A nonvolatile semiconductor memory device transmits/receives data to/from a data input/output terminal every j bits (e.g., eight bits). Each of memory cells in a memory cell array can hold data of n bits in correspondence to 2n threshold levels. A write data conversion circuit generates write data from bit data input from the same data input/output terminal in a set of a plurality of data of j bits input at different timings.

1. Field of the Invention
The present invention relates to a nonvolatile semiconductor memory device, and more particularly, it relates to the structure of a nonvolatile semiconductor memory device capable of storing information of at least four values (information of at least two bits) in a single memory cell. More specifically, the present invention relates to the structure of an electrically reloadable nonvolatile semiconductor memory device such as a flash memory, for example.
2. Description of the Prior Art
In order to meet increase of the storage capacity of a nonvolatile semiconductor memory device such as a flash memory, a structure capable of storing multivalued data exceeding binary data in a single memory cell has been developed.
FIG. 118 is a schematic block diagram showing the overall structure of a conventional AND flash memory 8000.
A memory cell array 100 includes a number of memory cells having floating gates and control gates. Referring to FIG. 118, the memory cell array 100 is divided into two memory cell blocks 100R and 100L.
The control gates, drains and sources of the memory cells are connected to word lines WL, bit lines BL and source lines SCL (not shown) respectively.
FIG. 118 representatively shows a single word line WL and a single bit line BL. Row decoders 110 selectively drive the word lines WL on the basis of externally supplied address signals. A sense latch circuit 120 is provided on single ends of the bit lines BL. The bit lines BL are selected on the basis of selection signals output from column decoders 130, for transferring read data and write data.
The sense latch circuit 120 includes a column switching circuit (not shown in FIG. 118) for selecting the bit lines BL on the basis of the selection signals from the column decoders 130.
An address buffer 140 supplies the address signals to the column decoders 130 and the row decoders 110.
A chip control part 200 externally receives an access control signal (not shown) and a clock signal (not shown) and entirely controls the internal circuits of the flash memory 8000 for write control and read control of the memory cells. The chip control part 200 controls a power supply generation part 150 thereby switching operating voltages of word drivers (not shown) driving the potentials of the word lines WL in response to operation modes for erasing, writing, reading and the like.
Data latch circuits DL-L and DL-R are data buffers temporarily holding data transferred in data write and read operations.
The operation modes of the flash memory 8000 are not particularly restricted but instructed by an access control signal externally supplied to the chip control part 200 or command data supplied through a data bus or the like, and include data rewrite (erase and write) and data read modes.
In the conventional AND four-valued flash memory 8000 shown in FIG. 118, each memory cell is in an information storage state selected from an erased state, a first write state, a second write state and a third write state. The four information storage states in total correspond to states decided by 2-bit data. In other words, each memory cell can store 2-bit data.
Therefore, the flash memory 8000 sets three different types of write verify voltages applied to the word lines WL in the write operation and sequentially switches the voltages for performing write operations three times.
In each write operation, the chip control part 200 controls an operation of writing two-valued (1-bit) write data "0" or "1" ("L" or "H") held in a sense latch SL (included in the sense latch circuit 120) connected with a memory cell subjected to writing while setting the corresponding write verify voltage every write operation. Information of four values (two bits) can be written in a single memory cell due to this structure, as described later in detail.
The flash memory 8000 sets three types of voltages as word line selection levels applied by the word line WL in the read operations and captures data of two values (one bit) read from the memory cell in the three read operations through the sense latch circuit 120, and the chip control part 200 converts the data to information of four values (two bits) after termination of the three read operations.
The outlines of write and read operations are now described.
In the write operation, a data string of two values (one bit) to be written and address signals are captured in the address buffer/data input/output buffer 140 from a data input/output terminal group 10 and an address signal input terminal group 12 respectively.
The chip control circuit 200 separates the data string of two values (one bit) to be written into data strings of upper and lower bit data (or data strings of odd and even bit data) and transfers the data strings to the data latches (hereinafter referred to as non-selected selection latches) DL-L and DL-R connected with non-selected memory cells in the memory cell array 100 through signal lines 20 respectively for temporarily latching the data strings.
The chip control part 200 captures the data held in the data latches DL-L and DL-R through the signal lines 20 when performing each of "write 1 (write operation for obtaining the first write state)", "write 2 (write operation for obtaining the second write state)" and "write 3 (write operation for obtaining the third write state)" and converts the data to data "0" or "1" of two values (one bit) corresponding to the data of four values (two bits) to be written in the selected memory cell in response to "write 1", "write 2" and "write 3". Further, the chip control part 200 transfers the converted data to the sense latch SL in the sense latch circuit 120 connected with the selected memory cell through a signal line 18 so that the aforementioned write operations "write 1", "write 2" and "write 3" are performed in accordance with the binary data latched in the selected sense latch SL.
Thus, information of four values (two bits) can be written in a single memory cell by temporarily holding binary data separated into an upper bit string and a lower bit string in the data latches DL-L and DL-R, forming write data of two values (one bit) for each of three write operations ("write 1" to "write 3") having different verify voltages and performing the three write operations having different verify voltages.
In the read operation, three different types of voltages are sequentially applied to the selected word line WL so that information "0" or "1" of two values (one bit) read from the memory cell of the memory cell array 100 to the selected sense latch SL by three read operations is transferred to and temporarily held in the data latches DL-L and DL-R. Three types of data "0" or "1" of two values (one bit) in the data strings read through the three read operations, held in the data latches DL-L and DL-R and latched in the selected sense latch SL are transferred to the chip control circuit 200 through the signal lines 18 and 20.
The chip control circuit 200 composites upper and lower bits of data of four values (two bits) on the basis of the data transferred in the aforementioned manner. The chip control circuit 200 outputs the composited upper and lower bits from the data input/output terminal group 10 through the data input/output buffer 140.
The aforementioned write and read operations are now described in further detail.
[Conventional Write Operation of Four-Valued Data]
FIG. 119 illustrates the relation between write data and thresholds of memory cell transistors in a conventional two-valued AND flash memory. In the write and read operations, data are written and read with reference to a determination level Vj01.
FIG. 120 illustrates the relation between write data and thresholds of memory cell transistors in the conventional four-valued AND flash memory 8000. In the write and read operations, data are written and read with reference to three determination levels Vj1, Vj2 and Vj3.
As hereinabove described, the conventional four-valued AND flash memory 8000 divides the threshold into four types after writing as shown in FIG. 120, while the conventional two-valued AND flash memory divides the threshold (Vth) of the memory cell transistor into two types "0" and "1" after writing.
Therefore, the flash memory 8000 requires three types of determination levels Vj1, Vj2 and Vj3 for determining the respective levels.
FIGS. 121 to 126 are conceptual diagrams showing data held in the data latches DL-L and DL-R and the sense latch SL and thresholds of memory cells after writing in first to third processing steps of the write operation.
FIG. 121 shows data held in the latches DL-L, DL-R and SL in the first processing step of the write operation, and FIG. 122 shows thresholds of the memory cells in the first processing step of the write operation.
FIG. 123 shows data held in the latches DL-L, DL-R and SL in the second processing step of the write operation, and FIG. 124 shows thresholds of the memory cells in the second processing step of the write operation.
FIG. 125 shows data held in the latches DL-L, DL-R and SL in the third processing step of the write operation, and FIG. 126 shows thresholds of the memory cells in the third processing step of the write operation.
Before starting the write operation, the thresholds of the memory cells are set below the determination level Vj1.
Referring to FIGS. 121 and 122, data DQ0 to DQ3 and DQ4 to DQ7 are stored in the data latches DL-R and DL-L respectively among data DQ0 to DQ7 for one byte input from terminals I/O0 to I/O7 included in the data input/output terminal group 10 in the first step of the write operation. Referring to FIG. 121, it is assumed that C9h represents the input 1-byte data in hexadecimal notation.
The data latch DL-R latches the input data DQ0 to DQ3 from the terminals I/O0 to I/O3 and the data latch DL-L latches the input data DQ4 to DQ7 from the terminals I/O4 to I/O7 as for the entire sector (data corresponding to one word line WL).
In the following description, consider each 2-bit data (DQ4, DQ0), (DQ5, DQ1), (DQ6, DQ2) and (DQ7, DQ3), having one of the data DQ4 to DQ7 held in the data latch DL-L as the upper bit and one of the data DQ0 to DQ3 held in the data latch DL-R as the lower bit, as a set of data.
The chip control part 200 operates the aforementioned sets of data included in the data latches DL-R and DL-L and zeros only bit data of the sense latch SL corresponding to such data that the upper bit held in the data latch DL-L is "0" and the lower bit held in the data latch DL-R is "1".
As shown in FIG. 121, the sense latch SL holds "0111" from the high-order position. On the basis of the data thus held in the sense latch SL, data are written in memory cells MC1 to MC4 corresponding to the bits of the sense latch SL respectively. The memory cells MC1 to MC4 are connected with the same word line WL. The third determination level Vj3 is employed as the determination value for a verify operation.
At this time, data is written in the memory cell corresponding to the data "0" in the sense latch SL. Thus, the data (corresponding to data "01") of level 4 is written in the memory cell MC4 corresponding to the most significant bit of the sense latch SL.
In practice, a high voltage is applied to the word line WL thereby writing the data through an FN (Fowler-Nordheim) tunnel current.
A voltage below the word line voltage is applied to bit lines BL corresponding to the bit data "1" of the sense latch SL, in order to relax the voltage applied from the word line WL. Consequently, data is written in only the memory cell connected with the bit line BL corresponding to the bit data "0" held in the sense latch SL.
Referring to FIGS. 123 and 124, the data held in the data latches DL-R and DL-L are operated in the second step of the write operation for writing "0" in the bit of the sense latch SL corresponding to such a set of data that the upper bit held in the data latch DL-L is "0" and the lower bit held in the data latch DL-R is "0". The determination value in the verify operation is changed to Vj2, and data are written only in the memory cells connected with bit lines BL corresponding to the data DQ5 and DQ1 in data writing.
Referring to FIGS. 125 and 126, the data held in the data latches DL-R and DL-L are operated in the third step of the write operation for writing "0" in the bit of the sense latch SL corresponding to such a set of data that the upper bit held in the data latch DL-L is "1" and the lower bit held in the data latch DL-R is "0". The determination value in the verify operation is changed to Vj1, and data are written only in the memory cells connected with bit lines BL corresponding to the data DQ6 and DQ2 in data writing.
After inputting all data to be written, the write operation is terminated through three operations and write processing as described above.
[Conventional Read Operation of Four-Valued Data]
The read operation is now described.
FIGS. 127 to 132 are conceptual diagrams showing data held in the data latches DL-L and DL-R and the sense latch SL, thresholds of memory cells and determination levels in first to third processing steps of the read operation.
FIG. 127 shows data held in the latches DL-L, DL-R and SL in the first processing step of the read operation, and FIG. 128 shows thresholds of the memory cells and determination levels in the first processing step of the read operation.
FIG. 128 shows data held in the latches DL-L, DL-R and SL in the second processing step of the read operation, and FIG. 129 shows threshold of the memory cells and determination levels in the second processing step of the read operation.
FIG. 129 shows data held in the latches DL-L, DL-R and SL in the second processing step of the read operation, and FIG. 130 shows thresholds of the memory cells and determination levels in the second processing step of the read operation.
FIG. 131 shows data held in the latches DL-L, DL-R and SL in the third processing step of the read operation, and FIG. 132 shows thresholds of the memory cells and determination levels in the third processing step of the read operation.
Referring to FIGS. 127 and 128, data are read at the first determination level Vj1 and the results are stored in the sense latch SL in the first processing step of the read operation. The data are transferred to the data latch DL-R, and the sense latch SL is cleared.
Referring to FIGS. 129 and 130, data are read at the second determination level Vj2 and the results are stored in the sense latch SL in the second processing step of the read operation. The data are transferred to the data latch DL-L and the sense latch SL is cleared again.
Referring to FIGS. 131 and 132, data are finally read at the third determination level Vj3 and the results are stored in the sense latch SL in the third processing step of the read operation. The chip control circuit 200 sets the data of the data latch DL-R to "1" only on such a bit position that both of the data stored in the sense latch SL and the data in the data latch DL-R are "0".
The data latches DL-L and DL-R sequentially output the data DQ4 to DQ7 and DQ0 to DQ3 respectively.
Also in the read operation, the data are output after all three read operations are defined.
For example, Japanese Patent Laying-Open No. 9-297996 (1997) discloses a more detailed structure of such a multivalued memory. This memory also requires a plurality of processing steps in each of read and write operations, similarly to the aforementioned multivalued memory.
In the conventional AND four-valued flash memory 8000, as hereinabove described, the speed of the chip for read and write operations is deteriorated by a delay following a plurality of processing steps, as compared with the general two-valued flash memory. This problem of deterioration of the speed gets serious as the number of values is increased.

