A network host device is enabled to initiate providing of network communication configuration information for a network to at least one network-enabled device for establishing a communication session via the network. It is determined when a last communication session is terminated of a last one of the at least one network-enable device. In response to determining when the last communication session is terminated, the network host device is disabled from providing the network communication configuration information. In response to determining when the last communication session is terminated, the network communication configuration information for the network is automatically changed.

Users of network-enabled devices often require network access to communicate and exchange data with other network-enabled devices, network resources, and/or the Internet. Network-enabled devices include computers, mobile phones, and personal digital assistants (PDAs). A network host device can establish a communication session between a network and a network-enabled device to provide connectivity for the network-enabled device. Network host devices include wireless access points (WAPs), wireless network base stations, switches, and hubs.
Typically, access to a network via a network host device requires that a network-enabled device provide network communication configuration information to the network host device. Examples of network communication configuration information include a service set identifier (SSID) and network keys. The network communication configuration information must be distributed to the network host device or to a user of the network host device in order for the user to be able to access the network. The distribution of communication configuration information should be controlled because the information may be readily passed to unauthorized network-enabled devices. Therefore, it is desirable to provide secure techniques for handling network communication configuration information.
One technique for providing secure network communication configuration information involves manually entering changed configuration information after access by guest network-enabled devices is terminated. This technique requires that an operator manually change the configuration information. Thus, this technique is subject to human error because an operator must remember to manually change the configuration information after access for a guest terminates.
Another technique for providing secure network communication configuration information involves providing instructions to a network host device and a network-enabled device to enter a configuration mode. After providing the indicators, the network host device and network-enabled device attempt to communicate using an unsecure connection. If the connection is successful, the network host device generates an SSID and network keys and communicates configuration information including the SSID and the network keys to the network-enabled device. The network host device and network-enabled device may reboot and connect using the communicated configuration information.
This technique requires that an operator be in close proximity to the device to manually press a reset button to change the configuration information. Thus, this technique is subject to human error because an operator must remember to manually change the configuration information after a network access for a guest is terminated.
Accordingly, in light of the above described difficulties and needs associated with existing techniques for changing network communication configuration information, there exists a need for improved methods, systems, and computer program products for automatically changing network communication configuration information when a communication session is terminated.

Methods, systems, and computer program products for automatically changing network communication configuration information when a communication session is terminated


A micro-needle roller (MNR) infusion system for transdermal delivery of active agents, skin-care products, and other topical formulations is described herein. The infusion system of the instant invention comprises a needle roller assembly with 0.25 mm needles enclosed in a housing with a vacuum line and a disposable cartridge having the active agent, the skin-care product or the topical formulation. The vacuum delivers the fluid and ensures that the skin is being pulled against the needle wheel surface to ensure that penetration of the needles is complete into the skin, simultaneously the fluid is flowing to the wheel and to skin as it rolls along with the outer housing of the tip cap assembly being occluded to the skin surface.

Without limiting the scope of the invention, its background is described in connection with the microneedle arrays, methods for transdermal drug delivery and in general to devices for the administration of active agents to patients through the skin.
U.S. Pat. No. 7,658,728 (Yuzhakov, 2010) discloses microneedle arrays and drug delivery devices for transdermally delivering a drug formulation to a patient. The microneedle array device includes a substantially planar substrate having an array of apertures; and a plurality of microneedles projecting at angle from the planar substrate, the microneedles having a base portion integrally connected to the substrate, a tip end portion distal to the base portion, and body portion therebetween, wherein each microneedle has at least one channel extending substantially from the base portion through at least a part of the body portion, the channel being open along at least part of the body portion and in fluid communication with at least one of the apertures in the substrate.
U.S. Patent Application No. 20080140049 (Kirby, 2008) describes a device for transport of material across or into a biological barrier, the device includes a puncturing projection associated with a first portion of a substrate, the first portion of the substrate being movable between a first substrate position in which, in use, the puncturing projection is in puncturing contact with the biological barrier so as to form a flow path for said material across or into said biological barrier and a second substrate position in which, in use, the puncturing projection is at least partially retracted from the first position, wherein the substrate is resiliently deformable or displaceable from the first to the second substrate position by a biasing device associated with the substrate.
U.S. Patent Application No. 20100042050 (Chowdhury, 2010) discloses a drug delivery device that delivers pharmacologically active substances transdermally using microneedles arranged on a belt mounted rotatably about a plurality of rollers, the microneedles having an associated drug reservoir mounted on the belt which is compressed when the needles and belt are brought into contact with the skin.
Patent Application WO/2004/082469 (Karasiuk, 2004) relates to a device, a system employing the device and method of performing skin treatment are provided for skin treatment. The device of the Karasiuk invention includes a vacuum head base defining a chamber therein and having a substantially smooth treatment tip attached and extending from an end thereof or integral therewith. The tip has at least one central opening that is open to the chamber, and is adapted to contact the skin and traverse the skin in a substantially non-abrasive manner. A vacuum access opening is provided through a side wall of the vacuum head base and adapted to connect with a source of vacuum. A tissue stop member is located within the chamber. It may have an abrasive surface for exfoliating skin cells, or a smoother surface for traversing the skin without substantial abrasion.

Microneedle roller (MNR) infusion system


Conductive polymeric particles can be formed by mixing a monomer, carbon black and a block copolymer, wherein the block copolymer contains an A block that is miscible with said monomer and a B block that anchors to the surface of the carbon black, such as polystyrene or a derivative of polystyrene. A polymerization initiator is added to the mixture and bulk polymerization is effected until about 5 to about 30 weight percent of the monomer has been polymerized. This partially polymerized product is then dispersed in water and further polymerized.

This invention is generally directed to conductive particles and processes for the preparation thereof. More specifically, the present invention relates to conductive particles containing a polymer matrix and a carbon black dispersion, wherein the carbon black is evenly distributed throughout the polymer matrix using a block copolymer that contains a polymer block that is miscible with the polymer matrix and a second block that anchors to the surface of the carbon black.
In electrostatographic imaging and related development processes, images are developed using a developer generally comprising colored toner particles and carrier particles. Carrier cores generally comprise metals, which are conductive or semiconductive materials. Polymeric materials are generally used to coat the surface of the metals and are usually insulating. Therefore, carrier particles coated completely with polymer or a mixture of polymers can lose their conductivity and become insulating. Although this is desired for some applications, other applications require the carriers to have specific conductivity properties. Conductive magnetic brush development systems, for example, require carrier particles that are conductive. Since the carrier polymer coating can also control the triboelectric charging properties of the carrier, a conductive carrier coating is needed to design carriers with the desired conductivity and triboelectrical properties. However, traditional conductive polymers are very costly, and are not suitable for preparing low cost coatings. Thus, a conductive polymer composite comprising a low cost polymer and a conductive filler, such as conductive carbon black, is considered a more suitable alternative.
The coating of metal materials, such as carrier beads, with a polymer is known and can be achieved by two general approaches, solution and powder coating. Solution coating of carriers using a polymer composite solution comprised of a polymer, a conductive filler and solvent can be utilized to prepare a conductive carrier. However, trapping of solvent in the solution coating adversely interferes with the use of the coated materials. For example, residual solvent trapped in the carrier coating reduces the carrier life and the release of the solvent in the developer housing can cause other problems due to the harmful effects of adsorbed solvent on various copying machine parts and the toxicity of solvent. Moreover, the solvent recovery operation involved in solution coating processes is costly.
The powder coating of metal surfaces such as the carrier cores can eliminate the need for solvents and, therefore, many of the problems associated with solution coating. However, powder coating requires polymer powder that is very small in size, for example less than one micron. Although several polymer powders with desired particle size are available for carrier powder coating, there is a need for very small conductive polymeric particles, particularly, submicron particles, containing a conductive filler distributed evenly throughout the particles.
The preparation of polymeric particles for powder coatings can be accomplished primarily by three methods, namely grinding or attrition, precipitation and in situ particle polymerization. In grinding or attrition processes, especially fluid energy milling, large polymeric particles or polymeric composite particles containing fillers are reduced to the size needed for powder coating, for example less than one micron. However, such processes are often not desirable both from an economic and functional viewpoint. These materials are difficult to grind, and therefore, grinding or attrition of the required materials for coating with present milling equipment is very costly due to very low processing yield, for example in the range of 5 to 10 weight percent.
Precipitation processes can also be used to prepare polymeric and polymeric composite particles. In one approach, the polymer solution is heated to above its melting temperature and then cooled to form particles. In another process, the polymer solution is precipitated using a nonsolvent or the polymer solution is spray dried to obtain polymeric and polymeric composite particles. With all of these precipitation processes, it has been difficult to achieve low cost and clean polymer particles, that is, for example, with no or substantially no impurities such as solvents or precipitants in the resulting polymer particles. Furthermore, it is also difficult to obtain particles with small particle size and narrow particle size distribution. It is also difficult to control filler distribution throughout each particle's polymer matrix.
Suspension polymerization can be utilized to prepare polymer particles and polymeric composite particles containing, for example, a conductive filler. The main advantage of suspension polymerization is that the product may easily be recovered. Therefore, such a process is considered economical. However, it is very difficult to prepare very small particles by suspension polymerization, for example having a size less than five microns, because the monomer droplets tend to coalesce during the polymerization process, especially in the initial stage of polymerization where the droplets are very sticky.
U.S. Pat. No. 4,835,084 discloses a method for preparing pigmented particles wherein high concentrations of silica powder are used in the aqueous phase to prevent coalescence of the particles. U.S. Pat. No. 4,833,060 discloses a process for the preparation of pigmented particles by dissolving polymer in a solvent that is immiscible with water and dispersing the solution that is formed thereby in an aqueous phase containing silica powder to prevent coalescence of the particles. However, the silica powder used in both of these processes is removed using KOH, which is costly, and residual KOH and silica materials left on the surface of the particles affect the charging properties of the particles. Moreover, the above processes do not teach the preparation of submicron conductive particles.
In in situ particle polymerization processes, polymer particles are prepared by using suspension, dispersion, emulsion and semisuspension polymerization processes. Although emulsion and dispersion polymerization processes can be utilized to prepare polymeric particles smaller than one micron by nucleation and growth, these processes do not readily enable synthesis of particles containing fillers such as conductive fillers. Conductive fillers, such as carbon blacks, are free radical polymerization inhibitors and thus tend to reduce the rate of polymerization in such processes.
U.S. Pat. No. 5,043,404, the disclosure of which is totally incorporated herein by reference, discloses a semisuspension polymerization process for the preparation of small polymeric particles that are comprised of a mixture of monomers or comonomers, a polymerization initiator, a crosslinking component and a chain transfer component, which are bulk polymerized until partial polymerization is accomplished. The resultant partially polymerized monomer or comonomers is dispersed in water containing a stabilizer component with, for example, a high shear mixer. Then, the resultant suspension is polymerized, followed by washing and drying the submicron polymeric particles. However, the patent does not disclose submicron conductive polymeric particles containing fillers.
U.S. Pat. 5,236,629 discloses a process for the preparation of submicron particles using the semisuspension polymerization process. However, when carbon black is used as a conductive filler with monomers that do not have a high affinity for the carbon surface, particularly methacrylates and acrylates, the carbon black dispersion tends to be poor because of the difficulty in (1) dispersing the carbon black uniformly into the monomer initially (prior to polymerization) and (2) maintaining a stable carbon black dispersion (i.e. preventing formation of aggregates and clusters) during polymerization. "Poor carbon black dispersion" means that (1) some of the submicron particles contain very little or no carbon black, and/or (2) the carbon black present in the particles is not uniformly distributed within the particle, but rather is present as clusters. Either condition results in lower conductivity than is achieved when the carbon black is distributed uniformly throughout the submicron polymeric particles.
U.S. Pat. No. 5,484,681 describes a process for the preparation of submicron conductive particles that uses a diblock copolymer to tailor the triboelectric charge of the particle. This is accomplished by selecting the two blocks such that they diffuse to the particle surface during polymerization and thus have a significant effect on charge. However, the application does not disclose improving carbon black dispersion.
Even or homogeneous distribution of fillers such as carbon black is not believed achievable with the prior art processes mentioned herein. In fact, in prior art processes, the conductive filler is agglomerated around some of the polymeric particles and many of the other polymeric particles contain little or no conductive filler. Therefore a need exists for a invention to enable preparation of submicron conductive particles with even carbon black dispersion.

