One embodiment of the present invention provides an apparatus and the like for improving the accuracy of deterioration estimation regarding a monitoring target. An information processing apparatus as one embodiment of the present invention includes a detector, a separator, a calculator, and an estimator. The detector detects a normal waveform pattern included in a waveform of time-series data of a target. The separator separates the waveform of the time-series data into components while removing the normal waveform pattern that is detected. The calculator calculates a feature of the time-series data based on at least one of the components. The estimator estimates deterioration of the target based on the feature.

For an operator that performs maintenance of appliances, determining a timing of performing maintenance is an important issue. For example, with printers or the like, the degree of progress of deterioration differs depending on the type of paper that is used, the frequency of use, temperature and the like. Accordingly, maintenance often unexpectedly becomes necessary before an initially planned timing. To avoid such a situation, there is much demand to grasp the degree of progress of deterioration with high accuracy and in real time.
However, a method of continually checking deterioration of an appliance using a sensor has issues in terms of cost. For example, in the case of performing maintenance of an appliance where a roller is built in as a key part, deterioration of the roller has to be grasped, and a deteriorated roller has to be replaced on a regular basis. However, a roller is a rotating body, and a sensor that is capable of directly monitoring the state of a surface of a rotating body is expensive. Accordingly, an apparatus that estimates deterioration of an appliance with high accuracy based on items that can be measured with inexpensive sensors, such as an accelerometer, is desired.

Information processing apparatus, information processing method, and non-transitory computer readable medium


An apparatus that attaches to the end of the electrical fish tape to eliminate or reduce drag and friction while the fish tape is pushed through bends in electrical pipe with a roller attached to the end of an electrical fish tape or snake to drastically reduce friction and drag when the fish tape or snake is being pushed through bends in electrical pipe. The roller is designed to rotate when coming into contact with the inner pipe wall at any position. Inner bearing further magnifies roll, takes advantage of the flat side of the fish tape to position the roller going into and through the bend for optimum roll.

1. Field of the Invention
This application is directed to an apparatus that attaches to the end of an electrical fish tape to eliminate or reduce drag and friction while the fish tape is pushed through bends in electrical tubing.
2. Background and Prior Art
This invention relates generally to the field of electrical wiring installation and more specifically to an apparatus that attaches to the end of an electrical fish tape to eliminate our reduce drag and friction while the fish tape is pushed through bends in electrical tubing.
When installing electrical wire in conduit tubing, two things limit the distance between pull points in the tubing in an exposed industrial piping application. One is the length of the fish tape or snake. If the fish tape measures 200 feet, the pull points will be placed less than 200 feet part. For example, pull points could be placed at 180 feet intervals to ensure that the fish tape exposed sufficiently for manipulation at each end. The second aspect is the degree of bend between pull points. For example, a total of 360 degrees of bend is the extreme maximum bend between pull points. Typically installers will only put 270 degrees between pull points. If the bend is required to exceed 270 degrees, a junction box or condulet is installed as a pull point at every 270 degree interval. These junction boxes and condulets, which are used for pull points, drive up the cost of electrical installation, not only for the price of materials, which can be expensive, but the time for the initial wire pull and future pulls in the wire way because both points have to be manned to pull wire, which affects the cost of labor. It is difficult to push a fish tape through 360 degrees. After 270 degrees of bend is achieved, A-90 allows the end of the fish tape to roll through another bend with minimum resistance from friction/drag.
The most widely known method of getting a pull lead inside an electrical conduit at present is the fish tape itself. The fish tape is bent on the lead end in such a manner as to make the tip rounded. Many commercial fish tapes today have factory ends that accomplish the same end. Some fish tapes have a flexible metallic leader approximately 18″ long, but this leader is still subject to the same friction and drag inside the pipe and is not a solution to the underlying problem.
Numerous attempts to address the aforementioned problem have been patented. U.S. Pat. No. 4,171,123 to Woelkers is directed to a fish-shaped hanger for attaching multiple wire separately to a fish tape.
U.S. Pat. No. 4,596,381 to Hamrick utilizes a bag as the head of a fish tape and uses pressure differences between entry point and destination to urge the tape onward.
U.S. Pat. No. 4,895,221 to Carlson employs a sponge or foam material as a carrier for a lubricant near the head of the fish tape to decrease drag at bends.
U.S. Pat. No. 5,505,432 to Noonan discloses a fish tape head including an anti-snagging device in the form of a roller means disposal between the arms of a yoke.
The art continues to lack a low friction fish tape head which easily pushes through multiple conduit angles regardless of the orientation of the flat tape to the direction of the turn.


The semiconductor integrated circuit device includes a plurality of decoupling cells that suppress power noise respectively, a plurality of power switches that connect the decoupling cells to a power line respectively, and a control circuit that controls the number of power switches selected from among the plurality of power switches and to be turned on according to power noise to be changed according to the operation state of each of internal circuits driven by a power supplied from the power line.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit device, particularly to a semiconductor integrated circuit device that includes a decoupling cell that suppresses power noise.
2. Description of Related Art
In recent years, the supply voltage of semiconductor integrated circuit devices has become lower and the power noise has affected more significantly operations of the circuits of those devices. This is why such semiconductor integrated circuit devices have come to include a decoupling capacitor provided between a power line and a ground line to stabilize the supply voltage respectively. The patent document 1 (hereunder, to be referred to as the conventional example 1) discloses an example of such a decoupling capacitor that can be built in such semiconductor integrated circuit devices.
A semiconductor integrated circuit device, when including a plurality of circuit blocks therein, changes the operation mode of each of the circuit blocks in accordance with how the circuit block is used, thereby suppressing its power consumption. For example, the semiconductor integrated circuit device operates each idle circuit block in the standby mode that requires small power consumption and operates each active circuit block in the normal operation mode that requires large power consumption.
The patent documents 2 and 3 (hereunder, to be referred to as the related examples 2 and 3) disclose examples of semiconductor integrated circuit devices, each of which includes a function for switching between such operation modes. FIG. 14 shows a block diagram of the semiconductor integrated circuit device 100 disclosed in the related example 2. As shown in FIG. 14, in the semiconductor integrated circuit device 100, a logic circuit 101 and a power gate switch 102 are connected to each other serially between a power line VDD and a ground line VSS. In the semiconductor integrated circuit device 100, a reference potential line VVss is also connected between the logic circuit 101 and the power gate switch 102. In the conventional example 2, the logic circuit 101 turns on/off the power gate switch 102 according to its operation mode. Consequently, the semiconductor integrated circuit device 100 comes to suppress the leak current in the standby mode, thereby it is assured of fast operations that require large power consumption in the normal operation mode.
In the related example 3, the decoupling capacitor charges the parasitic capacity of the first circuit block when the first circuit block operation mode is changed from standby to normal. Consequently, the semiconductor integrated circuit device 100 suppresses the amount of charge into the parasitic capacity of the first circuit block from the power supply at the time of each operation mode change, thereby suppressing the power noise at that time.    [Patent document 1] Japanese Unexamined Patent Application Publication No. 2005-175003    [Patent document 2] Japanese Unexamined Patent Application Publication No. 2005-268694    [Patent document 3] Japanese Unexamined Patent Application Publication No. 2001-358294    [Non-patent document 1] "Measurement Results of On-chip IR-drop", K. Kobayashi et al. CUSTOM INTEGRATED CIRCUIT CONFERENCE, 2002, Proceedings of the IEEE 2002, volume, issue, 2002 pp. 521-524

Semiconductor integrated circuit device having control circuit to selectively activate decoupling cells


An improvement is made to a torque splitting device employing hydraulic clutches so as to avoid any discontinuity in the control even when the properties of the actuating oil such as the pressure and temperature thereof deviate from standard values. For instance, when the oil temperature is low, the target value of the oil pressure for each of the clutches is modified to a lower value. Thus, it becomes possible to make less pronounced any delay in the response of the torque splitting device which may arise due to the sluggishness of the oil as it flows out of the clutch cylinder. The oil pump is typically actuated by a member rotating at a speed proportional to the vehicle speed, and the pressure output of the pump may be inadequate in a low speed range. In such a case, the target value is again reduced so as to reduce any abrupt change in the property of the torque splitting device when the vehicle is accelerated from a low speed. Because the pressure output of the pump normally drops as the oil temperature rises, it is desirable to take into account the oil temperature in this control action as well.

