The present invention discloses a semiconductor wafer having a scribe line dividing the semiconductor wafer into a matrix of plural semiconductor chips. The semiconductor wafer includes a polysilicon layer, a poly-metal interlayer insulation film formed on the polysilicon layer, and a first metal wiring layer formed on the poly-metal interlayer insulation film. The semiconductor wafer includes a process-monitor electrode pad formed on a dicing area of the scribe line. The process-monitor electrode pad has a width greater than the width of the dicing area. The process-monitor electrode pad includes a contact hole formed in the poly-metal insulation film for connecting the first metal wiring layer to the polysilicon layer.

In a typical dicing process of a semiconductor wafer (dicing target) for separating plural semiconductor chips from the semiconductor wafer, an annular blade having, for example, diamond particles adhered thereto is rotated at high speed and makes contact upon a scribe line formed on the semiconductor wafer. By the rotating blade making contact upon the scribe line, the semiconductor wafer is diced into plural semiconductor chips. In order to achieve better dicing performance, various parameters are optimized. The parameters include, for example, the thickness of the blade, the rotational speed of the blade, the stage speed, and the depth of the cut.
The semiconductor wafer has a layered configuration with various thin films formed on a silicon substrate and is not formed with a uniform material with respect to the thickness direction of the semiconductor wafer. More specifically, the semiconductor wafer includes metal wiring that is formed of a metal material mainly comprising aluminum material (widely used as wiring of semiconductor chips). The material of the metal wiring has a characteristic different from that of the silicon material of the silicon substrate.
Furthermore, the semiconductor wafer has a process-monitor provided on a scribe line of the semiconductor wafer for inspecting the performance of the semiconductor chips of the semiconductor wafer. The process-monitor includes a process-monitor electrode pad for evaluating the electrical characteristics of a process-monitored semiconductor device. The process-monitoring pad is also formed of a metal material. Therefore, in a process of dicing the semiconductor wafer, a layered configuration including a silicon substrate, an insulation film, and a metal material is diced.
FIGS. 15A and 15B are diagrams for showing the vicinity of a scribe line of a conventional semiconductor wafer. FIG. 15A is a plan view of the conventional semiconductor wafer. FIG. 15B is a cross-sectional view taken along line W-W of FIG. 15A.
A LOCOS (Local Oxidation of Silicon) oxide film 17 is formed on a semiconductor substrate 15. A BPSG (Boro-Phospho silicate glass) film 19 is formed on the LOCOS oxide film 17.
A first metal wiring layer 21-1 is formed on the BPSG film 19. The first metal wiring layer 21-1 is situated in the area where a process-monitor electrode pad 31 is formed. Furthermore, in the area illustrated in the drawing, the first metal wiring layer 21-1 is formed in an annular shape along a peripheral part of the semiconductor chip 3.
A first interlayer insulation film 23-1 is formed on the BPSG film 19 and also on the first metal wiring layer 21-1. A through-hole is formed in the first interlayer insulation film 23-1 on the first metal wiring layer 21-1 in the area where the process-monitor electrode pad 31 is formed. Furthermore, an annular through-hole is formed in the first interlayer insulation film 23-1 on the first metal wiring layer 21-1 along a peripheral part of the semiconductor chip 3.
A second metal wiring layer 21-2 is formed on the first interlayer insulation film 23-1. The second metal wiring layer 21-2 is situated in the area where the process-monitor electrode pad 31 is formed and in the through-hole thereof. Furthermore, in the area illustrated in the drawing, the second metal wiring layer 21-2 is formed in an annular shape along a peripheral part of the semiconductor chip 3.
A second interlayer insulation film 23-2 is formed on the first interlayer insulation film 23-1 and also on the second metal wiring layer 21-2. A through-hole is formed in the second interlayer insulation film 23-2 on the second metal wiring layer 21-2 in the area where the process-monitor electrode pad 31 is formed. Furthermore, an annular through-hole is formed in the second interlayer insulation film 23-2 on the second metal wiring layer 21-2 along a peripheral part of the semiconductor chip 3.
A third metal wiring layer 21-3 is formed on the second interlayer insulation film 23-2. The third metal wiring layer 21-3 is situated on the second interlayer insulation film 23-2 of the area where the process-monitor electrode pad 31 is formed and in the through-hole thereof. Furthermore, in the area illustrated in the drawing, the third metal wiring layer 21-3 is formed in an annular shape on the second interlayer insulation film 23-2 and in the through-hole along a peripheral part of the semiconductor chip 3.
A final protective layer 25 is formed on the second interlayer insulation film 23-2 and on the third metal wiring layer 21-3. A pad opening part is formed in the final protective layer 25 in the area where the process-monitor electrode pad 31 is formed. Thereby, the surface of the third metal wiring layer 21-3 is in an exposed state.
The above-described metal wiring layers 21-1, 21-2, and 21-3 situated in the vicinity of the peripheral part of the semiconductor chip 3 together form a guard ring 21.
In a dicing process, it is generally difficult to dice (cut) plural films formed of different materials at a single time and the dicing tends to lead to a problem of the creation of metal burrs. Normally, since a process-monitor semiconductor device situated in a dicing line is relatively small in size, the process-monitor semiconductor device can be thoroughly diced without any metal burr in a case where, for example, a blade having a thickness of 20-50 μm is employed. Meanwhile, since a process-monitor electrode pad has a width of at least 60 μm or more, the width of the process-monitor electrode pad will be greater than the thickness of such blade (width of the dicing area). This results in the problem of metal burrs.
This problem could be overcome by making adjustments in the dicing process in a case of employing a design rule referred to as a half-micron process which is applied to two-three wiring layers.
However, in recent years and continuing, there is a significant increase in forming multiple layers of metal wiring since semiconductor devices are fabricated in finer sizes (for example, fabricating a semiconductor device having seven-eight wiring layers is not unusual). Accordingly, in a case where plural layers of metal wiring are provided as a process-monitor electrode pad on a scribe line, the metal film(s) included in the process-monitor electrode pad causes metal burrs.
Furthermore, in recent years and continuing, various methods of planarization technology of an insulation film are used for solving the problem of focus depth in a case of using photolithography technology. The method of planarizing the surface of an insulation film may be, for example, using a CMP (Chemical Mechanical Polishing) method, or employing a BPSG film as the film between a polysilicon layer and a metal layer. The BPSG film, which is an insulation film formed by including boron and phosphorous into a silicon oxide layer, is fabricated by employing a CVD (Chemical Vapor Deposition) method. By increasing the concentration of boron and/or phosphorous, the surface of the insulation film can be suitably planarized. Therefore, the concentration of boron and/or phosphorous is increased to reduce the size of semiconductor devices.
However, the inventor of the present invention found that the adhesion between the BPSG film and the metal wiring layer (more specifically, between the BPSG film and a titanium film serving as a substrate of an aluminum alloy and having a high melting point) becomes weaker as the concentration of boron and/or phosphorous in the BPSG film is increased. This is because the increase in the concentration of boron and/or phosphorous not only promotes planarization, but at the same time, reduces the micro-roughness of the BPSG film. This results in loss of contact area between the BPSG film and the metal film. Therefore, the finer the semiconductor device is fabricated by increasing the concentration of boron and/or phosphorous, the more likely that metal burring of the process-monitor electrode pad occurs in the dicing process. As a result, dicing of semiconductor wafers becomes more difficult.
One example for preventing such a problem is disclosed in Japanese Laid-Open Patent Application No. 2005-191334. Japanese Laid-Open Patent Application No. 2005-191334 discloses a process-monitor electrode pad disposed inside a semiconductor chip so that only the semiconductor device for process monitoring is disposed on the scribe line. Accordingly, the electrode pad would not obstruct the dicing process.
However, since the method disposes a process-monitor electrode pad inside a semiconductor chip, the semiconductor chip is to be formed in a large size. This increases manufacturing cost. This additional electrode pad disposed inside the semiconductor chip is a critical problem particularly for a semiconductor chip product having a large number of electrode pads, since the chip size of the product is decided according to the limits in the distance between electrode pads.
As shown in FIG. 15B, a guard ring formed of a metal material may be disposed between a semiconductor chip and a scribe line for preventing the inside of the semiconductor chip being damaged in the dicing process. However, by disposing the process-monitor electrode pad inside the semiconductor chip, the process-monitor electrode pad is required to overstep the guard ring for contacting with a process-monitor semiconductor device. This is a difficult task to accomplish since a portion of the guard ring, being formed of metal material, would undesirably be cut off for accomplishing such task. If such portion of the guard ring is cut off, the purpose of providing the guard ring would be lost.
Japanese Laid-Open Patent Application No. 2005-191334 also discloses an example of disposing a process-monitor electrode pad inside a semiconductor chip and using the process-monitor electrode pad not only for process-monitoring but also as an electrode pad of the semiconductor chip.
However, since there is, in general, no correlation between the number of semiconductor devices provided on the scribe line for process-monitoring and the number of electrode pads used in each product, it is difficult to adjust the position of semiconductor devices disposed on the scribe line and the position of the electrode pads used for a product. Furthermore, this example requires a separate probe card for each product when performing electric measuring with a process monitoring device. In addition, this example does not resolve the above-described problem of the guard ring.
Japanese Laid-Open Patent Application No. 2005-191334 also discloses an example of disposing process-monitor electrode pads and semiconductor devices within the scribe line but not in the dicing area (cutting area) of the scribe line.
However, this example requires the scribe line to be wide. This reduces the number of semiconductor chips that can be cut off (diced) from a semiconductor wafer. As a result, manufacturing cost is increased.

Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line


The present invention provides a text and graphic separation method and a text enhancement method. The text and graphic separation method is used for separating texts and graphics of an image and comprises coarse classification and advanced classification. The method of the present invention also adjusts the luminance of the text to enhance the text image according to the separation result.

Recently, multi-function peripheral device is popular for digital image processing. It provides functions for image scanning and printing. In Multi-function peripheral device, graphic and text separation and text enhancement are often processed in Multi-function peripheral device.
Document usually comprises a graphic part and a text part. By way of graphic and text separation processing, the graphic part and the text part can be separated for further processing. For example, in case of without graphic/text separation process, when printing a document, printers use color ink to print the whole content. That is, the text part will be printed with color ink as well and therefore wastes color ink. However, in case of having graphic and text separation process, the graphic part is printed with color ink and the text part is printed with black ink and therefore the color ink is saved.
The graphic and text separation methods of prior art comprise a hue adjusting method, an edge detecting method and a chroma and luminance detecting method. These prior art methods do not classify the image according to text and graphic, but apply a single process on the whole image. It won't provide a good graphic and text separation result without classifying the image according to graphic and text. For example, the hue adjusting method adjusts the hue of the whole image, such as increasing the hue of the brighter part of the image and reducing the hue of the darker part of the image, to separate graphic and text. Because graphics and texts are subjected to the same process of hue adjusting, it will impact the hue of the whole image.
Besides, the edge enhancement method often incorrectly recognized the noise and graphics of the image of document as texts and therefore generated error recognition result. However, applying the method which used chroma and luminance to separate text and graphic on low or zero chroma photos will also fault the result.
The purpose of text enhancement is to make the image of text clearer. The prior art methods for text enhancement do not separate text and graphic before the text enhancement process, but adjust the luminance of the whole image to clear the text image. However, such adjustment will decrease the hue of the graphics of the document.

Text and graphic separation method and text enhancement method


The invention facilitates the distribution of content over a network (e.g., the Internet, a television network) and, in particular, the distribution of high-bandwidth (i.e., data intensive) content, such as video content or customized content. At least one of the sites of the network (a “core server”) is controlled (at least in part) by an entity that desires to distribute content to one or more other network sites (“client(s)”) at which the content is to be used. In accordance with the invention, a core server uses one or more other network sites (“node server(s)”) to distribute content on behalf of the core server to one or more clients. In particular, in accordance with one embodiment of the invention, the entit(ies) having control (at least in part) of each of one or more network sites (node server(s)) can be recruited to use their site(s) to distribute content on behalf of a core server to one or more clients.

1. Field of the Invention
This invention relates to the provision of content over a network by a content provider. In particular, the invention relates to the provision over a network of high-bandwidth content and to the provision of content over a network by enlisting one or more network sites to facilitate the distribution of content on behalf of a content provider.
2. Related Art
An ongoing problem for content delivery networks is the delivery of high-bandwidth content in a satisfactory manner. High-bandwidth content is any content that requires relatively (as compared to the bandwidth capabilities of the network) large data transmission rates in order to effect transmission of the content within an acceptable period of time. High-bandwidth content can be, for example, a single set of data intensive content (e.g., video content, three-dimensional visual still images). High-bandwidth content can also be multiple sets of content that are to be transmitted at the same time (e.g., customized content) so that, together, the sets of content are data intensive.
For example, as discussed in U.S. patent application Ser. No. 09/144,369, entitled "Ameliorating Bandwidth Requirements for the Simultaneous Provision of Multiple Sets of Content over a Network," filed on Aug. 31, 1998, by Trevor I. Blumenau, the disclosure of which is incorporated by reference herein, delivering individualized or customized content (different streams of data delivered at the same time and/or the same stream of data delivered at different, but overlapping, times) to many content users across a network (e.g., the Internet) is extremely challenging. Delivery of such content can be facilitated by strategically placing a multiplicity of servers at key places (nodes) in the topology of the network to allow for "hand-offs." For example, in one system for distributing low-bandwidth content over the Internet to a very large number of people, several servers on which copies of the content are stored have been connected worldwide at different nodes on the Internet to effect distribution of the content.
Video content is typically data intensive (even more so as the quality of the video increases). A single set of video content can be high-bandwidth content. For example, delivering full video streams to large audiences on the Internet (or similar network) so far has been impossible. Existing systems for delivery of video streams over the Internet suffer from undesirable limitations. For example, CNN distributes video streams over the Internet, but the video streams are limited to a pixel resolution of less than 320×240 and the video streams include only very short clips using very low frame rates. Some Web sites have broadcasted video streams over the Internet, but, again, the frame size is small and the frame rate low. Additionally, those Web sites have not delivered customized video content (in terms of either the time of delivery—i.e., video on demand—or the actual content delivered).

Content distribution system for distributing content over a network, with particular applicability to distributing high-bandwidth content


A method and apparatus provide for etching a semiconductor wafer using a two step physical etching and a chemical etching process in order to create vertical sidewalls required for high density DRAMs and FRAMs.

The present invention is directed to an improved plasma etch reactor apparatus and method.
A new set of emerging films are being beneficially employed in the development of high density semiconductor chips such as for example high density dynamic random access memories (xe2x80x9cDRAMxe2x80x9d) and ferroelectric random access memories (xe2x80x9cFRAMxe2x80x9d). These materials provide for higher capacity devices by allowing for a reduction in the size of the individual features on the memory substrate. Accordingly, enhanced profile control technologies are required.
In the past, a number of techniques have been used to obtain a desired semiconductor feature wall profile. One technique is ion milling which is classified as a physical etching method. With this technique, an ion mill beam is used to physically sputter away portions of a layer of a semiconductor device which are not desired, leaving the desired feature defining the various components and traces on the semiconductor device. While such techniques have produced desirable profiles, the disadvantage of using ion milling techniques is that the processes are slower and such techniques tend to cause the formation of veils or fences upstanding from the desired feature.
Photoresist material is to protect and define the desired features produced by the ion milling technique. Once the photoresist material is stripped away, the veils or fences remain as undesirable and difficult to remove structures.
Chemical etching is another technique employed to remove portions of a layer of a semiconductor wafer which are unprotected by photoresist material. Such methods, while providing for faster etching than provided by, for example, ion milling, do not necessary have the same profile control afforded by ion milling.
Accordingly, there is a need to provide an etching process and apparatus which quickly and accurately processes emerging films which are used in the latest semiconductor products.
The present invention includes a method and apparatus designed to process emerging films which present unique etch problems. Such new films include for example, platinum and barium strontium titanate (BST), which are currently being used in the development of high density DRAM devices, and platinum and lead zirconium titanate (PZT) or bismuth strontium tantalate (Yxe2x88x921), which are currently being used in development of non-volatile, FRAM devices. Of these new films, BST, PZT, and Yxe2x88x921 have for example a high dielectric constant which allows for the development of greater circuit density, fine line geometry devices. With enhanced feature densities, more exacting vertical profile are required.
The present invention is directed to performing critical etching which results in anisotropic profiles (i.e., straight, vertical sidewalls) which is highly selective and causes minimal damage to the underlayer or other wafer materials, and which is performed uniformly over a non-uniform area.
Accordingly, the present invention provides for an apparatus and method which allows for a physical etching and then a chemical etching of a wafer in order to obtain wafer features with highly advantageous vertical sidewall profiles. The present invention provides for a method and apparatus which operates on a continuum, first emphasizing physical etching such as for example, by way of ion milling, and then emphasizing chemical etching.
Such a technique is uniquely counter-intuitive in that the ion milling portion of the process creates the desired vertical profiles, but in addition creates undesirable veils. However, advantageously, the present invention provides for a chemical etching in a continuum with the operation, which chemical etching satisfactory removes the veils. Accordingly thereafter, such that the semiconductor wafer can be operated on with other methods such as the unique rinse-strip-rinse method presented in the above U.S. patent application Ser. No. 08/438,261, now U.S. Pat. No. 5,672,239, to obtain the desired feature, configuration, densities and profiles. Thus, after the chemical etching process has occurred, the wafer is rinsed in order to remove any soluble residue prior to the stripping away of the photoresist material in a stripping or ashing step and with a subsequent post-strip rinsing of the semiconductor wafer to remove residue.
The method is performed in a chamber which has an electrode adjacent to where the semiconductor wafer is placed. The electrode is provided with a first power supply operated in the megahertz range and with a second power supply operated in the kilohertz range. During the first portion of the method, both power supplies are operable in order to enhance the ion milling technique. During the second portion of the method where the chemical etching is predominant, the second power supply operating in the kilohertz range is turned off, greatly reducing the influence of ion milling.
In another feature of the invention, a tri-electrode chamber is used wherein the bottom electrode is located adjacent the wafer and is powered as indicated above with two power supplies. A side peripheral electrode is either grounded or free-floating, and a top electrode spaced from and locked above the wafer is either grounded or allowed to be free-floating.

Method and apparatus for etching a semiconductor wafer with features having vertical sidewalls


A vehicle, such as a motorcycle, includes one or more stationary funnels through which air is delivered to an intake port of an engine. One or more movable funnels are arranged on an inlet side of the one or more stationary funnels and cooperating with the stationary funnels to deliver air to the intake port of the engine. A parallel linkage rotatably supports the stationary funnels and includes an upper linkage member and a lower linkage member.

