A hand foldable and portable article of furniture comprising planar back and right and left side members hinged at edge surfaces thereof such that the right and left side members swing between a folded position with the side members on a back of the back member and a unfolded position in which the side members are substantially perpendicular to the back member and upper edges of the back and side members are interlocked in mating grooves in a planar top member, one of the back and side members being transversely bendable at its upper edge to spring lock into its mating groove to tightly interlock the article of furniture in its unfolded position.

Over the years there has been a continuing need for foldable articles of furniture which are readily transportable from one location to another for reassembly in a rapid and efficient manner. Prior patents directed to such articles of furniture include U.S. Pat. Nos. 168,879; 242,355; 835,902; 1,559,878; 2,764,462; 2,932,343; 4,082,389; 4,236,460; and 4,579,401.
Specifically, the '879 patent shows a foldable wardrobe comprising side members F, F hinged to a pair of back members A, A. A pair of shelves C and C slide in grooves in the inside of the side pieces F, F and are secured in place by hooks or other connectors. A top member E also has grooves in an underside which receive tongues extending from the upper edges of back and side members. In practice, the two piece back and the hinge connection therefore provides a relatively unstable back for the wardrobe. Further, the side members are not hinged to fold outward over the back of the wardrobe to form a compact package. Finally the structural integrity of the wardrobe depends upon the tongue and groove connections between the top and sides and the connector attachment for the shelves to the sides of the wardrobe.
The '355 patent also discloses a folding wardrobe having a back member, hinged side members, shelves for sliding in open-ended grooves and a pair of pins that cooperate with holes in a top (not shown) for securing the wardrobe together. The hinges disclosed in the '355 patent and the groove A' at the point where the side members engage the back members preclude the side members from swinging outwardly to a folded position on a back surface of the back of the wardrobe to form a compact package for transport from one location to another. Further, the entire structural rigidity depends upon the top which is pinned to the side members.
The '902 patent also discloses a folding wardrobe having a rigid back b, a pair of side members c hinged to the back and a top d also hinged to the back. The hinge connection for the sides to the back only allow the sides to fold forward over the back while the rings c4 and cleats c5 prevent the folding of the sides and back into a compact package.
The '878 patent discloses a collapsible camp cupboard having a back 1 and side abutments 2 and 3 rigidly secured to the back 1. The abutments are a little thicker than shelf boards 6, 7, 8, 9 and 10 which loosely fit between the abutments in front of the back and are secured pivotally in place and by virtue of binding strips 11 and 12 swing freely from horizontal positions downwardly to vertical positions within the cupboard. Side boards 20 and 25 are connected to the abutments 2 and 3 by hinges and are adapted to swing inwardly to cover the folded shelves. Thus, while the cupboard is collapsible, it is not collapsible to a condition where the side members swing outwardly over the back to form a highly compact structure for easy transport from one location to another.
The '462 patent discloses a portable, collapsible bar with side members 7 and a top 9 hinged to a back 6. A top 9 rests on the upward edges of the back and side members while dowels 11 project downwardly at the underside of the top into openings 12 in a metal plate 13 recessed in the upper edge of each of the side members to lock the top to the side members with the bar in its erected position. The hinge structure for the back and side and top members does not produce a highly compact package upon folding of the bar to a collapsed position. Further, the support structure for the bar and the method of assembly and disassembly of the bar are complicated.
The '343 patent discloses a collapsible portable stand-up table. The table includes a vertically extending back member 24 having side members 18 and 20 secured by hinges to an inner face thereof. A front member 22 is hinged to an outside of the side member 20. A removable top tray 10 fits on top of the back, front and side members when they are assembled in a rectangular pattern. The hinge connections for the table are such that the side 19 folds inward over a front or inner side of back member 24 while the side member 20 folds inward over the side 18 and the back 24 with the front 22 folding inward over the side 20. None of the hinges allow the sides to pivot outwardly relative to the back member and over a back thereof to form a highly compact package. Further, the table includes latches for securing the top 12 to the body comprising the back and side members.
The '389 patent discloses a collapsible camp supply unit comprising a multi-shelf cabinet wherein outwardly extending tongues from the shelves fit through slots in the sides, front and back of the cabinet to be secured by clothespins. The front and back of the cabinet consists of hinged sections for folding along a vertical line connection between the sections. The side members are also connecting by hinges to the sections comprising the back member to swing inwardly over the insides of the back member when it is desired to fold the cabinet. As noted, the cabinet does not include hinges which allow the side members to fold outwardly relative to the back to form a compact package for transport and the connection of the various parts is via the clothespins extending through the tongues of the shells beyond the side members. Thus, the cabinet is relative unstable when assembled and does not fold to a highly compact package for transport.
The '460 patent describes a foldable furniture system consisting of four vertical posts supporting side members to a back. The sides are adapted to swing inwardly relative to the back rather than outwardly to lie on the back surface of the back member in a highly compact package.
The '471 patent describes a collapsible cabinet including a base to which side members and a back are hinged for folding inwardly over the base member. Latches are included to hold the side panels latched to the front when the cabinet is erected and to provide structural integrity to the cabinet. Thus, when assembled, the cabinet is somewhat unstable and is not capable of being collapsed to a highly compact package for transport.
Thus, there is a continuing need for hand foldable and portable furniture which is foldable to a highly compact package and which is easily unfolded to a sturdy unit of furniture. The present invention satisfies such needs.


A system includes a pressure vessel configured to receive a pneumatic flow, and to supply pressurized fluid to a spray coating device. The system also includes a first chamber disposed within the pressure vessel, and configured to store a first fluid, and a second chamber disposed within the pressure vessel, and configured to store a second fluid. Furthermore, the system includes a lid removably coupled to the pressure vessel. The system also includes a first fluid pathway extending through the lid, and configured to deliver the first fluid to the first chamber while the lid is coupled to the pressure vessel. In addition, the system includes a second fluid pathway extending through the lid, and configured to deliver the second fluid to the second chamber while the lid is coupled to the pressure vessel.

The invention relates generally to systems for spraying substances, such as coating substances (e.g., paint), and more particularly, to a multi-component pressure tank assembly for spray coating systems.
A variety of spray coating devices may be used to apply a spray to a target object. For example, certain spray coating systems may have a pressurized feed container configured to supply pressurized fluid (e.g., paint) to the spray coating device for generation of a fluid spray. In certain applications, it may be desirable to alternate between fluids (e.g., switch from one color to another). Accordingly, a user may depressurize the feed container, detach the spray coating device, remove a lid of the feed container, empty the fluid from the container, clean the container, and flush the spray coating device with a cleaner (e.g., solvent). The user may then refill the container, replace the lid, reattach the spray coating device, and re-pressurize the feed container. This process is time-consuming and reduces the efficiency of the spray coating process.

Multi-component pressure tank assembly for spray coating systems


An apparatus and a method of using the apparatus for measuring the cut resistance of polymeric and elastomeric materials having specimen holding and tensioning devices arranged on a common axis; a blade cutting device located orthogonally to the axis of the first and second specimen tensioning devices and a cutting block assembly located on the same axis as the cutting device and on the opposite side of the specimen tensioning device.

1. Field of the Invention
This invention relates to an apparatus for determining the cut resistance of materials under tension
2. Description of the Related Art
U.S. Pat. No. 5,613,414 describes a device that employs a heated knife for cutting elastomeric materials such as those used for tire treads. US patent Publication 2008/0073020 describes an apparatus and method for cutting elastomeric components in the tire building process. U.S. Pat. No. 4,864,852 describes an apparatus and method to cut flexible materials used in protective apparel. However, these references do not address the need for an apparatus and method for testing the cut resistance of automobile tire sidewalls that are in tension as a result of tire inflation pressure.

Apparatus for determining cut resistance


Organic peroxide compositions are stabilized against decomposition by the use of antioxidants, resulting in increased shelf life of products made using the compositions.

1. Technical Field
This disclosure relates to the preparation of compositions containing stable organic peroxide in solution. The compositions are useful for topical application to human skin and/or allow stable organic peroxides to be utilized in new product forms. Products (e.g., industrial, pharmaceutical or consumer based products) formulated using these compositions exhibit extended shelf life. Such compositions also have unique processing capabilities.
2. Background of Related Art
Organic peroxides are used in many products. For example, benzoyl peroxide is used in pharmaceutical and consumer products as an active ingredient for therapeutic treatments. Organic peroxides are unstable. This instability is a desired trait when these materials are used for free radical initiation. When organic peroxides are used for purposes other than free radical initiation, however, it is desirable to have the material be as stable as possible. Instability is problematic and leads to short shelf lives, required expiration dating, higher product costs, special storage considerations, product returns as well as reduced efficacy due to loss of active.
Accordingly, what are needed are compositions of organic peroxides with improved stability for use in products where increased shelf life would be an advantage.


A paper supply mechanism comprising a roll paper compartment for storing roll paper, a first side wall that can move and defines one side of the roll paper compartment, a second side wall that defines the other side of the roll paper compartment, a lock mechanism that locks the first side wall, a roll paper urging member that urges the roll paper in a storage width direction of the roll paper compartment; and a holding mechanism that operates in conjunction with the lock mechanism and holds the roll paper urging member in a predetermined position.

