A safety device brakes an elevator car with a guide rail exhibiting an oblong guide flange. The safety device includes a base carrying a retaining element and an abutment with the guide flange positioned therebetween. A mechanism squeezes, when braking, a braking element blocking roller between the guide flange and the abutment. The mechanism, co-operating with an electromagnet, moves the braking element in a controlled way between different positions associated with different operating conditions of the safety device.

The present invention relates generally a safety device for elevators to prevent unintended elevator car movement.
For guiding the elevator car in the case of elevators with guide rails, guide shoes, which are arranged at the elevator car, are employed and such guide shoes are developed either as roller guide shoes or as sliding guide shoes. In the first case, rollers are generally provided with so-called two-dimensional or three-dimensional guides, which roll on appropriate guide surfaces of the guide rail. In the second case, slideway linings slide with small free motion along the guide rails, so that they confer to the elevator car during the vertical transport motion a guide in the horizontal plane. Safety devices, which are physically separate from the guide shoes, are fastened to the elevator car and such safety devices operate to engage the guide rail.
The well-known devices of this kind work in the manner that in case of exceeding the speed limit of the elevator car or respectively in case of over-speed, the safety device is mechanically operated by a speed governor device.
The common safety devices of the state of the art can be categorized according to their construction either to the group of the brake safety devices or the group of the wedge blocking safety devices or the roller blocking safety devices.
A brake safety device is shown in the U.S. Pat. No. 6,131,704, which has a slideway for guiding the elevator car along the guide rail. This safety device includes a forked lever mechanism and a relatively large and heavy electromagnet. With this safety device, the guiding apparatus is functionally separated from the braking device or respectively from the safety device. The usage of such a safety device is therefore uneconomical in particular in the case of low cost elevators with small hoisting height, that is to say for buildings with few floors and low hoisting speeds of the elevator car.
In the case of wedge blocking safety devices or roller blocking safety devices, a loose wedge or loose roller is engaged on a side of the guide rail in order to fit between the stationary guide rail on the one hand and an associated abutment of the safety device on the other hand, by means of the speed limiter, while the safety device block is supported on the opposite side of the guide rail. The prevailing frictional circumstances lead to a further blocking of the clamp body or respectively of the blocking roller and consequently to the braking of the elevator car. Such a blocking roller safety device is described for example in the published European application EP 0 870 719 A1.
Conventional safety devices are applied only in the case of over-speed or in case of inspection work (typically twice per year). Traditional safety devices are in particular of major disadvantage if the elevator car stands at a floor and due to loading, it slips or it falls uncontrolled.
According to the state of the art, an additional so-called creeping protection device prevents the slipping of the elevator car. Thereby, a bolt is pushed into engagement, for example in the appropriate openings of the guide rail, during each stop at a floor, so as to hold in each case the elevator car at the floor level. Further details about the construction and the function of such a creeping protection device are shown in the published European application EP 1 067 084 A1.
A task of the following described invention is therefore to avoid the mentioned disadvantages of the state of the art devices and to create an improved safety device for elevators.


A combination comprises a muffler and a mounting band constructed and arranged to secure the muffler in a hanging orientation. The mounting band includes a continuous, arcuate metallic strap having first and second ends. The metallic strap is positioned in extension circumferentially around the muffler. The first and second ends of the metallic strap are welded to one another to retain the metallic strap as a continuous band around the muffler. The hanger is secured to a continuous portion of the metallic strap. The hanger is centered radially along the strap, at a location about 150.degree.-210.degree. from the weld of the strap ends.

In general, truck mufflers, are generally cylindrical bodies. They typically weigh 25 or more lbs., often 30-50 lbs. Many such mufflers are mounted horizontally, under the framework of trucks.
A wide variety of muffler mounting arrangements have been used. In general, a horizontally mounted muffler requires at least two hanger points. These are generally created by mounting two bands around the outer periphery of the cylindrical muffler. The bands are generally secured around the muffler by either bolts or welds. The bands generally include two hangers thereon. The muffler is typically suspended underneath the frame, by the two hangers.
Improved arrangements have been sought, with respect to such factors as: strength; cost of materials; and, ease of assembly.

Assembly for mounting of a muffler; combination and method


A system and method of generating a cleaned machine image. One example includes capturing used machine image data stored in a first boot volume to generate a set of captured machine image data and extracting at least a portion of the set of captured machine image data to the second volume to generate a cleaned machine image.

Running a machine image over time can cause the machine image to bloat. In other words, a machine image can become less efficient over time by consuming greater hardware and software resources and taking more time to perform operations. Operations such as trimming and defragmenting can be used to clean a machine image at a block level, but are unable to completely reverse machine image bloat that can occurs over time because of limitations of both the operating system and the sub-system.
For example, the unused memory space within memory blocks can be recognized as unused space by a file system kernel, but where a given block comprises any data, the block will still be identified as a used block by the underlying disc infrastructure. Sub-system trimming operations can be used to clean up a boot drive by marking blocks without data as un-used, which allows new data to be written to that block more efficiently. However, where any data is stored in a block, even a small portion, such a sub-system trimming operation would not be able to recapture the block for efficient use.
Operating system operations such as defragment can be used to make a boot volume operate more efficiently by logically reordering blocks of the boot volume. However, when the operating system writes to logically synchronous blocks, the data may actually span multiple physical blocks, which still does not preclude small bits of data from preventing mostly unused blocks from being recaptured by a trimming operation. Accordingly, the operating system is unable to effectively clean up the disc via defragmentation and the sub-system is also unable to effectively clean up the disc via trim, which results in an increasingly bloated disc over time as the machine image executes over time.


Method for treating hair comprising the application onto hair of polymeric layer(s) which can removed to a large extent or even totally in an easy manner upon request of the user by using oxidizing composition.

Different methods for changing the natural colour of hair are known in the art. These methods involve the use of hair colouring compositions which allow either permanent or temporary change of hair colour. Hair colouring compositions which are used to permanently change the colour of hair, also called oxidative hair colouring compositions, typically comprise oxidative hair dye precursors, which can diffuse into the hair through the cuticle and into the cortex where they then react with each other and a suitable oxidizing agent to form the end dye molecules. Due to their larger size, the resultant molecules are unable to readily diffuse out of the hair during subsequent washing with water and/or detergents; hence delivering a consumer-desired permanency of colour. This reaction typically takes place at approximately pH 10 to 11 in the presence of an alkalizing agent and an oxidizing agent. Typically an oxidizing composition (also called developer and/or oxidizing component) comprising the oxidizing agent and a dye composition (also called tint or dye component) comprising the alkalizing agent and if present the hair dye precursors are mixed shortly before use. The consumer repeats this process regularly in order to maintain the desired hair colour, shade and intensity of colour and to ensure continual, even coverage of the hair including coverage of new hair growth. The problem with standard oxidative hair colouring methods is that the conditions under which the reaction is taking place, i.e. the high pH value as well as the presence of an oxidizing agent may cause damage to the structure of the hair and may be irritating for the scalp of the user, especially when such a process is repeated regularly and the compositions which are usually used have an undesirable odour. Furthermore, obtaining the desired colour result is not easy since standard oxidative hair colouring compositions are reactive compositions and it is therefore not easy to control the reaction on hair. Finally, once the hair has been coloured with oxidative hair colouring compositions, it is particularly difficult for the user to remove totally the colour or even to a large extent, e.g. to retrieve its natural hair colour. In order to do so, the user would typically need to either colour its hair with a new oxidative hair colouring composition or wait for the new hair to grow.
Alternatively, methods for temporarily changing the colour of hair have also been developed. These methods usually involve the application of hair colouring compositions comprising direct dyes. Direct dye compositions are usually less aggressive for the hair since they are non reactive compositions. However, since direct dyes are low molecular weight molecules, they may have the tendency to also colour the scalp of the user. Even if the hair colouration which is obtained is typically characterized by a weaker washfastness than when the hair is coloured with standard oxidative hair colouring compositions, i.e. the colouration is typically fading after regular washing of the hair with standard shampoo compositions, it may still be difficult or at least requires a lot of time for the user to remove the colour at least to a large extent, if not entirely.
Methods for temporarily changing the colour of hair involving the application of hair colouring compositions comprising polymeric dyes have also been developed. The hair colouration which is obtained by application of polymeric dyes onto hair is also typically characterized by a weaker washfastness than when the hair is coloured with standard oxidative hair colouring compositions. However, it may also be difficult or at least require a lot of time for the user to remove the colour at least to a large extent, if not entirely.
Therefore, there is still the need for a method for treating hair which makes easier the removal upon request of the user of an artificial colouration which is obtained thereafter on hair. This method should preferably involve the use of compositions which are less aggressive for the hair and for the scalp. Finally, this method should also preferably involve the use of low odour compositions.
The inventors have surprisingly found that at least some of these needs may be met by the method for treating hair according to the present invention, wherein a polymeric layer is obtained onto the hair by applying a cationic polymer and which can be removed upon request of the user by using an oxidizing composition.

This patent is subject to a terminal disclaimer.


