An electrically-conductive epoxy resin is disclosed having stable joint resistance over extended operating times and high impact strength where the resin is based on a silver flake-filled polymeric reaction product of a liquid bisphenol A having very low hydrolyzable chlorine content and suitable polypropylene oxide-based primary amine curing agents.

Production of electronic modules typically involves an electrical circuit patterned on a fiberglass/epoxy, ceramic, or flexible polymer substrate with copper or cermet conductors. The electrical functions are imparted through circuit components (i.e., transistors, resistors, capacitors, diodes, microprocessors) which are soldered to the surface of the board (Surface Mount Technology) or soldered in holes through the board (Through Hole Technology). Constructions of this sort are widely used in many industries: automotive, telecommunications, entertainment, military and computers. Automotive applications of circuit boards with soldered components include engine control modules, ignition modules, instrument panel controls, radios, electrical centers, and various other accessory and convenience modules.
The leading technique used throughout the electronics industry for soldering components to the substrate uses a metallic solder alloy containing, by weight, 63% tin/37% lead. It is applied to the circuit board either as a paste which is heated to more than 200.degree. C. to "reflow" the paste into a solder joint. Alternatively, the board is passed over a molten wave of solder to form joints to bond the electrical components to the circuit board. In either case, a flux material consisting of weak acids is used to remove surface oxidation from metallic surfaces and allow the molten solder to bond to the surfaces and form reliable solder joints.
While this solder attachment technology has existed for many decades, it does have some notable shortcomings. One issue is the lead in the alloy. Lead has already been banned from paint, gasoline, and plumbing solders for environmental and safety reasons. Numerous environmental regulations have been proposed to tax, limit, or ban the use of lead in electronic solders. A second shortcoming is the use of the above mentioned flux material for removing surface oxides. This flux leaves a residue on the finished parts that must be cleaned off with a solvent spray. This is an expensive and often inefficient process. In addition to lead and flux, the solder needs to be processed at temperatures above 200.degree. C. This temperature often dictates the use of an expensive substrate in order to withstand the soldering process temperature, even though the assembly will never encounter temperatures nearly as high in the rest of its service life. In certain high temperature automotive applications (i.e., engine compartment locations where temperature can reach 175.degree. C.), the conventional tin/lead solder may not be usable since the service temperature is dangerously close to the melting point of the alloy. Yet another shortcoming of solder is that the metallic alloy is a brittle material that can crack after repeated thermal cycling. In cases where expansion rates of component and substrate are vastly different, cracked solder joints may be a significant problem.
There are two main alternatives to the existing tin/lead solders. One is a lead-free metallic solder alloy and the other is an electrically conductive synthetic resin adhesive. In the family of metallic solders, many lead free alloys exist including, tin, silver, indium, bismuth, copper and antimony among other metals. Numerous research efforts have evaluated lead free alloys, but have found no lead free solders that directly match the properties of the existing 63% tin/37% lead alloy in use today. Issues for lead free solders include: higher process temperature (which may require redesigned circuit boards and electrical components), different mechanical properties, longer processing times and more sensitivity to assembly process parameters.
The second alternative, electrically conductive adhesives, offer several advantages over traditional solder assembly including: absence of lead, low processing temperatures, no need for solder flux or subsequent flux cleaning steps, improved mechanical properties, better high temperature performance, and a simplified assembly process. Conductive adhesives have been on the market for several decades and are widely used in sealed semiconductor packages. However, use of conductive adhesives for unsealed circuit boards represents a new application for adhesives.
Several international research efforts (IVF-Sweden, Delta-Denmark) have evaluated conductive adhesives as a solder replacement. They have reported successful results for niche applications but have not identified a drop-in solder replacement. The technology is limited by electrical resistance stability through temperature/humidity aging and impact strength.
In the US, the National Center for Manufacturing Sciences (NCMS) performed an extensive evaluation of electrically conductive adhesives for surface mount printed circuit applications. In that cooperative industry project, over 30 commercially available adhesives were evaluated for basic electrical and mechanical properties. The NCMS team defined a test method for evaluating electrical resistance of a conductive adhesive joint as well as an impact test to assess the capability of these adhesives for holding a component on a circuit board during an impact (S. L. McCarthy, "New Test Methods for Evaluating Electrically Conductive Adhesives," J. Surface Mount Technology, Vol. 9, July 1996, pp. 19-26). The electrical testing was performed before and after exposure to an elevated temperature/humidity environment (85.degree. C., 85%RH) and was conducted with copper parts and tin/lead parts. The testing revealed that some adhesives had adequate electrical resistance when copper surfaces were used. On the other hand, no adhesives were identified for producing adequate resistance with tin/lead surfaces. Impact testing also concluded that no adhesives were capable of meeting the NCMS impact test requirement. The use of present conductive adhesives for surface mount component attachment to printed circuit boards is very limited because the impact strength and electrical resistance stability that they provide has fallen far short of the industry standard tin/lead solder performance.
Previous testing of commercially available adhesives has concluded that conductive adhesives are suitable for only niche applications, limited by resistance and impact requirements. Contact with commercial adhesive vendors has revealed that most have been stopped by the requirement for resistance stability on Sn/Pb surfaces. Some vendors have claimed success at developing an impact resistant adhesive, but none have been able to address the resistance variability when in contact with tin/lead layers. In fact, many adhesive vendors have acknowledged that impact strength and resistance stability are mutually exclusive parameters. The conductive adhesives of this invention provide formulations with both impact and resistance properties that are comparable to or exceed the performance of tin/lead solders. This combination of properties expands the window of application for conductive adhesives from limited niche applications to potential universal solder replacement in circuit board applications.
From a traditional viewpoint, cured epoxy resins are often thought of as rigid and brittle materials. This rigidity and brittleness are further magnified when fillers are added to accomplish certain desirable properties such as in the case of metal filled epoxy resins. Conventional epoxies filled with 70% to 80% silver flakes are highly conductive but very brittle and failure occurs even under a mild mechanical shock condition.


A rotor includes a rotor core having a plurality of pairs of magnet-receiving holes and a plurality of magnets respectively received in the magnet-receiving holes. Each pair of the magnet-receiving holes is arranged in a substantially V-shape that opens toward a stator side. The rotor core has, for each of the magnet-receiving holes, a magnetic flux barrier that is formed, at a magnetic pole centerline-side end of a stator-side wall surface of the magnet-receiving hole, so as to protrude from the stator-side wall surface toward the stator side. The protruding height H of the magnetic flux barrier from the stator-side wall surface is set to be in the following range: 0.12×R≦H≦0.29×R, where R is the minimum distance from an intersection P1, which is between the magnetic pole centerline and a rotor-side circumferential surface of the stator, to the stator-side wall surface of the magnet receiving hole.

