An object of the present invention is to provide a recombinant LPA phosphatase capable of specifically hydrolyzing LPA, which is useful for elucidation of the metabolism pathway of LPA, and also for diagnosis and treatment of various diseases with which LPA is associated; a method capable of simply and inexpensively determining LPA associated with various diseases; and a kit for determination suitable for the method. The present invention has succeeded in purifying the LPA phosphatase using bovine brain as raw material, and further in cloning human LPA phosphatase gene. The present invention is accomplished by a DNA encoding a peptide comprising the amino acid sequence of SEQ ID NO:1; a DNA comprising the nucleotide sequence of SEQ ID NO:2; a protein encoded by the DNA; an expression vector carrying the DNA; a transformant harboring the expression vector; a method for producing a recombinant lysophosphatidic acid phosphatase by the transformant; a method for determination of LPA by the protein; a determination reagent for LPA by the protein; a kit for diagnosis, comprising the reagent for determination, and the like.

Lysophosphatidic acid (LPA) is a naturally-occurring phospholipid having the simplest chemical structure, and it has been known to exhibit a growth factor-like activity against the fibroblasts [Moolenaar, W. H. et al., (1992) Rev. Physiol. Biochem. Pharmacol. 119, 47–65; Moolenaar, W. H., (1995) J. Biol. Chem. 270, 12949–12952; Moolenaar, W. H. et al., (1997) Curr. Opinion Cell Biol. 9, 168–173]. The LPA is rapidly produced and released as a product of the coagulation process of blood from the activated platelets. Therefore, it is suggested that the LPA has a kind of a role in healing of a wound and regeneration. Also, there is clarified that the LPA induces rapid retraction of the axon and transient formation of spheres of cell bodies in neurocytes. These biological activities are thought to be caused by LPA receptor conjugated with G protein [Moolenaar, W. H. et al., (1997) Curr. Opinion Cell Biol. 9, 168–173], and a cDNA encoding two deduced LPA receptors has been isolated [Hecht, J. H. et al. (1996) J. Cell Biol. 135, 1071–1083; Guo, Z. et al. (1996) Proc. Natl. Acad. Sci. USA 93: 14367–14372].
In addition, the LPA possesses various biological activities such as promotion of cancer cell invasion, cell adhesion, suppression of apoptosis, and chemotaxis. Moreover, there has been reported that its amount present in sera is high in ovarian cancer and other gynecologic malignancies [Xu, Y. et al. (1998) JAMA 280, 719–723], and it is expected to also serve as a marker for early detection of cancers.
Regarding the production of the LPA, there has been known that the LPA is synthesized by generation from monoacylglycerol by monoacylglycerol kinase, generation from phosphatidic acid by phospholipase A1 (PLA1) or phospholipase A2 (PLA2), and the like. However, since the LPAs produced in response to various stimuli take place at a slightly delayed stage as compared to the generation of phosphatidic acid (PA) [Gait, F. et al. (1997) FEBS Lett. 410, 54–58], it is thought that those ascribed to the latter pathway are dominant.
However, the LPA in the biosynthesis system is immediately converted to phosphatidic acid, so that it is thought that most of the cases where the LPA acts as a bioactive substance is not made from the synthesis system but as a product of a phospholipid degradation system. Regarding the hydrolytic pathways of the LPA, there are possibly three pathways, namely pathways with LPA phospholipase A, LPA phosphatase and LPA acyltransferase [Gait, F. et al., (1997) FEBS Lett. 410, 54–58; Eberhardt, C. et al., (1997) J. Biol. Chem. 272, 20299–20305]. Since the LPA is a bioactive lipid, it is thought that the exclusion of the LPA by the above enzyme plays an extremely important role in termination of the signal.
Regarding LPA phospholipase A, one purified from rat brain has been known, which is a membrane bound enzyme of a size of 80 kDa, and hydrolyzes LPA but does not hydrolyze other lysophospholipids [Thompson, F. J. and Clark M. A., (1994) Biochem. J. 300, 457–461].
Regarding the LPA phosphatase, there has been reported the presence of ecto-(lyso)phosphatidic acid phosphatase that also hydrolyzes PA in PAM212 mouse keratinocytes [Xie, M. and Low, M. G., (1994) Archives Biochemistry Biophysics 312, 254–259]. Until recently, a membrane bound PA phosphatase which is relatively PA-specific but also exhibits a weak activity for LPA has been purified from porcine thymus [Kanoh, H. et al., (1992) J. Biol. Chen. 267, 25309–25314; Kai, M. et al., (1996) J. Biol. Chem. 271, 18931–18938]. In addition, a membrane bound PA phosphatase, which also hydrolyzes LPA, ceramide 1-phosphate and sphingosine 1-phosphate, is purified from rat liver [Waggoner, D. W. et al., (1995) J. Biol. Chem. 270, 19422–19429; Waggoner, D. W. et al., (1996) J. Biol. Chem. 271, 16506–16509]. However, there has not yet been known LPA-specific phosphatase at present.
Further, regarding the method for determination of LPA, there has been known a method comprising extracting lipid components from a sample, separating LPA from other lipid components by thin layer chromatography, and thereafter determining the resulting LPA by gas chromatography as a methyl ester of a fatty acid via transmethylation reaction [Xu, Y. et al. (1998) JAMA 280, 719–723]. However, this method requires complicated procedures, so that it has a defect that a length of time period is required for assay of a large number of samples.

Recombinant lysophosphatidic acid phosphatase


A selective copper deposition method, comprising the steps of: forming barrier metal patterns on a wafer; and depositing copper only on the barrier metal patterns by electrochemistry, by which high pure copper film patterns can be formed simultaneously with deposition of copper, with ease.

1. Field of the invention
The present invention relates, in general, to a selective copper deposition method and, more particularly, to use of electrochemistry for copper deposition.
2. Description of the Prior Art
Most of metal wirings used in VLSI devices are made of tungsten, superior in electromigration (hereinafter referred to as "EM"), or aluminum, relatively low in electrical resistance. However, the two types of metal wirings cannot satisfy the EM and electrical resistance required for 1 giga or more DRAM. Recently, active research has been directed to copper, a promising metal.
To date, the use of wirings of copper includes a significant problem. In detail, there are not yet established standards for precursors to be used upon deposition and the deposition methods thereof, membrane quality and forming methods of pattern.
In copper-depositing methods suggested up to date, the most representative is metal-organic chemical vapor deposition (hereinafter referred to as "MOCVD"), in which organo-metals, represented by AcAc (acetylacetone R.dbd.R'.dbd.CH.sub.3), hf.sub.ac (1,1,1,5,5,5-hexafluoroacetylacetone R.dbd.R'.dbd.CF.sub.3) and tf.sub.ac (trifluoroacetylacetone R.dbd.CF.sub.3) are utilized as precursors. However, when blanket deposition is effected by MOCVD, problems for membrane quality and subsequent pattern formation also remain unsolved.
For pattern formation, the damascene process, developed by IBM corporation, U.S.A., is one of the solutions, which will be illustrated in conjunction with FIGS. 1A to 1D in order to better understand the background of the invention.
FIG. 1A shows a wafer 1 of which the surface is deposited with, an intermetallic dielectric (hereinafter referred to as "MD") 2, an insulating film.
On the IMD is formed photosensitive film patterns 3 which serve as a mask in subsequent photolithographic process, as shown in FIG. 1B. As a result of this etching, the insulating film is selectively removed so as to form spaced-apart patterns.
Following removal of the photosensitive film patterns 3, a blanket of copper 4 is formed over the resulting wafer by use of CVD, as shown in FIG. 1C.
Then, a chemical mechanical polishing (hereinafter referred to as "CMP") process is effected on the copper blanket, to form a wiring structure in which insulating films and copper films 4' alternate.
As for technique for the copper blanket, when copper precursors are let to enter a chamber, thermal energy is utilized to cleave copper from the precursors which is, then, deposited over the wafer 1 present in the chamber.
In as much as the copper film obtained by such MOCVD is based on the separation of copper from its precursors using thermal energy, carbon bonds in the precursors inevitably break owing to which contamination of copper occurs. Therefore, it is impossible to obtain 1.7 .mu..OMEGA.cm, the resistance of pure copper.
After depositing copper, when the copper blanket thus obtained is subjected to etch to form predetermined patterns, the copper is reacted with a base etchant, e.g. BCl.sub.3 or Cl.sub.2, to give CuCl.sub.2, a product. Since CuCl.sub.2 sublimes at 200.degree. C. or higher, the temperature of wafer must be elevated up to at least 200.degree. C. in order to obtain desired copper patterns.
In particular, this technique is difficult to apply for highly integrated devices very dense but relatively poor in topology, such as VLSI. Copper deposition has appeared as a hot issue in manufacture of semiconductor devices.


The invention relates to a fuel electrode for high-temperature solid electrolyte fuel cells and a process for manufacture of the electrode. The fuel electrode of the invention is a porous element composed of a high-melting metal, such as ruthenium, osmium, rhodium or iridium, or an alloy containing the metal. The process for manufacture of the fuel electrode comprises coating an electrode material with a solution or dispersion of the high-melting metal and/or its chloride, sintering the same and finally reducing the product.

