A bracket for electrical outlet boxes that includes: a first end section, a middle section and a second end section, wherein each section has a substantially planar surface, a first side, a second side, a top surface and a bottom surface, wherein the middle section is offset from and substantially parallel to the first and second end sections; first and second offset portions connecting the middle section to the first and second end sections; first and second opposing ends extending upwardly and substantially perpendicular to the first and second end sections; a first tab and a second tab extending in opposing relation to each other from the first side of the first and second ends; a first leg and a second leg extending downwardly from the second side of the first and second end sections; and a bendable member extending from the first side of the middle section.

The use of electrical outlet boxes for housing electrical devices and connecting wires is well known in the art. In new construction, the boxes are typically attached to wall studs using screws or nails prior to placement of the wall on the studs. Conventional fasteners may be used in these situations to mount the boxes to the wall studs. In many cases, the outlet boxes include tabs or apertures for mounting the boxes. However, when electrical boxes are installed in existing walls, such as when renovating or remodeling, the wall studs are not always readily accessible or in the desired location to permit easy installation of the electrical boxes. These situations require the use of "cut-in" or "old work" electrical boxes, which do not have to be attached to a stud or support member.
"Cut-in" or "old work" boxes, are used where the boxes are inserted into an opening cut into the wall. The boxes are specifically constructed to include clamping hardware, which enables the box to be clamped to the wall about the opening without regard to the location of the wall studs. These cut-in or old work boxes have a variety of designs and many of them use a bracket or similar type of mounting hardware to secure the box to the wall.
"Cut-in" or "old work" boxes generally take two forms. The first includes boxes having swing-out clips. Examples of boxes of this type are shown in U.S. Pat. Nos. 4,332,330, 2,299,696, 2,272,846 and 1,957,844. The boxes shown in these patents include adjustable clips mounted on each box side wall. The clips are initially positioned inside the outer perimeter of the box so that the box may be inserted into an opening in the wall which is sized to specifically accommodate the box. After the clips pass through the opening, they may be swung outwardly to engage the back surface of the wall. These swing-out clips, however, are difficult to manipulate in the tight environment in which these boxes must be installed. Further, the box must include passageways or slots through the side wall of the box to enable the clip to swing out from an internal position to an external position once the box is inserted through the wall opening. As may be appreciated, boxes having swing-out clips of this type require extensive fabrication and/or modification of an existing box structure. Due to such extensive modification, many of these types of cut-in boxes are not listed by agencies such as Underwriters Laboratories (UL) and Canadian Standards Association (CSA).
Another type of cut-in box includes those boxes which have clips and screws mounted on the exterior surface of the side walls or the top and bottom walls of the box. Examples of boxes of this type are shown in U.S. Pat. Nos. 2,867,344, 2,801,019, 1,957,003 and 1,775,665. As the clips shown in these patents are mounted exteriorly of the box, they present a wide profile which requires a larger hole to be cut through the wall into which the box is to be mounted. Such a large opening may require extensive wall repair after the box is installed or must be used with a large cover plate to cover the opening.
Also, many of these boxes include complicated wall engaging mounting structures. Compression devices, toggle clips, snaps and the like such as shown in U.S. Pat. Nos. 4,120,473, 4,120,416, 2,776,774, 2,870,931 and 2,769,562 may also be used to secure the box to the wall. However many of these structures are difficult for the installer to easily operate.
Common to all of the above described boxes, is the fact that the boxes must be prefabricated or specifically modified to accommodate particular mounting hardware. This necessitates the installer carrying boxes which are specifically manufactured solely for old work or cut-in applications in addition to boxes for other applications.
Therefore, it is desirable to provide a mounting bracket which allows for the use of a standard electrical box in old work or cut-in applications.

Rework bracket for electrical outlet boxes


Barrier materials for reducing the permeability of plastic packaging materials are provided, characterized as containing at least about seven percent by weight amine nitrogen, or a total of at least about 17 percent amine nitrogen plus hydroxyl groups. The barrier materials exhibit oxygen permeability of less than about 1.5 cc-mil/100 in.sup.2 -day-atmosphere and a carbon dioxide permeability of less than about 15 cc-mil/100 in.sup.2 -day-atmosphere at 23.degree. C. and zero percent relative humidity. The barrier material can be formed from polyepoxide and polyamine. Optionally the polyamine may comprise prereacted polymeric resin formed from a polyepoxide and a polyamine. Multilayer packaging materials and multilayer containers including the polyamine-polyepoxide barrier material are part of the invention.

The present invention relates to barrier materials, curable coating compositions for forming such materials, and to packaging materials and/or containers including barrier materials. The barriers substantially reduce the permeability of gases such as carbon dioxide and/or oxygen through packaging materials.
Plastics have found increasing use as replacements for glass and metal containers in packaging, especially of foods and beverages. The advantages of such plastic packaging includes lighter weight, decreased breakage (versus glass) and potentially lower costs. However, shortcomings in the gas-barrier properties of common packaging plastics, such as polyolefins, e.g., polyethylene and polypropylene, poly(ethylene terephthalate) and polycarbonates, present major disadvantages in the packaging of many foods and beverages. For example, many foods and beverages are sensitive to oxidation and must be protected from oxygen to prevent discoloration or other detrimental effects. Further, plastic beverage containers suffer comparative shelf-life problems versus glass or metal due to the loss of carbon dioxide through the plastic container.
Numerous barrier coatings have been developed including, e.g., barrier materials based on thermoplastic, crystalline resins such as vinylidene chloride or ethylene-vinyl alcohol. Each of these materials have drawbacks. Ethylene-vinyl alcohol-based polymers lose barrier properties upon exposure to water, and packages of this material cannot generally undergo retort, i.e., heating under pressurized steam for pasteurization without loss of barrier performance. Vinylidene chloride-based polymers have been recognized as having excellent gas-barrier properties, but preparation of such vinylidene chloride-based polymers must generally be done under high pressure. Further, since vinylidene chloride-based barrier materials include halogen atoms, the disposal of such materials via incineration poses environmental problems. In addition, both vinylidene chloride-based polymers and ethylene-vinyl alcohol based polymers exhibit loss of adhesion after undergoing retort.
U.S. Pat. No. 2,830,721 (Pinsky et al.) discloses a polyamine-polyepoxide barrier coating for plastic containers. The purpose is to reduce the permeation of organic solvents through polyethylene containers. For polymeric food and beverage containers, it would be desirable to provide barrier coatings that have lower oxygen and/or carbon dioxide permeabilities than those disclosed in the Pinsky et al. patent.

Polyamine-polyepoxide gas barrier coatings


A golf tee setting device includes a generally cylindrical body having a top portion, a bottom portion, and a passage extending between the top portion and the bottom portion. The passage is sized to allow a golf tee to pass therethrough. The body has at least one opening therein between the top portion and the bottom portion. The opening defines a surface such that a line extending through the passage traverses the surface at two locations. A kit having a plurality of the devices of different lengths is also provided. Additionally, a method of manufacturing the device is also provided.

A conventional golf tee is readily known and recognizable by a golfer of any skill and ability. Teeing a golf ball is understood to be inserting a conventional golf tee into the ground and placing a golf ball on top of the tee, typically in the cupped end of the tee. Typically, a golfer sets a tee and tees his ball by placing the golf ball in the palm of the hand and grasping the tee between the index and middle fingers such that the golf ball rests in the cupped end of the tee. The ball is grasped firmly such that the tee points out between the knuckles. The golfer then closes his hand around the ball and tee. Grasped in this manner, the tip of the tee is oriented perpendicular to the ground and the golfer forces the tee into the ground by applying pressure through the golf ball.
From a set of clubs, the golfer selects a desired club based on the conditions present at a particular tee. Golf clubs are designed with an impact surface having differing loft (the angle between a vertical plane and the clubface when the club is at rest). A typical set of clubs generally consists of 3 woods, 2 wedges, a putter, and 8 irons (3, 4, 5, 6, 7, 8, and 9 irons, plus a pitching wedge). The longest wood, the 1 wood, is typically referred to as the driver. It has a large club head and typically the longest shaft. The shorter woods (e.g., the 3, 5, and 7 woods) are most commonly used when the ball is not on a tee, but in the fairway. These woods generally have greater loft than the driver and a smaller club head.
Different manufacturers of golf clubs emphasize different features of their driver depending on their target audience. For example, some manufacturers emphasize the large size of their driver club head. The accompanying larger sweet spot allows a golfer to hit his ball further. Other manufacturers emphasize that their driver club head with its low center of gravity creates a flight trajectory of the golf ball which results in a greater driving distance. Still other manufacturers emphasize that the shape of their driver club head allows a golfer to drive the ball further.
A result of these different features of the driver is that, depending on the style of driver, a golfer may desire to tee the golf ball at different heights above the ground so that the driver club head impacts the golf ball at the driver sweet spot. Accordingly, tees are available in different lengths, ranging from 1⅜ inches to 4 inches. It is not always practical for a golfer to use the same tee length, and therefore, there is a need for a device that sets the golf tee at a consistent height above the ground independent of the tee length.

Golf tee setter and method of manufacture


A thermal shutdown circuit board integrated circuit device. The thermal shutdown circuit includes a current source for receiving a current bias and generating an output current in accordance therewith. The current source is configured to produce the output current in a manner proportional to absolute temperature. A current mirror is coupled to the current source. The current mirror is configured to mirror the output current from the current source and is configured to have a high output impedance. A thermal shutdown transistor is coupled to control one output of the current mirror. The thermal shutdown transistor is also coupled to receive the output current and shutdown the output current at a temperature threshold in a manner dependent on shutdown circuit operating temperature.

