A method of creating data of a mask for manufacturing a semiconductor device. The mask includes at least one auxiliary pattern arranged adjacent to a line pattern. The at least one auxiliary pattern is allocated in accordance with a rule-based method on the basis of an interval between a first line pattern and a second line pattern adjacent to the first line pattern. Size of the at least one auxiliary pattern is then optimized in accordance with a model-based OPC (Optical Proximity Correction), by shifting edges of the at least one auxiliary pattern and edges for one of the line patterns on the basis of a first light intensity threshold on the at least one auxiliary pattern and a second light intensity threshold on the line patterns.

1. Field of the Invention
The present invention relates to a mask data creation method used for manufacturing a semiconductor device, especially a mask data creation method for a mask with auxiliary patterns.
2. Description of the Related Art
An patterns on a device have been becoming more and more miniaturized as density of a semiconductor device increases. For example, a dynamic random access memory (hereinafter referred to as a DRAM) with 1 gigabit of capacity has been made for practical use. In this sort of large capacity DRAM, width of a line and interval between lines, or line and space, and patterns have been miniaturized. A memory cell of the DRAM is composed of one transistor and one capacitor, and a predetermined number of the memory cells are arranged in X and Y directions according to a scale of integration to form a memory cell array area. Reading/writing information to/from the memory cells is performed by driving a circuit including word lines acting as gates to switching transistors and bit lines for reading and writing information to/from capacitors arranged around the memory cell array. The word lines and the bit lines are orthogonal to each other, and are provided as repetition of a pattern, which is made of lines and spaces between the lines.
In a DRAM, memory cells are allocated most densely in a memory cell array area in order to achieve a larger capacity in a limited chip area of the DRAM. As a result, word lines and bit lines are densely arranged in a pattern of repetition of the lines and intervals between the lines, or a line-and-space pattern, in which width of the lines becomes close to a resolution limit defined by a lithography process, which depends on a photolithography device, resist and so forth. Furthermore, circuits such as a sense amplifier, a decoder and the like, are arranged as peripheral circuits in the memory cell array area with the same pitch as the memory cells. Furthermore, on the further outside of the circuits, a control circuit and an input/output circuit are provided. There is a strong demand especially for a higher scale of integration for a DRAM, and effort has been made for achieving a resolution as high as possible.
Here, resolution means a ½ pitch of the smallest periodic pattern which can form a pattern with a practical depth of focus. The depth of focus means a range of focus which can form a pattern in a resist on a light exposure substrate. If the depth of focus is too small, light is not fully irradiated in a direction of film thickness because of unevenness of film thickness of the resist or a surface of the semiconductor, thus a prominent problem occurs in pattern forming. Therefore, it is desirable to use a large depth of focus.
Generally, it is known that a resolution R is proportional to a wavelength of a light exposure source λ, and inversely proportional to a numerical aperture NA, that is, R=K1*λ/NA. Here, K1 is a factor dependent on a process. Therefore, an improvement has been made in a photolithography device so that the wavelength of the light exposure source λ becomes shorter and the numerical aperture NA becomes higher, namely lower wavelength and higher NA. At present, KrF laser (248 nm of wavelength) and ArF laser (196 nm of wavelength) have been used as exposure sources. And, 0.8 and more for NA is obtained. By virtue of effect of other efforts, a critical size of 100 nm or less has now been achieved.
On the other hand, in lithography in which a mask pattern is transferred from the mask to the semiconductor substrate, it is an important subject to obtain both a smaller resolution and a depth of focus in light irradiation at the same time. It is represented that the depth of focus (DOF) is proportional to the wavelength λ, and inversely proportional to the square of the numerical aperture NA, that is, DOF=K2*λ/NA2. Here, K1 is a factor dependent on a process. Therefore, the depth of focus becomes smaller when a shorter wavelength and higher NA are obtained, and thus, it has been an important subject to secure a depth of focus.
As a method for securing the depth of focus, an oblique incidence illumination method such as zone illumination has been used. This is a method for irradiating only an oblique light to a mask by excluding a vertical light element from the light for illuminating the mask. A quadrupole illumination and the zone illumination have come into practical use. In a conventional usual illumination, image formation state by three-beam interference, in which three beams of zero order diffracted light and ± first order diffracted lights are collected with a projection lens, has been used. On the contrary, in the oblique incidence illumination, one of the ± first order diffracted lights is discarded (irradiated not to enter the projection lens), and two-beam interference, comprising the zero order diffracted light and the rest of the ± first order diffracted lights, is used to form an image.
Comparing the three-beam interference with the two-beam interference in the point of view from the best focus level of the image formation state, the intensity of the light of the two-beam interference is less than that of the three-beam interference since one of the ± first order diffracted light is discarded. However, when paying attention to a beam incidence angle on the image formation surface of the semiconductor substrate, the beam incidence angle for the image formation of the two-beam interference is ½ of that of the three-beam interference. Therefore, an image of the two-beam interference is less blurry when defocused, and sufficient light intensity distribution can be obtained when forming a resist pattern.
Furthermore, as another method, it has been known that it is possible to further increase the depth of focus by using a halftone phase shift mask. A halftone shift phase mask is one in which, a pattern of the mask in the shaded area is formed by a translucent pattern area, so that 2 to 20% of light leaks, is formed on a mask as a shaded area, and a phase of the penetrated light is inverted 180 degrees from a phase of the light of a transparent area adjacent thereto. In the dense pattern made of the line and space described above, the balance of the zero order diffracted light and one of the ± first order diffracted lights is ameliorated and the light intensity is improved when the halftone mask and the oblique incidence illumination are combined by making use of the diffracted light.
This sort of method shows a great effect when applied to the dense pattern made of the line and space described previously, however, the oblique incidence illumination method has little effect to an isolated pattern which does not originate the diffracted light, and thus increase of the depth of focus can not be expected. Here, the isolated pattern includes a case in which the interval between patterns is sufficiently large, and a case in which the interval is relatively close but not as dense as the dense pattern, that is, a middle pitch.
For increasing the depth of focus in the isolated pattern, on the contrary for the case of the dense pattern, decrease of the NA value (the light including only an almost vertical element is irradiated to the mask) and σ value is effective. Here, σ is called a coherence factor, and is represented by a ratio of NA of a lighting optical system and NA of a projection lens. This means that When σ is small, a small light close to a point light source illuminates the mask, and when σ is large, a large light source illuminates the mask. When the halftone phase shift mask is used, an illumination of small σ can also improve the depth of focus. This sort of condition for increasing of the depth of focus of the isolated pattern results in causing an ill effect of miniaturizing the critical size of the dense pattern made of the line and space. Therefore, it has been difficult to satisfy both exposure features of the miniaturized dense pattern and the isolated pattern.
Therefore, a method using a minute pattern called an auxiliary pattern, which do not serve for resolution itself, has been studied in order to satisfy both the dense pattern and the isolated pattern. The auxiliary pattern is also called a light intensity adjustment pattern, an assist bar, a scattered bar, an diffraction bar, or assist feature. By using the mask on which the auxiliary pattern is allocated adjacent to the isolation pattern under a condition of an oblique incident illumination, it is possible to obtain an image formation state which is close to the two-beam interference, and obtain an increased depth of focus. The location and the width of the auxiliary pattern affects the depth of focus of the transferred pattern.
The allocation of the auxiliary pattern is performed during the rule-based OPC process. The OPC stands for Optical Proximity Correction, and means correction in light proximity effect of lithography. Generally, the OPC method is roughly divided into a rule-based OPC and a model-based OPC. The rule-based OPC is a method for correcting a mask pattern based on an amount of correction of the size of a predetermined auxiliary pattern generating portion, by using parameters such as a width of the pattern which is a target for generating the auxiliary pattern, and an interval between the target pattern and a pattern near it, and the like.
On the other hand, the model-based OPC is a method for correcting a mask pattern so that a desired transferred pattern is obtained by using a light intensity simulation based on parameters such as an optical condition, a resist and the like. In order to create a model of the model-based OPC, it is necessary to change the pitch relative to each targeted size in the greater and smaller ranges including the latter, measure the size of the transferred pattern, and match the parameters to be suitable for the measurement result. Then, the light intensity distribution of each portion of the mask is calculated by using the deduced model. Subsequently, the limit of the light intensity by which the resist which has received the light is dissolved is used as a threshold, and correction of the mask size is performed so that a light intensity position of the designated threshold (corresponding to an edge position of a pattern transferred to the resist) becomes a desired size of the transferred pattern.
The reason why the allocation of the auxiliary pattern is carried out by using the rule-based method is that an effective position for allocating the auxiliary pattern is limited. That is, in order to form the image formation state of the two-beam interference, like the case of the dense pattern, the auxiliary pattern should be allocated in a position, adjacent to the pattern, with a fixed pitch interval in which the two-beam interference can occur. Therefore, the model-based OPC which determines an optimal position by performing a simulation for each pattern is not required. The rule-based OPC, which creates a rule table in advance and makes corrections according thereto, is more suitable since the process is speedy.
As described above, the auxiliary pattern can be relatively easily determined by selecting the location to form the two-beam interference between adjoining patterns and allocating so. However, the optimal size (width) of the auxiliary pattern largely depends on a process condition, it is not possible to decide it only by the optical condition. It is desirable that the width of the auxiliary pattern for obtaining an improved effect of the depth of focus is close to the upper limit of the transferred size, but not to be transferred.
However, since whether or not the auxiliary pattern is transferred is largely depend on a photosensitivity of the resist, the optimization of the width had to be experimentally decided by allocating a different width of the auxiliary pattern for each line pattern location. The process of optimizing the size is the most time-consuming part for creating a rule for the mask with the auxiliary pattern. That is, there is a plenty of steps for creating the mask rule.
In a lithography applied to a conventional semiconductor device with a loose rule, in which the smallest line width is on the order of 300 nm, taking into consideration of the dense pattern which is made of the line and space, and a sparse pattern in which adjacent patterns sufficiently distant from each other, it has been a large subject to study an allocation method of the auxiliary pattern for the sparse pattern. U.S. Pat. No. 5,242,770 and U.S. Pat. No. 5,447,810 disclose allocation methods relating to this.
However, a lithography applied to a semiconductor device with a current severe rule, such as a rule in which the smallest line width is on the order of 100 nm, a size correction of the adjoining pattern with the middle pitch, in which a pattern interval is relatively close but not as dense as the dense pattern, is an important subject, rather than the sparse pattern. Since the middle pitch is largely used for a peripheral circuit located around the periphery of the memory array described previously, the interval thereof is not fixed but varied. Conventionally, since a pattern width was wide, it has been possible to treat as a sparse pattern in which each of the adjoining patterns allocated in the peripheral circuit are not affected by each other, or the effect can be ignored.
However, nowadays, in order to meet a demand for improving a scale of integration, the pattern width became narrow, and each pattern has to be allocated close to each other, thus an effect among each pattern can not be ignored even in the peripheral circuit. As described above, it is necessary to study the optimal width of the auxiliary pattern for allocating thereof for using in the middle pitch pattern with various intervals. Therefore, it causes to require more time for a creating mask rule, and this enlarges the problem.
U.S. Pat. No. 5,821,014 discloses a method for allocating an auxiliary pattern having a different width case by case in order to allocate the auxiliary pattern to various pitch patterns. In this disclosure, the auxiliary pattern allocation is examined by matching the auxiliary patterns with different width until the optimal pattern is obtained, therefore mask creation time is increased as described above. Furthermore, Japanese Unexamined Patent Publication No. H6-242594 discloses an allocation method for an auxiliary pattern for a middle pitch pattern. However, it does not mention difficulty for deciding width of the auxiliary pattern to be located for various middle pitches.
As described above, conventionally, three parameters, that is, the location, the number, and the width of the auxiliary pattern have been decided by using the rule-based OPC. The location of the auxiliary pattern, and the number of the auxiliary pattern can be set easily by using an optical condition and a predetermined rule, respectively. However, as a circuit becomes miniaturized, it has been required greater amount of time for deciding the width of the auxiliary pattern to handle patterns with various width and intervals. According to miniaturization of the pattern, pattern correction has been necessary even for the middle pitch pattern on a mask, which had been treated as a sparse pattern. Various sizes are used in the middle pitch pattern, and thus a problem that a great amount of time is required for deciding a rule in a rule-based OPC occurs.