The applicant has previously proposed, for instance in Japanese patent laid-open publication No. 8-21492 which corresponds to the U.S. patent application Ser. No. 08/497,557 filed Jun. 30, 1995, a torque splitting device which, provided in parallel with a conventional differential device, controls the simulated rolling resistance to each of the right and left or front and rear axles and boosts the rotational speed of the axle encountering a lower rolling resistance. Thereby, the torque distribution ratio to the right and left axles can be positively changed depending on the steering wheel steering angle and the vehicle speed to the end of improving the steering performance of the vehicle. The contents of the above mentioned United States patent application are hereby incorporated in this application by reference.
As illustrated in FIG. 10, this previously proposed torque splitting device T comprises an oil pressure pump 32 producing an output pressure that depends on the vehicle speed, a regulator Re for adjusting the output pressure to a prescribed level, a pair of wet hydraulic multi-disk clutches Ca and Cd for producing simulated rolling resistances, a pressure regulating valve 30 consisting of a linear solenoid valve for determining a torque distribution ratio for the right and left (or front and rear) wheels according to the turning radius or the road resistance, and controlling the engagement forces of the clutches Ca and Cd so as to achieve a desired torque distribution ratio by adjusting the oil pressure for each of the clutches to a target value, an electronic control unit 29 for computing the target oil pressures, and controlling the electric current for the pressure regulating valve 30, and a planetary gear mechanism P which is connected to the wet hydraulic multi-disk clutches Ca and Cd and actually distributes the torque. The output of the engine E forwarded to the torque splitting device T via the transmission TM can be thus appropriately distributed to the right and left (or front and rear) axles 5L and 5R depending on the operating condition of the vehicle.
The operating response of such a clutch is affected by the viscosity of the actuating oil, and tends to drop under a low temperature condition because of an increase in viscosity. Because the clutch is typically disengaged by removal of the actuating oil from the clutch cylinder, the response delay is particularly significant when disengaging the clutch under a low temperature condition. The reduction in the response of the clutch due to an increase in the flow resistance to the actuating oil means that the difference in rotational speed between the right and left wheels may remain even after the steering wheel is brought back to the neutral position. This is not desirable because it causes discomfort to the vehicle operator.
Also, because the output of the oil pressure pump depends on the vehicle speed, the oil pressure pump may not be able to produce a sufficient oil pressure to appropriately operate the wet hydraulic multi-disk clutch in a low speed range. The volumetric efficiency of the oil pressure pump, which typically consists of a gear pump or a cam pump using a trochoidal or other piston element, is known to be affected by the viscosity or the temperature of the oil. When the oil temperature is high, and the viscosity of the oil is therefore low, the volumetric efficiency of the oil tends to drop. Therefore, for instance when a certain oil pressure target value is supplied to the pressure control valve so as to create a certain difference in the driving force between the right and left wheels to accommodate a turning maneuver, the oil pressure pump may not be able to produce the required oil pressure if the rotational speed of the engine is low and/or the oil temperature is high. Under such a condition, when the rotational speed of the oil pressure pump is accelerated from a low speed range involving an insufficient output pressure of the pump, it is possible for the wet hydraulic multi-disk clutch to abruptly engage as soon as the output pressure of the pump reaches a prescribed value. This means a discontinuity in the torque distribution control, and is not desirable again as it causes a discomfort to the vehicle operator.

Torque splitting device using hydraulic clutches


A solution useful for forming a solid that supports mass transfer includes carbon nanotubes and a solvent. Solids formed using the solution thereby have carbon nanotubes dispersed therein that are useful for communicating gas and/or electric charges within the solid. Catalyst layers of the invention that include carbon nanotubes can provide high levels of efficiency while requiring low catalyst concentrations.

In many applications it is desirable for gas and/or electrical charge to diffuse or otherwise pass into or through a solid layer. Often, however, the solid material may not support useful rates of diffusion or other mechanisms for passing gas and/or charge. By way of example, catalyst particles dispersed in a so-called catalyst layer in an electrochemical cell or fuel cell provide a catalyzing medium spread over an area. In order for the catalyst particles in the layer to be active, they will desirably have relatively easy access to gas and be able to conduct electrical charge. The layer may also be required to conduct protons. Proton conducting materials, however, often do not provide good support for gas and/or charge diffusion and conduction.
Catalyst layers are of particular utility when used with electrochemical cells employing a membrane and electrode assembly, with an example being proton exchange membrane (PEM) fuel cells. These cells may include a membrane electrode assembly (MEA) consisting of a proton exchange or solid polymer electrolyte membrane coated on one or both of its operative surfaces with a catalyst layer. Fuel and air are converted to electricity on the MEA, with the catalyst layer providing for higher conversion rates. The active catalyst typically comprises precious metal particles, and most commonly one or more of Pt, Pd, or Ir; or Pt or Pd alloyed with one or more of Pd, Ru, Mo, Ni, Fe, Co, Mn.
Because of their expense, it is desirable to minimize the amount of catalyst particles required while maintaining high levels of cell efficiency. Accordingly, it is desirable for high proportions of the catalyst particles to be active. Also, providing thin catalyst layers may be useful to minimize the catalyst particle cost. Catalyst inks that include catalyst particles suspended in a solvent are useful for providing a thin catalyst layer. For example, it is known to spread a catalyst ink on a proton exchange membrane and then hot press the resultant structure to remove the solvent and fix the catalyst particles near the surface of the membrane. Such a method is described in detail, for example, in U.S. Pat. No. 5,234,277 to Wilson et al., and "A NAFION-Bound Platinized Carbon Electrode For Oxygen Reduction In Solid Polymer Electrolyte Cells," A. K. Shukla et al., J. Appl. Electrochem., 19 pp. 383–386 (1989). These methods and resultant catalyst layers, however, have problems associated with them. For example, hot pressing can result in damage or destruction of the membrane, and can result in poor mass transfer and proton conductivity within the catalyst layer. These problems cause reduced fuel cell efficiency and current output from the cell.
A solution to some of the problems of these prior art inks and layers was proposed in U.S. Pat. No. 5,415,888 to Bane jee et al. Generally, the '888 patent teaches the addition of proton-conducting polymers, such as NAFION (NAFION is a registered trademark of the DuPont Chemical Corporations, Wilmington, Del.), to a catalyst ink. Inclusion of the proton-conducting polymer reduced the need for hot pressing and its related disadvantages. In practice, the catalyst ink is applied to the proton exchange membrane and the solvent is removed, leaving catalyst particles embedded in a thin layer of the cast proton-conducting polymer. In addition to acting as an electrolyte to provide a path for proton conduction away from the catalyst, the solid proton-conducting polymer also fixedly holds the catalyst particles in position.
The teachings of the '888 patent leave several problems unresolved. For example, a portion of the active catalyst is often buried in the proton-conducting polymer layer, which generally does not support good rates of gas diffusion or electron conduction. In a buried state the catalyst particle is thus essentially inactive and wasted because it is not easily accessible to reactants (i.e. fuel or air/oxygen) or to the current collector. Wasted catalyst keeps the relative cost of these methods and layers high and lowers their efficiency. Also, the cast form of the proton-conducting polymer that results when the catalyst ink dries typically does not have satisfactorily, high proton conductivity. These and other problems are discussed in "Effects Of NAFION Impregnation On Performances Of PEMFC Electrodes," Lee et al., Electrochimica Acta 43(24):3693–3701, 1998.
A more recently proposed solution is presented in U.S. Pat. No. 6,309,722 to Zuber et al. The '722 patent teaches adding insoluble components to the inks to induce porosity in the conducting polymer layer. The porosity partially overcomes problems associated with the catalyst being isolated from the reactants. However, the porosity does not overcome the problem of the catalyst being electrically isolated from the current collector or the problem of the limited proton conductivity of the cast proton-conducting polymer. In addition, achieving porosity adds time and cost to the preparation of the catalyst inks and layers.
Some prior art fuel cell applications seek a high density catalyst loading in order to achieve small fuel cell size. For example, in mini and microelectronics applications small fuel cells are desirable. For these applications, the prior art has had limited success in achieving suitably high loadings.
These and other problems in the art remain unresolved.

Solids supporting mass transfer for fuel cells and other applications and solutions and methods for forming

The Board of Trustees of the University of Illinois


Switchgear, such as gas-insulated, metal-encapsulated high-voltage switchgear, is accommodated in a container. The container has a side wall formed with an opening. An outwardly opening flap closes the opening in the normal situation. Upon a sudden pressure increase in the container, caused for instance by arcing, the flap is automatically opened and the container is vented. A linkage with a damper is connected to the flap for damping a motion of the flap into the open position.

1. Field of the Invention
The invention relates to container-type switchgear which is housed in a container; the switchgear is, in particular, a gas-insulated, metal-encased high-voltage switchgear.
For practical reasons, the installation of switchgear in a container provides for a great number of advantages. On the one hand, the container is a commercially available housing and, on the other hand, a container and its contents can be easily transported. For these reasons, container-type switchgear is becoming increasingly popular.
If an electric arc occurs within the switchgear of the container-type switchgear, or within the container in general, the electric arc results in a pronounced increase in the pressure and the temperature within the container. This sudden increase in the pressure and the temperature poses a risk of damage to the container which, in turn, could result in the uncontrolled escape of hot gases from the container. This poses a severe risk to persons in the vicinity.


The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

In order to generate sufficient signal for analysis, many applications in genomics and biomedical research require the conversion of nucleic acid molecules in a library into separate, or separable, libraries of amplicons of the molecules, e.g. Margulies et al, Nature 437: 376-380 (2005); Mitra et al, Nucleic Acids Research, 27: e34 (1999); Shendure et al, Science, 309: 1728-1732 (2005); Brenner et al, Proc. Natl. Acad. Sci., 97: 1665-1670 (2000); and the like. Several techniques have been used for making such conversions, including hybrid selection (e.g., Brenner et al, cited above); in-gel polymerase chain reaction (PCR) (e.g. Mitra et al, cited above); bridge amplification (e.g. Shapero et al, Genome Research, 11: 1926-1934 (2001)); and emulsion PCR (emPCR) (e.g. Margulies et al, cited above). Most of these techniques employ particulate supports, such as beads, which spatially concentrate the amplicons for enhanced signal-to-noise ratios, as well as other benefits, such as, better reagent access.
These techniques have several drawbacks. In some cases, amplicons are either in a planar format (e.g. Mitra et al, cited above; Adessi et al, Nucleic Acids Research, 28: e87 (2000)), which limits ease of manipulation and/or reagent access, or the amplicons are on bead surfaces, which lack sufficient fragment density or concentration for adequate signal-to-noise ratios. In other cases, amplifications must be done in emulsions in order to obtain clonal populations of templates. Such emulsion reactions are labor intensive and require a high degree of expertise, which significantly increases costs. It would be very useful if supports were available which were capable of providing a higher density of analyte binding or attachment sites, particularly for clonal populations of nucleic acid fragments. It would also be advantageous if such supports did not require emulsion reactions for producing clonal populations.
Gels have been widely used as supports in analytical and synthetic processes and as encapsulating agents, e.g. Weaver et al, U.S. Pat. No. 5,055,390; Trnovsky et al, U.S. Pat. No. 6,586,176, and have interiors accessible to analytical reagents. However, such particulates are limited in that they are typically produced with widely varying size distributions, particularly at lower size ranges, e.g. less than about 30 μm, which makes them unsuitable for many exacting analytical applications, such as large scale DNA sequencing.
It would be highly useful if methods and compositions were available for creating small-sized monodisperse populations of gel-based particulate supports, which could be readily loaded with analytes, such as amplicons of nucleic acid fragments.