Electronic devices are being used today to perform a wide variety of tasks. Many different areas of business, industry, government, education, entertainment, and most recently, the home, are tapping into the enormous and rapidly growing list of applications developed for today's increasingly powerful electronic devices. Such devices include, for example, handheld electronic devices such as mobile instrument equipment, portable computers, portable medical electronics devices, and fixed electronic devices such as machine tool controllers, large server computer systems, and robotic servo mechanisms.
As electronic devices and machines controlled by electronics become increasingly ubiquitous and widespread in their use, there is increasing interest in improving the performance and the functionality of the electronics. For example, increasing the performance and software execution speed of computer system devices is of great interest.
There are many methods used by designers to increase the functionality of electronic devices. For example, with digital computer systems, software execution speed is increased by increasing the processor "clock speed." Another method used by designers, with both digital electronics and analog electronics, is to increase the density of the electrical components within integrated circuit dies. For example, many high-performance integrated circuit processors include tens of millions of transistors integrated into a single die (e.g., 60 million transistors or more). As density increases, the operating speeds possible within a given design also increase, for example, as circuit traces are packed ever more closely together. Another method for increasing performance is to increase the efficiency of heat removal from a high-density high-performance integrated circuit. As component density increases, the thermal energy that must be dissipated per unit area of silicon also tends to increase. To maintain high performance, stable operating temperature must maintained. Accordingly, the use of carefully designed heat dissipation devices (e.g., heat sink fans, liquid cooling, heat spreaders, etc.) with high-performance processors has become relatively standardized.
Thus, performance enhancing techniques such as increased component density, increased clock speed, and increased heat dissipation are carefully balanced in order to obtain an optimum performance level. Over heating leads to erratic functional behavior of the device, such as, for example, computational errors, unpredictable behavior, or even physical destruction of the device. As more and more functions are integrated into smaller and smaller semiconductor dies, the operating speeds can be increased, however, the resulting increased switching activity leads to greater heat generation. Additionally, circuits having a high degree of integration are generally much more sensitive to thermal overloads and are more easily damaged by excessive heat. Such circuits tend to the specifically designed to function with very small operating currents, thus, current spikes related to thermal transients can easily damage them.
To protect such sensitive circuits from damage, is desirable to provide thermal protection which functions to shut down, or otherwise limit, current to a given electronic device when the device operates outside of safe thermal limits. Such thermal protection circuitry needs to be tailored to the operating conditions of the overall incorporating electronic device. In the case of a low power devices, the thermal protection circuitry needs to function properly while consuming low power. For example, in some electronic systems, like low operating current regulators, there is a need for a thermal shutdown circuit that will operate at about 1 microamp.
Generally, a thermal shutdown circuit for an integrated circuit device acts like a thermometer in that it senses a die temperature and shuts down the normal function of the device when the temperature exceeds a given threshold, or shutdown temperature (e.g., approximately 180 deg C.). Since the operating current of the integrated circuit device is much reduced during thermal shutdown, there is no chance that internal dissipation will significantly raise the operating temperature of the integrated circuit device during the shutdown. Thus, in the case of a regulator integrated circuit device, effective thermal protection circuitry makes the device practically "blowout" proof.
There exists problems with prior art thermal shutdown circuits. Prior art thermal shutdown circuits often employ large resistors in their design. The large resistors lead to correspondingly large back gates, or "tubs", which in turn produce a corresponding back gate leakage current, or tub leakage current. Since the tub leakage current doubles with every 10 degrees centigrade, the size of the resistor needs to be quite large (e.g., 9M) in order to compensate for the change in resistance caused by the tub leakage current. Additionally, the changing tub leakage current causes the shutdown voltage to change as temperature changes, making the actuation of the shut down less accurate. Additionally, prior art thermal shutdown circuits often required circuit elements, such as zener diodes, that limit the voltages the device can process.
Thus, what is required is a thermal shutdown circuit for integrated circuit devices that is dependent on device temperature. What is require is a circuit that is independent of the tub/substrate diode leakage currents. Additionally, the required solution should not required excessively large resistors and should not require a large operating current. The present invention provides a novel solution to these requirements.


Systems, methods, and computer program products are provided for installing web management software on an entity server by communicating requests to entity servers for the purpose of executing instruction on the entity servers. As an example, the system receives installation parameters comprising hardware, software, and network information associated with an entity server and based on these installation parameters, generates a list of commands to install web management software on an entity server, wherein each command is executable by the entity server for performing a function to install the web management software on the entity server. The system initiates a server communication session with the entity server, and for each command in the list of commands, communicates a request comprising the command to be executed by the entity server, wherein the requests are sent in a selected order and at selected times to install web management software on the entity server.

Typically an institution requires the use of servers running web management software in order to display data and allow for the operation of business functions. Installing a web management may require significant time and resources. There exists a need for automating the installation process of web management software on servers collectively operated by an institution.

Web management software configuration automation


The present invention pertains to an apparatus for providing current. The apparatus comprises a voltage regulator for regulating output voltage of a generating device to a predetermined level. The apparatus is also comprised of a voltage boost circuit for maintaining a desired current out of the voltage regulator at lower efficiencies. The voltage boost circuit is in electrical communication with the voltage regulator. In a preferred embodiment, the voltage boost circuit includes means for storing energy and means for controlling when the storing means stores or releases its energy.

As shown in FIG. 1, the charging system of a typical motor vehicle consists of an alternator, voltage regulator, and battery. Internal to the alternator are the field coil (rotor), stator, rectifier bridge and the diode trio.
When current flows through the field coil, a magnetic field is produced. When the alternator shaft is rotated by the engine, a voltage is induced in the stator. The rectifier bridge converts AC voltage from the stator to a DC voltage needed for the charging of the vehicle's battery. The diode trio functions the same as the rectifier bridge but its output is used to supply current to the field coil. The voltage regulator limits the alternator output voltage to a preset level by controlling the field coil current.
On initial engine start-up, residual magnetism in the field coil generates a voltage in the stator which is rectified by the diode trio. This voltage is applied to the field coil by the voltage regulator and current flows through the field coil increasing the induced stator voltage and subsequently the voltage available for the field coil current. Since the rectifier bridge and diode trio anodes are connected commonly to the stator, the output voltage from the alternator and the voltage available to the field coil are approximately the same.
It is known in the past that at low engine speeds, the available output current from the alternator decreases due to the decrease in induced stator voltage. The voltage regulator attempts to maintain a constant voltage at the alternator output by increasing field coil current but is limited by the available voltage and magnetic saturation. As the stator voltage decreases, the resistance of the field coil will limit the field coil current proportionally to the voltage applied to the field coil.
The present invention provides a field voltage boost circuit that can be used between the diode trio and the field coil to increase the maximum available field current by increasing the voltage applied across the field coil. Increased output power from the alternator is achieved by this increased field current.

Power boost circuit for a voltage regulator


A method for the secured storing of a data element in an external memory, which is connected to a microcontroller via an interface module, which is configured to calculate memory addresses for data to be stored and for error correction values. The method includes receiving the data element to be stored by the interface module, a calculation by the interface module of a memory address in the external memory for the data element to be stored, and a writing, starting at the memory address, of the data element and of the error correction value via the interface module into the external memory, the error correction value immediately following the data element being written and the writing taking place within one addressing phase. A corresponding interface module, a corresponding microcontroller, and a corresponding control unit are also described.

In working memories such as SRAM, Flash, PCM or DRAM, it is possible, in addition to the data bits, to store additional bits for correcting errors or identifying errors, referred to as "Error Correction Code," in order to secure the data content. Single bit errors or multi-bit errors within a data element may thus be identified and corrected as a function of the number of the bit errors within the data element.
In embedded systems, for example, control units of machines or vehicles, so-called microcontrollers are used which include, in addition to one or multiple processor cores, a particular limited amount of internal working memory, in which programs and data are stored during execution. For this working memory, in particular, for safety-critical applications, for example, in motor vehicles, an error correction method may be implemented in the microcontroller with the aid of ECC.
Typical SRAM memory cells used as working memories in microcontrollers include 6 transistors and are accordingly relatively expensive and complex to manufacture, hence, the working memory integrated into the microcontroller is frequently dimensioned only large enough to be sufficient for basic applications. An internal expandability of the working memory is usually not provided or is not possible in microcontrollers for reasons of cost, since the working memory is integrated with the processor cores in one chip.
In order to also enable the implementation of applications, which access a working memory larger than is provided on the microcontroller, it is possible to connect an external working memory via a communication interface, for example, an SPI interface (Serial Peripheral Interface). This external working memory may be cost-efficiently designed in the form of DRAM memory cells that require only one transistor. However, no error correction function is implemented in available externally connectable working memories.

