A process of removing particles from the surface of a substrate to be processed in a vacuum chamber comprising forming a plasma from an inert plasma precursor gas in said chamber, thereby lifting loosely adhered particles from the surface of the substrate, and increasing the flow of said inert gas without increasing the pressure in the vacuum chamber, thereby sweeping the particles beyond the surface of the substrate, where they can be removed by the vacuum chamber exhaust system. Particles having a particle size of about 0.1 micron or larger can be removed in this fashion.

In the manufacture of microelectronic devices, particularly VLSI and ULSI devices, in which the overall dimensions of devices are becoming bigger and more closely packed, and the critical dimensions are becoming much smaller, particle contamination is of increasing concern. The presence of particles during deposition or etching of thin films can cause voids, dislocations or shorts which adversely affect performance and reliability of the devices.
The problem of contaminant particles was addressed initially by improving the quality of clean rooms and improving automated equipment to handle materials and semiconductor substrates, e.g., silicon wafers. Improved cleaning of wafer surfaces was also addressed. These improvements have greatly reduced the number of particles that are present or fall onto a wafer surface during the processing cycle. However, many particles are generated inside the wafer processing chambers themselves due to the materials formed or used for processing and due to mechanical manipulations, for example the rubbing movements of robotic equipment during substrate transfer operations and the like.
In particular during processing that uses a plasma, many fragments of various kinds are generated from the processing gases, including ions, electrons, uncharged particles and the like. The plasma generated fragments can combine to form generally slightly negatively charged particles, i.e., on the order of 10.sup.4 negative charge. In addition, the processing chamber becomes coated with various materials, such as polymers, during plasma processing of a wafer. Stress, such as stress due to thermal cycling and the like, causes these films to fracture and dislodge from the walls and surfaces on which they have deposited, also generating particles. In addition, particles are generated within the processing chambers during wafer transfer operations, pump oil backstreaming and the like.
Selwyn et al have disclosed one solution to avoiding deposition of particles onto a wafer. They redesigned the wafer support electrode to provide grooves therein which provide a disturbance around the periphery of the wafer, and beyond the wafer surface. This attracts particles to this disturbed region beyond the wafer so that the vacuum chamber exhaust system can carry particles away from the wafer and outside of the processing system. While a reduction of particles of up to 70% is said to be obtained, it does require redesign of wafer support electrodes and retrofitting of existing equipment, which is expensive.
Selwyn et al have also suggested that during plasma processing, particles form and collect at the plasma/sheath boundary. At the end of plasma processing when the RF power is shut off, these particles fall onto the wafer. They further teach that this is a major source of particulate contamination of wafer surfaces in a plasma chamber. They suggested that the number of particles be reduced by turning off the RF power slowly, so that particles are released from the sheath region more slowly, and can be evacuated by the chamber exhaust system rather than drop onto the wafer. This solution however is uncontrollable at best.
It would be highly desirable to develop a reliable, inexpensive process to remove particles from substrate surfaces and from plasma processing chambers.

Reducing particulate contamination during semiconductor device processing


A mobile communication terminal for transmitting/receiving image data over a group communication network includes: a push-to-talk (PTT) key for requesting a transmission right in a group communication mode; a vocoder for encoding a user voice signal received via a microphone; a memory for storing various image data; a controller for combining voice data received from the vocoder with the image data read from the memory to form a packet, or separating the image data from the received packet to perform an output control process; and a transceiver for transmitting packet data received from the controller to a group communication management center, or receiving the packet data from the group communication management center.

1. Field of the Invention
The present invention relates to a method for transmitting/receiving image data using a mobile communication terminal, and more particularly to a method for transmitting both image data and voice data in a group communication system capable of performing a push-to-talk function.
2. Discussion of the Related Art
Generally, a group communication system well known to the art as a point-to-multipoint (PTM) communication system or a push-to-talk (PTT) communication system is indicative of a system for allowing only one user, who has an exclusive transmission right during a predetermined time, to transmit desired information to other network members. Typically, the above-mentioned group communication system includes a plurality of transceivers, and the transceivers are tuned to the same frequency (i.e., the same channel). If a user, who has a transmission right and desires to send his or her voice signal to a called party, presses a PTT switch 110 positioned at one side of a mobile terminal 100 shown in FIG. 1, the mobile terminal 100 transmits the voice signal to the called party. If the user takes his or her finger off of the button 110, the mobile terminal 100 enters a reception mode. If there is a method for determining which one of persons will transmit the next message, predetermined users share the same frequency with one another.
FIG. 2 is a conceptual diagram illustrating a group communication system. Referring to FIG. 2, the group communication system includes a plurality of wireless telephones 211, 212, and 213, first and second base stations 221 and 222, and an Internet-, Intranet-, or Extranet server 230. The first wireless telephone 211 and the second wireless telephones 212 wirelessly communicate with the first base station 221. The first base station 221 communicates with the Internet-, Intranet- or Extranet server 230 over the Internet, the Intranet, or the Extranet. In fact, a large number of routers and other devices are included in the group communication system shown in FIG. 2. The third wireless telephone 213 wirelessly communicates with the second base station 222. The second base station 222 communicates with the Internet-, Intranet, or Extranet server 230 over the Internet, Intranet, or Extranet.
A communication scheme based on the above-mentioned group communication system provides a caller user and a called party with only a voice exchange service. Therefore, if there is a meeting of a certain group at a specific meeting place, the caller user may have difficulty in explaining the meeting place to the called party. In order to verbally explain the above-mentioned meeting place using the PTT service, most users must verbally explain the meeting place to their called parties several times.
Therefore, some users may frequently transmit a rough map including position information of the meeting place to their called parties. In this case, if raw data of the rough map image is transmitted to the called parties without any change, large amounts of data are created. Also, if a group communication caller user transmits an image configured in the form of a file, no problem occurs in the image transmission. Otherwise, if an image is drawn on a liquid crystal display (LCD) in real time, a changed part drawn by a caller user's handling must be checked by a specific device in real time, such that the specific device may have a complicated structure. As a result, an amount of load applied to a network is greatly increased, resulting in deterioration of call quality.

Mobile communication terminal for transmitting/receiving image data over group communication network and method for transmitting/receiving image data using the mobile communication terminal


A transmitter pulse circuit produces two-phase pulse trains containing a certain number of pulse edges corresponding to an integral number represented by binary parallel bits of a data value to be transferred. The transmitter responds to a coordinate data value derived from a digitizer. The receiver includes a counter for counting pulse edges contained in the two-phase pulse trains, and a retrieving circuit for retrieving intermittently the counted contents to determine the number of received pulse edges. The counting circuit and the retrieving circuit constitute together a bus mouse interface of a host computer in the receiver. The coordinate data can be transferred to the host computer through the bus mouse interface without using a general RS-232C interface, thereby efficiently improving the host computer multiple terminal processing capacity.

