A system and method measures a parameter of body fat using body fat monitoring circuitry provided with a mobile communications device or device cover. A mobile terminal device includes a housing supporting a display, a processor, and a user interface for facilitating user interaction with the mobile terminal device. Body fat monitoring circuitry of the mobile terminal device includes a tactile interface supported by one or both of the housing and a cover of the housing. The monitoring circuitry communicates monitoring signals to a portion of a user's body via the tactile interface. The processor computes a resistance to the communication of the monitoring signals and computes the user's body fat parameter using the computed resistance. An acceleration sensor may be included to provide various pedometer functions.

Weight management through reduction of excess body fat plays a vital role in maintaining good health and fighting disease. Medical evidence has shown that excess body fat poses a major threat to health and longevity. Excess body fat is linked to major physical threats, such as heart disease, cancer, and diabetes. A certain amount of fat, however, is essential to bodily functions. Fat regulates body temperature, cushions and insulates organs and tissues, and is the main form of the body's energy storage.
Weight alone is not a clear indicator of good health, because it does not distinguish between pounds that come from body fat and those that come from lean body mass or muscle. Various body fat measuring devices have been developed to better quantify the amount of body fat as a percentage of total body mass. Although many of these devices provide accurate body fat measurements, such devices tend to be expensive and offer limited functionality beyond a basic measuring capability.
As contemporary lifestyles have become increasingly fast-paced and complicated, the number of personal electronic devices carried on the person has increased. It is not uncommon for an individual to carry a cellular phone, a PDA, some form of calculator, a pager, and a portable personal medical device, such as a body fat measuring device, heart rate monitor or pedometer, for example. The inconvenience of physically transporting and accounting for such devices often results in eliminating certain devices from one's personal inventory of devices. In many cases, personal medical devices, such as body fat monitoring devices, which can enhance exercise regimens and provide motivation for healthier lifestyle habits, are cast aside in favor of more utilitarian devices, such as the now ubiquitous cellular phone.
There is a need for integration of mobile communications and health promoting devices, such as body fat monitoring devices. The present invention addresses this and other needs, and provides additional features and advantages over conventional implementations and techniques.

Body fat monitoring system and method employing mobile terminal


Two pairs of dielectric rod radiators are positioned on an antenna, with one pair in the azimuthal and the other in the elevational plane of the antenna radiation pattern. The axes of each pair are physically canted away from the direction of the main antenna beam. The radiation pattern of the dielectric rod elements is an electromagnetic “well” which is symmetrically located with respect to the axis of the main beam of the antenna with the antenna's beam centered in the “well”. In aiming the antenna, for example, at a transmitting communication satellite, the amplitudes of signals received from the two dielectric rod azimuthal lobes are compared, and signals received from the two dielectric rod elevational lobes are similarly compared to provide servo error information for positioning the antenna beam. Signal processing may utilize a single multiplexed narrow band amplifier.

1. Field of the Invention
This invention relates to a positionable antenna, and in particular to a positionable narrow beam microwave antenna.
2. Description Relative to the Prior Art
The microwave antenna having a linear array of electromagnetic radiating slots is known in the art. The slots serve as dipoles, generally spaced at distances λ/2 apart, (λ=wavelength), and generate a highly directional single lobe radiation beam due to the mutual interference of the dipole outputs. Typically, slots arranged in a square array generate a beam that is narrow in both the azimuthal and elevational planes. An important feature of narrow beam antenna performance depends upon the accurate positioning of the beam in a selected direction to maximize signal transmission or reception. In the prior art, it is known that antenna servo control signals for antenna positioning in the azimuthal and in elevational directions may be derived by "dithering" the beam in the two orthogonal directions. "Dithering" consists in cyclically shifting the antenna's beam from its aimed position to alternately derive "left-right" and "up-down" received signal responses from the displaced beam whose amplitudes are compared and converted into servo control signals for positioning the antenna. Since it uses the r.f. information signal itself, this method generally reduces the signal-to-noise ratio of the antenna, as "dithering" requires the continuous sweeping of the antenna pattern through off axis directions.
It is also known in the art that an appropriately shaped dielectric rod antenna, which may be a ferrite, exhibits directional radiation characteristics when end-fed with microwave electromagnetic excitation. Dielectric rods are particularly effective when configured as elements of a microwave antenna array, and the use of dielectric rods as such directional antenna elements is described in detail in the article entitled "Ferrod Radiator System" by F. Reggia, E. G. Spencer, R. D. Hatcher, J. E. Tompkins, Proceedings of the IRE, 45 (1957) #3.
Seen in FIG. 1, a dielectric rod radiator, 10, has a dielectric shaft, 12, tapered to suppress side lobes, and to match its end impedance to a free space impedance of 377 ohms. This rod, fabricated from a dielectric material which may be a ferrite, has a permittivity of, e.g., 10, and a gain of 35 compared to a standard horn radiator. End fed with 1.5 cm electromagnetic energy, the directional radiation pattern, 14, of such a dielectric rod is shown in FIG. 2. The angle Θ is measured in the plane formed by the axis of the rod and a line perpendicular to the axis, the 0 of angle Θ being in the direction of the line perpendicular to the rod axis. The peak direction of the radiation pattern is along the rod axis, and hence occurs at Θ=π/2. It will also be noted that due to reciprocity the pattern of an antenna is the same both for transmission and reception.

Apparatus and method for control of a precisely positionable high gain microwave antenna


In one embodiment, a method of operating a refrigeration system includes measuring a relative humidity of a container and comparing the measured relative humidity to a humidity set point. The method also includes operating evaporator fans of a refrigeration system when the measured relative humidity is above the humidity set point.

Transporting and storing temperature sensitive cargo over periods of time may require a controlled climate in the space where the cargo is loaded. Climate control includes controlling the temperature of the cargo to be within a certain predefined acceptable range. Controlling the temperature includes bringing the temperature of the cargo into an acceptable range (by refrigerating or heating) and maintaining the temperature within that range. Climate control may also include controlling the humidity of the space where cargo is loaded.
The temperature of temperature sensitive cargo should be kept within predefined acceptable limits. Some cargo must be maintained frozen, and the temperature of any part of the frozen cargo must be kept below a predefined freezing temperature which depends on the cargo, e.g. below 10 degrees Fahrenheit or lower, while commodities such as fresh fruit and vegetables should be kept chilled, but not frozen, to stay fresh.
During operation of a refrigeration system water vapor will condensate on the evaporator and form a layer of ice that will degrade the efficiency of the evaporator and thereby of the refrigeration system. The ice is removed by running a defrosting cycle. Traditionally, defrosting cycles are initiated according to a predetermined schedule at time intervals which may depend on the nature of the cargo and the time since its loading into the container.
Some cargoes need relative humidity to be kept below acceptable upper limits. Some of these cargoes are also sensitive to temperatures, while others are relatively insensitive to temperature. Examples of such products are electronic and optical products, scientific instruments, machinery and metals such as iron and steel that may corrode if the relative humidity is too high, clothing and other textiles where fungus growth can be prevented by keeping the relative humidity low.

Apparatus for controlling relative humidity in a container


A spectroscopic measurement apparatus includes an actuator that is driven by applying a drive voltage, a gap detector that detects a dimension of a gap, and a voltage control section including a feedback loop that controls the drive voltage depending on a detection result of the gap detector. The voltage control section includes a comparator that outputs a voltage signal at a High level VH if an absolute value of a deviation between a drive amount of the actuator and a setting value of the drive amount exceeds a predetermined threshold based on the detection result after a predetermined time elapses from the start of driving of the actuator.

1. Technical Field
The present invention relates to an actuator control device, an optical module, and an electronic apparatus.
2. Related Art
A variable wavelength interference filter is known that includes a pair of substrates facing each other, reflective films respectively disposed on each substrate and facing each other, and electrodes respectively disposed on each substrate and facing each other (for example, JP-A-1-94312).
In the variable wavelength interference filter described in JP-A-1-94312, electrostatic capacitance monitor electrodes facing each other and electrostatic force applying electrodes (electrostatic actuator) facing each other are respectively disposed on each substrate. In such a variable wavelength interference filter, a voltage is applied to the electrostatic actuator by a control circuit and thereby a gap amount (interval dimension) between the reflective films is changed. In addition, a potential of the electrostatic capacitance monitor electrode is detected by an electrostatic capacitance detection circuit and the voltage applied from the control circuit to the electrostatic actuator is finely adjusted (feedback control). As a result, the dimension (gap amount) of the gap between the reflective films can be set to a desired target value.
However, the electrostatic actuator described in JP-A-1-94312 does not include a configuration to confirm whether the gap amount corresponding to an electrostatic capacitance value is equal to a target value of the gap amount and whether the feedback control is normally (correctly) performed when performing the feedback control. Thus, even if the feedback control is abnormally performed and an error occurs, the error cannot be detected.

