A method is disclosed for modifying a device dimension extraction model. After collecting in-line data with regard to at least one feature of a device for one or more layouts, a proximity and linearity effect with regard to the feature based on the collected data is determined. Further, the device's electrically active region (OD) drawn size effect with regard to the feature is also determined based on the collected data. The dimension extraction model is modified based on at least two of the above three characterized effects.

The present disclosure relates generally to semiconductor device modeling and manufacturing, and more particularly to the methods for correlating transistor models to the fabricated features of the device transistors.
The production of semiconductor integrated circuits (ICs) and devices requires the use of many steps to define and fabricate specific circuit components and circuit layouts onto an underlying substrate. These steps include design processes (function design, logic design, physical/layout designs and the like), manufacturing processes (material, device fabrication and the like) and test processes (device physical, electrical, functionality testing and the like). The design processes include modeling methods by which certain physical dimensional aspects of the device's transistors are correlated to certain electrical parametric performances of the transistors. Such transistor models are used to help extract and define the initial manufacturing fabrication parameters, as well as for determining changes and re-targets to the fabricated transistor physical dimensional features to re-center their electrical parametric performances.
Device circuits utilizing field-effect transistors (FETs) are commonly modeled to determine the transistors' gate poly-silicon electrode length, the dimensional length of the physical channel between the transistors' source and drain regions. The OD area width, the transistors' electrically active region under the gate poly-silicon electrode, is also a modeled parameter that correlates strongly to device transistor performance. It is important from the view of the device designers and for the manufacturing operations, that the extraction models for transistor gate length and OD area width reliably and accurately predict and represent the electrical characteristics of the transistors.
Typical transistor models, such as the SPICE model for example, translate the modeled (drawn) gate length and OD area width parameters to the actual physically measured dimensions for the fabricated transistors. Such models correct or correlate the modeled, drawn gate poly-silicon length and area width dimensions to the actual fabricated transistor CD (critical dimension) values by either a fixed CD offset modification, or by a differently specified offset value applied to the in-line fabrication operations. These transistor models extract corrected transistor physical dimensional parameters that are usually optimized for a specific device transistor layout style and pattern. In actuality, due to certain real-life process issues, the transistor models are often not optimal for all varieties of device transistor layout styles and patterns. As example, for the advanced device process technologies with gate lengths of less than 65 nm (nano-meter) and OD area widths around 110 nm, certain systematic process phenomena and issues may induce as much as and larger than 10% drifts to the final electrical performance parameters of the transistors. As a result, the transistor models experience non-modeled inaccuracies and additional offset errors between the actual fabricated device transistors and the expected electrical performance characteristics of the same. Such inaccuracies and errors may occur not only between one product device to another, but also between different operating circuits within a given device. As device transistor dimensional geometries shrink with the more advanced device and process technology generations, the issues and difficulties for maintaining reliable and accurate transistor models become more important for maintaining device performance and high production/device yields.
The flow diagram 100 of FIG. 1 illustrates a method for correcting and correlating the transistor gate length and OD area width parameters to the transistor electrical performance parameters. Both flows require the use of collected data, the in-line measured transistor CD data from the transistors during fabrication and the measured electrical performance data taken from the fabricated transistors. The in-line CD data collection is shown as step 102 of both flow diagrams. The collection of transistor electrical data is shown as the next step 104 of both flow diagrams. In FIG. 1, in the next step 106, the collected in-line CD and final transistor electrical data are used to calculate and determine correction, offset factors to be applied within the transistor model such that the corrected, offset CD parameters of the model match that of the measured in-line CD data. The new correction, offset factors are then applied to the transistor model, shown as step 108 of FIG. 1. The transistor model is subsequently used for extraction of electrical performance for device transistors with a variety of layouts.
Accordingly, it is desirable to have an improved method for modeling transistors such that the physical parameters of the transistor features are correlated well to the electrical performance of the same.

Method for physical parameter extraction for transistor model

Taiwan Semiconductor Manufacturing Co., Ltd.


A method of verifying a digital hardware design simulated in a hardware design language (HDL). States to be verified are defined, including signal values for each component within the hardware design. A test is applied to the hardware design, such that traces of internal signals within the hardware design are recorded. Each trace includes signal data, time data and at least the internal signals associated with the components. The traces are processed to ascertain whether the plurality of components simultaneously had the signal values associated with the state, thereby to ascertain whether the state was achieved.

When verifying a digital hardware design specified using an HDL, the verification engineer is often interested to know whether the design has passed through a certain configuration of internal component signals, known as a "state".
Modern HDLs can be executed on simulation systems to produce traces of how the signals change over time. In the case of processor cores, for example, the simulation can effectively run the machine code accepted by the design. When verifying a module within the design, a test harness known as a testbench can be used to supply the correct stimuli to the design.
The signal traces can often be very long, and in a format that makes ascertaining what has actually happened relatively difficult for an engineer to ascertain, especially, where the state of interest constitutes the behaviour of multiple components over time.


A method of forming a semiconductor device having a metal gate includes the following steps. First of all, a first gate trench is formed in a dielectric layer. Next, a first work function layer is formed, covering the first gate trench. Then, a protection layer is formed in the first gate trench, also on the first work function layer. Then, a patterned sacrificial mask layer is formed in the first gate trench to expose a portion of the protection layer. After that, the exposed protection layer is removed, to form a U-shaped protection layer in the first gate trench. As following, a portion of the first work function layer under the exposed protection layer is removed, to form a U-shaped first work function layer in the first gate trench. Finally, the patterned sacrificial mask layer and the U-shaped protection layer are completely removed.

1. Field of the Invention
The present invention relates to a method of forming a semiconductor device having a metal gate, and more particularly to a method of forming a semiconductor device which can prevent against work function layer damage.
2. Description of the Prior Art
Poly-silicon is conventionally used as a gate electrode in semiconductor devices, such as metal-oxide-semiconductors (MOS). However, with a trend toward scaling down the size of the semiconductor device, work function metals are used to replace the conventional polysilicon gate to be the control electrode that cooperates with the high-K gate dielectric layer. The conventional dual metal gate methods are categorized into gate first process and gate last process. Among the two main processes, the gate last process is able to avoid processes of high thermal budget and to provide wider material choices for the high-K gate dielectric layer and the metal gate, and thus gradually replaces the gate first process.
In a conventional gate-last process, after a dummy gate is formed, the dummy gate is removed to forma trench where a work function layer and a metal gate layer are sequentially filled therein to form a metal gate structure. Due to the shrinkage of the device size as a consequence of device miniaturization, it is increasingly difficult to fill the materials into the trench. In some cases, overhang structure and void may occur, thereby decreasing the quality of the metal gate.

Method of forming a semiconductor device having a metal gate


A system and method for tomographic image reconstruction using truncated limited-angle projection data that allows exact interior reconstruction (interior tomography) of a region of interest (ROI) based on the linear attenuation coefficient distribution of a subregion within the ROI, thereby improving image quality while reducing radiation dosage. In addition, the method includes parallel interior tomography using multiple sources beamed at multiple angles through an ROI and that enables higher temporal resolution.

1. Field of the Invention
The present invention generally relates to computed tomography (CT) and, more particularly, to systems and methods for exact interior reconstruction using improved analytic continuation techniques and with the extension of such techniques to instant tomography and across other tomographic modalities.
2. Background Description
Classic CT theory targets exact reconstruction of a whole cross-section or of an entire object from complete projections, while practical applications such as medical CT, micro- and nano-CT often need to focus on a much smaller internal region of interest (ROI). Current CT theory cannot exactly reconstruct an internal ROI only from truncated projections associated with x-rays through the ROI because this interior problem does not have a unique solution. When applying traditional CT algorithms for interior reconstruction from truncated projection data, features outside the ROI may create artifacts overlapping inside features, rendering the images inaccurate or useless. Moreover, specific problems remain for pre-clinical imaging, as in the case of small animals (see Wang, G., "Micro-CT scanners for biomedical applications: an overview", Adv. Imaging, 2001, 16: pp. 18-27). Although there has been an explosive growth in the development of cone-beam micro-CT scanners for small animal studies, the efforts are generally limited to cross-sectional or volumetric imaging at high spatial resolution of 20-100 μm at large radiation dose.
Traditional CT is necessarily associated with x-ray source and/or detector scanning so that projections can be collected from a sufficient number of orientations. Although the multi-source strategy has been a natural solution to higher temporal resolution CT and already used in the classic Mayo Clinic Dynamic Spatial Reconstructor (see Robb, R. A., et al, High-speed three-dimensional x-ray computed tomography: The dynamic spatial reconstructor. Proceedings of the IEEE, 1983. 71(3): p. 308-319, and Ritman, E. L., R. A. Robb, and L. D. Harris, Imaging physiological functions: experience with the DSR. 1985: philadelphia: praeger), the modern Siemens dual-source cone-beam scanner (see Flohr, T. G., et al, First performance evaluation of a dual-source CT (DSCT) system. European Radiology, 2006. 16(2): p. 256-268), and other systems, such an x-ray scanning mechanism remains indispensible. The bulkiness of sources/detectors in limited physical space has previously made it impossible to collect simultaneously a sufficient number of projections simultaneously.
The importance of performing exact image reconstruction from the minimum amount of data has been recognized since the introduction of CT scanning. A recent milestone was the two-step Hilbert transform method (see Noo et al. "A two-step Hilbert transform method for 2D image reconstruction". Physics in Medicine and Biology, 2004. 49(17): p. 3903-3923), which was further expanded by Defrise et al. "Truncated Hilbert transform and image reconstruction from limited tomographic data." Inverse Problems, 2006. 22(3): p. 1037-1053.
Despite the impressive advancement of the CT technology, there are still unmet, critical and immediate needs such as those mentioned above for better image quality at lower doses in many biomedical and other investigations.

