An electrical connector includes an elongated housing having a daughter-card receiving on a first surface and mother-card receiving channel on a second surface thereof and extending along a lengthwise direction for receiving a daughter-card member and mother-card member. Respective daughter-card engagement slots and mother-card member slots are defined on opposed ends of housing, each slot extending from the first surface and second surface and along a transverse direction. The slots are laterally separated from the receiving channel for receiving lateral edge portions of the daughter-card member. A central line of each slot is aligned with a central line of the receiving channel in the lengthwise direction such that configuration of the slots will allow for the daughter card member and mother-card member to be held coplanar with respect to a middle plane of the channel, thereby establishing an effective electrical connection between the connector and the daughter-card member and the mother-card member.

1. Field of the Invention
The present invention relates to the art of electrical connectors, and more particularly to an electrical connector for electrically connecting together circuit boards, such as a mother-card member and a daughter-card member.
2. Description of the Related Art
Chinese Pat. No. 2845210 issued to Cai Zhou-Xuan on Dec. 6, 2006 discloses a related conventional electrical connector normally named as "a card-edge connector". The card edge connector includes an insulative elongated housing defining a card member receiving channel extending from a surface of the housing and along a lengthwise direction. A plurality of terminals is arranged in series and on the housing along opposed lengthwise edges of the card member receiving channel. The terminals include resilient arms defining opposed contact sections extending into the card member receiving channel for resiliently clipping a mating edge of the card member and for electrically contacting soldering pads disposed along the mating edge of the card member when the card member is inserted into the card member receiving channel of the housing. The housing may be provided with a latching device attached thereto, the latching device generally including a positioning slot at one side thereof for a lateral edge portion of the card member to be received therein so as to hold the card member in position with respect to the electrical connector. For most instances, this arrangement of the positioning slot may be such that when the card member is secured onto the electrical connector by inserting the lateral edge portion of the card member into the positioning slot, the mating edge of the card member, from a top view thereof, may be displaced with respect to a central line of the card member receiving channel of the housing along the lengthwise direction of the housing. Thus, there may be some of soldering pads on the mating edge of the card member that are not in direct contact with the terminals of the housing, thereby resulting in electrical connection failure at locations of those soldering pads.
U.S. Pat. No. 5,478,247 issued to Chou Lin Chen on Dec. 26, 1995 discloses another related card-edge connector. This card-edge connector also includes a card member receiving channel extending from a surface thereof and along a lengthwise direction for engaging a main edge of a card member. This configuration may also enable the card member to be displaced with respect to a middle plane of the card member receiving channel of the connector, thereby having a same problem described above.
Therefore, there is a need to provide an electrical connector to resolve the above-mentioned problem.


A decentralized computer network architecture and method that gathers metadata from local and remote clients and, based on that metadata, locally makes a decision whether to send a packet over the network. Each client listens to what other clients are doing, and only sends when the total number of concurrent speakers is below some threshold. In a multi-party voice conferencing embodiment, the threshold is a number of concurrent speakers that is restricted to less than a certain number. Under the decentralized computer network architecture, the type of network topology used to connect the clients is flexible, as long as each client is running a peer-aware system to decide locally whether to send their packets. The decentralized computer network architecture and method is distributed to run on each client, making it suitable for a wide variety of network topologies (such as full-mesh, bridge-based, or a hybrid of the two).

Voice over Internet Protocol (VoIP) enables use of the Internet as a transmission medium for telephone calls instead of using the traditional Public Switched Telephone Network (PSTN). VoIP sends voice data in packets using the Internet Protocol (IP). Voice data for each call participant is contained in a voice stream. VoIP is quickly gaining popularity due to the proliferation of broadband connections to homes and the availability of low-cost hardware and software. Despite the rise in popularity, in order to compete with PSTN, VoIP must provide the functionality offered by PSTN, such as multi-party voice conferencing.
Multi-party voice conferencing is a conference between multiple participants in which voice data is transmitted to each participant. The participants often are located at different sites. For a PSTN voice conference, each participant's telephone is connected to a central bridge, which mixes and sums all of the voice signals and transmits the voice sum back to the participants. When migrating to VoIP, it is natural to try and emulate this topology in the digital domain. However, various problems arise with this client-bridge topology. Using the client-bridge topology in a VoIP voice conference, the voice data of each participant is transmitted over a wide-area network (such as the Internet), and each participant is connected to the network using a client. The Internet, however, introduces variable delays and packet losses into the network transmission process. Another problem is that the client-bridge topology places a high demand on the bridge. In particular, the bridge must decode the clients' voice packets, sum them, compress, and send summed and compressed voice packets back to each client. Because each client requires his own voice to be subtracted from the sum, the packet compression usually has to be done separately for each individual client. Because of these problems, the load on the bridge increases linearly to the number of clients that are connected to the bridge. This type of topology puts the scaling burden onto the central bridge, but the requirement for CPU processing power and bandwidth on each client is low.
A simple way to avoid the above-mentioned problems with the client-bridge topology is to connect each of the clients together. This is known as the full-mesh topology. However, one of the main problems with the full-mesh topology is that it does not scale well. In fact, the number of connections goes up as O(N2). Thus, although the full-mesh topology works well for a small number of participants, scaling to a larger number of participants is not good.
In order to be able to scale well and avoid the degradation of the client-bridge topology, another type of topology recently introduced is the tandem-free operation (TFO). Tandem refers to the double encoding that is performed on the packets. TFO operates by sending a packet to the bridge, and, instead of decoding, adding, and sending the packets back to the listener, the packets are merely forwarded by the bridge. Thus, the bridge becomes a simple forwarding device.
One problem, however, with the TFO topology is that the bridge is forced to reserve a significant amount of resources to deal with the worst case scenario of being flooded by incoming packets. This occurs because many external factors, such as microphone quality, the microphone's position relative to the user's mouth, the gain of the sound card, the level and type of background noise or simply many people start to talk at the same time, are out of the control of the bridge. This need to hold so much bandwidth in reserve to deal with the fluctuation in the number of incoming packets tends to negate at least some of the cost savings and other advantages of adopting the TFO topology.

Decentralized architecture and protocol for voice conferencing


An actuator includes a screw mechanism (13) having a threaded nut (16) rotatable by an electric motor (11) about a longitudinal axis (x) and a screw (17) translatable along the axis between an axially extended position and an axially retracted position. The screw (17) is connectable to a wire (W) of a Bowden cable (C) having an outer sheath (S). The actuator has a casing (20) with a first, fixed transversal surface (18). A cup (50) is mounted axially slidably on the casing (20) and has a second transversal surface (51) adapted for resting against an end of the sheath (S). A spring (53) is compressed between the first, fixed transversal surface (18) and the sliding cup (50). The cup (50) is capable of reaching an axially extended position, corresponding to a released brake condition, and an axially retracted position towards the first fixed transversal surface (18), against the bias of the spring (53), corresponding to a brake actuated condition.

There are known braking devices associated with electromechanical linear actuators comprised of an electric motor and a drive assembly which converts rotary motion imparted to the rotor of the electric motor into a linear movement of an out-put member which applies a braking force to the parking brakes of the vehicle through a Bowden cable. See, for example, WO-A-98/56633 and WO-A-2005/061293. The actuators are associated with sensors that supply signals indicative of the amount of braking force being applied.

Electromechanical linear actuator for a parking brake


An augmentation amplifier is provided for aspirating gas flow from a surrounding medium. The amplifier connects at an inlet to a pressurized gas source and at an outlet to a gas receiver. Ambient gas from the medium supplements source provided compressed gas. The amplifier includes a Venturi conduit including a throat, an external cavity and a diffusion chamber. The conduit receives and flows pressurized gas from the inlet to the throat. The cavity receives ambient gas from the medium. The chamber expands and accelerates the pressurized gas from the throat to entrain the ambient gas via aspiration. The accelerated and ambient gases combine into an exhaust gas to the outlet.

The invention relates generally to air amplification aspirators. In particular, the invention relates to devices to augment compressed air from high pressure containers to include ambient air from the atmosphere for inflation.
Inflatable boats, such as the Zodiac FC470™ are used by military personnel for various littoral missions. As stowed, the FC-470 has folded dimensions (in feet/inches) of 2′ 6″×4′ 11″ with an empty weight of 322 lbm (10.0 slugs). Fully inflated, the FC-470 has deployed length and width of 15′ 5″ and 10′ 10″, respectively. Compressed air from a pressurized tank is used to inflate such a boat. For example, self-contained underwater breathing apparatus (SCUBA) tanks can be employed for this purpose.


A network includes a TCP-in-TCP tunnel between a mobile device, which includes a TCP client and a gateway, and a TCP server, which resides in a subnet. Another gateway in the subnet receives and caches TCP packets and acknowledgments (ACKs) from the TCP-in-TCP tunnel. In response to receiving an indication from the TCP server that it has not received a cached TCP packet, the second gateway may resend the packet without relaying the indication to the TCP client, and the first gateway may send a control message instead of a complete TCP packet to the second gateway.

