A bell that rings when the entire rolling element bell is shaken, includes a base section having a recess, and a bell section that is supported directly or indirectly by the base section, a rolling element that is adapted to roll in the recess, the rolling element hitting the base section when the entire rolling element bell has been shaken, and the rolling element has rolled to reach an edge of the recess of the base section, and the rolling element bell being configured so that sound produced by the rolling element bell is adjusted by adjusting a contact angle or a contact height of the rolling element with an inner wall of the bell section.

1. Field of the Invention
The present invention relates to a highly resonant bell that may be used in various fields such as a doorbell, an alarm bell, an animal repeller bell, and a call bell.
2. Description of the Related Art
Various bells such as a doorbell that is rung by a visitor, an alarm bell that gives a warning, an animal repeller bell (e.g., bear repeller bell), and a good luck bell have been proposed. These bells may not ring when shaken to only a small extent, and may produce a monotonous sound.
Patent Japanese Utility Model Registration No. 3012065 discloses a bell in which a rolling element is placed in a space surrounded by a metal sheet, and Patent Japanese Design Registration No. 392367 discloses a toy bell in which a ball is held between upper and lower resonators. However, these bells may not ring when shaken to only a small extent.
As illustrated in FIG. 15, a related-art bell may have a structure in which a weight 114 is suspended using a suspension member 111 (e.g., string) inside a bell section 112, for example.
Such a structure has a problem in that the swing cycle of the weight 114 is determined by the length of the suspension member 111.
When a bell has a structure in which a ball is suspended, the ball hits the inner wall of the bell section at a constant angle.
Since the ball is suspended using a string or the like, the bell does not ring immediately when the bell section has been shaken.


A developing apparatus includes a developing roller, a first shaft, a second shaft, a belt, and a power supply. The developing roller is in contact with an image forming body. The first shaft is driven in rotation by an external drive source. The belt is entrained about the first and second shafts, and is partially at first and second portions in a wrapping contact with the developing roller. The power supply applies voltages to the first and second shafts such that a voltage drop appears in the belt in a direction of travel of the belt. The power supply applies a voltage to the developing roller such that a first electric field is developed across the developing roller and the first portion, and such that a second electric field in the opposite direction to the first electric field is developed across the developing roller and the second portion.

1. Field of the Invention
The present invention relates to a developing apparatus and an image forming apparatus that incorporates the developing apparatus.
2. Description of the Related Art
Among conventional image forming apparatuses based on electrophotography are printers, copying machines, facsimile machines, and other multi function apparatuses. A printer performs electrophotographic processes including charging exposing, developing, transferring, cleaning and neutralizing. Through these processes, a toner image is formed on a photoconductive drum, and is transferred onto a medium such as paper. Subsequently, the toner image is fixed into a permanent image.
An electrophotographic printer incorporates a developing unit that usually uses one-component toner. A toner supplying roller formed of sponge supplies the toner to a developing roller, which in turn supplies the toner to the photoconductive drum to develop an electrostatic latent image with the toner into a toner image.
During developing process, only the toner on the developer roller that is brought into contact with the electrostatic latent image is transferred to the photoconductive drum to develop the electrostatic latent image, and the rest remains on the photoconductive drum. This may leave a reversal image of the electrostatic latent image on the developing roller.

Developing apparatus and image forming apparatus


A method of training a model for object classification and detection includes training a first classification model including a shared feature extractor shared by classification models and a first classifier for outputting a result of an object in a first input image based on feature values of the first input image, training a second classification model including the shared feature extractor and a second classifier for outputting a result about authenticity of a second input image based on feature values of the second input image, and training a third classification model including the shared feature extractor and a third classifier for outputting a classification result about a rotation angle of a third input image on the basis of feature values of the third input image extracted by the shared feature extractor, using a third training image set including images rotated at one or more angles.

Generally, a training data, which is labeled with a bounding box and a class of an object existing in each image, is needed to train an object detection model. Particularly, since a lot of effort is required to display the bounding box in the image, it is difficult to obtain a large amount of training data marked with the bounding box.
To solve this problem, weakly-supervised object detection (WSOD) capable of training a model without a bounding box has been proposed recently. However, the weakly-supervised object detection has a problem of requiring a lot of images labeled with a class. Accordingly, it is required to provide a method of training an object classification model even when only a small amount of images are labeled with a class in a situation without the bounding box.

Method and apparatus for training model for object classification and detection


A vehicle door is made by providing a first sheet metal door panel with fastening portions at a peripheral portion of the first door panel. The fastening portions each have at least a portion that extends at a first angle of not greater than 90 degrees with respect to a body of the first door panel. A second sheet metal door panel is provided with flange portions at a peripheral portion of the second door panel. The flange portions extend transverse to a body of the second door panel. The vehicle door is formed by fastening each of at least two of the fastening portions of the first door panel to an associated one of the flange portions of the second door panel.

Utility truck bodies often have a box-like, non-aerodynamic appearance. This box-like appearance lends itself to relatively simple manufacturing processes for making doors for the truck bodies. However, a trend in the manufacture of trucks today is to provide the truck body with aesthetically pleasing lines, which calls for some curved body panels. The process of manufacturing curved body panels increases the cost and complexity of the truck door construction.
Curved truck door panels are typically formed by a metal-forming process that requires the use of special dies. These dies are provided with a shaped surface for pressing the sheet metal into a desired shape, and greatly increase the cost of the truck body. Thus, there is a need for an inexpensive method for producing curved vehicle door panels.
U.S. Pat. No. 5,239,753 to Kalis Jr. et al., which is incorporated herein by reference in its entirety, relates to a method that employs a jig having curved supports for imparting a curvature to an outer door panel. An inner door panel is fastened to the outer door panel by aligning openings in tabs of the outer door panel with openings in ribs of the inner door panel and by riveting the tabs to the ribs. This method of joining the inner and outer door panels increases the complexity and thus the expense of the door manufacturing process.


An adjustable safety relief valve is provided for use on a pressure vessel or a flow line with a pressurized fluid therein. In the preferred embodiment, the safety relief valve comprises a body with a closed bonnet and a chamber therein and an inlet and an outlet; the inlet including a valve seat; a disk member with an attached stem member closable on the valve seat; a mechanism in the body biasing the disk member to rest on the valve seat; a guide member supported in the bonnet to guide and limit disk member movement; and a skirt member affixed to the body, which surrounds the disk member and defines a uniform flow area with the inlet. The presented safety relief valve has improvements, which remove detriments to disk member movement and function, resulting in a safety relief valve with predictable performance and improved reliability.

The present invention relates to safety relief valves for use with gases or liquids on a pressurized system, such as pressure vessel or a flow line.
Safety relief valves are commonly used on pressure vessels or pipelines to relieve temporary pressure surges in excess of the safe pressure the vessel or pipeline can withstand. Safety relief valves have the advantage of responding very quickly to pressure changes in pressurized systems to which they are attached. Safety relief valves move to a fully open position almost immediately after the pressure within the system rises above a user-determined set pressure. This allows excess fluid pressure to escape quickly. Then, when sufficient pressure has escaped, safety relief valves quickly move back to a closed position. For an example of a safety relief valve, see U.S. Pat. No. 4,932,434, which is herein incorporated by reference in its entirety.
Existing safety relief valves do, however, have some problems. One problem is that fluid flowing through a safety relief valve must change direction inside the valve body due to the valve body outlet being located at a ninety degree angle in relation to the valve inlet. The redirection of flow causes internal moveable parts to shift towards the valve body outlet during valve cycling, resulting in interference between the moveable parts and related stationary guide members. Part shifting causes the guide surfaces of parts to rub together resulting in damage, such as galling, to occur on the guide surfaces. Galling can be defined as a condition where excessive friction between sections on two mating parts results in localized welding with subsequent splitting and a further roughening of the rubbing surfaces of one or both of the two mating parts. Part shifting also causes problems when the valve closes. As the moveable parts attempt to realign with the inlet upon valve closure, undesirable impact occurs between the face of the moveable parts and the inlet resulting in impact damage to the parts.
See, for example, the safety relief valves described in U.S. Pat. No. 4,799,506 (hereinafter the '506 patent), which is herein incorporated by reference in its entirety, and U.S. Pat. No. 8,413,955 (hereinafter the '955 patent), which is herein incorporated by reference in its entirety. In these designs, a disk member rests upon a valve seat on an inlet with a stem member attached to the disk member. The stem member provides guidance to the disk member, and a guide member with an internal longitudinal guide bore acts to provide guidance to the stem member. This type of disk member guidance arrangement is preferable, since the guide surfaces are located away from the general path of flow, which lessens the possible build-up of foreign particles between the guiding members. When the disk member is removed from the valve seat, fluid escapes and exits the valve body through the outlet, which is located at a ninety degree angle in relation to the inlet. The redirection of fluid from the inlet towards the outlet shifts the disk member and stem member towards the valve body outlet. The shifting of the disk member towards the outlet creates detrimental contact between the stem member and the guide bore during valve cycling. Disk member shifting towards the outlet, coupled with repeated cycling of the disk member, causes damage to the stem member and the guide bore. In a worst case scenario, the stem member material may yield or fail. Damage to the members is exacerbated during high pressure venting cycles, due to the increase in contact force between the stem member and the guide bore created by high-powered flow forces exiting the valve body outlet. In the '506 and '955 patents, the stem member serves as the main means of guidance for the disk member when the disk member is removed from the valve seat, and close fit tolerances are necessary between the stem member and the guide bore for repeatable valve performance. Any damage on the stem member or guide bore can interfere with the cycling of the disk member, thereby changing valve opening and closing characteristics, which makes valve performance less predictable.
The shifting of the disk member towards the outlet also creates a problem when the valve closes. As the disk member attempts to realign with the inlet upon valve closure, undesirable contact occurs between the spherical sealing surface of the disk member and the top surface of the valve seat. The repeated realignment of the disk member with the valve seat during valve closing results in damage on the disk member due to repeated impact. This is especially undesirable, since the spherical face of the disk member is used in combination with the valve seat to provide a valve seal at the inlet. Disk member damage at the spherical sealing surface will result in the valve continuously leaking pressurized fluid from the inlet.
Another problem with existing safety relief valves is that they tend to utilize a sliding-fit disk member and skirt member design with the skirt member providing disk member guidance. See, for example, the safety relief valves described in U.S. Pat. No. 2,597,057 (hereinafter the '057 patent), which is herein incorporated by reference in its entirety, and U.S. Pat. No. 5,341,838 (hereinafter the '838 patent), which is herein incorporated by reference in its entirety. In the '057 and '838 patents, when the disk member is raised from an inlet so that fluid escapes, a portion of the skirt member obstructs the flow path as fluid flows around a blow-down control mechanism on the inlet, so that the fluid accumulates above the disk member in a closed bonnet. As fluid moves around the disk member and into the bonnet, foreign fluid particles accumulate between the sliding surfaces of the disk member and the skirt member. The closely fitted outer diameter of the disk member and inner diameter of the skirt member serve to guide the disk member and control the time it takes for fluid from the inlet to enter and exit the closed bonnet. This condition is used to control the blow-down value of the valve, but in doing so, the sliding-fit parts are coated with contaminates from the fluid. The build-up of foreign particles from contaminated fluids causes interference with disk member movement. This interference can affect the amount of inlet pressure needed to operate the valve, thereby changing valve opening and closing characteristics, which makes valve performance less reliable.
In addition to the above-mentioned problems, safety relief valves can vary in quality in a number of ways. Different safety relief valves vary in their ability to attain high coefficients of flow, their performance reliability, their durability, their cost to manufacture, and their ease of use.


