An engine uplift loader includes a frame assembly having generally parallel first and second frame members spaced apart by a distance enabling the shipping cradle and engine to be positioned between the first and second frame members. A plurality of lifting devices are supported on the frame assembly extending upwardly therefrom, each lifting device being operable to raise and lower an upper end of the lifting device relative to the frame assembly along a generally vertical lifting axis. An attachment assembly is mounted to the upper end of each lifting device, each attachment assembly being structured and arranged to attach to the shipping cradle such that raising the upper ends of the lifting devices causes the shipping cradle and engine to be lifted upwardly. At least one of the attachment assemblies is movably mounted on the respective lifting device such that the attachment assembly can be selectively positioned in various positions relative to the lifting axis of the lifting device so as to accommodate different configurations of shipping cradles. Thus, the engine can be lifted while still in its shipping cradle, and the engine uplift loader can accommodate more than one configuration of engine and cradle.

The present invention relates to devices for lifting relatively large and heavy structures. The invention relates more particularly to a lifting device for lifting an aircraft engine so that the engine can be attached to engine mounting structure on an aircraft.
During installation of an aircraft engine on an aircraft wing, the engine must be lifted up to the wing for mounting the engine on a strut attached to the wing. Where the aircraft wing has dihedral, the engine generally must be rotated about its axis to properly align it with the dowel pins that project downwardly from the strut and that are received into holes in the engine mounts on the engine for supporting shear loads between the engine and the strut. Then, the aircraft engine can be secured to the wing with appropriately sized threaded fasteners that support the tension loads between the engine and the strut.
This installation process is complex, requires close coordination between operators, and can present potential hazards to the loading equipment, the aircraft, the engine, and the operators. Aircraft engines are extremely heavy and present high loading factors during installation. For example, engines for jumbo aircraft, such as the Boeing 777 series aircraft, can weigh in excess of 20,000 pounds. Further, the wings of jumbo aircraft, such as the Boeing 777 series aircraft, can be a considerable height above the ground. Thus, mounting an engine on a jumbo aircraft, such as a Boeing 777 series aircraft, entails lifting an aircraft engine weighing up to 20,000 pounds or more to a strut that can be up to 15 feet off the ground.
Because of the size and weight of aircraft engines for jumbo aircraft, the aircraft engine should be handled as little as possible in order to minimize the likelihood of equipment damage or injuries to personnel. However, installing an aircraft engine using known techniques requires removing the aircraft engine from the aircraft engine""s shipping cradle. These known techniques include the use of overhead bridge cranes with slings, a xe2x80x9cbootstrapxe2x80x9d system that is temporarily mounted on the aircraft wing, and known loaders such as those described in U.S. Pat. Nos. 4,440,265 and 4,461,455. The extra step of transferring the aircraft engine from its shipping cradle necessitated by the use of these known loading methods requires extra tooling and makes these known methods time consuming and expensive. It would be desirable to provide an engine loader that could obviate the necessity of removing the engine from its shipping cradle prior to lifting it to the aircraft.
Further, known loaders such as those described above can only be used to lift the particular aircraft engine they are designed to lift, and cannot accommodate any other aircraft engines. Thus, loading multiple types of aircraft engines with known loaders requires multiple types of loaders. This significantly increases the costs of procuring and maintaining the loading equipment.
Thus, there is an unmet need in the art for an aircraft engine loader that can be used to lift an aircraft engine that is still in the aircraft engine""s shipping cradle or to lift a cradle and dolly for an engine, and for an aircraft engine loader that can be used to load multiple types of aircraft engines.
The present invention addresses the above needs by providing an engine uplift loader that can lift an aircraft engine while still in its shipping cradle for mounting the engine to engine mounting structure on an aircraft. Further, the loader in accordance with a preferred embodiment of the invention can be used for loading different types of engines.
According to one aspect of the invention, an engine uplift loader includes a frame assembly having generally parallel first and second frame members spaced apart by a distance enabling the shipping cradle and engine to be positioned between the first and second frame members. A plurality of lifting devices are supported on the frame assembly extending upwardly therefrom, each lifting device being operable to raise and lower an upper end of the lifting device relative to the frame assembly along a generally vertical lifting axis. An attachment assembly is mounted to the upper end of each lifting device, each attachment assembly being structured and arranged to attach to the shipping cradle such that raising the upper ends of the lifting devices causes the shipping cradle and engine to be lifted upwardly. At least one of the attachment assemblies is movably mounted on the respective lifting device such that the attachment assembly can be selectively positioned in various positions relative to the lifting axis of the lifting device so as to accommodate different configurations of shipping cradles. Thus, the engine can be lifted while still in its shipping cradle, and the engine uplift loader can accommodate more than one configuration of engine and cradle.
Preferably, the lifting devices include attachment fittings mounted adjacent to the upper ends of the lifting devices, and the attachment assemblies include cable assemblies that are removably attached to the attachment fittings. The cable assemblies removably attach the aircraft engine shipping cradle to the loader and are arranged to permit attachment to shipping cradles of different types of aircraft engines. A load monitoring device can be attached to each cable assembly for monitoring the load exerted on the engine and shipping cradle by the engine uplift loader.
The attachment fittings that are movably mounted on their lifting devices preferably are mounted by a slide assembly structured and arranged to permit the attachment assembly to be slid along a horizontal axis. Preferably, each of the first and second frame members supports two spaced-apart lifting devices, and the slide assembly is employed on only one of the two lifting devices for adjusting the distance between the attachment assemblies on the two lifting devices.
According to another aspect of the invention, the frame assembly includes a plurality of fluid cushion bearings that depend downwardly from the frame assembly. The fluid cushion bearings permit the loader to be supported on a fluid film so that it can be readily maneuvered to align the engine with the engine mounting structure on the aircraft.
The engine uplift loader can include a plurality of jacks attached to the frame assembly and operable to be extended in engagement with the supporting surface to urge the engine uplift loader upwardly to maintain a preload between the engine and the engine mounting structure on the aircraft. The loader can also include wheels for transporting the loader along the supporting surface.
In accordance with another aspect of the invention, the frame assembly of the loader comprises a generally U-shaped frame assembly having spaced, generally parallel first and second frame members each having a first end and a second end, and a third frame member extending between the first ends of the first and second frame members. The frame assembly defines an opening between the second ends of the first and second frame members through which the engine on the shipping cradle can be received such that the engine and shipping cradle are disposed between the first and second frame members. Each of the first and second frame members includes a pair of lifting devices spaced apart therealong. Where it is desired to be able to vary the distance between the attachment assemblies that attach to the shipping cradle so as to accommodate different types of engines and cradles, one of the lifting devices on each frame member can include a slide assembly or other type of movable mount for the attachment assembly, as previously described.
The lifting devices preferably comprise fluid-operated cylinders such as hydraulic cylinders, and the cylinders preferably incorporate relief valves for relieving fluid pressure in the cylinders should such pressure exceed a predetermined value. Accordingly, the engine uplift loader is self-relieving to prevent damage to the loader and/or to the aircraft as a result of abnormally large forces therebetween that could arise from various causes.


Semiconductor devices and methods of fabricating the same are provided. The semiconductor device may include interconnections extending in a first direction on a substrate and spaced apart from each other in a second direction perpendicular to the first direction, barrier dielectric patterns disposed on top surfaces of the interconnections, respectively, and an upper interlayer dielectric layer disposed on the interconnection. Respective air gaps are disposed between adjacent ones of the interconnections.

The inventive concept relates to integrated circuit devices, and more particularly, to integrated circuit devices including interconnection structures and methods of fabricating the same.
Semiconductor devices may be attractive in the electronics industry due to their small size, multi-functionality, and/or low fabrication cost. The semiconductor devices can be categorized as any one of semiconductor memory devices that store logic data, semiconductor logic devices that process operations on logical data, and hybrid semiconductor devices having both the function of the semiconductor memory devices and the function of the semiconductor logic devices.
High speed semiconductor devices and/or low voltage semiconductor devices may be increasingly desired to satisfy demand for higher speed and lower power consumption in electronic devices. The semiconductor devices may be more highly integrated in order to meet such demands. However, as semiconductor devices become more highly integrated, reliability of the semiconductor devices may deteriorate. But, maintaining high reliability of the semiconductor devices may also be desired with the development of an electronic industry. Thus, various research has been conducted for improving the reliability of the semiconductor devices.

This patent is subject to a terminal disclaimer.

Integrated circuit devices including interconnections insulated by air gaps and methods of fabricating the same


A method is disclosed of processing in a processor an image-wise exposed black-and-white light-sensitive silver halide photographic material comprising the steps of developing in a developing solution and fixing in a fixer solution, characterized in that upon starting of the processing the said fixer solution comprises a mixture of a fixer starter solution and a fixer replenisher solution, in that said fixer solution is replenished with the said fixer replenishing solution and in that the said fixer starter solution is a developing solution.

