A method of inspecting a photomask for a semiconductor integrated circuit formed based on drawing pattern data, includes the steps of classifying a drawing pattern of the semiconductor integrated circuit into a plurality of ranks in accordance with a predetermined reference and extracting the same, determining inspecting accuracy for each of the ranks, and deciding quality of the photomask depending on whether the determined inspecting accuracy is satisfied.

1. Field of the Invention
The present invention relates to a method of inspecting a mask pattern, an inspection apparatus, inspecting data used therein and a method of generating the inspecting data, and more particularly to the extraction and inspection of inspecting accuracy data in a process for inspecting a photomask.
2. Description of the Related Art
In recent years, a semiconductor integrated circuit device (hereinafter referred to as an LSI) in each product is evaluated as a key device, and an increase in the scale and speed of the LSI has been required in order to maintain the competitiveness of the product. A fine process is necessary with the microfabrication of an element and an increase in integration.
Under the circumstances, process conditions have been increasingly restricted in order to form a pattern as designed.
In the formation of the semiconductor integrated circuit device, an isolation is carried out over, the surface of a semiconductor substrate and a well having a desirable concentration is formed, and an impurity diffusion region having a desirable conductivity type is formed in the well, and furthermore, an insulating film is formed and a wiring pattern is provided.
For example, in the formation of the wiring pattern, a photolithographic step of forming a conductive film such as a polycrystalline silicon layer, an aluminum layer or a metal silicide layer and then carrying out exposure through a photomask to form a desirable mask pattern is carried out, and etching is performed by using the mask pattern as a mask, thereby forming the wiring pattern.
At the etching step, the conductive film exposed from the mask pattern is selectively removed. Even if various conditions such as the concentration and temperature of an etchant are optimized, an etching speed is varied depending on the density (area ratio) of the mask pattern, and further more, the peripheral length of the mask pattern. For this reason, accuracy in etching is varied depending on the density of the mask pattern or a pattern pitch. Even if a mask pattern region is excessively large or small, the accuracy in the etching is reduced.
Moreover, the formation of a diffusion layer also has the same problems. If an ion implantation region for forming the diffusion layer is too small, the concentration of the ion is generated so that a desirable diffusion profile cannot be obtained. Accordingly, the accuracy in the photomask for forming the mask pattern for diffusion is also very important.
In each process, a pattern is formed by using the photomask. The pattern accuracy of the mask pattern on the photomask greatly depends on the accuracy in the pattern formation in the process. Therefore, a demand for an enhancement in the accuracy has been increased.
Under the circumstances, at a defect inspecting step, necessary accuracy for a region which is to have the highest accuracy in a photomask to be inspected is acquired from a photomask designer and an inspection is carried out by using a value thereof as a reference value. Thus, an effort to reduce the defect of the photomask has been made.
For this reason, over one photomask, all regions are inspected based on the same inspection reference. Therefore, a defect set within such a range as not to originally influence an actual circuit operation is treated to be present, and correction or manufacture is carried out again. Consequently, there is a problem in that a time (TAT) required from an order to a completion is increased.
Moreover, the photomask is expensive. Therefore, a sudden rise in a cost caused by the necessity of a large number of photomask blanks for carrying out the manufacture again is also a serious problem.
In a recent process for manufacturing a semiconductor integrated circuit, moreover, there has been proposed a method of CMP (Chemical Mechanical Etching) for flattening the surface of a substrate. For example, this method serves to form an insulating film on a surface by a coating method of a CVD method and to then carry out chemical etching while performing mechanical polishing, thereby flattening the surface. In the case in which the pattern density of a wiring layer to be a lower layer is low and there is a region including a pattern having a predetermined area or less, however, the flattening cannot be carried out even if the insulating film is formed thickly. As a result, a region having no wiring pattern after the CMP becomes a concave portion so that a dent state is maintained.
In the case in which the layout pattern has a deviation, thus, sufficient pattern accuracy for the layer cannot be obtained. In addition, there is a problem in that the pattern accuracy of an upper layer is also influenced. Consequently, there is a problem in that the process accuracy cannot be sufficiently obtained.
Therefore, it is conceived to extract the area ratio of the mask pattern from the layout pattern of a semiconductor chip, additionally providing a dummy pattern to the layout pattern to adapt the area ratio of the mask pattern of a layer constituting the layout pattern in consideration of the optimum area ratio of the layout pattern of the layer obtained based on the process conditions of the layer, thereby setting the layer to have the optimum area ratio.
A photomask to be a very important element in such an increase in accuracy in a pattern is used through a defect inspecting step.
Also in the inspection, necessary accuracy in a portion in which the toughest accuracy conditions in the photomask to be inspected is acquired from the designer of the photomask and the inspection is carried out by using the data.
According to this method, it is possible to advance the inspection without specifying a place having the toughest portion in the creation and inspection of the photomask. Thus, a yield can be enhanced.
Description will be given to a conventional photomask inspecting flow with reference to the drawings.
FIG. 25 is a flow chart showing a conventional photomask inspection.
In this method, first of all, the pattern of a photomask is created based on a design rule (step 101). Next, the pattern of the photomask thus obtained is converted into data for photomask drawing and data are transferred to the manufacturing division of the photomask or another manufacturing company thereof so that a photomask is started to be actually manufactured (step 102).
The minimum value of the design rule of a pattern is specified as inspection accuracy data when the data are thus transferred (step 106).
On the other hand, the photomask manufacturing division or another manufacturing company thereof draws a pattern on a photomask blank by using the drawing data of the photomask formed at the step 102, thereby forming the photomask (step 103).
Next, the result of the pattern formation is decided based on the inspecting accuracy data obtained at the step 106 (step 104).
Then, it is decided that only the pattern formation decided to be within the range of the inspecting accuracy data is acceptable (step 105).
With the recent microfabrication of a process, however, a minimum pattern width and a minimum interval tend to be increasingly reduced. For example, consideration will be given to the case in which there is formed a photomask including patterns 210 to 213 having a minimum width which is arranged at a minimum interval 203 as shown in FIG. 26A and patterns 214 to 216 provided at a large interval 204 as shown in FIG. 26B. For example, it is assumed that the tolerance of a defect formed in a pattern having the minimum interval 203 is set to have a size represented by an allowable defect 201. At this time, in the case in which a pattern defect 206 having a smaller size than the size of the defect 201, it is decided that this is the tolerance at the inspecting step.
In the case in which there is a pattern defect 202 having a greater size than the size of the allowable defect 201, moreover, it is decided that the photomask is a defect in the inspection because the defect 202 is larger than the allowable defect 201 at the inspecting step.
However, the allowable defect 201 has one size in the same photomask and the same processing is carried out based on the allowable defect 201 in any region having a great pattern width.
For this reason, in the case in which there is the pattern defect 202 having a greater size than the size of the allowable defect 201, the interval 204 is much greater than the minimum interval 203 as shown in FIG. 26B. Therefore, it is decided that the defect 202 is also a defect at the inspecting step between the patterns 214 and 215. Even if such a defect is thus present in the region having a great interval in an actual design rule, however, there is no problem. In spite of the foregoing, a correcting step is started so that a step of carrying out an inspection again is added.
In the conventional method, thus, a demand for inspecting accuracy corresponding to the minimum interval 203 is given over the whole photomask. Therefore, it is decided that the defect 202 having such a size as not to make troubles is also a defect at the inspecting step.
Also in the case in which the same defect is generated and patterns might be actually short-circuited with each other, there is no problem when an adjacent pattern has the same node or a dummy pattern is formed for the purpose. Accordingly, it is not necessary to carry out the correction. However, the same defect is decided to be a defect in this case, the correcting step is started and the step of carrying out the inspection again is added.
Therefore, the inspection is executed with unnecessary accuracy so that a correction frequency is increased. Consequently, there is an obvious problem in that a reduction in a photomask creating period (TAT) and a decrease in the cost of creation are hindered.

Mask pattern inspecting method, inspection apparatus, inspecting data used therein and inspecting data generating method

Matsushita Electric Industrial Co., Ltd.


An extruder for melting plastic granules which is designed as a two-stage system in an integrated structural unit with an extruder chamber having an extruder screw in a heatable housing, as well as with a drying chamber having a heated conveying screw with displacement elements which dry the plastic granules and axially convey them to the extruder chamber without compression. In a preferred embodiment, the conveying screw has a larger diameter than the extruder screw, and displacement elements of greater depth than the extruder screw.