Scaffolded nucleic acid polymer particles and methods of making and using


A parallel computer using a simply structured network which allows loads on message-transferring routes to be as equally distributed as possible and which eases possible conflict between different types of messages being transferred. Given a message to be transmitted, each processor (PE) on the network references a property setup table to determine property information depending on the message type and places the information into the message. For example, a route bit RB as the property information is set to "0" or "1" depending on whether the message is originated by the sending PE or is a message acknowledging the receipt of another message. According to the RB bit in the received message, a route instruction circuit in each exchange switch (EX) references a route instruction table to determine the message destination that depends on the receiving PE number designated by the message. Each EX has a plurality of virtual channel circuits. Each virtual channel circuit has a plurality of buffers assigned beforehand to different values of the RB bit within the message. The received message is placed into the buffer corresponding to the RB bit value of the message, whereby conflict between messages is minimized.

The present invention relates to a parallel computer comprising a plurality of processors constituting a network for transferring messages therebetween.
One of the capabilities required of the network of the parallel computer is a high throughput, i.e., the ability to transmit a large number of messages in a short time.
A majority of conventional parallel computers operate under what is known as the dimension ordered routing scheme for network routing. Dimension ordered routing involves transmitting all messages from, say, a one-dimensional direction to a two-dimensional direction in the same transfer procedure. The same applies when a path conflict occurs between different messages. In the case of such a conflict, the initially transmitted message is given priority in transfer over the subsequently transmitted message. Where dimension ordered routing is employed, a transfer route not actually used can develop on the network. In a conventional dimension ordered routing setup, messages may concentrate on a specific portion of the network or may not use certain routes at all. That is, part of the transfer routes on the network are not utilized effectively. Incidentally, the message conflict refers to cases where the transfer route of one message conflicts with that of another message so that one of the messages is delayed in transfer.
One solution to the above problem is the so-called adaptive routing disclosed in the Papers from Information Processing Society of Japan, Proc. of Symposium on Parallel Processing JSPP '94, pp. 129-136, May 1994 (hereafter referred to as the first-cited reference). The adaptive routing scheme attempts to disperse transfer routes of messages over the network by utilizing the routes effectively. The first-cited reference discusses cases in which adaptive routing is applied to a hyper-crossbar network.
The disclosed adaptive routing method works as follows: When a path conflict occurs as mentioned, the message later transmitted is transferred on the spot to a currently available route (in a different dimensional direction). This resolves the conflict state. By distributing messages to different transfer routes, the adaptive routing method utilizes all transfer routes on the network effectively and makes the load on each of the transfer routes as equally distributed as possible.
There is one major disadvantage to the network enabling a plurality of transfer routes to transfer messages to the same destination: there may occur a closed loop of a channel chain between a plurality of messages. That is, each of, say, two messages attempts to take over the transfer route of the other message, resulting in a deadlock. Illustratively, suppose that in a three-dimensional network situation, a message 1 is to be transmitted over routes X, Y and Z in that order while a message 2 is to be sent over routes Y, Z and X in that order. As the message 1 is trying to take the route Z and the message 2 the route X, a loop is formed between the two transfer routes leading to a deadlock. The Way to avoid the deadlock proposed in the first-cited reference involves using virtual channels on the hyper-crossbar network. Virtual channels are made up of a plurality of independent buffers (i.e., virtual channels) for storing messages with respect to each physical channel of the network. A plurality of virtual channels share one physical channel. The first-cited reference explains how the deadlock state is resolved by utilizing virtual channels on the hyper-crossbar network. What follows is a description of how virtual channels are used.
The hyper-crossbar network illustratively includes "in" processors, "n" being factorized into n1.times.n2.times.n3.times. . . . , nm. Each of the factors is regarded as a one-side mesh cross-point count constituting an m-dimensional mesh space in which processors are disposed. The sides of the mesh are connected by partial networks composed of crossbar switches so as to form message transfer routes. In this example, each crossbar switch is provided with as many buffers as the number of dimensions (m). One physical channel is used as "m" virtual channels. Illustratively, in the above-described three-dimensional network, an adaptive routing scheme based on virtual channels allows the message 1 to be transferred over routes X1, Y2 and Z3 in that order, and enable the message 2 to be moved through routes Y1, Z2 and X3 in that order (subscripts 1, 2 and 3 added to characters X, Y and Z indicate virtual channel numbers). This prevents any closed loop from developing between the routes thereby avoiding deadlock. In this example, it is possible to select any dimension when each crossbar switch is transited provided the selected dimension has not been passed through in the past.
Virtual channels are allocated depending on the number of crossbar switches transited so far by the message in question. Each message contains therein dynamic transfer route transit information (describing, among others, which switches the message in question has transited so far) in order to suppress deadlock.
The concept of virtual channels was proposed earlier in IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, Vol. 3, No. 2, pp. 194-205, March 1992 (hereafter called the second-cited reference). This reference also indicates that the deadlock state is avoided by applying virtual channels to a torus network based on dimension ordered routing.
Another capability required of the network of the parallel computer is a minimized possibility of conflict between different types of messages. These types of messages transferred over the network of the parallel computer include broadcast messages, synchronization messages, data transfer messages and emergency messages and so on. They vary in type depending on the purpose. If a conflict occurs between such different types of messages, one of the messages (e.g., emergency message) can be delayed in transfer.
Some parallel computers have a plurality of message-wise networks for the efficient transfer of messages differing in their purposes. For example, the parallel computer introduced in Information Processing Society of Japan, IPSJ SIG Notes ARC, Vol. 92, No. 64, pp. 89-96 (hereafter called the third-cited reference) have three independent networks: one for broadcast messages, another for synchronization messages and another for data transfer messages.
Japanese Patent Laid-Open No. Sho 63-124162 (hereafter called the fourth-cited reference) discloses a technique whereby, in case of a fault on the network, the current message transfer route is switched so as to bypass the faulty network portion. According to the disclosed technique, the message route is designated by the message-originating processor inserting routing bits into its message.

Parallel computer system using properties of messages to route them through an interconnect network and to select virtual channel circuits therewithin


An ultrasonic measuring gauge includes a probe configured to be moved along a surface of a material to be measured, transmit ultrasonic waves to the material, and receive ultrasonic waves reflected from the material. The gauge also includes a processing unit and an input unit. The processing unit is configured to operate according to one of two different modes of operation based on an input received by the input unit. In a first mode of operation, the probe determines the thickness at portions between the first and second locations on the surface of the material at which the probe is coupled to the material regardless of whether the probe is continuously physically coupled between the two locations. In a second mode of operation, the processing unit determines a corresponding thickness of the material at each portion between two locations when the probe is continuously physically coupled between the two locations.

