A power strip that is resistant to the tampering of children is provided. The power strip includes a non-conductive housing and multiple electrical sockets. In front of each socket is a non-conductive plate with holes corresponding to the holes of the outlet. The plate is spring-biased into a first position so that the holes in the plate are out of alignment with the holes in the socket to prevent a child from inserting anything into the socket. A non-conductive barrier is disposed between the spring that biases the plate and the conductors that connect the sockets together to prevent inadvertent contact between the spring and the conductors. A depression is formed in the housing so that, when the prongs of a standard three-prong plug are inserted into the holes of the plate to rotate the plate, all three prongs will make contact with the plate and rotation thereof will be facilitated. The power strip may include a surge protector as well.

1. Field of the Invention
The invention relates to power strips, and more particularly to multiple outlet power strips that are tamper-resistant so as to prevent children from injury.
2. Description of Related Art
Power strips are commonly employed electrical devices for enabling several appliances to be operated from a single power source. A common power strip has a plug, for plugging into the power source, and multiple outlets. The plugs from each of the appliances are inserted into the outlets of the power strip and all can be used simultaneously.
Surge protectors or suppressors are common electrical devices which prevent sensitive electrical appliances and equipment (such as computers and audio systems) from being harmed by sudden spikes in voltage. A voltage surge is typically considered to be a transient wave of voltage on the power line, having an amplitude of up to several thousand volts and a duration of between 1-100 milliseconds. Common effects of voltage spikes are damage to electronic components and/or loss of data and programs in computer memories. Voltage spikes can be caused by a number of events, such as lightning striking power lines, switching of transmission lines by electrical utilities, or rapid connections or disconnections of large loads on the same line. The surge protector acts as a buffer and limits the peak voltage applied to an electronic device to a level which will not harm the device. Surge protectors typically employ a clipping circuit for this purpose.
The physical structure of a surge protector typically includes a non-conductive housing having a number of electrical sockets formed therein. The sockets typically are linked by common conductors and are formed in a row. The most common type of surge protector includes one row of sockets and is sometimes referred to as a power strip.
In households having small children, electrical outlets are commonly childproofed for safety reasons. If an electrical outlet is left exposed, small children are able to inadvertently or intentionally insert electrically conductive objects into the outlet. Such action may have a deleterious effect on both the children and the electrical system of the house; the electrical system may short out, and the children may be injured or electrocuted.
Typically, a plastic plug is inserted into an outlet to childproof it. This prevents the insertion of another object. However, when it is desired to use the outlet, the plastic plug must be removed. It is not uncommon to lose the plug during the use of the outlet and then not be able to replace the plug in the outlet afterwards.
Electrical outlets have been developed that have child safety features integrally formed therein. One common design includes a cap which is pivotally mounted on top of the outlet. In order to use the outlet, the cap must be flipped up to expose the socket. Another common design entails placing a rotatable nonconductive plate over the socket. The plate has holes which correspond to the socket. However when the outlet is not in use, the plate is biased in a position where the holes in the plate do not align with the holes of the socket. When it is desired to use the outlet, the plate is rotated or slid so as to align the plate holes with the outlet holes. Typically, the plate is mounted to the socket and biased with a torsion spring. Such an arrangement is depicted in, for example, U.S. Pat. Nos. 2,154,160 to Hamilton and 2,752,581 to Benander. Use of torsion springs is not, however, a perfect solution, as they are prone to break.
Another childproof outlet is described in U.S. Pat. No. 4,584,430 to Belknap. Belknap describes a plate mounted in front of a socket having radially extending arms disposed on opposing sides of the plate. Nonconductive linearly resilient bands such as rubber bands are attached to these arms and also attached to fixed points on the housing. The rubber bands bias the plate in a position where the holes of the plate are not aligned with the holes of the socket. This outlet suffers from the deficiency that rubber bands are prone to become brittle with age and use.
A similar outlet is described in U.S. Pat. No. 2,524,250 to Bierce. In this reference, a plate is rotatably mounted in front of a socket and is provided with holes corresponding to the holes in the socket. A coil spring biases the plate in a position where the holes of the plate are not aligned with the holes of the socket. The spring is disposed in an arcuate slot and is bent in an arcuate fashion alone the slot. Such non-linear deformation is conducive to shortening the life-span of the spring.
Most of the above outlets are designed for two-pronged plugs. Only Belknap illustrates a third ground hole to accommodate three-prong plugs. The standard three-prong plug possesses a ground plug that is substantially longer than the other two plugs. The preferred method of turning the childproofing plate out of the way so that its holes align with the holes of the socket is to insert a plug into the holes of the plate and turn the plate by hand. However, since the ground prong of the three-prong plug is substantially longer than the other two prongs, it is difficult to insert all three prongs into the holes of a plate such as that described in Belknap; the ground prong will enter the ground hole, but the other two prongs will be too short to enter their respective holes. As a result, the plate must be turned by another more cumbersome means, such as by use of fingers alone. Depending on the strength of the biasing means, this procedure can be very difficult.


An air conditioning control device and a method thereof are provided, and the air conditioning control method includes the following steps. A plurality of predetermined state information and a current state information are generated according to environment states of a physical space, and a target state information is selected form the plurality of predetermined state information according to a minimum energy consumption. Moreover, the current state information and the target state information are utilized to generate a current effective temperature value and a target effective temperature value, and a set temperature value and a return-air temperature value are extracted from an air conditioning controller. The current effective temperature value, the target effective temperature value, the set temperature value and the return-air temperature value are utilized to execute fuzzy inference to generate a temperature fine-tuning value. The temperature fine-tuning value is utilized to adjust the set temperature value.

In recent years, other than the improvement in energy efficiency of equipment itself, there is an increasing number of buildings introducing energy management system to execute the intelligence management on energy consumption, such as schedule controlling or scenario controlling on air conditioning, lighting, heat exchange systems etc., and the potential energy saving may be further promoted via the energy information and communication technology (EICT) and the combination of sensors, controllers, embedded systems and energy managements.
The majority of current heating, ventilation and air conditioning (HVAC) systems control the airflow and the chilled-water flow thereof by the difference between the set temperature value and the return-air temperature value. However, the sensors detecting the return-air temperature value is not located in the actual field environment or the sensors have insufficient quantities to response the actual distribution state in the space. Therefore, the return-air temperature value obtained by the HVAC system is often unable to indicate the real state of the field environment and the actual feeling of personnel in the space. Furthermore, as regards the control on the set temperature value, the field personnel usually has to manually adjust the set temperature value stored in the HVAC system, in real-time, thereby resulting the system being used inconveniently.
In other words, at present, the large-scaled air conditioning control devices are often unable to obtain the real state with reference value, thereby causing difficulties in controlling the air handling unit (AHU) or the fan coil unit (FCU) inside the large-scaled air conditioning control device, and also causing the field environment being undercooling/overheating with the occurrence of energy-waste. Furthermore, the majority of large-scaled air conditioning control devices currently have to rely on the field personnel's experience to manually adjust the set temperature, thereby resulting the device being used inconveniently.

Air conditioning control device and method thereof

Industrial Technology Research Institute


Combinatorial libraries that contains various different 4, 5 fused 3-substituted-2-pyrrolocarboxylic acids for screening pharmacological activity and methods of synthesizing said libraries.

