Tri-titanium aluminide alloys are preferably deformed and heat treated below the beta transus temperature of the alloys to produce an improved combination of mechanical properties, specifically elevated temperature yield strength and creep resistance, and room temperature ductility and toughness. A preferred composition consists essentially of, in atomic percent, 24.5% aluminum, 12.5% niobium, 1.5% molybdenum, balance titanium.

This invention relates to tri-titanium aluminide alloys containing beta stabilizers, particularly molybdenum and niobium, which have an improved combination of tensile yield strength and creep-rupture strength at elevated temperatures, and room temperature ductility and fracture toughness.
Titanium alloys have found widespread use in aircraft gas turbine engines. Such alloys are attractive because they provide a useful combination of light weight, high strength and resistance to elevated temperatures. Early attempts to extend the capabilities of titanium alloys included studies of alloys based on the binary intermetallic compound Ti.sub.3 Al. This early work included research in the Ti-Al-Nb system from about 9 to about 30 atomic percent aluminum (about 5 to about 17.5 weight percent aluminum) and about 8 to about 17 atomic percent niobium (about 15 to about 30 weight percent niobium). These compositions yield alloys having the alpha-2 phase as a major constituent. In the present discussion, alloys having chemical compositions based on the binary intermetallic Ti.sub.3 Al but containing other alloying elements are termed tri-titanium aluminides. The term alpha-2 means the ordered hexagonal phase having the DO.sub.19 structure characteristic of the Ti.sub.3 Al composition. However, alloys termed alpha-2 alloys may contain small amounts of other phases, such as retained beta (which is isomorphous with the high temperature allotrope of elemental titanium) or a metastable orthorhombic phase. Unless otherwise indicated, all compositions described herein are given in atomic percent.
This early work indicated that although tri-titanium aluminides containing niobium have excellent creep-rupture strength and oxidation resistance, room temperature ductility and fracture toughness were too low to allow the alloys to be useful as engineering alloys.
More recent work has been done to develop tri-titanium aluminide intermetallic alloys for use in turbine engine applications. One of the problems with these tri-titanium aluminides continues to be the lack of room temperature ductility, with elongation in room temperature tensile tests frequently less than about 2 percent. Such low elongation values can adversely affect ultimate tensile strength, because the material fractures shortly after yielding.
Efforts have been made to develop tri-titanium aluminides into engineering alloys. Jaffee, U.S. Pat. No. 2,880,087, broadly discloses titanium aluminide alloys containing from 0.5-50 weight percent niobium, vanadium, and other elements and mixtures thereof, but lacks teachings on the proportions of vanadium and niobium as well as any particular criticality within the disclosed range.
Blackburn et al., U.S. Pat. No. 4,292,077, describe a titanium alloy having an aluminum content in the range of 24-27 percent, 11-16 percent niobium, balance titanium. Blackburn teaches the substitution of Vanadium for a portion of the niobium. Blackburn also teaches that solutioning and cooling from above the beta transus results in improved tensile strength and ductility, whereas solutioning and cooling from below the beta transus produces low ductility and low creep life. While additions of other elements, including molybdenum, are mentioned, Blackburn indicates that there are no benefits from such additions. Clearly, Blackburn does not appreciate the benefits of the substitution of molybdenum for niobium in improving the heat treatment response and strength of tri-titanium aluminide alloys, which is a critical part of the present invention.
Blackburn et al., U.S. Pat. No. 4,716,020, discloses a tri-titanium aluminide alloy having improved ductility containing molybdenum from 0.5 to 4 percent, niobium plus molybdenum from 11 to 16 percent and aluminum from 25 to 27 percent, and optionally, up to about 4 percent vanadium substituted for niobium. Blackburn fails to recognize the overall importance of molybdenum in achieving desirable response to heat treatment, particularly with alloy compositions containing less than 25 percent aluminum. Blackburn teaches solutioning the alloy above the beta transus to achieve the improved properties.
Gigliotti et al., U.S. Pat. No. 4,788,035, provides an alloy having improved tensile strength, ductility and rupture life due to the reduction in aluminum content and the addition of tantalum, coupled with optional additions of vanadium and niobium. However, Gigliotti fails to recognize the benefits of molybdenum in achieving further. improvements in properties in this class of alloys.
In a 1988 article, Ward et al. disclosed forging below the beta transus in order to vary the volume fraction of primary alpha-2, followed by heat treatment below the forging temperature. However, that publication fails to disclose processing temperatures and also fails to appreciate the significance of molybdenum in providing improvements in either properties or response to heat treatment.
In a 1989 article, Sauthoff mentions the benefits of niobium additions and very fine grain size in Ti.sub.3 Al-type alloys to improve ductility, but provides no teaching regarding specific amounts of niobium additions and no teaching regarding methods for refining grain size.
An object of the present invention is to provide a tri-titanium aluminide alloy having an improved combination of mechanical properties, such as improved elevated temperature tensile strength and creep-rupture resistance without sacrificing room temperature ductility and fracture toughness, or, alternatively, improved room temperature ductility and fracture toughness without sacrificing elevated temperature tensile strength and creep-rupture resistance.
Another object of the present invention is to provide a method for processing tri-titanium aluminide alloys to achieve the improved combination of room temperature ductility and fracture toughness and elevated temperature tensile strength and creep-rupture resistance.
Yet another object of the present invention is to provide a combination of a tri-titanium aluminide alloy and a method for processing that alloy such that improved room temperature ductility and fracture toughness can be achieved with easily implemented thermal treatment cycles.

Tri-titanium aluminide alloys having improved combination of strength and ductility and processing method therefor


A device for conditioning a liquid fuel flowing therethrough. There is a casing with fuel inlet and outlet ports, and at least one insert within the casing which defines passages through which the fuel must pass in streams. The insert contains one or more trace metal elements which are added to the fuel as the fuel flows over the surface of the insert. The insert may be made of an amalgam, and the trace elements may include tin, mercury, lead, and antimony, which may be desirable to add to the liquid fuel. The insert may be formed with a longitudinally extending hub portion from which fins portions extend radially, and the casing may be tubular so that the fuel streams are constrained to the passages formed between the fins. There may also be a magnet mounted in the casing for conditioning the fuel passing therethrough.

1. Field of the Invention
The present invention relates generally to fuel systems, and more particularly to apparatus for treating and conditioning fuel for use in an internal combustion engine.
2. Background Art
It has been recognized for many years that the addition of small amounts of certain metallic elements, such as tin, can improve the combustion characteristics of liquid fuels such as petrol and diesel oil. It is also well known that there are increasingly strict regulations with regard to exhaust emissions from internal combustion engines due to the harmful effects of certain exhaust gases on the environment. The improvement in the combustion characteristics which is effected by the addition of trace amounts of metals to the fuel can therefore help with emission control by reducing the pollution effects of exhaust gases by reducing the amount of unburnt fuel exhausted, as well as by improving engine efficiency by increasing the amount or percentage of the fuel actually burnt in the engine.
Furthermore, it has been prior practice to add relatively large amounts of certain metals, notably lead, to liquid fuels, primarily to suppress preignition and eliminate engine "knock". Recently, the use of these additives (primarily tetraethyl lead) has been largely terminated due to environmental concerns, and alternative formulations have been employed to minimize preignition. However, these metal additives also had the secondary purpose of protecting and enhancing the condition of certain internal components of the engines, notably valve seats; while most newer engines are designed to operate on lead-free fuels, many of the older-type engines will remain in service for many years to come, and these will be subject to potential damage (e.g., valve seat erosion) because leaded fuels will no longer be available. However, it is believed that engine protection can be enhanced, and much of this wear or damage reduced or eliminated, by adding trace amounts of certain metals to the fuel, and it is also believed that suitable amounts may be provided for this without posing environmental concerns, being that it is no longer necessary to include amounts sufficient to suppress preignition. Furthermore, it is believed to be possible for this purpose to use trace amounts of certain metals which do not pose the same threat to the environment as prior materials.
Accordingly, it is an object of the present invention to provide an apparatus for conditioning liquid fuel prior to delivery to an internal combustion engine by adding a trace level of a metallic element or elements to the fuel.

Apparatus for treating and conditioning fuel for use in an internal combustion engine


A nonvolatile semiconductor memory of an aspect of the present invention comprises a voltage step-down circuit including a first and a second circuit to achieve a voltage drop and configured to decrease the first voltage to a second voltage less than the first voltage, a transfer transistor to transfer the second voltage to a word line, and a control circuit to generate the second voltage as a first write voltage in a first mode wherein the first write voltage less than or equal to a prescribed magnitude is applied to the word line, and to generate the second voltage as a second write voltage in a second mode wherein the second write voltage greater than the prescribed magnitude is applied to the word line, wherein the difference between the first voltage and the second voltage is greater than or equal to the threshold voltage of the transfer transistor.

