This is a discharge cell used for an ozonizer. A space where a discharge gap amount is determined between the first electrodes 10 and 10 is formed by stacking a couple of upper and lower first electrodes 10 and 10, constituted by the plate-like rigid body, in both sides with sandwiching a couple of rigid body spacers 20 and 20. In this space, a dielectric body unit 30 that consists of a rigid body of the sandwich structure of sandwiching a second electrode 32 is arranged between glass plates 31 and 31. The dielectric body unit 30 is supported in a neutral position in the space by a plurality of spacers 40, 40, . . . for discharge gap formation that are inserted between the upper and lower first electrodes 10, and forms discharge gaps 50 and 50 in both sides. The minimum discharge gap amount G of 0.4 mm or less is stably secured. It is possible to prevent the damage of a cell component and a pressurizing mechanism.

1. Field of the Invention
The present invention relates to a discharge cell used for a plate type ozonizer.
2. Description of the Related Art
A discharge cell shown in FIG. 16 is known as one of discharge cells used for plate type ozonizers.
The discharge cell shown in FIG. 16 comprises a couple of low voltage electrodes 1 and 1 acting for a heat sink, a dielectric body unit 2 arranged between the couple of low voltage electrodes 1 and 1, spacers 4, 4 . . . for forming discharge gaps 3 in both sides of the dielectric body unit 2. The dielectric body unit 2 has multilayer structure where a high-voltage electrode 2b intervenes between two glass plates 2a and 2a as a dielectric body. The spacers 4, 4 . . . . includes metal, ceramics, glass, or a resin, and are arranged in predetermined intervals in the direction perpendicular to a direction of gas circulation in the discharge gaps 3.
In a usual plate type ozonizer, it is made to form the discharge cell by making the low voltage electrodes 1 and 1 and dielectric body unit 2 be a module, and by stacking the modules in the thickness direction with making the low voltage electrodes 1 and 1 shared between adjoining modules.
When generating ozone, it is performed to apply a predetermined high voltage to the high voltage electrode 2b in the dielectric body unit 2 with circulating a raw material gas comprising an oxygen gas or a mixed gas including an oxygen gas into the discharge gaps 3 and 3 formed in both sides of the dielectric body unit 2. Since a silent discharge arises in the discharge gaps 3 and 3 by applying a high voltage, the oxygen gas in the raw material gas is ozonized.
In such a discharge cell for a plate type ozonizer, current tendency is to make each gap amount G of the discharge gaps 3 and 3 be small. It is considered that this is because it becomes possible by making each gap amount G of the discharge gaps 3 and 3 be small to highly concentrate the ozone gas since the cooling efficiency of the discharge gaps 3 and 3 increases, it becomes possible to obtain a discharge effect suitable for ozone generation, and it becomes possible to reduce the thickness of the high voltage electrode 2a, and by extension to the thickness of the discharge cell since it becomes possible to simplify the cooling structure of the high voltage electrode 2a by the cooling efficiency in the discharge gaps 3 and 3 increasing.
Then, as for the reduction of each amount G of discharge gaps (hereinafter, a discharge gap amount G), it is mentioned in the laid-open specification of PCT/US/10764 that it is effective to make it be 0.005 inches or less (0.13 mm or less). Actually, also according to the test and analysis by the present inventor et al., it is apparently effective to the generation of high concentration ozone that each discharge gap amount G is 0.4 mm or less, and in particular, 0.2 mm or less.
However, it is not easy to stably realize a minimum discharge gap amount G that is 0.2 mm or less in amass production level.
That is, in order to realize the minimum discharge gap amounts G, the spacers 4, 4 . . . having the thickness that is the same as the discharge gap amounts G are necessary. As described above, metal, ceramics, glass, or a resin is used as the material of the spacers 4, 4 . . . .
In the discharge cell shown in FIG. 16, pressure F in a cell assembly (hereinafter, cell assembly pressure F) is directly applied to the spacers 4, 4 . . . . Hence, if the spacers 4, 4 . . . are made of elastic bodies such as a resin, the magnitude of the gap amounts G of discharge gaps changes with the magnitude of the cell assembly pressure F, and hence it is difficult to stably manage the discharge gap amounts G at a constant value.
If the spacers 4, 4 . . . are made of rigid bodies such as metal, ceramics, or glass, compression in the thickness direction does not arise, and hence predetermined discharge gap amounts G are secured once. But, since the cell assembly pressure F is directly applied to the spacers 4, 4 . . . and the dielectric body unit 2, depending on the magnitude of the cell assembly pressure F, there is a possibility that the minute spacers 4, 4 . . . may be damaged or the glass plates 2a and 2a in the dielectric body unit 2 may be damaged.
In addition, since it is necessary to equally pressurize the whole discharge cell in any cases, it cannot be avoided to upsize a pressurizing mechanism (clamping mechanism).
In addition, in the above-described discharge cell, since the gas circulates in parallel and one-way traffic from the front of the discharge gaps 3 and 3 to the back, it is necessary to take out the ozone gas through a comparatively large header attached in the back face of the discharge cell. For this reason, the ozonizer is further enlarged, and hence manufacturing cost also increases.
Furthermore, in a usual discharge cell, as described above, since the stacked structure where many modules are stacked in the thickness direction is adopted, a laminated face appears in the back face, on which the header is attached, as it is, and hence it is not flat. For this reason, since it is difficult to perform sealing between the discharge cell and header, this sealing cost also increases.
In a discharge cell for an ozonizer, it is important to miniaturize the discharge cell with keeping the same performance, or to enhance performance without upsizing the discharge cell. There are several methods for enhancing the performance, and one of them is to enhance ozone-generating efficiency by suppressing temperature increase in the discharge gaps 3 and 3. For this reason, electrodes, that is, at least the low voltage electrodes 1 and 1 are made to be coolers with jacket structure to entirely cool the discharge gaps 3 and 3 from both sides. There is thinning of a cell module as another method. Supposing the thickness of each module is reduced to one half, cell modules whose number is twice as many as the number of conventional cell modules can be arranged in the same space, and hence performance is enhanced twice.
However, it is difficult to thin a cell module in a conventional discharge cell. A main reason is that the thickness of the cooler is dominant over that of the cell module. Since essentially having large thickness in comparison with other components such as a dielectric body made of a thin plate, the cooler with the jacket structure becomes a major cause of blocking the thinning of the cell module. In addition, since fittings attached to side faces for the supply and exhaust of cooling water mutually interfere, it is difficult to thin the cooler to the thickness smaller than the size of the fittings.
Therefore, since the thickness of the cooler is dominant over the thickness of the cell module, it is difficult to thin the cell module to the thickness smaller than that of the present cell module.
In addition, the number of stacked layers of the cell module is large, for example, 30. For this reason, it has great influence on the price reduction of a discharge cell for an ozonizer to reduce the manufacturing cost of each module. As for the high voltage electrode 2b intervening between the two glass plates 2a and 2a in the dielectric body unit 2, it is known that cooling becomes unnecessary by thinning. From this viewpoint, the high voltage electrode 2b is formed by integrally coating a conductive material over both surfaces of the glass plates 2a and 2a by metallizing, plating, thermal spraying, or the like.
Owing to this, since a gap is eliminated from between the glass plate 2a and high voltage electrode 2b, a discharge required for generating ozone stably arises in the discharge gap 3. However, on the other hand, since coating cost for forming an electrode increases, this becomes a major factor of increasing the manufacturing cost of each module. In addition, it is also a problem that mechanical and physical secondary abuses arise and leading of a terminal area becomes difficult, by the glass plate 2a being heated in the coating process.
In addition, conventionally, this high-voltage electrode 2b is formed with coating substantially over the glass plates 2a and 2a, and the depth of the high voltage electrode 2b in the fore-and-aft direction is substantially the same as the depth of the low voltage electrodes 1 and 1 with the depth of the glass plates 2a and 2a. Nevertheless, as a recent tendency, the thickness of the glass plate 2a has been made thin so as to miniaturize a discharge cell, and the distance between components of the discharge cell is shortened. Hence, it has become impossible to secure the sufficient insulation distance between the high voltage electrode 2b and low voltage electrodes 1 and 1. For this reason, since unusual discharges frequently occur between the high voltage electrode 2b and low voltage electrodes 1 and 1, the deterioration of reliability of the discharge cell has been a problem.
An object of the present invention is to provide a discharge cell for an ozonizer that can stably secure the minimum discharge gap amount G such as 0.2 mm or less in a mass production level, and can avoid the breakage of a cell component and the upsizing of a pressurizing mechanism (clamping mechanism).
Another object of the present invention is to provide a small and economical discharge cell for an ozonizer where it is easy to exhaust ozone gas in spite of performing gas circulation in a parallel flow.
Still another object of the present invention is to provide a discharge cell for an ozonizer that has a thin cooler without lowering coolability, and makes it possible to drastically enhance performance.
Further another object of the present invention is to provide an economical discharge cell for an ozonizer that can reduce the manufacturing cost of a module, and in particular, electrode formation cost.
Still further another object of the present invention is to provide a discharge cell for an ozonizer with high reliability that does not cause an unusual discharge.