The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.

In the fabrication of microelectronic devices, application of one or more metallization layers is an important step in the overall fabrication process. The metallization may be used in the formation of discrete microelectronic components, but is most often used to provide interconnect components formed on a workpiece, such as a semiconductor wafer. For example, metallized structures are used to interconnect devices of an integrated circuit.
An integrated circuit is an interconnected ensemble of devices formed within a semiconductor material and within a dielectric material that overlies a surface of the semiconductor. Devices which may be formed within the semiconductor include MOS transistors, bipolar transistors, diodes, and diffused resistors. Devices which may be formed within the dielectric include thin film resistors and capacitors. Typically, more than 100 integrated circuit die (IC chips) are constructed on a single 200 mm diameter silicon wafer. The devices utilized in each die are interconnected by conductor paths formed within the dielectric. Typically, two or more levels of conductor paths, with successive levels separated by a dielectric layer, are employed as interconnections. Aluminum alloy and silicon oxide are examples of materials which have been used for conductive and dielectric features.
With the continuing interest by integrated circuit manufacturers for ways to reduce delays in the propagation of electrical signals, copper has replaced aluminum alloy as the material of choice for interconnect structures.
In addition to its desirable electrical properties, the use of copper as interconnect structures allows integrated circuit manufacturers to leverage electrodeposition process advantages provided by the use of copper. For example, electrodeposition of copper currently provides the most cost-effective manner in which to deposit a copper metallization layer. In addition to being economically viable, electrodeposition techniques provide substantially conformal copper films that are mechanically and electrically suitable for interconnect structures.
Despite the advantages of copper, it has not been as widely used as an interconnect material as one would expect. This is due, at least in part, to the difficulty in effectively and economically depositing copper metallization. For example, depositing copper metallization necessitates the need for the presence of barrier layer materials. The need for barrier layer materials arises from the tendency of copper to diffuse into silicon junctions and alter the electrical characteristics of the semiconductor devices formed in the substrate. Barrier layers made of, for example, titanium, titanium nitride, tantalum, tantalum nitride, tungsten and tungsten nitride, and the like, are typically laid over the silicon junctions and any intervening layers prior to depositing a layer of copper. Unfortunately, materials used as barrier layers typically do not exhibit the electrical conductive properties necessary to allow for the uniform electrochemical deposition of copper directly onto the barrier layers using conventional gap fill chemistries and processes. Accordingly, current practice employs a conductive seed layer applied to the barrier layer before the workpiece is subjected to an electrochemical copper deposition process.
A number of processes for applying a conductive seed layer onto the barrier layer exist. One such process is chemical vapor deposition or CVD, in which a thin copper film is formed on the surface of the barrier layer by thermal decomposition and/or reaction of gas phase copper compositions. CVD can result in conformal copper coverage over a variety of topological profiles; however, CVD is expensive to carry out and utilizes expensive equipment.
Another known technique for depositing a seed layer onto the barrier layer is physical vapor deposition or PVD. PVD provides relatively good adhesion between the barrier layer and the deposit of copper seed layer when compared to a seed layer deposited by CVD. One disadvantage of PVD is that it may result in poor (nonconformal) step coverage when used to fill recessed micro-structures, such as vias and trenches, disposed in the surface of the semiconductor workpiece.
The need to deposit a seed layer using CVD or PVD as described above introduces a process step that requires a large capital investment in equipment to carry out the vapor deposition process. In addition, both PVD and CVD are considered to be relatively slow, thus adversely affecting manufacturing throughput.
Attempts have been made to electrodeposit copper directly onto a barrier layer of titanium nitride or titanium tungsten. However, it has been observed by the present inventors that electrochemical deposition of copper directly onto untreated barrier layers leads to unsatisfactory results, such as poor nucleation and copper peeling due to poor adhesion between the electrodeposited copper and the material of the barrier layer.
In view of the above, the inventors have recognized the need to provide processes for depositing copper onto barrier layers that provide conformal copper coverage with adequate adhesion to the barrier layer, provide adequate deposition rates, are commercially viable, and which do not employ seed layers deposited by PVD or CVD. These needs are met by the processes of the present invention as described below.

Method for applying metal features onto barrier layers using electrochemical deposition


A circuit is provided for programming antifuses while preventing other antifuses from being inadvertently programmed or stressed. The antifuses and programming circuits are arranged in a plurality of banks, each of which contains a plurality of programming circuits corresponding in number to the number of bits of an address signal. The bits of the address signal are applied to corresponding programming circuits in all of the banks. The programming circuits each include a antifuse select transistor coupling its respective antifuse to a bank select node for the bank. The antifuses in one of the banks are programmed by coupling the bank select node for that bank to ground through a bank select transistor. The antifuse select transistor in the programming circuit and the bank select transistor thus complete a current path from a programming node, through the antifuse and transistors to ground. However, the interconnection of the bank select transistor and the antifuse select transistor has a relatively high parasitic capacitance. As a result, significant current can be capacitively coupled through the bank select transistor of the nonselected bank, thereby inadvertently programming the antifuses in the nonselected bank. Inadvertent programming of antifuses in the nonselected bank is avoided by charging the parasitic capacitances of the bank select nodes in the nonselected banks. As a result, the antifuse select transistors in each of the programming circuits are maintained in an OFF condition, and the voltage across the parasitic capacitances remains relatively constant, thereby limiting the current flowing through the parasitic capacitances.