Interior tomography and instant tomography by reconstruction from truncated limited-angle projection data

Virginia Tech Intellectual Properties, Inc.


A wash basin drain structure includes a tightening assembly, a control rod assembly, a drain pipe, and a plug. A threaded top ring of the fastening assembly relative to a threaded annular seat is screwed reversely to push an anti-leakage washer of the drain pipe upward, so that the threaded top ring and a washer are against the bottom of the wash basin and resilient portions of the resilient ring engages with a non-slip portion of the drain pipe. When a threaded fixing member in a threaded hole of a fixing seat of the control rod assembly is screwed inward, the end of the threaded fixing member will hold against the body of the drain pipe and pull an inner pipe portion of the fixing seat to seal and engage with an insertion hole of the drain pipe. A magnetic end head of a link rod of the control rod assembly is attracted to connect with a magnetic portion of a plug body of the plug to act as a lever. The present invention can be assembled with ease.

1. Field of the Invention
The present invention relates to a wash basin drain structure.
2. Description of the Prior Art
As shown in FIG. 6, a conventional drain structure comprises a drain pipe (50), a lock ring (60), a plug (70), and a control assembly (80). The drain pipe (50) comprises a pipe connector (51) at one side thereof. The pipe connector (51) has a bushing (510) therein. The drain pipe (50) further comprises a gasket (52) on the body of the drain pipe (50) and a hexagon tightening nut (53) under the gasket (52). The plug (70) comprises a plug cover (71) at one end hereof, a stop ring (710) under the plug cover (71), and a through hole (72) at another end of the plug (70). The control assembly (80) comprises an action rod (81). The action rod (81) has a ball shaft (810) and a screw nut (82) at an inner end of the action rod (81). The drain pipe (50) is inserted out of the drain hole of the wash basin from bottom to top, and then locked by the lock ring (60). The gasket (52) of the drain pipe (50) is attached under the drain hole of the wash basin and tightened by the hexagon tightening nut (53) under the gasket (52), such that the wash basin and the drain pipe (52) are tightly connected to prevent water from leakage. The plug (70) is inserted in the drain pipe (50). The end of the action rod (81) of the control assembly (80) is inserted through the pipe connector (51) of the drain pipe (50), and the ball shaft (810) of the action rod (81) is slid in the pipe connector (51) and blocked by the bushing (510) of the pipe connector (51). The screw nut (82) of the action rod (81) is screwed to the pipe connector (51), so that the control assembly (80) acts like a lever with the ball shaft (810) as the fulcrum. When the action rod (81) is pulled upward to link the plug (70) to move downward, the stop ring (710) under the plug cover (71) of the plug (70) is to cover the opening of the drain pipe (50). When the action rod (81) is pressed downward to link the plug (70) to move upward, the water in the wash basin is discharged through the opening of the drain pipe (50). However, the conventional drain structure has some shortcomings:
1. Inconvenient to use: When the drain pipe is coupled to the wash basin, the drain pipe is inserted out of the drain hole of the wash basin from bottom to top and then locked by the lock ring from the top. The gasket of the drain pipe is attached under the drain hole of the wash basin and tightened by the hexagon tightening nut under the gasket. The end of the action rod of the control assembly must be aimed at the insertion hole of the plug, which is not easy for connection. It is inconvenient to use.
2. Difficult connection: When the drain pipe is coupled to the wash basin, the drain pipe is inserted out of the drain hole of the wash basin from bottom to top and then locked by the lock ring from the top. The gasket of the drain pipe is attached under the drain hole of the wash basin and tightened by the hexagon tightening nut under the gasket. The connection and assembly is complicated and difficult.
Accordingly, the inventor of the present invention has devoted himself based on his many years of practical experiences to provide these problems.


A semiconductor device comprises bit line landing pads and storage landing pads disposed on both sides of the bit line landing pads overlying a substrate. A bit line interlayer insulating layer overlies the bit line and storage landing pads. A plurality of bit line patterns are disposed on the bit line interlayer insulating layer. The bit line patterns each include a bit line and a bit line capping layer pattern. Line insulating layer patterns are placed on a top surface of the bit line interlayer insulating layer. Upper contact holes are placed in a region between the bit line patterns and higher than upper surfaces of the bit lines. Contact hole spacers cover the side walls of the upper contact holes. Lower contact holes are self-aligned with the upper contact holes and extend through the line insulating layer patterns and the bit line interlayer insulating layer, thereby exposing the storage node landing pads.

1. Field of the Invention
The present invention relates to semiconductor devices and methods of fabricating the same, more particularly to semiconductor devices having DRAM cells and methods of fabricating the same.
2. Description of Related Art
In general, a semiconductor device having DRAM cells comprises gate patterns and capacitors on one active region selected from a cell array region. One cell includes one gate pattern and one capacitor adjacent to the gate pattern and has one address on the cell array region. The gate pattern controls the flow of data which moves through a semiconductor substrate, and the capacitor is a place where the data are stored. One bit line pattern is formed on the active region and electrically contacts the active region. The bit line pattern is a line which allows data to be moved between the cell array region and a peripheral circuit region. There have been performed studies on a capacitor over bit-line (COB) structure together with the bit line pattern. In the COB structure, the gate pattern, the capacitor and the bit line pattern arranged on the active region are insulated from each other by an insulating layer. At this time, one of DRAM cells has one contact hole in the insulating layer so that a landing pad, which is a node of the capacitor, contacts the active region. The contact hole can include of one or more holes, and also the capacitor contact landing pad can include one or more pads in accordance with the number of the holes.
But the more a high integration of the semiconductor device is required, the more reduction in a design rule of the semiconductor device is considered. The reduction in a design rule leads to small feature size of the active region, the contact hole, the gate pattern, the bit line pattern and the capacitor with the landing pad. This makes contact resistance between the capacitor contact landing pad and the active region and resistance of the gate and bit line patterns larger and also reduces a capacitance of the capacitor. An issue of design rule reduction can be solved by using upgraded semiconductor manufacturing equipments more or less, but it is very difficult to increase a contact area between the capacitor and the landing pad. A method of forming the COB structure comprises the steps of forming a storage node interlayer insulating layer on the whole surface of a semiconductor substrate having a landing pad in an insulating layer, forming a storage node hole in the storage node interlayer insulating layer, and forming a storage node by molding a doped poly silicon layer in the storage node hole. Here, the storage node hole exposes only to an upper surface of the landing pad, and an area of the side wall of the storage node corresponds to a height of the storage node hole. Therefore, due to the reduction of the design rule, a diameter of the storage node hole gets become smaller, and a size of contact area between the storage node hole and the landing pad gets become smaller. As a result, the contact resistance between the storage node and the landing pad is higher, and the storage node may be leaned or collapsed. This causes refresh fail of the DRAM cell resulting from the high contact resistance, and physical or electrical short by the storage node.
On the other hand, U.S. Pat. No. 6,136,643 to Jeng, et al discloses a method of manufacturing a capacitor having a COB structure. According to the '643 patent, the method includes forming DRAM cells having active regions, gate patterns, bit line patterns and a capacitor of a COB structure. A third etching stopper is formed to cover side walls of the bit line patterns, a third sacrificial insulating layer exist in the bit line patterns. At this time, photolithography and etching process are performed two times to form an opening portion penetrating the third sacrificial insulating layer between bit line patterns. However, during the performance of the etching process two times, the third etching stopper can be overly etched to thereby expose the side walls of the bit line patterns. Therefore, in the process of forming a lower electrode of the capacitor, the lower electrode and the bit line patterns may form a short circuit through the opening portion.

Semiconductor devices having DRAM cells and methods of fabricating the same


A dynamic topic partitioning messaging system. The messaging system can include a message server; one or more topics stored in the message server; one or more subtopics associated with at least one of the topics in the message server; and, a dynamic topic partitioning system configured to partition the topics into the subtopics. Notably, the message server can be Java message service (JMS) compliant. In that regard, the message server can reside in a single process address space. For example, the process address space can be a Java virtual machine (JVM).

