A system on chip comprises a CPU, a local memory a data processing module, and a DMA controller. The DMA controller comprises a first interface to handle data transmissions, to and from the local memory, associated with an indication to the local memory of an address in local memory, and is designed to perform data writes and reads in the local memory via this interface. The DMA controller also comprises a second interface, which in response to a command received from the central processing unit, operations for writing and reading data in the local memory via the first interface. The DMA controller also comprises a third interface with the processing module to transmit to it the data read, via the first interface, in the local memory, this transmission not being associated with an indication to the processing module, by the DMA controller, of an address.

1. Technical Field
The present invention relates to integrated systems on silicon chip, or SoC ("System On Chip"), comprising at least one central processing unit, or CPU, on which programs can be run, a direct memory access, or DMA, controller, and a local memory.
The present invention relates more particularly to such systems in which successive processes, for example using algorithms, are applied to input data, typically digital audio and/or video data. Such SoCs are, for example, included in electronic appliances such as set-top-boxes, personal digital assistants (PDA), mobile phones, and so on.
2. Description of the Related Art
With the dimensions of the processing cores reducing as their processing capabilities increase, one trend is to carry out a maximum of processes via software applications, the hardware components, for example the logic gates, being used only when particularly high processing performance levels, in terms of bit rate in particular, are required.
In practice, the use of software applications allows the use of algorithm languages with a high level of abstraction, for example "C" language, which facilitates the design step. Furthermore, errors are corrected in software applications simply by loading a new code.
One trade-off between the advantages of software implementations and those of hardware implementations is to combine both aspects within one and the same system, then called "firmware", in which the system comprises on the one hand modules comprising hardware components and on the other hand software applications which are run on the CPU, the tasks to be performed by the system being divided between the hardware modules and the software applications. When executing instructions that are part of these software applications, the CPU interacts with the hardware modules, for example by sending commands to these modules. These commands use, for example, successive processes carried out by the hardware modules, for example of digital filtering, image processing, speech recognition, MPEG encoding/decoding, and other such types, on the digital data received as input to the system.
The hardware modules of the "firmware" type systems therefore receive data as input, carry out processes on this received data, and deliver the processed data as output.
It is also necessary to optimize the processing times of the software applications that the CPU applies to the data which is stored in the local memory of the system, which the CPU accesses quickly. However, in most systems on chip, it is not possible to store in local memory all the data that needs to be processed by the system on chip, for example, all the image data in the case of a system working on images. One, or even several, mass storage memories (for example, disks), hereinafter designated external memories, thus store at respective addresses in the external memories, data intended for processing by the CPU of the system on chip.
The function of the DMA controller of the system on chip is to transfer data from the external memory to the local memory, when this data is needed for the processing currently being carried out by the CPU. Similarly, the function of the DMA controller is to release storage resources in the local memory by transferring data from the local memory to the external memory. The data is thus transferred from memory to memory, from a source address in one memory to a destination address in another memory.
Moreover, in some cases, the data to be processed by the hardware modules is interchanged with the hardware modules via dedicated interfaces of the processor, normally called "streaming" interfaces, each comprising an input port named SDI (Streaming Data In) and an output port named SDO (Streaming Data Out), and a register associated with each of these ports. Each of these ports normally consists of a data bus and a few synchronization signal channels.
Such a configuration is represented in FIG. 1. The "firmware" type system on chip SP1 comprises a CPU 1, hardware modules 2 and 3. The system SP1 has access under control of the CPU 1 to an external or local memory 6. The CPU 1 comprises a register 4 (respectively 5) linked to the hardware module 3 via the output port SDO1 (respectively the input port SDI1). The CPU 1 also comprises a register 4′ (respectively 5′) linked to the hardware module 2 via the output port SDO2 (respectively the input port SDI2).
The writing, controlled by the CPU 1, in the register 4 (respectively 4′), of data from the memory 6, has the effect of applying this written data to the port SDO1 (respectively SDO2). The CPU 1 can then control the writing in the register 4 (respectively 4′), of new data from the memory 6 which will, also, be applied to the port SDO1 (respectively SDO2). The reading, controlled by the CPU 1, of the register 5 (respectively 5′) has the effect of supplying the data then applied to the port SDI1 (respectively SDI2). The writing in the memory 6 of this data is then controlled by the CPU 1.
In some cases, one and the same port can be used for reading and writing.
This solution for supplying input data and recovering output data from the hardware modules is not suitable for large volumes of data because it requires intensive involvement from the CPU.
In other configurations, each hardware module comprises its own DMA controller. For example, the "firmware" system SP2 diagrammatically represented in FIG. 2 comprises a CPU 7 and two hardware modules 8 and 9. The CPU 7 controls access to an external memory 6 via DMA controllers. The hardware modules 8 and 9 in practice each comprise a DMA controller 8′ and 9′. The DMA controller of each hardware module can thus be used to read the data to be processed in the mass memory 6, then, once this data has been processed by the hardware module, to write the data obtained in the mass memory 6. However, this solution increases the cost of the hardware modules. It also constitutes an obstacle to the granularity of the hardware modules. For example, a hardware module comprising a DMA controller carries out two successive processes on the input data, for example a temporal interpolation and a spatial interpolation of image data. If there is a desire to divide it into two hardware modules, one carrying out the temporal interpolation and the other the spatial interpolation, in order for certain data to be able to be subjected to just one of the two processes, it is then necessary to add a DMA controller.
There is therefore a need for a solution to supply input data and collect output data from the hardware modules of a "firmware" type system on chip, reducing the drawbacks of the prior art.

DMA controller, system on chip comprising such a DMA controller, method of interchanging data via such a DMA controller


A process and a system for controlling an electrohydraulic pressure supply for an auxiliary power device of an automotive vehicle in which a hydraulic pump system is operated by means of an electric motor the speed of rotation of which is controlled by operating parameters. In order to operate the auxiliary power system with the least possible energy, the changes in speed of rotation which differ from a predetermined desired speed of rotation of the electric motor are recognized and levelled out. In order to operate the power-assisted system with the least possible energy, the switching of the electric motor (2) from stand-by operation to full-load operation, or vice versa, takes place as a function of the speed of rotation (n) of the electric motor (2).

The invention relates to a process and a system for controlling an electrohydraulic pressure supply for an auxiliary power device of an automotive vehicle for operating a hydraulic pump system by means of an electric motor, and wherein the electric motor is switched from stand-by operation to full-load operation only in case of need.
It is well known in automobile engineering to develop auxiliary power systems by means of external hydraulic energy. In such a case, a pump system is drive by means of an electric motor. The electric motor is connected directly to the battery voltage of the vehicle.
A change in load causes an increase in output, particularly an increase in current, of the electric motor. Power-assisted steering systems are known, for instance, which, proceeding from a stand-by operation, operate the electric motor with full power only in case of need. In his case, there is a difficulty of recognizing the case of need. Furthermore, full energy is fed to the system also upon operation under partial load. In addition, due to the finite rate of acceleration of the electric motor, there is a time delay in the response of the system which is disturbing to the driver.

Process and system for controlling an electrohydraulic pressure supply for an auxiliary power device for an automotive vehicle


Disclosed herein are teleconferencing pods that include a microphone and a loudspeaker for open-air conversations, connectible to a separate telephonic device that generates an intermittent sidetone that is active at certain times not in the control or monitoring of the pod. In those pods is a sidetone suppressor that suppresses a distracting open-air echo produced from the intermittent sidetone and a compensator that detects sidetone transitions to avoid generating an echo signal in the pod and to avoid adapting suppression in the absence of an externally-generated sidetone. Sidetone suppression may be by several means, and may include variables controlled by adaption, including delay factors, scalers and coefficients. Detailed information on various example embodiments of the inventions are provided in the Detailed Description below, and the inventions are defined by the appended claims.

