A corrosion protected wind turbine unit includes a wind turbine unit support structure or foundation implanted in water and an impressed current anode electrochemically coupled to the wind turbine unit support structure or foundation through the water. Also included is a controlled current source configured to receive electrical current from the wind turbine unit or at least one other wind turbine unit located in proximity to the corrosion protected wind turbine unit and further configured to operate the impressed current anode.

This invention relates generally to wind turbine energy sources and more particularly to the protection of marine-based wind turbine structures.
Generally, a wind turbine includes a rotor having multiple blades. The rotor is mounted to a housing or nacelle, which is positioned on top of a truss or tubular tower. Utility grade wind turbines (i.e., wind turbines designed to provide electrical power to a utility grid) can have large rotors (e.g., 30 or more meters in diameter). Blades on these rotors transform wind energy into a rotational torque or force that drives one or more generators that may be rotationally coupled to the rotor through a gearbox. The gearbox steps up the inherently low rotational speed of the turbine rotor for the generator to efficiently convert mechanical energy to electrical energy, which is fed into a utility grid.
Some wind turbine units (i.e., the wind turbine itself, the tower, support structure/foundation, auxiliary components, etc.) are installed in water or seawater, and may be installed in shallow, swift current, with shifting bathymetry and perhaps brackish water. It is known that steel structures used for marine facilities corrode, when unprotected, about 5 mils per year. Higher rates of corrosion are also possible, depending upon the composition of the water, imperfections in the steel itself, and many other factors.
To avoid or at least delay the effects of corrosion, some of these known offshore wind turbine unit installations use cathodic protection (CP) to protect wind turbine unit support structures or foundations. This technique involves the use of electrochemical reactions to prevent the corrosion of underwater steel structures. Sacrificial anodes are presently being used in such CP installations. However, if the anodes are buried by shifting bathymetry or tidal changes in water level, if the current is particularly swift, and/or the salinity of the water changes by a significant amount, the protection provided will suffer. For example, the anodes can be consumed prematurely, underprotect the structure, or passivate. Sacrificial anodes cannot adjust to changing conditions and would be subject to premature consumption or to underprotection of the wind turbine unit support structure or foundation. Locations far from the equator also have both a higher chance of annual wind force and a higher chance of higher tides. Variations in water depth of as much as 80 feet can occur due to strong tides, which can change the amount of support structure or foundation that is being corroded, along with current, waves, salinity, and bathymetry changes.
In addition, sacrificial anodes require wasteful over-design and consequential excess weights. The high weights may require the construction of stronger support structures, especially if the anodes are installed as part of the support structure, as is usually the case for platforms or tripods. Since windy offshore sites have a limited/short installation and construction season, cathodic protection sometimes cannot be installed until the next installation season, allowing initial corrosion to occur on the support structures or foundations. Furthermore, hazardous minor metal components are common in sacrificial anodes. These components are released into the surrounding water as the anodes are "sacrificed" (corroded/eroded). Some environmentalists and government bodies are concerned by the effect of this release on the surrounding environment.
In addition, a large amount of energy is consumed for the manufacture of sacrificial anodes, which are typically very heavy. In addition to increased cost, this weight results in increased safety risk both as a result of weight as well as the large number of components that must be installed.
Thus, sacrificial anode CP is not an ideal protection for wind turbine units either in regard to safety and environmental considerations, or in changing ocean conditions.

Corrosion protection for wind turbine units in a marine environment


A CPU for a motor driving apparatus of an image forming apparatus excites a predetermined phase winding among plural phases of a stepping motor for a predetermined time period. Thereafter, before a rotation of the motor is started, it is judged whether there is the possibility of deviating a positional relationship between a rotor and a stator of the motor from a positional relationship determined by the excitation of the predetermined phase winding for the predetermined time period, by an external force, on the basis of judgement whether a door is opened for jam treatment. If the possibility of deviation is judged, the predetermined phase winding among plural phases of the stepping motor is excited again for a predetermined time period.

1. Field of the Invention
The present invention relates to a motor driving apparatus for controlling a rotation of a stepping motor, a control method therefor, control program therefor, a storage medium readable by a computer storing such control program, and an image forming apparatus such as a copying machine and the like having a recording paper conveying system including the stepping motor as a driving source.
2. Related Background Art
In recent years, in image forming apparatuses such as copying machines, there has been requested an image forming apparatus in which image formation can be performed at a higher speed with a compact construction. In order to permit the image formation at the higher speed with the compact construction, a position of a recording paper being conveyed must be grasped correctly. However, in the conventional techniques, a motor used as a driving source of a recording paper conveying system of an image forming apparatus is a DC motor, and there is dispersion in operations of clutches and solenoids constituting a conveying mechanism and, thus, there is dispersion in a sheet conveying distance. In high speed machines, since such dispersion becomes great, a stepping motor capable of determining a rotational angle correctly in accordance with the number of inputted pulses has been used.
A general method for rising-up the stepping motor will be explained hereinbelow.
A positional relationship between a stator and a rotor of the stepping motor in a non-excited condition that exciting electrical current is not applied to the stepping motor (for example, power OFF) is as shown in FIG. 1A. In this condition, the rotor is stopped at a most stabilized position by an influence of only a magnetic force. Thereafter, for example, upon initiation of a copying operation, when the electrical current is applied to the stepping motor to cause the exciting, as shown in FIG. 1B, a position where the rotor is electrically stabilized with respect to the rotor is established. In order to continue to rotate the motor, an exciting phase of the motor must be successively changed by driving clocks.
However, when the non-excited condition is transferred to the electrically stabilized condition, in order to correct the deviated positional relationship between the stator and the rotor, torque of the stepping motor is changed greatly by the magnetic force. While the torque is being changed, the exciting phase is switched by the driving clock, with the result that, if the rotor tries to rotate continuously, the motor will be out-of-phase.
As one of methods for preventing the out-of-phase, there is so-called pre-multi-rotation in which the motor is rotated for a predetermined time period upon power ON. The exciting phase is determined by the pre-multi-rotation, and the positional relationship between the stator and the rotor is stored in a storing device, so that the stepping motor can be rotated smoothly when the copying operation is started.
Further, as a second method, there is a method in which only exciting electrical current having predetermined phase is flown through the motor sufficiently before the motor is rotated, and, after the positional relationship between the stator and the rotor is stabilized and the fluctuation of torque is ceased, the rotation of the motor is started.
However, in the recording paper conveying system of the image forming apparatus using the stepping motor as the driving source, when the stepping motor is actually rotated by the above-mentioned pre-multi-rotation, if the recording paper exists on a sheet feed roller to be rotated thereby, the recording sheet is conveyed, with the result that sheet jam may occur.
Further, in compact and high speed image forming apparatuses, since a distance between a sensor for generating a motor driving start signal (and disposed in front of the sheet feed roller) and the sheet feed roller is limited and a time period from when the recording sheet is passed by the sensor to when the sheet reaches the sheet feed roller is short, the exciting cannot be effected sufficiently before the driving of the motor is started.
Further, regardless of the sensor, if the exciting electrical current is previously applied for a predetermined time period, since the current continues to flow through the motor, power consumption will increased.

Motor driving apparatus, control method therefor, control program therefor, storage medium readable by computer storing control program and image forming apparatus


The present invention relates to the cloning and expression of foreign protein or polypeptides in bacteria, such as Escherichia coli. In particular, this invention relates to expression tools comprising a FKBP-type peptidyl prolyl isomerase selected from the group consisting of FkpA, SlyD, and trigger factor; methods of recombinant protein expression, the recombinant polypeptides thus obtained, as well as to the use of such polypeptides.

A large variety of expression systems has been described in the patent as well as in the scientific literature. However, despite the fact that fusion proteins have become a cornerstone of modern biology, obtaining the target protein in a soluble, biologically active form, as well as in high yield, continues to be a major challenge (Kapust, R. B. and Waugh, D. S., Protein Sci 8 (1999) 1668-74).
Examples of fusion partners that have been touted as solubilizing agents include thioredoxin (TRX), glutathione S-transferase (GST), maltose-binding protein (MBP), Protein A, ubiquitin, and DsbA. Although widely recognized and potentially of great importance, this solubilizing effect remains poorly understood. It is not clear, for example, what characteristics besides intrinsically high solubility epitomize an effective solubilizing agent. Are all soluble fusion partners equally proficient at this task, or are some consistently more effective than others? Similarly, it is not known whether the solubility of many different polypeptides can be improved by fusing them to a highly soluble partner, or whether this approach is only effective in a small fraction of cases.
The state of the art relating to the most potent expression systems has recently been summarized by Kapust et al., supra. In their attempt to produce soluble fusion proteins comprising various target proteins they assessed three different and prominent candidate fusion partners. Maltose-binding protein (MBP), glutathione S-transferase (GST), and thioredoxin (TRX) were tested for their ability to inhibit the aggregation of six diverse proteins that normally accumulate in an insoluble form. All these candidate expression systems are known to the skilled artisan and described in detail elsewhere (e.g., EP 293 249 describes in detail the use of GST as an expression tool).
Remarkably, Kapust et al., supra, found that MBP is a far more effective solubilizing agent than the other two fusion partners also widely used in the art. Moreover, they demonstrated that only in some cases, fusion to MBP can promote the proper folding of the attached protein into its biologically active conformation.
It is especially critical that many aggregation-prone polypeptides may be rendered soluble by fusing them to an appropriate partner, but that some candidate fusion partners in a more or less unpredictable way are much better solubilizing agents than others.
A great demand therefore exists to provide for alternative, efficient expression tools, which are especially appropriate for the recombinant expression of aggregation prone proteins, e.g. like the rsgps.
There is a wealth of patent literature relating to proteins which bind to the immunosupressant FK-506, the so-called FK-506 binding proteins or FKBPs.
These proteins have been extensively studied and commercial applications have been designed centering around the FK-506 binding activity of these proteins. For example, WO 93/25533 makes use of CTP:CMP-3-deoxy-D-manno-octulosonate cytidyl transferase (=CKS) as expression tool. A FKBP is inserted into a CKS-based expression vector down-stream of the CKS gene. The fusion protein obtained is used to improve measurements of FK-506 and other immunosuppressants.
WO 00/28011 discloses materials and methods for regulation of biological events such as target gene transcription and growth, proliferation and differentiation of engineered cells.
WO 97/10253 relates to a high throughput assay for screening of compounds capable of binding to a fusion protein which consists of a target protein and an FK-506-binding protein. Disclosed is the use of an FKBP12-Src homology (SH2) fusion protein in an high throughput screening assay. The fusion protein is produced in soluble form in the bacterial periplasm and released by standard freeze-thaw treatment.

