Device for classifying tachyarrhythmia that obtains pre-defined values, monitors atrial intervals and compares lengths of each interval with pre-defined value IL, stores length of atrial interval if length is shorter than IL, in case X of most recent Y number of atrial intervals have length shorter than IL, evaluates most recent <=N atrial intervals with length <IL and performs test for stored lengths via criteria, classifies atrial tachyarrhythmia as stable if all tested lengths pass >=1 criteria, and controls a cardiac device depending on the classification. Atrial intervals are first evaluated by using the “X-out-of-Y” criterion and subsequently checked for stability after an atrial tachyarrhythmia is detected using “X-out-of-Y” criterion. For stability check, only intervals found shorter than the interval limit are used. Check is based on interval-to-interval comparison rather than as generally practiced, comparisons of individual intervals with the minimum or average of all intervals.

1. Field of the Invention
The present invention generally relates to implantable cardiac devices, including pacemakers, defibrillators and cardioverters, which stimulate cardiac tissue electrically to control the patient's heart rhythm. More particularly, the present invention relates to a method and device for classifying atrial tachyarrhythmia as being stable or unstable. Further, the present invention relates to a method and device for indicating Very High Rate rhythm.
2. Description of the Related Art
There are previously proposed methods for detecting atrial tachyarrhythmias and a determination of their being stable or unstable. However, an otherwise simple task is complicated by the fact that a multi-chamber pacemaker or ICD may not "see" all of the atrial complexes due to some of these falling in cross-chamber blanking periods, such as post-ventricular-pace blanking and far-field blanking periods.
It is known from the prior art to use a so called "X-out-of-Y" criterion to detect an ongoing atrial tachyarrhythmia. The U.S. Pat. No. 6,671,548 B1 for example describes use of such a "X-out-of-Y" criterion. This criterion declares detection of an atrial tachyarrhythmia when X number of intervals among most recent Y number of atrial intervals are found to be shorter than an interval limit corresponding to the tachyarrhythmia rate limit. The numbers X, Y and the tachyarrhythmia rate limit may be user defined, e.g., pre-defined or may be programmable. As is clear, the "X-out-of-Y" criterion accommodates for undersensing of some of the atrial events.

Device, method and computer-readable storage medium for classifying atrial tachyarrhythmia


A medical image recording system easily obtains information of a device, etc. used at the time of an examination without conscious effort on operator's part, and records image information and the device information, which are obtained at the time of the examination, by making a 1-to-1 association between them. The system comprises at least an image information obtaining unit obtaining an observation image at the time of an examination for a medical treatment, a device information obtaining unit obtaining information of a device used at the time of the examination, and a recording unit recording information composing of the image information obtained by the image information obtaining unit and the device information obtained by the device information obtaining unit, as one associated information.

1. Field of the Invention
The present invention relates to a medical image recording system.
2. Description of the Related Art
Conventionally, a medical image recording system which records information of an image shot by making an examination with an electronic endoscope, etc., and allows the information to be effectively used for a diagnosis after the examination, an electronic carte to be filled in, the progression observation of a treatment effect, results of examinations made by a plurality of doctors, a diagnostic conference, etc. is proposed (for example, see Japanese Patent Publication No. HEI07-141498). Also a medical image recording system having a mechanism for obtaining and recording information of a device used for an examination to grasp the use state of the device used at the time of the examination is proposed (for example, see Japanese Patent Publication No. 2001-46326).
In these medical image recording systems, an observation image of a medical device such as an electronic endoscope, etc. is recorded along with patient data (an ID number, a name, etc.), and when a report of an examination is created with an electronic carte after the examination is terminated, a shot medical image is pasted on an electronic carte report screen, contents of an examination made are recorded, and the type name and the S/N (serial number) of a device used for the examination, and the name of a drug, etc. used for the examination are input.
However, with the conventional medical image recording systems, the information of the type name, the S/N, etc. of a device used for an examination is manually input, or such information items are selected from a list preregistered to a database, in order to record the contents of an examination made.
In the case of a large hospital, examinations of as many as 10,000 patients per year can possibly be made, and various types of devices are used for only one examination. By way of example, only for an electronic endoscope, its types include a duodenal endoscope, an esophageal endoscope, an endoscope for an electric knife treatment, etc. Additionally, product generations exist even for an endoscope of the same type. For example, an endoscope introduced ten years ago and an endoscope introduced one year ago coexist, and are used in many cases.
Accordingly, input operations for recording the information (such as a type name, an S/N, etc.) of a device used for an examination to an electronic carte, etc. after the examination is made are very troublesome. Additionally, since the input operations rely on a note or memory of a user, there is a great possibility that an input error is caused. Additionally, if an input error occurs, it is difficult to notice the input error, and the error can be possibly overlooked. Furthermore, if a person who makes an examination differs from a person who makes a diagnosis after the examination, it becomes much more difficult to notice the above described error.
Besides, since a large number of examinations are made for one year as described above, the amount of image information handled becomes very large. Therefore, it is difficult to make an association between information of a shooting condition used at the time of an examination, a device, etc., and image information, after the examination is made. Furthermore, if image processes such as an enhancement, etc. are executed at the time of shooting, they can possibly hinder an image process when image information is reproduced later.
A problem of the above described conventional medical image recording systems is that a 1-to-1 association is not assured to be made (image information is not associated with the information of a device, etc. due to a man-made error) between image information obtained at the time of an examination, and information of a medical device, etc. used when an image is obtained (at the time of the examination). This is because the image information obtaining unit obtaining an observation image at the time of an examination, and the device information obtaining unit obtaining information of a medical device used when the image is obtained (at the time of the examination) are completely independent.


According to one embodiment, there is a solid-state imaging device including an imaging region. In the imaging region, a plurality of pixels are arranged two-dimensionally. A first inclination angle of a light incidence surface of a dichroic filter in a first pixel among the plurality of pixels relative to a normal to a surface of a semiconductor substrate and a second inclination angle of a light incidence surface of a dichroic filter in a second pixel located farther from a center of the imaging region than the first pixel among the plurality of pixels relative to the normal are decided on so as to make, for light incident on the imaging region, a filter property of the dichroic filter in the first pixel and a filter property of the dichroic filter in the second pixel equalized.

In an imaging system such as a camera, a solid-state imaging device is placed at a predicted image plane of an imaging lens. The imaging lens forms an image of an object on the imaging region (image plane) of the solid-state imaging device. The solid-state imaging device generates an image signal according to the object image. At this time, if the amounts of received light of pixels in the periphery attenuate relative to pixels near the center in the imaging region, there may occur shading where pixel signals in the periphery of the imaging region attenuate in luminance (signal level) relative to pixel signals in the vicinity of the center of the imaging region, in the image signal generated by the solid-state imaging device.

Solid-state imaging device and manufacturing method of the same


A reflective article such as a mirror or an energy-screening transparent panel comprises a reflective metal coating deposited on a glass substrate. The metal coating comprises a reflective layer of silver and has been treated with a solution containing ions of at least one of the group consisting of: Cr(II); V(II or III); Ti(III or II); Fe(II); In(I or II); Cu(I); and Al(III). Such a treatment affords protection of the reflective coating against corrosion.

1. Field of the Invention
This invention relates to reflective articles comprising a reflective metal coating deposited on a glass substrate, and it extends to methods of manufacturing such articles.
Such a metal coating may be deposited pattern-wise to form a decorative article, but the invention has particular reference to glass substrates bearing a continuous reflective coating. The coating may be applied to a substrate of any form, for example to an artistic object, to achieve some desired decorative effect, but it is envisaged that the invention will find greatest use when the coating is applied to a sheet glass substrate. The reflective coating may be so thin that it is transparent. Glass panes bearing transparent reflective coatings are useful inter alia as solar screening panels or as low-emissivity (in respect of infra-red radiation) panels. Alternatively, the coating may be fully reflective, thus forming a mirror-coating. Such a mirror may be plane, or it may be curved.
2. Description of the Related Art
Reflective metal coatings, e.g. of silver, are apt to be attacked by atmospheric pollution with the result that the silver layer becomes tarnished so that the required optical properties of that layer are lost. It is accordingly known to apply protective layers to such a silver layer, the nature of the protective layer being determined by the required properties of the coated substrate and by cost.
For example, transparent silver layers such as may be used in solar screening coatings may be protected against corrosion by overcoating them with one or more transparent metal oxide layers. Such silver layers are often formed by a vacuum deposition technique, and the protective layer(s) is or are also formed by vacuum deposition, often in the same apparatus, to avoid risk of marring the silver layer. Such protective layers are expensive to form.
Front-silvered mirrors may be protected in the same way.
Back-silvered mirrors may be protected by one or more opaque layers, since the optical properties of the rear face of a mirror are largely irrelevant, and that face is anyway usually hidden from view in some form of mirror mounting.
According to classical methods, mirrors are manufactured by sensitizing a glass sheet, applying a silvering solution to form a silver reflective layer, overcoating that silver layer with a protective layer of copper, and then painting the copper layer to produce the finished mirror.
The purpose of the copper layer is to retard tarnishing of the silver layer, and the copper layer is itself protected from abrasion and corrosion by the layer of paint.
Of the various paint formulations which could be used for protecting a mirror, those which afford the best protection against corrosion of the copper layer contain lead pigments. Unfortunately lead pigments are toxic and their use is being increasingly discouraged for reasons of environmental health.