1. Field of the Invention
This invention relates to a nonvolatile semiconductor memory, more particularly to a NAND flash memory.
2. Description of the Related Art
Known as one type of a nonvolatile semiconductor memory is the NAND flash memory. The NAND flash memory has a transfer MOS transistor that transfers a transfer voltage to the word lines.
To write data to the memory cells, the gate voltage is applied to the gates of the transfer MOS transistor and the transfer voltage is transferred to the word lines via the transfer MOS transistor. The gate voltage and transfer voltage are generated by a voltage generating circuit.
The voltage generating circuit has a voltage step-up circuit. The voltage step-up circuit increases the power-supply voltage, generating the gate voltage to be applied to the gate of the transfer MOS transistor. The gate voltage increased by the voltage step-up circuit is decreased by a voltage step-down circuit, thereby providing a transfer voltage to be transferred to the word lines.
The gate voltage to be applied to the gates of the transfer MOS transistor to transfer the transfer voltage to the word lines should be greater than the sum of the transfer voltage and the threshold voltage of the transfer MOS transistor. Note that the gate voltage for the transfer MOS transistor is equal to the sum of the transfer voltage to be transferred to the word lines and the voltage drop achieved by the voltage step-down circuit.
Hence, to transfer the transfer voltage to the word lines, the voltage drop that the voltage step-down circuit achieve must be greater than or equal to the threshold voltage of the transfer MOS transistor.


The present application describes a monitoring circuit for an aircraft. The monitoring circuit comprises an inductive system, wherein the inductive system comprises a multitude of air core inductors and capacitors. Depending on the distance between a target and the inductive system the frequency response of the inductive system is changed. The change in the frequency response is detected and displayed in a display unit. The monitoring circuit can be used to improve door monitoring in an aircraft.

A multitude of doors are used in aircraft. There are external doors which allow access from the outside to the passenger compartment, and there are freight loading doors. Any unintendedly open door leads to problems as a result of a decrease in pressure in the cabin, and to damage of the aircraft structure as a result of torn-off doors.
To prevent any unintended opening of doors, said doors are kept in the closed position by means of an expensive locking mechanism. Before takeoff it must be ensured that all locking mechanisms are in the position "locked and secured". For this reason the current position of locking devices is monitored by proximity switches and is centrally evaluated and displayed.
Most of the time this type of proximity switch is designed as an inductance with a ferrite core, operated as a free-running oscillator. If a magnetic conductor (target), which can be affixed to the monitoring mechanics, approaches said proximity switch, the magnetic resistance of the arrangement changes, and so does the inductance, and thus the oscillator changes its oscillation behaviour so that a change in the position of the locking mechanisms of a door leaf can be recognised. The ferrite core inserted in the inductances is nowadays required to ensure adequate sensitivity and thus reliable detection of the open position of the door leaf. Ferrite cores are however heavy. This has a negative effect in the case of aircraft, where weight savings are very important.


A medicine container includes a child-resistant closure with a tamper-evident feature. The closure includes a plug adapted to be fixed to the container adjacent the open end. The plug has an access opening for enabling removal of material from the container through the open end of the container. A slide is supported on the plug for sliding movement in a first direction relative to the plug between a closed position in which the slide covers the access opening and an open position in which the access opening is uncovered. A child-resistant feature is interposed between the plug and the slide. The closure also includes a tamper-evident feature that permanently indicates breaking of the original seal of the container. The container may have a rectangular configuration including at least one surface large enough for a mailing address label; and a sealable window mailer envelope for receiving the medicine container.

Traditionally, local pharmacists have supplied their patients with prescription mediations in round containers with child-resistant closures. In recent years, pressure to lower medical costs has made it increasingly more common for prescriptions to be dispensed from centralized locations and delivered by mail.
Some centralized prescription facilities have automated the filling process, causing them to abandon the traditional round pill container because of handling problems including capping difficulties and a closure that overhangs the container's body. Today, the package of choice for automated filling locations is a round bottle that accepts a threaded, two-piece child-resistant closure.
One problem with such containers is that the child-resistant closure needs to be fully removed from the container in order to dispense product. This can encourage a patient to leave the cap off, thus making the package non child-resistant. Also, the patient needs to deal with the loose cap while the medication is being dispensed from the container.
There are other improvements that can be made in the automated filling and delivery process. For example, a filled prescription package is typically mailed in a reinforced envelope that must be addressed separately from the medication container; this creates a potential for misdirecting an order. Also, round containers are not "mail-friendly", are cumbersome for a patient to transport in a pocket or purse, and do not store well in medicine cabinets. Required "compliance" labels contain increasingly greater amounts of information, that is difficult to fit onto some round containers. Reading this information is complicated by the fact that a round container needs to be rotated as the information is read.

Child resistant dispensing closure package


Provided are a polyimide tube including a polyimide resin composition, wherein the polyimide resin composition contains a polyimide resin in which an acicular highly thermally conductive filler such as carbon nanotubes is dispersed in 15 volume percent or more relative to the total volume of the composition; the acicular highly thermally conductive filler has an orientation of 1.3 or more, the orientation being represented by the modulus of elasticity of the polyimide resin composition in the circumferential direction/the modulus of elasticity of the polyimide resin composition in the axial direction; and the polyimide tube has high thermal conductivity, is excellent in terms of mechanical strength and indentation strength, and provides a high fixing property and an excellent offsetting property; a process for producing such a tube; and a fixing belt including such a tube serving as a base member.

In general, in an image-forming process with an image-forming apparatus employing an electrophotographic technique such as a copier or a laser-beam printer, after a toner image is formed on a transfer-receiving material such as a recording paper sheet through an exposing step, a developing step, and a transferring step, a fixing step of fixing the unfixed toner image to the transfer-receiving material is performed. The fixing process is generally performed by heating and pressing an unfixed toner image to fuse the unfixed toner image with a transfer-receiving material. As for a measure for the heating and pressing, a process is commonly employed in which a fixing roller and a pressing roller are disposed so as to face each other, and a transfer-receiving material on which an unfixed toner image is disposed is passed between the rollers to press the unfixed toner image between the rollers and to heat the unfixed toner image by using a heating source installed in the fixing roller.
Japanese Unexamined Patent Application Publication No. 5-40425 discloses a process in which a steel use stainless (SUS) tube is used as the fixing roller. However, SUS tubes are expensive in terms of material cost and processing cost and hence have a problem of the costs. SUS tubes also have a problem in that SUS tubes have poor flexibility and hence end portions and the like of the SUS tubes tend to suffer from cracking, for example, when paper sheets are caught in the SUS tubes.
In recent years, as illustrated in FIG. 1, a process in which an unfixed toner image 5 on a transfer-receiving material 4 is heated with heating means (heater) 2 through a thin endless belt 1 (fixing belt) and pressed with a pressing roller 3 to fix the unfixed toner image 5 to form a fixed toner image 6 has been developed. Such a fixing belt is commonly an endless belt in which a polyimide tube, which is excellent in terms of heat resistance, mechanical strength, tear strength, flexibility, a mold release property, and the like, is used as a base member and a fluorocarbon resin layer is disposed on the outer surface of the base member.
To improve the thermal conductivity of a fixing belt in which a polyimide tube is used as a base member and to achieve, for example, a decrease in waiting time after the turning-on of power, a decrease in power consumption, an increase in fixing speed, and a decrease in fixing temperature, a process in which the polyimide tube is made to contain an inorganic filler that is excellent in terms of thermal conductivity has been disclosed. Such inorganic fillers proposed are carbon black, silicon carbide, silica, and the like (Japanese Unexamined Patent Application Publication No. 3-25478); boron nitride (Japanese Unexamined Patent Application Publication No. 8-80580); carbon nanotubes (Japanese Unexamined Patent Application Publication No. 2004-123867); and the like.
[Patent Document 1] Japanese Unexamined Patent Application Publication No. 5-40425
[Patent Document 2] Japanese Unexamined Patent Application Publication No. 3-25478
[Patent Document 3] Japanese Unexamined Patent Application Publication No. 8-80580
[Patent Document 4] Japanese Unexamined Patent Application Publication No. 2004-123867

Polyimide tube, process for producing the same and fixing belt


Photographic silver halide materials are disclosed comprising a support and a silver halide emulsion layer having associated therewith a coupler having in a non-coupling position a silyl substituent represented by the formula: ##STR1## wherein R.sub.1 through R.sub.4 individually are unsubstituted or substituted aliphatic, aromatic or heterocyclic groups, R.sub.5 is an unsubstituted or substituted aliphatic, aromatic or heterocyclic group which can be bonded to a non-coupling position of a second coupler moiety, and n=0, 1 or 2. In a preferred embodiment, the coupler is a photographic image dye-forming coupler. Processes for developing images in the photographic materials are also disclosed.