1. Statement of the Technical Field
The present invention relates to asynchronous communications and more particularly to messaging systems.
2. Description of the Related Art
Distributed applications have begun to proliferate, as have a host of previously unexplored problems associated with message synchronization, transmission reliability, system scalability, and message security. Present solutions include conventional messaging systems formed from loosely coupled components communicating with one another with asynchronous messages. Notably, conventional messaging systems have been used to build highly reliable, scalable, and flexible distributed applications.
At its core, the conventional messaging system permits separate, uncoupled applications to reliably communicate in an asynchronous manner. Importantly, the messaging system architecture generally replaces the client/server model with a peer-to-peer relationship between individual computing components, wherein each peer computing component can send and receive messages to and from other peer computing components. In consequence, messaging systems can provide several significant advantages over other, more conventional distributed computing models.
For instance, messaging systems encourage "loose coupling" between message consumers and message producers. Specifically, there exists a high degree of anonymity between producer and consumer. In fact, from the perspective of the message consumer, it does not matter who produced the message, where the producer resided in the computing network, and when the message had been produced. As a result, dynamic, reliable, and flexible systems can be assembled whereby entire ensembles of sub-applications can be modified without affecting the remaining portion of the system. In any event, conventional messaging systems assume one of two messaging systems models: publish/subscribe and point-to-point.
The publish/subscribe messaging system supports an event driven model where consumers and producers participate in the transmission of messages. Producers "publish" messages, while consumers "subscribe" to messages of interest, and consume the messages. More particularly, producers associate messages with a specific topic, and the messaging system routes messages to consumers based upon the topics for which consumers have registered. In point to point messaging systems, by comparison, messages are routed to an individual consumer which maintains a queue of "incoming" messages. Messaging applications send messages to a specified queue, and clients retrieve messages from a queue.
The Java™ Message Service (JMS), part of the Java 2 Enterprise Edition (J2EE™) suite manufactured by Sun Microsystems of Palo Alto, Calif., provides standard APIs that Java developers can use to access the common features of enterprise messaging systems. JMS supports both the publish/subscribe and point-to-point models and allows the creation of message types consisting of arbitrary Java objects. A fundamental design goal of JMS is to provide a consistent set of interfaces that messaging system clients can use independent of the underlying message system provider. In this way, not only are client applications portable across machine architectures and operating systems, but the client applications also remain portable across messaging products.
Still, in JMS only a single thread can be used to service a messaging system subscriber receiving any published message for a customer defined topic in which it is interested. In consequence, if enough message traffic is generated for that topic, a single thread in a multithreaded virtual machine can become overrun fairly quickly. Accordingly, what is needed is a messaging system in which multiple threads can service a messaging system subscriber receiving any published message for a customer defined topic.

Dynamic partitioning of messaging system topics

International Business Machines Corporation


A data storage array is provided such as for a distributed storage system or a consumer electronics device wherein increased data storage capacity is provided at the cost of increased power consumption in relation to industry standard power consumption rates. The array has a plurality of data storage devices, each having an actuator operably disposed in a data storing and retrieving relationship with a data storage medium. The data storage medium is rotated at a speed of substantially greater than 10,000 revolutions per minute, and each of the data storage mediums has a data storage capacity of substantially greater than 100 gigabytes. The increased heat created by the relatively faster rotation speed is handled through improved airflow made possible by a multiple device array constructed in accordance with embodiments of the present invention.

Distributed storage systems use hardware such as a central processing unit (CPU), one or more disc controllers, and a plurality of data storage arrays providing bulk storage. Computer program code operating on the CPU and/or disc controllers controls the manner in which user data is stored and accessed on the bulk storage. User data can be stored in various fault tolerant schemes, such as in redundant array of independent drive (RAID) formats, for example. Multiple RAID formats can advantageously be employed concurrently within the data storage system. The rate at which the bulk storage can be dynamically allocated, as well as the amount of available storage capacity, both significantly contribute to the marketability of the storage system.
The first direct access storage device, IBM's RAMAC in 1957, had a 5 megabyte storage capacity existing on fifty 24 inch data storage discs. By the 1980s, the rate at which areal density capabilities progressed yielded a single 5.25 inch disc with the same 5 megabyte storage capacity. The industry has continued to evolve into ever-smaller form factors according to a standardized scaling methodology. Today, the 5.25 inch form factor is obsolete, having been replaced with the 3.5 inch and 2.5 inch form factors, and more recently with sub 1.8 inch form factors.
The evolution driving the scaling methodology has been skewed by the proliferation of consumer computer products employing the disc drives. That is, increased areal density has permitted decreased disc size, without penalty to storage capacity, and rotated at increased velocity with potentially reduced or constant power consumption. The increased rotational speed increases processing performance by reducing latency lags. The smaller size actuators offer improved seek time performance.
In continually pushing to make the discs smaller and spin them faster, power consumption has in fact become the baseline standardization design point, limiting the number of discs and the speed at which the discs can be rotated without exceeding a reliable operating temperature.
Accordingly, data storage arrays providing bulk storage have followed the same evolutionary path—that of seeking to continually reduce the size of the storage discs without loss of storage capacity in order to pack more drives within the array. In other words, the evolutionary goal has been to increase the spindle density within the array. However, as improvements in areal density have slowed, the demand for more capacity and faster processing capability by distributed storage systems remains a market factor. What is needed is a solution that optimizes both the processing speed and the storage capacity as primary design points, wherein power consumption and the associated heat dissipation becomes a tertiary consideration. It is to these improvement features that the embodiments of the present invention are directed.

High speed and high capacity data storage array


Index entries representing ranges of values are queried with a query value to determine if the query value is in one of the ranges. Numeric ranges are represented in an index and queries are constructed to match index entries. Search terms are constructed from the query value, such that a search term matches an index entry if and only if the queried for valued is in the range represented by the index entry. To facilitate querying the indexes, queries are constructed to contain search terms having a data structure format similar to that of the index entries.

Search systems, such as search engines, search large numbers of databases, web pages, documents, etc. A common goal of many search systems is to provide quick and meaningful responses to queries. In an attempt achieve efficient searches, many search engines utilize indexes to facilitate searching. An index maps content (typically in the form of tokens) to the entities being searched (database records, web pages, or the like). Typically, an index is queried for an exact match to a query value. Or, a range query is submitted looking for all documents which contain a value in the range query. Current systems however, do not provide an efficient mechanism for querying with a probe value in search of documents containing a range of values, wherein the probe value is within the range.


A shredder is disclosed. The shredder includes a housing having a throat for receiving at least one article to be shredded, and a shredder mechanism received in the housing and including an electrically powered motor and cutter elements. The shredder mechanism enables the at least one article to be shredded to be fed into the cutter elements. The motor is operable to drive the cutter elements so that the cutter elements shred the articles fed therein. The shredder also includes a detector that is configured to detect a thickness of the at least one article being received by the throat, and a controller that is operable to perform a predetermined operation responsive to the detector detecting that the thickness of the at least one article is at least equal to a predetermined maximum thickness.

1. Field of the Invention
The present invention relates to shredders for destroying articles, such as documents, compact discs, etc.
2. Description of Related Art
Shredders are well known devices for destroying articles, such as documents, compact discs ("CDs"), expired credit cards, etc. Typically, users purchase shredders to destroy sensitive articles, such as credit card statements with account information, documents containing company trade secrets, etc.
A common type of shredder has a shredder mechanism contained within a housing that is removably mounted atop a container. The shredder mechanism typically has a series of cutter elements that shred articles fed therein and discharge the shredded articles downwardly into the container. The shredder typically has a stated capacity, such as the number of sheets of paper (typically of 20 lb. weight) that may be shredded at one time; however, the feed throat of a typical shredder can receive more sheets of paper than the stated capacity. A common frustration of users of shredders is to feed too many papers into the feed throat, only to have the shredder jam after it has started to shred the papers. To free the shredder of the papers, the user typically reverses the direction of rotation of the cutter elements via-a switch until the papers become free.
In addition, shredders-that are subjected to a lot of use should have periodic maintenance done to them. For example, the cutter elements may become dull over time. It has been found that lubricating the cutter elements may improve the performance of cutter elements, particularly if the shredder is used constantly over a long period of time.
The present invention endeavors to provide various improvements over known shredders.

This patent is subject to a terminal disclaimer.


A DC to DC switching power converter includes a shared set of high-side switching elements which may be operated at approximately a duty cycle approaching 50%, and one or more sets of low-side switching elements which may be operated at a lower duty cycle. The sets of low-side switching elements may be turned off early in response to a control signal to regulate a particular output. Steering diodes are included to inhibit current from flowing between the various low-side stages when turned of at different times. Freewheeling diodes reduce the need for snubber circuitry. The control signals may be isolated by high-speed optical couplers.

DC to DC switching power converters are commonly used to convert one available DC voltage to one or more other DC voltages. With some conventional DC to DC power converters, the different voltage outputs may be coupled off of a single transformer. One problem with these conventional power converters is that independent regulation of the various outputs is difficult. This is especially a problem for low voltage applications which require precise output regulation. To achieve independent regulation of various outputs, conventional DC to DC power converters have utilized separate sets of high-side and low-side switches for each output. This is having a separate power converter for each independently regulated output. This conventional approach results in increased size, weight and number of components as well as reduced overall efficiency and reliability.
Thus there is a general need for an improved DC to DC switching power converter and method. There is also a need for a DC to DC power converter and method that provides more than one output from a single input. There is also a need for a DC to DC power converter and method that can provide for independent regulation of at least two or more outputs. There is also a need for a DC to DC power converter and method that provides more power forms. There is also a need for a DC to DC power converter and method that requires fewer components and utilizes less packaging space. There is also a need for a DC to DC power converter and method that more efficiently and reliably produces independently regulated outputs.