As is well-known in the processing of photographic materials seasoning of the processing solutions makes their compositions differ from the compositions of solutions added freshly to processing tanks of developer and fixer. Therefore as an efficient measure in order to minimize differences in compositions between start and while running processing, the use of starter solutions is well-known since quite a long time as has e.g. been illustrated in U.S. Pat. No. 3,276,874. More recently in EP-A 0 696 759 a method for processing a black-and-white silver halide photographic material in an automatic processing machine or processor is disclosed, wherein the developer replenisher is used in the form of a concentrated solution or in the form of a solid comprising a dihydroxybenzene or ascorbic or erythorbic acid or derivatives thereof.
A developer replenisher having a higher pH value (in an amount of at least 0.5) than its development starting solution has been described in U.S. Pat. No. 5,503,965. Addition of starter, including at least one alkali agent, to the fixer in order to have a difference of pH between new liquid and running liquid within 0.2 has been described for a fixer having a pH after adding starter from 4.0 to 5.0 as in JP-A 03-68937, whereas a pH from 4.3 to 5.3 is controlled in JP-A 06-250350. Replenishing fixer solutions having a higher thiosulphate concentration than in the fixer at the start of processing, wherein pH of the fixer is more than 3.8 and preferably from 4.2-5.5 has been described in JP-A 06-230527, for rapid processing applications. Starter tablets have further been described in JP-A 04-032839.
The addition of sulfite salts to the fixer replenisher solution is known in order to compensate for the drop in sulphite concentration and pH decrease due to electrolysis. Electrolysis can proceed for example by passing the fixer around a circulation loop which includes an electrolytic cell. Electrolytic removal of silver also has the benefit of enabling a lower regeneration rate of fixer to be used. This is fully consistent with recent trends to reduce the volume of treatment liquids used in photographic processing. Electrolysis of the fixer solution, known as most efficient method of chemical recovery of the said fixer solution in order to reduce the slow down effect on fixation rate of increasing amounts of silver ions present in the fixer, however makes pH and sulfite ion concentration decrease.
As a consequence a less stable fixer solution is provided, wherein sulfur deposit may tend to occur as has e.g. been described in J.Imag.Techn. Vol. 10 (1984), p. 214 and in Materials Evaluation, April 1991, p. 511.
As an approach of modern technological developments related with rapid processing from the viewpoint of ecology is becoming more and more stringent, a demand for lower replenisher volumes is a normal trade-off. As a consequence differences in compositions between seasoned processing solutions and fresh solutions after throughput of constant amounts of photographic material tend to increase. The said differences are the ultimate factors determining to what extent reduction in replenishing amounts may be carried out.
Problems resulting therefrom are e.g. lack for constant and acceptable sensitometric properties (a "must" with respect to "constant quality" required by the clients), degradation of physical properties (e.g. uneven gloss at the surface of the processed and dried material) and unacceptable odour of the processing solutions.

Method of processing light-sensitive silver halide photographic materials


The present technique relates to a method and apparatus to provide a deep power down mode. In a memory device, such as DRAM or SRAM, various internal voltage buses provide power throughout the semiconductor chip. In a deep power down mode, grounding devices may be utilized to ground the internal voltage buses. With the internal voltage buses grounded, the outputs of the level shifters, which are control signals, may need to be forced into specific states. Through the use of the grounding devices and level shifters, leakage may be reduced and latch-up conditions may be reduced. As a result, the operation of the semiconductor chip may be enhanced because the problems associated with grounding the internal voltage buses may be diminished.

1. Field of the Invention
The present invention relates generally to semiconductor devices and, more particularly, to the management of power in a semiconductor device, such as a memory device.
2. Description of the Related Art
This section is intended to introduce the reader to various aspects of art which may be related to various aspects of the present invention which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Microprocessor-controlled integrated circuits are used in a wide variety of applications. Such applications include personal computers, telephones, portable devices, networks, and a host of consumer products. As is well known, microprocessors are essentially generic devices that perform specific functions under the control of a software program. This program is stored in a memory device that is coupled to the microprocessor. Not only does the microprocessor access memory devices to retrieve the program instructions, but it also stores and retrieves data created during execution of the program in one or more memory devices.
It should be understood that memory devices and integrated circuits are typically mass produced through fabrication processes to form semiconductor chips. In forming the chip, different materials are layered together to form various structures or circuitry within the chip. These structures are connected together to exchange signals, to receive power from external devices, and to distribute power throughout the chip. The power and signals are utilized by the structures within the semiconductor chip to perform specific functions. For instance, the distribution of power enables memory cells within a memory device to maintain data delivered from a microprocessor during the execution of a program.
Regardless of the specific structures being fabricated within the semiconductor chip, it is often desirable to conserve power by managing the power during standby or deep power down modes. For instance, in a device, such as a cellular telephone or a personal computing device, the semiconductor chips implemented may consume small amounts of power during a deep power down mode of operation. During the deep power down mode, the device may supply power to select components to maintain operation. Each of these components may include defects which result in junction leakage that consumes power. Also, the structures within the semiconductor chips may float and produce additional errors when the power is removed. These power consumption inefficiencies and associated problems may reduce the amount of time that the device is utilized in the normal or the deep power down mode of operation.

Method and apparatus for achieving low power consumption during power down


By packet speed setting device, setting is made so as to send out a cycle start packet at predetermined-times speed when image data is transferred from a DV apparatus to a DVD recorder, and by predetermined-times speed dubbing function determination device, it is determined whether or not the DV apparatus has a predetermined-times speed dubbing function when image data recorded on the DV apparatus is dubbed on the DVD recorder at predetermined-times speed. By notification device, the DV apparatus is notified to perform predetermined-times speed dubbing from the DVD recorder in the case of having the predetermined-times speed dubbing function, and by predetermined-times speed dubbing start device, predetermined-times speed dubbing is started by controlling components of the DV apparatus and the DVD recorder related to the predetermined-times speed dubbing by the notification.

1. Field of the Invention
The present invention relates to an information recording system that makes connection between, for example, an optical disk recording and reproducing apparatus for recording information on an optical disk and reproducing information recorded on the optical disk and a digital video apparatus for outputting a pickup image as digital image data of a predetermined format through a predetermined digital cable.
2. Description of the Related Art
In recent years, an IEEE (Institute of Electrical and Electronics Engineers) 1394 data interface has been known as a digital data interface. In the IEEE1394 data interface, a data transfer rate is higher than that or, for example, a SCSI and as is well known, isochronous communication ensuring that a required data size is sent and received periodically can be conducted. As a result of this, the IEEE1394 data interface is effective in transferring stream data of AV (Audio Visual) etc. in real time.
As a conventional information recording system for mutually conducting communication using such an IEEE1394 data interface, for example, a device constructed by making connection between a DVD recorder for recording information on a DVD (Digital Versatile Disc) or reproducing information recorded on the DVD and a DV (Digital Video) apparatus for outputting a pickup image as digital image data of a predetermined format through a cable of IEEE1394 has been known. In the IEEE1394, time synchronization between the DV apparatus and the DVD recorder connected to the cable can be obtained by carrying a packet far time synchronization called a cycle start packet into the cable of IEEE1394, for example, per 125 microseconds.
When image data recorded on the DV apparatus is dubbed on the DVD recorder in such a conventional information recording system, the image data of the DV apparatus flows through the cable of IEEE1394 in synchronization with the cycle start packet and is recorded on the DVD recorder.


A network device including an ingress processor and egress processor which receives frames of data over the network on an input port, and transfers it to an appropriate output port. The received frame is processed by an ingress processor which prepares an intra-switch frame for delivery to an egress processor serving a relevant output port of the switch. The intra-switch frame includes a frame header having parameters which have been determined by the ingress processor, as well as data indicating an address for the egress processor for beginning processing of the frame. By identifying to the egress processor processing which has already taken place, the egress processor is relieved of any redundant processing of the frame. The egress processor provides a hardware frame classifier which decodes the information contained in the intra-frame header to derive parameters which have been previously computed as well as a starting address for the egress processor. By reducing the amount of redundant processing of the egress processor, total device throughput delay is reduced.

The present invention relates to network processors which transfer network data frames between nodes of a network. Specifically, a process and apparatus for supplying frame type information and information identifying the depth of processing of an ingress processor to an egress processor of a network node is described which avoids redundant frame processing.
Communication network systems transfer information between a source and destination in frames which are transferred between different nodes along the network. The frames contain data destined for the user as well as destination information and other information which is needed for later processing downstream. One of the more common devices for transferring frames of data between nodes is the multi-processor switch. The multiprocessor switch is organized as a series of blades for receiving traffic through multiple ports, and for delivering traffic through other ports on the same or different blades of the switch. The blades typically have an ingress processor associated with them which processes incoming frames by correlating the frame destination with an output port, determining from the frame various parameters which are needed to process the frame, and transferring the processed frame to an egress processor on the same or a different blade. The egress processor may share the same hardware as the ingress processor and run a different set of pico code instructions when it is forwarding frames to an output port of the same blade.
Incoming frames are processed by the ingress processor by parsing the contents of the header, determining a destination for the frame, and then handing off the frame to the appropriate egress processor for processing and forwarding to an appropriate output port. The processing of frames by the ingress and egress processor necessarily requires redundant processing of the frame as it is handed off from the ingress processor to the egress processor. Parsing of header information from the received frame, identifying the frame type as well as other control parameters is part of a frame classification process executed in both the ingress and egress processor. The redundant processing of the frame produces delays in overall device throughput degrading the device performance. The present invention is directed to a system and method which will avoid redundant processing by the egress processor which has previously taken place in the ingress processor.

