A computerized method and system for combined billing for at least one customer on a plurality of customer accounts includes computer applications which automatically assemble and aggregate account charges, such as usage charges, fees, finance charges, discounts, rebates and rewards, for the customer on the plurality of accounts. The system also automatically formats a combined bill for the customer from the aggregated account charges and renders the combined bill to the customer. The account charges are automatically calculated by a computer application from account data for the customer's accounts, which is transmitted to the computer application from one or more storage devices, for example from vendors of energy, such as electricity and gas service, retail, such as credit cards, and communications, such as telephone and Internet service.

On the whole, the credit card industry is losing its return on equity. In 1990, credit card providers, as a whole, were making about three percent return on assets after tax. Just eight years later, the return on equity was little more than one percent. During the same period of time, the number of credit card providers in the marketplace shrank from about 6,000 to only about 3,000. Thus, there are fewer and fewer players with lower and lower return on assets, and the trend appears likely to continue in the future. Credit card providers make revenue and have expenses that are primarily associated with three types of costs: cost of funds, cost of losses (bad debts), and operating costs. During the current period, the revenue of credit card providers continues to decline. In 1990, a consumer could obtain a credit card as long as he or she was willing to pay an interest rate of, for example, 19.8 percent with a $20 annual fee. Eight years later, there were a wide variety of prices, and the return on assets from the revenue that credit card providers were receiving continued to decline. Concurrently, the marketing to offer new credit cards to consumers increased from 500 million in 1990 to over three billion pieces of mail in 1997. This expansion of available credit for consumers added to mounting bad debt problems in the industry and record numbers of consumer bankruptcy filings.
Therefore, in order to make money, it is necessary for credit card providers to devise a way to lower infrastructure cost. A credit card provider has little control over its cost of financing. Therefore, the credit card provider must look at operating cost and endeavor to think creatively on how it can reduce such costs in order to give itself a strategic cost advantage. One possible way to reduce cost is to reduce the level of customer service, which would likely create dissatisfied customers. A far more attractive way to reduce cost is to leverage services over a bigger infrastructure, for example, by combining billing with multiple providers of goods and/or services. An attractive market to target is industries that provide recurring services, and statements, to the consumer. These are industries such as telephony, insurance/annuities, cable/pay television, the energy markets (gas, water, and electricity), and home security. Service providers such as energy companies are shifting to a deregulated industry like that of the airline, financial and long distance telecommunications industries. Customers are able, or will be able, to choose from a wide variety of marketing entities which will provide their electricity. This choice encourages energy service companies to add value to their offering by lowering cost and developing new products and services and, in a sense, competing to be a full home services provider.
The electric and utility industries have annual revenues which exceed the yearly revenue of the long distance telecommunications industry and the local phone market, and these industries together have combined revenues that come close to rivaling the overall sum spent on all general purpose credit cards. Proposed deregulation includes, for example, the creation of non-profit corporations in charge of buying power from current monopoly power companies and for monitoring the transmission of power throughout a state, as well as the restructuring of utility companies to become local power distribution companies. In other words, under proposed deregulation, energy companies move away from vertical integration and divide the functions of generation (i.e., managing power plants to produce electricity); transmission (i.e., moving electricity from the power plant to the factory, office, or home); distribution (i.e., retailers marketing to the public); and marketing (i.e., selling electricity and the services associated with it to end users and maintaining the customer relationship). Similar to other deregulated industries, increased market competition and the ability for customers to select from multiple energy providers poses a great risk for energy companies, for example, in loss of share and increased losses. Deregulation opens opportunities for credit card providers, as well as for energy providers. Credit card providers increased overall card usage from 11% of all transactions in 1980 to 17% in 1998. Utility payments provide another way of increasing that percentage.
In fact, it is estimated that the market size of the recurring bill market rivals the one trillion dollars spent annually on all credit cards in the U.S. There is a current need to provide a computerized system for combined billing of multiple vendor statements for a customer—for example, telephony, energy, cable, water, home security, and gas—on a single statement, in order to take advantage of the recognized competencies of credit card providers for marketing, receivable management, risk management and statementing, to reduce those risks to the recurring bill providers.

Method and system of combined billing of multiple accounts on a single statement


In a method for responding to a denial of service attack at a higher layer of a communication network, said communication network also having a lower layer beneath the higher layer for receiving packet information from users, providing a packet filter inspection layer between the higher layer and the lower layer. By use of an application layer which is associated with or comprises said higher layer, creating a rule in the packet filter layer to identify a likely denial of service attack. By use of the packet filter inspection layer, inspecting incoming packet information to determine whether it is a likely denial of service attack, and if it is stopping the incoming packet information from being sent to the application layer. After a predetermined time period, stopping use of the rule to prevent packet information from being sent through to the application layer.

Attacks on Internet communication networks known as a "Denial of Service" (DoS) attacks are a serious problem. Examples of some widely known DoS attacks are Teardrop, TCP SYN Flood, Smurf, Buffer Overflow etc. Each of these attacks can be mapped to one of the seven layers of the OSI model: By way of background, the "Open Systems Interconnection" protocol (OSI) comprises a seven layer model: Application (layer 7); presentation (layer 6); session (layer 5); transport (layer 4); network (layer 3); data link (layer 2); and physical (layer 1). The Teardrop attack targets the Network Layer, TCP SYN Flood and Smurf attacks target the transport Layer. Some buffer overflow attacks target higher layer protocols. In "Voice over Internet Protocol" (VoIP) systems, an attack could occur at the higher session layer utilizing vulnerabilities inside "Session Internet Protocol" (SIP), H.323, MGCP, or Megaco etc. The attack could also occur at the higher application layer. We will take SIP as an example: An attack on the session and application layers using SIP may comprise the following scenarios. SIP packets are received from an SIP entity or a group of SIP entities:                where packets are malformed; i.e., they are not formed in accordance with well known, expected and legal SIP grammar (session layer);        packets contain SIP headers or body types or parameters which are legal but which exploit a vulnerability on an end point or server to which they are directed (session layer);        SIP registrations may come from attackers which tend to steal services from legitimate subscribers or devices (application layer);        packets may simply be sent at a higher rate to exhaust either the intermediate servers or the end devices which are targeted (session layer).
For VoIP, so-called "user agents" (UA) operating at the application layer send and receive information packets by use of the Session Internet Protocol (SIP), H.323, MGCP, Megaco etc. SIP is by far the most commonly used protocol for VoIP based communications.
Current solutions for DoS attacks implement network and/or transport layer 3/4 based solutions for VoIP and other application traffic. However, in most cases, existing layer 3/4 systems to prevent DoS attacks may not be able to thwart the attack since the attack is not "visible" at the L3/L4 level (e.g. SIP and SDP based applications operates at the session layer 5 and above). Most attacks may not show a pattern at layer 3 and 4 or may not be detectable as a packet rate based attacks. Also, the L3/L4 address may be variable while the session layer and application layer identity (like username/password) indicated hereafter as the Address-of-Record (A-O-R)) may be the same. For example, the attacker may move frequently in the network across wireless hotspots and issue the same attack from different L3/L4 domains
An attacker may also launch a multitude of rate based attacks from mobile locations. Only the application layer has the information which L3/L4 identities have been authenticated. A simple L3/L4 based solution would allow the attacker to steal scarce network resources from authenticated users. An extreme example is an E911 DoS Attack, where the attacker sends packets which look like emergency calls to the server and a Public Safety Access Point (PSAP) to inundate them with fake calls. The system may thus be unable to process valid E911 calls from a real disaster zone.
In another scenario, a legitimate user may be unaware of bugs or viruses in a software he/she downloads from the Internet. The attacker may send traffic towards another user in a P2P (peer-to-peer) session, which may crash or cause unpredictable behavior on the peer user. The downloaded software may be authentic or may have been compromised.
In the above, a situation has been described in which it is not possible to pin the attacker to a unique L3/L4 address because the attacker may be mobile.
There is another case when it is hard to pinpoint a unique association between the attacker and a L3/L4 address. For example, an attacker who hacks into a VoIP "Private Branch Exchange" (PBX) and assumes the identity of one or more users by gaining access to their user ID and password. The attacker then initiates the attack by mixing malicious calls among authentic calls. Such an attack cannot be prevented simply by a L3/L4 based solution without blocking service to the entire set of users behind that PBX (thus denying service as well). Thus previous layer 3/4 solutions can be ineffective and impractical.

Method for responding to denial of service attacks at the session layer or above


A method of obtaining and geo-registering an aerial image of an object of interest is provided. The method includes obtaining an aerial image and accessing an object detection model trained using a machine learning algorithm. The method includes training set of aerial images of an object of interest, and using the object detection model to detect the object of interest in the aerial image. The object detection includes a prediction of a boundary of the object of interest depicted in the aerial image based on the defined boundary of the object of interest. And the method includes geo-registering the aerial image including the prediction of the boundary of the object of interest with a geographic location of the object of interest.

