The handle assembly comprises a beam which extends from an area on the user's forearm to just beyond the user's knuckles between the phalanges and metatarsals. A saddle at the forearm end distributes loads over the forearm area. The saddle may be fitted with a adjustable strap to hold the saddle in place. There is a journal at the knuckle end, the axis of the journal being essentially parallel to the beam and positioned such that the hub of a hand grip attached to a shaft in the journal fits between the fore and middle fingers of the users hand. An adaptor is attached to the shaft to facilitate attaching any of a variety of tools or implements to the assembly. In one embodiment of the invention the grip comprises a second saddle which engages the wrist joint for the hand. Mounting the grip and adaptor on the journalled shaft enables altering the active direction of the tool or implement without moving the forearm saddle on the arm.

The subject invention is in the field of handles for hand held and operated equipment, including, for examples, hammers, saws, typewriters and computer key boards. Specifically it is in the field of handles intended to relieve physical stress in the wrist joint during use of hand-held equipment. More specifically, it is in the field of handles for tools which must or may be used without action of the wrist joint of the hand holding the hand-held equipment. 2. Prior Art
The patents listed below are a sampling of the prior art in this field, the closest prior art known to the inventor of the subject invention. U.S. Pat. Nos.:
______________________________________ 2,353,557 4,570,340 2,672,685 4,924,571 4,117,593 4,924,924 ______________________________________
The Arm Controlled Power Cutter of U.S. Pat. No. 4,924,571 and the Hand-held Turning Tool System of U.S. Pat. No. 4,924,924 both embody the principle feature of the subject invention: i.e. structure which bridges the wrist joint for the purpose of reducing the physical forces applied to and required of the joint relative to the bending moment applied by use of a particular tool or implement. This feature is not particularly applicable to tools or implements which require flexing of the wrist joint, such as a hammer or a tennis racquet but it is particularly applicable to tools and implements which do not necessarily require flexing of the wrist joint, such as knives and hand gardening tools.
The usefuleness of a handle incorporating structure which bridges a wrist joint is significatly enhanced by having the handle readily and easily adaptable to use with a variety of tools and implements and to a variety of techniques of using any or all of the tools and implements. This is particularly true in view of the fact that a wrist joint has two primary rotary degrees of freedom with a complete range of combinations of the two.
Accordingly, the prime objective of the subject invention is to provide a handle having wrist bridging structure which significantly relieves physical stress on the user's wrist. A second objective is that the direction of action of a tool attached to the handle be controllable without movement of the apparatus on the user's forearm.

Handle assembly for relieving wrist joint stress


A support for holding or restraining construction or roofing articles on an inclined or pitched roof. The support prevents construction or roofing articles from sliding down or off the inclined or pitched roof of a house or building and allows the construction worker or roofer to position the articles in the immediate area where the construction worker or roofer is working. The support may also have a tray attached to a level surface of the support so that construction tools and/or materials may be located therein for ready accessibility to the construction worker or roofer.

1. Field of the Invention
The present invention relates to a support for various construction and roofing articles to prevent them from sliding down or off an inclined or pitched roof of a house or building. The support which is lightweight and easy to handle is made from an elastomeric material such as foam rubber. The support is generally wedge-shaped and can also accommodate a tray on one of its surfaces. The tray can hold construction tools, supplies, etc. The support is especially adapted to restrain roofing shingles or a bundle of roofing shingles from sliding down a pitched roof
2. Description of the Related Art
There is a number of devices which have been used by roofers and construction workers to support various articles on a pitched roof The Riggs'patent U.S. Pat. No. 4,043,093 discloses an L-shaped device which is particularly adaptable to holding a bundle of roofing shingles on a sloping roof, the device has a bent over section at one end thereof for hooking over the top edge of a lower course of roof shingles previously attached to the roof The Wozney, Jr., patent U.S. Pat. No. 4,987,720 discloses a non-skid device particularly adaptable for holding shingles on a pitched roof; the device is somewhat L-shaped and has a rubberized or elastomer foam material secured to the underside of its base. The Rihaly patent U.S. Pat. No. 5,165,642 discloses a shingle holder with a T-shaped structure which lies flat on the surface of a sloping roof and a pair of arms extending perpendicularly from one end thereof; the shingle holder is secured to the roof at the opposite end of the T-shaped structure by one or two nails. The O'Farrell et al patent U.S. Pat. No. 5,232,187 discloses a device for supporting a paint bucket on an inclined surface such as a roof, the device is wedge shaped and has a cavity in one surface thereof for insertion of a paint bucket therein and the device has a non-slip base plate on another surface thereof wherein the base plate is made from a soft sponge material. The Monaco patent U.S. Pat. No. 5,249,397 discloses a knockdown platform for use on an inclined roof; the platform which is collapsible can be adjusted to provide a flat table top to support painting or roofing materials, etc.

Article support and tray for a pitched roof


Systems and methods for biological sample detection by combining and directing light with an optical blender that provides a composite beam from spatially and spectrally distinct non-parallel light sources.

Systems for detecting fluorescence can include one or more detectors to provide detection of fluorescence by each sample analyzed. These systems can include a broadband light source excitation of each sample analyzed. These systems can include filters to separate the output of the light source into multiple excitation wavelengths. It can be desirable to combine the outputs of spatially-separate and spectrally distinct light emitting diodes (LEDs) or lasers to achieve a higher flux in multispectral detection.

Combining multi-spectral light from spatially separated sources


A method and apparatus for orienting a disk to precisely align a fiducial mark on the disk relative to an external reference point while gripping the disk only along its circumferential edge.

This invention relates to a method and apparatus for orienting a disk (e.g., a silicon wafer) to precisely align a fiducial mark on the disk relative to a reference point external to the disk.
Various processes require the ability to rotationally position a disk to a known orientation. For example, in the fabrication of silicon wafers, in order to mark the disk in a particular location on the disk surface, it is necessary to precisely orient the disk relative to a marking device, e.g., a laser. Such applications may require very precise disk positioning while minimizing any contact with the disk surface. For example, published SEMI guidelines and specifications for silicon wafers used in the production of semiconductor chips appear to require that such wafers be manipulated only by its circumferential edge; see SEMI MI-0298 Specifications For Polished Monocystalline Silicon Wafers, which limits contact to an exclusion zone extending 3 mm from the wafer edge toward its center.

Method and apparatus for orienting a disk via edge contact


A system and method to correct or cancel MOS linear region impedance curvature employing an analog solution to trim out the MOS linear region impedance curvature while accommodating PVT spreads in values of internal or external precision resistors. The linear region curvature correction may be obtained by using two MOS transistors in the pad driver/buffer and operating the transistors so as to proportionately increase output impedance of one of them when the output impedance of the other decreases, and vice versa. A linear pad impedance may be maintained over a range of Vpad values, while also maintaining the Vgs supplied to pad driver transistors at its maximum possible value to obtain greater linearity. The approach of the present disclosure relaxes the requirements on the voltage/current references used in the MOS pad drivers and makes tight impedance control possible, especially in a situation where the MOS fabrication process (typically all currently used processes) does not have available an internal precision resistor with a reasonably well controlled value.

