Methods, non-transitory computer readable media, and computing devices for three-dimensional searching that precisely targets retrieval within diverse types of content includes retrieving web content in response to a received request from a client device. A destination page, an address within the page, and an offset distance from a starting point at the address to a correlated responsive portion of the web content to the received request is identified. The responsive web content with the identified destination page, the address, and the offset distance is provided to the requesting client device.

Traditional web searching is one-dimensional. By way of example, when a phrase is input into a web search engine, then the results for that searched phrase by the web search engine are simply provided as a list of different page locations which contain the phrase. In particular, each of these results in the list is one dimensional, i.e. each of these results is directed to a top location of the identified web page where the web search engine believes the result exists within the web page without any further precision. As a result, often when results are accessed, further effort by the end user to scroll down from the top of the web page is required to hopefully find the particular desired result from the initially initiated search. Accordingly, this often can be quite time consuming and tedious for the end user.
Prior solutions to address this issue have included initiation of a further search within the identified web page through the engagement a 'ctrl-f' command, reentry of the previously searched phrase again, and then initiation of that further search for that phrase within the web page. Although helpful, this process is still time consuming and tedious and requires further action and inputs from the end user. Additionally, this approach is not able to search within certain types of content which may be identified in the results of the search, such as video content where a relevant ten minutes of video content may be buried within two hours of video content.

Methods for three-dimensional searching to precisely target retrieval within diverse types of content and devices thereof


A method for producing a micromechanical component, preferably for fluidic applications having cavities. The component is constructed from two functional layers, the two functional layers being patterned differently using micromechanical methods. A first etch stop layer having a first pattern is applied to a base plate. A first functional layer is applied to the first etch stop layer and to the first contact surfaces of the base plate. A second etch stop layer, having a second pattern, is applied to first functional layer. A second functional layer is applied to the second etch stop layer and to the second contact surfaces of the first functional layer. An etching mask is applied to the second functional layer. The second and the first functional layer are patterned as sacrificial layers by the use of the first and the second etch stop layer by etching methods and/or by using the first and the second etch stop layer. By supplementing patterning of the base plate, additional movable fluidic elements may be implemented, using the method. The method is preferably used for producing a micropump having an epitactic polysilicon layer as the pump diaphragm.

Micropumps are used for various technical fields, particularly in the medical field, in order to convey small quantities of fluids in a precise manner. Micromechanical manufacturing methods are used for producing micropumps, silicon being used, for example, which may be simply and precisely patterned using appropriate depositing and etching methods.
This type of micropump is described in U.S. Pat. No. 6,390,791, which is produced on an SOI wafer. This micropump is made up of a triple stack having two glass wafers and an SOI wafer located in between. In order to produce a pump diaphragm, a monocrystalline silicon layer of the SOI wafer is used, for the production, for example, a dry etching method (DRIE) being used for patterning the silicon layer, and a sacrificial oxide etching method being used for exposing the patterns. The disadvantages of this method include that, in the high-rate etching method, the etching depth is established by the etching time, and is therefore not precisely controllable. If one does not keep precisely to the etching time, the result is a thickness variation of the functional layer of which the pump diaphragm is formed. This leads to different pump characteristics of the micropump. In addition, in the conventional method, it is disadvantageous that sacrificial oxide etching steps are required which have the effect of a nonreproducible undercut etching depth, since there is no lateral etch stop.

Micropump having a pump diaphragm and a polysilicon layer


A method and apparatus for expanding tubulars are disclosed. In one embodiment, an apparatus for radially expanding a tubular in a wellbore is disclosed. The apparatus includes an expansion swage. In addition, the apparatus includes at least one anchoring device for selective and releasable anchoring of selected parts of the apparatus to an inner surface of the tubular. The apparatus also includes a thruster providing a force for longitudinal movement of the expansion swage inside the tubular. Moreover, the apparatus includes a hydraulic valve for selective control of a flow of operating fluid to the thruster. The hydraulic valve includes a valve cylinder slidably positioned on a shaft and a position control device for selective and releasable securing a position of the valve cylinder on the shaft. The hydraulic valve also includes an elastic device for shifting the valve cylinder between two end positions.

1. Field of the Invention
This invention relates to the field of expandable tubulars and more specifically to a method and apparatus for running downhole tubulars of a diameter smaller than the size of the casing already installed in the wellbore and expanding the tubular to a larger diameter downhole.
2. Background of the Invention
Expandable tubulars have become a viable technology for well drilling, repair, and completion. In one technique, the expandable tubular string has a pre-expanded portion (e.g., expansion swage launcher) at the bottom of the string with the expansion swage inserted in the launcher. Hydraulic pressure may be applied through a drill pipe to an area below the expansion swage to generate a force for propagation of the swage through the tubular and subsequent expansion of the tubular. One drawback of this technique is the safety aspect of the operation at the end of the expansion process. For instance, when the expansion swage is exiting from the expanded tubular (e.g., "pop-out" point), the entire volume of expanded tubular may be under the high pressure, and the tubular may be radially and longitudinally stretched by the pressure. The expandable tubular string typically employed may have a length of several thousand feet and may be expanded by applying three thousand to five thousand pounds per square inch of pressure. The combined energy of the compressed liquid and of the elastically stretched tubular, when instantly released at the pop-out point, may propel the drill pipe with the expansion swage acting as a piston out of the well causing equipment damage and injuries to the rig personnel.
Another technique includes an expansion device having an expansion cone, an actuator capable of displacing the expansion cone, and two end anchors capable of preventing movement of the actuator when the expansion cone is displaced. A drawback of this device is that it may not reset automatically. For instance, the repeated steps of application and withdrawal of hydraulic pressure to the whole system, including drill pipe, are time consuming, uneconomical in operation, and not suitable for expanding long tubulars. Techniques have been developed to overcome such drawbacks. For instance, techniques include an expansion device that includes an expansion cone, an actuator, two or three anchoring devices as well as a sliding valve that may automatically reset the actuator. The sliding valve may be positioned in an annular chamber of a double-walled cone-guide shaft. In addition, the sliding valve may be displaced between a front position, in which the valve passage is at the front side of the actuator piston, and a rear position, in which the valve passage is at the rear side of the actuator piston. Drawbacks to such a design include that the valve does not provide passage for the liquid out of the chamber on one side of the piston when the pressure is applied in the chamber on the other side of the piston, which may create a pressure lock and make the actuator in-operational. Further drawbacks include that the modification of such valve design, in order to incorporate fluid passage out from one side of the actuator piston and pressure fluid entering on the other side of the actuator piston simultaneously, may be difficult because the sliding valve provides communication with high pressure line only.
Therefore, there is a need for a safe and efficient technique of tubular radial expansion in downhole conditions.

Method and apparatus for downhole tubular expansion


A peeling sheet supply unit is formed along an endless belt and is configured to supply a peeling sheet having a peeling surface on the endless belt. A first resin sheet transfer device is provided at a downstream side of the peeling sheet supply unit, and is configured to form a resin sheet by transferring a thermoplastic toner to a first region of the peeling sheet. A second resin sheet transfer device is provided at a downstream side of the first resin sheet transfer device and is configured to form a resin sheet by transferring a thermoplastic toner to a second region of the peeling sheet, the second region having a region different from a region overlapped with the first region.

1. Field of the Invention
Embodiments described here relate to a resin sheet manufacturing apparatus and a resin sheet manufacturing apparatus.
2. Description of the Prior Art
In the past, there is a method for manufacturing a picture-printed resin sheet. The method for manufacturing the resin sheet is to form a resin sheet and print a picture thereon by using an ink or the like.
Also, there are known various label manufacturing technologies. For example, Jpn. Pat. Appln. KOKAI Publication No. 2007-283745 proposes a label producing method and apparatus in which in the case of a label coated with an adhesive on a rear surface, an electrophotographic image forming apparatus using a toner is employed, without making a cutting die, and a label having an arbitrary shape is formed at a desired timing by sequentially forming a label base material, label image, and a seal material on a peeling sheet coated with an adhesive. Also, as a main component of a toner for the label base material, a polyvinyl acetal resin is used.
Also, Jpn. Pat. Appln. KOKAI Publication No. 2010-184470 discloses an example in which a UV-curable polyester resin is used as a constituent resin of the label.
Furthermore, for example, Jpn. Pat. Appln. KOKAI Publication No. 2011-107418 discloses a label forming method and apparatus that use an electrophotographic image forming apparatus and forms a label having a sufficient thickness.
However, the above-described resin sheet manufacturing method has the following problem. That is, printing on the resin sheet provides no stereoscopic effect to the printing and has a lack of diversity. Also, the printing may be erased by water or oil.

Resin sheet manufacturing apparatus and resin sheet manufacturing method

CASIO ELECTRONICS MANUFACTURING CO., LTD.


There is provided a semiconductor device including (a) a semiconductor chip, (b) a wiring making. electrical connection with the semiconductor chip and containing copper (Cu) therein, (c) a solder ball making contact with the wiring and containing tin (Sn) therein, and (d) a layer made of copper-tin (Cuxe2x80x94Sn) alloy, sandwiched between the wiring and the solder ball, and having a thickness equal to or greater than about 1.87 micrometers. The copper-tin alloy layer strengthens connection between the wiring and the solder ball, and hence, ensures reduction in occurrence of breakage and/or cracking in the wiring and the solder ball. As a result, it would be possible to avoid the solder ball from being separated from the wiring due to the breakage and cracking. Accordingly, a fabrication yield of the semiconductor device can be enhanced.