Modern day drug discovery is a multi-faceted endeavor. Researchers commonly delineate a biochemical pathway that is operative in a targeted pathological process. This pathway is analyzed with an eye toward determining its crucial elements: those enzymes or receptors that, if modulated, could inhibit the pathological process. An assay is constructed such that the ability of the important enzyme or receptor to function can be measured. The assay is then performed in the presence of a variety of molecules. If one of the assayed molecules modulates the enzyme or receptor in a desirable fashion, this molecule may be used directly in a pharmaceutical preparation or can be chemically modified in an attempt to modulate its beneficial activity. The identified molecule that exhibits the best profile of beneficial activity may ultimately be formulated as a drug for the treatment of the targeted pathological process.
With the use of high-throughput screening techniques, one can assay the activity of tens of thousands of molecules per week. Where molecules can only be synthesized one at a time, the rate of molecule submission to an assay becomes a debilitating, limiting factor. This problem has led researchers to develop methods by which large numbers of molecules possessing diverse chemical structures can be rapidly and efficiently synthesized. One such method is the construction of chemical combinatorial libraries.
Chemical combinatorial libraries are diverse collections of molecular compounds. Gordon et al. (1995) Acc. Chem. Res. 29:144-154. These compounds are formed using a multi-step synthetic route, wherein a series of different chemical modules can be inserted at any particular step in the route. By performing the synthetic route multiple times in parallel, each possible permutation of the chemical modules can be constructed. The result is the rapid synthesis of hundreds, thousands, or even millions of different structures within a chemical class.
For several reasons, the initial work in combinatorial library construction focused on peptide synthesis. Furka et al. (1991) Int. J. Peptide Protein Res. 37:487-493; Houghton et al. (1985) Proc. Natl. Acad. Sci. USA 82:5131-5135; Geysen et al. (1984) Proc. Natl. Acad. Sci. USA 81:3998; and Fodor et al. (1991) Science 25:767. The rapid synthesis of discrete chemical entities is enhanced where the need to purify synthetic intermediates is minimized or eliminated; synthesis on a solid support serves this function. Construction of peptides on a solid support is well known and well documented. Obtaining a large number of structurally diverse molecules through combinatorial synthesis is furthered where many different chemical molecules are readily available. Finally, many peptides are biologically active, making them interesting as a class to the pharmaceutical industry.
The scope of combinatorial chemistry libraries has recently been expanded beyond peptide synthesis. Polycarbamate and N-substituted glycine libraries have been synthesized in an attempt to produce libraries containing chemical entities that are similar to peptides in structure, but possess enhanced proteolytic stability, absorption and pharmacokinetic properties. Cho et al. (1993) Science 261:1303-1305; Simon et al. (1992) Proc. Natl. Acad. Sci. USA 89:9367-9371. Furthermore, benzodiazepine, pyrrolidine, and diketopiperazine libraries have been synthesized, expanding combinatorial chemistry to include heterocyclic entities Bunin et al. (1992) J. Am. Chem. Soc. 114:10997-10998; Murphy et al. (1995) J. Am. Chem. Soc. 117:7029-7030; and Gordon et al. (1995) Biorg. Medicinal Chem. Lett. 5:47-50.
Substituted indoles are a class of bioactive, heterocyclic molecules that have attracted considerable attention in the pharmaceutical industry. Bunker, Edmunds et al., Bioorg. Med. Chem. Lett. 1996, 6(9), 1061-66.
Methods for the solution phase preparation of 3-aryl-2-indolylcarboxylic acids have been reported. Ger. Offenlegungschrift 1,812,205, Sumitomo Chemical Co. ltd.; Chem. Abstr., 71, 124521 F (1969); Zeeh, B. Chem. Ber. 1969, 102, 678-685. In this method, two equivalents of an isonitrile are condensed with one equivalent of diarylketone with boron trifluoride catalyst. This route is limited to the production of particularly substituted 3-aryl-2-indolylcarboxylic acids. The solution phase chemistry method also has practical limitations, which hinders the synthesis of thousands of analogs that are possible with a solid phase synthesis approach.

Combinatorial library of 3-aryl-1H-indole-2-carboxylic acid


A method is disclosed that comprises the steps of preassembling the connector pipe in a support; coupling a frame to the pipeline at or towards an end thereof such that the location of at least one part of the frame is known with reference to the throughbore and the end of the pipeline; engaging the support with a portion of the frame; substantially aligning the connector pipe with the end of the pipeline; and connecting the connector pipe to the end of the pipeline. A cutting tool is also disclosed that can be coupled to a portion of a guide means and used to cut the pipeline at a predetermined distance from the guide means such that the end of the pipeline is created. A remotely operable vehicle can be used to remotely actuate and control the connection of the pipe and the pipeline.

There are existing methods for replacing part of a pipeline with a spool piece. For instance, the pipeline is cut at two axially spaced locations and the portion of pipeline between the cuts is removed. Towards each cut end, the pipeline is raised to a particular height relative to the seabed. A connector pipe is lowered in a frame onto the seabed adjacent each cut end and the frame is set at a predetermined height relative to the seabed so that the connector pipe is at a similar height to the pipeline. The pipe and the pipeline can then be connected. However, since the seabed is not uniform, natural variations in height and inclination can result in misalignments and complications in achieving the connection of the connector pipe to the existing pipeline.

Apparatus for connecting a connector pipe to a pipeline


A method and system is devised for handling blind sectors in redundant sensors of a vehicle. Blind sectors of the redundant sensors are detected, and if they qualify as large blind sectors, any intersection of such large blind sectors that lies within a monitored zone extending from the vehicle yields a critical signal sent to the driver of the vehicle, or to the navigation system in case of an autonomous vehicle.

Today's vehicles, including autonomous or driverless ones, commonly use sensors mounted on the vehicle to detect possible obstacles and allow avoidance behavior, such as a complete stop or a trajectory change, so as to navigate safely through environments. «Sensor» as used herein, designates an opto-electronic apparatus, such as a LIDAR sensor, based on the principle of emitting a lightwave beam, catching the reflections of objects in the field of view, and providing distance information about reflecting objects, with a given scanning frequency in one or multiple scanning layers.
Sensors are susceptible to obstructive elements such as dirt, dead bugs, droppings, soap residues or water spots, or even cracks in the protective housing for the opto-electronic, with such protective housing being an integral part of the sensors, or being added around and about them by protective elements of the vehicle (glass or other material that is transparent to the optical beam used by the sensor). Such obstructive elements disrupt the accuracy of the sensors by effectively creating blind sectors in the scanning layer(s), and putting navigation of the vehicle at risk. Systems have been devised to help increasing availability of reliable data from sensors by checking the conditions of their protective housing, and/or cleaning it as the case may be, and keeping sensors free of obstructive elements as long and as often as possible. However, there remains periods of time when this is not the case.
To increase safety and availability, redundancy in sensors has been introduced, with «redundant sensors» defined as sensors mounted on the vehicle, and being redundant relatively to each other, i.e. sharing at least one region of overlap between scanning layers, with that region containing a monitored zone extending from the vehicle. This includes sensors not having scanning layers in the same plane (for example with sensors mounted at different heights of the vehicle), to the extent there is an overlap region when such layers and monitored zone are all projected orthogonally on a substantially horizontal plane within the vehicle's reference system.
«Monitored zone» as used herein, designates a zone extending from the vehicle, designed to detect every obstacle onto and close to the vehicle trajectory that is creating a risk of collision. The maximum size of the monitored zone is such that the monitored zone is contained entirely in the region of overlap between scanning layers. The actual size within that limit may be either fixed, or dynamically calculated as a function of the speed, steering and mechanical characteristics of the vehicle (shape of the vehicle, maximal deceleration, brake reaction time) or latencies of the software onboard the vehicle (for example software that is controlling an autonomous or driverless vehicle), or a combination of one or more of these parameters. For example when the vehicle is stopped, the monitored zone has no surface. The person skilled in the art will recognize that the concept of dynamic calculation of a monitored zone, «protected field» or «monitoring range» within the boundaries of the field of view of a sensor, based in particular on the motion vector of a vehicle on which the sensor is mounted, is known in the prior art. The person skilled in the art will also recognize that a dynamically calculated monitored zone meeting the criteria of the foregoing definition, may be arrived at in many different technical ways.
However, even with redundant sensors, there remains a risk that both sensors be simultaneously affected by obstruction and blind sectors leading to an unsafe blind area in the monitored zone. There is therefore a need for a method and system for improved handling of blind sectors of redundant sensors in a vehicle.

Method and system for handling blind sectors of scanning layers of redundant sensors in a vehicle


Described are biaxially oriented polylactic acid (BOPLA) films with a novel formulation that exhibits a softer feel and quieter sound, without jeopardizing film making stability. The films can be used, for example, in packaging applications. The films can be metallized, or combined with barrier coatings or layers, for improved gas barrier properties particularly for moisture vapor transmission barrier desired in packaging applications. The films can also be printing films for packaging applications and may be transparent or matte in appearance. The films have characteristics that are beneficial to converting processes, are economical, and maintain bio-compostability similar to typical BOPLA films.