Reflective articles having improved corrosion resistance


An apparatus for emulating multiple RFID tags in a supply chain/logistics network, comprising: an RFID transceiver for receiving an RF command from an interrogator, a controller for converting the received RF command into a digitized message, an RFID emulation unit for retrieving or storing identification data with respect to the multiple differing RFID tags, wherein the RFID emulation unit retrieves or stores identification data in one or more ID repositories with respect to one or more product RFID tags, one or more case RFID tags and a pallet RFID tag and the controller responding to the interrogator with a single ID retrieved from the one or more ID repositories contain information as to the one or more product RFID tags, one or more case RFID tags and a pallet RFID tag, wherein the RFID emulation unit retrieves or stores the identification data on a remote server over the Internet or locally in non-volatile memory of each apparatus. In addition, the apparatus can contain a housing, a handle and a display screen and an input device to allow a user at any point in the supply chain/logistic network to quickly determine information on the products, cases or pallet.

1. Field of the Invention
The present invention generally relates to RFID tags, more particularly, an apparatus, system, method and computer program storage device for emulating multiple RFID tags in a supply chain/logistics network to create a single interrogator read point.
2. Description of the Prior Art
Increasingly, radio frequency identification (RFID) solutions are being deployed resulting in RFID tags attached to or embedded in all sorts of objects. The main thrust behind this increased deployment of RFID solutions is the electronic product code (EPC) system, which is a family of coding schemes employing RFID technology as an eventual successor to the bar code. More recently, EPC networks have been proposed such as EPCglobal® which is a collection of interrelated RFID standards for hardware, software, and data interfaces networked together with a core service provider to enhance a supply chain to a community of trading partners engaged in the capture, sharing, and discovery of EPC related data.
In operation, an EPC network such as EPCglobal® share information among RFID devices and service providers (e.g. identifying the object and its location) after an RFID reader/interrogator interrogates and identifies an RFID tag. A very limited amount of information is encoded in the RFID tag and different vendors will assign and issue different tags which typically leads to multiple tags on a single object. Accordingly, RFID tags traveling along a supply chain will encountering numerous RFID tag readers/interrogators (read points) throughout their lifetimes.
Referring to FIG. 1A, a conventional interrogator 110 is illustrated interacting with several similar RFID tags attached or embedded in various objects 100. As can be seen in FIG. 1A, an RFID reader (hereafter "interrogator") 110 is capable of interrogating various objects such as electronic devices having RFID tags 120, coupled to or embedded within the electronic device, such as an mp3 player 130, a laptop computer 140, a PDA 150 and a cellular phone 160. In operation, the interrogator 110 sends an interrogation signal to the RFID tags 120 and receives back a response signal including an ID based upon hard coded information in the RFID tag 120. The interrogator 110 compares the ID to entries in a database (not shown) for identifying the ID tag 120 to a specific object (as well as other information such as location and ultimate destination).
RFID tags 120, as mentioned above are commonly utilized in supply chain networks, for example coupled to or embedded in objects such as a box (not shown) or within the box, a case (not shown) or an entire pallet 170 which may contain multiple boxes. FIG. 1B illustrates a conventional supply chain network where multiple differing types of RFID tags are attached to an object. As can be seen in FIG. 1B, a bottle of wine 172 has a product RFID tag 122 attached at the wine manufacture's site. Product RFID tag 122 is a high frequency (HF) tag (13.56 MHZ, ISO 18000-3), which is attached to every wine bottle 172. The manufacture can also attach a case RFID tag 124 to a case of wine 174. For example, as shown in FIG. 1B, a wine case 174 is cased by six bottles per case and tagged with case RFID tag 124, which is an ultra high frequency (UHF) (900 MHZ, ISO 18000-6B) tag. Moreover, shippers and wholesalers and other intermediates in the supply chain might attach other types of RFID tags to the wine case 174. Later, in the supply chain, wine cases 176 are stacked 27 cases per pallet 170. Each pallet 170 is tagged with a pallet tag 126, such as a UHF (900 MHZ, ISO 18000-6B) RFID tag manufactured by Intermec® (Large Ridged Tag GEN-2-ITO4UOOYTT001A). Each RFID tag described above, the pallet RFID tag 126, the case RFID tag 124, and the product RFID tag 122 may likely only communication with a specific interrogator 110. Hence, at each point of contact in a supply chain network, multiple interrogators 110 would be required in order to have full information on the products on a pallet 170.
In the conventional supply chain network, as shown in the example of FIG. 1E, a single pallet 170 can contain multiple, i.e. hundreds of differing RFID tags. The conventional pallet 170 contains a pallet tag 126 affixed to the pallet itself, twenty-seven cases 176, each contain a case RFID tag 124 (or more depending on whether a shipper or wholesaler added additional RFID tags), and nested within each case 174, are six product RFID tags 122 (27+27*6+1=190 RFID tags). The shear number of differing RFID tags can potentially cause each interrogator 110 to misread a product RFID tag 122, case RFID tag 124 or pallet RFID tag 126 due to RF interference among the differing RFID tags. Also RFID in the conventional supply chain RFID tags likely become damaged due to the harsh conditions of shipping/warehousing, which also cause misreads by the interrogator 110. Therefore, it would be highly desirable to avoiding having to affix more than one RFID tags to an object. Alternatively, it would be highly desirable to avoid having multiple interrogators at each point of access (read point) in a supply chain network.
Having set forth the limitations of the prior art, it is clear that what is required is a method, system or computer program storage device capable of emulating RFID tags for device identification without the necessity of affixing multiple physical RFID tags to devices or reading each individual RFID tag, i.e., for products on a pallet container, or like transport means through a network.

Embedded system architecture for RFID tag emulation

International Business Machines Corporation

Institute for Information Technology Advancement


An antenna applied in a communication device is provided. The antenna includes a conductive supporting portion, a radiator and a grounding portion. The radiator operates in a first frequency band. The grounding portion is connected to the radiator through the conductive supporting portion. The grounding portion includes a cavity extended from a top surface of the grounding portion into the interior of the grounding portion. A resonant cavity operating in a second frequency band is formed between the radiator and the cavity.

1. Field of the Invention
The invention relates in general to an antenna, and more particularly to a planar inverse-F antenna (IFA).
2. Description of the Related Art
As science and technology have gained rapid advance nowadays, a large variety of compact antennas have been developed and applied in various electronic devices such as mobile phones and notebook computers. For example, the planar inverse-F antenna (PIFA), which has compact structure and excellent transmission efficiency and can be easily disposed on an inner wall of an electronic device, has been widely applied in the wireless transmission of many electronic devices. However, most of conventional PIFAs are single band antenna, and can only support a narrower frequency band.

This patent is subject to a terminal disclaimer.


A family of interconnect structures, switches that exploit the interconnect structures to attain scalability, low latency, and single-chip implementations. The disclosed interconnect structures and switches support a wide variety of applications including supercomputer interconnects, LAN switches, IP and ATM switches, telephony central office switching, video on demand servers, interconnects for mainframe database servers, high-speed workstation interconnects, and many others that are known to those having ordinary skill in the art.

The present invention relates to interconnection structures for computing and communication systems. More specifically, the present invention relates to a scaleable low-latency switch for usage in a multiple level interconnection structure.
A persistent and significant unsolved problem in the field of computer science and communications has been the lack of a scaleable, low-latency interconnect that sustains high throughput, a high cross-sectional bandwidth, under fully loaded conditions. Existing interconnect designs, such as banyon, omega and fat-tree networks, multi-level grids, torus and hypercube networks, all fail in various degrees to scale without limit, and to support low latency and high throughput when loaded with traffic. Geometries of existing networks were developed by Nineteenth Century mathematicians, and even earlier geometricians, and were never intended to support a message-routing method.
What is needed is an interconnect structure and a suitable switch for use in forming interconnections in the structure that are scaleable virtually without limit, and that support low latency and high throughput.


A backpack that comprises a series of durable fabric panels that have been sewn together to form a soft and expandable container, which has been equipped with ergonomic shoulder straps and numerous features for the homeless individual that help overcome many of the shortcomings and disadvantages of prior art. The d backpack employs a series of adjustable quick-release straps to provide expandability and Velcro connections for detachability. The backpack employs an internal pleated back pad that is removable to be used as a sleeping pad and in combination with a chevron stitch pattern for added support and user comfort. The backpack also has a closure system for closing the top inner liner of a backpack.

It is an unfortunate but all too common occurrence to have an individual or family be displaced from their home or domicile and become "homeless." When this occurs the individual or family is forced to carry their clothing and personal care items in a mobile storage device. For a displaced veteran the preferred portable storage device is a backpack, which her/him training has taught him/her to utilize for carrying their belongings and life sustaining supplies. There are numerous backpacks available, but few have been constructed with features that are tailored to the homeless. This can be problematic when required to carry all their belongings in a bag that rests against their back with all the weight tethered by straps over their shoulders for long periods of time. Furthermore, the organization formed by the inventor seeks to provide these backpacks loaded with life sustaining supplies free of charge to the displaced veteran, which requires that the backpacks be produced economically.
Prior art backpacks are of numerous shapes and sizes with specialized features for specific tasks, but they are not dedicated to the homeless and most are very costly.
Accordingly, there exists a need for a backpack that is tailored for the homeless individual's needs that is functional, durable and affordable, especially for homeless veterans.