The invention relates to a semiconductor device and a method of fabricating the same, and more particularly to enhancement of a fabrication yield of a semiconductor device.
In response to requirement for an electronic device to accomplish higher performance, to be smaller in size and lighter in weight, and to be able to operate at a higher rate, many new semiconductor devices have been developed. For instance, an electronic device is formed smaller in size and lighter in weight by more highly integrating a semiconductor chip to thereby fabricate a semiconductor device in smaller size and weight.
FIGS. 1A to 1C illustrate a conventional semiconductor device. FIG. 1A is a cross-sectional view of a conventional semiconductor device, FIG. 1B is an enlarged view of a connection between a wiring layer and a solder ball, and FIG. 1C is a cross-sectional view illustrating that the semiconductor device illustrated in FIG. 1A is electrically connected to a printed wiring board.
With reference to FIG. 1A, the conventional semiconductor device is comprised of a semiconductor chip 1, a film substrate 3, a polyimide adhesive layer 31 adhering the film substrate 3 to the semiconductor chip 1, a resist 32 covering the wiring layer 2 therewith and formed with a land 7 which is a recess formed at a surface thereof, a wiring layer 2 formed on the film substrate 3, a solder ball 101 mounted on the wiring layer 2 in the land 7, a gold (Au) layer 8 covering the wiring layer 2 therewith within the land 7, a metal 5 filled in a through-hole 4 formed through both the film substrate 3 and the polyimide adhesive layer 31, and a gold (Au) layer 6 covering therewith the metal 5 at a top surface thereof
The wiring layer 2 is in electrical connection with the semiconductor chip 1, and contains copper (Cu) therein. The solder ball 101 contains tin (Sn) therein. Though FIG. 1A explicitly illustrates the gold layer 8 formed on the wiring layer 2, it is considered that the gold layer 8 is diffused into the solder ball 101 in a heating step such as a temperature cycle test to be carried out after completion of the semiconductor device, and hence, it is further considered that the gold layer 8 will not exist on the wiring layer 2 after such a heating step is carried out.
As illustrated in FIG. 1C, the semiconductor device illustrated in FIG. 1A is electrically connected to a printed wiring board 34 through the solder ball 101.
FIG. 2A is an enlarged view of the wiring layer 2 and the solder ball 101, wherein the solder ball 101 is composed of Snxe2x80x94Pb eutectic solder containing tin 82 at 63% and lead 83 at 37%. FIG. 2B is a partially enlarged view of a boundary between the wiring layer 2 and the solder ball 101. As illustrated in FIG. 2B, a Cuxe2x80x94Sn alloy layer 81 having a thickness of 1.75 micrometer to 2.0 micrometer is sandwiched between the wiring layer 2 and the solder ball 101.
A method of fabricating the conventional semiconductor device illustrated in FIGS. 1A to 1C is explained hereinbelow with reference to FIGS. 3A to 3H and 4A to 4H. FIGS. 3A to 3H are partial cross-sectional views of the semiconductor device illustrated in FIG. 1A.
First, as illustrated in FIG. 3A, the wiring layer 2 containing copper therein is formed on an upper surface of the film substrate 3, and the adhesive layer 31 is formed on a lower surface of the film substrate 3. The film substrate 3 has a thickness of 12 micrometers, the wiring layer 2 has a thickness of 18 micrometers, and the adhesive layer 31 has a thickness of 10 micrometers. The film substrate 3 is composed of a material having a resistant to a temperature of 250 degrees centigrade or greater, such as polyimide. The adhesive layer 31 is composed of polyimide.
Then, as illustrated in FIG. 3B, the wiring layer 2 is patterned into a predetermined pattern.
Then, as illustrated in FIG. 3C, the patterned wiring layer 2 and the film substrate 3 are both covered with the resist 32.
Then, as illustrated in FIG. 3D, there is formed the through-hole 4 through the adhesive layer 31 and the wiring layer 2, for instance, by means of a laser beam gun.
Then, as illustrated in FIG. 3E, the through-hole 4 is filled with the metal 5 such as copper or aluminum.
Then, as illustrated in FIG. 3F, the metal 5 is covered at a top surface thereof with the gold layer 6.
Then, as illustrated in FIG. 3G, the resist 32 is formed with the land 7 above the wiring layer 2. In later steps, the solder ball 101 is mounted on the wiring layer 2 in the land 7.
Then, as illustrated in FIG. 3H, the land 7 is covered with the thin gold layer 8.
Thus, there is completed a tape substrate 93 comprised of the film substrate 3 having the wiring layer 2 formed on the upper surface. Though FIGS. 3A to 3H illustrate only one land 7, it should be noted that the film substrate 3 is in the form of a sheet, and the film substrate 3 is formed with a plurality of lands 7 in each of which the solder ball 101 is to be mounted in later steps.
A method of mounting solder balls on the wiring layer 2 is explained hereinbelow with reference to FIGS. 4A to 4H.
First, as illustrated in FIG. 4A, the tape substrate 93 resulted from the steps illustrated in FIGS. 3A to 3H is placed with the gold layer 6 being upwardly directed. For simplification, the gold layer 6 is not illustrated in FIG. 4A.
Then, as illustrated in FIG. 4B, stiffeners 41 are adhered on the tape substrate 93 at opposite its opposite ends. The stiffeners 41 are composed of copper or stainless, for instance. The stiffeners 41 are used for fixing the tape substrate 93 when the semiconductor chip 1 is mounted onto the tape substrate 93.
Then, as illustrated in FIG. 4C, the semiconductor chip 1 is mounted on the tape substrate 93, surrounded by the stiffeners 41. Then, the gold layer 6 is electrically connected to an electrode 12 of the semiconductor chip 1 through a bonding wire (not illustrated). The connection is accomplished by means of a bonding tool, a heater and a ultrasonic wave generator (not illustrated).
Then, as illustrated in FIG. 4D, resin 42 is applied between the tape substrate 93 and the semiconductor chip 1, and then, is cured to thereby reinforce a connection between the tape substrate 93 and the semiconductor chip 1. The resin 42 is composed of epoxy resin in liquid, for instance.
Then, as illustrated in FIG. 4E, a product resulted from the step illustrated in FIG. 4D is covered with a cover 43 for the purpose of protection of the semiconductor chip 1. Then, the cover 43 is sealed under atmospheric pressure. The cover 43 is made of Cu, Al or SiC, for instance.
Electrically conductive adhesive 44 such as Ag paste or Cu paste is coated on a lower surface of the cover 43. The adhesive 44 is heated, and hence, cured when the cover 43 is sealed.
Then, as illustrated in FIG. 4F, the solder balls 101 are absorbed to a positioner 45, and subsequently, the solder balls 101 are mounted onto the lands 7 formed above the wiring layer 2. Thereafter, flux (not illustrated) is applied across the solder balls 101 and the lands 7. Then, the solder balls 7 are caused to reflow to thereby physically connect the solder balls 101 to the lands 7. Then, the flux is washed out.
Thus, there is completed such a product as illustrated in FIG. 4G. The product is then subject to a temperature cycle test in order to test performances and resistance to damages.
Then, as illustrated in FIG. 4H, the solder balls 101 are caused to reflow to thereby physically connect the solder balls 101 to the printed wiring board 34. Thus, there is completed a semiconductor device as a final product.
However, the conventional semiconductor device illustrated in FIGS. 1A to 1C is accompanied with the following problem.
As mentioned earlier, a semiconductor chip is highly and highly integrated in order to meet requirement of fabricating a semiconductor device in a smaller size and a smaller weight. In a more highly integrated semiconductor chip, the greater number of pins has to be formed per a unit area of a semiconductor chip, resulting in a smaller spacing between adjacent pins. As the number of pins is increased, the number of external terminals, that is, solder balls to be connected to one semiconductor chip is also increased, resulting in a smaller spacing between adjacent solder balls.
In general, as a spacing between adjacent solder balls is decreased, a contact area through which a solder ball is connected to a wiring layer is also decreased. As a result, a connection strength between a solder ball and a wiring layer is reduced.
As explained above, in the conventional semiconductor device illustrated in FIGS. 1A to 1C, since a contact area through which the solder ball 101 makes contact with the wiring layer 2 is relatively small, a connection strength between the solder ball 101 and the wiring layer 2 is resultingly small. Accordingly, a connection at which the solder ball 101 is connected to the wiring layer 2 is likely to be broken or cracked, resulting in separation of the solder ball 101 from the wiring layer 2. This results in deterioration in fabrication yield of the semiconductor device.
In view of the above-mentioned problem, it is an object of the present invention to provide a semiconductor device which is capable of preventing separation of a solder ball from a wiring layer, and further, to provide a method of fabricating a semiconductor device which method is capable of doing the same.
In order to solve the above-mentioned problem, the inventors had studied enhancement in strength at a connection between a solder ball and a wiring layer. As a result of the long-term study, the inventors had found out that it would be possible to enhance the strength by forming a copper-tin alloy layer between a solder ball and a wiring layer to thereby prevent occurrence of breakage and cracking at a connection between a solder ball and a wiring layer. The inventors had further found out that it would be possible to form a copper-tin alloy layer by keeping a solder ball mounted on a wiring layer, at a temperature equal to or greater than a melting point of the solder ball for a predetermined period of time in inactive or reducing gas atmosphere.
Specifically, in one aspect of the present invention, there is provided a semiconductor device including (a) a semiconductor chip, (b) a wiring making electrical connection with the semiconductor chip and containing copper (Cu) therein, (c) a solder ball making contact with the wiring and containing tin (Sn) therein, and (d) a layer made of copper-tin (Cuxe2x80x94Sn) alloy, sandwiched between the wiring and the solder ball, and having a thickness equal to or greater than about 1.87 micrometers.