Multilevel storage nonvolatile semiconductor memory device enabling high-speed data reading and high-speed data writing


The invention provides a transparent resin composition which is stable and has weather resistance and chemical resistance under natural environmental conditions, under harsher natural environmental conditions, and under similar or harsher usage conditions, the composition comprising a polycyclohexylene dimethylene terephthalate copolyester, and further comprising an ultraviolet absorber composed of a benzoxazinone-based compound and/or a hydrolysis inhibitor composed of a carbodiimide; a transparent resin composition which is stable and has weather resistance and chemical resistance under even harsher usage conditions; and a transparent resin composition which is stable and has weather resistance and chemical resistance under the above conditions, the composition further comprising an antioxidant and a heat-resistant material. These transparent resin compositions can be used for helmets, face shields for helmets, lenses for spectacles, outer cases for storing items, sheet materials for outdoor installation, and frames and temples for spectacles.

Helmets, which are one item of safety equipment, are now being worn proactively in numerous fields, including the industrial field, distribution field, construction and engineering field, and in the field of products used in social life. Among the materials for these helmets, polycarbonate (PC), acrylic-butadiene-styrene resin (ABS) and glass fiber-reinforced thermosetting resins (FRP) are widely known (Patent Document 1: JP 2003-105620 A). Among these, polycarbonate is attracting particular attention in terms of the properties mentioned below, and is starting to also be used widely in other technical fields.
Polycarbonate is a transparent amorphous resin. This resin exhibits minimal mold shrinkage, good dimensional precision and minimal water absorption, and therefore displays good dimensional characteristics. It is a material that has outstanding impact resistance, together with minimal creep and favorable heat resistance, electrical properties, self-extinguishing properties and light resistance.
A problem that has been identified for this material is its lack of chemical resistance (Non-Patent Document 1: "Plastic Data Book", jointly edited by Asahi Kasei Amidas Corporation and the editorial department of "Plastics", published Dec. 1, 1999 by Kogyo Chosakai Publishing Co., Ltd., pages 599 and 605).
In the case of helmets used outdoors, when the helmet is used under severe conditions, including under conditions of sunlight and high temperature, or even under conditions of low temperature and high humidity, contamination of the polycarbonate material that constitutes the helmet is severe, and in such cases, it is essential to perform a chemical treatment to remove surface contamination. It is thought that when this type of treatment is performed, the polycarbonate resin can undergo sudden damage, including dissolution or swelling, and whitening or cracking, which is problematic for its use as a product.
Table 1 illustrates the results of measurements performed by the inventors of the present invention to evaluate the chemical resistance of polycarbonate to a variety of different chemicals.
TABLE 1OrganicOxidizingChemical typesolventsSaltsAlkalisAcidsagents10-grade310176evaluation
The results in the table represent evaluation grades out of 10. A higher number indicates better chemical resistance. It is evident that polycarbonate is readily permeable to alkali and organic solvents, and does not exhibit stability to these chemicals. Further, because polycarbonate has ester bonds, it is thought that when exposed to alkaline solutions or hot water, the polycarbonate undergoes a hydrolysis reaction, resulting in degradation of the products using such materials. On the other hand, it has been assumed that even in the presence of water or acid, and under both normal temperature or low temperature conditions, almost no hydrolysis occurs. Under conditions of high temperature and high humidity, because hot water is present, the occurrence of a hydrolysis reaction is a concern.
When an alkaline solution is present, it is thought that the hydrolysis reaction can accelerate under the effects of the concentration and temperature of the solution. When used as the material of a product, these effects must be considered prior to use.
The following countermeasures have been proposed for the resin of polycarbonate helmets having the types of problems outlined above, but sudden damage to helmets during use have still been observed, meaning the uncertainty cannot be eliminated.
Polycarbonate resin molded bodies formed from laminates in which a polycarbonate resin is used as the base material, a water non-absorbing barrier layer composed of an ultraviolet-curable resin coating film is formed as a first layer on at least one surface of the base material, and an anti-fogging layer composed of a water-absorbing ultraviolet-curable resin coating film is formed as a second layer on the first layer are already known (Patent Document 2: JP 2007-210138 A).
The formation, on a plastic goggle lens or helmet shield composed of polycarbonate or the like, of a film that imparts physical properties such as good adhesion and superior wear resistance, and enables the inner surface to exhibit anti-fogging properties as a result of hydrophilicity, and the outer surface to exhibit waterproofness, water droplet resistance, oil resistance and stain resistance as a result of water repellency and oil repellency is already known (Patent Document 3: JP 2006-089859).
Multilayer articles comprising a substrate layer containing at least one thermoplastic polymer and fiber in a range between about 15% by weight and 75% by weight based on the total weight of the fiber-reinforced polymer substrate, and at least one top layer containing at least one thermoplastic polymer having structural units derived from at least one 1,3-dihydroxybenzene and at least one organic dicarboxylic acid are already known (Patent Document 4: JP 2008-500204 A).
Molded resin articles in which an abrasion-resistant organic hard coat layer having a haze of 5% or less is provided on one surface of a base, and an anti-fogging organic hard coat layer formed from a coating material described below is provided on the other surface are already known (Patent Document 5: JP 1996/041831 A1).
A composition comprising a polymer blend derived from: (a) a prepolymer comprising a component selected from the group consisting of free amine groups, free anhydride groups, and combinations thereof, and further comprising structural units derived from a dianhydride and a diamine, and (b) a polymer comprising a reactive component selected from the group consisting of structural groups, terminal groups, and combinations thereof, wherein the reactive component exhibits reactivity with the free anhydride groups, the free amine groups, or combinations thereof, and wherein the polymer blend is non-delaminated (Patent Document 6: JP 2010-51037 A).
Tests using polycarbonate alloys as a raw material have also been conducted. Alloys of polycarbonate and acrylic-butadiene-styrene resin, and polycarbonate and polyester or the like are mostly opaque, and cannot be used in technical fields that require transparency. The results of usage tests performed by the inventors of the present invention also revealed that the chemical resistance is unsatisfactory, and the conclusion was reached that the use of such alloys as a raw material for helmets and the like would be problematic.
The inventors of the present invention have worked hard in developing safety equipment such as helmets. Specifically, they have investigated not only the shape of helmets, but also the problems mentioned above relating to what materials are appropriate for use in helmets. They thought that the continued use of polycarbonate resin was essentially impossible. However, having viewed the large amount of research into the development of new resins that had already been conducted, they felt that the development of a novel resin that could be used as a material for helmets would be extremely difficult. Accordingly, they reached the conclusion that the most realistic approach was to resolve the above problems by using an existing resin, and developing a material that could be used in a stable state under usage conditions.