Actuator control device, optical module, and electronic apparatus


A 3D display device comprises display panel, light-guiding plate and light-emitting unit. The display panel comprises a plurality of sub-pixels with a first short-side width. The light-guiding plate comprises first flat surface, second flat surface, light input surface, and a plurality of light-guiding elements disposed at first flat surface or second flat surface. The light-emitting unit is disposed adjacent to the light input surface. Each light-guiding element comprises a curve shape with at least one inflection point, and a shift range of the curve shape is greater than zero and less than or equal to one and a half times the first short-side width. Light enters light-guiding plate and guided by light-guiding elements, and light is outputted in an alternating arrangement of at least one bright zone and at least one dark zone. A 3D display apparatus is also disclosed.

Field of Invention
The invention relates to a display apparatus and a light-emitting module and a light-guiding plate thereof.
Related Art
Recently, because the manufacturing process and material of light-emitting diode (LED) are improved unceasingly, the light-emitting efficiency of LED is enhanced enormously. Different from the fluorescent lamp or compact fluorescent lamp, LED has some wonderful characteristics, such as less power consumption, long lifespan, high safety, short response time and small size, thus gradually applied to a lighting apparatus, a lighting case or a lighting module. The lighting apparatus is such as an indoor or outdoor lamp, a flashlight, a headlight or taillight of a vehicle, or other kind of the lighting apparatus. The lighting module can be applied as a backlight module of a display apparatus or otherwise.
FIG. 1A is a schematic exploded diagram of a conventional display apparatus 1, and FIG. 1B is a side view of the display apparatus 1.
The display apparatus 1 includes a display panel 11 and a light-emitting module 12. The light-emitting module 12 is a backlight module of the display apparatus 1, emitting the light L through the display panel 11 for displaying images.
The light-emitting module 12 is disposed on a side of the display panel 11, and can include two lateral light sources 121, a light-guiding plate 122 and a plurality of light-guiding elements 123. The lateral light sources 121 are instanced as two LED light bars. They are disposed on two opposite sides of the light-guiding plate 122, respectively, and emit the light L entering the light-guiding plate 122 through a light input surface I of the light-guiding plate 122. Each of the light-guiding elements 123 is white ink in a form of an oblique strip, and is disposed on a bottom surface B1 of the light-guiding plate 122 by coating. The light is guided to the center portion of the light-guiding plate 122 from the lateral sides of the light-guiding plate 122 by the total reflection. The light-guiding elements 123 can interfere with the total reflection of the light so that the light can be emitted through a light output surface O of the light-guiding plate 122 and towards the display panel 11 for displaying images.
However, when the light L is outputted through the light output surface O of the light-guiding plate 122 and towards the display panel 11, the light output on the light output surface O is formed into an alternate form (alternating arrangement) of bright and dark oblique strips. For example, the odd strips are bright and the even strips are dark. By adding the influence of the light-shielding layer (i.e. the opaque black matrix, not shown) disposed in the display panel 11 in the form of strips, the light outputted through the display panel 11 will generate interference fringes (only one interference fringe is shown in the area A of FIG. 1C while the rest are not shown) due to the diffraction, shown by the area A in FIG. 1C (in which the straight strips M are caused by the light L passing through the light-shielding layer, and the oblique strips N are caused by the light on the light output surface O in an alternate form (alternating arrangement) of bright and dark oblique strips). The interference fringes are the so-called Moiré phenomenon, decreasing the display quality of the display apparatus 1.
Therefore, it is an important subject to provide a light-emitting module and a display apparatus that can change the light output form and interfere with interference fringes to improve the display quality.

Display apparatus and light-emitting module and light-guiding plate thereof


A method and system for open-loop acquisition of a pseudo-noise (PN) encoded QPSK burst signal is provided. The method includes the steps of determining a PN correlation accumulation (PNCA) threshold and a sync threshold. Searching for a burst signal synchronization by searching a burst preamble for a sync word exceeding the sync threshold. In response to detecting the sync word, performing a PNCA of at least 256 bits following the detected sync word and comparing the PNCA of the at least 256 bits with the PNCA threshold. The comparison further includes the step of verifying that the PNCA of the 256 bits following the detected sync word exceeds the PNCA threshold and then verifying sync word detection. Next, using the burst preamble an estimate of carrier signal frequency is determined; and using a subsequent burst preamble carrier signal frequency and carrier signal phase is determined.

1. Field of the Invention
The present invention relates to spread spectrum communication systems using PN coding techniques and, more particularly, to acquiring a phase of the PN code.
2. Prior Art
Spread spectrum (SS) systems, which may be CDMA systems, are well known in the art. SS systems can employ a transmission technique in which a pseudo-noise (PN) PN-code is used as a modulating waveform to spread the signal energy over a bandwidth much greater than the signal information bandwidth. At the receiver the signal is de-spread using a synchronized replica of the PN-code.
There are, in general, two basic types of SS systems: direct sequence spread spectrum systems (DSSS) and frequency hop spread spectrum systems (FHSS).
The DSSS systems spread the signal over a bandwidth fRF±Rc, where fRF represents the center bandpass carrier frequency and Rc represents the PN-code maximum chip rate, which in turn is an integer multiple of the symbol rate Rs. Multiple access systems employ DSSS techniques when transmitting multiple channels over the same frequency bandwidth to multiple receivers, each receiver having its own designated PN-code. Although each receiver receives the entire frequency bandwidth only the signal with the receiver's matching PN-code will appear intelligible, the rest appears as noise that is easily filtered. These systems are well known in the art and need not be discussed further. As noted, the DSSS system PN-code sequence spreads the data signal over the available bandwidth such that the carrier appears to be noise-like and random to a receiver not using the same PN-code.
In communication systems having multiple central base stations or network access points (AP) and multiple subscriber units or consumer premise equipment (CPE), e.g., fixed or mobile units, the CPE may receive and decode signals transmitted by each of the APs. It will be appreciated that in burst communication systems it is desirable to provide a method and system to quickly determine the strongest or desirable transmitting station; and to quickly open-loop synchronize with a forward burst signal communicated by the transmitting station.

Acquisition of a synchronous CDMA TDD QPSK waveform using variable thresholds for PN and burst synchronization


A power conversion system includes one power conversion device and one or more power conversion devices. The power conversion device includes a power converter that controls output voltage to be a preset voltage to apply the preset voltage to a load on the basis of an output from a power supply. The power conversion device controls the power converter so that a detected value of the first voltage detected by a voltage detector becomes a preset voltage value. The power conversion devices each include a power converter that controls output current to be a preset current to supply the preset current to the load on the basis of an output from a power supply. The power conversion devices each controls operation of the power converter on the basis of the detected value of the first voltage. The power conversion device controls operation of the power converter by changing the first voltage.

Patent Literature 1 mentioned below teaches a technology for stabilizing power supply to a load connected in common in a power conversion system having a configuration in which first and second power conversion devices are connected in parallel between respective power supplies for the first and second power conversion devices and the common load.
Specifically, according to Patent Literature 1, when power input to the first power conversion device from the load is detected, a power path between the second power conversion device and the load is disconnected. This avoids interruption of power supply from the first power conversion device to the load due to a protective function, and stabilizes power supply to the load.


According to one embodiment, a cartridge includes a main explosive and an exploding foil initiator housed in a case. The exploding foil initiator includes metallic strips that are operable to initiate explosion of the main explosive in response to an electrical signal.

A cartridge actuated device (CAD) generally refers to a type of device that may be actuated by an explosive charge. Examples of such cartridge actuated devices include powder-actuated tools, such as explosive charge powered nail guns or various types of military armament, such as bomb racks, ejection type missile launchers, ejection seats, chaff dispensers, and the like. Energy to actuate these cartridge actuated devices may be supplied by an explosive encased in a cartridge that operates in a manner similar to a shell used in a firearm. Using these cartridges, a relatively small initiation force may be able to trigger a relatively larger amount of energy for actuating the cartridge actuated device.

Exploding foil initiator actuated cartridge


A ceramic material, having the general formula: EQU A.sub.x B.sub.y O.sub.2-.delta.. wherein. x.ltoreq.1 and y.ltoreq.1 and -1.delta.<1, and PA1 A is one or more metals selected from the group of Ti, PA1 Zr, Hf, Ce and Th or mixtures thereof; PA1 B is at least two metals selected from group 2a, 3b and the lanthanide group of metals.

