A system for encoding video data calculates a need parameter for an encoder and then adds a predetermined need bias value to the need parameter. The bias value is added without first determining video source complexity. The system then determines whether the input video comprises static video. Thereafter, the need parameter bias value is scaled in response to a determination that the input video includes the static video.

Multiple programs are known to be encoded and sent over a common channel having a fixed limited bandwidth using a technique known as statistical multiplexing. Statistical multiplexing is a type of communication link sharing in which a communication channel is typically divided into an arbitrary number of digital channels or data streams. The multiple programs may be statistically multiplexed using a multiplexer (often referred to as a STAT MUX), a rate controller and a plurality of encoders. The communication channel is known to have a bandwidth limitation. Because the multiple programs often have a variable bit rate (VBR) and the communication channel has a bandwidth limitation, bit distribution over the multiple programs is known to be problematic.
In typical operation, the transmission bit rates for each of the encoders is a delayed version of the encoding bit rates for the same encoder by a predetermined delay. The predetermined delay may be, for instance, 1.5 seconds and is an initial delay from an encoding time (a current program clock reference (PCR)) to a decoding time (the decode time stamp (DTS) of the first encoding frame). This predetermined delay is known as a system delay.
The multiplexer may change transmission bit rates upon requests from the encoders through a minimum bit rate request and a maximum bit rate request. The minimum bit rate request informs a rate controller of a lowest rate at which video may be sent that allows receipt of complete frames at a decoder prior to decoding. The maximum bit rate informs the rate controller of a highest rate at which video may be sent to the decoder. The encoders retain all encoding bit rates received in the past predetermined delay and uses this information to calculate a target frame size and an initial quantization parameter (QP) level for each frame to be encoded. As soon as an encoder finishes encoding a frame, the encoder updates a current need parameter. The encoders also use a current transmission bit rate to regulate the amount of bits transferred to the multiplexer and update the minimum bit rate request and the maximum bit rate request at each interrupt. An interrupt is triggered as soon as a bit rate information message arrives at the encoder.
Each encoder calculates the need parameter based on the complexities of past encoded frames and look-ahead activities of the incoming frames. The complexity of a past encoded frame is defined by the product of the bits used for this frame and the average quantizer for this frame. The multiplexer allocates more bits (bandwidth) for the encoders having video input of higher complexity while maintaining the constant group bandwidth in an effort to keep all the encoders running at the same QP level.
In order to keep all encoders running at the same perceptible quality levels (not necessary the same QP levels), the encoders are known to add a need parameter bias to the need parameter. The need parameter bias is a perceptibly determined constant across all encoders with video input of motion pictures. With the constant need parameter bias, the encoders having video input of lower complexity run at lower QP levels that mitigate the compression artifacts. Although the encoders having video input of higher complexity may run at higher QP levels, the compression artifacts are obscured somewhat by the high video complexity.
Although the constant need parameter bias scheme works as expected when all the encoders have dynamic video input, whenever any of the encoders has static video input (video that is stable and has low complexity), such as a slate, the encoder cannot produce enough bits to fill the allocated bit rate. The unused bandwidth is thus wasted.


A card connector device whose structure is simple and which can hold plural types of cards of different widths. A plate-spring-shaped card position control unit is formed on the top of a case by partially cutting off a part of the case. The tip of the card position control unit is folded and protrudes from the case by a prescribed distance toward the bottom of the case.

1. Field of the Invention
The present invention relates to a card connector device used in a personal computer or the like.
2. Description of the Related Art
PCI cards, such as a memory card used in a personal computer, a LAN card and the like are known. Because PCI cards have a variety of widths, in order to insert such PCI cards in one slot, the positional relationship between an electrode on the card side and am electrode on the card connector side must be constant against such cards of a variety of sizes.
Patent reference 1 discloses a plate spring which can be moved to absorb the width differences of the cards and which is provided on each side of the case so that two types of PCI cards with different sizes can be inserted in the same slot.
Patent reference 2 discloses a structure which is provided with a card guiding member which can be pulled out and back in such a way as to narrow the width of a card insertion slot and a card of a different size is guided to a card mounting unit by adjusting the side position by the card guiding member.
Against a PCI card for transferring data in parallel, using a PCI bus, an EXPRESS card for transferring data serially is also known. The EXPRESS card also has a plurality of widths.
The EXPRESS card has two standard widths of 54 mm and 34 mm. The slot size of an EXPRESS-card connector device is designed to be wide so that EXPRESS cards of different sizes can be inserted in the same slot. When a narrow card is inserted, a space of approximately 20 mm occurs in the card connector part corresponding to the side of the inserted EXPRESS card and the side of the EXPRESS card cannot be supported. Therefore, when a side force is repeatedly applied to the tip (part protruding from the slot) of the EXPRESS card, the card moves in the card connector and it finally comes out of the connector.
In order to solve such a problem, Patent references 1 and 2 can be adopted, However, in either case, the structure of a card connector device becomes complex.
Patent reference 1: Japanese Patent Application No. 2004-63197
Patent reference 2: Japanese Patent Application No. 2004-71257


A touch substrate, including: a base substrate; a plurality of touch electrodes arranged in a touch area on the base substrate; a plurality of touch signal lines, a ground line, an antistatic member and an electrostatic protection component arranged in a peripheral area on the base substrate, the plurality of touch signal lines are respectively electrically connected to the plurality of touch electrodes, the ground line is located on a side of the plurality of touch signal lines away from the touch area, the antistatic member is located on a side of the ground line away from the touch area, an end of the electrostatic protection component away from the touch area is in contact with the antistatic member, and an orthographic projection of the electrostatic protection component on the base substrate covers an orthographic projection of each of the antistatic member and the ground line on the base substrate.

In a touch panel, a touch position is detected by intersecting transmitting (Tx) electrodes and receiving (Rx) electrodes in mutually orthogonal directions on a panel. With the development trend of narrow bezels of electronic apparatus, bezel sizes of touch display devices are also continuously reducing, which results in weakening of their antistatic ability.

Touch substrate and touch display device

CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.


A silver halide color photographic material comprising a reflective support having provided therein a blue-sensitive silver halide emulsion layer, a green-sensitive silver halide emulsion layer, a red-sensitive silver halide emulsion layer and plural light-insensitive layers, wherein the blue-sensitive silver halide emulsion layer contains a monodisperse silver halide emulsion and a yellow coupler represented by formula (I) defined below, and at least one light-insensitive layer which is positioned farther from the reflective support than the blue-sensitive silver halide emulsion layer is a hydrophilic colloid layer containing at least one hydrophobic compound represented by formula (II) defined below, and a relative refractive index of an organic phase containing the hydrophobic compound with the exception of a volatile organic solvent and an amphipathic solute to a hydrophilic polymer thin film which forms the light-insensitive layer is in a range from 0.9875 to 1.0125; wherein said yellow coupler is represented by formula (I) ##STR1## wherein R.sub.1 represents a halogen atom or an alkoxy group; R.sub.2 represents a hydrogen atom, a halogen atom, or an alkoxy group; A represents --NHCOR.sub.3, --NHSO.sub.2 R.sub.3, --SO.sub.2 NHR.sub.3, --COOR.sub.3 or ##STR2## each represents an alkyl group; and Y represents a group which is capable of being released upon a coupling reaction with an oxidation product of a developing agent and is connected to the coupling position through an oxygen atom or a nitrogen atom; and wherein said hydrophobic compound is represented by formula (II) ##STR3## wherein R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 each represents a hydrogen atom, a halogen atom, a nitro group, a hydroxy group, an alkyl group, an alkenyl group, an aryl group, an alkoxy group, an acyloxy group, an aryloxy group, an alkylthio group, an arylthio group, a mono- or di-alkylamino group, an acylamino group or a 5-membered or 6-membered heterocyclic group containing an oxygen atom or a nitrogen atom; or R.sub.8 and R.sub.9 are connected together to form a 5-membered or 6-membered aromatic carbon ring.. The silver halide color photographic material has sufficiently high color forming properties, particularly in the blue-sensitive emulsion layer thereof, is suitable for a rapid processing, and is excellent in processing stability.

