An improved door closure indicator is provided. The indicator operates on pressure levels read within a pressurized chamber rather than from proximity switches coupled between the chamber and the door. If the door seals to the chamber, pressure within the chamber will quickly change, and the change will be read on a pressure sensor indicative of the door closure. According to one example, the chamber can comprise a vacuum chamber and the pressure sensor can be a vacuum monitor. Once vacuum is detected, it is determined with more absolutism that the door is actually closed rather than having to rely upon switch operation and/or alignment of the door activation mechanism to proximity switches arranged on the chamber housing. The processing tool which embodies the chamber includes a chamber controller which incorporates various switches and relays which channel pressure readings taken from the chamber to a load controller, and also delays pressure readings after opening a half-gate valve operably coupled between a vacuum pump and the chamber.

1. Field of the Invention
This invention relates to a vacuum chamber and, more particularly, to a circuit and apparatus for verifying evacuation of the chamber after a substrate is loaded into the chamber for processing.
2. Description of the Related Art
A substrate is generally defined as a material upon which processing takes place. For example, a substrate can receive deposition, etch, implant, heat (anneal) and various clean cycles. A popular type of substrate is one which is silicon-based and generally known as a semiconductor wafer. Substrate, however, is a term henceforth used to encompass any object which receives processing and therefore is defined to extend beyond a semiconductor wafer.
In many instances, optimal substrate processing involves placing the substrate inside a chamber containing an ambient dissimilar from that which surrounds the chamber. Ambient within the chamber may be controlled to ensure processing is carried out according to a specific processing xe2x80x9crecipe.xe2x80x9d Using the semiconductor wafer example, certain types of deposition require wafers within a chamber be subjected to a vacuum and substantial temperatures. Low pressure, high temperature deposition upon the wafer is well recognized as, for example, low pressure chemical vapor deposition (xe2x80x9cLPCVDxe2x80x9d). Low pressure processing to produce a LPCVD film is but one example of many involving a chamber and pressurization within that chamber. Pressurization levels within a chamber to effectuate optimal processing of the substrate is critical not only to produce accurate film properties, but also to minimize contamination within the chamber during any or all of the various processing steps beyond deposition.
When film is being deposited, etchant delivered, dopants implanted or temperatures applied, it is important that extraneous material not be allowed to enter the chamber during those critical processing steps. For example, if gas or particulate matter enters the chamber during LPCVD processing, the ensuing film may suffer improper conformality and/or electrical properties. It is therefore desired that the chamber ambient receive proper pressurization levels before processing is applied to the substrate. This implies that all apertures and/or orifices into the chamber be sealed after the substrate is loaded and before the substrate is processed.
FIG. 1 illustrates one example of an application involving a chamber 10 which can be pressurized (i.e., a pressurized chamber). A mechanism 12 is used for loading one or more substrates 14 into chamber 10 prior to evacuating the chamber. In the example provided, chamber 10 may be configured as a horizontal tube LPCVD reactor which can be used to deposit doped or undoped dielectric films upon exposed surfaces of substrate 14. Further to that example, substrate 14 may be a silicon-based semiconductor wafer fixed on edge within a carrier secured to a paddle or plunger 16. Thus, the carrier which secures one or more wafers, defined as substrate 14, may be secured to a door 18 to which plunger 16 is coupled. Within the semiconductor fabrication industry, chamber 10 can be referred to as a furnace or reactor, which can receive radiated heat via resistive heating coils surrounding the reactor. Chamber 10 interior walls may be made of quartz or metallic material which are somewhat inert to reactant gasses 20 metered into chamber 10 at one end of the chamber. The other end of chamber 10 is coupled to a vacuum pump which extracts reactant byproducts 22 in the direction shown.
Metering the reactant gasses 20, and evacuating byproducts 22 occur only if it is known that the inside of chamber 10 is properly sealed. This requires knowing that door 18 is properly sealed against exterior ambient ingress. Door 18 may be designed to close in the direction of arrows 24 until a seal occurs between a flange 26 at one end of chamber 10 and a sealing membrane 28 arranged on a chamber-facing surface of door 18. Membrane 28 may comprise an o-ring, and flange 26 may be stainless steel or quartz. Flange 26 comprises a relatively planar surface upon which membrane 28 can be compressed when door 18 closes. Once compressed, membrane 28 seals the interface between door 18 and chamber 10.
Before processing can occur (i.e., before reactant gas is metered into the chamber and byproducts removed), it is important to ensure the chamber""s integrity by verifying closure of door 18. Many conventional mechanisms are available to provide door closure verification. A popular mechanism may involve a proximity switch 30 mounted to the exterior surface of chamber 10. Proximity switch 30 is generally considered a xe2x80x9ccontactxe2x80x9d switch which movably reciprocates when placed in contact with a protrusion 32 of door 18. Merely as an example, door 18 may include a protrusion 32 and chamber 10 exterior housing may include a receptacle 33. As protrusion 32 enters receptacle 33 toward which switch 30 extends, protrusion 32 surface will contact and thereafter move the switch lever from a normally open position to a closed position. Of course, there may be numerous other mechanisms on which switch 30 is mounted and from which switch 30 is activated. The receptacle/protrusion mechanism is shown only as an example.
Entry of protrusion 32 into the receptacle 33 of chamber 10 hopefully coincides with the compression (i.e., seal) of membrane 28 against flange 26. When moved, protrusion 32 should manually brush against the lever of switch 30, causing that lever to transition upon a contact as shown in further detail in FIG. 2. FIG. 2 illustrates closure of lever 34 between a pair of contacts 36a and 36b. Closure of lever 34 across contacts 36 produces a signal from switch 30 upon conductor 38.
In many instances, there may be two switches. A second switch 40 may be present as shown in FIGS. 1 and 2. Switch 40 may suffice as a back up if switch 30 is rendered inoperable. Switch 40 may also serve as a fail stop to prevent protrusion 32 from unduly pressing against chamber 10 housing should switch 30 fail. Switch 40, similar to switch 30, comprises a pair of contacts 42a and 42b, and a lever 44 which reciprocates between contacts 42. A conductor 46 extends from switch 40 to indicate status of the switch and, more importantly, whether door 18 is closed against flange 26.
The nature of proximity switches in general and the mechanism by which they are mounted does not always allow accurate verification of door closure. Proximity switches rely upon movement of the levers 34 and 44 when contacted with protrusion 32. If the protrusion and/or door should become misaligned, then actuation of levers may not occur indicating the door is open when in fact it is closed. Furthermore, integrity of the contacts may be lessened through extensive wear, also resulting in a switch that is open when the door is actually closed. Conversely, membrane 28, and the integrity by which membrane 28 mates with flange 26, may be reduced after repeated door closure so that the seal between those structures will eventually fail even though switches 30 and 40 indicate switch closure.
Conventional proximity switches and their use in verifying door closure is therefore not always absolute. In actuality, proximity switches mostly determine the status of the switches and not necessarily the status of door closure or, more importantly, status of pressure within the chamber. If the door is closed but the switches fail and do not indicate closure, then the processing tool will hold off its processing until the misreading problem has been solved. This can reduce processing throughput. Conversely, if the switches indicate the door is closed and yet the door is open, then gasses external to the chamber will be drawn into the chamber along with the evacuated byproducts. Ingress of, for example, oxygen or hydrogen into chamber 10 during LPCVD oxide or nitride formation may contaminate the ensuing dielectric film and jeopardize the electrical properties of that film. In a worst case situation, toxic or flammable gasses may enter the chamber through the partially open door 18, causing a possible fire or a toxic cloud to form within the chamber. A more likely scenario is the door is slightly ajar even though the switches indicate the door is sealed against chamber 10. When vacuum is drawn to the chamber, particles are agitated across the substrate as turbulence is created through the slight opening between the chamber 10 and door 18. Sufficient particles within what should be a pristine deposited film may cause significant yield loss of the final product. In the case of semiconductor wafers, particulate count on the silicon substrate or within a deposited oxide film may, in the extreme, cause improper shorting of dielectrically spaced conductors.
It is therefore desired that a mechanism be derived which can accurately verify door closure in a pressurized chamber. Instead of monitoring switch operation, it would be more prudent to monitor pressure levels within the chamber since, in fact, it is pressure level that dictates whether or not the door is actually closed and sealed.
The problems outlined above are in large part solved by a door verification system hereof. The verification system includes a mechanism for monitoring ambient pressure within a pressurized chamber. The pressure level produced within the chamber is defined to be greater than or less than atmospheric pressure, i.e., 760 torr. According to a one embodiment, the pressure level of which the present mechanism monitors is defined as a pressure differential between the inside and the outside of the chamber. If the pressure outside the chamber is 760 torr, then the pressure sensor should activate at a differential of anywhere from 10 to 500 torr (e.g., about 260 to about 750 torr in absolute terms), preferably 20 to 300 torr differential (e.g., about 460 to 740 torr absolute), and more preferably 40 to 100 torr differential (e.g., about 660 to 720 torr absolute). Once the pressure status drops below a pre-defined, (i.e., atmospheric pressure value), then a more accurate indication of door closure can be achieved.
Pressure is preferably monitored within a vacuum line coupled to the chamber. Monitoring the vacuum line instead of the chamber itself prevents exposing the sensitive pressure sensors to the high temperatures and caustic chemicals normally associated with the chamber operation. Removing the sensors from the chamber yet maintaining the sensors in gaseous communication with the chamber affords minimal environmental corruption to those sensors and therefore enhances the longevity and accuracy of their readings.
The pressure sensor or sensors operate as a contained unit. When pressure within the chamber drops below a certain value, the pressure sensor will output a signal to a chamber controller. The chamber controller receives that signal and provides indication to a tool which is processing the substrate (i.e., processing tool) that the door is closed. Until that signal is received, a load controller within the chamber controller may continue to drive the door toward the chamber if door movement is called for.
The processing tool is defined as any tool which includes a chamber which can receive a substrate and a pressurized ambient. According to one example, the substrate may include a semiconductor wafer, and the processing tool may be a semiconductor manufacturing tool, such as an LPCVD tool, a plasma enhanced etch tool, an diffusion furnace, etc. The processing tool includes not only the chamber, but also a pressure delivery line (e.g., a vacuum line) coupled between a pressure source (e.g., a vacuum pump) and the chamber. Coupled to the delivery line is a pressure (e.g., vacuum) monitor and throttle valve. The vacuum monitor serves to indicate door closure, while the throttle valve regulates vacuum pressure within the chamber. Further included with the processing tool is a main valve, coupled between the vacuum source and the vacuum tube. A half valve and secondary conduit extends across the main valve between the vacuum source and the vacuum tube. The half valve may be operated before the main valve to draw a slight vacuum upon the chamber through the secondary conduit.
The secondary conduit, in combination with the main suction tube, provide a two-step vacuum sequence. The first step draws lower amounts of vacuum across the vacuum monitor, triggering the vacuum monitor that the door is closed as readings drop below 1.0 atmospheres (or 760 torr). The half-gate valve within the secondary tube, must therefore be open after the door is closed to allow the vacuum monitor to achieve a vacuum reading. A timed delay therefore exist between the time in which the half-gate valve is open and the vacuum monitor checks for chamber evacuation. Accordingly, a circuit is present which performs the desired delay. The circuit also properly sequences opening of the half gate valve after manually closing the door and before checking the vacuum monitor. An additional circuit is provided to select whether the vacuum monitor or a conventional proximity switch should determine door closure. A relay may be used to perform that selection. If active, the relay coil will draw corresponding wipers from one post to another within the relay. The drawn wiper will then select the pressure monitor to indicate proper door closure rather than proximity switches. For example, if the pressure reading is below a pre-defined value, then the substrate load controller will see an open circuit as directed through the relay, indicative of door closure. An open circuit signals the load controller that the door is closed and that further movement of the door is not needed. If the relay coil is not active, then the load controller will see either an open or a closed circuit mandated by the proximity switch. Accordingly, retrofit to existing proximity switches is easily accomplished using a relatively few circuit components comprising, according to one embodiment, a pair of relays and a pair of switches.
Broadly speaking, the present invention concerns an apparatus for determining closure of a door. The apparatus comprises a chamber having first and second apertures extending into the chamber. A pressure delivery unit is coupled to the first aperture and a pressure monitor is coupled in gaseous communication with the pressure delivery unit. The pressure monitor can therefore determine sealed closure of the door over the second opening when a pressure reading within the pressure monitor varies from a pre-defined amount. According to one example, the pre-defined amount is atmospheric pressure. According to another embodiment, the pressure delivery unit is a vacuum pump and the pressure monitor is a vacuum monitor. When the pressure level read by the vacuum pump drops below, e.g., 760 torr, sealed closure of the door is verified.
The present invention further concerns a circuit indicating a pressure level within a semiconductor fabrication chamber. The circuit includes a pressure monitor switch placed in gaseous communication with the chamber. A load controller is operably coupled to receive indication of a pressure fluctuation within the chamber as a result of power applied to the controller. A relay is coupled between the pressure monitor switch and the controller for applying the power during times when the switch is in a state determinative of the pressure level.
The present invention yet further concerns a method for verifying closure of a vacuum sealed door across an aperture extending into a semiconductor fabrication chamber. The method comprises driving the door into hopefully a closed position across the aperture. Thereafter, a first vacuum is applied to the chamber. Sealing of the door across the chamber is then verified if the first vacuum amount causes pressure within chamber to drop below atmospheric pressure. Applying the first vacuum comprises drawing gas and/or fluid from the chamber through a secondary conduit of relatively small diameter compared to the diameter of a main conduit. A second vacuum amount greater than the first vacuum amount is applied subsequent to verifying seal of the door. Applying the second vacuum comprises drawing gas and particulate matter from the chamber through the main conduit to draw pressure within the chamber further below atmospheric pressure. The secondary conduit can draw pressure less than one atmosphere while the main conduit can draw pressure less than 300 millitorr.

