A modular guide frame for use with gates of various thicknesses is assembled from separate side portions. The side portions are provided with hubs, having facets of different widths. The hubs may be coupled with one another to align the facets and provide different gate guide configurations, having various channel widths. An extension plate may be coupled between the side portions to further expand the width of the channel. Elongated sealing members may be secured within the channel to further customize the fit between the guide frame and a gate. The symmetrical nature of the side portions allow them to be manufactured from a single extrusion form, while retaining the ability to be used with one or more differently sized gates.

1. Field of the Invention
The present invention relates to guides for sliding gates and more particularly to a modular guide frame that may be easily adapted for use with gates having different or slightly irregular thicknesses.
2. Description of the Related Art
Simple mechanical gates, such as slide gates, stop gates and weir gates have been used for countless years in fields such as agriculture, municipal water systems, wastewater systems, and the like. Such systems are typically comprised of a single, planar gate that slides between open and closed positions within an elongated guide or channel, which is shaped to conform to the shape and size of the gate. These gates and their guides have been previously fabricated from numerous different materials, including wood, steel, galvanized steel, extruded aluminum, reinforced polymers, and the like. Clearly, one of the most common methods of fabricating such a system is to prepare a gate, having a particular size and shape, and then fabricating a gate guide to fit the gate. The gate guide may be provided in the form of one or more elongated, one-piece channels that may be cut to size and reconfigured into a particular shape that will slidably receive the gate. The gate guide may then be mechanically secured in position or imbedded within concrete or other suitable material, depending upon the particular application.
However, a problem frequently encountered in the assembly and installation of a gate system occurs when a gate is selected that has an uncommon or slightly irregular thickness. In these instances, pre-fabricated gate guide materials may provide a channel width that is too broad to provide an adequate sealing engagement between the gate and the gate guide, or the channel may be too narrow, preventing the gate from being received within the gate guide. In either situation, the installer is forced to custom fabricate a gate guide to adequately receive the gate, if a new gate, having standard dimensions cannot be used. Unfortunately, custom fabricating gate guides can be costly and time consuming. This is especially true in large-scale settings that require a plurality of gates having one or more unique gate sizes or configurations.
Accordingly, what is needed is a modular gate guide frame that may be fabricated using efficient, extrusion methods while being quickly and easily adapted for use with one or more gates having unusual or slightly irregular dimensions.


An organic electroluminescence device having an improved performance and a compound represented by formula (1), which is a novel material that enables the organic electroluminescence device:

In general, an organic electroluminescence device (organic EL device) includes an anode, a cathode, and organic layers interposed between the anode and the cathode. When a voltage is applied between both electrodes, electrons from the cathode side and holes from the anode side are injected into a light emitting area, and the injected electrons and holes are recombined in the light emitting area to generate an excited state. Then, when the excited state returns to a ground state, light is emitted. Accordingly, development of a compound by which electrons or holes are efficiently transported to a light emitting area and recombination of the electrons with the holes is promoted is important in obtaining a high-performance organic EL device. Also, in recent years, with the further spread of smart phones, organic EL TVs, and organic EL lightings using organic EL devices, there is a demand for a compound that satisfies both a high efficiency and a sufficient device life.
For example, Patent Literatures 1 to 6 discloses an aromatic amine compound used in an organic EL device.

Compound, material for organic electroluminescence device, organic electroluminescence device, and electronic device

Abstract: wherein, X, Ar1 to Ar5, R1 to R20, *a, and *b are the same as those defined in the specification.


A movement-amount-estimation device includes an edge-removal unit to generate a first edge-removed image by removing from a first edge-image a first-removal-target edge by on a change in brightness indicated by edge intensity in a direction from an inner side to an outer side of a mobile body, the first edge-image being generated from a first image taken by an imaging device mounted on the mobile body, and to generate a second-edge-removed image by removing from a second edge-image a second-removal-target edge by the change in brightness indicated by the edge intensity in the direction from the inner side to the outer side, the second edge-image being generated from a second image taken at a different clock time than the first image; and an output unit configured to output a movement amount of the mobile body that is estimated based on the first edge-removed image and the second edge-removed image.

There has been known a technology for mounting a camera configured to image the outside on a mobile body such as a vehicle, taking a picture of the surroundings including a road surface, and estimating a movement amount of the mobile body from a movement amount of a pattern on the road surface in the images taken at two different clock times (see, "Development of a Monocular Ranging and Verification System Using an Onboard Camera", SEI Technical Review, Issue No. 169, pp. 82 to 87, July 2006, for example). In such a technology, a movement amount may not be estimated with high accuracy due to an influence such as a shade of the own vehicle, for example, when a lane boundary position or a solid object is detected from the images taken, and the like. Thus, there has also been known a technology for improving detection accuracy of a lane boundary position or a solid object (see, Japanese Laid-open Patent Publication Nos. 2003-337999, 2009-265783, 2010-15367, 2004-338637, and 09-72716, for example).

Movement amount estimation device, movement amount estimation method, and computer-readable recording medium storing movement amount estimation program


A zener diode with a low reverse breakdown avalanche voltage and the use of zener diode in electrostatic discharge protection circuit is described herein. The low breakdown avalanche voltage is achieved by creating a zener diode with a lightly doped region between the P+ and N+ zones. Zener diode disclosed herein is particularly useful in protection circuits for integrated circuits having features or sizes of one micron or less.

1. Field of the Invention
This invention relates to electrostatic discharge protection circuits. More particularly, the invention relates to electrostatic discharge protection circuits used to protect field effect transistor integrated circuits, especially those with features of one micron or smaller.
2. Description of the Prior Art
Integrated circuits employing field effect devices, commonly termed MOS integrated circuits, are susceptible to electrostatic discharge. Given the decreasing size of circuit features resulting from improving process technology, static electricity generated by daily activity alone can destroy or substantially harm many MOS circuits. The circuits most susceptible to damage are usually finished circuits which have been packaged, but not yet installed in a finished product. Once installed, other means can protect the chip from damage.
An electrostatic discharge typically occurs when the circuit is touched by an individual handling the circuit before installation; when a static discharge occurs as the packaged circuit slides on its pins across another surface; or more generally, whenever the circuit is exposed to static electricity. Overall, damage from electrostatic discharges is the cause of over half of the devices returned by customers.
One traditional method for protecting integrated circuit devices comprised of field effect transistors from electrostatic discharge is to use diodes. These diodes are coupled between the input paths of the circuit and the pins to which the power supplies are connected. With electrostatic discharge events of one polarity the diodes are forward-biased, and with discharges of the opposite polarity they are reverse-biased. Normally the discharge that causes the diodes to become reverse-biased is the more problematic, because voltages and power surges seen by the internal logic circuits are higher than for the forward-biased case. Other methods used for protecting MOS circuits from electrostatic discharge are almost always variations on the diode clamping system described above.
The traditional methods described above usually function satisfactorily for circuits with large features. However, as the features of integrated circuits approach one micron and less, lower voltages than those which damage larger features can destroy the diodes and the circuit. The reverse junction breakdown voltage of known diodes is too high to protect these new integrated circuits.

Low reverse junction breakdown voltage zener diode for electrostatic discharge protection of integrated circuits


A process and plant are disclosed for the manufacture of particulate or liquid elastomeric polymers suitable for the manufacture of a wide variety of commercial elastomers, substantially in the absence of water for purifying and particulating the elastomer.