Method for the secured storing of a data element in an external memory and interface module


A packaging method of LED of high heat-conducting efficiency and a structure thereof firstly is to provide a copper substrate having a plurality of indentations. An insulating layer is formed on the surface of the substrate and the bottom of the indentations. Meanwhile, a set of metallic circuits is formed on the insulating layer of the substrate, and a layer of insulating lacquer is coated on the surface of the metallic circuits, where there is no electric connection and no enclosure. A tin layer is coated on the insulating layer of the indentation and the metallic circuits, where there is no insulating lacquer. Furthermore, a set of light-emitting chips are die bonded on the tin layer of the indentation. Next, the light-emitting chips and the metallic circuits are electrically connected by a set of gold wires. Moreover, a ringed object is arranged on the surface of the substrate, such that the light-emitting chip set, the gold wires and the metallic circuits are enclosed therein. Meanwhile, a fluorescent glue is attached to the light-emitting chip set, the gold wires and the metallic circuits. Eventually, an epoxy resin is filled into the interior of the ringed object to be dry for forming an epoxy resin layer. Thus, a packaging manufacture of LED is completed.

1. Field of the Invention
The present invention generally relates to an LED, in particular, to a packaging method of LED of high heat-conducting efficiency and a structure thereof.
2. Description of Prior Art
Light-emitting diode (LED) is a semiconductor component in solid state, which applies an inter-combination of electron and hole to release energy in a form of light. LED belongs to luminescence lighting and has many merits, such as: small size, long life, low electricity consumption, quick reaction speed, and vibrating endurance. Basically, LED is a light-emitting component for a variety of appliance, information-showing board, and communicating product.
As shown in FIG. 1 and FIG. 2 (i.e. ROC Patent M292879), when a traditional LED is manufactured, a metallic plate 100 is firstly stamped into a lead frame 101, which is placed into a die together with a metallic base 103. After injection formation, two electrode legs 102 of the lead frame 101 and a partial area of the base 103 are enclosed and fixed by the glue seat 104, making base 103 and two electrode legs 102 located in an indentation 105 of the glue seat 104. Next, the light-emitting chip 106 is die-bonded onto the surface of the base 103 by means of silver glue, and the light-emitting chip 106 and two electrode legs 102 are electrically connected by gold wires 107. Finally, after a fluorescent glue body 108 is attached to the light-emitting chip, an epoxy resin 109 is further filled into the indentation 105 of the glue seat 104.
However, the above manufacturing steps of LED are so tedious that they consume too many working time and labor, making it being impossible to lower down the manufacturing cost. According to the prior manufacturing method of LED, a light-emitting chip 106 is firstly pasted onto a base (or lead frame) by means of silver glue, then the positive and negative electrodes of the light-emitting chip 106 are connected to the electrode legs 102 by means of wiring machine with gold or aluminum wire, finally an epoxy resin 109 is applied to complete the packaging procedure. However, since the poor physical characteristics of electrode legs 102, base 103, and epoxy resin 109 in terms of heat conduction, heat resistance reaches as high as 250° C./W˜300° C./W in this traditional packaging form. Therefore, the temperature of LED will rise due to the poor heat dissipation, consequently causing the deterioration and ageing of the epoxy resin 109. In a long term, the light-emitting efficiency of the LED will be decreased and the temperature increment will be accelerated, because of the thermal accumulation. A poor reliability phenomenon is caused by a structure stress generated from the temperature increment.
Accordingly, aiming to solve aforementioned shortcomings, after a substantially devoted study, in cooperation with the application of relatively academic principles, the inventor has at last proposed the present invention that is designed reasonably to possess the capability to improve the prior arts significantly.

Packaging method of LED of high heat-conducting efficiency and structure thereof


According to an aspect of the present invention, a modeling method of a semantic gateway is provided, which includes: inputting a plurality of protocol data from a plurality of devices that each use a different protocol to the semantic gateway; performing, at the semantic gateway, a protocol analysis and syntax induction on the inputted plurality of protocol data respectively, to obtain a plurality of protocol ontology instances corresponding to the plurality of protocol data; performing, at the semantic gateway, a semantic query and matching operation for the plurality of protocol ontology instances using a dictionary library and a model ontology library to obtain a plurality of model ontologies corresponding to the plurality of protocol ontology instances; and merging, at the semantic gateway, the plurality of model ontologies to generate a generic model.

The present invention relates to a modeling method of a semantic gateway and a semantic gateway, which are capable of establishing mapping among information having the same semantics but different expression forms in a plurality of heterogeneous devices by building a general model for communication among the plurality of heterogeneous devices using different protocols in a given industrial application scenario, and further, enable information exchange among the heterogeneous devices to be easily implemented.
As is well known, traditional industrial gateways are used for data exchange at the protocol layer. With the development of intelligent manufacturing technology, there are intelligent gateways that can perform the following operations: collecting information of each device by simply applying a relationship library and store it in a database, and simply processing the collected data, such as calculating statistical values (mean value), maximum/minimum, etc.), data filtering, auxiliary judgment (alarm).
IDC statistics show that there will be more than 50 billion terminals that are connected to devices by 2020, and by 2018, 50% of IoT networks will face network bandwidth limitations, and 40% of data needs to be analyzed, processed and stored at the edge of the networks. Industrial Internet of Things is one of the most important areas. Therefore, the development of new industrial gateways is imperative.
In China's industrial systems, heterogeneous information systems are very common due to historical reasons. This leads to low interoperability of data among heterogeneous information systems, which is not beneficial to application development and deployment. In addition, with the significant development of hardware performance, it is possible to deploy semantic-based computing and reasoning at the edge nodes, and various semantic gateways have emerged.
The so-called semantics can be simply regarded as the meaning of the concepts represented by the things in the real world corresponding to the data, and the relation between these meanings is the interpretation and logical representation of the data in a certain field.
The most important part of the semantic gateway is how to solve the problems of heterogeneous data communication, modeling and model mapping. Many organizations have proposed modeling theories and methods to solve heterogeneous information communication in a certain field. The model library needs to be maintained and updated according to the requirements of specific application scenarios. Information system communication among various domains needs to be implemented using the communication protocol adaptation and model mapping technology. In addition, in some special equipment fields, some specific data information models might be used, and so a corresponding policy is also required.
In the Chinese Patent Publication CN103839155A, a semantic-gateway-based heterogeneous information system model integration method is proposed. The patent document provides a semantic-gateway-based heterogeneous information system model integration method in a manufacturing enterprise, comprising the steps of: building a semantic gateway model according to modeling methods of different information systems, establishing an adapter model corresponding to a semantic gateway; and establishing information mapping among the semantic gateway models of different modeling models. The information of the enterprise information system is linked with a semantic gateway model of a corresponding modeling method through an adapter model of the corresponding modeling method, and the information is mapped by the semantic gateway to another semantic gateway model that is built according to another modeling method. The semantic gateway model of the other modeling method parses the information, and then links the information to the enterprise information system established by the other modeling method through an adapter model of the other modeling method, to achieve information integration. This patent document proposes a semantic gateway integrating and modeling structure and corresponding method from the level of modeling of information system, to realize information integration of heterogeneous information systems.
The prior art patent document proposes a method of building a semantic gateway model using a modeling language, a modeling method and a modeling tool according to a modeling theory, and establishing mapping of information among semantic gateway models of different modeling methods, so as to realize information integration of heterogeneous information systems.
However, the heterogeneous information system information integration method is not beneficial to actual deployment and application. This is because a variety of theories and methods, in conjunction with the modeling needs of different fields and different services, make it necessary to model according to specific business needs when deploying the semantic gateway, so that the modeling workload in the semantic gateway is heavy, which is not beneficial to the actual deployment.
In addition, in the actual use process, the introduction of new equipment in the production line may cause new models and new mappings to increase, making the maintenance and update of the semantic gateway model library inconvenient.

Modeling method of semantic gateway and semantic gateway


An image signal processing device includes a reference signal generating portion, a determination portion, and an extraction portion. The reference signal generating portion generates and outputs a reference signal that sequentially transmits reference pulses shifted from horizontal synchronization pulses on a horizontal synchronization signal by a predetermined shift time. The determination portion determines whether the horizontal synchronization pulses are normal by comparing time differences between input of the horizontal synchronization pulses and input of the reference pulses with the shift time. The extraction portion extracts line image data points from an image signal in synchronization with the input of the horizontal synchronization pulses that have been determined as normal.

The present disclosure relates to an image signal processing device configured to extract line image data from an image signal in synchronization with input of horizontal synchronization pulses to a horizontal synchronization signal, and relates to an image reading apparatus.
An image reading apparatus includes an image reading portion that reads images from document sheets and that outputs an image signal and an image signal processing device that processes the image signal. The image signal processing device extracts line image data from the image signal in synchronization with input of horizontal synchronization pulses to a horizontal synchronization signal.
In addition, the image reading apparatus is known to count data points in the image signal to detect abnormalities in the horizontal synchronization signal based on the count value obtained when the horizontal synchronization pulses are input.

Image signal processing device, image reading apparatus to extract line image data from an image signal when horizontal synchronization pulses are determined as normal, and a determination portion determines whether horizontal synchronization pulses are normal by comparing time differences between the input of the horizontal synchronization pulses and input of the reference pulses with a shift time


This invention relates generally to the treatment of cathepsin or dynamin mediated diseases, such as proteinuria, cancer, and cognitive disease and related products. Diagnostic and other assays are also provided, as well as methods for podocyte cell gene transfer.