Transmission Control Protocol (TCP) enables two nodes to establish a reliable connection and exchange streams of information over a network. Each stream of information may be split into TCP segments ("segments") at a transport layer that are each sent across the network as separate Internet Protocol (IP) packets ("packets" or "datagrams") at a network layer. When sent from a source to a destination, a TCP segment includes a sequence number and an acknowledgment number. The sequence number indicates a byte number for the first byte of information in the segment. The acknowledgment number indicates a byte number for the first byte of the next segment that the destination expects to receive from the source. The destination can use the sequence number associated with each segment to assemble the segments in the proper order.
When the destination receives a segment, it sends an acknowledgment to the source indicating the byte of the last segment that it has received and contiguously assembled in the stream. This acknowledgment indicates to the source that the destination has received all bytes up to and including the acknowledgment number minus one. The destination may also (or instead) send an acknowledgment of a non-contiguous segment through a mechanism such as Selective Acknowledgment (SACK).
If the source does not receive an acknowledgment for a sent segment within a certain amount of time or receives multiple duplicate acknowledgments, the source may assume that the segment has been lost in transmission to the destination and resend the segment. This certain amount of time can change dynamically, increasing (via an exponential backoff algorithm) with each lost segment to effectively allow more time for a subsequently sent segment to reach the destination and for the destination to acknowledge receipt of the subsequently sent segment.
TCP tunnels may be used when a packet traverses through at least one gateway device between a packet's original source and its ultimate destination. A TCP tunnel, which is essentially another TCP transmission layer, may provide security for and improve reliability of TCP packets tunneling through it. However, for TCP packets that are lost in sections not covered by the TCP tunnel, an end-to-end retransmission of packets may still be needed.

System and method for reducing retransmissions due to tunneled TCP-in-TCP communication in a network


An output circuit (15) includes an output transistor (16) driving a load (18) a phase 1 turn-off circuit (32), and a phase 2 turn-off circuit (34). A status circuit (28) is connected to both the phase 1 turn-off circuit (32) and the phase 2 turn-off circuit (34). Phase 1 turn-off circuit (32) and phase 2 turn-off circuit (34) provide a two phase turn-off when status circuit (28) identifies that output transistor (16) should be turned off which allows output transistor (16) to dissipate the energy stored in any inductance without output transistor (16) entering breakdown, therefore improving the circuit's (15) reliability and reducing both the energy and the increase of current in the output transistor (16).

Many applications of power integrated circuits require high side driver configurations such as the one illustrated in prior art circuit 10 of FIG. 1. A power MOSFET 16 has a source coupled to load 18 and a drain coupled to Vcc through inductance 12 and resistance 14 due to cabling. Output power transistors such as transistor 16 in FIG. 1 are often used in automotive applications where a power supply, Vcc, may be connected with an appreciable amount of cabling causing a cable inductance 12 and cable resistance 14. Cable inductance 12 often causes problems when, due to a short circuit across load 18, transistor 16 must be turned off quickly. A fast turn-off of power transistor 16 gives rise to a large inductive flyback since current cannot change instantaneously through an inductor which is well understood by those skilled in the art.
FIG. 1 illustrates a common prior art solution to this problem. A short circuit detect 28 monitors load 18. In the event that load 18 becomes short circuited, as, for example, an automechanic in repairing a vehicle may short load 18 with a screwdriver, short circuit detect 28 manipulates a switch 20 to discharge the voltage on the gate of transistor 16 thus turning transistor 16 off. This "fast turn-off" triggers an inductive flyback at the drain terminal of power MOSFET 16, therefore the drain terminal voltage will decrease to a large negative value very quickly when power MOSFET 16 turns off. When the inductive flyback voltage reaches the breakdown voltage of power MOSFET 16, MOSFET 16 begins to conduct in the reverse biased avalanche mode and will dissipate all the energy that was stored in inductance 12 during the conduction cycle.
The circuit of FIG. 1 has a serious drawback; namely a reliability issue. When power MOSFET 16 turns off and experiences inductive flyback, it breaks down. When breakdown occurs the transistor junction breaks down nonuniformly causing "hot spots" to appear at junctions in MOSFET 16 where current has concentrated in localized areas. High current concentrations in localized areas lead to transistor damage and reliability problems.
As power integrated circuits switch larger currents and dissipate larger amounts of energy, better methods must be developed to provide switching reliability at a competitive cost.
It, accordingly, is an object of this invention to provide a circuit and method of dissipating the stored energy in inductances during switching that will protect the output device, conserve die area, and provide circuit reliability. Other objects and advantages of the invention will be apparent to those of ordinary skill in the art having reference to the following specification and drawings.