Conductive particles containing carbon black and processes for the preparation thereof


An acceleration sensor device comprising: an acceleration sensor chip comprising a mass portion, a support frame and flexible arms having piezo-resistors on their top surfaces; and an upper regulation plate having an IC circuit, which is larger in area than the support frame, bonded to a top surface of the support frame; wherein the acceleration sensor chip and the upper regulation plate are placed in a protection case with a lid. The regulation plate protrudes from outside walls of the support frame to partition the space accommodating the chip in the protection case by the protrusion and to prevent air circulation above and below the regulation plate, so that a temperature rise due to the IC circuit among the piezo-resistors provided on the top surfaces of the flexible arms is kept uniform to reduce offset voltage.

Acceleration sensors utilizing physical quantity change such as piezo-resistance effect or capacitance change have been developed and commercialized. Although these acceleration sensors can be widely used in various fields, there has recently been a demand for a smaller acceleration sensor capable of highly sensitively detecting acceleration in multi-axial directions at the same time.
Silicon single crystals have features: they can be an ideal elastic body because of their extremely few lattice defects, they can utilize semiconductor process technology without modification, and the like. Thus, particular attention is paid to semiconductor acceleration sensors of piezo-resistance effect type, in which thin flexible arms are formed on a silicon single crystal substrate and outputs are provided by converting stresses applied to the thin flexible arms into electric signals by a strain gauge such as % a piezo-resistor.
There are used three axis acceleration sensors having beam-structural flexible arms that are made of thin portions of a silicon single crystal substrate, connect a mass portion in the center made of a thick portion of the silicon single crystal substrate to a peripheral frame, and have a plurality of piezo-resistors formed in each axis direction on a flexible arm. In order to sensitively detect small acceleration, flexible arms are made longer and thinner, and the mass portion that serves as a pendulum is made heavier. The fact that small acceleration can be detected has caused flexible arms to be broken because great impact makes the amplitude of a mass portion too large. Thus, in order not to break flexible arms having had a large impact, regulation plates are provided above and below an acceleration sensor to regulate the amplitude of a mass portion by the regulation plates.
Patent Document 1 and Patent Document 2 show that in order to control the gap between a regulation plate and a mass portion of an acceleration sensor chip to be a predetermined value, microballs having substantially the same diameter as the gap are mixed with adhesive, and the adhesive mixed with the microballs is used to bond the regulation plate to the acceleration sensor chip. Since the gap between the regulation plate and the acceleration sensor chip can be determined by the diameter of a microball, the gap can be kept at the predetermined value. In this way, by using adhesive containing microballs, the gap between a regulation plate and an acceleration sensor chip can be controlled.
Piezo-resistors formed adjacent to a mass portion and adjacent to a support frame, respectively, on a flexible arm constitute a bridge circuit to measure each axial component of acceleration applied from the outside. The output voltage of the bridge circuit is as small as several mV to several 10 mV. Thus, a circuit for amplifying output voltage is required in order to address a wide range of application fields. Moreover, as for the output of a piezo-resistor, a temperature sensor for the piezo-resistor is needed to be located adjacent to an acceleration sensor to calibrate or compensate the output of the acceleration sensor with the output of the temperature sensor.
Thus, for example, Patent Document 3 proposes that an IC circuit including a bridge circuit, an amplifier circuit, and a temperature compensation circuit be incorporated in an upper regulation plate.
When an upper regulation plate having an IC circuit is used, heat generated by the IC circuit increases the temperature of the upper regulation plate. Since the upper regulation plate having the IC circuit is made of silicon, and the thermal conductivity of silicon is 168 w/m·K which is about 7000 times as large as that of air, 0.0241 w/m·K, the overall upper regulation plate is warmed by the heat generated by the IC circuit.
Piezo-resistors provided for an acceleration sensor chip are disposed on the top surfaces of flexible arms, that is, at locations opposite to the bottom surface of an upper regulation plate, at a small gap of several μm to several 10 μm from the bottom surface of the upper regulation plate, and hence when the temperature of the upper regulation plate increases, the temperature of the piezo-resistors is increased caused by radiant heat from the bottom surface of the upper regulation plate. The temperature of a piezo-resistor at a location corresponding to the center of the upper regulation plate, that is, adjacent to the mass portion, becomes lower or higher than the temperature of a piezo-resistor adjacent to the support frame. Since movement of air adjacent to the periphery of the acceleration sensor chip is larger than that of air at a center portion of the acceleration sensor chip, the temperature of a piezo-resistor formed adjacent to the support frame tends to vary from the temperature of a piezo-resistor formed adjacent to the mass portion. Since the piezo-resistors adjacent to the support frame and the piezo-resistors adjacent to the mass portion on the flexible arm are incorporated into the bridge circuit to measure each axial component of acceleration, if there is a temperature difference between the piezo-resistors adjacent to the support frame and the piezo-resistors adjacent to the mass portion, the temperature causes a resistance difference between them, and hence even when no acceleration is applied, an output voltage is measured. Specifically, there has been a problem that offset voltage is large.
Patent Document 1: Japanese Patent Laid-Open No. 4-274005
Patent Document 2: Japanese Patent Laid-Open No. 8-233851
Patent Document 3: Japanese Patent Laid-Open No. 6-242141

Acceleration sensor device having piezo-resistors measuring acceleration


A buckle for a belt or harness comprising a ring member defining a hollow interior space, a slidable bar, and releasable securable lock. The ring member has a first and a second side section, and a first and a second end section, which are connected to one another. The slidable bar is mounted between the side sections and is movable between a position immediately adjacent the first end section and a position immediately adjacent the second end section. The first end section of the buckle is securable to one portion of a web of the belt or harness. A free end portion of a web of the belt or harness is arranged to extend through the ring's interior space between the first end section and the slidable bar, around the bar, and through the space between the bar and the second end section, from which it exits beyond the second end section of the buckle. Pulling on the free end of the web causes the slidable bar with the web section therearound to slide into close proximity with the second end section to fictionally hold the web in place. The lock is a spring biased member arranged to be normally biased in an extended orientation over the slidable bar to tightly engage it and the web portion wrapped therearound and thereby prevent the accidental release thereof. The lock is manually actuable to release the spring biased member, the slidable bar and the web section when desired.