1. Technical Field
The present invention relates to rotors for rotating electric machines that are used in, for example, motor vehicles as electric motors and electric generators.
2. Description of Related Art
There are known IPM (Interior Permanent Magnet) motors that have permanent magnets embedded in a rotor core. The IPM motors can use both reluctance torque and magnetic toque, thereby achieving high efficiency. Therefore, the IPM motors are particularly suitable for use in hybrid and electric vehicles.
An IPM motor generally includes a stator and a rotor that is disposed in radial opposition to the stator. The rotor includes a rotor core and a plurality of permanent magnets. The rotor core has a plurality of pairs of magnet-receiving holes formed therein. Each pair of the magnet-receiving holes is arranged in a substantially V-shape that opens toward the stator side. Each of the permanent magnets is received in a corresponding one of the magnet-receiving holes of the rotor core. Further, for each pair of the magnet-receiving holes, the two corresponding permanent magnets which are respectively received in the two magnet-receiving holes of the pair are arranged so as to together form one magnetic pole of the rotor. In addition, for each pair of the magnet-receiving holes, there is formed a corresponding center bridge that extends in a radial direction of the rotor core between the two magnet-receiving holes of the pair to separate them from each other.
Japanese Unexamined Patent Application Publication No. 2000-278896 (to be simply referred to as Patent Document 1 hereinafter) discloses a technique of suitably designing magnetic flux barriers at opposite ends of each magnetic pole of the rotor, thereby reducing cogging torque of the motor.
However, with the technique disclosed in Patent Document 1, the q-axis inductance may be lowered and magnetic flux leakage via the corresponding center bridge may be increased.
Japanese Unexamined Patent Application Publication No. 2011-211860 (to be simply referred to as Patent Document 2 hereinafter) discloses a technique of providing magnetic flux barriers on the radially inside (i.e., the side closer to a longitudinal axis of the rotor core) of each magnetic pole of the rotor, thereby reducing magnetic flux leakage in a radially inward direction.
However, the technique disclosed in Patent Document 2 cannot be applied to rotors where there is insufficient space for providing the magnetic flux barriers in the vicinity of a radially inner periphery of the rotor core.


On a printing relief plate, which is produced by a printing relief plate producing apparatus and a printing relief plate producing method, convexities and detecting portions are set to be lower than a solid area of the printing relief plate. In the event that a detecting portion image and a solid area image are printed on a print medium using the printing relief plate by a printing apparatus and by carrying out a printing method, in a printing pressure determining apparatus and a printing pressure determining method, it is determined whether a printing pressure is an appropriate printing pressure or not by comparing an optical density of the detecting portion image and an optical density of the solid area image.

1. Field of the Invention
The present invention relates to a printing relief plate provided on the surface of a plate material, and on which convexities are formed for transferring inks to a print medium to print halftone dots thereon. Further, the present invention relates to a printing relief plate producing apparatus and a printing relief plate producing method for producing the aforementioned printing relief plate. Furthermore, the present invention also relates to a printing apparatus and a printing method for transferring inks from the printing relief plate to a print medium to print halftone dots thereon. Still further, the present invention relates to a printing pressure determining apparatus and a printing pressure determining method for determining whether or not a printing pressure applied to a printing relief plate is an appropriate printing pressure in a case where ink is transferred to a print medium from the printing relief plate.
2. Description of the Related Art
For example, in flexographic printing, a printing relief plate, which is made from a flexible plate material having elasticity, is mounted on the surface of a plate cylinder. Convexities for printing halftone dots by transferring ink to a print medium are formed on a surface (plate surface) of the printing relief plate. Then, in the case that ink is supplied to a plate surface from an anilox roller, under a condition in which the print medium is gripped by the plate cylinder and an impression cylinder, the ink is transferred to the print medium from the plate surface, and halftone dots can be printed on the print medium. Consequently, a desired image can be transferred to (printed on) the print medium.
In this case, by adjusting the pressure (anilox pressure) between the anilox roller and the plate surface, and the pressure (printing pressure) between the plate surface and the print medium, printing conditions for the print medium can be determined. Further, for satisfactorily transferring the entire image (image pattern) to the print medium, preferably, the printing pressure is kept as low as possible (at a minimum printing pressure necessary for favorably transferring the entire image).
Japanese Patent No. 4962855 discloses a technique wherein a detecting portion, which is lower than an image printing area made up of convexities, is formed on a plate surface, and in the case that ink from the detecting portion is transferred to the print medium, it is determined that an excessive printing pressure (also referred to below as an over-printing pressure) is applied onto a plate surface.
Further, Japanese Laid-Open Patent Publication No. 02-009635 and Japanese Laid-Open Patent Publication No. 2009-000881 disclose techniques for adjusting a printing pressure, based on a line width or density of a linear portion, which is printed on a print medium.
Furthermore, Japanese Laid-Open Patent Publication No. 2002-137558 discloses a technique of inspecting the quality of a printing relief plate, by confirming an image that is transferred to a print medium by transfer of ink to the print medium from quality-confirming convexities that are formed on the plate surface.

Printing relief plate, printing relief plate producing apparatus, printing apparatus, printing pressure determining apparatus, and methods therefor


The invention relates to electrochemical energy storage devices containing a composition comprising an electrically conductive polymer based on polypyrrole, substituted or otherwise, and ionic groups which comprise an R-sulphate or R-sulphonate group, R denoting an alkyl or aryl radical.. The invention also relates to the use of these devices as a supercapacitor or as a rechargeable generator.

1. Field of the Invention
The present invention relates to electrochemical energy storage devices containing a composition comprising an electrically conductive polymer based on polypyrrole, substituted or otherwise, and ionic groups.
2. Description of the Prior Art
In patent application EP 0,300,330 (BASF Aktiengesellschaft) it has been proposed to employ electrically conductive polymers, such as especially polypyrrole, as active electrode material for producing electricity storage devices.
However, some electrical applications, such as the production of electrochemical storage systems of the type of capacitance or capacitor with a high energy density and a long cycle time,- require conductive polymers with special properties exhibiting developed morphologies.
These special properties are especially a high energy per unit mass and unit volume for applications in, energy sources feeding portable systems, a long lifetime of the pseudocapacitive type, and a high resistance of the polymer to aging over a wide range of storage temperature and conditions.

Electrochemical energy storage devices comprising electricaly conductive polymer and their uses

Compagnie Generale d'Electricite (Societe Anonyme)


The invention relates to a method of performing an oilfield operation of an oilfield having at least one well having a wellbore penetrating a subterranean formation for extracting fluid from an underground reservoir therein. The method steps include analyzing the oilfield operation to generate a decision tree comprising a first decision and a second decision, wherein a first outcome of the first decision dictates acquiring information relevant to the second decision, formulating a figure of merit of the oilfield operation according to the decision tree based on the information and uncertainties associated with the oilfield, determining a value of the figure of merit by modeling the oilfield operation using statistical sampling, and performing the oilfield operation upon making the first decision based on the value of the figure of merit.