In many industries, it is often desirable to extract meaningful information from images to provide an understanding of the objects depicted in the images. For example, aircraft such as unmanned aerial vehicles (UAVs) or other remotely piloted vehicles, autonomous airborne vehicles or the like, may carry cameras for capturing aerial images for inspection, survey and surveillance of objects depicted in the images. These aircraft often also geo-register aerial images with the geographic locations of objects of interest depicted in the images, many employing cameras equipped with Global Positioning System (GPS) receivers to determine geographic location. But because of the high altitude and speed of the aircraft, the geographic location provided by many of these GPS receivers is often inaccurate, some resulting in a shift in geographic location of an object by as much as 10-20 kilometers compared to a ground survey of the object. It is generally desirable to correct the error in geo-registration of aerial images for accurate inspection, survey and surveillance, but it is difficult to accomplish.
There are approaches to more accurately geo-register aerial images, including those that employ ground control markers. Ground control markers are usually black-white check pattern, painted on paper cardboard, metal sheet or pavement on the ground. The design of markers allows operators to see them with ease from the aerial capture, and input them in a geo-registration tool. But ground control markers require a lot of manual input. A person needs to place the marker at a proper location and record the GPS data. The person also needs to locate the aerial markers after the data capture. It is clearly an expensive and slow process required for each flight.
Other approaches employ image stereo matching in which an oblique image is registered to a previously generated two-dimensional, geo-referenced image. This is also sometimes called geo-registration feature matching. The drawback of this approach is that an already geo-registered reference image is required, which is not always available or easy to obtain.
Therefore it would be desirable to have a system and method that takes into account at least some of the issues discussed above, as well as other possible issues.

This patent is subject to a terminal disclaimer.

Geo-registering an aerial image by an object detection model using machine learning


A connection system for interconnecting various components, such as components of an overhead garage door system, is provided which includes, in one aspect, a first component having a pair of spaced apart hook members, an intermediate guide member and a detent extending from a planar body of the first component. A second component includes a pair of spaced apart apertures which are shaped and aligned to receive the hook members, and an intermediate aperture which is shaped and aligned to receive the guide member upon registration of the first and second components in face-abutting relationship. As the first and second components are translated relative to each other, the detent of the first component engages the intermediate aperture of the second component to thereby establish a connection between the first and second components. Connection of a roller bracket to a door stile of an overhead garage door system is provided by the novel connection system, as well as connection of a door stile to a door panel. In a second aspect of the invention, interconnection of horizontal tracks, vertical tracks and track radiuses is provided by the novel connection system to form continuous door tracks on opposite sides of a door frame.

Overhead garage door systems are widely used in both residential and commercial applications, and are designed to be operated either manually or automatically through a reversible motor. Overhead garage doors typically include a series of interconnected door panels which are connected along their longitudinal edges by one or more hinges to provide pivotal movement of the door panels between vertical and horizontal positions as is known in the art. The door panels typically include a series of roller brackets mounted on opposite sides of the door panels for supporting a series of rollers. The rollers travel in a pair of continuous tracks mounted on opposite sides of a door frame which guide movement of the door panels between the vertical and horizontal positions.
Overhead garage door panels typically include two or more spaced door stiles mounted vertically on each door panel to support various hardware components of the garage door system and to add additional strength and rigidity to the panels. These hardware components may include, for example, hinges for providing pivotal movement at each joint between adjacent door panels, and roller brackets for supporting the rollers which travel within the opposite pair of door tracks. Typically, hinges and roller brackets are attached to the door stiles through fasteners, such as rivets, screws and bolts for example, to provide an interconnection of components which can withstand the load and vibrational forces to which the door panels are generally subjected.
Additionally, the door tracks in which the garage door travels are typically mounted through various bracket and fastener assemblies to a door frame. Each door track includes a horizontal track which extends generally parallel to the garage ceiling and has an integral radius section for guiding movement of the garage door between the horizontal and vertical positions. Each door track further includes a vertical track which is mounted generally parallel to the door frame and which forms a linear extension of the radius section which extends from the horizontal track. Depending on the size of the garage door opening and the available overhead room, different horizontal track radiuses are used to accommodate for different installation requirements. That is, one installation may require a ten inch radius on the horizontal track while another installation may require a twelve or fifteen inch radius. Thus, different configurations of horizontal track, i.e., with an integral ten, twelve or fifteen inch radius, for example, must be properly selected for a particular installation.
Due to the size and weight of the overhead garage door components, and the general complexity associated with their assembly, overhead garage door systems typically are shipped by the manufacturer to a dealer for assembly at a site by a professional installer. It will be appreciated that the amount of parts which needs to be boxed and shipped by the manufacturer, as well as the length of time required for assembly of the overhead garage door system at each site, is affected by the number of mechanical fasteners included in the overhead garage door system. Moreover, the dealer or installer must carry a greater inventory of parts as the number of unique track components and fasteners in the overhead garage door system is increased.
Accordingly, there is a need in the overhead garage door industry for a connection system which provides for rapid interconnection of garage door components in the field with a reduced number of mechanical fasteners required to accomplish the interconnection. There is also a need for a connection system which provides a reliable interconnection of garage door components while the components are subjected to loads and vibrations during use of the overhead garage door system. Additionally, there is a need for a connection system which is suitable for overhead garage door systems which is relatively easy to manufacture without requiring the formation of complicated mechanical fastening structures on the individual garage door components to provide the interconnection. Moreover, there is a need for an overhead garage door connection system which easily accommodates for changes in the configuration of the garage door system at the installation site.


An apparatus adapted to a film cartridge comprises an engaging portion which engages with the film cartridge being loaded into a cartridge chamber, a guiding portion which guides the engaging portion such that the engaging portion which has engaged with the film cartridge makes movement of at least one of rotation and sliding, and a switch which operates in response to the movement of the engaging portion.

1. Field of the Invention
This invention relates to an arrangement for detecting a film cartridge being loaded into a cartridge chamber.
2. Description of Related Art
With regard to a film cartridge of a so-called thrust type having no leader part of film left outside of the film cartridge, an arrangement for detecting the position of the film cartridge relative to a cartridge chamber of a camera in automatically loading and ejecting the film cartridge into and from the cartridge chamber has been proposed in Japanese Patent Application No. HEI 7-135451.
According to the proposed arrangement, in automatically loading and ejecting the film cartridge into and from the camera, three positions, or states, of the film cartridge relative to the cartridge chamber must be detected in order to minimize the possibility of malfunctions of related mechanisms. The three positions or states are as follows.
(1) a position where the film cartridge has become loadable by an automatic loading mechanism (start of drawing-in), PA1 (2) a state in which the film cartridge has been completely loaded into the cartridge chamber by the automatic loading mechanism (completion of loading), and PA1 (3) a state in which the film cartridge has been ejected from the cartridge-chamber by an automatic ejecting mechanism and, then, the film cartridge has been completely pulled out by an operator (pulling-out).
In the case of Japanese Patent Application No. HEI 7-135451, two switches are used in combination as a means for detecting the three positions or states.
FIG. 10 shows the arrangement of a cartridge chamber proposed in the above Japanese Patent Application No. HEI 7-135451. In this arrangement, automatic loading and ejecting mechanisms are arranged to automatically load and eject a film cartridge 101, which is shown in FIG. 11, from the lower side of the camera by engaging with a recessed part 101-a of the film cartridge 101.
Referring to FIGS. 10 and 11, an engaging claw 104 which is urged to rotate by a spring 103 is pivotally supported for rotation by an ascending/descending member 102 and is arranged to engage with the recessed part 101-a of the film cartridge 101. The ascending/descending member 102 is arranged to be moved in the loading and ejecting directions jointly by an intermittent screw 105 which is not threaded in part near its drawing-in end, a support shaft 106 and a loading motor 107. A return spring 108 is arranged to aid the ascending/descending member 102 and the intermittent screw 105 for their screw engagement.
An opening-and-closing cover 109 is arranged to be opened and closed by an opening-and-closing motor 110. The opening-and-closing cover 109 is thus arranged to shield from light a cartridge chamber 111 which is arranged to accommodate the film cartridge 101. A film rewinding fork 112 is arranged to support the film cartridge 101 in conjunction with the opening-and-closing cover 109. The operations of these parts are controlled by a microcomputer 113.
An opening switch (SW1) 114 and a closing switch (SW2) 115 are arranged to detect the opening and closing of the opening-and-closing cover 109. An ejecting direction limit switch (SW3) 116 is arranged to detect the completion of an ejecting action of the ascending/descending member 102 on the film cartridge 101. A main switch (SW6) 119 is provided for opening and closing operations on the opening-and-closing cover 109.
The position (state) of the film cartridge 101 relative to the cartridge chamber 111 is detected by the combination of a loading drive start switch (SW1) 117 and a state detection switch (SW5) 118. More specifically, the microcomputer 113 determines the state (position) of the film cartridge 101 relative to the cartridge chamber 111 by the following combinations of states of the switches 117 (SW4) and 118 (SW5).
(SW4, SW5)=(off, off): a state in which the film cartridge has not yet been loaded or has been completely pulled out by the operator.
(SW4, SW5)=(off, on): a state in which the film cartridge is either in process of being pulled out by the operator or in process of being loaded. (SW4, SW5)=(on, on): a state in which the film cartridge is waiting for being pulled out by the operator after the completion of an automatic ejecting action, or a state in which an automatic loading drive is started after the completion of insertion by the operator.
(SW4, SW5)=(on, off): a state in which the film cartridge has been completely loaded.
However, the automatic loading and ejecting mechanisms arranged as described above have presented the following problems.
The switches for detecting whether or not the film cartridge has been inserted into the cartridge chamber by the operator to a position where the film cartridge has become able to be drawn in by the automatic loading mechanism are arranged to make such a detection by a side face 101-b of the film cartridge 101. In actuality, however, it is necessary to have some clearance between the film cartridge 101 and the cartridge chamber 111. The film-cartridge 101, therefore, might happen to irregularly move within a plane perpendicular to the loading direction inside the cartridge chamber 111. The irregular movement of the film cartridge 101 tends to incur inadequate contact of the switches which are of the contact type arranged to detect the side face 101-b of the film cartridge 101 as mentioned above. The automatic loading arrangement thus has the possibility of inadequate loading. Further, the arrangement using the engaging claw necessitates accurate detection of the inserted position of the film cartridge within the cartridge chamber in order to enable the engaging claw to engage with the film cartridge. However, unevenness in size among film cartridges tends to cause variations in timing of contact with the side face of the film cartridge. Under such a condition, the engaging claw might fail to engage with the film cartridge, thereby hindering adequate loading.