Biaxially oriented polypropylene (BOPP) films are typically used for packaging, decorative, and label applications and often perform multiple functions. In a lamination, they provide printability, transparent or matte appearance, or slip properties. The films sometimes provide a surface suitable for receiving organic or inorganic coatings for gas and moisture barrier properties. The films sometimes provide a heat sealable layer for bag forming and sealing, or a layer that is suitable for receiving an adhesive either by coating or by laminating.
However, in recent years, interest in "greener" packaging has been strongly developing. Packaging materials based on biologically derived polymers are increasing due to concerns with renewable resources, raw materials, and greenhouse gas generation. Bio-based polymers are believed—once fully scaled-up—to help reduce reliance on petroleum, reduce production of greenhouse gases, and can be biodegradable or compostable as well. Bio-based polymers such as polylactic acid (PLA)—which is currently derived from corn starch (but can be derived from other plant sugars) and thus, can be considered to be derived from a renewable resource—is one of the more popular and commercially available materials available for packaging film applications. Such bio-based polymers used for packaging applications can also be degradable and/or compostable in certain situations.
For such a bio-based polymer to be fit-for-use for many snack food packaging applications, it is desirable that the bio-based polymer film match as many of the attributes possible that BOPP is well-known for, such as heat sealability, printability, controlled COF, metallizability, barrier, etc. For example, for high barrier packaging, metallized oriented PLA films should demonstrate good oxygen and moisture barrier properties. For metallized oriented PLA in particular, good oxygen barrier property is generally easily achieved due to the polar nature of PLA, which provides good hydrogen-bonding of the polymer molecules. However, this polar nature tends to be detrimental for achieving high moisture barrier. Without being bound by any theory, the thought is that water molecules—being polar themselves—may more easily migrate through a polar polymer film than a non-polar polymer film.
In recent applications of biaxially oriented polylactic acid (BOPLA) films used in place of BOPP in snack-food packaging applications, it has been noted that the higher stiffness and modulus of BOPLA films versus BOPP films, have resulted in a "noisier" package, particularly for flexible bag packaging for salty snacks such as corn-based chips or potato chips. Many consumers have noted that chip packaging utilizing a lamination of a BOPLA print film and a BOPLA metallized gas barrier film is significantly louder during handling (i.e. opening of the chip bag, reclosing of the chip bag) than traditional packaging using a lamination of a BOPP print film and a BOPP metallized gas barrier film; or even an hybrid package lamination including a BOPP print film and a BOPLA metallized gas barrier film. For some consumers, the increased loudness or noisiness of the BOPLA/BOPLA laminate package is objectionable compared to traditional BOPP/BOPP laminate packages. Of note, however, is that if a laminate package is made using a BOPP film laminated to a BOPLA film, the noise generated could be acceptable to the consumer. However, such "50%" bio-based laminate does not satisfy the above requirements of being "green" because the proportion of sustainable, renewable materials is not as high as desired; furthermore, it does not bio-degrade or compost due to the high percentage of OPP in the laminate structure. Thus, it appears that to reduce noise in an all-BOPLA laminate package structure—and also retain its high renewable material content and compostability—it is necessary not only to "soften" but also to "quiet" the BOPLA film. Quieter BOPLA films for packaging applications that maintain compostability of the package and suitable processability are described.
Modifier and additives have been added to BOPLA films to reduce the modulus and stiffness of the BOPLA films. U.S. Pat. No. 7,128,969 describes a film composed of a base layer of PLA with a minority component of a thermoplastic or polyolefin such as polypropylene or polyethylene, typically less than 1% by weight of the base layer. Such a formulation is particularly suitable for thermoforming or biaxial stretching by means of pneumatic drawing or other mechanical forming. However, this patent does not include formulations that also reduce the noise of the film, and maintain compostability and suitability for processing.
U.S. Pat. No. 5,908,918 describes an impact-modified PLA packaging film using a degradable impact modifier and plasticizer. The impact-modifier is preferably combined with the plasticizer to achieve the desired improvement in impact strength and flexibility. The use of low molecular weight, migratory plasticizers, however, can be detrimental to other useful properties desired in packaging films such as metallizing for high barrier or high-definition printing of the packaging film for graphics and advertising. This patent does not contemplate achieving highly flexible PLA-based packaging films using components that do not contain a plasticizer and which may not affect metallizing or printing characteristics.
Similarly, EP Patent Application 08739216 describes a film formulation to produce softer PLA articles using a vegetable oil-derived plasticizer with the PLA resin. However, such vegetable oil-based materials may be migratory and cause problems with metallizing or printing of such a modified substrate.
The article "Improving PLA Mechanical Properties by the Addition of Oil," Polymer Engineering & Science (2010), vol. 50, issue 3, pp. 513-519, describes using oils to toughen PLA films. Upon addition of specific oils, PLA film modulus decreases and ductility improved. However, such oils are migratory and can cause processing problems as well as poor properties for metallizing and printing.
The article "Technology Focus Report: Toughened PLA," Natureworks® LLC (2007) technical bulletin, describes the use of various types of elastomers—including non-degradable polyolefin elastomers—to improve toughness and impact properties of PLA articles. However, such elastomers are preferably added at amounts of 10-30 wt % to achieve improvements in toughness and such amounts can worsen compostability.
U.S. patent application Ser. No. 12/161,967 describes a film formulation including PLA and polyether-polylactic acid copolymer. The addition of an amount of polyether-polylactic acid copolymer softens the PLA is rather large, about 20-50 wt % of the film.
U.S. Pat. No. 7,214,414, WO 2007046174 and JP 200531998 disclose films including low Tg polymers that allow the films to have some suitable properties for packaging films. However, the films are mainly described as being suitable for blown film processing. These references do not provide sufficient disclosure of films suitable for sequential processing or a simultaneous biaxially oriented PLA film-making processing. Furthermore, these references do not describe how to achieve the quietness and sufficient process suitability.
JP4210492 discloses a biaxially oriented PLA film having 15-50 wt % of aliphatic polyester to achieve good die cutting properties etc. U.S. patent application Ser. No. 09/932,523, publication 2003/0039775 A1 describes polylactic acid-based films including a toughening additive of 5-40 wt % of the core. The toughening additives are shown to improve elongation-to-break property of the films but also show a high degree of heat shrinkage and less thermal stability which can be detrimental for many packaging applications.

Biaxially oriented polylactic acid film with reduced noise level


Multiprocessor circuit cards and communication devices that employ such cards are described herein. In some instances, the multiprocessor circuit cards may be subscriber identity module (SIM) cards and the communication devices may be wireless mobile telephones that are compliant with a communication standard such as ISO/IEC, 3GPP, GSM consortium or other standards.

In the current state of wireless communication, communication devices such as cellular telephones may employ communication circuit cards. Examples of such cards include subscriber identity module (SIM) cards that may be inserted into a slot of a communication device such as a Global System for Mobile Communications (GSM) compliant wireless mobile telephone. Typically, a SIM card is employed to store various subscriber information including information and/or algorithms needed to authenticate a subscriber to a network, personal directories, personal settings, and so forth. Conventional SIM cards typically include a processor and various memories such as volatile, nonvolatile, and Electrically Erasable Programmable Read Only Memory (EEPROM) memories. The dimensions (i.e., form factor) of these SIM cards including the locations of the input/output (I/O) terminals or contacts, the signaling protocols, and so forth, are typically dictated by communication standards, such as those set forth by the International Organization for Standardization and the International ElectroTechnical Commission (ISO/IEC), the 3rd Generation Partnership Project (3GPP), the GSM Consortium, and/or by other groups or agreements.
The term "wireless mobile phone" as used herein refers to the class of telephone devices equipped to enable a user to make and receive calls wirelessly, notwithstanding the user's movement, as long as the user is within the communication reach of a service or base station of a wireless network service provider. Unless specifically excluded, the term "wireless mobile phone" is to include the analog subclass as well as the digital subclass (of all signaling protocols).

Multiple processor communication circuit cards and communication devices that employ such cards


An article dispensing apparatus, such as a vending machine (10), includes a controllably positioned suction hose dispenser (220) for retrieving articles (223) from a storage area (215). In one embodiment, a quick release device (500) coupled to the suction hose dispenser (220), is activated in response to mechanical contact caused by the controllable positioning of the suction hose dispenser (220), said activation facilitating a quick release of the retrieved article to a place (210) associated with an article dispensing area (22).

1. Field of the Invention
The present invention relates generally to improvements in the design and operation of article handling apparatus and is particularly useful in the environment of article handling devices that use a suction-type article handling mechanism.
2. Description of the Prior Art
Most prior art article handling mechanisms, more specifically referred to in the description of the present invention as being in the environment of a point-of-sale (POS) article dispenser, rely on a multitude of motors, switches and solenoids for moving various portions of the handling mechanism, and handling of the articles themselves, such as packaged products. Most such machines require one motor, switch and/or solenoid dedicated for each row, column or type of article or package to be handled or dispensed therefrom. Such machines generally suffer from numerous disadvantages, such as poor reliability due to mechanical failures, as well known by those skilled in this art.
U.S. Pat. No. 5,240,139 represents a significant improvement in article handling devices. It describes the use of a negative air pressure lifter (i.e., article pickup or handling mechanism), which uses suction, i.e., a reduced or so-called "negative" air pressure created by a partial vacuum, for making a secure contact to an article to be retrieved by entering the open top of an article storage bin located in a refrigerated storage area of a vending machine. Although robotic, and specifically suction-type lifting mechanisms are in common use in factory settings, where space limitations are generally relaxed, their use in tight confines, such as an article vending machine, has not gained wide acceptance. Due to the greater reliability and versatility of vending machines of the type which utilizes suction technology for grasping and moving selected articles, it would be desirable to develop new techniques and methods for the operation and control of such machines, as well as for other more generalized article handling mechanisms.
Article contact detection is provided in the forenoted U.S. Pat. No. 5,240,139 by a mechanical or electromechanical proximity switch mounted at the article pickup end of the negative air pressure lifter.
It would be desirable to avoid the use of a proximity switch type of sensor at the article pickup end of the lifter, most notably because of the necessity of providing to the pickup head power and signal carrying conductors associated with the switch. Such conductors not only present obstacles to the freedom of movement of the pickup head, but also present reliability problems due to their potential for breakage. However, even if a "remotely-positioned" type of product contact sensor is provided, care must be taken to ensure that it is simple and reliable.
Furthermore, a vacuum breaker would also be desirable in a vending machine having a suction-type article handler, in order to facilitate a "quick release" of the product at the end of the dispensing cycle. U.S. Pat. No. 5,957,326 entitled APPARATUS FOR RETRIEVING RANDOMLY ORGANIZED ARTICLES, describes a vending apparatus having a suction-type article handler and a vacuum breaker. A pickup head having a plurality of suction cups mounted thereon (in order to help ensure the retrieval of one of a plurality of randomly organized articles for a storage bin) is lowered into the storage bin as suction is applied to the cups. After the passage of a predetermined amount of time, the machine controller causes the pickup head to start being removed from the bin. While the pickup head is being removed, a vacuum sensing assembly coupled to each suction cup determines if more than one of the suction cups has an article attached thereto (i.e., article contact is assumed in response to the sensing of vacuum in the hose coupled to a given suction cup). If more than one suction cup has an article adhered thereto, the machine controller causes a valve assembly 81 to release vacuum from all of the suction cups except one. Furthermore, when the product pickup head reaches a certain predetermined "delivery" position, the valve assembly 81 causes the vacuum to be released so that the product can be dropped. No mechanical connection is shown between the product pickup head and the valve assembly 81, so it is logical to assume that the valve 81 is activated by and electronic signal.
PCT patent publication WO 99/12132 entitled VENDING MACHINE discloses a vending machine having an articulated arm for positioning an article gripping suction hose into a freezer for retrieving articles to be dispensed. It teaches the use of both an electromechanically operated proximity switch at the article gripper head for turning the vacuum source on when the gripper makes contact with the product, as well as the use of a position sensor for advising the machine controller to energize a vacuum breaker when the gripperhead reaches a predetermined position indicative of the product reaching the dispensing area.