The present invention relates to a fuel electrode for high-temperature solid electrolyte fuel cells and a method for manufacture of the electrode.
Heretofore, nickel/zirconia (Ni/ZrO.sub.2) cermets have been employed for fuel electrodes in commercialized high-temperature solid electrolyte fuel cells.
These Ni/ZrO.sub.2 cermets are typically produced by the following alternative processes: (1) A process in which NiO/ZrO.sub.2 is sintered and then reduced to provide a Ni/ZrO.sub.2 cermet (e.g. the Ceramatec process described in Proceedings of SOFC-NAGOYA, p. 24); (2) A process, known as the Westinghouse process, in which ZrO.sub.2 in a crude Ni/ZrO.sub.2 cermet is caused to grow into spaces between Ni grains by the EVD technique (Japanese Kokai Patent Publication No. 61-153280).
Aside from the above, porous platinum (Pt) materials obtainable by sintering platinum pastes have been used in ZrO.sub.2 sensors and the like or in basic research.
However, the Ni/ZrO.sub.2 cermet electrode manufactured by the first-mentioned process is disadvantageous in that when the fuel cell is run over thousands of hours at temperatures near 1,000.degree. C., the Ni grains therein are sintered to degrade the electrode and ultimately cause exfoliation of the electrode. Increasing the proportion of ZrO.sub.2 for avoiding this sintering detracts from the performance of the electrode.
The Ni/ZrO.sub.2 cermet manufactured by the second-mentioned process is resistant to sintering and insures a satisfactory electrode performance but since it involves an EVD step, the overall manufacturing process is complicated and the cost of manufacture is increased.
The porous platinum electrode is disadvantageous in that the platinum reacts with impure metal in the fuel and is vaporized in a continuous operation in a reducing atmosphere to cause early aging of the electrode. Furthermore, platinum is an expensive metal and the manufacture of porous platinum electrodes is costly.

Fuel electrode for solid electrolyte fuel cells and a method for manufacture of the electrode


Disclosed herein is a reconfigurable smoking pipe and a method of using the same for single handed operation. The reconfigurable smoking pipe comprises a base unit, a lighter holder, a bowl, a smoke chamber, a carburetor, a mouthpiece, and a plug. The base unit comprises multiple ports. The lighter holder is attached to the base unit. Each of the bowl, the smoke chamber, the carburetor, and the plug are detachably attached to any one of the ports of the base unit. A mouthpiece is detachably attached to anterior end of the smoke chamber. A user assembles the reconfigurable smoking pipe and inserts a lighter into the lighter holder. The user holds the reconfigurable smoking pipe in a smoking position using a single hand by gripping the inserted lighter and lights a smoking substance held in the bowl by operating the gripped lighter using the single hand.

This invention relates to the field of smoking implements. More specifically, this invention relates to a reconfigurable smoking pipe.
Smoking implements such as smoking pipes are widely used by smokers to smoke tobacco. Smoking pipes typically require an external lighter or matches to be used for lighting the tobacco. A user usually must hold a smoking pipe in one hand and a lighter or a match in the other hand while lighting. Moreover, tools such as a pipe cleaner or a reamer must be used to clean the smoking pipe. Smoking pipes are generally built as a single unit and dismantling the smoking pipes requires expert knowledge.
Hence, there is a need for a smoking pipe that requires only a single hand for gripping and lighting. There is also a need for a smoking pipe that may be easily dismantled for cleaning and for reconfigurable positioning.


An actuator device for adjusting an adjusting element may include a housing, an actuator for driving the adjusting element, and a drive circuit for operating the actuator. The housing may include a support body that may include a drive receiving space and a gear receiving space. The drive circuit may include a plurality of electrically conductive conductor bodies for contacting a plurality of drive contacts of the actuator, for contacting a plurality of components of the drive circuit, and for contacting a supply device. At least one conductor body of the plurality of conductor bodies may be structured as a contact tongue, arranged on the drive circuit, and abut on an electrically conductive actuator housing in a pretensioned manner establishing an electrical contact between the drive circuit and the actuator housing. The actuator housing may be configured as at least one of a zero-ground potential and a reference potential.

Actuator devices of the above-mentioned type serve the purpose of adjusting an adjusting element. The adjusting element is, for example, a valve, a wastegate valve, a variable turbine or compressor geometry, exhaust flaps, acoustic flaps or also windshield wipers. For this purpose, actuator devices usually have a housing, in which an actuator, usually an electrical motor, and an adjusting gear connected thereto are arranged. During operation of the actuator devices, a drive torque provided by the actuator can be transferred to the adjusting element via the adjusting gear. A drive circuit is usually provided to control the actuator. Said drive circuit comprises an interference suppression branch for reducing electromagnetic interferences caused by the actuator, and a sensor branch for detecting and monitoring drive parameters.
An actuator device of this type is known from DE 10 2009 053 830 A1, wherein an adjusting device for operating an adjusting element comprising an actuator and comprising a housing made of plastic for receiving the actuator as well as a power electronics for operating the actuator are described.
An adjusting device for adjusting an adjusting element, in particular for a motor vehicle, is known from DE 10 2015 215 732 A1.
An adjusting device for adjusting a flap in an internal combustion engine comprising a housing is described in EP 1 865 173 B1. A gear unit and a drive motor are arranged in the housing. For electrically connecting the drive motor and other electrical and electronic components, the adjusting device has a stamped grid, which has sections of conductor tracks, which are partially extrusion-coated with plastic in the cover.
An actuator comprising a metal housing, an electric motor, an adjusting element, a transfer mechanism adapting the movement of the electric motor to the adjusting element, and an electronic circuit for controlling the electric motor is known from WO 2014/090953 A2. A stamped grid, which has conductor tracks, which serve to contact a sensor and to contact the electric motor, is arranged in the actuator.
Electrical and/or electromagnetic interferences originating from the used actuator, e.g. an electric motor, usually occur during the operation of actuator device. Interferences of this type influence electrical components, which are arranged in the actuator device. Voltage signals, for example, are distorted or are superimposed with measurement noise, which may necessitate a relatively complex signal processing. This can also affect to surrounding/adjacent components/assembly groups, as well as interference-sensitive receiving devices, such as TV receivers, radios or mobile telephones. To reduce the described interferences, it is common to use so-called interference suppression circuits. In the case of the actuator device, so-called electromagnetic compatibility circuits are used in practice, which are also known as EMC circuit. An interference suppression of the drive circuit or of the actuator, respectively, is attained in any case by means of the EMC circuit.
For the desired interference suppression, however, interference suppression circuits require a voltage potential, which is referred to as zero-ground potential or reference potential and which is usually simply described in practice as ground contact or grounding.
In the case of circuits of this type, zero-ground potentials of this type are usually realized in that an additional ground conductor, for example a ground cable or a ground conductor track, is arranged inside the drive circuit. The ground conductor is routinely guided via a system connector plug to the outside, where a connection to a zero-ground potential can be established. The additional conductor body, however, necessitates an increase of the circuit complexity, even though fewer complex circuits would be desirable, for example from the aspect of the cost and development scale for the production of an actuator device of this type.

Actuator device for adjusting an adjusting element, drive circuit for an actuator, manufacturing method for producing a drive circuit


The invention includes a pretensioned mesh insert and method for providing a pretensioned mesh insert for a traveling water screen basket. First and second mated screen panels are secured together to place one of the screen panels under tension and the other of the screen panels under compression so that it bows outwardly from the screen under tension. The structure of the invention operates to reduce the fatigue experienced by the screen panels.

The invention relates to a traveling water screen basket. More particularly, the invention relates to a pretensioned mesh insert for a traveling water screen basket and a method for producing the pretensioned mesh insert.
Power plants, foundries, and other types of factories are often located near a body of water in order to satisfy their critical need for water, which is typically used as a coolant. However, water taken from a natural source must be filtered to prevent naturally occurring debris and aquatic life from being taken in with the water. The filtering process is designed both to preserve the existing aquatic life and to remove from the water anything that might damage the equipment in the plant or factory.
Typically, traveling water screen through-flow filtration units are used to accomplish the desired filtering. The units are placed in the water reservoir in front of the plant intake ports and include a series of "baskets" mounted on an endless carrier chain assembly. The baskets each include an assembly of screens through which water from the reservoir passes on its way to the intake parts. The screens operate to filter the water and are attached to a frame called a basket. The basket includes a lip used to collect debris from the water. The carrier chain is driven by an electric motor causing the baskets on the upstream or ascending side of the unit to travel upward. As the baskets exit the water, they pass through a splash housing where they are cleaned. The baskets then follow the carrier chain to the downstream or descending side of the unit to repeat the cycle in endless loop fashion.
As already mentioned, each basket includes a screen assembly mounted thereon to accomplish the filtering task. The screens known in the prior art are simply bolted to the baskets themselves or to some type of supporting frame which is then attached to the basket. When a selected screen is on the upstream side of the unit, water flowing through the upstream or filter side of the screen creates a first force on the screen from a first direction. This force causes the screen to deflect a given distance in the first direction from its resting non-tensioned position placing the screen in tension and placing stress on the screen at its point of contact with the frame or basket. The carrier chain assembly then moves the water screen baskets out of the water through the splash housing to the descending side of the unit. When this occurs, the pressure is relieved allowing the mesh to flex back to a resting state. When the screen is again submerged on the descending side, water flows through the screen in a relative direction opposite to the flow through the screen when the screen is on the ascending side. The reversed orientation of the screen causes the flowing water to place a force on the screen in a direction opposite to that existing on the ascending side of the unit. This reversal of the force vector causes the screen to move from the point of deflection experienced on the ascending side of the unit through the resting non-tensioned position to the point of deflection in the opposite direction where the screen is again forced into tension and again placing stress on the screen at the point of contact with the frame. The constant series of transitions from deflection in one direction to deflection in the opposite direction and vice versa causes the material comprising the screens to fatigue quickly at the point of contact between the frame and the screen. This causes the screen to fracture and bend away from the frame resulting in the introduction of debris into the cooling water used in the plant or factory. The degree of fatiguing is at least in part related to the degree of travel from deflection in one direction to deflection in the other direction.
A need exists for a screen for a traveling water basket that substantially eliminates the degree of travel during deflection resulting from the force of water in either direction as the screen passes through a cycle of the carrier chain assembly to prevent premature fracture.