An antenna module according to one embodiment of the present invention, comprises: a coil layer including a wound first coil; a shield layer disposed on the coil layer and including a plurality of sequentially stacked magnetic sheets; and a protection layer disposed on the shield layer, wherein the thickness of an edge of the shield layer is greater than the thickness of the center of the shield layer, and the total separation distance between the plurality of magnetic sheets at the edge of the shield layer is greater than the total separation distance between the plurality of magnetic sheets at the center of the shield layer.

Due to development of wireless communication technology, interest in wireless charging technology for wirelessly supplying power to electronic devices has increased. The wireless charging technology can be applied not only to battery charging of a portable terminal, but also to various types of power supply for household appliances, power supply for electric vehicles and subways, and the like.
General wireless power transmission and reception technology uses the principle of magnetic induction or magnetic resonance. For example, when electrical energy is applied to a transmission antenna of a wireless power transmission device, the transmission antenna can convert electrical energy to electromagnetic energy and radiate the electromagnetic energy to surroundings. Further, a receiving antenna of a wireless power receiving device can receive the electromagnetic energy radiated from the transmission antenna and convert the electromagnetic energy to electrical energy.
In this case, in order to increase power transmission and reception efficiency, it is necessary to minimize energy loss between the wireless power transmission device and the wireless power receiving device. To this end, it is necessary to align the transmission antenna and the receiving antenna within an effective distance. Further, it is necessary to dispose a shield layer around the transmission antenna and the receiving antenna to focus the electromagnetic energy radiated from the transmission antenna in a direction toward the receiving antenna.
FIG. 1 is one example of a wireless charging system.
Referring to FIG. 1, a wireless charging system 1 includes a wireless power transmission device 10 and a wireless power receiving device 20. The wireless power receiving device 20 includes a receiving coil 21, a shield layer 22, and a battery 23, and the receiving coil 21 of the wireless power receiving device 20 can be aligned with a transmission coil 11 of the wireless power transmission device 10.
A magnetic force flux generated between the transmission coil 11 and the receiving coil 21 does not occur uniformly, and can occur slightly at a center portion of the coil and can occur densely at an edge portion of the coil. Accordingly, the magnetic force flux through the shield layer 22 of the wireless power receiving device 20 tends to be concentrated to an edge of the shield layer 22, and accordingly, a load applied to the edge of the shield layer 22 may be greater than a load applied to a center portion of the shield layer 22.
Due to a difference between the load applied to the edge of the shield layer 22 and the load applied to the center portion of the shield layer 22, the power transmission and reception efficiency of the wireless power transmission device 10 and the wireless power receiving device 20 can be lowered.

Antenna module comprising shield layer and wireless power receiving device


A damping bushing for a guide pin of a spot-type disc brake is disclosed, having an elastic pleated cup formed with a first end section fixed to a cylindrical body receiving the guide pin, and also formed with a second end section adapted to be assembled to a ring fixed to the guide pin. The ring has a recess which accepts a torus integral with the second end section The torus (74) is formed with an outer large radius of curvature portion and an inner smaller radius of curvature portion which creates a cam shape. The larger radius portion allows a pleat of the second end section to force the torus over a cone shaped ring end and into the ring recess. The torus then is retained by the smaller radius portion engaging a corner of the recess.

The present invention relates to a damping bushing for cylindrical parts for a spot-type disc brake having.
A damping bushing is known from published German patent application No. 34 12 543. The damping bushing of this publication is composed of two parts including an elastic damping element or guide element and of a stop element coupled to the guide element in a positive locking fit. The elastic guide element presents a substantially cylindrical basic body with projections between which the stop element is arranged. The guide element is seated on a guide pin in a bore of the caliper and projects with a longer axial extension from the bore on one side. An attachment which is relatively short in axial direction is disposed on the other side of the bore. At the point of the short element attachment, dust particles may enter into the bore between the damping bushing and the guide pin.
A pin guide with a dust cover also is known from published German Patent application No. 35 14 497 whose end section is supported in a substantially U-shaped metal ring. The ring and the cup are joined or united in a manual operation.
The invention has, therefore, as an object to provide a damping bushing which is improved in its end section and whose assembly in a ring seated on a pin is simplified and facilitated. It is a further object of the invention to improve a damping bushing in such a manner that dirt is isolated from the bore and from the spaces between the damping bushing and the guide pin. The damping bushing in accordance with the present invention advantageously is of a simple design.


An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a MPU. The laminated capacitor is accommodated within a cavity provided on a wiring board. The capacitor includes a plurality of first external terminal electrodes connected to first internal electrodes via a plurality of first feedthrough conductors and a plurality of second external terminal electrodes connected to second internal electrodes via a plurality of second feedthrough conductors. The first external terminal electrodes provided on a first major surface of a capacitor body are connected to via-hole conductors at the hot side for the power source within a substrate, and the second external terminal electrodes provided on first and second major surfaces are connected to grounding via-hole conductors and a mother board within the substrate.