Fusion polypeptides, vaccines and compositions of FKBP chaperones and target polypeptides


The present invention includes compositions and methods for diagnosis of polymorphisms associated with susceptibility to idiopathic scoliosis in a patient by determining the presence of a mutation in a nucleic acid sample provided from the patient for a mutation in a transcription factor binding site in one or more non-coding regions of the chromodomain helicase DNA binding protein 7 gene.

Without limiting the scope of the invention, its background is described in connection with scoliosis.
Scoliosis is a lateral deformity of the spine produced by rotation of the vertebral bodies. "Idiopathic" scoliosis occurs in otherwise healthy children, usually during the period of rapid growth at adolescence. It is the most common pediatric spinal deformity and has a prevalence of 2-3% in school age children. Two clear risk factors in IS are remaining growth potential, and female gender1. Inheritance is generally complex (MIM #181800), although some families with apparent Mendelian transmission have been described2. Genome wide scans in single families and family collections3-7, and chromosomal breakpoint mapping8 have tentatively identified several chromosomal regions that may contribute to disease; however, results of these studies have not clearly converged on any single region and IS susceptibility loci have remained elusive.
Despite years of study, few if any methods exist for the diagnosis of scoliosis. One of the few examples is United States Patent Application No. 20060015042, filed by Linial, et al., which teaches a method and apparatus for detection and measurement of scoliosis of the spine. Briefly, a method and apparatus for measuring the lateral curvature of a human spine is taught to detect the presence and degree of scoliosis in the patient. The device is said to be useable by non-medical personnel and medical practitioners, including doctors, chiropractors, physical therapists, nurses and the like. The system is said to be a low cost quick operating hand held device based on the operating structure of a standard computer mouse to determine immediately the curvature of the spine. The hand held device is used to scan the length of a patient's spine by contacting the patient's back as it is drawn along the length of the spine to provide a reading of the lateral curvature as X-Y coordinate information. The X-Y coordinate information is then graphed by a computer software program run on a standard computer. The software program allows repeated readings to be saved and compared over time.
Yet another method for the diagnosis of scoliosis is discussed in United States Patent Application No. 20050130250 by Moreau for a method of diagnosing adolescent idiopathic scoliosis and related syndromes. The method for diagnosing an increased risk for a scoliosis is by measuring dysfunction of the melatonin-signaling pathway in an animal comprising detecting the presence or absence of at least one impairment in melatonin-signaling pathway in at least one of the animal's cells. The presence of one impairment in melatonin-signaling pathway is said to indicate that the animal possesses an increased risk of developing scoliosis. The method of screening includes a compound useful in the treatment of a disease characterized by a dysfunctional melatonin-signaling pathway by contacting a candidate compound with at least one cell expressing at least one melatonin-signaling pathway impairment, wherein the candidate compound is selected if the melatonin signaling pathway impairment is reduced in the presence of the candidate compound as compared to that in the absence thereof.
Despite years of effort toward the diagnosis of pre-existing scoliosis, there exists a need for methods to diagnose scoliosis prior to the onset of symptoms. Early diagnosis of the possibility of scoliosis would permit physicians to monitor, evaluate and correct before or upon the onset of changes is spinal curvature. Early diagnosis is most likely to decrease the effect of the scoliosis, maximize the opportunity for treatment and reduce the length and extent of treatment.

Texas Scottish Rite Hospital for Children


Provided is a compact lens module which enables zoom and auto-focus functions even in a small lens module by providing a lens carrying structure using a supersonic driving unit. A lens unit is positioned in a case and has at least one lens. A carrying member is rotatably connected in the case and connected to the lens unit so that the lens unit may move forward and backward. In addition, a driving unit is mounted in the case for transferring a driving force to the carrying member so as to move the lens unit by repeatedly contacting and non-contacting with the carrying member.

1. Field of the Invention
The present invention relates to a lens module, and more particularly, to a compact lens module which enables zoom and auto-focus functions even in a small lens module by providing a lens carrying structure using a supersonic driving unit.
2. Description of the Related Art
A camera technique is developed from a film camera using a film to a digital camera which converts an image into digital signals. Recently, such a digital camera is gradually miniaturized and begins to be applied to a personal mobile communication terminal. Quality of the digital camera mounted to the personal mobile communication terminal, for example a cellular phone, is based on the pixel number of the image sensor, which is increasing continually, and nowadays a digital camera having 1 million pixels or more is scheduled for marketing, or already in the market.
The compact camera mounted to the cellular phone is mainly used just for pleasure, but it is expected that the compact camera will be considered as a useful camera beyond its prior function as an amusement tool since an image of 1 million or more pixels is realized recently. Thus, desires for a zoom function and an auto focus function, which are generally adopted in the film camera, are also increased to the compact camera, which may make the compact camera be recognized as a formal camera.
As a semiconductor manufacturing process is applied to an image sensor, it is possible to accumulate more image sensors in a narrow area. However, for the optical zoom and auto-focusing functions, there is needed a lens module design having an especially short stroke and a compact driving unit.
FIG. 1 shows a conventional lens driving structure. FIG. 1 is disclosed in U.S. Pat. No. 6,268,970 in the title of "Zoom Lens Barrel". In FIG. 1, the barrel includes frames 100 for supporting each lens group 120, 130 and 140, and cam tubes 160 and 170 for supporting the frames. The cam tubes allow the frames to move the lens in an axial direction, and the cam tubes are driven by a driving actuator 110.
In the zoom driving method of such a cam structure, a relative position of each lens is determined according to the shape of the cam while the zoom function is used. Thus, a focusing lens and a driving unit are additionally required for focusing at a specific magnification, and the driving tool becomes disadvantageously complicated and large-sized since a final reduction gear and a lens holding structure moving along the cam are further required.


A movable container which includes a body with a lower portion, a middle portion, and a top portion. The top portion includes a cup, and at least one wheel is rotatably mounted on the lower portion of the body. The wheel contacts a support surface and rotates relative to the body causing the cup to move along the support surface. A brake system is mounted on the body adjacent the at least one wheel for engaging the at least one wheel and restricting rotation the wheel.

This invention relates to a novelty and more particularly a novelty cup on wheels.
In the area of children's products, it is common for products such as cups to be stylised so as to carry either two or three dimensional characters so as to make the products more appealing to consumers.
In an attempt to provide a cup or the like with more appeal, the present invention provides a novelty device comprising an eating or drinking utensil mounted on a plurality of wheels for motion.


An entry mat for placement before an entry door to permit cleaning of shoe soles. The entry mat has a liquid reservoir with an open top, and a plurality of adjacent parallel generally cylindrical brushes mounted such that certain bristles thereof extend outwardly from the open top of the liquid reservoir for engagement of a shoe bottom and certain bristles thereof extend inwardly into the reservoir. At least one of the cylindrical brushes is rotatable. The mat has a liquid absorbing fabric material releasably retained in a taut configuration by a stretcher, a wiping mat, and a frame member having respective compartments within which the liquid reservoir, liquid absorbing fabric material and wiping mat are housed. Use of the entry mat is a three step process wherein shoe soles are first wiped on the wiping mat to remove larger sized debris. Next, the shoe soles are subjected to the brushes whereby the at least one rotating brush introduces liquid from the reservoir to the soles for cleansing. Finally, the shoe soles are repeatedly rubbed on the taut liquid absorbing fabric material for drying.

While entry door mats are commonly found at front doors, back doors, inside garage entry doors, and the like of homes and businesses, such mats generally are of a single-component material and often constructed of an abrasive fiber. Persons entering the doors tend to wipe their shoe soles on the mats to thereby attempt to remove all sorts of grime from the shoes. Such untoward material can include mud, dirt, gum, oil, road tar, and various other precipitates that can stay with a shoe sole. As is apparent from the wide scope of debris that thus may be present, some of these materials are not easily removed by simple wiping on a conventional door mat. Additionally, those materials that are removed remain in the mat, and can be picked up by subsequent users and carried inside the door anyway.
In view of the above difficulties and the general inefficiencies of conventional entry door mats, it is apparent that a need is present for an entry mat that can provide significant cleaning of shoe soles before the wearer enters a home, business, or other area to be protected from shoe-borne soil. Accordingly, a primary object of the present invention is to provide an entry mat that provides for liquid washing of a shoe sole followed by drying with a liquid absorbing fabric material.
Another object of the present invention is to provide an entry mat wherein liquid washing is enhanced by brushes that apply the cleansing liquid.
Yet another object of the present invention is to provide an entry mat for a three step process of sole cleaning comprising a wiping mat for initial contact, brushes for liquid cleaning, and a tautly retained liquid absorbing material for drying the sole.
These and other objects of the present invention will become apparent throughout the description thereof which now follows.


