According to one embodiment, the exposure device includes an exposure head, a holder, a biasing member, a lifting mechanism, a support member, a harness, and a protrusion. The holder supports the exposure head movably in a first direction of approaching the photosensitive drum and a second direction of being spaced from the photosensitive drum. The harness has one end portion connected to the exposure head. The harness is positioned with respect to the support member in a positioning location having a length direction position different from that of the one end portion. The harness has a folding portion formed between the one end portion and the positioning location. The protrusion enters inside of the folding portion to regulate movement of the folding portion of the harness in the first direction or the second direction. The protrusion protrudes from the holder in a third direction intersecting the first direction.

For example, an exposure device of an image forming apparatus includes an exposure head, a harness, a holder, and a biasing member. The harness is a signal line for sending a drive signal or the like to the exposure head. The harness is connected to the exposure head. The holder holds the exposure head. The biasing member applies a load to the exposure head in a direction of approaching a photosensitive drum. In order to accurately position the exposure head, it is required to apply an appropriate load to the exposure head.
In the exposure device, the harness is connected to the exposure head, and thus the load applied to the exposure head may be inaccurate due to the influence of the harness.

Exposure device and image forming apparatus


In a method for transmitting a data stream, especially a reducible data stream, from a producer to a plurality of viewers, wherein producer and viewers are subscribers in a network having point-to-point connections, the producer transmits the data stream over a point-to-point network connection to at least one viewer, at least one viewer receives the data stream over a point-to-point network connection and promptly transmits it in identical or reduced form to at least one additional viewer, and every viewer is promptly supplied with the data stream in identical or reduced form by either the producer or another viewer over a point-to-point network connection.

The Internet, originally designed for static data, is increasingly becoming a platform on which also multimedia data such as audio and video data is transported. Traditionally, data transmission on the Internet takes place in such a way that the available data is present on a server and wait for a user to retrieve them. Here, there is always a certain time span between the production of data and the processing by a user.
Streaming technology pursues another approach, in which the transmitted contents, for example a television program or a radio program, already appear on the user's end during the transmission, so in other words, said user can follow the television or radio program live. Here, it is usually neither required nor desired that the entire program be recorded by the user. This type of transmission is also referred to as real-time transmission, since the data is present on the user's end and is reproduced with no major time lag.
For the purposes of the present application, a program to be transmitted consists of one or more types of different multimedia data, such as motion picture, sound, graphics, texts, applications or any other data. The entire content of a program, in its chronological sequence, forms a data stream that must be transmitted from the producer to the viewers when transmitting a program.
Here, the basic problem arose that providing a data stream to a plurality of viewers in data networks usually involves great effort and high costs.
With the aid of so-called multicast technologies, data can be distributed simultaneously to many subscribers in a network. However, this requires special equipment for the data network, and in particular, the routers must be multicast-capable. Moreover, the configuration and operation of such networks is complicated and arduous.
Thus, many data networks do not have multicast technology, for example multicast is generally not possible on the Internet. In large networks, for which the Internet is one example, multimedia data is thus typically transmitted directly from a particular producer to the individual viewers. For this purpose, the viewer sets up a point-to-point connection to the producer server, for example a TCP/IP (Transmission Control Protocol/Internet Protocol) connection or a UDP/IP- (User Datagram Protocol-) based connection in IP-based networks.
Alternatively, the producer may also install various data servers or employ the services of already installed data servers. In this case, the data is first distributed by the producer to the various data servers. A viewer who wants to receive the data is referred to a data server. A point-to-point connection over which the data is transmitted is set up between data server and viewer.
A drawback of these methods is that, for both alternatives, the producer must provide an adequate network connection. All data is transmitted over point-to-point connections, at one end of which is a data server of the producer and on the other end of which is the viewer. A separate connection must be set up for every viewer, so that, for n viewers, n-fold transmission capacity must be available. Moreover, the n-fold quantity of data to be transmitted accumulates for the producer, since the data has to be transmitted to each viewer separately. If the producer wants to reach many viewers, he is forced to make large bandwidths available. If his program is successful, large quantities of transmitted data accumulate. In both cases, the producer must expect high costs.
A further disadvantage is that the available software is difficult to operate due to the complex technology and requires special training for the operating staff.

Method for transmitting a data stream from a producer to a plurality of viewers


A developer station and related method for distributed replenishment of toner as well as powder coatings and related materials. The developer station is divided into a first space adjacent or within a second space, the first space located adjacent a toner supply and the second space including a developer sump. The first space includes a toner-conveying device located in the first space, the toner-conveying device having a tapered body with a first end and a second end. A conveyance housing is located adjacent to and disposed such that the toner conveying device conveys the toner toward the developer sump as it travels from the first end of the toner conveying device to the second end of the toner conveying device, the housing having slots or openings so that the toner is deposited in the developer sump along the length of the conveying device.

Electrographic printers and copiers utilizing developer comprising toner, carrier, and other components use a developer mixing apparatus and related processes for mixing the developer and toner used during the printing process. The term "electrographic printer," is intended to encompass electrophotographic printers and copiers that employ dry toner developed on an electrophotographic receiver element, as well as ionographic printers and copiers that do not rely upon an electrophotographic receiver. The electrographic apparatus often incorporates an electromagnetic brush station or similar development station, to develop the toner to a substrate (an imaging/photoconductive member bearing a latent image), after which the applied toner is transferred onto a sheet and fused thereon.
As is well known, a toner image may be formed on a photoconductor by the sequential steps of uniformly charging the photoconductor surface in a charging station using a corona charger, exposing the charged photoconductor to a pattern of light in an exposure station to form a latent electrostatic image, and toning the latent electrostatic image in a developer station to form a toner image on the photoconductor surface. The toner image may then be transferred in a transfer station directly to a receiver, e.g., a paper sheet, or it may first be transferred to an intermediate transfer member (ITM) and subsequently transferred to the receiver. The toned receiver is then moved to a fusing station where the toner image is fused to the receiver by heat and/or pressure.
Development stations require replenishment of toner into the developer sump to replace toner that is deposited on the photoconductor or receiver. In development stations utilizing a carrier, this toner must be mixed uniformly with the carrier. Replenishment has been done at a single location in the developer sump, but this has lead to high concentrations of low-charge toner in one area of the sump, which tends to produce a dark streak on the image or receiver, or produces non-uniform areas in an image.
The present invention corrects the problem of non-uniform mixing. The apparatus and related methods transport and mix the toner efficiently when needed, maintaining the correct proportions necessary to produce the high quality prints or powder coatings required by consumer demand. The following invention solves the current problems with developer mixing so that the mixer will work in a wide variety of situations and with different types of toners, powders, or particles.

Electrographic distributed replenishment apparatus and method


A rifle comprising a housing, a barrel anchored thereon and a forearm extending below the barrel. The barrel is anchored by a fastening element which extends through a cross hole of the housing. The forearm has at least one axial projection that detachably engages into a seat of the housing. The cross hole for anchoring the barrel and the seat for fastening the forearm intersect and the forearm comprises a snap-in recess for the fastening element to snap in when the barrel is anchored.

The present invention relates to a rifle having a housing, a barrel anchored on it and a fore-end extending under the barrel, in which case the barrel can be anchored with the aid of an attachment means which passes through a lateral hole in the housing, and the fore-end has at least one axial projection which engages detachably in a holder in the housing.
Rifles with an interchangeable fore-end allow different fore-ends to be used for different purposes, for example one fore-end with a bipod which can be unfolded for sniper use, a slim fore-end for hunting use, etc.
It is known, for detachable attachment of the fore-end for the axial projection to be equipped with sprung latching tabs which can be pulled back by a mechanism inside the fore-end in order to hold the fore-end. This design is rather complex to manufacture and is susceptible to defects during use.
The invention is based on the object of providing a simple, safe and reliable design for quick replacement of the fore-end, which at the same time ensures that the fore-end is anchored without play.


An audio system on a headset presents, to a user, audio content simulating a target artificial reality environment. The system receives audio content from an environment and analyzes the audio content to determine a set of acoustic properties associated with the environment. The audio content may be user generated or ambient sound. After receiving a set of target acoustic properties for a target environment, the system determines a transfer function by comparing the set of acoustic properties and the target environment's acoustic properties. The system adjusts the audio content based on the transfer function and presents the adjusted audio content to the user. The presented adjusted audio content includes one or more of the target acoustic properties for the target environment.

The present disclosure generally relates to audio systems, and specifically relates to an audio system that renders sound for a target artificial reality environment.
Head mounted displays (HMDs) may be used to present virtual and/or augmented information to a user. For example, an augmented reality (AR) headset or a virtual reality (VR) headset can be used to simulate an augmented/virtual reality. Conventionally, a user of the AR/VR headset wears headphones to receive, or otherwise experience, computer generated sounds. The environments in which the user wears the AR/VR headset often do not match the virtual spaces that the AR/VR headset simulates, thus presenting auditory conflicts for the user. For instance, musicians and actors generally need to complete rehearsals in a performance space, as their playing style and the sound received at the audience area depends on the acoustics of the hall. In addition, in games or applications which involve user generated sounds e.g. speech, handclaps, and so forth, the acoustic properties of the real space where players are do not match those of the virtual space.