1. Field of the Invention
The present invention relates to a wiring connection structure of a laminated capacitor and a decoupling capacitor, and a wiring board. The present invention particularly relates to a laminated capacitor that is advantageously applied to a high frequency circuit, and a wiring connection structure of a decoupling capacitor constructed using the laminated capacitor, and wiring boards.
2. Description of the Related Art
Most typical conventional laminated capacitors include a capacitor body having a plurality of laminated dielectric layers having, for example, ceramic dielectrics, and plural pairs of first and second internal electrodes alternately disposed along the direction of lamination of the dielectric layers in opposed relation with each other so as to define a plurality of capacitor units. First and second external terminal electrodes are provided on the first and second end surfaces, respectively, of the capacitor. The first internal electrodes extend onto the first end surface of the capacitor body, where the first internal electrodes are electrically connected to the first external terminal electrodes. The second internal electrodes are also extended onto the second end surface, where the second internal electrodes are electrically connected to the second external terminal electrodes.
In this laminated capacitor, the electric current flowing, for example, from the second external terminal electrode to the first external terminal electrode flows from the second external terminal electrode to the second internal electrode, and arrives at the first internal electrode from the second internal electrode through the dielectric layer, followed by arriving at the first external electrode through the first internal electrode.
The equivalent circuit of a capacitor is represented by a circuit in which C, L and R are connected in series, where C denotes the capacitance of the capacitor, L denotes an equivalent series inductance (ESL) and R denotes an equivalent series resistance (ESR) mainly defined of the resistance R of the electrode.
The resonance frequency (f0) of this equivalent circuit is represented by an equation of f0=1/[2π×(L×C)1/2], which means that the function as a capacitor is lost at a higher frequency than the resonance frequency. In other words, the resonance frequency (f0) becomes high when the value of L, or the value of ESL, is small, to allow the capacitor to be available at higher frequencies. Although copper has been used for forming the internal electrode in order to reduce the ESR value, a capacitor designed to have a low ESR value is required for applying the capacitor in microwave regions.
A low ESR value is also required for the capacitor to be used as a decoupling capacitor, which is connected to a power supply circuit for supplying electricity to a MPU chip (a bear chip) of a microprocessing unit (MPU) for a work station or a personal computer.
FIG. 8 is a block diagram illustrating one example of the wiring connection structure of a MPU 1 and a power source 2 as described above.
With reference to FIG. 8, the MPU 1 includes a MPU chip 3 and a memory 4. The power source 2 is provided to supply electricity to the MPU chip 3, and a decoupling capacitor 5 is connected to the power supply circuit including the MPU chip 3 to the power source 2. A signal circuit is provided in the area from the MPU chip 3 to the memory 4.
The decoupling capacitor 5, which is used in conjunction with the MPU 1, is also used for absorbing noises or smoothing fluctuation of the power source in the same way as conventional decoupling capacitors are used. However, use of a decoupling capacitor having operating frequencies of over 500 MHz and up to 1 GHz have been recently contemplated in a MPU chip 3, which is required to have a function as a quick power supply (a function to supply electric power from the charged electricity of a capacitor within a time interval of several nano-seconds, when electricity is urgently needed for power-up of the system), when a high speed operation is required with respect to the MPU chip 3.
The power source is actually designed so that a DC power of about 2.0 V is supplied to the MPU chip 3 (with an operation clock frequency of about 500 MHz) with a power consumption of about 24 W, or an electric current of 12 A. For reducing power consumption, the system is configured to put the system in a sleep mode when the MPU chip 1 is on alert, thereby reducing the power consumption to 1 W or less. Electric power required for converting the system from the sleep mode to the active mode should be supplied to the MPU chip 3 within a time interval of the operating clock frequency, or the electric power should be supplied to the CPU within a time interval of about 4 to about 7 nano-seconds at an operation frequency of 500 MHz for converting the system from the sleep mode to the active mode.
However, because the supply of the electric power from the power source 2 is too late, the MPU chip 3 has been powered by discharging the electricity accumulated in the decoupling capacitor 5 placed in the vicinity of the MPU chip 3 before the electricity is supplied from the power source 2.
Accordingly, the inductance component has been desired to be as low as possible in the decoupling capacitor 5 for the MPU 1, urging development of a capacitor having a very low inductance value.
Under the conditions described above, a wiring structure of a laminated capacitor that is able to lower the ESL value has been proposed in Japanese Unexamined Patent Publication No. 11-204372.
The ESL value is mainly reduced by offsetting magnetic fields induced by the electric current flowing in the laminated capacitor. Therefore, the electric current is allowed to flow along various directions in the laminated capacitor in order to offset the magnetic fields. For diversifying the current directions, the number of the external terminal electrodes provided on the surface of the capacitor body is increased, or the number of externally exposed terminal tabs of the internal electrodes to be electrically connected to the external terminal electrodes is increased, besides shortening the flow path length of the current flowing through the internal electrodes.
FIG. 9 illustrates a laminated capacitor 11 disclosed in the foregoing Japanese Unexamined Patent Application Publication No. 11-204372 together with an illustration of the cross-sectional structure of a MPU 12 using the laminated capacitor 11 as a decoupling capacitor.
With reference to FIG. 9, the laminated capacitor 11 is provided with a capacitor body 14 including a plurality of laminated dielectric layers 13. At least one pair of first and second internal electrodes 15 and 16 arranged opposite to each other with specified layers of the dielectric layer 13 disposed therebetween are provided within the capacitor body 14.
Both of first and second external electrodes 18 and 19 are provided on the first major surface 17 of the capacitor body 14 extending substantially parallel to the internal electrodes 15 and 16. External terminal electrodes are not provided at all on a second major surface 20 which is opposite to the first major surface 17.
First feedthrough conductors 21, which perforate through specified layers of the dielectric layers 13 so as to provide electrical continuity between the first internal electrodes 15 and the first external terminal electrodes 18 while the electrodes are electrically insulated from the second internal electrode 16, and second feedthrough conductors 22, which perforate through specified layers of the dielectric layer 13 so as to provide electrical continuity between the second internal electrodes 16 and the second external terminal electrodes 19 while the electrodes are electrically insulated from the first internal electrodes 15, are provided within the capacitor body 14.
A plurality of the first and second feedthrough conductors 21 and 22 are provided, and a plurality of the first and second external terminal electrodes 18 and 19 are also provided corresponding to positions of the respective first and second feedthrough conductors 21 and 22.
According to the laminated capacitor 11 as described above, the magnetic fields induced by the electric current flowing through the internal electrodes 15 and 16 offset each other to lower the ESL value, since the directions of the electric current flowing through the internal electrodes 15 and 16 are diversified in addition to the flow path being shortened.
The MPU 12 includes, on the other hand, a multi-layered wiring board 24 having a cavity 23 on the bottom surface thereof. A MPU chip 25 is mounted on the surface of the wiring board 24. The laminated capacitor 11 that defines a decoupling capacitor is accommodated within the cavity 23 of the wiring board 24. The wiring board 24 is mounted on the surface of a mother board 26.
As illustrated in the drawing, wiring conductors required for the MPU 12 are arranged within and on the surface of the wiring board 24, and an electrical circuit as shown in FIG. 8 is completed by these wiring conductors.
A representative example includes hot-side electrodes 27 for a power source and ground electrodes 28 disposed within the wiring board 24.
The hot-side power electrode 27 is electrically connected to the first external terminal electrode 18 of the laminated capacitor 11 through a via-hole conductor 29 at the hot side for the power source, is electrically connected to a specified terminal 31 of the MPU chip 25 through a via-hole conductor 30 at the hot side of the power source, and is electrically connected to a hot-side conductive land 33, which is destined to be in electrical continuity with the mother board 26, through a via-hole conductor 32 at the hot side for the power source.
The ground electrode 28 is electrically connected to the second external terminal electrode 19 of the laminated capacitor 11 through a via-hole conductor 34 for grounding, is electrically connected to a specified terminal 36 of the MPU chip 25 through a via-hole conductor 35 for grounding, and is electrically connected to a conductive land 38 for grounding, which is destined to be connected to the mother board 26, through a via-hole conductor 37 for grounding.
Illustration of the memory corresponding to the memory 4 shown in FIG. 8 is omitted in FIG. 9.
Both of the first and second external terminal electrodes 18 and 19 are located on the major surface 17 of the capacitor body 14 in the laminated capacitor 11 as shown in FIG. 9. For example, if the wiring conductor has a ground potential, then the second external terminal electrode 19 of the capacitor 11 is connected to the conductive land 38 for grounding after passing through the via-hole 34 for grounding, the via-hole conductor 34 for grounding, the ground electrode 28 and the via-hole conductor 37 for grounding in the wiring board 24.
Accordingly, the length of the ground side line determined by the lengths of the via-holes conductors 34 and 37 for grounding, and the length of the ground electrode 28 turns out to be relatively longer so as to increase the inductance component generated around the ground side line. As a result, the effect of using the laminated capacitor 11 designed to have a low ESL value is compromised and reduced. The relatively longer ground side line also causes an increase of impedance.
Increasing of the length of the ground side line as described above also causes the wiring in the wiring board 24 to be very complicated.

Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board


A computing system may include a proxy server application and a database. The proxy server application may provide, to a computing device disposed within a managed network, instructions to identify one or more processes executing on the computing device. The proxy server application may also determine, for a process of the one or more processes, a file system path of a directory associated with the process and, based thereon, select one or more directories to scan for files associated with the process. The computing device may be provided with instructions to (i) scan the one or more directories and (ii) determine a plurality of attributes associated with one or more files discovered therein. The proxy server application may additionally receive results of the scan containing a representation of the plurality of attributes and store, in the database, the results of the scan.

Remote network management platforms allow computer networks to be managed by way of cloud-based devices and services. Advantageously, these architectures simplify the provisioning and operation of managed networks, including computing devices, software applications, and configurational relationships therebetween present in such managed networks. These different aspects of managed networks may be identified by discovery operations carried out across computing devices within the managed network. However, different managed networks may organize the computing devices and software applications found therein in a number of ways. Thus, it may be difficult to predefine discovery operations that are effective for a wide variety of managed networks.

Dynamic discovery of executing applications


An electrical device includes an electrical component encased in encasement material with leads electrically coupled to the component and extending through the encasement material for attachment to an electrical circuit. The leads include an internal region plated with solder for attachment to the component, an external region plated with solder for electrically coupling the component to a circuit board, and an intermediate region between the internal and external regions which is devoid of solder and which is positioned to be in contact with the encasement material to define an unplated interface between the lead and the encasement material. Leads having a center region devoid of solder plating may be formed by providing a lead frame, with selectively plated and punched regions of the lead frame to form the internal and external lead portions, plating the internal and external lead portions with solder and thereafter punching the center unplatted region to provide a plurality of leads having a center unplatted region. Components are thereafter electrically coupled to the solder plated internal portions of the leads on the lead frame with the leads and attached electrical components encased in an encasement material so that the encasement material is in direct contact with the unplatted center region of the leads.

The present invention relates to electrical components and methods for making electrical components and in particular to electrical components with leads having selected regions plated with solder and other regions devoid of solder plating. The regions devoid of solder plating contact an encasement material which encases the electrical component so that voids or spaces in the interface between the encasement material and the leads are not formed when the leads are heated during subsequent soldering.
The problem of flux or wash residue contaminants penetrating a case or housing in which an electrical component is encased is well known. Specifically, such wash residues or fluxes penetrate the encasement through small voids in the interface between the leads and the encasement. Such voids or spaces between the leads and the encasement material can be formed during the solder reflow processes such as wave or hand soldering or board washing operations. If not properly removed, flux or washing residues can enter the interior of the electrical device through such interface spaces causing component failure.
For example, in solder ref low processes, amine-activated water soluble fluxes are used followed by reflow soldering and water rinses. This process can cause small openings between the interface between the lead and the encasement material. During the reflow solder process these small openings provide a path to the interior of the electronic component in the encasement material allowing solder residue contamination and ultimate component failure.
While the mechanism that causes the opening of these paths or voids between the leads and the encasement material is not exactly known, one hypothesis is that the path is caused by capillary action during reflow allowing the plating material on the lead to migrate in the direction of the solder wave thereby leaving small openings at the case-to-lead interface. Another hypothesis is that the heat involved in the solder reflow process causes differential expansion of the encasement material-to-lead interface. After the thermal cycle of heating and cooling, small openings may be left at the interface between the lead and the encasement.
Regardless of the cause, any small openings that accumulate residues are detrimental to the normal performance and life of the particular component. It is therefore desired to eliminate openings between the lead-to-encasement interface during the reflow process to thereby minimize the problem of residues being deposited inside the interface between the lead and encasement.

Electronic components with leads partly solder coated


A method for manufacturing a substrate embedded with a passive device, comprising the steps of (a) molding the passive device and (b) mounting the molded passive device in a cavity formed on the substrate, is disclosed. The substrate embedded with a passive device and the manufacturing method thereof in accordance with the present invention can prevent warpage of the substrate caused by disproportioned properties of materials.