Conventional integrated circuit memories contain individual memory cells arranged in an array of rows and columns. Occasionally, fabrication defects render one or more cells inoperative. To boost production yields, several redundant rows and columns of cells are integrated into the memory array to be used as substitutes for the defective rows or columns. After identifying the defective row or column, a redundant row or column is substituted for the row or column containing the defect. This substitution requires the programmable devices, such as fuses or antifuses, to identify the defective rows or columns for which a redundant row or column is to be substituted.
Antifuses are capacitive-type structures, an example of which is shown in FIG. 1. As shown in FIG. 1, an electronic circuit 2 contains an antifuse 4 which includes a pair of conductive plates 6 and 8 and a dielectric material 9 between the plates. The conductive plates 6, 8 may be made from doped silicon, polysilicon, metal or another conductive material with similar properties. The dielectric material 9 may be made from oxide, nitride, nitride-oxide, oxide-nitride-oxide, undoped amorphous silicon, or equivalents thereof In an unprogrammed state, the antifuse 4 is non-conductive and has a resistance of over 1 mega-ohm across the plates 6, 8. To program the antifuse 4, a relatively high electric field is applied across the plates 6, 8. The high electric field causes the breakdown and melting of a portion of the dielectric material 9, and the two plates 6, 8 of the antifuse 4 flow, contacting each other and creating a low-resistance path. Essentially, the breakdown of the dielectric material 9 occurs at an area in which the composition of the material is most defective. Therefore, blown antifuses conduct and unblown antifuses do not conduct.
As mentioned above, fuses (not shown) are also used to identify defective rows or columns in a memory device for which a redundant row or column is to be substituted. Fuses are basically conductive paths that are opened and thus made non-conductive by applying a sufficiently large voltage and current to the fuse.
FIG. 2A shows a part of a conventional substitute memory cell enabling circuit array 10. The enabling circuit array 10 shown in FIG. 2A is capable of selecting up to three substitute rows or columns using three respective banks 12, 14, 16 of programming circuits 20a, b . . . n. It will be understood, however, that a lesser or greater number of banks 12, 14, 16 may be used to enable a lesser or greater number of substitute rows or columns.
The number of programming circuits 20 in each bank 12, 14, 16 corresponds to the number of bits in an address designating the defective row or column. The corresponding programming circuits 20a, b, . . . n in each bank 12, 14, 16 receive a respective address bit A.sub.0, A.sub.1, . . . A.sub.n. The address received in the address bits A.sub.0, A.sub.1, . . . A.sub.n of the bank 12, 14, 16 are not necessarily the same as the row or column address of the defective row or column. All of the programming circuits 20a, b, . . . n in each bank 12, 14, 16 are enabled by a respective NMOS bank select transistor 22, 24, 26. The conductive state of each bank select transistor 22, 24, 26 is controlled by a respective enable inputs En.sub.0, En.sub.1, En.sub.2.
Each programming circuit 20 also includes an antifuse 4 having a air of plates 6, 8 as explained above with reference to FIG. 1. The plate 6 of each antifuse 4 is connected to a circuit ground node 30. The circuit ground nodes 30 of all of the programming circuits 20 are connected to each other and to a circuit ground C.sub.GND input. The other plate 8 of the antifuse 4 is connected through a voltage clamping transistor 36 and an antifuse select transistor 38 to the drain of one of the bank select transistors 22, 24, 26. The gate of each voltage clamping transistor 36 is coupled to an elevated supply voltage V.sub.CCP. The elevated supply voltage V.sub.CCP is normally generated from a supply voltage V.sub.CC using a charge pump or similar circuit, although it may be generated from any source. The gate of each antifuse select transistor 38 in one bank is connected to the gates of corresponding antifuse select transistors 38 in other banks. Thus, for example, the gates of the antifuse select transistors 38 in the programming circuits 20a are all connected to each other and to the A.sub.0 input.
The manner in which the antifuses 4 are programmed to correspond to the addresses of defective rows or columns will now be explained. Initially, the antifuse select transistors 38 and the bank select transistors 22, 24, 26 are all OFF. When the memory cell enabling array 10 is ready for programming, a relatively large programming voltage is applied to the C.sub.GND terminal and a logic "1" is applied to one of the enable inputs En.sub.0 -En.sub.2 to turn on the corresponding bank select transistor 22, 24, 26. The bank select transistor, for example transistor 22, pulls the source of each antifuse select transistor 38 in the bank 12 to ground. At this time, the plate 6 of the antifuse 4 in each programming circuit 20 in the bank 12 is coupled to the relatively high programming voltage while the plate 8 in each programming circuit 20 is isolated from ground by its respective antifuse select transistor 38.
The final programming step is turning ON the antifuse select transistors 38. A pattern of address bits A.sub.0 -A.sub.n is applied to the gates of the antifuse select transistors 38 in all of the programming circuits 20. The antifuse select transistors 38 receiving a high gate voltage are turned ON, thereby completing the circuit path from the plate 8 of the antifuse 4 to ground in the enabled bank 12 in which the bank select transistor 22 is turned ON. As a result, the full magnitude of the programming voltage on the C.sub.GND terminal is applied between the plates 6, 8 of selected antifuses 4 in the bank 12. The resulting electric field causes a breakdown of the dielectric material 9, thereby forming a low-resistance path across the antifuses 4. Although the antifuse select transistors 38 are selectively turned ON in the remaining banks 14, 16, the plates 8 of the antifuses in these banks are isolated from ground by the OFF bank select transistors 14, 16.
After the substitute memory cell enabling array 10 has been programmed as described above, it is used to identify row or column addresses corresponding to defective rows or columns for which a substitute row or column must be used. A sensing circuit (not shown) determines whether antifuses 4 have been blown in the pattern of the address by applying the bits of the address to respective antifuses 4 in all of the banks 12, 14, 16. The sensing circuit (not shown) uses a logic circuit to combine the resulting signals from all of the antifuses 4 in each bank to determine if the antifuses 4 in any of the banks 12, 14, 16 are programmed in the same pattern as the address. If the address matches one of the addresses that has been programmed into the antifuses 4, the output of the logic gate changes state and enables a substitute row or column of memory cells.
One of the inherent problems with the prior art substitute memory cell enable array 10 shown in FIG. 2A is the unintended programming of antifuses 4. This problem is best explained with reference to FIGS. 2B and 2C. FIG. 2B shows the programming circuit 20 in a non-selected bank 14 during programming of a selected bank 12, while FIG. 2C shows the voltages at various nodes in the circuit of FIG. 2B.
During programming of the antifuse 4, the programming voltage applied to the circuit ground node 30 is applied to the plate 6 of the antifuse 4. Since the plate 8 is isolated from ground at this time because the antifuse select transistor 38 is OFF, the voltage on the plate 8 follows the rise of the voltage on the plate 6. At time t.sub.0, the A.sub.0 input to the gate of the antifuse select transistor 38 goes high to program the antifuse 4 in the corresponding programming circuit 20a of the enabled bank 12. However, since the gates of all antifuse select transistors 38 in corresponding programming circuits 20a are connected to each other, the antifuse select transistor 38 in the non-selected bank 14 also turns ON. Although the bank select transistor 24 of the non-selected bank 14 is OFF, the source of the transistor 38 is nevertheless coupled to ground by a parasitic capacitance 40 due to the relatively long interconnection between the drain of the bank select transistor 24 and the source of the antifuse select transistor 38. As a result, the voltage on the plate 8 is pulled to V.sub.O at time t.sub.0, and gradually increases as the parasitic capacitance 40 charges. The voltage V.sub.O is substantially equal to the voltage V.sub.CC applied to the gate of the transistor 38 less its threshold voltage V.sub.T. As the voltage on the parasitic capacitance 40 increases, the voltage at a node 44 increases to V.sub.CCP -V.sub.T, where V.sub.T is the threshold voltage of the transistor 36, as shown in FIG. 2C. When the voltage at node 44 reaches this level, the transistor 36 turns OFF. The voltage on a bank select node 46 across the parasitic capacitance 40 eventually rises to V.sub.CC -V.sub.T, where V.sub.T is the threshold voltage of the transistor 38, as also shown in FIG. 2C. At this point, the transistor 38 turns OFF.
It is significant that, up until the time that the transistors 36, 38 turn OFF, there is a substantial voltage across the antifuse 4 and a current path from the circuit ground node 30 to ground through the parasitic capacitance 40, the transistors 36, 38 and the antifuse 4. As a result, sufficient current can flow through the antifuse 4 to partially or completely blow the antifuse 4, or otherwise overstress the dielectric material 9 of the antifuse 4.
If an antifuse 4 is inadvertently programmed as described above, it may be possible to detect the error during testing of the memory device containing the substitute memory cell enabling array 10. However, the inadvertent programming of the antifuse 4 may be less than complete. In particular, the voltage inadvertently applied to an antifuse 4 as explained above may stress the dielectric material 9 in the antifuse 4, but not sufficiently to cause the antifuse to become sufficiently conductive to be perceived as being programmed. However, once stressed, the dielectric material 9 in the antifuse 4 may break down over time thus transitioning from a state that is perceived to be non-conductive to a state that is perceived to be conductive. Also, a partially programmed antifuse may be perceived as non-conductive under some conditions, such as supply voltage or temperature values, but be perceived as conductive under other conditions. Consequently, an antifuse 4 that is not intended to be programmed may be perceived as non-conductive during testing of an integrated circuit, but may be perceived as conductive during use of the integrated circuit.
Although the above discussion relates to the use of antifuses 4 in the substitute memory cell enable array 10, it is also applicable to other types of electrically programmed programming elements, such as fuses. In particular, a voltage applied to a the C.sub.GND input to program a fuse (not shown) would result in a current through the fuse, the transistor 36, 38 and an ON bank select transistor, such as transistor 22, of the selected bank 12. However, the voltage applied to the fuses in non-selected banks, for example bank 14, would also be coupled through the transistors 36,38 in those banks to the parasitic capacitances 40 of the interconnections of the OFF bank select transistors 24, 26. The current flowing through the fuses to charge the parasitic capacitances 40 may, in some cases, be sufficient to completely or partially program the fuses in the non-selected banks 14, 16.

Self-protected circuit for non-selected programmable elements during programming


A VPM (Video Port Manager) provider, which performs such control as to allow a VGA (Video Graphic Array) controller to effectively receive moving picture data from a ZV (Zoomed Video) port, acquires display environment information about the system display performance and the current display mode from a VGA BIOS (Video Graphic Array Basic Input Output System), and determines the maximum resolution of moving pictures displayable by the system based on that display environment information. When the resolution specified in the moving picture display request from a VPM client is greater than the displayable maximum resolution of moving pictures, the optimal data conversion processing needed to display moving picture data without causing a display disturbance and with a resolution closest to the specified resolution, such as data compression, frame thinning or line thinning, is performed on that moving picture data.

