A method for composing a scene using a data module includes: receiving, from a user, an instruction to instantiate the data module to produce at least a first instance of the data module in a second data module; receiving, from the user, a first override for modifying the first instance of the data module; receiving, from the user, a second override for modifying the data module; identifying a conflict introduced by the first override or the second override; configuring a display interface to display an indication informing the user of the identified conflict; configuring the display interface to display one or more options for resolving the identified conflict; receiving, from the user, a selection of an option of the one or more options; and in response to the selection of the option, resolving the identified conflict by deleting the first override or the second override.

A computer-generated animation is typically created by rendering a sequence of images, with each image depicting a computer-generated scene composed of one or more computer-generated assets (e.g., a character, a group of characters, an environment, an effect, or a lighting rig). In a particular scene, an asset may include more than one instance of a same data module. For example, a scene may depict a human character having a left arm and a right arm. In this example, the left arm and the right arm are instances of a same data module (e.g., an arm module).
Overrides are a data management technique that allows for reuse of data modules. Overrides allow a user to edit a data module or an instance of the data module, to partially modify content thereof. These overrides are granular edits that allow the instance (or derivation) of a data module to be partially modified from the original.

Stipulated overrides with violation resolution


Disclosed are a method and a system for updating a multi-frequency band pre-distortion coefficient lookup table, in order to solve the problems that the calculation complexity is high. Wherein, the method comprises: collecting a first frequency band reference signal and a first frequency band feedback signal, a second frequency band reference signal and a second frequency band feedback signal; calculating a first frequency band pre-distortion coefficient and a second frequency band pre-distortion coefficient; performing phase calibration on the first frequency band pre-distortion coefficient and the second frequency band pre-distortion coefficient, respectively; and updating a first lookup table according to the first frequency band pre-distortion coefficient performed the phase calibration, and updating a second lookup table according to the second frequency band pre-distortion coefficient performed the phase calibration.

At present, with global large-scale construction of 3G network, operators increasingly focus on reducing the construction costs and the maintenance costs. Power amplifier as one of the most expensive devices in the communication system is more and more required to have a higher efficiency, such that the Digital Pre-Distortion (DPD) technology has developed quickly.
In the DPD technology, the DPD processing of signals is performed mainly by pre-distortion coefficients. The pre-distortion coefficients are substantially stored in a pre-distortion coefficient LookUp Table (LUT). In the existing DPD technology, the research on updating LUT is mainly directed to single frequency band signals and a mathematical model of the DPD processing of signals is as follows:
                                          z                                      (              n              )                                =                                    ∑                              m                =                0                            M                                                                  x                                                  (                                      n                    -                    m                                    )                                                                                ∑                                      q                    =                    1                                    Q                                                                                w                                          m                      ,                      q                                                                                                                              x                                                                          (                                                      n                            -                            m                                                    )                                                                                                                                  (                                              q                        -                        1                                            )                                                                                =                                    ∑                              m                =                0                            M                                                                  x                                                  (                                      n                    -                    m                                    )                                            ·                                                LUT                  m                                                                  (                                                                                x                                                                    (                                                  n                          -                          m                                                )                                                                                                  )                                                                                =                                    ∑                              m                =                0                            M                                                                  x                                                  (                                      n                    -                    m                                    )                                            ·                                                LUT                  m                                                                  (                                      Q                                                              (                                              r                                                  n                          ,                          m                                                                    )                                                        )                                                                                LUT          m                                  (                                                x                                            (                                  n                  -                  m                                )                                                          )                    =                        ∑                      q            =            1                    Q                                              w                          m              ,              q                                                                                                  x                                                  (                                      n                    -                    m                                    )                                                                                  (                              q                -                1                            )                                            ,                            m      =              1                                                  …                                                  M              ,          n      =              1                                                  …                                                  N
Wherein, rn,m=|x(n−m)| is an amplitude of an input signal, Q(•) is a quantization factor, an input address of LUT depends on a quantized amplitude Q(rn,m) of the input signal, wm,q is a pre-distortion coefficient calculated by DPD adaptive filter, and after calculating the Wm,q, a pre-distortion signal may be acquired by a pre-distortion module.
However, presently there is no suitable method for updating LUT of multi-frequency baud signal. If above processing of single frequency band is used for the signals of each frequency, then the calculation complexity will be high and calculated pre-distortion coefficients will be unstable.

Method and system for updating multi-frequency-band pre-distortion coefficient lookup table

DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD


Described are systems, devices and methods for facilitating the delivery of stimulation to, and the monitoring and recording of physiological signals (e.g., electroencephalographic signals) from a research subject. Devices include a headmount that includes a cranial frame and a headstage, and a connection between the headmount and external equipment used for stimulation, monitoring, and/or recording that is robust physically and electrically to optimize stimulation, monitoring and recording even while the subject remains ambulatory. In some embodiments, a hinged headmount allows the configuration to be easily manipulated during attachment and any subsequent adjustment or reattachment procedures and permits easy access to any wires or other components implanted in the subject. In some embodiments, a flexible cable extends out from the headmount at an acute angle relative to a horizontal plane of the headmount, to optimize strain relief as the subject moves about while attached to any stimulation, monitoring and/or recording equipment.

Epileptic seizures are associated with excessive or abnormally synchronous neuronal activity. Physicians have been able to treat epilepsy by surgery to resect one or more brain portions or by medication. Brain surgery is irreversible, and may be ineffective or associated with neural morbidity in a sizable percentage of cases. In many instances, medication may be ineffective in controlling seizures, or patients may suffer from debilitating side effects. A more promising method of treating patients having epileptic seizures is by electrical stimulation of the brain.
Systems, devices and methods for delivering electrical stimulation through electrodes are under investigation for use in treating epilepsy, as well as a number of other conditions, including chronic pain, cardiac arrhythmias, and the like. Research equipment and associated tools are useful in furthering investigations before clinical trials are initiated in humans. It may be desirable to provide one or more improvements to the systems, devices and methods used with non-human subjects in order to carry out the research.

Systems, devices, and methods for monitoring and analyzing research animal behavior before, during and after brain electrical stimulation


A platform adaptor for attachment to a support stand for supporting a large object such as a boat at dry dock includes a support beam which is pivotally connected to a center pole of the support stand and two support struts which extend downwardly from the support beam to attachment to two legs of the support stand such that the support beam will be generally horizontally oriented. A platform plank can be positioned on support beams of two platform adaptors attached to two spaced apart support stands to provide a platform for people and equipment located adjacent the supported object.

1. Field of the Invention
This invention relates to support stands for supporting large objects such as boats at dry dock, and in particular to a platform apparatus that is attachable to such support stands to provide a platform adjacent the supported object for people and equipment.
2. The Prior Art
Support stands for use in supporting and stabilizing large objects are well known and of varying sizes and complexity. One category of support stands are adapted to contact the hull of a boat at dry dock so as to maintain the upright orientation of the boat for storage or repair. Often times multiple support stands are located in spaced relation along both sides of the hull. Typical support stands of this type include a center pole supported by three legs, one of the legs being shorter in length than the other two, with the center pole mounting an abutment element which can be moved in relation to the center pole so as to contact and buttress the hull against tilting. See, for example, U.S. Pat. No. 4,155,667 and U.S. Pat. No. 4,759,660.
When repair work needs to be done on the hull, workers must use ladders to elevate themselves to the necessary heights or scaffolding must be erected next to the boat. Using ladders is not always adequate as there will be no place to put heavy equipment that may be needed, and the erection of scaffolding requires the availability of extra equipment that may be expensive and complicated to put together.


A method, system and computer program product for handling write requests in a data processing system is disclosed. The method comprises receiving on an interconnect bus a first write request targeted to a first address and receiving on the interconnect bus a subsequent second write request targeted to a subsequent second address. The subsequent second write request is completed prior to completing the first write request, and, responsive to receiving a read request targeting the second address before the first write request has completed, data associated with the second address of the second write request is supplied only after the first write request completes.