In silver halide color photographic materials, a light-sensitive layer comprising three kinds of silver halide emulsion layers which have been selectively sensitized so as to have a sensitivity to blue color, green color and red color, respectively is applied in a multilayer construction onto a support. For example, in a so-called color printing paper (hereinafter referred to as "color paper"), a red-sensitive emulsion layer, a green-sensitive emulsion layer, and a blue-sensitive emulsion layer are provided usually in the order stated, from the side from which exposure to light is carried out, and a color mixing-preventing or ultraviolet light-absorptive interlayer or protective layer is provided between the respective light-sensitive layers.
In forming color photographic images, three photographic color couplers of yellow, magenta, and cyan are incorporated in light-sensitive layers and, after exposure to light, the resulting light-sensitive material is subjected to color development processing using a so-called color developing agent. Coupling reaction between an oxidation product of an aromatic primary amine and each coupler provides a colored dye. In such a case, it is required to provide a color density as high as possible within a restricted developing time.
In recent years, it has been requested in this field that after receipt of order, prints obtained by development processing can be promptly delivered to users. Therefore, a silver halide color photographic material which can be rapidly processed and is excellent in processing stability has been desired. In addition, it is naturally requested to provide color prints at a low cost.
With color paper, since the blue-sensitive silver halide emulsion layer is provided on the nearest position to the support as described above, developing speed of the layer is slowest. Accordingly, it is most important to improve developing properties of the blue sensitive silver halide emulsion layer in order to enable rapid processing.
For the purpose of obtaining a high color density, it is ordinarily investigated to employ a coupler having a coupling rate as fast as possible, to employ a silver halide emulsion which is readily developed and provides a large amount of developed silver per unit coating amount, and/or to utilize a color developing solution having a high developing speed.
Various techniques on silver halide color photographic materials capable of being rapidly processed have hitherto been known. For instance, there are (1) a technique to make silver halide grains fine as described in Japanese Patent Application (OPI) No. 77223/76 (the term "OPI" as used herein means an "unexamined published patent application"); (2) a technique to lower silver bromide in silver halide as described in Japanese Patent Application (OPI) No. 184142/83 and Japanese Patent Publication No. 18939/81; (3) a technique of adding a 1-aryl-3-pyrazolidone having the specific structure to a silver halide photographic material as described in Japanese Patent Application (OPI) No. 64339/81 and further a technique of adding a 1-aryl-3-pyrazolidone to a silver halide color photographic material as described in Japanese Patent Application (OPI) Nos. 144547/82, 50534/83, 50535/83 and 50536/83; and (4) a technique of using a color development accelerator, for example, such as those as described in U.S. Pat. Nos. 2,950,970, 2,515,147, 2,496,903, 4,038,075 and 4,119,462, British Patents 1,430,998 and 1,455,413, Japanese Patent Application (OPI) Nos. 15831/78, 62450/80, 62451/80, 62452/80 and 62453/80, Japanese Patent Publication Nos. 12422/76 and 49728/80, etc.
However, when technique (3) or (4) is employed, although the processing time is shortened, processing stability is poor in the rapid processing and a problem of fog occurs. Also, when a low silver bromide emulsion is used in accordance with technique (2), a problem of low processing stability occurs while a rapid processing can be performed. Further, in the case of using fine grain silver halide according to technique (1), the severe disadvantage of decrease in sensitivity is accompanied, in addition to a problem of low processing stability.
Resently, a technique using emulsion grains having an average particle size of 0.20 .mu.m to 0.55 .mu.m as silver halide in the blue-sensitive emulsion layer is proposed as described in Japanese Patent Application (OPI) Nos. 38944/86, 52644/86, 80253/86, 80254/86, 97655/86, 100751/86 and 153639/86, etc. However, there is a problem of remarkable decrease in sensitivity, though improved effects on a rapid processing property and processing stability are recognized.
Moreover, it is preferred to employ a coupler having a high coupling activity for the purpose of imparting a rapid processing property. However, there is a severe problem in that fog increases remarkably as the coupling activity of coupler increases.


A vented closure is provided in which a PTFE membrane layer comprises a vent for releasing accumulated gas pressure. The membrane is carried on a structural support which may vary from a fabric type backing to a porous plastic stem, the support permitting a variety of improved vent architecture to be utilized including vents with reduced material requirements, improved geometry, and better handling characteristics.

This invention is directed towards providing a self-venting cap for releasing vapor pressure from sealed containers. Pressure can accumulate in containers from a variety of causes including gas evolving chemical reactions, de-gassing of filled contents, foaming of contents from normal shipping and handling, temperature fluctuations, attitudinal changes, as well as abnormal conditions which may result from contamination or mishandling of the containers.
There is a particular demand for venting closures for retail containers of surfactants, cleaning products, and similar fluids which tend to generate vapor pressure. As pliable, plastic containers have become more popular with consumers, vapor pressure problems have become more numerous. Such problems include failed closures, container distortion which interferes with retail displays, and consumer distrust of misshapen (pressure distorted) containers. Packaging volumes are often less efficient as product head space, the unfilled volume, is increased to compensate for pressure fluctuations.
A variety of ventable caps and containers are known in the art. Several patents exist which provide for a gas-permeable, liquid-impermeable polytetrafluorethylene (PTFE) barrier for venting vapor pressure. One such patent is U.S. Pat. No. 3,951,293 to Schulz which is incorporated herein by reference and which discloses a liquid closure having one or more horizontal film layers of PTFE as a cap liner. The liner permits communication between the container vapor pressure and the external vapor pressure through a perforated cap or sealing diaphragm. While such a closure is suitable for many applications, it has been found unsuitable for some viscous liquids. Further, the prior art designs require generous use of the PTFE material to provide sufficient venting. Therefore, there is room for variation and improvement within the art.


Sabots for projectiles are provided. One sabot includes a body formed from at least one section, wherein the body is configured to surround a portion of a projectile. The sabot also includes one or more engagement portions configured to interface the body with another sabot such that the body is supported at an intermediate position of the projectile, and one or more surfaces configured to interface with an outer mold line of the projectile. The sabot further includes one or more surfaces configured to interface with an inner surface of a launch platform.

The present disclosure relates generally to sabots for projectiles, such as sabots for hypervelocity projectiles.
Sabots are devices that may be used when firing a projectile, such as when the projectile is smaller than the diameter of the bore from which the projectile is shot or launched, to maintain a position of the projectile within the bore. Some conventional sabot designs use high performance materials (e.g. titanium metal matrix composite). However, these designs interface with the projectile in a manner that is not efficient for these materials. Therefore, these designs have additional mass to handle the inefficiencies of the load path.
Additionally, because existing sabots are completed using composite or metallic designs, due to the length of a projectile, the existing designs of sabots fill the gun bore from the pusher plate (or armature) to near the nose of the projectile. As a result, materials must be used that can withstand the mass thereof, which include, for example, high grade metals or composite materials. These materials are rigid in nature and provide no cushion for the projectile during the launch event. Thus, conventional sabots are designed with thin inserts to provide low wear surface for the gun bore. The cost to produce these sabots is high due to the composite process or the cost of machining complex designs. Also, due to the length of the sabots and general volume the sabots are filling, the weight of the sabot can increase very quickly based on the caliber of the gun bore.


An apparatus and method of controlling a mobile terminal by detecting a face or an eye in an input image are provided. The method includes performing face recognition on an input image facing and being captured by an image input unit equipped on the front face of the mobile terminal; determining, based on the face recognition, user state information that includes whether a user exists, a direction of the user's face, a distance from the mobile terminal, and/or a position of the user's face; and performing a predetermined function of the mobile terminal according to the user state information. According to the method, functions of the mobile terminal may be controlled without direct inputs from the user.

1. Field of the Invention
The present invention relates generally to an image processing apparatus and method, and more particularly, to an apparatus and method of controlling a mobile terminal based on analysis of a user's face in an input image.
2. Description of the Related Art
Mobile terminals have increasingly expanded their services and additional functions, among which a camera function is considered a key function. To increase usefulness of the mobile terminal and satisfy different desires of users, combinations of the mobile terminal having a camera with their services and additional functions are required. As an example of the combinations, there is a technology to recognize faces from images inputted through the camera. The face recognition technology has been found to be very important in many application fields, such as expression studies, driver's drowsiness detection, or identification check.
Among the face recognition technologies, there is one method where three or more of features, such as a face, eyes, a mouth, a jaw, eye brows, a facial contour, etc., are identified in an image captured from the camera, a rotational direction of the image is determined with respect to a reference direction, and the image is displayed in the determined rotational direction. In addition, there is a technology to display information by recognizing the user's facial contour and positions of his/her eyes, jaw, and mouth, calculating a rotation angle of a line that links both eyes, and determining a display direction of the information. In this regard, the face recognition procedure requires detecting correct positions of many facial components or features in the image, such as the face, eyes, mouth, jaw, etc.
As such, since most conventional technologies are based on detection of the user's face together with at least one facial component, such as the eyes, mouth, jaw, etc., they may not obtain normal face recognition results nor correctly perform functions corresponding to the face recognition results from an image having a face being obscured by any other object or having only a part of the face being captured due to a particular viewing angle.
Furthermore, for a face recognition technology, a correct eye detection technique needs to be done for correct face recognition. However, conventional technologies only focus on detection of eye positions in a face image and do not consider the situation where the face detection has failed. Thus, a need exists for correctly detecting the eye positions even in the situation where the face detection has failed.
Furthermore, in order for a user to perform a desired operation of the mobile terminal, hardware interfaces, such as keypads or touchscreens have to be used. If it is possible for the mobile terminal to be controlled through eye detection without direct inputs from the user, it guarantees better quality of user experience.

