Technology is provided for partitioning a shared unified cache in a multi-processor computer system. The technology can receive a request to allocate a portion of a shared unified cache memory for storing only executable instructions, partition the cache memory into multiple partitions, and allocate one of the partitions for storing only executable instructions. The technology can further determine the size of the portion of the cache memory to be allocated for storing only executable instructions as a function of the size of the multi-processor's L1 instruction cache and the number of cores in the multi-processor.

Computer processors (e.g., central processing units or "CPUs") commonly employ CPU caches to reduce the average time to access memory. Typically, caches are smaller and faster than main system memory. Caches are commonly used by a CPUs to temporarily store copies of data and instructions that were recently read or perhaps might be repeatedly accessed by the processor. Before a CPU accesses (e.g., reads or writes) data in the main system memory, it first checks for a corresponding entry in a cache. If an entry exists in the cache, a "cache hit" is said to occur and the CPU can simply access the cached data. If the entry does not exist in the cache, a "cache miss" is said to occur and the CPU typically waits for a "cache line" to be copied from the main system memory to the cache. A cache line is typically a known or fixed length of bytes. When the cache is full and a cache miss occurs, an eviction policy is used to replace some previously cached data with a new cache line that satisfies the CPU's access. As an example, a least recently used (LRU) eviction policy may evict cached information that has not been recently accessed
Caches speed up performance by helping the processor avoid the longer step of loading the values from a main memory device, e.g., a main system memory, which is typically much slower than cache memory. Caches are referred to as "on-board" or "on-chip" when they are integrally packaged with the processor cores, e.g., on a single integrated chip. Many computer systems include additional caches, such as a level 2 (L2) cache and level 3 (L3) cache, which may support on-board (level 1/L1) instruction and data caches. For example, the CPU may first check the L1 cache, and then the L2 cache, and then the L3 cache, before finally resorting to the main system memory. Each cache level is typically progressively larger and slower than the previous level. The larger cache in the additional (L2 or L3) caches is also generally referred to as the last level cache ("LLC") or "shared cache." The additional caches act as an intermediary between the main (system) memory and the on-board caches, and can store a much larger amount of information than the on-board caches, but at a longer access penalty.
Further, in multi-processor computer systems, the additional caches are sometimes shared between two or more processors (also referred to as "cores") in the computer system. For example, in some multi-processor computer systems, two or more processors may share a single L3 cache while each processor maintains a separate L1 cache. Having two or more processors share a cache may be beneficial in various instances. For example, when multiple processors commonly require instructions or data, only one processor fetches the instructions or data into the shared cache and the other processors can then copy the instructions or data into their respective L1 caches.
The L1 cache generally includes a separate instruction cache (L1i) for storing executable instructions and a separate data cache (L1d) for storing data, allowing the processors to access both instructions and associated data simultaneously (i.e. during the same clock cycle) for executing a given instruction. On the other hand, as the additional cache (or "shared cache") acts as a backup for the L1 cache, the computer systems commonly use the additional cache to store both the executable instructions and the data within the same unified cache (as opposed to separate caches for data and instructions) to optimize for memory utilization of the additional cache. However, such a cache architecture can suffer from performance degradation due to high cache thrashing.
Cache thrashing can occur when a cache is loaded with instructions or data, the loaded information is then evicted, and then the cache is loaded again with new instructions or data. For example, when an application retrieves a lot of data, instructions in the L2 and L3 cache may be evicted to load cache lines containing data because the instructions corresponding to the application may be accessed from the L2 or L3 cache may be accessed much less frequently than data, e.g., because the processor has cached the instructions in the instruction portion of the L1 cache.
When multiple processors of a multi-processor architecture process the same instructions (e.g., execute the same application), cache thrashing can be particularly problematic, e.g., because different cores may need to retrieve the same instructions, but the instructions needed by one core have been evicted from a shared cache to load data accessed by other cores. Performance degradation can be caused by cache thrashing because the processor has to wait ("stalls") until an evicted instruction is re-fetched from the main memory. Cache thrashing can considerably slow down the performance of a computing system because a processor has to continually move instructions or data in and out of the cache instead of executing application instructions.
Conventional techniques reduce cache thrashing by increasing the cache size, increasing cache-associativity, having a victim cache, and so on. However, these techniques come with concomitant overhead, e.g., extra hardware costs, increased cache hit access time, etc. Another conventional technique identifies frequently executed instructions after code-profiling and locks the cache through software to minimize cache thrashing. However, this technique requires additional overheads in terms of requiring profiling of code and extra instructions in the code to lock the cache.
The headings provided herein are for convenience only and do not necessarily affect the scope or meaning of the claimed embodiments. Further, The drawings have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be expanded or reduced to help improve the understanding of the embodiments. Similarly, some components and/or operations may be separated into different blocks or combined into a single block for the purposes of discussion of some of the embodiments. Moreover, while the various embodiments are amenable to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and are described in detail below. The intention, however, is not to limit the particular embodiments described. On the contrary, the embodiments are intended to cover all modifications, equivalents, and alternatives falling within the scope of the disclosed embodiments as defined by the appended claims.


A detachable plug-type connector, in particular for the connection of a pressure line to a hydraulic cylinder with a pin-shaped inner part, which pin-shaped inner part can be inserted in a boring of an outer part. Between the outer part and the inner part there is a seal. The seal sits in the boring of the outer part, and in front of the seal there is a securing element which limits the axial travel of the seal in the extraction direction.

1. Field of the Invention
This invention generally relates to a detachable plug-type connector for hydraulic systems, in particular for motor vehicles, for the connection of a pressure line to a hydraulic cylinder. The plug-type connector has a pin-shaped inner part which can be inserted into a boring of an outer part, whereby a seal is provided between the outer part and the inner part.
2. Background Information
Such a plug-type connector is disclosed, for example, in German Patent No. 44 04 731. The outer part is a part of a housing of the hydraulic cylinder. The seal is realized in the form of an O-ring which sits in a groove on the pin-shaped inner part or plug. The inner part is enlarged conically in its rear area. The guidance and the firm seating of the inner part in the stepped boring of the outer part are ensured by the enlarged outer surface and the front end, which has a smaller diameter. There is a support element between the seal and the conical enlargement of the inner part. A securing element which is realized in the form of a spring clip sits in slots which run diametrically opposite to one another in the outer part, and the spring clip serves to reduce the inside diameter of the boring. During installation, the inner part is introduced into the outer part and thus also into the spring clip. The spring clip is thereby expanded by the cone of the inner part. As the inner part is pushed further into the outer part, the spring clip arrives in the area of the securing element, which is formed by a significantly reduced outside diameter on the inner part (for example, a groove or a shoulder), and snaps in place as a result of the spring bias. It is then no longer possible to extract the inner part from the outer part.
For disassembly, the spring clip is pulled out of the slot, and the seal is removed from the plug-type connection along with the inner part. One disadvantage of this procedure is that when the plug-type connection is removed, the seal can become dirty or damaged, and when the seal is reinstalled at some later point it may no longer perform an ideal sealing action. It is also possible that the seal will be lost during this disassembly procedure. Significant disadvantages can also occur if, when the plug-type connection is detached, the seal comes into contact with petroleum products, for example, in particular if the hydraulic cylinder in question is a brake cylinder. Seals which are resistant to brake fluid are not resistant to petroleum and vice-versa. The gasket will consequently swell up and cease to perform its function. In the case cited by way of example, that would entail significant risks.
During assembly, the spring clip already sits in its securing position in the slots in the outer part, to clearly indicate to the mechanic by the locking of the inner part that the plug-type connection has been correctly made. If, as the inner part (the plug) is being introduced, the procedure is not performed extremely carefully, e.g. if the plug is introduced at an angle, the seal can be damaged when it comes into contact with the circlip or sealing ring, which can also have an undesirable affect on the operation of the hydraulic cylinder.

Hydraulically operated clutch assembly for a motor vehicle having a detachable plug-type connector


The present invention relates to a plasma process chamber, which includes: an upper housing having a gas inlet connected to a gas source, and a gas shower head placed in the upper housing; and a lower housing having a gas outlet connected to a vacuum pump, and a substrate provided on the inner bottom of the lower housing. On the substrate is placed a wafer. A plasma reactor is provided between the upper housing and the lower housing of the plasma process chamber. The plasma reactor is provided on the outer circumference of its main body with at least one reactor tube of horseshoe shape. A closed magnetic core is attached to the reactor tube, and a coil is wound on said magnetic core. The coil is connected electrically to an A.C. power. The plasma reactor is placed in the middle area of the plasma process chamber and a plurality of the reactor tubes are provided on the outer circumference of the plasma reactor so that plasma reaction is generated and distributed evenly in the plasma process chamber. Consequently, high density of the plasma can be obtained. Furthermore, the generated plasma ion particles are diffused evenly in the plasma process chamber by the diffusion induction electrodes so that cleaning efficiency can be highly increased in the plasma process chamber.

