A resin compound, which causes very little thermal stress even when a flip chip is mounted, has a low modulus of elasticity, and a heat resistance which is sufficiently high for solder floating at 300xc2x0 C., and the resin compound also can be used in an adhesive film, a metal-clad adhesive film, a circuit board, and an assembly structure. The resin compound contains (A) a polyamide imide with siloxane bond, (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.

The present invention relates to a resin compound and to an adhesive film with excellent heat resistance, electrical properties, adhesion to metal and, at the same time, low elastic modulus; and the invention also relates to a circuit board and an assembly structure using these elements. The resin compound and adhesive film of the invention are applicable widely to the surface circuit layer and/or stress compliance layer of a circuit board. Because the circuit board of the invention has a low modulus of elasticity, it is most suitable for flip chip technology.
The latest technical innovations are remarkable in providing electronic devices, such as personal mobile data terminals, that are smaller in size, lighter in weight and higher in performance. As an assembly of these electronic devices, flip chip technology or a chip scale package (CSP) structure that makes it possible to realize high-density and compact packaging has come to be employed instead of conventional resin encapsulated semiconductor packaging using a resin compound made of epoxy resin and an inorganic filler.
As indicated above, a high-density compact package is frequently made of a grid array structure because, when the package is mounted on a circuit board, a number of pins must be arranged in a small area as external terminals for the package. Since there is a technical limitation to high-density packaging on a conventional circuit board for the above reason, a board with a surface laminate wiring circuit that has no through-hole, but comprises via-holes only, has been in use. As a material for forming a fine wiring circuit on a board surface, there are available a photo-via material, on which a wiring circuit is formed by exposure and development processes, and a laser-via material, on which holes are machined by laser beam or the like. Brief technology of the above type has been disclosed, for example, in xe2x80x9cPrinted Circuit Board Applicable to High-Density Packagingxe2x80x94Present Status and Problems of Build-up Circuit Board Technologyxe2x80x9d of xe2x80x9cElectronic Materialxe2x80x9d issued by Industrial Research Association, October 1998 issue.
Generally speaking, a material with high heat resistance, typically such as a polyimide, has a high modulus of elasticity. For this reason, if a packaging device with low coefficient of thermal expansion and high modulus of elasticity, such as a flip chip, is mounted on a polyimide circuit board, a question as to its reliability arises because of possible disconnection due to the thermal stress caused between the board and the device.
On the other hand, because the heat resistance of a rubber-added material with a low modulus of elasticity is generally lower, a question arises concerning the heat resistance against high-temperature bath solder (lead free solder) at about 300xc2x0 C.
The present invention provides a resin compound, which causes very little thermal stress even when a flip chip is mounted, which has a low modulus of elasticity, and which has a high heat resistance sufficient for solder floating at 300xc2x0 C., and the present invention also provides an adhesive film, a circuit board, and an assembly structure using the resin compound.
The means of solving the above problems in accordance with the present invention are as follows.
The first aspect of the invention involves a resin compound containing (A) a polyamide imide with siloxane bond, (B) an acrylic polymer with weight-average molecular weight of 500,000 or more, (C) a thermoset resin, and (D) a solvent.
The second aspect of the invention involves an adhesive film having the above-mentioned resin compound. This adhesive film provides an adhesive material that has both a low modulus of elasticity and high heat resistance, and also provides excellent adhesion to metal and electrical properties.
The use of (A) a polyamide imide with siloxane bond as an essential component in accordance with the invention makes it possible to maintain a low modulus of elasticity without lowering the heat resistance. The polyamide imide with a siloxane bond has superior solubility to solvent, as compared to the polyimides having a similar heat resistance, and it also has excellent miscibility with other polymers. It is a suitable component for realizing the effect of the resin compound of the present invention.
In addition, since the component (A) above has a siloxane bond, it has a higher miscibility with other components of the invention, including acrylic polymer and epoxy resin. As a result, a uniform film with no layer separation can be provided in a broad range of composition (mixture).
Particularly, in combining with a high molecular-weight acrylic polymer, the miscibility is an important issue. The siloxane bond content in the acrylic polymer structure is preferred to be 20 to 80 weight %. If it is less than 20 weight %, the miscibility decreases and a uniform resin compound with acrylic polymer cannot be obtained. If it exceeds 80 weight %, the adhesion to metal decreases, and, when a fine wiring circuit is formed, a lower reliability.
In accordance with the present invention, by using a polyamide imide containing a siloxane bond, it is possible to realize excellent miscibility with a high molecular-weight acrylic polymer, and, at the same time, to drastically lower the modulus of elasticity relative to that of conventional polyamide imide.
In accordance with the invention, (A) a polyamide imide with a siloxane bond represents a condition where, for example, an amide bond or an imide bond is bonded with the siloxane bond.
To be specific, a polymer that at least contains an amide bond, an amide bond as the main chain of an imide precursor, and the following bond unit is preferred:
xe2x80x94NHxe2x80x94COxe2x80x94Xxe2x80x94Zxe2x80x94 or xe2x80x94NHxe2x80x94COxe2x80x94Xxe2x80x94COxe2x80x94NHxe2x80x94Yxe2x80x94Zxe2x80x94
(X and Y in the above formula are an organic group including an aliphatic or aromatic group, and can be equal or different. Z is a siloxane bond.)
Besides, a polymer that contains a siloxane bond as the end group of an amide bond and an amide bond as the main chain of an imide precursor as follows, for example, is also effective:
xe2x80x94NHxe2x80x94COxe2x80x94Xxe2x80x94Z or xe2x80x94NHxe2x80x94COxe2x80x94Xxe2x80x94COxe2x80x94NHxe2x80x94Yxe2x80x94Z
(X and Y in the above formula are an organic group including an aliphatic or aromatic group, and can be equal or different. Z is a siloxane bond.)
In accordance with the present invention, by using (B) a acrylic polymer with a weight-average molecular weight of 500,000 or more, it is possible to realize a low modulus of elasticity without lowering the heat resistance. If an acrylic polymer with a weight-average molecular weight of less than 500,000 is used, sufficient properties, including heat resistance and electrical properties, cannot be attained. The use of a high molecular-weight polymer with weight-average molecular weight of 500,000 or more makes it possible to attain stable properties.
The mix ratio of the above component (A) to component (B) is preferably 3:1 to 1:5 by weight. In mixing the two, from the point of view of lowering the modulus of elasticity, increasing the mix ratio of the component (B), i.e. the acrylic polymer, is preferable so as to increase the resolution in film forming and the adhesion to metal. However, increasing the component (B), i.e. the acrylic polymer, in excess of the mix ratio 1:5 results in insufficient properties, including heat resistance and electrical properties.
It is also preferable when the glass transition temperature of the acrylic polymer is 0xc2x0 C. or less. Because of this, the modulus of elasticity under a range of 0 to 150xc2x0 C., a normal operating environment, can be maintained low.
Since use of a combination of the above components (A) and (B) in accordance with the present invention is not sufficient enough to maintain the properties at high temperature, it is preferred to utilize a component that forms a cross-linked structure so as to maintain the solder heat resistance at 300xc2x0 C. or above.
A thermoset resin is a component that forms a cross-linked structure. It is available in the form of, for example, an epoxy resin, a maleimide resin, a cyanate resin, an isocyanate resin, a phenol resin, an allyl resin, an unsaturated polyester resin, a butadiene resin, a silicone resin, a vinyl ester resin, and a silicone resin. Among all these, a epoxy resin that comprises an epoxy compound, a hardener containing a phenol group, and an imidazole curing accelerator is the most preferable.
Because a epoxy resin before cross-linking is generally a low molecular-weight compound or low molecular weight polymer, it contributes to improved wettability in bonding a film with various materials and brings about an effect of increasing the adhesion to metal.
In accordance with the present invention, the addition of the thermoset resin component (C) is preferred to be 5 to 50 weight % of the entire film. If it is less than 5 weight %, the effect of utilizing a cross-linked structure formed by the thermoset resin component cannot be produced sufficiently, and, consequently, sufficient heat resistance at high temperature cannot be attained. If it exceeds 50 weight %, the modulus of elasticity tends to increase, and, consequently, the resolution in film forming is negatively affected.
The epoxy resin of the invention can be a compound used in a semiconductor sealing material or printed circuit board material. It is available in the form of, for example, a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol type epoxy resin, including bisphenol A, bisphenol F and bisphenol S type epoxy resins, a multi-functional epoxy resin of phenol resin or cresol resin, and a bi-functional or tri-functional epoxy resin having a naphthalene skeleton, antracene skeleton or dicyclo-pentadiene skeleton.
A publicly known compound is applicable as the hardener for the above-mentioned epoxy resins. Among all these, a compound having two or more phenolic hydroxyl groups is preferable. It is available in the form of, for example, a phenol novolac resin, a condensation polymer of phenol and aralkyl ether, a bisphenol resin, an o-cresol novolac resin, and a poly p-vinyl phenol.
As needed, a publicly known compound is applicable as the curing accelerator. It is available in the form of, for example, an imidazole compound, a tertiary phosphate compound, a quaternary phosphate compound, a complex of a tertiary phosphate compound and a borate compound, a complex of a quaternary phosphate compound and a borate compound, a tertiary amine, a borate complex salt, Lewis acid, an inorganic acid, a short-chain amide, a dihydrazide, a titanic ester, and a cationic or anionic catalyst. Among all these, an imidazole compound is preferable because it excellently adds to the heat resistance, adhesion, and shelf life of the material.
If the physical properties of the adhesive film of the present invention after heating and curing allow the modulus of elasticity at 50xc2x0 C. to be less than 1 GPa, the thermal stress caused by temperature variation can be reduced drastically at the time when a flip chip is mounted on the film, and the reliability under a thermal cycle and other conditions can be improved tremendously.
In accordance with the present invention, the solvent component (D) has no particular limit provided that the thermoset polymer as the above components (A) and (B) and the epoxy resin, hardener, and curing accelerator as the component (C) can be evenly mixed in it. A preferable solvent is, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, y-butyrolactone, N,N-dimethyl formamide, N-methyl-2-pyrrolidone, toluene, dimethyl acetamide, cyclohexanone, or isopropyl alcohol, and a mixed solvent of two or more of the above is allowable.
An additive, such as an inorganic filler, colorant. or flame retardant can be added so long as the properties of the resin compound and the adhesive film of the invention are not affected.
The third aspect of the invention involves a metal-clad adhesive film that utilizes the resin compound of the first aspect of the invention as an insulation layer. By use of the metal-clad adhesive film as wiring material for the below-mentioned build-up structure, the process can be simplified.
The resin compound of the present invention is bonded onto a metal foil by a process in which a specified amount of the resin compound containing solvent is applied on a metal foil and then the metal foil and the resin film are bonded together as the solvent is removed by heating, depressurizing, or other processing. The metal foil has no specific limit provided that it serves as a conductor forming a circuit, but copper is preferable. A metal-clad adhesive film is available in a structure where a metal foil is formed on one side of the film or on both sides of the film.
The fourth aspect of the present invention involves a circuit board having a built-up structure where the adhesive film of the second aspect of the invention is arranged on the circuit board and the circuit layer of the circuit board is electrically connected to external terminals. The adhesive film to be arranged on the circuit board can be either a simple adhesive film or the above-mentioned metal-clad adhesive film.
If a simple adhesive film is arranged on a circuit board, the circuit board having a built-up structure can be obtained by a process in which, after holes for via-hole connection are drilled at specified positions using a laser machine or the like, the board is subjected to roughing and conductor plating so as to form a wiring circuit and attain the continuity to the lower circuit board by means of connection through the via-holes. By repeating this process as needed, a built-up circuit board having a multi-layer structure can be provided.
If a metal-clad adhesive film is arranged on a circuit board, holes are made at necessary positions of the metal foil beforehand by etching or other means and then holes for via-hole connection are drilled in the film by a laser machine or the like, utilizing the metal foil as a mask. Then, the holes for via-hole connection are made conductive by plating, and lastly a wiring circuit is etched on the metal foil. Thus, a circuit board having a built-up structure is formed. By repeating this process as needed, a built-up circuit board having a multi-layer structure can be provided.
The fifth aspect of the present invention involves an assembly structure in which a flip chip is mounted on the circuit board having a built-up structure according the fourth aspect of the invention. The surface of a circuit board with the built-up structure to mount a flip chip is made of an insulation layer with a low modulus of elasticity. The use of the assembly structure can drastically reduce the thermal stress to be caused by the difference in the coefficient of thermal expansion between the flip chip and the circuit board. Thus, it becomes possible to secure connection reliability under a thermal cycle and other conditions without using an underfill resin that was needed in the prior art.
The present invention can reduce cost, including the material and process cost, tremendously. Because no underfill resin is needed, the invention makes it possible to perform repairs more easily than before and can contribute greatly to improvement of the yield. dr
FIG. 1 is a diagram showing a cross-sectional view of an adhesive film.
FIG. 2 is a diagram showing a cross-sectional view of an adhesive film on one side of which a metal foil is arranged.
FIG. 3 is a diagram showing a cross-sectional view of a circuit board of a build-up structure on which an adhesive film is arranged.
FIG. 4 is a diagram showing a cross-sectional view of a circuit board having a built-up structure on which layers of adhesive films are arranged in a multi-layer structure.
FIG. 5 is a diagram showing a cross-sectional view of a circuit board having a built-up structure on both sides of which an adhesive film is arranged.
FIG. 6 is a diagram showing a cross-sectional view of an assembly structure in which a flip chip is mounted on a circuit board having a built-up structure.
FIG. 7 is a diagram showing a cross-sectional view of an adhesive film on both sides of which a metal foil is arranged.

