A stem package with good high frequency characteristics for high-speed transmission at 10 Gbps and higher includes a stem which has an under surface, an upper surface and one or more through holes penetrating from the upper surface to the under surface, a mount for mounting, with an optical semiconductor device, on the upper surface, a lead terminal for signal supply penetrating one of the through holes with an insulator between the stem and the lead terminal, the upper surface having an earth conductor adjacent to the lead terminal for signal supply and Projecting from the upper surface so that a difference between the characteristic impedance of the transmission line constituted by the through hole, the insulator, and the lead terminal for signal supply and the characteristic impedance of the transmission line constituted by a lead terminal for signal supply projecting from the upper surface is small.

1. Field of the Invention
This invention relates to packages for optical semiconductor devices, especially a package for optical semiconductor devices that are excellent in high frequency characteristics.
2. Description of the Background Art
In recent years, the transmission rate is accelerated one after another from 600 Mbps to 2.5 Gbps, moreover to 10 Gbps, in the field of optical communications. Therefore, the light emitting devices and the photo detectors for optical transmitter-receivers are required for quick-operating. With this, good high frequency characteristics and low cost are required for the packages of the light emitting devices and the photo detectors. There are a stem type package in coaxial form having a simple structure and a butterfly type package using a strip line in box form for the light emitting devices and the photo detectors.
The conventional stem package includes a stem-body 113, as shown in FIG. 9A and FIG. 9B. A pair of lead terminals 105 for photodiodes and a lead terminal 112 for signal supply are inserted in respective through holes of stem-body 113 and insulated by glass 106. Moreover, a sub-mount 102 and a mount 901, in which a semiconductor laser 103 is mounted, adjoins the lead terminal 112 for signal supply on the upper surface of the stem-body 113, and a recess 109, in which sub-mount 108 and the photodiode 107 for monitoring are attached, is located at the upper surface of stem-body 113. Here, the recess 109 is located where the laser light from the monitor face, opposite to light emitting face of the semiconductor laser diode, is input into the photodiode 107 for monitoring, mounted on sub-mount 108. In addition, an earth lead terminal 114 is attached as in FIG. 9A.
A semiconductor laser 103 is mounted on one side of mount 901 with sub-mount 102 between them, the photodiode 107 for monitor is mounted on the recess 109 with sub-mount 108 between them and then the predetermined lead terminals are connected with a wire 104,110,111. Thereby, a semiconductor laser device having the stem formed as mentioned above is constituted (for example, U.S.P. non examined publication No. 2002/0041612A1, and 2002/0141142A1).
In the semiconductor laser device formed as mentioned above, when a voltage of about 1.5 V is applied between the lead terminal for signal supply 112 and the earth lead terminal 114, an electrical current of tens of mA flows in the semiconductor laser device and laser light is emitted. The light emitted from the face opposite to the light emitting face is detected at the monitor photodiode 107 to control the quantity of the emitted light.
Stem packages for optical semiconductor device, with good heat radiating properties for radiating the heat generated by the semiconductor laser devices, are shown in Japanese Non-examined Patent Publications No.58-98995, No.07-240565 and U.S. Pat. No. 5,262,675.
However, in the conventional package for an optical semiconductor device, although the high frequency characteristics of a butterfly package are good, it is made very expensive by the complicated structure. On the other hand, although the stem package is cheap, high frequency characteristics are not good, so it is difficult to use for high-speed transmission at 10 Gbps or more.

Package for optical semiconductor device


A method of fabricating a semiconductor package is provided, including: cutting a substrate into a plurality of interposers; disposing the interposers in a plurality of openings of a carrier, wherein the openings are spaced from one another by a distance; forming a first encapsulant to encapsulate the interposers; removing the carrier; and disposing at least a semiconductor element on each of the interposers. By cutting the substrate first, good interposers can be selected and rearranged such that finished packages can be prevented from being wasted due to inferior interposers.

1. Field of the Invention
The present invention relates to semiconductor packages, and, more particularly, to a semiconductor package having through silicon vias (TSV), a method of fabricating the semiconductor package, and an interposer structure of the semiconductor package.
2. Description of Related Art
Flip-chip technologies facilitate to reduce chip packaging sizes and shorten signal transmission paths and therefore have been widely used for chip packaging. Various types of packages, such as chip scale packages (CSP), direct chip attached (DCA) packages and multi-chip module (MCM) packages, can be achieved through flip-chip technologies.
In a flip-chip packaging process, a great coefficient of thermal expansion (CTE) mismatch between a chip and a packaging substrate adversely affects the formation of joints between conductive bumps of the chip and contacts of the packaging substrate, thus likely resulting in delamination of the conductive bumps from the packaging substrate. On the other hand, along with increased integration of integrated circuits, a CTE mismatch between a chip and a packaging substrate induces more thermal stresses and leads to more serious warpage, thereby reducing the product reliability and resulting in failure of a reliability test.
To overcome the above-described drawbacks, a silicon interposer is disposed between a semiconductor chip and a packaging substrate. Since the silicon interposer and the semiconductor chip are made of similar materials, the above-described drawbacks caused by a CTE mismatch can be effectively prevented.
FIGS. 1A to 1C show a method of fabricating a conventional semiconductor package 1.
Referring to FIG. 1A, a plurality of TSVs 100 are formed in a silicon interposer 10, and a redistribution layer (RDL) structure (not shown) is formed on an upper side of the silicon interposer 10. A plurality of semiconductor chips 11 are disposed on the upper side of the silicon interposer 10 and electrically connected to the TSVs 100 through a plurality of conductive bumps 110.
Referring to FIG. 1B, an encapsulant 12 is formed on the silicon interposer 10 to encapsulate the semiconductor chips 11, thereby forming a plurality of packages 1a.
Referring to FIG. 1C, an RDL structure 13 is formed on a lower side of the silicon interposer 10 according to the practical need, and then a singulation process is performed to obtain a plurality of singulated packages 1a. Each of the packages 1a is disposed on and electrically connected to a packaging substrate 15 through a plurality of conductive bumps 14.
However, forming the through silicon vias 100 in the silicon interposer 10 results in a high fabrication cost. Further, according to the process yield, some units 10′ of the silicon interposer 10 may be inferior. Although a good semiconductor chip 11 can be selected by performing an electrical performance test after a singulation process, the good semiconductor chip 11 may be disposed on an inferior unit 10′. As such, the finished package 1a cannot pass a reliability test, and consequently the good semiconductor chip 11 must be wasted along with the inferior unit 10′, thereby increasing the fabrication cost.
On the other hand, if inferior units 10′ are detected before forming the encapuslant 12 so as to avoid disposing of good semiconductor chips 11 on the inferior units 10′, it will become difficult to control the amount and flow path of the encapsulant 12. Consequently, the semiconductor chips 11 cannot be evenly covered by the encapsulant 12.
In addition, since the silicon interposer 10 is not singulated before disposing the semiconductor chips 11 on the silicon interposer 10, the semiconductor chips 11 are required to be less in size than the corresponding units 10′, such that the number of the electrodes of the semiconductor chips 11 is limited. Consequently, the module function and efficiency of the units 10′ are limited.
Therefore, how to overcome the above-described drawbacks has become urgent.

Method of fabricating semiconductor package having an interposer structure

Siliconware Precision Industries Co., Ltd.


A medical cutting device for producing thin cartilage disks has a device body with a first holding device with a first working section having a first recess disposed on a top side of the device body such that the first recess is entirely or partially enclosed by a first delimiting ridge and, a connecting section that is directly, rigidly adjoined by the first working section and a cover with a counterpart section to the connecting section that is directly, rigidly adjoined by a first pressure section, which comprises a central, first pressure plate that is resiliently held in the first pressure section and, in an operating state for producing thin cartilage disks, is disposed opposite the first recess, which is entirely or partially enclosed by the first delimiting ridge.