Oilfield operations, such as surveying, drilling, wireline testing, completions and production, are typically performed to locate and gather valuable downhole fluids. As shown in FIG. 1A, surveys are often performed using acquisition methodologies, such as seismic scanners to generate maps of underground structures. These structures are often analyzed to determine the presence of subterranean assets, such as valuable fluids or minerals. This information is used to assess the underground structures and locate the formations containing the desired subterranean assets. Data collected from the acquisition methodologies may be evaluated and analyzed to determine whether such valuable items are present, and if they are reasonably accessible.
As shown in FIGS. 1B-1D, one or more wellsites may be positioned along the underground structures to gather valuable fluids from the subterranean reservoirs. The wellsites are provided with tools capable of locating and removing hydrocarbons from the subterranean reservoirs. As shown in FIG. 1B, drilling tools are typically advanced from the oil rigs and into the earth along a given path to locate the valuable downhole fluids. During the drilling operation, the drilling tool may perform downhole measurements to investigate downhole conditions. In some cases, as shown in FIG. 1C, the drilling tool is removed and a wireline tool is deployed into the wellbore to perform additional downhole testing.
After the drilling operation is complete, the well may then be prepared for production. As shown in FIG. 1D, wellbore completions equipment is deployed into the wellbore to complete the well in preparation for the production of fluid therethrough. Fluid is then drawn from downhole reservoirs, into the wellbore and flows to the surface. Production facilities are positioned at surface locations to collect the hydrocarbons from the wellsite(s). Fluid drawn from the subterranean reservoir(s) passes to the production facilities via transport mechanisms, such as tubing. Various equipment may be positioned about the oilfield to monitor oilfield parameters and/or to manipulate the oilfield operations.
During the oilfield operations, data is typically collected for analysis and/or monitoring of the oilfield operations. Such data may include, for example, subterranean formation, equipment, historical and/or other data. Data concerning the subterranean formation is collected using a variety of sources. Such formation data may be static or dynamic. Static data relates to formation structure and geological stratigraphy that defines the geological structure of the subterranean formation. Dynamic data relates to fluids flowing through the geologic structures of the subterranean formation. Such static and/or dynamic data may be collected to learn more about the formations and the valuable assets contained therein.
Sources used to collect static data may be seismic tools, such as a seismic truck that sends compression waves into the earth as shown in FIG. 1A. These waves are measured to characterize changes in the density of the geological structure at different depths. This information may be used to generate structural maps of the subterranean formation. Other static measurements may be gathered using core sampling and well logging techniques. Core samples are used to take physical specimens of the formation at various depths as shown in FIG. 1B. Well logging involves deployment of a downhole tool into the wellbore to collect various downhole measurements, such as density, resistivity, etc., at various depths. Such well logging may be performed using, for example, the drilling tool of FIG. 1B and/or the wireline tool of FIG. 1C. Once the well is formed and completed, fluid flows to the surface using production tubing as shown in FIG. 1D. As fluid passes to the surface, various dynamic measurements, such as fluid flow rates, pressure, and composition may be monitored. These parameters may be used to infer various characteristics of the subterranean formation.
Sensors may be positioned throughout the oilfield to collect data relating to various oilfield operations. For example, sensors in the wellbore may monitor fluid composition, sensors located along the flow path may monitor flow rates, and sensors at the processing facility may monitor fluids collected. Other sensors may be provided to monitor downhole, surface, equipment or other conditions. The monitored data is often used to make decisions at various locations of the oilfield at various times. Data collected by these sensors may be further analyzed and processed. Data may be collected and used for current or future operations. When used for future operations at the same or other locations, such data may sometimes be referred to as historical data.
The processed data may be used to predict downhole conditions, and make decisions concerning oilfield operations. Such decisions may involve well planning, well targeting, well completions, operating levels, production rates and other configurations. Often this information is used to determine when, where and if to drill new wells, re-complete existing wells, or alter wellbore production.
Data from one or more wellbores may be analyzed to plan or predict various outcomes at a given wellbore. In some cases, the data from neighboring wellbores, or wellbores with similar conditions or equipment is used to predict how a well will perform. There are usually a large number of variables and large quantities of data to consider in analyzing oilfield operations. It is, therefore, often useful to model the behavior of the oilfield operation to determine the desired course of action. During the ongoing operations, the operating conditions may need adjustment as conditions change and new information is received.
Techniques have been developed to model the behavior of geological structures, downhole reservoirs, wellbores, surface facilities, as well as other portions of the oilfield operation. Examples of modeling techniques are shown in Patent/Application/Publication Nos. U.S. Pat. No. 5,992,519, WO2004049216, WO1999064896, U.S. Pat. No. 6,313,837, US20030216897, US20030132934, US20050149307, and US20060197759. Typically, existing modeling techniques have been used to analyze only specific portions of the oilfield operation. More recently, attempts have been made to use more than one model in analyzing certain oilfield operations. See, for example, Patent/Application/Publication Nos. U.S. Pat. No. 6,980,940, WO2004049216, US20040220846, and U.S. Ser. No. 10/586,283.
Techniques have also been developed to predict and/or plan certain oilfield operations, such as drilling operations. Examples of techniques for generating drilling plans are provided in Publication Nos. US20050236184, US20050211468, US20050228905, US20050209886, and US20050209836. Some drilling techniques involve controlling the drilling operation. Examples of such drilling techniques are shown in Patent Application Nos. GB2392931 and GB2411669. Other drilling techniques seek to provide real-time drilling operations. Examples of techniques purporting to provide real-time drilling are described in U.S. Pat. Nos. 7,079,952, 6,266,619, 5,899,958, 5,139,094, 7,003,439, and 5,680,906.
Despite the development and advancement of modeling techniques in oilfield operations, there remains a need to consider the effects of unavailable information and/or uncertain information and/or uncertainty in oilfield parameters on oilfield operations. It would be desirable to provide techniques to assess the value of acquiring missing information, and/or assess the value of reducing the uncertainty in information and/or assess the value of reducing the uncertainty in oilfield parameters for decision making support. It would also be desirable to perform this value assessment the acquired information may change the characteristics of the oilfield operation. It is further desirable that such techniques selectively consider desired parameters, such as the probable contents of the missing information to be acquired, uncertainty in the acquired information, market uncertainty, private uncertainty, etc. Such desired techniques may be capable of one or more of the following, among others: considering the effect of multivariate, and/or time dependent, and/or continuously distributed, and/or discretely distributed uncertainties, valuing the missing information to be acquired in the future, and providing modeling capability to speed up the value assessment process without jeopardizing the quality of the results.

Valuing future information under uncertainty


A new and improved insert ring for a wafer support inside a processing chamber for the processing, particularly dry etching, of semiconductor wafer substrates. The insert ring includes a generally convex inner surface which faces the wafer support and defines a gap or berline wall between the insert ring and the wafer support. In one embodiment, the convex inner surface is convexly-tapered. In another embodiment, the convex inner surface is convexly-curved. Throughout etching of multiple successive substrates on the wafer support, accumulations of polymer material on the inner surface of the insert ring are prevented or at least substantially reduced. Consequently, polymer peeling is eliminated or reduced and operational intervals for the processing chamber or system between periodic maintenance or cleanings, are prolonged.