Apparatus and method of controlling mobile terminal based on analysis of user's face


A hair styling iron A is provided comprising: a body 1 which includes a grip portion 4, a plate portion 6 including a heater H and a plate 8, and a fulcrum portion 5; and a sandwiching member 2 which includes a lever portion 15 opposed to said grip portion 4, a plate portion 17 equipped with a heater H and a plate 18 and opposed to the plate portion 6 of the body 1, and a fulcrum portion 16 located between the lever portion 15 and the plate portion 17 and pivotally supported by the fulcrum portion 16 of the body 1. Between the rearward portions of the fulcrum portions of the body 1 and the sandwiching member 2 is interposed a spring 12 which biases the plate portions 6 and 17 normally in the direction away from each other. Each of the plate portions 6 and 17 is provided with ridges 14 along the perimeter, and has been subjected to a flocking treatment from its perimeter to the outer surface.

1. Technical Background of the Invention
The present invention relates to a hair styling iron, and more specifically to a hair styling iron used for giving a press treatment in which the hair is exposed to heat and pressure.
2. Relating Prior Art
Up to now, for giving straight-perm treatment to the hair, the hair is applied with a first perming solution and then smoothed down with a comb on a plastic plate called a "panel" while stroking the hair with the back of the comb. Alternatively, the hair is smoothed down with a comb only, without the help of a panel. Either of these operations, generally called a "strainer operation", is aimed for providing uniform rearrangement of the cuticle up to the tip of the hair by smoothing down the hair, thereby giving the hair a glossy smooth surface. The use of a panel, however, causes substantial damage to the hair. On the contrary, the operation, when carried out using a comb only, fails to provide uniform rearrangement of the cuticle, thus suffering from uncertain finish.


A semiconductor integrated circuit device includes a control unit configured to control a switching element or an output transistor of a power supply device, a monitor terminal for monitoring an output voltage of the power supply device, a test unit configured to output a test signal to the monitor terminal before activation of the power supply device, and a determination unit configured to determine whether or not the monitor terminal is open, on the basis of a voltage of the monitor terminal when the test unit outputs the test signal to the monitor terminal.

The present disclosure relates to a semiconductor integrated circuit device.
Recent years have seen a growing demand for functional safety of components used in advanced driver assistance systems (ADASes) and the like mounted to vehicles. For example, functional safety of components can be realized by preventing malfunction of the components in the event of detection of anomaly thereof. Accordingly, anomaly detection techniques have recently been growing in importance.


A system for coupling to a vehicle and for causing actuation of a remote device via a control signal transmission includes a transmitter for causing the control signal transmission to the remote device. The system further includes a circuit configured to cause a back-up display to indicate status of the remote device in response to a status determination.

The present disclosure generally relates to the field of vehicles. The present disclosure relates more specifically relates to wireless control systems for a vehicle and a remote electronic system in communication with the vehicle.
Conventional systems for controlling appliances and remote devices, such as garage door openers, security gates, home alarms, and lighting systems, use individual remote controls to operate a respective appliance and/or device. With such a conventional system, it is difficult to control multiple remote devices, much less consolidate operation of the remote devices into a single, controllable system. For example, garage door opener mechanisms open and close a garage door in response to a radio frequency control signal. The control signal is typically generated and transmitted from a remote control that is sold with the garage opener. The control signal has a preset carrier frequency and control code such that the garage door opener mechanism is responsive only to the remote control issuing the associated control signal. A problem associated with this type of system is that the door opener must receive a specific predetermined control signal in order to be operated. That is, each appliance and device must receive a specific predetermined control signal. Therefore, a user wishing to control multiple devices is required to have multiple remote controls.
Communication systems currently exist which enable multiple appliances and devices to be controlled by a central or single remote device. One such system is HOMELINK®, owned by Johnson Controls, Inc., in which a trainable transceiver is able to "learn" characteristics of received control signals such that the trainable transceiver may subsequently generate and transmit a signal having the learned characteristics to a remotely controlled device. For example, one such system is disclosed in U.S. Pat. No. 5,854,593.
A user trains the trainable transceiver by, for example, transmitting a signal from a remote controller in the vicinity of the trainable transceiver. The trainable transceiver learns the carrier frequency and data code of the signal and stores this code for later retransmission. In this manner, the trainable transceiver can be conveniently mounted within a vehicle interior element (e.g., visor, instrument panel, overhead console, etc.) and can be configured to operate one or more remote electronic systems.

Systems and methods for rear view mirror displays


A novel mechanism for sharing filter taps across a plurality of interference cancellers. Each interference canceller may be directed to impairment, such as Ethernet impairments, including Ethernet 1000Base-T impairments. Various interference impairments include echo cancellation, NEXT cancellation and/or other interference detection or cancellation, etc. The hardware requirements of the interference impairment cancellers are reduced by sharing filter taps among the cancellers. In a first embodiment, the taps from a unified filter tap bank are shared across all the interference impairment cancellers for all four channels and over all ports. In a second embodiment, a portion of the taps of each filter are shared wherein each canceller comprises a fixed filter tap portion and a shared filter tap portion. A tap allocation algorithm assigns taps to those cancellers that need them the most. A canceller configuration is selected that yields maximal interference mitigation and the taps are allocated accordingly.

Modern network communication systems are generally of either the wired or wireless type. Wireless networks enable communications between two or more nodes using any number of different techniques. Wireless networks rely on different technologies to transport information from one place to another. Several examples, include, for example, networks based on radio frequency (RF), infrared, optical, etc. Wired networks may be constructed using any of several existing technologies, including metallic twisted pair, coaxial, optical fiber, etc.
Communications in a wired network typically occurs between two communication transceivers over a length of cable making up the communications channel. Each communications transceiver comprises a transmitter and receiver components. A fault along the communication channel causes a disruption in communications between the transceivers. Typically, it is desirable to be able to determine when a fault occurs in the channel. Once a fault is detected, it is desirable to determine information about the fault, such as its location along the channel.
The deployment of faster and faster networks is increasing at an ever quickening pace. Currently, the world is experiencing a vast deployment of Gigabit Ethernet (GE) devices.
Gigabit Ethernet, as well as other high-speed communication schemes, suffers from multiple sources of interference. The receiver must employ interference cancellers in order to reconstruct the transmitted signal. In any practical implementation, however, it is desirable to both minimize the cost of the receiver to consume as little power as possible.
Thus, there is a need for a mechanism for minimizing cost and power consumption while still canceling multiple interferences in a communication link such as an Ethernet connection.

Interference canceller tap sharing in a communications transceiver


A heat sink surface mounts to a printed circuit board in direct separation, thermal and physical, from components on the board. The heat sink cools the components by conducting heat from the components through the printed circuit board to the heat sink.

Surface mount circuit board technology has led to improvements in electronic component density, lower costs, and manufacturing simplicity.
High power electronic components such as power transistors and power devices commonly benefit from a heat sink that attaches to the component to ensure proper operation. Heat sinks can also improve performance of lower power devices. Heat sinks capable of attaining sufficient cooling are typically a relatively large component on a circuit board. One problem with usage of heat sinks in surface mount technology is the difficulty in fastening a large heat sink to the board using surface mount technology. Another problem is that the higher component density enabled by surface mount technology leaves little available space for placement of heat sinks. A further problem is that the heat sink significantly increases the profile or height of components and devices attached to the board, impeding the configuration of compact designs.

Hewlett-Packard Development Company, L.P.


A Quasi Radix-16 Butterfly comprises an radix-4 butterfly processor and on-board memory with external memory addressing changes from a conventional radix-4 butterfly processor. On-chip cache memory is included to store data outputs of the radix-4 butterfly processor for application as data inputs to the radix-4 butterfly processor in a second series of butterfly operations to implement high-speed processing that is maximally execution-bound.

1. Field of the Invention
The present invention relates to a LSI butterfly processor and method for high performance Fast Fourier Transform (FFT) processors.
2. Description of Related Art
With the present state of the art in VLSI technology, the speed of VLSI computing structures is typically limited by the data bandwidth of a VLSI array processor and not by silicon circuits. The data bandwidth is directly related to the number of input and output (I/0) pins. The level of integration has reached a point where, due to limited I/0 bandwidth, it is not possible to achieve 100% execution hardware utilization without increasing the number of I/0 pins significantly. In such a situation, the design of VLSI processors should aim for minimization of the undesirable effects of limited I/0 bandwidth while preserving the tremendous advantages of large computation arrays.
Early integrated FFT processors were based on a radix-2 "butterfly" as illustrated in FIG. 1a, to keep the amount of hardware required on a single chip to a minimum. A "butterfly" is a set of arithmetic operations commonly used in digital signal processing. Recently, due to advancing technology, several radix-4 butterfly-based processors have been disclosed. These processors are a logical evolutionary advance from radix-2 processors that takes advantage of a higher level of integration and thus more silicon area. Each radix-4 butterfly requires four data inputs, three `twiddle` inputs (i.e. angular velocity information), and four data outputs, as shown in FIG. 1b. A typical multi-cycle radix-4 butterfly processor includes one complex data input port, one complex twiddle port and one complex data output port, where each port can be 32 to 48 bits wide in such fixed point processors. Thus, for a radix-4 butterfly processor there is already a large number of I/0 pins. Also, it is difficult to conceive of a radix-8 butterfly processor because there is a tremendous increase in the amount of hardware required for a radix-8 butterfly processor as compared with a radix-4 butterfly processor. The term "butterfly" processor is used herein to conveniently designate the circuit module, described in detail later herein, which includes a plurality of fan-in inputs and a plurality of fan-out outputs in the schematic representation.
It is desirable to compute Fast Fourier transforms (FFTs) using as high a radix as possible to alleviate the I/0 bandwidth problem in VLSI FFT processors. The use of higher radices is even more desirable for FFT processors designed to handle exceptionally large FFT sizes e.g., 16 million data-point FFT. The I/0 bandwidth problem in high performance FFT processors is illustrated in the timing diagrams of FIGS. 2a and 2b. Let Tio be the I/0 cycle time and Teu be the execution unit pipeline cycle time. For a dual radix-2 butterfly, four I/0 cycles are performed to fetch the data (A1, B1, A2, B2), as shown in FIG. 2a. The datapath then performs two butterfly operations (1,2) on fetched data in two cycles. If Tio is equal to Teu then the datapath cannot be kept busy continuously and is I/0 bound as indicated by the blank cycles in the datapath timing waveform of FIG. 2a. As indicated in FIG. 2a, to make the datapath execution bound, 4.times.Tio=2.times.Teu i.e., the I/0 cycle time should have to be one-half the execution pipeline cycle time. FIG. 2b illustrates the same situation for a radix-4 butterfly. Here again four I/0 cycles are required to fetch the data for a single radix-4 butterfly. If it is assumed that the datapath can execute a radix-4 butterfly every two cycles, then once again Tio would have to be (1/2) Teu to make the datapath execution bound. This then is the I/0 bandwidth problem in high performance pipelined FFT processors with a limited number of I/0 ports, specifically three complex ports (namely, an input port, a twiddle port and an output port as indicated in FIG. 2).