1. Field of Invention
The present invention relates to a paper supply mechanism that has a roll paper compartment for storing roll paper and supplies continuous printer paper from the roll paper compartment to the printing unit of a printer. The invention relates more particularly to a paper supply mechanism that enables the changing of the storage width of the roll paper compartment according to the paper width of the stored roll paper.
2. Description of Related Art
Roll paper printers used for issuing receipts, for example, use paper rolls having continuous printer paper wound into a roll as the recording medium. One type of roll paper supply mechanism used in such roll paper printers commonly uses a drop-in type roll paper compartment into which the paper supply roll is loaded from above and which allows the paper roll to rotate freely. Japanese Unexamined Patent Appl. Pub. JP-A-2006-44900 teaches a roll paper supply mechanism of this type that enables adjusting of the paper storage width by moving the left and right side walls that determine the storage width of the roll paper compartment.
With a drop-in type roll paper compartment, the inertial load of the roll paper and the friction between the roll paper and the bottom of the roll paper compartment must be overcome in order to make the roll paper roll deliver the paper from the roll paper compartment. The roll paper is fed by driving a paper feed roller disposed in the paper transportation path. The paper transportation load on the paper feed rollers increases as the paper speed increases, and can cause slippage between the paper feed roller and the paper, and which reduces paper transportation precision. To reduce the paper transportation load and enable conveying the paper precisely, Japanese Unexamined Patent Appl. Pub. JP-A-2007-203563 teaches a roll paper supply mechanism disposed to the bottom of the roll paper compartment that has a delivery roller for causing the roll paper to turn in the feed direction.
In the roll paper supply mechanisms of the related art described above, the side walls of the roll paper compartment can move. The side walls of the roll paper compartment are manually moved to positions corresponding to the paper width of the stored paper roll to adjust the storage width. However, because there are deviations in roll paper width and the roll paper supply mechanism, the storage width must be adjusted to accommodate these deviations.
If the storage width is too narrow after being adjusted, the side walls will push forcefully against the ends of the roll paper. This results in an excessive paper transportation load acting on the paper feed roller of the roll paper printer, for example, and therefore requires even greater force to deliver the printing paper from the paper roll.
However, if the storage width is too wide after being adjusted, the roll paper can shift side to side inside the roll paper compartment, which can result in the roll paper meandering or becoming skewed as it is delivered into the paper transportation path.
When a delivery roller is disposed in the roll paper compartment, the delivery roller is generally made from rubber or other material with a high coefficient of friction. In order to move the roll paper sideways (that is, along the width of the roll paper compartment) while in contact with the delivery roller while also moving the side walls, the roll paper must be pushed with enough force to overcome the friction between the roll paper and other parts when the paper roll is placed in the roll paper compartment and the side walls are then moved to adjust the width.
In addition, when the roll paper is on the delivery roller and the roll paper is shifted to one side, side pressure from friction with the delivery roller when the roll moves acts in addition to the side pressure from the side walls of the roll paper compartment, and the paper transportation load required to feed printing paper from the paper roll becomes excessive.

Paper supply mechanism and roll paper printer


A method and apparatus for use with a controller for controlling a machine wherein a torque reference value is provided, the method for identifying an error representative of the difference between the torque reference value and the torque applied to the machine and using the error value to modify machine operation.

The present invention relates to controllers providing adjustable frequency currents to loads and more specifically, to a method and apparatus to regulate torque provided to loads.
Induction Motors
Induction motors have broad application in industry, particularly when large horsepower is needed. A three phase induction motor receives three phases of electrical voltage to produce a rotating magnetic stator field. A rotor contained within the stator field experiences an induced current (hence the term induction) which generates a rotor field. The interaction of the rotor field and the stator field causes rotation of the rotor.
A common rotor design is a "squirrel cage winding" in which axial conductive bars are connected at either end by shorting rings to form a generally cylindrical structure. The flux of the stator field cutting across the conductive bars induces cyclic current flows through the bars and across the shorting rings. The cyclic current flows in turn produce the rotor field.
The use of this induced current to generate the rotor field eliminates the need for slip rings or brushes to provide power to the rotor, making the design relatively maintenance free.
Field Oriented Control of Induction Machines
To a first approximation, the torque and speed of an induction motor may be controlled by changing the frequency and magnitude of the driving voltage and thus the angular rate of the rotating stator field. Generally, for a given torque, increasing the stator field rate will increase the speed of the rotor (which follows the stator field). Alternatively, for a given rotor speed, increasing the frequency of the stator field will increase the torque by increasing the slip, that is the difference in speed between the rotor and the stator field. An increase in slip increases the rate at which flux lines are cut by the rotor, increasing the rotor generated field and thus the force or torque between the rotor and stator fields.
Referring to FIG. 1, the rotating phasor 1 of the stator magneto motive force ("mmf") will generally have some angle α with respect to the phasor of rotor flux 2. The torque generated by the motor will be proportional to the magnitudes of these phasors 1 and 2 but also will be a function of their angle α. The maximum torque is produced when phasors 1 and 2 form a right angle to each other (e.g., α=90°) whereas zero torque is produced if these phasors are aligned (e.g., α=0°). Phasor 1 may therefore be usefully decomposed into a torque producing component 3 perpendicular to phasor 2 and a flux component 4 parallel to rotor flux phasor 2.
These two components 3 and 4 of the stator mmf are proportional, respectively, to two stator currents iqs, a torque producing current and ids, a flux producing current, which may be represented by orthogonal vectors in the rotating frame of reference (synchronous frame of reference) of the stator flux having slowly varying magnitudes. Accordingly, in controlling an induction motor, it is generally desired to control not only the frequency of the applied voltage (hence the speed of the rotation of the stator flux phasor 1) but also the phase of the applied voltage relative to the current flow and hence the division of the currents through the stator windings into the iqs and ids components. Control strategies that attempt to independently control the currents iqs and ids are generally termed field oriented control strategies ("FOC").
While torque regulation has been contemplated in the past, unfortunately the regulation schemes adopted have not been very accurate. To this end, generally, at speeds below the rated motor speed, it has been assumed that the developed motor torque has been equal to a reference torque value. At speeds above rated speed, torque has been regulated in a pseudo open loop manner by dividing the torque reference value by an estimate of motor flux reduction value. More specifically, the torque reference is divided by a term proportional to the motor operating speed that is an estimate of the reduction in motor flux. Unfortunately, the term proportional to operating speed is a relatively inaccurate estimate of motor flux reduction and therefore torque regulation via one of these schemes is not very accurate. In addition, while system torque can change rapidly, operating frequency changes relatively slowly and therefore, in some cases, stability problems have been known to occur when operating frequency is used as an estimator of flux reduction. While such inaccurate torque regulators may work in some applications, such limited regulating capabilities are not acceptable for other applications.
Therefore, it would be advantageous to have a system that estimates torque quickly and accurately.

Method and apparatus to regulate torque provided to loads


A compound represented by formula I or II. X represents a mono substituent on a benzene ring, and is selected from —H, —I, —Br, —Cl, —F, —CN, an amino, and a derivative thereof; R1 is a C2-10 alkyl, C2-10 alkyl substituted by cyclopropane or fluorine, except n-butyl; and M is an amine ion or metal ion.

The disclosure relates to a benzoic acid compound, its application thereof in the prevention and treatment or relief of ischemic diseases such as cerebral ischemia or acute or chronic myocardial infarction, and also relates to the application of the benzoic acid compound in the prevention and treatment or relief of amyotrophic lateral sclerosis (ALS). The disclosure relates to the field of pharmaceutical chemistry.
Cardiovascular and cerebrovascular diseases, especially coronary atherosclerosis and the associated ischemic heart and brain diseases, are common diseases that seriously damages human health. Butylphthalide is a drug approved for the treatment of stroke. Benzylpiperazine (BZP) (structural formula A) is in clinical trials. The metabolism of butylphthalide shows that the two carbon at the ends of the side chain are easily oxidized by cytochrome P450, and the proportion of the metabolites of butylphthalide in human body is as follows. The total metabolites M3-2, M2, M5-2 of adults after oral administration of 200 mg of butylphthalide are 16 times higher than that of the effective drug n-butylphthalide (NBP).

Benzoic acid compound and method for preparing the same


An abrasive wear-resistant material includes a matrix and sintered and cast tungsten carbide granules. A device for use in drilling subterranean formations includes a first structure secured to a second structure with a bonding material. An abrasive wear-resistant material covers the bonding material. The first structure may include a drill bit body and the second structure may include a cutting element. A method for applying an abrasive wear-resistant material to a drill bit includes providing a bit, mixing sintered and cast tungsten carbide granules in a matrix material to provide a pre-application material, heating the pre-application material to melt the matrix material, applying the pre-application material to the bit, and solidifying the material. A method for securing a cutting element to a bit body includes providing an abrasive wear-resistant material to a surface of a drill bit that covers a brazing alloy disposed between the cutting element and the bit body.