This invention relates to photographic couplers that comprise a silyl substituent in a non-coupling position, and to photographic materials and processes using such compounds.
Images are commonly obtained in the photographic art by a coupling reaction between the development product of a silver halide color developing agent, particularly an oxidized aromatic primary amino developing agent, and a color forming compound commonly described as a coupler. The dyes formed vary depending upon the composition of the coupler and the developing agent. The subtractive process of color formation is typically employed in multicolor photographic elements. Resulting dyes are typically cyan, magenta and yellow dyes formed in or adjacent to silver halide layers sensitive to radiation complementary to the radiation absorbed by the image dyes, that is, silver halide emulsions sensitive to red, green and blue radiation.
Couplers that contain various substituents in the non-coupling positions of the couplers are known. Examples of such couplers are described, for example, in U.S. Pat. No. 3,772,002, and in Research Disclosure, December 1978, Item 17643, Section VII. These substituents serve different functions, acting, for example, as ballast groups or groups that affect the solubility or dispersibility of the coupler, or the hue of the dye formed from the coupler.
There has been a need for a new class of couplers comprising substituent groups in non-coupling positions of the couplers that enable modification of the hue of the dye formed upon oxidative coupling of the coupler without significantly adversely affecting other desired properties of the coupler, such as image stability, dispersibility, and low melting point.

Photographic silver halide material containing a coupler having in a non-coupling position in a silyl substituent


Disclosed is a method and system in which an intermediary is provided within a communication path through which a message is transmitted from its originator to a client device, and the intermediary operates to insert into the message a target port number based at least in part on the originator of the message. In a scenario where the message originator provided or is otherwise associated with a given application group on the client device, the intermediary may thus modify the message to have the message designate as target port number the port number that the client device associates with the application group. Ultimately, when the client device receives the message, the client device would read the target port number and responsively route the message to the appropriate application or application group.

In general, when an application server or other network entity transmits a message to a client device, logic at the client device must process the message and forward the message to appropriate client application for handling. To facilitate routing the message within the client device to the appropriate application, the client device may have data that correlates port numbers with particular applications, and the incoming message may carry a target port number. Upon receipt of the message, the client device may thus read the target port number specified by the message and may refer to the data to determine which application corresponds with that port number. The client device may then pass the message to that application.
As a client device gets loaded with applications, it is theoretically possible that the client device may run out of port numbers to be correlated with the applications. When that happens, at issue may then be how to facilitate routing of incoming messages to appropriate applications on the device.

Modification of en-route message to add destination port number selected based at least in part on message originator


Data structures and algorithms are provided to automatically generate an analog stimulus to apply to a simulation of the analog DUT. A constraint solver is provided to determine suitable values to use in the stimulus generation. The suitable values are random values within a range of allowed values. For example, a number of different stimuli are generated for successive application to the analog DUT, each with a different magnitude within a range of allowed magnitudes. Data structures and algorithms are provided to monitor analog electrical properties at nodes of the analog DUT. Data structures and algorithms are provided to define constraints on the analog electrical properties and determine whether the constraints were violated. Data structures and algorithms are provided to define simulation coverage conditions in the analog domain and determine whether the defined analog domain coverage conditions have been satisfied.

As the size of the analog portion of circuits increases it is becoming more challenging to verify the analog design. The difficulty in verification exists whether verifying an analog circuit alone, or a design containing both a digital portion and an analog portion (mixed mode designs). Traditional design verification flows employ different tools and methodologies for analog designs than for digital designs.
Typically, a digital design is verified by employing a hardware description language (HDL), such as Verilog or VHDL (VHSIC hardware description language), and possibly using a Hardware Verification Language (HVL). HDLs are languages that have text-based expressions that can describe temporal behavior and/or circuit structure of an electronic system. For example, a digital design can be described in an HDL using text-based expressions. A simulation program allows the digital design to be simulated by executing the underlying semantics of the expressions written in the HDL language.
A verification program is typically executed along with the simulation of the digital DUT in order to analyze and verify the digital DUT. The verification program can be written in the same HDL that is used to describe the DUT. However, recently HVLs have been developed to aid in the verification of the digital DUT. Among other goals, HVLs are intended to provide programming constructs and capabilities to permit testing a DUT, particularly those DUTs expressed in an HDL, by stimulating certain inputs of the simulation of the digital DUT and monitoring the resulting states of the simulation of the DUT.
In addition to HDLs that are directed towards digital designs, there exist HDLs that are directed towards analog systems (e.g., Verilog-A) and mixed digital/analog systems (e.g., Verilog AMS). However, such analog or mixed mode HDLs do not have the ability to conveniently analyze and verify an analog DUT or a digital/analog DUT.
Typically, the analog portion of the circuit is analyzed and verified with a simulation tool such as SPICE (Simulation Program with Integrated Circuit Emphasis). Currently, there are a number of commercial versions of SPICE. SPICE is able to simulate analog circuits with great accuracy by solving equations that represent electrical behavior of the devices in the circuit. However, due to limitations of the SPICE language, verification of an analog circuit is primarily a manual process, which is tedious and error prone.
For example, SPICE outputs log files containing simulation results. However, it is very tedious for the user to look through the log files. In order to test the circuit under different conditions, a first SPICE simulation is executed with one set of parameters that are input by hand. Then, the parameters are changed by hand and a new simulation is executed.
A minimal amount of automation can be achieved by the user writing script programs that drive a SPICE simulation. For example, the user can write a script program that allows a very limited number of different input signals to be applied to the SPICE simulation. This allows the simulation to step through a limited number of voltage values. However, the input parameters that are changed are typically limited to changing the voltage source from 1.0 volt to 1.1 volt, etc. However, script programs are not convenient for specifying more complex combinations and variations of input parameters to a SPICE simulation.
Because of the vastly different techniques between analyzing the digital and the analog portions of the design, analog and digital simulations are often executed completely independent from each other. Unfortunately, using independent simulations for the two portions of the design can result in inaccuracies. In recent years, tools have emerged that co-simulate by using an HDL simulator for the digital portion and a SPICE simulator for the analog portion. These tools help solve some problems that arise from using two independent simulations. However, even with such a mixed mode co-simulation, analysis and verification of the analog portion is still a tedious and error prone process.
Thus, analyzing an analog DUT is tedious and error prone regardless of whether only the analog portion is being analyzed or whether the digital and analog portions of the design are being analyzed together. Therefore, there is a need for more efficient and accurate techniques for analyzing and verifying an analog circuit design. There is a need for a technique that functions with a simulation of analog circuit design by itself or a co-simulation of an analog design with a circuit digital design.
The approaches described in this section are approaches that could be pursued, but not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.

Method to analyze an analog circuit design with a verification program


A corrosion sensor includes a plurality of metal strips having different thicknesses. A first metal strip with the least thickness is first employed to provide sensitive corrosion detection. After an exposed portion of the first metal strip is consumed, a second metal strip having a second least thickness can be employed to provide continued sensitive corrosion detection employing a remaining un-corroded portion of the second metal strip. The plurality of metal strips can be sequentially employed as exposed portions of thinner metal strips become unusable through complete corrosion and un-corroded exposed portions of thicker metal strips become thin enough to provide sensitive corrosion detection.

The present disclosure relates to methods of detecting gaseous contaminants that cause corrosion and apparatuses for effecting the same.
Corrosion is a common issue in aeronautic industry, clean rooms, paper industry, waste water treatment plant, and many other industrial facilities. In an illustrative example, data centers employing mission critical Information Technology infrastructures and computers are geographically spanning around the world to provide faster access to users. Some of such data centers are located in geographical areas rich in sulphurous gaseous contaminations. Many hardware failures associated with silver and copper corrosion of thin film resistors, power switches and/or circuit boards components at such geographical areas are well known. Detection of gaseous corrosive contaminants is, therefore, necessary to anticipate, and to take preventive steps for, corrosion of computer hardware at areas susceptible to corrosion through gaseous corrosive contaminants.
Current commonly used corrosion detection techniques rely on weight measurement of silver and copper coupons due to simplicity and ease. Corrosion detection technique known in the art is not sensitive enough to detect corrosion rates under 10 nm per month, and requires an extensive exposure time in a corrosive environment. The result provided by coupon measurements provides a weighted corrosion rate over an extended period of time without specifically pointing to temporal variation of the corrosion in the data centers.
In order to provide improved corrosion sensitivity, the corrosion product has to produce a sizeable change in the detection signal. In case of resistive technique, where change in resistance due to thickness film variation is measured as the film is exposed to the corrosive environment, the thickness of a metallic film needs to be sufficiently small such that the thickness of a corroded portion of a metallic film is significant relative to a total film thickness. However, the thickness of the metallic film in prior art corrosion detectors is constrained by the lifetime of the corrosion detectors. Specifically, corrosion detectors are designed to be operational over a significant period of time without requiring replacement. In practical terms, replacing corrosion sensors every month or two in order to obtain high sensitivity is an expensive and time consuming proposition, and is not a practicable solution.
Additional requirements for effective corrosion sensors relates to separation of the corrosion effect from fluctuation of temperature and humidity and mechanically robustness so that the performance of the corrosion sensors is not affected by disturbances caused by strong air streams commonly encountered in data center environments. Furthermore, there is demand for real time corrosion detectors that can assess both the indoor and outdoor environment.

