A system for controlling the air-to-fuel ratio in an internal combustion engine includes an air intake conduit coupled to an intake manifold, an EGR valve disposed in-line with an EGR conduit responsive to a valve control signal, a lambda sensor producing a lambda signal indicative of the air-to-fuel ratio of the exhaust gas and a control circuit producing the valve control signal as a function of a desired mass air flow value, a desired air-to-fuel ratio, and the lambda signal. In an alternate embodiment, the system further includes a fueling system responsive to a fueling control signal. In this embodiment, the control circuit produces the fueling control signal as a function of a desired fuel control value, a desired air-to-fuel ratio, and the lambda signal. In another alternate embodiment, the control circuit produces the valve control signal as a function of a desired air-to-fuel ratio and the lambda signal.

A number of systems for controlling exhaust emissions produced by an internal combustion engine currently exist. It is desirable with such systems to control the actual air-to-fuel ratio (A/F) of the exhaust emissions by controlling the air and/or fuel supplied to the engine to reach a targeted A/F ratio. Reaching the targeted A/F ratio will provide a number of benefits including, but not limited to, achieving a desired oxides of nitrogen (NOx) production level.

System for controlling exhaust emissions produced by an internal combustion engine


In a cosmetic container an outer body portion surrounds a main body portion and is rotatable with respect thereto. Rotation of the main body moves a cosmetic holder up and down within the main body. An insert sleeve is fixedly secured to the outer body and surrounds the main body. The upper portion of the outer body is formed to provide an integral active portion positioned between the main body and the insert sleeve with gaps therebetween. The active portion of the outer body is provided with an inwardly projecting circular rib at an intermediate portion thereof which rotatably contacts the outer peripheral surface of the main body. The opposite end of the active portion of the main body elastically engages with the inner peripheral portion of the insert sleeve. Thus, the active portion of the outer body will act as a spring and can be deformed appropriately within the space between the main body and the insert sleeve.

1. Field of the Invention
The present invention relates to a cosmetic container for receiving a stick-like cosmetic such as a lipstick, which can smoothly extract and retract a stick-like cosmetic such as a lipstick accommodated therein.
2. Description of the Prior Art
As a main body of a conventional cosmetic container, a cylindrical body formed by pressing a flat plate, namely a so-called pressing pipe, has been used. However, a great number of steps are required for manufacturing the pressing pipe, and it is difficult to make the cylindrical body to have a cross-section of a complete circle. Therefore, in order to reduce the number of the manufacturing steps, to improve dimensional precision of the main body, and to smoothen extraction and retraction of the cosmetic relative to the container, it has become the recent practice that a straight pipe formed by drawing is used as the main body.
FIG. 31 shows an example of a prior art cosmetic container using a straight pipe as a main body.
As shown in FIG. 31, within a decorative casing 200 having an upper open end, a main body 201 composed of a straight pipe formed by drawing is arranged co-axially and relatively rotatably therewith. There is a space between the casing 200 and the main body 201. A cylindrical outer body 205 provided with a continuous spiral groove 207 on an inner peripheral surface thereof is arranged between the casing 200 and the main body 201. The outer body 205 is integrally fitted to the bore of the casing 200. An insert sleeve 203 is permanently fitted to the upper end portion of the outer body 205 to rotatably surround the main body 201. Within the main body 201, a cosmetic holder 209 for receiving and holding a cosmetic is received. Diametrical projections 211, 211 opposed to each other are provided at the lower end portion of the holder 209. These projections 211, 211 pass through elongated slots 213, 213 provided in the lower portion of the main body 201 to engage with the spiral groove 207. On the outer periphery of the center portion of the main body 201 is formed a projecting bead 215 which is engaged with an internal recess 206 of the outer body 205 to prevent removal or separation of the main body 201. Reference numeral 216 indicates a cap for detachably closing the upper open end of the casing 200.
In use, by rotating an integral assembly comprising the casing 200, the outer body 205 and the insert sleeve 203, the projections 211, 211 in engagement with the spiral groove 207 are guided along the slots 213, 213 of the main body 201 to move up and down, to achieve extraction and retraction of the cosmetic holder 209.
In such a conventional cosmetic container, the outer body 205 is in contact with the main body 201, and the insert sleeve 203 is in contact with the outer body 205 and the main body 201, respectively.
However, a straight pipe manufactured by drawing will inevitably have a certain degree of diametrical dimensional error. The extraction and retraction property of the cosmetic container is greatly governed by frictional resistance between the main body 201 and the outer body 205, especially at the abutment portion at which the bead 215 is engaged within the recess 206. The frictional resistance would, in turn, vary depending upon dimensional relationship between the main 201, the outer body 205 and the insert sleeve 203.
For example, when the diameter of the insert sleeve 203 is relatively small, an excessive degree of frictional resistance may exist between the main body 201 and the outer body 205, and the cosmetic holder 209 can not be moved smoothly.
When a diameter of the insert sleeve 203 is relatively large, the frictional resistance between the main body 201 and the outer body 205 in the abutment portion is decreased. In this case, the cosmetic holder 209 can be moved too easily, and a user would have difficulty in using the cosmetic. Further, airtightness of the container is degraded, and there is a possibility of deteriorating the cosmetic by an invasion of the open air.
In another prior art, a lubricant such as silicon grease is applied to the contacts between the respective constituents of the container in order to smoothen extraction and retraction of the cosmetic. However, use of silicon grease is not desirable, because the cosmetic tends to deteriorate under the influence of components of the silicon grease during the long-term use.
It is lately in fashion to use a cosmetic hard to melt away, a moist cosmetic, etc. However, cosmetic of such a type has a relatively large content of a volatile substance. Therefore, unless the container provides a good airtightness, the cosmetic would be deteriorated. Further, when the airtightness of the container is not excellent, after the cosmetic is accommodated, so-called "slip-out" (a phenomenon that the cosmetic is contracted and consequently slipped out of the cosmetic holder); "desertion" (a phenomenon that the cosmetic cannot effectively cope with movement of the cosmetic holder); and "breakage" (a phenomenon that the cosmetic is contracted and consequently becomes easy to break). In order to prevent such phenomena, airtightness of the container becomes a critical requirement.


An earpiece for a sound delivery system has a sound output port for delivering sound into the ear canal of the user. A cerumen block is provided to prevent cerumen or earwax from blocking the sound output port of the earpiece. The cerumen block is formed by a small flap of material which covers the sound output port and blocks cerumen from entering the sound output port in a closed position while allowing sound to pass around the flap and enter the ear canal in an open position. A resilient hinge returns the cerumen flap to the open position once the earpiece has been placed within the ear canal.

1. Field of the Invention
The present invention relates to a cerumen block for a sound delivery system such as a hearing aid, a communications device, or a multimedia device, and more particularly, the invention relates to an earpiece having a cerumen block for improved delivery of sound into the ear canal.
2. Brief Description of the Related Art
Sound delivery systems such as hearing aids, cellular telephones, and other sound transmitting systems employing earpieces are utilized to deliver sounds directly to the ear canal of the user. Such sound delivery systems include those worn by police, firefighters, secret service agents, and the like to receive sound transmissions from a remote location. Other sound delivery systems include the class of hearing aids which are used by the hearing impaired to amplify and process sounds. Traditional hearing aids include "in the ear" (ITE) hearing aid devices inserted into the ear of the user, "in the canal" (ITC), "completely in the canal" (CIC), and "behind the ear" (BTE) hearing aid devices which are attached behind the ear of the user. The BTE hearing aid devices generally include a flexible plastic tube connecting an amplification and processing device mounted behind the ear to an eartip positioned within the ear canal.
Many different types of eartips are available for fixing an end of a sound transmitting tube in the ear canal. Eartips may be custom made to fit within the ear canal of a particular user, however, these custom made eartips are expensive and can block the ear canal almost entirely causing a problem known as the occlusion effect. Other types of eartips include stock members which are generally used during a trial period when a hearing aid is being tested or while an ear mold is being made. These stock eartips may be formed of hard materials, rubbery materials, or foam. However, any eartip which is placed within the ear canal will have problems of blockage of the eartip sound output ports by cerumen (earwax).
Cerumen blockage of the sound output ports of an earpiece causes sound degradation and eventual failure of the sound delivery system to deliver sound to the ear canal. This degradation and eventual failure due to cerumen blockage is the most common cause of failure in sound delivery systems such as hearing aids. There are many different approaches commercially available for preventing the cerumen blockage of hearing aid sound output ports. One such blockage preventing method includes a sound transparent membrane which allows sound to pass through while blocking cerumen. Because of the thinness required of the sound transparent membrane to prevent sound attenuation, the membrane tends to be delicate and to tear or puncture easily.
Another type of cerumen blockage prevention system includes a mechanical assembly which can be periodically actuated to eject collected cerumen from the sound output ports to clear the output ports. One such mechanical actuated assembly includes a spring loaded cylindrical output port which slides over a pin to eject cerumen. The mechanical actuated assemblies for ejection of cerumen are complex and require periodic actuation to remove cerumen buildup. Another type of blockage protector is a replaceable "band aid" type protector which requires periodic replacement. The "band aid" cerumen protector includes a porous piece of material such as foam having pressure sensitive adhesive which is used to secure the foam over a sound output port. These "band aids" fill up with cerumen, blocking the sound but are easily peeled off and replaced. Thus, these devices must be maintained and there is an associated expense of periodic replacement. Finally, acoustic labyrinths have been used in the sound output ports of earpieces to reduce cerumen blockage. These acoustic labyrinths slow the occurrence of cerumen blockage but will still become clogged over time.
Accordingly, it would be desirable to address the problem of cerumen blockage of sound delivery output ports by a simple, reliable, and effective cerumen blockage device.