1. Technical Field
The present invention relates in general to data processing systems and in particular to managing memory access in data processing systems. Still more particularly, the present invention relates to a system, method and computer program product for preserving the ordering of read and write operations in a direct memory access system by delaying read access.
2. Description of the Related Art
A conventional symmetric multiprocessor (SMP) computer system, such as a server computer system, includes multiple processing units coupled to a system interconnect, which typically comprises one or more address, data and control buses. Coupled to the system interconnect is a system memory, which represents the lowest level of volatile memory in the multiprocessor computer system and which generally is accessible for read and write access by all processing units. In order to reduce access latency to instructions and data residing in the system memory, each processing unit is typically further supported by a respective multi-level cache hierarchy, the lower level(s) of which may be shared by one or more processor cores.
One aspect of design that affects cache performance and design complexity is the handling of writes initiated by the processor or by an alternate bus master. Because two copies of a particular piece of data or instruction code can exist, one in system memory and a duplicate copy in the cache, writes to either the system memory or the cache memory can result in an inconsistency between the contents of the two storage units. For example, consider the case in which the same data in both the cache memory and the system memory in association with a particular address. If the processor subsequently initiates a write cycle to store a new data item at the predetermined address, a cache write "hit" occurs and the processor proceeds to write the new data into the cache memory. Since the data is modified in the cache memory but not in the system memory, the cache memory and system memory become inconsistent. Similarly, in systems with an alternate bus master, direct memory access (DMA) write cycles to system memory by the alternate bus master modify data in system memory but not in the cache memory. Again, the data in the cache memory and system memory become inconsistent.
Inconsistency between data in the cache memory and data in system memory during processor writes can be prevented or handled by implementing one of several commonly employed techniques. In the first technique, a "write-through" cache guarantees consistency between the cache memory and system memory by writing the same data to both the cache memory and system memory. The contents of the cache memory and system memory are always identical, and so the two storage systems are always coherent. In a second technique, a "write back" cache handles processor writes by writing only to the cache memory and setting a "dirty" bit to indicate cache entries which have been altered by the processor. When "dirty" or altered cache entries are later replaced during a "cache replacement" cycle, the modified data is written back into system memory.
Inconsistency between data in the cache memory and corresponding data in system memory during a DMA write operation is handled somewhat differently. Depending upon the particular caching architecture employed, one of the variety of bus monitoring or "snooping" techniques may be used. One such technique involves the invalidation of cache entries which become "stale" or inconsistent with system memory after a DMA write to system memory occurs. Another technique involves the "write-back" to system memory of all dirty memory blocks within the cache memory prior to the actual writing of data by the alternate bus master. After the dirty memory blocks that are targeted by the DMA write is written back to the system memory, the memory blocks are invalidated in the cache, and the write by the alternate bus master may be performed.
As systems become larger and the latency required to resolve cache coherence increases, this latency can limit the bandwidth that a DMA device is able to achieve in the system. To sustain full DMA write throughput, the system must balance the amount of time to resolve cache coherence with the amount of data transferred per request. The traditional method of balancing time required to resolve cache coherence and the amount of data transferred per request is to design the system with a larger cache line size. Thus, with a larger cache line size, more data can be invalidated per cache line invalidation request. However, the major drawbacks of increasing the cache line size include trailing edge effects and the increased likelihood of false sharing of data within the larger cache lines.
Therefore, there is a need for an improved system and method of increasing the throughput capacity of DMA devices without increasing the size of the cache line within the cache memory.

Method to preserve ordering of read and write operations in a DMA system by delaying read access

International Business Machines Corporation


A magnetic induction device mounted at the wellhead that is capable of measuring changes in magnetic flux can recognize when a tubing joint or casing collar passes in or out of the well. The number of changes in magnetic flux directly correlates to the number of joints and collars that have passed, and therefore an accurate inventory of the number of lengths of casing or tubing that are run into the well can be automatically maintained.

After a drilling rig is used to drill an oil or gas well and install the well casing, the rig is dismantled and removed from the site. From that point on, a well service rig typically is used to service the well. Servicing includes, among many other things, installing and removing inner tubing strings and sucker rods. When a drilling or well service rig is working on a well, it is incumbent upon the crew operating the rig to create a record of the casing, tubing, or rods installed into and removed from the well. This record is an important part of the well file, or well history, and will often be referred to at later dates during the life of the well. However, counting individual casing, tubing, or sucker rod segments, or their joints or connections, and then later correlating this count to the depths within the well of the individual casing, tubing, or rod segments, or their joints or connections, can be a laborious task that is very much susceptible to human error.
While there are many devices and methods of locating and recording tubing connections, this technology generally is applied to casing and tubing that has already been run into the well. For examples, see U.S. Pat. Nos. 6,032,739 and 6,003,597. Current well servicing technology does not include a means for automatically counting the number of joints or connections at the same time the casing, tubing, or rods are being pulled from or run into a well. Furthermore, there is no technology that can automatically reduce this count into database form. Finally, there is no system that can automatically give the rig operator a continuously updated rod, tubing, or casing count as these items are being run in or pulled from a well. This invention alleviates these deficiencies.


To provide a semiconductor device capable of being easily subjected to a physical test without deteriorating characteristics. According to a measuring method of a semiconductor device in which an element layer provided with a test element including a terminal portion is sealed with first and second films having flexibility, the first film formed over the terminal portion is removed to form a contact hole reaching the terminal portion; the contact hole is filled with a resin containing a conductive material; heating is carried out after arranging a wiring substrate having flexibility over the resin with which filling has been performed so that the terminal portion and the wiring substrate having flexibility are electrically connected via the resin containing a conductive material; and a measurement is performed.

Recently, a wireless chip which sends and receives data has been actively developed, and such a wireless chip is also called an IC tag, an ID tag, a radio frequency (RF) tag, a radio frequency identification (RFID) tag, a wireless tag, an electronic tag, a wireless processor, a wireless memory, or the like.
As a transmission system of the wireless chip, there are three types of an electromagnetic coupling system, an electromagnetic induction system, and a radio wave system. The electromagnetic coupling system employs a mutual induction of electric coils by alternating magnetic field, and employs a frequency of 13.56 MHz. With the electromagnetic coupling system, a communication with a range of approximately several tens cm at most can be performed. The electromagnetic induction system employs two types of frequencies with classifying broadly. One is 135 kHz or less, and the other is 13.56 MHz. Communication with a range of maximum about 1 m with a wireless chip can be performed, though it depends on a shape and a size of a wireless chip and reader/writer. The radio wave system employs frequency bands of UHF and 2.45 GHz, and has a greatest feature that a communication range is long.
Generally, a wireless chip (also referred to as an IC chip) includes an integrated circuit portion including a transistor or the like, and an antenna. The wireless chip can exchange information with an external device (reader/writer) via radio waves. Lately, by providing the wireless chip to various articles, monitoring, management, or the like of the articles is tried. For example, a merchandize management system has been proposed in which by attaching a wireless chip to an article, the merchandize management is automatically carried out with ease, as well as the stock control of the stock quantity, the stock status, and the like (Reference 1: Japanese Patent Laid-Open No. 2004-359363). In addition, an application of the wireless chip to a security device or a security system has been proposed for improving the anticrime effect (Reference 2: Japanese Patent Laid-Open No. 2003-303379). Further, a method for preventing abuse due to exploitation by mounting the wireless chip to paper money, securities, or the like has been proposed (Reference 3: Japanese Patent Laid-Open No. 2001-260580). Thus, applications of the wireless chip to various fields have been proposed.
In addition, the wireless chip is used by attaching to a surface of an article, embedding in an article, or the like so as to be fixed. For example, the wireless chip is used after embedding in an organic resin of a package made of the organic resin, or attaching to a surface thereof.

Semiconductor device, manufacturing method thereof, and measuring method thereof

SEMICONDUCTOR ENERGY LABORATORY CO., LTD.


Systems, methods, and devices are configured to share a printable electronic document created as part of a job, such as a print, copy, or scan job, between users. They include receiving a command to print an electronic document associated with a job initiated on a multi-function device, the job initiated in response to an input from a first user. They further include receiving an input to share the electronic document associated with the job with a second user and identifying the second user. They also include sending a notification message to the identified second user, the notification message indicating an availability of the electronic document associated with the job to the identified second user.

Networked printer systems allow a user to create and submit a processing job, such as a print job, a copy job, or scan job for physical or electronic document to a multi-function printer or multi-function device (MFD). Networked printer systems may also allow the user to print an electronic document from a job created as a print job, copy job, or scan job on one MFD or printer and print the electronic document on any other printer or MFD on the network. However if the user wishes to share the electronic document used or created as part of the job (e.g., print job, copy job, or scan job) with any other users, the user typically has to transfer the electronic document to another device, copy the electronic document to a portable memory device, send an email message to the other user with the electronic document as an attachment, or share his/her login credentials with the other user.
The available mechanisms for sharing a printable electronic document between users, created as part of a job initiated at an MFD have some drawbacks. Sharing authentication or logon information between users or with persons not authorized to have access to the network may create security issues and may further be against business policy. Additionally, sharing the source file with another user, using a mechanism such as through email, server sharing, direct copy, or any other method of file transfer, requires an additional use of resources and additional time from the users for accessing and transferring the file, creating the print job, finally printing the document. Further, sharing a printable electronic document created from a physical document as part of a copy or scan job at an MFD requires additional time and resources by the first user to transfer the printable electronic document using a device other than the MFD. Therefore, there is a need to address the issues associated with sharing a printable electronic document created or used as part of a job at an MFD between users.

Apparatus and method for sharing a printable electronic document between users


A differential circuit layout can advantageously use step symmetry for inductors and mirror symmetry for the rest of the circuit. Interconnect segments can be used to connect the terminals of the inductors to other components in the circuit. These interconnect segments facilitate the transition from the step symmetry of the inductors to the mirror symmetry of the other components. To provide this transition, the terminals of an inductor and its associated interconnect segments are formed on a middle axis of the inductor. This mixed symmetry can advantageously cancel the common-mode magnetic field, reduce the parasitic inductor coupling, and balance parasitic wiring capacitances between the two sides of the differential circuit.