1. Field of the Invention
The present invention relates to a ceramic material, in particular to fluorite type ceramics for use in the preparation of ion and/or electronic conducting ceramic products, in particular for membranes useful in the separation of oxygen and oxygen containing gas mixture and for electrolytes in fuel cells and electrochemical reactors.
2. Description of the Related Art
Fluorite ceramic materials for use in oxygen transport membranes have the general formula: EQU A.sub.x B.sub.y O.sub.2-.delta.
where
x.ltoreq.1 and y.ltoreq.1 and -1<.delta.<1, and PA1 A is one or more metals selected from the group of Ti, PA1 Zr, Hf, Ce and Th, PA1 B is Sm plus at least one metal selected from the group 2a and 3b and other lanthanides. PA1 x.ltoreq.1 and y.ltoreq.1 and -1<.delta.<1, and A is one or more PA1 metals selected from the group of Ti, Zr, Hf, Ce and Th, PA1 B is at least two metals selected from the group 2a and 3b and other lanthanides.
Classical ceramic materials for oxygen conductors are based on zirconia doped with metal such as Y, Mg and Ca.
Other ceramic oxygen conductors are based on ceria doped with metals such as Y, Sm and Gd. These materials may exhibit mixed ionic and electronic conductivity depending on oxygen partial pressure. The ceria based materials have a higher conductivity than the zirconia based materials at temperatures below 1000.degree. C., which makes the ceria based ceramics useful for commercial oxygen separation, fuel cell applications and catalysts. However, prices for pure ceria and pure dopants are prohibitive for more wide-spread commercialization. Furthermore, the pure mixed oxides typically used may be very refractory and very difficult to sinter into dense ceramic components.


A retuning process particularly useful with an Ar/H2 smoothing anneal by rapid thermal processing (RTP) of a silicon-on-insulator (SOI) wafer performed after cleavage. The smoothing anneal or other process is optimized including a radial temperature profile accounting for the edge ring and exclusion zone and the vertically structured SOI stack or other wafer gross structure. The optimized smoothing conditions are used to oxidize a bare silicon wafer and a reference thickness profile obtained from it is archived. After extended processing of complexly patterned production wafers, another bare wafer is oxidized and its monitor profile is compared to the reference profile, and the production process is adjusted accordingly. In another aspect, a jet of cooling gas is preferentially directed to the edge ring and peripheral portions of the supported SOI wafer to cool them relative to the inner wafer portions.

Rapid thermal processing (RTP) is a well known process used in the fabrication of semiconductor integrated circuits when it is desired to quickly heat a wafer or other substrate to a relatively high temperature required for a thermally activated process and to thereafter quickly cool the wafer. RTP chambers typically include an array of high-intensity incandescent lamps, often tungsten halogen lamps, which together with reflector cavities around the lamps direct high-intensity infra-red, visible, and near-ultraviolet radiation toward the wafer. The lamps can be quickly turned on and off, and wafer temperatures in excess of 1000° C. can be achieved in times on the order of 10s or less. An example of such an RTP chamber is the Radiance RTP chamber available from Applied Materials, Inc. of Santa Clara, Calif.
Recently, RTP has been applied to the formation of Silicon-on-Insulator (SOI) wafers fabricated by the cleavage technique developed by SOITEC. In this process, as illustrated in the cross-sectional view of FIG. 1, energetic hydrogen ions H+ are implanted at a predetermined depth from the top surface of a silicon donor wafer 10 to form a hydrogen-rich layer 12. The top surface is then oxidized to form an oxide layer 14 of SiO2, as illustrated in the cross-sectional view of FIG. 2. The oxide layer 14 may have a thickness of about 150 nm, which consumes part of the silicon above the hydrogen-rich layer 12 leaving an underlying silicon layer 16. Exemplary thicknesses are 50 nm for the silicon layer 16 and 150 nm for the oxide layer 14 although the thickness may vary according to the eventual use of the SOI wafer. As illustrated in the cross-sectional view of FIG. 3, the donor wafer 10 is then inverted and bonded by a thermal process to a second, handle silicon wafer 20. Importantly for some aspects of the invention, present bonding techniques require the donor wafer 10 to be somewhat smaller than the handle wafer 20 so that a peripheral edge exclusion 22 develops at the top of the handle wafer 20 outside of the SOI stack. For a 300 mm SOI wafer, the edge exclusion 22 may be approximately 1 to 3 mm wide.
In one method of obtaining the SOI wafer, the hydrogen-rich layer 12 is stressed and chemical or mechanical techniques are used to cleave the bonded wafers 10, 20 along the cleavage line of the hydrogen-rich layer 12, leaving an SOI wafer 24 illustrated in the cross-sectional view of FIG. 4. The SOI wafer 24 includes the monocrystalline silicon layer 16 electrically isolated from the silicon handle wafer 20 by the insulating oxide layer 14. SOI wafers have many uses. Very advanced silicon integrated circuits can be formed in the silicon layer 16 with virtually no leakage or parasitic capacitance to or through the silicon substrate 20, thereby lowering the power consumption and increasing the processing speed of the integrated circuit form in the isolated silicon layer 16. SOI wafers have other uses including micro electromechanical system (MEMS) wafers in which electrically actuated micro structures are formed in silicon layers.
However, the cleavage process does not leave a smooth upper surface in the silicon layer 16. Instead, as illustrated in the expanded cross-sectional view of FIG. 5, an upper surface 26 of the silicon layer 16 is very rough, exhibiting peaks and valleys. It has been found that an RTP anneal in an ambient of argon and hydrogen gases for 30s at 1200° C. is effective at smoothing the structure to form a smooth upper surface 28, illustrated in FIG. 6.
There are other methods of obtaining SOI wafers by layer cleaving, some of which are described by Wolf in Silicon Processing for the VLSI Era, vol. 4: Deep-Submicron Process Technology, Lattice Press, 2002, pp. 527-550. Any layer having a cleaved surface is expected to show roughness that needs to be smoothed.
An RTP chamber is well suited for the required smoothing anneal. However, it has become apparent that the temperature must be closely controlled across the wafer. Variations in temperature of as little as 1° C. can cause a defect known as crystal slip, a crystallographic line defect that may extend for distances that may be visible. The slip defect is equivalent to a stress-induced fracture of the monocrystalline silicon layer 16. Any chip containing a slip defect is either inoperative or subject to early failure. The Radiance RTP chamber includes pyrometry and temperature control based on separate control of multiple, for example, seven annular heating zones. The temperature control should be able to provide the required temperature uniformity of 1° C. at 1200° C. Nonetheless, SOI wafers have continued to exhibit unacceptable number of slip defects.
Neyret et al. in U.S. Pat. No. 6,853,802 have suggested that the slip problem arises from the edge exclusion 22. Their solution is to include an extra ring around the wafer periphery to adjust the thermal control at the wafer edge exclusion 22. This solution however is felt to be inflexible since the extra ring needs to be optimized for the different combinations of silicon and oxide thicknesses.

Edge temperature compensation in thermal processing particularly useful for SOI wafers


An article for protecting the cam of a compound bow that includes a member extending from a limb of the compound bow and disposed in overlapping arrangement with the cam. The member extends beyond the cam such that the cam is elevated from a surface upon which the compound bow is placed. The member is positioned at an angle of greater than 0 and less than 180 degrees relative to the bow limb such that the member may be used as a stand and to provide vibration dampening functions.

1. Field of the Invention
The invention relates to an article that is especially useful for protecting the cam area of a compound bow from contact with the ground, for functioning as a compound bow stand, and for dampening vibration.
2. Description of the Related Art
A compound bow is a bow that has pulleys or cams at the end of each limb through which the bow string passes. As the string of the bow is pulled back (drawn), the pulleys or cams turn. The action of the cams reduces the amount of force needed to completely draw the bow. Compound bows also have the advantage of being less affected by changes in temperature and humidity such that superior accuracy, velocity, and distance are achieved in comparison to the traditional longbow.
In the most common compound bow models, there is the riser (body) into which limbs are attached. At the end of each limb there is a cam, the shape of which generally is round or oval but may vary. The cams normally have two concentric oval or more irregular shaped perimeters around which the string and cables go. Cables travel between the cams and at one end are attached to the string, while at the other end the cables are attached to the cam axles.
The materials from which a compound bow is made can be quite varied. The riser of compound bows is usually made of aluminum and magnesium, while the limbs to which the cams are attached typically are made of composite materials. Bowstring is normally made of high-modulus polyethylene.
Many devices for attachment to a compound bow are known to exist. For example, U.S. Pat. No. 7,036,497 discloses a bow stand that has a base that attaches to the riser and a pair of legs that attach to, and extend down from, a limb of the bow. While such a configuration may be suitable for its intended purpose, the invention of the '497 patent does not provide any direct protection or vibration dampening ability to the cam area.
U.S. Pat. No. 7,089,923 discloses a compound bow press that allows the user to relieve tension on the bow limbs such that the strings can be removed or the bow otherwise serviced. The press consists of two members that are mounted on a limb near each cam and that extend at a zero degree angle relative to the end of the limb. Due to this angle, each cam (and string) is left unprotected from contact with dirt or other foreign substances in the event that a user wants to set the limb end of the bow perpendicular to the ground (a common resting position).
Hence, it would be useful to have a simple and inexpensive all-in-one cam protector that additionally functions as a stand and a vibration dampener.