A method for determining whether surface connected, through thickness defects exist in a coated carbon-carbon composite article. The method involves the immersion of the coated article in a low viscosity liquid; if a stream of bubbles rises from the surface of the coating, such bubbles indicate the existence of at least one surface connected, through thickness defect in the coating.

Carbon-carbon composites are a unique class of materials whose elevated properties make them attractive for various aerospace applications. Anticipated applications of carbon-carbon composites in gas turbine engines include components such as exhaust nozzle flaps and seals, and tail cones. The materials are composites, although in general, all of the composite elements are carbon, in its various allotropic forms. Carbon-carbon materials are produced from organic precursor fibers, such as polyacrylonitrile, rayon, or pitch. Such fibers are usually produced in bundles (yarn), often by an extrusion process. The precursor fibers are heated in an inert atmosphere to pyrolyze or carbonize them, and may then be heated to a higher temperature (usually above about 2,000.degree. C.) to form graphite fibers. These graphite fibers may then be layed down, woven, or interleaved to form what are referred to as 1D, 2D, 3D, etc., structures where D stands for direction (i.e., in a 2D structure, fibers are layed in two, usually orthogonal, directions).
These woven structures may then be impregnated with a pitch or resin material which, by the application of heat, is converted to carbon which acts as the matrix for the composite. Hot pressing may be employed to obtain a more dense structure. Repeated impregnation steps may also be used to increase the density of the product being fabricated. In general, the product never achieves 100% theoretical density, i.e., it is porous. The density of some carbon-carbon components is in the range of about 1.3-1.75 grams per cubic centimeter (g/cc).
The finished product is usually at least 90-95% carbon, but by virtue of the fiber alignment and other processing details, has exceptional mechanical properties when compared with other carbon type materials such as monolithic graphite. The mechanical properties of carbon-carbon composite materials are constant, or even increase slightly, with temperature exposure up to about 2,000.degree. C. This temperature capability makes carbon-carbon materials exceptionally attractive for various aerospace applications.
One of the few drawbacks of carbon-carbon materials is their susceptibility to oxidation degradation at temperatures above about 340.degree. C. Various coatings have been developed which protect carbon-carbon substrates from oxidation. To be fully protective of the carbon-carbon substrate, the coating must fully encapsulate the component, viz., there must be no gaps in the coating, or defects which extend through the thickness of the coating and to the substrate. In applications where the coated component will be exposed to severe cyclic conditions (temperature and/or stress), a duplex, or two layer, coating system may be used to insure that the substrate is sufficiently protected from the environment. Some of the useful coatings for carbon-carbon components are disclosed in, e.g., U.S. Pat. Nos. 4,465,777, 4,472,476, 4,476,164, 4,476,178, and 4,544,412, all of which are incorporated by reference. Glass-type coating systems for carbon-carbon components have also been proposed.
Cracks in single layer coating systems, as well as in two layer coating systems have been observed. While a majority of these cracks do not extend to the carbon-carbon substrate, some do. Catastrophic oxidation of the carbon-carbon substrate may occur when oxygen, moving through these defects, comes in contact with the substrate at elevated temperatures. Theoretically, any defect which is larger than the size of the oxygen atom is large enough to permit contact of oxygen with the substrate, which would begin the oxidation process. However, the rate at which oxygen moves through these very small through thickness defects is slow, and it is probably not until the component experiences stress at high temperatures that these defects increase to a size at which rapid oxygen diffusion, and therefore, rapid oxidation degradation, occurs. It is believed that the through thickness defect size which can result in rapid oxidation may be as small as about 15-150 microns. For the purposes of this specification and attached claims, defects which extend from the outer surface of the coating and through the entire thickness of the coating to the carbon-carbon substrate are termed through thickness defects.
Metallographic and X-ray techniques have heretofore been used to detect the existence of defects in coatings applied to carbon-carbon materials. However, as is known to those skilled in the art, such techniques are time consuming. As a result, newer and faster techniques are constantly being sought to determine the existence of such defects.
Numerous prior art patents teach methods for the nondestructive detection of cracks and other defects in various types of materials. See, e.g., U.S. Pat. Nos. 1,370,347, 1,613,962, 2,055,568, 2,316,842, 2,407,945, 3,064,466, 3,590,256, and 3,592,047. However, each of these patents is concerned with the examination of pressurized or air-tight containers, or, alternatively, the examination of articles using pressurized liquid. In both of these types of techniques, cracks are identified by air bubbles which rise from the surface of the article being examined. However, these techniques are complicated, and often use bulky equipment; they are not felt suitable for the examination of carbon-carbon composite materials, especially aircraft engine components, some of which can be several feet in length and breadth.
Thus, what is needed in the art is a fast, yet simple method for detecting very small, surface connected defects in coatings applied to carbon-carbon materials.

Nondestructive test for coated carbon-carbon composite articles


An image pickup apparatus of the present invention includes: a lens holding frame 10 that holds a lens 30, on the periphery of which a first pair of restricting members composed of convex members 101 and 102 are provided at at least two places; and a circuit board 20 that connects the lens holding frame 10 with a camera main body electrically. The circuit board 20 includes a flexible substrate 21 with wiring that establishes electrical connection, and a reinforcing plate 22 fixed to a part of the flexible substrate 21. The circuit board 20 is fixed to the lens holding frame 10, such that at least a part of the reinforcing plate 22 is disposed between the first pair of restricting members, and that both ends of the part of the reinforcing plate 22 disposed between the first pair of restricting members are restricted by the first pair of restricting members. Consequently, it is possible to provide a camera that is easy to manufacture or to provide a camera that causes little flare.

1. Field of the Invention
The present invention relates to electrical wiring for a camera, and in particular, to a method of fixing a circuit board to a lens holding frame in a camera in which the lens holding frame in a lens barrel is connected with a camera main body via the circuit board.
2. Description of Related Art
Conventionally, cameras capable of correcting camera shake by moving a part of a lens constituting the cameras have been known. In such cameras, it is required to exchange signals between a lens holding frame and a camera body in order to move the lens or recognize the position of the lens. In a known camera, signals are exchanged via a flexible substrate (see, in particular, Patent document 1).
A camera using the same concept as that of Patent document 1 will be described below with reference to FIGS. 10 to 12. FIG. 10 is an external perspective view of a lens holding frame 1010. FIG. 11 is a perspective view of a circuit board 1020 in a position to be assumed when it is fixed to the lens holding frame 1010. FIG. 12 is a perspective view showing a state in which the circuit board 1020 is fixed to the lens holding frame 1010.
As shown in FIG. 10, a lens (not shown) is fixed at the center of the lens holding frame 1010. The lens holding frame 1010 is connected electrically with a camera main body (not shown) via the circuit board 1020 shown in FIG. 11. The circuit board 1020 is positioned by a restricting pin 1130b and fixed to the lens holding frame 1010.
As shown in FIG. 11, the circuit board 1020 includes a holding-frame-side fixing portion 1212 and a main-body-side fixing portion 1213 that are connected with each other via a lead-out portion 1211. At the base of the lead-out portion 1211, restricting holes 1230a and 1230b are provided. The circuit board 1020 is a substrate containing a flexible material such as polyimide.
As shown in FIG. 12, in order to fix the circuit board 1020 to the lens holding frame 1010 and the camera main body (not shown), the holding-frame-side fixing portion 1212 and the main-body-side fixing portion 1213 are fixed to the lens holding frame 1010 and the camera main body (not shown), respectively, and restricting pins 1130a and 1130b are inserted into the restricting holes 1230a and 1230b, respectively. When the restricting pins 1130a and 1130b are inserted into the restricting holes 1230a and 1230b in this manner, the lead-out portion 1211 can be fixed reliably to the lens holding frame 1010.
However, in order to fix the lead-out portion 1211 to the lens holding frame 1010, it is necessary to insert the restricting pins 1130a and 1130b into the restricting holes 1230a and 1230b. This operation is difficult since the restricting holes 1230a and 1230b are small in size, resulting in low efficiency in manufacturing a camera.
Further, a conventional camera has a problem that flare is caused by a light beam reflected by the lead-out portion 1211. Patent document 1: JP 2002-229090 A (in particular, FIG. 1)

Matsushita Electric Industrial Co., Ltd.


A terminal-provided wire (10) includes a wire (13) with a core (11) whose end is exposed, and a terminal (20) crimped to the end of the core (11) and connectable to a mating side. The terminal (20) includes a front terminal portion (21) and a rear terminal portion (22). The rear terminal portion (22) includes a bottom plate portion (26) on which the core (11) is to be placed, a pair of wire barrel portions (27) extending from the bottom plate portion (26) and to be crimped to the core (11), an easily breakable portion (28) extending in an axial direction from the bottom plate portion (26) and to be broken at the time of disassembling, and a fixing portion (29) extending in the axial direction from the easily breakable portion (28). The front terminal portion (21) includes an auxiliary crimping portion (25) to be placed on the bottom plate portion (26) in such a manner as to be sandwiched between the bottom plate portion (26) and the core (22) and to be crimped to the core (22) together with the wire barrel portions (27) to partly highly compress the core (22), a fixing portion (24) to be fixed to the fixing portion (29) and a connecting portion (23) extending in the axial direction from the fixing portion (24).