This patent is subject to a terminal disclaimer.

Audio system for artificial reality environment


Wafer debonding of a bonded bulk wafer and a device wafer using a liquid jet to avoid scratching of the wafers is provided. The wafer debonder includes a wafer loader having a first stand with a flat upper surface and a second stand located above the first stand having a lower surface slanted with respect to the upper surface of the first stand at a predetermined angle. A first holder is connected to the first stand and a second holder is located on an imaginary surface extended from the lower surface of the second stand for holding the wafers. A liquid jetting nozzle is positioned adjacent the wafer loader to direct a jet of liquid at the interface between the wafers to separate the wafers.

Integrated circuits fabricated in silicon-on-insulator ("SOI") substrates offer various performance advantages. A commercially fabricated silicon-on-insulator wafer may be generally classified into one of two types. A SIMOX (separation by implanted oxygen) wafer is one type which generally includes an oxide layer in a bulk wafer which is obtained by implanting oxygen ions in the bulk wafer and then annealing the wafer. The second type is a bonded SOI wafer which may be produced by forming a thermal oxide layer on the surface of a bulk wafer and then directly bonding a device wafer on the thermal oxide layer.
In the case of the bonded SOI wafer, if impurity particles exist in the interface between the bulk wafer and the device wafer after the bonding process, the device may be useless commercially. Therefore, the bonding process is generally performed in a super-clean room in order to attempt to prevent the interface between the bulk wafer and the device wafer from being contaminated by impurity particles. However, in practice, it is generally not possible to carry out a bonding process without generating some impurity particles. Therefore, in some cases, impurity particles exist in the interface between the wafers after bonding the device wafer to the bulk wafer. As a result, if impurity particles exist, a debonding process may be provided to allow removal of the impurity particles.
FIGS. 1A and 1B are cross-sectional views illustrating a conventional wafer debonding method. As illustrated in FIG. 1A, after forming thermal oxide layer 30 on bulk wafer 10, device wafer 20 is directly bonded on thermal oxide layer 30 to form bonded wafer 60. If it is determined that impurity particles exist in the interface between bulk wafer 10 and device wafer 20 requiring debonding, razor blade 40 is inserted between bulk wafer 10 and device wafer 20, and the bonded wafers are debonded manually by hands 50 as shown in FIG. 1B.
With the conventional method of debonding as illustrated in FIGS. 1A and 1B, while the thickness of each of bulk wafer 10 and device wafer 20 is thin, the bonding strength between the wafers is typically too strong to separate the wafers with bare hands alone. Therefore, razor blade 40 is inserted as an auxiliary tool for debonding bonded wafer 60.
However, razor blade 40 may cause undesirable scratches around edges of bulk wafer 10 and device wafer 20, causing a scratch in the surfaces of the wafers. Since this scratch typically can not be eliminated even if the debonded wafers are rebonded after cleaning, the wafers having a scratch may need to be discarded, thereby increasing processing costs.

Apparatus and methods for wafer debonding using a liquid jet


A skiving apparatus for simultaneously skiving the outer and inner surfaces of an end of reinforced hose. The apparatus comprises an outer diameter cutting tool, an internal skiving mandrel and a bracket for holding the outer diameter cutting tool and the internal skiving mandrel in a substantially perpendicular relation. The internal skiving mandrel has a nose for coaxially receiving a hose end thereover, spiral cutting threads and a stop collar. To achieve the desired simultaneous skiving effect, the internal skiving mandrel and the outer diameter cutting tool have a coincident cutting direction. Thus, when the hose is fed over the mandrel and the apparatus is rotated the simultaneous skiving of the inner and outer surfaces of the hose is accomplished.

1. Field of the Invention
This invention relates generally to preparing the end of a hydraulic or other reinforced hose to receive a coupling, and, more specifically, to the simultaneous skiving of the outer and inner surfaces of a hose end.
2. Background
High pressure hydraulic and pneumatic hoses are typically constructed with one to six layers of spiral wrapped steel wire reinforcement embedded in the walls. A simplified model useful for conceptualization is an inside rubber tube spirally wrapped with steel wire, covered by an outer rubber tube. In practice, the parts of the hose are bonded together, more or less as reinforced tire parts are bonded, into a single unit.
The hose is usually manufactured in long lengths supplied in coiled form to manufacturers who cut to the desired length. Connectors or "fittings" are fastened to the ends of hoses to allow convenient and leak free coupling. Fittings are available in many styles for differing applications and preferences. Two classes of connectors are "reusable" and "crimp" fittings.
Reusable fittings consist substantially of two parts, a "socket" which slips over the outside of a prepared hose and threads onto the second part, a "nipple" which has a tube that slips inside the prepared hose. Crimp fittings are similar except that threads are omitted and slips inside the prepared hose. Crimp fittings are similar except that threads are omitted and the outer socket is of thinner steel material which may be squeezed and formed (crimped) to tightly secure the fitting to the end of the hose. Some of the same equipment and processes apply to both types of fittings.
In preparation for attaching certain fittings, some rubber material is removed from both the outside diameter and the inside diameter of the hose. This preparation serves to minimize the outside diameter of the fitting, minimize flow restriction by increasing the inside diameter of the hose before inserting the nipple, and strengthen the fitting's grip on the hose.
For high pressure applications, reusable fittings typically require skiving the outside of the hose only, while crimp fittings typically require removing a portion of both the inside and the outside of the hose. Thus, the present invention has its primary application in preparing hose ends for installation of crimp fittings, although it is not limited to this application.
The process of removing a portion of either the outer or inner surfaces of a hose end is called skiving. External skiving compares to stripping or peeling. Internal skiving compares to boring or reaming. Heretofore, devices and methods for skiving have focused singularly on preparing either the outer diameter or inner diameter of the hose end, but not both.
The most elementary way to skive the outer surface of reinforced hose is with knife and pliers. The knife and pliers method is a manual method where a ring is cut around the hose end with a knife down to the wire reinforcement braid and a slit is made from the ring to the hose end. The outer layer of rubber is then peeled off with pliers. To speed up the process, special "external skiving tools" have been developed, and are well-known in industry.
One well accepted external skiving tool consists of three major parts. The first part is a mandrel with a beveled nose which fits inside the hose to steady it and allow precise control of the cutting depth. The mandrel also has a machined stop to control the length of hose to be skived. The tail end, beyond the stop, is a gripping portion, normally cylindrical, made to be gripped in a spindle. An angled bracket is clamped to the mandrel. It extends from the axis of the mandrel to clamp and hold an outer diameter cutting tool normal to the surface of the hose. The cutting tool is adjusted and clamped to skive the outside of the hose. As the tool is turned and the mandrel is inserted into the end of a hose, the cutting tool makes a cut normal to the hose with one cutting blade, and a second cut to skin or skive the hose with another blade.
Prior methods of skiving the outside diameter of a hose end with the described external skiving tool are:
(a) manual--An appropriate sized skiving tool for the hose size is selected and mounted in a vise. The hose end is slipped over the mandrel until the hose contacts the skiving blade of the outer diameter cutting tool. The hose is pushed and turned clockwise to skive the outside diameter until the hose bottoms on the stop. The tool is withdrawn and the hose end cleaned. PA1 (b) manual with "speed handle"--The hose is clamped in a vise and the skiving tool is attached to a "speed handle," a device similar to the brace of a hand drill. The mandrel is pushed into the hose and turned clockwise with the speed handle until the mandrel stop bottoms on the hose. The tool is withdrawn and the hose end cleaned. PA1 (c) by machine--The skiving tool is mounted in the spindle of a turning machine and the spindle is started counterclockwise (as looking at the spindle from the front). The hose is pushed over the mandrel of the skiving tool by hand, preferably mounted in a vise which slides parallel to the axis of the spindle, until the hose bottoms on the mandrel stop. The hose end is then withdrawn and cleaned. PA1 (a) manual--The appropriate sized skiving tool is selected and clamped in a vise. The hose is pushed over the end of the skiving tool until it contacts the cutting threads. The hose is pushed and turned counterclockwise until it bottoms on the tool. The hose end is then withdrawn and cleaned. PA1 (b) manual with "speed handle"--The hose is clamped in a vise while the tool is attached to a speed handle. The tool is then inserted into the hose end and turned counterclockwise with the speed handle until it bottoms on the hose. The tool is withdrawn and the hose end cleaned. PA1 (c) by machine--The skiving tool is mounted in the spindle of a turning machine and the spindle started clockwise (as looking at the spindle from the front). The hose is pushed over the mandrel of the skiving tool by hand, preferably mounted in a vise which slides parallel to the axis of the spindle, until the hose bottoms on the stop. The hose end is then withdrawn and cleaned.
Special tools called "internal skiving tools" are likewise well-known in the industry for trimming the inner surface of a hose end. The typical internal skiving tool has a nose portion with a beveled end for easy insertion into the hose end. Behind the nose are sharpened threads which screw into the inside wall of the hose and cut it. A stop on the tool aids skiving to the desired depth from the end of the hose. A desired cylindrical ring section is pulled out when the tool is retracted. The tail end, beyond the stop, is a gripping portion which may be hexagonal for secure gripping in a spindle, or vise.
Prior methods of skiving the inside diameter of a hose end with the described internal skiving tool are:
In the patent art, Rassi and Dick, in U.S. Pat. No. 3,759,121, describe a self-contained machine including dual opposed chisel-type cutters for skiving the outside of a hose end. Beckhausen, in U.S. Pat. No. 3,811,347, discloses a device with guide rods and rollers and one or more cutting blades to strip material from the outside of a hydraulic hose end. Anderson et al., in U.S. Pat. Nos. 3,820,421 and 3,938,215, describe an apparatus for skiving the outside of the end of a piece of reinforced hose while vacuuming the inside of the hose to recover particulate debris. U.S. Pat. No. 3,965,570 to Kozulla discloses a tool for skiving the outside diameter of the end of a hydraulic hose with an adjustable chisel-type cutter and a mandrel which fits inside the hose for support. Plies, in U.S. Pat. No. 4,000,552, describes a machine which buffs the exterior surface of the end of a hose with a wire brush to make the exterior concentric with the interior and to prepare it for a coupling.
An important limitation of conventional skiving devices and methods is that the outer and inner hose end surfaces must be prepared in separate operations. None of the known skiving apparatus is capable of performing double duty as both an outer and inner diameter skiving tool, much less simultaneously skiving both the inner and outer hose end surfaces. This requirement of multiple skiving operations increases handling time, adds to equipment requirements, and decreases worker productivity.
It is thus an object of the present invention to provide a device and method for the simultaneous skiving of both the outside and inside of a hose end.
It is a further object of the invention that the device be capable of use with conventional turning machines, such as portable reusable hose assembly machines, operating, for example, at 15 rpm.