Reduced component power converter with independent regulated outputs and method


A lift control device actively controls the lift force on a lifting surface. The device has a protuberance near a trailing edge of its lifting surface, which causes flow to separate from the lifting surface, generating regions of low pressure and high pressure which combine to increase the lift force on the lifting surface. The device further includes an arrangement to keep the flow attached around the protuberance or to modify the position of the protuberance in response to a command from a central controller, so as to provide an active control of the lift between a maximum value and a minimum value.

Often, lifting surfaces experience unsteady forces caused by turbulence, gusts, wind shear, unsteady currents, upstream obstacles, and the like. Those unsteady forces lead to structural fatigue or catastrophic loads, and must be accounted for in system design. For example, to counter the anticipated occasional unsteady forces due to wind gusts, wind turbine components must be built strong and heavy, which makes them costly to build. Similarly, the cost and weight of materials used in the construction of airplane wings and fuselages is impacted by expected fatigue loads experienced by the wings and control surfaces.
In order to reduce the impact of unsteady forces, lifting surfaces may include active controls designed to modify the lift force in reaction to changes in the inflow velocity, in such a way as to minimize the fatigue loads experienced by the structure. One example is movable flaps, located either near the leading edge or the trailing edge of the blade. The flaps are controlled by a computer algorithm that is designed to minimize the undesirable fatigue load. In addition to movable flaps, there are other alternative active load control techniques, including boundary layer blowing or suction, synthetic jets, microtabs, and others.
Unfortunately, all of the active control techniques listed above are complex, and complexity leads to reliability problems, high capital cost, high energy cost, and safety issues. What is needed in the art is a simple and robust method of actively controlling the lift on lifting surfaces in response to changes in the inflow.


A building management system (BMS) provides feedback to a user via a user interface to assist the user in configuring the BMS. It can be challenging for new or less experienced users to understand all of the actions they are performing when configuring a BMS. The feedback presented via the user interface includes graphical and textual feedback to alert the user of actions performed when applying tags. The feedback identifies one or more missing requirements associated with the tags. The feedback presented via the user interface also includes textual summaries of control sequences configured using the BMS. The textual summaries include descriptions of control sequences and instructions for properly configuring the building equipment.

The present disclosure relates generally to the field of building management systems. A building management system (BMS) is, in general, a system of devices configured to control, monitor, and manage equipment in or around a building or building area. A BMS can include, for example, an HVAC system, a security system, a lighting system, a fire alerting system, any other system that is capable of managing building functions or devices, or any combination thereof.
Building management systems can be difficult to properly configure for new or inexperienced users. Even for more experienced users, the process of configuring a BMS for a large site can be very time consuming and a variety of mistakes can be made. It would be desirous to have a BMS that can assist users during the configuration process.

Building management system with instant feedback on configuration


Methods and systems for supplying power to multiple voltage islands using a single supply source are disclosed. Aspects of one method may include providing power to a first of a plurality of voltage islands, and individually controlling providing of power to each of a remaining portion of the plurality of voltage islands. For example, when an electronic system is first powered on, a low current voltage source may be used to supply power to a primary voltage island. As a higher current voltage source becomes available, power derived from the higher current voltage source may be provided to the primary voltage island and to secondary voltage islands. Power to each of the secondary voltage islands may be, for example, individually controlled via a power MOS transistor. The power MOS transistor may also be configured to allow a faster blocking time than unblocking time.

Power consumption is very important in many electronic devices, especially in mobile devices, which have very limited battery power. However, even for those electronic devices that are not powered by batteries, power conservation may be optimized. This may allow, for example, marketing advantages as an "energy saver" device. Many electronic devices may have multiple subsystems, and some of these subsystems may require power at different times. Accordingly, multiple power sources may be utilized to provide power to each of the multiple subsystems. This may comprise additional circuitry and heat generation, which may increase power consumption and overall system cost.
Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such systems with some aspects of the present invention as set forth in the remainder of the present application with reference to the drawings.

Method and system for supplying power to multiple voltage islands using a single supply source (SSS)


A mounting device for hand-worn jewelry in the shape of two open rings joined together at their ends essentially forming an inverted ‘m.’ The mounting device comprises two semicircular arcs joined together to form the bottom of the inverted ‘m’ shape and three vertical stems connected at their lower end to the semi-circular arcs thus forming the legs of the inverted ‘m’. Caps are affixed to the tip of the stems, to allow anchoring of the mounting device to the webbing of the hand and also to provide on their upper surface a mounting and display area for mounting precious stones or for engraving artistic motifs.

Hand worn jewelry has been in existence since antiquity. Such jewelry typically consists of rings worn on fingers. These rings are usually made of precious metal and sometimes serve as the mounting base for precious stones in various shapes, configurations, colors and materials. Various designs have been invented for such rings, but in essence the rings have always been toroidal to fit around a finger.
U.S. Pat. No. 6,581,413 by Kadosh is an interesting example of ring arrangement. In essence, Kadosh mechanically joins two rings together, each ring being worn on a different finger. However, Kadosh still relies on the basic toroidal shape for his rings.
The world of fashion always needs novelty. There is a need for a new kind of implement for mounting jewelry on a hand. In addition, there is a need for such an implement to mount jewelry without obstructing the fingers from view.
Further features, aspects, and advantages of the present invention over the prior art will be more fully understood when considered with respect to the following detailed description claims and accompanying drawings.

Open rings for supporting jewelry between fingers


There is provided herein a flame retarded polyamide composition comprising: (a) at least one polyamide; (b) a hydroquinone bisdiphenyl phosphate ester of the general formula (I): wherein R1, R2, R3 and R4 each independently is aryl, or arylalkyl each independently containing up to about 30 carbon atoms, optionally interrupted with heteroatoms, X is a divalent hydroquinone group, containing up to about 20 carbon atoms, and n has an average value of from about 1.0 to about 2.0; and, (c) at least one brominated flame retardant and optionally, melamine polyphosphate.

Glass reinforced or non-reinforced thermoplastic polyamides are used for the production of electronic parts such as connectors, frames, moving parts, transformers, micro motors, amongst others. In most of these applications, flame retardancy is needed and is usually provided by flame retardant systems based on a combination of brominated flame retardants with antimony trioxide as synergist.
But this type of flame retardant system has limitations, because antimony trioxide, being a very efficient synergist, tends to significantly increase the smoke yield, which impairs visibility and creates problems for evacuation of people in the case of fire. Furthermore, antimony trioxide has a very high bulk density which increases the specific gravity of molded parts. This is especially undesirable in transportation and aviation. Even furthermore, antimony trioxide has significantly increased in price in recent years. Still further, some recently introduced ecolabels require elimination of antimony trioxide from thermoplastic parts.
Although there is a clear need for low antimony trioxide or antimony trioxide free flame retardant plastics, such usually requires a significant increase in the loading of brominated flame retardant.
While some phosphorus-containing materials have been used such as the aluminum salt of diethylphosphinic acid (DEPAL), it has still resulted in various processing issues such as corrosion of extruder screws, lower flow, more difficult moldability, longer injection molding times, poor recyclability, poor mechanical and thermal properties and less than desirable ageing resistance.


Provided is a method and apparatus for providing a three-dimensional (3D) image. A plurality of first projection images may be created by detecting X-rays which are emitted toward an object at different angles. A plurality of second projection images with respect to a partial volume of the object may be created by applying a forward projection and interpolation to at least one of the plurality of first projection images. A left image and a right image may be selected from among the plurality of second projection images, and the selected left image and right image may be displayed for a user as a 3D projection image.

1. Field
Exemplary embodiments relate to a method and apparatus for providing a three-dimensional (3D) image.
2. Description of the Related Art
A digital breast tomosynthesis (DBT) refers to an apparatus which may be used for acquiring an X-ray projection image of breast from a limited angle and reconstructing a three-dimensional (3D) volume of breast tissue based on the acquired X-ray projection image. For example, the DBT may refer to an apparatus which may be used for creating a 3D image which represents a portion of a body of an object by digitizing multiple X-rays.
To diagnose a state of tissue which may include breast cancer by using the reconstructed volume of breast tissue, a diagnostician has generally so far observed slices of recovered volume. In the case of the above method, the diagnostician may be required to perform a diagnosis while performing an imaging correlation between slices in his mind, and may be required to perform the diagnosis by using a large number of slice images. In addition, in the case of using a slice image, tissue which is twisted on a detector plane may not be identifiable due to depth blurring.

Method and apparatus for providing three-dimensional (3D) image


An anatomical healing abutment is configured to connect to a dental implant. The healing abutment has a body portion which includes at least three reference marks that provide data to orient the connection axis of the abutment with the that of the dental implant so that certain conventional steps, including healing abutment manipulation, multiple scans, and the taking of impressions, can be eliminated, thereby saving time and effort on the part of the practitioner.