The present invention defines a DNA:protein-binding assay useful for screening libraries of synthetic or biological compounds for their ability to bind DNA test sequences. The assay is versatile in that any number of test sequences can be tested by placing the test sequence adjacent to a defined protein binding screening sequence. Binding of molecules to these test sequence changes the binding characteristics of the protein molecule to its cognate binding sequence. When such a molecule binds the test sequence the equilibrium of the DNA:protein complexes is disturbed, generating changes in the concentration of free DNA probe. Also described herein is a method to capture DNA that has been released from the DNA:protein complex.

Several classes of small molecules that interact with double-stranded DNA have been identified. Many of these small molecules have profound biological effects. For example, many aminoacridines and polycyclic hydrocarbons bind DNA and are mutagenic, teratogenic, or carcinogenic. Other small molecules that bind DNA include: biological metabolites, some of which have applications as antibiotics and antitumor agents including actinomycin D, echinomycin, distamycin, and calicheamicin; planar dyes, such as ethidium and acridine orange; and molecules that contain heavy metals, such as cisplatin, a potent antitumor drug.
Most known DNA-binding molecules do not have a known sequence binding preference. However, there are a few small DNA-binding molecules that preferentially recognize specific nucleotide sequences, for example: echinomycin preferentially binds the sequence [(A/T)CGT]/[ACG(A/T)] (Gilbert et al.); cisplatin covalently cross-links a platinum molecule between the N7 atoms of two adjacent deoxyguanosines (Sherman et al.); and calicheamicin preferentially binds and cleaves the sequence TCCT/AGGA (Zein et al.).
The biological response elicited by most therapeutic DNA-binding molecules is toxicity, specific only in that these molecules may preferentially affect cells that are more actively replicating or transcribing DNA than other cells. Targeting specific sites may significantly decrease toxicity simply by reducing the number of potential binding sites in the DNA. As specificity for longer sequences is acquired, the nonspecific toxic effects due to DNA-binding may decrease. Many therapeutic DNA-binding molecules initially identified based on their therapeutic activity in a biological screen have been later determined to bind DNA.
Experiments performed in support of the present invention have identified an in vitro assay useful to screen for DNA-binding molecules. The assay also allows the discrimination of sequence binding preferences of such molecules. The potential therapeutic applications for molecules that bind to specific DNA sequences are widespread.

Screening assay for the detection of DNA-binding molecules


Provided are a tri-block copolymer and an electrolyte membrane prepared therefrom. The tri-block copolymer has a structure of polar moiety-containing copolymer block/non-polar moiety-containing copolymer block/polar moiety-containing copolymer block, or non-polar moiety-containing copolymer block/polar moiety-containing copolymer block/non-polar moiety-containing copolymer block, and is useful for an electrolyte membrane for fuel cells. The electrolyte membrane for fuel cells prepared from the tri-block copolymer exhibits superior dimensional stability and excellent fuel cell performance.

Recently, the predicted exhaustion of conventional energy sources such as oil and coal has brought about an increasing interest in alternative energy sources. In particular, a fuel cell, as an energy storage system, is advantageous in that it is highly efficient, does not discharge pollutants such as NOx and SOx, and the fuel used is abundant, and thus attracts much attention.
A fuel cell is a power generation system which converts chemical bond energy of a fuel and an oxidizing agent into electric energy. Typically, hydrogen, methanol or hydrocarbons such as butane are used as the fuel and oxygen is used as the oxidizing agent.
The most basic unit to generate electricity in the fuel cell is a membrane electrode assembly (MEA), which is composed of an electrolyte membrane, and an anode electrode and a cathode electrode formed on both surfaces of the electrolyte membrane. Referring to Reaction Scheme I illustrating a mechanism via which a fuel cell generates electricity (reaction scheme of the fuel cell in the case where hydrogen is used as the fuel), in the anode electrode, oxidation occurs to produce hydrogen ions and electrons and the hydrogen ions move through the electrolyte membrane to the cathode electrode. In the cathode electrode, oxygen (oxidizing agent), the hydrogen ions transferred through the electrolyte membrane react with electrons to produce water. Based on these reactions, electron transfer occurs in an external circuit.At anode electrode: H2→2H++2e−At cathode electrode: ½O2+2H++2e−→H2OOverall reaction: H2+½O2→H2O  [Reaction Scheme I]
Among fuel cells, a proton exchange membrane fuel cell (also referred to as a "polymer electrode membrane fuel cell", PEMFC) provides high energy efficiency, high current density and power density, short driving period and rapid response to load variation. The proton exchange membrane fuel cell utilizes a proton exchange membrane and requires high proton conductivity, chemical stability, thermal stability at an operating temperature, low gas permeability, and in particular, superior mechanical strength as a membrane. Although membranes satisfying these requirements have been developed, clean manufacturing technology for the production of price competitive membranes is needed to make commercialization possible. Fluorine-based membranes such as Nafion (manufactured by Du Pont), Aciplex (manufactured by Dow membrane or Asahi Chemical) have disadvantages of decreased proton conductivity and high production cost in a low-humidity and high-temperature process. Accordingly, a great deal of research associated with non-fluorine polymers in which a polar group is introduced into a heat-resistant polymer as a base skeleton to provide functionalities of polymer electrolytes is actively made. Of these, poly(arylene ether) polymers having aromatic derivatives and ether bonds exhibit good heat resistance and chemical resistance, superior mechanical strength, excellent durability and low production costs.
However, dimensional stability, in consideration of the fact that polymer electrolyte membranes of fuel cells generate large amount of water, is a very important factor to be contemplated. Commonly, an electrolyte membrane should have a high ion exchange capacity (IEC) in order to have a high ionic conductivity. However, since ion exchange capacity (IEC) of the electrolyte membrane is directly related to water uptake, as water uptake increases, ion exchange capacity increases. As a result, dimension stability is deteriorated and film thickness increases, thus disadvantageously deteriorating overall performance of cells.
However, non-fluorine polymer membranes which efficiently solve the problem of dimensional stability, while maintaining superior performance, have been not yet known.

Tri-block copolymer and electrolyte membrane made from the same


Bolt mechanism for an electronic firearm adapted to eliminate rearward axial motion of the bolt plug with respect to the bolt body on closing the bolt assembly.

This invention relates to firearms and more particularly to electronic firearms. Specifically, the present invention relates to a bolt assembly adapted to fire electrically activated ammunition from an electronic firearm.
In electronic firearms, it is desirable to prevent leakage of gasses associated with the discharge of ammunition within the chamber of the firearm. In previously disclosed electronic firearms and in previously disclosed percussion firearms, gas leakage can be caused by the violation of the primer contact of a round of ammunition within the chamber of the firearm. Such violation occurs, especially in bolt action firearms, when the bolt assembly is closed on a round of ammunition within the chamber. If the firing pin protrudes too far, it may dislodge the primer contact of the round when the bolt assembly is closed and then locked. If the firing pin does not protrude far enough, it will not be in contact with the primer when the bolt assembly is closed and then locked. Accordingly, it is important to provide a means of controlling the protrusion of the firing pin when the firearm is closed, and especially in the case of bolt action firearms, when the bolt assembly is rotated from the closed position to the closed and locked position.
Previous bolt assemblies, upon rotation from the closed to the closed and locked position, were configured so that such rotation resulted in rearward motion of the firing pin with respect to the bolt face at the front of the bolt assembly. Such rearward axial motion was the result of the relative rearward motion of the bolt plug, which did not rotate, with respect to the bolt body. Because the firing pin was supported by the bolt plug, it protruded forward from the front of the bolt body, and when the bolt was closed, could puncture or dislodge the primer contact in a chambered round of ammunition prior to the rotation of the bolt into the closed and locked position. Furthermore, the rearward motion of the firing pin and bolt plug could leave the primer and the round unsupported and could result in gas leakage upon activation of the round.
In an electronic firearm having a round of electrically activated ammunition within its chamber, upon activation of the round, gasses are generated and can escape between the electrical primer contact, insulator, and primer cup of the round. Typically, the leaking gasses expand rearward and can damage the firing pin, its coating, the bolt face, or in extreme cases, the firearm itself. Recent ammunition design provides primers that will seal at maximum operating pressures and above, provided that the primer's electrical contact is properly supported by the firearm's firing pin during firing. Accordingly, there is a need for a means for maintaining contact between the tip of the firing pin and the primer contact at the rear of a round of ammunition within the chamber of the firearm. In addition, in bolt action electronic firearms, there is a need for a means of maintaining such contact during rotation of the bolt from the closed to the closed and locked position without subjecting the round of ammunition to unnecessary forces that can dislodge a primer contact from a round of ammunition and increase the likelihood of gas leakage. There is also a need for a means of providing support to a round of ammunition within the chamber of a gun to limit deformation and rearward extrusion of the primer contact in the rear of the round of ammunition during activation of the round. Such deformation and extrusion can lead to gas leakage.


In an embodiment, a shared memory fabric is configured to receive memory requests from multiple agents, where at least some of the requests have an associated deadline value to indicate a maximum latency prior to completion of the memory request. Responsive to the requests, the fabric is to arbitrate between the requests based at least in part on the deadline values. Other embodiments are described and claimed.