Method and apparatus for processing frame classification information between network processors

International Business Machines Corporation


The present invention relates to a surface protecting adhesive film for a semiconductor wafer in which an adhesive layer having a storage elastic modulus from 1×105 Pa to 1×107 Pa at 150° C. and a thickness of from 3 μm to 100 μm is formed on both a surface and back surface of a base film having a melting point of at least 200° C. and a thickness of 10 μm to 200 μm. According to the present invention, in a step of grinding the back side of a semiconductor wafer and removing a damaged layer generated on the back side, the semiconductor wafer can be prevented from being broken and being contaminated and the like even if a semiconductor wafer is thinned as low as 100 μm.

A step of processing a semiconductor wafer comprises a step of adhering a surface protecting adhesive film for a semiconductor wafer to a circuit-formed surface of the semiconductor wafer, a step of processing a non-circuit-formed surface of the semiconductor wafer, a step of peeling a surface protecting adhesive film for the semiconductor wafer, a step of dicing for dividing and cutting the semiconductor wafer, then a step of molding for sealing the semiconductor chip with a resin for protecting the outer portion, and the like.
Conventionally, in a step of processing a non-circuit-formed surface of a semiconductor wafer, when thickness of the semiconductor wafer is removed to be as low as 200 μm, strength of the semiconductor wafer itself might be deteriorated due to a damaged layer caused by a mechanical grinding and the semiconductor wafer might be broken due to a minute stress. On this occasion, if a thickness of the semiconductor wafer is less than 200 μm, a non-circuit-formed surface of the semiconductor wafer is mechanically grinded and then a step of chemical treatment is additionally carried out in order to remove a damaged layer generated on the non-circuit-formed surface of the semiconductor wafer.
As an etching step of a chemical treatment, a wet etching step has been carried out, which uses mainly a mixture of fluorine and acetic acid. A circuit-formed surface is faced downward while a non-circuit-formed surface is faced upward to fix surrounding portions of a semiconductor wafer with clamps in a state that the semiconductor wafer is exposed with a nitrogen gas. The thus-clamped wafer is rotated at a high rate and an etching solution dropwise from the top at the same time. In this way, a wet etching step for processing a non-circuit-formed surface of the semiconductor wafer has been carried out. However, from the viewpoint of an environment, the treatment of a waste solution and the like has been worried.
In late years, a step of removing a damaged layer generated on a non-circuit-formed surface of a semiconductor wafer has been examined as an etching method in consideration of an environmental aspect by a plasma etching using plasma. However, inside the system is made at high temperatures and in vacua in order to generate plasma, thus resulting in breaking a semiconductor wafer or causing a fusion of an adhesive film in some cases. Further, there is a problem in that it is not possible to transport a semiconductor wafer from a chuck table.
Further, as an alternative step, a step of sputtering or evaporating a metal on a non-circuit-formed surface of a semiconductor wafer that was thinned after grinding a non-circuit-formed surface of a semiconductor wafer has been examined. Since the temperature and vacuum conditions are added in the same manner as the above plasma etching step, tapes might be greatly damaged.
In late years, the thinning of a semiconductor chip has been in high demand, and a chip having a thickness of from 20 μm to 100 μm has been required. In the mean time, a manufacturing process of a semiconductor wafer has been complicated. A protecting method for a semiconductor wafer capable of preventing the thus-thinned semiconductor wafer from the breaking and the processing various back side in a state that a semiconductor wafer is adhered to a substrate supporting the semiconductor wafer via a surface protecting adhesive film for a semiconductor wafer has been demanded as a step of processing a non-circuit-formed surface of a semiconductor wafer.
An example of a protecting method is disclosed in JP2001-77304A. In this patent is disclosed a method of joining a holding substrate having a thickness of more than 0.2 mm to a circuit-formed surface of a semiconductor wafer via a thermoplastic resin layer, and processing a non-circuit-formed surface of a semiconductor wafer. However, a method of this type might cause some problems such as a contamination of a semiconductor wafer and the breakage of a semiconductor wafer during the grind as stress of grinding pressure could not be absorbed in case of a further thinned wafer.

Pressure sensitive adhesive film for protection of semiconductor wafer surface and method of protecting semiconductor wafer with the pressure sensitive adhesive film


An electronic component includes a semiconductor device (320) over a circuit board (210, 910), a heat sink (240, 940) over the semiconductor device, a clip (250, 950) over the heat sink and coupling the heat sink to anchors (230, 930) adjacent to the semiconductor device. A method of assembling the electronic component includes using an automated tool to couple the anchors to the circuit board, reflowing solder to electrically couple the semiconductor device and the anchors to a ground plane in the circuit board, and removably coupling the heat sink to the anchors.

This invention relates, in general, to electronics, and more particularly, to methods of assembling components onto a circuit board and electronic components thereof.
In the electronics industry, many different types of components, including semiconductor devices and heat sinks, are assembled or mounted onto circuit boards to create electronic components. Some semiconductor devices require discrete, external heat sinks to efficiently dissipate heat from the semiconductor devices. These heat sinks are mounted onto the circuit board over the semiconductor devices.
Ball Grid Array (BGA) devices and Quad Flat Pack (QFP) devices are two examples of semiconductor devices that mount directly onto the circuit boards. Some of the BGA and QFP devices do not entirely encapsulate the semiconductor chip of the device. Instead, the back side of the semiconductor chip is exposed to more efficiently dissipate heat from the semiconductor chip. However, these exposed-die BGA and QFP devices are not compatible with the discrete, external heat sinks.
Furthermore, heat sink anchors are mounted onto the circuit board to couple the heat sinks to the circuit board. However, these anchors must be manually mounted onto the circuit board. Therefore, the anchors are not compatible with a high speed, high volume assembly process. Additionally, the heat sink anchors protrude through the circuit board and extend at least 0.25 centimeters beyond the back side of the circuit board. This large protrusion renders the resulting electronic component unusable in many applications having strict height limitations on the back side of the circuit boards.
Moreover, as the semiconductor devices increase in speed, the semiconductor devices radiate higher frequency emissions. Industry regulations require these high frequency emissions to be shielded from adjacent electronic components.
Accordingly, a need exists for a method of assembling components onto a circuit board and an electronic component thereof where the heat sink of the electronic component is compatible with exposed-die semiconductor devices, where the heat sink anchors are compatible with a high speed, high volume assembly process, where the heat sink anchors do not violate the height limitations of certain applications, and where the radiated high frequency emissions from the semiconductor devices are shielded from neighboring components.

Method of assembling components onto a circuit board


The motorcycle footrest includes a mounting block and a footrest plate. The mounting block is clamped to a crash bar secured to a motorcycle frame. A pivot pin pivotally connects an end of the footrest plate to the mounting block for pivotal movement about a pivot pin bore axis that extends upwardly and forwardly at an angle of 45° from a horizontal plane. The footrest plate has a first footrest surface and a second footrest surface that are parallel to each other and face in opposite directions. Stop surfaces on the mounting block limit pivotal movement of the footrest plate when the first footrest surface is in a use position and when the second footrest surface is in a use position. At least one aperture passes through the footrest plane and intersects the first and second footrest surfaces. An aperture insert is mounted in the aperture.

Footrests that clamp to the crash bars on motorcycles have been used for many years. Some of the footrests are clamped in a selected fixed position and remain in that position at all times. To provide a flat shoe contact surface at the required angle for a person sitting on the seat of the motorcycle, it has generally been necessary to have a left side footrest and a right side footrest.
Motorcycle operators may decide to move footrests to a storage position when they are not in use. To accommodate the requirement, footrests that are moveable between a use position and a storage position have been constructed. These footrests do not provide two different use positions.
Motorcycles have an engine that produces heat, located between the operator's legs. With the exception of ambient air, motorcycles do not have air conditioning. To improve comfort, control temperature and avoid fatigue during extended trips, operators of motorcycles find it convenient to rest their feet in three or more different positions. One position is at the side of the engine and near the ground. A second position is on footrests attached to crash bars and extending inward toward the motorcycle from the attachments to the crash bars. A third position is footrests attached to the crash bars and extending outward away from the motorcycle and the attachments to the crash bars. In the first position, the operator's feet are well below the operator's knees and close to the engine. In the second position, the operator's feet are well forward of the knees, each knee joint is bent less, and the distance between the feet and the engine is increased from the distance when in the first position. In the third position, the operator's feet are laterally spread apart further, the knee joints are bent a little less than when the feet are in the second position and the distance between the feet and the engine is increased from the distance when in the second position.
Footrests generally have a flat footrest surface that is at an angle to horizontal. The angle of the footrests places the footrest surface in a plane that is generally normal to the tibia. The footrests available in the past that have a flat footrest surface have a left side footrest and right side footrest. To obtain the third footrest position, in addition to the second footrest position, a second set of footrests is required. The second set of footrests must be attached to the crash bars below or above the first set. Both inside footrests are generally at one common elevation. Both outside footrests are generally at a common elevation and either above or below the inside footrests.


Methods and systems use print drivers to automatically record identifications (IDs) of the computerized devices and applications that provided different printable items to the print drivers. The methods and systems automatically send the IDs of the computerized devices and applications that provided the different printable items to an analytics engine. The methods herein automatically produce metrics based the computerized devices and applications used to generate the different printable items using the analytics engine.