Circuit and apparatus for verifying a chamber seal, and method of depositing a material onto a substrate using the same


A wafer handling mechanism is operated to place a wafer on a chuck. A chucking force is then applied to the wafer, whereby wafer support features of the chuck transfer a defect pattern onto a surface of the wafer. The surface of the wafer is analyzed by a defect metrology tool to obtain a mapping of the defect pattern transferred onto the surface of the wafer. A center coordinate of the chuck within a coordinate system of the wafer is determined by analyzing the defect pattern as transferred to the surface of the wafer. A spatial offset between the center coordinate of the chuck and the center of the wafer is determined. The spatial offset is used to adjust the wafer handling mechanism so as to enable alignment of the center of the wafer to the center coordinate of the chuck.

In the fabrication of semiconductor devices such as integrated circuits, memory cells, and the like, a series of manufacturing operations are performed to define features on semiconductor wafers ("wafers" or "substrates"). The wafers include integrated circuit devices in the form of multi-level structures defined on a silicon substrate. At a substrate level, transistor devices with diffusion regions are formed. In subsequent levels, interconnect metallization lines are patterned and electrically connected to the transistor devices to define a desired integrated circuit device. Also, patterned conductive layers are insulated from other conductive layers by dielectric materials.
A number of the various wafer manufacturing operations require handling and placement of the wafer on a chuck within a processing chamber. Such placement of the wafer on the chuck is done remotely using a robotic device. It is generally important that the wafer be placed on the chuck in a known position relative to the chuck. For example, it may be specified that the wafer should be centered within a wafer receiving area of the chuck. However, accuracy in placement of the wafer on the chuck by the robotic device is generally a function of how well the robotic device is calibrated to a spatial position of the chuck. Therefore, the wafer may be placed in a non-centered manner on the chuck due to mis-calibration between the robotic device and the spatial position of the chuck. When this occurs, it is not generally known how far off-center the wafer is relative to the wafer receiving area of the chuck.
Processes performed on the wafer in the chamber generally assume that the wafer is centered within the wafer receiving area of the chuck. Therefore, when the wafer is positioned in a non-centered manner on the chuck, it is possible that the wafer fabrication process will suffer in terms of desired results. Consequently, it is of interest to better control centering of the wafer on the chuck.

Method and system for centering wafer on chuck


Methods and systems for programming programmable transponders are disclosed. An apparatus for programming programmable transponders can include a label supply for supplying labels, a programing zone into which the labels are conveyed, a feed-system for transporting a label to the programming zone, a source of radiation for communicating tag-information to the transponder, and a shield mechanism. The source can be disposed to illuminate a programming zone into witch the lable is transported. The shield mechanism can substantially enclose the source of radiation and a first one of the labels in the programming zone and exclude at least a second one of the labels.

Current product marking schemes provide only limited information about the identity of a particular package of merchandise. As a result, it is difficult, using only information on the package, to trace mass market products to a particular source. It is even more difficult to trace the path taken by a package of merchandise through the supply chain from a manufacturer, through a chain of distributors, to a retailer.
Programmable transponders, such as RFID tags, have sufficient storage capacity to uniquely identify a package of merchandise. Such transponders offer the potential of marking mass-produced packages of merchandise with unique identifiers. The ease with which such transponders can be interrogated has the potential to render practical the task of tracking a package of merchandise through the supply chain.

This patent is subject to a terminal disclaimer.

Merchandise marking with programmable transponders


A fluid delivery system is used for the treatment of subcutaneous hernia sites and includes a bioabsorbable polymer fabric mesh layer and a bioabsorbable and permeable bladder attached to the upper side of the fabric mesh layer. Fluid from the bladder is diffused through pores communicating between the bladder and the fabric mesh layer so as to be dispersed to underlying tissue.