The success of implant dentistry was vastly improved by the incorporation of osseointegration. Osseointegration was originally discovered by Dr. P. Bränemark in the 1950s and 1960's using titanium implants. Dr. Branemark, an orthopedic surgeon, discovered that when titanium was implanted into bone, the two substances fused safely and securely. This appeared to provide a permanent solution to the old problem of replacing missing teeth with a durable, stable substitute for the original tooth.
However, what has been proven over time is that intimate bony contact with the dental implant is not the only condition for dental implant success. Bony anatomy at the superior aspect of the dental implant where it meets the eventual dental restoration or prosthesis is also very critical for dental implant success. Dental implant art continues to go through many modifications and evolutions in an attempt to maximize dental implant success, including aesthetic factors.
The result of more than a half century of development is a standardized set of implant hardware, and techniques for using that hardware. Dental implants and their accompanying extensions and abutments have a wide range of different shapes and designs. Examples are manufactured by Nobel Biocare, Strauman, Zimmer Biomet, BioHoizons, Implant Direct, and a number of others. Practitioners in this particular field are well aware of all the aforementioned hardware produced so that no additional elaboration is needed for an understanding of the background of this invention. Primers on implants are cited in the Information Disclosure Statements.
Historically, dental implants were placed in a surgical staged approach (two stages). The first surgical stage consisted of making an incision in the gingival tissue and reflecting the gingival tissue to the buccal and lingual to expose the alveolar bone. An osteotomy (hole to receive the dental implant fixture) would then be created in an increasing diameter stepwise fashion using a dental drill with low speed, high torque and irrigation. The dental implant fixture (implant) would then be screwed or pressed into the osteotomy and the gingival tissue would be reapproximated and sutured closed.
After a healing period of two to six months, the second stage surgical procedure would be performed at which time a small flap or hole punch would be used to create a hole in the gingival tissue through which a healing collar (healing abutment) would be placed. The gingival tissue would then heal around the healing collar for two to four weeks, at which time the artificial tooth (crown) would be fabricated and placed by screwing or cementing it to the dental implant final abutment.
A key development in the implant art is the anti-rotational connection between the dental implant fixture embedded in the bone at the missing tooth or extraction site and the final abutment (which holds the prosthesis replacing the tooth) fixed to the implant fixture. The basic designs were developed by Niznick, and are disclosed in a plurality of patents originated by that individual. All of these patents are incorporated herein by reference, and cited in the Information Disclosure Statement.
The anti-rotational connection (for crown or prosthetic abutments) patented by Niznick is so important in this art that it has become a key hardware standard, so that its absence in modern implant treatment for partially edentulous situations virtually never occurs. Furthermore, the use of these various anti-rotational connectors determine the techniques and procedures that have also become standard in modern implant dentition. As such, further elaboration is not required.
Anti-rotational connections come in many shapes, including a hexagonal shape (by Zimmer and BioHorizons); a conical hexagon and a tri-lobed arrangement (Nobel Biocare); four-sided arrangements; and, an octagon (Strauman), as well as a number of others on the market. By preventing rotation between the permanent (or final) abutment holding the crown complex (prosthesis) to the implant fixture, a high degree of stability is achieved.
Because of the reliability provided by such standard procedures and hardware, a great deal of modern implant dentition can now be directed to aesthetics, and efficiency in conducting the overall replacement process (to prevent unnecessary discomfort to the patient). The overall process steps and armamentarium, from tooth extraction to placement of the final prosthesis at the edentulous site are crucial in that they determine the overall efficiency and pace of the surgical procedure (including patient discomfort), and most importantly the aesthetic characteristics of the final prosthesis and the surrounding anatomy.
More recent developments in the procedures by which dental implants are placed include performing both the first and second stage surgical procedures at one time (single stage implant surgery), and immediate placement of dental implants after tooth extraction. Single stage dental implant surgery can be described as placing the dental implant fixture and healing abutment or collar at the same time. The advantage of this is that the patient only has to go through one surgical procedure, thereby saving time and inconvenience for the patient.
Conventional healing collars were developed to better facilitate the second stage of the surgical process. This includes the insertion of the healing abutment into the implant through partially healed gingiva to guide the contouring of the gingiva. To facilitate this, conventional healing abutments have always been circular in cross section, and have always been rotatable to screw into the implant. This was done to create as little trauma as possible to the partially healed gingiva. Despite the convenience of using a circular healing collar in single stage surgery, there are both esthetic and mechanical drawbacks.
A major disadvantage to the use of conventional, circular healing collars is that maturation of the gingival tissue around a conventional circular cross-sectional (in the horizontal plane) healing collar, heals in a non-anatomic shape. This situation can make the placement of the final crown more difficult. As the gingival tissue matures in a non-anatomic shape it is less resilient to the outward pressure of the final crown's (prosthetic tooth) greater overall dimension and different shape, which can cause a mismatch between gingiva and crown. This can hinder the complete seating (cementation or screw fixation) of the final crown.
This situation can cause the crown to be incompletely connected onto the abutment, therefore requiring reduction of the crown's occlusal surface or resulting in open regions between the abutment and crown interface. Open regions between the abutment and crown can cause cement extrusion into the surgical site resulting in an inflammatory tissue response, compromised healing and alveolar bone loss. Both stability and aesthetics can be compromised. This can be exacerbated by inaccurate placement of the crown abutment with respect to the connection axis of the implant.
A disadvantage of immediate dental implant placement after tooth extraction is the possibility of initial reduced stability of the implant fixture due to the implant osteotomy not having the same shape as the tooth root socket. To address this, bone graft materials are often placed within the tooth root socket around the dental implant fixture to help bone completely form around the dental implant fixture. With lack of gingival tissue to help retain the bone graft, the graft can become unstable. A conventional circular healing abutment does not allow for complete occlusion of the gingival opening and stabilization of the bone graft. This also adds to the difficulty of fitting a crown abutment to the implant site.
Membranes made of different materials have been used in the past to attempt to stabilize bone graft materials. However, their lack of rigidity can also lead to bone graft instability. This lack of bone graft stability can lead to loss of the bone graft and non-ideal alveolar bone anatomy. Non-ideal alveolar bone anatomy around a dental implant will ultimately lead to displeasing aesthetic results.
In modern implant dentistry, the aesthetics of the implant site and the surrounding tissue have become paramount. The conventional art regarding healing abutments focuses largely on maintaining a gingival opening for the tooth restoration to traverse through. Conventional healing abutments have been designed with a circular cross sectional configuration so as to create a gingival opening to accept the restoration hardware (crown and holding abutment). Conventionally, there is a wide range of sizes and shapes available that create a circular cross sectional opening within the gingiva. Such systems have only occasionally been successful in contouring gingiva, and providing acceptable final aesthetic results.
Custom made temporary prostheses have also been used but are labor intensive, take multiple appointments, and do not contour, contain, and stabilize bone graft materials. These temporary prostheses are usually fabricated to gradually increase in size with the attempt to contour the gingival tissue over time. This approach can be very time consuming, expensive for the patient, and only addresses the gingival tissue.
History has shown that favorable final aesthetics is directly related to the shape of the gingival anatomy and shape of the interdental gingival papilla.
Numerous studies (Tarnow, Salama, and the like) have shown that the final anatomic shape and appearance of the interdental papilla is directly affected by the height of the alveolar crestal bone and its distance from the interproximal contact point of the two adjacent tooth crowns. These studies are incorporated herein by reference.
It has been shown that the distance from the height of the alveolar crestal bone to the contact point can determine whether or not the interdental gingival papilla between the crowns will appear anatomically correct. If the distance between the two landmarks is less than the recommended guidelines, the practitioner can be relatively certain that the interdental papilla will fill the space between the tooth crowns leading to favorable aesthetics. If the distance between the landmarks is greater than the recommended guidelines then the probability for incomplete presence of the interdental papilla increases and esthetics becomes less favorable. However, conventional techniques have proven unreliable in controlling the desired contouring of gingiva.
These drawbacks of conventional implant dentition have been addressed by the anatomical healing abutment system of U.S. Pat. No. 8,382,477, issued Feb. 26, 2013, to the instant inventor. This system optimizes both the mechanics and the aesthetics of bone graft contouring and the resulting gingiva configuration. These benefits result from the anatomical healing abutments shaping qualities, both with and without concavities for bone graft material. Unfortunately, there still remain flaws in conventional implant dentition with regard to matching a crown, or other prosthetic abutment, to the complexities of the optimized gingiva configuration resulting from the subject healing abutment. This is especially true for the conventional process of fitting a crown abutment in a complex gingiva configuration which has been shaped to conform with an original tooth at the implant site.
Conventionally, in order to configure a crown abutment to the gingiva at the implant site, it is necessary to go through a number of steps. The first step is to remove the healing abutment from the implant site. This is done using the special tools included with the healing abutment kit to expose the surrounding gingiva. For the next step, an optical scan is made of the entire jaw area to obtain a gingiva profile at the implant site with respect to the rest of the mouth. This scan also provides an accurate picture of the optimized gingiva, but little more with respect to the orientation of the implant.
Next, a device known as a scan post or body (105 in FIG. 17) is inserted at the site of the implant. The scan post must be configured so as to fit onto the implant using the existing implant connection arrangements. This is necessary to provide data on the implant location, angle and connection axis. Once again, this is a time-consuming process, and can be irritating to the patient.
Another scan is then made of the jaw, gingiva and scan post. This is done to provide the correct orientation of the axis of connection of the implant so that the crown abutment can be properly oriented with respect to the rest of the jaw when the crown abutment connects to the implant. After the second scan is completed, the scan post is removed and the healing abutment replaced.
The aforesaid process can often prove to be tedious to both the practitioner and the patient. The use of the scan post, along with two scans (rather than one), is time-consuming and expensive. Nonetheless, the use of this process is absolutely necessary for creating optimal aesthetic prosthetics, such as crowns. Another complication is that the scanning systems provided by different commercial entities use different types of scanning bodies or posts. The use of these different devices complicates the process for the practitioner, who must adapt to different sizes, shapes and configurations of scanning bodies and posts. This adds to the time spent by the practitioner and the inconvenience suffered by the patient.
All of the aforementioned data (an accurate depiction of the gingiva, the details of the implant, and their relationship to the rest of the jaw and associated dentition) are absolutely necessary to create virtual models of any proposed prosthetic device and its abutment. This means that there are two major issues to consider: the precise fitting of the abutment and the crown thereon; and, the overall aesthetic appeal of the combined crown and abutment. To obtain the best aesthetic determination for crown appearance, it is helpful to have a modeling system that can provide a wide variety of different proposed crown shapes.
The dental practitioner can then make a determination regarding the best aesthetics that can be provided for a crown at the implant site. A crown configuration (and the correct prosthetic abutment orientation) for optimum aesthetics can be very time-consuming. Fortunately, this part of the process does not place a strain on either the practitioner or the patient since virtual modeling is used. Rather, this part of the process is carried out only after all of the data has been gathered from the patient, and the patient's time and discomfort is not an issue. Rather, it is the time spent scanning the patient's mouth, both with and without the healing abutment, and the use of the scanning post, that places a strain on both practitioner and patient. This data gathering aspect of the overall process presents the problems in crown configuration and alignment.
In the art of implant dentistry, a key goal is expediency and maximum cost-effectiveness. This cannot be properly achieved with the current techniques for measuring crown abutments, and designing crowns. Consequently, improvements in the conventional system are needed to improve the overall speed and cost-effectiveness of the measuring system for crown abutments. This must be achieved with a minimum of impact on the patient, and will require less patient time in the operatory.