IgE antagonists comprising one or more of the Fc.sub..epsilon. RI receptor-binding determinant sites of human IgE are described. The disclosed antagonists include IgE variants, peptide antagonists, peptidomimetics and other small molecules. The antagonists are useful in raising and screening anti-IgE antibodies, in the isolation and purification of Fc.sub..epsilon. RI receptor, and in the treatment of allergic disease.

IgE is a member of the immunoglobulin family that mediates allergic responses such as asthma, food allergies, type 1 hypersensitivity and the familiar sinus inflammation suffered on a widespread basis. IgE is secreted by, and expressed on the surface of, B-cells. IgE binds to B-cells (and monocytes, eosinophils and platelets) through its Fc region to a low affinity IgE receptor (Fc.sub..epsilon. RII). Upon exposure of a mammal to an allergen, B-cells synthesize IgE that binds the allergen. This IgE in turn is released into the circulation by the B-cells where it is bound by B-cells (through the Fc.sub..epsilon. RII) and by mast cells and basophils through the so-called high affinity receptor (Fc.sub..epsilon. RI) found on the surface of the mast cells and basophils. Such mast cells and basophils are thereby sensitized for allergen. The next exposure to the allergen cross-links the Fc.sub..epsilon. RI on these cells and thus activates their release of histamine and other factors which are responsible for clinical hypersensitivity and anaphylaxis.
It is generally understood that Fc.sub..epsilon. RI and Fc.sub..epsilon. RII bind to recognition sites in the IgE constant (Fc) domain. The IgE recognition sites for the two receptors have been poorly defined, despite considerable effort in the past directed to the problem.
Over the past decade several studies have been undertaken to determine which portions of the human IgE molecule are involved in binding to human Fc.sub..epsilon. RI and Fc.sub..epsilon. RII and which portions of the rodent IgE molecules are involved in binding to rodent Fc.sub..epsilon. RI and Fc.sub..epsilon. RII. Essentially three approaches have been tried. First, peptides corresponding to specific portions of IgE sequence have been used as either competitive inhibitors of IgE-receptor binding or to elicit anti-IgE antibodies which would block IgE-receptor interaction. Second, mutations in IgE have been partially explored in efforts to identify the binding site. Third, chimeric molecules have been constructed in attempts to characterize the binding site. These three approaches are discussed below.
For purposes of consistency, all numbering of immunoglobulin amino acid residues, including the amino acid numbering of peptides corresponding to specific portions of IgE, mutant IgE molecules and chimeric IgE molecules, that appears herein is done according to the immunoglobulin amino acid residue numbering system of Kabat et al., Sequences of Proteins of Immunological Interest (National Institutes of Health, Bethesda, Md. 1987). Thus, any numbering system for immunoglobulins or fragments thereof appearing in the references discussed below is ignored and such immunoglobulins or fragments are renumbered herein according to the numbering system of Kabat et al.
In a study using the first approach discussed above, i.e., the IgE peptide approach, Nakamura et al., EP 0263655 published Apr. 13, 1988, found that peptides corresponding to human IgE residues 360-389, 457-523, 464-499, 516-521, 360-380, 376-388, 455-475, 464-472, 497-516, 513-526, 515-521, and 516-530 administered by injection into the skin of rats reduced the size of skin lesions caused by antigen challenge at the treated sites.
Helm et al., Proc. Natl. Acad. Sci., 86:9465-9469 (1989) found that a peptide corresponding to IgE residues 329-409 blocked in vivo sensitization of human basophil granulocytes with human IgE antibodies. Further studies indicated that residues 395-409 were not essential for binding of the 329-409 peptide to Fc.sub..epsilon. RI (Helm et al., Proc. Natl. Acad Sci., 86:9465-9469 (1989)).
Vercelli et al., Nature, 338:649-651 (1989) used recombinant IgE peptides as well as anti-Fc.sub..epsilon. monoclonal antibodies to investigate the B-cell (Fc.sub..epsilon. RII) binding site of human IgE. They concluded that the Fc.sub..epsilon. RII binding site is in Fc.sub..epsilon. 3 near K399-V402.
Burt et al., Eur. J. Immun., 17:437-440 (1987) investigated seven peptides corresponding to amino acid sequences located within various surface regions of the C.sub.H 3 and C.sub.H 4 domains of rat IgE for competition against rat IgE in binding to rat mast cells. Their most active peptide, p129, was 1000-fold less active than IgE. p129 is homologous to human sequence 439-453 which includes loop EF. Another of their peptides, p130, homologous to residues 396-418 in the human Fc.sub..epsilon. 3 domain, which includes the CD loop, had no activity.
Robertson et al., Molec. Immun., 25:103-113 (1988) assessed murine IgE binding by sequence-directed antibodies induced by several synthetic peptides. They concluded that the sequence defined by their .epsilon.-peptide-4 (homologous to human IgE residues 446-460 spanning the EF loop), was not significantly involved in receptor binding while the sequence defined by their E-peptide-3 (homologous to human IgE residues 387-401), was likely to be proximal to the IgE-receptor recognition site. Thus, the murine anti-IgE binding study of Robertson et al., Molec. Immun., 25:103-113 (1988) contradicted the Burt et al., Eur. J. Immun., 17:437-440 (1987) data implicating the EF loop in rat IgE binding.
Nio et al., Peptide Chemistry, 203-208 (1990) evaluated numerous peptides with respect to their ability to inhibit histamine release by human basophils in vitro. Only one peptide (peptide 2, Table 1), exhibited specific inhibition; this peptide encompassed residues 376-388. However, a larger peptide which incorporated this sequence (peptide 3, Table 1), had no inhibitory activity.
In a study using the second approach discussed above, i.e., mutations in mouse IgE to characterize the Fc.sub..epsilon. RI-binding site on mouse IgE, Schwarzbaum et al., Eur. J. Immun., 19:1015-1023 (1989) (supra) found that a point mutant P404H (P442H by the numbering system used herein) had 2-fold reduced affinity for Fc.sub..epsilon. RI on rat basophilic leukemia (RBL) cells, but the interpretation of this finding is controversial (Weetall et al., J. Immunol., 145:3849-3854 (1990)).
Lastly, in the third approach discussed above, chimeric molecules have been constructed in attempts to identify the Fc.sub..epsilon. RI-binding site on IgE. Human IgE does not bind to the murine receptor (Kulczycki Jr., et al., J. Exp. Med., 139:600-616 (1974)) while rodent IgE binds to the human receptor with a reduced affinity (Conrad, et al., J. Immun., 130:327-333 (1983)); human IgG1 does not bind to IgE receptors (Weetall et al., J. Immun., 145:3849-3854 (1990)). Based on these observations, several groups have constructed human-murine chimeras or human IgE-IgG chimeras. Weetall et al., J. Immun., 145:3849-3854 (1990) made a series of human IgG1-murine IgE chimeras and concluded that the Fc.sub..epsilon. 2 and Fc.sub..epsilon. 3 domains are involved in binding murine Fc.sub..epsilon. RI while the Fc.sub..epsilon. 4 domain is unlikely to be involved in binding to murine Fc.sub..epsilon. RI (but may possibly be involved in binding to Fc.sub..epsilon. RII). However, these conclusions are uncertain since they rest primarily on lack of binding by chimeras and three of five chimeras lacked some interchain disulfide bonds.
Nissim et al., EMBO J., 10:101-107 (1991) constructed a series of human-murine IgE chimeras and measured binding to RBL-2H3 rat mast cells and concluded that the portion of mouse IgE which binds with high affinity to the specialized Fc.epsilon. receptor on RBL cells could be assigned to Fc.sub..epsilon. 3. In further studies with human-murine IgE chimeras, Nissim et al., J. Immunol., 150: 1365-1374 (1993) reported that although the introduction of the entire mouse Fc.sub..epsilon. 3 domain into human IgE enabled the chimera to bind mouse Fc.sub..epsilon. RI, the swapping of only 16 or 26 amino acids from the N-terminus of mouse Fc.sub..epsilon. 3 for the homologous residues in human IgE (residues 361-377 or 361-388) was insufficient to endow the chimera with mouse Fc.sub..epsilon. RI-binding ability. Moreover, Nissim et al. (J. Immunol.) found that substitution of 26 amino acids from the N-terminus and 47 amino acids at the C-terminus of mouse Fc.sub..epsilon. 3 for the homologous residues in human IgE (residues 361-388 and 438-506) failed to confer mouse Fc.sub..epsilon. RI-binding ability and also reduced human Fc.sub..epsilon. RI-binding ability.
The results reported by these authors (e.g. Helm et al. and Burt et al.) are contradictory as to what part of IgE binds to Fc.sub..epsilon. RI in rodents or humans. However, the instant invention precisely identifies the domains of human IgE which are involved in the binding of human IgE to human Fc.sub..epsilon. RI receptor.
It is an object of this invention to identify antagonists of human IgE which are capable of inhibiting allergic responses.
It is another object to provide novel compounds for use in the assay of human Fc.sub..epsilon. RI receptor and for use as immunogens or for selecting anti-human IgE antibodies.