If the copper-tin alloy layer had a thickness smaller than 1.87 micrometers, it would be impossible to sufficiently enhance a strength at a connection between a solder ball and a wiring layer, resulting in that the connection might be broken or cracked in a heating step such as a temperature cycle test, in which case, a solder ball is separated from a wiring layer.
However, it would be possible to enhance a strength at a connection between a solder ball and a wiring layer by forming the above-mentioned copper-tin alloy layer having a thickness equal to or greater than about 1.87 micrometers, between the solder ball and the wiring layer. As a result, it would be possible to prevent or reduce occurrence of breakage or cracking at the connection, ensuring that the solder ball is not separated from the wiring layer. Thus, the present invention enhances a strength at the connection, and hence, enhances a fabrication yield of a semiconductor device.
It is preferable that the copper-tin alloy layer has a thickness equal to or greater than 2 micrometers, and more preferable that the copper-tin alloy layer has a thickness equal to or greater than 3 micrometers.
There is further provided a semiconductor device including (a) a semiconductor chip, (b) a wiring making electrical connection with the semiconductor chip, having first and second surfaces, and containing copper (Cu) therein, (c) a solder ball making contact with the wiring at the first surface and containing tin (Sn) therein, (d) a film substrate making contact with the wiring at the second surface, the film substrate being formed with a through-hole reaching the wiring, (e) an electrical conductor filling the through-hole therewith, (f) a first layer covering the electrical conductor therewith at the opposite side of the wiring, and made of gold, and (g) a second layer made of copper-tin alloy, sandwiched between the wiring and the solder ball, and having a thickness equal to or greater than about 1.87 micrometers.
The above-mentioned semiconductor chip makes it possible to enhance a strength at a connection between a solder ball and a wiring layer by forming the above-mentioned copper-tin alloy layer having a thickness equal to or greater than about 1.87 micrometers, between the solder ball and the wiring layer. As a result, it would be possible to prevent or reduce occurrence of breakage or cracking at the connection, ensuring that the solder ball is not separated from the wiring layer. Thus, the present invention enhances a strength at the connection, and hence, enhances a fabrication yield of a semiconductor device.
It is preferable that the solder ball contains agglomerates scattering therein, the agglomerates being composed of material other than tin.
For instance, the agglomerates are composed of lead (Pb) scattering at a density of 20xc3x97104 mmxe2x88x923 or greater.
If the lead agglomerates scatters at a density smaller than 20xc3x97104 mmxe2x88x923, a solder ball is likely to be deformed by the lead agglomerates, in which case, a connection between a solder ball and a wiring layer might be broken and cracked in a heating step such as a temperature cycle test, and hence, it would be impossible to prevent separation of the solder ball from the wiring layer.
However, if a solder ball contains lead agglomerates at a density of 20xc3x97104 mmxe2x88x923 or greater, it would be possible to prevent deformation of the solder ball, and hence, occurrence of breakage and cracking at the connection. As a result, it would be possible to prevent separation of the solder ball from the wiring layer which separation is caused by the above-mentioned breakage and cracking of the connection. Thus, the present invention enhances a strength at the connection, and hence, enhances a fabrication yield of a semiconductor device
It is preferable that the lead agglomerates have a cross-sectional area of 10 square micrometer or smaller in average.
If the lead agglomerates have a cross-sectional area greater than 10 square micrometer in average, a solder ball is likely to be deformed by the lead agglomerates, in which case, a connection between a solder ball and a wiring layer might be broken and cracked in a heating step such as a temperature cycle test, and hence, it would be impossible to prevent separation of the solder ball from the wiring layer.
However, if the lead agglomerates have a cross-sectional area of 10 square micrometer or smaller in average, it would be possible to prevent deformation of the solder ball, and hence, occurrence of breakage and cracking at the connection. As a result, it would be possible to prevent separation of the solder ball from the wiring layer which separation is caused by the above-mentioned breakage and cracking of the connection. Thus, the present invention enhances a strength at the connection, and hence, enhances a fabrication yield of a semiconductor device
The semiconductor device may further include a printed wiring board making electrical connection with the solder ball.
In another aspect of the present invention, there is provided a method of fabricating a semiconductor device, including the steps of (a) forming a wiring containing copper (Cu), on a substrate, (b) mounting a solder ball containing tin (Sn), on the wiring, and (c) keeping a product resulted from the step (b), in inactive gas atmosphere or in reducing gas atmosphere at a temperature equal to or greater than a melting point of the solder ball.
In accordance with the above-mentioned method, tin contained in the solder ball is diffused in liquid into the wiring layer containing copper, resulting in that a copper-tin alloy layer is formed between the solder ball and the wiring layer, having a thickness sufficient to prevent the solder ball from being separated from the wiring layer. The thus formed copper-tin alloy layer enhances a strength of a connection between the solder ball and the wiring layer, and hence, ensures that the connection is not broken and cracked. Thus, the present invention enhances a strength at the connection, and hence, enhances a fabrication yield of a semiconductor device.
The product resulted from the step (b) is kept in an inactive or reducing gas atmosphere for a predetermined period of time sufficient to enhance a strength of a connection between the solder ball and the wiring layer.
For instance, the product is kept in an inactive or reducing gas atmosphere for an hour or longer.
There is further provided a method of fabricating a semiconductor device, including the steps of (a) forming a wiring containing copper (Cu), on a substrate, (b) covering the wiring with a resist having a recess through which the wiring appears, (c) forming a through-hole through the substrate so that the through-hole reaches the wiring, (d) filling electrical conductor in the through-hole, (e) covering the electrical conductor with a gold layer, (f) connecting the substrate to a semiconductor chip. (g) mounting a solder ball containing tin (Sn), in the recess, and (h) keeping a product resulted from the step (g), in inactive gas atmosphere or in reducing gas atmosphere at a temperature equal to or greater than a melting point of the solder ball.
In accordance with the above-mentioned method, tin contained in the solder ball is diffused in liquid into the wiring layer containing copper, resulting in that a copper-tin alloy layer is formed between the solder ball and the wiring layer, having a thickness sufficient to prevent the solder ball from being separated from the wiring layer. The thus formed copper-tin alloy layer enhances a strength of a connection between the solder ball and the wiring layer, and hence, ensures that the connection is not broken and cracked. Thus, the present invention enhances a strength at the connection, and hence, enhances a fabrication yield of a semiconductor device.
The method may further include the step of forming a gold layer on the wiring in advance of mounting the solder ball on the wiring.
By forming a gold layer on the wiring and then mounting the solder ball on the gold layer, it would be possible to prevent the wiring layer from being oxidized.
There is provided a semiconductor device including (a) a semiconductor chip, (b) a wiring making electrical connection with the semiconductor chip and containing copper (Cu) therein, (c) a solder ball making contact with the wiring and containing tin (Sn) therein, and (d) a layer made of copper-tin (Cuxe2x80x94Sn) alloy, sandwiched between the wiring and the solder ball, and having a thickness equal to or greater than about 1.87 micrometers, the semiconductor device being resulted from the steps of (a) forming the wiring on a substrate, (b) mounting the solder ball on the wiring, and (c) keeping a product resulted from the step (b), in inactive gas atmosphere or in reducing gas atmosphere at a temperature equal to or greater than a melting point of the solder ball.
There is further provided a semiconductor device including (a) a semiconductor chip, (b) a wiring making electrical connection with the semiconductor chip and containing copper (Cu) therein, and (c) a solder ball making contact with the wiring and containing tin (Sn) therein, the solder ball containing lead (Pb) agglomerates scattering therein at a density of 20xc3x97104 mmxe2x88x923 or greater, the semiconductor device being resulted from the steps of (a) forming the wiring on a substrate, (b) mounting the solder ball on the wiring, and (c) keeping a product resulted from the step (b), in inactive gas atmosphere or in reducing gas atmosphere at a temperature equal to or greater than a melting point of the solder ball.
There is still further provided a semiconductor device including (a) a semiconductor chip, (b) a wiring making electrical connection with the semiconductor chip and containing copper (Cu) therein, and (c) a solder ball making contact with the wiring and containing tin (Sn) therein, the solder ball containing lead (Pb) agglomerates scattering therein, the lead agglomerates having a cross-sectional area of 10 square micrometer or smaller in average, the semiconductor device being resulted from the steps of (a) forming the wiring on a substrate, (b) mounting the solder ball on the wiring, and (c) keeping a product resulted from the step (b), in inactive gas atmosphere or in reducing gas atmosphere at a temperature equal to or greater than a melting point of the solder ball.
The above and other objects and advantageous features of the present invention will be made apparent from the following description made with reference to the accompanying drawings, in which like reference characters designate the same or similar parts throughout the drawings.