The present invention relates to a moving pictures display apparatus system, and, more particularly, to a moving pictures display method and moving pictures display apparatus which are adapted to computer systems having an exclusive bus for moving pictures and a medium for storing codes for displaying moving pictures.
The entire contents of Japanese Patent Application No. 8-44806 filed on Mar. 1, 1996 are incorporated herein by reference.
Personal computers which can use PC cards that conform to the PCMCIA (Personal Computer Memory Card International Association) standards and JEIDA (Japanese Electronics Industry Development Association) standards are becoming popular these days. Recently, various developments have been made to use the PC cards as a video capture card for controlling the input and output of moving picture data, an MPEG (Moving Picture Coding Experts Group) decoder card and the like.
To efficiently process a vast amount of data like moving picture data, it becomes popular to design personal computers with system architectures which use the PCI local bus that can permit fast data transfer. Even the PCI local bus has a limit to the data transfer performance. When a PC card is used as a video capture card or an MPEG decoder card as mentioned above, therefore, the data transfer performance of the PCI local bus is insufficient.
In this respect, developments on techniques for using an exclusive bus for moving pictures, called "ZV (Zoomed Video) port," to directly connect a PC card to a display controller have recently started. The ZV port can permit a PC card to directly send video data and audio data to a display controller and an audio controller respectively without using the system bus. This overcomes the inconvenient long occupying of the system bus by the transfer of a vast amount of video data, and thus can allow moving pictures to be displayed without degrading the system performance. The ZV point is disclosed in a U.S. patent application Ser. No. 08/458,690 filed Jun. 2, 1995.
In conventional systems for transferring moving picture data to the display controller using such an exclusive moving picture bus, however, the displayable window size (the resolution of moving pictures) of moving picture data is determined specifically by software which controls the transfer of the moving picture data. The conventional systems cannot therefore display moving picture windows which are larger than the window size determined by the software.
There is another shortcoming originating from the system display performance such that when moving pictures whose resolution is greater than a certain level are displayed, the amount of transfer of moving pictures to a display monitor from a video memory per unit time becomes insufficient, thus causing a disturbance on the display screen.


An optics device port configuration system includes a switch. A first optics device and a second optics device are connected to the switch. A cable connects the first optics device and the second optics device to provide a link. The switch determines that an optics type of the first optics device is unavailable. In response, the switch applies each of a plurality of fiber optics configurations on the switch until either the link becomes available or each of the fiber optics configurations have been applied without the link becoming available. In response to each of the fiber optics configurations having been applied without the link becoming available, the switch applies each a plurality of copper optics configurations on the switch until the link becomes available. In response to the link becoming available, the switch provides at least one setting on the switch until errors are not occurring on the link.

The present disclosure relates generally to information handling systems, and more particularly to a configuration system for optics devices in an information handling system.
As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system (IHS). An IHS generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, IHSs may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in IHSs allow for IHSs to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, IHSs may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
Some IHSs such as, for example, switch IHSs, utilize optics devices such as, for example, small form-factor pluggable (SFP) optics devices, enhanced SFP (SFP+) optics devices, and quad-SFP (QSFP) optics devices, that are compact, hot-pluggable transceivers that connect to ports on the switch IHS in order to provide for, for example, telecommunication and data communication applications. In general, the port on the switch IHS to which the optics device is connected is configured in order to work properly with its connected optics device without link issues or packet cyclic redundancy check (CRC) issues. Conventionally, the settings that allow the optics device to work properly (e.g., Software receive loss-of signal (SwRXLOS) settings, interface type settings, pre-emphasis settings, etc.) on the port of the switch IHS are retrieved by reading an optics type from an electronically erasable programmable read-only memory (EEPROM) in the optics device, and using that optics type to retrieve those settings for use in configuring the port. However, if an optics device with an EEPROM that has not been programmed or that has been corrupted is provided in the port of the switch IHS, link issues and packet CRC issues will typically result as, without the optics type from the EEPROM, the switch IHS will not be able to determine the correct settings to configure its port for that optics device. As such, optics devices with unprogrammed or corrupted EEPROMs are unusable and typically must be replaced.
Accordingly, it would be desirable to provide an improved optics device configuration system.


A tilt adjustment device for adjusting tilt of a left guide bar with respect to a right guide bar, and includes a holding seat and a cylindrical-shaped bushing disposed rotatably within the holding seat. The bushing defines a bar-retention hole to permit extension of the left guide bar therethrough, and has a turning portion defining a first axis and an insert portion that extends eccentrically from the turning portion and that defines a second axis parallel to the first axis. Rotation of the cylindrical-shaped bushing relative to the holding seat results in a radial movement of the turning portion, which, in turn, moves the first axis toward and away from the second axis of the insert portion.

Among all the data storage solutions, the optical disks are becoming more and more important for backing up data and exchanging information because the optical disks have many advantages including a high storage capacity, easy to handle and carry, and a long preserving time for the stored data. Till now, the optical disk drives can be found all around us, such as in desktop computers, laptop computers, DVD players, and even some instruments or electronic products with built-in microprocessors.
Referring to FIG. 1, a conventional optical disk drive 10 is shown to include a spindle motor 104, a disk loader (not visible) mounted on the spindle motor 104, an optical disk (not shown) mounted on the disk loader so as to be rotated by the spindle motor 10, left and right guide bars 106, 108, a carriage seat 105 mounted slidably on the left and right guide bars 106, 108, and a pick-up head 102 mounted on the carriage seat 105. The carriage seat 105 is movable on the left and right guide bars 106, 108 upon actuation of a sled motor (not shown), which in turn, causes the pick-up head 102 to move reciprocally on the left and right guide bars 106, 108. The pick-up head 102 is provided with a voice coil motor (not shown), which cooperates with the sled motor to enable the pick-up head 102 to move along a vertical direction downward and upward in order to precisely focus the laser beam on a recording surface of the optical disk, thereby permitting reading operation of the data from the optical disk.
In order to reproduce the data recorded on the disk properly, the head 102 must move radially in a straight line from the center of the disk and the plane of the disk and the plane of movement of the head 102 along the guide bars 106, 108 should be parallel. However, the head 102 may deviate from the radial path from the disk center or is tilted with respect to the plane of the disk due to manufacturing errors. Under such circumstance, the head 102 fails to provide precise focusing and tracking of the disk.
U.S. Pat. No. 5,768,248 to Hyun-woo Lee has proposed a pick-up position and tilt adjusting apparatus for a disk player. However, the aforesaid tilt apparatus includes several complicated parts for adjusting the elevation of the left and right guide bars, thereby resulting in high manufacture cost.

Tilt adjustment device for an optical disk drive


Memory management in a computer system is improved by preventing a subset of address translation information from being replaced with other types of address translation information in a cache memory reserved for storing such address translation information for faster access by a CPU. This way, the CPU can identify the subset of address translation information stored in the cache.

1. Field of the Invention
The invention relates generally to memory management in a computer system and, more particularly, to an improved memory address translation mechanism for boosting performance of real-time applications running on a computer system.
2. Description of the Related Art
In a modern computer system, a technique known as virtual memory is used to manage the resource of physical or real memory of the computer system. This technique provides to the application an illusion of a very large amount of memory. Originally, the virtual memory system was developed to solve the problem of having too little physical or real memory. Although this may no longer be a factor in most modern systems having plenty of memory, the virtual memory mechanism itself has proven valuable for other reasons. Among these reasons, the virtual memory mechanism simplifies memory allocation and/or memory protection as well as application program design.
In a virtual memory system, virtual addresses are translated into real addresses with page tables having a plurality of page table entries (PTEs). Typically, such page tables are stored in a main memory of the computer system such as a DRAM chip. However, there is a bottleneck between the CPU and the main memory since the memory bus connecting between the CPU and the main memory is much slower than the operating speed of the CPU. For certain applications that do not require real-time response, this bottleneck may not pose a legitimate concern. However, many real-time applications may find this bottleneck causing a discernable delay in the operation of such applications.
A known technique to get around this bottleneck problem is to store PTEs in a special cache called a translation lookaside buffer (TLB), which is close to the Central Processing Unit (CPU). Typically, the TLB resides on-chip within the CPU to eliminate or significantly reduce any delay associated with looking up page tables in a main memory, as long as a particular set of PTE(s) searched by the CPU happens to be stored in the TLB. When the particular set of PTE(s) is not found in the TLB, this event is typically defined as a TLB miss.
Generally, as memory read and/or write requests are made, the mapping from the virtual to real memory is cached in the TLB. When there is a TLB miss, either dedicated hardware or software must reload the TLB with the correct PTE. A software reload as well as hardware reload of the TLB can be fairly costly in terms of performance, because such a reload would require reading PTEs from the main memory and looking for a match. Typically, it can take up to three cache line misses to find a match. In real-time applications, therefore, it is undesirable to have a TLB miss.
Therefore, there is a need for a system and method for managing memory for real-time applications in a computer system.

Memory management for real-time applications

International Business Machines Corporation


In a UV high-power radiator, a plurality of dielectric tubes (6) having internal electrodes (7) are disposed in the interior of a quartz housing having rectangular cross section. The interior of the housing is filled with a filling gas which emits UV radiation under discharge conditions. The electrical supply is provided in such a way that the discharges (17) develop between adjacent dielectric tubes (6). A notable feature of this construction is its compactness, economical nature and service friendliness.