A typical fixed-cutter, or "drag," rotary drill bit for drilling subterranean formations includes a bit body having a face region thereon carrying cutting elements for cutting into an earth formation. The bit body may be secured to a hardened steel shank having a threaded pin connection for attaching the drill bit to a drill string that includes tubular pipe segments coupled end to end between the drill bit and other drilling equipment. Equipment such as a rotary table or top drive may be used for rotating the tubular pipe and drill bit. Alternatively, the shank may be coupled directly to the drive shaft of a down-hole motor to rotate the drill bit.
Typically, the bit body of a drill bit is formed from steel or a combination of a steel blank embedded in a matrix material that includes hard particulate material, such as tungsten carbide, infiltrated with a binder material such as a copper alloy. A steel shank may be secured to the bit body after the bit body has been formed. Structural features may be provided at selected locations on and in the bit body to facilitate the drilling process. Such structural features may include, for example, radially and longitudinally extending blades, cutting element pockets, ridges, lands, nozzle displacements, and drilling fluid courses and passages. The cutting elements generally are secured within pockets that are machined into blades located on the face region of the bit body.
Generally, the cutting elements of a fixed-cutter type drill bit each include a cutting surface comprising a hard, super-abrasive material such as mutually bound particles of polycrystalline diamond. Such "polycrystalline diamond compact" (PDC) cutters have been employed on fixed-cutter rotary drill bits in the oil and gas well drilling industries for several decades.
FIG. 1 illustrates a conventional fixed-cutter rotary drill bit 10 generally according to the description above. The rotary drill bit 10 includes a bit body 12 that is coupled to a steel shank 14. A bore (not shown) is formed longitudinally through a portion of the drill bit 10 for communicating drilling fluid to a face 20 of the drill bit 10 via nozzles 19 during drilling operations. Cutting elements 22 (typically polycrystalline diamond compact (PDC) cutting elements) generally are bonded to the face 20 of the bit body 12 by methods such as brazing, adhesive bonding, or mechanical affixation.
A drill bit 10 may be used numerous times to perform successive drilling operations during which the surfaces of the bit body 12 and cutting elements 22 may be subjected to extreme forces and stresses as the cutting elements 22 of the drill bit 10 shear away the underlying earth formation. These extreme forces and stresses cause the cutting elements 22 and the surfaces of the bit body 12 to wear. Eventually, the cutting elements 22 and the surfaces of the bit body 12 may wear to an extent at which the drill bit 10 is no longer suitable for use.
FIG. 2 is an enlarged view of a PDC cutting element 22 like those shown in FIG. 1 secured to the bit body 12. Cutting elements 22 generally are not integrally formed with the bit body 12. Typically, the cutting elements 22 are fabricated separately from the bit body 12 and secured within pockets 21 formed in the outer surface of the bit body 12. A bonding material 24 such as an adhesive or, more typically, a braze alloy may be used to secure the cutting elements 22 to the bit body 12 as previously discussed herein. Furthermore, if the cutting element 22 is a PDC cutter, the cutting element 22 may include a polycrystalline diamond compact table 28 secured to a cutting element body or substrate 23, which may be unitary or comprise two components bound together.
The bonding material 24 typically is much less resistant to wear than are other portions and surfaces of the drill bit 10 and of cutting elements 22. During use, small vugs, voids and other defects may be formed in exposed surfaces of the bonding material 24 due to wear. Solids-laden drilling fluids and formation debris generated during the drilling process may further erode, abrade and enlarge the small vugs and voids in the bonding material 24. The entire cutting element 22 may separate from the drill bit body 12 during a drilling operation if enough bonding material 24 is removed. Loss of a cutting element 22 during a drilling operation can lead to rapid wear of other cutting elements and catastrophic failure of the entire drill bit 10. Therefore, there is a need in the art for an effective method for preventing the loss of cutting elements during drilling operations.
The materials of an ideal drill bit must be extremely hard to efficiently shear away the underlying earth formations without excessive wear. Due to the extreme forces and stresses to which drill bits are subjected during drilling operations, the materials of an ideal drill bit must simultaneously exhibit high fracture toughness. In practicality, however, materials that exhibit extremely high hardness tend to be relatively brittle and do not exhibit high fracture toughness, while materials exhibiting high fracture toughness tend to be relatively soft and do not exhibit high hardness. As a result, a compromise must be made between hardness and fracture toughness when selecting materials for use in drill bits.
In an effort to simultaneously improve both the hardness and fracture toughness of earth-boring drill bits, composite materials have been applied to the surfaces of drill bits that are subjected to extreme wear. These composite materials are often referred to as "hard-facing" materials and typically include at least one phase that exhibits relatively high hardness and another phase that exhibits relatively high fracture toughness.
FIG. 3 is a representation of a photomicrograph of a polished and etched surface of a conventional hard-facing material. The hard-facing material includes tungsten carbide particles 40 substantially randomly dispersed throughout an iron-based matrix material 46. The tungsten carbide particles 40 exhibit relatively high hardness, while the matrix material 46 exhibits relatively high fracture toughness.
Tungsten carbide particles 40 used in hard-facing materials may comprise one or more of cast tungsten carbide particles, sintered tungsten carbide particles, and macrocrystalline tungsten carbide particles. The tungsten carbide system includes two stoichiometric compounds, WC and W2C, with a continuous range of compositions therebetween. Cast tungsten carbide generally includes a eutectic mixture of the WC and W2C compounds. Sintered tungsten carbide particles include relatively smaller particles of WC bonded together by a matrix material. Cobalt and cobalt alloys are often used as matrix materials in sintered tungsten carbide particles. Sintered tungsten carbide particles can be formed by mixing together a first powder that includes the relatively smaller tungsten carbide particles and a second powder that includes cobalt particles. The powder mixture is formed in a "green" state. The green powder mixture then is sintered at a temperature near the melting temperature of the cobalt particles to form a matrix of cobalt material surrounding the tungsten carbide particles to form particles of sintered tungsten carbide. Finally, macrocrystalline tungsten carbide particles generally consist of single crystals of WC.
Various techniques known in the art may be used to apply a hard-facing material such as that represented in FIG. 3 to a surface of a drill bit. A rod may be configured as a hollow, cylindrical tube formed from the matrix material of the hard-facing material that is filled with tungsten carbide particles. At least one end of the hollow, cylindrical tube may be sealed. The sealed end of the tube then may be melted or welded onto the desired surface on the drill bit. As the tube melts, the tungsten carbide particles within the hollow, cylindrical tube mix with the molten matrix material as it is deposited onto the drill bit. An alternative technique involves forming a cast rod of the hard-facing material and using either an arc or a torch to apply or weld hard-facing material disposed at an end of the rod to the desired surface on the drill bit.
Arc welding techniques also may be used to apply a hard-facing material to a surface of a drill bit. For example, a plasma transferred arc may be established between an electrode and a region on a surface of a drill bit on which it is desired to apply a hard-facing material. A powder mixture including both particles of tungsten carbide and particles of matrix material then may be directed through or proximate the plasma transferred arc onto the region of the surface of the drill bit. The heat generated by the arc melts at least the particles of matrix material to form a weld pool on the surface of the drill bit, which subsequently solidifies to form the hard-facing material layer on the surface of the drill bit.
When a hard-facing material is applied to a surface of a drill bit, relatively high temperatures are used to melt at least the matrix material. At these relatively high temperatures, atomic diffusion may occur between the tungsten carbide particles and the matrix material. In other words, after applying the hard-facing material, at least some atoms originally contained in a tungsten carbide particle (tungsten and carbon for example) may be found in the matrix material surrounding the tungsten carbide particle. In addition, at least some atoms originally contained in the matrix material (iron for example) may be found in the tungsten carbide particles. FIG. 4 is an enlarged view of a tungsten carbide particle 40 shown in FIG. 3. At least some atoms originally contained in the tungsten carbide particle 40 (tungsten and carbon for example) may be found in a region 47 of the matrix material 46 immediately surrounding the tungsten carbide particle 40. The region 47 roughly includes the region of the matrix material 46 enclosed within the phantom line 48. In addition, at least some atoms originally contained in the matrix material 46 (iron for example) may be found in a peripheral or outer region 41 of the tungsten carbide particle 40. The outer region 41 roughly includes the region of the tungsten carbide particle 40 outside the phantom line 42.
Atomic diffusion between the tungsten carbide particle 40 and the matrix material 46 may embrittle the matrix material 46 in the region 47 surrounding the tungsten carbide particle 40 and reduce the hardness of the tungsten carbide particle 40 in the outer region 41 thereof, reducing the overall effectiveness of the hard-facing material. Therefore, there is a need in the art for abrasive wear-resistant hardfacing materials that include a matrix material that allows for atomic diffusion between tungsten carbide particles and the matrix material to be minimized. There is also a need in the art for methods of applying such abrasive wear-resistant hardfacing materials, and for drill bits and drilling tools that include such materials.

This patent is subject to a terminal disclaimer.