In the United States and across the world, a major complication associated with surgical procedures is the development of an incisional hernia. As high as 10% of open abdominal operations will be complicated by the development of incisional hernias. An incisional hernia occurs when a weakness in the muscle of the abdomen allows the tissues of the abdomen to protrude through the muscle. The hernia appears as a bulge under the skin, and can be painful or tender to the touch. In the case of an incisional hernia, the weakness in the muscle is caused by the incision made in a prior abdominal surgery. An incisional hernia may be small enough that only the peritoneum, of the lining of the abdominal cavity, pushes through. In severe cases, portions of organs may move through the muscle.
Repair rates of incisional hernias are even worse with some recurrence rates approaching 50%. Many biologic technologies are being developed to decrease the rate of hernia formation as well as to repair the hernias if they do occur.
Studies are currently being performed with indwelling catheter-based technologies allowing for drug delivery to the incisional site wherein the catheter provides saturation of the wound bed with various medicament-containing liquids. The distal end of the catheter is inserted in or around the wound site, secured to the patient with surgical sutures, surgical adhesive, bandages or the like, leaving an accessible proximal end portion of the catheter to allow for the infusion of therapeutic liquids through one or more proximal catheter ports.
Unfortunately, it commonly occurs that indwelling catheters lead to infections caused by cutaneous organisms mesh seeding along the catheter line into the incisional area at the site of implantation. Catheter infection, defined as the entrance of microorganisms at the site around or in the catheter, is a serious complication, particularly when a mesh is implanted for hernia repair. Microorganisms invariably gain access to the tract of the sheath and the catheter at the skin surface and grow inwards toward the surgical hernia area, contaminating the surgical site. The longer the duration of a transcutaneous catheter, the greater the risk of infection.
An infection arising from an indwelling transcutaneous catheter is an especially severe complication in surgical procedures involving hernia repair where a mesh is implanted to secure a hernial rupture. Invariably, the infection arising from the indwelling catheter will contaminate the entire area including the implanted mesh, giving rise to life threatening infections. Often, the entire infected mesh has to be removed as well as the infected tissue surrounding it.
Currently, there are no universal self-contained implantable hernia repair devices that allow for the testing and delivery of medicaments directly to the hernia repair site.
Accordingly, there is a need for a comprehensive hernia control, prevention, treatment and a system that avoids or, at least, decreases the chances of infection while strengthening the tissue surrounding hernias, or potential hernias. Such a system would provide general, as well as specific, remedies for the drawbacks of the conventional art.

Mesh based fluid delivery prosthesis and method of use


An output torque control system for an internal combustion engine for a vehicle is responsive to a stepping-on amount of the accelerator pedal, for controlling output torque from the engine. Upon detection of an operation for starting the vehicle, the output torque from the engine is inhibited from being controlled to an increased value in response to the stepping-on amount of the accelerator pedal over a predetermined time period. It is determined that the operation for starting the vehicle has been carried out, when the accelerator pedal has been stepped on and a change in the shift position of the automatic transmission has occurred.

1. Field of the Invention
This invention relates to an output control system for internal combustion engines for vehicles, which reduces output torque from the engine during starting of the vehicle with an accelerator pedal of the vehicle being stepped on when an automatic transmission of the engine is put in gear, to thereby reduce a gear-shifting shock.
2. Prior Art
Conventionally, there is known an engine output torque control system for an internal combustion engine with an automatic transmission and throttle valve-driving means for electrically controlling the opening of a throttle valve of the engine in response to stepping-on of an accelerator pedal of the vehicle. According to the control system, a desired output torque from the engine is calculated based on a gear shifting mode of the automatic transmission and an amount of stepping-on of the accelerator pedal, a desired opening of the throttle valve is calculated based on the calculated desired engine output torque and the rotational speed of the engine, and the throttle valve is controlled through the throttle valve-driving means such that the actual opening of the throttle valve becomes equal to the calculated desired opening, to thereby control the output torque from the engine.
An automotive vehicle with the above internal combustion engine and engine output control system installed therein is started from a standing position thereof, in such a manner that when the accelerator pedal is not stepped on, a shift lever of the automatic transmission is operated to change the shift position of the automatic transmission from a neutral (N) position or a parking (P) position to a drive (D) range or a reverse (R) range whereby the gear mechanism of the transmission is put in gear, i.e. a clutch thereof is engaged, and if the accelerator is then stepped on, the throttle valve is controlled to open in response to the amount of stepping-on of the accelerator pedal, so that a driving force is transmitted from the engine through the automatic transmission to driving wheels of the vehicle to start the vehicle.
However, if the accelerator pedal is suddenly or largely stepped on immediately after the gear mechanism is put in gear to start the vehicle, the output torque from the engine suddenly increases to cause a sudden change in the driving force, resulting in a large gear-shifting shock being given to the driver and passenger(s).
Such a gear-shifting shock can occur similarly even in the case where the shift position is changed to put the gear mechanism in gear in a state where the accelerator pedal has been stepped on.

Control system for inhibiting torque increase corresponding to increasing throttle opening during a standing start


A flexible expansion joint is capable coping with a great extension for its limited length. The flexible expansion joint includes: a first sleeve to be put on an end part of a first pipe; an outer sleeve to be put on an end part of a second pipe so as to overlap the first sleeve and capable of moving axially relative to the first sleeve; a first sealing member; a second sealing member; a third sealing member; a first length limiter including a first stopper for limiting the axial movement of the first pipe and the first sleeve relative to each other; and a second length limiter including a second stopper for limiting the axial movement of the second pipe the outer sleeve relative to each other.

Flexible expansion joints need to deal with bending and expansion of pipelines. Metal bellows expansion joints are well known conventional flexible expansion joints. Metal bellows expansion joints deform repeatedly to deal with the bending and expansion of pipelines and hence are liable to subject to metal fatigue. Considerably strong force needs to be applied to metal bellows expansion joints to deform the same and hence metal bellows expansion joints cannot be easily deformed.
A flexible expansion joint disclosed in, for example, JP 2008-180323 A for connecting pipes is capable of being fit over ends of the pipes respectively, without being specially worked and without requiring specially working the ends of the pipes.
FIGS. 1 to 3 show a pipeline including a pipe 1, a pipe 2, and a flexible expansion joint 100 connecting the pipes 1 and 2. The flexible expansion joint 100 has sleeves and sealing members.
FIG. 1 shows the flexible expansion joint 100 in a state where the pipes 1 and 2 connected by the flexible expansion joint 100 are coaxial and the axial distance between the respective ends of the pipes 1 and 2 is fixed.
FIG. 2 shows the flexible expansion joint 100 in a state where the axial distance between the respective ends of the pipes 1 and 2 connected by the flexible expansion joint 100 is not changed, the respective axes of the pipes 1 and 2 are separated from each other by a coaxiality deviation δ and the axis of the flexible expansion joint 100 is inclined at an angle θ1 to an axial direction. In the state shown in FIG. 2, the pipeline has an expansion allowance E.
FIG. 3 shows the flexible expansion joint 100 in a state where the axial distance between the respective ends of the pipes 1 and 2 connected by the flexible expansion joint 100 is changed, the respective axes of the pipes 1 and 2 are separated from each other by a coaxiality deviation δ, the axis of the flexible expansion joint 100 is inclined at an angle θ1 to the axial direction and the pipeline is elongate by an allowable axial length A.    Patent Document 1: JP2008-180323A


The Trusted Computing Platform Alliance (TCPA) Specification is implemented to allow a credit card company to remotely install a credit card private key into a TCPA module to create a Trusted Platform Module (TPM). More specifically, when a credit worthy user applies for a credit card, the user will send the credit card company a public portion of a “non-migratable storage key,” which is accredited a TPM endorsed by a Certification Authority. The credit card company will create its own public/private key pair according to the TCPA Specification, to create a TCPA header, and wrap the full structure by encrypting it with the public portion of the TCPA non-migratable storage key. The credit card company then sends by email the encrypted bundle with a certificate for it, and sends a corresponding pass phrase by regular mail.

The Internet provides a new arena for electronic commerce in which credit card companies are very interested. Quite naturally, since "commerce" is a necessary part of e-commerce, it stands to note that providing for the transfer of funds and credit during e-commerce transactions bodes well for those credit card companies that can securely provide for such transactions. One of the main concerns that continues with respect to e-commerce is the lack of trust that the consuming public has in the security of such transactions to protect their credit card and banking accounts.
One current method for obtaining a credit card from a credit card company on-line is for the user to fill out a credit card application at the credit card company's website, and then if approved, the credit card company will send a physical credit card to the user who can then activate the credit card by calling a toll-free number from the user's home phone. However, credit card theft is abundant, and according to some reports, accounts for half of the monetary loss of the credit card companies.
To eliminate the need for a physical credit card, another prior art method is to send to the user a smartcard for use in on-line transactions. However, the problem with a smartcard is one of expense, since use of a smartcard requires a smartcard reader to be installed on the user's computer.
As a result, there is a need in the art for a less expensive but reliable and secure process for enabling users to obtain a credit card authorization that they can use on their computer for facilitating purchases over the Internet.

System and method for installing a remote credit card authorization on a system with a TCPA complaint chipset


Communications between a central concert controller and portable interactive devices of audience members in a venue are integrated through a Wi-Fi network providing coverage of the venue. A multi-megabit traffic exchange without loss of data is achieved. Both omnidirectional and highly directional radios utilize a single frequency in order to provide a signal to areas that are not in a line of sight of a single Wi-Fi source. Each directional radio includes a backhaul transceiver. Users are sent images such as streaming videos by a video jockey, and may upload content to the central system. A server within the system controls interactions of user devices. Each user device may be assigned a unique ID number.