A enhanced folding bed bracket, lean leg bars are installed on both sides of the X shaped folding bracket for dispersing the force received by the bracket, the lean leg bars are linked with the leg bars of the bracket through connecting member, thereby the lean leg bar can be folded or unfolded along with the fold or unfold of the fold folding frame. The strength of the bracket is increased, in the mean time the folding or unfolding is not affected. The improved enhanced folding bed bracket, its bracket receives much less force, is not easy to be deformed and folding and unfolding are easy.

Folding bed, the name suggests that you can fold the bed. Often, the folding bed is made by a wooden or metal frame tied by canvas, it always is used for the field work or the march, it can be folded to put in a small bag for easy carry. More and more people participate in outdoor recreation, camping and other activities, so that folding bed market is also growing, accompanied by, consumers require increasingly high quality for the folding bed.
Chinese patent application No. "201,320,678,955.3" discloses a folding bed, including at least three X-shaped folding stands, a bed cloth, a head bar, an end bar, two side bars, L-shaped connecting members and the T-shaped connecting members. Said side bar is composed by two connected fulcrum bars, and both ends of the side bar are connected with the head bar and end bar respectively to form a square frame for supporting the bed cloth. Wherein two X-shaped folding frame connect with end of the side bars by the L-shaped members, the third X-shaped folding frame is provided at the junction of two fulcrum bars through the T-shaped connecting members. The volume of the folding bed is made smaller by five times folding, more convenient to carry. However, such a problem that the structure is only applicable to the bed width of the smaller design. The leg bars of the X-shaped folding frame and the ground constituting the ground angle is small, usually about 30°, resulting in the leg bars receive a large force, when applying the design to the bed with greater width, the force applied to the leg bars will increase, such structural design of folding beds tend to be difficult to pass the load tests, the leg bar is easily deformed, which affects the use performance and service life.


A Component of a technical installation comprises a memory unit for storing identification data related to the component and/or technical date related to the component and/or a user manual and/or transportation information related to the component and/or links directed to further information related to the component.

Whenever components or products of a technical installation are shipped to a customer it is necessary to separately ship a documentation including information such as identification data or technical data of the component shipped. Further, in particular with regard to large technical installations, during transportation, erection and commissioning the information of the installation has to be matched with a manual which has to be handed out to the costumer. Then, e.g., at the customer side, it is hard to identify the match between the single component and its documentation, and the manuals often are not at hand. During service life it is difficult to identify the correct spare parts, and the maintenance instructions are not always at one's fingertips.


There is a need to perform recalculation against a fault attack on any public key e within a time period required for one-time modulo exponentiation.

The present invention relates to a technology effectively applicable to products and systems equipped with a security function such as IC cards, onboard microcomputer systems, and IOT (Internet of Things) in terms of countermeasures against a fault attack on the Chinese remainder theorem (CRT) used for the Rivest Shamir Adleman (RSA) algorithm as one of public key encryptions.
The RSA algorithm uses the Chinese remainder theorem for fast decryption. On the other hand, various attack techniques are proposed to expose secret information such as keys during execution of encryption algorithms such as RSA. A fault attack is one of dangerous attack techniques. This method generates an error using some technique during a calculation and specifies key information based on a result of this calculation and a result of the normal calculation.
RSA
The RSA algorithm uses equation X=ZemodM for encryption and equation Z=XfmodM for decryption, where e and ne denote public keys, f denotes a private key, Z denotes plain text, and X denotes encrypted text.
The following relations hold: 1=e×fmod{(p−1)(q−1)} and M=p×q, where p and q denote private prime numbers.
Chinese Remainder Theorem
When the above-mentioned decryption uses the Chinese remainder theorem, plain text Z results from the following equations: Dp=fmod (p−1); Dq=fmod(q−1); Xp=XDpmodp; Xq=XDqmodq; w=(Xp−Xq)×q−1modp; and Z=w×q+Xq.
Fault Attack
The fault attack technique exposes secret information such as a key by comparing a correct value with a value output from a faulty state caused by injecting a noise injected into a power supply or a clock or irradiating a laser to a circuit during encryption.
Fault Attack on the Chinese Remainder Theorem
As described below, a fault attack on the Chinese remainder theorem causes a faulty state during the modulo exponentiation operation to find Xp or Xq. The fault attack causes a faulty state at the timing to execute the modulo exponentiation operation to find Xp as illustrated in FIG. 6. Given Z′ denotes a calculation result to cause the faulty state and the error and Z denotes a correct calculation result, the following equations Z-Z′=(w-w′)×q and q=gcd{pq, (w-w′)×q}=gcd(M, Z-Z′) are used to find q as the greatest common divisor of known value M and output value difference Z-Z′. This can find p and f from q. An attacker can expose private key f.
Countermeasures Against the Fault Attack
The technique described in patent literature 1 provides a countermeasure against an attack technique that illegally exposes private key f by analyzing physical information such as power consumption. The technique described in patent literature 2 provides a countermeasure against an attack that analyzes power consumption or injects an error. However, none of the technologies consider countermeasures against a fault attack on the decryption algorithm using the Chinese remainder theorem. The inventors examined the following countermeasures.
The first countermeasure is to calculate Xp and Xq each twice and output value Z if the same value results from the calculations performed twice. If a recalculation yields different results, an attack is assumed to occur and value Z is not output. This method needs to perform the modulo exponentiation operation for Xp and Xq four times.
The second countermeasure is to re-encrypt result Z (X=ZemodM) of a calculation using the Chinese remainder theorem. Value Z is output if the result equals input X. Value Z is not output otherwise. It is common practice to use e=65537. In this case, the re-encryption does not require a long calculation time. The calculation time is not impractical.