Integrated circuits are formed on a semiconductor substrate, which is typically composed of silicon. Such formation of integrated circuits involves sequentially forming or depositing multiple electrically conductive and insulative layers in or on the substrate. Etching processes may then be used to form geometric patterns in the layers or vias for electrical contact between the layers. Etching processes include "wet" etching, in which one or more chemical reagents are brought into direct contact with the substrate, and "dry" etching, such as plasma etching.
Various types of plasma etching processes are known in the art, including plasma etching, reactive ion (RI) etching and reactive ion beam etching. In each of these plasma processes, a gas is first introduced into a reaction chamber and then plasma is generated from the gas. This is accomplished by dissociation of the gas into ions, free radicals and electrons by using an RF (radio frequency) generator, which includes one or more electrodes. The electrons are accelerated in an electric field generated by the electrodes, and the energized electrons strike gas molecules to form additional ions, free radicals and electrons, which strike additional gas molecules, and the plasma eventually becomes self-sustaining. The ions, free radicals and electrons in the plasma react chemically with the layer material on the semiconductor wafer to form residual products which leave the wafer surface and thus, etch the material from the wafer.
Referring to the schematic of FIG. 1, a conventional plasma etching system, such as an Mxp+ Super-E etcher available from Applied Materials, Inc., is generally indicated by reference numeral 10. The etching system 10 includes a reaction chamber 12 having a typically grounded chamber wall 14. An electrode, such as a planar coil electrode 16, is positioned adjacent to a dielectric plate 18 which separates the electrode 16 from the interior of the reaction chamber 12. Plasma-generating source gases are provided by a gas supply (not shown). Volatile reaction products and unreacted plasma species are removed from the reaction chamber 12 by a gas removal mechanism, such as a vacuum pump 24 through a throttle valve 26.
The dielectric plate 18 illustrated in FIG. 1 may serve multiple purposes and have multiple structural features, as is well known in the art. For example, the dielectric plate 18 may include features for introducing the source gases into the reaction chamber 12, as well as those structures associated with physically separating the electrode 16 from the interior of the chamber 12.
Electrode power such as a high voltage signal is applied to the electrode 16 to ignite and sustain a plasma in the reaction chamber 12. Ignition of a plasma in the reaction chamber 12 is accomplished primarily by electrostatic coupling of the electrode 16 with the source gases, due to the large-magnitude voltage applied to the electrode 16 and the resulting electric fields produced in the reaction chamber 12. Once ignited, the plasma is sustained by electromagnetic induction effects associated with time-varying magnetic fields produced by the alternating currents applied to the electrode 16. The plasma may become self-sustaining in the reaction chamber 12 due to the generation of energized electrons from the source gases and striking of the electrons with gas molecules to generate additional ions, free radicals and electrons. A semiconductor wafer 34 is positioned in the reaction chamber 12 and is supported by a wafer platform or ESC (electrostatic chuck) 36. The ESC 36 is typically electrically-biased to provide ion energies that are independent of the RF voltage applied to the electrode 16 and that impact the wafer 34.
Typically, the voltage varies as a function of position along the coil electrode 16, with relatively higher-amplitude voltages occurring at certain positions along the electrode 16 and relatively lower-amplitude voltages occurring at other positions along the electrode 16. A relatively large electric field strength is required to ignite plasmas in the reaction chamber 12. Accordingly, to create such an electric field it is desirable to provide the relatively higher-amplitude voltages at locations along the electrode 16 which are close to the grounded chamber wall 14.
As discussed above, plasma includes high-energy ions, free radicals and electrons which react chemically with the surface material of the semiconductor wafer to form reaction produces that leave the wafer surface, thereby etching a geometrical pattern or a via in a wafer layer. Plasma intensity depends on the type of etchant gas or gases used, as well as the etchant gas pressure and temperature and the radio frequency generated at the electrode 16. If any of these factors changes during the process, the plasma intensity may increase or decrease with respect to the plasma intensity level required for optimum etching in a particular application. Decreased plasma intensity results in decreased, and thus incomplete, etching. Increased plasma intensity, on the other hand, can cause overetching and plasma-induced damage of the wafers. Plasma-induced damage includes trapped interface charges, material defects migration into bulk materials, and contamination caused by the deposition of etch products on material surfaces. Etch damage induced by reactive plasma can alter the qualities of sensitive IC components such as Schottky diodes, the rectifying capability of which can be reduced considerably. Heavy-polymer deposition during oxide contact hole etching may cause high-contact resistance.
FIG. 2 illustrates structural details of the environment of the ESC 36 inside the reaction chamber 12. A typically silicon insert ring 40 is interposed between a shadow ring 38 and the outer circumference of the ESC 36. The insert ring 40 enhances uniformity of the etch rate among all areas on the surface of the wafer 34. A gap 46 (known in the art as a berline wall) is defined between the flat inner edge 42 of the insert ring 40 and the outer circumference of the ESC 36. The edge of the wafer 34, resting on the ESC 36, may extend over the gap 46.
As shown in FIG. 3, throughout repeated processing of successive wafers 34 on the ESC 36, a deposit of polymer material 44 tends to gradually accumulate on the outer edge of the ESC 36, and extends into the gap 46. This deposit of polymer material 44 gradually grows and closes or substantially narrows the gap 46, finally becoming deposited on the flat inner edge 42 of the insert ring 40. This excessively increases the leakage of helium from the backside of the wafer 34 during etching, thereby energizing the B/H alarm of the etching system between PM (periodic maintenance) cycles. Furthermore, accumulation of the polymer material 44 onto the insert ring 40 causes peeling of polymer particles from the ESC 36 and the insert ring 40. These polymer particles can potentially contaminate devices being formed on the wafers 34. Consequently, the ESC 36 and the insert ring 40 must be wet-cleaned about every 70 hours of operation of the system 10.
One of the approaches which has been taken to retard the accumulation of the polymer deposit 44 on the insert ring 40 has included widening or narrowing of the gap 46. However, this tends to increase deposition of the polymer deposit 44 on, and accelerate polymer peeling from, the insert ring 40.
Therefore, the present invention is directed at providing an insert ring having a convex inner surface to prevent or minimize the deposition of polymer material on the insert ring, and thus, eliminate or reduce the peeling of polymer material from the insert ring.
It is therefore an object of the present invention to provide a novel insert ring for a wafer support, which insert ring prevents or minimizes the formation of polymer material thereon during processing of wafers on the support.
Another object of the present invention is to provide a novel wafer support insert ring having a convex inner surface to prevent or minimize the formation of polymer material on the inner surface of the ring.
Still another object of the present invention is to provide a novel wafer support insert ring having a convexly-curved inner surface to prevent or minimize the formation of polymer material on the inner surface of the ring.
Another object of the present invention is to provide a novel wafer support insert ring having a convexly-tapered inner surface to prevent or minimize the formation of polymer material on the inner surface of the ring.
Yet another object of the present invention is to provide a novel wafer support insert ring which prevents or minimizes the quantity of polymer material capable of accumulating in a berline wall or gap between the inner surface of the insert ring and the exterior circumference of an electrostatic chuck in a process chamber.
A still further object of the present invention is to provide a novel wafer support insert ring which extends the time between periodic maintenance or cleanings required for an etching chamber.
Yet another object of the present invention is to provide a novel wafer support insert ring which prevents or substantially reduces polymer peeling in a process chamber for semiconductor wafer substrates.

Taiwan Semiconductor Manufacturing Co., Ltd.


An electronic device includes a semiconductor device that includes: a substrate including a switching element having a buried gate electrode; a buried decoupling capacitor having a line width same as a line width of the buried gate electrode; and a variable resistance element, electrically coupled to the switching element, formed over the substrate.

Recently, as electronic devices or appliances trend toward miniaturization, low power consumption, and high performance, and so on, there is a demand for a semiconductor device capable of storing information in various electronic devices or appliances such as a computer, a portable communication device, and so on, and research and development for such semiconductor devices have been conducted. Examples of such a semiconductor device include a resistive random access memory (RRAM), a phase-change random access memory (PRAM), a ferroelectric random access memory (FRAM), a magnetic random access memory (MRAM) and an electric fuse (E-fuse).