A conventional asynchronous data communication system operating in a start-stop synchronization mode initially converts parallel data bits into serial data bits which are then transferred, i.e. transmitted, from a transmitter to a receiver.
This system is described briefly with respect to an example in which a data value is transferred from a digitizer to a host computer. FIG. 10 is an overall perspective view of a communication system including a digitizer and a host computer. The digitizer 1 is comprised of a tablet planar sensor 2 which defines a two-dimensional coordinate plane. A suitable input tool such as a stylus pen 3 is used to designate a given point on a surface of the tablet planar sensor 2 so that the sensor 2 generates an analog detection signal indicative of the designated point. The digitizer 1 further includes a processing circuit unit operative to calculate data representative of a two-dimensional coordinate value of the designated point according to the analog detection signal. The calculated data are fed to the host computer 5 through a signal cable 4. The host computer 5 is provided with a plurality of different type interfaces for connection with peripheral input and output terminal devices. The interfaces are selected according to a form of the signal to be transferred.
FIG. 11 is a waveform of an output signal transmitted from the digitizer. For example, the digitizer generates a coordinate data value in the form of eight parallel data bits. This eight-bit parallel data value is subjected to parallel/serial conversion to produce an eight-bit serial data signal as shown in FIG. 11. For example, eight parallel data bits represented by 10110101 are converted into a corresponding eight-bit serial data signal represented by 1-0-1-1-0-1-0-1. Such mode of bit data transmission is called an asynchronous system of start-stop synchronization mode as noted before. In order to receive a data signal formed according to the asynchronous system of start-stop synchronization mode, the host computer is typically provided with a particular interface based on an RS-232C standard. Therefore, a peripheral terminal device is generally connected to the host computer through a general purpose RS-232C interface.
The RS-232C interface is normally shared by various kinds of peripheral terminal devices adopted to execute data transfer or transaction according to the asynchronous system of start-stop synchronization mode. However, the RS-232C interface can accept a limited number of peripheral terminal devices to be concurrently accessed by the host computer. Therefore, it is desired to provide a different communication mode for effectively executing data transfer or transaction through other interfaces of the host computer than the RS-232C interface.
The typical host computer is provided with a bus mouse interface specifically designed to be connected to a bus mouse device. A brief description is given herewith for the bus mouse for facilitating understanding of the present invention. A bus mouse is generally utilized as a coordinate input terminal device for a computer. However, the bus mouse can treat only a relative displacement value. Further, since the bus mouse has an overall size considerably greater than a stylus pen used as an input tool of the digitizer, the bus mouse cannot carry out character input and menu selection. On the other hand, the digitizer can treat the absolute coordinate value and input characters. Since the bus mouse has a relatively low price and utilizes a relatively simple interface construction, recently developed computers are generally compatible with a standard bus mouse. FIG. 12 is a schematic diagram of the construction of a typical bus mouse device. The bus mouse is manually moved to derive input computer signals representing the amount of its own displacement. The bus mouse is provided on its bottom portion with a ball member 6 to enable the movement of the body of the bus mouse. A pair of sensors 7 and 8 are disposed in contact with the ball member 6 to detect separately X-axis and Y-axis components of the displacement amount.
FIG. 13 is a schematic illustration for the operation of the bus mouse sensor of FIG. 12. The X-axis sensor 7 has a rotary shaft in contact with the ball member 6. Although not shown in the figure, Y-axis sensor 8 has another rotary shaft disposed orthogonally to the rotary shaft of the X-axis sensor 7, in contact with the ball member 6. As ball 6 rolls due to the displacement of the bus mouse, the rotary shaft of the X-axis sensor 7 is rotated according to the X-axis component of the displacement to produce an output signal having pulse trains XA and XB. Concurrently, the bus mouse outputs a switching signal S1 and S2 indicative of operating state or condition of the bus mouse.
FIG. 14 represents waveforms for output signals of the bus mouse. As shown in the figure, the output signal is composed of two pulse trains. When the bus mouse is displaced in the plus or positive direction in terms of X-axis, pulse train XA has a leading phase with respect to pulse train XB. On the other hand, when the bus mouse is displaced in the minus or negative direction in terms of X-axis, the pulse train XA has a lagging phase with respect to pulse train XB. By such operation, the amount of bus mouse displacement per unit time is detected in terms of a number of pulse edges per unit time contained in the output signal; the displacement direction is indicated by the relative phase condition of the output signal.
The typical host computer is provided with a bus mouse interface responsive to the output and switching signals from a bus mouse device. The bus mouse interface contains first and second eight-bit counters respectively corresponding to the X and Y coordinates for counting pulse edges of the X and Y output signals. These calculation results are retrieved from the respective eight-bit counters each period of a given interval of, e.g., 8 ms, regulated by an internal time in the host computer to detect the amount of bus mouse displacement and the switch condition of the bus mouse every period.
As shown in FIG. 11, a conventional digitizer produces an output signal composed of a binary bit series according to the asynchronous system of start-stop synchronization mode. On the other hand, as shown in FIG. 14, the bus mouse device produces an output signal composed of a two-phase pulse train. Therefore, the conventional digitizer has a different output signal format from that of the bus mouse device. Hence the digitizer cannot be directly connected to the bus mouse interface of the host computer.
As understood from the above description, the binary bit serial data value cannot be supplied to the bus mouse interface of the host computer, if it is based on the asynchronous system of start-stop synchronization mode. However, the bus mouse interface is so specialized and therefore is not as frequently occupied as the general RS-232C interface. Thus, it is desired in commercial use to carry out the data transfer or transactions by using a channel of the bus mouse interface. However, the conventional data communication system could not satisfy such a demand in the market.
In view of the above noted drawbacks of the conventional data communication system, an object of the present invention is to provide a new communication system for transferring parallel data bits from a transmitter, such as a peripheral terminal device, to a receiver, such as a host computer, through a bus mouse interface provided in the host computer.


Batteries are displayed for consumer purchase in a package which provides a means for spacing an electronic article surveillance sensor from the batteries contained within the package. By spacing the sensor away from the metal case of the batteries the interference typically caused by metal in close proximately to an electronic article surveillance sensor is eliminated. Two ways of accomplishing the spacing of the sensor from the batteries are disclosed. The first is a strip of cardboard placed between the surveillance sensor mounted on the side of the box and the batteries. The second is a specially designed box which has a box panel which divides the box into two compartments: one to hold the batteries and a second which creates a space between the batteries and the side of the box on which a surveillance sensor is mounted.

Crimes related to retail establishments represent a serious source of loss to retailers. Although a tremendous number of shoplifters are apprehended each year, it is believed that reported occurrences of shoplifting are dwarfed by the number of undetected or unreported shoplifting events occurring each year in the United States. The cost of shoplifting is not only a significant cost for retailers, but is ultimately borne by the consumer.
Arrayed against the growth in theft is technology which has provided solutions which increase the cost or risk to the criminal perpetrators by making the perpetration of their crimes more readily detectable.
One approach to detecting shoplifting is to place an electronic article surveillance sensor which is hidden or difficult to remove on each item of merchandise. The sensors are detected at the exits of a store and assure that merchandise cannot be removed unless the merchandise is first purchased. Examples of some of the sensors which have been developed are found in U.S. Pat. Nos. 5,357,240; 5,313,192; 5,111,186; 4,510,489; and 4,510,490. For patents to related technology see U.S. Pat. Nos. 5,341,125; 5,109,217; and 4,980,670.
While it is generally desirable that the prospective thief be aware of the fact that a particular store is protected by an electronic article surveillance system, it is also desirable that the potential thief not be able to readily remove the sensor from the merchandise. In some applications this is accomplished by placing a lock on the merchandise which cannot be removed without a special key. For other types of merchandise, it is desirable that the sensor be of the disposable type which is integrally packaged with the goods. In this type of sensor it is usually desirable to hide the sensor so its location and even existence within a particular product is not readily apparent to the potential thief.
In order to cost-justify itself, the electronic surveillance sensor must be cost effectively incorporated in the packaging so the cost of preventing theft does not exceed the cost incurred by theft. Thus, as in the production of all consumer items, cost efficient manufacture is a critical objective.
With batteries there is a problems with placing the sensor in the package. If placed too close to the batteries the sensor may not be detectable. The weight of the batteries can also crush the sensor if the package is dropped in shipping.
What is needed is a battery package which hides an electronic surveillance sensor in the package while preserving functionality.


A first monophonic signal within a predetermined frequency range and a second monophonic signal at least outside of the predetermined frequency range are produced from a monophonic input signal. A simulated-stereo device is provided for dividing each of the first and second monophonic signals into stereo-simulated signals. The level of the first monophonic signal is compared with the level of the second monophonic signal. The level of the first stereo-simulated signal is attenuated when the level of the first monophonic signal is higher than the level of the outside monophonic signal.

Stereophonic sound is essentially different from monophonic sound in that the sound image of a particular sound source is localized. If the sound source moves, the sound image is accordingly moved. Thus, the stereophonic sound gives a sense of space in expanse and in perspective, in which the sound image is faithfully localized.
The sound image in a monophonic sound does not move. Therefore, if the sound image of the monophonic sound is moved, the sound can resemble stereophonic sound.
The localization of the sound image depends largely on the difference between sound pressure levels of sounds coming out of right and left loudspeakers. Another factor is the difference in phase, that is, the difference between times taken by the sounds from both speakers to reach the listener. The sound image is localized at a position from which sound with a higher sound pressure level is produced and at a position from which a sound with an advanced phase is produced.
There has been proposed a system for producing simulated-stereophonic sounds whose sound images are not localized by changing the sound level and phase.
FIGS. 9a to 9g show various conventional simulated-stereo devices. Referring to FIG. 9a a monophonic input signal is branched at a point P and applied to respective left and right loudspeakers 3 and 4 through filters 1 and 2 having different frequency responses. The filters 1 and 2 are, for example, a high-pass filter and a low-pass filter, respectively, the output signals of which are shown in FIG. 9b. Alternatively, the filters 1 and 2 may be complementary comb filters which give output signals shown in FIG. 9c, or all-pass filters which are different in group delay time as shown in FIG. 9d.
FIG. 9e shows a simulated stereo device having a reverberation chamber 5 wherein a loudspeaker 6 is provided and a pair of microphones 7 and 8 are provided at different positions. Monophonic sound generated by the loudspeaker 6 is picked up by the microphones 7 and 8 and reproduced through loudspeakers 9 and 10.
In another device which is shown in FIG. 9f, each monophonic input signal branched at a point P is applied to respective adders 11 and 12. The monophonic input signal is further applied to a delay circuit 14 through a level controller 13 and branched at a point Q. One of the branched signal is applied to the adder 11, while the other branched signal is applied to the adder 12 through a phase inverter 15. The adders 11 and 12 are connected to loudspeakers 11a and 12a, respectively.
In a device shown in FIG. 9g, monophonic input signals branched at a point P are applied to filters 16 and 17 which have different characteristics from each other. The output characteristics of the filters 16 and 17 continuously change in accordance with the input signals branched from a point Q. Each of the output signals of the filters 16 and 17 are applied to respective loudspeakers 18 and 19 to be reproduced.
The simulated-stereo devices described above use either a level difference or a phase difference between sounds reproduced by the right and left loudspeakers. These methods are cited in "Spatial Hearing", Blauert, Morimoto, and Goto, 1988, Tokyo.
However, in the conventional simulated-stereo devices, the monophonic input signal is imparted with a similar stereophonic effect over the entire frequency range. Namely sound images of all sound source are moved. Therefore, when applied to a movie projector, all sorts of sounds are uniformly dispersed without localization in spite of the characteristic differences between the sounds in different frequency ranges, thereby giving a strange feeling to the audience, for example, in a case of a screen in which a singer sings a song, the position of the voice of the singer moves together with sounds of the background. This is very unnatural.

System for producing stereo-simulated signals for simulated-stereophonic sound


This invention discloses an adaptive deconvolution method for enhancing the vertical resolution of an MWD (measurement-while-drilling) electromagnetic resistivity logging tool. The tool measures the total differences between the voltages induced in a pair of spaced-apart receiver coils. A deconvolution filter, appropriate to the current position of the logging tool in the borehole, is derived according to the weighted average of the measured phase differences. Using the so-derived deconvolution filter, the measured phase differences are spatially deconvolved thereby to enhance the vertical resolution of the measurements by reducing the shoulder-bed effects.