1. Field of the Invention
The present invention relates to a process for manufacturing many of the common commercial elastomers. The elastomers that can be manufactured by this process include, but are not limited to, ethylene-propylene-diene rubber, styrene-butadiene rubber, styrene-butadiene thermoplastic rubber, cis-polybutadiene rubber, butyl rubber and cis-polyisoprene rubber. The process applies to both batch and continuous manufacturing processes. Further, the process is used with elastomers produced in solution or in particulate form. A modification of the process makes it applicable for the manufacture very low molecular weight liquid polymers.
2. Description of the Prior Art
The manufacture of elastomers in anhydrous solvents or diluents consists of a polymerization section, a catalyst removal section, an elastomer particulation section, a diluent and monomer recycle purification section and an elastomer packaging and shipping section. See, for example for unrelated types of processes, U.S. Pat. No. 3,523,929, entitled "Olefin Polymerization Process", issued Aug. 11, 1970, to J. L. Paige et al; U.S. Pat. No. 2,565,960, entitled "Preparation of an Improved Hydrocarbon Resin", issued Aug. 28, 1951, to J. D. Garber et al; U.S. Pat. No. 4,068,053, entitled "Method of Removing Water From Liquid Olefin In The Polymerization of Olefins", issued Jan. 10, 1978, to C. D. Miserlis et al.
Existing elastomer processes do not normally use fine molecular sieve removal steps prior to the reactor in the polymerization section, although the use of molecular sieves is known in the art. Various purification steps for other processes unrelated to the elastomer process of this invention are shown in the prior art. See, for example, U.S. Pat. No. 2,900,430, entitled "Process For the Removal of straight Chain Acetylene From Isoprene", issued Aug. 18, 1959, to A. M. Henke et al; U.S. Pat. No. 2,906,795, entitled "Recovery and Utilization of Normally Gaseous Olefins", issued Sep. 29, 1959, to W. P. Bullard et al; U.S. Pat. No. 3,209,050, entitled "Purification of Diolefins", issued Sep. 28, 1965, to E. S. Hanson; U.S. Pat. No. 3,326,999, entitled "Purification of Olefins", issued Jun. 20, 1967, to R. D. Rhodes, Jr.; U.S. Pat. No. 3,352,840, entitled "Removal of Deposits From Polymerization Reactors", issued Nov. 14, 1967, to C. M. Oktay; U.S. Pat. No. 3,514,426, entitled "Process For Suppressing Molecular Jump", issued May 26, 1970, to R. E. Barrett; U.S. Pat. No. 3,635,931, entitled "Polyisoprene From Amylenes Via-Amylene Isomerization Oxidative Dehydrogeneration Extractive Distillation and Polymerization of Low-Concentration Isoprene", issued Jan. 18, 1972, to J. W. Davison; U.S. Pat. No. 4,016,349, entitled "Process For Removing Vanadium Residues From Polymer Solutions", issued Apr. 5, 1977, to J. M. McKenna; U.S. Pat. No. 4,182,801, entitled "Method of Drying Liquid Olefin Monomer Feed in a Molecular Sieve Dryer in the Polymerization of Olefins From Liquid Olefin Monomer", issued Jan. 8, 1980, to Miserlis et al; U.S. Pat. No. 4,235,983, entitled "Purification of Olefin Recycle to Polymerization", issued Nov. 25, 1980, to Steigelmann et al; and Paige.
Existing processes utilize an expensive hot water injection particulation section which also increases the cost of diluent and monomer recycle purification and adds a water waste disposal problem.
The use of flashing or settling zones for recovery of materials in processes unrelated to the elastomer process of this invention is also known in the prior art. See, for example, U.S. Pat. No. 2,921,053, entitled "Recovery of Olefins From Hydrocarbon Mixtures", issued Jan. 12, 1960, to R. F. Dye; and McKenna.
Further, some patents show the use of additives for product separation. See, for example, U.S. Pat. No. 4,098,980 to Markle et al. As set out infra, the reactants and other materials are carefully specified, and no additional additives, or place from which they could be introduced, are shown in the specification, and the process operates as shown and without any such additives.

Process for the manufacture of elastomers in particulate form


Embodiments of the invention disclose an integrated circuit and a method for improving utilization of multiply and accumulate (MAC) units on the integrated circuit in an artificial intelligence (AI) engine. In one embodiment, the integrated circuit can include a scheduler for allocating the MAC units to execute a neural network model deployed on the AI engine to process input data. The scheduler includes status information for the MAC units, and can select one or more idle MAC units based on the status information for use to process the feature map slice. The integrated circuit can dynamically map idle MAC units to an input feature map, thereby improving utilization of the MAC units. A pair of linked list, each with a reference head, can be provided in a static random access memory (SRAM) to store only feature map slices and weights for a layer that is currently being processed. When processing a next layer, the two reference heads can be swapped so that output feature map slices for the current layer can be used as input feature maps for the next layer.

As a branch of artificial intelligence (AI), machine learning can perform a task without using an application specifically programmed for the task. Instead, machine learning can learn from past examples of the given task during a training process, which typically involves learning weights from a dataset.
A machine learning model (e.g., a neural network model) can perform a task on input data through inference. During the inference, features can be extracted from the input data and compared to a score using a classifier for making predictions and providing results. Feature extraction and classification can be computationally intensive, and can include computing dot products of features and weights for each layer in the model. Therefore, when a machine learning model is running on an AI engine, a large number of multiply and accumulate (MAC) operations need to be performed by the AI engine.
An AI engine can include multiple MAC units, which are hardware units or blocks for performing MAC operations. Before a machine learning model is deployed on an AI engine for execution, a mapping tool can be used to generate a metafile from the model to specify static mappings between each layer in the model with MAC units in the AI engine. The static mappings can lead to a lower utilization rate of MAC units in the AI engine.
For example, when a slice of input feature map requires a number of MACs that is not multiple of the total MAC units in an AI engine, some MACs can be idle. The idle MACs cannot be used to process a next slice of the input feature map due to the static mappings. For another example, due to the sparsity of feature maps, the MAC units may complete tasks unevenly, leaving some MAC units idle. Even for MAC units statically mapped to a feature map slice, one or more MAC units may have to wait due to latency in data fetch or instruction fetch.

Methods for improving AI engine MAC utilization


A semiconductor memory device is disclosed. A block unit is divided into memory mats based on an internal address. In the case where the internal address is “1”, data are read in ascending order in accordance with a start address from the memory mat, while the internal address is incremented by an address conversion circuit thereby to select a 4-word block including the words next selected from the memory mat. At the same time, the internal address is incremented based on the start address, so that the period for reading each word included in the lowest order of 4-word block can be secured. In the process, the address next to be input can be decoded.

1. Field of the Invention
The present invention relates to a semiconductor memory device having a burst access mode capable of high-speed read operation.
2. Description of the Background Art
In recent years, the progress of the process technique has improved the integration degree of a semiconductor memory device with an increased operating speed. Especially, the operating speed of the CPU (Central Processing Unit) has remarkably increased. In keeping with the operating speed of the CPU, therefore, the program data stored in the semiconductor memory device is required to be read at high speed. Demand is high, therefore, for an increased speed of the read operation of the semiconductor memory device.
Specifically, the music information and the image information such as animation have come to be stored in a single semiconductor chip. The music information can now be reproduced through the speaker or the image information can be reproduced on the display screen of a display unit. Variations in the speed of reading the music information or the image information would cause discontinuous music or image reproduction and give the sense of discomfort to the user.
The music information and the image information, therefore, are required to be read at high uniform speed. As a method to meet the requirement of high-speed access to the semiconductor memory device described above, the operation of the semiconductor memory device has come be performed in burst mode. Specifically, in burst mode, an address that is the base of the burst read operation of data, for example, is applied to the semiconductor device, and the data corresponding to each page are latched and read at a time. The addresses required for the burst read operation from the latch are generated continuously in the internal circuits and read sequentially. Accordingly, the address is not required to be read anew each time and a high-speed access can be achieved in reading a memory array.
For example, the memory cell data of 16 words of Nos. 0 to 15 are read, and while these 16-word data of numbers 0 to 15 are being output, the data of 16 words of Nos. 16 to 31 are read from the memory cell. This reading process is sequentially repeated. In this specification, one word is assumed to represent 16-bit data.
In the burst mode operation described above, each time one page has been read, the address of the next page is given to the semiconductor memory device anew. The decoding process of the input address in the next page readout should be carried out within the page readout time from the memory array by the sense amplifier.
Specifically, consider a case in which a given page is read with the start address for 15th data in the aforementioned example. The read time for only the 16th data can be secured. Therefore, no time margin can be secured for reading from the memory cell, thereby leading to the problem that it is difficult to output the data continuously.
In order to obviate this disadvantage, Japanese Patent Laying-Open No. 9-106689 discloses a method in which a sense amplifier and a latch circuit are arranged on each of the bit lines for reading the data of a memory array to eliminate the requirement of inputting a new address each time the page is switched. According to this method, the data are collectively read from all the bit lines and stored in a corresponding latch. A new address input is not required, therefore, at other than the time of switching the word line, thereby making high-speed read/write operation possible. In the system using the semiconductor memory device, therefore, the page read time is eliminated at the time of switching the page for an improved overall processing speed.
In the conventional semiconductor memory device described above, the fact that each bit line has a corresponding sense amplifier and a latch circuit for storing the data from the sense amplifier can shorten the access time can be shortened. Since the sense amplifiers and the latches occupy a large area of the chip, however, the disadvantage is encountered that the chip area is increased as compared with the ordinary semiconductor memory device.
Also, the provision of a sense amplifier for each bit line greatly increases the power consumption for reading the data. In an application to a battery-driven portable information device, therefore, the operating time of the portable information device is undesirably shortened.

Semiconductor memory device for improving access time in burst mode


A wireless communications system is configured to perform wireless communication by using a first band dedicated to the system and a second band shared by the system and another wireless communications system. The system includes a base station configured to transmit in the first band to a terminal when detecting an available carrier wave of the second band, a control signal permitting data transmission in the second band from the terminal to the base station, the base station continuously sending out a radio wave of the second band during a period until the data transmission; and the terminal configured to perform the data transmission after a predetermined time from transmission of the control signal by the base station.

A conventionally known apparatus is operational by a common medium for reception and transmission and includes a transmitter for transmitting multiple frames transmitted continuously at substantially reduced inter-frame intervals (see, for example, Japanese Laid-Open Patent Publication No. 2009-207149). A technique of performing a wireless cellular operation in an unlicensed spectrum or a spectrum licensed in a simplified manner is conventionally known (see, for example, Published Japanese-Translation of PCT Application, Publication No. 2014-500685).

Wireless communications system, base station, and terminal


An electrical motor includes a ground brush connected to ground, first and second supply brushes connected to first and second supply lines and adapted to cause the motor to rotate at first and second speeds, and an interference suppression device comprising a common core, a first coil connected in series between the first supply brush and the first supply line and a second coil connected in series between the second supply brush and the second supply line. The space required by the device in the motor casing is less than with the conventional arrangement of two individual chokes and can provide improved noise suppression due to magnetic coupling between the two coils.