Abstract: A modulo exponentiation operation is expressed as Y=XdmodN. The modulo exponentiation operation is performed to yield C0=Xd′modN, C1=XdmodN, and T=X2^nmodN, where d′ denotes two's complement of d and n denotes the number of bits in d. The modulo exponentiation operation determines whether or not a remainder resulting from the product of a value of C0 and a value of C1 modulo N matches a value of T. The modulo exponentiation operation assigns the value of C1 to Y if a match is found. The modulo exponentiation operation reports an error if a match is not found. The modulo exponentiation operation applies an RSA decryption process to a modulo exponentiation operation using the Chinese remainder theorem.


A chain wheel for driving or diverting a conveyor of an apron conveyor including transport plates is disclosed. The transport plates may be releasably connectable via a chain connecting parts to the conveyor chain. The chain wheel may have a chain wheel body including a lateral face. The chain wheel may also have teeth arranged peripherally offset over the lateral face. In addition, the chain wheel may have bearing faces. The bearing faces may be arranged peripherally offset over the lateral face between two adjacently situated teeth. The bearing faces may also be configured to support the chain connecting parts.

In minerals mining, such as, in particular, in underground mining, so-called scraper chain conveyors have for decades been used for material transport, in which an endless conveyor chain is provided at regular intervals with drivers, which are connected to the horizontally lying chain links, hereinafter referred to as horizontal chain links, of the conveyor chain. The conveyor chain runs at both conveyor ends around a respective chain wheel, by means of which the conveyor chain is diverted and/or driven. Both chain wheels here have teeth with uniform tooth pitch. Particularly in scraper chain conveyors, in which only one chain wheel is motor-driven whilst the other chain wheel forms a pure deflection pulley in a reversing station, the chain wheel of the reversing station, after a certain operating time, has been used in the main drive, and vice versa, in order to continue to operate the scraper chain conveyor with the same pair of chain wheels. The chain wheels are generally mounted and supported at the main drive station and at the reversing station with a substantially horizontally lying chain wheel axle, with the distance between two drivers normally amounting to a plurality of horizontal and vertical chain links. In representation of numerous such embodiments of scraper chain conveyors, reference is made to WO2007/110088 A1, having block-like horizontal chain links, or DE 43 16 753 A1, having eyelet-like chain links.
In respect of the scraper chain conveyors, scraper chain conveyors having a double-centre chain have almost totally prevailed in recent years. The driving or diversion of the conveyor chain around the chain wheel has been realized by a horizontal chain link being respectively placed with its one bend against the locating pocket on the rear flank of a first tooth and with its other bend against the front flank of the, in the direction of rotation, following tooth. At the same time, the vertical chain links engage in an interspace on the tooth to enable the next following horizontal chain link to come to bear with its front bend correspondingly against the rear side of the second tooth, and the rear bend to come to bear against the front flank of a then third tooth. Due to the play in the joints of the individual chain links with one another, each tooth may press with its locating pocket on the front flank against the bend of a horizontal chain link, which at the same time engages in the eyelet of a following vertical chain link. Hereby the vertical chain link is drawn into the tooth space and the next following horizontal chain link is drawn into the circulation around the chain wheel.
Due to the high raw material requirement, there is increasingly the desire to work even poorly accessible or, where appropriate, very low deposits. In DE 20 2012 100 777, the Applicant has proposed an apron conveyor in which the transport plates are tiltably connected to a chain connecting part, which is in turn connected to the respective horizontal chain links of a conveyor chain.
The present disclosure is directed, at least in part, to improving or overcoming one or more aspects of prior systems.


The present invention provides a semiconductor laser device of which reliability is enhanced. In the semiconductor laser device of the present invention, a semiconductor laser element 3 emitting laser light in a plane direction, a reflection mirror 4 reflecting the laser light in an upper direction and a light acceptance unit 5 detecting signal of incident laser light are disposed inside an insulative frame 2. A plurality of leads 8 extending in a horizontal direction are fixed in the end walls 2a, 2b opposed to each other in the longitudinal direction of the insulative frame 2. The insulative frame 2 is made of liquid crystal polymer.

The present invention relates to a semiconductor laser device. Particularly, the present invention relates to a semiconductor laser device used as an optical pickup apparatus which reads out information recorded in an optical recording medium or writes information in the optical recording medium.
As a conventional semiconductor laser device, Japanese Laid-open patent publication No. 2001-111159 describes a semiconductor laser device 104 as shown in FIG. 9. In a housing portion of an insulative frame 100 with an upper end opened, a semiconductor laser element 101, a reflection mirror 102, a light acceptance unit 103 and so on are housed. The insulative frame 100 is made of PPS resin having a heat-resisting temperature of 260° C. However, in a fabrication process, high heat resistance is required when heating wire bond or soldering the semiconductor laser device by lead free solder. The conventional PPS resin has a disadvantage that a margin of the heat resistance is not enough.
Also, in the conventional semiconductor unit 104, when providing leads 105 on the insulative frame 100, the end 105a of each lead 105 is pressed on the bottom of the housing portion from upward to fix the lead 105. However, there has been a disadvantage that skew or shift of the lead 105 is caused when fixing the lead 105, resulting in decrease of reliability of the wire bond and deterioration of dimensional and positioning accuracy as a product of semiconductor laser device.
There has been an another disadvantage that as the insulative fame 100 of the conventional semiconductor laser device 104 has thin thickness as compared to the longitudinal dimension of the frame 100, the frame 100 deforms when the temperature is elevated. Also, there has been a disadvantage that the mechanical strength is low even at a normal temperature.
In the conventional semiconductor laser device 104, light emitted from the semiconductor laser element 101 in a plane direction is reflected on the reflection mirror 102 and irradiated in a top surface direction. As shown in FIG. 10, when attaching the reflection mirror 102 on an inclined surface of a stem 106 formed around the semiconductor element 101, resin is applied on a reflection-mirror attaching position (inclined surface) and the reflection mirror 102 is disposed and fixed thereon. In this method, however, the movement of the reflection mirror 102 is not restrained when fixing the reflection mirror 102. Therefore, there has been a disadvantage that the reflection mirror 102 is shifted, generating lift or skew and causing deterioration of fabrication accuracy or product properties.
Furthermore, in the conventional semiconductor laser device 104, signal processing (signal detecting) of light reflected on and returned from an optical recording medium is conducted using only one light acceptance unit 103. However, as shown in FIG. 10, when fixing the reflection mirror 102, for example, if the reflection mirror 102 is inclined in a direction shown by an arrow A, a light input position on the light acceptance unit 103 for signal detecting is shifted as show in FIG. 11 in a left-right direction in the figure from a light input position P at the time of focalizing. On the other hand, if the reflection mirror 102 is inclined in a direction shown by an arrow B, the light input position is shifted as shown in FIG. 11 in an up-down direction in the figure. The shift of the light input position P is also caused by change of ambient temperature.