1. Field of the Invention
The present subject matter relates to the integration of communications between a central concert controller and portable interactive devices of audience members in a venue through a Wi-Fi network.
2. Background
A recently developed enhancement of the concert experience includes providing a performance and interacting with client devices of individuals in an audience.
A shortcoming in the prior art is that while mobile coverage has been provided, it has not been designed to reach substantially all audience members or to provide coverage within the nominal bandwidth limitations of entertainment venues. Cell phones may be used to couple users to a live event. However, in many venues cell phone communications will be shielded. There will be venues in which cell phone communication will be shielded.
A Wi-Fi link is an alternative way to connect to an audience. However, municipal and local Wi-Fi networks are not designed to reach thousands of visitors at a time. Stadium venues typically include seating sections comprising concrete tiers. These tiers effectively block Wi-Fi transmissions.
United States Published Patent Application No. 20110075612 discloses a system in which content is sent to a plurality of receiving access terminals (portable devices) within a venue boundary, i.e. venue cast. Content generated at an access terminal, is transmitted to a venue cast server. A venue-specific network could be a wide area network (WAN) or a Wi-Fi hotspot deployment. The system provides "unscheduled ad hoc deliveries" of content via the venue transmission system to provide venue visitors with venue related information. This system provides for one-way transmission of content. There is no mechanism for creating interaction between users and the venue cast server. There is no suggestion of creating a shared experience among users.
United States Published Patent Application No. 20110212683 illustrates a network operable within sports and entertainment venues to provide wireless data communications system nodes distributed throughout a sports and entertainment venue establishing a wireless communication network supporting communications with hand held devices. Each node must be a stand-alone node with its own server that is continuously synchronized with a central, synchronizing server. This increases expense of the system and complexity of communications.
U.S. Pat. No. 6,731,940 discloses methods of using wireless geolocation to customize content and delivery of information to wireless communication devices which send signals to a central control system. The method uses an RF receiving site including antenna array and a mobile device operated by a user. In a p-dimensional array, a vector is derived from RF signals sampled from p antennas of array to derive a location of the mobile device. Location-specific information is transmitted to a user, e.g., targeted advertisements or special services to travelers and shoppers. Interaction is not provided.
It has also not been possible to communicate specific messages to individual devices or groups of devices which are capable of interaction.

Directed wi-fi network in a venue integrating communications of a central concert controller with portable interactive devices


A hinged snow plow for an off-road vehicle is provided wherein a cowling is pivotally secured to the free end of an adapter. The adapter attaches to a tubular mounting means of a universal nature. The tubular mounting means which is modified, depending upon the off-road vehicle to which the snow plow is to be mounted. The combination of the adapter and tubular frame make the snow plow mountable to almost any off-road vehicle.

1. Field of the Invention
The present invention relates to snow plows. More particularly, the invention relates to a hinged snow plow for use on off-road vehicles. The snow plow is designed so that an adapter bracket is easily mounted to a tubular frame which is made in many variations so that the snow plow of the present invention can be mounted to practically any off-road vehicle.
2. Description of the Prior Art
Hinged snow plows have been known in the art for many years in relationship to the mounting of various types of snow plows on pickup trucks for use in commercial settings. One such snow plow that is known is disclosed in U.S. Pat. No. 4,658,519, issued on Apr. 21, 1987, to Phillip J. Quenzi. This patent discloses a hinged snow plow wherein a cowling is pivotally secured to the free end of a support frame which attaches to a vehicle in a manner such that the cowling pivots in a generally vertical plane about the free end of the frame. The blades of the snow plow are hinged to the cowling. However, this snow plow has a first and second stop means which are undesirable for use in off-road vehicles. Off-road vehicles generally lack adequate traction and are underpowered for moving and clearing areas of snow on a commercial basis or for expanded personal use. The provision of the stop means on the Quenzi snow plow under certain conditions requires additional power which the off-road vehicle simply does not have. Also, the hydraulic adjustment means are impractical for use on off-road vehicles since a source of hydraulic power is just not available. The U.S. Pat. No. 3,307,275, issued on Mar. 7, 1967 to E. A. Simi, and the U.S. Pat. No. 3,706,144, issued Dec. 19, 1972 to Miceli, also suffer from one or more of these problems. Thus, those skilled in the snow plow art have continued to search for solutions to these problems.


A suture for use in MIS surgery and tying internally in a body cavity using graspers extending through trocars in the body wall, the suture comprising a length of suture material suitable for fastening body tissue within the body cavity, the length having opposite end portions, and gripping means attached to at least one of the end portions. The gripping means, which may be formed and shaped to facilitate engagement and movement by graspers, may be a soft, sponge-like body attached to the length end or an elongated body in the shape of a paddle attached to the length end for use by a grasper in the movement of a body organ.

The present invention relates to sutures for use in laparoscopic/pelviscopic surgery, and more particularly to the provision of sutures which are more easily tied and secured in a body cavity using graspers extending through trocars in the body wall.
The present invention relates to suture tying or suture fastening in laparoscopic/pelviscopic surgery which is a rapidly growing field of surgery in this and other countries. Typically, a patient is anesthetized and placed on a surgery table for surgery. An initial very small opening, perhaps 12 mm in diameter, is made in the body wall for insertion of a scope or optic probe which will facilitate viewing inside the body cavity. In the case of the abdominal cavity, for instance, the cavity may be expanded by an insufflation process using carbon dioxide under pressure. This type of surgery is beginning to be well known as Minimally Invasive Surgery (MIS) or Less Invasive Surgery (LIS).
One of the well known problems with MIS or LIS is that the use of sutures is a very difficult task for many surgeons. The surgeon has to be able to tie a suture inside the body cavity using graspers which extend through trocars in the body wall. The surgeon has to do this tying while viewing the suture and the body tissue with which the suture is used on a television camera picking up the image through the scope or optic probe.
Many MIS or LIS procedures are accomplished today using very expensive disposable clip guns which apply titanium clips to various body conduits such as the cystic duct, artery or other blood vessel. Some of these clip guns may cost the hospital, for instance, more than $200 and up to as much as $280. These clip guns are so frail and intricate in design and made from plastic that they cannot be easily sterilized to be reusable after a surgery. They are simply loaded with a supply of, for instance, twenty clips to be used in a single MIS or LIS procedure and then disposed of with all of the other disposable equipment used in the procedure.
It is believed that more surgeons would use low-cost sutures and not use the more expensive titanium clips requiring the disposable clip guns in MIS or LIS if suture ligation was made easier inside the body cavity. In addition, many surgeons prefer the security of sutures over metal clips.
It is an object of the present invention, therefore, to provide a suture for use in MIS or LIS surgery and tying intracorporeally using graspers which extend through trocars in the body wall, the suture comprising a length of suture material suitable for fastening (approximating) body tissue within the body cavity. The suture length, of course, has opposite end portions. A gripping means is attached to at least one of the end portions of the suture length, the gripping means being formed and shaped to facilitate engagement and movement by the graspers conventionally used in MIS or LIS surgery to facilitate tying a knot in the suture length.
In one embodiment of the present invention, a needle will be attached (swedged on) to the other end portion of the suture length to facilitate penetration of the suture length through tissue, whereby the opposite end portions can then be tied by manipulating the gripping means and the needle.
Another object of the present invention is to provide such a gripping means which comprises a soft, sponge-like body attached to the suture length opposite end. This body may be generally elongated in the direction of the suture length to have a proximal end attached to an end portion of the length and a distal end extending away from the length. In another embodiment of the present invention, the body may be a wax-like or deformable material enclosing the suture end portion to be gripped by a grasper. This wax-like or deformable material may be made from a material which will be absorbable in the body cavity. The body may be impregnated with any suitable pharmaceutical material such as, for instance, an antibiotic agent.
In accordance with the present invention, the gripping means body is preferably of a diameter small enough to be placed through the body wall by passing through a cannula having an internal diameter in the range of 5 mm to 12 mm.
Another object of the present invention is to provide a ligation suture for use in tying off a body conduit such as the cystic duct, artery or other blood vessel inside a body cavity during MIS or LIS surgery procedures using graspers extending through trocars in the body wall, the suture comprising a length of suture material sufficiently long to accommodate the circumference of the targeted conduit and the knot to be tied, the length having opposite end portions. A gripping means is attached to each length end portion, the gripping means being formed to have a size larger in transverse cross section than the suture length cross section to facilitate gripping and controlled movement with the graspers.
The gripping means may comprise a body formed from a material more rigid than the suture material, and may be formed as an elongated body attached to the suture length. The elongated body may have a length greater than about three times its transverse cross sectional dimension. In some cases, the body may be shaped as a slightly curved paddle in the elongated direction for use in moving tissue deflecting an organ or encircling a structure to be ligated.
Further, the gripping means may be made of material or coated with material which is colored to be distinctive in the scope view or on the video screen.
Other objects and features of the present invention will become apparent as this description progresses.


The measurement of ejection tonnage in a die in forming process uses an embedded, in-die sensor and signal filtering methods for a more refined interpretation of the weaker signals associated with die vibrations. In particular, a self-tuning (adaptive) filter, matched to the embedded sensor, is used to reconstruct the stimulus of the die vibrations to reveal otherwise non-measurable knock-out tonnage parameters from the strain signal output by the sensor. Necessary information is obtained by means of a suitable dynamics identification procedure. Information necessary for self-tuning is obtained by means of a suitable die-set dynamics identification procedure.