In vehicle windscreen wiper motors, it is known to connect to each supply brush of the motor a choke and a capacitor so as to suppress radio frequency interference caused during use of the windscreen wipers. In use, the choke suppresses frequencies in the FM broadcast frequency band and higher frequencies, while the capacitor suppresses the AM broadcast band and lower frequencies.
The choke is commonly formed of a length of copper wire wound into a coil around a rod-shaped core of magnetically conductive material, such as a ferrite. The number of turns of the coil is generally chosen as a compromise between the greatest number of turns which can be carried by the core, the current carrying capacity of the wire and the space available in the motor housing. In order to ensure that the core does not work itself loose from the coil, it is common to apply a coat of a suitable varnish between the coil and core so as to bond the coil to the core. Alternatively, the core can be secured in place by bending the ends of the coil around the ends of the core, although this is generally more time consuming as an additional manufacturing step is required after fitting the coil onto the core.
For a windscreen wiper motor adapted to provide two or more wiping speeds, the motor includes two or more supply brushes and, consequently, an interference suppression choke and a capacitor connected to each supply brush.
It is possible to use a single capacitor for all of the supply brushes, by coupling the capacitor directly to the supply line which connects the motor to a power supply, in such a manner that the brush selection switch used to switch from one supply brush to another is located between the capacitor and the supply brushes.
On the other hand, in order for the chokes to provide adequate noise suppression, it is necessary for them to be positioned close to the source of noise, that is close to their respective supply brush. As it is not normally possible to place the brush selection switch close to the supply brushes, due in part to space restrictions within the motor housing and to the need to have the switch close to the driver, it is not possible to reduce the number of chokes.

Electrical motor with choke coils on a common core


Disclosed herein are methods and devices for stimulating soldering of a substrate with a component during a reflow process. In an exemplified embodiment, the method involves placing a substrate/component combination into a reflow oven; directing the substrate/component combination to the heating zone of said reflow oven; and vibrating the substrate/component combination while said substrate/component combination is in said heating zone. The vibrating of the substrate/component combination occurs at a predetermined amplitude and frequency such that formation of a complete solder joint is stimulated without displacing said substrate and said component relative to each other.

Surface mount electronic assembly generally requires an oven reflow process in order to bond components to printed circuit boards or bumped dies to substrates. One common failure mode with this process is what is known as cold solder joints or "non-wets" where the solder on the component does not form a solder joint with the substrate or printed circuit board. This requires expensive and manual repair or loss or materials if repair is not possible. In flip chip assembly, this failure mode is a direct yield impact and results in 100 percent material scrap as once the device is fully assembled, it cannot be repaired. Typically, in a reflow soldering apparatus, a circuit board and electronic components are heated, thereby melting a solder to join the circuit board and electronic components by the solder. Typically, it is necessary to use high activation fluxes which require post process cleaning and are generally more expensive. High activation flux and cleaning is an added expense and process that requires additional inspection and baking of the device. Other attempts to adjust the problem of cold solder joints include using multiple reflows. Multiple reflows adds to the process cycle time and unnecessarily stresses the devices. In addition, this does not completely eliminate cold solder joints and human error can be introduced into the process, as devices may be reflowed more than desired.

System and method for forming solder joints


In a manufacturing method for a glass panel with a gasket, an elastic member is placed on a table, and a multilayer glass panel is placed thereupon. A die is pressed against a top surface of the multilayer glass panel, thereby compressing the elastic member and glazing gasket molding material together with adhesive ejected from the application nozzle and applied to the top surface of the multilayer glass panel.

The applicant has already proposed a method of manufacturing a multilayer glass panel with a glazing gasket in which a multilayer glass panel is placed on a table, glazing gasket molding material is ejected from an application nozzle to a constant shape, and the glazing gasket molding material is installed on the surface of the glass panel with adhesive (Japanese Unexamined Patent Application Publication No. 2011-51802).
In this previous application, the glazing gasket molding material and the adhesive are ejected from the application nozzle while the multilayer glass panel and the application nozzle are moved relative to each other at high speed, and applied onto the surface of the glass panel.
However, when the glazing gasket molding material together with the adhesive is applied to the surface of the glass from the application nozzle that is moving at high speed, in order to properly attach the glazing gasket molding material on the glass surface, and in order to form the glazing gasket molding material to the required shape, it is desirable to apply the glazing gasket molding material ejected from an outlet to the glass surface with pressure.
Therefore, the closer the die of the application nozzle in which the outlet is formed is to the glass surface the better, so applying the glazing gasket molding material while the die is pressing against the glass surface is the most desirable in terms of applying the pressure of the glazing gasket molding material that is ejected from the outlet to the glass surface.
In other words, in order to properly attach the glazing gasket molding material to the glass surface, and in order to form the gasket molding material to the required shape, it is most desirable to apply the gasket molding material with the die pressing against the glass surface.
However, at an application starting point of the start of application and at an application finishing point at the finish of application, the quantity of gasket molding material applied is not constant. Therefore, it is conceivable that at portions that include the application starting point and the application finishing point are cut with a laser and removed, and a gasket molded body that is manufactured in advance is fitted into the removed portions.
In this case, the glass surface may be damaged due to the laser to be used while cutting the gasket molding material.
Therefore, it is conceivable that a fixture plate is placed on the glass plate, the application starting point and the application finishing point are determined on the fixture plate, the portions that include the application starting point and the application finishing point are cut with the laser on the fixture plate and removed, and the gasket molded body that is manufactured in advance is fitted into the removed portions.
In this case, if the gasket molding material is applied while the die is pressing against the glass surface, at the position of the fixture plate, a step is formed with the glass surface with the thickness of the fixture plate, so to move the die from the surface of the glass onto the fixture plate, at a position near the application finishing point, it is necessary to either raise the die and weaken the impelling force, or lower the table and weaken the impelling force.
Therefore, in order to ensure the pressing force of the die against the glass surface, an impelling mechanism or a control mechanism that can adjust the impelling force has been used conventionally. This results in the structure of the glazing gasket molding apparatus being more complex, and is also disadvantageous for reducing costs.

Manufacturing method for glass panel with glazing gasket and glazing gasket molding apparatus


A pressure regulator configured to regulate a working fluid by a pilot pressure, including: a spool valve mechanism having a spool; a biasing mechanism having a pilot-pressure chamber and a pilot piston, the biasing mechanism being configured to bias the spool toward the other end of the pressure regulator in its axial direction by a pressure of the working fluid in the pilot-pressure chamber; a counter biasing mechanism having a regulated-pressure chamber and a counter biasing piston, the counter biasing mechanism being configured to bias the spool toward one end of the pressure regulator in the axial direction by a pressure of the working fluid in the regulated-pressure chamber; and at least one of a first damping mechanism configured to damp a movement of the pilot piston and a second damping mechanism configured to damp a movement of the counter biasing piston.

Field of the Invention
The present invention relates to a pressure regulator configured to regulate a pressure of a working fluid supplied from a high-pressure source and also relates to a hydraulic brake system for a vehicle including the pressure regulator.
Description of the Related Art
In the field of a vehicle hydraulic brake system, a system is known in which a brake device generates a braking force depending not on a brake operation force but mainly on a pressure of a working fluid supplied from a high-pressure source. In the system, a pressure regulator is used for regulating the pressure of the working fluid supplied from the high-pressure source. In a system described in the following Patent Literature 1 which is one example of such a system, there is provided a pressure regulator for regulating a pressure of a working fluid by a pilot pressure.    Patent Literature 1: JP-A-2013-227016

Pressure regulator and hydraulic brake system for vehicle equipped with the same


Power of signal light injected to a Raman amplification medium is measured or estimated by calculation and ratio of the gain between forward pump light and backward pump light is controlled according to the result of the measurement or calculation. Wavelengths used in the forward pumping are optimally allocated.

