A method for operating a non-volatile memory device includes performing an erase operation onto a memory block including a plurality of memory cells, and performing a first soft program operation onto all the memory cells of a string, after the erase operation, grouping word lines of the string into a plurality of word line groups, and performing a second soft program operation onto memory cells coupled with the word lines of each word line group.

1. Field
Exemplary embodiments of the present invention relate to a method for operating a non-volatile memory device, and more particularly, to a method for operating a non-volatile memory device including an erase operation and a Soft program-On-Chip (SOC) operation.
2. Description of the Related Art
A non-volatile memory device is a memory device capable of retaining stored data although power is turned off.
A non-volatile memory device may perform a program operation, an erase operation, and a read operation. In particular, a NAND-type non-volatile memory device performs a program operation and an erase operation by injecting or discharging charges to or from a floating gate electrode through Fowler-Nordheim (F-N) tunneling. In a NAND-type non-volatile memory device, programmed memory cells have a positive (+) threshold voltage, and erased memory cells have a negative (−) threshold voltage. As the range of threshold voltage distribution is narrower, the operation characteristics of a memory device are improved.
Hereafter, a conventional non-volatile memory device and an operation method thereof are described with reference to the accompanying figures.
FIG. 1 illustrates a structure of a conventional non-volatile memory device.
Referring to FIG. 1, the non-volatile memory device includes a memory block 100, a block switch 110, a high-voltage switch 120, a bulk voltage generator 130, and a page buffer 140.
The memory block 100 includes a plurality of memory cells MC for storing data, a plurality of word lines WL0 to WLN that select and enable a memory cell MC, and a plurality of bit lines BL0 to BLM that output the data of the memory cells MC. The word lines WL0 to WLN are in parallel to each other, and the bit lines BL0 to BLM are in parallel to each other as well. The bit lines BL0 to BLM may cross the word lines WL0 to WLN. In the memory block 100, the memory cells MC are serially coupled between a source selection transistor SST and a drain selection transistor DST to form a string structure. One end of each string is coupled with a corresponding bit line BL0 to BLM, while the other end of the string is coupled with a common source line CSL in parallel. The gates of a plurality of drain selection transistors DST are coupled with a drain selection line DSL, and the gates of a plurality of source selection transistors SST are coupled with a source selection line SSL. Also, the gates of the memory cells MC are coupled with the word lines WL0 to WLN, and a set of memory cells coupled with the same word line is called a page.
The block switch 110 is selected by a selection signal SELb, and the block switch 110 may enable the high-voltage switch 120 by driving a node BLKWL into a high level based on the selection signal SELb.
The high-voltage switch 120 includes a plurality of high-voltage transistors SHT, HT and DHT, and the high-voltage switch 120 controls the connection between global word lines GWL0 to GWLN and local word lines WL0 to WLN according to the level of the node BLKWL. In particular, during an erase operation, the high-voltage switch 120 couples the global word lines GWL0 to GWLN that are coupled with a ground voltage with the local word lines WL0 to WLN to apply the ground voltage to the local word lines WL0 to WLN.
The bulk voltage generator 130 generates a bulk voltage VBK according to a program/erase/read operation and applies the generated bulk voltage VBK to a bulk of the memory block 100, for example, a P-well. In particular, during an erase operation, the bulk voltage generator 130 generates a high voltage and applies the generated high voltage to the bulk of the memory block 100. The high voltage applied to the bulk during an erase operation is referred to as an erase voltage.
The page buffer 140 includes a plurality of page buffer circuits (not shown). The page buffer 140 performs a program operation or a read operation by being coupled with a bit line BL. Further description of the structure and operation of the page buffer is omitted.
FIG. 2 is a flowchart describing a method for operating a conventional non-volatile memory device. Specifically, the figure describes an erase operation and a Soft program-On-Chip (SOC) operation.
First, when an erase command and an address that designates a target memory block 100 to be erased are inputted to a decoder in step S210, a corresponding block switch 110 is selected, and the high-voltage switch 120 is enabled to apply a ground voltage to all the word lines WL0 to WLN of the memory block 100 based on the output of the block switch 110.
Subsequently in step S220, an erase voltage is generated by the bulk voltage generator 130 and applied to the bulk of the memory block 100, and accordingly, the data stored in the memory cells MC of the corresponding memory block 100 are erased.
In step S230, the page buffer 140 performs a read operation and verifies whether the data of all the memory cells MC of the corresponding memory block 100 are erased.
If any of the data of the memory cells MC is not erased, the verification step determines that the erase operation was to be a failure, and the process of the step S220 is repeated.
Otherwise, when the data of all the memory cells MC are erased, more specifically, when the erase operation is decided to be a success, the erase operation ends and the method moves to step 240 to perform a Soft program-On-Chip (SOC) operation.
More specifically, when the erase operation ends, the SOC operation is performed in step S240 by applying a soft program voltage to the word lines WL0 to WLN while applying a ground voltage to the bulk of the memory block 100.
Subsequently in step S250, the SOC operation is verified based on an SOC verification voltage. More specifically, the SOC verification voltage is a negative voltage ranging from approximately −1V to approximately −2V. The SOC operation verification step determines whether there is a memory cell MC whose threshold voltage is equal to or exceeds the SOC verification voltage.
The SOC operation verification is performed for each string. If there is a memory cell whose threshold voltage is increased to the SOC verification voltage among the memory cells MC of a particular string, the string is decided to have succeeded in the SOC operation, and the string is referred to as a 'pass string.' Conversely, if there is no memory cell whose threshold voltage is equal to or exceeds the SOC verification voltage among the memory cells MC of a particular string, the string is decided to have failed in the SOC operation, and the string is referred to as a 'non-pass string.'
When the number of pass strings reaches a predetermined number X after performing the SOC operation verification onto all strings, the SOC operation is decided to be successful and the SOC operation is ended.
Conversely, when the number of pass strings does not reach a predetermined number X, the SOC operation is decided to have failed and the operation of the step S240 is repeated by increasing the SOC operation voltage. While performing the operation of the step S240 again, the threshold voltage of the memory cells of pass strings is prevented from being varied while the SOC operation voltage is applied by applying a bit line program prevention voltage, e.g., a power source voltage Vcc, to the bit lines coupled to the pass strings. On the other hand, the threshold voltage of the memory cells of the non-pass strings is increased while the SOC operation voltage is applied by applying a bit line program voltage, e.g., 0V, to the bit lines coupled to the non-pass strings.
FIG. 3 illustrates the effects of the method for operating the conventional non-volatile memory device.
Referring to FIG. 3, a curve E2 indicates the threshold voltage distribution of memory cells MC whose SOC operation ends and a curve E1 indicates the threshold voltage distribution of memory cells MC whose erase operation ends. The curve E2 is shifted to the right when compared with the curve E1. The shifting of curve E2 to the right signifies that the threshold voltage of the memory cells is raised through the SOC operation.
Other than increasing in the threshold voltage, the SOC operation decreases the range W1 of the threshold voltage distribution of memory cells, but only to a limited extent. The threshold voltage distribution after an SOC operation decreases only a limited amount because each of the memory cells has diverse characteristics, such as having different threshold voltage according to the position. Also, when the threshold voltage of any one cell among the memory cells MC reaches the verification voltage, the SOC operation ends.
As described above, when the range W1 of the threshold voltage distribution of the memory cells MC is wide, the range PV1, PV2 and PV3 of the threshold voltage distribution of the memory cells MC in the program state becomes wide as well. Accordingly, the margin between the levels is decreased in multi-level cells.

Method for operating non-volatile memory device


The masterbatch contains a black pigment and a masterbatch thermoplastic resin, the masterbatch satisfying the following conditions:

Conventional methods for obtaining a colored resin molded body include mixing a masterbatch containing a resin dispersed with pigments in advance and a resin as a material of the resin molded body to be colored, and thereafter molding the mixture. Such a masterbatch is manufactured by kneading pigments used for coloring and a resin which is the same as or different from the resin as a material of the resin molded body, together with various additives which are added as necessary.
For example, Patent Document 1 discloses a resin composition using a polyolefin resin, carbon nanotubes, and a specific wax. More specifically, Patent Document 1 discloses obtaining a jet-black tone having a bluish tint and a high degree of blackness by dispersing carbon nanotubes coated with a specific wax into a polyolefin resin.
Meanwhile, conventional resin molded bodies applied with three-dimensional processing sometimes have an impression deteriorated in quality of the outer appearance, thus lacking a sense of uniformity in color, due to an occurrence of a phenomenon of differences in tint, impression, aesthetic sense, and the like felt by a user due to changes in light reflection depending on the angle of view of the user. Bronzing is known as a cause of such a phenomenon.
As a method for evaluating bronzing, for example, Patent Document 2 discloses using a multi-angle spectrocolorimeter to obtain reflection intensity ratios at a baseline of 550 nm and a peak top of 650 nm at a light receiving angle with the highest reflectance in a red wavelength region, whereby, the lower the reflection intensity ratio, the more reduced the bronzing.
Further, Patent Document 3 discloses using a three-dimensional deflection angle spectrophotometric system to calculate chroma of a regular reflection light by irradiating a recorded image with light from a 45° direction and receiving the light at a position of 45° in the opposite direction, whereby bronzing is less conspicuous as the chroma of the regular reflection light is smaller. In addition, Patent Document 3 sets the chroma of the bronze color to C*=√(a*{circumflex over ( )}2+b*{circumflex over ( )}2).

Masterbatch, resin molding material, molded body, methods for manufacturing the masterbatch, the resin molding material, and the molded body, and method for evaluating masterbatch

Abstract: (Conditions)                when a resin plate is produced by kneading 100 parts by weight of polypropylene having a melt flow rate of 30 g/10 min (JIS K7210:1999) and a density of 0.9 g/cm3 (JIS K7112:1999) with respect to 3 parts by weight of the masterbatch and subjecting the mixture to injection molding using a mold polished by a coated abrasive with a particle size of #800 (JIS R6001:1998), a* values and b* values of a surface of the resin plate in the L*a*b* color system satisfy specific conditions.


