Method and apparatus are provided responsive to the circuit parameters at one or more locations of an electrical power transmission and/or distribution network for detecting protective device operation. The detection of the protective device operation is utilized to locate faults and also to ascertain the status of protective devices. This information is useful in automated power systems for desirable isolation and sectionalizing of faults for optimum restoration of the network. A fault detection unit of the present invention is responsive to sensed circuit parameters and provides at least first and second outputs indicative of protective device operations that open the circuit. The first output is provided upon the occurrence of an overcurrent followed by the loss of a circuit parameter, such as voltage, for a specified time duration. In a preferred arrangement, the timing for a specified time duration is started when the overcurrent ends. Thus, rapid detection is achieved since the specified time duration need not include the maximum operating time of the protective device. The second output is provided if the conditions for the first output are satisfied and the loss of the circuit parameter continues for a specified extended time interval corresponding to the sequence of operation of the upstream protective device so as to establish protective device operation. For example, the first output in one illustrative arrangement corresponds to the opening of a recloser while the second output corresponds to the lockout of the recloser. In a preferred arrangement, a third output is provided upon the occurrence of an overcurrent for a specified time duration. A fourth output is provided upon the occurrence of an overcurrent for a specified time duration and the presence of voltage after the occurrence of the first output for purposes of detecting downstream fuse operation on power systems utilizing fuse-saving arrangements.

1. Field of the Invention
The present invention relates generally to the field of electrical power transmission and distribution systems and more particularly to method and apparatus for determining protective device operations and locating fault conditions via the monitoring and detection of system conditions obtained from sensed circuit parameters.
2. Description of the Related Art
In electrical power distribution systems, various customers and users are supplied with electricity in networks such that power may be provided to the users from more than one system network path or more than one source. In this manner, faults may be isolated via sectionalizing while maintaining power delivery to the users who are not in the immediate vicinity of the faulted section; i.e., where the fault occurs. To achieve this purpose, a variety of devices are arranged throughout the distribution system at appropriate locations to efficiently provide for the interruption and isolation of faults. These devices include fuses, circuit breakers, reclosers, sectionalizers, and remotely and locally operated distribution switches.
The circuit breakers are located near the sources of the supply to the distribution system. Additionally, reclosers are located farther (downstream) from the points of supply at the breakers. Breakers and reclosers include the sequenced operation of reclosing cycles in the presence of overcurrents whereby the delivery of electric power is interrupted via the opening of the circuit for predetermined intervals followed by the closing of the circuit. Hereafter, breakers and reclosers are utilized interchangeably. The reclosing sequence continues until either the fault is cleared or a predetermined number of reclosing operations have taken place (e.g. , four) whereupon the recloser locks out to continuously open the circuit until appropriate action can be taken by maintenance personnel to repair the circuit. In this manner, momentarily occurring overcurrents or fault conditions which are self-clearing allow the restoration and maintenance of power delivery to the system without permanent opening (lock out) of the circuit.
Farther downstream from the source of supplies of the network, sectionalizers may be provided which are arranged to count the number of recloser operations. After a particular number of counts, for example three where the recloser has a total of four sequences of operation, the sectionalizer will open during the recloser open time so as to isolate a particular fault and allow the recloser to successfully reclose. At other locations, such as in branch sections or feeder lines, fuses may be provided which are coordinated with the other protective devices to sense overcurrents and faults so as to interrupt current before the operation of the circuit breaker, reclosers, and/or sectionalizers. Additionally, distribution switches capable of remote or local operation are provided at various points along the network to provide suitable isolation, sectionalizing, and re-routing of power via different sources.
Information about system operation and control of the system can be provided from each distribution switch or circuit point to a master station via suitable communication channels--radio, fiber-optics, land lines, or power-line carrier. For example, information can be obtained corresponding to the lockout condition of particular breakers as well as the voltage and current at particular points in the network. Additionally, fault indicators can be provided at suitable points to report as to the location of the fault on the network. Control of the system is available via the remote operation of sectionalizing devices equipped with remote terminal units (RTU's).
While particular information about parameters at the remote locations is available to a master station, the lockout condition in some systems is not readily discernable, and the determination of upstream protective device operations and the location of faults is only generally ascertainable at the master station. Additionally, presently available methods can erroneously respond as a result of magnetizing inrush currents, cold-load pickup, and backfeed conditions. Thus, the location of a fault is not confidently known via the information received at the master station. Accordingly, the remote terminal units and the distribution switches along the network cannot be utilized to efficiently locate, isolate, and restore the system after the occurrence of a fault or overcurrent condition.


The present invention provides a lighting system for lighting the interior of an enclosure. The enclosure has at least one movable door or drawer for opening and accessing the interior of the enclosure. The lighting system includes a light assembly with a lower casing and an upper casing. The light assembly also includes a plurality of light emitting diode (LED) mounted within the upper casing, at least one battery mounted within the upper casing, electrical circuitry connecting the plurality of LED's to the battery, a means for mounting the lower casing to a surface, and a electrical receptacle mounted within the lower casing. The lighting system further includes a magnetic switch including an electrical cable or harness. The cable has an electrical plug configured to electrically mate with the receptacle of the lower casing. The magnetic switch has a means for mounting to an interior enclosure surface. The electrical cable or harness allows mounting of the magnetic switch at a location within the enclosure away from the light assembly. The lighting system further includes a magnet having a means for mounting the magnet to the enclosure door. The magnet is positioned in proximity to the magnetic switch when the enclosure door is in a closed position. Upon installation of the lighting system, the plug of the magnetic switch is mated with the electrical receptacle of the lower casing. The battery, magnetic switch, circuitry, and the LED are arranged, mounted, and electrically interconnected within the enclosure. When the enclosure door is opened, the magnet is removed from proximity to magnetic switch, the circuitry connects power from the battery to the plurality of LED's, and the LED's light the enclosure interior.

1. Field of the Invention
The present invention generally relates to apparatuses and systems for use in enclosure lighting. More particularly, the present invention relates to a battery powered apparatus and system for aftermarket and retro-fit use as enclosure lighting.
2. Description of the Related Art
The modern home, garage, and office environment has many enclosures in the form of cabinets, draws, toolboxes and furniture. The enclosures are often dark and poorly lighted. The location of the enclosure within the home, garage, or office determines the available ambient lighting conditions, and the available lighting is often inadequate to view the enclosure contents. To date there is little prior art designed to conveniently aid in lighting the contents of an existing cabinet, whether the limited visibility is due to poor room lighting, no lighting, or deep shelving units. Thus, there is a need for a lighting system to be easily added within a variety of enclosure types by an unskilled homeowner or office worker so that the contents are readily viewed and accessible when the cabinet is opened.
Prior art solutions to cabinet lighting are often built into the cabinet and require AC power and the associated requirement of a receptacle close to the enclosure. In every home or office, many enclosure exist which do not have built in lighting. Aftermarket lighting systems are often complex to install and still require an AC power source. The light intensity required to light a simple cabinet is low. The AC powered systems of the prior art are often overkill to the lighting requirements in a dark kitchen cabinet.
In adding an aftermarket light source to an existing cabinet or other enclosure, the homeowner or office worker is faced with installation. Many prior art lighting systems use a push button or toggle switch to enable the light when the cabinet door is opened. The switches are often fussy on mounting location and operating tolerances and their installation is often outside the skill level of the homeowner or office worker. In prior art systems designed for easy installation, the switch for sensing the door position is often integral with the housing containing the light source. This all-in-one design makes positioning the unit within the cabinet complicated, and the unit often interferes with the utility of the enclosure as a storage space. The all-in-one prior art designs require the light source be placed at a non-optimum location for lighting the enclosure interior, i.e. beside the enclosure door. Moreover, many cabinets have more than one door, and the prior art systems only illuminate the cabinet interior when the switched door is opened. The door designs of various enclosures offer an additional challenge to prior art switch installations. For example, modern cabinets use full overlay, partial overlay and recessed doors. The switch installation must be customized for each type of door and enclosure shape. The prior art switch installation often requires cutting, drilling, or other modifications of the enclosure structure and door.
Some prior art systems have used complex infa-red, or other wireless connection, with signals and circuitry to connect the door sensing switch to the light unit. These units are overly complex for the task at hand and their price point is often a deterrent to use in a simple cabinet with poor lighting.
According, it would be advantageous to provide a lighting system for installation in a variety of enclosure types which does not require AC power. The system should be affordable and allow retro-fit into existing cabinetry or other enclosures. The system installation should be readily within the skills of a homeowner or office worker. The system should allow the placement of the light source at the optimum location within the enclosure. The system should provide for simple installation of a switch to sense the opening and closing of the enclosure door, and activate the light when the door is open. Enclosures having multiple doors should be easily accommodated and the system should operate when any one of the doors is opened. It is thus to such an enclosure lighting system that the present invention is primarily directed.