Systems and methods herein generally relate to printing devices and printing systems, and more particularly to methods and systems that use the print driver to analyze and change the printing process.
When a document is submitted for printing, a print driver converts it into a print ready format, before sending it to the printer. The print controller does other processing on the document specified by the print ticket. However, several pieces of printing data such as application type and version, operating system and version, format conversion time, device the document originated from, etc., are available for captured for analytics purposes, but may not be captured.

Gathering analytic data using print drivers


A user's content presentation device automatically measures the technical objective quality of an Internet video stream and/or estimates the perceived subjective quality of the stream, and provides feedback to the user regarding one or both of these estimates.

The video (and audio) obtained from many Internet sites for display on Internet TVs is of poor quality for various reasons, including quality of original encoding and network conditions. For example, a user might view Internet video on a device and might be presented with a menu with 300 different Internet sites that provide Internet TV content, and as recognized herein it is unfortunately the case that the video (and audio) obtained from many of these web sites may be of poor quality owing to a low encoded bit rate of the original content, as well as owing to packet drops, jitter, latency, and other problems caused by the network between the content server and the user's content presentation device.
As understood herein, such network problems may be caused by inadequate capabilities of the streaming server (e.g. CPU power, bus bandwidth) for the number of streams it is providing simultaneously to different viewers. Network problems may also be caused by inadequate bandwidth of the access link from the server to the Internet, as well as by inadequate bandwidth of the access link from the Internet to the user's content presentation device.
The present invention also recognizes that from the perspective of a user in his house, content from certain Internet TV sites will consistently provide content that is superior in technical quality to content from other Internet TV sites. In addition, some Internet TV sites may consistently be sources of video that may have unacceptably poor quality when viewed on the user's content presentation device. The problem then becomes how a user might determine which Internet sites are preferable with regard to technical quality of content, and once this is determined, how a user might remember the quality of content from various sites for future reference. With these critical recognitions in mind, the invention herein is provided.

Method and system for providing recommendations for internet content providers


The present invention relates to an optical fiber coating method and an apparatus therefor which can form high quality coating layer on an optical fiber (12) by preventing non-concentricity of a coating resin (14) applied on the optical fiber (12) and admixing of bubble. The optical fiber coating apparatus according to the present invention includes at least one pair of an illumination light introducing window (39) and an optical fiber monitoring window (40) formed facing each other with the resin pool between in a side wall portion of a die holder (17), opposing a resin pool (27), a light source (41) opposing to the illumination light introducing window (39) and projecting an illumination light toward the center portion of the resin pool (27), an image pick-up device (42) opposing the optical fiber monitoring window (40) for monitoring at least a contact portion between the optical fiber (12) and the coating resin (14) and in the vicinity thereof, and coating condition modifying means for modifying a coating condition of the coating resin (14) with respect to the optical fiber (12) on the basis of the result of observation of the image pick-up device (42).

1. Field of the Invention
The present invention relates to an optical fiber coating method and apparatus therefor, which can form a high quality coating layer on an optical fiber which is drawn at high speed.
2. Description of the Related Art
An optical fiber drawn from a drawing furnace is normally provided a primary coating to be a buffer layer with an ultraviolet curing resin, silicon resin or the like, before contacting with a solid substance, such as a take-up roller. Furthermore, a secondary coating layer for reinforcement is provided with an ultraviolet curing resin, nylon or the like.
As such conventional optical fiber coating apparatus, the apparatus disclosed in Japanese Patent Application Publication No. 2-25854 (1990), Japanese Patent Application Laid-Open No. 61-72656 (1986), Japanese Patent Application Publication No. 5-37938 (1993), Japanese Patent Application Laid Open No. 64-65430 (1989), for example, have been known.
The apparatus disclosed in Japanese Patent Application Publication No. 2-25854 detects a center position of an optical fiber drawn from a drawing furnace by means of a measuring unit. Then, the overall coating apparatus is shifted along a plane perpendicular to an axis of the optical fiber by means of a motor so that it may be aligned with the optical fiber coaxially. Thereby, the coating layer of uniform thickness is formed on the optical fiber.
The apparatus disclosed in Japanese Patent Application Laid-Open No. 61-72656 measures an external diameter of the optical fiber with a coating resin layer after passing through a coating die set by an external diameter measuring device. On the basis of the measured value, a supplying pressure of a resin supplied in the coating die set is controlled. Thereby, the optical fiber having a coating layer of uniform external diameter can be obtained.
The apparatus disclosed in Japanese Patent Application Publication No. 5-37938 detects concentricity of a coating resin layer applied by a coating application device with respect to the optical fiber by means of a monitoring device. On the basis of result of detection, the coating application device is inclined about an orthogonal two axes (these two axes are located on a plane perpendicular to the axis of the optical fiber) taking a lower side outlet orifice of the coating application device as a center. Thereby, non-concentricity of the coating resin layer with respect to the optical fiber can be restricted.
In the apparatus disclosed in Japanese Patent Application Laid-Open No. 64-65430, the optical fiber on which the primary coating resin in an upper tank have been supplied, is guided in a pool of a secondary coating resin which is supplied into the lower tank. Then, a transmitted illumination light is projected to the optical fiber to detect the non-concentricity of the primary coating resin layer. On the basis of this, the position of the upper tank relative to the optical fiber is corrected so as to reduce magnitude of non-concentricity.
If the thickness of the primary coating layer or the secondary coating layer formed on the optical fiber is non-uniform, a microbending phenomenon due to variation of ambient temperature, external force applied on the optical fiber or the like, namely, irregular bending, may be caused on the optical fiber resulting in increase transmission loss of the optical fiber. Also, when the thickness of the primary coating layer or the secondary coating layer is non-uniform, strength at the portion where the coating layer is thin, becomes relatively low to increase tendency to snap at such portion. Furthermore, if a bubble is admixed in the coating resin layer, the strength of the optical fiber at such portion becomes relatively low. In addition, since the volume of the bubble varies depending upon variation of the ambient temperature, the foregoing microbending phenomenon is caused to increasing transmission loss of the optical fiber.
Recently, as optical fiber preform have expanded in length, drawing speed is becoming higher. When the optical fiber is drawn at such high speed, it may be possible to reduce non-concentricity of the coating resin layer by the conventional coating apparatus disclosed in Japanese Patent Application Laid-Open No. 64-65430. However, it is inherently required to detect the magnitude of non-concentricity as a numerical value which is difficult to calculate. Furthermore, it is not possible to make the thickness of the coating resin layer uniform or to prevent bubbles from being included in order to form the high quality coating layer. In addition, since the optical fiber after applying and curing the primary coating resin is observed in the secondary coating resin, a dedicated observing means becomes necessary for measuring the magnitude of non-concentricity to observe the optical fiber after secondary coating. As a result, facility becomes large.
On the other hand, in the invention disclosed in Japanese Patent Application Publication 2-25854, an adjustment for the non-concentricity consisting of shifting the magnitude of the coating device is not sufficient to is adjust uniformity sufficiently. Since fluctuation of the thickness of the coating resin layer does not depend on variation of the supplying pressure, it is not possible to maintain a uniform layer thickness by the method disclosed in Japanese Patent Application Laid-Open No. 61-72656. In the invention disclosed in Japanese Patent Application Publication No. 5-37938, the concentricity monitoring device is required but there is no disclosure for how the fluctuation of the external diameter of the coating resin layer can be restricted.
Furthermore, in these conventional apparatuses, associated with increasing of drawing speed of the optical fiber, delicate variation of the drawing condition, such as temperature or drawing tension of the optical fiber, and supplying pressure or temperature of the coating resin, which has not been significantly affected upon drawing at low speed, should affect for flow condition of the resin to be applied. As a result, non-concentricity of the coating resin layer or non-uniformity of the layer thickness can be caused, and admixing of bubble in the coating resin layer is potentially caused.
Particularly, when the drawing speed of the optical fiber becomes higher, the thickness of the coating resin layer can fluctuate to create an unstable condition. Simultaneously, the non-concentric condition becomes unstable as often as not, and the applying condition of coating resin layer become unstable. In such case, there is not suggested or disclosed as to how the coating device is to be adjusted in the conventional apparatus.
An object of the present invention is to provide an optical fiber coating method which can obtain a high quality coating layer on an optical fiber by reducing non-concentricity or fluctuation of thickness of a coating resin layer applied to the optical fiber drawn at high speed and by preventing admixing of bubbles.
Another object of the present invention is to provide an optical fiber coating apparatus which can realize such optical fiber coating method.

Optical fiber coating method and apparatus therefor


An image rescue system includes an application program for communication with a mass storage device, the application program being in communication with an operating system layer for accessing the mass storage device to read and write information, in accordance with an embodiment of the present invention. The image rescue system further includes a device driver in direct communication with the application program, and in communication with the operating system layer and the mass storage device, the mass storage device allowing the application program to search information in the mass storage device considered damaged by the operating system layer, the damaged information being inaccessible to the operating system layer.