In many computer systems with multiple devices, an arbitration is performed to provide access to a shared resource such as a shared memory. Different types of arbitration mechanisms are provided to enable arbitration between the different agents or requestors. Some systems use a fixed priority arbitration system in which different agents are allocated a particular priority. However, this can lead to unfairness in usage and starvation of one or more agent's ability to obtain access to the shared resource. Other arbitration systems provide for a round robin-based approach to allocating access to the shared resource.
In either event, the arbitration that is performed does not take into account factors regarding the shared resource such as its power state. As such, requests granted access to the shared resource cause the resource to exit a low power state, although the device does not require such immediate access to the shared resource. Accordingly, current arbitration systems suffer from various drawbacks.

Arbitrating memory accesses via a shared memory fabric


An overcurrent protection circuit for low-voltage, high-current electrical systems comprises a Positive Temperature Coefficient (PTC) resistor in series with an auto-reset thermal breaker. The breaker allows for intermittent current within an assumed product usage duty cycle, and repeatedly trips and resets on sustained high current usage or during a short-circuit fault. The PTC resistor limits current in the system to a low value when the temperature rises to the PTC resistor's trip point. The PTC resistor protects the system from thermal damage during the non-breaker-tripped portions of sustained high current use, or during continuous low-current use. The use of both the PTC resistor and auto-reset breaker provides thermal overcurrent protection while allowing for performance claims based on an assumed duty cycle of product use.

The present invention relates generally to the field of overcurrent protection circuits and in particular to overcurrent protection circuits including an auto-reset breaker and PTC resistor(s).
Many automotive-related electrical circuits involve low voltage (e.g., 12 VDC) and relatively high currents (e.g., 10–250 A). Examples include the starter motor in automobiles and trucks, as well as aftermarket accessories for automobiles, ATVs and off-road vehicles, such as winches. Automatically resetting thermal breakers are widely used for protection in these applications. These auto-reset breakers allow for brief or intermittent high currents, but will trip, or cause an open circuit and thus prohibit current flow, under sustained high current. The breakers are thermally actuated.
A representative auto-reset thermal breaker comprises a bi-metal element and a pair of contacts. The bi-metal element changes shape when heated, breaking the contacts and opening the circuit. A snap action is accomplished by forming the bi-metal element into a shape that inverts as a reaction to reaching a design temperature. Once the circuit opens, the bi-metal element begins to cool and returns (snaps) back to the closed position, allowing current to flow. This is the auto-reset feature.
The breaker trip curve is based on a time/temperature relationship. Breakers are rated for the maximum sustained current that they will allow to flow continuously without tripping. That is, the breaker rated current is the maximum "never trip" current value. A characteristic of auto-reset thermal breakers is allowing brief or intermittent currents far in excess of their rated capacity, tripping only when the current generates sufficient heat.
Since intermittent use of aftermarket products is expected, these products are sold with performance claims that exceed actual performance available under sustained conditions. That is, the claims assume a duty-cycle for the products' use. The manufacturers use under-rated auto-reset breakers for fault protection. The breakers are sized to allow for claims of product performance and protection of the device that are only true under the assumed duty cycle. For example, the manufacturer of a bumper-mounted winch may assume a usage duty cycle of thirty seconds use during any four minute period. The manufacturer may then choose an auto-reset breaker that will not heat up sufficiently under the current load to trip within thirty seconds, although it will trip if the current load is sustained much longer than thirty seconds (e.g., the current load exceeds the rating of the breaker). The three and a half minutes of assumed non-use is sufficient time for the breaker to cool, so as to not trip during another thirty seconds of use. This duty cycle may be typical of a one using the winch to pull a truck out of the mud, and the typical user will experience the performance claimed by the manufacturer.
One using his winch all day to pull stumps from the ground, however, will exceed the designed duty cycle, and will experience repeated tripping of the breaker. During such sustained high-current use—which also occurs under a short-circuit condition—the auto-reset breaker will continue resetting, continuing to allow intermittent high currents in the system. These repeated high-current conditions could cause wiring and other system components to heat up to dangerous levels, creating a fire hazard.
Unanticipated, sustained low-current use may also create a fire hazard. For example, the starter motor in an automobile may draw up to 250 A on a cold morning; and 45–50 A during more temperate weather. This circuit may be protected by a 280 A fuse. The current draw is designed to be brief—on the order of a few seconds for a well-tuned engine. However, if some fault failed to disengage the starter motor after the engine started, it may continue to draw, e.g., 50 A, well below the current that would blow a 280 A fuse. A sustained current of 50 A may cause the wiring or components—designed only for brief currents—to heat to dangerous levels, presenting a potential fire hazard.
Protective devices other than auto-reset breakers are rarely used in aftermarket products due to adverse customer perception. For example, fuses are never used because blowing a fuse prevents use of the product until the fuse is changed, and leads to customer perception of inferior quality. Manual reset breakers are sometimes used but are considered a nuisance by customers, and are often defeated to prevent them from tripping.
Hence a need exists in the art for an overcurrent protection circuit that allows for the industry practice of duty-cycle based performance claims, and additionally provides effective protection against high-current thermal damage. In addition, a need exists for an overcurrent protection circuit that protects against both very high excess current, and unanticipated sustained low current.

Overcurrent protection circuit including auto-reset breaker and PTC resistor


An optical apparatus includes: a light source including multiple light-emitting points arrayed in a first direction; and an imaging optical system including multiple lens optical systems arrayed in the first direction. The imaging optical system forms images of the multiple light-emitting points on a light-receiving surface. In a first cross-section and in a second cross-section, half-value of a maximum value of angle of divergence of an imaging optical flux input to the light-receiving surface, resolution, and a size of each image of the plurality of light-emitting points formed on the light-receiving surface, satisfy predetermined conditions.

As of recent, there have been developed image forming apparatuses and image reading apparatus including optical apparatuses which have a lens array made up of multiple lenses. This configuration enables realization of reduction in apparatus size and costs, in comparison with configurations scanning a photosensitive member by a polygon mirror, configurations reading images using multiple lenses and mirrors, and so forth.
Japanese Patent Application Laid-Open No. 63-274915 (hereinafter referred to as "PTL 1") discloses a lens array in which multiple lenses are arrayed in one direction (first direction). Each of the multiple lenses perform erecting same-size imaging of an object within a cross-section parallel to the first direction and optical axis direction (first cross-section), and perform inverted same-size imaging of an object within a cross-section perpendicular to the first direction (second cross-section). This configuration enables the lens power to be smaller within the second cross-section, as compared with an optical system performing erecting same-size imaging in the first cross-section. This is advantageous in realizing both resolution and light available efficiency.
Now, let us consider depth of field as being indicative of imaging capabilities of the lens array, in addition to resolution. Depth of field indicates a range on the optical axis over which a predetermined resolution can be obtained in front of and behind the image field position. Normally, a lens array having a great depth of field has lower light available efficiency, and a lens array having great light available efficiency has lower depth of field. Further, a lens array has to have resolution ensured within the first and second cross-sections, so consideration has to be given to common field of depth within both cross-sections.
However, the lens array disclosed in PTL 1 does not take into consideration the common depth of field within both the first and second cross-sections when receiving input of light rays from the light-emission points of an array light source. That is to say, the lens array described in PTL 1 is of a configuration where the depth of field in the first cross-section and the depth of field in the second cross-section are different. The common depth of field is determined by the smaller of the depths of field in both cross-sections, so the lens array according to PTL 1 has secured unnecessarily great depth of field in one cross-section. Accordingly, the lens array disclosed in PTL 1 is not an optimal configuration for realizing both resolution and light available efficiency, since light available efficiency is lost by the amount exceeding the common depth of field at one cross-section.
Also, the common depth of field of the lens array differs according to the position of each light-emitting point of the array light source, as well. Accordingly, difference in light-emitting point has to be taken into consideration to realize both resolution and light available efficiency, but there is no disclosure or suggestion of taking difference in light-emitting point with regard to the lens array described in PTL 1.

Optical apparatus, image forming apparatus, and image reading apparatus


An X-ray source comprising a cathode element adapted to generate a stream of electrons. The X-ray source includes an anode element adapted to present a focal spot position for the stream of electrons. A vacuum chamber contains the cathode element and anode element. The anode element and/or the cathode element can be moveable with respect to the other in coordination with the generation of the stream of electrons.