In forming processes utilizing dies, and the like, it is often advantageous to sense or measure stress or strain experienced by the die during the knock-out of the part being formed. The knock-out tonnage, as it is called, associated with part ejection, may be used to monitor and diagnose the process being used (i.e., part phoscoating), and die conditions (i.e., in-process assessment of progressive wear, cracking or spalling). Signals relating to knock-out tonnage are typically also indicative of the level of, or need for, sufficient lubrication to maximize service life.
The proposition to utilize conventional sensors in dies used in forming processes is not always straightforward. In typical die-sets, for example, there are no convenient or suitable methods to locate load sensors on the ejecting anvil or along the centerline of the die, due to the moving parts and signal transmission requirements, or the substantiality of the required sensors. Furthermore, the sensors themselves in such environments are required to withstand the shock loads and vibrations which occur on the moving parts and along the centerline of the die for extended periods of time.
Accordingly, the need remains for an alternative method of measuring ejection force in the dies in forming processes, which can either withstand or avoid the need to experience ejection tonnage directly, but rather, utilize an alternative approach to calculate or estimate the forces involved.

In-die ejection force measurement in forming operations

National Center for Manufacturing Sciences


A tobacco water pipe for smoking loose leaf tobacco, the tobacco water pipe having a base and an elongated tube, the elongated tube being removably interlocked to the base of the tobacco water pipe. To removably interlock the base and the elongated tube, the base of the water pipe has a seat member which is at least partially embedded into the base of the tobacco water pipe and the elongated tube has a sleeve member which is affixed to the lower most portion of the elongated tube. The seat member of the base is configured to receive the sleeve member of the elongated tube. The sleeve member alone, or in connection with a collar member, is designed to interlock with the seat member, securely fastening the elongated tube to the base of the tobacco water pipe.

The present invention relates to a tobacco water pipe for loose tobacco, and more particularly, to a tobacco water pipe having an elongated tube which is easily removable from the base of the tobacco water pipe.
Tobacco water pipes have long been used to remove the nicotine and tar in tobacco smoke and to cool the tobacco smoke. By incorporating a water bath into the smoking pipes, the pipes are then able to filter and cool the smoke which makes smoking more enjoyable.
One problem with tobacco water pipes is that the construction of the water pipes makes it difficult to clean the water bath area between uses. Most often, the elongated tube of the tobacco water pipe is permanently affixed to the base of the tobacco water pipe making it difficult to reach the interior of the pipe which contained the water bath. Because the water bath acts to filter the smoke, the water bath becomes quickly saturated with tar deposits and other smoke particles. Thus, the water must be frequently removed from the tobacco water pipe and the pipe must be cleaned in order to prevent the build-up of tar and smoking particles in the interior of the pipe.
Another problem with the traditional tobacco water pipes is that the elongated tubes are made of acrylic or glass and are therefore easily broken. As previously mentioned, the elongated tubes are most always permanently affixed to the base of the tobacco water pipe. Thus, when an elongated tube is broken, the pipe is rendered virtually useless. Today, many tobacco water pipes come with decorative ceramic bases and this can make the replacement of an entire pipe rather expensive.


The switching regulator includes a voltage-to-current converter to convert a noise voltage into a noise current and output the noise current; and a sawtooth generator to output a sawtooth voltage signal having a frequency that varies in response to the noise current output from the voltage-to-current converter.

Example embodiments relate to a switching regulator, and more particularly, to a switching regulator capable of exhibiting reduced electromagnetic interference (EMI), a method of operating the switching regulator, and an electronic device including the switching regulator.
As EMI appears as a big problem in recent mobile communication systems, various techniques of reducing EMI have been developed.
Some devices employ a large filter and/or shielding in order to reduce EMI. However, these measures increase the cost and size of the device. The size of an EMI filter may be reduced by using a spread spectrum technique. However, this still has its own disadvantages.


A fire-fighting monitor includes a first body having an internal passageway defining an inlet and an outlet, a coupler having an internal passageway defining an inlet and an outlet, the coupler being pivotally mounted to the body at the outlet of the body wherein the internal passageway of the coupler is in communication with the internal passageway of the body, and the coupler having at least one pivot axis. Further, the monitor includes a counterbalance device, which comprises an annular member mounted to the first body at the pivot axis. The counterbalance device further comprises a pivot member mounted to the coupler and a second unitary body mounted about the pivot member, with the second unitary body being adapted to engage and generate an interference with an inner surface of the annular member when the coupler is pivoted about the pivot axis in a first direction and adapted to release the interference with the inner surface of the annular member when the coupler is pivoted about said pivot axis in an opposed second direction from the first direction.

The present invention is directed to a fire-fighting monitor and, more specifically, to a portable fire-fighting monitor that incorporates a safety system that controls the rotation of the monitor's nozzle to keep the monitor from overturning or moving due to the reaction force generated by the flow of fluid through the monitor.
Fire-fighting monitors include an inlet, which is connected to a hose or pipe, and a discharge outlet to which a nozzle or stream shaper is mounted. Monitors typically deliver a large quantity of fluid (typically water or foam) and, as a result, generate a reaction force that increases with an increase in the fluid flow and/or pressure. This reaction force extends in the opposite direction from the flow of the fluid and, therefore, can act on the monitor to create a moment about the base of the monitor, depending on the direction of the nozzle. For portable monitors, this reaction force can be destabilizing. When the nozzle is oriented so that the reaction force extends within the footprint (i.e. within the perimeter of the outer circumference of the monitor, which is defined by the ground contact points of the monitor's supports) of the monitor, there will be no destabilizing moment; though a translational force may be generated. However, when the reaction force does not pass through the footprint of a portable monitor, portable monitors are susceptible to overturning and/or sliding. Furthermore, the weight of the nozzle or stream shaper has a tendency to urge the nozzle or stream shaper to pivot downward, where the reaction force will have a greater tendency to tip or slide a portable monitor. While control over the flow of fluid through the monitor can reduce the reaction force to safe levels, conventionally portable monitors do not have manual shut-off valves. Instead, the flow of fluid through the monitor is limited through a valve at the fire truck or at the fire hydrant.
Various modifications have been proposed. However, many of these modifications increase the weight of the monitor and, further, complicate the assembly of the monitor. To facilitate the control of the reaction force, some monitors have incorporated one-way brakes. However, there is a need to provide a simplified assembly that can achieve greater control over the monitor, but without the attendant costs and complicated construction of some the prior art monitors.

Elkhart Brass Manufacturing Company, Inc.


An F-connector for terminating the end of a coaxial drop cable includes a tubular post and fastening nut, along with a modified form of body member. The body member outer wall includes a series of annular ridges, and the end of the body member includes a beveled surface. The F-connector includes a collar assembly that incorporates a gripping ring. The collar assembly has a central passage for receiving the end of the coaxial cable. One end of the collar assembly has an internal bore of a diameter commensurate with the outer diameter of the body member; the internal bore also has annular ridges formed thereon which frictionally engage the ridges on the outer wall of the body member. A compression tool longitudinally compresses the collar assembly over the body member during installation, causing the beveled surface of the body member to cam the gripping ring inwardly toward the tubular post, securing the outer jacket and conductive braid of the coaxial cable therebetween.