1. Field of the Invention
The present invention relates to a vehicle, and more particular, to a vehicle provided with a funnel through which the air is delivered to an intake port of an engine.
2. Description of the Related Art
It is conventional for vehicles, such as motorcycles, for example, to be provided with a funnel through which the air is delivered to an intake port of an engine. For example, Japanese Patent Publication No. 09-100720 discloses a motorcycle provided with an intake air funnel that is divided into two parts.
FIGS. 36 and 37 are cross sectional views illustrating a construction of a funnel similar to that disclosed in Japanese Patent Publication No. 09-100720. With reference to FIG. 36, a funnel of the motorcycle includes a stationary funnel 101 and a movable funnel 102. The stationary funnel 101 is fixed to an air cleaner box, or intake air box 103, to which the air purified by an air filter (not shown) is supplied. An inlet 101a end portion of the stationary funnel 101 is arranged in the cleaner box 103 and an outlet 101b end portion is connected to an intake port (not shown) on which an intake valve of an engine 100 is arranged.
The movable funnel 102 is arranged in the air cleaner box 103 so as to be movable in the air cleaner box 103. Specifically, the movable funnel 102 is supported in the air cleaner box 103 by a single turning lever 105, which rotates about a support shaft 104. Therefore, as shown in FIG. 36, in the event that the turning lever 105 is turned in a direction identified by the arrow M, an outlet 102a of the movable funnel 102 is moved toward the inlet 101a of the stationary funnel 101. On the other hand, as shown in FIG. 37, in the event that the turning lever 105 is rotated in a direction identified by the arrow N, the outlet 102a of the movable funnel 102 is moved away from the inlet 101a of the stationary funnel 101.
The operation of the two-part intake air funnel is described with reference to FIGS. 36 and 37. First, when the engine 100 rotates at low speeds, an intake pipe connected to the engine 100 from the air cleaner box 103 is lengthened in order to attain a desired pulsation effect of the air moving within the intake air funnel. As is known, the pulsation effect improves the intake efficiency through adjustment of the length of the overall intake passage to correspond the movement of high pressure waves within the intake passage to the rotational speed of the engine 100. That is, when the engine 100 rotates at low speeds, the outlet 102a of the movable funnel 102 is coupled to the inlet 101a of the stationary funnel 101 by rotating the turning lever 105 in the M direction, as shown in FIG. 36. Thereby, the intake passage leading to the engine 100 from the air cleaner box 103 is lengthened because the both the stationary funnel 101 and the movable funnel 102 make up the intake passage.
When the engine 100 rotates at high speeds, the intake passage leading to the engine 100 from the air cleaner box 103 is shortened facilitate obtaining a desired pulsation effect. That is, when the engine 100 rotates at high speeds, the outlet 102a of the movable funnel 102 is separated from the inlet 101a of the stationary funnel 101 by rotating the turning lever 105 in the N direction, as shown in FIG. 37. Thereby, the intake passage leading to the engine 100 from the air cleaner box 103 is made shortened because the intake passage is defined only by the stationary funnel 101.

Engine air intake arrangement for a vehicle


An apparatus for repairing an existing spill containment manhole operably associated with an underground fuel storage tank. The apparatus includes a containment vessel for containing fuel spilled during filling of the underground fuel storage tank. A major portion of the containment vessel is adapted to be inserted into an existing spill containment manhole. Preferably, the containment vessel includes an upper annular flange that extends over and surrounds a portion of an existing cover rim of an existing spill containment manhole thereby isolating an upper portion of the containment vessel from an upper portion on the existing spill containment manhole when the containment vessel is installed. Optionally, a replacement cover is provided to replace an existing cover of the existing spill containment manhole. The replacement cover may include at least one sealing member that engages the inner surface of the at least one wall of the containment vessel when installed.

A variety of spill containment devices or manholes have been employed to prevent contamination of the surrounding environment during the process of filling underground storage tanks with hazardous liquids including fuels like gasoline. Service stations dispensing gasoline, diesel, and other fuels commonly employ underground storage tanks for storing various types of fuels. The underground storage tanks typically include a riser pipe through which the fuel is dispensed from and transferred to the underground storage tank. The riser pipe is connected to and extends upwardly from an opening in the underground fuel storage tank.
A pipe section commonly known as a fill port or nipple is typically connected to the riser pipe. A removable fill cap is usually secured to the fill port or nipple. The fill cap is removed to fill the underground fuel storage tank.
Spill containment manholes or devices have been used to provide access to the fill port of the underground fuel storage tank and prevent contamination of the surrounding environment. For example, fuel can and does spill when the dispensing hose from the fuel truck is connected or disconnected to the fill port. In addition, fuel spills may occur if the underground storage tank is overfilled. The spill containment manholes or devices were designed to trap spilling fuel to prevent contamination of the surrounding environment. Specifically, the spill containment manhole or device surrounds and contains the fill port or nipple. By providing a containment vessel surrounding the fill port, the spill containment manhole or device can prevent fuel spills caused during the process of filing the underground fuel storage tank from contaminating the environment.
The spill containment manhole or device typically includes a removable cover to allow an individual to access the fill cap and fill port. The spill containment manhole or device may have a drain operably connected to the riser pipe to drain any fuel trapped by the spill containment manhole back into the underground fuel storage tank.
Over time the spill containment manhole or device deteriorates making it considerably more likely that a crack or other imperfection will form allowing fuel to leak into the surrounding environment that normally would have been trapped by the spill containment manhole or device. Attempts have been made to provide a bucket or liner that can be inserted into an existing manhole to repair an existing leak or potential leak. One such product is THE LINEBACKER™ made by JGD Products, LLC. This product has several inherent disadvantages. First, the bucket or liner does not extend up to the ground surface. Therefore, the bucket or liner does not isolate the existing spill containment manhole. Rather, at least an upper portion of the existing spill containment manhole must be relied upon to prevent fuel from leaking into the surrounding environment. Further, this design requires a sealant be applied to the vertical wall of the bucket or liner and the adjacent portion of the existing spill containment manhole inside of the containment area of the existing spill containment manhole. Therefore, if the sealing material deteriorates overtime or is incorrectly applied in the first instance, fuel can escape into the surrounding environment through the defective or deteriorated seal. Another disadvantage of this product is that the same removable cover is typically reused. THE LINEBACKER™ bucket or liner does not provide a direct seal with the removable cover. In other words, the removable cover does not seal directly to the THE LINEBACKER™ bucket or liner. Again the bucket or liner fails to isolate the existing spill containment manhole. Rather, at least an upper portion of the existing spill containment manhole must be relied upon to prevent fuel from leaking into the surrounding environment. Another disadvantage with this product is that it uses a bulky connector for connecting the bucket or liner in a fluid tight manner to the fill port and/or corresponding coupling or fitting. This is undesirable as there is limited space. A further disadvantage of this product is that it does not include a vehicle for draining fuel back into the underground fuel storage tank from the bucket or liner.

Apparatus and method for repairing an existing spill containment manhole


Methods for producing a magnesium-rare earth intermediate alloy, which belongs to the technical field of molten salt electrolytic metallurgical technology. In one embodiment, the method comprises subjecting magnesium chloride, lanthanum praseodymium cerium chloride and potassium chloride to an electrolysis, and adding additional lanthanum praseodymium cerium chloride and magnesium chloride during the electrolysis. In the electrolysis process, neither metal magnesium nor rare earth metal is used, only the chlorides of rare earths and magnesium are used and the rare earth ions and the magnesium ions are co-electrodeposited on the cathode, so as to obtain the intermediate alloy having a melting point close to the eutectic temperature of the rare earth and magnesium. The method has various advantages including but not limited to high operability, simple process and equipment, stable quality of product by mass production and easy for commercial scale production.