1. Field of the Invention
The invention relates to a high-power radiator, in particular for ultraviolet light, having a discharge chamber filled with a filling gas which emits radiation under discharge conditions and having electrodes which are connected in pairs to one or more high-voltage sources, there being situated between two electrodes which are at different potential dielectric material which is adjacent to the discharge chamber.
At the same time the invention makes reference to a prior art as disclosed, for instance, by the European Patent Application having publication number 0 363 832.
2. Discussion of Background
The industrial use of photochemical processes is heavily dependent on the availability of suitable UV sources. The conventional UV radiators yield low to medium UV intensities at a few discrete wavelengths such as, for example, the mercury low-pressure lamps at 185 nm and, in particular, at 254 nm. Truly high UV powers are achieved only from high-pressure lamps (Xe, Hg) which, however, then distribute their radiation over a larger wavelength range. The new excimer lasers have made a few new wavelengths available for fundamental photochemical experiments, but are at present suitable only in exceptional cases for an industrial process for cost reasons.
The European Patent Application mentioned at the outset or, alternatively, the conference paper entitled "New UV and VUV Excimer Radiators" by U. Kogelschatz and B. Eliasson distributed at the 10th Lecture Conference of the Society of German Chemists, Specialist Group on Photochemistry, in Wurzburg (FRG), 18th-20th Nov. 1987, describes a new excimer radiator. This new radiator type is based on the principle that excimer radiation can be produced even in dark electrical discharges, a type of discharge which is used on a large scale industrially in the production of ozone. In the current filaments of this discharge which are present only for a short time (<1 microsecond), noble gas atoms which react further to form excited molecular complexes (excimers) are excited by electron collisions. These excimers live only a few nanoseconds and, on decomposing, give up their bonding energy in the form of radiation whose wavelength range may be in the UV-A, UV-B, UV-C or even in the visible spectral range, depending on the composition of the filling gas.
In the most recent past, the demand for such high-power radiators has increased because the particular properties of the radiator have opened up many new fields of application in chemical and physical process technology, in the graphical trade, for coatings etc. There is therefore a great need for economical and operationally reliable UV radiators, if possible of modular construction.


Disclosed is a method for determining metastatic potential of tumors, a method and a composition for treating/suppressing metastasis of cancers, as well as a method for obtaining a metastasis suppressor. A particular aspect of the invention relates to a method and a composition of evaluating expression levels of connective tissue growth factor (CTGF, also known as CCN2) to determine the status of tumor invasion. Another aspect of the invention relates to a method and a composition comprising a tumor suppressor, which maintains or increases an expression level of CTGF to suppress the invasion ability of tumor cells effectively. In another aspect of the invention relates to methods for obtaining a metastasis suppressor by evaluating the expression levels of CTGF after contacting suppressor candidates with a tumor cell line system.

1. Field of the Invention
The present invention relates to a method and composition for diagnosing and suppressing metastasis thereof A particular aspect of the invention relates to a method and composition of evaluating expression levels of connective tissue growth factor (CTGF, also known as CCN2) to determine the status of tumor invasion. Another aspect of the invention relates to a method and composition comprising a tumor suppressor, which maintains or increases an expression level of CTGF to suppress the invasion ability of tumor cells effectively.
2. The Prior Arts
Cancer is a leading cause of death in most developed countries. Although many researchers focus their efforts on developing effective methods to treat cancers, the difficulty of treating metastatic cancers is still a problem.
Metastasis is a process that the cancer cells spread from their original site to other areas in the body. Tumor metastasis involves detachment of tumor cells from the primary tumor mass, microinvasion of tumor cells into stromal tissue, intravasation of tumor cells into blood vessels, extravasation and growth of tumor cells in secondary sites. Many approaches have been developed to study the metastatic process in molecular levels, but the mechanisms of metastasis are still not very clear.
Occurrence of metastasis may bring high risk and death rate to patients. To optimize the prognosis, some aggressive methods with severe side-effects are taken to treat or suppress the tumor metastasis. Also, early detection of primary, metastatic, and recurrent disease can significantly impact the prognosis of patients suffering from cancers. Accordingly, determination of metastatic potential of tumor cells is very important to take adequate treatments to patients. Furthermore, there is a great need for methods which are effective to treat or suppress the tumor metastasis.

Methods and compositions for diagnosing and suppressing metastasis thereof


At least one embodiment of this disclosure includes a power shelf for serving a power zone within an IT equipment rack. The power shelf includes: a DC bus configured to provide DC power to rack-mounted equipment within the power zone; multiple pairs of backup battery units (BBUs) and power supply units (PSUs), wherein the multiple pairs include at least a redundant pair, such that voltage and power is supplied through the DC bus sufficient to power the rack-mounted equipment even when one of the multiple pairs is inoperative; and a power circuit, in each PSU of each of the multiple pairs, configured to rectify an AC phase from an external multi-phase AC power source, wherein the power circuit is configured to draw power from one of the BBUs paired to the PSU when the PSU fails to provide power sufficient to power the rack-mounted equipment.

With the advent of the Internet, data centers have become a practical and viable solution for cloud computing or any large-scale IT operations for business and services. A data center typically houses racks of computer servers, which provide both processing and data storage functionalities, as well as telecommunication and networking equipment, such as switches and routers, to support the communication requirements of the servers. Data center components are often collocated, where resources are shared across an organization or among multiple organizations.
Given the centralized nature of data centers, it is beneficial to maximize the service availability because downtime may result in severe consequences to those who rely on the data center and lost income to the data center operators. Since a primary cause of data center downtime is power failures, data centers are often equipped with backup power systems, such as uninterruptible power supplies (UPS) and generators. In addition, massive energy consumption by data centers causes increased resource depletion and greenhouse gas emission, among other environmental concerns. Accordingly, efficient power solutions are desired that not only guarantee high power availability, but are also cost-effective and environmentally-friendly.
The figures depict various embodiments of the disclosure for purposes of illustration only. One skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the invention described herein.


A bonnet is provided for operating a quarter turn valve assembly. The valve assembly includes a valve housing formed to include a fluid-conducting passage therein and a quarter turn valve moveable in the passage to regulate flow of fluid through the passage. The bonnet comprises a mechanism for moving the quarter turn valve in the passage, the moving mechanism including an elongated linkage assembly. The bonnet further includes an actuator housing containing the moving mechanism and an adapter block interposed between the valve housing and the actuator housing and configured to provide a mechanism for connecting the actuator housing to the valve housing. The adapter block includes a recess formed therein including a mechanism for receiving the elongated linkage assembly. The bonnet further includes a mechanism for coupling the actuator housing to the valve housing to trap the adapter block therebetween so that the actuator housing, adapter block, and valve housing are held together as a unit. The bonnet also includes a first seal mechanism contained in the recess for establishing a first sealed connection between the elongated linkage assembly and the adapter block to block flow of any fluid in the valve housing into the actuator housing so that removal of the actuator housing allows for maintenance of the first seal mechanism within the recess while leaving the valve housing in place.