1. Field of the Disclosure
The present disclosure broadly relates to pad impedance in MOS (Metal Oxide Semiconductor) driver circuits and, more particularly, to an apparatus and method to correct MOS linear region impedance curvature.
2. Brief Description of Related Art
The high speed I/O standards governing data transfers between two high speed electronic devices require a tight control of output impedance of a device driver or buffer circuit in such devices. In modern I/O standards, the output impedance is required to be controlled to a nominal value ± some percentage error or variation. For example, FIG. 1 illustrates an exemplary pad impedance specification 10 under USB2.0 (Universal Serial Bus version 2.0) for a low impedance driver circuit. An example of a low impedance drive unit is a USB1.1 (Universal Serial Bus version 1.1) buffer circuit within a USB2.0 PHY (Physical Layer) device. The specifications mandated in the chart in FIG. 1 may apply to such USB1.1 buffer circuits. In USB2.0, the output impedance of a driver circuit or buffer unit must be controlled within 45 Ohms ± 10% of tolerance. Therefore, the allowable range of output impedance becomes from 40.5 Ohms to 49.5 Ohms. This allowable range is shown by the shaded portion in FIG. 1. It is observed from FIG. 1 that such impedance control applies over a certain voltage range on a drive circuit output pad (i.e., the voltage range of Vpad shown in FIG. 2 and discussed later hereinbelow.) In case of USB2.0, this voltage range is from 0V to 1.1V. Beyond Vpad=1.1V, the pad impedance (Rpad in equation (1) given hereinbelow) is allowed to increase as seen from the spread of the shaded region in FIG. 1.
The discussion herein uses the terms "pad" or "integrated circuit pad" interchangeably to refer to an electrically conducting junction or outlet for a circuit that is fabricated using a semiconductor fabrication process (e.g., a CMOS fabrication process). The pad for the circuit allows the circuit to be connected to another circuit on the same integrated circuit (IC) chip or to another circuit or device external to the chip containing the circuit with the terminating pad.
FIG. 2 illustrates a general approach to pad impedance control in a MOS driver circuit 12. The MOS driver circuit 12 is fabricated as part of an integrated circuit (IC) and includes an n-channel MOS transistor M1 (14) having its gate terminal 16 connected to a bias voltage Vgs (denoted as a gate-to-source voltage source 17), its source terminal 18 held at a ground potential, and its drain terminal 20 connected to the integrated circuit's or chip's output pad (IC pad) 24 via a series resistor Rs 22—also referred to interchangeably herein as an internal precision resistor, an internal linearizing resistor or an internal termination resistor. The internal linearizing resistor 22 is typically integrally fabricated (i.e., on the same chip) with the MOS transistor 14. As discussed hereinbelow, an external precision resistor (not shown) may also be used instead of the internal one. The voltage present at the output pad (e.g., when another electronic device is connected to the IC containing the driver circuit 12) is denoted by the variable pad voltage source Vpad 26. In the circuit configuration of FIG. 2, the impedance present at the IC pad 24 may be given by the following equation:
                              R          pad                =                                            V              pad                                      I              pad                                =                                    R              s                        +                          1                              β                                                  (                                                            V                      gs                                        -                                          V                      T                                        -                                                                  V                        ds                                            2                                                        )                                                                                (        1        )                                          where                                                              β                =                              (                                          μ                o                                            C                ox                                      )                                          (                          W              L                        )                                              (        2        )            It is noted here that equation (1) neglects the effects of channel length modulation, λ. In equation (1), Rs is the internal linearizing resistor 22, Vgs is the gate-to-source voltage 17, VT is the appropriate threshold voltage (for NMOS or PMOS), Vds is the drain-to-source voltage present in the transistor M1, and β is the transconductance of the MOS device 14 (in mA/Volt). As is known in the art, the value of β is as defined in equation (2), in which μ0 is the surface mobility of the channel (holes for p-channel or electrons for n-channel) given in (cm2/volt.second), Cox is the MOS gate capacitance per unit area (in F/cm2), W is MOS device's effective channel width (cm), and L is MOS device's effective channel length (cm).
It is noted that different MOS fabrication technologies may have different values for μ0 and Cox. If μ0 and Cox are low, then the width-to-length ratio W/L (i.e., the size of the MOS device) needs to be made very large to compensate for the lower μo and Cox values, thereby maintaining the impedance control for Rpad in equation (1). It is further noted that the equations (1) and (2) apply to the MOS transistor M1 in its linear region (i.e., the region between cutoff and saturation) of operation. The linear region of operation of the MOS transistor 14 with an internal linearizing resistor 22 is shown in the two pad or "output" current (Ipad) versus pad or output voltage (Vpad) graphs (the transconductance graphs) 28, 30 in FIG. 2. In the linear region, the curvature of the Ipad-Vpad graph 28 is small with large value of Vgs 17, whereas the curvature of the Ipad-Vpad graph 30 is large with lower values of Vgs 17. This curvature is interchangeably referred to hereinbelow as "MOS linear region impedance curvature," or "MOS linear region curvature," "linear region curvature," or simply "impedance curvature." It is known that the slope of an Ipad-Vpad curve gives the reciprocal of Rpad. Thus, because of the MOS linear region curvature, the values of Rpad are not the same or controlled for graphs 28 and 30.
Although the series resistor Rs 22 forces the NMOS transistor M1 to be in its linear region, for this technique of impedance (Rpad) control to work, it is usually assumed that Vgs is at its maximum value (e.g., at supply voltage Vdd in an NMOS device) and that the PVT (Process Voltage Temperature) variation of Rs 22 is relatively small (at least with respect to the PVT impedance variation of transistor M1). The gate-to-source voltage Vgs 17 must normally be at its maximum possible value (for transistor M1 linear region operation) to minimize the impedance curvature of transistor M1 (as, for example, in the graph 28 in FIG. 2) because of the changing Vds as the pad voltage Vpad 26 changes (due to, for example, fluctuations in the operating characteristics of another device or circuit stage connected to the MOS driver circuit 12 through the IC pad 24 or presence of a "return wave front" from such device operating as a signal receiving device).
The effect of PVT spread of the internal linearizing resistor Rs 22 may be illustrated in the case of a USB1.1 buffer within a USB2.0 PHY as follows. In a 0.11 μm embedded CMOS fabrication technology, the value of Rs 22 will spread by as much as 45% from its nominal value over PVT. Thus, for example, if the nominal value (at 0° C.) of Rs=28 Ohms, then it will actually PT spread between about 22 Ohms and 35 Ohms. The problem is the lower 22 Ohm limit because it means that, for a 45 Ohm overall impedance requirement (as discussed hereinbefore with reference to FIG. 1), the linear region of MOS transistor M1 (14) has to make up greater than 50% of that total impedance (or 45 Ohms). Such a high impedance requirement from transistor M1 (14) during its linear region of operation may create an impedance curvature of as much as several Ohms over the 1.1V range of the USB2.0 specification (discussed hereinabove with reference to FIG. 1). If one chooses Rs 22 much higher than 28 Ohms, then the dimensions (W/L) of transistor M1 (14) would be unrealistically huge as can be seen from equations (1) and (2). An external precision resistor (not shown) of high value may be used (as discussed hereinbelow) to maintain the smaller size of M1, but there would still be some linear region curvature (in the Ipad-Vpad graph) and also a need for extra pads (for external precision resistor).
A problem with the current precision resistor approach is that many non-analog CMOS fabrication processes do not have precision resistors available. In such processes, it may not be possible to meet a tight impedance specification with the circuit of FIG. 2. In such processes, some additional form of PVT impedance trimming is usually necessary. At present, three basic solutions (or mixtures of them) exist to control pad impedance within a tight percentage spread.
In the first approach, an external series precision resistor Rs (not shown) is used with essentially no PVT variation. The external resistor is not fabricated along with the MOS transistor M1 (14), but rather externally attached to the IC pad 24 in series with transistor M1 when needed. In this configuration, the internal resistor 22 may be absent from the MOS driver circuit 12. If such an external resistor Rs is made large enough, then one can effectively compensate for large PVT variations in the impedance of transistor M1. Unfortunately, there are some disadvantages with this technique: (1) This technique requires external components and increases system cost and component count. (2) This technique may require more I/O pads (e.g., in case of using such technique for a USB1.1 buffer in a USB2.0 PHY device). (3) Even with an external precision resistor, it may not be possible to meet a tight low impedance specification (e.g., under USB2.0 as discussed above with reference to FIG. 1) because of the need to make transistor M1 inordinately large in size (as can be seen from equations (1) and (2) above).
In the second approach, a "digital" (or "discrete") impedance trimming technique is used. In this technique, transistor M1 (14) may comprise of a number of NMOS "fingers," the "correct" number of fingers being activated for any given PVT corner. The advantage of this technique is that Vgs 17 can be kept constant, normally at its maximum possible value (e.g., supply voltage Vdd (not shown)), to minimize the curvature in the linear region impedance of transistor M1 (14). However, the disadvantages of this digital calibration technique are: (1) When it is not possible to drive Vgs to a high value (>>Vds(max) in the Vpad region of interest), then the linear region impedance curvature of transistor M1 (14) can still be very significant. When one takes into account comparator offsets and reference voltage offsets (in the trimming circuit realization), then a tight impedance specification may not be realizable. (2) In this technique, a whole replica pad driver is required for comparison with some reference precision resistor (or current derived from such a precision resistor). This is a waste of silicon area, for example, in a USB2.0 PHY device that needs just two impedance controlled IC pads. The addition of an entire third pad for just impedance control may not be desirable. (3) It is not clear under this technique when one needs to update the impedance (i.e., change the number of NMOS "fingers"). Impedance updating may not be done safely during data transmission because it could cause major discontinuities in the rise/fall in voltage/current characteristics of the transmitting pad. This may cause the overall system to fail. Therefore, the impedance needs to be updated at a time when there is no active data transmission (or data reception, if the pad is being used as a termination resistance as, for example, in the USB2.0 HS mode). However, there may be no clear "gap" in the transmission protocol and, hence, choosing such "update gap" may pause an additional problem for the system designer. Such "update gaps" may be defined in the data protocol; however, that is not the case for USB2.0. The USB2.0 system designer may have to spend time and resource to figure out such "safe gaps" during which impedance may be updated.
In the third approach, an "analog" impedance trimming technique is used. This technique essentially solves many of the problems associated with the digital trimming technique described above. The advantage of the analog trimming technique are: (1) A "fraction" or "scaled version" of the pad cell (i.e., a scaled replica pad driver) can be used for impedance trimming. This saves on silicon area. (2) The trimming process is continuous; thus, one does not need a clear "update" gap in the transmission protocol as with the digital solution. However, the disadvantages of the classical analog solution are: (1) Similar to digital trimming, the analog approach trims the pad impedance for one value of Vpad only. This means that the linear region MOS impedance curvature is not trimmed out for a range of Vpad values. (2) The use of a properly-biased, scaled replica pad may require very tight control of voltage and current references because of the existence of MOS linear region impedance curvature. (3) The Vgs of transistor M1 (14) cannot be kept constant, at its maximum possible value, to minimize linear region impedance curvature. With a fixed size for transistor M1, Vgs 17 will be maximized for the slow process corner (slow process, maximum temperature, minimum supply voltage Vdd, largest internal linearizing resistor Rs value) and, thus, the impedance curvature is minimized for this worst case corner only. For the fast process corner (fast process, minimum temperature, maximum Vdd, smallest Rs value), however, the Vgs 17 will have to be much lower than maximum, resulting in the worst linear region impedance curvature (e.g., as shown in graph 30 in FIG. 2). If the PVT change in Rs 22 is large, then the classic analog solution fails to trim pad impedance to within a tight percentage tolerance.
Therefore, it is desirable to devise an analog solution (given its many advantages in terms of, for example, reduced complexity and conservation of silicon area) to trim out the MOS linear region impedance curvature while accommodating PVT spreads in values of internal or external precision resistors. It is further desirable to maintain a linear impedance for a range of Vpad values, while also maintaining the Vgs at its maximum possible value to obtain greater linearity.

MOS linear region impedance curvature correction


An ultrasound transducer manufactured by using a micromachining process comprises: a first electrode into which a control signal for transmitting ultrasound is input; a substrate on which the first electrode is formed; a second electrode that is a ground electrode facing the first electrode with a prescribed space between the first and second electrodes; a membrane on which the second electrode is formed and which vibrates and generates the ultrasound when a voltage is applied between the first and second electrodes; a piezoelectric film contacting the membrane; and a third electrode electrically continuous to the piezoelectric film.

