Cracking of gap fill dielectric material in open fields bordering a dense array of conductive features on subsequent thermal processing is significantly reduced or avoided by etching to remove all or a portion of the dielectric material in the open field except for sidewall spacers on bordering metal features. Embodiments also include removing dielectric material from an upper surface of a metal feature having a surface area in excess of about 100 microns.sup.2 to avoid cracking on subsequent thermal processing. An oxide, such as silicon oxide derive from TEOS or silane is deposited and planarized, as by CMP. Embodiments include employing HSQ as a low dielectric constant gap fill material.

The escalating demands for high densification and performance associated with ultra large scale integration semiconductor devices require design features of 0.25 microns and under, such as about 0.18 microns, increased transistor and circuit speeds, high reliability and increased production throughput with a low rejection rate for competitiveness in the market place. The reduction of design features to 0.25 microns and under generates numerous problems challenging the limitations of conventional interconnection technology, including conventional photolithographic, etching and deposition techniques.
Conventional methodology for forming patterned metal layers comprises a subtractive etching or etch back step as the primary metal patterning technique. Such a method involves the formation of a first dielectric interlayer on a semiconductor substrate, such as doped monocrystalline silicon, with conductive contacts formed therein for electrical connection with an active region on the semiconductor substrate, such as a source/drain region. A metal layer is deposited on the first dielectric layer. The metal layer is typically formed as a composite structure comprising sequentially deposited layers of titanium or tungsten, a primary conductive metal layer, such as aluminum or an aluminum alloy, and an upper anti-reflective coating, such as titanium nitride. A photoresist mask is then formed on the metal layer. The photoresist mask typically comprises a pattern of openings corresponding to various patterns consistent with circuit design. Such patterns typically include one or more dense arrays of metal features, such as conductive lines, spaced apart by gaps. Such a dense array of metal features is typically separated from an isolated metal feature or another dense array of metal features by a greater distance than the gap dimension separating the metal features within the particular dense array. For example, metal features in a dense array are typically spaced apart by a distance less than about 1 micron, e.g., about 0.375 microns for metal features of about 0.50 microns; whereas, an open field generally extends a distance greater than about 1 micron, such as greater than about 1.5 microns, e.g., greater than about 2 microns. A dielectric material, such as spin on glass (SOG), is typically deposited to fill in the gaps between the metal features, and baked at a temperature of about 300.degree. C. to about 450.degree. C. for a period of time up to about two hours, depending upon the particular SOG material employed. Planarization, as by chemical-mechanical polishing (CMP), is then performed.
Although semiconductor devices are being scaled in the horizontal direction, they are not generally scaled in the vertical dimension, since scaling in both dimensions would lead to a higher current density and that could exceed reliability limits. Horizontal scaling, therefore, requires conductive lines having a high aspect ratio, i.e., conductor height to conductive width of greater than 1, with reduced interwiring spacings. As a result, capacitive coupling between conductive lines becomes a primary limitation on circuit speed. If intrametal capacitance is high, the possibility for electric inefficiencies and inaccuracies increases. It is recognized that a reduction in capacitance within multi-level metallization systems will reduce the RC time constant between the conductive lines.
Various dielectric materials having a relatively low dielectric constant, e.g., a dielectric constant of less than about 4, have been proposed. One such dielectric material, hydrogen silsesquioxane (HSQ) offers many advantages for use in interconnect technology. HSQ is relatively carbon free, thereby rendering it unnecessary to etch back HSQ below the upper surface of the metal lines to avoid po-son via problems. In addition, HSQ exhibits excellent planarity and is capable of gap filling interwiring spacings less than 0.15 microns employing conventional spin-on equipment. HSQ undergoes a melting phase at approximately 200.degree. C. and it does not convert to the high dielectric constant glass phase until reaching temperatures of about 400.degree. C. in intermetal applications. As-deposited HSQ is considered a relatively low dielectric constant material with a dielectric constant of about 2.9-3.0, vis-a-vis silicon dioxide grown by thermal oxidation or chemical vapor deposition technique which has a dielectric constant of about 3.9-4.2. The mentioned dielectric constants are based on a scale wherein 1.0 represents the dielectric constant of air.
However, in attempting to employ various dielectric materials, particularly low dielectric constant materials such as HSQ, for gap filling, it was found that cracking typically occurs during subsequent thermal processing in fabricating the semiconductor device. Such subsequent thermal processing includes chemical vapor deposition of a planarizing oxide, such as a silicon dioxide derived from tetraethyl orthosilicate (TEOS) by plasma enhanced chemical vapor deposition (PECVD) or silicon dioxide derived from silane by PECVD. Gap fill dielectric cracking actually causes a deposited film to lift off of the metal features, thereby adversely impacting device reliability and increasing the rejection rate.
Accordingly, there exists a need for semiconductor methodology enabling the use of low dielectric constant dielectric materials, such as HSQ, for gap filling a patterned metal layer without cracking upon subsequent processing.

Reduced cracking in gap filling dielectrics


A hand-operated feeler includes a rod on a crossed movement table mounted on a support fitted with an immobilization device at a fixed reference as compared to the part to be measured and a processing unit configured to store and process the results. Such a device results in rapidly measuring the contours of parts including deep and sunken honeycomb cells.

(1) Field of the Invention
The present invention refers to a device and a process for profile measurement.
This can be used notably for complex contour parts such as turbine rotors, to measure the profiles of blade grooves or thin tightness tongues which are sharp peaks designed to etch the annular packing in material which can be sensitive to abrasion, to establish leaktightness by labyrinth seal. The profiles measured could be axial or circular on rotation parts.
(2) Description of Related Art
The metrological devices for profile measurement or more generally for surface contours comprise the following:    the feeler rod comparators and penetration measurement dial, which allow only rudimentary measurements,    more accurate feelers but bulky and consequently costly, situated at the end of multiple articulation passive arms fitted with travelling encoders, an example of which is described in the document FR 2 702 043,    powered feelers mounted flexibly on a moving support where the movements are measured as and when the motor moves the feeler support and when a bending of the feeler is measured: an example is described in the document U.S. Pat. No. 4,622,751; but only simple movements are possible,            non-mechanical devices using photogrammetry and based notably on the reflection of light by the surface to be measured; these are efficient but costly.
The situation is more complicated for the pronounced contour profiles, especially widening out under the surface of the part, which is the case of the blade grooves which are connected at the surface of the part only by a narrower neck. It thus creates a problem for reaching the profile points situated at the bottom of the cavity and above all those of the overhanging parts situated under the neck. Even the feeler mounted on an articulated arm is often insufficient in spite of its flexibility as the feeler must in practice have relatively wide sections in order to possess the required mechanical resistance, and to lodge the passive measuring and maintenance motors of the articulations in stable position. For checks of such profiles, the requester already used gauge sets which were moved up and down the grooves in search of a blocking point or excessive play if any. It is obvious that the gauge sets allow only basic measurements and have the disadvantage of being specific to a given section of grooving. Another method that the requester used consisted in moulding an impression of the groove section, then extracting the mould and measuring its profile under better conditions than the profile of the groove itself. This method, very long, produced good results but was not convenient.
A simple device is being sought after to measure complex or inaccessible profiles, with considerable or hollow contours. A device both simple and inexpensive is required, easy to use and sufficiently accurate—ten or so microns or a few microns for the applications mentioned above.
It has appeared that a hand-operated feeler was the only contour follower likely to offer these advantages although those already mentioned (the comparator and the articulated arm) are clearly insufficient for different reasons.