The present invention relates to an extruder for melting and extruding plastic granules of the type commonly used in the spinning of polymeric filaments.
In the extrusion of plastic granules, especially for a polymer that is suitable for use in a melt spinning process, the following process steps are usually involved; drying, feeding, melting, degassing and discharge of product. In the conventional systems the first process step, namely drying, is carried out by means of a drier and is generally performed independently of the actual extrusion, in a process that takes place continuously or also batchwise in a separate drying device. The spun-dry granules are then fed to an extruder in which the further process steps up to discharge of the product take place, the degassing being directly dependent on the degree of drying of the granules.
EP 0 134 977 B1 describes a device for removing volatile constituents from plastic materials, which for molding is conveyed through a plasticising screw and plasticised therein. This plasticising screw is arranged in a heated cylinder through which the particulate plastic material is fed. The plasticising screw comprises an actual plasticisation section and a conveying section arranged upstream of the latter. An additional conveying screw arranged upstream of this plasticising screw conveys the material to be extruded to a suction channel, from which it falls into the conveying section of the plasticising screw. Since the cylinder in which the plasticising screw operates is heated, and since through the work of the plasticising screw energy is supplied to the material to be extruded, volatile constituents escape, so that the granules are dried to a certain extent. These volatile constituents are removed, through the suction line, from the cylinder in which the plasticising screw operates. In order to ensure that these volatile constituents are removed, the conveying screw and the plasticising screw are driven so that only such an amount of granules is fed to the plasticising screw as to ensure that the latter is only partially filled in the region of the suction line, in other words in its conveying section.
As regards the efficiency of the drying of the granules, this known arrangement has inter alia the disadvantage that the granules are only indirectly heated. On the one hand energy losses thus occur, and on the other hand an additional device is furthermore necessary to ensure a reduced pressure for suctioning off the volatile constituents, which in turn requires additional energy. The known arrangement can therefore be used only to a limited extent for drying granules, and is better suited primarily for removing volatile constituents from the plastic material to be extruded.
It is accordingly an object of the present invention to provide an extruder that is of compact construction, which in addition to feeding, melting, degassing, and removing the resulting melt, can also effectively dry the plastic granules, and which furthermore is energy-saving and economical to operate.


The surroundings heat exchanger envelops an enclosure's insulation so that it exchanges part of its heat load directly through the enclosure, instead of indirectly with the surroundings which would then exchange an equal amount of heat with the enclosure. This reduces the temperature differentials required to drive heat a transfer because little heat remains to be transferred by the indirect path. This is augmented, in some cases, either by exchanging heat with media other than gas, comprising conductive solids or liquids, natural or forced convective liquid systems, or phase change systems comprising thermal storage or combination refrigeration/heat-pumping systems or combining the heat supplier of a refrigeration system with the heat absorber of a heat pumping system; or by avoiding unnecessarily high temperatures when pumping heat into hot water systems by either or both of the following means: regulating temperatures at lower set points or zoning heat pumps according to user need, which improves efficiency significantly, when heat is provided by heat pump, as it does not when heat is provided by electric resistance heating or combustion of fossil fuel.

1. Field of the Invention
The present invention relates to Refrigeration, and specifically to reducing costs, by increasing the effectiveness of Surroundings Heat Exchangers and by more efficiently recovering reject heat for water heating.
2. Prior Art
Refrigeration Systems are used for maintaining the contents of enclosed spaces, which are separated from their surroundings by the enclosing walls, at depressed or elevated temperatures. In some cases the functions of refrigeration and heat pumping are combined to keep the contents of one or more enclosed spaces at depressed temperatures while also keeping the contents of one or more other enclosed spaces at elevated temperatures. The objective is frequently to delay deterioration of the contents of the enclosed space, to maintain enclosed spaces at comfortable temperatures for occupation by humans or other animals, or to adjust the temperature of materials in preparation for use. In the past said contents of said enclosed spaces have been maintained, at the desired temperatures, using Surroundings Heat Exchangers, maintained at temperatures greater (in the case of refrigeration systems) and less (in the case of heat pumping systems) than those of the surroundings immersed in the surroundings, which exchange heat with said surroundings. Said heat transfer is required to counteract heat which is transferred (by conduction, convection or radiation) through the enclosing walls, which are normally insulated, in addition to heat transferred along with material exchanged between the surrounding space and the enclosed space and heat generated or absorbed within the enclosed space (e.g. by chemical reaction or electric heater). Frequently the surroundings comprise gasses, such as air, and said heat is frequently exchanged between the Surroundings Heat Exchangers and said gasses. The heat transfer coefficients between solid heat exchange surfaces, and gasses are very low, as is well known to workers in the heat transfer field. Since the heat flow rate is approximately proportional to the product of said coefficient, the heat exchange area, and the temperature differential, it is necessary to maintain a large temperature differential in order to drive the heat exchange between Surroundings Heat Exchangers and gaseous surroundings. The alternative of providing large heat transfer surfaces is limited by cost and available space. The maintenance of said large temperature differentials, for heat transfer, results in large differences between the temperatures of the Heat Supplier and the Heat Absorber of the Refrigeration System. As is well known to workers in the field of refrigeration, the efficiency of Refrigeration Systems increase as said temperature differences decrease. Consequently the maximum achievable efficiency of the Refrigeration System is adversely affected by the fact that the heat load must be transferred between said gas and said Surroundings Heat Exchanger. Typical residential refrigerators operate with heat supplier temperatures about 50.degree. F. above the temperature of the surroundings. Previous efforts to reduce the effect, of said low heat transfer coefficients, on efficiency, comprise those described in the "Prior Art" section of my application Ser. No. 08/030,734 filing date Mar. 6, 1993, as well as the Enclosure Heat Exchanger improvements disclosed in said application. Reject heat from residential type air conditioning is used for residential type water heating in commercially available equipment. This practice, although beneficial, is of limited value because the real time supply of waste reject heat from air conditioning systems is typically poorly correlated with the real time demand for heat for water heating. The use of reject heat from residential type refrigerators for residential type water heating, has been described in my application Ser. No. 08/030,734 filing date Mar. 6, 1993. The rationale for that invention includes improved efficiency, due partly to reduced temperature differences between heat supplier and absorber, substantially to the minimum temperature difference at which the insulated enclosure, the heat absorber or heat supplier, comprising given largely enveloping construction, could maintain a given space at a given temperature, within given surroundings at given temperature, in the absence of other heat absorber or heat supplier, (made possible by enveloping heat exchangers or avoidance of, notoriously poor, gas side heat transfer characteristics, or both), but other important factors comprise; the typical good match, in both quantity and temperature, between the reject heat available and the heat required for water heating; the typical proximity of the two appliances involved; and excellent real time correlation between supply and demand. Although the above referenced contributions have improved the performance of refrigeration systems, and in some cases have increased efficiency, or in other ways reduced operating costs, none of them have achieved or fulfilled the objectives of the present invention; one of which is to reduce operating costs, by reducing the temperature difference between the Surroundings Heat Exchanger and the Enclosure Heat Exchanger, by reducing the temperature differentials required for heat transfer, by use of Enveloping Surroundings Heat Exchangers; and the second of which is to improve the efficiency of water heating heat pumps by segregating the water either by the heat pump zone or by both the heat pump zone and the usage stream.

Refrigeration efficiency improvement by reducing the difference between temperatures of heat rejection and heat absorption


A controller module is coupled to a plurality of application modules over a backplane. The backplane comprises a differential bus(s) having a TX and RX data signal, a differential clock signal, and a single ended collision detection line. The application modules transmit data to the controller module. The controller module retransmits a recovered version of the data back to the application modules over the collision detection line. Each application module compares the retransmitted data bits with the data bits it originally transmitted. If the data is not the same, a collision has occurred and the application module removes itself from the bus. If the data is the same as that transmitted originally, that particular application module continues to transmit on the bus. Metastability at the controller module""s differential receiver enables multiple differential transmitters to be on the differential bus at the same time.

I. Field of the Invention
The present invention relates generally to circuit board intercommunication. More particularly, the present invention relates to detecting collisions over a differential bus in an electronic assembly.
II. Description of the Related Art
Backplane communication links can be very capacitive. A single ended transceiver that is capable of transmitting/receiving over a capacitive backplane may not be able to achieve the same data rates, reliability and ease of use as industry standard off the shelf differential transceivers. This may require single-ended bus circuits to be either on a single circuit board or a limited number of circuit boards very near each other. Single ended transceivers work well in a low capacitive environment.
One way around the impedance and distance limitations is to use differential transceivers to form a differential bus. Some types of differential transceivers are designed for multipoint data transmission environments and work reliably in the presence of noise. Various types of differential transceivers are available as off the shelf parts and require few external parts to function; this makes them easy to use, reliable and less prone to malfunction. The differential bus allows multiple circuit boards to communicate with each other at various distances that are greater than what could be achieved with a single-ended bus. The drawback to this scheme is that a differential bus does not support collision detection the same way a single-ended bus can. There is a resulting need for a high data rate differential bus that handles multiple circuit boards over long distances and can function over a backplane while still supporting collision detection.
The present invention encompasses collision detection over a differential bus. An apparatus using collision detection encompasses an electronic assembly with a differential bus(s). The assembly comprises a controller module and a plurality of application modules. The controller module and the application modules communicate over a common bus(s) structure.
In one embodiment, the common bus structure is comprised of a differential transmit signal, differential clock signal, two differential receive signals, a single ended collision detection line, and a single ended select line. The redundancy on the receive buses and the use of the single ended select line are not required for the invention since, in another embodiment of the common bus structure, these signals are not used. The controller module sources the clock and select signals over their respective backplane signals.
The controller module retransmits the data that is recovered by that module, transmitted from the application modules, over the collision detection line. The controller module does not know if a collision is actually occurring. The application modules determine if a collision is occurring by monitoring the collision detection line and comparing it to the data that was sent by that particular application module. No notification of a collision is transmitted between the controller module and the application modules or between the application modules.
The plurality of application modules are each coupled to the differential bus and the collision detection line. Each application module has a processor for controlling the application module and has a data packet controller for originally transmitting the data packets over the differential bus to the controller module.
If a collision is detected on the differential bus, the particular application module experiencing the collision is removed from the bus by placing its three state bus drivers into a high impedance state. These drivers are controlled by the bus access control logic on that particular application module. The methodology used by the bus access control logic on the application module will depend on the type of differential transceivers used to implement the differential bus and the capabilities of the data packet controller on the application module.