It is an object of the invention to protect a flexible printed circuit of a liquid crystal display device. A liquid crystal display device of the invention includes: a flexible printed substrate that extends as far as a position where it opposes a metal frame; and a light-blocking tape that has a portion that is positioned between a semiconductor integrated circuit and a light source. The light-blocking tape includes: a light-blocking layer that has a first surface that faces a liquid crystal display panel and a second surface that faces a backlight module; a first pressure-sensitive adhesive layer that has a portion that is formed on the first surface of the light-blocking layer and pressure-sensitively adheres to the liquid crystal display panel; and a second pressure-sensitive adhesive layer that has a portion that is formed on the second surface of the light-blocking layer and pressure-sensitively adheres to the backlight module. An insulating tape pressure-sensitively adheres to the first or second pressure-sensitive adhesive layer between the liquid crystal display panel and the backlight module and extends as far as between the flexible printed substrate and the metal frame.

1. Technical Field
The present invention relates to a liquid crystal display device.
2. Related Art
There is known a liquid crystal display module where a flexible printed circuit is connected to a liquid crystal display panel (see Japanese Patent No. 3,792,554). A backlight is mounted on the liquid crystal display panel, and strength is ensured by a frame. The frame made of a metal from the standpoint of strength. The flexible printed circuit may possibly contact the frame because the flexible printed circuit is often bent and used. In that case, preventing breakage and shorting of wires formed on the flexible printed circuit is desired.


An embodiment of the invention provides a semiconductor integrated circuit device having a dummy pattern for improving micro-loading effects. The device comprises an active region in a substrate and an isolation region in the substrate adjacent the active region. A plurality of dummy patterns are formed over the isolation region, wherein each dummy pattern is aligned parallel to and lengthwise dimension of the active region. The dummy patterns may have non-uniform spacing or non-uniform aspect ratios. The dummy pattern may have, in plan view, a rectangular shape, wherein its length is greater than the lengthwise dimension of the active region. The spacing between the dummy pattern and the active region may be less than about 1500 nm.

The existence of pattern loading effect in films has been well known. There is a problem that a micro-loading effect occurs due to a difference in pattern density and degrades the uniformity of pattern sizes. The micro-loading effect pertains to a phenomenon occurring upon simultaneously etching or polishing a pattern of a higher density and a pattern of a lower density. Due to a difference in the etching/polishing rate of a film from one location to another, the amount of reaction produced by the etching/polishing becomes locally dense or sparse, and the convection of a large amount of reaction products by etching with a low volatility causes a non-uniformity in the etching rate. Large variations in effective pattern density have been shown to result in significant and undesirable effects such as pattern dimension deviation, critical dimension uniformity (CDU), and thickness variation.
To counteract this effect, a layout design step known as dummy fill, where the circuit layout is modified and dummy patterns are added to locations with low pattern density, was developed. The adding of dummy patterns helps to achieve uniform effective pattern density across the wafer, therefore avoiding problems.
Conventionally, such dummy patterns are left in place. In the case dummy patterns are conductive, they form parasitic capacitance with the interlayer metal wiring. The parasitic capacitance contributes to the RC time delay due to charging and discharging time. The scaling scheme of ILD and higher operation frequency for advanced process will cause severe performance degradation due to unwanted parasitic capacitance. At the present stage of the development of the integrated circuit art, there is an increasing demand in the field of digital integrated circuits for faster switching circuits. As when the switching demands of the integrated circuits go into higher frequency, the slowing effect produced by parasitic capacitance becomes an increasing problem.
Since dummy patterns are not removed, they cannot be formed in an active region, or oxide defined (OD) region. Leftover dummy patterns not only increase parasitic capacitance and degrade device performance, but also affect the subsequent processes. One of the conventional solutions is to place dummy patterns surrounding, but not in, the active regions. Not being able to be placed in desired regions, the effect of the dummy patterns is significantly limited. Such an arrangement also increases the difficulty of fine-tuning the dummy patterns. There were also efforts made to put dummy patterns into dummy active regions (DODs), surrounding dummy regions, or regions having neither an oxide nor an active device. However, the results have generally not proven satisfactory.
There is another effect that also affects the semiconductor process. When two devices are too close to each other, optical proximity effects occur. Optical proximity effects are due to light diffraction and interference between closely spaced features on the reticle resulting in the widths of lines in the lithographic image being affected by other nearby features. One component of the proximity effect is optical interaction among neighboring features; other components arise from similar mechanisms in the resist and etch processes.
The micro-loading and proximity effects affect the gate formation of the MOS devices. The critical dimension, or the gate length of a MOS device, may deviate significantly from design. For example, if an 80 nm gate length is desired, when the critical dimension of a MOS device in a dense device area is on target at 80 nm, the critical dimension of a MOS device in an isolated device area may reach around 110 nm, or 30 nm more than the target value in certain cases. Also the deviations for nMOS and pMOS gates are different, causing N/P ratio mismatching and complicating circuit design.
While advantages of using dummy patterns in IC fabrication are appreciated in the art, many problems remain regarding dummy pattern structure and arrangement. For example, such problems may include device critical dimension control, optical proximity effects, optical proximity correction (OPC) cycle-time, design complexity, device mismatch, and process window and yield. Accordingly, there remains in semiconductor manufacturing a need for simplified yet robust dummy patterns.

Dummy patterns in integrated circuit fabrication

Taiwan Semiconductor Manufacturing Company, Ltd.


A process is claimed for reducing tensile welding stresses in a nozzle in a nuclear reactor shell, such as a nuclear reactor head, wherein the nozzle has been welded to the nuclear reactor shell, which involves applying axial compressive loads on the free ends of the nozzle in an amount sufficient to substantially reduce the welding stresses. In some cases radial pressure can be imposed on the inner wall of the nozzle wherein the tensile welding stresses are located.

1. Field of the Invention
This invention relates to a process for reducing tensile welding stresses in nozzles in a nuclear reactor shell, preferably in a nuclear reactor head, said nuclear reactor shell having been provided with nozzles extending through openings in said shell, said nozzles having been welded to said nuclear reactor shell through a weld lying on an inner surface of said nuclear reactor shell and the outer surface of said nozzle immediately adjacent thereto, said welding resulting in the generation of high tensile welding stresses in the wall of said nozzle adjacent to said weld, which comprises applying axial compressive loads, or pressures, on the free ends of said nozzles sufficient to substantially reduce said welding stresses.
2. Description of the Prior Art
Nuclear reactors are normally provided in the shell thereof, particularly in the head thereof, with nozzles generally extending substantially vertically through openings therein and which are circumferentially welded to said shell through a weld lying on the inner surface of said shell and on the outer surface of said nozzle immediately adjacent thereto. These nozzles, particularly when they extend through the head of a nuclear reactor, generally are made of alloys of nickel or stainless steel, such as an Inconel alloy, such as Inconel 600, provide for passage therethrough of control rod drive shafts attached to an exterior control rod drive mechanism. The tensile stresses generated from the weld holding the nozzle to the nuclear reactor head tend to facilitate stress corrosion crack formation in the inner surface of the nozzle in the vicinity of said weld. These cracks, in time, can extend upwardly into the body of the nozzle or into a portion of the weld, or both, into communication with the outer surface of the nozzle above the weld, into the space between the outer surface of the nozzle and the adjacent surface of the head opening, and then to the exterior of the reactor. Irradiated water can thus pass upwardly into the atmosphere, creating a serious pollution problem. If the cracks are circumferential, the nozzle can be detached from the reactor head by the pressure in the reactor, also with damaging results.
As seen in U.S. Pat. No. 5,196,160, filed Mar. 23, 1992, one way to obviate such problems is to form a coaxial circumferential groove extending upwardly into at least a portion of the nozzle that extends into the reactor and then filling such circumferential groove with a weld material.
I have now found that such problems in the nozzle arising from the tensile stresses generated in the wall of said nozzle adjacent to the weld holding said nozzle to said nuclear reactor shell, particularly a nuclear reactor shell, can be substantially reduced by applying axial compressive loads to the free ends of said nozzles.

Process for reducing tensile welding stresses in a nozzle in a nuclear reactor shell


A motorcycle that maintains sufficient vehicle rigidity with a simple structure. A main frame has an up-and-down extension part in a vehicle width center, side plates disposed apart on the right and left of the up-and-down extension part, and first and second supporting pipes. Both ends of the supporting pipes are attached to the side plates.

1. Field of the Invention
The present invention relates to a motorcycle, and more specifically, to a body frame structure of a motorcycle.
2. Description of Related Art
In a conventional mono backbone type body frame structure of a motorcycle, a main frame that suspends an engine of the motorcycle extends from a head pipe to the rear in a vehicle width center, bends downward at a rear side of the engine, and reaches a vehicle bottom. Side plates are separately attached to right and left sides at a bottom end portion of the main frame, and a front end portion of a swing arm is supported between the side plates and the main frame.
JP-A-2007-118865 discloses a motorcycle having such a body frame structure. In this motorcycle, right and left side plates are secured by bolt to a main frame in the center. Two bosses (top and bottom) extend from the right and left side plates to abut onto the main frame, thereby adjusting a space between the main frame and the side plates.
However, in this conventional mono backbone type body frame, the right and left side plates are jointed by patching them using the bosses and the main frame. Therefore, in order to smoothly receive a load added to one side plate by the entire body frame including the right and left side plates and the main frame, and to exert sufficient vehicle rigidity, special actions such as increasing the thickness of the main frame or the boss diameter of the side plate are required.