This patent is subject to a terminal disclaimer.

Quick release for article handling mechanism


The subject invention concerns materials and methods for modulating lignin biosynthesis in sugarcane plants. In one embodiment, lignin biosynthesis is down-regulated. Genes and the proteins encoded thereby that can be targeted for achieving down-regulation of lignin in sugarcane include, for example, 4-coumarate-CoA ligase (4CL). In one embodiment, the 4CL gene is 4CL-M, 4CL-N, or 4CL-L. The subject invention also concerns a sugarcane plant, specific plant tissue, and plant cells having modulated (e.g., down-regulated) lignin biosynthesis. The subject invention also concerns methods for producing a sugarcane plant having modulated (e.g., decreased or down-regulated) biosynthesis of lignin.

Sugarcane is the highest yielding biomass producer. Typically, farmers reduce the sugarcane post-harvest leaf residue by open air burning, which negatively impacts air quality. Fuel grade ethanol can be made from sugarcane leaf litter residue following acid hydrolysis pre-treatments to remove lignin which acts as a physical barrier to enzyme hydrolysis. Thus, down-regulation of lignin biosynthesis pathway enzymes is a promising strategy to increase the efficiency of bio-ethanol production from hemicellulosic sugarcane residues. In the lignin pathway, 4-coumarate-CoA ligase (4CL) is a key enzyme that catalyze the formation of CoA thiol esters of 4-coumarate and other hydroxycinnamates. However, sugarcane has a complex polypoid genome and these genes belong to a large gene family. Their broad substrate specificities have made it difficult to identify orthologs that are specifically involved in lignin biosynthesis. Thus, there remains a need in the art for means for inhibiting lignin biosynthesis in sugarcane.

Isolation and targeted suppression of lignin biosynthetic genes

UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.


An ion laser apparatus includes an ion laser tube, a pipe member, and air cooling heat radiating fins. The ion laser tube base a laser capillary having a discharge path between an anode and a hot cathode and a feedback path for an internal gas. The pipe member constitutes a cooling liquid channel for causing a cooling liquid to flow in an outer peripheral portion of the laser capillary. The air cooling heat radiation fins directly radiate heat, which is generated by the laser capillary, without being through the cooling liquid.

The present invention relates to an ion laser apparatus and, more particularly, to an ion laser apparatus having an improved cooling structure for a laser capillary.
As conventional methods of cooling an ion laser apparatus, an air cooling method and a water cooling method are known.
FIG. 3 shows a conventional air-cooled ion laser apparatus, and FIG. 4 shows a conventional water-cooled ion laser apparatus.
In FIGS. 3 and 4, reference numeral 1 denotes a laser capillary consisting of BeO. A discharge path 2 is formed at the center of the laser capillary 1, a feedback path 3 for a laser medium such as an argon gas is formed around the laser capillary 1, and a metallized layer 4 is formed on the outer surface of the laser capillary 1. Reference numerals 5a and 5b denote a pair of laser mirrors; 6, a hot cathode arranged in a cathode bulb 7 consisting of stainless; 8, an anode; 9 (FIG. 3), heat radiation fins brazed on the laser capillary 1 by the metallized layer 4; and 10, a pipe, having cooling water inlet and outlet ports 11 and 12 and brazed on the laser capillary by the metallized layer 4, for causing cooling water to flow around the laser capillary 1.
In a laser apparatus using the laser tube shown in FIG. 3, an air cooling fan (not shown) for cooling the heat radiation fins is used. In addition, when a water cooling method is used, a cooling unit (not shown) for cooling water and a cooling water circulating system (not shown) are required.
In the above conventional air-cooled ion laser apparatus, hot air is blown by causing the air cooling fan to cool the cooling fins, and the hot air cannot be easily handled depending on applications of the ion laser apparatus. Since the vibration of the air cooling fan is transmitted to the laser apparatus to vibrate the laser tube, the position of the laser beam emitted from the laser apparatus is vibrated in synchronization with the vibration of the laser apparatus. In addition, unlike in the air cooling method, although a water cooling method does not have the above problems, i.e., the handling of hot air and the vibration of the fan, the water cooling method has the following drawback. That is, the water cooling method requires a cooling unit for cooling water and a cooling water circulating system, thereby increasing the size of the water cooling unit.
As described above, since the conventional air- and water-cooled ion laser apparatuses have advantageous and drawbacks, they are selectively used according to their application purposes. However, in experiments or the like, since two ion laser apparatuses, i.e., air- and water-cooled ion laser apparatuses must be prepared, a large investment in equipment is required.
In addition, two types, i.e., air- and water-cooled laser apparatuses must be manufactured in manufacturers, and both the types of lasers are expensive.
In order to solve the above problems, as disclosed in Japanese Patent Laid-Open No. 58-213486, the following ion laser tube is proposed. In the laser ion laser tube, after heat generated by a laser capillary is temporarily absorbed in a cooling liquid in a pipe, the heat absorbed in the cooling liquid is radiated through heat radiation fins arranged on the outer peripheral portion of the pipe. However, since the laser capillary is cooled with air through the cooling liquid, a high cooling efficiency cannot be obtained. In addition, a water cooling method or an air cooling method cannot independently used.


With a trend toward a higher intensity projection type liquid crystal display device to further increase brightness of a projection screen, rated input power of a light source lamp increases, which makes essential a fan apparatus for cooling the light source lamp, etc. Such a fan apparatus would require a light-shielding member which causes the number of parts to increase. The present invention provides a fan apparatus provided with a rotor section that can be rotated/driven around a predetermined rotation axis and a propeller section including propeller blades and attached to the rotor section arranged in such a way as to substantially shield light parallel to the rotation axis.

For a projection type liquid crystal display device in recent years, a high resolution light bulb device, for example, a liquid crystal panel unit is used to project image information more clearly and brightness is continuously increased to light up the projection screen brighter.
More specifically, with the widespread use of personal computers such as notebook personal computers, there is a strong demand for a small, light projection type display device with excellent portability as an image output apparatus for a notebook personal computer which is widely used for electronic presentations. Furthermore, a projection type display device, etc., for a home theater is also becoming widespread.
On the other hand, as the brightness increases, rated input power of a light source lamp also increases, which makes it more important to secure cooling performance for cooling the light source lamp, etc.
With reference now to FIGS. 5 to 7, a conventional projection typed is play device will be explained. FIG. 6 is a plan view of a conventional projection type display device using a cooling apparatus around a light source lamp used in a projection type display device that modulates light signals through a light bulb made up of a liquid crystal panel according to image information, color-combines modulated light beams of different colors after modulation, enlarges and projects the light beams on a screen through a projection lens unit. Furthermore, FIG. 7 is a right side view of the same device. FIG. 5 illustrates a conventional axial flow fan to show an overview of a cooling fan 6 which is a general axial flow fan used in the same device.
As shown in FIG. 6, the conventional projection type display device includes a light source lamp unit 1, an irradiation optical unit 2 that condenses light from the above-described light source lamp unit 1, three liquid crystal panel units 3 consisting of R, G and B liquid crystal panels as light bulbs for optically generating image information from the condensed light, a color combination system unit 4 that color-combines the optical information of the liquid crystal panel units 3, a projection optical unit 5 that enlarges and projects the image information onto a screen, a cooling fan 6 for cooling the light source lamp unit 1 and its periphery, a light-shielding member 7 for preventing unnecessary light of the light source lamp unit 1 from leaking outward and a housing 8 provided with a exhaust opening 9 for circulating exhaust air of the cooling fan 6.
Here, the cooling mechanism of such a projection type display device will be explained.
As shown in FIG. 6, the high temperature atmosphere of the light source lamp unit 1 is led through the light-shielding member 7 and exhausted out of the housing through the exhaust opening 9 provided in the housing 8 due to a pressure difference produced before and after propellers as air blowing means by rotation of the cooling fan 6. In this way, the heat of the atmosphere inside the housing 8 is transferred and cooling is realized.
More specifically, propellers 12 form an air blowing means formed integral with the rotor of a motor 11 and rotate as the motor 11 rotates. Thus, the air is circulated in the axial direction inside an air duct formed in a housing 10 that holds the motor generally aligned with the rotation center of the motor 11.
However, such a conventional projection type display device requires a large light-shielding member to prevent light from leaking toward the outside of the set through the exhaust opening that circulates exhaust air of the cooling fan, which constitutes a major limiting factor against downsizing or price-reduction of the apparatus. Further, processing speed of electronic devices such as personal computers have been drastically improved, and thus the temperature inside the housing tends to rise owing to the location of a circuit board, etc., on which the CPU and various drive ICs are mounted. For this reason, it is necessary to provide a large axial flow fan or dust-proof structure to prevent dust, etc., from entering the set, causing complexity and upsizing of the structure).
Furthermore, the above-described conventional projection type display device has excessive air blowing resistance of the cooling fan caused by such a light-shielding member, which requires high-speed drive of the cooling fan to cope with an increased amount of heat generated at the high-power light source lamp unit, producing loud noise and interfering with audiovisual functions.