Collision detection on a differential bus


A method of operating an internal combustion engine system includes passing exhaust gases from an engine to an aftertreatment device such as a particulate filter at an exhaust temperature less than a target temperature, and increasing a temperature of exhaust gases passing through the aftertreatment device to the target temperature by controllably restricting exhaust flow upstream the filter. The method still further includes generating a signal indicative of exhaust back pressure and reducing exhaust pressure by selectively reducing airflow to the engine responsive to the signal. An internal combustion engine system and associated control system includes an electronic control unit configured to selectively increase a temperature of exhaust gases passing through a particulate filter to a regeneration temperature via a variable flow restriction device. The electronic control unit is further configured to reduce exhaust pressure upstream the flow restriction device by commanding adjusting an intake airflow control element for the engine responsive to a signal corresponding to exhaust back pressure.

A wide variety of engines, notably compression ignition diesel engines, have a tendency to generate undesired amounts of particulate matter such as soot and ash during operation. It has become almost universal to equip such engines with particulate filters to limit the extent to which soot particles, etc. are discharged during operation. A wide variety of designs for such filters are known, some of which have met with significant commercial success. One feature of all common filter designs on the market is that they tend to clog with trapped particulates over time. It is common for diesel particulate filters to become at least partially clogged with particulates after only a few hours of engine operation. Once particulates accumulate beyond a certain point, engine operation can become compromised.
To continue operating an engine or machine associated with a particulate filter which has become clogged, it is typically necessary to "regenerate" the filter. In other words, something must be done to remove the particulate matter clogging the filter, other than discharging the undesired material into the environment. Certain machines with an internal combustion engine have a duty cycle wherein the engine is operated at a relatively high power output, resulting in exhaust temperatures high enough to "burn off" the clogged particulates. Other machines having lower range duty cycles tend to predominately produce lower temperature exhaust which is rarely, if ever, sufficient to initiate combustion of accumulated particulate matter. Regardless of duty cycle, it is increasingly common to equip engine systems with some auxiliary means for regenerating their particulate filters when needed. One common strategy relies upon the application of auxiliary heat to combust the particulates trapped in the filter, so that the particulate material is consumed while the gaseous combustion products are discharged. Electric heaters, injection of fuel into the exhaust system upstream of the filter, and various other strategies are used for this purpose.
A relatively more recent strategy utilizes heat from the exhaust itself to raise the temperature of the particulate filter and the particulate matter trapped therein to a temperature sufficient to initiate combustion and consequent consumption of the particulate matter. A component known in the art as a variable geometry turbine has been used for this purpose. Variable geometry turbines typically include turbine vanes or movable walls whose position/orientation can be adjusted to restrict flow of exhaust gases through the turbine. As a result, the pressure and thus temperature of the exhaust gases can be increased to initiate combustion and enable burning off of particulate matter in the filter. Systems are also known wherein the air to fuel ratio of the mixture burned by the engine is enriched to increase the temperature of the exhaust gases for regeneration of an associated filter. Relying on either of these strategies has proven to have various drawbacks. On the one hand, adjusting the air to fuel ratio of the engine may be insufficient by itself to raise the temperature of exhaust gases sufficiently to combust particulate matter in the filter. On the other hand, use of the variable geometry turbine strategy alone may also be ineffective, and can cause pressures in and downstream of the engine to increase above that which certain engine systems are designed to accommodate.
U.S. Pat. No. 6,981,370 to Opris et al. is directed to a method and apparatus for regeneration of a particulate matter filter in an exhaust system. Opris et al. disclose an engine system and operating method wherein a throttle valve positioned upstream of the engine is partially closed to reduce the amount of air entering the engine cylinders. Reduction of air is stated to result in a richer fuel/air mixture which in turn increases exhaust gas temperatures. The throttle valve is controlled in cooperation with an "extended open duration" of an intake valve to reach a desired exhaust temperature for filter regeneration. While the strategy set forth by Opris et al. may work quite well, it can be desirable in other instances to regenerate a filter without relying upon use of a variable valve control strategy.
The present disclosure is directed to one or more of the problems or shortcomings set forth above.

Engine system, operating method and control strategy for aftertreatment thermal management


A computer system includes a processor, a communication interface, and a database. The communication interface is configured to receive, from a computing device, a coupon request message, wherein the message includes a first unique coupon program ID. The processor is programmed with computer-executable instructions that cause the processor to extract, from the coupon request message, the first unique coupon program ID. In addition, the processor matches the first unique coupon program ID to a second unique coupon program ID stored in the database. Furthermore, the processor generates, by a token service system, a digital coupon token. The digital coupon token is associated with the first and second unique coupon program IDs. Moreover, the processor is programmed to transmit the digital coupon token to the computing device.

Coupons are used to attract consumers to merchants and influence spending. Merchants often use coupons to lure consumers to visit a physical location, and sometimes will provide additional coupons to a consumer after a transaction in order to encourage repeat business. However, merchants lack necessary technology for validating coupons and/or detecting fraudulent coupons.
Coupon fraud occurs whenever someone intentionally uses a coupon for a product that he/she has not purchased or otherwise fails to satisfy the terms and conditions for redemption. In addition, coupon fraud occurs when coupons are altered/counterfeited. The current coupon ecosystem relies primarily on manual validations of the coupons by comparing the coupons to a file of fraudulent coupons. Manual validation of coupons is prone to error, labor intensive, inefficient, and cost intensive. A fragmented ecosystem, poor standards, antiquated systems, and lack of innovation have created an inefficient coupon market with no single trusted party, and limited controls for fraud.

System and method for processing digital coupons


A thin visible and near IR absorbing plate is placed between the radiation source and the object to be processed in a rapid thermal processing system. The object is heated in part by the near IR and far IR radiation from the thin plate, and the material and optically induced heating inhomogeneities are reduced.