1. Field of the Invention
The present invention relates generally to a plasma process chamber and system, and more particularly to a plasma process chamber and system of the structure that is capable of improving uniformity of plasma and generation density of plasma in the plasma process chamber when carrying out a process using plasma.
2. Description of Related Art
A plasma source is used widely in several processes for manufacturing semiconductor devices, for example such as etching, stripping, cleaning, etc. A plasma process chamber is used to manufacture the semiconductor devices while the processes, such as etching, stripping, etc. are carried out using plasma gas in a process for manufacturing semiconductor devices.
In a plasma related application, how to realize stable generation of plasma and to provide high ionization efficiency for the plasma have become continuous problems to be solved by technical experts of this art. Moreover, several technical studies for increasing uniformity of the plasma have been developed continually. In a process using the plasma, plasma gas must be distributed evenly in the plasma process chamber so that the corresponding process goes on effectively.
In recent years, the size of wafers has been increased in order to improve a production rate of the semiconductors. In addition, several technical problems to be solved have been brought about in the process of manufacturing the semiconductors. One of the aforesaid problems is that a plasma process chamber capable of obtaining uniform plasma is required. Furthermore, plasma ion particles must be diffused evenly in the plasma process chamber so that the plasma process chamber can be cleaned more effectively.


The present invention provides a printed circuit board having a unique commonized pad upon which different sized surface mounted devices can be mounted. The preferred form of the commonized pad comprises two electrically conductive pads, each having a tapered portion that electrically connects a narrow portion to a wide portion. The present invention is advantageous over known pads in that it (1) allows for using different sizes of surface mounted devices without redesign and (2) it does not require wasting what might otherwise be antiquated inventory or continuation of an old process to use up what would be antiquated inventory.

Most electronic devices are now packaged with their electronic components mounted on printed circuit boards ("PCB"). PCBs have electrically conductive leads that are often connected to electrically conductive pads upon which surface mounted devices ("SMDs") can be mounted. Typically, these SMDs are resistors or capacitors. However, SMDs can also be inductors, "jumpers" (which short circuit two points), or other electrical components known to those of ordinary skill in the art. Generally, the electrical element of an SMD is carried within a ceramic or plastic package having two conductive end portions (connected internally through the electrical element) and a nonconductive center portion. To permanently connect the SMD electrically to the PCB, its conductive end portions are soldered to appropriately spaced conductive pads provided on the surface of the PCB.
Problems can arise, if known conductive pads are used, when one attempts to change the size of an SMD, for example, due to design requirements or the desire to substitute one SMD for another. For instance, it may be desired to change from the use of a large SMD (e.g., a 1206 SMD) to a small SMD (e.g., an 0805 SMD). Originally, for a large SMD, the conductive pads of the PCB would have to be larger than some minimum size in order to properly solder the conductive end portions of the SMD to the pads. However, if production changes to use a small SMD, problems arise due to the conductive pads being too big and spaced too far apart for the smaller SMD. This may result in excess solder being deposited to connect the first conductive pad of the PCB to the first conductive end portion of the small SMD and the second conductive pad to the second conductive end portion. Quite often there will be enough excess solder to bridge the gap between the conductive pads, shorting them together. If this happens, the SMD's component (i.e., resistor, capacitor, inductor, etc.) is shorted and cannot perform its intended function. Those of ordinary skill in the art will appreciate that even if the SMD is to merely serve as a jumper, a problem may arise, because excess solder could short together two electrically conductive paths that were not intended to be shorted together.
A manufacturer may use the original, large SMDs, despite a desire to substitute a smaller SMD, or may redesign the PCB with smaller more closely spaced conductive pads to better accommodate the small SMDs. The first choice simply forgoes an opportunity to substitute the smaller chip. The second choice, in addition to requiring potentially costly redesign of the PCB layout, renders any large SMD inventory a loss if production of the new PCBs redesigned for using the small SMDs starts prior to the total depletion of the large SMD inventory.

Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted


A developer conveying apparatus includes a first developer storing portion, a second developer storing portion, and a conveying pipe that connects the first and second developer storing portions. The conveying pipe includes a tubular main body and a conveying member rotatably provided in the main body. A groove is formed on a surface of the conveying member, and the groove has a depth less than or equal to 5 μm.

The present invention relates to a developer conveying apparatus and an image forming apparatus.
A conventional image forming apparatus such as a printer, a copier, a facsimile machine, a complex machine is configured to form an image as follows. A surface of a photosensitive drum is uniformly charged by a charging roller. Then, the surface of the photosensitive drum is irradiated by an LED head so that a latent image is formed thereon. The latent image is developed by a developing roller in such a manner that a toner (i.e., a developer) forming a thin layer on the developing roller adheres to the latent image. The developed image (i.e., toner image) is transferred to a recording medium by a transfer roller. The residual toner remaining on the photosensitive drum after the transferring is scrapped off therefrom by a cleaning device, and is collected by the cleaning device.
The toner collected by the cleaning device is conveyed by a developer conveying apparatus to a developer storing container. The developer conveying apparatus has a conveying tube for conveying the toner. The conveying tube extends between the cleaning device and the developer storing container.
In some cases, detachable components of the image forming apparatus are disposed in the vicinity of the conveying tube. Therefore, the conveying tube is disposed so as to be curved, in order not to interfere with attachment/detachment of the detachable components (see, for example, Japanese Laid-open Patent Publication No. 8-314348).
A conveying spiral is provided inside the conveying tube. The conveying spiral is in the form of a coil, and is rotated to convey the developer through the conveying tube. The conveying spiral is curved along the curvature of the conveying tube.

Developer conveying apparatus and image forming apparatus


After the attachment process, a substrate etching process, in which the outer surfaces of the upper and lower substrates are etched to reduce the thickness of the substrates, is performed according to the desired lightening of the substrate. However, since a main seal pattern can be damaged during the substrate etching process, a method of preventing the damage, in which a sub-seal pattern is formed, is suggested. However, if a plurality of unit liquid crystal cells is formed on one substrate, deterioration resulting from a low margin for the sub-seal patterns can occur so that a yield is decreased. In an embodiment according to the present invention, damage of the main seal pattern from the etching solution during the substrate etching process is prevented by the formation of the sub-seal patterns in the exterior of the main seal pattern, and air of the cell interior are easily vented due to the air vent portion having a proper seal pattern for ventilation. Therefore, the yields of the unit liquid crystal cells are increased.