Spherical silicone fine particles having an average particle diameter of 0.1 to 5 xcexcm, which can be produced without decreasing a yield and also without conducting a dilution step, and a process for effectively producing the same. Spherical silicone particles are obtained by reacting an organotrialkoxysilane with a tetraalkoxysilane. Water in an amount of 20 to 150 moles is added to 1 mole of the silane mixture, which is subjected to hydrolysis under an acidic condition to obtain an aqueous or alcohol solution of an organosilanol and/or the partial hydrolyzed product thereof, and an aqueous alkaline solution is added thereto, mixed and allowed to stand to conduct polycondensation.

The present invention relates to spherical silicone fine particles and the process for producing the same. More specifically, the present invention relates to spherical silicone fine particles having an average particle diameter of 0.1 to 5 xcexcm and the process for effectively producing the same.
A process described in JP-A-63-77940 (The term xe2x80x9cJP-Axe2x80x9d as used herein means an xe2x80x9cunexamined published Japanese patent applicationxe2x80x9d) has conventionally been known as a process for producing spherical silicone fine particles. This production process obtains spherical silicone fine particles wherein the shape of the respective particles is independently truly spherical, by subjecting organotrialkoxy silane and/or partial hydrolyzed product thereof to hydrolysis and polycondensation at the interface between the organotrialkoxy silane and/or the partial hydrolyzed product thereof, or a mixed liquid of the organotrialkoxy silane and/or the partial hydrolyzed product thereof and an organic solvent as an upper layer, and a mixed liquid of ammonia and/or amine and an organic solvent as a lower layer.
Silicone fine particles obtained by this process have characteristics such that the particle shape is spherical, the hydrophobic property is high, the condensation ability is low, and the specific gravity is small. In view of those characteristics, the silicone fine particles are used as modification additives for imparting lubricating property to paints, plastic, rubber, cosmetics and paper, improving dispersibility, and giving light-scattering function.
However, the production process of such spherical silicone fine particles is complicated to maintain a reaction interface where the organotrialkoxysilane and/or the partial hydrolyzed product thereof are subjected to hydrolysis and polycondensation. As a result, there was the problem that productivity to time and the capacity of an apparatus is low.
In order to solve these problems, the present inventors proposed a process for producing spherical silicone fine particles comprising optionally diluting an aqueous/alcohol solution of an organosilane triol obtained by hydrolyzing an organoalkoxysilane and/or the partial condensation product thereof, adding an aqueous alkaline solution thereto, followed by mixing, and then keeping the resulting mixture in a stationary state (JP-A-2000-186148). According to this process, the hydrolysis and the polycondensation are effected in a uniform reaction state so that spherical silicone fine particles are obtained. Thus, complicated keeping of an interface where hydrolysis and polycondensation are effected is not required as in the conventional art and, therefore, productivity to time and the capacity of an apparatus can greatly be improved.
According to this process, an average particle diameter of spherical silicone fine particles obtained can be controlled in a range of 1 to 10 xcexcm and the spherical silicone fine particles obtained have a characteristic such that the particle size distribution of the resulting particles is sharp as compared with the conventional art. The spherical silicone fine particles are compounded with plastics and used for a light diffuser panel of a liquid crystal display and for imparting lubricating property for enhancing running stability of a video tape for a high-quality image.
This process, however, has a problem in that it is difficult to obtain fine particles having an average particle size of less than 1 xcexcm. Namely, according to this process, for obtaining particles having a relatively small average particle size, the concentration of a reaction product is required to decrease or a dilution step is required. Thus, in the production of particles having a relatively small average particle size, the productivity thereof to time and the capacity of an apparatus is low as compared with a case of obtaining particles having a relatively large average particle size.
The present invention has been made to solve these conventional problems.
Accordingly, one object of the present invention is to provide spherical silicone fine particles having an average particle diameter of 0.1 to 5 xcexcm, which can be produced without decreasing the yield and also without a dilution step.
Another object of the present invention is to provide a process for effectively producing such spherical silicone fine particles.
As a result of extensive investigations to achieve the above-described objects, it has been found that the above-described objects could be achieved by adding an aqueous alkaline solution to an aqueous/alcohol solution of silanol (obtained by hydrolyzing a mixed silane comprising an organotrialkoxysilane and an organotetraalkoxysilane wherein four hydrolyzable groups are bonded to Si) and/or the partial condensation product thereof, mixing the resulting mixture rapidly and uniformly, and allowing the mixture obtained to stand. The present invention has been completed based on this finding.
The spherical silicone fine particles of the present invention is obtained by polycondensation reaction of an organotrialkoxysilane represented by the following formula (I):
R1Si(X)3xe2x80x83xe2x80x83(I)
wherein R1 represents a monovalent group selected from a group consisting of a substituted or unsubstituted alkyl group, alkenyl group and phenyl group; X represents the same or different hydrolyzable group, and an organosilane represented by the following formula (II):
SiX4xe2x80x83xe2x80x83(II)
wherein X represents the same or different hydrolyzable group, with a R1/Si ratio being in a range of 0.9 to less than 1.0.
The process for producing spherical silicone fine particles of the present invention comprises:
(A) a step of mixing an organotrialkoxysilane represented by the following formula (III):
R1Si(OR2)3xe2x80x83xe2x80x83(III)
wherein R1 represents a monovalent group selected from a group consisting of a substituted or unsubstituted alkyl group, alkenyl group and phenyl group; R2 represents the same or different substituted or unsubstituted alkyl group; and
a tetraalkoxysilane represented by the following formula (IV):
Si(OR2)4xe2x80x83xe2x80x83(IV)
wherein R2 represents the same or different substituted or non-substituted alkyl group such that a ratio of R1/Si is 0.9 to less than 1.0, adding thereto water in an amount of 20 to 150 moles per mole of the silane of the resulting mixture to conduct hydrolysis under an acidic condition, thereby obtaining an aqueous or alcohol solution of an organosilanol and/or the partial hydrolyzed product thereof; and
(B) a step of adding an aqueous alkaline solution to the aqueous or alcohol solution of an organosilanol and/or the partial hydrolyzed product thereof obtained above, followed by mixing and mixed, and subjecting the organosilanol and/or the partial hydrolyzed product thereof to polycondensation under a stationary state to form spherical silicone fine particles.
The present invention is described in detail below.
Examples of R1 in an organotrialkoxysilane represented by the formula (I) used in the present invention include an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms and a phenyl group. Those can be used alone or as mixtures thereof. Methyl group is preferable because of good reactivity.
Example of X in the general formula (I) or (II) is an alkoxy group represented by OR2, which can be an organosiloxane partially comprising a halogen such as chlorine. Examples of R2 of the alkoxy group represented by the above OR2 include an alkyl group such as methyl, ethyl or butyl; and an alkoxy-substituted hydrocarbon group such as 2-methoxyethyl, or 2-ethoxyethyl. Methyl, ethyl and 2-methoxyethyl are preferable because of high hydrolysis rate. Examples of such a methyltrialkoxysilane include methyltrimethoxysilane, methyltriethoxysilane, methyltri-n-propoxysilane, methyltriisopropoxysilane, and methyltris(2-methoxyethoxy)silane. Those can be used alone or as mixtures thereof.
In the reaction in the process for producing spherical silicone fine particles of the present invention, when an organosilane wherein a halogen is bonded to Si is used, the hydrolysis rate is too high so that it is difficult to control the reaction. Therefore, an organotrialkoxysilane represented by the formula (III) and a tetraalkoxysilane represented by the formula (IV) are used. Examples of R2 in OR2 of the formulae (III) and (IV) include an alkyl group such as methyl, ethyl or butyl; and an alkoxy-substituted hydrocarbon group such as 2-methoxyethyl or 2-ethoxyethyl. Methyl, ethyl and 2-methoxyethyl groups are preferable because of high hydrolysis rate. Examples of such an organosilane include tetramethoxysilane, tetraethoxysilane, tera-n-propoxysilane, tetraisopropoxysilane and tetra(2-methoxyethoxy)silane. Those compounds can be used alone or as mixtures thereof.