1. Field of the Invention
The present invention relates to an apparatus and a method for the rapid thermal processing (RTP) of sensitive electronic materials. The present invention reduces the thermal inhomogeneities introduced when the materials have inhomogeneous structure and optical absorption characteristics.
2. Description of the Prior Art
Rapid Thermal Processing (RTP) is a versatile optical heating method which can be used for semiconductor processing as well as a general, well controlled, method for heating objects or wafers which are in the form of thin sheets, slabs, or disks. The objects are inserted into a chamber which has at least some portions of the chamber walls transparent to transmit radiation from powerful heating lamps. The transparent portion of the walls is generally quartz, which will transmit radiation up to a wavelength of 3 to 4 microns. These lamps are generally tungsten-halogen lamps, but arc lamps or any other source of visible and/or near infra-red radiation may be used. The radiation from the lamps is directed through the transparent portions of the walls on to the surface of the object to be heated. As long as the objects absorb light in the near infrared or visible spectral region transmitted by the transparent portion of the walls, RTP techniques allow fast changes in the temperature and process gas for the different material processes and conditions. RTP allows the "thermal budgets" of the various semiconductor processing to be reduced, as well as allows the production of various metastable states which can be "frozen in" when the material is cooled rapidly.
RTP systems are relatively new. In the last 10 or 15 years, such systems were used only in research and development. The thrust of the work was increasing the temperature uniformity, and developing heating cycles and processes which decreased the thermal budget. Prior art RTP machines can heat unstructured, homogeneous materials in the form of a flat plate, and produce temperature uniformities across the plate adequate for semiconductor processing processes. However, when the material is not uniform and has, for example, non-uniform optical or material characteristics, relatively large temperature non-uniformities can occur. This is particularly injurious for a partially processed silicon wafer with various parts of devices implanted, etched, or grown on the wafer.
The temperature control in current RTP systems is mostly performed by monochromatic (or narrow wavelength band) pyrometry measuring temperature of the relatively unstructured and featureless backside of semiconductor wafers. The results of the temperature measurement are used in a feedback control to control the heating lamp power. Backside coated wafers with varying emissivity can not be used in this way, however, and the backside layers were normally etched away or the temperature was measured using contact thermocouples.
A newer method of temperature control is the power controlled open loop heating described in our U.S. Pat. No. 5,359,693, which patent is hereby incorporated by reference. This patent also discloses a method of producing relatively defect free material in RTP machines. The number integrated circuits using sub-half-micron technology has increased enormously since we filed for our patent, and the methods outlined are not sufficient to produce the necessary material quality. The structure dependent thermal and process inhomogeneities must be reduced to the absolute minimum physically possible.
Apparatus induced thermal inhomogeneities have been reduced in the last few years because of the demand for more uniform processing. Among the techniques used have been control of the individual lamp power, use of circular lamps, and rotation of the semiconductor wafers with independent power control.
The reduction of temperature non-uniformities due to non uniformities and structures on the material being processed, however, presents many more problems. Thin films on the surface of the heated structure can have constructive or destructive interference effects, and lead to large differences in power density absorbed, even though the incident radiation is absolutely uniform. Geometrical or chemical structures can also lead to non uniform energy absorption. For example, differing dopant levels lead to different absorption coefficients for particular wavelengths of the incident light.
These effects have been described in "Rapid Thermal Annealing--Theory and Practice", by C. Hill, S. Jones, and D Boys, NATO Summer school: Reduced Thermal Processing for ULSI, Boca Raton, Fla., 20 Jun. to 1 Jul. 1988. Other references include "Impact of Patterned Layers on Temperature Non-Uniformity During Rapid Thermal Processing for VLSI- Applications", P. Vandenabeele, K Maex, R. De Keersamaekker, 1989 Spring Meeting of the Materials Research Society, San Diego, Symposium B., Apr. 25-28, 1989; "Temperature Problems with Rapid Thermal Processing for VLSI- Applications", Dr. R. Kakoschke, Nuclear Instruments and Methods in Physics Research, B 37/38 (1989) pp. 753-759; and in Defect-Guarded Rapid Thermal Processing", Z. Nenyei, H. Walk, T. Knarr, J. Electrochem. Soc., pp. 1728-1733 140, No. 6, Jun. (1993).
Patents such as U.S. Pat. No. 4,891,499, hereby incorporated by reference, and EP 0 290 692 A1 give suggestions for making the uniformity better over the whole wafer, but do not deal with the structure induced inhomogeneities. The challenge is still the continuous improvement of the wafer to wafer temperature control for the better repeatability and the continuous improvement of the process homogeneity on the patterned frontsides of the wafers.
Japanese patent application 61-129,834 proposes quartz plates interposed between the quartz walls of the RTP chamber and the wafer. The plates transmit the short wavelength radiation from the lamps and absorb the (non-uniform) longer wavelength radiation from the hot walls of the chamber.
Japanese patent document JP A 60-211947 discloses an RTP system with an optical system arranged to keep all lamp light out of the pyrometer measuring system by absorbing it in a graphite plate.
Kanack et. al. , Appl. Phys. Lett. 55 2325 (1989) disclose a method of annealing contacts in GaInAsP by placing the InP substrate wafer between two silicon susceptor wafers.
The presence and reduction of structure induced inhomogeneities appears to be more complicated than has been presented in the literature. In fact, the reduction of structure induced inhomogeneities in RTP systems has physical limits.
In order to achieve rapid heating and high substrate temperatures, the color temperature of the lamps used in the RTP system must be much higher than the desired wafer temperature. In addition, the emitting surface area of the tungsten lamp filaments much smaller than the surface of the reflectors which distribute the light through multiple reflections in an RTP system, which requires even higher color temperature of the filaments of the lamp. A high color temperature has the disadvantage that the lamp emission spectrum is quite different from the emission spectrum radiated from the wafer. If the lamp and wafer emission spectra were the same, for example, varying absorption coefficients on the wafer would imply the same varying emission coefficients, so that if more light energy were absorbed in one place, more light energy would be radiated and the temperature would be substantially constant independent of the varying absorption constants. When the peaks of the incident energy spectra from the lamps and the radiant energy spectra from the wafer are far apart, the varying absorption constants are not balanced by identically varying emission coefficients.
In addition, identical thin film structures with different lateral dimensions will have different temperature time profiles since the thermal capacity of the neighborhood of the structure will have a larger effect for smaller area structures.
However, these "passive" structure determined inhomogeneities which are known in the literature have been neglected for small structures.
Chemical solid state reactions such as silicidization or oxidation and physical structure changes such as annealing of amorphous implanted silicon to crystal silicon are mostly exothermic processes. Some allotropic processes are, however, endothermic. These sources and sinks of energy are highly localized, and can lead to temperature inhomogeneities. We have, however, found nothing in the RTP literature that deals with such effects.
In conventional thermal processing, where the conductive or convective energy transfer is dominant and the heating rates of 1-10 C / minute are common, such structure induced temperature inhomogeneities are not important, because there is enough time for thermal conduction to "even out" such inhomogeneities. At heating rates of 10-1000 C/sec, however, such inhomogeneities can be important. In the usual RTP reactor, the wafer is heated at from 10-100 C/sec. When the desired temperature is reached, the temperature is usually held constant (steady state temperature) for a determined time. Multi step temperature time profiles can also be programmed into a modem system. Very great care is taken to test the wafer temperature homogeneity during this entire heating process, generally using unstructured wafers. Less care is taken to measure or take into account the structure generated inhomogeneities, and less effort is generally given to reducing them.
The "thermal reactions" often have their greatest reaction rate at the beginning of the "steady state" temperature period, and are usually finished in the next 10-100 seconds. Titanium and Cobalt silicide processes are a good example of such processes. Local temperature differences can be amplified under such conditions due to the rapid change of the optical properties of the new phase. In this case, such solid state reactions can proceed a different rates for different areas of material, and possibly for the smallest structures the reactions will not proceed to the desired point.
Most RTP machines have a thin rectangular quartz reaction chamber having one end open as sketched in FIG. 1. Chambers meant for vacuum use often have a flattened oval cross section. Chambers could even be made in the form of a flat cylindrical pancake. In general, the chambers are used so that the thin objects to be heated are held horizontally, but they could also be held vertical or in any convenient orientation. The reactor chamber is usually thin to bring the lamps close to the object to be heated. The reactor chamber is opened and closed at one end with a pneumatically operated door when the wafer handling system is in operation. The door is usually made of stainless steel, and may have a quartz plate attached to the inside. The process gas is introduced into the chamber on the side opposite the door and exhausted on the door side. The process gas flow is controlled by computer controlled valves connected to various manifolds in a manner well known in the art.
Reactors based on this principle often have the entire cross section of one end of the reactor chamber open during the wafer handling process. This construction has been established because the various wafer holders, guard rings, and gas distribution plates, which have significantly greater dimensions and may be thicker than the wafers, must also be introduced into the chamber and must be easily and quickly changed when the process is changed or when different wafer sizes, for example, are used. The reaction chamber dimensions are designed with these ancillary pieces in mind. Copending patent application Ser. No. 08/387,220, hereby incorporated by reference, teaches the use of an aperture in the door to regulate gas flow and control impurities in the process chamber.
The wafer to be heated in a conventional RTP system typically rests on a plurality of quartz pins which hold the wafer accurately parallel to the reflector walls of the system. Prior art systems have rested the wafer on an instrumented susceptor, typically a uniform silicon wafer.

Method and apparatus for rapid thermal processing


An electronic parts layout determination method enables manufacture of a wide variety of electronic products with enhanced efficiency and in a short time. For all kinds of electronic parts selected for the manufacture of all of the electronic products, the electronic parts are divided into a plurality of speed groups based on the allowable rotation speed limits of mounting heads during rotation of a rotary table. The speed groups are subjected to a sequencing procedure. Electronic parts used for manufacture of each type of electronic product are then classified into groups, each group including a different kind of electronic part. The resulting parts groups are further classified into subgroups, each subgroup corresponding to one of the speed groups. These subgroups of electronic parts are arranged in a specific order and electronic parts belonging to each speed group are arranged so that a part having a low frequency of usage is placed near a neighboring speed group.

1. Field of the Invention
The present invention relates to an arrangement method for optimizing the layout of electronic parts and components in a storage shelf structure of an automatic electronic parts mounting device and a method for manufacturing a product using such arrangement method.
2. Description of Related Art
An electronic parts mounting device for manufacturing various types of electronic products by mounting a plurality of electronic parts onto respective printed circuit boards includes a mounting unit for installing predetermined electronic parts on printed circuit boards and an electronic parts arrangement shelf unit for supplying electronic parts to the mounting unit. The mounting unit includes a rotary table that can rotate in a horizontal plane. This rotary table is provided with head units arranged around a loop and facing downwards for picking and moving predetermined electronic parts. Each head unit has a predetermined number of suction nozzles facing downwards in a loop arrangement for picking up electronic parts through suction action. The number of head units is determined in accordance with the number of types of electronic parts to be used.
The electronic parts are stored in the parts arrangement shelf unit (hereinafter referred to simply as "the shelf unit") in such a manner that the same type of electronic parts are always arranged at a predetermined position therein. The shelf unit slides horizontally to carry certain electronic parts toward an electronic part mounting position of the mounting unit, thereby allowing the suction nozzles to continuously mount the electronic parts on the printed circuit boards.
When arranging the necessary electronic parts in the shelf unit during the manufacture of electronic products using such electronic parts mounting device, it will be important to determine if the method of arranging such electronic parts in the shelf unit (determining which parts should be placed at which position of the shelf unit) meets the following conditions: (1) manufacturing time (production cycle time) for each electronic product is shortened; and (2) the number of electronic parts replacements when changing the type of electronic product to be manufactured is reduced. Productivity may be enhanced by properly determining the method for arranging the electronic parts in the shelf unit.
Conventionally, the electronic parts layout determination method of arranging the different kinds of electronic parts and components in the shelf unit has been determined merely upon workers' decisions for each product to be manufactured. This is troublesome and time-consuming since there are different layout methods for different products.
Meanwhile, in the electronic parts mounting unit, an allowable rotation speed limit of a head unit is set so that there will be no positional deviations or detachment of the electronic parts being carried from the suction nozzles due to rotation of the head unit. Because of this, it will be impossible to adequately meet the above conditions without taking account of the allowable rotation speed limit.
In addition, as the number of electronic products to be manufactured by one parts mounting device increases, the number of types of electronic parts to be used will increase accordingly. Thus, it will be very difficult for workers to determine the way of arranging the layout of electronic parts that will meet both conditions (1) and (2).