The invention relates to a medical cutting device for producing thin cartilage disks. The device includes a device body, a cover and a first holding device having a first section with a first recess disposed on the top side of the device body, the recess entirely or partially enclosed by a first delimiting ridge. The cutting device is made of a sterilizable material.
Frequently in medical and surgical practice, it becomes necessary to cut thin, endogeneous cartilage disks out of a larger piece of cartilage, e.g., from the auricle, the tragus, the cartilaginous portion of the upper bony rib or the nasal septum. For example, it may be necessary to examine special properties of the main body in greater detail, in particular under a microscope. In otorhinolaryngology, thin cartilage disks of this type also are required in many surgical applications, such as in the middle ear region, to cover a middle ear prosthesis, to restore the posterior wall of the auditory meatus or for the plastic repair of a defect of the tympanic membrane. Thin cartilage disks of this type are also used in many nasal surgeries in order to perform functional or aesthetic corrections of the nose.
A cutting device is described in EP 0 483 567 B1, using which thin cartilage disks having a thickness that is specifiable, within certain limits, are cut out of a larger piece of cartilage quickly reliably and with a consistent level of quality. However, to obtain different thicknesses of the cartilage disks that are created, special shims having a known thickness must be placed in the cutting device. These shims, like the cutting device itself, must be thoroughly cleaned and kept sterile and they must be handled in this manner separately before every operation, which is a time-consuming process that is susceptible to error. Considering that an average ear, nose and throat (ENT) hospital has three to four surgical suites, and that, at peak times, fifteen to twenty patients may be operated on in one day, it is possible that a cartilage cutter must be made available up to fifteen times a day. This poses a great logistical challenge in terms of supplying sterilized materials.
Moreover, handling the shims is not entirely easy. For example, due to the small size of the shims, it is not always possible to label them adequately and in an easily recognized manner, even though this is necessary in order to ensure that precisely the proper shim having the particular size that is required is available during the operation. In addition, special skills are required to insert the relatively small shims into the cutting device correctly and to fix them in position therein.
In order to ensure that thin cartilage disks having certain different thicknesses are created in a consistent level of quality, even without using the known shims, US 2010/0286693 A1 proposes that a first recess disposed in a first working section on a top side of the device body is closable via a first projection disposed on a top side of the cover, wherein the first lateral delimiting ridge comprises a first guide slot into which a cutting blade is inserted and which extends from an end face of the first section and extends parallel to the bottom surface of the first recess at a predetermined, first distance therefrom. In the device according to US 2010/0286693 A1, at least one second holding device is provided that comprises a second section having a second recess, which is disposed on the top side of the device body, the second recess being entirely or partially enclosed by a second delimiting ridge, and being closable via a second projection which is disposed on the top side of the cover. The second lateral delimiting ridge comprises a second guide slot, into which a cutting blade is inserted and which extends from an end face of the second section and extends parallel to the bottom surface of the second recess at a predetermined, second distance therefrom.
Since different distances between the particular guide slot and the corresponding bottom surface of the particular recess may be selected for different holding devices, this known cutting device makes it possible to create cartilage disks having certain different thicknesses by using the different holding devices without the need to use the shims that are indispensible in the previous prior art. In addition, the fact that the new cutting device is handled between the thumb and the index finger increases the operating surgeon's confidence in the actual cutting procedure, because all parts, due to the geometry and design thereof, are moveable relative to one another in a reliable and controlled manner.
The disadvantage of this known cutting device is that the production of the parts is highly complex. Products produced using injection-molding technology in particular have the characteristic that considerable problems can result when walls are very thin. As a result and due to the financial outlay involved, the products typically cannot be produced in a cost-effective manner.


A mobile device or the like having a 3-axis electronic compass is rotated, and the outputs from magnetic sensors disposed in the three axis directions are input to a first arithmetic processing unit (11) so as to obtain the magnetic data X, Y, and Z. By inputting the magnetic data X, Y, and Z to a second arithmetic processing unit (12), gains Gx and Gz can be obtained. A control unit (16) generates access codes x0 and z0 corresponding to the gains Gx and Gz. The correspondence between the access codes x0 and z0 and inclination angle (pitch angle) α or between the gains Gx and Gz and inclination angle (pitch angle) α is tabulated and stored in a memory unit (17). The control unit (16) accesses the memory unit (17) so as to obtain an inclination angle (pitch angle) α0 corresponding to the access codes x0 and z0.

In a related art, a method is proposed in which an azimuth is detected while taking into account an error caused by an inclination angle (a posture angle with respect to the horizon plane) of a compass if the compass is set at an angle relative to the horizon plane (refer to, for example, Patent Document 1).
In a method described in Patent Document 1, a magnetic sensor 100, a hall element 24, and an inclination sensor 22 are integrated into one. The magnetic sensor 100 detects two axis components of a magnetic vector defined in a plane parallel to a substrate. The hall element 24 detects a component of the magnetic vector in a direction perpendicular to the substrate. The inclination sensor 22 detects an inclination angle of the substrate. A proper azimuth is detected by correcting the two axis components detected by the magnetic sensor 100 and the vertical component detected by the hall element 24 on the basis of the inclination angles (a roll angle and a pitch angle) of the substrate detected by the inclination sensor 22.
[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2002-196055

Inclination sensor and azimuth measuring apparatus using inclination sensor


There is provided a sternal closure system for re-approximating the left and right halves of a patient's longitudinally incised sternum during a surgical procedure in the thoracic cavity. The system includes a first anchor, disposed inside the left half of the sternum, a second anchor, disposed inside the right half of the sternum, and a fixing element for rigid connection between the first and the second anchors, respectively disposed within the left and right halves of the sternum, facilitating separation of the left and right halves of the sternum closed in this way, in case of post-operative emergency surgical procedures. An apparatus for fixing and removing the anchors is also provided.