1. Field of the Invention
The present invention is directed to a substrate and a manufacturing method thereof, more specifically to a substrate embedded with a passive device and a method for manufacturing the substrate.
2. Description of the Related Art
Today, packaging substrates are required to improve their performance to keep up with the rapid improvement of performance of semiconductors. Printed circuit boards must essentially be denser, faster and smaller. In the areas of integrated parts, such as semiconductors and thin film devices, particularly, there is heavy research to address these needs. There has been increased demand for high-density recording as well in the area of recording medium such as the magnetic recording head.
The demand for multi-function, high-performance electronic devices necessitates the development of high-density printed circuit boards. Consequently, the demand for printed circuit boards, in which high-density packing is capable, is rapidly increasing in order to satisfy this requirement. Packing an MLCC, for example, can make the printed circuit board much thinner and the surface area much more useful, thereby realizing a higher-density printed circuit board. However, there are a number of technical obstacles in packing this kind of electronic part. It is important to secure the reliability of an electronic part during the packing process and the thermal deformation of a printed circuit board. Inhibiting the warpage of a printed circuit board, in which a hole for packing an electronic part is made, is particularly important for securing the reliability of the electronic part as well as increasing the productivity of the printed circuit board.
Moreover, the parts can be installed in the substrate in order to create space for packing highly-integrated parts. Among the parts installed in the substrate, passive devices such as the capacitor can hold a constant voltage momentarily and consequently maintain a signal formed in the circuit without distorting the signal.
FIG. 1 is a diagram showing a substrate embedded with a multilayer ceramic condenser, in accordance with the prior art. Illustrated in FIG. 1 are a core substrate 30, a through hole 32, tapers 32a, a UV tape 40, an IC chip 20, die pads 22, transition layers 38, filler 41 and press plates 100A and 100B.
A cavity is formed by drilling or laser-processing a copper clad laminate or a pre-preg such that an electronic part can be packed. The electronic part is fixed with a conductive adhesive on a copper coil and then is inserted in the copper clad laminate or pre-preg. With this method, it is not easy to prevent the warpage of the substrate and secure the reliability of the packed chip because the core material of the copper clad laminate is an epoxy type, which can cause warpage by the difference in stiffness and thermal expansion coefficient with the adhesive injected for fixing the chip. This kind of substrate warpage may apply mechanical pressure on the packed MLCC, and cause a reliability problem of the MLCC.


A container with integrated handles provides an alternative to other containers handling materials. In some embodiments, the container includes an outer surface that encloses a cavity; a first face internal to the container; a second face internal to the container; a third face internal to the container; a fourth face internal to the container; an integrated handle including a first aperture disposed in the first face internal to the container and a second aperture disposed in the second face internal to the container and proximate to the first aperture; and an internal support disposed in the cavity, wherein the internal support traverses the cavity of the container to form a handle cavity by extending from the first face internal to the container to one or more faces internal to the container, wherein the internal support includes a handle cavity flap, a first binder flap, and a second binder flap.

Sift Proof Boxes (SPB) are designed to prevent leakage of particulate contents. Generally, the equipment required to erect, fill, and seal SPBs is expensive and complicated. A provider of SPBs generally will not provide other packing formats for free-flowing material. In general, SPBs are created using a full overlap (FOL) design and have become increasingly popular as a consumer package format for dry granules, dry powders, and semi-solids. Regular Slotted Cartons (RSC) require less expensive equipment to erect but require two hands to hold, lift, and pour as the RSCs do not include a single integrated handle. Presently, SPBs require two hands to hold, lift, and pour. An alternative to both glued FOL SPBs and taped RSCs with side handles is needed.

Container for use with transportable materials


A system for safely and humanely anesthetizing and/or euthanizing animals is provided. The system provides both manual and automated operation and may be scaled up to accommodate a large number of animals during a single procedure. The system includes a chamber 20 for receiving an animal to be anesthetized or euthanized and a supply of gas is provided for the chamber, and a fluid controller (65, 165, 265, 365) controls the flow of gas to the chamber. In one embodiment, a valve (75) controls the flow of exhaust air to the chamber.

Frequently, many organizations, such as research organizations need to anesthetize or euthanize animals, such as mice or rats that were used during research. One common way of euthanizing small mammals is to expose the animals to CO2 in an enclosure. However, frequently, the procedure is done by untrained individuals so that the animal unnecessarily suffers during the procedure. Additionally, frequently, untrained individuals may not understand the quantity of CO2 that can leak into the room if the procedure is performed incorrectly. At best such leakage leads to a waste of compressed CO2, at worst, it can create a health problem for those in the vicinity.

Method and apparatus for euthanizing animals


A rapid liquid phase deposition (LPD) process of coating a substrate provides improved deposition rates. The LPD process may include the following steps: incubation of acids with corresponding oxides, sulfide, or selenide for a predetermined period of time; removing the undissolved oxides, sulfide, or selenide; liquid phase deposition of the oxide, sulfide, or selenide film or coating at an elevated temperature; and removing the substrate from the growth solution. Further, the growth solution can be prepared for re-use by cooling to a desired temperature and adding extra oxides, sulfides, or selenides.

There are various methods used to grow inorganic materials onto a substrate that are well-known in industry. For example, growth processes such as chemical vapor deposition (CVD), sol-gel, and liquid phase deposition (LPD) may be utilized to grow inorganic materials on a substrate. For example, U.S. Pat. No. 7,718,550 to Barron et al. granted on May 18, 2010 discusses low temperature growth of inorganic materials.
Solar cells may provide several layers of inorganic materials, such as a light-absorption, electrodes, light-responsive, and anti-reflective layers. Films or coatings including, but not limited to, SiO2, TiO2, ZrO2, In2O3, SnO2, BaTiO3, ZnS, Bi2Se3, and/or the like may be utilized in solar cells. LPD provides a low cost process for depositing films or coatings. However, LPD can be further improved with increase deposition, further simplification, and/or reusability of the growth solution.

Systems and methods for rapid liquid phase deposition of films


An identification bracelet for mounting about a person's wrist or the like incorporates a sealable window to protect wearer-related information against contact with moisture and the like. The bracelet includes a flexible band defining an information-bearing zone, in combination with an overlying adhesive-backed transparent cover strip. In an initial state, the cover strip has opposite ends securely adhered to the band, and a central window segment separated from the band by a peel-off release film. The window segment is adapted for lift-away separation from the band as by tearing along a line of weakness line at one end thereof to expose the information-bearing zone for receiving wearer-related information, and for facilitated peel-off removal of the release film, followed by adhesively seating the strip central window segment onto the band in a manner defining a sealed perimeter overlying and protecting the wearer-related information.

This invention relates generally to improvements in identification appliances such as wristbands and the like for mounting onto a specific person or object, and for carrying information associated with the specific band wearer. More particularly, this invention relates to an improved identification bracelet having a sealable window for overlying and protecting wearer-related information applied to or carried by the bracelet against contact with moisture and the like for an extended period of time, wherein such moisture contact could otherwise interfere with or adversely impact human and/or machine reading of the wearer-related information.
Bracelet-type identification appliances such as wristbands and the like are commonly worn by individual patients in a hospital or other medical facility. The identification bracelet normally carries certain human-readable patient identification information such as patient name, room number, patient identification (ID) number, etc., wherein this identification information can be printed directly onto the bracelet, or otherwise applied to a card, tag or label that is affixed to or suitably carried by the bracelet. In addition, a variety of machine-readable information may be similarly applied to or carried by the bracelet, such as bar code information which may duplicate the human-readable patient identification information but may also include selected patient condition information. In recent years, such identification bracelets have also incorporated radio frequency identification (RFID) circuits having the capacity to receive and store significant patient medical history in addition to patent identification and condition information. Such identification bracelets have also been used in a wide range of non-medical environments.
Moisture contact with the wearer-related information carried by the identification bracelet can interfere with and thereby prevent accurate reading thereof by human or automated means. In this regard, some bracelet designs have incorporated a transparent window element to overlie and thereby provide some protection for wearer-related information visible through the transparent window. For example, U.S. Pat. Nos. 4,221,063; 4,285,146; 4,318,234; 4,386,795; and 5,581,924 depict a bracelet wherein a transparent window element cooperates with an underlying band to define a small slotted pocket for slide-fit reception of a card, tag or label having the wearer-related information printed thereon and viewable through the window element. However, many of these bracelet designs provide only limited protection, and, more specifically, are not sealed against water intrusion upon immersion of the bracelet as may occur, for example, during bathing.
Alternative bracelet configurations have been proposed wherein the transparent window element is backed with a transparent, typically pressure-sensitive adhesive layer. See, for example, U.S. Pat. Nos. 3,197,899 and 6,546,656 which depict the transparent window element adhesively positioned over an information-bearing zone or region formed on or carried by an underlying flexible band. The transparent window element is initially adhered at one end to the underlying band and thus comprises a movable flap that can be lifted to expose the information-bearing zone, and further to permit a peel-off film to be removed from the flap before downward displacement into adhered relation with the band in a position overlying the information-bearing zone. Hermetic sealing of the periphery of the information-bearing zone, however, is at best limited to provide minimal protection against water intrusion. In addition, in these bracelet designs, the movable flap is incompatible with convenient and economical manufacturing methods particularly such as producing a plurality of ready-to-use bracelets in a snap-apart or break-apart sheet form. Moreover, the transparent window element in these designs is combined with fastener means for adhesively mounting the bracelet about the wearer's wrist or the like, resulting in a complex bracelet construction with limited inherent variable size adjustment capability.
U.S. Pat. No. 5,740,623 describes another alternative bracelet construction including a tubular band formed from transparent plastic, and defining an internal pocket for slide-fit reception of an information-bearing card, tag or label, with a connector element provided for press-fit reception into the opposite ends of the band to form and retain the band into a closed loop configuration wrapped about a person's wrist or the like. While this bracelet design may provide improved hermetic protection against ingress or moisture or other liquids into contact with the information-bearing card or the like, the tubular band construction does not provide inherent size adjustment capability. In addition, the tubular band construction is also not susceptible to convenient and economical manufacturing methods particularly such as producing a plurality of ready-to-use bracelets in snap-apart or break-apart sheet form.
There exists, therefore, a significant need for further improvements in and to identification bracelets of the type used in a medical facility and the like, particularly wherein a transparent window element is mounted onto an underlying flexible band in a manner conducive to economical manufacture in multi-bracelet sheet form, and further wherein a transparent window element is adapted to overlie and hermetically seal underlying wearer-related information against contact with moisture and the like. The present invention fulfills these needs and provides further related advantages.