Ultrasonic measuring gauges are commonly used to measure the thickness of a material, and to determine whether there are any structural flaws in the material. Such gauges can be used for, example, to measure the effects of corrosion or erosion on tanks, pipes or any solid material where access is limited to one side of the material.
FIG. 1 illustrates an example of the structural features of a known ultrasonic gauge 110. The known gauge 110 includes a probe part 114 at a lower end of the gauge which enables a probe 116 to be connected to the gauge 110. At an opposite end of the gauge 110, a display 115 is arranged for reading out measurements or other data. Switches 112, 113, 117 are also provided on the gauge 110 for controlling the operation of the gauge 110. The switches 112, 113 and 117 are shown external to the display 115 in FIG. 1. However, the switches 112, 113 and 117 and other controls can be provided on the display 115 in the form of a touch-screen display.
The probe 116 includes a transducer for transmitting ultrasonic waves to a surface of a material to be measured, and receiving ultrasonic waves reflected back from the material. Processing circuitry comprised in the gauge 110 computes the thickness of the material based on the transmitted and received ultrasonic waves. The existence of structural flaws in the material can be determined based on the measured thickness of one part of the material, as compared with the relative thickness of other parts of the material. For example, during a scanning operation, the processing circuitry within the gauge 110 can compile aggregate data including a maximum thickness value and a minimum thickness value while the probe 116 is dragged across the material in continuous, uninterrupted physical contact with the material. U.S. Pat. No. 5,009,103 is an example of a known ultrasonic measuring gauge for measuring the thickness of a material. The entire disclosure of U.S. Pat. No. 5,009,103 is incorporated by reference in its entirety.
During a measurement operation, a coupling gel is commonly applied to the surface of the material to be tested. The gel provides a medium through which ultrasonic waves can travel from the probe 116 to the material. During scanning operations involving rough and/or scaly surfaces of the material, the probe 116 is dragged across the surface of the material while the processing circuitry in the gauge 110 analyzes ultrasonic reflections from the material that are propagated back to the processing circuitry via the probe 116. During such scanning operations, the probe 116 is in physical contact with the material via the coupling gel. However, during scanning operations, the probe 116 can be become physically decoupled, that is physically separated, from the material, either due to the rough and/or scaly surface of the material or due to user operation.
FIG. 2 illustrates an example of a scanning operation using such an ultrasonic gauge 110 on a material having a non-uniform surface. For clarity of illustration, only the probe 116 of the gauge 110 is illustrated in FIG. 2 for scanning the surface of a material 210. As shown at point A in FIG. 2, the probe 116 is physically coupled to the material 210 and thus the processing circuitry of the gauge 110 will be able to determine the thickness of the material 210 at point A due to the reflection of ultrasonic waves from the material 210 at point A. At point B, however, the probe 116 becomes physically decoupled (i.e., physically separated) from the material 210 due to the ridge and subsequent crevice at point B. As noted above, the processing circuitry of the gauge 110 is configured to maintain continuous readings while the probe 116 is in continuous, uninterrupted physical contact with the material 210. For example, it may be desirable to determine the maximum and minimum thicknesses of the material between points A and E of FIG. 2. However, because the probe 116 has become physically decoupled from the material 210 at point B, the processing circuitry of the gauge 110 may reset the measurement session, such that only the maximum and minimum values between points A and B are recorded. Similarly, even if the probe 116 is physically coupled again to the material 210 after point B, the operator may physically decouple the probe 116 from the material 210 at point C due to the ridge at point C. Such a decoupling will again result in the processing circuitry to restart a new measurement session between only points B and C. At point D, the probe 116 can be physically re-coupled to the material 210 and obtain continuous measurements between points D and E. However, due to the physical decoupling of the probe 116 at points B and C, the processing circuitry of the gauge 110 may output three independent measurement sessions, that is, (i) from point A to point B, (ii) from point B to point C, and (iii) from point D to point E. Accordingly, if it desired to measure the maximum and minimum thicknesses continuously from points A to E, erroneous indications may result due to the physical decoupling of the probe 116 from the material 210.


A sanitary valve assembly including a valve with a field replaceable gasket. The gasket is formed with an opening capable of deformation to a shape which deforms sufficiently to slide over a noncircular retaining surface of the valve head. The valve head retaining surface is provided between a pair of axially spaced laterally extending shoulders including a shoulder formed of shoulder segments separated by concave indentations. Upon passing over the shoulder, the opening in the gasket reassumes its undeflected configuration in which it engages the shoulders thus retaining the gasket on the valve stem. The gasket fits loosely on the valve head when the valve assembly is in the open position, thereby permitting the assembly to be cleaned in place by flushing washing fluid through the clearances between the valve head and gasket.

This invention pertains to valve assemblies, and more particularly to sanitary valves having cleanable-in-place gaskets which are field replaceable.
It has long been known to equip linearly actuated valves with relatively soft gaskets for contacting a valve seat to provide a tight seal. A common feature of prior art valve gaskets was difficulty in replacing the gaskets in the field. Installation of a new rubber or other elastic facing requires stretching and drawing over relatively large projections on the valve stem.
A further problem with the aforementioned prior art valve stems and gaskets is that they are not suitable for food handling applications. Sanitary installations require the use of non-corrosive materials, such as stainless steel and certain synthetic plastics. Further, the equipment should be easily cleanable. Ease of cleaning requires the use of components having a minimum number of crevices for food particles to lodge in during operation. In addition, built-up particles must be easily flushable during cleaning. Ideally, machinery, including valve elements, for handling consumable products should be cleanable without the necessity of any disassembly and reassembly, i.e., the machinery should be cleanable with all the components in place. Many prior art valve elements contain crevices that can trap food particles, and the crevices cannot be cleaned without laborious disassembly and reassembly or the use of longer automatic cleaning cycles.
In my U.S. Pat. No. 4,531,532 I disclosed one form of such an improved assembly. A need exists for additional or alternative forms of sanitary valve assemblies which incorporate field replaceable gaskets for sealing against the valve seat and which are quickly and efficiently cleanable in place.


In the invention, a PWM signal is formed at a frequency of a reference pulse signal, the PWM signal which has a pulse width being changed according to a frequency difference between an FG pulse signal for detecting a speed of a brushless motor and the reference pulse signal of a target speed, an output signal for PWM control is formed by an N-fold frequency of the PWM signal, the output signal for PWM control in which a pulse having the divided pulse width is arranged in each N-divided period, the N-divided period in which each one period of the PWM signal is divided by N, and electric power supply to a coil of each phase of the brushless motor is turned on and off at intervals shorter than that of the output signal control without increasing the frequency of the reference pulse signal. Therefore, speed control performance of the brushless motor is improved while avoiding the upsizing and const increase of the apparatus

1. Field of the Invention
The present invention relates to a method and apparatus for controlling motor drive in which a brushless motor is driven by PWM speed control.
2. Description of the Related Art
Conventionally this kind of brushless motor (also referred to as brushless DC motor or brushless AC motor) typified by a three-phase brushless motor is used for driving various kinds of office automation equipment such as a sheet-feed motor of a printer. In order to accurately drive the brushless motor at a setting speed, the PWM speed control is frequently used as speed control of the brushless motor.
When the PWM speed control is performed by detecting a frequency according to a rotating speed of the brushless motor, an FG sensor is used as means for detecting the rotating speed of a rotor of the brushless motor. A PWM signal is formed at the frequency of a reference pulse signal such that the frequency (phase) of a frequency pulse signal (FG pulse signal) indicating a detection speed obtained by the FG sensor coincides with the frequency (phase) of the reference pulse signal (clock signal) indicating a previously set target speed. In the PWM signal, a pulse width is changed according to a frequency difference (phase difference) between the frequency pulse signal and the reference pulse signal. The PWM signal enables a switching operation of a switching device constituting an inverter circuit in a motor drive unit. Therefore, electric power supply to a motor coil is controlled by the so-called PWM control, and the rotating speed of the brushless motor is controlled at the target speed.
When the brushless motor drive is controlled by the PWM speed control method, a coil current of each phase of the brushless motor alternates between tuner-on and turn-off at periods of the PWM signal, i.e., at periods of the reference pulse signal. At this point, the coil current of each phase tends to be increased at an integral characteristic, and the coil current of each phase tends to be decreased at a differential characteristic.
Therefore, even if duty ratio of a pulse-width of the PWM signal is, e.g., 20%, because the coil currents of the phases are not accurately controlled at magnitude of 20%, there is a fear that the brushless motor is not rotated at desired speed and torque.
In order to solve the above problem, it is thought that the PWM signal is shifted to the higher frequency to perform the on-and-off control of the coil current of each phase at shorter intervals by increasing the frequency of the reference pulse signal. However, in this kind of brushless motor used as the drive source of the office automation equipment, the drive control is frequently realized by the motor drive control apparatus which is formed by a digital signal processor (DSP) or a dedicated motor control IC. In this case, upgrading of DSP or the motor control IC is required for such a vast change that the frequency (period) of the reference pulse signal is changed, which results in the problems that the apparatus becomes extremely expensive while a circuit scale of DSP or the motor control IC is enlarged to remarkably upsize the apparatus. Therefore, it is impractical.
When the rotating speed of the brushless motor is decreased, in order to perform design so as to become a predetermined speed in a rated load state, and in order to keep the predetermined speed in no-load running or in light-load running, it is necessary that the rotating speed of the brushless motor is controlled more finely. In order to perform the fine control, it is necessary to take a countermeasure such as the increase in frequency (period) of the reference pulse signal. However, as described above, the change in clock frequency or register configuration, update of a processing program, or the like is required for such the vast change that the frequency (period) of the reference pulse signal is changed, so that the upgrading of DSP or the motor control IC is required. As a result, there are the problems that the apparatus becomes extremely expensive while the circuit scale of DSP or the motor control IC is enlarged to remarkably upsize the apparatus.
Thus, it is very difficult to take the countermeasure such as the increase in frequency (period) of the reference pulse signal, and conventionally it is impossible to control the rotating speed of the brushless motor more finely. When the brushless motor drive control apparatus is not formed by DSP or the dedicated motor control IC, it is obvious that the above problems are also generated.

Method and apparatus for controlling motor drive


The present invention aims to provide a liquid-pervious sheet suitable to be used as a liquid-pervious topsheet of a bodily fluid-absorbent wearing article. One surface 58 of both surfaces 57, 58 of a liquid-pervious sheet 11 is formed with crests 61 and troughs 62 extending in parallel to one another in a longitudinal direction A and alternate in a transverse direction B. The one surface 58 is additionally formed at least in the respective crests 61 with a series of compressed debosses 70. In the respective compressed debosses 70, thermoplastic synthetic fibers forming the liquid-pervious sheet 11 more densely gather together than in zones surrounding the respective compressed debosses 70 and thereby maintain initial fiber formation of the individual thermoplastic synthetic fibers.