This patent is subject to a terminal disclaimer.

Electronic device and method for fabricating the same


A system and method for managing and redeeming a promotional coupon for goods and services. The system provides a link between an operator console and a remote database server having one or more coupon files, each of which contains a plurality of coupon records. A customer telephones the operator and discloses an encrypted coupon number from the coupon issued to the customer. The encrypted coupon number is used to access the relevant coupon record in a coupon file on the remote database server. The status of the coupon is transmitted back to the operator console. If the coupon is valid, the operator console provides the goods or services requested by the customer. The operator console subsequently sends a command to the coupon file to change the status of the coupon in the coupon record.

1. Field of the Invention
The present invention relates to the field of electronic management of promotional coupons, and more particularly, to the real-time redemption of promotional coupons for goods and services, such as telecommunications and rebates, where the customer with the printed coupon is remotely located from the redemption agent.
2. Related Art
Companies issue promotional coupons for a variety of purposes, such as to encourage new customers to try the goods or services of the company, or to provide a simple accounting system whereby customers may give gifts of the goods or services to others. Coupons can also be used for controlling the redemption of rebates, registering a newly purchased product, receiving free time with a long distance telecommunications carrier, and enforcing trial periods or a free number of telephone calls with a telecommunications carrier. The coupons are usually printed objects, carrying printed indicia or a coupon number to prevent forgery. When the coupons are used in-person at a retail store, a store clerk may examine the coupon to verify by the printed indicia whether or not the coupon is valid. Upon successful verification, the store clerk provides the goods or services to the customer, and then collects the coupon to remove it from circulation (and from possible re-use). The coupon may also be sent to a central location for tabulation.
In the field of telecommunications, such as long distance telephony, it is also desirable to issue coupons to encourage new customers to the long-distance service or to enable giving of gifts of the service. However, unlike the situation in a retail store, a telecommunications operator processing the coupon, such as an operator in a long-distance network, is remotely located from the customer and from the printed coupon. Therefore, the operator cannot examine the printed coupon to verify its authenticity, and cannot collect the coupon after its use to remove it from circulation or to send it to a central tabulation facility. This remote use of coupons is further compounded by the fact that there are a variety of coupons, each having a variety of promotional characteristics, such as expiration date, type of service or goods, number of times the coupon can be used, day and time restrictions, and the use of cryptographic information to eliminate the possibility of forgery.
Therefore, there is a need for an electronic coupon management system wherein a database containing information for valid coupons communicates with a plurality of remote terminals, enabling telecommunications operators to verify or validate a coupon in real-time.

System and method for electronic coupon management


A cart includes a frame and a rigid base section horizontally registered above a ground level and oriented parallel thereto. Casters are mated to opposed corners of the base section. An upper section is pivotally conjoined to opposed corners of the base section and is offset along a vertical plane. The upper section is spaced from the casters. A collection bin is centrally housed within the upper section and seated on the base section. The bin is arranged so that the upper section abuts proximal and distal top ends of the bin. Clamping arms are anchored to a distal end of the base section and spaced from the upper section respectively. The upper section and the clamping arms are simultaneously and independently articulated during operating conditions.

1. Technical Field
This invention relates to transportation carts and, more particularly, to an adaptable transport cart for use with strollers and the like for assisting a caregiver to simultaneously maneuver a baby stroller while carrying a variety of objects within the cart during operating conditions.
2. Prior Art
Parents of infants and young children frequently desire a wheeled child carrier or stroller on which the child can be seated to permit the parents to push the stroller and the child when the parents are walking. Such child strollers are widely used by parents during various activities. Among such activities is shopping. Reaching a store or shopping center often requires traveling by automobile. This necessitates the transporting of the child stroller in the automobile. Consequently, collapsible child strollers are popular. When shopping, the parents frequently accumulate a significant number of packages which require transporting, either back to the automobile or directly to the home or other location. Since properly controlling the child stroller requires the use of two hands, it is difficult, if not impossible, for one parent to both control the child stroller and to carry the packages. Although there are wheeled package carriers available, they generally are not collapsible for transporting in an automobile. In addition, it is not possible for one parent to both control a child stroller and control a wheeled package carrier. Further, such wheeled package carriers generally do not protect the packages from the weather.
Once a child is able to walk, the child can, and often prefers to, walk for some distance even when a child stroller is available. Thus, it is possible to use the child stroller for the carrying of packages, with the child walking and holding on either to the child stroller or to the parent. However, the child stroller, being designed for a child to sit on it, has a maximum weight carrying capacity of about 40 pounds and a limited ability to hold bulky packages. Consequently, the child stroller has limited ability to carry large, heavy packages. In addition, often people without children desire a package carrier when shopping. Many such people, for example, grandparents or other relatives of a child, find it desirable to have available a child stroller even though they do not use it every day, since they desire to have it available for when a grandchild or other young relative or friend visits.
One prior art example shows a convertible child stroller/package carrier having a wheeled frame, a child seat which can be removably fastened to the frame to provide a child stroller, and a package holder which likewise can be removably fastened to the wheeled frame to provide a package carrier. The wheeled frame ordinarily has four legs, with a wheel assembly on each. Two additional legs with wheel assemblies can be attached on the rear of the wheeled frame to provide additional stability when carrying heavy packages. The wheeled frame is preferably hinged to permit folding of the child stroller/package carrier for ease of transporting, either by carrying by hand or by placement in an automobile or other vehicle. The package holder is preferably a weather resistant bag or a mesh bag and is preferably provided with a drawstring for closing of the bag when the package carrier is removed from the wheeled frame. Unfortunately, this example requires switching out of the seat for the bag as necessary, which can be difficult and time consuming.
Another prior art example shows a convertible stroller and shopping vehicle having a stroller portion and a shopping vehicle portion. The stroller portion includes a seat which is movable from a deployed position to a stowed position. In the deployed position, the invention is used as a stroller. The shopping vehicle portion includes a collapsible receptacle that can be oriented in one of two orientations. In an open orientation, the receptacle creates a shopping cart while in a collapsed orientation the invention can be used to transport bulk materials. Unfortunately, this example does not provide a suitable seating area for a child when not being used as a shopping cart.
Accordingly, a need remains for an adaptable transport cart for use with strollers and the like in order to overcome the above-noted shortcomings. The present invention satisfies such a need by providing an assembly that is simple and easy to use, is lightweight yet durable in design, and assists a caregiver to simultaneously maneuver a baby stroller while carrying a variety of objects within the cart. Such an assembly conveniently provides ample storage in which a wide variety of personal items can be neatly and easily stored. The assembly can effectively hold grocery items as well as luggage, and advantageously folds flat against an existing stroller, thus conveniently offering compact and convenient storage between uses.