1. Field of the Invention
The present invention relates to a liquid crystal display device and fabrication method thereof, and more particularly to a seal pattern of a liquid crystal display device and fabrication method thereof.
2. Discussion of the Related Art
A liquid crystal display (LCD) device is an apparatus that displays images according to a change of a transmittance. Two substrates are disposed having electrodes in such a way that the surfaces of the electrodes face each other. A liquid crystal layer is interposed therebetween and the liquid crystal molecules are aligned by an electric field generated from a voltage between the electrodes. The LCD device is fabricated by the processes of forming a lower substrate, referred to as an array substrate, having thin film transistors (TFTs) and pixel electrodes; forming an upper substrate, referred to as a color filter substrate, having common electrodes and color filters; forming a liquid crystal cell by aligning and attaching the substrates; injecting the liquid crystal materials; and sealing and attaching a polarization film.
In a conventional LCD device, since a plurality of liquid crystal cells are simultaneously formed on a wide area substrate, a process of cutting the substrate into the unit liquid crystal cells is needed after an assembly process.
FIG. 1 is a flow chart illustrating a fabrication process of a conventional liquid crystal cell for an LCD device.
At step ST1, the lower and upper substrates are formed that include TFTs and color filters, respectively. The lower substrate is formed by repeating deposition and patterning steps of a thin film and several masks. Recently, a fabrication process that reduces cost by decreasing the number of masks has been investigated. The upper substrate is formed by subsequently making a black matrix, red (R)/green (G)/blue (B) color filters and a common electrode. The black matrix distinguishes the color filters and prevents light leakage of a non-pixel area. The color filter can be formed by a dyeing method, a printing method, a pigment dispersion method or an electro-deposition method; the pigment dispersion method is most widely employed.
At step ST2, an orientation film that determines an initial orientation of the liquid crystal layer is formed on the upper and lower substrates. This step includes deposition and alignment of a polymeric thin film along a specific direction. An organic material of the polyimide series is mainly used as the orientation film and a rubbing method is mainly used as the aligning method of the orientation film, respectively. The rubbing method consists of rubbing the orientation film along the specific direction by a rubbing cloth, and has advantages such as easy orientation treatment, suitability to mass production, high stability of the orientation and easy controllability of a pre-tilt angle.
At step ST3, a seal pattern that forms a gap for liquid crystal material injection and prevents leakage of the liquid crystal material is formed on one substrate. The seal patterning process involves forming a desired pattern by application of a thermosetting plastic. A screen print method using a screen mask and a seal dispenser method using a dispenser are used for the seal patterning process. For the simplicity of fabrication, the screen print method has mainly been used. However, since the screen mask is not suitable for a wide substrate and a contamination by contact between the mask and the orientation film often occurs, use of the seal dispenser method has gradually increased.
At step ST4, a spacer having a specific size to maintain a precise and uniform gap between the upper and lower substrates is deposited by spraying the spacer onto one of the upper and lower substrates. The spacer spray method can be divided into two different types: a wet spray method that involves spraying a mixture of alcohol and spacer material and a dry spray method that involves spraying spacer material alone. Furthermore, the dry spray method can be sub-divided into two different types: an electrostatic spray method that uses electrostatic force, and a non-electric spray method that uses gas pressure. Since the liquid crystal cell structure is susceptible to damage from static electricity, the non-electric method is mainly used.
At step ST5, the upper and lower substrates are attached by pressure-resistant hardening of the seal pattern.
At step ST6, the attached liquid crystal substrate is divided into unit cells. A cell cutting process includes a scribe process that forms cutting lines on a surface of the substrate using a diamond pen, a hardness of which is higher than a hardness of the glass substrate, and a break process that divides the unit cells by force.
At step ST7, a liquid crystal material is injected into the unit cells. A vacuum injection method using pressure difference between the inside and outside of the unit cells is commonly used as an effective injection method. Since fine air bubbles included in the liquid crystal material can deteriorate the display property of the unit cells, a bubble-eliminating process, in which the cells are kept in a vacuum state for a long period of time, is required.
After finishing the liquid crystal material injection, an injection hole is sealed to prevent leakage of the liquid crystal material. Generally, a ultra violet (UV) curable resin is deposited onto the injection hole by use of a dispenser and then ultra violet light is irradiated on the resin, thereby hardening the resin and sealing the injection hole. Polarization films are attached on outer surfaces of the unit cell and a driving circuit is connected to the unit cell using an attachment process. After the attachment process, a substrate etching process, in which the outer surfaces of the upper and lower substrates are etched to reduce the thickness of the substrates, is performed according to the desired lightening of the substrate.
FIG. 2 is a flow chart illustrating the substrate etching process.
At step ST8, impurities made during the previous processes are eliminated. If there are impurities on the outer surfaces of the attached substrates, etching deterioration such as an under-etching in the vicinity of the impurities occurs and the surfaces of the substrates become rough. Accordingly, since a diffused reflection or a refraction of the light can occur, the impurities are eliminated with a cleaning solution such as isopropyl alcohol (IPA) or deionized water (DI).
At step ST9, the attached substrates are etched. Generally, a glass substrate is used for the liquid crystal substrate and about 60% of the substrate comprises silicon dioxide (SiO2). Therefore, the substrate can be etched with a solution of hydrofluoric (HF) acid, for example, a diluted solution with about 15% concentration, which is an etching solution for SiO2.
At step ST10 and ST11, a residue of the HF solution is removed and the substrates are dried.
However, since a seal pattern can be damaged during the substrate etching process, a method of preventing the damage by forming a dual seal pattern is suggested.
FIG. 3 is a plan view of a seal pattern for 6, 13.3-inch unit cells in the glass substrate having an area of 590×670 mm2.
As shown, 6 unit cells, "A, B, C, D, E and F" are formed on the substrate 10. Each unit cell has a main seal pattern 21 and an injection hole 22 is formed at the lower center of each main seal pattern 21. Furthermore, first, second and third sub-seal patterns 31, 32 and 33 are formed at the outer side of the main seal patterns 21 and surrounding the main seal pattern 21 of each unit cell. The sub-seal patterns 31, 32 and 33 not only have the function of protecting the main seal pattern 21 from the etching solution but also have the function of venting air between the upper and lower substrates during the attachment process. In the case of the open sub-seal patterns 31, 32 and 33 having an open portion to vent the air with ease, the permeated etching solution can cause damage to the main seal pattern 21, for example, a corrosion of pads or a substrate damage. In contrast, in the case of the closed sub-seal patterns 31, 32 and 33 without the open portion to protect the main seal pattern 21 from the etching solution, deterioration can occur, for example, light leakage or a low display quality owing to the lack of the liquid crystal material injection. Therefore, the sub-seal patterns 31, 32 and 33 are formed to have a structure to improve the above drawbacks. However, if a plurality of unit liquid crystal cells are formed on one substrate shown in FIG. 3, deterioration resulting from a low margin of the sub-seal patterns 31, 32 and 33 can occur so that a yield is only about 60% to 70%.

Seal pattern for liquid crystal display device and forming method thereof


An orthodontic bracket is provided that includes a cover and a base, wherein the cover can be rotated over an arch wire slot in the base portion. The present bracket invention operates to close when a frangible portion is severed upon initiating rotation of the cover, such that the cover rotates about a hinge, which may include a pin or axle. In one embodiment of the invention, the pin or axle can be moved laterally and/or vertically after the frangible portion is severed. Preferably, the bracket is manufactured to form one piece, such as using an injection molding, machining, or casting process. The bracket offers economical advantages because additional subsequent assembly is not required to attach a cover to a base.

Orthodontic brackets are secured to a patient's teeth for use in selectively straightening the patient's teeth. One type of orthodontic bracket known in the art includes a base having a slot formed thereon. The slot is configured to receive an archwire that extends between different teeth. A separate cover plate is removably attached to the base for use in securing the archwire to the base. One example of the above orthodontic bracket is disclosed in U.S. Pat. No. 4,712,999.

Orthodontic bracket with frangible cover mechanism


A self-checkout system for controlling an exit of a checkout area (110) is provided. The system comprises a sensor arrangement (120) comprising at least one sensor (140), wherein the sensor arrangement (120) is configured to track, by the at least one sensor (140), a person being inside the checkout area (110), receive a payment signal confirming a successful payment by a person (1), receive an exit detection signal, from the at least one sensor (140) representing that a person (1) is at a predetermined distance from the exit in the checkout area (110), and determine if the exit detection signal and the payment signal correspond to the same person (1), and if so transmit an opening signal to said exit so that said person (1) is allowed to exit the area (110).

In today's stores many different articles, such as food products, hygiene articles, clothing, textures, etc. may be purchased which all have different sizes and shapes. Normally, a checkout operator handles each article manually and makes sure that the article is associated with the correct pricing at checkout for payment by the customer. This is traditionally done either by manually inputting the price, by scanning a barcode attached to the article, or a combination of those. However, automatic checkout counters are becoming an interesting alternative for retail stores and supermarkets. Such checkout counters provides safe and easy handling of articles and they normally include different components for identifying the article accurately.
In order to prevent customer from taking articles outside the store without paying for the item, the store and/or articles therein may be part of a surveillance system. The surveillance system may include a security tag that is removable attached to the article and/or the shopping areas are equipped with gates for allowing or preventing customers from entering or exiting the shopping areas through the gates. For example, automatic checkout counters may be equipped with exit gates which may be closed during the purchase, and opened only when the customer scans the receipt after payment. Consequently the gate opens upon purchase verification and is returned to its closed position immediately after.
Having to scan the receipt in order to get out has several drawbacks. The customer may be carrying several bags with his/hers purchased items and thus having difficulties in scanning the receipt without having to put down the bags to the ground. Secondly, the customer may have thrown away the receipt or, where it is possible, have chosen not to be given a receipt.
An important aspect of automatic checkout counters is to improve the user experience while still remaining high security levels. Therefore, there is a need for an improved store exit system that prevents or at least decreases the risk of stealing while at the same time being easy and convenient for the costumer.


Methods and systems for synchronizing communication of different versions of an advertisement to multiple, disparate devices associated with a user are provided. The advertisement is received on a first device associated with the user. Incident to receiving the advertisement, the first device establishes a communication path with a second device associated with the user. Utilizing the communication path, capabilities of the second device are determined. A version of the advertisement is rendered for the second device, where the version rendered is dependent upon the determined capabilities of the second device. And, utilizing the communication path, the rendered version of the advertisement is communicated to the second device.

Currently advertisers who wish to market a product have to launch multiple advertisement campaigns across different devices in order to take advantage of the capabilities of the different devices. For example, an advertiser may wish to market a new car. The advertiser generates one advertisement campaign that is geared towards television and which emphasizes visual elements as these elements are best shown on a television. The advertiser then generates another advertisement campaign that is designed to take advantage of the capabilities of a cellular phone. For example, a location and a phone number of a dealership that sells the car are highlighted in the cellular phone campaign as these elements find their best expression on a cellular phone. The result is that the advertiser ends up funding multiple campaigns across the different devices—an expensive and inefficient proposition for the advertiser.
An additional problem with generating multiple campaigns across different devices is that the advertiser does not know which advertising campaign actually spurred the consumer to take action. For example, a consumer may view a company's advertisement on a television. The consumer later conducts a Web search on a computer for the company; at this point, the consumer decides to purchase a product from the company using the computer. From the advertiser's perspective, it appears that the Web search drove the consumer's response, when, in actuality, it was the television advertisement that led the consumer to buy the product.
Another problem for advertisers occurs when an advertising campaign runs late at night. With respect to the advertisement campaign concerning the car, the advertisement might require the consumer to call a dealership's phone number to take advantage of special deal terms. But if the advertisement is run late at night, it is likely too late to call the number. In addition, the consumer will have likely forgotten the phone number by the time morning arrives. The result is a loss of potential customers.
Yet another problem for advertisers is the lack of portability of some of the advertisements. For example, a personal computer may display a coupon for $10 off a pizza. However, the personal computer is not portable. Instead, the consumer has to print off the coupon and bring the coupon in to the pizza establishment. This can be problematic if the consumer does not have ready access to a printer.
An additional problem from a consumer or user's perspective is the inability to transfer a set of search results from one device to another device. For instance, a user may run a search on a cellular phone and be very pleased with the search results. However, the user cannot easily transfer the search results to another device. Instead, the user is forced to rerun the search on the new device and could potentially end up with a different set of results that are less helpful.