About 20 million Americans have kidney insufficiency, a significant independent risk factor for cardio-vascular disease. The number of people diagnosed with kidney disease has doubled each decade for the last two decades impacting on human suffering and enormous Medicare costs imposed by end-stage renal disease. Urinary protein loss (proteinuria) is a common feature of kidney dysfunction of glomerular origin and is itself a risk factor for both renal and extra-renal diseases including cardiovascular disease. Diabetic kidney disease, for example, the most common and fastest growing form of ESRF in the U.S., is first manifest by the leakage of a small amount of protein in the urine and altered podocyte behavior. Kidney podocytes are highly differentiated cells and form the outer part of the ultrafiltration barrier. Their foot processes (FP) are interconnected by the slit diaphragm (SD). Proteinuric kidney diseases are typically associated with podocyte membrane remodeling (FP effacement and SD disruption).

Cathepsin L mediated diseases and associated methods and products


A method and device of torque generation based on electromagnetic effect is provided. An electromagnetic torque whose direction is opposite to the motor driving direction is generated in a magnetic field when a motor-drive armature winding is adopted based on the electro-magnetic induction principle. Meanwhile, a reverse electromagnetic torque which is reverse to the armature winding with the same magnitude, is applied on a magnet set and is transmitted to an underactuated system so as to provide required torque for the underactuated system. Advantageously, the provided torque is in direct ratio to speed, difficulty in control is significantly reduced, two-stage electromagnetic variable speed can be achieved, the design of the system is simple and reliable with a concise and clear structure, and the device may be employed in a wide variety of applications.

Due to the lack of a direct acting force or a torque, system control of an underactuated system generally tends to be difficult. For example, a unicycle robot may have only one wheel contacting the ground and an ordinary wheel is only capable of forward and backward movement, so the unicycle robot cannot provide a lateral torque while the veer of the unicycle robot needs a torque. Likewise, a satellite, a spacecraft and a missile all need to be driven by a torque in order to point to a predetermined direction. An advanced spacecraft and a missile generally realize attitude adjustment through outward gas ejection, and the satellite may use inertial flywheel rotation for generating a reaction wheel and a magnetic torque or a liquid loop so as to realize attitude adjustment. The main propeller reverse torque overcoming of a helicopter or a saucer aircraft is realized by adopting a rotating tail propeller that is orthogonal to a main propeller.
Certain existing approaches utilize a scheme of controlling lateral balance of a unicycle robot by an inertial flywheel. One other approach utilizes a scheme of controlling lateral veer of a unicycle robot by an inertia flywheel. The method of using an inertia flywheel to provide a reverse torque is also widely employed in satellite attitude adjustment, although it is difficult to use an inertia flywheel providing reverse torque to control attitude. The reason is that the magnitude of the reverse torque provided by an inertia flywheel is in direct ratio to rotational acceleration of the flywheel while a motor is a speed servo system for which tracking for acceleration is not easy to achieve when the flywheel rotates at a uniform speed, and thus no reverse torque is generated. In addition, the magnitude of the provided reverse torque is limited because of the limitation of the rotational speed of the motor.
One technique, as disclosed in Chinese Patent Application No. 200510111490.3, provides a method and system for controlling attitude of micro-satellite based on an active magnetic control, mainly by adopting magnetic torque active magnetic control, integrating with gravity gradient rod and momentum wheel offset stabilization control unit to form satellite attitude stabilization platform, and utilizing coil current interaction on the geomagnetic field and a satellite to provide a torque to adjust satellite attitude. Such technique is significantly different from that of the present invention in that the interaction between a permanent magnet and an armature winding in the magnetic field are utilized to generate a counter torque. On the other hand, according to the technique as disclosed in Chinese Patent Application No. 200910152010.6, an angular momentum produced through liquid flowing in a pipe enables the satellite attitude to change. However, such technique is also significantly different from that of the present invention in a scheme that electromagnetic effect is used to adjust satellite attitude. For a spacecraft, the carried gas capable of being jetted out is limited, while the scheme where electrical energy is converted into mechanical energy can utilize inexhaustible solar energy.
A technique, as disclosed in Chinese Patent Application Nos. 200720037988.4 and 200820120359.2, uses everyday objects to complete many experiments of motor-driven electromagnet generation principle, eddy current working principle, eddy current generation effect and eddy current generating torque under magnetic field effect. Another technique, as disclosed in Chinese Patent Application No. CN102529574A, provides a mobile medical equipment truckle with an electromagnetic torque balance motor installed, wherein the technique can use friction torque of electromagnetic torque balance truckle generated by the rotation of the truckle, to reduce thrust for the working staff. Yet another technique, as disclosed in Chinese Patent Application No. CN1532656A, provides a miniature three-shaft attitude control device, including three planar motors, a cube support frame and a control plate, wherein the planar motors include rotors, stators, rotor shafts and bearings. The rotors comprise a plurality of pairs of magnetic poles. The planar motors are disposed on three mutually perpendicular planes of the cube support frame through the rotor shafts and the bearings. Because stator coils in the stators are secured on a substrate, and a flat stator is in a fixed state, the direction of reactive force applied on the rotors is opposite to direction of the force applied on the stators. The stator coils are continuously made to pass through three-phase square wave current according to a certain electrifying sequence, that is, continuous rotation of the rotors is guaranteed. Such a structure ensures larger rotating torques of the motors. Still another technique, as disclosed in Chinese Patent Application No. CN1983098A, provides a micro satellite attitude control system containing a magnetorquer, wherein the magnetorquer is formed by three magnetic bars and its power amplifier circuit. When current passes through the magnetic bars, controllable magnetic torque, which can react with the ground magnetic field to generate three-shaft control torque, can be generated. A control system with active magnetic control by the magnetorquer as the core and in combination with gravity gradient rod and momentum wheel offset stabilization works as a satellite attitude stabilization platform.

Method and device for torque generation based on electromagnetic effect


A nut plate fastener retains a screw inserted through an aperture formed in a panel. A double-sided adhesive tape may be adhered to one face of the fastener to mount in the panel aperture. The nut plate fastener consists of an integral member and includes a bottom plate with a cone-shaped ring-liked raised screw impression to receive and retain a screw, and a top plate portion connected to the bottom plate. The screw when in the fastened position is confined between the top and bottom plates as to be isolated from objects contained within the panel and adjacent the nut plate fastener. Three tabs project from the bottom face of the bottom plate and project through the tape which centers the fastener in the panel aperture.

1. Field of the Invention
The present invention relates generally to industrial fasteners and more particularly to nut plate fasteners.
2. Brief Description of the Prior Art
Many variety of industrial fasteners are available which act like a nut in retaining a screw. Such fasteners, when formed from resilient materials, for example sheet metal, are often called "nut plates", since they retain a screw and act as a plate in distributing the load. Such nut plates are frequently employed as reinforcement members when a panel wall is relatively week; for example, a panel may be formed of thin plastic or thin metal.
U.S. Pat. Nos. 4,755,090 and 4,647,263, issued Jul. 5, 1988 and Mar. 3, 1987, respectively, and assigned to the assignee of the present application, disclose nut plate fasteners to which this invention relates. The nut plate fasteners disclosed in these patents essentially comprise a one-piece body member having, as portions thereof, an upper leaf and a bottom leaf, with each including an aperture therethrough for receiving the corresponding screw member. The complete disclosures of these aforementioned patents are herein incorporated by reference. A disadvantage of such nut plate fasteners is that wiring, hoses, etc. that reside proximate the structure's panel wall can be damaged by inadvertent contact with the screw member. As such, it is necessary to fasten objects proximate the panel wall which could be damaged by the exposed screw.
There is a need for an improved nut plate fastener which will isolate a screw member away from objects residing proximate a structure's panel wall.


A faucet assembly including a spout with dual flow outlets resulting in two separate streams of water from a discharge outlet that combine into a single stream a distance below the flow outlets. In an illustrative embodiment, the faucet spout is formed is formed through additive manufacturing.

The present disclosure relates to faucets including spaced apart hot and cold water passageways having independent hot water and cold water outlets. More particularly, the present disclosure relates to a faucet including spaced apart hot water and cold water outlets, controlled independently by hot and cold water valves, which are angled inwardly towards each other so that hot and cold water streams from the water outlets merge to create a single mixed water stream outside of the faucet.
Faucets including multiple passageways for the delivery of water from separate valves to a spout outlet are known. In some faucets, a premixing chamber may exist where water from each valve is combined prior to being discharged from the spout outlet. In other faucets, the outlet of each passageway is located adjacent to each other, wherein water is discharged in a single stream.
Control over water temperature and flow are known performance factors for faucets. Aesthetic details of faucet components and water discharged therefrom are also factors considered in the design of faucets. With the recent availability of additive manufacturing (e.g., three dimensional printing), new and useful designs can now be created than previously possible by traditional manufacturing processes.
In an illustrative embodiment of the present disclosure, a faucet body includes a first passageway fluidly coupled to a first valve, a second passageway fluidly coupled to a second valve and sealed from the first passageway by a divider, a first flow device fluidly coupled to the first passageway, and a second flow device fluidly coupled to the second passageway, the second flow device being spaced apart from the first flow device.
According to another illustrative embodiment of the present disclosure, a faucet spout includes a hot water passageway extending between a hot water inlet and a hot water outlet, the hot water outlet including a hot water discharge axis angled relative to a vertical axis, and a cold water passageway extending between a cold water inlet and a cold water outlet, the cold water outlet including a cold water discharge axis. The cold water discharge axis is angled relative to the vertical axis toward the hot water discharge axis. The hot water passageway is fluidly sealed from the cold water passageway.
Additional features and advantages of the present invention will become apparent to those skilled in the art upon consideration of the following detailed description of the illustrative embodiment exemplifying the best mode of carrying out the invention as presently perceived.