Conventionally, bodily fluid-absorbent wearing articles such as disposable diapers or menstruation napkins are known including a liquid-pervious topsheet, a liquid-impervious backsheet and a bodily fluid-absorbent core interposed between the top- and backsheets. It is known to form the topsheet on one of its surfaces with a first group of crests and troughs alternately arranged to extend in parallel in one direction, and with another group of crests and troughs alternately arranged to extend in parallel in a direction orthogonal to the former group of crests and troughs. It is also known to utilize such a topsheet in a manner such that the crests and the troughs face the wearer's skin.
For example, JP 1983-132155 A (PTL 1) discloses a liquid-pervious nonwoven fabric suitable for use as a topsheet in a disposable diaper or the like. This nonwoven fabric has crests and troughs extending in parallel in a machine direction in the manufacturing process of the nonwoven fabric. The density of the nonwoven fabric is higher in the troughs than in the crests.
JP 2008-25079A (PTL 2) also discloses a liquid-pervious nonwoven fabric suitable for use as a topsheet in a disposable diaper or the like. This nonwoven fabric is generally flat on one surface thereof and formed on the other surface with crests and troughs extending in parallel in a machine direction and similar crests and troughs extending in parallel in a cross direction orthogonal to the machine direction. The nonwoven fabric has a higher density in the crests than that in the troughs.
WO 2008-146541 A1 (PTL 3) discloses a laminate of sheet elements. According to one embodiment, the laminate consists of a first sheet element and a second sheet element laminated together, and both the first and second sheet elements contain thermoplastic fibers. The first sheet element is formed with a plurality of through-holes having the same longitudinal direction. In addition to the through-holes, the first sheet element is formed with a plurality of grooves along the longitudinal direction of the through-holes. The first sheet element and the second sheet element are fusion bonded to each other in a plurality of joint debosses.

Liquid-pervious sheet and method of making the same


The system is operable in either a standby mode, having associated with it a predetermined standby current level, or a plating mode, having associated with it a predetermined plating current level. The system also has associated with it a cut-off current level at which the system is transferred from the plating mode to the standby mode, and a come-on current level at which the system is transferred from the standby mode to the plating mode. A variable voltage generator impresses a voltage across the electrolytic solution, and this voltage is monitored by a microcontroller. The voltage for each mode is the voltage which will produce the predetermined current for that mode. When the microcontroller determines that the voltage has remained stable, that is, with a deviation less than .+-.5% for a predetermined period of one minute, then the microcontroller will provide a signal to the voltage generator to initiate a change of mode.

1. Field of the Invention
In its most general aspect, the invention relates to a system for carrying out a process by sensing the conductivity of a fluid, the process being carried out in different modes dependent on the conductivity of the fluid, and for regulating and stabilizing the power supply to provide a current level for each mode which current level is appropriate to prevailing conditions.
In a specific case, the invention relates to a silver recovery system being operable in either a standby mode, having associated with it a predetermined standby current level, or a plating mode, having associated with it a predetermined plating current level. More specifically, the invention relates to such a silver recovery system wherein there is provided a standby voltage level, for causing the standby current level, and a plating voltage level, for causing the plating current level, and means for regulating the standby voltage level and the plating voltage level respectively in accordance with prevailing conditions.
In the present disclosure, the system is described as being embodied in a silver recovery system.
2. Description of Prior Art
Systems for recovering metals from solution by an electrolytic process as well known in the art, and an interesting and informative history and description of such systems is given at columns 1 and 2 of U.S. Pat. No. 4,776,931, Hardy, Oct. 11, 1988. In this patent, Hardy also describes his own system wherein a plating voltage is reduced to a lower standby voltage if the plating current falls below a threshold value. The standby voltage is periodically increased to its higher plating value for brief intervals to test the current at the higher voltage during these intervals. If the current drawn during any interval is higher than the threshold current level, then the voltage remains at the plating voltage. If it is below the threshold, then the voltage once again drops to the standby level until another sample is to be taken.
The problem with the Hardy system is that both the standby voltage and the plating voltage are predetermined and remain unvaried in spite of prevailing conditions.
This two-stage high-voltage/low-voltage system assumes that conditions are such that the high voltage will always deliver a predetermined plating current, and that the low voltage will deliver a predetermined standby current. However, this does not take into account deterioration of the plating cell occasioned by, for example, electrode oxidation, pH variants, sulphite levels, flow rates, etc. due to which a predetermined voltage will not necessarily, after time, deliver the same predetermined current that it did before the onset of deterioration. These points are also discussed to some extent in the Hardy patent.
U.S. Pat. No. 4,612,102, Brimo et al, Sept. 16, 1986, also teaches a two-stage high-voltage/low-voltage silver recovery system. In the Brimo et al patent, the conductivity of the electrolyte is monitored (by monitoring the current flow) and the driving voltage is set to either a plating voltage or a standby voltage depending on the state of the conductivity of the current. Brimo et al, as Hardy, also assumes that a predetermined voltage will always cause a predetermined current to flow which, as above pointed out, is untrue. The Brimo et al patent is further discussed in columns 1 and 2 of the Hardy patent above referred to.
Other silver recovery systems known in the art are described in, for example, U.S. Pat. No. 4,762,598, Drew, Aug. 9, 1988, U.S. Pat. No. 4,675,085, Vasquez, Jun. 23, 1987 U.S. Pat. No. 4,619,749, Nusbaum, Oct. 28, 1986, and U.S. Pat. No. 5,102,513, Pelkus, Apr. 7, 1992.
The '598 patent describes a silver recovery system which provides a means for counter-acting the ripple of the plating current by providing a current which is sufficient to maintain plating but not high enough to permit the formation of silver sulphide. This is accomplished by controlling the mean value of the current.
In the '085 silver recovery system, the anode and cathode are maintained in a fixed spaced relationship in a casing. The plating voltage, which will be increasing due to increase in resistance of the is monitored until it reaches a predetermined reference value. At that time, a drain is opened to drain the metal containing solution from the casing.
The '749 patent teaches a silver recovering system which has both primary and secondary electrodes. The plating current is correctively changed by detection logic in response to excessive variation in the electrolytic resistance of the liquid.
Pelkus teaches, in the '513 patent, the step of monitoring current and voltage to determine whether there is sufficient silver in solution to continue silver recovery. When the silver of below a predetermined value, a "lock-out" condition is triggered. During this period, no voltage is applied except when sampling. In this regard after "lock-out", further silver will be added to the solution and the content of silver in solution will be monitored at sampling intervals.
As can be seen, none of the references, or any other references known to Applicant, or any systems known to Applicant, provide means for regulating the voltage in the different modes of operation to provide predetermined and desired current levels at these different modes.


This invention relates to a distributed feedback semiconductor laser which achieves distributed feedback by gain coupling by providing periodical changes in the thickness of the active layer (5) or the absorptive layer, and aims to achieve light distributed feedback mainly of periodical perturbation of the gain factor by diminishing the periodical perturbation of refractive index caused by the changes in the thickness of the active layer (5) or the absorptive layer. This invention is characterized by a refractive index canceling structure comprising a combination of layers (6) and (7) of different refractive indices to cancel periodical changes in refractive index caused by the periodical structure of the active layer (5) or the absorptive layer.