Pretensioned mesh insert and method for producing a pretensioned mesh insert


A method for detecting a target nucleic acid sequence in a sample in the presence of at least protein capable of binding to single-stranded DNA is provided, comprising contacting said sample with at least one oligonucleotide probe comprising a fluorophore, a quencher and a region complementary to said target nucleic acid sequence. The sequence of the oligonucleotide probe comprises at least 20% RNA nucleotides, modified RNA nucleotides and/or PNA nucleotides.

Detection of target nucleic acid sequences has been performed using DNA probes comprising fluorophore/quencher pairs. Such probes exhibit a change in quenching activity on binding to a target nucleic acid, allowing for quantitative detection of target. Probes can be used to monitor DNA amplification in real time, and different targets may be detected in the same reaction through use of different fluorophore/quencher pairs on each probe for the targets to be detected, thus allowing multiplexing. Examples of previous probe systems for detection of DNA amplification include hybridisation probes showing conformational changes on target binding (U.S. Pat. No. 7,241,596), molecular beacons (U.S. Pat. No. 5,925,517), Taqman chemistry (U.S. Pat. No. 6,214,979), and endonuclease-cleavable probes (U.S. Pat. No. 7,435,561 and US20050214809). An isothermal DNA amplification process relying on an upstream primer, a downstream primer, and a strand invasion system is described in WO 2009/150467.

Detection of nucleic acids by strand invasion based amplification


A variable resistor is provided with a series resistor network including first, second and third resistor parts which are connected in series, where the second resistor part is connected to the first and third resistor parts via first and second nodes, respectively, and a fourth resistor part, coupled in parallel to the second resistor part via the first and second nodes. The fourth resistor part includes a plurality of resistors which are connected in series via a plurality of third nodes. The first resistor part has a terminal opposite the first node for receiving an input signal, and an output signal of the variable resistor is obtained via an arbitrary one of the third nodes of the fourth resistor part.

The present invention generally relates to variable resistors, and more particularly to a variable resistor which attenuates an input voltage by an arbitrary amount.
In various electronic circuits, the signal voltage is often attenuated to a desired value. An example of such a process is an attenuation of a signal having a voltage of A V by X dB. In such a process, the accuracy of the amount of the attenuation greatly affects the circuit operation, and an extremely accurate control of the attenuation is required.
FIG. 1 shows a first example of a conventional variable resistor. In FIG. 1, a plurality of resistors (nine in this case) 10 through 18 are connected in series, and a plurality of switches (fourteen in this case) 20 through 33 are coupled between nodes connecting the adjacent resistors and a non-inverting input terminal (+) of an operational amplifier 19 in a tournament connection. The switches 20 through 33 are divided into a switch group A which is made up of the switches 20 through 27, a switch group B which is made up of the switches 28 through 31, and a switch group C which is made up of the switches 32 and 33. The switch groups A, B and C are respectively controlled by control signals S.sub.A, S.sub.B and S.sub.C. Within each switch group, every other switches are turned ON/OFF while the remaining switches are turned OFF/ON, in response to the control signal supplied thereto. For example, the switch 21 is OFF when the switch 20 is ON, the switch 29 is OFF when the switch 28 is ON, and the switch 33 is OFF when the switch 32 is ON.
If the switches 20, 28 and 32 are ON, for example, a divided voltage V.sub.10-11 which is obtained by a series resistor network made up of the resistors 10 through 18 is applied to the operational amplifier through these switches 20, 28 and 32. The divided voltage V.sub.10-11 appears at the node which connects the resistors 10 and 11, and may be described by the following formula (1), where .SIGMA.R.sub.10,,18 denotes a series resistance formed by all of the resistors 10 through 18, .SIGMA.R.sub.11,,18 denotes a series resistance formed by the resistors 11 through 18, and V.sub.IN denotes an input voltage. EQU V.sub.10-11 =(.SIGMA.R.sub.11,,18 /.SIGMA.R.sub.10,,18)V.sub.IN---( 1)
On the other hand, if the switches 27, 31 and 33 are ON, a divided voltage V.sub.17-18 which is obtained by a series resistor network made up of the resistors 10 through 18 is applied to the operational amplifier through these switches 27, 31 and 33. The divided voltage V.sub.17-18 appears at the node which connects the resistors 17 and 18, and may be described by the following formula (2). EQU V.sub.17-18 =(R.sub.18 /.SIGMA.R.sub.10,,18)V.sub.IN ---( 2)
When it is assumed for the sake of convenience that all of the resistors 10 through 18 have the same resistance R, the formulas (1) and (2) can be rewritten as the following formulas (1a) and (2a). ##EQU1##
Other divided voltages V.sub.114 12 through V.sub.16-17 between the divided voltages V.sub.10-11 and V.sub.17-18 can be obtained in a similar manner, and the following relationship can be obtained. EQU V.sub.11-12 =(7/9)V.sub.IN .apprxeq.0.77V.sub.IN EQU V.sub.12-13 =(6/9)V.sub.IN .apprxeq.0.66V.sub.IN EQU V.sub.13-14 =(5/9)V.sub.IN .apprxeq.0.55V.sub.IN EQU V.sub.14-15 =(4/9)V.sub.IN .apprxeq.0.44V.sub.IN EQU V.sub.15-16 =(3/9)V.sub.IN .apprxeq.0.33V.sub.IN EQU V.sub.16-17 =(2/9)V.sub.IN .apprxeq.0.22V.sub.IN
Accordingly, the variable resistor shown in FIG. 1 can vary the attenuation from 0.11 times to 0.88 times depending on the combination of the control signals S.sub.A, S.sub.B and S.sub.C, and an output voltage V.sub.OUT of the operational amplifier 19 can be varied in steps.
However, according to the first example of the conventional variable resistor, the voltage varying width is determined by the voltage dividing width of the series resistor network. For this reason, if an attempt is made to improve the resolution by making the voltage varying width small, the number of required resistors and switches becomes extremely large, and there is a problem in that the circuit scale becomes extremely large.
FIG. 2 shows a second example of a conventional variable resistor. In FIG. 2, a first series resistor group 44 is made up of a plurality of resistors (four in this case) 40 through 43 and functions as an input resistance Rs of an operational amplifier 45. Similarly, a second series resistor group 50 is made up of a plurality of resistors (four in this case) 46 through 49 and functions as a feedback resistance Rf of the operational amplifier 45. The operational amplifier 45 operates as an inverting amplifier and an amplification A.sub.NF thereof is determined by a ratio of the resistances Rs and Rf, that is, A.sub.NF =-Rf/Rs. Switches 51 through 56 are provided with respect to the first and second series resistor groups 44 and 50. Control signals S.sub.s1 through S.sub.s3 and S.sub.fl through S.sub.f3 are supplied to these switches 51 through 56, and all of the switches 51 through 56 are turned OFF or only one switch with respect to each of the first and second series resistor groups 44 and 50 is selectively turned ON in response to the control signals S.sub.s1 through S.sub.s3 and S.sub.f1.
When all of the switches 51 through 56 are OFF, the input resistance Rs has a maximum resistance .SIGMA.R.sub.40,,43 of the first series resistor group 44 and the feedback resistance Rf has a maximum resistance .SIGMA.R.sub.46,,49 of the second series resistor group 50.
If it is assumed for the sake of convenience that all of the resistors 40 through 43 and 46 through 49 have the same resistance R, the maximum resistances .SIGMA.R.sub.40,,43 and .SIGMA.R.sub.46,,49 can both be described by 4R. Hence, the amplification A.sub.NF is -4R/4R=-1. On the other hand, if only the switch 53 provided with respect to the first series resistor group is turned ON, the amplification A.sub.NF is -4R/R=-4.
Accordingly, by appropriately setting the resistances R.sub.40 through R.sub.43 and R.sub.46 through R.sub.49 of the resistors 40 through 43 and 46 through 49, it is possible to switch the amplification A.sub.NF of the operational amplifier 45 in multi-steps depending on the control signals S.sub.s1 through S.sub.s3 and S.sub.f1 through S.sub.f3. In other words, the output voltage V.sub.OUT of the operational amplifier 45 can be varied in steps.
However, according to the second example of the variable resistor, metal oxide semiconductor (MOS) transistors are used for the switches 51 through 56 which are provided with respect to the first and second series resistor groups 44 and 50 in order to obtain a sufficiently high switching speed. As a result, the ONON-resistances of the MOS transistors affect the input resistance Rs and the feedback resistance Rf, and there is a problem in that the amplification A.sub.NF of the operational amplifier 45 becomes inaccurate.
FIG. 3 shows a third example of the conventional variable resistor. In FIG. 3, a first voltage dividing circuit 60 is made up of a plurality of resistors 61 through 65 and switches 66 through 71. This first voltage dividing circuit 60 is used to obtain a volta V.sub.60 by dividing the input voltage V.sub.IN by an ON/OFF combination of the switches 66 through 71. For example, if the switches 66 and 70 are ON and the other switches are OFF, the voltage V.sub.60 becomes a maximum. On the other hand, the voltage V.sub.60 becomes a minimum if the switches 69 and 71 are ON and the other switches are OFF.
A second voltage dividing circuit 80 is made up of a plurality of resistors 81 through 85 and switches 86 through 91. This second voltage dividing circuit 80 varies the ratio of the input resistance Rs and the feedback resistance Rf of an operational amplifier 92 so as to vary the amplification A.sub.NF. For example, if the switches 86 and 90 are ON and the other switches are OFF, the input resistance Rs becomes the series resistance of the resistors 82 through 85, the feedback resistance Rf becomes the resistance of the resistor 81, and the amplification A.sub.NF becomes a minimum because the ratio Rf/Rs becomes a minimum. On the other hand, if the switches 89 and 91 are ON and the other switches are OFF, the input resistance Rs becomes the resistance of the resistor 85, the feedback resistance Rf becomes the series resistance of the resistors 81 through 84, and the amplification A.sub.NF becomes a maximum because the ratio Rf/Rs becomes a maximum.
According to this third example of the variable resistor, the input voltage V.sub.IN can be varied in four steps by the first voltage dividing circuit 60, and the amplification A.sub.NF of the operational amplifier 92 can be varied in four steps by the second voltage dividing circuit 80. For this reason, it is possible to obtain the output voltage V.sub.OUT by adjusting the input voltage V.sub.IN in sixteen (=4.times.4) steps by appropriately switching the ON/OFF combination of the switches provided with respect to the first and second voltage dividing circuits 60 and 80. Compared to the first example of the variable resistor, it is possible to make the circuit scale smaller.
In addition, the current flowing to the second voltage dividing circuit 80 mainly flows through the resistors 81 through 85 and only an extremely small current flows through the switches 86 through 91. Hence, even if MOS transistors are used for the switches 86 through 91, it is possible to suppress the voltage drop generated by the ON-resistances of the MOS transistors. Accordingly, it is possible to accurately adjust the amplification A.sub.NF of the operational amplifier 92, and the problems of the second example of the variable resistor can be suppressed.
However, according to the third example of the variable resistor, the voltage V.sub.60 obtained from the first voltage dividing circuit 60 is variably amplified in the operational amplifier 92 with the amplification A.sub.NF which is set by the second voltage dividing circuit 80. As a result, an offset voltage of the operational amplifier 92 which is added to the voltage V.sub.60 is also subjected to the variable amplification, and there is a problem in that the offset voltage varies depending on a code which is set to control the ON/OFF states of the switches which are provided with respect to the first and second voltage dividing circuits 60 and 80. The code sets the ratio V.sub.IN /V.sub.OUT.
A more detailed description will be given of the offset voltage. Generally, the operational amplifier which is used as a comparator is made up of a differential amplifier circuit formed by a transistor pair having the same characteristic. However, because it is extremely difficult to make a transistor pair having perfectly identical characteristics, an offset voltage is inevitably generated by the difference in the characteristics of the transistor pair. The offset voltage is the voltage which appears at the output when the input of the operational amplifier is zero, and is normally described by a value V.sub.OS which is converted to the input. In other words, it is regarded that a voltage corresponding to the value V.sub.OS is input to the input terminal of the operational amplifier. Therefore, since the regular input voltage in (V.sub.60 in FIG. 3) is inevitably amplified by this value V.sub.OS, there is a problem in that the accuracy of the variable resistor which attenuates the input voltage V.sub.IN to an arbitrary output voltage V.sub.OUT cannot be improved.