1. Field of the Invention
The present invention relates to a terminal and a terminal-provided wire.
2. Description of the Related Art
Conventionally, there is known a terminal-provided wire in which a terminal is mounted on an end of an exposed core of a wire. This terminal includes a barrel in the form of a plate piece, and the terminal and the core are electrically connected by crimping (caulking) this barrel in such a manner as to be wind around the core.
An oxide film may be formed on a part of a core surface on which the terminal is to be crimped. This oxide film is a cause of increasing electric resistance between the core and the terminal and electric resistance among strands constituting the core. Thus, as described in Japanese Unexamined Patent Publication No. 2010-62097, the barrel is wound around the core with a high pressure in mounting the terminal on the core, thereby crushing and destroying the oxide film. If the oxide film is destroyed, a new core surface (new surface), which is not oxidized, appears from below. This new surface is utilized such as for electrical connection between the core and the terminal, thereby reducing the electric resistance described above.
Note that if the barrel is wound around the core with a high pressure to form a new surface, the core is highly compressed to become narrower. Thus, there is a possibility of core breakage (strand breakage) in that part. Particularly, if the core (strands) is made of aluminum, the core needs to be more compressed as compared with the case of a core made of copper to form a new surface by destroying an oxide film. Thus, the problem of core breakage (strand break) is more serious. Thus, as described in Japanese Unexamined Patent Publication No. 2010-62097, only a part of the barrel to be arranged on a tip side of the core is wound around the core with a high pressure to ensure high electrical connection (low electric resistance). A part of the barrel located behind this part is wound around the core with a lower pressure than at the tip side to ensure mechanical strength (particularly, tensile strength) of the terminal-provided wire while suppressing the core breakage and the like. A tip side of the barrel has a part (part where an extending piece is folded) thicker than a part behind it, and that part is raised toward an inner side (core side). If the core is fastened by the tip part of the barrel including this raised part, the core is highly compressed and the thickness (core diameter) thereof is reduced. Contrary to this, if the core is fastened by the rear part of the barrel having a small thickness, the core is compressed with a low pressure. Thus, the thickness (core diameter) thereof is not reduced as much as at the tip side and the strength of the core is ensured.
A terminal to be connected to an end of a core of a ground wire (hereinafter, ground terminal) is known as described in Japanese Unexamined Patent Publication No. 2003-178822. The ground terminal of this type is used by being firmly mounted at a predetermined position of a vehicle body utilizing a fixing member such as a bolt in a state crimped to an end of a ground wire.
Note that it is also described in Japanese Unexamined Patent Publication No. 2003-178822 that ground wires including such ground terminals are collected from discarded vehicles for a recycling (reutilization) purpose. A ground terminal is pulled in a state hooked to a J-shaped hook attached to a lifting apparatus such as a crane at the time of disassembling a discarded vehicle. At that time, the ground terminal is kept mounted on a vehicle body by a fixing member. When a force is applied to the ground terminal, the ground terminal is broken (cut) and the ground wire is removed from the vehicle side. Because of such a situation and the like, the ground terminal is required to have a configuration easily destroyable at the time of disassembling (easy disassemblability, disassembling easiness).
Conventionally, a terminal-provided wire has not been provided which is excellent in electrical connection performance between a terminal and a wire (core) and easy disassemblability.
The present invention was completed in view of the above situation and aims to provide a terminal-provided wire which has good electrical connection performance between a terminal and a wire (core) and is easily breakable at the time of disassembling and a terminal utilized therefor.


A clamshell device for printers is disclosed. This clamshell device has a main body including a paper roll seat opening used for installing a paper roll therein, with an inclined guide surface formed at the upper edge of each sideall defining the paper roll seat opening. A roller frame is hinged to the main body, and is used for selectively closing the paper roll seat opening. This roller frame has a rubber roller coming into compression contact with a holding roller of the main body so as to compress paper passing through the nip of the two rollers. A locking post is movably set within two longitudinal slits of the roller frame at opposite ends thereof, and is movable along the guide surfaces of the main body while being changed in its position within the longitudinal slits during a rotation of the roller frame relative to the main body.

1. Field of the Invention
The present invention relates to a device used in printers for compressing paper using clamshell-type during a printing process and, more particularly, to a clamshell device for printers having a simple construction and accomplishing the recent trend of compactness, lightness, smallness and thinness of its parts, thus being preferably usable in compact printers, the clamshell device being also designed to improve work efficiency during its fabrication and effectively produced through mass production.
2. Description of the Prior Art
FIG. 1 is a view showing a conventional clamshell device for printers. As shown in the drawing, the conventional clamshell device comprises a cover 11, which is hinged to a main body (not shown) at one end thereof so as to be openable. A rubber roller 14 mounted to the roller frame 12, which is hinged to the cover 11, rotate itself and compresses the paper to be fed to a printer head while maintaining desired tension of the paper during a printing process. A sliding frame 13 hinged to the main body use the elastic force of spring 13xe2x80x2, which is normally connected to the main body, so as to support the roller frame 12. A locking member 16 is hinged to the end of the cover 11, and is selectively caught by a stopper 17 of the main body, thus limiting a rotation of the cover 11. A holding roller 15 is mounted to the main body and comes into close contact with the rubber roller 14 so as to support the paper, which is moving into the printer head (not shown) during a printing process of the printer.
In the conventional clamshell device, the rubber roller 14 and the holding roller 15 are completely contact each other during a printing process, thus give a compressing force to the paper passing through the nip between the two rollers.
When the cover 11 is rotated in a cover closing direction as shown by the arrow in FIG. 1, the roller frame 12 hinged to the cover 11 is also rotated in the same direction. The rubber roller 14, mounted to the end of the roller frame 12, is brought into compression contact with the holding roller 15 of the main body, thus compressing the paper fed to the printer head of the printer. Therefore, the paper is fed to the printer head under sufficient tension during a printing process.
In order to maintain the closed position of the cover 11, it is necessary for the stopper 17 to stably catch the locking member 16 provided at the end of the cover 11. When the stopper 17 fails to catch the locking member 16 during such a cover closing action, the roller frame 12 is undesirably rotated clockwise since the spring 13xe2x80x2 normally applies the clockwise moment to the sliding frame 13. In such a case, it is almost impossible to maintain the compression contact of the rubber roller 14 with the holding roller 15. When the rubber roller 14 fails to come into compression contact with the holding roller 15 as described above, the two rollers 14 and 15 cannot compress the paper and fail to smoothly feed the paper to the printer head of the printer.
This means that the compression force, applied to the paper during an operation of the clamshell device for printers, is accomplished by the engagement of the locking member 16 of the cover 11 with the stopper 17 of the main body. In addition, the spring 13xe2x80x2 applies elastic force to the sliding frame 13 so as to damp any impact generated in the clamshell device during a cover opening or closing action.
However, the conventional clamshell device for printers is problematic in that for making complete compression contact between the rubber roller and the holding roller, it is necessary a locking structure additionally. Other problems of the conventional clamshell device reside in that the device does not have any automatic tilting means, and that it has a complex construction, in addition to an excessive number of parts. Furthermore, the parts of the conventional clamshell device for printers are large in size, and so the conventional clamshell device cannot be usable in compact and small-sized printers.
The object of the present invention is to provide a clamshell device for printers, which has a simple construction and accomplishes the recent trend of compactness, lightness, smallness and thinness of its parts, thus improving work efficiency during assemblage and being easily produced in commercial quantities.
In order to accomplish the above object, the present invention provides a clamshell device for printers, comprising: a main body including a paper roll seat opening used for installing a paper roll therein, with a guide surface, which is formed at the upper edge of each sidewall, inclined at an angle of inclination; a roller frame hinged to the main body and closing the paper roll seat opening, the roller frame having a holding roller coming into compression contact with a rubber roller of the main body so as to give compression force to paper passing through the nip of the rubber and holding rollers; a locking post movably set within two longitudinal slits of the roller frame at its side wall, said locking post being movable along the guide surfaces of the main body while being changed in its position within the longitudinal slits during an either directional rotation of the roller frame relative to the main body; and a spring held on the roller frame at one end thereof and on the main body at the other end thereof, and normally applying elastic force to the roller frame.
In this invention, a stopper is formed on the main body for preventing an excessive rotation of the roller frame.
In addition, the guide surfaces has a shoulder profile capable of stably holding the locking post in cooperation with the elastic force of the spring at a time the holding roller of the roller frame comes into compression contact with the rubber roller of the main body.
In the preferred embodiment of this invention, the spring is held by the locking post of the roller frame at one end thereof and by a spring holding shaft at the other end thereof, the spring holding shaft being provided around the bottom of the paper roll seat opening.


Provided are a method for preparing an electrode system, an electrode system prepared therefrom, and an electric device including the same. The method includes the steps of forming a porous template having nanopores on a first electrode, wherein a diameter of the nanopores is between 5 to nm 500 nm; and forming a rod-type/tube-type second electrode inside the nanopores which are connected to the first electrode, the electrode system prepared therefrom, and an electric device including the same. With the large surface area, the electrode system of the present research improves efficiency and performance of various electric devices. The contrast and respond speed of the electrochromic device can be increased, and the number of electron-hole pairs of a solar cell is increased. The loss of electron-hole pairs is minimized, and charge storage of the supercapacitor and charge respond speed is heightened.

