A jumper coaxial cable assembly includes a jumper coaxial cable and at least one solder-type connector secured thereto. The cable may include an outer conductor, which, in turn, includes aluminum with a tin layer thereon. The tin layer permits an aluminum outer conductor to be used, yet facilitates soldering of the solder-type connector onto the outer conductor. The tin layer may be a tin alloy, such as a tin/lead alloy, for example. The outer conductor may have a continuous, non-braided, tubular shape, and the tin layer may extend continuously along an entire length of the outer conductor. The tin layer may be readily formed by tin plating during manufacturing of the jumper coaxial cable. The jumper coaxial cable assembly may be joined to a main coaxial cable and/or to electronic equipment.

Coaxial cables are widely used to carry high frequency electrical signals. Coaxial cables enjoy a relatively high bandwidth, low signal losses, are mechanically robust, and are relatively low cost. A coaxial cable typically includes an elongate inner conductor, a tubular outer conductor, and dielectric separating the inner and outer conductors. For example, the dielectric may be a plastic foam material. An outer insulating jacket may also be applied to surround the outer conductor.
One particularly advantageous use of coaxial cable is for connecting electronics at a cellular or wireless base station to an antenna mounted at the top of a nearby antenna tower. For example, the transmitter and receiver located in an equipment shelter may be coupled via coaxial cables to antennas carried by the antenna tower. A typical installation includes a relatively large diameter main coaxial cable extending between the equipment shelter and the top of the antenna tower to thereby reduce signal losses. For example, CommScope, Inc. of Hickory, N.C. and the assignee of the present invention offers its CellReach® coaxial cable for such applications.
Each end of the main coaxial cable may be coupled to a smaller diameter, and relatively short, coaxial cable jumper assembly. The coaxial cable jumper assembly includes a length of coaxial cable with connectors attached to the opposing ends. The cable of the jumper cable assembly is typically of a smaller diameter than the main coaxial cable to provide a smaller cross-section, greater flexibility and facilitate routing at the equipment shelter, and also at the top of the antenna tower, for example. Connectors are typically coupled to each end of the jumper coaxial cable to form the coaxial cable jumper assembly.
A coaxial cable is typically manufactured in a continuous fashion wherein an inner conductor or wire and is advanced along a path through an extruder which extrudes a dielectric foam around the inner conductor. Downstream from the extruder are a series of cooling tanks to cool and solidify the dielectric foam. The outer conductor may be applied as a metallic tape formed into a tube around the dielectric layer. The plastic insulating jacket may be extruded downstream from application of the outer conductor.
The connectors for the jumper cable assembly can be installed onto the ends of the coaxial cable at the cable manufacturing plant and/or in the field. Connectors are available in two main categories—mechanical-type connectors which are configured for mechanical installation onto the end of the jumper coaxial cable, and solder-type connectors which are configured to be coupled by soldering. Unfortunately, the mechanical-type connector is relatively complicated, includes many parts, and, therefore, is relatively expensive. Solder-type connectors may be less expensive because of fewer parts. For example, U.S. Pat. No. 5,802,710 to Bufanda et al. discloses a solder-type connector which uses a solder preform wrapped around an annularly corrugated outer conductor of the coaxial cable. The connector body is placed over the solder perform and then heated to solder the connector to the end of the cable.
Unfortunately, not all materials used in connectors and/or coaxial cables are readily suited to soldering. Aluminum is a highly desirable material and is often used for the outer conductor of a jumper coaxial cable. Unfortunately, aluminum does not readily accept solder, and, therefore, more expensive mechanical-type connectors have typically been used in combination with a jumper coaxial cable having an aluminum outer conductor.

Method for marking coaxial cable jumper assembly including plated outer assembly


An apparatus is described that includes a display panel and a sensor. The display panel includes an array of pixels configured to direct light through a front side of the display panel. Each pixel includes sub-pixels, each of which includes an organic light emitting diode (OLED) and an integrated circuit (IC) for controlling an electrical current to the OLED. The sensor is arranged at a back side of the display panel. The sensor includes an emitter configured to emit electromagnetic radiation transmitted through a first area of the display panel. The IC of sub-pixels of the array of pixels outside the first area includes a first IC arrangement. The IC of sub-pixels of the array of pixels within the first area includes a transistor in addition to the first IC arrangement. The transistor is configured to operate as a control switch controlling emission of light from the sub-pixel.

Display panels of mobile devices can include a sensor embedded underneath the cover glass of the screen, such as a front facing camera or facial recognition sensor. When such sensor performs the sensing of an associated parameter—such as 3D detection, proximity, or the like—an emitter of the sensor emits electromagnetic radiation such as infrared waves through the display. Interaction between the electromagnetic radiation from the sensor and a pixel circuit for driving an AMOLED display pixel can cause undesirable effects in the display, such as an unintentional luminance increase of the pixels due to an interaction between the EM radiation and the pixel circuits. For example, conventional circuits of sub-pixels of the pixels arranged in such display panel can cause an unintentional luminance increase due to an increase of the off-leakage current of transistor switches in the pixel circuit due to absorption of the electromagnetic radiation in the transistor structure. Such a luminance increase can undesirably cause image distortion due to the increased luminance. The sensor's performance can also be affected by the illumination of the display sub-pixels when they capture signals (such as visible light, and infrared) through the display panel since a small portion of light from a sub-pixel can be reflected backward by the display panel internal structures, and becomes a noise to the sensors.

Synchronously and locally turning-off sub pixels in under-display sensor area of AMOLED panel


Centralized support user management in a distributed healthcare information management system. Support user management may include generation of permission data that may be distributed from a central server to one or more local systems. The local systems may execute a healthcare information management application such as, for example, a pharmacy workflow management application. In any regard, central support users at the central server may periodically require access to the local systems to perform, among other activities, technical support or troubleshooting in relation to the application executed at the local system. In turn, provision of permission data from the central server to the local system may allow support users to access the local system with specific permission identification's provided specific ones of the support users. In turn, specific user permissions may be established and support user tracking may be carried out at the local systems.

Distributed healthcare information management systems may include a plurality of local instances of healthcare information management applications operating remotely at remote nodes that are in operative communication with a central server. For instance, U.S. Provisional Patent Application No. 61/975,519 entitled "MANAGEMENT OF MEDICATION DOSE ORDERS" filed on Apr. 4, 2014, which is co-owned with the present application and incorporated by reference herein in the entirety, discloses certain embodiments of a distributed healthcare information management system.
In such a distributed system, remote nodes may communicate with a central server. For instance, the remote nodes may communicate with the central server for number of different functions. Administrative functions may also be performed at the remote nodes. In this regard, users of the central server may access the local node to perform certain administrative functions. Additionally, remote users (e.g., users remote from the central server and local node) may access the local node to perform administrative functions. Such administrative functions may be related to the management, upgrade, development, troubleshooting, technical support, or other tasks associated with the local node or a client application (e.g., a healthcare information management application like a pharmacy workflow manager or the like) executed at the local node.
A distributed healthcare information management system (e.g., including a host device such as a central server, client device, or a combination thereof) may also employ a role-based security model. The role-based security model may attribute access rights or privileges to individual users. In turn, individual users may access resources at a distributed healthcare information management system using a username and password combination associated with a given set of permissions or rights.
For instance, in one particular example of a healthcare information management system, the local nodes may each execute a client application comprising healthcare information management system for management of healthcare information (e.g., a pharmacy workflow management application for preparation of dose orders) related to the facility at which the local notice is executing (e.g., a hospital, pharmacy, or the like). As such, local users of the client application may have usernames and password combinations that are used to access the system such that specific permissions may be provided to appropriate users. However, additional access may need to be provided to a remote user (e.g., a central support user at a central server). In this regard, the support user may not have a local username and password combination for access to local client application.
In a traditional approach to providing support users access to a local device a generic "administrator" login may be provided to all central support users for access to a local node for purposes of performing various functions related to the local node. As such, tracking of specific support users taking action with respect to the local node and management of the role-based security model with respect to a specific support user may not be possible. Furthermore, security may be compromised in the case where a user having access to the generic administrator login is no longer to be permitted access to local systems. In turn, continued development to improve the role-based security model of the distributed healthcare information management system is needed.