A method reducing microbial growth uses an inorganic substance consisting of MoO2 and/or MoO3 which causes the formation of hydrogen cations when in contact with an aqueous medium to achieve an antimicrobial effect. The substance is present as a layer or a component of a layer, and is present in combination with one or more materials as a composite material. The composite material has a polymer matrix, and the substance is incorporated at 3 to 50% by weight into the composite material.

Microorganisms such as bacteria and fungi are omnipresent in our living space and populate the most different types of surfaces. Many microorganisms are pathogens and, consequently, their spreading and/or control play(s) a special part in public health and hygiene. If such microorganisms get into our body, they may be the cause of life-threatening infections. If one contracts such an infection in a hospital, this is called a nosocomial infection.
It is started from the assumption that the Euro amounts in the two-digit billion range for the elimination of damage caused by nosocomial infections are required per year worldwide. Consequently, the control of pathogenic microorganisms plays a special part in public health and hygiene.
Apart from the warding off and/or the killing of undesired microorganisms by means of antibiotics, for instance, prophylactic measures, e.g. the creation of spaces that are hostile to the life of microorganisms are gaining more and more importance. Among these prophylactic measures the use of silver as an additive to organic and inorganic materials over the past few years has quickly gained in importance. Here, silver ions interfere with important functions of microorganisms. Nowadays, it is proceeded from the assumption that silver ions block enzymes and prevent their vital transport functions in the cell. Further effects include the impairment of the structural strength of cells and/or also a damage to the membrane structure. These effects may result in a cell damage and/or cell death. Silver has a very broad active spectrum against multi-resistant germs, as well. Small doses are sufficient for achieving a long-term effect. This is called an oligodynamic effect. Organic compounds are still added in some cases in order to increase the effectiveness of silver. It is always of importance that sufficient silver ions are present. Consequently, a nanoscale silver powder, so-called nanosilver, is used in order to achieve a large particle surface.
Silver does not have any toxic side effects in a broad dosage spectrum. Only highly increased accumulations of silver in the body may result in an argyria, an irreversible, slate-gray discoloration of skin and mucous membranes. In addition, increased silver concentrations may cause taste disorders, disorders of the sensitivity to smell and cerebral convulsions.
Moreover, it must be mentioned that, in general, the interaction between nanoscale particles and the human organism has not been sufficiently investigated as yet. Broad investigation programs have only been started recently. The antimicrobial effectiveness of silver is not sufficient for many applications. The effectiveness is only given up to 0.25 of molar saline solution. Beyond that, the formation of silver chloride takes place. The essential disadvantage of the use of nanosilver resides in a non-satisfactory cost situation. On the one hand, this is due to the high price of silver and, on the other hand, the processing of silver to nanoparticles is time-consuming and expensive. A further problem arises in the processing of nanosilver due to the formation of agglomerates, aggregates and clusters. Due to this, the active surface is reduced and, as a further consequence, the antimicrobial effect. In order to prevent this, nanosilver is deposited on particle surfaces of a carrier, e.g. TiO2, which, in turn, increases the production costs.
Consequently, there has been no lack of attempts at detecting an antimicrobial, oligodynamic and disinfecting effect in other metals. Copper, for instance, also has a strong antimicrobial effect, but at a too high zytotoxicity. The result of a search in the Internet encyclopedia Wikipedia under the search word oligodynamics is that, so far, this effect has been found in the following metals, in a descending order in accordance with their effectiveness: mercury, silver, copper, tin, iron, lead and bismuth. Gold and osmium, two noble and expensive metals, have this effect, as well.
However, it is required for many applications that, in addition to a sufficient antimicrobial effectiveness, the active substance does not have any zytotoxicity and thrombogeneity and is in general biocompatible. Active substances such as mercury, bismuth or copper do not have these properties due to their high zytotoxicity and the non-given biocompatibility.
A plurality of patent and non-patent literature deals with the production and the use of nanosilver. Further metals and inorganic compounds are only described in isolated cases. U.S. Pat. No. 5,520,664 discloses a catheter made of plastic. Atoms are introduced by means of ion implantation to achieve an antimicrobial effect. Silver, chromium, aluminum, nickel, tungsten, molybdenum, platinum, iridium, gold, silver, mercury, copper, zinc and cadmium are mentioned as a metal with an antimicrobial effect. However, only silver and copper are mentioned in the examples and special embodiments.
JP 2001-54320 describes a plastic material which contains 0.005 to 1% by weight of a mixture of molybdenum trioxide and silver oxide. The invention relates to a film consisting of an antibacterial resin component and of components which may be used for the material of partitions of clean rooms, for the uppermost layer of floor coverings, linings, briefcases, desk pads, tablecloths, packaging bags, textiles and the like. Here the problem is that in the case of the incorporation of an inorganic, antibacterial active substance the transparency of the plastic material, e.g. of vinyl chloride resin, is lost. The loss of transparency is avoided by the admixture of oxide of the hexavalent molybdenum. This application readily reveals that, upon the exceeding of the weight ratio of molybdenum trioxide to silver oxide of 95:5, an antibacterial effect can no longer be achieved. Consequently, no antibacterial effect is attributed to molybdenum oxide per se. If the ratio of molybdenum oxide to silver oxide is less than 30:70, i.e. with small shares of molybdenum oxide, a discoloration of the vinyl chloride resin takes place.
An antimicrobial plastic material is described in JP 2001-04022, which contains both organic components with an antimicrobial effect and metallic components. Silver, platinum, copper, zinc, nickel, cobalt, molybdenum and chromium are mentioned as a metallic component with an antimicrobial effect. However, silver and copper are again only mentioned as being active in the examples and preferred embodiments.
A glaze for ceramic components is disclosed in JP 2000-143369, which contains silver molybdate. Here, 0.01 to 1% of silver molybdate are added and converted to metallic silver. The effect is increased by the addition of 10 to 50% of titanium oxide.
An antimicrobial effect can also be achieved by means of components with a photooxidative effect. Due to this, reactive free radicals are formed, which damage the microorganisms. JP 11012479 describes an antimicrobial plastic material which contains an organic and an inorganic component. Metallic particles such as silver, zinc and copper and further compounds such as calcium zinc phosphate, ceramics, glass powder, aluminum silicate, titanium zeolite, apatite and calcium carbonate are mentioned as an example of inorganic components. Here, metal oxides such as zinc oxide, titanium oxide or molybdenum oxide act as a catalyst for the photooxidative effect. Consequently, JP 11012479 reveals that the antimicrobial effectiveness is only achieved, if the photooxidative mechanism occurs, i.e. the prerequisite for the effectiveness is the action of electromagnetic radiation.


A propped cantilever carrier is described that can be used in planetary gear systems. The carrier can comprise cantilevered arms extending outward from a central hub. At the end of each cantilever a post can extend downward that is configured to receive bearings and gears. A plate can comprise a hole for each post in the carrier. When the plate is coupled to the carrier it can hold the bearings and gears in place and provide added strength to the carrier. The strength benefits are large compared to the light weight of the carrier (with plate) apparatus.

Planetary gear systems are used in many applications. Regarding vehicles, planetary gears are useful in transmissions. For a variety of vehicles (autos, airplanes, electric vehicles), machinery (such as windmills), and other applications requiring converting speed and torque, there is a need to convert a motor speed (e.g., revolutions per minute (RPM)) to a different speed, such as wheel RPM or blade RPM. Planetary gear systems commonly have a carrier, sun gear, planetary gears, and a ring gear. Two typical carrier designs are web-and-plate and cantilever.


Novel vitamin D analogs, markedly active in the fields of cell proliferation and differentiation, are selected from among (4E,6E)-7-{3-[2-(3,4-bis-hydroxymethylphenyl)-ethyl]phenyl}-3-ethylnona-4,6-dien-3-ol, (E)-6-[3-(3,4-bis-hydroxymethylbenzyloxy)phenyl]1,1,1-trifluoro-2-trifluoromethyloct-5-en-3-yn-2-ol, (3E,5E)-6-[3-(3,4-bis-hydroxymethylbenzyloxy)-phenyl]-1,1,1-trifluoro-2-trifluoromethylocta-3,5-dien-2-ol, (E)-6-{3-[2-(3,4-bis-hydroxymethylphenyl)ethyl]phenyl}-1,1,1-trifluoro-2-trifluoromethyloct-5-en-3-yn-2-ol, and (3E,5E)-6-{3-[2-(3,4-bis-hydroxymethylphenyl)-ethyl]phenyl-1,1,1-trifluoro-2-trifluoromethylocta-3,5-dien-2-ol, and the geometric isomers thereof and these compounds in which one or more of the hydroxyl functions are protected by a protective group —(C═O)—R, in which R is a linear or branched alkyl radical having from 1 to 6 carbon atoms, an aryl radical having from 6 to 10 carbon atoms, or an aralkyl radical having from 7 to 11 carbon atoms, the aryl radical or the aralkyl radical optionally being mono- or disubstituted by a hydroxy group, an alkoxy radical having from 1 to 3 carbon atoms, a halogen atom, a nitro function or by an amino function, and mixtures thereof.