The present invention is generally related to an X-ray tube assembly and more particularly to an X-ray tube assembly in which anode or cathode elements are moveable with respect to each other.
Radiographic imaging systems, such as X-ray and computed tomography (CT) have been employed for observing interior aspects of an object. Typically, the imaging systems include an X-ray source that is configured to emit X-rays toward an object of interest, such as a patient. A detecting device, such as an array of radiation detectors, is positioned on the other side of the object and is configured to detect the X-rays transmitted through the object of interest.
X-ray or radiographic imaging is the basis of a number of diagnostic imaging systems. Computed tomography (CT) is one example of such a system that is predicated upon the acquisition of data using the principles of radiography. By mapping the incomplete penetration of X-rays through an object from multiple different angles, CT image systems generate volumetric representations of the object. Dedicated Breast Tomography (DBT) operates under similar principles to CT, but, whereas CT generally acquires data a full 360 degree range of angles about the imaged object, DBT will acquire only a limited range of angles such as 30 to 120 degrees and with a system geometry optimized to breast imaging, Typically, in CT and DBT imaging systems, a single X-ray source emits a single fan-shaped or cone-shaped beam toward a subject or object, such as a patient or a piece of luggage. The imaging angle is defined relative to the fixed imaged object by a line that joins the focal spot location in the tube to the detector center. In a moving source configuration, the angle is changed by moving the source relative to the fixed subject and collecting data at times. In a distributed source configuration, multiple focal spot locations are provided in the system and are energized in a sequence so as to provide data at different imaging angles. The beam, after being attenuated by the subject, impinges upon an array of radiation elements. One embodiment of this array could be a pixel array within a radiographic detector or multiple pixels spread over multiple discreet detectors. The intensity of the attenuated beam radiation received at the detector array is typically dependent upon the attenuation of the X-ray beam by the subject. Each detector element of the detector array produces a separate electrical signal indicative of the attenuated beam received by each detector element. The electrical signals are transmitted to a data processing system for analysis which ultimately produces an image.
Generally, for CT the X-ray source and the detector array are rotated about an axis within an imaging plane and around the subject. For DBT, the X-ray source is moved relative to the subject and the detector may or may not move. X-ray sources typically include X-ray tubes, which emit the X-ray beam at a focal point. X-ray detectors typically include a collimator for collimating X-ray beams received at the detector, a scintillator for converting X-rays to light energy adjacent the collimator, and photodiodes for receiving the light energy from the adjacent scintillator and producing electrical signals therefrom. Alternately, a photoconductor layer can serve a combined function of the scintillator and photodiodes by directly absorbing X-rays and converting directly to electrical signals.
In an indirect detector type, the scintillator converts X-rays to light energy. The scintillator discharges light energy to a photodiode adjacent thereto. Each photodiode detects the light energy and generates a corresponding electrical signal. In a direct detector type, the photoconductor converts X-rays to electric charge in proportion to the energy and delivers that charge under the influence of a high voltage to electrical contacts. The outputs of the photodiodes or photoconductor are then transmitted to the data processing system for image reconstruction. Other types of radiation detectors exist such as those that convert X-rays directly to electrical signals without the use of a scintillator or photodiode.
CT systems, as well as X-ray systems, typically utilize a rotating anode during the data acquisition process. Rotating the anode presents a moving electrode track at the spot which generates the X-ray fan beam, and thereby spreads the thermal load on an enlarged surface area of the anode. That is, the anode typically includes a single target electrode that is mounted or integrated with an anode disc. The anode disc may be rotated by an induction motor during data acquisition. Rotation is initiated before the start of a mechanical scan of the source. The rotation rate is maintained at a constant rate throughout the source trajectory and not coordinated specifically with the acquisitions of data at multiple locations. Since the electrons striking the anode deposit most of their energy as heat, with a small fraction emitted as X-rays, producing X-rays in quantities sufficient for acceptable image quality generates a large amount of heat. It can be the case that the heat is generated sufficiently rapidly and in a small focal area on the anode electrode surface as to raise the temperature close to the melting temperature of the electrode material or creating destructive thermal strain and shock. The consequences of such thermal overloading can be melting or cracking on the anode surface. A number of techniques have been developed to accommodate the thermal load placed on the anode during the X-ray generate process.
For example, advancements in the detection of X-ray attenuation has allowed for a reduction in X-ray dose necessary for delivering images with sufficient quality. X-ray dose delivered to the patient and tube current are directly related and, as such, a reduction in tube current results in a reduction in X-ray dosage. Similarly, a drop in tube current, i.e. reduction in the number of striking electrons on the anode target, reduces the thermal load placed on the anode target during data acquisition. Simply, less power is needed to generate the X-ray necessary for data acquisition. However, counteracting the advances in detection equipment is the need to decrease scan time or increase throughput (e.g. patients per hour) that call for increased X-ray power. X-rays are generated at a focal local on the anode electrode as a result of electrons emitted from a cathode striking a target electrode mounted to or integrated with the anode disc. A control circuit sets the number of electrons emitted from the cathode and the voltage potential placed across the cathode and anode in order meet the imaging requirements and to protect the tube from over-heating. Total heat load on the anode that is proportional to the emitted current and the voltage potential placed across the cathode and anode. Optimal patient safety conditions can call for higher tube voltage or pre-patient attenuation filters that drive higher X-ray power requirements that challenge the thermal condition of the anode. In spite of advances in detection equipment, a minimum number of electrons must be generated for meaningful data acquisition under the constraints of minimum patient dose or increased throughput. As a result, a mere reduction in tube current is insufficient to address the thermal load on the anode resulting from X-ray generation.
Another approach is predicated upon the spreading of the generated heat across the surface and mass of the anode disc. By rotating the anode disc as electrons are striking the target electrode, the heat generated therefrom may be spread across a track of the anode disc rather than at a single focal location on the target electrode surface. This rotation of the anode disc effectively reduces the thermal load placed at any single location on target electrode. As a result, tube current may be increased without thermal overloading of the anode. Generally, the faster the anode disc is rotated the higher the tube current that may be used.
Increasing the tube current and effectively the power levels of the X-ray tube assembly is particularly desirable for short duration high power reconstruction protocols. With these protocols, the gantry is caused to rotate at significantly fast rotational speeds. Through increased rotational gantry speed, the overall exam time may be decreased. Decreasing the overall exam or scan time improves patient throughput and reduces patient discomfort which reduces patient-induced motion artifacts in the reconstructed image. To support faster gantry speeds, the X-ray tube must output sufficiently more instantaneous power which is required for short duration protocols.
To provide the requisite instantaneous power needed for short duration protocols, the X-ray tube must output more power without exceeding the thermal load of the target electrode. As mentioned above, rotating the anode disc during X-ray generation reduces the thermal load on the electrode target.

X-ray source with moving anode or cathode


A novel use of D-psicose (for suppressing the abnormal intra-day increase of blood glucose level) is provided. A composition containing D-psicose as the active component and for use in suppressing the abnormal intra-day increase of plasma glucose concentration. The composition is a composition in blend with D-psicose and/or a derivative thereof. The composition is in a form selected from sweeteners, seasonings, food additives, food materials, food and drink products, health food and drink products, pharmaceutical products, and feeds and blended with D-psicose, and/or a derivative thereof as the active component, for use in preventing and therapeutically treating diseases requiring the saving of insufficient insulin, the amelioration of insulin sensitivity and the amelioration of hyperglycemia, and/or diseases of which the symptoms can be ameliorated via the suppression of the abnormal intra-day increase of plasma glucose concentration or of which the onset can be prevented via the suppression thereof, such as diabetes mellitus, occult diabetic states, obesity, hyperglycemia, and/or arteriosclerosis. A method for using D-psicose in suppressing the abnormal intra-day increase of plasma glucose concentration, comprising giving D-psicose at given times to suppress the abnormal increase of plasma glucose concentration throughout the day.

D-Psicose is one of monosaccharides called rare sugar. Because the sugar was hardly available in the past since the sugar could not be produced at a mass scale, almost no research works about the physiological activity and pharmacological activity of the sugar were done. In recent years, a mass-scale process of producing D-psicose with an enzyme has been developed by Izumori, et al. at the Agricultural Department, Kagawa University, so that the biological activity thereof has been elucidated.
Compared with monosaccharides such as D-glucose and D-fructose, D-psicose has been drawing attention as a sugar never promoting fat synthesis or never accumulating body fats, particularly intraperitoneal fat (non-patent reference 1). Additionally, a report tells that the effective energy value of D-psicose is almost zero (non-patent reference 2). Highly possibly, a process of producing D-psicose in a form of a crystalline sugar complex containing D-fructose will be established (patent reference 1). Therefore, an application of D-psicose as a sweetener is expected.
Concerning the physiological activity and pharmacological activity of D-psicose, the patent reference 1 includes a report telling that examinations were made using D-psicose and the intestinal tract about the influence of the ketohexose belonging to rare sugar on glucose absorption since foods are digested to decomposed so that glucose is absorbed in the intestine for supply; an action of D-psicose to mildly suppress blood glucose level was verified in an animal (rat), so that it was verified that D-psicose had an action of decreasing blood glucose at hyperglycemia and an action of promoting insulin secretion and that D-psicose hardly triggered protein saccharification. The patent reference 1 describes that it was demonstrate that the ketohexose belonging to rare sugar had an action of stimulating insulin secretion from pancreatic β cell and an action of enhancing insulin secretion at hyperglycemic states and that the ketohexose belonging to rare sugar will therefore expectantly be a substance with a new action mechanism never found conventionally; additionally that the ketohexose belonging to rare sugar promotes insulin secretion in patients with diabetes mellitus to ameliorate the blood glucose level; that the ketohexose belonging to rare sugar after enteral administration suppresses glucose absorption and the ketohexose belonging to rare sugar never influences sugar metabolism, which suggests that the ketohexose possibly suppresses post-meal hyperglycemia in diabetes mellitus so the ketohexose is expectantly a substance advantageous for the prevention or therapeutic treatment of diabetes mellitus; that it is observed that the ketohexose belonging to rare sugar is effective for preventing arteriosclerosis in significant relations with diabetes mellitus and complications thereof and the main cause of death due to diabetes mellitus is an arteriosclerotic disease, so the ketohexose belong to rare sugar and having an action of suppressing arteriosclerosis is expectantly an innovative therapeutic agent of diabetes mellitus to ameliorate the blood glucose level and prevent arteriosclerosis; and that the ketohexose belonging to rare sugar is expectantly a health supplementary food with such therapeutic effects and an anti-obesity action.    Non-patent reference 1: Matsuo T., et al., Asia Pacific J. Clin. Nutr. 10, 233-237, 2001    Non-patent reference 2: Matsuo T., et al., J. Nutr. Sci. Vitaminol 48, 77-80, 2002    Patent reference 1: International Patent Application WO 03/097820    Patent reference 2: JP-A-2001-11090

Application of D-psicose to suppression of abnormal circadian increase in blood glucose level

Rare Sugar Production Technical Research Laboratories, LLC.