An improved system and method for classifying tags of content using a hyperlinked corpus of classified web pages is provided. An anchor text index may be searched to find anchor texts that may match text of the tag, documents referenced by the matching anchor texts may be found, and the documents referenced by the matching anchor texts may be grouped to disambiguate multiple classifications that result from matching the anchor texts with the categories of the reference documents. To resolve ambiguity between multiple classifications, weighted classifications may be used where each document may be assigned a positive weight for a mapping to a category to indicate the confidence of the classification of the document to the category. The classification for the grouping of the documents referenced by the matching anchor texts with greatest frequency may be selected and output as the classification for the tag.

The collaborative efforts of users participating in social media services such as Wikipedia, Flickr, and Delicious have led to an explosion in user-generated content. The content can occur in various forms, such as text, photos, video, audio, or multimedia content. A popular way of organizing the content is through tagging. In fact, a considerable amount of such content is labeled by user-defined tags. The tags provided by the user provide useful descriptors of the content, especially in the case of multimedia. Although informal tagging conventions have emerged, tagging does not restrict the user in any way when defining labels for describing content. The extensive freedom users enjoy allows for accurate descriptions and organization of content. The flexibility of such a tagging mechanism allows users to index and navigate the large amount of content that is being generated.
As a consequence, user-defined tags of content have likewise resulted in explosive growth. This imposes the problem of semantically categorizing and exploring a potentially infinite tag space. Any such endeavor is complicated by the practice of unrestricted labeling of content by users that has resulted in the emergence of an uncontrolled vocabulary that by far exceeds the semantics of a hierarchical ontology or taxonomy such as WordNet. The lack of a pre-defined schema makes the task of semantically exploring this immense and sparse tag space even more difficult.
Current solutions to word sense disambiguation involve using the context that terms occur in. In tag corpora, there is often minimal context making these methods inappropriate. See, for example, N. Ide and J. Vacronis, Word Sense Disambiguation: The State of the Art, Computational Linguistics, 24(1). Moreover, such an approach to mapping the user-defined tags upon an existing taxonomy does not scale to the vast vocabularies that exist within web-based services such as Flickr and Delicious.
What is needed is a way to classify user-defined tags of content for semantically exploring the corpora of user-defined tags. Such a system and method should be able to flexibly use a classification schema that may scale to the vast vocabularies that exist within web-based services.

System and method for classifying tags of content using a hyperlinked corpus of classified web pages


A system and method of producing a paper product from a wetstock solution using a sensor for sensing resistive impedance changes of the wetstock on the support web of the system. The resistive impedance changes are used to measure physical characteristics such as water weight of the wetstock on the support web of a sheetmaking system. The system includes a fixed impedance element coupled in series with a sensor portion between an input signal and ground. The sensor portion is an electrode configuration which includes at least two electrodes with a portion of the wetstock residing between and in close proximity to the electrodes. The sensor exhibits a variable impedance resulting from changes in the physical characteristics of the wetstock. The fixed impedance element and the variable impedance of the sensor portion form a voltage divider network such that changes in impedance of the sensor portion results in changes in voltage which are measured, converted to impedance changes of the wetstock, and which are then related to water weight of the wetstock.

1. Field of the Invention
The present invention generally relates to systems for controlling continuous sheetmaking systems and, more specifically, to sensors and methods for measuring the fiber weight of wetstock in a paper making machine.
2. State of the Art
In the art of modern high-speed papermaking, it is well known to continuously measure certain properties of the paper material in order to monitor the quality of the finished product. These on-line measurements often include basis weight, moisture content, and sheet caliper (i.e., thickness). The measurements can be used for controlling process variables with the goal of maintaining output quality and minimizing the quantity of product that must be rejected due to upsets in the manufacturing process.
The on-line sheet property measurements are often accomplished by scanning sensors that periodically traverse the sheet material from edge to edge. For example, a high-speed scanning sensor may complete a scan in a period as short as twenty seconds, with measurements being read from the sensor at about 50 milliseconds intervals. It is also know that a series of stationary sensors can be used to make similar on-line measurements.
In the manufacture of paper on continuous papermaking machines, a web of paper is formed from an aqueous suspension of fibers (stock) on a traveling mesh papermaking fabric and water drains by gravity and suction through the fabric. The web is then transferred to the pressing section where more water is removed by pressure and vacuum. The web next enters the dryer section where steam heated dryers and hot air completes the drying process. The paper machine is, in essence, a water removal, system. A typical forming section of a papermaking machine includes an endless traveling papermaking fabric or wire which travels over a series of water removal elements such as table rolls, foils, vacuum foils, and suction boxes. The stock is carried on the top surface of the papermaking fabric and is de-watered as the stock travels over the successive de-watering elements to form a sheet of paper. Finally, the wet sheet is transferred to the press section of the papermaking machine where enough water is removed to form a sheet of paper.
Papermaking devices well known in the art are described for example in U.S. Pat. No. 5,400,258. Many factors influence the rate at which water is removed which ultimately affects the quality of the paper produced. As is apparent, it would be advantageous to monitor the dynamic process so as to, among other things, predict and control the dry stock weight of the paper that is produced.
It is conventional to measure the moisture content of sheet material upon its leaving the main dryer section or at the take up reel employing scanning sensors. Such measurement may be used to adjust the machine operation toward achieving desired parameters. One technique for measuring moisture content is to utilize the absorption spectrum of water in the infra-red. Monitoring or gauge apparatus for this purpose is commonly in use. Such apparatus conventionally uses either a fixed gauge or a gauge mounted on a scanning head which is repetitively scanned transversely across the web at the exit from the dryer section and/or upon entry to the take up reel, as required by the individual machines. The gauges typically use a broad-band infra-red source and one or more detectors with the wavelength of interest being selected by a narrow-band filter, for example, an interference type filter. The gauges used fall into two main types: the transmissive type in which the source and detector are on opposite sides of the web and, in a scanning gauge, are scanned in synchronism across it, and the scatter type (sometimes called "reflective" type) in which the source and detector are in a single head on one side of the web, the detector responding to the amount of source radiation scattered from the web.

Electromagnetic field perturbation sensor and methods for measuring water content in sheetmaking systems


Polycarbonate prepolymer is crystallized using a water and solvent mixture, or by application of a shear force while heating, or by orientation of the prepolymer with a shear force followed by a temperature hold. High molecular weight polycarbonate is obtained by the solid state reaction of the crystallized prepolymer.