This invention relates to safety devices and more particularly to adjustable buckle for safety belts, harness, etc.
Various types of safety devices, e.g., safety harnesses, parachute harnesses, safety belts, etc., make use of adjustable buckles to enable the harness, belt, etc. to be adjusted to a desired position, e.g., into close conformity with the person wearing the safety device. Some buckles make use of a chape or catch to extend through a selected one of plural openings or holes in the web or strap to be secured by the buckle. Such buckles, are not continuously adjustable since they can only be adjusted to the discrete positions established by the opening or holes in the web or strap. Continuously adjustable buckles are, however, available. Such buckles commonly make use of a rectangular rim or frame having a pair of side sections and a pair of end sections. A slidable arm is mounted between the side sections and is arranged to be slid therealong so that the arm can be disposed close to either of the end sections. Such buckles are normally fixedly secured to one portion of a web or strap by looping a portion of the web or strap about a first one of the end sections and then sewing or riveting the loop together. The free end of the web or strap to which the buckle is fixedly secured (or the free end of another web or strap) is arranged to be connected to the buckle by extending it through the frame's interior space between the other end section and the slidable bar, around the bar, and through the space between the bar and that end section, from which it exits the buckle. By pulling on the free end of the web the slidable bar with the web section therearound is drawn into close proximity with the other end section so that it is fractionally held in place.
While prior art adjustable buckles are suitable for enabling the continuous adjustment of a webs or straps connected thereby, they never the less leave something to be desired from the standpoint of their propensity to loosen, particularly if tension is not maintained on the web or strap. For example, in applications, where such buckles are used on safety harnesses worn by workers under conditions where no tension is maintained on the strap or web, if the worker bends over the buckle's slide may slip, thereby releasing the web. This accidental web releasing action is shown in FIG. 2.
Fortunately, the free end of the web or strap used in a safety device incorporating such an adjustable buckle is folded over itself at least twice and then sewn or otherwise fixed in place. This results in a thick free end of the web or strap, which is resistent to accidental escape from the space in the buckle's frame. Accordingly, while the buckle may loosen, it is unlikely to completely disconnect the web or strap sections it serves to connect. In some applications this may be, at worst, an inconvenience. However, in other applications, e.g., where the buckle is on a safety harness, the fact that the buckle can loosen may mean that a portion of the worker's body may slip out of the portion of the harness or safety belt with the loosened buckle. Obviously, such action may be intolerable.


The present invention relates to an apparatus and method suitable for dispensing heterogeneous compositions.

Existing methods and apparatus can adequately dispense homogeneous compositions, such as homogeneous cleaning compositions. Even with existing technology, dispensing liquids or powders can be messy, exposing persons to the composition. Dispensing solids can be difficult and expensive. Improved methods and apparatus are needed to dispense heterogeneous compositions, particularly heterogeneous compositions including at least one component that flows.
Existing cleaning compositions require formulations that keep the composition homogeneous and/or stable. Homogeneous liquid and solid compositions include a significant amount of materials that keep them homogeneous and stable. There remains a need for a product that can be employed in a heterogeneous form, that can include an increased proportion of active ingredients (rather than ingredients that keep the composition homogeneous and stable), and that can form a homogeneous concentrate and/or use composition.

This patent is subject to a terminal disclaimer.

Dispensing apparatus and method suitable for heterogeneous composition


A method for laser shock peening an article including laser shock peening a first area with at least one high fluence laser beam and laser shock peening a border area between the first area and a non-laser shock peened area of the article with at least one first low fluence laser beam. The border area may be laser shock peened with a second low fluence laser beam or more low fluence laser beams wherein the second low fluence laser beam and others have a lower fluence than the first low fluence laser beam. The border area may be laser shock peened with progressively lower fluence laser beams starting with the one first fluence laser beam wherein the progressively lower fluence laser beams are in order of greatest fluence to least fluence in a direction outwardly from the first area through the border area to the non-laser shock peened area.

1. Field of the Invention
This invention relates to laser shock peening and, more particularly, to methods and articles of manufacture employing laser shock peening a boundary area bordering a laser shock peened surface with a lower fluence.
2. Description of Related Art
Laser shock peening or laser shock processing, as it is also referred to, is a process for producing a region of deep compressive residual stresses imparted by laser shock peening a surface area of an article. Laser shock peening typically uses one or more radiation pulses from high energy, about 50 joules or more, pulsed laser beams to produce an intense shockwave at the surface of an article similar to methods disclosed in U.S. Pat. No. 3,850,698 entitled "Altering Material Properties"; U.S. Pat. No. 4,401,477 entitled "Laser Shock Processing"; and U.S. Pat. No. 5,131,957 entitled "Material Properties". The use of low energy laser beams is disclosed in U.S. Pat. No. 5,932,120, entitled "Laser Shock Peening Using Low Energy Laser", which issued Aug. 3, 1999 and is assigned to the present assignee of this patent. Laser shock peening, as understood in the art and as used herein, means utilizing a pulsed laser beam from a laser beam source to produce a strong localized compressive force on a portion of a surface by producing an explosive force at the impingement point of the laser beam by an instantaneous ablation or vaporization of a thin layer of that surface or of a coating (such as tape or paint) on that surface which forms a plasma.
Laser shock peening is being developed for many applications in the gas turbine engine field, some of which are disclosed in the following U.S. Pat. No. 5,756,965 entitled "On The Fly Laser Shock Peening"; U.S. Pat. No. 5,591,009 entitled "Laser shock peened gas turbine engine fan blade edges"; U.S. Pat. No. 5,531,570 entitled "Distortion control for laser shock peened gas turbine engine compressor blade edges"; U.S. Pat. No. 5,492,447 entitled "Laser shock peened rotor components for turbomachinery"; U.S. Pat. No. 5,674,329 entitled "Adhesive tape covered laser shock peening"; and U.S. Pat. No. 5,674,328 entitled "Dry tape covered laser shock peening", all of which are assigned to the present Assignee.
Laser peening has been utilized to create a compressively stressed protective layer at the outer surface of an article which is known to considerably increase the resistance of the article to fatigue failure as disclosed in U.S. Pat. No. 4,937,421 entitled "Laser Peening System and Method". These methods typically employ a curtain of water flowed over the article or some other method to provide a plasma confining medium. This medium enables the plasma to rapidly achieve shockwave pressures that produce the plastic deformation and associated residual stress patterns that constitute the LSP effect. The curtain of water provides a confining medium, to confine and redirect the process generated shockwaves into the bulk of the material of a component being LSP'D, to create the beneficial compressive residual stresses.
The pressure pulse from the rapidly expanding plasma imparts a traveling shockwave into the component. This compressive shockwave caused by the laser pulse results in deep plastic compressive strains in the component. These plastic strains produce residual stresses consistent with the dynamic modules of the material. The many useful benefits of laser shock peened residual compressive stresses in engineered components have been well documented and patented, including the improvement on fatigue capability. These compressive residual stresses are balanced by the residual tensile stresses in the component. These added residual tensile stresses may lower fatigue capability of components and, thus, should be reduced and/or minimized. The laser shock peening is performed at selective locations on the component to solve a specific problem. The balancing tensile stresses usually occur at the edge of the laser shock peened area. Small narrow bands or lines of tensile stresses can build up immediately next to the laser shock peened patch or area along the edges of the patch. Extensive finite element analyses are done to determine where these tensiles will reside and the LSP patches are designed and dimensioned such the tensile band(s) end up in an inert portion of the article or component (e.g. not at a high stress line in one of the flex, twist or other vibratory modes). It is desirable to reduce the level of these tensile stresses in the transition area between the laser shock peened and non-laser shock peened areas.

Lower fluence boundary laser shock peening


A magnetron sputtering source for depositing a material onto a substrate includes a target from which the material is sputtered, a magnet assembly disposed in proximity to the target for confining a plasma at the surface of the target and a drive assembly for scanning the magnet assembly relative to the target. The sputtering source may further include an anode for maintaining substantially constant plasma characteristics as the magnet assembly is scanned relative to the target. The anode may be implemented as variable voltage stationary electrodes positioned at or near the opposite ends of the scan path followed by the magnet assembly, spaced-apart anode wires positioned between the target and the substrate or a movable anode that is scanned with the magnet assembly. The magnet elements of the magnet assembly may have different spacings from the surface of the target to enhance depositional thickness uniformity. The target may be fabricated in sections, each having a target element bonded to a backing element for reduced sensitivity to thermal variations. The target may be rotated from a first fixed position to a second fixed position relative to the magnet assembly at least once during its operating life for increased target utilization.