Adaptable transport cart for use with strollers and the like


The invention provides a liquid crystal display panel, comprising a plurality of scan lines fabricated along a first axis, a plurality of data lines fabricated along a second axis, a first pixel and a second pixel. Each of the first and second pixels is surrounded by two adjacent scan lines and two adjacent data lines. The first pixel comprises a first thin film transistor (TFT). The second pixel comprises a second and a third TFT. The gates of the second and third TFT are electrically connected to the two adjacent scan lines surrounding the second pixel, respectively. The third TFT further comprises a source electrically connected to a photo-sensor, and a drain electrically connected to an access line fabricated along the second axis. One end of the access line is electrically connected to a signal processor via a switch.

1. Field of the Invention
The invention relates to liquid crystal panels, and particularly relates to the driver devices thereof.
2. Description of the Related Art
There are three types of touch panel: resistive, surface wave, and capacitive. Resistive touch panels are usually limited to small size. Surface wave touch panels register contact by electromagnetic response or by electromagnetic transmission. Capacitive touch panels register contact by capacitive response, with coordinates of the contact point evaluated according to variations in capacitance generated.
Conventionally, touch panels and liquid crystal display panels are manufactured separately and combined into a finished product. The separately manufactured liquid crystal display panel and touch panel result in a heavy and expensive finished product with low transparency. To deal with the above drawbacks, a liquid crystal touch panel, which integrally fabricates the touch panel and the liquid crystal display panel in the same panel, is in development.
FIG. 1 illustrates a conventional liquid crystal touch panel. As shown in FIG. 1, the liquid crystal display panel 10 comprises a plurality of scan lines 12 fabricated along a first axis, a plurality of data lines 14 fabricated along a second axis, a plurality of first pixels 16, and a plurality of second pixels 18. As shown in FIG. 1, each of the first and second pixels (16 and 18) is surrounded by two adjacent scan lines 12 and two adjacent data lines 14. The first pixel 16 comprises a first thin film transistor 20. The first thin film transistor 20 has a gate electrically connected to one of the two adjacent scan lines surrounding the first pixel, a source electrically connected to one of the two adjacent data lines surrounding the first pixel, and a drain electrically connected to a pixel electrode (not shown in FIG. 1). The second pixel 18 comprises a second thin film transistor 22 and a third thin film transistor 24. The gates of the second and third thin film transistors 22 and 24 are electrically connected to the two adjacent scan lines surrounding the second pixel, respectively. The second pixel 22 further comprises a source electrically connected to one of the two adjacent data lines surrounding the second pixel, and a drain electrically connected to a pixel electrode (not shown in FIG. 1). The third thin film transistor 24 further comprises a source electrically connected to a photo-sensor, and a drain electrically connected to an access line 28. The photo-sensor may be implemented by a fourth thin film transistor 26, as the FIG. 1 shows. The fourth thin film transistor 26 has a gate and a source both electrically connected to a bias voltage line 30, and a drain electrically connected to the drain of the third thin film transistor 24. In response to external light, the fourth thin film transistor 26 generates a current as a photo-sensed signal. The photo-sensed signal is passed to the access line 28 via the third thin film transistor 24 and then transmitted to a signal processor (shown in FIG. 2). After the signal processing, contact is available.
FIG. 2 illustrates the peripheral circuit of the liquid crystal display panel 10. As shown in FIG. 2, between an access line 28 and the signal processor 32, a fan-out line 34 couples the access line 28 to a connection pad 36 of the liquid crystal display panel 10. The length of fan-out line 34 is dependent on the access line 28 coupling to the fan-out line 34. The resistance of fan-out line 34 is dependent on the length of the fan-out line 34. The transmission of the photo-sensed signal is affected by the different resistance of fan-out lines 34. Therefore, the signal processor 32 cannot deal correctly with the received photo-sensed signal.
FIG. 4 shows a simulated result of the liquid crystal display panel 10. As shown in the lower waveform of FIG. 4, in the gate-in terminal of an access line 28, the photo-sensed signal measures 9.8827 μA. As shown in the top waveform of FIG. 4, in the gate-end terminal of the connection pad 36, the photo-sensed signal measures 6.423 μA. There is an error between the measurements. Therefore, a solution for the asynchronous gate-in/gate-end signals is called for.

Liquid crystal panel and driver device thereof


A rolling guide device is capable of facilitating smooth circulation of rolling elements in an endless circulation path, and enhancing the accuracy of motion of a moving member relative to a track member. The moving member includes: a main body member having load rolling surfaces and return paths for the rolling elements; direction change pipes incorporating inner direction change paths and having inner peripheral guide surfaces of outer direction change paths, respectively; and lid members each being mounted on the main body member and having outer peripheral guide surfaces of the outer direction change paths. The main body member has position reference holes formed therein so as to serve as position references for the direction change pipes, respectively, whereas the direction change pipes have positioning protrusions formed thereon so as to be press-fitted into the position reference holes, respectively. Further, the direction change pipes include rotation restriction protruding portions.

Hitherto, this type of rolling guide device includes a track member on which a rolling surface for rolling elements is formed along a longitudinal direction of the track member, and a moving member, which is assembled to the track member through intermediation of a large number of the rolling elements that roll on the rolling surface, and is configured to freely reciprocate along the track member. An endless circulation path for the rolling elements is formed in the moving member. This endless circulation path allows the moving member to move along the track member without any stroke limitation.
In a rolling guide device disclosed in JP 2006-105296 A, the moving member includes a main body member made of a metal, a plurality of circulation path modules mounted on the main body member, and a pair of lid members mounted on the main body member so as to cover the circulation path modules. Load rolling surfaces opposed to the respective rolling surfaces of the track member are formed on the main body member. The rolling elements are configured to roll in a load path defined by the rolling surface and the load rolling surface that are opposed to each other. Further, each circulation path module mounted on the main body member includes a pipe portion inserted into a through hole formed in the main body member, and a direction change portion formed at one end of the pipe portion and arranged on an end surface of the main body member in its moving direction.
A return path for the rolling elements is formed in the pipe portion in parallel to the load path, whereas an inner direction change path for connecting the return path and the load path is formed in the direction change portion. Further, an inner peripheral guide surface of an outer direction change path intersecting with the inner direction change path is formed on an outer surface of the direction change portion. When the lid member is mounted on the main body member so as to cover the circulation path module, the outer direction change path is formed between the direction change portion and the lid member.
The endless circulation path for the rolling elements is formed by a pair of circulation path modules in combination, and the pair of circulation path modules is mounted on the main body member so as to be opposed to each other. At this time, the pipe portions of the respective circulation path modules are inserted into different through holes formed in the main body member, and the distal end of each pipe portion protrudes through the main body member so as to be connected to the outer direction change path formed by the direction change portion of the opposing circulation path module. That is, the endless circulation path looped in an order of the load path, the inner direction change path, the return path, the outer direction change path, and the load path is formed by the pair of circulation path modules in combination. Further, the inner direction change path and the outer direction change path intersect with each other at each direction change portion, and thus two endless circulation paths are formed.


In traffic-related stationary phases, a drive ratio of the transmission remains engaged with the engine running on a road vehicle equipped with automatic transmission. The service brake automatically remains activated for a short time after the vehicle has come to a halt as a result of a targeted braking operation. Thereby, the driver is allowed to remove his/her foot from the brake pedal, and the vehicle can be held stationary in a reliable manner on a flat or sloping road surface. This holding braking mode of the vehicle service brake system is cancelled when the driver actuates the accelerator pedal whose position is monitored by a switch.