Resin compound, and adhesive film, metal-clad adhesive film, circuit board, and assembly structure, using the resin compound


The present invention relates to a method (30) for actuating an electric machine (14) in the motor starting mode by means of a power electronic system (10), in particular for application in a motor vehicle, wherein the power electronic system (10) has a multiplicity of controllable power switches which are designed to supply the electric machine (14) with electric current (l_s), wherein a total amount of energy (50) which is required to reach a predefined rotational speed (n_crit) and a time period (t—0) for reaching the predefined rotational speed (n_crit) is estimated (38), wherein a setpoint torque (M) for starting the electric machine (14) is determined (42) on the basis of the estimated total amount of energy (50) and the estimated time (t—0), and wherein the power electronic system (10) is actuated (46) in accordance with the setpoint torque (M).

It is generally known to actuate electric three-phase current machines by means of a power inverter which is supplied with electrical energy by a direct current source and which converts the direct voltage into an alternating voltage by means of a multiplicity of power switches, and as a result supplies the electric machine with electrical energy or with electric current. The power switches are actuated or switched here in accordance with the electrical frequency of the machine, and therefore in accordance with the rotational speed. In the starting mode of the electric machine, large currents usually flow through the actuated phase sections, and due to the low electrical frequency at low rotational speeds the corresponding power switches are loaded by the corresponding phase current over a relatively long time period. This high loading can damage the power switches of the power inverter, with the result that measures have to be taken to limit the loading of the power switches.
In conventional methods, when the load limit of the power switches is reached, the power is decreased in order to limit the loading of the power switches and avoid damage to the power switches. This abrupt reduction in the torque which is made available is uncomfortable and can give rise to situations which are critical for safety when the method is applied in a motor vehicle, since the desired or requested power is unexpectedly not made available. As a result of the abrupt reduction in the torque which is made available, the drive train is abruptly relieved of tension, as a result of which oscillations which additionally have a very adverse effect on the driving comfort can occur in the drive train.

Method and device for actuating an electric machine in the motor starting mode


A communication network, such as an audiovisual system, on an automobile has a master unit and a plurality of slave units which are connected to a common communication bus. Each of the master and slave units is capable of successively issuing a plurality of command data through asynchronous transmission to another unit and returning acknowledgement data in response to the command data transmitted from another unit. The units add received command data to acknowledgement data when the acknowledgement data is to be returned. The command data includes first command data requiring acknowledgement data and second command data requiring no acknowledgement data. Each unit handles the first and second command data differently when the acknowledgement data is to be returned. When communication data is to be transmitted between the units, major classification data and subclassification data, depending on the contents of the communication data, are added to a leading portion of the communication data.