Device and process for profile measurement


An exemplary liquid crystal display includes a first frame and a second frame. The first frame includes two opposite first side walls, and each first side wall includes at least one slideway defined therein. The second frame includes two opposite second side walls, and the second side walls respectively correspond to the first side walls. Each second wall includes at least one strip provided thereat. The first strips of the second frame are slidable along the corresponding first slideways such that the first frame and the second frame are detachably engaged together.

Liquid crystal displays are commonly used as display devices for compact electronic apparatuses, not only because they provide good quality images but also because they are very thin. A typical liquid crystal display includes a two-part housing; that is, a plastic frame and a metal frame attached together.
Referring to FIG. 14, a typical liquid crystal display 8 includes a top bezel 80, a liquid crystal panel 81, a plastic frame 82, a brightness enhancement film (BEF) 83, a diffusing film 84, a light guide plate (LGP) 85, a reflective film 86, and a bottom tray 87, arranged in that order from top to bottom. The liquid crystal display 8 further includes a linear light source 88 disposed adjacent to the light guide plate 85.
The top bezel 80 includes a plurality of first notches 802 respectively defined in each of four vertical side plates (not labeled) thereof. The bottom tray 87 includes a plurality of second notches 872 respectively defined in a plurality of vertical side tabs (not labeled) thereof. The plastic frame 82 includes a plurality of first ears 822 and second ears 824 outwardly extending from each of four vertical side walls (not labeled) thereof. The first ears 822 of the plastic frame 82 respectively correspond to the first notches 802 of the top bezel 80, and the second ears 824 of the plastic frame 82 respectively correspond to the second notches 872 of the bottom tray 87.
When the liquid crystal display 8 is assembled, the liquid crystal panel 81, the BEF 83, the diffusing film 84, the light guide plate 85, the reflective film 86, and the light source 88 are accommodated in the plastic frame 82. The top bezel 80 and the bottom tray 87 are respectively fixed to the plastic frame 82, with the first ears 822 of the plastic frame 82 respectively fixed in the first notches 802 of the top bezel 80, and the second ears 824 of the plastic frame 82 respectively fixed in the second notches 872 of the bottom tray 87.
In the operation of fixing the top bezel 80 and the bottom tray 87 to the plastic frame 82, the vertical side plates of the top bezel 80 and the vertical side tabs of the bottom tray 87 need to be outwardly pressed to fix the first and second ears 822, 824 in the respective first and second notches 802, 872. In addition, in an operation of detaching the top bezel 80 and the bottom tray 87 from the plastic frame 82, the vertical side plates of the top bezel 80 and the vertical side tabs of the bottom tray 87 need to be outwardly pressed to release the first and second ears 822, 824 from the respective first and second notches 802, 872. The above-described operations are somewhat inconvenient and time-consuming, and this can contribute to the cost of assembling the liquid crystal display 8. Further, the vertical side plates of the top bezel 80 and the vertical side tabs of the bottom tray 87 may be deformed in the above-described operations. When this occurs, the mechanical stability of the liquid crystal display 8 at the top bezel 80 and the bottom tray 87 is liable to be impaired. This is turn may cause the liquid crystal display 8 to malfunction, and may reduce the durability of the liquid crystal display 8.
What is needed, therefore, is a liquid crystal display that can circumvent, overcome or at least mitigate the above-described difficulties.

Liquid crystal display with slidably assembled frames


There can be provided a novel and useful process for the synthesis of hard boron nitride consisting essentially of single phase cubic boron nitride by a gaseous phase synthesis technique, which comprises adding a F atom-containing gas to the gaseous phase or adding a F atom-containing gas and H atom-containing gas to the gaseous phase, whereby the codeposited hexagonal boron nitride can selectively be etched and hard boron nitride of substantially single phase can finally be synthesized.

1. Field of the Invention
This invention relates to a process for the synthesis of hard boron nitride having a very large hardness as well as high heat resistance. The hard boron nitride of the present invention can effectively be applied to the field needing excellent properties such as hardness, heat resistance, oxidation resistance, chemical stability, etc., e.g. cutting tools, wear resistance tools and the like.
2. Description of the Prior Art
The so-called hard boron nitrides such as cubic boron nitride and wurtzite boron nitride can be said to be ideal as a material for tools such as cutting tools, wear resistance tools, etc. because of having a hardness next to diamond and being excellent in heat resistance, oxidation resistance and chemical stability in comparison with diamond. However, since a superhigh pressure and high temperature are required for the synthesis of hard boron nitride, than in the case of diamond, the shape of the product is largely restricted and a very expensive superhigh pressure generating apparatus should be used, resulting in a high synthesis cost and a limitation on the range of use thereof.
As in the case of diamond, processes for the synthesis of hard boron nitride have lately been developed comprising depositing on the surface of a substrate from gaseous phase without using a superhigh pressure and high temperature. According to this gaseous phase synthesis technique, it is considered that the shape of the product is hardly limited and the synthesis cost is largely decreased because of using no superhigh pressure generating apparatus.
As the gaseous phase synthesis of hard boron nitride, there are proposed a number of methods, for example,1 an ion beam method comprising melting and vaporizing metallic boron by an HCD electron gun, reacting with nitrogen plasma in the ambient atmosphere and thus depositing and synthesizing boron nitride on the surface of a substrate, 2 a reactive sputting method comprising sputtering metallic boron with hydrogen or nitrogen, reacting with nitrogen plasma in the ambient atmosphere and thus depositing and synthesizing on the surface of a substrate and 3 a plasma CVD method comprising reacting diborane with nitrogen or ammonia in an atmosphere of high frequency such as microwave and depositing and synthesizing boron nitride on the surface of a substrate.
However, all the above described prior art methods have not succeeded in depositing and synthesizing cubic boron nitride or wurtzite boron nitride of single phase on a substrate from gaseous phase, but have obtained only a mixture of hard boron nitride of cubic or wurtzite type and hexagonal boron nitride of a thermodynamically low pressure phase. The hexagonal boron nitride is not suitable for a tool material because of its low hardness and accordingly, the gaseous phase synthesis boron nitride according to the prior art method has not been put to practical use as a tool material.
In view of the above conditions the present invention has been made for the purpose of providing a novel gaseous phase synthesis process for obtaining hard boron nitride on the surface of a substrate as a substantially single phase, which can practically be used as a tool material.

Process for the synthesis of hard boron nitride


A method and apparatus for controlling the movement of a vehicle side window. The side window is movable by way of a window lifter, of a side door of a motor vehicle. The side window is automatically moved by the window lifter into a predetermined intermediate position as a function of a movement of the side door, the intermediate position deviating from a completely closed or lowered position of the side window. To prevent rattling noises due to the side window, starting from the completely lowered position of the side window, the side window is raised into the intermediate position at least when closing the side door. In this intermediate position, the side window with its upper window edge is moved in at least some sections into a sealing gap which is situated on a railing of the side door.