Advertisement rendering for multiple synced devices


A method for controlling injection in a die casting machine and apparatus for the same capable of producing high-quality die-casting products, which are not produced with fins, even in a high-speed cast or the use of the die with a low precision. A pressurizing controllable valve (21) is a flow adjustable type. A main spool (211) is structured to have a two-way valve (212) with a check-valve function and a position detector (213) for controlling servo, so that the flow of hydraulic fluid charged to a pressurizing cylinder device 20 is not controlled to be switched between ON-OFF but is allowed to adjustably flow, and a pressurizing process is controlled in response to a fin critical curve, thereby fins are previously avoided to be produced, thus producing the high-quality die-casting productions.

1. Field of the Invention
This invention relates to a method for controlling injection in a die casting machine and apparatus for controlling the same, more particularly, to an injecting control in a die casting machine capable of producing a high-quality die-casting product without fins.
2. Description of the Related Art
It is conventionally known that quality of a die-casting product is greatly influenced by an injection velocity or an injection pressure when molten material is fed into a die. Particularly, a sufficient pressurization is needed before the molten material is coagulated, therefore, a die casting machine having a two-stage driving cylinder device for injection and pressurization has been used.
Generally, in the aforementioned type die casting machine, after an injection plunger is advanced at low-speeds, the molten material is started feeding into a die cavity to avoid foaming the molten material and so on. The end of the molten material reaches a gate portion of the die, thereby the pressure of the injection cylinder device for feeding is increased. After that, the injection plunger is advanced at high-speeds to avoid decreasing the temperature of the molten material, and then the molten resin is rapidly fed into the die cavity.
Following an injection process as described above, at the time the pressure of the injection cylinder device is further increased by filling the die with the molten material or at the time the injection plunger is advanced to a predetermined position corresponding to completion of feeding, a high-pressure is added to the injection cylinder device by a pressurizing cylinder device to operate a pressurizing process for increasing the pressurization to the molten material fed into the die by the injection plunger.
(Concrete explanation of the conventional die casting machine of a pressurizing system)
The conventional die casting machine of the two-stage cylinder pressurizing system will be explained in detail below.
In the die casting machine 90 shown in FIG. 7, a molten material 92 fed into the die cavity 91 is charged into an injection sleeve 93, and injected by driving an injection plunger 94 by using an injection cylinder device 95 for feeding. And further, hydraulic fluid charged in a back side of the injection cylinder device 95 is charged with pressure at the high-pressure by using a pressurizing cylinder device 96 having a larger diameter after the feeding of molten material 92 is completed, the molten material 92 fed into the die cavity 91 is pressurized through the injection cylinder device 95.
FIG. 8 shows injection velocity change CV and injection pressure change CP in an injecting process to a pressurizing process in the die casting machine 90. In the drawing, the injection cylinder device 95 is advanced at a low-velocity VL at the outset, and, begins advanced at high-velocity VH at time t1 to feed the molten material 92 in a stroke, after that it is braked by receiving a feeding pressure of the molten material as feeding finishes. At time t2, the pressurizing cylinder 96 is driven to pressurize the molten material, thereby a pressure of the molten material 92 fed into the die cavity 91 reaches a pressure PH, and then the injection cylinder 95 is further advanced and stopped at time t3. This stopping point is a stroke end of the injection cylinder device 95.
For a linking control between the injection cylinder device 95 and the pressurizing cylinder device 96 in the die casting machine 90 (changing from the injecting process to the pressurizing process) as described above, a sequence valve system, in which the change is carried out with detection of an injection-pressure fluctuation, or a limit switch system, in which the change is carried out with detection of an advanced position of the injection plunger, is employed.
(Oil hydraulic circuit in the sequence valve system)
The following oil hydraulic circuit is used in the sequence valve system.
As shown in FIG. 9, the injection cylinder device 95 is connected with an injection oil hydraulic circuit 114 leading through a check valve 111 and an injection velocity adjusting valve 112 to an accumulator 113. The pressurizing cylinder device 96 is connected with a pressurizing oil hydraulic circuit 117 leading through a pressurizing controlling valve 116 of a pilot operation, opened by a sequence valve 115, to the accumulator 113.
The sequence valve 115 is defined to open the pressurizing controlling valve 116 when the pressure of the injection oil hydraulic circuit 114 exceeds a predetermined pressurizing-start pressure. Therefore, the injection cylinder device 95 is started advancing to inject by operating the injection velocity adjusting valve 112, and the feeding pressure is increased with the complete feed of the molten material into the die and reaches the predetermined pressurizing-start pressure, whereupon the sequence valve 115 is driven to open the pressurizing controlling valve 116, and then the pressurization is performed by starting advancing the pressurizing cylinder device 96.
FIG. 10 concretely shows a surrounding area of the injection cylinder device 95 and the pressurizing cylinder device 96.
The injection cylinder device 95 has an injection piston 95A therein, in which the injection piston 95A is advanced by an oil pressure of hydraulic fluid charged from the injection oil hydraulic circuit 114 to the back side of the injection piston 95A. The hydraulic fluid charged from the injection oil hydraulic circuit 114 flows to be adjusted by injection velocity adjusting valve 112, whereby the injection piston 95A is switched between advance and stop and an advancing velocity is adjusted.
The pressurizing cylinder device 96 has a pressurization piston 96A therein, in which the pressurization piston 96A is advanced by an oil pressure of hydraulic fluid charged from the pressurizing oil hydraulic circuit 117 to the back side of the pressurization piston 96A, thereby the injection piston 95A is pressed from the back side thereof through an intermediate member 95B of the injection cylinder device 95. The hydraulic fluid charged from the pressurizing oil hydraulic circuit 117 is intermittently controlled by the pressurizing controllable valve 116, whereby the pressurizing piston 96A is switched between advance and stop.
Intermittence of the pressurizing controllable valve 116 is carried out by the sequence valve 115. As the sequence valve 115, a solenoid valve, changing based on the feeding pressure by appropriate means, or the like is used.
Incidentally, in the conventional two-stage die casting machine as described above, the flow of the hydraulic fluid charged to the pressurizing cylinder device is fixed without an adjustable control in the pressurizing process in which the injection cylinder device is pressurized with the pressurizing cylinder device. Because, the hydraulic fluid charged to the pressurizing cylinder device is intermitted in the pressurizing controllable valve, in which a constant flow valve of an ON-OFF two-point switching type is conventionally used as the pressurizing controllable valve.
The hydraulic fluid is charged to the pressurizing cylinder device at a constant flow, so that a pressurizing properties of a casting pressure is to be the injection pressure change CP as shown in FIG. 8, in which the upturned curve makes a quadratic curve becoming gradually gentle slope as approaching the highest pressure PH. This is why the injection plunger receives resistance as the molten material in the die is being coagulated, so that the pressurization becomes slow. Concretely, the casting pressure P is proportional to the square root of the product of an elapsed time t and a coefficient a.
On the other hand, a fin critical pressurizing curve is known in the pressurizing process. The molten material leaks from a parting line of the dies when the exceeding pressure is added to the die in the pressurization, with the result that fins are produced. But, fins are not produced when the pressure is less than the fin critical pressurizing curve. The fin critical curve is given as a curve CX in which the casting pressure P is proportional to the product of the coefficient a and the square of the elapsed time t (see FIG. 8).
The reason why the fin critical curve CX is to be the quadratic curve as described above is because the molten material in the die, which does not coagulate in the early stage of the pressurization, easily leaks from the parting line in view of the high flow characteristics of the molten material, so that the high pressure cannot be added, but the molten material hardly leaks from the parting line after beginning to coagulate with the passage of time, so that fins are not produced although the high pressure is added.
In the aforementioned conventional die casting machine, however, the hydraulic fluid is charged to the pressurizing cylinder device in the constant flow, therefore, the pressurizing properties of the casting pressure is not allowed to approach the fin critical curve. As a result, the conventional die casting machine is presented with a disadvantage that the good quality die-casting products cannot be produced in view of substantially produced fins in the high-speed cast or the use of the die having the parting line with a low precision.
It is an object of the present invention to provide the method for injecting in the die casting machine and the apparatus for the same capable of producing the high-quality die-casting products, which are not produced with fins, even in a high-speed cast or the use of the die with a low precision.

Method for controlling injection in a die casting machine and apparatus for the same


Metallic clothing having metallic wire teeth bent at a double angle. The lower portion of each tooth is angled by an first angle with respect to vertical, and the upper portion is angled at a second angle with respect to vertical. The upper portion terminates at the tip, or point, of the tooth. This double-angle tooth profile is angled in the direction opposite to the general direction of travel of fibers being carded. The upper side portion of each tooth is tapered inwardly to the tip, and the rear edge of the upper end of each tooth may be provided with a forward curvature towards the point of the tooth. Alternate embodiments include single angled teeth and a double-angled teeth, each having a base portion substantially the same height as the teeth.