Central user management in a distributed healthcare information management system


Methods, systems and computer program products for cardiac pacing are provided. For pacing using biventricular synchronization in a patient, a first stimulation signal is applied to a first region of a heart of the patient at a first time and a second stimulation signal applied to a second region of the heart of the patient at a second time to provide biventricular synchronization stimulation of the heart. Cardiac function of the patient associated with application of the first and the second stimulation signals is sensed and a timing relationship of the first stimulation signal to the second stimulation signal is adjusted based on the sensed cardiac function. Additionally, a cardiac timing interval, such as the A-V timing interval, may be adjusted by applying stimulation to a heart of the patient utilizing a cardiac timing interval, detecting a change in cardiac function by sensing cardiac function associated with application of the stimulation using the cardiac timing interval and adjusting the cardiac timing interval directly from the detected change in cardiac function.

The heart is a muscular organ that is covered by a fibrous sac known as the pericardium. The space between the pericardium and the muscular organ is called the pericardial space. The walls of the heart are substantially formed from muscle (the myocardium) that differs from either skeletal or smooth muscle. The heart comprises atria and ventricles, each of which is composed of layers of myocardium that are formed to encase the blood-filled chambers. In operation, when the walls of a chamber contract, they come together similar to a squeezing fist. This contraction of the cardiac muscle is triggered by depolarization of the muscle membrane. To operate properly, the muscle contractions should be coordinated.
If the muscle contractions are not coordinated within the ventricles, blood may be sloshed back and forth within the ventricular cavities instead of being ejected into the aorta and pulmonary arteries. Thus, the complex muscle masses forming the ventricular pumps should contract substantially simultaneously for efficient pumping.
The heart is able to achieve this coordination because of (a) the tight junctions formed between adjacent cardiac fibers (the fibers are joined end to end at structures known as intercalated disks, which provide the points or junctions) which allow action potentials to be transmitted from one cardiac cell to another; and (b) the specialized muscle fibers in certain areas of the heart which provide the conducting system for proper excitation of the heart. The specialized fibers are in contact with fibers of the cardiac muscles to form gap junctions, which permit passage of action potentials from one cell to another. The specialized conduction system is configured, in normal operation, to provide a rapid and coordinated spread of excitation.
Cardiac muscle cells are autorhythmic, i.e., capable of spontaneous, rhythmical self-excitation. The sinoatrial (SA) node is the normal pacemaker for the entire heart or smooth muscle, and it is from this region that the excitation wave starts; it then moves or propagates through the remainder of the myocardium in a synchronized manner. The SA node region of the heart contains a small mass of specialized myocardial cells in the right atrial wall near the entrance of the superior vena cava that have a fast inherent rhythm, which allows the SA node to be the normal pacemaker. In unusual circumstances, other regions of the heart can become more excitable and provide a faster spontaneous rhythm. In this situation, this other region can become the pacemaker and the rhythm for the entire heart.
In normal operation, the cells of the SA node make contact with the surrounding atrial myocardium fibers. Thus, from the SA node, a wave of excitation spreads throughout the right atrium along the atrial myocardial cells via the gap junctions. In addition, the atrial tissue directs the impulse from the SA node directly to the left atrium, to simultaneously contract both atria.
The excitation wave then is distributed to the ventricles by way of a second small mass of specialized cells located at the base of the right atrium near the wall between the ventricles (the atrioventricular (AV) node). The AV node is configured to delay the propagation of action potentials (the wavefront) by about 0.1 second, to allow the atria to contract and empty the blood into the ventricle before ventricular contraction. The wavefront is then quickly dispersed along the specialized conducting fibers (down the interventricular septum to the ventricular free walls) and then through unspecialized (typical) myocardial fibers in the remaining myocardium.
The pumping of blood includes alternate periods of contraction and relaxation. The cardiac muscle has a relatively long refractory period (on the order of about 250 ms). This refractory period is a time during which the membrane is insensitive to stimulus (either totally unable to propagate an excitation wave or only able to do so upon exposure to an increased level of stimulation).
Heart function may be decreased in certain conditions in heart failure. In such conditions, it may be possible to increase synchronization of electrical activity that increases the muscular contraction synchronization, thereby improving cardiac function.
One approach to the improvement of cardiac function has been through biventricular synchronization utilizing a pacing device, such as a pacemaker, or other cardiac rhythm management device. Certain techniques for biventricular synchronization are described, for example, in U.S. Pat. No. 4,928,688 to Mower, the disclosure of which is incorporated herein by reference in its entirety. In general, biventricular synchronization involves application of both left ventricular and right ventricular stimulation. Initiation of the stimulation may, for example, be based on a sensed heart rate, an atrioventricular interval or the like, such as described in U.S. Pat. No. 6,285,907, the disclosure of which is incorporated herein by reference in its entirety. Typically, the left and right ventricular stimulation occur simultaneously or one of the left or right ventricular stimulation is delayed by a predefined time. For example, in an implanted device, the timing between left and right ventricular stimulation is, typically, either a fixed predefined relationship or a relationship established at the time of implantation and fixed thereafter. However, such timing may be suboptimal for a given patient or the patient's condition may change over time such that a different timing may provide better cardiac function.

Pacing methods and devices using feedback controlled timing


A semiconductor memory device has a memory cell area and a peripheral area including a scribe area. A large number of first monitoring patterns are disposed in the scribe area for monitoring the peripheral circuit in the peripheral area, whereas a few number of second monitoring patterns are disposed adjacent to the memory cell area for monitoring the characteristics of the memory cells. A CMP process which reduces the thickness of the memory device does not generate dust of the conductive material from the scribe area because the first monitoring pattern has a level substantially equal to the level of the peripheral area.