The claimed systems and methods relate generally to loudspeaker teleconferencing systems that utilize full duplex operation with distant participants, and more particularly to teleconferencing pods that can connect to a telephone device generating an intermittent sidetone that is active at certain times not in the control or monitoring of the pod, wherein the pod includes a sidetone suppressor and compensation function to avoid applying suppression in the absence of an externally-generated sidetone.
The inventions described herein relate to conferencing systems that can connect to a telephonic device in systems such as that depicted in FIG. 1. In that system 100, a telephonic connection is made between a local participant in proximity to a conferencing pod 102 and a distant party 108 using distant party equipment and/or devices, not shown. In system 100, a telephonic device 104 is used to make a connection 107 with distant party 108. Herein the term telephonic and telephone refer not only to devices and systems that utilize a public switched telephone network (PSTN), but also other devices that can make an audio connection between a local participant and a distant participant through any kind of network or connection including point-to-point, wired, wireless, switched packet and any other. The telephonic device 104 includes a keypad and/or controls 106 for controlling the connection 107 to distant party 108 and optionally other controls such as volume, mute and others. Conferencing pod 102 may connect to device 104 by simulating another device type such as a headset. Hereinafter the term "connector" includes not only physical connections, but also terminals and contacts of any type, and also digital, network, wireless or virtual connections.
Telephonic device 104 may produce a sidetone. The term sidetone has several historical meanings, and originates from the early days of radio when Morse code was used. To provide feedback to the radio equipment operator and audible tone was produced in a headset worn by the operator at times when the transmit key was depressed. In devices using an audio signal the term sidetone has come to mean a retransmission of an audio signal received at a local microphone to a local participant, for example through a headset. This is done as feedback to the local participant that his words are being transmitted. Sidetone generation and use can be understood in reference to FIG. 2A, wherein a simple telephonic device is illustrated. The device of FIG. 2A is a stand-alone telephonic device, with an incoming port 208 and an outgoing port 206 for carrying audio to and from a distant participant. This device also includes a speaker 202 and a microphone 200. Speaker 202 and microphone 200 would ordinarily be made part of a headset or other equipment whereby speaker 202 is positioned near the ear of local participant 204, and the sound of 213 produced by speaker 202 is not substantially carried to microphone 200.
Where sound produced by the Speaker 202 is not being carried to microphone 200 it may be desirable to include a sidetone generator 210. The sidetone generator produces an audio signal received at the microphone 200 at a low level, typically less than what listener 204 hears a distant participant, providing feedback to the listener 204 that his speech is being transmitted to the distant parties. That audio signal is fed to a mixer 212 along with the distant audio received at port 208 producing a signal at speaker 202 that includes both the distant audio and a sidetone.
Now referring to FIG. 2B, the functional aspects of a system as shown in FIG. 1 are illustrated. The system of FIG. 2B includes a telephone device having many of the same components as that of the stand-alone device, including an incoming port 208, an outgoing port 206, a sidetone generator 210 and the mixer 212. Although this telephone device might include a speaker and microphone, here a connection is made to a separate device through an incoming connector 216 and an outgoing connector 214 which supplies an incoming and outgoing audio signal to an external device, for example a headset. The external device connects to connectors 214 and 216, and includes its own speaker 203 and microphone 201. If the external device is a conferencing pod, speaker 203 will be configured to produce sound in the local vicinity so that the local participants 204 can hear the distant audio received at port 208. Microphone 201 is likewise configured to pick up sound in the local vicinity of the pond such that the local participants can be heard by the distant parties.
The presence of sidetone generator 210 introduces a problem. The inclusion of sidetone generator 210 in the telephonic equipment may be on an assumption that external equipment connected to ports 214 and 216 is a headset, or rather that a substantial transmission path does not exist between the speaker and microphone at the external device. However, the presence of a conferencing pod does indeed introduce such a path 222. Thus, distant audio produced at Speaker 203 is carried to microphone 201 and transmitted over path 222 through the outgoing connector 260 distant participants. This is perceived by the distant participants as an echo with the delay approximately two times the propagation delay between the local and the distant participants. Additionally, because of the presence of a sidetone generator 210 a feedback loop is introduced in the local equipment. This is experienced by the local participants and the distant participants as ringing and, if the coupling between speaker 203 and microphone 201 is sufficient, howling.
Therefore, the situation presented in FIG. 2B illustrates a particular problem where a conferencing pod is to be connected to a telephone in substitution of a headset, although that is not the only situation that the inventions which are described herein may be applied to. However, the situation provides a convenient illustration to describe the configuration and operations described in the discussion below.

Adaptive conferencing pod sidetone compensator connecting to a telephonic device having intermittent sidetone


An outdoor baseball practice facility including a playing surface with a plurality of adjacent stations arranged thereon. Each station of the present invention includes a homeplate with angularly diverging baselines extending away therefrom to define a playing field therebetween. The baselines of any one station overlap the baselines of one or more adjacent stations. The baselines of each station have a distinguishable appearance from the baselines of other adjacent stations to allow a batter to better appreciate whether a struck ball remains within a specified playing field. Each station of the present invention furthermore includes an apparatus for presenting balls at an elevated distance above the homeplate of each station. A homerun area on the playing surface is disposed a predetermined distance away from the homeplate of each station.

Baseball has been America's favorite pastime for many years and has vast appeal. That is, baseball appeals to the young and the old, boys as well as girls, and to women and men. At some point in many peoples lives, we have imagined what it would be like to stand in a batters box and hit a ball in an actual baseball field. Unfortunately, because of the upkeep, insurance and a myriad of additional reasons, few people outside of baseball players get to experience the joy and delight associated with hitting a baseball in actual field conditions. Few people outside of baseball get to experience the joy of what it would be like to hit a baseball a distance resembling a homerun in the major baseball leagues.
Baseball batting cages are known in the art. Such batting cages typically are confined spaces wherein a ball is mechanically thrown toward a batter. In these arrangements, however, the ball hit by the batter cannot pass beyond the confines of the cage wherein the batter is disposed. Accordingly, and because the batter is confined within relatively tight space constraints, there is no adequate manner by which the batter can judge how well the ball is hit. Moreover, there is no comparison of a small batting cage with an open field. Thus, the thrill obtainable on a field when the ball is well hit is not equaled in a batting cage.
Thus, there continues to be a need and a desire for an outdoor baseball practice facility wherein a player can practice hitting a baseball in conditions which more accurately depict playing fields of major league parks.


Display backlight units are controlled with a signal. A message has an address header specifying one of an array of backlight units, and instructions for individually controlling each of the backlight units, particularized accordingly. The message is routed from a controller to a first controllable backlight unit of the display, which controllably responds to its corresponding particularized instructions. The message is sequentially routed in order from each backlight unit to the next in a chained ring configuration. Data from the backlight units is similarly routed back to the controller.

Liquid crystal displays (LCD) function by controlling the polarization state of display components, essentially at the pixel level. Light, typically white and emitted by a BLU source behind (from the perspective of a viewer) the LCD components, is polarized and illuminates the display components from their rear. LCD components that are in a transmissive state with respect thereto allow the polarized backlight to pass, and components that are in a non-transmissive state are correspondingly opaque.
Modern BLUs may have multiple light emitting components. For example, HDR displays may use an array of white light emitting diodes (LED). The brightness of the BLU components' emissions may be controlled to achieve acceptable HDR performance. For example, the emission intensity of one or more of the BLU components may be modulated in relation to a video input, e.g., signals that change the transmissivity state of the display components.

Dolby Laboratories Licensing Corporation


An articulated concrete block system that includes a gabion mattress drainage layer. The two major components of the system reduce the effects of erosion and increase the hydraulic stability in areas that experience high velocity water flows, hydraulic jumps, and will dissipate wave energy action for shoreline and coastal erosion. Geosynthetics are first placed on the ground surface, followed by a gabion mattress drainage layer, a smaller aggregate layer for fine grading, another optional geosynthetic layer, and then the articulated concrete blocks overlie the system.

Articulated Concrete Block systems (ACB) have been utilized in the United States since the early 1980's. This type of block system incorporates the use of cables to form pre-assembled mats that can be lifted via spreader bars with heavy equipment to place the pre-assembled mats on the soil surface to protect the same from erosion. In the 1990's improved articulated concrete block systems were invented and did not require the use of cables. Rather, the improved blocks were fabricated with interlocking tabs and sockets that resisted horizontal displacement, and thus could be installed by hand.
Rock drainage layers have been utilized even longer and are placed underneath Rock RipRap to prevent erosion on coastal shorelines, ditches, canals, and areas where higher turbulent water flow and/or wave action exists. The rock drainage layers dissipate high turbulent water flow, as well as release the energy of water pressure during wave attacks. Gabion boxes and Reno mattresses have also been utilized as drainage structures since about the nineteenth century. The gabion/reno wire cages incorporate the use of galvanized or stainless wire, either double twisted or welded together, to form wire boxes of certain lengths, widths and heights. The wire boxes or "cages" were then filled with rock, and a wire lid is utilized to close and clamp the cage to encapsulate the rocks therein. These wire box systems have been utilized worldwide to successfully protect steep slopes, channels, landfill chutes, and many other applications from erosion.
Drainage layers have also long been known to affectively increase the hydraulic stability when used with articulated concrete block systems. Examples of applications include areas that experience high water velocities, hydraulic jumps, shoreline wave attacks, and landfill down chutes. Rock drainage layers placed underneath articulated concrete block systems primarily include smaller 1 to 1.5 inch size rock having a thickness generally of about 6 inches. Before installing the drainage rock layer, a geosynthetic material is placed on the ground, a 6 inch rock drainage layer is installed, another geosynthetic layer is overlaid thereon, then the articulated concrete block system is installed on top. Rock drainage layers employed today incorporate the use of a woven mesh underneath the rock, to be used in conjunction with articulated concrete block systems. The entire system is then anchored to steep slopes with percussion driven earth anchors to stabilize the slopes.
A revetment system identified by U.S. Pat. No. 10,113,285 by Nadeau illustrates a revetment system incorporating the use of a cellular confinement structure that is overlaid by an articulated concrete block system. This system failed to achieve the ability to utilize the much-needed use of larger rock stone sizes, such as 3×5 inch bull rock, 6 inch or even 9 inch rock riprap as the first drainage layer, then the smaller 1-1.5 inch rock layer for a final grade to support the articulated concrete block system. Described in this patent are plastic cells that are filled with a backfill that may include sand, topsoil, or other material such as aggregate. Common aggregate size is D50 (¾ inch) while other alternate aggregate could be D50 stone of ⅜ inch to 1.5 inch size. This is due to the size and limitation of the cellular confinement shapes of the individual pockets or areas where the backfill is placed. Therefore, this type of multi-layer system is described as being limited to the use of smaller aggregate sizes, i.e., 0.75 to 1.5 inch.
The Nadeau confinement system has no bottom or top, but only perforated walls to confine the aggregate from moving in a lateral direction. The cellular confinement system obtains its vertical strength from the aggregate filling the same. In other words, once the cellular confinement system is filled with aggregate, heavy equipment can be driven over it, but not before it is filled with the aggregate.
An example of a rock drainage layer technology is a completed project for a home owner on Lake Sam Rayburn, Tex. This project design was submitted to the U.S. Army Corps of Engineers, Fort Worth, Tex. District, for review and approval prior to any work commencing by the homeowner. This project included a geotextile filter fabric first installed on the subgrade, a geogrid layer, 6 inch depth of a 3×5 inch bull rock, 1-2 inches of smaller 0.75-1.5 inch aggregate, another geogrid layer, and an 8 inch open cell articulated concrete block system. All layers were hand laid without using cables in the ACB system. The voids of the articulated concrete block were then back-filled with the 1 inch small aggregate since the application was for 6 foot wave attacks predicted and no vegetation was desired. According to information from the home owner, the USACOE allowed only two methods of approved products for use on this lake, which were large Rock Riprap or an ACB system.
The project was installed on steep slopes with limited or difficult access for the 3×5 inch drainage rock layer. Small rubber track skid steers were used to transport the rock and place it on the slope to a uniform 6 inch depth. The problem with this installation technique is that the rock kept falling or rolling down the slope. In addition, the equipment could not access all locations of the slope. This was remedied by installing the rock from the top of the slope.
In accordance with the invention disclosed herein, it was recognized there was a need for a gabion mattress with individual boxes. This would simplify the placement of the rock and allow a smoother and consistent final grade to receive thereon the articulated concrete block system. It was further recognized that once installed, a greater hydraulic stability could be achieved for better erosion protection by incorporating the wire mesh and gabion/reno structure. With this arrangement, it was recognized that percussion driven earth anchors could still be incorporated which would tie both systems together, and structurally as well, holding the entire system in place, if desired.
A problem with the Nadeau revetment system identified above is that if water undercuts the bottom layer of the flexible geosynthetic material, then the flexible material no longer rests on the ground, but falls or bows downwardly into the void formed in the eroded soil. The downward movement of the flexible geosynthetic material allows the aggregate contained by the confinement system to also fall downwardly to fill the void caused by the underlying eroded soil. This fault can cause a chain reaction in which the aggregate from the other confinement cells washes away and the revetment system is no longer able to prevent further erosion.
Other similar layered revetment systems utilizing cellular-type confinement systems include those described in U.S. Pat. No. 7,431,536 by Benda and U.S. Pat. No. 4,572,705 by Vignon et al. These layered revetment systems suffer the same problems as does the revetment system by Nadeau, described above. Many of these cellular confinement systems have no top or bottom so that they can be easily folded up into a compact structure to facilitate storage and shipping.