1. Field of the Invention
This invention teaches use of an adaptive deconvolution method for enhancing the vertical resolution of an MWD (measurement while drilling) electromagnetic logging tool.
2. Discussion of Related Art
Wireline induction logging tools are well known in the art of studying the formation characteristics of the earth through which a borehole has been drilled. Typically, a sonde, carrying one or more transmitting coils and one or more receiving coils, is lowered into the borehole on the end of a multi-conductor cable. An AC signal, at a frequency on the order of 20 kHz excites the transmitter coil. Radiation from the transmitter generates an electromagnetic field in the formation which, in turn, induces a flow of eddy currents therein. Variations in the magnitude of the eddy currents due to variations in the formation conductivity (or its inverse, resistivity) are detected by the receivers. The magnitude of formation conductivity is diagnostic of certain parameters of the earth layers that were penetrated by the borehole. Although other types of tools are known for measuring resistivity, induction tools are preferred in many cases for operational reasons.
A quantitative measure of the conductivity is determined by measuring the value of the voltage induced in the receiver coil that is in-phase with the transmitter current (the real or R component). The real signal is a nonlinear function of conductivity. A quadrature component (X-component) signal can also be measured and be combined with the real component such that the resulting value is a linear function of conductivity.
The term "vertical geometric factor" (VGF), or the impulse response is used by those skilled in the art to describe the response of an induction tool to a thin conductive layer. The impulse response of a typical induction tool in a homogeneous formation is a curve that has a main lobe of finite width that spans a length of the borehole and an amplitude that is an inverse non-linear function of the formation conductivity (N.B. the unit of measurement for conductivity is mho and for borehole applications, 0.001 mho or mmho. Some authors use units of resistivity which are measured in ohm-meters. The terms are often used interchangeably). Although most of the signal originates from the main lobe, unwanted side lobes of non-zero amplitudes extend vertically above and beneath the main lobe.
In thin beds of low conductivity, the unwanted contribution of the side lobes from adjacent beds that have higher conductivity, will cause the thin-bed measurements to be too high. That error is called the "shoulder effect".
As before stated, the magnitude of impulse response of the induction logging tool is an inverse function of formation conductivity but that function is non-linear. The non-linearity is referred to as the "skin effect". The magnitude of the skin effect is also a complex function of the system operating frequency and coil separation.
Various methods have been used in the prior-art borehole logging sondes to counteract the problems cited. For example, see U.S. Pat. No. 4,471,436, issued Sep. 11, 1984 to R. T. Schaefer et al. for PHASOR PROCESSING OF INDUCTION LOGS INCLUDING SHOULDER AND SKIN EFFECTS. Shoulder effect is reduced by generating a spatial deconvolution filter which sharpens the main lobe and reduces the side lobes when the filter is convolved with the VGF. The skin effect is reduced by filtering the quadrature phase component measurements according to a non-linear spatial filtering function to obtain a correction representative of the change in sonde response function as a function of the formation conductivity. The correction component measurements are then summed with the processed in-phase component measurement to produce a processed log measurement sans the unwanted side-lobe contributions.
There are certain technical differences between wireline logging tools as described above and tools used in measurement-while-drilling (MWD). In the latter case, the transmitter and receiving coils of the tool are mounted on a highly-conductive metal mandrel to withstand the drilling stresses during operation. The physical configuration of the conductive mandrel and the transmitter/receiver coils requires that the coils be excited at a frequency on the order of MHz. This tool is thus also named as a propagated wave resistivity tool. Whereas the prior-art wireline tools depended upon a combination of the real and quadrature components to derive apparent conductivity, the propagated wave resistivity tool of this invention relies on the phase difference between the measured signals in the two receiver coils. Therefore, the way of evaluating the VGF impulse response function for MWD is different from that for wireline induction application. See for example MWD Resistivity Tool Response In A Layered Medium, by Q. Zhou et al., Geophysics, November 1991, pp. 1738-1748. Also Geometric Factor and Adaptive Deconvolution of MWD-PWR Tools, by Q. Zhou et al., The Log Analyst, July-August, 1992 pp. 390-398.

Method for processing signals from an MWD electromagnetic resistivity logging tool


Disclosed are a photosensitive resin composition for a color filter that includes (A) a squaraine dye including at least one selected from compounds represented by the following Chemical Formulae 1 and 2, (B) an alkali soluble resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, and a color filter using the same.

A liquid crystal display device is one of display devices and has advantages of lightness, thinness, low cost, low power consumption, an excellent junction with an integrated circuit, and the like, and thus is widely applied for a laptop, a monitor, and a TV screen. The liquid crystal display device includes a lower substrate including a black matrix, a color filter, and an indium tin oxide (ITO) pixel electrode, and an upper substrate including an active circuit portion including a liquid crystal layer, a thin film transistor, an electricity storage capacitor layer, and an ITO pixel electrode. In the liquid crystal display device, color filters are formed in a pixel region by sequentially laminating a plurality of color filters (in general, formed of three primary colors such as red (R), green (G), and blue (B)) in a predetermined order to form each pixel, and a black matrix layer is disposed in a predetermined pattern on a transparent substrate to form a boundary between the pixels.
A color filter may be fabricated in a pigment dispersion method. According to the pigment dispersion method, a coloring thin film is formed by repeatedly coating a photopolymerizable composition including a colorant on a transparent substrate provided with a black matrix, exposing a desired pattern to a light, removing an unexposed part with a solvent, and thermally curing the resulting product. The photosensitive resin composition for a color filter used in the pigment dispersion method generally includes an alkali soluble resin, a photopolymerizable monomer, a photopolymerization initiator, an epoxy resin, a solvent, other additives, and the like. The pigment dispersion method has been actively applied to an LCD of a mobile phone, a laptop, a monitor, TV, and the like. However, a photosensitive resin composition for a color filter for the pigment dispersion method has recently required more improved performance as well as excellent pattern characteristics. Particularly, high luminance and high contrast ratio along with high color reproducibility are required.
An image sensor is a part for photographing images in a portable phone camera or a DSC (digital still camera). It can be classified as a charge-coupled device (CCD) image sensor and a complementary metal oxide semiconductor (CMOS) image sensor depending upon the manufacturing process and the application method. A color imaging device for a charge-coupled device (CCD) image sensor or a complementary metal oxide semiconductor (CMOS) image sensor includes color filters each having filter segments of mixing primary color of red, green, and blue, and the colors are separated. A recent color filter mounted in the color imaging device has a pattern size of 2 μm or less, which is 1/100th to 1/200th of the pattern size of a conventional color filter pattern for LCDs. Accordingly, increased resolution and decreased pattern residues are important factors for determining the performance of a device.
A color filter fabricated by using a conventional pigment-type photosensitive resin composition has a limit in luminance and a contrast ratio due to the size of pigment particles. In addition, a color imaging device for an image sensor needs a smaller dispersion particle diameter for forming a fine pattern.

Photosensitive resin composition for color filter and color filter using the same


In one embodiment, a method is performed at a control point (CP) in a network. An action is invoked to create a synchronization data structure on a media server that includes a content directory service (CDS) in the network, wherein the synchronization data structure includes a synchronization relationship describing a relationship between the CP and the CDS. Then an action is invoked to add synchronization pair information to one or more objects on the CDS. A change log is requested from the CDS. Then the change log is received from the CDS, wherein the change log contains information about changes to the one or more objects to which synchronization pair information for the CP was added.

1. Field of the Invention
The present invention relates to home networking. More particularly, the present invention relates to synchronizing content between a content directory service and a control point in a home networking environment.
2. Description of the Related Art
Universal Plug and Play (UPnP) is a distributed, open networking architecture that allows devices to connect seamlessly and to simplify the implementation of networks in the home (data sharing, communications, and entertainment) and corporate environments. UPnP achieves this by defining and publishing UPnP device control protocols built upon open, Internet-based communication standards.
UPnP has grown in popularity of late in part due to the rise in popularity of media servers. Media servers are small computers that store multiple types of content (e.g., photos, music, videos, etc.). The content may then be streamed from a media server to one or more control points (e.g., iPod, television set, etc.).
As an example, a "Media Server" device might contain a significant portion of the homeowner's audio, video, and still-image library. In order for the homeowner to enjoy this content, the homeowner must be able to browse the objects stored on the Media Server, select a specific one, and cause it to be "played" on an appropriate rendering device.
For maximum convenience, it is highly desirable to allow the homeowner to initiate these operations from a variety of User Interface (UI) devices. In most cases, these UI devices will either be a UI built into the rendering device, or a stand-alone UI device such as a wireless PDA or tablet. In any case, it is unlikely that the homeowner will interact directly with the device containing the content (i.e. the homeowner won't have to walk over to the server device). In order to enable this capability, the service device needs to provide a uniform mechanism for UI devices to browse the content on the server and to obtain detailed information about individual content objects. This is the purpose of the Content Directory Service (CDS).
The Content Directory Service additionally provides a lookup/storage service that allows clients (e.g. UI devices) to locate (and possibly store) individual objects (e.g. songs, movies, pictures, etc) that the (server) device is capable of providing. For example, this service can be used to enumerate a list of songs stored on an MP3 player, a list of still-images comprising various slide-shows, a list of movies stored in a DVD-Jukebox, a list of TV shows currently being broadcast, a list of songs stored in a CD-Jukebox, a list of programs stored on a PVR (Personal Video Recorder) device, etc. Nearly any type of content can be enumerated via this Content Directory service. For those devices that contain multiple types of content (e.g. MP3, MPEG2, JPEG, etc), a single instance of the Content Directory Service can be used to enumerate all objects, regardless of their type.