1. Field of the Invention
The present invention relates generally to the field of retrieval and recovery of information and particularly to rapid and efficient retrieval and recovery of information stored in a mass storage device, which is accessible or inaccessible to an operating system.
2. Description of the Prior Art
In modern electronic systems, storage, retrieval, and recovery of digital information plays a significant role in the operation of devices included within such systems. A common example of an electronic system is a personal computer (PC), which requires access to digital data for processing thereof to perform and execute a wide variety of tasks. Digital data may be stored in a PC either internally as in a hard disk or externally in a mass storage data device such as a digital photo reader or a compact flash reader device.
In the conventional methods of accessing digital data, as implemented in electronic systems, an application program operating under a standard commercially available operating system accesses a mass storage data device for reading and/or writing of digital data. The operating system recognizes the mass storage data device and "mounts" it as an operating system data volume, i.e. a "disk drive". The application program thereby accesses the mass storage data device at the logical level within the operating system using the operating system formatting information included within the mass storage data device.
However, the conventional methods of accessing digital data have a limitation that is encountered when the mass storage data device is for some reason corrupted. In the event of corruption of the mass storage data device, the electronic system cannot recover the digital data simply because the operating system is unable to communicate with the mass storage data device. Another limitation of the conventional methods of accessing digital data is that the application program commands the mass storage data device only with standard commands available to the operating system.
In light of the foregoing, it is desirable to develop a method and apparatus for accessing digital data even when the mass storage data device is corrupted and the operating system cannot communicate therewith. Further, the method and apparatus should not interfere with normal operations of the operating system, i.e. be transparent to the operating system. The desired method and apparatus should be able to access, retrieve, and recover information efficiently and cost-effectively.

Image rescue system including direct communication between an application program and a device driver


A display sheet is disclosed comprising, a substrate, first transparent conductors, second conductors and, between first and second conductors, at least one imaging layer comprising a substantial monolayer of isolated domains of liquid-crystal material, dispersed in a continuous matrix, wherein said domains of liquid-crystal material comprises a mixture of at least two populations, a first population comprising a first liquid-crystal material having a first λmax within the infrared spectral region and a second population comprising a second liquid-crystal material having a second λmax within the visible spectral region. Alternately, the imaging layer can comprise a substantial monolayer of isolated domains of liquid-crystal material comprising a population of domains comprising a liquid-crystal material having a λmax between 700 and 800 and having a half-peak width that extends into both the visible spectrum region and the infrared spectral region.

Bi-stable reflective displays based on PDLC are known. A polymer-dispersed liquid crystal (PDLC) system contains droplets of liquid crystal material dispersed in a polymer matrix. Such systems are known in the art and have been disclosed by Doane et al. (Applied Physics Letters 48, 269, 1986), Doane et al. in U.S. Pat. No. 5,251,048, West et al. (Applied Physics Letters 63, 1471, 1993) and by Stephenson (U.S. Pat. No. 6,359,673). The PDLC may be used to create passive matrix displays on flexible substrates. See also U.S. Pat. No. 6,061,107 to Yang et al., incorporated by reference. Chiral-nematic liquid-crystals, also referred to as cholesteric liquid crystals, have the capacity of maintaining (in a stable state) one of a plurality of given states in the absence of an electric field.
West et al. (Applied Physics Letters 63, 1471 1993) disclose a PDLC based bi-stable reflective display. The device comprises droplets of chiral nematic liquid crystal (CLC) in a polymer binder coated between two transparent electrodes. The CLC material can be switched between a reflecting planar state and a weakly scattering focal conic state by application of voltage pulses of different magnitudes. The planar and focal conic states are both stable at zero applied field. However, West et al. disclose the spectrum of only a single CLC material with peak reflectivity of 564 nm and do not teach methods for obtaining an infrared-light reflecting display. They note that the domain structure of the dispersed system in the focal conic state scatters light uniformly over the visible portion of the spectrum with the back scattered intensity gradually increasing at lower wavelengths, they do not specifically teach methods to improve contrast of the display.
U.S. Pat. No. 6,061,107 to Yang et al. discloses a bi-stable polymer-dispersed cholesteric liquid crystal display having flattened domains between glass plates. The flattened domains are said to have a major axis larger than the cell thickness determined by 5-micron glass fiber spacers. The domains are dispersed in a thermoplastic polymer such as polyvinyl butyral polymer. Multicolor displays in which domains having different cholesteric liquid crystals reflecting different color light, representing different pixels, are disclosed.
Stephenson in U.S. Pat. No. 6,359,673 discloses a PDLC-based bi-stable reflective display. By combining the reflections of droplets of CLC material doped to give reflections either in the blue, green and red part of the spectrum or the blue and yellow part of the spectrum, a neutral appearance in the reflective state is obtained. Stephenson teaches that domains or droplets of liquid crystal in the light-modulating layer are smaller than the thickness of the layer so that multiple domains overlap. Stephenson further teaches that the contrast of the display may be improved by combining multiple overlapping domains comprising right-handed and left-handed chiral-nematics.
T. Kakinuma et al., in "Black and White Photo-addressable Electronic Paper using Encapsulated Cholesteric Liquid Crystal and Organic Photoconductor," IDW '02, page 1345 to 1348 discloses a liquid crystal display using a combination of red (pink) and green capsules to create broadband. However, the imaging layer has many overlapping domains (as shown by the enlarged portion of FIG. 1).
U.S. Pat. No. 5,847,798 discloses (particularly in FIG. 7) a liquid crystal cell having multiple stable reflecting states between a colored reflecting state and a light scattering state in order to allow for a substantially white background. Under room light conditions, where light is incident on the cell from all directions, the light reflected from different domains has different colors, including wavelengths that are in the infrared spectral region, because the incident angles θ in different domains are different. As such, the light observed by a human eye is an average of the reflection bands centered at different wavelengths and has a substantially white appearance.
U.S. Pat. No. 6,034,752 to Khan et a. discloses a liquid crystal device in which the liquid crystal material has a pitch length effective to reflect radiation having both the visible and the infrared ranges of the spectrum, either in a single region (single cell) between opposing substrates or in separate regions, for example, in stacked regions in which a first cell reflects red light and a second cell reflects blue light and a third cell reflects green light. The devices described by Khan et al. have a back substrate furthest from the observer that may be painted black or a separate layer may be used to improve contrast. Thus, as shown in the figures, black paint in a background is located on the other side of the ITO electrodes from the layers with the cholesteric material. Example 1 discloses a stacked display, one cell or region reflecting infrared and one cell or region reflecting visible light. Example 2 discloses a composition for a single cell display employing a single liquid crystal material that reflects both visible and infrared radiation. The Examples do not employ domains of liquid crystal in a polymer matrix and the imaging layers are not coated on a flexible substrate.
There are two main methods for fabricating polymer-dispersed liquid crystal devices: emulsion methods and phase-separation methods. Emulsion methods have been described in U.S. Pat. Nos. 4,435,047 and 5,363,482. The liquid crystal is mixed with an aqueous solution containing a binder. The liquid crystal is insoluble in the continuous phase, and an oil-in-water emulsion is formed when the composition is passed through a suitable shearing device, such as a homogenizer. The emulsion is coated on a conductive surface, and the water evaporated. A second conductive surface may then be placed on top of the emulsion layer by lamination, vacuum deposition, or screen-printing to form a device. While the emulsion methods are straightforward to implement, droplet size distributions tend to be broad, resulting in a loss in performance. For cholesteric liquid crystal devices, also referred to herein as CLC devices, this typically means reduced contrast and brightness. Phase separation methods were introduced in an effort to overcome this difficulty.
Phase-separation methods have been outlined in U.S. Pat. No. 4,688,900 and in Drzaic, P. S. in Liquid Crystal Dispersions published by World Scientific, Singapore (1995). The liquid crystal and polymer, or precursor to the polymer, are dissolved in a common organic solvent. The composition is then coated on a conductive surface and induced to phase separate by application of ultra-violet (UV) radiation or by the application of heat or by evaporation of the solvent, resulting in droplets of liquid crystal in a solid polymer matrix. A device may then be constructed utilizing this composition.
U.S. Pat. No. 6,423,368 proposes the use of droplets of the liquid crystal material prepared using a limited coalescence process. In this process, the droplet-water interface is stabilized by particulate species, such as colloidal silica. Surface stabilization by particulate species such as colloidal silica is particularly preferred as it can give narrow size distribution and the size of the droplets can be controlled by the concentration of the particulate species employed. The materials prepared via this process are also referred to as Pickering Emulsions and are described more fully by Whitesides and Ross (J. Colloid Interface Sci. 169, 48 (1995)). The uniform droplets may be combined with a suitable binder and coated on a conductive surface to prepare a device. The process provides significant improvement in brightness and contrast over prior art processes. It also overcomes some of the problems associated with photoinitators and UV radiation, which are used in phase-separation techniques.
Commonly assigned, copending U.S. patent application Ser. No. 10/718,900 to Chari et al. shows that the maximum contrast in a bi-stable cholesteric liquid crystal mixture display prepared by the limited coalescence method is obtained when the uniform liquid crystal domains or droplets are coated as substantially a monolayer on the first conductive support. The bi-stable states in these cholesteric liquid crystal mixture displays are the planar reflecting state and the weakly scattering focal conic state. Backscattering of light from the weakly scattering focal conic state increases drastically when there is more than a monolayer of droplets between the conductive surfaces. Chari et al. disclose a liquid crystal display having an imaging layer comprising a mixture of two populations of liquid crystal domains, both populations, however, having a peak wavelength in the visible spectrum.
It would be useful to provide liquid-crystal displays that reflect in both the visible and infrared light ranges with improved contrast. It would be useful for such displays to be fabricated using simple, low-cost processes.