1. Field of the Invention
The present invention relates to a method of and a system for data communication in a communication network on an automobile, and more particularly to a method of and a system for data communication in a network of components of an audiovisual system on an automobile.
2. Description of the Prior Art
In recent years, automobile audio systems have been changing from systems which give a user only audio information such as music to systems which allow the user to enjoy both audio and visual information. Systems with both audio and visual capabilities are known as audiovisual systems.
Automobile audiovisual systems on automobiles are composed of many different audio and visual components. The audio components include a cassette tape deck, a radio tuner, a CD (compact disk) player, etc., while the visual component include a TV (television) tuner, a navigation system, etc.. Audio signals produced by some of these components are amplified by an amplifier and reproduced from loudspeakers in the automobile. Video signals produced by other components are displayed on a display unit in the automobile. Today, the audiovisual system components are controlled according to digital technology, i.e., by respective controllers in the form of microcomputers.
The components of an audiovisual system are required to be controlled systematically for systematic operation of the components. To meet this requirement, the controllers of the respective components are connected by a communication bus network, so that control data for the components will be transmitted through the communication bus.
In the conventional audiovisual system network, the controllers of the components are controlled by a polling process. According to the polling process, either one of the controllers is given a priority status and handled as a master unit, with the other controllers as slave units, and when the master unit is to collect data from a slave unit, the master unit always accesses the slave unit, i.e., initiates the transfer of the data from the slave unit.
When the master unit transmits communication data to a slave unit for access or the slave unit transmits data back to the master unit, it is necessary that the controllers be identified or specified. For this purpose, the controllers are allotted respective address indicating themselves.
Heretofore, the controllers are allotted respective unique addresses. Control data which are to be given to controllers comprise address data peculiar to the respective controllers and instruction data (e.g., start command: ON data) added to the address data. The control data which is generated is sent to the communication bus.
It is known that upon the transmission of communication data between the master and slave units, acknowledgement data (ACK) is sent back from a receiving unit to a transmitting unit in order to acknowledge that the data transmitted by the transmitting unit is properly received by the receiving unit. Depending on the degree of importance of the transmitted data, the transmitting unit may or may not confirm the acknowledgement data returned from the receiving unit. In audiovisual systems, there are a plurality of slave units, and communication data may contain a plurality of successive commands (e.g., start command, switching command, etc.) to be given to the slave units. According to synchronous transmission, the transmitting unit can relate a command to an acknowledgement code therefor by determining whether they are in timed relationship or not. According to asynchronous transmission, however, when a plurality of commands requiring respective acknowledgement codes are successively issued, the transmitting unit cannot ascertain which acknowledgement codes, returned from the receiving unit, correspond to which commands. Therefore, the transmitting unit is unable to determine whether the received acknowledgement codes should be confirmed or not.
One problem with the conventional communication process is that there are many complex communication data transmitted to and received from the communication bus. More specifically, commands contained in communication data which are transmitted from a master unit of an audiovisual system to slave units or components are fixed with respect to the slave units, and there are many such commands. When a new slave unit or component is to be added to the audiovisual system to expand the latter, commands also have to be added for use with the new component.
The communication data contains display data as well as commands to be issued from the master unit. Accordingly, the communication data, composed of these various commands and data, is complex and lengthy, and needs a complicated processing sequence in the transmitting unit.
Furthermore, when a new slave unit or component is connected to the communication bus, communication data to be sent to and received from the new slave unit may not be processed if its format is unknown.

Method of and system for data communication in communication network on automobile


In one example embodiment, the present invention is an open-end wrench head that has an orifice and two jaws. Each jaw has an inner part, an outer part, and a terminal tip end. Each inner part is formed for contact and engagement with a work-piece such as a nut or bolt. Each outer part is viewable from a side view of the wrench head and has a predetermined length. The outer part of at least one jaw has at least one groove formed therein creating at least two adjacent ridges running at least partially along the length thereof.

The jaw or jaws of an open-end wrench head are susceptible to spreading apart and bending outwardly upon the application of high torque to a work-piece such as a nut or bolt, and/or engagement failure whereby the jaws slip upon and around a work-piece. Often, the wrench head may even become damaged wherein the jaws are permanently spread apart compromising further use of the wrench. Accordingly, there is a need to strengthen the jaws of an open-end wrench to reduce the susceptibility to engagement failure and/or damage to the wrench head wherein the jaws become permanently spread apart.


A method and apparatus for recovering a data symbol from a communication signal in which the communication signal is processed to produce a baseband waveform that is then sampled to obtain a channel sequence. The channel sequence is decoded to obtain an estimate of the data symbol together with a measure of the reliability of the data symbol. The processing of the communication signal is adjusted dependent upon the measure of the reliability of the data symbol. This abstract is not to be considered limiting, since other embodiments may deviate from the features described in this abstract.

In a communication system, the data to be transmitted is typically broken into symbols and each symbol is combined with additional information (such as parity bits) to form a code word. The process of transforming original data sequences into structured sequences better suited to transmission is called channel coding. The information in the code word is used for error checking and, sometimes, for error correction. The resulting sequence of code words is transmitted over an analog communication channel to a receiver, where an attempt is made to recover the original data symbols from the code words in a decoder. In the simplest decoders, the additional information is used to decide of the decode data is correct or not, and may be used to request that the data be resent if incorrect. More sophisticated communication systems use Forward Error Correction (FEC), where the additional information in the code word is used in an attempt to correct errors in the decoded data symbols.
A simple method for reducing bit errors in a communication system to increase the analog signal level. However, while higher signal levels are more robust to noise interference, the use of higher gain increases the power consumption of the system. Consequently, communication systems often incorporate an automatic gain control (AGC) circuit. The purpose of the AGC circuit is control the level of the analog signals in the transmitter or receiver of the communication system. A typical AGC circuit monitors a property of the analog signal after gain has been applied in amplifier and adjusts the gain based upon a predetermined criterion. For example, the power of the signal or the envelope of the signal may be monitored. One problem with this approach is that the AGC system itself also consumes power. A further disadvantage is the need for circuitry to measure the power or envelope of the amplified signal.

Communication system control using reliability data


The invention relates to molecules or molecular complexes, which comprise binding pockets of PLK3 or its structural homologues. The invention relates to crystallizable compositions and crystals comprising PLK3. The present invention also relates to a data storage medium encoded with the structural coordinates of molecules and molecular complexes which comprise the PLK3 or PLK3-like ATP-binding pockets. The present invention also relates to a computer comprising such data storage material. The computer may generate a three-dimensional structure or graphical three-dimensional representation of such molecules or molecular complexes. This invention also relates to methods of using the structure coordinates to solve the structure of homologous proteins or protein complexes. In addition, this invention relates to methods of using the structure coordinates to screen for, identify and design compounds, including inhibitory compounds that bind to PLK3 or homologues thereof.