1. Field of the Invention
The present invention relates to a MUT (Micromachined Ultrasound Transducer).
2. Description of the Related Art
An ultrasound diagnosis method is commonly employed in which ultrasound is transmitted to walls of a body cavity and the state of the body cavity is converted into images on the basis of the echo signals thereof for the purpose of making diagnoses. An ultrasound endoscope is one of the devices used for this ultrasound diagnosis method.
The ultrasound endoscope has an ultrasound probe at the distal end of an insertion tube to be inserted into body cavities, and this ultrasound probe converts electric signals into ultrasound in order to transmit the ultrasound to body cavities and also receives ultrasound reflected in the body cavities in order to convert the received ultrasound into electric signals.
Conventionally, ceramic piezoelectric material PZT (lead zirconate titanate) has been used for piezoelectric elements that convert electric signals into ultrasound. However, micromachined ultrasound transducers (hereinafter, referred to as MUTs) have attracted attention. MUTs are among a category of devices that are referred to as micro electro-mechanical systems (MEMS).
Also, in recent years, capsule endoscopes have been realized that are swallowed into body cavities in order to obtain images of the body cavities (for example, Patent Document 8). By using this ultrasound diagnosis medical capsule endoscope, it is possible to make ultrasound diagnoses at sites at which it was previously difficult to make diagnoses.
Because the conventional MUTs have been configured to have membranes of respective transducer cells that are continuous along the plane direction, the continuous configuration has interfered with the deformation of the membranes of the respective transducer cells and the transverse waves have leaked to the adjacent transducer cells, and thereby the efficiency of the electromechanical conversion has been reduced.
Also, the membranes have been supported by the peripheral portions, and accordingly the bending vibrations of the membranes have leaked to the supporting members as longitudinal vibrations so that the mechanical quality factor Q has been reduced and the amplitude of the membrane has been small. Thereby, the S/N ratio has been reduced so that ultrasound diagnosis images have been deteriorated. Also, the conventional MUTs, especially cMUTs (capacitive micromachined ultrasound transducers) have required DC bias for both the reception and the transmission, and accordingly a driving control method that uses as small an amount of DC bias voltage as possible has been important. This DC bias has had to be applied for far longer periods of time for the reception than for the transmission, and thus a configuration that realizes reception without DC bias has been desired.
Also, the techniques relating to the present invention are disclosed in, for example, patent documents 1 through 8 below.
Patent Document 1:
Japanese Patent Application Publication No. H07-274287
Patent Document 2:
Japanese Patent Application Publication No. H08-274573
Patent Document 3:
Japanese Patent Application Publication No. 2004-274756
Patent Document 4:
U.S. Pat. No. 6,262,946
Patent Document 5:
U.S. Pat. No. 6,328,696
Patent Document 6:
U.S. Pat. No. 6,328,697
Patent Document 7:
Publication in Japan of translation of PCT International
Patent Application No. 2004-503313 (WO 2001/097562)
Patent Document 8:
Japanese Patent Application Publication No. 2004-350705
Non-Patent Document 1:
Pages 149 through 152 in the Twelfth version of Volume 1 of "Onkyo Kogaku Genron" written by Tsuyoshi Itoh and published by CORONA PUBLISHING CO., LTD, in Dec. 10, 1980

Ultrasound transducer manufactured by using micromachining process, its device, endoscopic ultrasound diagnosis system thereof, and method for controlling the same


Disabling wireless access point notifications is described. In some implementations, wireless access point notifications on a mobile device can be disabled when movement of the mobile device is detected. In some implementations, wireless access point notifications on a mobile device can be re-enabled when the mobile device detects that the mobile device has been stationary for a specified period of time following movement of the mobile device. In some implementations, wireless access point notifications can be disabled on a per access point basis.

Modern mobile computing devices are capable of detecting and connecting to wireless access points for accessing networks, including the internet. These computing devices often provide notifications (e.g., dialog boxes, pop-up windows, etc.) to users when access points are detected. Wireless access point notifications are often displayed to provide the user of the mobile device with a convenient way to identify and connect to wireless access points. However, in some circumstances, wireless access point notifications can be inconvenient and can interfere with the use of mobile computing devices.

This patent is subject to a terminal disclaimer.


An electrical plug includes an internal contact holder, which comprises a holder base, a top cover covering the holder base and a sliding cover slidably coupled to two sliding grooves in an opening in the top cover and movable along the sliding grooves in and out of the top cover to close/open the opening, a first metal conducting member installed in the holder base and extending out of the front and rear sides of the holder base and a second and third metal conducting members installed in the holder base and respectively extended out of the front and rear sides of the holder base, and a fuse electrically connected between the second and third metal conducting members and suspending in the opening of the top cover.

1. Field of the Invention
The present invention relates to electrical plugs and more particularly, to an electric plug with a fuse therein, which keeps the fuse from sight and prohibits replacement of the fuse when the electrical plug is connected to an electrical outlet.
2. Description of the Related Art
Many electrical plugs are known having a fuse for current-limiting protection. However, these electrical plugs are still not satisfactory in function due to the following drawbacks:
1. No safety measure is provided: A cover is provided to protect the fuse and to keep the fuse from sight. If the fuse is burned out, the user can open the cover to replace the burnt fuse. However, there is no safety means to prohibit the cover from being opened when the electrical plug is connected to an electrical outlet. When replacing the fuse as the electrical plug is kept connected to the electrical outlet, an accidental electric shock may occur. Further, a child may open the cover and touch the internal circuit to cause an electric shock accidentally.
2. Component parts may be loosened easily: The component parts of conventional fuse-protected electrical plugs are assembled by means of electrically connecting the power cable to the metal conducting members and then installing the metal conducting members in an electrically insulative housing. When stretching the power cable, the metal conducting members may be biased, or the connection between the power cable and the metal conducting members may be loosened, resulting in an accidental shock circuit or occurrence of sparks or fire accident.

Electrical plug with a sliding cover extending from a front of an internal contact holder


A flexible digital transmission system that improves upon the ATSC A/53 HDTV signal transmission standard. The system includes a digital signal transmitter for generating a first Advanced Television Systems Committee (ATSC) standard encoded 8-VSB bit stream and, for generating an encoded new robust bit stream for transmitting high priority information bits, wherein symbols of the new bit stream are capable of being transmitted according to a transmission mode including: a 2-VSB mode and a 4-VSB transmission mode. The standard 8-VSB bit stream and new bit stream may be simultaneously transmitted over a terrestrial channel according to a broadcaster defined bit-rate ratio. The transmission system includes a control mechanism for generating information needed for encoding robust packets at a transmitter device. It also includes a mechanism for encoding control parameters and multiplexes the generated information with the standard and robust bit-streams for transmission. A receiver architecture is additionally provided to decode standard and robust bit-streams transmitted by the transmitter device.

1. Field of the Invention
The present invention relates to digital transmission systems and particularly, to the Advanced Television Systems Committee (ATSC) Digital Television (DTV) standard (A/53). The invention describes a method for transmitting a robust bit-stream along with the standard bit-stream that is in compliance with the ATSC standard, an further describes a method for enabling identification of robust packets at a receiver device.
2. Discussion of the Prior Art
The ATSC standard for high-definition television (HDTV) transmission over terrestrial broadcast channels uses a signal that comprises a sequence of twelve (12) independent time-multiplexed trellis-coded data streams modulated as an eight (8) level vestigial sideband (VSB) symbol stream with a rate of 10.76 MHz. This signal is converted to a six (6) MHz frequency band that corresponds to a standard VHF or UHF terrestrial television channel, over which the signal is broadcast at a data rate of 19.39 million bits per second (Mbps). Details regarding the (ATSC) Digital Television Standard and the latest revision A/53 is available at http://www.atsc.org/.
FIG. 1 is a block diagram generally illustrating an exemplary prior art high definition television (HDTV) transmitter 100. MPEG compatible data packets are first randomized in a data randomizer 105 and each packet is encoded for forward error correction (FEC) by a Reed Solomon (RS) encoder unit 110. The data packets in successive segments of each data field are then interleaved by data interleaver 120, and the interleaved data packets are then further interleaved and encoded by trellis encoder unit 130. Trellis encoder unit 130 produces a stream of data symbols baying three (3) bits each. One of the three bits is pre-coded and the other two bits are produced by a four (4) state trellis encoder. The three (3) bits are then mapped to an 8-level symbol.
As known, a prior art trellis encoder unit 130 comprises twelve (12) parallel trellis encoder and pre-coder units to provide twelve interleaved coded data sequences. In multiplexer 140 the symbols of each trellis encoder unit are combined with "segment sync" and "field sync" synchronization bit sequences 150 from a synchronization unit (not shown). A small in-phase pilot signal is then inserted by pilot insertion unit 160 and optionally pre-equalized by filter device 165. The symbol stream is then subjected to vestigial sideband (VSB) suppressed carrier modulation by VSB modulator 170. The symbol stream is then finally up-converted to a radio frequency by radio frequency (RF) converter 180.
FIG. 2 is a block diagram illustrating an exemplary prior art high definition television (HDTV) receiver 200. The received RF signal is down-converted to an intermediate frequency (IF) by tuner 210. The signal is then filtered and converted to digital form by IF filter and detector 220. The detected signal is then in the form of a stream of data symbols that each signify a level in an eight (8) level constellation. The signal is then provided to NTSC rejection filter 230 and to synchronization unit 240. Then the signal is subjected to equalization and phase tracking by equalizer and phase tracker 250. The recovered encoded data symbols are then subjected to trellis decoding by trellis decoder unit 260. The decoded data symbols are then further de-interleaved by data de-interleaver 270. The data symbols are then subjected to Reed Solomon decoding by Reed Solomon decoder 280. This recovers the MPEG compatible data packets transmitted by transmitter 100.
While the existing ATSC 8-VSB A/53 digital television standard is sufficiently capable of transmitting signals that overcome numerous channel impairments such as ghosts, noise bursts, signal fades and interferences in a terrestrial setting, there exists a need for flexibility in the ATSC standard so that streams of varying priority and data rates may be accommodated.
It would thus be highly desirable to provide in an ATSC digital transmission system, a technique for transmitting new robust bit-streams along with the standard ATSC 8-VSB bit-stream, wherein the new bit-stream has a lower Threshold of Visibility (TOV) compared to the standard ATSC stream.
It would further be highly desirable to provide a flexible ATSC digital transmission system and methodology that provides a mechanism for transmitting defined parameters used to correctly identify robust packets at a receiver device.
It would further be highly desirable to provide a flexible ATSC digital transmission system and methodology that permits a trade-off of the standard bit-stream's data rate for the new bit-stream's robustness, and, further is such that the transmission is backward compatible with existing digital television receiver devices.