This applications claims the priority of German Application No. 103 49 912.1-23 filed Oct. 25, 2003, the disclosure of which is expressly incorporated by reference herein.
This invention starts with a method and apparatus for controlling the movement of a side window of a side door of a motor vehicle. Preferred embodiments of the invention relate to methods and apparatus for controlling the movement of a movable side window in a side door of a motor vehicle, said side window being movable by means of a window lifter operated by outside force, in which method the side window is moved automatically by the window lifter into a predetermined intermediate position as a function of a movement of the side door, said intermediate position differing from a completely closed or completely lowered position of the side window.
Such a method for controlling the movement of a side window of a side door of a motor vehicle is known; in this method, said side window is movable by means of an outside force-operated window lifter. In this method, the side window is automatically moved by the window lifter as a function of the movement of the side door from the closed position into the open position, such that the side window is moved into a predetermined intermediate position which deviates from a completely closed or lowered position of the side window. In the state of the art, this is described as a so-called short-stroke lowering. This starts from the completely closed position in which the window is completely raised, then the side window is lowered a few millimeters into the intermediate position when the side door is opened, so that the upper edge of the window is out of engagement with a gasket assigned to this edge of the window, so that opening of the door is facilitated and moreover less stress is put on the gasket. When the side door is again moved out of the open position into the closed position, the short-stroke lowering is canceled and the side window is again raised into the gasket so that the side window resumes the completely raised and closed position. This short-stroke lowering is known from European Patent Document EP 09 17 674 B1 (corresponding U.S. Pat. No. 6,166,508), German DE 41 07 271 A1, and German DE 195 47 582 C2 (corresponding U.S. Pat. No. 5,810,423), for example.
Another method for controlling the movement of a side window is known from German Patent DE 42 03 512 C1, wherein the side window is completely lowered when the side door is opened, so that entering the vehicle is facilitated in particular under tight parking conditions.
An object of certain preferred embodiments of this invention is to provide a method of the type referred to above for controlling the movement of a side window so as to optimize the quality impression given by the vehicle.
This object is achieved with a method for controlling the movement of a movable side window in a side door of a motor vehicle, said side window being movable by means of a window lifter operated by outside force, in which method the side window is moved automatically by the window lifter into a predetermined intermediate position as a function of a movement of the side door, said intermediate position differing from a completely closed or completely lowered position of the wide window, wherein, starting from a completely lowered position of the side window, the side window is raised into the intermediate position at least when the side door is closed, in which intermediate position the side window with its upper window edge is moved in at least some sections into a sealing gap situated on a railing of the side door.
Important advantages achieved with this invention can be regarded as the fact that the side window is supported laterally by the gasket with its upper window edge within the sealing gap in the movement of the side door from the open position to the closed position, so that rattling noises when closing the door are at least reduced. This method is used mainly with frameless side doors and in particular with convertibles which can be parked with the roof down. The side window is often left in its completely lowered position when the occupants leave the vehicle. The inventive method yields a high quality appearance when the side door is closed with the side window lowered because the side window does not cause any rattling noises.
According to an advantageous refinement of certain preferred embodiments of the invention wherein the side window is automatically moved back into the completely lowered position when the side door has again reached its closed position starting from its open position, when the closing of the side door is concluded, i.e., when the lock on the side door has been locked, the side window is completely lowered again into the intermediate position. This locking of the side door lock may be used as a parameter for controlling the window lifter, for example, so that on recognition that the lock is locked, the side window is automatically moved into the completely lowered position, in which it is completely lowered out of the sealing gap and thus is no longer visible.
In a preferred exemplary embodiment of the invention, wherein starting from the completely lowered position of the side window, the side window is automatically raised into the intermediate position when opening the side door, the side window is raised into the intermediate position when the side door is opened, i.e., when the lock is unlocked. Then the unlocking of the lock may be used as a parameter for controlling the window lifter. As an alternative exemplary embodiment, wherein manual operation of a door opening handle of the side door is determined and the side window is then automatically raised into the intermediate position, it is also conceivable for manual operation of the door opening handle by the vehicle user to be determined, whereupon the side window is automatically raised into the intermediate position. Then the operation of the internal door opening handle as well as the exterior door opening handle may be used for this.
According to certain preferred embodiments of this invention, the completely lowered position of the side window is determined. To do so, for example, a limit switch may be provided in the path of the side window. It would also be conceivable for the position of the window lifter which is operated by an outside force to be determined by means of its control device. Such methods of determining the current position of the side window or another movable car body part are known so they need not be described in detail here.
The invention also contemplates apparatus for carrying out the above described methods.
Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.

Method for controlling the movement of a window of a side door of a motor vehicle

Dr. Ing. h.c.F. Porsche Aktiengesellschaft


In an embodiment, a data processing method comprises detecting that a computer is loading a dynamic loader in a user space, the dynamic loader intending to load computer program code; allowing loading the dynamic loader into memory and then suspending operation of the dynamic loader; reorganizing the computer program code into reorganized code by re-ordering a plurality of code segments into a new order that is potentially different than an original order of the plurality of code segments; modifying the dynamic loader in memory to redirect one or more system or library call instructions of the dynamic loader to cause referencing the reorganized code; updating a binary header of the reorganized code to reflect the new order; allowing the dynamic loader to load the reorganized code based on the binary header after the updating.

The approaches described in this section are approaches that could be pursued, but not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.
Computer programs that operate on servers that are accessible over the public Internet, and in other contexts, are known to have vulnerabilities to various kinds of attacks. Certain attacks are implemented by installing unauthorized or malicious code into the programs and causing execution of the foreign code.
Virtualization is a technique with which multiple different host operating systems, with associated computer programs, can run on a single computer or processor under control of a supervisory program, which may be a hypervisor. The use of virtualization creates new opportunities for attacks and new kinds of security vulnerabilities.
The SecVisor academic research project uses permissions bits maintained in an operating system page table to determine whether a page is writable or executable and to set page permissions so that pages of program code are not executable if they are also writable. However, SecVisor provides no mechanism for interworking with the memory page permissions that are maintained in a hypervisor or in a virtual machine monitor (VMM) that is closely coupled to a virtualization-optimized CPU, such as XEN on INTEL processors.
XEN has provided the ability for a privileged domain to register on a hypercall interface for a memory event that is served by the memory handler of the hypervisor. Memory events have been used for demand paging of the domain, for example, for disk swapping of memory pages. Programs listening on memory events could use a different hypercall to read or write pages from or to disk and update page type values to indicate that the pages have been paged in or out. XEN implements a memory page framework denoted p2m that manages memory page type values for the purpose of supporting different uses of memory. For example, when a memory page has been paged out to disk, the memory page type value for that page may be set to "swapped out" (p2m_ram_paged) because the page is unavailable. This type is then converted to a memory access permission of not-readable. If a program attempts to read the page, XEN p2m throws a page fault and its page fault handler will page the memory in from disk, update the memory page type value to a paged-in type (which is converted to an access permission of readable), and return control to the program that caused the fault. Additional memory types exist for pages that are emulating hardware—and thus should cause the I/O emulator to react as if the memory access were a bus access to a peripheral. Additional page types are for shared memory between domains. However, none of the page types represent access permissions different from their type or usage, and thus make altering or restricting memory access permissions further for security—for example, of the content, rather than the emulation purpose—of the page impossible.

This patent is subject to a terminal disclaimer.