Drilling tools having hardfacing with nickel-based matrix materials and hard particles


There are provided a coil component and a board having the same. The coil component includes: a magnetic body including a substrate having two cores, first and second coil parts disposed on one surface of the substrate and wound in the same direction, and third and fourth coil parts disposed on the other surface of the substrate to be spaced apart from each other; and first to fourth external electrodes disposed on outer surfaces of the magnetic body and connected to the first to fourth coil parts.

The present disclosure relates to a coil component and a board having the same.
Electronic products such as digital televisions, smartphones, and notebook computers, have commonly transmitted and received data in a high frequency (HF) band, and henceforth, it is expected that such information technology (IT) electronic products will be more frequently used in practical applications, since such devices are able to function independently and are also able to be connected to one another via universal serial bus (USB) or other communications ports to have multiple functions and high degrees of integration.
As smartphones have been developed, demand for highly efficient and highly functional small and thin power inductors able to operate at high levels of current has increased.
Therefore, currently, a 2016-sized product having a thickness of 1 mm has been used, instead of a 2520-sized product having a thickness of 1 mm commonly used in the past. Further, and it is expected that products will be further miniaturized to have 1608-size with a thickness of 0.8 mm.
Simultaneously, demand for an array having a reduced mounting area has also increased.
The array may have a coupled or non-coupled inductor form or a combination thereof, according to a coupling coefficient or mutual inductance between a plurality of coil parts.
Meanwhile, in a case in which a coupled inductor is able to decrease inductor current ripples while having the same output current ripples as those of a non-coupled inductor, the efficiency of an inductor array chip may be improved without increasing the size of a mounting area thereof.
In various applications, coupled inductors having a coupling coefficient of about 1.0 to 0.9 while having a certain degree of leakage inductance have been required, rather than non-coupled inductors.
Therefore, there is a need to manufacture an inductor array product capable of decreasing inductor current ripples by increasing a mutual inductance value while having a certain degree of leakage inductance that is not excessively low to decrease output current ripples.

Coil component and board having the same


A safety switch includes a cable having a first end connected to a cable translator moveable between a disengaged position and an engaged position, the cable having a second end for connection to a remote lock and power supply switch.

It is well known to provide a housing around dangerous electromechanical machinery, and to provide a lock on the housing to prevent unauthorized access of users to the electromechanical machinery. Often a power supply switch is integrated with the lock, so that whenever the lock is opened to allow access to the electromechanical machinery, the supply of power to the machinery is automatically interrupted thereby turning off the machinery.
Typically, the lock is provided on the exterior of the housing of the electromechanical machinery. This means that if a user of the machinery were to be accidentally locked inside of the housing, the user may become trapped, and furthermore may be in close proximity to the electromechanical machinery when it is operating.


A method of automatic configuration of a communications interface of an unknown data network, the method comprising connecting an Electronic Flight Bag (EFB) to the unknown data network, attempting to open communication ports, in response to attempting to open communication ports, receiving data from the unknown data network, determining, by a controller module, if the selected communications interface can interpret the received data, and operating the communications interface of the EFB in accordance with the selected communications interface.

For contemporary aircraft, an avionics 'platform' includes of a variety of elements such as sensors, data concentrators, a data communications network, radio frequency sensors and communication equipment, computational elements, operational or functional elements, and graphical displays. These components can share information with other components over the data communications network.
Transfer of data to and from components, or over the data communications network, can utilize specialized data networks, such as Aeronautical Radio Inc. (ARINC) compliant data networks, and can define standards or specifications for network operations, including data transmissions. Different aircraft or avionics platforms can further utilize different specialized data networks, or utilize a combination of different specialized data networks. Network components utilized to construct the data network can utilize a specialized data network protocol, hardware including relays, switches, communicative connections, and the like, to ensure performance of the network architecture for the specialized data, or under the performance of the network communications defined by various data network specifications.

Method and system for automatic configuration of a communications interface for a specialized data network of an aircraft


A method of encapsulating a plurality of IC chips attached to a lead frame strip that includes an outer frame and a plurality of vertical and horizontal connecting bars attached to the outer frame in a manner that defines a plurality of inner frames arranged in a matrix pattern within the outer frame, each inner frame including an area where an IC chip from the plurality of IC chips is attached. The method comprises, for each inner frame, encasing the IC chip attached to the inner frame along with a portion of the inner frame within a package cavity of a mold sized to form a single integrated circuit package; and injecting encapsulant material into each package cavity, where the encapsulant material is delivered to the package cavity through a series of runners and gates that includes at least one runner positioned on a plane above the lead frame strip, a lead frame runner positioned along a first connecting bar of the lead frame strip and a vertical gate that couples a runner positioned on a plane above the lead frame strip to the lead frame runner and wherein each lead frame runner delivers encapsulant material to a plurality of package cavities positioned adjacent to the lead frame runner.

1. Field of the Invention
The present invention relates generally to a method for encapsulating lead frame based packages. More specifically, embodiments of the invention pertain to a high density molded lead frame and a method for manufacturing the same.
2. Background Art
Recently developed packages for integrated circuit (IC) die or chips include the quad flat, no-lead (QFN) package and the dual flat, no-lead (DFN) package, which is essentially the same as a QFN package except it includes leads on two sides of the package instead of four. QFN and DFN packages are sometimes referred to within the semiconductor industry as micro lead frame (MLF) packages or a molded leadframe packages (MLP). FIG. 1 is a cross-sectional view of a simplified MLP 10. MLP 10 includes an IC die 12 attached to a die pad portion 14 of a lead frame by an adhesive 13. Bonding pads 18 are formed on the top of IC die 12 and connected to leads 16 of the leadframe by wirebonds 19. An encapsulant material 20 covers the package including IC die 12, wirebonds 19 and the upper surfaces of die pad 14 and leads 16. Die pad 14 and leads 16 are exposed on the bottom of the package thereby facilitating heat dissipation from IC 12 external to package 10 and decreasing the overall thickness of the package. A half-etched portion 17 is formed on the sidewall surface of die pad 14 and leads 16 to better mechanically secure the die pad and leads to the encapsulant material, which flows underneath half-etched portion 17.
MLP 10 is typically one of many IC packages formed in a matrix pattern on a lead frame strip, and MLP 10 is typically encapsulated using one of two different techniques, which can be referred to as block molding or matrix molding. Packages encapsulated using a block molding technique are typically separated from the lead frame strip using a sawing process while packages encapsulated using a matrix molding technique are typically separated from the lead frame using a punch process. To accommodate the different types of encapsulation and singulation processes, lead frame strips are specifically designed for one or the other.
One example of a suitable lead frame strip 30 that can be used for a block encapsulation process is shown in FIG. 2. Strip 30 includes an outer frame 32 having a plurality of positioning holes 34 formed thereon and a plurality of vertical and horizontal connecting bars 36 and 38, respectively, that form a plurality of inner frames 40 which are shown in more detail in FIG. 3, which is an expanded view of portion A in FIG. 2. Each inner frame 40 shown in FIG. 3 includes a die pad 14 and a plurality of leads 16 that surround the die pad. Die pad 14 is connected to the lead frame by tie bars, which are not shown for simplicity, and each set of leads 16 extends from one of the horizontal or vertical connecting bars towards its respective die pad 14.
Lead frame strip 30 includes four 9×9 matrices of inner frames 40, each of which will be made into an IC package to provide 81 separate IC packages per block. In a block encapsulation method, each matrix is encapsulated within a single block of encapsulation material and then singulated using a sawn technique. FIG. 4 shows a lead frame strip 30 having two encapsulation blocks 31a and 31b formed over matrices of IC packages within the area covered by blocks 31a and 31b. Also shown in FIG. 4 are two 9×9 matrices (31c and 31d) of inner frames 40 that have not yet been covered by encapsulation blocks. Each of blocks 31a–31d provides 81 separate IC packages after the encapsulation, singulation and additional steps of the package formation process are completed. A plurality of stress relief holes 42 are shown between each of blocks 31a–31d that help ensure accurate singulation during the sawing process.
An example of a lead frame 50 suitable for a matrix type molding process is shown in FIGS. 5 and 6. A matrix mold encapsulation process encapsulates each integrated circuit package within a separate cavity as opposed to using a single cavity to encapsulate an entire matrix as done in a block molding method. Matrix molding techniques are typically used when packages are separated from the lead frame strip using a punch singulation technique as opposed to a sawing technique. FIG. 5 shows an example of a portion of a lead frame strip 50 that can be used for a matrix molding encapsulation technique where each individual IC package is encased within a package cavity 54 of a mold. As shown in FIG. 5, space needs to be saved on the lead frame strip for runners 52 to be placed between the individual IC packages. During a standard transfer molding encapsulation process, encapsulant is melted and flows down the runners by the force of gravity. From the runners, the encapsulant then flows into gates 53 that lead to a cavity 54, which defines the shape of the plastic resin that makes up the bulk of each IC package. The encapsulant fills the cavity within the mold and, after the encapsulant cools and hardens, the mold can be removed leaving behind a partially formed package having encapsulant material covering the IC chip, wire bonds and leads (except for the portion used to make contact to an external device/board).
One problem with the well known transfer molding process described with respect to FIG. 5 is that providing space for the runners reduces the density of the packages that can be formed for a given size lead frame strip thus contributing to an overall cost increase in the MLP manufacturing process. Each runner 52 travels the length of the connecting bar it is positioned over and thus needs to be wide enough to allow for a sufficient amount of encapsulant to travel down the runner and fill the mold cavity for each package connected to the runner in a reasonable amount of time. This issue can be easily seen in FIG. 6, which is a simplified top plan view of the lead frame strip 50 that was only partially shown in FIG. 5. As shown in FIG. 6, lead frame strip 50 includes alternating thin vertical connecting bars 55 and thicker vertical connecting bars 56. Runners 52 are positioned over the thicker vertical connecting bars 56 (note FIG. 5 is rotated 90 degrees with respect to FIG. 6). The runner along connecting bar 56a provides encapsulant to the eighteen cavities in lead frame strip 50 adjacent to connecting bar 56a (shown within dashed line B, note that lead frame strip 50 has columns of packages nine rows deep).
Accordingly, improved techniques and method of packaging ICs, such as MLPs 10, are desirable.