1. Field of the Invention
The present invention relates generally to so-called F-connectors used primarily in the cable television industry to connect coaxial cables to threaded ports, and more particularly to such F-connectors that are installed using an axial compression tool.
2. Description of the Related Art
Coaxial cable F-connectors are often used to terminate a drop cable in a cable television. system. The coaxial cable typically includes a center conductor surrounded by a dielectric, in turn surrounded by a conductive foil/grounding braid; the conductive foil/grounding braid is itself surrounded by a protective outer jacket The F-connector is secured over the prepared end of the jacketed coaxial cable, allowing the end of the coaxial cable to be threadedly connected with a threaded port of a terminal block.
Crimp style F-connectors are known wherein a crimp sleeve is included as part of the connector body. A special radial crimping tool, having jaws that form a hexagon, is used to radially crimp the crimp sleeve around the outer jacket of the coaxial cable to secure such a crimp style F-connector over the prepared end of the coaxial cable. Examples of such crimp connectors are disclosed within U.S. Pat. No. 4,400,050 to Hayward, assigned to Gilbert Engineering Co., Inc.; and U.S. Pat. No. 4,990,106 to Szegda, assigned to John Mezzalingua Assoc. Inc.
It is known in the art that the passage of moisture between the coaxial cable jacket and the surrounding F-connector can lead to corrosion, increased contact resistance, reduced signal strength, and excessive RF leakage from the connector. Those skilled in the art have made various efforts to form a seal between the F-connector and the jacket of the coaxial cable to preclude such moisture ingress. F-connectors are known in the cable television industry wherein special sealing compounds are included in an effort to form leakproof seals. For example, U.S. Pat. No. 4,755,152 to Elliot, et al., and assigned to Tele-Communications, Inc. discloses a crimp connector incorporating a glob of a gel or other movable sealing material within a cavity of the connector to form a seal between the jacket of the coaxial cable and the interior of the F-connector.
Still another form of F-connector is known wherein an annular compression sleeve is used to secure the F-connector over the prepared end of the cable. Rather than crimping a crimp sleeve radially toward the jacket of the coaxial cable, these F-connectors employ a plastic annular compression sleeve that is initially attached to the F-connector, but which is detached therefrom prior to installation of the F-connector. The compression sleeve includes an inner bore for allowing such compression sleeve to be passed over the end of the coaxial cable prior to installation of the F-connector. The F-connector itself is then inserted over the prepared end of the coaxial cable. Next, the compression sleeve is compressed axially along the longitudinal axis of the connector into the body of the connector, simultaneously compressing the jacket of the coaxial cable between the compression sleeve and the tubular post of the connector. An example of such a compression sleeve F-connector is shown in U.S. Pat. No. 4,834,675 to Samchisen and assigned to LRC Electronics, Inc.; such patent discloses a compression sleeve type F-connector known in the industry as "Snap-n-Seal". A number of commercial tool manufacturers provide compression tools for axially compressing the compression sleeve into such connectors; for example, the CablePrep division of Ben Hughes Communication Products Company of Chester, Connecticut sells such a hand-operated compression tool under the commercial designation "Terminx".
The aforementioned "Snap-n-Seal" compression connector requires substantial manipulation by an installer. The installer must detach the annular compression sleeve from the connector, slide the compression sleeve over the end of the coaxial cable, then install the connector, and finally compress the compression sleeve into the body of the connector. During assembly, the compression sleeve can easily become lost. In addition, such "Snap-n-Seal" connectors are significantly more expensive than conventional crimp style connectors. Moreover, such "Snap-n-Seal" connectors often exhibit excessive RF leakage of electromagnetic signals passing therethrough. In addition, because the annular compression sleeve of such "Snap-n-Seal" connectors must allow the coaxial cable to pass therethrough but must also compress the coaxial cable, the range of cable sizes that can be accommodated by any specific compression sleeve is limited.
It is known in the coaxial cable field generally that collars or sleeves within a coaxial cable connector can be compressed inwardly against the outer surface of a coaxial cable to secure a coaxial cable connector thereto. For example, in U.S. Pat. No. 4,575,274 to Hayward and assigned to Gilbert Engineering Company Inc., a connector assembly for a signal transmission system is disclosed wherein a body portion threadedly engages a nut portion. The nut portion includes an internal bore in which a ferrule is disposed, the ferrule having an internal bore through which the outer conductor of a coaxial cable is passed. As the nut portion is threaded over the body portion, the ferrule is wedged inwardly to constrict the inner diameter of the ferrule, thereby tightening the ferrule about the outer surface of the cable. However, the connector shown in the Hayward '274 patent is much more expensive than conventional F-connectors and can not be installed quickly, as by a simple crimp or compression tool; rather, the mating threads of such connector must be tightened, as by using a pair of wrenches.
Accordingly, it is an object of the present invention to provide a simple and inexpensive F-connector that can be quickly installed using conventional F-connector installation tools.
It is another object of the present invention to provide such an F-connector that does not require any threaded, rotational movement of the connector components during installation in order to secure such connector over the end of the coaxial cable.
It is still another object of the present invention to provide such an F-connector which forms a reliable moisture proof seal between the F-connector and the jacket of the coaxial cable to preclude moisture from passing between the F-connector and the jacket of the coaxial cable extending therein, while avoiding the need for gels or other sealing compounds.
It is a further object of the present invention to provide such an F-connector which minimizes RF leakage from such connector.
A still further object of the present invention to provide such an F-connector that is shipped to a user as a one-piece structure, and which is installed onto the end of a coaxial cable as a one piece structure without detachment of any components, in order to simplify the installation of such connector over the end of a coaxial cable, and to avoid the loss of detachable components.
Yet another object of the present invention is to provide such an F-connector that is capable of being used with a wide range of coaxial cable braids and still form a leakproof seal with the outer jacket of the coaxial cable.
These and other objects of the present invention will become more apparent to those skilled in the art as the description of the present invention proceeds.


DNA constructs comprising DNA sequences encoding fruit-ripening-related proteins may be transformed into plants to modify plant characteristics (particularly fruit quality). New DNA sequences are disclosed; cDNA and genomic clones have been deposited; new fruit-ripening-related promoter sequences may also be obtained. Sense and antisense constructs for plant transformation are described. Genetically modified plants may be used to produce improved fruit and may also be used in breeding programs to produce hybrid seed.

Considering the large number of complex pathways involved in the fruit ripening process, and despite construction and screening of many tomato fruit cDNA libraries in the past decade, surprisingly few fruit- or ripening-specific genes and their functions have been identified. In order to address this specific area a new cDNA library was constructed (pERT clone series, Early Ripening Tomato) from the pericarp of a very early ripening stage of wild-type tomato fruit and differentially screened against mRNA obtained from the pericarp of ripening inhibitor (rin) mutant fruit of a similar developmental stage.
The rin mutation, first reported in 1968, is recessive, maps to chromosome 5 and is closely linked to the macrocalyx locus. It has pleiotropic effects on ripening, resulting in an extremely retarded ripening phenotype. Fruit demonstrate an increased resistance to many common post harvest pathogens and have been maintained for years without further signs of normal ripening or deterioration. Following extensive storage of fruit seeds may germinate and grow precociously within the fruit. Other aspects of plant growth and early fruit development appear unaffected by the rin mutation. However, the rin fruit fail to attain a normal level of pigmentation as a result of decreased accumulation of carotenoids, particularly lycopene, and there is a decreased rate of chlorophyll loss so that rin fruit remain green when wild-type fruit are fully red. The rin fruit eventually "ripen" to a lemon yellow colour after several weeks. These mutant fruit also fail to achieve normal flavour or aroma which has been correlated with the reduced production of a number of aromatic compounds.
Despite these considerable shortfalls the rin mutation is used in the heterozygous state in commercial tomato production, as in such a genetic state the deficiencies of the homozygous rin mutation regarding fruit quality are at least partially overcome. The major benefit of rin heterozygous tomatoes is the maintained firmness which gives the tomato improved handling characteristics particularly for fresh market applications.
Examination of total proteins of wild-type and rin pericarp reveals differences during ripening, some proteins being more abundant and others reduced in the mutant fruit as compared to wild-type. In vitro translation profiles suggest that such changes are the result of altered gene expression in the mutant fruit. Subsequent analysis with ripening-related cDNA clones showed altered patterns of accumulation of several mRNAs in the mutant fruit, suggesting that the rin mutation effects expression of many ripening-related genes.
At the onset of ripening, rin fruit do not show the autocatalytic rise in ethylene evolution characteristic of normal tomato fruit and ripen essentially as non-climacteric fruit. Therefore, it has been suggested that the rin mutation may affect ethylene receptors end thus lead to the retarded ripening phenotype. However, there is evidence that rin fruit are able to perceive ethylene but ethylene alone is unable to reverse the mutant phenotype. Application of high levels of exogenous ethylene does induce red pigmentation in rin fruit and leads to an increase in respiration rate but fails to induce autocatalytic ethylene production. Ethylene treatment also restores accumulation of some ripening-related mRNAs which are substantially reduced in the mutant fruits namely those homologous to PTOM 5 (phytoene synthase), pTOM 13 (ethylene-forming enzyme), pTOM 99 (now known to be encoded by the ethylene responsive gene E8) and E4, but fails to significantly increase accumulation of polygalacturonase (pTOM 6) mRNA.
rin fruit, as a non-climacteric background, have been used to examine transcriptional activation and accumulation of a number of ethylene-responsive genes. These experiments indicate that rin effects both transcriptional and post-transcriptional events. Transcription of both polygalacturonase and E4 genes, and thus subsequent mRNA accumulation, are effectively abolished in rin fruit. In contrast, transcription of the E8 (pTOM 99) and J49 genes is reduced and their homologous mRNAs accumulate at a reduced level. In the case of the E17 gene, the rin mutation appears to have no effect on transcription, but mRNA accumulation is severely impaired.
In view of the extreme nature of the rin ripening mutant and its diverse effects at the molecular level, where it affects the expression of many ripening-related genes, it is not an ideal breeding tool. However due to the nature of the mutation, we decided to use rin fruit mRNN as a probe to isolate fruit ripening-related cDNAs. A cDNA library produced from mRNA isolated from the pericarp of wild-type tomato fruit (Lycopersicon esculentum Mill. cv Ailsa Craig) at the first visible sign of fruit ripening was differentially screened to identify clones whose homologous mRNAs were present at various levels in fruit of the tomato ripening mutant, ripening inhibitor (rin). We have now isolated, characterized and sequenced a series of new cDNA clones whose homologous mRNAs show altered patterns of expression in rin fruit during ripening.

DNA encoding fruit-ripening-related proteins, DNA constructs, cells and plants derived therefrom


A variable resistor includes a first resistor having linear resistance or attenuation characteristic, a second resistor disposed along the first resistor and having the linear resistance or attenuation characteristic, and a slider for bridging the first and second resistors, wherein one end of each of the first and second resistors is connected with each other.