Integrating articulated concrete blocks with gabion/reno cages


A multi axial asphalt heater for re-heating and recycling of old and new asphalt for permanent joint free repairs and restorations. It is possible to adjust the heating elements mechanically up and down off the asphalt surface with the lever arm mechanism. The provision of rotational movement of the heating elements permits the device to be retracted into a transport configuration. Forward and reverse motion of the heating elements permits a graduate heating process to be performed. The fold-up design with radially shaped adjustable hinges provide various angularity adjustments not only for compact convenience but also for establishing specific heat clearances, avoiding shut down delays and overheating.

The present invention relates to re-heating and recycling of old and new asphalt for permanent joint free repairs. The prior art is replete with designs having a portable Multi axial Infrared heating system supported on pneumatic wheels. Various mechanisms have been devised for adjusting the three separate infrared heating banks. The adjustments of the infrared heating banks requires a series of adjustment steps; For example there is forward and reverse movement, up and down movement and fold up feature. A primary object of the present invention is to provide in association with a compact Fold up Design, an adjustable mechanism that permits precise Heating Adjustments for various climatic temperature situations and asphalt conditions.

Multi axial asphalt heating system with up and down, forward and reverse adjustments and fold up feature adjustment


In one exemplary aspect, a method of managing computer network traffic flow quality of service includes the step of configuring a configurable network device to provide a specified quality of service to a data packet with a specified quality of service configuration based on a quality of service classification port number in a data packet header of the data packet. At the source node, a data packet is generated. At the source node, replacing the destination port number in the data packet header with a quality of service classification port number. At the source node, the destination port number is included in an options field of the data packet's header. The data packet is communicated to the configurable network device. At the destination node, receiving the data packet, replacing the quality of service classification port number with the original destination port number, and forwarding the packet to a destination process.

1. Field
This application relates generally to computer networking, and more specifically to a system, article of manufacture and method for setting network traffic flow quality of service (QoS) by modifying port numbers.
2. Related Art
Conventional methods of network services provide Quality of Service (QoS). Few non-limiting examples are based on COS values (layer 2 header) or TOS values (layer 3 header). Intermediate switches and routers can be configured to change these fields based on various parameters, a non-limiting example can be looking at the 5-tuple of the packet, 5-tuple consists of source IP, source port, destination IP, destination port, and protocol. Various network attributes such variable bit rate and delivery time may depend on various current states of the network such as the current traffic load.
Deep packet inspection is another non-limiting option to classify the flow and provide QoS. Intermediate devices (e.g. routers and/or switches) in the network may not be configurable to efficiently inspect the deeper layers of the data packets and provide QoS or priority according to their contents. Moreover, in-line deep packet inspection can increase networking latency, decrease throughput and reduce QoS.
Even if intermediate devices (e.g. routers and/or switches) can support deep packet inspection, customized classifying logic might not be present on these devices. Hence, this may require a customized software loaded on these intermediate devices, which is not very common.
Data packets are segmented when an application utilizes large packet sizes greater than the path MTU (Maximum Transmission Unit). Data packet segmentation can cause the header to be separated from the other segments of the data packet. Thus, conventional attempts to provide a QoS level based on current methods of inspecting data packet headers can be problematic. Accordingly, improvements can be made over conventional methods of setting network traffic flow QoS.

Method and system of setting network traffic flow quality of service by modifying port numbers


A novel liquid crystal display device is disclosed. the device comprises a liquid crystal cell comprising a pair of substrates disposed facing each other, at least one of said pair of substrates having an electrode thereon, and a liquid crystal layer held between said pair of substrates, comprising a nematic liquid crystal material, molecules of which being oriented nearly normal to the surfaces of said pair of substrates in a black state, a first and a second polarizing films disposed while placing said liquid crystal cell in between; and at least two optically anisotropic films, each of them disposed respectively between said liquid crystal layer and each of said first and said second polarizing films, wherein, assuming thickness of said liquid crystal layer as d (nm), refractive index anisotropy of said liquid crystal layer at wavelength λ (nm) as Δn (λ), and in-plane retardation of said optical compensation film at wavelength λ as Re(λ), relations (I) to (IV) below are satisfied at least at two different wavelengths in a wavelength range from 380 nm to 780 nm:200≦Δn(λ)×d≦1000   (I)Rth(λ)/λ=A×Δn(λ)×d/λ+B;   (II)Re(λ)/λ=C×λ/{Δn(λ)×d}+D; and   (III)0.488≦A≦0.56, B=−0.0567, −0.041≦C≦0.016; and D=0.0939.   (IV)