Systems, methods, and software for handling circuit switch fallback (CSFB) communications are provided herein. A method of operating a wireless communication device includes wirelessly registering with the first communication network to receive a wireless data service, and after the registration with the first communication network with an enabled CSFB configuration, wirelessly registering with a second wireless communication network to receive a wireless circuit switched voice service. The method also includes identifying a service problem with the second wireless communication network, and in response, de-registering from the first wireless communication network and disabling the CSFB configuration. The method includes, after disabling the CSFB configuration, re-registering with the first wireless communication network to receive the wireless data service. After the re-registration with the first wireless communication network, the method includes exchanging voice communications over the wireless data service of the first wireless communication network without using the CSFB services.

Wireless communication systems typically include wireless access systems with equipment such as wireless access nodes along with various control and routing nodes which provide wireless access to communication services for wireless communication devices over wireless links. A typical wireless communication system includes systems to provide wireless access across a geographic region, with wireless coverage areas associated with individual wireless access nodes. The wireless access systems exchange user communications between wireless communication devices, service providers, and other end user devices. The user communications typically include voice calls, data exchange, web pages, streaming media, or text messages, among other communication services.
In some wireless communication systems, more than one wireless communication protocol or wireless frequency spectrum can be employed across more than one wireless network. For example, a first wireless network employing a first wireless communication protocol can be deployed along with a second wireless network employing a second wireless communication protocol. Separate wireless access equipment can be deployed for each wireless network, such as when a fourth generation (4G) Long Term Evolution (LTE) wireless network is deployed over a similar geographic area as a third generation (3G), legacy, or other non-LTE wireless network. Wireless communication devices can be configured to support multiple wireless access modes, such as communicating with one or more wireless networks.
Voice services or overhead signaling for the voice services of legacy wireless networks can be provided over other non-legacy wireless communication networks. In some examples, circuit switched fallback (CSFB) techniques are employed to carry overhead signaling for voice communications of a legacy wireless communication network over the overhead signaling or data services of another wireless communication network.
Overview
Systems, methods, and software for handling circuit switch fallback communications in wireless communication networks are provided herein. In one example, method of operating a wireless communication device that is initially configured to use circuit switch fallback (CSFB) services over a first wireless communication network is provided. The method includes wirelessly registering with the first communication network to receive a wireless data service, and after the registration with the first communication network and responsive to an enabled CSFB configuration, wirelessly registering with a second wireless communication network to receive a wireless circuit switched voice service. The method also includes identifying a service problem with the second wireless communication network, and in response, de-registering from the first wireless communication network and disabling the CSFB configuration. The method includes, after disabling the CSFB configuration, re-registering with the first wireless communication network to receive the wireless data service. After the re-registration with the first wireless communication network, the method includes exchanging voice communications over the wireless data service of the first wireless communication network without using the CSFB services.
In another example, wireless communication device that is initially configured to use circuit switch fallback (CSFB) services over a first wireless communication network is provided. The wireless communication device includes a transceiver portion configured to wirelessly register with the first communication network to receive a wireless data service. After the registration with the first communication network and responsive to an enabled CSFB configuration, the transceiver portion is configured to wirelessly register with a second wireless communication network to receive a wireless circuit switched voice service. The wireless communication device also includes a processing system configured to identify a service problem with the second wireless communication network, and in response, de-register from the first wireless communication network and disable the CSFB configuration. After disabling the CSFB configuration, the transceiver portion is configured to re-register with the first wireless communication network to receive the wireless data service. After the re-registration with the first wireless communication network, the transceiver portion is configured to exchange voice communications over the wireless data service of the first wireless communication network without using the CSFB services.

Circuit switch fallback handling for wireless communication devices in wireless communication networks


An LED lamp is described, the LED lamp comprising an LED unit, e.g. provided on a base, in an embodiment, a fitting for contacting a power supply, and a light guide arranged to receive a light beam from the LED unit and guide the light beam towards a first light diffusing surface thereby providing a diffused light beam and whereby the light guide further comprises a second light diffusing surface facing the first light diffusing surface for diffusing at least part of the diffused light beam. The LED lamp as described enables to provide an omnidirectional light distribution, comparable to the light distribution of a conventional filament based light bulb.

At present, conventional lighting applications such as light bulbs are being replaced by LED-based lighting applications. As such, LED lamps are known that are provided with a conventional screw fitting (e.g. an E27 fitting) and a base part in or near the screw fitting to house the electronics for driving the LED lamp. Such LED lamps are e.g. known from U.S. Pat. No. 6,227,679. U.S. Pat. No. 6,227,679 e.g. discloses an LED lamp having a base provided with a plurality of LEDs (as e.g. illustrated in U.S. Pat. No. 6,227,679) having different orientations as a single LED does not, in general, provide an illumination pattern substantially covering 360°. Typically, the base part of such an LED lamp can be comparatively large, and may thus prohibit light to be radiated in directions substantially towards and beyond the fitting. Therefore, replacing a conventional filament based light bulb of an existing light fixture by a known LED lamp may result in a changed, undesired illumination pattern. Phrased differently, a substantially omni-directional illumination pattern (as e.g. obtained from a filament light bulb) may be difficult to realise with known LED lamps; as such, known LED lamps are not suited to replace incandescent light bulbs in all current applications.
Furthermore, known LED-based lamps may have a substantially different appearance compared to filament based lamps. Therefore, in applications where the typical appearance of e.g. a filament based light bulb is desired or wanted, e.g. an application where the user has a direct view on the incandescent light bulb, a replacement of the existing light bulb by a known LED lamp may have a low acceptance by the user.
In view of the above drawbacks of known LED lamps, it is an object of the present invention to provide an LED lamp that is better suited to provide illumination conditions comparable to conventional light bulbs.

LED lamp comprising light guide including first and second diffusing surfaces


A collation method and apparatus that is immune from singularization faults which disrupt the collation process. Each signature is loaded into individual grippers of a power and free gripper conveyor system. Those grippers that experience a miss or a double are diverted out of the process stream. Only those grippers that carry one and only one signature are allowed to continue on in the primary signature queue. The grippers that continue on in the primary signature queue are re-queued into a sequential order which eliminates gaps in the queue. The collation machine accepts signatures from the downstream end of the signature queue as the singularization process continues to add signatures to the upstream end of the signature queue. The singularizer uses a track and diverter structure, where grippers without a signature are diverted to the diverter structure and grippers with a signature continue on the track to a collator.

1. Field of the Invention
The present invention relates to an apparatus and method for singularizing articles. In particular, the present invention relates to a apparatus and method for singularizing signatures which reduces or eliminates missing, doubling, or feed jams of signatures in the collation process.
2. Description of the Prior Art
Prior art apparatuses for collating signatures, such as sheets, are known. In such apparatuses, signatures are generally loaded into hoppers that are mounted on the collation machine. The collation machine removes signatures one at a time from each desired hopper, and thereafter collates the removed sheets into a bundle. However, the prior art collation machines can result in faults in the collation process, resulting in incorrect, incomplete, and unusable bundles. For example, faults can occur when the collation machine causes a miss, a double, or a feed jam at a particular hopper. A miss occurs when the collation machine fails to remove a sheet from a particular hopper. A double occurs when the collation machine removes more than one sheet from a particular hopper for a particular bundle. A feed jam occurs when the sheet or sheets removed from a hopper become jammed in the collation machine. In each case, these faults negatively impact the production efficiency of the collation machine.
Misses and doubles result in unusable and erroneous bundles being ejected from the collation machine, or require that the machine be stopped to replace the missed sheet or to remove the doubled sheet. As an alternative, the collation machine can inhibit the hoppers that are downstream of the miss or double, resulting in a partially collated bundle being ejected and leaving an empty space in the production cycle.
Jams halt the collation process and require stopping the machine and intervention in order to clear the jam and restart the machine to allow the machine to continue operation. All of these solutions decrease the efficiency of the collating process, and can result in significant waste of material. As the number of hoppers in a collating machine increase, the risk of faults occurring increases exponentially, thereby reducing the effectiveness of the machine.

Singularizer with magnetically diverted gripper conveyor and method of singularizing


A process for the delignification and bleaching lignocellulosic-containing pulp, in which the pulp is delignified with an organic peracid or salts thereof, treated with a complexing agent, washed and subsequently bleached with a chlorine-free peroxide containing bleaching.