Methods and apparatus for detection of gaseous corrosive contaminants


A highly reliable fuse for explosives and armaments is achieved by employing a micro mechanical device that operates to disrupt a relatively low impedance bypass circuit coupled in parallel with a relatively high impedance trigger mechanism. The removal of the electrical bypassing is performed as a result of the movement of the micro mechanical device to enable detonation under prescribed conditions. The electrical bypassing is removed by having at least one low impedance electrical bridge that is part of the bypass circuit break when the micro mechanical device is subjected to prescribed trigger activation forces, which are typically large forces, such as are generated during launch or impact. The micro mechanical device may be a micro-electrical mechanical system (MEMS) device and the bridge is at least one spring that is part of the MEMS device and also part of the bypass circuit.

It is desired that missiles and bombs explode only when specified conditions are met, such as upon reaching their targets. Otherwise, it is desired that such missiles and bombs can be handled safely. Thus, it is necessary for a missile or bomb to contain a fuse that can differentiate between motions resulting from normal handling, or even severe accidental drops, and between the motions that indicate a need to set off an explosion, e.g., launch or impact. In addition, it is desirable that the operational readiness, as well as the state of the fuse, be testable with the result being perceivable by a human being.


A semiconductor structure includes a semiconductor layer of a first conductivity type, a photosensitive zone configured such that photogenerated charges may be accumulated in a first potential well, a region of the first conductivity type, formed in the semiconductor layer, for temporarily storing the photogenerated charges in a second potential well, a transfer gate between the region of the second conductivity type and the photosensitive zone for defining a potential barrier between the first and second potential wells during a non-transfer phase, and for eliminating the potential barrier between the first and second potential wells during a transfer phase, and a readout structure for reading out the temporarily stored photogenerated charges, which includes a JFET, the gate of which is formed by the region of the second conductivity type.

The present invention relates to a semiconductor structure having a photosensitive zone and transfer gate and an area for temporarily storing (latching, or buffering) photogenerated charges in a potential well upon transfer across the transfer gate, as well as to a method of operating such a semiconductor structure, and to a production method.
Electrooptical image sensors have globally taken up a considerable market share. They enrich people's lives in many aspects. Markets where such sensors are applied are, for example, photography, medical technology, the automotive industry, scientific sensor systems, broadcasting, safety/security/machine vision or the consumer market.
Generally, CMOS image sensors have a dominant market share as compared to CCD sensors. This is essentially due to applications in the consumer market, where low-cost CMOS image sensors are used, among other things, for handhelds, notebooks or mobile radio devices. Those CMOS sensors which serve this market often benefit from the high integration density. The latter may be achieved in CMOS both for signal-pickup detectors and for the evaluating electronics. An additional advantage over CCD sensors is that the detectors (pixels) and the electronics, which may be very complex if need be, can be implemented on a semiconductor chip, which results in low-cost camera systems.
The market for image sensors for industrial or scientific applications with CCD sensors is more pronounced in relation to the consumer market. It is said that said market often has a lower intrinsic uncertainty and/or lower inherent noise and, thus, a larger dynamic range as compared to CMOS sensors. It is therefore mandatory for competitive CMOS products to produce sensors having as large dynamic ranges as possible while not using any or using as few expensive process variations as possible.
In addition, sensors for such applications are often not subject the harsh restrictions regarding increasing miniaturization, which in most cases are tied to enormous investments in process technology. This includes, e.g., sensors for spectroscopy, distance measurement or X-ray detection, which in many cases involve large photoactive areas so that signals can be detected even at low irradiance. Low-noise CMOS sensors, which may be produced without any expensive process modifications, in combination with the flexibility offered by CMOS as compared to CCD thus have a large market potential.
Applications for the proposed low-noise semiconductor structure for converting photogenerated charge are, for example:                inspection/positioning systems        automotive imaging systems:                    surveillance inside a vehicle            airbag controlling systems            vehicle safety            road-line recognition            pre-crash sensors            pedestrian protection            self-parking systems                        topographical applications        general surveillance systems        medical imaging        scientific imaging applications        video games and entertainment
Noise reduction of sensors based on CMOS imagers is an essential problem that needs solving in order to provide products that can compete with CCD technology. The dominant readout structure for CCD imagers and CMOS imagers based on pinned photodiodes or the like is "floating diffusion" (FD). The readout principle based on an FD is restricted, in terms of noise performance, by the so-called reset noise. Said reset noise describes the inaccuracy of the reset level which is achieved when the storage capacity is being charged. On the basis of the so-called Correlated Double Sampling Method (CDS), it has been possible to improve the signal-to-noise ratio of such sensors substantially. In this context, two sampling operations are performed in as timely a manner as possible; at one point, only the reset value is sampled, and at another point, the subsequently detected signal level is sampled. Upon subsequent subtraction of these values, the inaccuracy is ideally eliminated since in the event of an obvious correlation, it is similarly inherent to the reset value as it is to the signal value (Solid-State Imaging with Charge-Coupled Devices, A. J. Theuwissen, ISBN-10: 9048145430, 2010). Analyses show that upon elimination of the reset noise, the uncertainty of the readout is often dominated by the source follower, which is mostly used as a readout circuit (Characterization and improvement of random noise in 1/3.2″ UXGA CMOS image sensor with 2.8 μm pixel using 0.13 μm-technology, J. Y. Kom et al., Proc. IEEE Workshop on Charge-Coupled Devices and Advanced Image Sensors, 2005). The uncertainty of this source follower is often described, by way of example, by thermal noise, excess noise and random telegraph signal (RTS) noise, the two latter processes typically being dominant. Since CDS stages exhibit a filter characteristic, the noise sources of the source follower may partly be reduced by suitably dimensioning said filter characteristic. RTS noise, however, cannot be fully eliminated by a CDS stage and might possibly result, in the case of unsuitable dimensioning of the source follower, not only in increased uncertainty in the readout of a pixel, but, also caused by the process variations to which the sensors are subject, also in local distribution of the uncertainty across the pixel matrix of such CMOS imagers (Random Telegraph Signal in CMOS Image Sensor Pixels, X. Wang et al., IEDM Tech. Dig., 2006).
There have been various efforts to decimate excess noise and RTS noise of the source follower. By way of example, one often associates said noise processes in CMOS devices with defects (traps) in the substrate or at interfaces such as the silicon/silica interface. Said traps may locally bind and release charge carriers, which causes RTS noise. If the area where the charge carrier transport takes place is flawed with "many" traps, excess noise will arise according to the idea of the McWorther model (1/f noise and related surface effects in germanium, A. L. McWorther, Thesis (Sc. D.) MIT, 1955). At the circuit level, RTS noise has been reduced, e.g., by clocking the operating current of the source follower. The model concept here is based on the assumption that shortly after switching on the operating current, no charge carriers are captured by traps, and that this will remain so for a period of time (Novel Readout Circuit Architecture for CMOS Image Sensors Minimizing RTS Noise, P. Martin-Gonthier et al., IEEE Electron Device Letters, 2011). However, this innovation does not eliminate the traps themselves, but only reduces their effect for an uncertain time period.
The geometry variation of the source follower transistor was examined in detail and published (Optimization of Random Telegraph Noise Non Uniformity in a CMOS Pixel with a pinned-photodiode, A. Lahav et al., Proc. Int. Image Sens. Workshop 2007; RTS Noise Impact in CMOS Image Sensors Readout Circuit, P. Martin-Gonthier et al., 16th IEEE International Conference on Electronics, Circuits, and Systems, 2009). Alternatively, one has been able to show that RTS and excess noise can be minimized even by relatively simple layout measures in that the current-carrying area of the transistor no longer contacts the field oxide, which is often relatively poor in quality for production-related reasons (Custom transistor layout design techniques for random telegraph signal noise reduction in CMOS image sensors, P. Martin-Gonthier et al., Electronic Letters, 2010). The gain in noise performance thus published is to be evaluated as positive if one takes into account that no process modifications need to be performed to achieve it. However, by contrast, a substantial improvement in the noise performance was achieved by not adapting the geometry or the layout of standard structures, but by using an additional implantation (A CMOS Image Sensor with a Buried-Channel Source Follower, X. Wang et al., ISSCC 2008; A CMOS Image Sensor With In-Pixel Buried-Channel Source Follower and Optimized Row Selector, Y. Chen et al., IEEE Transactions on Electron Devices, 2009). This additional implantation is used for defining the current-carrying channel of the source follower underneath the silicon/silica interface. Even though the idea of buried MOS dates back at least to the year 1976 (Conductance of Ion-Implanted Buried-Channel MOS Transistors, W. Schemmert et al., Transactions on Electron Devices, 1976), the innovation achieved is enormous since the noise performance has been enormously improved at manageable technological expense and without any or with possibly only a small loss regarding the filling factor of a pixel.
The following publications also described techniques addressing low-noise pixel readout: "A Low Noise CCD Output Amplifier" & "The Low Light Level Potential of a CCD Imaging Array", R. J. Brewer, International Electron Devices Meeting 1978; U.S. Pat. No. 4,074,302; U.S. Pat. No. 5,357,128; "The Double-Sided Floating-Surface Detector: An Enhanced Charge-Detection Architecture for CCD Image Sensors", E. Roks et al., ESSDERC 1995; "The Double-Sided Floating-Surface Detector: An Enhanced Charge-Detection Architecture for CCD Image Sensors", E. Roks et al., IEEE Transactions on Electron Devices 1996; Paper "A Bipolar Floating Base Detector (FBD) For CCD Image Sensors", E. Roks et al., IEDM '92; U.S. Pat. Nos. 5,464,997 & 5,593,910; U.S. Pat. No. 5,229,630; "A High Sensitivity Output Amplifier for CCD Image Sensor", Y. Matsunaga et al., International Electron Devices Meeting 1987; Paper "A New high Sensitivity Photo-transistor for Area Image Sensors", H. Yamashita et al., IEDM '88; U.S. Pat. No. 4,984,045; U.S. Pat. No. 5,060,070; and U.S. Pat. No. 5,712,498.