The invention relates to a method for forming a telescoped multiwall nanotube. Such a telescoped multiwall nanotube may find use as a linear or rotational bearing in microelectromechanical systems or may find use as a constant force nanospring. In the method of the invention, a multiwall nanotube is affixed to a solid, conducting substrate at one end. The tip of the free end of the multiwall nanotube is then removed, revealing the intact end of the inner wall. A nanomanipulator is then attached to the intact end, and the intact, core segments of the multiwall nanotube are partially extracted, thereby telescoping out a segment of nanotube.

There is currently substantial interest in reducing the size scale of various mechanical systems, and dramatic recent advances have been achieved in the fabrication of microelectromechanical systems. A review of current trends in micromelectromechanical systems can be found in W. Trimmer, (1997) Micromechanics and MEMS: Classic and Seminal Papers to 1990, IEEE Press, New York. Ultimately, such systems are expected to reach well into the nanometer domain, and hence considerations of the mechanical behavior of materials at the nano- or atomic-scale, including those related to atomic perfection and friction, become critically important.
Carbon nanotubes, as discussed in Iijima (1991) Nature 354:56-58, have unique mechanical and electronic properties that make them outstanding candidates for nanomechanical or nanoelectromechanical applications, such as nanoscale electronics, see Collins et al. (1997) Science 278:100-103, and nanoscale mechanical systems, see Iijima (1998) Proc. IEEE Eleventh annual International Workshop on Micro Elector Mechanical Systems (IEEE, Heidelberg, Germany), 520-525. For a discussion of the mechanical properties of carbon nanotubes see Iijima et al. (1996) J. Chem. Phys. 104:2089-92, Poncharal et al. (1999) Science 283:1513-16, and Wagner, et al. (1998) Appl. Phys. Let. 72:188-90. For a review of the electronic properties of carbon nanotubes see N. Hamada et al. (1992) Phys. Rev. Lett. 68:1579-81, and Saito et al. (1992) App. Phys. Let. 60:2204-6.
Multiwall carbon nanotubes (MWCNTs) comprise concentric cylindrical layers or shells of graphite-like sp2-bonded carbon, where the intershell interaction is predominantly van der Waals. In analogy to the well-known lubricating properties of van der Waals bonded graphite, the individual cylinders of MWNTs might be expected to easily slide or rotate with respect to one another, forming near-ideal linear and rotational nanobearings. Recent theoretical calculations disclosed by Kolmogorov et al. ((2000) Bulletin of the APS, March Meeting 2000, Minneapolis, Minn. (American Institute of Physics)) and Crespi et al.((1999) in Electronic Properties of Novel Materials—Science and Technology of Molecular Nanostructures, Kuzmany et al., Eds. (American Institute of Physics, College Park, Md. pp. 364-368) indicate that the MWNT interlayer corrugation energy is indeed small, favoring such motion. For a MWNT, one could envision an extension mode much like the "telescoping" of a mariner's traditional spyglass. Some evidence for inadvertent MWNT telescopic extension can be found in severe mechanical stress failure mode studies, including MWNTs embedded in a stressed polymer composite, see Wagner et al. (1998) Appl. Phys. Let. 72:188-90, and for MWNTs torn apart in quasi-static tensile stress measurements performed in a scanning electron microscope, see Yu et al. (2000) Science 287:637-640. However, no demonstration of controlled and reversible telescoping of MWNTs has been previously achieved.
A major difficulty in initiating controlled telescoping in MWNTs is the commonly capped ends that seal in all inner core nanotube cylinders. Even if the MWNT ends are opened by methods such as acid etching, it is difficult to selectively contact only the core tubes. Recently, a method has been disclosed whereby the ends of a MWNT can be carefully opened, removing the caps from just the outer shell nanotubes while leaving the core nanotubes fully intact and protruding, see Cumings et al. (2000) Nature 406:586. It has been found that the method of Cumings et al. can be used to attach a moveable nanomanipulator to the core nanotubes within a MWNT. This attachment allows for in-situ manipulation of the nanotube core thereby providing controlled reversible telescoping. Robust ultra-low friction linear nanobearings and (constant-force) nanosprings are demonstrated.

Telescoped multiwall nanotube and manufacture thereof

The Regents of the University of California


A voltage boost circuit and a method of boosting voltage using a voltage boost clock signal with varying frequency, in which the voltage boost circuit includes a boost voltage generator that responds to a voltage boost clock signal in order to boost an input voltage and outputs the boosted input voltage as an output boost voltage; and a boost voltage frequency control unit that responds to the result obtained by comparing a level of the output boost voltage and a level of a target boost voltage so as to change the boost voltage frequency of the voltage boost clock signal and outputs the voltage boost clock signal having the changed boost voltage frequency. The voltage boost circuit and the voltage boosting method can prevent a waste of the operating current during the boosting of the voltage.

1. Technical Field
The present disclosure relates to a voltage boost circuit and a method of boosting voltage and, more particularly, to a voltage boost circuit and a method of boosting voltage using a voltage boost clock signal with varying frequency.
2. Discussion of Related Art
A voltage boosting circuit is a circuit that increases a voltage level of a received input voltage and outputs the increased voltage.
The level of boost voltage output by a general voltage boost circuit is proportional to a boost voltage frequency of a voltage boost clock signal and the amount of operational current of the voltage boost clock signal. In addition, the amount of load current flowing in a general voltage boost circuit is inversely proportional to the level of the boost voltage. Meanwhile, the amount of load current flowing in a general voltage boost circuit varies according to various conditions. In this case, in order for the voltage boost circuit to stably output a boost voltage over a predetermined target voltage, the voltage boost circuit should be able to output a boost voltage to the extent of the target voltage under a condition that the load current is at a maximum.
The boost voltage frequency of the voltage boost clock signal, however, is fixed in the voltage boost circuit. Therefore, in order for the voltage boost circuit to output boost voltage to the extent of the target voltage even under the condition that the load current is at a maximum, the voltage boost circuit fixes and outputs the highest boost voltage frequency that corresponds to the condition. Meanwhile, as described above, the amount of operational current of the voltage boost circuit is proportional to the boost voltage frequency. Therefore, under a condition other than the condition where the load current is at a maximum, the operational current of the voltage boost circuit may flow excessively.

Voltage boost circuit and voltage boosting method using voltage boost clock signal with varying frequency


The invention relates to microelectronic technology and, more specifically, relates to a method of forming a gate with a LELE double pattern. The method adopts an ONO structure (Oxide-SiN-Oxide). The ONO structure is exposed twice, and the advanced patterning film is used as a mask in the processing of polysilicon etching. The ONO structure is used to replace the traditional hardmask of silicon oxide, and the substructure of ODL (Organic Under Layer) which is based on the spin-on, and the middle layer structure of SHB (Si-based hardmask). The method saves cost and improves the process of advanced patterning film as a mask with the nodes in 40 nm and above which is applied to the process with the nodes in 22/20 nm and below. Consequently, the maturity and stability of the process for poly gate with the nodes in 22/20 nm and below are improved.