Packet identification mechanism at the transmitter and receiver for an enhanced ATSC 8-VSB system


Hydroxyaromatic compounds such as phenol are converted to diaryl carbonates by reaction with oxygen and carbon monoxide in the presence of a catalyst package which typically comprises a group VIIIB metal or compound thereof, an inorganic cocatalyst, an organic cocatalyst and a hexaalkylguanidinium bromide or chloride, preferably bromide. The use of the hexaalkylguanidinium salt causes an increase in the yield of diaryl carbonate without a decrease in selectivity.

This invention relates to the preparation of diaryl carbonates by carbonylation. More particularly, it relates to the improvement of diaryl carbonate yield in the carbonylation reaction.
Diaryl carbonates are valuable intermediates for the preparation of polycarbonates by transesterification with bisphenols in the melt. This method of polycarbonate preparation has environmental advantages over methods which employ phosgene, a toxic gas, as a reagent and environmentally detrimental chlorinated aliphatic hydrocarbons such as methylene chloride as solvents.
Various methods for the preparation of diaryl carbonates by a carbonylation reaction of hydroxyaromatic compounds with carbon monoxide and oxygen have been disclosed. In general, the carbonylation reaction requires a rather complex catalyst. Reference is made, for example, to U.S. Pat. No. 4,187,242, in which the catalyst is Group VIIIB metal, i.e., a metal selected from the group consisting of ruthenium, rhodium, palladium, osmium, iridium and platinum, or a complex thereof.
Further developments in the carbonylation reaction, including the use of such cocatalysts as cobalt pentadentate complexes and terpyridines, are disclosed in U.S. Pat. Nos. 5,231,210, 5,284,964 and 5,399,734. These patents also disclose the use of quaternary ammonium or phosphonium halides, as illustrated by tetra-n-butylammonium bromide, as part of the catalyst package.
The commercial viability of the carbonylation reaction would be greatly increased if product yield therein could be improved. The relatively low yields disclosed in the working examples of the above-identified patents include some in the single digits. It is evident, therefore, that methods to improve the yield are needed.

Method for preparing diaryl carbonates employing hexaalkylguanidinium halides


The present invention relates to a novel Pediococcus genus microorganism and more particularly, Pediococcus pentosaceus EROM101 (KCCM-10517) originated from human intestines having immune enhancement, anticancer and antiviral activities and a use thereof. Due to its excellent immune enhancement, anticancer and antimicrobial activities by activating macrophages/spleen cells and inducing gut immunity, the Pediococcus pentosaceus EROM101 of the present invention can be effectively used for the production of various products such as immune enhancement agent, anticancer agent, antimicrobial agent, food additive, intestinal function-controlling agent, live bacterial agent, feed additive and other fermented products.

Lactic acid bacteria are the bacteria metabolizing carbohydrate and producing lactic acid thereby. These bacteria belong to facultative anaerobes or obligatory anaerobes which proliferate well under anaerobic conditions. Lactic acid bacteria are divided into 5 genuses, which are Streptococcus, Lactobacillus, Leuconostoc, Bifidobacteria and Pediococcus. A Streptococcus genus microorganism is a homofermentive bacterium that generates lactic acid by fermenting milk to suppress putrefying bacteria or pathogenic bacteria. A Lactobacillus genus microorganism is a bacilliform, and a homo- or heterofermentive bacterium, which is widely seen in the fermentation of dairy products or vegetables. A Leuconostoc genus microorganism, a diplococcus, is a heterofermentive bacterium and mostly involved in fermenting vegetables. A Bifidobacteria genus microorganism is an obligatory anaerobe which generates L(+) lactic acid useful for children's health, but cannot survive under aerobic conditions. Lastly, a Pediococcus genus microorganism is a homofermentive bacterium having the form of tetracoccus, which is mostly found in Kimchi or brined foods and involved in the fermentation of meats including sausages. Among them, Bifidobacteria are the major obligatory anaerobic lactic acid bacteria found in human intestines, and they are counted 100–1000 times as many as facultative anaerobic lactic acid bacteria such as Lactobacillus and Streptococcus in human intestine.
Lactic acid bacteria control pH of intestines to keep them acidic condition, so that they inhibit the proliferation of harmful bacteria like E. coli or Clostridium sp. And they moderate diarrhea and constipation, and play an important role in vitamin synthesis, anticancer activity, lowering serum cholesterol and the like. Particularly, lactic acid bacteria have a specific protein that can be adhered tightly to mucosa and epithelial cells of intestines, to have an intestinal function-controlling effect inhibiting the growth of harmful bacteria. In addition, lactic acid bacteria stimulate the proliferation of macrophages, resulting in the enhancement of the capability of macrophage to recognize and sterilize harmful bacteria invaded in intestines. They, further, stimulate the secretion of immune-related substances, resulting in the enhancement of the immunity (Gabriela perdigon et al., J. of food Protection 53:404–410, 1990; Katsumasa sato et al., Microbiol. Immunol., 32(7):689–698, 1988). Especially, Lactobacillus genus microorganism produces acidophillin to inhibit the growth of harmful bacteria such as dysentery bacillus (Shigella), salmonella and staphylococcus, and the proliferation of causal bacteria of diarrhea, resulting in the normalization of intestinal flora and the cease of diarrhea. In addition, Pediococcus pentosaceus has been confirmed to have an excellent ability to inhibit the growth of harmful bacteria such as Helicobacter pylori, Listeria sp. and the like by secreting a strain specific antibacterial peptide.
Recently, studies have actively been progressing about separating lactic acid bacteria and developing a live bacterial medicine, food additive and intestinal function-controlling agent using the same, in order to keep minor lactic acid bacteria inhabiting human intestines longer. Korean patent No.264295 discloses "Novel Bifidobacterium longum MK-G7 bifidus strain having a physiological activity suitable to Koreans and a use thereof", and Korean patent No.158049 discloses "Bifidobacterium longum HS90 producing mucopolysaccharide having an excellent humidness". Also, Korean patent No.2000-316517 discloses "Novel Lactobacillus acidophilus YD9904 strain having an excellent acid producing ability and acid resistance, and a product containing the same", and the Korean patent No.2001-70689 discloses "Lactobacillus acidophilus 30SC having a great acid resistance and bile-tolerant activity as well as an antibacterial activity of inhibiting the growth of pathogenic bacteria and putrefying bacteria". Korean patent No.2001-11797 discloses "Novel acid-tolerant Lactobacillus luteri probio-16 having an antimicrobial activity against rotavirus and harmful microorganism, and live bacterial activator containing the same". That is, almost all the studies about lactic acid bacteria have been focused on Lactobacillus genus microorganisms and Bifidobacterium genus microorganisms having an acid-tolerant and/or an anti-microbial activity.


The invention relates to a heat exchanger having at least one sorption duct in which is arranged a sorption medium and through which a fluid can be made to flow, characterized in that the heat exchanger also contains at least one catalyst with which a fuel can be converted exothermically such that at least some of the resulting heat can be conveyed to the sorption medium. The invention also relates to a method for heating and/or conditioning a gas stream, having at least the following steps: supplying a gas stream, containing multiple different components, into a sorption duct in which is arranged a sorption medium, such that at least one component is bound in the sorption medium, and supplying and exothermically converting at least one fuel under the action of a catalyst, such that at least one component of the gas stream is expelled from the sorption medium.

G. M. Munz et al.: "First results of a coated heat exchanger for the use in dehumidification and cooling process, Applied Thermal Engineering 61 (2013) 878-883, discloses a device of this type. It contains a cross-flow heat exchanger, some of the boundary surfaces of which are coated with a sorbent. This serves to improve the indoor climate in a building by dehumidifying the external air supplied to the room. The indoor climate can thus be improved, in particular in hot and moist climate zones, as a result of which energy for additional cooling can be saved. This known device has to be regenerated after the full loading of the sorbent. For this purpose, the heat exchanger is supplied with heat via a heat transfer fluid, which causes the stored moisture to be expelled from the sorbent.
However, this known device has the drawback that in addition to the sorbent the housing of the heat exchanger and the pipes used to supply the heat transfer medium are heated as well. The energetic efficiency is thus only low.
It is also known from practice to heat such a heat exchanger by hot air, heating water or thermal oil. In this case, the heating by heating water is limited to temperatures below 100° C. unless the system is operated with excess pressure. However, this requires a reinforced mechanical design and thus the heating of additional masses which result from the mechanically reinforced design. Although the use of thermal oil can serve to transfer heat at higher temperatures, it creates an environmental problem when disposed of or in the case of leakages.

Heat exchanger and method for use thereof

Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.


A usage frequency attribute is determined for each biometric feature in a biometric feature database. The usage frequency attribute indicates a matching success frequency of matching the biometric feature to a user having the biometric feature. The biometric features of the user are sorted in descending order of the usage frequency attribute. The sorting is based on a descending order of the usage frequency attributes for a given user. The biometric features in the biometric feature database are stored in descending order. The storing includes providing prioritized access to the biometric feature having a highest value of the usage frequency attribute so that the biometric feature is selected first in response to a request for the biometric feature of the user.