(a) Field of the Invention
The present invention relates to a semiconductor memory device having a monitoring pattern and, more particularly, to the arrangement of the monitoring patterns for monitoring the characteristics of memory cells and peripheral circuits in the semiconductor memory device.
(b) Description of the Related Art
Some conventional semiconductor memory devices have monitoring patterns for monitoring whether or not the transistors and interconnects formed on the product chip have desired characteristics. JP-A-56(1981)-83955, for example, proposes such a monitoring pattern in a semiconductor memory device. The monitoring pattern is generally disposed in the peripheral area or corner region of the product chip in view that there is scarcely any marginal area for the monitoring pattern in the central area or memory cell area of the memory device wherein a large number of transistors are integrated.
FIG. 1 is a partial top plan view of a conventional product chip of a memory device for showing an arrangement of the monitoring patterns. The monitoring patterns 13a, 13b and 13c are disposed in a space between bonding pads 12 and the corner region of the product chip 11.
FIG. 2 shows the detailed structure of one of the monitoring patterns in FIG. 1. The monitoring pattern shown therein has a specific pattern structure for monitoring the characteristics of a MOS transistor, and includes a pair of diffused regions 15, a gate electrode 14 made of polycrystalline silicon (polysilicon), and a plurality of through-holes 17 formed on the diffused region 15, which are similar to those in the memory cells. The monitoring pattern also includes pads 16 for deriving or inputting signals from and to the diffused regions 16 and the gate electrode 14.
The provision of the monitoring patterns in the product chip significantly increases the chip area for the product chip, because a large number of monitoring patterns should be provided for monitoring the characteristics of the semiconductor elements and interconnects in the product chip. For example, in a CMOS memory device, the monitoring patterns include at least two MOS monitoring patterns for monitoring nMOS and pMOS transistors, and threshold monitoring patterns for monitoring respective thresholds of transistors if there are a plurality of transistors having different thresholds. Separate monitoring patterns should be provided for the transistors in the memory cell. Moreover, other monitoring patterns should also be provided for monitoring characteristics of interconnects, such as electric resistance of polysilicon or refractive metals and through-holes, or withstand voltage or capacitance of the capacitor.
Among the proposals for suppressing the increase of the chip area accompanied by provision of the monitoring patterns, there is a proposal of "Test Element Group (TEG) Chip", wherein a large number of monitoring patterns are integrated in a single chip dedicated for monitoring ("Nikkei Micro-device", May 1995, pp. 56-58). FIG. 3 shows the proposed semiconductor wafer having TEG chips, wherein a large number of product chips 11 and a plurality of TEG chips 23 for monitoring the product chips 11 are arranged on the single wafer 21. By this proposal, the problem increase of the chip area does not arise; however, there arise other problems of complicated exposure steps for different chips, which causes reduction in the throughput of the fabrication of wafers, and a reduced yield of the chips from a single wafer.
There is another proposal in the above-mentioned publication, wherein monitoring patterns are provided on the scribe areas of the semiconductor wafer. FIG. 4 shows a partial top plan view of the proposed semiconductor wafer, wherein a plurality of monitoring patterns 13 are arranged along a stripe scribe areas 24 disposed for dicing the wafer into a plurality of product chips 11 after the completion of the monitoring. The proposed wafer solves the problem increase in the chip area of the product chips. The proposed wafer also solves the problem complicated exposure steps because the monitoring patterns 13 can be exposed concurrently with the exposure for the product chips 11. In view of these advantages, the proposed wafer is increasingly employed in the current fabrication process for the semiconductor memory device.
The proposed wafer, however, raises other problems in that dust of conductive materials is generated to degrade the yield of the product chips when a new fabrication technique is employed for the semiconductor memory devices, as detailed below.
First, the problem dust arises when a chemical-mechanical polishing (CMP) technique, such as described in "Semiconductor World", pp.99-101, Feb. 1995, is employed for planarization of the semiconductor chip. The CMP technique generally tends to expose the interconnect layers in the monitoring patterns formed on the scribe area, and raises the problem dust due to the peel-off of the conductive materials. This problem occurs especially in the structure of the DRAM, as shown in FIG. 5, wherein the memory cell area is higher than the peripheral area.
In FIG. 5, a memory cell in the memory cell area 22 includes a memory cell transistor having a pair of diffused regions 15a and 15b, or 15b and 15c, and a gate electrode 14a, or 14b, and a storage capacitor overlying the memory cell transistor and having a bottom electrode 31 and a top electrode 32. The peripheral area 20 includes a transistor having a pair of diffused regions 15d and 15e and a gate electrode 14c, which are similar to those in the memory cell area. Both the transistors in the memory cell area 22 and the peripheral area 20 have a substantially equal structure, and accordingly, the level of the memory cell area 22 is higher than the level of the peripheral area 20 because of the presence of the capacitor. In a typical 64 Mega-bit DRAM, the top electrode 32 of the storage capacitor has a thickness of 1500 to 2500 angstroms and the bottom electrode 31 has a thickness of 5000 to 8000 angstroms, which causes the difference of the level around 1 .mu.m between the memory cell area 22 and the peripheral area 20. In this configuration, it is difficult to completely planarize an insulation film 33 in both the areas 22 and 20 by the CMP technique, and accordingly, the resultant geometry depends on the levels of the underlying layers in both the areas 22 and 20.
Some of the monitoring patterns disposed in the scribe area for monitoring the characteristics of the memory cells have a level equal to the level of the memory cell. Accordingly, in the vicinity of the scribe area, monitoring patterns having a smaller space and a higher level than the peripheral area exist adjacent to the peripheral area having a larger space and a lower level. This raises difficulty in the CMP technique, and the resultant geometry of the monitoring patterns after the CMP process is generally based on the level of the peripheral area, resulting in a lower level of the monitoring patterns.
FIG. 6 schematically shows the geometry of the typical DRAM before and after the CMP process. In the drawing, the memory cells and the monitoring pattern each including transistors and a capacitor are shown by hatched boxes 10 and 18. As understood from the drawing, the top insulator film 33 after the deposition thereof has a smaller thickness in the monitoring pattern 10 compared to the memory cells 18 due to the lower level of the peripheral area. That is, the thickness of the top insulator layer 33 is generally uniform in the peripheral area and in the scribe area. Accordingly, after the CMP process, as shown by a chain line, the top electrode of the monitoring pattern tends to be exposed, which causes dust of the conductive materials to be scattered on the wafer, thereby degrading the characteristics of the memory device and thus the yield thereof.
Second, the problem dust arises in a step for removing a polyimide film if a large scale chip such as for a DRAM is fabricated by a lead on chip (LOC) technique, which is described in "Nikkei Micro-device", Feb. 1992, pp 77-84. The LOC process can save a conventional die pad for supporting the product chip by arranging an inner lead on the product chip (i.e., lead on chip), the inner lead having a function for supporting and fixing the product chip as well as an ordinary function for transmitting input/output signals to and from the chip.
FIG. 7 shows the product chip fabricated by the LOC technique before dicing of the wafer. An inner lead 36 is bonded to the product chip for supporting the product chip with an intervention of an adhesive tape 37 and a polyimide film 38 therebetween. The polyimide film 38 functions for alleviating the stress applied to the product chip from the adhesive tape 37. A passivation film 39 covers the surface of the entire product chip except for the scribe area 24. In this configuration, the polyimide film 38 as well as the passivation film 39 has been removed from the scribe area 24 in view that the polyimide film 38 and the passivation film 39 may obstruct the dicing of the wafer. In the polyimide removing step, the monitoring pattern may also be exposed in the scribe area 24. Especially, if combined with the CMP process, the polyimide removing step exposes the top electrode of the monitoring pattern, which causes the problem dust of the conductive materials.

Semiconductor memory device having a monitoring pattern


The invention is featured in that the natural language process can be made in a way that a chained functions structure expressing relationships among concepts of elements of the natural language constructing the character strings is generated, a rule table which stores in advance rules of association relationship between the chained functions structure and form of a command language which the processor system can execute is looked up, the generated chained functions structure is converted to a form which the process can be executed, and the command language are obtained as results of the analysis by incorporating the information as to the operating statuses of the processor system into the converted form. The invention enables the computer to operate in a desired mode with input of usual natural language without use of any of the formal languages usually given to the computer (special languages and command defined for the computer).