Apparatus and method for preventing I/O bandwidth limitations in fast fourier transform processors


An automatic laser power control circuit comprises a laser diode package, a voltage adjusting unit and a polarity adjusting unit. The laser diode package emits laser light according to an applied voltage, and outputs an electric signal of a voltage proportional to the power of the emitted laser light. The voltage adjusting unit adjusts the voltage applied to said laser diode package based on the voltage of the electric signal outputted from said laser diode package. The polarity adjusting unit changes a polarity of the voltage of the electric signal outputted from said laser diode package so that the polarity is the same as that of the voltage applied to said laser diode package, and supplies the voltage having the changed polarity to said voltage adjusting unit. The automatic laser power control circuit provides an advantage that a monitor diode included in the laser diode package can be compatibly used regardless of its ground type.

The present invention relates to an automatic laser power control circuit for an optical disc system, and more particularly, to an automatic laser power control circuit in which a monitor diode for monitoring light power of a laser diode can be used regardless of its ground type.
An optical disc system such as a compact disc player (CDP) or a digital versatile disc player (DVDP) projects laser light on an information recording surface of a disc to read out information. A semiconductor laser diode which has been commonly used as a light source for laser light generally has a poor temperature characteristic. Therefore, the light power of the semiconductor laser diode decreases when temperature rises, while the light power of the semiconductor laser diode increases when temperature decreases. This fluctuation of the light power of the laser diode can cause some errors in reading out information from the disc. Accordingly, the optical disc system includes an automatic laser power control (ALPC) circuit to control the light power of the laser diode to be constant.
FIG. 1 shows a conventional automatic laser power control circuit. A laser diode package 11 includes a laser diode 111 and a monitor diode 112 for monitoring a light power of the laser diode 111. The monitor diode 112 outputs a monitor current I proportional to quantity of the light output from the laser diode 111. A voltage determined by multiplying the monitor current I and resistance R is applied to an amplifying unit 12 via a terminal 6. The amplifying unit 12 amplifies the supplied voltage via first and second amplifiers 121 and 122 into a predetermined amplification factor. The output voltage of the amplifying unit 12 is applied to a base of a transistor 13 via a terminal 5. The transistor 13 turns on/off according to the voltage applied to the base. A collector of the transistor 13 is connected through a coil L to the laser diode 111.
If the light power of the laser diode 111 increases, the monitor current I passing through the monitor diode 112 increases. As the monitor current I increases, a higher voltage than the predetermined voltage corresponding to the constant light power of the laser diode 111 is applied to the terminal 6. Higher voltage applied through the terminal 6 is amplified by the first and the second amplifiers 121 and 122, and the amplified higher voltage is applied to the base of the transistor 13 via terminal 5. As a result, the transistor 13 turns off and the driving current of the laser diode decreases. Accordingly, the increased light power of the laser diode 111 decreases, and thus becomes the same as the above constant light power.
On the contrary, if the light power of the laser diode 111 decreases, the monitor current I passing through the monitor diode 112 decreases and then a lower voltage than the predetermined voltage corresponding to the constant light power of the laser diode 111 is applied to the terminal 6. The lower voltage is amplified by the first and the second amplifiers 121 and 122. The amplified lower voltage is applied to the base of the transistor 13 via the terminal 5, and the transistor 13 turns on. When the transistor 13 turns on, the current passing through the laser diode 111 increases, and the light power of the laser diode 111 increases reach the constant light power corresponding to the predetermined voltage. As described above, the automatic laser power control circuit controls the light power of the laser diode 111 to be constant.
The circuit shown in FIG. 1 uses the laser diode package in which cathodes of the laser diode 111 and the monitor diode 112 are grounded through a common ground terminal. However, there are some commercially available laser diode packages in which an anode of the monitor diode is grounded. The direction of the monitor current of the anode-grounded-type laser diode package is different from that of the monitor current of the cathode-grounded-type laser diode package. Accordingly, the conventional circuit shown in FIG. 1 cannot be used with the two types of the laser diode packages.


An apparatus for detecting a location of conductive pins with respect to a circuit board during an assembly process using a press tool to mate the circuit board and the conductive pins includes a detector housing holding a plurality of switches aligned with corresponding conductive pins, wherein the detector housing is configured to be mounted to the press tool used during the assembly process. The switches change state based on the location of the conductive pins with respect to the circuit board. The apparatus further includes a sensor electrically coupled with the plurality of switches, wherein the sensor monitors the change of state of each switch to indicate that the respective conductive pins are properly mated with the circuit board.

This invention relates generally to assembling electronic components to printed circuit boards (PCB), and more particularly, to an apparatus and method for detecting the penetration of compliant pins through the PCB during assembly.
In many current electronic assemblies, electronic components, such as connectors and insert-molded housings, are attached to or mounted on PCBs. These assemblies require a suitable mechanical attachment and a proper electrical contact between the component and the PCB. Various machines and manufacturing processes automatically assemble or attach the various electronic components to the PCBs. One means for attaching the component to the PCB is by a press-fit pin or compliant pin. The compliant pin is press-fit into an opening or hole in the PCB to provide both an electrical and mechanical mounting between the component and the PCB. An example of a compliant pin application is electrical control modules used in automobiles. A control module is assembled by pressing the PCB onto the compliant pins of the housing of a module until the PCB is fully seated. Other types of compliant pin products, such as connectors, are manufactured in a similar manner. A typical component includes an array of electrical contact pins that have a compliant section at the tip of the pin. This compliant section of the pin is larger than the receiving holes in the PCB, creating an interference fit with the receiving holes of the PCB and thereby, generating a firm electrical contact.
In order to verify a proper assembly, the manufacturing process must include feedback to ensure that the compliant portion of the pin properly penetrated the PCB and is making good electrical contact with the PCB. Currently, the feedback is generated by visually inspecting the assembly either during or after assembly, by either manual or vision inspection equipment. The manual method is subjective because it is operator dependent and the amount of penetration can not be quantified. Additionally, because the components of the PCB must be supported by the manufacturing equipment or tooling, it is difficult or even impossible to visually inspect during the assembly process. Thus, an additional step to visually inspect must come after the assembly process. Likewise, using vision inspecting equipment is a second manufacturing operation and is expensive.
Thus, a need remains for providing feedback to ensure proper penetration and a need remains for generating feedback during the manufacturing process.

Apparatus and method for detecting a location of conductive pins with respect to a circuit board


An integrated circuit includes a substrate and a first insulating layer on the substrate that includes a first hole including a floor and a sidewall. A first conductive contact extends conformally on the sidewall and floor to define a groove in the first hole. A second insulating layer is provided on the first insulating layer and includes a second hole that exposes the groove. A second conductive contact is provided in the second hole and in the groove. These integrated circuits are fabricated by forming a first insulating layer on a substrate that includes a first hole including a floor and a sidewall. A first conductive contact is conformally formed on the sidewall and floor to define a groove in the first hole. A second insulating layer is formed on the first insulating layer and includes a second hole that exposes the groove. A second conductive contact is formed in the second hole and in the groove.