This application claims the priority of DE 196 11 360.1, the disclosure of which is expressly incorporated by reference herein.
The present invention relates to a device for automatic actuation of a hydraulic brake system of a road vehicle for the purpose of maintaining a vehicle stationary for the duration of traffic-related stationary phases by coupling brake pressure from a brake-pressure source which can be activated without the cooperation of the driver into at least one, and preferably all, of the wheel brakes of the vehicle.
DE-43 32 459 A1 describes an actuating device for a road vehicle with an automatic transmission. The known actuating device has a brake-pressure control device. By processing sensor output signals of a sensor arrangement in accordance with plausibility criteria while the engine is running and with the vehicle in a stationary condition achieved after a braking operation, automatic continuation of the stationary braking operation is provided. After a delay time period, .delta.t, of defined length since the time the vehicle came to a halt has passed, a brake pressure sufficient to keep the vehicle reliably in the stationary condition is coupled into the wheel brake(s) used for the stationary braking operation.
Here, a signal which triggers the stationary braking mode is obtained from a conjunctive (AND logic) linking of the following signals:
(a) An output signal of an electronic speed or wheel-speed sensor, characteristic of the stationary condition of the vehicle, PA1 (b) an output signal of an electronic engine speed transmitter and/or a pressure sensor which monitors the pressure at the inlet branch of the vehicle, as an information signal for a running engine, PA1 (c) an output signal characteristic of the actuated state of the brake pedal, and the output signal of the brake light switch and/or that of an electronic pressure transducer by way of which the pressure in at least one of the wheel brakes can be detected, and PA1 (d) an output signal of a transmission-ratio transmitter.
The release of the brakes required upon resumption of the driving mode is controlled by the control device, which, from a redundant combination of sensor output signals, e.g. those of an accelerator-pedal position transmitter and a throttle-valve position sensor or an engine-speed sensor, detects the driver's desire for resumption of the driving mode.
The known actuating device is designed so that the driver is initially merely assisted in actuating the brakes. After the expiration of a delay time period which is in practice short, i.e. 1 to 2 seconds, however, the brake pressure is increased to such an extent that the vehicle is held stationary in a reliable manner, even on a hill, and the driver can take his or her foot from the brake pedal. The brake is released again only when the driver actuates the accelerator pedal and the throttle-valve position sensor produces a signal characteristic of this.
In stationary phases at traffic-light-controlled crossroads or in slow-moving motorway traffic involving numerous stationary phases, the known actuating device provides the desired relief for the driver. However, the automatic activation of a stationary braking operation with a relatively high braking force is problematic in parking situations, especially on an inclined road surface. This occurs for example, in reverse parking, the driver, after having placed his or her vehicle next to the vehicle in front, would like to allow the vehicle to roll backwards with a forward drive ratio engaged in order to avoid the engagement of the reverse drive ratio but there is an associated risk that the vehicle will start to roll with a jerk as soon as the accelerator pedal is actuated. On a flat road surface, too, parking of the vehicle when a number of changes between forward and reverse travel are required can be made more difficult by the actuating device.
It is, therefore, an object of the present invention to improve an actuating device in such a way that, without prejudice to required triggering of stationary braking-mode phases, parking operations can be carried out in a simple and reliable manner.
This object has been achieved according to the present invention by providing that the brake-pressure control device is configured to trigger the automatic stationary braking mode only if, within the delay time period, the driver performs an actuating action which can be recognized as a driver's desire for triggering of automatic stationary braking and is detectable by the sensor arrangement, and provides the ending of the automatic stationary braking mode only if, in addition to the sensor output signals of the sensor arrangement which reveal the driver's desire for resumption of the driving mode, there are also present sensor output signals which, again with reference to or initiation actuation criteria, fulfill safety-relevant secondary conditions.
According to the present invention, the triggering of the otherwise automatic stationary braking mode takes place only when the driver himself/herself performs an actuating action within the delay time period, .delta.t, preferably increasing the brake pressure by a minimum amount of about 5 bar by actuation of the brake pedal. The additional effort required for actuation in this situation is marginal because the driver is, in any event, still actuating the brake pedal. It is perfectly reasonable to expect this of the driver in view of the advantage that an automatic stationary braking operation is only carried out when the driver expressly so intends. This also applies if the driver additionally or alternatively actuates a switch designed, for example, as a momentary-contact switch and hence gives an electronic control unit a command pulse which clearly expresses the driver's intention, an intention which can, as it were, still be "expressed", i.e. made effective, after expiration of the delay time period.
Whenever the automatic stationary braking mode is activated, it is advantageous if the occurrence of a speed signal of a velocity (or v) sensor triggers an automatic increase of the braking force until the stationary condition of the vehicle has been achieved again. The brake-pressure increase required for this takes place in steps of about 5 bar in each case. In a preferred configuration of the brake-pressure control device, an additional brake-pressure raising step takes place after the stationary condition of the vehicle has been achieved again. The automatic stationary braking mode ends only if, in addition to sensor output signals of the sensor arrangement which reveal the driver's desire for resumption of the driving mode, there are also present sensor signals which, again with reference to plausibility criteria, signal the fulfillment of safety-relevant secondary conditions, in particular that the bonnet or hood is closed, the driver's seat is occupied and the doors of the vehicle are closed. If one of these conditions is not met, the driver is warned by an acoustic or optical signal, and the driving mode cannot be effected.
Components of the service brake are used to maintain a stationary condition of the vehicle achieved by a targeted braking operation, e.g. by driving inlet valves of an anti-lock system present on the vehicle into their brake-pressure-holding position or by switching solenoid valves. Thereby, the brake circuits of the vehicle are connected to the associated pressure outputs of the brake master cylinder, into their shut-off position, with an advantageously low outlay on electronic and/or electrohydraulic circuitry.
A configuration of the actuating device which is functionally reliable and simple in terms of circuitry is also possible by providing a hydraulic auxiliary pressure source which can be activated by driving the actuating device with an output signal of the electronic control unit and the output pressure of which can be coupled into at least one of the brake circuits for the duration of the automatic stationary braking mode.
In a preferred configuration of the actuating device, the service brake system of the vehicle is activated in the automatically controlled stationary braking mode by driving its pneumatic brake booster.
In the automatic stationary braking mode of the brake system, it is particularly advantageous if the brake pressure used for this purpose is limited to ensure that this pressure can be dissipated again with sufficient rapidity upon the transition to the driving mode.
As an alternative, or in addition to the possibilities mentioned for producing braking force in the stationary braking mode, it is also within the contemplation of the present invention to provide an electric-motor-type or electrohydraulic or electropneumatic actuating element which can be driven by an output signal of the electronic control unit and by way of the driving of which the parking brake of the vehicle can be activated.
In a preferred configuration of the actuating device, an introductory brake-pressure build-up for the stationary braking mode can be followed by the ending of this pressure build-up because the vehicle can be held stationary by the "locked-in" brake pressure maintained in the wheel brakes. It can be expedient here if pressure-build-up cycles with following holding cycles are repeated from time to time, e.g. at one-minute intervals.
If the brake-pressure dissipation which concludes the automatic stationary braking mode is effected by multiple pulsed switching of the change-over valve assigned to the brake circuit used for the stationary braking operation, potential pressure surges and the associated generation of noise can be moderated. This occurs upon the transition from the stationary braking mode to the driving mode, where the electronic control unit first produces a control signal which effects an increase of the output pressure of the brake unit and only then produces the sequence of pulses which serves to drive the respective change-over valve and produces the brake-pressure reduction.
A brake-pressure dissipation which is rapid but nevertheless associated with comparatively little noise generation when driving away again is also achieved, in a vehicle which is equipped with an anti-lock system which operates on the return-pumping principle. This is achieved by the return pump(s) of the system and its brake-pressure regulating valves being driven into the pressure reduction mode for a minimum time period.
The high transmission or drive-ratio reduction makes it advantageous, particularly when ending the automatic stationary braking mode by a transition into the reversing mode, for the brake-pressure dissipation to take place in steps of about 5 bar in order to avoid jerky driving away of a vehicle.