Electronic component layout determination method and a manufacturing method using the same


A snare drum having an improved resonant, sensitive and harmonic sound. The snare drum comprises a head end, a snare end is substantially circular at its head end while being increasingly larger in transverse cross-sectional shape proceeding from the head end towards the snare end. An indentation adjacent the head end allows a drum skin to be positioned within a hoop and tightened to secure the skin and hoop without binding.

This invention relates to a snare drum, and more particularly to an improved snare drum that has a small head, a larger base and that produces a resonant, sensitive and harmonic sound.
A musical drum consists of a cylindrical drum shell over the open ends of which drum heads are tensioned. Each drum head consists of a circular "skin" having a diameter slightly greater than the diameter of the drum shell and a hoop being secured to the periphery of the skin. The skin rests against an angular bearing edge of the drum shell with a hoop lying along side the outer surface of the drum shell.
Pressure is applied to the hoop in a direction away from the bearing edge in order to create tension on the skin. Pressure may be applied to the drum shell in a variety of ways, many of which involve the use of fittings or brackets secured to the drum shell and upon which a tensioning device for the skin may be secured. With this type of drum, as the pressure on the skin is increased, mechanical distortion of both the top and bottom hoops may occur. Further, with certain levels of pressure on the drum head, there may be a tendency for the drum brackets to be dislodged from the drum shell, thus altering the skin pressure. Still further, the adjustment of the skin by the brackets may also bind the skin so there will be uneven pressure on the skin thus altering the skin pressure and sound.
Tapered musical drums have been in existence for some time. U.S. Pat. No. 1,113,253 discloses a tapered, collapsible drum with a head smaller in diameter than its base. The body portion of the drum is flexible so that vertical supporting bars can be removed to allow the drum body to completely collapse or telescope, thus materially reducing the size of the drum and facilitating the conveyance or shipment of the drum. The taper of the drum, running from the smaller head to the larger base was designed purely for the function of collapsing the drum for transport.
There is a need for a tapered drum that is resonant, sensitive and harmonic while yet allowing the tensioning of the head to be accomplished in such a matter so that there are no dislodgings of the drum brackets, binding of the skin or other aberrations that would alter the skin pressure and quality of sound being emitted from the drum.


System and methods for stimulating cartilage formation at a first tissue site through a second tissue site is presented. The system includes a fluid source for supplying a therapeutic solution, a reduced pressure source for supplying reduced pressure, a fluid delivery manifold for deploying adjacent the first tissue site, and a vacuum manifold for deploying within the second tissue site. The fluid delivery manifold extends between a proximal end fluidly coupled to the fluid supply and a distal end having at least one aperture for delivering the therapeutic solution to the defect adjacent the articulating surface of the first tissue site. The vacuum manifold extends between a proximal end fluidly coupled to the reduced pressure source and a distal end having at least one aperture for delivering the reduced pressure to the first tissue site adjacent the opposing surface of the first tissue site.

1. Field of the Invention
The present invention relates generally to tissue treatment systems and in particular to the stimulation of cartilage formation using reduced pressure treatment
2. Description of Related Art
Clinical studies and practice have shown that providing a reduced pressure in proximity to a tissue site augments and accelerates the growth of new tissue at the tissue site The applications of this phenomenon are numerous, but application of reduced pressure has been particularly successful in treating wounds. This treatment (frequently referred to in the medical community as "negative pressure wound therapy," "reduced pressure therapy," or "vacuum therapy") provides a number of benefits, including faster healing and increased formulation of granulation tissue. Typically, reduced pressure is applied to tissue through a porous pad or other manifolding device. Unless otherwise indicated, as used herein, "or" does not require mutual exclusivity. The porous pad, often an open-cell foam, contains cells or pores that are capable of distributing reduced pressure to the tissue and channeling fluids that are drawn from the tissue. The porous pad often is incorporated into a dressing having other components that facilitate treatment. While reduced pressure therapy has been used to treat soft tissue injuries, such therapy has not been used extensively to promote, for example, cartilage regeneration.
Damage to cartilage through age, injury, wear, and metabolic disorders, such as osteoarthritis, affect millions of people throughout the world. Indeed, it is currently believed that 85% of all Americans will develop degenerative joint disease as a result of normal activities that damage cartilage. The gradual degeneration and destruction of articular cartilage, one of three different types of cartilage, may be due to trauma, structural deformation of the joints and being overweight. Articular cartilage is a highly organized avascular tissue composed of chondrocytes formed in an extracellular matrix. Articular cartilage is generally thin with an extremely low or insignificant blood flow and, as such, has a very limited ability to repair or heal itself Partial-thickness chondral defects, for example, cannot spontaneously heal. This tissue is extremely important to the normal, healthy function and articulation of joints. Articular cartilage enables joint motion surfaces to articulate smoothly with a very low coefficient of friction. It also acts as a cushion to absorb compressive, tensile, and shearing forces and, thus, helps protect the ends of bone and surrounding tissue. The clinical manifestations of cartilage damage or wear are often painful and debilitating, including swelling of the joint, crepitation, and decrease in functional mobility. As the condition worsens, pain may even limit minimum physical efforts and persist at rest making it difficult to sleep. If the condition persists without correction and/or therapy, the joint can be totally destroyed, leading the patient to major replacement surgery with a total prosthesis, or to disability. The complications of cartilage injury are multifold. For example, injured cartilage tends to cause additional damage to articulations and the articular surfaces. Damage to articular surfaces is linked to bone spur development, which further limits joint movement.
The other two types of cartilage are fibrocartilage and elastic cartilage. Fibrocartilage offers strength with flexibility while providing shock absorption against impact and tensile forces. Fibrocartilage may be found in several areas of the body including, the annulus fibrosus of the intervertebral discs and the meniscus located in the knee joint. Elastic cartilage may provide flexibility and structural support to portions of the body. Elastic cartilage may also be found in several areas of the body including, the outer ear, the larynx, and the epiglottis. Fibrocartilage and elastic cartilage may also be damaged from injuries or degeneration. The damaged cartilage may be painful and debilitating and may further result in cosmetic defects. Consequently, damaged cartilage can have sweeping effects on the body that may ultimately lead to a reduced quality of life.
Typically, the body cannot completely repair the cartilage. Cartilage is primarily composed of collagen fibers, proteoglycans and elastin fibers that form an extracellular matrix. The matrix is formed by specialized cells called chondrocytes. Chondrocytes are one of the few cell types that can survive with a minimal blood supply. However, when cartilage is damaged, the lack of an adequate blood supply to the chondrocytes results in an inability to regenerate new chondrocytes, a process that requires an increased amount of nutrients and access through the blood stream to other cells and proteins. Full thickness articular cartilage damage that exposes the subchondral bone or osteochondral lesions may generate a normal inflammatory response that repairs the cartilage, but the new fibrocartilage formation is functionally inferior.
Current techniques to inhibit or delay degeneration of joint cartilage include use of anti-inflammatory agents, chondrogenic stimulating factors, antirheumatics, systemics, viscoprotection and injection of depot steroids. Other methods to inhibit or delay degeneration of joint cartilage include implantation of chondrocytes or synthetic matrices. One method of treatment for cartilage damage is surgical intervention, with reattachment and reconstruction of the damaged tissue. None of the above methods are totally satisfactory, and those methods rarely restore full functionality or return the tissue to its native normal state. In addition, none of those methods are proven to regenerate cartilage in situ and in vivo.

Stimulation of cartilage formation using reduced pressure treatment


An example method is provided in one example embodiment and includes receiving first values associated with a host located in a first overlay domain; translating the first values to second values, the second values being local values in a second overlay domain; storing the second values and corresponding first values in a mapping table for the second overlay domain; and advertising the second values for the host in the second overlay domain.

Interconnecting the overlay networks of multiple organizations within a data network becomes a fundamental requirement, as overlay networks proliferate in number. The number of organizations having virtualized overlay networks continues to grow and the requirements on the mechanisms used to provide this interconnectivity in a scalable manner become critical to the success of these virtualized networks.
In the simplest interconnectivity model, an overlay would be fully terminated at the edge of an organization and mapped to a different overlay that is managed by either a peer organization or a service provider of data transit services. In either case, the edge devices between organizations must maintain the full state of all routes for all organizations that are peering to each other. As mobility becomes more widely adopted, the routing information for the different organizations becomes very granular and does not benefit from summarization in an edge device. The net result is an explosion in the amount of states and information that an edge device must maintain.