Chlorine-free bleaching agents have long been used for bleaching mechanical pulps. In recent years, it has become increasingly common to bleach also chemical pulps with chlorine-free bleaching agents, such as hydrogen peroxide and ozone, even in the first stages. It has been considered necessary to pretreat the pulp directly after digestion and an optional oxygen-delignifying stage so as to avoid deteriorated pulp properties and an excessive consumption of the bleaching agent. Pretreatment of the pulp primarily involves acid treatment and treatment with a complexing agent or salts of alkaline-earth metals, optionally in combination. Strongly acid pretreatment removes desirable as well as undesirable metal ions from the original positions in the pulp. Treatment with suitable complexing agents primarily removes the undesirable metal ions, while the desirable ones are largely retained. Treatment with salts of alkaline-earth metals maintains or reintroduces the desirable metal ions.
EP-A-0 402 335 thus discloses the pretreatment of chemical pulp with a complexing agent directly after digestion or oxygen delignification, to make a subsequent alkaline peroxide bleaching more efficient.
EP-A-0 480 469 relates to delignification of lignocellulose-containing pulp with oxygen. The pulp can be delignified or bleached before or after the oxygen stage with peroxide-containing compounds, such as hydrogen peroxide or peracetic acid, chlorine dioxide and/or ozone. Use of sequences with both peracetic acid and hydrogen peroxide, results in a significant decrease in pulp viscosity.
U.S. Pat. No. 5,091,054 describes a process where a pulp is treated with a sequence in two steps. In the first step peroxomonosulphuric acid, i.e., Caro's acid (=an inorganic acid containing sulphur), is added. A complexing agent may be added in the treatment with Caro's acid. In the second step the pulp is bleached with peroxide and/or oxygen.
With increasingly stringent environmental standards, there is a growing need for completely chlorine-free processes for delignifying and bleaching lignocellulose-containing pulps. To produce fully bleached pulps with unaltered strength properties in a reasonable number of stages and with a reasonable consumption of bleaching agents, it has become necessary to consider using also powerful, and hence difficultly-controlled, bleaching agents having a high delignifying and/or bleaching capacity.

Process for delignification of lignocellulose-containing pulp with an organic peracid or salts thereof


Techniques for the identification of a spike-processing circuit are provided. An exemplary method includes receiving spike trains corresponding to a circuit input over a time period, and selecting a number of spikes for each of input spike trains over a predetermined time window. Each of the selected spikes can be replaced with a sampled reproducing kernel to obtain a plurality of signals, and each obtained signal can correspond to one of the input spike trains. Each of the obtained signals can be passed through a plurality of receptive fields or filters to obtain an aggregate filter output signal. The filter output signal can be encoded into an output spike train, and the output spike train can correspond to a response of the circuit to the plurality of input spike trains.

One aspect of sensory neuroscience is the development of techniques for understanding the functional organization of sensory systems. Comprehensive models of sensory processing can suffer at least in part due to a lack of methods for estimating spike-processing neural circuits in higher brain centers.
Certain neural circuit models and methods for their identification can assume rate-based systems, and can consider both the input (stimuli) and the output (response rates) to be in the continuous domain. However, outputs of most neurons in a sensory system can be sequences of all-or-none action potentials. Furthermore, input signals can be continuous in some cases only for neurons located at the sensory periphery. In contrast, input signals for neurons upstream of sensory neurons can be spatiotemporal spike trains. As such, there is a need to develop a framework for the estimation of both receptive fields in the periphery and of spatiotemporal spike processing upstream.

Systems and methods for identification of spike-processing circuits

THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK


A laser measuring system for continuous measurement of at least one join of pipe being inserted into or removed from a wellbore. The laser measuring system can have a laser housing with a laser surface velocimeter. The laser housing with a laser arm can be connected to a support member with an upper mounting member and an upper rubber pipe wiper and a lower plate with a lower rubber pipe wiper. The laser surface velocimeter can communicate via a network to a computer processor and data storage for measuring pipe joint length in real time. A pressurized gas port can pressurize the laser housing above ambient pressure to keep a laser beam clear of particulate and well fluids. The laser beam used to detect and calculate length and quantity of joints of pipe moving past the laser beam transmitting the information to the computer processor real time.

A need exists for an automated, remote controlled laser measuring system for use with joints of pipes in real time as the joints of pipes are pulled from a wellbore or inserted into a wellbore.
A further need exists for an accurate controllable laser measuring system with a housing supported off the ground and surrounding the joints of pipes being removed from or inserted into a wellbore.
The present embodiments meet these needs.
The present embodiments are detailed below with reference to the listed Figures.

Laser measuring system for joints of pipes


An improved enclosure for increasing the sealed storage capacity of pick-up boxes of vehicles that tow fifth-wheel camping or recreational vehicles or fifth-wheel utility or horse trailer vehicles is disclosed. The enclosure forms a weatherproof seal with the box in a manner that seals the entire box except for around the hitch and for a hitching access path from the tailgate to the hitch. A wear-resistant plate and flexible boot combination cooperate with a cradle assembly to provide a weatherproof seal and to direct rain out of the box. The enclosure assembly requires no connections with the towed vehicle.

1. Field of the Invention
This invention relates generally to towing vehicles and more particularly to a hitch and enclosure configuration for a pick-up truck adapted to tow recreational fifth-wheel, horse or utility fifth-wheel trailers.
2. Description of the Art
Fifth-wheel trailers have become a popular form of recreational vehicle due to the increased living area provided by the forward portion of the vehicle, which extends over the back of the towing vehicle without increasing the overall length of the combined towing and towed vehicles. Such recreational vehicles are normally towed by a conventional pick-up truck, with the towing hitch mounted within the box of the truck so as to generally overlie the truck's rear axle. The general followed procedure for connecting the trailer for towing by the pick-up truck is to position the trailer's hitching apparatus at a vertical height that is slightly above that of the towing vehicle's hitching mechanism mounted in the box of the pick-up truck, to lower the pick-up truck tailgate, and to align and back the pick-up truck toward the trailer until the trailer's hitch matingly engages the hitch mounted on the pick-up. For pick-up's with conventional tailgates, the tailgate must be lowered and raised before and after the hitching process in order to respectively enable unimpeded movement of the trailer hitch within the pick-up box and to re-close the end of the box.
Most purchasers of fifth-wheel camping or recreational vehicle trailers prefer to use most or all of the pick-up box area not used by the hitch, for storage of valuables. A number of enclosure configurations have been designed for such purpose, which generally include one or more weatherproof and lockable storage compartments. For storage reasons it is desirable to have the entire pick-up box volume enclosed. However, the hitch portion mounted in the central portion of the box makes such enclosure difficult. Since the hitch assembly moves in operative use, a solid hitch enclosure for fifth-wheel vehicles is generally impractical. Therefore, a number of enclosure designs have left the hitch assembly area unenclosed. One problem with leaving the hitch assembly open to the environment is that rain water can collect within the pick-up bed, thereby damaging the contents of the box or otherwise making it unsuitable for storage purposes. It would also be desirable to protect the hitching apparatus itself from the external environment.
Various techniques have been employed to enclose the hitch assembly, but all such attempts have heretofore been impractical. One technique uses a cover or lid member that is secured in place rearward of the hitch assembly once the trailer is secured to the hitching assembly. Due to the relatively small clearance between the bottom of the overhanging trailer portion and the top surfaces of the pick-up sidewalls, it is difficult and time consuming to secure such an enclosing lid in place. Furthermore, the lid must be physically removed before the trailer can be detached. Another approach has been to enclose the hitch assembly by means of a flexible boot assembly extending from a cover of the pick-up box, up toward the underside of the forward portion of the trailer. Such prior art boots are typically secured to the trailer by means of straps or flexible chord members that are hooked to the underside of the trailer once the trailer has been secured to the hitch. Such process is tedious and time consuming. Also, such method does not provide a weatherproof seal to the hitch area and rain or mist can still enter the pick-up box cavity through the top of such boot. Further, such techniques are unreliable since the straps and fasteners used can be pulled apart as a result of relative twisting and turning motion between the trailer and pick-up box as the trailer is towed and require the boot to be detached from the trailer when making sharp corners, or when backing into tight spaces.
The present invention addresses these shortcomings of the prior art and provides a reliable, secure means for weatherproofing the hitch assembly in a manner that maintains the security of the enclosed storage areas of the pick-up box, and in a manner that requires no additional connections to the trailer. The present invention provides such an apparatus that eliminates rain water from entering the box. Except for those operations requiring activation of the hitch linkage mechanism, the present invention does not require an operator to move any pieces or parts of the enclosure assembly during the hitching or unhitching operations, nor does it require him to raise or lower the tailgate during such operations.

Trailer hitch and towing vehicle enclosure apparatus


A substrate processing unit includes: a vertically-movable substrate holder for holding a substrate; a pan surrounding a periphery of the substrate holder; a cell, located below the substrate holder and within the pan, having in its interior a chemical processing section; and a cell cover, capable of closing a top opening of the cell, having a plurality of spray nozzles for separately spraying at least two types of processing liquids, wherein the pan and the cell each have an individual liquid discharge line.