The invention relates to an assembly with an electrotechnical component on a carrier. A first electrical connecting line and a second electrical connecting line going to the electrotechnical component are provided on or in the carrier. The electrotechnical component comprises a first connection and a second connection. The first connection is attached on the carrier by a thermally softenable solder material to the first electrical power supply line, and the second connection is attached on the carrier by a thermally softenable solder material to the second electrical power supply line. A first electrical signal line to the electrotechnical component is provided on or in the carrier. The assembly furthermore comprises a mechanical prestressing, which in the event that the solder material is softened can displace the electrotechnical component on the surface substantially in a parallel plane to the carrier or orthogonally to the carrier.

The overloading of electrotechnical components may result in them working outside the rated operating range. The power conversion caused by a reduced component insulating strength at a damaged electrotechnical component, for example, may result in unacceptable heating.
If the unacceptable heating of the electrotechnical component is not prevented, it may result for example in the damaging of the electrotechnical component itself, as well as surrounding materials, or even to an ignition and/or the release of toxic gases and/or explosive destruction.
In order to curb these effects, temperature fuses are often associated with the electrotechnical component in order to enable a disconnection in the event of unacceptable heating. The temperature fuse is thermally attached to the electrotechnical component being monitored.
The problem with this, however, is that only a very limited thermal coupling is available, so that such layouts are not suitable for rapid heating processes, because the thermal conduction requires too much time.
Due to the limited thermal coupling possibility, this layout is not suitable for rapid heating processes.
Therefore, the voltage surge protection component used for example in voltage surge protection devices, especially varistors, gas discharge tubes (GDT) and transient voltage suppressor (TVS) diodes, is outfitted with activatable disconnection devices.
For example, such thermal disconnection devices are described for damaged voltage surge protection components in patents DE 42 41 311 of the applicant, DE 699 04 274, and U.S. Pat. No. 6,430,019.
The solutions described in the patents all work by the same basic principle. The component being monitored is attached in a thermosensitive manner via a contact element. The thermosensitive attachment occurs generally via a soldered connection. The contact element is mounted in a prestressed state, or the force of a second prestressed element, such as a spring, acts on the contact element. If the spring force exceeds the holding force of the thermosensitive contact site, such as a soldered site, the contact opens and the monitored component is disconnected.
Equally important to the disconnection of a component in the case of overload or fault is the displaying of the device defect, in order to alert the user to the lack of protection and/or to the need for a replacement.
Since such components are generally located in switch/fuse cabinets, a defect can only be recognized on the device.
Therefore, telecommunications devices are being used increasingly so that a malfunction can also be recognized at another location.
These telecommunications devices are based on the use of a direct or indirect switching device.
However, it turns out that such mechanical switching devices are prone to malfunction, in addition to having a large space requirement.
It would therefore be desirable to provide an assembly in which a disconnection can be detected and remotely communicated with simple means.
The solution of the problem according to the invention is provided by the features of the independent claim. Advantageous embodiments of the invention are indicated in the dependent claims, the specification, and the figures.
The invention shall be represented in the following with reference to the figures. It should be noted that different aspects shall be described, each of which may be used alone or in combination. That is, any aspect may be used with different embodiments of the invention, unless explicitly presented as a pure alternative.
Furthermore, for the sake of simplicity, generally only one entity shall be referred to in the following. But, unless specifically stated, the invention may also have several of the mentioned entities. Accordingly, the use of the word "a" or "an" should only be taken to mean that at least one entity is used in a simple embodiment.
So far as methods are described in the following, the individual steps of a method may be arranged and/or combined in any given sequence, as long as the context does not indicate otherwise. Furthermore, the methods may be combined with each other, as long as not explicitly indicated otherwise.
Indications with numerical values should generally not be taken as exact values, but rather also contain a tolerance of +/−1% to +/−10%.
Insofar as standards, specifications, or the like are mentioned in this application, they always refer at least to the standards, specifications, or the like which are applied on the date of the application. That is, if a standard/specification etc. is updated or replaced by a later version, the invention is also applicable to it.
The figures represent various embodiments.
An assembly according to the invention—as represented in FIGS. 1 to 4—comprises a carrier P. An electrotechnical component EB is arranged on the carrier P. A first electrical power supply line L1 and a second electrical power supply line L2 going to the electrotechnical component EB are provided on or in the carrier P.
The electrotechnical component EB comprises a first connection A1 and a second connection A2, wherein the first connection A1 is attached on the carrier P by a thermally softenable solder material to the first electrical power supply line L1. The second connection A2 is attached on the carrier P by a thermally softenable solder material to the second electrical power supply line L2.
A first electrical signal line L3 to the electrotechnical component EB is provided on or in the carrier P, wherein the first connection A1 on the carrier P is attached by a thermally softenable solder material to the first electrical signal line L3 as well.
The assembly furthermore comprises a mechanical prestressing D, which in the event that the solder material is softened can displace the electrotechnical component EB on the surface substantially in a parallel plane to the carrier P or orthogonally to the carrier P so that the electrical attachment of the first electrical power supply line L1, the second electrical power supply line L2 and the first electrical signal line L3 is interrupted such that a potential can now be measured between the first electrical power supply line L1 and the first electrical signal line L3.
That is, unlike with the prior art, no additional switch is required, but instead an electrical potential is made available when changing from a first state (working/operating state—see e.g. FIGS. 1, 2 and 5) to a second state (fault/disconnection state—see e.g. FIGS. 3, 6). In this way, no additional mechanical components are needed. By the elimination of mechanical components, the production costs and the required design space can be reduced. Furthermore, the elimination of mechanical components results in heightened safety, since now there is less risk of faults due to individual mechanical parts.
That is, by dividing the electrical connection between L1 and L3, a potential can now be measured between these two lines, e.g., when L1 continues to be at the power supply voltage.
In another embodiment of the invention—as represented in FIG. 4—an assembly 1 according to the invention comprises a carrier P. An electrotechnical component EB is arranged on the carrier P. A first electrical power supply line L1 and a second electrical power supply line L2 going to the electrotechnical component EB are provided on or in the carrier P.
The electrotechnical component EB comprises a first connection A1, a second connection A2, a third connection A3, and a fourth connection A4, wherein the third connection A3 and the fourth connection A4 are substantially electrically short-circuited in the interior of the electrotechnical component EB.
The first connection A1 is attached on the carrier P by a thermally softenable solder material to the first electrical power supply line L1. The second connection A2 is attached on the carrier P by a thermally softenable solder material to the second electrical power supply line L2.
A first electrical signal line L3 and a second electrical signal line L4 to the electrotechnical component EB are provided on or in the carrier P, wherein the third connection A3 is attached on the carrier P by a thermally softenable solder material to the first electrical signal line L3, and wherein the fourth connection A4 is attached on the carrier P by a thermally softenable solder material to the second electrical signal line L4.
The assembly furthermore comprises a mechanical prestressing D, which in the event that the solder material is softened can displace the electrotechnical component EB on the surface substantially in a parallel plane to the carrier P or orthogonally to the carrier P so that the electrical attachment of the first electrical power supply line L1, the second electrical power supply line L2, the first electrical signal line L3, and the second electrical signal line L4 is interrupted such that a potential can now be measured between the first electrical signal line L3 and the second electrical signal line L4.
That is, unlike with the prior art, no additional switch is required, but instead an electrical potential is made available when changing from a first state (working/operating state—see e.g. FIG. 4) to a second state (fault/disconnection state). In this way, no additional mechanical components are needed. By the elimination of mechanical components, the production costs and the required design space can be reduced. Furthermore, the elimination of mechanical components results in heightened safety, since now there is less risk of faults due to individual mechanical parts.
That is, by the displacement of the electrotechnical component EB, the short circuit present in the interior of the electrotechnical component EB (represented in FIG. 4 by a connection line in the electrotechnical component) is broken. Such electrical connections are often found in integrated circuits in the form of so-called NC-connections.
In the embodiment of FIG. 4, furthermore, a galvanic separation can be advantageously provided between signal circuit (signal lines L3 and L4) and working circuit (power supply lines L1, L2). That is, a signal circuit can be operated independently of the working circuit, so that for example other voltage levels can be used, more favorable to a subsequent processing.
In all embodiments of the invention, it may furthermore be provided that a solder pad is used for the electrical connection of the first electrical power supply line L1 and for the first electrical signal line L3, which are joined together in the soldered state by the solder material and the first connection A1 of the electrotechnical component EB. These solder pads may be arranged, e.g., such that the first connection A1 at least partly covers both the solder pad of the first electrical power supply line L1 and the solder pad of the first electrical signal line L3. A soldering will then produce an electrical connection. That is, the invention can be implemented with simple design measures.
In all embodiments of the invention, it may furthermore be provided that the electrotechnical component EB is chosen from a group comprising varistor, transient voltage suppressor diode, PTC, NTC, gas discharge tube, transistor, thyristor, and integrated circuit.
That is, the invention is not limited to voltage surge protection, but rather can be used with the most diverse components.
In all embodiments of the invention it may furthermore be provided that the force accumulator D comprises a spring. The spring may be configured as a helical spring.
Other force accumulators D can be made from an elastomer, for example.
In all embodiments of the invention it may furthermore be provided that the carrier P comprises a circuit board material. Generally the carrier material is rigid and flat. However, other embodiments are not ruled out.
In all embodiments of the invention, it may furthermore be provided that two solder pads arranged next to each other are used for the electrical connection of the first electrical power supply line L1 and the first electrical signal line L3, wherein the solder pads in the soldered state are joined to each by the solder material and the first connection A1 of the electrotechnical component EB, wherein the solder pads arranged next to each other are arranged substantially behind one another in the shear direction. Such an arrangement is shown, e.g., in FIG. 5 (working/operating state) and FIG. 6 (fault/disconnection state).
In the embodiments of the invention according to FIGS. 1-4, two solder pads arranged next to each other are used for the electrical connection of the first electrical power supply line L1 and the first electrical signal line L3, wherein the solder pads in the soldered state are joined to each other by the solder material and the first connection A1 of the electrotechnical component EB, wherein the solder pads arranged next to each other are arranged substantially parallel in the shear direction.
That is, thanks to the possibility of providing different shear directions parallel to the carrier P, the spatial circumstances can be taken into account.
Likewise, however, it is also possible to loosen the electrotechnical component EB orthogonally to the carrier P. For this, e.g., a force accumulator is provided (substantially) orthogonally to the carrier P, which when heated exerts tension or pressure on the electrotechnical component EB orthogonally to the carrier P.
That is, in the invention an electrotechnical component EB (such as a gas discharge tube, varistor, or suppressor diode) is soldered on a carrier P. The electrical power supply lines L1, L2 are likewise carrier-based.
In the new solution described here, a solder pad which is coordinated with an electrical connection contact of a component EB is "divided" between two separate pads. The electrical connection of the component EB in this case can at least partially cover both (partial) solder pads. At the same time, an electrical connection is provided by this and/or by the soldering. Now, if the component EP is displaced along the surface of the carrier P (after being acted upon by heat), the component EB will be disconnected from the electrical circuit(s). Likewise, the two (partial) solder pads will be electrically separated from each other. This additional "switch contact," realized with no additional expense, makes it possible to realize a simple and economically effective remote reporting of the status of the disconnection device.
Alternatively, the component EB can be assigned to only one of the two (partial) solder pads and the connection to the second of the two (partial) solder pads is produced by a solder bridge. If, now, the component is heated unacceptably and consequently separated from the solder pads, the solder bridge which joins the two pads together will likewise be heated and interrupted upon displacement of the component EB.