A wind turbine with a sensor that measures the out-of-plane deflection of the blades and a controller that uses the signal from the sensor to determine the risk of a tower strike. The controller takes any necessary action to prevent a tower strike when it determines that the risk of a strike is high. The sensor can include strain gages or accelerometers mounted on the blades or it can include a fixed sensor mounted on the side of the tower to measure tower clearance as the blade passes by. The control action taken can include pitching blades, yawing the nacelle, or stopping the turbine. The controller is preferably a fuzzy logic controller.

This invention relates to a control system for wind turbines and particularly to a control system that limits blade deflection to avoid tower strikes.
Wind turbines have long been used to generate electricity from the wind. The most common type of wind turbine is the horizontal axis turbine. Horizontal axis wind turbines have one or more blades (but most commonly 2 or 3 blades) attached to a shaft that rotates about a horizontal axis. On the opposite end of the shaft from the blades is a gearbox and generator. When wind passes over the blades, the shaft rotates and the generator makes electricity. Such wind turbines have been extensively used in California for the past 20 years and are being installed in large numbers all around the world.
One of the primary concerns in the design of a wind turbine is the cost of energy. In order to keep the cost of energy low the turbine must be rugged and reliable and have a low maintenance cost. Wind turbine manufacturers have improved the cost of energy by increasing the size of their wind turbines. Over the past 20 years, wind turbines on the commercial market have increased from approximately 50 kW in the early 1980s to nearly 2 MW today. As the turbine size and blade length increase, blade deflection becomes a more important issue. Some large wind turbines have been known to experience tower strikes in which a blade deflects to the point that it strikes the tower and is destroyed. Furthermore, many wind turbine manufacturers are reducing the cost of their wind turbines by making the blades lighter weight. This results in a more flexible blade and exacerbates the tower strike issue. Several wind turbine designs, such as those described in U.S. Pat. Nos. 4,352,629, 6,327,957 and 5,584,655 (all of which are incorporated herein by reference) describe highly flexible wind turbine blades. These highly flexible designs may become more common in the future as turbine designers strive to reduce the cost of energy even further. For flexible wind turbine blades to be successful on a large wind turbine, it is necessary to have a system to prevent tower strikes.

Wind turbine blade deflection control system


A portable enclosure for the placement of wet articles for storage and at least partial drying. The enclosure includes a rigid plastic frame including an article hanger enclosed by a housing with a top, bottom and sides. At least three of the sides and the top are at least partially formed of a mesh material and at least the bottom is impervious. An exteriorly extending adjustable length strap with Velcro type closure means attached to the frame can be looped over an external support to support the enclosure and contents. A container is located in the bottom of the housing to catch any liquid dripping from the wet articles to contain the dripping within the housing. A zippered opening in one wall is provided for selected entry into the interior of the housing.

1. Field of Invention
This invention relates to a portable enclosure, self-contained to allow placement of wet articles so that they may drain and dry within.
2. Description of Prior Art
I myself and everyone that I have talked to about the field of invention know of nothing of its kind.

Portable enclosure - self-contained for wet articles


A belt unit includes: a pair of roller members spaced from and opposing each other in a first direction, each of the roller members having an axis extending in a second direction; an endless belt extending around the roller members; a plurality of transfer members arranged along the first direction between the roller members and spaced from one another so as to be enclosed by the endless belt; and a frame that rotatably supports the roller members and the transfer members. The frame includes: a pair of resin side frames spaced from each other in the second direction, each of the resin side frames extending in the first direction; and a resin bridging beam extending between the side frames.

A so-called tandem color laser printer includes a plurality of photosensitive drums which correspond to respective colors, e.g., yellow, magenta, cyan, and black, and which are arranged in tandem side by side in a horizontal direction.
The tandem color laser printer includes a transfer unit disposed opposing the photosensitive drums and configured to transfer toner images formed on the photosensitive drums to a sheet during a conveyance of the sheet.
For example, the transfer unit is provided with a housing formed of metal plate that is disposed within a conveyor belt extending between a drive roller and a driven roller, and the housing holds transfer rollers opposing respective photosensitive drums.


A voltage regulator has an output circuit for producing from an input voltage a predetermined output voltage to be supplied to a load, an overcurrent protection circuit for preventing overcurrent in the output circuit, a memory for storing control information fed from outside, and an adjustment circuit for adjusting the level at which the overcurrent protection circuit detects overcurrent according to the control information read from the memory. With this configuration, it is possible to accurately detect overcurrent by canceling factors such as individual variations in the characteristics of the circuit components, the influence of stress occurring when the regulator IC is packaged, and fabrication-associated variations in the load.

1. Field of the Invention
The present invention relates to a voltage regulator that produces from an input voltage a predetermined output voltage to be supplied to a load, and relates particularly to the optimization of an overcurrent protect circuit incorporated in such a voltage regulator.
2. Description of the Prior Art
FIG. 3 is a circuit diagram showing an example of the configuration of a conventional voltage regulator. The conventional regulator IC 1′ shown in this figure is built by sealing into a single package an output circuit (a P-channel MOS transistor P1, an operational amplifier OP1, a direct-current voltage source E1, and resistors R1 and R2) for producing from an input voltage Vi a predetermined output voltage Vo to be supplied to a load Z1 and an overcurrent protection circuit (a P-channel MOS transistor P2, a resistor R3, and an N-channel MOS transistor N1) for preventing overcurrent in the output circuit.
It is true that, in the regulator IC 1′ configured as described above, the predetermined output voltage Vo produced from the input voltage Vi is supplied to the load Z1 connected externally to the output terminal of the regulator IC 1′. Moreover, the overcurrent protection circuit prevents the output current Io from reaching the capacity limit of the transistor P1 even when, as immediately after electric power starts being supplied to the regulator IC 1′, the output current Io flows at a dash into a bypass capacitor C1.
However, in the conventional regulator IC 1′, the level at which the overcurrent protection circuit detects overcurrent is fixed at the time of the fabrication of the circuit. This makes it impossible to cancel factors such as individual variations in the characteristics of the circuit components, the influence of stress occurring when the regulator IC 1′ is packaged or mounted on a circuit board, and fabrication-associated variations in the load Z1 connected to the regulator IC 1′.
Thus, in the conventional regulator IC 1′, the level at which to detect overcurrent is set rather high (generally 1.5 times or more as high as the upper limit of the actually used range of the output current Io, see FIG. 4) with a margin secured so that the level at which to detect overcurrent does not happen to be lower than the upper limit of the actually used range of the output current Io.
As a result, with the overcurrent protection circuit mentioned above, it is possible to prevent the output current lo from reaching the capacity limit of the transistor P1 when, as immediately after electric power starts being-supplied to the regulator IC 1′, the output current Io flows at a dash into the bypass capacitor C1, but this is achieved at the cost of unnecessarily great power loss as indicated by hatching in FIG. 4.
Moreover, in anticipation of such power loss, the regulator IC 1′ needs to be supplied with electric power from a power supply device with a rather high power supply capacity. This increases the size and cost of the power supply device.
Incidentally, there is available a regulator IC (not shown) having a sense resistor, for detecting the output current, connected outside the IC so that overcurrent is prevented on the basis of the voltage across the sense resistor. With this type of regulator IC, by setting the resistance of the sense resistor appropriately, it is possible to vary the level at which to detect overcurrent. This apparently helps solve the problem described above. In reality, however, the sense resistor has a very low resistance, and thus tends to be influenced by variations in connection resistances and other factors. Thus, the sense resistor is difficult to match with the circuit components within the IC. This makes it extremely difficult to satisfactorily correct for a variation in the level at which to detect overcurrent.
As a result, even in the regulator IC configured as described above, the level at which to detect overcurrent needs to be set rather high with a margin secured so that the level at which to detect overcurrent does not happen to be lower than the upper limit of the actually used range of the output current. Thus, it is not possible to satisfactorily solve the problem described above. In addition, the sense resistor, connected externally, hampers the scaling-down and cost reduction of the appliance incorporating the regulator IC.


Apparatus for providing an analog drive transistor control signal to the gate electrode of a drive transistor in a drive circuit that applies current to an EL device, the drive circuit including a first supply electrode of the drive transistor and the EL device connected to a second supply electrode of the drive transistor, comprising a measuring circuit for measuring the current passing through the supply electrodes at different times to provide an aging signal representing variations in the characteristics of the drive transistor and EL device caused by operation of the drive transistor and EL device over time; a compensator for changing a linear code value in response to the aging signal to compensate for the variations in the characteristics of the drive transistor and EL device; and a linear source driver for producing the analog drive transistor control signal in response to the changed linear code value.