The search for new therapeutic agents has been greatly aided in recent years by a better understanding of the structure of enzymes and other biomolecules associated with diseases. One important class of enzymes that has been the subject of extensive study is protein kinases.
Protein kinases constitute a large family of structurally related enzymes that are responsible for the control of a variety of signal transduction processes within the cell. (See, Hardie, G. and Hanks, S. The Protein Kinase Facts Book, I and II, Academic Press, San Diego, Calif.: 1995). Protein kinases are thought to have evolved from a common ancestral gene due to the conservation of their structure and catalytic function. Almost all kinases contain a similar 250-300 amino acid catalytic domain. The kinases may be categorized into families by the substrates they phosphorylate (e.g., protein-tyrosine, protein-serine/threonine, lipids, etc.). Sequence motifs have been identified that generally correspond to each of these kinase families (See, for example, Hanks, S. K., Hunter, T., FASEB J., 9:576-596 (1995); Knighton et al., Science, 253:407-414 (1991); Hiles et al., Cell, 70:419-429 (1992); Kunz et al., Cell, 73:585-596 (1993); Garcia-Bustos et al., EMBO J., 13:2352-2361 (1994)).
In general, protein kinases mediate intracellular signaling by effecting a phosphoryl transfer from a nucleoside triphosphate to a protein acceptor that is involved in a signaling pathway. These phosphorylation events act as molecular on/off switches that can modulate or regulate the target protein biological function. These phosphorylation events are ultimately triggered in response to a variety of extracellular and other stimuli. Examples of such stimuli include environmental and chemical stress signals (e.g., osmotic shock, heat shock, ultraviolet radiation, bacterial endotoxin, and H2O2), cytokines (e.g., interleukin-1 (IL-1) and tumor necrosis factor α (TNF-α)), and growth factors (e.g., granulocyte macrophage-colony-stimulating factor (GM-CSF), and fibroblast growth factor (FGF)). An extracellular stimulus may affect one or more cellular responses related to cell growth, migration, differentiation, secretion of hormones, activation of transcription factors, muscle contraction, glucose metabolism, control of protein synthesis, and regulation of the cell cycle.
Many diseases are associated with abnormal cellular responses triggered by protein kinase-mediated events as described above. These diseases include, but are not limited to, autoimmune diseases, inflammatory diseases, bone diseases, metabolic diseases, neurological and neurodegenerative diseases, cancer, cardiovascular diseases, allergies and asthma, Alzheimer's disease, and hormone-related diseases. Accordingly, there has been a substantial effort in medicinal chemistry to find protein kinase inhibitors that are effective as therapeutic agents.
Among medically important serine/threonine kinases is the family of polo-like kinases that have an important role in several stages of mitosis. This family includes the mammalian PLK1, PLK2 (serum-inducible kinase, Snk), PLK3 (fibroblast growth factor-inducible kinase, Fnk/proliferation-related kinase, Prk) and PLK4 (Sak). Polo-like kinase 1 (PLK1) has been suggested to promote mitotic entry by activating cyclin B/cdk1 by phosphorylating cyclin B itself, by phosphorylating the Cdk1-activating phosphatase Cdc25c and by phosphorylating the Cdk1-inhibiting kinases Myt1/Wee1 (Abrieu, A., et al. Cell Sci 111, 1751-1757 (1998); Jackman, M. et al Nat Cell Biol. 5, 143-148 (2003); Nakajima, H. et al. J. Biol. Chem. 278, 25277-25280 (2003); Qian, Y. W. et al. Mol. Cell. Biol. 18, 4262-4271 (1998); Toyoshima-Morimoto, F. et al. Nature 410, 215-220 (2001); Watanabe, N. et al. Proc. Nat. Acad. Sci. USA 101, 4419-4424 (2004)). Furthermore, PLK1 has been implicated in centrosome maturation and separation, with defects giving rise to monopolar spindles (Lane, H. A., et al. J. Cell Biol. 135, 1701-1713 (1996); Sunkel, C. E., et al. J. Cell Sci. 89, 25-38 (1988)). Studies on human cells and in vitro have indicated a role for PLK1 in activating the anaphase-promoting complex/cyclosome (APC/C) (Golan, A. et al J. Biol. Chem. 277, 15552-15557 (2002); Kotani, S. et al. Mol. Cell 1, 371-380 (1998). PLK1 is located mostly in the cytoplasm during interphase and translocates to the nucleus in early mitosis. PLK1 also has been shown to associate with centrosomes from G2 up to metaphase, to translocate to kinetochores at metaphase, and to locate at the midbody from anaphase to telophase (Golsteyn, R. M. et al. J. Cell Biol. 129, 1617-1628 (1995); Lee et al. Mol. Cell Biol. 15, 7143-7151 (1995)).
In contrast to PLK1, PLK2 and PLK3 appear to perform different functions, and PLK3 plays some functions that might directly antagonize PLK1 function (Smits et al. Nat. Cell Biol. 2 672-676 (2000); Xie et al. J. Biol. Chem. 276, 43305-43312 (2001). Small interfering RNA (siRNA)-mediated inhibition of PLK3 expression suggests that PLK3 is essential for superoxide-induced cell death, and deletion analysis of PLK3 showed that the N-terminal domain (amino-acids 1-26) is essential for induction of delayed onset of apoptosis (Li Z. et al. J. Biol. Chem. 280, 16843-16850 (2005)). Over-expression of PLK1 has been observed to cause oncogenic transformation in NIH 3T3 cells (Smith et al. Biochem. Biophys. Res. Commun. 234, 397-405 (1997), while overexpression of PLK3 induces apoptosis (Conn et al. Cancer Res. 60, 6826-6831 (2000).
Polo-like kinases are characterized by an N-terminal catalytic Ser/Thr kinase domain and a C-terminal non-catalytic region containing two tandem Polo-boxes (Sonnhammer et al. Nucleic Acids Res. 26, 320-322 (1998). The Polo-box domain is required for correct subcellular localization (Lee et al., Proc. Natl. Acad. Sci. USA 95, 9301-9306 (1998); Ma et al., Mol. Cancer. Res. 1, 376-384 (2003); May et al., J. Cell Biol. 156, 23-28 (2002); Reynolds & Ohkura J. Cell Sci., 116, 1377-1387 (2003)), and the crystal structure of the polo-box domain in PLK1 has been determined (Elia et al. Cell 115, 83-95 (2003); Cheng et al., EMBO J. 22, 5757-5768 (2003)). The Polo-box domain recognizes a conserved phosphothreonine/serine motif in the substrate which binds along a positively-charged cleft located at the edge of the Polo-box interface. Mutations of key residues to disrupt the phosphodependent interactions abolishes cell-cycle dependent localization but does not affect its kinase activity (Lee et al., Proc. Natl. Acad. Sci. USA 95, 9301-9306 (1998), and suggests that substrate binding to the Polo-box domain is required for proper mitotic progression (Elia et al. Cell 115, 83-95 (2003)).
Because of their link to cellular proliferation, PLK family proteins have been associated with cancer development and progression. In fact, the over-expression of murine PLK1 in NIH3T3 cells has been observed to be transforming (Smith, M. R. et al. Biochem. Biophys. Res. Commun. 234, 397-405 (1997)). In addition, PLK1 has been seen to be over-expressed in a wide variety of primary tumor cell lines, including breast cancer (Wolf G. et al. Pathol. Res. Pract. 196, 753-759 (2000)), colorectal cancer (Takahashi T. et al. Cancer Sci. 94, 148-152 (2003)), non-small-cell lung cells (Wolf G. et al. Oncogene 14, 543-549 (1997)), head and neck squamous cell carcinomas (Knecht R. et al. Cancer Res. 59, 479-480 (1999)), ovarian carcinomas (Takai N. et al. Cancer Lett. 164, 41-49 (2001)), prostate (Weichert W. et al Prostate 60, 240-245 (2004)) and pancreatic cancer (Gray P. J. et al. Mol. Cancer. Ther. 3, 641-646 (2004)) and is positively correlated with aggressiveness and prognosis (Takai N., et al Oncogene 24, 287-291 (2005)).
Whilst the precise function of PLK2 is uncertain, the expression of PLK3 is negatively correlated with the development of certain cancers. PLK3 mRNA is either undetectable or markedly downregulated in lung carcinomas (Li B. et al. J. Biol. Chem. 271, 19402-19408 (1996)) head and neck squamous cell carcinomas (Dai W. et al. Genes Chromosomes Cancer 27, 332-336 (2000)) and in colon tumors (Dai W. et al. Int. J. Oncol. 20, 121-126 (2002)). In support of these observations, the expression of PLK3 in vitro reduces the rate of fibroblast cell proliferation (Dai W. et al. Genes Chromosomes Cancer 27, 332-336 (2000)) and the enforced expression of constructs expressing kinase-active PLK3 induces rapid cell cycle arrest and apoptosis (Conn C. W. et al. Cancer Res. 60, 6826-6831 (2000); Wang Q. et al. Mol. Cell. Biol. 22, 3450-3459 (2002)). PLK3 has been shown to be a stress response protein involved in DNA damage checkpoint (Bahassi E. M. et al. Oncogene 21, 6633-6640 (2002); Xie S. et al. J. Biol. Chem. 276, 43305-43312 (2001)). In this role, PLK3 only becomes phosphorylated following DNA damage or mitotic spindle disruption, whereupon its kinase activity is enhanced, otherwise, PLK3 is not phosphorylated during normal cell cycle progression. Consistent with this, possible substrates of PLK3 are thought to include both the tumor suppressors Chk2 and p53, which have both been shown to bind to PLK3 in vivo, and be phosphorylated by PLK3 in vitro.
The role of PLK3 in DNA damage checkpoint leads to the interest in designing PLK3 inhibitors that are effective as therapeutic agents. A challenge has been to find protein kinase inhibitors that act in a selective manner, targeting only PLK3. Since there are numerous protein kinases that are involved in a variety of cellular responses, non-selective inhibitors may lead to unwanted side effects. In this regard, the three-dimensional structure of the kinase would assist in the rational design of inhibitors. The determination of the amino acid residues in PLK3 binding pockets and the determination of the shape of those binding pockets would allow one to design selective inhibitors that bind favorably to this class of enzymes. The determination of the amino acid residues in PLK3 binding pockets and the determination of the shape of those binding pockets would also allow one to design inhibitors that can bind to PLK3.
For example, a general approach to designing inhibitors that are selective for an enzyme target is to determine how a putative inhibitor interacts with the three dimensional structure of the enzyme. For this reason it is useful to obtain the enzyme protein in crystal form and perform X-ray diffraction techniques to determine its three dimensional structure coordinates. If the enzyme is crystallized as a complex with a ligand, one can interactively elucidate the binding pocket, and determine both the shape of the enzyme binding pocket when bound to the ligand, as well as the amino acid residues that are capable of close contact with the ligand. By knowing the shape and amino acid residues in the binding pocket, one may design new ligands that will interact favorably with the enzyme. With such structural information, available computational methods may be used to predict how strong the ligand binding interaction will be. Such methods thus enable the design of inhibitors that bind strongly, as well as selectively to the target enzyme.
Despite the fact that the genes for PLK3 has been isolated and the amino acid sequence of PLK3 is known, no one has described X-ray crystal structural coordinate information of PLK3 protein. As discussed above, such information would be extremely useful in identifying and designing potential inhibitors of the PLK3 kinase or homologues thereof, which, in turn, could have therapeutic utility.
The structures of several serine/threonine kinases have been solved by X-ray diffraction and analyzed. Specifically, the crystal structures of P38 kinase (Wilson et al., J. Biol. Chem., 271, pp. 27696-27700 (1996)) and MAPKAP Kinase 2 (U.S. Provisional application 60/337,513) have been studied in detail.
To date, no crystal structures of PLK3 kinase have been reported. Thus the crystal structure of unphosphorylated PLK3 kinase domain complexes with inhibitors are of great importance for defining the active conformation of PLK3 kinase. This information is essential for the rational design of selective and potent inhibitors of PLK3.