As described below, conventional polycyclohexylene dimethylene terephthalate copolyester resins have different properties from conventional polycarbonates in that they exhibit chemical resistance when used under normal conditions. However, the field in which the inventors of the present invention are proposing to use polycyclohexylene dimethylene terephthalate copolyester resins requires a material that is stable and has weather resistance and chemical resistance not in favorable environments such as that inside an indoor facility, but under natural environmental conditions, and similar or harsher usage conditions, which represent conditions in which these copolyester resins have not conventionally been used. The addition of other substances to alter the properties and make the resin capable of withstanding these types of conditions can be considered. Even considering the premise of inhibiting decomposition of the polycyclohexylene dimethylene terephthalate copolyester resin, the substance must have a dominant property that inhibits decomposition, and based on the results thereof, measures must be taken to address those factors not covered by the dominant factor. In any event, it was thought that modifying the resin to ensure that it is able to withstand usage conditions would be effective. Polycyclohexylene dimethylene terephthalate resins were investigated from this type of viewpoint.
Polycyclohexylene dimethylene terephthalate resins have been publicly disclosed (Patent Document 7: U.S. Pat. No. 2,901,466). Since then, polycyclohexylene dimethylene terephthalate copolyester resins produced by Eastman Chemical Company have also become well known (for example, Patent Document 8: JP H11-512484 A, and JP 3,432,830 B). Further, production methods have also been disclosed in U.S. Pat. No. 5,106,944 (Patent Document 9) and U.S. Pat. No. 5,668,243 (Patent Document 10). Modified polycyclohexylene dimethylene terephthalate copolyesters have been confirmed as having good impact resistance, minimal creep, and good heat resistance and electrical properties. In the formation of a copolyester, the reaction between a glycol component and a dicarboxylic acid component can be performed under normal polyester polymerization conditions. The copolyester is produced by a transesterification reaction. When a copolyester is produced from an ester-type dicarboxylic acid component, the reaction process can be composed of two steps. In the first step, a glycol component and a dicarboxylic acid component such as dimethyl isophthalate and dimethyl terephthalate are reacted under high temperature, typically about 180 to about 280° C., and under a pressure of about 0.0 to about 60 psig. The temperature of the transesterification reaction is preferably about 190 to about 240° C., and the pressure is preferably about 15 to about 40 psig. The reaction product is heated at an even higher temperature and under reduced pressure to form a polyester by a glycol elimination. The glycol is easily volatilized under these conditions, and is removed from the system. This polycondensation step which represents the second step can be continued under higher vacuum conditions, and typically at a temperature of about 240 to about 300° C., preferably about 245 to about 290° C., and most preferably within a range from about 250 to 270° C., until a polyester of the desired polymerization degree, as determined by I.V., is obtained. It is known that the polycondensation step can be performed under reduced pressure within a range from about 400 to about 0.1 mmHg (torr) (Patent Document 11: JP 2003-506592 A, Patent Document 12: JP 2002-523647 A). Further, a production method in which a polyester or an oligomer thereof is supplied and passed through a vertical stirred thin-film evaporator in a molten state, thus obtaining a polyester having a higher polymerization degree than that prior to supply is also known (Patent Document 13: JP 2000-309631 A).
As a result of active research, it is also known that polyesters such as poly-1,4-cyclohexylene dimethylene terephthalate-isophthalate and copolyesters thereof undergo hydrolysis in the presence of minute amounts of water, and innovations have been adopted to avoid this hydrolysis (Patent Document 14: JP 2007-285944 A).
A polyester support for an anti-fogging film formed from a biaxially stretched polyester film comprising, as a copolymerization component, a polyester of an aromatic dicarboxylic acid having a metal sulfonate group and a polyalkylene glycol is also known. An ultraviolet absorber is added to this polyester support for an anti-fogging film formed from a polycyclohexylene dimethylene terephthalate (Patent Document 15: JP 2004-359707 A).
Furthermore, the addition of a carbodiimide or the like to prevent hydrolysis of a polyester is also known (Patent Document 16: JP H11-506847 A).
The use of a film having an ultraviolet shielding effect during pattern transfer is also known (Patent Document 17: JP 4,105,919 B). Further, a thermoplastic polyester molding composition comprising a polyester resin and an ultraviolet stabilizing system, which is suitable for preparing a molded item that is resistant to decomposition and discoloration even when exposed to ultraviolet radiation for long periods is also known (Patent Document 18: JP H11-323100 A).
A polymer composition comprising a blend of at least two different polymers selected from the group consisting of polystyrene, polycarbonate, polyetherimide, polyolefin, polysulfone, polyethersulfone, polyacetal, nylon, polyester, polyphenylene sulfide, polyphenylene oxide and polyetheretherketone, and at least one elastomer having a tensile modulus less than about 50,000 prig for toughening these polymers (Patent Document 19: JP 3,647,036 B) is disclosed as having wear resistance, superior crack propagation resistance, lower yield strength, and increased transfer film ductility.

Transparent resin composition having good chemical resistance, durability and stability under natural environmental conditions, harsher natural environmental conditions, and similar or harsher usage conditions, and product using same


A pneumatic tire has a tread portion provided with two crown main groove and two shoulder main grooves and divided into a center land zone, two middle land zones and two shoulder land zones. The middle land zone is provided with middle auxiliary grooves. The shoulder land zone is provided with shoulder axial grooves. The width of the shoulder axial groove at the axially outer end is more than the width of the shoulder axial groove at the axially inner end. Through the shoulder main groove, the shoulder axial grooves are continued to the respective middle auxiliary grooves.

The present invention relates to a pneumatic tire, more particularly to a tread pattern suitable for a winter tire and capable of improving running performance on snowy roads and running performance on icy roads in a good balance.
Winter tires or pneumatic tires for the winter season are required to have running performance on snowy roads (hereinafter, snow performance) and running performance on icy roads (hereinafter, ice performance) which are improved in a good balance at high levels.
For instance, in order to improve ice performance by increasing the ground contacting area of the tread, if the widths of tread grooves are decreased, then, during running on snowy roads, shearing force of snow packed into the tread grooves is decreased, and snow performance is deteriorated. Thus, it is difficult to improve snow performance and icy performance in a good balance at high levels.
Japanese Patent Application Publication No. JP-A-2009-269500, directed to improve snow performance and icy performance of a pneumatic tire in a good balance, teaches to specifically define the widths of five land zones which are axially divided by four circumferentially-continuously-extending main grooves, to form each land zone as a row of blocks, and to provide a circumferentially-continuously-extending narrow groove for each of the middle land zones. However, there is room for improvement on such pneumatic tire.


Oral delivery systems including at least one encapsulated active are provided. The oral delivery systems include at least one active component; and a polymer matrix at least partially encapsulating the at least one active component. In some embodiments, the polymer matrix has a tensile strength of at least about 6,500 psi and/or includes at least one polymer having a water absorption of about 0.01% to about 50% by weight. The at least one active component may be an oral care active, which may be encapsulated alone or in combination with other actives, such as a taste masking active.