Identification bracelet with sealable window


The present disclosure relates to a quantum dot light-emitting layer, a quantum dot light-emitting device and preparing methods therefor and belongs to the field of liquid crystal display. The preparing method for a quantum dot light-emitting layer includes: placing a first halide AX and a second halide BX2 in a solvent; stirring and dispersing the reaction system formed by the first halide AX, the second halide BX2 and the solvent at a set temperature for a set time period; cooling the reaction system at a cooling rate of 0.1° C./24 h-1° C./24 h to generate an A4BX6 single crystal thin film containing ABX3 quantum dots, and using the A4BX6 single crystal thin film containing ABX3 quantum dots as the quantum dot light-emitting layer; wherein A includes one of Cs+, CH3NH3+ and HC(NH2)2+; B includes one of Pb2+ and Sn2+; and X includes one of Cl−, Br− and I−.

The metal halogen perovskite material refers to a metal halide having a perovskite structure, and due to the characteristics such as an obvious quantum confined effect, a relatively high fluorescence quantum yield, and a uniform size, etc., the metal halogen perovskite quantum dots based on the metal halogen perovskite material have attained extensive attention in the field of optoelectronic applications.
In the related art, a perovskite CH3NH3PbI3 polycrystalline thin film is synthesized by sequentially depositing PbI2 and CH3NH3I on a nano-polyporous titanium dioxide thin film through a two-step solution spin coating method, and is used as a quantum dot light-emitting layer in a quantum dot light-emitting diode. Alternatively, the metal halogen perovskite quantum dots are combined with a polyethylene oxide polymer to form a thin film containing the metal halogen perovskite quantum dots.

Quantum dot light-emitting layer, quantum dot light-emitting device and preparing methods therefor


An illumination device includes a box body, a LED module, and a light homogenizing plate. A variety of different color temperatures are set in different chips controlling the LEDs in the LED module. The homogenizing plate converts light, such that the illumination device can generate light beams of various color temperatures. The test requirements applicable to different lenses or in relation to different color temperatures of the same lens at different periods can thus be met.

Optical lenses are widely used in mobile phones, tablet computers, cars, and camera modules of other terminal devices. After the optical lenses are manufactured, the optical lenses must be tested in order to ensure a photographic quality of the optical lenses.
Existing optical test equipment can only emit light beams with a single color temperature, and thus cannot be used to test different optical lenses or different color temperatures of the same optical lens.

TRIPLE WIN TECHNOLOGY(SHENZHEN) CO. LTD.


Systems and methods are disclosed for providing direct style sheet editing. The disclosed systems and methods may include selecting a first target rule for a next formatting operation. The selected first target rule may include a modified property and may be selected from a plurality of target rules. Furthermore, the disclosed systems and methods may include enabling property changes to occur in a most specific target rule in the plurality of target rules. The most specific target rule may contain the modified property. Moreover, the disclosed systems and methods may include providing a highlighting mechanism configured to allow a user to see which regions of a page are to be affected by the selected first target rule.

A style sheet is a master page layout used in document creation systems such as word processing, desktop publishing, and the Internet. The style sheet is a file that is used to store margins, tabs, fonts, headers, footers, and other layout settings for a particular category of document. When a style sheet is selected, its format settings are applied to all the documents created under it, saving the page designer or programmer from redefining the same settings over and over again for each page.
Cascading style sheets (CSS) defines a visual formatting model used for laying out, for example, extensible markup language (XML) or hypertext markup language (HTML) elements. In this model, every element is laid out using a visual "box model." As shown in FIG. 4, a box model 400 includes a plurality of boxed elements comprising a margin 405, a border 410, a padding 415, and a content 420 that together allow the flexible layout of the boxed elements. Moreover, every edge for each boxed element in box model 400 is given a CSS property (e.g. "margin-left" or "padding-top".) For example, using box model 400, a paragraph can be indented by giving it a left margin.
Another aspect of the visual formatting model are the CSS position schemes that define a set of positioning modes that use the offsets "top", "right", "bottom", "left", "width" and "height" to position boxed elements on a page. Using one of the positioning schemes, such as "absolute", a boxed element can be position at the very top-left of the positioning container using "top: 0; left: 0;", for example.
In some situations, editing box model properties is limited to manual code editing or form user interface (UI.) Thus, the conventional strategy is to directly edit the associated CSS box model properties. This often causes problems because the conventional strategy requires a manual non-visual process. For example, the conventional strategy forces designers to tediously edit the page layout in one UI and then switch to a preview mode to observe the edit's effect.
In view of the foregoing, there is a need for methods and systems for providing direct style sheet editing more optimally. Furthermore, there is a need for providing direct style sheet editing using, for example, a style application toolbar.

Methods and systems for providing direct style sheet editing


A bag clip comprising first and second elongate jaw portions defining front and back ends and inner and outer surfaces. Extending between and interconnecting the first and second jaw portions intermediate the front and back ends thereof is a first spring portion which is operable to bias the front ends toward each other. The clip further comprises an elongate second spring portion which is attached to the front end of the second jaw portion and extends inwardly toward the first spring portion in cantilevered relation to the inner surface of the second jaw portion. The second spring portion is operable to bias the front end of the second jaw portion toward the front end of the first jaw portion.

Currently, a number of prior art clamping devices are sold in the marketplace which are used for purposes of maintaining bags containing chips, pretzels and similar snack food items in a closed state after such food containment bags have been opened and only a portion of the contents consumed. One such prior art clamping device which is widely marketed under the trademark "CHIP CLIP" comprises a pair of jaw members which include handle portions formed thereon and are operatively connected to each other via a torsion wire spring. The spring biases the jaw members into abutting contact with each other, thus maintaining the bag in a closed state when the open end thereof is inserted between the jaw members. The compression of the handle portions of the jaw members toward one another overcomes the biasing force exerted by the spring, thus separating the jaw members and allowing the bag to be inserted or removed from therebetween.
Though this particular clamping device and others which are similarly structured are generally suitable for maintaining bags in a closed state, such devices possess certain deficiencies which detract from their overall utility. In this respect, the torsion wire spring typically incorporated into these prior art devices loses resiliency over time, thus allowing the device to be easily dislodged from the open end of the bag due to a decrease in the biasing force exerted by the spring. This loss of spring resiliency is accelerated when the jaw members are maintained in an open position for prolonged periods. Additionally, the materials used to fabricate the jaw members of the clamping device are prone to fatigue, and typically crack or completely rupture after repeated uses of the device. Further, due to the fabrication of these prior art clamping devices with independent jaw members interconnected by a separate torsion wire spring, the spring is oftentimes dislodged or disconnected from one or both of the jaw members, thus rendering the device unusable. Finally, since these prior art clamping devices incorporate only a single biasing member or spring, the biasing force exerted by the jaw members on the open end of the bag is limited, thus not ensuring that the bag is maintained in a tightly closed state. The present invention overcomes these and other deficiencies associated with prior art bag clamping devices by providing a bag clip incorporating a pair of biasing spring portions for added resiliency over prolonged periods of time.


A memory module having an address mirroring function is provided. The memory module includes a register that allows mode registers of first memory chips of a first rank and mode registers of second memory chips of a second rank to be identically programmed in response to a mode register set (MRS) command during a rank-merged test mode. The register sets address signals, which are symmetrically connected to the first and second memory chips through through-via-holes (TVHs) or blind-via-holes (BVHs) of a printed circuit board, to be selectively mirrored.

The inventive concepts described herein relate to memory modules, and more particularly, to memory modules that perform an address mirroring function to reduce test time.
In a data processing systems such as personal computers (PCs), server computers, workstations, or communication systems, module-type memories may be used as data storage memory. In view of the demand for high capacity, high density, and high performance, there has been a trend toward providing data processing systems with high capacity memory modules. However, an extended amount of time is required to test high capacity memory modules, thereby lowering productivity. Accordingly, there is a desire to provide memory module that may reduce required test time.