In the biometric identification technology, a computer is used to identify a user based on physiological features (such as fingerprint, iris, physiognomy, or DNA) or behavioral features (such as the user's gait or keystroke habit). For example, fingerprint recognition, facial recognition, iris recognition, etc. are all biometric identification.
When the biometric identification technology is used to identify a user, a feature can usually be stored in a biometric feature database. Thus, a biometric feature of the user generated during initial registration is stored in the database. When identification is performed, the biometric feature of the user that is identified can be compared with features in the biometric feature database to identify the user.

Biometric feature database establishing method and apparatus


A liquid crystal diffraction lens element and an optical head device, which can switch focal lengths of both of outgoing light and returning light by a single element, are provided.

1. Field of the Invention
The present invention relates to a liquid crystal diffraction lens element capable of switching a focal point, and to an optical head device employing the liquid crystal diffraction lens element for writing and/or reading (hereinafter referred to as writing/reading) an information to/from an optical recording medium such as an optical disk.
2. Discussion of Background
Heretofore, an optical head device for writing/reading an optical recording medium such as an optical disk, carries out writing/reading an information to/from optical disks having different cover thicknesses such as CD and DVD. Here, between optical disks having different cover thicknesses, the depths of their information recording planes for recording an information, from their disk surfaces (hereinafter simply referred to as the depth of information recording plane) are different. In order to enable writing/reading of a plurality of optical disks having information recording planes of different depths, an optical modulation element for switching a focal length is employed (refer to e.g. JP-A-9-230300; hereinafter referred to as Patent Document 1.).
Here, the optical modulation element disclosed in Patent Document 1 comprises a pair of transparent substrates, a liquid crystal sandwiched between these transparent substrates, an optical member having a Fresnel lens shape provided at an interface between the liquid crystal and one of the transparent substrates, and transparent electrodes for applying a voltage to the liquid crystal. The optical modulation element is configured to switch the voltage applied to the liquid crystal to switch alignment direction of the liquid crystal, to thereby switch the refractive index of the liquid crystal for incident light to switch presence and absence of Fresnel lens function of the optical member.
For the optical head device, usually, light polarized in a predetermined direction is used as incident light, and switching of the refractive index is carried out by making the alignment direction of the liquid crystal agree with the polarization direction of incident light. The refractive index of the liquid crystal is switched so that it agrees or differs from the refractive index of the optical member having a Fresnel lens shape before and after switching of a voltage applied to the liquid crystal.
Further, in order to improve recording density of an optical disk, an optical head device employing a laser diode emitting light of wavelength 405 nm, has been proposed. For the optical head device using this wavelength band, roughly two standards have been proposed. They are the Blu-ray standard which uses a cover layer of 0.1 mm thick made of transparent resin covering an information recording layer of an optical disk and uses an objective lens of NA (numerical aperture) 0.85, and the HDDVD standard which uses a cover layer of 0.6 mm thick and uses an objective lens of NA 0.65. Further, in each of the Blu-ray standard and the HDDVD standard, in order to increase information volume in each optical disk, optical disks having multi-layer information recording layers have been developed.
However, in such a conventional optical head device, since the liquid crystal in the optical modulation element is uniformly aligned, there has been a problem that for light polarized in a direction in which the liquid crystal shows the ordinary refractive index, the refractive index of the liquid crystal can not be switched by switching an applied voltage. In an optical head device for writing/reading e.g. DVDs or high density optical disks (the Blu-ray standard or the HDDVD standard), in which a polarizing optical system is generally employed, it is possible to switch focal length of only one of outgoing light being light toward an optical disk and returning light being light reflected by the optical disk. For this reason, heretofore, in order to enable switching of focal lengths of both of outgoing light and returning light, an optical modulation element is provided for each of outgoing light and returning light, which causes e.g. increase of the size of optical head device, complication of driving, or increase of cost.
Further, in order to establish compatibility between the Blu-ray standard and the HDDVD standard, an element capable of variably changing a focal point depending on the difference of cover layer thickness, has been desired.
Further, an element for variably changing a focal point at a time of writing/reading layers of multi-layer optical disks of each standard, has been desired.

Liquid crystal diffraction lens element and optical head device

Abstract: The liquid crystal lens element comprises transparent substrates 1a, 1b, a liquid crystal 4 sandwiched between the transparent substrates 1a, 1b, transparent electrodes 2a, 2b, birefringent Fresnel lens members 3a, 3b each having a Fresnel lens shape and made of a birefringent material, and a seal 5, wherein the extraordinary refractive index direction A of the birefringent Fresnel lens member 3a and the extraordinary refractive index direction B of the birefringent Fresnel lens member 3b are perpendicular to each other, and the alignment direction of the liquid crystal 4 at the interface between the liquid crystal 4 and the transparent substrate 1a is perpendicular to the alignment direction of the liquid crystal 4 at the interface between the liquid crystal 4 and the transparent substrate 1b.


A method for enhancing spatial resolution of a transmission electron microscopy TEM) system configured for electron holography. In an exemplary embodiment, the method includes configuring a first lens to form an initial virtual source with respect to an incident parallel beam, the initial virtual source positioned at a back focal plane of said first lens. A second lens is configured to form an intermediate virtual source with respect to the incident parallel beam, the position of said intermediate virtual source being dependent upon a focal length of the first lens and a focal length of the second lens. A third lens is configured to form a final virtual source with respect to the incident parallel beam, wherein the third lens has a focal length such that a front focal plane of the third lens lies beyond the position of the intermediate virtual source, with respect to a biprism location.

The present invention relates generally to material specimen inspection techniques, and, more particularly, to a system and method for improving spatial resolution of electron holography.
Advancements in Transmission Electron Microscopy (TEM) technology enable materials to be analyzed at near atomic resolution by providing high-magnification, high-resolution imaging and analysis capabilities. TEM enables scientists to gather information relating to a material's physical properties, such as its microstructure, crystalline orientation and elemental composition. This information has become increasingly important as the need for advanced materials for use in areas such as microelectronics and optoelectronics, biomedical technology, aerospace, transportation systems and alternative energy sources, among others, increases.
TEM is accomplished by examining material specimens under a transmission electron microscope. In a transmission electron microscope, a series of electromagnetic lenses direct and focus an accelerated beam of electrons, emitted from an electron gun contained within the microscope, at the surface of a specimen. Electrons transmitted through the specimen yield an image of the specimen's structure, which provides information regarding its properties. In addition, elemental and chemical information is provided by both the transmitted electrons and the x-rays that are emitted from the specimen's surface as a result of electron interaction with the specimen.
In 1947, a Hungarian-British physicist named Dennis Gabor sought to find a way to sharpen the resolution of the images initially produced in transmission electron microscopes, which were in their infancy at the time. He proposed electron holography, a method of interference imaging in which the phase and amplitude components of the electron beam are separated to correct the spherical aberration of the microscope. In this regard, the electron beam source is split into the incident, undeviated electron wave (i.e., the reference wave) and the image wave (or object wave) diffracted by the specimen and exiting the bottom surface thereof. Assuming the electron optical geometry is correctly set up, these two waves can be made to interfere. The resulting interference pattern is then processed using optical techniques to form the holograms (images).
Unfortunately, the electron microscopes of Gabor's era did not produce an electron wave with sufficient coherence to permit the proper degree of interference required to make a useful hologram. More recently however, the development of TEMs using highly coherent field-emission electron sources has made electron holography a more effective undertaking. This technique has been shown to be particularly valuable for two-dimensional, p-n junction potential mapping of semiconductor devices with high spatial resolution. Such information is valuable for semiconductor device development and yield improvement.
Recent scaling in semiconductor device manufacturing down to sub-micrometer levels (e.g., about 20–100 nm gate length devices) warrants the implementation of two-dimensional electrical junction mapping at a high spatial resolution (e.g., less than 1 nm). In this regard, off-axis electron holography in a TEM has been successfully used to produce 2-D potential maps of semiconductor devices at a spatial resolution from which junction positions can be inferred. The potential maps are derived from phase information that is extracted from the interference pattern generated by overlapping electrons, which have passed through the semiconductor sample along with the electrons that have not.
As devices have continued to shrink, the corresponding electron holography parameters for effective inspection of the current generation of these semiconductor devices now include: an overlap width in the range of about 100 nm to about 1000 nm for an adequate field of view (FOV); a fringe spacing between about 0.1 nm to about 10 nm for meaningful spatial resolution; visibility of the fringe contrast of about 10% to about 30% for useful signal to noise ratio; and adjustability of both the overlap and the fringe spacing relative to the sample for flexibility. FIG. 1(a) is an electron hologram taken with no sample, illustrating the fringe width (which determines the FOV), while FIG. 1(b) is an enlarged view of the highlighted portion of FIG. 1(a), particularly illustrating the fringe spacing (which determines the spatial resolution).
The implementation of previous approaches to off-axis electron holography (i.e., utilizing a single objective lens) has resulted in a trade off between fringe width (FOV) and fringe spacing. For example, if the overlap width was satisfactory, the fringe spacing was unsatisfactory and vice versa. Accordingly, it has now desirable to be able to independently control the various electron holography parameters, such as overlap and fringe spacing, for adequate inspection of increasingly scaled down semiconductor devices.

System and method for improving spatial resolution of electron holography

International Business Machines Corporation


In a pixel circuit of an organic EL display device, a gate of a driving transistor is coupled to a gate of a compensating transistor, which is configured to operate as a diode. A precharge voltage is applied to the gate of the driving transistor while a selection signal is applied to a previous scan line, so that the compensating transistor is biased in a forward direction to apply a data voltage on the gate of the drive transistor. The driving transistor may be electrically isolated from the organic EL element (OLED) while precharging, so as to prevent the OLED from emitting a light using the precharge voltage. In addition, the driving transistor may be electrically isolated from the OLED while the data voltage is being charged, so as to prevent the OLED from emitting a light.