Semiconductor device with increased connection strength between solder balls and wiring layer


A superabsorbent polymer having improved absorption under pressure and fast absorption rate is obtained by first providing a solution containing carboxylic acid monomers or water soluble salts thereof, and a crosslinking agent. A carbonate blowing agent and a polymerization initiator are added, individually or in combination, to the solution to form a carbonated monomer solution. A polymerization initiator is then added to the carbonated monomer solution which is then polymerized at temperatures ranging from about 0.degree. C. to about 130.degree. C., forming a microcellular hydrogel. The microcellular hydrogel is chopped or ground into gel pieces having a particle diameter ranging from about 0.1 mm to about 5.0 cm. The gel pieces are dried at temperatures ranging from about 85.degree. C. to about 210.degree. C., and are then ground to form a polymer having a particle size of from about 0.05 mm to about 5.0 mm. A mixture is formed from 100 parts by weight of the polymer and about 0.001 to about 30 parts by weight of a surface crosslinking agent. The polymer is reacted with the surface crosslinking agent to crosslink molecular chains existing on a surface of the polymer, forming the superabsorbent polymer.

Superabsorbent polymers are water insoluble, hydrogel-forming polymers capable of absorbing large quantities of aqueous fluids including synthetic urine, brines, and biological fluids such as urine, sweat, and blood, while retaining the absorbed fluids under pressure. Hydrogel-forming superabsorbent polymers are useful as absorbents for water and aqueous body fluids when the polymers are incorporated in absorbent articles, such as disposable diapers, adult incontinence pads, sanitary napkins, and bandages. Many of the existing superabsorbents are formed from unsaturated carboxylic acid monomers including acrylic acid, methacrylic acid, alkylacrylates, and acrylamides which are rendered water insoluble by crosslinking.
The degree of crosslinking affects the absorbent capacity and gel strength of a superabsorbent. Capacity is a measure of the amount of fluid which a given amount of superabsorbent polymer will absorb. Gel strength indicates the tendency of the hydrogel once formed to deform under an applied stress. Polymers exhibiting inadequate gel strength will form a hydrogel which deforms and fills the void space in an absorbent article, inhibiting absorbent capacity and fluid distribution throughout the article. Polymers having low absorbent capacity are incapable of absorbing a sufficient amount of the fluid encountered in use of a diaper or other absorbent article. A polymer having a high gel strength generally possesses a low absorption capacity, and a polymer having a high absorption capacity typically possesses a low absorption rate because of gel blocking phenomenon or low gel strength after absorption.
Another characteristic that a superabsorbent polymer must possess is an acceptable level of extractable, water soluble polymer remaining within the superabsorbent. The extractable polymer can leach out of a hydrogel when fluids contact the superabsorbent. The extractables that leach out of the superabsorbent apparently lower the absorption speed and capacity of the superabsorbent, resulting in leakage of the fluid from an absorbent article.
Commercially available superabsorbents generally possess sufficient capacity, but do not have adequate gel strength, swell rate (i.e., absorption speed) and absorption under pressure for the absorbent articles of reduced size and thickness that are now being produced. As fluff fiber in absorbent products is replaced with greater amounts of superabsorbent polymer, the polymer has to perform the functions of the fluff fiber. The polymer must quickly absorb fluid and transport it throughout an absorbent article without releasing the stored fluid from the swelled hydrogel on exertion of pressure. Accordingly, the swollen gel particles cannot impede absorption of additional fluid by forming a barrier, but must maintain their liquid permeability.
In order to improve the absorption speed of superabsorbent polymers, blowing agents have been incorporated into superabsorbents as described in U.S. Pat. Nos. 5,118,719 and 5,145,713. As the blowing agent is dispersed throughout the monomer solution during polymerization, it releases carbon dioxide when heated. The porosity of the resultant superabsorbent polymer provides more surface area within the polymer particles, increasing the rate at which fluid is absorbed by the polymer.
The absorption under pressure of a superabsorbent has been improved by crosslinking the molecular chains at the surface of the polymer. Surface crosslinkage also improves the gel strength of the polymer and reduces the amount of extractables at the polymer surface. Although capacity is reduced at the polymer surface, the core of the polymer, which has lower crosslink density, retains its absorbance capacity. Crosslinking at the surface of the polymer particles provides spacings between the particles when swelled, allowing fluid to pass the swelled particles and travel throughout the absorbent article. Surface crosslinkage, however, frequently reduces the absorption speed of the polymer. While these materials possess adequate absorption under pressure, they absorb significantly slower than the fluff fiber they are replacing in thinner personal care articles.
The polymers which have been crosslinked at their surface (herein referred to as core polymers) are not porous materials like those disclosed in U.S. Pat. Nos. 5,118,719 and 5,145,713. Accordingly, these superabsorbents generally exhibit slow rates of absorption. U.S. Pat. Nos. 4,666,983 and 5,140,076 disclose absorbent polymers formed from reacting an absorbent resin powder having a carboxyl group with a crosslinking agent having at least two functional groups per molecule to crosslink the surface of the polymer. German Patent No. 4,020,780 describes surface crosslinked superabsorbent particles formed by coating monomers having acid groups with an alkylene carbonate. U.S. Pat. No. 5,229,466 discloses surface crosslinking by treating a water swellable carboxyl group containing polymer with a solution of an N-(hydroxyalkyl)-beta-(meth)-alanine ester or a polycondensation product thereof. A superabsorbent polymer made from acrylic acid, a water soluble polysaccharide and a crosslinking monomer having at least two polymerizable ethylenically unsaturated double bonds per molecule is described in U.S. Pat. No. 5,145,906. Water absorbent resins surface treated with a polyquaternary amine are disclosed in U.S. Pat. No. 4,824,901.
There is a need for a method of producing a water absorbent resin which exhibits high absorbency under pressure, high absorption speed and high gel strength.

Superabsorbent polymer having improved absorption rate and absorption under pressure


The electrical connector includes an electrical terminal, a housing delimiting a chamber for receiving the terminal along a reception direction (X), successively at a reception position and at a retained position, a pawl hinged to one amongst the housing and the terminal, and a stop fixed to the other amongst the housing and the terminal. Said pawl and stop cooperate for retaining the terminal at its retained position, and said housing includes a guiding wall with guiding surface on which the terminal is pushed against by the pawl being elastically pushed back. The guiding surface comprises a raising slope inclined toward the inside of the chamber along the reception direction (X) 1 the slope being located to be climbed on by the terminal pushed from its reception position to its retained position. Application in the automotive industry.

A connector comprises a supporting housing carrying a set of terminals, each terminal being crimped with an electrical wire. The connector thus obtained is intended to be connected with a set of pins, for instance carried by a electrical board, each pin coming into contact with a terminal.
For mounting the connector, each terminal is first crimped to a wire, and then inserted into a receiving chamber of the housing. In the chamber, the terminal is retained by means of a pawl and a stop. Usually, the pawl is hinged to the housing and the stop is arranged on the terminal, although the pawl may be hinged to the terminal.
Several problems arise with current connectors.
During its insertion, the terminal strikes the base of the pawl and pushes it back elastically. Afterward, the terminal reaches a retained position where the pawl is released and retains the terminal from going backward the reception direction.
In order to avoid unwanted disengagement of the terminal, the pawl is generally made very stiff, which increase the insertion force needed to push it back. Stiffness can be obtained through thickness of pawl foot or through longer stroke of pawl.
Since terminals are usually inserted by human operator, the pawl cannot be made too stiff, and unwanted disengagement may still occur.
Moreover, the pawl often rests against the stop only with a limited area of its contact surface. This happens when the stop is shifted laterally relative to the pawl, for instance because of clearance.
Here again, this may lead to unwanted disengagement of the terminal.
Moreover, in case the connector is exposed to vibrations, it is preferred that the terminal when in its final position is held tightly. Therefore it is preferred that the terminal is adjusted with small clearance within the receiving chamber.


A pressure measured by a load cell is converted into a digital signal by an A/D converter provided in an analog interface, and is processed by a digital filter provided in the analog interface. A sensor signal processed in the digital filter is transferred to a controller 10 for industrial machinery every transfer cycle via an optical fiber. A digital sampling cycle by the A/D converter is set to be shorter than the transfer cycle.