1. Technical Field of the Invention
The invention relates, by way of novel and useful industrial products, to biaromatic compounds which are vitamin D analogs.
The invention likewise relates to the process for their preparation and their utilization in pharmaceutical compositions intended for use in human or veterinary medicine, or else furthermore in cosmetic compositions.
The compounds according to the invention have a marked activity in the fields of cell proliferation and differentiation and are administered more particularly for the topical and systemic treatment of dermatological complaints, conditions or afflictions (or others) linked to a keratinization disorder, complaints, conditions or afflictions having an inflammatory and/or immunoallergic component and of hyperproliferation of tissues of ectodermal origin (skin, epithelium . . . ), whether benign or malignant. These compounds can in addition be used to combat aging of the skin, whether photoinduced or chronological and to treat cicatrization disorders.
It is likewise possible to use the compounds according to the invention in cosmetic compositions for body and hair hygiene.
2. Description of Background/Related/Prior Art
Vitamin D is a vitamin essential for the prevention and treatment of defects of cartilage mineralization (rachitis) and of bone (osteomalacia), and even of certain forms of osteoporosis in elderly subjects. However, it is now known that its functions extend even beyond the regulation of bone metabolism and of calcium homeostasis. Among these can be mentioned its actions on proliferation and on cell differentiation and the control of immune defenses. Their discovery has opened the way to novel therapeutic approaches in dermatology, cancerology, as well as in the field of autoimmune illnesses and that of organ or tissue transplantation.
An efficacious therapeutic contribution has long been known against the toxicity of this vitamin (sometimes fatal hypercalcemia). Currently, structural analogs of vitamin D are being synthesized, some of which only retain the differentiating properties and do not have any action on the calcium metabolism.
The assignee hereof has already proposed in WO 00/26167 (D1) novel compounds which are vitamin D analogs which show a selective activity on cell proliferation and differentiation without having hypercalcemic character. These compounds which are vitamin D analogs are in particular more easily synthesizable and therefore more economic with respect to what was known previously.

This patent is subject to a terminal disclaimer.


An embodiment of the present disclosure provides a dual camera module including: a first camera module having a first optical axis; a second camera module having a second optical axis aligned with respect to the first optical axis and a second extension part extending in a direction crossing the second optical axis; a fixing member having a first accommodation part accommodating the first camera module, a second accommodation part accommodating the second camera module, and a second fixing part coupled to the second extension part; and a second adhesive part connecting the second extension part with the second fixing part to fix the second camera module to the fixing member.

Camera modules, especially, camera modules mounted on portable electronic devices, have smaller numbers of pixels due to a high resolution and miniaturization of mobile phones, which are recently required. Accordingly, a picture quality is greatly deteriorated even with a slight distortion of an optical axis.
In addition, in the case of vehicle camera modules, with the introduction of automatic parking function, lane detection function, and around view monitoring, a distance to an object, a size and shape of the object, a matching rate with a driver's visual field, and a degree of image alignment between cameras are becoming very important.
Recently, as dual camera modules are applied, each camera module needs to be aligned to have the same optical axis. However, there is a problem that the optical axis is distorted while being transferred to a fixed process, after one optical axis is aligned with respect to the other camera module.

Dual camera module and apparatus for manufacturing the same


A terminal box for a solar battery module is provided with terminal plates (30) connectable with positive and negative electrodes of the solar battery module, cables (91) for external connection connectable with the terminal plates (30), bypass diodes (50) spanning between the adjacent terminal plates (30), and a pair of lead pieces (80) each connected with a corresponding pair of conductor plates (51) provided in the bypass diode (50) and holding a bear chip diode therebetween. The leading ends of horizontal portions (83) of the lead pieces (80) are detachably connected with the corresponding terminal plates (30) by bolts (24).

1. Field of the Invention
The invention relates to a terminal box for a solar battery module, to a rectifying unit and to a method of assembling it.
2. Description of the Related Art
A solar energy generation system supplies direct-current electricity from a solar battery panel on the roof of a house to electric equipment via an inverter or the like. The solar battery panel has solar battery modules, and electrodes of the solar battery modules are connected via terminal boxes.
Japanese Patent Publication No. 3498945 discloses a terminal box with terminal plates juxtaposed in a box. Ends of the terminal plates at one side are connectable with positive and negative electrodes drawn out from the underside of the solar battery module and the other ends thereof are connectable with cables for external connection. Bear chip diodes span between adjacent terminal plates and short an inverse current if there is an inverse load from one cable for external connection to the other. The bear chip diode has a diode functioning portion and two conductor pieces connect with the diode functioning portion while hold the diode functioning portion therebetween. The conductor pieces also are connected with the corresponding terminal plates by soldering. The bear chip diode is inexpensive and takes up a smaller area in the box as compared to a diode of the package type.
Excessive current caused, for example, by lightening may break the bear chip diode. The broken bear chip diode cannot be replaced easily since the conductor pieces of the bear chip diode are soldered to the terminal plates.
The present invention was developed in view of the above problem and an object thereof is to make a rectifying device easily exchangeable.

Terminal box for a solar battery module, a rectifying-device unit and a method of assembling it


The present invention relates to a supported hybrid catalyst and a method for preparing an olefin based polymer using the same. The supported hybrid catalyst according to the present invention can be used in the preparation of an olefin-based polymer, and the olefin-based polymer prepared using the supported hybrid catalyst has excellent processability and mechanical properties and thus can be effectively used for the application of films or the like.

Olefin polymerization catalyst systems can be classified into Ziegler-Natta and metallocene catalyst systems, and these two highly active catalyst systems have been developed in compliance with their characteristics. Ziegler-Natta catalyst have been widely applied to existing commercial processes since it was developed in the 1950's. However, since the Ziegler-Natta catalyst is a multi-active site catalyst in which a plurality of active sites are mixed, it has a feature that molecular weight distribution of the polymer is broad, and there is a problem in that since composition distribution of comonomers is not uniform, it is difficult to provide the desired physical properties.
Meanwhile, the metallocene catalyst comprises a main catalyst whose main component is a transition metal compound, and an organometallic compound cocatalyst whose main component is aluminium. Such a catalyst is a single-site catalyst which is a homogeneous complex catalyst, and offers a polymer having a narrow molecular weight distribution and an uniform composition distribution of comonomers, depending on the single site characteristics. The stereoregularity, copolymerizing properties, molecular weight, crystallinity and the like of the resulting polymer can be controlled by changing the ligand structure of the catalyst and the polymerization condition.
U.S. Pat. No. 5,914,289 discloses a method of controlling the molecular weight and the molecular weight distribution of polymers using metallocene catalysts which are supported on supports. A large amount of solvent and long time are required to prepare the supported catalysts, and the process of supporting metallocene catalysts on the respective support is troublesome.
Korean Patent Application No. 2003-12308 discloses a method of controlling the molecular weight distribution of polymers by polymerizing while changing a combination of catalysts in a reactor by supporting a bi-nuclear metallocene catalyst and a mononuclear metallocene catalyst on a support with an activator. However, this method is limited in simultaneous achievement of properties of the respective catalysts. In addition, there is a disadvantage that a metallocene catalyst portion is departed from a supported catalyst to cause fouling in the reactor.
Therefore, in order to solve the above-mentioned disadvantages, there is a need to develop a method for preparing olefin-based polymers with a desired physical properties by easily preparing a supported hybrid metallocene catalyst having an excellent activity.
On the other hand, a linear low density polyethylene is prepared by copolymerizing ethylene and alpha-olefins using a polymerization catalyst under a low pressure. Thus, this is a resin having a narrow molecular weight distribution which has a short chain branch of a certain length, but no long chain branch. The linear low density polyethylene film has, in addition to the characteristics of a typical polyethylene film, a high breaking strength and elongation, and exhibits excellent tear strength and falling weight impact strength. The use of the linear low density polyethylene film increases in the stretch film, overlapping film or the like which is difficult to apply to a low density polyethylene or a high density polyethylene.
However, the linear low density polyethylene using 1-butene or 1-hexene as a comonomer is mostly prepared in a single gas phase reactor or a single loop slurry reactor, and the productivity is high as compared to a process using 1-octene comonomer, but these products are also limited in the catalyst technology and process technology. Thus, they are problematic in that their physical properties are greatly inferior to when using 1-octene comonomer and the molecular weight distribution is narrow and thus processability is poor.
Many studies are conducted to improve these problems, and U.S. Pat. No. 4,935,474 discloses a process for producing polyethylenes having a broad molecular weight distribution using two or more metallocene compounds. U.S. Pat. No. 6,828,394 discloses a process for producing polyethylenes having an excellent processability and particularly suitable for the film. In addition, U.S. Pat. No. 6,841,631 and U.S. Pat. No. 6,894,128 disclose that polyethylenes having a bimodal or multimodal molecular weight distribution is prepared using a metallocene catalyst comprising at least two metal compounds and thus it can be used for the application of a film, a blow molding, a pipe and the like. However, although the processability of these products was improved, there are still problems that the dispersion state per molecular weight within the unit particle is not uniform and thus the extruded appearance is rough even under a relatively good extrusion condition, and the physical property is not stable.
Given the above circumstances, the preparation of superior products, having a balance between the physical property and the processability is continuously required, and improvement for this is further required.

Supported hybrid catalyst and method for preparing olefin-based polymer using the same


A nursing bottle having an air returning function comprises a bottle body, a fixing cover, a nipple, a ventilation component, an air conduit, an elastic one-way valve set at a second opening of the air conduit and is located at the interior of the air conduit, a mounting part located on the second opening of the air conduit to secure the elastic one-way valve. The ventilation component, the air conduit, the elastic one-way valve and the mounting part form a gas returning device and are located on the interior of the bottle. The bottle reduces the contacting area between the air and the milk, lowering the amount of vitamin loss. The phenomenon of vomiting milk, choking and flatulence will be omitted since no air bubble is generated.