Assembly having an electrotechnical component on a carrier


The likely relevance of each term of a search-engine query of two or more terms is determined by their deletion probability scores. If the deletion probability scores are significantly different, the deletion probability score can be used to return targeted ads related to the more relevant term or terms along with the search results. Deletion probability scores are determined by first gathering historical records of search queries of two or more terms in which a subsequent query was submitted by the same user after one or more of the terms had been deleted. The deletion probability score for a particular term of a search query is calculated as the ratio of the number of times that particular term was itself deleted prior to a subsequent search by the same user divided by the number of times there were subsequent search queries by the same user in which any term or terms including that given term was deleted by the same user prior to the subsequent search. Terms are not limited to individual alphabetic words.

The present invention relates to computer search queries. More particularly, the present invention relates to methods and apparatus for determining the relative value of the various terms in a search query including two or more words, phrases, numbers and symbols submitted to a World Wide Web search engine.
A great many people use Internet search engines everyday to find information located on an increasingly large number of web sites with a great diversity of both commercial and noncommercial content spread across several billion pages of varying length. A basic challenge for any site among the Web's multitude is visibility, making its existence known to as many Web users as possible. This is particularly important to commercial sites, and as with other media, advertising is the central means of making potential customers aware of their business, their wares and their location.
The Web remains the newest media form. Advertising on the Web is an extremely competitive business, where the means of delivery of advertisements is still evolving. The evolution is guided in part by technological countermeasures such as pop-up blockers to eliminate ads or site links that distract and often irritate the user by preempting display screen 'real estate'. And in part, it is guided by trying to properly target the ads to potential users. Banner ads, which are dropped into a space reserved on the web page, are often simply 'generic ads' which usually provide links to commercial sites but often target customers no better than highway billboards.
Line ads, which are one or more—usually brief—sentences placed in a space reserved for them on the web page provide links to commercial sites, but are often poorly targeted as well—especially where the search term is comprised of more than a single word. Poor targeting by the search engine results when it is unable to know which of two or more words should be considered the most significant search term, or whether some contiguous words are to be considered a single term. Poor targeting of ads means a diminished effectiveness of the ads which has a negative impact on the interest in buying such ads and in the price of the ads. With existing methods it has been possible to predict the significant term in a multi-term query only about 30% of the time. An example of the present result of this problem is seen in FIGS. 3, 4 and 5. In FIG. 3 the search term was the single word, 'Honda' designated 302. The page has many ads in the right hand column, designated 304. Similarly, in FIG. 4, the search term is the single word 'test', designated 402, and there are many ads in the right hand column, designated 404. But in FIG. 5, where the search term is 'Honda test', designated 502, there are no ads whatever in the right hand column, designated 504.
A better means of understanding the relative value of two or more terms in a query would better focus advertising opportunities and increase revenue for both search engine companies and for their advertising clients. Two-word queries, for example, present nearly 30% of all American search queries, yet there has been no method for predicting the probability of the comparative relevance of either word to the search, even though knowing the comparative importance of either word to the intent of the searcher would clearly be valuable both for the relevance of search results as well as for advertising opportunities.

System and methods for ranking the relative value of terms in a multi-term search query using deletion prediction


The present invention relates to a wireless communication system and, more specifically, to a method and a device for controlling a backoff timer on the basis of multipriority in a wireless communication system. The method for controlling a backoff timer in a terminal in which multipriority is set, according to one embodiment of the present invention, comprises the steps of: transmitting, to a network node, a non access stratum (NAS) request message which is set to a first priority level and does not have an access point name (APN); receiving a reject message for the NAS request message from the network node; and starting a session management (SM) backoff timer on the basis of the rejection message, wherein while the SM backoff timer is operated, the terminal is permitted to transmit a new NAS request message which is not set to the first priority level.

Machine type communication (MTC) refers to a communication scheme between one or more machines and is also referred to as machine-to-machine (M2M) communication. Here, a machine refers to an entity which does not require direct human operation or intervention. For example, a device including a mobile communication module, such as a meter or a vending machine, may include a user equipment such as a smartphone which is capable of automatically accessing a network without operation/intervention of a user to perform communication. Various examples of such a machine are referred to as an MTC device or terminal in the present specification. That is, MTC refers to communication performed by one or more machines (that is, MTC devices) without human operation/intervention.
MTC may include communication (e.g., device-to-device (D2D) communication) between MTC devices and communication between an MTC device and an MTC application server. Examples of communication between an MTC device and an MTC application server include communication between a vending machine and a server, communication between a point of sale (POS) device and a server and an electric meter, and communication between a gas meter or a water meter and a server. AN MTC-based application may include security, transportation, healthcare, etc.
Meanwhile, if congestion or overload occurs in a network, congestion control may be performed in a control plane. For example, network congestion control may be performed at a non-access stratum (NAS) level which is an uppermost stratum in a control plane between a terminal and a network control node in a radio interface. In general, if a network congestion occurs, a network may configure a back-off timer for inhibiting a request for a network for a predetermined time with respect to a terminal.
According to operation of a currently defined wireless communication system, priority may be configured per terminals, and only one of "(NAS signaling) low priority" for a terminal supporting MTC or "(NAS signaling) non-low priority" for a terminal supporting non-MTC.
Meanwhile, if network congestion or overload occurs, a back-off timer (BOT) may be used in order to distribute network load. Back-off timers may be classified into a Mobility Management (MM) back-off timer and a Session Management (SM) back-off timer. MM back-off timer defines a time in which a terminal is prohibited from performing MM-related operations such as an attach request, SM back-off timer defines a time in which a terminal is prohibited from performing SM-related operations such as a session establishment/modify request related to an Access Point Name (APN).