Controlled power MOSFET switch-off circuit


A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

It is common in the semiconductor industry to make an electrically conductive bump on a substrate, and in particular to make a solder bump on a semiconductor device. Solder bumps are often formed on an integrated circuit chip to make a flip chip. A flip chip microelectronic assembly includes a direct electrical connection of face down (that is, "flipped") electronic components onto substrates, such as ceramic substrates, circuit boards, or carriers using conductive bump bond pads of the chip. Flip chip technology is quickly replacing older wire bonding technology that uses face up chips with a wire connected to each pad on the chip.
The flip chip components used in flip chip microelectronic assemblies are predominantly semiconductor devices, however, components such as passive filters, detector arrays, and MEM devices are also being used in flip chip form. Flip chips are also known as "direct chip attach" because the chip is directly attached to the substrate, board, or carrier by the conductive bumps.
The use a flip chip packaging has dramatically grown as a result of the flip chip's advantages in size, performance, flexibility, reliability, and cost over other packaging methods and from the widening availability of flip chip materials, equipment and services. In some cases, the elimination of old technology packages and bond wires may reduce the substrate or board area needed to secure the device by up to 25 percent, and may require far less height. Further, the weight of the flip chip can be less than 5 percent of the old technology package devices.
Flip chips are advantageous because of their high-speed electrical performance when compared to other assembly methods. Eliminating bond wires reduces the delay in inductance and capacitance of the connection, and substantially shortens the current path resulting in a high speed off-chip interconnection.
Flip chips also provide the greatest input/output connection flexibility. Wire bond connections are generally limited to the perimeter of the chip or die, driving the die sizes up as a number of connections have increased over the years. Flip chip connections can use the whole area of the die, accommodating many more connections on a smaller die. Further, flip chips can be stacked in 3-D geometries over other flip chips or other components.
Flip chips also provided the most rugged mechanical interconnection. Flip chips when underfilled with an adhesive such as an epoxy, can withstand the most rugged durability testing. In addition to providing the most rugged mechanical interconnection, flip chips can be the lowest cost interconnection for high-volume automated production.
The bumps of the flip chip assembly serve several functions. The bumps provided an electrical conductive path from the chip (or die) to the substrate on which the chip is mounted. A thermally conductive path is also provided by the bumps to carry heat from the chip to the substrate. The bumps also provided part of the mechanical mounting of the chip to the substrate. A spacer is provided by the bumps that prevents electrical contact between the chip and the substrate connectors. Finally, the bumps act as a short lead to relieve mechanical strain between the chip and the substrate.
Flip chips are typically made by a process including placing solder bumps on a silicon wafer. The solder bump flip chip processing typically includes four sequential steps: 1) preparing the wafer for solder bumping; 2) forming or placing the solder bumps on the wafer; 3) attaching the solder bumped die to a board, substrate or carrier; and 4) completing the assembly with an adhesive underfill.
The first step in a typical solder bumping process involves preparing the semiconductor wafer bumping sites on bond pads of the individual integrated circuits defined in the semiconductor wafer. The preparation may include cleaning, removing insulating oxides, and preparing a pad metallurgy that will protect the integrated circuits while making good mechanical and electrical contact with the solder bump. Accordingly, protective metallurgy layers may be provided over the bond pad. Ball limiting metallurgy (BLM) or under bump metallurgy (UBM) generally consists of successive layers of metal. The "adhesion" layer must adhere well to both the bond pad metal and the surrounding passivation, provide a strong, low-stress mechanical and electrical connection. The "diffusion barrier" layer prevents the diffusion of solder into the underlying material. The "solder wettable" layer provides a wettable surface for the molten solder during the solder bumping process, for good bonding of the solder to the underlying metal.
A variety of UBM structures are known to those skilled in the art that accomplish the above functions and have one, two, three or more layers depending on whether the bump is gold, copper, aluminum, solder or nickel based. For gold based bumps, known UBM structure include layers of Cr—Cu, Ti—Pd, Ti—W, or Ti—Pt. For copper based bumps, known UBM structures include layers of Cr—Cu, or Al—Ni. For aluminum based bumps, known UBM structure include layers of Ti or Cr. For solder based bumps, known UBM structures include layers of Cr—Cu—Au, Ni—Cu, Ti—Cu, TiW—Cu, Ni—Au, or Al—NiV—Cu. For nickel based bumps, known UBM structure include layers of nickel. The UBM layers may be deposited by electroplating, evaporation, printing, electroless plating, and/or sputtering. It is also known to deposit one or more seed layers over the UBM structure prior to depositing the electrically conductive material (such as solder) that forms the bump.
In fabricating a flip-chip bond structure, the fabrication process requires a tight control of interface processes and manufacturing parameters in order to meet very small dimensional tolerances. Various techniques may be utilized to fabricate a UBM structure and to deposit the solder bump. A few widely used methods of depositing bumps include evaporation, electroplating, electroless plating and screen-printing. Kung et al, U.S. Pat. No. 6,179,200 provides a description of these more widely used methods of depositing bumps as follows.
The formation of solder bumps can be carried out by an evaporation method of Pb and Sn through a mask for producing the desired solder bumps. When a metal mask is used, UBM metals and solder materials can be evaporated through designated openings in the metal mask and be deposited as an array of pads onto the chip surface.
In one prior art evaporation method, a wafer is first passivated with an insulating layer such as SiO2, via holes are then etched through the wafer passivation layer to provide a communication path between the chip and the outside circuit. After a molybdenum mask is aligned on the wafer, a direct current sputtering cleans the via openings formed in the passivation layer and removes undesirable oxides. A cleaned via opening assures low contact resistance and good adhesion to the SiO2. A chromium layer is evaporated through a metal mask to form an array of round metal pads each covering an individual via to provide adhesion to the passivation layer and to form a solder reaction barrier to the aluminum pad underneath. A second layer of chromium/copper is then co-evaporated to provide resistance to multiple reflows. This is followed by a final UBM layer of pure copper which forms the solderable metallurgy. A thin layer of gold may optionally be evaporated to provide an oxidation protection layer. These metal-layered pads define the solder wettable regions on the chips, which are commonly referred to as the ball limiting metallurgy (BLM) or under bump metallurgy (UBM). After the completion of UBM, solder evaporation occurs through a metal mask, which has a hole diameter slightly greater than the UBM mask-hole diameter. This provides the necessary volume for forming a subsequent solder ball. A solder reflow process is performed at a temperature of about 350° C. to melt and homogenize the evaporated metal pad and to impart a truncated spherical shape to the solder bump. The evaporation method, even though well established and has been practiced for a long time in the industry, is a slow process and thus can not be run at a high throughput rate.
A second method for forming solder bumps is the electroplating method. In an electroplating process, UBM layers are first deposited, followed by the deposition of a photoresist layer, the patterning of the photoresist layer, and then the electro-deposition of a solder material into the photoresist openings. After the electro-deposition process is completed, the photoresist layer can be removed and the UBM layers can be etched by using the plated solder bumps as a mask. The solder bumps are then reflowed in a furnace reflow process. The photolithography/electroplating technique is a simpler technique than evaporation and is less expensive because only a single masking operation is required. However, electroplating requires the deposition of a thick and uniform solder over the entire wafer area and etching metal layers on the wafer without damaging the plated solder layer. The technique of electroless plating may also be used to form the UBM structure.
Another solder bump formation technique that is capable of solder-bumping a variety of substrates is a solder paste screening method. The screen printing technique can be used to cover the entire area of an 8-inch wafer. In this method, a wafer surface covered by a passivation layer with bond pads exposed is first provided. UBM layers are then deposited on top of the bond pads and the passivation layer. A photoresist layer is deposited over the UBM. The portions of the UBM are etched followed by stripping off the photoresist layer. A stencil is then aligned on the wafer and solder paste is squeegeed through the stencil to fill the openings on top of the bond pads and the UBM layers. After the stencil is removed, the solder bumps may be reflowed in a furnace to form solder balls.
One drawback of the solder paste screen printing process is that, with the recent trend in the miniaturization of device dimensions and the reduction in bump to bump spacing (or pitch), the prior art solder paste screening techniques become impractical. For instance, one of the problems in applying solder paste screening technique to modern IC devices is the paste composition itself. A paste in generally composed of a flux and solder alloy particles. The consistency and uniformity of the solder paste composition becomes more difficult to control with a decreasing solder bump volume. A possible solution for this problem is the utilization of solder paste that contains extremely small and uniform solder particles. However, this can only be achieved at a very high cost penalty. Another problem is using the solder paste screening technique in modern high-density devices is the reduced pitch between bumps. Since there is a large reduction in volume from a paste to the resulting solder bump, the screen holes must be significantly larger in diameter than the final bumps. It is therefore generally desirable to form solder bumps that are reflown into solder balls with a larger height and a larger pitch between the balls.
Several other methods are known to those skilled in the art for producing solder bumps on a semiconductor device. One such method is called the solder jet printing method. The solder jet printer method is based upon piezoelectric demand mode ink jet printing technology and is capable of producing and placing molten solder droplets 25–125 micrometers in diameter at rates of up to 2000 per second. In demand mode ink jet printing systems, a volumetric change in the fluid is induced either by the displacement of piezoelectric material that is coupled to the fluid or by the formation of the vapor bubble in the ink caused by heating a resistive element. The volumetric change causes pressure transience to occur in the fluid, and these are directed so as to produce a drop that issues from an orifice. A droplet is created only when it is desired in demand mode systems. Demand mode ink jet printing produces droplets that are approximately equal to the orifice diameter of the droplet generator.
Another method for producing solder bumps is known as the micro-punching method. In the micro-punching method, solder tape is supplied from a spool and rolled up by a motor driven spool. A micro-punch is driven by an electric actuator and a displacement enlarging mechanism. A micro-punch and die set blanks a thin solder tape and forms a small cylindrical piece. A solder flux may be formed over the entire semiconductor wafer to be bumped and the solder pieces may be punched and placed directly onto the wafer.
One of the most cost-effective packaging techniques is known as direct chip attach wherein a solder bumped flip chip is directly attached to a printed circuit board. However, due to the thermal expansion mismatch between the silicon chip and the printed circuit board (made from an epoxy or fiberglass material), an underfill encapsulant is usually needed for solder joint reliability. Due to the underfill operation, the manufacturing costs is increased in the manufacturing throughput is often substantially reduced. Further, reworking an underfill flip chip on a printed circuit board is practically impossible.
Although electrically conductive bumps, such as solder bumps, are more frequently used with flip chips, electrically conductive bumps are often applied to other semiconductor devices, printed circuit boards, and ceramic substrates. Typically the forming of solder bumps is accomplished using a flux, which in the semiconductor industry usually is an organic oxide. FIGS. 1A–F illustrate the steps of a typical prior art process of forming a solder bump on a substrate. In FIG. 1A a semiconductor device 10 is provided including a silicon based substrate 12 with a plurality of alternating metallization and dielectric layers. A bond pad 14 is provided over the silicon based substrate 12. A passivation layer 16 is provided over the silicon based substrate 12 and includes an opening down to the bond pad 14. An under bump metallurgy 18 is provided over the passivation layer 16 and into the opening formed a passivation layer 16 and is connected to the bond pad 14. In FIG. 1B a sacrificial layer 20 is provided which typically is a photoresist layer that has been deposited, patterned and developed to provide an opening 22 therein overlying the bond pad 14. In FIG. 1C, solder 24 may be deposited into the opening 22 formed in the sacrificial layer 20 and onto the under bump metallurgy 18. The solder 24 may be deposited by any of a variety of methods including electroplating or screen printing. As shown in FIG. 1D the sacrificial layer 20 is then removed to provide a solder structure 26 on top of the under bump metallurgy 18. It is typical for the solder structure 26 to form an oxide layer 32, more particularly thin oxide (SnOx) upon exposure to the air for even short periods of time. Excess under bump metallurgy 18 is removed typically by etching using the solder structure 26 as a mask, and then as shown in FIG. 1E, a solder flux 28 is deposited over the solder structure 26. The flux is particularly needed if the solder is electroplated onto the substrate because an electroplated solder structure would not have flux included in the composition of the solder. The purpose of the solder flux is to reduce the oxide on the surface to be heated or material (solder) to be reflown. The reduction of the oxides allows the solder to flow at a lower temperature. As shown in FIG. 1F, the solder structure 26 with the flux 28 is heated to reflow the solder structure 26 and then cooled to form a solder bump 30 on the silicon based substrate 12.
However, the use of a flux agent requires additional applications steps, additional process equipment tools and often follow-up cleanup steps to remove flux residue. Flux residue also has associated with it a high risk of reliability due to corrosion caused by the flux residue. The present invention provides alternatives to and advantages over the prior art.

Taiwan Semiconductor Manufacturing Co., Ltd.


Methods and systems are provided for adaptive recruitment computer system. In one novel aspect, the adaptive recruitment computer system generates a question bank based on a job description, selects adaptively questions from the question bank for an interview, and generates a feedback report for the candidate based on the evaluation of the candidate's answer. In one embodiment, the computer system categorizes a job requirement based on a body of knowledge (BOK) skill knowledge base, generates a question bank, selects adaptively a subset of questions from the generated question bank, wherein each question selected is based on evaluations of candidate's answers to corresponding prior questions using a recurrent neural network (RNN) model, and generates a feedback report for the candidate, wherein the feedback report using the RNN model based on evaluations of answers and a BOK candidate knowledge base, wherein the BOK candidate knowledge base receives updates from the computer system.