1. Field of the Invention
The present invention relates to a transfer apparatus for transferring measurement data detected by a sensor in various industrial machineries.
2. Description of the Related Art
In various industrial machineries, various physical amounts are detected by a sensor attached to an industrial machinery, and detection signals thereof (analog signals) are transferred to a controller of the industrial machinery directly or via an amplifier. On the other hand, an A/D converter, which is provided inside the controller, converts the received detection signals into digital signals, and the controller utilizes the same for controlling.
For example, in an injection molding machine, a pressure applied to an injection screw for detecting a resin pressure inside a heating cylinder is detected by a sensor such as load cell, and a detection signal thereof (analog signal) is transferred to a controller for controlling the injection molding machine. On the other hand, an A/D converter, which is provided inside the controller, converts the received detection signal into a digital signal, and the controller utilizes the digital signal converted (pressure information) for injection control (see Japanese Patent Application Laid-Open No. 9-76318).
The analog signal measured by the sensor is digitally sampled in the A/D converter to be converted into a digital signal, and the digital signal converted is serially transferred to the controller. On the other hand, the digital signal received from the sensor is subjected to a filtering processing in a digital filter for noise removing, and the controller utilizes the same.
When the sensor output is transferred to the controller in the state of analog signal, there is a problem that noise occurring along with the transfer of analog signal is easily mixed in a sensor signal.
At the sensor side, the A/D converter digitally samples a sensor detection signal to convert it into a digital signal, and transfers the same to the controller. On the other hand, at the controller side, the transferred digital signal is subjected to a filtering processing for noise removing, and is then utilized. In this case, the sensor signal received by the controller is a signal every transfer cycle. Finally, a cycle at which the signal detected by the sensor is digitally sampled in the A/D converter is limited to the transfer cycle. It is useless that A/D conversion is performed at a sampling cycle shorter than the transfer cycle, and an accuracy of the sensor signal which can be grasped by the controller is determined by the transfer cycle.
Since the filtering processing is performed by the digital filter for noise removing at the controller side, the filtering processing is realized only after the serial transfer is performed a predetermined number of times or more. Thus, there is a problem that it takes much time after the sensor detects the physical amount until the controller utilizes the sensor output signal, causing a delay.

Data transfer apparatus for industrial machinery


The animal waste collection sheet is planar and is consisted of a top sheet which is liquid permeable, a back sheet which is liquid impermeable and an absorbent sheet disposed between the top sheet and the back sheet. The top sheet has a high fiber density region in a thickness direction thereof, with a fiber density higher than an average fiber density of the top sheet, at least in a part of a side facing the absorbent sheet. The average fiber density is preferably in the range of 0.005 to 0.20 g/cm3, and a fiber density of the high fiber density region is preferably in the range of 0.007 to 0.25 g/cm3.

1. Field of the Invention
The present invention relates to an animal waste collection sheet for disposing the discharged matter of pets and the like.
2. Related Art
Conventionally, a so-called pet sheet using an absorbent sheet has been known as a pet litter for indoor-kept animals such as dogs and cats, to facilitate the disposal of discharged matter such as urine. For example, Japanese Unexamined Patent Application No. 2001-309730 (hereinafter referred to as Patent Document 1) and Registered Utility Model No. 3056800 (hereinafter referred to as Patent Document 2) disclose planar pet sheets including a top sheet which is liquid permeable, a back sheet which is liquid impermeable and an absorbent sheet disposed between the top sheet and the back sheet.
In general, a top sheet constituting a pet sheet such as the abovementioned Patent Documents 1 and 2 includes a conventionally known point bond non-woven fabric, a perforated film and the like. However, pet sheets using these conventional top sheets have following problems: leakage of the discharged matter from edge portions of pet sheet, due to running of the liquid on the top sheet and lack of liquid holding capacity; a highly visible urine trace due to a low masking property, leading to an unclean appearance after a repeated use; and a damp or chill surface due to absorbed urine, which discourages pets against using the pet sheet repeatedly.
To address the abovementioned problems, the thickness or the weight of a non-woven fabric constituting the top sheet may be simply increased for an increased masking property and a lowered thermal conductivity. However, a top sheet with increased thickness or weight retains urine and does not allow the urine to be completely absorbed by an absorbent body, and is unfavorable in view of appearance and hygiene. Especially, since pet sheet is a product generally used indoors such as living rooms, solution for the abovementioned problems is extremely important for the target animals and the users; however, function of the conventional pet sheets are insufficient and unsatisfying.


The present disclosure provides a pillow cover (10) and pillow having a plurality of compartments (22). The pillow cover (10) includes a top sheet (12) and a bottom sheet (14) that are connected to define a chamber (16). The plurality of compartments (22) is located on the top sheet (12) opposite the chamber. An envelope (30) is located on the bottom sheet (14) adjacent to the chamber (16). A releasable fastener (40) is connected to and located between the top sheet (12) and the bottom sheet (14). The pillow includes a pad (52) located in the envelope and may include an insert (62) located in the chamber.

Conventional pillow covers or cases are typically constructed from one or two rectangular panels of fabric which are sewn together at some of the edges so as to create an enclosure with one open end. The open end of the pillow cover is typically left open so as to facilitate removing a pillow from, or inserting a pillow into, the pillow cover so that when the pillow is inserted into the pillow cover, the pillow cover surrounds the pillow on three of the four edges of the pillow.


A burner tray (10) for a domestic gas fire has a gas inlet (12), and a ceramic fibre blanket (18) lining its bottom surface (11), the blanket distributing gas over substantially the whole area of the tray while reducing heat loss to the tray and increasing the heat output of the fire.

This invention relates to a domestic gas fire, particularly a decorative coal or log effect gas fire.
To provide a coal or log effect gas fire, the gas from a domestic supply is first distributed over the area of a fire burner tray which is fitted in the fire grate. The most common method at present used for distributing the gas is to fill the tray with silica sand which covers a gas inlet in the bottom of the tray. In one alternative, the gas is introduced into a hollow perforated tube resting on the bottom of the tray, the tube then being covered with the silica sand.
Apart from silica sand, alternative distributing materials have included vermiculite granules, expanded clay and other refractory aggregates, mineral or ceramic wool, and slotted refractory boards.
Existing gas fires sometimes incorporate a flame failure valve responsive to a pilot light. The pilot light generally requires its own piped supply of gas, the pilot assembly being provided as a "bolt-on" accessory to the basic fire. These accessories add to the cost of the fire and are often difficult to install and adjust.
Existing fires also suffer from undesirable gas hiss. Attempts to reduce or eliminate this hiss have previously been made but have been unsuccessful and/or required more complex burner trays. For example, in UK Patent 1561099 there is disclosed a gas fire burner tray fitted with a silencer which consists of a separate chamber containing a non-combustible porous material such as mineral wool or ceramic wool. The combustion region of the tray may also be part filled with mineral or ceramic wool.
A further disadvantage of exiting gas fires is that a substantial amount of heat is lost by conduction to the metal burner tray.


A power transmission device for transmitting a power of a maximum torque of T (kgf-m) from an engine to a device at an output side, having a torque converter (1) and a speed change device (3). The torque converter (1) includes an impeller (5) receiving the power from the engine (E), a turbine (6) opposed to the impeller (5) and a stator (7) disposed between the impeller (5) and the turbine (6), and has a torus of an outer diameter determined in the following range with respect to the engine torque T: EQU D=2.5T+(170 to 183). The speed change device (3) has a continuous speed change unit (16) and is operable to transmit an output of the torque converter (1) at a variable speed.

A. Field of the Invention
The present invention relates to a power transmission device, and in particular to a power transmission device having a variable speed changing device including a continuous speed changing unit.
B. Description of the Background Art
Power transmission devices for automobiles may be categorized into a variety of groups. One group of transmission devices includes the combination of a user activated mechanical clutch and a gear train commonly referred to as a standard or manual transmission (MT). Another group of transmission devices includes the combination of an automatic transmission device having a torque converter and a hydraulically controlled gear train. Such an automatic transmission device will be referred to herein after as an "AT" device. Another group of transmission devices includes the combination of an automatic clutch device, which can be one of various kinds of clutches, and a variable speed changing device, such as a continuous speed changing belt-pulley configuration. Such a variable speed changing device will be referred to hereinafter as a "CVT" device (Continuously Variable Transmission).
A CVT device generally is configured to allow for a continuously variable speed ratio, where the ratio of an engine's output rotation speed to the output of the transmission device is continuously variable. Such CVT devices usually include belts which have a large torque transmission capacity.
In a power transmission device provided with the CVT device, an engine is coupled to the CVT device by an automatic clutch device such as an electromagnetic clutch. However, the automatic clutch device such as an electromagnetic clutch has disadvantages, and for example, it will not allow a vehicle to creep forward at an extremely slow speed. The sudden engagement of electromagnetic clutches precludes the possibility of a vehicle creeping forward. In order to improve driving characteristics of the vehicle, a CVT device is combined with a torque converter in some cases.
CVT devices are often used in small cars where space is at a premium. Therefore, it is important to minimize the space taken by all components of the drive train. A problem with torque converters used with CVT devices is that the torque converter is large and takes up a fair amount of space.
Further, when the torque converter is combined with the CVT device, the capacity of the torque converter is often considered and determined in a manner similar to torque converters used with an AT device. In determining the capacity of a torque converter, a required capacity coefficient C is calculated based upon torque characteristics of the engine so that performance of the engine may be maximized. The capacity coefficient C represents the toque which can be inputted into the torque converter at a certain rotational speed, and is expressed as follows: EQU C=Ti/Ni.sup.2
where Ti represents an input torque, and Ni represents an input rotation speed. The capacity coefficient C is proportional to the outer diameter of a torus, the torus being defined by, for instance, the turbine of the torque converter. The capacity coefficient C is proportional to the outer diameter D of the torus to the fifth power. The capacity coefficient C may also be expressed as follows: EQU C=Ti/Ni.sup.2 =K.multidot.D.sup.5
where K is a coefficient depending on a type and a structure of the torque converter as well as properties of fluid and the speed ratio of input to output of the torque converter. Based on the above relationships, the size of the torque converter is generally determined from an estimated value of the outer diameter of the torus (the outer diameter of the turbine of the torque converter).
A CVT device is typically smaller than an AT device having a similar capacity. Even so, it is desirable to reduce the size of the torque converter used with the CVT device.