Semiconductor structure, method of operating same, and production method

Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.


A harness supported bag adapted to be carried on the back of a person is adapted for storing a liquid refreshment such as water, fruit juice or the like. A tube extending from the bag to the front of the person enables the latter to draw liquid refreshment during ambulation. In one alternative embodiment, a transparent pocket is superposed over the bag for receiving indicia to identify the person during a race (e.g. a marathon) whereas in another alternatively preferred embodiment, supplementary reservoir means are provided having a passage connected to the bag and manually activatable valve means for selectively enabling a person to transfer the contents of the supplemental reservoir to the bag during running or other physical activity.

1. Field of the Invention
The present invention relates generally to portable fluid containers, and more particularly, to a fluid container adapted to be carried on the back of a person by means of a harness and which is especially adapted to carry a liquid refreshment during vigorous physical activity such as running or hiking.
2. Description of the Prior Art
Portable containers for liquid refreshment adapted to be worn by a person during physical activity are quite well known. The so-called "canteen" for carrying a supply of water and worn on a belt around the waist is useful when walking or hiking. However, this form of portable liquid container is totally unsuitable for a long distance runner or jogger desiring to consume liquid refreshment while "on the run" so to speak. U.S. Pat. No. 4,090,650 discloses a "canteen" adapted to be worn about the waist by means of a belt and includes a flexible straw extending long enough from the canteen to the wearer's mouth to enable drinking during running activity. Nonetheless, since this form of portable container is worn about the waist, it interferes with the wearer's running motion, and further, is susceptible of shifting on the runner's body or becoming loose and even falling off during a race.
Thus, there exists a need for a portable container adapted to carry a liquid refreshment or other consumable fluid which may be employed by a user during vigorous physical activity such as running in a marathon race, for example, and which may be worn in a more non-restrictive manner than prior art "canteen" and thus, minimize inhibiting the normal running motion of the user. This need is met by the present invention as will be made apparent from the following description thereof. Other advantages of the present invention over the prior art also will be rendered evident.


A radiographic image detector to detect radiation applied thereto and obtain radiographic image information, includes: an internal power supply to supply power to drive units at least upon imaging; a communication unit to perform communication with an external device; a connection terminal connectable to a connection unit which performs at least one of charging of the internal power supply and the communication with the external device; a storing unit to store at least one of an image and information; a connection detecting unit to detect whether the connection terminal is connected to the connection unit; a state checking unit to check a state of each unit; and a control unit to control the state checking unit such that the state checking unit checks the state of each unit when the connection detecting unit has detected that the connection unit is connected to the connection terminal or disconnected therefrom.

1. Field of the Invention
The present invention relates to a radiographic image detector and a radiographic imaging system, and, in particular, to a radiographic image detector used without being connected to an external device at the time of imaging, and to a radiographic imaging system applying such a radiographic image detector.
2. Description of the Related Art
In the field of radiographic imaging for the purpose of medical diagnosis, there has been widely known a radiographic imaging system which irradiates a subject with radiation, detects an intensity distribution of the radiation having transmitted through the subject, and obtains a radiographic image of the subject. Moreover, in recent years, with respect to a radiographic imaging system, there has been developed and used a radiographic image detector called a "flat panel detector" (hereinafter, referred to as "FPD"), which is formed into a thin flat plate having a large number of photoelectric conversion elements arranged thereon in a matrix. The FPD detects the radiation having transmitted through the subject, photoelectrically converts the detected radiation into an electric signal, and performs image processing on the electric signal obtained after photoelectric conversion. It is thus possible to obtain easily and rapidly the radiographic image of the subject.
The radiographic image detector is broadly classified into a stationary detector installed as a part of the system at a predetermined position and a portable (cassette-type) detector freely portable. From a viewpoint of convenience in carriage and easy handling, utilization of the cassette-type radiographic image detector has been widely studied recently.
With respect to the cassette-type radiographic image detector, there has been known one which includes a rechargeable or replaceable internal power supply to drive the radiographic image detector, and is used without being connected to an external device such as an external power supply at the time of imaging. In case of using this kind of radiographic image detector to perform imaging without being connected to an external device, the radiographic image detector can be freely transported and installed depending on the site to perform imaging, and the like. This provides advantages that a degree of freedom in performing the imaging is improved and that it becomes easy to handle the radiographic image detector.
Meanwhile, with the radiographic image detector as described above, it is necessary to transfer radiographic image information acquired through imaging to the external device. Thus, there has been proposed, for example, a radiographic image detector which includes a memory for storing image information and transfers the image information stored in the memory to the external device through a connection terminal (for example, see JP-Tokukaihei-7-140255-A).
Further, in the radiographic image detector to perform imaging operation by using an internal power supply, when the amount of power remained in the internal power supply becomes small, it is necessary, for example, to connect the internal power supply to the external device in order to charge the internal power supply. Therefore, there has been proposed a radiographic image detector which is connected to the external device through a cradle and the like, to be able to charge the internal power supply and perform communication with the external device (for example, see JP-Tokukai-2000-206636-A). Further, there has been proposed a radiographic image detector capable of performing imaging and the like either in a state of being connected to the external device or disconnected therefrom (for example, see JP-Tokukai-2003-172783-A).
However, when imaging is performed without connecting the radiographic image detector to an external device such as the external power supply and with insufficient amount of power remained in the internal power supply, it is sometimes impossible to obtain a suitable image for correct diagnosis. Moreover, when imaging is erroneously performed while a memory to store image information, a communication unit to transmit the image information to the external device, and the like, are not functioning normally, the obtained image may not be stored or transferred to be wasted. In this case, re-imaging of the patient is required, and thus the patient is subjected to unnecessary exposure to radiation, which is unreasonable.

Radiographic image detector and radiographic imaging system


A pharmaceutical composition of a pharmaceutically acceptable trospium salt, with upon administration to a human patient generates an average steady state blood levels of trospium with a minimum (Cmin) and maximum (Cmax) blood levels of about 0.5-2.5 ng/ml and about 2.0-6.0 ng/ml, respectively.

Trospium is a quaternary ammonium derivative of tropine, and has anticholinergic properties. The hydrophilicity of the molecule, due to its permanent positive charge, limits its lipid solubility. Trospium chloride has been shown to antagonize acetylcholine on excised strips of human bladder muscle. Antispasmodic activity has been shown in the bladder, the small intestine, and on contractility of the gall bladder. Trospium chloride exhibits parasympatholytic action by reducing smooth muscle tone, such as is found in the urogenital and gastrointestinal tracts. This mechanism enables the detrusor to relax, thus inhibiting the evacuation of the bladder. Lowering the maximum detrusor pressure results in improved adaptation of the detrusor to the contents of the bladder, which in turn leads to enhanced bladder compliance with increased bladder capacity.
Trospium chloride was introduced into the market as a spasmolytic agent in 1967 (German patent 1 194 422). Trospium chloride has been available in an orally administrable, solid administration form (tablets and dragees), for intravenous or intramuscular injection as a solution, and for rectal administration as suppositories, and is primarily used for the treatment of bladder dysfunctions (urge incontinence, detrusor hyperreflexia). The product has been on the market in Germany and several other European countries for a number of years for specific therapeutic indications including urinary frequency, urgency, nocturia, and urge-incontinence associated with detrusor instability, urge syndrome, and detrusor hyperreflexia.
Currently, in the European market there is an immediate release trospium chloride tablet (Spasmo-lyt®), which is indicated for the treatment of urge incontinence and detrusor hyperreflexia and is used as a 20 mg tablet taken twice daily or bid (a total dose of 40 mg per day). In common with other quaternary ammonium compounds, orally administered trospium chloride is slowly absorbed, with the maximum blood level achieved after 5-6 hrs. The oral bioavailability is approximately 10%, and is significantly reduced with the intake of high-fat food. There are side effects associated with the use of the twice-daily trospium chloride regimen, such as dry mouth, headache, constipation, dyspepsia, and abdominal pain. These side effects are associated with a high blood concentration of trospium chloride. Moreover, studies in which a 40 mg immediate release dose was given once daily resulted in higher overall incidence of adverse events as compared to 20 mg given twice daily.
A once-a-day administration of trospium is advantageous over the twice-a-day administration in terms of both patient compliance and reduced adverse events, thus providing better treatment of the conditions for which trospium chloride is indicated.
In order to provide for an effective once-a-day form of trospium, there is a need for unique formulation approaches that provide the desired therapeutic effects while minimizing, if not eliminating, the undesired side effects mentioned above. This means that the minimum blood trospium concentration (Cmin) at steady state should be above the minimum therapeutically effective blood concentration and the maximum blood trospium concentration (Cmax) also at steady state should be below the maximum toxic blood concentration over the treatment period. Trospium chloride and other quaternary ammonium compounds exhibit a limited window of absorption in the human gastrointestinal tract, presenting a significant challenge to formulating a once-a-day composition.