1. Field of the Invention
The present invention relates to variable resistors and, more particularly, is directed to a slide type variable resistor suitable for use as a volume controller.
2. Description of the Prior Art
A variable resistor is generally represented in the drawings by a resistor 1 and a slider 2, as shown in FIG. 1A. However, in a practical variable resistor, a conductive thin lead 3 for current collection is disposed along the main resistor 1, and the lead 3 and the resistor 1 are bridged by the slider 2 as shown in FIG. 1B.
The variable resistor for use as a volume controller is required, as is well known, to have a logarithmic resistance characteristic in resistance change thereof, and so the variable resistor having a so-called A-curve resistance characteristic is utilized for controlling the volume.
In order to realize the variable resistor having the non-linear resistance characteristic, the following two manufacturing methods have been proposed.
In the first method, resistors having different resistance values are printed many times.
In the second method, a trimming process of the resistor pattern is performed after the printing of the resistor.
However, the second method has the disadvantage such that many numbers of processings are required after the printing process of the resistor, thereby remarkably increasing the cost of the variable resistor.
In the first method, since the accuracy of the resistance characteristic depends on the accuracy of the printing of resistors, the resistance characteristic fluctuates for every variable resistor.
When two variable resistors having different resistance characteristics due to the fluctuation, for example, are interconnected with each other so as to be cooperated and used to control the volume of stereophonic sound, the position of a reproduced sound image disadvantageously fluctuates to the righthand or lefthand side.
A sound control console in a broadcasting station or the like employs a slide type variable resistor since the adjusting position can be visually recognized. In this case, if the resistance characteristic fluctuates at every variable resistor, a difference between an actual attenuation degree of the variable resistor and a scale of attenuation degree thereof on the sound control console will disadvantageously fluctuate for every variable resistor.
In particular, when the variable resistors having different resistor characteristics are employed in a multi-channel mixer, many adjusting levers interlinked with the sliders of the resistors, which are to be arranged in a linear line, are arranged in a zigzag fashion. Thus, in this case, the adjustment of volume may be seen to be erroneous for an operator.


A plate assembly has a plate member (1, 21, 101) having a recessed portion (3, 23, 103), and a lid member (2, 22, 102) mounted on the plate member to cover the recessed portion. A gap is formed between the plate member and the lid member around the recessed portion so as to allow a liquid to permeate the gap due to capillarity while preventing the liquid from entering the recessed portion. If the liquid is an adhesive, the lid member (2, 22) is bonded to the plate member (1, 21), the plate member having a bonded surface (4, 26) which is formed so as to surround the recessed portion (3, 23), the plate member having an adhesive relief portion (25) which is formed around the bonded surface so as to be recessed from the bonded surface, the gap being formed between the bonded surface and the lid member so as to allow the adhesive to permeate the gap due to capillarity. If the liquid may be a filler, the plate member (101) has a sealing surface (105) which is formed so as to surround the recessed portion (103), the plate member having a lid member fixing surface (107) which is separated from the sealing surface by a pass partition groove (106), the lid member (102) being fixed to the lid member fixing surface to form the gap between the sealing surface and the lid member so as to allow the filler to permeate the gap due to capillarity.

1. Field of the Invention
The present invention generally relates to a plate assembly. More specifically, the invention relates to a plate assembly capable of being widely used as a micro chip or the like (e.g. a capillary electrophoresis chip) which is used in a technical field called the integrated chemistry.
2. Description of the Prior Art
In recent years, there is known a technique called the integrated chemistry for preparing a fine groove having a width and depth of about tens to two hundreds micrometers in a micro chip of a glass or plastic, to use the fine groove as a liquid passage, a reaction vessel or a separation/purification detecting vessel, to integrate a complicated chemical system into the micro chip. According to such an integrated chemistry, a micro chip (Lab-on-chip) having a fine groove capable of being used in various tests is called a total analytical system (μ-TAS) if the use of the micro chip is limited to analytical chemistry, and the micro chip is called a micro reactor if the use of the micro chip is limited to a reaction. When various tests, such as analyses, are carried out, the integrated chemistry has advantages that the time to transport diffusible molecules is short due to its small space and that the heat capacity of a liquid phase is very small. Therefore, the integrated chemistry is noticed in the technical field wherein a micro space is intended to be utilized for carrying out analysis and chemical synthesis. Furthermore, the term "test" means a test carried out by any one or combinations of operations and means, such as analysis, measurement, synthesis, decomposition, mixing, molecular transportation, solvent extraction, solid phase extraction, phase separation, phase combination, molecular uptake, culture, heating and cooling.
In such an integrated chemistry, a capillary electrophoresis chip used in a test in the field of, e.g. biochemistry, has a fine groove or circular recessed portion having a width and depth of 10 to 200 micrometers in the chip of a glass or plastic, to use the fine groove or recessed portion as a liquid passage or reaction vessel to separate and identify a very small amount of vital materials, such as nucleic acids and proteins, and other low molecular materials, and to handle materials having a very small volume of nanoliters to picoliters. Therefore, it is required to precisely form the fine groove.
As methods for forming a fine groove (a hollow portion) in a glass or plastic, there are blow molding and lost-core methods. It is difficult for these methods to precisely form a fine groove having a cross section tens micrometers square. Therefore, there is adopted a method for forming a fine groove in a surface of a glass or plastic plate to bond a lid member (another plate) to the surface of the plate having the fine groove. As methods for bonding two plates, there are generally known ultrasonic welding, vibrating welding, laser beam welding, insert molding (see Japanese Patent Laid-Open No. 11-58467) and adhesion (see Japanese Patent Laid-Open Nos. 2000-246092 and 2000-288381).
However, in the ultrasonic welding and vibrating welding, materials to be bonded to each other are locally melted, so that there is the possibility that a hollow portion having a cross section, e.g. about tens micrometers square, may be deformed. In addition, it is required to use a special equipment to increase costs. Therefore, the ultrasonic welding and vibrating welding can not be adopted.
In the laser welding, it takes a lot of welding time when the shape of the fine groove is complicated, and it is required to use a special equipment, so that there is a problem in that production costs are increased.
In the insert molding disclosed in Japanese Patent Laid-Open No. 11-58468, a plastic plate having a fine groove is previously housed in a cavity of an injection molding die, and a film covering the fine groove is arranged on the surface of the plastic plate. Thereafter, a plastic to be formed as a lid member is injected into the cavity to form a capillary electrophoresis chip. In the insert molding, there are problems in that the shape of the die is complicated and production costs are increased.
In the adhesion, a lid member is fixed to the surface of a plate having a fine groove with an adhesive. If the lid member is simply pasted on the plate, there is some possibility that the adhesive is extruded into the fine groove so that the adhesive entering the fine groove changes the cross section of the fine groove or fills up the fine groove. However, if it is possible to prevent such troubles from being caused, it is possible to efficiently form a capillary electrophoresis chip at low costs without the need of any special equipment.
Therefore, as disclosed in Japanese Patent Laid-Open Nos. 2000-246092 and 2000-288381, there has been developed a technique wherein an energy line curable composition is used as an adhesive to irradiate a part of the adhesive other than that in a fine groove with energy lines to harden the part of the adhesive to wash and remove only the adhesive in the fine groove with a solvent. However, there are problems in that it is difficult to simply carry out such a technique in an actual production field considering productivity and that such a technique requires an expensive equipment.


A dynamic random access memory's (DRAM's) electrostatic discharge (ESD) protection circuit structure and its method of manufacture, wherein the ESD protection circuit and the capacitors are formed at the same time. The ESD protection circuit has a heavily doped drain structure so that hot carriers can be recruited for discharging electrostatics and a better electrostatic discharge protection can be achieved. Furthermore, no additional electrostatic discharge implant operations are necessary.