An insulating film is formed on a semiconductor substrate, and an Al electrode pad is provided on the insulating film. The pad is electrically connected to a positive element by means of a signal line. A protection film is formed on the pad and insulating film. First and second openings are formed in the protection film. A barrier metal layer is formed on the inner periphery of the first opening and on the protection film. An Au bump is formed on the barrier metal layer. The Al electrode pad is exposed through the second opening.

1. Field of the Invention
This invention relates to a semiconductor device capable of preventing cracks in the vicinity of electrode pads.
2. Description of the Related Art
FIG. 6 is a plan view showing a conventional semiconductor device. As is shown in FIG. 6, a positive element region 12 is provided on a semiconductor substrate 11, and a plurality of electrode pads 13 are provided thereon around the region 12. Each electrode pad 13 is electrically connected to the region 12 by means of a signal line 14, and also to a package terminal (not shown) by the ILB (Inner Lead Bonding). A source voltage is supplied to the positive element region 12 through the package terminal, thereby supplying input/output signals.
With the development of a technique for refining a positive element provided in the positive element region 12, the integration density in the region 12 has been increased. Therefore, many signal lines and electrode pads are necessary.
FIG. 7 shows a conventional semiconductor device having many electrode pads, in which elements similar to those shown in FIG. 6 are denoted by corresponding reference numerals, and explanation will be given of only different elements.
The number of positive elements provided in a positive element region 15 is larger than that of the elements provided in the region 12 shown in FIG. 6. Accordingly, the numbers of signal lines 14 and electrode pads 13 are larger than those in FIG. 6.
FIG. 8 is an enlarged sectional view, taken along line 8--8 of FIG. 7. A first insulating film 16 is formed on a semiconductor substrate 11. Electrode pads 13 are provided on the first insulating film 16. A second insulating film 17 having openings 17a is formed on the electrode pads 13 and first insulating film 16 such that the openings 17a are arranged above the electrode pads 13.
As is shown in FIG. 7, where many electrode pads 13 are formed, the distance between each adjacent two pads is narrow. Thus, stress exerting upon the first and second insulating films 16 and 17 at the time of the ILB is high. Therefore, as is shown in FIG. 8, cracks 18 and 19 may occur under the electrode pad 13 and between the pads 13. As a result, it is possible for water to sink into the cracks 18 and 19, resulting in a leakage of electricity or corrosion of the pads.


A calibration method for an X-ray measuring device includes mounting a calibration tool on a rotating table, identifying centroid positions from an output of an X-ray image detector, calculating projection transformation matrixes from the centroid positions and known relative positional intervals, repeating to identify the centroid positions from the output of the X-ray image detector and to calculate the projection transformation matrixes from the centroid positions and known relative positional intervals while the rotating table is rotated twice or more by a predetermined angle, and calculating a rotation center position of the rotating table on the basis of the projection transformation matrixes. The calibration method thereby allows easy calculation of the rotation center position of the rotating table on which an object to be measured is mounted in a rotatable manner, with the simple process.

Conventionally, X-ray measuring devices (e.g., X-ray computed tomography scanners for measurement), which can measure a three-dimensional shape of an object to be measured using an X-ray, have been primarily used for observation and inspection of defects, such as voids in casting parts, welding defects in welded parts, and defects in circuit patterns of electronic circuit parts, which are difficult to identify from external appearance. However, in recent years, the increasingly widespread use of 3D printers have increased demands for 3D measurement of the interior of workpieces with improved accuracy. To meet these demands, the X-ray measuring devices are expected to further increase the accuracy of dimension measurement is required of.
To perform a high accurate dimension measurement by the X-ray measuring device, as described in Japanese Patent Application Laid-Open No. 2000-298105, it is important to perform various calibrations specific to the device prior to the start of the measurement.

This patent is subject to a terminal disclaimer.

Calibration method for X-ray measuring device


A semiconductor device includes an N-type insulated-gate field-effect transistor including a first insulating layer that is provided along side walls of a gate electrode, has a negative thermal expansion coefficient, and applies a tensile stress to a channel region of the N-type insulated-gate field-effect transistor. The device also includes a P-type insulated-gate field-effect transistor including a second insulating layer that is provided along side walls of a gate electrode, has a positive thermal expansion coefficient, and applies a compression stress to a channel region of the P-type insulated-gate field-effect transistor.

1. Field of the Invention
The present invention relates generally to a semiconductor device, and the invention is applicable to, e.g. a transistor in which the mobility of electrons or holes is varied by applying a stress to a semiconductor substrate.
2. Description of the Related Art
In the prior art, as one of active devices that constitute an LSI (large-scale integration), there is known an insulated-gate field-effect transistor (hereinafter referred to as "transistor") that is represented by a MOS (metal oxide semiconductor) transistor or a MIS (metal insulator semiconductor) transistor. With development in fine patterning of the transistors, the number of transistors in the LSI has become enormous. Being in direct proportion to the integration level, the heat emitted from the transistors becomes more and more intensive as the number of the transistors increases. As a result, the degree of lattice vibration of the crystal lattice of, e.g. silicon that forms the transistor becomes higher and the corresponding thermal disturbance becomes more and more severe, decreasing the mobility of electrons or holes (carriers).
To solve this problem, a semiconductor device has been proposed, wherein an insulating material that imparts a stress is buried in suitable places around the transistors and, as a result, a desired stress is applied to the channel region of the transistor, thus improving the mobility of electrons or holes (see Jpn. Pat. Appln. KOKAI Publication No. 2004-63591, for instance).
In this structure, however, the stress that can be imparted by the insulating material is invariable in relation to a temperature rise of the semiconductor substrate, etc. Thus, when the temperature of the LSI rises from room temperature to high temperatures (e.g. about 200° C.), the effect of the stress becomes insufficient due to the intensified thermal disturbance of silicon, etc. As a result, the mobility of electrons or holes decreases.
Consequently, there is such a tendency that the mobility of electrons or holes (carriers) becomes lower as the temperature of the LSI rises.

Semiconductor device that is advantageous in operational environment at high temperatures


Techniques for managing permissions to cloud-based resources with session-specific attributes are described. A first request to create a first session to permit access to resources of a provider network is received under an assumed role. The first request is permitted based on an evaluation of a rule associated with the role. Session data including a user-specified attribute included with the first request is generated. A second request to perform an action with a resource hosted by the provider network is received. The user-specified attribute is obtained from the session data based at least in part on the second request. The second request is permitted based on an evaluation of another rule with the user-specified attribute.

Business of all types often face computing security challenges such as managing who has access to what. For example, certain users (e.g., users, applications, etc.) might have access to certain resources (e.g., computers, applications, databases, etc.) but not others. Information Technology ("IT") personnel often manage access control. As the size and complexity of organizations grow, managing access control can become a significant and complex effort. Users joining and/or leaving the organization, moving between projects or teams, deploying software applications, etc. creates a continually changing environment, and typical hands-on access management approaches often fail to scale. Further compounding the complexity of access control is the rise of cloud-based computing—now IT personal need to manage both access control to computing resources of their own enterprise as well to cloud-based computing resources.

Managing permissions to cloud-based resources with session-specific attributes


A method of manufacturing a semiconductor device includes removing a low-resistivity metal film, conductive layer, third insulating film and an upper part of the electrode layer in a gate electrode isolation region with a gate forming pattern serving as a mask, forming a protecting film so that the protecting film covers the low-resistivity metal film, conductive layer, third insulating film and upper surface of the electrode layer, removing the protecting film formed on the upper surface of the electrode layer located in the upper surface of the electrode layer in the gate electrode isolation region, removing the electrode layer in the gate electrode isolation region, and removing residue of the protecting film.