Crystal structure of polo-like kinase 3 (PLK3) and binding pockets thereof


Systems, methods, and user interfaces for search query formulation are provided. A graphical representation (610) of a media basis may be provided that includes at least one metadata region (611) representing metadata associated with the media basis. Then, at least one user selection (620) of at least a portion of the graphical representation (610) may be received. Based on the received selection(s) (620), at least one search term may be generated.

In systems that present media selections to a user such as audio, video, games, books, movies, and the like, the selection of a particular media item for presentation to the user is often awkward. User interfaces for searching media assets are currently limited to the entry of text by the user or worse; the selection of individual letters that form part of the title of a media asset. Such interfaces are irritating to the user because of their slow and restricted style of query generation. An easier method of generating a search query is sought that makes it easier to construct a query tailored to a user's interest.

Method and apparatus for search query formulation

INTERDIGITAL MADISON PATENT HOLDINGS, SAS


This application discloses a system implementing tools and mechanisms to selectively load design data for logical equivalency check. The tools and mechanisms can identify a hierarchy of modules in a circuit design, perform a depth-first search of the hierarchy of modules starting with a root module to identify a subset of modules to parse, and selectively parse the subset of the modules in the circuit design. The tools and mechanisms can utilize the parsed subset of the modules to determine logical equivalence of the circuit design with at least another circuit design.

Designing and fabricating electronic devices typically involves many steps, known as a "design flow." The particular steps of a design flow often are dependent upon the type of circuitry, its complexity, the design team, and the device fabricator or foundry that will manufacture the electronic device. Several steps are common to most design flows for electronic devices. Initially, a specification for a new circuit is transformed into a logical design, sometimes referred to as a register transfer level (RTL) description of the circuit. With this logical design, the circuit can be described in terms of both the exchange of signals between hardware registers and the logical operations that can be performed on those signals. The logical design typically employs a Hardware Design Language (HDL), such as Verilog, Very high speed integrated circuit Hardware Design Language (VHDL), or the like.
At various stages of the design flow, the design is transformed into a different representation, for example, the transformation of the design from an RTL representation to a gate-level netlist representation during synthesis, the transformation of the gate-level netlist to a physical design layout, or the like. These transformations are intended to convert the design into an equivalent representation, albeit at a different level of abstraction than the previous representation of the design, which retains the functionality of the design. To help ensure that a transformation did not alter the functionality of the design, an equivalence of the different design representations can be determined, for example, using a logical equivalence tool that often include one or more formal techniques, such as a Binary Decision Diagram (BDD), a Boolean Satisfiability (SAT) Solver, an Automatic Test Pattern Generator (ATPG), Cut Point Prover, or the like.
While the use of the logical equivalence tool can be an effective way to determine logical equivalence between multiple designs at different levels of abstraction, it often takes a non-insignificant amount of time to load the multiple designs into the logical equivalence tool. Typically, the logical equivalence tool will parse the entirety of each design, identify which portions of each design correlate to each other, and link those correlated portions together in a data structure. After the data structure has been built, the logical equivalence tool can attempt to determine logical equivalence between the correlated portions based on the data structure.
Oftentimes, designers wish to utilize the logical equivalence tools to check only a subset of the designs for logical equivalence, but these logical equivalence tools still have to perform the time-consuming operation of loading the entirety of each design before checking the subset of the designs. Some synthesis tools have attempted to truncate this initial loading burden by generating one or more additional design files that include portions of the designs that the logical equivalence tools wish to check for logical equivalence. The logical equivalence tools can then load the entirety of these newly generated design files and check them for equivalence. The assumption, however, that an equivalence between the newly generated design files necessarily renders equivalent the portions of the designs included in the newly generated design files can be fallacious, as the generation of the design files is often susceptible to errors. In other words, when a conventional logical equivalence tool wishes to check only a subset of multiple designs, there is a tradeoff between load time and accuracy.

Selectively loading design data for logical equivalency check


In a semiconductor device including a semiconductor body, a continuous oxide layer, a continuous metallization layer, and a diffusion zone, the diffusion zone is located below a portion of the continuous oxide layer to reduce this portion in thickness, and the corresponding part of the metallization layer in the region of the oxide layer portion of reduced thickness forms an undulation which protects the metallization layer against thermal stresses.

The invention is based on a semiconductor device including a semiconductor body having on its upper surface at least one diffusion zone forming an electrode such as base-or emitter electrode of the device, a continuous oxide layer covering a part of the upper surface adjacent to the electrode diffusion zone, and a continuous metallized layer contacting the electrode diffusion zone and extending on the oxide layer to act as a conductor path.
Semiconductor devices, like ignition transistors, but also collecting circuits in integrated circuits which are subjected to high thermical shock stresses during testing and partially also during the practical operation show a disintegration of the metallization, after a period of time. Integrated collecting circuits for motor vehicles are mainly provided with collecting circuits so as to protect them against excess voltages of the power supply. These circuits require relative large faces and are designed up to the limits of their possible physical stressability. In frequent thermical shock stresses a destruction of the metallization occurs very often, whereby the metallization mainly consists of aluminum. Fine cracks can be noticed at certain distances in the metallization which interrupt the metallization at certain segments.

Method of making metallization for semiconductor device


A lubricating oil composition comprising a normally liquid alpha-olefin oligomer consisting essentially of repeating units having the structural formula: ##STR1## wherein x represents an integer from 3 to 11, inclusive; and. y represents the number of repeating units in the oligomer such that the weight average molecular weight is from about 5,000 to about 20,000;. said oligomer having from about 70 to 100 percent head-to-tail alignment of the repeating units of the oligomer. Preferably the weight average molecular weight of the oligomer is from 5,000 to about 10,000; and said oligomer is further characterized as having a dispersity of less than about 5.5, and a Z average molecular weight of less than about 24,000.