Unblemished white teeth have long been considered cosmetically desirable. Unfortunately, in the absence of thorough dental cleaning, teeth can become discolored or stained from color-causing substances present in food, beverages, tobacco, and the like, and internal sources such as blood, amalgam-based fillings, and antibiotics (e.g., tetracycline).
Currently, there are a number of methods for removing stains in teeth. These methods are generally based on the use of abrasives, hydrolytic agents or oxidizing agents to break down the staining material. For example, mechanical methods of tooth cleaning are known whereby the stain is mechanically abraded through the use of abrasives or polishing agents normally employed in toothpaste preparations. Typical preparations containing abrasives are toothpastes, gels or powder dentifrices, which require close contact with the teeth. Typical abrasives include hydrated silica, calcium carbonate, sodium bicarbonate and alumina.
Hydrolytic agents, such as proteolytic enzymes, can also be used to whiten teeth. These products are usually in the form of pastes or gels, and function to whiten teeth by removing the plaque and calculus that have entrapped the stain.
Oxidizing agents such as urea peroxide, hydrogen peroxide or calcium peroxide, represent the most common forms of whitening agents for tooth enamels. It is believed that peroxides whiten teeth by releasing hydroxyl radicals capable of breaking down the plaque/stain complex into a form that can be flushed away or removed by an abrasive.
Other active stain-removing components include surface-active agents, such as anionic surfactants and chelators, which have been incorporated into stain-removing compositions because of their stain-removing properties. For example, anionic surfactants typically employed in dentifrice compositions include sodium lauryl sulfate and sodium N-lauryl sarcosinate. Furthermore, chelators, such as polyphosphates, are typically employed in dentifrice compositions as tartar control ingredients. For example, tetrasodium pyrophosphate and sodium tri-polyphosphate are typical ingredients found in such compositions.
Stain-removing gum compositions are known. For example, gum compositions including sodium tripolyphosphate and xylitol are known. Also, gum compositions are known, which include hexametaphosphate and an abrasive silica material. Moreover, a dental gum is known, which includes sodium tripolyphosphate, tetrasodium pyrophosphate, a silica abrasive and zinc acetate. A whitening gum composition is also known, which includes the abrasives sodium bicarbonate and calcium carbonate, and is sold under the brand name V6®.
Moreover, stain-removing gum compositions are known that include anionic surfactants such as fatty acid salts. For example, sodium stearate is a fatty acid salt employed in a gum product sold under the brand name Trident White® (see U.S. Pat. Nos. 6,471,945, 6,479,071 and 6,696,044). Furthermore, copending, commonly-owned U.S. patent application Ser. No. 10/901,511 discloses stain-removing gum compositions containing a salt of ricinoleic acid.
Current delivery systems for oral care/tooth whitening actives present problems. For example, the release of actives from tablets, films, mouthwashes, toothpastes and gels is quite rapid and occurs for a short period of time. Most of these products produce temporary, elevated levels of actives, followed by a rapid decrease to zero levels. Similarly, some tooth whitening actives can be released at elevated levels from gum bases within a few minutes following mastication, followed by a rapid decrease to low levels.
Encapsulating materials have been used previously to encapsulate sweeteners, acids, flavorings, soluble dietary fibers, biologically active agents, breath freshening agents, and the like. Such encapsulating materials have included, for example, cellulose and its derivatives, arabinogalactin, gum arabic, polyolefins, waxes, vinyl polymers, gelatin and zein. In general, encapsulating actives in edible compositions has been used to slow their degradation, to enhance the uniformity of their release, and to prolong their release in a controlled manner.
The selection of a suitable encapsulating material (e.g., polyvinyl acetate, PVAc) has usually been focused on the molecular weight of the encapsulating material, with higher molecular weights generally associated with longer release times. However, this approach is limited in that a predictable modification of the release profile of an active is made only through the modification of the molecular weight of the encapsulating material.
In view of the foregoing, it would be beneficial to provide oral delivery systems wherein a controlled amount of an oral care active is delivered to an oral cavity over a longer period of time, rather than delivering a high concentration of the active followed by no active. In particular, it would be advantageous to encapsulate at least one oral care active in a suitable polymer matrix to enhance the uniformity of its release, and to prolong its release in a controlled manner. In some embodiments, the release profile of the active may be modified by selection of a polymer matrix having a tensile strength within a desirable range and/or may be modified by including in the matrix a polymer having a water absorption within a desirable range.

This patent is subject to a terminal disclaimer.

Controlled release oral delivery systems


A swim fin for use in a swimming mode and in a walking mode has a boot portion including a shoe having a foot receiving pocket and a bulbous connecting member. Three tracks are formed in the connecting member terminating in a cavity at each end of each track, the cavity at one end being disposed substantially parallel to the axis of elongation of the foot receiving pocket and thus the foot of a swimmer and the cavity at the other end of each track being disposed approximately 90.degree. to the axis of the foot receiving pocket. The fin also includes a web having fingers adapted to be received in the cavities at one end of the tracks or in the cavities at the other end of the tracks selectively when the web is positioned in the swimming mode or the walking mode. The web also carries pins which are resiliently connected to the boot portion of the fin and positioned within a guideway in the connecting member. The configuration of the guideway is such as to urge the fingers into one or the other sets of cavities. The fingers may be positioned in one set or the other of the cavities by pulling the web to remove the fingers from one set of the cavities and repositioning the web with the fingers positioned in the other set of cavities.

This invention relates to swim fins and more particularly to swim fins which may be used effectively for swimming and for walking.
Swim fins are devices which are worn on a swimmer's feet to provide an increased surface for acting on the water and to flexibly flutter in the water while the swimmer kicks. The fins thus permit the swimmer to generate greater propulsive force and efficiency while swimming. However, the fins are bulky and cumbersome when worn while walking on land because of the generally uninterrupted length of the fin from the mounting portion of the foot of the wearer to the free or forward end of the web or blade of the fin. Conventional fins are thus impracticable for use while walking and must be installed at the water's edge and removed when exiting from the water.
Various proposals have been made in the prior art to provide swimming fins which may be less cumbersome when walking than conventional fins. Many of the proposals are complex or provide ineffective means for locking the web of the fin in either or both the swimming or walking mode. Exemplary of this prior art are Wozencraft U.S. Pat. No. 2,903,718 which merely unlatches a portion of the fin and permits it to swing so as to drag behind the swimmer's foot; Markowitz U.S. Pat. No. 3,268,927 which requires a large awkward boot for carrying a strut on which a lever is pivoted; Tackett et al U.S. Pat. No. 4,752,259 which hinges the web so that it pivots onto or under the foot where it is held by magnets; Klein U.S. Pat. No. 4,981,454 which pivotably hinges the web but does not latch it in the walking position; Italian Patent No. 533,240 which hinges and pivots the web from a latched swimming position but requires a brace about the leg to hold it in the walking position; French application No. 2,565,498 which uses a lever to pivot the web; and Russian Inventor's Certificate No. 1,189,460A which hinges the web and pivots it against the action of an over-center spring.
In none of the known prior art proposals is there a positive locking of the web portion of the fin to the foot mounted portion in both the swimming and the walking mode while permitting the blade to flexibly flutter during the swimming mode. Accordingly, although a substantial number of proposals have been made to solve the aforesaid problem, these proposals have not provided feasible solutions and appear not to have been adopted commercially.


A carrier substrate has a resistor track for a slider of a level sensor. The resistor track comprises numerous metal strips which are aligned transversely with respect to the main direction in which said resistor track extends and run at a distance from one another. Regions of metal strips have extensions toward one side of the resistor track which are bridged by an adjusting resistor. The adjusting resistor is designed for isolating resistor regions by cuts running transversely with respect to the extensions.

1. Field of the Invention
The present invention is directed to a carrier substrate with a resistor track for an electrical device in which a slider for providing the connection with electrical energy is movable along the resistor track and the resistor track comprises numerous metal strips which are aligned transversely with respect to the main direction in which said resistor track extends. These elements are located at a distance from one another and are interconnected on one side by a defined, electrical resistor, in particular for a potentiometer of a lever sensor for the level indication in a fuel tank.
2. Description of the Related Art
Carrier substrates of the above type are used for level sensors in fuel tanks of modem motor vehicles and are therefore generally known. There are, however, numerous other applications for which electrical energy also has to be picked up from a resistor track by means of a slider and fed to a moving component.
In the case of level sensors, the aim is usually to achieve linearity between the filling level and the displacement of the level-indicating indicator. Since, however, the cross section of tanks in which the filling level is measured often varies considerably over the height of the tank, in order to adapt to spatial conditions of the motor vehicle, producing this linearity requires sophisticated calibration. In the case of the level sensors known thus far, the individual metal strips are interconnected on one side by a resistor surface bridging them. For changing the resistance of the resistor track, the resistor surface between the metal strips is cut into radially to differing extents, so that the electric current has to flow over a more or less wide remaining width of the resistor surface from one metal strip to the other. The cutting into the resistor surface is currently carried out by means of laser light. If it is desired to use this technique to calibtrate a level sensor in such a way that a linear characteristic is obtained, the number of laser cuts required would be increased by about tenfold, which would mean that a high computer capacity would be required for automatic calibration and that the positioning accuracy of the laser would have to meet undesirably high requirements in order that the tolerances do not accumulate impermissibly from one laser cut to the next.
The invention is based on the problem of developing a carrier substrate with a resistor track which can be calibrated with as little effort as possible in such a way that a linear characteristic can be achieved for the indication of a device operating with such a resistor track.
This problem is solved according to the invention by regions of metal strips having extensions toward one side of the resistor track which are bridged by an adjusting resistor and by the adjusting resistor being designed for isolating resistor regions by cuts running transversely with respect to the extensions.
Such a design makes it possible to isolate resistor regions with relatively little effort and, as a result, change the electrical resistance in the respectively chosen regions specifically for the entire region, by isolating more or less wide resistor regions. Since the calibration takes place in the region of the extensions, the calibrating regions can be arranged on the printed circuit board without any problem and do not influence the movements of the slider.
It is particularly cost-effective if the adjusting resistor is produced on the extensions by printing thereon and the cuts are formed by means of laser light.
The calibration can be carried out by isolating previously defined individual resistors in fixed calibrating steps and therefore with particularly little computer effort if the adjusting resistor comprises a plurality of resistor tracks running transversely with respect to the extensions.
However, stepless calibration is also possible if, according to another development of the invention, the adjusting resistor forms a closed surface printed onto the extensions.