Sputter deposition, also known as sputter coating, is a technique for depositing thin films of desired materials on a substrate such as, for example, a glass panel for a flat panel display, a magnetic disk for a hard disk drive or a semiconductor wafer. In general, ions of an inert gas from a plasma are accelerated toward a target of the material to be deposited. Free atoms of the target material are expelled when the ions collide with the target. A portion of the free atoms are collected on the surface of the substrate and form a thin film.
One well known sputtering technique is magnetron sputtering. Magnetron sputtering uses a magnetic field to concentrate the sputtering action. Magnets are positioned behind the target, and magnetic field lines penetrate the target and form arcs over its surface. The magnetic field helps to confine electrons in an area near the surface of the target. The resulting increased concentration of electrons produces a high density of ions and enhances the efficiency of the sputtering process.
Both fixed and movable magnet structures have been utilized in magnetron sputtering. In one prior art sputtering system utilizing a moving magnet, the target is circular and the magnet structure rotates with respect to the center of the target. In a second prior art sputtering system utilizing a moving magnet, the target is rectangular or square and the magnet structure is scanned along a linear path with respect to the target. In a third prior art sputtering system, the target is rectangular and the substrate is moved in a plane parallel to the surface of the target during sputtering. The second type of sputtering system is disclosed, for example, in U.S. Pat. No. 5,382,344 issued Jan. 17, 1995 to Hosokawa et al and U.S. Pat. No. 5,565,071 issued Oct. 15, 1996 to Demaray et al.
Prior art sputtering systems which utilize a rectangular or square target and a linearly scanned magnet structure have a number of problems and disadvantages. The requirement for large substrates has led to the need for large target assemblies. Such target assemblies usually include target tiles solder bonded to a single water-cooled backing plate. The bonded target tiles and the backing plate form a bimetal structure which bows permanently during the bonding operation in response to temperature variations because of differing rates of thermal expansion. Prior art attempts to minimize bowing have utilized target tile segments, expansion gaps between target tile segments, low melting point solder and backing plate materials that have a closer match in expansion/contraction coefficient with the target material. Bowing of the target can be significant, up to 0.060 inch for a 17 inch target using indium tin oxide tiles and a copper backing plate. Bowing of the target assembly produces variations in target-to-substrate distance and may compromise some other design parameter that is critical to the magnetron source operation.
A sputter cathode wherein target segments are mounted on a mounting plate by locating studs is disclosed in U.S. Pat. No. 5,536,380 issued Jul. 16, 1996 to Ocker et al. Each target segment includes a target backplate and a target bonded to the backplate.
Linear scan sputtering systems typically utilize a magnet assembly which produces a closed-loop plasma in the shape of an elongated oval, often referred to as a racetrack-shaped plasma. The magnet assembly is scanned with respect to the target in a direction perpendicular to the long dimension of the racetrack-shaped plasma. The resulting erosion of the target tends to be greatest at the ends of the plasma, thus producing erosion grooves along each edge of the target parallel to the scan direction. To avoid contaminating the substrate, sputtering must be stopped before the erosion pattern has consumed the full thickness of the target material at any point. The target must be replaced when the erosion at any point approaches a substantial fraction of the target's initial thickness. Thus, in a given production process, only a certain number of substrates can be coated from one target. By making the erosion of the target more uniform, a larger percentage of the target material may be utilized before it is necessary to replace the target.
The linear scanning sputter source typically has a large rectangular or square target attached to a water-cooled backing plate. This structure operates at cathode potential, typically several hundred volts negative with respect to ground. On the backing plate side of the target, a racetrack-shaped magnet assembly creates a magnetic field at the target surface that is sufficient to sustain a plasma when the appropriate electric field is provided. The electric field is created by operating the target structure at cathode potential in a chamber held at ground potential. The electric field at the target surface is influenced by the size and shape of the chamber and by the characteristics of the plasma which is formed. The combination of magnetic and electric fields in a near vacuum causes the sputtering action to occur.
Depositional thickness uniformity is an important requirement of sputtering systems. For large area substrates, uniform deposition is achieved by using large targets and linearly scanning the magnet assembly with respect to the target, producing uniform erosion of the target surface and uniform coating of the substrate. However, the inherent geometry of a large area sputtering system produces effects which limit thickness uniformity.
The magnet assembly is linearly scanned parallel to the target surface and perpendicular to the long dimension of the magnet assembly. This motion causes the plasma, which is formed a few millimeters away from the target surface, to sweep across the target surface. The geometry of the sputtering chamber affects the depositional thickness uniformity. In particular, when the chamber walls are relatively close to the ends of the racetrack-shaped plasma, the deposited films are relatively thin in the center of the substrate and relatively thick at the edges. It is desirable to provide a sputtering system which achieves depositional thickness uniformity.

Methods and apparatus for linear scan magnetron sputtering


This disclosure features methods and compositions for treating diseases of the gastrointestinal tract with a chemokine/chemokine receptor inhibitor.

Chemokines and chemokine receptors play a role in inflammation, and have been implicated for a role in various intestinal disorders. The gastrointestinal (GI) tract generally provides a therapeutic medium for an individual's body. At times, therapeutic drugs may need to be dispensed to specified locations within the small intestine or large intestine, which is more effective than oral administration of the therapeutic drugs to cure some medical conditions. For example, therapeutic drugs applied directly within the small intestine would not be contaminated, digested or otherwise compromised in the stomach, and thus allow a higher dose to be delivered at a specific location within the small intestine. However, dispensing therapeutic drugs directly within the small intestine inside a human body can be difficult, because a device or mechanism (e.g., special formulation) is needed to carry a therapeutically effective dose of drug to a desired location within the small intestine and then automatically deliver the therapeutic drug at the desired location. Such a device or mechanism also needs to be operated in a safe manner as the device or mechanism needs to enter the human body.
The gastrointestinal (GI) tract generally provides a therapeutic medium for an individual's body. At times, therapeutic drugs may need to be dispensed to specified locations within the small intestine or large intestine, which is more effective than oral administration of the therapeutic drugs to cure or alleviate the symptoms of some medical conditions. For example, therapeutic drugs dispensed directly within the small intestine would not be contaminated, digested or otherwise compromised in the stomach, and thus allow a higher dose to be delivered at a specific location within the small intestine. However, dispensing therapeutic drugs directly within the small intestine inside a human body (e.g., the cecum, the ascending colon) can be difficult, because a device or mechanism (e.g., special formulation) would be needed to transport a therapeutically effective dose of drug to a desired location within the small intestine and then automatically deliver the therapeutic drug at the desired location. Dispensing therapeutic drugs directly within other locations in the GI tract of the human body can be similarly difficult. Such a device or mechanism also would also need to be operated in a safe manner in that the device or mechanism needs to physically enter the human body.
In sum, there remains a significant unmet medical need for improved treatment regimens for gastrointestinal diseases, such as inflammatory bowel disease (IBD), including a need for regimens which can dispense therapeutics to specific locations within the GI tract, thereby reducing or avoiding the drawbacks of oral or other forms of systemic administration.

Treatment of a disease of the gastrointestinal tract with a chemokine/chemokine receptor inhibitor


Device for handling flexible packages, of the type used in horizontal packing machines that are used to form packets from a heat-sealable complex sheet, fill them with the product to be packed and heat-seal the openings when they are full. The device includes scissors for cutting the packets that are formed continuously from the complex sheet, a packet-lifting mechanism and a revolving mechanism that moves horizontally. The revolving mechanism consists of a moving chain, and several sets of carrying clips that are attached horizontally to the outer sides of the chain. The carrying clips pick up the packets supplied by the lifting clips at a collection station, move them horizontally through the packing machine filling and sealing stations and finally release them at a packet release station.

At present there are devices for handling flexible packages or containers, and more specifically packets, that include a revolving mechanism that moves along a vertical plane, while the two driving and driven sections of the chain move along a horizontal plane at different heights. Therefore, when the packets are being filled by the packing machine, the product that is being poured into the packets sometimes spills onto the chains and moving parts of the device, causing the device to break down or malfunction. As a result, the moving parts must be cleaned at regular intervals to remove any product that has been spilt.
After picking up the packets, these devices have to carry them through the different stations of the packing machine to which they are attached, open the packets to fill them and then stretch the packet opening so that it can be heat-sealed. For the aforementioned reasons, these well-known devices are highly complex in mechanical terms, and this affects their final price.


A wheel suspension comprising a vehicle body, a wheel movably articulated on the vehicle body via a control arm assembly. A wheel carrier and at least one helical pressure spring which is supported on the vehicle body on the one hand and on the wheel carrier or the control arm assembly on the other hand. The spring stiffness of the vehicle body support referred to the wheel contact point of the wheel can be controlled so as to be variable. Use is made of a helical pressure spring assembly whose force action line deviates from the geometric spring center line. Furthermore, there are provided rotational means for the 3-dimensional adjustment of the force action line relative to the geometric spring center line.