This invention relates generally to metallic clothing with teeth having a double-angled profile, a tapered tip, and a radiused point for use on carding segments and carding flats.
Carding flats and stationary carding segments are generally used in carding machines about the main carding cylinder and produce a carding interface therebetween. Carding flats may also remove trash and non-spinnable fibers during carding. Conventional carding flats often involve the use of flexible wire clothing, which is attached to the flats themselves via adhesive, or some other fastening means. The flexible clothing is produced by providing a flexible substrate, which could be fabric, rubber, plastic, leather, or some combination thereof. The wire clothing is essentially "stapled" through the substrate. After the staples have been inserted through the substrate, the ends of the staples, i.e., the "wires," are subsequently bent at a forward angle and are ground to produce a desired profile.
Production of flexible clothing is relatively labor-intensive and expensive because of the required bending and grinding of the wires after their insertion through the substrate.
Metallic clothing is also known. Metallic clothing does not require a pliable substrate as does flexible clothing, but instead is comprised of a series of wire segments which are stacked side-by-side against each one another in a channel formed in an elongated holder. This holder can be produced of a material such as plastic, or some other material, and is subsequently attached to the flat or carding segment itself via adhesive, clips, or some other fastening means. The advantages of metallic wire clothing are that it is easier to produce and offers longer life. However, in certain applications metallic clothing may tend to not remove trash and non-spinnable fibers as well as does conventional flexible card clothing.
Accordingly, there exists a need for metallic clothing having an improved ability to remove trash and non-spinnable fibers.

Metallic clothing for carding segments and flats


The invention relates to a motion detector comprising at least of one accelerometer and corresponding control electronics encapsulated in an enclosure with means for attaching the enclosure to a moving body. In accordance with the invention the motion detector includes means for turning, aligning and locking the detector in any desired direction relative to the moving body with the help of the enclosure.

The invention comprises means for encapsulating and attaching a motion detector on surfaces of practically any orientation, whereas the detector thereafter easily can be turned, aligned and locked into a direction that is advantageous for the measurement application. The detector can thereafter easily and rapidly be removed and reinstalled without further need for re-alignment. The aim with the invention is to essentially lower the cost of installation and ownership and through a more accurate initial positioning form a basis for an installation calibration resulting in a better performance of the measurement.
In many measurement applications it is difficult to find a good location where the sensor or measurement instrument can be installed. Depending on the type of sensor and the measurement application it sometimes might be advantageous to install the unit in a location only surrounded by inclined surfaces, despite that the proper functionality would require the sensor to be turned differently. This is especially the case with motion detectors which, depending on the setup, should be installed in a particular location and/or direction relative to the body which motions will be measured. With a motion detector we here mean a sensor consisting either of either                a one, two or three dimensional accelerometer,        the aforesaid accelerometer with a one, two or three dimensional gyro,        the aforesaid accelerometer with a one, two or three dimensional magnetometer or        the aforesaid accelerometer with a one, two or three dimensional gyro and with a one, two or three dimensional magnetometer
In the three latter cases the measurement axis or axes of the gyro, the magnetometer or both are assumed to be parallel with one, two or three of the accelerometer's axes. With a three dimensional accelerometer we understand a device that has three accelerometers, the measurement axes of which are perpendicular to each other. With a three dimensional gyro we understand a device that has three gyros, the measurement axes of which are perpendicular or in known angles to each other. Consequently a three dimensional magnetometer is a device that has three magnetometers, the measurement axes of which are perpendicular to each other. Correspondingly a two dimensional accelerometer or gyro or magnetometer has two axes which are perpendicular to each other.
Although there are motion detectors for many applications, the majority of motion detectors on the market are encapsulated in traditional box shaped enclosures intended for direct mounting on a flat surface. Sometimes these enclosures have mounting flanges or ears, which enable attachment on the wall without the need to open the detector cover. Also motion detectors with cylindrically shaped enclosures with or without mounting flanges are available. Some of the mounting flanges or ears have extended holes or grooves in order to enable fine adjustment.
Box shaped or cylindrical motion detector enclosures are well suited for many applications, but sometimes there is a need to install the detector on an inclined surface and if this is the case the detector must, depending on the application, often be installed on a wedge-shaped support or with long screws with nuts for fine adjustment or alternatively the measured motions must afterwards numerically be converted to another coordinate system. All three options solve the measurement problem technically, but add complexity to the installation. A wedge-shaped support or long screws with nuts might easily also be considered as makeshifts or temporary. Numerical conversion on the other hand requires measurement of the mounting angle, feeding in this info into the processing system and more data processing. The latter could also be accomplished by using of some kind of automatic re-calibration, but also this requires time, knowledge on the status of the body on which the motion detector is attached, caution and obviously also additional data processing. If the body is a vehicle, boat etc. re-calibration can typically only be done when the body is stationary or in another known state.
In conclusion—If highest possible measurement performance is required and if motion detectors with traditional enclosures must be installed on inclined surfaces, this installation work can in practice currently only be accomplished by a professional technician, who carefully takes the special conditions into consideration. This increases the overall system price and which is especially noticeable in systems intended for price critical volume or consumer applications such as small or medium sized yachts and boats.


An apparatus for supporting recovery of the vehicle if the vehicle is stolen includes a determining unit that determines whether the vehicle is being stolen. A camera judges a state of the vehicle and an environment around the vehicle. When the determining unit determines that the vehicle is being stolen, a horn of the vehicle is automatically honked.

1. Field of the Invention
The present invention relates to a technology for recovering a stolen vehicle.
2. Description of the Related Art
There is known a technology for monitoring a vehicle and its surroundings while the driver is away from the vehicle to detect and prevent theft of a vehicle or theft of articles from a vehicle.
Japanese Patent Application Laid Open No. 2002-257013 discloses a technology for preventing auto theft by locking the engine with an immobilizer when theft is detected. Japanese Patent Application Laid Open No. 2003-157483 discloses a technology for photographing the surroundings of a vehicle when an object approaches the vehicle, and transmitting the photographed image when a fraudulent act is committed.
Japanese Patent Application Laid Open No. 2000-142323 discloses a stolen-vehicle prevention device that sets off an alarm when theft is detected based on a change of a connection status of an anti-theft warning member incorporated in a junction box of, for example, an ignition key. Japanese Patent Application Laid Open No. 2002-316617 discloses a technology for recovering a stolen vehicle by deploying an airbag to obstruct a thief from driving the vehicle.
When a vehicle is stolen, the vehicle is in most cases driven or transported to be moved away from the original parking space. Most conventional technologies' attempts to interrupt theft of the vehicle before the vehicle is moved.
A stolen vehicle is not always used as is; its external and/or internal appearance is changed, or it is disassembled so that parts can be sold. Therefore, a stolen vehicle needs to be recovered quickly.
Moreover, a recovering means as disclosed in Japanese Patent Application Laid Open No. 2002-316617 is automatically activated, which might cause an adverse effect. Thus, there is a need to develop a technology for quickly and reliably recovering a stolen vehicle after the vehicle is moved away from the original parking space.

Stolen vehicle recovery support apparatus


A wireless home entertainment system consistent with certain embodiments has at least one server having at least one manipulable authentication element thereon, wherein the manipulable authentication element is not a general purpose data entry element. At least one component is in wireless communication with the server. A User Interface is used for selecting an authenticated component to be de-authenticated. A person can cause the server to regard an authenticated component as being de-authenticated by manipulating the authentication element while a component to be de-authenticated is selected using the user interface. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

In-home wireless entertainment systems can include a central server and various components that are in wireless communication with the server and that are dispersed throughout the house. For examples, TVs, digital video disk (DVD) recorders, VCRs, Digital Video Recorders, telephones, personal digital assistants (PDAs), appliances, and so on may all be linked in a wireless entertainment system.
In a wired system, authentication and de-authentication is not generally a problem, since a component must be physically present in the home to communicate with the system. In a wireless system, however, it is possible for an eavesdropper or otherwise unauthorized person outside the home to access the system using the wireless network, which typically extends beyond the walls of the house.
Currently, wireless components are authenticated during "set up" using procedures that, for many consumers, can be confusing and complicated, and furthermore that might be less than secure. When a component is to be de-authenticated (e.g., if a device is sold or replaced or otherwise removed from the network) it is also generally advisable to de-authenticate the device from the network so that it is no longer able to communicate with the network, and thus inhibit unauthorized intrusion into the network. This process is also often confusing and complicated to the ordinary consumer.

This patent is subject to a terminal disclaimer.


The disclosed invention relates to a wind power generation device for a window trim frame, the wind power generation device: enabling alignment and provision in a prefabricated manner so as to fit the size of a window trim frame or the window frame of a general house or a building such that the installation thereof is simplified; manufactured in a small size such that purchase and production costs are relatively lower than those of other power generation facilities and the like; and charging, with produced electric energy, a storage battery provided at the end thereof and, simultaneously, enabling a charging completion to be immediately checked, thereby easily being used.