This invention relates to valve actuators, and particularly to a bonnet for opening and closing a quarter turn valve assembly. More particularly, this invention relates to a bonnet configured to operate a quarter turn ball valve assembly and sealed to block escape of fluid from the valve assembly through the bonnet.
Quarter turn valves are commonly used to regulate or throttle the flow of a broad range of fluids in various industrial applications. In some applications, it is necessary to regulate the flow of a noxious liquid, gas, mixture, or other fluid conveyed from one point to another through a pipe or other conduit. A quarter turn valve assembly is mounted in a pipe and operable to regulate the flow of fluid through the pipe. Typically, the quarter turn valve assembly includes a valve housing that is welded to the pipe although it is known to use flanged or threaded joints to connect a quarter turn valve housing to a pipe.
Many different types of quarter turn valves are known. For example, ball valves, butterfly valves, and plug valves, etc. can be configured to function as a quarter turn valve. A quarter turn ball valve assembly includes a valve housing mounted in the pipe and a ball valve mounted in the housing such that it can be rotated "one quarter turn" inside the valve housing to move between its opened and closed position.
A bonnet is an apparatus that is coupled to a quarter turn valve assembly and operated to open and close a quarter turn valve included in the assembly. Typically, the bonnet is connected to a quarter turn valve mounted inside a housing and operable to rotate the quarter turn valve in a clockwise or counterclockwise direction inside the valve housing between a fluid flow-permitting "opened" position and a fluid flow-blocking "closed" position.
Bonnets of the type described above are well known in the art. For example, apparatus including a rack and pinion assembly for operating a rotary valve are disclosed in U.S. Pat. Nos. 4,597,556 to Sandling; 4,976,403 to Bramblet; 3,650,506 to Bruton; 2,983,479 to Thomas; and 1,264,282 to Dearing. Other apparatus for operating rotary valves are disclosed, for example, in U.S. Pat. Nos. 4,867,414 to Hubacek; 4,580,763 to Velan; 4,546,662 to Tremblay; 4,516,754 to Owoc; 4,468,002 to Tremblay; and 4,452,426 to Owoc.
A bonnet configured easily to mount on and detach from most types of quarter turn valve assemblies that are in service in a pipe line and in need of repair would advantageously avoid shortcomings of conventional bonnets. During development of the present invention, it has been observed that many conventional bonnets are designed to connect to only one brand of quarter turn valve assembly. This restriction makes it necessary for service personnel to maintain a supply of many different bonnet styles so that the right bonnet style for each quarter turn valve assembly in service will be available if bonnet repair or replacement becomes necessary. Maintaining a large inventory of different bonnet styles is both costly and troublesome. A single bonnet that is adaptable to mate with and actuate many different brands and styles of quarter turn valve assemblies would be an improvement over conventional bonnets.
It is difficult to retrofit an existing quarter turn valve with a replacement bonnet because conventional bonnets typically cannot be easily removed from the quarter turn valve to permit installation of a replacement bonnet. In some cases, the bonnet is formed to be an integral part of the quarter turn valve assembly and is not easily detached from the quarter turn valve assembly. It will be understood that many quarter turn valves assemblies are welded in place and that it is necessary to use a torch to cut the quarter turn valve assembly out of the pipe line so that a replacement bonnet can be attached to the old quarter turn valve assembly or a new bonnet and quarter turn valve unit can be inserted into the pipe line.
The pipe line can be disabled or otherwise out of service for a long time if it is necessary to cut a quarter turn valve assembly out of the pipe line each time the bonnet needs to be repaired or replaced. Typically, if flammable solvents or fluids are piped through the line, then the entire pipe line system must be shut down in the vicinity of the quarter turn valve assembly and the line must be purged of all fluid prior to commencement of any cutting or welding. In some cases, service personnel must obtain a repair permit to remove an old quarter turn valve assembly and weld a new or reconditioned quarter turn valve assembly and bonnet in place in the line.
It will be appreciated by those skilled in the art that removal and replacement of a quarter turn valve assembly held in place in a pipe line by flanged or threaded connections is still cumbersome and time-consuming. It is still necessary to shut down the line and provide enough skilled service technicians to handle the job.
A bonnet made of modular components that could be quickly and easily removed from a quarter turn valve assembly while leaving the quarter turn valve assembly in place in the pipe line would be an improvement over conventional bonnets. Moreover, a modular bonnet could be disassembled more easily after the bonnet is removed from the quarter turn valve assembly to enhance repair or rehabilitation of the bonnet.
The maximum amount of fluid that can pass through a bonnet from a quarter turn valve assembly to the atmosphere is prescribed by environmental specification, regulation, or law to minimize discharge of noxious fluid through a bonnet to the surroundings. While many conventional bonnets are hermetically sealed to comply with stringent environmental regulations, failure of a single sealed connection within many conventional bonnets could result in unwanted discharge of noxious fluids into the environment. A bonnet formed to include a series of sealed chambers or secondary seals therein to retain or trap noxious fluids in the bonnet should one of the primary sealed connections in the bonnet fail would be an improvement over conventional bonnets.
An improved bonnet is provided by the present invention for operating a quarter turn valve assembly. The quarter turn valve assembly includes a valve housing and a quarter turn valve movable in a fluid-conducting passage to control the flow of fluid through the passage. The valve housing is mounted in a pipe line so that the fluid-conducting passage becomes a part of the pipe line and the quarter turn valve is operable by means of the bonnet to regulate or throttle fluid flow through the pipe line.
According to the present invention, the bonnet includes means for moving the quarter turn valve in the passage formed in the valve housing between a passage-opening and a passage-closing position to regulate fluid flow through a pipe line connected to the passage. The bonnet further includes an actuator housing spaced apart from the valve housing and configured to contain the moving means. The moving means includes a linkage assembly that extends out of the actuator housing and into the spaced-apart valve housing to connect to the quarter turn valve.
A separate adapter block is included in the bonnet and interposed between the actuator housing and the valve housing. The adapter block includes means for supporting the portion of the linkage assembly that extends through the adapter block to reach the valve housing for movement relative to the adapter block.
The quarter turn valve will move in the valve housing to open and close the fluid-conducting passage upon actuation of the moving means in the actuator housing to move the linkage assembly (and the quarter turn valve connected thereto) relative to the adapter block.
Means is also provided for coupling the actuator housing to the valve housing to trap the adapter block therebetween. This causes the actuator housing, adapter block, and valve housing to be held together as a modular unit.
Advantageously, the adapter block can be configured to connect a single actuator housing to a great many styles and shapes of valve housings to reduce inventory of replacement bonnets. This feature enables service personnel to adapt a bonnet to mount on a particular quarter turn valve assembly merely by selecting the proper mating adapter block. It would only be necessary to keep an inventory of inexpensive adapter blocks to permit quick and easy reconfiguration of the improved bonnet of the present invention rather than maintaining a large, diverse stock of conventional bonnets. Further, a modular bonnet can be disassembled quickly and easily to permit efficient repair or rehabilitation of the bonnet including replacement of the various linkages, drive mechanisms, seals, or other components contained in the bonnet.
Moreover, a modular bonnet in accordance with the present invention can be removed from the valve housing containing the quarter turn valve without making it necessary for service personnel to remove the quarter turn valve assembly from its place in the pipe line. Essentially, the quarter turn valve can be moved to close the fluid-conducting passage, the existing bonnet can be removed while the quarter turn valve assembly housing remains attached to the pipe, and a new or rehabilitated bonnet in accordance with the present invention can be mounted on the valve housing.
In preferred embodiments of the present invention, the bonnet can also include a pair of sealing rings mounted on the portion of the linkage assembly that extends through the adapter block. These sealing rings are spaced apart to define a first sealed containment area inside the adapter block to retain and trap therein any fluid that might inadvertently leak from the valve housing into the adapter block. The sealing rings are loaded using a spring force with a predetermined force to extend their useful life as sealing members.
Also, two other sealed containment areas are provided in sequence inside the actuator housing to trap and retain therein any fluid that might inadvertently leak from the adapter block into the actuator housing. The last (or third) of these sealed containment areas is sealed by means of a bellows and at least one O-ring seal. A monitor is coupled to the third sealed containment area and calibrated to indicate if any unwanted fluid inadvertently leaks into the third sealed containment area from the second sealed containment area. Such a leak will only occur in the unlikely event that one or more seals in the first and second sealed containment areas fail.

Sealed bonnet for actuating a quarter turn valve assembly


The present invention is related to an opening device for a microwave oven door. A hook is moved up and down to open/close the door. A swing lever moves the hook upwardly when swinging around a swing shaft at a predetermined angle. An elastic piece is protrudingly formed from an inside of the microwave oven to the swing lever for supporting the swing lever through one direction. By this construction, the elastic piece is deformed because the swing lever is swung. This bending restoring force restores the push button and swing lever to their initial positions, when the push button is released. As a result, the push button is restored without special spring part. Therefore, the number of parts is decrease, and the production cost is lowered. Also, the assembling work is improved, since the elastic piece is produced with swing lever integrally.

1. Field of the Invention
The present invention relates to a microwave oven, and more particularly to an opening device for a microwave oven door.
2. Description of the Prior Art
Generally, for opening a conventional microwave oven, a push button installed in the front surface of the microwave oven is used. FIG. 1 is a side sectional view of the conventional opening device for a microwave oven door. As shown in FIG. 1, the opening device mainly consists of a push button 3, swing lever 9, hook lever 11, and hook 15.
The push button 3 is located under a control panel 1 and is capable of being pushed inside the microwave oven to a predetermined distance. Button shaft 5 is installed in push button 3, and a spring 7 is assembled around the button shaft 5.
The swing lever 9 is installed in the rear surface of control panel 1. A swing shaft 15 is installed to be swung on the rear surface of the control panel 1. A protrusion 17 is formed where the button shaft 5 contacts the swing lever 9.
The hook lever 11 is installed to be swung in the upper portion of the swing lever 9. One end of hook lever 11 is contacted to hook 15. A lock panel 13 in which the hook lever 11 is assembled limits the swing angle of the hook lever 11. The hook 15 can be moved up and down by hook lever 11. The hook 15 opens the door(not shown) by being moved upwardly, and closes the door(not shown) by being moved downwardly.
The conventional opening device for a microwave oven door is operated as below.
When the user pushes the push button 3 with hand, the push button 3 is pushed inside the microwave oven against the elastic force of the spring 7. Button shaft 5 swings the swing lever 9, thereby contacting the protrusion 17. Then the swing lever 9 swings around the swing shaft 15. The upper surface of the swing lever 9 touchs one end of hook lever 11. The hook lever 11 moves the hook 15 upwardly when swinging. Therefore, the microwave oven door(not shown) is opened. After that, push button 3 is returned to its initial position by the elastic force of the spring 7. The swing lever 9, hook lever 11, and hook 15 are also returned to their initial positions, when the push button 3 is returned.
In order to close the door, the user swings the door shut directly without any button operation.
The conventional opening device for a microwave oven door operated as above has problems because the manufacturing cost is high and the assembling work is difficulty since the spring has to be assembled.

Opening device for a microwave oven door


The electronic-component-mounting board according to the present invention includes: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a upper surface of the metal plate; an electronic component which is mounted on the high-heat-dissipation substrate and is electrically connected to the circuit pattern; and one external connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic-component-mounting board and an external device. The external-connection terminal is formed of a material having a thermal conductivity less than that of the metal plate and has at least one external electrode to which a lead wire is soldered. Therefore, the lead wire can be connected by soldering even on the high-heat-dissipation substrate. Accordingly, the reliability of the electrical connection is improved, and reduction in size and thickness of the electronic-component-mounting board can be achieved. In addition, the cost of the electronic-component-mounting board can be reduced.