Liquid crystal display device comprises a liquid crystal cell and polarizing plates. The polarizing plate usually has protective films and a polarizing film, and is obtained typically by dying the polarizing film composed of a polyvinyl alcohol film with iodine, stretching, and being stacked on both surfaces thereof with the protective films. A transmissive liquid crystal display device usually comprises polarizing plates on both sides of the liquid crystal cell, and occasionally comprises one or more optical compensation films. A reflective liquid crystal display device usually comprises a reflector plate, the liquid crystal cell, one or more optical compensation films, and a polarizing plate in this order. The liquid crystal cell comprises liquid-crystalline molecules, two substrates encapsulating the liquid-crystalline molecules, and electrode layers applying voltage to the liquid-crystalline molecules. The liquid crystal cell switches ON and OFF displays depending on variation in orientation state of the liquid-crystalline molecules, and is applicable both to transmission type and reflective type, of which display modes ever proposed include TN (twisted nematic), IPS (in-plane switching), OCB (optically compensatory bend) and VA (vertically aligned), and ECB (electrically controlled birefringence).
Of these LCDs, most widely used for application in need of high definition display is 90° twisted nematic liquid crystal display (referred to as "TN mode", hereinafter) using nematic liquid crystal molecules having a positive dielectric anisotropy, driven by thin-film transistors. The TN mode has viewing angle characteristics such as ensuring excellent display characteristics in the front view, but as being degraded in the display characteristics in an oblique view, such as causing lowered contrast, or grayscale inversion which is inversion of brightness in a grayscale image, which are strongly desired to be improved.
In recent years, there has been proposed a vertically-aligned nematic liquid crystal display device (referred to as "VA mode", hereinafter) as a mode of LCD capable of improving the viewing angle characteristics, in which nematic liquid crystal molecules having a negative dielectric anisotropy is used, wherein the liquid crystal molecules are oriented so as to direct the long axes thereof nearly normal to the substrate under no applied voltage, and are driven by thin-film transistors (see Japanese Laid-Open Patent Publication "Tokkai" No. hei 2-176625). The VA mode is not only excellent in the display characteristics in the front view similarly to the TN mode, but can exhibit wider viewing angle characteristics through adoption of a retardation film for viewing angle compensation. The VA mode is successful in obtaining wider viewing angle characteristics by using two negative uniaxial retardation films, having the optical axes normal to the film surface, on the upper and lower sides of a liquid crystal cell, and it is also known that further more wider viewing angle characteristics can be obtained by additionally applying an uniaxial orientation retardation film having an in-plane retardation value of 50 nm and a positive refractive index anisotropy (see SID 97 DIGEST, p. 845-848).
Use of two retardation films (SID 97 DIGEST, p. 845-848), however, results not only in increase in the cost, but also in degradation in the yield ratio due to need of bonding a number of films, wherein use of a plurality of films raises a problem of increase in the thickness, which is disadvantageous for thinning of the device. An adhesive layer used for stacking stretched films may shrink under varied temperature and humidity, and may cause failures such as separation or warping of the films. Disclosed methods of improving these drawbacks include a method of reducing the number of retardation films (Japanese Laid-Open Patent Publication "Tokkai" No. hei 11-95208) and a method of using cholesteric liquid crystal layer (Japanese Laid-Open Patent Publication "Tokkai" No. 2003-15134, ditto "Tokkai" No. hei 11-95208). These methods were, however, still in need of bonding a plurality of films, and were insufficient in terms of thinning and cost reduction. Another problem resided in that light leakage from the polarizing plate in the oblique view in a black state could not completely be suppressed in the visible light region, and this consequently failed in fully improving the viewing angle. And it was also difficult to completely compensate the visible light, obliquely incident on the polarizing plate, over the entire wavelength of visible light thereof in a black state, and, consequently, color shifts depending on the viewing angle. A proposal has been made also on control of wavelength dispersion of retardation of the retardation film so as to reduce the light leakage (Japanese Laid-Open Patent Publication "Tokkai" No. 2002-221622), but this resulted in only an insufficient effect of reducing the light leakage. Still another problem was that influences given by changes in birefringence index of the liquid crystal layer were not fully considered, so that the device remained unsuccessful in obtaining a sufficient effect depending on birefringence of the liquid crystal layer.


A network quarantine management system eliminates registration or updating work of a quarantine-exempted device and prevents a fraudulent device from abusing authorized network information registered as a quarantine-exempted device and from impersonation.

The present invention relates to a method for device quarantine and a quarantine network system, and more specifically to a method for device quarantine and a quarantine network system, the use of which is suitable for reducing labor of an administrator by not executing quarantine on devices such as a printer.
As a result of rapid development of a network society in recent years, network security is becoming major concerns.
Problems associating with network control and information control in an organization include carrying in of laptop computers and use of illegal software. More specifically, connection of a laptop computer infected by a computer virus at a place outside the organization such as a home or on a business trip to the network within the organization causes damage such as spreading of the computer virus and network down. In addition, a case that using banned software in an organization resulted in voluntary or careless disclosure of confidential information of the organization to outside of the company, thus leaking such information has also occurred.
In an attempt to prevent from such damage, it is urged to enhance security of user's client equipment, in addition to conventional measures taken in units of network such as a firewall and an intrusion detection system. As one of new enhancement measures, a quarantine system which restricts a client device in which anti-virus measures are defective or banned software is installed to perform communication is being realized. A purpose of the quarantine system is to prohibit devices that do not conform to organizational policies from being coupled to the network, and the quarantine system is configured by combining the following processing:
(1) Isolation processing: This processing permits connection of a client device only to a specified network until an inspection and therapy of a client device are completed. A client coupled to a network is forcibly connected to a network (quarantine network) designed exclusively for inspection and therapy to check safety. The quarantine network is configured independent from the business network and servers for inspection and therapy, which will be described later, is coupled thereto. The processing is realized when it is associated with network relay devices (a router, a network switch, a gateway, etc.), a DHCP, a personal firewall, etc.
(2) Inspection processing: This processing inspects if the client status conforms to the organizational policies. The inspection server inspects whether or not the client device is infected by virus, the patch is adequate, or fraudulent software is activated, etc. When safety is ensured here in this processing, connection to the business network is permitted.
(3) Treatment processing: This processing executes updating, modification of configurations of a client to satisfy the policy requirements. If a problem is found in the above-stated quarantine, the processing distributes virus definition files and security patches from a therapeutic server and updates a problematic computer. After the therapy processing, the processing performs an inspection again to permit communication through the in-house network.
To realize such quarantine system, software to inspect client status is required for the client device. However, devices which cannot run quarantine software exist such as a printer and NAS (Network Attached Storage). For connection of such devices to a network, it is generally performed to exempt quarantine by pre-registering network information (MAC address, IP address, etc.) of the device concerned in an apparatus to perform isolation processing as a quarantine-exempted device. The Japanese Patent Laid-open No. 2004-289260 discloses a technique to achieve isolation by arranging so that security-unknown devices can be accommodated in a logically closed segment in a system having a DHCP server.

Method for device quarantine and quarantine network system

Abstract: When a quarantine management system detects network connection of a new device, the system judges the type (printer, NAS, etc.) of the device by port scanning. The system enables the device to communicate with another device coupled to a business network without an inspection for connecting the device to the business network, if the newly coupled device is judged to be of an authorized type. The device type judgment is conducted whenever a connection is made and is repeatedly conducted after establishment of the connection to check that the type is of an authorized type and, if the type is found to be an unauthorized type, the device is isolated for inspection.


A zinc oxide (ZnO) field effect transistor exhibits large input amplitude by using a gate insulating layer. A channel layer and the gate insulating layer are sequentially laminated on a substrate. A gate electrode is formed on the gate insulating layer. A source contact and a drain contact are disposed at the both sides of the gate contact and are electrically connected to the channel layer via openings. The channel layer is formed from n-type ZnO. The gate insulating layer is made from aluminum nitride/aluminum gallium nitride (AlN/AlGaN) or magnesium zinc oxide (MgZnO), which exhibits excellent insulation characteristics, thus increasing the Schottky barrier and achieving large input amplitude. If the FET is operated in the enhancement mode, it is operable in a manner similar to a silicon metal oxide semiconductor field effect transistor (Si-MOS-type FET), resulting in the formation of an inversion layer.

1. Field of the Invention
The present invention relates to a high electron mobility transistor (HEMT). More particularly, the present invention relates to a HEMT formed as a field effect transistor (FET) having a gate insulating layer positioned between a gate contact and channel layer. The invention also pertains to manufacturing methods for the aforementioned HEMT device.
2. Description of the Related Art
As known to those familiar with semiconductors, materials such as silicon (Si) and gallium arsenide (GaAs) have found wide application in semiconductor devices for lower power and in the case of Si lower frequency applications. These more familiar semiconductor materials have failed to penetrate higher power high frequency applications to the extent desirable, however, because of their relatively small bandgaps (e.g., 1.12 eV for Si and 1.42 eV for GaAs at room temperature) and relatively small breakdown voltages.
Accordingly, interest in high power, high temperature, and high frequency applications and devices has turned to wide bandgap semiconductor materials such as zinc oxide (3.37 eV at room temperature), silicon carbide (SiC) (2.996 eV for alpha SiC at room temperature) and the Group III nitrides such as gallium nitride (GaN) (3.36 eV for GaN at room temperature). These materials have higher electric field breakdown strengths and higher electron saturation velocities as compared to GaAs and Si.
A device of particular interest is the high electron mobility transistor (HEMT), which is also known as a modulation-doped field effect transistor (MODFET). These devices offer operational advantages under a number of circumstances because a two-dimensional electron gas (2DEG) is formed at the heterojunction of two semiconductor materials with different bandgap energies, and where the smaller bandgap material has a higher electron affinity than the larger bandgap material. The 2DEG is an accumulation layer in the undoped, smaller bandgap material and can contain a very high sheet electron concentration on the order of 1012 to 1013 carriers per square centimeter (carriers/cm2). Additionally, electrons that originate in the doped, wider-bandgap semiconductor transfer to the 2DEG, allowing a high electron mobility due to reduced ionized impurity scattering.
This combination of high carrier concentration and high carrier mobility gives the HEMT a very large transconductance and a strong performance advantage over metal-semiconductor field effect transistors (MESFETs) for high-frequency applications. High electron mobility transistors fabricated in the zinc oxide/aluminum gallium nitride (ZnO/AlGaN) material system have the potential to generate large amounts of radio-frequency (RF) power because of their unique combination of material characteristics which includes the aforementioned high breakdown fields, their wide bandgaps, large conduction band offset, and high saturated electron drift velocity. A major portion of the electrons in the 2DEG is attributed to pseudomorphic strain in the AlGaN/MgZnO since the MgZnO in-plane lattice parameter is 3% smaller than that of ZnO. When (0001) oriented MgZnO alloys are grown on thick ZnO, the biaxial strain induces a piezoelectric field in the material. When MgZnO layers are grown beyond the critical thickness for the Mg concentration used, the film begins to relax, and if the strain is sufficient, it leads to cracking of the film. This strain is useful however, in that it can be used to create a piezoelectric field in the structure. Bykhovski et. al. proposed using piezoelectric doping for AlGaN/GaN (possible replacement of GaN by ZnO is suggested in the same work) HEMT structures as a substitute for conventional impurity doping. The piezoelectric doping produces a 2-D electron gas (2DEG) near the interface without having to use conventional doping. In order to work, a high quality MgZnO layer is required, because the electron density in the MgZnO/ZnO 2DEG structure is limited by the elastic strain relaxation, which depends on MgZnO barrier thickness and on the Mg molar fraction in the barrier. It is this principle that has allowed the development of ZnO based FETs. Strain diminishes once the barrier thickness is larger than the critical thickness. The development of misfit dislocations in heterostructures can significantly affect the mobility and reduce the device performance. Maeda et al. further discovered in their study that the maximum 2DEG density depends more strongly on the strain relaxation than on the Al composition.
High power semiconducting devices of this type operate in a microwave frequency range and are used for RF communication networks and radar applications and offer the potential to greatly reduce the complexity and thus the cost of cellular phone base station transmitters. Other potential applications for high power microwave semiconductor devices include replacing the relatively costly tubes and transformers in conventional microwave ovens, increasing the lifetime of satellite transmitters, and improving the efficiency of personal communication system base station transmitters. Accordingly, the need exists for continued improvement in high frequency high power semiconductor based microwave devices.