1. Field of the Invention
The present invention relates to an inductor layout and in particular to an inductor layout using step symmetry for the inductors and mirror symmetry for the rest of the circuit.
2. Description of the Related Art
Inductors can be used in many types of circuits. For example, in radio frequency (RF) circuits, inductors can be used in voltage-controlled oscillators (VCOs), low-noise amplifiers, and passive-element filters. In general, an inductor is a passive electrical device that stores energy in a magnetic field.
An inductor is physically formed using one or more turns of wire and has two terminals. FIG. 1 illustrates a layout of an exemplary spiral inductor 100 including an outer terminal 101 and an inner terminal 102. Inductor 100 is formed in a square pattern, which can provide more inductance for a given surface area and can be easily fabricated using standard integrated circuit techniques. In one technique, inductor 100 can be built on a substrate (e.g. silicon) using at least two metal layers. Specifically, a first metal layer can be used to form spiral coil 103 whereas a second metal layer can be used to form an underpass contact 104. Underpass contact 104 can be connected to inner terminal 102 using a via (not shown).
RF circuits are increasingly using differential techniques to achieve enhanced linearity, dynamic range, and output power. In a differential circuit, signals with equal magnitude and opposite phase are transmitted and processed using two sets of components. Of importance, both sets of components are ideally symmetrical with respect to each other. This symmetry can be used to reject common-mode coupling, which can otherwise result in interference and undesirably affect signal processing.
Mirror symmetry for a layout of a differential circuit is commonly used because of its effectiveness in providing identical parasitic wiring capacitances on both sides of the differential circuit, thereby simplifying computations taking into account these capacitances. For example, FIG. 2 illustrates a schematic of an exemplary bandpass filter 200 including devices, e.g. inductors 201 and capacitors 202 and 203, that can be formed using mirror symmetry (e.g. using inductor layouts 201′ and 201″).
However, in a differential circuit that includes inductors, current flows in opposite directions (indicated by arrows 206 and 207). Using the well known "right hand rule", the magnetic field generated by the inductor using layout 201′ would be going into the plane including the inductor, which is shown by symbol 208. Unfortunately, the magnetic field using layout 201″ would also be going into the plane including the inductor, which is shown by symbol 209 (i.e. the magnetic fields would be positioned in the same direction). A sensitive circuit positioned near this inductor pair may be adversely affected by this combined magnetic field.
In contrast, if step symmetry is used (for example, if both inductors of a differential circuit are instantiated using layout 201′), the net far field transmitted is zero, since the magnetic field generated by one inductor effectively cancels the magnetic field generated by the other. Sensitive circuits may thus be placed in proximity to inductor pairs in step symmetry with no substantial degradation.
Similarly, a magnetic field couples as a common-mode signal when inductor step symmetry is used. For example, FIG. 3 illustrates a schematic of bandpass filter 200 that can be formed using step symmetry (e.g. using inductor layout 201′). A magnetic field would therefore create a common-mode current in this inductor pair and can thus advantageously substantially cancel the effect of the coupled field.
In contrast, a magnetic field would couple as a differential signal if inductors in a differential circuit are instantiated using mirror symmetry (e.g. using inductor layouts 201′ and 201″). Deleterious interference from a nearby circuit producing a magnetic field may result in this inductor configuration.
Unfortunately, using step symmetry makes balancing of parasitic wiring capacitances between the two sides of the differential circuit difficult. Therefore, a need arises for a technique and layout that provide the benefits of both mirror and step symmetries.

Inductor layout using step symmetry for inductors


Flashing footwear includes at least one light source, e.g., an LED, located on an external surface of the footwear so as to be visible, such as the rear of the heel. A power source, such as a battery, provides sufficient power to light the light source to cause illumination in response to a switch actuated by the condition of motion of the footwear so as to change between open and closed positions. A circuit is combined with the battery and switch to form a module arranged in the heel of the footwear. This circuit directs power from the battery to the LED to cause the LED to illuminate for a period of time in response to a change of the switch from the closed position to the open position and/or to light continuously while the switch is closed.

The present invention relates to lighted footwear and, more particularly, to footwear with light modules that apply power from a power source in such a way as to turn on the lights so the safety of the wearer is improved, the useful life of the power source is extended and an attractive lighting pattern is created.
At various times in the past, lighted footwear has enjoyed some popularity. This lighted footwear all has the same basic components, i.e., at least one light source, a source of power for the light or lights and a switch of some sort to apply the output of the power source to the light to cause it to come on and provide illumination. The lights can be of a variety of types, e.g., incandescent bulbs, electroluminescent panels, and light emitting diodes (LEDs). These are popular lights for this purpose because they can be lighted by the power from small batteries, so that the elements lighting the light can be encapsulated in the footwear and need not be connected to any external power source. However, there is no reason that light sources which require a.c. voltage or current, such as fluorescent lights, could not be used in lighted footwear, assuming a suitable power source were provided. Consequently, as used in this application, "light source" is intended to encompass any device capable of generating detectible light, visible or otherwise, e.g., infrared.
In its simplest form lighted footwear typically has lights in the heel and along the sole of the footwear, which could be athletic, casual shoes, formal shoes or sandals for men, women or children. A battery, e.g, of three (3) volts output, is incorporated in the heel or sole of the shoe and is connected by wires to the lights. A switch is provided in the connecting wires to control the illumination of the lights, which switch may be a simple manual switch as disclosed in U.S. Pat. No. 4,158,922 of Dana, III. Thus, whenever the user wishes the lights to be on, for example, just before he or she goes jogging at night, he or she can turn on the lights by operating the switch. However, with such an arrangement the lights would be on continuously until the switch is turned off.
If the lights are flashed intermittently, there are two advantages. First, the life of the battery is increased in proportion to the time the lights are off during the intermittent flashing. Second, a more attractive eye-catching display is provided. When running at night, the flashing of the lights makes the user more visible, e.g., to motorist, so that the safety of the user is increased. One way to achieve a flashing effect is to utilize a motion-activated switch to apply power to the lights. This could be a mercury switch which is in the form of a tube containing a quantity of mercury and having spaced-apart electrical contacts. The tube is oriented on the footwear so that when the footwear is flat, there is no connection between the contacts. However, as the footwear is tilted, as during the taking of a step, the mercury runs down the tube and closes the contacts. This contact is broken again when the footwear is flat again at the completion of the step. Thus, as the user walks, the lights come on and go off. Mercury switch operated lighted footwear is disclosed in U.S. Pat. No. 4,848,009 of Rodgers and the Dana III '922 patent mentioned above.
In another form of motion-activated switch, the mercury in a mercury switch is replaced for environmental reasons with a metal ball that rolls in the tube. Further, mechanical motion activation can be achieved by the mechanical lever system disclosed in U.S. Pat. No. 2,572,760 of Rikelman. In addition, intermittent operation of the lights can be achieved by a pressure switch. During jogging, whenever the wearer's foot hits the ground the pressure activates a switch in the shoe which closes the circuit and causes the lights to flash. Such a pressure switch is disclosed in European Patent Application No. 0 121 026 of Dana III.
Another way to achieve an intermittent lighting effect is to incorporate an electronic circuit into the flashing footwear. This circuit could be an integrated circuit low frequency oscillator or flasher operated by the switch and providing the power to the lights. Whenever the switch is closed the oscillator provides power to the lights at a slow rate, e.g., from 0.5 to 2.5 Hz. Such a flasher could be like the National Semiconductor LM3909 LED Flasher/Oscillator. Use of this device to provide intermittent lighting is disclosed in the Dana III European patent application. The U.S. Pat. No. 4,158,922 of Dana III also discloses a low frequency oscillator made from individual components which is used in this fashion.
One problem with these prior motion-activated switches, e.g., the mercury, ball, lever and pressure switches, is that they can remain continuously closed, thus allowing the lights to stay on and running the battery down. For example, if shoes with the mercury, ball or lever switches are placed at an attitude corresponding to a step in walking, the switch will close and the lights will light continuously. Similarly, the shoes with the pressure switch can be packed so there is enough pressure on the switch so that these lights are on. If this happens in transit from the factory to the store shelves, the flashing effect may no longer work at the time an attempt is made to sell the product to the ultimate user or soon after the sale. This can cause customer complaints and returns of the merchandise. With the pressure switch, if the wear is merely standing in one place for too long, the lights will remain on and premature exhaustion of the battery will occur.
An electronic solution to the problem of premature battery exhaustion is disclosed in U.S. Pat. No. 4,848,009 of Rodgers. The Rodgers patent proposes that the power to light the lights be provided from the battery through a circuit. This circuit is than controlled by the switch and a further timing circuit so that when the switch closes the circuit provides power to the light and starts the timing circuit. After a predetermined period of time the timing circuit signals the power circuit to cut off the power to the lights. Power cannot be reapplied to the lights until the switch opens and closes again. This results in a single illumination of the lights for a fixed period of time in response to the closure of the switch.
An alternative arrangement for avoiding premature battery exhaustion is provided in U.S. Pat. No. 5,408,764 of Wut. The Wut arrangement uses a battery, lights and a spring switch. The spring switch is in the form of a coil of spring wire which is cantilevered over an electrical contact on a printed circuit board. The other end is also connected to an electrical contact. Whenever a jolt is given to the switch, a module containing the switch, or a shoe containing the switch, the coil of wire will swing into contact with the printed circuit board contact, thus closing the circuit and supplying power to light the lights. However, because of the spring nature of the coil, it swings back out of contact with the printed circuit board as soon as the momentum applied by the jolt is overcome. As a result the spring switch provides only intermittent contact, so it cannot apply power to the lights for a long period of time and run down the battery.
It is known to provide enhanced attractiveness to flashing footwear by providing sequential lighting of a plurality of lights instead of mere intermittent lighting. Thus, for example, if there were three lights on the shoe, each switch closure would cause them to light in sequence, as opposed to simultaneously, and the sequence could be repeated two or more times.
The Rodgers and Wut patent designs provide single illuminations of the lights when the foot hits the ground during walking or jogging. This is the position during walking or jogging when the feet are least visible. For example if the wearer is jogging in grass of even moderate height, the lights may be obscured by the grass, thus making the wearer less visible and more susceptible to danger. Thus, it would be beneficial to have lighted footwear that could provide lighting in a unique and novel sequence while the foot is raised, but still avoid the problem of premature battery exhaustion.