Synchronizing content between content directory service and control point


The invention relates to a method for tracking closely adjacent and time-shifted signals incoming to a RAKE-receiver (25). According to the method, the sampling positions of the RAKE-branches (25a, 25b) are not permitted to come closer to one another in time than by a predetermined minimum value when updating the branches. The invention also relates to an arrangement (24) for putting the method into effect. The arrangement includes a search unit (24a), a plurality of tracking units (24c, 24d) and a processor unit (24b). The invention also relates to a RAKE-receiver utilizing said apparatus.

In a mobile radio system, the existance of such signal reflecting surfaces as walls, building structures, hills, mountains etc. are liable to cause the receiver of a radio signal perceiving the signals to be dispersed in time, wherewith signals that carry the same information will arrive at the receiver at different time delays. For instance, the signals received may comprise a strongly dominant signal component, e.g. a direct wave, and weaker reflected signals belonging to the dominant signal component, so-called rays, or a spread of rays of essentially uniform strength. In general, there exists a ray which is stronger than the remaining rays and this ray can then be considered as the main ray.
Time dispersion is generally disadvantageous, since the signals are able to interfere with one another and therewith create interference fading. Time dispersion can, however, also be of benefit. The reflected signals transmit the same information as the main signal. When fading has caused pronounced attenuation of the main signal itself, the main signal can be "reconstructed" or amplified by constructive addition of the time-dispersed rays, i.e. the signal becomes diversity amplified.
A RAKE-receiver is a radio receiver which utilizes this feature of time dispersed signals. The RAKE-receiver includes a plurality of independent receiver units, so-called RAKE-branches, each of which receives and tracks, or locates, a respective ray. The RAKE-receiver also includes means for combining the received signals, and means for delaying these signals so that they will be brought into phase prior to combining the signals. In order to be able to utilize diversity it is necessary to detect a plurality of incoming time-dispersed rays, which places commensurate demands on the resolution sensitivity of the receiver.
Receivers for multi-path spread rays based on the RAKE-principle are known from U.S. Pat. Nos. 5,305,349, and 5,237,586, and from International patent application WO94/28640. These publications describe various ways of combining the received signals to obtain diversity amplified output signals. In the known RAKE-receivers, the RAKE-branches each track respective rays independently of one another. The drawback with the known RAKE-receivers is that when two incoming rays are located so close together that the RAKE-receiver is unsuccessful in resolving the signals, each of the two branches responsible for tracking a respective ray will track one and the same ray, so that one of the rays will not be tracked.
The published patent application GB 2 286 509A describes a method of measuring the impulse response of a received signal in a radio system. The receiver may operate in accordance with the RAKE-principle. The maximum and minimum impulse-response values are measured by a separate receiver and stored in a memory. The time-setting of the branches of the RAKE-receiver are controlled in accordance with the stored values. When the time distance between two mutually adjacent maxima is smaller than a predetermined threshold value, only one of the maximum instants is used to determine the time setting of the branches. The other signal is not then tracked. This is a disadvantage, because the diversity cannot be utilized.

Method and arrangement of signal tracking and a rake-receiver utilizing the arrangement


An integrated circuit module has a common function known good integrated circuit die with selectable functions. The selectable functions are selected during packaging of the known good integrated circuit die. The known good integrated circuit die is mounted to a second level substrate. The second level substrate has wiring connections to the input/output pads of the known good integrated circuit die that select desired input functions and output functions. Further, the wiring connections on the second level substrate provide signal paths to transfer signals to the desired input function and signals from the desired output function, and signals to and from the common functions. Also, the wiring connections form connections between the input/output pads and external circuitry. To select the desired input functions and the desired output functions, appropriate logic states are applied to input/output pads connected to a function selector to configure a functional operation of the integrated circuit module. The second level module substrate has connector pins to provide physical and electrical connections between the external circuitry and the wiring connections on the second level substrate.

1. Field of the Invention
This invention is related to integrated circuits. More particularly, this invention relates to multiple function integrated circuits such as Dynamic Random Access Memories (DRAM) having function selection through wiring connections on a second level substrate onto which an integrated circuit is mounted.
2. Background of the Related Art
The structure of a DRAM is well known in the art. Usually a DRAM chip is configured to be organized as a ×1 (by 1), ×4 (by 4), ×8 (by 8), or ×16 (by 16) package by selective destruction of fuses internal to the DRAM chip and by selectively connecting the data input/output pads to pins on a package. The unused pins are not connected to the input/output pads of the undesired or unused data transfer pads. Refer now to FIG. 1 for a schematic drawing of the structure of a DRAM integrated circuit showing the input/output selection function. A DRAM array 100 has multiple banks of arrays of DRAM cells. Address signals are applied to the address I/O's 105 and decoded within column address and row address decoders to select DRAM cells within the DRAM array 100.
Control and timing signals 120 are applied to the control logic and timing generator 115 to provide the necessary control and timing functions for the DRAM array 100.
Upon applying an address to the DRAM array 100, digital data is transferred to or from the DRAM array 100 by the internal data bus 110. The internal data bus 110 is connected between the sense amplifier and I/O bus on each memory bank. The internal data bus 110 may conceptually have a connection for each column of one memory bank, but usually is the maximum data bit width configuration of the DRAM integrated circuit.
The internal data bus 110 is connected to the input/output selector 125. The input/output selector 115 determines the interconnections between the input/output buffers 130 and the internal data bus 110. The selection pins 140 of the input/output selector 125 are connected to the selection networks formed of the resistors 145a, 145b, and 145c and the fuses 150a, 150b, and 150c. A logical one state is applied to the selection pins 140, if a fuse 150a, 150b, and 150c is opened. A logical zero state is applied to the selection pins 140, if a fuse 150a, 150b, and 150c remains intact. The logical states applied to the selection pins 140 determine which connections on the internal data bus 110 are connected to which of the input/output buffers 130. While, as shown, the selector circuits will draw unacceptable amounts of standby current, it is presented here for illustration. Other techniques known in the art are used to form the selection networks.
The input/output buffers 130 are connected to the pads 135. The fuses 150a, 150b, and 150c of the selection network are opened either as a masking during a final metalization or personalization by blowing the fuses 150a, 150b, and 150c with highly intense laser light prior to separation of a wafer containing the DRAM integrated assembly into DRAM modules.
Those input/output pads 135 not used for a configuration are not connected to the module connections during the next level assembly. The fused configuration selection forces the maintenance of inventory of the DRAM die for each desired configuration increasing the difficulty in planning of production of DRAM wafers.
While the structure of the prior art as shown in FIG. 1 is described for a DRAM, other integrated circuit functions such as computational processors (microprocessors, microcontrollers, digital signal processors, etc.), programmable memory, and programmable logic arrays employ metal masking or fuse destruction at the wafer level, and making or omitting connections during attachment of the functional integrated circuit die to a next level package assembly. This complicates the semiconductor processing in that extra masking steps are required for mask programming of desired functions of the functional integrated circuit die. Each function desired requires a unique mask for the selection process, further complicating the semiconductor process. Additionally, fuse destruction adds an extra step in the processing of the functional integrated circuit die.
FIG. 2 shows a process for forming integrated circuit modules. The process begins with the formation 200 of the integrated circuit chip on a semiconductor wafer. The semiconductor process 210 forms the collection of transistors that are the electronic circuits on the semiconductor wafer. The electronic circuits are interconnected by metalization and are also connected to input/output pads by the metalization placed on the surface of the semiconductor wafer. During the metalization, optional functions may be personalized to select optional functions. In the case of the DRAM of FIG. 1, the fuses 150a, 150b, and 150c are either opened or held intact during this process to select the desired input/output organization options. An alternative to selecting the desired input/output organization options of the DRAM of FIG. 1 is exposing the metalization on the surface of the semiconductor substrate that forms the fuses 150a, 150b, and 150c to intense laser light to destroy the appropriate fuses 150a, 150b, and 150c.
The steps of formation of the integrated circuit chip is common for all the desired selectable functions until the metalization to select the desired functions. The integrated circuit chips then becomes a custom design. Equally, the integrated circuit chip has a common design until the destruction of fuses to create the custom personalization that selects each desired function of the integrated circuit chip.
The semiconductor wafer is placed on a test system and each integrated circuit chip is tested 215 for functionality. The functioning chips are denoted as functional die. The semiconductor wafer is then diced 220 and the functional die are separated for further assembly 225 in a first level or module package. The selection or omission of connections between the functional integrated circuit die and the first level package is a custom design particular to each combination of desired functions.
The input/output pads of the desired functions of the functional die are connected by a method such as wire bonding or tape automated bonding to the pins of the first level package. The input/output pads of the undesired function are omitted during the wire bonding or tape automated bonding. The package is tested 230 and inventoried 235 for further assembly.
The assembly 205 of the second level package begins by forming 240 the substrate of the second level assembly. Multiple layers substrate are formed having interconnection metalization that connects the packaged and tested die to external circuitry that is present either on the second level package or elsewhere within the electronic system. The multiple layers are assembled to form the substrate of the second level assembly.
A solder mask is placed 245 on the second level assembly and a solder paste is placed 250 at all connection points of the packaged and tested die. The packaged and tested die is attached 255 to the second level assembly. In a surface mounted packaging system, the solder paste is melted and the pins of the packaged and tested die fused to the metalization of the second level assembly. The remaining processing of the second level assembly is completed 260.
For integrated circuit modules having multiple functions, the metalization of the second level assembly must be customized. Again, this increases the number of assembly types required to be inventoried.
U.S. Pat. No. 5,360,992 (Lowery et al.) discloses a semiconductor package, which allows pinouts and bond options to be customized after encasement of a semiconductor die. The semiconductor package has two assemblies in a first embodiment and an optional third assembly in a second embodiment.
A first assembly comprises a semiconductor die encased in plastic, ceramic, or other suitable material. All available bond options (bond pads) are routed to the exterior portion of the package by a first assembly frame. Portions of the first assembly frame are exterior to the encasement and terminate in exterior pad portions that can be conductively bonded to.
A second assembly of the invention comprises a second assembly frame that provides a means of input/output (I/O) between the packaged die and a next level of assembly onto which it is installed. The second assembly frame comprises conductive paths to which the exterior pad portions are connected, the first assembly being conductively mounted to the second assembly thereby. With the two-piece embodiment of the invention, the frame of the second assembly determines the pinouts (the pin numbers associated with each of the signals of the device) of the various signals of the die contained within the first assembly.
The optional third assembly, which, if used, is interposed between the first and second assemblies, comprises means for "keying" the exterior pad portion desired locations or the second assembly frame. The assembly can comprise at least two different forms.
In the first form, the third assembly is a nonconductive membrane having voids there through, conductive paths of the second assembly are located in an "X" direction, while the exterior pad portions of first assembly of this form are bars extending in a "Y" direction. By selectively placing the voids in the membrane, the pads of the first assembly can either be connected with the conductive paths of the second assembly or isolated from the conductive paths if no void is formed. Using the X-Y arrangement, any of the bond options can be connected with any of the pinouts. Connecting is accomplished by coating the bars with a conductive material and interposing the insulative membrane between the first and second assemblies. The conductive material fills the voids, thereby passing signals between the first and second assemblies.
In the second form, the third assembly comprises a flex circuit as used with tape automated bonding. The second assembly has a single design, and the layout of the flex circuit determines the pinouts and options of the semiconductor device. The flex circuit is conductively mounted to the first and second assemblies in a fashion consistent with tape automated bonding (TAB) technology, for instance with solder, or by some other means such as conductive epoxy.
U.S. Pat. No. 5,737,767 (Agrawal et al.) teaches a random access memory (RAM) array with a reconfigurable bit width or word width. In one embodiment, a reconfigurable x-y RAM array is provided which includes a memory array comprised of a plurality of RAM cell columns. The RAM cell columns are organized into a number of groups where the number of groups corresponds to the bit width of the memory. Each group contains an equal number of columns so that the number of columns in a group multi number of groups equals the total number of array. The number of columns in a group is reconfigurable according to the present invention. Thus, when the number of columns in a group is smaller, the number of groups is larger and when the number of columns in a larger, the number of groups is smaller. Thus, the bit width of the memory is reconfigurable by modifying the number of columns in a group, since the bit memory corresponds to the number of groups.
To access a word stored in the array, The RAM decodes an address and selects one bit from each column group. Thus, the word size stored by the RAM is determined by the number of columns groups configured in the array.
Agrawal et al. provides multiplexer (mux) logic coupled to each column. Column select logic decodes a memory address and provides select signals corresponding to the address to the mux logic. The mux selects a particular column in the group to be accessed and outputs a column bit signal indicative of the memory state of the selected column.
Column configuration logic is coupled to the mux logic and combines the mux outputs into memory bit signals. The mux outputs combined by the column configuration logic determine the size of the column groups from which a memory bit signal is selected. The column configuration logic may be placed in different modes to configure different column group sizes and thus to reconfigure the bit width of the memory. The column select logic is responsive to the configuration mode and decodes the address for the appropriate column group size.