A system is provided for providing security with an optical card. According to one embodiment of the invention, immunization data can be disposed on an optical card and used in an optical card system to establish that a particular individual has been immunized for a particular disease. The immunization data can be stored in a variety of formats and encrypted for verification. Biometric data can be used with the immunization data to establish that the immunization data applies to that particular individual. The optical card memory allows sufficient biometric data to be stored so as to clearly verify the identity of the card holder.

With the advent of terrorist attacks on the United States, it is ever more apparent that there is a need for increased security in our everyday lives. One such threatened attack is through the use of biohazardous material which often can take the form of bio-engineered or existing contagious diseases. An example of one such dangerous disease is smallpox. While smallpox has essentially been eradicated in North America and well-developed areas of the world, it still poses a threat to those who have not been immunized from it. Similarly, other diseases, such as the Ebola virus, are extremely contagious and dangerous to large populations as well.
In the past year, the illness known as Severe Acute Respiratory Syndrome (SARS) has made apparent the vulnerability of large populations to a contagious disease. Furthermore, this illness has demonstrated that people in afflicted areas will flee the infected area to escape the disease without knowing whether they are a carrier of the disease. It was observed that people in quarantined areas would attempt to flee those areas without regard to the effect that their condition would have on others that they came into contact with outside the quarantined area. Therefore, this has clearly demonstrated that people are willing to break the law or lie so as to escape a biohazardous site.
Similarly, there are those people who will put their own health at risk to enter a biohazardous site—either to retrieve possessions or contact loved ones. It is common to see people cross police barricades when trying to return to homes that have been evacuated for natural disasters such as forest fires and hurricanes. Undoubtedly, the same mentality would prevail for some people if a biohazardous situation were to develop, preventing people from returning to their homes or loved ones.
Therefore, there is a need for a system which can be used to help establish that an individual is immunized to a particular threat. Furthermore, a verification system is desired that will help prevent an individual from forging his or her immunization to a particular threat. Similarly, there is a need for a system to establish that someone has been immunized to a particular threat so as to allow them to enter or exit to a currently quarantined area.


A structured illumination apparatus includes a light modulator being disposed in a light path of an exit light flux from a light source, and in which a sonic wave propagation path is arranged in a direction traversing the exit light flux; a driving unit generating a sonic standing wave in the sonic wave propagation path by giving a driving signal for vibrating a medium of the sonic wave propagation path to the light modulator; an illuminating optical system making at least three diffracted lights of the exit light flux passed through the sonic wave propagation path to be interfered with one another, and forming interference fringes of the diffracted lights on an observational object; and a controlling unit controlling a contrast of the interference fringes by modulating a phase of at least one diffracted light among the diffracted lights in a predetermined pitch.

1. Field
The present application relates to a structured illumination apparatus, a structured illumination microscopy, and a structured illumination method.
2. Description of the Related Art
Patent Document 1 (U.S. Pat. No. 6,239,909) discloses an example in which a structured illumination microscopy is applied to a fluorescent observation. In a method of Patent Document 1, a light flux that exits from a coherent light source is split into two light fluxes by a diffraction grating, and those two light fluxes are individually focused on mutually different positions on a pupil plane of an objective lens. The two light fluxes exit from the objective lens as collimated light fluxes with different angles, and overlap each other on a sample plane to form interference fringes. Accordingly, the sample plane is subjected to structured illumination. Further, in the method of Patent Document 1, images of sample images are obtained using different phase of the structured illumination, and separated for frequency components and demodulated from the plurality of obtained images by the method described in the U.S. Patent Document 1.
Note that as a method of shifting the phase of structured illumination in steps, there are a method in which a wedge-shaped prism is inserted into one of the above-described two light fluxes and moved in steps in a direction perpendicular to an optical axis, a method in which a diffraction grating is moved in steps in a direction perpendicular to a grid line, a method in which a sample is moved in steps in a pitch direction of structured illumination, and the like.
However, when an optical element is moved in steps, a certain period of time is required for moving and stopping of optical element at an appropriate position, so that it is difficult to reduce a period of time to take all of the required images. Particularly, when a sample to obtain the images is a live organism specimen, there is a chance that a structure of the sample changes every second, so that the obtainment of images should be performed as fast as possible.
Further, as an application of technique utilizing the interference fringes (Patent Document 1), a technique of turning a beam that contributes to the interference fringe into three beams (Non-Patent Document 1: Mats G. L. Gustafsson et al., "Doubling the lateral resolution of wide-field fluorescence microscopy using structured illumination", Proceedings of the SPIE—The International Society for Optical Engineering, Vol. 3919, pp. 141-150, 2000) has also been proposed for achieving a super-resolution effect in both of an in-plane direction and a depth direction of a sample. This is because, if three beams are used, a stripe pattern of structured illumination can be generated not only in the in-plane direction but also in the depth direction. However, in that case, the number of images required for the aforementioned separating calculation is increased, so that it can be considered that the necessity of increasing the speed of obtaining images is particularly high.

Structured illumination apparatus, structured illumination microscopy, and structured illumination method


A subdivided fixed amount distributing apparatus for aerosol containers is provided in which aerosol contents exceeding a specified amount is prevented from being used in one cycle by keeping constant in total number of injection times at all times. A structure is simplified by making it possible to eject total amount to the outside every one time by means of a fixed amount injection valve, so that damage to the distributing apparatus due to outside air temperature is prevented and movement of the distributing apparatus is made smooth when it is pushed and released. The subdivided fixed amount distributing apparatus includes a lower sleeve 18 secured to an upper end of an aerosol container 1, a nozzle body 15 formed with a nozzle 16 communicating with a stem 4, a rotating body 23 disposed in a rotatable manner with respect to the nozzle body 15 and the lower sleeve 18, an annular body 34 disposed at an upper side of the rotating body 23, a pushing body 45 pushing the stem 4, and an upper sleeve 37 secured to the lower sleeve 18 at a lower end thereof, in which pushing operation of the stem 4 enables a fixed amount injection of the aerosol contents and positional movement of a fitting piece 28 while pushing operation of the stem 4 and positional movement in the same direction of the fitting piece 28 are disabled by hitting the fitting piece 28 on an upper end surface of a lower projection 21 after positional movement by pushing operation of predetermined times.

Some aerosol contents contained in an aerosol container, such as medical products, hair care products, and cosmetic products may be used directly for human bodies. If such aerosol contents are used exceedingly in an amount more than a prescribed use amount, however, such use may cause harmful effects on human beings, or may result in wasteful use. As disclosed in Japanese Unexamined Patent Publication No. 2001-232249, a subdivided amount distributing apparatus for aerosol containers has been developed in which the apparatus capable of spraying a prescribed fixed amount usable in a certain period multiple times is connected to a stem of an aerosol container and disposed at an exterior of the aerosol container.
This subdivided amount distributing apparatus for aerosol containers is formed with a fixed amount chamber and a fixed amount injection valve, respectively, in the apparatus, and the aerosol contents of a fixed amount are introduced from the aerosol container main body into the fixed amount chamber and stored therein. The interior of the fixed amount chamber is normally pressurized with a piston, and the aerosol contents contained in the fixed amount chamber are injected multiple times in a subdivided manner through the fixed amount injection valve. Fixed amount injection during a prescribed period is allowed by injection of a fixed amount one or more times, thereby bringing advantages realizing distribution of aerosol contents suitable for medical products, hair products, and cosmetic products, which are otherwise not favorable when used in an amount of a prescribed amount or more or used in a wasteful manner.

Small fixed quantity dispenser for aerosol container


A system and method for cleaning dirty data in an intermediate cache are disclosed. A dirty data notification, including a memory address and a data class, is transmitted by a level 2 (L2) cache to frame buffer logic when dirty data is stored in the L2 cache. The data classes include evict first, evict normal and evict last. In one embodiment, data belonging to the evict first data class is raster operations data with little reuse potential. The frame buffer logic uses a notification sorter to organize dirty data notifications, where an entry in the notification sorter stores the DRAM bank page number, a first count of cache lines that have resident dirty data and a second count of cache lines that have resident evict_first dirty data associated with that DRAM bank. The frame buffer logic transmits dirty data associated with an entry when the first count reaches a threshold.