Reorganization of virtualized computer programs


A backup method for a system including a network attached storage including a primary volume and a secondary volume, and a backup server connected to the network. The network attached storage performs a resynchronization process when a backup request is received at a time point that consistency of a file system can be guaranteed, the resynchronization process making the contents of the primary and secondary volumes coincide with each other, splits the secondary volume from the primary volume and transfers data of the secondary volume to the backup server while an online operation with the primary volume continues. The backup server stores the transferred data in a recording medium. The network attached storage performs again the resynchronization process for making the contents of the primary and secondary volumes coincide with each other, after backup completion.

The present invention relates to a backup system for files in a network attached storage.
A magnetic disc storage apparatus stores data obtained by a computer. In order to protect the data from accident, disaster and fault, the computer transfers the data to a magnetic tape apparatus. Such a data protection procedure is generally called "backup". In general backup, an operator manually designates a backup source device and a backup destination apparatus (such as a tape drive and a tape library apparatus) to initiate a backup process at a predetermined time and copy data to a backup device such as a magnetic tape.
A recent trend of interconnecting a plurality of host computers and storage devices to form a network is prevailing. This network is generally called a storage area network (SAN) in contrast with a local area network (LAN) such as Ethernet interconnecting a plurality of computers.
Computers and storage devices on SAN are interconnected by transmission paths such as copper cables and optical cables generally called Fibre Channel. The main advantage of SAN is provision of the environment that a plurality of computers can access each storage device in common. For example, data of a plurality of computers can be backed up in a single backup device because this backup device can be shared by the computers. In a system configuration having a number of computers and magnetic disc storage apparatuses, a tape library apparatus and a high speed tape apparatus are often used as a backup apparatus. In such a system, since the backup apparatus can be shared by a plurality of host computers, cost of the system configuration can be reduced.
With the advent of SAN, the number of environments which share a backup apparatus is increasing. A network attached storage (NAS) has therein a unique file system. This file system refers directly to a volume to back up data in the unit of volume, and data backup in the unit of file is impossible. For high speed on-line backup, it is necessary to connect a storage to a high speed I/O bus such as those in SAN and the like.


A tree stand includes a platform having a tree engaging end; a pair of hollow support arms pivotally connected to the sides of the platform; a belt having ends slidable in the support arms for forming a loop around a tree trunk to connect the platform to the tree; latches on the arms for locking the ends of the belt in position; and a bungee cord or spring connecting one end of the belt to the platform or support arms, whereby when one latch is released the belt is pulled into one arm to shorten the loop around the tree.

1. Field of the Invention
This invention relates to a tree stand, and in particular to a stand which can be used to climb and support a load in a tree.
2. Discussion of the Prior Art
As described in the inventor's U.S. Pat. No. 6,588,546, issued Jul. 8, 2003, (which is incorporated herein by reference) tree stands are load supporting platforms used primarily by hunters. The stands are used to climb a tree and to support a hunter at an elevated position on the trunk of a tree. Most conventional tree stands are formed of two parts, including a top or seat platform and a bottom or footrest platform. Examples of such tree stands are disclosed by U.S. Pat. No. 4,488,620, issued to L. R. Gibson on Dec. 18, 1984; U.S. Pat. No. 4,589,522, issued to D. L. Shelton on May 10, 1986; U.S. Pat. No. 4,596,309, issued to J. W. Venson on Jun. 24, 1986; U.S. Pat. No. 4,942,942, issued to R. E. Bradley on Jul. 24, 1990; U.S. Pat. No. 5,097,925, issued to G. T. Walker, Jr. on Mar. 24, 1992; U.S. Pat. No. 5,234,076, issued to R. L. Louk et al on Aug. 10, 1993; U.S. Pat. No. 5,775,464, issued to B. D. Gardner on Jul. 7, 1998; U.S. Pat. No. 5,842,541, issued to N. Arcuri on Dec. 1, 1998; U.S. Pat. No. 5,862,883, issued to S. N. Carriere on Jan. 26, 1999; U.S. Pat. No. 5,921,348, issued to J. M. Louk et al on Jul. 13, 1999; U.S. Pat. No. 5,975,242, issued to R. R. Woller et al on Nov. 2, 1999 and U.S. Pat. No. 6,264,000, issued to S. M. Johnson on Jul. 24, 2001.
It will be noted that the basic elements of tree stands of the type described herein include a planar load supporting platform; a pair of support arms connected to the sides of the platform; a belt having free ends slidable in free ends of the support arms for forming a loop around the tree, and latches on the support arms for releasably locking the free ends of the belt in the free ends of the support arms. Two load supporting platforms are required. An upper platform includes a seat for supporting a person, and a lower platform supports the feet.
When climbing a tree, the outer end of a platform is tilted upwardly so that the belt can be slid up the tree trunk. In the case of the upper platform, the user stands on the lower platform and manually manipulates the upper or seat platform. The lower platform is moved using the feet, which are connected to the lower platform by a strap. The strap is also used to connect the platforms together when the stand is in the storage or transport condition. Obviously, the platforms should be kept as close as possible to the horizontal. As the stand is moved up a tree the length of the loop of belt around the tree must become smaller as the diameter of the tree trunk reduces; otherwise, the platform will no longer be horizontal. Accordingly, the belt must be shortened which is done by releasing one of the latches and pushing the belt into the tubular support arm. A problem with existing stands is the difficulty in making the loop shorter as the trunk becomes narrower. The user is required to release the belt latch with one hand and manually move the belt into the support arm with the other hand. This is particularly difficult when shortening the belt on the lower platform.


A rotating dressing tool (2) coated with abrasive grains for profiling a multi-start grinding worm (4) for the continuous generation grinding of preferably small moduled gear teeth is provided with a stripping zone (6), a pre-profiling zone (7) and a finish profiling zone (8). After being swivelled into their dressing position about a swivel axis (F) at right angles to the axis of rotation of the dressing tool, the profiling zones are brought one after the other into engagement with the grinding worm (4). The number of profile ribs in the pre-profiling zone and finish profiling zone is equal to or greater than the number of thread starts on the grinding worm.