From German Publication DE 25 38 103 A1 wheel suspensions are known wherein symmetrical helical pressure springs are eccentrically offset relative to the spring plates by means of which they are supported on the vehicle body and on the control arm assembly. The helical pressure springs in this case are conventional springs wherein the spring center line corresponds to the force action line of the spring. By effecting a motor-driven rotation of the spring plates there occurs a change in the spring stiffness of the vehicle body support relative to the wheel contact point. The spring stiffness of the spring itself remains unaffected. Said adjustment influences the effective lever arms, so that the vehicle suspension can be adjusted to be "softer" or "harder".
German Publication DE 37 07 085 A1 proposes wheel suspensions wherein the supporting points of a helical pressure spring relative to the vehicle body and/or relative to the wheel carrier and control arm assembly respectively can be translatorily displaced in a direction extending perpendicularly relative to the central axis of the respective spring plate. In this case the spring stiffness of the vehicle body support which is referred to the wheel contact point can be varied relative to the wheel in a controlled way. In addition, the spring stiffness of the spring itself remains unchanged. The desired effect is based on a change in the effective lever arms.
German Publications DE 37 43 450 C2 and DE 101 25 503 C1 propose wheel suspensions which use helical pressure springs whose force action lines form an angle with the spring central line. The wheel suspensions used are entirely of the McPherson type and as a result of the angular position selected between the force action line and the spring central line which can deviate only slightly from the axis of the respective spring strut, the transverse forces acting on the suspension of the spring strut are reduced. The deviation of the force action line from the spring central line in the built-in condition is achieved with the helical pressure springs in the untensioned condition in a radial view and follow an approximately S-shaped course. In a radial view, an S-shaped course is followed in a first view and a C-shaped course is followed in a second view extending perpendicularly relative thereto or an S-shaped course in a first view and, equally, an S-shaped view in a second view extending perpendicularly relative thereto.
As described in detail in German Publication DE 101 25 503 C1, the examples mentioned here are not the only technical possibilities for achieving a predetermined deviation of the spring center line from the force action line in the built-in condition in a wheel suspension. Other possibilities are referred to.
Again, as described in German Publication DE 101 25 503 C1, there is no standardized definition of the term spring center line of helical pressure springs. The description given therein of determining spring center lines of helical pressure springs will be repeated below.
A first method of determining the spring center line of helical pressure springs comprises first, the design of the enveloping jacket of the helical pressure spring and then, the design of an enveloping jacket used to determine the center line of the enveloping jacket wherein the center line is equated with the spring center line. At most, this method can only be used to a limited extent. It fails in those cases where there are spring coils with variable coil diameters.
A further method of determining the spring center line of helical pressure springs comprises arithmetic means using the coil points for determining the curvature centers of the spring coil and wherein the connection between the curvature centers of the spring coils is determined in this way to constitute the spring center line.
Finally, the spring center line of helical pressure springs can be determined in such a way that the projections of the individual spring coils are considered in one plane. The center of each spring coil is assumed to be the center of a circle which is made to approach the spring coil and the centers of the spring coils obtained in this way are connected to one another.
When reference is made to the spring center lines of helical pressure springs, it depends on the degree of significance attached to the spring center lines for the spring action lines of helical pressure springs. If a helical pressure spring comprises a straight spring center line, the spring force action line, which of course is always a straight line, coincides with the spring center line. In the case of a helical pressure spring whose spring center line in the untensioned condition, the center line follows an approximately C-shaped course. The spring force action line, in the built-in condition, is displaced relative to the spring center line which, in the built-in condition, extends in a straight line (See German Publication DE 37 43 450 C2, FIG. 5). On the other hand, in the case of a helical pressure spring whose spring center line in the unloaded condition follows an approximately S-shaped course, the spring force action line in the built-in condition extends at an acute angle relative to the spring center line extending in a straight line in the built-in condition (See German Publication DE 37 43 450 C2, FIG. 6).
The force action line of the helical pressure spring is determined by the direction of the forces and counterforces of the vehicle body on the one hand and of the wheel carrier and control arm assembly on the other hand, relative to the spring plates on which the helical pressure spring is supported. The contact between the ends of the helical pressure spring and the spring plates is generally a multi-point contact, for example a three-point contact. However, linear contacts can also occur.

Wheel suspension with spring adjustment for motor vehicles


A full services access multiplexer is described. A master digital subscriber line (master DSL) modem is coupled to a conductor pair. A POTS extender also is coupled to the conductor pair and may sense the operation of a fallback or other signal on the conductor pair. A suppression signal may be transmitted to a master DSL modem upon occurrence of the fallback. The suppression signal may travel over a control circuit. Traffic over a backplane or other network segment may be uninterrupted to a Integrated Access Device (IAD) by handling signals inbound and outbound to the backplane via a packet assembler and disassembler (PAD). The PAD may transmit a data stream to a vocoder and receive a data stream from the vocoder for injection onto the backplane. The vocoder connects duplexed traffic to the subscriber line interface circuit (SLIC) wherein traffic between the vocoder and the SLIC are in analog formats in or near the audible range of frequencies.

Current voice telephone system operators are generally engaging in a growth phase of deploying data services to their subscribers. One of the chief ways to do this is to offer digital subscriber lines (DSL) wherein both voice and data may be carried over a common twisted pair cable to a subscriber's residence or business. In one of the more popular versions of DSL, Asymmetric Digital Subscriber Line (ADSL), a twisted pair carries two types of duplexed signals over different frequency bands. The first signal is the voice signal, generally at 4 KHz and below. The second signal is the data signal, generally modulated at above 4 KHz.
Other forms of DSL may inter-mingle voice signals with data, by, e.g. voice over packet (VOP). Such forms include: Symmetric DSL (SDSL), High bit-rate DSL (HDSL), and Very-high-bit-rate DSL (VDSL). In such cases, the voice signal may be modified by a Integrated Access Device (IAD) to be converted into data packets. A IAD is intended to provide access to the twisted pair by multiplexing at least one voice signal with other signals, such as data, which is used most commonly by computers for internet access. Such a device, coupled with DSL service can provide a great improvement to home-owners or small businesses because the cost to maintain a single twisted pair subscriber line that multiplexes various signals is much less than having a dedicated subscriber line for each device at the customer premises.
Unfortunately, because the IAD is performing high level communications functions—essentially changing the signaling format between dissimilar networks—the IAD may be susceptible to power failures that leave none of the customer premises equipment operating. Although the data culture associated with computers has long accepted, in many situations, the possibility of intermittent failures, the opposite is true for the voice telephony world. Namely, in many parts of the world, a telephone is viewed as a necessity, and particularly, a valuable tool to avert disasters through timely call placement to emergency personnel, e.g. calling 911. For this reason, telephone switches are required to have an up time greater than 99.999% of the time.
Thus the dilemma: how to offer fast data throughput, including that supporting voice, and maintain constant fault-free voice operation to a customer while keeping the number of subscriber lines between customer premises and data aggregator to a minimum.
Part of the solution lies in the ability to adjust the operation of a remote device, by transmitting a minimalist signal from the local device that is failing—a last gasp, if you will. A signal may be the encoding of two or more values (sometimes voltages) that change over time on a medium. A packet may be a series of changing values or an arrangement of signals. A protocol may involve the exchange of one series of changes on a medium. A signal may occur when a voltage changes or where an established protocol requires a responsive reply, but none occurs. Under ordinary circumstances a master DSL master modem communicates with a slave DSL modem component of the IAD so that the slave DSL modem synchronizes or trains to signals provided by the master DSL. Any failure of the slave DSL modem to respond under this protocol may be taken as a signal that the slave DSL is in a fault mode.
A data aggregator may be a Digital Subscriber Line Access Multiplexer (DSLAM) having at least one master DSL modem. Constant voice access has been accomplished for some forms of DSL by providing a secondary twisted pair line between a data aggregator and an IAD. Companies such as Coppercom provide a IAD that upon detecting a power failure, would route at least one of the telephones at a customer premises to the secondary twisted pair line—thus bypassing the data network altogether. For obvious reasons, it is twice as costly to maintain the two pairs of cabling from the data aggregator such as a switch or a DSLAM to the subscriber than in the situation where a single twisted pair is used. Nevertheless, the highly fault-resistant voice central office is much more reliably available than its counterpart, the IAD. This is true because central office (CO) equipment is more capable of providing reliability because of economies of scale, particularly due to CO backup batteries and other redundant power sources. Thus, there is a need to extend plain old telephone service (POTS) to an IAD that has failed in that the IAD is unable to transmit data packets.

Pots extender for voice fallback in a subscriber line


A method for action selection based upon an objective of an outcome relative to a subject. In one embodiment, a training set is obtained that contains attributes of a subject. In the present embodiment, a best behavioral model for predicting an outcome when a subject has an action applied is calculated. The training set is mapped to the best behavioral model. The mapping provides a base from which a random sub-sample is acquired. In the present embodiment, a random sub-sample of the training set and the best behavioral model is then selected. This random sub-sample reduces the computational requirements when determining an optimized strategy. The optimized strategy provides an optimal action relative to the subject for the objective of the outcome. In one embodiment, the subject is a customer of a business entity, enabled to interact with the customer, and an action is a promotion offered by the business entity.

Computer systems and their related technologies that are currently available enable the acquisition and storing of nearly endless amounts of data and information regarding a seemingly endless variety of subject matter. Those systems and technologies also enable the acquired data and information to be categorized and classified according to an almost limitless selection of attributes.
Accordingly, numerous methods have been implemented to utilize the acquired data and information for purposeful interpretation. To provide purposeful interpretation of data and information acquired, numerous methods have been implemented in an attempt to provide an optimal action as a response to particular sets of criterion relative to a customer. Referring to the various methods that are commonly utilized, each has focused primarily on one particular approach to interpretation and utilization of the outcome to provide the optimal action relative to a particular subject. It should be appreciated that each method is not without certain drawbacks.
In a first example, one method calculates the estimated objective function for nearly any of the possible actions and simply selects the one with maximum value. In this example, each subject is a customer who has accessed a company's Web site for a particular reason. In this same example, an action is something promoted by a company, such as, for example, something for sale. While this approach provides complete flexibility for the estimation, it uses a "greedy algorithm" for finding the optimal allocation strategy. A greedy algorithm is in reference to the manner in which the optimal action is derived. It bases the decision solely on a single factor, such as e.g., profit. For example, assume a company is selling computers, and each of the computers comes with different configurations and prices dependent upon those configurations. In this instance, the optimal action, the selling of the computer, would be based on the computer with the highest selling price and, in one example, the largest amount of profit. By essentially ignoring any business side constraints such as, e.g., budget, inventory levels, projected sales, shipping costs, and the optimal action can produce results that are far from being optimal.
In a second example, a customer is placed into several groups using, for instance, a clustering algorithm or supervised learning. The customers within a particular grouping are then treated as homogenous in their response to nearly any action. This enables solving the optimization problem with a finite number of groupings. For each new customer, the appropriate groups are determined, and the optimal action for those groups are applied to that new customer. While this approach provides for a wider range than that of the optimal action based on maximum value, it restricts the estimation to be only of a segmentation type. A segmentation type of estimation may not provide an optimal action for a given application. It is well known in the art that estimators derived and/or obtained from a generalized linear regression or from a neural network are not analogous to the segmentation type.
Additionally, to ensure that the sample size is sufficient to estimate the outcome within each of the groups in the segmentation type of estimation, the total number of groups must be kept rather small. However, to find a segmentation where the customers of each group are homogenous to almost all the optimum action possibilities would be very unlikely.
In another example, numerous complex procedures are utilized to attempt to estimate the joint distribution of the estimated outcome space. This approach suffers from the inherent complexity of performing the complex procedures, but also from the fact that it is quite difficult to provide estimation based upon a high dimensional distribution.
Thus a need exists for a method of estimation and optimization of an action on subjects that is based on an objective of an outcome which incorporates attributes relative to each subject. A further need exists for a method that considers each subject as a separate segment. An additional need exists for a method which includes business side constraints. Additionally, a need exists for a method that reduces the computational complexity normally associated with previous methods. Further, a need exists for a method that incorporates full flexibility into the estimation function. Another need exists for a method that can separate the estimation portion from the optimization portion, so as to strike a balance between optimality and tractability.
The present invention provides a unique, novel solution to those and other problems.