1. Field of the Invention
The present invention is utilized in an optical communication. Particularly, the present invention relates to a technique for suppressing degradation of signal quality due to input signal power variation.
2. Description of Related Art
In the WDM (Wavelength Division Multiplex) optical transmission system, a plurality of signal channels having different wavelengths are transmitted simultaneously through an optical fiber. Therefore, the WDM optical transmission system is advantageous in that transmission capacity per optical fiber can be increased by increasing the number of wavelengths, saving the number of optical fibers.
The WDM optical transmission system mainly consists of (1) an optical transmitter provided at the transmitting end of an optical transmission line, (2) an optical receiver provided at the receiving end thereof and (3) the optical transmission line between the optical transmitter and the optical receiver. The optical transmission line usually consists of (A) a plurality of optical amplifiers (for example, erbium-doped optical fiber amplifiers) for amplifying WDM light signal and (B) a plurality of optical fibers for connecting the optical amplifiers mutually.
Signal quality of an optical signal transmitted from the optical transmitter degrades while traversing through the optical transmission line. The degradation of signal quality is caused mainly by ASE (Amplified Spontaneous Emission) and nonlinear waveform distortion. ASE is a constant amount of random light produced by the optical amplifier and nonlinear waveform distortion is a waveform distortion caused by time-dependent nonlinear refractive index changes in the transmission fiber induced by signal light pulses. The distortion increases with the signal light power.
The signal degradation due to ASE tends to increase with decreasing signal power at the output of the optical transmission line. This is because the input of an optical amplifier is usually connected to the output of the optical transmission line. Since the optical amplifier usually generates a constant amount of optical noise, ratio of signal light to ASE, that is, signal-to-noise ratio (SNR) degrades when signal power at the output of the optical transmission line decreases. That is, in order to reduce influence of ASE on the signal light, larger signal power is preferable at the output of the optical transmission line.
The degradation of signal quality due to nonlinear waveform distortion tends to increase with increasing signal power at the input of the optical transmission line. This is because nonlinear refractive index variation, which is the cause of nonlinear waveform distortion, increases with increase in signal power. Therefore, in order to suppress the influence of nonlinear waveform distortion on the signal quality, smaller signal power is preferable at the input of the optical transmission line.
Therefore, for suppressing the signal quality degradations from both ASE and nonlinear waveform distortion, larger signal power is preferable at the output of the optical transmission line while smaller input power is preferable at the input of the transmission line. However, since the output signal light power and the input signal light power are in one-to-one relation, the difference of the two powers being the loss of the optical transmission line, the above two conditions cannot be satisfied simultaneously. Therefore, the powers of the output and input signal lights are set so as to minimize the total degradation.
Even with the optimal signal power setting, it is impossible to completely remove the two degradations. Further, since both of the degradations accumulates while the signal light passes through a plurality of optical amplifiers and optical transmission fibers, maximum transmission distance, that is, length of the optical transmission system is limited by the accumulated degradations.
In order to relax this limitation on the maximum transmission distance, a method and a system utilizing Raman amplification has been proposed. Raman amplification is a phenomenon in which a signal light is amplified within an transmission fiber when light, which is referred to as pump light having specific wavelength different from that of the signal light, are launched simultaneously into the optical fiber.
There are three configurations for a system using Raman amplification: "backward pumping" configuration in which amplification is performed by using a pump light (referred to as backward pump light) propagating in the opposite direction to the signal light; the "forward pumping" configuration in which amplification is performed by using a pump light (referred to as forward pump light) propagating in the same direction as the signal light; and "bidirectional pumping" configuration in which amplification is performed by using both the backward pump light and the forward pump light. In any of these three system configurations, it is possible to improve the signal quality compared to systems which does not utilize Raman amplification, by appropriately setting the optical signal power at the input terminal of the optical transmission line.
For example, an improvement in signal quality by utilizing the backward pumping will be described with reference to FIG. 27. Curve (a) in FIG. 27 shows the signal power distribution in an optical transmission fiber in an optical communication system without Raman amplification. The average power of all wavelength channels is employed for simplicity. When the backward pump light is injected into the optical transmission line from the output terminal, the signal light is amplified in the optical fiber, as shown by curve (b) in FIG. 27. As a result, signal light power at the output of the optical transmission fiber is increased, reducing the influence of ASE generated by an optical amplifier connected to the output terminal. Therefore, the signal quality is improved.
An improvement in signal quality by utilizing the forward pumping will be described with reference to FIG. 28. Curve (a) in FIG. 28 shows the signal power distribution in an optical transmission fiber in an optical communication system without Raman amplification. When the forward pump light is injected into the optical transmission line from the input terminal, the signal light is amplified as shown by curve (b) in FIG. 28. When the input signal light power is reduced such that the signal light at the output of the optical transmission fiber becomes equal to the level before Raman amplification is applied, the output signal light becomes as shown by curve (c) in FIG. 28. As a result, it becomes possible to lower signal light power while maintaining the output signal power from the optical transmission line, that is, while maintaining the degradation due to ASE constant. Therefore, the nonlinear waveform distortion can be reduced leading to improved signal quality. When the bidirectional pumping configuration is used, it becomes possible to reduce the influences of both the ASE and nonlinear waveform distortion, simultaneously.
Such optical transmission system in which the signal quality is improved by Raman amplification is disclosed in, for example, H. Suzuki et al, Optical Fiber Communication Conference and the International Conference on Integrated Optics and Optical Fiber Communication '99 Technical Digest, ThO4.
It has been known, however, that the Raman amplification improves the signal quality by the above mentioned mechanism on one hand but generates noise peculiar to Raman amplification on the other. Noise peculiar to Raman amplification is, for example, Raman ASE. Since Raman ASE rapidly increases with increase in signal gain by Raman amplification, maximum gain of Raman amplification, which effectively works in improving the signal quality, is limited by Raman ASE.
Assuming the input signal power at the input of an optical transmission fiber is the same and the gain of Raman amplification is the same, an amount of Raman ASE generation is minimum in the forward pumping configuration and maximum in the backward pumping configuration. The amount of Raman ASE generated in the bidirectional pumping configuration is in between the other two configurations.
Degree of signal quality degradation caused by Raman ASE increases with the decrease in the input signal light power into an optical transmission fiber. Therefore, if Raman amplification is used with low input signal power into an optical transmission fiber, degradation due to Raman ASE becomes substantial.
Noise peculiar to Raman such as Raman ASE amplification is disclosed in, for example, P. B. Hansen et al, IEEE Photonics Technology Letters, Vol. 10, No. 1, January 1998, pp.159–161.
Further, since the average signal power inside the optical transmission fiber is increased by Raman amplification, additional nonlinear waveform distortion occurs compared to the system without Raman. If the input signal power at the input of an optical transmission fiber is the same and the gain of Raman amplification is the same, the additional nonlinear waveform distortion is maximum in the forward pumping configuration and Raman amplification is minimum in the backward pumping configuration. The additional nonlinear waveform distortion in the bidirectional pumping configuration is in between the other two constructions.
If gain is obtained by forward pumping without lowering input signal light into the optical transmission line as shown by curve (b) in FIG. 28, the signal light power is higher at any longitudinal position of the optical transmission line, compared to the case without Raman amplification. Therefore, the nonlinear waveform distortion becomes larger compared to the case without Raman amplification.
Incidentally, when the light power is increased only in a later part of the optical transmission fiber in which signal light power is already lowered by loss, and when increase is small as in the case shown by curve (b) in FIG. 27, the additional nonlinear waveform distortion is negligibly small.
Although Raman amplification is accompanied with noise and nonlinear waveform distortion peculiar thereto, it is possible to improve the signal quality compared with the case without Raman amplification by properly designing to suppress influence of these matters.
Further, it is known that, when Raman amplification is utilized, it is possible to compensate, simultaneously with the improvement in signal quality, for the tilting of signal light power with respect to wavelength (wavelength dependency) that originates from propagating through an optical transmission fiber having wavelength-dependent loss. Since the gain characteristics of Raman amplification has wavelength dependency, it is possible to realize gain characteristics opposite to the loss wavelength characteristics of the optical transmission fiber by appropriately selecting wavelength and power of pump light.
Therefore, by using an optical transmission fiber as Raman amplification medium, it becomes possible to maintain at the output of the transmission fiber constant with respect to wavelength. By maintaining WDM signal power constant with respect to wavelength, it is possible to provide uniform signal quality in all wavelength channels.
Particularly, it is possible to compensate for the tilting of signal light power with respect to wavelength, which varies with time, by changing the pump light wavelength and/or the pump light power with time. An example of an optical communication system in which the loss wavelength dependency is compensated for by Raman amplification is disclosed in JP2001-7768A.
In JP2001-7768A, it is described that, when Raman amplification is used, it is preferable to control gain of Raman amplification such that signal light power at the output terminal of an optical fiber transmission fiber becomes uniform with respect to wavelength while at the same time the total output signal light power (total of signal light powers in all wavelength channels thereof) is maintained. This is because when an optical amplifier such as an erbium-doped fiber amplifier is connected to the output of the transmission fiber, change in total signal power would lead to gain tilt provided by the amplifier. When the gain is tilted with respect to wavelength, it becomes impossible to provide uniform signal quality over all wavelength channels.
As mentioned above, it is possible to improve the signal quality in an optical transmission system and to compensate for the loss wavelength dependency of the transmission fiber, which varies with time, by utilizing the conventional technique related to Raman amplification. However, the conventional technique has a problem when input signal power into the optical fiber transmission fiber is changed while the wavelength dependency is kept constant.
Input signal power into may change while wavelength characteristics is kept constant, for example, when the output signal power of an optical amplifier reduces due to trouble with a pumping laser diode, or when the loss of an transmission fiber changes due to reconnection of optical fiber transmission fibers by an optical cross-connect. The optical cross-connect may be of an automatic type using optical switches or of a manual type in which an optical patch panel is manually switched. Further, there may be a case when the system is reconnected to a different set of transmission fibers with different loss after turning off the system for the purpose of system recycling.
For example, in an optical communication system with backwardly pumped Raman amplification which initially operates in the optimal signal light power with which signal degradation is minimum as shown in curve (a) in FIG. 29, when the signal light power is lowered over all wavelength channels as shown by curve (b) in FIG. 29 (the average signal light power of the all wavelength channels is shown in FIG. 29), a control is conventionally performed such that the output power from the optical transmission fiber becomes constant. That is, the control increases pumping light power, so that gain due to Raman amplification is increased. As a result, the average signal power becomes as shown in curve (c) in FIG. 29.
In such state, since the output signal power from the transmission fiber is kept constant by controlling Raman gain, there is no variation in degradation due to ASE generated by a subsequent optical amplifier. However, as mentioned previously, degradation due to Raman ASE increases with decrease in input signal light into the transmission fiber. Therefore, if reduction of signal light power over the whole wavelength channels is large, degradation due to Raman ASE becomes substantial.
This will be described by using the simulation result shown in FIG. 31 and FIG. 32a to FIG. 32c. The abscissa in FIG. 31 is the distance, that is, position along transmission fiber and the ordinate is the average signal light power. Assuming that, initially, an optical communication system operates with the signal light power shown by curve (a) in FIG. 31 and the transmission fiber is a 125 km long single mode fiber, calculated waveform at the input and the output of the transmission fiber for a representative wavelength channel is as shown by waveforms in FIG. 32a and FIG. 32b, respectively. Signal bitrate is 40 Gbit/sec. From these figures, signal degradation due to ASE and nonlinear waveform distortion may be observed. When the signal light power is lowered over all wavelength channels as shown by curve (b) in FIG. 31, a conventional control tried to keep the output power from the transmission fiber constant. That is, in the conventional technique, the control increased the pump power, so that gain due to Raman amplification is increased. As a result, the average signal power distribution becomes as shown by curve (c) in FIG. 31. In this example, the input signal light power is lowered by 10 dB. As a result of the reduction of the input signal light power, the degradation of signal quality due to Raman ASE is increased and the waveform of the signal output from the transmission fiber becomes as shown by the waveform in FIG. 32c. From this, it is clear that degradation due to Raman ASE increased. Further, similar degradation occurs even when the loss of the transmission fiber is increased by 10 dB by such as by switching of connection of the optical fiber.
In a case where the signal light power over all wavelength channels is increased as shown by curve (b) in FIG. 30 in an optical communication system utilizing forwardly pumped Raman amplification which initially operates with the optimal signal light power with which the degradation of signal quality is minimum as shown by curve (a) in FIG. 30, the conventional control is performed to keep the output signal power light from the transmission fiber constant. That is, the control decreases pumping power so that gain due to Raman amplification is decreased. As a result, the average signal light power becomes as shown by curve (c) in FIG. 30.
In this state, since power of the signal light ejected from the transmission fiber is kept constant by controlling Raman gain, the amount of degradation due to ASE generated by a subsequent optical amplifier is not changed. However, since light power is increased in the preceding part of the transmission fiber compared to the power distribution before the increase, additional nonlinear waveform distortion in this portion of the transmission fiber is substantial.
This will be described by using the simulation result shown in FIG. 33, FIG. 34a and FIG. 34b. The abscissa in FIG. 33 is the distance, that is, position along transmission fiber and the ordinate is the average signal light power. Assuming that, initially, the optical communication system operates with the signal light power shown by curve (a) in FIG. 33 and the transmission fiber is a 125 km long single mode optical fiber, the calculated waveform at the input and the output of transmission fiber for a representative wavelength channel become as shown by the waveform in FIG. 34a. Signal bitrate is 40 Gbit/sec. When the signal light power is increased over all wavelength channels as shown by curve (b) in FIG. 33, the conventional tried to keep the output signal light from the transmission fiber constant. That is, in the conventional technique, the control decreased the pumping power, so that gain due to Raman amplification is reduced. As a result, the average signal power becomes as shown by curve (c) in FIG. 33. In this example, input signal light is increased by 10 dB. As a result of the increase in the input signal light power, the signal degradation due to nonlinear waveform distortion is increased and the waveform of the output signal light from the transmission fiber becomes as shown by the waveform in FIG. 34b. From this, it is clear that the nonlinear waveform degradation has become large.
In order to suppress such nonlinear waveform distortion, it is necessary to restrict Raman gain such as shown by curve (d) in FIG. 30. In such case, the increase in nonlinear waveform distortion in the preceding part of the transmission fiber cancels out with the decrease in nonlinear waveform distortion in the subsequent part of the transmission fiber and becomes comparable to the amount of nonlinear waveform degradation as in (a) of FIG. 30. In this case, however, since the output signal power from the transmission fiber is lowered, the signal quality is degraded by ASE generated by the subsequent optical amplifier.
In the conventional techniques related to the bidirectional pumping, a control method has not clearly been defined for the case when the input signal light power into an transmission fiber varied while wavelength characteristics thereof is kept constant. If a simple control is performed for the reduction in input signal light power such that gain obtained by the forward pumping and gain obtained by the backward pumping are increased at the same rate, signal quality in the backward pumping portion is degraded due to Raman ASE. On the contrary, when the input signal power is increased, signal quality in the forward pumping portion is degraded due to the additional nonlinear waveform distortion.
JP2000-98433A discloses an output light power control means in which the input or output light is monitored and a pumping light power is controlled on the result of the monitoring such that the output light power is kept at a predetermined value. However, JP2000-98433A does not disclose any control method, which takes the ratio of the forward pumping to the backward pumping and Raman ASE into consideration.
As such, since there is no control technique related to collaboration of the forward pumping and the backward pumping in the conventional optical communication system or an optical amplifier, which utilizes Raman amplification and because there is no optical amplifier, which utilizes Raman amplification that is capable of adapting to various input signal light powers, it has been usual to find the optimal point in try-and-error manner every time when the conventional optical amplifier is installed. Therefore, a huge amount of labor is required in installing the conventional optical amplifier and a cost for sending engineers to the location of the installation, causing such technique to be not realistic.
Further, if the characteristics of transmission line is changed because the configuration of the transmission line is changed such as by an optical cross-connect, it is difficult to flexibly adapt to such situation by the conventional technique.