A electrical box including a top wall, a side wall connected to the top wall, a cavity formed by the top wall and the side wall, at least one mounting flange on the side wall having a mounting hole therein, at least one mounting fastener in communication with the at least one mounting flange, and wherein the mounting fastener is slidably engaged with the at least one mounting flange.

1. Technical Field
Aspects of the present disclosure relate generally to electrical boxes and more specifically to electrical boxes for supporting light fixtures and/or ceiling fans from a ceiling.
2. Background Art
Electrical boxes are well known and have been used for decades in buildings. Electrical boxes are used both in walls and ceilings to provide electrical current to various places within a building. Further, the electrical boxes may also be used to mount various electrical receptacles, such as duplex or decorator outlets, or electrical switches. In ceilings, electrical boxes function to support the weight of the light fixture or ceiling fan in addition to providing electrical current to operate the light and/or fan.
Electrical boxes, and specifically ceiling fan boxes, can be installed in a number of different ways. In new construction, the electrical boxes are mounted directly to studs or trusses and then drywall is mounted. In retrofit applications, the electrical box is mounted to drywall instead of the studs. In ceiling fan box retrofit installations the ceiling fan box must be mounted to the studs or other suitable structure so that the ceiling fan weight may be properly supported during fan operation.


Methods, systems, and devices are described for intercepting socket calls from applications installed on a mobile device while a first wireless interface is active. The first wireless interface is a cellular interface. Upon determining to release the intercepted socket calls to the socket layer, a second wireless interface is activated. The second wireless interface is a Wireless Local Area Network (WLAN) interface. The sockets calls are released to the socket layer and transmitted using the activated second wireless interface. Upon substantially completing the socket calls, the second wireless interface is deactivated. The intercepting of the socket calls and the activation of the second wireless interface occurs while the mobile device is in an idle mode.

Applications or device applets are now available that operate to provide a wide range of add-on services and features to wireless devices. For example, it is now possible for wireless devices to download and launch device applets to perform value added functions such as shopping, searching, position location, driving navigation, or an array of other functions. Thus, the use of device applets may increase the functionality and usability of wireless devices and offers device users features and convenience not originally available on the devices themselves.
A wireless device may interface with one or more communication networks. For example, the wireless device may include a variety of radios providing communications using Cellular, WiFi, Bluetooth, or other types of radio access technologies. Accordingly, applications executing on the wireless device may interface with a radio to establish a communications channel, and the channel may be used by the applications to communicate with the appropriate network.
Applications may continue to interface with radios on the wireless device to establish communication channels even when the device is in an idle mode. A cellular interface may provide a low power consumption rate while the device is in an idle state, while a WiFi interface may allow the device to transport data at a lower power consumption rate than the cellular interface. With an increasing number of applications installed on a device, cellular data networks may become overloaded by network signaling associated with the setup of communication channels.

Offloading of data to wireless local area network


A method for providing a workspace management tool includes presenting a workspace overview graphical user interface (GUI) having a first area and a second area. The first area includes visual indicators of favorite applications of a user, and the second area includes multiple regions, each region representing a different work space. The method further includes receiving, via the workspace overview GUI, a user request to open a new window for one of the favorite applications in a first work space, adding the new window to the first work space, and presenting the new window in a reduced form in a region representing the first work space without overlapping other open windows of the first work space.

The increased processing power of personal computers allows users to perform multiple tasks simultaneously. Such multitasking can occur in a single application (e.g., launching multiple instances of a web browser) or across multiple applications. In window-based operating systems, each currently running application may have one or more windows open to execute tasks desired by the user. Hence, the user may have a significant number of windows (e.g., 10-15 windows) opened at the same time. Navigation between such a large number of windows can be confusing and disruptive.
One existing approach deals with the above problem by presenting currently open windows in a reduced form so that they can all fit on a single screen. While this approach helps the user to navigate between currently opened windows, it has several limitations. For example, the above approach does not present to a user an overview of all available activities and/or active work spaces when the user is viewing open windows associated with current activities. Neither does the above approach allow the user to add new activities and/or organize new and existing activities onto separate work spaces while viewing open windows of the existing activities, etc.
Accordingly, there is a need for an efficient tool that can provide an integrated digital work environment for a user.


A method for forming a light-transmitting region comprises providing a support feature. A sacrificial layer is formed over a portion of the support feature, wherein the sacrificial layer comprises an energy-induced swelling material. A light-blocking layer is conformably formed over the support feature to cover the sacrificial layer and the support feature. The support feature, the sacrificial layer, and the light-blocking layer are subjected to an energy source to swell the sacrificial layer until bursting to thereby delaminate a portion of the light-blocking layer from the support feature and leave a light-transmitting region exposed with a portion of the support feature in the light-blocking layer. A gas flow or scrub cleaning force is provided to clean up the light-transmitting region and a top surface of the light-blocking layer remains over the support feature.

1. Field of the Invention
The invention relates to image sensing device fabrication, and in particularly to methods for forming a light-transmitting region of an image sensing device.
2. Description of the Related Art
Recently, image sensing devices such as solid state image sensing devices are being used in a very wide range of optoelectronic devices including, for example, digital cameras, cellular phones, and toys. Conventional image sensing devices include image sensors such as charge coupled device (CCD) image sensors and complementary metal oxide semiconductor (CMOS) image sensors.
In the art of solid state imaging devices, microlenses are typically provided to improve image sensitivity. In addition, a diaphragm is typically provided within the solid state imaging device as a light path filter of the microlenses, to therby regulate the amount of light that passes through the microlenses and toward the image sensors therein.
The diaphragm is typically defined over a top surface of the microlenses by forming a patterned light-blocking layer by photolithgraphy techniques over the top surface of the microlenses. Since the microlenses are typically provided with a curved surface, photolithgraphy techniques performed to the portion of the light-blocking layer formed over the curved surface of the microlenses may result in uneven exposure uniformalty and repeatablity during patterning thereof. Moreover, the use of photolithgraphy techniques also have disadvantages of increasing fabrication costs and time.

Method for forming light-transmitting regions


According to an embodiment, a semiconductor device includes a semiconductor layer, a first electrode, and a first insulating film. The first electrode extends in a first direction and is provided inside the semiconductor layer. The first insulating film is provided between the semiconductor layer and the first electrode, a thickness of the first insulating film in a direction from the first electrode toward the semiconductor layer increasing in stages along the first direction. The first insulating film has three or more mutually-different thicknesses.

A MOSFET (Metal Oxide Semiconductor Field Effect Transistor) is a semiconductor device used in applications such as power control, etc. Such a MOSFET may have a trench gate structure, includes an element region in which semiconductor elements are provided, and includes a terminal region surrounding the element region. Trenches are formed through the terminal region from the element region; and a conductive body and/or an insulating film is filled into the interior of the trenches. It is a challenge to increase the breakdown voltage of the insulating film in the terminal region in the MOSFET having the trench gate structure.


A counterfeit paper currency detector with a barcode reading function includes a casing unit receiving a delivering device, a driving device, a paper currency detection device, and a barcode reading device. The delivering device includes a passageway between an upper base and a lower base. The driving device drives a paper currency or a barcode sheet to pass through the passageway. When a paper currency passes through the passageway, a plurality of first paper currency detection units and a plurality of second paper currency detection units of the paper currency detection device examine whether the paper currency is genuine. When a barcode sheet passes through the passageway, a first reading module or a second reading module of the barcode reading device reads widths and spaces of a plurality of bars on the barcode sheet.