1. Field of the Invention
The present invention relates to a substrate processing unit and a substrate processing apparatus, and more particularly to a substrate processing unit and a substrate processing apparatus which are useful for forming a protective film, for example, by electroless plating, on exposed surfaces of embedded interconnects of a conductive material (interconnect material), such as copper or silver, embedded in fine interconnect recesses provided in a surface of a substrate, such as a semiconductor wafer.
The present invention also relates to a substrate holding apparatus and a substrate holding method which can be advantageously used in processing a surface (processing surface) of a substrate with a plating solution or other processing liquid.
2. Description of the Related Art
As a process for forming interconnects in a semiconductor device, a so-called "damascene process", which comprises embedding a metal (conductive material) into trenches and contact holes, is coming into practical use. According to this process, aluminum, or more recently a metal such as silver or copper, is embedded into trenches and contact holes previously formed in an interlevel dielectric film. Thereafter, an extra metal is removed by performing chemical-mechanical polishing (CMP) so as to flatten a surface.
In a case of interconnects formed by such a process, for example copper interconnects formed by using copper as an interconnect material, embedded interconnects of copper have exposed surfaces after flattening processing. In order to prevent thermal diffusion of such interconnects (copper), or to prevent oxidation of such interconnects (copper) e.g. during forming thereon an insulating film (oxide film) under an oxidizing atmosphere to produce a semiconductor device having a multi-level interconnect structure, it is now under study to selectively cover exposed surfaces of interconnects with a protective film (cap material) composed of a Co alloy, a Ni alloy or the like so as to prevent thermal diffusion and oxidation of the interconnects. Such a Co alloy, a Ni alloy or the like can be produced e.g. by performing electroless plating.
As shown in FIG. 1, for example, trenches 4 as fine interconnect recesses are formed in an insulating film (interlevel dielectric film) 2 of SiO2, low-k material film or the like which has been deposited on a surface of a substrate W, such as a semiconductor wafer. A barrier layer 6 of TaN or the like is formed on an entire surface, and then copper plating, for example, is performed on the surface of the substrate W to fill the trenches 4 with copper and deposit copper film on the surface of the substrate W. Thereafter, CMP (chemical-mechanical polishing) is performed on the surface of the substrate W so as to flatten the surface, thereby forming interconnects 8 composed of a copper film in the insulating film 2. Thereafter, a protective film (cap material) 9 composed of a CoWP alloy film is formed e.g. by electroless plating selectively on surfaces of interconnects (copper) 8 to protect interconnects 8.
A common electroless plating method for selective formation of the protective film (cap material) 9 of the CoWP alloy film on the surfaces of interconnects 8 generally involves the following process steps. First, substrate W such as a semiconductor wafer, which has undergone a CMP process, is immersed in an acid solution e.g. of 0.5M H2SO4 at a solution temperature of e.g. 25° C. for e.g. one minute to remove CMP residue, such as copper, remaining on a surface of an insulating film 2. After cleaning (rinsing) a surface of the substrate W with a cleaning liquid such as pure water, the substrate W is immersed in a mixed solution, e.g. of PdCl2 and H2SO4, for e.g. one minute to adhere Pd as a catalyst to surfaces of interconnects 8, thereby activating exposed surfaces of interconnects 8.
Next, after cleaning (rinsing) the surface of the substrate W with a cleaning liquid such as pure water, the substrate W is immersed in a solution containing e.g. 20 g/L of Na3C6H5O7.2H2O (sodium citrate) at a solution temperature of e.g. 25° C., thereby performing a neutralization treatment of the surfaces of interconnects 8. Then, after cleaning (rinsing) the surface of the substrate W with e.g. pure water, the substrate W is immersed in a CoWP plating solution at a solution temperature of e.g. 80° C. for e.g. 120 seconds, thereby performing selective electroless plating (electroless CoWP cap plating) on activated surfaces of interconnects 8. Thereafter, the surface of the substrate W is cleaned with a cleaning liquid such as ultrapure water. The protective film 9 composed of a CoWP alloy film is thus formed selectively on the surfaces of interconnects 8 to protect interconnects 8.
As described above, when forming a protective film (cap material) composed of a CoWP alloy by electroless plating, a catalyst-application processing for applying a catalyst, for example Pd, to surfaces of interconnects is performed in advance. Further, removal of CMP residue, e.g. copper, remaining on an insulating film, which processing is necessary for preventing a protective film from being formed on the insulating film, is performed usually by using an inorganic acid, such as H2SO4 or HCl. On the other hand, an electroless plating solution is generally an alkaline solution. Accordingly, it is necessary to perform a neutralization step immediately before plating to stabilize a plating process, whereby processes are increased and a number of processing tanks in respective processes is increased. As a result, not only throughput is lowered, but also process control between the processes is complicated. Furthermore, the apparatus has an increased size and occupies a wide installation space in a clean room, leading to an increased cost of the clean room.
This is because though use of a single processing unit to perform different processings with different processing liquids can reduce a space for performing an entire process of substrate processing, and can also reduce energy necessary for substrate transportation, it is difficult to avoid mixing or dilution of different processing liquids when a single processing unit is employed for performing different processings using the different processing liquids.
On the other hand, a dip processing method, which involves immersing a substrate in a processing liquid to bring a surface (processing surface) of the substrate into contact with the processing liquid, has conventionally been employed for performing stable and uniform plating (e.g. electroless plating) of the substrate or stable and uniform pre-plating processing, cleaning or the like of the substrate. A substrate processing unit, adapted for the dip processing method, is generally provided with a substrate holding apparatus for holding a substrate while sealing a peripheral portion of a front surface of the substrate, so that when the substrate, held by the substrate holding apparatus, is immersed in a processing liquid for processing of the substrate, the processing liquid is prevented from intruding into a peripheral portion of the front surface and also into a back surface of the substrate.
A substrate holding apparatus, which employs a so-called vacuum attraction method, has been developed. Such a substrate holding apparatus includes a continuous, ring-shaped attracting seal (annular seal) composed of an elastic material such as a rubber, and presses this attraction seal against a substrate so as to bring an end surface of the attracting seal into tight contact with a peripheral portion of a back surface of the substrate over an entire circumference, and attracts and holds the substrate while sealing the peripheral portion of the back surface of the substrate in a ring shape with the attraction seal by vacuuming an interior of the attraction seal.
It is important for a substrate holding apparatus to be capable of completely releasing a substrate from a head without any load after processing. A conventional method, widely practiced in a substrate holding apparatus adapted for the above-described vacuum attraction method, for example, involves introducing a clean gas, such as N2 gas, into an attracting seal (annular seal) and jetting the gas toward a substrate, thereby releasing the substrate. In some cases, however, a substrate strongly sticking to an attracting seal, such as a rubber, cannot be released only by introduction of clean gas, such as N2 gas. A method is therefore employed to introduce pure water, together with a clean gas, into an attracting seal and jet them toward a substrate simultaneously, thereby securely releasing the substrate even when the substrate is strongly sticking to the attracting seal, which is of a material such as a rubber.
However, when employing a method involving simultaneous jetting of clean gas and pure water, e.g. in a substrate holding apparatus adapted for the vacuum attraction method, two circuits for introductions of a clean gas and of pure water are necessary in addition to a circuit for vacuuming, leading to a complicated circuit construction and an increased size of apparatus.
In performing processing, such as electroless plating, of a substrate while holding the substrate with a substrate holding apparatus, it is desirable to hold the substrate with a weakest possible force and uniformly over an entire surface so as not to cause deformation of the substrate, thereby ensuring accuracy of processing. In order to securely prevent release or fall of a substrate during a series of processings, however, the substrate is attracted or mechanically held by a substrate holding apparatus with a certain degree of holding force which would not cause release or fall of the substrate even when the substrate is rotated generally at a maximum rotational speed, for example, during draining (spin-drying). There are, therefore, cases in which a load is applied locally on a substrate to cause deformation, or a substrate strongly sticks to e.g. an attracting seal whereby release of the substrate becomes difficult.

This patent is subject to a terminal disclaimer.

Substrate processing unit and substrate processing apparatus


Methods, program products, and systems implementing adaptive data transmission are disclosed. A universal data collector can act as an intermediary between a log producer and a log processor. The universal data collector can be connected to the log producer through a first, reliable network. The universal data collector can be connected to the log processor through a second, less reliable network. The universal data collector can perform a multi-phase commit of data to ensure that the log data are saved by the log processor. The universal data collector can smooth the data transmission from the universal data collector to the log processor through a network, including adaptively buffering the log data according to available network bandwidth of the network.

A large organization often can have multiple smaller, remote facilities. At each of the facilities, multiple devices can produce a variety of log data. For example, a satellite office of a company can maintain multiple log sources. Log sources can include devices and applications, including web servers, email servers, routers, firewalls and communication gateways. Each of the log sources can produce log data, which can include one or more records relating to actions of the log source. These log data can be transmitted to one or more central processing servers using various log protocols.
An exemplary logging protocol is Syslog (Internet Engineering Task Force (IETF) proposed standard request for comment (RFC) 5424). Syslog allows separation of a log source that generates log data from a system that stores the log data and a system that reports and analyzes the log data. Syslog can transfer data using the user datagram protocol (UDP) or transmission control protocol (TCP). Today, Syslog does not guarantee reliable storage of the log data. In addition, Syslog does not provide a standard way of managing a wide area network (WAN) that connects a log source and the central processing server. The WAN can be slow, loss-prone, insecure, and potentially overloaded.