1. Field of the Invention
The present invention relates to polymers and to methods of making polymers. In another aspect, the present invention relates to polycarbonate prepolymer, to methods of making such prepolymer, to polycarbonate polymer, and to methods of making such polycarbonate polymer. In even another aspect, the present invention relates to a crystallized polycarbonate prepolymer, to methods of crystallizing polycarbonate prepolymer utilizing a diluent and solvent mixture, utilizing heat with shear generation, or utilizing seeding, to a method making polycarbonate by solid state polymerization, and to polycarbonate made therefrom.
2. Description of the Related Art
Over the last few years, aromatic polycarbonates have found utility in various applications requiring engineering plastics with outstanding heat resistance, impact resistance, and transparency. Due to the popularity of aromatic polycarbonates, much prior art exists with respect to production processes for such aromatic polycarbonates.
The phosgene method
A well known commercially utilized production process is the so-called "phosgene method" involving an interfacial polycondensation process between an aromatic dihydroxy compound such as 2,2-bis(4-hydroxyphenyl) propane (henceforth referred to as bis-phenol A) and phosgene. In the phosgene method, a solvent mixture consisting of water or an aqueous alkali solution and an organic solvent which is not miscible with water is normally used. Commercially, a mixed solvent of aqueous sodium hydroxide and methylene chloride is used. A tertiary amine or a quaternary ammonium compound is used as a polymerization catalyst. The hydrogen chloride formed as a side product is removed in the form of a salt with a base. The weight average molecular weight of the aromatic polycarbonate formed is generally 15,000-70,000 and normally is 16000-40,000.
Unfortunately, the interfacial polycondensation "phosgene process" suffers from many disadvantages as are well known in the literature, examples of which are listed in U.S. Pat. No. 5,204,377.
Transesterification (or-melt) process
Various prior art "transesterification" (also known as "melt") processes are known in which an aromatic polycarbonate is formed from an aromatic dihydroxy compound and diaryl carbonate. As commercially practiced, a polycarbonate is obtained by an ester exchange reaction between bis-phenol A and diphenyl carbonate conducted in a molten state in the presence of a catalyst to release the phenol to produce a polycarbonate. However, in this method, the degree of polymerization of the desired aromatic polycarbonate can not be increased unless phenol and finally diphenyl carbonate are removed by distillation from a highly viscous (8,000-20,000 poise at 280.degree. C.) molten material of the polycarbonate formed.
Unfortunately, the transesterification process also suffers from many disadvantages as are well known in the literature, examples of which are listed in U.S. Pat. No. 5,204,377.
Solid-slate condensation polymerization
Solid-state condensation polymerization has developed as an alternative to the phosgene process and the transesterification process for making polycarbonate.
In solid-state condensation polymerization, a high molecular weight polycarbonate is produced by first preparing a relatively low molecular weight crystallized polycarbonate prepolymer followed by subsequent solid-state polymerization of the crystallized prepolymer.
In general, a solid phase polymerization process is made possible by an ability of a polymer to sustain a solid phase state at temperatures above the glass transition temperature without causing the polymer to fuse (when the temperature for the polymerization is below the glass transition temperature, the polymerization does not take place since the molecular movement is inhibited).
As disclosed in International Patent Application No. PCT/JP88/989, solid-state condensation polymerization could be effectively performed to increase the molecular weight of formed polycarbonate in the production of aromatic polycarbonate from, as starting materials, dihydroxydiaryl alkane, such as bisphenol A, and a diaryl carbonate, such as diphenyl carbonate. As disclosed in PCT/JP88/989, a high quality aromatic polycarbonate in which a substantially amorphous prepolymer having hydroxyl and aryl carbonate groups as terminal groups is crystallized and then subjected to solid-state condensation polymerization.
U.S. Pat. No. 5,266,659, issued Nov. 30, 1993, discloses a solid state process for the preparation of high molecular weight poly(arylcarbonates) from amorphous oligomer. Specifically, the process involves heating in a controlled manner, a BPA-carbonate oligomer in the presence of a catalyst selected from alkali metal aryl acid, alkali metal borohydrial and a quarternary ammonium salt of bioxyanion derived from a carboxylic acid poly(arylcarbonate)s of high molecular weight.
As disclosed in PCT/JP88/989, crystallization is preferably accomplished by either a solvent treatment method or heat crystallization method.
In the solvent treatment method, the prepolymer is crystallized by using a suitable solvent. Examples of suitable solvents include, an aliphatic halogenated hydrocarbon such as chloromethane, methylene chloride, chloroform, carbon tetrachloride, chloroethane, dichloroethane (various isomers), trichloroethane (various isomers), trichloroethylene, and tetrachloroethane (various isomers); an aromatic halogenated hydrocarbon such as chlorobenzene and dichlorobenzene; an ether such as tetrahydrofuran and dioxane; an ester such as methyl acetate and ethyl acetate; a ketone such as acetone, and methyl ethyl ketone; and an aromatic hydrocarbon such as benzene, toluene, and xylene.
Unfortunately the solvent method creates flammability hazzards, results in oligomers, thus requiring an oligomer removal step for acetone recycle. The formed particles can be shattered to a very small size, which can be unacceptable for further polymerization because a typical molecular advancement step utilizes flow of hot nitrogen through a bed of crystallized prepolymer particles. Particles that are too small can then be carried away with nitrogen at moderate nitrogen flow and pressure drop can be excessive due to tight packing of the small particles.
In the heat crystallization method, the prepolymer is heated at a temperature above the glass transition temperature but below the temperature at which the prepolymer begins to melt to crystallize the prepolymer. Crystallization is accomplished simply by maintaining the prepolymer at a specified temperature. As heat crystallization is believed to take too long, there exists a need to reduce the crystallization time.
U.S. Pat. No. 5,204,377, issued Apr. 20, 1993, is directed to a solid-state condensation polymerization process for making polycarbonate. Crystallization is accomplished by a solvent technique in which amorphous prepolymer is treated with solvent under a high shearing force sufficient to reduce the prepolymer to particles having an average particle diameter of 250 microns or less, and a specific surface area of at least 0.2 m.sup.2 /g and a crystallinity of at least 5%, to thereby crystallize and simultaneously render porous the amorphous prepolymer.
JP 5310907, published Nov. 22, 1993, discloses a method of reducing residual organic solvent content by irradiating solvent-containing polycarbonate and/or polycarbonate oligomer with from 300-30,000 MHZ microwave energy.
However, in spite of these advancements in the prior art, none of these prior art references disclose or suggest the application of a water/solvent mixture, or the application of heat crystallization under shear conditions/ to crystallize polycarbonate prepolymer.
Thus, these is still a need for an improved method of making polycarbonate prepolymer.
There is another need in the art for an improved method of making crystallized aromatic polycarbonate.
These and other needs in the art will become apparent to those of skill in the art upon review of this specification, including its drawings and claims.

Method of making polycarbonate prepolymer and method of making high molecular weight polycarbonate


A non-aqueous electrolyte secondary battery has an electrode and an electrolyte layer. The electrode includes a collector having a lot of fine pores on its surface, and a membrane layer made of an electrode active material provided along the surface shape of the fine pores of the collector. By this structure, the battery can manifest an excellent performance even in charging and discharging at high speed without using a binder and conductive material.

1. Field of the Invention
The present invention relates to a non-aqueous electrolyte secondary battery, more specifically, to a constitution of a positive electrode material in a non-aqueous electrolyte secondary battery.
2. Description of the Related Art
Recently, with a view to the worldwide issue of air pollution due to automotive exhaust gas, electric vehicles using electricity as a power source, hybrid vehicles driven by a combination of an engine and a motor, and fuel cell vehicles using a fuel cell as a power source, and the like are attracting attention. Developments of batteries of high energy density and high output density mounted on those vehicles are taking important positions industrially. Further, also regarding vehicles using only an engine as a power source, vehicles carrying a high voltage battery, which enable mounting of various electrically powered equipments, are put into practical use.
Due to its high energy density and discharge voltage, a lithium secondary battery is believed to be a battery suitable for such vehicles, and various developments thereof are progressed.
A lithium secondary battery is comprised of a positive electrode and a negative electrode capable of storing and releasing a lithium ion, and a non-aqueous electrolyte layer. The electrode contains an electrode active material, conductive material, electrolyte, electrolyte salt, binder and the like. The non-aqueous electrolyte layer is composed essentially of an electrolyte salt and a non-aqueous solvent.
When charging and discharging is conducted at high current rate in such a battery, a lithium ion present on an electrolyte inside of an electrode is absorbed rapidly in an electrode active material. By this, the lithium ion concentration in the electrode decreases, lithium ions are diffused and supplied from a non-aqueous electrolyte layer. Lithium ions enter into and exit from a non-aqueous electrolyte layer, and simultaneously electrons from a collector move through a conductive material to cause progress of an electrode reaction, thus performing charging and discharging.
Such an electrode for the lithium secondary battery is produced by mixing an electrode active material, conductive material and binder in a solvent to give a slurry, then, coating the slurry on a collector and drying this (see, Japanese Patent Application Laid-Open No. H7-220722).
An electrode produced by the method of Japanese Patent Application Laid-open No. H7-220722 has a constitution in which an electrode active material and the like are supported by a binder and electrical contact between electrode active materials is maintained by a conductive material.

Non-aqueous electrolyte secondary battery having electrode active material membrane layer


The present invention relates to the use of 1,25-dihydroxyvitamin D values in ratio with PTH as a prognostic biomarker. More particularly, the present invention relates to a method for predicting or stratifying the risk of worsening renal function (WRF) in a patient at risk of renal injury or affected by renal injury. Levels of 1,25-dihydroxyvitamin D (1,25(OH)2D) are measured in a biological sample and taken together with parathyroid hormone (PTH) levels to provide a ratio indicative of the risk of worsening renal function.

Progressive deterioration of renal function is common in patients with different diseases such as chronic heart failure (HF), chronic kidney disease (CKD) and metabolic syndrome, and is associated with unfavorable outcomes, which can be improved by timely interventions.
The cross talk between the diseased heart and kidney is a growing burden for health care systems as the incidence of HF and chronic kidney disease (CKD) has been steadily increasing and will further increase due to ageing of the general population and better treatment of acute cardiac and renal diseases. It has also been realized that the progressive development of worsening renal function (WRF) over time carries an increased risk of death and hospitalizations.
Identifying patients at risk of worsening renal function (WRF) is important for their clinical management, and might lead to less frequent hospitalizations and to the prevention of adverse outcomes. Early prediction and identification of patients at risk for future WRF may also be useful to optimize therapies and to improve outcomes. Circulating biomarkers may therefore provide a simple and objective means to predict deterioration in renal function in patients with chronic HF or other diseases such as chronic kidney disease (CKD) or IgA nephropathy. For instance, a common marker of renal injury is serum creatinine, which however is slowly affected by changes in renal function and is also dependent on a plurality of different factors such as muscle mass, sex, race and age.
Disturbances of mineral metabolism, and in particular to the parathyroid hormone (PTH)/vitamin D axis, are characteristic of decreased renal function (Evenepoel, P. et al. (2014) "Laboratory Abnormalities in CKD-MBD: Markers, Predictors, or Mediators of Disease?" Semin. Nephrol. 34(2):151-163). Recent studies indicate that vitamin D-deficiency may promote or accelerate the progression of CKD. Cross-sectional studies have shown higher circulating levels of PTH and lower levels of vitamin D metabolites as CKD progresses (lower estimated glomerular filtration rate, eGFR). To the inventors' knowledge, there are, however, scant reports on the ability of circulating markers of bone mineral metabolism to predict deterioration of renal function over time.
Therefore, the inventors examined the relation between two markers of the vitamin D/PTH axis and worsening of renal function (WRF) in a large cohort of patients with HF.
Lack of reliable automated testing of 1,25-dihydroxyvitamin D (1,25(OH)2D), the biologically active metabolite of vitamin D, has in the past precluded evaluation of the prognostic value of this measurement.
Therefore, there is a need to identify biomarkers for predicting or stratifying the risk of worsening renal function (WRF) in a patient at risk of renal injury or in a patient affected by renal injury.

This patent is subject to a terminal disclaimer.

Use of 1,25-dihydroxyvitamin D values in ratio with PTH as a prognostic biomarker


A method for producing a separator plate, where thermoplastic polymer material and a powder of electro-conductive filler, ECF is kneaded at a kneading temperature above a glass transition temperature for the thermoplastic polymer material but below a melting temperature for the thermoplastic polymer material in order to provide a malleable but not molten compound and for causing fibrillization in the thermoplastic polymer material prior to hot-compacting the sheet in a press-form to form a separator plate. A production facility for practicing the method is also disclosed.