High-electron mobility transistor with zinc oxide


A method is provided for forming isolated regions of oxide of an integrate circuit, and an integrated circuit formed according to the same. A plurality of active areas is formed in an upper surface of a portion of a substrate body. A field oxide region is formed which separates at least two of the plurality of the active areas, wherein an upper surface of the field oxide region is substantially planar with an upper surface of the substrate body. Nitride spots are formed in the bulk of the field oxide region and not in the active area which do not need to be removed since they do not effect device integrity.

The trend to continue to miniaturize semiconductor integrated circuits to achieve submicron feature sizes and increase the number of devices fabricated on the integrated circuit has required smaller isolation areas between devices. The active areas in which devices are built are isolated by a layer of oxide known as field oxide. However, the technology used to isolate active areas has not kept pace with the everdecreasing device geometries.
Isolation techniques should meet a variety of requirements. First, active areas should be in close proximity. Second, the lateral encroachment or tapering of the field oxide into the active areas, known as "birdbeaking", should be minimized. Third, the leakage current between active devices should be negligible. Fourth, the process for forming the field oxide regions must be easily adapted for use with standard integrated circuit fabrication process flows and not adversely affect device parameters.
Many methods have been proposed over the years to reduce the bird's beak of a field oxide region when isolating devices. One such method of isolating devices, LOCOS, local oxidation of silicon, produces regions of insulating silicon dioxide between devices. The LOCOS process was a great technological improvement in reducing the area needed for the isolation regions and decreasing some parasitic capacitances.
In LOCOS, silicon nitride is deposited and patterned over a stress relief pad oxide layer. The silicon nitride layer is retained over the area over where further oxidation is not desired. Thus, the silicon nitride is etched to expose a portion of the pad oxide where the field oxide is to be grown. After the thermal oxidation of the exposed pad oxide to form the field oxide regions, the silicon nitride layer is removed.
Several problems occurred, however, with LOCOS. Thermal oxidation in the original LOCOS form always incurred lateral encroachment, or birdbeaking, of the field oxide into the active areas growing under the silicon nitride mask. This birdbeaking is a substantial sacrifice of active areas that becomes significant for feature sizes less than 1.5 microns. The active area becomes smaller than the initial dimensions of the nitride layer.
Attempts to suppress birdbeaking in LOCOS, such as forming thicker nitride layers, caused stress-related defects in the nearby substrate due to the difference in the thermal coefficients of expansion between the silicon substrate and the silicon nitride layers. Process complexity also increased substantially in attempting to avoid these stress-related defects. To achieve submicron geometries, there can be little or no physical loss of the active areas as occurs with the birdbeaking phenomenon.
To reduce the bird's beak effect, there has been proposed the use of a polysilicon layer between the nitride layer and the pad oxide layer as more fully described in U.S. Pat. No. 4,407,696, issued Oct. 4, 1983 to Han et al. The use of the polysilicon layer in the LOCOS process, known as poly-buffered LOCOS or PBLOCOS, is used to reduce oxidation induced stacking faults resulting from the stress caused by the different thermal coefficients of expansion between the silicon substrate and a thick silicon nitride layer overlying the substrate. As described more fully in the publication "Twin-White-Ribbon Effect and Pit Formation Mechanism in PBLOCOS", J. Electrochem. Soc., Vol 138, No. Jul. 7, 1991 by Tin-hwang Lin et al, the polysilicon layer absorbs the excessive stress caused by the silicon nitride and prevents the lateral encroachment of oxidants, thus reducing the bird's beak.
The field oxide layer grown using poly-buffered LOCOS thus comprises the oxide derived from the silicon substrate, a portion of the pad oxide layer and oxide derived from the polysilicon layer. Afterwards, the nitride layer, the polysilicon layer and the pad oxide are etched. The poly-buffered LOCOS process reduces the bird's beak area over standard LOCOS resulting in less encroachment of the tapered portion of the field oxide into the active areas under the nitride mask. However, the bird's beak effect still remains, due to the oxidation of the polysilicon layer. In addition, the complexity of the process increases substantially in order to achieve the resulting structure.
In order to further decrease the bird's beak area using poly-buffered LOCOS, it has been proposed to surround the polysilicon layer with silicon nitride, as more fully described in U.S. Pat. No. 4,260,229, issued Nov. 9, 1993 to Hodges et al. and incorporated herein. As with standard poly-buffered LOCOS, the stress caused between the thick nitride layer over a thin pad oxide and the silicon substrate is reduced by the addition of the polysilicon layer. The bird's beak is further reduced due to the encapsulation of the polysilicon in silicon nitride. The oxidation of the polysilicon is reduced or eliminated. None of the polysilicon layer thus forms any part of the thermally grown field oxide. The resulting bird's beak is thus substantially reduced. Also in an effort to decrease the bird's beak, it has also been proposed to use a nitrogen implant into the polysilicon layer followed by an annealing step to encapsulate the polysilicon layer in silicon nitride, as more fully described in U.S. Pat. No. 5,192,707, issued on Mar. 9, 1993 to Hodges, et al. None of the polysilicon layer should thus form any part of the thermally grown field oxide. The resulting bird's beak area under the nitride mask is thus substantially reduced.
Each of these ideas help to reduce the bird's beak at the edge of field oxides but thick field oxides add to the topography of the surface of the wafer. Global planar isolation surfaces are desirable for submicron design rule technologies, particularly under 0.5 microns. Transistor gate patterns are subject to reflective notching problems from the topographies created by thick field oxide isolation regions. Anti-Reflective coatings and increased die loading in photoresists are designed to decrease the reflective notching problems, but inherently add to process complexity and cost, decreased pattern quality and increased exposure times. Some planarizing isolation processes are often times very expensive, such as Chemical Mechanical Polishing (CMP). Other planarizing techniques create high defectivities such as the well-known techniques: buried-oxide isolation technology (BOX) and recessed sealed-interface local oxidation technology (SILO and POP-SILO). Yet other techniques are very complex such as the nitride encapsulated polybuffered LOCOS process (NEPBL). Finally, other techniques simply do not work as well such as trench isolation, and spin-on-glass fills with etchback processes. It would be desirable to have a process of forming a field oxide region with a reduced bird's beak which also forms a substantially planar surface.
It is therefore an object of the present invention to provide a method of forming an isolation region with a reduced bird's beak.
It is a further object of the present invention to provide such a method which provides more planarization for subsequent processing steps which will improve step coverage of subsequently formed layers.
It is yet a further object of the present invention which utilizes standard integrated circuit processing steps.
Other objects and advantages of the present invention will be apparent to those of ordinary skill in the art having reference to the following specification together with the drawings.

Method of forming a planar isolation structure in an integrated circuit


A transfer press has sliding tables each assigned to one or several press stations and which, for the mold change, can be moved preferably laterally out of the transfer press. The sliding tables (or the molds disposed thereon) have receiving devices for the tooling which includes at least workpiece-specific holding devices of a transfer system which is used for transporting parts from press station to press station. For moving the sliding tables out of the transfer press, the receiving devices are positioned in separate depositing areas preferably provided laterally next to the molds. When the receiving devices are changed from their operative position taken up in the transfer system into the deposited position, the holding devices are swivelled by the receiving device which has a swivellable construction itself or a separate transfer device.