(a) Field of the Invention
The present invention relates to an image display device, and a display panel and driving method thereof. More specifically, the present invention relates to an organic electroluminescent (hereinafter, referred to as "EL") display device.
(b) Description of the Related Art
The organic EL display device, which is a display device for electrically exciting a fluorescent organic compound to emit a light, has organic light-emitting cells that are voltage- or current-driven to display an image. These organic light-emitting cells have a structure composed of an anode (indium tin oxide (ITO)) layer, an organic thin film, and a cathode (metal) layer. For a good balance between electrons and holes to enhance luminescent efficiency, the organic thin film has a multi-layer structure that includes an emitting layer (EML), an electron transport layer (ETL), and a hole transport layer (HTL). The multi-layer structure of the organic thin film can also include an electron injecting layer (EIL), and a hole injecting layer (HIL).
There are two driving methods for these organic light-emitting cells: a passive matrix driving method, and an active matrix driving method using thin film transistors (TFTs). In the passive matrix driving method, anode and cathode stripes are arranged perpendicularly to each other to selectively drive the lines. On the other hand, in the active matrix driving method, a thin film transistor and a capacitor are coupled to ITO pixel electrodes so as to sustain a voltage by the capacity of the capacitor. According to the form of the signals applied to the capacitor to sustain the voltage, the active matrix driving method can be divided into a voltage programming method and a current programming method.
The voltage programming method is for displaying an image by applying a data voltage representing gradation to the pixel circuit, but may have a problem of non-uniformity due to a deviation of the threshold voltage of the driving transistor and the electron mobility. The current programming method is for displaying an image by applying a data current representing gradation to the pixel circuit, guaranteeing uniformity. But, this method is problematic in securing the time for charging the load of the data lines, since only a slight quantity of current is used in controlling the organic EL element.
A pixel circuit for compensating for the threshold voltage of the driving transistor in the voltage programming method is disclosed in U.S. Pat. No. 6,362,798 issued to Kimura et al.
The pixel circuit disclosed in U.S. Pat. No. 6,362,798 includes, as shown in FIG. 1, four transistors M1 to M4, and an organic EL element (OLED). The driving transistor M1 transfers a current corresponding to a voltage between its gate and source to OLED, and has a capacitor Cst between the gate and source. The transistor M2 is configured to operate as a diode (i.e., its gate and drain are connected together) and has the gate connected to the gate of the transistor M1. A gate of the switching transistor M3 is connected to a current scan line Sn, and a gate of the transistor M4 is connected to a previous scan line Sn−1.
When the threshold voltage of the transistor M1 is equal to that of the transistor M2, it can be compensated due to the transistor M2. But, when the gate voltage of the driving transistor M1 is higher than the data voltage applied through the transistor M3, the transistor M2 is diode-connected (i.e., configured to operate as a diode) in a reverse direction, as a result of which the data voltage cannot be transferred to the gate of the driving transistor M1. To prevent this phenomenon in the prior art, the precharge voltage VP is applied to the gate of the driving transistor M1 and sustained to be less than the lowest data voltage, while a selection signal is applied to the previous scan line Sn−1. In this manner, the gate voltage of the driving transistor M1 reaches the precharge voltage VP when the data voltage is applied, thereby coupling the transistor M2 in the forward direction.
A current flows through the driving transistor M1 due to a voltage corresponding to the difference between the precharge voltage VP and the power voltage VDD, when the precharge voltage VP is transferred to the gate of the driving transistor M1. This current causes the OLED to emit a light, in which case normal black level cannot be displayed to represent black level gradation. Moreover, the current flows to the OLED while the data voltage is transferred to the gate of the driving transistor M1 and charged in the capacitor Cst, thereby increasing power consumption.

Image display device, and display panel and driving method thereof, and pixel circuit


An object forming method executed by at least one processing unit for forming a three-dimensional shape on a surface of a material, the method including: generating height information specifying a height of the three-dimensional shape, so that the height of the three-dimensional shape in a protection area surrounding a symbol area subjected to symbols on the surface of the material is higher than the height of the three-dimensional shape in the symbol area on the surface of the material, the material is subjected to a design including the symbols on the surface; and forming the three-dimensional shape on the surface of the material based on the generated height information.

One of known object forming techniques comprises printing a desired pattern with black ink or toner on a heat-expandable sheet that expands and increases in volume when heated, and then uniformly irradiating the entire surface of the heat-expandable sheet with light. This technique takes advantage of the fact that in comparison with the areas where no printing is made, the areas where some printing is made with black ink or toner absorb heat at higher rates and are heated to higher temperatures, and the sheet expands and rises in the areas where some printing is made with black ink or toner. For example, Unexamined Japanese Patent Application Kokai Publication No. 2012-171317 describes an object printing apparatus using the above technique.
On the other hand, a product having a three-dimensional shape formed on a surface of a heat-expandable sheet using the above technique may have the surface erased in part in the course of distribution. For example, if a three-dimensional stamp with an uneven surface is produced using the above technique and the area where numbers and/or characters representing a face value are printed is erased, information regarding the stamp face value is missing and the stamp face value becomes unknown.

Object forming method, object forming apparatus, and nonvolatile computer-readable recording medium on which program is stored


An object of the present invention is to provide a concentrated liquid food that enables easy injection and suppresses gastro-esophageal reflux.

Nasogastric or oral tube feeding, or gastrostomy or jejunostomy tube feeding, have been conventionally used for patients and the elderly who have difficulty taking food by mouth. Nasogastric or oral tube feeding is a method of continuously injecting nutrients such as concentrated liquid food via a tube inserted from the nose or mouth into the esophagus, stomach, duodenum, or jejunum; and gastrostomy or jejunostomy tube feeding is a method of continuously injecting nutrients such as liquid food via a tube placed in an external fistula that is surgically or endoscopically created in a region from the esophagus to the jejunum (often the stomach).
Since patients and the elderly to whom tube feeding is applied often have a remarkably low function of the cardia at the upper stomach, gastro-esophageal reflux may occur when a concentrated liquid food in the stomach is in the state of a fluid. To prevent gastro-esophageal reflux, it is necessary to inject a concentrated liquid food at a low speed to a seated patient. At this time, the patient being fed must remain in the same seating position for a long period of time, and this imposes a great burden on care workers and the patient.
In contrast, when the concentrated liquid food is in the state of a gel, gastro-esophageal reflux can be suppressed; however, to inject the liquid food through a tube, a high pressure must be continuously applied by a pump or human power during the injection, which requires a special device and also imposes a great burden on care workers.
In order to prevent such gastro-esophageal reflux, or in order to alleviate the burden upon injection of liquid foods, various attempts have been made. More specifically, a tube-feeding nutritive food containing a gellan gum and alginic acid as gelling agents effective for preventing gastro-esophageal reflux (Patent Document 1: JP2000-169396A), a tube-feeding nutritive food containing a carrageenan, and alginic acid (Patent Document 2: JP2000-169397A), a concentrated liquid food obtained by adding one or more kinds of a thickening material selected from low methoxyl pectin, gellan gum, alginate and the like so as to adjust the viscosity to 20-40 mPa·s, and a vomit preventing food consisting of the liquid food and a calcium aqueous solution obtained by dissolving a water-soluble calcium salt (Patent Document 3: JP2006-141258A), a gelling agent for nutritive preparations comprising a two-part liquid composed of a solution containing a low methoxyl pectin and a condensed phosphate salt; and a solution containing a bivalent or polyvalent metal salt, wherein the gelling agent gelatinizes a nutritive preparation by being mixed with the nutritive preparation before tube injection (Patent Document 4: JP2006-248981A), a gelling agent for the liquid nutritive food composed of carrageenan and a mixture of locust bean gum with an extract of devil's tongue and used in the form of a solution state (Patent Document 5: JP2007-77107A), a gel type enteral nutrient obtained by blending agar and an alginic acid and/or a salt thereof (Patent Document 6: JP2008-69090A), a tube injection thickener for a protein-containing liquid food comprising a pair of (A) a xanthan gum-containing solution and (B) a solution obtained by adding locust bean gum and/or glucomannan to a protein-containing liquid food, followed by heat treating at 80° C. or more (Patent Document 7: JP2009-153441A), a gel-like thick liquid diet or nutritional supplement satisfying conditions including a pH of 3-5, incorporation of 0.1-1 mass % of a water-soluble hemicellulose and/or HM pectin, and the like (Patent Document 8: JP2009-274964A), a gelling agent for an acidic thick liquid diet containing sodium alginate, a calcium salt insoluble/slightly soluble in neutral water, and a chelating agent (Patent Document 9: JP2009-291175A1, a gelled tube feeding nutritious food containing └-carrageenan as a gelling agent (Patent Document 10: JP2010-77068A), a method for mitigating or preventing vomiting comprising: mixing a calcium ion supplying agent with an enteral nutrient; tube-administering the resulting mixture; and, before or after the tube administration of the mixture, tube-administering a solution containing one or more substances selected from kappa-carrageenan, iota-carrageenan, sodium alginate, and alginic acid (Patent Document 11: JP-2010-254598A), an acidic gel-like enteral nutrient comprising (1) a protein, (2) an acidic polysaccharide, (3) one or more carrageenans selected from the group consisting of λ-carrageenan, └-carrageenan, κ2-carrageenan, and carrageenans including μ-component and ν-component, wherein (4) the pH is adjusted to 2.5 to 6 (Patent Document 12: JP2013-199469A), an emulsified food product composition comprising (A) a lipid, (B) a thickener that gels in an acidic region, (C) at least one emulsion stabilizer selected from the group consisting of gum arabic and gum ghatti, and (D) a divalent metal salt (Patent Document 13: WO2013/146181A), and the like have been suggested.