Fan apparatus, method of manufacturing fan apparatus, projection type display device and electronic device

Matsushita Electric Industrial Co., Ltd.


A test pattern includes a normal pattern, an abnormal pattern having predetermined defects, and a conductive line electrically connected to the normal pattern and electrically isolated from the abnormal pattern. Thus, a non-contact test process and a contact test process may be compatible with the single test pattern.

1. Technical Field
Exemplary embodiments of the present invention relate to a test pattern and a method of monitoring defects using the same. More particularly, exemplary embodiments of the present invention relate to a test pattern that is used for setting examination procedures in a tester for detecting defects of a semiconductor device, and a method of monitoring the defects using the test pattern.
2. Discussion of Related Art
Generally, a semiconductor device may be manufactured by various processes, such as a deposition process, a photolithography process, an ion implantation process, a polishing process, a cleaning process, and the like. After completing one or more of the above-mentioned processes, a plurality of defects, such as a short, an open, and the like, may be generated in the semiconductor device. The defects may have undesirable effects on the performance of the semiconductor device. Thus, to effectively control the defects that may be generated in each of the processes, the defects need to be detected using a suitable defect detector.
Further, to determine whether the defect detector has the desired detection capacities, the detection capacities of the defect detector may be examined using a test pattern. Here, the methods used for a defect detector examination may be classified into a non-contact test process and a contact test process using a probe.
Examples of conventional methods used for the defect detector examination are disclosed in U.S. Patent Application Publication No. 2004-207414 and Japanese Patent Laid-Open Publication Nos. 2002-368049 and 1999-31727.
According to the non-contact test process, a test pattern is scanned using an electron beam. Defects in the test pattern are then detected based on the obtained scanning results.
In contrast, according to the contact test process, the probe electrically makes contact with a test pattern. An electrical signal is supplied to the test pattern through the probe. Defects in the test pattern are then detected according to the obtained electrical signals.
To enhance the accuracy in examining the detection capacity of the defect detector, a method of artificially forming and implanting defects into a test pattern has been used. For instance, defects are artificially formed in a specific portion of the test pattern, and then the detection capacity of the defection tester is examined by accurately detecting an abnormal pattern therein that has defects detected by the defect detector.
When the non-contact test process is employed, the artificially created defects may be precisely detected based on a brightness difference between a normal pattern and the abnormal pattern on the obtained scanning result. When the contact test process is employed, however, all patterns in the test pattern may be detected as abnormal patterns, because the probe makes contact with the all of the patterns. That is, since the normal pattern and the abnormal pattern in the conventional test pattern are electrically connected to each other, all of the patterns may be determined as abnormal patterns when the contact test process is performed. As a result, when the contact test process is employed, the defects may not be artificially formed in the conventional test pattern. Therefore, it may be required to prepare separate test patterns in accordance with the contact test process and the non-contact test process.
Further, since the non-contact test process and the contact test process may not be applied to the conventional single test pattern, defects between a pattern and a conductive line arranged on the pattern may not be accurately detected. For example, in the conventional single test pattern, when a pattern is formed by a chemical mechanical polishing (CMP) process, minute conductive materials may still remain between the patterns. Thus, after forming the pattern, it may be necessary to perform a subsequent process so as to carry out the defect detection process. As a result, after the conductive line is formed on the pattern by the subsequent process, the defect detection process is carried out using the conductive line. Here, since the pattern is covered with the conductive line, defects such as the minute conductive materials may be detected only by the contact test process, but not by the non-contact test process. As described above, however, the contact test process and the non-contact test process may not be applied to the conventional test pattern so that defects between the pattern and the conductive line may not be accurately detected.
Furthermore, in a conventional test pattern having alternately arranged patterns such as an NMOS contact and a PMOS contact, that have different electrical characteristics, the two kinds of the patterns may be separately scanned with an electron beam during the non-contact test process. Thus, separate information with respect to each of the patterns may not be obtained, because the electron beam may have a minimum scan width of about 100 μm, and each of the patterns may have a width of no more than about 50 μm. Therefore, patterns having different electrical characteristics may not be separately tested using the conventional test pattern.

Test pattern and method of monitoring defects using the same


Described are a stable semiconductor memory device which is not susceptible to the influence of a heat treatment temperature of a semiconductor substrate of reaction pressure in the CVD method and is free from the reduction in remanence caused by data writing in repetition; and a fabrication process of such a device which comprises forming, by the CVD method, a ferroelectric film containing as a component element bismuth, suing a bismuth alkoxide compound as a raw material, and using the ferroelectric film as a film for the formation of storage capacitance for a semiconductor memory device.

1. Field of the Invention
This invention relates to a process for the preparation of bismuth oxide, a method for the formation of a bismuth layered oxide, and a method for the fabrication of a capacitor structure of a semiconductor device.
2. Description of the Related Art
In recent days, application researches of a non volatile memory cell which adopts a ferroelectric thin film have been briskly conducted accompanied with an advance in the film forming technique. This non volatile memory cell is a non volatile memory cell which makes use of a high-speed polarization inversion of a ferroelectric thin film and its remanence and is high-speed reloadable. The non volatile memory cell adopting a ferroelectric thin film, which cell is under study now, can be classified into two systems, that is, a system of detecting a change in the accumulated charge amount of a ferroelectric capacitor and a system of detecting a change in resistance caused by the spontaneous polarization of the ferroelectric substance. The semiconductor device according to the present invention belongs to the former one.
At high temperatures, triphenyl bismuth vaporizes accompanied with decomposition so that the temperature control for maintaining a stable vapor amount is very difficult. For example, according to Literature 1, that is, "Ferroelectric bismuth titanate films by hot wall metalorganic chemical vapor deposition" in J. Si, et al., "J. Appl. Phys. 73(11), 7910-7913(Jun. 1, 1993)", it is necessary to maintain a container for raw materials at a temperature of from 165 to 170 in order to secure a sufficient vapor pressure of triphenyl bismuth. When the container for raw materials is maintained at such a high temperature, the following disadvantages occur.
(A) Triphenyl bismuth in the container for raw materials is gradually decomposed when exposed to high temperatures for a long time, so that it becomes difficult to continue a stable gas supply.
(B) It is necessary to heat each part of the MOCVD apparatus such as a container for raw materials and piping to 150-200.degree. C. in order to conduct efficient gas supply and besides, to prevent recoagulation in the piping during transportation to the MOCVD reaction chamber. It is however difficult to conduct temperature control or temperature management for the above purpose.
Triphenyl bismuth is a relatively stable substance. Its reactivity is, on the other hand, low so that the concentration of its component cannot easily be increased at the time of forming a ferroelectric thin film by the MOCVD method. In addition, triphenyl bismuth and its analogous compounds are not advantageous for the formation of its oxide film because they do not have a metal-oxygen bond in their molecules. When a ferroelectric thin film, which is an oxide film, is formed on the surface of a base material, both of the decomposition reaction of triphenyl bismuth and the reaction with oxygen are necessary as the reaction steps on the surface of the base material. Accordingly, the use of the above-described source raw materials requires the external addition of an oxidation source. The preparation of bismuth oxide using triphenyl bismuth is conducted as follows: EQU --Bi--C.sub.6 H.sub.5 .fwdarw.--Bi--+C.sub.6 H.sub.5 -- EQU --Bi--+O.fwdarw.--Bi--O--
Described specifically, when bismuth oxide is prepared using triphenyl bismuth, the reaction is conducted through two steps. So, the preparation of bismuth oxide or formation of an oxide film containing bismuth as a component element is susceptible to the temperature of the base material or the reaction pressure in the MOCVD reaction chamber.

Ferroelectric capacitor and manufacturing the same using bismuth layered oxides


An electrophotographic imaging member having a thermoplastic charge transport layer comprising a charge transport compound, a polycarbonate polymer binder, a particulate dispersion, and a high boiler compatible organic liquid. The disclosed charge transport layer exhibits enhanced wear resistance, excellent photoelectrical properties, and good print quality.