In order to detect a passage timing of a light beam and to suppress cost, a light beam detection circuit (2) includes a detection signal generation section (34) configured to receive a light beam for scanning of a scanning target (101A) with one optical sensor (10), and generate a detection signal corresponding to an amount of received light; a reference signal output section (44) configured to output a reference signal that is in proportion to a light-amount control signal of a light-emission element (LD1) that emits the light beam; and a synchronizing signal generation section (35) configured to compare a detection signal generated by the detection signal generation section (34) with a reference signal output from the reference signal output section (44) to generate a synchronizing signal to determine a position to start scanning of the scanning target (101A) with the light beam.

As illustrated in FIG. 1, an electrophotographic type image forming apparatus includes a Beam Detect (BD) sensor on the starting side of a light beam scanning area. The BD sensor is configured to, as a light beam for scanning by a light beam scan unit passes therethrough, output a detection signal of the magnitude corresponding to the amount of received light of the light beam. The light beam scan unit controls a timing to write an electrostatic latent image on a photoreceptor drum in accordance with the detection signal of the BD sensor.
For instance, the light beam scan unit processes a detection signal of the BD sensor with a light beam detection circuit as shown in FIG. 2A. This light beam detection circuit includes a comparator having an inverting input terminal that receives, as an input, a detection signal (voltage V−) of the BD sensor subjected to current-voltage conversion. The comparator has a input terminal that receives, as an input, predetermined voltage V+ as a threshold level (threshold value). As shown in FIG. 2B, the comparator outputs a synchronizing signal when the voltage V− exceeds the voltage V+. Upon detecting a change of the synchronizing signal of the comparator from H level to L level, a control section sets a starting position to write an image.
Some conventional electrophotographic type image forming apparatuses are adapted to change the light amount of a light beam depending on ambient temperature or ambient humidity of the apparatus, a deterioration state of the photoreceptor drums and the like (see Patent Literature 1, for example). Such an image forming apparatus, however, has a problem that a change in the light amount of a light beam causes displacement of a starting position to write an image. For instance, as shown in FIG. 2C, since the magnitude and the tilt of a detection signal (voltage) of the BD sensor differ between the amount of received light of a light beam of 220 μW and 80 μW, the detection timing of the light beams will be different therebetween by about 660 ns. At this time, when the light beam scan speed by the light beam scan unit is 1,612,149 mm/s, then the starting position to write an image will be displaced by as large as about 1.1 mm.
Then, a light scanning recorder conventionally disclosed includes two optical sensors disposed adjacently and compares waveforms output from the two optical sensors, thereby enabling detection of a passage timing of a light beam always precisely without displacement (see Patent Literature 2, for example).

Light beam detection circuit, light beam scan unit and image forming apparatus to detect light beam that changes light-amount thereof


A bird feeder apparatus includes an elongate tubular housing, having a floor mounted intermediate the first and second ends of the tubular housing, with the support post secured to the floor within the tubular housing. The housing includes an annular ring extending about the housing in adjacency to the floor exteriorly of the housing, wherein feed slots directed through the housing permit access to food and projection of food from the housing through the slots. A cap structure mounted to a second end of the housing permits filling of food within the housing.

1. Field of the Invention
The field of invention relates to bird feeder apparatus, and more particularly pertains to a new and improved bird feeder apparatus wherein the same permits selective filling of bird feed within the housing and directing the bird feed exteriorly of the housing while preventing access of animals to the bird feed.
2. Description of the Prior Art
Bird feed apparatus of various types is available in the prior art such as exemplified in the U.S. Pat. Nos. 4,144,842; 4,541,362; 4,867,104; and 4,974,547.
The instant invention attempts to overcome deficiencies of the prior art by providing for a bird feeder apparatus of simple construction preventing access of animals to feed within the housing and in this respect, the present invention substantially fulfills this need.


The present invention provides a hybrid-type cooling device which can perform cooling by phase transition, ventilation and convection.

As design rule decreases due to the trend towards large scale integration of semiconductor devices, and thereby the line width of electronic devices constituting semiconductor devices narrows, small-sized and high performance electronic equipment has been achieved owing to a larger number of transistors per unit area, which causes, however, that the ratio of heat emission of a semiconductor device per unit area increases. The increase of the rate of heat emission deteriorates the performance of semiconductor devices and lessens the life expectancy thereof, and eventually decreases the reliability of a system adopting semiconductor devices. Particularly in semiconductor devices, parameters are too easily affected by operation temperatures, and thereby that further deteriorates properties of integrated circuits.
In response to the increase of the rate of heat emission, cooling technologies have been developed such as fin-fan, peltier, water-jet, immersion, heat pipe type coolers, etc., which are generally known.
The fin-fan type cooler which compulsorily cools devices using fins and/or fans has been used for tens of years, but has some defects such as noise, vibration, and low cooling efficiency compared to its large volume. Although the peltier type cooler doesn't make noise or vibration, it has a problem that it requires too many heat dissipation devices at its hot junction needing large driving power in accordance with the law of conservation of energy. The water-jet type cooler goes mainstream in cooling device research because of its efficiency, but its structure is complicated due to the use of a thin film pump driven by an external power supply, and it is significantly affected by gravity, as well as a problem that it is difficult to achieve robust design when applied to personal mobile electronic equipment.
Due to above problems, the heat pipe type cooler is recently widely applied in various shapes as a compact type cooling device together with the fin-fan type cooler because its advantages that it is simple in structure and easily manufactured. That is, as shown in FIG. 1, a conventional cooling device 10 combining both heat pipe and fin-fan includes a heat pipe 12 contacting a heat source 20 at one end thereof, a plurality of fins 14 being disposed at the other end of the heat pipe 12, and a fan 16 being disposed near the fins 14, whereby the heat absorbed from the heat source 20 is dissipated by the fins 14.
In the cooling device 10 using such heat pipe, since the flowing directions of gas and liquid are opposite each other, it dries out when a large quantity of heat is applied to the heat pipe, because the liquid returning to an evaporation section from a condensation section is sucked again into a gas transfer section due to the speed of the gas generated, so that it eventually fails to return to the evaporation section. In addition, there is a problem that its installation location is significantly restricted because the evaporated refrigerant is transferred depending on the difference between buoyancy and pressure in the heat pipe, and the liquefied refrigerant in the heat pipe depends on gravity due to the structure and size of the medium of the returning section.
Further, since the amount of heat produced by a highly integrated semiconductor device such as an up-to-date CPU is so large that the conventional cooling device cannot deal with the heat, even the cooling device 10 combining heat pipe and fin-fan can manage to cool only when equipped with three or four of the heat pipes 12 and two or more of the fans 16. If the elements increase as above, the size of the device becomes too large, and besides noise and power consumption by lots of the fans 16 also increase considerably, so that it isn't useful any more. The disadvantage of the convention heat pipe type cooler as above is that the loss of heat transfer at the fins themselves rapidly drops in comparison to the heat transfer at the phase transition medium, because it has to transfer heat through fins of large area even though utilizing phase transition of fluid.


A technique is presented for enhancing performance of distributed applications. A sender loop thread in a sending node for sending messages to a destination node is provided with two different opportunities to gain access to the CPU. A batching priority is provided such that when a predetermined number of messages are in a queue for sending to the destination node, the sender loop thread is provided with access to the CPU. Further, the sender loop thread may gain access to the CPU when processing within the sending node is at a relative lull and any number of messages are waiting to be sent within the sending queue. This combination of techniques ensures that when a sufficient number of messages for batching are ready to be sent, they will be sent with minimal delay, while alternatively, if the number of messages have not reached the threshold for batching, but processing is at a relative lull, the messages will be sent anyway, thus utilizing the CPU and preventing unnecessary slowdowns in performance of the distributed application.