Method and device for controlling multipriority in wireless communication system


Disclosed herein is a liquid crystal display device including, a liquid crystal layer, a first substrate and a second substrate which face each other through the liquid crystal layer therebetween, and a plurality of columnar spacers holding a gap between the first substrate and the second substrate, wherein the plurality of columnar spacers include a first columnar spacer and a second columnar spacer which are formed to be substantially equal in height, and a substrate surface of one of the first substrate and the second substrate is provided with a recess in at least one of a part where to dispose the first columnar spacer and a part where to dispose the second columnar spacer.

1. Field of the Invention
The present invention relates to a liquid crystal display device and a method of manufacturing a liquid crystal display device.
2. Description of the Related Art
Liquid crystal display devices generally have a configuration in which two substrates are disposed to face each other with a predetermined gap (spacing) therebetween, and a liquid crystal is fillingly sealed in the gap between the two substrates to form a liquid crystal layer. In the liquid crystal display thus configured, spacers are interposed between the two substrates so as to hold the gap between the two substrates (the thickness of the liquid crystal layer) at a predetermined size. While fine granular (spherical) spacers have been used, spacers in a columnar shape (hereinafter referred to as "columnar spacers") have recently come to be used in place of the granular spacers. The columnar spacers are formed on a substrate by use of a photosensitive resin material such as a photo-resist and, hence, they are referred to also as "photo-spacers."
When a load is exerted on the liquid crystal display device having the columnar spacers in the thickness direction, the substrate and the columnar spacers are deformed under the load. When an excessive load is exerted on a part of the liquid crystal display device, the columnar spacers holding the gap (spacing) between the substrates undergoes plastic deformation at that part. As a result, the gap between the substrates would not return to its initial size even when the load is removed, so that an irregularity in display would be generated.
In recent years, attendant on the reductions in thickness of mobile apparatuses, thinning of glass components in liquid crystal display devices and thinning of the acrylic resin plates or the like covering the surfaces of the liquid crystal display devices have advanced, and there is a tendency toward increased loads being exerted on the liquid crystal display devices. In order to realize a liquid crystal display device with a high pressure resistance under such circumstances, it is effective to enhance the density of the columnar spacers laid out in the substrate surface so as to disperse the pressure exerted on the individual columnar spacers. Specifically, it suffices to increase the area of contact between the substrate and the columnar spacers, either by increasing the number of the columnar spacers laid out per unit area or by enlarging the outer diameter of the individual columnar spacers.
However, the liquid crystal display device generally undergoes a volumetric shrinkage due to a lowering in the density of the liquid crystal under low-temperature environments, so that if the layout density of the columnar spacers is raised by increasing the number of the spacers or by enlarging the spacer outer diameter as above-mentioned, the elastic shrinkage of the columnar spacers may fail to follow up to the volumetric shrinkage of the liquid crystal. Consequently, there may cause a problem on a quality basis in that bubbles are generated in the liquid crystal layer if only a slight impact is exerted on the liquid crystal display device under low-temperature environments. Especially, in mobile use, the liquid crystal display device is frequently exposed to low-temperature environments, and the generation of bubbles would constitute a fatal defect on a quality basis. Therefore, there is a limit to the enhancement of the layout density of the columnar spacers for the purpose of obtaining a higher pressure resistance. In view of this, normally, the retention of quality is given priority over the enhancement of pressure resistance, and the layout density of the columnar spacers is designed to be somewhat low.
In order to solve such a problem, for example, Japanese Patent Laid-open No. 2005-326887 and Japanese Patent Laid-open No. 2002-341354 report a configuration in which two kinds of columnar spacers differing in height are arranged so that the number of the columnar spacers effective in holding the two substrates is varied according to the magnitude of the load (load pressure). In addition, Japanese Patent Laid-open No. 2002-341354 discloses a configuration in which projected stepped parts are formed by stacking layers of substrate-constituting materials, and first columnar spacers are put into contact with the stepped parts, whereby a gap is intermediately provided between second columnar spacers, of which the material and the height are the same as those of the first columnar spacers, and the substrate.

Liquid crystal display device and method of manufacturing liquid crystal display device


The present invention provides a safety shield for installation in an aerial bucket. The safety shield provides an adjustable panel which may be extended to a variety of positions to protect a user from unintentional contact with harmful surfaces such as electrical wires.

1. Field of the Invention
The present invention relates to the field of safety devices. In particular, the present invention relates specifically to an electricity shield for linemen.
2. Description of the Known Art
As will be appreciated by those skilled in the art, safety devices are generally employed to prevent collision with a object or substance. In some situations, the offensive object or substance may be harmful or cause harm if contacted. Patents disclosing information relevant to safety devices include U.S. Pat. No. 1,988,435, issued to Beebe on Jan. 22, 1935; U.S. Pat. No. 2,262,394, issued to Evans on Nov. 11, 1941; U.S. Pat. No. 2,576,238, issued to Rayburn on Nov. 27, 1951; U.S. Pat. No. 3,642,096, issued to Valentine on Feb. 15, 1972; U.S. Pat. No. 3,695,390, issued to Leigh on Oct. 3, 1972; U.S. Pat. No. 5,611,410, issued to Baillargeon on Mar. 18, 1997; U.S. Pat. No. 6,361,003, issued to Keoun on Mar. 26, 2002; and U.S. Pat. No. 6,907,894, issued to Bishop on Jun. 21, 2005. Each of these patents are hereby expressly incorporated by reference in their entirety.
U.S. Pat. No. 3,642,096, issued to Valentine on Feb. 15, 1972 entitled Insulating Liner for Man-Carrying Buckets. The abstract provides the following information. A man-carrying bucket for utility trucks in which a man is elevated in the bucket to work on electric powerlines, lamps and the like. The bucket is constructed of molded plastic reinforced with fiberglass and is additionally insulated by a polyethylene liner that is constructed in three pieces, a main portion covering the sidewalls and bottom of the bucket, a top portion that extends up over the top flange of the bucket, and a bottom portion additionally protecting the floor of the bucket. Economy of manufacture is attained by molding the top and bottom portions as a unitary element and then severing the element to provide the top and bottom portions of the liner. The three-piece construction is advantageous from the standpoint of economy in manufacturing and testing of the bucket, and durability and reliability in service.
U.S. Pat. No. 3,695,390, issued to Leigh on Oct. 3, 1972 entitled Aerial Lift with Workman's Basket with Protective Covering. The abstract provides the following information. Aerial lift with workman's basket with protective covering having a boom structure, the outer end of which can be raised and lowered about a horizontal axis, rotated about a vertical axis and moved toward and away from the platform carrying the boom structure. A workman's basket having an upper open end is mounted adjacent the outer end of the boom structure. Support means is secured to the basket and includes an arm which is cantilevered over the upper end of the basket. A removable canopy is provided and means is provided for securing the canopy to the arm so that the canopy overlies and is spaced above the upper open end of the basket and means is provided for removably securing the canopy to the upper end of the basket for enclosing the space between the canopy and the upper end of the basket whereby workmen in the basket can be protected from the sun and inclement weather.
U.S. Pat. No. 5,611,410, issued to Baillargeon on Mar. 18, 1997 entitled Aerial Platform Enclosure Apparatus. The abstract provides the following information. An aerial platform utility enclosure designed to be easily installed upon an unenclosed aerial platform bucket. The enclosure protects the worker from environmental elements without reducing visibility out of the bucket because a polycarbonate plastic such as LEXAN is used to cover the entire enclosure. Upper and lower structural components of the enclosure are constructed out of a non-conductive material. The lower structural component is firmly attached to the bucket while rotation of the upper structure and the protective cover in a full circle allows the worker to have greater access too his surroundings without having to reposition the bucket.
U.S. Pat. No. 6,361,003, issued to Keoun on Mar. 26, 2002 entitled Aerial Bucket Support Apparatus. The abstract provides the following information. An aerial bucket support apparatus is comprised of a contoured support portion, for receiving and supporting an aerial bucket operator, and an attachment portion, for attaching to a wall of the aerial bucket. The aerial bucket support apparatus provides support to an operator when the operator may lean against the aerial bucket walls, providing more comfort and providing additional safety. The aerial bucket support apparatus can also include a recessed portion for housing tools.
Thus, it may be seen that these prior art patents are very limited in their teaching and utilization, and an improved safety device is needed to overcome these limitations.