System and method for scalable inter-domain overlay networking


The invention relates to a method for selecting products, wherein with each product there is associated a data set with a plurality of product characteristics, wherein the selection of a product is performed based on criteria selected by a user relating to the characteristics, and wherein the selection is displayed on a graphic display unit.

The invention relates to a method for selecting products, wherein with each product there is associated a data set with a plurality of characteristics of the product, wherein the selection of a product is performed based on user-defined criteria relating to the characteristics, and wherein the selection is displayed on a graphic display unit.
Methods known so far for selecting products allow the user to perform a targeted search for individual products in a product group with the help of search functions. The products are classified based on their characteristics and data sets are generated for the individual products. The database generated in this manner can be searched by using various search algorithms according to the criteria inputted by the user. It happens frequently during searches in large databases that an exceedingly large number of products matches the search criteria inputted by the user which makes it very difficult for the user to make a selection.
One example for the aforedescribed selection method is the Internet sales offer from the company Amazon.com. This online merchant offers a variety of products via its Internet pages. The products are initially subdivided into product groups, such as for example books, music and various other products. The user has to first select the desired product group, whereafter he can search within this product group for all available products that are offered by the merchant Amazon.com. In addition to this first coarse product classification, the products are subdivided into individual categories. For example, the available book titles are here subdivided into categories, such as biographies, computer, money, community, children's books, youth books, art and culture, etc. When the user selects one of these product categories, he is offered by the merchant a selection of several products associated with this category. The user can again select certain sub-categories within a category. For example, under the category biographies, the sub-categories Federal Republic of Germany, DDR, important personalities, diaries or current events can be found. The user has the option to perform a hierarchical search in these sub-categories or to search the respective selected category, respective sub-category using key words.
If the user wishes to order a certain product from the goods offered by the merchant, then he has to describe this product with the search function so narrowly that the result of the search steers him to the desired product, or he has to search through the hierarchically arranged search trees of the product categories. Only at the end of his search will he get an idea if a search actually leads him to the desired product.
Another known sales offer is the sales offer in the Internet from the company Quelle. The selection method also enables the user to search within the available products by using a selective search query. Because of the company Quelle offers a large number of products, a search of all available products produces a confusingly large number of results. To support the user in his search and selection of the desired products, the offered products are already subdivided into specific categories, such as small appliances, home improvement, sports, fashion and consumer electronics. After the user has selected one of these categories, he can perform a more refined search within the sub-categories. For example, under the category consumer electronics, there are sub-categories photography, TV sets, DVD, etc. If the user looks for products for a DVD player, then he will certainly select the category DVD. In the category DVD, the products are again subdivided into the product categories DVD-software, sets, players. In the category software, the user now finds all available DVD movies and can select the desired product from the large number of offered products.
Disadvantageously, a search with search queries performed according to the aforedescribed state of the technology produces, one hand, an unmanageable large number of results. For the search to be successful, the user has to accurately describe the product he is looking for. On the other hand, the searches through the hierarchically constructed search trees are very time-consuming for the user, and the user only finds out at the end of the search if the correct product is among the selection.

Abstract: The object of the invention to simplify the selection process in such a way that the number of results is limited by simplifying the criteria for the characteristics, is solved by setting the criteria for the characteristics on at least two scales and setting the criteria on the scales with the help of at least one input device in conjunction with the graphic display unit.


A sheet-processing machine has a shaping device for processing sheets. The shaping device has at least one shaping point. The sheet-processing machine comprises at least one separating device. The at least one separating device is designed to remove at least one remaining piece from at least one sheet of the sheets. The at least one separating device is arranged downstream of the at least one shaping point along a transport path provided for transporting the sheets. At least one inspection device is arranged, downstream of the separating device in the transport direction of the sheets, to determine an actual state of the at least one sheet of the sheets. The invention additionally relates to a method for inspecting at least one remaining part of at least one sheet of sheets, which part has been processed by a shaping device, and to a method for inspecting at least one sheet of sheets.

A flat-bed die-cutting machine comprising an inspection device for monitoring the substrate for register errors and a sheet diverter for channeling out defective sheets is known from EP 3 064 327 A1.
A box production device comprising an inspection device for detecting the position of a slot, generated by a die-cutting device on a sample sheet, is known from EP 2 589 494 A1.
A method for identifying a single multiple-up copy, containing a print image of defective quality, on a printing substrate comprising several multiple-up copies is known from EP 1 727 679 B1. An inspection system records a picture of the printing substrate and compares data of the recorded image to a data set derived from stored data regarding the shape of the individual multiple-ups on the printing substrate.
A method for controlling, by closed-loop control, cut-off registers or color registers at a printing press is known from EP 1 759 845 A2. An actual value of a sheet, measured by an inspection device, is compared to a prepress-based desired value, and an actuating signal is ascertained based on the ascertained control deviation.
A device for checking the quality of a product composed of two corrugated cardboard portions is known from WO 2019/034289 A1, wherein the corrugated cardboard portions are connected to one another by a slot. The device comprises two cameras, each of which detects the slot of one side of the product in the delivery pile, and an evaluation device, which ascertains a deviation of the position of the slot from one side of the product relative to the other side.
EP 1 844 865 A1 shows an inspection system in a single-object sorting device comprising a cutting device and an identification sensor. A print sheet comprising multiple individual objects is divided into multiple individual objects by the cutting device. The identification sensor detects individual markings, whereupon a sorting decision for activating the diverter is made in a sorting electronics system.
DE 10 2012 023 391 A1 shows a device for printing a paper or film web using a die cutter for die cutting individual multiple-ups from the film and an ejector station. An inspection system is arranged between the die cutter and the ejector station, which detects and reads out a previously applied code that is assigned to a print image. A comparison of the read-out code controls an ejection of the die-cut multiple-up.
DE 196 53 927 C1 discloses a sheet processing machine comprising transverse and longitudinal cutting devices, inspection devices and a delivery device. A first inspection device checks the sheet for damage. A second inspection device inspects the front side of the sheet and a fresh edge of the sheet resulting from the trimmed end. A third inspection device inspects the back side and trimmed edges in the longitudinal direction and the trailing end of the sheet.
WO 2004/108428 A2 discloses a processing machine for producing bundled printed sheet articles. The processing machine comprises a rotary die-cutting device for processing substrate, downstream from which the articles are separated from a waste matrix. One or more inspection devices can be arranged along the transport path of the substrate.
DE 10 2017 208 744 A1 discloses a sheet printing machine comprising printing couples and a shaping unit that is configured as a shaping device and comprises a dedicated drive controllable by open-loop and/or closed-loop control. An inspection device for monitoring the print quality is arranged downstream from the printing couples.

Sheet processing machine, method for inspecting at least one remaining portion of at least one sheet processed by a shaping device, and method for inspecting a sheet


A rigging device includes an eccentric sleeve having a generally cylindrical shape and an eccentric bore disposed at an offset distance from a centerline of the eccentric sleeve. A pin has a shaft and a head disposed at a first end of the shaft and a retaining feature disposed at a second end of the shaft. The shaft is disposed within the eccentric bore. A lifting lug is realeasably mated to the shaft and disposed between the eccentric sleeve and the retaining feature.

While various configurations of piping systems exist, one embodiment mates system components by use of a flange at each end of a pipe, valve, bulkhead, or the like. A gasket material is disposed therebetween, and a plurality of bores are disposed around the perimeter of the mating flanges. In one configuration, a first flange has threaded bores configured to receive bolts, machine screws, or the like, and a second flange is a through-bore configured with a clearance fit between the aforementioned threaded fastener. When the head of the fastener is tightened against the face of the through-bore flange, the second flange is pulled into contact with the first flange. In another configuration, bores on both flanges are through-holes, and a bolt and nut combination clamps the two flanges into contact with the gasket. The relation between the two flange planes is optimally parallel, and the thickness of the gasket material prevents the flange faces from touching. The resulting gap of the completed joint may approach 0.25 inches.
The flanged pipe, caps, valves, or other flanged accessory will be fabricated by selecting materials and dimensions that will support the pressure and structural considerations of the system. This will often result in heavy and unwieldy components that require (or at least benefit from), mechanical lifting aids. Slings, chains, and cables may be employed with overhead lifting aids and other rigging apparatus.
The state of the art requires that a lifting eye be welded to the face or edge of the flange. This eye results in a an undesirable protuberance, necessitates the use of a certified welder with accompanying weld quality testing, and significant time and money may be expended to prepare for the assembly of each flanged component.
Therefore there exists a need for attaching lifting apparatus to blind flanges, without welding and without interfering with the flange bolting process.