Embodiments include methods for a wireless device operating in a wireless communication network. Such methods include receiving from the wireless communication network, during a first transmission-time interval (TTI), an explicit request for automatic repeat-request (ARQ) feedback from the wireless device. The request can include an indication of one of the following: a range of ARQ process numbers for which the ARQ feedback is requested, or a range of TTIs, indicating that the wireless device is to provide ARQ feedback for all ARQ processes active during the indicated range of TTIs. Such methods also include transmitting to the wireless communication network, during a second TTI after the first TTI, ARQ feedback information for the ARQ processes indicated in the request. Other embodiments include complementary methods performed by a network node, as well as wireless devices and network nodes configured to perform such methods.

Automatic repeat-request (ARQ) is an error-control technique used in many wireless networks. With ARQ, a receiver of data transmissions sends acknowledgements (ACKs) or negative acknowledgments (NACKs), referred to "ARQ feedback," to inform the transmitter of whether each message has been correctly received. Incorrectly received messages, as well as messages that aren't acknowledged at all, can then be re-transmitted.
Hybrid ARQ (HARQ), which can be understood as a refined form of ARQ, combines the basic ARQ techniques described above with forward error-correction (FEC) coding of the data messages, to improve the ability of the receiver to receive and correctly decode the transmitted messages. As with conventional ARQ, receivers employing HARQ send ACKs and NACKs, as appropriate, after each attempt to decode a message. These ACKs and NACKs are referred to as "HARQ feedback."
The fourth-generation system widely known as LTE (for Long-Term Evolution) and more formally known as the Evolved UMTS Terrestrial Radio-Access Network (E-UTRAN) has been developed and deployed by members of the 3rd-Generation Partnership Project (3GPP). For downlink transmissions in LTE today, HARQ feedback is sent from the UE (user equipment—3GPP terminology for a mobile terminal) to the network on either the Physical Uplink Control Channel (PUCCH) or the Physical Uplink Shared Channel (PUSCH), depending on whether or not the UE has been scheduled for uplink PUSCH transmission.
For each downlink transmission to the UE, the UE will transmit an ACK or NACK, depending on whether or not the transmission was correctly received. The network can, apart from detecting ACK or NACK, also draw the conclusion that the UE did not properly receive the corresponding downlink assignment, and thus did not even attempt to demodulate and decode the transmitted data message, if the network detects no feedback from the UE when anticipated. Note, however, that a missed ACK/NACK detection on the network side could also be due to the network's failure to receive it properly, even though it was transmitted by the UE.
A NACK received by the network will trigger a retransmission, whereas the reception of an ACK allows the corresponding HARQ transmit (Tx) process to be flushed and re-used. That a HARQ Tx process has been flushed and is being re-used is indicated to the UE from the network side by toggling the NDI (New Data Indicator) flag in the next downlink assignment for the corresponding HARQ process, along with the new data. This, in turn, will cause the UE to flush the HARQ receive (Rx) process and associate the newly received data with the current HARQ Rx process.
As described above, the failure of the network to receive an ACK/NACK from a UE when expected is an indication of a probable failure by the UE to correctly decode the downlink assignment message, which in LTE is sent on the Physical Downlink Control Channel (PDCCH) or enhanced PDCCH (ePDCCH). Detecting this condition at the network may thus be used for the purpose of PDCCH/ePDCCH link adaptation—i.e., for adapting the robustness of the physical control channel that carries the downlink grant.
While LTE is based on a fixed (or semi-static) division between uplink and downlink, other systems, as well as future versions of LTE, may be based on a dynamically scheduled division between uplink and downlink. In such systems, there may not be a one-to-one correspondence between downlink transmissions and HARQ feedback messages.
In upcoming enhancements of LTE, the assumed mode of operation is dynamic time-division duplexing (TDD), where subframes can be dynamically allocated for uplink or downlink use. With this approach, the number of HARQ processes may increase quite significantly, because, for example, a relatively large number of transmission-time-intervals (TTIs) in a row may be assigned to the downlink. This causes the number of needed HARQ processes to grow, since there is a long gap between feedback opportunities in the uplink, to free up HARQ processes.

Flexible configuration of HARQ process feedback


A data processing apparatus has prefetch circuitry for prefetching cache lines of instructions into an instruction cache. A prefetch lookup table is provided for storing prefetch entries, with each entry corresponding to a region of a memory address space and identifying at least one block of one or more cache lines within the corresponding region from which processing circuitry accessed an instruction on a previous occasion. When the processing circuitry executes an instruction from a new region, the prefetch circuitry looks up the table, and if it stores a prefetch entry for the new region, then the at least one block identified by the corresponding entry is prefetched into the cache.

The present technique relates to the field of data processing. More particularly, it relates to prefetching of instructions to a cache in a data processing apparatus.
A data processing apparatus may have an instruction cache for storing instructions. When an instruction needs to be executed by processing circuitry, it is fetched from the cache. If an instruction to be executed is not in the cache, then it is fetched from memory, but this may delay processing. To improve performance, a prefetcher may be provided to prefetch instructions into the cache before they are actually needed by the processing circuitry. To predict which instructions are likely to be executed in the future by the processing circuitry, most known prefetchers require a reasonably large amount of tracking data generated based on past instruction accesses. The present technique seeks to provide a more efficient prefetching technique.

Prefetching using a prefetch lookup table identifying previously accessed cache lines


Systems and methods for producing the sensation of 3-dimensional viewing by projecting and displaying a foreground image and a background image onto separate projection screens positioned on a single viewing axis are disclosed. The images are viewed simultaneously and appear as a single image having depth characteristics. The foreground image screen and the background image screen are provided with image transmission, reflection, and absorption characteristics which allow for simultaneous viewing of more than one screen without image "bleed" or excessive loss of image intensity.

1. Field of the Invention
The present invention relates generally to systems for producing apparent 3-dimensional viewing. More particularly, the present invention relates to apparatus useful for projecting and displaying images onto separate projection screens positioned on a single viewing axis in such a manner as to provide audiences with a sensation of 3-dimensional viewing.
2. Description of Related Art
For many decades the motion picture and video display industries have attempted with various degrees of success to provide viewing systems which give a sensation of depth or 3-dimensional viewing to the audience. One early approach involved provided a greater visual depth for viewers and consisted of increasing the projection screen width relative to its height and curving the screen. This provided a viewing area very close to the normal visual range and additionally created increased depth illusion.
Another approach is known as stereoscopic viewing and consists of simultaneously projecting images, photographed at different angles, onto a screen through polarizing filters which are oriented at right angles to each other. Viewers are required to wear a pair of special polarizing viewing spectacles which allows each eye to see only one image. The viewer's brain combines the images so that a resultant image having apparent 3-dimensional characteristics is observed.
Another system for creating 3-dimensional viewing is described in U.S. Pat. No. 2,952,182 and consists of projecting one image on a front screen and projecting a second image on a back screen which is located directly behind the front screen. In order for a viewer to observe the images projected on both screens, the front screen is formed of a wire mesh material which is painted with white pigment on the front, to maximize reflection, and painted black on the back to maximize absorption. The rear screen is a rear projection screen and allows light to pass through it so that it appears to originate from the screen. In order to avoid image "bleed" created by light from the front screen passing through the mesh and reflecting from the rear screen, a filter is positioned between the front and rear screens and at an angle to the front screen. This filter reflects about 80% of the light striking it while allowing sufficient light to pass through so that the viewer can observe the back screen. A real drawback associated with this system is the reduced visualization of the back screen caused by the presence of the filter. That is, only a small percentage of the light originating from the rear screen is transmitted to the viewer opposite the front screen, resulting in low intensity images.
Accordingly, it is an object of the present invention to provide a system for 3-dimensional viewing which does not require viewers to wear stereoscopic viewing spectacles.
It is also an object of the present invention to provide a system for 3-dimensional viewing without image "bleed".
It is further an object of the present invention to provide a system for 3-dimensional viewing which does not require filtering screens.
It is another object of the present invention to provide a system for 3-dimensional viewing which can be constructed economically and easily in motion picture auditoriums having a variety of sizes and dimensions.

Apparatus and method for producing 3-dimensional images


A method for non-contact measurement of a displacement between a surface and a capacitive sensor comprised of at least two superimposed conductive plates electrically insulated one from the other and a sensor circuit coupled to the plates including: positioning the capacitive sensor proximate to the surface such that the displacement is a distance of a gap between the surface and one of the plates; applying a high frequency signal to the plates; applying the high frequency signal and a sensor plate to control a voltage gain of an amplifier in the circuit, where the capacitance on the sensor is indicative of the displacement between the sensor and surface; differentiating an output of the amplifier and the high frequency signal, and determining a value of the displacement based on the difference between the output of the amplifier and the high frequency signal.