Various types of surgical procedures are currently performed to investigate, diagnose, and treat diseases involving a tissue or organs located in a patient's thoracic cavity (e.g., the heart, lungs, and the like).
Using current techniques, many of those procedures typically require a partial or median sternotomy to gain access into the patient's thoracic cavity. A partial or median sternotomy is a procedure by which a saw or other appropriate cutting instrument is used to make a midline, longitudinal incision along a portion or the entire axial length of the patient's sternum, allowing two opposing sternal halves to be separated laterally. A large opening into the thoracic cavity is thus created, through which a surgeon may directly visualize and operate upon the heart and other thoracic organs or tissues.
Following the surgical procedure within the thoracic cavity, the two severed or separated sternal halves must be reapproximated (closed). Traditionally, the sternal halves have been reapproximated with stainless steel wires which are wrapped around or through the sternal halves so as to exert medial compression thereon and twisted together to approximate the sternum. There are inventions disclosed and claimed in Pasque, Michael U.S. Pat. No. 5,423,821 and WO9641581A1, Monassevith, Leonid U.S. Pat. No. 6,171,320 and IL 119911.
Pasque discloses a device and method for closing the sternum using selected plastics or nylon fibers or other strand expandable materials for suturing. A fastener device is also disclosed.
Monassevitch discloses a surgical clip including three lengths of wire integrally formed of a shape memory alloy, two of which form closed geometrical shapes similar in configuration and magnitude to each other, and third connects the first two.
Other methods of sternum repair include the use of band or strap assemblies. Among them are inventions disclosed and claimed in Green, David et al., U.S. Pat. No. 5,417,698 and EP 592960A2; Burgess, Frank et al., U.S. Pat. No. 4,944,753; Golds, Ellen et al., U.S. Pat. Nos. 5,356,412; 5,356,417; EP 596277A1 and EP 597258A1; Sutherland, Lloyd et al., U.S. Pat. No. 4,730,615; Johnson, Greg et al., U.S. Pat. Nos. 6,045,572; 6,080,185; PCT/US99/24164 and Barry, Joseph U.S. Pat. No. 4,583,541.
Such assemblies typically include a locking mechanism, which secures a band or strap in a closed looped configuration about the sternum positions.
For example, Green, David et al., U.S. Pat. No. 5,417,698 and EP 592960A2 disclose an instrument for tightening wound closure elements around human sternum. The instrument includes two handles pivotally attached to one another and movable between an open and closed position. A retaining system is also provided to tighten wound closure material.
Burgess, Frank et al. in U.S. Pat. No. 4,944,753 disclose a method and device for producing an artificial retro-sternal tunnel or space at the conclusion of a sternotomy, and an implantable elongate member for closure of the longitudinally severed sternum.
Golds, Ellen et al. in U.S. Pat. Nos. 5,356,412; 5,356,417; EP 596277A1 and EP 597258A1 disclose a strap assembly to be looped about split portions of sternum including a flexible elongated member and a buckle member with a clamp element rotatably mounted within buckle member from a non-strap securing position to the strap securing position in response to tensional forces exerted on the strap during tensioning thereof about the tissue portion.
Sutherland, Lloyd et al. in U.S. Pat. No. 4,730,615 disclose a sternum closure device made of biocompatible metal coated with a biocompatible polymer and comprising a head portion, tail portion and flexible spine portion. The head portion includes a locking tang to prevent backward movement of the spine portion once it is received and engaged in the head portion.
Johnson, Greg et al. in U.S. Pat. Nos. 6,045,572; 6,080,185 and PCT/US99/24164 disclose a system for closing together two sides of sternum, including a first and second grommets adapted to be disposed on two sides of the sternum, a wire suture, a mechanism for placing a grommet into the sternum and a placement tool. Besides, they disclose a method of threading a wire suture through a hole in a sternum and a method of bringing together two sides of a sternum.
Finally, Barry, Joseph in U.S. Pat. No. 4,583,541 discloses a sternum closure device having an elongated strap-like member provided with a flat back surface which flatly overlies the anterior surface of a severed or separated sternum. The forward surface of the member is convex and longitudinally grooved for nesting the tied or twisted end portions of suture wires extending across the posterior of the sternum and projecting forwardly through cooperating pairs of holes formed in the member on opposing sides of the groove.
While utilization of steel wires and strap assemblies have been widely accepted for sternum repair, these devices present a number of disadvantages. Steel wires can and do break, and provide insufficient (non-uniform) clamping force resulting in sternal nonunion. Steel wires are difficult to maneuver and place around the sternum. The cut ends of the steel wires are also sharp and can pierce through the surgeon's gloves or fingers. In addition, the small diameter of the steel wires can cause the wires to migrate into or through the tissue surrounding the sternum region or into the sternal bone itself over time. This can lead to significant patient pain and discomfort in addition to slowing the postoperative recovery and increasing the risk of sternal infection. Moreover, the strap mechanisms of band assemblies are often relatively structurally complex and are difficult to precisely apply about the sternum. There are also healing problems associated with the use of steel wires and band assemblies due to improper forces exerted by these devices which can cause unwanted bone movements leading to raking and rubbing of surrounding tissue or bone.
Several other techniques of sternal reapproximation have been proposed both for primary closure following a median sternotomy and for reclosure following post-operative emergency surgical procedures. One such sternal closure technique and kit for performing same is described in Zurbrugg, Heinz, U.S. Pat. No. 6,030,410. According to this method, staples are applied to the sternal halves to reinforce the bone adjacent to the suture outlets so as to prevent the suture from cutting into the bone. As each suture loop is tightened to adapt the sternum, the suture loop abuts the staples adjacent the suture outlets. A sterile surgical staple gun is employed to install the staples in the sternal halves.
This method and device and other similar to them, are not optimal, however, because they require direct fixation of the wire to the bone with staples. This makes difficult reentry into the thoracic cavity.
Gabbay, Slomo in U.S. Pat. No. 4,792,248 describes a sternum closure device used for holding together the halves of a split sternum. The device described therein is composed of two plates, one anterior and one posterior to the sternum, that are fixed to each other and to the sternum by means of threaded rods into internally threaded posts positioned in predrilled holes through the bone on either side of the sternotomy.
There are also known methods and apparatus for stapling together severed sternum, including a staple applying tool adapted to drive the staples into or around the sternum halves and lock together these sternum halves. Among them there are U.S. Pat. No. 5,163,598 by Peters, Rudolf et al. and U.S. Pat. No. 4,122,989 by Kapitanov, Nikolai et al. As disclose Peters, Rudolf et al., the sternum stapling apparatus includes a distal shoe with staple forming anvil, a piston within caliper assembly, a staple cartridge and the adjusting tool including a pair of jaws, one having a fulcrum lug and the other having two spaced lugs, whereby the staple may be bent by closure of the lugs together to decrease the linear spacing of the staple legs and increase the abutting force of the bone tissue portions. Kapitanov, Nikolai et al. disclose a surgical instrument for suturing sternal fragments with metal staples including an anvil unit which has two elongated jaws aligned with each other and having inner surfaces facing each other and formed with longitudinal guiding grooves for a staple. The front ends of the jaws carry anvils for bending the tips of the staples. In similar apparatus there may be used special compression bone clips and staples such as described by Wevers, Henk et al. in U.S. Pat. No. 4,444,181 and Murray, William in U.S. Pat. No. 3,960,147.
This device, and others similar to it, are not optimal, however, because they make reentry into the thoracic cavity through the sternotomy extremely difficult if a medical emergency arises during the surgical procedure or post-operative requiring relatively quick access to the organs and/or tissues within the patient's thoracic cavity.

Sternal closure system, method and apparatus therefor


A chip-on-film package may include a tape wiring substrate, a semiconductor chip mounted on the tape wiring substrate, and a molding compound provided between the semiconductor chip and the tape wiring substrate. The tape wiring substrate may include a film having upper and lower surfaces. Vias may penetrate the film. An upper metal layer may be provided on the upper surface of the film and include input terminal patterns and/or output terminal patterns. The input terminal patterns may include ground terminal patterns and/or power terminal patterns. A lower metal layer may be provided on the lower surface of the film and include a ground layer and/or a power layer. The ground layer and the power layer may cover at least a chip mounting area.

1. Field of the Invention
Example embodiments of the present invention relate in general to a tape wiring substrate and a tape package using the tape wiring substrate and, more particularly, to a tape wiring substrate that may have a dual metal layer and a chip-on-film package that may implement the tape wiring substrate.
2. Description of the Related Art
Flat panel displays may include, for example, a liquid crystal display ("LCD") for portable phones, a thin-film transistor liquid crystal display ("TFT LCD") for computers and plasma display panels ("PDP") for domestic use. A flat panel display may include a component part known in the art as a tape package. In some applications, the tape package may have fine pitch wiring patterns.
Tape packages may include a tape wiring substrate. The two principal types of tape packages may be a tape carrier package ("TCP") and a chip on film ("COF") package. The tape wiring substrate of a TCP may have a chip mounting window in which a semiconductor chip may be mounted via an inner lead bonding method (for example). The tape wiring substrate of a COF package may not include a chip mounting window. Here, the semiconductor chip may be flip chip bonded to the tape wiring substrate. As compared to the TCPs, the COF packages may allow a thinner tape wiring substrate and/or finer pitch wiring patterns.
In the COF packages, I/O terminal patterns may act as external connection terminals, instead of solder bumps. The I/O terminal patterns may be directly attached to a printed circuit board or a display panel.
FIG. 1 is a plan view of a conventional COF package 100. FIG. 2 is a cross-sectional view taken along the line II-II of FIG. 1.
Referring to FIGS. 1 and 2, the COF package 100 may include a tape wiring substrate 20. A semiconductor chip 10 may be flip chip bonded to the tape wiring substrate 20. A molding compound 40 may seal the flip chip bonded portion through an underfill process.
The semiconductor chip 10 may have an active surface that may support electrode pads 12. The electrode pads 12 may be provided along the edge portions of the active surface. Electrode bumps 16 may be provided on the electrode pads 12. The electrode bumps 16 may include input bumps 17 and output bumps 18, for example. The input bumps 17 may include ground bumps 17a and power bumps 17b, for example.
The tape wiring substrate 20 may include a base film 21, and an upper metal layer 24 provided on the upper surface 22 of the base film 21. The base film 21 may have a chip mounting area confronting the semiconductor chip 10. The chip mounting are may be located in the center portion of the base film 21. The base film 21 may include sprocket holes 29. The sprocket holes 29 may be arranged along the base film 21 at predetermined intervals. An end of the upper metal layer 24 may be connected to the electrode bumps 16. Another end of the upper metal layer 24 may extend outwards from the chip mounting area. The upper metal layer 24 may include input terminal patterns 25 and output terminal patterns 26. The input terminal patterns 25 may include input terminal patterns for ground 25a ("ground terminal patterns") and input terminal patterns for power 25b ("power terminal patterns"). The input terminal patterns 25 may extend to one side of the base film 21 relative to the semiconductor chip 10, and the output terminal patterns 26 may extend to another side of the base film 21 relative to the semiconductor chip 10. The input and the output terminal patterns 25 and 26 may extend parallel to the arrangement of the sprocket holes 29.
When the semiconductor chip 10 is flip chip bonded to the tape wiring substrate 20, the ground bumps 17a may be bonded to the ground terminal patterns 25a and the power bumps 17b may be bonded to the power terminal patterns 25b.
Although conventional COF packages are generally thought to be acceptable, they are not without shortcomings. For example, to facilitate achievement of semiconductor products having lighter weight, smaller size, higher speed, multifunction and/or increased performance, the upper metal layer 24 may have fine pitch wiring patterns, the semiconductor chip 10 may be more miniaturized, and the number of electrode bumps 16 may be increased. Accordingly, the ground terminal patterns 25a and the power terminal patterns 25b may be reduced in pitch. The ground and the power terminal patterns 25a and 25b provided on the upper surface 22 of the base film 21 may have insufficient areas for stable ground and/or power supply, for example.
The conventional COF package 100 may insufficiently reduce electromagnetic waves and/or noise that may occur during operation of the semiconductor chip 10, which may result in poor electromagnetic interference and/or noise characteristics. Further, the conventional COF package 100 may unstably supply power to the semiconductor chip 10.