A controller of each power conversion device in a power conversion system controls a switching element unit, based on a detected value of reactor current flowing through a filter reactor, a detected value of output voltage output between the terminals of a filter capacitor, and a detected value of output current flowing through an output reactor. The controller generates a voltage command based on the output current and the output voltage and generates a correction amount of the voltage command based on the output current in which a reference frequency component is removed. The controller generates a current command based on the addition value of the voltage command and the correction amount and controls the switching element unit such that the reactor current matches the current command.

A power conversion system including a plurality of power conversion devices connected in parallel is known. In such a power conversion system, when a plurality of power conversion devices operate in parallel to supply power to a load, a deviation in amplitude or phase of output voltage of the power conversion devices may cause cross current among the power conversion devices.
In order to prevent occurrence of cross current, for example, Japanese Patent Laying-Open No. 2010-288437 (PTL 1) discloses a method in which current supplied from a power conversion system to a load (hereinafter referred to as "load current") is detected by a current detector, and a value obtained by dividing the detected load current by the number of devices operating in parallel is used as an output current command per power conversion device to control output current of each power conversion device.

Power conversion device and power conversion system


The present disclosure includes a number of device and system embodiments. One such bracket device embodiment includes a coupling segment having two coupling legs for connecting to a first support member and a mounting segment having two mounting legs for connecting to a second support, and wherein the mounting legs are arranged to be oriented in an opposite direction relative the coupling legs when attached to the second support, the mounting legs perpendicular in one axial dimension to the coupling legs.

Frame structures that are used for supports, stands, display apparatus, racks, carts, or workstations often utilize a plurality of frame members which are attached together perpendicularly where certain frame members constitute vertical frame portions and other frame members constitute horizontal frame portions.
There are many existing ways to attach the frame members to one another. Where permanent structures are envisioned, permanent techniques of fastening are used such as welding, gluing, or nailing. In structures which are not intended to be permanent, techniques such as bolting, interfitting projections and slots, bendable metal tabs, and the like have been used.
A common drawback of non-permanent structures is that the devices are limited in that the number of points of attachment is restricted, and the structure is oftentimes predetermined for one configuration and cannot be used for multiple uses based on the configuration chosen.


Disclosed is a plasma processing apparatus, in which parasitic plasma is not generated in a transfer chamber. The plasma processing apparatus has a load lock chamber, a transfer chamber, a processing chamber, and gate valves installed between the chambers for transferring a substrate and opening and closing openings of the chambers. Each of the gate valves includes a valve housing provided between the chambers such that the valve housing contacts side surfaces of the chambers by interposing sealing members therebetween, and forming a designated closed space therein; a valve including a sealing plate contacting an inner surface of the valve housing on the side of the processing chamber, and a back plate contacting the inner surface of the valve housing on the side of the transfer chamber; a valve driving unit connected to the valve for moving the valve in the vertical direction; and a ground member formed on the surface of the valve for electrically connecting the valve and the valve housing when the valve contacts the inner surface of the valve housing.

1. Field of the Invention
The present invention relates to a plasma processing apparatus, and more particularly to a plasma processing apparatus, in which parasitic plasma is not generated in a transfer chamber.
2. Description of the Related Art
Generally, plasma processing apparatuses are used to process a substrate, such as etching, for flat panel displays, which is supplied thereto, using plasma. The flat panel displays include liquid crystal displays, plasma display panels, or organic light emitting diodes. Among these plasma processing apparatuses, a vacuum processing apparatus generally includes three chambers, i.e., a load lock chamber, a transfer chamber, and a processing chamber.
The load lock chamber serves to receive a non-processed substrate from the outside or discharge a processed substrate to the outside alternately in an atmospheric state and a vacuum state. The transfer chamber is provided with a transfer robot for transferring a substrate between the other chambers, and serves to convey a substrate to be processed, from the load lock chamber to the processing chamber or a processed substrate from the processing chamber to the load lock chamber. The processing chamber serves to deposit a film on a substrate or etch a substrate using plasma in a vacuum.
The processing chamber is provided with electrodes installed at the upper and lower parts of the inside thereof. Generally, one electrode of the processing chamber is connected to a RF power source, and the other electrode of the processing chamber is grounded. When RF power is applied to the inside of the processing chamber under the condition that a processing gas is injected into the processing chamber, plasma is generated in the processing chamber due to electric discharge, and a substrate is processed using the plasma.
As shown in FIG. 1, a conventional plasma processing apparatus includes a load lock chamber 10, a transfer chamber 20, and a processing chamber 30. Gate valves 40 and 50 are provided between the load lock chamber 10 and the transfer chamber 20 and between the transfer chamber 20 and the processing chamber 30 under the condition that the gate valves 40 and 50 are adjacent to the corresponding chambers 10, 20, and 30.
The gate valve 40 is interposed between the load lock chamber 10 and the transfer chamber 20, and serves to open and close a communication channel therebetween. The gate valve 50 is interposed between the transfer chamber 20 and the processing chamber 30, and serves to open and close a communication channel therebetween. The gate valves 40 and 50 include valve housings 42 and 52, valves 44 and 54, and valve driving units 46 and 56.
The airtightness of the valve housing 42 between the load lock chamber 10 and the transfer chamber 20 is maintained by airtightness maintaining members (O), and the airtightness of the valve housing 52 between the transfer chamber 20 and the processing chamber 30 is maintained by airtightness maintaining members (O).
Plates for opening and closing openings of the load lock chamber 10 and the transfer chamber 20 by means of the valve driving unit 46 are provided in the valve housing 42, and plates for opening and closing openings of the transfer chamber 20 and the processing chamber 30 by means of the valve driving unit 56 are provided in the valve housing 52.
The transfer chamber 20 is provided with a transfer robot 22 installed therein for transferring a substrate (not shown) to the load lock chamber 10 or the processing chamber 30. The transfer robot 22 includes a transfer arm and a driving unit (not shown). The transfer arm includes an end effector assembly 24, and an end effector 26 connected to the end effector assembly 24 for transferring the substrate.
Generally, chambers are made of aluminum. However, the transfer chamber 20 is made of steel use stainless (SUS) due to strength to weight ratio and increase in volume corresponding to the size of a substrate.
The transfer chamber 20 made of SUS, which has specific resistance differing from that of aluminum, is not easily grounded. When the transfer chamber 20 is not completely grounded, as shown in FIG. 2, RF power (R) in the processing chamber 30 is not exhausted to the outside, but is induced in the transfer chamber 20. When the RF power (R) is induced in the transfer chamber 20, the wall of the transfer chamber 20 does not reach a complete grounding potential state, and the wall of the transfer chamber 20 and the corner portion of the end effector assembly 24 having a grounding potential, which is disposed close to the wall of the transfer chamber 20, are coupled, thus generating parasitic plasma (PA).
When parasitic plasma (PA) is generated in the transfer chamber 20, many problems occur. That is, processing characteristics are changed due to an RF power loss, particles are increased due to damage to ions in the transfer chamber 20, static electricity of a substrate is generated due to charging of the inside of the transfer chamber 20 or the transfer robot 22, and the transfer robot 22 malfunctions due to the pseudo noise of RF.

Advanced Display Process Engineering Co., Ltd.


A method and apparatus for reducing power consumption of a memory device. The method includes initiating a precharge operation. The precharge operation includes driving one or more bitlines to a precharge voltage. The method also includes identifying one or more defective wordlines and, during the precharge operation, driving the identified defective word lines to the precharge voltage.

1. Field of the Invention
The invention generally relates to reducing the power consumption of memory devices. More specifically, the invention relates to reducing the power consumption of memory devices due to defects in the memory device.
2. Description of the Related Art
Many modern electronic devices contain digital memory (e.g., a dynamic random access memory, DRAM). Each memory may be used to store information for a digital device. Users of such electronic devices typically desire large amounts of memory in a small package. Where the electronic devices are portable (e.g., battery powered), users may also desire electronic devices which do not consume as much power and therefore have a longer battery life. Thus, manufacturers of electronic devices typically desire small, high density memories with low power consumption.
To meet the demand for small, high density memories, memory manufacturers typically create memory chips with the smallest available features (e.g., transistors and control lines) and with densely packed memory cells. However, as the size of features in a memory chip shrinks and as the memory density of a memory chip increases, small, uncontrollable errors in the manufacturing process may cause more defective memories at a high cost to the manufacturer.
An example of a possible defect in a memory device is a short (e.g., an unintended electrical connection) between a defective wordline and a bitline of a memory device. Wordlines and bitlines are lines in a memory device which are used to access a memory cell (e.g., at the junction of the wordline and bitline) in the memory device. Where a wordline and bitline are shorted, the memory cell located at the junction of the wordline and bitline may, in some cases, not be accessible, thereby resulting in a defective wordline and defective memory device.
To reduce the number of defective memory devices resulting from defective wordlines and/or bitlines, many manufacturers create memory devices with redundant wordlines and/or bitlines. Where, for example, the manufacturer detects a defective wordline, the memory device may use a redundant wordline instead of the defective wordline. When a memory device uses a redundant wordline instead of a defective wordline, the defective wordline may be referred to as a repaired wordline.
While repairing a defective wordline may prevent a memory device from losing data, the defective wordline may still remain shorted to a bitline. In some cases, where a defective wordline is shorted to a bitline, current may flow between the defective wordline and the bitline, thereby increasing the power consumption of the memory device.
As an example, when wordlines and bitlines are not being used to access memory cells, each wordline is deactivated and the bitlines are precharged in preparation for the next sensing operation. During deactivation, each wordline voltage may be lowered to a low voltage (e.g., the low wordline voltage, VNWLL), thereby disconnecting each memory cell from the bitlines used to access the memory cell. The voltage of the bitlines when properly precharged is a voltage midway between the voltage corresponding to a bitline high logic level (VBLH) and the voltage corresponding to a bitline low logic level (VBLL). The midway voltage ((VBLH+VBLL)/2) may be referred to as the precharge voltage or bitline equalize voltage, VBLEQ.
However, where a wordline is defective (e.g., shorted to a bitline), during precharge, current may flow from the bitline being held at the precharge voltage (VBLEQ) to the defective wordline being held at the low wordline voltage (VNWLL). Where current flows between a defective wordline and a bitline, the power consumption of the memory device may increase. In some cases, because each defective wordline may be in a precharge state for an extended period of time (e.g., when the memory device is not being accessed but is in a standby state), and because each memory device may contain several defective wordlines, the power consumption of the memory device during precharging due to defective wordlines may be substantial, thereby decreasing the value of the memory device (e.g., by reducing the battery life of electronic devices which use the memory device).
Accordingly, what is needed are methods and apparatuses for reducing the power consumption of a memory device due to a defective wordline.