This invention relates to a method and system for non-contact measurement of a gap between a sensor and a conductive or non-conductive surface using a capacitive measurement device with a plurality conductive plates that permits measurement of material depth and dielectric changes in solids and fluids.
Non-contact gap measurement sensors having two parallel superimposed conductive plates, which are electrically insulated from one another, are disclosed in, for example, U.S. Pat. Nos. 4,675,670; 5,990,807; 6,075,464 and 6,552,667. A high frequency signal is placed on the first plate of the sensor. By measuring the capacitance between the sensor and a proximate surface, the sensor generates a signal that is indicative of the gap between the sensor and the surface.
A difficulty with existing non-contact capacitive sensors is that the capacitive signal generated by the sensor that is representative of the gap may be overshadowed by noise. The noise may arise from capacitance variations of extension cables between the sensor and its associated electronics, signal pickup electronics and transformer, and stray capacitances from the signal pickups. The noise due to these capacitance variations may be much greater than the capacitance of the signal indicative of the gap.
Another difficulty in using a capacitive sensor is that capacitance is formed between the sensor and any surfaces which come near the sensor, including surfaces behind the sensor. Some sensitivity to surfaces behind the sensor remains even when an active shield plate is placed behind the sensor plate.
There is a need for a capacitive measurement method and a non-contact capacitive measurement sensor that is less sensitive to variations in capacitance, in an insulator between the two plates of the sensor and variations in the impedance of the cables connecting the sensor to the circuit. Excessive sensitivity to these variations may increase the difficulty in manufacturing the sensor and increase the sensor sensitivity to temperature and other environmental factors.

Capacitive sensor and method for non-contacting gap and dielectric medium measurement


The invention provides a method of manufacturing potassium-lithium-niobate crystals having a composition which corresponds to the formula EQU (K.sub.2 O).sub.0.3 (Li.sub.2 O).sub.0.2+a (Nb.sub.2 O.sub.5).sub.0.5+b. where. -0.01<a<0.01 PA0 -0.005<b<0.005. from a melt comprising potassium, lithium and niobium compounds. By adding a small quantity of vanadium, preferably in the form of V.sub.2 O.sub.5, considerably larger crystals are obtained. In addition, the homogeneity of these crystals is much better than that of the crystals obtained by the method according to the prior art.

The invention relates to a method of manufacturing potassium-lithium-niobate crystals having a composition which corresponds to the formula EQU (K.sub.2 O).sub.0.3 (Li.sub.2 O).sub.0.2+a (Nb.sub.2 O.sub.5).sub.0.5+b
where
-0.01<a<0.01 PA0 -0.005<b<0.005
from a melt comprising potassium, lithium and niobium compounds. The invention also relates to crystals of this composition.
The above-mentioned monocrystalline crystals can be used in devices for doubling the frequency of a light wave. In these devices, this so-called primary wave is passed through a nonlinear optical medium of potassium-lithium-niobate (PLN), thereby forming a so-called second harmonic wave. The frequency of the latter wave is twice that of the primary wave.
The method described in the opening paragraph is known from, inter alia, European Patent Application EP 409.339. The method described therein enables stoichiometric potassium-lithium-niobate (PLN) having a non-centrosymmetrical tetragonal crystal structure of the tungsten bronze type to be manufactured. Using this material, the frequency of primary waves having a wavelength in the frequency range 790-920 nm can be doubled at room temperature. The known material also exhibits a high degree of birefringence in this frequency range, so that optimum phase matching of the (infra)red light (primary wave) and blue light (second harmonic wave) is possible. As the wavelength of the radiation issuing from the current semiconductor lasers, such as (Al,Ga)As lasers is situated in the range around 800 nm, the known material is very suitable for use in combination with such lasers. The generated shortwave light can be used for the high-density storage of information and for reading said information, for example in high-density data recording.
Applicants have found that the disadvantage of the known method is that the crystals manufactured are relatively small. For example, up to now it has been impossible to grow crystals having a crystal volume in excess of 3.5 mm.sup.3. This crystal volume is insufficient to allow said crystals to be successfully used in devices for frequency doubling. Besides, these relatively small crystals exhibited cracks and their composition was insufficiently homogeneous.

Potassium-lithium-niobate crystals and the manufacture thereof


Prosthetic intervertebral discs, systems including such prosthetic intervertebral discs, and methods for using the same are described. The subject prosthetic discs include upper and lower endplates separated by a compressible core member. The subject prosthetic discs exhibit stiffness in the vertical direction, torsional stiffness, bending stiffness in the saggital plane, and bending stiffness in the front plane, where the degree of these features can be controlled independently by adjusting the components, construction, and other features of the discs.

The intervertebral disc is an anatomically and functionally complex joint. The intervertebral disc is composed of three component structures: (1) the nucleus pulposus; (2) the annulus fibrosus; and (3) the vertebral endplates. The biomedical composition and anatomical arrangements within these component structures are related to the biomechanical function of the disc.
The spinal disc may be displaced or damaged due to trauma or a disease process. If displacement or damage occurs, the nucleus pulposus may herniate and protrude into the vertebral canal or intervertebral foramen. Such deformation is known as herniated or slipped disc. A herniated or slipped disc may press upon the spinal nerve that exits the vertebral canal through the partially obstructed foramen, causing pain or paralysis in the area of its distribution.
To alleviate this condition, it may be necessary to surgically remove the involved disc and fuse the two adjacent vertebrae. In this procedure, a spacer is inserted in the place originally occupied by the disc and additional fixation devices, such as plates and rods, may be added to provide increased stability. Despite the excellent short-term results of such a "spinal fusion" for traumatic and degenerative spinal disorders, long-term studies have shown that alteration of the biomechanical environment leads to degenerative changes at adjacent mobile levels. The adjacent discs have increased motion and stress due to the increased stiffness of the fused segment. In the long term, this change in the mechanics of the motion of the spine causes these adjacent discs to degenerate.
To circumvent this problem, an artificial intervertebral disc replacement has been proposed as an alternative approach to spinal fusion. Although various types of artificial intervertebral discs have been developed to restore the normal kinematics and load-sharing properties of the natural intervertebral disc, they can be grouped into two categories: ball and socket joint type discs and elastomer type discs.
Artificial discs of ball and socket type are usually composed of metal plates, one to be attached to the upper vertebra and the other to be attached to the lower vertebra, and a polyethylene or metal bearing surface working as a ball. The metal plates may have concave areas to house the bearing surface. The ball and socket type allows free rotation or movement between the vertebrae between which the disc is installed and thus has no load sharing capability against bending and translation. (Some ball and socket type artificial discs have rotation limiting features, which still do not address appropriate torque for a natural disc.) Artificial discs of this type have a very high stiffness in the vertical direction; they cannot replicate the normal compressive stiffness of the natural disc. Also, the lack of load bearing capability in these types of discs causes adjacent discs to bear the extra load, resulting in the eventual degeneration of the adjacent discs and facets. These types of discs also cannot replicate a natural disc's instantaneous access of rotation (IAR) as a direct result of lacking natural compressibility.
In elastomer type artificial discs, an elastomeric polymer is between metal plates and these metal plates are fixed to the upper and the lower vertebrae. The elastomeric polymer may be bonded to the metal plates by having the interface surface of the metal plates be rough and porous. This type of disc can absorb a shock in the vertical direction and has a load bearing capability. However, this structure has a problem in the interface between the elastomeric polymer and the metal plates. Even though the interface surfaces of the metal plates may be treated for better bonding, polymeric debris may nonetheless be generated after long term usage. Furthermore, the bond of the elastomer to the metal substrate tends to fail after a long usage because of its insufficient shear-fatigue strength.
Because of the above described disadvantages associated with either the ball and socket or elastomer type discs, there has existed a continued need for the development of new prosthetic devices. Several such new prosthetic devices are described in U.S. patent application Ser. No. 10/632,538, filed Aug. 1, 2003, and U.S. patent application Ser. No. 10/903,276, filed Jul. 30, 2004, each of which applications is hereby incorporated by reference herein. The foregoing applications describe, inter alia, prosthetic intervertebral discs that include an upper endplate, a lower endplate, and a compressible core member disposed between the two endplates. Several prosthetic disc embodiments are described, including single-piece, two-piece, three-piece, and four-piece structures.
While such prosthetic intervertebral discs and methods for their use show great promise, there remains a need for improved prosthetic discs and methods for their use.


In one embodiment, a pair of differential amplifiers have outputs coupled together. A signal received on one input results in signals coupled to the outputs that substantially cancel each other at the outputs.

The present invention relates, in general, to electronics, and more particularly, to methods of forming semiconductor devices and structure.
In the past, the semiconductor industry utilized various methods and structures to form digital circuits using differential amplifiers. For example differential amplifiers were used to form emitter coupled logic (ECL) circuits such as multiplexers and flip-flops. These differential amplifier circuits typically utilized multiple differential amplifiers that shared the collectors of some of the transistors that were used to form the differential amplifiers. For example, a collector of one transistor of a differential pair could be connected to a collector of an equivalent transistor of another differential pair. Under some operating conditions the first differential pair may be disabled. If a signal were applied to the input of a disabled transistor, a parasitic capacitance of the disabled transistor caused cross-talk that affected the output signal resulting in jitter in the output signal and false triggering of other circuits that were connected to the output.
Accordingly, it is desirable to have a method of reducing crosstalk in circuits that have shared transistors, and reducing jitter in the output signal.
For simplicity and clarity of illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements. Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description. As used herein current carrying electrode means an element of a device that carries current through the device such as a source or a drain of an MOS transistor or an emitter or a collector of a bipolar transistor or a cathode or anode of a diode, and a control electrode means an element of the device that controls current through the device such as a gate of an MOS transistor or a base of a bipolar transistor. Although the devices are explained herein as certain NPN transistors, a person of ordinary skill in the art will appreciate that complementary devices are also possible in accordance with the present invention.

Cross-talk reduction circuit and method therefor

Semiconductor Components Industries, L.L.C.