Tape wiring substrate and chip-on-film package using the same


The present invention relates to a method of generating implicit terrain data and an electronic apparatus for performing the method, and more particularly to a method of generating implicit terrain data and an electronic apparatus which are capable of minimizing a size of data while maintaining geographical quality of original terrain data.

In recent years, digital maps are widely used for cars, ships and air planes to check a location. Digital maps, which are utilized in various application systems based on a geographical information system (GIS), construct three-dimensional (3D) terrain via processing of digital map data stored in a storage device through a computer and represent the terrain via a display apparatus.
Digital maps are rendered by terrain modeling, wherein a digital elevation model (DEM) or contour line model is available. A DEM represents digital terrain via interpolation between height values (elevations) at grid points at regular intervals. A digital contour line model represents terrain through interpolation between contour lines.
A digital contour line model has a remarkably small data size as compared with a DEM but is not precise. A DEM is obtained by reading aerial photographs or satellite images and provide data with various resolutions based on an interval between grid points. Precision of terrain is determined on an interval between grid points and thus ultimately depends on a resolution of a DEM. High-resolution terrain data is precise but needs a substantially great data size, whereas low-resolution terrain data is not precise but needs a small data size.
Active use of high-resolution terrain data of digital maps is difficult due to limitation on computer resources available to provide terrain. In particular, only limited computer resources are allowed to be mounted in transportations frequently using digital maps, such as a car, ship and air plane, making it difficult to manage high-capacity data.

Method of generating implicit terrain data by performing lossless compression and lossy compression and electronic apparatus for performing the method

ELECTRONICS AND TELECOMMUNCATIONS RESEARCH INSTITUTE


Crystalline scintillator materials comprising nano-scale particles of metal oxides, metal oxyhalides and metal oxysulfides are provided. The nano-scale particles are less than 100 nm in size. Methods are provided for preparing the particles. In one method, used to form oxyhalides and oxysulfides, metal salts are dissolved in water, and then precipitated out as fine particles using an aqueous base. After the particles are separated from the solution, they are annealed under a flow of a water saturated hydrogen anion gas, such as HCl or H2S, to form the crystalline scintillator particles. The other methods take advantage of the characteristics of microemulsion solutions to control droplet size, and, thus, the particle size of the final nano-particles. For example, in one method, a first micro-emulsion containing metal salts if formed. The first micro-emulsion is mixed with an aqueous base in a second micro-emulsion to form the final nano-scale particles.

The present invention relates generally to a scintillation material for making scintillation detectors. More specifically, the invention provides a scintillation material comprising nano-scale particles of either a metal oxyhalide or a metal oxysulfide, and methods for preparing the same.
Scintillators are materials that convert high-energy radiation, such as X-rays and gamma rays, into visible light. Scintillators are widely used in detection and non-invasive imaging technologies, such as imaging systems for medical and screening applications. In such systems, high-energy photons typically pass through the person or object undergoing imaging and, on the other side of the imaging volume, impact a scintillator associated with a light detection apparatus. The scintillator typically generates optical photons in response to the high-energy photon impacts. The optical photons may then be measured and quantified by the light detection apparatus, thereby providing a surrogate measure of the amount and location of high-energy radiation incident on the detector. Additionally, scintillators may be useful in systems used to detect radioactive objects, such as contraband or contaminants, which might otherwise be difficult to detect.
With regard to non-invasive imaging techniques, one of the most important applications for scintillators is in medical equipment for the production of radiographic images using digital detection and storage systems. For example, in current digital X-ray imaging systems, such as CT scanners, radiation from a source is directed toward a subject, typically a patient in a medical diagnostic application. A portion of the radiation passes through the patient and impacts a detector. The surface of the detector converts the radiation to light photons which are sensed. The detector is divided into a matrix of discrete picture elements, or pixels, and encodes output signals based upon the quantity or intensity of the radiation impacting each pixel. Because the radiation intensity is altered as the radiation passes through the patient, the images reconstructed based upon the output signals provide a projection of the patient's tissues similar to those available through conventional photographic film techniques.
Another high-energy radiation based imaging system is positron emission tomography (PET), which generally employs a scintillator-based detector having a plurality of pixels typically arranged in a circular array. Each such pixel comprises a scintillator cell coupled to a photomultiplier tube. In PET, a chemical tracer compound having a desired biological activity or affinity is labeled with a radioactive isotope that decays by emitting a positron. Subsequently, the emitted positron interacts with an electron giving out two 511 keV photons (gamma rays). The two gamma rays are emitted simultaneously and travel in opposite directions, penetrate the surrounding tissue, exit the patient's body, and become absorbed and recorded by the detector. By measuring the slight difference in arrival times of the two photons at the two points in the detector, the position of the positron inside the target can be calculated. The limitations of this time difference measurement are highly dependent on the stopping power, light output, and decay time of the scintillator material.
In both CT and PET, a small pixel size is required to generate an accurate image, i.e., for good spatial resolution. To avoid pixel to pixel contamination of the light produced in each luminescent module, the scintillators are made from single crystals or transparent ceramic imaging plates that are cut into small segments, or diced. The smaller segments are used with collimating reflectors between the individual elements to maintain as much of the light toward an individual detector as is physically possible. The dicing process limits the size of the individual pixel, as both production costs and process difficulties increase as the pixel size gets finer.
For systems where a still smaller pixel pitch is required, such as in digital radiographic systems, phosphors such as needles of CsI and fiber optic scintillator (FOS) face plates have been used. However these scintillators do not meet the more stringent luminescence requirements for CT systems. Scintillators based on CsI have a long decay time, leading to afterglow which tends to wash out images. Furthermore, detectors based on FOS plates do not have the high conversion efficiency needed for accurate imaging.
In contrast to the complex scintillators used for imaging applications, scintillators used in the detection of radioactive contraband or contamination are often simple plastic films, made from such materials as polythiophene or polyanaline. However, these systems are not very specific to the type of radiation involved, and often may give false alarms.
Accordingly, there is a need for new scintillators that can be easily formed into materials with the small pixel sizes needed for application in CT and PET, while affording transparency and tailored luminescence properties.

Nano-scale metal oxide, oxyhalide and oxysulfide scintillation materials and methods for making same


Conveyor chains are provided which comprise free balls which are free to rotate in all directions thereby allowing for the stable conveyance of articles in any direction in the entire horizontal plane and at an increased speed in the direction of conveyance with reduced contamination in the conveyance environment. A conveyor chain 100 comprises a number of chain links 110 comprising a plurality of hinge portions 112 in a zigzag formation protruding from the front and rear end edges that are connected to each other in the longitudinal direction of the chain through hinge pins 120. Free balls 131 protrude from both the surface and back sides of the chain link 110 and are free to rotate while held in the chain link 110. Either the free balls 131 or ball holding portions 132, which hold the free balls 131, is made of polyacetal while the other is made of polyamide or polyester.

Conveyor belts for the conveyance of articles may comprise balls or rollers which can rotate. The articles can be quickly sorted during conveyance on such conveyor belts as they can be unloaded while being slid to a side of the conveyance line (see Japanese Laid-Open Patent Publication No. 2003-182829).
In such a conveyor belt, the belt module comprises vertically laminated first and second members. The conveyor belt is formed by connecting hinge portions formed in the first and second members of the modules by the use of hinge pins. Between the first and second members are balls or rollers which can rotate and allow for the articles to be discharged by sliding to a side of the conveying line.
However, the above-mentioned conventional conveyor belts comprise belt modules formed by vertically integrated first and second members wherein the balls are sandwiched between the first and second members. This formation causes sliding wear between the belt module and the balls.
Further, such conveyor belts comprise a belt module and balls that are made of polyacetal, which has excellent self-lubricating property so as to suppress sliding wear. Because the materials of the belt module and the ball are the same, however, the contact surfaces between the belt module and ball have high affinity and are likely to adhere to each other, thereby resulting in increased sliding wear.
Therefore, the above described belts have problems with accelerated wear. Further, a backlash in the conveyor belt or a change in the conveying level can occur due to the extra wear, whereby articles loaded on the balls of the belt cannot be conveyed stably. Additionally, the sliding wear will lead to the contamination of the conveyance environment with the powder and dust generated by the sliding wear.


A device for teaching, language skills is disclosed. In the teaching device, a predetermined number of questions are displayed on a display. The predetermined number is determined dependent on a level of a learner. The learner inputs answers to the questions to be displayed on the display. The answers are discriminated to be correct or incorrect. The device teaches correct answers for the incorrect answers repeatedly.. A question for a level of the learner which is higher than a predetermined level is removed from the predetermined number of questions.