1. Field of the Invention
The present invention relates to a system, method and computer program for intelligently batching messages for distribution in a data processing system. More particularly, the present invention relates to a technique for intelligently batching messages for distribution across a process or nodal boundary for a distributed application.
2. Description of the Related Art
Distributed software applications (programs) have gained in popularity recently as they permit enhanced performance by distributing tasks among processors and utilizing otherwise under-utilized processing power. Distributed applications rely on multiple processes running in different nodes to perform or execute the application. Each process typically has multiple threads associated therewith and is usually associated a single computer or processor, although more than one process can exist on a given processor.
With the advent of object oriented languages, the full oriented applications execute by sending messages utilizing names between objects which comprise the application. This is fundamentally different from most applications written in procedural computer languages, in which code modules are identified by their address. This feature of object oriented applications potentially relieves the application developer of the horrific task of having to specifically hard code communications between threads of a distributed application operating in different nodes by local address in order to ensure proper node-to-node communication. In distributed object oriented applications, a "send thread" or routine is typically established within each node or process or object space or address space relative to each potential destination node or process or object space or address space to which messages may be sent.
Relatively slow performance or speed of object oriented applications has been identified as a drawback of using object oriented applications. While performance of object oriented applications operating within a single node has been greatly improved recently, performance issues for distributed applications have received much less attention. One major source of delays has been identified with regard to performance issues of distributed object oriented applications. The performance of a distributed application is greatly affected by the time it costs for messages to be sent from node to node over the network. Sending messages from object to object across nodal boundaries takes several times longer than does sending a message between objects within the same node or object space. The basic prior art technique for sending messages across nodal boundaries calls for simple polling of each send thread within a given process such that each sending thread is polled regularly, such as every 15 milliseconds, and if at least one message is ready or waiting to be sent, all waiting messages are sent. However, this technique is quite inefficient and affects performance because the send threads are constantly polled and responsiveness is tied to the frequency of polling. The less frequent the polling, the greater the amount of batching that occurs, but the application is less responsive. When the polling is more frequent, less batching of messages occurs and more CPU cycles are wasted, but the application is very responsive.
One approach to enhance performance has been the use of pure batching. Batching simply means sending more than one message at a time. A basic batching scheme for a distributed application calls for send thread within a given node to wait until a predetermined number of messages has been delivered to a batch queue for delivery to a destination node. After the number of messages is in the queue, the send thread is given CPU access within the node and the batch of messages is sent out over the network together in a single communication to the destination node. Batching takes advantage of the fact that the cost in time relative to sending more than one message over a network together is much less than the cost of sending each message separately. However, for many applications, and particularly for distributed object oriented applications, this technique may not improve performance significantly and can cause the loss of responsiveness and performance. In extreme cases, if a batch communication is not to be sent until, for example, three messages are in the batch queue, the first and second messages could arrive at practically the same time in the queue, but it may take many seconds or minutes before the third message arrives in the queue and the messages can be sent. Such delays are often not acceptable, as overall processing may be delayed until processing is carried out by objects in the remote node in response to receipt of the messages.
Another attempt to enhance performance calls for the send process relative to a given destination node to interrupt the processing whenever it receives a message to be sent, thus causing the message to be sent virtually immediately. But, once again, this technique fails to optimize performance of the overall application. While such a scheme is quite responsive, no batching will typically occur.
Accordingly, a need exists for a technique by which messages are sent across nodal boundaries which enhances system performance.

Intelligent batching of distributed messages


A system for processing a substrate includes a plasma chamber to generate a plasma therein. The system also includes a process chamber to house the substrate, where the process chamber is adjacent the plasma chamber. The system also includes a rotatable extraction electrode disposed between the plasma chamber and substrate, where the rotatable extraction electrode is configured to extract an ion beam from the plasma, and configured to scan the ion beam over the substrate without movement of the substrate by rotation about an extraction electrode axis.

1. Field
Embodiments relate to the field of substrate processing using ions. More particularly, the present embodiments relate to a system and structure for providing an ion beam to a substrate.
2. Discussion of Related Art
Present day plasma based processing systems include apparatus in which a substrate is held stationary while immersed in a plasma that encompasses the substrate, as well as apparatus that employ scanning of a substrate in a process chamber adjacent to a plasma chamber or plasma source. The latter type of apparatus facilitates the use of relatively compact ion or plasma sources, since only a portion of a substrate need be exposed to ions from a plasma at a given time. For example, some configurations employ plasma chambers in which a rectangular extraction assembly is used to extract an ion beam having an elongated cross section.
To expose an entire substrate to ions from the plasma source, the substrate is scanned adjacent to the extraction assembly along a given direction. At any instance, a portion of the substrate defined by the size and shape of the extraction assembly is exposed to an ion beam having an elongated cross section, which may be as wide as the substrate being processed, wider or narrower. An advantage of this approach is that the exposed portion need only be as narrow as a few centimeters or even millimeters along the direction in which the substrate is scanned. In this manner, a plasma (ion) source may be employed that has dimensions smaller than the substrate being exposed, at least along one direction, which may allow large substrates to be treated without having to employ a plasma source that matches or exceeds the substrate size.
However, in such plasma systems, a process chamber may be significantly larger than the plasma source chamber in order to accommodate substrate scanning. This imposes a burden upon various components of a plasma processing system including process chamber housing components, scanning drives, pumps, and other components. As substrates scale to larger sizes, the concomitant scaling of some or all these components is contemplated. This places a further burden on plasma processing equipment manufacturers, as well as tool users, such as semiconductor manufacturers, solar cell manufacturers, and other device manufacturers that may employ such systems.

Varian Semiconductor Equipment Associates, Inc.


An electrical plug connector includes a housing being formed of insulating material and having at least one contact chamber. A contact element is to be inserted in the at least one contact chamber in a given plugging direction. A locking device for the contact element is movable transversely to the given plugging direction, is formed of insulating material and is constructed as a slide. The locking device is transversely moveable between an initial detent position permitting the contact element to be inserted into the at least one contact chamber, and a final detent position locking the contact element. The housing and the locking device are formed from a thermoplastic synthetic having the same or different properties and are produced by multicomponent injection molding with the housing being injection molded directly on the slide.

FIELD OF THE INVENTION
The present invention relates to an electrical plug connector, including a housing being formed of insulating material and having at least one contact chamber for an insertable contact element, and a locking device for the contact element being formed of insulating material, being constructed as a slide and being movable transversely to a plugging direction, wherein the locking device has a preliminary detent position in which the contact element can be introduced within the contact chamber, and the locking device is movable to a final detent position by transverse motion of the slide for locking of the contact element. Such plug connectors are already on the market.
The locking device of the known plug connector is used as a secondary securing device, while the primary securing device of the contact element that is introduced into the contact chamber is typically formed by detent tongues pointing away from the contact element. As plug connectors become increasingly more compact, the space for secondary securing devices also becomes tighter and tighter, and therefore there is no space left for most of the existing versions. It is predominantly for that reason that secondary securing devices constructed in the form of transverse slides have recently become increasingly important. In the known plug connectors, the housing and the locking device are constructed as separately produced individual parts, so that the slide must be introduced into the housing in its own, complicated assembly operation. In that assembly, which must be carried out by hand, care must be taken to ensure that the slide is introduced into the housing in the correct position and in such a way that it cannot fall out. The production of the individual parts not only requires a complicated assembly but also can impair the quality of the plug connector, because the tolerances add up, which is disadvantageous.

Electrical plug connector with a locking device


A fishing rod according to one embodiment of the invention includes a small-diameter hollow rod body extending in a central axis direction, a large-diameter hollow rod body extending in the central axis direction, and a spigot ferrule inserted in the small-diameter rod body from its rear end and into the large-diameter rod body from its front end to connect the small-diameter rod body and the large-diameter rod body. In the fishing rod, a first inclined surface that extends from an rear end of the small-diameter rod body at an angle of 0.1° to 10.0° with respect to the central axis direction is formed on an inner peripheral surface of the small-diameter rod body.