1. Technical Field
The invention relates to a method for producing a magnesium-rare earth intermediate alloy, which belongs to the technical field of molten salt electrolytic metallurgical technology.
2. Background of the Art
Magnesium-rare earth intermediate alloy is a basic material for producing an advanced and new type of corrosion-resistant and high temperature-resistant magnesium alloy. There are mainly the following three methods for producing a magnesium-rare earth intermediate alloy. The first one is mutual infiltration method, and the second one is magnesium thermal reduction method, but these two methods have the following defects: it is difficult for the mutual infiltration method to avoid segregation of the alloy components, since magnesium is greatly different from most of rare earth metals in specific gravity and melting point, so that rare earth metals cannot be dispersed well into magnesium; while the magnesium thermal reduction method is a batch method, which production cost is high. The third one is molten salt electrolytic method, which comprised both of liquid state cathode method and co-precipitation electrolytic method.
Liquid state cathode method is a method for producing a magnesium-rare earth intermediate alloy by electrolysis using magnesium or magnesium-rare earth intermediate alloy having a low rare earth content as liquid state cathode. Electrolysis is carried out by using the alloy constituents as the cathode, wherein rare earth ions in the electrolyte is migrated and dispersed toward the cathode under the action of DC electric field, and an electrochemical reaction is carried out on the cathode. The rare earth segregated on the cathode is alloyed with the cathode magnesium to produce the magnesium-rare earth intermediate alloy having a low melting point.
Ping LI, Dingxiang TANG, et al. proposed a method for producing an yttrium-rich rare earth-magnesium alloy having 20 to 30% of yttrium-rich rare earth, by using an alloy having 10 wt % of yttrium-rich rare earth as a sinking cathode, in a electrolyte of 15 to 20% of RE(Y)Cl3—KCl—NaCl, under an electrolysis condition of a cathode current density being 1 to 1.5 A/cm2, with a current efficiency of greater than 70%[1].
Chunxu REN and Kangning ZHANG proposed a method for electrolyzing neodymium magnesium alloy using liquid state metal magnesium as a cathode. Magnesium is floated on the surface of the electrolyte because of its lower density, and becomes the upper liquid cathode. NdCl3—KCl—NaCl is used as the electrolyte, the content of NdCl3 is 20%. The electrolysis temperature is 820±20° C., and the cathode current density is 1.5 A/cm2. At the early stage of electrolysis, the magnesium cathode is floated on the tope of the electrolyte. During the electrolysis, as neodymium is segregated continuously and formed into a magnesium neodymium alloy with the liquid state cathode, the density of the cathode alloy increases with the content of neodymium. When its density is greater than that of the electrolyte, the alloy cathode sinks into a bottom receiver. At this moment, the cathode conductive molybdenum bar should also fall down along with the alloy cathode so as to keep contact with the alloy. During the electrolysis, the alloy is stirred continuously, which can accelerate the dispersion of neodymium into the inside of the alloy, enhance the alloying process, eliminate the concentration gradient of the alloy, and increase the current efficiency and the direct yield of neodymium, wherein the neodymium content in the magnesium alloy can be up to about 30%. The current efficiency of the process is 65-70%, and the neodymium direct yield is up to 80-90%[2].
The co-precipitation electrolytic method is a method for producing a magnesium-rare earth intermediate alloy by using the co-precipitation of the rare earth ions and magnesium ion in the electrolyte onto the cathode.
Yttrium magnesium and yttrium magnesium-rich alloys were produced in Zhongshan University, by electrolytically coprecipitating in a melt containing yttrium chloride and yttrium-rich chloride, in a small type of graphite electrolysis cell. In the case where the temperature is 850 to 860° C., the cathode current density is 20 to 32 A/cm2, and 25 to 35% of YCl3 and 4 to 6% of MgCl2 is contained in the melt, an yttrium magnesium alloy containing about 60% of yttrium can be obtained through electrolysis, wherein the average current efficiency is 70%, and the yttrium direct yield is 75%, with a maximum being able to be up to 83%.
A yttrium magnesium alloy having a yttrium amount of more than 60% is obtained in Hunan Rare Earth Material Institute, by using YCl3—MgCl2—KCl as the electrolyte, and electrolyzing at a temperature of 900° C., in a graphite electrolysis cell having a diameter of 150 mm, wherein the current efficiency is 50%, and the rare earth direct yield is greater than 70%[4].
In Baotou Rare Earth Research Institute, a Mg—Ce intermediate alloy containing 40 to 60% of Ce is produced under an order of 800 A, by using CeCl3 crystalline material and anhydrous MgCl2, with CeCl3—MgCl2—KCl in a ratio of CeCl3/MgCl2/KCl=25-35/3-5/60-70 (wt %) being the electrolyte, at a temperature of 900 to 920° C. and under a cathode current density of 10 to 15 A/cm2, wherein the current efficiency is up to 75%, the direct yield of the rare earth is 95%, and the direct yield of magnesium is 98%[5].
However, the raw materials used is anhydrous rare earth metal chloride in the liquid state cathode method, and anhydrous magnesium chloride in the electrolytic co-precipitation method, which require a complicated dehydrating process, especially the process for removing the final 2 crystalline waters from magnesium chloride is extremely complicated, causing many problems such as large energy consumption, large material consumption and the equipment corrosion by HCl.

Method for producing a magnesium-lanthanum praseodymium cerium intermediate alloy

Changchun Institute of Applied Chemistry Chinese Academy of Sciences


A system for regulating the cabin temperature of an automobile features an automobile having a roof and a passenger cabin. The roof features a ventilation housing aperture located therein. The system features a ventilation housing having a hollow housing chamber located therein. A housing bottom side features a fan aperture located therein. The housing bottom side is located on the ventilation housing aperture thereon. A housing rear side features an exterior vent aperture located therein. The system features an anterior chamber and a posterior chamber located in the hollow chamber. A chamber divider is located between the anterior chamber and the posterior chamber. The system features a fan located in the fan aperture operatively connected to a power source.

Automobiles have been in use since the late 1800s, but originally contained open seating for the driver and passengers. Through the early 1900s, automobile cabins emerged and advanced in design to better protect the occupant as well as provide a more comfortable environment. Automobile cabin temperatures tent to rise to extreme levels during the summer months in many areas, especially with all the windows closed. A need exists for a better ventilation system for automobile cabins. The present invention features a system for regulating the cabin temperature of an automobile.
Any feature or combination of features described herein are included within the scope of the present invention provided that the features included in any such combination are not mutually inconsistent as will be apparent from the context, this specification, and the knowledge of one of ordinary skill in the art. Additional advantages and aspects of the present invention are apparent in the following detailed description and claims.


A foot actuated wheel brake for shopping carts and other wheeled equipment is disclosed. The wheel brake is designed for at least one wheel in a wheeled cart where each wheel is rotatably supported on a yoke at a lower end of a leg support in the wheeled cart. The wheel brake includes a first foot pedal that extends above and is movably mounted to the yoke. Preferably, the first foot pedal has a red colored stop sign shape. A second foot pedal extends laterally outwardly beyond the yoke and is movably mounted to the first foot pedal. Preferably, the second foot pedal has a green colored curvilinear shaped element that extends outwardly beyond the red colored stop sign shape. Operating engaging/disengaging structure is associated with the first and second foot pedals for moving the brake shoe into braking engagement with the wheel when the first foot pedal is engaged and for releasing the brake shoe from the wheel when the second foot pedal is engaged. The foot actuated wheel brake of the present invention may be used on existing shopping carts as well as on original equipment.

The present invention relates to a foot actuated wheel brake for shopping carts or other wheeled equipment, and more particularly, to a positive locking and quick release foot actuated wheel brake for selective braking engagement of a rotatably mounted wheel on a shopping cart or other wheeled equipment.
Numerous wheel braking devices have been developed for engaging a wheel in various wheel carts and equipment to stop the movement of the equipment. In most cases, the brake devices are designed for use only on a single wheel since by stopping the rotation of a single wheel, the entire wheel cart can be immobilized. Some typical examples of brake devices are shown in U.S. Pat. Nos. 2,572,548; 2,695,683; 2,709,828; 3,571,842 and 3,860,992. The wheel brakes shown in these patents, as well as many other designs which have been constructed to address the problem, disclose useful features and constructions, although they have found limited use in shopping carts. In the early 1990's, there have been no substantial inroads of prior art wheel brake devices in shopping carts.
There are millions of shopping carts used in the United States and other foreign countries; however, at the present time, the foot actuated wheel brake has not been incorporated in such equipment, for several important reasons. These include the fact that such wheel brake devices have not been designed with both the consumer and store owner in mind. That is, prior art wheel brakes have not been constructed so as to be both user friendly to the consumer, as well as to being economical to the store owner. A further reason is that such prior art wheel brake devices have not been easy to use when they do not provide a positive locking and unlocking engagement of a wheel on a repetitive basis over a sustained period of time. As a result, the many problems associated with shopping carts remain.
These problems include the difficulty of loading a car from a shopping cart or trying to file a place to leave the shopping cart, after use. Almost everyone has experienced the difficulty of unloading groceries or other products from a shopping cart into a car. Without a wheel braking device, the shopping cart can easily roll away, and this requires the user to somehow hold on to the cart, while unloading it. Consumers are use to holding the shopping cart with their feet or holding the cart with other parts of their bodies against the cart, while unloading the contents of the cart into a car. This particular problem is more than a frustrating experience because the shopping cart could easily roll away and damage the user's car or other cars nearby, as well as the cart itself.
Injury to other people is a related problem with runaway carts. For example, shopping cart injury is one of the leading causes of injuries to children. Thus, the problems of a runaway cart may create frustrating experiences during use, but also impose serious risk or exposure to both the property of others and bodily injury to users.
Runaway shopping carts have been clocked at speeds exceeding 30 m.p.h. in high winds. As will be appreciated, carts travelling at such high rates of speed can cause serious injury to both pedestrians and motorists. During periods of high winds, damage to vehicles also increases, because the carts can become easily dislodged. Damage to the carts, resulting in repair and/or replacement by the store owner, is a continuing problem. A store owner may also be faced with increases in insurance premiums and deductibles. Because repair of minor shopping cart damage can cost $200.00 or more, the store owner's insurance and deductibles are typically not sufficient to cover the cost associated with repairing damage to vehicles and the carts.
Following use of the shopping cart, the user looks for a place to leave the cart where it will not roll away. Typically, cart corrals have been developed for storing and nesting shopping carts after use. While users are expected to position the shopping cart in the cart corral after use, for a variety of reasons, many shoppers do not use cart corrals. As a result, this creates another potential runaway cart problem where inclines and/or high winds cause the cart to move to an unwanted location.
The foot actuated wheel brake of the present invention has been constructed to overcome all of the aforementioned problems that are primarily associated with shopping carts. Additionally, the foot actuated wheel brake of the present invention can also be used on other types of wheel equipment, as may be desired.


A photoresist composition and manufacturing method thereof, a manufacturing method of a metal pattern, and a manufacturing method of an array substrate are provided. The photoresist composition includes a base material and an ion adsorbent, and the ion adsorbent is chelating resin.