For the dressing of cylindrical grinding worms for the continuous generation grinding of gears in the module range of 1 to 3 mm, gang rolls or full profile rolls are often employed which enclose the desired grinding worm profile over one or more threads. One such tool is known e.g. from CH 686 171 A5, which by a special construction permits the re-machining of the diamond coating of a composite diamond dressing tool for dressing both threads of a two-start cylindrical grinding worm.
Especially in the case of workpiece teeth with a module of less than 1 mm, however, so-called full profile rolls with 3 to 5 profile ribs are used which, in similar manner as a thread dressing roll, simultaneously enclose 3 to 5 adjacent threads of the total grinding worm profile. Such a profile roll is shown in FIG. 1 in mesh with a grinding worm.
A disadvantage of these full profile rolls is that a re-machining of the abrasive coating to correct the flank geometry and to assure adequate surface quality of the ground gears is as yet technically unattainable, and that they must therefore be produced by the very expensive and time consuming negative or reversal process. This means that towards the end of the dressing process the grinding worm threads must be brought one after the other into mesh with several different profile ribs of the dressing tool without further dressing infeed, in order to reduce the effective roughness depth of the grinding worm flanks to the permissible value and to "calibrate" the profile.
For the continuous generation grinding of fine and ultra-fine teeth in the module range up to 1 mm, multi-start grinding worms with more than 5 starts are generally employed. For such grinding worms the well known above mentioned full profile rolls have an inadequate number of ribs available to profile all the grinding worm threads simultaneously, i.e. in the same dressing stroke. For this reason, to produce all the grinding worm threads of these grinding worms when pre-profiling, the profile roll must be put into action axially displaced several times. FIG. 2 shows a three-ribbed profile roll 2 in a first axial dressing position Y1 in a first, second (Y1′) and third (Y1″) grinding worm revolution of a five-start grinding worm with a lead H for producing the first three of the five grinding worm threads. To pre-profile the two remaining grinding worm threads the profile roll is brought to a second dressing position Y2 and Y2′, which is axially displaced by two profiling ribs relative to the first dressing position Y1, Y1′, Y1″. Since the number of grinding worm starts and the number of ribs on the profile roll are not of an integer ratio, the profile rib flanks of the dressing tool are subject to unequal wear due to unequal use, which causes losses in accuracy when subsequently finish profiling.
Another disadvantage of the number of profile ribs being less than the number of grinding worm starts is that the ribs provided on the dressing tool must perform both the pre-profiling work and the finish profiling work. This means that the quality of the finish profiling, i.e. the calibration quality is impaired by the far greater wear of the abrasive coating during pre-profiling.
The disadvantages mentioned above make it apparent that the known full profile rolls with 3 to 5 profile ribs are unsuitable for the profiling of multi-start small moduled grinding worms.
Furthermore in the generation grinding of fine teeth as opposed to the grinding of large moduled workpieces it is usual, when changing over to a new workpiece, to remove the grinding worm profile no longer required, and to profile the grinding worm completely freshly. Since the abrasive profile of the known profile rolls is not suitable for the stripping or removal of the grinding worm profiles no longer required, a separate tool suitable for this expressed purpose must be provided on the machine, or the grinding worm must be removed from the machine to strip it, which makes breaking down and fresh setting up necessary.

Process and dressing tool for the dressing of cylindrical grinding worms for the continuous generation grinding of gears


A nut cracking mechanism for shelling variable-sized nuts having a brittle shell and fragile nut meat, the nut cracker mechanism having a housing with a horizontally positioned rotatable drum contained in the housing, and an adjustable, substantially vertical compression plate mounted in the housing with a cracking surface displaced from a cylindrical slip resistant cracking surface of the drum to form a narrowing gap between the drum and the compression plate, the gap having an upper portion sized to accommodate nuts of varying sizes and a lower portion sized to compress nuts between the cylindrical surface of the drum and the compression plate until the nut cracks and releases its meat, the mechanism having associated components to feed nuts to the top of the mechanism and receive shells and meat from the bottom of the mechanism.

This invention relates to a nut cracking mechanism, and in particular to a nut cracker, that accommodates a nut having a hard or brittle shell with a fragile meat, such as a walnut or pecan. The nut cracker is also of a type that accommodates nuts of varying size, thereby minimizing pre-sort operations.
Different nuts often require different types of mechanisms to effectively remove the shell from the internal kernel. This inventor has experience in devising nut cracking machines for the thick shell macadamia nut. Different nut cracking machines are disclosed in my patents including, Kim, U.S. Pat. No. 5,505,123, issued Apr. 9, 1996, for Nut Cracking Apparatus; and Fredericksen, et al., U.S. Pat. No. 5,247,879, issued Sep. 28, 1993, for Nut Cracking Machine.
Typically, a nut is compressed between two surfaces with sufficient force to crack or fracture the shell sufficiently to release the nut with minimum damage to the internal meat. Shelled nuts that are whole and undamaged command a greater sale price than fragmented nuts and nut pieces.
In a commercial nut shelling operation, a continuous feed of prepared nuts are supplied to one or more cracking and shelling machines which fracture the nut shell so that the nut can be separated from the shell. In general, separating the released meat from the shell and shell debris is accomplished in a subsequent stage from the cracking operation.
Certain nuts, such as walnuts and pecans, have brittle relatively thin shells. This class of nut has a bifurcated kernel with a fibrous membrane separating all but an interconnecting bridge between the two nearly identical halves. In the shelling operation, it is preferred that the kernel is split into halves in order that the membrane can be separated from the meat and discarded with the shells. For this class of nut, recovery of a minimally damaged half-kernel is preferred. Because of the thin brittle shells and irregularly shaped kernel, shelling of this type of nut with a high percentage of minimally damaged half-kernels is a challenge.

Nut cracking mechanism for variable-sized nuts


Method and system for an adapter operationally coupled to a host system and a network is provided. The adapter includes an internal memory that can be configured in a first mode to operate as a dedicated random access memory used by a main processor of the adapter; or configured in a second mode to operate both as a random access memory used by the main processor and also used for storing information received from the network. The method includes enabling the second mode of the internal memory so that the internal memory is configured to operate both as random access memory for the main processor and for storing information received from the network.

1. Field of the Invention
The present invention relates to networks, and more particularly to staging frames in long distance links.
2. Background of the Invention
Storage area networks ("SANs") are commonly used where plural memory storage devices are made available to various host computing systems. Data in a SAN is typically moved between plural host systems (that include computer systems, servers and others) and storage systems (or storage devices, used interchangeably throughout this specification) through various controllers/adapters.
Host systems typically include several functional components. These components may include a central processing unit (CPU), main memory, input/output ("I/O") devices, and streaming storage devices (for example, tape drives). In conventional systems, the main memory is coupled to the CPU via a system bus or a local memory bus. The main memory is used to provide the CPU access to data and/or program information that is stored in main memory at execution time. Typically, the main memory is composed of random access memory (RAM) circuits. A computer system with the CPU and main memory is often referred to as a host system.
Host systems often communicate with storage systems via a host bus adapter ("HBA", may also be referred to as a "controller" and/or "adapter") using an interface, for example, the "PCI" bus interface. PCI stands for Peripheral Component Interconnect, a local bus standard that was developed by Intel Corporation®. The PCI standard is incorporated herein by reference in its entirety. PCI-Express is another Input/Output ("I/O") bus standard (incorporated herein by reference in its entirety) that is compatible with existing PCI cards using the PCI bus.
Various other standard interfaces are also used to move data between host systems and storage devices. Fibre channel is one such standard. Fibre channel (incorporated herein by reference in its entirety) is an American National Standard Institute (ANSI) set of standards, which provides a serial transmission protocol for storage and network protocols such as HIPPI, SCSI, IP, ATM and others.
Networks in general and SANs in particular are now expected to operate at high speeds, sometimes at a rate greater than 4 Gigabits per second ("GB") (for example, 10 GB). Often these systems operate using long links to communicate with each other. The term link as used herein throughout this specification is the actual physical link that connects one device to another. In some instances these links can be 10 kilometer long. The term long link as used herein is not based on any particular length. A long link is a link due to which frames (or data packets) need to be staged before they can be processed by an adapter/controller.
HBAs facilitating data transfer in such high speed environment with long links (for example, 10 Km long) typically use external non-volatile memory devices (for example, random access memory devices) to store frames that are received from the network. The use of external memory devices is expensive and also delays frame processing. This is undesirable in high bandwidth/long link environment.
Although the foregoing problem has been highlighted with respect to SANs, the same problem exists with other types of network that use high bandwidth and long links. For example, an Ethernet network operating over long links can have the same problems where a network adapter has to use external memory (for example, random access memory ("RAM")) for staging frames.
Based on the foregoing, there is a need for a method and system for efficiently processing frames.