1. Field of Invention
The present invention relates to a method of fabricating dynamic random access memory. More particularly, the present invention relates to an electrostatic discharge protection circuit structure of a dynamic random access memory and its method of manufacture.
2. Description of Related Art
Dynamic random access memory (DRAM) is a type of memory whose data are stored in an array of capacitors above a semiconductor substrate. The kind of data stored depends on the charging state of a capacitor. In general, a single bit of data is stored in a capacitor. A fully discharged capacitor represents a logic state of "0" while a fully charged capacitor represents a logic state of "1". If the electrodes of a capacitor in a DRAM are assembled correctly and the dielectric layer is uniformly built, the area of the electrode determines the amount of charges stored in a capacitor when the specified operating voltage is applied.
Read/write operation of a capacitor is achieved by selectively coupling the capacitor to a bit line so that electric charges can flow to the capacitor. Selective coupling of the capacitor is obtained through a transfer field effect transistor (transfer FET). Normally, the bit line is connected to one of the source/drain terminals of the transfer FET, and the other source/drain terminal of the transfer FET is connected to the capacitor. A word line is connected to the gate terminal of the transfer FET. By applying proper signal to the word line, flow of electric charges between the bit line and the capacitor can be controlled.
In general, in the fabrication of a capacitor over bit-line (COB) DRAM structure, an electrostatic discharge (ESD) protection circuit is also formed to protect the DRAM against any accidental damage due to external electrostatic discharge.
FIGS. 1A through 1G are cross-sectional views showing the progression of manufacturing steps in fabricating the electrostatic discharge protection circuit and capacitor of a DRAM according to a conventional method.
First, a semiconductor substrate 10 is provided as shown in FIG. 1A, and then an isolating structure 12 is formed over the substrate 10 defining a device region 14 and an ESD protective circuit region 16. The isolating structure 12 can be a shallow trench isolating structure or a field oxide layer, for example. Thereafter, a gate oxide layer 18, a polysilicon layer 20 and an oxide layer 22 are formed sequentially over the substrate structure.
Next, the oxide layer 22, the polysilicon layer 20 and the gate oxide layer 18 are patterned in sequence as shown in FIG. 1B. Ultimately, gate structures 24 and 26 are respectively formed in the device region 14 and the ESD protective circuit region 16. The gate structures 24 and 26 are both composite layers composed of a gate oxide layer 18a, a polysilicon layer 20a and an oxide layer 22a. In the subsequent step, an ion implant operation is carried out to implant ions into the semiconductor substrate 10 on the sides of the gate structures 24 and 26 to form lightly doped drain (LDD) source/drain regions 28 and 30.
Next, as shown in FIG. 1C, a layer of silicon nitride material having a thickness of about 1000 .ANG. is deposited over the substrate structure using, for example, a plasma-enhanced chemical vapor deposition (PECVD) method. Subsequently, the silicon nitride layer is etched back to form spacers 32 and 34 on the sidewalls of the gate structures 24 and 26 using, for example, an anisotropic etching method. Thereafter, a second ion implantation is carried out to implant ions into the substrate to form heavily doped source/drain regions 28a, 28b and 30a. Later, a dielectric layer 36 is formed covering the entire substrate structure using, for example, a low-pressure chemical vapor deposition (LPCVD) method. The dielectric layer 36 can be made from tetra-ethyl-ortho-silicate (TEOS), for example.
Next, as shown in FIG. 1D, the dielectric layer 36 is patterned by first forming a photoresist layer. Then, a contact opening 38 that expose the source/drain region 28b (for example, a source region) is formed in the device region 14 using, for example, a dry etching method. The contact opening 38 is subsequently used to form a bit line. Thereafter, the photoresist layer is removed, and a doped polysilicon layer 40 having a thickness of about 1000 .ANG. is formed over the substrate structure using, for example, a low-pressure chemical vapor deposition method. The doped polysilicon layer 40 also completely fills the contact opening 38 to make an electrical contact with the exposed source/drain region 28b.
Next, the polysilicon layer 40 is patterned to form a polysilicon layer 40a using conventional photolithographic and etching processes as shown in FIG. 1E. The polysilicon layer 40a serves as a bit line for the DRAM. Thereafter, a dielectric layer 42 having a thickness of about 7000 .ANG. is formed over the dielectric layer 36 and the polysilicon layer 40a using, for example, a plasma-enhanced chemical vapor deposition method. The dielectric layer 42 can be made from material including phosphosilicate glass (PSG). Subsequently, the dielectric layer 42 and the dielectric layer 36 in the device area 14 are sequentially etched to form contact openings 44 of the capacitor using, for example, a dry etching method. The contact openings expose the source/drain regions 28a. Then, a polysilicon layer 46 is formed over the entire substrate structure. The polysilicon layer 46 also fills the contact openings 44 so that the exposed source/drain regions 28a are electrically connected.
Next, as shown in FIG. 1F, conventional photolithographic and etching techniques are used to pattern the polysilicon layer 46 forming a polysilicon layer 46a. The polysilicon layer 46a functions as the lower electrode of a DRAM capacitor. Thereafter, a dielectric layer 48 and another polysilicon layer 50 are sequentially formed over the lower electrode. The dielectric layer 48, for example, can be an oxide/nitride/oxide (ONO) composite layer, and the polysilicon layer 50 functions as the upper electrode of the DRAM capacitor. Subsequently, a borophosphosilicate glass (BPSG) layer 52 is formed over the entire substrate structure using, for example, a plasma-enhanced chemical vapor deposition method. After that, the BPSG layer 52, the dielectric layer 42 and the dielectric layer 36 in the ESD protection circuit region 16 are sequentially patterned to form contact openings 54 and 56 using, for example, a dry etching method. The contact opening 54 exposes the gate structures 26, while the contact opening 56 exposes the source/drain regions 30a.
Next, as shown in FIG. 1G, conductive material such as tungsten is deposited over the substrate structure to form a conductive layer 58 using a chemical vapor deposition method, for example. The conductive layer 58 also fills the contact openings 54 and 56 so that the exposed gate structures 26 and the exposed source/drain regions 30a are electrically connected. Subsequently, the conductive layer 58 is patterned to form the DRAM's ESD protection circuit as shown in FIG. 1G.
Finally, subsequent operations necessary for forming the DRAM structure is performed. Since those manufacturing operations are familiar to semiconductor technologists and have no direct relation to this invention, detailed description is omitted here.
In the aforementioned method of production, the ESD protective circuit and the capacitors are completed at the same time without additional operations. However, the conventional DRAM's ESD protective circuit has a lightly doped drain (LDD) structure. Therefore, the degree of utilization of hot carrier in electrostatic discharge is low, and hence the extent of electrostatic discharge protection is poor. Consequently, DRAM may be insufficiently protected and damages caused by electrostatic discharge may be common.
In light of the foregoing, there is a need to provide an improved ESD protective circuit structure for DRAM together with the method of fabricating the structure.

Method of forming electrostatic discharge protection structure of dynamic random access memory


The invention relates to a method of changing allocation of Serving-Call Session Control Functions (S-CSCFs) to a user of an IMS network. The user is being provided with services via a first S-CSCF allocated to the user. The method includes implementing a re-allocation instruction at the first S-CSCF. The reallocation instruction includes criteria for de-allocation of the user from the first S-CSCF. The S-CSCF determines if the criteria are met; and if the criteria are met, de-allocates the user.

IP Multimedia Subsystem (IMS) is the technology defined by the Third Generation Partnership Project (3GPP) and ETSI TISPAN group to provide IP Multimedia services over mobile communication networks. (This technology is described in various technical documents some of which are referenced in the following description, and include 3GPP TS 22.228, TS 23.228, TS 24.229, TS 29.228, TS 29.229, TS 29.328 and TS 29.329 Releases 5 to 7, and TS24.173 Release 7.) IMS provides key features to enrich the end-subscriber person-to-person communication experience through the use of standardised NS Service Enablers, which facilitate new rich person-to-person (client-to-client) communication services as well as person-to-content (client-to-server) services over IP-based networks.
The IMS makes use of the Session Initiation Protocol (SIP) to set up and control calls or sessions between subscriber terminals (or subscriber terminals and application servers). Whilst SIP was created as a subscriber-to-subscriber protocol, IMS allows operators and service providers to control subscriber access to services and to charge subscribers accordingly.
By way of example, FIG. 1 illustrates schematically how the IMS fits into the mobile network architecture in the case of a GPRS/PS access network (IMS can of course operate over other access networks). Call/Session Control Functions (CSCFs) operate as SIP proxies within the IMS. The 3GPP architecture defines three types of CSCFs: the Proxy CSCF (P-CSCF) which is the first point of contact within the IMS for a SIP terminal; the Serving CSCF (S-CSCF) which provides services to the subscriber; and the Interrogating CSCF (I-CSCF) whose role is to identify the correct S-CSCF and to forward to that S-CSCF a request received from a SIP terminal via a P-CSCF.
Within the IMS service network, Application Servers (ASs) are provided for implementing IMS service functionality. Application Servers provide services to end users in an IMS system, and may be connected either as end-points over the 3GPP defined Mr interface, or "linked in" by an S-CSCF over the 3GPP defined ISC interface.
The S-CSCF is the central node of the signaling plane. It is a SIP server, but performs session control as well. It uses Diameter Cx and Dx interfaces to download and upload user profiles to/from the user's Home Subscriber Server (HSS). The S-CSCF handles SIP registrations, and is in the path of all signaling messages, so that it can inspect every message in a session. It decides to which application server(s) the SIP message will be forwarded for the provision of services and it provides routing services. Most IMS networks will include multiple S-CSCFs to ensure availability of services to users and to distribute the signaling load. These S-CSCFs may be located over a wide geographical area.
According to current standards (see 3GPP TS 23.380) if a S-CSCF fails, the registration state of the failed S-CSCF can be restored at another S-CSCF so that operations can continue. However, when the user equipment (UE) that was allocated to the failed S-CSCF has been re-allocated to the new S-CSCF, this new S-CSCF may be located in a different region of the country than the UE. For example, the UE and the S-CSCF originally allocated to it may be in the West Coast region of the USA, whereas the new S-CSCF is in the East Coast region. It is clearly less efficient to direct signals over large distances, but for as long as the original S-CSCF is out of action, this may be acceptable. When the S-CSCF originally allocated to the user (which may be geographically close), it is preferable to switch the user back to this original S-CSCF.
Various proposals have been made for switching a user over to the "optimal" S-CSCF. One proposal is to use Administrative Deregistration procedures according to 3GPP TS 29.228. However, this will always terminate any existing sessions and dialogs that exist in the S-CSCF. This means that if the user is in a call, the call will be terminated.
Another proposal is to use re-selection procedures initiated by the I-CSCF. In this case, the I-CSCF first detects that the current S-CSCF is not optimal and needs to be re-selected, and secondly probes the current S-CSCF to check if there are active sessions in the current S-CSCF, and if not, selects a new, more optimal S-CSCF. (See 3GPP TR23.812 and until the latest version of this Technical report is available, see SA2 contribution S2-091406). One drawback with this proposal is that the re-allocation can only be done during a re-registration procedure. In addition, new functionality needs to be introduced both to detect that the S-CSCF needs to be changed and to re-select it. Furthermore, the proposed solution will introduce a new forking behavior in the I-CSCF (i.e., first try the current S-CSCF, and then try the new S-CSCF). This makes the I-CSCF stateful and changes the underlying principle of the I-CSCF functionality. These changes in the I-CSCF would also be quite expensive to implement. Finally, race conditions may arise if two UEs attempt to register at the same time.
In addition, neither of the proposed solutions described above take into account that even when a UE is not registered in IMS, a S-CSCF may still be allocated to a user for unregistered services.

Reallocation of serving proxy function in IMS