This application claims the priority of German application 197 20 518.6, filed May 16, 1997, the disclosure of which is expressly incorporated by reference herein.
The present invention relates to a transfer press for machining sheet metal parts, particularly a suction press, having at least one press station in which a bedplate is arranged which, as required, can be moved out of the press station and which is used for receiving at least one mold to be exchanged as required, for machining the sheet metal part, and a transfer device for feeding and/or removing the sheet metal parts to or from the press station in a defined transfer direction, the transfer device including at least one holding device to be changed when required for the temporary holding of the sheet metal parts which is situated in the transfer direction in front of and/or behind the mold when the mold is closed.
The present invention also relates to a process for the mold change and tooling change in such a transfer press having at least one bedplate on which at least one mold is held, and having a transfer device which has at least one holding device which can be changed as required.
Known transfer presses, as shown in EP-B-0 388 610, have a succession of press stations through which a workpiece has to travel in the transfer direction. The press stations are defined by molds divided into a top mold parts and a bottom mold part. The top mold part is fastened to a slide and the bottom mold part is disposed on a bedplate. A transfer device, for example, a two-axis transfer device with cross traverses, is used for the transport of the workpieces, on which cross traverses suction frames are held. In addition, the press has a press frame which includes press stands normally arranged between the working stations.
For the mold change, the bedplates with the molds disposed thereon are normally guided laterally out of the transfer press. They are moved through the press stands, the space conditions usually being such that the bedplates just fit through the press stands.
During the operation of the conventional transfer press, the suction frames or other holding devices pertaining to the transfer system are held between the molds, i.e., in the area for example, of the press stands when the molds close. The holding devices must first also take up this position if the top mold part is deposited on the bottom mold part in order to be able to move it out of the transfer press by way of the sliding table.
In addition to the mold change, the holding devices must also be changed. This should naturally take place in a manner which is as simple and requires expenditures of personnel which are as low as possible. At least some holding devices cannot, however, simply be guided laterally out of the transfer press because they would otherwise collide with the press stands.
Accordingly, an object of the invention is to provide a transfer press which permits a simple mold change including a simple tooling change, in which the tooling also includes holding devices which are part of a transfer system.
This object has been achieved in accordance with the present invention by providing a transfer press wherein at least one receiving device for the holding device is provided on the bedplate and/or the mold, and the receiving device holds the holding device during the mold change in a depositing area with an orientation which differs from the orientation of the holding device in the operating position. The process for changing the mold and the tooling involves steps wherein the holding device is swivelled out of its operative position into a changing position in which the holding device is held with respect to the transfer direction laterally next to the mold on a corresponding receiving device and in that the bedplate with the mold and the holding device (tooling) is moved out of the transfer press.
The transfer press of the present invention has a receiving device which has the purpose of depositing the tooling removed from the transfer system on the bedplate (or the mold) so that the bedplate with the mold and the tooling can be moved out of the transfer press.
According to the present invention, the tooling is held on the receiving device in an orientation and alignment which differs from the orientation in the transfer system. Thereby, for example, holding devices of the transfer system related to the tooling are deposited at a point on the bedplate at which, particularly with respect to the transfer direction, they do not project beyond the table contour.
A correspondingly provided transport device for the tooling is capable of changing the spatial orientation of the holding devices corresponding to the purpose so that the holding devices can be deposited at points on the bedplate which cannot be reached by the transfer system alone. Thereby, the holding devices are deposited at the otherwise not utilized points of the mold or the bedplate at which they do not hinder the moving-in and moving-out of the bedplate from the transfer press. In addition, the depositing points (receiving devices) may be selected such that the molds disposed on the bedplate are easily accessible, for example, to a crane.
If, as the result of the construction of the transfer press according to the present invention, on the side of the bedplate situated in the front and the rear in the transfer direction, additional space is not required for the holding devices (the tooling), the bed plates can be set up spaced from one another by only the with of a press stand. The distances between the bedplates and thus between the molds therefore become very short and permits a fast workpiece transfer and thus a high timing rate of the press.
The transport device for changing the tooling from the transfer system into the depositing area of the bedplates is advantageous particularly in transfer presses with two-axis transfers. The holding devices held on the cross traverses, for example, suction frames, suction spiders or the like, require a relatively large amount of space. In this case, the transport device permits the depositing at neutral points of the bedplate or of the mold. While the suction frames extend with the cross traverses in the operative position transversely to the transfer direction, they are deposited in the inoperative position in the longitudinal direction laterally to the molds. This is an area which is not crossed during the sheet metal part transport by the respective sheet metal part. Thereby, the transfer press can be constructed as short as possible in the transfer direction which benefits the stroke number.
The holding device can be held being oriented in the lateral area of the bedplate in the longitudinal direction as well as vertically. This depends on the concrete construction of the receiving device. The transport device correspondingly has a vertical, a horizontal or a diagonally arranged swivel axis. The transport device may be arranged on the bedplate or the mold and may, at the same time, be used as a receiving device for the holding system of the holding device in the inoperative position. The transport device can, however, also be arranged as a transfer device and be held on a press stand, that is, separately of the bedplate, in the holding device is transferred to the holder provided at the bedplate.
As required, particularly in the case of bedplates which have several molds disposed at a distance from one another, individual holding devices (tooling) may be deposited between the molds. This applies particularly to holding devices which, in the inoperative position are held above the bedplate between the molds and thus not in the area of press stands. These holding devices are not swivelled during the depositing on the bedplate.
The transfer device can be constructed such that the taken-over holding device is swivelled through the open mold or over the closed mold detached from the slide. The latter may be expedient if the transfer device carries out not only a swivel movement but simultaneously also a lifting movement, or if the depositing on the bedplate takes place relatively high.
According to the present invention, during the mold and tooling change, the tooling, which is part of the transfer system, is swivelled from its working position into a changing or inoperative position and is deposited on the bedplate. The bedplate, which is preferably constructed as a sliding table, is then moved out of the transfer press together with the mold and the tooling. By way of swivelling of the tooling, particularly of the holding devices, they can be transported to the lateral areas of the bedplate. Therefore, for depositing the holding device, no additional space needs to be provided which extends the bedplate in the transfer direction. In the lateral area, the holding device can be held horizontally or vertically, but at least in a plane which is aligned vertically and in the longitudinal direction. The holding device, which is, for example, constructed as a suction frame or a suction spider, can be held in a flat manner as well as may be held to be rotated about its longitudinal axis. For this purpose, the transport device has at least two swivelling or rotating axes.

Transfer press having a lateral depositing arrangement for the tooling


The disclosed and claimed concept provides for an overmold that is applied to substantially all of the exposed portions of a wood handle for a tool.

Field of the Invention
The disclosed concept relates to a wood tool handle having an overmold and, more specifically, to a wood handle wherein substantially all of the handle surface is protected by the overmold.
Background Information
Tools, and more specifically tool handles, are made from different materials having different advantages and disadvantages. For example, wood, and especially hickory wood, is known to be lightweight, impact absorbent, inexpensive, and strong. Hickory wood, however, is subject to degradation from exposure to the elements. Fiberglass handles, on the other hand, are less effected by exposure to the elements, but may be heavy and less impact resistant. Metal handles are strong and lightweight, but are expensive and do not absorb impact shocks.
One method of improving handles is to apply a protective coating over the handle member. Wood handles often have a coating of varnish or a similar material that provides some protection form the elements. Metal and fiberglass handles may have a plastic coating or a preformed sheath disposed thereon. Such plastic is often an injection molded plastic. Injection molded plastics are strong and may help dampen the shock of impact. However, given that wood handles must retain some moisture so as to retain their resilience, and as applying injection molded plastic requires heating the plastic to the point where applying the molten plastic causes water within a wood handle to be converted to steam, there has not been a method to apply a plastic overmold to substantially all of a wood handle.
As set forth in U.S. Pat. Nos. 4,287,640 and 4,344,901, it is known to apply an overmold to a portion of a wood handle. As noted in those patents, the portion of the handle to have an overmold applied thereto is subjected to additional drying. That is, the portion of the handle that is supported by the overmold is dried more than the unsupported portions of the handle. Thus, the unsupported portion of the handle retains its resilience while the protected portion is supported by the overmold.

Wood handle with overmold and method of manufacture


A sound dampener for a disk brake assembly comprising a composite of vinyl ester and glass. Preferably, the composite is comprised of a region of woven glass sandwiched between a layer of vinyl ester and another layer of vinyl ester in which random strands of glass are embedded. The composite dampens the vibrations induced by the friction associated with the disk brake assembly to eliminate brake squeal. The composite also has low rates of thermal conductivity and thermal expansion which aid in reducing break squeal.

1. Field of the Invention
This invention relates to disk brakes, and more particularly to a composite sound dampener for use in disk brakes to eliminate brake squeal.
2. Description of the Related Art
Sound dampeners for disk brakes are used in disk brake assemblies to eliminate or reduce brake squeal. It is known to use a sound dampener made from a composite of elastomeric material and glass particles. The elastomeric material dampens the vibrations, and the glass particles reduce the rate of heat transfer.
Many types of sound absorbers are known. U.S. Pat. No. 4,154,322 issued to Yamamoto et al. on May 15, 1979, discloses a sound dampener comprising a wire mesh screen between a backing plate and metal shim. U.S. Pat. No. 4,373,615 issued to Melinat on Feb. 15, 1983, discloses a laminated sound dampener comprising a ceramic heat barrier, an elastomeric vibrational absorbing material, a second metal plate and an optional second elastomeric layer. U.S. Pat. No. 3,885,651 issued to Odier on May 27, 1975, discloses a sound dampener comprising a butyl rubber layer and a metal plate.


The method of managing delivery goods comprises the steps of receiving identification information for delivery goods entered by a deliverer when a recipient of the delivery goods is not at home, extracting delivery goods information and recipient information relevant to the delivery-goods identification information from a storage unit which stores the delivery goods information and the recipient information corresponding to the delivery goods information, and notifying the recipient of the delivery goods information based on the recipient information.