For example, when learning English words or phrases, an English-Japanese dictionary or a language book is used. However, too many words or phrases are listed on each page of such a dictionary or book and thus learners tend to loose their memorizing desires.
With the advance of semiconductor technology, it has recently become feasible to provide a mass storage device, and an electronic dictionary has been put to practical use. Such device has a liquid crystal display and a variety of keys such as English-Japanese/Japanese-English mode keys, alphabet keys (A-Z) in English, kana keys from A to NN, sonant key, capital/small letter selector keys, word/phrase selector keys, search key, translation key, etc.
For example, when the spelling of English words and the Japanese translation are learned, English words are displayed on the liquid crystal display by setting an English-Japanese mode and using the English letter keys. Then, when the translation key is pushed on, while imagining the meaning of the English word, the English word is replaced on the display by Japanese word. In accordance with the Japanese word on the display, one can judge whether his memory is correct or not.
In this device, only words or sentences which he wants to learn are successively displayed on the liquid crystal display so that he may learn them with pleasure and never get tired of the learning.
However, in such a conventional device, only the translated Japanese word versus the input English word, or vice versa is alternately displayed, and thus it does not have the effectiveness to promote the learner's retentive power. Furthermore, the learner has to judge whether the memory is correct or not, and thus it can not exactly evaluate the mastered level in learning. In addition, among the English words displayed on the display, there are words which the learner has already memorized, so that the learning time becomes long.
Accordingly, it is an object of the present invention to provide a teaching device by which one can learn languages at one's level, the evaluation of having learned languages can be made at a learning process, and one can learn words or phrases which have not been memorized, so that the learning efficiency is highly improved.
According to the invention, a teaching device, comprises:
a display for displaying questions of a teaching subject and answers to the questions by a learner; PA1 means for testing the learner to discriminate correct and incorrect answers among the answers to questions, the learner being tested by a predetermined number of the questions per one teaching block dependent on a level of the learner on the teaching subject; PA1 means for determining a level of the learner on each of the questions per the teaching block; and PA1 means for removing a question of the level of the learner higher than a predetermined level from the questions per the teaching block for the repeatedly teaching means.
means for repeatedly teaching correct answers on the incorrect answers to the learner;


An adhesive composition comprising a first liquid containing (A) an acrylic compound selected from the group consisting of (meth)acrylic acids and esters thereof, and (B) a polymerization initiator selected from the group consisting of peroxy esters and hydroperoxides, and a second liquid containing (C) a condensation product of an amine and an aldehyde, and (D) a copper salt, wherein an acid phosphate compound of the following formula (I): ##STR1## wherein R is an alkyl group, an alkoxyalkyl group or a CH.sub.2 .dbd.CR.sub.1 --CO(OR.sub.2).sub.m -- group, wherein R.sub.1 is H or CH.sub.3, R.sub.2 is --C.sub.2 H.sub.4 --, --C.sub.3 H.sub.6 --, ##STR2## --C.sub.4 H.sub.8 --, --C.sub.6 H.sub.12 -- or ##STR3## and m is an integer of from 1 to 10; and n is 1 or 2, is contained in the first liquid or in both the first and second liquids.

In recent years, there has been an increasing demand for quick-curing adhesives capable of being cured in a short period of time at room temperature, from the viewpoint of energy saving, labor saving, saving of resources, etc. As heretofore well known room temperature quick-curing adhesives, a quick-curing epoxy adhesive of two-part liquid system, an .alpha.-cyanoacrylate adhesive, an anaerobic adhesive and an acrylic adhesive of two-part liquid system may, for example, be mentioned.
Among these adhesives, the quick-curing epoxy adhesive of two-part liquid system is designed to be used by measuring and mixing two liquids i.e. a main agent and a curing agent. If the measurement or the mixing of the two liquids is not conducted adequately, it is likely that a substantial deterioration in the bonding strength will result. Further, even if the measurement and the mixing of the two liquids are adequately conducted, there still remain drawbacks such that the peel strength and impact strength are low and unsatisfactory.
The .alpha.-cyanoacrylate adhesive provides excellent operation efficiency, but is generally poor in the peel strength and impact strength and inferior in the heat resistance and moisture resistance. Therefore, its application field is very much limited. The anaerobic adhesive is an adhesive of the type which is cured by shutting off air by pressing it between objects to be bonded. Therefore, at the time of bonding, the adhesive is likely to be pressed out from the objects, and the adhesive at the portion which is in contact with air, such as the pressed out portion, will not be cured. Thus, the anaerobic adhesive will not be sufficiently cured, and deficient bonding is likely to result in a case of porous objects or in a case where the clearance between the objects is large.
The acrylic adhesive of two-part liquid system is generally called a second generation acrylic adhesive (SGA). It is of a two-part liquid system, but it has excellent operation efficiency in that it is unnecessary to accurately measure the two liquids, and it is capable of being cured quickly in from a few minutes to a few tens minutes by extremely rough measurement and mixing (in some cases, merely by contacting the two liquids). Yet, high peel strength and impact strength are obtainable, and the curing of the adhesive pressed out from the objects, is excellent. Therefore, adhesive of this type has been widely used. However, from the viewpoint of the energy saving, labor saving and saving of resources, there is an increasing demand for further shortening the curing time, which is presently from a few minutes to a few tens minutes at room temperature with such an acrylic adhesive of two-part liquid system.
Various proposals have been made to shorten the curing time of such an acrylic adhesive of two-part liquid system. For example, U.S. Pat. Nos. 4,348,503 and 4,429,088 disclose that an adhesive composed of a first liquid comprising an acrylic ester monomer, an aromatic perester, an organic acid and a transition metal, and a second liquid comprising an amine/aldehyde adduct activator, can be cured in a fixture time of 45 seconds.
Japanese Unexamined Patent Publication No. 199085/1985 discloses that also an adhesive composition comprising a certain specific urethane prepolymer, a (meth)acrylate monomer (referring generally to acrylates and methacrylates), a peroxy ester and an accelerator made of a compound which is capable of forming a redox system with the polymerization initiator of a peroxy ester, can be cured in a short fixture time within one minute.
Further, Japanese Unexamined Patent Publication No. 65277/1980 discloses that an adhesive composition having chlorosulfonated polyethylene and a certain specific acrylic monomer blended in certain specific proportions and comprising cumene hydroperoxide, an aldehyde-amine adduct activator and a transition metal introduced as any appropriate organic compound, can be cured in from 5 to 10 seconds.
On the other hand, it has been known to incorporate an acid phosphate compound to an acrylic adhesive in order to improve the adhesion to aluminum, stainless steel or chromated zinc coated steel parts. For example, Japanese Unexamined Patent Publication No. 132234/1976 discloses that an acid phosphate compound is incorporated to an anaerobic adhesive composition.
Further, U.S. Pat. Nos. 4,223,115 and 4,452,944 disclose that phosphorus compounds are incorporated to acrylic adhesives. However, U.S. Pat. No. 4,223,115 states that "the addition of phosphorus-containing compound to polymerizable acrylic adhesive compositions has a retarding effect which is directly proportional to the amount of such compound", and it is suggested that to solve such a problem, a tertiary amine having a certain specific structure is added to accelerate the curing.
Further, U.S. Pat. No. 4,731,146 discloses an improvement in adhesion for bonding metals such as aluminum and a curable primer solution in a volatile organic solvent of an acid phosphate compound and a certain specific metal salt. Also here, it is stated that phosphate compounds have been known as stabilizers for acrylic monomer compositions, and acid phosphate monomers have a cure inhibiting or slowing effect.
As described in the foregoing, quick-curing acrylic adhesives have been known, and acrylic adhesives having acid phosphate compounds incorporated to improve the adhesion for bonding metals, have been well known. However, since acid phosphate compounds have a cure slowing effect, there has been no adhesive having excellent adhesion to metals and simultaneously having a high curing speed.

Acryl-type two-part liquid adhesive composition


An automatic cycle storage system comprising a plurality of cycles, each of which carries a locking member designed to be received in a keeper of a locking station. Each cycle includes an anti-theft cycle lock which, when it is in the position in which it immobilizes the cycle, prevents the cycle from being locked to a locking station.

Such a cycle storage system can be used, for example to make cycles available to the public, subject to the person who is borrowing the cycle being identified, and optionally subject to a rental being paid at a control terminal post.
Document WO-A-02/095698 describes an example of such a cycle storage system which is entirely satisfactory.
A particular object of the present invention is to improve further devices of that type, in particular in order to guarantee that a borrowed cycle cannot be locked to a fixed locking station unbeknown to the person who has borrowed it, during a temporary halt.


Provided herein are methods for making liposomal API formulations via continuous in-line diafiltration processes. Also provided herein are liposomal API formulations manufactured by the disclosed methods.