The distributed feedback semiconductor laser generates stimulated emission of light by distributed optical feedback to an active layer with a diffraction grating provided near the active layer. The device can produce stimulated emission of excellent lasing spectral characteristics by a relatively simple construction, Therefore, it has been the target of various R & D efforts and is expected to be used as a light source suitable for a long-distance and large-capacity optical communication system, an optical information processing system, an optical memory system and an optical measuring instrument.
Such distributed feedback semiconductor laser has an optical waveguide structure, wherein an active layer is surrounded with transparent hetero-junction semiconductor layers, for efficient stimulated emission. R & D efforts are recently directed toward distributed feedback of light by periodically changing the refractive index in a transparent optical waveguide layer which is placed very close to the active layer. In that case, a diffraction grating, having triangular cross section for instance, is formed on the interface of the optical waveguide layer on the side farther from the active layer.
In the light distributed feedback by such index coupling, however, feedback to phase cannot be matched for the light in Bragg wavelength which is reflected correspondingly to the period of the thickness change in the optical waveguide layer. Because of this phase match condition, stable lasing cannot be obtained and two longitudinal lasing mode whose wavelengths are separated symmetrically in the vertical direction across the Bragg wavelength may possibly be generated at once. Even if only one such longitudinal-mode-lasing takes place, it is difficult to select previously which of the two wavelengths would be lasing. So, the precision in setting lasing wavelength is seriously deteriorated.
In sum, the light distributed feedback using index coupling which is based on the periodical perturbation of the refractive index in the optical waveguide layer has an inherent problem of degeneracy by longitudinal lasing mode of two wavelengths, which is difficult to avoid.
There have been proposed various solutions for the problem. One of them proposed a structure to shift the phase by 1/4 wavelength substantially at the center of the diffraction grating. Those proposals, however, are not quite effective as they tend to make the construction of a laser more complicated, require additional manufacturing steps only for the solution of the degeneracy and need formation of anti-reflection coating on the facets of the laser.
Kogelnik et al. proposed a theory in their paper titled "Coupled-Wave Theory of Distributed Feedback Lasers", Journal of Applied Physics, 1972, Vol. 43, pp. 2327-2335, whereas a stop band is produced around the Bragg frequency when distributed feedback of the light is conducted by index coupling, if distributed feedback is conducted by gain coupling based on the periodical perturbation of gain factors, such stop band would not be produced and longitudinal mode lasing of exclusively single wavelength would be obtained. They did not mention in their paper the specific construction to realize the theory, rather they merely discussed on the result of their theoretical studies.
Some of the present inventors have invented novel semiconductor lasers applying the basic theory of Kogelnik et al., and filed patent applications as follows:
Japanese Patent Application No. 63-189593, filed on Jul. 30, 1988 PA1 Japanese Patent Application No. 1-168729, filed on Jun. 30, 1989 (Publication No. JP-A 3-34489) PA1 Japanese Patent Application No. 1-185001 to 1-185005 filed on Jul. 18, 1989) (Publication No. JP-A 3-49283 to 3-49287) PA1 High (active layer)-intermediate-high-intermediate . . . PA1 Low-intermediate-low-intermediate . . . PA1 (1) The periodic changes in refractive index caused by the absorptive layer and the intermediate refractive index layer are canceled by the periodic changes in refractive index caused by the lower-refractive-index layer and the intermediate-refractive-index layer. PA1 (2) The periodic changes in refractive index caused by the absorptive layer and the lower-refractive-index layer are canceled by the periodic changes in refractive index caused by the lower-refractive-index layer and the intermediate-refractive-index layer. PA1 (3) The periodic changes in refractive index caused by the absorptive layer and the intermediate-refractive-index layer are canceled by the periodic changes in refractive index caused by the intermediate-refractive-index layer and the lower-refractive-index layer. PA1 (4) The periodic changes in refractive index caused by the absorptive layer and the lower-refractive-index-layer are canceled by the periodic changes in refractive index caused by the intermediate-refractive-index layer and the lower-refractive-index layer. PA1 k.sub.0 : wave number in a free space PA1 .beta..sub.0 : propagation constant in z direction PA1 A.sub.q : component of the q-th order when the squares of the refractive indices is Fourier expanded in the z direction PA1 .epsilon..sub.0 : electric field intensity PA1 P: constant obtained by integrating {.epsilon..sub.0 (x) .epsilon..sub.0 * (x)} in the x direction
The inventors succeeded in realizing distributed feedback by gain coupling by the invention constructions which were indicated in the respective specifications and drawings. Many of the constructions shown in these patent applications are provided with periodical corrugation on the surface of an active layer to utilize the periodical perturbation of gain factors caused by the changes in thickness.
The refractive index of the active layer is usually different from that of the surrounding layers as it is necessary to confine the light. If the active layer is corrugated, the refractive index inevitably changes periodically. In other words, the construction having a corrugated surface on the active layer did not achieve the distributed feedback by gain coupling only, but was still subject to the effect of perturbation caused by the index coupling.
Some of the present inventors therefore proposed a design that would diminish the perturbation caused by the index coupling so as to obtain the perturbation caused by the gain coupling alone in the paper, "Purely gain-coupled distributed feedback semiconductor lasers", by Y. Luo, Y. Nakano, K. Tada, T. Inoue, H. Hosomatsu and H. Iwaoka, Appl. Phys. Lett. 56 (17), Apr. 23, 1990, pp. 1620-1622. According to the proposed construction, the thickness of an active layer is periodically changed to provide gain coupling components, and the perturbation of the refractive index due to the corrugated surface of the active layer is canceled by the refractive index perturbation of another corrugation provided nearby with the opposite phase. The GC-DFB-LD which does not substantially contain the index coupling components is herein referred to as a "pure GC-DFB-LD".
Because the overflow of carriers from the active layer should be inhibited, materials of the layers on both sides of the active layer should have sufficiently wide band gap compared to that of the active layer. Such materials, however, have low refractive index, and therefore tend to change the magnitude of the perturbation of refractive index sensitivity to the forms of the two corrugations, for instance, the tooth height of the two corrugations. In order to effectively cancel the perturbation of refractive index, an extremely high manufacturing precision is required.
In the GC-DFB-LD of GaAs based materials which has been realized so far, it was not considered to be a problem because high reproducibility both in their diffraction gratings and the growth shape was relatively easily realized with AlGaAs. But when index coupling components are attempted to be completely eliminated in a device of GaAs based materials, or when the material is inferior in manufacturing precision for canceling the perturbation of refractive index, the process should be controlled thoroughly and strictly.
It is an object of this invention to provide a distributed feedback semiconductor laser which can solve the above mentioned problems of the prior art, which can diminish distributed feedback caused by index coupling and which can obtain the distributed feedback caused mainly by gain coupling.

Distributed feedback semiconductor laser

Optical Measurement Technology Development Co., Ltd.


A hardware memory includes at least one memory cell, peripheral circuitry and randomization circuitry. The memory cell(s) store data, which may be written to, read from and held in the hardware memory. The peripheral circuitry reads and writes data to the memory cell(s) and may perform other functions necessary for facilitating the data read, write and hold. The randomization circuitry randomizes operations performed by the peripheral circuitry to reduce a correlation between the data and the current consumed by the hardware memory.

The present invention, in some embodiments thereof, relates to securing a hardware memory and, more particularly, but not exclusively, to securing an embedded memory against side channel attacks (SCA).
Hardware security has become a serious issue in Very-large-scale integration (VLSI) system on chip (SoC) design. While considerable research has been done on development of secure logic styles, less attention has been paid to designing secured embedded memories. Storing private or secret data in embedded memories is much more beneficial than storing it in flip flops, as the area of a single memory cell may be up to 10λ smaller than the area of flip flops available in the standard cell libraries.
In the recent years the use of cryptographic devices storing secret and sensitive information has expanded and become essential in many applications. Cryptographic devices are vulnerable to many threats, such as tag tracking, jamming, blocking, cloning, and eavesdropping.
Another significant and powerful threat to these devices is extracting the secret key by non-invasive Side-Channel Attacks (SCA). SCA on cryptographic devices exploits unintentionally information leaks from physical channels, such as power consumption, electromagnetic emission, timing properties, etc. In particular, Power Analysis (PA) is a type of SCA, which utilizes the processed information which leaks through the power dissipation of a device. PA is based on the correlation between the instantaneous power consumed by the device and the processed or stored data. It exploits this correlation to extract a secret key or sensitive information. PA attacks do not require any information about the actual hardware implementation of the cryptographic device, only the functionality of the modules has to be known.
Conventional embedded memories, typically implemented by 6 transistor (6T) SRAM bit cells, are highly susceptible to side-channel attacks used to reveal the data stored in the memory array. While embedded memories are usually optimized for density and performance, little attention has been given to defending them against side-channel attacks, such as differential power analysis and electromagnetic radiation.
In the context of Side-Channel-Information (SCA) attacks, data-dependent asymmetric current/power dissipation (which occurs in standard 6T and 8T SRAM bit cells), serves as a potential source to information leakage to be utilized by an attacker. Countermeasures to such attacks can be realized at different abstraction levels. For example, several circuit level solutions were recently suggested, alternating the bit cell configuration by the addition of several transistors [2, 6].
While there are cell-level approaches for combating power analysis attacks, solutions at the bit cell level are often impractical since they require specific peripheral circuitry, resulting in an extra area overhead and complexity. Furthermore, other design considerations, such as performance and stability may be degraded. There are currently no gate-level or architectural design approaches for protecting memory cells or memory arrays against power analysis attacks.
Additional background art includes:    [1] Ravi, Srivaths, et al. "Security in embedded systems: Design challenges."ACM Transactions on Embedded Computing Systems (TECS) 3.3 (2004): 461-491.    [2] Rožić, Vladimir, Wim Dehaene, and Ingrid Verbauwhede. "Design solutions for securing SRAM cell against power analysis." Hardware-Oriented Security and Trust (HOST), 2012 IEEE International Symposium on. IEEE, 2012.    [3] N. Verma and A. P. Chandrakasan, "A 256 kb 65 nm 8T Subthreshold SRAM Employing Sense-Amplifier Redundancy," Solid-State Circuits, IEEE Journal of, vol. 43, pp. 141-149, 2008.    [4] Kocher, Paul, Joshua Jaffe, and Benjamin Jun. "Differential power analysis."Advances in Cryptology—CRYPTO'99. Springer Berlin Heidelberg, 1999.    [5] Ravi, Srivaths, Anand Raghunathan, and Srimat Chakradhar. "Tamper resistance mechanisms for secure embedded systems." VLSI Design, 2004. Proceedings. 17th International Conference on. IEEE, 2004.    [6] Konur, Engin, et al. "Power analysis resistant SRAM." Automation Congress, 2006. Wac'06. World. IEEE, 2006.    [7] A. Juels, "RFID security and privacy: a research survey," IEEE J. Sel. Areas Commun., vol. 24, no. 2, pp. 381-394, February 2006.    [8] P. Kocher, J. Jaffe, and B. Jun, "Differential Power Analysis," in Advances in Cryptology—CRYPTO'99, M. Wiener, Ed. Springer Berlin Heidelberg, 1999, pp. 388-397.    [9] S. Mangard, E. Oswald, and T. Popp, Power Analysis Attacks: Revealing the Secrets of Smart Cards. Springer Science & Business Media, 2008.


A hermetically sealed package comprises an substantially rigid base(3; 22), preferably a tray, a product (2; 23) to be packaged, which in a preferred embodiment is higher than the tray side walls (5), supported on the tray (3; 22), and a stretch film (8; 15) welded to the substantially rigid base (3; 22) along a sealing line so as to form a hermetically sealed enclosure for the product.