1. Field of the Invention
The present invention relates to a method and system for processing natural language in a natural language interface disposed between a computer and a human being and governed by a natural language.
2. Description of the Prior Art
A technique associated to the present invention was disclosed in an article entitled "An Inquiring System Capable of Asking Operating Procedures for a Workstation in Natural Japanese," Nikkei Electronics, No. 1985.9.9, pp. 225-243.
The technique described there was mentioned to be capable of guiding the operating procedures depending on the information display on the screen. A syntax and meaning of a Japanese question are analyzed to output an answer. The technique includes functions for correcting errors of postpositional particles and recovering omission of words with use of common senses of the workstation. It was described in the article that flow of enquiry is accumulated n a subject storage to generate an answer conceiving flow of the subject.
The previous technique mentioned above has the disadvantage that the natural language is hardly processed if questions have unsolved ambiguity or if the questions can be interpreted only when they meet conditions at a time of operation. This is because the answer is generated by looking up the information as to the flow of the questions and answers.
Also, the previous technique has the disadvantage that operating on the very object being currently handled is not taken into account, as it is to guide the operation of the computer (workstation).

Method and system for processing natural language


A wave energy converter system comprises two floats; a first being generally flat and heaving up and down in phase with passing surface waves on a body of water, and the second being elongated and heaving up and down out of phase with the passing waves. Preferably, the first float is annular with a central vertical opening therethrough, and the elongated float, with a weighted bottom end, extends vertically through the central opening of the first float. The two floats thus move out of phase with one another, thus providing a relatively large relative motion between the two floats giving rise to highly efficient energy conversion. Each float serves as a “ground” for the other; thus avoiding the need for anchoring the floats to the floor of the body of water.

This invention relates to the conversion of energy present in surface waves on large bodies of water to useful energy.
In co-pending application, Ser. No. 10/357,675, filed Feb. 4, 2003, the subject matter of which is incorporated herein by reference, there is disclosed a surface wave energy conversion system comprising two separate, but interacting components, each for capturing energy from surface waves.
A first of the system components comprises a float on the water surface which bobs up and down in response to passing waves. Such bobbing motion tends to be in phase with the passing waves, i.e., the float rises in response to a passing cresting wave.
The second component of the system comprises a submerged member dependent from the float and including a compressible fluid responsive to water pressure variations. In response to an overpassing cresting surface wave and an increase in water pressure, the compressible fluid is compressed resulting in a decreased volume and corresponding decreased buoyancy of the second component. Thus, the second component tends to sink relative to the float in out-of-phase relation with the passing waves.
Of significance is that the two components tend to move in opposite directions in response to the same passing wave. Thus, by interconnecting an energy transducer, e.g., a linear electrical generator, between the two components, energy generation is obtained.

Wave energy converter (WEC) device and system


A process for applying a protective self-adhesive film onto a coat-finished product having an object unnecessary to be protected by the protective self-adhesive film, which process comprises (1) the following steps: applying a perforated self-adhesive film (a) having a perforation onto the surface of the coating of the coat-finished product so that an area occupied by the object may be positioned within the perforation, applying a protective self-adhesive film onto the object, the perforated self-adhesive film (a) and such a part of the coating of the coat-finished product as not to be covered with the perforated self-adhesive film (a), and removing an unnecessary portion of the protective self-adhesive film over the perforation; or (2) the following steps: applying the protective self-adhesive film onto the object and a coating of the coat-finished product, cutting out such an unnecessary portion of the protective self-adhesive film as positioned over the area occupied by the object by use of a cylindrical cutting device comprising a ring-shaped cutter blade and a cylindrical pressing means, preferably further comprising a ribbon heater to heat the cutter blade to press and adhere the remaining portion of the protective self-adhesive film around the onto the coating of the coat-finished product, and removing the cut unnecessary portion of the protective self-adhesive film by suction.

(1) Field of the Invention
The present invention relates to a process for applying a protective self-adhesive film, and more particularly to a process for applying a protective self-adhesive film onto a coat-finished product.
(2) Description of the Prior Art
Transport of a coat-finished product to users, or temporary indoor or outdoor storage of the coat-finished product causes defects such as marks, stains, discoloration, contamination and the like on the surface of the coat-finished product due to influences of clouds of sand, iron powder, rain, particularly acid rain, salts, sunlight, etc. For the purpose of overcoming the above defects, a process for applying a protective self-adhesive film onto the surface of the coat-finished product to temporarily protect the surface of the coat-finished product is known in the art.
The application of the above protective self-adhesive film is carried out by a process which comprises uniformly pressing the film onto the surface of the coat-finished product such as a bonnet of an automobile by use of a roller, squeezee or the like, and cutting out an unnecessary portion of the protective self-adhesive film over an area occupied by an object unnecessary to be protected by the protective self-adhesive film, for example, a projecting portion of a washer nozzle on the bonnet of the automobile, by use of a cutter knife.
However, the above process in the art had such disadvantages that cutting out the protective self-adhesive film with the cutter knife in the application of the protective self-adhesive film may make cuts onto the coating of the coat-finished product, resulting in reducing commercial value and durability of the coating.

Process for the application of protective self-adhesive film


Herein disclosed is a logic circuit which has an input bipolar transistor for receiving an input signal at its base; variable impedance circuit having at least a first P-channel MOSFET connected between a first supply voltage and the collector of the input bipolar transistor; a second N-channel MOSFET connected between the emitter of the input bipolar transistor and a second supply voltage; an output bipolar transistor connected between the first supply voltage and the output terminal of the circuit for receiving the collector potential of the input bipolar transistor at its base; and a third, pull-down MOSFET connected between the output terminal and the second or third supply voltage.

The present invention relates to a logic circuit and, more particularly, to a technology which is especially effective if used in a bipolar CMOS (which will be shortly referred to as the "Bi.multidot.CMOS") to be packaged in a high speed logic integrated circuit device or the like constituting a high speed computer.
There is a Bi.multidot.CMOS logic circuit which is composed of a pair of output bipolar transistors (as will be shortly referred to as the "transistors") in the shape of a totem pole and a CMOS (i.e., Complementary MOS) circuit for imparting a predetermined logic condition to those output transistors. There is also an ECL (i.e., Emitter Coupled Logic) circuit which is constructed of: a current switch circuit composed basically of differential transistors; and an emitter-follower circuit for transmitting the non-inverted and inverted output signal of the current switch circuit. There is further a high speed logic integrated circuit device which is constructed basically of the Bi.multidot.CMOS logic circuit or the ECL circuit, which may be combined to provide a high speed computer.
The Bi.multidot.CMOS logic circuit is disclosed, for example, in Japanese Patent Laid-Open No. 11034/1984 (corresponding to U.S. Pat. No. 4,890,017). On the other hand, the ECL circuit is disclosed, for example, in FIG. 1, on pp. 1301 to 1306 of "A 23-ps/2.1-mW ECL Gate with an AC-Coupled Active Pull-Down Emitter-Follower Stage" by K. Y. Toh et al. of VOL. 24, No. 5 of IEEE JOURNAL OF SOLID-STATE CIRCUITS issued in October, 1989.
The aforementioned high speed logic integrated circuit device or the like has its scale enlarged so that the circuit components of the logic circuit have a tendency to be further miniaturized and highly integrated. As a result, a problem arises in the degradation of reliability by hot carriers, and the absolute value of the supply voltage has to be reduced. However, this reduction of the absolute value of the supply voltage cannot be effected at will in the Bi.multidot.CMOS logic circuit of the prior art partly because the propagation delay time is longer than that of the ordinary CMOS logic circuit and partly because the amplitude of an output signal is compressed to an extent of the base-emitter voltage of the output transistors. In the ECL circuit of the prior art, moreover, the differential transistors are saturated to block the high speed operations if the absolute value of the supply voltage is about 3 V or less.
In order to cope with those difficulties, there is either an NTL (i.e., Non-Threshold Logic) circuit including a phase divider (or phase splitter) and an output emitter-follower circuit for transmitting an inverted output signal of the phase divider, or the so-called "SPL (i.e., Super Push-pull Logic) circuit (as should be referred to U.S. Pat. No. 4,999,520)", in which the output unit of the NTL circuit is replaced by an active pull-down circuit. In the NTL circuit of the prior art, however, the low power consumption of the high speed logic integrated circuit device is prevented because an operating current is steadily caused to flow in the phase divider and the output emitter-follower circuit. In the SPL circuit, on the other hand, the chip area of the high speed logic integrated circuit device is augmented because of the many circuit elements present. It is also found in each of the foregoing various logic circuits that the high speed logic integrated circuit device and accordingly the high speed computer cannot be given an efficient system structure because the logical functions to be realized are restricted.
Incidentally, an improved SPL circuit was filed as U.S. patent application Ser. No. 669,642 on Mar. 14, 1991 by Usami, one of the present inventors, and now abandoned in favor of the following continuing applications: U.S. patent application Ser. No. 929,917, filed Aug. 17, 1992 as a continuation application thereof (now U.S. Pat. No. 5,237,214); and U.S. patent application Ser. No. 739,195, filed Aug. 1, 1991 as a continuation-in-part application thereof (now U.S. Pat. No. 5,206,546).