Memory module having address mirroring function


A decorating article set includes a decorating article and a decorating article holder. The decorating article holder includes a holding element and a connecting member. The holding element has a securing cavity and is arranged to be securely attached on a decorating surface. The connecting member is configured from a material which is the same as that of the decorating article, and is secured in the securing cavity, and arranged to be connected to the decorating article. The decorating article is secured on the decorating surface through the holding element and the connecting member.

1. Field of Invention
The present invention relates to a decorating article set, and more particularly to a decorating article set which comprises a decorating article holder which is capable of securely mounting a glass or crystalline decorating article on a decorating surface.
2. Description of Related Arts
A conventional decorating article such as a glass decorative sphere is usually mounted on an object for decorating purpose. For example, a glass decorative sphere may be mounted on a top surface of a decorating column which is erected at a specific position for providing decoration. A wide variety of glass or crystalline decorative spheres and decorating columns have been developed in the market.
A deep-seated problem for the above-mentioned decorating article and decorating column is that it is rather difficult to mount the decorating article on the decorating column. Take a glass decorative sphere as an example. A glass decorative sphere usually has a top spherical portion and a flat supporting surface formed as a bottom surface of the glass decorative sphere. Some sorts of adhesive agents, such ultraviolet (UV) light curing adhesive, are commonly used to adhere the glass decorative sphere onto the decorating column, which is typically made of wooden, plastic or metallic material. Since the glass decorative sphere is generally very heavy, the bonding strength provided by the adhesive agent may not be strong enough and the glass decorative sphere may accidentally detach from the decorating column. The reason for this adhesive failure is due mainly to the fact that conventional adhesive agents are generally incapable of providing reliably strong bond between a glass or crystalline decorating article and a decorating column which is configured from a material other than glass or crystalline, such as wood.
As a result, there is a need to safely and reliably mount a decorating article on a decorating surface.


A grain combine threshes grain from crop and deposits the grain in a grain bin. A discharge conveyor is mounted to the grain bin. At the distal end of the discharge conveyor is a discharge for expelling the grain. A telescopic, secondary unloader which is smaller than the discharge conveyor is located immediately below the discharge. The secondary unloader may be variably extended beyond the end of the discharge, or retracted when it is not in use. The secondary unloader is divided into grain conveying and paddle return sections which are formed from a partition which extends along the length of the secondary unloader. Paddles are provided in each section and are joined to a continuous flexible linkage mounted around sprockets. The secondary unloader uses hydraulic cylinders to extend and retract. When the secondary unloader is retracted, it is recessed inward from the distal end of the discharge conveyor which operates in a conventional manner by discharging grain from the discharge. When the secondary unloader is in an extended position, the reach of the discharge conveyor is extended by the length of the secondary unloader. In the extended position, grain is expelled from the discharge and falls into the grain conveying sections at the proximal end of the secondary unloader. The secondary unloader then conveys the grain to its distal end where the grain is expelled.

Prior art methods of unloading grain from the grain bin of a combine or a similar piece of agricultural equipment usually involve providing an unloading chute with the grain bin. The unloading chute typically has an intake located at or near the bottom of the grain bin so that grain is continuously removed even as the level of the grain drops within the grain bin. A screw-type grain auger or grain conveyor is typically used and housed within the unloading chute to convey the grain up and away from the grain bin onto the grain bed of a truck or trailer. Generally, prior art grain unloaders may be pivotally rotated from a storage position alongside the grain bin to a discharge position away from the grain bin.
The distance from the distal end of the unloader to the bin is fixed. There are a number of problems associated with fixed-length unloaders. If the length of the unloader is too short, it is difficult to position the truck bed under the distal end of the unloader, particularly if the combine continues cutting grain while unloading. If the length of the unloader is too long, the unloader is difficult to store during nonuse. Also, in rough grain fields, the extreme twisting and vibration encountered during use is amplified along the length of unloaders, thereby increasing the risk of danger and premature failure.


An inductive component is disclosed. In an embodiment, the inductive component includes at least one electrical conductor, a coil former with a hollow-shaped winding former, for being wound with the at least one electrical conductor, and a magnetic core, which is arranged in a cavity of the winding former. The at least one electrical conductor is surrounded by a potting material. The potting material has no directly adherent contact with the magnetic core so that the magnetic core is decoupled from the potting material.

An inductive component, for example, a transformer, comprises a magnetic core, around which a coil is arranged. The coil may comprise a coil former on which electrical conductors are wound. In order in the case of such an inductive component, in particular a component of a small structural form, to ensure a sufficient degree of high-voltage resistance, the coil and the magnetic core may be accommodated in a housing and surrounded by a potting material, so that the electrical conductors, the coil former and the magnetic core are completely embedded in the potting material.
On account of the different temperature behavior, in particular the different coefficients of thermal expansion, of the magnetic core and the potting material, when there are temperature fluctuations mechanical stresses may occur in the potted assembly. Even with small temperature fluctuations, the magnetic and electrical parameters of the material of the magnetic core may change on account of the mechanical stress occurring in the core material, so that there is the risk of the inductive component no longer conforming to a required specification. With greater temperature fluctuations, the magnetic core, for example, a ferrite core, which is sensitive to material stresses, may be damaged or destroyed.


A case for maintaining insignia and other articles associated with a uniform includes an outer cover and an inner surface, and is configured to fold about a center fold. The case includes an inner panel for attaching and carrying uniform articles and an inner pouch for carrying loose items. The flap and the pouch are each attached along one side to the inner surface of the case near the center fold. The case has a plurality of inner attachment surfaces, which includes the inner surface of the case, the side surfaces of the panel, and the outer surfaces of the pouch. At least one of the attachment surfaces includes a section having hook and loop fasteners to engage uniform badges having hook and loop fasteners. Additionally, at least one of the attachment surfaces includes foam backing configured to receive at least one uniform pin.

Uniforms are used in conjunction with numerous trades and professions. Many, if not all, uniforms must be cleaned or laundered in some fashion. Additionally, numerous uniforms have articles associated therewith, requiring removal of the articles before cleaning or laundering the uniform. Often times the articles removed from the uniform include badges, pins, and/or loose items such as coins, etc. There remains a need for an organized way to maintain the articles removed from a uniform. Additionally, there remains a need for an apparatus to secure and maintain the removed articles in an organized manner.

Case for maintaining insignia and articles related to uniform


A multipurpose drawing tool is provided. One embodiment of the tool that is advantageous for drawing circles one-handedly includes a protractor portion and an elongated radius arm portion. The protractor portion includes an aperture, and a securing member is rotatably mounted in the aperture. The securing member may be a transparent or translucent suction cup for releasably attaching the tool to a drawing surface such as a vertically-oriented dry-erase or chalk board. Alternatively, the securing member may be a transparent or translucent magnet or a conventional magnet configured with a generally annular or toroidal shape. In another embodiment, an improved protractor is provided that includes a straightedge portion, a semicircular portion, a pivot arm and a suction cup or magnet securing member that pivotally secures an end of the arm to a central portion of the straightedge portion.

There are numerous well-known drawing tools available for drawing circles, drawing and measuring lines, constructing and measuring angles, and producing geometric constructions and patterns. Generally, these devices do not provide clearly visible, direct views of vertex points through an open pivot point for drawing circles, constructing and measuring angles, and producing geometric constructions and patterns. Rather, the user must approximate the positioning of the device over the vertex point, impairing the accuracy of the positioning of circles drawn with the device, or the accuracy of the construction and measurement of angles.
One device for drawing circles that provides a clear view of vertex points through a pivot point is disclosed in U.S. Pat. No. 6,606,792, issued Aug. 13, 2003 to Stoneberg for "Drawing Tool." The disclosed drawing tool includes a protractor portion at one end and an elongated radius arm portion extending therefrom, with a pivot disc rotatably mounted in the tool proximate the protractor portion. The radius arm rotates about the pivot disc that includes an open circular pivot point for sighting a vertex point. Although this drawing tool has enjoyed substantial commercial success, use of the tool has been somewhat limited to drawing and measuring on horizontal surfaces such as desks, overhead projectors and the like because a user must continuously press down on the pivot disc when drawing a circle to keep the tool aligned with the vertex point.
Due to the ubiquity of drawing surfaces such as, for example, vertically-oriented dry-erase or "white" boards, vertically-oriented chalk or "black" boards and horizontal surfaces such as overhead projectors and the like, in educational/classroom and workplace settings, an improved drawing tool that facilitates drawing circles in a one-handed manner would be an important improvement in the art.


A film-coated extended release oral dosage composition containing the nasal decongestant pseudoephedrine sulfate in a unique polymer matrix core and a film-coating on such core containing the non-sedating antihistamine, loratadine, and use of the said composition for treating patients showing the signs and symptoms associated with upper respiratory diseases and nasal congestion are disclosed.