Method for encapsulating lead frame packages


A requester-side autonomic governor is provided for a requester configured to send service requests to a service provider. For example, the requester and service provider may be disposed in a Service Oriented Architecture (SOA) architected system. A feedback loop, preferably a monitor portion of a Monitor, Analyze, Plan, and Execute (MAPE) loop, is configured to monitor responses to service requests. An autonomic governor mechanism limits the type and/or number of concurrent service requests according to a resource pool scheme, and dynamically adjusts a resource threshold of the resource pool scheme based on information provided by the feedback loop. In one embodiment, the resource threshold is reduced if more than a predetermined number of service requests generated time-outs, and is increased if more than a predetermined number of service requests are being held awaiting available pool resources and less than a predetermined number of service requests generated time-outs.

1. Field of Invention
The present invention relates in general to the digital data processing field and, more particularly, to a computer-implemented method, apparatus, and computer program product for implementing a requester-side autonomic governor in a Service Oriented Architecture (SOA) architected system.
2. Background Art
In the latter half of the twentieth century, there began a phenomenon known as the information revolution. While the information revolution is a historical development broader in scope than any one event or machine, no single device has come to represent the information revolution more than the digital electronic computer. The development of computer systems has surely been a revolution. Each year, computer systems grow faster, store more data, and provide more applications to their users.
Years ago, computers where stand-alone devices that did not communicate with each other, but today, computers are increasingly connected in networks and one computer, called a client, may request another computer, called a server, to perform an operation. With the advent of the global Internet, this client/server model is increasingly being used in online businesses and services, such as online commerce, banking, auction houses, stock trading, and information storage and retrieval. The client/server model is also used in local intranets.
Two current techniques for connecting clients and servers are called Service Oriented Architecture (SOA) and Utility Computing. A service-oriented architecture includes a collection of services, which communicate with each other. Typically, a service is a function that is well-defined, self-contained, and does not depend on the context or state of other services. The communication between the services may involve either simple data passing between two or more services, or may involve two or more services coordinating some activity.
Utility computing is a service provisioning model in which a service provider makes computing resources available to a customer as needed, and charges customers for a specific usage of the resource rather than a flat rate. Like other types of on-demand computing (such as grid computing), the utility model seeks to maximize the efficient use of resources and/or minimize associated costs. Another version of utility computing is carried out within an enterprise in a shared pool utility model. In the shared pool utility model, an enterprise centralizes its computing resources to serve a larger number of users without unnecessary redundancy.
In both the Service Oriented Architecture and Utility Computing, the client determines the server that is to receive and process a request, and the client may have multiple requests that it sends to multiple servers. Each server processes its received requests and sends responses to the client that originated the request.
An SOA can provide a consistent, re-usable method for integrating any type of information consumer with any business process or information provider. In the SOA, a set of services can be defined that provide application functions. These services can serve as an abstraction layer that hides core system details from clients and provides a simple way to integrate consumers and service providers based upon standardized protocols, such as XML, WSDL, and SOAP.
Service oriented architectures are characterized by the use of service invocations as the basic building block for distributed systems, whether those systems are loosely coupled or tightly coupled. A service invocation is a call for a service to be performed. Examples of service invocations include simple service invocations, such as instructions to get the current time in UTC; or service invocations to, given a metric unit of measure, produce the equivalent English system of measure. Other examples of service invocations include more complex service invocations, such as instructions to, given an item number, produce the quantity of that item which is stocked in a warehouse or retail store; or instructions to, given a list of items and a customer account number, place an order with a retail enterprise for those items on behalf of the referenced customer.
In an SOA, a client can invoke a service within a component to perform an operation and, optionally the client can receive a response. Invoked services can include, for example, business services configured to fulfill the needs of business customers, whether those customers are individual consumers or other businesses. The services can be grouped into various SOA components where each component can specialize in functions such as catalog management, shopping cart management, credit card transaction processing, sales tax computation and the like.
Typically, a provider of a synchronous service in an SOA has a limited amount of resources or requests that it can support at one time. Hence, one or more clients may simultaneously invoke a synchronous service and overwhelm the service provider with too many requests. Often there is no Message Queuing infrastructure in place to manage and/or control these requests. In some cases it is not possible to apply additional resources or modifications to the service provider. For example, the client, while interested in obtaining the service from the provider, may be an unrelated party with respect to the service provider and, hence, have little or no interest in increasing the provider's capacity. Moreover, the service provider may not find it cost effective to apply additional resources or modifications. In effect, the popularity of the service has caused the provider to experience Quality of Service (QOS) issues. These Quality of Service issues will likely impact the clients invoking the service and, perhaps, cascade to clients of those clients.
These Quality of Service issues may lead clients invoking the synchronous service to develop their own functionality similar to that of the service, especially in cases where demand for the service is increasing or is forecast to increase and/or the requesting application is to be rewritten. Typically, however, continued use of the existing service by the requesting application or re-use of the existing service by the rewritten requesting application is preferred because of the cost and delay that must borne in developing the functionality. In some cases, it may not even be possible for the client to develop the functionality.
Therefore, a need exists for an enhanced mechanism for invoking a synchronous service in a Service Oriented Architecture (SOA) architected system.

Computer-implemented method for implementing a requester-side autonomic governor using feedback loop information to dynamically adjust a resource threshold of a resource pool scheme

International Business Machines Corporation


A process is disclosed to increase the Z/E ratio of 1,2,3,3,3-pentafluoropropene. The process involves contacting a starting material comprising 1,2,3,3,3-pentafluoropropene with a catalyst on AlF3 or carbon, wherein the catalyst is selected from the group consisting of SbClwF5-w, TiClxF4-x, SnClyF4-y and TaCl2F5-z wherein w is from 0 to 4, x is from 0 to 3, y is from 0 to 3, z is from 0 to 4, to obtain a product wherein the Z/E ratio of 1,2,3,3,3-pentafluoropropene is increased relative to the Z/E ratio of 1,2,3,3,3-pentafluoropropene in the starting material.

1. Field of the Disclosure
The disclosure herein relates in general to processes for the catalytic isomerization between E and Z isomers of 1,2,3,3,3-pentafluoropropene (HFC-1225ye).
2. Description of Related Art
As a result of the Montreal Protocol phasing out ozone depleting chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs), industry has been working for the past few decades to find replacement refrigerants. The solution for most refrigerant producers has been the commercialization of hydrofluorocarbon (HFC) refrigerants. The new hydrofluorocarbon refrigerants, HFC-134a being the most widely used at this time, have zero ozone depletion potential and thus are not affected by the current regulatory phase out as a result of the Montreal Protocol. The production of other hydrofluorocarbons for use in applications such as solvents, blowing agents, cleaning agents, aerosol propellants, heat transfer media, dielectrics, fire extinguishants and power cycle working fluids has also been the subject of considerable interest.
There is also considerable interest in developing new refrigerants with reduced global warming potential for the mobile air-conditioning market.
HFC-1225ye, having zero ozone depletion and a low global warming potential, has been identified as a potential refrigerant. HFC-1225ye can also find use in other applications such as solvents, cleaning agents, foam blowing agents, aerosol propellants, heat transfer media, dielectrics, fire extinguishing agents, sterilants and power cycle working fluids. HFC-1225ye may also be used to make polymers. HFC-1225ye may exist as one of two configurational isomers, E or Z, which boils at different temperatures. Depending on the applications, HFC-1225ye may be preferably used as a Z isomer or a E isomer or a mixture thereof. The liquid phase SbF5 catalyzed isomerization of E-HFC-1225ye to Z-HFC-1225ye has been described by Burton et al. in Journal of Fluorine Chemistry, 44, 167-174 (1989).
There is a need for new catalytic isomerization processes for the isomerization between E-HFC-1225ye and Z-HFC-1225ye.