High speed BI CMOS logic circuit and a semiconductor integrated circuit device using same


There is disclosed a liquid crystal display panel that is adaptive for simplifying its process and reducing its cost by performing a patterning process without using a photolithography process, and a fabricating method thereof.

1. Field of the Invention
The present invention relates to a liquid crystal display panel and more particularly to a liquid crystal display panel that is adaptive for patterning a color filter of the liquid crystal display panel without using a photolithography process, and a fabricating method thereof.
2. Description of the Related Art
FIG. 1 is a sectional diagram representing a liquid crystal display panel of the prior art.
The liquid crystal display panel shown in FIG. 1 includes an upper array substrate having a black matrix 54, a color filter 56, an over coat layer 57, a common electrode 68, a column spacer 63 and an upper alignment film 58 which are sequentially formed on an upper substrate 52; a lower array substrate having a TFT, a pixel electrode 66 and a lower alignment film 88 which are formed on a lower substrate 82; and a liquid crystal (not shown) injected into an inner space between the upper array substrate and the lower array substrate.
In the upper array substrate, the black matrix 54 is formed on the upper substrate 52 corresponding to a TFT area of a lower plate and an area of gate lines and data lines (not shown), and there is provided a cell area where a color filter 56 is formed. The black matrix 54 prevents light leakage and absorbs an external light, thereby acting to increase contrast. The color filter 56 is formed at the cell area divided by the black matrix 54. The color filter 56 is formed by R, G and B to realize R, G and B colors. The over coat layer 57 is formed to cover the color filter to flatten the upper substrate 52. A common voltage is supplied to the common electrode 68 to control the movement of liquid crystal. The column spacer 63 acts to keep a cell gap between the upper substrate 52 and the lower substrate 82. On the other hand, it is possible that there is no over coat layer 57 in a twisted nematic TN mode where a vertical direction electric field is used, and the common electrode 68 might be formed in the lower array substrate in case of an In-Plane Switch IPS mode where a horizontal direction electric field is used.
In the lower array substrate, the TFT includes a gate electrode 59 formed on the lower substrate 82 along with a gate line (not shown); semiconductor layers 97, 64 overlapping the gate electrode 59 with a gate insulating film therebetween; and source/drain electrodes 90, 92 formed together with a data line (not shown) with the semiconductor layers 97, 64 therebetween. The TFT 37 supplies a pixel signal from the data line to the pixel electrode 66 in response to a scan signal from the gate line.
The pixel electrode 66 is in contact with a drain electrode 92 of the TFT with a protective film 100 therebetween, wherein the protective film is of a transparent conductive material with high light transmissivity. Upper/lower alignment films 58, 88 for liquid crystal alignment are formed by performing a rubbing process after spreading an alignment material such as polyimide.
FIGS. 2A to 2F are sectional diagrams representing a fabricating method of an upper array substrate of the prior art step by step.
Firstly, after an opaque metal, e.g., Chrome Cr, is deposited on the upper substrate 52, the opaque material is patterned by a photolithography using a first mask and an etching process, thereby forming the black matrix 54 as shown in FIG. 2A. Herein, the opaque resin can be used as a black matrix material.
After a red resin is deposited on the upper substrate where the black matrix 54 is formed, the red resin is patterned by photolithography using a second mask and the etching process, thereby forming a red color filter R as shown in FIG. 2B.
After a green resin is deposited on the upper substrate where the red color filter R is formed, the green resin G is patterned by photolithography using a third mask and the etching process, thereby forming a green color filter G as shown in FIG. 2C. After a blue resin is deposited on the upper substrate 52 where the green color filter G is formed, the blue resin is patterned by photolithography using a fourth mask and the etching process, thereby forming a blue color filter B as shown in FIG. 2D. Hereby, the red, green, blue color filters 56 are formed.
After a transparent conductive material is deposited on the upper substrate 52 where the color filter 56 is formed, by a deposition method such as sputtering, and then it is patterned, thereby forming the common electrode 68 as shown in FIG. 2E. On the other hand, the over coat layer 57 is located between the common electrode 68 and the color filter 57 in case of the IPS mode.
A spacer material is patterned on the upper substrate 52 where the common electrode 68 is formed, by the photolithography using a fifth mask and an etching process, thereby forming a column spacer 63 as shown in FIG. 2F.
Thus, in order to form the upper array substrate of the liquid crystal display panel of the prior art, at least 5 mask processes are required. Each of the mask processes includes the photolithography which is a series of photography processes having a spread of photo-resist, a mask alignment, an exposure and a development. In such a photolithography process, its required time for process is long, the waste of the photo-resist and a developing solution that develops the photo-resist pattern is big, and expensive equipments such as exposure equipment are required. As a result, there is a problem that the fabricating process is complicated and a fabricating cost of the liquid crystal display panel is increased.

Method of fabricating an LCD, including steps of forming a color filter by pressing with a soft mold

Abstract: A liquid crystal display panel according to an embodiment of the present invention includes a color filter which is formed by a press forming by a soft mold; and a black matrix to divide the color filter by the cell.


A non-corrosive cleaning composition for removing residues from a substrate. The composition comprises: (a) water; (b) at least one hydroxylammonium compound; (c) at least one basic compound, preferably selected from the group consisting of amines and quaternary ammonium hydroxides; (d) at least one organic carboxylic acid; and (e) optionally, a polyhydric compound. The pH of the composition is preferably between about 2 to about 6.