The United States of America as represented by the Secretary of the Air Force


A surface scan measuring device, a surface scan measuring method, a surface scan measuring program and a recording medium storing such a program which can appropriately adjust the scanning speed, the sampling pitch and other measurement parameters according to the surface condition of a workpiece are provided. The surface scan measuring device includes a radius of curvature computing section (543) for computing the radius of curvature of the scanning point from the measurement data acquired during the ongoing scanning operation, a moving speed deciding section (544) for deciding the moving speed of the scanning probe according to the computed radius of curvature and a sampling pitch deciding section (546) for deciding the sampling pitch according to the computed radius of curvature.

1. Field of the Invention
The present invention relates to a surface scan measuring device, a surface scan measuring method, a surface scan measuring program, and a recording medium. More specifically, the present invention relates to, for example, a surface scan measuring device for measuring the form of the surface of a workpiece along with the roughness, the waviness, the contour and other surface texture of the workpiece,
2. Description of Related Art
Conventionally, a roughness measuring machine, a contour measuring machine, a roundness measuring machine, a coordinate measuring machine and the like are known as a measuring machine for measuring the surface texture and the three-dimensional profile of a workpiece by scanning the surface of the workpiece with a scanning probe (see, for example, Patent Document 1: Japanese Patent Application Laid-Open No. Hei. 5-248852, Patent Document 2: Japanese Patent Laid-Open Publication No. Hei. 8-178646, Patent Document 3: Japanese Patent Laid-Open Publication No. 2000-39302, and Patent Document 4: Japanese Patent Laid-Open Publication No. 2003-202219).
For example, a known measuring system that utilizes a coordinate measuring machine is configured so as to include a coordinate measuring machine adapted to move a scanning probe, a joystick to be operated manually, a motion controller for controlling the operation of the coordinate measuring machine and a host computer for operating the coordinate measuring machine by way of the motion controller and processing the measurement data acquired by the coordinate measuring machine to determine the dimensions and the form of a workpiece. The moving speed of the scanning probe and the sampling pitch of the measurement data and other necessary parameters are defined and input to the host computer in advance.
With the above-described arrangement, the scanning probe scans the surface of the workpiece at the preset moving speed to acquire measurement data at a preset sampling pitch under the control of the motion controller and the host computer. The form of the workpiece is analyzed on the basis of the measurement data.
However, when the moving speed for moving the scanning probe and the sampling pitch for acquiring measurement data are fixed to predefined respective values, there arises a problem that the moving speed and the sampling pitch can be inadequate for scanning the surface of the workpiece depending on the surface condition of the workpiece. For example, if the surface of the workpiece shows undulations only to a small extent and the scanning speed is fixed to a low value, it will take an unnecessarily long time for the surface measurement. Conversely, if the surface of the workpiece shows undulations to a large extent and the scanning speed is fixed to a high value, there may arise errors such as excessive push-in and breakaway. Additionally, excessive data can be acquired if the surface of the workpiece shows undulations to a small extent and data are collected at a fixed sampling pitch, whereas the acquired data may be insufficient for measuring the surface if the surface of the workpiece shows undulations to a large extent and data are acquired at a preset and fixed sampling pitch.

Surface scan measuring device, surface scan measuring method, surface scan measuring program and recording medium


A phase-locked loop (PLL) circuit is disclosed. The PLL circuit includes a detecting circuit configured to detect a phase difference between a digitally controlled oscillator (DCO) clock signal and a reference clock signal, and generate a difference signal based on the detected phase difference; a digitized difference generator, coupled to the detecting circuit, configured to generate a control code based upon the difference signal; and a DCO configured to generate the DCO output signal responsive to the control code of the digitized difference generator; wherein the detecting circuit, the digitized difference generator and the DCO form a closed loop and reduce the phase difference between the DCO output signal and the reference clock signal. An associated method and a circuit are also disclosed.

In advanced high density semiconductor manufacturing processes, the number of capacitors and resistors is suggested to be reduced. As such, digital phase-locked loop (DPLL) circuits or all digital phase-locked loop (ADPLL) circuits are employed to replace analog phase-locked loop circuits for suitable applications because analog phase-locked loop circuits often require more capacitors and resistors than DPLL or ADPLL circuits. An ADPLL circuit may include a digital phase detector (also known as a digital phase comparator) to detect phase differences between a digitally controlled oscillator (DCO) signal and a reference clock signal. The digital phase detector generates a control signal to the DCO for adjustment in response to the detected phase differences. As a result, skew between the DCO signal and the reference clock signal can be eliminated in the closed loop.
Some existing ADPLL or DPLL circuits such as a Time-to-Digital Converter (TDC) based DPLL circuit are complicated in architecture and typically consume more power than PLL circuits in order to achieve high accuracy. PLL circuits that employ bang-bang phase detector (BBPD) may be easy to design and is simpler than the TDC based PLL circuits, but unfortunately the associated application is limited due to poor jitter performance of BBPD.

Circuit for digitizing phase differences, PLL circuit and method for the same

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.


A roof system includes a closure that opens a roof opening in a vehicle. An operating mechanism for the closure includes a first device including a lever configured to move the rear edge of the closure towards a raised position above the roof. A second device includes a lever configured to move the front edge of the closure in a vertical direction. At least one of the levers has a first pivotal connection at a first end of the closure, and spaced second and third connections connecting the respective lever at least to a guiding slide. At least one of the levers is pivotally connected to a sliding member at one of said second and third connections. The sliding member is separate from the guiding slide, slides in the longitudinal direction of the guide rail and is supported by the guide rail in directions perpendicularly to the longitudinal sliding direction.

The discussion below is merely provided for general background information and is not intended to be used as an aid in determining the scope of the claimed subject matter.
The invention relates to a roof system that opens and closes a roof opening in a vehicle. Generally, such roof systems include a closure element (hereinafter "closure") that is movable between a closed and open position in which it opens and closes the roof opening. Movement of the closure is effectuated by an operating mechanism. An improved operating mechanism in particular in relation to its stability under loads from the closure is often desired.


An in-line monitoring apparatus for monitoring particulate matter in a liquid stream includes an inlet and outlet for ingress and discharge of a liquid stream. An in-line particulate matter-sampling unit is arranged for accumulation of particulate matter suspending in the liquid flow between the inlet and outlet, including an apparatus for measuring particulate matter accumulation therein. Further, there is apparatus for separating particulate matter from the liquid stream and for providing the particulate matter to the in-line sampling unit and control apparatus for operating the in-line monitoring apparatus in a first and second operative mode. In the first mode, the in-line sampling unit is operative to permit entry and accumulation of particulate matter therein for measurement by the in-line monitoring apparatus, and in the second mode, a flow of liquid along the first conduit passes through the in-line sampling unit so as to remove the particulate matter accumulations therefrom so as to flush out any particulate matter as may have accumulated in the in-line sampling unit.