A peripheral interface system and apparatus including a pair of integrated circuits, referred to as a system adapter and a socket controller, use a communication protocol, referred to as a windowed-interchip-communication protocol, to interface peripherals, such as PCMCIA cards or infrared devices, and other subsystems having different formats with a CPU system bus. The system adapter communicates to a hard disk drive subsystem using the ATA communication standards to interface an ATA hard disk drive with the CPU system bus. Communication between the system adapter and the socket controller, which communicates with PCMCIA peripheral cards and IR peripherals, is accomplished using the windowed-interchip-communication protocol which may share hardware resources with other communication protocols. Communication between the system adapter and the hard disk drive and between the system adapter and the socket controller may be provided on the same chain of a standard 40 signal ribbon cable. Alternatively communication between an expansion board and a socket controller may be performed across a cable separate from the hard disk drives having a different signal line format. The system adapter may be included within a single interface expansion board which can be connected to the motherboard and CPU system bus or it can be directly connected or soldered to the motherboard and communicate with the socket controller and ATA hard disk drives using one or more busses.

Modern digital systems such as the system 101 illustrated in FIG. 1A typically include multiple integrated circuits on multiple printed circuit boards. The system 101 is a desktop computer which includes two ATA-type disk drives 114 and 115 and two Personal Computer Memory Card International Association (PCMCIA) expansion slots or sockets 116 and 117. PCMCIA is a standard interface and specification to allow PCMCIA cards such as 122 and 123 to vary the capabilities of a computer system or other electronic equipment. The PCMCIA cards consist of a connector that interfaces to a printed circuit board that is approximately the size of a credit card. The main printed circuit board or motherboard 100 includes the central processing unit (CPU) 140, which is the heart of the computer system 101 and controls the operations of the system, and also the internal system memory 142. The CPU 140 is coupled to the system memory 142 and the other integrated circuits on the motherboard 100 by the core logic 143. As peripherals or subsystems such as the disk drives 114 and 115 are added to the system 101, interface boards such as the board 104 are coupled to the motherboard 100 and to the system bus 146. This interface board 104 is also coupled to the disk drives 114 and 115 by a cable 110 which allows the interface board 104 to communicate with the disk drives 114 and 115. The interface board 104 includes the ATA host adapter integrated circuit 108 which serves as the interface and controls communications between the disk drives 114 and 115 and the CPU system bus 146.
In systems of the prior art, as additional peripherals such as the PCMCIA expansion slots or sockets 116 and 117, are added to the system, an additional interface board 102 must be coupled to the motherboard 100 to serve as the interface and control communications between the PCMCIA expansion slots 116 and 117 and the bus 146. The bus 146 has a differing number of address and data lines as compared to the PCMCIA address and data line requirements. Data transfers across bus 146 are at a different rate than the data transfer to a PCMCIA card. Other control signals are also required at the PCMCIA interface in order to adapt to the various needs of differing PCMCIA cards that may be inserted. Thus the PCMCIA interface is very flexible and the PCMCIA adapter 106 is used to interface differing data and address line requirements having different transfer rates between the system bus 146 and PCMCIA cards 122 or 123. The interface boards 102 and 104 are typically coupled to the motherboard 100 by inserting them into receiving slots on the motherboard 100. Because there is limited space within the computer system case and the number of receiving slots on the motherboard 100 is also typically limited, only a finite number of interface boards can be coupled to the motherboard 100, thus restricting the number of peripherals which can be coupled to the computer system 101 at any one time.
The disk drives 114 and 115 illustrated in FIG. 1A are ATA (Advanced Technology Attached) hard disk drives. ATA hard disk drives may also be commonly referred to as IDE (Integrated Drive Electronics) hard disk drives. ATA is a set of standards and specifications used for communications between disk drives and host central processing units which defines an integrated bus interface between disk drives and host CPUs and provides a common point of attachment for system manufacturers, system integrators and suppliers of intelligent peripherals. The ATA standard interface having 40 total lines, includes a three-bit address bus designated as DA0, DA1, and DA2 used for indexing drive registers; a 16 bit bidirectional data bus designated as DD0 through DD15; a data width format signal designated as IOCS16- indicating either an 8 or 16 data bit capability, a write strobe signal designated as DIOW-; a read strobe signal designated as DIOR-; an interrupt request signal INTRQ, a status signal I/O Channel Ready designated as IORDY, and host chip select 0 and 1 signal lines respectively designated as CS1FX- and CS3FX-. The two host chip select signal lines CS1FX- and CS3FX- which act similar to an address line, select access of either Command Block registers or Control Block registers within an attached ATA disk drive. Other signals present within the ATA standard interface that may be significant to the description of the present invention will be described below. The complete ATA standard interface and communication standard is described within the APPENDIX 1 "Information Technology--AT Attachment Interface for Disk Drives".
The disk drives 114 and 115 may be designated disk drive 0 and disk drive 1 by the ATA cable connection for the ATA standard interface signal CSEL (ground=drive 0, open=drive 1) or by setup switches or jumper wires within the disk drive electronics that are read upon reset. Only one of the disk drives 114 or 115 connected to the same ATA cable 110 can be accessed at any one time. The selection of whether disk drive 0 or disk drive 1 is to be accessed is controlled through use of the drive/head register which is embedded in each disk drive. Both disk drives 114 and 115 simultaneously respond to writes on the cable to the drive/head register, however only the selected drive will respond to writes to other registers therein. Bit 4 of each drive/head register, designated DRV, is used to select the drive that should be active to receive the other drive register accesses and is compared by the drive with its CSEL or switch/jumper configuration as drive 0 or drive 1. If the host CPU sets DRV to zero then drive 0 is selected and further register accesses are to drive 0 registers. If the host CPU sets DRV to one then drive 1 is selected and further register accesses are to drive 1 registers.
Accesses to the disk drives occur during cycles such as those illustrated in FIG. 1D as either ATA read cycles 190 or ATA write cycles 191. Note that during all ATA read or write cycles either a CS1FX- or CS3FX- signal becomes active as illustrated by the CS1FX-/CS3FX- waveform 181. Activation of CS1FX- or CS3FX- is then followed by either DIOR- active low signal or DIOW- active low signal as represented by the DIOR- waveform 182 or the DIOW- waveform 183. If neither CS1FX- nor CS3FX- is active then no write or read operation is being performed to the disk drives regardless of the condition of other signals on the ATA cable 110 including DIOR- and DIOW- as illustrated by the ATA NOOP cycles 192 and 193.
If a read or write host CPU transfer cycle to or from the ATA drive needs to be extended then the ATA drive de-asserts the IORDY signal inactive low. This indicates that the selected hard disk drive needs further time to complete the present operation before any other operation may take place. Otherwise IORDY is pulled up to an active one or an active high level by a pullup resistor.
The PCMCIA expansion slots 116 and 117 illustrated in FIG. 1A are two typical implementations of sockets, also referred to as slots, into which a PCMCIA card 122 or 123 can be inserted. The PCMCIA standard enables memory and I/O devices to be inserted as exchangeable peripherals into electronic devices through a standard interface. A PCMCIA card 122 uses this standard interface, allowing PCMCIA interfaced peripheral devices such as a modem card, a network card, a sound card, a floppy disk drive, a hard disk drive, or other cards to be plugged into the system computer by means of their embodiment in a PCMCIA card 122. This PCMCIA card 122 is plugged into a PCMCIA expansion slot 116 which is coupled to a PCMCIA host adapter integrated circuit 106 within the computer system 101. The operation of the PCMCIA expansion slot 116 is controlled by the PCMCIA host adapter integrated circuit 106. The PCMCIA bi-directional buffer 120 is coupled to the PCMCIA expansion slot 116 through the bus 124. The PCMCIA bi-directional buffer 120 is coupled to the connector 128 by the bus 126. The cable 112 is coupled to the connector 128 and to the connector 130. The connector 130 is coupled to the PCMCIA host adapter integrated circuit 106 by the bus 138.
A second type of PCMCIA expansion slot 117 is also shown in the computer system 101 and coupled to the PCMCIA host adapter board 102. The second PCMCIA expansion slot 117 is coupled to the termination circuit 121 by the bus 125. The circuits 120 and 121 can be either bi-directional buffers or simple termination circuits. The termination circuit 121 is coupled to the connector 129 by the bus 127. The connector 129 is coupled to the cable 113 which is in turn coupled to the connector 131. The connector 131 is coupled to the PCMCIA host adapter integrated circuit 106 by the bus 139. The first and second PCMCIA expansion slots 116 and 117 are designed to function identically but may provide differing voltage settings and timing parameters.
The ATA standard interface is not compatible with the PCMCIA standard interface in that a PCMCIA device cannot be coupled to a system through an ATA port, even if the differing connector types were not a problem. Correspondingly, a user cannot couple a standard ATA device, such as the disk drives 114 or 115 to a system through a PCMCIA port. However, there is a method of interface described by the ATA SFF (Advanced Technology Adapter Small Form Factor) committee to connect ATA devices packaged in a PCMCIA form factor to PCMCIA socket connectors. This allows an ATA disk drive to be mechanically arranged into a PCMCIA card form factor and designates how the ATA signal lines may be arranged within the card's PCMCIA connector. However, the ATA SFF interface to a PCMCIA socket connector does not support system identification of installed drives and will not work for devices other than ATA SFF packaged disk drives. Due to the limited applicability, the ATA SFF interface method is not supported in many machines which offer PCMCIA card support. For the reasons discussed above, it is preferable to use the more flexible PCMCIA standard because it can interface to a wide variety of peripheral devices including a disk drive interface and because it simplifies the interface.
A second desktop computer system is illustrated in FIG. 1B. The only difference between the system of FIG. 1A and the system illustrated in FIG. 1B is that within the system of FIG. 1B, a single cable 170 is coupled between the PCMCIA host adapter board 102 and the two PCMCIA expansion slots 116 and 117. Cable 170 is a wider cable than cables 112 and 113 of FIG. 1A, carrying a greater number of signal lines to support two PCMCIA expansion slots 116 and 117. Due to the increased number of signal lines, cable 170 and connectors 172 and 133 are more costly than cable 112 or 113 and connectors as illustrated in FIG. 1A. The cable 170 is coupled to the connector 133 and to the connector 172 on the PCMCIA expansion board 178. The connector 133 is coupled to the PCMCIA host adapter 106 by the busses 138 and 139. The connector 172 is coupled to a termination or buffering circuit 176 by the bus 174. The termination or buffering circuit 176 is coupled to the first PCMCIA expansion slot 116 by the bus 124 and to the second PCMCIA expansion slot 117 by the bus 125.
A portable computer system 161 is illustrated in FIG. 1C. The portable computer system 161 includes an ATA compatible disk drive 114, a modem 157 and two PCMCIA expansion slots 116 and 117. Because this is a portable computer system, the integrated circuits such as the ATA host adapter 108 and the PCMCIA host adapter 106 are integrated onto the motherboard 160 instead of coupled through receiving slots as in the desktop system discussed previously. The modem 157 is coupled to a Universal Asynchronous Receiver/Transmitter (UART) through a cable 158 and a bus 155. The UART 154 is also coupled to the system bus 146. The modem 157 is also coupled to a phone jack 156 for coupling the modem to a phone line.
The graphics controller 144 of the portable computer system 161 is coupled to the system bus 146 and to the display used by the portable computer system 161, by either of the outputs 150 or 152. If the display used by the portable system 161 is a CRT display then the RGB output 150 of the graphics controller 144 is coupled to the display. If the display used by the portable system 161 is a flat-panel display then the flat-panel output 152 of the graphics controller 144 is coupled to the display.
While in the systems illustrated in FIG. 1A, 1B and 1C, ATA compatible peripherals and PCMCIA compatible peripherals have been illustrated and described, peripherals of many different formats can be coupled to systems of the prior art in this same fashion. For example, printers, modems, fax boards, digitizers, scanners and other types of peripherals can be included in a computer system by coupling an expansion board similar to the boards 102 and 104 to the motherbcard 100 in desktop systems or integrating additional integrated circuits onto the motherboard 160 for portable computer systems. However, as stated above, the number of peripherals which can be coupled to a computer system at any one time is limited to the amount of space within the computer case and the specific limitations of the motherboard 100. The cost of adding peripherals is also related to the number and size of the chips required to add those peripherals as well as the size and number of cables.
What is needed is an apparatus which allows multiple peripherals of differing formats to be coupled to the motherboard 100 by a single expansion board or a single integrated circuit interface. What is further needed is an apparatus for coupling multiple peripherals to a single expansion board or a single integrated circuit interface using a single cable or connector. What is also needed is an apparatus which will use more efficiently the finite space within a computer system case and allow a greater number of peripherals to be coupled to a computer system. What is needed is an apparatus which will use low cost standard cabling and connectors having a low signal line count in order to provide for the most economically efficient method of supporting an increasing number of peripheral devices within a computer system.