Multiple selectable function integrated circuit module


Disclosed is apparatus and a method for the stretch forming of an elongated hollow metal section, such as an aluminum extrusion. The apparatus and method uses one or more constraining means secured to the forming die and a die extension to constrain and support the walls of the elongated hollow metal section against the forces produced by air pressure within the interior of the hollow metal section. The apparatus and methods disclosed herein prevent the formation of wrinkles, crimps and bulges in the walls of the elongated hollow metal section during the stretch forming and reshaping thereof.

This invention relates to apparatus and methods for the forming of elongated hollow metal sections into a predetermined shape or contour. It relates particularly to apparatus and methods for the bending or reshaping of elongated hollow metal sections, such as aluminum extrusions, using "stretch forming" apparatus and methods. The stretch forming process for bending or shaping of an aluminum extrusion involves placing the ends of the elongated hollow extrusion into an opposed pair of jaws or clamps attached to a pair of opposed hydraulic cylinders and then applying sufficient tension through the hydraulic cylinders and jaws or clamps on the ends of the extrusion to "stretch" the metal in the extrusion beyond its yield point or elastic limit. While the metal is tensioned above the elastic limit, a forming die of desired shape and contour is pressed against the extrusion causing the extrusion to assume the desired shape and contour of the forming die. The tension on the ends of the extrusion is then reduced and the newly shaped extrusion is removed from the forming die and the stretch forming apparatus.
In the past, the stretch forming of elongated hollow metal sections, and especially thin walled aluminum extrusions, often produced crimps or wrinkles in certain portions of the sections or extrusion walls as a result of the inability of the walls of the section or extrusion to resist the reshaping forces during the stretch forming operation. Such crimps and wrinkles not only weakened the final section but also resulted in an extrusion of unacceptable appearance.
While in some cases the crimps and wrinkles could be eliminated by using a thicker walled section, such a solution added to the cost of the finished product and increased its weight. U.S. Pat. No. 4,803,878 issued Feb. 14, 1989 to Moroney not only discloses the above-described process for stretch forming of elongated hollow metal sections or extrusions, but also discloses one proposed solution to eliminate the crimps and wrinkles formed in the shaping of thin walled extrusions. Moroney suggests that the crimps and wrinkles can be reduced or eliminated by introducing a gas under pressure into the interior of the elongated hollow metal section or extrusion while it is being stretch formed. Moroney claims that the internal gas pressure is sufficient to support the internal walls of the extrusion during the stretch forming operation and will prevent the formation of crimps and wrinkles. While the use of an internal pressurized gas has helped to reduce the formation of crimps and wrinkles, the use of the internal pressurized gas alone has not completely eliminated the crimps and wrinkles and in some instances, produced bulging of the thin walls of the hollow metal section or extrusion and again resulting in an unacceptable finished product.

Apparatus and method for the stretch forming of elongated hollow metal sections


A hinged support apparatus and method for a portable electronic display device is disclosed that includes a mounting plate and an elongated base each, respectively, having a proximal and a distal end portion. The hinged support apparatus includes a mounting plate and an elongated base, at least a portion of which is disposed upon and coplanar with the mounting plate. The mounting plate and the elongated base can include tenons that can engage in position stops located in mortises in the opposite parts. Using these tenons and mortises, the distal end of the elongated base can be locked or interlocked into a position at a splayed out angle from the mounting plate for easier viewing.

Portable electronic display devices such as, for example, cell phones, tablets, and other small electronic displays having a visible display, are almost universally used in today's world. Most of these devices have a planar viewing display and may be hard to view—especially by a user sitting at a desk, in a chair, or viewing the display at an angle for one reason or another.
Stands are available for such devices into which the electronic display can be attached or inserted. Then the stands can be set upright on a surface such as a desk or table and can allow the display face of the electronic display to be viewed at an angle that is easily seen by a user. These stands can be freestanding and can sometimes have collapsible legs or stands to hold them upright.

Hinged support apparatus with position stops


A method for human motion analysis, an apparatus for human motion analysis, a device, and a storage medium. The method includes: acquiring image information captured by a number of photographing devices, where at least one of the number of photographing devices is disposed above a shelf; performing human tracking according to the image information captured by the plurality of photographing devices, and determining position information in space of at least one human body and identification information of the at least one human body; acquiring, according to the position information in space of a target human body of the at least one human body, a target image captured by the photographing device above a shelf corresponding to the position information; and recognizing an action of the target human body according to the target image and detection data of a non-visual sensor corresponding to the position information.

In the retail scenario, a human motion needs to be analyzed, which specifically relates to human tracking and motion acquisition and recognition involving purchasing behaviors.
In the prior art, the human tracking is performed by a multi-channel camera uniformly arranged, specifically, two-dimensional image information captured by the multi-channel camera is used as a basis of the human tracking, and the human tracking is performed in the two-dimensional image and the position of the human body is determined. However, the human tracking is in accurate in a crowded retail scenario. In addition, the prior art uses a light curtain or an infrared sensor to acquire and recognize actions related to the purchase behaviors, but the position of the hand acquired through the light curtain or the infrared sensor is inaccurate, causing that the human motion cannot be accurately recognized.

Method for human motion analysis, apparatus for human motion analysis, device and storage medium


A method and system for managing a group of computer applications operating on a computer. The method comprises the steps of establishing a set of policies for operating the applications under a variety of circumstances, each of the circumstances being associated with one of the policies and each of the policies setting forth a behavior to occur under the associated circumstance; and monitoring the environment of the computer to determine when one of the circumstances occurs. When one of the circumstances is determined as occurring, a search is made through the set of policies to identify the policy associated with said one of the circumstances, and said group of computer applications is operated in accordance with the behavior set forth in said associated policy.