Provided is a method of producing a membrane and electrode assembly (MEA) comprising: mixing a metal catalyst with pure water, perfluorinated polymer ionomer and a polar organic solvent to prepare a composition for forming a catalyst layer; coating a diffusion layer formed on an electrode support with the catalyst layer forming composition, drying to forming a catalyst layer, thereby preparing a cathode and an anode, respectively; and interposing an electrolyte membrane between the anode and the cathode. The electrode catalyst for a fuel cell is inactivated to prevent spontaneous oxidation, thereby stabilizing the catalyst.

1. Field of the Invention
The present invention relates to a membrane and electrode assembly (MEA), and more particularly, to an MEA which can produce a stable catalyst layer by maintaining a metal catalyst at an inactivated state using deionized water in forming the catalyst layer, a production method of the same and a fuel cell employing the same.
2. Description of the Related Art
Recently, as portable electronic devices and cordless communication equipments have been rapidly developed, much attention is being paid to development of fuel cells as portable power sources, fuel cells for pollution-free automobiles and power-generation systems as clean energy sources.
A fuel cell is a new power generation system for directly converting the chemical energy of fuel gas, e.g., hydrogen or methanol, and an oxidizer, e.g., oxygen or air, into electrical energy. There are several different fuel cells: molten carbonate fuel cells operating at higher temperatures of approximately 500 to approximately 700° C.; phosphoric acid fuel cells operating at approximately 200° C.; alkaline electrolyte fuel cells and polymer electrolyte fuel cells operating at below 100° C. or at room temperature.
The polymer electrolyte fuel cell is subdivided into a proton exchange membrane fuel cells (PEMFC) using hydrogen gas and a direct methanol fuel cell (DMFC) using liquid methanol according to anode fuel. The polymer electrolyte fuel cell, which is a source of future clean energy that can replace fossil energy, has high power density and high energy conversion efficiency. Also, the polymer electrolyte fuel cell can operate at room temperature and can be made miniaturized. Thus, the polymer electrolyte fuel cell has very wide applications including zero-emission vehicles, home power generation systems, and power source for mobile communications equipment, medical appliances and military equipment.
In general, a proton exchange membrane fuel cell using hydrogen is advantageous in that it has high power density, but cautious handling of hydrogen gas is needed and there is demand for an additional facility, such as a fuel reforming apparatus for reforming methane, methanol or natural gas to produce hydrogen fuel.
On the other hand, although having lower power density than gaseous fuel cells, a direct methanol fuel cell is considered to be suitable as a small and general-purpose portable power source from the viewpoints of manageability, low operation temperatures and no necessity of additional fuel reforming apparatus.
A basic unit of a direct methanol fuel cell (DMFC), MEA, is constructed of electrodes, that is, an anode and a cathode, disposed at opposite sides of an electrolyte, for oxidation and reduction. Each of the anode and cathode includes a support plate for maintaining the shape and strength of a cell, a diffusion layer for supplying fuel into the cell and a catalyst layer for reacting the fuel to be decomposed into ions.
The DMFC operates based on the following principle.
First, a methanol solution as fuel is supplied to the anode. The fuel absorbed into carbon paper used as the support plate is evenly diffused throughout the surface of the diffusion layer through pores present in the diffusion layer and is induced into the catalyst layer. The methanol solution induced into the catalyst layer reacts in the presence of a catalyst Pt—Ru to then be decomposed according to the electrochemical reactions below:CH3OH→(CH3OH)ads(CH3OH)ads→(CH2OH)ads+H++e−(CH2OH)ads→(CHOH)ads+H++e−(CHOH)ads→(COH)ads+H++e−(CHOH)ads→(CHO)ads+H++e−(COH)ads→(CO)ads+H++e−(CHO)ads+H2O→CO2+3H++3e−(CO)ads+(H2O)ads→CO2+2H++2e−
Protons produced by sequential decomposition steps by the action of the catalyst at the anode are transferred to the cathode across an electrolyte layer. Electrons produced simultaneously with the protons are also transferred to the cathode via the diffusion layer, a current collector and an external circuit. Carbon present in methanol reacts with deionized water to then be exhausted in the form of CO2 gas.
In the cathode, oxygen present in the air is supplied through the support plate and is evenly diffused into the MEA via the gas diffusion layer. The oxygen transferred to the catalyst layer reacts with a Pt catalyst to produce oxygen ions and simultaneously reacts with the protons and electrons transferred from the anode to produce water.
In the anode of a DMFC, methanol oxidation occurs to produce protons and electrons. The produced protons and electrons are transferred to the cathode. In the cathode, the protons react with oxygen, that is, oxidation occurs. An electromotive force based on the oxidation reaction of the protons is an energy source of a fuel cell. The following reaction equations represent reactions occurring in the anode and cathode and an overall reaction occurring in the single cell.
[Anode]CH3OH+H2O→CO2+6H++6e−Ea=0.04 V
[Cathode] 3/2O2+6H++6e−→3H2O Ec=1.23 V
[Single Cell]CH3OH+ 3/2O2→CO2+2H2O Ecell=1.19 V
The overall performance of a fuel cell is greatly influenced by the performance of anode materials because the methanol decomposition in the anode determines the rate of the overall reaction. Thus, in order to realize commercialization of DMFCs, development of superb catalysts for methanol oxidation is quite important.
Known patents including U.S. Pat. Nos. 5,415,888, 4,185,131, 5,869,416 and 5,882,810 describe the use of alcohol or organic solvent in the manufacture of a catalyst layer and a diffusion layer without separate techniques or steps for preventing oxidation of a catalyst.

Membrane and electrode assembly, production method of the same and fuel cell employing the same


An oxetane-cyclic epoxy compound represented by Formula 1:

1. Field
Embodiments relate to an oxetane-cyclic epoxy compound, a method of preparing the same, and a composite sheet for display substrate including the same.
2. Description of the Related Art
Glass having excellent heat resistance and transparency, and a low coefficient of linear expansion is widely used as substrates for liquid crystal displays (LCDs) or organic electroluminescent (EL) displays, color filter substrates, solar cell substrates, or the like. Recently, as substrate materials for displays are required to have small size, slimness, light weight, impact resistance and flexibility, plastic materials are receiving attention as a substitute for a glass substrate.

Oxetane-cyclic epoxy compound, method of preparing the same, and composite sheet for display substrate including the same

Abstract: where R1 is hydrogen, a methyl group or an ethyl group.

KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY


An integrated circuit and method of generating a bias signal for a data signal receiver is disclosed. One embodiment provides a replica circuit configured to generate a feedback signal, wherein the replica circuit is a replica of at least a part of a data signal receiver, and wherein the feedback signal depends on a reference signal of the data signal receiver. A compensation circuit is configured to compensate an influence of the reference signal on the feedback signal. An amplifier circuit is configured to generate a bias signal based on the feedback signal, the bias signal being provided to the data signal receiver.

Receiver circuits integrated on a semiconductor chip may be constructed as differential receiver circuits to convert data from a low swing non-return-to-zero signal voltage (NRZ signal voltage) to full-swing CMOS levels. In most receiver circuits this NRZ signal voltage varies across a reference voltage VREF. As this reference voltage for the data receivers can vary, data skew through the receiver can also greatly vary. Therefore a receiver biasing circuit may be applied which can compensate for variations of the reference voltage so that an adapted biasing voltage can be supplied to the receiver and the receiver can provide a controlled skew of the data signal.
For these and other reasons, there is a need for the present invention.

Integrated circuit and method of generating a bias signal for a data signal receiver


A socket-less test board and a clamp for clamping an integrated circuit to the socket-less test board is disclosed. The test board includes a recess region for receiving an integrated circuit to be tested. The clamp includes a base structure with a recess region to accommodate the integrated circuit and a heat sink that is positioned in contact with the package of the integrated circuit. Mounting and fastening elements mount and fasten the clamp to the test board, holding the integrated circuit in place during electrical testing.