Bipolar plates (BPPs), for example produced by combining two monopolar plates (MPP), are key components of some type of fuel cells, as they play a role of separators for single membrane-electrode assemblies. Also, they play a role in electrically connections for providing the required voltage of the stack.
As high temperature and strong acidic media limit utilization of metallic BPPs due to their tendency to corrode, carbon materials, especially graphite, are attractive as alternatives to metal.
U.S. Pat. No. 6,544,680 discloses moulded separator plates with carbon and PPS but with the addition of a thermosetting resin. U.S. Pat. No. 6,803,139 discloses moulded separator plates with carbon and a thermoplastic, for example polyphenylene sulfide (PPS), but with the addition of carbodiimide. EP1758185 discloses moulded separator plates with 84% carbon, 2% PTFE, 14% epoxy that is cured in the hot press. Polyphenylene sulfide (PPS) or Polytetrafluoroethylene (PTFE), also called Teflon, are mentioned as thermoplastic resins but not exemplified.
The US Department of Energy (DOE) has set a 2020 target for polymer electrolyte membrane fuel cell components, which is described on the Internet site https://www.energy.gov/eere/fuelcells/doe-technical-targets-polymer-electrolyte-membrane-fuel-cell-components. The 2020 target requires a specific resistance of less than 0.01 Ω·cm2 and a flexural strength more than 25 MPa. In order to reach this target of low resistance, the amount of graphite in the BPP composition should be rather high, especially more than 70 wt. %, and its particles should be uniformly distributed in the polymer binder. This can be achieved, for example, via grinding raw materials to micron or sub-micron dimensions with further intensive mixing the grinded powders.
A grinding process is disclosed in WO2018/072803 by SerEnergy, also disclosing use of PTFE for bonding powder of graphite and PPS into BPPs. In this disclosure, isopropanol plays important role as surfactant in the production process. However, in practice, it has turned out that iso-propyl alcohol is likely to provoke agglomeration of PTFE particles in the aqueous dispersion during mixing, which may be desired in some cases but which requires a relatively long time of stirring, which is undesirable from a commercial perspective, as it prolongs the production process. Using iso-propanol has another disadvantage in that work with iso-propanol requires strict safety rules and permanent control, especially at elevated temperatures, due to its high flammability as its flash point is only 12° C.
It would therefore be desirable to provide a method for production of separator plates, in which the use of iso-propanol can be avoided, while keeping the advantage of moulding of a pliable particular material.
In order for making fuel cells competitive to other energy sources for especially vehicles, the cost according to the DOE 2020 target should be below than 3 USD/kW. For reducing costs in the production of separator plates for fuel cells, scaling-up and accelerating of the manufacturing processes is vital.
U.S. Pat. No. 7,758,783 discloses a continuous process for producing separator plates. Carbon is dropped onto a conveyor, polymer sprayed on top of it, and the mix pressed into plates through a calendering process.
US2005/0042496 discloses a continuous process in which polymer is blended with a filler, for example graphite, kneaded and extruded before transferred into a form, in which it is compacted, for example into a separator plate.
US2018/358630A1 discloses compression moulding of a bipolar plate for a fuel cell, in which a conductive composition is used with carbon powder and the polymer resin, for example polyphenylene PPS and/or PTFE. EP1394878A1 discloses a fuel cell separator moulded from a blend of polymer resin and carbon and a filler. WO2019/039214A1 discloses a fuel cell separator that is obtained by impregnating a porous sheet. WO2018/179633A1 discloses a hydraulic moulding press system. US2013/216744A1 discloses a press moulding system for plastic bonded fiber layers.
In particular for proton exchange membrane (PEM) fuel cells, there are two main cost contributors, namely platinum-containing electrodes and the bipolar plates (BPPs). It would be desirable to reduce the costs for production in order to be within the targets as set in the USA DOE's 2020 program.

Method of producing separator plates by compaction and a production facility


The hybrid adder of the present invention uses stages of carry select functions to provide serial carries and a carry look-ahead tree structure to compute the final carries in parallel. The longer the carry select stages become, the slower and smaller the hybrid adder gets by reducing the size of the carry tree. By making the carry select stages shorter, the faster and larger the adder gets by increasing the size of the carry tree. The increased flexibility of the resulting hybrid adder gives the circuit designer a greater range of possible designs to achieve optimum size and speed performance. A preferred process for selecting optimum stage lengths is also described. The method for designing the hybrid adder is preferably carried out using a logic synthesis software program.