With the development in machine-learning based artificial intelligence (AI), the applications of the AI technology have grown exponentially. At the same time, the efficiency of talent recruitment is becoming more important than ever. Traditionally, recruiters from the human resource (HR) and/or recruitment firms selected candidates from a limited talent pool. The screening process for a job opening takes a large amount of human effort. AI's powerful ability to rapidly process millions of data points enables the recruiters to quickly identify high-potential candidates. Further, the explosive growth of the online community, which has extended beyond casual networking among friends and families, has increasingly gained applications for business and professional uses. Many organizations and business units have their social media presence. Social media has been increasingly viewed as a professional platform to help businesses and job seekers connected. The vastly increased talent pool online enables AI programs to get the latest candidate profiles. The traditional human interactive recruiting process has been laden with bias. AI-enabled auto screening process reduces potential human bias in the recruitment process. On the other hand, however, the current automatic recruiting services lack the human interaction, which provides real-time dynamic interview questions based on not only the answers but also the deep knowledge of the requirement as well as experiences with human interactions. Further, traditionally, the feedback to the candidate are not informative and helpful to the candidate. It normally only has a decision with very little information.
Improvements and enhancement are needed for an AI-enabled recruitment system with an adaptive interview process and a detailed feedback.

Adaptive recruitment system using artificial intelligence


A distance measuring apparatus having a frame and a wheel rotatable relative to the frame around a first axis. The wheel has a peripheral surface that can be rolled against a surface upon which a distance measurement is to be taken. The distance measuring apparatus further has a counter assembly through which advancement of the distance measuring device can be converted to a distance measurement. The scraper assembly has a scraping edge that is one of (a) adjacent to the wheel, and (b) against the wheel. The scraping edge intercepts foreign matter adhered to the wheel as the wheel is rotated around the first axis to avoid buildup of foreign matter upon the wheel as the distance measuring apparatus is operated.

1. Field of the Invention
This invention relates to distance measuring apparatus of the type having a rotatable wheel and, more particularly, to a distance measuring apparatus having a scraper assembly with a scraping edge for intercepting foreign matter adhered to the wheel as the wheel is rotated.
2. Background Art
Distance measuring apparatus utilizing rotatable wheels are well known in the art. In a typical construction, a frame supports a wheel for rotation around an axis. The frame has an associated handle which can be grasped to manipulate the frame and thereby roll the wheel against a surface upon which a distance measurement is to be taken. A counter is activated as the wheel is rotated and converts rotation to a distance measurement, which is digitally or mechanically displayed. This conversion is based upon the diameter for the wheel. That is, each wheel rotation is correlated to a distance traversed by the wheel which is equal to the wheel circumference.
Wheeled distance measuring apparatus are used in a wide range of environments. These apparatus are commonly used by the construction industry on sites at which terrain and conditions may be quite harsh. It is common for those utilizing wheeled distance measuring apparatus to encounter muddy conditions that may be aggravated when there is precipitation.
As a result of using wheeled distance measuring apparatus in the above-described environments, there is a tendency of foreign matter, such as chunks of earth, or the like, to adhere to the wheel. The adhered foreign matter has a number of undesirable effects. First, foreign matter at discrete locations on the wheel periphery may preclude smooth rolling of the wheel over the underlying terrain. A significant buildup may ultimately produce interference between the wheel and other parts of the apparatus, thereby impairing operation. To eliminate this latter problem, the user may be required to manually scrape the foreign matter off of the wheel. To accomplish this, the user may have to interrupt the measuring process and use a separate utensil to scrape the wheel periphery. Aside from the obvious inconvenience, this process may result in a compromise of the accuracy of the measurements by reason of not resuming the measuring process at the precise point at which it was interrupted.
Most significantly, the accumulation of foreign matter upon the wheel increases the effective circumference of the outer surface which rolls against the underlying surface upon which a measurement is taken. Foreign matter may progressively accumulate on the wheel and go virtually undetected by the user. Eventually, the foreign matter may accumulate to the point that an appreciable change in the effective diameter of the wheel results. Over long distances, a deviation from true measurement may result that is significant.
The industry continues to seek out new designs for distance measuring apparatus which are capable of taking accurate distance measurements even on rough and potentially wet and muddy terrain.


A method for processing color-image pixel-data for outputting by a multi-bit (N) color-image output device including the steps of (a) characterizing color-image pixels into N successive, associated scan lines of pixels, which lines are bridged, effectively for processing purposes, by successive N×N pixel groups distributed along the associated scan lines, and (b) for each such pixel group, applying processing to the pixels in the group, including vector error diffusion processing, in a pixel-by-pixel and scan-line-by-scan-line manner employing, cyclically, N different color palettes, one each for the different scan lines—one of which palettes is bi-tonal, and other(s) of which is (are) of a higher bit level up to the level N.

This invention relates to color-image data preprocessing for color-image printing, and more specifically, to methodology relating to patterning and dot-gain improvements associated with vector error diffusion processing of color-image data which is to be printed by an electro-photographic (EP) engine. As will be seen, preferred practice of the present invention is performed in the context of a multi-color-level EP engine, referred to generally as multi-bit (N) color output device. Such a device is specifically illustrated herein in the form of a 2-bit EP engine.
In the processing of color-image data, error diffusion practice often gives rise to what is known as high-frequency blue noise, like halftone patterning. This behavior usually contributes to undesirable graininess and other patterning problems, such as so-called "melting", or "tailing". Additionally, when a processed result is printed by an EP engine, there is often relatively severe dot-gain which can produce a very undesirable image.
In prior art attempts to deal with these problems, often employed is a thresholding approach which is used to control pixel placement and to avoid undesirable pixel clustering. However, this approach can lead to further undesirable qualities in an image, such as color shifting and other types of unwanted patterning. All of these issues tend to become magnified in a setting where vector error diffusion is performed.
The present invention addresses these issues in a relatively simple, yet significantly effective manner. More specifically, the unique approach to color-image-data pre-processing for printing which is taken by the present invention soidly addresses these issues by using at least two different color palettes to handle color pixel processing. If desired, and as will become apparent to those skilled in the art, more than two different color palettes could be used if desired.
According to a preferred manner of practicing the invention, such practice specifically employs, as illustrated herein, two quite different-character color palettes. One of these palettes is a bi-tonal palette, or look-up table (LUT), and the other is a multi-level (multi-bit), 2-bit palette, or LUT. For illustration purposes, input image-data color space is chosen to be sRGB, and the LUT-converted-to color space is basic CMYK color space for the bi-tonal LUT, and (as will be explained further in detail below) 2-bit C, CI, CII, M, MI, MII, etc. multi-color-level color space for the 2-bit LUT.
Still referring to preferred practice of the invention, a 2×2 4-bit cluster (a half-tone cell) of pixels is chosen to define what are referred to herein, in two different "scan lines", as high-priority and low-priority pixels-two each in each cluster. Scan line number One which, as will be seen, is the upper one of the two scan lines contains the two, designated, high-priority pixels. Scan line number Two, the lower scan line, contains the two, designated, low-priority pixels.
In the practice of this invention, and in relation to the performance of pre-printing vector error diffusion, the high-priority pixels are processed using the multi-level LUT, and low-priority pixels are processed using the bi-tonal LUT.
This use of such differentiated LUTs is a key contribution of the present invention. Implementation of the invention, as suggested earlier, significantly addresses the undesirable EP printing issues which have been mentioned above, and definitively offers improvements relating to image pixel patterning and dot-gain in finally printed color images.
Various other features and advantages which are offered by the invention will become more fully apparent as the detailed description which follow is read in conjunction with the accompanying drawings.

Patterning and dot gain improvement for vector error diffusion


A method for detecting specific associations between a tethered molecule and an untethered target molecule. The method comprises (1) selecting a tethered molecule; (2) alternately impinging THz radiation onto the tethered molecule and onto a sample including the tethered and untethered target molecules; (3) detecting the radiation impinged on the tethered molecule to form a reference signal and the radiation impinged on the sample to form a sample signal; and (4) comparing the reference signal with the sample signal to generate a specimen signal indicative of an association between the selected tethered and target molecules. The method will detect whether a selected tethered molecule and the desired target exhibit any affinity or, in cases where the affinity is known, will detect the presence of the target molecule in a sample. Also provided is an apparatus for detecting specific associations between a tethered molecule and an untethered target molecule.