The present invention discloses application of a bile acid composite bacterial agent in the preparation of feed additives for mutton sheep. The bile acid composite bacterial agent comprises Parabacteroides distasonis bacterial suspension and bile acid, and the Parabacteroides distasonis bacterial suspension is obtained by cultivation and fermentation of Parabacteroides distasonis LCG-06 with the deposit number CGMCC No. 20820. The bile acid composite bacterial agent of the present invention has natural components and has no toxic and side effects, and can significantly increase the growth rate of mutton sheep and promote nutrition absorption, accelerate the decomposition of in vivo fat of mutton sheep, thereby reducing the body fat percentage of mutton sheep, increasing the slaughter weight and slaughter rate of mutton sheep, increasing the incomes for breeding of mutton sheep. Therefore, it has broad application prospects.

Mutton sheep is one of the most adaptable domestic animals to the external environment. With the improvement of the living standards of Chinese people, the demand for mutton sheep has gradually increased. Presently, allopatry fattening way is mainly adopted for mutton sheep. There are many ways for crops and livestock breeding. In the pasturing areas, due to prohibition and restriction of grazing, the feeding amount of ewes is reduced, leading to shortage of sheep. Moreover, due to lack of feeding standard, some fattening farms have no scientific feed ratio, which causes different sizes of mutton sheep. When there is lack of nutrition, yellow fat disease or increased fat content may occur, which will affect the quality of mutton sheep and the farming incomes of farmers. In addition, some veterinary drugs or other feed additives are used, which may have side effects and have residue in the body of mutton sheep. When people eat such mutton sheep, their health will be seriously threatened. Therefore, it is very necessary to develop an efficient natural bacterial agent that can improve the quality of mutton sheep.

Application of a bile acid composite bacterial agent in the preparation of feed additives for mutton sheep

Shandong Longchang Animal Health Product Co., Ltd.


An apparatus and method for driving an ink-jet printhead in which current is applied to a heater to heat ink to be supplied in an ink chamber to generate a bubble to eject ink from the ink chamber, the apparatus including a circuit that alternately applies current to the heater to alternate a direction of current flowing through the heater.

1. Field of the Invention
The present invention relates to an apparatus and method for driving an ink-jet printhead. More particularly, the present invention relates to an apparatus and method for driving a thermal ink-jet printhead that is able to extend a lifespan of a heater by alternately applying current pulses to the heater.
2. Description of the Related Art
In general, ink-jet printheads are devices for printing a predetermined image, color or black, by ejecting a small volume droplet of ink at a desired position on a recording sheet. Ink-jet printheads are generally categorized into two types depending on which ink ejection mechanism is used. A first type is a thermal ink-jet printhead, in which a heat source is employed to form and expand a bubble in ink to cause an ink droplet to be ejected due to the expansive force of the formed bubble. A second type is a piezoelectric ink-jet printhead, in which an ink droplet is ejected by a pressure applied to the ink due to a deformation of a piezoelectric element.
An ink droplet ejection mechanism of a thermal ink-jet printhead will now be explained in detail. When a current pulse is supplied to a heater, which includes a heating resistor, the heater generates heat and ink near the heater is instantaneously heated to approximately 700° C., thereby boiling the ink. The boiling of the ink causes bubbles to be generated and exert pressure on ink filling an ink chamber. As a result, ink around a nozzle is ejected from the ink chamber in the form of a droplet through the nozzle.
A thermal inkjet printhead is classified into a top-shooting type, a side-shooting type, and a back-shooting type depending on a bubble growing direction and a droplet ejection direction. In a top-shooting type of printhead, bubbles grow in the same direction in which an ink droplet is ejected. In a side-shooting type of printhead, bubbles grow in a direction perpendicular to a direction in which an ink droplet is ejected. In a back-shooting type of printhead, bubbles grow in a direction opposite to a direction in which an ink droplet is ejected.
An ink-jet printhead using the thermal driving method should satisfy the following requirements. First, manufacturing of the ink-jet printheads should be simple, costs should be low, and should facilitate mass production thereof. Second, in order to obtain a high-quality image, cross talk between adjacent nozzles should be suppressed while a distance between adjacent nozzles should be narrow; that is, in order to increase dots per inch (DPI), a plurality of nozzles should be densely positioned. Third, in order to perform a high-speed printing operation, a period in which the ink chamber is refilled with ink after being ejected from the ink chamber should be as short as possible and the cooling of heated ink and heater should be performed quickly to increase an operating frequency.
FIG. 1 illustrates an exploded perspective view of a conventional thermal ink-jet printhead. FIG. 2 illustrates a cross-sectional view for explaining a process of ejecting an ink droplet using the conventional thermal ink-jet printhead of FIG. 1.
Referring to FIGS. 1 and 2, the conventional thermal ink-jet printhead includes a substrate 10, an ink chamber 26, which is formed on the substrate 10 and stores ink therein, partition walls 14, which define the ink chamber 26, a heater 12, which is disposed within the ink chamber 26, a nozzle 16, through which an ink droplet 29′ is ejected, and a nozzle plate 18, through which the nozzle 16 is formed. In operation, a current pulse is supplied to the heater 12 to generate heat, such that ink 29 filled in the ink chamber 26 is heated, thereby generating a bubble 28. The generated bubble 28 is continuously expanded such that pressure is applied to the ink 29 filled in the ink chamber 26, thereby ejecting the ink droplet 29′ out of the printhead through the nozzle 16. Subsequently, ink 29 from a manifold 22 is introduced into the ink chamber 26 through an ink channel 24. Resultantly, the ink chamber 26 is refilled with ink 29.
FIG. 3 is a circuit diagram of a first conventional circuit for driving a thermal ink-jet printhead. FIG. 4 is a diagram illustrating pulses of the first conventional circuit of FIG. 3.
Referring to FIGS. 3 and 4, in a circuit to which a positive voltage V1 is constantly applied as a supply voltage pulse VCC to drive an ink-jet printhead, a current pulse IH is supplied to a thin film heater 30 using a drive signal SDR and a field effect transistor (FET). According to the conventional circuit, since a current flows in a constant direction through the heater 30, damage to the heater 30 may occur due to electromigration. Recently, attempts to reduce an amount of energy applied to a high-density printhead by reducing a thickness of a heater therein have been made. As the heater becomes thinner, however, damage to the heater due to electromigration becomes a more serious problem.
FIG. 5 is a circuit diagram of a second conventional circuit for driving an ink-jet printhead. FIG. 6 is a diagram illustrating pulses of the second conventional circuit of FIG. 5.
Referring to FIGS. 5 and 6, in a circuit to which a supply voltage pulse VCC is supplied to drive an ink-jet printhead, a current pulse IH is supplied to a heater 50 using a drive signal SDR and a driving electric FET. A current waveform is controlled by means of a pull down resistor and two electric FETs. According to the second conventional circuit, current waveform distortion, such as overshoot, may be reduced, and thus maximum current amplitude is lowered, which results in a decrease in damage to the heater 50 due to electromigration. As mentioned above, the second conventional circuit similarly has a similar in reducing the possibility of damage to the heater 50 that is caused by a decrease in a thickness of the heater 50.

Apparatus and method for driving an ink-jet printhead


A welding gun includes an actuator and welding tips. The actuator includes a stator coupled to a welding robot and a rotor rotatable relative to the stator about an axis of the actuator. The stator includes an axially extending portion and at least one circumferentially extending arm. The rotor includes an axially extending portion and at least one circumferentially extending arm. The welding tips are coupled to an end of the circumferentially extending arm of the stator and an end of the circumferentially extending arm of the rotor. Lengths of the axially extending portion of the stator and the axially extending portion of the rotor can be determined to any length so long as strength and rigidity are assured.

1. Field of the Invention
The present invention relates generally to a welding gun, and more particularly, to a welding gun supported by a robot.
2. Description of Related Art
Conventional welding guns are grouped into X-type (for example, disclosed in Japanese Patent Publication No. HEI 4-253576) and C-type.
In the X-type welding gun, as illustrated in FIG. 16, welding tips 4 and 5 are coupled to first ends 2A and 3A of two arms 2 and 3 which are pivotally coupled to each other at a connecting point 1, and a distance between second ends 2B and 3B of the two arms 2 and 3 is changed by an actuator 6 so that the welding gun is opened and closed. In the C-type welding gun, as illustrated in FIG. 17, welding tips 8 and 9 are coupled to opposite ends of a C-type frame, and a distance between the welding tips 8 and 9 is changed by an actuator 10 so that the welding gun is opened and closed.
However, because the welding tips of conventional welding guns move on a straight line, the arms and frame tend to interfere with a workpiece. This is illustrated in FIGS. 14 and 15 in which the interference is denoted by letter A. As a result, operation of the welding gun tends to be restricted. A maximum opening amount X.sub.1 of the welding tips and a protruding amount X.sub.4 of the welding tips from the body of the welding gun illustrated in FIGS. 16 and 17 tend to be restricted, so that the freedom in designing the welding gun is small.