1. Field of the Invention
The present invention relates to an electronic-component-mounting board including: a high-heat-dissipation substrate including a metal plate and a circuit pattern formed on a thin insulation layer disposed on an upper surface of the metal plate; an electronic component mounted on the high-heat-dissipation substrate; and one external-connection terminal which is disposed on the high-heat-dissipation substrate and provides electrical connection between the electronic component and an external device.
2. Description of Related Art
In wiring boards for mounting electronic components, such as light-emitting diodes, that generate a relatively large amount of heat, appropriate measures for heat dissipation must be taken. For example, wiring boards are already known in which a metal substrate having high-thermal conductivity is used to mount electronic components such as light-emitting diodes elements which are electrically connected to a circuit pattern formed on an upper surface of the metal substrate. In one known example of a substrate having high heat dissipation characteristics, a thin insulating layer is provided on the upper surface of a metal plate, and a predetermined circuit pattern is formed on the insulating layer (see, for example, Japanese Design Registration No. 1261413).
FIG. 6 is a perspective view illustrating an example of an electronic-component-mounting board previously proposed by the present applicant. As shown in FIG. 6, a conventional electronic-component-mounting board 1 is composed of: a high-heat-dissipation substrate 2 in which a metal plate 2a, such as an aluminum plate, having high-thermal conductivity is used; a light-emitting unit 3 serving as an electronic component and mounted on a substantially central portion of the high-heat-dissipation substrate 2; and external-connection terminals 4 which are disposed on opposite end portions of the high-heat-dissipation substrate 2 to provide electrical connection to an external device (not shown).
The high-heat-dissipation substrate 2 has a predetermined circuit pattern (not shown) formed on the upper surface of the metal plate 2a with an insulating layer 5 therebetween. The light-emitting unit 3 is composed of: a plurality of light-emitting diode elements 6 disposed on the high-heat-dissipation substrate 2; and a light-transmitting resin 7 that encapsulates the light-emitting diode elements 6.
Conventionally, a female connector is used as each of the external-connection terminals 4. By fitting a male connector (not shown) in the female connector, electric power is supplied from the outside to the light-emitting-diode elements 6 through the circuit pattern.
However, when a female connector is used as each of the external-connection terminals 4, its connection is made through engagement with a male connector, and therefore electrical reliability in a long-term use is problematic. Moreover, the above connectors may serve as an obstacle to miniaturization and thickness reduction and are also expensive.
In view of the above, it is conceivable that a lead wire is directly soldered and connected to the circuit pattern of the high-heat-dissipation substrate avoiding use of the conventional connectors. However, in this case, during the soldering of the lead wire to a circuit pattern disposed on a thin insulating layer disposed on the high-heat-dissipation substrate, necessary heat for soldering easily escapes to the metal plate constituting the high-heat-dissipation substrate, and therefore, an excessive amount of time is required to increase the temperature of the lead wire junction to the melting point of the solder. On the other hand, if the entire electronic-component-mounting board is heated in order to reduce the time required to increase the temperature of the lead wire junction to the melting point of the solder, other components such as the electronic-component are overheated and damaged.


A water based spray wax composition containing a microemulsion of a cationic wax nanoparticles, a quaternary silicone compound and zinc oxide nanoparticles providing long lasting protection of paint, glass, and metal, plastic, rubber, or elastomeric trim surfaces. The use of microemulsions or nanometer sized particles in the primary ingredients provides a transparent spray wax composition, which provides excellent coverage due to a significantly larger surface area, due to the nanoparticles used in the formulation. It also enables the wax particles to penetrate and fill small cracks and crevices for improved appearance, and durability of the spray wax properties. Because of their small size, nanometer sized particles do not reflect light which passes though the coating without any, or a minimal, amount of reflection resulting in a visual appearance of the liquid being transparent and eliminating hazing, streaking, and swirl marks associated with conventional spray wax products utilizing ingredients composed of conventional sized particles.

Spray waxes are used for the exterior protection and enhancement of automobiles, boats, planes, trucks, and other vehicles. Exposure of these materials to heat and light, especially in extreme environmental conditions such as the interior of an automobile can degrade and damage the material over time resulting in discoloration and fading of the material.
Spray wax products have been developed to coat the surface of these materials to minimize the degradation of the material due to environmental factors and provide a durable protection and shiny appearance. Problems occur when the products are sprayed onto a surface to be protected such as the trim on a car door or door handles and over spray results in a residue on the glass or plastic. Natural spray wax products typically utilize conventional wax emulsion products having a particle size typically around 2000 nanometers (0.2-100 □m) wherein hazing is observed during wax application and as a result uneven application. Alternatively, the product may be composed of a gel typically does not spray as easily in cold weather and may leave too thick of a coating on the surface resulting in streaking.

This patent is subject to a terminal disclaimer.

Ashland Licensing and Intellectual Property, LLC


A thermally conductive material, a donor element including the material, a method of printing using the donor element, and a print assembly including the donor element are described, wherein the thermally conductive material includes at least two immiscible or incompatible organic polymers, or a block or graft copolymer, wherein the constituent homopolymer repeat units that form the copolymer are prepared from chemical species that would form mutually immiscible or incompatible polymers, and thermally conductive particles having a short axis of less than or equal to 0.2 microns.

Thermal transfer systems have been developed to obtain prints from pictures that have been generated electronically, for example, from a color video camera or digital camera. An electronic picture can be subjected to color separation by color filters. The respective color-separated images can be converted into electrical signals. These signals can be operated on to produce cyan, magenta, and yellow electrical signals. These signals can be transmitted to a thermal printer. To obtain a print, a black, cyan, magenta, or yellow donor layer, for example, can be placed face-to-face with a dye image-receiving layer of a receiver element to form a print assembly, which can be inserted between a thermal print head and a platen roller. A thermal print head can be used to apply heat from the back of the donor sheet. The thermal print head can be heated up sequentially in response to the black, cyan, magenta, or yellow signals. The process can be repeated as needed to print all colors, and a laminate or protective layer, as desired. A color hard copy corresponding to the original picture can be obtained. Further details of this process and an apparatus for carrying it out are contained in U.S. Pat. No. 4,621,271 to Brownstein.
Thermal transfer works by transmitting heat through the donor from the back-side to the donor layer. When the colorant in the donor layer is heated sufficiently, it sublimes or diffuses, transferring to the adjacent dye-receiving layer of the receiver element. The density of the colorant forming the image on the receiver can be affected by the amount of colorant transferred, which in turn is affected by the amount of colorant in the dye donor layer, the heat the dye donor layer attains, and the length of time for which the heat is maintained at any given spot on the donor layer.
At high printing speeds, considered to be 2.0 msec/line or less, the print head undergoes heat on/off cycles very rapidly. This generated heat must be driven through the donor support assemblage very rapidly to affect the colorant transfer from the donor to the receiver. Each layer in the donor can act as an insulator, slowing down the heat transfer through the layers of the donor to the receiver. Because of the short heat application time, any reduction in heat transfer efficiency results in a lower effective temperature in the donor layer during printing, which can result in a lower transferred colorant density. It is known to overcome the low print density associated with shorter line times by increasing the printhead voltage, increasing the relative amount of colorant in the donor layer, or a combination thereof. Applying higher print head voltages can decrease the lifetime of the thermal print head, and requires a higher power supply, both of which increase cost. Increasing the relative amount of colorant in the donor layer increases costs, as well as increasing the chance of unwanted colorant transfer, such as during storage of a donor element, as well as increasing donor-receiver sticking during printing.
To increase the thermal flux through the donor element, it is known to add thermally conductive agents, such as metallic particles, graphite, or carbon black, that will increase thermal conductivity of the support, intermediate layers, and dye donor layers. Increasing the thermal conductivity in the direction perpendicular to the plane of the donor element allows more heat to transfer through the thickness of the donor element in less time, enabling the use of less heat, less time, or both, to print an image. However, it is critical to minimize the amount of thermally conductive agents added to these layers to minimize any adverse effects that they may have on the physical and optical properties of the layers, and to keep costs low.
U.S. Patent Application Publications Nos. 2005-0134656A1 to Gao and 2005-0137089A1 to Gao et al. disclose that a polymeric material including thermally conductive inorganic particles can be in a layer between the donor layer and the support, the support, a layer beneath the support, or a combination thereof, to increase thermal conductivity of the donor element.
EP 0909659 discloses a dye donor element that has a support comprising a low thermal conductivity matrix and a plurality of high thermal conductivity particles dispersed in the matrix. This provides high thermal conductivity perpendicular to the plane of the donor element, and low thermal conductivity parallel to the plane of the donor element. There is a significant increase in materials cost as well as manufacturing challenges associated with this approach because the support is much thicker than any of the other layers in the donor element.
U.S. Pat. No. 6,476,842 B1 discloses the use of carbon black as a thermally conductive material in layers of a thermal donor other than the donor layer. US Patent Application Publication US2003/021153A1 discloses the use of carbon black or metals as thermally conductive patches in the donor layer. The addition of carbon black or colored metallic particles, such as Au, Ag, Cu, Pd, Pt, Ni, and graphite, can add color to the thermal donor element. This is undesirable because color sensors are used in the thermal dye transfer printers to detect which color patch is in line to be printed. Often, the donor element will contain a plurality of black marking lines that are utilized by the printer for alignment and registration purposes. If the dye donor layers become too black, such as when metallic or carbon black particles are added, then the printer cannot distinguish the colorant patches from the registration marks.
U.S. Pat. No. 4,826,717 discloses a dye layer containing inorganic particles of the same size as, or larger than, the thickness of the dye layer, wherein the entire dye layer is transferred to the dye receiving layer upon printing. There is a problem with this in that the particle size is too large. The particles provide thermal transfer pathways through the dye layer directly through the particles without actually heating the dye/binder part of the dye layer, which is necessary to effect dye transfer.
There is a need in the art for a means of increasing thermal conductivity of a material, such as for use in a donor element, increasing transferred colorant density of a donor element, and increasing print speed of a donor element while 1) maintaining or increasing print density, such as by increased colorant transfer efficiency, 2) maintaining or reducing power to the print head, 3) maintaining or reducing manufacturing cost, and 4) maintaining the optical properties (color and transparency) and physical properties of the donor colorant patches.