1. Field of the Invention
This invention generally relates to computer management, and more specifically, the invention relates to automatically managing operations on a computer. Even more specifically, the invention relates to methods and systems, particularly well suited for use with personal computers, for automatically managing one or more software operations based on rules provided by a user and the states or conditions of other applications on the computer.
2. Background Art
In personal computing, the behavior of the personal computer (PC) is determined by its system and application software. The behavior of one application is almost always totally independent of any other. This is because the user does not want an application's behavior to depend on whether other applications are active or not. If it were, the user would have to understand why and adapt his or her use of that application.
But there are times when it is useful to modify the behavior of an application when executed in the presence of others. A common case is when the user's expectations are that the PC's overall behavior is to be determined by one and only one application. This may be due to a prioritization on the user's part. For example, the user may be urgently in need of the results of a single application—say a programming language compiler—and may want to defer all other use of the PC for other purposes so as to reduce the amount of time he or she will have to wait. Or the user may be using the PC in a public context, say for a presentation, and want the PC to be dedicated to that purpose without interruption, either by compute-intensive processes such as an anti-virus scan or by processes that might share the display, such as instant messaging.
It is possible for the user to manually reconfigure the PC's execution environment to achieve these ends. For example, the user can use the Windows Task Manager to kill all applications and processes that might interfere with his or her desired purpose. But this manual reconfiguration requires time, effort and most importantly considerable insight into the software configuration. If not performed correctly, the reconfiguration can damage the operation of the PC, potentially rendering it unfit for any purpose. Moreover, manual reconfiguration would be required again when the PC is returned to normal operation. This may require launching applications with specific parameters, again a skill- and knowledge-intensive task that is prone to error and potential environment damage.
Were it possible to capture the tasks necessary to reconfigure the PC's execution environment in computer-readable form, and to build an engine, driven by this representation, to carry them out, the modification of the overall behavior of the PC could be automated. If it were additionally possible to recognize situations where reconfiguration is needed automatically, then the user would see a most desirable form of PC behavior in which his or her needs are recognized and accommodated automatically.

Autonomic context-dependent computer management


A monitoring device detects late packet collision on a CSMA/CD LAN. The device comprises a first detector for detecting the presence of a packet in the LAN, a second detector for detecting the occurrence of a packet collision in the LAN and a late collision indicator which provides a late collision indication whenever the second detector detects the occurrence of a collision more than a predetermined time after the first detector detects the presence of a packet.

As is well known, in a CSMA/CD LAN a number of stations are interconnected through a single shared cable (electrical or optical) logically configured as a bus (though possibly physically configured as a bus, tree or star). Data is transmitted between the stations in packets and generally signals are normally only present on the LAN when user data or control data is being transferred (that is, the LAN is idle--no signals present--in the gaps between packets). A station wishing to transmit data first checks that the LAN has been idle long enough for all transmissions to have propagated across the LAN; providing this check shows the LAN to be idle, the station then proceeds to transmit its data. It is, of course, still possible for two stations to start transmission at approximately the same instant and in this case there will be a collision between the two packets being transmitted. Each transmitting station listens out for any such collision and if one does occur, the station erases transmission after having first transmitted a jam sequence that ensures the collision is detected by all the stations concerned. The stations responsible for transmitting the colliding packets will then attempt to retransmit their data after a short, random, delay.
If the LAN is functioning correctly, collisions should only occur within a predetermined time interval following the start of transmission by any particular station. The duration of this time interval is dependent on the longest propagation delay between any pair of stations on the network (or where the network is made up of several segments interconnected by repeaters, between any pair of stations on the relevant network segment), the time taken by a station to launch a packet, and the time taken for a station to detect a collision. In practice, where a LAN is designed in accordance with a particular technical standard, this predetermined time interval will normally be determined with reference to the maximum values of the defining parameters as set down in the technical standard.
In some LAN fault conditions, packet collisions may occur after the initial time interval where such collisions are expected. It is possible to observe such collisions using network analyzers; however, such items of equipment are expensive and complex, requiring much skill to set them up to observe late collisions.
It is an object of the present invention to provide a method and apparatus that facilitate the monitoring of late collisions on CSMA/CD LANs.


The transistor arrangement contains a first and a second field effect transistor comprising a first and a second source drain connection and a control connection for applying a first or a second signal. The two field effect transistors are of the same conductive type. The transistor arrangement is configured in such a manner that the first signal can be applied in an alternating manner to the control connection of the first field effect transistor and the second signal can be applied in a simultaneous manner to the control connection of the second field effect transistor, and/or the second signal can be applied to the control connection of the first field effect transistor and the first signal can be applied simultaneously to the control connection of the second field effect transistor.