This patent is subject to a terminal disclaimer.


A polarization mask for producing light of locally different polarization from unpolarized or uniformly polarized light. On the light output side, discrete areas with different polarization directions are present, which are either static or switchable. The mask is useful for, among other things, the transfer of polarization pattern onto a PPN layer.

1. Field
The invention relates to a polarization mask for producing linearly polarized light having a predetermined polarization direction from incident light. The polarization mask is useful in the exposure of polarization-sensitive layers, for the preparation of such components, and for their preferred use. The term xe2x80x9cproducingxe2x80x9d is to be understood for the purposes of this description as denoting both the actual production of linearly polarized light from unpolarized light and changing the polarization direction of incident light which has already been linearly polarized.
2. Description
Various processes and materials have recently become known in which anisotropic material properties are induced by irradiation with linearly polarized light. The anisotropic propertyxe2x80x94that is, the preferred direction of the material in microscopically small zonesxe2x80x94can be varied by location of the polarized light: In addition to optical anisotropy it is more particularly the steric anisotropy which gives these materials their interest for industry. Liquid crystals in contact with a polymer material are oriented in accordance with the preferred direction thereof by the steric anisotropy of such material. These photostructurable polymers are therefore eminently suitable as orientation layers for liquid crystals, it being possible for the orientation direction to be varied in the micrometer range.
U.S. Pat. No. 4,974,941, the contents of which are herein incorporated by reference, describes a process based on a guest-host system wherein a preferred direction is induced by irradiation with linearly polarized light of an appropriate wavelength by the cis-trans-isomerization of dyes. Liquid crystals in contact with a surface thus irradiated are oriented in accordance with this preferred direction. This orientation process is reversiblexe2x80x94that is, by further irradiation of the layer with light of a second polarization direction, the orientation direction already written in can be turned again. This reorientation process can be repeated as often as required and is therefore particularly interesting in connection with re-alignable optical memories.
U.S. Pat. No. 5,389,698, the contents of which are herein incorporated by reference, discloses photostructurable orientation layers in which, in contrast to the reversible orientation process hereinbefore described, an irreversible anisotropic polymer network is built up. The optical and orienting properties induced in the network during the exposure with linearly polarized light are photostable and so cannot be further re-oriented by further exposures. These photo-oriented polymer networks (PPN) can therefore be used wherever stable, structured or unstructured LC orientation layers or optical elements such as non-absorptive color filters, linear and cholesteric polarization filters, optical delay layers or the like are needed.
As a rule, in the exposure of a photostructurable orientation layer at least two different polarization states of the light have to be used to write in a definite pattern. Various exposure processes for impressing polarization patterns into photostructurable layers are known at present. All the known processes have the disadvantage that the total information cannot be transmitted in parallel fashion but must be transmitted seriallyxe2x80x94that is, in more than a single exposure step. The known processes are therefore complex, costly, and time-consuming.
For instance, a scanner can be used to apply the information to the photostructurable layer in dot form. In this case the polarization direction can be varied from dot to dot. However, in the transfer of high-information-content patterns only a very short exposure time is available for each dot if the total exposure time for the pattern is not to exceed acceptable limits. Consequently, the energy necessary for the orientation must be applied to a small region of the layer in a short time, so that the heat loadability of the photostructurable material is severely stressed.
Another possibility, described in U.S. Pat. No. 5,389,698, the contents of which are herein incorporated by reference, is for the layer to be irradiated with polarized light through a mask. This enables all the zones or regions of a layer which have the same orientation direction to be exposed simultaneously. Many different orientation directions can therefore be written into a layer by the use of further masks. An exposure step is necessary in this process for each orientation direction, the transmission direction of the polarization filter having to be adjusted and the mask having to be changed and positioned each time. Positioning the mask is a particularly time-consuming operation.
Since a particular transmission direction of the polarizer is associated with each mask in this stepwise exposure process, the polarizer itself can be part of the mask. A polarizing mask of this kind can be produced in various ways by known technologies, for example, by laminating a film on to a polarization film. A polarizing mask of this kind can be produced in various ways by known technologies, for example, by laminating a film on to a polarization film. A polarizing mask of this kind could be improved if all the necessary polarization directions could be integrated in a single mask so that a complete polarization pattern could be transferred to a photostructurable layer in a single exposure step. A polarization mask of this kind for the preparation of LC orientation layers is mentioned in EP-A-632 311, but no indication is given about how such a polarization mask might be produced. In fact, the stretching process conventional in the preparation of polarization films automatically leads to a consistent polarization direction over large areas.
U.S. Pat. No. 5,327,285, the contents of which are herein incorporated by reference, discloses a process for producing polymerizers having two polarization directions which differ zonewise in the micrometer range. The process is based on the technology for producing polarizer films. The polarizing properties of two polarizer films are extinguished zonewise by chemical or mechanical treatment and stuck together accurately at a 90xc2x0 offset from one another. However, due to the stringent requirements for positioning the two films and sticking them together the differently polarizing zones cannot be made as small as required. Also, parallax errors caused by the stacking of the relatively thick polarization films on one another limit the number of possible polarization directions to two.
It is the intent of the present invention to provide a polarization mask that enables production of linearly polarized light with zonewise differing polarizing directions.
The subject invention provides a polarization mask for producing linearly polarized light having a predetermined polarization direction from incident light and having a light input side and light output side. The polarization mask comprises a plurality of zones which are limited from each other on the light output side and which have at least intermittently different polarization directions.

Optical component for producing linearly polarized light


The present invention relates to a method of driving a plasma display panel and a plasma display apparatus employing the same. In the plasma display apparatus, a plurality of scan electrodes formed in a plasma display panel are divided into first and second groups and then supplied with scan signals. When a scan bias voltage supplied in a first subfield of first and second subfields is higher than that supplied in a second subfield of the first and second subfields, a lowest voltage of a reset signal supplied in the second subfield is higher than that supplied in the first subfield. In accordance with the plasma display apparatus of the present invention, the lowest voltage of the reset signal is controlled according to the scan bias voltage in dividing the plurality of scan electrodes into two or more groups and driving them. Accordingly, an address erroneous discharge due to the loss of wall charges can be reduced, the occurrence of spots can be prevented and therefore the image quality of a display image can be improved.

1. Field of the Invention
The present invention relates to a plasma display apparatus and, more particularly, to a method of driving a plasma display panel.
2. Discussion of Related Art
A plasma display apparatus includes a panel in which a plurality of discharge cells are formed between a lower substrate having barrier ribs formed thereon and an upper substrate opposite to the lower substrate. The plasma display apparatus is configured to display an image in such a manner that the plurality of discharge cells are selectively discharged in response to an input image signal and a fluorescent material is excited with vacuum ultraviolet rays generated by the discharge.
For an effective display of an image, the plasma display apparatus generally includes a driving control device, which processes input image signals and outputs the processed signals to a driver for supplying driving signals to a plurality of electrodes included in a panel.
In the case of a large-screen plasma display apparatus, time margin for panel driving falls short and therefore it is necessary to drive the panel at high speed.

Method of driving plasma display panel and plasma display apparatus employing the same


When the hatch of a substrate washing chamber 5 is opened to receive a substrate, certain valves are closed, and a valve is opened, supply CO2 to purge the substrate washing chamber 5 to and exclude air. When the hatch is closed, another valve is opened to vent substrate washing chamber 5 so that the CO2 expels any gas and unwanted air from the substrate washing chamber 5 and the conduits. Thereafter, super critical CO2 is used to wash the substrate and clean the circulation line. The flow of supercritical CO2 is sent to the substrate washing chamber 5. After flowing through the circulation line, including a circulation channel 11, it passes through a bypass channel 12 to a decompressor 7. Any chemicals or organic substances left in the circulation line are continuously sent to a separation/recover bath 8 together with the flow.