Catalytic isomerization between E and Z isomers of 1,2,3,3,3-pentafluoropropene

Abstract: A process is also disclosed to decrease the Z/E ratio of 1,2,3,3,3-pentafluoropropene. The process involves contacting a starting material comprising 1,2,3,3,3-pentafluoropropene with a catalyst on AlF3 or carbon, wherein the catalyst is selected from the group consisting of SbClwF5-w, TiClxF4-x, SnClyF4-y and TaClzF5-z wherein w is from 0 to 4, x is from 0 to 3, y is from 0 to 3, z is from 0 to 4, to obtain a product wherein the Z/E ratio of 1,2,3,3,3-pentafluoropropene is decreased relative to the Z/E ratio of 1,2,3,3,3-pentafluoropropene in the starting material.


An organic light emitting diode display device includes a first substrate including a display area, wherein a plurality of pixels each including sub-pixels is defined in the display area; a switching thin film transistor and a driving thin film transistor in each of the sub-pixels over the first substrate; light-blocking patterns in at least one of the sub-pixels; a color filter layer in at least one sub pixel; a first passivation layer over the switching thin film transistor, the driving thin film transistor and the light-blocking patterns; a first electrode in each of the sub-pixels over the first passivation layer; an organic light emitting layer on the first electrode all over the display area; and a second electrode on the organic light emitting layer all over the display area.

1. Field of the Invention
The present disclosure relates to an organic light emitting diode (OLED) display device. More particularly, the disclosure relates to an OLED display device having an improved image quality.
2. Discussion of the Related Art
An OLED display device of flat panel display devices, which may be referred to as an organic electroluminescent display device, has high brightness and low driving voltage. In addition, because it is self-luminous, the OLED display device has an excellent contrast ratio and a ultra thin thickness. The OLED display device has a response time of several micro seconds, and there are advantages in displaying moving images. Also, the OLED display device has wide viewing angles and is stable under low temperatures. Since the OLED display device is driven by low voltage of direct current (DC) 5V to 15V, it is easy to design and manufacture driving circuits.
Accordingly, the OLED display device has been widely used as a television, a monitor, a mobile phone, and so on.
Hereinafter, a structure of an OLED display device will be described in more detail.
FIG. 1 is a cross-sectional view schematically illustrating a pixel region of an organic light emitting diode (OLED) display device according to the related art.
The OLED display device 1 according to the related art includes an OLED substrate 10 having an array element and an organic light emitting diode E and an opposite substrate 70 for encapsulation.
The array element on the OLED substrate 10 includes a switching thin film transistor (not shown) connected to gate and data lines and a driving thin film transistor DTr connected to the organic light emitting diode E. The organic light emitting diode E includes a first electrode 47 connected to the driving thin film transistor DTr, an organic light emitting layer 55 and a second electrode 58.
Light emitted from the organic light emitting layer 55 is output through the first electrode 47 or the second electrode 58, and thus the OELD display device 1 displays an image.
At this time, the first electrode 47 is formed of a transparent conductive material having a relatively high work function such as indium tin oxide (ITO) and functions as an anode electrode. The second electrode 58 is formed of a metallic material having a relatively low work function and functions as a cathode electrode.
The related art OLED display device has a pixel consisting of three sub-pixels of red, green and blue.
To improve color display quality and brightness, an OLED display device having a pixel consisting of four sub-pixels of red, green, blue and white has been suggested.
FIG. 2 is a cross-sectional view illustrating part of an OLED display device having a pixel consisting of four sub-pixels according to the related art. FIG. 2 omits an opposite substrate and an array element and schematically shows a color filter layer 45 and an organic light emitting diode E. For convenience of explanation, white, red, green and blue sub-pixels of the pixel are defined as first, second, third and fourth sub-pixels SP1, SP2, SP3 and SP4.
In FIG. 2, the pixel P of the OLED display device 2 consists of four sub-pixels SP1, SP2, SP3 and SP4. A first electrode 47 as an anode electrode is formed at each of the sub-pixels SP1, SP2, SP3 and SP4. An organic light emitting layer 55 emitting white light is formed on the first electrode 47 all over a display area. A second electrode 58 as a cathode electrode is formed on the organic light emitting layer 55 all over the display area.
Here, red, green and blue color filter patterns 45a, 45b and 45c are formed under the first electrodes 47 in the second, third and fourth sub-pixels SP2, SP3 and SP4, respectively. At this time, although not shown in the figure, a black matrix is formed in boundaries of the color filter patterns 45a, 45b and 45c.
In the OLED display device 2, the organic light emitting layer 55 emits white light, and the white light passes through the red, green and blue color filter patterns 45a, 45b and 45c in the second, third and fourth sub-pixels SP2, SP3 and SP4 to produce red, green and blue light. Since a color filter layer is not formed in the first sub pixel SP1, the white light passes through the first sub pixel SP1 as it is, thereby expressing white.
At this time, to improve color purity and brightness of the red, green and blue light from the second, third and fourth sub-pixels SP2, SP3 and SP4, the first electrodes 47 of the second, third and fourth sub-pixels SP2, SP3 and SP4 have different thicknesses to cause a micro cavity effect.
For the micro cavity effect, the first electrode 47 has a double-layered structure of a lower layer 47a and a second layer 47b. The lower layer 47a is formed of a metallic material having relatively high reflectivity and a transmissive property at a relatively thin thickness such that selective reflection is made. The metallic material may be silver (Ag), for example. The upper layer 47b is formed of a transparent conductive material having relatively high work function. The transparent conductive material may be indium tin oxide (ITO), for example.
The micro cavity effect is a phenomenon that, by making a difference in thicknesses of material layers through which light passes, that is, optical distances, light emitted from the organic light emitting layer 55 is repeatedly selectively reflected between specific layers and light with changed spectrum and increased optical intensity is finally transmitted through the first electrode 47 or the second electrode 58.
Like this, by making a difference in the thicknesses of the first electrodes 47 at the sub-pixels SP2, SP3 and SP4, the OLED display device 2 may have the improved brightness and color purity because of the micro cavity effect.
At this time, if the first electrode 47 of the first sub pixel SP1 expressing white includes a lower layer of silver (Ag) with an upper layer of the transparent conductive material, the first sub pixel SP1 emits light with a specific wavelength range, and color coordinates fall through. Therefore, the first electrode 47 of the first sub pixel SP1 has a single-layered structure of indium tin oxide without the lower layer of silver (Ag).
Meanwhile, as shown in FIG. 3, which is a graph showing brightness of a related art OLED display device having the above-mentioned structure according to viewing angles, the brightness in the second, third and fourth sub-pixels of the related art OLED display device expressing red, green and blue is remarkably decreased according to the viewing angles due to the difference in the thicknesses of the first electrodes. On the other hand, the brightness in the first sub pixel of the related art OLED display device expressing white is slightly decreased according to the viewing angles because of the first electrode without a lower layer.
Accordingly, the OLED display device having the above-mentioned structure has low image qualities due to the difference in decreases of the brightness of the white sub pixel and the red, green and blue sub-pixels.

Organic light emitting diode display device


Mechanisms are provided for performing an operation on a received data packet. A data packet is received and a hash operation on a header field value of a header of the data packet is performed to generate a hash value. A lookup operation is performed in a hash table associated with a type of the header field value to identify a hash table entry. A bit string associated with the hash table entry is retrieved, where each bit in the bit string corresponds to a class of rules of a rule set of a firewall. A matching operation of the header field value to rules in classes of rules corresponding to bits set in the bit string is performed to select one or more search trees. Operations are performed based on rules in the classes of rules being matched by header field value of the data packet.

The present application relates generally to an improved data processing apparatus and method and more specifically to mechanisms for improving the performance of firewall packet filtering.
Packet classification is a function performed by modern Internet routers whose aim it is to classify packets into "classes" or "flows" according to an established rule set that looks at multiple fields of each packet. Once this classification is performed, different actions can be performed on the data packets depending on the results of the classification. One example of an algorithm that may be implemented by routers to perform such classification is the G-filter algorithm.
The "G-filter" algorithm is a packet filtering algorithm that supports fast matching of packet 5-tuples to a listing of firewall rules n-tuples (where n is less than or equal to 5). In the G-filter algorithm, each packet header has two addresses, two ports, and a transport protocol. Each firewall rule specifies ranges of values for one or more of these 5 fields. Thus, in the 5-tuple version of G-filter, each rule falls into one of 32 classes, depending on which tuple fields the rule matches. G-filter calls these classes "fallback sets."
For example, if two rules both regulate packets only by the packets' destination addresses and destination ports, the G-filter indicates that these two rules are in the same fallback set. If another rule regulates packets by destination address, destination port, and transport protocol, then G-filter indicates that this rule is in a different fallback set. It is convenient to label each fallback set of rules with a 5-bit string, in which each 1 bit identifies a tuple-dimension that all of the set's rules are associated with or care about:                0th bit: rules that match packets by source-address.        1st bit: rules that match packets by destination-address.        2nd bit: rules that match packets by source-port.        3rd bit: rules that match packets by destination-port.        4th bit: rules that match packets by transport-protocol.
G-filter builds a separate search-tree for each fallback set in a rule set. At packet matching time, G-filter searches every fallback set's search tree. More information about the G-filter algorithm may be found in Geraci et al., "Packet Classification via Improved Space Decomposition Techniques," IEEE 2005.