The present invention relates to a counterfeit paper currency detector and, more particularly, to a counterfeit paper currency detector with a barcode reading function.
Counterfeit paper currency detectors and barcode readers are generally utilized for automatic business transaction. A typical counterfeit paper currency detector examines a paper currency by transmitting detecting light. When a driving device drives a paper currency to pass through a paper currency passageway, a detecting light transmitter and a detecting light receiver are used to examine whether the paper currency is genuine. A barcode reader is used to scan a one-dimensional barcode to read the widths and spaces between the black bars, thereby obtaining the information represented by the one-dimensional barcode.
However, the barcode reading method utilized by currently available barcode readers cannot be integrated into counterfeit paper currency detectors. Furthermore, the barcode readers and image sensors are expensive, rendering difficulties in cost reduction. Thus, a need exists for a novel counterfeit paper currency detector that mitigates and/or obviates the above drawbacks.

Counterfeit paper currency detector with barcode reading function

Top Vending Machine Electronics Co., Ltd.


Two light modulators, a first light modulator and a second light modulator, suffice for four light sources, a first light source, a second light source, a third light source, and a fourth light source, whereby the cost can be lowered as compared with a configuration in which three light modulators are required. As a result, cost reduction is achieved. Further, since two light modulators suffice, the size of the projector can be reduced as compared with the configuration in which three light modulators are required.

1. Technical Field
The present invention relates to a projector.
2. Related Art
There is a known projector that modulates light having exited out of a light source unit in accordance with image information by using a light modulator and enlarges and projects the resultant image by using a projection lens. As a known configuration of a projector of this type, a light modulator is disposed, for example, for each of red light, green light, and blue light, and modulated light fluxes are combined with each other. JP-A-2001-42431 is exemplified as a related art document.
In the configuration described above, however, the need to provide three light modulators causes an increase in cost.


An electrochemical device and a proton conducting medium for use in an electrochemical device having a proton conducting electrolyte comprising the formula:HaMbQ.nH2Owhere H is a proton, M is a cation, Q is the fluoroborate or fluoroheteroborate anion, n ranges from 0.01 to 1000, a ranges from 0.01 to 2 and b ranges from 0 to 2, a and b are chosen to render the formula electrically neutral, and when b is greater than 0, the ratio of b to a is less than 100 to 1.

Proton exchange fuel cells, including polymer electrolyte membrane fuel cells, offer clean and efficient energy conversion for power generation by converting chemical energy into electrical energy. Electrochemical conversion is effected by introducing an oxygen-containing oxidant gas through a gas diffusion cathode and introducing a hydrogen-containing fuel gas through a gas diffusion anode. Protons migrate into a proton conducting electrolyte medium containing a proton conductor and react with reduced oxygen to form water. To facilitate chemical conversion, platinum containing electrodes are generally employed.
Several types of fuel cells have been developed based on the type of the fuel employed, e.g., hydrogen, natural gas, gasoline, and alcohols; their operating conditions, e.g., low or high temperature; and the type of proton conducting electrolyte used in the fuel cell. Examples of fuel cells include the alkaline fuel cell, polymeric-electrolyte-membrane (PEM) fuel cell, phosphoric acid fuel cell, molten carbonate fuel cell, and solid-oxide fuel cells.
Low temperature operation of a fuel cell (<100° C.) typically requires using very pure hydrogen as the hydrogen source. However, this source is relatively expensive and requires complex hydrogen storage devices. Hydrogen from carbon based fuels, e.g., that which comes from the water-gas-shift reactionCO+H2OCO2+H2is less costly and easier to store. However, such fuel sources contain various amounts of carbon monoxide, and at <100° C. a 10 ppm level of carbon monoxide may poison the platinum catalyst at the cathode and anode via adsorption. Higher temperature operation of proton membrane exchange fuel cells (at least 100 to 250° C.) significantly reduces the effect of carbon monoxide adsorption. Higher temperature may also improve reaction kinetics and efficiency of the fuel cell.
Higher temperature operation of fuel cells creates significant challenges in fuel cell design. One of these challenges is in the selection of the proton conducting electrolyte. Proton conducting media employed in fuel cells operating at high temperature should have one or more of the following: high conductivity, good chemical, electrochemical, and morphological stability, oxidation resistance, good hydrogen and oxygen solubility, and an optimal interaction with the electrode catalyst material(s).
The hydrated perfluorinated sulfonic acid polymer, such as, Nafion™ (a trade mark of DuPont), and similar materials that are also commercially available, are commonly used as proton conducting electrolytes for low temperature fuel cell operation. However, because the proton-conduction mechanism in Nafion™-type membranes is based on the migration of hydrated protons, fuel cells using Nafion™-type membranes require a complicated water management system and pressurized operation above 100° C. Phosphoric acid cells offer an opportunity to operate fuel cells at high temperature but the phosphate anions are strongly absorbed on the platinum catalyst. A proton conducting electrolyte having strong adsorption characteristics in the platinum catalyst results in a loss of active sites for oxygen reduction, and a correspondingly low current density, lowering the power density of the fuel cell.
The following patents and articles are representative of the state of the art with respect to proton conducting membranes for use in fuel cells and electrochemical devices.
U.S. Pat. No. 6,468,684, discloses solid acid electrolytes of the general formula MaHb(XOt)c where H is a proton, M is a metal such as Li, Be, Na, and Mg, X is Si, P, S, As and a, b, c, and t are rational numbers, for use as proton conducting materials. These electrolytes do not require hydration and can be operated at temperatures above 100° C. Composite membranes fabricated from the solid acid, CsHSO4, a representative of this class show conductivities as high as 8 mS cm−1 at 146° C. in humidified air (ρH2O=3.13×10−2 atm).
U.S. Pat. No. 5,344,722 discloses a phosphoric acid fuel cell in which the electrolyte includes phosphoric acid and a fluorinated compound, such as a salt of nonafluorobutanesulphonate or a silicone compound such as polyalkylsiloxane, e.g., polymethylsiloxane.
It is reported in Surface Electrochemistry J. O. M. Bockris and S. U. M. Khan, Plenum Press, p 887 that aqueous solutions of trifluoromethanesulfonic acid show a higher oxygen reduction rate on a platinum catalyst than solutions of phosphoric acid, presumably because of an improved oxygen solubility in the electrolyte and a lower adsorption of the acid at the Pt catalyst surface.
Alberti, et al in the article entitled, Solid State Protonic Conductors, Present Main Application and Future Prospects, Solid State Ionics, 145 (2001) 3-16 disclose a wide variety of proton conducting membranes for fuel cells. Examples of proton conducting materials include proton-conducting polymers impregnated with hydrophilic additives, such as heteropolyacids, zirconium phosphate, sulfated zirconia; sulfonated polyether ketones; and solid acid electrolytes, such as perfluorinated sulfonic acid polymers.
Yang, et al, in the article, Approaches And Technical Challenges To High Temperature Operation Of Proton Exchange Membrane Fuel Cells, Journal of Power Sources, 103, (2001), 1-9 disclose fuel cells employing a platinum anode catalyst. Composite membranes based upon perfluorinated sulfonic acids (Nafion™) and zirconium hydrogen phosphate as well as imidazole/Nafion membranes are mentioned.
U.S. Pat. No. 6,059,943 discloses solid-state, inorganic-organic composite membranes useful as ionically conducting membranes in electrochemical devices. Examples are based upon oxidation resistant polymeric matrices filled with inorganic oxide particles. Organic polymers include polytetrafluoroethylene, perfluorosulfonic acid, polysulfones and the like, while inorganic oxides are based upon heteropolytungstates, heteropolymolybdates, anions of tantalum and niobium, etc.
Rupich, et al in the article entitled Characterization of Chloroclosoborane Acids as Electrolytes for Acid Fuel Cells, J. Electrochem. Soc. 1985, 132, 119 disclose hydrated chloroclosoborane acids, H2B10Cl10 and H2B12Cl12 as alternative liquid electrolytes for intermediate temperature fuel cells. As described in this reference, aqueous solutions of these acids also show poor oxidative stability and a stronger adsorption on the Pt catalyst than aqueous solutions of sulfuric acid which itself adsorbs strongly on the Pt cathode.
All the patents cited above are incorporated herein by reference.

Proton conducting mediums for electrochemical devices and electrochemical devices comprising the same


A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.

Soldering irons and similar devices are used to apply solder to a work piece, such as an electronic component on a printed circuit board. A solder feed structure can be used to deliver solder in the form of a wire to the tip of the soldering iron. The feed structure must direct the solder wire with accuracy to a desired location, allow an unobstructed view of the work piece, and avoid becoming clogged with flux material. Flux is a chemical agent that facilitates soldering by removing oxidation from a work piece. Conventional feed structures have difficulty with the above requirements, particularly when fine diameter solder wire is used for small electronic components. Accordingly, there is a continuing need for a solder feed structure that satisfies these requirements.