(a) Field of the Invention
The present invention is related to a method for preparing an electrode system, an electrode system prepared therefrom, and an electric device comprising the same; and more particularly, to a method for preparing an electrode system by using a porous template, that can enlarge a surface area of an electrode system used in an electric device to improve efficiency and performance of the electric device by improving a response speed of the electric device, accelerate transfer of electron-hole pairs and enlarge a storage space of an electric charge.
(b) Description of the Related Art
An electrode system having a large surface area is favorable for preparing an electric device using reactions that occur on the surface of the electrode system more effectively, compared with a conventional flat electrode system. For example, an electrochromic device having an electrode system with a large surface area is sufficiently colored compared with another electrochromic device having an electrode system with a small surface area, although both electrochromic devices are prepared with the same amount of electrochromic material. It is also known that the response time of the electrochromic device can be increase remarkably because of the large surface area of the electrode system included in the electrochromic device (D. Cummins et. Al., J. Phys. Chem. B, 104, 11449(2000)). In case of a solar cell, the efficiency of the solar cell depends on the effective separation of electron-hole pairs generated on an interface of an electrode and the transfer of the separated electron-hole pair to an anode and a cathode of the electrode. Herein, the large surface area of the electrode can help to increase the number of the electron-hole pairs generated on the interface and also helps to transfer the separated electron-hole pair without much loss. Conventionally, a method for fabricating an electrode by using a nano-sized particle of a metal oxide at a high temperature is introduced and developed to enlarge the surface area of the electrode system (M. Gratzel, Nature, 414, 338 (2001)). However, the above-mentioned conventional method for fabricating the electrode system has problems in that the electrode materials are limited and that the processing temperature is high.

Method for preparing electrode system, electrode system prepared therefrom, and electric device comprising the same


A light reflecting material having a reflecting layer comprising barium sulfate, titanium dioxide and a binder resin. When the light reflecting material of the present invention is used as a reflector of a lighting panel of edge light type, it efficiently causes light to enter into a light conducting plate and hence high brightness of the lighting panel can be obtained. High brightness is also obtained when it is used as a light reflecting material of backlight systems and illumination signboards.

1. Field of the Invention
The present invention relates to a light reflecting material for reflectors or reflection plate materials used for back light systems of various visual display units such as liquid crystal displays, illumination signboards, lighting equipment and the like.
In particular, the present invention relates to a light reflecting material of high reflectance useful as a reflector of so-called edge light type lighting panels, which comprise a light conducting plate and a light source arranged facing at least one side edge of the light conducting plate with the reflector being provided around the light source so as to surround the light source and efficiently cause light from the light source to enter the light conducting plate, or as a light reflecting material efficiently reflecting light from the light conducting plate to a liquid crystal panel.
2. Related Art
As conventional light reflecting materials, there can be mentioned aluminum plates such as those described in Japanese Unexamined Application Publication No. Sho 62-286019, metallic reflection plates such as those described in Japanese Utility Model Unexamined Application Publication No. Hei 4-22755, aluminum plates painted white such as those described in Japanese Unexamined Application Publication No. Sho 63-2002, films painted white such as those described in Japanese Unexamined Application Publication No. Hei 6-67174, foamed white films such as those described in Japanese Unexamined Application Publication No. Hei 3-256090 and the like.
In particular, backlights of the edge light type now in wide use often use silver deposited films of high reflectance as a reflector to obtain high brightness in lighting panels.
As a light source for backlights of the edge light type, tubular lamps including hot-cathode tubes and cold-cathode tubes are generally used. However, problems may arise when a silver deposited film is used as the reflector of these lamps. For example, oscillation of the light source and lighting failure may occur because conductive silver is present very close to the light source. Furthermore, silver deposited films are very expensive.
On the other hand, lighting failure could be obviated by using a foamed white film for the reflector. As disclosed in Japanese Unexamined Application Publication No. Hei 3-256090, however, the flexibility required for good handling during wrapping about the light source can be ensured only up to a maximum thickness of about 75 .mu.m when the foamed white film is a foamed white polyester film.
However, if such a thin foamed white film is used as the reflector, it may disadvantageously leak light from the light source to the outside and hence lower the brightness of the lighting panel.
In the case of aluminum plates and films painted white, good hiding property can be obtained if titanium dioxide is used as a white pigment. However, titanium dioxide absorbs light of 450 nm and shorter wavelengths and the light reflectance is therefore disadvantageously suppressed below a certain level.
Further, if barium sulfate is used as a white pigment, the layer containing the barium sulfate must have a large thickness or contain a large amount of added barium sulfate to obtain high reflectance because barium sulfate has low hiding power. If the thickness of the layer containing barium sulfate is increased to obtain sufficient hiding power, it becomes difficult to wrap the film around the lamp and hence the efficiency of the operation is degraded. If thickness of the layer is made smaller to obtain sufficient flexibility, the quantity of barium sulfate added has to be increased beyond the critical pigment concentration in order to obtain sufficient hiding power and the coated layer is therefore liable to suffer cohesive failure.
The object of the present invention is to solve the problems of the conventional materials mentioned above, i.e., to provide a light reflecting material which is free from the problems of oscillation of light source, lighting failure and the like, exhibits high reflectance, and has sufficient flexibility enabling easy wrapping around a light source.


There is disclosed a nonvolatile semiconductor memory device, which is capable of maintaining a high capacitance ratio even when a memory cell is formed in a micronized size without increasing the number of manufacturing steps. In a flash memory having buried diffusion layer type cells, a source region and drain regions and are formed in self alignment with a polycrystalline film pattern which has a polycrystalline silicon film having projecting and recessing parts in its upper surface.