Abstract: The object can be solved by a concentrated liquid food, comprising:                (A) a polysaccharide that becomes gelated or thickened by combining with calcium;        (B) a calcium source; optional (C) a chelating agent;        (D) a protein having emulsifiabilty; and        (E) a soybean hemicellulose,        (with the proviso that, when the calcium source (B) is a water-soluble calcium source, the concentrated liquid food comprises the chelating agent (C)),        wherein the concentrated liquid food has a viscosity of 250 mPa·s or less before contact with a simulated gastric fluid, and has a viscosity of 1,500 mPa·s or more after contact with a simulated gastric fluid.


A molding flask structure for molding close tolerance articles, such as prosthetic dental devices. The flask structure includes upper and lower flask members that each include cup-recesses adapted to face each other to define therebetween a mold cavity when the flask members are connected together. Assembly of the flask members is effected by a plurality of connecting bolts to securely hold the flask members together. Vent passageways are provided in the flask members to extend from the mold cavity to permit excessive internal pressures to be relieved to the exterior of the flask member. A sprue opening defined by semi-cylindrical recesses in contacting faces of each of the flask members extends from the mold cavity to the exterior to permit the introduction of molding material into the mold cavity. The sprue opening is partially threaded and partially unthreaded. The flask members can be made of a plastic material which is transparent to microwaves, to permit the molding material within the mold cavity to be cured thermally either by microwaves or by direct application of external heat to the flask.

1. Field of the Invention
The present invention relates to a molding method and apparatus, and more particularly to an improved molding method and apparatus for investment-type molding of close-tolerance plastic articles, such as a dental prosthesis.
2. Description of the Related Art
Typically, a dental prosthesis, such as a full or partial denture, is prepared by forming the tooth-supporting and gum-contacting portion of the prosthesis in a closed mold cavity into which a plastic, denture base material is introduced. The replacement teeth are first properly positioned within the mold cavity, which is defined by two mold-cavity-defining mold portions, to assume the proper relative positions to replace the lost natural teeth when the prosthesis has been formed and is positioned within the mouth of the patient. The cavity-defining mold portions are separated and the material, which is often of a dough-like consistency, is positioned within the mold cavity. The mold portions are then pressed together, to compress the dough-like plastic material so that it flows to fill the mold cavity to unite with the teeth. The material is cured to form the desired prosthesis upon hardening of the plastic material.
Initially, a dentist takes an impression of the portion of the patient's mouth at which the prosthesis is intended to be positioned. The impression is in the form of a casting of plaster of paris, or other impression-defining material. When the impression material is removed from the patient's mouth and has become solidified it is packed with dental stone, which upon hardening conforms almost exactly in shape with that portion of the patient's mouth at which the finished prosthesis is to be positioned. The plaster of paris, or other impression material, is then separated from the dental stone impression.
The teeth that are to be a part of the finished prosthesis are then positioned in the appropriate place or places on the dental stone impression of the patient's mouth. The resulting stone impression and teeth are a duplicate of the patient's mouth, with replacement teeth in position. The stone impression accurately defines the surfaces of the patient's mouth and gums over which the prosthesis fits and on which it is supported when in use.
After the stone impression of the portion of the patient's mouth has been formed, a wax material is then applied to the surface of the stone impression in the desired thickness to define the thickness and outer shape of the finished prosthesis. The replacement teeth are then positioned on the wax pattern in the same position and in the same orientation that they would assume when part of the finished prosthesis. The stone impression and wax pattern are then placed in a suitable mold, and a complementary mold portion is provided by investment casting of plaster of paris over the surface of the prosthesis. Upon hardening of the plaster defining the complementary mold portion, the mold portion is separated from the impression material and the wax is removed by melting it and letting it flow from the respective mold portions. The result is a two-part mold that includes in one part the teeth to be incorporated into the prosthesis. The resulting mold cavity corresponds in shape and thickness with the shape and thickness of the final prosthesis.
Molding material is then placed between the two mold portions, which are then pressed together and held in a clamping fixture while the prosthetic material is undergoing a curing operation, such as by the application of heat. After curing the prosthesis is separated from the plaster mold portions, and is then trimmed, ground, and polished for ultimate use.
The prior art process hereinabove described most often utilizes a heat curable resin having the consistency of a dough. The dough is manually packed into the space between the upper and lower portions of the mold, and normally several trial packings are needed before the mold is finally properly packed and suitable for undergoing the curing operation. Such trial packings result in wasted molding material, and they involve repetitious and time consuming procedures.
It is an object of the present invention to eliminate the trial packing steps, with their consequent waste of material and waste of time.
It is another object of the present invention to provide a mold structure within which both investment material and the prosthesis material can be introduced to substantially eliminate processing errors.
It is a further object of the present invention to provide a mold member that is of light weight, and that is transparent to heat and microwaves for permitting curing of the molding material.

Apparatus for molding a dental prosthesis


A system and method for partitioning to support high availability of a multiprocessor system. The system comprises a plurality of masters, including processors, input/output devices, or the like, and is divided into regions. Per-region access rights are assigned to the system resources. The regions are grouped into partitions, wherein a partition is a portion of the system that is treated as a single unit with respect to failure. Failure of a master in a given region only affects resources accessible to that given region. Per-region access can be to main memory on a per-page basis, for example. Alternatively, the per-region access can limit access to directory storage, input/output ports and devices, control or diagnostics registers.

1. Field of the Invention
The present invention relates generally to multiprocessor computer systems, and more particularly, to a system and method for partitioning to support high availability of system resources.
2. Related Art
A distributed computer system typically includes a plurality of processing nodes each having one or more processors, a cache connected to each processor, and main memory that can be accessed by any of the processors. The main memory is physically distributed among the processing nodes. In other words, each processing node includes a portion of the main memory. At any time, data elements stored in a particular main memory portion can also be stored in any of the caches existing in any of the processing nodes.
As multiprocessors become larger and larger, the probability of a hardware failure increases due to the increased number of components in the system. In addition, software and hardware failures can cause a large number of processors to be unavailable. It is desirable that the effects of software or hardware failure be contained to a subset of the entire system, thus allowing the multiprocessor to be more highly available.
Access rights have been used for years by software to protect resources. However, access rights have not been commonly used to protect hardware resources in an effort to improve hardware availability. The Stanford FLASH implemented a single bit in its memory directory to protect sections of memory (see, J. Kosjin et al., The Stanford FLASH Multiprocessor, Proceeding of the 21st International Symposium on Computer Architecture,pg. 302-313, April 1994). However, this scheme of protection only supported the concept of "us versus them." Only intra-partition communications is protected by such a scheme. Communications between two partitions cannot be protected because once inter-partition communication begins, a third partition can access and corrupt any resource associated with either of the two communicating partitions.
Thus, what is required is an improved partitioning system that results in minimal, if any, system performance degradation, and requires minimal directory storage overhead while supporting high availability of system resources.

System and method for multiprocessor partitioning to support high availability


Hot press forming of a steel material is made possible by coating the surface of the steel material with a plated layer of zinc or a zinc alloy and forming thereon a barrier layer which prevents the vaporization of zinc even when heated to 700-1000° C. Corrosion resistance can also be guaranteed without requiring post treatment, and hot press forming of high tensile steel sheet and stainless steel sheet is made possible. The barrier layer is formed by forming an upper plated layer, by surface oxidation, by contact with an oxidizing agent, by contact with Zn and an oxidizing agent, by anodic electrolysis, by cathodic electrolysis, or by coating with a ZnO sol.

In recent years, in order to decrease the weight of automobiles, efforts are being made at reducing the thickness of steel materials which are used in automobiles by increasing their strength. However, this causes some problems as described below, with taking steel sheet, which is representative of steel materials, as an example. When steel sheet is press formed by drawing, for example, as the strength of the steel sheet which is used increases, the contact pressure of the sheet with the die at the time of drawing increases. As a result, galling of the steel sheet or breakage of the steel sheet may occur. If the blank holding force is decreased in order to increase the amount of the material which enters the die at the time of drawing of a steel sheet, with the intention of even slightly lessening this problem, another problem such as variation in the shape after press forming occurs.
Furthermore, so-called springback occurs at the time of press forming. There are countermeasures against this such as the use of a lubricant. However, with high tensile steel sheet having a strength of 780 MPa or above, the effect of such countermeasures is small.
Thus, the press forming of high tensile steel sheet has currently many problems. Hereinafter, this type of material will be referred to as a "difficult-to-press form steel material".
As a technique for press forming such difficult-to-press form steel materials, it is conceivable to subject a steel material to press forming after the material has been heated. Such a technique includes so-called hot press forming and warm press forming. These two methods will hereinafter be collectively referred to simply as "hot press forming".
As disclosed in U.K. Patent 1,490,535, according to hot press forming, it is possible to form a steel sheet into a complicated shape with good dimensional accuracy since the steel sheet is softer and more ductile at a high temperature. Another advantage of hot press forming is that strengthening of the steel sheet due to martensite transformation (so-called hardening) can be simultaneously achieved by heating the steel sheet to the austenite region and then performing quenching at the same time as press forming in the die.
However, since hot press forming is a method in which a heated steel sheet is subjected to working, the surface of the steel sheet to be worked is unavoidably oxidized. Even if the steel sheet is heated in a non-oxidizing atmosphere in a heating furnace, the sheet has a possibility of contacting the atmosphere, for example, when it is removed from the furnace before press forming, resulting in the formation of iron oxides on the surface of the steel sheet. These iron oxides have the problem that they may fall off during press forming and adhere to dies, thereby decreasing productivity, or that an oxide film (scale) made from such iron oxides remains on a product produced by press forming and worsens its appearance. Furthermore, if such an oxide film remains on a press formed product, in the case where the product is subsequently coated with a paint, the resulting painted film has poor adhesion to the steel sheet.
Therefore, after hot press forming, it is necessary to remove a layer of iron oxide, which is a constituent of such an oxide film, by applying shot blasting to the press formed product. This unavoidably results in cost increases. In addition, even if the iron oxide layer is removed, the steel sheet by itself has poor rust preventing properties.
Even if a low alloy steel or stainless steel is used so as to prevent the formation of such an oxide film during heating prior to hot press forming and so as to guarantee corrosion resistance, it is impossible to entirely prevent the formation of an oxide film, and the costs become much higher than for plain steel.
In order to prevent such surface oxidation of steel sheet at the time of hot press forming, theoretically it is effective to use a non-oxidizing atmosphere for both the atmosphere at the time of heating and the atmosphere during the entire pressing process, but this results in a large increase in equipment costs.
Due to these circumstances, even today, hot press forming is not sufficiently utilized.
An outline of current technology which has been proposed in patent applications is as follows.
One advantage of hot press forming is that heat treatment can be performed simultaneously with press forming. It is proposed in JP 07-116900A (1995) to simultaneously perform surface treatment at this time. However, there is no disclosure therein with respect to a means of solving the above-described problems due to surface oxidation.
A steel sheet for hot working is proposed in JP 2000-38640A, which is coated with aluminum in order to provide the steel sheet with resistance to oxidation at the time of hot working. However, this steel sheet, too, is much more expensive than plain steel.
As proposed in JP 06-240414A (1994), from just the standpoints of improving rust preventing properties or corrosion resistance, the addition of elements such as Cr and Mo to the steel composition of a steel material is employed in some cases. However, with such a countermeasure, not only do the costs increase due to the addition of Cr and Mo, but in the case of a material for press forming, there is the problem of a deterioration in press formability due to the addition of these alloying elements.