The accurate detection of minute amounts of chemical and biological substances has been a major goal in bioanalytical technology throughout the twentieth century. Over the years, a wide variety of biosensing strategies have been developed to satisfy numerous needs. The general aim is to develop a scheme that is able to simplify sample preparation steps, provide high selectivity and sensitivity, respond in a continuous and reversible manner, and accomplish measurements without sample perturbation. Added to these conditions are other goals of convenience such as reusability, portability, low costs for mass production, miniaturization, and ease of use. These features are the most demanding parameters for biosensor designs.
The use of fluorescent indicators in bioassays has met with a certain level of success. Many biological molecules show an inherent fluorescence (associated with the amino acid derivatives of tryptophan or tyrosine, nucleic acids, or other metabolites such as porphyrins). Exploiting this inherent property for bioassay is not a simple procedure, however, because the emitted fluorescence signal is generally weak and often difficult to distinguish above a background signal. To overcome these limitations, an additional step of adding fluorescent labels has been used to mark the desired specimen for easier detection. Such addition disturbs the sample, however, and requires extra steps in sample preparation. Other limitations of fluorescence indicators include fluorescence quenching by other solutes and the insensitivity of fluorescence to certain binding events. In current solid-phase immunoassay procedures, wash steps are labor intensive and time consuming when performed manually and would require complicated and, therefore, expensive robotics in an automated format.
Recently, THz-TDS (Terahertz time domain spectroscopy) has emerged as a successful method to probe the electrical properties of thin solid films in the spectral interval from 0.1 to 10 THz, between the infrared and microwave bands. This technique provides a new alternative to measure the refractive index of thin solid films without sample perturbation. The heart of the THz system is a mode-locked Ti:sapphire femtosecond (fs) laser, which generates fs duration pulses at a MHz repetition rate and low average power. A beam splitter separates the laser beam into excitation and reference pulses. The excitation pulse illuminates an unbiased GaAs semiconductor emitter wafer to generate a THz beam, which is collimated and focused onto an electro-optic sampling crystal, <110> oriented ZnTe, with parabolic mirrors. A pellicle after the second parabolic mirror allows the reference beam to travel collinearly with the THz wave across the electro-optic crystal. A quarter wave plate (QWP), a Wollaston prism (P), and a pair of photodiodes are assembled for the balanced detection of the THz beam.
Unfortunately, compared to the existing biosensors in the marketplace, current THz-based systems suffer from poor signal-to-noise ratios and sensitivity. The most useful techniques for monitoring on-off binding in the far-infrared are attenuated total internal reflection Fourier transform infrared (ATR-FTIR) spectroscopy and Raman spectroscopy. Unfortunately, the complications associated with cryogenic detectors in FTIR and Raleigh lines in Raman are among the anomalies that hamper FTIR and Raman spectroscopy from being widely used. Also, in general, FTIR has a relative poor signal-to-noise ratio for frequencies less than 1 THz.
Therefore, a need remains for a new non-invasive biosensor technology having application, for example, in health care, food monitoring, and weapon detection.

Detection of biospecific interactions using amplified differential time domain spectroscopy signal


Embodiments of the invention include a conditional access system comprising a terminal and a smartcard, wherein the terminal comprises a user interface for interaction with an end-user, comprising an output for displaying first user interaction data and an input for generating second user interaction data in response to the first user interaction data; and a descrambler configured for descrambling scrambled content, and wherein the smartcard is configured for generating the first user interaction data and allowing, in dependence of the second user interaction data received from the user interface, the descrambler to descramble the scrambled content.

Conditional access systems are generally used to provide conditional access to services like premium content. The content is scrambled and a smartcard is used to conditionally allow a terminal to descramble the scrambled content. The smart-card allows descrambling of the content by transmitting control words (CW) needed for descrambling to the terminal.
The smartcard is generally a separate card which is to be inserted into the terminal before operation. Alternatively the smartcard can be a surface mounted device (SMD) integrated into the terminal.
The terminal is e.g. a set-top box, PVR or a mobile phone. A user interface comprising output means such as a display and possibly input means such as a key-board can be connected to the terminal. A television e.g. can be connected to the set-top box for displaying the descrambled content. Alternatively the user interface is integrated into the terminal. A mobile phone e.g. is equipped with a display and keypad or keyboard and can be used to display descrambled content on the display and receive user input through the keypad/keyboard.
The terminal has a receiver for receiving data comprising scrambled content, entitlement management messages (EMM) and encrypted entitlement control messages (ECM). The EMM is a data unit that provides general information about the subscriber and the status of the subscription. The ECM is a data unit that contains the CW needed for decrypting the scrambled content.
A filter in the terminal filters the EMM and ECM from the data and a conditional access client (CA client) in the terminal receives the EMM and ECM from the filter. The CA client processes the EMM and ECM and, depending on the content of the EMM and ECM, transmits a first status code to the smartcard.
The smartcard analyses the first status code and responds to the CA client with a second status code if descrambling of the content cannot be allowed based on the first status code. Alternatively the smartcard decrypts the ECM to obtain the CW and transmits the CW to the CA client if descrambling of the content is allowed based on the first status code.
In known conditional access systems, user interaction functionality is implemented in the CA client. If the EMM or second status code indicates that user interaction is required, e.g. because a PIN-code, confirmation, payment or content selection is required before allowing descrambling of the content, the CA client generates a message which is transmitted to the output means of the user interface. Through the input means of the user interface the end-user responds to the message and the response is processed by the CA client. Depending on the response a third status code is transmitted to the smartcard and the smartcard responds as described for the first status code and second status code.
In modern terminals parts of the CA client are implemented as firmware stored on a field re-programmable ROM or flash memory. The firmware is upgradable by downloading new firmware. The new firmware is e.g. downloaded from an external server using a web browser in the terminal, using over-the-air (OTA) provisioning techniques in case of mobile phones, or provided to the terminal through e.g. a Bluetooth interface.
In older terminals, for which the installed-base is much higher, CA client functionality is not upgradable as it is implemented in ROM.
Parts of the functionality of the smartcard can be implemented as firmware stored in a memory. This firmware can be upgraded by providing a new firmware to the CA client transmitted in EMMs, or using over-the-air (OTA) provisioning techniques in case of mobile phones, and starting an upgrade procedure in the CA client to provide the new firmware to the smartcard. Alternatively the smartcard can be replaced by a new smartcard.
A drawback of known conditional access systems is that conditional access functionality is split between CA client and smartcard. Consequently adding functionality to an existing conditional access system disadvantageously requires both the CA client and the smartcard to be upgraded. User interaction functionality in the CA client needs to be upgraded by the end-user or by the service provider in control of the terminal, while the smartcard needs to be upgraded by the smartcard provider. When using older terminals the CA client cannot be upgraded. Adding functionality to new conditional access systems disadvantageously requires close cooperation between the terminal vendor and the smartcard vendor to align CA client functionality and possibly user interface aspects with smartcard functionality.
Another drawback results from conditional access functionality being generally conditional access system specific. This requires terminal vendors to manufacture conditional access system specific terminals.

Conditional access system and smartcard for use in conditional access system


A temporary trap having baskets and optionally filters in the baskets used in conjunction with curb inlets for sewer systems to keep debris from being washed into the sewer during construction of roads and sewers. The trap is a box, typically rectangular, square or round, with baskets having a plurality of holes therein for allowing water to pass therethrough while trapping debris therein. The trap is inserted into a curb inlet by lifting the grate off the curb inlet frame, inserting the trap and then replacing the grating. After a rain the baskets and filters may be cleaned out and reused. Optionally, when the construction project is finished the grate is lifted off the curb inlet frame and the trap removed. An optional cloth filter for insertion into the trap filters finer debris from entering the sewer system. The trap has an overflow opening in case the trap becomes clogged.

1. Field of the Invention
This invention relates to traps and filters for insertion under a curb inlet grating for a sanitary, storm or catch basin.
2. Description of the Related Art
When streets are under construction the catch basins for the sewers can fill up with all kinds of debris during rains. Since the construction of the area is not complete there are many objects in the area that can be washed into the newly installed sewer and clog it up, whereas after construction the area is in finished condition, landscaped, fully paved, and construction related debris is removed therefore presenting fewer objects which can be washed into the catch basin and clog up the sewer.

Sanitary, storm and catch basin trap with filter insert


In an automatic-faucet system, the control circuit that operates the system's valve (18) causes an indicator lamp (32) to start blinking when it first opens the valve. It keeps the lamp blinking for a predetermined duration to indicate to the user that a time interval prescribed as necessary for effective hand washing has not yet expired. When the interval does expire, the user is thereby assured that he has complied with the relevant duration regulation.

The present invention is directed to automatic flow-control systems. It applies particularly to automatic faucets.
The human hand functions disproportionately as a disease carrier. But the hand's propensity to transmit disease can be largely suppressed simply by effective hand washing. This fact is well known to public-health authorities, who have accordingly expended considerable effort in promulgating regulations and information to encourage the public, and food workers in particular, to exercise proper hygiene in this regard. Prominent among such efforts is the posting of signs in food workers' rest rooms that urge workers to wash their hands.
Such personnel should not just wash their hands but also do it effectively. To a great extent the effectiveness depends on the washing operation's duration, so efforts have additionally been made to sensitize food workers in particular to the desirability of is observing a minimum hand-washing duration.
While these efforts have undoubtedly produced a higher public-health level, considerable room for improvement remains. Human behavior being a central factor, compliance can be spotty.