Generalized segmentation method for estimation/optimization problem

Hewlett-Packard Development Company, L.P.


A mixing drum unit for mixing a plastic resin and an aggregate includes a metal support drum and a plastic liner resting in the drum. An outer cover is secured to the drum overlying the outer end of the liner. The liner includes a cylindrical portion telescoped into the drum extending outwardly to an outer frustoconical portion having an outer end opening. The liner has a V-shaped shallow base which promotes mixing and ease of cleaning. The drum and liner include telescoping drive paddles which extend axially throughout the liner and project radially for coupling. The liner drive paddles extend into the outer frustoconical liner portion. The liner paddles have a radial wall and an inclined wall with an inner apex. The paddles are asymmetrically arranged about the drum and liner with at least one paddle spaced asymmetrically between the two adjacent paddles. The drum paddle is a metal plate projecting radially into the triangular liner paddle for direct coupling therebetween. The cover, where used, compliments and mates with the cylindrical projection of the drum projection and the frustoconical liner portion. The cover is releasably attached abutting the drum end by releasable latches.

This invention relates to a aggregate/binder rotating mixing drum with a replaceable liner, and particularly to such a mixing drum for mixing an aggregate with a plastic binder.
Mixing drums are used for mixing of various materials to form a substantially uniform mixture of the several different materials or ingredients. Metal mixing drums are widely used in many applications because of the improved wear characteristics. Typically, in concrete and other similar binder and aggregate based mixing systems, various metal drums have been designed and are widely used for intermixing of the cement, aggregate and other materials to form a final product such as concrete and the like. With the development of plastic binders, various products have been developed involving the inter-mixing of aggregate material and a plastic binder material. A particular product which has been developed includes an epoxy resin binder which is intermixed with decorative aggregate to form a decorative material which is applied as a final decorative surface. The decorative material is generally applied as a decorative top layer overlying a concrete and other similar underlayments for patios, driveways and the like. The decorative material has been generally mixed in a conventional rotating mortar mixing drum having internal agitating and paddle units to insure thorough mixing, similar to the system used for many years for mixing cement and concrete. The mixing drum must be cleaned after each use to prevent build up and accumulation of product within the drum and thereby insure that subsequent mixtures are thoroughly intermixed and are not contaminated by the previous mixture. Cleaning can be particularly difficult when handling plastic binders such as epoxy resins.
Various mixing devices have been available with a liner removably secured to the drum for rotation with the drum, with a removable liner for easy cleaning after use of the mixing apparatus. U.S. Pat. No. 4,521,116 discloses a rotating drum apparatus in which a cylindrical drum is provided. A special plastic liner is bolted within the drum and includes a complementing cylindrical portion which telescopes into the drum and substantially conforms to the drum. The liner is bolted to the drum and rotates therewith. The liner includes an outer cone-shaped portion which is integrally formed with the cylindrical portion and which is specially constructed for positioning outwardly of the drum. The bolted liner can be released and removed for cleaning of epoxy mixture residue within the liner.
Although the liner promotes easy cleaning, the present inventor has found that epoxy resin aggregate mixing and the like presents certain problems with respect to the thoroughness of the mixing and the conventional construction of the liner and develops pockets within the system which interfere with the thorough mixing of the product and may result in undesirable agglomeration of residue within liner pockets which are difficult to clean thoroughly. Further, the projecting liner can raise certain questions with respect to the stability of the system, the required construction of the liner to withstand the forces encountered in loading and operating the lined mixer and the like.

Rotating mixing drum with replaceable liner for mixing aggregate and binder


A semiconductor device includes a semiconductor chip, leads for sending and receiving signals between the semiconductor chip and an external device, fine metal wires, an encapsulant for sealing the leads, and a lid member. On the surface of each of the leads, a metal oxide film is formed by an oxidation treatment. The metal oxide film has a thickness larger than a natural oxide film and no more than 80 nm.

(a) Field of the Invention
The present invention relates to a semiconductor package which is equipped with an LSI chip, a solid-state imaging element, a light receiving/emitting element or the like and is made of a resin, a method for fabricating the same, and a semiconductor device.
(b) Description of Related Art
Conventionally, a typical molding of a semiconductor package has been carried out by sandwiching a leadframe having leads, dam bars that couple the leads to each other and other components between respective regions of upper and lower parts of a molding die adjacent to its die cavity, pouring a resin in the die cavity, and then curing the resin.
FIG. 9 shows a cross sectional view illustrating a conventional optical device with a semiconductor package having an overhang structure.
As illustrated in FIG. 9, the optical device includes: an optical chip 101 such as a solid-state imaging element, a light receiving/emitting element or an LSI; leads 102 for sending and receiving signals between the optical chip 101 and an external device; fine metal wires 107 for connecting the optical chip 101 and the leads 102; a rectangular dished encapsulant 103 for sealing the leads 102; and a lid member 105 such as a glass window or a hologram which is attached to the top surface of the encapsulant 103. The encapsulant 103 is formed in one piece from a resin poured during molding.
The lid member 105 is attached to the top of the encapsulant 103, and the optical chip 101 is mounted at the center of the recess of the encapsulant 103. Therefore, the optical chip 101 is placed in an internal space 106 surrounded with the encapsulant 103 and the glass window 105.

Semiconductor package, method for fabricating the same, and semiconductor device

Matsushita Electric Industrial Co., Ltd.


A compact, lightweight, low power aircraft air filtration and VOC removal unit enables the removal of VOCs from cabin air in a passenger aircraft. A plurality of baffles having air flow-through airflow spaces are spaced apart along a duct. UV LEDs are mounted on the interior sides of the outermost baffles, and on both sides of all interior baffles. A filter module is disposed between pairs of baffles, and spaced from the baffles sufficiently to illuminate the entirety of both sides. Each filter modules comprises a plurality of filters. The filters are selected from a coarse foam, a fine foam, or a fused quartz filament felt. Each filter is loaded with a catalyst including one or more of AEROXIDE® P25, other pure titanium dioxide (TiO2), iron-doped TiO2, carbon-doped TiO2, and combinations thereof. The catalysts on the filters, under UV illumination, chemically reduce VOCs in the airflow to non-VOC molecules.

Volatile organic compounds (VOC) are a class of organic chemicals characterized by a high vapor pressure at room temperature, typically resulting from a low boiling point. They include non-methane hydrocarbons (NMHC) and oxygenated NMHC (e.g., alcohols, aldehydes and organic acids). VOCs emanate from off-gassing of foams, plastics, fabrics, and other manufactured products, particularly when they are new, and from the solvents in many cleaning products. VOCs are also produced as byproducts of human metabolic processes. Over 200 VOCs have been identified in human alveolar breath. In a closed environment full of people, such as a passenger aircraft, endogenously produced VOCs dominate.
From measurement campaigns, the primary complaints from passengers and crew in the aircraft are eye, nasal tract and throat irritation. Industry (FAA CoE ACER, ASHRAE) research has shown that many of these complaints are sourced from gaseous contaminants, notably VOCs.
VOCs cannot be removed by typical air filtration methods such as HEPA filtration. Existing systems to reduce VOC concentration in the cabin environment include activated carbon.
The Background section of this document is provided to place aspects of the present disclosure in technological and operational context, to assist those of skill in the art in understanding their scope and utility. Unless explicitly identified as such, no statement herein is admitted to be prior art merely by its inclusion in the Background section.

Aircraft air purification and volatile organic compounds reduction unit


A system for forming a corneal implant includes a cutting apparatus, which includes a laser source that emits a laser and optical elements that direct the laser. The system includes a controller implemented with at least one processor and at least one data storage device. The controller generates a sculpting plan for modifying a first shape of a lenticule formed from corneal tissue and achieving a second shape for the lenticule to produce a corneal implant with a refractive profile to reshape a recipient eye. The sculpting plan is determined from measurements relating to the lenticule having the first shape and information relating to a refractive profile for a corneal implant. The controller controls the cutting apparatus to direct, via the one or more optical elements, the laser from the laser source to sculpt the lenticule according to the sculpting plan to produce the corneal implant with the refractive profile.

A variety of eye disorders, such as myopia, hyperopia, astigmatism, and presbyopia, involve abnormal shaping of the cornea. This abnormal shaping prevents the cornea from properly focusing light onto the retina in the back of the eye (i.e., refractive error). A number of treatments attempt to reshape the cornea so that the light is properly focused. For instance, a common type of corrective treatment is LASIK (laser-assisted in situ keratomileusis), which employs a laser to reshape the cornea surgically.