Power transmission device with continuous speed control


A system and method for dynamically updating a web page display. Web pages modification is accomplished by receiving a uniform resource locator (URL) message having embedded application parameters, selecting desired portions of the application parameters, modifying the web page with the selected portions, and displaying the modified web page to the user. Application parameters may be search criteria used to find the search results, and the search criteria may be displayed along with the search results. The search results may include a number of entries each having an entry name and corresponding information location. A serial list of entries is received and a web page listing the entry names in an organized fashion is dynamically created. Hyperlinks between each entry name and its corresponding information location are then created, which allows information at the information location to be displayed when the corresponding entry name is selected.

1. Technical Field
The present invention relates to a system and method for dynamically updating web page displays.
2. Related Art
There are many prior art systems which interact with a user to application parameters which are sent to an application running on a processing system, either local or remote. The application processes the application parameters to create information in a response. For example, the application parameters may be search criteria sent to a search engine running locally, on a local area network (LAN), a wide area network (WAN) or the Internet. The data searched may also be local, on a LAN, a WAN, or on the Internet. The results found are presented to the user on a display, however, the search criteria is not displayed. This requires the user to remember the exact search criteria when reviewing search results.
The search results are typically categorized and presented to the user as a serial list of entry names (each representing a category) and a hyperlink to an information location of information corresponding to the entry name. Typically, much of the serial list runs off of the screen. It was difficult to comprehend the list since only a small portion may be viewed at a time. Prior art methods have tried to 'hardcode' names for categories representing the data returned and list the names in a table format to show more of the information together on each page. However, the categories change over time and the 'hardcoded' names no longer match the data returned.
Therefore, there is currently a need for a system, and associated method, that describes what type of information is being displayed.

System and method for dynamically updating web page displays

International Business Machines Corporation


A device for automatically providing program information to a television display upon detection of an event in the program. The event being a user definable event. The device also provides automatic PIP display of the program having the event and a delay of the event so that it is not missed by the viewer.

A television feature called PIP allows a television viewer to view a main television program while monitoring (typically in a small "window") another PIP program. When an exciting event occurs in the PIP program, the viewer can swap the program being viewed in the main display with the program being viewed in the PIP. The problems with such a system are that the viewer cannot monitor the audio information in the PIP, and in addition the PIP occupies a portion of the main display which is quite annoying to a viewer watching on the program information in the main display.
For viewers without PIP, many will switch from a favorite channel to another channel while waiting for some event to occur on the favorite channel. It is typical, for example, for a viewer to switch back and forth between a football game and some other programming while there is little action in the football game, but many times a touchdown is missed without the viewer even knowing it.
In previously known television receiving devices aimed at solving these problems, such as that disclosed in U.S. Pat. No. 5,585,865, the televisions monitor the program content of a channel by relying on additional data which is transmitted with a television signal, such as the data received from the Extended Data Service (EDS). In this prior art television receiver a user selects a particular genre of programming that he/she would like to view such as "Sports". The EDS data is then extracted from the incoming video signals and compared to the genre selected by the viewer. If a match is found on a particular channel the television tuner is switched to this channel.
The problems associated with such a system is that it requires "program type" data, which indicates the type of program (e.g. "Sports" "Movie" "News" etc.), to be transmitted in addition to the video signal. The user therefore must rely on the broadcasters to agree to transmit such "program type" data. Even if there is an agreement among broadcasters to transmit this data, such a monitoring system does not permit a user to monitor data on a user defined basis and more importantly the user cannot monitor events occurring in the video signal or in the audio signal but only events occurring in the EDS data. In particular the user cannot monitor information occurring within the program such as when a favorite sports figure's name is mentioned during a program, whether it is during a sporting event or simply on the news. Similarly, it is known to detect header information in the transmitted signal for various purposes, but to date a user has been unable to define what information the user would like to detect in the video signal or audio signal.

Method and device for detecting an event in a program of a video and/or audio signal and for providing the program to a display upon detection of the event


There is provided a method and apparatus for tracking of items and containers of items. The method comprises generating a set of unique item identifier codes, each identifier code corresponding to a specific item in a set of items. Then, at a production line, uniquely identifying multiple items by marking the multiple items with the corresponding unique item identifiers. The method further includes detecting the unique item identifiers on the set of items and transmitting the detected unique item identifiers to a processor. After aggregating items into containers, containers are marked with container identifiers. The method then associates the detected container identifier in the database with detected item identifiers.

Counterfeiting and contraband is a major problem in many industries, and in particular the tobacco industry. To detect counterfeit products, there is a need to be able to authenticate genuine products throughout the supply chain. In order to authenticate a product as genuine, a manufacturer may uniquely mark each product during manufacture and then use that mark or marks to determine whether the product is genuine at a later time.
One way to authenticate a product that is shipped in a container holding a plurality of products is to mark the container with an identifier and to mark each individual product within the container with an identifier. The container identifiers and product identifiers are stored in a database together. A check can be made later in the supply chain to determine whether the product identifiers for products in a particular container correspond to the container identifier for the container. This check consists of comparing a read container and product identifier pair with pairs of identifiers stored in the database. If a matching container identifier and product identifier is in the database, then the product is determined to be genuine.
However, these existing systems are not practically possible to implement for very high volume products, and in particular for cartons of cigarettes in a case. The difficulty with the authentication method is often the volume of data that needs to be stored and sent in order to implement it.
The limitations of the existing systems are further highlighted when secure identifiers are used. For example, the product identifiers placed on certain products (such as easily counterfeited, expensive, or otherwise controlled products) may be complex in order that each identifier is unique and in order that the marking protocol cannot easily be discovered by potential counterfeiters. For this reason, product identifiers can be also encrypted. Secure tracking systems require additional data storage and time for authentication.
In distribution and logistics of many types of products, track and trace, or tracking and tracing, concerns a process of determining the current and past locations (and other information) of a specific product. In this context, the inventive item tracking system allows track and trace of products at individual unit level, as well as at the container level. As used herein, a "unit" of a product is considered to be a single item that is tracked through the system. A unit may eventually be sold in commerce as an individual item, or product. A "container" is an aggregation of two or more units of the product, and the container may also be sold as a single product in commerce. Multiple containers, each comprising multiple units, can be further aggregated into containers of containers. The systems described herein are applicable to various industries, such as the cigarette, food, and pharmaceutical industries, as well as any other industry that produces significant quantities of products that are aggregated into collective packaging. The systems are applicable to all types of goods, including as non-limiting examples, pharmaceuticals and other consumer goods, without regard to the speed at which the goods are produced.

Method and apparatus for unit and container identification and tracking


In a support frame of an interface card module, two module locks are disposed thereon, both the support frame and the module locks having enlarged operational holes for easy operation for a user. To install the interface card module on a housing of an electronic device, the module locks are pushed and moved by the housing and withstood by the housing. The user may directly operate the module locks through the enlarged holes to disengage the module locks from the housing and to uninstall the interface card module. The interface card module further uses a card lock pivoted on the support frame for locking the interface card at the support frame.

1. Field of the Invention
The invention relates to an interface card module and an electronic device having the interface card module, and more particularly, to an interface card module and an electronic device having the same that facilitates easy installation in consideration of ergonomics.
2. Description of the Prior Art
Newly developed server structures like the cloud server structure in the form of 2U4 nodes contain mainstructure with ½U for each node. With the highly compacted disposition within each node, various kinds of interface cards, such as interface cards with PCI or AGP interface, are commonly used in the node for functional expansion. These interface cards configuration may also be used as an expansion carrier of GPU, Raid, etc. Practically, each interface card should be assembled with a dedicated support frame to make an interface card module, which is then installed on the server.
However, there is no clear operational guide for helping a user to quickly and easily install such interface card modules on the server or remove them from the server. Users may not be able to start from exactly a right position to install or remove the interface card module. In addition, most interface card modules provide no easy-to-handle structure.

Interface card module and electronic device having the same


The method and system include marking a surgery site (e.g., location of surgical incision) or a site of other medical action with a machine-readable medical marking (e.g., bar code or a dot pattern), which may be used in conjunction with (1) a scanner for reading the machine-readable medical marking and (2) a controller for controlling medical actions in response to the read machine-readable medical marking. The system and method ensure the validation of the surgical procedure, the patient awaiting the surgical procedure, and the site or location on the patient where the surgery is to be performed. Utilizing a scanning device for reading machine-readable medical markings, and a controller, there are additional means to check and double check the medical action before the actual medical action (e.g., surgery) is performed.

1. Field of the Invention
The present invention relates generally to a system and method for using a machine-readable medical marking for managing medical actions or procedures, and more particularly, to generating and using machine-readable medical markings that are used for accessing up-to-date data associated with a patient's medical information (e.g., pre-operative and post-operative information as well as information on the surgical procedure itself).
2. Discussion of the Background
During known surgical procedures, it is possible for mistakes to be made because a doctor incorrectly identifies any one of (1) a patient, (2) a procedure to be performed, (3) allergies of the patient, (4) site of the surgery, (5) level of the surgery, (6) diagnostic reports (e.g., lab reports for test results, blood results, etc.). Such a mistake may occur because there is an insufficient connection between (1) the patient (who may be unconscious), (2) the patient's information, and (3) the information about the patient's procedure. Accordingly, a need exists for providing a greater connection between (1) the patient (who may be unconscious), (2) the patient's information, and (3) the information about the patient's procedure.