Healing abutment system for configuring crown abutments at an implant site


Embodiments of the disclosure provide a method and apparatus for encrypting and decrypting data. The method for encrypting data in a computer system can include: receiving, by a memory operation module, a first data and a second data for encryption; determining at least one storage area for a first encrypted data corresponding to the first data and a second encrypted data corresponding to the second data; generating at least one key based on the first and second data and the at least one storage area; and encrypting the first data and the second data using the at least one key to generate the first encrypted data and the second encrypted, respectively.

With the accelerating pace of global informatization, networks and mobile Internet devices have been closely linked to people's life and have become an indispensable carrier for information exchange in the modern society. As the performance of mobile smart devices improves significantly and the coverage of the high-speed mobile Internet expands continuously, mobile offices and mobile financial transactions are popularized. But there are increasingly more threats to office data and financial transaction data.
To solve the data security problem, it is necessary to improve the level of computer technologies, cryptological theories, and network applications. Currently, the information security protection has been developed from conventional single-point information encryption to an information assurance system that is constructed based on chip level hardware protection and that covers the entire network system. Moreover, a low-cost, small-size high-performance chip design that resists decryption and has an information security protection mechanism has become an inevitable trend. Therefore, a System-on-Chip (SoC) design gradually becomes a new development trend of embedded systems. A chip designer usually integrates an encryption/decryption algorithm and an information security protocol in one SoC chip, which provides a higher level of security. However, the encryption/decryption algorithm integrated in the conventional SoC chip uses a same key for encryption/decryption of different chips or different storage areas in the same chip, and cannot protect data effectively.

Storage data encryption/decryption apparatus and method


A process for preparing a photographic emulsion involves an initial nucleation step of reacting a first silver salt with a bromide in the presence of a first excess halide under conditions effective to nucleate AgBr crystals. The nuclei are then grown to form photosensitive grains by addition of a second silver salt and a second halide as growth salts. If excess chloride is used during nucleation, even without excess bromide and/or a growth modifier, the nuclei formed have twin planes, and the pAg level can be used to control the aspect ratio of the tabular grains obtained. If a relatively high silver concentration in the growth solution is maintained throughout the growth step, the resulting grains have a unique, twinned cubooctahedral or cubooctahedral-tabular shape. Unique tabular grains having alternating 1.1.1 and 1.0.0 edge faces can be formed by this process.

Photographic film quality is directly related to the grain properties of the silver halide emulsion. Grain properties affect sharpness, granularity, chemical and spectral sensitization, pressure sensitivity, contrast, speed, developability, and other characteristics of the film. Silver halide grains having cubic, octahedral, cubooctahedral and tabular forms are all well known and have been used in photosensitive emulsions.
Single and double twinning has been known to occur in a number of known silver halide crystal shapes. See generally James, The Theory of the Photographic Process, 4th Ed., pages 21-22. Berry et al., Photographic Science and Engineering, Vol. 6, No. 3, June 1962 pages 159-165 describe doubly twinned cubic grains and speculate as to the existence of doubly-twinned cubooctahedral grains (at page 162). As illustrated in FIG. 1.9 of James, known double-twinned tabular grains have a ridge-trough edge structure.
Many methods have been proposed for producing thin tabular grains of intermediate or high aspect ratio. See, for example, Takada et al., U.S. Pat. No. 4,783,398 issued Nov. 8, 1988, wherein a growth modifier is used during nucleation and growth to produce a tabular grain having a 50-90 mole % content of chloride and an aspect ratio between 2:1 and 10:1. Maskasky, U.S. Pat. No. 4,400,463 issued Aug. 23, 1983, describes hexagonal and dodecahedral tabular grains with ridge-trough edge structures. Maskasky U.S. Pat. No. 4,713,323 issued Dec. 15, 1987 uses a large excess of chloride (0.5 molar CaCl.sub.2) and a growth modifier at nucleation and during growth to provide tabular grains with aspect ratios of 8:1 to greater than 12:1. In Daubendiek et al., U.S. Pat. No. 4,914,014 issued Apr. 3, 1990, a thin tabular grain silver bromide or bromoiodide emulsion is precipitated using excess bromide at the nucleation stage. A large stoichiometic excess of bromide is also recommended in Wilgus U.S. Pat. No. 4,434,226 and Kofron U.S. Pat. No. 4,439,520.
Double-twinned tabular grains have been prepared in a variety of forms. See, for example, Saitou U.S. Pat. No. 4,945,037, which describes tabular grains wherein the center and outer portions of the grain contain different mole percent amounts of iodide. Grains having both 1.1.1 and 1.0.0 planes are mentioned; see also Konica European Patent Publication Nos. 421,740 and 421,426. A commonly-assigned application by Jagannathan et al. entitled HIGH EDGE CUBICITY TABULAR GRAIN EMULSIONS describes AgBr and AgBrI tabular grains wherein less than 75% of the edge surfaces lie in 1.1.1 crystallographic planes.
A variety of methods for preparing photographic emulsions have involved using two or more different halide salts. Saleck et al., U.S. Pat. No. 4,075,020 issued Feb. 21, 1978, describes a halide converted emulsion made by continuous conversion of a more soluble silver halide into a less soluble silver halide. Finnicum et al., U.S. Pat. No. 4,147,551 issued Apr. 3, 1979, discloses a halide converted emulsion process which produces cubic and mixed crystal silver halide grains. Typical halide conversions produce amorphous grains and are unable to produce the more preferred tabular grains which exhibit superior photographic qualities. Saleck et al., U.S. Pat. No. 4,241,173 issued Dec. 23, 1980, reports a process where silver halide is precipitated in a large (50 mole %) excess of chloride under equilibrium conditions and without a separate nucleation step.
Despite these recent advances, a need remains for methods capable of controlling the aspect ratio of silver halide tabular grains, and also for preparing new twinned grain shapes. The present invention addresses these needs.

Process for preparing a photographic emulsion using excess halide during nucleation


A new and distinct cultivar of Aechmea plant named ‘America’, characterized by its upright and outwardly arching growth habit; unique creamy white, light green and green variegated leaves with green-colored margins and creamy white and light green-colored longitudinal stripes; inflorescences held upright and above the foliar plane on strong fuchsia red-colored scapes; tightly branched inflorescences with rosy-colored flower bracts with dark blue violet apexes; and long-lasting inflorescences.

The present invention relates to a new and distinct Aechmea plant, botanically known as Aechmea dichlamydea var. trinitensis×Aechmea fendleri and hereinafter referred to by the cultivar name 'America'.
The new Aechmea plant is a naturally-occurring whole plant mutation of the Aechmea dichlamydea var. trinitensis×Aechmea fendleri 'Blue Tango', disclosed in U.S. Plant Pat. No. 11,743. The new Aechmea plant was discovered and selected by the Inventor from within a population of plants of 'Blue Tango' in a controlled greenhouse environment in Princeton, Fla. in 2005.
Asexual reproduction of the new Aechmea plant by offsets in a controlled greenhouse environment in Princeton, Fla. since 2005 has shown that the unique features of this new Aechmea plant are stable and reproduced true to type in successive generations.


An electron flux amplifier is provided wherein a microchannel plate (MCP) is monolithically formed with, or bonded to, a semiconductor amplifier. In a preferred embodiment, microchannels are formed to extend into a semiconductor substrate to a predetermined depth from the surface, and a collection diode is formed in the substrate beneath the channels. The collection diode may comprise a single planar diode, or a plurality of electrically isolated diodes to provide for imaging of the electron flux. The electron flux amplifier may be used as a detector in a photomultiplier tube (PMT) having a photoelectronically responsive input surface and one or more accelerating electrodes for directing a photoelectron flux toward the electron flux amplifier.