Method and system for storing frames in networks


A menu board for supporting elongated menu strips of varying heights is disclosed having adjustable guide rails supported in a frame. The frame includes side members incorporating guide rail support elements disposed along the length of the side members to releasably engage the guide rails. The guide rails are selectively positionable along the length of the side members to provide adjustable spacing between adjacent pairs of guide rails. The menu strips include descriptive indicia such as product names and pricing information and are disposed between and supported by adjacent pairs of the guide rails.

Menu boards are widely used at fast food restaurants, for example, to display menu item descriptions and pricing information to a customer. Such menu boards are generally used at drive-thru services and within the interior of the restaurants to inform the customer of the available products, their prices, and may also include photographs of special menu items. Typically, the menu board is mounted as a front panel to an illuminating box containing a light source for back-lighting the menu board from the interior of the box.
In menu boards of the type described above, it is well known in the art to provide menu item descriptions and pricing information on elongated menu strips which are then positioned forwardly of the light source. The menu strips may include transparent characters or numerals which are thus illuminated by the light source while an opaque surface on the menu strip prevents light from being transmitted through other areas of the menu strip. Examples of such menu strip designs may be found in Porter, II et al., U.S. Pat. No. 4,367,604 and Grate, U.S. Pat. No. 4,461,107 wherein the menu strips are positioned on the menu board between adjacent pairs of guide rails fixed to a front or rear surface of the menu board.
It is generally common in the fast food industry to have menu strips with varying heights as different menu items require more or less description of the product. For example, one menu strip may contain the description "Hamburger" while another menu strip may describe a special combination of "Hamburger", "French Fries" and "Drink", with these descriptions being presented in three separate lines on the menu strip to reduce customer confusion in selecting from available products. In the latter example, it will be recognized that the menu strip will have a greater height than in the former example. Moreover, the restaurant may include photographs of special menu items presented on flexible strips of varying heights which are also positioned forwardly of the light source between adjacent pairs of guide rails.
In the past, menu boards were typically customized for a particular application with the spacing between adjacent pairs of guide rails being fixed at the time of installation. Thus, a fast food restaurant could not change the spacing of the guide rails to accommodate menu strips of varying heights without having to purchase a completely new menu board with different guide rail spacing.
One known attempt has been made in Murray, U.S. Pat. No. 4,521,984 to provide a menu board with limited flexibility to accommodate menu strips of varying heights. In this disclosure, a rigid frame is provided with a series of slots along a pair of side members to capture the guide rails in the slots before final assembly of the frame. In this way, variable spacing between adjacent guide rails is provided by varying the spacing between adjacent slots in the frame. Notwithstanding this effort, however, the menu board frame has fixed spacing between adjacent pairs of guide rails after the menu board has been assembled. Thus, once the frame has been assembled, the spacing between adjacent pairs of guide rails cannot be changed to accommodate menu strips or photographs of varying heights.
Accordingly, a primary object of the present invention is to provide an improved menu board which has flexibility to accommodate menu strips or photographs of varying heights.
Another object of the present invention is to provide such a menu board which is easy to manufacture and economical to use.
Yet another object of the present invention is to provide such a menu board which is readily adaptable to changes in menu item descriptions or in product pricing.


A method for measuring a fill level of a fill substance in a container, in which, in an empty container, at least a part of the microwave signals transmitted into the container is reflected back via a reflection on a floor of the container. Microwave signals are transmitted into the container and their fractions reflected back to the fill-level measuring device. These are received as received signals. Echo functions are derived, which show amplitudes of the received signals as a function of a position corresponding to their travel time traveled in the container. A container floor echo is detected at a position, which lies in an earlier determined, both sides limited, empty echo position range, in which the container floor echo occurs in the case of empty container, at an empty echo position dependent on a shape of the container and an installed position of the fill-level measuring device.

Such fill-level measuring methods are applied in a large number of branches of industry, e.g. in the processing industry, in the chemicals industry or in the foods industry.
Typically, the fill-level measuring device is mounted above the container. In measurement operation, microwave signals are transmitted from the fill-level measuring device toward the fill substance in the container, and their fractions reflected back in the container to the fill-level measuring device are received back as received signals after a travel time dependent on their path distance traveled in the container. Based on the received signals, echo functions are derived, which show amplitudes of the received signals as a function of a position corresponding to their travel time or their path distance traveled in the container. In such case, travel time and path distance are convertable into one another based on the propagation velocity of the microwave signals along the path.
Reflections on reflectors located in the container, reflectors such as e.g. the surface of the fill substance and the container floor, bring about local maxima in the echo functions, referred to herein subsequently as echoes, at a position in the echo function corresponding to their distances from the fill-level measuring device.
For determining the travel times, all known methods can be applied, which enable relatively short distances to be measured by means of reflected microwaves. The most well known examples are the pulse radar method and the frequency modulation, continuous wave radar method (FMCW radar).
In the case of pulse radar, short microwave transmission pulses are transmitted periodically into the container, where they are reflected and, after a travel time dependent on the path distance traveled by them, received back.
In the case of the FMCW-method, a microwave signal is continuously transmitted, which is periodically linearly frequency modulated, for example, in the manner of a sawtooth function. The frequency of the received signal consequently has, relative to the instantaneous frequency, which the transmission signal has at the point in time of receipt, a frequency difference, which depends on the travel time of the associated microwave signal. The frequency difference between transmission signal and received signal, which can be won by mixing both signals and evaluating the Fourier spectrum of the mixed signal, corresponds, thus, to the travel time and therewith to the separation of the reflecting surface from the fill-level measuring device. Furthermore, the amplitudes of the spectral lines of the frequency spectrum won from the Fourier transformation correspond to the echo amplitudes. This Fourier spectrum consequently represents the echo function in this case.
Based on the echo function, a fill-level echo is determined, which corresponds to the reflection of the transmitted signal on the surface of the fill substance. From the travel time of the fill-level echo, there results directly, in the case of known propagation velocity of the microwaves, the path distance, which the microwaves traveled on their path from the measuring device to the surface of the fill substance and back. Based on the installed height of the fill-level measuring device over the container, the sought fill level can be directly calculated therefrom,
In such case, it is desired also to be able to detect the presence of an empty container correctly and reliably. In the case of empty container, there is no reflection of the microwave signals on the surface of the fill substance. Instead, the microwave signals strike, at a distance from the fill-level measuring device subsequently referenced herein as the empty distance, a portion of the container floor, and are reflected there. In measurement applications, in which, in the case of empty container, at least a part of microwave signals transmitted into the container is reflected back via a container floor to the fill-level measuring device, the echo functions have in the case of empty container regularly an echo designated subsequently herein as the container floor echo, which is attributable to the reflection on the container floor.
Problematic, in such case, is that the position of the container floor echo in the echo function in the case of empty container is dependent on the location of installation of the fill-level measuring device and on the geometry of the container. Only in the case of empty container with flat floor are the transmitted microwave signals reflected directly back to the fill-level measuring device. In that case, the container floor echo occurs in the case of empty container at the position within the echo function corresponding to the empty distance.
If, in contrast, the transmitted microwave signals fall in the case of empty container, for example, on an inclined or curved portion of the container floor, then they are reflected corresponding to their angle of incidence, with which they strike the portion, and can, thus, only indirectly be reflected back to the fill-level measuring device via other reflections in the container. Here, in the case of empty container, the fractions of the transmission signals reflected back in the container to the fill-level measuring device travel a path dependent on the location of installation and dependent on the container geometry. The length of this path can, in given cases, be very much greater than the empty distance.
In order to detect an empty container, presently there are already methods applied, in the case of which, based on the echo functions, it is checked, first of all, whether a fill-level echo can be identified within the empty distance. If such is not the case, then, it is checked whether a container floor echo has occurred in a region of the echo functions exceeding the empty distance. Since the container floor echo, depending on container form, can also occur at positions, which are clearly greater than the empty distance, there is, for this, regularly taken into consideration a relatively large range of distances, which range begins at the position corresponding to the empty distance and contains those positions corresponding to distances to the fill-level measuring device, which are greater than the empty distance. If there is in this range of distances a corresponding echo, it is recognized as the container floor echo, and the fill-level measuring device reports an empty container.
This method contains, however, the danger of incorrect empty reports, when a fill-level echo of an actually present fill substance is temporarily not detectable. In that case, due to a container floor echo present in the echo function supplementally to the not detectable fill-level echo, an empty container is indicated.
This case arises, for example, when the fill substance has temporarily a smaller dielectric constant, and, thus, only weak reflections occur on the surface of the fill substance. These weak reflections are not unequivocally identifiable in the echo function due to their small amplitude. Likewise, also turbulence on the surface of the fill substance or foam formation on the surface can lead to the result that the fill-level echo can no longer be identified in the echo function.
Moreover, the fill-level echo can also no longer be directly identified, when the fill level in the container runs over a height, in which a microwave reflecting disturbance, such as e.g. a component installed in a container, such as a stirrer, is located. If the fill level is located at the height of the disturbance, then disturbance echo and fill-level echo superimpose in the same region of the echo function and, accordingly, one cannot be directly distinguished from the another. This problem is, however, today overcomeable by supplemental measures, such as e.g. suitable echo tracking algorithms.