The present invention relates to a spigot joint fishing rod in which a small-diameter rod body and a large-diameter rod body are jointed with a spigot ferrule. A conventional spigot joint fishing rod is disclosed in, for example, Japanese Patent Application Publication No. 2003-250396.
In the spigot joint fishing rod, the small-diameter rod body and the large-diameter rod body are both formed as hollow tubes and one end of the spigot ferrule is inserted in the small-diameter rod body and the other end of the spigot ferrule is inserted in the large-diameter rod body to joint the small-diameter rod body and the large-diameter rod body. One end of the spigot ferrule is inserted into a bottom end of the small-diameter rod body and the other end is inserted into a tip end of the large-diameter rod body.


A pipe handling catwalk comprising: a deck including an upper surface, a first end, an opposite end and a tubular support surface on the upper surface, the tubular support surface being elongate and extending between the first end and the opposite end; a deck guide including a wall extending up from the deck upper surface and drivable along tubular support surface of the deck; a ramp mounted on the deck adjacent its first end and positionable extending at an angle from the deck; a carrier connected to the ramp to remain on the ramp and being moveable such that an end thereof can be lifted away from the ramp to reduce the inclination of the carrier relative to the angle of the ramp, the carrier including an upper surface and a tubular retaining surface thereon extending along the carrier substantially in line with the tubular support surface of the deck; and a carrier guide including an upstanding tubular engaging surface extending up from the carrier upper surface and drivable along tubular retaining surface of the carrier.

A drilling rig catwalk is a pipe handling machine for conveying tubulars between a drill rig drilling floor and a tubular supply, oftentimes located laterally offset and some distance below the floor. When conveying tubulars to the drill floor it is particularly beneficial to have the tubulars presented at a reasonable distance off the floor that they can be readily handled by personnel on the floor. However, with the floor of many rigs raised well above the store of tubulars, lifting the tubulars to a position readily handled by the rig personnel may create a dangerous situation.


A data out circuit of a DRAM includes a normal operation determining part receiving a RASB (row address strobe bar) and a CASB (column address strobe bar) to determine whether a normal operation or an abnormal operation to be performed, a write/read determining part determining whether a read operation or a write operation to be performed, a first delaying part generating an OEC (out enable control) signal to delay a DOE (data output enable) generation signal, a controlling part outputting an EQSWB (equalizer switch bar) to control the DOE to transit only a first transit of the CASB, and a switching part receiving signals from the first delaying part and the controlling part, and switching the DOE, and a DOE generating part receiving signals from the normal operation recognizing part and the write/read determining part, and the switching part to generate the DOE signal outputting only a valid data.

1. Field of the Invention
The present invention relates to a circuit of a semiconductor device, and more particularly, to a data out circuit of a DRAM. Although the present invention is suitable for a wide scope of applications, it is particularly suitable for improving a data out speed and providing a reliable data out circuit of a DRAM.
2. Discussion of the Related Art
An EDO (Extended Data Out) mode is generally used for an efficient and stable data out even in a short cycle for a high speed access to DRAM devices. The EDO mode employs a concept of a data latch for a faster cycling in a fast page mode, so that the first pipeline latch in the circuit is used to keep data out even when a CASB(Column Address Strobe Bar) is high. Accordingly, the data out circuit keeps outputting the present data until the next data out occurs following the address change, thereby making a stable data out even within a short cycle.
A background art data out circuit of a DRAM will be described with reference to FIG. 1 illustrating a block diagram illustrating a data out circuit of a DRAM according to a background art.
In the background art data out circuit of a DRAM of FIG. 1, a column address transition signal is not transmitted to a DOE(Data Output Enable) signal which controls a data out by opening a data out buffer in read operation. The data circuit includes a normal operation determining part 11, a write/read determining part 12, a delay part 13 and a DOE generating part 14.
The normal operation determining part 11 receives a RASB(Row Address Strobe Bar) and a CASB and determines whether it is a normal operation or an abnormal operation by transmitting the CASB to low and receiving the above column address. The normal operation is to read or write a data for a desired address whereas the abnormal operation is to determine a CBR(CAS before RAS), which is the CASB transits to low before the RASB transits to low.
The write/read determining part 12 receives a WEB(Write Enable Bar) and determines whether it is a read operation when the WEB is low, and it is a read operation when the WEB is high.
The operation of the aforementioned data out circuit of a DRAM will be describe with reference to FIG. 2.
As shown in FIG. 2, there are different pulses of RASB, CASB, address, EQMB (Equalizer Middle Bar), OEC (Out Enable Control), DOE (Data Output Enable),and an output data. If the normal operation determining part 11 determines it is a normal operation, the write/read determining part 12 determines it is a read when the RASB is transited to low in an EDO mode, a row address is received. Upon receiving the row address, a row system circuit is operated. If the CASB is transited to low, a column address is received and the DOE generating part 14 generates a DOE signal. Thus, a data out is ready to be executed according to outputs from the normal operation determining part 11, the write/read determining part 12 and the delay part 13. In other words, a data out is executed after satisfying a tCAA (Column Address Access Time).
When a tCAS (Column Address Setup Time)--a setup time between the column address and CASB--is -5 nS.about.+5 nS, the OEC of the delay part 13 is always high by receiving the high HPH. When the CASB becomes low, a data is outputted immediately since there is no control for the data out buffer. Consequently, an invalid data is outputted through the data out buffer in accordance with the CASB before outputting a valid data at an address designated presently. In other words, the valid data is outputted after the invalid data is outputted during the first cycle.
The background art data out circuits of a DRAM has the following problems.
In the data out circuit of a DRAM according to the background art, since a column address transition signal is not provided to the DOE, there is a delay in speed and an instability in system operation. This problem is caused by an invalid data provided during the first cycle coming from the outputted data when the CASB is transited to low since there is no data out buffer control.
Further, the background art data out circuit of a DRAM attempts to solve the problem caused by DOE not having a column address transition signal. However, the background art data out circuit data causes an invalid signal because a latch part is inoperative as the EQMB is high at the tASC of 7.about.9 nS, so that the tAA speed varies with the tASC. Accordingly, a system operation malfunction and a frequent transition of the DOE occurs in the background art data out circuit of the DRAM, thereby reducing a data out speed.

Semiconductor memory device having improved data output circuit


A communication system is provided for transmitting video, audio, and data content between two or more nodes of a communications network comprised party of twisted pair links. Also provided, is a telecommunication system for transmitting spectrum, comprising transmission bandwidths that carry signals such as, video, audio, data and other services, over twisted pairs of telephone wires. Such system being adapted for dynamic assignment and management of frequency bands of spectrum over twisted pair links.

An issue that often arises in communication systems is maintaining sufficient transmission bandwidth to satisfy quality of service ("QoS") requirements. These challenges are accentuated in instances where unshielded twisted pairs telephone lines ("twisted pair links") are employed in such systems. Moreover, such signals rapidly degrade when transmitted over a twisted pair links of meaningful length. However, given the existence of twisted pair links in many buildings and communication networks and the cost associated with alternative links and/or retrofitting existing twisted pair links with alternative links, it is desirable to transmit such signals over twisted pair links for a variety of applications, including video communication systems. Accordingly, there is a need for a system that provides a means to use twisted pair links for high data bandwidth applications.
Such need is fueled, in part, by the recent explosion in demand for full real time motion video, high resolution images, and defined quality of services that have also ignited heretofore inexperienced demand for broadband spectrums. While existing phone systems nominally pass voice signals between 0.3 and 3.4 kHz, twisted pair links are capable of carrying frequencies well beyond such 3.4 kHz upper limit. In certain twisted pair links, the upper limit can be tens of megahertz, depending on the length and quality of the wire.
Previously and currently known technologies have attempted to quench demands with near broadband services, such as DSL and related technologies, which provide digital data transmission over the wires of a local telephone network. However, DSL employs a "fixed" frequency allocation according to DSL provider specifications. For example, DSL allocates a finite set of frequency bands for uplink and downlink above the 3.4 kHz upper limit. Another problem with DSL is that signals passing over twisted pair links deteriorate rapidly and unevenly across frequency spectrum with increasing length of the twisted pair communication wire.
Other previously and currently known technologies employ fully digital services, such as E1/T1, in an attempt to satisfy the aforementioned demands for bandwidth. However, fully digital services are often cost prohibitive in that they often require additional voltage, wiring, and special equipment at each end of the line and line, and conditioning to prepare for digital only service.
There has not heretofore been employed a cost effective and efficient method and apparatus for dynamically allocating frequency to meet the above and other needs. Moreover, there has not heretofore been employed a technology that provides for high bandwidth transmissions over twisted pair links presently forming the backbone of the local telephone infrastructure in the United States other countries.