The present invention relates to an electronic current amplification and collection structure for photomultiplier tubes and to a photomultiplier tube incorporating such a structure. In particular the current amplification and collection structure includes a micro-channel plate multiplier and a reverse-biased semiconductor diode.
Photomultiplier tubes are known for detection or imaging of electromagnetic signals including signals of particular spectral characteristics such as infra-red signals, visible light signals, ultra-violet, x-rays, and gamma rays. In a typical photomultiplier tube, photons of such signals are incident upon a biased conductive surface, a photocathode, which emits electrons via the photoelectric effect. These primary electrons are then accelerated toward a biased conductor, or dynode, which emits further electrons, i.e., secondary electrons. Amplification is achieved within a photomultiplier tube by arranging several dynodes to receive incident electrons and to emit secondary electrons, and by configuring the biasing electric fields among the dynodes to guide the emitted electrons along paths between successive dynodes. Ultimately, the cascading stream of electrons is collected to provide an electrical current proportional to the incident photon flux. The degree of amplification provided between the initial photon flux and the collected electron current is determined by factors including the electron emission characteristics of the dynodes, the number of dynode stages, and the voltage applied between successive dynodes for accelerating the electrons.
It is desirable for photomultiplier tubes to provide as high an amplification as possible for a given applied voltage. It is also desirable for photomultiplier tubes to be compact and mechanically reliable. For imaging purposes, it is also desirable for the two-dimensional cross section of the amplified electron stream to accurately represent the two-dimensional distribution of incident photons.
One device for amplifying an electron beam while maintaining the two-dimensional distribution of the beam is a microchannel plate. For example, U.S. Pat. No. 5,086,248 to Horton et al. describes methods for producing a variety of microchannel plate structures formed from semiconductor wafers. A typical microchannel plate includes a body of secondary electron emissive material having a number of pores extending through the body. Electrodes formed on respective sides of the body allow application of a bias voltage parallel to the direction of the pores. In operation, incident electrons collide with the walls of the pores, thus causing a cascade of secondary electrons which further collide with the pore walls to provide amplification of the incident photon flux.
In accordance with one aspect of the present invention, a device for amplifying and collecting electron current in a photomultiplier tube is provided. The device combines a microchannel plate (MCP) formed of a semiconductor material and a planar, reverse-biased semiconductor diode for collecting electrons emitted from the microchannel plate. The MCP and reverse-biased diode may be provided as a monolithic structure by forming the MCP in a semiconductor substrate such that the channels of the MCP extend into the substrate to a predetermined depth, and by forming the diode to be located beneath the bottom of the channels.
In accordance with another aspect of the present invention, amplification and collection of an electron flux is enhanced by a structure incorporating a microchannel plate and a planar diode. The microchannel plate and diode are preferably formed monolithically. The microchannel plate amplifies an incident electron flux by emission of secondary electrons. The diode is configured to provide solid-state amplification by mechanisms of electron bombardment induced current (EBIC) and/or by avalanche generation of excess carriers.

Integrated semiconductor microchannel plate and planar diode electron flux amplifier and collector


In some embodiments, the present specification describes methods for displaying a three-dimensional image of an isolated threat object or region of interest with a single touch or click and providing spatial and contextual information relative to the object, while also executing a view dependent virtual cut-away or rendering occluding portions of the reconstructed image data as transparent. In some embodiments, the method includes allowing operators to associate audio comments with a scan image of an object. In some embodiments, the method also includes highlighting a plurality of voxels, which are indicative of at least one potential threat item, in a mask having a plurality of variable color intensities, where the intensities may be varied based on the potential threat items.

X-ray computed tomography (CT) scanners have been used in security screening in airports for several years. A conventional system comprises an X-ray tube that is rotated about an axis with an arcuate X-ray detector which is also rotated, at the same speed, around the same axis. The conveyor belt on which the baggage is carried is placed within a suitable aperture around the central axis of rotation and moved along the axis as the tube is rotated. A fan beam of X-radiation passes from the source through the object to be inspected and subsequently to the X-ray detector array.
The X-ray detector array records the intensity of X-rays passed through the object to be inspected at several locations along its length. One set of projection data is recorded at each of a number of source angles. From these recorded X-ray intensities, it is possible to form a tomographic (cross-sectional) image, typically by means of a filtered back projection algorithm. In order to produce an accurate tomographic image of an object, such as a bag or package, there is a requirement that the X-ray source pass through every plane through the object. In the arrangement described above, this is achieved by the rotational scanning of the X-ray source, and the longitudinal motion of the conveyor on which the object is carried.
In this type of system the rate at which X-ray tomographic scans can be collected is dependent on the speed of rotation of the gantry that holds the X-ray source and detector array. In a modern CT gantry, the entire tube-detector assembly and gantry will complete two to four revolutions per second. This allows up to four or eight tomographic scans to be collected per second, respectively.
As the state-of-the-art has developed, the single ring of X-ray detectors has been replaced by multiple rings of detectors. This allows many slices (typically 8) to be scanned simultaneously and reconstructed using filtered back projection methods adapted from the single scan machines. With a continuous movement of the conveyor through the imaging system, the source describes a helical scanning motion about the object. This allows a more sophisticated cone-beam image reconstruction method to be applied that can in principle offer a more accurate volume image reconstruction.
Some conventional CT scanners comprise non-rotating stationary gantry systems, which project X-ray beams from fixed, stationary sources at the subjects to be scanned. These systems include one or more spatially distributed X-ray sources for emitting X-rays and one or more X-ray detectors for detecting the X-rays. Multiple X-ray sources are required to be activated at the same time to produce a fan beam of X-rays in order to create a three-dimensional scanned image of an object. Stationary gantry systems may use anywhere from a dozen to a few hundred X-ray sources to produce a scanned image that varies in quality depending on the number of X-ray sources used. Non-rotating gantry CT scanners are also used in medical imaging applications to capture detailed three-dimensional (3D) images of subjects, at high speeds.
Real-time Tomography (RTT) is a new generation of X-ray systems that implement multi-emitter X-ray sources with more than one cathode or electron gun and one or more high voltage anodes within a single vacuum tube, envelope or X-ray tube. In this system, a multi-emitter X-ray source allows non-sequential motion of an X-ray beam about an object under inspection through the use of multiple grid controlled cathodes which can be excited in any chosen sequence, the electron beam from each source being directed to irradiate anode sections which are distributed around the object under inspection. This allows non-helical source trajectories to be constructed at high speeds consistent with the requirements for dynamic and high-throughput object imaging. Additionally, the rapid switching of cathodes under electrostatic control enables a fast movement of the effective focal spot of the X-ray tube and rapid generation of sets of tomographic X-ray scan data without the use of moving parts.
Human visual system has a capability of viewing across a great bandwidth for interpretation of a scene. 3D datasets presented by the current scanning and imaging systems pose a challenge for visualization that has not yet been overcome. The amount of 3D data to be shown all at once in a single view is limited. Objects of interest are often hidden within the data and occluded. Visualization of CT data of a large bag in airport screening contains one or more regions of interest (ROI) that may be potential threat objects (PTOs), occluded by surrounding clutter in a baggage that is being scanned. These ROIs often cannot be discriminated from occluding regions. Simply extracting the ROIs or PTOs from the image may not be helpful because one typically loses context upon isolating the ROI or PTOs. Visualization of small ROIs without surrounding information is often meaningless. Surrounding context is particularly important when visualizing an object within a 3D scene because humans comprehend objects and spatial relationships between objects based on depth cues. In order for the user to correctly interpret the PTO (the focus), interact with it or orient oneself, the user simultaneously needs a detailed depiction (focus) along with a general overview (context).
While CT X-ray scanners are able to produce 3D images of objects under inspection and/or of medical subjects, they are limited in their ability to process complex 3D images and portions thereof, for a relatively more focused and contextual analysis—to resolve security threats and, of the regions of interest in medical applications. Therefore, there is a need for improving efficiency and usability of the analysis of threat objects and/or anatomical structures embedded in a complex 3D image.

Methods and systems for generating three-dimensional images that enable improved visualization and interaction with objects in the three-dimensional images


An improved fingerprint sensing device is provided with multiple sensing apparatus, two or more of which operating on different sensing principles. For example, a capacitive sensor may be integrally formed with an optical sensor on a single substrate. Ideally, the multiple sensing apparatus are disposed such that they may sense nearly identical portions of a fingerprint simultaneously. A primary sensor may be employed to establish the identity of a user based on a fingerprint, while a secondary sensor may be employed to establish that the fingerprint is part of a live human (anti-spoofing). Integrated light sources may be provided to drive an optical sensor. The light sources may also provide visual cues for usage, and enhance the aesthetics of the device.