Thermally conducive material and use in high-speed printing


An apparatus for sharing frequencies in an orthogonal frequency-division multiplexing OFDM-based wireless communication system, wherein the OFDM-based wireless communication system comprises a base station and a mobile device that work within a radio frequency band, the method comprising: detecting an interference signal in the radio frequency band; setting by the base station, based upon the interference signal, interference indication information in a control header of a downlink frame to be sent to the mobile device, the interference indication information indicating a frequency range that is occupied by the interference signal in the radio frequency band; and sending by the base station the downlink frame to the mobile device, such that the mobile device may, based upon the interference indication information, avoid the frequency range where the interference signal is located.

Radio spectrum is an important resource for wireless communication services. With the development of wireless communication wideband orientation, new technologies and new services such as WiMAX (Worldwide Interoperability for Microwave Access), LTE (Long Term Evolution), and UWB (Ultra-Wide Band) constantly emerge, and the demand on spectrum increases exponentially.
In reality, utilization of spectrum resources is imbalanced. On one hand, some unlicensed frequency bands have busy traffic and congested occupations; on the other hand, some licensed frequency bands, particularly low frequency bands that have better signal propagation features, have rather low spectrum utilization rate, and the spectrum resources are even wasted. Thus, it is quite significant to sufficiently utilize the spectrum resources and improve the spectrum resource utilization rate so as to relieve the supply-demand contradictions of spectrum resources and satisfy sustainable development of ever increasing wireless communication service applications.
One of the technologies for improving the spectrum resource utilization rate is a cognitive radio technology. The cognitive radio technology utilizes spectrum resources in a manner of opportunistic access. According to the cognitive radio technology, no spectrum resource is always occupied, while when a certain spectrum resource is not occupied, a radio communication device may take the "opportunity" to utilize this spectrum resource. In an Internet of Things (IOT) application, priority levels between mobile devices do not distinguish from one another; the opportunity for each mobile device in using a shared spectrum resource is equal; thus, adoption of the opportunistic access technology is particularly suitable for effectively utilizing the spectrum resources.

Sharing frequencies in an OFDM-based wireless communication system


An inkjet printer has a printhead mounted in a carriage which periodically moves in a carriage scan direction to a stop position in a service station where an actuation device causes a wiper blade to move back and forth across ink orifices on a nozzle surface of the printhead during a wiping operation. The actuation device incorporates a rotating lead screw to impart transtlational motion to the wiper blade in a wiping direction orthogonal to the carriage scan direction. A clutching action prevents further movement of the wiper blade after completion of each wiping step. The actuation device is driven through a gear train from a motor such as a media advance motor. An ink spittoon is incorporated in the same service station for receiving ink generated during a spitting operation, and a scraper in the ink spittoon removes residual ink from the wiper blade.

This application relates generally to inkjet printing, and more particularly to online service station functions of spitting ink into a spittoon, wiping ink orifices, capping an array of nozzles on a printhead, and priming inkjet cartridges.
Some prior color inkjet pen cartridges functioned somewhat satisfactorily with no wiping and minimal capping. Other prior monochrome/color inkjet cartridges used in single cartridge printers were wiped and capped with relatively simple mechanisms of the type shown in U.S. Pat. No. 4,583,717. Complex problems arose when trying to service different types of printheads on multiple ink cartridges mounted together in a print carrriage, particularly when the ink cartridges have different types of color/black inks.

Actuation mechanism for translational wiping of a stationary inkjet printhead


A display panel includes a first base substrate that includes an upper surface to which an external light is incident and a lower surface facing the upper surface and includes a plurality of pixel areas and a peripheral area adjacent to the pixel areas when viewed in a plan view, a plurality of pixels disposed on the lower surface of the first base substrate to respectively correspond to the pixel areas, and a black matrix layer disposed between the pixels and the lower surface of the first base substrate to overlap the peripheral area. The black matrix layer includes a low reflection layer disposed on the lower surface of the first base substrate and a light blocking layer disposed on the low reflection layer.

1. Field of Disclosure
The present disclosure relates to a display panel and a method of manufacturing the same. More particularly, the present disclosure relates to a display panel including a low reflection black matrix and a method of manufacturing the display panel.
2. Description of the Related Art
A flat panel display device has been developed to replace a cathode ray tube display device with thick thickness and high power consumption. As the flat panel display device, various display devices, such as an organic light emitting display device, a liquid crystal display device, a plasma display panel device, etc., are widely used.
Each display device includes pixels and signal lines to apply signals to the pixels. Each pixel includes a thin film transistor connected to a corresponding signal line of the signal lines.
Each pixel is driven in response to a data voltage provided through the corresponding signal line, and thus a desired image is displayed.


Hazardous compounds are chemically treated to remove various pollutants by subjecting the compounds (samples) to various process steps, including selecting specific solvents and using them, treating the sample at room temperature or below (30.degree. C. or lower); separating fatty acids mixed with heavy metal and semi-metal compounds as well as the separation of organic substances (including halogenated compounds) added to heavy metals and semi-metals; and using sodium nitrite and sodium 1-naphthylamine-4-sulfonate in combination from specific solvents, thereby in the sample, adsorbing and fixating halogen substances related to air pollution, coagulation resulting from the decomposition of fatty acids and the fixation of such compounds by quicklime and graphite and the stable fixation of heavy-metal oxide and semi-metal compounds using solvents having redox action and the formation of their complex salts and compounds, the above being accomplished by a continuous processing method.

1. Field of Invention
Methods for detoxifying and fixing environmental pollutants (compounds known as a source of environmental pollution) such as heavy metal compounds (Cu, Pb, Cr, Zn, Co), semi-metal compounds (P, As, Sb, Bi) and halogenated compounds.
2. Description of Prior Art
According to the current method for treating environmental pollution, the processing of pollutants can be completed by heat treatment at high temperatures to make heavy metal oxides and semi-metal oxides; yet no method is known to stably fix these oxides. Although some commentators say that those compounds are not environmentally hazardous when converted into oxides, it is clear that the compounds are not sufficiently treated for pollution just by being oxidized. Specific environmental pollutants such as heavy metal, semi-metal, and halogenated compounds are thus required to be completely neutralized/detoxified.
In order to deal with environmental pollution as set forth hereinabove, the following is required: (1) safe handling and treatment of potentially hazardous gaseous elements (halogen group) that are added to heavy metals and semi-metals; (2) safe fixing of heavy metals and semi-metals as well as the (organic) elements added to them; (3) safe handling and thermal treatment of secondary pollution in soil due to the dumping of heavy metals and semi-metals; and safe handling and secondary treatment of polluted colloidal substances primarily semi-metal compounds in polluted water.
Hazardous compounds known for environmental pollution such as heavy metal, semi-metal, and halogenated compounds, are in a state of secondary pollution in most cases. They exist in (1) colloidal sludge; (2) soil containing spread ash from an incinerator, especially in ash incompletely combusted; and (3) polluted soil and water that are dumped untreated. Therefore it is desired to provide a procedure for removing hazardous heavy metal and semi-metal compounds existing in the forms noted hereinabove.

Methods for neutralizing/detoxifying and stably fixing/solidifying hazardous compounds


A mobile workload deployment mechanism in a cloud computing environment determines when mobile devices are in proximity of a resource needed to process a mobile workload, and deploys the mobile workload to the mobile devices in proximity of the needed resource. Various methods performed by the mobile workload deployment mechanism account for the mobile nature of mobile devices, and how that mobility may affect the relocation, suspension, and other processing of the mobile workload.

1. Technical Field
This disclosure generally relates to mobile devices, and more specifically relates to using mobile devices in a cloud computing environment and deploying mobile workloads to the devices based on proximity of a resource.
2. Background Art
Cloud computing has become an area of emphasis for software and website providers. Cloud computing is a general term for presenting computation, software, data access, and storage services in a manner that the end-user has no knowledge of the physical location and configuration of the system that delivers the services. With the proliferation of mobile devices, it has been recognized in the prior art that mobile devices may exchange data with devices in the cloud. However, nothing in the prior art shows using mobile devices as compute elements in the cloud.
The mobile nature of mobile devices presents a unique challenge to incorporating mobile devices as compute members in the cloud, because movement of a mobile device may affect the ability of the mobile device to complete a task. For example, if an employee's mobile phone is used to run a task that requires access to the company's network, and if the employee then leaves for lunch, taking his or her mobile phone away from the company's network, the task will not complete. Thus, the unique nature of mobile devices requires deployment of workloads to mobile devices in ways not known in the prior art that account for the movement of mobile devices so the mobile devices can participate as compute members in a cloud computing environment.

Deployment of mobile workloads based on proximity