A method forming a surface modifying composition with reduced need for organic solvent and evaporation thereof for removal of insoluble reaction byproducts from the composition. The purified composition can be used in the formation of articles having improved biocompatibility, such as medical articles (e.g., spun hollow fiber).

The present invention relates to a method for producing surface modifying compositions (SMCs) with improved byproduct removal and their use in the manufacture of articles made therewith.
Membranes which have selective permeabilities are widely used in various products, such as filtration media used in the medical field. Membranes having a form of hollow fiber are particularly suitable for the preparation of high area per volume membranes, such as hollow fiber membranes suitable for hemodialysis, hemofiltration, or hemodiafiltration. A variety of polymers, including polysulfone, polyethersulfone, cellulose, cellulose acetate, polyamides, polyacrylonitriles, polymethyl methacrylates, polyvinyl alcohols, polyolefins, and the like, have been used to form such hollow fiber membranes.
U.S. Pat. No. 8,318,867 describes surface modifying macromolecules (SMMs) with fluorinated end groups. The '867 patent indicates that the SMMs can be used in hollow fiber membrane filtration made from polyethylene, polypropylenes, or polysiloxane base polymers for fluid or gas separation, in films and nonwoven applications, e.g., surgical drapes, gowns, face masks, wraps, bandages, and other protective wear garments for medical technicians (e.g., overalls, labcoats), and in implantable medical devices (e.g., central venous catheters). The '867 patent further shows synthesis of SMMs with fluorinated end groups, which are washed in methanol, and the polymer is then transferred to a rotary evaporator and dried. U.S. Pat. No. 8,071,683 describes synthesis of surface modifying macromolecules (SMMs) with fluorinated end groups, which are washed repeatedly with methanol, then washed twice in THF/EDTA (tetrahydrofuran/ethylene diamine tetraacetic acid) to remove residual catalyst followed by more successive washes in THF/MeOH to remove unreacted monomers, low molecular weight byproducts, and catalyst residues, and then the SMM is dried in a flow oven and then dried under vacuum. The '683 patent also describes a synthesized SMM with fluorinated end groups that is washed successively in IPA/EDTA (isopropanol/EDTA) solution followed by another wash in IPA/hexanes to remove unreacted monomers, low molecular weight byproducts, and catalyst residues to provide a polymer that is then dried under vacuum prior to use.
A need exists for surface modifying compositions produced with byproduct removed and without the need and expense of evaporating off organic solvents. The compositions are capable of improving biocompatibility of polymer surfaces.

Method for providing surface modifying composition with improved byproduct removal


A free standing, upright sports goal structure (10) having a plurality of inflatable bladders to form the framework (19) of a standing goal structure, together with an outer casing (25) of non-elastic material which encloses the inflatable framework (19) and serves to form a strong rigid goal structure (10) which is useful in a plurality of sports, yet which can quickly and easily be erected or collapsed for convenient transportation and storage.

1. Field of Invention
This invention relates to inflatable structures and is particularly directed to portable inflatable structures for indoor and outdoor use as a sports goal, hoop, or basket.
2. Prior Art
In the past there have been numerous types of inflatable objects, such as balloons, simulated furniture, and various types of flotation devices. This invention is of an upright, free standing, inflatable goal, hoop or basket. It is composed of inflatable portions which are interconnected and include four equally spaced legs. Each leg in turn is connected by an arched section. Each arched section is attached to the circular hoop or goal creating one complete structure. A mesh netting is attached to the interior circumference of the circular hoop, hanging from the hoop or basket.


A semiconductor device manufacturing apparatus according to the present invention comprises a head for holding a semiconductor wafer, a retainer ring for surrounding the outer periphery of the semiconductor wafer held by the head, and a polishing pad for polishing a polished surface of the semiconductor wafer. This apparatus presses the polished surface of the semiconductor wafer against the polishing pad together with the retainer ring to polish the semiconductor wafer. The retainer ring used in the present invention has a surface that is in contact with the polishing pad, which increases a contact area of the retainer ring against the polishing pad in accordance with wear of the retainer ring.

1. Field of the Invention
The present invention relates to a semiconductor device manufacturing apparatus and method. More particularly, the present invention relates to a retainer ring provided in a CMP (Chemical Mechanical Polishing) apparatus for polishing a semiconductor wafer, and a method of manufacturing a semiconductor device using the CMP apparatus.
2. Description of the Related Art
An increasingly strict level of flatness has been required for the surface of semiconductor devices for patterning thereon in semiconductor device manufacturing steps as wires become finer and finer. Then, after the design rule of semiconductor devices was reduced to less than 0.35 μm, CMP apparatuses are generally used to directly polish the surface of semiconductor devices.
This CMP apparatus can improve the uniformity and planarity of the surface of a micromachined semiconductor device, and is particularly effective for eliminating steps on the surface of the semiconductor device.
FIG. 1 generally shows a head section of a CMP apparatus related to the present invention.
Head 3 of the CMP device is a main component for pressing semiconductor wafer 5 against polishing pad 8 to perform a polishing action. Head 3 comprises a resin-made retainer ring 1 for holding semiconductor wafer 5 which is being polished by head 3. This ring has not only a function of guiding semiconductor wafer 5 subjected to the polishing but also a function of adjusting a polishing profile near the edge of the semiconductor wafer.
FIG. 2 schematically shows the action of retainer ring 1 during a polishing operation. During polishing, a certain pressure acts on the back surface of semiconductor wafer 5 from head 3 through rubber-made membranes 6a, 6b, 6c. In this event, it is ideal that the entire surface of semiconductor wafer 5 is uniformly pressed against the surface of polishing pad 8, but the applied pressure is made non-uniform in a region within several millimeters from the edge of semiconductor wafer 5 due to the influence of the counter-action of the downward deformation of polishing pad 8. For this reason, retainer ring 1 is provided in a shape which surrounds the outer periphery of semiconductor wafer 5. In this way, the region non-uniformly applied with the applied pressure is shifted from the bottom surface of semiconductor wafer 5 to the bottom surface of retainer ring 1, thereby uniformly applying the pressure within the wafer surface. Also, by changing the pressure to polishing pad 8 of retainer ring 1, the profile of polishing rate can also be changed around the outer periphery of semiconductor wafer 5.
Generally, retainer ring 1 has a flat surface which comes into contact with polishing pad 8. In addition, in order to promote a polishing material supplied to semiconductor wafer 5 and facilitate head 3 to dechuck from polishing pad 8, a groove is formed at a certain depth in some cases (for example, see Japanese laid-open patent publication No. 11-333712, Japanese laid-open patent publication No. 2002-124492 and the like).
Describing the polishing operation of the CMP apparatus, after semiconductor wafer 5 is fixed with membranes 6a, 6b, 6c of head 3, semiconductor wafer 5 is moved above polishing pad 8, and retainer ring 1 is brought into contact with polishing pad 8 by using a predetermined pressure. Subsequently, semiconductor wafer 5 is pressed against the surface of polishing pad 8 with an air pressure through membranes 6a, 6b, 6c. In these circumstances, polishing pad 8 is being applied with a rotating motion about the center thereof, and a polishing material is being supplied at the same time. The surface of the wafer is polished in this basic operation.
When the surface of such a wafer is polished, retainer ring 1 made of a resin is increasingly worn. The resin material most typically used for retainer ring 1 is PPS (polyphenylene sulfide), and retainer ring 1 made of PPS is worn down by approximately 0.1 mm to 0.5 mm after 1000 wafers are polished. In this regard, retainer ring 1 is replaced when the groove in the contact surface reaches a predetermined wear amount (approximately 1.5 mm) within a remaining range. Otherwise, a PEEK (polyether ether ketone) resin, a PET resin and the like are used as well as the above resins. With the PEEK resin, a wear amount is generally kept smaller than the PPS resin.
In the polishing apparatus as described above, as the surfaces of wafers are repeatedly polished, retainer ring 1 made of a resin is locally worn down more, resulting in a change in the shape of a surface of retainer ring 1 that is in contact with the polishing pad. In particular, the shape is changed near the outer periphery of retainer ring 1. As a result, the effective pressure of retainer ring 1 (contact pressure with polishing pad 8) increases, causing a change in the polishing rate near the edge of semiconductor wafer 5, and causing non uniform polishing of the wafer surface to be exacerbated.
As countermeasures to this, at present, the pressure of retainer ring 1 to polishing pad 8 is sequentially reduced in accordance with the degree to which retainer ring 1 is worn down. However, while the exacerbation of uniformity can be restrained to some degree, this action requires continuous condition adjustments and significantly hampers productivity.
Also, while more frequent replacements of retainer ring 1 is also taken into consideration, this is not a realistic solution. The reason is described with reference to FIG. 3. The graph of FIG. 3 shows the correlation of within-wafer uniformity of wafer polishing to the wear amount of retainer ring 1 when no adjustment is made to the pressure of retainer ring 1 toward polishing pad 8. The vertical axis of the graph indicates that a lower value represents higher (better) uniformity. What is noted in this graph is that the within-wafer uniformity largely changes (exacerbates) at an initial stage of retainer ring wear, such as a wear amount of 0 to 0.5 mm. This is because the shape on the outer peripheral side of retainer ring 1 largely changes at an initial stage of wear to increase the effective pressure. Since aging changes in within-wafer uniformity become obvious at the initial stage after the start of use, it can be said that the action involving a replacement of retainer ring 1 at an earlier stage cannot solve the aforementioned problem.
A further investigation was made on the use of a material exhibiting a low wear rate for members which form the parts of retainer ring 1. However, this action simply causes an initial wear stage, in which the within-wafer uniformity changes in large as shown in FIG. 3 and which continues for a longer period, and does not constitute an effective solution.