In the manufacture of microcircuits, positive photoresists are used as an intermediate mask for transferring an original mask pattern of a reticule onto wafer substrates by means of a series of photolithography and plasma etching steps. One of the final steps in the microcircuit manufacturing process is the removal of the patterned photoresist films from the substrates. In general, this step is affected by one of two methods. One method involves a wet stripping step in which the photoresist-covered substrate is brought into contact with a photoresist stripper solution that consists primarily of an organic solvent and an amine. However, stripper solutions cannot completely and reliably remove the photoresist films, especially if the photoresist films have been exposed to UV radiation and plasma treatments during fabrication. Some photoresist films become highly crosslinked by such treatments and are more difficult to dissolve in the stripper solution. In addition, the chemicals used in these conventional wet stripping methods are sometimes ineffective for removing inorganic residual materials formed during the plasma etching of metal or oxide layers with halogen-containing gases.
An alternative method of removing a photoresist film involves exposing a photoresist-coated wafer to oxygen-based plasma in order to burn the resist film from the substrate surface in a process known as plasma ashing. Plasma ashing has become more popular in the microcircuit manufacturing process because it is carried out in a vacuum chamber and, hence, is expected to be less susceptible to airborne particulate or metallic contamination. However, plasma ashing is also not fully effective in removing the plasma etching by-products noted above. Instead, removal of these plasma etching by-products must be accomplished by subsequently exposing the photoresist film to certain cleaning solutions. Several commercial products are now available to clean the plasma etching by-products left by plasma etching followed by plasma ashing. For example, EKC 265, available from EKC Technology, Inc., is a post etching cleaning solution composed of water, alkanolamine, catechol and hydroxylamine. Such a composition is disclosed in U.S. Pat. No. 5,279,771 to Lee. ACT 935, available from Ashland Chemical, is another post etching cleaning solution and is composed of water, alkanolamine and hydroxylamine. Such a composition is disclosed in U.S. Pat. No. 5,419,779 to Ward. In both cases, hydroxylamine is used as a corrosion inhibitor. ELM C-30, available from Mitsubishi Gas Chemical, is composed of water, N,N-dimethylformamide, a fluorine compound, organic carboxylate, and a sugar alcohol, wherein the sugar alcohol acts as a corrosion inhibitor. Such a composition is disclosed in U.S. Pat. No. 5,630,904 to Aoyama et al.
These commercial products can effectively dissolve plasma etching residues, however, they can also attack the metallic and oxide layers deposited patternwise on the substrate. This is because the pH of EKC 265 and ACT 935 is above 11 and ELM C-30 contains a fluorine compound. The corrosion inhibitors used in these products are not completely effective in stopping corrosion, because metal layers such as copper, aluminum or aluminum alloys (e.g., Al—Cu—Si), and the like are particularly corrosion sensitive. Furthermore, while the addition of a suitable corrosion inhibitor is essential to prevent corrosion of the substrate metal layers, some corrosion inhibitors tend to inhibit the removal of the plasma etching residue and/or form an insoluble film deposited on the metal substrate surface. Therefore, the corrosion inhibitor must be carefully selected.
It is also difficult to balance effective plasma etching residue removal over corrosion inhibition because chemical compositions of the plasma etching residues are generally similar to those of the metal layers or oxide layers on the substrate. The alkanolamines used in prior art cleaning compositions were oftentimes found to attack the plasma etching residue and the substrate metal layers in the presence of water. Accordingly, there remains a need for a composition that can selectively and effectively remove plasma etching residues without the unwanted attack on the metallic and oxide layers, which causes a loss of metal layers.
Several other patents in the photoresist stripper/cleaner application field exist as follows, although none of them disclose the use of the compositions of the present invention:
Japanese Patent Application No. 7-028254, assigned to Kanto Kagaku, discloses a non-corrosive resist removal liquid comprising a sugar alcohol, an alcohol amine, water, and a quaternary ammonium hydroxide.
PCT Published Patent Application No. WO 88-05813 teaches a positive or negative photoresist stripper containing butyrolactone or caprolactone, quaternary ammonium hydroxide compound, and optionally, a nonionic surfactant.
U.S. Pat. No. 4,239,661 to Muraoka et al. discloses a surface-treating agent comprising an aqueous solution of 0.01% to 20% trialkyl (hydroxyalkyl) ammonium hydroxide. This agent is useful in removing organic and inorganic contaminants deposited on the surface of intermediate semiconductor products.
U.S. Pat. No. 4,904,571 to Miyashita et al. teaches printed circuit board photoresist stripper composition containing a solvent (e.g., water, alcohols, ethers, ketones, and the like), an alkaline compound dissolved in the solvent, including quaternary ammonium hydroxide, and a borohydride compound dissolved in the solvent.
U.S. Pat. No. 5,091,103 to Dean et al. teaches a positive photoresist stripping composition containing: (A) N-alkyl-2-pyrrolidone; (B) 1,2-propanediol; and (C) tetraalkylammonium hydroxide.
U.S. Pat. No. 5,139,607 to Ward et al. teaches positive and negative photoresist stripping composition containing: (A) tetrahydrofurfuryl alcohol; (B) a polyhydric alcohol (e.g., ethylene glycol or propylene glycol); (C) the reaction product of furfuryl alcohol and an alkylene oxide; (D) a water-soluble Bronstead base type hydroxide compound (e.g., alkali metal hydroxide, ammonium hydroxide and tetramethyl ammonium hydroxide); and (E) water. Optionally, the composition may also contain up to 1% of a nonionic surfactant.
U.S. Pat. No. 5,174,816 to Aoyama et al. discloses a composition for removing chlorine remaining on the surface of an aluminum line pattern substrate after dry etching, which composition comprises an aqueous solution containing 0.01 to 15% by weight of a quaternary ammonium hydroxide, such as trimethyl (2-hydroxyethyl) ammonium hydroxide, and 0.1 to 20% by weight of sugar or sugar alcohol, such as xylitol, mannose, glucose and the like.
Other compositions used to strip photoresist include a solution of H2SO4 and an oxidizing agent such as H2O2 that oxidizes, and thus decomposes organic photoresists. However, solutions containing strong acids and oxidizing agents are hazardous to handle, must be applied at elevated temperatures, and require a sufficient amount of hot deionized (DI) water after stripping is performed. Also, such solutions have a short active life as the oxidizing agent readily decomposes. Thus, it is necessary to frequently replenish the solutions. The need for solution replenishment renders the process both hazardous and economically inefficient. In addition, these types of conventional acid-based chemistries are too aggressive on the metal substrates.
Therefore, there remains a need for a new type of cleaning composition for removing plasma etch residues from substrates. Additionally, there remains a need for such a cleaning composition that does not deleteriously affect the substrate. Further, there remains a need for such a cleaning composition that is aqueous-based, non-hazardous and will not harm the environment.

Non-corrosive cleaning composition for removing plasma etching residues

Fujifilm Electronic Materials U.S.A., Inc.


An archery bow/crossbow press and method provides operation to various bow designs including bows with past parallel limbs or having limbs with sharp curvatures using collectively connected bow limb supports to engage the outer face of a bow limb for compression; each bow limb support configured with at least one upper and at least one lower support arm wherein each support arm comprises bow limb contact areas that may include various shapes adaptable to engage a bow limb or limb components; each support arm may be positioned against a bow limb independently or collectively with each other; and, when the bow limb supports are positioned collectively on the bow they may be the sole contact of the bow press during the pressing operation.