An electrical connector is provided, including a main body, first terminals installed at a seat of the main body, second terminals embedded in the seat, and a housing. The housing has a bottom wall, two side walls, and a top wall, and defines an accommodating space having a first opening and a second opening. A plurality of first spring plates are disposed on the top wall and bottom wall. A second spring plate is disposed near the second opening of the top wall. Third spring plates are disposed near the second opening of the bottom wall. When a connector plug is plugged into the electrically connector, the first, second and third spring plates make contact with an iron housing of the connector plug to increase the contact area between the connector plug and the electrical connector, and reduce electromagnetic interference to peripheral devices.

1. Field of the Invention
The present invention relates to electrical connectors, and, more particularly to an electrical connector for preventing electromagnetic interference caused by peripheral electronic devices.
2. Description of the Prior Art
With the advancement of technology, electric devices, such as smart phones, tablets, and laptops, now come with many different functions.
Since most people living nowadays require a large amount of mobility everywhere they go, it is important to minimize the size of electronic products so that the users can carry them around.
Regardless of a smart phone, tablet or a laptop, they have been widely used for most people. However, the main design purpose for smart phones or tablets still focuses on entertainment. Therefore, with portable electronic devices, laptops are still the main product to provide the full range of functionality.
In general, the laptops usually come with a plurality of USB connectors mounted adjacent to the printed circuit board for the user to connect other peripheral electronic products.
However, the USB connectors mounted adjacent to the printed circuit board, though providing convenience to the user, suffer from electromagnetic waves generated, and the performances of peripheral electronic devices are greatly affect.
Thus, there is an urgent need to solve the problem of the prior art.


A disk device tray includes a first support component, a second support component and a step component. The first support component has a first support face with a first disk supporting area that supports an outer edge portion of a lower face of a first disk. The second support component has a second support face with a second disk supporting area that supports an outer edge portion of a lower face of a second disk. The step component has an inner side portion protruding upward with respect to an outer side portion. The inner side portion has a top face that is located lower than the second support face and a first inner peripheral face that extends upward from the first support face to the top face and restricts movement of the first disk in a radial direction of the first disk.

1. Field of the Invention
The present invention generally relates to a disk device tray. More specifically, the present invention relates to a disk device tray for a disk device.
2. Background Information
As shown in FIGS. 7 and 8, a conventional disk device includes a tray 220 on which two kinds of disk of different diameter (e.g., a small-diameter disk D1 and a large-diameter disk D2) can be placed. The tray 220 has first and second annular support components 230 and 240 formed at two concentric locations of the tray 220. An outer peripheral part of the small-diameter disk D1 is placed on the first support component 230, and an outer peripheral part of the large-diameter disk D2 is placed on the second support component 240.
The first support component 230 has a support face 231 on which is placed the outer peripheral part of the lower face of the small-diameter disk D1, and a cylindrical upright face 232 that contacts with an outer peripheral end face of the small-diameter disk D1 and thereby prevents the misalignment of the small-diameter disk D1. Similarly, the second support component 240 has a support face 241 on which is placed the outer peripheral part of the lower face of the large-diameter disk D2, and a cylindrical upright face 242 that contacts with an outer peripheral end face of the large-diameter disk D2 and thereby prevents the misalignment of the large-diameter disk D2. The diameters of the cylindrical upright faces 232 and 242 of the first and second support components 230 and 240 are somewhat larger than the diameters of the corresponding disks, which makes it easier to place and remove the disks in the first and second support components 230 and 240. Also, an upper end position of the upright face 232 of the first support component 230 is located at a lower level than the support face 241 of the second support component 240. This keeps a recording region of the large-diameter disk D2 placed on the second support component 240 in a state of non-contact with a flat upper face 221 of the tray 220 and prevents it from being scratched or otherwise damaged.
With the disk device, the disk that has been placed on the tray 220 and loaded is clamped by a clamping mechanism and lifted up from the tray 220. Then, the disk rotates in this state, a recording face of the disk is optically processed through the action of an optical pickup or the like, and information is thereby recorded or reproduced. Also, the disk is moved to the tray 220 as soon as it is unclamped from the clamping mechanism.
Furthermore, with the disk device, the depth of the first support component 230, that is, the height H that the upright face 232 rises from the support face 231, is less than the thickness of the small-diameter disk D1. As a result, the tray 220 can be made thinner and, in turn, so can the disk device.
Meanwhile, supporting the large-diameter disk D2 on pads affixed to a tray has been proposed as a way to reduce the thickness of the tray when two kinds of disks of different diameter are used (see Japanese Laid-Open Patent Application Publication No. 2002-230939, for example).
The pads are affixed at a plurality of places on outside of a support component of the small-diameter disk D1. The large-diameter disk D2 is placed on the pads.
With the conventional disk device shown in FIGS. 7 and 8, the rise height H of the upright face 232 of the first support component 230 is set to be less than the thickness of the small-diameter disk D1. This allows the tray 220 to be thinner, and in turn allows the overall disk device to be thinner. However, this makes it difficult to ensure that the upright face 232 has an adequate contact height (corresponds to the rise height H of the upright face 232) with respect to the outer peripheral end face of the small-diameter disk D1. Accordingly, when the tray 220 is tilted because the disk device is tilted away from the horizontal orientation, the outer peripheral end face of the small-diameter disk D1 that has been moved from a turntable of the clamping mechanism to the tray 220 upon the unclamping of the clamping mechanism does not always catch on the upright face 232, and instead rides up over the upright face 232. If this happens, the small-diameter disk D1 will shift away from a proper position in the tray 220 (the position where the entire small-diameter disk D1 fits into the annular first support component 230), and the small-diameter disk D1 may catch on a housing frame of the disk device, etc., in the midst of the tray 220 being unloaded to the outside of the housing frame, thereby causing a malfunction.
One effective way of dealing with this is to lower the position of the support face 231 of the first support component 230 and increase the rise height H that the upright face 232 rises from the support face 231. However, if this is done, it may make it difficult to reduce the thickness of the tray 220 and, in turn, the entire disk device.
With the tray having the pads, the height that an upright face of the support component for the small-diameter disk D1 rises from a support face is increased by the thickness of the pads. Therefore, when the small-diameter disk D1 is placed on the support face, the contact area with respect to the outer peripheral end face of the small-diameter disk D1 is larger. However, since the pads have to be attached to the tray, the number of required parts increases, and not only does this make the assembly process more complicated, but the recording region of the large-diameter disk D2 contacts with the pads. Accordingly, even if a soft material is used for the pads, there is still the risk that the recording region will be scratched or otherwise damaged.
In view of the above, it will be apparent to those skilled in the art from this disclosure that there exists a need for an improved disk device tray. This invention addresses this need in the art as well as other needs, which will become apparent to those skilled in the art from this disclosure.


A motor current is estimated based on a target motor speed, an actual motor speed, and an engine speed. When the estimated motor current exceeds a predetermined value equivalent to a heat limiting current value, a variation (motor speed F/B amount) of the target motor speed outputted to an EDU from an ECU is restricted so that the motor current was restricted and heat generation in motor is restricted. In consideration of a deterioration of responsivity of the variable valve timing control due to restriction of the motor current during execution of motor current restriction processing, an existence of the abnormalities of variable valve timing controller is determined based on a deviation of the target camshaft phase and the actual camshaft phase.

In order to perform electronic control of the variable valve timing control, the variable valve timing controller which has the motor as a source of the drive has been developed. The variable valve timing controller described in JP-2006-70754A (US2006/0042578A1) includes a first gear, a second gear, a phase changing gear, and an electric motor. The first gear (outer gear) is concentrically arranged with the camshaft and is rotated with the rotation driving force of the crankshaft. The second gear (inner gear) rotates together with the camshaft. The phase changing gear (planet gear) transmits the torque of the first gear to the second gear, and varies the rotational phase of the second gear relative to the first gear. The motor is coaxially provided to the camshaft so that the revolution speed of the phase changing gear is controlled. The number of teeth of the first gear, the second gear, and the phase changing gear is determined so that the camshaft may rotate with one half of the rotational speed of the rotational speed of the crankshaft.
In the above motor drive variable valve timing controller, as a driving current of the motor ("motor current") increases during the variable valve timing control, the heat value of the motor increases and a coil temperature rises. When the transient operating condition in which a target motor speed (target valve timing) changes frequently continues, a coil temperature of the motor may exceed an allowable temperature and will cause durability deterioration and malfunction of the motor.
In order to solve the above matters, the present inventors has developed a variable valve timing controller which is able to restrict a motor current so that generated heat does not exceed a specified permissible value. In such a valve timing controller, a new diagnosis technology is needed.

Variable valve timing controller for internal combustion engine


A device (15) for slowing the movement of a door (2) urged by unidirectional thrust means (4), including a casing (17) fixable to a structure (S) and defining a chamber (18) filled with a viscous fluid, and a rotor (31). The rotor (31) includes a disc portion (32) and a shaft portion (33) protruding through the lid (21) of the casing (17) in such a way as it can be associated with the door (2). The base surface (23a) of the chamber (18) has a recess (51) operable to house a pivotable arm (52). The arm (52) has a pin portion (54) protruding into the chamber (18). The lower surface (62) of the disc portion (32) of the rotor (31) has a groove (70) for engaging the pin portion (54) of the arm (52). At one end (73), the groove (70) has a cam (76) dividing it into a return path (75) and a forward path (74) for the pin portion (54) so as to define a locking position for the rotor (31) in cooperation with the thrust means (4).