Wind power generation is a typical eco-friendly power generation method that uses wind to produce electricity. In particular, since the 1990s, the green power generation facility which is a green power plant has emerged as an alternative to thermal power generation and nuclear power generation due to the global greenhouse gas and climate problems, and is currently rapidly advancing.
Generally, a wind power generation apparatus has a principle of generating kinetic energy through rotational force of a blade to rotate a transmission gear of a transmission, and converting the kinetic energy into electric energy through a generator. The wind power generation apparatus may be classified into a horizontal axis wind power generation apparatus ("horizontal axis wind turbine") and a vertical axis wind power generation apparatus ("vertical axis wind turbine").
The wind power generation apparatus is usually installed on a large scale in windy mountainous areas or coastal areas. On the other hand, solar cell equipment, which is one of the eco-friendly power generation facilities, is frequently installed in houses and buildings.
However, the wind power generation apparatus installed in mountainous areas and/or coastal areas is difficult to move to other sites after installation and is disadvantageous in that the apparatus is installed on a large scale, thus involving high initial construction costs, although it is environmentally friendly.
In addition, in the case of solar cell equipment used in general houses or buildings, maintenance services may be possible by, for example, local governments. However, like the wind power generation apparatus, the solar cell equipment also needs high initial construction costs and entails a limitation of being usable only when solar energy can be supplied.

Wind power generation device for window trim frame


A method and apparatus for the measurement of wafer thickness, flatness and the trench depth of any trenches etched thereon using the back surface of the wafer to accurately measure the back side of a trench, rendering the trench an effective bump, capable of being measured on the top surface and the bottom surface through a non-contact optical instrument that simultaneously measures the wavelength of the top surface and bottom surface of the wafer, converting the distance between wavelengths to a thickness measurement, using a light source that renders the material of which the wafer is composed transparent in that wavelength range, i.e., using the near infrared region for measuring the thickness and trench depth measurement of wafers made of silicon, which is opaque in the visible region and transparent in the near infrared region. Thickness and flatness, as well as localized shape, can also be measured using a calibration method that utilizes a pair of optical styli.

1. Field of the Invention
The present invention relates generally to the field of the measurement of silicon wafers used in the production of semiconductors, and particularly to the measurement of the thickness of thin wafers, the flatness and localized shape of thin wafers and the depth of trenches etched thereon.
2. Description of the Prior Art
When making semiconductors, manufacturers start with blank silicon wafers. Many processes are performed on them before the completed semiconductors are complete and a large number of these processes involve placing images of a photo mask on the wafer. The various images must overlay each other with great accuracy. As the size of the features on the wafer shrink, the accuracy with which each layer must overlay increases.
The size of features being placed on wafers now is at such a tight level that even the shape of the wafer can effect the quality of the photo processes. Imagine a wafer with the shape of a potato chip. The wafer is so warped that the masks can never be aligned because the optical equipment cannot focus on the entire surface at once. This type of problem is costly to semiconductor manufacturers due to reduced yields. An instrument that accurately and reliably measures the flatness and thickness of a wafer would help these manufacturers improve their process and produce better ICs with greater yield.
The present technique that is most popular for measuring the thickness of a wafer is called a capacitance test. The wafer is placed between two electrodes and the material in between causes a change in capacitance. The change in capacitance is a direct measure of the amount and type of material between the electrodes.
For many years this technique has worked reliably. The limitations and shortcomings of this technique have only recently become significant as the accuracy of the required measurement increases and the wafers have become significantly thinner.
One of the shortcomings of this technique is that detailed information is needed about the properties of the wafer material, such as its relative permittivity. This can be problematic if the wafer has multiple materials or is bumped with solder bumps.
Another shortcoming is that the number of locations where the thickness can be measured is small, due to the relatively large size of the capacitance sensors. Typically the number of locations is about 10 for a 4-inch wafer and about 30 for a 12-inch wafer. A manufacturer would ideally want to know detailed height and thickness information over the entire wafer, not just a small number of locations. Additionally, the accuracy of the measurements is a question as the measurement is essentially an average thickness over the area of the capacitance sensor.
The area of the capacitance sensor is typically about ½ inch in diameter. More importantly, however, is that the resolution of the capacitance sensors is no longer fine enough to satisfy the increasingly tight requirements of the manufacturers. With late generation wafers having a thickness of between 800 and 200 microns, and expectations that future generations will be as thin as 40 microns, the measurement accuracy needs to be 0.1 micron or smaller.
Related to the problem of measurement of the thickness of thin wafers is the problem of measuring trench depth on wafers. When processing semiconductor wafers into devices, such as integrated circuits, micro-electro-mechanical systems (MEMS), and integrated photonic devices, manufacturers perform many processes, some of which include etching trenches into the wafer. For many of these devices, the depth of the etched trench is critical to the proper performance of the finished device, and the manufacturers typically desire to measure its depth. However, current methods of measuring the trench are severely limited.
MEMS products typically contain three-dimensional structures with regions of deep, narrow trenches with near-vertical sidewalls. A typical example is a trench etched 5 microns wide by 100 microns deep. MEMS devices with these characteristics include sensors, actuators, and RF devices such as inductors and comb switches. All of these devices characteristically require deep vertical etching processes to separate moving mechanical parts, and finger-like features are very common.
Manufacturers of MEMS devices do not currently have an accurate and inexpensive method to non-destructively measure the depth of etched high aspect ratio trenches. They need to have precise control over etch depth to produce a working device, and the measurement of etch depth is very important for process development and control. Current metrology technology cannot measure the depth of high aspect ratio trenches with speed and accuracy. Thus, the development of a non-contact metrology instrument that quickly and accurately measures the etched depth of high aspect ratio trenches, such as those formed by narrow finger-like structures, would greatly benefit MEMS manufacturers in process development and control.
Integrated circuits often require deep trenches etched in the wafer to electrically isolate neighboring circuit devices, such as transistors. Space on the wafer is always an important consideration, and yet the trench must be deep enough to provide the required isolation. Thus, the aspect ratio of these etched trenches is increasing with improvements in technology. Currently, these trenches can be one micron or smaller wide and six microns or more deep. In addition, these trenches typically have rounded or rough bottoms that absorb any incident light. Manufacturers need to measure the depth of these trenches for process control and characterization. Currently, the only method to measure these trenches involves destructively cutting the wafer.
Integrated photonics devices are typically fabricated on materials other than silicon, or in layers of materials "grown" on top of silicon. Examples are SiC, InP, GaAIAs, and silicon nitride. These devices are etched structures to form waveguides, lasers, and other photonic devices. The shape parameters of the etched structures are very important to the performance of photonic devices. The current invention relates to the measurement of deep trenches in a wide variety of materials, such as the above examples as well as the thickness of the wafer.
Because of the very steep sidewalls inherent in such trench structures, profiling instruments that use a stylus or other method of contact cannot accommodate an aspect ratio or lateral dimension of this nature. For example, atomic force microscopes (AFM) and stylus profilers are not suitable because even if the tip could penetrate the trench, it would not be able to follow the side wall, and the tip would break when exiting the trench.
Standard non-contact optical instruments for measuring surface height are confocal microscopes, white light interferometers, phase shift interferometers, and triangulation techniques. All of these optical techniques involve some manner of illuminating the trench and analyzing the reflected light. However, the steep walls of the trench prevent much of the light from reaching the bottom of the trench. In addition, some etched trenches may have rounded or rough bottoms. The light that enters these trenches might be completely absorbed. If there is no light returned, then no method of analysis can possibly determine the depth of the trench. Aside from these fundamental problems, each of the listed non-contact methods has problems unique to that particular method.
Standard confocal microscopes fail because they confuse the signal from the top of the trench with the signal from the bottom when the trench is too narrow. When the width of the trench approaches the size of the source pinhole, as much or more light will be detected when the focus is on top of the trench as when it is at the bottom. Thus, a confusing signal is generated even when the bottom of the trench is far away from the focal plane. Confocal microscopes are also very slow since they require scanning the measurement sample axially to find the plane of best focus.
White light interferometers have similar difficulties in that they are slow and must scan axially. In addition, the fringe signal is weak due to the light scattered from the walls and the top. Phase shift interferometers fail outright because phase unwrapping fails to detect steep sidewalls. Finally, triangulation techniques can only succeed if precise control of the direction of the incident beam relative to the direction of the trench is maintained so that the light can get into the trench from the side. This constraint makes such an instrument infeasible.
All of the prior art methods described above have in common the fact that they attempt to measure the trenches from above, that is, the optical beam or mechanical stylus approaches the trench from the same side as the surface that was etched.


New strains of microorganisms producing anti-Campylobacter metabolites have been identified which have the ability to utilize mucin as a sole substrate for growth and the ability to reduce and/or inhibit the incidence of Campylobacter jejuni colonization in poultry.