Reflective liquid crystal display with infrared reflection


A module (38), a terminal (12) including the module, and a system (10) including the terminal (12), are described. The module may be a printer module (38) comprising a print engine (60), a microcontroller (62), and a wireless receiver (66), such as a wireless modem, so that the module (38) is operable to receive data from a remote server (18) and to print the received data. The module (38) also includes a coupler (70 or 270) for directing data received from the wireless modem (66) to the microcontroller (62) and for directing data from the terminal (12) to the microcontroller (62). A method of printing tickets at a terminal (12) and a method of retro-fitting a self-service terminal (12) are also described.

The present invention relates to a module, particularly an item dispensing module such as a printer module, and to a terminal including such a module. In particular, the invention relates to a self-service terminal (SST), such as an automated teller machine (ATM), including such a module. The present invention also relates to a method of fulfilling pre-arranged transactions at a self-service terminal.
ATMs typically include a printer module for providing users with transaction receipts, mini statements, and such like. These printer modules typically include a print engine and a microcontroller for controlling the print engine.
The print engine performs printing functions, such as: feeding paper to a print head, printing data onto the fed paper, cutting the printed paper, and feeding the cut printed paper out through a receipt slot in an ATM's fascia for removal by a user.
The microcontroller provides the print engine with the commands and data necessary for performing these printing functions. The microcontroller also monitors the operation of the print engine and provides state of health information to an ATM controller. This state of health information includes the amount of paper remaining.
Printer modules are typically connected to the ATM controller by a secure serial channel because sensitive account information is sent to the printer module by the ATM controller.
There are a large number of ATMs installed throughout the world, most of them owned and operated by financial institutions, and many of these ATMs have printer modules. These ATMs are expensive to purchase and maintain. It is therefore desirable to use these ATMs for other functions in addition to providing financial transactions, so that additional revenue can be generated.
With the increase in electronic transactions, it has become common to purchase tickets by telephone using a credit or debit card.
One problem associated with this is that to enable a purchaser to redeem the ticket, a physical ticket has to be supplied because many venues are not able to accept electronic tickets. Posting a ticket to a purchaser introduces a delay, which makes postal delivery unsuitable for last minute purchase of tickets.
ATMs could be used to print tickets, but it is a complex task to route data through an ATM network. In addition, ATM networks are secure private networks, so many financial institutions would be unwilling to grant access to these networks to third party ticket suppliers.


A control for a vehicle including a battery, an auxiliary load, an electric power controller controlling electric power exchanged between the battery and the auxiliary load and a charger charging the battery using a power supply outside the vehicle includes: during vehicle drive control, controlling the electric power controller so that an SOC falls within a predetermined range; when the power supply is connected to the vehicle, controlling the electric power controller and the charger so as to carry out extended charging in which a variation in the SOC during the external charging is larger than a width of the predetermined range that is a control range from a control lower limit value to a control upper limit value during drive control; and calculating the full charge capacity by multiplying a ratio of a maximum value of the SOC to a variation in the SOC during the extended charging by an accumulated value of current flowing into the battery during the extended charging.

1. Field of the Invention
The invention relates to control over a vehicle and, more particularly, to charging and discharging control over a battery equipped for a vehicle.
2. Description of Related Art
In recent years, hybrid vehicles and electric vehicles (hereinafter, these are collectively referred to as electromotive vehicles) are practically used. An electromotive vehicle uses a battery, an inverter and a motor that is driven by the inverter, as a power source. In such an electromotive vehicle, usually, charging and discharging of the battery are controlled so that a state quantity (hereinafter, also simply referred to as "SOC") that indicates the state of charge of the battery falls within a constant range. It is known that, when charging and discharging are repeated within such a constant range, there occurs a deviation between an estimated SOC and an actual SOC, a decrease in charging and discharging capacity due to a so-called memory effect, degradation due to sulfation, or the like. It is known that these problems may be eliminated by bringing the battery close to a full charge or a complete discharge (so-called refreshing).
Japanese Patent Application Publication No. 2007-223462 (JP-A-2007-223462) describes a technique that reliably refreshes a battery. A control device described in JP-A-2007-223462, in a hybrid vehicle that is connectable to an external power supply, carries out refresh discharging of the battery before charging the battery from the external power supply, and charges the battery from the external power supply after the battery has been subjected to refresh discharging.
Incidentally, it is possible to estimate the full charge capacity of the battery using an SOC variation amount and accumulated current value during charging (the amount of charge flowing into the battery). That is, by multiplying the ratio of an SOC maximum value to the SOC variation amount (which is expressed by SOC maximum value/SOC variation amount, and is a value larger than 1) by the accumulated current value, it is possible to estimate the amount of charge corresponding to the SOC maximum value, that is, the full charge capacity of the battery.
If the full charge capacity is estimated by the above method, it is presumable that the estimate accuracy of the full charge capacity deteriorates when the SOC variation amount during charging cannot be sufficiently ensured. That is, the accumulated current value during charging is calculated on the basis of an output from a current sensor; however, the output from the current sensor contains an error. Therefore, when the SOC variation amount is small, the rate of amplifying the accumulated current value (=SOC maximum value/SOC variation amount) at the time of estimating the full charge capacity increases, so an error contained in the estimated full charge capacity is also amplified accordingly.
However, JP-A-2007-223462 does not describe anything about the above problem or a solution thereof.

Vehicle control device and vehicle control method


A filler instrument comprises a first chamber section having a first cross sectional area and a second chamber section having a second cross sectional area less than the first cross sectional area. The second chamber section communicates with the first chamber section. The first chamber section includes an inlet for receiving a material into the filler instrument, and the second chamber section includes an outlet for discharging the material from the filler instrument. A first plunger is sized to pass through the first chamber section and not the second chamber section. A second plunger is sized to pass through an interior bore of the first plunger and into the second chamber section. In use, the first plunger displaces material residing in the first chamber section through the second chamber section toward the outlet, and the second plunger displaces material residing in the second chamber section through the outlet.

The deployment of expandable structures, generically called "balloons," into cancellous bone is known. For example, U.S. Pat. Nos. 4,969,888 and 5,108,404 disclose apparatus and methods using expandable structures in cancellous bone for the fixation of fractures or other osteoporotic and non-osteoporotic conditions of human and animal bones.
As part of a fracture fixation procedure, bone cement or other therapeutic compound, can be injected into a targeted bone to repair and/or augment the target bone. Several companies offer bone cement injection devices. These devices are similar to a household caulking gun. Typically, the injection device has a pistol-shaped body, which supports a cartridge containing bone cement. The cement is typically in two-parts and must be mixed in a mixer and transferred into the cartridge for injection.
Just after mixing, and prior to curing, the cement is in a flowing, viscous liquid state, similar to a syrup or watery pancake batter in consistency. The injection device has a ram, which is actuated by a manually movable trigger or screwing mechanism for pushing the viscous bone cement out the front of the cartridge through a suitable nozzle and into the interior of a bone targeted for treatment.
Once injected into the targeted bone, the cement undergoes a curing cycle of perhaps 6 to 8 minutes. While curing, the cement passes from a viscous liquid to a putty-like consistency and finally to a hard rigid block.

Systems and methods for treating vertebral bodies


A variable compression ratio-applied control system using an ADAS and a control method thereof are provided. The system includes a driver assist unit for measuring the distance and the relative speed with a preceding vehicle, and a compression ratio changing unit for changing a compression ratio during traveling, and a neutral control mode for blocking power transfer by a transmission during traveling is implemented, a compression ratio changing unit is operated by using the information acquired through the driver assist unit in a state where the neutral control mode has been implemented, and the compression ratio is changed during inertia traveling during which the neutral control mode has been implemented.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Generally, an engine block, a cylinder head, and a connecting rod that form an engine are determined in size at the time of manufacture. Therefore, a compression ratio obtained by dividing the volume of a cylinder and the volume of a combustion chamber by the volume of the cylinder could not be changed.
When the compression ratio is high, the thermal efficiency increases but the friction increases, thereby occurring knocking or misfiring. Meanwhile, as illustrated in FIG. 1, when the engine is operated at a specific RPM, the fuel efficiency is enhanced as the load is increased. Therefore, there has been a study for enhancing the fuel efficiency by increasing the compression ratio when the engine load is small.
Therefore, as illustrated in FIG. 2, a variable compression ratio technology for mounting a link structure 2 on a connecting rod 1 to change the stroke length of a piston head has emerged.
However, when the compression ratio is changed by the variable compression ratio technique, the torque temporarily becomes unstable, and the combustion noise is changed, thereby causing a driver to feel the vehicle failure. Particularly, when the compression ratio was changed, the RPM of the engine was instantaneously changed in order to keep the current torque, such that an impact similar to the shift impact was transferred to the driver. When changing from a low compression ratio to a high compression ratio, the engine operating sound was changed as the explosion pressure increased, thereby causing the driver to feel instability of the engine failure.