In semiconductor integrated circuits, conductive contacts are formed so as to electrically connect multi-level interconnections to each other and/or between an interconnection and a substrate. FIG. 1 is a cross-sectional view showing a cell area and a peripheral circuit area of a conventional Dynamic Random Access Memory (DRAM). Reference numerals 80 and 90 represent the cell area and the peripheral circuit area, respectively.
Referring to FIG. 1, in the cell area 80, trench-type device isolation regions 4 defining an active area are formed in a substrate 2. A gate stack, including a gate insulating layer 6, a polysilicon layer 8, a silicide layer 10 and a capping insulating layer 12, is formed on the substrate 2 in which the device isolation regions 4 are formed. Gate spacers 16 are formed on sidewalls of the gate stack. Source/drain regions 19 including lightly doped impurity regions 14 and highly doped impurity regions 18 are formed in the active area adjacent to the gate stack. A first interlayer insulating layer 20 is formed on the substrate 2 that includes the gate stack having the spacers 16 formed on the sidewalls thereof. A bit line contact hole 22 is formed which passes through the first interlayer insulating layer 20. A bit line contact 29 including a barrier metal 26 and a tungsten layer 28 is formed within the bit line contact hole 22. A bit line 32a electrically connected to the bit line contact 29 is formed on the first interlayer insulating layer 20 in which the bit line contact 29 is formed. A second interlayer insulating layer 36 is formed on the bit line 32a and the first interlayer insulating layer 20. An opening 40 is formed to expose the source region 19 through the second interlayer insulating layer 36 and the first interlayer insulating layer 20. The opening 40 is filled with polysilicon to thereby form a contact plug 42. A capacitor including a lower electrode 44, a dielectric layer 46 and an upper electrode 48 is formed on the second interlayer insulating layer 36 in which the contact plug 42 is formed. A third interlayer insulating layer 50 is formed on the capacitor and the second interlayer insulating layer 36. A metal interconnection 62 including a barrier metal 56 and a tungsten layer 58 is formed on the third interlayer insulating layer 50.
In the peripheral circuit area 90, device isolation regions 4 defining an active area are formed on the substrate 2, and a highly doped impurity region 18 is formed in the active area. A lower interlayer insulating layer 20 is formed on the substrate 2. A lower contact hole 24 is formed through the lower interlayer insulating layer 20 to expose the highly doped impurity region 18. A lower contact 30 including a barrier metal 26 and a tungsten layer 28 is formed in the lower contact hole 24. An interconnection line 32b electrically connected to the lower contact 30 is formed on the lower interlayer insulating layer 20 in which the lower contact 30 is formed. An upper interlayer insulating layer 52 is formed on the interconnection line 32b and the lower interlayer insulating layer 20. An upper contact hole 54 is formed through the upper interlayer insulating layer 52 to expose the interconnection line 32b. An upper contact 60 and a metal interconnection 62, each of which includes a barrier metal 56 and a tungsten layer 58, are formed inside the upper contact hole 54 and on the upper interlayer insulating layer 52, respectively. In the peripheral circuit area 90, the highly doped impurity region 18, the interconnection line 32b and the metal interconnection 62 are electrically connected to each other via the lower contact 30 and the upper contact 60.
In the fabrication of the lower contact 30, the lower contact hole 24 exposing the highly doped impurity region 18 is formed on the lower interlayer insulating layer 20, and then the barrier metal 26 and the tungsten layer 28 are formed inside the lower contact hole 24 and on the first interlayer insulating layer 20. Thereafter, the resulting structure may be planarized using a Chemical Mechanical Polishing (CMP) process until a surface of the lower interlayer insulating layer 20 is exposed, thereby forming the lower contact 30. However, the CMP process may cause a well known dishing phenomenon such that the planarized surface is formed in a dish shape. Furthermore, the slurry used in CMP process may cause contamination and particle generation. Accordingly, in order to remove problems associated with contamination and/or particles during CMP process, extra cleaning process may be preformed.

Methods of fabricating integrated circuit conductive contact structures including grooves


An optical pickup apparatus for detecting a symmetric S-shaped signal to obtain a focus-error signal by an SSD method for stability in operation is provided. In an optical pickup apparatus for irradiating laser light onto an optical recording medium and for directing the light reflected from at least the optical recording medium to a light-receiving device section through a diffraction element to detect a focus-error signal by a spot size detection method using diffracted light caused by the diffraction element, the position of the light-receiving device section is set to the position offset closer to the diffraction element from the focal position of the 0 order light passing through the diffraction element.