1. Field of the Invention
The present invention relates to the microelectronic technology, more specifically, relates to a method of forming the gate with a LELE double pattern.
2. Description of the Prior Art
In the technology node of 32 nm and below of the photoetching process, the resolution index requirement thereof exceeds the limit of the optical lithography platform. A series of measures were adopted to solve the problem. As the ITRS (International Technology Roadmap for Semiconductors) shows, the DPT (double patterning technology), the EUV (extreme ultraviolet) and the EBL (electron beam lithography) are highly expected.
DPT splits a set of high-integrated circuit patterns into two and more low-integrated circuit patterns. The mask is manufactured respectively, and is completed exposing and etching in order, and then is merged into the high-integrated circuit pattern desired.
With the development of technology of the software and hardware of the photoetching equipment, the resolution and technical life of 193 nm immersion optical lithography platform are extended accordingly. The photoetching technologies of the immersion photoetching machine, of the EUV and even the smaller technology node are developed.
According to the research, the process of LELE (Litho-Etch-Litho-Etch) is the most popular process of DPT. This process forms the desired pattern by twice lithography and etching. There are two types for the desired pattern: the line and the trench.
FIG. 1a is a diagram of the traditional DPT with the first photolithography process. FIG. 1b is a diagram of the traditional DPT with the second photolithography process. FIG. 1c is a diagram of the traditional DPT with the process of LELE. As shown in FIGS. 1a-1c, the resolution of 193 nm immersion machine, such as NXT-1950i, has the HP (half pitch) of 38 nm, in order to satisfy the active layer of nodes in 22/20 nm and the design for poly gate. As shown in FIG. 1a, the Exposure 1 is formed by the first photolithography process. And as shown in FIG. 1b, the Exposure 2 is formed by the second photolithography process. Then the final contour is formed by the Exposure 1 and Exposure 2 with the process of LELE.
In the traditional processing for poly gate in 22/20 nm node, the main method is lithography and etching the polysilicon just by once, and the ODL (organic under layer) with spin-on is used to fill the patterns under layer. The SHB (Si-based hardmask) is used as a hardmask for the second photolithography. Finally, the bottom anti-reflective layer and the photo resist are formed a structure before the second exposing, that means the silicon oxide is used as a hardmask in the process of etching the polycrystalline silicon.
As the ODL and SHB are new materials and their cost is high, it is not often used for the process of the nodes in 40 nm and above. If these new materials are used in the process of the nodes in 28 nm and below, that will cost a lot of time and money.
Chinese Patent (CN 101303525A) has disclosed a method of double patterning. The method uses a filling material which is soluble in the developing solution to fill the trench with repeated layers and baking. Then the remnant fillers are removed by the repeated processes of developing. In another words, the flatness of silicon wafer is improved by the processing of double patterning with the developed filler. It also reduced the adverse effects of the trench filling to the accuracy of lithographic and the focal depth of subsequent lithography.
Chinese Patent (CN 101446760A) disclosed a method of double patterning for lithography, and the process comprises the following steps: a first photoresist layer is formed on the substrate at first, and the first photoresist layer has at least one opening, then the first photoresist layer is solidified. A second photoresist layer is formed on the substrate, then the first photoresist layer and the second photoresist layer are removed to expose the substrate, and making a smaller interval between the first photoresist pattern and the second photoresist pattern.

Method of forming the gate with the LELE double pattern

Shanghai Huali Microelectronics Corporation


Method and apparatus for detecting a species in a dilute medium, the species having a spectral feature, the apparatus comprising: a beam source arranged to generate a first laser beam and a second laser beam coherent with each other, and having a matching chirp pattern. Beam guide arranged to pass at least the first laser beam through the dilute medium; a beam mixer arranged to mix the first and the second laser beams to form a mixed beam. Detector arranged to detect, during the chirp pattern, the mixed beam and to measure changes in the mixed beam caused by refractive index variations in the dilute medium across a spectral feature. Output providing a signal that changes in response to the measured changes.

Absorption spectroscopy and fluorescence spectroscopy are commonly used to detect the presence of particular chemical species in a range of samples, especially dilute media such as gases. Absorption of narrow band laser light by a particular molecular transition may be detected by a reduction in detected intensity or amplitude especially in the ultraviolet or visible spectrum. Absorption of broad band light may be due to one or a plurality of molecular transitions and may also be detected by spectroscopic analysis of the light. Similarly, fluorescence arising from excited molecular states may also be detected.
However, such techniques typically rely on amplitude detection and so are susceptible to scintillation and laser noise.
"Resonant, heterodyne-laser-interferometer for state density measurements in atoms and ions", Review of Scientific instruments 77, 093108 (2006), J. J. Moschella, et al., describes a resonant, two-wavelength heterodyne interferometer for measuring the population density of plasmas. Two separate lasers are used and an acousto-optical modulator splits the beams. However, this system is not particularly suitable for dilute species where the signal may be swamped by noise and other factors.
Therefore, there are required methods and apparatus for detecting dilute species that overcome these problems.

The Science and Technology Facilities Council


A method, apparatus and method for compiling a hardware design for performing hardware emulation using synchronized processors is described. The apparatus comprises a plurality of processors defining a processor group for evaluating data regarding a hardware design and a synchronizer for synchronizing the operation of the processor group while emulating at least a portion of the hardware design. The method comprises providing a synchronization signal to a plurality of processors defining a processor group for evaluating data regarding a hardware design, receiving a ready signal from the processor group, and providing an execution signal to the processor group, where the execution signal causes the processor group to evaluate a submodel. The method for compiling the hardware design comprises converting at least one high-level construct into a sequence of operations and identifying a sequence of operations that comprise at least one conditional submodel.

1. Field of the Invention
Embodiments of the present invention generally relate to a processor based hardware emulation engine and, more specifically, to a method and apparatus for synchronizing processors within the emulation engine.
2. Description of the Related Art
Hardware emulators are programmable devices used in the verification of hardware designs. A common method of hardware design verification is to use processor-based hardware emulators to emulate the design. These processor-based emulators sequentially evaluate combinatorial logic levels, starting at the inputs and proceeding to the outputs. Each pass through the entire set of logic levels is known as a cycle; the evaluation of each individual logic level is known as an emulation step.
An exemplary hardware emulator is described in commonly assigned U.S. Pat. No. 6,618,698 titled "Clustered Processors In An Emulation Engine", which is hereby incorporated by reference in its entirety. Hardware emulators allow engineers and hardware designers to test and verify the operation of an integrated circuit, an entire board of integrated circuits, or an entire system without having to first physically fabricate the hardware.
The complexity and number of logic gates present on an integrated circuit has increased significantly in the past several years. Hardware emulators need to improve in efficiency to keep pace with the increased complexity of integrated circuits. The speed with which a hardware emulator can emulate an integrated circuit is one of the most important benchmarks of the emulator's efficiency, and also one of the emulator's most important selling factors in the emulator market.
A hardware emulator is comprised of multiple processors. During each process cycle, each processor is capable of emulating a logic gate, mimicking the function of a logic gate in an integrated circuit. The processors are arranged to compute results in parallel, in the same way logic gates present in an integrated circuit compute many results in parallel. This creates a chain of logic similar to what occurs in an integrated circuit. In the chain of logic, efficient communication between processors is crucial.
The programs executed by the processors in a hardware emulator consist of instructions containing a sequence of operations. The entire sequence of operations is known as a model. The model is further comprised of an unconditional model, i.e., a sequence of operations that are not dependent upon the outcome of any other sequence of operations, and one or more conditional models, i.e., a sequence of operations whose execution is dependent upon the outcome of another sequence of operations. The conditional and unconditional models are referred to herein as "submodels" with respect to the overall "model" of the hardware.
Certain operations act directly upon data, while other operations describe the conditions necessary for the data to be acted upon. For example, consider the conditional submodel described by the sequence of operations described by equation 1:if(a!=0) b=c+d   (1)The operation "b=c+d" (b equals c plus d) acts upon the data element "b" using "c" and "d" as operands. The operation "a !=0" (a does not equal zero) describes the condition necessary for data element "b" to be acted upon.
Conditional submodels were previously not evaluated using an emulator because evaluating the conditional submodel would decrease the efficiency of inter-processor communication, i.e., additional emulation steps are needed to evaluate a conditional submodel versus evaluating non-conditional submodels. The conditional submodel such as the one described has two possible results. The efficiency of inter-processor communication is decreased because calculation of the correct result requires extra emulation steps; further, the processors cannot calculate the result in parallel because the output of the first part of the equation, i.e., if (a!=0), is uncertain. Therefore, a compiler must convert the conditional submodel into a logically equivalent, but lengthier, non-conditional submodel. For example, if a, b, c and d are Boolean operands, the above sequence of operations may be rewritten as equation 2:b=a &(c+d)|!a &b   (2)
The above equation is a lengthier, logical non-conditional equivalent of the above conditional equation. The hardware emulator must evaluate the lengthier non-conditional equation even if the first part of the conditional statement it is based upon is likely to be false, i.e., the first part of the equation is not true and the remainder of the equation does not need to be evaluated.
Thus, there is a need in the art for a processor-based hardware emulation system capable of efficiently evaluating conditional submodels. The hardware emulation system should avoid evaluating submodels for which the conditions of execution are not satisfied.