In first step (A) in the process for producing spherical silicone fine particles, an organotrialkoxysilane represented by the formula (III) and a tetraalkoxysilane represented by the formula (IV) are hydrolyzed under an acidic condition to obtain an aqueous or alcohol solution of an organosilanol and/or the partial hydrolyzed product thereof.
A mixing ratio of the organotrialkoxysilane represented by the formula (III) and the organotetraalkoxysilane represented by the formula (IV) is 0.9 to less than 1.0, preferably 0.92 to 0.98, in terms of a R1/Si ratio. When the R1/Si ratio approaches 1.0, an average particle size distributes in a narrow range. However, the yield tends to lower. Contrary to this, when the R1/Si ratio approaches 0.9, an average particle size distributes in a wide range. However, the yield becomes high. Therefore, a mixing ratio should be controlled according to the purpose of use.
Either an organic acid and an inorganic acid can be used as an acid used in the present reaction. Examples of the organic acid include formic acid, acetic acid, propionic acid, oxalic acid and citric acid. In view of ease in controlling a partial condensation reaction of the generated organosilanol, acetic acid is particularly preferable. Any inorganic acid can be used as the inorganic acid so long as impurities such as an ionic substance which limits the use of finally obtained silicone fine particles do not remain. Hydrochloric acid is particularly preferable because of being readily available.
Hydrogen chloride contained in a trace amount as an impurity of a silane or organochlorosilanes such as an organotrichlorosilane can be used as a catalyst or a catalyst precursor. The amount of an acid used varies depending upon a kind of a silane and an acid and an amount of water used. However, an acid concentration of an aqueous acid solution prepared by dissolving the acid in water is preferably in a range of (1 to 100)xc3x9710xe2x88x925 N. If the acid concentration is less than 1xc3x9710xe2x88x925 N, hydrolysis does not proceed adequately. On the other hand, if it exceeds 100xc3x9710xe2x88x925 N, it is difficult to control hydrolysis reaction, making it difficult to optionally control an average particle size of finally obtained silicone fine particles.
An amount of water used in hydrolysis is preferably 20 to 150 moles per mole of the silane. If the amount of water is less than 20 moles, agglomeration among fine particles formed tends to occur. On the other hand, if it exceeds 150 moles, the yield of silicone fine particles finally obtained is decreased, so that the productivity thereof is also decreased. Water used for hydrolysis preferably has a high purity such that impurities such as an ionic substance which limits the use of finally obtained silicone fine particles do not remain. Namely, water having an electric conductance of 50 mS/m or less is preferably used. In particular, ion-exchanged water having an electric conductance of 2 mS/m or less is more preferably used.
Hydrolysis reaction is not particularly limited. However, in order to effectively obtain an organosilanol and/or the partial condensation product thereof, the reaction is preferably conducted in a state such that a temperature in a range of 10 to 60xc2x0 C. is maintained for 1 to 6 hours.
Thus, according to step (A), a silane used is hydrolyzed so that an organosilanol and/or the partial condensation product thereof is obtained in the form of a solution formed by dissolving the same in a mixture comprising an excess amount of water other than water consumed in the hydrolysis and an alcohol or a substituted alcohol formed by the reaction.
Second step (B) of the production process of the present invention is a step of obtaining spherical silicone fine particles from the aqueous or alcohol solution of an organosilanol and/or the partial hydrolyzed product thereof obtained in first step (A) (hereinafter this solution is referred to as a xe2x80x9csilanol solutionxe2x80x9d) by polycondensation reaction. The reaction in this second step is performed by adding an aqueous alkaline solution to the silanol solution obtained, mixing the resulting mixture, and then placing the uniformly mixed reaction system in a stationary state. Those procedures should be performed rapidly.
The aqueous alkaline solution shows basic property, and functions as a neutralizing agent of an acid used in the first step and also functions as a catalyst of the polycondensation in the second step.
Examples of an alkaline substance of such an aqueous alkaline solution include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide and potassium hydroxide; ammonia; and organic amines such as monomethylamine and dimethylamine. Of those compounds, ammonia and organic amines are preferable because even a trace amount of impurities, which limit the use of the resulting spherical silicone fine particles, does not remain. Further, ammonia is particularly preferable because of being easily removed.
The aqueous alkaline solution is used in an amount so as to neutralize an acid and also effectively function as a catalyst in a polycondensation reaction. Further, it is used in the amount which can maintain a time capable of rapidly placing a reaction system prepared by rapid addition and uniform mixing in a stationary state prior to formation and deposition of silicone fine particles. Namely, on the premise that the amount of an aqueous alkaline solution used exceeds an amount required for neutralization of an acid, an aqueous ammonia solution having a concentration of 0.1 to 0.5% is used in an amount of 0.5 to 30 parts by weight per 100 parts by weight of the silanol solution obtained in the first step.
In second step (B), the silanol solution is charged into a reaction vessel and the alkaline solution was added to the silanol solution. The resulting solution is rapidly and uniformly mixed by an optional means such as stirring. The addition method is not particularly limited so long as the addition can be effectively made within a minimum mixing time. The alkaline solution may be added from the above the silanol solution or maybe introduced into the silanol solution through a nozzle. The mixing time is one which is required to dissolve an alkali catalyst in a reaction system, appropriately a time as short as possible. For example, the mixing time including the addition time is 0.5 to 10 minutes, preferably 0.5 to 3 minutes, at a temperature of 5 to 30xc2x0 C., preferably 10 to 20xc2x0 C.
After uniformly mixing, the resulting system is allowed to stand to complete polycondensation. The procedure of allowing the system to stand can provide spherical silicone particles having a desirable average particle size and also can provide an excellent efficiency to time and the capacity of an apparatus. For example, such a procedure is conducted for 2 to 24 hours, preferably 2 to 10 hours, while maintaining the above-described mixing temperature.
By conducting polycondensation in second step (B) spherical silicone fine particles can be obtained in a water/alcohol mixture in the form of dispersion or sol. Spherical silicone particles obtained in accordance with the present invention in the form of dispersion or sol can be used as they are. Further, depending upon the necessity, appropriate treatments such as filtration, drying and pulverization are applied thereto, whereby the spherical silicone particles can be recovered as finely divided powder. An average particle diameter of silicone fine particles can be controlled by varying a proportion of a tetraalkoxysilane used in hydrolysis, an amount of water used in hydrolysis, and an amount of an alkali used in polycondensation.
The present invention will be further described in detail by the following Examples and Comparative Examples. In these Examples, parts and percents are by weight. The evaluation method of fine particles shown in the Examples is for an average particle diameter (xcexcm) of 50 or more particles calculated from a scanning electron microscope photograph and roundness (ratio of short diameter of particle/long diameter of particle). The present invention is not limited to those Examples.

Spherical silicone fine particles and process for producing the same


A mobile communication terminal includes two housings and a hinge portion for movably coupling the housings together. The terminal further includes: a non-contact communication portion for conducting close range wireless communication; an operation portion; and a display portion. The non-contact communication has a loop-like antenna disposed in one of the housings. The display portion displays information with regard to a communication status of the close range wireless communication. Another communication terminal includes a housing having a display portion and an operation portion disposed therein; and a non-contact communication portion for conducting close range wireless communication. The non-contact communication portion has a loop-like antenna formed in a region of the housing having the display portion disposed therein.