The present invention relates to the monitoring of particulate matter in a water supply.
There are numerous objectives for monitoring of sand content in pumped well water. Among the reasons for such monitoring are to ensure the quality of the water supply, to insure the integrity of the well bore to prevent collapse of the well, and to prevent valve wear or damage to pumping installations.
Various devices are known for measuring the sand content in a liquid stream. These devices have the drawbacks of requiring on-site sampling by a technician. Emptying and calibration of such devices are also required.
The present invention seeks to overcome disadvantages of known art by providing an in-line monitoring apparatus, which is entirely automated. This in-line monitoring apparatus monitors the need for quantitative measurement and can be set to repeatedly monitor this need at predetermined intervals. The apparatus can be brought in-line, flushed, activated to perform sand content measurement, and deactivated, entirely by remote control. This ability also provides the possibility to repeat measurements, if necessary or desired.
There is thus provided, in accordance with a preferred embodiment of the present invention, an in-line monitoring apparatus for monitoring particulate matter in a liquid stream, which includes:
an inlet for permitting ingress of a liquid stream into said in-line monitoring apparatus;
an outlet for discharging a liquid stream from said in-line monitoring apparatus;
first and second liquid flow paths each arranged to conduct a liquid flow between said inlet and said outlet;
an in-line particulate matter sampling unit arranged along said first flow path for permitting therein accumulation of particulate matter suspended in a liquid flow between said inlet and outlet, and having apparatus for measuring particulate matter accumulations therein;
apparatus for separating particulate matter from a liquid stream entering said inlet, and for providing the particulate matter to said in-line sampling unit;
first and second valves for selectably permitting liquid flow along said first and second flow paths, respectively, wherein said first valve is arranged downstream of said in-line sampling unit; and
control apparatus for operating said in-line monitoring apparatus in first and second operative modes, wherein, in said first mode, said first valve is closed so as to prevent a through flow of liquid along said first liquid path, and said second valve is open, and in said second mode, said first valve is open so as to permit a through flow of liquid along second liquid path, and said second valve is closed,
wherein, in said first mode, said in-line sampling unit is operative to permit entry and accumulation of particulate matter therein for measurement by said in-line monitoring apparatus, and in said second mode, a flow of liquid along said first conduit passes through said in-line sampling unit so as to remove the particulate matter accumulations therefrom so as to flush out any particulate matter as may have accumulated in said in-line sampling unit.
Further in accordance with a preferred embodiment of the present invention, said in-line sampling unit includes:
at least one sampling chamber for receiving an accumulation of particulate matter; and
at least one apparatus for detecting the presence of at least a predetermined volume of particulate matter in said at least one sampling chamber, said at least one apparatus being operative to provide to said control apparatus an output signal indicative of said at least predetermined volume of particulate matter accumulation,
wherein said in-line monitoring apparatus also includes flow measuring apparatus for measuring the volumetric flow rate of a liquid flowing between said inlet and said outlet operative to provide an output signal to said control apparatus indicative of a rate of liquid flow, and wherein said control apparatus is further operative to evaluate the concentration of particulated matter suspended in the liquid stream per unit flow.
Additionally, in accordance with a preferred embodiment of the present invention, said control apparatus is operable to activate said in-line monitoring apparatus in said first operative mode until detection of said at least predetermined concentration of particulate matter; and wherein, in response to an output signal received from said apparatus for detecting, said control apparatus is operative to switch said in-line monitoring apparatus to said second operative mode.
Preferably, subsequent to said removal of particulate matter from said in-line sampling unit, said control apparatus is operative to switch said in-line monitoring apparatus from said second mode to said first mode.
Alternatively, subsequent to said removal of particulate matter from said in-line sampling unit, said control apparatus is selectably operable to operate said in-line monitoring apparatus in a third mode, during which said apparatus for detecting is inactive for a preselected period of time, after which said control apparatus operates said in-line monitoring apparatus reactivates said apparatus for detecting so as to operate said in-line monitoring apparatus in said first operative mode.
Additionally, in accordance with a preferred embodiment of the present invention, the concentration of particulate matter that said in-line monitoring apparatus is operative to detect is at least approximately 100 ppm.
Further in accordance with a preferred embodiment of the present invention, the concentration of particulate matter that said in-line monitoring apparatus is operative to detect is at least approximately 50 ppm.
Further in accordance with a preferred embodiment of the present invention, the concentration of particulate matter that said in-line monitoring apparatus is operative to detect is at least approximately 1 ppm.
Additionally, in accordance with a preferred embodiment of the present invention, said abovementioned valves are solenoid-type switching valves.
Further in accordance with a preferred embodiment of the present invention, said device for selectively separating a liquid stream from any suspended particulate matter as may be contained therein is a cyclone type device.
Further in accordance with a preferred embodiment of the present invention, said at least one sampling chamber includes a first lower smaller sampling chamber and a second upper larger sampling chamber.
Additionally, in accordance with a preferred embodiment of the present invention, said in-line monitoring apparatus further includes apparatus for inducing settlement of particulate matter from said upper sampling chamber to said lower sampling chamber wherein said upper sampling chamber is formed so as to permit passage of particulate matter to said lower sampling chamber.
Further in accordance with a preferred embodiment of the present invention, apparatus for inducing settlement of particulate matter includes an inclined conduit leading from said upper sampling chamber to said lower sampling chamber.
Additionally, in accordance with a preferred embodiment of the present invention, apparatus for inducing settlement of particulate matter further includes a generally upward conduit leading out from said lower sampling chamber, for allowing a flow of liquid that has entered said lower sampling chamber via said inclined conduit, to exit it.
Further in accordance with a preferred embodiment of the present invention, said apparatus for inducing settlement of particulate matter may include a vibratory unit for vibrating said sampling unit.
Further in accordance with a preferred embodiment of the present invention, said in-line monitoring apparatus includes at least one particulate matter separator arranged along said first flow path, downstream of said in-line sampling unit and upstream of said first valve, for permitting an outflow of particulate matter flushed through said first flow path during activation in said second operative mode, thereby substantially preventing outflow thereof from said outlet.
Further in accordance with a preferred embodiment of the present invention, said in-line monitoring apparatus is arranged so as to tap in to a main-flow conduit such that a stream of liquid entering said in-line monitoring apparatus from the main flow conduit is a substantially representative sample of the liquid flowing through the main flow conduit containing a correspondingly representative volume of suspended particulate matter.
There is thus also provided, in accordance with a preferred embodiment of the present invention, a method of upward flushing of an in-line monitoring apparatus for monitoring particulate matter, which includes:
directing a flow of liquid, generally downward through an inclined conduit, to a sampling chamber, thereby generating turbulence in the sampling chamber; and
flushing the sampling chamber upward, by the turbulent flow, which carries particulate matter upward, through a generally upward conduit.

Monitoring of particulate matter in water supply

Hoffman and Hoffman Electronic and Electro Mechanical Engineering Ltd.


Security strips for identifying the genuineness of sheet material such as documents, securities and banknotes. The security strips are constructed of several different components, encoding means and electrically conductive layers connected in different arrangements on a support substrate. Layers of known per se electrically conductive polymers are being used. The security strips are applied on the sheet material or they are integrated in the sheet material. These security strips constitute insurmountable technological obstacles for a forger.

1. Field of the Invention
The invention relates to security strips for the identification of genuineness of web materials such as documents, securities and banknotes.
2. The Prior Art
In connection with the ever improving quality of state-of-the-art copying and computer technology, an increase in the number of imitation of documents, securities and banknotes is to be expected. For instance, banknotes forged with the aid of modern copying machines cannot by human vision be distinguished easily from genuine banknotes. Hence, measures must be taken which for some time cannot be overcome by technologies available to counterfeiters. Aside from special paper for such securities banknotes are, for instance, provided with refractively active security elements and a security thread embedded in the paper.
Testing of refractively active security elements cannot be performed easily within a document processing machine as it is operated at high speeds. Testing is carried out visually during production of the banknotes as well as by sorting, as may become necessary, of banknotes returning from circulation. Such processes are time consuming and expensive.
Paper-embedded security threads usually of foil structure consisting of at least one support substrate and a metalization applied to the support substrate and which are embedded in the paper web either complete or with so-called windows (window thread), are usually examined for their electric conductivity by firmly established inductive and capacitive coupling methods. The examination of the electrical conductivity of the metalization is made complex because on the one hand banknotes when in use are subject to very high wear and tear as, for instance, by creasing and folding by the user, but also by bending in automatic teller machines and tallying machines. On the other hand, the foil structure is subjected to considerable stresses during the technological paper making process because of stretching and bending in a rotary screen. Consequently, randomly distributed fine fissures occur in the metalization which render measuring results unsafe and not reproducible. In order to counter forgeries of this security element, it is not only the presence of the metalization which must be detected in banking machines, but the genuineness must also be defined by a predetermined parameter of the conductivity.
DE 22 15 628 describes a metalization thread or strip with machine readable individualizing codes structured as a perforated security strip or as a strip provided with magnetic data.
A security document, in particular a banknote with a security element provided with indicia readable in penetrating light and which is electrically conductive, and which is provided with further materials for mechanized testing, has been described in DE 40 41 025 A1. Preferably, the security element consists of a transparent strip of foil provided with negative writing which may easily be visually tested and which is additionally provided with electrically conductive and magnetic materials.
The known testing elements for authenticity tests of objects, securities, especially banknotes, suffer from the main disadvantage which resides in their being known. This being known is such as to enable a forger to arrive at conclusions in respect of the elements to be tested, on the basis of knowing the testing methods and devices and their functioning.
In DE 197 18 859 there has been described a method of applying a conductive layer on a plastic foil. In this connection, a primer is initially deposited on the printable foil, and, subsequently, a conductive organic polymer.
Furthermore, DE 198 36 503 describes a method of integrating electrically conductive materials into the paper web of documents with an electrically conductive security thread, with an electrically conductive polymer being homogeneously or sectionally applied onto or into the paper web.
DE 198 56 457 describes a foil for a foil capacitor in which, for reducing the total resistance of the electrode, current paths are formed on the electrically conductive layer which have a lower surface resistance than the electrically conductive layer. The electrically conductive layer may be either a metallic layer or a conductive polymer layer. The current paths consist of the same or of another electrically conductive material.
Moreover, DE 199 15 155 describes an electrically conductive material for security elements to be embedded in paper webs for the testing of documents, the material being an electrically conductive polymer. The security element is a foil structure of at least one support foil, an applied metalization with sectional demetalizations and a layer of the electrically conductive polymer. Fractures in the metalization are bridged be the parallel layer of electrically conductive polymer.
Finally, DE 199 28 060 describes an optically variable security element with at least one support foil, a reflective layer, diffractive structures and a protective layer for the testing of documents, there being embedded in the laminar structure, at varying positions, of the security element an electrically conductive polymer which is applied to a support material as a liquid coating material as a solution, dispersion or suspension, or as a monomer, together with a polymerizer, the reflective layer consisting of at least one layer of lacquer containing film-like metal pigments.
DE 199 35 434 describes a method of current-free precipitation of metallic layers of high metallic conductivity with a slurry being applied to a substrate which contains at least one organic binder, a reduction agent and at least one solvent. The solvent is subsequently removed from the layer, and the layer is brought into contact with a solution which contains ions of the metal to be precipitated.
Finally, WO94/19813 describes a metalized foil capacitor wherein the metalization of the foils is as thin as possible in order to improve the dielectric stability. This results in conductivities of from 5–300Ω/□. The invention is based, among others, on the use of metal layers of different thicknesses which are being realized separately.