Flat-panel displays are of great interest as information displays for computing, entertainment, and communications. Electroluminescent (EL) flat-panel display technologies, such as organic light-emitting diode (OLED) technology provides benefits in color gamut, luminance, and power consumption over other technologies such as liquid-crystal display (LCD) and plasma display panel (PDP). However, EL displays suffer from performance degradation over time. In order to provide a high-quality image over the life of the display, this degradation must be compensated for.
EL displays typically comprise an array of identical subpixels. Each subpixel comprises a drive transistor (typically thin-film, a TFT) and an EL device, the organic diode that actually emits light. The light output of an EL device is roughly proportional to the current through the device, so the drive transistor is typically configured as a voltage-controlled current source responsive to a gate-to-source voltage Vgs. Source drivers similar to those used in LCD displays provide the control voltages to the drive transistors. Source drivers convert a desired code value step 74 into an analog voltage step 75 to control a drive transistor. The relationship between code value and voltage is typically non-linear, although linear source drivers with higher bit depths are becoming available. Although the nonlinear code value-to-voltage relationship has a different shape for OLEDs than the characteristic LCD S-shape (shown in e.g. U.S. Pat. No. 4,896,947), the source driver electronics required are very similar between the two technologies. In addition to the similarity between LCD and EL source drivers, LCD displays and EL displays are typically manufactured on the same substrate: amorphous silicon (a-Si), as taught e.g. by Tanaka et al. in U.S. Pat. No. 5,034,340. Amorphous Si is inexpensive and easy to process into large displays.
Degradation Modes
Amorphous silicon, however, is metastable: over time, as voltage bias is applied to the gate of an a-Si TFT, its threshold voltage (Vth) shifts, thus shifting its I-V curve (Kagan & Andry, ed. Thin-film Transistors. New York: Marcel Dekker, 2003. Sec. 3.5, pp. 121-131). Vth typically increases over time under forward bias, so over time, Vth shift will, on average, cause a display to dim.
In addition to a-Si TFT instability, modern EL devices have their own instabilities. For example, in OLED devices, over time, as current passes through an OLED device, its forward voltage (Voled) increases and its efficiency (typically measured in cd/A) decreases (Shinar, ed. Organic Light-Emitting Devices: a survey. New York: Springer-Verlag, 2004. Sec. 3.4, pp. 95-97). The loss of efficiency causes a display to dim on average over time, even when driven with a constant current. Additionally, in typical OLED display configurations, the OLED is attached to the source of the drive transistor. In this configuration, increases in Voled will increase the source voltage of the transistor, lowering Vgs and thus, the current through the OLED device (Ioled), and therefore causing dimming over time.
These three effects (Vth shift, OLED efficiency loss, and Voled rise) cause each individual OLED subpixel to lose luminance over time at a rate proportional to the current passing through that OLED device. (Vth shift is the primary effect, Voled shift the secondary effect, and OLED efficiency loss the tertiary effect.) Therefore, as the display dims over time, those subpixels that are driven with more current will fade faster. This differential aging causes objectionable visible burn-in on displays. Differential aging is an increasing problem today as, for example, more and more broadcasters continuously superimpose their logos over their content in a fixed location. Typically, a logo is brighter than content around it, so the pixels in the logo age faster than the surrounding content, making a negative copy of the logo visible when watching content not containing the logo. Since logos typically contain high-spatial-frequency content (e.g. the AT&T globe), one subpixel can be heavily aged while an adjacent subpixel is only lightly aged. Therefore, each subpixel must be independently compensated for aging to eliminate objectionable visible burn-in.
Prior Art
It has been known to compensate for one or more of these three effects. Considering Vth shift, the primary effect and one which is reversible with applied bias (Mohan et al., "Stability issues in digital circuits in amorphous silicon technology," Electrical and Computer Engineering, 2001, Vol. 1, pp. 583-588), compensation schemes are generally divided into four groups: in-pixel compensation, in-pixel measurement, in-panel measurement, and reverse bias.
In-pixel Vth compensation schemes add additional circuitry to each subpixel to compensate for the Vth shift as it happens. For example, Lee et al., in "A New a-Si:H TFT Pixel Design Compensating Threshold Voltage Degradation of TFT and OLED", SID 2004 Digest, pp. 264-274, teach a seven-transistor, one-capacitor (7T1C) subpixel circuit which compensates for Vth shift by storing the Vth of each subpixel on that subpixel's storage capacitor before applying the desired data voltage. Methods such as this compensate for Vth shift, but they cannot compensate for Voled rise or OLED efficiency loss. These methods require increased subpixel complexity and increased subpixel electronics size compared to the conventional 2T1C voltage-drive subpixel circuit. Increased subpixel complexity reduces yield, because the finer features required are more vulnerable to fabrication errors. Particularly in typical bottom-emitting configurations, increased total size of the subpixel electronics increases power consumption because it reduces the aperture ratio, the percentage of each subpixel which emits light. Light emission of an OLED is proportional to area at a fixed current, so an OLED device with a smaller aperture ratio requires more current to produce the same luminance as an OLED with a larger aperture ratio. Additionally, higher currents in smaller areas increase current density in the OLED device, which accelerates Voled rise and OLED efficiency loss.
In-pixel measurement Vth compensation schemes add additional circuitry to each subpixel to allow values representative of Vth shift to be measured. Off-panel circuitry then processes the measurements and adjusts the drive of each subpixel to compensate for Vth shift. For example, Nathan et al., in US 2006/0273997(A1), teach a four-transistor pixel circuit which allows TFT degradation data to be measured as either current under given voltage conditions or voltage under given current conditions. Nara et al., in U.S. Pat. No. 7,199,602, teach adding an inspection interconnect to a display, and adding a switching transistor to each pixel of the display to connect it to the inspection interconnect. Kimura et al., in U.S. Pat. No. 6,518,962, teach adding correction TFTs to each pixel of a display to compensate for EL degradation. These methods share the disadvantages of in-pixel Vth compensation schemes, but some can additionally compensate for Voled shift or OLED efficiency loss.
Reverse-bias Vth compensation schemes use some form of reverse voltage bias to shift Vth back to some starting point. These methods cannot compensate for Voled rise or OLED efficiency loss. For example, Lo et al., in U.S. Pat. No. 7,116,058, teach modulating the reference voltage of the storage capacitor in an active-matrix pixel circuit to reverse-bias the drive transistor between each frame. Applying reverse-bias within or between frames prevents visible artifacts, but reduces duty cycle and thus peak brightness. Reverse-bias methods can compensate for the average Vth shift of the panel with less increase in power consumption than in-pixel compensation methods, but they require more complicated external power supplies, can require additional pixel circuitry or signal lines, and may not compensate individual subpixels that are more heavily faded than others.
Considering Voled shift and OLED efficiency loss, U.S. Pat. No. 6,995,519 by Arnold et al. is one example of a method that compensates for aging of an OLED device. This method assumes that the entire change in device luminance is caused by changes in the OLED emitter. However, when the drive transistors in the circuit are formed from a-Si, this assumption is not valid, as the threshold voltage of the transistors also changes with use. The method of Arnold will thus not provide complete compensation for subpixel aging in circuits wherein transistors show aging effects. Additionally, when methods such as reverse bias are used to mitigate a-Si transistor threshold voltage shifts, compensation of OLED efficiency loss can become unreliable without appropriate tracking/prediction of reverse bias effects, or a direct measurement of the OLED voltage change or transistor threshold voltage change.
Alternative methods for compensation measure the light output of each subpixel directly, as taught e.g. by Young et al. in U.S. Pat. No. 6,489,631. Such methods can compensate for changes in all three aging factors, but require either a very high-precision external light sensor, or integrated light sensors in each subpixel. An external light sensor adds to the cost and complexity of a device, while integrated light sensors increase subpixel complexity and electronics size, with attendant performance reductions.
Existing Vth compensation schemes are not without drawbacks, and few of them compensate for Voled rise or OLED efficiency loss. Those that compensate each subpixel for Vth shift do so at the cost of panel complexity and lower yield. There is a continuing need, therefore, for improving compensation to overcome these objections to compensate for EL panel degradation and prevent objectionable visible burn-in over the entire lifetime of an EL display panel.

Electroluminescent display compensated analog transistor drive signal


A magnifying projecting lens has a negative first lens group, a positive second lens group and a positive third lens group that is arranged in this order from a magnifying side. The lens groups are arranged so as to satisfy the following condition: EQU fb/f>1.7,. wherein. fb equals a back focus when an object distance is .infin. PA0 f equals a focal length of the lens.

1. Field of the Invention
The present invention relates to a magnifying projecting lens which is used in a projector, such as a liquid crystal projector, and more specifically to a projecting lens which requires a long back focus; that is a distance between a surface to-be-projected and the projecting lens.
2. Description of the Prior Art
FIGS. 54 and 55 show optical systems of this kind of projector.
In the optical system shown in FIG. 54, a light beam W emitted from a light source is separated into color components of R(red), G(green) and B(blue) by a dichroic mirror 2. Each component is made incident onto a liquid crystal light bulb 4 after being reflected by a mirror 3. The light beam components R, G and B passing through the liquid crystal light bulbs 4, 4, . . . are overlaped by a dichroic prism 5 and projected onto a screen 7 through a projecting lens 6.
However, the dichroic prism 5 is expensive because the prism requires high accuracy to finish and cement. In general, the method with the dichroic mirror shown in FIG. 55 is put into practice.
In this method, at least two dichroic mirrors are disposed in different positions to make the light beam components R, G and B overlap. A distance between the liquid crystal light bulb 4 and the projecting lens 6 becomes long, to make sure of the space for these dichroic mirrors 8; that is the projecting lens 6 requires a long back focus.
The easiest method to make a back focus of a lens long is to make a focal length of the lens long. However, when the focal length becomes long, the distance between the projecting lens and the screen becomes long. In particular, it is not desirable for a box type projector for projecting from the backside of the screen, because a depth of the projector becomes large even if the optical path is turned.
A retro focus lens has a long back focus in comparison with the focal length. However, the retro focus lens is composed of many pieces and is expensive.


Composite tube assemblies and thin-walled tubing are disclosed. In embodiments, the composite tube assemblies include a functional tube and a sacrificial tube disposed within or around the functional tube. The sacrificial tube may be removed by exposure to a corrosive media, without substantially affecting the functional tube. Methods of forming composite tube assemblies and thin-walled tubing are also described.