1. Field of the Invention
The present invention relates generally to the field of memory management and, more specifically, to class dependent clean and dirty policy.
2. Description of the Related Art
One element of a memory subsystem within certain processing units is a Level 2 Cache memory (referred to herein as "L2 cache"). The L2 cache is a large on-chip memory that serves as an intermediate point between an external memory (e.g., frame buffer memory) and internal clients of the memory subsystem (referred to herein as the "clients"). The L2 cache temporarily stores data being used by the various clients. This data may be retrieved from or written to a dynamic random access memory (DRAM). The clients may re-use data that is stored in the L2 cache while performing certain operations.
During a write operation, where a client transmits data that needs to be committed to a DRAM, the data to be written is first transmitted to the L2 cache and is held there until an opportune time to push the data to the DRAM arises. Data present in the data cache is considered "dirty" until the data is written to the DRAM, after which the memory space in the data cache can be cleaned and made available for other data. During a read operation, a client may request data that was previously written during a write operation. If that data is not currently stored in the L2 cache then that data has to be retrieved from the DRAM. A read operation where the data has to be retrieved from the DRAM is processed in significantly more clock cycles than a read operation where the data is retrieved directly from the L2 cache. Thus, overall system performance may be severely impacted if data has to be retrieved from the DRAM for a significant number of read operations.
As is well known, each block of dirty data in the L2 cache has an associated location within a specific bank page of the DRAM, where the dirty data is written. To optimize memory accesses by mitigating delays resulting from waiting for DRAM bank pages to pre-charge, the number of write operations from the L2 cache to a particular DRAM bank page at any given time should be maximized. However, simply maximizing the number of write operations to the DRAM bank page may not strike the appropriate balance of optimizing write operations to the DRAM and allowing data to remain in the L2 cache long enough to be reused so that data requests to the DRAM can be avoided.
As the foregoing illustrates, what is needed in the art is a more efficient mechanism for determining which data should be transmitted from an intermediate cache, such as an L2 cache, to an external memory.

System, method and frame buffer logic for evicting dirty data from a cache using counters and data types


A structural connector is provided that limits transmissions of vibrations between connected structural elements in a building or structure. The structural connector is formed from two opposing sheets with a vibration damping material connecting the two.

Field of the Invention
The present invention relates generally to building construction. More particularly the present invention relates to a vibration damping, sound isolating, structural connector to connect various building elements to aid in sound proofing and noise reduction.
Description of Related Art
In the field of vibration damping products, a common solution is the composite type of vibration damping materials comprising a metal sheet and a viscoelastic polymeric material. One example of such a vibration damper is formed of a thin steel sheet and a rubber or synthetic resin-based viscoelastic polymeric layer bonded to both sides thereof, and another vibration damper formed by sandwiching and bonding a viscoelastic polymeric layer between two steel sheets.
Said composite type of vibration dampers are used in a wide range of industrial fields such as automotive engine mounts, disc brakes, oil pans, transmissions, compressors, air cleaners, brake clutches, electronic ranges, speakers and players. However, the vibration dampers of the prior art are not structurally capable of supporting large or complex loads or resisting specific significant forces, such as those experienced during building construction.
Other sound-proofing systems include the use of substantial insulation, and specially designed building materials. Both of these systems are costly, and can be difficult to install. Further, these existing approaches to sound proofing are generally topical applications that merely muffle sound on the surface. Structural elements are not used in sound-proofing systems.
Cavity insulation decreases airborne sound transmission but has no effect on structure borne sound such as impact noise that travels a direct path through very dense materials.
Another approach involves staggered stud walls, which are actually double studded walls whereby the opposing wall finishes do not share fastening to common studs. This practice only partially controls sound transmission as both studs walls are attached to the same top and bottom plates allowing for wall impacts to travel up into the ceiling plane and down through the floor system. Attempts are also made to control noise by adding extra layers of sheetrock or installing sheets of mass-loaded vinyl between sheets of sheetrock. Again, these features fail in preventing structural transmission of sounds, and merely muffle some sound transmission.
Therefore, what is needed is a device that may provide adequate vibration damping that is also capable of being an integral part of a building structure, and capable of withstanding heavy loads such as those experienced in a building and during building construction.


An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.

Technical Field
Various embodiments relate generally to an electronic device, an electronic arrangement and a method of manufacturing an electronic device.
Description of the Related Art
Packages may be denoted as encapsulated electronic chips with leads extending out of the encapsulant and being mounted to an electronic periphery, for instance on a carrier such as a printed circuit board.
However, there is still potentially room to improve handling of electronic devices having embedded one or more chips while maintaining manufacturability simple.

Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure


A laminated substrate obtained by laminating a carbon fiber reinforced resin substrate (a) containing a carbon fiber and a thermoplastic resin fiber and a glass fiber reinforced resin substrate (B) containing a glass fiber and a thermoplastic resin, wherein a content of the carbon fiber in the carbon fiber reinforced resin substrate (a) is 20% by mass or more and less than 100% by mass with respect to a total mass of the carbon fiber reinforced resin substrate (a), and the carbon fiber reinforced resin substrate (a) has an elongation percentage of from 20% to 150% at a maximum load point in a MD direction at a temperature of a melting point of a resin constituting the thermoplastic resin fiber+20° C., an elongation percentage of from 20% to 150% at a maximum load point in a TD direction, and a tensile stress of 1.0×10−3 to 1.0×10−1 MPa.

In recent years, the products are desired to have a lighter weight in the fields of transportation equipment such as motor vehicles, railroads, and aviation, robots, electronic equipment, furniture, building materials and the like from the viewpoint of environmental conservation and energy conservation for the construction of a sustainable society.
As described in Non-Patent Document 1, laminated structures, by which weight saving and cost saving are expected, have already been applied in a wide range of fields as a means for obtaining composite materials. The background to widely put such laminated structures in practical use is a manufacturing method in which laminate molding is easily conducted and the productivity is excellent as a method utilizing the properties of the respective materials. As the basic laminated structures, there are structures such as a sandwich structure and a hybrid structure and the effect thereof is exerted by selecting a lightweight material at a place with a small moment.
In addition, fiber reinforced resin composite materials, which are materials containing reinforcing fibers, exhibit superior specific strength and specific rigidity as compared with metal materials and can thus contribute to weight saving. For this reason, fiber reinforced composite materials containing carbon fibers, aramid fibers, glass fibers, and the like as reinforcing fibers have been widely used in structural materials such as aircrafts and motor vehicles, general industries such as tennis rackets, golf shafts, and fishing rods, sports applications, and the like to utilize the high specific strength/specific modulus.
Examples of the forms of reinforcing fibers used in these may include woven fabrics fabricated using continuous fibers, UD sheets in which fibers are aligned in one direction, random mats fabricated using cut fibers, and nonwoven fabrics.
As fiber-resin composite materials, there are composite materials containing thermosetting resins as a matrix, and examples of a molding method suitable for a complicated shape such as a three-dimensional shape may include a substrate formed of SMC. SMC refers to one obtained by disposing a fiber structure called chopped strand impregnated with a thermosetting resin in a molding die in a sheet shape and heating and pressurizing the fiber structure to mold a plastic, and it is possible to form a complicated three-dimensional structure since SMC exhibits relatively high flowability. Hitherto, as the matrix resin of fiber reinforced composite materials, thermosetting resins as described above have been mainly used. In recent years, however, fiber reinforced composite materials containing thermoplastic resins as a matrix have attracted attention from the viewpoint of cost, rapidity and easiness of molding, further, recyclability after use, and the like (Patent Document 1).
As a fiber-resin composite material, there is a composite material containing a thermoplastic resin as a matrix, the composite material exhibits flowability similar to thermosetting property and is a molding method suitable for complicated shapes such as a three-dimensional shape. In addition, the composite material exhibits favorable processability and can be thus repeatedly molded. However, it is difficult to hold a certain amount of fibers at the target place in the case of imparting partial functionality to fiber reinforced composite materials.
In general, thermoplastic resins have a higher viscosity than thermosetting resins, thus it takes a long time to impregnate the fiber substrate with the resin, and as a result, there has been a problem that the tact time until molding is prolonged.
Patent Document 2 describes thermoplastic stamping molding as a means for solving these problems. This is a molding method in which a chopped fiber impregnated with a thermoplastic resin in advance is heated to a temperature equal to or higher than the melting point and then charged into a part of the mold, then the mold is immediately closed, and the fiber and resin flow in the mold to obtain a product shape and are then cooled/molded. However, there have been problems that it is impossible to fabricate a thin material since the fiber and resin flow in the mold, the fiber orientation is disturbed, control is difficult, and the like. In addition, the fibers are uniformly dispersed in a short fiber form as a means for improving the impregnating property, and it is thus possible to prevent a resin-rich portion from generating in the gap between the bundles of fibers or the resin from not being impregnated into the fiber bundle and thus forming an unimpregnated portion. However, there have been problems that it is impossible to increase the fiber length, further, voids are generated in the molded body when the fiber volume content is increased, and this leads to a decrease in mechanical properties (Patent Document 3).
There is a substrate for plastics (mixed mat) which can be easily impregnated with a thermoplastic matrix resin, is uniform, and exhibits excellent handling property and three-dimensional moldability by fabricating the substrate in which the reinforcing fiber and the thermoplastic resin are mixed under certain conditions in advance (Patent Document 4). However, reinforcing fibers are generally considered to be more expensive than resins, and it is thus not greatly effective to use reinforcing fibers in the entire member in consideration of cost and the like.