This patent is subject to a terminal disclaimer.

Raman amplification control method, optical communication system, optical amplifier and program


The present invention relates to a method and a device for processing and reproducing an audio stereo signal. The method produces a left output signal for transmission to a left loudspeaker in a loudspeaker pair, which is, or is equivalent to, the sum of the mid input signal (M) and the side input signal (S), the method further produces a right output signal for transmission to a right loudspeaker in said pair, which is, or is equivalent to, the sum of the mid input signal (M) and the side signal (S) phase shifted 180° . The method further being characterized in that at least part of the side input signal (S) or the mid input signal (M) is phase shifted approximately 45°-135° relative to the other signal prior to or at the production of the left and right output signals. The invention further relates to such an audio stereo signal reproduction system.

A large number of methods and systems exist intended for faithful reproduction of the sound experienced by a listener at the recording position. The system coming closest to virtually move the listener to the recording location, i.e. to convey an impression of the true location of the different sound sources of the original event, is the binaural method of recording and the binaural method of reproduction (headphones). This method has as its shortcomings in that the sound is interpreted by ear canals both in the recording stage and in the reproduction stage and in a worst case even by two sets of pinna (outer ears) on its way to the listeners brain where the sound information is to be interpreted. There are solutions that utilize a simplified recording method including a foam ball of head size with the microphone elements on each side of the ball instead of a replica of a head. This is a compromise to gain sound quality but loses the distinction of localization between front and back and the elevation. All other ways than the binaural method to record and reproduce sound is a creation of an imaginary sound image that is truly subjective. This is the case for both the recording stage and the reproduction stage.
As opposed to previously known methods, the object of the reproduction stage should only be to convey the electrical differences to the listener's auditory system with minimal loss or addition of information. The place where the stereo sound image is created is then the recording and/or mixing stage. The stereo image might be made as a truthful, but still subjective, interpretation of the sound experienced by a listener in a venue, or as an illusion of an imaginary event that never have physically occurred or a mixture of the two.
Most reproduction systems of today are based on a pair of widely spaced loudspeakers, and true reproduction of the electrical stereo signal, both in terms of relative intensity between the sound waves perceived by the ears of the listener and the time difference between these, can at best be perceived only at one single position in relation to the loudspeakers. These methods are often subject to incorrect translation of the electrical stereo information dependant on the preferences of the separate loudspeakers and how the loudspeakers are positioned in relation to the listener. There is thus a need for a sound reproduction system that provides identical reproduction of the stereo sound image regardless of setup and quality of the loudspeakers.
A system that solves this problem is described in the patent application WO01/39548, assigned to the applicant of the present invention, which discloses a method of processing and reproducing an input audio stereo signal. A side signal is split into a first and a second intermediate signal, where the first intermediate signal is equal to the side signal and the second intermediate signal is equal to the first intermediate signal phase shifted 180°, a mid signal is attenuated by a factor α which compensates for imperfections in the balance between the mid and side signals appearing in the audio reproduction stage, the attenuated mid signal is added to both the first and the second intermediate signals, so as to form the output audio stereo signal, and the output stereo signal is directed to an audio stereo signal reproduction system comprising a pair of loudspeaker units located in close proximity to each other. The system described in WO01/39548 allows an audio stereo signal to be reproduced with a high degree of fidelity with high consistency in the perceived stereo image regardless of the quality of system.
A problem with such a system with closely located loudspeaker units, however, is that at high frequencies, above 1-5 kHz, the degree of fidelity in perceived stereo effect degrades or vanishes totally.

Audio stereo processing method, device and system


An optical module includes: a pedestal; a glass optical multiplexer/demultiplexer fixed onto the pedestal via a UV adhesive; and a metal block which is smaller than the glass optical multiplexer/demultiplexer and is fixed to a top surface of the glass optical multiplexer/demultiplexer.