Complex integrated circuits (ICs) are typically designed using a CAD system. The CAD system allows the user to design a circuit using pre-designed circuit building blocks from a library. One basic structure frequently designed using logic synthesis tools is an adder for adding binary numbers of any bit width. Common adder designs which would be incorporated into the library are ripple adders, carry-select adders, and carry look-ahead adders. Subsets of adders include comparators (only determines carry) and counters (increments by 1).
Equation 1 below is the well known equation for generating a sum bit Si for two binary numbers X.sub.i and Y.sub.i, for the bit position i, where C.sub.i-1 is the carry bit from the next lower significant bit position. EQU S.sub.i =(X.sub.i Y.sub.i) C.sub.i-1 Eq. 1
In this disclosure, the symbol " " is a logical exclusive OR (XOR), the symbol "*" is a logical AND, and the symbol "+" is a logical OR.
The equations presented herein are also shown or described in the book Computer Architecture: A Quantitative Approach, Appendix A, by David A. Patterson and John L. Hennessy, ISBN 1-55860-069-8, incorporated herein by reference.
Ripple adders are so named because the carry bit for a pair of binary numbers must be calculated before the sum of the next higher significant bits can be calculated. This delay in generating each carry bit ripples along the ripple adder so that the total delay is proportional to the width of the binary numbers to be added.
Ripple adders are slow, but simple, and take up relatively little silicon surface area.
A more complex adder structure which uses a greater amount of silicon surface area than the ripple adder for the same adder bit width is shown in FIG. 1 and is generally called a carry select adder is approximately proportional to the square root of the bit width, assuming uniform input signal arrival times and optimal stage lengths.
FIG. 1 shows a 5-bit carry select adder having two stages 3 and 4, stage 3 being comprised of two adders 6 and 7, and stage 4 being comprised of three adders 8, 9, and 10. The outputs of the last adder in a stage (adders 7 and 10) are applied to a multiplexer 12 or 14.
Both stages 3 and 4 of FIG. 1 begin computing in parallel, with the adders in each stage computing in series. The final sum bits (S0-S4) and carry bit (C.sub.out) are not valid until the carry input (C.sub.in0 and C.sub.in1) saves for each stage. Two possible sum bits for each adder 6-10 and two possible carry bits for each adder 6-10 are calculated before the carry input bit arrives for the stage. The carry input (C.sub.in0) for stage 3 can be set to zero if there is no carry into stage 3. Stage 4 cannot provide its final sum bits and carry output (C.sub.out) bit until stage 3 has output its carry bit (C.sub.in1) by the appropriate control of multiplexer 12. Hence, the delay by stage 3 in calculating the carry bit C.sub.in1 is added to the accumulated delays by the multiplexers when calculating the final carry bit C.sub.out. Such delay, however, is much less than the conventional ripple adder.
The various outputs of each adder 6-10 and multiplexers 12 and 14 are calculated as expressed in the well-known equations below.
The sum for bit i in stage k can be computed from: EQU s1.sub.k,i =(X.sub.k,i Y.sub.k,i) cl.sub.k,i-1 Eq. 2
(final sum bit in stage k, bit i, for carry in=1) EQU s0.sub.k,i =(X.sub.k,i Y.sub.k,i) c0.sub.k,i-1 Eq. 3 PA1 (final sum bit in stage k, bit i, for carry in=0) PA1 (carry bit for stage k, bit i, for carry in=1) EQU C0.sub.k,i =(X.sub.k,i *Y.sub.k,i)+c0.sub.k,i-1 *(X.sub.k,i +Y.sub.k,i)Eq. 5 PA1 (carry bit for stage k, bit i, for carry in=0) PA1 (sum in stage k, bit i, as selected by the carry in for that stage)
The carry bit output (c0, c1) from each adder 6-10 can be computed from: EQU c1.sub.k,i =(X.sub.k,i * Y.sub.k,i)+c1.sub.k,i-1 *(X.sub.k,i +Y.sub.k,i)Eq. 4
The carry bits applied to the first adder 6 and 8 in each stage are fixed as: EQU c1.sub.k,-1 =1(input bit c1) Eq. 6 EQU c0.sub.k,-1 =0(input bit c0) Eq. 7
The final sum output (S0-S4) selected for each adder 6-10 based on the carry-in bit (C.sub.in) for that stage is follows: EQU S.sub.k,i =s1.sub.k,i if C.sub.in =1 Eq. 8 EQU s0.sub.k,i if C.sub.in =0
The output carry bit from a stage k is as follows: EQU C.sub.k =cl.sub.k,n-1 if C.sub.in =1 Eq. 9 EQU C0.sub.k,n-1 if C.sub.in =0
(carry out from stage k with n bits, as selected by the carry in (e.g., C.sub.in0 or C.sub.in1) for that stage)
The equations above are presented in a summary fashion and would be readily understood, and already known, to those skilled in the art. Additional detail is presented in the book Computer Architecture: A Quantitative Approach, previously mentioned.
In a carry look-ahead adder (CLA), the carry signals for each bit are computed in parallel in a tree structure. One type of CLA is shown in FIG. 2. The tree structure can be made to have more logic per stage (bigger), but fewer stages (faster), resulting in a bigger, faster adder, or less logic per stage (smaller), but more stages (slower) for a smaller, slower adder. A CLA should be designed to compute the carries (C.sub.i) for each bit position as fast as possible given the amount of silicon surface area allocated. Usually, a tree is built with log.sub.2 (n) stages, where n is the bit width of the numbers to be added. If n is not a power of 2, then the number of stages is log.sub.2 of the next higher power of 2. At each stage (k), the CLA tree computes a generate signal (G) and a propagate signal (P) for bit i, where: EQU G.sub.k+1,i =G.sub.k,i +(P.sub.k,i *G.sub.k,i-2.sup.k) Eq. 10 EQU P.sub.k+1,i =P.sub.k,i *P.sub.k,i-2.sup.k Eq. 11
Each block 22 making up the tree performs the following logical operations on its inputs to generate G.sub.out and P.sub.out : EQU G.sub.out =G.sub.in +(P.sub.in * G0.sub.in) Eq. 12 EQU P.sub.out =P.sub.in *P0.sub.in Eq. 13
The G signals indicate that there will definitely be a carry bit at bit i; the P signals indicate that there will be a carry at bit i only if there is a carry at bit position i-2.sup.k. For the first stage (k=0) we set: EQU G.sub.0,i=X.sub.i *Y.sub.i Eq. 14 EQU P.sub.o,i =X.sub.i +Y.sub.i Eq. 15
The designer just needs to build enough stages (k) to ensure that the CLA structure computes all of the carries. In general, only log.sub.2 (n) stages (assuming n is a power of 2) are needed so delay is related logarithmically to the bit width of the adder. The value of G.sub.i in the last stage for bit i is a carry value needed to compute a sum using the equation 1 above.
The CLA of FIG. 2 shows the carry circuitry for a four-bit carry look-ahead adder. The four blocks 20 at the bottom of FIG. 2 generate G.sub.i and P.sub.i based on equations 14 and 15 above. The remaining blocks 22 are identical to one another and perform equations 10-13. The two stages of carry tree generate the four final carry bits C.sub.0 -C.sub.3 which are used to compute the final sum bits in accordance with equation 1. The adder portion which uses X.sub.i, Y.sub.i, and C.sub.i-1 in equation 1 to generate a sum S.sub.i may optionally be incorporated in blocks 20. This CLA tree structure is easily extended to any number of bits. The speed advantages of the CLA are, of course, increased as the bit width becomes greater, while the size disadvantages of the CLA worsen as the bit width becomes greater.
The book Computer Architecture: A Quantitative Approach, previously mentioned, provides equivalent equations for a CLA adder using a different format and an equivalent CLA tree structure using an arrangement different from that shown in FIG. 2 but performing identical logic functions. FIGS. 3A, 3B, and 3C illustrate the CLA tree adder described in the above-mentioned book. The structures of FIGS. 3A-3C are presented to illustrate how a CLA structure can be implemented in a variety of ways yet still carry out the same logical functions performed by the CLA tree described with respect to equations 10-15.
FIG. 3A shows a first part of a CLA tree for an 8-bit adder, where the bits of the two numbers to be added (numbers a and b) are inputted into the top of the CLA tree into logic blocks 1. The logic functions performed by the logic blocks 1 are shown at the bottom of FIG. 3A. The outputs of the blocks 1 are input into the four input terminals of the blocks 2, performing the logic functions depicted at the bottom of FIG. 3A. The diagram of FIG. 3A would be readily understood by those skilled in the art. The diagram of FIG. 3A illustrates the generation of the various G and P values, where the G signals indicate that there will definitely be a carry bit at a particular bit position, and the P signals indicate that there will be a carry at a particular bit position only if there is a carry bit at another bit position.
FIG.3B illustrates other functions performed by the resulting CLA tree to generate carry bits, where a carry-in bit c.sub.0 is applied to the input of the CLA tree. The logic function performed by the various blocks shown in FIG. 3B is illustrated at the bottom of FIG. 3B.
FIG. 3C shows the combination of the structures shown in FIGS. 3A and 3B to form a complete CLA tree. The functions performed by each of the logic blocks A and B in FIG. 3C are illustrated at the bottom of FIG. 3C using conventional logic symbols understood by those of ordinary skill in the art.
Other CLA and carry select adder structures are described in U.S. Pat. Nos. 3,700,875; 4,764,888; 5,047,976; 5,396,445; 4,464,729; 5,122,982; 5,276,635; 5,278,783; 4,525,797; 5,283,755; and 5,027,312, all incorporated herein by reference.
Speed Versus Area Considerations
When a user of a logic synthesis tool is designing an adder in a larger circuit, the parameters which dictate the optimum adder design for the particular application include bit width, maximum tolerable delay, area constraints, input arrival time skews and other well-known considerations. If, during a timing analysis of a circuit design, it is found that the adder is too slow or too large, the adder must be changed to a different design, such as by converting a ripple adder to a carry select adder, or a carry select adder to a CLA, or vice versa. The possible choices of adders is relatively limited, and therefore the user of the logic synthesis tool is only given a choice of adder designs which do not precisely meet the user's speed vs. are requirements.
What is needed is a more flexible adder synthesis software program for developing a new adder structure which has a speed us area lying somewhere between a conventional carry select adder and a carry look-ahead adder of the same bit width.

Adder which employs both carry look-ahead and carry select techniques


The disclosed embodiments provide a system that uses broadcast-based TLB sharing to reduce address-translation latency in a shared-memory multiprocessor system with two or more nodes that are connected by an optical interconnect. During operation, a first node receives a memory operation that includes a virtual address. Upon determining that one or more TLB levels of the first node will miss for the virtual address, the first node uses the optical interconnect to broadcast a TLB request to one or more additional nodes of the shared-memory multiprocessor in parallel with scheduling a speculative page-table walk for the virtual address. If the first node receives a TLB entry from another node of the shared-memory multiprocessor via the optical interconnect in response to the TLB request, the first node cancels the speculative page-table walk. Otherwise, if no response is received, the first node instead waits for the completion of the page-table walk.

1. Field of the Invention
This disclosure generally relates to techniques for reducing latency in shared-memory multiprocessor computer systems. More specifically, this disclosure relates to techniques for reducing address-translation latency in shared-memory multiprocessor systems.
2. Related Art
Computer memory is typically divided into a set of fixed-length blocks called "pages." An operating system can provide a virtual memory abstraction to give a program the impression that it is accessing a contiguous address space that is larger than the actual available physical memory of the underlying computer system. During operation, the operating system and hardware of the computing device translate virtual addresses into physical addresses in the physical memory. These translated physical addresses are then used to access the desired data from the memory hierarchy.
The latency caused by such address translation can significantly impact the performance of shared-memory server systems. Accessing a virtual address typically involves using specialized translation hardware to determine a corresponding physical memory address. This translation hardware often includes a translation lookaside buffer (TLB) which caches page-table translation information to improve the speed of virtual address translations. Modern processors use multiple levels of such TLBs to avoid the latency of page-table lookups. However, growing data-set sizes and an increase in the number of hardware threads that share a TLB are increasing TLB pressure, thereby resulting in increased TLB miss rates. In modern multiprocessor systems, a miss in a multi-level TLB initiates a page-table walk, which typically involves several DRAM accesses that can take hundreds of clock cycles to complete. In the worst case, a memory instruction first misses in the TLB (e.g., during translation) and then also misses in the cache hierarchy, resulting in an even larger delay.
Hence, what is needed are system structures and techniques for managing virtual address translations without the above-described problems of existing techniques.

Using broadcast-based TLB sharing to reduce address-translation latency in a shared-memory system with optical interconnect


A method for detecting a specific pattern contained in an image. The pattern-detection method has steps of binarizing the input image data to obtain binary image data, recognizing a partial image that is contained in the binary image data, is part of the specific pattern, and has an empty inside, and determining the specific pattern contained in the image based on the recognition results. In the partial-image recognition step, a pixel-block area of predetermined size containing a target pixel is successively scanned for the binary image data, and a partial image contained in the binary image data is recognized on the condition that at least one OFF-pixel exists within a reference block consisting of the target pixel and predetermined pixels in its neighborhood within the block.

The present invention relates to an apparatus and method for detecting a specific pattern contained in an image.
A pattern matching processing has been known as one of data processing performed in an apparatus, such as copier, which stores obtained image data in an image memory as binary or multi-valued data and detects a specific pattern or recognizes a shape contained in an image by comparing the data with the pixel data of a reference pattern stored previously in a memory.
In recent years, as scanning input apparatus and printing output apparatus, those that can rapidly process a large amount of information such as high-resolution data have been widely used. With performing various data processings including pattern matching processing with these apparatus at real time, there is a problem that their hardware configurations become complex. In order to resolve this problem, a pattern-detection apparatus that can rapidly detect a specific pattern and has a simple configuration is desired.
As one of such pattern-detection apparatus, there is known an apparatus that recognizes a partial image having a predetermined shape and size and being part of a specific pattern, based on condition that (1) the number of ON-pixel within m×n pixel rectangle block area in the neighborhood of a target pixel falls within a predetermined range, and that (2) no ON-pixel exists within a predetermined area in the neighborhood of said block area, after low-resolution converting a binary data. However, this pattern-detection apparatus cannot precisely identify a partial image, in particular, having an empty inside and often wrongly detects another image, such as a circular image having an all over painted inside or a quadrilateral or triangular image composed of multiple pixels of the same size, with the desired partial image. Also, this pattern recognition apparatus cannot precisely identify the shape of a partial image and often wrongly detects for the desired image, another image such as an L-shaped image or diagonal line.
Further, as a pattern-detection apparatus that can rapidly detect a specific pattern and has a simple configuration, the following one is known. The specific pattern is the detection object for this apparatus and consists of a plurality of partial images having a predetermined shape and size. In this apparatus, binary image data is successively scanned by a filter in which the specific pattern is framed. A score is set for the arrangement of the partial images recognized in the area framed by the filter. The apparatus determines the detection of the specific pattern based on the score. However, in this apparatus, if at least one of the partial images constituting the specific pattern is not recognized, then even if the recognition results for other partial images are perfect, the specific pattern cannot be detected.