A manufacturing method for a semiconductor device with a discrete field oxide structure is provided, the method includes: growing a first PAD oxide layer on the surface of a wafer; forming a first silicon nitride layer (302) on the first PAD oxide layer through deposition; defining a field region by photolithography and etching same to remove the first silicon nitride layer (302) located on the field region; performing an ion implantation process to the field region; performing field region oxidation to grow a field oxide layer (304); peeling off the first silicon nitride layer (302); wet-dipping the wafer to remove the first PAD oxide layer and a part of field oxide layer (304); growing a second PAD oxide layer on the surface of the wafer, and forming a second silicon nitride layer (312) on the second PAD oxide layer through deposition; defining a drift region by photolithography and etching same to remove the second silicon nitride layer (312) on the drift region; performing an ion implantation process to the drift region; and performing drift region oxidation to grow a drift region oxide layer (314). The above-mentioned method peels off the silicon nitride layer (302) after the growth of the field oxide layer (304) is finished, at this time, the length of a bird beak of field-oxide (304) can be optimized by adjusting a wet-dipping amount to solve the problem that the bird beak of field-oxide (304) is too long.

In modem integrated circuit design, a high voltage LDMOS (Laterally Diffused Metal Oxide Semiconductor) device is widely used. A voltage endurance of the LDMOS FET is achieved through a drift region of the drain of the MOS FET and a principle of reduced surface field (RESURF). The drift region is formed by performing an ion implantation process and a high temperature thermal diffusion process. The drift region usually includes a thermal oxide layer with a certain thickness, a polysilicon is laminated on the thermal oxide layer, an upper surface potential distribution on the drift region is changed to realize a full depletion of the drift region, an extreme voltage endurance under a limited drift region length is achieved.
Generally, a high voltage process for a line width greater than 0.35 μm employs a local oxidation of silicon (LOCOS) method to isolate, a stacked field oxide used by the oxide layer on the drift region is a LOCOS method. A field oxide region is defined by photolithography, and a field oxide of a first step is grown. A photolithography process is performed to define a drift region, a thermal oxidation layer is performed to grow an oxide layer of the drift region, meanwhile a second step of growth is achieved through overlapping growth on the field oxide region. Thicknesses of the drift region thermal oxidation layer and the field oxide can be fitted in any combination, a better depletion of the drift region can be achieved, a length of the bird beak of the field oxide cannot be controlled, an area of the source region can be affected, which will lead to an electric leakage when in a serious situation, causing a yield thereof to be low.

Manufacturing method for semiconductor device with discrete field oxide structure


An endoscope apparatus according to a present embodiment has a CCD and an LED control section which controls LED1 and LED2. The LED control section sequentially drives the two LEDs, LED1 and LED2, on the basis of an image pickup start timing signal corresponding to each image pickup cycle S for the CCD within the image pickup cycle S such that driving time periods for LED1 and LED2 do not overlap. The LED control section also variably controls the driving time periods for LED1 and LED2 to adjust an amount of exposure within the image pickup cycle S and performs control so as to conduct, within the image pickup cycle S, at least a first drive within the image pickup cycle S of LED2 that is a second or subsequent one to be driven with reference to a timing for driving of LED1 that is driven earlier.

1. Field of the Invention
The present invention relates to an endoscope apparatus having a plurality of illumination sections that emit illuminating light, with which a site to be observed is irradiated, and a control section which controls driving of the plurality of illumination sections.
2. Description of the Related Art
Among endoscope apparatuses, a so-called electronic endoscope apparatus is generally known which has an illumination section emitting illuminating light and obtains an image signal corresponding to an image of an object by irradiating a site to be observed with light emitted from the illumination section as illuminating light, receiving return light of the illuminating light reflected from the object with a solid image pickup device, such as a CCD (charge coupled device), (exposing the solid image pickup device to the return light), and photoelectrically converting the return light.
Among such electronic endoscope apparatuses, a so-called frame-sequential endoscope apparatus is generally known. The frame-sequential endoscope apparatus does not have a light-receiving side color filter at a front face of each light-receiving device of a solid image pickup device and irradiates a site to be observed with illuminating lights of a plurality of colors required for formation of an endoscopic image in sequence. The frame-sequential endoscope apparatus exposes the solid image pickup device to light for one image pickup cycle with each irradiation operation with illuminating light, photoelectrically converts return light reflected from an object with the solid image pickup device, and obtains an image signal of a predetermined color for every image pickup cycle. The frame-sequential endoscope apparatus can obtain one endoscopic image by combining image signals of individual colors obtained in respective image pickup cycles.
Examples of the frame-sequential endoscope apparatus include a frame-sequential endoscope apparatus that has a light source apparatus in which a color wheel, having irradiation side color filters of respective colors for generating illuminating lights of a plurality of colors required for formation of an endoscopic image, is arranged, e.g., in front of a light source emitting white light and irradiates an object in rotation with illuminating lights of the plurality of colors, such as R, G, and B, from a distal end portion of an endoscope insertion portion via a light guide or the like by rotationally driving the color wheel.
In the endoscope apparatus with the above-described configuration, an irradiation time period and an irradiation cycle (timing for irradiation) for illuminating lights of the individual colors, such as R, G, and B, depend on a rotation cycle of the color wheel. The endoscope apparatus can obtain an endoscopic image with appropriate brightness by adjusting an exposure time period for the solid image pickup device within the irradiation time period in each of the determined irradiation cycles to obtain image signals of the individual colors.
For example, an endoscope apparatus proposed in Japanese Patent Application Laid-Open Publication No. 2007-29746 is conventionally available in order to reduce color misregistration or image blurring occurring in an endoscopic image.
The endoscope apparatus described in Japanese Patent Application Laid-Open Publication No. 2007-29746 allows selection of standard time periods, short time periods, or long time periods as a lighting time period for each of three LEDs emitting illuminating lights of respective colors of R, G, and B and an exposure time period for a solid image pickup device for obtaining an image signal for each color according to an observation situation in which return light from an object is bright or dark. The endoscope apparatus also performs control so as to change an image pickup cycle for the solid image pickup device and a lighting cycle (timing for lighting) for the LEDs for the individual colors of R, G, and B to standard cycles, short cycles, or long cycles according to selection of the time periods such that an observed image with an optimum image pickup cycle is obtained according to an observation situation. With the configuration, the endoscope apparatus reduces color misregistration and image blurring in an endoscopic image.

Endoscope apparatus including a plurality of light-emitting devices


A heat-dissipating device includes a receiving tray, a driving module, a plunger, and a heat-dissipating member. A first holding valve assembly and a second holding valve assembly are located on the receiving tray. The driving module includes a first magnet. The plunger includes a second magnet. The receiving tray is divided into a first ventilation area and a second ventilation area. The plunger is moveable in the receiving tray by magnetic forces between the first magnet and the second magnet. Air outside of the receiving tray flows through the first and second ventilation areas via the first holding valve assembly and the second holding valve assembly.

1. Technical Field
The present disclosure relates to heat-dissipating apparatuses.
2. Description of Related Art
With the development of technology, electronic devices are becoming thinner and smaller while containing more and more electronic components. However, the electronic components generate large amounts of heat during operation. A heat dissipation module, such as a fan, is used in the electronic device for dissipating the heat. However, an air inlet and an air outlet of the fan cannot be changed, which adversely affects heat dissipation efficiency of the fan. Therefore, there is room for improvement within the art.

HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.


According to each embodiment of the present invention, a phase-correlation can be generated between respective laser fields produced by a plurality of independent lasers. Specifically, based on a structure that first and second laser fields each having a mixed quantum state represented by a single-mode Glauber coherent state that a phase is completely indeterminate are mixed with each other and a quantum continuous measurement is performed by causing absorbers to individually cross two output quantum states, the phase-correlation can be generated between the first and second laser fields when absorption by the absorbers massively occurs in one of the two quantum states as a result of the quantum continuous measurement.

The present invention relates to a method and apparatus for generating a phase-correlation which is essential as a resource in such quantum information science as a quantum computer, quantum communication, quantum cryptography and others.
It is often the case that a laser field generated by an optical laser is described as an electric field that a phase component in a quantum state (pure state) called a coherent state is determinate.
However, according to laser theory properly based on a quantum theory, it is clearly shown that a steady-state laser field is in a coherent state (mixed state) that a phase component is completely indeterminate. As a result, it can be understood that a phase of the laser field proceeds to the steady state and becomes diffused with time irrespective of an initial state of that phase.
In a prior art, one laser as a reference is set, and synchronization of the entire phase is achieved by continuously supplying a laser field to each part from this laser in order to eliminate the indeterminateness of the phase of the laser field in the mixed state.
Specifically, laser beams in the mixed state are divided by using a half beam splitter and supplied to each part. At this time, it can be understood from a simple calculation that quantum states of respective output ports of the half beam splitter have a phase-correlation with respect to each other. It is well known from experience that such a phase-correlation is strong relative to a decoherence due to the environment.
Such a phase-correlation is useful for a communication protocol called quantum teleportation, for example (C. H. Bennette, et al., Phys. Rev Lett. 70, 1895 (1993).).
Quantum teleportation is currently verified by an experiment system mainly using photons. It is typified as a substantive experiment (A. Furusawa et al., Science 282, 706 (1998).) of a protocol called an infinite dimension quantum teleportation (S. L. Braunstein and H. J. Kimble, Phys. Rev. Lett. 80, 869 (1998).). In this substantive experiment, an original protocol that a measured value takes a discrete value is expanded in such a manner that a measured value becomes a continuous quantity in the light of readily enabling the application of a laser beam source.
On the other hand, in relation to this substantive experiment, it is revealed that a transmission side and a reception side must be physically connected with each other in a light path which does not exist in the original protocol in order to eliminate the phase indefiniteness that the laser field essentially has and maintain a phase-correlation between the transmission side and the reception side (T. Rudolph and B. C. Sanders, Phys. Rev. Lett. 87, 077903 (2001)). In order to realize the infinite dimension quantum teleportation which does not have such an extra light path, according to investigation conducted by the present inventors, a scheme that two or more independent laser beam sources have a phase-correlation is required.