Optical pickup apparatuses for detecting a focus-error signal by a spot size detection method (SSD method) using diffracted light caused by a diffraction element are known. Such an optical pickup apparatus is described with reference to FIGS. 6 through 8.
FIG. 6 illustrates an example structure of an optical pickup apparatus for detecting a focus-error signal by an SSD method.
A laser beam emitted from a laser light source 21 such as a laser diode reaches an objective lens 23 through a beam splitter 22, and is irradiated via the objective lens 23 onto an information recording surface of an optical recording medium 10 such as an optical disc.
The light reflected from the optical recording medium 10 returns to the beam splitter 22 through the objective lens 23, the optical path thereof being refracted by the beam splitter 22, and is directed to a diffraction element 24.
The reflected light is divided by the diffraction element 24 into the 0 order light passing therethrough, and +1 order light (diffracted light) and −1 order light (diffracted light) diffracted by the diffraction element 24.
The 0 order light, the +1 order light, and the −1 order light reach a light-receiving device section 25.
In the light-receiving device section 25, for example, light-receiving patterns shown in FIG. 8 are formed.
A light-receiving device 31 has a light-receiving region E corresponding to the 0 order light.
A light-receiving device 32 has three divided light-receiving regions A, S1, and B, and corresponds to the +1 order light.
A light-receiving device 33 also has three divided light-receiving regions C, S2, and D, and corresponds to the −1 order light.
Each of the light-receiving regions E, A, S1, B, C, S2, and D of the light-receiving devices 31, 32, and 33 outputs an electrical signal having a current level corresponding to the light intensity of the incident light.
The electrical signal output from each of the light-receiving devices 31, 32, and 33 is supplied to a matrix amp (not shown) for processing, such as current-to-voltage conversion, amplification, and matrix calculation, thereby generating a required signal.
That is, a playback signal, focus-error signal, tracking error signal, etc., corresponding to the information recorded in the optical recording medium 10 are generated.
The objective lens 23 is held by a two-axis mechanism (not shown) having a focus coil and a tracking coil so as to be displaceable in the near-and-apart direction with respect to the optical recording medium 10 (focusing direction) and in the direction transverse to the track orientation of the optical recording medium (tracking direction).
A focus drive signal is generated by a servo circuit (not shown) based on the focus-error signal to drive the focus coil of the two-axis mechanism, so that the objective lens 23 is driven in the focusing direction so as to be focused with respect to the optical recording medium 10.
A tracking drive signal is further generated by the servo circuit based on the tracking error signal to drive the tracking coil of the two-axis mechanism, so that the objective lens 23 is driven in the tracking direction so as to track with respect to the optical recording medium 10.
In the SSD method, the focus-error signal is generated according to the spot size of the diffracted light.
In the focused state shown in FIG. 8(a), the spot size of the +1 order light incident on the light-receiving device 32 is equivalent to the spot size of the −1 order light incident on the light-receiving device 33.
On the other hand, in the defocused state where the objective lens 23 is too close to or too far from the optical recording medium 10, as shown in FIGS. 8(b) and 8(c), the spot size of the +1 order light incident on the light-receiving device 32 is different from the spot size of the −1 order light incident on the light-receiving device 33.
Accordingly, by comparing the spot sizes on the light-receiving devices 32 and 33, the focus-error signal can be generated.
More specifically, the focus-error signal is generated by, in the subsequent matrix amp, calculating (A+B+S2)−(C+D+S1) on the outputs of the light-receiving regions A, S1, B, C, S2, and D.
In general, when the objective lens 23 moves from the position most distant from the optical recording medium 10 to the position closest thereto, as known in the art, in the focus-error signal, a so-called S-shaped curve shown in FIG. 7 is observed in the vicinity of the focused position.
A substantially linear region from peak P1 to peak P2 in the curve corresponds to a so-called in-focus region. In basic operation, when the objective lens 23 is positioned within the in-focus region, a focus servo controls the position of the objective lens 23 to be brought to the position of the origin of the S-shaped curve (i.e., the position where focus error=0) based on the focus-error signal.
As shown in FIG. 7, it is assumed herein that the distance of the in-focus region of the S-shaped signal is indicated by d. In other words, "d" is defined as the displacement distance of the optical recording medium (the distance by which the optical recording medium changes with respect to the position of the objective lens) when the S-shaped signal varies from the peak P1 to the peak P2.
Furthermore, one-side in-focus regions d1 and d2 of the S-shaped curve with respect to the origin of the S-shaped curve are defined as the displacement distances of the optical recording medium when the S-shaped signal goes from the origin of the S-shaped curve to the peaks P1 and P2 of the S-shaped curve, respectively. Then, the following equation holds true:d=d1+d2  Formula (1)
The origin of the S-shaped curve coincides with the focal position on the optical recording medium.
This relationship is established, in the standard SSD method, when the diffracted light (the +1 order light and the −1 order light) diffracted by the diffraction element 24 has the same spot diameter r, as shown in FIG. 8(a), resulting in substantial coincidence with the focal position of the 0 order light (strictly speaking, however, it is shifted towards the diffraction element 24 by L·cosθ, where θ denotes the angle of diffraction and L denotes the distance between the diffraction element 24 and the light-receiving device section 25).
It is assumed herein that the NA (numerical aperture) of the objective lens 23 is indicated by NA[L]. It is further assumed that the NA of the 0 order light in the light focused at the light-receiving device section 25 which passes through the diffraction element 24 is indicated by NA[0]. It is still further assumed that the NAs of the +1 order light and the −1 order light diffracted by the diffraction element 24 are indicated by NA[+1]′ and NA[−1]′, respectively.
It is also assumed that the NAs are so small that the following approximation applies: NA=sin θ=tan θ=θ.
Then, the following relationship is obtained:NA[−1]′<NA[+1]′  Formula (2)Thus, the following relationship holds true:NA[−1]′+NA[+1]′=2·NA[L]  Formula (3)
As shown in FIG. 6, the distances from the position of the light-receiving device section 25 (the focal position of the 0 order light) to the focal positions of the diffracted light (the +1 order light and the −1 order light) diffracted by the diffraction element 24 are indicated by D11 and D12, respectively.
Then, the above-noted one-side in-focus regions d1 and d2 of the S-shaped curve can be approximated as follows:d1={(½)·D11·(NA[+1]′)2}/(NA[L])2  Formula (4)d2={(½)·D12·(NA[−1]′)2}/(NA[L])2  Formula (5)
Since the spot diameters r of the diffracted light on the light-receiving devices 32 and 33 on the origin of the S-shaped curve are the same, the following equation is obtained:
                                                                        r                                                  /                                                2                            =                                                          D11                ·                                                      NA                                                              [                                              +                        1                                            ]                                                        ′                                                                                =                                                          D12                ·                                                      NA                                                              [                                              -                        1                                            ]                                                        ′                                                                                Formula                                                            (          6          )                    Therefore, the following relationship holds true from Formula (6):D11/D12=NA[−1]′/NA[+1]′  Formula (7)
If NA[0]=NA[+1]′=NA[−1]′ can be approximated, D11 is equal to D12, and the following equation is obtained from Formulas (4) and (5):d1/d2=1  Formula (8)
Thus, the following relationship is obtained between the diffracted light (the +1 order light and the −1 order light) and the 0 order light:NA[+1]′=L/(L−D11)·NA[0]  Formula (9)NA[−1]′=L/(L+D12)·NA[0]  Formula (10)
If the distance L between the diffraction element 24 and the light-receiving device section 25 is sufficiently large, or if the distances D11 and D12 are sufficiently small, Formula (8) holds true.
If the above-noted approximation does not apply, however, the relationship NA[0]=NA[+1]′=NA[−1]′ does not hold true, and Formula (11) rather than Formula (8) is obtained:
                                                                        d1                /                d2                            =                                                                                (                                                                        NA                                                                                [                                                          +                              1                                                        ]                                                                          ′                                            )                                        2                                    /                                                            (                                                                        NA                                                                                [                                                          -                              1                                                        ]                                                                          ′                                            )                                        2                                                  ·                                  (                                      D11                                                              /                                                            D12                                    )                                                                                =                                                                                NA                                                              [                                              +                        1                                            ]                                                        ′                                /                                                      NA                                                              [                                              -                        1                                            ]                                                        ′                                                                                Formula                                                            (          11          )
In this case, an asymmetric in-focus region of the S-shaped curve is exhibited. That is, the in-focus region shown in FIG. 7 is exhibited.
An asymmetric S-shaped curve means instability in gain of a focus servo signal or an asymmetric focus margin, and is disadvantageous in view of the stability in recording to and playback from an optical recording medium.
In a device supporting a high-density recording medium, the objective lens 23 has a high NA. In order to accomplish the same in-focus region d of the S-shaped curve as that described above, as is understood from Formulas 4 and 5, the focal change distance D11 (D12) with respect to the diffraction element 24 must increase as the numerical aperture (NA[L]) of the objective lens 23 increases.
This further results in a greater amount of change in the NA of the diffracted light diffracted by the diffraction element 24 than that of the 0 order light, as is given by Formulas 9 and 10.
In an optical pickup apparatus which includes the objective lens 23 having a high NA, therefore, a more asymmetric in-focus region of the S-shaped curve is exhibited.
Furthermore, desirably, the distance L from the diffraction element 24 to the light-receiving device section 25 should be reduced in order to reduce the size of the optical pickup apparatus.
However, as is understood from Formulas 9 and 10, as the distance L from the diffraction element 24 to the light-receiving device section 25 becomes shorter, the amount of change in the NA of the diffracted light diffracted by the diffraction element 24 becomes greater than that of the 0 order light. Thus, this case also results in a more asymmetric in-focus region of the S-shaped curve.
As described above, an optical pickup apparatus which obtains a focus-error signal by the SSD method using a diffraction element has a problem of such an asymmetric in-focus region of the S-shaped curve.
A noticeably asymmetric in-focus region of the S-shaped curve is exhibited, resulting in a large problem, particularly in an optical pickup apparatus which includes the objective lens 23 having a high NA and in which the distance L from the diffraction element 24 to the light-receiving device section 25 is small, that is, a compact optical pickup apparatus used for high-density optical recording media.

Optical pickup apparatus for detecting a focus-error signal using a spot size detection method


This invention relates to an end-sampling thief probe and a method of using this probe. The thief probe of the invention is useful in extracting a sample with minimal disturbance and provides an improved method for end-sampling.