System and method of utilizing a machine readable medical marking for managing surgical procedures


A signal acquisition and distance variation measurement system for laser ranging interferometers comprising a signal acquisition unit. This unit comprises a frequency detection subsystem to detect the frequency of a received laser beam measurement signal which is buried in noise, wherein the subsystem comprises an acquisition subsystem with a wavelet packet decomposition unit and a phase/frequency detector PLL; a main PLL unit being coupled to the frequency detection subsystem for receiving the detected frequency of the measurement signal for phase estimation of the measurement signal; and a phasemeter band detection subsystem for detecting whether the measurement signal frequency is higher or lower than a reference signal frequency of a reference laser beam by operating a known change to the frequency of the reference signal and measuring the consequent change in the frequency of an interference signal for having the phase of reference signal locked to the measurement signal phase.

The invention relates to a signal acquisition and distance variation measurement system for laser ranging interferometers, in particular for use in a space application, having a signal acquisition unit.
In the past, spaceborne laser terminals have been employed only for communication purposes. However, investigations have been made to use laser instruments as radio instruments due to their reliability. As a result, future planned missions such as eLISA, NGO and, next generation geodesy missions are going to implement laser technology in order to measure distance variations between satellites of a satellite constellation as the interference of a reference beam with a measurement beam allows performing range measurements with a precision equal to a fraction of the laser wavelength. The range measurement relies on a tacking phasemeter and on the accuracy with which it is able to evaluate the phase of the interference signal.
By means of a satellite constellation, gravitational waves and planet gravimetry can be studied, as their orbital trajectories are influenced by these physical phenomena. A technique used to evaluate trajectory anomalies introduced by gravimetry or by gravitational waves is measuring the phase difference of an electromagnetic signal between a transmitting-receiving-satellite. This technique has been employed by the Gravity Recovery And Climate Experiment (GRACE) which addresses its measurements through a microwave link between a trailing and a following satellite. It is known that measurement accuracy can be highly improved using a laser link rather than a microwave link.
The accuracy of the laser range measurement relies on a phasemeter, mainly on a PLL (Phase-Locked-Loop), which measures the phase difference between a measurement beam and a reference beam. The main architecture of phasemeters is based on so-called mixing phase detector PLLs as they exploit the most accurate phase measurement when compared to other PLL concepts. The drawback of these PLLs is the small pull-in-ranges which constrains the maximum frequency offset allowable between the input signal and the VCO (Voltage Controlled Oscillator).
Before establishing a measurement link, the satellite constellation has to undergo an initial signal acquisition phase. Independently from the complexity of this mandatory process, which can vary according to the mission and/or instrument layout, the initial frequency offset between the input signal and the VCO can reach up to 200 MHz or more. The phasemeter requires a build-in frequency estimation stage algorithm, respectively, in order to properly steer the VCO frequency of the main PLL towards the incoming beatnote.
From prior art, the importance of the main PLL in addressing the range measurement accuracy is known. In this sense, efforts have been made in developing phasemeter prototypes and signal processing algorithms in order to fulfill a specific mission requirement.
A more broadband view on signal processing for the initial signal acquisition may be made by using FFT (Fast Fourier Transformation) or DFFT (Digital Fast Fourier Transformation) based algorithms. These algorithms, working in a frequency domain, require, in addition to the main PLL board, processing units where FFT algorithms are implemented. These are used to initialize the main PLL and lock the incoming measurement signal (Laser Light Signal). FFT based algorithms can also be directly implemented in FPGAs (Field Programmable Gate Array). Nevertheless, the amount of FPGA logic elements and memory required by these algorithms in order to detect with sufficient accuracy the correct frequency of the received signal in a reasonable amount of time makes it almost impossible to implement a full phasemeter in just a single FPGA.
The inference of the phasemeter detection band is implicitly designated via the mandatory signal acquisition phase. Until now, no dedicated autonomous process for the inference of the phasemeter detection band is known.

Signal acquisition and distance variation measurement system for laser ranging interferometers


Methods and devices for searching for a missing person. Data sources are accessed through an IP network to obtain information about the missing person. Based on the obtained information, potential scenarios are develop of the current location of the missing person. The information is disseminated to search entities that search the geographic areas of the potential scenarios. Additional information is obtained about the missing person during the search to further develop the potential scenarios and focus the search areas.

Search and rescue is the search for and provision of aid to people who are in distress or imminent danger. The general field of search and rescue includes many specialty sub-fields, typically determined by the type of terrain the search is conducted over. These include mountain rescue; ground search and rescue, including the use of search and rescue dogs; urban search and rescue in cities; combat search and rescue on the battlefield and air-sea rescue over water.
Search and rescue actions are time-sensitive as the missing person is often in need of aid. Many search and rescue operations gather huge amounts of information that could prove useful in finding the person. However, it is difficult to parse through this amount of information in a timely manner.
The United States Coast Guard is a leader in the United States in conducting search and rescue missions. Unfortunately, the budget constraints have reduced the amount of available funds to back these missions. Therefore, better approaches are required that use less money and/or resources but still provide the necessary results of finding missing persons.


A guide for an esophageal echo probe includes a bite block with a collar about one end thereof to seat about the patient's mouth and a sleeve of low friction, flexible, form-retaining material having a generally arcuate configuration and dimensioned and configured to extend from the patient's mouth through the ovopharynx and into the esophagus. A secondary guide extends along the length of the bite block and sleeve and provides a passage seating an orogastric tube to lead the sleeve through the ovopharynx and into the esophagus. The passage through the bite block and sleeve is dimensioned to slidably receive and guide a transesophageal echo probe for placement in the patient's body.

The present invention relates to guides for medical instrumentation, and, more particularly, to a guide for a transesophageal echo probe.
Recent developments in heart surgery for repaired diseased arteroventricular valves and replacement of diseased semilunar valves have resulted in increasing usage of homograft valves, i.e., valves from organ donors, instead of the synthetic valves which have heretofore been most widely used. Whether a valve is repaired or a homograft valve or synthetic valve is utilized, the surgeon wishes to ensure that the operation of the valve is satisfactory while the patient is still coupled to the bypass machine and before completely closing the thoracic cavity.
To provide such an evaluation of valve operation, or even evaluate cardiac function after any operation, an esophageal echo probe is introduced through the mouth and passed downwardly into the esophagus to a point within the patient's body where the operation of the valve can be monitored. The probe has a diameter of approximately 3/4 inch and requires guidance into the esophagus. Despite the patient's unconscious state, there is a substantial gag effect and there is also a tendency for the patient to bite down on anything which is being introduced into the mouth and being forced downwardly. Echo probes are expensive instruments having a value on the order of $30,000, and they are extremely sensitive; thus a patient who bit the instrument could cause substantial damage.
Furthermore, the size of the probe is such that there is frictional contact between its surface and the tissue about the passages through the pharynx and esophagus, and this can result in damage to the tissue.
Accordingly, it is an object of the present invention to provide a novel guide which, when placed in the patient, will facilitate insertion and guidance of the transesophageal echo probe into the desired position within the patient's body.
It is also an object to provide such a guide which will protect the probe from injury by the patient's teeth.
Another object is to provide such a guide which will minimize the gag effect on the patient resulting from the insertion of a device of such size.
A further object is to provide a novel method for inserting a transesophageal echo probe into a patient utilizing a guide which will facilitate its introduction without damage to the pharynx and esophagus.


A phosphor including a matrix in the form of titanate expressed by Ca1-xSrxTiO3 (0<x≦0.5), and Pr (praseodymium) and Li (lithium) that are added to the matrix. The phosphor may further include Zn (zinc) that is added as well as the Pr and Li to the matrix. Also disposed is a process of manufacturing the phosphor, including: a mixing step of mixing a matrix material, a first additive material including Pr, and a second additive material including Li, so as to obtain a mixture; and a firing step of firing the obtained mixture at a firing temperature of from 1050 to 1250° C.