Field of the Invention
The present invention relates to an optical module provided with an optical multiplexer/demultiplexer that multiplexes or demultiplexes light and a method of manufacturing the same.
Background Art
Conventional optical modules align lenses at desired positions using a lens holder into which a lens is inserted and a holder guide, and fix members thereof through laser welding or the like. The material of the lens holder and the holder guide is stainless steel, steel, Kovar or the like (e.g., see Japanese Patent Application Laid-Open No. 2-139506). There is also a proposal of an optical module using a glass prism for an optical multiplexer/demultiplexer (e.g., see "Four-channel 25 Gbps Optical Receiver for 100 Gbps Ethernet (registered trademark) with Built-in Demultiplexer Optics" Optical Communication (ECOC), 2010 36th European Conference, Mitsubishi Electric Corporation, written by Aruga).
When fixing the lens holder and the holder guide through UV adhesion after alignment of lenses, the optical module described in Japanese Patent Application Laid-Open No. 2-139506 poses a problem that UV light is kicked by the metallic lens holder or holder guide and the lens position cannot be fixed.
Regarding the optical module described in "Four-channel 25 Gbps Optical Receiver for 100 Gbps Ethernet (registered trademark) with Built-in Demultiplexer Optics" Optical Communication (ECOC), 2010 36th European Conference, Mitsubishi Electric Corporation, written by Aruga, when the optical multiplexer/demultiplexer is held for alignment, the glass optical multiplexer/demultiplexer must not be damaged. For this reason, the optical multiplexer/demultiplexer needs to be held using, for example, a suctioning apparatus having a large area. Moreover, the optical multiplexer/demultiplexer is fixed to a pedestal using an adhesive. When an attempt is made to align the multiplexer/demultiplexer while keeping the multiplexer/demultiplexer in contact with the adhesive using the suctioning apparatus, the glass optical multiplexer/demultiplexer comes off the suctioning apparatus by yielding to the viscosity of the adhesive, making it difficult to make alignment at an appropriate position. Thus, after making alignment at a position at which the optical multiplexer/demultiplexer is caused to float from the adhesive, the optical multiplexer/demultiplexer is dismounted and caused to come into contact with the adhesive. Therefore, alignment is performed at a position different from the position where the optical multiplexer/demultiplexer should originally be fixed, and misalignment may occur when the optical multiplexer/demultiplexer is dismounted. This results in a problem that the optical multiplexer/demultiplexer cannot be fixed at an optimal position.

Optical module and method of manufacturing the same


Visual images may be used to detect, or verify the existence of, landmarks. In one example, the landmarks may be used to provide driving or walking directions. A set of records may be examined to identify the street addresses of businesses or other entities. Additionally, street-level images may be captured with a camera, and the locations at which the images were captured may be recorded. The images may be evaluated with an Optical Character Recognition (OCR) process to determine what words appear in the images. The words in the image are compared with the names of entities whose addresses are near where the image was captured. If the words match the entity name, then a sign identifying the entity is presumed to be visible along a particular route, and the entity may be used as a landmark in a set of walking or driving directions.

Many map applications provide the ability to give directions. Examples of map applications include web-based map applications (e.g., Live Search Maps, Google Maps, MapQuest, etc.) and navigation devices. Typically, these map applications give directions in the form of lists of intersections at which a user is to change direction. For example, directions might say, "Proceed for 1.5 miles, and then turn right on Main Street." Map applications typically provide text (or spoken) directions, along with a map of the intersection at which the change of direction is to take place. For example, when the directions call for a turn at the intersection of Main Street and Elm Street, an automobile navigation device may display a map of that intersection near the time when the user is approaching the turn.
Directions provided by map applications are sometime difficult to follow. Maps are schematic representations of roads, and some people are not adept at relating these abstractions to an actual road. Moreover, sometimes the map displayed by the application does not correspond well with the actual road that the application is trying to show. For example, some highway intersections, or street crossings at oblique angles, may not appear in real life as they do on a map. Additionally, in some areas street signs are not easily visible, and the building-numbering scheme may be unclear or inconsistent, which also can make directions difficult to follow.


Heat is transferred to a cold plate from one or more subassemblies in an array of subassemblies in an electronic package. The cold plate has a thermally conductive cold plate substrate, a pressure header, a pressure passage, and one or more pressure connections. Each of the pressure connections connects through a housing opening to housing volume defined by a flexible housing in an encapsulated liquid thermal interface (LTI). The flexible housing is in physical and thermal contact with one of the subassemblies through a housing bottom and a top surface of one or more components in the subassembly. A thermally conductive fluid fills the housing volume, housing opening, pressure connections, pressure passage, and pressure header which are all in fluid communication along with one or more other connections, housing openings, and LTIs on other subassemblies. The system transfers heat from the subassemblies to the cold plate while maintaining a constant pressure/stress on each of the subassemblies. The system pressure on each of the subassemblies is equal. The system pressure can be controlled to a preloaded pressure to insure good electrical contact between components. Shear on the subassemblies is minimized by the LTIs.

The present invention relates to cooling packages of arrays of load sensitive subassemblies/modules containing electronic components. More specifically, the invention relates to cooling load sensitive electronic subassemblies/components in packages to minimize thermal and mechanical stresses.
New computer systems are expected to have an array of replicated electronic subassemblies/modules of components packaged together. Array packaging allows a single cooling component such as a cold plate to be deployed to reduce the cost of cooling multiple components in an array.
However, even though subassemblies may be replicas of one another, variations in dimensions and materials of components in the subassemblies and operational variations of the components and subassemblies cause differences in heat generation, heat flux, heat removal, and temperature related to these subassemblies/components. As such, thermal and mechanical stresses and strains are introduced that can affect each of the components and subassemblies differently. These stresses and strains can diminish performance of these systems and lead to component and/or subassembly failure. Further, differential heating of the components/subassemblies make system design and operation more difficult because conditions that permit good operation of one component/subassembly can cause deterioration in another component/subassembly.
Particularly, optomechanical assemblies that provide high speed communication links between multiple processors use these packaging concepts. Since optical components are sensitive to operating temperature as well to mechanical misalignment, managing the thermal as well as mechanical load becomes of paramount importance in these packages.
There is a need for an array packaging cooling system which minimizes mechanical, heating, and temperature fluctuations and the commensurate stresses and strains due to manufacturing and operational variations of components in these packages.

Pressure controllable encapsulated liquid thermal interface

International Business Machines Corporation


An optoacoustic sensor for detecting one or more target gases includes a body featuring halves containing measurement cells. Each measurement cell is in communication with a light source and a microphone as well as the ambient atmosphere. Evaluation and control electronics are in communication with the light sources and the microphones sequentially illuminate the first and second light sources so that a measurement signal due to optoacoustic pressure variations from a target gas is generated by the microphone of the illuminated or gas active cell and a compensation signal is generated by the microphone of the non-illuminated or gas inactive cell. The compensation signal is subtracted from the measurement signal by the evaluation and control electronics to provide a sensor output signal.

The present invention generally relates to gas sensors and, more specifically, to an optoacoustic gas sensor.
Optoacoustic gas sensors have been used in various applications, including gas analyzers and gas detectors, to monitor environment gas concentration, most often for safety and process control purposes. Optoacoustic gas measurement is based on the same basic principles as conventional infrared-based gas analyzers—the ability of gases to absorb infrared light. More specifically, optoacoustic technology is based on generating acoustic pressure waves as result of gas irradiation with suitably modulated light.
A variety of optoacoustic gas sensors are known in the prior art. These include the optoacoustic gas sensors disclosed in U.S. Pat. No. 4,557,603 to Oehler et al.; U.S. Pat. No. 4,818,882 to Nexo et al.; U.S. Pat. No. 4,866,681 to Fertig; U.S. Pat. No. 5,753,797 to Forster et al.; U.S. Pat. No. 5,841,017 to Baraket et al. and U.S. Pat. No. 6,006,585 to Forster. These patents disclose arrangements where the sensor contains an infrared light source, a measurement cell, a membrane, a microphone and an electrical circuit for operating the light source and evaluating the microphone output signal. The light source transmits light pulses with specific wavelength into the measurement cell, where the radiation is absorbed by the gas to be detected and/or measured. Different gases can be measured by using light waves of different wavelengths corresponding to the absorption line of the gas to be measured. Therefore, the sensors may employ either narrow-band light sources, such as lasers, or wide-band light sources, such as incandescent filaments with optical band-pass filters.
When the gas to be detected is present in the environment within which the sensor is placed, the gas diffuses through the membrane into the measurement cell and there absorbs the light emitted. The absorbed radiation, which for very short time (a few microseconds) is stored as intermolecular vibrational-rotational energy, is quickly released by relaxation to translational energy during which numerous collisions occur between the gas molecules. Translational energy is equivalent to heat, which causes the pressure to rise in the absorption/measurement cell. If the incident light is modulated at a given frequency, a periodic pressure change is generated in the absorption cell.
At the edge of the measurement cell, the microphone captures the pressure modulation. The amplitude of the acoustic signal output is proportional to the radiation energy of the light source and the concentration of the absorbing gas. As a result, when the radiation energy is kept constant, the acoustic signal output can be measured and it delivers a value proportional to an absorbing concentration of gas.
There is quite frequently the need to detect and measure the concentration of multiple gases which are expected to be present or part of the process to be monitored. While it is possible to assign multiple sensors, each devoted to one specific gas, a single sensor distinctively measuring the concentration of multiple gases is undoubtedly a more economic alternative.
Furthermore, due to the nature of their detection principles, optoacoustic gas sensors have limited sensitivity. This is in part due to the effects of measurement cell wall effects, but is also due to environment pressure fluctuations and vibrations of several sources such as ventilation systems. It is therefore desirable to provide an optoacoustic gas sensor having a compensation cell in addition to the measurement cell that compensates for the interference signals generated exactly during gas measurement.
When it comes to reliability, the capability of gas sensors to have reliable self-diagnostic features to ensure the proper functionality of the sensor is undoubtedly most attractive. Most gas sensors do not have such capabilities. In addition, this capability must be technically feasible but also economically justifiable.
Gas sensors must be certified if they are to be installed in areas with intermittent or continuous presence of explosive gases (so-called "hazardous" or "classified" locations). To be certified, the design of a sensor must follow certain guidelines and fulfill strict requirements that are the subject of established standards. The most commonly applied standards for gas sensors relate to either explosion-proof or intrinsically safe design methods. It is therefore desirable to provide a sensor design that takes into consideration the most stringent certification requirements and fulfills either or both design methods.
Power consumption is becoming a crucial issue in the field of gas sensors as they are being increasingly used to detect and measure different gases from remote locations. Providing real-time measurements from distant locations puts a burden on sensors in terms of power consumption. It is therefore desirable to provide a gas sensor that features low power consumption.
It is also desirable to provide a gas sensor that corrects the effects of varying temperature so as to improve measurement accuracy.
It is also advantageous for the sensor output to represent not only the actual gas concentration, but also the gas concentration rate of increase, once a preset threshold has been reached or exceeded. For example, when a sensor is used to detect and measure natural gas (CH4) leaks, the rate of gas concentration increase may provide additional information regarding the severity of the leakage situation.
Accordingly, it is an object of the present invention to provide an optoacoustic gas sensor that can simultaneously measure the presence and concentration of multiple gases.
It is another object of the present invention to provide an optoacoustic gas sensor that compensates for interference signals.
It is another object of the present invention to provide an optoacoustic gas sensor that has reliable self-diagnostic features.
It is another object of the present invention to provide an optoacoustic gas sensor that may be certified as explosion-proof and/or intrinsically safe.
It is still another object of the present invention to provide an optoacoustic gas sensor that has low power consumption.
It is still another object of the present invention to provide an optoacoustic gas sensor that corrects for varying temperature.
These and other objects and advantages will be apparent from the following specification.