1. Field of the Invention
The present invention relates to a semiconductor device with a structure that element isolation regions are formed so as to be self-aligned with gate electrodes and a method of manufacturing the same.
2. Description of the Related Art
With recent reduction in the design rules, semiconductor devices have employed a structure that element isolation regions are formed so as to be self-aligned with gate electrodes. As one of such semiconductors, JP-A-2003-78047 discloses a NAND flash memory. The disclosed NAND flash memory is manufactured as follows. A first insulating film serving as a gate insulating film is formed on a principal surface of a semiconductor substrate. A first electrode layer (corresponding to an electrode layer) serving as a floating gate electrode is formed on the first insulating film. Subsequently, the first electrode layer, first insulating film and a flat part of the semiconductor substrate are selectively removed so that element isolation trenches are formed. Next, an insulating film (corresponding to a second insulating film) is buried in the element isolation trenches so that element isolation insulating films are formed, respectively. The element isolation insulating film is etched until a part of the element isolation insulating film is located at a level between the first electrode layer and the first insulating film. Subsequently, a second insulating film (corresponding to a third insulating film) is formed as an interpoly insulating film so as to cover the whole first electrode layer and the whole element isolation insulating film.
Subsequently, a second electrode layer (corresponding to a conductive layer and a low resistivity metal film) is formed on the second insulating film. A gate processing pattern is formed on the second electrode layer. The second electrode layer, the second insulating film and the first electrode layer are removed with the gate processing pattern serving as a mask. In this case, since an upper part of the insulating film formed in the element isolation region has previously been etched so as to be nearly at the level of an upper surface of the first insulating film, etching residue can be suppressed with respect to the first electrode layer on the sidewalls of the second insulating film, occurrence of short circuit can be suppressed between gate electrodes.
In the above-described method, however, sidewalls of the first and second electrode layers are exposed when the upper part of the second insulating film is etched so as to be nearly at the level of an upper surface of the first insulating film. Accordingly, there is a possibility that electrical characteristics of the first and second electrode layers may be deteriorated. In particular, the possibility of deterioration becomes higher when these electrode layers contain a low resistivity metal film.

Semiconductor device and method of manufacturing the same


The present invention is directed to a method for producing a high moisture, non-fat cheese sauce. In accordance with the method, a skim milk cheese having from about 40% to about 60% moisture and a milk protein source having from about 3% to about 70% moisture are heated to an elevated temperature of from about 160.degree. F. to about 190.degree. F. with agitation so as to form a homogeneous mixture of the skim milk cheese and the milk protein source. The agitation at the elevated temperature is continued while a polyphosphate complexing salt, starch and a gum are added to the heated mixture. The agitation at the elevated temperature is continued for a period of time sufficient to gelatinize the starch and permit the polyphosphate complexing salt to interact with the casein of the skim milk cheese and the milk protein source and to form a stable, high moisture, non-fat cheese sauce. The cheese sauce is then packaged while the temperature of the cheese sauce is above about 100.degree. F.

Processed cheese products containing a substantial level of fat are well known in the food industry and Standards of Identity have been established by the United States Food and Drug Administration for several types of processed cheese products.
In accordance with the Standards of Identity, pasteurized processed cheese is the food prepared by comminuting and mixing, with the aid of heat, one or more natural cheeses of the same or two or more varieties. Specifically excluded from use in the preparation of pasteurized processed cheese, however, are cream cheese, neufchatel cheese, cottage cheese, low fat cottage cheese, cottage cheese dry curd, cooked cheese, hard grating cheese, semisoft part-skim cheese, part-skim spice cheese and skim milk cheese. The pasteurized processed cheese is prepared by heating the natural cheese with an emulsifying agent while mixing into a homogeneous plastic mass. During its preparation, pasteurized processed cheese is heated for not less than 30 seconds at a temperature of not less than 150.degree. F. The moisture content of pasteurized processed cheese cannot be more than 43%, except that the moisture content of pasteurized process washed curd cheese or pasteurized process colby cheese cannot be more than 40%. The moisture content of pasteurized process Swiss cheese or pasteurized process Gruyere cheese is not more than 44%. The moisture content of pasteurized process Limburger cheese is not more than 51%.
The fat content (dry basis) of pasteurized processed cheese cannot be less than 47% except that the fat content of pasteurized process Swiss cheese is not less than 43% and the fat content of pasteurized process Gruyere cheese is not less than 45%.
The emulsifying agents prescribed for use in the manufacture of pasteurized process cheese are one or any mixture of two or more of the following: monosodium phosphate, disodium phosphate, dipotassium phosphate, trisodium phosphate, sodium metaphosphate (sodium hexametaphosphate), sodium acid pyrophosphate, tetrasodium pyrophosphate, sodium aluminum phosphate, sodium citrate, potassium citrate, calcium citrate, sodium tartrate, and sodium potassium tartrate.
Pasteurized process cheese food is prepared in a manner similar to that of pasteurized processed cheese except that the moisture content is not more than 44% and the fat content is not less than 23%. For pasteurized processed cheese food, addition of cream, milk, skim milk, buttermilk, cheese whey and any of the foregoing from which part of the water has been removed can be used. Anhydrous milkfat, dehydrated cream, albumin from cheese whey and skim milk cheese can also be used in pasteurized processed cheese food. The same emulsifying agents permitted in the manufacture of pasteurized processed cheese can also be used in the manufacture of pasteurized processed cheese food.
Pasteurized process cheese spread is prepared in a manner similar to pasteurized processed cheese and pasteurized processed cheese food. The moisture content of a pasteurized processed cheese spread is more than 44%, but not more than 60%, and the fat content is not less than 20%. The same emulsifying agents can be used. In addition, the use of gums is permitted in the manufacture of pasteurized processed cheese spread. The gums can be selected from the group consisting of carob bean gum, gum karaya, gum tragacanth, guar gum, gelatin, sodium carboxymethyl cellulose, carrageenan, oat gum, sodium alginate, propylene glycol alginate and xanthan gum. The total weight of the gums cannot be more than 0.8% of the weight of the finished pasteurized processed cheese spread.
The above described processed cheese products have a body and texture such that they are either sliceable or spreadable. It would be desirable to provide a high moisture, non-fat cheese sauce which has a lower viscosity than the heretofore known processed cheese products and which is shelf-stable with aseptic packaging. With increasing consumer awareness, the focal point of the food industry is on reducing fat and calorie consumption. Low-fat, low calorie foods, which look and taste similar to their full fat, higher calorie counterparts, are eagerly sought by the consumer. Researchers in the food industry have concentrated on developing food products which are nutritious and palatable and which contain substantially reduced levels of fat containing ingredients. This is particularly true in the dairy industry, where low calorie, low-fat products, such as skim milk, yogurt and reduced fat ice cream have been successfully marketed. The high fat levels associated with processed cheese products have been thought to be necessary to maintain a desirable creamy mouthfeel associated with pasteurized processed cheese products. The combination of high total solids, contributed in part by the high fat content, and the relatively low pH have been necessary to provide shelf stability in shelf-stable, pasteurized process cheese products.
U.S. Pat. No. 4,689,239 to Rispoli et al., for example, is directed to a process for producing an aseptically processed, natural, dairy-based sauce. In accordance with the process of the Rispoli, et al. patent, a combination of 40 to 80% by weight of whole milk or an equivalent amount of non-fat dry milk and water, 0 to 25% by weight of heavy cream, 1 to 15% by weight of butter, 2 to 20% by weight of corn starch which has a majority of amylopectin, 1 to 8% of high amylose corn starch comprising greater than 50% amylose and 0 to 40% by weight of flavors and particulates is heated to a temperature of from 140.degree. F. to 190.degree. F. for from 10 minutes to about 30 minutes. The heated blend is homogenized and the homogenized blend is again heated to a temperature exceeding 250.degree. F. for from about 10 seconds to about 120 seconds. This blend is then cooled and held for a period of time sufficient to increase the blend viscosity to 3,000 to 30,000 centipoise. The Rispoli, et al. patent does not utilize any cheese components and any cheese flavor associated with the dairy-based sauce of the Rispoli, et al. patent must be imparted by use of added flavors.
It is a principal object of the present invention to provide a method for producing a high moisture, non-fat cheese sauce from skim milk cheese.
It is another object of the present invention to provide a method for producing a high moisture, non-fat cheese sauce from skim milk cheese which is shelf-stable and which has a dippable consistency suitable for multiple product applications, such as dips, spreads, sauces and as an ingredient in frozen entrees and side dishes.