Interest has grown in the development of light weight, high flux heat exchangers for various applications. For example, single stage reusable near space air breathing flight vehicles that include light weight, high flux heat exchangers have been proposed for use in low cost manned space flight operations, e.g., to cool hot (e.g., ˜1000° C.) inlet air at speeds of Mach 5 or higher. Proposed heat exchangers for such purposes are constructed using small diameter (e.g., 1 millimeter (mm) (˜0.040 inch) Outside Diameter (OD)), very thin wall (e.g., 25 micron (μm) (0.001 inch)) superalloy tubes.
The dimensions and operating parameters required for such tubes present a variety of tube making challenges. For example, tube drawing of small diameter tubes generally requires highly specialized tube making skill and/or apparatus, even at relatively traditionally tube wall thicknesses (e.g., 75-250 μm (0.003 to 0.010 inch). As the tube wall thickness decreases below 75 μm (e.g., towards 25 μm), tube drawing often results in undesirable through-the-wall defects. Forming small diameter tubes by tube drawing long lengths using conventional lubrication and degreasing practices can also result in carbon or nitrogen contamination of the material used to form the tube—which may be undesirable for some applications.
Several methods exist for producing small diameter, thin-wall tubing, but are not without challenges. For example, bench drawing may be used to form small diameter, thin-wall tubing meeting the above noted specifications. However, the cost of bench drawing such tubing may be high, the production capacity may be limited, tube lengths are limited, and use of that process may entail significant scrap loss.
Small diameter, thin-wall tubing may also be made by coil drawing using a coil welding and tube sinking (drawing without internal diameter support) process. The product produced by such a process may suffer from through the wall defects, however, both at and away from the weld. It may also be difficult to use some materials (e.g., superalloys) in such a method, and the product may exhibit a rough surface with longitudinal defects.

Composite tube with a sacrificial layer for very thin wall heat exchangers


A circuit board, associated assembly, and method of manufacture. The circuit board comprises an elongated groove, extending into the circuit board, for accommodating a footing of a large component such as an RF shield. The groove allows solder paste to be deposited therein via a stencil, to a depth greater than the stencil thickness. Thus the same stencil can be used for depositing solder paste for both small and large components.

Printed circuit boards allow for reliable and cost-effective production of electronic devices. A common technique for populating printed circuit boards with components, for example surface-mount components, involves applying solder paste to desired areas of a printed circuit board through a specially configured stencil. The components are then pressed into the solder paste, and the populated circuit board is passed through an oven to reflow the solder paste.
Some printed circuit assemblies call for a mixture of different sized components, such as small or fine-pitched component leads alongside components with large leads or a large footing to be attached to the circuit board. This situation arises, for example, when a radiofrequency (RF) shield is used to isolate other electronic components. The RF shield is the large component, while the other electronics are configured to be placed on the circuit board underneath the RF shield and are hence smaller.
However, providing an appropriate amount of accurately placed solder paste for both large and small components presents a challenge. For example, a thinner stencil is generally conducive for applying solder paste for smaller components, whereas a thicker stencil is generally conducive for applying solder paste for larger components. Previous solutions to this problem include using multiple stencils with multiple rounds of solder paste application, and using specialized "step" stencils having variable thickness. This can introduce cost and complexity into the manufacturing process, and can reduce quality yields in the finished product.
It will be noted that throughout the appended drawings, like features are identified by like reference numerals.

Grooved circuit board accommodating mixed-size components


The method describes the operation of a roller blind including a moving element that can be operated via an actuator and a handheld-type remote control used to set the value of an operating parameter of the system, the value of this parameter being modifiable between two limit values. In this method, after a modification of the setting of the parameter value, an acknowledgement signal is sent, the acknowledgement signals differing according to whether the parameter value is or is not a limit value.

The invention relates to an operating method for a motorized system for closure, privacy, solar protection or screening, comprising a moving element that can be operated via an actuator and a handheld-type remote control used to set the value of an operating parameter of the system, the value of this parameter being modifiable between two limit values. It also relates to a motorized system operating according to this method.
The adjusting of setting parameters required to correctly operate systems for closure, privacy, solar protection or screening, such as, for example, a garage door, a roller blind or an awning, is a recurrent topic associated with the motorization of these systems.
These parameters to be determined are in particular the force applied on an obstacle, the obstacle detection sensitivity and the stress-relieving time.
There are, indeed, very strict standards defining the conditions in which the system must be able to detect an obstacle and react accordingly. Also, it is important to protect the closure system against repeated mechanical stresses.

Operating method for a motorized roller blind


An insert is provided for the hollow interior of a trick tool box including one or more rails having mounting structure for supporting bins, trays, tool racks, tool holders, hooks, pegs and other means for storing items within the box interior.

One of the most popular accessories for trucks and recreational vehicles is a truck box used to store and secure a variety of tools and other items in the bed of the vehicles. There are a number of different types of truck boxes, including cross-over boxes, side mount boxes, chest boxes, top mount boxes, RV boxes and others. Each truck box is typically formed of aluminum tread plate, and comprises a front wall, a back wall, a bottom wall and opposed end walls which are interconnected to define a hollow interior. The truck box interior is closed by a top lid that is pivotal on one or more hinges, usually with the assistance of gas springs. In many truck box designs, latch mechanisms connected by an operating rod are provided to maintain the top lid in a closed and locked position to secure the contents of the box. The latch mechanisms and operating rod may be protected from damage by a rail located along the front wall of the box.
Depending upon the types of tools or other items to be stored in the box, it is advantageous to provide separate storage areas within the box interior. This has been achieved in past designs by providing the box with drawers, shelves, compartments defined by vertically extending panels and similar structures. Drawers and shelves typically extend across the entire width of the box, e.g. from the front wall to the back wall, and may also span the length of the box between the opposed end walls. The compartments noted above may be formed by inserting panels into vertical slots formed in the front and back walls of the box, such as shown in U.S. Pat. No. 6,634,691, but like the drawers and shelves such compartments extend all the way across the width of the box. Very little flexibility is provided in the way interior space within the box may be arranged in such designs, which can create difficulties for those who have different types and sizes of items to be stored.


DNT-Oxal crystalline forms and processes for making DNT-Oxal crystalline forms are provided.

Duloxetine is a dual reuptake inhibitor of the neurotransmitters serotonin and norepinephrine. It has been found to be useful in the treatment of stress urinary incontinence (SUI), depression, and pain management. The primary raw material in the synthesis of duloxetine is (S)-(+)-N,N-Dimethyl-3-(1-naphthalenyloxy)-3-(2-thienyl)propanamine oxalate (DNT-Oxal).
The preparation of DNT-Oxal is described in European Patent Application No. EP 457,559 A3 and International Patent Application Publication WO 2004/056,795 A, as well as in Deeter, J. et al, Tetrahedron Lett., 1990, 31, 7101. However, Deeter et al. fail to describe the procedure accurately, and do not disclose any crystalline form of DNT-Oxal.
Polymorphism, the occurrence of different crystal forms, is a property of some molecules and molecular complexes. A single molecule, such as DNT-Oxal, may give rise to a variety of crystalline forms having distinct crystal structures and physical properties, such as melting point, x-ray diffraction pattern, infrared absorption fingerprint, and solid state NMR spectrum. One crystalline form may give rise to thermal behavior different from that of another crystalline form. Thermal behavior can be measured in the laboratory by such techniques as capillary melting point, thermogravimetric analysis ("TGA"), and differential scanning calorimetry ("DSC"), which have been used to distinguish polymorphic forms.
The difference in the physical properties of different crystalline forms results from the orientation and intermolecular interactions of adjacent molecules or complexes in the bulk solid. Accordingly, polymorphs are distinct solids, sharing the same molecular formula, yet having distinct advantageous physical properties compared to other crystalline forms of the same compound or complex.
One of the most important physical properties of pharmaceutical compounds is their solubility in aqueous solution, particularly their solubility in the gastric juices of a patient. For example, where absorption through the gastrointestinal tract is slow, it is often desirable for a drug that is unstable to conditions in the patient's stomach or intestine to dissolve slowly, so that it does not accumulate in a deleterious environment. Different crystalline forms or polymorphs of the same pharmaceutical compounds can and reportedly do have different aqueous solubilities.
The discovery of new polymorphic forms of a pharmaceutically useful compound provides a new opportunity to improve the performance characteristics of a pharmaceutical product. It enlarges the repertoire of materials that a formulation scientist has available for designing, for example, a pharmaceutical dosage form of a drug with a targeted release profile or other desired characteristic.
There is a need in the art for the discovery of new forms of DNT-Oxal and/or processes for their preparation.

Crystal forms of (S)-(+)-N,N-dimethyl-3-(1-naphthalenyloxy)-3-(2-thienyl)propanamine oxalate and the preparation thereof


A spring cluster disc (14) for a foil thrust bearing (10) is provided with a plurality of sets (52) of springs (62,64,66). The springs are configured to provide varying spring force and thus varying stiffness in radial and circumferential directions.

The load capacity of a foil thrust bearing depends on the compliance of the bearing with pressure exerted by a fluid film developed between the bearing and the runner. The pressure profile for a thrust bearing varies, and in order to accommodate the optimal pressure profile and attendant fluid film thickness associated with maximum load capacity, the thrust bearing should be designed to provide stiffness which varies in a manner similar to the pressure profile.
Current foil thrust bearings have limited load capacity, and this limitation results from spring designs which indicate only a limited appreciation for variance in pressure profile and its effect on load capacity.
A typical spring design is illustrated in FIGS. 2-6 of U.S. Pat. No. 4,668,106 Gu. While such spring designs provide varying stiffness in radial directions, they provide limited load capacity because of excess pad deflection over the spring support points. The excessive pad deflection leads to a divergent fluid film at the trailing edge of the pad and prevents the bearing from developing an optimal pressure profile. Thus, the advantages associated with providing varying stiffness in both radial and circumferential directions has gone unrecognized.
An objective of this invention is to provide foil thrust bearings with stiffness variation in both radial and circumferential directions.
A further objective of the invention is to provide such stiffness variation in a manner which approximates pressure profiles in both radial and circumferential directions.
Concomitant objectives of the invention are to extend the range of potential applications for foil bearings, and to enable the use of smaller foil bearings in a given application.