1. Field of the Invention
The present invention relates to a nonvolatile semiconductor memory device and a manufacturing method of the same, and more particularly to a stacked type flash memory and a manufacturing method of the same.
2. Description of the Related Art
Conventionally, among nonvolatile semiconductor memory devices capable of performing electrical rewriting, flash memories which have functions for electrically erasing a plurality of memory cells in a required region in a flush have been available. Among these flash memories, there is one, which is composed of stacked gate type memory cells.
FIG. 1 is a typical plan view showing one construction example of a conventional flash memory composed of stacked gate type memory cells. FIG. 2(a) is a section view taken along the line X-X' of the flash memory shown in FIG. 1, and FIG. 2(b) is a section view taken along the line Y-Y' of the flash memory shown in FIG. 1.
Referring to FIGS. 1 and 2(a), on the surface of a P type silicon substrate 201, there are provided a field oxide 202 in an element isolation region and stacked gate type memory cells in an element formation region. Each of the memory cells is composed of a gate oxide film 210 provided on the surface of the P type silicon substrate 201, a floating gate electrode 215 formed of an N type polycrystalline silicon film, which is provided on the surface of the P type silicon substrate 201 via the gate oxide film 210, a gate insulating film 213 formed by stacking a silicon oxide film, a silicon nitride film and a silicon oxide film, which is provided on the surface of the floating gate electrode 215, a control gate electrode 216 formed of an N+ type polycrystalline silicon film as a word line, which is formed on the floating gate electrode 215 via the gate insulting film 213, and a source region 208 and drain regions 207a and 207b formed on the surface of the P type silicon substrate 201. Each floating gate electrode 215 belongs to each memory cell.
The source region 208 and the drain regions 207a and 207b are formed of N+ type diffusion layers, each of which is formed in self alignment with, for instance, a nitride film pattern 205. The drain regions 207a and 207b are connected to bit lines 219a and 219b formed on the surface of an interlayer insulating film 217 through contact holes 218, which are provided at each interval of 16 memory cells in the interlayer insulating film 217 covering the memory cells. The source region 208 is shared by a required number of memory cells, and as in the case of the drain regions 207a and 207b, each source region 208 is connected through the contact hole 218 to a source line 220, which is formed on the surface of the interlayer insulating film 217.
In the flash memory of this type constituted as above, N+ type diffusion layers are used as sub-bit and sub-source lines. Instead of one contact hole provided for one memory cell, drain and source regions composed of the N+ type diffusion layers are shared. For a plurality of memory cells, one contact hole exists in the drain region and one in the source region. The existence of one contact hole for the plurality of memory cells makes it possible to reduce the areas of the memory cells and is thus effective for the reduction of a chip size. The memory cell construction described above is referred to as a buried diffusion layer type flash memory, hereinafter.
Data writing and erasing operations for the above-noted buried diffusion layer type flash memory are summarized as follows with a voltage applied to the drain regions 207a and 207b, a voltage applied to the source region 208, a voltage applied to the control gate electrode 216 and a voltage applied to the P type silicon substrate 201 respectively set to V.sub.DD, V.sub.SS, V.sub.CG and V.sub.SUB.
Memory cell writing implies pulling out of electrons injected into the floating gate electrode 215 therefrom. For example, writing is performed by respectively applying V.sub.CG =-9V to the control gate electrode 216 which belongs to a memory cell targeted for writing, V.sub.DD =5V to the drain regions 207a and 207b and V.sub.SUB =0V to the P type silicon substrate 201 and opening the source region 208. During this period, in the control gate electrode 216 selected for writing and the memory cell which belongs to the drain region 207, an electric field applied to the gate oxide film 210 is higher than those of the other memory cells. Consequently, a Fowler-Noldheim current (referred to as a FN current, hereinafter) based on a quantum tunnel effect flows, and thus electrons are pulled out of the floating gate electrode 215 of this memory cell. A threshold voltage of the memory cell is shifted in a negative direction and reduced from about 5V to about 2V.
Erasing of the memory cell is performed by injecting electrons into the floating gate electrode 215. Erasing in the flash memory is performed for each memory array. For example, erasing is performed by respectively applying V.sub.CG =16V to the control gate electrode 216, V.sub.DD =0V to the drain region 207, V.sub.SUB =0V to the P type silicon substrate 201 and V.sub.SS =0V to the source region 208. Thus, a high electric field is applied to each gate oxide film 210 of all the memory cells which belong to the control gate electrode 216. Consequently, an FN current based on the quantum tunnel effect flows as in the case of writing and accordingly electrons are injected into the floating gate electrode 215 of this memory cell. A threshold voltage of the memory cell is shifted in a positive direction and increased from about 2V to about 5V.
A manufacturing method of the flash memory constructed in the above-noted manner will be described below.
FIGS. 3 to 13 are typical plan views each illustrating a manufacturing method of the flash memory shown in FIG. 2.
First, a field oxide 202 is formed in the element isolation region of the surface of the P type silicon substrate 201. Subsequently, a first oxide film 203 having a thickness of 4 nm is formed and then a nitride film 204 having a thickness of about 300 nm is grown on the full surface (FIG. 3).
Then, the nitride film 204 is patterned in a striped form and a nitride film pattern 205 is formed. Thereafter, by using the nitride film pattern 205 as a mask, arsenic ions of 5E15 cm-2 are implanted at 70 KeV approximately in parallel with a normal on the surface of the P type silicon substrate 201, and an arsenic ion implanted layer 206 is formed in the P type silicon substrate 201 (FIG. 4).
Then, the arsenic ion implanted layer is subjected to a heat treatment in a nitrogen atmosphere of 850.degree. C. for 30 minutes. By this heat treatment, the arsenic ion implanted layer 206 is activated and drain regions 207a and 207b and a source region 208 composed of N+ diffusion layers are formed (FIG. 5).
Then, by performing thermal oxidation at a temperature of 850.degree. C., second oxide films 209a, 209b and 209c each having a thickness of about 100 nm are formed on the drain regions 207a and 207b and the source region 208 (FIG. 6).
Then, the nitride film pattern 205 and the first oxide film 203 are removed in sequence by etching, and a portion of the surface of the P type silicon substrate 201 is exposed (FIG. 7).
Then, a gate oxide film 210 having a thickness of about 8 nm is formed in the element formation region of the surface of the P type silicon substrate 201 by thermal oxidation, and thereafter a first N type polycrystalline silicon film 211 is formed on the entire surface (FIG. 8).
Then, the first polycrystalline silicon film 211 is patterned on a stripe-like polycrystalline silicon film 212 so as to be in parallel with the bit line (FIG. 9).
Then, a gate insulating film 213 is formed on the entire surface (FIG. 10).
Then, a second N+ type polycrystalline silicon film 214 is formed on the entire surface (FIG. 11).
Then, the second polycrystalline silicon film 214, the gate insulating film 213 and the polycrystalline silicon film pattern 212 are sequentially patterned, and thereby a control gate electrode 216 composed of the second polycrystalline silicon film 214 and a floating gate electrode 215 composed of the polycrystalline silicon film pattern 212 are formed. Subsequently, by thermal oxidation, silicon oxide films (not shown) each having a thickness of 10 to 20 nm are formed in the exposed surfaces of the control gate electrode 216 and the floating gate electrode 215 and the surface of the P type silicon substrate 201 (FIG. 12).
Then, an interlayer insulating film 217 formed of a BPSG film having a thickness of about 0.8 .mu.m is formed on the entire surface, and subsequently a contact hole 218, and so on, reaching the drain regions 207a and 207b and the source region 208 are formed. An area of the bit contact hole 218 is 0.4 .mu.m.sup.2. Thereafter, an aluminum metallic film having a thickness of about 0.45 .mu.m is formed on the entire surface. By patterning this metallic film, bit lines 219a, 219b, a source line 220, and so on, are formed (FIG. 13).
However, in the conventional flash memory described above, because the drain regions and the source region cannot be formed in self alignment with the polycrystalline films, its manufacturing process becomes long and micro fabrication of memory cells is difficult.
In the conventional manufacturing method described above, first, the drain regions and the source region were formed in self alignment with the nitride film pattern, and then when the width of the nitride film pattern was set to, for instance 0.4 .mu.m, the capacitance ratio of the memory cell was set to, for instance about 0.7 by greatly increasing the width of the polycrystalline silicon film pattern to, for instance 1.45 .mu.m.
The capacitance ratio of the memory cell will be described below.
The memory cell capacitance ratio is an important parameter for the operations of the memory cell, which includes writing, erasing and reading operations. The capacitance ratio is defined by the following formula. EQU Vfg=.alpha.(Vcg-.DELTA.Vth) EQU .alpha.=Cfg/Ct
Herein,
Vfg: Potential of floating gate electrode PA1 Vcg: potential of control gate electrode PA1 .alpha.: Capacitance ratio PA1 .DELTA.Vth: Shifting amount of memory cell threshold voltage PA1 Cfg: Capacitance between floating gate electrode and control gate electrode PA1 Ct: Capacitance of all around floating gate electrode PA1 From the above-noted formula, it should be understood that when a certain voltage is applied to the control gate, a voltage applied between the floating gate electrode and the P type silicon substrate is a value obtained by multiplying the voltage applied to the control gate electrode by a capacitance ratio. PA1 a floating gate electrode provided on the surface of a semiconductor substrate through a gate oxide film; PA1 a control gate electrode provided on the surface of the floating gate electrode interposing a gate insulating film and functions also as a word line; PA1 a drain region provided on the surface of the semiconductor substrate, the drain region being connected to a bit line composed of an N+ type diffusion layer orthogonally crossing the word line; and PA1 a source region provided on the surface of the semiconductor substrate, the source region being connected to a source line composed of an N+ type diffusion layer orthogonally crossing the word line. PA1 forming an N type polycrystalline silicon film of a predetermined impurity concentration on the entire surface of the semiconductor substrate, the N type polycrystalline silicon film having projecting and recessing parts in an upper surface thereof; forming a gate insulating film on the entire surface of the semiconductor substrate; PA1 forming a predetermined polycrystalline silicon film pattern by sequentially patterning the gate insulating film and the polycrystalline silicon film using a first photoresist film pattern as a mask; PA1 forming an arsenic ion implanted layer by implanting arsenic ions in parallel with a normal to the surface of the semiconductor substrate with the first photoresist film pattern used as a mask; PA1 forming drain and source regions composed of N+ type diffusion layers on a surface of the semiconductor substrate by removing the first photoresist film pattern and performing a heat treatment at a specified temperature so as to activate the arsenic ion implanted layer; PA1 forming oxide films on the drain and source regions in the surface of the semiconductor substrate by thermal oxidation; PA1 forming a control gate electrode composed of a conductive film and a floating gate electrode composed of the polycrystalline silicon film pattern by forming a conductive film on the entire surface of the semiconductor substrate and sequentially patterning the conductive film, the gate insulating film and the polycrystalline silicon film pattern; and PA1 forming an interlayer insulating film on the entire surface of the semiconductor substrate, a contact hole reaching the N+ type diffusion layer in the interlayer insulating film and bit and source lines respectively connected to the drain and source regions interposing the contact hole on the surface of the interlayer insulating film. PA1 a floating gate electrode provided on a surface of a semiconductor substrate through a gate oxide film; PA1 a control gate electrode provided on a surface of the floating gate electrode through a gate insulating film, the control gate serving also as a word line; PA1 a drain region provided on the surface of the semiconductor substrate, the drain region being connected to a bit line composed of an N+ type diffusion layer orthogonally crossing the word line; PA1 a source region provided on the surface of the semiconductor substrate, the source region being connected to a source line composed of an N+ type diffusion layer orthogonally crossing the word line; and PA1 a side wall oxide film formed on a side face of the floating gate electrode and above the drain and source regions. PA1 In the semiconductor memory device having the above-described constitution, the floating gate electrode has projecting and recessing parts in an upper surface thereof. PA1 The semiconductor substrate is a P type silicon substrate. PA1 forming a gate oxide film in an element formation region of a semiconductor substrate surface by thermal oxidation; PA1 forming an N type polycrystalline silicon film of a predetermined impurity concentration on the entire surface of semiconductor substrate, the N type polycrystalline silicon film having projecting and recessing parts in an upper surface thereof; PA1 forming a predetermined polycrystalline silicon film pattern by patterning the polycrystalline film with a first photoresist film pattern; PA1 forming an arsenic ion implanted layer by implanting arsenic ions in parallel with a normal to the surface of the semiconductor substrate using the first photoresist film pattern as a mask; PA1 forming drain and source regions composed of N+ type diffusion layers on the surface of the semiconductor substrate by removing the first photoresist film pattern and performing a heat treatment at a specified temperature so as to activate the arsenic ion implanted layer; PA1 forming a side wall oxide film on a side face of the polycrystalline silicon film pattern by depositing an oxide film on the entire surface of the semiconductor substrate and performing anisotropic etching; PA1 forming oxide films on the drain and source regions of the semiconductor substrate surface by thermal oxidation; PA1 forming a control gate electrode composed of a conductive film and a floating gate electrode composed of the polycrystalline silicon film pattern by forming the conductive film on the entire surface of the semiconductor substrate and sequentially patterning the conductive film, the gate insulating film and the polycrystalline silicon film pattern; and PA1 forming an interlayer insulating film on the entire surface of the semiconductor substrate, a contact hole reaching the N+ type diffusion layer in the interlayer insulating film and bit and source lines respectively connected to the drain and source regions through the contact hole on the surface of the interlayer insulating film. PA1 forming a gate oxide film in an element formation region of a semiconductor substrate surface by thermal oxidation; PA1 forming an N type polycrystalline silicon film of a predetermined impurity concentration on the entire surface of the silicon substrate, the N type polycrystalline silicon film having projecting and recessing parts in an upper surface thereof; PA1 forming a specified polycrystalline silicon film pattern by patterning the polycrystalline silicon film with a first photoresist film pattern; PA1 forming a second photoresist film pattern covering at least a region planned for source formation, the second photoresist film pattern having an opening part in a region planned for drain formation; PA1 forming a second arsenic ion implanted layer in the semiconductor substrate by implanting arsenic ions of a quantity to form a first high impurity concentration region by first implanting energy in parallel with a normal to the surface of the semiconductor substrate using the second photoresist film pattern as a mask; PA1 forming a drain region composed of a first N+ type diffusion layer on the surface of the semiconductor substrate by removing the second photoresist film pattern and performing a first heat treatment at a specified temperature so as to activate the second arsenic ion implanted layer; PA1 forming a side wall oxide film on the side face of the polycrystalline silicon film pattern by depositing an oxide film on the entire surface of the semiconductor substrate and performing anisotropic etching; PA1 forming a third photoresist film pattern covering at least a region planned for drain formation, the third photoresist film pattern having an opening in a region planned for source formation; forming a third arsenic ion implanted layer in the semiconductor substrate by implanting arsenic ions of a quantity to form a second high impurity concentration region by second implanting energy in parallel with a normal to the surface of the semiconductor substrate using the third photoresist film pattern as a mask; PA1 forming a source region composed of a second N+ type diffusion layer on the surface of the semiconductor substrate by forming an oxide film on the surface of the semiconductor substrate by a thermal oxidizing method; PA1 eliminating the third photoresist film pattern and activating the third arsenic ion implanted layer; PA1 forming a control gate electrode composed of a conductive film and a floating gate electrode composed of the polycrystalline silicon film pattern by sequentially forming a gate insulating film and the conductive film on the entire surface of the semiconductor substrate and patterning the conductive film, the gate insulating film and the polycrystalline silicon film pattern; and PA1 forming a interlayer insulating film on the entire surface of the semiconductor substrate, a contact hole reaching the N+ type diffusion layer in the interlayer insulating film and the bit and source lines respectively connected to the drain and source regions through the contact hole on the surface of the interlayer insulating film.
For writing and erasing operations in the conventional memory cell described above, an FN tunneling phenomenon is utilized. By this method, compared with, for instance a channel hot electron injecting method, the consumption of currents during writing and erasing can be reduced more. Accordingly, the method is suited for reducing of a power supply voltage, which has been demanded of the flash memory in recent years.
However, in order to perform writing and erasing by using the FN tunneling phenomenon, it is necessary to apply a high electric field to the gate oxide film. In other words, if a capacitance ratio is taken into consideration, a higher voltage must be applied to the control gate electrode. Here, in order to generate a high voltage inside a chip, a dedicated circuit is necessary, and thus as a voltage is higher, an area occupied by the circuit in the chip is larger. In order to reduce the chip area, a voltage applied to the control gate electrode must be reduced as much as possible. Accordingly, it is necessary to set the capacitance ratio of the memory cell to a high level and increase an electric field applied to the gate oxide film when an FN tunneling phenomenon occurs.