This disclosure relates, in various embodiments, to electrostatographic imaging members. More particularly, the disclosure relates to an improved outermost exposed imaging layer, such as a charge transport layer, of an electrostatographic imaging member which extends the mechanical service life of the member.
Electrostatographic imaging members are known in the art. Typical electrostatographic imaging members include photoreceptors for electrophotographic imaging systems and electroreceptors such as ionographic imaging members for electrographic imaging systems. Generally, these imaging members comprise at least a supporting substrate and at least one imaging layer comprising a thermoplastic polymeric matrix material. In a photoreceptor, the photoconductive imaging layer may comprise only a single photoconductive layer or a plurality of layers such as a combination of a charge generating layer and one or more charge transport layer(s).
Electrostatographic imaging members can have a number of different configurations. For example, they can comprise a flexible member, such as a flexible scroll or a belt containing a flexible substrate support. The flexible member belt may be seamed or unseamed. The electrostatographic imaging members can also be a rigid member, such as those utilizing a rigid support substrate drum. Drum imaging members have a rigid cylindrical supporting substrate bearing one or more imaging layers. Although the present disclosure is equally applicable to imaging members of any configuration, for reasons of simplicity, the disclosure herein after will focus primarily on and represent flexible electrophotographic imaging members such as a flexible seamed belt.
Flexible electrophotographic imaging member belts are typically fabricated from a sheet which is cut from a web. The sheets are generally rectangular in shape. The edges may be of the same length or one pair of parallel edges may be longer than the other pair of parallel edges. The sheets are formed into a belt by joining overlapping opposite marginal end regions of the sheet. A seam is typically produced in the overlapping marginal end regions at the point of joining. Joining may be effected by any suitable means. Typical joining techniques include welding (including ultrasonic), gluing, taping, pressure heat fusing, and the like. Ultrasonic welding is generally the more desirable method of joining because it is rapid, clean (no solvents) and produces a thin and narrow seam. In addition, ultrasonic welding is more desirable because it causes generation of heat at the contiguous overlapping end marginal regions of the sheet to maximize melting of one or more layers therein to produce a strong fusion bonded seam.
A typical flexible electrophotographic imaging member belt comprises at least one photoconductive insulating layer. It is imaged by uniformly depositing an electrostatic charge on the imaging surface of the electrophotographic imaging member and then exposing the imaging member to a pattern of activating electromagnetic radiation, such as light, which selectively dissipates the charge in the illuminated areas of the imaging member while leaving behind an electrostatic latent image in the non-illuminated areas. This electrostatic latent image may then be developed to form a visible image by depositing finely divided electroscopic marking toner particles on the imaging member surface. The resulting visible toner image can then be transferred to a suitable receiving member or substrate such as paper.
A number of current flexible electrophotographic imaging members are multilayered photoreceptors that, in a negative charging system, comprise a substrate support, an electrically conductive layer, an optional charge blocking layer, an optional adhesive layer, a charge generating layer, and a charge transport layer. In such an imaging member, the charge transport layer is the top outermost layer exposed to the environment. Since flexible electrophotographic imaging members exhibit upward curling after completion of the application of a charge transport layer, an anti-curl back coating can also be employed on the back side of the flexible substrate support (the side opposite from the electrically active layers) to achieve the desired photoreceptor belt flatness.
In normal machine design, the flexible photoreceptor belt is mounted over and around a belt support module. As such, the belt is constantly subjected to bending strain as it flexes over each of the belt module support rollers during dynamic belt cyclic motion. The greatest bending strain is tension concentrated at the surface of the charge transport layer, so that extended belt cyclic flexing has been found to facilitate the development of surface cracking. In this regard, surface cracking in the charge transport layer is somewhat unique only in belt photoreceptors and is induced, in part, due to the effect of dynamic fatigue of the belt flexing over the supporting rollers of a machine belt support module.
Surface cracking has also been found to be caused by exposure to airborne chemical contaminants as the photoreceptor segments statically "park" or directly bend over the rollers after periods of photoreceptor belt non-use during machine idling. Typical chemical contaminants include solvent vapors, environment airborne pollutants, and corona species emitted by machine charging subsystems. Surface cracking can also be exacerbated by the combination of fatigue belt flexing and airborne chemical exposure. Photoreceptor surface cracking is a critical mechanical issue seen in imaging members, particularly in flexible belts, because the cracks manifest themselves into printout defects that seriously impact copy quality.
Similarly, under normal machine electrophotographic imaging processing conditions, the top outermost exposed charge transport layer is constantly subjected to mechanical interactions against machine subsystems and components. These include, for example, sliding cleaning blade and cleaning brush actions, corona species exposure, toner debris, developer components, toner image receiving papers, and the like. Consequently, the charge transport layer is also susceptible to surface scratching, abrasion, wear, and filming which produce copy print-out defect problems as well.
Each charge transport layer-of a multi-layered photoreceptor is typically formed by a solution coating process. The coating solutions generally contain an organic solvent(s), such as methylene chloride or a chlorinated solvent. After application of the coating solution, the wet coating layer is dried at elevated temperatures to remove a substantial amount of the solvent to produce a solid layer. However, not all of the solvent may be removed from the coating layer during drying. For example, in forming a typical charge transport layer from a coating solution containing about 86 weight-% (wt-%) methylene chloride solvent and 14 wt-% dissolved solids, the solvent evaporates very quickly during the elevated temperature drying process. However, about 2 wt-% of the methylene chloride will typically still be present or trapped in the resulting charge transport layer (i.e., residual methylene chloride). The trapped solvent evaporates or "outgases" over time. The outgassing of the trapped solvent from the charge transport layer during storage and over the life of the photoreceptor causes dimensional contraction of the charge transport layer, causing increased internal strain in the charge transport layer. Thus, in addition to the bending strain induced during dynamic photoreceptor belt flexing over each belt module support roller in a machine, this increase in internal strain will exacerbate charge transport layer cracking under normal belt functioning conditions in the field.
Dimension contraction in the charge transport layer also causes the photoreceptor belt to exhibit upward curling at both edges when the belt functions in a machine. Since the contraction in belt direction is prevented by the applied tension as the belt is mounted over and around a belt support module, edge curling in the photoreceptor belt is an important issue. Edge curling changes the distance between the belt surface and the charging device, causing non-uniform surface charging density which is visible as a "smile print" defect. Such a defect is characterized by higher intensity print-images at the locations over both belt edges.
Since the charge transport layer of a typical negatively charged multilayered photoreceptor flexible belt is typically the outermost exposed layer, it is inevitably subjected to constant mechanical interactions against various electrophotographic imaging machine subsystems under a normal service environment. These mechanical interactions include abrasive contact with cleaning and/or spot blades, exposure to toner particles, carrier beads, toner image receiving substrates, etc. As a result, the charge transport layer may frequently exhibit mechanical failures such as frictional abrasion, wear, and surface cracking due to fatigue dynamic belt flexing. Under normal functioning conditions, exposure to the ozone species generated from the wires of a charging device is known to cause polymer binder chain scission, exacerbating charge transport layer cracking and wear problems. Charge transport layer wear is also an issue because wear reduces thickness and thereby alters the equilibrium of the balancing forces between the charge transport layer and the anti-curl back coating, impacting imaging member flatness. Moreover, in a rigid electrophotographic imaging member drum design utilizing a contact AC Bias Charging Roller (BCR), ozone species attack on the charge transport layer polymer binder is more pronounced because of the close vicinity of the BCR to the charge transport layer of the imaging member drum. As a consequence, charge transport layer wear is a serious problem which significantly reduces the functional life of the imaging member.
To resolve one or more of the above-noted shortcomings and issues, a method of fabricating electrophotographic imaging members to produce robust mechanical charge transport layer function has been investigated and successfully demonstrated as described below. The imaging members produced thereby exhibit good wear resistance, cracking life extension, and durability. Such imaging members exhibit enhanced physical/mechanical service life.


The combination of a vessel and a stopper assembly. The vessel has a wall defining a storage space for a supply of a flowable material and an orifice on the wall communicating through the body from the storage space to externally of the storage space. The stopper assembly selectively blocks the orifice. The stopper assembly has a frame, a stopper element with a blocking surface on the frame that is movable relative to the vessel between i) a closed position wherein the blocking surface substantially blocks the orifice and ii) an open position, and a repositioning mechanism for moving the stopper element relative to the vessel with the stopper element remaining in the closed position to thereby avoid fixing of the stopper element to the vessel.

1. Field of the Invention
This invention relates to vessels of the type having a discharge orifice therein and, more particularly, to a stopper system that allows the orifice to be selectively blocked.
2. Background Art
There are a multitude of different vessels having a discharge orifice which is required to be selectively opened and blocked. In some environments, a relatively simple valve structure can be utilized to accomplish this. However, the discharge of high temperature, pourable material may require a substantially different structure.
Relatively complicated valve mechanisms have been devised for molten metal vessels. These valves commonly utilize replaceable refractory elements. Operation of the valve may occur by relatively sliding refractory plates to selectively register openings therethrough.
While this type of refractory valve has proven effective in operation, it has a number of drawbacks. First of all, the refractory plates are prone to wearing after continued use as a result of which pouring characteristics may be changed and seals may be compromised.
In the event that replacement of paits in such a valve is required, the disassembly required to effect this replacement may be quite extensive and time consuming. This may result in significant down time.
A cruder method of controlling the state of vessel orifice involves the use of sand. Sand may be mounded at the orifice to prevent the discharge of molten metal or slag. When it is required to open the orifice, the sand is redistributed to expose the orifice.
When this operation is performed manually, it may be time consuming and fatiguing. Further, the operator of the valve is required to be positioned in close proximity to the high temperature vessel, thereby risking exposure to high temperatures and in a worse case the discharge of material.
Another option in the prior art for sealing a vessel orifice is to solidify the discharging material at the orifice. This can be done by cooling the region around the orifice. When it is desired to initiate flow through the orifice, the solidified material can be heated to a liquid state, thereby allowing flow out through the orifice.
Another available option is to utilize a stopper element which is loosely inserted into the orifice. The material in the vessel is allowed to flow around the stopper material and solidified to create a complete seal. When it is desired to release the material from the vessel, the stopper element is heated to melt the solidified material and allow the stopper to be removed to achieve a flow condition.