This patent is subject to a terminal disclaimer.

System and method for dynamic allocation of spectrum


A tag-along microsensor device comprises a means for transmitting a signal, adhesion means, and sensing means. In a preferred embodiment, a means for transmitting a signal includes a nano-antenna apparatus. Adhesion means may include mechanical, magnetic, or static electric adhesion means. Mechanical adhesion means may include a hook or barb, or a chemical adhesion means such as glue or other sticky chemical adhesive. Sensing means may include sensing of audio signals, accelerometers, gyros, or other sensors.

1. Field of the Invention
The present invention relates to micro-sensors, particularly micro-sensors capable of adhering to a person, animal or vehicle and wireless relaying relevant position or other sensor information. The present invention further relates to a microsensor method of operation. Secondarily, the present invention also relates to antennas and to a system and method to utilize a conducting enclosure as a highly efficient electrically small antenna.
2. Description of the Prior Art
Ultra-wideband (UWB) systems are in great demand for precision tracking, radar, and communications. A commercially successful UWB system must be both small and very low power. Similarly, there is great interest at present in "smart dust," miniature sensors, and other nano-devices that can wirelessly transmit data, positioning signals, or radar signals using very low power signals and utilizing wavelengths that may be much larger than the device itself. Highly efficient, electrically small antennas are a necessity for UWB systems, smart dust, nano-devices, and numerous other commercial and government applications.
Prior art efficient antennas commonly are on the order of a half-wavelength long for a dipole or a quarter-wavelength long for a monopole. For ultra-wideband (UWB) operation in the 3.1–10.6 GHz, a 5.3 cm dipole or a 2.6 cm monopole are called for (5.7 GHz center frequency). These antennas may be small enough for some applications. For other applications, even smaller antennas may be required. Efficient quarter to half wave antennas that operate in the upper VHF band or UHF band (for instance from 100 MHz on up) must be significantly larger than analogous microwave antennas. This is too large for many potential applications. In general however, no matter the application, there is always a need to make antennas smaller and less obtrusive while remaining efficient. Existing small VHF/UHF UWB antennas tend to be very inefficient including large current radiators, and resistively loaded antennas. Antennas smaller than a quarter-wavelength are usually referred to as electrically small antennas. In prior art, electrically small antennas are prone to be inefficient, particularly when significantly smaller than a quarter-wavelength.
In view of the foregoing, there is a great need for an efficient, electrically small UWB antenna for positioning, smart dust, nano-devices, and other applications. There is a further need for a method to effect efficient UWB transmissions from electrically small enclosures. Additionally, there is a need for an antenna apparatus that transcends traditionally accepted bounds of antenna size versus performance. There is a further need for a microsensor capable of adhering to a person, animal, or vehicle, and wirelessly relaying telemetry, sensor, position, and other data. These needs and more are met by the present invention.


A stent comprises a first section and a second section and at least one securement member. The at least one securement member is disposed about at least one region of the first section and at least one region of the second section. The at least one securement member has a crimped diameter that is less than its uncrimped diameter. When the at least one securement member is in the crimped diameter at least a portion of an inner surface of the at least one securement member is fixedly engaged to the at least one region of the first section and the at least one region of the second section. In the crimped diameter the at least one region of the first section and the at least one region of the second section are immediately adjacent one another.

Stents, grafts, stent-grafts, vena cava filters and similar implantable medical devices, collectively referred to hereinafter as stents, are radially expandable endoprostheses which are typically intravascular implants capable of being implanted transluminally and enlarged radially after being introduced percutaneously. Stents may be implanted in a variety of body lumens or vessels such as within the vascular system, urinary tracts, bile ducts, etc. Stents may be used to reinforce body vessels and to prevent restenosis following angioplasty in the vascular system. They may be self-expanding, mechanically expandable or hybrid expandable.
Stents are generally tubular devices for insertion into body lumens. However, it should be noted that stents may be provided in a wide variety of sizes and shapes. Balloon expandable stents require mounting over a balloon, positioning, and inflation of the balloon to expand the stent radially outward. Self-expanding stents expand into place when unconstrained, without requiring assistance from a balloon. A self-expanding stent is biased so as to expand upon release from the delivery catheter. Some stents may be characterized as hybrid stents which have some characteristics of both self-expandable and balloon expandable stents.
Stents may be constructed from a variety of materials such as stainless steel, Elgiloy, nickel, titanium, nitinol, shape memory polymers, etc. Stents may also be formed in a variety of manners as well. For example a stent may be formed by etching or cutting the stent pattern from a tube or section of stent material; a sheet of stent material may be cut or etched according to a desired stent pattern whereupon the sheet may be rolled or otherwise formed into the desired substantially tubular, bifurcated or other shape of the stent; one or more wires or ribbons of stent material may be woven, braided or otherwise formed into a desired shape and pattern. In some stents, one or more portions of the stent are welded together.
Some examples of stents or stent components that may be braided are described in U.S. Pat. No. 5,061,275, U.S. Pat. No. 4,655,771, U.S. Pat. No. 6,146,403, U.S. Pat. No. 5,836,966, U.S. Pat. No. 6,423,084, U.S. Pat. No. 6,139,573 as well as in U.S. application Ser. No. 10/063,315 to Eder et al., filed Apr. 10, 2002.
Typically, a stent is implanted in a blood vessel or other body lumen at the site of a stenosis or aneurysm by so-called "minimally invasive techniques" in which the stent is compressed radially inwards and is delivered by a catheter to the site where it is required through the patient's skin or by a "cut down" technique in which the blood vessel concerned is exposed by minor surgical means. When the stent is positioned at the correct location, the catheter is withdrawn and the stent is caused or allowed to expand to a predetermined diameter in the vessel.
Currently many stents, such as the prior art stent 100 shown in PRIOR ART FIG. 1, have one or more portions 102 and 104 that are secured together by a weld 106 at one or more points or seams where the portions are immediately adjacent one another. While stents having such welds 106 typically meet or exceed the performance requirements of clinical use, many perceive the welds 106 of such stents to be weak as the welds sometimes yield when subjected to handling. It is thus desirable to provide a mechanism for securing stent elements together which provides a stent with improved peel strength, improved shear or tensile strength, and/or improved radial strength at and/or around a securement site.
All US patents and applications and all other published documents mentioned anywhere in this application are incorporated herein by reference in their entirety.
Without limiting the scope of the invention a brief summary of some of the claimed embodiments of the invention is set forth below. Additional details of the summarized embodiments of the invention and/or additional embodiments of the invention may be found in the Detailed Description of the Invention below.
A brief abstract of the technical disclosure in the specification is provided as well only for the purposes of complying with 37 C.F.R. 1.72. The abstract is not intended to be used for interpreting the scope of the claims.