The invention is a method of producing an array, or multiple arrays of quantum dots. Single dots, as well as two or three-dimensional groupings may be created. The invention involves the transfer of quantum dots from a receptor site on a substrate where they are originally created to a separate substrate or layer, with a repetition of the process and a variation in the original pattern to create different structures.

As the miniaturization of synthesized functional structures that possess electrical, optical and mechanical functionalities continues to progress rapidly, fabrication techniques based on conventional multi-steps of photolithography and subsequent etching processes appear to be approaching to their practical limits quickly. In the quest for discovering alternative techniques to such "top-down" approaches in which bulk materials are engraved into small-scale functional structures, the concept based on "bottom-up" approaches in which small-scale functional structures are formed by spatially arranging nanoscale building blocks, e.g. atoms and/or molecules, on given foreign substrates have been gaining significant attentions.
One of the bottom-up approaches that have been explored extensively in the past ten years is spontaneous self-assembled quantum dot, in particular, coherent, i.e. free from structural defects, small semiconductor inclusions, with a linear order of several tenths of nanometers, in a semiconductor matrix. However, inherent challenges associated with various formation techniques of spontaneous self-assembled quantum dots (SAQDs) have been hindering them from being prosperous approaches to synthesize small-scale functional structures.
As the term "spontaneous" indicates, the lack of control on specifically positioning SAQDs into densely-packed multi-dimensional periodic arrays has been a serious issue that needs to be aggressively addressed to ensure flexible tuning of physical properties of the small-scale functional structures consisting of SAQDs. One of diverse approaches that result in arranging SAQDs into periodic arrays, to some extent, as in prior art [T. I. Kamins and R. S. Williams, Appl. Phys. Lett. 71, 1201 (1997)] schematically shown in FIGS. 1A-1C, is to use engineered strain field generated by pre-formed three-dimensional structures. In FIG. 1A, a starting substrate 1 is a standard substrate having flat surface. Then, as in FIG. 1B, the starting substrate 1 is pre-patterned to create a mesa structure 2. Appropriately designed three-dimensional geometry of the mesa structure 2 provide narrow regions where the formation of SAQDs 3 is energetically favorable, thus SAQDs 3 form along the mesa top as in FIG. 1C. Although this approach can result in positioning SAQDs 3 in a particular geometrical arrangement, this does not seem to be a feasible way to obtain a densely-packed array because the formation of SAQDs 3 is spatially limited within small regions around the generated strain field. In another prior art (not shown here), an energetic beam consisting of charged particles such as ions can be used to create regions where the formation of SAQDs is energetically enhanced, however, this process would be time-consuming and/or very expensive.
Another intrinsic limitation in the formation of SAQDs relates to single crystal substrates on which SAQDs are, in most of cases, formed. Since semiconductor SAQDs are formed under the influence of mechanical strain generated by physical mismatches between a SAQDs material and a substrate material, the substrate necessarily need to be single crystal, putting substantial limitations in terms of choosing substrate materials.
On the other hand, organic nanoscale templates for the formation of arrays of nanoscale building blocks are being developed using both artificial and natural materials such as block copolymers, DNA, bacteria, virus, phage and proteins, all of which, unlike semiconductor SAQDs, have a built-in capability of arranging their organic nanoscale building blocks into two-dimensional arrays on a wide range of substrates. These organic nanoscale templates can apparently be used to arrange foreign inorganic nanoscale building blocks, e.g. semiconductor QDs, into two-dimensional arrays characterized by the original organic nanoscale templates. However, as in a prior art [R. A. Mcmillan, et al, "Ordered nanoparticle arrays formed on engineered chaperonin protein templates", Nature Materials 1, 247 (2002).], general incompatibilities in physical properties of such organic nanoscale templates when incorporated as a part of functional device consisting of arrayed inorganic nanoscale building blocks clearly indicate that organic nanoscale templates eventually need to be removed.
Therefore, it would be desirable to have a capability of transferring an array of nanoscale building blocks from an original substrate on which the array is preferably formed using a nanoscale template to another substrate on which only the array of nanoscale building blocks resides eventually. It would be further desirable to have a capability of arranging many arrays of nanoscale building blocks into three-dimensional structures. These are necessary to fabricate the novel devices (optical and electrical) having significantly high performances as compared with the bulk-based or non-uniform quantum dot based devices.

Methods of forming arrays of nanoscale building blocks


An array substrate includes a plate, a switching element, an insulating layer and a pixel electrode. The plate includes a pixel region, and the switching element is disposed on the plate. The insulating layer is disposed on the plate to include an opening for a multi-domain disposed in the pixel region and a contact hole. An electrode of the switching element is partially exposed through the contact hole. The pixel electrode is disposed on the insulating layer corresponding to the pixel region, an inner surface of the opening for the multi-domain and an inner surface of the contact hole so that the pixel electrode is electrically connected to the electrode of the switching element. Therefore, the viewing angle and the image display quality of the LCD apparatus are improved, and a manufacturing process is simplified.

1. Field of the Invention
The present invention relates to an array substrate, a method of manufacturing the array substrate and a liquid crystal display (LCD) apparatus having the array substrate. More particularly, the present invention relates to an array substrate capable of improving viewing angle and simplifying manufacturing process, a method of manufacturing the array substrate and an LCD apparatus having the array substrate.
2. Description of the Related Art
In general, a liquid crystal in an LCD apparatus varies an arrangement in response to an electric field applied thereto, and thus a light transmittance thereof may be altered. The liquid crystal is interposed between an array substrate having a thin film transistor (TFT) and a color filter substrate, and has an anisotropic dielectric constant.
The liquid crystal of the LCD apparatus is anisotropic so that an image display quality is dependent on the angle of a viewpoint. In a conventional LCD apparatus, the range of the viewpoint angle is restricted so that the image display quality is deteriorated. When the LCD apparatus is used as a monitor, the viewpoint angle may be more than 90°. The viewpoint angle having a contrast ratio of more than about 10:1 is defined as a viewing angle of the LCD apparatus. The contrast ratio is a ratio of a luminance of a dark image to a luminance of a bright image. When the LCD apparatus displays a darker image, and has more uniform luminance, the contrast ratio of the LCD apparatus increases.
The LCD apparatus may include a black matrix having a decreased reflectivity and use a normally black mode so as to prevent the leakage of a light and to display the darker image. When a voltage is not applied to a common electrode and a pixel electrode of the LCD apparatus having the normally black mode, a black image is displayed. In order to uniformize the luminance, the LCD apparatus includes a compensation film or a liquid crystal layer having a multi-domain. The liquid crystal layer having the multi-domain has a plurality of domains.
The LCD apparatus forming the multi-domain includes a mixed vertical alignment (MVA) mode, a patterned vertical alignment (PVA) mode, an in-plane switching (IPS) mode, etc.
When the LCD apparatus includes the MVA mode, a plurality of protrusions is formed on the color filter substrate and/or a thin film transistor (TFT) substrate to form the multi-domain, thereby increasing the viewing angle of the LCD apparatus. The protrusions are formed on the color filter substrate and/or the TFT substrate through additional processes, for example, such as coating process, photo process, etc., thereby increasing the manufacturing cost of the LCD apparatus. In addition, when the color filter substrate is misaligned with the TFT substrate, the protrusions may not form the multi-domain so that the yield of the LCD apparatus is decreased.
When the LCD apparatus includes the PVA mode, a plurality of slits is formed in the common electrode to distort the electric field in the liquid crystal layer to form the multi-domain, thereby increasing the viewing angle of the LCD apparatus. When the color filter substrate is misaligned with the TFT substrate, the slits may form a distorted multi-domain, thereby deteriorating the image display quality.
When the LCD apparatus includes the IPS mode, the TFT substrate includes a plurality of electrodes disposed substantially parallel with one another to form the distorted electric field. The LCD apparatus including the IPS mode, however, has decreased luminance.
In addition, the LCD apparatus forming the multi-domain is manufactured through the additional processes so that the manufacturing cost of the LCD apparatus is increased.

Array substrate, method of manufacturing the same and liquid crystal display apparatus having the same


A method for configuring a gas distribution channel, the gas distribution channel being configured for introducing a plasma source gas into a plasma processing chamber of a plasma processing system is disclosed. The method includes providing a metal conduit, providing a thermo-plastic tubular structure, and disposing the thermoplastic tubular structure within the metal conduit. The method also includes applying heat and pressure to the thermo-plastic tubular structure, thereby causing the thermo-plastic tubular structure to mechanically couple with the metal conduit wherein an outer surface of the thermo-plastic tubular structure is longitudinally coupled with an inner surface of the metal conduit.