The invention relates to a transistor arrangement, an integrated circuit and a method for operating field effect transistors.
The noise of a field effect transistor (in particular MOSFET, "metal oxide semiconductor field effect transistor") limits the accuracy of an electrical circuit. This is problematic when a signal having a small amplitude occurs in such a circuit. Therefore, the performance of an analog circuit is limited by the phenomenon of noise.
The low-frequency noise of a MOS transistor is caused by statistical loading or unloading of defect states at the interface between the channel region and the gate insulating region of the field effect transistor. At low frequencies, this mechanism supplies the dominant contribution to the noise. On account of their localization the defects are also often referred to as interface states. Predominantly those defects whose energy level lies close to the (quasi) Fermi level of the charge carriers contributing to the current flow contribute to the low-frequency noise. Other interface states whose energy level is significantly higher or lower are either completely occupied or completely unoccupied and thus do not contribute to the noise, cf. S. Christensson, I. Lundström, and C. Svensson, "Low frequency noise in MOS transistors—I theory," Solid-St. El. 11, pp. 791-812, 1968.
R. Brederlow, W. Weber, R. Jurk, C. Dahl, S. Kessel, J. Holz, W. Sauert, P. Klein, B. Lemaitre, D. Schmitt-Landsiedel, and R. Thewes, "Influence of fluorinated gate oxides on the low frequency noise of MOS transistors under analog operation," in Proceedings of the 28th European Solid-State Device Research Conference, pp. 472-5, 1998 discloses suppressing low-frequency noise by means of optimizing the fabrication process for the field effect transistors. This exploits the fact that the magnitude of the low-frequency noise critically depends on the quality of the interface between channel region and gate insulating layer. However, narrow limits are imposed on the technological optimization possibilities.
A further method for reducing the low-frequency noise is based on setting the operating point of the field effect transistors such that the low-frequency noise is minimized. By way of example, it is known that choosing the operating point within the framework of those operating points which are suitable for analog circuit technology permits a reduced noise power to be achieved, cf. S. Christensson, I. Lundstrom, and C. Svensson, "Low frequency noise in MOS transistors—I theory," Solid-St. El. 11, pp. 791-812, 1968. If Vg designates the gate voltage, Vt designates the threshold voltage and Vd designates the drain voltage of a field effect transistor, then Vg−Vt=100 mV to 1V and Vd>VgVt is a suitable choice. With this method, however, there is the restriction of the degrees of freedom in the circuit design from other standpoints, such as, e.g. power consumption, modulation range, bandwidth. Furthermore, the noise reduction that can be achieved by means of this method is small.
Since low-frequency noise voltages or noise currents in a MOSFET are inversely proportional to the root of the active area thereof, cf. S. Christensson, I. Lundstrom, and C. Svensson, "Low frequency noise in MOS transistors—I theory," Solid-St. El. 11, pp. 791-812, 1968, there is the possibility of reducing the low-frequency noise of a circuit by choosing the component areas to be sufficiently large. With this method, there is the increased area taken up. Moreover, an increased power consumption may result, particularly if the bandwidth of the circuit cannot be reduced, since then only the widths, but not the lengths of the transistors are permitted to be increased. The current consumption of the circuit or of the paths in which the relevant transistors are operated rises approximately proportionally to the width of the relevant transistors. Furthermore, all the capacitive loads that occur in a predetermined circuit rise the input capacitance of sensitive amplifier circuits.
DE 10001124 C1 to I. Bloom, and Y. Nemirowsky, "1/f noise reduction of metal-oxide-semiconductor transistor by cycling from inversion to accumulation," Appl. Phys. Lett. 58, pp. 1664-6, 1991 disclose that the low-frequency noise of a transistor can be reduced if the quasi Fermi level at the interface is periodically altered.
DE 10001124 C1, S. L. J. Gierkink, E. A. M. Klumperink, E. Van Tuijl, and B. Nauta, "Reducing MOSFET 1/f noise and power consumption by 'switched biasing'," in Proceedings of the 28th European Solid-State Circuits Conference, pp. 154-7, 1999 describe circuitry methods for reducing the low-frequency noise of MOSFETs. The method described in S. L. J. Gierkink, E. A. M. Klumperink, E. Van Tuijl, and B. Nauta, "Reducing MOSFET 1/f noise and power consumption by 'switched biasing'," in Proceedings of the 28th European Solid-State Circuits Conference, pp. 154-7, 1999 is restricted, however, to circuits in which the transistors are periodically switched on and off. This is not desirable, however, in many analog circuits since continuous signals are intended to be processed.
DE 44 35 305 A1 discloses a signal integrator operated with double sampling speed.
US 2003/0128776 A1 discloses a method and a device for reducing DC offsets in a communication system.
S. L. J. Gierkink et al. "Intrinsic 1/f Device Noise Reduction and Its Effect on Phase Noise in CMOS Ring Oscillators" In: IEEE Journal of Solid-State Circuits, 1999, Vol. 34, No. 7, pp. 1022-1025 discloses intrinsic reduction of 1/f noise and its effect on phase noise in CMOS ring oscillators.
E. Klumpernik et al. "Reducing MOSFET 1/f Noise and Power Consumption by Switched Biasing" In: IEEE Journal of Solid-State Circuits, 2000, Vol. 35, No. 7, pp. 994-1001 discloses a method for reducing 1/f noise and the power consumption in a MOSFET by means of switched biasing.
A mismatch of MOS transistors limits the resolution of circuits. This is the case if said circuits have to process very small signals. Consequently, the performance primarily of analog circuits is limited on account of these phenomena. Manufacturing tolerances (mismatch) of MOS transistors are also caused by the fluctuation of the dopant concentration in the transistor channel and in many cases constitute a great obstacle to the miniaturization of analog circuits.
Precise analog circuits, which are thus susceptible to manufacturing tolerances, are usually constructed in differential fashion. In this case, the transistors important for the function of the circuits (but not necessarily the transistors used for a current source) are doubly present, the pairs of transistors in each case processing signals that are different in their sign but are of identical type in terms of magnitude and phase. For the performance of the analog circuit, it is of crucial importance that the manufacturing tolerances between these transistor pairs become as small as possible.
Various methods are proposed in Enz, C C, Temes, G "Circuit techniques for reducing the effects of op-amp imperfections: auto zeroing, correlated double sampling and chopper stabilization", Proceedings of the IEEE, Vol. 4, No. 11, September 1996 for reducing the manufacturing tolerances in analog circuits. Firstly, it is possible to enlarge the area of a transistor and to implement a centered layout. In the case of this method, the area of the transistors used has to be enlarged to an extent such that it satisfies the mismatch requirements made of the respective circuit. This is often associated not only with circuitry disadvantages but also with higher manufacturing costs. Furthermore, Enz, CC, Temes, G "Circuit techniques for reducing the effects of op-amp imperfections: auto zeroing, correlated double sampling and chopper stabilization", Proceedings of the IEEE, Vol. 4, No. 11, September 1996 proposes autozeroing (for example correlated double sampling) and chopper stabilization.
A description is given below of the floating body effect and the self-heating effect, which can occur in partially depleted (PD) and in fully depleted (FD) SOI transistors ("silicon on insulator") in CMOS technology. These effects have an influence on the circuit design in particular of analog circuits.
With regard to the future development of semiconductor technology, alterations are to be expected away from conventional bulk CMOS processes toward SOI processes, and moreover toward double or triple gate transistor architectures. This expectation is evident e.g. from the International Technology Roadmap for Semiconductors, ITRS 2001.
Despite the advantages of SOI CMOS transistor technology compared with bulk CMOS transistor technology (for example the reduction of parasitic capacitances, the possibility of better diffusion resistances and capacitances, the better device insulation, whereby latch-up effects and substrate coupling effects are reduced, etc.), integrated SOI circuits using analog circuit technology have been investigated only little heretofore, see Tihanyi et al. "Properties of ESFI MOS transistors due to the floating substrate and the finite volume", IEEE Trans. Electron Devices, Vol. ED-22, p. 1017, 1975.
One problem of SOI field effect transistors is the floating body effect inherent to them, which leads to a kink effect in the case of the drain current. MOS transistors which are processed on SOI films, so that the channel region is partially depleted of charge carriers, or for example a double gate transistor on an SOI film, a vertical transistor on an SOI film (FinFET), etc., are exposed to the floating body effect, see Tihanyi et al. "Properties of ESFI MOS transistors due to the floating substrate and the finite volume", IEEE Trans. Electron Devices, Vol. ED-22, p. 1017, 1975, Chan et al. "Comparative Study of Fully Depleted and Body-Grounded Non Fully Depleted SOI MOSFETs for High performance analog and Mixed Signal Circuits", IEEE Trans. On Electron Devices, Vol. ED-42, No. 11, p. 1975, 1995.
The kink effect is brought about by the injection of holes or electrons into the floating substrate of an n-MOS transistor or of a p-MOS transistor on an SOI film. For an n-MOSFET in SOI technology, said holes are generated by means of impact ionization (clearly ionization through charge carrier introduction) into a region with a high electric field near the drain. Once they have been generated, the holes migrate into the region in which the electrical potential is lowest, that is to say in the direction of the floating substrate. Accumulation of holes increases the floating substrate potential until the substrate-source junction is sufficiently biased, for compensating for the current generated by hole generation. The accumulated charge in the body depends on the previous state of the transistor (that is to say its history), on process parameters, device dimension, supply voltage, temperature, slew rate and switching frequency.
The increase in the substrate potential leads to a reduction of the threshold voltage and results in a kink in the output characteristic curve or characteristic, as a result of which the gain of analog amplifiers and the constancy of current sources are impaired.
Another feature of SOI technology compared with bulk MOSFET technology is that the self-heating of individual devices is not negligible. This results from the poor thermal conductivity of the buried silicon oxide layer arranged beneath a silicon layer of an SOI substrate, so that the channel temperature of the SOI device may rise by tens of ° C. above the temperature at normal operation. The insulating substrate forms a thermal barrier, so that the heat generated by the operated device cannot simply be transferred to the substrate. The thermal conductivity of silicon oxide (SiO2) is a few orders of magnitude worse than that of bulk silicon. Therefore, in contrast to a bulk MOS transistor, significant self-heating can occur in the case of a MOS transistor on an SOI film. This self-heating occurs in any type of transistor structure which has a poor thermal coupling between the channel region and heat sinks, such as the bulk silicon or even the housing (e.g. all SOI or double or triple gate concepts).
If the device heats up, the mobility of charge carriers decreases in the channel region, which in turn reduces the drain current. Consequently, the device characteristic is significantly modified, with negative output conductivity, as can often be observed at high drain currents.
Thermal effects are in most cases not significant for digital circuits, on account of the low average energy dissipation, and by virtue of the fact that clock frequencies normally lie sufficiently far above thermal time constants. However, analog circuits can be significantly influenced by self-heating effects. The output conductivity can be low or even negative at low frequencies and can then rise with the frequency, which leads to unforeseen gain and phase variations. Interacting devices that adjoin one another may be at different temperatures, which may lead to a thermally induced mismatch. The temperature gradients which result from the self-heating effect and the thermal coupling effect lead to non-isothermal conditions and therefore to malfunctions, see Tenbroek et al. "Impact of Self-Heating and Thermal Coupling on Analog Circuits in SOI CMOS", IEEE Journal of Solid-State Circuits, Vol. 33, No. 7, p. 1037, 1998.
Possibilities for alleviating floating body effects of a MOS transistor on an SOI film are known, see Wei et al. "Minimizing Floating-Body-Introduced Threshold Voltage Variation in Partially Depleted SOI CMOS", IEEE Electron Device Letters, Vol. 17, No. 8, 1996. Among these possibilities, the body contact method appears to be the only circuit-oriented possibility. All the other concepts are related to device engineering. The body potential in a partially depleted SOI transistor is kept constant by the body contact, although the problem occurs as to how the system configuration can be optimized given simultaneous minimization of the effect of stray resistance and stray capacitance between the body contact path and the active region. Furthermore, it is known that the effectiveness of hole absorption falls rapidly if the channel width is increased. In particular, the physical definition of the contact to the FinFET or to the planar double gate transistor requires tricky lithography.
Fully depleted (FD) SOI devices in which an ultra thin silicon body of an SOI substrate having a thickness of 10 nm to 30 nm is used are naturally a good choice for analog/mixed signal applications, since they suppress the kink effect, see Colionge "Silicon-on-Insulator Technology: Material to VLSI", Norwel, Mass.: Kluwer, p. 139-141, 1991. However, even fully depleted device structures cannot prevent self-heating effects, and it is necessary to take account of the small process margin of FD devices with regard to the threshold voltage control, and also a loss of area. Furthermore, the high inherent body resistance and the high inherent body capacitance which are introduced by the body contact are problematic, and the floating body effects are far more serious in an analog design.
Even advanced double and triple gate concepts suffer from self-heating and, depending on how they are constructed, they may also be exposed to charge accumulation effects such as the kink effect in partially depleted SOI substrates.

Transistor arrangement, integrated circuit and method for operating field effect transistors


A laryngoscope for use with a disposable blade cover is provided. The laryngoscope comprises a handle and a blade. The laryngoscope further comprises an actuator system for selectively securing the disposable blade cover about at least a portion of the blade.

Laryngoscopes are common devices used in medical and surgical practice. A laryngoscope generally comprises a blade portion and a handle portion. The primary use of a laryngoscope is to expose the larynx of a patient to assist with the placement of an endotracheal tube. During endotracheal tube placement, laryngoscopes tend to be contaminated by the patient's oral fluids. Contaminated laryngoscopes endanger both medical practitioner and patients. Needed in the art is a convenient system and laryngoscope for use with a disposable blade covering that allows for decreased contamination.

Laryngoscope with disposable blade cover


A laminate of an air permeation preventive layer an adhesive layer provided with an air permeation preventive layer comprising a thermoplastic elastomer composition containing a thermoplastic resin as a continuous phase and a rubber composition dispersed therein as a dispersed phase and arranged on one surface of the air permeation preventive layer, an adhesive composition layer having a thickness of 100 μm or less, a self tack of less than 5N and a tack to an unvulcanized diene-based rubber or 5N or more, containing 100 parts by weight of a thermoplastic elastomer containing 50 parts by weight or more of an epoxy-modified styrene-butadiene-based block copolymer so that a total of 30 to 200 parts by weight of a terpene resin and an aromatically modified terpene resin having a weight average molecular weight Mw of 1000 or less and a softening point of 60 to 120° C., 0.1 to 3 parts by weight of an internal mold release agent and 0.1 to 2 parts by weight of an organic peroxide.