Archery bow presses are widely used in the archery trade for stringing, tuning, and general maintenance of different types of bows including compound bows, traditional bows and crossbows. The compound bow most commonly uses a levering system of cables and pulleys (cams) to bend a set of stiff limbs attached to a central mount (riser), and is usually left strung with the cables and cams holding the limbs under high tension. The traditional style of bow is usually referred to as a bow with no cams, where the limbs are strung with the bow string secured directly to the limbs. The crossbow is basically a very stiff limbed bow, with or without cams, attached crosswise on a stock having a trigger mechanism for holding the bow in a cocked position.
Through the years bow designs have been changing to keep up with the market's demand for faster and quieter shooting bows, resulting in a wide variety of bows on the market today with varying components and limb styles, including bows that have two limbs instead of one limb attached on either end of a riser, known as a quad limb bow. Many bows have short, swept back more parallel limbs, known as parallel limb bows. Other bows may have thinner limbs that are held under higher tension (preloaded) by the cables and cams, so as to bend the limbs back in a radius curvature toward the opposite limb, past parallel, known as preloaded past parallel limb bows. There are even bows with reverse limbs, where the limbs project out from the riser or a stock, away from the archer. Any one of these different bow designs may include various components attached to the limbs, for example axle hubs (for the cams) mounted to the outside curvature of the limbs, or string suppressors near the tips of the limbs for dampening sound and vibration.
These vast differences in bow designs have proven problematic for many of today's bow presses, which lack a quick and effective means to safely, securely, and effectively press these different bow designs. This is mostly due to the limited number of bow limb contacts readily accessible on the presses, or the inability of the bow limb contacts to effectively support or hold the bow limb during the pressing operation. Also, many of today's bow presses are structurally weak or lack the geometric makeup to effectively press bows with short stiff limbs, such as crossbows.
One of the newer designs of bows and growing very popular are the bows with preloaded past parallel limbs. However, applying force to pre-loaded past parallel (PPL) limbs in order to relax the tension on the strings and cables has proven to be a very cumbersome and sometimes a dangerous practice with current bow presses. PPL bows have limbs with preloaded dynamics and curvatures that have a tendency to distort or flatten out at the bow limb contacts when force is applied to the limbs, resulting in excess stress to the bow limbs and/or to other components of the bow. The bow limb contacts also tend to slide on the bow's limbs, and can possibly slide off the limbs and allow the bow to slip out of the press. This could potentially lead to injury to the operator or damage to the bow.
Bow press manufacturers have tried to remedy the problems of PPL bows slipping out of their presses and excess stress applied to these bows when pressing, with little success. Attempts include techniques such as adding stops or holding devises to their presses to secure a bow by the riser, or clamping a bow limb directly to the press's bow limb contacts, or backing off the bow's limb bolts multiple turns in order to reduce the curvature of the bows limbs. These remedies are not ideal as these fixes may result in one or more of the following: more set up time; a higher level of skill required in setting up the press; a bow limb flexing undesirably; undue stress on various components of the bow; or the bow still losing contact with the bow press.
Accordingly there is a need in the archery industry for a bow/crossbow press that is powerful, diverse, and can safely press a wide variety of bows, including PPL bows with past parallel limbs or having limbs with sharp curvatures; that has multiple bow limb contacts readily accessible on the press, with the ability to effectively support or hold the limbs of a bow during the pressing operation without the bow limb distorting or sliding off the bow limb contacts; and that is structured to safely apply the pressing forces needed for bows having stiff limbs.

Archery bow press and method for compressing an archery bow using collectively connected bow limb supports


A bale carrier having first and second rows of bale cradles pivotally mounted thereon and which are moveable between bale supporting positions and bale dumping positions. A plurality of first safety latches are mounted on the carrier adjacent one of the rows of bale cradles. A plurality of second safety latches are mounted on the carrier adjacent the second row of bale cradles. A plurality of third and fourth safety latches are mounted on the carrier adjacent the first and second rows of bale cradles. The first safety latches are operatively interconnected so that all of the first safety latches may be simultaneously moved together between latched and unlatched positions. The second safety latches are also operatively interconnected so that all of the second safety latches may be simultaneously moved together between their latched and unlatched positions. In order to dump a hay bale from one of the cradles on the first row, the first safety latches are moved to their unlatched position and the appropriate third latch is moved to its unlatched position so that that particular bale cradle may be moved to its dumping position. When it is desired to dump a bale from the second row, the second safety latches are moved to their unlatched positions with the appropriate fourth safety latch being moved to its unlatched position so that the hay bale on that particular bale cradle may be dumped therefrom.

Many types of apparatuses have been previously provided for carrying or transporting large round hay bales. In the co-pending application, an improved bale carrier was provided. In the bale carrier of the co-pending application, a bale carrier is disclosed which has the capability of dumping bales from either side of the wheeled frame means. Although the bale carrier of the co-pending application represented a significant advance in the art, only a single row of bales could be carried on the bale carrier since it was desirable to dump the bales from either side of the wheeled frame means.


The present invention relates to a fire extinguishing assembly for transforming a liquid into a liquid mist. The assembly includes an adapter section (3a, 14a) having at least one liquid inlet (3b, 14b) and a nipple section (6a, 9a) that connects to the adapter section. The nipple section includes a plurality of bores (6c, 9c) extending between an internal duct (12g) that connects to the liquid inlet (3b, 14b), and outlets on an outside of the nipple section (6a, 9a). The bores (6c, 9c) are located around the nipple section (6a, 9a). A deflecting surface (3d, 12d) for guiding the liquid is positioned around the outlets of the bores (6c, 9c). The deflecting surface (3d, 12d) includes recesses extending in a direction substantially from the nipple section (6a, 9a) to a circumference of the deflecting surface (3d, 12d). The bores (6c, 9c) and deflecting surface (3d, 12d) have a mutual positioning so that straight liquid jets flowing through the bores (6c, 9c) will hit the deflecting surface (3d, 12d) with at least a bevel angle α.

In many installations it is common to have more or less permanent piping with nozzles ejecting water or water mist. Examples of such installations include buildings, ships, offshore installations, tunnels, mines, or generally any facility or location at which it is desired to be able to put out or prevent fire. Sprinkler systems have been used in such installations for a long time.
In many situations, the use of water mist is preferable to sprinkler systems from which water is discharged in the form of larger drops, because water mist often provides for a more efficient fire-extinguishing, requires less water, causes less water damages, may be used in connection with fire in liquids and gases, and has a lesser negative impact on electric installations. Water mist systems may be used anywhere as a replacement for sprinkler systems. In connection with permanently installed fire extinguishing systems it is common for the fire-extinguishing assemblies to be under a certain water pressure. These characteristics are common for prior art sprinkler systems and fire extinguishing assemblies. Heat-sensitive glass bulbs are commonly used in permanently installed fire extinguishing systems.
However, water-based fire extinguishing assemblies suffer from certain associated disadvantages. Such assemblies are often manufactured with small nozzle openings which easily become clogged by contaminations in the water, and therefore normally a screening or water filtering system is required. Also, such assemblies typically have been relatively weighty, which is undesirable especially on vessels and floating structures as a large number of assemblies are required which combines to increase the overall weight significantly. Moreover, many of these assemblies also require a high inlet pressure in order to function properly, which increases the complexity, the necessary rating of the piping, the costs, as well as reduces the reliability particularly in case of fire. In addition, another problem is related to seals of known assemblies, and poor seals may result in leaks disrupting the mist pattern. Many assemblies also produce a relatively poor spreading of the mist, and a single generator, therefore, may only be used in rooms of a relatively limited size.
From NO 314835 an arrangement is disclosed for providing small water droplets, for use in particular for water-based fire-extinguishment. The arrangement is adapted for pivoting around its own axis, and is constituted by a hollow shaft. At least two circular water distribution disks are attached to the one end of the shaft by way of bolts. The water distribution disks are arranged in a spaced relation by means of spacers on the bolts. Each water distribution disk has an open center section, an inner horizontal annular surface, a steeply descending section, a less steeply descending section, as well as a narrow outer horizontal surface. A water supply conduit is provided in the hollow shaft. The conduit connects to a water supply at a one end and is closed and protrudes to the lowermost water distribution disk at the other end. The conduit comprises at least a water outlet at the levels in between two by two water distribution disks.