1. Field of the Invention
The present invention relates in general to a phosphor and also a fluorescent display device equipped with the phosphor as a light emitting source.
2. Discussion of Related Art
Conventionally, there has been used a Zn1-xCdxS based phosphor (hereinafter referred to as ZnCdS based phosphor) as a phosphor that is to be excited by a low-velocity electron beam used in a fluorescent display device such as VFD (Vacuum Fluorescent Display), to emit a red luminous color. In recent years, use of toxic element such as Cd (cadmium) is restricted in view of environmental issue, and ZnCdS based phosphor is also subjected to such a restriction. Further, another problem is that, where ZnCdS based phosphor as sulfide is decomposed by irradiation of an electron beam thereto, an electron emission capacity of oxide cathode serving as an electron source is reduced by S (sulfur) scattering from the ZnCdS based phosphor. In the present specification, the term "low-velocity electron beam" is interpreted to mean an electron beam accelerated by an electric voltage of 10-100 (V) suitable for the VFD, unless otherwise specified.
On the other hand, there is proposed, as an oxide based phosphor which does not include Cd and S and which is exited by a low-velocity electron beam to emit a red luminous color, a phosphor including a matrix constituted by an alkaline earth metal and an oxide of Ti (titanium), and an rare earth element and a group III element that are added to the matrix. The alkaline earth metal may be, for example, Mg, Sr, Ca or Ba. The rare earth element may be, for example, Ce, Pr, Eu, Tb, Er or Tm. The group III element may be, for example, Al, Ga, In or Tl. As a typical example of the composition, there is SrTiO3:Pr,Al as disclosed in patent documents 1 and 2 that are identified below. The elements Pr, Al given on a right side of ":" are components added to SrTiO3. In this composition, a preferable amount of Pr is from 0.1 to 2 (mol %), while a preferable amount of Al is from 1 to 50 (mol %) (see the patent document 1).
In addition, although not being used for the VFD, there is proposed CaTiO3 based phosphor as another example of the composition in which the alkaline earth metal is Ca, as disclosed in non-patent documents 1-3 that are identified below. In the non-patent documents 1-3, there are disclosed, for example, CaTiO3:Pr excited by an electron beam accelerated by an electric voltage of 700 (V) or higher, CaTiO3:Pr,Al excited by an ultraviolet, and CaTiO3:Pr, Li excited by an electron beam accelerated by an electric voltage of 1 (kV).
[Patent document 1]
JP-H08-85788A (publication of unexamined Japanese Patent Application laid open in 1996)
[Patent document 2]
JP-2003-41246A (publication of unexamined Japanese Patent Application laid open in 2003)
[Non-patent document 1]
Vecht et al. "New electron excited light emitting materials" J. Vac. Sci. Technol. B 12(2), March/April 1994 p. 781-784
[Non-patent document 2]
P. T. Diallo et al. "Improvement of the optical performances of Pr3+ in CaTiO3" Journal of Alloys and Compounds 323-324 (2001) p. 218-222
[Non-patent document 3]
Seung-Youl Kang et al. "The Influence of Li Addition on Cathodoluminescence for CaTiO3:Pr3+" EURODISPLAY 2002 p. 777-779
SrTiO3:Pr,Al phosphor disclosed in the patent document 1 has a problem that its service life is short due to considerable deterioration of its brightness. The patent document 2 discloses a technique for restraining the deterioration of the brightness by covering a surface of each particle of the phosphor with a protective coating that is made of compound of the matrix. However, even with the application of such a technique thereto, the service life of SrTiO3:Pr,Al phosphor is still considerably shorter than that of ZnCdS based phosphor. Further, the brightness of SrTiO3:Pr,Al phosphor covered with the protective coating is lower even in its initial stage than that of ZnCdS based phosphor.
Regarding CaTiO3 based phosphor disclosed in the non-patent documents 1-3, where it is excited by a low-velocity electron beam, its brightness is at most about one-tenth as high as that of ZnCdS based phosphor. Thus, CaTiO3 based phosphor can not be used for the fluorescent display device such as VFD.


The present invention concerns articles having an outer surface that bears at least two layers of metal particles, wherein the at least two layers comprise an outermost layer and an intermediate layer; the outermost layer consisting essentially of aspherical metallic particles having a mean particle size of 50 to 500 microns; and the intermediate layer consisting essentially of substantially spherical metallic particles having a mean particle size of from 50 to 500 microns. In some embodiments, the outer surface has a volume porosity of between about 20% to about 80%.

There are a number of design criteria which have long been sought for segmental bone replacement implants including (1) the implant should last the lifetime of the patient without losing function or initiating any adverse process response; (2) the implant should restore the normal function of the bone in which it is implanted; and (3) the implant should be producible on a commercial scale. To satisfy the foregoing criteria, not only should the implant support the imposed load, often of a fluctuating nature, but the interface between the implant and the bone should also withstand the load requirement.
A plastic cement such as polymethyl methacrylate is often used to affix an implant to bone as well as to improve the fit between the implant and the bone. Implants also have been provided with porous coatings which mate with the bone and invite bone ingrowth such that, after a period of time, the prosthesis becomes integrated into the bone structure. Typical of such coatings are the those disclosed in U.S. Pat. Nos. 3,855,638; 4,206,516; 4,156,943; and 4,612,160.
Ceramic coatings have also been used to good effect and often are particularly desirable because of the affinity between bone and ceramic materials such as alumina (Al2O3). Typical of such coatings are those disclosed in U.S. Pat. Nos. 4,145,764 and 4,483,678 to which are particularly concerned with dental implants, and U.S. Pat. Nos. 4,309,488 and 4,846,837, which more broadly disclose implantable bone replacement material for use throughout the body.
Other work has utilized highly convoluted surfaces on the implant. U.S. Pat. Nos. 5,368,881 and 5,658,333 show use of non-spherical powder to produce a roughened surface for prosthesis. These surfaces, however, are known to have little to no inter-connected porosity.
There is a continued need in the art for prosthesis surfaces with improved properties.

Sintered coatings for implantable prostheses


An automobile surface protectant composition containing volatile silicone which when applied to a wet surface displaces water and imparts gloss and water repellency. Preferably, the composition includes a volatile silicone fluid, an amino-functional silicone fluid, and an organopolysiloxane fluid.

This invention relates to a liquid surface protectant composition used to impart a durable high gloss finish, as well as water repellency, to surfaces such as painted automobile surfaces, vinyl, rubber, and leather goods. The invention also relates to a method of using the composition.
Surface protectant compositions, polishes, and waxes containing silicone compounds are known in the art. For example, high gloss protective coatings for automobile finishes have traditionally involved the application of a wax to the dry exterior surface followed by buffing the applied wax. A wide variety of products formulated with hydrocarbon or vegetable-based waxes, silicone polymers, and various additives are commercially available. Nearly all waxes, however, are difficult to apply uniformly and require extensive buffing to provide a high gloss or shine. In addition, these coatings are not well suited for application to rubber and vinyl surfaces. Moreover, the surface typically must be dried prior to applying the wax.
Protective coatings which can be applied onto the rubber, vinyl, or leather surfaces of an automobile are also known. Typically, these protective coatings are applied using an aerosol or pump spray applicator. These protective coatings are generally emulsions, either an oil-in-water or a water-in-oil type, which require substantial wiping to achieve uniform gloss. Unfortunately, these coatings typically are not suitable for the painted surfaces of the automobile.
Consequently, there exists a need for a surface protectant composition that can be applied to a variety of surfaces yet is easy to apply, is self-leveling over the surface and provides a high gloss. More importantly, there exists a need for a surface protectant that can be applied to the surface when the surface is wet to impart a gloss and water beading performance onto the surface.


A differential voltage magnitude comparator to receive a differential input signal and a differential reference signal, in which a magnitude difference of the differential input signal is compared to the magnitude reference of the differential reference signal. An output state depends on the magnitude difference of the differential input signal to the magnitude difference of the differential reference signal. If the magnitude difference of the differential input signal is below the magnitude difference of the differential reference signal, the output is in one state, but if the magnitude difference of the differential input signal is above the magnitude difference of the differential reference signal, the output is in the other state. The comparison and logical operation to provide the output states are generated in single stage.

The present invention relates to the field of semiconductor circuits and more particularly to a comparator circuit.
A comparator circuit is utilized for many applications. In general a comparator receives two inputs and generates an output based on the comparison of the two input signals. The comparison is typically looking at the amplitude or magnitude of the input voltages. A differential voltage magnitude comparator is a type of a comparator in which two differential input signals are provided to the comparator and a differential output is generated from the comparator. In one application one of the differential inputs is a reference signal. For example if the reference signal is a steady state voltage value the reference input then can be used to elevate the signal level of one of the other differential inputs for performing the comparison.
For example, a differential comparator can be used to detect squelch (or unsquelch) for a receiver coupled to receive an input signal. For example, such a receiver can be coupled to a communication line or bus to discern when valid traffic is present on the line. When the traffic is sent over a single differential pair the presence of valid traffic is defined by the voltage difference between the pair of data lines comprising the differential pair. The state in which traffic is present is defined as the unsquelch state while the absence of traffic is defined as the squelch state. A comparator circuit can be used to identify the squelch/unsquelch states.
The present invention provides for a differential voltage magnitude comparator in which one of the applications of the comparator of the present invention is to perform the squelch/unsquelch detection.

Differential voltage magnitude comparator


The invention provides isolated nucleic and amino acid sequences of a taste cell receptor that serves as a sensor for the bitter taste of phenylthiocarbamide (PTC), antibodies to such PTC taste receptor, methods of detecting such nucleic and amino acid sequences, and methods of screening for modulators of such PTC taste receptor.

The ability to taste the bitter compound phenylthiocarbamide (PTC) and related chemicals is bimodal, and all human populations tested to date contain some people who can (tasters) and some people who cannot taste (nontasters) PTC, e.g., the frequency of tasters in North Americans of European ancestry is about 67%. Why this trait has been maintained in the population is uncertain but this polymorphism may have evolved as a key defense mechanism against the ingestion of harmful substances. The gene that gives rise to this phenotype is unknown, and its characterization would permit insights into the mechanism of bitter taste perception and screening for modulators of taste that would be useful in the pharmaceutical, food, and beverage industries to customize taste.

Phenylthiocarbamide (PTC) taste receptor

The United States of America as represented by the Secretary of the Department of Health and Human Services

The University of Utah Research Foundation