Variable compression ratio-applied control system using ADAS and control method thereof


A drum brake includes a brake drum with an attaching region for arranging the brake drum on a vehicle part, such as a wheel hub, and a shell region with a first contact face, and a friction lining with a second contact face which faces toward the shell region, the first and second contact face being curved along or in a radial plane.

The present invention relates to a drum brake and to a brake shoe of a drum brake, both in particular for commercial vehicles, such as trucks, semitrailers, trailers or the like.
Drum brakes of the type under discussion here are well known from the prior art. Here, a brake drum is provided, in the interior of which two brake shoes are mounted pivotably, and the brake shoes are pressed via a cam roller and a camshaft onto the inner circumferential face of the brake drum. It is a problem in drum brakes of this type, however, that, upon actuation of the drum brake, the open region of the brake drum which does not have the attaching region for mounting on the wheel hub expands on account of thermal influence, with the result that the brake linings no longer pass into full surface contact with the brake drum.
It is therefore an object of the present invention to provide a drum brake and a brake shoe of a drum brake, in particular for commercial vehicles, which ensure high operational reliability in all operating states, in particular by way of full surface bearing of the brake linings against the brake drum.


An enclosure and operable storage system for efficiently utilizing a toy, literature item, or other novelty item in conjunction with a personal computer. The enclosure and operable storage system generally includes an enclosure, wherein the enclosure is comprised of a portable configuration and playful configuration, or comprised of a book. A computer system including a memory device, at least one network adapter, and optionally a processing unit are positioned within the enclosure. At least one virtual application or virtual operating system is installed upon the memory device to be run by the processing unit of the host computer. Additionally, at least one external peripheral connector is connected to the computer system to connect to at least one peripheral device of a host computer.

1. Field of the Invention
The present invention relates generally to central processing units and more specifically it relates to an enclosure and operable storage system for efficiently utilizing a toy, literature item, or other novelty item as a personal computer or in conjunction with a personal computer.
2. Description of the Related Art
Any discussion of the related art throughout the specification should in no way be considered as an admission that such related art is widely known or forms part of common general knowledge in the field.
Central processing units have been in use for years. Typically, computers (i.e. personal computers) include various electronic components, such as but not limited to a motherboard, a CPU (i.e. microprocessor), mass storage device (i.e. hard drive), mass memory (i.e. RAM), power supply (e.g. AC, DC), expansion cards (e.g. graphics cards, sound cards, modem, etc.), optical disc drive, operating system (i.e. MICROSOFT, LINUX, etc.) and various other electronic components, mechanical components and software programs. Computers are also generally housed within a rectangular shaped enclosure and may connect to or include within various interface devices (e.g. monitor, keyboard, mouse, etc.).
The enclosure (i.e. rectangular shaped structure) associated with many computers may become mundane for many people over time. This can be especially prevalent with children, wherein some children may lose attention with unpleasant looking objects quickly. In today's ever increasing technology focused society, it is important for many individuals to learn computer skills at an early age. Because of this increasing need and the general lack of efficiency in the prior art, there is a need for a new and improved enclosure and operable storage system for efficiently utilizing a toy, literature item, or other novelty item as a personal computer or in conjunction with a personal computer.


A laser weldable PBT-series resin composition and a molded product thereof are provided, in which the composition is weldable uniformly and has high welding strength even when the composition comprises a polybutylene terephthalate (PBT) as a base.

A polybutylene terephthalate (PBT)-series resin is excellent in various properties such as heat resistance, chemical resistance, electric properties, mechanical properties and shaping processability (or moldability), and is used for a number of applications. Specific examples of the applications include a variety of automotive electrical components or parts (e.g., various control units, various sensors, and ignition coils), connectors, switch parts, relay parts, and coil parts. These components or parts sometimes need airtightness, and in order to produce such components or parts conveniently, bonding (or joining) means such as an adhesive, a hot plate welding, and an ultrasonic welding have been utilized. Regarding these bonding means, however, some problems have been pointed out. For example, in the case of using an adhesive, the waste of process time up to curing of the adhesive, or the burden on the environment becomes an issue. Moreover, in a hot plate welding or an ultrasonic welding, there is fear that a product receives a damage due to heat, vibration, and others.
On the other hand, a bonding (or joining) method by a laser welding has no damage of a product due to heat or vibration involved in the welding, and the welding process is also very simple. However, it is pointed out that, in the case of bonding a PBT-series resin by a laser welding, the resin cannot be substantially welded because of carbonization or others due to a low transmission of a laser beam. Japanese Patent Application Laid-Open No. 26656/2001 (JP-2001-26656A: Patent Document 1) discloses a process for producing a united molded product which comprises uniting a molded product formed from a polyester-series copolymer having a melting point within a specific range with other molded product by welding processing. This document describes that a homopolyalkylene arylate resin (a polybutylene terephthalate, a polyethylene terephthalate, and a polyethylene naphthalate) has a low laser welding strength.
Japanese Patent Application Laid-Open No. 245481/1998 (JP-10-245481A: Patent Document 2) discloses a thermoplastic resin composition which comprises a composition composed of a thermoplastic polycarbonate resin and a thermoplastic polyester resin (such as a polyethylene terephthalate) and a methacrylic ester-series resin (graft resin) blended therewith in a proportion of 1 to 10% by weight, in which the methacrylic ester-series resin is obtained by graft-polymerizing a monomer containing a methacrylic ester as a main component in the presence of a crosslinked acrylic ester-series elastic body. This document mentions an embodiment in which a bisphenol A-based polycarbonate resin and a polyethylene terephthalate resin are used in a proportion of 1.5/1 to 4/1 (weight ratio) in the resin composition. Further, as a heat-welding method of the resin composition, a hot plate welding, a vibration welding or an ultrasonic welding is also described. In this composition, however, it is necessary to use the graft resin in order to improve welding strength of the composition, and the use of the graft resin tends to deteriorate mechanical strength, heat resistance or others of the composition.
Further, according to a molded product comprising a PBT-series resin as a base, a transmittance relative to a laser beam sometimes fluctuates depending on the site to be irradiated. Therefore, in the case where such a molded product is bonded to a counterpart material (or a resin molded product (or a molded product formed from a resin)) through a welding by a laser beam, it is sometimes impossible to weld the molded product and the counterpart molded product uniformly and firmly with each other on the contact interface.    [Patent Document 1] JP-2001-26656A (Claims)    [Patent Document 2] JP-10-245481A (Claims)

Resin composition for laser welding and molded article

Abstract: The laser weldable resin composition comprises 1 to 50 parts by weight of (B) an elastomer (such as a polystyrene-series thermoplastic elastomer or a polyester-series thermoplastic elastomer), 5 to 100 parts by weight of (C) a polycarbonate-series resin, 1 to 10 parts by weight of (D) a plasticizer (e.g., an aromatic polycarboxylic acid ester, and an acrylic plasticizer), and 0 to 100 parts by weight of (E) a filler or reinforcing agent (such as a glass fiber), relative to 100 parts by weight of (A) a polybutylene terephthalate-series resin (a homopolyester or a copolyester). The molded product prepared from the resin composition has a small light transmittance fluctuation range depending on sites to be irradiated of the molded product. Thus, the molded product can be bonded to a counter part article uniformly by a laser welding.


An underwear includes: a front body formed by a stretchable material and having a cylindrical high neck portion covering a neck at a top portion thereof; and a back body formed by a stretchable material, having both bottom side edges stitched to both bottom side edges of the front body, a top edge stitched to a region from a bottom end of the neck portion to a shoulder, and both top side edges forming armholes. The front body is made of a cylindrical material and is formed by cutting the cylindrical material in an axial direction from a bottom opening portion thereof to the high neck portion. The back body is made of a cylindrical material and is formed by cutting the cylindrical material in an axial direction from one end opening portion thereof to the other end opening portion.

1. Field of the Invention
The present invention relates to underwear worn mainly by women.
2. Description of Related Art
Humans cannot avoid having noticeable wrinkles, sags, or spots as they grow older. In particular, the wrinkles or the like bother women. Therefore, women who have noticeable wrinkles or the like hesitate to wear clothes with a wide-open breast portion. Also, regardless of age, due to cold, humans hesitate to wear clothes with a wide-open breast portion in the winter season or in well-cooled places.
Japanese Patent Application Laid-Open No. 2005-113338 describes underwear that is sewed using skin color stockings that are excellent in stretching property. The underwear is configured to cover from the neck to the bottom of the bust. Therefore, the underwear can secure warmth while hiding the wrinkles or the like of a wearer.
Among the underwear described in Japanese Patent Application Laid-Open No. 2005-113338, in the case of seamless underwear, the production cost increases because it is necessary to manufacture a dedicated production machine. Also, Japanese Patent Application Laid-Open No. 2005-113338 describes a method for producing underwear by using conventional panty hose. However, the production method thereof is complex, and thus the productivity thereof is poor. Accordingly, the underwear described in Japanese Patent Application Laid-Open No. 2005-113338 is expensive.
In addition, in the underwear described in Japanese Patent Application Laid-Open No. 2005-113338, when the wearer moves the neck, shoulder, arm, and the like, a sagging occurs particularly at the cloth ranging from the shoulder to the neck, and the sagging causes a wrinkle. Therefore, although an object of the underwear described in Japanese Patent Application Laid-Open No. 2005-113338 is to hide wrinkles or the like, a noticeable wrinkle is generated by the cloth in a region where a wrinkle hardly occurs in usual cases.