1. Field of the Invention
The present invention relates to a mobile communication terminal, and more particularly to a mobile communication terminal with a non-contact communication function for wireless communication at close range.
2. Description of the Related Art
These days, a technology is widespread for conducting wireless communication at close range utilizing, for example, a non-contact type IC card to carry out user authentication and to transmit/receive information. JP 2004-56413 A discloses a technology where a mobile communication terminal such as a mobile phone conducts the above-mentioned close range wireless communication. More specifically, a mobile phone can have a user identity module (UIM) attached thereto. The UIM has an IC chip, a loop-like antenna coil, such as a loop antenna coil, and the like for close range wireless communication. The antenna coil may be attached to the mobile phone in advance. A user of the mobile phone can use the mobile phone for user authentication, entrance into (or exit from) a specific place, transmittance/reception of information with an external device, and the like.
The UIM is disposed far from a display portion of the mobile phone to keep out of the way of the display portion. It follows that the UIM is proximate to a user's hand which operates a key operation portion. A hand or fingers of the user who grasps the key operation portion degrade antenna characteristics and decrease the sensitivity of the close range wireless communication. In close range wireless communication, a magnetic flux which passes through a center portion of the antenna coil generates induced electromotive force for conducting wireless communication. In order to improve the sensitivity of the wireless communication, it is necessary to, for example, make as much magnetic flux as possible pass through a cross-section of the antenna coil. However, the antenna coil attached to the UIM is an antenna coil having a relatively small cross section. Therefore, the amount of magnetic flux which passes through the center portion of the antenna coil is limited.


An asymmetric geometry headlamp for vehicular use is built as a multifaceted three dimensional body which has multiple light emitting devices (LEDs and/or laser emitters) installed on its angled facets, hence forming a multipurpose illumination apparatus within a single assembly which is designed to provide; a low beam with a wide illuminated area covering 2 PiSteradians, a high beam all position and signaling lights. A microprocessor based system runs real time, continuously adaptive control routines for day and night conditions and provides the electric signals necessary for the independent control of the luminous intensity, direction and color spectrum to each facet of the headlamp's LEDs (light emitting diodes) and for the high beam. Multiple photo-sensors, CCD or CMOS video cameras, position encoders and accelerometers provide the feedback signals used in the automation of all lighting functions in a system designed to completely replace the manual actuation of lights on vehicles.

In the present market, the design of the vehicular (automotive) headlamps may be characterized by fixed emitting fixtures presenting a fixed luminous intensity with unidirectional orientation of the main light rays (vectors). The photoelectric characteristics of these headlamps are controlled manually which in fact adds to the burden of night driving, increasing driver's response time to avoiding obstacles and reduces his perception in distinguishing shapes and the road topography due to the high contrast and penumbra effects created by such static design concepts. Due to the sudden change in road illumination intensity during high-low beam switching, there are seconds of blindness following this action which have negative results in driving performance and had proven to be a source of accidents. Prior art is basically oriented on limited initial illumination and relies on increasing the frontal and side luminosity accordingly with the external the light conditions, in other words it starts at the low point of illumination and adjusts it higher as needed.
This application introduces a new concept where initially all light emitting devices provide full frontal and side illumination over a wide angle of visibility pattern which is further controlled and adapted to respond to the exterior light conditions by diminishing the initial intensity and directional light parameters to lower levels.
Some more advanced designs include mechanized headlamps which respond to the driver's change of direction and improve the side and curve visibility and with variable intensity controls as presented in the following granted US patents; U.S. Pat. No. 7,950,837 B2—Yatsuda et al. May 2011, U.S. Pat. No. 7,815,352 B2—Naganawa et al. October 2010, U.S. Pat. No. 7,891,851 B2—Turhan, Alcelik Feb. 22, 2011, U.S. Pat. No. 6,504,265—Toda/2003, and U.S. Pat. No. 6,513,958—Ishikawa/2003.
Such headlamps are complex in their mechanical design, expensive to maintain or replace and have the main disadvantage of taking the front illumination and displacing it sideways which as result diminishes the forward illumination with unpredictable results. A view at the contemporary automotive control systems reveals that from navigation to brakes and many other driving functions or safety features are computer controlled while the vehicular illumination systems remain manually operated thus presenting a subjective rigid design with limited performance and presenting deficiencies which are no longer suitable for a modern vehicle. Novel systems are demanded by the market and in response a unique solution is presented in this application.
Prior art cited by the patents above are seeking an improved forward and side illumination pattern by using fixed or mobile light devices assembled on the same known planar surface and make use of electromechanical headlamp positioning systems or are using reflectors and light concentrators for directional lighting. Each system has its technological advantages which also encounters specific economical drawbacks.
The proposed application eliminates the need for mechanical actuation of the light emitting devices and proposes a three dimensional disposition of the light emitting devices (LEDs that could be supplemented by additional Laser devices) within the headlamp assembly which provides a wide spatial illumination. The herein system and method of illumination produces unconventional patterns of light with continuously adjusted parameters of intensity and direction. In other terms, this headlamp provides an initial full 2 PiSteradian of solid angle illumination in normal driving conditions in the absence of concomitant traffic and will adjust down its parameters to generate more restrictive patterns of illumination as it is determined by external illumination and traffic conditions, a concept nor perceived or anticipated by any of the prior art. Some prior art as in U.S. Pat. No. 8,080,942 Heider, is describing a dynamic, adaptive light control system of a planar construction comprising of supplemental light sources which are positioned at three different fixed angles and sharing location with a regular daytime running light module. It also presents a method of adaptive front lighting employing control techniques like device switching, PWM, dimming or other methods a priori existent in the public domain.
This application differentiates itself from these claims by bringing a novel and unobvious solutions by proposing a three-dimensional asymmetric principle of building a headlamp structure and by presenting a method of multidirectional light emission over a wide angle of view which automatically and continuously adapts its field of illumination in a multitude of overlapping patterns. Such geometrical structure is comprised of multiple polygonal shapes attached to a central polygonal shape at various and unequal angles. The upper facet shown in FIG. 3 makes an exception from this rule by having its angle of inclination oriented downward and forward for the purpose of creating the upper cut-off limit of illumination hence reducing the blinding effect to the incoming traffic and also reducing the glare created by dust, fog, rain, snow or other external conditions. Such design and method of illumination provides an economic design solution which is superior to technologies relying on an adjustable mirror-lens combination of elements arranged in various planar positions as described by the prior art.
The proposed physical design brings another original feature by including all the lighting required by a vehicle, within a single multifunctional embodiment which is using the same light emitting devices for multiple purposes by providing a continuously controlled low to high beam range of illumination, the signaling lights by changing the color spectrum of at least one of the existing LEDs and also provide position lights without raising the need for separate light devices or hardware.
The present application recognizes prior art elements in the pending application Ser. No. 12/422,284 which suggests its possible use in a vehicular illumination system. The concept of an asymmetric angular placement of various facets containing the light emitting devices is not presented in Ser. No. 12/422,284 which may not be foreseen as a possible method of automatic control or be presumed constructively as described in the present application.
Experimentation with various geometrical shapes and angle of distribution of the light emitted by LEDs and Laser sources lead to the conclusion that an asymmetric apparatus having a variable geometry that contains the emitting light sources positioned at predetermined angles produced a wide, uniform pattern of illumination. When individually controlled in intensity and direction, the combined light produced by the system created the best overall illumination patterns conforming with the vehicular illumination standards in effect.
Along with introducing the concept of angular displacement of the light sources in five or more directions of illumination ex., Up/Down/Left/Right and the Center for a selective directional emission of light rays, the herein application invokes an adaptive discrete control of light intensity and a switching algorithm of emitters, individually and in groups for an efficient electric power management and omnidirectional dispersion of light which can be selectively oriented. The light emitters assembled on the facets of the asymmetric geometrical structure are and spatially disposed as to generate a wide distribution of the light vectors and to emit a spatial diffuse light with multiple adaptive directional vector component patterns, and being under the control of a microprocessor or a plurality of microcontrollers. This form of light distribution allows the realization of a multidirectional radiant source, with variable luminous flux and illuminance, which is integrated over all the directions of a solid angle or 2π Steradians.
Having a radiometric analysis of the light emitting sources, the herein design saves electrical energy [Watt*Hour] thus increasing light efficacy through the emitters switching technique and through the PWM (Pulse Width Modulation) principles applied to each directional emitter-module (Left, Right, Up, Down and Center modules). From a photometric point of analysis the PWM controls the light intensity of each emitter-module and relies on the feedback signal delivered by the photo-sensors or cameras which in turn assures a maximum luminous intensity [lm] in the driving direction after compensating for the incoming traffic and surrounding light sources. In effect, such adaptive light control system is designed to minimize the glare while enhancing the quality of the allover illumination and therefore limiting the negative effects of the eye's difficulty to adapt to sudden light intensity changes.
This invention is focused on reducing drastic changes in the illumination levels (as encountered when changing from high beam to low beam) and produces constant illumination over the whole scene, issue not presently addressed by any of the headlamp devices. Illumination levels over the scene produced by traditional sources can contain either insufficient or over illuminated portions, phenomenon associated with a corresponding decrease in human reaction time due to the inertial effect on the eye receptors recovery called the after image effect. A much wider area of illumination provided by this design facilitates early detection of obstacles thus limiting the long term driving stress.
By controlling the left and right fields of illumination this design prevents the formation of direct glare (the presence of a bright light in the visual field) to the incoming traffic.
Some of the most important features of the present asymmetrical geometry concept applied to vehicle headlamps are; a) wide area of visibility over the shoulder and over curved roads without the aid of motion devices, b) elimination of the scotoma effect on the eye by extending the visibility in critical zones situated ahead and sideways.
Studies by Brebner and Welford, 1980 and Luce (1986) establish that the mean simple reaction (the acknowledgement of visual stimuli but without including a physical response time) is approximately 190 ms, while Eckner et all. (2010) determines it to be 268 ms. The average time calculated for the mean simple reaction from these studies is averaging at 229 ms, and it becomes even longer for images picked around the eye edges and at night time.
The human biological response time to light stimuli calculated from the moment of perception to the moment an image is created on the brain is called recognition reaction time and extends to approximately 384 ms, according to Eckner et. all study (2010).
If we consider that at the actual cruising speed of a vehicle is 65 MPH (or 104.6 Km/h) such vehicle will advance by a distance of 95.3 Ft (29.06 m/s) every second. Considering that the human recognition reaction time is approximately 384 ms (or 0.384 s), the distance the same vehicle will travel before the driver would have reacted to the visual stimuli is 36.59 Ft (11.15 m). This is equivalent with driving blind for 36.59 Ft, situation that could be only aggravated by a limited peripheral illumination delivered by the regular headlamp designs. An additional visual impediment is created by the fixed illumination field of the traditional headlamps which widely vary among manufacturers. Such negative effects are compensated for in this invention through the adoption of an adaptive illumination system that generates a wide view pattern which is selectively adjusted in intensity and direction without compromising luminosity via restrictive geometrical or optical methods.
The herein design addresses all the functional parameters of a vehicular headlamp and improves the overall visibility by producing five (in this application) or more independent adaptive illumination patterns, and extends the distance and angle of view through its automatic light intensity control which receives feedback from automotive ambient light sensors (ALS). The negative effects created by the time delayed human reaction is reduced in the herein design by constantly adjusting the forward and side illumination, hence allowing for early detection of obstacles which in turn results in a longer time to react and to higher road awareness with reduced driver fatigue. This invention proposes a multiple light emitting modules assembled on a number of geometrical facets of a headlamp, which facets are positioned at various angles measured from the center module/facet so that the light vectors (300) of the central module/facet are oriented forward, the Left and Right facets' vectors (200) are oriented sideways, and oriented downward for the Up and Down facets, as depicted in FIG. 8 (light vectors top view), and in FIG. 10 (light vectors side view).
This headlamp and signaling system relies on proprietary real-time microprocessor control routines, and a data acquisition unit running independent of the main vehicle computer and common interfacing is limited to displaying various functional states or malfunction of the illumination system on the vehicle monitor. A separate display monitor may be also provided for displaying the headlamp's operational status.
This concept of continuously adaptive lighting systems for vehicular applications originates with the necessity to increase the quality of illumination and to extend the field of visibility to approximately 2 Pi Steradians or even to full 4 Pi Steradians (a whole sphere) in special applications, having also the scope of eliminating spots of high intensity and penumbra and to provide a source of uniform illumination with wide spatial visibility and high detail throughout the whole scene under observation. The illumination pattern and intensity parameters of the headlamp are continuously controlled by a microprocessor/microcontroller system working to reduce the glare to the incoming traffic while enhancing the overall visibility.
The presented design may be integrated with other video electronic equipment employing high quality imaging applications as could be the case in 3-D viewing devices for commercial or military use.
The photo-sensors, video cameras, position encoders and accelerometers included in the system provide the input feedback signals for low/high beam lighting, for the directional pattern control of the emitted light rays without the necessity of any mechanical motion devices and also for the emitter color spectrum change.
In full operating mode, the area of illumination covers a solid angle of 2 Pi Sr. (2 Pi*Steradian), or an equivalent of 180° (planar Degrees) in a two dimension angular representation. During regular operation the luminous intensity and spatial coverage over a 2 Pi Sr., area is dynamically and continuously adjusted by electronic circuitry as it is dictated by the surrounding illumination characteristics. This new adaptive control concept when applied in vehicular headlamp design produces constant luminosity of the road ahead, reduces the eye strain while revealing a considerably improved view of details. The automatically controlled wide angle illumination pattern guarantees visibility around the curve prior to taking the turn without affecting the front visibility.
During the daytime use, the headlights are dimmed to a low level by the PWM (Pulse Width Modulation) signal applied to the LED's driver circuits upon comparing the environment light to a threshold which is electronically set and may be also manually adjusted.
The signaling for direction change is provided by the same emitter devices assembled on the left and right geometrical facets of the headlamp by changing their radiation spectrum to approximately 540 nm wavelength corresponding to a yellow/orange light, spectral change that may be also generated by choosing individual multi-pin colored LEDs activated by electrical polarity reversal or by using RGBY color type of LED emitters.
A distress red light signal of approximately 650 nm wavelength is generated by the same means of color change as in the previously described principles, a red flashing light which will automatically be triggered by the accelerometer sensors when the vehicle speed is suddenly reduced from high to a lower level or when the cruising speed is reduced below 40-45 mph.