The present invention relates to the packaging of consumer goods (food and non food products) in plastic containers.
In particular the present invention relates to improved package constructions comprising a base over which the product to be packaged is placed and a thermoplastic cover film which extends over the product and is welded to the base.
A substantial number of products including foodstuffs, such as cheese, meat, processed meat, poultry, fruit, vegetable, fish, pizza, etc., are currently sold in packages consisting of a base, such as a flat support or preferably a tray, on which the product to be packaged is placed, which is then overwrapped with a stretch film, such as, typically, stretch PVC (polyvinyl chloride) and stretch polyolefin films.
This packages are particularly useful when either a flat support is used as the base or when the base has a tray-like configuration and the product to be packaged is higher than the tray side-walls.
A stretch film is by definition a thermoplastic film that when applied under tension around a product elongates and conforms to the shape of the product to be packaged. Stretch overwrapping is generally carried out using either a horizontal stretch wrapper or an elevator-type stretch wrapper.
In the horizontal stretch wrapper the film is pre-stretched and applied over the product while kept under tension by a suitable grip system. The film is then folded longitudinally around the base supporting the product and sealed longitudinally below said base by means of a center-sealer. The film tubing is then transversally severed and the front and rear flaps thus obtained are folded and welded against the tubing surface by passing the package on a heated belt.
In the elevator-type stretch wrapper, the film is kept tensioned and stretched by raising the product placed on a suitable base against the film. Then the film is folded, both transversely and longitudinally, around the base supporting the product and bunch-sealed against the lower surface of said base by passing the package on a heated belt.
Depending on the type of film employed, passing on a heated belt may be insufficient to close the package by tack welding. In such a case, a pressure-assisted welding step is necessary, wherein a driven overhead pressure roller operates in conjunction with the heated belt.
In both cases, however, the welding that is obtained does not always provide for a hermetically sealed package. As a consequence thereof, purge or in general liquids that exude from the packaged product may leak from the package and contaminate the outside of the same package and/or of the other packages that are stored close to it. Furthermore the presence of a liquid in the tack welding area decreases the strength of the tack welding and the overwrapping film can easily unwrap or anyway the package becomes loose.
PVC is the film most commonly used in stretch overwrapping because it has, in addition to a remarkable elongation, also very good elastic properties, i.e. a good elastic recovery and a very low permanent deformation.
Alternatively, stretch polyolefin films are commonly employed such as those described for instance in EP-A-687,558, Japanese patent application publication no. 262673/1994 (Derwent Accession Number 94-337840), Japanese patent application publication no. 39973/1994 (Derwent Accession Number 94-103866), Japanese patent application publication no. 31882/1994 (Derwent Accession Number 94-086225), Japanese patent application publication no. 155210/1985 (Derwent Accession Number 85-239384), or Japanese patent application publication no. 327936/1992 (Derwent Accession Number 93-002817).
These stretch films may be manufactured by cast extrusion or co-extrusion, using either a flat or a circular film die that allows to shape the polymer melt into a thin film or tube; by heat or glue lamination of two or more cast films obtained as above; or by coating or extrusion coating of a cast film with one or more polymer layers. Alternatively, and preferably, these stretch films are manufactured by the blown film (or hot blown film) process wherein a mono- or multi-layer tube is formed and then, while it is still molten, is blown up like a bubble to generate a large diameter tube from a relatively small circular die.
Said stretch films, besides having remarkable elongation and preferably good elastic properties, may also be heat-shrinkable, i.e. they shrink when heated to a temperature that is above the, Vicat softening temperature of the film polymers but below their melting temperature. Said heat shrink feature is provided to the stretch films, by the process for their manufacture. Said process may involve extruding or co-extruding or extrusion-coating a so-called primary tube or sheet, that is quickly quenched, reheated to a suitable orientation temperature and oriented either mono-axially or bi-axially (trapped bubble process or tenter frame process). Or, as the so-called double bubble method described in EP-A-410,792, it may involve extruding or co-extruding the molten polymer to a hot blown film, heating the obtained film to a temperature above its orientation temperature and reinflating it by a blown bubble process. When the stretch film obtained by one of these methods is heated to a temperature that approximates the orientation temperature, it will shrink tending to return to its original dimension before orientation.
Examples of suitable heat-shrinkable stretch polyolefin films are for instance described in EP-A-286,430, EP-A-369,790, GB-A-2,154,178, EP-A-562,496, U.S. Pat. No. 5,460,861, etc.
Actually, in packaging, the stretch films, either PVC or the stretch polyolefin films, are used in the same way to overwrap the product placed on the flat support or in the tray, as indicated above.
When a heat-shrinkable stretch film is employed, a heat treatment following the bunch-sealing step improves the package appearance by tightly conforming the film to the packaged item. Besides the disadvantage of the poor hermeticity of the stretch overwrapped conventional packages, the cost of getting a package by stretch overwrapping, particularly when expensive polyolefin stretch films are employed, may sometimes be unacceptable at industrial level. A large surface of film is in fact needed to get
the overwrap of the base and the product placed thereupon, and
the overlapping between the edges to be welded together below the base itself.
As a consequence of the large surface of film required, an additional disadvantage of this packaging method resides in the large amount of plastic waste that is generated and that eventually needs to be disposed of.
Defensive Publication US-T-896 016 discloses a sealed package comprising a tray containing a foodstuff and a polymeric film attached to an outwardly extending flange of said tray by means of a heat sealed adhesive wherein the polymeric film has a tab portion extending beyond at least a portion of the perimeter of the flange to provide easy opening of the package by pulling on the tab.
Said polymeric film has a thickness of about 1 to 10 mils (25,4 to 254 xcexcm) and is not stretched over the foodstuff.
As known in the art, a package wherein a film is not stretched over the foodstuff results in a slack, unattractive package which becomes worse upon handling or upon storage under low temperature conditions.
Further drawbacks of said package are inherent in the manufacturing method requiring burdensome and expensive steps
of smearing said heat-sealed adhesive on the tray flange, and
of disposing of a substantial ring portion of film extending beyond the perimeter of the flange to provide material for cutting a tab therein.
FIG. 6 of U.S. Pat. No. 3,587,839 discloses a package consisting of a relatively rigid tray containing a packaged product wherein said tray is closed between an upper stretched elastic film and a lower heat shrunk film. This package involves a large waste of plastic material (i.e. the lower film) compared to a package where the upper film is attached to the tray rather than to an additional lower film.
In turn, the packaging method disclosed by U.S. Pat. No. 3,587,839 comprises the steps of
placing a heat shrinkable film on a platen,
placing a product or a relatively rigid tray containing the product to be packaged on said heat shrinkable film,
placing a stretchable elastic film on said product or on said relatively rigid tray containing the product to be packaged,
moving downward a film holding device to hold both films against the platen along a line around the periphery of said product, or of said relatively rigid tray containing the product to be packaged, spaced outwardly at a predetermined distance therefrom and from the sealing head so that the tensioning of said upper film occasioned by the subsequent lowering of said sealing head may be controlled and uniform,
lowering said sealing head while forcing said upper film into contact with said lower film along a line around and adjacent the periphery of said product or of said relatively rigid tray containing the product to be packaged,
energizing the electrical resistance of said sealing head to heat both films sufficiently to form a welded seal and to severe them along a continuous line around and adjacent the periphery of said product or of said relatively rigid tray containing the product to be packaged,
transporting the thus obtained package to a suitable station to effect an appreciable shrinkage of said lower heat shrinkable film.
In said method the sealing head has the double task of tensioning the upper film and of heating both films sufficiently to form a welded seal and to severe them. Thus, it is required sufficient time to allow said sealing head to become cold before performing the next tensioning a and sealing step otherwise the hot head pierces the upper film while tensioning it. The packaging speed is thereby substantially slowed down.
U.S. Pat. No. 2,147,384 claims a package comprising a relatively stiff opaque backing sheet of material capable of receiving printing impressions on the surface threreof, and a transparent facing membrane of thermoplastic elastic material stretched over and attached to the face of said backing sheet along the edge portions of said sheet and a membrane so as to provide a commodity receiving space between said sheet and membrane within the connected edges thereof, the edge portions of said backing sheet being corrugated and the edge portions of said transparent membrane being fused into the corrugations of said backing sheet. The backing sheet is said to be preferably composed of a cellulose material, preferably coated with casein. In contrast, no information at all are given about the composition of said transparent elastic rubber membrane and the elastic modulus thereof.
Even the packaging method and machine applied for manufacturing said package are not enabled by such document.
It is an object of the present invention to provide a hermetically sealed package for a product supported on a substantially rigid base as well as a method and a machine for manufacturing said package in a quick way.
It is another object of this invention to provide a hermetically sealed package for a product supported on a substantially rigid base as well as a method and a machine for manufacturing said package using less plastic material than necessary according to the prior art.
Preferably, the product to be packaged has a particularly high profile and is placed in a substantially rigid tray.
A first object of the present invention is to provide a hermetically sealed package comprising:
i) a substantially rigid base,
ii) a product to be packaged supported on said substantially rigid base,
iii) a stretch thermoplastic film extending over the product and welded, all around the product, to said substantially rigid base,
iv) said stretched thermoplastic film being heat welded to said substantially rigid base along a sealing line so as to form a hermetically sealed enclosure for the product.
In a preferred embodiment of the present invention, said substantially rigid base is a tray with a hollow or recessed center portion, upwardly extending side walls and a peripheral rim provided with a continuous flange and said stretched thermoplastic film extends over the product and is heat welded all around the tray along said sealing line on said continuous flange.
In an even more preferred embodiment of the present invention, the product to be packaged is higher than the tray side walls.
A second object of the present invention is to provide a method for manufacturing a hermetically sealed package for a product comprising:
a) providing a substantially rigid base,
b) placing said product to be packaged on said substantially rigid base,
c) stretching a thermoplastic stretch film all around said product,
d) welding said thermoplastic stretched film to said substantially rigid base all around the product,
e) cutting at least some of the stretched film extending beyond the outer perimeter of said substantially rigid base,
f) said stretching being performed by stretching and pressing said film against said substantially rigid base along a pressure line, and
g) said welding of said film to said substantially rigid base being performed by heating along a sealing line so as to form a hermetically sealed enclosure for the product.
In the package and in the method of this invention, preferably the stretch film is stretched in at least one direction by at least 10%, preferably by at least 15%, and even more preferably by at least 20%. Typically, the stretch film is stretched in both transverse and longitudinal directions. In such a case the stretch film may be stretched to a different degree in one direction compared to the other.
Preferably, when a heat-shrinkable stretch film is employed, said method further comprises heating said package thereby causing the heat-shrinkable stretch film to shrink.
In a preferred embodiment of the method according to the present invention the substantially rigid base is a tray with a hollow or recessed center portion, upwardly extending side walls and a peripheral rim provided with a continuous flange and said stretched thermoplastic film extends over the product and is heat welded all around the tray along said sealing line on said continuous flange.
In a more preferred embodiment of the method according to the present invention, the product which is placed on the upper surface of the tray center portion is higher than the tray side walls.
In an even more preferred embodiment, the product be packaged is fresh poultry and the method of packaging refers to poultry packaging.
A third object of the present invention is to provide a packaging machine for manufacturing a hermetically sealed package, said packaging machine comprising:
A) means for feeding a thermoplastic stretch film,
B) means for advancing said film over a substantially rigid base bearing a product to be packaged,;
C) means for stretching said film all around the product;
D) means for welding said stretched film to said substantially rigid base all around the product; and
E) means for cutting at least some of the stretched film extending beyond the outer perimeter of said substantially rigid base, wherein
F) said means for stretching comprises a first frame capable of stretching and pressing said film against said substantially rigid base along a pressure line, and
G) said means for welding comprises a second frame capable of heat welding said stretched film to said substantially rigid base along a sealing line so as to form a hermetically sealed enclosure for said product.
As it will be apparent, the present invention overcomes the drawbacks of the prior art in that the hermetically sealed package is manufactured by applying a stretch pressure on the film by means of the first stretching frame acting along the pressure line and by separately heat welding the film by means of a second welding frame acting along the sealing line. Thus, it is avoided any piercing of the film thereby improving the quality of the finished packages and the manufacturing speed is also improved.
Moreover, the waste of plastic material is reduced to a minimum.