Method and apparatus for generating phase-correlation


There is provided in accordance with the practice of this invention a process for separating Factor VIII complex from an impure protein fraction containing Factor VIII complex. An aqueous solution of the impure protein fraction containing Factor VIII complex is applied to a heparin-coupled chromatographic medium, to bind the Factor VIII complex to the medium. The Factor VIII is then recovered from the heparin-coupled chromatographic medium by elution with an aqueous solution comprising CaCl.sub.2 and histidine. The recovered Factor VIII is further purified by precipitation with a solution comprising glycine and NaCl, and washing the resultant precipitate with a solution comprising histidine, glycine, and NaCl to provide a Factor VIII complex solution with a specific activity of about 70 to about 150 units/mg.

Coagulation of blood is a complex process requiring the sequential interaction of a large number of components, nearly all of which are proteins. These components include fibrinogen and Factors II, V, VII, VIII, IX, X, XI, and XII. A lack of any of these components, or a nonfunctional component, can lead to an inability of the blood to clot when required, with resultant excessive and life-threatening blood loss to the patient.
Factor VIII is absent or is present at deficient levels in certain individuals. For example, persons who have a deficiency (or absence) of Factor VIII, i.e., persons suffering from hemophilia A, have blood which either fails to clot or clots only after longer periods of time than the time required for clotting in a person who has a normal level of Factor VIII.
Factor VIII is present in plasma as a high-molecular-weight complex (Factor VIII complex), which includes Factor VIII:C and von Willebrand factor (Factor VIII:RAg or vWf). Factor VIII:C promotes blood coagulation. Factor VIII:RAg interacts with platelets to promote aggregation of the platelets and, when incorporated in the Factor VIII complex, acts as a stabilizer for Factor VIII:C.
The primary therapeutic use of Factor VIII has been its intravenous administration to hemophilia A patients. In severe cases, relatively high concentrations of Factor VIII are required. These high concentrations are obtained by purification and concentration of Factor VIII. However, purification often leads to instability and loss of Factor VIII:C activity because of the removal of Factor VIII:RAg from the Factor VIII complex during purification. Thus, the resultant purified product is often a mixture of both stable Factor VIII complex and unstable Factor VIII:C, along with contaminating proteins that have not been removed.
Some processes for producing Factor VIII concentrate have been based on a discovery by Poole et al. (Nature, 203, p. 312 (1964)) that the precipitate remaining after plasma is frozen and then thawed, i.e., the cryoprecipitate, contains Factor VIII in a concentrated form and excludes various other protein fractions. It was discovered that, in addition to Factor VIII, the cryoprecipitate also includes the major portion of the fibronectin component of plasma.
Work progressed over the years to perfect the separation of Factor VIII from other proteins in the cryoprecipitate, including the fibronectin component, so that the resultant products would incorporate increased concentrations of Factor VIII relative to the other proteins present in the plasma.
One area in which a substantial amount of work has been done in the production of Factor VIII is based on the use of polyethylene glycol (PEG) to precipitate Factor VIII from other proteins in an aqueous cryoprecipitate solution. For example, U.S. Pat. No. 3,652,530, which issued on Mar. 28, 1972 to A. J. Johnson, discloses a process for preparing a Factor VIII concentrate by fractionating cryoprecipitate with PEG at a relatively lower concentration to precipitate fibrinogen and other proteins, and then increasing the PEG concentration to precipitate Factor VIII.
U.S. Pat. No. Re. 29,698 to Fekete et al. discloses a process for production of Factor VIII by which heparin is added to a cryoprecipitate solution, along with PEG, to provide increased yields of precipitated Factor VIII. It is disclosed that the amount of heparin employed during the fractionation step can vary, with the optimum concentration being one unit of heparin per ml of the plasma solution, whereas concentrations of heparin greater than about 10 units per ml are to be avoided as dangerous.
Purification of Factor VIII by chromatography on heparin (European Patent Application. No. 90308104.0 to Battacharya et al. and Madras et al., Haemostasis, 7, 321-331 (1978)) has also been used. The Madras process, while producing Factor VIII complex, results in a Factor VIII complex with little or no activity. The Battacharya process results in an active Factor VIII; however, the specific activity of the protein purified was at best 66 units/mg. (The phrase "specific activity" as used herein means units of Factor VIII:C clotting activity per milligram of protein. A "unit" is defined as the amount of Factor VIII:C in one ml of normal plasma.)
Purification of Factor VIII has also been achieved by chromatography on monoclonal antibody-containing chromatography media (U.S. Pat. Nos. 4,361,509 and Re. 32,001 to Zimmerman et al.). Such procedures result in Factor VIII:C of very high specific activities, approximately 1500 to 2500 units/mg of total protein, and, therefore, high purity. However, in the Zimmerman process, the Factor VIII:RAg is dissociated from Factor VIII:C, which results in the Factor VIII:C being unstable.
Currently, the methods used to purify Factor VIII result in protein preparations, i.e., Factor VIII concentrates, which have a relatively low Factor VIII:C specific activity. It is desirable that there be provided an improved process for the separation of Factor VIII complex, i.e., the intact Factor VIII:C/Factor VIII:RAg complex, from contaminating proteins for producing Factor VIII which results in increased purity, higher concentration, and enhanced yields and stability of the protein.


A deterministic technique is used for assigning locations to object replicas in a data center, while taking the various constraints into account that guarantee high availability and fast recovery. Example constraints include not putting the replicas on the same machine and not on the same rack, in case the rack or the network switch goes down. Also, because power distribution units (PDUs) can fail, the two replicas are not put on the same PDU. A solution is guaranteed to be found, if one exists.

A data center generally has a cluster of computers, and each computer has some storage, such as hard disks, attached to it. Objects such as a file, a collection of files, or other types of data may be stored on the computer's storage. Replicas or copies of the objects are also desirably stored on one or more machines in the cluster. It is desirable to have multiple replicas of the object so in case one replica storage gets corrupted or destroyed or if an associated machine becomes unavailable, another replica can still be accessed. For example, two replicas may be stored, referred to as a primary replica and a secondary replica. The two replicas of a given object are said to be peers of each other.
A problem is determining where to store the primary and secondary replica of each object among the computers in the cluster in such a way that certain constraints are not violated. For example, it might be desirable that every object has at least one of its replicas available whenever some class of common failures occurs.
It is desirable to assign storage locations to object replicas such that high availability and fast recovery may be achieved. Conventional methods of solving the replica-assignment problem rely on trial and error.

Network flow for constrained replica placement


A memory-logics LSI device forms an input/output path for testing. A memory device has a memory input/output unit,which includes an input/output selector with test function. A test clock signal, which is directly supplied in the test mode, is used to selectively take in one of input signals and an output signal to output the signal. The output is monitored on an external pin, while changing the timing of the positive-going edge of the clock signal, or the input signals. Relative measurement is then made on a delay amount indicating to which extent the input signals are delayedto cause a phase shift with respect to the clock signal,at the timing immediately before input to and after output from the memory device.