There is a case that a recipient of delivery goods requiring "delivery goods reception approval" is absent so that a delivery person has to visit again the recipient to receive the reception approval and deliver the delivery goods. On the other hand, when failing to receive the delivery goods because he/she is away from home and the reception approval cannot be given to the deliverer, the recipient has to wait the next delivery, or go to a delivery center, where the recipient gives the reception approval to pick up the delivery goods.
As a first problem to be solved, the deliverer cannot complete delivery because the recipient is not at home and the deliverer cannot obtain recipient's reception approval with respect to the delivery goods. As a second problem to be solved, the recipient fails to receive the delivery goods because the delivery goods is delivered while the recipient is away from home so that he/she cannot give the deliverer the reception approval with respect to the delivery goods.

Method, apparatus, and medium for remote approval of a delivery if the recipient is absent from the delivery location


A structure for retaining bobbin wound electromagnetic coil assemblies on the poles of an electric motor is disclosed. Each coil assembly includes a bobbin having an opening formed therein which defines an interior space within which the motor poles are received. The ends of the bobbin are formed having pairs of opposed flange portions, each of which is generally flat and rectangular in shape. The flange portions extend from the upper and lower sides of each end of the bobbin, defining generally U-shaped end portions. The inwardly facing surfaces of the flange portions are each formed having an outer tapered surface and an inner groove extending thereacross. Wire is wound about the exterior surface of the bobbin, extending between the opposed flange portions at the ends of the bobbin. A pair of coil retainers are provided for retaining the coil assemblies on their respective stator poles during use. The coil retainers are each formed from a flat sheet of rigid material. When installed, the coil retainers engage the grooves formed on the flange portions of the bobbins to support the coil assemblies on the poles of the motor. A cylindrical rotor assembly is supported concentrically within the stator for rotation relative thereto.

This invention relates in general to electric motors and in particular to an improved structure for retaining a plurality of bobbin wound coil assemblies within such an electric motor. One specific application for this invention is in a variable reluctance electric motor, although the invention may be used in other electric motor structures as well.
Electric motors are well known devices which convert electrical energy to rotary mechanical energy. To accomplish this, electric motors establish and control electromagnetic fields so as to cause the desired rotary mechanical motion. There are many different types of electric motors, each utilizing different means for establishing and controlling these electromagnetic fields. Consequently, the operating characteristics of electric motors vary from type to type, and certain types of electric motors are better suited for performing certain tasks than others.
Synchronous motors constitute one principal class of electric motors. The two basic components of a synchronous motor are (1) a stationary member which generates a rotating electromagnetic field, generally referred to as the stator, and (2) a rotatable member driven by the rotating magnetic field, generally referred to as the rotor. Synchronous motors are characterized in that the rotational speed of the rotor is directly related to the frequency of the electrical input signal applied thereto and, therefore, the rotational speed of the electromagnetic field generated thereby. Thus, so long as the frequency of the applied electrical input signal is constant, the rotor will be driven at a constant rotational speed. Within this broad definition, however, the structure and operation of synchronous electric motors vary widely.
One variety of synchronous electric motor is known as a variable reluctance motor. Variable reluctance motors operate on the principle that a magnetic field which is created about a component formed from a magnetically permeable material will exert a mechanical force on that component. This mechanical force will urge the component to become aligned with the magnetic flux (lines of force) generated by the magnetic field. Thus, by using the stator to establish and rotate a magnetic field about a rotor formed from a magnetically permeable material, the rotor can be driven to rotate relative to the stator. The resistance to the passage of this magnetic flux from the stator to the rotor is referred to as reluctance. The magnitude of this reluctance changes with the rotational position of the rotor relative to the stator. Thus, electric motors of this type are commonly referred to as variable reluctance motors.
In a basic variable reluctance motor structure, this operation can be accomplished by providing a generally hollow cylindrical stator having a plurality of radially inwardly extending poles formed thereon. A coil or winding of an electrically conductive wire is provided about each of the stator poles. Concentrically within the stator, a cylindrical rotor is rotatably supported. The rotor is provided with a plurality of radially outwardly extending poles. However, no electrical conductor coils are provided on the rotor poles. By passing pulses of electrical current through each of the stator coils in a sequential manner, the stator poles can be selectively magnetized so as to attract the rotor poles thereto. Consequently, the rotor will rotate relative to the stator.
To optimize the operation of the variable reluctance motor, the magnitude of the electrical current which is sequentially passed through the stator coils is typically varied as a function of the rotational displacement of the rotor, as opposed to simply being supplied in an on-off manner. For example, the magnitude of the electrical current passed through a particular stator coil can initially be large, but decrease as the rotor pole rotates toward it. Consequently, the stator coil is prevented from continuing to attract the rotor pole toward it when the rotor pole has rotated to a position near or adjacent to the stator pole. This facilitates the rotation of the rotor at a more uniform speed.
As mentioned above, coils of electrically conductive wire are provided about each of the stator poles in a typical variable reluctance motor. In the past, these coils have been formed by winding the electrically conductive wire (which is coated with an electrically non-conductive insulator) about the poles of the stator. The wire used in such coils has typically been conventional wire having a circular cross sectional shape. While such wire is commonly available and relatively inexpensive, the circular cross sectional shape of the wire does not lend itself to high density winding. Also, a special winding machine must be provided to wind the wire about the poles of the stator within the electric motor.
More recently, it has been found desirable to form the wire used in such coils from insulated foil wire. Foil wire lends itself to higher density windings. Also, a special winding machine is not necessary because the foil wire can be wound on a mandrel outside of the electric motor, then installed therein. While electromagnetic coils formed from both round and foil wire have been effective, it would be desirable to provide an improved structure for an electric motor in which the coils are wound upon bobbins, and wherein an improved structure is provided for retaining these coils on the poles of an electric motor.

Coil assembly retainer for electric motor


A heating section (1) heats a fixing roller (10). A cooling section (2) cools the interior of a unit or apparatus. A temperature detecting section (3) detects the temperature of the fixing roller (10). A control section (4) controls current conduction to the heating section (1) based on the detected temperature. A conduction cutoff section (5) cuts off current conduction to the heating and cooling sections (1, 2) regardless of conduction control by the control section (4) if the detected temperature exceeds a predetermined temperature.

1. Field of the Invention
The present invention relates to a fixing unit with a cooling section for an eleotrophotographic apparatus, and an image forming apparatus with a cooling section.
2. Description of the Related Art
An image forming apparatus, such as an electrophotographic apparatus, includes a fixing unit for fixing the toner image onto a print medium. The fixing roller of the fixing unit is heated up to a high temperature and the surface temperature is controlled to stay within a predetermined range.
FIG. 8 shows a temperature control circuit of a conventional fixing unit. The conventional fixing unit includes a heating section 1 for heating a fixing roller 10, a cooling section 2 for blowing air into the interior of the unit to cool the fixing roller 10, a temperature detection section 3 for detecting the surface temperature of the fixing roller 10, and a control section 4 for sending a control signal to the heating section 1 to heat the fixing roller if the detected temperature of the fixing roller 10 is below a predetermined temperature or to stop heating the fixing roller 10 if the detected temperature is above the predetermined temperature.
The heating section 1 includes a series circuit of a heater 1-1 for heating the fixing roller 10, a thermostat 1-2 for preventing overheat of the fixing roller 10 due to a malfunction, an a-c current source 1-3 for supplying the heater 1-1 with heating current, and a switching circuit 1-4 for turning on/off the a-c current source 1-3 based on control of the control section 4. An amplifier consisting of a transistor Tr1, a resistor R3, and a resistor R8 to receive and amplify a control signal from the control section 4 is connected to a control terminal of the switching circuit 1-4.
The cooling section 2 includes a fan 2-1 for cooling the unit interior, an amplifier consisting of a transistor Tr4, a resistor R9, and a resistor R10 for amplifying a control signal from the control section 4, and a driving amplifier consisting of a transistor Tr5 and a resistor 11 for driving the fan 2-1. The temperature detection section 3 includes a thermistor 3-1 for detecting the temperature of a fixing roller 10 and a voltage dividing resistor R1. The voltage at a connection point between the thermistor 3-1 and the voltage dividing resistor R1 is sent to a port P1 of the control section 4 as the detected temperature.
The control section 4 is made of a central processing unit (CPU) and connected to a read only memory (ROM) and a random access memory (RAM). According to a readable program stored in the ROM or RAM, it receives the detected temperature from the temperature detection section 3 and executes a predetermined process, sending a control signal to the heating section 1.
In the above conventional fixing unit, if the control section 4 becomes out of control or the switching circuit 1-4 is down, an unexpected heating current can be continuously supplied to the heater 1-1 to raise the temperature of the fixing roller above the necessary level. If the fan 2-1 keeps rotating under this condition, the raised temperature spreads over the entire equipment, preventing normal printing. There is a technique that the sensitivity of the thermostat 1-2 is enhanced to prevent the extreme increase in the temperature of a fixing roller.
In the conventional fixing unit, however, it is impossible to prevent the raised temperature from spreading over the entire unit, causing a malfunction. In addition, there is a limit to the improvement in the thermostat and it is difficult to completely prevent the continuous supply of unexpected current to the heater 1-1.

Fixing unit with cooling section and image forming apparatus with cooling section


A scan flip-flop circuit and related scan chain are disclosed. The scan flip flop comprises in one embodiment an input stage receiving, selecting between, and outputting either a normal logic signal or a scan logic signal in accordance with an operation mode for the scan flip-flop circuit. The scan flip-flop further comprises a flip-flop receiving either the normal logic signal or the scan logic signal selected by the input stage, and outputting in accordance with a clock signal a first logic signal from a first flip-flop output terminal and an output stage receiving the first logic signal and comprising first and second output terminals, such that a signal output from the first output terminal is identical to the normal logic signal received in the input stage, and a signal output from the second output terminal maintains a high logic value when the scan flip-flop circuit operates in a normal mode and a signal output from the first and second output terminals are identical to the scan logic signal received in the input stage when the scan flip-flop circuit operates in a scan mode.