Foil thrust bearing with varying radial and circumferential stiffness


The present invention relates to mixtures comprising at least one polyester precursor and at least one alkali- and/or alkaline-earth metal salt where the mixture contains at least one phosphonic acid ester of the Formula (I)(RO)OC—R′—PO(OR)2  (I)where independently R represents a group with 1 to 60 carbon atoms and R′ represents a group with 1 to 20 carbon atoms. Furthermore, the present invention relates to the polyester compositions which can be produced from the mixtures and to the resulting polyester films.

1. Field of the Invention
The present invention relates to mixtures, polyester compositions, films and procedures for their manufacture.
2. Description of Related Art
Aromatic polyesters such as, for example, polyethylene-terephthalate are synthetic materials widely known in the plastics industry which are used, amongst other applications, for the manufacture of films. The economic importance of these synthetic materials requires the use of the most cost-beneficial procedure possible for their preparation. In order to increase the speed of manufacture of the films a procedure is often used which involves the polyester melt carrying an electrostatic charge. This requires that the polyester melt possesses the lowest possible level of specific resistance to achieve a high product quality. This is often achieved by adding metal salts to the melt. For example, EP 1 213 123 describes the influence of different metallic salts upon the product quality of extruded films.
These polyester films have the disadvantage that the synthetic material suffers from low stability. To improve this level of stability phosphorus compounds are most frequently employed. If conventional phosphoric acid derivatives are used, turbidity develops which is disadvantageous for the optical appearance of the films.
Polyesters are known from EP 0 403 664 which contain phosphonium compounds in addition to alkali- and alkaline-earth metal salts. These films exhibit a high degree of transparency. Furthermore, these films possess high thermal stability and they can be produced at a high speed when manufactured by the above-mentioned procedure. There is, however, a disadvantage in that phosphonium compounds are often injurious to health and are able to migrate out of the film. Furthermore, phosphonium compounds are very expensive.
Generally speaking, it is necessary that all the phosphorus compounds used for the application in question be granted FDA—(Food and Drugs Administration) approval.
Beyond this, the publication "Improved Electrostatic Pinning Using a Biased, Conductive Shield" by M C Zaretsky, J E Benson, in the Journal of Electrostatics, 40 & 41 (1997) 735-740) describes the extrusion characteristics of compositions which in addition to metal salts also contain the phosphorus compounds described in the document EP 0 403 664.

Mixture, polyester composition, film and procedures for their manufacture


An ink-jet head has a plurality of nozzle groups which respectively jet inks of a plurality of colors. Each nozzle group has a high density portion of small nozzle interval and two low density portions of larger nozzle interval than the high density portion. The high density portion is positioned between the low density portions. Because in accompaniment with a reciprocating movement of the ink-jet head, an intermediate area, in which inks from the two low density portions land in a mixed manner, is formed between two areas, in which inks from the high density portion land, color banding is made inconspicuous and lowering of the printing quality due to differences in color can be suppressed.

1. Field of the Invention
The present invention relates to an ink-jet printer and an ink-jet head which jet inks onto a recording medium.
2. Description of the Related Art
As a color ink-jet printer which jets a plurality of color inks onto a recording medium such as a recording paper to record a color image and/or letter onto the recording medium, there is widely known an ink-jet printer having a construction in which a serial-type ink-jet head which jets a plurality of color inks from nozzles while moving in a direction (scanning direction) orthogonal to a feeding direction of the recording paper or the like. For example, an ink-jet head described in Japanese Patent Application Laid-open No. 2003-220705 has four cavity plates each of which has a cavity for jetting one of four color inks (cyan (C), magenta (M), yellow (Y), and black (K)), and in each of the cavity plates has two nozzle rows formed therein, each rows having a plurality of nozzles arranged in the feeding direction. The four cavity plates are positioned so as to be aligned in the scanning direction. Thus, as shown in FIG. 19A for example, when three kinds of nozzle groups 201 which jet three color inks respectively, are positioned in the order of cyan (201C), magenta (201M), and yellow (201Y) from the left, and when an ink-jet head 200 moves to the right, the three color inks (IC, IM, and IY) land on the recording paper in the order of Y (yellow), then to M (magenta), and then to C (cyan) (Y-M-C order), thereby forming a dot as shown in FIG. 18B.


A hydraulic assisted steering mechanism for marine propulsion drive wherein the hydraulic assist is operated by a control valve having its valve element actuated by a wire actuator that is operated by the steering mechanism. The actuating element that interconnects the wire actuator to the control valve element is supported for movement in a variety of embodiments so as to confine the movement in same direction as the valve element.

This invention relates to a steering system for a marine propulsion unit and more particularly to an improved arrangement for actuating a control valve of a hydraulically assisted marine steering arrangement.
In many forms of marine propulsion systems, the propulsion unit is steered remotely by a steering control positioned in the operator's area of the watercraft. Normally a flexible cable is employed for transmitting the steering control from the steering wheel to the marine outboard drive. Frequently a form of hydraulic power assist is employed for assisting in the steering and this includes a linear type of hydraulic motor which is connected to the outboard drive through its tiller for assisting in the steering. A control valve of a servo system actuates the hydraulic motor in response to steering inputs at the steering wheel. The control valve is frequently operated by means of an element that is connected to a portion of the wire actuator so as to move the control valve control element in response to movement of the wire actuator element. Although these systems are effective, the wire actuator element does not move truly in a linear fashion. In addition, the interconnecting actuator between the wire actuator and the control valve element is normally restrained only where it is connected to the control valve element and the wire actuator element. As a result, the movement of the control valve may not actually track the steering needs.
For example, there may be vibrations occur in the wire actuator and these vibrations can be transmitted to the control valve element even though the vibrations do not occur in the direction of steering movement. As a result, some hunting of the position of the outboard drive may result. In addition, other difficulties can arise because of the types of constructions previously employed.
It is, therefore, a principal object of this invention to provide an improved steering control for a hydraulic steering mechanism for a marine propulsion unit.
It is a further object of this invention to provide an improved arrangement for controlling the steering control valve from a wire actuator element.
It is a still further object of this invention to provide an improved actuating arrangement for actuating a control valve of a hydraulic steering system from a wire actuator element wherein the actuating element is confined so that it can only move in the same direction as the control valve element.

Steering system for marine propulsion unit


A mower deck having a plurality of cutting blades carried within a cutting chamber and having a plurality of flow control baffles positioned within the cutting chamber including a first flow control baffle being movably connected to the mower deck. The first flow control baffle being selectively movable between a pair of orientations within the cutting chamber during a mowing operation. In a preferred embodiment, the first flow control baffle may be positioned between the pair of orientations without access to the cutting chamber.

1. Field of the Invention
This invention relates to a lawn mower having multiple rotary cutting blades and more particularly to a lawn mower of the type described having one or more flow control baffles positioned at the underside of the mower deck.
2. Description of the Related Art
Commercial-type lawn mowers, whether they are walk-behind or riding mowers, normally include a mower deck having multiple rotary cutting blades positioned therein. Common classifications of mower decks include a mulching deck, a side discharge deck, a rear discharge deck or a bagging deck depending upon the manner in which the cut grass cuttings or clippings are handled or directed. When a mower is of the side discharge deck type, the grass clippings are discharged out one side of the deck and onto the ground. If the lawn mower is of the mulching deck type, the grass clippings are re-cut into finer particles and are then discharged directly down to the ground. Oftentimes, a mower is converted from a side discharge mower to a mulching mower and vice versa by changing certain of the deck baffles and the type of blade.
The prior art has previously provided flow control and mulcher baffles which are attached to the underside of the mower deck. Mulcher baffles maintain the clippings cut by each blade in an enclosed area around the blade so that the clippings are re-cut by the mulching blades and are directed down to the ground. In the prior art lawn mowers, the lawn mowers are only able to be converted to a mulching mower and vice versa through the labor-intensive and time-consuming installation of mulching baffles.

Lawn mower having adjustable flow control baffle


The present application provide a seal for use between components engine facing a high pressure cooling air flow and a hot gas path in a gas turbine. The seal may include a first shim, a second shim with an air exit hole, one or more middle layers positioned between the first shim and the second shim, and one or more cooling pathways extending through the middle layers for the high pressure cooling air flow to pass therethrough and exit via the air exit hole into the hot gas path.

Generally described, turbo-machinery such as gas turbine engines and the like include a main gas flow path extending therethrough. Gas leakage, either out of the gas flow path or into the gas flow path, may lower overall gas turbine efficiency, increase fuel costs, and possibly increase emission levels. Secondary flows also may be used within the gas turbine engine to cool the various heated components. Specifically, cooling air may be extracted from the later stages of the compressor for use in cooling the heated components and for purging gaps and cavities between adjacent components. For example, seals may be placed between turbine components such as stators and the like to limit air leakage. These locations, however, may face very high temperatures and velocities that may lead to heavy oxidation and even seal failure. As firing temperatures increase, thermal loads on seals, such as those included in gas turbine engines, increase accordingly, resulting in reduced seal lifetime, reduced component lifetime, and/or increased seal and component wear.

Seals with cooling pathways and metered cooling


A photocatalyst compound comprising: (i) a photocatalyst selected from the group consisting of TiO.sub.2, WO.sub.3 and mixtures thereof, the photocatalyst being substantially free of sharp, narrow band X-ray reflections at angles corresponding those of crystalline TiO.sub.2, WO.sub.3 and mixtures thereof, and (ii) a porous, crystalline, adsorbent support material. A process for producing the photocatalyst compound is also disclosed. The process comprises: (i) hydrolysing a non-ionic titanium compound to produce a colloidal suspension having an average particle size of less than about 250 .ANG.; (ii) contacting a porous, crystalline, adsorbent support material with the colloidal suspension to produce an impregnated support; and (iii) calcining the impregnated support to produce the photocatalyst compound. The photocatalyst compound is useful, in the treatment of a fluid containing an organic pollutant.