A scene is captured. A two-dimensional matrix comprising a plurality of image detection components is generated according to the captured scene. Each image detection component corresponds to one color component. A plurality of matrixes are generated according to the image detection components. One image detection component and a portion of matrixes are calculated to obtain the missing color components.

1. Field of the Invention
The invention relates to a processing method, and more particularly to a color interpolation processing method.
2. Description of the Related Art
FIG. 1a shows a structure for an image sensor module. Scene is captured by lens 11. A color filter array (CFA) 12 comprises color filters R, B, and G for acquiring color components. A charged-coupled device (CCD) 13 or an active pixel sensor (APS) comprises a plurality of pixel units. Each pixel unit transforms color components into electronic signals and stores the electronic signals.
One color component is acquired by one color filter. Thus, only one color component is available in each pixel unit such that the other two of the three color components are missing from each pixel unit. To completely display the scene 10, various color interpolation methods are utilized. The color interpolation methods determine the other two missing color components according to the filtered and stored color component.
One color interpolation method by S. C.Pei et al in IEEE Trans. Circuits and Systems for Video Technology, VOL. 13, NO. 6, June 2003 describes "Effective Color Interpolation in CCD Color Filter Arrays Using Signal Correlation".
FIG. 1b is a schematic diagram of the CFA. The color interpolation method disclosed by S. C. Pei et al obtains a missing G7 value according to a known R7 value. The missing G7 value can be recovered as (1).
                              G                                                              7                =                              R                                                                          7                    +                                    1              4                                                  (                                                                    K                    R                                                      3                                +                                                      K                    R                                                      6                                +                                                      K                    R                                                      8                                +                                                      K                    R                                                      11                                            )                                                          (        1        )
wherein, KR3 is defined as in (2), KR6 is defined as in (3), KR8 is defined as in (4), and KR11 is defined as in (5).
                                          K            R                              3                =                                            G                                                                                3                        -                          R                                                                                3                                =                                    G                                                                                3                        -                                          1                2                                                          (                                                      R                                                                                1                                    +                                      R                                                                                7                                                  )                                                                        (        2        )                                                      K            R                              6                =                                            G                                                                                6                        -                          R                                                                                6                                =                                    G                                                                                6                        -                                          1                2                                                          (                                                      R                                                                                5                                    +                                      R                                                                                7                                                  )                                                                        (        3        )                                                      K            R                              8                =                                            G                                                                                8                        -                          R                                                                                8                                =                                    G                                                                                8                        -                                          1                2                                                          (                                                      R                                                                                7                                    +                                      R                                                                                9                                                  )                                                                        (        4        )                                                      K            R                              11                =                                            G                                                                                11                        -                          R                                                                                11                                =                                    G                                                                                11                        -                                          1                2                                                          (                                                      R                                                                                7                                    +                                      R                                                                                13                                                  )                                                                        (        5        )
A missing B7 value can be obtained according to the missing G7 value defined by (1). The missing B7 value is calculated as
                              B                                                              7                =                              G                                                                          7                    +                                    1              4                                                  (                                                                    K                    B                                                      2                                +                                                      K                    B                                                      4                                +                                                      K                    B                                                      10                                +                                                      K                    B                                                      12                                            )                                                          (        6        )
wherein operations of KB2, KB4, KB10, and KB12 are similar to KR3, KR6, KR8, and KR11.
Although the missing value is obtained by the color interpolation method disclosed by S. C. Pei et al, the color interpolation method does not particularly take the edge pattern into account. Therefore, the method would induce the false colors and blur the pattern around the edges.
Another color interpolation method by X.Wang et al in ICICS-PCM 2003 describes "Edge-Adaptive Color Reconsruction for Single-Sensor Digital Camera".
The color interpolation method disclosed by X. Wang et al detects an edge pattern in a G channel and calculates a G value at R or B pixel in the edge pattern. Next, the color interpolation method utilizes a weighted method to calculate an absolute difference value between a horizontal direction of the G channel and a vertical direction of the G channel for obtaining an R value at an unknown R pixel and a B value at an unknown B pixel.
The color interpolation method disclosed by X. Wang et al usually detects the incorrect edge pattern such that the incorrect value is generated. Additionally, since the weighted method is more complex, the cost of the hardware is increased.
Another color interpolation method by Y. M. Wu et al in Image Analysis and Interpretation, 2004. 6th IEEE Southwest Symposium describes "Color Interpolation for Single CCD Color Camera". The color interpolation method utilizes a weighted method to calculate the unknown G, B, R values. The accuracy is higher, however, the cost of the hardware is higher.


A substrate cleaning apparatus includes a bath in the form of a vessel filled with a cleaning liquid, a substrate guide disposed on the bottom of the vessel and configured to support at least one substrate vertically, a first sensing unit for sensing the substrate(s) supported by the guide, and a second sensing unit for sensing substrates or remnants thereof disposed on the bottom of the vessel. The first sensing unit has sensor elements installed on the opposite sides of the vessel as situated across from one another. The second sensing unit has sensor elements installed on both sides and on the bottom of the vessel for detecting substrates or remnants from damaged substrates lying on the bottom of the process chamber.

1. Field of the Invention
The present invention relates to an apparatus for detecting the presence or absence of a semiconductor wafer or other type of substrate, such as liquid crystal glass substrate, at a station in equipment for processing the substrate.
2. Description of the Related Art
A wet station typically comprises one and more baths filled with DI water or chemicals, and a substrate guide to supply a plurality of substrates to the baths. The substrates are cleaned while being moved sequentially among the baths. Also, a light-sensing unit is installed on each bath in order to detect the substrates that enter and leave the bath. The light sensing unit comprises a light emitting element and a light-receiving element disposed at opposite sides of the bath.
One conventional apparatus for detecting the semiconductor wafer in a semiconductor wet station is disclosed in Korean Laid-Open Utility Model No. 1999-0038610. The semiconductor wet station is constituted by a chemical bath and a de-ionized water bath to remove alien substances from the wafer. The semiconductor wet station also comprises a wafer detecting unit capable of detecting the wafers that enter and leave the chemical bath and the de-ionized water bath. The wafer detecting unit includes light-emitting and light-receiving elements disposed on the bottom of side walls of each bath.
These light-emitting and light-receiving elements of the wafer detecting apparatus are oriented to detect only the presence or absence of semiconductor wafers that are disposed upright at the bottom of the bath. That is, the conventional wafer detecting apparatus cannot detect for the presence of material lying on the bottom of the baths even though it is installed on a bottom portion of the bath.
Another conventional apparatus for detecting semiconductor wafers at a wet station is disclosed in Japanese Laid-Open Patent Publication No. 2000-124293. The wet station comprises a process vessel having transparent sidewalls. The apparatus for detecting semiconductor wafers includes a light sensor installed on the sidewalls of the process vessel, the sensor being oriented to detect for the presence of the upright wafers in the vessel.
However, the conventional wafer detecting apparatus can not detect wafers or damaged parts thereof that remain at the bottom of the process vessel. Accordingly, the wet station continues to operate even if wafers or damaged parts thereof remain at the bottom of the process vessel. Thus, wafers continue to be damaged and contaminated by remnants, thereby lowering the manufacturing yield.


An EL display is provided with EL segments which are individually illuminable and which include one or more complete function key images and/or fragments of complete function key images. One or more of the EL segments may thus be illuminated to present multiple, different user interfaces each having one or more complete function key images. A complete function key image presented as part of a user interface may be a complete key image that was included as part of an illuminated EL segment or may be formed by a combination of key image fragments included as part of multiple illuminated EL segments.

This invention relates generally to devices having displays and, more particularly, relates to a remote control having a display with multi-function electroluminescent ("EL") segments.
Devices having EL displays are known in the art. By way of example only, PCT patent application WO 00/72638, entitled "electroluminescent display," discloses an EL display comprised of a transparent front-electrode, rear electrodes, and a layer of electroluminescent material located between the first and second electrodes. Conductive tracks are electrically connected to the rear electrodes and supply a driving voltage for the electroluminescent material to the rear electrodes. A backplane layer is provided between the electroluminescent material layer and the conductive tracks are electrically connected to the front electrode, such that the potential difference across the electroluminescent material layer in the region of the conductive tracks is substantially zero. In this way, when the conductive track is supplying the driving voltage to the rear-electrodes the electroluminescent material layer is not illuminated by an electric field between the conductive tracks and the front electrode. Gaps may be defined in the front electrode corresponding substantially to the location of the conductive tracks. This also prevents the voltage in the conductive tracks from illuminating the electroluminescent material layer.
It is further known to utilize such an EL display in a universal remote control of the type for controlling the operation of various appliances of various types and various manufacturers. In this regard, commonly assigned U.S. patent application Ser. No. 10,410,103, entitled "Remote Control With Screen Guided Display," discloses a universal remote control having an EL display where various segments of the EL display are independently illuminated at various times to present the user with a remote control user interface that corresponds to an activity currently being performed by the user. In particular, the segments that are individually illuminable correspond to an entire key image, e.g., an image representing a transport command such as play, fast forward, rewind, etc., and/or blocks of entire key images.
While a universal remote control having an EL display that can be selectively illuminated to provide multiple remote control user interfaces is desirable, it is seen that increasing the number of individually illuminable EL segments in the EL display also increases the overall manufacturing cost of the universal remote control. Accordingly, a need exists for a universal remote control that has an EL display that can be selectively illuminated to provide multiple remote control user interfaces and which can be manufactured in a relatively more cost effective manner.