Method and apparatus for interfacing between peripherals of multiple formats and a single system bus


One embodiment of the method includes allocating, using a network management entity, at least one of a plurality of physical resource blocks (PRBs) of a first wireless access technology for utilization by a second wireless access technology. A spectrum of the first wireless access technology is embedded within a spectrum of the second wireless access technology. The method further includes communicating, using the network management entity, a message to a controller of the first wireless access technology identifying the PRBs not allocated for utilization by the second wireless access technology.

In an attempt to address a growing demand for global mobile data traffic, one proposed solution has been to deploy what is known as small cells, which involve an isolated or clustered deployment of low powered base stations in footprints of macro cellular networks such as GSM based macro cellular networks. With Long Term Evolution (LTE) becoming a key standard for high speed data services in cellular networks, deployment of LTE small cells has proven to be an efficient and inexpensive way to address the growing demand for mobile data traffic.
However, a problem with introducing LTE small cells in footprints of macro cellular networks, meaning having both the small cells and a macro cellular network use the same frequency spectrum, is a resulting interference occurring between signals transferred between user equipment (UEs) operating based on the LTE technology and those that operate based on a technology of the macro cellular networks. This interference in turn results in degraded communication between UEs of each technology.
One solution to address the problem of interference has been to deploy the two technologies in separate spectrums. However doing so requires additional dedicated spectrums for the small cells, which given the ever increasing scarcity of wireless communication resources, is not a desirable solution.
An alternative solution has been to refarm a spectrum used by a macro cellular network, in particular, spectrum in use by an older generation macro cellular network, to allow one or more small cells deployed within a coverage area of the macro cellular network to also use portions of the same spectrum for transmitting signals. In doing so, a concept of frequency partitioning has been introduced. This concept is based on the idea that as demand for older technologies such as Global System for Mobile (GSM), based on which macro base stations of cellular networks operate diminishes, more and more of GSM's spectrum may be allocated for utilization by small cells such as LTE smalls cells deployed within the coverage area of the macro cells. Frequency partitioning, also known as Static Spectrum Refarming (SSR), allows for the configuration of the LTE smalls cells to occupy a determined portion of the macro cell's spectrum and thus UEs operating based on the technology of the macro cell can avoid using frequency channels of the spectrum occupied by the LTE small cells.
However, this approach incurs inefficiencies with regard to optimal utilization of the spectrum. LTE systems are deployed in bandwidths of 1.4 MHz, 3 MHz, 5 MHz, 10 MHz, 15 MHz and 20 MHz. FIG. 1 illustrates refarming of a GSM spectrum according to a static spectrum refarming method known in the Prior Art. As shown in FIG. 1, there is a 10 MHz spectrum 101 available for use by the technology of the macro cell, i.e., GSM technology. Only 2.4 MHz of spectrum 102 is needed to satisfy the demand of GSM based UEs, owing to diminished capacity requirements. Given the limitations on bandwidths in which LTE systems can be deployed, of the 7.6 MHz of spectrum left unused, LTE system are deployed in either the 1.4 MHz, 3 MHz or 5 MHz. Deploying the LTE system in the 5 MHz spectrum results in, as can be seen from FIG. 1, 3.6 MHz of unused bandwidth 104 that is simply going to be wasted.

Methods and systems for GSM spectrum refarming for LTE small cells


A plasma display apparatus includes a plasma display panel and a chassis base extending substantially parallel to the plasma display panel. The chassis base has a driving circuit mounted thereon in opposition to the plasma display panel. A driver IC faces the chassis base, and is packaged in a film-shaped assembly. A thermal conduction medium is disposed and solidified between the driver IC and the chassis base so as to dissipate the heat generated at the driver IC.

1. Field of the Invention
The present invention relates to a plasma display apparatus and, more particularly, to a plasma display apparatus having a heat dissipating structure for a driver integrated circuit (IC).
2. Description of Related Art
Generally, a plasma display apparatus has a plasma display panel for displaying the desired images based on the plasma generated due to gas discharge. The electrodes provided at the plasma display panel are electrically connected to a driving circuit, and a driver IC applies address voltages to the electrodes in accordance with the signals controlled at the driving circuit.
Among voltage application structures using a driver IC, there are a chip on board (COB) structure wherein the driver IC is mounted on a printed circuit board (PCB), and a chip on film (COF) structure wherein the driver IC is directly mounted on a flexible printed circuit (FPC) formation film. Recently, a small-sized and low cost tape carrier package (TCP) has been extensively used as the voltage application structure.
Meanwhile, in order to express 256 grays or more with a plasma display panel, at least eight-timed address discharges should be made for 1/60 second corresponding to the one TV field, and hence, much heat is generated in the COF, the COB or the TCP structures mounted on the chassis base.
Accordingly, a reinforcing plate is provided at the COB or the COF structure to reinforce its structural intensity and fix it to the chassis base. The reinforcing plate has the further role of a heat sink to dissipate the heat generated at the IC to the exterior.
Meanwhile, in order to dissipate the heat generated at the driver IC of the TCP structure, a liquid or gel-typed thermal conduction medium is disposed between the driver IC and the chassis base to transfer the heat to the chassis base.
However, with respect to the plasma display apparatus with the above heat dissipating structure, when it is checked or repaired, the thermal conduction medium is diffused toward the periphery of the driver IC to thereby form a predetermined gap between the driver IC and the chassis base. Accordingly, the heat conducted from the driver IC via the thermal conduction medium is not efficiently transferred to the chassis base due to the gap between the driver IC and the chassis base so that the heat at the driver IC is not dissipated.