The nursing bottles in the current market for feeding the babies generally have the following problems. A traditional nursing bottle is composed of a bottle body, a cap, and an elastic nipple. Except for the hole set on the elastic nipple, the other parts of the bottle are tightly sealed. When the baby sucks the milk, the volume of the liquid inside the bottle decreases and the air volume inside the bottle increases. A negative pressure is thus generated. The generated negative pressure increases a resistant force for the liquid flowing out from the elastic nipple. As a result, the baby has to suck quite strenuously under this circumstance. When a larger negative pressure is formed inside the bottle, the outside air is being pushed into the bottle, which can easily generate a large number of bubbles from the milk in the bottle. After sucking the milk containing gas bubbles, the gas accumulates inside the baby's abdomen, and the baby may spit up. Moreover, too much air in the stomach and digestive tract causes abdominal pain.
Generally, the vitamin C contained in milk has strong reducibility. It can be extremely easy to be oxidated and lost. While vitamin A has oxidability, when the content of vitamin C is reduced to a certain degree, vitamin A and vitamin E will start to be lost. When an outside air enters into the traditional bottle through holes of the elastic nipples, the contacting time between the outside air and the milk is long, which results in a significant decrease in vitamins A and E, or a complete loss of vitamin C.
In the market, there are also some bottles featured in preventing the phenomenon of flatulence. Those bottles are all set with an inner cap inside the bottle cap which compresses the nipple. There are several inlet holes on the inner cap. Air is transported into the bottom of the bottle through an air conduit. Air passes through the inlet hole and goes directly into the bottom of the bottle when the baby sucks the milk with the nursing bottle having above structure. This design can reduce air bubbles inside the milk, which prevents the flatulence from happening. However, due to the existence of the inlet holes, the milk will continue to drop into the baby's mouth even when the baby is not sucking the nipple (this is due to the generated positive pressure when feeding). The milk fills the baby's mouth, in this case, milk may flow out of the baby's mouth or the baby may spit up, which wets baby's clothes. More seriously, the milk naturally flows into the baby's esophagus and the trachea, which causes the phenomenon of choking on milk. Besides, since the pressures inside and outside the bottle are the same the milk could flow into the baby's mouth without sucking. This does harm to the training of baby's sucking ability.
In the case that the end of the air conduit extending into the bottle is not sealed and left open, milk can easily enter the air conduit, and thus cause milk leakage. Such kind of nursing bottle without a one-valve mounted on the end of the air conduit would make the liquid flow back to the air conduit when the nipple is pressed. The reversely flowed liquid would pass through the connecting and supporting components of the air conduit and finally flow out of the bottle. The reason of this phenomenon is that when the nipple is pressed down, the air inside the bottle is compressed, as the air conduit is configured to communicate with the outside atmosphere, the liquid inside the bottle subjected to the compression is forced to flow out of the bottle. In the practical use, the leakage of milk would definitely make the user feel awkward and troublesome, especially when going out, the leaked milk would stain the cloth of the baby. Moreover, this type of design often requires a conduit with a very small diameter, and it is hard to wash and clean the conduit without specific tools. Further, since the nursing bottle is held with the nipple down at a roughly 45 degrees angle when feeding a baby, the existing bottles (where the air conduit and its connecting and supporting components are configured to communicate with the outside atmosphere, the gravity of the liquid itself cannot be offset, so the liquid will keep flowing out to the mouth of the baby under the action of the gravity of the liquid) failing to offset the gravity of the milk can cause unexpected outflow of the milk even when the baby is not sucking, thereby causing choking to the baby. Choking to a baby can be a fatal risk, and there are many cases happening in day-to-day life that a baby gets choked due to the unexpected outflow of milk while the baby is not sucking the nipple. For the case that the end of the air conduit extending into the bottle is provided with a valve, usually, the valve holds the end of the conduit with its elasticity, which is easy to get loosened and detached. As a result, the valve will get lost easily, or even worse be eaten by the baby. Further, with this design, parents tend to disassemble the valve for washing and cleaning, which is likely to damage the valve and shorted the service life of the valve, making the one-way valve unable to open and close the air conduit normally with the natural elasticity of the valve. Since the valve is not fixed to the end of the air conduit, frequent disassembling will also cause damage to the air conduit. As the valve becomes loosened or damaged, milk will enter and block the air conduit, so a baby will have a hard time sucking the nipple against the negative pressure, causing a leakage. What's more, as the milk cannot flow out smoothly with the air conduit blocked, the overly resistant nipple could collapse, in this case the baby may swallow a large amount of air, causing flatulence and stomachache. Therefore, since the existing nursing bottles cannot completely address all the problems, there is a long-felt need to develop a nursing bottle which can avoid choking, spitting-up, nutrition loss etc. and has the advantage of easy packing and cleaning.
Besides, the air guiding device of the existing nursing bottle is complicated. There are many tiny accessories. The bottles must be cleaned and disinfected immediately after using, the cleaning time for the multiple parts is too long and it is quite inconvenient.

Nursing bottle having air returning function


An input stage suitable for use with any desired supply voltage VCC, including supply voltages less than 5 volts, and which is capable of withstanding an overvoltage input signal greater than VCC applied to its input pad. A pass transistor is used between the input pad and the input buffer in order to limit the voltage supplied to the input buffer, thereby allowing voltages in excess of VCC to serve as a legitimate logical one input signal to the input buffer. Overvoltage protection is used to limit the voltage on the input pad to a voltage in excess of the greater-than-VCC legitimate input voltage. An output stage is suitable for use with a wide variety of supply voltages, including supply voltages less than 5 volts, while allowing proper operation in the event that a legitimate overvoltage is applied to its output pad. ESD protection is provided in order to limit the voltage on the output pad to a voltage greater than the maximum legitimate overvoltage. Cascode devices are used to limit the voltages seen by the pull up and pull down transistors when a legitimate overvoltage is applied to the output pad. Suitable transistor switches are used to prevent excessive current from being dissipated when a legitimate overvoltage is externally applied to the output pad when the output stage is in either the high impedance mode or the active high mode.