Petroleum oils have been conventionally used as lubricating oils in internal combustion engines. In the past, a thinner, lighter weight oil had to be used in colder climates in order to provide sufficient fluidity for initial lubrication at low temperatures. However, as the engine continued to operate and heat up the oil, the oil became thinner and at higher operating temperatures had insufficient viscosity for optimum lubrication. In warm weather operation a heavier weight oil was required, because the thinner, lighter weight oil provided insufficient lubrication at such higher temperatures. The viscosity-temperature relationship of an oil is expressed as its "viscosity index".
In order to improve the viscosity index of lubricating oils, it has been proposed to incorporate various polymeric materials into the base stock in order to improve the inherent viscosity-temperature characteristics of the lubricating oil. One common class of commercial polymeric viscosity index improvers are the methacrylate polymers, such as polymethacrylate esters. High molecular weight viscosity modifiers formed from alpha-olefin polymers have been proposed, such as those having a weight average molecular weight in excess of 50,000, as described in U.S. Pat. No. 3,795,616 to Heilman et al.
Lower molecular weight alpha-olefin oligomers and copolymers have been proposed for use as base fluids, such as those produced, and thereafter hydrogenated, using boron trifluoride and a co-catalyst, such as n-butanol described in U.S. Pat. No. 4,032,591 to Cupples et al. However, such hydrogenated oligomers have had little or no effect when attempts have been made to utilize small amounts of such materials as viscosity index improvers for lubricating oils.
The aforementioned U.S. Pat. No. 3,795,616 to Heilman et al describes polymers of alpha-olefins having from 5 to 12 carbon atoms which are useful as viscosity enhancers for lubricating oils. The alpha-olefin polymers of Heilman et al are high molecular weight materials having a weight average molecular weight between 50,000 and 1,000,000 and a ratio of weight average to number average molecular weight of from 1 to 12. Heilman et al also teach that any Ziegler-Natta type catalyst can be employed to prepare these polymers.
U.S. Pat. No. 3,346,498 to DeVries describes high molecular weight copolymers of alpha-olefins and diolefins having 11 to 15 carbon atoms which lower the pour point of waxy mineral lubricating oils. These polymers are taught as having a molecular weight of 50,000 to 1,000,000 and are prepared using a catalyst containing a titanium halide and an organo aluminum compound.
Canadian Patent No. 734,980 to Sauer et al discloses lower molecular weight polymers of alpha-olefins having 6 to 16 carbon atoms which are useful as synthetic lubricating oils having a high viscosity index. The polymers of Sauer et al are described as having an average molecular weight ranging from about 300 to 2,000. These polymers are prepared using a catalyst of titanium tetrachloride and an organo aluminum compound, wherein the molar ratio of titanium to aluminum is from 2:1 to 20:1. Sauer et al teach that this molar ratio is important to produce normally liquid polymers. If the molar ratio of titanium to aluminum is below 2:1, Sauer et al teach that undesirable solid polymers are produced.
U.S. Pat. No. 3,403,197 to Seelbach et al discloses low molecular weight unsaturated polymers of alpha-olefins having from 3 to 40 carbon atoms. The polymers of Seelbach et al are described as having a cryoscopic molecular weight of from 150 to 1,500 and are prepared using a catalyst consisting of violet titanium trichloride and a monoalkyl aluminum dihalide.

Normally liquid alpha-olefin oligomers useful as base stocks and viscosity index improvers, and lubricating oils containing same


Disclosed are compositions suitable for use in embolizing blood vessels which compositions comprise a polymer, a biocompatible solvent and a contrast agent. The polymer is selected from the group consisting of polyacrylonitrile, polyurethane, polyvinylacetate, cellulose acetate butyrate, nitrocellulose and copolymers of urethane/carbonate and copolymers of styrene/maleic acid.

1. Field of the Invention
This invention is directed to novel compositions suitable for use in embolizing blood vessels. In particular, this invention is directed to embolizing compositions comprising a biocompatible polymer, a biocompatible solvent and a contrasting agent. The compositions of this invention find particular utility in embolizing blood vessels in, for example, the treatment of aneurysms and in ablating diseased tissues.

This patent is subject to a terminal disclaimer.

Compositions for use in embolizing blood vessels


A three point pivoting 360.degree. articulable pinchless hinge connects two members which may pivot 360.degree. with respect to each other. The hinge has two opposing couplers, each having a toothed semicircular portion meshed with the opposing coupler toothed semicircular portion. Each coupler is adapted to be connected to one of the members to be pivoted with respect to each other. A pin is in each coupler extending along an axis of the semicircular portion thereof. A link connects each pin to maintain the meshed engagement of the couplers through 360.degree. of coupler pivotal rotation with respect to each other. The link has a sufficient width substantially that of the width of the coupler body as to block and prevent the meshed semicircular portions from pinching an individual's finger or object.

This invention relates to a hinge, and more particularly, to a three point pivoting 360.degree. articulable pinchless hinge.
Hinges are well known for connecting members that are to rotate or pivot with respect to each other. One of the members may or may not be stationary. Examples of members that pivot with respect to each other are wall panels and room partitions. Examples where one member stays stationary include doors, gates, lids and covers. The most commonly known hinge is commonly referred to as the piano hinge. The piano hinge may generally be described as having flat or plate portions to be secured along the edges of the respective two members that are to be pivoted with respect to each other. The edges of the hinge plates have fingers or tabs that are formed arcuately into a complete loop portion for capturing a pin or rod. The tabs extending from opposing plates are staggered to permit them to interleave and become aligned with opposing tabs. The aligned looped tabs permit the pin or rod to be captured by the tabs and permit the hinge plates to pivot or rotate with respect to each other.
This type of hinge has two significant drawbacks. Firstly, this hinge structure typically does not permit 360.degree. articulation with respect to the two members but most commonly 180.degree.. Secondly, piano hinges align the edges of the members closely together and, as a consequence, renders the piano style hinge prone to pinching fingers or other objects that happen to get placed in the vicinity of the hinge during such pivotal movement. This is largely because both hinge plate portions are close together and both pivot about a single axis.
FIGS. 1 through 3 show the significant limitations of the prior art hinges. For illustrative purposes, the hinges 6 are connected to wall panels or room partition members 5. Their articulation limitation, typically 180.degree., requires that the hinges be alternatively arranged as to permit every other panel to alternately rotate in the other direction. This limitation is required to obtain articulation of the panel assembly. Double headed Arrows A and A' generally show the 180.degree. range of articulation of the panels in opposite direction of each other.
The limitation of this type of hinge structure is shown in FIG. 2. Corners 7 and objects, such as building support columns 8, are difficult to articulate the panels 5 with hinges 6 therearound in any type of aesthetically pleasing manner. FIG. 3 shows how every other hinge 6 is restricted beyond their 180.degree. arc of articulation thereby failing to make a perfectly arcuate or serpentine wall arrangement but rather a cornered wall arrangement B.
There is a need for a three point pivoting 360.degree. articulable pinchless hinge that is pinch proof, smooth in operation, positive in its movement and will give the user a full range of choices in positioning of the respective members to be hinged together.


A system and method for dynamically adjusting the bit rate of a data transmission. A sending endpoint transmits data, such as video conferencing data across a network to a receiving endpoint. The receiving endpoint maintains information about the performance of the network and uses the information to determine when to request an increase or a decrease in the transmission rate. The information is maintained as a set of called parameters. The called parameters provide historical and statistical information about the call. For example, by maintaining information that indicates the number of intervals since the last increase was attempted and the number of intervals that the last increase was maintained, the receiving endpoint can avoid oscillating between a higher bit rate and a lower bit rate. If a bit rate increase was requested, but was not maintained for a sufficient period of time, then the endpoint will delay a subsequent request for an increase until the call parameters indicate that the increase will be successful. The call parameters include both predetermined and dynamic thresholds. The thresholds are compared against measured network performance indicators to determine when to request an adjusted bit rate.

A computer network is used for a number of different purposes, including sending electronic mail, browsing the Internet, sharing files and conducting videoconferences. The various data transmissions carried by the network cause fluctuations in the available network bandwidth. Each data transmission sent over the network consumes some portion of the network's total bandwidth, leaving progressively less bandwidth for other transmissions. With respect to videoconferencing, the fluctuation in available bandwidth can be particularly troublesome. For example, if an individual is engaged in a videoconference with another person, an increase in network traffic can degrade the quality of the video or audio.
In response to an increase in network traffic, the videoconference data transmission rate may be reduced in order to minimize lag, transmission gaps, or connection loss. However, if additional bandwidth becomes available on the network due to a decrease in network traffic, then continued transmission at the reduced bit rate is unnecessary. If the videoconference system could detect the additional available bandwidth, then the videoconference data transmission rate could be increased to take advantage of the available bandwidth.
Some videoconferencing systems reduce the videoconference transmission rate, but do not attempt to increase the transmission rate if additional bandwidth becomes available. Other systems increase and decrease the transmission rate, but do so in a manner that causes the transmission rate to "thrash" or to oscillate between a higher transmission rate and a lower transmission rate.
Therefore, there is a need in the art for detecting changes in the available bandwidth and optimizing the bit rate of a videoconference transmission. There is a further need to keep proper statistical and historical data to allow the optimization to be made without thrashing between higher and lower transmission rates.