Method for fill level measurement according to the travel time principle


When producing an exposure mask including a stack of reflective layers for reflecting extreme ultraviolet light, an absorber film for covering a light reflection plane of the stack of reflective layers with a predetermined pattern, and a buffer film interposed therebetween, the swing effect and the bulk effect that occur on a transferred portion of the predetermined pattern are specified in accordance with characteristic values of forming materials of the absorber film and the buffer film and optical conditions when exposing, and a forming film thickness of the absorber film is decided in consideration of the specified swing effect and the specified bulk effect so that the line width variation of the pattern and/or pattern shift of the pattern are at their minimum values. As a result, even for an exposure mask capable of dealing with extreme ultraviolet light, the line width variation and pattern shift after a wafer is exposed are minimized, and therefore it is possible to realize miniaturization of a transferred image appropriately.

In recent years, as semiconductor devices are miniaturized, there are needs for miniaturizing a pattern width, a pattern pitch (line width), and so forth, of a circuit pattern formed on a wafer, a resist pattern for forming a circuit pattern, and so forth. These needs can be satisfied by using ultraviolet light having a shorter wavelength to expose the resist pattern. As semiconductor devices are miniaturized, ultraviolet light having short wavelengths is used to expose wafers. For a semiconductor device produced corresponding to a design rule of 350 nm, ultraviolet light having a wavelength of 365 nm is used; for semiconductor devices produced corresponding to design rules of 250 nm and 180 nm, ultraviolet light having a wavelength of 248 nm is used; and for semiconductor devices produced corresponding to design rules of 130 nm and 100 nm, ultraviolet light having a wavelength of 193 nm is used. Currently, ultraviolet light having even a wavelength of 157 nm is used.
It is known that resolutions corresponding to these wavelengths are expressed by Rayleigh's formula, w=k1×(λ/NA), where w represents a minimum width of a pattern that is to be resolved, NA represents a numerical aperture of a lens of a projection optical system; λ represents a wavelength of exposure light; k1 represents a process constant that depends on the performance of the resist pattern, the use of resolution enhancement technology, and so forth. It is known that when the optimum resist pattern and super high resolution technology are used a process constant of k1=around 0.35 can be selected. In the super high resolution technology, ±first order diffraction light that passes through a mask and is diffracted by a light insulating pattern on the mask is selectively used so as to obtain a pattern smaller than a wavelength. Theoretically, a much smaller pattern can be obtained using ±n-th order diffraction light (where n≧2). However, the intensity of the diffraction light remarkably decreases. In addition, the pattern is restricted by the pupil of the projection optical system. Thus, it is not practical to use ±n-th order diffraction light (where n≧2).
According to the Rayleigh's formula, it is found that when ultraviolet light having a wavelength of 157 nm is used and a lens having NA=0.9 is used, the minimum pattern width is 61 nm. In other words, to obtain a pattern width smaller than 61 nm, it is necessary to use ultraviolet light having a shorter wavelength than 157 nm.
Thus, recently, the use of ultraviolet light having a wavelength of 13.5 nm, referred to as extreme ultraviolet light, has been considered for use as ultraviolet light having a shorter wavelength than 157=n. However, there are materials such as calcium fluoride (CaF2) and silicon dioxide (SiO2) that have light transmissivities for ultraviolet light having a wavelength of up to 157 nm. Thus, a mask and an optical system that are capable of transmitting these ultraviolet lights can be produced. However, there are no materials that are capable of transmitting extreme ultraviolet light having a wavelength of 13.5 nm with a desired thickness. Thus, when extreme ultraviolet light having a wavelength of 13.5 nm is used, it is necessary to structure a mask and an optical system as a reflective type mask and a reflection type optical system that reflects light rather than a light transparent mask and a light transmission type optical system, respectively.
When a light reflective type mask and a light reflection type optical system are used, light reflected on a mask surface has to be guided to a projection optical system without interference with light that enters the mask Thus, light that enters the mask should inevitably have an incident angle of φ against the normal line of the mask surface. This angle depends on the numerical aperture NA of the lens of the projection optical system, magnification m of the mask, and the size σ of the lighting source. More specifically, when a mask having a reduction factor of, for example, 5× is used on a wafer, in an exposure apparatus having NA=0.3 and σ=0.8, light enters the mask at a solid angle of 3.44±2.75 degrees. When a mask having a reduction factor of 4× is used on a wafer, in an exposure apparatus having NA=0.25 and σ=0.7, light enters the mask at a solid angle of 3.58±2.51 degrees.
As a reflective type mask that deals with inclined incident light, a mask includes a stack of reflective layers, hereinafter referred to as mask blanks, that reflect extreme ultraviolet light, an absorber film that covers the mask blanks with a predetermined pattern and absorbs extreme ultraviolet light, and a buffer film interposed between the mask blanks and the absorber film The mask blanks are constituted by a structure composed of molybdenum (Mo) layers and silicon (Si) layers that are alternately laminated. Generally, the mask blanks are composed of a total of 40 layers of molybdenum layers and silicon layers. When the absorber film that absorbs extreme ultraviolet light is coated in a predetermined pattern on the mask blanks, incident light is selectively reflected corresponding to a circuit pattern, a resist pattern, and so forth that are to be formed. The buffer film is disposed as an etching stopper that prevents the stack of reflective layers from being etched or to avoid being damaged when defects have been removed from the formed absorber film.
When the foregoing reflective type mask is produced, it is necessary to properly decide the film thickness of the absorber film. Conventionally, the film thickness of the absorber film is decided in accordance with an optical density (hereinafter referred to as "OD") of the absorber film, for example, OD=3. The film thickness of the absorber film that satisfies OD=3 is a film thickness that causes the intensity of incident light to be attenuated to 1/1000. As described in, for example, "Proceedings of SPIE vol. 4343 (2001) pp 409-414 "TaN EUVL Mask Fabrication and Characterization", the value of the OD depends on the reflectance of the surface of the absorber film. The film thickness is decided in accordance with the OD obtained from the reflectance of the surface of the absorber film because a transparent mask that is not capable of dealing with extreme ultraviolet light employs that method.
However, when a reflective type mask dealing with extreme ultraviolet light is used, if the film thickness of the absorber film is decided in accordance with the OD obtained from the reflectance of the surface of the absorber film, the line width variation and the pattern shift to be transferred to a wafer may become large. In the case of the reflective type mask, although the absorber film and the buffer film are formed on the mask blanks that reflect extreme ultraviolet light, the swing effect and the bulk effect may occur on a transferred image on a wafer due to multiple reflections in the absorber film and the buffer film.
More specifically, when the thicknesses of the absorber film and the buffer film are approximately 100 nm and 30 nm, respectively, these thicknesses are larger than a wavelength of 13.5 nm of extreme ultraviolet light, the standing wave effect occurs between extreme ultraviolet light and light reflected by the mask blanks. This standing wave periodically varies the line width and position of the pattern to be transferred to the wafer. In other words, the swing effect, in which the line width and pattern position periodically swing, and the bulk effect, in which they do not periodically vary, occur.
Thus, when the film thickness of the absorber film is decided in accordance with the OD obtained from the reflectance of the surface of the absorber film, the film thickness of the absorber film may be decreased so as to reduce the influence of the light insulating effect of the absorber film (for example, OD=2). However, the foregoing swing effect and bulk effect may cause the line width variation and pattern shift to become too large. As a result, the needs for miniaturizing the pattern width, pattern pitch, and so forth of a transferred image would not be properly satisfied.
Therefore, an object of the present invention is to provide an exposure mask, a method for producing an exposure mask, and a method for producing a semiconductor device, the exposure mask being a reflective type mask being capable of dealing with extreme ultraviolet light, the film thickness of an absorber film being decided so that the line width variation and pattern shift of a pattern exposed on a wafer are at their minimums and so that the exposure mask contributes to the improvement of the performance of a semiconductor device (appropriate address for miniaturization).