Apparatus and method for detecting a pattern


The present invention is related to a camera having a film wind spool with an insertion slot for receiving a film leader, a counter roller at a film supply side of the film wind spool, and a film winding device having a plate-shaped guide member between the film wind spool and the counter roller for guiding the film leader from the film supply side to the insertion slot of the film wind spool when the guide member is in a first position. The guide member further includes two end pieces, each of the two end pieces are pivotally connected to a different axial end of the counter roller. A rear cover is provided on the camera that opens to expose the film winding device and has an interior projection. The film winding device further includes a flange protruding from the film winding device in a position corresponding to the interior projection when the rear cover is closed. This flange is connected to one of the end pieces for moving the guide member from the first position to a second position which allows winding of the film onto the film wind spool when the rear cover of the camera is closed.

1. Field of the Invention
The present invention relates to a camera with an image plane switching function, which is able to perform horizontal and vertical photographing according to a user's request, and a film winding device for winding Brownie film with no perforation around a film wind spool.
2. Description of the Related Art
If a camera using 135 mm film is held horizontally during photographing, a picture format is 24.times.36 mm (length.times.breadth). If the camera is held vertically, the picture format is 36.times.24 mm (length.times.breadth). In the case of a camera using 120 mm film, the picture format is a semi-brownie size: 6.times.4.5 cm (length.times.breadth) in the horizontal photographing or 4.5.times.6 cm (length.times.breadth) in the vertical photographing.
In a conventional film winding device, the perforations of the film are engaged with a sprocket when the film is loaded, and the motor rotates the sprocket so as to smoothly feed the film. When the film reaches the wind spool, the film is pressed against the wind spool by a guide which is pushed toward the wind spool. The perforations are engaged with nails formed on the wind spool, and the film is wound around the wind spool. Every time the exposure of a frame is completed, the sprocket and the film wind spool rotate, and the film is wound around the wind spool by the rotation.
The above-mentioned film winding device is mounted in a camera using a film such as 35 mm film provided with perforations. In the Brownie camera using the Brownie film without perforations, it is difficult to use the above-mentioned device which is driven by a motor to wind the leader of the film around the film wind spool.
When the film is loaded in the conventional Brownie camera, the user pulls the leader of the film from the film supply side with one hand, and rotates the film wind spool to position the film leader insertion hole of the film axis part at a predetermined position with the other hand, and inserts the leader of the film into the film leader insertion hole.
Most of the conventional cameras (the so-called compact lens shutter camera using 135 mm film) are rectangular along the film feed direction. A strobe is provided at the upper left of the front of the camera. When a person at a relatively short distance from the camera is stroboscopically taken, there is no problem about the shadow of the person. On the other hand, if the strobe is attached to the camera with the film image plane called the 120 Brownie, and when the person is stroboscopically taken by the camera which has been rotated by 90.degree. from the horizontal position to be vertical, the position of the strobe light emitting part changes greatly. Thereby, the shadow close to the subject is taken, and the photograph is not easy to see and lacks a sense of beauty. Since the camera becomes larger and heavier in proportion to the picture format, the user cannot vertically hold the camera with the relatively-large image plane in a stable manner during the photographing.
The conventional Brownie camera has another disadvantage in that the film cannot be easily loaded. The leader of the film often enters the gap between the film wind spool and the counter roller, not being inserted into the film leader insertion hole. For this reason, the operation of the conventional Brownie camera requires a lot of skill.
The camera of this type is not common in use because of the above-mentioned disadvantages.

Camera and film winding device of camera


A high-purity carbon fiber reinforced carbon composite formed by a process which entails graphitizing a molded member packed with carbon fibers, which fibers are subjected to a purification process under halogen gas prior to being graphitized and prior to being packed with a matrix of carbon material, and the matrix of carbon material, the carbon fiber reinforced carbon composite having an impurities content of not more than 30 ppm in ash content and satisfies either or both of the following conditions for impurities:

1. Field of the Invention
The present invention relates to high purity carbon fiber reinforced carbon composites (hereinafter referred to as C/C composites) having a reduced impurities content by using a high purity treatment. More particularly, the present invention relates to high-purity C/C composites useful as semiconductor material processing components, such as Czochralski (hereinafter referred to as CZ) furnace components and apparatus.
2. Description of the Background
FIG. 2 illustrates a pulling single crystal apparatus used in the CZ process for manufacturing a single crystal ingot for use as a material of a semiconductor wafer, for example. As shown in FIG. 2, the CZ apparatus is so structured that a raw material in a quartz crucible 1 is heated to a high temperature by a heater 2 disposed around the quartz crucible 1 so that the raw material can be converted into the melt 3 which is pulled under vacuum pressure to form the single crystal ingot 4.
The structural elements, such as a crucible 5 supporting the quartz crucible 1 and an upper ring 6, an inner shield 7 and others which are subjected to radiant heat of the heater 2, are exposed to high temperature when pulling a single crystal ingot 4 from the quartz crucible 1 within a molten silicon.
Accordingly, the structural elements must be formed of a material that can maintain a prescribed mechanical strength under high temperature. Further, the structural elements must be formed of a material of high-purity, because impurities, such as metals, contained in the structural elements lead to crystal defects in orientation of the solidifying single crystal ingot 4 and also lead to reduced purity, when leaked during manufacturing. In general, a high purity graphite having excellent mechanical properties at high temperature and having high-purity is used for the structural elements of the CZ apparatus (Japanese Patent Publication No. Hei 6(1994)-35325). Recently, with increasing diameter of the single crystal, the single crystal pulling apparatus used in the CZ process has also been increased in size. This leads to difficult handling because of the increased weight of the graphite elements and a problem in reducing the effective processing size of the interior of the apparatus.
The C/C composites have the properties of lightweight and excellent mechanical strength, as compared with the graphite material. Thus, even when reducing thickness, the structural elements of the C/C composites exhibit a strength equal to that of the graphite material, allowing effective use of the processing chamber of the apparatus. In addition, by being lightweight, the apparatus may be easily handled. With such advantages, crucible components used in the CZ apparatus having a large diameter are now moving from those made of graphite to those made of C/C composites.
Recently, elements for use in a CZ apparatus made of high purity C/C composites have been proposed. For example, U.S. Pat. Nos. 5,683,281 and 5,800,924 disclose high purity C/C composites subjected to degasification at 2,400xc2x0 C. to 3,000xc2x0 C. under an inert gas atmosphere in the carbon fiber stage; impregnation with high purity pitch or resin for densification; graphitization; and high purification at 2,400xc2x0 C. to 3,000xc2x0 C. under a halogen gas atmosphere, so that the impurities of Ag, Al, Ba, Be, Ca, Cd, Co, Cr, Cu, K, Mg, Mn, Mo, Na, Ni, P, Pb, Sr and Zn can be reduced below the detection limit by inductively coupled plasma spectroscopy (ICP). U.S. Pat. No. 5,616,175 discloses 3-D C/C composites for a pulling single crystal apparatus which is impregnated with the carbon material which results in a matrix which is then graphitized, followed by high purification under a halogen gas, so that the impurities are not more than 10 ppm and whose surface is coated with pyrolytic carbon or silicon carbide, for preventing reaction with the gas generated from the melt when the single crystal is pulled.
In the single crystal solidification of the pulling silicon single crystal in the CZ process, well known impurities, such as V and Fe, cause crystal defects in orientation of the solidifying of the single crystal. Therefore, the total content of impurities must be reduced, particularly by decreasing the V and Fe impurities for using the CZ process. In U.S. Pat. Nos. 5,683,281 and 5,800,924, the impurities of V and Fe were detected by ICP. The amounts of the impurities of V and Fe are still too great to control the crystal defects in orientation of the solidifying single crystal.
It is an object of the present invention to provide high purity C/C composites with reduced impurities content, such as V and Fe, by high purity treatment.
The high purity C/C composites are formed by graphitizing a molded member packed with carbon fibers and carbon material of a matrix. The carbon fibers are highly purified under halogen gas atmosphere. The purified carbon fibers are molded into the desired shape on a tool or in a die and impregnating the carbon material of the matrix. The molded member packed with carbon fibers and carbon material of the matrix are either independently or simultaneously graphitized with high-purification under halogen gas atmosphere, and then are highly purified under a vacuum/halogen gas atmosphere in order to highly purify the C/C composites. According to the present process, impurities are greatly reduced. The impurities content of V and Fe, for example, are not more than 0.12 ppm and 0.10 ppm by ICP optical emission analysis, respectively.
The carbon material of the matrix impregnated carbon fibers become graphite fibers. The carbon material of the matrix around the graphite fibers also becomes graphite and coats the graphite fibers. The present high-purity C/C composites contain two graphites namely, the high-purity graphite fibers and the high-purity graphite matrix. According to the structure of the C/C composites, the impurities may be difficult to dissolve from the inside of the graphite fibers.
The C/C composites of U.S. Pat. Nos. 5,683,281, 5,800,924 and 5,616,175 are highly-purified under halogen gas at one time after graphitizing the molded C/C composites which are structured to coat the graphite matrix on the graphite fibers. Accordingly by structure, the C/C composites may be mainly purified around the outside surface of the graphite matrix, and the impurities of the inside of the graphite matrix and of the graphite fibers may be difficult to purify in the purification process thereof. The graphite fibers of the present invention are highly purified because the fibers are purified under halogen gas atmosphere before molding and graphitizing, and then the graphitized and molded C/C composites are either independently or simultaneously graphitized with high-purification under halogen gas atmosphere. The purity of the resulting C/C composites is not more than 30 ppm of ash content.