1. Field of the Invention
The present invention relates to a photocatalyst compound and to a process for production thereof.
2. Description of the Prior Art
Photocatalysis is known and has application in treatment of fluids such as water containing pollutants.
Conventionally, a photocatalyst such as titanium dioxide (TiO.sub.2) is added to the fluid to be treated to form a slurry. The slurry is then exposed to electromagnetic radiation which would result in the catalytic destruction or decomposition of the pollutants in the fluid. For TiO.sub.2, radiation having a wavelength of less than or equal to about 380 nm results in catalytic destruction or decomposition of the pollutants in the fluid.
It is known in the art to load TiO.sub.2 on a support to facilitate recovery of the TiO.sub.2 in a specific place. However, as is known in the art, TiO.sub.2 is a relatively poor adsorber of, inter alia, organic compounds and there has been little or no attention given to this in the art.
Indeed, much of the prior art has focused on methods of immobilizing the photocatalyst TiO.sub.2 directly on to the support material. Generally, this technique involves thermal fusing of TiO.sub.2 to a support material such as silica gel, etched glass beads, interior of glass tubes, Teflon.TM. tubing, woven glass mesh, sand and the like. See, for example, any of the following prior art references:
1. Serpone et al., Solar Energy. Mater. 14, 121 (1986), PA0 2. Matthews et al., Anal. Chim. Acta. 223, 171 (1990), PA0 3. Matthews, Solar Energy Mater. 38, 405 (1987), PA0 4. U.S. Pat. No. 5,182,030 (Crittenden et al.), PA0 5. Australian patent application PH7074 (Mattews), PA0 6. Stakheev et al., J. Phys. Chem. 97, 5668 (1993), PA0 7. Matthews, Wat. Res. 25, 1169 (1991), PA0 8. Yoneyana et al., J. Phys. Chem. 93 4833 (1989), PA0 9. Yamanaka et al., Mater. Chem. Phys. 17, 87 (1987), PA0 10. Minero et al., Langmuir8, 481 (1992), and PA0 11. U.S. Pat. No. 4,495,041 (Goldstein),
the contents of each of which are hereby incorporated by reference.
While there appears to exist a commercial interest in TiO.sub.2 -based photocatalysis for the destruction or decomposition of pollutants in water, the known systems suffer from a number of disadvantages.
Specifically, a disadvantage of the work done to date is that, with most of the supported TiO.sub.2 photocatalysts, there is a drop-off in the photoactivity of the photocatalysts compared to the photoactivity of unsupported TiO.sub.2 photocatalyst.
Yet another disadvantage is that, with most of the prior art supported TiO.sub.2 photocatalysts, there is a drop-off in the adsorption of pollutants by the photocatalysts compared to the adsorption characteristics of the support material, per se, due to the unfavourable adsorption characteristics of TiO.sub.2.
It would be desirable to have a photocatalyst compound alleviate at least one of the above-identified disadvantages of the prior art.

Photocatalyst having an x-ray diffraction pattern which is substanially free of characteristic reflections associated with crystalline TiO.sub.2

University Technologies International Inc.


A method for determining a site for an offshore wind turbine includes determining a plurality of possible site locations, and positioning an offshore assembly at at least one of the possible site locations, wherein the assembly includes a floating support structure, a tower extending upwardly from the floating support structure, equipment coupled to the tower, and a counter-balance system coupled to the floating support structure at a location below a center of gravity of the floating support structure. The method further includes measuring conditions at the at least one of the possible site locations using the equipment, and determining a site for the offshore wind turbine from the at least one of the possible site locations based on the conditions of the plurality of possible site locations.

This invention relates generally to offshore wind turbines, and more particularly to methods and apparatus for determining a site for an offshore wind turbine.
Wind power is quickly becoming a growing energy source around the world. Conventionally, wind turbines are clustered together as wind farms in locations that have favorable wind conditions. However, placement of these wind farms is limited due to the desire to place the wind turbines in remote locations and the need to place the wind turbines in a location with favorable wind conditions to provide increased power output.
Wind turbines are currently being sited at offshore locations. Offshore wind turbines are desirable because they provide additional locations to place wind turbines and they provide favorable wind conditions due to the lack of obstruction for wind currents. However, identifying favorable wind resource locations is a challenge to long term economic competitiveness and also a key for business development strategies. Known identification techniques include erecting a meteorological tower upon a foundation secured to the sea floor to measure wind conditions. However, these meteorological towers are expensive to construct and are stationary with respect to the sea floor. Other known identification techniques include dispersing data buoys to collect wind condition measurements. However, these data buoys typically collect wind condition data at or near the water surface, which can be significantly different than the wind conditions at higher elevations, such as the elevation of conventional wind turbines. Furthermore, these data buoys are susceptible to wave motion which can distort wind condition readings. Accordingly, identification techniques of the kind presently in use have not previously provided wind condition measurements in a cost effective and reliable manner.

Method and apparatus for determining a site for an offshore wind turbine


Provided are a digital condenser microphone having a preamplifier with variable input impedance and a method of controlling the variable input impedance of the preamplifier. The preamplifier includes a bias terminal for applying a bias voltage to an input signal when the input signal is output from a microphone condenser. An impedance unit includes at least one variable input impedance element which is connected to the bias terminal and to which the bias voltage is applied via the bias terminal. An operational amplifier receives the input signal, converts the input signal into an output signal, and outputs the output signal. A control block determines whether a DC voltage level of the output signal output from the operational amplifier has reached a reference value, and controls a total impedance of the impedance unit based on a result of the determination.

Generally, condenser microphones are parts that convert the sound pressure of externally input acoustic signals into a voltage signal. One such condenser microphone is a digital condenser microphone (Electret Condenser Microphone: ECM) which is characterized in that an existing post-processing stage is remarkably simplified and the noise interference of analog signals is eliminated. However, such a digital condenser microphone must be essentially provided with a preamplifier for amplifying input signals and eliminating noise from the input signals because detection sensitivity to externally input acoustic signals is low. In particular, in recent condenser microphones, as condensers are gradually becoming small in size and integrated, active capacitance (typically, about 1 pF to 10 pF) greatly decreases, and then drop in sensitivity is greater.
FIG. 1 is a circuit diagram showing a conventional digital condenser microphone.
Referring to FIG. 1, the conventional digital condenser microphone includes a microphone sensor unit 1, a high-impedance interface unit 2, a Direct Current (DC) cut-off condenser 3, a preamplifier 4, and an Analog to Digital (A/D) converter 5.
The microphone sensor unit 1 includes an input power source Vs and a condenser Cmic for a microphone, and is configured to detect an acoustic signal Vs from the outside of the microphone and output the detected acoustic signal as a voltage V1.
The high-impedance interface unit 2 includes a resistor R1 having a high-input impedance at the input terminal of a Junction gate Field-Effect Transistor (JFET). The high-impedance interface unit 2 receives the voltage V1 output from the microphone sensor unit 1 and then outputs a voltage V2 via current control.
The DC voltage cut-off condenser 3 cuts off a DC voltage and only an acoustic signal is converted into current by a resistor R2.
The acoustic signal is converted into the current by the resistors R2 and R4 of the preamplifier 4 and is output as a voltage V3 by resistors R3 and R5 in a subsequent stage, and the voltage V3 is input to the A/D converter 5. In this case, the gain of the preamplifier 4 is determined by R3/R2 (R5/R4).
As described above, the conventional preamplifier is configured such that the input voltage V1 undergoes several stages of voltage/current and current/voltage conversion via the impedance interface unit 2 and the input resistors R2 and R4 of the preamplifier 4 and then the amplified voltage signal V3 is output.
However, the conventional digital condenser microphone in which the preamplifier is implemented using the JFET is vulnerable to noise generated by the input power source. Further, disadvantages of the conventional digital condenser microphone are that it requires an individual element, such as the JFET, and that it is inappropriate to integrate the microphone interface, the preamplifier, and the A/D converter into a single chip due to an increase in area attributable to the high-impedance resistor at the input terminal and the DC voltage cut-off condenser.

Digital condenser microphone having preamplifier with variable input impedance and method of controlling variable input impedance of preamplifier


The present invention is a grain-oriented electrical steel sheet characterized in that Bi is present at 0.01 to less than 1,000 ppm in terms of mass at the interface of the substrate steel and the primary film of the grain-oriented electrical steel sheet. The grain-oriented electrical steel sheet is produced by any of the processes of: before decarburization annealing, applying preliminary annealing for 1 to 20 sec. at 700° C. or higher and controlling an atmosphere in the temperature range; controlling the maximum attaining temperature B (° C.) before final cold rolling so that the maximum attaining temperature B may satisfy the expression, −10×ln(A)+1,100≦B≦10×ln(A)+1,220, in accordance with a Bi content A (ppm) and at the same time heating the steel sheet cold rolled to the final thickness to 700° C. or higher within 10 sec. or at a heating rate of 100° C./sec. or more before decarburization annealing, or immediately thereafter applying preliminary annealing for 1 to 20 sec. at 700° C. or higher; or controlling a TiO2 amount B added in relation to MgO of 100 as parts by weight and an MgO coating amount C (g/m2) so that the expression, A0.8≦B×C≦400, may be satisfied in accordance with the Bi content A (ppm).