Photoresist refers to a corrosion-resistant film material which changes in solubility upon being illuminated by ultraviolet light, electron beam, particle beam, x-ray and so on. The photoresist is a key material for a lithography process. The photoresist can be classified as a positive photoresist and a negative photoresist according to its change in solubility before and after exposure. The solubility of the positive photoresist is increased after exposure, whereas the solubility of the negative photoresist is reduced after exposure.
The photolithography process is an indispensable process for manufacturing an array substrate, and a pattern with a desired shape can be obtained, and the photoresist is indispensable to implementation of the photolithography process. A main component of the photoresist is a photosensitive group-containing polymer. Under irradiation of ultraviolet light and the like, photosensitive groups of the irradiated photoresist undergo a chemical reaction, which results in difference in the solubility of the photosensitive portion and the light-shielding portion of the photoresist in a developer and thus forms a pattern with a desired shape after developing.

Photoresist composition, its manufacturing method, and manufacturing methods of metal pattern and array substrate

Hefei Xinsheng Optoelectronics Technology Co., Ltd.


A semiconductor element and a manufacturing method thereof are provided. The semiconductor element includes a base, an epitaxy layer, a first well, a second well, a third well, a first heavily doping region, a second heavily doping region, a implanting region and a conductive layer. The epitaxy layer is disposed on the base. The first well, the second well and the third well are disposed in the epitaxy layer. The third well is located between the first well and the second well. A surface channel is formed between the first heavily doping region and the second heavily doping region. The implanting region is fully disposed between the surface channel and the base and disposed at a projection region of the first well, the second well and the third well.

1. Technical Field
The disclosure relates in general to a semiconductor element and a manufacturing method thereof, and more particularly to a metal oxide semiconductor field effect transistor and a manufacturing method thereof.
2. Description of the Related Art
With the development of semiconductor technology, varied semiconductor elements are provided. For example, a metal oxide semiconductor field effect transistor can be used in an analog circuit or a digital circuit.
In the metal oxide semiconductor field effect transistor, a base electrode and a source electrode may not directly connected and my result a body effect. According to the body effect, a gate voltage of the metal oxide semiconductor field effect transistor will be changed and affects the electric performance thereof.

Semiconductor and manufacturing method thereof


Aquatic organism repellent agents are derived from algae, sponges, tunicates, bryozoans, echinoderms and coelenterates and prevent the attachment and accumulation of microscopic and macroscopic organisms to surfaces in aquatic environments. One or more of the agents may be incorporated into a carrier for release of the agent in the locus to be protected.

1. Field of the Invention
This invention relates to prevention of fouling of surfaces in aquatic environments by microscopic and macroscopic organisms. More particularly, antifouling agents, compositions, coatings and methods for repelling and preventing attachment, growth and proliferation of biofouling organisms are disclosed.
2. Description of Related Art
Biofouling organisms settle on surfaces that are submerged in aquatic environments. Submerged surfaces such as water pipes, power plant water intake systems, sewer pipes, boat hulls, heat exchangers, grids, and the like are prone to biofouling. Biofouling is a major problem for most industries involved with fresh or salt water environments. Aquatic pests frequently clog pipes or become attached to submerged surfaces thus interfering with normal operations. For example, warm water associated with power plant cooling systems provides an ideal environment for the attachment and growth of aquatic organisms. Biofouling organisms also attach to other surfaces which contact aqueous solutions such as fishing nets, buoys, pilings, off-shore platforms, lumber, roofs, and concrete.
When a clean surface is introduced into an aquatic environment, it typically becomes coated with a conditioning layer of hydrophobic dissolved organic compounds. Microorganisms such as bacteria, algae, fungi, and protozoa attach to the conditioning layer and establish colonies which result in the formation of a slime layer. Such slimes can cause problems, e.g., by significantly reducing heat transfer across exchangers in cooling systems. Furthermore, slime layers contribute to the establishment of biofouling communities because planktonic (free floating) larvae of many invertebrate biofouling organisms are physically and chemically attracted to the slime layer. Examples of invertebrate biofouling organisms include mollusks such as mussels and oysters, and crustaceans such as barnacles. The release of specific compounds from the slime layer can also trigger metamorphosis of the planktonic larvae (see Hadfield (1986) Bull. Mas. Sci. 39:418-425 and Young and Mitchell, (1973) Int. Biodeterior. Bull. 9:105-109).
The blue mussel, Mytilus edulis, presents a particular problem at coastal power plants located in the Northeastern region of the United States. Mytilus edulis planktonic larvae settle on and attach to any available substratum. More recently, zebra mussels have begun to clog structures submerged in fresh water or brackish water environments. Settled juveniles grow rapidly and form dense aggregates which cause such problems as clogging inflow or outflow pipes.
Biofouling of underwater structures such as power plant water intake systems and heat exchangers results in significant economic losses to industry. Decreased fuel efficiency, increased cleaning and maintenance expenses, as well as outage expenses all contribute to increased economic expenditures. The incentive for preventing marine biofouling is great. As a result, various methods and compositions have been developed for prevention of marine biofouling. For example, utilities employ several methods for removing established biofouling communities. Periodic power outages are employed to physically enter power plant systems to remove organisms and debris. In addition, utilities often attempt to kill established biofouling communities by pumping large volumes of chlorine and molluscicides through water handling systems. However, these methods are slow acting and adversely affect the local ecology downstream from the effluent. Furthermore, these chemical treatments are inefficient because toxins are mixed in bulk water phase in an attempt to treat a surface phenomenon. Certain organisms such as the blue mussel can sense sub-lethal concentrations of some toxins and seal themselves off for long periods thereby effectively preventing contact with the toxins. Therefore, another drawback of certain existing chemical treatments is that relatively large toxic doses must be maintained for extended periods to effectively eliminate biofouling pests.
Ablative toxic antifouling coatings containing tributyl tin, copper alloys, mercury compounds, or cathodic protection have also been employed to control fouling. These antifouling coatings may include toxins which are leached into the aquatic environment to inhibit biofouling. The following examples of antifouling coatings are included for purposes of illustration. U.S. Pat. No. 5,096,488 describes a vinyl polymer or copolymer emulsion containing certain enumerated ammonium compounds. U.S. Pat. No. 5,116,407 describes an antifouling marine coating containing certain enumerated amine compounds acting as paint binders and marine biocides. U.S. Pat. No. 5,143,545 describes an antifouling marine paint containing certain enumerated water insoluble antibiotics said to be toxic to gram negative organisms of the genus Oceanospirillum, and a metallic compound, i.e., copper, tin, or zinc, acting as a marine biocide. U.S. Pat. No. 5,199,977 describes an antifouling paint containing a polymeric metal containing hybrid salt and certain enumerated organic ligands.
Observations have been made that certain sea creatures are associated with bioactive compounds. Attempts have been made to determine whether specific sponges are associated with compounds that have antimicrobial activity. Thompson et al., Marine Biology 88, 11-21 (1985), describe screening and bioassays for biologically active substances from sponge species near California, USA. Various extracts and metabolites are described as being biologically active but none of the substances was active in all assays.
A preemptive antifouling composition is needed for treating surfaces in aquatic environments which is highly effective and (1) does not contain heavy metals or synthetic toxins that adversely affect the local ecology, (2) is easy to manufacture and incorporate into or on undersea structures, (3) is easily cleaned and (4) has a prolonged effective lifetime. The benefits associated with such a composition would be enormous.

Aquatic antifouling compositions and methods

The Research Foundation of State University of New York


A method is provided for fabricating an avalanche photodiode (APD) device, in particular, a separate absorption charge multiplication (SACM) APD device. The method includes forming a first contact region and a second contact region in a semiconductor layer. Further, the method includes forming a first mask layer above at least a first contact region of the semiconductor layer adjacent to the first contact region, and forming a second mask layer above and laterally overlapping the first mask layer. Thereby, a mask window is defined by the first mask layer and the second mask layer, and the first mask layer and/or the second mask layer are formed above a second contact region of the semiconductor layer adjacent to the second contact region. Further, the method includes forming a charge region in the semiconductor layer through the mask window, wherein the charge region is formed between the first contact region and the second contact region, and comprises forming an absorption region on the first contact region using the first mask layer. An APD fabricated by the disclosed method is also provided.

In the above-given technical field of APD devices (e.g., photodetectors) for optical communication, light sensing or quantum communication, a receiver sensitivity and operating data rates are crucial requirements for performance, as they determine the power consumption of the optical communication link. APD devices have great potential to enable these requirements.
Conventional APD devices are typically realized in two device architectures. The first device architecture is a standard pin form, which is also referred to as pin-APD device. The second device architecture is a p+/i/p−/i/n+ form, which is also referred to as SACM APD device. In the standard pin APD devices, a light absorption and a multiplication of carriers due to the avalanche effect occur in an intrinsic region of the diode. However, in SACM APD devices, an absorption region and a multiplication region of the diode are separated by a charge region (e.g., the p− doped region of a p+/p−/n+ diode). While standard pin APD devices have the potential for low operating voltages, the SACM APD devices have a higher sensitivity and can operate at higher speeds. Thus, the SACM APD devices can be more attractive for optical interconnections, optical communication, local optical quantum computing, quantum communication, terahertz communication, terahertz imaging, sensing, etc.
SACM APD devices can work efficiently if the absorption region and the multiplication region are separated by the charge region (also referred to as field control region or layer). In a SACM APD device, light is absorbed in the absorption region, and an electric field due to a reverse bias separates photo-generated carriers, with electrons moving to the multiplication region. The high reverse bias also allows for an avalanche of the carriers in the multiplication region. The charge region controls/balances the electrical fields in the absorption region and the multiplication region, respectively, and thus protects the typically low-bandgap semiconductor material (e.g., Ge) in the absorption region from high electrical fields needed in the multiplication region.
Thereby, the doping level and the width of the charge region can play a crucial role in balancing the electric field between the absorption region and the multiplication region. Thus, controlling the doping level and thickness of the charge region can be critical for the overall behavior of the SACM APD device.
Conventionally, SACM APD devices are realized in a vertical formation, which either requires dedicated epitaxially grown stacks or contacts on the absorption region. Such vertical SACM APD devices with dedicated epitaxially grown stacks have the benefit of controlling the doping layer and the thickness of the charge region with very good precision. However, integration of the epitaxially grown stacks into an existing silicon photonics platform can be challenging, due to the epitaxy complexity. Further, the vertical device designs also require contacting schemes on the absorption region, which can be a yield issue. Moreover, the epitaxially grown stacks can restrict the freedom in designing the devices, as every design generally requires a dedicated epitaxy study and epitaxy split.
Therefore, there is need for different SACM APD device designs.