Semiconductor device manufacturing apparatus and method


A method of forming a conduit providing fluid communication between respective reservoirs of an ink tank, the method comprising the steps of: (a) forming a first orifice extending through a first external wall portion of an ink tank defining part of a first ink reservoir of the ink tank; (b) forming a second orifice extending through a second external wall portion of the ink tank defining part of a second ink reservoir of the ink tank; and (c) attaching a substrate over the first and second external wall portions at least about a first continuous seal line surrounding both the first and second orifices to define an external conduit communicatively connecting the first ink reservoir with the second ink reservoir.

The present invention concerns containers utilized to house liquids and, more specifically, to containers utilized to house liquid ink for inkjet printer applications. Ink containers may be integral with a printhead or communicatively connected thereto. In applications where replacement ink containers are communicatively connected to a permanent printhead, it is desirable that the container be able to supply ink in a predictable manner. Exemplary replacement ink containers may includes one or more chambers filled or partially occupied by liquid ink. To impart a predictable flow of ink from the container to the printhead, the container may house one or more backpressure mediums. Backpressure mediums are mediums that include pores through which liquids can flow, but that provide a resistance to flow resulting from capillary action. Typical backpressure mediums include felts, foams, and other fibrous mediums having pores sizes imparting predictable resistance to fluid flow from the resulting capillarity.
In order to increase the utilization of ink within a container, it is usually preferred that the backpressure medium occupy as little space as possible to satisfy the breathing requirements of the container. At the same time, less backpressure medium results in less control over the flow of ink from the container. In other words, a balance is generally arrived at that involves providing one chamber of the container having a backpressure medium (backpressure chamber) that is in communication with another chamber of the container housing only liquid ink or a combination of liquid ink and trapped gases (free ink chamber).
Conventional ink containers provide for transfer of liquid ink between free ink chambers and backpressure chambers using one or more openings through internal walls of the container that would otherwise separate the chambers. Typically, one or more internal walls step as a partition, but for an opening through the lower level of the wall to allow ink to travel from the free ink chamber and into the backpressure chamber only when the level of ink within the backpressure chamber drops below a predetermined point. This predetermined point typically coincides with the level of the opening between the chambers so that air bubbles from the backpressure chamber can flow into the free ink chamber to displace liquid ink, thereby driving liquid ink into the backpressure chamber until the level of ink within the backpressure chamber rises and cuts off the opening, discontinuing gaseous transfer into the free ink chamber and liquid ink transfer into the backpressure chamber.
Some embodiments of the instant invention provide an alternative to the internal wall openings and provides conduits that extend outside of the conventional ink container by utilizing a substrate mounted to the exteriors of the chambers that allow communication between the free ink chamber and the backpressure chamber, with or without requiring molding of openings within internal walls. Some embodiments also provide manufacturing alternatives that allow the formation of openings within the internal wall separating the chambers without requiring tooling to be substantially constrained by the dimensions of the ink container.
Some embodiments of the present invention to provide a method of forming a conduit providing fluid communication between respective reservoirs of an ink tank, that include the steps of: (a) forming a first orifice extending through a first external wall portion of an ink tank defining part of a first ink reservoir of the ink tank; (b) forming a second orifice extending through a second external wall portion of the ink tank defining part of a second ink reservoir of the ink tank; and (c) attaching a substrate over the first and second external wall portions at least about a first continuous seal line surrounding both the first and second orifices to define an external conduit communicatively connecting the first ink reservoir with the second ink reservoir.
In an embodiment, the method further includes the step of providing at least one depression in the first and second external wall portions extending between the first and second conduits. In another embodiment, the method further includes the steps of (i) forming a third orifice extending through a third external wall portion of the ink tank defining part of the first ink reservoir; (ii) forming a fourth orifice extending through a fourth external wall portion of the ink tank defining part of the second ink reservoir; and (iii) attaching a second substrate over the third and fourth external wall portions at least about a second continuous seal line surrounding both the third and fourth orifices to define a second external conduit communicatively connecting the first ink reservoir with the second ink reservoir. In a further embodiment, the first orifice is adjacent to a first felt member occupying at least a portion of an internal area of the first ink reservoir, and the second orifice is in direct communication with free ink occupying at least a portion of an internal area of the second ink reservoir.
In yet another embodiment, the first and second substrates include a single substrate and the single substrate comprises the first and second seal lines. In still another more detailed embodiment, the first orifice and the second orifice of the first ink reservoir are adjacent to a first felt member occupying at least a portion of an internal area of the first ink reservoir, the first orifice and the second orifice of the second ink reservoir are in direct communication with free ink occupying at least a portion of an internal area of the second ink reservoir, and the combination of the first conduit and the second conduit provides the exclusive manner for fluids to traverse between the first reservoir and the second reservoir. In a further embodiment, the substrate comprises a polymer film, and the first portion of the film is laminated to an exterior wall of the first ink reservoir and to an exterior wall of the second ink reservoir. In still a further detailed embodiment, the step of laminating the first portion of the substrate to the first ink reservoir and to the second ink reservoir includes at least one of heat staking, laser welding, ultrasonic welding, vibrational welding, and adhesive mounting a film to an exterior wall of the first ink reservoir and to an exterior wall of the second ink reservoir.
Some embodiments described herein include a method of forming a conduit providing fluid communication between respective reservoirs of an ink tank, the method comprising the steps of: (a) forming a first orifice through a wall of an ink tank and into communication with a first reservoir and a second reservoir of the ink tank; and (b) sealing a substrate to the ink tank to overlap the first orifice and form a first by-pass conduit communicatively connecting the first reservoir and the second reservoir.
In a more detailed embodiment, the method further includes the steps of: (i) forming a second orifice through the wall of the ink tank and into communication with the first reservoir and the second reservoir of the ink tank; and (ii) sealing the substrate to the ink tank to overlap the second orifice and form a second by-pass conduit communicatively connecting the first reservoir and the second reservoir. In yet another more detailed embodiment, the first reservoir comprises a free ink reservoir, and the second reservoir comprises a backpressure reservoir that is occupied by a backpressure media. In a further detailed embodiment, the combination of the first conduit and the second conduit provides the exclusive manner for fluids to traverse between the first reservoir and the second reservoirs and the substrate comprises a polymer film.
Some embodiments of the present invention provide an ink tank comprising: (a) a first reservoir for housing a liquid ink, the first reservoir including a first orifice through a wall at least partially defining an interior region of the first reservoir; (b) a second ink reservoir for housing a liquid ink, the second ink reservoir including a first orifice through a wall at least partially defining an interior region of the second reservoir; and (c) a first conduit overlapping the first orifice of the first ink reservoir and the first orifice of the second ink reservoir allowing fluid communication between the first reservoir and the second reservoir, the first conduit defined at least in part by a film mounted to the wall of the first ink reservoir and to the wall of the second ink reservoir.
In a more detailed embodiment, the first reservoir comprises a backpressure chamber housing at least one backpressure medium through which liquid ink traverses prior to exiting through an ink outlet orifice of the backpressure chamber, and the second reservoir comprises a free ink chamber housing liquid ink prior to entering the backpressure chamber. In yet another more detailed embodiment, the free ink chamber and the backpressure chamber share a common wall, and the common wall includes an opening therethrough providing a second conduit between the free ink chamber and the backpressure chamber. In a further detailed embodiment, at least one of the wall of the first reservoir and the wall of the second reservoir includes a furrow extending lengthwise in parallel with a line of travel between the first orifices. In still a further detailed embodiment, the ink tank further comprises: (i) a second orifice through the wall at least partially defining the interior region of the first reservoir; (ii) a second orifice through the wall at least partially defining the interior region of the second reservoir; and (iii) a second conduit overlapping the second orifice of the first ink reservoir and the second orifice of the second ink reservoir to allow fluid communication between the second orifices, the second conduit defined at least in part by a film mounted to the wall of the first ink reservoir and to the wall of the second ink reservoir.
Some embodiments of the present invention provide an ink tank comprising: (a) a first vessel defining a first ink reservoir; (b) a second vessel defining a second ink reservoir; and (c) a first by-pass conduit communicatively connecting the first vessel to the second vessel by way of a first orifice that concurrently exposes the first vessel and the second vessel, the first by-pass conduit comprising a first substrate overlapping the first orifice and enclosing one side of the first orifice to allow sealed fluid communication between the first vessel and the second vessel.
In a more detailed embodiment, the first reservoir comprises a free ink reservoir for supplying liquid ink to the second reservoir, and the second reservoir comprises a backpressure reservoir housing at least one backpressure medium through which liquid ink traverses prior to exiting through an ink outlet orifice of the second vessel. In yet another more detailed embodiment, the first vessel and the second vessel share a common wall that includes an opening therethrough directly linking the first reservoir to the second reservoir. In a further detailed embodiment, the ink tank further comprises a second by-pass conduit communicatively connecting the first vessel to the second vessel by way of a second orifice that concurrently exposes the first vessel and the second vessel. In still a further detailed embodiment, the second by-pass conduit comprises a separate substrate overlapping the second orifice and enclosing one side of the second orifice to allow sealed fluid communication between the first vessel and the second vessel. In a more detailed embodiment, the ink tank further comprises a second by-pass conduit communicatively connecting the first vessel to the second vessel by way of corresponding orifices that expose the first vessel and the second vessel, the second by-pass conduit comprising a second substrate overlapping the corresponding orifices and enclosing a side of the corresponding orifices to allow sealed fluid communication between the first vessel and the second vessel. In a more detailed embodiment, the first substrate and the second substrate comprise a polymer film.
Some embodiments of the present invention provide a method of facilitating fluid communication between chambers of an ink tank, the method comprising the steps of: (a) forming a hole through an exterior wall bounding a first chamber of an ink tank; (b) forming a hole through an exterior wall bounding a second chamber of an ink tank; and (c) sealing a film to the exterior wall of the first chamber and to the exterior wall of the second chamber to encompass the hole of the first chamber and the hole of the second chamber to create an external sealed conduit providing fluid communication between the first chamber and the second chamber.
Some embodiments of the present invention provide a method of establishing countercurrent fluid transfer between areas of an ink tank, the method comprising the step of sealing a film to an exterior surface of an ink tank to define a first sealed exterior passage between at least two compartments of the ink tank, the seal between the film and the exterior surface of the ink tank outlining at least a first opening through the ink tank.
In a more detailed embodiment, the method further comprises the step of sealing a second film to the exterior surface of the ink tank to define a second sealed exterior passage between at least two compartments of the ink tank, the seal between the film and the exterior surface of the ink tank outlining at least a second opening through the ink tank. In yet another more detailed embodiment, the step of sealing the second film to the exterior surface of the ink tank seals the second sealed exterior passage to the exclusion of the first sealed exterior passage. In a further detailed embodiment, the ink tank includes an interior passage through an interior wall of the ink tank providing fluid communication between the first chamber and the second chamber of the ink tank, where the interior passage allows fluid to flow in a first direction from the first chamber to the second chamber, and the first sealed exterior passage allows fluid to flow in a second direction, opposite that of the first direction.
Some embodiments of the present invention provide a method of forming an ink tank, the method comprising: (a) molding at least two ink chambers of an ink tank, each ink chamber is defined by vertical walls that intersect a horizontal wall, where the at least two chambers share a common wall dividing the chambers from one another; (b) forming a first orifice and a second orifice through the horizontal floor, where the second orifice is vertically overlapped by the common wall; (c) mounting a lid to the vertical walls opposite the horizontal wall; and (d) mounting a film over the first orifice and the second orifice to inhibit fluid from egressing through the orifices.
In a more detailed embodiment, the common wall includes an opening therethrough providing fluid communication between the at least two chambers, and the step of forming the second orifice through the horizontal wall includes removing material from the horizontal wall to create the second orifice and further includes removing material from the common wall directly above the second orifice to form the opening through the common wall. In a further detailed embodiment, further comprising the step of: (i) forming a first orifice through a vertical wall defining the first chamber; (ii) forming a first orifice through a vertical wall defining the second chamber; and (iii) mounting a film to the vertical wall of the first chamber and to the vertical wall of the second chamber to encompass the first orifices and provide a sealed conduit between the first chamber and the second chamber.