Aromatic polyesters containing monomer units derived from terephthalic acid, one or more aromatic diols, such as bisphenol A, and one or more aromatic hydroxyacids, such as 4-hydroxybenzoic acid or 6-hydroxy-2-naphthoic acid, are described. The aromatic hydroxyacid is incorporated in a quantity sufficient to yield a polymer which is non-crystalline and which has a low enough softening temperature that it can be readily synthesized in the melt with a useful molecular weight without the need for subsequent solid state polymerization. These aromatic polyesters are useful for making transparent articles with high temperature properties.

Polymers of 2,2-bis(4-hydroxyphenyl)propane (hereinafter referred to as "bisphenol A"), terephthalic acid and isophthalic acid are well known wholly aromatic polyesters, generally being referred to as polyarylates. Polyarylates are commercially available, and their high heat distortion temperatures and transparency make them useful as a substitute for lower melting transparent polymers (e.g., polycarbonates) in high temperature applications. Other transparent polymers that can be used at elevated temperatures are not commonly available.
Polyarylates that also include 4-hydroxybenzoic acid as a comonomer have been described in the literature. These reports suggest that these polymers may have higher heat distortion temperatures than polyarylates without 4-hydroxybenzoic acid, but are difficult to process. For example, U.S. Pat. No. 4,189,549 describes and claims blends of the copolymers of isophthalic and/or terephthalic acid, 4-hydroxybenzoic acid and bisphenol A with other polymers. The patent describes the unblended copolymer as a "transparent resin having a high heat distortion temperature and excellent mechanical and electrical properties," but states that the copolymer is "hard to process by a conventional processing machine because of the high flow-starting temperature." The '549 patent then reports that blending the copolymers with polycarbonates or aliphatic polyesters corrects the "defects" of both components of the blends, yielding a blend that is more readily processed than the unblended copolymer.
A process for synthesizing copolymers of isophthalic and/or terephthalic acid, 4-hydroxybenzoic acid and bisphenol A is disclosed in U.S. Pat. No. 4,075,173. This patent teaches that the copolymer can readily be made in high molecular weight by first synthesizing a low molecular weight pre-polymer using a melt condensation process and then raising the molecular weight by solid state polymerization. The patent uses a two-step method because bulk polymerization directly to a high molecular weight results in coloration and degradation, which are caused by the high temperatures that are needed to keep the polymer in a molten state as the polymerization proceeds. The patent particularly emphasizes that polymerization of the acetate esters of the phenols and the free acids has the "fatal drawbacks" of coloration and deterioration.
These two patents therefore teach that a copolymer of isophthalic and/or terephthalic acid, 4-hydroxybenzoic acid, and bisphenol A cannot be made in high molecular weight by a direct melt polymerization, especially by polymerization of the acetate esters of the phenols. These patents furthermore suggest that these copolymers cannot be readily processed in the melt using conventional techniques (e.g., injection molding).
There is also one report of a copolymer of terephthalic acid, bisphenol A and 4-hydroxybenzoic acid (J. W. Jackson, Jr., British Polymer Journal, 12, pp. 154-162, December, 1980). This publication reports that incorporation of bisphenol A and terephthalic acid at a 30 mole % level in poly(4-hydroxybenzoate) (i.e., terephthalic acid:bisphenol A:4-hydroxybenzoic acid=30:30:70) eliminates the liquid crystallinity of poly(4-hydroxybenzoate). The publication does not comment on the ease or difficulty of processing the copolymer in the melt, since the publication is directed to liquid crystalline polymers.
Finally, polyarylates made from isophthalic acid and/or terephthalic acid, bisphenol A and about 5 to 10 mole % of 6-hydroxy-2-naphthoic acid have been reported in U.S. Pat. No. 5,023,314 and a related process patent (U.S. Pat. No. 5,109,101). These polymers preferably contain at least about 10% isophthalic acid (as a % of the two diacids). Polymers containing only terephthalic acid, bisphenol A and 6-hydroxy-2-naphthoic acid are not mentioned in the patent, nor is 4-hydroxybenzoic acid mentioned as a potential comonomer.

Non-crystalline wholly aromatic polyesters


Provided is a process for making non-phthalate plasticizers, by acylating an aromatic compound with a succinic anhydride to form a keto-acid, and then esterifying the keto-acid with C4-C13 OXO-alcohols to form a plasticizer compound. The aromatic rings of the aromatic compound may also be optionally hydrogenated.

Plasticizers are incorporated into a resin (usually a plastic or elastomer) to increase the flexibility, workability, or distensibility of the resin. The largest use of plasticizers is in the production of "plasticized" or flexible polyvinyl chloride (PVC) products. Typical uses of plasticized PVC include films, sheets, tubing, coated fabrics, wire and cable insulation and jacketing, toys, flooring materials such as vinyl sheet flooring or vinyl floor tiles, adhesives, sealants, inks, and medical products such as blood bags and tubing, and the like.
Other polymer systems that use small amounts of plasticizers include polyvinyl butyral, acrylic polymers, nylon, polyolefins, polyurethanes, and certain fluoroplastics. Plasticizers can also be used with rubber (although often these materials fall under the definition of extenders for rubber rather than plasticizers). A listing of the major plasticizers and their compatibilities with different polymer systems is provided in "Plasticizers," A. D. Godwin, in Applied Polymer Science 21st Century, edited by C. D. Craver and C. E. Carraher, Elsevier (2000); pp. 157-175.
Plasticizers can be characterized on the basis of their chemical structure. The most important chemical class of plasticizers is phthalic acid esters, which accounted for about 85% worldwide of PVC plasticizer usage in 2002. However, in the recent past there has been an effort to decrease the use of phthalate esters as plasticizers in PVC, particularly in end uses where the product contacts food, such as bottle cap liners and sealants, medical and food films, or for medical examination gloves, blood bags, and IV delivery systems, flexible tubing, or for toys, and the like. For these and most other uses of plasticized polymer systems, however, a successful substitute for phthalate esters has heretofore not materialized.
One such suggested substitute for phthalates are esters based on cyclohexanoic acid. In the late 1990's and early 2000's, various compositions based on cyclohexanoate, cyclohexanedioates, and cyclohexanepolyoate esters were said to be useful for a range of goods from semi-rigid to highly flexible materials. See, for instance, WO 99/32427, WO 2004/046078, WO 2003/029339, WO 2004/046078, U.S. Patent Publication No. 2006-0247461, and U.S. Pat. No. 7,297,738.
Other suggested substitutes include esters based on benzoic acid (see, for instance, U.S. Pat. No. 6,740,254, and also co-pending, commonly-assigned, PCT Publication No. WO2009/118261A1, and polyketones, such as described in U.S. Pat. No. 6,777,514; and also co-pending, commonly-assigned, U.S. Patent Application Publication No. 2008-0242895 A1. Epoxidized soybean oil, which has much longer alkyl groups (C16 to C18) has been tried as a plasticizer, but is generally used as a PVC stabilizer. Stabilizers are used in much lower concentrations than plasticizers. Co-pending and commonly assigned U.S. patent application Ser. No. 12/653,744, filed Dec. 17, 2009, discloses triglycerides with a total carbon number of the triester groups between 20 and 25, produced by esterification of glycerol with a combination of acids derived from the hydroformylation and subsequent oxidation of C3 to C9 olefins, having excellent compatibility with a wide variety of resins and that can be made with a high throughput.
U.S. Pat. Nos. 1,909,092 and 2,233,513, both to Brunson and incorporated herein by reference, disclose esters of aryl benzoic acids of the formula R—CO—R′—COOH, wherein R and R′ are aromatic nuclei, including esters derived from saturated monohydric alcohols containing three or more carbon atoms in the molecule, such as iso-propyl, butyl, isoamyl, beta-ethoxyethyl, beta-butoxyethyl, benzyl and cyclohexyl alcohols. The esters are disclosed as useful as plasticizers for nitrocellulose.
U.S. Pat. No. 2,372,947 to Gresham, incorporated herein by reference, discloses polyvinyl halide compositions containing alkyl esters of ortho-benzoyl benzoic acid, wherein the ester group is a C4 to C16 alkyl, such as butyl o-benzoyl benzoate, 2-ethylhexyl o-benzoyl benzoate, lauryl o-benzoyl benzoate, and cetyl o-benzoyl benzoate.
U.S. Pat. No. 3,110,724 to Woodbridge et al., incorporated herein by reference, discloses a process of reacting an aromatic anhydride with another aromatic compound over a catalyst and esterifying the resulting intermediate with a polyalkylene glycol to form surfactants.
Co-pending and commonly owned U.S. Provisional Patent Application Ser. No. 61/227,116, filed Jul. 21, 2009, herein incorporated by reference, discloses the esterification of keto acids derived from the acylation of aromatic compounds with cyclic anhydrides.
Thus what is needed is a method of making a general purpose non-phthalate plasticizer having and providing a plasticizer having suitable melting or chemical and thermal stability, pour point, glass transition, increased compatibility, good performance and low temperature properties.