The disclosed technology relates to the ornamental and utilitarian features of a device configured to protect the Metatarsal-Phalanges Joints (MPJ) zone of the user's foot when wearing shoes such as dress shoes. The device defines a loop placed around the MPJ zone wherein such loop can be neutral or natural in color to minimize its impact on the style of the shoe or flashy or have its own design that can add “strappiness” or “laciness” or contrasting color. The loop forms a protective layer between the problem areas (e.g. side and top around the MPJ zone) of the foot and the shoe material.

Proper fit is always an issue with women's shoes. Women frequently forego comfort for the sake of style. Not only are such stylish shoes uncomfortable, they can cause callous formations, bruises, and cuts around the metatarsal/phalanges joints (MPJ). There are at least three causes of such discomfort and callous formations. A first cause is improper fit. A second cause is the shoe material rubbing against the delicate skin of the foot for long periods of time. A third cause is the design cut of certain styles of shoes.
With regard to proper fitment of a shoe, one of the most common women's shoe fitment issues relate to the fit around the MPJ zone. While shoe manufacturers offer the standard widths of narrow, medium, and wide such size gradation is insufficient to account for width variations within those categories. A woman's foot that fits a medium, for example, might still feel a painful rubbing at the MPJ zone, and going to the next width category is not an option (the shoe would not stay on the foot). Further, it is very common that one foot is wider than the other (due to bunions, bunionettes or natural asymmetry) making shoe size selection more difficult as no shoe manufacturer or supplier will sell individual shoes as opposed to pairs of shoes, ie. It's not possible to buy a left foot medium and right foot wide without buying two pairs of shoes. And even if they did, the size gradations are too crude leaving the person again to buy a tighter shoe and suffer the pain or buy a wider shoe that flops around.
With regard to shoe material, some shoe materials often cause skin irritation even if the shoe is a perfect fit. The edge of the shoe material rubbing the foot can wear away the skin on the top of the foot where it comes in contact. The constant shifting of weight while walking pushes the foot into the edge of the shoe effectively turning the top of the shoe material into a planer.
With regard to shoe style, the above problems can be exacerbated by certain popular styles of women's shoes including flats, pumps, and any other high heel style shoe.
Prior art solution to the above identified problems include: 1) endure the pain—the majority of women just simply endure the pain, 2) wear less fashionable shoes—women can wear less fashionable shoes than they otherwise would desire, 3) local cover—women can use products such as band-aids® or mole-skin® that are unattractive and cover only a small portion of the trouble area do not reliably stay in place and are not resusable. Similarly, two widely known prior art solutions that are not feasible for women's dress shoes include: 1) socks—they cannot be worn with fancier shoe styles and socks cover the entire foot (not desirable), and 2) panty hose—they are often too sheer and don't provide enough protection.
What is needed is a loop of material that covers substantially all of the trouble area but only the trouble areas where such loop can be neutral or natural in color to minimize its impact on the style of the shoe or flashy or have its own design that can add "strappiness" or "laciness" or contrasting color. Such a foot loop could be designed to change the look of the shoe in many ways since many styles are envisioned. Additionally, appliqués will be available to add another dimension to the look if such is desired.
The disclosed to ornamental and utilitarian technologies address at least the above identified problems by forming a protective layer between the problem areas (e.g. side and top around the MPJ zone) of the foot and the shoe material.


A cosmetic applier comprises a container assembly including a tubular sleeve, a cup holder reciprocable inside the sleeve and a cam for raising and retracting the cup holder. A pomade cup assembly includes a cup carrying pomade and an inverted cup-shaped transparent shroud about the pomade and connected to the top of the cup, the shroud having a diameter at least as great as the inner diamater of the sleeve. Interfitting fastener parts are on the cup and holder. In the preferred version, the fastener is of the permanently locking type. The selected pomade cup may be snapped into the holder and the holder and cup retracted by turning the cam so that the shroud, engaging the sleeve and spread by it, pops off the cup and is freed for easy disposal.

1. Field of the Invention
This invention relates to a cosmetic applier having an insertable pomade cup assembly. More specifically, the invention relates to a lipstick applier in which the container assembly comprising the usual tubular sleeve, its cup holder and the surrounding cam may be marketed and selected separately from the cup assembly comprising the pomade, its cup and a transparent tubular shroud protecting the pomade and connected to the cup. The selected container assembly and pomade cup assembly may be united by the retailer or the purchaser.
2. Description of Related Art including Information Disclosed under .sctn..sctn.1.97 to 1.99
The prior art includes a number of patents wherein a pomade cup assembly may be installed into its lipstick container after purchase. The purpose has usually been to permit the replacement of an old used-up pomade without having to buy an entirely new lipstick container. Such an arrangement can also permit selective replacement of one color pomade for another so that the user can choose a color most suitable with the outfit she wears on a given evening.
More specifically, the prior art includes a number of patents to Claudine Sherman. In her U.S. Pat. No. 2,678,128 she provides a cup in which the pomade is molded, a transparent housing which fits over the cup and pomade, and a cap which fits over the assembly over the bottom. In use, the cap is removed and the cup is inserted into the cup holder of the lipstick container. The transparent housing is then pulled away, exposing the lipstick.
Other Sherman U.S. Pat. Nos. 2,753,991 issued Jul. 10, 1956 and U.S. Pat. No. 2,767,834 issued Oct. 23, 1956 show similar arrangements. In each the pomade cup is pressed into a holder in the lipstick container. In U.S. Pat. No. 2,753,991 a crossbar is provided in the holder and a slot in the bottom of the pomade cup wedges over the bar when the cup assembly is inserted.
U.S. Pat. No. 2,629,489 which issued Feb. 24, 1953 to de Shelly provides a refill cartridge wherein a circumferential band grips the transparent housing and cup.
The U.S. Pat. No. 2,497,950 to Lohr et al issued Feb. 21, 1950 shows a changable lipstick including several pomade-filled cups sold together with a container. The cups have ridges on them and are pushed into a holder in the lipstick container for use and then later pulled out by means of a special apparatus so that other colored pomades may be substituted.
In the Moore et al U.S. Pat. No. 3,230,960 which issued Jan. 25, 1966, a container assembly is provided including a sleeve, cup holder and screw-threaded cam, the cup holder having a head which is releaseably engaged by a socket on the bottom of the pomade cup. A plastic adapter may enclose a replacement pomade and cup, the adapter fitting over the top of the container sleeve which it frictionally engages. In use, with the cup extended, the old cup is exposed above the sleeve and may be snapped out of its head-socket connection in the holder. Subsequently, with the new pomade cup connected, the holder is retracted, and the pomade is withdrawn from the adapter. The empty adapter may be removed from the container sleeve and disposed of.

Cosmetic applier comprising a container assembly and an insertable pomade cup assembly


A light source device and method of making the device uses a substrate, which may be a glass or ceramic substrate, having thru-holes for heat dissipation. The light source device includes a number of light-emitting dies that are mounted on the substrate such that each thru-hole is positioned directly below one of the light-emitting dies.