Semiconductor chips are typically fabricated in wafer form. A silicon wafer undergoes a series of well known processing steps to fabricate a plurality of dice on the wafer. Scribe lines separate the individual die on the wafer. After fabrication, the individual dice are singulated by cutting or sawing the wafer along the scribe lines. The individual die are then encapsulated in a package. After a new chip is designed and fabricated, it will often undergo a series of electrical tests to determine if it operates within the specifications of the device. Electrical parameters, such as clock speed or frequency, signal rise and fall times, overshoot and undershoot, bandwidth, the skew between input/output pins, etc. are all tested under various conditions to determine the specifications of the device.
The testing of the integrated circuit is typically performed on test board. A number of probe points and traces are provided on the test board. During testing, the probe points are probed by test equipment to provide test signals to the board. Traces on the board provide input signals to the integrated circuit mounted on the board. The chip processes the input signals and generates output signals. Traces on the board carry the output signals to the probe points where they are measured by the probe equipment. The probe equipment then analyses the input and output signals to ascertain the electrical parameters of the device.
A number of techniques are known for mounting the integrated circuit onto a test board. With one technique, metal pins of a socket are mounted into through-holes formed on the test board. Each of the through holes are metal plated and in electrical contact with one of the traces on the test board. The leads of the integrated circuit are inserted into receptacles in the socket. Metal traces connect the leads of the integrated circuit and the pins of the socket. Electrical paths are therefore provided between the integrated circuit and the probe points on the test board. A number of problems are associated with using a socket for mounting the integrated circuit. Since the size, dimensions, and pin lay out of most integrated circuits are different, a specific or dedicated socket must be fabricated for each device. The fabrication of a different socket for each device tends to be expensive. Sockets also do not provide ideal electrical connections between the probe points on the board and the integrated circuit, particularly devices with high lead counts. To accommodate all the leads, the through holes in the test board are typically arranged in concentric circles around the socket. Due to this arrangement, the electrical paths between the leads of the integrated circuit and the probe points are not symmetrical. As a result, the capacitance, inductance, and ohmic characteristics of the electrical paths of each trace may vary. The different electrical characteristics of each electrical path may result in inaccurate measurements of the electrical parameters being tested, such as the channel to channel slew rate, for example.
Another type of known test board calls for the soldering of the integrated circuit onto the board. After a device has been tested, the integrated circuit is removed by de-soldering and replaced with another integrated circuit. The problem with this solution is that after the soldering and removal of just a few integrated circuits, the traces on the board begin to degrade, again adversely effecting the electrical performance of the board and the ability to accurately measure and ascertain the electrical characteristics of the chip under test.
In a third type of test board arrangement, the integrated circuit is pressure mounted on the test board using a metal plunger to physically hold the chip into place. The problem with this arrangement, however, is that the pressure exerted by the plunger tends to bend or displace the leads of the integrated circuit package. There is also no "guide" to hold the chip in alignment with the contacts on the test board. Poor electrical connections can therefore result. The plunger also tends to act like a heat sink, potentially altering the measured electrical characteristics of the device under test.
A socket-less test board and a clamp for clamping an integrated circuit to the socket-less test board is therefore needed.

Socket-less test board and clamp for electrical testing of integrated circuits


In one aspect, the invention encompasses a semiconductor processing method of forming a metal-comprising layer over a substrate. A substrate is provided within a reaction chamber, and a source of a metal-comprising precursor is provided external to the reaction chamber. The metal-comprising precursor comprises a metal coordinated with at least one Lewis base to form a complex having a stoichiometric ratio of the at least one Lewis base to the metal. An amount of the at least one Lewis base is distributed within the source to an amount that is in excess of the stoichiometric ratio. At least some of the metal-comprising precursor is transported from the source to the reaction chamber. A metal is deposited from the metal-comprising precursor and onto the substrate within the reaction chamber. In another aspect, the invention encompasses a method of storing a metal-comprising material. A metal-comprising material is dispersed within a solution. The metal-comprising material comprises a complex having the stoichiometric form (Y)xM(Q)z; wherein M is a metal, Y is a first ligand, x is from 0 to 4, Q is a Lewis base, and z is from 1 to 6. An amount of Q is dispersed within the solution to an excess over the stoichiometric ratio of Q to M in the complex.

In one aspect, the invention pertains to methods of forming semiconductor circuit constructions, such as, for example, methods of forming capacitor constructions. In particular embodiments, the invention pertains to methods of forming capacitor constructions comprising diffusion barrier layers. In other aspects, the invention pertains to solutions of metal-comprising materials, and to methods of storing metal-comprising materials.
As DRAMs increase in memory cell density, there is a continuing challenge to maintain sufficiently high storage capacitance despite the continuing goal to further decrease cell area. One principal way of increasing cell capacitance is through cell structure techniques. Such techniques include three-dimensional cell capacitors, such as trenched or stacked capacitors. Yet as feature size continues to become smaller and smaller, development of improved materials for cell dielectrics as well as the cell structure are important. The feature size of 256 Mb DRAMs is on the order of 0.25 micron, and conventional dielectrics such as SiO2 and Si3N4 might not be suitable because of small dielectric constants.
Chemical vapor deposited oxide films, such as, for example tantalum oxide (Ta2O5), BaTiO3 and SrTiO3 films are considered to be very promising cell dielectric layers. For instance, the dielectric constant of Ta2O5 is approximately three times that of Si3N4. Capacitor constructions have been proposed and fabricated to include the use of one or more of the oxide materials as a capacitor dielectric layer. However, diffusion relative to the oxide materials can be problematic in the resultant capacitor constructions. For example, tantalum from Ta2O5 tends to undesirably out-diffuse from dielectric layers comprising tantalum oxide. Further, materials from the adjacent conductive capacitor plates can diffuse into the tantalum-comprising dielectric layers. In either event, the dielectric properties of the dielectric layer are adversely affected in a less than predictable or an uncontrollable manner.
A method of inhibiting diffusion between tantalum oxide and adjacent materials is to surround the tantalum oxide with a material that constitutes a diffusion barrier layer. Suitable materials for utilization as diffusion barrier layers are materials comprising transition metals (such as, for example, ruthenium, osmium, rhodium, iridium and cobalt), and can include transition metal oxides (such as, for example, ruthenium oxide, osmium oxide, rhodium oxide, iridium oxide and cobalt oxide). The transition metals are typically deposited by chemical vapor deposition (CVD) utilizing metal-comprising precursor compounds. The metal-comprising precursor compounds generally comprise a transition metal coordinated with one or more Lewis base ligands in the form of a complex. Exemplary metal-comprising precursors are (cyclopentadienyl)Rh(CO)2, and (1,3-cyclohexadiene)Ru(CO)3. During a CVD process, the metal-comprising precursors are provided in a reaction chamber with a substrate and subjected to temperature and pressure conditions (and, in some instances, to a plasma or photolysis) to decompose the precursor and cause release of metal from the precursor. The released metal is then deposited on the substrate. A difficulty in utilizing the above-describe metal-comprising precursors in CVD processes is that the precursors frequently decompose prematurely. Such decomposition can occur while the precursors are stored outside the chamber and can result in formation of dimers or molecular clusters of the transition metal precursors. The resulting materials comprising dimers or molecular clusters are generally less volatile than are the original metal-comprising precursors, and accordingly can be difficult to utilize in CVD processes. It would be desirable to develop methods for CVD of metal-comprising precursors which avoid the above-described difficulties.
In one aspect, the invention encompasses a semiconductor processing method of forming a metal-comprising layer over a substrate. A substrate is provided within a reaction chamber, and a source of a metal-comprising precursor is provided external to the reaction chamber. The metal-comprising precursor comprises a metal coordinated with at least one Lewis base to form a complex having a stoichiometric ratio of the Lewis base to the metal. An amount of the Lewis base is provided within the source to an excess of the stoichiometric ratio. At least some of the metal-comprising precursor is transported from the source to the reaction chamber. A metal is deposited from the metal-comprising precursor and onto the substrate within the reaction chamber.
In another aspect, the invention encompasses a method of storing a metal-comprising material. A metal-comprising material is dispersed within a solution. The metal-comprising material comprises a complex having the stoichiometric form (Y)xM(Q)z; wherein M is a metal, Y is a first ligand, x is from 0 to 4, Q is a Lewis base, and z is from 1 to 6. An amount of Q is dispersed within the solution to an excess over the stoichiometric ratio of Q to M in the complex.
In yet another aspect, the invention encompasses a method of forming a capacitor. A first capacitor electrode is formed over a substrate. A diffusion barrier layer is formed proximate the first capacitor electrode. A dielectric layer is formed. The dielectric layer is separated from the first capacitor electrode by the diffusion barrier layer. A second capacitor electrode is formed. The second capacitor electrode is separated from the first electrode by the dielectric layer. The forming the diffusion barrier layer comprises the following steps. The substrate having the first capacitor electrode thereover is provided to within a reaction chamber. A source of a metal-comprising precursor is provided external to the reaction chamber. The metal-comprising precursor comprises a metal coordinated with one or more Lewis bases to form a complex having a stoichiometric ratio of the Lewis bases to the metal. At least some of metal-comprising precursor in the source is a liquid. A gas is provided, and an amount of at least one of the Lewis bases is distributed within the gas. After the Lewis base is distributed within the gas, the gas is passed through the liquid metal-comprising precursor of the source. At least some of the metal-comprising precursor from the source is transported to the reaction chamber with the gas. A metal-containing film is deposited from the metal-comprising precursor onto the substrate.

Solutions of metal-comprising materials, methods of forming metal-comprising layers, methods of storing metal-comprising materials, and methods of forming capacitors