Laminated substrate and method for manufacturing the same


Improved methods of decoding data symbols of a high throughput (HT) data field in a mixed mode packet are provided. In one embodiment, first and second data symbols of the HT data field can be decoded using timing information derived from a legacy header of the mixed mode packet. In another embodiment, the first data symbol of the HT data field can be decoded using timing information derived from a legacy header of the mixed mode packet, whereas the second data symbol of the HT data field can be decoded using approximately half of the tones of the HT long training field in the mixed mode packet. Subsequent data symbols of the HT data field can be decoded using all tones of the HT long training field in the received mixed mode packet.

1. Field of the Invention
The present invention relates to wireless networks, and in particular to the decoding of the first high throughput (HT) symbol of the HT data field.
2. Related Art
The IEEE 802.11-2007 is a set of standards relating to wireless local area networks (WLAN). The legacy standards, e.g. 802.11a and 802.11g, have data rates that are relatively low. For example, both 802.11a (released 1999) and 802.11g (released 2003) have a data rate of 54 Mbit/s. In contrast, one of the most recent standards, 802.11n (projected release 2008), has a data rate of 300 Mbit/s. Thus, 802.11n is characterized as a high throughput protocol.
An 802.11 access point (AP) can operate in one of three modes: the legacy, mixed, or Greenfield mode. In the legacy mode, the AP can use one of the legacy protocols, e.g. 802.11a or 802.11g. In the mixed mode, the AP can use one of the legacy protocols or 802.11n. In the Greenfield mode, the AP can only use 802.11n (wherein "Greenfield" refers to a project that lacks any constraint imposed by prior work).
FIG. 1 illustrates an exemplary mixed mode packet format 100 that can be used in accordance with the 802.11n standard. As shown, mixed mode packet format 100 includes a legacy header 110, a high throughput (HT) header 111, and an HT data field 109. Legacy header 110 includes a legacy short training field 101, first and second legacy long training fields 102 and 101, and a legacy signal field 104. HT header 111 includes first and second HT signal fields 105 and 106, an HT short training field 107, and an HT long training field 108.
As known by those skilled in the art of wireless communication, fine timing (which determines an offset of the receiver) can be estimated from the slope of a frequency domain channel response. In a conventional legacy packet, which includes legacy header 110 followed by a legacy data field, legacy long training fields 102 and 103 can be used to consecutively better estimate the fine timing.
Notably, an HT receiver may ignore legacy header 110, thereby relying solely on HT header 111 for fine timing. However, HT header only includes one HT long training field 108. Unfortunately, by the time fine timing is obtained from this sole field, the first and second data symbols of HT data field 109 are already being processed for decoding. This fine timing is available for the third data symbol of HT data field 109.
To resolve this processing latency, the symbols of the data field could be stored in memory and then accessed for processing when the fine timing information is available. Unfortunately, this solution incurs undesirable additional hardware and time latency costs. Note that 802.11n requires that decoding of the packet must be complete by 16 microseconds after the end of the packet. Unfortunately, the additional time latency associated with data symbol storage and access could violate this requirement.
Therefore, a need arises for a technique to provide improved decoding for the first data symbol of the HT data field.


A semiconductor device includes a semiconductor substrate which has a major surface and a MOS transistor which has a gate and first and second diffusion regions and which is formed on the major surface. The semiconductor device also includes a laminated structure of a SOG layer, wherein the laminated structure is composed of a base layer and a surface layer formed on the base layer and is formed over the MOS transistor and wherein the surface layer is denser than the base layer.

1. Field of the Invention
The present invention generally relates to a semiconductor device and a method of fabricating the same, and more particularly, to a semiconductor device, such as a semiconductor integrated circuit device, having Spin On Glass film (it is called hereinafter SOG film) that is suitable for multilevel interconnection structure to achieve high integration and a method of fabricating thereof.
This application is a counterpart of Japanese patent application, Ser. No. 192584/1999, filed Nov. 7, 1999, the subject matter of which is incorporated herein by reference.
2. Description of the Related Art
In a multilevel interconnection technique of a semiconductor device, a multilevel interconnection structure can be obtained by forming an interlevel insulator between a lower wiring and an upper wiring, wherein the lower wiring is formed over a semiconductor substrate and the upper wiring is formed over the lower wiring. An integration of the semiconductor device can be improved by the multilevel interconnection structure.
In general, an electrical junction part is formed in a contact hole which is provided in the interlevel insulator so as to expose an active region of the semiconductor substrate.
There is a self-alignment contact technique to provide such contact hole. This self-alignment technique is executed by following steps.
First, a pair of gate electrodes whose side surfaces and upper surfaces are covered with protection films, e.g., a silicon nitride film, is formed over a semiconductor substrate.
Next, an interlevel insulator is formed over the entire surface of the semiconductor substrate so as to cover the gate electrodes and the protection films.
Next, an etching mask having an opening is formed on a surface of the interlevel insulator so that the opening corresponds to an active region of the semiconductor substrate between the gate electrodes.
Then, an etching process is executed by using the etching mask to form a contact hole extending from the active region to an upper surface of the interlevel insulator. At this time, since the protection films have a high etching-resistance characteristic against an etching gas, or the like, the protection films are prevented from being etching. This means that the protection films function as an etching mask.
In the self-alignment contact technique, even though the etching mask is formed on a position which is slightly different from a desired position, the contact hole exposing the active region can be obtained because of a mask function of the protection film.
However, an anisotropic etching is used for a selective etching process using the etching mask wherein the anisotropic etching is an etching that an etching rate in a direction horizontal is relatively smaller than the etching rate in a direction vertical. Therefore, when a large amount of mask misalignment occurs, there is a possibility that an area of the exposed active region become smaller than an area having a desired value.
The reduction of the exposed active region causes an increase in the contact resistance between the exposed active region and a conductive part which is formed within the contact hole. This means also that electrical characteristics become uneven among contact holes.
In order to overcome such problems mentioned above, an idea that an isotropic etching is used for the selective etching instead of the anisotropic etching may arise. However, when only the isotropic etching is simply applied to the selective etching to form the contact hole in the interlayer insulator, it is difficult to control the area of the exposed active region and the depth of the contact hole. This means that a required contact hole is not obtained.
Another idea that both of the isotropic etching and the anisotropic etching is applied to the selective etching may also arise. However, it is not realistic that the interlayer insulator having single etching-resistance property is subjected to different kinds of etching methods, i.e., the isotropic etching and the anisotropic etching.
Consequently, there has been a need for a semiconductor device having improved electric characteristics and a method of fabricating the same.

Semiconductor device and method of fabricating the same


A process for making a polyamide substrate characterized by enhanced breaking strength and fade resistance is disclosed. The process features the steps of treating a polyamide substrate, preferably a nylon 6 substrate having a hindered amine light stabilizer chemically bound thereto, with an effective amount of an ultraviolet inhibitor, an antioxidant and optionally, a dye, in the presence of a swelling agent for the polyamide that is also a solvent for the ultraviolet inhibitor and the antioxidant to impart high breaking strength to the substrate. A life preserver or other type of buoyancy device may be made from the process. A polyamide fabric comprising a dye, an ultraviolet inhibitor and an antioxidant also is disclosed. When a polyamide fiber of the present invention is exposed to sunlight, the useful life of the fiber is greatly increased compared to untreated polyamide fiber.