Method for fabricating an avalanche photodiode device


The present invention provides a method of measuring a glycated protein in a sample using a redox reaction, by which the glycated protein can be measured accurately with high sensitivity. In order to remove a glycated amino acid present in the sample other than the glycated protein, the glycated amino acid is degraded in advance by causing a fructosyl amino acid oxidase to act thereon, and thereafter, a fructosyl amino acid oxidase is caused to act on the glycated protein in the presence of a tetrazolium compound and sodium azide to cause a redox reaction. The amount of the glycated protein is determined by measuring the redox reaction. As the glycated protein, glycated hemoglobin is preferable.

Among various glycated proteins, glycated hemoglobin (glycated Hb) in blood serves as an important indicator in the diagnosis, treatment, etc. of diabetes, because it reflects the patient's past history of blood glucose levels.
Measurement of such glycated Hb has been carried out, for example, by high performance liquid chromatography (HPLC), a minicolumn method, an immunoassay, a dye method, or the like. According to these methods, the ratio of glycated Hb to total Hb or the amount of glycated Hb can be determined. However, the above-described HPLC has a problem in that, for example, it requires a dedicated apparatus for measuring glycated Hb, and the immunoassay and the dye method have problems in that, for example, cells used for measurement might be contaminated and the measurement sensitivity might not be sufficient.
On this account, measurement of a glycated protein such as glycated Hb using a redox reaction caused by an enzyme has been utilized in applications such as biochemical analyses and clinical tests, because it can be carried out easily without using a special measuring apparatus.
Such measurement of glycated Hb using a redox reaction is carried out, for example, in the following manner. First, a sample containing glycated Hb is treated with a fructosyl amino acid oxidase (hereinafter referred to as "FAOD") so that the FAOD acts on a glycation site of the glycated Hb, thereby causing hydrogen peroxide to be formed. The amount of the hydrogen peroxide corresponds to the amount of the glycated Hb. Subsequently, to the sample treated with the FAOD, a peroxidase (hereinafter referred to as "POD") and a reducing agent are added so that a redox reaction occurs between the hydrogen peroxide and the reducing agent with the POD as a catalyst. At this time, when a reducing agent that develops color when it is oxidized is used, the amount of the hydrogen peroxide can be determined by measuring the color developed. As a result, the amount of the glycated Hb in the sample can be determined.

Method of quantifying glycosylated protein using redox reaction and quantification kit


A method for displaying a desktop display surface. The method includes creating a render target surface having substantially the same dimensions as a desktop display surface, casting the desktop display surface as a texture, and setting the render target surface as a scanout read location. The method further includes creating a two dimensional rectangular object, rendering the two dimensional rectangular object by mapping the desktop display surface texture to the two dimensional rectangular object, storing the rendered two dimensional rectangular object to the render target surface and scanning out the rendered two dimensional rectangular object from the render target surface.

1. Field of the Invention
Embodiments of the present invention generally relate to a method for displaying an image, and more particularly, to a method for displaying a scalable image.
2. Description of the Related Art
Many computer programs provide a feature for zooming in and out of an image. Examples of such computer programs include Adobe Acrobat, MapQuest, Microsoft Word and many others. When a user wants to see a larger version of the image displayed on a computer screen, the user simply selects a scale up or zooming feature. Likewise, when the user wants to reduce the image, the user simply selects a scale down feature. However, this scale up and scale down feature are limited to the specific application or program.
Therefore, a need exists in the art for a method of scaling up or scaling down an image without being limited to any specific application.


A velocity-controlled elevator drive including an a.c. motor (28) driving elevator machinery regulated by means of a frequency converter (26) supplying the motor (28) with a controlled frequency and voltage. The load condition of the elevator is measured by means of a load weighing device (32) in the elevator car. A power limit (P.sub.A) is input to the elevator machinery as a reference value and the speed reference (38) given to the frequency converter is determined on the basis of the power limit (P.sub.A) and the load condition.

The present invention relates to a procedure for regulating a velocity-controlled elevator drive in which an a.c. motor driving the elevator machinery is controlled by a frequency converter feeding the motor with a controlled frequency and voltage, said elevator drive being provided with devices detecting the load condition of the elevator.
An objective in the control of an elevator in a normal situation is to drive the elevator in such a way that, each time the elevator is operated, it will run through the distance between the starting floor and the target floor as fast as possible. Therefore, the elevator motor is generally so controlled that the acceleration, deceleration and speed of the elevator are in all circumstances as high as the machinery permits without causing inconvenience to passengers. For the control, it is required that the electric network supplying the elevator drive should produce sufficient power in all situations during elevator operation. In normal use, this is generally no problem.
When a disturbance occurs in the supply of power, the elevator will not work in the intended manner. To cope with power failures, elevators are provided with safety equipment enabling the elevator cars to be driven to landings. A longer break in the supply of electricity requires the connection of a reserve power system, which is generally designed to keep about one in four elevators available for use by passengers. In this case, the transport capacity of the elevators is dramatically reduced.
Disturbances may appear in the supply of electric energy even if no actual power failure occurs. The voltage in the electric supply network may fall below the nominal value or the frequency variations may exceed the allowed limits. In such cases, the protective devices used in the electric network and by the consumers of electricity are generally activated when certain preset limit values are reached. In elevator drives, such situations may occur in areas where the electricity distribution network is weak and also during construction when power is supplied by a temporary electricity supply system insufficient in capacity. When the voltage in the network falls, the load capacity of the network is generally reduced, so that a load of normal magnitude will cause an overload on the network, resulting in a further fall in the voltage, activation of protective equipment and break-off of power.
From patent specification U.S. Pat. No. 5,229,558, Kone Elevator GmbH, a solution is known in which the elevator is driven at a lower speed and/or acceleration when the supply voltage falls, correspondingly reducing the power requirement. However, this specification does not take the real power need of the elevator into account, but the transport capacity, i.e. the travelling speed of the elevator is reduced on-the basis of the condition of the electric network.


Disclosed herein is a reed affixing device for a wind instrument. The device includes a puller means disposed on an upper portion of the mouthpiece in a longitudinal direction thereof and having a puller, with hollow portions formed in the puller in the longitudinal direction of the mouthpiece. A string-shaped cord passes through the hollow portions in the form of a unidirectional spiral from a side of the puller to wind around the reed and the mouthpiece at several times, and is secured to first and last hollow portions formed, respectively, in both ends of the puller. An affixing means is fastened to a side of the puller means to secure the reed to the mouthpiece. A pair of sound adjusting members is provided on opposite sides of the reed to be in close contact with the cord that is wound several times, thus adjusting a tone of sound.

1. Field of the Invention
The present invention relates to reed affixing devices for wind instruments, and, more particularly, to a reed affixing device for a wind instrument, which is intended to secure a reed to a mouthpiece of a wind instrument, such as a saxophone or a clarinet.
2. Description of the Related Art
Generally, a reed is coupled to a mouthpiece of a wind instrument, such as a saxophone or a clarinet, to produce the sound of the instrument via vibrations. There are various kinds of reeds classified according to the thickness or material thereof. Further, the reeds may make various tones. Thus, different kinds of reeds are used according to the style of music; for example, classical music, jazz or pop.
A player needs bright or dark sounds according to his or her preference or the characteristics of the music being played. To this end, the player selectively uses a thick reed for producing a dark sound or a thin reed for producing a bright sound. However, although the reed is selectively used as such, this method imposes limits upon the production of tones such that only one type of music can be played using a certain thickness of reed.
Further, the existing mouthpiece has various sizes. However, a cord of a ligature, which is currently used to secure the reed to the mouthpiece, has a length suitable for a specific mouthpiece. Since the length of the cord of the ligature which is currently available is limited, the ligature may be applied only to a specific kind of mouthpiece.
Moreover, the existing mouthpiece has various angles. Thus, there is required a ligature, which is configured to secure the reed to the mouthpiece of various angles in an accurate position and posture.
U.S. Pat. No. 5,648,623 discloses a ligature for woodwind instruments, which is intended to secure a reed to a mouthpiece of a wind instrument. In other words, the ligature for the woodwind instrument is configured to secure the reed to the mouthpiece using a cord.
However, the cited reference lacks a tone control function, which is capable of changing the tone between bright and dark, as necessary. Further, the cited reference is problematic in that there is no additional function of adjusting the length of the cord according to the size of the mouthpiece; therefore the ligature may be employed on only a very limited range of mouthpieces. Further, the cited reference is problematic in that it has no additional position control structure for securing the reed to mouthpieces of various angles in an accurate position and posture; consequently, the ligature may secure the reed to the mouthpiece in inaccurate position and posture if the mouthpiece has a large angle, thus causing inconvenience to a player.