The present invention relates to a scan circuit for testing a semiconductor integrated circuit (hereinafter referred to as an "IC"), such as a microcontroller unit (hereinafter referred to as a "MCU"). More particularly, the present invention relates to a scan flip-flop circuit having reduced power consumption during a normal operating mode.
A claim of priority is made under 35 U.S.C. § 119 to Korean Patent Application 2004-45607 filed on Jun. 18, 2004, the entire contents of which are hereby incorporated by reference.
In a semiconductor IC such as a MCU, a competent scan test function is essential to a determination of whether respective logic gates within the MCU operate properly. As the number of logic gates used in contemporary MCU designs has increased, the relative importance of the scan test function has also increased.
A particular type of test circuit is routinely used to implement the scan test function. Generally speaking, this test circuit includes hardware capable of storing test data adapted to establish a defined internal state for the logic gates being tested. Output data is collected in response to the test data. The output data indicates whether the logic gates are operating normally or in error. This generic type of test circuit is termed a "scan flip-flop circuit".
FIG. 1 is a circuit diagram showing a conventional scan flip-flop circuit 100. Referring to FIG. 1, the conventional scan flip-flop circuit 100 includes an input stage 116, a D flip-flop 110, and an output stage 118. The scan flip-flop circuit 100 has four input terminals D, TI, TE, and CK, and two output terminals Q and QN. The input terminal includes a mode input terminal TE, a normal input terminal D, a scan input terminal TI, and a clock input terminal CK. An operating mode signal is applied to mode input terminal TE, a normal logic signal is applied to normal input terminal D, a scan logic signal is applied to scan input terminal TI, and a clock signal is applied to clock input terminal CK. The first output terminal Q receives one of the normal logic signal or the scan logic signal which are applied to the normal input terminal D and the scan input terminal TI, respectively. The first output terminal Q produces an output in accordance with the clock signal. The second output terminal QN similarly receives either the normal logic signal or the scan logic signal, inverts the received signal, and outputs the result in accordance with the clock signal.
Input stage 116 of scan flip-flop circuit 100 selects between the normal logic signal and the scan logic signal in accordance with a defined operating mode for the scan flip-flop circuit 100, and outputs the selected logic signal to the D flip-flop 110. Input stage 116 includes a first AND gate 104, a second AND gate 106, and a NOR gate 108. First AND gate 104 ANDs the normal logic signal and an inverted operating mode signal. Second AND gate 106 ANDs the scan logic signal and an operating mode signal. NOR gate 108 NORs an output of first AND gate 104 and an output of second AND gate 106. Accordingly, input stage 116 selects and outputs the normal logic signal when scan flip-flop circuit 100 operates in a normal mode (TE='0'), and selects and outputs the scan logic signal when scan flip-flop circuit 100 operates in a scan mode (TE='1').
Unfortunately, the input stage of the conventional scan flip-flop circuit is characterized by a large number of transistors which are necessary to implement the plurality of logic gates. Because of this large number of transistors, the conventional scan flip-flop circuit occupies a considerable space within the semiconductor IC and generally reduces the overall degree of device integration.
Returning to FIG. 1, D flip-flop 110 includes one input terminal which receives either the normal logic signal or the scan logic signal from input stage 116 and outputs the received logic signal in synchronism with the clock signal. Typically, D flip-flop 110 of scan flip-flop circuit 100 is triggered on a rising edge of the clock signal. Operation and construction of the D flip-flop is conventional. In a case where a rising clock edge is applied to a clock (or gating) terminal of D flip-flop 110, the D flip-flop will output a signal having a logic value of '1' when the received input signal has a logic value of '1', and will output a signal having a logic value of '0' when the received input signal has a logic value '0'. D flip-flip 110 also delays its output relative to the received input signal by a time interval up to the period of the clock signal.
Output stage 118 includes first and second inverters 112 and 114, which are respectively connected to output terminals Q and QN of D flip-flop 110. First and second inverters, 112 and 114, respectively invert signals to be output from first and second output terminals Q and QN of D flip-flop 110.
Table 1 is a truth table showing values output from output terminals Q and QN and corresponding values applied to the respective input terminals D, TI, TE, and CK in the conventional scan flip-flop circuit shown in FIG. 1. Here, Q(n+1) indicates an output corresponding to an (n+1)th clock signal.
TABLE 1DT1TECKQ(n + 1)QN(n + 1)0x0Rising011x0Rising10x01Rising01x11Rising10xxxFallingQ(n)QN(n)
FIG. 2 is a circuit diagram illustrating an example of a scan chain circuit and its operation using a plurality of scan flip-flop circuits like the one shown in FIG. 1. As shown in FIG. 2, the scan chain is composed of five scan flip-flip circuits 202, 204, 206, 208, and 210, and two combinational logic circuits 212 and 214. It is assumed that three scan flip-flip circuits 202, 204, and 206 each respectively receive externally applied normal logic signals when a scan chain operates at a normal mode. It is further assumed that each of the combinational logic circuits 212 and 214 includes at least one output terminal and at least two input terminals. Logic states for signals apparent at the respective output terminals of the combinational logic circuits 212 and 214 are determined by the respective states of signals simultaneously applied to the corresponding input terminals.
The scan chain includes three normal input terminals IN1, IN2, and IN3, one scan input terminal SCAN_IN, a mode input terminal TEST, a clock input terminal CLK, and one output terminal OUT or SCAN_OUT. An externally derived normal logic signal is applied to the three normal input terminals IN1, IN2, and IN3, a scan logic signal is applied to the scan input terminal SCAN_IN, an operating mode signal is applied to the mode input terminal TEST, and a clock signal is applied to the clock input terminal CLK. As shown in FIG. 2, a scan input terminal SCN_IN to which an externally derived scan logic signal is applied, is connected to only the scan input terminal TI of a first scan flip-flip circuit 202. The scan input terminals TI for the other scan flip-flop circuits (204, 206, 208, and 210) are connected in a cascade fashion from the output terminals Q of a previous scan flip-flip circuit to a following scan input terminal of a next scan flip-flop circuit, thereby forming a chain configuration or arrangement. In such a scan chain, signal racing due to clock skew is prevented by inserting nil cells (nil1, nil2, nil3, and nil4 ) are respectively inserted between an output terminal Q and a corresponding scan input terminal T1 in the cascade.
On the other hand, when the scan chain circuit of FIG. 2 operates in scan mode (TE=1), each of the scan flip-flip circuits performs a scan operation in response to a signal applied through its scan input terminal TI, and outputs a scan test result through scan flip-flop circuit 210 which forms a final stage for the scan chain. In contrast to this operation, when the circuit of FIG. 2 operates in a normal mode (TE=0), each scan flip-flop circuit operates in response to a signal applied through a normal input terminal D, regardless of the signal applied through scan input terminal TI. That is, when the circuit of FIG. 2 operates in normal mode (TE=0), the signal applied through a scan input terminal TI for each scan flip-flop circuit is not used during normal operation of the circuit. However, as indicated at Table 1, when the circuit of FIG. 2 operates in normal mode (TE=0), each scan flip-flop circuit will nonetheless continuously toggle in its state in response to the signal applied to its scan input terminal TI in from the preceding output terminal Q. This useless signal level switching consumes considerable power.

Scan flip-flop circuit with reduced power consumption


A printing apparatus includes a medium casing which accommodates at least one printing medium in a stack manner, an accommodated medium conveying unit which conveys the at least one printing medium accommodated in the medium casing from a first medium standby position to a second medium standby position, a feeding unit which feeds an outermost printing medium of the at least one printing medium conveyed to the second medium standby position from the medium casing, a printing medium conveying unit which conveys the fed printing medium from the feeding unit to a printing position, a print head which is disposed at a position opposed to the printing position and carries out a printing process on a printing surface of the conveyed printing medium, and a brush which brushes off the printing surface of the printing medium at a position between the second medium standby position and the printing position.

JP-A-2005-179043 discloses a configuration of a sheet feeder that feeds media, which are accommodated in a casing, to the outside of the casing in a printing apparatus such as a printer, a copying machine, etc (see FIG. 1 and FIG. 3A through FIG. 5). The sheet feeder lifts printing media accommodated in a casing to a feeding position and feeds the most upwardly placed printing medium by a conveying roller.
However, printing media may be accommodated in a casing in a state where paper dust and dusty substances are adhered to the printing media or foreign substances are adhered thereto due to cutting of printing media. When the printing media fed from the casing with such foreign substances adhered thereto, and the printing media are subjected to printing by a printing apparatus such as a printer, the foreign substances are adhered to the print heads of the printer. Thus, printing quality may be deteriorated. For example, regarding an ink jet printer, nozzle holes are blocked up with foreign substances adhered to nozzles for discharging ink. Thus, ink discharging characteristics of the nozzles may be changed. Further, foreign substances may be adhered to the print heads of a thermal transfer printer. In this case, ink transfer may be defected or become uneven. Thus, there is a fear that foreign substances adhered to the printing media deteriorates the printing quality.