This invention relates to a film-coated extended release oral dosage composition containing the nasal decongestant pseudoephedrine in a unique polymer matrix core and a film-coating on such core containing the non-sedating antihistamine, loratadine. The oral dosage composition is useful for treating patients showing the signs and symptoms associated with upper respiratory diseases and nasal congestion.
Loratadine is disclosed in U.S. Pat. No. 4,282,233 as a non-sedating antihistamine and it is useful as an anti-allergy agent in, for example, the treatment of seasonal allergic rhinitis symptoms such as sneezing and itching.
Pseudephedrine as well as pharmaceutically acceptable acid additional salts, e.g., those of HCl or H.sub.2 SO.sub.4, is a sympathomimetic drug recognized by those skilled in the art as a safe therapeutic agent effective for treating nasal congestion and is commonly administered orally and comcomitantly with an antihistamine for treatment of nasal congestion associated with allergic rhinitis. For example, 5 mg of loratadine and 120 mg of pseudoephedrine sulfate ("PES") in a matrix core repetab tablet product is available wherein the PES is equally distributed in the tablet coating and barrier core and all the loratadine is in the coating. The product is recommended for twice-a-day dosing for effectiveness. It would be desirable to have a once-a-day loratadine-pseudoephedrine product.
The successful development of a formulation of a loratadine-pseudoephedrine once-a-day product requires achieving a release rate profile for pseudoephedrine component over an extended period in excess of twelve hours while maintaining the safety and effectiveness of loratadine. Products containing non-sedating antihistamines in combination with pseudoephedrine such as Seldane-D, a press-coated product of terfenadine and pseudoephedrine and Hismanal-D, a combination of pseudoephedrine prills and a separate astemizole tablet are known. However, the administration of terfenadine and astemizole products to humans has been found to cause adverse effects including cardiac arrhythmias and occurrence of these arrhythmias have increased when the terfenadine or astemizole products are co-administered with other drugs such as ketoconazole and erythromycin or upon overdose of the non-sedating anti-histamine.
It would be desirable for increased patient compliance to have an extended release product effective and safe when used on a once-a-day basis.

Stable extended release oral dosage composition comprising loratadine and pseudoephedrine


A semiconductor device and a method of manufacturing a semiconductor device includes the steps of forming a first conductivity type layer on one surface of a work piece comprising a semiconductor substrate. A gate oxide is formed on the surface of the substrate. A first conductive structure is formed on the gate oxide consisting essentially of polysilicon. An insulating structure is formed in contact with the first conductive structure. Material is removed from the surface of the first conductive structure to expose at least a portion of the surface of the first layer, and to form on the remaining structure on the workpiece a second conductive structure consisting essentially of polysilicon. The polysilicon is in electrical contact with the first conductive structure. Thus, a compound conductive structure is provided on the work piece.

1. Field of the Invention
This invention relates to semiconductor devices and more particularly to an improved conductor structure.
2. Description of Related Art
A buried bit line ROM cell is by far the most competitive ROM structure of high density ROM memories because it is contactless and hence the cell size is smaller. The dimension of a cell is determined mainly by the pitches of the word line polysilicon structures employed to connect to the cells and the buried N+ bit lines. When the cell dimension shrinks, the buried bit line N+ doping needs to be reduced to avoid the problem of short channel punch through.
A device made with the low N+ concentration produced by the reduced level of doping is sensitive to the counter doping from P- type (boron) doping for programming in the channel region.
The boron implantation with a dose >1.times.10.sup.14 /cm.sup.2 in the channel area for programming also goes into the source/drain buried N+ area with an As+ implantation dose of about 1.times.10.sup.15 /cm.sup.2, which increases source/drain capacitance. Low buried bit line resistance is important because every cell will have a different bit line resistance to metal pick up contact (low resistance metallic line in contact with the contact opening.) For example, there will be one contact for every 32 cells.
FIG. 1 shows a plan view of a semiconductor device and FIG. 2 shows a sectional view of that device taken along line 2--2 in FIG. 1. For a certain design rule, the minimal opening for ROM code implantation is the same as channel area 10 in a semiconductor substrate 9 shown in FIGS. 1 and 2 where 10 is the channel area and the word line 11 is formed of polysilicon or polycide, in accordance with the state of the art and buried bitlines 14 and 14' are at right angles to word line 11.
The cross section along the direction of word line 11 taken along line 2--2 in FIG. 1 is shown in FIG. 2. The word line 11 crosses over the SDOX (Source/Drain Oxide) layer 12. The SDOX layer 12 is grown over an N+ implant area during gate oxide oxidation. SDOX layer 12 is thicker (between about 600 .ANG. about 1500 .ANG.) than the gate oxide (about 200 .ANG.) and the channel area 10 composed of a gate oxide over P- well (P- sub) area. The bit lines 14, 14' (source/drain) doped with N+ ions lie beneath the SDOX layer 12. The source and the drain regions can be interchangeable. The source and the drain are bit lines also.
Photoresist layer 15 has been added to the structure and patterned in the usual photolithographic fashion. The openings 16 are above the channel areas 10 and the boron B+ ions are implanted in subchannel area 18 beneath the channel area 10.
The implanted boron plus lateral diffusion from both the N+ area and the channel boron area results in lower N+ concentration near the source/drain edge 99 as shown in FIG. 2, which in turn, results in higher N+ resistance. Also, the formation of N+/P+ junctions (P+ represents boron doping in channel area) results in high source/drain junction capacitance (C.sub.j.) All the factors of high sheet resistance (high Rs of N+) and high junction capacitance,( high C.sub.j of N+/P+) are the challenges for high speed design of buried bit line ROM products. Note that R.sub.s (sheet resistance) as employed herein refers the value of diffused resistance per unit square of a buried bit line. The unit of R.sub.s is ohms per square. As employed herein, junction capacitance (C.sub.j) refers to source/drain to substrate junction capacitance.)
FIG. 3 is a plan view showing a region of the P+ layer 30 within a ROM opening 31 framed by the bitlines 14 and 14' and within the upper word line 11.
FIG. 4 shows a section taken along line 4--4 in FIG. 3 with the P+ layer illustrated beneath the channel area 13.
An object of this invention is to make the ROM code implantation (boron for this case) into the center part of the channel area, which can achieve the goals of enhancing programming (turning the transistor off) and preventing the P+ layer from encroaching upon or contacting with the N+ source/drain junction.


A semiconductor light-emitting device includes: a package substrate having a mounting surface on which a first circuit pattern and a second circuit pattern are disposed; a semiconductor LED chip mounted on the mounting surface, having a first surface which faces the mounting surface and on which a first electrode and a second electrode are disposed, a second surface opposing the first surface, and side surfaces located between the first surface and the second surface, the first electrode and the second electrode being connected to the first circuit pattern and the second circuit pattern, respectively; a wavelength conversion film disposed on the second surface; and a side surface inclined portion disposed on the side surfaces of the semiconductor LED chip, providing inclined surfaces, and including a light-transmitting resin containing a wavelength conversion material.

Apparatuses and methods consistent with exemplary embodiments relate to a semiconductor light-emitting device.
A semiconductor light-emitting diode (LED) is an element containing semiconductor materials which, when electrical energy is applied thereto, emits light through electron-hole recombination due to the application of electrical energy. The LED is widely being used as a light source of general lighting devices and a backlight unit of large-scale liquid crystal display (LCD) devices, and accordingly, the development thereof is currently being accelerated.
In general, LEDs may be provided as light-emitting devices packaged in a variety of forms to be easily provided in application devices. In the process of packaging such LEDs, disadvantageous effects such as deteriorations of light emission efficiency or increase in color deviation may occur in a product due to light loss and total internal reflection caused by other components.


A cleaning device for cleaning a screen plate used in a screen printing is disclosed. The cleaning device comprises a base structure which can be placed just below the screen plate. A press member, such as a cleaning blade or cleaning roller is carried on the base structure The press member has a contact portion which contacts a lower surface of the screen plate to scrape off any foreign things from the lower surface when the base structure is moved in a direction parallel with a major surface of the screen plate. In some embodiments, a cleaning paper wet with a solvent is intimately put between the contact portion of the press member and the lower surface of the screen plate to promote the cleaning effect.

1. Field of the Invention
The present invention relates in general to screen printings and more specifically to a device for cleaning a screen plate used in the screen printing.
2. Description of the Prior Art
For printing electric circuit patterns on an insulating base board, a so-called "screen printing" has been hitherto used. The printing system employed in this printing comprises generally a screen plate (or mesh screen plate) which is put on an insulating base board to be printed, and a squeegee (viz., ink squeezing device) which runs on the screen plate while squeezing a given amount of viscous conductive ink onto the screen plate and pressing the screen plate against the insulating base board. With this, a desired circuit pattern of the conductive ink is printed on the surface of the insulating base board, which pattern coincides with a perforated print pattern defined by the screen plate. The base board thus printed is then removed from the screen plate and heated for fixing the printed circuit pattern. The screen plate is constructed of a stainless steel mesh or the like.
For improving the quality of the printed pattern on the base board, it is necessary to clean the screen plate at certain intervals. Hitherto, various cleaning devices have been proposed and put into practical use for such purpose. However, due to their inherent constructions, some of them fail to exhibit a satisfied cleaning effect and some are costly

Device for cleaning screen plate used in screen printing