A device for slowing the movement of a door, drawer or similar movable member, having releasable locking means.
The present invention relates to a device for slowing the movement of a door, drawer or similar member which is movable with respect to a fixed structure and urged by unidirectional thrust means.
The present invention relates to a device for slowing the movement of a door, drawer or similar member which is movable with respect to a fixed structure and urged by unidirectional thrust means, of a type described in the preamble to Claim 1.
A device of this type is known from British Patent Application GB-A 2 062 933 and is normally used to smooth the movement of a slidable drawer caused by spring means, as used in certain types of ashtray fitted in the dashboard of motor vehicles, or of pivoted doors, of a type used, for example in tape recorder apparatus.
It is also known that such drawers or doors often have latch closure means which are released by a light pressure on the drawer, so that pressure is used to carry out both opening and closing operations.
The document U.S. Pat. No. 4,893,522 describes a rotary damper including a cylindrical rotor, a casing with a shaft for insertion into the cylindrical rotor and a cylindrical wall enclosing this shaft, with a viscous fluid between the inner surface of the cylindrical rotor and the casing shaft. A spiral spring is fitted between the cylindrical wall of the casing and the outer surface of the rotor and is wound up by the rotation induced by an applied torque. This device has incorporated latch closure means, including an excursion groove formed either in the inner surface of the casing lid or in an end surface of the cylindrical rotor and having a heart-shaped cam groove at one end and an operating pin either provided on the lid or on the cylindrical rotor, operable to slide along the groove.
The document EP-A-0 199 242 describes a device in which the latch closure means include a sphere engaged in a rectilinear groove, formed in the lateral surface of the stator, and urged by a shaped groove formed in the lateral wall of the rotor and having a cam defining a forward path and a return path for the sphere.

This patent is subject to a terminal disclaimer.

Device for slowing the movement of a door, drawer or similar movable member, having releasable locking means


A method and apparatus for defining a system design specification by using a finite set of templates that have a format for accepting a set of system expression such that a selected template, when filled with the system expressions, defines an intended behavioral attribute of the system. In one illustrative embodiment, each template has a set of qualifiers and a set of entry blanks, wherein each qualifier is associated with an entry blank. In such an embodiment, the set of entry spaces may comprise a fulfilling condition entry space for accepting a system expression that defines a required or assumed event of the system model, an enabling condition entry space for accepting a system expression that defines a precondition for starting a check of the required or assumed event, and a discharging condition entry space for accepting a system expression that defines a condition after which said fulfilling condition is no longer required or assumed by the system model. Filling the entry spaces of a selected template with the appropriate system expression can form an expression that defines an intended behavior of the system model. Thus, a set of filled templates can define a set of intended behaviors of the system model (i.e. a system design specification). The system design specification can then be used to generate computer-executable code (e.g. automata) for testing the intended behavioral attributes of the system. For example, each filled template of the system design specification can be converted to an automaton by a given subroutine.

A long-standing problem in the design of large-scale, highly complex systems is verifying that the system will behave in the manner intended by its designers. One approach to this problem is to simply try out the system, either by building and testing the system itself or by building and testing a model of the system. Since most new systems require several revisions or redesigns before they behave as intended by the system designer, many system designers choose to first build and test a model of the system. This enables the designer to check the system design by testing the behavior of the system model so that any causes for system redesign can be identified before incurring the expenses associated with building the system itself.
In one method of building and testing a system model, called computer simulation, a designer "builds" the system model by writing a computer program that simulates the intended properties (i.e. functions and features) of the system. The computer program, or system model, is designed to accept inputs, perform functions and generate outputs in the same manner as would the actual system. In computer simulation, the system model is tested by running a checking program which checks how the system model behaves in response to various inputs. Basically, the checking program controls the inputs to the system model, and checks whether the behavior of the model to a given set of inputs is the behavior intended by the system designer. For example, in checking a model of a telephone, a checking program would be operable to control the various telephone model inputs (e.g. AC power level, control signals, and dialed numbers), and monitor the behavior of the telephone model in response to such inputs.
A significant problem with computer simulation, however, is that only the behaviors anticipated by the designer can be checked. That is, the designer can only check those behaviors which the checking program is designed to check. This is a problem because a designer may not posses the system knowledge that is necessary to anticipate or incorporate all of the intended system behaviors into the checking program. Notwithstanding this, even a designer knowledgeable about the system design may find it hard to anticipate some behavioral attributes of a sufficiently complex system. As a result, computer simulation is not always a reliable method of testing the properties (i.e. intended functions and features) of a system design.
As the limitations of simulation have become apparent, interest has grown in another method of building and testing a system model, called formal verification. In formal verification, to test a model of a system, a designer is required to "build" both a system model, which may be the same model used for simulation, and a system design specification. The designer may "build" the system model by writing a computer program or a set of logical expressions that define an implementation of the system, and may "build" the system design specification by writing a set of logical expressions that define the intended behavioral attributes of the system. Basically, the system model is designed to accept inputs, perform functions and generate outputs in the same manner as would the actual system, if built, and the system design specification is designed such that each logical expression defines an intended behavioral attribute of the system or system model.
With a system model and a system design specification, a verification tool can be used to test whether the behavior of the system model is consistent with the intended behaviors defined by the design specification. Often, this is done by converting both the system model and the system design specification into a state machine. The system model state machine can be described as a system or set of states and transitions that reflects or mimics how the system model would behave in response to any given set of inputs. The system design specification state machine can be described as a system or a set of states and transitions that defines how the designer intends or expects the system model to act in response to a given set of inputs. For example, the design specification state machine might define which states the system model state machine may enter (i.e. "good" states) and may not enter (i.e. "bad" states) during operation, when given a certain set of inputs. Thus, to test whether the system model behaves according to the expected behaviors defined in the design specification, the verification tool would control and/or vary the inputs to the system model state machine and check whether the system model state machine can possibly enter any states defined by the design specification state machine as "bad" states. If so, the system design is said to fail the system design specification, and a system redesign may be in order.
Thus, it is clear that the accuracy and reliability of a formal verification system directly depends on the accuracy of the designer in writing the logical expressions that define the system design specification. If the logical expressions do not accurately define the intended behaviors of the system, the design specification state machine will not accurately define which states the system model state machine may and may not enter, given a set of inputs. Moreover, if the design specification state machine fails to accurately define the bad states, then any formal verification test will fail to check the system model for the intended behavior. Thus, the reliability of formal verification ultimately depends on the accuracy of the designer in writing the logical expressions that define the system design specification.
Heretofore, when writing the logical expressions that define a system design specification, designers are literally faced with the task of working from a blank page. That is, the designers must decide how to express each intended behavioral attribute beginning with a blank page and a set of logical operators. To illustrate, most present day designers use temporal logic to write the required logical expressions. A temporal logic expression can be generated by using a set of temporal logic operators which may include "G" meaning "at every state", "F" meaning "eventually", "A" meaning "along all state transition executions, ".about." meaning "not", meaning "or", and ".fwdarw." meaning "implies." Thus, to generate a logical expression that defines a given intended behavioral attribute of the system, the designer must understand the logical meaning of each operator, decide which operators to use, and decide how to associate the chosen operators with the appropriate system variables or system parameters to ultimately form an expression of the behavior being defined.
For example, temporal logic can be used to express a behavioral attribute such as turning on an oven when a temperature goes below a certain value. One temporal logic designer may express this behavior as AG(t.fwdarw.AF(.about.p w)), where the parameter "t" means the temperature goes below the stated value, "p" means the oven is powered, and "w" means the oven is turned on. Another designer, however, may decide that this behavior could be expressed in temporal logic as G(t.fwdarw.F(w)), wherein the parameters "t" and "w" are the same as described above. Although each expression may appear to its respective designer as accurately defining the system behavior, the expressions do not have the same logical meaning and thus do not define the same system behavior. As a result, it is very possible that different designers can write completely different logical expressions for defining the same system property, with one logical expression not actually defining the same intended behavior as the other. Thus, unless the designer posses both a detailed knowledge of the system design and a high level of skill in the logic being used to define the design specification, use of conventional formal verification tools to test a system design can be quite difficult and unreliable.

Apparatus for defining properties in finite-state machines


Provided is an ice maker. The ice maker includes a tray member comprising an upper tray having an upper shell and a lower tray having a lower shell. The ice maker also includes a driving unit disposed on a side of the tray member and configured to linearly move, in a vertical direction, at least one of the upper tray and the lower tray to change between an attached orientation in which the upper shell is attached to the lower shell to define a spherical shell and a separated orientation in which the upper shell is separated from the lower shell. The ice maker further includes an ejecting unit that is disposed on a side of the tray member and that is configured to facilitate separation of an ice piece made in the spherical shell from at least one of the upper tray and the lower tray.