High purity carbon fiber reinforced carbon composites and manufacturing apparatus for use thereof

Abstract: (1) V is not more than 0.12 ppm by ICP-OES; and

Abstract: (2) Fe is not more than 0.10 ppm by ICP-OES.


A circuit board with a quality-indicator mark and a method for indicating quality of the circuit board. The circuit board includes a plurality of circuit board units. A plating bus is formed around each circuit board unit and extended to form a plating trace in an inner-layer circuit structure of each circuit board unit. The inner-layer circuit structure is inspected in quality to maintain or break connection between the plating trace and plating bus if the quality is good or not. At least one circuit structure is formed on the inner-layer circuit structure and electrically connected to the plating trace to form a conductive mark on each circuit board unit. A metal protection layer is formed on the at least one circuit structure via the plating bus, and the conductive mark with the metal protection layer indicates that the inner-layer circuit structure of the circuit board unit is good.

With development in the electronic industry, electronic products have been developed toward providing multiple functions and high performances. In order to achieve high integration and size miniaturization of a semiconductor package, a circuit board for carrying multiple active/passive components and circuits has evolved from a double-layer board to a multi-layer board, wherein an available circuit area of the multi-layer circuit board is enlarged via interlayer connection technology within a limited space for accommodating integrated circuits with a high circuit density.
Moreover, due to an increase in popularity of portable products such as communication, network and computer products etc., BGA (ball grid array) packages, flip-chip packages, CSPs (chip size packages) and MCM (multi chip module) packages have become mainstream products in the market as they are incorporated with size-reduced integrated circuits (ICs) and have a high density and a large number of leads or input/output (I/O) connections. These packages are usually cooperative with high capability chips such as microprocessors, chip modules and graphics chips etc. to achieve higher speed operation. However, fabrication limitations of an IC package substrate with circuits on the functions thereof, such as chip signal transmission, bandwidth improvement and control resistance, impede the use of such substrate in a package with a large number of I/O connections. As the package size is reduced to approximately the chip size, bow to develop a package substrate with fine circuits and a high density of fine vias is an important research task.
Accordingly, a conventional method for fabricating a multi-layer circuit board by using build-up technology has been provided. FIGS. 1A to 1D show a build-up method for fabricating a multi-layer circuit board, and this build-up method generally includes two steps: preparing a core and performing a circuit build-up process. Referring to FIG. 1A, first, a core 11 is prepared, which comprises a resin core layer 111 with a pre-determined thickness and circuits 112 formed on front and back surfaces of the resin core layer 111. A plurality of plated through holes 113 are formed in the resin core layer 111 to electrically connect the circuits 112 on the front and back surfaces of the resin core layer 111. Then referring to FIG. 1B, a build-up process is performed on the core 11 to form a dielectric resin layer 12 on the front and back surfaces thereof respectively, and the dielectric resin layer 12 is provided with a plurality of blind vias 13 for exposing portions of the circuits 112. Referring to FIG. 1C, a metal conductive film 14 is deposited on an exposed surface of the dielectric resin layer 12, side walls of the blind vias 13 and the exposed portions of the circuits 112 by means of an electroless plating or sputtering technique, and a patterned dry film 15 is formed on the metal conductive film 14. The patterned dry film 15 has a plurality of openings 150 for exposing portions of the conductive film 14 on which a patterned circuit layer is to be formed. Finally referring to FIG. 1D, a patterned circuit layer 16 is formed in the openings 150 of the dry film 15 by an electroplating technique, wherein the patterned circuit layer 16 is electrically connected to the circuits 112 through the blind vias 13, and then the dry film 15 and the part of the conductive film 14 covered by the dry film 15 are removed by etching, such that a build-up structure 10a is fabricated on each of the front and back surfaces of the core 11 so as to achieve a 1+2+1 substrate 10 with multi-layer circuitry (i.e. 2 build-up structures and a double-layer core). Similarly, the above build-up process may be repeated to form a second build-up structure on the build-up layer 10a (referred to as "first build-up structure") so as to fabricate a 2+2+2 substrate with multi-layer circuitry. Related prior arts include U.S. Pat. Nos. 5,837,427, 5,994,771 and 6,384,344.
Subsequently, BGA semiconductor packaging processes are readily performed, which allow a semiconductor chip to be mounted on a front surface of the foregoing substrate with desirable circuitry, and allow a plurality of solder balls to be implanted on a back surface of the substrate, wherein the solder balls are used to electrically connect the BGA package to an external electronic device such as printed circuit board (PCB). In order to reduce the weight and size of electronic products, there is provided a TFBGA (thin and fine ball grid array) package having a smaller overall size than the conventional BGA package. The TFBGA packages are normally fabricated in a batch manner on a substrate strip, wherein the substrate strip is predefined with a plurality of package sites each for forming a single TFBGA package. A singulation process is finally performed to separate apart the plurality of package sites to form a plurality of individual TFBGA packages.
Generally to provide electrical connection and bonding of a semiconductor package to an external electronic device (such as PCB) via solder balls, or provide efficient electrical connection of a semiconductor chip to a substrate, a plurality of conductive traces such as copper traces are formed on surfaces of the substrate and extended to form connecting pads where a nickel/gold metal layer is applied to allow conductive elements, such as gold wires, bumps or solder balls to be effectively bonded to the connecting pads of the substrate and electrically connect the substrate to the chip or PCB, and also to prevent the connecting pads from oxidization due to external environmental influences. For forming the nickel/gold metal layer having high electrical conductivity, during the fabrication of the substrate, the connecting pads are adapted to be electrically connected to a plating bus, such that a plating current can go through the plating bus to the connecting pads and allow the nickel/gold metal layer to be deposited on the connecting pads. When the semiconductor package is fabricated, the plating bus becomes useless and is removed.
A layout method of the TFBGA substrate is shown as FIG. 2. The TFBGA substrate 200 is divided into a plurality of substrate units 20 by a plurality of transverse cutting lines SLx and a plurality of longitudinal cutting lines SLy. The substrate units 20 serve as package sites to be subjected to subsequent packaging processes and would be separated from each other by means of a final singulation process cutting along the cutting lines SLx and SLy. A circuit layout of each substrate unit 20 includes a plurality of bonding pads 21, a plurality of conductive through holes 22, and a plurality of conductive traces 23 electrically connected to the bonding pads 21 and the conductive through holes 22. The conductive through holes 22 are used to electrically connect the conductive traces 23 on a front surface of the substrate unit 20 to ball pads (not shown) on a back surface of the substrate unit 20. In order to electroplate a nickel/gold metal layer on the bonding pads 21 on the front surface and the ball pads on the back surface of the substrate unit 20, the conductive through holes 22 are adapted to be electrically connected to a plating bus 24 formed around each substrate unit 20, so that a plating current can go through the plating bus 24 to all the conductive through holes 22 and then to the bonding pads 21 and the ball pads of the substrate unit 20. The plating bus 24 is formed in a grid shape and located on the cutting lines SLx and SLy, such that the plating bus 24 can be removed during the final singulation process. Related prior arts include U.S. Pat. Nos. 6,281,047, 6,319,750 and 6,479,894.
However, the above layout method for the substrate has a plurality of drawbacks. Since the plating bus is formed around the substrate units, before the substrate units are singulated, electrical tests cannot be performed on the substrate units. As a result, if inner-layer circuits of the substrate units generally for signal connection and grounding or powering purposes are incurred with defective appearance during the substrate fabrication, this situation would not be realized, and such substrate units would still be subjected to subsequent die-bonding and packaging processes if the substrate units have good outer-layer circuits and bonding pads or ball pads. This not only causes a waste of materials and cost but also leads to an increase in fabrication steps and time, as well as sacrifices the client's good dies due to fabrication of products with defective inner-layer circuits as it is incapable of detecting failure of the inner-layer circuits at an earlier stage.
Therefore, the problem to be solved here is to provide a method for indicating whether inner-layer circuits of a substrate are good and thus indicating whether the substrate should be subjected to subsequent packaging processes, so as to prevent a waste of materials and cost, an increase in fabrication steps and time, and sacrifice of the client's good dies from occurrence.

Circuit board with quality-indicator mark and method for indicating quality of the circuit board

Siliconware Precision Industries Co., Ltd.


A circuit for detecting a touch point location on a touch panel, a touch panel and a display device for improving the precision of touch point location on the touch panel are disclosed. The circuit for detecting a touch point location on a touch panel comprises: a sensing sub-circuit, an amplification sub-circuit connected to the sensing sub-circuit, an output sub-circuit connected to the amplification sub-circuit, a detection sub-circuit connected to the output sub-circuit, and a first touch drive electrode line. The sensing sub-circuit comprising a fixed capacitor, a variable capacitor, and a first switch transistor, wherein a gate terminal and a source terminal of the first switch transistor are connected to the first touch drive electrode line, a drain terminal of the first switch transistor is connected to a terminal of the fixed capacitor, a terminal of the variable capacitor is connected to the other terminal of the fixed capacitor, the other terminal of the variable capacitor is connected to a reference voltage, and the amplification sub-circuit is connected to the terminal of the fixed capacitor that is connected to the variable capacitor.