Integrated circuits have achieved widespread use in that they are capable of reducing the space required to achieve a given electrical function, with an attendant increase in performance including a reduction in power requirements. In order for integrated circuits to conveniently interface with other integrated circuits and other types of electronic circuitry, certain industry-wide input/output (I/O) specifications have been developed. One example is the transistor-transistor logic (TTL) standard in which a supply voltage of five volts (nominal) is applied to a device. An input signal associated with a logical zero has a maximum voltage of approximately 0.7 volts and a logical one input level has a minimum voltage of approximately two volts. This TTL specification also requires that an integrated circuit provide an output voltage of at least approximately 2.4 volts associated with a logical one output signal, and an output voltage of not more than approximately 0.4 volts associated with a logical zero output level.
Current advancements in integrated circuit technology are spurring an evolution to lower voltage devices than the TTL standard. For example, one current trend is to develop integrated circuits utilizing 3 or 3.3 volt power supplies. In the future, even lower voltage devices (such as 2.4 volt devices) will be developed. Among the reasons for moving to lower voltage integrated circuits are a need to reduce system power without a corresponding tradeoff in performance.
Given the large number of TTL device types, it would be desirable to provide lower voltage devices which are capable of withstanding excessive voltages applied to their input and output pins from external sources, for example, if they are inadvertently or intentionally used with TTL devices or interfaces. Thus, for example, for a 3.0 volt device in which a high output voltage of approximately three volts corresponds to a logical one output signal, it would be very beneficial if the device were able to withstand a TTL logical one voltage level of approximately 5 volts applied to the output terminal, without consuming excessive power or incurring damage. Similarly, it would be very beneficial if a 2.4 volt device were able to withstand a logical one level of approximately 5 volts (TTL standard) or approximately 3.0 volts (for a 3.0 volt device) logical one signals apply to the output terminal.
FIGS. 1-8 are prior art input and output circuits which are known in the art. The following discussion describes the merits or lack thereof in using each of these input/output circuits in conjunction with an integrated circuit operating at a supply voltage VCC level of, for example, 3.3 volts.
FIG. 1 is a schematic diagram depicting a typical CMOS input stage. Input pad 10 receives an input signal from external circuitry for application to input buffer 13, whose output is connected to other circuitry (not shown) within the integrated circuit. Input protection diodes 11 and 12 are used in order to provide overvoltage protection for input pad 10. Input protection diode 11 forward biases when the input voltage is greater than VCC+VD, where VD is the forward bias voltage drop of input protection diode 11. Thus, when VCC is 5 volts, as in the prior art, input pad 10 is protected from voltage excursions exceeding approximately 5.6 volts. However, when VCC is 3.3 volts, and a 5 volt TTL level is applied to input pad 10, input protection diode 11 turns on, thereby providing input overvoltage protection while drawing an intolerable amount of current in a situation in which an acceptable 5 volt level is applied to input pad 10.
FIG. 2 is a schematic diagram of a typical CMOS output stage including output pad 20, output pad overvoltage protection diodes 21 and 22, pull up transistor 23, and pull down transistor 24. With a 3.3 volt power supply voltage, and an acceptable 5 volt TTL level applied externally to output pad 20, output protection diode 21 forward biases, undesirably pulling down pad 20 to 3.3 volts and consuming excessive current in the process. Furthermore, in the circuit of FIG. 2, with a 5 volt level applied to output pad 20 and the gate of P channel pull up transistor 23 being not more than three volts, P channel pull up transistor 23 turns on, causing excessive current to flow from output pad 20 through pull up transistor 23.
FIG. 3 is a schematic diagram of another prior art output stage including output pad 30, P channel pull up transistor 33, N channel pull down transistor 35, and Schottky diode 35. However, if this prior art 5 volt output stage were used with lower voltage circuits, for example with a 3.3 volt circuit in which the power supply may drop as low as 2.7 volts, the output high level applied by this circuit to output pad 30 would not be sufficiently high due to the voltage drop across Schottky diode 35. Schottky diodes used in I/O circuits tend to be very susceptible to damage due to electrostatic discharge (ESD). Furthermore, CMOS fabrication processes often do not allow for the fabrication of Schottky diodes, and this circuit must therefore be limited to use in BiCMOS devices, which are inherently more complex and expensive than CMOS processes.
FIG. 4 is a schematic diagram of another prior art BiCMOS output stage including output pad 40, P channel pull up transistor 43, N channel pull down transistor 44, and Schottky diode 46 coupled between the source and well region of P channel pull up transistor 43. Schottky diode 46 connected in this manner prevents the inherent diode formed between the drain and the well region of P channel pull up transistor 43 from forward biasing. However, this allows the well region of P channel transistor 43 to float between the supply voltage and a diode drop below the supply voltage level, which is undesirable in that floating wells are more susceptible to latch up and unpredictable performance. Also, this circuit will not prevent leakage through P channel transistor 43 when an externally applied voltage to output pad 40 exceeds its gate voltage. Other prior art variations on this circuit cause the well region of P channel pull up transistor 43 to be switched to a specific voltage level, for example by the use of field transistors. However, unless a well region is connected via a low impedance path to a fixed voltage level, latch-up is a distinct possibility. Field Effect Transistors, which are typically used for switching purposes, including possibly switching the well region of P channel pull up transistor 43, have relatively high resistance, thereby increasing the possibility of latch-up. Furthermore, this output circuit cannot be used in CMOS devices as most CMOS processes do not support the fabrication of Schottky diodes.
FIG. 5 is a schematic diagram of a prior art MOS output stage utilizing both an N channel pull up transistor 53 and an N channel pull down transistor 54. However, the use of an N channel pull up transistor 53 at lower voltages, such as with a 3.3 volt power supply level, does not provide sufficient over- drive to provide a sufficiently high output voltage level on output pad 50.
FIG. 6 is a prior art MOS output stage similar to that of FIG. 5 which overcomes the problems of FIG. 5 by utilizing a separate diffusion mask to provide a lower threshold voltage for N channel pull up transistor 63 than is provided for other N channel transistors in the device, including pull down transistor 64. This provides a greater amount of overdrive, even when using low voltages such as a 3.3 volt power supply voltage. However, this prior art device has the significant disadvantage of requiring a separate diffusion mask, thereby increasing the number of steps required to fabricate this device and adding a significant amount to fabrication cost.
FIG. 7 is a schematic diagram of a prior art bipolar output stage used in certain BiCMOS devices. When used with a low voltage device, such as a device using a 3.3 volt power supply, NPN pull up transistor 73 does not provide a sufficiently high output voltage level on output pad 70. It has been suggested that an additional PNP transistor or P channel device 75 be used as shown in order to provide an increase in output voltage on output pad 70. However, this device requires the use of bipolar transistors, and thus cannot be used in a pure MOS device, but will require the additional expense of a BiCMOS device, and will still have the problems associated with the use of a P channel pull up device.
FIG. 8 is a schematic diagram of a CMOS output stage which can be used with low voltage devices. In this prior art output stage, the gate oxide for output transistors 83 and 84 is approximately 150.ANG. while the gate oxide for other transistors in the integrated circuit, such as exemplified by buffer 89, is approximately 110.ANG.. This serves to improve the reliability of the output stage, in that output transistors, which may see a relatively high externally applied voltage, have thicker gate oxides which are better capable of withstanding the externally applied high voltage. However, this does not solve the problem of P channel pull up transistor 83 conducting when an externally applied voltage to output pad 80 exceeds the supply voltage of the device, for example when the device is powered by 3.3 volts and an external 5 volts is applied to output pad 80. Furthermore, output transistors 83 and 84 must be made larger since their channel lengths must be increased with increasing gate oxide thicknesses. Perhaps an even greater problem is the fact that this process is complex, and therefore expensive, in that at least two separate masks are required to achieve two separate gate oxide thicknesses in a single integrated circuit.
The disadvantage of requiring two separate gate oxide thicknesses can be overcome, of course, by using a 150.ANG. gate oxide for the entire integrated circuit. However, this will increase the die size as devices must be made larger (with increased channel lengths) with increasing gate oxide thicknesses. Also, thicker gate oxides result in a reduction in speed. Furthermore, this circuit could be used with a 3.3 volt supply powering the internal logic of the integrated circuit and a 5 volt supply powering the output buffer. However, this will either require two separate external supplies, or will require the 3.3 volt supply to be internally generated on chip from the externally applied 5 volt supply. This consumes power, and integrated circuit die area, and leads away from the desire to provide integrated circuits which operate with lower voltage supplies.

Low voltage input and output circuits with overvoltage protection


A semiconductor memory device that includes a memory cell array with memory cells arranged in rows and columns. The memory cells can also be formed in blocks. A plurality of word lines are applied voltages received by a plurality of drive lines, the plurality of word lines being classified into an arbitrary word line determined arbitrarily, secondary adjacent word lines located adjacent to both word lines adjacent to the arbitrary word line, and residual word lines other than the arbitrary word line in the secondary adjacent word lines. A plurality of transfer transistors are utilized to select the plurality of word lines or blocks. Among the plurality of transfer resistors, transfer transistors for the residual word lines are arranged at both adjacent locations and an opposite location around a transfer transistor for the arbitrary word line.

1. Field of the Invention
The present invention relates to an electrically erasable programmable non-volatile semiconductor memory device, for example, a NAND-type EEPROM.
2. Description of the Related Art
An electrically erasable programmable read-only memory (EEPROM) has been known in the art as one of semiconductor memories. For example, a NAND-type EEPROM including NAND cells has received attention because it can be highly integrated. Each NAND cell consists of a plurality of serially connected memory cells, each of which is the unit of one bit memory. The NAND-type is utilized in a memory card to store image data output from a digital still camera, for example.
The memory cell in the NAND-type EEPROM has an FET-MOS structure that includes a floating gate and a word line layered via insulators on a semiconductor substrate that provides a channel region. The NAND cell includes a plurality of memory cells serially connected in such a manner that they share a source/drain between neighbors. The source/drain corresponds to an impurity region that functions as at least one of a source and a drain.
An exemplary method of programming data in the NAND-type is described simply.
(1) "0" Program
While a channel region is kept at a voltage of 0V, a word line corresponding to a memory cell for "0" program is selected, and a voltage of 20V is applied to the word line. In addition, a voltage, for example, of 10V is applied to the word lines other than the selected word line. Because of a large potential difference between the selected word line and the channel region, electrons are injected through the tunnel current into the floating gate of the memory cell. As the result, the threshold of the memory cell turns to a positive state ("0" programmed state).
(2) "1" Program
After the channel region is set in a floating state at a certain voltage above 0V, a word line corresponding to a memory cell for "1" program is selected, and a voltage of 20V is applied to the word line likewise "0" program. In addition, a voltage, for example, of 10V is applied to the word lines other than the selected word line. As a result, the voltage on the channel region is boosted up, for example, to 8V through capacitive coupling with the selected word line. In this case, different from "0" program, because of a small potential difference between the selected word line and the channel region, few electrons are injected through the tunnel current into the floating gate of the memory cell for "1" program. Therefore, the threshold of the memory cell is retained in a negative state ("1" programmed state).
For "1" program, if the elevation of the voltage on the channel region is small, the tunnel current injects electrons into the floating gate, resulting in "0" program. In order to prevent such the failed program, in another exemplary programming method, a voltage of 0V is applied to two word lines both located adjacent to the word line for the memory cell for "1" program to increase the voltage elevation on the channel region.
The word lines are provided with respective transfer transistors. This transistor is employed to apply a voltage to the word line. According to the other exemplary programming method, the selected word line is set at 20V, the both adjacent word lines at 0V, and other word lines at 10V for programming. Therefore, transfer transistors may be required to supply 20V, 10V and 0V to the corresponding word lines.
A device isolation insulator for use in isolation between transfer transistors is required to have such a breakdown voltage that is determined based on the largest potential difference between adjacent transistors, specifically a potential difference when one of the adjacent transistors is set at 20V and the other at 0V. Therefore, compared to the exemplary programming method that does not utilize 0V, the device isolation insulator is required to have a higher breakdown voltage. This requirement increases the dimension of the device isolation insulator, and accordingly increases the area of a region to locate the transfer transistor (that is, an area of a row decoder). A technology has been known to devise arrangement of the transfer transistors to prevent such the problem (for example, Japanese Patent Application laid-Open No. 2002-141477, FIGS. 1 and 2).

Non-volatile semiconductor memory device with reduced chip real estate area for transfer transistors