Hermetically sealed package, and method and machine for manufacturing it

Abstract: In a method and a machine for manufacturing a hermetically sealed package (1; 101) a stretch film (8; 15) is stretched by means of a stretching frame (17) against a base (3; 22) along a pressure line and is heat welded by means of a sealing frame (18) to the base (3; 22) along a sealing line so as to form a hermetically sealed enclosure for a product (2; 23). (FIG. 4)


An optical communication system is formed by connecting a base station to user stations. Each user station has a transmitting section for upstream communication. The base station has a light source which supplies transmission light used for upstream communication.

1. Field of the Invention
The present invention relates to an optical communication system based on a communication scheme using light and, more particularly, to an optical communication system to which code division multiple access is suitably applied.
2. Related Background Art
An optical communication system based on optical code division multiple access (to be referred to as an "optical CDMA system" hereinafter) is an optical communication system which shares one optical transmission line by coded optical signals from the respective users using spreading codes, thereby performing multiple access. This optical communication system uses light as a communication medium and is used for, for example, an optical communication system based on a passive optical network scheme (to be referred to as an "optical PON system" hereinafter). Assume that an optical CDMA system is to be applied to this optical PON system. In this case, when so-called upstream communication is to be performed, for example, information to be transmitted is primarily modulated into an optical signal first by the transmitting section of a terminal station used by a user. The primarily modulated optical signal is then secondarily modulated (to be referred to as "coded" hereinafter) on the basis of an assigned spreading code. The coded optical signal is transmitted to, for example, a base station used by a communication common carrier through a transmission line.
On the base station side, the coded optical signal is secondarily demodulated (to be referred to as "decoded" hereinafter) by a decoder corresponding to the spreading code. The succeeding optical detecting section primarily demodulates the decoded optical signal and determines the transmitted information. The determination result is received as the transmitted signal.
In this manner, in the optical CDMA system, an optical signal to be transmitted is coded by using a spreading code on the terminal station side, and the received optical signal is decoded by a correlator corresponding to the spreading code on the base station side, thereby performing optical communication.


According to one embodiment, an electronic device includes a printed circuit board housed in a housing, a surface mount part soldered to the printed circuit board, a cooling mechanism which covers the surface mount part from an opposite side to the printed circuit board, a reinforcing portion formed by supplying an adhesive to an outer peripheral edge of the surface mount part and the printed circuit board such as to be across each other, which reinforces a solder joint portion provided between the surface mount part and the printed circuit board and a spacer formed of the adhesive, which is set between the surface mount part and the cooling mechanism and supports the cooling mechanism.

1. Field
One embodiment of the present invention relates to an electronic device, for example, which contains a printed circuit board in which soldered jointed portions of parts mounted on a surface of the board are reinforced with an adhesive.
2. Description of the Related Art
Electronic devices such as personal computers employ surface mount parts, for example, a ball grid array (BGA) in order to increase the package density of the printed circuit board. In the case where surface mount parts of this type are mounted on a printed circuit board, a coating agent or the like is applied on surface mount parts and the printed circuit board to be across over them in some cases for the protection of the jointed parts as discussed in Jpn. Pat. Appln. KOKAI Publication No. 4-122053.
In order to reinforce a solder jointed portion between a surface mount portion and a printed circuit board, which is weak to a stress caused by impulse, for example, a thermosetting adhesive is used. The adhesive is supplied to the outer circumferential edge of the surface mount part and the printed circuit board to be across over them, and then cured. In this matter, the adhesive reinforces the solder joint between the surface mount part and the printed circuit board, and thus the disconnection of the solder joint can be prevented.
In some cases, a surface mount part such as BGA is mounted on a substrate in such a state where a chip, which generates heat, is exposed. In order to cool down such a chip, a cooling mechanism such as a heat sink is provided for the surface mount part, and thus the part is thermally connected to the chip. The cooling mechanism is positioned to have a gap between the chip and itself. This gap is then filled with a grease having a heat conductivity.
If inclined or brought into direct contact with a chip, the cooling mechanism may damage the chip. In order to avoid this, a spacer is provided for the substrate of the surface mount part in order to maintain the gap between the cooling mechanism and the chip. The spacer is, for example, a rectangular-shaped part formed of a resin. The spacer maintains the gap between the cooling mechanism and the chip appropriately, and thus prevents the chip from being damaged due to the inclining of or direct contact by the cooling mechanism.
However, at the same time, it requires the excessive work to mount the spacer to the substrate of the surface mount part. Further, the spacer is required although it is not directly related to the performance of the surface mount part, and thus the number of parts is increased, which causes a higher production cost of the electronic device.


A fluid pressure cylinder can apply a fastening force to an axially movable reciprocating rod. A reciprocating rod 13 is mounted in a case main body 10 so as to be reciprocable in a forward direction and a backward direction, and two lock units 16a and 16b are incorporated in the case main body 10, and the lock units 16a and 16b include: lock sleeves 18a and 18b mounted axially movably and having taper surfaces 22a and 22b; and retainers 19a and 19b holding steel balls 21a and 21b that are fitted in the reciprocating rod 13 axially movably and engaged with the taper surfaces. A fastening cylinder 41 that contains a fastening rod so as to be reciprocable in a fastening direction and a fastening release direction is attached to the case main body 10, a fastening surface 44 contacting with the lock sleeves 18a and 18b being formed in the fastening rod, and the reciprocating rod 13 is fastened by the two lock units 16a and 16b.

In production lines for assembling a plurality of parts and producing industrial products, there is a work operation of taking out one part, i.e., one workpiece at a time by an industrial robot from a workpiece containing unit in which a number of parts are accommodated and then of assembling it to into a product. For example, when assembling a vehicle body, the vehicle body is produced by jointing a plurality of panel materials using a spot welding method or the like, i.e., the panel materials are assembled into the vehicle body by vacuum-holding the panel materials using a vacuum-sucking pad mounted on a robot arm and by transferring them to the vehicle body from the workpiece containing unit. When the robot arm is operated and the panel material, i.e., the workpiece is vacuum-held by the vacuum-sucking pad, vacuum is supplied to the vacuum-sucking pad under a state where the vacuum-sucking pad applies a predetermined pressing force to the workpiece. For this reason, it becomes necessary to apply the pressing force to the vacuum-sucking pad by the robot arm. In order to exert this pressing force on the vacuum-sucking pad, the vacuum-sucking pad is attached to a reciprocating rod driven by a fluid pressure cylinder and when the vacuum-held workpiece is to be transferred by the robot arm, it becomes necessary to fix the reciprocating rod in order to prevent the workpiece from swinging.
Further, when the vehicle body is assembled, as described in Patent Document 1, spot welding may be performed under a state where fastening between workpieces is carried out by a clamp arm, or the workpiece may be transferred by a carrying truck under a state where the workpiece is fastened by the clamp arm. In the case where the clamp arm is opened/closed by the reciprocating rod of the fluid pressure cylinder, it is necessary to fix the reciprocating rod for opening/closing the clamp arm in order to hold a clamped state for a predetermined period of time.
Patent Document 1: Japanese Patent Laid-Open Publication No. 2003-202004