1. Field of the Invention
The present invention is related to devices for biometric identification, and more specifically to an integrated multi-sensor device, such as a hybrid optical and electronic sensor, which may be employed for biometric identification, authentication, etc.
2. Description of the Prior Art
It is well known that no two person's fingerprints are identical. The differences between two individuals' fingerprints can therefore be used to identify and distinguish individuals for a variety of applications. Two primary categories of fingerprint sensing technology exist today: electrical and optical.
Broadly, optical sensing uses light (visible or otherwise) to capture an image of a user's fingerprint. For example, if a sufficiently intense light is incident on a user's finger, some of that light will be reflected. This reflection may be captured as an image and compared to a reference image to establish the identity of the user. There are many variations on this basic optical technology, including the selection of one or more different wavelengths of light to image the fingerprint, direct imaging, scanned imaging, total internal reflection (TIR) imaging, image enhancement (e.g., polarization), etc. In order to address difficulties such as dry, dirty or thickly callused skin, or fingertips worn smooth or damaged by surface cuts, scrapes, etc. which interfere with simply observing the surface pattern of an individual's fingerprints, certain optical fingerprint sensors examine attributes of a user's finger below the surface of the skin. See, e.g., Rowe et al., U.S. Pat. No. 6,560,352, which is incorporated by reference herein. Fundamentally, however, all optical technologies operate by capturing an image of a portion of a user's finger using light emitted from a light source.
Again broadly, electrical sensing captures an image of a user's fingerprint by measuring the response of one or more electrical components in the presence of the fingerprint. These responses are examined to determine characteristics of the surface and/or structure of a user's skin at or proximate the tip of the user's finger which are indicative of a fingerprint pattern. For example, capacitance is in part a function of the distance between two electrodes. If one electrode is a plate in the sensor and the other is a portion of a user's finger, as the distance between the finger and the plate vary the capacitance will vary. According to another example, the presence of a finger can alter the fringing effect between the two capacitor plates in a substrate. In either case, the height differences between a ridge and a valley (relative to the plate) in a fingerprint can be determined by observing the change in capacitance. An image of the fingerprint (or equivalently, regions thereof) can then be constructed. See e.g., Kramer, U.S. Pat. No. 6,512,381; Tartagni, U.S. Pat. No. 6,320,394; Knapp, U.S. Pat. No. 5,325,442; Tamori, U.S. Pat. No. 5,400,662; and Tamori, U.S. Pat. No. 5,429,006; each of which being incorporated by reference herein.
As each of the various optical and electrical sensing technologies have, to a greater or lesser extent, disadvantages which lead to errors in image construction and ultimately the possibility of misidentification a user, there is a virtually unending need to improve the accuracy of biometric sensing and identification. Furthermore, while no two individuals will have identical fingerprints, it is possible to construct a replica of an individual's fingerprint using a latent print or other captured form of an original fingerprint. Such replicated prints have historically been used to defeat the security of biometric identification systems, (so-called "spoofing"). Techniques for defeating spoofing, such as measuring temperature, electrical conductivity, optical reflectivity, etc. of the finger and proximate tissue are known (and referred to as "anti-spoofing"). However, virtually as soon as a new anti-spoofing technique is deployed, an effort surfaces to defeat it. Therefore, in addition to improved accuracy, there is a continuous need to improve anti-spoofing techniques.

Hybrid multi-sensor biometric identification device


The method of fabricating a multi-level, metallic microstructure includes the steps consisting in structuring a first layer of photosensitive resin so as to obtain a first level of a resin mould, the aperture in the first resin layer revealing a conductive surface of a substrate, structuring a second photosensitive resin layer over the first level of a resin mould so as to obtain a multi-level resin mould, the apertures in the multi-level mould revealing the conductive surface of the substrate, galvanically depositing a metal or alloy in the apertures of the multi-level resin mould and separating a multi-level metallic structure formed by the metal or alloy deposited in the apertures from the substrate and the multi-level resin mould.

Methods that correspond to the above definition are already known. In particular, the article by A. B. Frazier et al. entitled "Metallic Microstructures Fabricated Using Photosensitive Polyimide Electroplating Molds" published in the Journal of Microelectromechanical Systems (Vol. 2, N deg. 2, June 1993) describes a method of fabricating multi-level metallic structures by galvanic growth in polyimide moulds made by the photolithography of photosensitive resin layers. This method includes the following steps:                creating a sacrificial metallic layer and a priming layer on a substrate for subsequent galvanic growth,        spreading out a layer of photosensitive polyimide,        irradiating the polyimide layer with UV radiation through a mask that matches the contour of one level of the structure to be formed,        developing the polyimide layer by dissolving the non-irradiated parts so as to obtain a polyimide mould,        filling the mould with nickel to the height of the mould by galvanic growth, and obtaining an approximately flat top surface,        depositing a thin layer of chromium over the entire top surface by vacuum plating,        depositing a new layer of photosensitive resin on the chromium layer,        irradiating the resin layer through a new mask that matches the contour of the next level of the structure to be obtained,        developing the polyimide layer so as to obtain a new mould,        filling the new mould with nickel to the height of the mould by galvanic growth,        separating the multi-level structure and the polyimide mould from the sacrificial layer and the substrate,        separating the multi-level structure from the polyimide mould.
It will be clear that the method that has just been described may, in theory, be repeatedly implemented to obtain metallic structures that have more than two levels. One drawback of this method is the necessity of obtaining an approximately flat top surface during each galvanic deposition step. One solution to this problem is disclosed in EP Patent No. 1,835,050, which teaches that it is possible to obtain the desired flat surface by machining the metallic structure and the mould in situ after the galvanic deposition step. However, the presence of in a clean room machining installations could potentially create more problems than it solves. The alternative, which consists in making return trips between a machining installation and the clean room, is also incompatible with the extreme cleanliness generally necessary for photolithography and galvanic deposition.
EP Patent No. 0,851,295 discloses another method for fabricating multi-level metallic structures in moulds made by UV photolithography. This second method includes the following steps:                a) creating a sacrificial metallic layer on a substrate,        b) spreading out a layer of photosensitive epoxy resin with a thickness of between 150 and 700 microns,        c) pre-baking said layer at a temperature between 90° and 95° for a duration that depends upon the deposited thickness,        d) irradiating the resin layer with UV radiation through a mask that matches the contour of one level of the structure to be obtained,        e) post-baking said layer to cause polymerisation        f) reproducing steps b) to e) at least once, and if required, depending upon the desired contour for structuring the new layer of photoresist, using a different mask for step d),        g) developing the superposed resin layers by dissolving the non-irradiated parts so as to obtain an epoxy resin mould,        ii) forming a primary metallisation over the entire surface of the mould, then completely covering the mould by galvanic depositions so as to form the multi-level metallic structure,        h) separating the substrate from the assembly formed by the epoxy resin mould and the metallic structure,        iii) separating the multi-level structure from the resin mould.
One advantage of this second method is that the resin mould is completely made prior to the galvanic deposition step. Any machining of the multi-level metallic structure can thus be performed afterwards, outside the clean room, without any risk of contaminating the latter. However, this second method also has some drawbacks. In particular, the superposed resin layers are developed during the same step. In these conditions, the prebake step of the second photoresist layer necessarily also constitutes a post bake of the first layer. It is thus very difficult to adapt the temperature and the duration of the bakes in an optimum manner.

Method of fabricating multi-level metallic parts by the liga-UV technique


An angular rate sensor that utilizes the Coriolis effect and which includes two dithered accelerometers having proof masses suspended by a hinge fabricated out of a Silicon substrate, the proof masses are provided with support struts that can be adjusted by applying heat to the struts to compensate for misalignment of the proof masses along the dither axis. In one embodiment, the hinges are located on the same side of the substrate and a vibrating beam force transducers are connected between each of the proof masses and associated accelerometer frames in a push-pull arrangement.

In order to provide relatively low cost, inertial grade sensors for measuring angular rate of rotation as well as linear acceleration, sensors have been developed that include a pair of accelerometers and their mounting structure fabricated out of a monolithic planar substrate. The accelerometers can then be dithered along the plane of the substrate so that the output signals of the accelerometers have a Coriolis component which can be used to measure angular rate of rotation. The accelerometers can also provide signals representing linear acceleration of the sensor in an axis normal to the plane of the substrate. Typically, the accelerometers and mounting structure are etched or micromachined out of a monolithic wafer of silicon. Examples of this type of sensor are described in U.S. Pat. Nos. 5,241,861, 5,319,976, 5,331,853, and 5,341,682 all of which are assigned to the assignee of this invention.
It has been discovered that small angular alignment errors, on the order of 100.mu. radians, can occur due to accelerometer misalignment resulting from minute manufacturing tolerances and inherent deviations in wafer flatness. Since rate accuracy in this type of sensor is a function of full scale g-range, dither frequency and phase resolution, a 100.mu. radian error in a sensor being dithered at 600 Hz can result in a bias uncertainty of 3 degrees per hour. One approach to solving this problem is described in U.S. Pat. Nos. 4,665,748 and 4,799,385, both of which are assigned to the assignee of this invention, where accelerometer misalignment is reduced by measuring the in-phase component of the dither signal and serving a parallelogram mechanism that supports the accelerometers. However, such a parallelogram accelerometer support mechanism is not practical in the type of sensor where the accelerometers are fabricated out of silicon wafer.
Also, the sensors described in U.S. Pat. Nos. 5,241,861, 5,319,976, 5,331,853, and 5,341,682 can be subject to cross-axis linear vibration sensitivity because the hinges supporting the proof masses of the accelerometers are located on opposite sides of the substrate.

Axis aligned rate and acceleration sensor