1. Field of the Invention
The present invention relates to a high pressure processing apparatus and method which employs a high pressure processing fluid. More particularly, the present invention relates to a high pressure processing apparatus and method for subjecting a substrate to a predetermined high pressure process (e.g., for removing any unwanted matter adhered on the substrate) which supplies a high pressure fluid over a substrate, such as: a semiconductor substrate; a substrate for FPDs (Flat Panel Displays) (e.g., a glass substrate for a liquid crystal display device); a glass substrate for a photomask, a substrate for an optical disk, or the like (hereinafter collectively referred to as "substrates"). Furthermore, the present invention relates to a high pressure processing apparatus and method which can be used in a drying process for removing moisture off a substrate surface, or a development process for removing unwanted portions from a substrate surface.
2. Related Art Statement
In recent years, the trend away from using flon (fluorine) for washing substrates having electronic or other components formed thereon has directed much attention to the use of a low-viscosity processing fluid which is kept in a high-pressure state (e.g., super critical CO2) as a release agent or a rinse agent.
Moreover, the need for downsizing ("shrinking") semiconductor devices in recent years has led to the use of finer design rules (technology node) for devices, and this trend only appears to be growing. Such semiconductor device structures incorporate very minute trenches and holes, both of which need washing. Minute trenches may be employed for capacitors (or the capacitive portions thereof), horizontal wiring (or two-dimensional wiring), and the like. Minute holes may be employed for vertical wiring (three-dimensional wiring: connections between horizontal wires, gate electrode connections for transistors, etc.), and the like.
In such minute structures, increasingly larger ratios between the width and depth thereof (so-called "aspect ratio") have been used. In other words, there is a tendency to form narrower but deeper trenches, and to form smaller-diameter but deeper holes. Some micro-structures may have a width or a diameter on the order of submicrons, with an aspect ratio exceeding ten. After such micro-structures are formed on a semiconductor substrate through dry etching, not only the upper planar surface, but also the side walls and bottoms of the trenches and holes will be left with contamination, such as residues of the resist, denatured resist resulting from the dry etching, compounds of the resist and the bottom metal, and/or oxidized metals.
Conventionally, such contamination is washed away by using a solution-type chemical. However, since the ingression of a chemical and the later substitution with pure water may not occur smoothly in such micro-structures, unsatisfactory washing results may be obtained. Moreover, although low-dielectric constant materials (so-called "Low-k materials") are used in order to prevent delay in electrical signals due to the wiring being affected by etched insulative substances, the presence of chemicals tends to ruin the low dielectric constant. In the case where a wiring metal is exposed, it is impossible to employ a chemical which dissolves metals, which in itself is another limitation.
Super critical fluids (SCFs) are considered as a promising alternative for the washing of such micro-structures on semiconductor devices. As represented by a hatched portion in FIG. 8, an "SCF" refers to a substance which is in a state that only exists at a pressure equal to or greater than a critical pressure Pc and at a temperature equal to or greater than a critical temperature Tc. An SCF has properties intermediate between those of liquid and gas, and therefore is suitable for washing on a micro scale. Specifically, an SCF is effective for the washing of organic components due to its density (which approximates that of liquid) and high solubility, enables uniform washing due to its diffusibility which compares that of gas, and is suitable for the washing of micro components due to its low viscosity which compares that of gas.
As a substance to be converted into an SCF, carbon dioxide (CO2), water (H2O), nitrous oxide (N2O), ammonia, ethanol, or the like may be used. Among others, CO2 is frequently used because it can easily attain a super critical state due to its critical pressure Pc being 7.4 MPa and its critical temperature Tc being about 31° C. and because CO2 is non-toxic.
Although CO2 SCF is inert by nature, fluidic CO2 has a dissolving ability similar to that of hexane, and therefore can easily remove moisture, fat, etc., off a substrate surface. Moreover, amines, ammonium fluoride, or the like—which are employed for washing contamination off semiconductor substrates—can be admixed in a suitable concentration range to obtain a multi-component SCF. Such a multi-component SCF is capable of entering into minute device structures to remove the contamination. Moreover, the admixed amines or ammonium fluoride can be easily removed from the minute device structures together with the contamination.
Unlike a solution-type chemical, an SCF does not leave its residues after permeating a low-dielectric constant insulative substance, and therefore does not alter the properties of the insulative substance. Therefore, an SCF is highly suitable for the washing of micro-structures on semiconductor devices.
FIG. 9 illustrates an exemplary apparatus which performs a wash process for a substrate using an SCF. The high pressure processing apparatus shown in FIG. 9 comprises: a cylinder 201 containing liquid CO2; a condenser 202; a booster 203; a heater 204; a substrate washing chamber 205; a decompressor 207; a separation/recovery bath 208; and valves V1 and V2.
Hereinafter a wash operation of a high pressure processing apparatus having the above-described configuration will be briefly described.
First, a substrate as an object to be washed is placed within the substrate washing chamber 205, and the substrate washing chamber 205 is sealed. The following wash process begins after the placement of the substrate. First, the liquefied CO2 in the cylinder 201 is supplied to the condenser 202 so as to be stored there in the liquid state. The liquefied CO2 is compressed by the booster 203 to a pressure equal to or greater than the critical pressure Pc, and is further heated by the heater 204 to a temperature equal to or greater than the critical temperature Tc, thereby being converted into super critical CO2, which is supplied to the substrate washing chamber 205. In the substrate washing chamber 205, a washing takes place by allowing the super critical CO2 to come into contact with the substrate.
The super critical CO2, containing contaminants from the substrate washing (e.g., organic substances, inorganic substances, metals, particles, and/or water which have parted from the substrate and strayed into the super critical CO2 during the washing), is subjected to a final decompression by the decompressor 207 so as to be vaporized. Thereafter, the super critical CO2 is separated into gaseous CO2 and the contaminants in the separation/recovery bath 208. The isolated contaminants are discharged, whereas the CO2 gas is recovered for recycling in the condenser 202. The substrate washing is completed by repeating the above wash process for a predetermined amount of time or longer.
However, in accordance with the above-described conventional high pressure processing apparatus, the surrounding air may stray into the chamber through the hatch opening while positioning the substrate in the substrate washing chamber 205. Therefore, when the SCF which has been used in a wash process is recovered for recycling, the surrounding air components which have strayed into the substrate washing chamber 205 may enter the SCF generation/recovery line and deteriorate the purity of the SCF used for washing.
Even if the substrate washing chamber 205 is installed in a clean room when using the above-described high pressure processing apparatus for washing a semiconductor substrate, the air within the clean room may contain various contaminants, such as SOx, NOx, siloxanes, boron, and vaporous organic substances.
The reduced purity of the SCF may affect the condensation temperature of the CO2 gas which is recovered for recycling, whereby the performance of the substrate washing employing super critical CO2 may be deteriorated.
This problem is true not only of washing techniques employing SCF, but also of any high pressure process, such as development, washing, or drying of a substrate within a closed processing chamber, that employs a subcritical fluid or a high pressure gas of ammonia, for example.
As used herein, a "subcritical fluid" generally refers to a liquid which is in a high-pressure state below the critical point shown in FIG. 8. Fluids which fall within this region are sometimes distinguishable from SCFs. However, since physical properties such as density only undergo gradual (i.e., not stepwise) changes, there may be no physical breakpoint. Therefore, a subcritical fluid might also be usable as an SCF. Any substance which lies in the subcritical region, or more broadly, in the super critical region near the critical point, may sometimes be referred to as a "high-density liquefied gas".
Thus, a high pressure processing apparatus employing such a high pressure fluid still admits of improvement in the manner of recovering for recycling the high pressure process fluid which has been used in the processing, in terms of preventing deterioration of the process performance.
An apparatus having the configuration shown in FIG. 10 may alternatively be used as an apparatus for performing a wash process for a substrate employing an SCF. The high pressure processing apparatus shown in FIG. 10 comprises: a cylinder 201 containing liquid CO2, a condenser 202, a booster 203, a heater 204, a substrate processing chamber (SCF chamber) 205, a circulator 206, a decompressor 207, a separation/recovery bath 208, a switching section 209, a mixer 210, and a chemical supply section 211 which is coupled via a valve V3.
Hereinafter, a wash operation performed by the high pressure processing apparatus of the above configuration will be briefly described. A substrate as an object to be washed is placed within the substrate washing chamber 205, and the substrate washing chamber 205 is sealed. Awash process as follows is begun after the placement of the substrate. First, the liquefied CO2 in the cylinder 201 is supplied to the condenser 202 so as to be stored there in the liquid state. The liquid CO2 is compressed by the booster 203 to a pressure equal to or greater than the critical pressure Pc, and is further heated by the heater 204 to a temperature equal to or greater than the critical temperature Tc, thereby being converted into super critical CO2, which is supplied to the mixer 210. The mixer 210 mixes a predetermined chemical which is supplied via the valve V3 with the super critical CO2, and outputs the resultant mixture to the substrate washing chamber 205.
The reason for employing the aforementioned chemical will be described. Although the fluidic CO2 has a dissolving ability similar to that of hexane and therefore can easily remove moisture, fat, etc., off the substrate surface, it does not provide a sufficient dissolving ability for high-molecular-weight contaminants such as resists or etching polymers. Therefore, it is difficult to release and remove contaminants by using CO2 alone. This is the reason why a certain chemical (or assistant) is added to the CO2 to assist in the releasing and removal of the high-molecular-weight contaminants.
In the substrate washing chamber 205, a washing takes place by allowing the super critical CO2 to come into contact with the substrate. Specifically, the substrate washing is achieved by allowing the super critical CO2 mixed with the chemical to circulate for a predetermined of time, based on the switching of the switching section 209 and activation of the circulator 206. The circulation-based washing for the substrate is adopted in order to minimize the amount of super critical CO2 used, and to reduce the time required for washing. As a result, the running cost can be curtailed, thereby making for a more economical processing.
The super critical CO2 mixed with the chemical, having dissolved or dispersed therein the containing contaminants from the substrate washing (e.g., organic substances, inorganic substances, metals, particles, and/or water which have parted from the substrate and strayed into the super critical CO2 during the washing), is vaporized and subjected to a final decompression by the decompressor 207 so as to be vaporized. Thereafter, the super critical CO2 is separated into gaseous CO2, the chemical, and the contaminants in the separation/recovery bath 208. The isolated chemical and contaminants are discharged, whereas the CO2 gas is recovered for recycling in the condenser 202. The substrate washing is completed by repeating the above wash process for a predetermined amount of time or longer.
However, in order to use the high pressure processing apparatus for long periods of time, it becomes necessary, after every wash process, to clean the entire system of the chemical and residues in the channels of the circulation line and other components. Moreover, in the case of performing wash processes using different chemicals with the same apparatus, it is also necessary to perform a cleaning process to remove the residues of the chemical used in the previous process, before a new chemical can be used. This cleaning process is usually performed by allowing an SCF to flow through the entire system without mixing any chemicals therein. Therefore, in order to clean the circulation channel 212 which is part of the circulation line, only an SCF is circulated, and after the lapse of a predetermined period of time, the SCF in the circulation line is discharged to the decompressor 207. This operation must be repeated as necessary.
Cleaning the entire system through the above-described operation will invite a prolonged cleaning process time, a lower throughput of the high pressure processing apparatus, and a larger amount of SCF being used in the cleaning process, thus leading to increased cost.
Furthermore, unlike the processing operation performed by the high pressure processing apparatus, the above-described cleaning process is a separately and non-routinely performed process, and therefore does not make for much improved cleanliness within the circulation line. Consequently, the cleanliness with respect to the object to be processed is also deteriorated. Moreover, when wash processes are performed with different chemicals, a chemical which was used before the cleaning process may inevitably be mixed with a new chemical used in the circulation line, thereby resulting in unwanted chemical reactions between the chemicals, or making it impossible to perform a desired wash process. Thus, there are limits to the chemicals which can be used in the conventional high pressure processing apparatus.
Another known method is illustrated in FIG. 11, under which a cleaning process is performed in a conventional high pressure processing apparatus by supplying an SCF containing no chemicals (referred to as "fresh SCF") to the circulation line from a separate line. In the high pressure processing apparatus shown in FIG. 11, a "fresh" super critical CO2 is supplied from a fresh SCF supply section 213. Therefore, the cleanliness within the substrate washing chamber 205 is improved. However, as is the case with the aforementioned cleaning operation, the cleaning of the interior of the circulation line in this case occurs as a restricted process which requires the entire system to only execute a cleaning operation. Thus, this method does not solve the aforementioned problems.
Likewise, the above problems are true not only of washing techniques employing SCF, but also of any high pressure process, such as development, washing, or drying of a substrate within a closed processing chamber, that employs a subcritical fluid or a high pressure gas of ammonia, for example.