Reed affixing device for wind instruments


Computer-based detection of damage on machine components, such as misalignments and mechanical damage on bearings and clutches, is achieved using mathematical linkage of the temperatures of selected regions of thermography pictures. Photographs from the visible spectral range can be consulted in the computed-based detection.

1. Field of the Invention
The invention relates to a method and a system which is used for detection of misalignment and for prediction of faults on rotating machines and their components by means of thermography.
2. Description of Related Art
Various methods are known for predicting faults on rotating machines and their components, such as bearings, and the alignment of motors. Simplest is visual inspection in which obvious damages are sought. These damages are the emergence of oil or lubricating grease or visible leaks. In visual inspection fill levels of storage tanks, but also the accumulation of material in filters are also monitored.
Vibration analysis was developed from acoustic inspections which are carried out in part with a stethoscope. In doing so, vibration signals are recorded with microphones or accelerometers. Mostly piezosensors which are also made as MEMS modules are used nowadays as accelerometers. A signal for vibration rate or displacement can be obtained from the acceleration signal of the accelerometer by single or double integration. Thus, the original frequency range of the acoustic inspections is expanded from what is audible to ultrasound. Moreover, mathematical and digital methods can be used by further electronic processing in the evaluation of the data of vibration measurement, such as, for example, Fourier analysis.
Another method is oil analysis. While this method is relatively revealing, it is associated with high cost because, on the one hand, an oil sample must be taken, and on the other, the samples must be sent to a laboratory; this entails great time expenditure.
Another method which is being increasingly used in practice is thermography. Here, a picture of a machine component of interest is taken with an infrared camera. Often, photographs in the visible spectral range are superimposed on these pictures; the photographs have been taken from a similar or the same perspective, for example, the infrared camera and the camera for the visible spectral range being integrated in a housing. Thus, U.S. Pat. No. 7,809,258 describes such a camera with a technique for superimposing pictures from the visible and infrared spectral range. The evaluation of the photographs is reserved to the human observer who is often limited to finding especially striking temperature values in the infrared picture. This method is helpful to quickly locate, for example, a bearing which has run hot or a clutch which has become hot due to misalignment, and to initiate corrective measures. This location-finding of components which have become hot, however, is only possible when a human observer correctly determines the component which has become hot in the infrared picture. Thus, U.S. Pat. No. 7,706,596 mentions (in column 5 in lines 54-60) that it is necessary that an observer must have certain skills for the evaluation of infrared pictures.
Approaches to machine evaluation of infrared pictures are described in U.S. Pat. No. 7,528,372. There, the superposition of infrared pictures and photographs in the visible spectral range is mentioned. A comparison of thermography photographs which is carried out with computers is, in general terms, described as a "thermal performance algorithm". Little is given concerning the specific execution of these algorithms.
These algorithms can be applied to thermography photographs which have been taken at long time intervals, such as, for example, a picture of a new machine and a picture of the same machine after it has been in operation for a long period of time. Changing ambient conditions, such as the temperature in the factory hall in which the machine has been set up, engender problems in discovering these algorithms. Other problems are changes of operating conditions which are due to different operating states of the machine and also to the temperature of the medium to be conveyed changing in a pump which is driven by a motor, for example.
It is often possible to manage with artificially induced full load of a machine system which is to be assessed when the system has been subjected to initial start-up or maintenance and then to take a thermography picture. To check the machine at a later time, again full load is artificially produced and a thermography picture is taken. These two thermography pictures are then compared by experienced evaluators. This method is expensive and of little reliability due to the artificial inducement of the full load and the limited availability of experienced evaluators. It depends on the experience and ability of the evaluator whether and to what extent parameters, such as, for example, the ambient temperature or the amount and/or the temperature of a conveyed medium are correctly taken into account.

Method and system for predicting errors on components of rotating machines by thermography


A description is given of a one-component tissue adhesive containing, in aqueous solution, fibrinogen, F XIII, a thrombin inhibitor, prothrombin factors, calcium ions and, where appropriate, a plasmin inhibitor and of a process for the production thereof.

The invention relates to a tissue adhesive which contains fibrinogen, factor XIII, a thrombin inhibitor, prothrombin factors, calcium ions and, where appropriate, a plasmin inhibitor. The accelerators which are naturally present on the wound which is to be bonded result in the thrombin which is necessary for adhesion being liberated from the prothrombin in the adhesive.
The physiological processes involved in the repair of lesions in human or animal tissues result in fibrin being deposited in the region of the injury. This is initiated by thromboplastin flowing out of the injured cells and, on contact with plasma factor VII forming factor X activator which then, together with factor V and in a complex with phospholipids and calcium, converts prothrombin into thrombin. The action of thrombin in turn results, via elimination of the fibrinopeptides A and B from fibrinogen, in fibrin monomers which aggregate to form fibrin filaments which are covalently cross-linked, with the formation of isopeptide bonds by F XIIIa, a transglutaminase which is likewise activated by thrombin. An inhibitor, namely alpha2-antiplasmin, is bound by factor XIII onto the fibrin filaments and protects them from degradation by plasmin.
It is evident from this process of hemostasis and wound healing that, in addition to fibrinogen as substrate, two enzymes are required: thrombin and factor XIII.
The task of thrombin in this connection is to activate both fibrinogen and factor XIII, that is to say to convert them into their reactive form. This is the fibrin monomer in the case of fibrinogen, and is the catalytically active transglutaminase (F XIIIa) in the case of factor XIII.
European Patent 0,068,047 discloses an enriched plasma fraction which is suitable as a wound closure and contains fibrinogen, a fibrinolysis inhibitor and thrombin or prothrombin in an anhydrous system. This adhesive cannot be applied dissolved in water, but can be applied only as a powder, which is a disadvantage for use. When the mixture is dissolved in water, the components react together, and a clot is produced.
For a one-component adhesive with water as solvent it is difficult to combine the active substances in such a way and in such quantitative ratios that no premature and undesired activation takes place during the production of the adhesive, the reconstitution with a solvent and the maintenance in readiness for use and, on the other hand, a sufficiently high strength is achieved relatively quickly after application to the adhesion site.
Surprisingly, conditions allowing reproducible production of a one-component adhesive, which can be manipulated in practice, in a physiological medium have been found.
The requirements for a one-component adhesive of this type to be produced and be amenable to processing are that the relative concentrations of fibrinogen, plasmin inhibitor, F XIII, prothrombin concentrate, thrombin inhibitor and calcium ions are optimized. This particularly applies to AT III as thrombin inhibitor and to calcium ions, since the calcium ions are essential for activation of the coagulation factors. High concentrations increase the rate of thrombin formation, and Low concentrations slow it down. Hence it is necessary that the concentration of calcium ions is optimal. Since, when this is the case, the formation of thrombin cannot be ruled out, it is expedient to combine with a thrombin inhibitor, preferably AT III. This is because, on the one hand, the formation of thrombin must be ruled out during the production of the adhesive and, on the other hand, the adhesive must rapidly form a stable clot when coagulation, that is to say the deposition of a fibrin film, is initiated on contact with wound surfaces. AccordingLy, the production of a thrombin-containing one-component adhesive and its use in aqueous solution is inconceivable and, moreover, it is possible to use prothrombin only under conditions which prevent activation to thrombin during production and preparation for use. These include setting up defined concentrations of thrombin inhibitor and calcium ions.
Thus the invention relates to a tissue adhesive containing in aqueous solution fibrinogen, F XIII, a thrombin inhibitor, prothrombin factors, calcium ions and, where appropriate, a plasmin inhibitor.
It was surprising that it is possible to pack, and use as tissue adhesive, fibrinogen together with prothrombin as a so-called hypercoagulable solution which, moreover, also contains calcium ions and AT III.
An adhesive of this type according to the invention can be converted into a solid form, for example freeze-dried, and reconstituted with water. It can contain all the active substances in pasteurized form, and is then free of the risk of transmission of hepatitis and HTLV III.
The mixing ratio of the active substances fibrinogen, plasmin inhibitor, F XIII, prothrombin factors, calcium ions and AT III is such that no premature activation takes place and such that, however, the mixture spontaneously coagulates, and deposits fibrin, on contact with wound surfaces.
The time in which this takes place is consistent with clinical requirements. The one-component adhesive according to the invention does not differ in its action from the two-component systems of the state of the art.
The mixture of active substances in this adhesive is such that, in the solution for use, the concentration of fibrinogen is 70-90 mg/ml and that of the prothrombin factors is between 10 and 30 U/ml based on F II. The concentration of calcium ions, some of which are protein-bound in the adhesive, is intended to be 0.5-1 mmol/l in the solution for use. Examples of thrombin inhibitors are AT III, hirudin and heparin, and AT III is preferably used in a concentration of 0.1-1 U/ml of tissue adhesive; at this concentration it prevents, at the abovementioned concentrations of prothrombin factors and calcium ions, premature fibrin formation. On the other hand, however, it is possible to favor the latter when this appears desirable on the basis of the indication. For this purpose, it is possible to dissolve the freeze-dried adhesive in a higher final concentration of calcium ions than 0.5-1 mmol/l. However, rapid use after reconstitution is then necessary.
To produce the adhesive, the active substances are initially produced in soluble form having the highest possible activity and, where appropriate, having been pasteurized. The fibrinogen concentration should be as high as possible, since the strength of adhesion increases with increasing concentration. The fibrinogen can, for example, be produced and pasteurized as described in European Patent 0,103,196, and given the desired solubility by additives of the type of compound containing urea or guanidine residues as described in European Patent 0,085,923. Factor XIII can be pasteurized as described in European Patent 0,018,561, and the prothrombin factors can be pasteurized as described in European Patent 0,056,629.
The active substances in the preferred adhesive according to the invention in principle comprise human fibrinogen in the highest possible concentration, enriched with factor XIII and the factors of the prothrombin complex (factor II, VII, IX and X), calcium ions and antithrombin III. The tissue adhesive also contains an inhibitor which inhibits plasminogen activators and/or plasmin and thus protects the resulting fibrin from degradation by plasmin. This inhibitor may be in the form of a concomitant substance of the fibrinogen selected for the bonding, but is preferably added to the adhesive in the form of aprotinin. To improve the reconstitution of the tissue adhesive after freeze-drying, it is possible for the latter to contain albumin and/or substances which contain the urea or guanidine residue and also contain, where appropriate, an amino acid with a hydrophobic side-chain or a water-soluble fatty acid and, in addition, heparin.
The fibrinogen which is suitable and preferred for preparation of the tissue adhesive is purified and already contains factor XIII. However, apart from this, also suitable is cryoprecipitate which, experience has shown, contains alpha2-antiplasmin and human albumin in addition to factor XIII. It is also possible, however, to produce an adhesive of comparable action by mixing the individual components, namely: human fibrinogen, factor XIII (from plasma or placenta), plasmin inhibitors, prothrombin factors (factor II, VII, IX and X), albumin, AT III and calcium ions, a compound with a urea or guanidine residue, or an amino acid with a hydrophobic side-chain or a water-soluble fatty acid.
The mixture of the active compounds for the adhesive is advantageously in the form of a solid, preferably a lyophilizate.
The tissue adhesive preferably contains the following quantities of active compounds, which are pasteurized where appropriate, based on 1 ml of solution for use:
65-115, preferably 70-90, mg of highly purified human fibrinogen
40-80 U of factor XIII
1-50, preferably 10-30, IU of PPSB (prothrombin factors) based on F II (prothrombin)
0-10,000 KIU of aprotinin
0.01-50, preferably 0.1-1, IU of antithrombin III
0-5 USP U heparin and
0.1-5, preferably 0.5-1 mmol/lofcalcium ions, preferably as calcium chloride.
The adhesive can contain, for example glutamate, L-iso-leucine, L-arginine or human albumin as stabilizers and solubilizers.
The mixture of the solid active compounds of the tissue adhesive can be dissolved in water, or in a solvent containing calcium ions, in a short time at 20xc2x0 C. When applied to the tissue which is to be united or bonded the adhesive develops within a sufficiently short time a high bonding strength without thrombin being necessary as a second component.
Accordingly, it is possible to apply the adhesive in liquid form using a single syringe, so that preparation, manipulation and use are straightforward. The adhesive is tolerated and is completely absorbed.
This one-component adhesive does not differ, either in the bonding time or in the rupture strength, from a two-component adhesive, as has been found in bonding tests in the model of puncture wounds of the rat skin and in the bonding of small intestinal anastomoses in hogs. It is even possible to increase the bonding strength by choosing an optimal calcium ion concentration of the solution which is used to dissolve the freeze-dried active compounds.
The examples which follow are intended to illustrate the invention.