Aromatic acylation with cyclic anhydride for plasticizer production

EXXONMOBIL RESEARCH AND ENGINEERING COMPANY


A hydrogen generating system is provided for use in internal combustion engines for increasing the efficiency of the engine and decreasing emissions from the engine. The hydrogen generating system has an electrolysis cell for generating hydrogen and oxygen gases by electrolysis of an aqueous solution, a power source for providing electrical power to the electrolysis cell, an outlet flow means for introducing the generated gases into the intake manifold system of an internal combustion engine, a monitoring means for monitoring the operating conditions of the hydrogen generating system, and a control means connected to the monitoring means for controlling the operation of the hydrogen generating system in response to the monitoring means. Various devices and systems are added to facilitate use and overcome previous problems with prior hydrogen generating systems.

The use of hydrogen as a supplemental fuel in motor vehicle engines has been proposed to increase the performance of the engine. Hydrogen and oxygen, when used as part of the air/fuel mixture for the operation of the engine, have been found to increase the performance of the engine by increasing the mileage and by reducing the amount of emissions from the engine. The hydrogen and oxygen may be generated through electrolysis of an aqueous solution with the gases given off being mixed with the fuel and air supplied to the engine.
The generation of small quantities of hydrogen and oxygen using one or more electrolysis cells with the hydrogen and oxygen generated then being combined with the usual air/fuel mixture to improve the efficiency of internal combustion engines has been proposed in a number of prior patents. Some systems of these prior patents utilized the alternator or an auxiliary generator attached to the engine to provide the electrical power for the system.
One example of such a system is shown in U.S. Pat. No. 4,271,793. This patent describes an internal combustion engine having a fuel system for feeding an air/fuel mixture to the combustion chamber and an electrical generation system, such as an alternator. An electrolysis cell was attached adjacent to the engine to generate hydrogen and oxygen upon the application of a voltage between the cathode and the anode of the electrolysis cell. A gas delivery connects the cell to the engine fuel system for feeding the hydrogen and oxygen to the engine combustion chambers. The electrolysis cell was placed under a predetermined pressure to prevent the electrolyte from boiling off. The cell also included a cooling system and other safety features.
Another electrolysis cell is disclosed in U.S. Pat. No. 5,231,954. The electrolysis cell of this patent was used for generating hydrogen and oxygen gases which were added to the fuel delivery system as a supplement to the gasoline or other hydrocarbons burned therein. The cell was designed to reduce the hazard of explosion by withdrawing the gases through a connection with the vacuum line of the positive crankcase ventilation (PCV) system of the engine and by utilizing a slip-fitted top cap for the electrolysis cell.
A further example of an electrolysis cell for use in connection with an internal combustion engine, for generating hydrogen and oxygen gases is shown in U.S. Pat. No. 5,458,095. This system utilized an electric pump to draw the hydrogen and oxygen gases out of the cell, where the outlet side of the pump was connected to the air intake manifold using a hose having a terminating insert. The insert was formed from copper tubing bent at an appropriate angle to insure that the hydrogen and oxygen gas outlet from the pump was in the same direction as the downstream airflow in the air intake manifold.
Although much work has been conducted to advance automotive electrolysis systems, these systems have not been generally accepted due to safety and convenience concerns. A hydrogen generating system is required which overcomes at least some of the safety and convenience problems of previous systems.

Hydrogen generating apparatus and components therefor


The present invention provides a catalyst substance that is stable and performs well in the synthesis of ammonia, one of the most important chemical substances for fertilizer ingredients and the like. The catalyst substance exhibits catalytic activity under mild synthesis conditions not requiring high pressure, and is also advantageous from a resource perspective. Further provided is a method for producing the same. This catalyst comprises a supported metal catalyst that is supported on a mayenite type compound including conduction electrons of 1015 cm−3 or more and serving as a support for the ammonia synthesis catalyst. The mayenite type compound used as the support may take any form, including that of powder, a porous material, a sintered body, a thin-film, or a single crystal. Use of this catalyst makes it possible to increase the electron donating ability toward a transition metal.

Artificial fertilizers (ammonium sulfate and urea fertilizer), which are inevitable in producing crops to support continued existence of the human race, are produced from ammonia. A technique for synthesizing ammonia by employing nitrogen and hydrogen as starting materials and by utilizing a catalyst made of primarily iron was discovered by Haber and Bosch. That technique (called a "Haber-Bosch process") has been used as an essential technique to support the life of humankind up to now even after the lapse of about one century since the Haber-Bosch process was industrially completed in 1910's.
The Haber-Bosch process includes a step of direct reaction of a gas mixture of nitrogen and hydrogen to perform a reaction under high-temperature and high-pressure conditions of 400 to 600° C. and about 20 MPa to about 100 MPa by utilizing a doubly promoted iron catalyst, which is primarily made of Fe3O4 containing several weight percent of Al2O3 and K2O, and a step of separating ammonia produced through the reaction of N2+3H2→2NH3 by cooling the produced ammonia or absorbing the same with water. Even at present, such a technique is industrially used in a production process substantially in the same manner as that when it was initially completed.
On the other hand, there is a known catalyst using, as a transition metal element having ammonia synthesis activity at low temperature of 300° C. or below, one kind of elements selected from among Mo, W, Re, Fe, Co, Ru, and Os, or any one of combinations of Fe and Ru, Ru and Re, and Fe and Mo substantially in a metallic state (Patent Literature (PTL) 1). Ammonia synthesis methods using, as a catalyst, any of group 8 or 9 transition metals, e.g., Fe, Ru, Os and Co, have also been developed (PTLs 2 to 4). Methods using, particularly, ruthenium as a catalyst for ammonia synthesis have further been developed (PTLs 5 to 8). Moreover, ammonia synthesis methods using, as a catalyst, any of nitrides of group 8 or 6B transition metals and composite nitrides of Co and Mo, have been developed (PTLs 9 and 10).
In addition, a method of producing ammonia from nitrogen and water vapor through plasma contact by employing a catalyst containing, in a support material, a component that has catalytic activity and that is selected as at least one transition metal from a group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Fe, Ru, Os, Co, Rh, Ir, Ni, Pd, Pt, Mn, and Cu, is filed for a patent application (PTL 11).
Hitherto, in order to utilize an ammonia synthesis catalyst, e.g., Ru or Fe, with high efficiency, magnesia, alumina, graphite, ceria, etc. have been used as catalyst supports, and alkali metals, alkali metal compounds, alkaline earth metal compounds, etc. have been used as promoters.
When an acidic compound, e.g., alumina, is employed as the support, it has usually been required to add a large amount of compound, which serves as a promoter having a high electro-negativity, for the purpose of increasing an electron donating ability and providing a catalyst with high activity.
Meanwhile, there is a chemical compound, having a mineral name of "mayenite", among calcium aluminosilicates containing CaO, Al2O3 and SiO2 as ingredients. A compound having the same type of crystal structure as a crystal of the mayenite is called a "mayenite type compound". The mayenite type compound has a representative composition of 12CaO.7Al2O3 (hereinafter denoted by "C12A7"). It is reported that a C12A7 crystal has a unique crystal structure where two of 66 oxygen ions present in a unit cell, containing two molecules, are included as "free oxygen ions" in a space within a cage, which forms the framework structure of C12A7 (Non Patent Literature (NPL) 1).
After 2003, the inventors have clarified that those free oxygen ions can be replaced with various anions. In particular, all of the free oxygen ions can be replaced with electrons by holding C12A7 in a strong reducing atmosphere. C12A7 in which the free oxygen ions are replaced with electrons can be expressed by a chemical formula of [Ca24Al28O64]4+(e−)4 (hereinafter denoted by [C12A7:e−]). A substance containing electrons substituted for anions as described above is called an electride, and the electride is featured in having a good electrical conductivity (NPL 2).
Furthermore, the inventors have found C12A7:e− that is an electronic conducting mayenite type compound, 12SrO.7Al2O3 that is a compound being of the same type as C12A7, a mixed crystal compound of C12A7 and 12SrO.7Al2O3, and a synthesis method thereof (PTL 12). An invention regarding a mayenite type compound in which Al is partly replaced with Ga or In is also filed for a patent application (PTL 16). Such a mayenite type compound is suitable as electrode materials requiring high-temperature heat treatment, e.g., a PDP protective film material and a charge electron injection material in an organic EL device. The inventors have further found that C12A7:e− containing conduction electrons at a concentration of 1×1019/cm3 or more and a compound being of the same type as C12A7 can be obtained by (A) a method of annealing a C12A7 single crystal at high temperature in vapor of an alkali metal or a alkaline earth metal, (B) a method of ion-implanting inactive ions into a C12A7 single crystal, or (C) a method of direct solidification from a melt of a C12A7 single crystal in a reducing atmosphere (PTL 13).
Moreover, the inventors have succeeded in obtaining C12A7:e−, which exhibits metallic electrical conductivity, by annealing a C12A7 single crystal in vapor of titanium metal (Ti), and have filed inventions regarding a production method of the C12A7:e− and usage thereof as an electron emission material for a patent application (PTL 14). The C12A7:e− exhibiting metallic electrical conductivity can also be directly synthesized in the form of powder by mixing CaCO3 and Al2O3 at a ratio of 11:7, heating the mixture at 1300° C., and further heating an obtained product in a vapor atmosphere of metallic Ca (NPL 3).
Since electrons included in C12A7:e− are loosely trapped within a cage of a positively charged framework structure, those electrons can be taken out to the exterior by applying a voltage or by employing chemical methods. On the basis of an idea that those electrons taken out to the exterior can be used in reductive reaction, the inventors have invented a method of producing secondary alcohol and diketone compounds by reducing ketone compounds by the electrons included in C12A7:e− and have filed the method for a patent application (PTL 15).

Ammonia synthesis catalyst and ammonia synthesis method