The present invention relates in general to substrate manufacturing technologies and in particular to methods for methods for optimizing the delivery of a set of gases in a plasma processing system.
In the processing of a substrate, e.g., a semiconductor wafer or a glass panel such as one used in flat panel display manufacturing, plasma is often employed. As part of the processing of a substrate (chemical vapor deposition, plasma enhanced chemical vapor deposition, physical vapor deposition, etc.) for example, the substrate is divided into a plurality of dies, or rectangular areas, each of which will become an integrated circuit. The substrate is then processed in a series of steps in which materials are selectively removed (etching) and deposited (deposition) in order to form electrical components thereon.
In an exemplary plasma process, a substrate is coated with a thin film of hardened emulsion (i.e., such as a photoresist mask) prior to etching. Areas of the hardened emulsion are then selectively removed, causing parts of the underlying layer to become exposed. The substrate is then placed in a plasma processing chamber on a substrate support structure comprising a mono-polar or bi-polar electrode, called a chuck. Appropriate etchant source gases (e.g., C4F8, C4F6, CHF3, CH2F2, CF4, CH3F, C2F4, N2, O2, HBr, Ar, Xe, He, H2, NH3, SF6, BCl3, Cl2, etc.) are then flowed into the chamber and ionized to form a plasma to etch exposed areas of the substrate.
A reliable supply of ultrapure electronic specialty gases is critical to maintaining plasma processing system uptimes necessary to maximize productivity and manufacturing yield in semiconductor fabs. The delivery of such gases poses special challenges, however, because of their highly corrosive and reactive nature.
In particular, corrosion created in the gas delivery system may substantially reduce substrate yield. For example, in the process of etching a substrate, pollutants may be generated from materials in the etchant gases (e.g., carbon, fluorine, hydrogen, nitrogen, oxygen, silicon, boron, chlorine, etc.), from materials in the substrate (e.g. photoresist, silicon, oxygen, nitrogen, aluminum, titanium, etc.), or from structural materials within the plasma processing chamber or gas delivery system (e.g., stainless steel, aluminum, quartz, etc.).
It is commonly understood in the art, that a particle one-tenth the size of the thinnest line can substantially damage a substrate. Subsequently, components in contact with the process gases are generally engineered to minimize or eliminate potential sources of system contamination. Since a gas delivery system may be a significant source of contamination, gas conduits are often made of a set metals (e.g., electropolished stainless steel, copper (Cu), aluminum (Al), metal alloys, etc.).
For example, stainless steel is a substantially non-porous material commonly made of iron (Fe), with significant alloying additions of chromium (Cr), which gives the metal its "stainless" or corrosion-resistant characteristics, and nickel (Ni), which stabilizes the austenite and makes the metal nonmagnetic and tough. Electropolishing generally improves the surface chemistry of the part, enhancing the passive oxide film and removing any free iron from the surface.
In general, stainless steel comprises a "passive" film coating which is resistant to further "oxidation" or rusting. This film forms rapidly when exposed to oxygen. Once formed the metal has become "passivated" and the oxidation or "rusting" rate will substantially slow down.
However, plasma processing gasses (e.g., fluorine, chlorine, bromine, etc.) may still eventually penetrate this passive film and will allow corrosive attack to occur, particularly at specific points within a gas delivery system, such as weld bead and heat-affected zones (HAZ). In particular, the process of welding stainless steel often creates slag and layer re-deposits at the weld joints, potentially allowing corrosion. For example, materials such as sulfur (S), manganese (Mn), silicon (Si), and aluminum (Al) may be present at the weld site and tend to react with corrosive plasma processing gases such as the halogen, and produce corrosion and contaminants.
The degree of corrosion and hence the amount of contamination may depend on many factors, such as gas concentration and purity, moisture content, temperature, localized inhomogeneities in material, system flow rates, time of exposure, frequency of exposure. For instance, halogen gases, such as hydrogen chloride or hydrogen bromide, will corrode stainless steel when moisture levels exceed a few parts per million (ppm).
Although moisture can be reduced, it generally cannot be completely eliminated. For example, although plasma processing gases are normally stored in a purified form in compressed gas cylinders, moisture can be introduced into the gas distribution system when the cylinders are replaced, or when maintenance is performed on the processing chamber.
One method for reducing corrosion in the gas delivery system is to coat the inner surface of the tubular structures with a non-corroding material. In one example, a plastic coating is placed on a metal surface as a protective layer through a spraying or dipping process. However, spraying or dipping methods are not readily performed on small diameter delivery lines since access to the inside of the line is limited. In addition, both methods are unable to control the coating uniformity and surface finish, potentially affecting the gas distribution characteristics and substrate yield.
Referring now to FIG. 1 a simplified cross-sectional view of a plasma processing system 100 is shown. Generally, an appropriate set of gases is flowed into chamber 102 through an inlet 108 from gas distribution system 122. These etchant gases may be subsequently ionized to form a plasma 110, in order to process (e.g., etch or deposition) exposed areas of substrate 114, such as a semiconductor wafer or a glass pane, positioned on an electrostatic chuck 116. Gas distribution plate 120, along with liner 112, help to optimally focus plasma 110 onto substrate 114.
Gas distribution system 122 is commonly comprised of compressed gas cylinders 124a–f containing plasma processing gases (e.g., C4F8, C4F6, CHF3, CH2F3, CF4, HBr, CH3F, C2F4, N2, O2, Ar, Xe, He, H2, NH3, SF6, BCl3, Cl2, WF6, etc.). Gas cylinders 124a–f may be further protected by an enclosure 128 that provides local exhaust ventilation. Mass flow controller 126 is commonly a self-contained device (consisting of a transducer, control valve, and control and signal-processing electronics) commonly used in the semiconductor industry to measure and regulate the mass flow of gas to the plasma processing system.
In general, plasma processing gases are often stored compressed gas cylinders 124a–f or several months prior to use in a plasma processing system. Furthermore, many of the plasma processing gases are stored under pressure in a liquefied form. In particular, highly reactive, liquefied plasma processing gas is often typically stored in nickel cylinders to preclude the dissolution of metallic contaminants.
As with the plasma processing system as a whole, moisture in the gas distribution system may react with plasma processing gases to make other contaminant species. For example, HF and mixed tungsten oxyfluorides may be observed upon introducing WF6 into a wet environment.
Referring now to FIG. 2, a simplified diagram of a gas conduit as used in a gas distribution system is shown. For example, a mass flow controller pumps the mixed plasma processing gasses along longitudinal cavity 206 of tube 204 to the plasma processing chamber. Tubes used in gas distribution systems are commonly made of stainless steel in order to resist pitting, corrosion, cracking, and corrosion fatigue.
Referring now to FIG. 3, a simplified diagram of the tubular structure of FIG. 2 is shown, in which corrosion has occurred. As previously described, plasma processing gasses may still eventually penetrate this passive film and will allow corrosive attack to occur, particularly at specific points within the gas delivery system, such as weld bead and heat-affected zones (HAZ), such as on inner surface 304.
In view of the foregoing, there are desired methods and apparatus for optimizing the delivery of a set of gases in a plasma processing system.

Methods and apparatus for optimizing the delivery of a set of gases in a plasma processing system


Method and apparatus for determining the thickness of material layers of a container-held substance comprising a first material disposed in an upper layer and a second material disposed in a lower layer, by transmitting a radio signal through the substance towards a container portion; receiving reflected signals from a surface of the upper layer, a surface of the second layer, and the container portion; varying the frequency of the transmitted signal to determine phase displacement between transmitted and reflected signals; determining optical distances to the surfaces and the container portion, dependent on the phase displacements; determining the thickness of one of said layers dependent on phase displacement through and index of refraction of that layer; and determining the thickness of the other layer dependent on the thickness of said one of said layers.

In certain circumstances a substance is stored in a container, in which container different materials of the substance are divided into different layers. If the substance comprises two liquid materials which do not mix, such as an oil-based material and a water-based material, the denser material will collect closer to the bottom of the container, and the less dense material will collect closer to the surface. Another example may be a substance comprising a first generally liquid material, into which solid particles of a second material are dispersed. If left to rest, the second material particles will subsequently gather either on top of or under the liquid first material, dependent on which material is denser.
In such conditions it may be of interest to measure the amount of the different materials in the container, or the levels of surface defining the material layers. One example of a situation where such a measurement is of interest is in a container of petroleum oil, which also contains a certain amount of water. This may be the case in a tank of a oil tanker ship, or in an oil cistern e.g. in a refinery. The water may be deliberately disposed in the container, or be present due to condensation. Nevertheless, once placed in the container, the oil and the water will separate, such that the oil is collected in an upper layer and the water in a lower layer. Since the amount of oils is generally considerable larger than the amount of water, a surface dividing the two layers will be disposed close to the bottom of the container, and the actual position of the dividing surface is not easily assessed.
Solutions for measuring the level of water in an oil tank have been provided in the prior art. A problem is that the level of water preferably should be determined with an accuracy of a few millimeters, even when the water layer is located under a layer of oil of up to 35 meters or more, the dielectric constant of which is not well known. It has therefore not been possible to provide a contact free method for determining the level of the water with reasonable accuracy through the oil. Prior art solutions have consequently made use of alternative solutions, such as capacitive sensors applied in a narrow tube extending from the bottom of the container to the top.