Adaptive external vehicle illumination system


A device includes (a) radiation detector including a semiconductor substrate having opposing front and rear surfaces, a cathode electrode located on the front surface of said semiconductor substrate, and a plurality of anode electrodes on the rear surface of said semiconductor substrate, (b) a printed circuit board, and (c) an electrically conductive polymeric film disposed between circuit board and the anode electrodes. The polymeric film contains electrically conductive wires. The film bonds and electrically connects the printed circuit board and anode electrodes.

The present invention relates generally to detectors for gamma-ray and X-ray detection devices.
Anisotropic conductive films (ACFs) (also referred to as anisotropic conductive adhesives (ACAs)) consist of mixtures of conductive fillers in an insulating polymer. ACFs are capable of electrically conducting in one direction (the film thickness or Z axis) and insulating in other two directions (x and y axis). ACF has become important interconnect technology for devices which are not significantly sensitive to high pressure and high temperature, such as silicon devices or substrates used in advanced display assembly, contactless smart-card module assembly, and bare chip attach on rigid and flexible substrates.


A method of fabricating a semiconductor package is provided, including: providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; coupling a carrier having a semiconductor element carried thereon to the coupling portion of the heat dissipating structure to form between the carrier and the heat dissipating portion a receiving space for the semiconductor element to be received therein; and forming in the receiving space an encapsulant that encapsulates the semiconductor element. The use of the supporting portion enhances the bonding between the heat dissipating structure and a mold used for packaging, thereby preventing the heat dissipating structure from having an overflow of encapsulant onto an external surface of the heat-dissipating portion.

1. Field of the Invention
This invention relates to methods of fabricating a semiconductor package, and, more particularly, to a method of fabricating a semiconductor package having a heat dissipating structure.
2. Description of Related Art
A modern electronic product is compact-sized and low-profiled. With the rapid development of a semiconductor fabrication process, more and more electrical elements are allowed to be integrated into a chip. However, the electronic elements, when in operation, generate a great amount of heat, and the heat cannot be dissipated to a region outside of the chip because the encapsulant does not have well enough heat dissipating quality. Accordingly, the lifespan of the electronic elements is reduced. Therefore, how to dissipate the heat generated by the electronic elements effectively is an important issue in the art. In general, a heat dissipation is disposed above the chip to dissipating the heat generated by the chip to an ambient environment.
According to the prior art, a compression molding method is used during a packaging process, to disposed a heat dissipation on a chip, as shown in FIGS. 1A to 1D, which illustrate a method of fabricating a semiconductor package 1 according to the prior art.
As shown in FIG. 1A, a heat dissipation 11 is disposed on a side in a mold 10, and in physical contact with a surface of the mold 10.
As shown in FIG. 1B, a substrate 12 having a plurality of semiconductor elements 12 disposed thereon is disposed on another side in the mold 10 (i.e., an upper portion 101), and the semiconductor elements 121 are disposed between the substrate 12 and the heat dissipations 11. The semiconductor element 121 is electrically connected via a plurality of bonding wires 120 to the substrate 12.
As shown in FIG. 1C, an encapsulant 13 is then formed in a mold cavity 100 of the mold 10 to encapsulate the semiconductor element 121.
As shown in FIG. 1D, a singulation process (along a cutting path S) are performed after the encapsulant 13 is released from the mold 10, to form a plurality of semiconductor packages 1.
In the method according to the prior art, the heat dissipations 11 are not closely adhered to the mold 10. Accordingly, during the formation of the encapsulant 13, the encapsulant 13 will flow via a side of the heat dissipation 11 to an external surface of the heat dissipation 11 due to a capillarity phenomenon. In other words, a resin bleed phenomenon happens. After the encapsulant 13 is released from the mold 10, a residual encapsulant 13′ still stays on the external surface of the heat dissipations 11, as shown in FIG. 1 D′, and a semiconductor package 1′ of poor quality is formed.
Therefore, how to overcome the problems of the prior art is becoming an urgent issue in the art.