Campylobacter jejuni (C. jejuni) is recognized as the leading cause of acute bacterial gastroenteritis in the United States and many developed countries (Blaser, M. J., et al., 1983; Butzler, J. P., et al., 1979; Rettig, P. J., 1979). A variety of wild and domestic animals are intestinal carriers and are recognized reservoirs of the organism (Soerjadi-Liem, A. S., et al., 1984). Although these animals often excrete 10.sup.4 -10.sup.8 C. jejuni per gram of feces, they are typically asymptomatic (Grant, I. H., et al., 1980; Oosterom, J., et al., 1983; Wempe, J. M., et al., 1983). Surveys reveal between 30 and 100% of poultry carry the organism (Grant. I. H., et al., 1980; Oosterom, J., et al., 1983; Prescott, J. F., et al., 1981; Shanker, S., et al., 1986; Shanker, S., et al., 1990; Stern, N. J., et al., 1988; Stern, N. J., et al., 1985; Varga. J., et al., 1990; Wempe, J. M., et al., 1983). Serotypes of C. jejuni frequently involved in human infection are often the same as those isolated from poultry. Investigations of outbreaks and sporadic cases of Campylobacter enteritis have revealed poultry is a principal vehicle of illness (Brouwer, R., et al., 1979; Deming, M. S., et al., 1987; Grant, I. H., et al., 1980; Harris, N. V., et al., 1986; Hopkins, R. S., et al., 1983; Hopkins, R. S., et al., 1984; Istre, G. R., et al., 1984; Norkrans, G., et al., 1982; Rosenfield, J. A., et al., 1985).
C. jejuni is disseminated from live birds to dressed carcasses and poultry parts during processing (Baker, R. C., et al., 1987). Results of a large national survey of retail meats and poultry revealed that C. jejuni contaminated 30% of fresh chickens and only 5.1% of red meats (Stern, N. J., et al., 1985). Similarly, Harris et al. (1986) reported C. jejuni/coli contamination of 23% of 862 retail chickens but infrequent contamination of retail turkey, beef, and pork. Studies by Kinde et al. (1983) revealed up to 83% of retail chickens were contaminated with C. jejuni. A prospective case-control study by the Seattle-King County Public Health Department revealed that approximately half of the cases of Campylobacter enteritis were associated with ingestion of poultry products (Rettig, P. J., 1979). Deming et al. (1987) identified consumption of chicken or contact with cats or kittens as the major risk factors involved in sporadic cases of Campylobacter enteritis, among college students, implicating chicken as a vehicle in about 70% of the cases. Hence, poultry appears to be the major vehicle of Campylobacter enteritis in the United States.
Studies of chicks perorally inoculated with C. jejuni reveal that the birds are readily colonized by C. jejuni (Beery, J. T., et al., 1988; Kaino, K., et al., 1988; Sanyal, S. C., et al., 1984; Shanker, S., et al., 1988; Soerjadi. A. S., et al., 1982; Soerjadi-Liem, A. S., et al., 1984; Stern, N. J., et al., 1989), with the ceca being the primary sites of localization (Beery, J. T., et al., 1988). Histologic examination of these ceca revealed campylobacters localize in the lumen of mucus-filled crypts. Campylobacters appear to colonize the crypt mucus without attaching to the microvilli (Beery, J. T., et al., 1988). Hugdahl et al. (1988), studying the chemotactic behavior of C. jejuni, observed that the organism is attracted to mucin, and specifically to L-fucose which is a component of mucin. Mucin, a high molecular weight glycoprotein, is the principal constituent of mucus. In addition to its chemoattractant properties, mucin also can be utilized by C. jejuni as a sole substrate for growth (Hugdahl, M. B., et al., 1988).
Before the present invention, it had been difficult to isolate any active ingredients which combat the colonization of C. jejuni in poultry. Because of the detrimental effects of C. jejuni on humans resulting from transmission by poultry, there is a definite need for an effective treatment and control of the colonization of C. jejuni in poultry.

Control of campylobacter jejuni colonization


A speaker capable of emitting light includes a housing, a plurality of light generators, and a speaker core. The housing formed by material capable of conducting light, used as a speaker chamber of the speaker, has a first opening and a second opening. The plurality of light generators is formed nearby the second opening for generating light. The speaker core is set in the first opening of the housing for generating sound.

1. Field of the Invention
The present invention relates to a speaker capable of emitting light, and more particularly, to a speaker with a housing formed as a speaker chamber of the speaker and for conducting light generated by light generators, so as to have a function of emitting light.
2. Description of the Prior Art
With technological advancement, processing speeds of electronic devices become faster and faster, while sizes of the devices become smaller and smaller. Thus, generally speaking, the electronic devices nowadays already satisfy basic demands of consumers, such that more and more attention is paid to multimedia functions of the electronic devices. Taking computers for example, when basic calculation performance reaches basic requests of the consumers, multimedia effects of the computers become a focus for choosing such products. Among multimedia devices of computers, speakers are basic equipment, designed for generating sound originally, however, no longer satisfies consumers anymore. Therefore, except for generating sound, the speakers should have a function of emitting light, so as to attract consumers.
Please refer to FIG. 1, which is a cross-section diagram of a prior art speaker 10 with a function of emitting light. The speaker 10 includes a speaker chamber 110, a speaker core 120, a light pipe 130 and light emitting diodes (LED) D1 and D2. The speaker chamber 110 includes an opening 115 utilized for installing the speaker core 120. Functions of the speaker chamber 110 and the speaker core 120 are well known for those skilled in the art, and thus are not repeated here. The light pipe 130 is installed on the opening 115 of the speaker chamber 110, and is utilized for providing a light propagation path to conduct light emitted by the LEDs D1 and D2. Therefore, the speaker 10 not only generates sound by the speaker core 120, but also propagates and emits light by the light pipe 130 installed on the opening 115 of the speaker chamber.
Please proceed to FIG. 2, which is a schematic diagram of the light pipe 130 installed on the opening 115 of the speaker chamber. The light pipe 130 includes an acrylic ring 132, a reflector 134, a diffuser 136 and a circuit board 138. The acrylic ring 132 can be considered as a light carrier, and includes a first light reception terminal 1320 and a second light reception terminal 1325 for receiving light emitted by the LEDs D1 and D2 respectively. The reflector 134 and the diffuser 136 are respectively installed on the top and the bottom of the light pipe 130, which are utilized for propagating the light emitted by the LEDs D1 and D2 evenly, and the light propagation direction is as shown in FIG. 2. The circuit board 138 is utilized for attaching the LEDs D1 and D2 and for laying out related circuits. Moreover, the light pipe 130 can include a fixture (not shown in FIG. 2) for assembling the light pipe 130 on the speaker chamber. Since the light pipe 130 needs to be composed by the components mentioned above, the speaker 10 capable of emitting light has great thickness and occupies too much space, so that it is not suitable for current electronic devices with small sizes and light weight. Moreover, the light pipe 130 is composed of too many components, so that the production cost of the speaker 10 is high and the quality is not stable as well.


The present invention is an endovascular embolic composition. The embolic composition comprises a hydrophilic insoluble matrix having a microscopic mesh-like structure. The voids or intricacies of the matrix enclose droplets of aqueous solution as well as liquid oil. This structure is essentially equivalent to a "gel" structure with the insoluble matrix including both aqueous and oil droplets within its mesh. In creating the matrix a liquid oil base is mixed with an aqueous solution of a matrix base. The matrix base comprises an organic polymer such as a protein like albumin or its equivalent dissolved in an aqueous solution which may contain additional solutes. The matrix base solution is mixed and emulsified with the liquid oil base at a volume ratio ranging between about 1-to-1 and 1-to-5 respectively. To create the embolic composition the matrix base is then precipitated or cross-linked to form a gel with a mesh-like microscopic structure in which insoluble matrix surrounds and entraps both aqueous fluid and liquid oil. Preferably sclerifying agents are included within the composition so that scar tissue will develop to permanently occlude the embolized vasculature.

1. Field of the Invention
The present invention relates to the field of endovascular embolic materials for embolization in abnormal microvascular beds or nidi, and in particular to a semisolid-semiliquid endovascular embolic multipurpose ointment and a corresponding soft particle form of embolic beads.
2. Description of Related Art
Endovascular embolic materials, which are currently used for embolization of abnormal microvascular beds or nidi, include injectable solid particles, sutures, fibers, tissue or sponge fragments, as well as liquid agents such as glues and emulsions. In the case of brain arteriovenous malformation embolization, almost all of the solid embolic materials are nonradio-opaque. Most of these materials are rapidly biodegradable; for example, Avitene fibers, sponge and dura fragments, protein microbeads and the like, which offer only temporary embolization. See Lon F. Alexander et al., "The History of Endovascular Therapy," Neurosurgery Clinics of North America, 5 (3) at 383-391 (1994). The nondegradable materials, such as polyvinyl alcohol (PVA) particles, silk sutures and the like, have a high rate of recanalization and collateralization that is, a tendency for blocked vessels to reopen and a tendency for parallel vessel paths to develop, respectively. This not withstanding that these materials may permanently remain at the embolized sites.
It is believed that the spontaneous thrombolysis (i.e., dissolving of the blockage) and angiogenesis (i.e., growth of new vessels) are the main contributing mechanisms to this recanalization and collateralization. Furthermore, these prior art types of solid materials usually tend to stay proximate to the injection site instead of moving into the nidus itself due to the lack of deformability of these materials. As a result, a considerable number of nidus vessels remain anatomically open even though the whole arteriovenous malformation nidus is angiographically occluded. These remaining portions, which lack embolic material, offer beds for recurrence. See for example Mazen H. Khayata et al., "Materials and Embolic Agents for Endovascular Treatment," Neurosurgery Clinics of North America, 5 (3) at 475-84 (1994).
Many liquid embolic materials have unfavorable properties. For example, while liquid glue, such as isobutyl-2-cyanoarylate (IBCA) has a good mobility rate inside the delivery microcatheter, it is unpredictable inside the nidus due to difficulties in controlling its polymerization rate. An optimal result may be achieved if a glue with suitable adjusted hardening time is delivered into the desired dominant portion of the arteriovenous malformation nidus. However, further treatment, such as surgical removal or radiation, is usually required in most cases using these liquid materials. See Fournier et al., "Endovascular Treatment of Intracerebral Arteriovenous Malformations: Experience in 49 Cases," Journal of Neurosurgery, 75 (2) at 228-33 (1991).
In the case of malignant tumor endovascular treatments, such as hepatocellular carcinoma embolizations, the liquid emulsions made of Lipiodol and aqueous anticarcinogenic solutions show much better effects than most solid drug carrier particles. This is because the liquid emulsions have better mobility and can embolize malignant microvascular beds more extensively than solid particles. In addition, the emulsion can carry more anticarcinogens into the tumor. See Ichida et al., "Therapeutic Effect of a CDDP-Epirubicin-Lipiodol Emulsion on Advanced Hepatocellular Carcinoma," Cancer Chemotherapy and Pharmacology, 33 suppl., S74-8 (1994).
However, nonsolidifiable liquid material, such as Lipiodol emulsion, cannot be applied in the treatment of arteriovenous malformation because the emulsion would be washed away within minutes. Liquid emulsions exhibit less friction in the embolized microvascular beds, so that in some high blood flow tumors, especially those with intratumoral microshuntings similar to the arteriovenous malformation nidi, the delivered embolic agent can be washed away within hours or days. See Kan et al., "Distribution and Effect of Iodized Poppyseed Oil in the Liver After Hepatic Artery Embolication: Experimental Study in Several Animal Species," Radiology, 186:861-6 (1993); and Luo et al., "Treatment of Hepatocellular Carcinoma by Transarterial Approach," Chung-Huai Hsueh Tsa Chih Chinese Medical Journal, 73:158-60 (1993).
What is needed is a more stable embolic carrier with a better relative friction and mobility to produce a longer lasting embolization for preventing or retarding thrombolysis or revascularization and for maintaining a higher drug concentration within the target tumors when used for drug delivery. Embolic agents that resulted in scar formation which blocks new vascular growth would be especially favored. Therefore in general what is needed is an improved therapeutic result in endovascular embolizations which is not subject to the disadvantages discussed above in connection with each of the prior art embolic materials.