Road vehicle brake system actuating device and method for holding the vehicle stationary on sloped surfaces


The invention is a device for distributing a multiphase mixture having at least one gas phase and at least one liquid phase in which the mixture flows downwardly through at least one bed of granular solids. The device includes at least one distributor plate located above one of the at least one bed of granular solids at a distance "d" defining a space with "d" ranging from 0 to 5 cm., the distributor plate including a plurality of mixing channels in which the at least one liquid phase and the at least one gas phase of the mixture are mixed, each of the channels having at least one upper passage section and at least one lower passage section providing communication of the mixture formed in the mixing channels with the at least one bed of granular solids, the mixing channels being provided along at least part of a height thereof with at least one lateral passage section, and the upper passage section allowing a majority of the at least one gas phase of the mixture to pass and the at least one lateral passage section providing passage of the at least one liquid phase inside the mixing channels and/or at least part of the at least one gas phase, and wherein the distance "d" of separation of the distributor plate from one of the at least one bed of granular solids reduces any fragmentation of the mixture inside the space.

1. Field of the Invention
The present invention relates to a device for optimizing the distribution of a fluid containing for example at least one gas phase and at least one liquid phase through a bed of granular solids or particles, with the fluid downwardly circulating through the bed.
2. Description of the Prior Art
In this field, one of the key points for achieving good hydrogenation selectivity is proper distribution of the gas and liquid at the head of the reactor or of each catalyst bed in view of the fact that the gas/liquid volumetric ratios generally range from 0.01 to 50 and most frequently from 0.02 to 20.
Thus, the individual skilled in the art is familiar with positioning the distributor plate at a relatively great distance from the catalytic bed to form a sufficient space to allow distribution of the gas phase such that the gas or gas phase is correctly distributed.
Thus, for example, U.S. Pat. No. 4,126,540 mentions the possibility of choosing the value of the distance between the distributor plate and the catalytic bed from an extensive range of values of between 7.62 cm and 91 cm. After reading this document and in accordance with normal practice, the individual skilled in the art would, as mentioned above, select the distance value from the upper part of this range rather than the lower part.

Device for distributing a multiphase mixture through a catalytic bed

Route Nationale Hameau de Boussole Chuzelles


The present invention is directed to a method of making metal oxide and mixed metal oxide particles. The method includes treating a mixture formed from a metal source, such as metal alkoxide, a surfactant, and a first alcohol in an aqueous media at a very high metal oxide yield. The mixture is reacted using a catalyst to form metal oxide particles having a desired particle size in said mixture. By washing the particles with an aprotic solvent, the residual carbon content of the particles can be significantly reduced. The method is particularly suitable for forming silica particles. The metal oxide particles can then be heat treated to form synthetic fused metal oxides such as, for example, synthetic fused silica.

Metal and mixed metal oxides are useful as functional materials to provide heat resistance/conduction, as structural materials, composite membranes for fuel cells, solar cells, catalysts, controlled delivery, coatings, light diffusers, cosmetics, ceramic glasses, etc., wherein the particle size and morphology such as shape, internal porosity, and surface area may be important. Included among the metals used in such compounds are tetravalent metals such as zirconium, vanadium, titanium, and silicon, although lower valence metals such as aluminum or yttrium are also particularly useful. Because of its relative abundance, silicon oxides have been the material of choice for a wide variety of commercial usages from nanoparticles used in polymer composites to synthetic silica for production of ultrahigh purity fused quartz materials for semiconductor applications.
Controlled particle size, surface area, and porosity have been a matter of interest in recent years due to wide commercial applications. Current techniques for producing metal oxides, however, have a number of limitations and do not offer a single chemistry for providing a wide range of properties.
More specifically, for silicon metal and its corresponding silicon dioxide (silica), current techniques for synthesis of synthetic silica powder are based on sol-gel methods, ion-exchange of sodium silicate glass, and sol-gel of fumed silica derived from silicon tetrachloride or other oxidizable silicon source i.e. octamethylcyclotetrasiloxane in the presence of oxygen and/or water. Commercially available synthetic silica glass is primarily made utilizing; (1) a method in which a fume generated by decomposition of silicon tetrachloride or an organosilicon material in an oxyhydrogen flame is deposited and grown on a substrate; (2) a method in which a silica gel obtained by hydrolysis and gellation of a silicon alkoxide, is baked and a synthetic silica powder thereby obtained is further densified to make a glass; or (3) direct sol-gel processing usually used for smaller parts.
However, the method (1) has a problem in that the production cost is extremely high. On the other hand, in the method (2) employing a silica gel, particularly a silica gel derived from a silicon alkoxide, it is possible to obtain a synthetic silica powder having relatively low content of minor impurities, but the desired impurity level is not necessarily satisfied. Method 3 requires slow and extensive drying to produce parts without cracking and has not been found economically viable to this point for large shapes.
Silica sol has been conventionally made by using a sodium silicate solution called water glass as a starting material. In this way, sodium silicate solution is treated using a cation-exchange resin so that ions, such as sodium ion in sodium silicate, are removed in order to increase the purity of the starting material. Then, the resultant material is used for producing silica sol. Such a technique is disclosed in U.S. Publication No. 2007/0237701, which is incorporated by reference. However, because the above-method employs an ion-exchange resin for purification, its purity is limited to some degree. Thus, it is difficult to produce silica sol having 1 ppm or lower content of metal impurities, such as alkali metals (e.g., sodium), copper, nickel, and/or aluminum, which is required for use with electronic materials.
Alternatively, methods for making relatively high purity synthetic silica particles include hydrolyzing and condensing alkoxysilanes and using pulverization techniques. An example of a method using pulverization techniques for preparation of silica particles useful for high purity synthetic silica applications is disclosed in U.S. Pat. No. 6,131,409, which is incorporated by reference. Because of restrictions with respect to the purity of the starting material and the many process steps required to achieve the final particle size, various other processes have been attempted.
These methods and techniques, however, also have a number of limitations. For example, they do not appear to produce very high yields of silica. Also, as disclosed in U.S. Pat. No. 4,767,433, these methods and techniques do not form silica having a desired particle size, such as the particle size of 200 to 300 microns required by some fusion processes. These relatively larger particle size ranges also would be useful in the production of crucibles for semiconductor and glass articles useful to semiconductor processing such as, for example, racks, windows and containments, and fiber optics.

Method for making high purity metal oxide particles and materials made thereof