Method of fabricating a semiconductor package with heat dissipating structure having a deformed supporting portion

Siliconware Precision Industries Co., Ltd.


A new and distinct cultivar of Polianthes plant named ‘CNGH’, characterized by its upright plant habit; numerous bright yellow-colored flowers; flowers arranged on upright and strong flower scapes; pleasant fragrance; and good garden performance.

The present invention relates to a new and distinct cultivar of Polianthes plant, botanically known as Polianthes hybrida and hereinafter referred to by the name 'CNGH'.
The new Polianthes plant originated from an open-pollination in 2001 in Chiayl City, Taiwan of a proprietary selection of Polianthes tuberosa×Polianthes howardii identified as code number 84-E-14, not patented, as the female, or seed, parent with an unknown selection of Polianthes hybrida as the male, or pollen, parent. The new Polianthes plant was discovered and selected by the Inventor as a single flowering plant within the progeny of the stated open-pollination in a controlled greenhouse environment in Chiayl City, Taiwan in April, 2002.
Asexual reproduction of the new Polianthes plant by divisions in a controlled environment in Puli, Taiwan since 2010 has shown that the unique features of this new Polianthes plant are stable and reproduced true to type in successive generations.


An organic EL display device ensures brightness and improves a contrast ratio by a reduction in external light reflection. The organic EL display device includes a wavelength selective absorption filter that absorbs a light in a given absorption spectrum uniform in a display region. An absorption spectrum has a negative correlation with an outgoing spectrum in which respective spectrums of R pixels, G pixels, and B pixels are synthesized together.

1. Field of the Invention
The present invention relates to an organic EL display device, and more particularly to a technique for reducing an external light reflection to improve a contrast ratio.
2. Description of the Related Arts
An external light reflection on a display surface of a display device such as an organic EL display device reduces a contrast ratio of an image. As one of measures against this problem, there is a structure in which a circularly polarizing plate is arranged on a display surface. As another of the measures, there is a structure in which a neutral density (ND) filter that evenly absorbs a visible light wavelength range is arranged on the display surface.


The present invention provides a patterning method of an organic EL device that can easily and efficiently be performed with high definition, and that can control a contrast by a luminous brightness.

1. Field of the Invention
The present invention relates to a patterning method of an organic electroluminescent (hereinafter referred to as organic EL) device in which ultraviolet ray is irradiated to an organic EL device to form a light-emission pattern.
2. Description of the Related Art
An organic EL device is a self-emitting type device employing an organic compound as a luminescent material. It can emit light with high speed, so that it is suitable for a display of a moving image. Further, an organic EL device has a characteristic that its device structure is simple, which makes it possible to reduce a size of a display panel. Since the organic EL device has such an excellent characteristic, it has been spreading in daily life for use in a cellular phone, or a vehicle-mounted display.
There has conventionally been a method of coloring a cathode layer with the use of a mask, or a method of insulation using a resist, as a method for patterning the organic EL device.
However, these methods entail problems as follows. Specifically, a pattern blurring of a cathode occurs due to the deviation of the mask, or the like. Further, appropriate solvent corresponding to the organic luminescent material should be selected, since the method includes a wet-type photolithography process.
The term "pattern" here indicates an icon, character, letter, illustration, graphic, design, or the like displayed on a device panel, and the term "patterning" means providing the function for displaying these patterns.
In the conventional patterning method, it is difficult to cope with high definition of the pattern. Therefore, various studies have been made for amore efficient patterning method. For example, Japanese Patent No. 2793373 proposes, as one method of efficiently patterning with high definition, a patterning method in which ultraviolet ray is irradiated to an organic EL device and the irradiated area is made a non-emission area.
In the patterning method disclosed in Japanese Patent No. 2793373, ultraviolet ray is irradiated to an organic EL device before or after an electrode is formed. When ultraviolet ray is irradiated after a panel is formed, transmittance of the ultraviolet ray at a transparent substrate and a transparent electrode is insufficient, so that sufficient effect of the irradiation of ultraviolet ray cannot be obtained. Therefore, it is difficult to efficiently perform patterning with high definition.
In this patterning method, the area of the EL device where ultraviolet ray is irradiated is made a non-emission area, resulting in that the contrast in the emission area cannot be controlled.

Patterning method of organic electroluminescent device

Abstract: In an organic EL device having an organic layer, including an organic luminescent material, formed between a pair of counter electrodes, ultraviolet ray is irradiated to the organic layer, and the amount of irradiation is changed to form an emission pattern having a contrast caused by a luminous brightness corresponding to the amount of the irradiation of the ultraviolet ray.

Yamagata Promotional Organization for Industrial Technology


A product comprises a combination of a plurality of recovered materials, and at least one precursor material, an interaction between biomass and at least one fluid providing the plurality of recovered materials, the biomass being of animal or human origin, the at least one fluid in interaction with the biomass provides at least one of degradation of a plurality of organic molecules comprised by the biomass, and breakage of a plurality of protein bonds comprised by the biomass, and the combination of the plurality of recovered materials and the at least one precursor material forms the product into a solid object.

Every year vast quantities of biomass are produced that are finally disposed via conventional methods. In the art and as well in the present document, by the term "biomass" is understood, in a broad manner, an organism that once lived, or a part of an organism that once lived, or a part of an organism that is currently living, that organism being of plant, animal or human origin.
Various methods are currently known for the final disposition of biomass, such as interment, thermal cremation, hydrothermal processing such as alkaline hydrolysis, laser ablation, and others. Thermal cremation methods are characterized by a relatively high CO2 foot print, and emission of potentially hazardous gaseous species into the environment, especially toxic volatile metals such as mercury. Further, regardless of the method used, the known disposition methods produce solids and fluids that might present potential environmental hazards if directly released into the environment without any further due treatment, since they contain organic and inorganic species that may negatively impact the milieu, specifically the air, the ground and the drain system.
Upon the termination of a final disposition, by thermal cremation or by hydrothermal processing, especially in the case of human remains or animal remains, family members, and owners closest to the disposed elect to receive keepsake remains, consisting mainly of powdered bone fragments that are placed in an urn or other enclosures. The powdered bone fragments placed in an urn or other enclosures are prone to be dispersed and lost, if the holder (urn, or other enclosures) is breached or broken.
To alleviate some of the environmental impact, as related to CO2 emission for example, disposition methods, such as the alkaline hydrolysis method, is are being introduced. The alkaline hydrolysis method is a hydrothermal process using an aqueous alkaline solution to aggressively dissolve the biomass in a relatively short time. The alkaline hydrolysis method is characterized by a lower CO2 foot print as compared to a thermal cremation, and practically no emission of hazardous gaseous species into the environment, but at the same time it presents a different environmental hazard which is associated with the generation and uncontrolled release of potentially hazardous untreated effluents.
Regardless of the environmental issues, posed by the process that originates them, the keepsake remains made from bone fragments provided by both the alkaline hydrolysis process and the thermal cremation, suffer the same faith, they are prone to be lost if the urn or the enclosure holding them is breached or broken. In addition, loose powders do not carry any esthetic or artistic value.
Alkaline materials, specifically strong alkaline solutions made with a strong base, react with the biomass to liquefy and/or emulsify the biomass. In the process, especially if the biomass comprises human or animal remains, the reaction dissolves the proteins, and emulsifies the oils and fat comprised by the biomass. During the process of dissolution, the alkaline solution, as it reacts with the proteins, denatures them. The denaturation of proteins involves the disruption and destruction of the bio-structures. As a result, once the proteins are dissolved, the structure of the biomass disintegrates, and in the presence of water, it liquefies. During this process, the alkaline solution separates the fats into glycerin and fatty acids. Further, alkali metals comprised in the alkaline solution combine with the separated fatty acids, and the result is a crude soapy liquid. The above processing is strongly accelerated if the reaction is carried out under hydrothermal conditions.
In the process of reacting a biomass containing bone materials with alkaline solutions, upon completion of liquefaction and/or emulsification as described above, the bone fragment materials such as skeleton bone members are at least partially left behind. In a typical mammal such as a human, a substantial portion of bone is primarily made up of hydroxyapatite, a calcium phosphate mineral. In a typical thermal cremation (involving direct flame), the remains after cremation are also bone fragments of the same mineral composition in addition to other organic and inorganic residues such as calcium carbonate, and various carbonaceous materials.
In the process of reacting a biomass with a hydroxide as adapted to dispose human remains and pet carcasses in an alkaline hydrolysis process, the human remains, or the pet carcass is placed into an autoclave, along with a predetermined volume of an aqueous alkaline solution, such as solutions of potassium hydroxide or sodium hydroxide. The autoclave is operated at a typical temperature of 130-195° C. for about 2-3 hours. As a result, the organic matter liquefies into a brownish liquid/sludge effluent, and bone fragments remain over a grid like member, physically separating them from the effluent. Operating the autoclave for longer times further reduce the amount of remaining bone fragment materials. As mentioned above, the hydrothermal conditions provided by autoclaving accelerate the reaction significantly.
As mentioned above, the alkaline hydrolysis is currently an alternative for thermal cremation. During thermal cremation the biomass is incinerated at high temperatures, causing the evaporation of water from the biomass and the destruction of organic matter, leaving behind inorganic bone fragment materials, a fraction of residual carbonaceous materials, carbonates, other materials and airborne particulates that are normally captured and filtered out by an off gas treatment system. In a thermal cremation process, normally gas burners provide heat and a combustion environment in an incinerator. Volatile metals, such as mercury that may exist in a cadaver's dental work, are also volatilized during incineration and can be emitted out into the atmosphere if not captured in the off-gas treatment equipment.
Although the alkaline hydrolysis disposition method presents several advantages over thermal cremation, such as lower CO2 foot print, and lesser emissions of hazardous gaseous species, it generates an effluent that contains organics, and various dissolved and suspended solids. The effluent, when released untreated causes at least organic pollution, since it may contain cross linked amino-acid side chains that could be potentially harmful to humans and animals, in addition to fats and nucleic acids in a multiplicity of combinations.
The solids left over from an alkaline hydrolysis disposition, usually consisting of bone fragments, are crushed or ground into powder form, placed in a container and delivered to the family and friends of the deceased. The same applies to the solids recovered from a thermal cremation disposition.
However, the solids recovered from the thermal cremation also include undesired organic and/or inorganic species. To further process and/or handle the solids recovered from thermal cremation disposition it may be necessary to further treat the recovered solids with a fluid to substantially remove the undesired portion/portions. In the process, an effluent is generated that may need to be treated before being released. The effluent may be a gaseous, air, a liquid, a solid or combination thereof.
Therefore, to summarize, the art as currently available presents a plurality of problems, such as:
The solid materials originating from a thermal cremation disposition or from an alkaline hydrolysis disposition, when powdered and placed in an urn or other enclosure, are prone to be dispersed and lost, if their holder is breached or broken;
The effluents produced by both thermal cremation and alkaline hydrolysis potentially pose danger to the environment if released untreated;
The solids originating from thermal cremation disposition may comprise portions that are undesirable, either because they are hazardous or because they cause degradation of a solid product that is to be made from these solids;
In case neither cremation or alkaline hydrolysis are elected for a final disposition of a human or animal, the opportunity of creating permanent memorialization products is lost when the human or animal origin biomass is buried;
Finding solutions to the above highlighted problems is increasingly relevant in the context of increasing world population and agglomeration of urban areas. Novel and improved solutions are necessary to deal with the final disposition of biomass, and to provide permanent and durable memorialization products for the biomass irrespective what was the mode elected for its final disposition, be it either cremation, burial, alkaline hydrolysis or others.
None of the methods currently known in the art solves the problem of how to safely dispose into the environment the effluents resulting from either thermal cremation and alkaline hydrolysis. Should the case be that the choice is not to dispose of the effluents but to convert the effluents into a keepsake, none of the available art teaches how to create from the effluent a safe, value added product that may be used to memorialize the deceased. In addition, the art does not teach how to memorialize via a product, part of a living human or animal or a deceased human or animal that is to be buried.