The technology of using a thermoplastic elastomer for the air permeation preventive layer of a pneumatic tire is known in the art (e.g., see Japanese Patent No. 2999188). For example, when extruding the thermoplastic elastomer, together with an adhesive layer in two layers in cylindrical shapes, if the adhesive layer arranged at the outside is too tacky, it will stick to the take-up (or wind-up) rolls at the time of shaping and seriously degrade the workability. Further, this requires the insertion of release paper, Mylar®, etc. between the tubular materials at the time of take-up—which is a problem in terms of cost and transport weight. Further, if the adhesive layer is insufficiently tacky, at the time of tire production, there is the problem that the air permeation preventive layer will end up peeling off from the tire carcass thereby making formation impossible. Further, if the amount of the cross-linking agent in the adhesive composition is too large, there is the problem of occurrence of scorching in the process of co-extrusion with the thermoplastic elastomer composition at a high temperature. Note that Japanese Patent Publication (A) No. 11-240108 proposes a laminate of a thermoplastic resin/a rubber, but the present invention is directed to the different technology in the object and constitution thereof.

Laminate and pneumatic tires made by using the same


A method for expanding preload capabilities of a memory to encompass a register file is provided. The method comprises predicting an address of a memory location containing data to be accessed by a first memory operation instruction that has not yet executed, prior to the first memory operation instruction executing moving the data in the memory location to an unassigned register file entry, and causing a renaming register to assign the register file entry to an architectural register. Responsive to the renaming register assigning the register file entry to the architectural register, the method further comprises permitting a second instruction to execute using the data moved to the register file, wherein the second instruction is dependent on the first memory operation instruction.

One metric for describing microprocessor performance is the load-use cost, which refers to the number of cycles that must pass between an operation that loads information from a memory location and an instruction that uses the information from that memory location. The load-use cost takes into account the time associated with removing information from memory, formatting the information, and storing the information in the register file of the processor for use by other instructions. Various schemes exist for lowering load use, such as caching schemes, which store a subset of the data in smaller, faster memory closer to the processor.
Register-renaming is used in some microprocessor designs. With register renaming, an architecturally specified register comprises a pointer that points to a much larger array of registers. This allows for speculative execution of instructions without excessive amounts of data movement.

Methods and systems for expanding preload capabilities of a memory to encompass a register file


A balanced hands clock. The clock utilizes a single movement, which movement may be located in the minute hand. A gear drive mechanism provides leverage from said movement via a first pivot shaft to drive the hour hand. The clock is mounted in a base for time indicating movement. Covers may be provided to hide the single movement and the gear mechanism, so that no visible drive configuration is visible to an observer.

In the art of building "mystery clocks", drive mechanisms may or may not be visible. However, in "mystery clocks" the driving mechanisms are intentionally designed to impede the unwary observer when trying to understand how the drive actually functions.
A few clocks with two independent balanced hands have been built in the past. Some of the basic principles utilized in the design and operation of balanced hand clocks are described in an article entitled "The Balanced-Independent-Hand Clock", by Rubens A. Sigelmann, The National Association of Watch and Clock Collectors, Inc. ("NAWCC") Bulletin, Vol. 44/2, pages 177-182, April, 2002. The basic principles as previously known in the art are illustrated in FIGS. 1 and 2. One type of a balanced-hand for a clock can be represented by the simplified illustration provided in FIG. 1. The balanced hand 10 is represented as extending between (a) a center of mass m1 located for reference purposes as at the pointing end 12 of indicating arrow 14, and (b) a center of mass m2 situated for reference purposes at location identified by reference numeral 16. The balanced hand 10 is suspended from, and rotates freely around, a pivot axis 18. The mass m1 represents all the mass above the point of suspension or pivot axis 18. Distance I1 represents the distance between the center of mass for mass m1 and the point of suspension at pivot axis 18. Similarly, m2 represents all mass, except for mass m3 discussed below, below the point of suspension and pivot axis 18. Distance I2 represents the distance between the center of mass for mass m2 and the point of suspension at pivot axis 18. Also as indicated in FIG. 1, the mass m3 rotates along a circle 20 of radius r.
Referring now to FIG. 1, consider the case when mass m3 rotates by an angle beta (β) in the counterclockwise direction. Due to the force of gravity GR as indicated downward along reference line 22, the new position of the balanced hand 10 is given by the angle alpha (α) from the vertical reference line 22. A balanced hand exhibits no eccentricity if, when the angle beta (β) is equal to zero (0), the balanced hand aligns along the gravity direction of reference line 22, as shown in FIG. 1. Thus, for a balanced hand without eccentricity the angles alpha (α) and beta (β) are related by the equation [1]:m1l1 sin(α)=(m2+m3)l2 sin(α)+m3r sin(α−β)
Thus, as described by the equation [1], in the event that the mass and distance balance relationships of the balanced hand is described by the equation [2] belowm1l1=(m2+m3)l2then the only way the equation may be satisfied is if the angle alpha (α) equals the angle beta (β). This is the condition for the balanced hand being balanced. Consequently, in a precisely balanced hand, when the mass m3 rotates a prescribed angle beta (β) in the counterclockwise direction about the movement axis at 16 of movement 17, the balanced hand rotates exactly the equivalent angle alpha (α) in the clockwise direction about the pivot axis 18.
Prior art clocks as described in the article noted above utilize two independent balanced hands, namely, one for the minute hand and one for the hour hand. In those clocks, a quartz movement drives a mass m3 in each of the balanced hands. However, in such prior art clocks, the minute balanced hand mass m3 (minute) is attached to the axle 16 of the movement in the minute hand 10, and a the hour balanced hand mass m3 (hour) is attached to an axle of the movement in an hour hand, with construction similar to that shown for the minute hand depicted in the prior art minute hand design depicted in FIGS. 1 and 2.


A non-aqueous electrolyte secondary battery of the present invention includes a positive electrode including an active material absorbing and desorbing lithium ions, a negative electrode including an active material absorbing and desorbing lithium ions, a separator interposed between the positive electrode and the negative electrode, and a non-aqueous electrolyte. The separator includes a material containing a substituent group with electron-withdrawing property. The non-aqueous electrolyte includes a non-aqueous solvent and a solute dissolved therein, and the non-aqueous solvent includes at least one selected from the group consisting of a fluorine-containing aromatic solvent, a fluorine-containing cyclic carbonic acid ester, and a fluorine-containing cyclic carboxylic acid ester.

In recent years, in non-aqueous electrolyte secondary batteries, lithium ion secondary batteries having a high voltage and a high energy density have been actively studied. In general, in lithium ion secondary batteries, a lithium-containing transition metal oxide such as LiCoO2 is used as a positive electrode active material, a carbon material is used as a negative electrode active material, and a porous film made of polyethylene or polypropylene is used as a separator. A non-aqueous electrolyte generally includes a non-aqueous solvent and a solute dissolved therein. For the non-aqueous solvent, a cyclic carbonic acid ester, a chain carbonic acid ester, a cyclic carboxylic acid ester, and the like are used, and for the solute, lithium hexafluorophosphate (LiPF6), lithium tetrafluoroborate (LiBF4), and the like are used.
Various attempts have been made to improve the positive electrode active material, the negative electrode active material, the separator, and the non-aqueous electrolyte, for the purpose of improving the battery characteristics. With respect to the separator, for example, the following improvements have been made.
Patent Document 1 suggests, in order to further improve the safety of batteries in the event of short circuit or in abnormal use, using a separator formed by laminating a porous film made of fluorocarbon resin such as polytetrafluoroethylene (PTFE), and a polyethylene or polypropylene film. In Patent Document 1, since the separator includes a fluorocarbon resin film having a high melting point, the melting of the separator in the event of abnormal heat generation can be prevented. As such, the safety of batteries can be further improved.
Patent Document 2 suggests, in order to further improve the safety of batteries including a metallic lithium as the negative electrode active material, using a separator comprising two layers having different pore sizes. The layer having a smaller pore size prevents the dendritic growth of the metallic lithium, and as a result, an internal short circuit that may occur during charge and discharge and an ignition that may occur in association with the internal short circuit can be prevented. Specifically, Patent Document 2 discloses a separator formed by laminating a polytetrafluoroethylene film and a polypropylene film having a small pore size.
On the other hand, with respect to the non-aqueous electrolyte, for example, the following improvements have been made.
In Patent Document 3, by adding fluorinated benzenes into the non-aqueous electrolyte, the cycle performance is improved.
Patent Document 4 suggests using monofluoroethylene carbonate as the non-aqueous solvent of the non-aqueous electrolyte. In Patent Document 4, since a stable coating film derived from monofluoroethylene carbonate is formed on the negative electrode, the improvement in cycle performance is achieved.
Patent Document 1: Japanese Laid-Open Patent Publication No. Hei 5-205721
Patent Document 2: Japanese Laid-Open Patent Publication No. Hei 5-258741
Patent Document 3: Japanese Laid-Open Patent Publication No. 2005-340026
Patent Document 4: Japanese Laid-Open Patent Publication No. 2004-063432

Non-aqueous electrolyte secondary battery

Abstract: The combination of the foregoing separator and the foregoing non-aqueous electrolyte makes it possible to suppress the deterioration in the rate performance of the battery even when the battery is stored under high voltage and high temperature.