Method and system for dynamically adjusting video bit rates


A caliper is arranged for applying predetermined constant pressure to a joint or other anatomy under measurement. The caliper includes an elongate housing, a first jaw connected to the housing, a second jaw slidably connected to the housing, the first and second jaws spaced apart by a predetermined minimum distance, and a constant force spring engaging the first and second jaws. The constant force spring biases the first and second jaws toward one another. A method includes using the caliper to measure anatomical dimensions.

Various types of calipers are known for measuring different objects. A caliper must be properly applied against the object to take the desired measurement, and when measuring the thickness of between two sides of an object, a caliper must be held at right angles to the piece.
In the field of orthopedics, calipers are used for measuring a knee and a leg for a knee brace. As illustrated in FIG. 1, an exemplary method for measuring a knee includes using a marker to apply landmarks on the patient's leg such as at the medial joint space, and along the tibial crest at the tibial tuberosity and a distance below which is depicted in FIGS. 1A and 1B. Referring to FIG. 1C, a conventional caliper 102 comes into use in the method by taking the M-L (medial-lateral) measurement 109 at the joint space against the patient's condyles. The caliper 102 includes jaws 104, 106 snugly adjusted against the patient's skin to obtain the measurement and are left in place as the measurement is recorded along the scale 108.
In using the mid patella as a reference point, as depicted in FIG. 1D, above and below circumference measurements 105, 107 are taken at specified distances, and a caliper may also obtain M-L measurements at these locations as well. Next, with the patient standing in a weight bearing position facing a camera, the height of the camera is adjusted at a mid-patella level, and the camera is positioned so it is approximately a specified distance away from the patient. The image captures the leg a specified distance above and below mid patella and is taken of the anterior side of the knee, and an additional image is taken of the lateral side of the knee, as shown in FIGS. 1E and 1F.
The conventional caliper may obtain the M-L measurement and other devices have jaws that slide relative to one another and are indexed to a scale located along a shaft. The clinician must adjust one of the jaws relative to the other jaw, manually move the jaw to press against the patient's soft tissue, and manually removes the jaws from the soft tissue upon completion of the measurement. The force against the soft tissue may exceed comfort levels or may be inconsistently applied from patient to patient.
The conventional caliper 102 may have narrow jaws 104, 106 which may shift over the soft tissue due to their narrow width and may cause discomfort because of sharp tips of the jaws. The jaws are typically elongated and straight, and provide little or any space between areas of the soft tissue within the jaws for adjustment by a clinician. A patient's condyles may have an irregular shape and the narrow jaws may fail to provide an accurate measurement of M/L due to condyle irregularity. In variations, conventional calipers may use contoured "cup-shaped" contact point which extend over the condyles but limit the clinician for placement over the condyles.
Due to a variety of leg shapes, sizes and soft tissue amount, conventional calipers provide inconsistent compression over patients' soft tissue due in part to human error by clinician. The inconsistent compression results in improper measurements for the eventual knee brace and may lead to inferior customization of the knee brace.


A combination magazine and shipping tray for lead frames cut into discrete length strips. The magazine collects discrete length lead frame strips dispensed from an automated lead frame quality inspection machine. A cover, when placed over the magazine, provides a packaging tray for shipment of the collected lead frame strips to a semiconductor integrated circuit packaging facility. At the packaging facility, the cover is removed and the magazine is a loading magazine for loading discrete length lead frame strips into a machine used for packaging ICs.

1. Field of the Invention
The present invention relates to a combination magazine and shipping tray for lead frames cut into discrete length strips.
2. Description of the Prior Art
Lead frames are used in the packaging of semiconductor integrated circuits (ICs). Referring to FIG. 1, a discrete length strip of lead frames according to the prior art is shown. The discrete length strip 10 includes a plurality of lead frames 12 mechanically connected by a frame 14. Each lead frame 12 includes a plurality of leads 16 and a die pad area 18. With high lead count lead frames, a tape 20 may be applied across the leads 14 to prevent bending or displacement of the leads 16. The die pad area 18 is usually downset from the plane defined by the leads 16 so that when a die is placed on the pad area 18, it is substantially co-planar with the leads 16 of a lead frame 12. A plurality of indexing holes 22 in the frame 14 are used for indexing the discrete length strip 10 through machines used to package ICs. The discrete length strips 10 (hereafter "discrete strips") generally contain from 5 to 20 lead frames 12 per discrete strip 10, depending on the size of the individual lead frames 12.
Discrete strips 10 are mass produced from a long narrow strip of metal, such as copper or "alloy 42", which is selectively stamped. Each stamp forms a pattern of a lead frame 12 with the leads 16 and the die pad area 18. The peripheral regions of the strip of metal form the frame 14 which holds the individual lead frames 12 together. The strip of lead frames 12 is usually rolled onto a reel, and spot plated in a reel to reel selective plating system. For examples of a selective plating system, see U.S. Pat. Nos. 3,746,630 and 3,723,283, which are assigned to the assignee of the present invention. In subsequent steps, the tape 20 may be applied to the leads 16 and the die area 18 may be downset. The long selectively plated strip of lead frames is then cut into the discrete strips 10, as illustrated in FIG. 1.
The machines used to package integrated circuits are designed to operate on a lead frame 12 in the form of a discrete strip 10. In the packaging of semiconductor devices, a discrete strip 10 is loaded into a series of packaging machines to complete the packaging of the ICs. First, the discrete strip 10 is fed into a die attach machine where a die is fixed to each of the die pad areas 18. In a bonding machine, the leads 16 are electrically bonded to the die of each lead frame 12. In an encapsulation machine, the leads 16 and die of each lead frame 12 are then encapsulated in a packaging material, such as plastic or ceramic. The individual packages are then excised from the frame 14 of the discrete strip 10 to complete the IC packaging process.
Prior to shipment of the lead frames to a packaging facility, the discrete strips 10 are inspected for defects. Referring to FIG. 2, a block diagram of a lead frame quality inspection station, such as Model No. Spectra 2000 manufactured by Electrical Plating Engineering Company, is shown. The station 30 includes an automatic quality inspection machine 32, a conveyor 34 including a plurality of rollers 36A and 36B for conveying discrete strips 10, a reject bin 38, an accept bin 40, an unload elevator 42 positioned inside the accept bin 40, an optical sensor 43 and a packaging tray 44.
The rollers 36A and 36B operate independent of one another, but both under the control of the inspection machine 32. In response to a signal from inspection machine 32, the rollers 36A may be horizontally withdrawn from their normal operating position. As a result, a discrete strip 10 on the rollers 36A is dropped into the reject bin 38. Similarly, in response to another signal from the inspection machine 32, the rollers 36B may be horizontally withdrawn from their normal operating position. As a result, a discrete strip 10 on the rollers 36B is dropped into the accept bin 40.
During operation, discrete strips 10 are fed into the inspection machine 32 where they are inspected for defects. The inspected discrete strips 10 are placed onto conveyor 34 where they are conveyed toward the accept bin 40. If a discrete strip 10 is defective, however, the inspection machine 32 transmits a control signal to the rollers 36A. The defective discrete strip 10 is then dropped into and discarded in the reject bin 38 before it reaches the accept bin 40. Alternatively, if a discrete strip 10 passes inspection the inspection machine 32 directs the discrete strip 10 to be conveyed beyond the reject bin 38. At the accept bin 40, the inspection machine 32 transmits a control signal to the rollers 36B and the discrete strips 10 fall onto the unload elevator 42 in the accept bin 40.
As the discrete strips 10 accumulate into the accept bin 40, the unload elevator gradually descends. The optical sensor 43 determines the number of discrete strips 10 in the accept bin. Once a predetermined number of discrete strips 10 are accumulated in the accept bin 40, for example one hundred, the inspection machine 32 is shut off. The discrete strips 10 are then manually removed from the unload elevator 42, bundled, wrapped in paper, and placed by hand into the packaging tray 44.
A complete description of the packaging tray 44 is described in U.S. Pat. No. 4,798,305, entitled "Adjustable Shipping Tray", and is assigned to the assignee of the present invention. The adjustable shipping tray 44 provides a flat bottom, two sets of opposing vertical sides and an open top. Within the tray, one or more movable partitions are provided to allow the internal compartment of the tray to accommodate the bundles of lead frames of different sizes and configuration.
The prior art method of manually removing, wrapping and packing bundles of discrete strips 10 into the adjustable tray 44 has a number of deficiencies. First, manual handling of the lead frames may cause physical damage to the delicate discrete strip 10. The plated surfaces of lead frames may become scratched, leads 16 may be displaced, or the discrete strip 10 may be bent if mishandled. Second, the surface area of the lead frames 12 may be contaminated if the person manually handling the lead frames has dirty hands.