An ejector cycle system with a refrigerant cycle through which refrigerant flows includes an ejector disposed downstream of a radiator, a first evaporator located to evaporate refrigerant flowing out of the ejector, a branch passage branched from a branch portion between the radiator and a nozzle portion of the ejector and coupled to a refrigerant suction port of the ejector, a throttling unit located in the branch passage, and a second evaporator located downstream of the throttling unit to evaporate refrigerant. In the ejector cycle system, a variable throttling device is located in a refrigerant passage between a refrigerant outlet of the radiator and the branch portion to decompress the refrigerant flowing out of the radiator.

Ejector cycle systems provided with multiple evaporators have been conventionally known as in JP Patent No. 3322263 (corresponding to U.S. Pat. No. 6,574,987, U.S. Pat. No. 6,477,857).
As illustrated in FIG. 6, a first evaporator 16 is connected downstream of an ejector 15 with respect to a refrigerant flow. An accumulator 32 that is a vapor-liquid separator is located downstream of the first evaporator 16 with respect to the refrigerant flow. Further, a second evaporator 20 is located between a liquid phase refrigerant outlet of the accumulator 32 and a refrigerant suction port 15b of the ejector 15. The two evaporators 16, 20 are simultaneously operated.
In this refrigerant cycle, a pressure drop caused by a high-speed flow of refrigerant as expanded is utilized to draw refrigerant that flows out of the second evaporator 20, and further, velocity energy of refrigerant as expanded is converted into pressure energy at a diffuser portion 15d (pressure increasing portion) to raise the refrigerant pressure (i.e., the inlet pressure of a compressor 11). Thus, power for driving the compressor 11 can be reduced, and the efficiency of cycle operation can be enhanced.
In this refrigerant cycle, heat absorbing (cooling) action can be produced from separate spaces by using the first evaporator 16 and the second evaporator 20, or it can be produced from one and the same space by the two evaporators 16, 20. Also, the interior of a vehicle compartment can be cooled by using the two evaporators 16, 20.
In this refrigerant cycle, refrigerant that flows out of a radiator 12 all passes through a nozzle portion 15a of the ejector 15. Here, the flow rate of refrigerant that passes through the nozzle portion 15a of the ejector 15 is referred to as Gnoz. This Gnoz is set to such a flow rate that the dryness of refrigerant on the outlet side of the first evaporator 16 becomes a predetermined value or below. The refrigerant depressurized through the nozzle portion 15a is mixed with the refrigerant drawn through the refrigerant suction port 15b of the ejector 15, and flows into the first evaporator 16. The refrigerant that flows out of the first evaporator 16 is separated into vapor phase refrigerant and liquid phase refrigerant in the accumulator 32.
The refrigerant suction port 15b of the ejector 15 is depressurized and thus produces sucking action. As a result, the second evaporator 20 is supplied with the liquid phase refrigerant separated in the accumulator 32. Here, the flow rate of refrigerant drawn through the refrigerant suction port 15b is referred to as Ge. The liquid phase refrigerant that flows into the second evaporator 20 is evaporated at the second evaporator 20. Therefore, most or all of the refrigerant drawn through the refrigerant suction port 15b is vapor phase refrigerant. Consequently, the flow rate Gnoz of liquid phase refrigerant substantially contributes to the cooling capacity of the first evaporator 16. Therefore, the cooling capacity of the first evaporator 16 is influenced by Gnoz.
By increasing the flow rate Ge of refrigerant drawn to the refrigerant suction port 15b of the ejector 15, the flow rate of liquid phase refrigerant that flows into the second evaporator 20 is increased. Accordingly, the cooling capacity of the second evaporator 20 can be increased without reducing the cooling capacity of the first evaporator 16, and thus the cooling capacity of the entire cycle is increased as well.
The cooling capacity of an evaporator is defined, for example, as increment in the enthalpy of refrigerant observed when the refrigerant absorbs heat from air in the evaporator. The increment in enthalpy is defined by multiplying an increment in the specific enthalpy of refrigerant per unit weight by the flow rate of the refrigerant. The cooling capacity of the entire cycle is defined as the sum Qer of increments in the enthalpy of refrigerant at the first and second evaporators 16 and 20. The cooling capacity may also be defined as the coefficient of performance (COP) obtained by dividing Qer by the power consumed by the compressor 11.
In a conventional cycle, therefore, the phenomenon illustrated in FIG. 8 takes place. That is, when the flow ratio η (η=Ge/Gnoz) is increased, the cooling capacity Qer of the entire cycle is increased as well. The flow ratio 11 is the ratio of the flow rate Ge of refrigerant drawn into the refrigerant suction port 15b of the ejector 15 to the flow rate Gnoz of refrigerant that passes through the nozzle portion 15a of the ejector 15.
When the heat load of the conventional is low, the difference between the high pressure and the low pressure of refrigerant in the cycle is reduced; therefore, the input to the ejector 15 is reduced. In this case, a problem arises in the conventional cycle. Since the refrigerant flow rate Ge depends only on the refrigerant sucking capability of the ejector 15, the following takes placed: reduction in the input to the ejector 15→reduction in the refrigerant sucking capability of the ejector 15→reduction in the flow rate of liquid phase refrigerant that flows into the second evaporator 20→reduction in flow ratio η. This results in reduction in cooling capacity Qer.
The US 2005/0178150 proposes an ejector cycle illustrated in FIG. 7. In this ejector cycle of FIG. 7, a branch passage 18 is provided between the discharge side of a radiator 12 and the refrigerant inflow port of an ejector 15. A throttling mechanism 42 that adjusts the pressure and flow rate of refrigerant and a second evaporator 20 are located in this branch passage 18. The outlet of the second evaporator 20 is connected to the refrigerant suction port 15b of the ejector 15.
The flow of refrigerant is separated upstream of the ejector 15, and the separated refrigerant is drawn into the refrigerant suction port 15b through the branch passage 18. Therefore, the branch passage 18 is in parallel relation with the ejector 15 with respect to connection. For this reason, when refrigerant is supplied to the branch passage 18, the refrigerant sucking and discharging capability of the compressor 11 can be utilized in addition to the refrigerant sucking capability of the ejector 15.
Therefore, even though the phenomenon of reduction in the input to the ejector 15 and reduction in the refrigerant sucking capability of the ejector 15 occurs, the degree of reduction in the flow rate Ge of refrigerant drawn into the refrigerant suction port 15b of the ejector 15 can be reduced more than in the conventional cycle.
In the ejector cycle proposed in the US 2005/0178150, the flow of refrigerant is separated upstream of the ejector 15. Therefore, the flow rate Gn of refrigerant that flows out of the radiator 12 is equal to the sum of the flow rate Gnoz of refrigerant that passes through the nozzle portion 15a of the ejector 15 and the flow rate of refrigerant that flows into the second evaporator 20. The flow rate of refrigerant that flows into the second evaporator 20 is equal to the flow rate Ge of refrigerant drawn into the refrigerant suction port 15b of the ejector 15.
Therefore, the relation expressed as Gn=Gnoz+Ge can be maintained. Thus, when Gnoz is reduced, Ge is increased; when Gnoz is conversely increased, Ge is reduced. Therefore, even when the cooling capacity of the first evaporator 16 is lowered, the cooling capacity of the second evaporator 20 is increased; even when the cooling capacity of the second evaporator 20 is conversely reduced, the cooling capacity of the first evaporator 16 is increased. Hence, the cooling capacity Qer of the comparison cycle illustrated in FIG. 8 is brought. That is, in the comparison cycle, a change in cooling capacity Qer for a change in flow ratio η is smaller than that in the conventional cycle, and the cooling capacity is peaked at the optimum flow ratio ηmax.
Furthermore, in an ejector cycle system where refrigerant is circulated in a refrigerant cycle using a suction force of an ejector, oil is easily stayed in an evaporator based on an operation state of the ejector. Generally, a predetermined oil circulating amount is necessary when the system is operated under a low load for a long time in order to protect a compressor.