Products made from biomass and method of making the same


An improved relief valve for use in a diaphragm flush valve is constructed having a sealing member provided with an exteriorly threaded shaft extending down into the diaphragm flush valve with a smaller diameter metal stem extending from the bottom of the shaft, a sleeve member slidable along the metal stem and having a vertically aligned slit in its side wall, and a retaining member adjustably vertically positioned on the threaded sealing member shaft, wherein the retaining member having a stop element extendable into the vertical slit to prevent the sleeve member from dropping further than a predetermined distance from the bottom of the threaded shaft.

1. Field of the Invention
This invention relates to diaphragm flush valves, and more particularly to relief valves used in a diaphragm flush valve.
2. Prior Art
Diaphragm flush valves have long been used in water closets and urinals. As the need to conserve water resulting from economic and environmental concerns has increased there has arisen a need to control the amount of water permitted to flow through the water closet or urinal during a single flushing operation. There has also arisen a need to control the rapidity that the flushing operation can be repeated.
These concerns have been addressed through a variety of improvements to the diaphragm flush valve and related vacuum breaker systems used in water closets and urinals. Exemplary of such improvements are the inventions described in U.S. Pat. Nos. 5,026,021, 5,325,547, 6,119,713, 6,189,554, 6,227,219 and 6,554,018.
However, because of the varying water pressures at the inlet side of the diaphragm flush valves and the wide variety of commercially available diaphragm flush valves, the initial calibration and subsequent servicing of these diaphragm flush valves has remained more difficult and time than desired.

This patent is subject to a terminal disclaimer.

Relief valve for use in a diaphragm flush valve


A musical instrument of the stringed kind having a hollow sound box formed of a top plate, bottom plate and side walls. A string supporting bridge is mounted on the top plate and has two feet which are spaced apart transversely of the instrument. A sound post extends between the top and bottom plates and is connected to one foot of the bridge through an opening formed in the top plate. The opening and the connection are related so that there is no impediment to movement of the top plate in the region of the opening. By way of example, the post may extend through the opening to effect the connection with the bridge foot, in which event clearance will be provided between the post and the opening.

This invention relates to musical instruments of the stringed kind. By way of example, the invention is applicable to musical instruments such as the violin, viola, cello, bass, guitar and mandolin. It will be convenient, however, to hereinafter describe the invention with particular reference to violins.
Violin manufacture is a highly specialised art requiring the use of special timbers and the application of special skills which require many years to achieve. As a consequence, the violins of only a few manufactures are recognised as satisfactory for use by concert musicians, and those violins are extremely expensive. Even violins of lesser quality, however, are expensive because of the care and time involved in their manufacture.
The quality of sound derived from a particular violin rests largely on the skill with which certain internal components have been manufactured and installed. Those components include a bridge support bar and a sound post. The bar is usually called the bass bar and is secured to the underside of the top plate or belly of the sound box of the instrument so as to extend longitudinally of the instrument. The bar is of relatively heavy section and is positioned under the foot of the bridge which is adjacent the "G" string, or the string of lowest pitch. The sound post is generally a slender rod of round cross-section which is wedged between the top and bottom plates of the sound box at a location beneath the foot of the bridge which is adjacent the "E" string, or the string of highest pitch.
Each of the two components mentioned above must be manufactured of suitable material, formed to a correct size, and accurately located within the sound box in order to enable the instrument to generate quality sound. Substantial skill is required to achieve those objectives.
Due to the construction of the traditional violin, the top and bottom plates are forced to move in a very complex manner when activated by the strings of the instrument. For this reason, correct selection of the timber for those plates is very critical. The standard manufacturing dimensions of violins have been perfected over a period of 400 years and those dimensions apply to produce satisfactory results only if a timber of a very specific kind is used. That type of timber has always been in limited supply, but it is now becoming increasingly difficult to secure and that which is available is often of poor quality or inadequately seasoned. It is also very expensive.

Gondwana Musical Instrument Company Pty. Ltd.


A contact image sensor is provided including a housing, a slit plate a lens, one or two light sources and a light-receiving element array mounted on a light-receiving element array substrate. The housing contains the slit plate, the lens, the one or two light sources and the light-receiving element array substrate. The optical system of the contact image sensor is aligned and one or more depressions are formed on an end of the substrate for the alignment. Power to the one or two light sources is applied through one or more leads. Each of the one or more depressions is large enough so that each of the leads can be passed through the respective depressions.