Embolic material for endovascular occlusion of abnormal vasculature and method of using the same

The Regents of the University of California


Plasticizing resins, aqueous dispersions of cationic resins, and methods of making the same for use in cathodic electrodeposition are disclosed. The resins are formed from reacting a polyoxyalkylenepolyamine, a phenol, and a formaldehyde. The reactants may further include a block building unit derived from a polyepoxide. When used in combination with other conventional electrodepositable resins, deposited films with improved mechanical properties and descreased tendency toward cratering are obtained.

The present invention relates to plasticizing resins, aqueous dispersions of the resins which are suitable for use in cathodic electrodeposition, and methods of making the same.
Historically, cathodic electrodeposition products have offered a means to provide a high degree of corrosion protection for various applications. For many applications, various mechanical film properties such as chip resistance have increased in importance. It is also desirable for the appearance of an electrodeposited film to be free from various surface defects such as those associated with cratering.
The present invention provides a means to obtain a plasticized electrodeposition paint binder with improved mechanical properties, improved chip resistance, and a descreased sensitivity toward cratering. Obtained with this invention are electrodeposited films with improved mechanical properties, improved chip resistance, improved appearance and reduced number of surface defects.

Plasticizing resins, aqueous dispersions thereof and methods of making the same


The invention includes a system and method for managing an operation of a locomotive as a function of a location of the locomotive. The system comprises a location unit for determining the location of the locomotive and a control unit for controlling an operation of the locomotive as a function of the determined location. In another embodiment, the invention includes a system and method for receiving a security authorization input from an operator of the locomotive, comparing the received operator security authorization input to a security authorization parameter, and restricting an operation of the locomotive when the received operator security authorization input does not match the security authorization parameter. In yet another embodiment, the invention includes a system and method of sending a control command from a remote system, receiving the control command at the locomotive, and controlling an operation of the locomotive responsive to the received control command. In still another embodiment, the invention includes a system and method for controlling an operation of the locomotive as a function of the location of the locomotive, a monitored emission parameter and an emission characteristic.

A locomotive control system controls the operation of a locomotive in response to input from an operator. The operator provides an input into the locomotive to initiate one or more operation of the locomotive or to change a mode of operation. Operator inputs include setting the throttle to a particular notch setting or adjusting the reverser. Typical modes of operation of a locomotive include motoring, dynamic braking, self-load, idle, shutdown, start-up, cranking, and a throttle setting such a motor notch 5. The locomotive control system responds to the inputs from the operator to control the operation of the locomotive in response to the operator defined modes and other control inputs.
The locomotive control system has been implemented not only in locomotives that operate independently, but also in multiple locomotives that operate together in a consist for providing cumulative or reserve motoring capacity, for example in commonly assigned U.S. Pat. No. 6,691,957. The front locomotive in the consist is usually where an operator is located and is usually designated the lead unit while the other locomotives are designated trail units. However, the lead locomotive may be any locomotive within a consist. Each trail unit typically receives a trainline signal representing the position of the lead unit's reverser, and treats that signal as representing the position of its own reverser. The reverser is typically placed in the center position when configuring the locomotive for trail unit operation. While trail units are controlled by an operator located in another locomotive, each of the locomotives operating in a consist either directly or indirectly respond to the input commands of the locomotive operator.
There is increased concern for the security of transportation systems including improving security and restricting control over the operation of railway locomotives. Therefore, there is a need for a system and method that provides increased security to the operation of a locomotive. As one method of providing increased security, it would be desirable to remotely control an operation of a locomotive wherein the remote control operation would override the operator input command and restrict one or more operations of the locomotive. However, the present state of locomotive technology does not offer a railway system operator a mechanism to remotely intervene with locally controlled detrimental locomotive operation. Therefore, there is a need for a remote control system that can remotely control the operation of a locomotive wherein such remote control commands override input of the operator that is located on-board the locomotive. There is also a need to remotely control a locomotive such that an operator is not required to be in a locomotive at the time of operation of the locomotive. To support this remote control system, there is also a need to provide a secure communication channel or facility between a remote control system and a locomotive for communicating messages and delivering remote control commands.
Additionally, it would be desirable to control the operation of a locomotive based on the geographic location of the locomotive. For instance, a rail system operator operating a locomotive over a railway network may find it desirable to identify operating areas within the railway network such that one or more operations of the locomotive would be determined as a function of the location of the locomotive. For example, an emission objective may be established for a particular operating area. It may be desirable to control the operation of the locomotive based on the location of the locomotive, an emission parameter of the locomotive, and an emission characteristic or objective established for the locomotive. The present state of locomotive technology does not offer a railway system operator a mechanism to manage or control the operation of a locomotive based on the geographic location of the locomotive or based on an emission characteristic for an operating area and/or locomotive.


The invention includes a synthetic bone substitute material suitable for use as a replacement for cancellous bone in a bone graft composition, the material comprising a reticulated framework of interconnecting bioceramic struts defining an interconnecting interstitial void volume, and a solid non-porous composition substantially filling the interstitial void volume and in intimate contact with the reticulated framework, the pore-filling composition comprising calcium sulfate. Calcium triphosphate is a preferred bioceramic material for the reticulated framework.

Defects in bone structure arise in a variety of circumstances, such as trauma, disease, and surgery. There is a need for effective repair of bone defects in various surgical fields, including maxillo-craniofacial, periodontics, and orthopedics. Numerous natural and synthetic materials and compositions have been used to stimulate healing at the site of a bone defect. As with compositions used to repair other types of tissue, the biological and mechanical properties of a bone repair material are critical in determining the effectiveness and suitability of the material in any particular application.
After blood, bone is the second most commonly transplanted material. Autologous cancellous bone has long been considered the most effective bone repair material, since it is both osteoinductive and non-immunogenic. However, the use of autologous cancellous bone is not available under all circumstances, and donor site morbidity and trauma are serious drawbacks to this approach. The use of allograft bone avoids the problem of creating a second surgical site in the patient, but suffers from some disadvantages of its own. For instance, allograft bone typically has a lower osteogenic capacity than autograft bone, a higher resorption rate, creates less revascularization at the site of the bone defect, and typically results in a greater immunogenic response. The transfer of certain diseases is also a danger when using allografts.
To avoid the problems associated with autograft and allograft bone, considerable research has been conducted in the area of synthetic bone substitute materials that can be used in lieu of natural bone material. For example, various compositions and materials comprising demineralized bone matrix, calcium phosphate, and calcium sulfate have been proposed. In many instances, however, the synthetic bone materials proposed in the art have suffered from significant disadvantages. For example, some compositions fail to provide the structural support necessary to augment the healing process. Other compositions fail to adequately mimic the density and overall physical structure of natural bone, which can lead to reduced performance. This can be particularly problematic when replacing cancellous (trabecular) bone material, which has a distinct reticulated pore structure that can be difficult to mimic in a synthetic construct. Further, some materials suffer from a reabsorption rate that improperly paces the natural healing process and, thus, fail to provide the necessary framework for the ingrowth of new tissue.
There remains a need in the art for improved bone substitute materials suitable for use in bone graft compositions, particularly materials that can be used as a replacement for cancellous bone.