Method and apparatus for synchronizing processors in a hardware emulation system


A contoured golf club face provides increased structural integrity for a given weight and size is described and shown along with a method for its design. The contoured golf club face includes a vertical stiffening region, a tapered horizontal stiffening region, four similar contoured quadrants of increasingly thinning material toward the center of each quadrant, and thickening regions at face/sole and face/crown intersection regions. The thicknesses of adjoining regions are gradually blended to provide a smooth contoured surface. The present golf club face is light weight, is structurally resistant to impact deformation, is resistant to initial and long-term failure, has its mass center located at its sweet spot, exhibits inertial axes which are aligned with vertical and horizontal axes (i.e. primary club force directions: ball impact force and club centrifugal force directions), and produces acoustical tones. A club incorporating the present contoured golf club face may be provide a certain first acoustical sound when used to hit a ball with a certain first specific area of the face (e.g. the sweet spot or sweet spot region) and to provide a different second acoustical sound when used to hit a ball with an area of the face other than that first area (e.g. other than the sweet spot or sweet spot region). Thus, the present invention may be used to provide an educational tool for use in teaching and/or learning to consistently impact a ball on the optimal region of the club face.

Generally, a golf club comprises a shaft portion, a head portion, and a grip portion. That part of the golf club head portion which outlines or defines a hitting surface is called a golf club face. See, e.g., R. Maltby, "Golf Club Design, Fitting, Alteration & Repair" (4th Ed. 1995). Generally, a club face abuts or is adjacent to both a crown (or top portion) of the club head and a sole (or bottom portion) of the club head.
In hollow metal wood type club heads and cavity backed iron type club heads the golf club faces are preferably thin. Such golf club faces generally define two surfaces: a hitting (or front) surface and a back surface which is opposite the hitting surface.
When the face of a golf club head strikes a golf ball, large impact forces (e.g. up to 2000 pounds) are produced. These large impact forces load the club face. In the relatively thin faces of hollow metal wood type club heads and cavity backed iron type club heads these forces tend to produce large internal bending stresses. These internal bending stresses often cause catastrophic material cracking which causes the club head to be unusable.
Recent computational and experimental studies on hollow metal wood type club heads and cavity backed iron type club heads have shown that such catastrophic material cracking most often occurs in at least one of the following three face locations: (1) in the head face hitting surface at the ball strike center which is an area of large compressive bending stresses, particularly in the area of any score-lines; (2) on the back surface of the head face at the ball strike center which is an area of large tensile bending stresses; and (3) (a) at the portion of the intersection of the face and the crown which lies directly above the ball strike center which is an area of large vertical component of the bending stresses, and/or (b) the intersection of the face and the sole which lies directly below the ball strike center which also is an area of large vertical component of the bending stresses. The region between the face/crown intersection above the ball strike center and the face/sole intersection below the ball strike center may be called a ball strike zone.
It has also been found that the vertical stress distribution through the ball strike zone on the back side of the face comprises large compressive (i.e. negative) stresses in the face/sole intersection region which increase to zero toward the ball strike center region, reach a maximum tension (i.e. positive) value behind the ball strike center region, decrease through zero to large compressive (i.e. negative) stresses toward the face/crown intersection region. The vertical stress distribution through the ball strike zone on the front side (or hitting surface) of the face generally has the same, but opposite, components (i.e. large tension bending stresses at face/sole intersection which decrease to large compressive stresses at ball strike center and then increase to large tension bending stresses at face/crown intersection).
In designing golf club heads, the golf club face portion must be structurally adequate to withstand large repeated forces such as those associated with ball impact. Such structural adequacy may be achieved by increasing the face portion stiffness so that the bending stress levels are below the critical stress levels of the material used in the face. Typically, for metal club heads, the face portions are stiffened by uniformly increasing the thickness of the face portion and/or by adding one or more ribs (i.e. discrete attached posts or metal lines) to the back surface of the face.
Uniformly increasing the thickness of the face portion typically requires the addition of a large amount of material to adequately reduce the stress sufficient to prevent impact and/or fatigue cracking. However, the addition of such a large amount of material to a club face generally adversely affects the performance of a club incorporating such a face. The club performance is adversely affected by the overly heavy club head which has a mass center (i.e. center of gravity) which is too close to the club face thereby affecting optimum performance. In addition, the feel and sound of a club incorporating such a face is also adversely affected by the large number of vibrations transmitted through the club and by the acoustic response of the club.
Adding ribs to the back surface of a face to stiffen the face has the benefit of stiffening without adding a significant amount of weight to the face, but has the detrimental result of creating an irregular stiffness distribution on the face hitting surface. Examples of ribs which have been used in prior metal golf club head designs include, for example, vertical ribs, horizontal ribs, curved ribs, dendritic ribs, angled or skewed (i.e. V or X patterned) ribs, circular ribs, or a combination of more than one of these types. Such ribs are generally geometrically characterized as having a narrow width, any desired length, and a sufficient depth or thickness to locally increase the face stiffness and yet minimize the increase in face weight.
In addition, such ribs are typically shaped such that a sharp corner (or a curved corner with a small radii) is formed between a rib and the face back surface where the rib is attached. Such corners lead to cracking potential. Furthermore, the use of ribs which are positioned to run vertically along the face back surface cause the large bending stresses (which were described above) to travel to the face/sole and face/crown intersections thereby increasing cracking at those positions.
Additional problems experienced with the use of ribs on a face back surface are in the manufacture of such faces. Typically faces are formed using a casting process. It is more difficult to cast faces which include rib structures due to nonuniform material shrinkage which occurs during cool-down of such a casting. Such non-uniform cool-downs tend to cause inclusions, internal voids, and/or surface cracking in the cast materials, particularly along regions where ribs are positioned. Such non-uniform cool-downs also tend to cause face depressions and surface dimpling in the hitting surface opposite the regions where ribs are positioned.
Thus, there is a need for a new club face structure with increased structural integrity (and, thereby, reduced cracking and material failure) without adversely affecting club performance, look, feel, and sound.


An infant seat support assembly is disclosed for supporting an infant seat relative to a structure, such as a shopping cart.

When using a shopping cart with an infant seat (e.g., an infant car seat), users will place the infant seat in a basket or on a seat of the shopping cart. In both instances, safety of an infant in the infant seat is compromised. When placed in the basket, minimal space is provided to place items therein and the possibility exists of accidentally placing items on top of the infant. When placed on the seat, the infant seat can easily fall off the shopping cart or cause the entire shopping cart to be unstable and tip over.


An optical apparatus including a first optical coupling having a first and a second pair of optical communication ports in which substantially equal portions of an optical signal received at a port of one pair of ports are coupled to each port of the other pair of ports; an optical waveguide optically coupling the second pair of ports such that an optical signal leaving either one of the second pair of ports in a first polarization state; a second optical coupling for coupling an optical signal at a second wavelength to the optical waveguide so as to propagate along at least a portion of it in one direction only; and first and second polarizing beam splitters optically coupled to a respective one of the first pair of ports.

1. Field of the Invention
This invention relates to optical apparatus of particular, but not exclusive, application to routing pulsed optical signals.
2. Related Art
In time division multiplexed communication systems there is a need to perform operations on selected bits of data, which operations include removing and inserting bits in selected time slots from, and into, a received optical data stream. The present invention seeks to provide an optical routing device which can perform such operations in the optical regime, i.e., without the need to convert the data stream to an equivalent electrical data stream upon which the operations are performed.

British Telecommunications public limited company


A method controls the intake and/or the exhaust of at least one deactivated cylinder (10, 12, 14, 16) of an internal-combustion engine operating in four phases. The cylinder includes an intake with an intake valve (28), an exhaust with an exhaust valve (34), a fuel injector (42), an ignition (48) and a piston sliding within this cylinder between a position corresponding to its top dead center (PMHa, PMHd) and a position corresponding to its bottom dead center (PMBa, PMBd). When the engine runs at low or partial loads, one of the valves (28, 34) of the deactivated cylinder is opened in the vicinity of a top dead center (PMHa, PMHd). This valve is closed in the vicinity of the next top dead center (PMHd, PMHa).

An engine usually runs with all of its cylinders. However, when this engine works at low or partial loads, the engine efficiency is degraded by the increase in the contribution of frictions and of throttling in the case of gasoline type engines.
It has been proposed operating only part of the cylinders of this engine, thus making the remaining part inactive. Fuel injection is therefore stopped only in the cylinders to be deactivated. This allows the reduction of fuel consumption to be favoured by injecting the fuel required only for the cylinders necessary for production of the energy needed to operate the engine at low or partial loads.
Although this engine running type is satisfactory, it however involves some quite significant drawbacks.
In fact, since the lift laws of the exhaust and intake valves remain unchanged, the different phases known as expansion and compression of the inactive cylinder(s) will lead to running problems.
Thus, as it is well known, during the usual expansion phase of the cylinder of an engine, the combustion chamber of this cylinder contains a compressed fuel mixture that burns away while carrying out expansion of the volume present in this chamber. During this phase, the exhaust and intake valves are closed and the piston is driven in a motion towards its bottom dead center under the effect of the expansion of the burnt gas by transmitting the energy thereof to the crankshaft it is connected to.
When cutting off fuel supply to the cylinder to be made inactive, no fuel mixture occurs in the combustion chamber and only a volume of compressed air is present. During the phase of this cylinder which corresponds to its expansion phase, the piston is not subjected to a force resulting from the expansion of the burnt gases but it only stretches a volume of air compressed by the previous engine running phase. This stretching generates cooling of the air contained in the cylinder and this temperature drop is transmitted to the oil film usually present on the cylinder wall. The oil film cools down and loses its lubricating qualities, notably as regards the viscosity thereof, which leads to bad lubrication between the piston and the cylinder, which may cause sticking between these two parts.
This cooling is still more marked during the exhaust phase of the inactive cylinder, during motion of the piston from the bottom to the top of the cylinder. During this motion, the cold expanded air is pushed by the piston towards the exhaust valve and travels the surface of the oil film. This increases cooling of the oil film with a greater loss of the lubricating qualities thereof. Still more disadvantageously, this air leaving the chamber is sent to the exhaust channel by feeding a significant amount of oxygen into the hot gases from the combustion of the active cylinders. This oxygen supply is not only harmful for the reliability of the exhaust gas fuel/air ratio measurement, in case a depollution means is used, it also involves an exhaust gas afterburning risk if this gas contains a sufficient residual amount of fuel.
Furthermore, during the expansion phase of the inactive cylinder, the piston that slides in this cylinder is no longer a piston generating energy to be transmitted to the crankshaft. In fact, the combustion chamber contains no compressed fuel mixture that expands upon combustion, but only compressed air. This piston therefore acts as an energy absorber. In fact, since no combustion occurs in this cylinder, the piston is only driven, in a motion from the top to the bottom of this cylinder, by the crankshaft that is subjected to a rotating motion produced by the active cylinder(s). These cylinders therefore have to generate an additional energy to drive the piston of the deactivated cylinder. This additional energy is all the higher as the piston lubrication conditions in the inactive cylinder are degraded by the expansion of the compressed air.
The present invention aims to overcome the aforementioned drawbacks by means of a simple and economical method allowing to reduce even more the fuel consumption and to minimize the energy loss due to the inactive cylinder.