Method of making a high moisture non-fat cheese sauce


A video coding method enables reduction in the decrease in the efficiency of coding a video and enhancement of the image quality of the resulting decoded video. The video coding method includes predicting a video signal to generate a prediction signal; calculating, as a prediction error signal, the difference between the video signal and a prediction signal; and generating a reconstructed video signal by reconstructing the video signal based on the prediction signal and the prediction error signal. The video coding method also includes determining filter data items that are used to filter each of at least two of the prediction signal, the prediction error signal, and the reconstructed video signal; and coding the determined filter data items based on the cross correlations between the determined filter data items.

1. Technical Field
The present invention relates to video coding method of coding video signals and video decoding method of decoding the coded video signals, and in particular to methods of coding and decoding signals using filters for filtering the signals resulting from the coding and decoding.
2. Background Art
At present, the most of standardized video coding algorithms are based on hybrid video coding. Typically, hybrid video coding methods combine several different lossless and lossy compression schemes in order to achieve a desired compression gain. Hybrid video coding is also the basis for the ITU-T standards (the H.26× standards such as H.261 and H.263) as well as the ISO/IEC standards (the MPEG-X standards such as MPEG-1, MPEG-2, and MPEG-4). The most recent and advanced video coding standard is currently the standard denoted as H.264/MPEG-4 advanced video coding (AVC) which is a result of the standardization efforts by joint video team (JVT) that is a joint team of ITU-T and ISO/IEC MPEG groups.
A video signal input to an encoder is a sequence of images called frames. Each frame is a two-dimensional matrix of pixels. All the above-mentioned standards based on hybrid video coding include subdividing each individual video frame into smaller blocks each consisting of a plurality of pixels. Typically, a macroblock (usually denoting a block composed of 16×16 pixels) is an image element as a basic unit of coding. However, various particular coding steps may be performed for smaller image elements which are, for example, submacroblocks having a size of 8×8, 4×4, 16×8, or the like, or other units of blocks.
Typically, the coding steps in a hybrid video coding include a spatial and/or a temporal prediction. Accordingly, each current block to be coded is first predicted from previously coded video frames, that is, by using either the blocks in its spatial neighborhood or blocks from its temporal neighborhood. A block that is calculated next is a difference between the current block to be coded and a prediction result that is also referred to as a prediction residual or a prediction error signal. The next coding step is to transform a residual block (a prediction error signal) from the spatial (pixel) domain to a frequency domain. The transform aims at reducing the redundancy of the residual block. The still next coding step is to quantize the transform coefficients. In this step, the actual lossy (irreversible) compression is performed. Usually, the compressed transform coefficient values (quantized coefficients) are further compacted (losslessly compressed) by means of an entropy coding. In addition, supplementary information necessary to reconstruct the coded video signal is coded and provided together with the coded video signal. This information is, for example, information about a spatial and/or temporal prediction, the amount of quantization, or the like.
FIG. 1 is a block diagram showing an example of a typical video coding apparatus (encoder) 100 compliant with the H.264/MPEG-4 AVC standard. The H.264/MPEG-4 AVC standard is a combination of all the above-mentioned coding steps. A subtractor 105 first determines differences between a current block to be coded in an input video image (input signal) and a corresponding prediction block (a prediction signal). This difference is used to predict the current block to be coded. In H.264/MPEG-4 AVC, the prediction signal is generated either by a temporal prediction or by a spatial prediction. The type of prediction can be varied on a per frame basis or on a per macroblock basis. Macroblocks predicted using temporal prediction (inter prediction) are called inter-coded macroblcoks and macroblocks predicted using spatial prediction (intra prediction) are called intra-coded macroblcoks. The type of prediction for a video frame can be set by the user or selected by the video coding apparatus 100 so as to achieve a compression gain that is as high as possible. In accordance with the selected prediction type, an intra/inter switch 175 provides a corresponding prediction signal to the subtractor 105. The prediction signal which is generated using temporal prediction is calculated from a reconstructed image (a reconstructed image signal) which is stored in a memory 140. The prediction signal which is generated using spatial prediction is calculated from the value(s) of boundary pixel(s) in the neighboring block(s) which is/are previously coded, decoded, and stored in the memory 140. The memory 140 thus operates as a delay unit that allows a comparison between the current signal value to be coded and the prediction signal value generated from the previous signal value(s). The memory 140 can store a plurality of previously coded video frames. The difference between the input signal and the prediction signal is referred to as a prediction error signal or a residual. A transform/quantization unit 110 transforms the prediction error signal into coefficients of frequency components, and quantizes the transformed coefficients. An entropy coding unit 190 entropy-codes the quantized coefficients in order to further reduce the amount of data in a lossless way. Such reduction is mainly achieved by applying variable length coding using codewords having variable lengths that are determined based on the occurrence probabilities of the respective codewords.
Intra-coded images (also referred to as I-pictures, I-images or I-frames) consist only of macroblocks that are intra-coded, that is, intra-coded images. Thus, the intra-coded images can be decoded without reference to any other previously decoded image. The intra-coded images provide error resilience for the resulting coded video sequence. This is because the intra-coded images are images for removing (refreshing) errors that otherwise propagate from frame to frame in the video sequence due to temporal prediction. Moreover, each I-frame enables a random access within the resulting coded video sequence. Basically, intra-fame prediction is performed by using a predefined set of intra-prediction modes for predicting a current block based on the boundary pixels in the neighboring blocks already coded. Different spatial intra-prediction modes are performed by applying different two-dimensional prediction directions. This allows efficient spatial intra prediction in the case of various edge directions. The prediction signal generated by such an intra prediction is then subtracted from the input signal by the subtractor 105 as described above. In addition, information indicating a spatial intra prediction mode is entropy-coded and provided together with the coded video signal.
The video coding apparatus 100 includes a decoding unit which generates a decoded video signal. The video coding apparatus 100 further includes an inverse quantization/inverse transform unit 120 which executes the decoding steps corresponding to the coding steps. The inverse quantization/inverse transform unit 120 generates a quantized prediction error signal by inversely quantizing and inversely transforming the quantized coefficients. The quantized prediction error signal differs from the original prediction error signal due to a quantization error that is also referred to as a quantization noise. An adder 125 generates a reconstructed signal by adding the quantized prediction error signal to the prediction signal. In order to maintain the compatibility between the encoder side (the video coding apparatus 100) and the decoder side (the video decoding apparatus), a prediction signal known at both the encoder and decoder sides is generated using the reconstructed signal that is the video signal coded and then decoded. Due to the quantization, the quantization noise is superimposed to the reconstructed video signal. Due to the block-based coding, the superimposed noise often has blocking characteristics which result in noticeable block boundaries in the decoded image represented by the reconstructed signal, in particular when strong quantization is performed. Such blocking artifacts (block distortions) have a negative effect upon human visual perception.
In order to reduce these artifacts, a deblocking filter 130 performs deblocking filtering for each block of the decoded image. The deblocking filtering is performed on the reconstructed signal which is the sum of the prediction signal and the quantized prediction error signal. The reconstructed video signal that is the reconstructed signal after being subjected to the deblocking filtering is the decoded signal which is generally displayed at the decoder side (if no such post filtering is performed). The deblocking filter in H.264/MPEG-4 AVC can be applied locally. In the case of a high degree of blocking noise, a strong (narrow-band) low-pass filter is applied, whereas in the case of a low degree of blocking noise, a weaker (broad-band) low-pass filter is applied. The strength of the low-pass filter is determined by the prediction signal and by the quantized prediction error signal. A deblocking filter generally smoothes the block edges, which leads to an enhanced subjective quality of the decoded image. Moreover, since the filtered part of an image is used for the motion compensation prediction of the following images, the filtering also reduces the prediction errors, and thus enables increase in the coding efficiency.
Intra-coded macroblocks are filtered before being displayed, but intra prediction is carried out using the macroblocks represented by the reconstructed signal that is not yet filtered.
FIG. 2 is a diagram for illustrating processing performed by the deblocking filter 130. The deblocking filter 130 separates samples p3, p2, p1, and p0 of a first block 301 on its left and samples q3, q2, q1, and q0 of a second block 302 on its right, and performs deblocking filtering at the vertical block boundary 310. A linear deblocking filtering with four coefficients is applied to the input samples p2, p1, p0, q0, q1 and q2, which produces, as the samples already subjected to the deblocking filtering, the following filtered outputs "p0, new" and "q0, new":p0,new=(p2−(p1<<1)+(p0+q0+1)>>1)>>1,q0,new=(q2−(q1<<1)+(q0+p0+1)>>1)>>1
The reconstructed video signal is then stored in the memory 140.
In order to be decoded, inter-coded images require also the previously coded and subsequently decoded image(s). Temporal prediction may be performed uni-directionally (that is, using only video frames temporally before the current frame to be coded), or bi-directionally (that is, using also video frames preceeding and following the current frame. Uni-directional temporal prediction results in inter-coded images called P-frames (P-pictures), and bi-directional temporal prediction results in inter-coded images called B-frames (B-pictures). In general, an inter-coded image may be composed of any of a P-macroblock and a B-macroblock, and possibly even an I-macroblock.