1. Field of the Invention
The present invention relates to a stabilized polyamide substrate and a process for making the same. More particularly, this invention relates to a fiber or article made from a polyamide polymer, preferably having a hindered amine light stabilizer chemically bound thereto during polymerization, and treated with an antioxidant and ultraviolet inhibitor in the presence of a substance that is a solvent for the antioxidant and ultraviolet inhibitor and is a swelling agent for the polyamide. The treated polyamide substrate, preferably dyed, has unusually high strength as compared with the untreated polyamide substrate, and is useful in devices, and/or fabrics covering same, that are subject to weathering or exposure to severe environmental conditions during normal use.
2. Brief Description of the Related Art
Dyed fabrics woven from organic polymer fibers such as polyamides have been used in flags, decorative banners and as covers for personal flotation devices, such as life preservers. Prolonged exposure to sunlight, commonly referred to as weathering, tends to fade the dyed polyamide material and to reduce its physical properties such as strength retention and resistance to elongation. This occurs when the dye and polymeric components of the material absorb damaging wavelengths of light.
Various organic light stabilizers are known for use with polymer substrates like films, fibers and articles manufactured therefrom. Hindered amine light stabilizers (HALS) have been found to be particularly effective organic light and/or heat stabilizers, with one particularly effective stabilizer being that set forth in U.S. Pat. No. 5,618,909 to Lofquist et al., hereby incorporated by reference. Lofquist et al. discloses an efficient, environmentally friendly process for preparing light stabilized polyamide substrates such as molded objects, films, fibers and fabrics, and in particular flags, decorative banners, and fabric covers for personal flotation devices, with a HALS chemically bound to the polyamide and thus no longer susceptible to migration, leaching, and/or volatilization during downstream processing. Although the disclosed HALS stabilizes the polyamide polymer composition against heat and light, fading and coloration problems still exist when the polymer is dyed and exposed to excessive heat, moisture and light conditions. Particularly affected are dyed polyamide polymers that are used in water safety and water recreational devices, such as life vests, floats, banners, and other such normally weathered devices or fabrics.
It is also known to stabilize polymers against ultraviolet and oxidative deterioration by incorporating benzotriazole derivative ultraviolet absorbers and hindered phenol antioxidants into bulk polymers during melt processing. U.S. Pat. Nos. 3,935,163 and 5,380,774 disclose numerous benzotriazole derivatives and hindered phenol antioxidants suitable for this purpose. The disclosures of U.S. Pat. Nos. 3,935,163 and 5,380,774 are hereby incorporated by reference to the extent not incompatible herewith.
However, it is not always practical to incorporate bulk additives in polymers prior to a fiber spinning operation. The stability of a fiber spinning operation is extremely sensitive to the rheological properties of the polymer. Additives must be compatible with the polymer, must not unduly influence the polymer rheology, and must be capable of being rigorously controlled to a constant concentration. Further, a bulk additive must be incorporated at high concentration in order to provide useful concentrations at the surface of the article where needed. These are serious limitations on allowable materials.
A need exists for an effective method of treating fibers and articles after spinning or melt processing to improve strength retention after exposure to light. Ideally, this method should provide the active constituents at the surfaces of the fibers and be practicable in conjunction with dyeing so that no additional steps are required in manufacturing.
The present invention satisfies these needs. It provides means of improving the strength retention of a polyamide substrate after exposure to light. More particularly, the invention improves the strength retention of fibers and articles by treatment after spinning or melt processing. The method provides the active constituents at the surfaces of fibers and is practicable in conjunction with conventional fiber dyeing.
Determination of effective strength of the substrate, and resulting fibers, results from Weatherometer measurements of the substrate in question after exposure to light. Although desirable, it has proven particularly difficult to manufacture a polyamide substrate possessing a high breaking strength after light exposure, particularly a breaking strength of greater than about 300 Newtons after 300 hours of weathering [Underwriters Laboratories Canada, 300 hours of fading ASTM G26 Xenon Arc and ASTM D5034 Break Strength (Grab Test)]. The present invention achieves this superior breaking strength for polyamide fabric after light exposure.
The present invention includes a process for preparing a polyamide substrate characterized by high strength, even after extended exposure to light. The process comprises the steps of treating a polyamide substrate, preferably dyed, with an effective amount of an ultraviolet inhibitor and an antioxidant in the presence of a substance that is a solvent for the ultraviolet inhibitor and the antioxidant and is a swelling agent for the polyamide, to thereby impart enhanced breaking strength to the polyamide substrate after exposure to light.
An article made by this process is also within the scope of the present invention, e.g., a film, fiber or molded article, as well as products made therefrom, such as fabrics and fibrous networks. Life preservers and other buoyant device products, as well as fabric covers therefor, are examples of such articles.
The present invention further includes the fabric comprising a polyamide fibrous substrate treated with an ultraviolet inhibitor and an antioxidant, and optionally but preferred, with an acid dye.
The preferred polyamide substrate comprises a heat and/or light stabilizing amount, preferably from about 0.1 to about 1.0, more preferably 0.2 to 0.5 weight percent, of a hindered amine bound thereto by reaction of a functional group of the hindered amine with an end group of a precursor of the polyamide. The preferred hindered amine is represented by the formula:
in which
R1 comprises the functional group, which is an amine or an amide-forming group:
R2 is alkyl, preferably methyl or ethyl; and
R3 is selected from the group consisting of hydrogen; alkyl of 1 to 3 carbons; and xe2x80x94OR4 in which R4 is selected from the group consisting of hydrogen, methyl, and alkyl of 1 to 7 carbons.
When the treated polyamide substrate of the present invention is exposed to sunlight, its useful life is greatly increased compared to untreated polyamide substrates. This is particularly applicable to polyamide fibers and fabrics made therefrom, especially nylon 6 fibers and fabrics.


Embodiments of the present disclosure are directed towards an integrated circuit (IC) package having first and second dies with first and second input/output (I/O) interconnect structures, respectively. The IC package may include a bridge having first and second electrical routing features coupled to a portion of the first and second I/O interconnect structures, respectively. In embodiments, the first and second electrical routing features may be disposed on one side of the bridge; and third electrical routing features may be disposed on an opposite side. The first and second electrical routing features may be configured to route electrical signals between the first die and the second die and the third electrical routing features may be configured to route electrical signals between the one side and the opposite side. The first die, the second die, and the bridge may be embedded in electrically insulating material. Other embodiments may be described and/or claimed.

The input/output density of dies, such as processors, is continually increasing. Integration of multiple dies on a package with high interconnect densities is important to achieve high computational abilities. High density interconnect technologies like silicon interposers are expensive due to the large silicon area. Interconnect bridges embedded in substrates use less silicon than silicon interposers do.

Integrated circuit package with embedded bridge


Demyelinated axons were remyelinated in the demyelinated rat model by collecting bone marrow cells from mouse bone marrow and transplanting the mononuclear cell fraction separated from these bone marrow cells.

Transplantation of oligodendrocytes (i.e., oligodendroglia) (Archer D. R., et al., 1994. Exp. Neurol. 125:268–77; Blakemore W. F., Crang A. J., 1988. Dev. Neurosci. 10:1–11; Gumpel M., et al. 1987. Ann. New York Acad. Sci. 495:71–85) or myelin-forming cells, such as Schwann cells (Blakemore W. F., 1977. Nature 266:68–9; Blakemore W. F., Crang A. J., 1988. Dev. Neurosci. 10:1–11; Honmou O. et al., 1996. J. Neurosci. 16:3199–208), or olfactory ensheating cells (Franklin R. J. et al., 1996. Glia 17:217–24; Imaizumi T. et al., 1998. J. Neurosci. 18(16):6176–6185; Kato T. et al., 2000. Glia 30:209–218), can elicit remyelination in animal models and recovery of electrophysiological function (Utzschneider D. A. et al., 1994. Proc. Natl. Acad. Sci. USA. 91:53–7; Honmou O. et al., 1996. J. Neurosci. 16:3199–208). It is possible to prepare such cells from patients or other persons for cell therapy. However, this method is considerably problematic because tissue material must be collected from either the brain or nerves.
Neural progenitor cells or stem cells derived from brain have the ability to self-renewal and differentiate into various lineages of neurons and glia cells (Gage F. H. et al., 1995. Proc. Natl. Acad. Sci. USA. 92:11879–83; Lois C., Alvarez-Buylla A., 1993. Proc. Natl. Acad. Sci. USA. 90:2074–7; Morshead C. M. et al., 1994. Neuron 13:1071–82; Reynolds B. A., Weiss S., 1992. Science 255:1707–10). By transplantation into newborn mouse brain, human neural stem cells collected from fetal tissues differentiate into neurons and astrocytes (Chalmers-Redman R. M. et al., 1997. Neurosci. 76:1121–8; Moyer M. P. et al., 1997. Transplant. Proc. 29:2040–1; Svendsen C. N. et al., 1997. Exp. Neurol. 148:135–46), and myelinate the axons (Flax J. D. et al., 1998. Nat. Biotechnol. 16:1033–9). Remyelination and recovery of impulse conduction upon transplantation of neural progenitor (stem) cells derived from adult human brain into demyelinated rodent spinal cord have been reported (Akiyama Y. et al., 2001. Exp. Neurol.).
These studies have evoked great interest due to the indicated possibility of the application of the above-mentioned cells to regenerative strategy of neurological diseases (Akiyama Y. et al., 2001. Exp. Neurol.; Chalmers-Redman R. M. et al., 1997. Neurosci. 76:1121–8; Moyer M. P. et al., 1997. Transplant. Proc. 29:2040–1; Svendsen C. N. et al., 1997. Exp. Neurol. 148:135–46; Yandava B. D. et al., 1999. Proc. Natl. Acad. Sci. USA. 96:7029–34). However, in order to establish cell transplantation therapy (including autologous transplantation) using these cells, still problems, such as establishment of harvest method and requirement of cell expansion using trophic factors, remain to be solved.
According to the recent studies, neural stem cells were revealed to be able to differentiate or transform into hematopoietic cells in vivo, suggesting that neural progenitor (stem) cells are not restricted to the neural cell lineage (Bjornson C. R. et al., 1999. Science 283:534–7). Furthermore, bone marrow stromal cells (not mesenchymal stem cells in the bone marrow) are reported to differentiate into astrocytes by the injection into the lateral ventricles of neonatal mice (Kopen G. C. et al., Proc. Natl. Acad. Sci. USA. 96:10711–6), and into neurons in vitro when cultured under appropriate cell culture conditions (Woodbury D. et al., 2000. J. Neurosci. Res. 61:364–70).

Method for remyelinating a demyelinized lesion due to injury in the brain or spinal cord

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