In general, refrigerators are home appliances for storing foods at a low temperature in an inner storage space covered by a door. That is, since such a refrigerator cools the inside of the storage space using cool air generated by heat-exchanging with a refrigerant circulating a refrigeration cycle, foods stored in the storage space may be stored in a refrigerated or frozen state.
Also, an ice maker for making ice may be provided inside the refrigerator. The ice maker is configured so that water supplied from a water supply source or a water tank is received into an ice tray to make ice. Also, the ice maker is configured to separate the made ice from the ice tray by heating or twisting the ice tray.
As described above, the ice maker in which water is automatically supplied and ices are automatically separated may have a structure which is opened upward to lift the made ices up. Also, each of ices made in the ice maker having the above-described structure may have a shape having at least one flat surface, such as a crescent moon shape or a cubic shape.


A friction reduction assembly for a downhole tubular. The friction reduction assembly includes an electrically activated friction reduction sub. The sub includes a flowbore fluidically connected to a flowbore of the tubular and remaining open for fluid flow therethrough during both activated and non-activated states of the friction reduction sub. A friction reducer responsive to an indication of lockup of the tubular, wherein friction between the tubular and surrounding casing or borehole is reduced in an electrically activated state of the friction reduction sub. A method of reducing friction in a downhole tubular is also included.

In the drilling and completion industry, the formation of boreholes for the purpose of production or injection of fluid is common The boreholes are used for exploration or extraction of natural resources such as hydrocarbons, oil, gas, water, and alternatively for CO2 sequestration. When coiled tubing is conveyed in highly deviated, long horizontal, lateral, up-dip, and even vertical boreholes, the tubing may reach a point of "lock-up" whereby the surface initiated snubbing force is insufficient to overcome the frictional forces between the coiled tubing and the casing or formation wall.
There have been some attempts at overcoming such frictional forces by incorporating a valve to cyclically interrupt flow within the tubing to create pressure pulses. While such pressure pulses are capable of reducing frictional forces between the coiled tubing and the borehole environment, the valve typically temporarily blocks the flowbore of the tubing thereby disrupting flow that could by used by other downhole tools or bottom hole assemblies.
Thus, the art would be receptive to improved alternative devices and methods for breaking or minimizing frictional forces to allow further transmission of a coiled tubing into a borehole.

Friction reduction assembly for a downhole tubular, and method of reducing friction


Compounds of the Formula:

Alpha-1 (α1) adrenergic receptors (i.e., α1 adrenoceptors) are G-protein coupled transmembrane receptors that mediate various actions of the sympathetic nervous system through the binding of the catecholamines, epinephrine and norepinephrine (NE). Currently, several subtypes of the α1 adrenergic receptors are known to exist for which the genes have been cloned: αA1A (previously known as α1C), α1B and α1D. Recently the existence of a low affinity α1 adrenoceptor for prazosin named α1L, in human prostate has been determined. However, the gene for the α1L adrenergic receptor subtype has yet to be cloned. The α1 adrenoceptor plays a part in the sympathetic maintenance of smooth muscle tone and α1 adrenergic agonists are known to increase muscle tone in the lower urinary tract (Testa, R., Eur.J.Pharmacol., 249, 307-315 (1993). Pharmacological studies resulting in the subdivision of α1, adrenergic receptors have let to the suggestion that development of subtype-selective compounds may allow improved treatment with a lower incidence of side effects.
Urinary incontinence is a condition defined as the involuntary loss of urine. Stress urinary incontinence (SUI) occurs when the internal sphincter does not close completely. The primary symptom is minor leakage from activities, such as coughing, sneezing, laughing, running, lifting, or even standing, that apply pressure to a full bladder. Leakage stops when the activity stops. SUI is most common in women between the ages of 25 and 50, and many regularly exercising women have some degree of SUI.
The present methods to treat SUI include physiotherapy and surgery. Treatment with pharmaceuticals is limited to the use of non-selective adrenergic agonists.
Only a limited number of pharmaceutical agents have been employed, with varying success, to treat stress incontinence.
Phenylpropanolamine, pseudoephedrine and midodrine are considered first-line therapy for mild to moderate stress incontinence (Wein, supra; Lundberg (editor), JAMA, 1989, 261(18), 2685-2690). These agents are believed to work both by direct activation of a, adrenoceptors and indirectly by displacement of endogenous norepinephrine from sympathetic neurons following uptake into the nerve terminal (Andersson and Sjogren, Progress in Neurobiology, 1982, 71-89). Activation of α1 adrenoceptors located on the smooth muscle cells of the proximal urethra and bladder neck (Sourander, Gerontology, 1990, 36, 19-26; Wein, supra) evokes contraction and an increase in urethral closure pressure.
The utility of phenylpropanolamine, pseudoephedrine, and midodrine is limited by a lack of selectivity among the a, adrenoceptor subtypes and by the indirect action of these agents (i.e., activation of α1, α2, and β-adrenoceptors in the central nervous system and periphery). As a result, any desired therapeutic effect of these agents may be accompanied by undesirable side effects, such as an increase in blood pressure. The increase in blood pressure is dose-dependent and therefore limits the ability to achieve therapeutically effective circulating concentrations of these agents (Andersson and Sjogren, supra). Furthermore, in some patients these agents produce insomnia, anxiety and dizziness as a result of their central nervous system stimulant actions (Andersson and Sjogren, supra, Wein, supra).
While some selective α1A agonists have recently been disclosed for the treatment of stress incontinence, there continues to be a need for medicaments that are useful for the treatment of incontinence. A compound having the desired α1A adrenergic agonist profile is desirable.

Abstract: Compounds of the Formula:

Abstract: where R1-R6 are those defined herein and methods for producing the same. Also provided are pharmaceutical compositions comprising a Compound of Formula I and methods for their use as therapeutic agents.


An object of the present invention is to provide a dry pump and an exhaust gas treatment method which can improve an effect of inhibiting a reaction product from adhering to the inside of a gas outlet port of the dry pump, a gas exhaust pipe, or the like and can also improve an energy saving effect. To attain the object, the present invention includes the gas exhaust pipe disposed to be connected to the gas outlet port of the dry pump and to a gas inlet port of a detoxification device, and a heat exchanger which heats a diluent gas introduced therein using a heat generated from the dry pump and introduces the heated diluent gas into the gas exhaust pipe to heat a used gas to a temperature of not less than a predetermined value.

1. Field of the Invention
The present invention relates to a dry pump and an exhaust gas treatment method.
2. Description of the Related Art
In a semiconductor manufacturing treatment process, for example, dry etching treatment or chemical vapor deposition (CVD) in which a semiconductor, an insulator, a metal film, or the like is deposited on a semiconductor wafer in order to form a film through chemical vapor reaction, are performed. In a process chamber, various gases such as silane (SiH4) gas are used. The used gas exhausted from the process chamber is sucked by a dry pump or the like, further introduced into a detoxification device via a gas exhaust pipe, and subjected to detoxification treatment in the detoxification device.
In such a semiconductor manufacturing treatment process, when the foregoing used gas is subjected to cooling or the like, the used gas is solidified into a film or powder and adhere to the insides of an exhaust pipe other than that of the process chamber, the dry pump, and the detoxification device, and result in a deposit. The deposit clogs the pipe, resulting in the need of frequent maintenance.
For the maintenance, in a conventional semiconductor manufacturing treatment process, upon each end of process treatment, a cleaning gas of chlorine trifluoride (ClF3), nitrogen trifluoride (NF3), or hydrogen chloride (HCl), or the like is periodically introduced into the process chamber in accordance with the type of an adhering product. The introduced cleaning gas is led to each of the spots where semiconductor wafers are deposited to resolve and exhaust an adhering material and thus clean a reaction chamber, an exhaust pipe, a dry pump, and a detoxification device in a semiconductor treatment apparatus (see, e.g., Japanese Patent No. 3456933).
In general, as such a used gas and a cleaning gas are heated to a higher temperature of not less than 100° C., the function of resolving and exhausting the adhering material can more efficiently be performed.
Accordingly, the used gas and the cleaning gas (hereinafter such gases are generally referred to as "used gas") flowing from the process chamber through the dry pump toward the detoxification device several meters away from the dry pump are preferably held at a high temperature of not less than 100° C. when introduced into the detoxification device.
In view of this, a method has also been proposed in which, between a dry pump and a detoxification device, a diluent gas heated to about 300° C. is added to the used gas exhausted from the dry pump to be mixed with the used gas. The used gas is thus heated to 150° C. to 200° C. and introduced into the detoxification device (see, e.g., Japanese Patent Application Publication No. H4-330388).
The invention described in Japanese Patent Application Publication No. H4-330388 uses an electrically heated wire as a heat source for heating the diluent gas.
The discussion above is merely provided for general background information and is not intended to be used as an aid in determining the scope of the claimed subject matter. The claimed subject matter is not limited to implementations that solve any or all disadvantages noted in the background.

Dry pump and exhaust gas treatment method