An in-cell touch panel is formed by integrating a touch panel (TP) as an input medium together with a display panel, and plays an important role in the display technical field. Mutual capacitive TPs are very popular due to their advantages of high sensitivities and multi-touch.
An in-cell touch panel is such a device that the touch drive electrode line and the touch sense electrode line of the touch panel are integrated in the display panel. For example, the touch drive electrode line and the touch sense electrode line are integrated in a Liquid Crystal Display (LCD) or an Organic Light Emitting Device (OLED). The touch drive electrode line and the touch sense electrode line may be fabricated on the front substrate and/or rear substrate of the display panel. To simplify the configuration and reduce the thickness of the in-cell touch panel, the gate line, the common electrode line and other functional electrode lines of the display panel may be used as the touch drive electrode, which is driven in a time division manner to realize image display and touch function.
The basic principle of operation of the mutual capacitive touch panel will be briefly described in the following.
The touch drive electrode of the mutual capacitive touch panel determines X coordinate of the touch point location and the touch sense electrode determines its Y coordinate. A touch drive voltage is applied to the touch drive electrode and a constant voltage is applied to the touch sense electrode. When detecting a touch point location, touch drive electrodes along the X direction are scanned row by row. Signals at individual touch sense electrodes are read when scanning each row of the touch drive electrode. A round of scan can traverse all intersections between each row and each column and totally X*Y signals are scanned. With such a method for detecting the touch point location, coordinates of multiple points may be determined, and thereby realizing multi-touch.
A typical and conventional circuit for detecting a touch point location on a touch panel is illustrated in FIG. 1, which comprises: a sensing sub-circuit 101, an amplification sub-circuit 102, an output sub-circuit 103 and a detection sub-circuit 104. The sensing sub-circuit 101 comprises a fixed capacitor C1, a variable capacitor Cf and a Thin Film Transistor (TFT) M1. The gate and source terminals of the TFT M1 are connected to a touch drive electrode line (such as the gate line Gate(n−1) illustrated in FIG. 1, respectively, which is multiplexed as the touch drive electrode line and the gate line in a time division manner) and a reset voltage line (Vint line), the drain terminal of the TFT M1 is connected to a terminal of the variable capacitor Cf, and the other terminal of the variable capacitor Cf is connected to a reference voltage. A terminal of the fixed capacitor C1 is connected to the gate line Gate(n−1), and the other terminal is connected to the drain terminal of the TFT M1. The amplification sub-circuit 102 comprises a TFT Mamp for amplifying signals. The gate terminal of the TFT Mamp is connected to the drain terminal of the TFT M1, the source terminal is connected to the Vint line, and the drain terminal is connected to the source terminal of a TFT M2 in the output sub-circuit 103. The gate terminal of the TFT M2 is connected to another touch drive electrode line (such as the gate line Gate(n) illustrated in FIG. 1), and the drain terminal is connected to the detection sub-circuit 104 via a Read Out line.
The principle of operation of the circuit for detecting the touch point location on the in-cell touch panel as illustrated in FIG. 1 is as follows: when the Gate(n−1) is at a high level, the TFT M1 is turned on, the fixed capacitor C1 and the variable capacitor Cf are charged, and the drain terminal of the TFT M1 (i.e., node Vc illustrated in FIG. 1) will be charged to Vint (that is, Vc=Vint). When the Gate(n−1) is at a low level, voltage at the node Vc is changed to the following value due to a the capacitance coupling effect:Vc=Vint−C1*ΔVp/(C1+Cf)  (1)
In the above Equation (1), ΔVp represents a difference between a high voltage and a low voltage of a linear pulse on the Gate(n−1) line. When a touch occurs, the capacitance of Cf will be changed (generally increased), and thus the voltage at the node Vc is changed. That is, the gate voltage of the amplifying TFT Mamp is changed, the source current of the TFT Mamp is accordingly changed, that is, the source current flowing from the TFT Mamp to the TFT M2 is changed. When Gate(n) is of a high level, the TFT M2 is turned on, and a current flowing from the drain of M2 to the detection sub-circuit 104 via the Read Out Line is changed. The location of the touch point can be accordingly determined by detecting the changed current by the detection sub-circuit 104.
The main disadvantage of the circuit for detecting the touch point location on the in-cell touch panel illustrated in FIG. 1 is as follows: when comparing the value of Vc in Equation (1) computed with the changed Cf caused by the touch with the value of Vc in case of un-touch, the Vc change between the touch and un-touch is not significant and thus the change in the current flowing from the TFT Mamp to the Read Out Line via the TFT M2 is not as significant. As a result, the change of voltage Vout output by the detection sub-circuit 104 is not apparent, so the detection precision of the sub-circuit is low, that is, the precision of touch point location determination is not high. Moreover, since the amplification effect of the amplification sub-circuit 102 in the circuit for detecting the touch point location on the in-cell touch panel illustrated in FIG. 1 is not apparent, the current change amount at Read Out Line is small and the precision of the touch point location is low.

Circuit for detecting touch point location on a touch panel, touch panel and display device

HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.


An access network controller and a base station controller are formed to define an interface there between that enables the two systems to facilitate and respond to a voice call that is to be set up to a hybrid mobile station even though the hybrid mobile station is presently engaged in a data only call. More specifically, the base station is formed to generate a pseudo-page signal to the access network controller to determine whether the hybrid mobile station is present and available prior to the base station generating paging signals to establish the voice call. According to the response received from the access network controller, the base station either pages the hybrid mobile station to establish the voice call, forwards the call to voice mail, or forwards the call either to an Internet Call Delivery Server or to an Internet Call-Waiting Server.

1. Technical Field
The present invention relates to mobile communication devices and, more particularly, to hybrid mobile stations capable of communicating in a data-only mode with a data network and in a voice mode with a voice network.
2. Related Art
Traditional wireless mobile networks include Mobile Station Controllers (MSCs), Base Station Controllers (BSCs) and Base Transceiver Station Systems (BTSs) that jointly operate to communicate with mobile stations over a wireless communication link. Examples of common networks include Global System for Mobile Communications (GSM) networks, Time Division Multiple Access (TDMA) networks and Code Division Multiple Access (CDMA) networks.
To establish a wireless communication link, an MSC communicates with a BSC to prompt the BTS (collectively "Base Station" or "BS") to generate paging signals to a specified mobile station within a defined service area typically known as a cell or sector (a cell portion). The mobile station, upon receiving the page request, responds to indicate that it is present and available to accept an incoming call. Thereafter, the BS, upon receiving a page response from the mobile station, communicates with the MSC to advise it of the same. The call is then routed through the BS to the mobile station as the call setup is completed and the communication link is created.
Next generation cellular networks that are presently being developed are being formed, in contrast to traditional systems, to create the ability for mobile stations to receive data. For example, many new mobile stations, often referred to as mobile terminals, are being developed to enable a user to surf the web or send and receive e-mail messages through the wireless mobile terminal. Accordingly, different systems and networks are being developed to develop such a capability and improve their operational characteristics. One example of a system that is presently being deployed with voice and data capabilities is the CDMA 2000 network. The CDMA 2000 network, however, is optimized for voice transmissions as it grew out of a voice network (IS-95A) and therefor is not optimized for transmitting data. More formally, the 1xRTT Standard defines CDMA operation.
One data network that is being developed is defined by the 1xEDO standard. The 1xEDO standard defines a timeburst system utilizing a 1.25 MHz carrier that is set at a carrier frequency that is adjacent to the frequencies used by the voice networks. In one particular network, a 1.67 millisecond (mS) burst is used for the forward link in the 1xEDO network. The 1xEDO standard data-only network is optimized for streaming video and other such data applications. The next generation of CDMA networks that are being deployed can communicate with voice and data networks but do not process data as efficiently as the networks formed according to the 1xEDO Standard as well as other data standards.
The data-only 1xEDO networks that have been previously described are not formed to interact seamlessly between the voice and data networks. More specifically, a Dual Mode Mobile Station, herein also referred to as a Hybrid Mobile Station (HMS) that can communicate with a voice network, such as a CDMA 2000 network, as well as a data only network, such as the 1xEDO networks described herein, is not able to hear and respond to a page for an incoming call from a voice network such as the CDMA 2000 network while engaged in a data (data-only) call with the 1xEDO network. Accordingly, a system and method is needed that facilitates call setup and call delivery for voice calls for the HMS's that are in a data call with the 1xEDO network.

Method and apparatus for a hybrid mobile terminal


An ECU executes control processing including a step of executing engagement control on a K0 clutch when a D→N operation is performed, a step of keeping the K0 clutch engaged until an N→D operation is performed, a step of executing engagement control on a C1 clutch when the N→D operation is performed, a step of keeping the K0 clutch engaged when a request to operate an engine is issued following the elapse of a predetermined time α, and a step of executing disengagement control on the K0 clutch when a request to operate the engine has not been issued.

1. Field of the Invention
The invention relates to a driving apparatus for a hybrid vehicle and a control method thereof.
2. Description of Related Art
Japanese Patent Application Publication No. 2010-149538 (JP 2010-149538 A), discloses a vehicle installed with a predetermined hydraulic engagement apparatus that is engaged in order to switch a vehicle transmission apparatus to a power transmissible condition when a switch operation is performed from a non-driving position to a driving position.

Driving apparatus for hybrid vehicle and control method thereof