A grain-oriented electrical steel sheet used as the magnetic iron core for various electric apparatuses generally contains 2 to 7% Si and has a product crystal structure highly accumulated to {110}<001> orientations. The product quality of a grain-oriented electrical steel sheet is evaluated by both iron loss properties and excitation properties. Reduction of iron loss is as a result of reduction of energy loss taken away as thermal energy when a grain-oriented electrical steel sheet is used in an electric apparatus and therefore is desirable from the viewpoint of energy saving.
Meanwhile, the improvement of excitation properties makes it possible to increase the designed magnetic flux density of an electric apparatus and therefore is desirable from the point of view of reducing the size of the apparatus. Since the accumulation of a product crystal structure to {110}<001> orientations is desirable in order to improve the excitation properties and also reduce iron loss, various research has been carried out and various production technologies developed recently.
One of the typical technologies for the improvement of magnetic flux density is the production method disclosed in Japanese Examined Patent Publication No. S40-15644. This is a production method wherein AlN and MnS function as inhibitors and a high reduction ratio exceeding 80% is employed at the final cold rolling process. By this method, a grain-oriented electrical steel sheet having crystal grains accumulated to {110}<001> orientations and having a high magnetic flux density of 1.870 T or more in terms of B8 (a magnetic flux density at 800 A/m) can be obtained.
However, a magnetic flux density B8 obtained by the method is about 1.88 to at most 1.95 T and the value is only about 95% of the saturation magnetic flux density 2.03 T of a 3% silicon steel. Nevertheless, in recent years, the social demand for energy saving and conservation of resources has been growing increasingly severe and the demand for the reduction of iron loss and the improvement of the magnetization properties of a grain-oriented electrical steel sheet has also been increasing. Therefore, further improvement of magnetic flux density is in strong demand.
As a technology for improving magnetic flux density, Japanese Examined Patent Publication No. S58-50295 proposes the temperature gradient annealing method. By this method, a product having not less than 1.95 T in B8 was produced stably for the first time. However, when the method is applied to a coil having a weight on an industrial scale, the method requires heating an end face of the coil and cooling the other end face thereof to create a temperature gradient and causes large thermal energy loss. Therefore, there has been a problem in the application of the method to industrial production.
In this connection, as a technology to improve magnetic flux density, the method wherein Bi of 100 to 500 g/t is added to molten steel is disclosed in Japanese Unexamined Patent Publication No. H6-88171 and a product having B8 of 1.95 T or more has been produced. Further, the method wherein Bi is contained from 0.0005 to 0.05% as a constituent component in a base material and the material is rapidly heated to a temperature range of 700° C. or higher at a heating rate of 100° C./sec. or more before decarburization annealing is disclosed in Japanese Unexamined Patent Publication No. H8-188824, and by this method, it is possible to stabilize secondary recrystallization over the length and width of a coil and to stably obtain B8 of 1.95 T or more at any point in the coil industrially.
It is believed, as disclosed in Japanese Unexamined Patent Publication No. H6-207216 and others, that Bi accelerates the precipitation of fine MnS and AlN functioning as inhibitors, thus raises inhibitor strength, and is advantageous to the selective growth of the crystal grains having little deviation from the ideal {110}<001> orientations.
In particular, it is well known that the precipitation control of AlN functioning as an inhibitor greatly depends on the temperature of hot band annealing or annealing prior to the finish cold-rolling process among a plurality of cold-rolling processes incorporating intermediate annealing in between, and therefore optimization of the temperature has been adopted.
The following methods are employed in the case of a base material containing Bi: the method wherein hot band annealing or annealing prior to the finish cold-rolling process among a plurality of cold-rolling processes incorporating intermediate annealing in between is applied for 30 sec. to 30 min. in a temperature range from 850° C. to 1,100° C. as disclosed in Japanese Unexamined Patent Publication No. H6-212265; the method wherein the temperature of annealing prior to finish cold rolling is controlled in accordance with the excessive amount of Al in steel as disclosed in Japanese Unexamined Patent Publication No. H8-253815; and the method wherein an average cooling rate of a hot band is controlled and a temperature of annealing prior to finish cold rolling is controlled in the range from 2,400×Bi (wt %)+875° C. to 2,400×Bi (wt %)+1,025° C. in accordance with a Bi content as disclosed in Japanese Unexamined Patent Publication No. H11-124627. A feature of all of these methods is that the appropriate temperature range of annealing prior to finish cold rolling is lower than that in the case of not adding Bi.
However, since equipment for annealing prior to finish cold rolling is generally not designed so as to exclusively process Bi contained materials, it has been necessary to change the temperature from a higher temperature for a material not containing Bi when a Bi contained material is processed at a lower temperature, and poor secondary recrystallization or, even when secondary recrystallization occurs, poor magnetic property in terms of low magnetic flux density has sometimes arisen at the temperature change portion. Furthermore, a coil for temperature adjustment is sometimes used in the event of temperature change, but this measure is not desirable, since it reduces productivity.
In the meantime, as methods for reducing iron loss, various methods of magnetic domains refinement are disclosed including: the method wherein laser treatment is applied to a steel sheet disclosed in Japanese Examined Patent Publication No. S57-2252; the method wherein mechanical strain is introduced to a steel sheet disclosed in Japanese Examined Patent Publication No. S58-2569; and other methods. In general, the iron loss of a grain-oriented electrical steel sheet is evaluated by W17/50 (energy loss under the excitation conditions of 1.7 T in B8 and 50 Hz) stipulated in JIS C2553 and classified. In recent years, cases where an excitation magnetic flux density is raised to 1.7 T or more in an attempt to downsize a transformer and, even when a magnetic flux density is designed to be 1.7 T, a local magnetic flux density of a transformer iron core is raised to 1.7 T or more, and a steel sheet having a reduced iron loss at a high magnetic flux density (W19/50 for example) is desired.
With regard to a grain-oriented electrical steel sheet having a reduced iron loss in a high magnetic flux density, Japanese Unexamined Patent Publication No. 2000-345306 discloses the method wherein the deviation of the crystal orientations of a steel sheet from the ideal {110}<001> orientation is controlled to not more than five degrees on average and the average magnetic domain width of the steel sheet at 180° C. is controlled in the range from over 0.26 to 0.30 mm, or the area percentage of magnetic domains having a magnetic domain width of over 0.4 mm in the steel sheet is controlled in the range from over 3 to 20%. As a method for producing such a grain-oriented electrical steel sheet, Japanese Unexamined Patent Publication No. 2000-345305 discloses the method wherein a steel sheet is heated to 800° C. or higher at a heating rate of 100° C./sec. or more immediately before decarburization annealing. However, the high magnetic field iron loss of a steel sheet produced by the method is 1.13 W/kg in W19/50 at the lowest, and thus grain-oriented electrical steel sheet having still lower iron loss at a high magnetic flux density is desired.
In the case where Bi is contained in a base material, as disclosed in Japanese Unexamined Patent Publication Nos. H6-89805 and 2000-26942, the crystal grains of a product coarsen, therefore the magnetic domain width increases, conventional measures for magnetic domains refinement are not sufficient to narrow the magnetic domain width, and consequently there has been room for further decreasing iron loss at high magnetic flux density.
Further, as disclosed in many patent publications, when Bi is contained in a steel, a glass film that functions as an insulating film has not been formed stably in the width direction.
Moreover, as a technology for rapidly heating a steel sheet immediately before decarburization annealing, Japanese Unexamined Patent Publication No. H11-61356 discloses the technology for producing a grain-oriented electrical steel sheet excellent in film adhesiveness and magnetic properties through the processes of: carrying out the heating process in decarburization annealing in a rapid-heating chamber installed next to a decarburization annealing furnace; controlling the ratio PH2O/PH2 in the rapid-heating chamber in the range from 0.65 to 3.0; rapidly heating the strip to a temperature of 800° C. or higher at a heating rate of 100° C./sec. or more; controlling the resident time in the temperature range of 750° C. or higher in the rapid-heating chamber to 5 sec. or less; and further processing the strip by controlling the ratio PH20/PH2 in the decarburization annealing furnace in the range from 0.25 to 0.6. Further, Japanese Unexamined Patent Publication No. 2000-204450 discloses the method for producing a grain-oriented electrical steel sheet excellent in film adhesiveness and magnetic properties by heating a steel sheet to 800° C. or higher at a heating rate of 100° C./sec. or more and controlling an oxygen partial pressure and a vapor partial pressure in an atmosphere in the temperature range. However, even by those methods, when Bi is contained in a steel, it is impossible to form a primary film uniformly in a coil.
Further, Japanese Unexamined Patent Publication No. H8-188824 discloses the technology for obtaining a high magnetic flux density uniformly in a coil by: containing 0.0005 to 0.05% Bi in a base material; heating the coil to a temperature range of 700° C. or higher at a heating rate of 100° C./sec. or more in an atmosphere having a ratio PH20/PH2 of 0.4 or less before applying decarburization annealing; thus controlling the amount of SiO2; and stabilizing the behavior of absorbing and disgorging nitrogen in finish annealing. Such heat treatment is applied generally by using an electrical device for induction heating or conduction heating, and therefore it is commonly used to control an H2 concentration to 4% or less from the viewpoint of explosion-protection. Therefore, in order to secure an atmosphere wherein the ratio PH20/PH2 is controlled to 0.4 or less, it is necessary to stabilize operation at a low dew point, and thus a dehumidifier or the like is required, which results in increased equipment cost. In addition, a problem thereof is that the dew point must be controlled so as to deal with the least variation of a hydrogen concentration and therefore flexibility of operation is greatly hampered.
Next, an electrically insulative film formed on the surface of a grain-oriented electrical steel sheet is explained. Such a film plays a role not only of maintaining insulation, but also of imposing a tensile stress on a steel sheet and reducing iron loss by making use of the fact that the coefficient of thermal expansion of the film is lower than that of the steel sheet. Further, a good insulating film is important also in a transformer manufacturing process. In particular, in the case of a wound-core type transformer, bend forming is applied to a grain-oriented electrical steel sheet and therefore a film may sometimes exfoliate. For this reason, a film is also required to have excellent film adhesiveness.
Such an insulating film of a grain-oriented electrical steel sheet is composed of two films; a primary film and a secondary film. A primary film is formed by making SiO2 that is formed on a steel sheet surface in decarburization annealing react to an annealing separator that is applied thereafter in the finish annealing process. In general, an annealing separator is component mainly of MgO and reacts to SiO2 and forms Mg2SiO1. Finish annealing is generally applied to a steel sheet in the state of a coil and is influenced by temperature deviation in the coil and the distributability of an atmosphere between steel sheet layers. Therefore, a challenge is to form a primary film uniformly, and various methods have tried to solve the problem with regard to a decarburization annealing process, MgO functioning as an annealing separator, finish annealing process conditions and others.
As methods for optimizing an oxide layer formed on the surface of a steel sheet subjected to decarburization annealing, Japanese Unexamined Patent Publication No. H11-323438 discloses the method wherein PH20/PH2 in a soaking zone is kept lower than PH20/PH2 in a heating zone, Japanese Unexamined Patent Publication No. 2000-96149 the method wherein a heating rate is controlled to 12 to 40° C./sec. on average in a temperature range from ordinary temperature to 750° C. and to 0.5 to 10° C./sec. on average in a temperature range from 750° C. to a soaking temperature, and Japanese Unexamined Patent Publication No. H10-152725 the method wherein the an oxygen amount on the surface of a steel sheet after decarburization annealing is controlled in the range from 550 to 850 ppm.
Further, with regard to an annealing separator composed mainly of MgO and applied after decarburization annealing, Japanese Unexamined Patent Publication No. H8-253819 discloses the method wherein the coating amount of an annealing separator is controlled to 5 g/m2 or more, and Japanese Unexamined Patent Publication No. H10-25516 the method wherein an Ig-loss value is controlled in the range from 0.4 to 1.5%.
Furthermore, with regard to a Ti chemical compound, represented by TiO2, used as an additive to MgO, many technologies have been proposed. As such methods in the case of a base material not containing Bi, Japanese Examined Patent Publication No. S49-29409 disclosed the method wherein anatase-type TiO2 of 2-20 is blended with MgO of 100 as parts by weight, Japanese Examined Patent Publication No. S51-12451 the method wherein a Ti chemical compound of 2-40 is blended with an MgO chemical compound of 100 as parts by weight, Japanese Unexamined Patent Publication No. S54-128928 the method wherein TiO2 of 1-10 as parts by weight and SiO2 of 1-10 as parts by weight are contained as parts by weight, and Japanese Unexamined Patent Publication No. H5-195072 the method wherein a Ti chemical compound of 1-40 in terms of TiO2 is blended as parts by weight and an atmosphere containing nitrogen is used at the first stage of purification annealing.
As such methods in the case of a base material containing Bi, Japanese Unexamined Patent Publication No. 2000-96149 discloses the method wherein SnO2, Fe2O3, Fe3O4 and MoO2 are added by 0-15 as parts by weight, further TiO2 is added by 1.0-15 as parts by weight, and by so doing, film adhesiveness is improved. However, since a finish annealing process is generally applied to a steel sheet in the state of a coil, temperature deviation and the deviation of the distributability of an atmosphere occur in the coil, and therefore it has been difficult to control dissociative reaction of such SnO2, Fe2O3, Fe3O4 and MoO3. Further, Japanese Unexamined Patent Publication No. 2000-144250 discloses the method wherein a Ti chemical compound of 1-40 is blended as parts by weight, the nitrogen concentration is raised temporarily in accordance with the amount of the Ti chemical compound after the completion of secondary recrystallization, and by so doing, Ti is prevented from intruding into a steel. However, a problem of the method has been that the time of completion of secondary recrystallization is difficult to judge because of the temperature deviation in a coil as stated above.
With regard to a finish annealing process, Japanese Unexamined Patent Publication No. H9-3541 discloses the technology wherein the flow rate of an atmosphere gas at finish annealing is controlled so that the value of "atmosphere gas flow rate/(furnace inner volume−steel sheet volume)" may be not less than 0.5 Nm3/hr./m3. However, by the technology, the distributability of an atmosphere deviates between steel sheet layers in a coil, and therefore a desired effect is not obtained.
As explained above, in the case of a steel containing Bi, it is difficult to form a primary film uniformly by the aforementioned methods. Moreover, adhesiveness deteriorates when an insulating film having a film tension is applied, and poor secondary recrystallization, poor magnetic property in terms of low magnetic flux density occurs in the longitudinal direction when annealing is applied to a steel sheet in the state of a coil. Therefore, a problem of the above methods has been that it is difficult to obtain reduced iron loss at high magnetic flux density and good film adhesiveness distributing uniformly in the width and longitudinal directions when an insulating film is applied after finish annealing.