1. Field of the Invention
The present invention relates to a method for aligning a light-receiving element array substrate provided in a contact image sensor in a sub-scanning direction, a method for manufacturing the contact image sensor, and the contact image sensor.
2. Related Background Art
A contact image sensor, which enables reading the image of an original, comprises a light source, a lens, a light-receiving element array (e.g. CCD) and a housing for containing them. The original is irradiated by light from the light source, the lens focuses the light reflected from the original on the light-receiving element array, and the light-receiving element array receives the focused light. Although the light reflected from the original enters the lens and the light-receiving element in the contact image sensor receives the focused light by the lens, ghost images may be generated by the structure of an optical system causing a decrease in an image quality. Ghost images are a phenomenon such that a virtual image is generated in an image area in which an original image doesn't normally exist. The alignment of components, such as the light source, the lens, and the light-receiving element array, in the contact image sensor is important to prevent ghost images from being generated.
Conventionally, a rod lens array is used for the lens provided in the contact image sensor. An example of a rod lens array is disclosed in Japanese Patent Publication No. 1993-167778. Because the rod lens array is formed with a combination of a plurality of rod lenses disposed in an array configuration, each of the incident rays that enter the plurality of rod lenses generally has an optical path toward one of the plurality of rod lenses. Thus it is rare that the incident ray which enters into one rod lens enters into another adjacent rod lens. Therefore, in case that the rod lens array is used for the lens, ghost images are not typically generated. In addition, the rod lens array is generally formed by containing a light-shielding film between the rod lenses to obtain a more high-quality image, so that unnecessary light may not be entered into the adjacent rod lens.
As described above, the rod lens array has a structure such that ghost images are not typically generated. In case that the rod lens array is used for the contact image sensor, the precise alignment for the components, such as the rod lens array and the light-receiving element array, is typically not carried out.
However, a micro-lens array plate has more recently been used in contact image sensors instead of the rod lens array. On the micro-lens array plate, it is difficult to integrally form such a light-shielding film between micro-lenses, because the micro-lens array plate is formed integrally in the manufacturing process by means of injection molding of resin. In addition, the structure of the micro-lens array plate makes it easy to transmit unnecessary light when forming an image, since each of micro-lenses in the micro-lens array plate does not have a separate structure as compared with the rod lens array. Therefore, ghost images become a significant matter when utilizing the micro-lens array plate for the lens of a contact image sensor as opposed to utilizing the rod lens array for the lens of the contact image sensor where ghost images are not typically generated.
To prevent ghost images from being generated, it is generally disclosed, for example in Japanese Patent Publication No. 1999-331498 to form the light-shielding film into the micro-lens array plate in another additional process, and to form a slit opening in a slit plate located between the original and the micro-lens array plate. Even if the slit plate is used, however, ghost images may be generated when precise alignment among the slit plate, the lens and the light-receiving element array is not carried out. Therefore, it is especially important that each of the components, such as the slit plate, the lens and the light-receiving element array, are precisely aligned in a sub-scanning direction with respect to the optical system in the contact image sensor.
Additionally, a linear illuminating device is generally used for the light source provided in the contact image sensor. The linear illuminating device is typically composed of a plurality of light-emitting elements, such as light-emitting diodes or light-emitting thyristors which are linearly mounted on a light-emitting element array substrate that is composed of one or more of the light-emitting elements designed on one end of a translucent linear light-guide, for example. In such a linear illuminating device, it is necessary to align a positioning relationship between the slit plate and the lens to prevent ghost images from being generated, and to align a positioning relationship between the slit plate and the lens for increasing sensor-output, which corresponds to increasing of amount of light. The sensor-output, as described herein indicates a value of an output voltage of the contact image sensor, the output voltage being a value from a photo-electric converted signal by means of the light-receiving element array. An example of technology for aligning an array-line of the light-receiving element array such that a positioning relationship between a slit opening in a slit plate and an array-line of the light-receiving element array becomes parallel is disclosed in Japanese Patent Publication No. 1993-122443.
When the micro-lens array plate is used for the contact image sensor, as described above, the precise alignment of the micro-lens array plate, the slit plate and the light-receiving element array is needed. In order to carry out a precise alignment, the presence or absence of ghost images is desirably confirmed. A generalized method of checking for the presence or absence of ghost images is to read a whole area of a test chart 12 including round patterns 10 (as shown in FIG. 1A) through the optical system of the contact image sensor, and then to read the output image of the sensor-output. In this case, if the positioning relationship among the micro-lens array plate, the slit plate and the light-receiving element array is misaligned, ghost images 16 may appear as output image 14, as shown in FIG. 1B. In contrast, output image 18, shown in FIG. 1B is an actual image of the round patterns 10.
However, when the test chart 12 shown in FIG. 1A is used, there is a problem of taking more time for the alignment because the whole area of the test chart 12 should be read, and of a difficulty of online alignment.
Moreover, the light source provided in the contact image sensor generally has an irregular distribution of amount of light. In addition, in the case of utilizing the micro-lens array plate for the optical system, there is another problem in that the micro-lens array plate, especially, increases the irregular distribution of amount of light corresponding to the sensor-output relative to the case of utilizing another lens (e.g. a rod lens array). It is typically difficult to form the micro-lens array plate while keeping a uniformity of the dimensions (in particular, the plate thickness) and an optical performance of micro-lenses (a direction of an optical axis, a lens pitch and a curvature of the lens) on the whole area of the micro-lens array plate in the injection molding process.

Contact image sensor and methods for aligning a light element array substrate thereof


A technique is disclosed involves a station (e.g., an IEEE 802.11 station, etc.) requesting that one or more frames be transmitted from an access point to the station. The station might have been in power save mode during Bluetooth operation for the purpose of causing the access point to queue frames that are intended for the station. The station making the request is collocated with the Bluetooth station or is, in fact, a single station that supports two protocols (i.e., has two parts), and is able to determine the regular timing of the Bluetooth synchronous connected oriented (SCO) packet transmissions. The requests to the access point for IEEE 802.11 frames are timed to cause the access point response frames to fall between the Bluetooth messages, thus managing potential interference.

FIG. 1 depicts a schematic diagram of wireless local-area network (LAN) 100 in the prior art comprising access point 101, stations 102-1 through 102-K, wherein K is a positive integer, and shared-communications channel 103. Stations 102-1 through 102-K are typically associated with host computers (not shown), such as notebook computers, personal digital assistants (PDA), tablet PCs, etc. Stations 102-1 through 102-K enable communications between (i) the host computers or (ii) the host computers and other devices, such as printer servers, email servers, file servers, etc. Access point 101 enables stations 102-1 through 102-K to (i) coordinate transmissions between each other and (ii) communicate with devices in other communications networks.
Access point 101 and stations 102-k, for k=1 through K, transmit data blocks called "frames" over shared-communications channel 103. If two or more stations (or access point 101 and a station) transmit frames simultaneously, then one or more frames can become corrupted, resulting in what is called a "collision". Local-area networks, therefore, typically employ a medium access control (MAC) protocol for ensuring that a station can gain exclusive access to shared-communications channel 103 for an interval of time in order to transmit one or more frames. A "protocol" is a set of communications procedures that relate to the format and timing of transmissions between different stations.
In wireless local-area networks that are based on the Institute of Electrical and Electronics Engineers (IEEE) 802.11 standard, the medium access control protocol is based on a mechanism called "carrier sense multiple access" (CSMA), in which station 102-k or access point 101 can detect whether shared-communications channel 103 is busy or idle. If shared-communications channel 103 is busy, station 102-k or access point 101 will wait until the channel is idle before attempting to transmit a signal that conveys a message.
Shared-communications channel 103 can be used by stations that operate in accordance with different protocols. For example, the IEEE 802.11 standard (e.g., 802.11a, 802.11b, 802.11e, 802.11g, etc.) describes one set of protocols, and the Bluetooth standard describes another set of protocols. A particular station (e.g., station 102-1, etc.) might handle an IEEE 802.11 protocol or a Bluetooth protocol, or both. A station that is capable of handling multiple protocols (i.e., a "multi-protocol station") comprises multiple protocol subsystems, or "parts", in which each part handles communications in accordance with a specific protocol.
Coordination of the IEEE 802.11 and Bluetooth protocols in a multi-protocol station can become particularly difficult when the Bluetooth part transmits or receives packets that are synchronous connection oriented (SCO) (e.g., voice packets, etc.), because such packets are often repeatedly transmitted at high data rates. As a result, Bluetooth coexistence mechanisms, such as the IEEE 802.15.2 set of standards, have been introduced in the prior art to address this problem. Such coexistence mechanisms coordinate a multi-protocol station's transmission of (i) Bluetooth synchronous connection oriented voice packets, and (ii) frames of another protocol. These mechanisms, however, do not prevent collisions that can occur when access point 101 transmits an IEEE 802.11 frame at the same time that a multi-protocol station transmits a Bluetooth packet.
Another approach in the prior art is to use the IEEE 802.11 Power Save state to cause access point 101 to queue outbound IEEE 802.11 traffic that is intended for station 102-k. The queuing occurs during the time that station 102-k indicates that it is inactive in the IEEE 802.11 sense as far as access point 101 is aware, but actually remains active in the Bluetooth sense. The technique of entering and exiting power save mode to allow time for Bluetooth operation, however, does not effectively support synchronous connection oriented operation of Bluetooth for some applications (e.g., voice, etc.). The repetition rate of synchronous connection oriented Bluetooth is so rapid that it is often impractical to rely on the IEEE 802.11 frames that indicate the rapid changes in power save state.
Therefore, a need exists for an improvement in how stations that operate in accordance with different protocols coexist with an access point without some of the costs and disadvantages in the prior art.

Managing an access point in the presence of separate protocols that share the same communications channel


The invention relates to a device for stabilizing a paper web, particularly a tissue web, with at least one (web) stabilizer (3, 7) after a drying cylinder (1), where the stabilizer (3) is located directly at the cylinder (1) under the paper web (2). It is mainly characterized by the angle of incidence α of the stabilizer (3) at the drying cylinder (1) being adjustable.

The invention relates to a device for stabilizing a paper web, particularly a tissue web, with at least one web stabilizer after the drying cylinder, where the stabilizer is located directly at the cylinder under the paper web.
A system for stabilizing a paper web, particularly a tissue web, is known from EP 1101863. Here, there are a number of stabilizers mounted after a tissue dryer. At the same time, the dust is removed from the upper side of the paper web. Before dust removal, a stabilizer is provided for the paper/tissue web which also takes away any additional air carried along with the web. Particularly in the production of high-grade tissue (soft tissue on conventional tissue machines and on TAD paper machines), the preferred doctor blades have a bevelled edge (ground to 5-40°) and web adhesion to the drying cylinder is kept relatively low, or it is virtually impossible to set a high level of adhesion by the paper web anyway. Thus, the web tends to move downwards and is only stabilized by the web tension that draws the paper web against the top stabilizer. As a result, there is a need to set the level of adhesion to the Yankee cylinder and/or a low degree of creping, which in turn has a negative effect on the strength and/or elongation of the paper.