Efficient blending and sampling of powders is of critical importance in the manufacture of a wide variety of pharmaceutical solid doses such as tablets and capsules. These products are manufactured from powder blends, granulated powders, and extruded pellets. In a typical process, powders, granules, and pellets are blended, discharged to a tote or drum, emptied into a hopper on a press or encapsulator, and divided into the final dosage form. Achieving and maintaining homogeneous and well characterized blends of powders and granules is of critical importance, especially in formulations involving small amounts of high potency components, which are a substantial fraction of all oral dosages. Inadequate mixing somewhere along the production sequence often results in rejection of finished product due to poor quality.
In many systems, the components requiring blending are usually powders of different size, density, shape, and cohesiveness. Since such materials often display a considerable tendency to segregate, ultimate mixture homogeneity cannot be taken for granted; quite the opposite, unless the blending process is properly designed and controlled, the result is often a mixture with significant composition fluctuations throughout the powder bed [See, L. T. Fan, Y.-M. Chen, and F. S. Lai, Powder Technol., 61 (1990) 255. and M. Poux, P. Fayolle, J. Bertrand, D. Bridoux, and J. Bousquet, Powder Technol., 68 (1991) 213.]. Inhomogeneities in the powder blend can result in increased variability in the contents of potent components in tablets, leading not only to decreased therapeutic value but also to direct health risks due to toxicity in super-potent tablets.
For the reasons mentioned above, a thorough understanding of blending processes is highly desirable. Unfortunately, blending of granular materials is largely an art rather than a science, and at the present time the ability to design and accurately evaluate the performance of a mixing process for a high potency drug is limited.
Characterization of mixtures in most industrial processes relies on taking and analyzing discrete samples. Parameters such as sample size (n), number of samples (N), and location of the sampling points can affect the measurement values. Guidelines for selecting the number of samples have been proposed based on theoretical random mixtures (i.e., >30) [Devore, J. L., Probability and Statistics for Engineering and the Sciences, Vol., Brooks/Cole Publishing Company, Monterey, 1982, p. 640] but optimal values of these parameters for real systems displaying incomplete mixing are often unknown.
In real mixtures, practical considerations and physical limitations of sampling mechanisms limit the number and size of the samples that can be obtained. Extensive sampling is often impractical; commonly, just a few samples (<30) are removed from a blender. The most common approach is to use a thief probe to withdraw samples from different locations in stationary powder mixtures.
Of signifcant interest are two essential sampling problems that cannot be easily solved using currently available commercial technology:
(i) Disturbances. The most common technique for obtaining samples is to use a thief probe. Available probes can introduce large errors in sample composition due to the massive disturbances that take place during insertion of the probe. PA1 (ii) Segregation. It is well known among practitioners that powder mixtures can segregate (unmix) upon handling. Segregation can be a major sampling problem in any sampling process involving dry powders because such powders often segregate during insertion of the thief.
Thief samplers belong to two main classes: side sampling and end sampling. A typical side sampling probe has one or more cavities drilled or stamped in an inner cylinder enclosed by an outer rotating sleeve. The sleeve has holes that align with the cavities, allowing adjacent powder to flow into the cavities. Rotating the sleeve to its closed position traps the particles into the cavities. An end sampling thief has a single cavity at the end of the probe that can be remotely opened and closed. In both cases, the thief is introduced into the powder with its cavities closed. Once insertion is complete, the cavities are opened, allowing the powder to flow into them. The cavities are then closed, and thief is withdrawn, removing samples from the mixtures.
Thief sampling is a rather laborious and cumbersome technique and it is rarely practical to take more than 10 or 20 samples. In any sampling scheme, the experimentally measured variance, .sigma..sub.e.sup.2, is actually a combination of the true variance resulting from the mixing process, .sigma..sub.m.sup.2, the variance introduced by sampling error, .sigma..sub.s.sup.2 [Fan, L. T., et al., Powder Technol., 61 (1990) 255], and the variance resulting from analytical analysis, .sigma..sub.a.sup.2, i.e., EQU .sigma..sub.e.sup.2 =.sigma..sub.m.sup.2 +.sigma..sub.s.sup.2 +.sigma..sub.a.sup.2 (1)
In an ideal situation, .sigma..sub.s.sup.2 and .sigma..sub.a.sup.2 are negligible, and .sigma..sub.e.sup.2 (the variance subject to USP rules) is almost identical to .sigma..sub.m.sup.2 (the true variance). Unfortunately, thief probes bias measurements to the point that sampling uncertainty is expected to be a large fraction of the measurement [Ashton, M. D., et al., Trans. Instn. Chem. Engrs., 44 (1966) T166; Schofield, C., Powder Technol., 15 (1976) 169; Yip, C.W., et al., Powder Technol., 16 (1977) 189; Lai, F., et al., Chem. Eng. Sci., 36 (1981) 1133]. As mentioned earlier, two type of errors are often introduced by thief probes: (i) the mixture is extensively disturbed when the thief probe is inserted into the powder bed, and (ii) particles of different sizes often flow unevenly into the thief cavities. Side-sampling probes often have an additional problem: cohesive powders do not flow easily into thief cavities, sometimes resulting in samples that are smaller than desired.
Only a few studies have attempted to quantify the errors introduced by thief probes mainly focusing on side-sampling thief probes [Carley-Macauly, K. W., et al., Chem. Eng. Sci., 17 (1962) 493; Schofield, C., Powder Technol., 15 (1976) 169; Poole, K. R., et al., Trans. Instn. Chem. Engrs., 42 (1964) T305; Masiuk, S., Powder Technol., 51 (1987) 217; Gopinath, S., 27 (1982) 321; Gayle, J. B. et al., 50 (1958) 1279]. Carley-Macauley and Donald [Carley-Macauly, K. W., et al., Chem. Eng. Sci., 17 (1961) 493] performed a comparison study between two types of side sampling probes. One was a conventional probe (as described above); the other probe had cavities that were closed using a longitudinal slit. They took samples from a system composed of sand of two colors arranged in a layered structure. The conventional probe gave samples of a mixed color within a region of two aperture diameters (0.13") from the layer boundary. In the longitudinal slit probe, sand particles tended to run down the slit, causing errors greater than the conventional side sampling probe. In both cases, errors occur because the probe is sampling locations that have already been disturbed by the insertion of the probe itself. Other studies have reached similar conclusions. For example, in a study conducted by Williams and Khan [Williams, J. C., et al., Chem. Eng., (1973) 19], although no quantitative data was reported, the authors concluded that a side sampling thief gave totally misleading results in a segregating system. Instead, they used a sampler that removed a core of powder from the bed. The sampler was divided into sections in order to divide the core into samples. Orr and Shotton [Orr, N. A., et al., Chem. Eng., London, January (1973)12] determined that perturbations of the mixture structure are caused by friction along the length of the probe, and are independent of the profile of the tip. This result suggests that an end sampling probe will perform better than a side sampling probe because for an end-sampling probe the sample is taken from a relatively undisturbed region of powder beneath the tip of the probe. They developed such a probe for use with cohesive powders. Components sampled at depths of 1, 2, 4 and 6 cm through a 2 cm layer of charcoal powder qualitatively showed little contamination of the samples with charcoal powder. In a quantitative analysis, 20 samples of cohesive calcium carbonate were taken through a layer of cohesive lactose at a depth of 2 cm below an interface. The maximum amount of lactose found in the samples was 0.07% [Orr, N. A., et al., Chem. Eng., London, January (1973)12].

Rutgers, The State University of new Jersey


An apparatus includes a carding machine which has a web trumpet gathering a running fiber web into sliver and a calender roll pair arranged immediately downstream of the web trumpet for pulling the sliver therethrough. The apparatus further includes a sliver coiler having a rotary coiler head through which the sliver passes and a first sliver trumpet having an inlet which constitutes the inlet opening for the coiler head. A sliver drawing unit is arranged at the inlet opening for the coiler head for drawing the sliver running therethrough prior to entering the coiler head. Further, a second sliver trumpet is arranged at the inlet end of the drawing unit for guiding the sliver thereto.

This invention relates to a carding machine which, at its output, has a web trumpet with an after-connected pair of calender rolls, downstream of which--as viewed in the direction of sliver run--a sliver coiler is arranged which includes a rotary coiler head having a sliver inlet opening. A sliver drawing unit is disposed between the web trumpet and the sliver inlet opening of the coiler head.
In a known device a sliver drawing unit is provided between the stripper roll--which cooperates with the doffer of the carding machine--and the sliver coiler. At a distance from the stripper roll a web trumpet is disposed whose input is associated with a fiber web chamber while its output is situated immediately at the intake of the drawing unit. The web trumpet is thus arranged simultaneously at the output of the carding machine and at the input of the sliver drawing unit which is a regulated drawing unit. The web trumpet has a dual function: first, it forms, as an output trumpet at the carding machine, a sliver from the fiber web and guides, as an input trumpet, the sliver into the drawing unit. Second, the web trumpet serves as a measuring member to sense the sliver thickness. The thickness measurement signal affects, with the intermediary of regulating devices, the rpm of the feed roll at the input of the carding machine as well as the rpm of a roll pair of the regulated drawing unit. The drawing unit is arranged horizontally approximately at the height level of the stripper roll of the carding machine, and the web trumpet receives the approximately horizontally running sliver. The drawing unit is associated with the sliver coiler and is situated in a vertical direction approximately at one-half the height between the floor plate (platform) and the coiler head of the sliver coiler apparatus.
It is a disadvantage of the above-described arrangement that the web trumpet is, in the horizontal direction, at a distance from the stripper roll so that a web triangle is formed which is prone to rupture. Running speeds of above 100 m/min are not feasible with such an apparatus. It is a further drawback that between the outlet of the drawing unit and the sliver inlet opening of the coiler head of the sliver coiler a significant distance prevails so that the drawn and regulated sliver risks being exposed to unintended stretching along such a travel path, resulting in irregularities in the sliver.

Carding machine having an after-connected sliver coiler provided with a sliver drawing unit


The drive of the motor is stopped, the electromagnetic switch contacts are switched OFF, and thereafter the first and second contact points are closed to form a closed circuit of the smoothing capacitor, second contact point, first and second resistors, motor coil, ground 1, ground 2, first contact point, and smoothing capacitor. Charging voltage of the smoothing capacitor is applied to the closed circuit. If an insulation resistance of the motor deteriorates, a current flowing through the closed circuit is increased. The increase of the current is detected by means of the potential difference across the first resistor R1 in the closed circuit, to detect insulation resistance deterioration of the motor.

1. Field of the Invention
The present invention relates to a method of detecting insulation resistance deterioration of a motor, an insulation resistance deterioration detection device which implements the detection method, and a motor driver which has the insulation resistance deterioration detection device.
2. Description of the Related Art
Continuous long-term use of a motor deteriorates the insulation of the motor depending on the usage environment. A leakage breaker is actuated by a leakage current caused by the insulation resistance deterioration, and a drive unit which uses this motor suddenly stops operating. In such a case, it is unclear whether the cause of the sudden stop is in the motor or the drive unit. Investigation into the causes of the sudden stop requires a long time; which tends to extend the cessation of the device which uses the motor and the manufacturing line.
As a method of detecting insulation resistance deterioration of a motor, the method of detecting it by detecting a leakage current, as described above, is generally known. However, in an earth leakage detector, or other earth leakage detector such as an earth leakage protection relay, detection cannot be carried out until a leakage current becomes large to some extent (3 mA through 15 mA) Therefore, there is a problem that the detection is performed only when insulation resistance deterioration of the motor has advanced. Furthermore, since a sudden stop of the device using the motor is caused by earth leakage, investigation into the causes of the sudden stop has to be carried out by stopping the operation of the entire systems, such as the device and the manufacturing line, in order to find out whether the cause is in the motor itself or the motor driver. Moreover, this earth leakage detector cannot be used effectively in prediction and preventive maintenance of insulation resistance deterioration of the motor.
There is proposed a method for detecting an insulation deterioration of a compressor for an air conditioner at an early stage so as to prevent the air conditioner from becoming inoperative (see Japanese Patent Application Laid-Open No. 2001-141795, for example). According to this method, during a stopped state of the motor, high-frequency pulses are applied to one transistor constituting an electric power converter which drives the motor by converting a DC voltage to an arbitrary voltage and frequency, to drive the motor while the motor is not in operation, and a three-phase AC power supply is rectified and filtered to obtain a voltage of the DC power supply (or a voltage level which is set previously). Further, a motor current is detected. Then, an insulation resistance value is obtained based on the obtained voltage of the DC power supply and the detected motor current. If the computed insulation resistance value is below a set insulation resistance value, an alert is issued. There is also proposed a method of predicting insulation resistance deterioration, which computes the insulation resistance value of a motor by simply bringing the transistors in conduction, instead of applying high-frequency pulses to the transistor.
Although the method described in Japanese Patent Application Laid-Open No. 2001-141795 can be used effectively in prediction and preventive maintenance of insulation resistance deterioration of a motor, detection of voltage and current has to be carried out. Moreover, detection of heavy current has to be considered when using the detector, leading to increase of the cost.
Therefore, there has been applied for a patent in Japan on a motor driver which can remedy the problems of the conventional method of detecting insulation resistance deterioration of a motor, and can predict insulation resistance deterioration at low costs (Japanese Patent Application No. 2003-340009, which is hereinafter referred to as "prior application").
However, in this motor driver proposed in this prior application, the switch for connecting the AC power supply to the rectifier circuit of the motor driver is operated for a certain period of time, then the energy is accumulated in the capacitor which smoothes rectified voltage, thereafter the rectifier circuit is connected to ground, and the energy accumulated in the capacitor is applied to the motor via a detection resistor connected serially to a motor coil, at which time the potential difference between the both ends of the detection resistor is detected, whereby decline of insulation is detected. In this manner, the motor driver of the prior application requires control of actuating, for a certain period of time, the switch that connects the rectifier circuit to the AC power supply. Therefore, there is a problem that the invention of the prior application cannot be applied easily to the existing motor drivers and the like.
In addition, the insulation resistance of a motor is affected by the surrounding environment (temperature, humidity) where the motor is placed. The insulation resistance decreases, especially in high humidity. For this reason, it is desirable to understand the ambient temperature and humidity conditions when detecting insulation resistance deterioration. Furthermore, it is desirable to obtain the history of decline of the motor insulation resistance.