A circuit interrupter mechanism includes a first member movable in a first longitudinal direction and an opposite second longitudinal direction, and a second member pivotal in a first pivotal direction and an opposite second pivotal direction. A first tab is fixedly coupled to one of the first and second members, and a second tab is pivotally coupled to the other of the members. The first tab engages and disengages from the second tab during movement of the first member in the first longitudinal direction and in the second longitudinal direction. The second tab pivots with respect to the other of the members when engaged by the first tab during movement of the first member in the first longitudinal direction. The second tab does not pivot with respect to the other of the members when engaged by the first tab during movement of the first member in the second longitudinal direction.

1. Field
The disclosed concept pertains generally to electrical switching apparatus and, more particularly, to mechanisms for circuit interrupters. The disclosed concept also pertains to resettable trip indicator mechanisms for circuit interrupters. The disclosed concept further pertains to circuit interrupters.
2. Background Information
Circuit interrupters, such as for example and without limitation, circuit breakers, are used to protect electrical circuitry from damage due to an overcurrent condition, such as an overload condition, a short circuit or another fault condition, such as an arc fault or a ground fault. Molded case circuit breakers typically include at least one pair of separable contacts per phase. The separable contacts may be operated either manually by way of a handle disposed on the outside of the case or automatically in response to a detected fault condition. Typically, such circuit breakers include an operating mechanism, which is designed to rapidly open and close the separable contacts, and a trip mechanism, such as a trip unit, which senses a number of fault conditions to trip the breaker automatically. Upon sensing a fault condition, the trip unit trips the operating mechanism to a trip state, which moves the separable contacts to their open position.
It is known to hold a trip shaft in a rotated position when a circuit breaker is tripped. For example, some power circuit breakers employ a Resettable Trip Indicator (RTI) to signal a user that the circuit breaker has tripped due to an overload condition. In many instances, the circuit breaker is inoperable until the RTI is reset. For example, the RTI is often used in the IEC (European) market, while the UL/ANSI (United States) market often employs a Trip Indicator (TI).
Both of the RTI and TI provide an indication that a circuit breaker tripped as a result of an overload (e.g., short circuit) in an electrical system. For example, an RTI or TI push button/indicator can be a suitable color (e.g., red), such that when it pops-up it becomes clearly visible since it protrudes above the circuit breaker front cover.
It is a good practice to reset the TI push button/indicator by pressing the push button down from the popped-up position after removing the overload (e.g., short circuit) condition. However, the TI does not require being reset since the circuit breaker remains fully functional regardless of the TI position (e.g., reset or popped-up). Conversely, the RTI is required to be reset (e.g. by pushing the RTI push button down from the popped-up position), in order to enable the circuit breaker to close, since the RTI push button holds a trip shaft in a rotated position after the circuit breaker is tripped. This prevents the circuit breaker from closing until the trip shaft returns to its initial, non-rotated position.
In some known circuit breakers, a trip actuator is employed to unlatch an operating mechanism and trip open separable contacts in response to an overcurrent condition. For example, the trip actuator trips the circuit breaker by extending a plunger, which, in turn rotates a trip shaft. As soon as the trip actuator plunger is extended, the circuit breaker cannot be closed. For example, some of these known circuit breakers reset the trip state and return the trip actuator plunger to a retracted position by pushing a trip indicator rod. Others of these known circuit breakers are reset by other mechanisms (e.g., by an "opening yoke"). The "opening yoke" resets the trip actuator every time when the circuit breaker trips. In other words, the trip actuator trips the circuit breaker (e.g., by extending the trip actuator plunger). The "opening yoke" (during the tripping operation) resets the trip actuator (e.g., by pushing the trip actuator plunger back in its retracted position). In this case, the trip shaft is held in a rotated tripped position by a special linkage and not by the trip actuator plunger.
There is room for improvement in mechanisms for circuit interrupters.
There is also room for improvement in resettable trip indicator mechanisms for circuit interrupters.
There is further room for improvement in circuit interrupters including resettable trip indicator mechanisms.

Mechanism or resettable trip indicator mechanism for a circuit interrupter and circuit interrupter including the same