Remote control having a display with multi-function EL segments


A scroll compressor is provided with a housing having a discharge chamber to which a high-pressure refrigerant is discharged from a scroll unit, a discharge path connecting the discharge chamber and an outlet port 78 of the housing, a separating device arranged in the discharge path and separating a part of the lubricating oil from the refrigerant, and a relief valve arranged in a downstream side of the separating device in the discharge path. When a pressure within the discharge path exceeds a relief pressure, the relief valve is opened so as to eject the refrigerant to an outer side of the compressor from the discharging path.

1. Field of the Invention
The present invention relates to a compressor, and more particularly to a compressor arranged in a refrigerating circuit for an air conditioning system of a vehicle.
2. Description of the Related Art
This kind of compressor is used for compressing a refrigerant serving as a working fluid. In general, the refrigerant contains a mist-like lubricating oil, and the lubricating oil serves for not only lubricating sliding surfaces in the compressor, bearings and the like, but also sealing sliding surfaces in the compressor. However, in the case that the lubricating oil contained in the refrigerant is more, the lubricating oil causes to lower refrigerating performance of the refrigerating circuit.
A compressor disclosed in Japanese Unexamined Patent Publication No. 11-82352, therefore, includes a discharge chamber to which a compressed high-pressure refrigerant is discharged, an outlet port for discharging the refrigerant to a circulating path outside the compressor from the discharge chamber, and a separating device for separating the mist-like lubricating oil from the refrigerant, and the separating device is arranged in a delivery path extending to the outlet port from the discharge chamber. In more detail, the separating device includes a separating chamber forming a part of the delivery path, and the separating chamber receives the high-pressure refrigerant from the discharge chamber. The lubricating oil in the refrigerant is partly separated from the refrigerant in the separating chamber on the basis of centrifugal separating effect. The separated lubricating oil is stored in an oil storage chamber, and the oil storage chamber is arranged in a lower side of the separating chamber.
On the other hand, the compressor further includes an intake chamber for supplying the refrigerant to a compression chamber thereof, and the lubricating oil in the oil storage chamber is returned into the intake chamber, and is mixed into the refrigerant in the intake chamber as oil mist.
When the compressor has the separating device therein, an amount of the lubricating oil in the refrigerant discharged to the circulating path from the compressor is small, and it is possible to avoid the refrigerating performance of the refrigerating circuit from being lowered.
As mentioned above, since it is necessary that the separating chamber of the separating device and the storage chamber are secured in the compressor together with the discharge chamber, it is unavoidable that a volumetric capacity of the discharge chamber becomes necessarily small in the case that size of the compressor is fixed.
Further, in order to improve the separating performance of the lubricating oil, it is necessary to accelerate flow speed of the refrigerant introduced into the separating chamber from the discharge chamber. Therefore, the cross sectional area of a jet hole which connects the discharge chamber and the separating chamber has a small.
Further, in order to well lubricate the sliding surfaces and the bearings in the compressor, it is preferable to increase an amount of the lubricating oil returned to the intake chamber. To this end, a lot of lubricating oil is stored in the oil storage chamber.
For the reasons mentioned above, in the case that a load of the compressor, that is, a discharge amount of the high-pressure refrigerant into the discharge chamber is increased, pressure in the discharge chamber is exponentially increased, thereby instantaneously exceeding an allowable maximum discharge pressure of the compressor which causes compression of the lubricating oil in the refrigerant.
On the other hand, the compressor is provided with a relief valve in the discharge chamber, and the relief valve can limit discharge pressure in the discharge chamber to the allowable maximum discharge pressure or less.
However, when an impact pressure such as to instantaneously exceed the allowable maximum discharge pressure is frequently generated in the discharge chamber, the relief valve is erroneously operated so as to be opened every time when the impact pressure is generated, so that the refrigerant including a lot of lubricating oil is ejected to an outer side of the compressor, that is, to an outer side of the circulating path from the discharge chamber. Accordingly, since the refrigerant and the lubricating oil in the circulating path are both reduced, the refrigerating performance of the refrigerating circuit is significantly lowered, and the lubrication in the compressor runs short, whereby malfunction of the compressor is caused.
In order to avoid an improper operation of the relief valve, there can be considered that the relief valve is arranged in the oil storage chamber. However, since a lot of lubricating oil is stored in the oil storage chamber and space above a liquid surface level of the lubricating oil is reduced, the impact pressure generated in the discharge pressure is directly propagated in the space, and the relief valve is improperly operated. In this case, since the lubricating oil is ejected to an outer side of the circulating path from the oil lubricating chamber together with the refrigerant, a lot of lubricating oil is lost from the circulating path.

Compressor including pressure relief mechanism


An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

1. Field of the Invention
This invention relates generally to electronic equipment, such as computers, and, more particularly, to apparatus and methods for reducing electromagnetic interference caused by integrated circuit devices.
2. Description of the Relevant Art
Many electronic devices such as integrated circuits generate undesirable amounts of electromagnetic interference (EMI) during operation. For example, processors mounted on printed circuit boards (PCBs) may cause electromagnetic radiated emissions by injecting high frequency current into the printed circuit board, which then couples, directly or indirectly, to neighboring integrated circuits and other components. Such coupling may interfere with the individual performance of the devices, and thus adversely affect the overall performance of the system. In addition, because of the negative effects of EMI, the level of acceptable radiated emissions is subject to strict regulatory limits. For these reasons, it is desirable to contain or suppress the EMI generated by an integrated circuit.
There are two major methods by which integrated circuits can produce radiation: heatsink coupling and power bus injection. Various components have been employed to mitigate one or both of these EMI coupling mechanisms in a system. Some solutions involve grounding a lid or heatsink on the component and/or building a Faraday cage around the EMI producing chip (e.g., a CPU). In addition, various components such as gaskets, skirts, panels, and doors may be included in a system to contain emissions. Such components represent an additional cost and potential point of failure, as they typically require a separate part that must be added to the printed circuit board or enclosure.
In some systems containing processors, the second harmonic of the processor operating frequency may be a significant contributor to EMI. The EMI effects may be a result of high frequency current generated by complementary metal-oxide semiconductor (CMOS) devices in the integrated circuit. As integrated circuit technology advances, processors operate at increased frequency and power, thus presenting even greater challenges in maintaining emissions within acceptable levels.

Interconnect design for reducing radiated emissions


A child restraint warning system configured to be secured to a child seat/carrier having a base, a seat detachably connected to the base, where the child seat/carrier includes a harness configured to be releasably secured with a latch. When the seat is secured on the base a seat position sensor sends a signal to a control unit positioned on the back of the seat. The control unit is switched into an active status for detecting an unlocked condition of the harness latch. A first series of audible warning signals is produced by the control unit if the latch remains unlocked for a pre-determined period of time. If the latch continues to be in an unlocked condition after the first series of warning signals the control unit generates a second series of signals, which can be spoken messages pre-programmed by the user.

The present invention relates to infant car seats and, more particularly, to a latch mechanism that connects the infant car seat to a base member in either a front-facing or a rear-facing orientation.
Every state in the U.S. has laws requiring that infants and small children be seated in car seats while riding in automobiles. Although the state laws differ in details they all take into consideration grim statistics: in 2001, there were 44.642 injuries from motor vehicle accidents for children three years old and younger, and that grows to 76,248 injuries for children four to eight years of age. Although injuries from motor vehicle accidents aren't tracked as to whether or not a child was riding in a car seat, it is likely that this increase in injuries for older children was because they are less likely to be in a proper child safety seat than a younger child.
To address this problem, the industry takes steps to continually improve child restraint systems, be it an infant car seat or a booster seat for older children. Some of the car seats double in function—they can also be used as infant carriers that larches onto a base installed in a car. The assembly can use a four- or five-point harness. When used as a car seat, the carrier is locked with the base; when used as an infant carrier it is removed from the base and can be carried by the provided handle or locked with a stroller. Such seat-carrier assemblies are usually designed for infants weighing up to 20 pounds.
While the car seat/carrier system is designed for ease of operation it becomes somewhat difficult to ascertain whether the carrier has been properly latched to the base. If the carrier is not latched and locked the seat may disengage from the base and fail in its function of protecting an infant. The present invention contemplates provision of a child restraint system that warns a child caregiver that the infant seat has not been properly latched with the base.