Reflective exposure mask, and method for producing and using the same


A host machine executing a connection agent receives a configuration identifying a set of connections to a plurality of storage servers. The host machine later receives a command to run a virtual machine. The host machine determines, based on the configuration, a particular connection of the set of connections to a particular storage server of the plurality of storage servers, the particular connection enabling access to data associated with the virtual machine that is stored by the particular storage server. The host machine then establishes the particular connection to the particular storage server without first receiving a command to establish the particular connection.

Enterprises that use virtual machines (VMs) such as virtual desktops for their employees may have many virtual machines (e.g., on the order of 100,000 virtual machines) stored in disk images on shared network storage. For a host machine to run a virtual machine, that host machine should have an established connection to the storage server that stores the disk image associated with that virtual machine. In traditional virtualization environments, host controllers issue connect commands to the host machine, the connect commands identifying particular storage servers to connect to and how to connect to those particular storage servers. After a connect command has been issued, the host controller issues run virtual machine commands to the host machine. The host controllers additionally issue disconnect commands to the host machine to cause the host machine to disconnect from the storage server.

Managing connections in a distributed virtualization environment


A liquid storage apparatus including a container, an upper cover, a dispensing faucet, a conduit, a gas cylinder and a gas cylinder sleeve. The container includes a cavity and an upper opening. The upper cover is arranged on the upper opening. The dispensing faucet is led out from a side of the upper cover and is connected to the conduit in the upper cover; and the conduit extends to a bottom of the container. The upper cover includes an adjusting knob, and a pressure of the cavity of the container is adjusted by rotating to open or close a valve of the gas cylinder. The pressure in the container can be adjusted since the gas cylinder is arranged in the container and the valve of the gas cylinder can be opened or closed by rotating the adjustment knob.

Beverages, such as beers, strong ciders and some wines, may contain dissolved carbon dioxide and/or other gases, which enables the beverages to be carbonated or bubbly. The dissolved gas may escape from the solution, causing the beverages go flat. Specifically, the beverages tend to go flat when the beverages are exposed to the atmospheric pressure. The beverages that went flat are not welcomed by the consumers.
The change of the pressure in a liquid container, affected by the external environment, will affect the change of the pressure of the carbon dioxide in the container. Therefore, the liquid container is required to be able to adjust the pressure in the container.


A sealing ring for a seal assembly used in oil field equipment including an elastomeric body and a reinforced face. The reinforced face is of molded polytetrafluoroethylene and is integral with the elastomeric body to provide improved pressure capability for the seal without the need for backup rings. The elastomeric body is formed to have a waisted cross section with a narrower portion in the middle and a wider portion at each end. The wider ends provide multiple sealing surfaces and allow fewer rings to be used.

This invention relates in general to a sealing ring construction and more particularly to the components of fluid seal assemblies used to provide inner diameter and outer diameter sealing on oil field equipment.
It is common practice to use seal assemblies to form a fluid barrier on the inner diameter or exterior diameter of oil field equipment, such as gas lift valves, safety valves, and circulating tools. Typically, a seal assembly includes a center element, one or more sealing rings, and one or more backup rings. The sealing rings typically are V-shaped or Chevron type packing rings, which have a concave, V-shaped bottom surface, a convex top surface and straight sides. Such rings are commonly known as V-rings. An example of such an assembly is shown in U.S. Pat. No. 4,811,959. Multiple V-rings may be necessary to provide a sufficient number of sealing surfaces for an effective seal.
The service conditions for seal assemblies can vary widely in temperature, pressure and the type of liquid or gas being sealed. Temperatures can range from -70.degree. F. to 400.degree. F., with pressures from atmosphere to 20,000 psi. To accommodate the varying service conditions, various materials and combinations of rings and backup rings are used. U.S. Pat. No. 4,811,959 describes a large variety of ring materials including fabric impregnated with rubber, asbestos with a plastic binder or elastomeric material, wire mesh, asbestos cord, ceramic fibers, and elastomeric materials wrapped with tetrafluoroethylene-propylene copolymer or terpolymer.
Multiple non-elastomeric backup rings may be used to give strength to the sealing rings in order to accommodate high pressures. Often, when the seal assembly is taken apart and reassembled for repair or other reasons, the backup rings are inadvertently left out or too few backup rings are replaced. Error in installation of the backup rings can result in excessive deformation and destruction of the V-rings and substantial wear, inefficient operation and leakage of the seal.
In view of the foregoing, a need exists for a seal assembly which can accommodate high pressures without the need for backup rings. Also, a need exists for a seal assembly which reduces the number of sealing rings necessary to provide an effective seal.