Continuous manufacturing is a process whereby raw materials constantly flow into a process and intermediates or final product constantly flow out. Such processing has been employed in non-pharmaceutical industries and has recently been adopted in some types of pharmaceutical processes such as the synthesis of active pharmaceutical ingredients (APIs) and generation of solid oral dosage forms (tablets, etc.) (Kleinebudde et al. (Eds.), Continuous Manufacturing of Pharmaceuticals, Wiley-VCH, Hoboken 2017; Subramanian, G. (Ed.), Continuous Process in Pharmaceutical Manufacturing, Wiley-VCH, Weinheim 2015).
In recent history, continuous manufacturing has been used for the production of biologics. The manufacture of biologics has continued to develop the requirements and aspects to consider surrounding unit operations such as cell culture, chromatography, viral inactivation and various methods for tangential flow filtration (TFF), such as alternating tangential filtration (ATF) and single pass tangential flow filtration (SPTFF) (Subramanian, G. (Ed.), Continuous Process in Pharmaceutical Manufacturing, Wiley-VCH, Weinheim 2015)). ATF, for example, is a means of performing buffer/medium exchange with lower shear forces as compared to TFF. Continuous perfusive cell culture has used ATF to support continuous medium exchange with highly concentration suspensions (Castilho, Continuous Animal Cell Perfusion Processes: The First Step Toward Integrated Continuous Manufacturing, in: Subramanian, G. (Ed.), Continuous Process in Pharmaceutical Manufacturing, Wiley-VCH, Weinheim 2015, pp. 115-153; Whitford, Single-Use Systems Support Continuous Bioprocessing by Perfusion Culture, in: Subramanian, G. (Ed.), Continuous Process in Pharmaceutical Manufacturing, Wiley-VCH, Weinheim 2015, pp. 183-226).
Single pass tangential flow filtration (SPTFF) has been evaluated as well for concentrating protein, allowing this process step to happen in a continuous fashion instead of the batch mode required by traditional TFF (Brower et al. Monoclonal Antibody Continuous Processing Enabled by Single Use, in: Subramanian, G. (Ed.), Continuous Process in Pharmaceutical Manufacturing, Wiley-VCH, Weinheim 2015, pp. 255-296: Jungbauer, Continuous downstream processing of biopharmaceuticals. Trends in Biotechnolgy. 2013, 8, 479-492; Dizon-Maspat et al., Single pass tangential flow filtration to debottleneck downstream processing for therapeutic antibody production. Biotechnol Bioeng. 2012, 4, 962-70).
Other aspects for commercial implementation of continuous manufacturing such as a process analytical technology (PAT) requirement and use of single-use or disposable componentry have been explored. The implementation of single-use or disposable technology provides the same conceptual benefits as it would for a batch process, but increased in magnitude as more product is generated per single-use/disposable item.
The present invention addresses the need for a continuous manufacturing process for liposomal active pharmaceutical ingredients (liposomal APIs), such as liposomal drug products.

Methods for continuous manufacture of liposomal drug products


A method for fabricating a vertical offset structure that forms a complete vertical offset on a wafer includes a first trench forming step of forming first trenches on a wafer; a first etching step of performing a first patterning for determining etching positions of second and third trenches by depositing a first thin film on the wafer, performing a second patterning for temporarily protecting the etching position of the third trench by depositing a second thin film on the first thin film and the wafer, and then forming the second trenches by etching the wafer; a second etching step of forming a protection layer on side surfaces of the second trenches and then vertically extending the second trenches by etching the wafer; a third etching step of removing the second thin film and then forming the third trench by etching a position from which the second thin film is removed; and a fourth etching step of horizontally extending the second trenches vertically extended at the second etching step and the third trench by etching the wafer.

1. Field of the Invention
The present invention relates to a method for fabricating a vertical offset structure, and more particularly to a method for fabricating a vertical offset structure by extending specified trenches using a single wafer.
2. Description of the Related Art
A vertical offset structure is fabricated using a MEMS (Micro Electro Mechanical System) fabrication method. The MEMS fabrication method relates to fabricating systems of the micrometer dimension on a wafer (i.e., substrate) using a silicon process, and is based on the method of fabricating semiconductor devices. Representative systems which are fabricated using the MEMS fabrication method are accelerometers for measuring acceleration of moving objects, gyroscopes for measuring angular velocity of rotating objects, optical switches capable of controlling optical paths, etc.
The performance indicator of the vertical offset structure is determined depending on whether upper and lower electrodes of the structure have a complete vertical offset and how narrow the vertical gap between the vertical offset structures is in order to improve the performance of vertical driving and detection.
FIG. 1 is a cross-sectional view illustrating an example of a conventional vertical offset structure. This vertical offset structure is disclosed in U.S. patent application Publication No. 2002/0158293A1. The vertical offset structure, in which structure members having different thickness have a vertical offset, has a good performance in applications of vertical driving and detection. However, according to the vertical offset structure as illustrated in FIG. 1, the vertical offset is not produced on an upper electrode of the structure, but is produced on a lower electrode thereof. Thus, the vertical offset structure as illustrated in FIG. 1 has a degraded performance in applications using vertical driving and detection.
FIG. 2 is a view illustrating another example of a conventional vertical offset structure. This vertical offset structure is disclosed in U.S. Pat. No. 6,694,504 B2. According to the vertical offset structure as illustrated in FIG. 2, a complete vertical offset is produced on both upper and lower electrodes. However, according to the principle of the fabrication process, the horizontal gap gh between the upper and lower electrodes of the structure is limited to about 4.5 μm. Since the horizontal gap is limited, the improvement of performance of the vertical offset structure is limited.

Method for fabricating vertical offset structure


A pedestal for a semiconductor device etching system includes a pedestal body having a circumferential recess. The recess includes a cutaway area extending radially inwardly therefrom. The pedestal further includes a sealing ring configured to mate with the pedestal body recess. The sealing ring includes a radially inwardly-extending projection that resides within the cutaway area of the recess. Because the sealing ring projection fits within and is retained by the cutaway area of the recess, the sealing ring remains in place upon removal of the mounted wafer even if it adheres somewhat to the wafer.

Lithography is a commonly used technique for etching a desired pattern into a substrate, such as a semiconductor device. Typically, the substrate to be etched is secured into place with a securing device opposite a radiation source. A lithography mask is mounted between the radiation source and the substrate. The lithography mask is formed of a material that is opaque to radiation produced by the source but includes a radiation-transparent window with an opaque pattern. When the radiation source is activated, radiation emitted therefrom travels through the transparent portions of the window to the substrate but is prevented from passing through the opaque portions. A photoresist on the substrate is exposed in the desired pattern by the radiation passing through the transparent portions of the mask window. The photoresist is then developed and then used as a mask to etch the substrate.
Generally, semiconductor wafers to be etched are mounted on the upper surface of a pedestal positioned within a processing chamber. The position of the wafer relative to the upper surface and the radiation source can be adjusted by lift pins that extend through the pedestal body. The pedestal body also typically includes a cooling gas flow passage having an outlet positioned at the center of the pedestal upper surface. Helium is supplied to the passage for cooling the mounted wafer. This cooling prevents a photoresist layer on the wafer from burning due to high frequency voltage applied to the pedestal during exposure to the radiation and etching.
Typically, an elastomeric sealing ring is fixed on the circumferential edge of the upper surface of the pedestal. The sealing ring provides a seal between the bottom of the wafer and the upper surface of the pedestal. The sealing ring is usually V-shaped in cross-section, with the legs and vertex of the "V" fitting within an angled recess in the circumferential edge of the pedestal upper surface. With the sealing ring in place in the recess, one leg thereof projects above the upper surface of the pedestal and contacts the bottom surface of the wafer.
Unfortunately, during processing the sealing ring may adhere to the bottom of the wafer, as its surface contacting the wafer can melt due to the wafer's elevated processing temperature. When such melting occurs, lifting of the wafer by the lift pins also lifts the sealing ring and pulls it from the pedestal recess. This action can result in processing defects due to the leak formed between the sealing ring and the pedestal recess.
In addition, the sealing ring is typically formed of an elastomer having a Rockwell A hardness of 80A. This value is the result of more than 15 percent of the elastomeric material comprising inorganic filler added to reduce the material cost. Because of the presence of the filler, the elasticity of the material is reduced. The drop in elasticity can cause the sealing ring to deform during insertion on the pedestal which can, in turn, increase the chance of the sealing ring being unable to provide a seal.

Pedestal with self retaining sealing ring for semiconductor device etching system


A quench system and process for cooling high temperature gases is presented. The quench system includes a frustum, or conic, shaped section having an inlet at the smaller end of the quench section and the outlet at the larger end of the quench section. The system includes spray nozzles having openings flush with the wall of the quench section. The process includes spraying a large volume of liquid in small droplets for rapid heat transfer and vaporization of the quench liquid.