Fire extinguishing assembly for transforming a liquid to a liquid mist


A combined radiative and convective rework system is provided for repair, replacement, removal and rework of an electronic component on a printed circuit board. The system includes a guide for guiding heat-inducing radiation and heated gas towards at least one lead of the electronic component, and for preventing the heat-inducing radiation from damaging the body of the component. A heater, including a source of infrared radiation, provides the heat-inducing radiation and the heated gas. In one embodiment, the guide includes a single funnel cooperative with apparatus for reducing component body heating. In second and third embodiments, the guide includes two concentric funnels which form a volume which is traversed by the heat-inducing radiation and heated gas, and which provide at least one narrow region of heat energy to at least one of the leads, but not directly to the component body. In another embodiment, a plurality of removable guides are provided, each being specialized for use with a variety of different component types and sizes. The system also includes a viewing system for viewing the component along a central axis of symmetry of the guide.

It is frequently necessary to place, remove, or repair an electronic surface mounted component on a printed circuit board (PCB). Electronic components are typically bonded to the PCB with a solder material that has a melting point above the maximum operating temperature of the component, but sufficiently low so that only a small quantity of thermal energy is needed to melt the material. Thermal energy can be transferred via conduction, such as by a soldering iron; via convection, by means of forced hot air; or via radiation, as provided by an infrared lamp, for example.
It is known to apply a stream of hot air or other chemically inert gas to provide localized convective heating of the leads of a component. For example, a typical surface mounted component is square or rectangular, with leads that project outwardly from each of its four sides. If the component is square, a round region of hot air or hot gas centered on the component must be large enough to include the leads so that they receive direct exposure to the hot air. However, if the region is large enough to heat all of the leads, then the component is exposed to an excess of thermal energy, the excess energy potentially damaging the component. Also, the hot air undesirably heats up surrounding areas of the PCB and neighboring components. This not only may damage adjacent components but also may ultimately result in warpage or delamination of the PCB. An analogous problem arises when a round region of infrared illumination impinges upon all the leads of a component; the region necessarily includes the component itself, possibly causing damage to the component. Also, adjacent components can be damaged as well due to over heating and possible melting of their solder joints.
It is also known to supplement the above infrared heating with forced hot air or hot gas directed towards the location of the component from a position under the PCB to provide preliminary conductive heating to the component. However, since surface mounted components are commonly found on both sides of a PCB, this method of heating can result in overheating and damage to the components exposed to the forced hot air.

Combined radiative and convective rework system


A vertical/horizontal convertible suspending reduction furnace, comprises: a metal furnace body (5) of the reduction furnace, a reduction tank (13), a burner (2) and a suspension device. The metal furnace body (5) of the reduction furnace, which is connected with a sealing head (3) at one end, and connected with a fixed flange (20) of the reduction tank at the other end, is distributed with reduction tanks (13) inside uniformly. Burners (2) are provided symmetrically at the circumference of the metal furnace body (5), and a universal hoisting ring (4) is provided at its central point or off-central point. A steel rope (12), both ends of which are obliquely pulled on the suspension device, is hanged on the universal hoisting ring (4).

The traditional process of refining magnesium adopts the Pidgeon method. The method uses a horizontal furnace. The furnace body is laid on the base with a refractory brick. A plurality of reduction tanks are laid and distributed in the furnace. The reduction tank is filled with reactant pellets. Coal or oil is taken as fuel. A manual feeding and unloading method is adopted for combustion and heating. Firstly, the reduction tank is heated with radiant heat of a reverberatory furnace outside of the reduction tank; secondly, the heat is radiated and transmitted to the reactant pellets by the reduction tank; finally, the heat is transmitted by the reactant pellets through a mutual relay method. It is a peripheral heating.
It has been proved that: as to the combustion and heating method that the refractory brick is laid and forms a big hearth, as there are a big space in the hearth, big transmitting radius of heat radiation and a blind angle of high-temperature convection flue gas, there is bad temperature uniformity, and the reduction tank is easy to be overheated, generates thermal creep, is deformed and is scrapped. Furthermore, the feeds shall be manually loaded and unloaded during each reduction cycle, and the feeding and unloading feeds may not be mechanized and automated. Therefore, the old-fashioned furnace laid with the refractory brick has the disadvantages of high labor intensity, high energy consumption, low productivity, low reduction rate, and short service life of the reduction tank. The furnace body is laid with the refractory brick. It is generally maintained every about three months and carried out with big maintenance and replacement every about one year. Therefore, the service life of the furnace body is short.

Vertical/horizontal convertible suspending reduction furnace


Trading cards consist of a single rule card and a plurality of character cards. The rule card is formed with a data recording area on its front surface. The data recording area of the rule card is mechanically readably recorded with rule program data determining a rule of an interactive game. Each character card is formed with a data recording area on its front surface. The data recording area of the character card is mechanically readably recorded with parameter data. An electronic game machine is loaded with a cartridge, and on the electronic game machine, the interactive game according to the rule program data read from the rule card and the parameter data read from the character card is executed on the basis of a game program of the cartridge.

1. Field of the Invention
The illustrative embodiments relate to trading cards capable of interacting with an electronic game machine and a game system utilizing the same. More specifically, the illustrative embodiments relate to trading cards including a plurality of character cards and at least one rule card, and a game system capable of implementing a game wherein the trading cards and the electronic game machine interact with each other (hereinafter, "interactive game").
2. Description of the Prior Art
Conventionally, Japanese Patent Publication No. 5 (1993)-30475 discloses a card-game toy using an electronic game machine and barcode-recorded cards by combining them. This card-game toy is called BARCODE BATTLER as a product name. This card-game toy utilizes numeric data recorded as barcodes on the cards, so that the cards used by an offensive player are allowed to battle against the cards used by a defensive player, whereby it is possible to compete in superiority or inferiority in barcode-recorded numeric data. The card used in the card-game toy has barcode (so-called one-dimensional barcode) data configured by a combination of two kinds of bars different in thickness arranged in a predetermined number in a reading direction (horizontal direction). The barcode is optically read out and used for the electronic game.
However, in the conventional card-game toy, since competition utilizes the data recorded on the card only and the amount of data recorded on the barcode is insufficient, a battle game only is possible between an offensive and a defensive player. The electronic game is liable to be monotonous and interest will be lost in the game.
Furthermore, since a conventional game card is only recorded with data for a battle game, even if it the cards comprise a character figure depiction, etc., willingness to collect the cards is not enhanced, and therefore, it becomes difficult to promote the sales of the cards.
On the other hand, although not compatible with electronic games, conventionally, trading cards are widely known. However, the conventional trading cards are for performing a card game utilizing only the cards, and common figures are depicted on the rear surfaces of a set of the trading cards, and individual characters are depicted on the front surfaces of the individual trading cards. Accordingly, the conventional trading cards do not allow the player to play the electronic game and also have a small character figure (one half or smaller of a surface area of a card), thus not enhancing player eagerness to collect.
Furthermore, in a conventional electronic game machine such as a portable game machine, a television game machine, etc., a detachable game information storage medium such as ROM, cartridge, CD-ROM and etc. is utilized, and by exchanging the game information storage medium, a content of a game can be changed. In addition, a game system of a server system can be utilized. This system is capable of playing a game by downloading game data from the server, so as to store the data into an internal memory of a television game machine or the cellular phone, and charging the user.
However, in the conventional electronic game machine and the server system, it is impossible to change the content of the game, except by exchange of the game information storage medium or download of another game. Because the cost of a new game information storage medium or the download of the game information is high, it is difficult to provide various games at low cost.

Trading cards interactive with electronic game machine and game system