A motion compensation prediction unit 160 predicts an inter-coded macroblock (a P-macroblock or a B-macroblock). First, a motion estimation unit 165 detects a best-matching block for the current block within one of the previously coded and decoded video frames. The aforementioned prediction signal shows this best-matching block. The motion estimation unit 165 signals the relative displacement (motion) between the current block and its best matching block, as motion data in the form of a three-dimensional motion vector that is included in the supplementary information provided together with the coded video signal. The three dimensions consist of two spatial dimensions and one temporal dimension. In order to optimize the prediction accuracy, a motion vector may be determined with a spatial sub-pixel resolution such as the half pixel or quarter pixel resolution. A motion vector with a spatial sub-pixel resolution may point to a spatial position such as a sub-pixel position which is within an already decoded video frame and at which no real pixel value is available. Hence, spatial interpolation of such pixel values is needed in order to perform motion compensation prediction. The interpolation filter 150 interpolates such spatial pixel values. According to the H.264/MPEG-4 AVC standard, a six-tap Wiener interpolation filter having fixed filter coefficients and a bilinear filter are applied in order to generate pixel values at sub-pixel positions in both the vertical and horizontal directions.
In the intra- and inter-coding modes, the transform/quantization unit 110 transforms and quantizes the prediction error signals that are differences between the input signal and the prediction signal to generate quantized coefficients. Generally, an orthogonal transform such as a two-dimensional discrete cosine transform (DCT) or an integer version thereof is employed. The orthogonal transform is performed to reduce the redundancies of the natural video images efficiently. After the transform, lower frequency components are usually more important for the image quality than high frequency components. Thus, more bits can be spent for coding the low frequency components than the high frequency components. An entropy coding unit 190 converts the two-dimensional matrix of quantized coefficients into a one-dimensional array. Typically, this conversion is performed by a what is called zig-zag scanning. The zig-zag scanning is performed starting with the DC-coefficient in the upper left corner of the two-dimensional matrix and ending with the AC coefficient in the lower right corner according to a predetermined sequential order. The energy is typically concentrated in the lower frequencies corresponding to the left upper part of the two-dimensional matrix of coefficients. Thus, the zig-zag scanning usually results in an array where the last values are sequential zeros. In this way, it is possible to perform efficient coding using run-length codes as a part of or at a pre-stage of the actual entropy coding.
The H.264/MPEG-4 AVC employs scalar quantization which can be controlled by a quantization parameter (QP) and a customizable quantization matrix (QM). For each macroblock, a corresponding one of 52 quantizers is selected by a quantization parameter. In addition, such a quantization matrix is specifically designed to keep certain frequencies in the source to avoid degradation of image quality. A quantization matrix in the H.264/MPEG-4 AVC can be adapted to the video sequence and signaled together with the coded video signal.
The H.264/MPEG-4 AVC standard includes two functional layers that are a Video Coding Layer (VCL) and a Network Abstraction Layer (NAL). The VCL provides the coding functionality as briefly described above. The NAL encapsulates the coded prediction error signal together with the supplemantal information necessary for the decoding of the video into standardized units called NAL units according to their further application(s) such as transmission over a channel and/or storing in a storage. There are VCL NAL units containing the compressed video data and the related information. There are also non-VCL units that encapsulate additional data. Examples of such additional data include a parameter set relating to an entire video sequence, or recently added Supplemental Enhancement Information (SEI) providing additional information that can be used to increase the decoding performance.
In order to enhance the image quality, a what is called post filter 280 (see FIG. 3) may be applied at the decoder (the video decoding apparatus 200). The H.264/MPEG-4 AVC standard allows the sending of post filter data for such a post filtering via the Supplemental Enhancement Information (SEI) message. The post filter design unit 180 identifies the filter data (a what is called filter hint for post filtering) by comparing the locally decoded signal (the reconstructed video signal) and the original input signal. In general, the filter data is information used by a decoder to set up an appropriate filter condition. For example, the filter data may include filter coefficients as they are. However, the filter data may also include other information that enables the setup of the filter. Examples of the other information includes the cross-correlation information related to the uncompressed signal, cross-correlation information between the original input image and the decoded image, and cross-correlation information between the decoded image and the quantization noise. This cross correlation information can be used to calculate the filter coefficients. The filter data which is output by the post filter design unit 180 is also transmitted to the entropy coding unit 190 in order to be coded and inserted into the coded video signal.
The decoder may apply the filter data to the decoded signal before display of the decoded signal (the decoded video signal).
FIG. 3 is a block diagram of an exemplary video decoding apparatus (decoder) 200 compliant with the H.264/MPEG-4 AVC video coding standard. The input signal that is the coded video signal is first transmitted to the entropy decoding unit 290. The entropy decoding unit 290 entropy-decodes the input signal. This yields the quantized coefficients, the information elements necessary for decoding motion data, prediction modes, etc., and the filter data. The one-dimensional array of quantized coefficients is inversely scanned to be a two-dimensional matrix, and the two-dimensional matrix is then transmitted to the inverse quantization/inverse transform unit 220. The inverse quantization and inverse transform unit 220 generates a quantized prediction error signal by inversely quantizing and inversely transforming the quantized coefficients of the two-dimensional matrix. This corresponds to the differences generated by subtracting the prediction signal from the input signal input to the encoder in the case where no quantization noise is introduced
The prediction signal is generated from either a motion compensation prediction unit 260 or an intra prediction unit 270, respectively. The intra/inter switch 275 switches prediction signals to be output to the adder 225, according to an information element indicating the type of prediction applied at the encoder. An information element in the case of intra-prediction further includes information such as intra-prediction mode necessary for the intra prediction, and an information element in the case of motion compensation prediction further includes information such as motion data necessary for the motion compensation prediction. Depending on the current value of the motion vector, interpolation of pixel values may be required to perform motion compensation prediction. This interpolation is performed by an interpolation filter 250. The adder 225 generates the reconstructed signal by adding a quantized prediction error signal in the spatial domain to the prediction signal obtainable either from the motion compensation prediction unit 260 or the intra prediction unit 270. Furthermore, the adder 225 transmits the reconstructed signal to a deblocking filter 230. The deblocking filter 230 generates a reconstructed video signal by performing deblocking filtering on the reconstructed signal, and stores the reconstructed video signal in the memory 240. The reconstructed video signal is used for temporal prediction or spatial prediction of the following blocks.
The post filter 280 obtains the filter data entropy-decoded by the entropy decoding unit 290, and sets a filter condition such as a filter coefficient according to the filter data. In order to enhance the image quality, the post filter 280 applies the filtering according to the condition to the reconstructed video signal. In this way, the post filter 280 is capable of adapting to the characteristics of the video signal to be input to the encoder.
In summary, there are three types of filters used in the latest H.264/MPEG-4 AVC standard. The filters are an interpolation filter, a deblocking filter, and a post filter. In general, the suitability of a filter depends on the contents of the image to be filtered. Therefore, a filter design which enables adaptation to the image characteristics is advantageous. The coefficients of such a filter may be designed as Wiener filter coefficients.
FIG. 4 is a diagram illustrating a signal flow using a Wiener filter 400 for noise reduction. A noise n is added to an input signal s, resulting in a noisy signal s′ to be filtered. With the goal of reducing the noise n, the Wiener filter 400 is applied to the signal s′, resulting in the filtered signal s″. The Wiener filter 400 is designed to minimize the mean squared error between the input signal s which is the desired signal and the filtered signal s″. This means that Wiener filter coefficients w correspond to the solution of the optimization problem "argw min E[(S−S″)2]" which can be formulated as a system of a linear equation referred to as a Wiener-Hopf equation. The operator E[x] indicating the expected value of x. The solution is given by:w=R−1·p
Here, w is an M×1 vector containing the optimal coefficients of a Wiener filter having an order of M that is a positive integer. Also, R−1 denotes the inverse of an M×M autocorrelation matrix R of the noisy signal s′ to be filtered. Also, p denotes an M×1 cross correlation vector between the noisy signal s′ to be filtered and the original signal s. For further details on adaptive filter design, see Non-patent Literature (NPL) 1. NPL 1 is incorporated herein by reference.
Thus, one of the advantageous effects of the Wiener filter 400 is that the filter coefficients can be determined from the autocorrelation of the corrupted (noisy) signal and the cross correlations of the corrupted signal and the desired signal. In video coding, quantization noise is superposed to the original (input) video signal in the quantization step. Wiener filtering in the context of video coding aims at the reduction of the superimposed quantization noise in order to minimize the mean squared error between the filtered reconstructed video signal and the original signal.
Filter information that is transmitted from the encoder to the decoder can either be the calculated filter coefficients as they are or the cross correlation vector p which is necessary for calculating the Wiener filter and which cannot be determined at the decoder. Transmitting such supplementary information may enhance the quality of filtering. Furthermore, it is possible to further enhance the filtering quality and thereby enhance the video quality by, for example, either (i) increasing the order of the filter or (ii) separately determining the respective parts of the video signal and/or separately applying filter coefficients to the respective parts of the video signal.