Light emitting diodes ("LEDs") have many advantages over conventional light sources, such as incandescent, halogen and fluorescent lamps. These advantages include longer operating life, lower power consumption and smaller size. Consequently, conventional light sources are increasingly being replaced with LEDs in traditional lighting applications. As an example, LEDs are currently being used in flashlights, traffic signal lights, automotive exterior and interior lights and display devices.
A typical LED includes an LED die mounted on a substrate, such as a leadframe, and encapsulated in a molded lamp package. Since the light output of an LED is limited, the LED die may be mounted in a reflector cup formed on the substrate to collect the light emitted by the LED die and direct the light upward toward the top of the transparent lamp package. Moreover, the transparent lamp package of the LED may have a domed top, which functions as a lens to focus the light emitted from the LED die.
Different LED-based light source devices have been developed for various lighting applications. A typical LED-based light source device includes a number of LEDs to produce the desired illumination. These LEDs are usually mounted on a printed circuit board (PCB). An important design consideration of an LED-based light source device is heat management. When activated to generate light, an LED die produces a significant amount of heat, which is compounded when there are multiple LED dies in a small area. Unless properly dissipated, the collective heat generated by the LED dies can degrade the performance of the LED dies and even damage the light source device. Thus, the heat dissipation efficiency of the LED-based light source device may limit the density of LED dies that can be included in the device and/or limit the amount of current used to drive the LED dies.
In view of these concerns, there is a need for an LED-based light source device with increased heat dissipation efficiency so that the device can have a higher density of LED dies and/or the LED dies can be driven with higher current.

Light source device and method of making the device

Avago Technologies General IP (Singapore) Pte. Ltd.


A power supply circuit preventing any overvoltage to an electronic element includes a voltage conversion unit and a voltage clamping unit. The voltage conversion unit converts voltage of a power supply into an operation voltage of the electronic element, and outputs the converted voltage through an output terminal of the voltage conversion unit. When the voltage output from the output terminal of the voltage conversion unit is more than the operation voltage of the electronic element, the voltage clamping unit effectively clamps the voltage output from the output terminal of the voltage conversion unit down to the operation voltage of the electronic element.

1. Technical Field
The present disclosure relates to a power supply circuit.
2. Description of Related Art
A central processing unit (CPU) is an expensive and important part of an electronic device, such as a computer. When the CPU is damaged, the electronic device will no longer operate. A high input voltage can damage the CPU.

Power supply circuit for preventing overvoltage


An adapter for coupling connecting pipes for a commercial aircraft comprises an adapter top and an adapter bottom. The adapter bottom has a first adapter pipe that can be positioned within a recess in a floor of the aircraft. An attachment flange is formed to the external circumference of the first adapter pipe, through whose central flange opening the first adapter pipe is led, which attachment flange is positioned on the first adapter pipe end of the first adapter pipe and is attached by one flange side to a bottom floor region of the floor. The adapter top has a second adapter pipe to which a tubular supporting flange is joined. The pipe end region reinforced with said supporting flange of the second adapter pipe is inserted into the pipe cross section of the first adapter pipe.

Aircraft of the "AIRBUS" product family have hitherto not featured an adapter for coupling connecting pipes, which adapter would open up the option wherein with little manual effort corresponding pipe connections for potable water pipes, waste water pipes and vacuum pipes can lead through the floor of a passenger aircraft, without imposing difficulties in the installation of the pipes, and consequently involving a corresponding increased labour outlay. In the past, no such adapter of the type stated was available for pipe installations which for example (intermittently) carry sewage from flushing the toilets (during a flight). Up to now, the installation technology for such sewage pipes, which lead from the passenger deck to the below-floor region and which thus inevitably lead through the floor, involved enlarged holes in the floor through which holes the sewage pipes have been fed to collection containers in place in the below-floor region. For reasons of saving weight, there will not be any alternative in routing such lines because routing lines in an indirect way would understandably involve an increase in aircraft weight. There is thus no need to further consider existing spatial conditions and arrangements. Based on the described routing of sewage pipes it becomes understandable that inadequate sealing-off of sewage pipes leading through the floor against the hole wall has been met with ongoing criticism because the intended tightness in this floor region does not meet the required standards. Furthermore, if one takes into consideration that in the case of large-capacity aircraft, for example the passenger aircraft of the type "A380" pipe connections of the type described in the example lead through several passenger decks, the extent of the sealing loads becomes even clearer, provided said conventional installation technology as shown in the example of the sewage pipes is applied, because the use of floor adapters for vacuum pipes in a commercial aircraft has not hitherto been known in known aircraft types.
Experts know that in aircraft engineering (apart from the presented situation relating to the installation of vacuum pipes) connecting pipes are often used for supplying potable water or for draining waste water, wherein the liquids which are supplied or let out necessarily have to lead through the floor of an aircraft, because the toilets and the wash-rooms are normally installed in the cabin region (passenger region) and it is in these support regions that the connection of corresponding connecting pipes will take place. Although below the floor in the cargo compartment region there are suitable collection containers for the above-mentioned liquids, apart from direct pipe routing through the floor to the above mentioned support regions, which direct pipe routing is not advantageous for service and maintenance reasons, there is only the option of a floor adaptation of the connecting pipes, wherein such a desired adaptation, however advantageous it may seem, will be subject to certain requirements and also difficulties during installation.
At present, Airbus products, in particular those in the long-range fleet, are equipped with adapter plates 110, 140 which comprise a rotationally symmetrical adapter top 120, 150 and adapter bottom 130, 160, and are embedded in a floor plate 107. For attachment, of a known adapter used, to the floor of an aircraft, and for creating a leadthrough from pipes 101, 102 through said floor to pipes 1′, 2′, a technically skilled person will refer to the attached FIGS. 5, 5a and 5b, which said person will independently contemplate and interpret with their accumulated specialist knowledge and experience. It should be added, because it is not clear from the figures, that attachment of the adapter top and adapter bottom within the floor panel takes place in so-called inserts with the use of screws. Furthermore, three quick-closing screws 109 connect the adapter top to the adapter bottom. It should be mentioned that based on the subsequently stated disadvantages these adapter plates used are not being considered for the adaptation of vacuum connections in Airbus products. Aircraft of the type "Airbus" are not fitted with a vacuum adapter on which adaptation of connecting pipes subject to a vacuum, for example for conveying sewage, can be undertaken, in regard to which vacuum adapter there is no model in the state of the art as far as the particular use (adaptation of vacuum pipes) and intended purpose (conveyance of sewage) in an aircraft is concerned. Such solutions for a (comparable) potable-water connection and waste water connection implemented according to the model shown in said figures provided one does not consider the aspect of particular requirements concerning connecting pipes subjected to a vacuum and intended for adaptation are associated with a disadvantage in that during the transport of potable water or waste water (their intended use), isolated leakages occur which are caused by the (not particularly stable) quick-closing connections which are used for fitting the potable water or waste water connecting pipes to the adapter. There is thus a danger that the water which will exit from the leaking positions of the adapter can penetrate to regions situated underneath the aircraft floor, which is likely to cause safety-relevant damage.
Furthermore, installation personnel have often criticised the design of such adapter plates because fitting requires additional installation effort because final connection of the connecting pipes that are connected to the water system or to the waste water system can only take place below the floor. This measure always requires a change in the horizontal plane by the pipe installer, as a result of which the individual technological expenditure relating to time and preparation is unnecessarily increased. A further point of criticism which (in particular in aircraft engineering) deserves particular attention relates to the weight of the adapter, which weight is by no means favourable, and to the large number of parts for each coupling to be established.
An observer will easily recognise the heavy weight purely by noticing the relatively large dimensions of the adapter tops and bottoms, without having to examine in detail the materials used in these adapter components. A technically skilled person versed in aircraft engineering will notice that with the use of these aforementioned adapter plates corresponding integration problems within regions of the aircraft that are difficult to access are at first unavoidable. Such regions that are difficult to access are often encountered, not only during initial fitting out of the aircraft, but also later during service and maintenance. Thus, the installation personnel who will carry out pipe installations for the galleys and toilets of an aircraft of the type "Airbus A340" will not find any identical pipe connections which are matched to each other, because technologically different connection principles are to be observed. This practised installation technology requires a corresponding plurality of parts relating to different below-floor pipes, which plurality is to be taken into account in the connection of two connecting pipes, which connection is inevitably continued through the floor of the aircraft, and which plurality must also be taken into account in the adaptive connection of these pipes to a pipeline adapter firmly seated in the floor, as said plurality nearly doubles in such an arrangement.
These disadvantages, together with those disadvantages stated in the context of the vacuum pipe installation, provide a technically skilled person with sufficient reason to ponder how to improve the various described connection technologies involving a pipeline adapter such that said technically skilled person can state a solution by means of which the stated disadvantages as set out, of the state of the art, can be overcome and replaced by connection technology for advantageous coupling of connecting pipes in a commercial aircraft.
Accordingly, there may be a desire to improve an adapter for coupling two connecting pipes in a commercial aircraft such that it will be possible to attach the adapter without significant labour outlay to an attachment surface, and so that it will be possible, with the adapter, to implement leakage-free (non-dripping and pressure-proof) adaptation of the connecting pipes, which adaptation can be carried out efficiently. In this approach, a reduction in the multitude of different connecting pipes and a reduction in the multitude of components of the adapter is to be achieved, and furthermore, the need for installation personnel to change from one horizontal plane to another when installing the adapter in the floor is to be obviated.

Adapter for coupling connecting pipes in a commercial aircraft