Plasma display apparatus having heat dissipating structure for driver integrated circuit


The disclosure of the current invention describes the methods and systems for inputting and outputting to and from the large capacity memory cards which are used as external data storage and expanded random access memory.

As the use of personal computers became versatile, the memory size requirements have increased. Not only the physical but also external memory such as a floppy disk is required to hold mega bytes of information. However, the certain use of computer graphics and high-fidelity audio in the multi-media computing requires an even larger memory capability in memory devices. For example, a CD-ROM (Compact Disk Read Only Memory) disk stores approximately 600 mega byte of data. Other large capacity memory media include DVD (Digital Video Disk) for storing animation data, a DAT (Digital Audio Tape) for storing digital audio and a MD (Mini-Disk) for storing digital data.
To use these different media, a specific input and output (I/O) device is necessary for each medium. For example, a CD-ROM drive is required to access data stored on a CD-ROM while a DVD drive is necessary to access data from a DVD. In addition to these specific hardware, specific software interface is also necessary. As the term multi-media indicates, the various I/O devices and interfaces are unavoidable in a certain computer systems, and these specific I/O devices add complexity to a computer system.
In addition to the specific I/O requirements, the above described media also have various data formats. The same information is stored in a different format based upon a medium where the information is stored. Furthermore, to make the matter more complicated, within the same application area such as computer graphics, even if the same medium is used, there are numerous data formats to store the same graphic image. Although various data formats are not always easy to manage, conversion programs generally allow sharing of the same data.
In order to eliminate the above described problems associated with the multi-media, a single memory medium has been considered. Such a memory medium has to offer a number of advantages including a large memory capacity, fast access, flexibility and versatility. In view of these considerations, a PC memory card has great potential for the above enumerated desirable characteristics.
Among other things, PC cards have the following advantages when they are used as memory cards: Firstly, the memory cards do not require a specific I/O drive. This is a significant advantage since a memory card does not require any substantial mechanical parts such as a motor and a movable head. Because of the motor less access, many control mechanisms are also unnecessary. Secondly, because no head contacts the memory storage surface, the medium is free from mechanical damage. Thirdly, the memory access is faster since no moving part must be physically moved to access a certain portion of the memory. Although no single memory card does not yet have the memory capacity comparable to a CD-ROM, the memory capacity limitation of a memory card has been steadily improved. For example, the use of bear memory chips helps the chip density on a memory card, and the memory capacity of a memory chip is currently increasing at a rate of four times every three years.
The use of the PC cards have steadily increasing with portable computing. Some commercially available PC cards are used as a portable data storage unit. For example, the memory is a ROM for storing information such as fonts for printers and audio such as music as disclosed in Japanese Patent 59-92482. Other commercially available PC cards are used as devices rather than a memory storage. For example, fax modem cards or communication cards have been widely used for Internet access.
To support the above described various functions performed by the PC cards, Japanese Utility Model Patent 2-110098 discloses that each PC card has two separate memory areas. One is a general purpose area where program code or data is stored to perform a predetermined function. The other memory area is an attribute or configuration memory area where information or identification of the card is stored, and the attribute memory area is accessible only when a predetermined signal is enabled. The above described two-memory area configuration is standardized in the interface protocols such as PCMCIA (Personal Computer Memory Card International Association), JEIDA (Japanese Electronics Industry Development Association) as well as PC Card Standard (1995), which is jointly developed by PCMCIA and JEIDA. Also, see "A Summary of the Most Recent PC Card Standard" in Japanese, PP89-95, Interface, June, 1995. The two independent memory design is not efficient way of managing input/output of these PC cards especially when a plurality of memory cards is to be managed. Furthermore, the same address value is not unique in the above two-tier memory design. Depending upon the status of the predetermined signal, the same address resides in either of the two address areas. These address related issues are particularly important when a PC card is used as an expanded RAM device or a ROM data storage device.
To solve the above and other problems and improve the management of the PC cards, there has been a need for efficient memory card management systems and methods.

System for detachably connecting memory cards which provide memory specified by predetermined range of addresses registered in list and updating list independent of the I/O operation


Provided are SARS-CoV detection PCR primers having nucleotide sequences as set forth in SEQ ID NOS: 1-46, a method for detecting SARS-CoV using the primers, and a SARS-CoV detection kit including the primers.

1. Field of the Invention
The present invention relates to PCR primer sets for detecting severe acute respiratory syndrome (SARS) virus, a method and a kit for detecting SARS virus.
2. Description of the Related Art
Severe acute respiratory syndrome (SARS) virus is a new type of coronavirus and is designated as SARS-Coronavirus (hereinafter, referred to as "SARS-CoV") by the World Health Organization (WHO). It is known that SARS-CoV gives rise to severe acute respiratory syndrome. SARS-CoV is a novel RNA virus. It is known that the whole genome sequence of SARS-CoV consists of about 29,730 bp and the genetic makeup is similar to those of other types of coronaviruses.
The WHO reported guidelines for laboratory diagnosis of SARS as follows: (a) antibody test: identification of SARS-CoV antibody in serum after one day, (b) PCR (Polymerase Chain Reaction) test: identification of SARS-CoV RNA by PCR, and (c) virus separation: separation of SARS-CoV.
In a conventional PCR test, the following six types of primers are used for detection of SARS-CoV:                (1) BNIoutS2: SEQ ID NO: 29 (24mer); BNIoutAs: SEQ ID NO: 30 (21mer), BNIinS: SEQ ID NO: 31 (20mer); BNIinAs: SEQ ID NO: 32 (22mer),        (2) SAR1S: SEQ ID NO: 33 (21mer); SAR1As: SEQ ID NO: 34 (21mer),        (3) Cor-p-F2: SEQ ID NO: 35 (21 mer); Cor-p-R1: SEQ ID NO: 34 (21 mer),        (4) Cor-p-F3: SEQ ID NO: 35 (21mer); Cor-p-R1: SEQ ID NO: 36 (21mer),        (5) COR-1: SEQ ID NO: 37 (26mer); COR-2: SEQ ID NO: 38 (26mer),        (6) HKU (sense): SEQ ID NO: 39 (17mer); HKU (antisense): SEQ ID NO: 40 (16mer).
Among them, the primers of (1), which were developed by Bernhard-Nocht Institute (BNI, Germany) for diagnosis of SARS generated in early 2003, have been most widely used. However, only a local region, i.e., a polymerase gene region, of the whole genome sequence of about 30 kb of SARS-CoV, is used as a target site of currently known primers. Such a narrow application site may lead to either false negative or false positive results.
In view of these problems, the present inventors found SARS-CoV-specific primers which reduce a likelihood of being determined as false negative or false positive and rapidly detect SARS-CoV in situ after rapid PCR, and completed the present invention.

PCR primer set for detecting severe acute respiratory syndrome (SARS)-Coronavirus, method and kit for detecting SARS-Coronavirus using the same


An optical fire detector employs two or more sensors operating a different spectral bands. The spectral bands are selected to have approximately coincident cut-off wavelengths in order to make the detector's ability to positively identify a fire more uniform over its field of view. The use of three overlapping spectral bands provides the detector with enhanced detection capabilities for large, hot fires that behave like black body radiators.

The present invention is directed generally to a method and apparatus for detecting fires, and particularly to a method and apparatus for optically detecting fires using a combination of two or more wavelengths.
It is important that an optical fire detector is able to detect the presence of various types of flame in as reliable a manner as possible. This requires that the flame detector can discriminate between flames and other sources of infrared radiation. Commonly, optical flame detection is carried out in the infrared portion of the spectrum at around 4.5 .mu.m, a CO.sub.2 emission peak.
Simple flame detectors employ a single sensor, and a warning is provided whenever the signal sensed by the detector exceeds a particular threshold level. This simple approach suffers from false triggering, because it is unable to discriminate between flames and other bright objects, such as incandescent light bulbs, hot industrial processes such as welding, warm hands waved in front of the detector, and even sunlight.
Attempts have been made to overcome this problem by sensing radiation at two or more wavelengths. A comparison of the relative strengths of the signals sensed at each wavelength permits greater discrimination over false sources than when sensing at only a single wavelength.
Despite the implementation of detectors sensitive to radiation at more than one wavelength, optical detection techniques for detecting the presence of flames are still subject to high rates of false alarms, and misdiagnosis of true fires. For example, there is a difficulty in producing true alarms when monitoring fires at a long distance from the detector, say up to approximately 200 feet, when the signal to noise ratio is small. Also, fire detectors suffer from an inconsistency in fire detection characteristics under different fire conditions, for example fire temperature, size, position, fuel, and interfering background radiation. Consequently, there is a need for a fire detector whose ability to detect fires is less dependent on these factors.

Fire detection method and apparatus using overlapping spectral bands