Video coding method, video decoding method, video coding apparatus, and video decoding apparatus that use filters for filtering signals

PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA


The present disclosure discloses methods for high-yield fermentation of recombinant proline aminopeptidase and preparation of debittered rice peptide, belonging to the fields of fermentation technology, enzyme preparation and food additives. The present disclosure utilizes fermentation kinetic analysis to determine the high-yield fermentation method of proline aminopeptidase by recombinant Bacillus subtilis, and improve the yield of proline aminopeptidase to reach 174.8 U/mL. Proline aminopeptidase cooperates with alkaline protease and leucine aminopeptidase to hydrolyze rice protein. The free amino acid content is 27.3 times the unhydrolyzed free amino acid content, and the small peptide content below 180 Da in hydrolysate reaches 44.70%. The exposed N-terminal proline residue is fully hydrolyzed, and the free proline content is 1,064.3 times that of the unhydrolyzed free proline content, which increases the degree of rice protein hydrolysis. The method of the present disclosure has a good application prospect in the fields of foods and beverages and processing and utilization of food protein resources.

The optimization strategy for microbial fermentation culture often starts from the optimization of a medium and the control of a fermentation process. At present, it is impossible to infer and calculate a medium formula and fermentation process control strategy suitable for a certain microorganism from the basic principle of biochemical reaction. Also, the medium and fermentation process control strategies suitable for different microorganisms are different. No single culture method can be suitable for fermentation culture of a variety of microorganisms. Therefore, it is necessary to use small fermentation equipment such as shake flasks and glass jars for a specific microorganism. The most suitable culture method can be selected by combining and optimizing the medium composition, fermentation process control and other fermentation strategies according to a certain experimental design and test method.
At this stage, the fermentation yield of proline aminopeptidase is still relatively low, which cannot meet the needs of industrial preparation. This is also a key factor for the lack of commercial products of proline aminopeptidase. Therefore, how to improve the fermentation yield of proline aminopeptidase by fermentation strategies has become an urgent problem to be solved.
Enzyme preparation refers to a substance with enzymatic properties extracted from living organisms, and has been widely used in various fields such as medicine, chemical industry, food, brewing, etc., and has a wide range of applications. The food processing industry is closely related to people's lives. Enzymes are increasingly used in the food processing industry, and their roles are becoming more and more important, which are greatly reflected in meat processing, deep hydrolysis of proteins and the use as food additives.
Enzyme preparations have become more and more widely used along with the development of society, and the application field of aminopeptidase is also constantly explored. Non-specific aminopeptidase can hydrolyze the N-terminal amino acid residues of a protein or polypeptide in a broad-spectrum method, and can hydrolyze amino acid residues of different kinds of polypeptides or protein N-terminals to release different kinds of amino acids. The highly specific aminopeptidase can hydrolyze the amino acid residues which cannot be hydrolyzed by endoprotease and non-specific exoprotease, and can effectively deepen the degree of proteolysis and improve the nutritional value of the protein hydrolysate. Rice is one of food crops with the most abundant yield in the world. Rice protein, a product processed from rice, is rich in resources, balanced in nutrition and not susceptible to allergies. Therefore, rice protein has a very broad application prospect in the food industry. However, during the deep processing of rice protein, the hydrolysate often exhibits a strong bitter taste, which affects the field of application. How to improve the degree of hydrolysis of rice protein, remove or reduce the bitterness of hydrolysate, and increase the nutritional value of hydrolysate through cooperative degradation of enzymes has become an urgent problem to be solved.

Method for high-yield fermentation of recombinant proline aminopeptidase and preparation of debittered rice peptide


The present invention is to provide an hermetic-sealing package member including a substrate and at least one frame-like sealing material for defining a sealing region formed on the substrate, in which the sealing material is formed of a sintered body obtained by sintering at least one metal powder selected from gold, silver, palladium, or platinum having a purity of 99.9 wt % or greater and an average particle size of 0.005 μm to 1.0 μm, and with respect to an arbitrary cross-section toward an outside from the sealing region, a length of an upper end of the sealing material is shorter than a length of a lower end. Examples of a cross-sectional shape of the sealing material may include one formed to have a base portion having a certain height and at least one mountain portion protruding from the base portion or one formed to have a mountain portion having substantially a triangular shape in which the length of the lower end of the sealing material is a bottom. By use of the hermetic-sealing package member of the present invention, a load is reduced at the time of hermetic-sealing and a sufficient sealing effect can be obtained.

Various functional devices used in electronic devices such as MEMS elements are delicate parts having a sensitive portion or a driving portion and are hermetically-sealed and packaged to prevent deterioration in function due to sticking of particles or the like in many cases. Such an hermetically-sealed package is produced in such a manner that a substrate mounted with semiconductor elements and a cover are bonded to each other by use of a sealing material, thereby being sealed.
As a sealing material used in the production of the hermetically-sealed package, a brazing material (for example, Au—Sn-based brazing material) was widely applied in the past. However, since such a brazing material had a high bonding temperature (melting temperature of the brazing material), a material capable of bonding at a lower temperature was required. Against such background, the present inventors have developed a sealing method of using a metal paste, as a technique capable of bonding at a low temperature and having excellent sealing properties (Patent Document 1). In this method, a metal paste containing predetermined metal powders is applied, and a metal powder sintered body obtained by sintering the metal paste is used as a sealing material. The metal powder sintered body is further densified when being heated and pressurized at the time of bonding (sealing) and has substantially the same densification as a bulk body, whereby it can act as a sealing material.

Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member


The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

In recent years, with increasing miniaturization and weight-saving of data terminals such as personal computers and cellular phones, more compactness and higher density wiring are coming to be required in the printed circuit boards installed in these devices. In order to satisfy these needs, it is necessary to make the wiring width narrower and to make the gaps between the wiring closer. To match the higher processing speeds of electronic devices, it is also required to increase the number of inputs and outputs with which these electronic devices are provided.
To meet these demands, the mounting of elements on printed circuit boards changed from the pin intercalation type to the surface-mounted type, and then to the area array type represented by a BGA (ball grid array) which uses a plastic substrate. In a substrate on which a bear chip such as a BGA is mounted directly, the chip connections are often made by wire bonding using thermal supersonic waves with application of pressure. It is also required to increase the number of terminals connected by this wire bonding or to make the terminals narrower.
In the prior art, the substrate of these printed circuit boards consisted of a laminate obtained by superimposing a predetermined number of prepregs or the like having a matrix of an electrically insulating resin, and forming them into one piece by the action of heat and pressure. The electrically insulating resin was generally a thermosetting resin such as a phenol resin, epoxy resin, polyimide resin or bis-maleimide-triazine resin. A thermoplastic resin such as a fluororesin or polyphenylene ether resin may also be used.
As the method of forming the conductor circuit on the printed circuit board, the subtractive method is widely used. In this method, a conducting foil such as a metal foil is laminated on a surface (one side or both sides) of the aforesaid laminate, and heat and pressure are applied to form a one-piece conductor-clad laminated sheet. A circuit pattern is then formed by removing the conductor foil on this conductor-clad laminated sheet by etching.
In this conductor-clad laminated sheet, to prevent peeling of the circuit pattern, it is desirable that the conductor foil and insulator layer comprising the laminate of prepregs are firmly stuck together. For this purpose, in the prior art, the adhesive force between the conductor foil and insulator layer was increased by roughening the surface of the foil so as to produce an anchor effect of the resin in the insulator layer as disclosed in JP-A No. 04-211941 or "High-Density Circuit Boards" (by Electronic Material Group Editorial Dept., Kogyo Chosakai, 20 May, 1986, p. 149-157).

Primer, conductor foil with resin, laminated sheet and method of manufacturing laminated sheet