Nonvolatile semiconductor memory device and manufacturing method of the same


A combination lighter and optical pointer assembly is provided. The assembly generally comprises a body, a lighter unit, and an optical pointer unit. The body has formed therein first and second compartments, the lighter unit being received in the first compartment, and the optical pointer unit being received in the second compartment. The optical pointer unit includes a laser device that is powered by a battery disposed in the second compartment. The assembly thereby provides fully functional and independently operable lighter and optical pointer functions.

1. Field of the Invention
The present invention relates to a lighter unit combined with the function of an indicating unit, and in particular, to a device combining both functional units.
2. Background of the Invention
Conventional lighters provide only a flame generating function. Its utility is thus limited to that sole function. However, laser indicators, or pointers, have found wide use in presentations. A presenter typically indicates an object on a presentation surface by emitting a laser beam. Prior art pointers are enclosed within dedicated shells, but such dedicated shells increase costs. Also, prior art laser pointers packaged in such dedicated shells tend to be small in volume. Often, a user cannot easily find a misplaced pointer.

Lighter having the function of indicating

No. 305, Hua Cheng Rd., Hsin Chuang City


This invention is directed to plant genetic engineering. In particular, it relates to, for example, modulating seed (and in particular endosperm, embryo and seed coat) development, flowering time, chromosomal DNA methylation and modulating transcription in plants.

A fundamental problem in biology is to understand how seed development. In flowering plants, the ovule generates the female gametophyte, which is composed of egg, central, synergid and antipodal cells (Reiser, et al., Plant Cell, 1291-1301 (1993)). All are haploid except the central cell which contains two daughter nuclei that fuse prior to fertilization. One sperm nucleus fertilizes the egg to form the zygote, whereas another sperm nucleus fuses with the diploid central cell nucleus to form the triploid endosperm nucleus (van Went, et al., Embryology of Angiosperms, pp. 273-318 (1984)). The two fertilization products undergo distinct patterns of development. In Arabidopsis, the embryo passes through a series of stages that have been defined morphologically as preglobular, globular, heart, cotyledon and maturation (Goldberg, R. B., et al., Science (1994) 266: 605-614; Mansfield, S. G., et al, Arabidopsis: An Atlas of Morphology and Development, pp. 367-383 (1994)). The primary endosperm nucleus undergoes a series of mitotic divisions to produce nuclei that migrate into the expanding central cell (Mansfield, S. G., et al., Arab Inf Serv 27: 53-64 (1990); Webb, M. C., et al., Planta 184:187-195 (1991)). Cytokinesis sequesters endosperm cytoplasm and nuclei into discrete cells (Mansfield, S. G., et al., Arab Inf Serv 27:65-72 (1990)) that produce storage proteins, starch, and lipids which support embryo growth (Lopes, M. A. et al., Plant Cell 5:1383-1399 (1993)). Fertilization also activates development of the integument cell layers of the ovule that become the seed coat, and induces the ovary to grow and form the fruit, or silique, in Arabidopsis.
Of particular interest are recent discoveries of genes that control seed, and in particular endosperm, development. For instance, MEDEA (MEA) (also known as FIEI (see, e.g., copending U.S. patent application Ser. No. 09/071,838) and F644 (see, e.g., Kiyosue T, et al. (1999) Proc Natl Acad Sci USA 96(7):4186-91) encodes an Arabidopsis SET domain polycomb protein that appears to play a role in endosperm development. Inheritance of a maternal loss-of-function mea allele results in embryo abortion and prolonged endosperm production, irrespective of the genotype of the paternal allele. Thus, only the maternal wild-type MEA allele is required for proper embryo, endosperm, and seed coat development (Kinoshita T, et al. (1999) Plant Cell 10:1945-52). These results reveal functions for plant polycomb proteins in the suppression of central cell proliferation and endosperm development (Kiyosue T, et al. supra).
Another gene product that controls seed development is FIE, also known as FIE3 (see, e.g., copending U.S. patent application Ser. No. 09/071,838). The FIE protein is a homolog of the WD motif-containing Polycomb proteins from Drosophila and mammals (Ohad, N. et al. Plant Cell 11(3):407-16 (1999)). In Drosophila, these proteins function as repressors of homeotic genes. Loss of function mutations in the FIE gene result in endosperm phenotypes that are identical to medea loss of function mutations. A female gametophyte with a loss-of-function allele of fie undergoes replication of the central cell nucleus and initiates endosperm development without fertilization. These results suggest that the FIE Polycomb protein functions to suppress a critical aspect of early plant reproduction, namely, endosperm development, until fertilization occurs. Moreover, hypomethylation of fie mutants leads to the development of differentiated endosperm. Vinkenoog et al., Plant Cell 12:2271-2282 (2000).
Control of the expression of genes that control egg and central cell differentiation, or those that control reproductive development, i.e. embryo, endosperm and seed coat, is useful in the production of plants with a range of desired traits. These and other advantages are provided by the present application.

Promoter for expression of a heterologous polynucleotide in a female gametophyte

The Regents of the University of California


The invention describes a method for production of a three-dimensional structured surface with haptically and/or optically detectable microstructures, in which the microstructures are fixed as a dataset, with the steps: a) preparation of at least a virtual or real elastic film; b) determination of the elongations and compressions produced in the elastic film in the shaping process of the structured surface; c) modification of the datasets so that the elongations and compressions are at least partially compensated; d) checking of an elastic film structured with the modified dataset for distortions in the microstructures; e) if necessary, repetition of steps b) to d), until a final dataset is obtained; and f) structuring of the elastic film, so that at least a structure-supporting surface is produced on the film.

1. Field of the Invention
The invention relates to a method for production of a three-dimensional structured surface with haptically and/or optically detectable microstructures, the microstructures being fixed as a dataset.
2. Background of the Invention
Means for providing three-dimensional surfaces with structures are known. Conventional means, however, often do not satisfy high quality requirements in terms of dimensional stability, distortions or deformations recognizable to a viewer. For example, methods that produce a three-dimensional surface on a three-dimensional structured surface by triangulation are known. However, grain structures, such as those that occur in cowhide, cannot be produced by such methods since they involve an organically grown large-surface grain with continuous branches. In more complex methods, distortions are corrected in a multistage process and corrections of the grain are also repeatedly performed empirically.