Insulation resistance deterioration detection method and insulation resistance deterioration detection device for motor, and motor driver


An apparatus and method for monitoring a change of a polarization state resulted from an optical link and optical receiver is provided. By combining zero-frequency response matrices and phase information on the received signal at two moments, a change matrix of the zero-frequency channel response matrices at the two moments is obtained, and a parameter characterizing a polarization state change induced by the optical link is determined according to the change matrix, which may dynamically monitor in real-time manner the polarization state change induced by the optical link, irrelevant to the polarization state of an input signal of the optical link. Due to the combination of the zero frequency response matrices and the phase information, response of the optical link may be completely reflected, for more accurate monitoring the polarization state. In addition, there is no need to add additional hardware and controls, thereby simplifying the structure and saving cost.

Coherent optical communications systems play an important role in communications transmission networks due to their huge transmission bandwidths, great potentials for expansion, extremely low transmission loss, and low cost. In coherent optical communications, in order to ensure stable transmission of signals, an effective method is needed in an optical transceiver system to monitor and deal with various state changes of optical fibers in natural environments, such as bending, jitter, and being beaten. Research suggests that monitoring polarization changes is helpful to quickly response to, analyze of, and repair of such damages by an optical transceiver. That is, it is desirable to accurately reflect state changes of fibers in an optical link by monitoring changes of polarization states of signals in the optical link.
Currently, there are many different ways to monitor polarization states of signals. For example, a first method is a hardware-based method which monitors a change of a polarization state by using a DC laser and a commercial polarimeter or using two detectors and an optical rotator. A second method is based on digital signal processing by a receiver, in which a change of a polarization state in an optical link may be tracked at a faster speed in comparison with the first method.
It should be noted that the above description of the background is merely provided for clear and complete explanation of this disclosure and for easy understanding by those skilled in the art. And it should not be understood that the above technical solution is known to those skilled in the art as it is described in the background of this disclosure.

Apparatus and method for monitoring change of polarization state resulted from optical link and optical receiver


The present invention relates to an organic electroluminescent device comprising an hole injection layer and electron injection layer with zero-valent metal, and a method of manufacturing the same. In particular the present invention relates to an organic electroluminescent device comprising an anode layer, at least one electron transport layer, at least one electron injection layer, a cathode layer, and an emission layer, wherein the emission layer is arranged between the anode layer and the cathode layer, wherein the at least a first electron transport layer and the injection layer are arranged between the emission layer and the cathode layer, wherein the electron injection layer is arranged in direct contact to the first transport electron layer, wherein the first electron transport layer is arranged nearer to the anode layer and the electron injection layer is arranged nearer to the cathode layer, wherein at least the first electron transport layer comprises an organic phosphine matrix compound, and a first zero-valent alkali metal; and the electron injection layer comprises a second zero-valent metal of an alkaline earth metal and/or rare earth metal, and an alkali metal halide.

Organic electroluminescent devices, such as organic light-emitting diodes OLEDs, which are self-emitting devices, have a wide viewing angle, excellent contrast, quick response, high brightness, excellent operating voltage characteristics, and color reproduction. A typical OLED comprises an anode, a hole transport layer HTL, an emission layer EML, an electron transport layer ETL, and a cathode, which are sequentially stacked on a substrate. In this regard, the HTL, the EML, and the ETL are thin films formed from organic compounds.
When a voltage is applied to the anode and the cathode, holes injected from the anode move to the EML, via the HTL, and electrons injected from the cathode move to the EML, via the ETL. The holes and electrons recombine in the EML to generate excitons. When the excitons drop from an excited state to a ground state, light is emitted. The injection and flow of holes and electrons should be balanced, so that an OLED having the above-described structure has excellent efficiency and/or a long lifetime.
US2016248022 (A1) discloses an organic light-emitting device including: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode, the organic layer including an emission layer, wherein the organic layer further includes: i) a hole transport region between the first electrode and the emission layer, the hole transport region including at least one selected from a hole transport layer, a hole injection layer, and a buffer layer, and ii) an electron transport region between the emission layer and the second electrode, the electron transport region including an electron transport layer and at least one selected from a hole blocking layer and an electron injection layer; and wherein the electron transport region includes a compound represented by Formula 1 or a compound represented by Formula 2:

Hyuo Ahn et al., "P-112: Highly Efficient Electron Injection Layer of LiF/Yb Bilayer for Top-emitting Organic Light Emitting Diodes", SID International Symposium. Digest of Technical Papers, vol. 43, no. 1, 1 Jun. 2012, report highly efficient electron injection layer (EIL) of LiF/Yb bilayer for top-emitting organic light emitting diodes. The device with the LIF/Yb bilayer shows reduced operating voltage and enhanced efficiencies compared to other two devices with Yb and LiF/Al due to the reduced electron injection barrier, resulting in better charge balance. The device with the LiF/Yb bilayer shows high luminous efficiency of 53.2 cd/A and external quantum efficiency of 16.9%.
EP3182478 (A1) relates to Organic light emitting diode comprising at least one emission layer, an electron injection layer and at least one cathode electrode, wherein: —the electron injection layer comprises an organic phosphine compound, wherein the electron injection layer is free of a metal, metal salt, metal complex and metal organic compound; —the cathode electrode comprises at least a first cathode electrode layer, wherein—the first cathode electrode layer comprises a first zero-valent metal selected from the group comprising alkali metal, alkaline earth metal, rare earth metal and/or a group 3 transition metal; and—the electron injection layer is arranged in direct contact to the first cathode electrode layer.
US2017186981 (A1) discloses an organic light-emitting device includes a first electrode, a second electrode facing the first electrode, and an emission layer disposed between the first electrode and the second electrode. An electron transport region is between the second electrode and the emission layer. The electron transport region includes an electron injection layer including a first component including at least one halide of an alkali metal (Group I), a second component including at least one organometallic compound, and a third component including at least one of a lanthanide metal or an alkaline earth metal (Group II).
EP3109916 (A1) relates to an electronic device comprising at least one light emitting layer between an anode and a substantially silver cathode, the device further comprising between the cathode and the anode at least one mixed layer comprising (i) at least one substantially covalent electron transport matrix compound comprising at least one polar group selected from phosphine oxide group or diazole group, and (ii) in substantially elemental form, an electropositive element selected from substantially non-radioactive alkali metals, alkaline earth metals, rare earth metals, and transition metals of the fourth period of the Periodic table having proton numbers 22, 23, 24, 25, 26, 27, 28, 29.
Performance of an organic light emitting diode may be affected by characteristics of the organic semiconductor layer, and among them, may be affected by characteristics of an organic material of the organic semiconductor layer.
Particularly, development for an organic material being capable of increasing electron mobility and simultaneously increasing electrochemical stability is needed so that the organic electroluminescent device, such as an organic light emitting diode, may be applied to a large-size flat panel display.
There remains a need to improve performance of organic semiconductor layers, organic semiconductor materials, as well as organic electroluminescent devices thereof, in particular to achieve higher efficiency and/or longer lifetime through improving the characteristics of the compounds comprised therein.
In particular there is a need for organic semiconductor materials and organic semiconductor layers as well as organic electroluminescent devices with improved conductivity and thereby reduced operating voltage.
There is a need for a reduced operating voltage and thereby reduced power consumption and increased battery life, for example of mobile electroluminescent devices, as well as for increased efficiency and lifetime in such devices.

Organic electroluminescent device comprising a hole injection layer and electron injection layer with zero-valent metal