Light olefin materials, including ethylene and propylene, represent a large portion of the worldwide demand in the petrochemical industry. Light olefins are used in the production of numerous chemical products via polymerization, oligomerization, alkylation and other well-known chemical reactions. These light olefins are essential building blocks for the modern petrochemical and chemical industries. Producing large quantities of light olefin material in an economical manner, therefore, is a focus in the petrochemical industry. The main source for these materials in present day refining is the steam cracking of petroleum feeds.
The cracking of hydrocarbons brought about by heating a feedstock material in a furnace has long been used to produce useful products, including for example, olefin products. For example, ethylene, which is among the more important products in the chemical industry, can be produced by the pyrolysis of feedstocks ranging from light paraffins, such as ethane and propane, to heavier fractions such as naphtha. Typically, the lighter feedstocks produce higher ethylene yields (50-55% for ethane compared to 25-30% for naphtha); however, the cost of the feedstock is more likely to determine which is used. Historically, naphtha cracking has provided the largest source of ethylene, followed by ethane and propane pyrolysis, cracking, or dehydrogenation. Due to the large demand for ethylene and other light olefinic materials, however, the cost of these traditional feeds has steadily increased.
Energy consumption is another cost factor impacting the pyrolytic production of chemical products from various feedstocks. Over the past several decades, there have been significant improvements in the efficiency of the pyrolysis process that have reduced the costs of production. In a typical or conventional pyrolysis plant, a feedstock passes through a plurality of heat exchanger tubes where it is heated externally to a pyrolysis temperature by the combustion products of fuel oil or natural gas and air. One of the more important steps taken to minimize production costs has been the reduction of the residence time for a feedstock in the heat exchanger tubes of a pyrolysis furnace. Reduction of the residence time increases the yield of the desired product while reducing the production of heavier byproducts that tend to foul the pyrolysis tube walls. However, there is little room left to improve the residence times or overall energy consumption in traditional pyrolysis processes.
More recent attempts to decrease light olefin production costs include utilizing alternative processes and/or feed streams. In one approach, hydrocarbon oxygenates and more specifically methanol or dimethylether (DME) are used as an alternative feedstock for producing light olefin products. Oxygenates can be produced from available materials such as coal, natural gas, recycled plastics, various carbon waste streams from industry and various products and by-products from the agricultural industry. Making methanol and other oxygenates from these types of raw materials is well established and typically includes one or more generally known processes such as the manufacture of synthesis gas using a nickel or cobalt catalyst in a steam reforming step followed by a methanol synthesis step at relatively high pressure using a copper-based catalyst.
Once the oxygenates are formed, the process includes catalytically converting the oxygenates, such as methanol, into the desired light olefin products in an oxygenate to olefin (OTO) process. Techniques for converting oxygenates, such as methanol to light olefins (MTO), are described in U.S. Pat. No. 4,387,263, which discloses a process that utilizes a catalytic conversion zone containing a zeolitic type catalyst. U.S. Pat. No. 4,587,373 discloses using a zeolitic catalyst like ZSM-5 for purposes of making light olefins. U.S. Pat. Nos. 5,095,163; 5,126,308 and 5,191,141 on the other hand, disclose an MTO conversion technology utilizing a non-zeolitic molecular sieve catalytic material, such as a metal aluminophosphate (ELAPO) molecular sieve. OTO and MTO processes, while useful, utilize an indirect process for forming a desired hydrocarbon product by first converting a feed to an oxygenate and subsequently converting the oxygenate to the hydrocarbon product. This indirect route of production is often associated with energy and cost penalties, often reducing the advantage gained by using a less expensive feed material.
Recently, attempts have been made to use pyrolysis to convert natural gas to ethylene. U.S. Pat. No. 7,183,451 discloses heating natural gas to a temperature at which a fraction is converted to hydrogen and a hydrocarbon product such as acetylene or ethylene. The product stream is then quenched to stop further reaction and subsequently reacted in the presence of a catalyst to form liquids to be transported. The liquids ultimately produced include naphtha, gasoline, or diesel. While this method may be effective for converting a portion of natural gas to acetylene or ethylene, it is estimated that this approach will provide only about a 40% yield of acetylene from a methane feed stream. While it has been identified that higher temperatures in conjunction with short residence times can increase the yield, technical limitations prevent further improvement to this process in this regard.
While the foregoing traditional pyrolysis systems provide solutions for converting ethane and propane into other useful hydrocarbon products, they have proven either ineffective or uneconomical for converting methane into these other products, such as, for example ethylene. While MTO technology is promising, these processes can be expensive due to the indirect approach of forming the desired product. Due to continued increases in the price of feeds for traditional processes, such as ethane and naphtha, and the abundant supply and corresponding low cost of natural gas and other methane sources available, for example the more recent accessibility of shale gas, it is desirable to provide commercially feasible and cost effective ways to use methane as a feed for producing ethylene and other useful hydrocarbons.

High temperature quench system and process


an image forming apparatus including; a non-inversion conveyance unit that conveys a sheet to a downstream without inverting through the image forming unit; an inversion conveyance unit that inverts the sheet with printing on one side and that conveys the sheet to an upstream; a first sheet inversion unit that is arranged on the inversion conveyance unit and inverts the front and back of the sheet conveyed by the inversion conveyance unit; a control unit that controls the image forming unit and the conveyance unit, wherein the control unit includes a single-sided print mode and a double-sided print mode, and at a breakpoint of jobs, the control unit discharges the sheet so as to provide charge polarity that does not electrostatically attract a sheet discharged just before the breakpoint and a sheet discharged just after the breakpoint at least in the double-sided print mode.

1. Field of the Invention
This invention relates to an image forming apparatus that performs printing on a sheet based on image data, and particularly, to an image forming apparatus, an image forming system, and an image forming method including a single-sided print mode and a double-sided print mode.
2. Description of the Related Art
In an electro photographic type image forming apparatus, a latent image is formed on a photoreceptor based on image data, and the latent image is developed by a toner image. The developed toner image is transferred to a sheet through a transfer unit. In an apparatus that temporarily transfers the toner image to an intermediate transfer unit, the toner image of the intermediate transfer unit is transferred to a sheet through a transfer unit equivalent to a secondary transfer unit.
In these transfer units, a positive charge is provided to the back side of the sheet to attract a negatively charged toner image to the sheet to transfer the toner image in order to ensure the transfer. A fixing apparatus then fixes the toner image to the sheet and discharges the sheet with the fixed toner image to a discharge tray.
An example of such an image forming apparatus includes an apparatus including two modes, a discharge mode of discharging the sheet provided with the fixed toner image without changing the direction of the front and back of the sheet and a discharge mode of discharging the sheet by inverting the front and back of the sheet (for example, see Japanese Patent Laid-Open No. 2007-168116). In such an image forming apparatus, the discharge modes can be switched for each job to facilitate separation on a job-to-job basis.
In the image forming apparatus, the positive charge is provided from the back side of the sheet as described above in the process of transferring the toner image to the sheet. Consequently, the surface provided with the toner image is negatively charged, and the surface on the opposite side provided with the positive charge is positively charged in the sheet after the transfer of the toner image.
When the charged sheets are discharged to the discharge tray as described above, if, for example, the directions of the front and back of the previous and next sheets between jobs are the same as the previously charged sheet as shown in FIG. 11, the positively charged surface and the negatively charged surface of the sheets are placed on top of each other. There is a problem that the sheets stick to each other or that it is difficult to put the sheets in order. The problem becomes more apparent when post-processing is applied to the sheets. The problem becomes particularly prominent in a printed matter in a PP (Production Print) device field.
In the image forming apparatus described in Japanese Patent Laid-Open No. 2007-168116, two modes of a mode of discharging the sheet without changing the direction of the front and back of the sheet and a mode of discharging the sheet by inverting the front and back of the sheet, are switched in each job.
In view of the problem, an apparatus including a discharge blower that discharges a sheet after transfer of an image is proposed (see Japanese Patent Laid-Open No. 10-181969). An apparatus including a first discharger and a second discharger to ensure the discharge is also proposed (see Japanese Patent Laid-Open No. 2004-10240).
However, in these image forming apparatuses, there is a possibility of attracting and attaching a positively charged surface and a negatively charged surface of sheets when the positively charged surface and the negatively charged surface on the front and back of the sheets are different at a copy-based breakpoint during double-sided printing, single-sided printing, or the like.
The present invention has been made in view of the circumstances, and at least an object of the present invention is to provide an image forming apparatus, an image forming system, and an image forming method that can take into account the polarity of the front and back of a preceding sheet at a breakpoint of jobs to prevent sticking of charged sheets.