High pressure processing apparatus and method


A fixing device has a heating roller with a heat source therein. A power supply operates the heat source for heating a transfer material and fixing a toner image thereon. A pressure roller is spaced from the heating roller and a facing member faces the heating roller. An endless fixing belt is mounted on the facing member and the heating roller and contacts the pressure roller to form a nip. A temperature detector faces the outer surface of the fixing belt for detecting the surface temperature thereof. An excessive temperature preventer faces part of the outer surface of the heating roller where the fixing belt is not mounted for detecting the surface temperature of the heating roller and cutting off the power supply to the heat source when the surface temperature rises above a preset temperature.

1. Field of the Invention
The present invention relates to a fixing device for fixing a toner image transferred to a transfer material and an image forming apparatus employing such a fixing device.
2. Description of the Related Art
A fixing device as disclosed in Japanese Unexamined Patent Publication No. 2002-82571 has been conventionally known. This fixing device is arranged at a side immediately downstream of an image forming assembly in an image forming apparatus and fixes a toner image transferred to a sheet (transfer material) in the image forming assembly to this sheet by heating, i.e. applies a so-called image fixing operation. Such a fixing device includes a heating roller provided with a heat source inside, a fixing roller opposed to this heating roller and a fixing belt mounted between the fixing roller and the heating roller. There is also provided a pressure roller to be pressed into contact with the fixing roller with the fixing belt therebetween.
The sheet having the toner image transferred thereto is fed to a nip portion formed between the pressure roller rotating about its central axis and the fixing belt turning between the heating roller and the fixing roller. Upon passing the nip portion, toner particles are melted by supplying heat from the fixing belt to the sheet, and the image fixing operation is performed by fixing the melted toner particles to the surface of the sheet.
In such a fixing device, the temperature of the fixing belt needs to be properly controlled. To this end, a temperature sensor is arranged at a position facing part of the outer circumferential surface of the heating roller where the fixing belt is not mounted, and the temperature of the fixing belt is controlled to a specified temperature based on the detection result of this temperature sensor.
In the operation of fixing the toner particles to the sheet, temperature at the outer surface of the fixing belt to be directly brought into contact with the toner particles influence the quality (fixing property) of the image fixing operation. However, immediately after the warm-up following the start of the image forming apparatus, the outer surface of the fixing belt has not yet reached the specified temperature in many cases. If the sheet is passed through the nip portion in such a state, the temperature at the outer surface of the fixing belt falls to or below a specified temperature, thereby causing inconvenience of deteriorating the fixing property.
Even if sufficient time passes after the warm-up and the fixing belt is uniformly heated up to the specified temperature, the fixing property is deteriorated in some cases. For example, if a large number of sheets are successively fed to the nip portion per unit time, the outer surface of the fixing belt is deprived of a large quantity of heat. A resulting fall in the surface temperature of the fixing belt may deteriorate the fixing property of the toner particles.
In order to avoid such inconvenience, the temperature sensor (temperature detecting means) is arranged at the position facing the part of the outer circumferential surface of the heating roller where the fixing belt is not mounted in the fixing device of the above patent publication, and the temperature of the fixing belt is controlled to the specified temperature based on the detection result of this temperature sensor. However, the temperature on the outer circumferential surface of the heating roller does not necessarily correspond to the temperature at the outer surface of the fixing belt upon the occurrence of the above inconvenience. This leads to a problem that the surface temperature of the fixing belt cannot be properly controlled and the fixing property of the toner particles is deteriorated in some cases.
In the fixing device of the above patent publication, the heating roller might be overheated if the temperature sensor cannot precisely detect temperature for a certain reason or a control circuit is in trouble.

Fixing device and image forming apparatus


A fuel injector regulator having combined initial injection and peak injection pressure regulation. The fuel injector regulator includes a rate shaping valve movably supported within a valve bore between a closed position and an open position to regulate a rate of injected fuel. The regulator further includes a waste gate valve having a body movably supported within a bore of the rate shaping valve and between a closed position and an open position to regulate the pressure of injected fuel.

1. Field of the Invention
The present invention relates to fuel injector assemblies having a combined initial injection and peak injection pressure regulator.
2. Background Art
A fuel injector assembly having a combined initial injection and peak injection pressure regulator addresses a need in the art for a fuel injector assembly system which may be employed to lower the initial rate of fuel injection and to limit peak injection pressure in a simple, inexpensive and cost-effective manner.
One short-coming with such regulators is with the precision at which it can control a waste gate valve to control the valve's opening and closing pressure. The disadvantage is due to a differential in surface area of the waste gate valve being exposed to high pressure fuel when the valve is closed that is substantially less than a surface area exposed to the fuel when the valve is opened. This surface area differential causes a correspondingly differential in opening and closing pressure that prevents the waste gate valve from controlling its open and closing pressure with desired precision.
Accordingly, there exists a need to provide a fuel injector assembly which can more closely control the opening and closing pressures of a waste gate valve.

Fuel injector regulator having combined initial injection and peak injection pressure regulation


An information display system provides an effective device for the storage and display of information. An H-shaped frame provides easy installation and ease of manufacture. An information storage unit is attached to the H-shaped frame and provides a sealed unit that is easy to access but that protects the contents from exposure to the elements.

In recent years, over ten million homes are either sold or rented "by owner." Current signs available to the seller who desires to sell property, such as real estate, "by owner" have certain drawbacks. Generally, such signs do not offer any means to display or store adequate information about the property. One option used in recent years includes the use of a standard "for sale" or "for rent" by owner sign in conjunction with an information tube. Such tubes require the user to curl paper to fit it in the tube, which often results in an unprofessional appearance. The tube is attached to the sign using tape or other similar adhesive, which is not suitable to withstand outdoor elements such as rain and snow. In addition, such information tubes are somewhat flimsy and include an end cap that is difficult to use and often dangles open, exposing the contents to the weather as well. As a result, any paper information included in the tube becomes unreadable and unusable. Another alternative currently employed by sellers is to write information directly on the sign, which is difficult to read and is generally incapable of conveying the required information effectively.
Accordingly, there is a need for a user to professionally display information about property for sale that is attractive, easy to use and that provides effective storage for information related to the property offered for sale.