One-component tissue adhesive and a process for the production thereof

Abstract: This adhesive can be reconstituted from a freeze-dried form with water. It can contain aLL active substances in pasteurized form and is then free of the risk of transmission of hepatitis and HTLV III.


Multilayer thin-film electronics are manufactured at high speed, even while the various component functions are manufactured separately under conditions tailored to optimize component performance and yield. Each function or group of functions is fabricated on a separate flexible substrate. These flexible substrates are bonded to each other using adhesive films that are anisotropic electrical conductors or optical light guides. The bonding is performed by laminating the flexible substrates to each other in a continuous process, using the anisotropic conductor as the bonding layer.

1. Field of the Invention
This invention relates to large-area electronics and to methods for manufacturing thin film electronics continuously on separate carrier substrate foils, and then to combining these foils using anisotropic electrical conductors or light guides.
2. Related Art
In the field of thin film electronics where two or more layers of active circuits are employed, many technologies exist for connection of separate planes of passive circuits. One of these technologies is multilevel metallization on top of integrated silicon circuits, for which several levels of metal lines are built up by alternating between the fabrication of metal patterns, the deposition of insulators, the opening of vertical connections, followed by the fabrication of the next level of metal pattern, etc. Another of these technologies is multilevel printed wire boards (PWBs), for which passive metal connections are deposited on epoxy-based or ceramic boards that are fabricated with openings to make vertical connections. Individual boards are bonded to each other to form multilevel PWBs by bonding techniques that depend on the material of the board. These techniques are used industrially.
However, there are drawbacks associated with these existing techniques.

Multilayer, thin-film electronic devices


A coupler 10 consists of a length of cross-linked polyethylene pipe having a spiral groove 16 cut in its outer surface and another spiral groove cut in its inner surface. A heating element 18 is wound in the groove. The coupler is expanded mechanically so as to have an easy fit over the ends of polyethylene pipes 12, 14. The heater element 18 is energized and the coupler shrinks and forms fusion welded joints between itself and the pipes. No preparation of the pipe ends is necessary because the serrated inner surface cuts through the oxidized skin and bonds to material beneath the skin. The coupler is especially advantageous in large sizes of 500 mm or above. Instead of an electric heater, radiant energy, e.g. infra red or light is used to heat the coupler. For example, an array of reflector lamps can be used circumferentially located around the coupler.

The invention relates to polyolefin couplers for Joining polyolefin pipes; and to a method of joining such pipes.
Known couplers are widely used for joining pipes of up to 355 mm. Such couplers are of the socket type and have integral heating elements. The heating element melts the inside surface of the coupler and the opposed surfaces of the pipes. The opposed surfaces are generally spaced apart no more than 1-2 mm in the case of smaller couplers but the 355 mm size demands hydraulic fitting of the coupler and pipes. The gap in that case is virtually zero. The molten surfaces merge together and a welded joint is formed between each pipe and the coupler.
The object of the invention is to provide a coupler which can be used to join pipes especially, though not exclusively, pipes of large diameter, for example pipes of 500 mm or larger.
It has been proposed in U.S. Pat. No. 4,775,501 (Raychem Corporation) and in European Patent No. 0197759 (Raychem Corporation) to join polyethylene pipes by a coupler composed of cross-linked polymer containing a particulate conductive filler. The coupler was expanded below its melting point (120.degree. C.). The coupler was recovered to join the pipes by passing a current through the coupler so as to heat it and shrink the coupler onto the pipes. The coupler and the pipes were joined by a fusion joint.
In the two examples quoted in U.S. Pat. No. 4,775,501, the polyethylene pipes had an outside diameter of 0.84 inch (21 mm). The coupler reached its shrinkage temperature in about 30-45 seconds and current was passed into the coupler for a further 1 minute.
The pipe end portions are shown as having shrunk and the end surfaces of the pipes appear to have melted. The result is a considerable reduction in the diameter of the through bore of the pipes.
In the sole example in EP 0197759 the pipes had an outside diameter of 21.3 mm and a wall thickness of 2.8 mm. The heating conditions were as in U.S. Pat. No. 4,775,501. No illustration is given in EP 0197759.
The couplers mentioned in the Raychem patents have to be electrically conductive and to achieve this they are made from a material containing carbon particles in such a concentration that they create on electrically conductive path. It is known that such high loadings of carbon particles can cause a deterioration in desirable mechanical properties of the base polymer.

Polyolefin coupler for joining polyolefin pipes


The present invention provides a novel ester cleavage process for use with .beta.-lactams. The process is useful because of mild conditions necessary to complete the reaction, such conditions being especially suitable for .beta.-lactams.

This invention belongs to the field of organic chemistry and the synthesis of antibiotics. The invention provides a method for the removal of a carboxy-protecting group from cephalosporin, carbacephalosporin, penicillin and azetidin-2 one carboxylic acids using mild conditions. The carboxy group is desirably protected during the preparation of these compounds to block or prevent the otherwise reactive acidic carboxy group from participating in reactions that are in competition with a desired reaction at another site in the molecule. The esters are convenient and economical to handle in chemical processing but must eventually be removed because the compounds are used as antibiotics in either the acid or salt form. The ability to remove the carboxy-protecting group under mild conditions is useful because of the sensitivity of these .beta.-lactam compounds to heat, acidity and basicity.
The preparation of cephalosporins is taught broadly by Chauvette, U.S. Pat. No. 4,064,343. The preparation of 1-carbacephalosporins is taught broadly by Christensen, et al., in U.S. Pat. No. 4,226,866 and Munroe, in U.S. Pat. No. 4,791,106. The preparation of penicillins is taught by J. C. Sheehan and G. D. Laubach, (1951) J. Am. Chem. Soc., 73: 4376; J. C. Sheehan and E. J. Corey, (1951), J. Am. Chem. Soc., 73: 4756; J. C. Sheehan and G. D. Laubach, (1951), J. Am. Chem. Soc., 73: 4752. The preparation of azetidin-2-ones is taught broadly in Evans, et al. in U.S. Pat. No. 4,665,171.

Ester cleavage process for use with .beta.-lactams