Processes, methods and apparatus relating to olefin oligomerization include the use of Raman spectrometry to monitor the concentration of reactants, products or other chemical components. One or more oligomerization conditions are adjusted in response to those monitored concentrations. The present processes, methods and apparatus are capable of monitoring olefin oligomerization with the use of low resolution Raman spectrometry equipment, even where there is some degree of overlap between Raman spectral peaks. Apparatus for olefin oligomerization reactions have at least one Raman probe located in the oligomerization equipment, the Raman probe providing an output signal, and Raman spectrometry equipment located outside the oligomerization equipment and operatively connected to at least one Raman probe.

Olefin monomers may be oligomerized to form oligomers. For present purposes, oligomer is defined as a series of at least two monomer units and at most roughly 300 monomer units (roughly 600 carbon atoms), and which is a liquid or waxy material at room temperature. Ethylene can be trimerized to form 1-hexene. Processes for oligomerizing olefin monomers typically employ catalyst systems comprising one or more catalytic metal compounds, typically transition metals, perhaps together with a co-catalyst and/or a support such as alumina or silica. Oligomerization processes are generally homogeneous processes. Processes for making 1-hexene from ethylene are typically homogeneous processes, in that the reactants and products are soluble in a diluent, such as isobutane.
It is desired to monitor and control the oligomerization reaction so that one may operate the process efficiently. Control of the concentration of monomer, and if present, comonomer and hydrogen, is required to ensure an efficient, reliable production process. Therefore, it is desirable to monitor the oligomerization process by determining monomer content and, when one or more co-monomers are present, by determining co-monomer content(s). It may also be desirable to determine diluent content and product content.
Current methods of monitoring oligomerization processes and the components in such processes (reactants, products and diluent) are less than optimal for several reasons. In processes for producing 1-hexene from ethylene, the contents of ethylene monomer, 1-hexene product, and by-products such as octene and decene, have typically been determined by gas chromatographic analysis of the flash gas, that is, the gas released at one of the flash tanks where pressure is released.
However, monitoring of an oligomerization process by analysis of the flash gas is less than optimal for several reasons. One reason is the amount of time for such analysis. If an analysis takes too much time, it generally has less value for monitoring, controlling or adjusting the olefin oligomerization process. Also, another concern arises when the oligomerization equipment includes more than one flash chamber, such as a high pressure flash chamber and a low pressure flash chamber. In such instances, gas chromatographic analysis of flash gas takes more time and is potentially less accurate when both high pressure and low pressure flash tanks are in operation.
While the contents of the oligomerization reactor may be determined by removing a small sample for analytical testing in a remote laboratory, this is less favorable than monitoring in situ. It may be dangerous and difficult to remove a sample from a hot process stream, and there are risks that the sample may not be representative of the overall reactor contents or that removing the sample may alter the sample. Sampling is time-consuming, and delay may cause the sample not to be representative of the reactor contents. A significant amount of material may be produced in the time required to remove, prepare, and analyze a sample. The analytical data obtained from the delayed sample is therefore of limited value for proactive process control. Furthermore, additional processing of the extracted sample may be required yet is undesirable.
A preferred method of monitoring a process for oligomerization, such as for making 1-hexene from ethylene, would monitor the process as it happens, or as soon thereafter as practical. It is also preferable that an analysis method be performed in situ, as opposed to being performed on samples removed from the oligomerization equipment. An in situ method would reduce the need to remove samples from the production environment, improve safety, and yield faster measurements. However, there are obstacles to providing in situ on-line chemical information in a process environment. The analytical method must be sufficiently accurate and precise under hostile physical and chemical conditions. The analytical method must be capable of remote detection and analysis.
Analyses of oligomerization processes in situ, that is, within a reactor or associated equipment, have been difficult if not impossible to do, since such processes are carried out at high pressures. However, spectrophotometric apparatus such as a spectrograph and a radiation source can be situated in a location remote from the reactor that is to be analyzed in situ, the sampling site being connected to the apparatus by radiation conduits comprising fiber optic cables.
Raman spectrometry can provide qualitative and quantitative information about the composition and/or molecular structure of chemical components. Raman spectrometry is based upon the vibrational energy of a compound. A sample is irradiated, preferably by a monochromatic light source, and the scattered radiation is examined through a spectrometer using photoelectric detection. Most of the scattered radiation has the wavelength of the source radiation, which is referred to as Rayleigh scattering. However, the scattered radiation also comprises radiation at shifted wavelengths, which is referred to as Raman scattering, which occur at different wavelengths due to molecular vibrations. The difference in wavelengths between the source radiation and radiation affected by molecular vibrations is commonly referred to as the Raman shift. Even if monochromatic light is used as the source radiation, the Raman spectrum will comprise scattered light spread across a wavelength band. The Raman shift or Raman spectrum conveys compositional and molecular information regarding the component in the sample. The Raman spectrum is extremely weak compared to the Rayleigh spectrum.
Not all substances are measurable by Raman spectrometry. There must be a change in polarizability during molecular vibration of a substance in order for that substance to be Raman active.
There are several factors that have favored the use of gas chromatography as an analytical method over Raman spectrometry with oligomerization processes. In general, the reactants and products in oligomerization processes may have peaks in their respective Raman spectra that are relatively close together. For example, in the trimerization of ethylene to produce hexene, the reactant ethylene and the product hexene will each produce similar peaks in their Raman spectra. Ethylene exhibits a peak at 1620 cm−1 while hexene exhibits a peak at 1640 cm−1. As a result, it may be difficult to distinguish between ethylene and hexene, and there is likely to be some overlap in certain peaks. Thus, it would appear necessary to employ high resolution Raman spectrometry equipment to analyze the components of the hexene preparation process. Furthermore, Raman spectrometry equipment, particularly high resolution Raman spectrometry equipment, is relatively expensive, which would generally discourage its use with industrial processes. Gas chromatography equipment has historically been less costly than high resolution Raman spectrometry equipment. Furthermore, gas chromatography sampling systems are well established. Also, gas chromatography equipment tends to provide information that is more readily usable, whereas Raman spectrometry equipment tends to produce information that requires additional analysis. Engineers and operators tend to prefer equipment that provides a relatively simple reading rather than a spectrum.
International Application No. PCT/AU86/00076, which is incorporated herein by reference, discloses monitoring the presence or concentration of one or more chemical components by using Raman scattering. Optical fibers are used to direct electromagnetic radiation to and from the monitored environment, so that the Raman detector may be remote from the monitored environment. It is stated that the Raman monitoring method is applicable to gases, liquids and solids, though no particular chemical components are disclosed as being monitored. It is also stated that it is necessary to examine the intensity of the scattered light at selected characteristic wavelengths. A band pass filter system is used, which has a series of narrow band pass interference filters each having a band pass between 100 cm−1 and 400 cm−1. Each filter is chosen to give maximum transmission of the Raman scattering of a particular component to be analyzed. This international application does not disclose the use of Raman spectrometry to monitor an olefin oligomerization process, or to measure olefin monomers. The international application does not disclose a method of monitoring the presence or concentration of more than one chemical component when those components have overlapping Raman spectra.
U.S. Pat. No. 5,652,653, which is incorporated herein by reference, discloses a method of on-line quantitative analysis of chemical compositions by Raman spectrometry. The method comprises simultaneously irradiating the monitored chemical composition and a reference material. The method applies predetermined calibration means to the standard Raman spectrum of the analyzed chemical composition to ascertain the chemical composition. The method is used for analyzing a polyester manufacturing process. A polyester manufacturing process generally has a liquid reaction mixture that does not include solids or a slurry. The patent discloses the construction of constitution-intensity correlation (CIC) multivariate calibration means. This is done by comparing a plurality of peaks at different wavelengths in the Raman spectra, which are preferably standard spectra, with a plurality of chemical compositions of known concentrations. The wavelengths selected for construction of a CIC depend on the spectral characteristics of the particular component whose concentration in a chemical composition is to be determined. For each component whose in situ concentration in the composition is desired to be monitored at any given time, a separate CIC calibration is prepared.
U.S. Pat. No. 4,620,284, which is incorporated herein by reference, relates to qualitative and quantitative analysis using Raman scattering for substances in gaseous, liquid and solid form to provide numbers, rather than spectra, denoting the amounts of the substances present. It is disclosed that reference spectra are used to establish a relationship between spectra region areas and concentrations of substances, and that composite reference spectra may be prepared. The patent discloses a hydrocarbon analyzer dedicated to "PNA" analysis as a particular embodiment, which determines the composition of a hydrocarbon in terms of three groups: paraffins, napthlanes, and aromatics. Among the prior art disclosed in that patent is work accomplished using the Raman effect to analyze hydrocarbons, including an article entitled "Determination of Total Olefins and Total Aromatics." Similarly, an article entitled "Low-Resolution Raman Spectroscopy," Spectroscopy 13(10) October 1998, discloses Raman spectrometric analysis of mixtures of organic liquids as well as petroleum products.
However, it is believed that Raman spectrometry has not been previously employed to monitor an olefin oligomerization process.

Monitoring and control of processes for making 1-hexene