Ultra-high magnetic flux density grain-oriented electrical steel sheet excellent in iron loss at a high magnetic flux density and film properties and method for producing the same


There is described a facsimile device which includes a first transmitting device that transmits previously stored communication information of a receiving device to the receiving device; and, in response to such transmission, the receiving device compares that communication information with its own communication information. When the comparison shows a difference, a second transmitting device, which is associated with the receiving device, transmits new communication information back to the first transmitting device; and, in response to this, the first transmitting device updates the stored communication information.

1. Field of the Invention
The present invention relates to a facsimile device having one-touch dialing and abbreviated dialing functions.
2. Description of the Related Art
Hitherto, there have been known facsimile devices in which communication information such as, for example, receiving station names and image transmission speeds, are stored in accordance with the receiving stations with which communication is carried out registered by means of the one-touch dialing function or the abbreviated dialing function to record the name of the receiving station in the communication management report or to shorten the communication time.
However, such conventional facsimile devices do not have any means to update by communication the communication information regarding receiving devices of the receiving stations with which communication is carried out which are stored at the transmitting side. Therefore, when changes are made in the communication information regarding the receiving side, differences arise between the communication information regarding each of these receiving devices of the receiving stations stored at the transmitting side and the communication information at the receiving side, so that extra time may be taken to complete the communication, wrong information may be written in the communication management report, etc.
An object of the present invention is to provide an improved facsimile device.
Another object of the present invention is to provide a facsimile device capable of allowing proper communication and report output by proper updating management of communication information regarding the receiving station device with which communication is carried out.

Facsimile method and apparatus for communicating and storing receiving station communication information


A surface-emitting type semiconductor laser includes a first mirror, an active layer formed above the first mirror, a second mirror formed above the active layer, a first electrode formed above the second mirror, and a second electrode formed above the first electrode, wherein each of the first electrode and the second electrode has an opening section, and the opening section of the first electrode is formed inside the opening section of the second electrode in a plan view.

1. Technical Field
The present invention relates to surface-emitting type semiconductor lasers and methods for manufacturing the same.
2. Related Art
Surface-emitting type semiconductor lasers are semiconductor lasers that emit a laser beam orthogonal to the semiconductor substrate, and can be readily examined during their processing compared to edge-emitting type semiconductor lasers, and their radiation pattern is circular, such that surface-emitting type semiconductor lasers are expected to be applied as various sensors and light sources for optical communications. When surface-emitting type semiconductor lasers are used for sensors and optical communications, it is desirous to obtain a laser beam having a radiation pattern with a narrow radiation angle.
To narrow the radiation angle, the film thickness of the electrode formed around the emission surface should preferably be small. However, when the film thickness is small, problems such as lowered radiation efficiency, lowered wire bonding property and the like would occur. Japanese Laid-open patent application JP-A-2004-63707 describes an example of related art.

Surface-emitting type semiconductor laser and method for manufacturing the same


A receptacle connector comprises an insulated housing, plural first contact pins, plural second contact pins and a metal casing. The first contact pin complies with a USB 3.0 interface, comprises a contact pin, a connected portion, a second contact pin and an arch and mounts parallel with the first terminal on the insulated housing. The second contact pin complies with a USB 2.0 interface, comprises a protruded end, an elongated portion and a first pin and mounts on the insulated housing. The metal casing mounts around the insulated housing. The receptacle connector transmits data steady at a high transmission rate.

A Universal Serial Bus (USB) is a hot-swap type transmission interface widely used in computer peripherals, connects to hardware to a computer and transmits information without rebooting the computer. In 1998, a USB 1.1 transmission interface was first released. In 2007, Intel Corp. released a USB 2.0 transmission interface allowing the USB interface to be used with more applications including flash drives, printers and mice and having a transmission rate of 480 Mbps, about 40× times faster than the USB 1.1 interface.
As computers have become increasingly powerful and able to process larger amounts of data, computers and computer peripherals have had to be able to transfer more and more data. Transmission efficiency of a USB 2.0 interface is limited by file size that has promoted development of a USB 3.0 interface. The USB 3.0 interface has all the capabilities of the USB 2.0 interface but has more advantages such as lower power consumption and higher transmission rate.


An iron holder comprises a base and an insulation board for supporting the iron, the base forming a revolvable relationship with the insulation board, and there is an angle adjusting unit is arranged between the insulation board and the base for adjusting the revolving angle of the insulation board revolving relative to the base. Because the insulation board and the base forms a pivoted relationship, and the angle adjusting unit can adjust the angle between the insulation board and the base, the insulation board can be adjusted into a preferred angle for the users to lay the iron; and the iron holder can be conveniently packed to reduce packing materials.

An iron holder typically includes a base and an insulation board for supporting the iron and insulating heat. The insulation board of a traditional iron holder is fixed on the base in a special angle and position, and can not be moved or revolved. An iron, after being used, it cannot be conveniently to place the iron on the insulation board.