Method of controlling the intake and/or the exhaust of at least one deactivated cylinder of an internal-combustion engine


An apparatus includes first load ports 2A and 2B and second load ports 2C and 2D provided in a left-right direction; a processing unit D2; an inspection module 4 provided between the first load ports 2A and 2B and the second load ports 2C and 2D; a first substrate transfer mechanism 5A provided at one side of the inspection module 4 in the left-right direction, and configured to transfer a substrate W into the processing unit D2 and a transfer container C on the first load ports 2A and 2B; a second substrate transfer mechanism 5B provided at the other side thereof, and configured to transfer the substrate W into the inspection module 4 and a transfer container C on the second load ports 2C and 2D; and a transit unit 51 for transferring the substrate W between the first and the second substrate transfer mechanisms 5A and 5B.

In photolithography in a manufacturing process of a semiconductor device, a resist film is formed by coating a resist on a surface of a semiconductor wafer (hereinafter, simply referred to as "wafer") used as a substrate, and a resist pattern is formed by performing a developing processing after the resist film is exposed to light. A coating and developing apparatus configured to perform the formation of the resist film and the developing processing may be equipped with an inspection module for inspecting a surface state of the wafer before or after the individual processings in the coating and developing apparatus are performed.
If, however, this inspection module is provided, a space for accommodating modules configured to process the wafer may be reduced. That is, for the reason of space limit, it may be difficult to provide or additionally provide the inspection module within the coating and developing apparatus. Further, in order to perform the inspection with high accuracy, maintenance of the inspection module may be regularly performed, for example. Thus, the inspection module may need to be provided in such a way to allow this maintenance to be performed easily. Thus, there is a demand for a technique capable of providing the inspection module within the apparatus while meeting all of the aforementioned requirements.
Patent Document 1 describes a coating and developing apparatus equipped with a carrier block having a load port on which a carrier accommodating wafers therein is placed; a processing block having a multiple number of processing modules configured to process the wafers; and an interface module configured to connect the processing block and an exposure apparatus. An inspection module is horizontally arranged with respect to the carrier block. According to this apparatus configuration, however, a footprint of the apparatus is increased due to the presence of the inspection module. Moreover, since a transfer device for the wafer provided in the carrier block transfers the wafers to both the processing block and the inspection module, a load of the transfer device may be larger, which may result in deterioration of a throughput of the apparatus. Thus, it is also required to suppress the deterioration of the throughput of the apparatus and the increase of the footprint of the apparatus which might be caused by providing the inspection module.    Patent Document 1: Japanese Patent Laid-open Publication No. 2003-151878

This patent is subject to a terminal disclaimer.

Substrate processing apparatus, substrate processing method and recording medium


Methods and systems for optimizing interworking between various communication protocols are provided. The method comprises establishing a communication connection between a first endpoint and a second endpoint, wherein the first endpoint communicates over a first communication protocol and wherein the second endpoint communicates over a second communication protocol; and monitoring communication between the first and second endpoints such that communication messages that are transmitted by the first endpoint over the first communication protocol can be mapped to counterpart messages to be received by the second endpoint over the second communication protocol, and communication messages that are transmitted by the second endpoint over the second communication protocol can be mapped to counterpart messages received by the first endpoint over the first communication protocol.

Voice over Internet protocol (VOIP) refers to a set of standards for communicating digitized voice in form of data over an IP-based network, such as the Internet. Current VOIP systems use different communication protocols, such as packet based telecommunication protocol H.323 and session initiation protocol (SIP), to set up calls between one or more communication endpoints. Each endpoint (e.g., communication device) may communicate over a different communication protocol, such that one endpoint may communicate over the H.323 protocol and another endpoint may communicate over the SIP, for example.
To support communication between endpoints that use different VOIP protocols, basic models for interworking the H.323 and SIP protocols have been implemented. Interworking refers to the process of mapping a communication method (or message) supported in one protocol to a corresponding or counterpart communication method (or message) in another protocol. Interworking thus provides for establishing a communication connection between two endpoints, even if one endpoint communicates over the H.323 and another endpoint communicates over the SIP, for example.
Unfortunately, not every communication message transmitted over a first VOIP protocol (e.g., H.323) can be mapped to a counterpart message in a second VOIP protocol (e.g., SIP). That is, a one-to-one mapping relationship does not necessarily exist for all messages across different protocols and communication platforms. For example, a 1xx provisional message in the SIP does not have a counterpart in the H.323; or the TCS/MSD message in the H.323 does not have a counterpart in the SIP.
Accordingly, a first message in a first protocol may not be mapped to what would be an equivalent or a corresponding message in a second protocol, if no counterpart for the first message exists in the second protocol. The inability to properly map messages between various protocols results in unreliable interworking and extra processing overhead for gateways and session border controllers (SBC) that provide the interworking capabilities.
For the above reasons, systems and methods are needed that can overcome the aforementioned shortcomings.
Features, elements, and aspects of the invention that are referenced by the same numerals in different figures represent the same, equivalent, or similar features, elements, or aspects, in accordance with one or more embodiments.

Optimized interworking between different communication protocols


A compound having, in its molecule, a polymethine chain structure containing a partial structure represented by the following formula (1-1), and an image forming material containing the same. In the formula (1-1), R1, R2, R3, R4, and X each independently represent a hydrogen atom, a halogen atom, or a monovalent organic group. The image forming material is useful as the image recording layer of a planographic printing plate precursor.

1. Field of the Invention
The present invention relates to a compound having a specific methine-chain structure giving a printed-out image superior in visibility that allows easy differentiation of laser-irradiated and non-irradiated regions, and an image forming material and an image forming method using the same. The invention also relates to an image recording layer of a planographic printing plate precursor using the image forming material, more preferably a planographic printing plate precursor allowing so-called direct plate making in which a plate is directly made by scanning with a laser at a wavelength of 300 to 1,200 nm based on digital signal from computer or the like, a planographic printing plate precursor that can be developed in the printing step directly without being processed in a wet development step, a method of making the same, and a planographic printing method using the same.
2. Description of Related Art
Various compositions and methods for forming an image on a substrate and thus marking the substrate have been used in various industries. As a few examples of such industries, paper making industry, packaging industry, painting industry, medical industry, dental industry, electronic industry, fiber industry, airplane/ship/automobile industries, and visual art industry can be mentioned.
Such image formation or marking is used typically for identification of articles, e.g., for identification of the name or logo of the manufacturer, serial number or lot number, or structural type, or alternatively, for positioning during the production of semiconductor wafers and vehicles such as airplanes, ships, and on-shore vehicles.
Marking is also used in reinforced product, photoresist, solder mask, printing plate, and other photopolymer products. Laser marking is attracting attention recently as a high speed and efficient marking method, and has already been put into practice in some industries. Many laser-marking techniques include irradiating a required region of a substrate with laser radiation to modify or remove the irradiated region, or irradiating a coated substrate with laser radiation and removing the irradiated coating layer to produce contrast between the irradiated region (marked region) and the non-irradiated region (background).
Although laser marking on articles such as semiconductor chip is a rapid and economical means of marking, the latest laser-marking technique of obtaining a desired mark by surface combustion has relevant disadvantages. For example, the mark formed by surface combustion caused by laser is visible only at selected incident angles with respect to the light source. In addition, staining of the mark with oil or other contaminants on the article surface may blur or obfuscate the laser mark. Further, since the laser causes actual combustion on the article surface, in the marking of a bare die, the combustion may damage any structure beneath the surface or damage the internal circuit because of increase in the internal die temperature above its tolerance limit.
Digitalization technology of processing, storing, and outputting image information electronically in and out of computer has been widely spreading recently as an image forming means on the planographic printing plate precursor, and various new image-outputting systems compatible with the digitalization technology have been put into practical use. Computer to plate (CTP) technology of producing a planographic printing plate directly without use of a lith film by making a highly converged radiation ray such as laser radiation carry such digitalized image information and scan-irradiating the planographic printing plate precursor with the ray is attracting attention in the above situation. Accordingly, it is one of important technical issues to obtain a planographic printing plate precursor suitable for such technology.
When making a printing plate from a conventional planographic printing plate precursor, it is necessary to remove undesired portions of the image recording layer through dissolution in a developer or the like after exposure. However there has recently been a demand for elimination or simplification of such an additional wet processing. Under the circumstance, a so-called on-press development method has been proposed as a simplified platemaking method. In the on press development method, an image recording layer allowing removal of undesired portions of the image recording layer of the planographic printing plate precursor in the normal printing step is used, and the undesirable portions of image recording layer are removed on-press after exposure.
However, in general, an on-press developable or no processing (no development) planographic printing plate precursor, which does not accompany pre-printing development, does not have an image on the printing plate when the printing plate is mounted on the printing machine. Therefore, there is a problem in that the plate cannot be identified. In particular, it is quite important in multicolor printing whether resister marks for registration marked on the plate precursor are detectable or not. Accordingly, the use of such an on-press developable or no processing (no development) planographic printing plate precursor requires a means that enables the image to be confirmed after exposure or heating (a printing-out agent).
A printing plate containing, as printing-out agents, a compound that generates acid, base, or radical upon application of light or heat and a compound that changes its color in interaction with the generated acid, base or radical has been proposed (see, for example, Japanese Patent Application Laid-Open (JP-A) No. 11-277927). Moreover, it has been proposed to use the color change of a thermodegradable compound as a printing-out agent for the direct-recording planographic printing plate precursor having a thermosensitive layer (see, for example, JP-A No. 2000-335129). It has further been proposed to use a thermal decomposable colorant having a heat decomposition temperature of 250° C. or lower as a printing-out agent (see, for example, JP-A No. 2003-191657). However, these methods still have a problem in that the visibility in the exposed region is insufficient.