Image forming apparatus, image forming system, and image forming method


A lock assembly is described for a door, the assembly including a gib having at least one flange. A locking unit has a first wall including an edge portion on the wall for sliding into the gib and for engaging the flange on the gib such that the locking unit is retained by the gib. A locking latch is movable between an unlocked position in the locking unit and a locked position such that the locking latch engages a wall in a frame when in the locked position. A second wall extends from the first wall of the locking unit in a direction substantially non-parallel to the first wall of the locking unit to keep the door closed when the locking latch is in the locked position.

1. Field of the Invention
The present invention relates generally to door lock assemblies for keeping a door in a fixed position, such as door locks for keeping refrigerator display case doors closed.
2. Related Art
Commercial refrigerators and refrigerator display cases are employed in markets, food-vending operations, liquor stores and the like for the simultaneous preservation of freshness and attractive display of foods to the customer. Typically, commercial display cases have frames defining an opening for the case which is accessed through large, swinging doors having large areas of multiple-layered glazing to permit the customer to see, select and access the refrigerated product easily, while preventing heat transfer into the refrigerated space.
In some cities, grocery stores are permitted to stay open twenty-four hours per day; however, the sale of some items, such as beer and wine, have their hours of sale restricted. Thus, it would be desirable to lock the refrigerated display cases containing alcoholic beverages during the prohibited hours of sale. A lock for this purpose is described in the patent to Miller, U.S. Pat. No. 4,012,065, showing a channel-shaped body having a T-shaped slot capable of engaging a pin fastened to the display case. However, the Miller device does not prevent access by potential customers who know the construction of the device, especially since parts of the device may be visible through the glass panes of the door.
There is a need, therefore, for a lock assembly having a secure and covered lock structure which is quick and easy to use and provides a reliable lock for a door. There is also a need for a lock assembly having a removable lock which can be easily retrofit onto existing door structures, and one which is locked with an appropriate key. There is also a need for a lock assembly which includes a lock transition indication so the user can tell when the lock has made the transition between a locked and an unlocked condition. These and other needs are met by the present invention.


A device for adjusting the exposure of an image sensor includes an average luminance value calculation unit, a first exposure control unit and a correction exposure value calculation unit. The average luminance value calculation unit calculates the first total average luminance value of pixels that are output from the image sensor. The first exposure control unit controls the exposure value of the image sensor based on a previously set exposure value. The correction exposure value calculation unit calculates a correction exposure value by multiplying the exposure value, which is previously set on the first exposure control unit, by the ratio of a target luminance value to the first total average luminance value. Additionally, the first exposure control unit receives the correction exposure value from the correction exposure value calculation unit and controls the exposure value of the image sensor based on the correction exposure value.

1. Field of the Invention
The present invention relates generally to a device and method for adjusting the exposure of an image sensor and, more particularly, to a device and method for adjusting the exposure of an image sensor capable of performing fast exposure correction for various light sources.
2. Description of the Background Art
An image sensor is a device for photographing images using the light-sensitive characteristic of a semiconductor to detect the varying brightness and wavelengths of light reflected from subjects and to convert the detected brightness and wavelength into electrical values for each pixel. Conversion of the electrical values into levels at which signal processing can be performed is a function of the image sensor. In other words, the image sensor is a semiconductor device for converting an optical image into electrical signals.
A Charge Coupled Device (CCD) or CMOS (Complementary Metal Oxide Semiconductor) image sensor is considered a representative example of an image sensor. A CCD image sensor is a device in which individual MOS capacitors are located closely adjacent to each other. The CCD image sensors transfers an optical image into electrical signals by storing and transmitting charges.
In contrast, a CMOS image sensor is a device that uses the CMOS technique of using a control circuit and a signal processing circuit as peripheral circuits and adopts the switching method of sequentially detecting output by forming and using MOS transistors in proportion to the number of pixels. Such a CMOS image sensor has the advantage of low power consumption, so that it is useful for a personal portable device, such as a mobile phone. Accordingly, the CMOS image sensor can be applied to various applications, such as a Personal Computer (PC) camera, a medical camera, or a toy camera.
In addition, since the characteristics of light sources of an image sensor, such as luminance and color temperature, can vary according to the type of light sources, it is necessary to adjust exposure for the light sources in order to maintain proper luminance for the various light sources having different characteristics. Conventionally, the following two methods have been mainly used to adjust the exposure of an image sensor. A first method is a method of determining an appropriate exposure value for a plurality of frames while increasing or decreasing a currently set exposure value for an image sensor at a low rate. This method facilitates the hardware implementation of an exposure adjustment device for an image sensor, but is problematic in that fast correction is difficult because the exposure value must be corrected for a plurality of frames. In particular, a white screen sustains because a plurality of frames is used at a maximal exposure value (generally, ⅕ sec) when an image sensor moves from a dark place to a bright place, so that fast screen switching is difficult.
A second method is a method of measuring current ambient luminances using an auxiliary device, such as a photodiode (for example, a Light Emitting Diode (LED)), storing an appropriate exposure value list based on the measurement in non-volatile memory (for example, Read-Only Memory (ROM), flash memory, etc.), and then referring to the stored list. This method makes fast correction possible, but has problems in that it requires a separate storage device to store the exposure value list and must acquire the experimental exposure values appropriate for ambient luminance. Furthermore, in the case in which a light source having power frequency characteristics similar to those of a fluorescent lamp is used as the light source of an image sensor, attenuated emission occurs due to an intrinsic afterglow characteristic. As a result, so-called flicker results from variation in color as well as brightness.

Device and method for adjusting exposure of image sensor


An apparatus for gripping a fluid carrying hose comprising a jaw sized for placement about a pressurized hose, the jaw having a first end portion and a second end portion distal and generally opposite to the first end portion, a handgrip pivotally attached to the first end portion of the jaw, the handle having a normal position, and a plunger movably secured in the first end portion of the jaw. The plunger has a first end for contacting a portion of the handgrip and a second end opposite the first end of the plunger for grasping the surface of the pressurized hose. The plunger is responsive to the movement of the handgrip wherein the plunger moves in a first direction toward the second end portion of the jaw as the handgrip is pivoted in one direction and wherein the plunger moves in a second direction away from the second end portion of the jaw as the handgrip is moved back to the normal position.

COPYRIGHT NOTICE
.COPYRGT.Copyright 1998, Ronald S. Hollister and Thomas S. Corbett. All rights reserved. A portion of the disclosure of this patent document contains material that is subject to copyright protection. The copyright owners have no objection to the facsimile reproduction by anyone of the patent document or the patent disclosure, as it appears in the USPTO patent file or records, but otherwise reserves all copyright rights whatsoever.
1. Field of the Invention
The present invention relates to an apparatus for gripping a fluid carrying hose.
2. Problem to be Solved
Fluid carrying hoses are used in many settings. For example, fluid carrying hoses are used in the fire fighting, chemical, petroleum and water treatment industries. There are many other settings in which fluid carrying hoses are utilized.
In many of the applications mentioned above, the fluid carrying hoses are generally of relatively large diameter and the fluid pressure therein is relatively high. For example, in the fire fighting industry, the fluid pressure in the hose is relatively high in order to move and/or eject a large volume of water a relatively long distance from the outlet of the hose to the fire. As a result, the reactive force on the hose is also relatively high thereby often necessitating more than one person handling the end of the hose. In a fire fighting scenario, handling the hose is made all the more difficult due to the conditions generally encountered, e.g. obstacles and debris, the need to advance the hose through and around unfamiliar structures, darkness or reduced visibility due to smoke, difficulty in gripping the hose due to excessive moisture on the hose, fatigue of the personnel handling the hose, etc.
Accordingly, it is an object of the present invention to provide an apparatus for gripping a pressurized fluid carrying hose that provides the personnel handling the hose with a significantly improved grip on the hose.
It is another object of the present invention to provide an apparatus for gripping a pressurized fluid carrying hose that can be quickly attached to a hose.
It is another object of the present invention to provide an apparatus for gripping a pressurized fluid carrying hose that does not significantly distort the hose or interfere with the flow of fluid through the hose.
It is another object of the present invention to provide an apparatus for gripping a pressurized fluid carrying hose that is easy to use.
It is another object of the present invention to provide an apparatus for gripping a pressurized fluid carrying hose that is portable.
It is a further object of the present invention to provide an apparatus for gripping a pressurized fluid carrying hose that can be inexpensively manufactured.
These and other objects of the present invention will become readily apparent upon further review of the following specification and drawings.

Apparatus for gripping a fluid carrying hose