1. Field of the Invention
The present invention relates to a semiconductor device, and more particularly to a semiconductor device capable of accurately measuring a time parameter, such as the setup/hold time and the access time, of a synchronous memory device mounted on an LSI (large-scale integration) device together with synchronous logics integrated thereon.
2. Description of the Background Art
In general, a memory-logics LSI device, integrated on a semiconductor substrate, includes a memory or storage device, logics, an external signal switching circuit and a memory-logics interface (IF) signal switching circuit. Briefly describing the interconnection of these components, the memory-logics interface signal switching circuit is arranged between the memory device and the logics. The memory-logics interface signal switching circuit is supplied with an input signal from the logics on its input path to output the signal to the memory device from its output path. The memory-logics interface signal switching circuit is also supplied with a signal from the memory device on its other input path to deliver the signal to the logics from its other output path.
Between the external input/output pins of the integrated circuit and the logics, an external signal switching circuit is provided. The external signal switching circuit is supplied with a signal supplied from outside on its input path, to output the supplied signal from its output path to the external input/output pins. By the interconnection stated above, the memory-logics LSI device is thus adapted to transmit and receive the signals.
The memory-logics LSI device has a memory test mode evaluating the characteristics of the memory device. In the memory test mode, the external signal switching circuit and the memory-logics interface signal switching circuit of the memory-logics LSI device are made operative as a test interface circuit, and a test input path and a test output path are arranged to be directly used as an internal data transfer path without the intermediary of the logics disposed between the external signal switching circuit and the memory-logics interface signal switching circuit.
The memory configuration will now be described. The memory device includes a memory input/output unit and a memory controller, through which data are transferred to and from the synchronous memory. In particular, the memory input/output unit uses, for each input, an input buffer, a delay for timing adjustment and a flip-flop circuit, while using, for each output, an output buffer. In respect of clocks, an input buffer and a clock driver are provided. The flip-flop circuit used on the input side and the output buffer used on the output side are supplied with input clocks and output clocks, respectively.
The memory-logics LSI device structured as stated above makes the internal data transfer path operative to measure the setup/hold time and the access time of the memory device. The setup/hold time and the access time in the memory-logics LSI device are measured with the delay involved which is encountered on the internal signal paths such as the external signal switching circuit from the input/output pins to the memory device and the direct input/output path.
Several other examples of memory operational test have been proposed. The semiconductor integrated circuit device disclosed in Japanese patent laid-open publication No. 264675/1993 aims at improving the accuracy of the operational test of a memory device mounted on the integrated circuit device. In the circuit device, a memory device and a logic circuit are formed on the same semiconductor chip and an operational test of the memory device is carried out in response to an address signal entered from a terminal dedicated to testing on the chip. In response to this multi-bit address signal, entered from the terminal, the memory test circuit provides the input port of the memory device with the multi-bit address signal, and thereafter outputs a write control signal of a predetermined pulse duration to the memory device in response to the multi-bit address signal. That causes the operational test to be conducted without being affected by variations in the signal transfer time, thus improving accuracy in operational test.
The memory device integrated together with logics and the testing method therefor, disclosed in Japanese patent laid-open publication No. 174121/1999, intend to reduce the number of the transitions at the time of switching test modes to thereby improving the test efficiency and reducing the noise. The memory device is provided with an ordinary operational test mode for testing a memory core via a logic circuit, and a bypass test mode for entering information from an external pad without the intermediary of the logic circuit to directly test the memory core. The test circuit is thus used in common to the logic circuit and the memory core. The test selection information from a mode register or the test selection information from multiplexers is selected by another multiplexer, so that the selected information is supplied to the test circuit to enable the setting and the execution of the test mode.
The apparatus and method for testing a semiconductor integrated circuit, disclosed in Japanese patent laid-open publication No. 2002-162444, improve the situation in which the LSI device is not actually operative when the memory is tested to cause unforeseen operational troubles during actual use, or in which the memory and the random logics are tested independently of each other to thereby increase the cost for testing. For that aim, the memory device is supplied with a test signal separately from the logics, and the logics are supplied with an operating signal for intentionally being rendered operative. Hence, the operating state may be established closely to the actual operating state. In addition, the memory test and the scanning test may be conducted simultaneously, and therefore the test time may be shorter, whilst the cost for testing may also be reduced.
The case of evaluating memory characteristics in the memory-logics LSI device, indicated above, will now briefly be described. In measuring the access time by the above-indicated configuration, a clock signal is supplied over connections of the external input pins, external signal switching circuit, memory-logics interface signal switching circuit and memory input buffer. On the other hand, the output data from the memory device are supplied over connections of the memory-logics interface signal switching circuit, external signal switching circuit and external connection pins. Those connections cause the actual access time to be measured including the time required from inputting an external clock to outputting external data, that is, the delay time caused by the above-described circuits and the load on the connections.
Turning now to the setup/hold time, the input signal is supplied over the connections of the external input pins, external signal switching circuits, memory-logics interface signal switching circuit and memory input buffer to the flip-flop circuit of the memory device. In this case, the setup/hold time is actually measured including the difference in input timing between the external input pins for clock and input signals, that is, the skew ascribable to the physical difference between the transfer routes of the clock and the input signals. This time measurement did not correctly reflect the memory characteristics.
Japanese patent laid-open publication Nos. 264675/1993 and 2002-162444 deal with, as described above, measuring the time free from delay but the problem totally different from measuring the time free from. Japanese patent laid-open publication No. 174121/1999 discloses the bypass test mode indeed, and is silent about measurement of time free from delay described above.

Semiconductor device for accurate measurement of time parameters in operation


A scanning system includes a plurality of light detection and ranging (LiDAR) sensors, each LiDAR sensor of the plurality of LiDAR sensors being configured to generate a point cloud based on interactions of emitted light with a surrounding environment, and a processor configured to split a full 360° rotation of each LiDAR sensor into a plurality of slices including a first slice and a second slice, to generate a coherent fused point cloud by fusing together portions of point clouds of the plurality of LiDAR sensors corresponding to the first slice, and fusing together portions of point clouds of the plurality of LiDAR sensors corresponding to the second slice, to determine an action for the scanning system to take in response to the generation of the coherent fused point cloud, and to cause the scanning system to implement the action.

Generally, technical areas such as autonomous driving, robotics, and advanced driver-assistance (ADAS) systems rely on three-dimensional perception capabilities. The understanding of where an object is located in the world with respect to the robotic or autonomous driving platform is crucial for the decision making. Moreover, such information may only be valuable if one can associate an accurate timestamp to the localization of an object. Given a state of the world and a time, the prediction module can determine how agents in a scene are behaving, thus allowing the decision-making module to maneuver safely (or, e.g., inform the driver of potential hazards) in the environment.
The above information disclosed in this Background section is only for enhancement of understanding of the present disclosure, and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

Spatially and temporally coherent multi-LiDAR point cloud fusion


The present invention relates to a partial ester derived from the reaction product of an oxirane containing acid or derivative thereof, and a reactive hydroxyl compound selected from the group consisting of diols, triols, di-diols and 1,4-dihydroxy butane and a halogen containing polymer compositon thereof. The oxirane compound can be derived from the group consisting of epoxidized vegetable oil, epoxidized fish oil, an aliphatic or arylaliphatic containing craboxyl compound having an oxirane group in the aliphatic chain.

1. Field of the Invention
This invention relates to compounds containing a partial ester of an oxirane (epoxy) group and related halogen-containing polymer compositions, preferably poly(vinyl halide) compositions; and more particularly, this invention relates to partial esters of oxirane compounds in stabilized poly(vinyl chloride) (PVC) compositions.
2. Description of Related Art
Many halogen containing polymers and copolymers are thermoplastic in nature and require heating in order to fabricate them in operations such as molding, calendering, and extruding. The heat with which these polymers are processed is usually in the range of 140.degree. C. to 250.degree. C., and more typically 150.degree. C. to 225.degree. C. and is limited in degree and duration by their tendency to deteriorate and decompose. Decomposition of the polymers leads to deterioration of the resultant physical properties of the resin. In addition, a severe darkening in color of the resin results which prohibits its use in lightly colored or transparent articles. This deterioration and decomposition is a major drawback to the use of poly(vinyl chloride) resins in many applications. In order to overcome this deficiency thermal stabilizers, lubricants and processing aides are employed with halogen containing vinyl polymers.
Sarvetnick, Polyvinyl Chloride, Van Nostrand Reinhold CO., pp. 124-127, 1969, discloses the use of both external and internal lubricants in PVC. The main purpose of a lubricant compound is to facilitate processing and permit control of processing rate. External lubricants cause lubricity between the composition and metal surfaces of molds and processing equipment. Internal lubricants affect the frictional properties of resin particles in the composition during processing, thus enabling the compounder to maintain control over the fusion rate of the resin. Most lubricants exhibit both internal and external properties; however some are quite specific. Stearic acid and metal stearates are most commonly used. Other lubricants employed include petroleum based waxes, mineral and vegetable oils, low molecular weight polyethylene, amide and ester waxes, and silicone oils. Metal stearates such as lead, barium, cadmium, and calcium may be used for the dual purpose of stabilizing and lubrication. Lubricants are typically used in the range of from 0.25 to 1.0 percent.
In general, stabilizers fall into three main classes, metal soaps, organic chemicals, and organometallic compounds. Vinyl halide polymer compositions typically contain one or more metal-containing heat stabilizers. Metal-containing stabilizers include compounds where the metal is lithium, sodium, potassium, magnesium, calcium, zinc, strontium, cadmium, barium, manganese, iron, cobalt, titanium, aluminum, tin, lead, bismuth or antimony, or a mixture of any two or more such metal-containing compounds The use of many of these metal-containing compounds as PVC stabilizers is described in British Patent Specification 1,001,344 and an article by Robert G. Weiler, "Uncommon Metals as Heat Stabilizers for Flexible Vinyl", pages 534-537, Volume 28, Technical Papers, Society of Plastics Engineers, Inc., 1982.
Organotin compounds, particularly those having tin bonded to sulfur, such as those which contain a mercapto group, have been found to be an extremely effective type of stabilizer for halogen containing polymers, such as poly(vinyl chloride) polymers. A continuing goal of the fabricator is to reduce the cost of the compositions but obtain equal or better heat stability properties. This may be achieved with lower usage of more efficient organotin stabilizers but they still are relatively expensive. Another approach is to replace at least a portion of the tin present in a given resin formulation with a less expensive material, e.g., by addition of less expensive synergistic additive compounds.
Other well-known metal-containing heat stabilizers for vinyl halide polymers include compounds of the elements of Groups IIA and IIB of the Periodic Table of the Elements, as well as compounds of tin, lead, bismuth and antimony. Conventional well-known heat stabilizers for vinyl chloride polymers are also discussed in Chapter 9 of The Encyclopedia of PVC, edited by L. I. Nass (M. Dekker, New York 1976).
Japanese Patent, JP 75-143456 discloses a stabilized composition of a halogen resin containing a reaction product of a trihydric alcohol or greater and an epoxidized fatty acid ester. The composition contains at least one metallic salt which can be organotin or Group IIa metal stabilizing compound. While not identifying the structure of the reaction product, the Japanese reference discloses that the compound can be synthesized in water or in a water soluble organic solvent with an inorganic acid or alkaline catalyst. This would be expected to result in significant hydrolysis or saponification of the ester and possibly cleavage of the epoxy group. Therefore, the composition of the reaction products is not apparent

Partial esters of epoxy containing compounds


A method for determining a presence of a locking signal in a signal received by an optical receiver device, the optical receiver device configured to be used in an optical communications network, the locking signal being a signal exchanged by optical communication devices of the optical communications network in a phase preceding setting up communications between the optical communication devices. The presence of the locking signal is determined by obtaining a direct current component or a component at twice a frequency at which the locking signal is supposed to be modulated, and by obtaining a contribution of the communication signal, if any, on the component.