Compound having polymethine-chain structure, image forming material, planographic printing plate precursor, and image forming method using the same, method of making planographic printing plate, and planographic printing method


A female jockstrap has a covering and a support. The support includes a waistband with two front and two rear bands coupled to the covering. A protector has a generally trapezoidal upper extent and a depending lower extent. Removable couplings are provided between the jockstrap and the protector. The couplings includes a fastener on the exterior surface of the upper extent of the protector. Straps have fasteners extending laterally from the protector adjacent to the lower extent. The straps are adapted to wrap around the front bands. The interior face of the lower extent of the protector overlies the exterior surface of the covering.

1. Field of the Invention
The present invention relates to a female external genitalia protecting jockstrap system, hereinafter referred to as a "female jockstrap system", and more particularly pertains to maximizing wearer safety through a symphysis protector with increased comfort.
2. Description of the Prior Art
The use of female protection systems of known designs and configurations is known in the prior art. More specifically, female protection systems of known designs and configurations previously devised and utilized for the purpose of protecting females through known methods and apparatuses are known to consist basically of familiar, expected, and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which has been developed for the fulfillment of countless objectives and requirements.
By way of example, U.S. Pat. No. 4,967,767 issued Nov. 6, 1990 to Harris relates to a Vaginal Shield for Preventing Sexually Transmitted Diseases. U.S. Pat. No. Des. 395,735 issued Jul. 7, 1998 to Paramore related to a Female Jock Band. Lastly, U.S. Pat. No. Des. 419,280 issued Jan. 25, 2000 to Hines relates to an Undergarment.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not describe a female jockstrap system that allows maximizing wearer safety through a symphysis protector with increased comfort.
In this respect, the female jockstrap system according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in doing so provides an apparatus primarily developed for the purpose of maximizing wearer safety through a symphysis protector with increased comfort.
Therefore, it can be appreciated that there exists a continuing need for a new and improved female jockstrap system which can be used for maximizing wearer safety through a symphysis protector with increased comfort. In this regard, the present invention substantially fulfills this need.


Registered car calls are indicated in the car call buttons of an elevator car operating panel by illuminating one of the car call buttons with a first illumination characteristic, and the floor position of the elevator car within the building is indicated by illuminating any of the same car call buttons with a second illumination characteristic, different from the first illumination characteristic. One part of the car call button (such as the center) may be used to indicate registered car calls and another part of the car call button (such as the ring) may be used to indicate car position (or vice versa). Registered car calls may be indicated by steady or invariant illumination from the car call button while car position is indicated by illuminating the appropriate car call button with flashing illumination. Colors may also be used.

As seen in FIG. 1, a plurality of car call buttons 1-10 on a car operating panel 13 are used to register car calls for floors that passengers wish to reach. The car operating panel 13 may have door open buttons, door close buttons, firemen service and other switches and indicators, all of which are omitted herein for clarity. To inform passengers of the position of the elevator in the building, a car floor position indicator 15 includes a display 16 which may typically comprise a liquid crystal display. As is known, operation of one of the buttons 1-10 will typically illuminate the button temporarily, send a signal through circuits 18 and over wire connections 19 to a controller 20, which registers the corresponding call and sends signals back over the wires 19 and through the circuits 18 so as to permanently illuminate the related button, thus indicating to the passengers that the car call has been recognized by the elevator system.
The car position indicator 15 will typically cost several hundred US dollars. In addition, it represents parts that must be maintained and replaced from time to time, thus adding to the cost of each elevator. In some elevator systems, such as in low cost, public housing, costs can be paramount, and simplicity can be a great advantage.

Elevator car call buttons indicating car floor position


There is disclosed a handheld air flow velocity measurement probe that includes a bridge circuit assembly having an airflow velocity sensor that is a resistance temperature detector (RTD) and a digitally controlled resistive element to dynamically adjust and maintain the resistance of the velocity sensor within the overheat temperature predefined range. The velocity measurement also uses a separate temperature sensor to sense the temperature of the air or gas flow. A humidity sensor is also included remote from the other sensors to measure humidity in the gas flow to be measured. All of the above described components are housed at a probe tip instead of a base as in most standard handheld probes and the digital interface at the probe tip allows the user to replace a bulky, expensive telescoping antenna with stackable extender scheme.

This invention relates generally to device and system for measuring the velocity, temperature and humidity of gas flow in a ventilation system or area.
There are numerous applications for air flow and ventilation monitors, such as work areas, spray booths, clean rooms, grinding operations, fume hoods and ventilation systems. Fume hoods serve to protect an operator from noxious fumes contained or generated within the fume hood. The fume hood has one or more openings in a face of the fume hood and the exhaust is preset to provide a desired flow velocity of air into the hood. To assure the safety of the operator, it is necessary to confirm that the required flow velocity is maintained.
Similarly, ventilation systems such as HVAC systems need to be checked and calibrated regularly, usually at certain points along the ductwork, to ensure that the airflow is at the appropriate velocity, temperature and humidity called for by the facility. For instance, the ventilation needs of a hospital are different than those of a construction site. Current air velocity sensors, such as TSI's Alnor® thermal anemometer, which incorporate a conventional Wheatstone bridge circuit, provides both high accuracy and minimal obstruction to the airflow.
The principle used requires that the flow sensor be heated to some temperature above the temperature of the fluid or gas being measured. Velocity of the fluid or gas is related to the power dissipation in the sensor. Very early implementations of thermal anemometers involved manual adjustment of the sensor temperature. The manual adjustments proved to be inconvenient and, as technology became available, were replaced by electronic control circuitry that automatically maintained the sensor at the specified temperature. A typical prior art airflow device includes a bridge circuit, an operational amplifier, and a power output amplifier. The bridge circuit comprises two circuit legs, with the first leg sensing the ambient temperature and including a resistive temperature detector (RTD) RD, an offset resistance RC, and a reference resistance RA. The second leg of the bridge circuit is the heated velocity sensor, comprising a second reference resistor RB and the heated RTD RE. The airflow device operates by applying a voltage to the bridge circuit sufficient to heat the velocity sensor (RE) to a temperature where its resistance will balance the bridge circuit. In this circuit, sensor measurement and temperature control occur simultaneously. Within this circuit, the resistive sensor RE behaves as a nonlinear passive element. The nonlinearity results from power dissipation in the sensor, which raises the sensor temperature and changes its resistance, thus making the resistance value dependent on the current through the sensor. Control of the sensor temperature takes advantage of this nonlinear behavior.
One limitation to this prior art approach is that the ambient temperature sensor should not be powered in any way that could cause self-heating, while the RTD (resistance temperature detector) used to sense the velocity must be heated sufficiently to sense airflow. Since these sensors are typically disposed in corresponding legs of a bridge network, only by making the ambient sensor resistance much larger than the velocity sensor resistance will self-heating be reduced sufficiently to prevent significant temperature errors. This limits the selection of sensors and often requires the use of more expensive custom RTDs rather than lower cost standard values used widely in the industry. Additionally, with a very low sensor resistance, sensitivity to temperature is proportionally lower, requiring measurement of signals near the threshold of system noise.
Another challenge in the constant use of these airflow meters for temperature and velocity measurement is the need to calibrate them after so many uses or after so much time has passed since the device's last calibration. In most cases the device needs to be sent back to the factory for calibration. The inconvenience and lost revenue for many customers experienced due to instrument calibration is a driving factor to find a solution to the calibration requirement. This impact to customers is even more severe in emerging countries like China where the return-to-factory delay may last weeks. Sending back sensor probes from the field for calibration results in downtime for the customer, which can be especially high if the customer location is either geographically far away from the service center of if there are customs or other procedures that result in delays.

Air and gas flow velocity and temperature sensor probe


An apparatus and method for conveying information displayed on a touch screen are disclosed. For example, the apparatus includes an overlay having an array of pockets, a plurality of valves, wherein each pocket of the array of pockets is coupled to at least one of the plurality of valves via a respective channel, a pump coupled to the plurality of valves for providing a fluid to one or more pockets of the array of pockets and a controller in communication with the pump and each one of the plurality of valves to control an operation of the pump and each one of the plurality of valves for activating the one or more pockets of the array of pockets to correspond to information on a touch screen of the touch screen device.

The use of touch screen devices has grown in popularity via devices such as smart phones and tablet computers. However, a partially sighted or blind person may not be able to use a touch screen device.
One major drawback of the touch screen devices is that they cannot be adapted to the Braille system or even use tactile keys. Where some basic learning could master a hard key photocopier user interface, it is now impossible due to all of the possible options presented by soft keys on a user interface of the touch screen device. For example, a software upgrade could completely reconfigure the keys and render the touch screen device unusable without further re-training.

Apparatus and method for conveying information displayed on a touch screen device