A bucket has a pair of longitudinally parallel and spaced apart pins for attaching to a pin grabber quick coupler. The pins may require removal from the bucket for repair or replacement if the pins are damaged. One or more windows are formed in the side of the bucket for facilitating access to and the removal of the pins from the bucket.

Excavators are used for digging and various other operations. Excavators typically comprise a machine platform with a cab, engine, and other systems. A boom is typically pivotally attached at a horizontal axis to the machine platform. A stick is typically attached at a horizontal axis to the boom. At the end of the stick, a work tool, such as a digging bucket, is attached. Buckets can be attached to the stick via quick couplers. Quick couplers facilitate the coupling and decoupling of buckets to the end of the stick, and typically permit the operator to perform these operations without leaving the cab of the excavator.
A pin grabber quick coupler utilizes hooks on the coupler to attach to elongated, typically cylindrical pins on the bucket. The pin grabber quick coupler is attached to the end of the excavator stick. One or more of the hooks is actuated, such as by hydraulic cylinders, to grasp the pins on the bucket and hold the bucket to the coupler.
The bucket illustrated in UK published patent application GB 2 362 371 A is one example of a bucket with pins for attaching to a pin grabber quick coupler. The bucket has a pair of pins 25, 27 permitting the bucket to be grasped and retained by a pin grabber coupler. One disadvantage of this bucket design is that at least pin 25 cannot be easily accessed for repair or replacement. The pins in this bucket, and in buckets of similar construction, can be damaged. Damaged pins can cause the coupler to grasp the bucket incorrectly, or can prevent the coupler from grasping the bucket at all. When the pins are damaged, they must be removed and repaired or replaced. The bucket design in UK published patent application GB 2 362 371 A does not permit easy removal of at least pin 25 for repair or replacement.
Among other advantages, this invention provides a bucket with a pair of pins which are easily removed from the bucket for repair or replacement.


The invention includes semiconductor packages having a patterned substrate with openings extending therethrough, conductive circuit traces over the substrate and having portions extending over the openings, a semiconductor die over the circuit traces, and a matrix contacting the circuit traces and also contacting the die. The invention also includes methods of forming semiconductor packages. Such methods can include provision of a construction comprising an electrically conductive layer on a masking material. The layer has a first surface facing the masking material and a second surface in opposing relation to the first surface. The masking material is patterned to form openings extending to the first surface of the layer. The layer is then patterned. Subsequently, an integrated circuit die is provided over the second surface of the layer.

Semiconductor devices (for example, dynamic random access memory (DRAM) devices), are shrinking in the sense that smaller devices are being manufactured that are able to handle larger volumes of data and faster data transfer rates. Semiconductor manufacturers have been moving toward chip-scale packages (CSP) for semiconductor components having a small size and fine pitch wiring.
An exemplary CSP is shown in FIG. 1 as a board-on-chip (BOC) package 10. The package comprises a semiconductor component 12, such as an integrated circuit chip (or die), and accordingly the package can be referred to as a semiconductor package.
The package 10 comprises an interposer 14 utilized to support the semiconductor component 12. The shown interposer comprises a board 15, dielectric (i.e., electrically insulative) material 20 on one side of the board and circuitry 17 on another side of the board. Board 15 can be, for example, a glass weave material. Chip 12 is attached to the board 15 through an adhesive structure 16. The adhesive structure can be, for example, a cured glue, paste, or other polymeric matrix. As another example, the adhesive structure can be a tape. Such tape can have one side adjacent board 15 and an opposing side adjacent integrated circuit die 12, and adhesive can be along both of the opposing sides of the tape.
Dielectric material 20 is patterned to have a plurality of openings extending therethrough to the circuitry 17. Material 20 can comprise, for example, a photomask material, such as, for example, a dry film photomask. If material 20 is a photomask material, the material 20 can be patterned by photolithography. Specifically, the material can be patterned by exposing the material to a pattern of radiation and subsequently utilizing a developing solvent to impart the desired pattern within material 20.
A series of contact pads 30 are provided within the openings in dielectric material 20, and specifically are provided along a surface of circuitry 17 which is exposed within the openings. The contact pads 30 comprise a first conductive material 32 adjacent circuitry 17, and a second conductive material 34 over the first conductive material. Typically, conductive material 32 will be a nickel-containing material, and accordingly can comprise, consist essentially of, or consist of nickel; and material 34 will be a gold-containing material, and accordingly can comprise, consist essentially of, or consist of gold.
The contact pads are utilized for forming electrical contact to circuitry external of the contact pads. Solder balls 36 are shown attached to some of the contact pads, and the solder balls can then be utilized for electrically connecting the solder pads with other circuitry (not shown) external of the contact pads.
A pair of contact pad locations 40 and 42 are shown associated with integrated circuit die 12. Contact pad locations 40 and 42 comprise the nickel-containing material 32 and gold-containing material 34 of contact pads 30, but it is to be understood that contact pad locations 40 and 42 can also comprise other constructions. A pair of wires 44 and 46 are shown extending from contact pad locations 40 and 42, respectively, to a pair of the contact pads 30. The wires connect circuitry associated with integrated circuit die 12 to the circuitry of patterned conductive material 17, and can be referred to as wire bonds.
A slit 50 extends through the interposer 14, and the wires 44 and 46 extend through such slit to make the electrical contact with the contact pads 30.
An encapsulant 60 is provided within the slit 50, and over the wires 44 and 46 to protect the wires of package 10. Similarly, an encapsulant 62 is provided over integrated circuit die 12, adhesive structure 16 and board 15 to provide a protective covering over the semiconductor package.
The shown package of FIG. 1 is but one of several types of packages that can be formed in accordance with prior art methodologies. For instance, although the openings extending through insulative material 20 are shown to be wider than the contact pads (consistent with non-solder mask defined (NSMD) technologies), the openings could also be formed to be smaller than the contact pads (consistent with solder mask defined (SMD) pad technologies).
The package design of FIG. 1 can have various problems associated with the utilization of the interposer 14. Such problems can include size limitations imposed by the size of the interposer. The problems can also include negative performance properties induced by the interposer through, for example, adsorption of moisture by the interposer and/or outgassing of materials from the interposer. Accordingly, it is desired to develop new semiconductor packages.


A silencer is disclosed with a bypass resonator (4; 9, 12) connected by at least one tubular connection (3a, 3b; 7, 8; 13) to a sound-transmitting channel (1). The tubular connection (3a, 3b) can have various lengths (La, Lb), tubular connections (7, 8) of different thicknesses can be connected, or the volume (V1, V2, Vn) of the bypass resonator (13) can be variable.

The invention relates to a noise suppressor with a bypass resonator.
Connecting a bypass resonator to a noise suppressor in the air intake duct of an internal combustion engine is already disclosed in AT Patent 216,292. Such a bypass resonator leads to an improvement of the noise suppressor, especially near its natural resonance frequency, this frequency being determined by the dimensions and geometric configuration of the bypass resonator, also known as a Helmholtz resonator in shunt. To make it possible to adapt to different sound conditions, complex mechanical devices or a separate resonator for every sound condition are often necessary.
It is the object of the invention to provide a noise suppressor of the kind referred to above such that the (noise) damping characteristics can be influenced in a simple manner.
The noise suppressor according to the invention is advantageously able, to achieve the stated object as described and claimed hereinafter. Because the tubular connections between the sound-carrying duct and the bypass resonator are exchangeable parts which extend with various respective lengths into the bypass resonator, different natural resonances of the system can be adjusted in a simple manner.
In a second advantageous working embodiment of the invention, at least two tubular connections each having a different diameter are present, which are respectively connected with the bypass resonator through an alternately closing and opening flap valves; in an additional position, both can also be open or both can be closed. This control flap is mechanically simple to make, and its switching operationxe2x80x94in the case of a rotating control flap, for example, which depending on its rotational position respectively closes one opening and opens the otherxe2x80x94can be accomplished by an electric motor or also by a pressure chamber.
In a third working embodiment, the tubular connection is connected to a bypass resonator of a type whose volume which can be coupled to the tubular connection can be increased or decreased by means of a control flap. For example, the tubular connection can be coupled to the cylindrical outer surface of a hollow cylindrical bypass resonator, and the volume in the interior of the bypass resonator can be defined on one side by a stationary wall from the central axis to the outside wall and on the other side by movable wall which is continuously displaceable around the central axis or which can locked in various position settings.
Advantageously, the adjustment of the above-described pivotable flap or the wall can be effected by means of an electric motor or a pressure chamber. In the case of adjustment by means of the pressure chamber a push rod operated by the pressure chamber, which can be stopped in prescribed positions, can be provided. The latching of the push rod in the stops or switching positions can be achieved for example by a ball which catches under the pressure of a spring in recesses in the push rod. Without this push rod according to the embodiment, a pressure chamber operation, for example through a magnetic control valve, would catch only in the front and in the rear position when the vacuum is applied or is not applied.
In the case of a preferred application, the sound carrying duct is the intake duct for the intake air of an internal combustion engine and the noise emissions to be suppressed are generated by the air intake pulses of the individual cylinders. In the above-described embodiment with a pressure chamber and a push rod, one adjustment position for the adjustment of the resonator can be set in a state in which the intake duct vacuum is greatest in the low rotational speed range of the internal combustion engine and thus the vacuum box spring is compressed. A second adjustment position can be set in the case of weaker intake duct vacuum in the middle rotational speed range, and a third adjustment position can be set in the case of very weak intake duct vacuum in the higher rotational speed range and stronger spring force of the pressure chamber toward the push rod.
These and additional features of preferred embodiments of the invention will be found not only in the claims but also in the description and the drawings, whereby the individual features can be realized individually or jointly in the form of subcombinations in embodiments of the invention and in other fields and may represent advantageous as well as independently patentable embodiments, for which protection is hereby claimed.