The present invention generally relates to optical communications networks and more particularly to configuring the carrier wavelength to be used by a first optical communication device to communicate with a second optical communication device.
Optical communications networks, and more particularly passive optical communications networks, are increasingly used to give network access to residential or office gateways or to ensure mobile backhauling for instance.
In an attempt to increase the number of users to be served by one access system to the network, wavelength or frequency division multiplexing technologies have been developed. These technologies take advantage of multiplexing several optical signals using different carrier wavelengths or frequencies on a single optical fiber. Even though some user terminals may share the same carrier wavelength or frequency, a wavelength or frequency splitter is typically used to separate the different wavelengths, or frequencies, in order to increase the number of simultaneous optical transmissions. The wavelength or frequency splitter is typically placed between the user terminals and a terminal providing access to the rest of the network. For instance this latter terminal provides access to a metropolitan network or a core network. Different techniques can be used to achieve the wavelength or frequency splitting. We can cite thin films based systems, interference cavities as AWG (Array Wavelength Gratings) and FBG (Fiber Bragg Gratings).
The wavelength or frequency splitter then comprises several optical band-pass filters, for each direction of communications. It is used to filter and combine optical signals issued by the user terminals toward the terminal giving access to the metropolitan or core network. In the other direction, it is used to filter and spectrally split the optical signals issued by the terminal giving access to the metropolitan or core network.

Method and device for determining a presence of a locking signal in a signal received by an optical receiver device


An apparatus and associated methods to aid in system identification in a heterogeneous communication environment is generally described herein.

The need for increased data throughput and reliability has ushered a rapid advance in the development of next generation wireless networking technologies. One example of this rapid advance is illustrated within the IEEE 802.11 family of wireless local area network (WLAN) standards. To avoid fragmentation of the market with a proliferation of incompatible standards, a design goal for subsequent iterations of the 802.11 standard is that compatible devices be backward compatible with prior generation, or legacy, devices.
Illustratively, there is a requirement in the evolving next generation high-throughput (HT) WLAN (802.11n) standard that compatible devices be able to operate concurrently with the prior generation, 802.11a or 0.11 g devices in the same channel. One suggested solution is to use a rotated (BPSK) modulation, or a quadrature BPSK (Q-BPSK) for a 1st HT signal field of a HT WLAN packet. It will be appreciated by those skilled in the art that differentiating between a BPSK packet rotated by ninety-degrees (90°) and a packet modulated using 16-QAM may be difficult when the receiver suffers a poor signal-to-noise ratio (SNR). As such, the proposed solution may not be robust to delivered guaranteed performance under all network conditions.

Apparatus and related methods to aid in system identification in a heterogeneous communication system environment


A support structure or sleeve for the spindle of a machine tool consists of a tubular casing, preferably made of sheet steel with a high modulus of elasticity, in contact with a layer of agglomerate obtained by casting inside the casing a mixture formed by a granulate of stone and/or ceramic and/or expanded clay material as well as a synthetic resin of the hardening type, which is subject to cross-linking. The structure thus obtained combines a high vibration damping factor with an excellent mechanical strength and a reduced weight. The structure may also comprise a second casing which is located inside the layer of agglomerate and in contact therewith. The mass of agglomerate may also have, embedded in it, pipes for circulation of a cooling fluid in order to dispose of the heat produced by the spindle during operation.

The sleeve, which is normally mounted on a carriage, usually performs linear movements along three co-ordinate axes and has the machining tool mounted on its end. Depending on the configuration of the numerical control machine, the sleeve may be vertical or horizontal.
In the first configuration, which is characteristic of so-called gantry machines, the machine comprises a base or bench having two vertical walls or shoulders which support a cross-beam which has, running along it, a support structure, called a carriage, to which the sleeve is integrally joined and movable vertically. In the second type of machine, a vertical upright, which is slidable or fixed onto the base, extends upwards from the base or bench. The spindle-support carriage is mounted on the aforementioned upright, with the possibility of sliding in the vertical direction, while the sleeve, which is arranged horizontally and associated with the carriage, is movable horizontally.
The sleeve is per se a substantially tubular structure which is usually made of welded steel and inside which the main component of the machine tool, or the so-called spindle, is seated. There are two types of spindles: the first type, called an electric spindle, is positioned at the free end of the sleeve and has an attachment for the machining tool; the second type, called a motorised spindle, is housed inside the sleeve itself. For the sake of simplicity, in the present invention, the term "spindle" will be solely used since the sleeve which forms the invention may be used for supporting both an electric spindle and a motorised spindle.
A machine tool is subject to considerable stresses which may cause the deformation of some components, in particular the sleeve, which deformation adversely affects the precision required during machining, such as for example the machining of moulds, in which the tolerances of the finished product must be very small. If we consider the sleeve in particular, it must satisfy varying requirements which also are of a mutually opposing nature and can be summarised principally as follows:
a) rigidity, which by counteracting the abovementioned deformations, ensures that the requirements for precision during machining are satisfied;
b) damping of the vibrations resulting from machining, said vibrations also adversely affecting the machining precision and the possibility of achieving the desired tolerances; and
c) dissipation of the heat which is produced by the spindle during operation of the machine tool and is due both to the friction (for example of the bearings and the sliding guides) and to the various functional electric components (such as the motors, for example) as a result of the Joule effect.
In order to satisfy the requirement for rigidity, the sleeve is usually made of welded steel or cast iron with a considerable thickness, which however also results in a notable weight. The latter affects the remaining structural part of the machine which must be especially strengthened. Apart from this (which in any case constitutes a drawback affecting the design and manufacture of the machine), there is an increase in the masses involved and therefore the sleeve movement times, unless sleeve actuating motors are used which are more powerful—and therefore ultimately more costly.
The use of steel for construction of the sleeves in any case does not ensure a good level of damping of the vibrations, while the use of nodular cast iron, which is able to dampen vibrations, has the drawback of a low modulus of elasticity of this material.
Finally, there remains the unsolved problem of dissipating the heat generated during operation of the machine.

Structure for supporting the spindle in a machine tool and method for the manufacture thereof


An all-optical integrated photonic clock, systems employing the same, and methods of making and using the same. Illustrative examples are provided based on silicon semiconductor technology that employs rectangular waveguides fabricated on SOI wafers. In some embodiments, the clock can provide an optical timing signal. In some embodiments, the clock can provide a jitter-free electrical signal derived from the clock by use of a high speed photodetector.

1. Field of the Invention
The invention relates to all-optical modulators in general and particularly to a silicon all-optical integrated photonic clock that employs single photon absorption.
2. Description of Related Art
All-optical, low-power modulation is a major goal in photonics. Because of their high mode-field concentration and ease of manufacturing, nanoscale silicon waveguides offer an intriguing platform for photonics. To the best knowledge and belief of the inventors, all-optical modulators built with silicon photonic circuits have relied on either two-photon absorption (TPA) or the Kerr effect. Both effects are weak in silicon, and require extremely high (˜5 W) peak optical power levels to achieve modulation.
Almeida et al ("All-optical control of light on a silicon chip," Nature, vol. 431, pp. 1081-1084, 2004.) and Foerst et al ("High-speed all-optical switching in ion-implanted silicon-on-insulator microring resonators," Optics Letters, vol. 32, pp. 2046-2048, 2007) have recently demonstrated an all-optical modulator with single-photon absorption-based carrier injection using visible light. This approach has severe limitations. Because of the disparate wavelengths for gate and signal, these devices cannot be cascaded into circuits that require feedback.
There is a need for an all-optical clock that can provide accurate timing signals with reduced jitter.

All-optical integrated photonic clock having a delay line for providing gate signal to a gate waveguide


A system and method helps to control “read” and/or “write” access to electronic paper (e-paper). Informational data may be on a restricted portion of e-paper material that is protected by a security methodology accessible to authorized entities. Some embodiments maintain a record of access activity regarding the restricted portion, and a record of access activity regarding use of an item or product or service related to the e-paper informational data. Some implementations include an authorization listing of a person or entity having a particular access privilege or a supervisory privilege to make authorization and data changes. Authorization records may involve an access privilege to receive a status output regarding prior access activity and/or current status.

Electronic paper (sometimes also called electric paper and e-paper) has begun to replace legacy paper as an information source. It has many of the attributes of paper. For example it is writable, reflective and stable. Electronic paper can also be configured as a flexible and thin sheet, like paper.
Electronic paper can be used as an information source to be written to by multiple entities. In some circumstances electronic paper may provide benefits that are not available with ordinary paper material.