Method for production of a three-dimensional structured surface with haptically and/or optically detectable microstructures


A swivel hook assembly comprises a web-engaging member adapted for engaging a web and having a pivotal hole formed therein and a hook member including a hook body and a coupling member for pivotally joining the hook body with the web-engaging member. The coupling member comprises a pair of opposed guide studs, a pair of opposed resilient engaging studs mounted in a circles on one end of the hook body and a bridge block also mounted on said one end of the hook body, disposed between the engaging studs with spaces left therebetween and interconnected with the guide studs, each opposed engaging stud having an outward-projecting prong formed on the upper end, the guide studs being round in their respective outer peripheral surfaces and having the outer round peripheral surfaces run along an imaginary circle which is slightly less in diameter than the pivotal hole, the outward-projecting prongs of the engaging studs being forced through the pivotal hole against the resiliency of the engaging studs and snapped into engagement with the pivotal hole under the resiliency so that the hook member is pivotally mounted on the web-engaging member.

1. Field of the Invention
The present invention relates to a swivel hook assembly for joining webbing or the like to key rings, ropes or other various things.
2. Description of the Prior Art
Typical swivel hook assemblies of the type described are disclosed in Japanese Patent Publication No. 63-29124 and Japanese Utility Model Publication No. 62-27701. The conventional swivel hook assembly according to Japanese Patent Publication No. 63-29124 comprises a rectangular web-engaging frame having an engaging hole and a hook member including a hook body adapted for securing a ring or the like and a coupling member mounted at one end of the hook body for coupling the hook body to the engaging hole of the web-engaging frame. The coupling member comprises a pair of opposed resilient engaging studs mounted substantially in a circle on one end of the hook body. The engaging stud has an outward-projecting prongs on its upper end. The outward-projecting prongs of the engaging studs are slightly greater in diameter than the engaging hole of the web-engaging frame. The outward-projecting prongs of the opposed engaging studs are forced through the engaging hole while compressed against their own resiliency and come into snap-fit engagement with the engaging hole so that the hook member is pivotally mounted on the frame.
The conventional swivel hook assembly according to Japanese Utility Model Publication No. 62-27701 is substantially identical with the preceding one except that the coupling member comprises four (not two) opposed resilient engaging studs mounted in a circle one one end of the hook member. After the outward-projecting prongs of the opposed engaging studs are forced through the engaging hole and come into snap-fit engagement with the engaging hole, a wedging member is wedged into the space between the opposed resilient engaging studs so as to prevent them from being compressed and coming off the engaging hole and thus augment the engagement of the engaging studs with the engaging hole.
However, these conventional swivel hook assemblies suffer from some drawbacks.
In the first type of conventional swivel hook assemblies, the two engaging studs are so thick and resilient that, once engaged with the engaging hole, they are retained in the hole very firmly, but much power is needed to force the two engaging studs through the engaging hole. On the other hand, in the second type, the four engaging studs are so thin and less resilient that little power is needed to force the four engaging studs through the engage hole, but they are likely to come off the hole when the swivel hook assembly is subjected to severe use. For ensuring the engagement of the engaging stud with the hole, this would require use of an extra wedging member, leading to increase in manufacturing cost.
Another disadvantage is shared by both types. The engaging studs, whether two or four, jointly assume a mushroom-like shape as a whole, and each have the outward-projecting prong on its upper end. If the studs were formed thick, this would require the outward-projecting prong to become the larger correspondingly. But, this must be avoided because it would be very difficult if not impossible to force the bulky projecting prongs through the engaging hole. This forces the engaging studs to be formed much smaller diameter than the engaging hole. Consequently, the engaging studs of the hook member are very loosely fitted into the engaging hole, so that they are very likely to be subject to distortion during use of the swivel hook, thus getting eventually damaged.


This invention relates to a process for preparing a dimer by the steps of: (a) cyclodimerizing a polyisocyanate in the presence of a dimerization catalyst which is covalently bound to an insoluble inorganic matrix by contacting said polyisocyanate with said catalyst at a temperature of between about 20 and about 135.degree. C. in a reaction to form an uretidione-containing cyclodimerized isocyanate wherein a portion of the isocyanate moieties comprising said polyisocyanate are converted to uretidione groups, and (b) separating said catalyst from said cyclodimerized isocyanate in order to stop said reaction after a desired amount of isocyanate moieties in said polyisocyanate have been converted to uretidione moieties.

Polyuretidione adducts of polyisocyanates are intermediates which can be used in the preparation of high performance urethane coatings, paints, and films. These adducts provide reduced volatility and an associated reduced toxicity hazard during use, as compared to monomeric polyisocyanates, such as, for example, toluene diisocyanate. In addition, because of their low viscosity, isocyanato uretidiones can be used as reactive diluents for other highly viscous or solid isocyanate group containing coatings components or as a polyisocyanate component in solvent-free and low solvent coatings formulations.
Processes for preparing these adducts are well known. Examples illustrative of these processes can be found in U.S. Pat. Nos. 4,476,054; 4,912,210; and 4,929,724. Generally, the prior art processes involve adding a soluble catalyst which promotes the isocyanate to uretidione (also known as "dimerization") reaction of the precursor isocyanate, optionally in the presence, but usually in the absence, of a solvent, allowing the reaction to proceed to the desired extent and then stopping the reaction with a suitable quenching agent which destroys the activity of the catalyst. Alternatively, in the cases where relatively volatile catalysts are used, the reaction is stopped by distilling the catalyst along with the residual, unreacted precursor isocyanate from the product dimer.
After the residual, unreacted precursor isocyanate is removed, the resulting material, in the case where the precursor isocyanate is a diisocyanate, is a mixture of oligomers composed of 2, 3, 4, etc. precursor diisocyanate molecules joined by 1, 2, 3, etc. uretidione rings. Usually, this mixture is simply called dimer,.
In the case where the precursor isocyanate is polyisocyanate, the reaction is generally stopped well before all the isocyanate groups have been converted to uretidione groups because, otherwise, the resulting product would be an unusable polymer having a very high (theoretically infinite) molecular weight and viscosity. However, the cost of equipment and energy to remove residual, unreacted precursor isocyanate dictate that the reaction not be stopped too soon. Generally, the reaction is run to more than 10% conversion but less than 50% conversion. The preferred range is between 20 and 35%. The reaction is typically stopped using a quenching agent. The reaction between conventional dimerization catalysts and quenching agents typically results in the formation of an insoluble product which is typically removed by filtration using a filter aid.
Unfortunately, both the quenching agent and the filter aid increase the likelihood of introducing undesirable impurities into the product. Accordingly, new processes for producing dimers that do not employ a quenching agent and filter aid(s), and employ fewer process steps than prior art processes, would be highly desired by the dimer manufacturing community. Alternatively, in the cases where relatively volatile catalysts are used: the catalyst is contained in the recovered precursor isocyanate, making it unsuitable for any other use except recycle to the dimerization process; and, because the dimerization reaction is thermally reversible, especially in the presence of a catalyst, some of the product dimer is converted back to precursor isocyanate before the catalyst is removed at elevated temperatures. Accordingly, new processes for producing dimers that provide higher yields of product dimer, as well as catalyst-free recovered precursor isocyanate, would also be highly desired by the dimer manufacturing community.
An approach to meeting this need would be a catalyst that is bound to an insoluble substrate. Such systems are described in German Patent DE 4,026,705 wherein trialkyl phosphines are adsorbed onto matrices with specific surface characteristics. However, this technique suffers from two deficiencies. First, trialkyl phosphines promote the formation of isocyanurates in addition to uretidiones. This results in a higher viscosity product and also makes the product unsuitable for applications wherein cross linked, thermoset, films and elastomers are not desired. Secondly, the phosphine is not chemically bound to the substrate, therefore, some portion of the catalyst remains in solution after the substrate is filtered from the reaction mixture. Consequently, the addition of a catalyst inhibitor is still required before the unreacted isocyanate precursor is removed from the final product. Of course, this product is thereby contaminated with catalyst and inhibitor residues.
A more preferable approach is disclosed for a trimerization process in co-pending U.S. patent application 07/844,265, filed on Mar. 2, 1992 wherein the catalytic site is covalently bound to an insoluble organic polymer, and this process has also been used in dimer production. The described catalyst systems overcome the above cited limitations inasmuch as it is demonstrated that no catalytic residues remain in the product after the resin is removed. Therefore, no catalyst inhibitors need to be added to the product; and, the preferred catalytic site, derived from 4-aminopyridine, exclusively promotes the formation of uretidiones, thereby giving a more desirable product, free of isocyanurates. However, organic polymer substrates have some shortcomings. It is necessary to subject the as-produced resin to a rigorous pretreatment to remove low molecular weight oligomers that would otherwise contaminate the uretidione product. Even with such a pretreatment, moderate, but undesirable, levels of color are formed in the dimerization process. Most problematic is the accumulation uretidione oligomers within the resin during the dimerization reaction. This phenomenon of oligomer fouling continuously reduces the activity of the catalyst resin and thereby limits its single use lifetime. Further, the trapped oligomers can not be easily washed from the substrate. Thus, they represent an undesirable yield loss and necessitate the use of very rigorous conditions to regenerate the catalyst resin for reuse.
While, in principle, the aforementioned problems can be reduced through the use of more highly cross linked ("macroporous" or "macroreticular") polymers, they can not be eliminated as there is still some migration of the precursor isocyanate into the resin. Further, it is difficult to prepare such polymers with practical levels of catalytic sites available on the surface of the resin bead. Thus, a most preferred approach would be embodied in systems wherein the catalytic sites are covalently bound to the surface of an inorganic matrix. In principle, all of the above described problems arising from the dissolution of the precursor isocyanate into the catalytic substrate would be circumvented. Heretofore, such isocyanate dimerization catalyst systems have not been known to the knowledge of the present inventors.

Process for producing uretidione dimers of isocyanates using catalysts which are bound to inorganic matrices