Method and device for contactless level and interface detection


This invention integrates with a country's customs and immigration system to keep a periodic check on visitors within the country's borders. A smartcard is created and issued to the visitor at the visitor's Port of Entry. Pertinent immigration information is embedded in the smartcard. Cryptographic technology is used with the smartcard to maintain privacy, as well as to reduce fraud and other misuse. The smartcard is used as the visitor's official identification document whilst in the country. During the visitor's stay, at specified intervals, the visitor registers with automated kiosks (i.e. a Visitor-Visa Automated Teller Machines—ATMs), which are placed at various locations within the country. The ATM kiosks are securely integrated with the customs and immigration database. On exiting the country, the smartcard is returned and is recycled with a new visitor.

In January 2004, the US Department of Homeland Security (DHS) implemented a new system at 115 airports and 14 seaports, which is designed to confirm the identity of arriving foreign visitors. The new system is called the US-VISIT program, i.e. the United States Visitor and Immigrant Status Indicator Technology. Further information on the US-VISIT program can be found at www.dhs.gov/interweb/assetlibrary/USVisitRegulation1-5-04.pdf.
Today the primary focus of US-VISIT is on entry. By the end of 2005, it is planned that entrance and exit procedures will be phased in at all border entrances in the US. Currently 30 airports implement the exit portion of the program.
The US-VISIT uses scanning equipment to collect biometric identifiers, specifically digital fingerprints and digital photos of a person's face.
Data collected from foreign visitors is securely stored as part of a visitor's travel record. Upon exiting the US, visitors check out at kiosks by scanning their passport or visa and repeating the fingerprint scan.
The stored information will be available to authorized officials and law enforcement agencies and will help verify compliance with visa and immigration policies. The information, e.g. the scanned fingerprints, will be checked against a database of known and suspected terrorists and other undesirables.
A potential problem arises when a visitor overstays his visa. In the current system, this overstay will be caught if he exits the country. It is possible that a warrant for his arrest could be issued because the central database has detected an overstay. The problem is then locating the individual. The majority of visitor visas are issued for a period of six months. Within six months, it is possible for a visitor to fraudulently change his identity. The invention proposes to close many of these loop holes.

Method and system to validate periodically the visa of a foreign visitor during the visitor's in-country stay


A corrugated polyamide tube composed of a corrugated outer tube layer of polyamide resin and a flat inner tube layer fixed to the outer tube layer at bottom portions thereof, in which the inner tube layer is made essentially of a polyetheramide elastomer.

JA-62-93585 A discloses a multilayer plastic pipe comprising a corrugated outer rigid resin tube layer and an inner elastic flat resin tube layer. Typically, the outer rigid resin tube layer is made of polyolefin or polyvinyl chloride, and the inner elastic resin tube layer is made of an ethylene-based or propylene based thermoplastic elastomer.
WO 95/21051 discloses a corrugated multilayer tube comprising a corrugated outer resin layer and an inner resin layer. Typically, the outer resin layer is made of polyamide such as nylon 11, nylon 12, nylon 6 having resistance to zinc chloride, or their mixtures, and the inner layer is made of a fluorinated plastic material such as fluorinated polyvinylidene chloride, fluorinated polyvinyl, ethylenetetrafluoroethylene, and their mixtures. It is described that the disclosed multilayer tube is favorably employed as a hose to be installed in automobiles.


Novel triangular alignment marks and a novel algorithm are used to provide improved global alignment of the substrate on a substrate stage in an align-and expose tool. The method provides an improved metrology for aligning to a recessed alignment mark in the substrate having a material layer, such as insulating, polysilicon, and conducting layers that are inadvertently made asymmetric by processing such as chemical/mechanically polishing. The method also employs an algorithm that detects the recessed edges of the triangle and mathematically generates three lines representing the edges of the triangle. The algorithm then generates a family of lines moving inward from the edges of the triangular alignment marks and parallel to the edges until the lines converge to a common point which determines the alignment center for the triangular alignment marks. The algorithm uses the coordinates of the alignment center to position the substrate in the exposure tool for a coarse alignment the photomask for exposing a photoresist layer on the substrate. This new alignment mark and new algorithm minimize misalignment due to asymmetric formation of a material layer over the alignment mark.

(1) Field of the Invention
The present invention relates to semiconductor processing for integrated circuits, and more particularly relates to a method for achieving accurate alignment of photomasks or reticles using improved global alignment marks (keys) on a substrate and a novel alignment algorithm.
(2) Description of the Prior Art
Semiconductor processing for forming integrated circuits on substrates (wafers) requires a series of processing steps. These processing steps include the deposition and patterning of material layers such as insulating layers, polysilicon layers, and metal layers. The layers are typically patterned using a photoresist layer that is patterned over the material layer by exposing the photoresist through a photomask or reticle. The photoresist is then developed to provide the pattern. Typically the photomask or reticle has alignment marks (keys) that are aligned to alignment marks formed on the substrate at a previous processing step. However, as the integrated circuit feature sizes continue to decrease for increased circuit density, it becomes more difficult to register or align one masking level to the previous level. This is particularly difficult at submicrometer feature sizes when the overlay alignment tolerances are reduced. The overlay metrology problem is further exacerbated when the material layer has an asymmetric profile over the alignment mark on the substrate. This asymmetry can result during deposition, for example, during spin coating, or during planarization processing, such as by chemical/mechanical polishing (CMP). One area where this is of importance is for the coarse or global alignment marks on the perimeter of the substrate. This asymmetry results in distortion of the detection signal used by the software algorithm when aligning the substrate on the substrate stage to the photomask/reticle in an align and-expose tool, such as in a step-and-repeat exposure system.
At submicrometer feature sizes, the planar surface is required because of the need for a shallow depth of focus (DOF) to avoid resist image distortions. This planar surface is also necessary to prevent residue, such as stringers or rails, from forming on steep topographies that, for example, can cause electrical shorts between adjacent metal lines when the next material layer is patterned using directional plasma etching.
To better appreciate the aligning problem associated with the asymmetric alignment marks, a schematic top view of a substrate 10 having a prior-art two-point global alignment mark metrology is shown in FIG. 1. FIG. 1 also shows the array of chip areas or die areas 11 in which the integrated circuits are fabricated, and the positions of the two alignment marks 12 at the periphery of the substrate.
FIG. 2 shows a greatly enlarged top-view of one of the two prior art alignment marks 12. These alignment marks are typically comprised of several arrays of grooves 13 that are aligned along the x- and y-axes of a rectangular coordinate system 2 aligned with reference to the substrate stage.
Referring now to FIG. 3, a schematic cross-sectional view is shown through a portion 3-3' of the alignment mark in FIG. 2 after the grooves 13 are formed. For example, the grooves can be formed by recessing the substrate 10 using a previous etching step. Also shown in FIG. 3 is a typical optical detection signal 14 that the optical system on the aligner/exposure tool would detect prior to depositing the material layer commonly used in fabricating integrated circuits. The peak amplitudes in the detection signal are generally aligned over the grooves, as depicted by the vertical lines Z, and result in accurately determining the position of the alignment marks relative to the referenced x-y coordinates for the substrate stage. Unfortunately, as shown in FIG. 4, when the required material layer 16 is deposited and is asymmetric, the edge detection signal 14' is shifted to Z' and an error in alignment of (Z-Z') results that can exceed the alignment tolerance for the given product.
Several methods for making improved alignment marks and methods for aligning the substrate using these alignment marks have been reported. For example, in U.S. Pat. No. 4,343,878 to Chiang, an alignment method is described for making a series of square alignment marks, such as Box-in-Box marks that also generate used key pair blot marks that provide self-instructing mask alignment information.
Caldwell, in U.S. Pat. No. 5,503,962, teaches a method of forming an alignment mark in a planar layer when etching via holes in an insulating layer. Since the insulating layer is totally planarized over the alignment marks, it is not possible to align a mask for the next metal layer, which is opaque. Therefore, Caldwell provides recesses in the insulating layer during etching of the via holes to provide an alignment mark. In U.S. Pat. No. 5,643,801 to Ishihara et al., a laser anneal method is described which also includes two alignment marks on the substrate and two cameras for aligning the substrate before annealing. Still another method is described by Turner et al. in U.S. Pat. No. 5,365,072 for aligning a microscope in which concentric square, circular, or triangular alignment marks are used to reposition a microscope, such as an Atomic Force Microscope (AFM).
However none of the above methods addresses the need to accurately align a photomask or reticle over an alignment mark having an asymmetric material layer on the surface. There is still a need in the semiconductor industry to provide an improved alignment mark metrology using improved alignment marks and an algorithm that minimizes or prevents edge detection errors when a material layer resulting in an asymmetric profile is used.

Alignment pattern and algorithm for photolithographic alignment marks on semiconductor substrates

Vanguard International Semiconductor Corporation