Noise suppressor with a bypass resonator


In a method of producing converting data, a first characteristic curve showing relationship between density value and exposure amount is obtained by forming images on a first photographic material with plural different amounts of exposure and by measuring density values of the formed images. Digital exposure amount data is determined so as to represent the exposure amount of the first characteristic curve. The first characteristic curve is modified so as to show relationship between the density value and the digital exposure amount data by changing the exposure amount to the digital exposure amount data. A second characteristic curve showing relationship between density value and digital input value for exposing means is obtaiend by forming images on a second photographic material by the exposure means based on plural different digital input values and by measuring density values of the formed images. Then, converting data to convert the digital exposure amount data into the digital input value are obtained based on the first characteristic curve and the second characteristic curve.

The present invention relates to an image outputting method, a digital exposure amount image information calculating method, a converting information producing method, a converting information recording medium, and an image outputting system.
At the outset, the digital exposure used hereinafter means that an image exposure is conducted based on digital image signals so as to form an image. The digital exposure is not limited by a specific exposing means. That is, as an exposure means for the digital exposure, a scanning exposure means with a laser beam, a one dimensional exposure means with a single array light source in which plural light emitting elements such as LEDs are aligned in a line, a two dimensional exposure means with plural array light sources, a projecting exposure means with a CRT screen and so on may be used.
Conventional technique 1.
Conventionally, in order to output an image by an image outputting means in which an image is outputted by digital exposure for a photosensitive material on the basis of digital image information expressed in an arbitrary color space system, the following method is generally used. Relationship between an original image information expressed in an arbitrary color space system and a obtained final image are obtained. Further, relationship between input value for the image outputting means and the obtained final image is obtained. Converting information to convert the original image information into input values for the image outputting means is obtained from the relationship between the original digital image information and the obtained final image and the relationship between the input values for the image outputting means and the obtained final image. The digital image exposure is conducted for the photosensitive material by obtaining the input values for the image outputting means from the digital image information expressed in an arbitrary color space system on the basis of the obtained converting information, thereby outputting the image by the image outputting means.
Conventional technique 2.
In the case of obtaining a great number of color prints from B, G, R digital image information, a color negative film is formed with sublimation type pigment image by using a sublimation type thermal transfer printer, a color image is exposed and printed from the color negative film onto a color printing photosensitive material, thereby obtaining the color prints.
Conventional technique 3.
Further, in the case of obtaining a great number of color prints from B, G, R digital image information, a silver halide color negative photographic film used for photographing is subjected to digital exposure on the basis of B,G,R digital image information and a color negative film is obtained by developing the exposed silver halide color negative photographic film. Then, a color image is exposed and printed from the color negative film onto a color printing photosensitive material, thereby obtaining the color prints.
Conventional technique 4.
This technique is similar to Conventional technique 3. That is, in conventional technique 5, a silver halide color negative photographic film used for photographing is subjected to digital exposure on the basis of digital image information and a color negative film is obtained by developing the exposed silver halide color negative photographic film. Then, a color image is exposed and printed from the color negative film onto a color printing photosensitive material, thereby obtaining the color prints. It may be consider for an ordinary person in view of this technique to record an image by utilizing all recordable density region of the negative film. However, how to use the density region is not clear.
Conventional technique 5.
This technique is also similar to Conventional technique 3. That is, in conventional technique 5, a silver halide color negative photographic film used for photographing is subjected to digital exposure on the basis of digital image information and a color negative film is obtained by developing the exposed silver halide color negative photographic film. Then, a color image is exposed and printed from the color negative film onto a color printing photosensitive material, thereby obtaining the color prints. In the case that a synthesized image of a pattern image and a photographic image is formed on a silver halide negative photographic film by digital exposure on the basis of pattern image information and digital photographic image information, it may be difficult for an ordinary person in view of this technique to consider to separate the density range of the pattern image from the density range of the photographic image.
In Conventional technique 1, it is necessary to obtain relationship between the original digital image and the obtained final image. Since color reproducibility of the entire system has to be obtained, it may be difficult to obtain the relationship correctly. As a result, only improper converting information from which proper output image may not be obtained has been obtained. Further, even if proper converting information is obtained, when fluctuation in the exposure level of the digital exposure of the image outputting means, fluctuation in the developing level or deviation in the characteristics among lot of the photosensitive materials takes place, it is necessary to obtain all over again the relationship between the original digital image information and the obtained final image and the relationship between the input values for the image outputting means and the obtained final image. Such a work requires much labor. Since the fluctuation in the exposure level of the digital exposure of the image outputting means, the fluctuation in the developing level or the deviation in the characteristics among lot of the photosensitive materials often takes place, and since many measuring operations and skillful technique are required for obtaining the relationship between the original digital image information and the obtained final image and the relationship between the input values for the image outputting means and the obtained final image, many customers have outputted image by using the converting information used hitherto without obtaining all over again the relationship between the original digital image information and the obtained final image and the relationship between the input values for the image outputting means and the obtained final image. As a result, in many cases, high quality image output could not be obtained.
The first objective of the present invention is to make it easy to deal with the fluctuation in the exposure level of the digit al exposure of the image outputting means, the fluctuation in the developing level or the deviation in the characteristics among lot of the photosensitive materials.
In Convention al technique 2, since a color negative film is formed with sublimation type pigment image by using a sublimation type thermal transfer printer, the producing efficiency is low. Further, it may be difficult with the current technique to form a color negative film with high resolution. Still further, since a relative large size color negative film is produced and an image is exposed and printed from the obtained relatively large size color negative film onto a color printing photosensitive material so as to obtain color prints, a large size printing exposure section is needed.
From the problems in Conventional technique 2, the technique of Conventional technique 3 may come to attention. However, the following problems may be pointed out for the silver halide photographic color negative film. It may be necessary to subtract the influence of sub-absorption of color dies constituting an image on the silver halide photographic color negative film. There may be deviation between an actual image seen from an object by eyes and a memory image of the object or deviation between an actual color of the object and memory color. Developing effect among photosensitive layers generally takes place due to the reason that peoples usually like prints reproduced brightly.
The developing effect among photosensitive layers is an effect to refrain another primary color from coloring for exposure to color a specific primary color.
In some cases, the similar correction to the developing effect among photosensitive layers has been already applied to B.G.R digital image information. Therefore, in the step of producing a color negative film, if the developing effect among photosensitive layers is further applied, the developing effect among photosensitive layers becomes strong excessively. As a result, chrome is so overemphasized that abnormal color prints color differently from original color are produced.
The second objective of the present invention is to correct the influence of the developing effect among photosensitive layers so as to prevent chroma from being overemphasized due to the developing effect among photosensitive layers so that abnormal prints may be avoided and color prints with a natural feeling can be obtained.
With an ordinary conception in view of Conventional technique 4, if an image is recorded by using all density region recordable on a silver halide color negative photographic film, since flare may take place as a special problem of digital exposure on an ordinary apparatus manufactured at reasonable cost, a range capable of controlling exposure intensity very well is narrow. As a result, it may be difficult to record a density in the vicinity of the maximum density in the density region capable of being recorded on the silver halide color negative photographic film. If conducting such a recording, flare is apt to take place. Further, with the density in the vicinity of the minimum density of the density region capable of being recorded on the silver halide color negative photographic film, the characteristic becomes unstable.
The third objective of the present invention is to avoid the special problems of the digital exposure so as to make it easy to obtain good prints.
With an ordinary conception in view of Conventional technique 5, if a synthesized image is subjected to digital exposure, since flare may take place as a special problem of digital exposure on an ordinary apparatus manufactured at reasonable cost, it may be difficult to control the light amount delicately. The digital exposure fluctuates delicately due to flare, a pattern image my not be formed in a sharp image.
The fourth objective is to make it possible by avoiding the special problem of the digital exposure to obtain a print on which a pattern image is formed in a sharp image capable of being discriminated from a photographic image even if a synthesized image of the pattern image and the photographic image is printed.

Image outputting method and converting information producing method