Magazine and shipping tray for lead frames


Helper resonators useful for the reliable, controlled startup of an associated high power multidisk unstable imaging thin disk laser (TDL) main resonator each includes one of the thin disk gain elements (TDGEs) of the associated main resonator and a pair of helper reflectors disposed on opposite sides thereof. The helper resonators act to prevent the buildup of undesirable amplified spontaneous emission (ASE) during startup of the main resonator, pre-condition the TDGEs so as to enable efficient power transfer from the helper resonators to the main resonator when the main resonator reaches a selected feedback ratio (FBR) and provide a rapidly acting shunt for disk power in the event of a cessation of lasing of the main resonator.

1. Technical Field
The present disclosure relates to high power lasers, in general, and more particularly, to systems for enabling the reliable startup of high power unstable multidisk thin disk laser (TDL) resonators.
2. Related Art
A "Thin Disk Gain Element" (TDGE), sometimes referred to as an "active mirror," is an optical amplifier gain medium, typically but not necessarily disk-shaped, in which stimulated emission of light, i.e., "lasing," is produced when the disk is appropriately illuminated with a pump light source and a seed laser input, resulting in an output seed laser with gain. Conventional TDGEs may be made from a ytterbium (Yb) doped yttrium aluminum garnet (YAG) crystal, i.e., Yb:YAG disks, bonded to heat sinks, such as diamond or copper. In conventional TDGE systems, the crystal of the gain medium is fixed to the heat sink with a layer of, e.g., an indium or equivalent bonding solder or adhesive. The heat sink may be liquid cooled, e.g., with water or cryogenic fluids, or with a thermoelectric (TE) cooler. For clarification purposes, a Thin-Disk Laser (TDL) represents a combination of TDGEs, a highly reflective (HR) Primary mirror, a partially reflective feedback mirror commonly referred to as an Out-Coupler (OC) and a multitude of fold mirrors (FM) that properly image and link the intra-cavity optical beam to the multiple TDGEs. Power scalable TDLs are described in detail in, e.g., U.S. Pat. Pub. No. 2008/0304534 A1 by D. Sumida et al.
One approach to achieving a solid state laser with relatively high average output power is to employ a module-scaling approach in which multiple Gain Elements (GEs) are combined within a common resonator, enabling a single-output-beam laser at power levels well beyond the capability of a laser built around a single GE. For example, welding lasers employing Yb:YAG TDGEs have demonstrated significant output power levels with outstanding optical-optical efficiency by employing resonators designed to operate in the stable regime. However these high-power welding-laser designs do not achieve near-diffraction-limited output laser beams due to the significant multi-mode content within the output laser beam. Achieving a near-diffraction-limited output laser beam requires a resonator design that achieves single transverse mode operation within the laser. Multiple-TDL laser resonator systems are described in more detail in, e.g., U.S. Pat. No. 6,987,789 to H. Brusselbach et al. and in U.S. patent application Ser. No. 12/109,634 by D. Holmes, filed Apr. 25, 2008.
Applications requiring the generation of small laser spot size at large working distances require near-diffraction-limited laser beams. The typical performance measure that characterizes a laser beam with good focusability is the beam quality factor (BQ), where a diffraction-limited beam has a BQ=1 and a BQ>1 for beams with less focusability. Military applications typically require both high power and good BQ while preserving outstanding optical-to-optical efficiencies, making these applications the most demanding. Utilization of a Negative-Branch-Imaging-Resonator (NBIR) design with a Gradient Reflectivity Mirror (GRM) Out-Coupler (OC) theoretically would enable single-transverse mode operation within the resonator. This resonator design can theoretically achieve high power through multi-module scaling and resonator fold mirrors that image TDGE to TDGE within the resonator.
However, as a practical matter, TDLs designed to achieve such objectives are complicated by temperature-dependent aberrations within the TDGEs which arise from two primary sources associated with a variation in stored energy across the pumped region of the TDGE and Amplified Spontaneous Emission (ASE) trapped within the TDGE. In addition to causing optical aberration within the TDGEs, these effects can, if not properly controlled, lead to degradation of the TDGEs via intensity-dependent effects that give rise to temperature and stress-induced degradation. These effects become more prominent with increased pump diameter and increased pump intensity, which represent the standard strategies for storing more energy within each TDGE. These effects are particularly troublesome during the start-up of the TDL, due to the dynamic nature of these effects. The dynamic effects manifest as both temporally and spatially changing aberration distributions within each TDGE, making mode-control within the resonator challenging.
The design of resonator architectures is also compromised by large variations of energy extraction within the TDLs during the start-up of the resonators. These large variations in extracted energy from the TDLs during startup act to cause disk temperature variations that lead to non-tractable disk aberrations and loss of mode control, and ultimately, prevent the resonator from establishing the desired fundamental GRM mode, and can potentially result in degradation of the TDLs due to ASE-induced damage mechanisms.
The realization of high-power multidisk TDLs with near-diffraction limited beam quality and high optical-to-optical efficiency is thus predicated on establishing and maintaining single transverse mode operation within the resonator in the presence of highly dynamic aberrations arising within the TDGEs.
A need therefore exists for methods and apparatus that enable the reliable startup of a TDL designed to produce a near-diffraction-limited output beam in the presence of dynamically changing aberrations within the TDGEs of the resonator.

Reliable startup of high power thin-disk laser resonators


A magneto-optical disk comprising a substrate, a dielectric film made of aluminum germanium nitride disposed on the substrate and a magnetic film disposed on the dielectric film. The magnetic-optical disk has increased Kerr rotational angle, while having excellent corrosion resistivity and high performance with respect to the CNR ratio.

1. FIELD OF THE INVENTION
The present invention concerns a magneto-optical disk for recording, reproducing and erasing information, for example, by laser beams.
2. DISCUSSION OF BACKGROUND
With the remarkable development of so-called information society in recent years, requirements for recording media of large capacity and relevant recording/reproducing system have been increased rapidly and laser video disks, digital audio-disks, write-once disks for use in image or document files have already been put to practical use. However, such recording media put to practical use at present have a drawback of incapable of rewriting, and rewritable recording media and recording/reproducing system have been demanded. Then, as one of recording/reproducing systems, magneto-optical recording/reproducing systems have been proposed and shipping for their samples has already been started.
Magneto-optical disks used in the magneto-optical recording/reproducing system basically comprise a plastic substrate or a glass substrate on which an amorphous vertical magnetization memberane (or, a thin film of amorphous magnetic material having magnetic anisotropy so that the magnetic material is magnetized with its magnetic axis perpendicular to the plane of the thin film) is formed, and rare earth-transition metal alloys such as GdTbFe, TbFeCo, DyFeCo, GdDyFe, etc. are used as the magnetic material.
The written signal in a magneto-optical disk is read out by utilizing Kerr effect, that is, the rotation of the direction of polarization on reflection. The carrier-to-noise ratio (CNR) of read signal is generally insufficient for practical use because the Kerr rotational angle is small. In view of the above, it has been attempted to increase the Kerr rotational angle by forming a dielectric film of SiO or SiO.sub.2 on the magnetic material.
However, since the rare earth-transition metal alloy film is not superior in anticorrosion property, it is required that the dielectric film is effective not only for increasing the Kerr rotational angle but also for protecting the corrosion of magnetic film. The SiO or SiO.sub.2 film has a drawback of incapable of providing substantial protection against corrosion. As for the improvement of the drawback, Si.sub.3 N.sub.4 or A1N has been proposed as the dielectric film. As the example for the former, Japanese Patent Publication No. Sho 62-27458 discloses the use of a silicon nitride film, which increases the Kerr rotational angle and which is suitable to practical use.
When the silicon nitride film is deposited by means of sputtering, since the film having such a refractive index as that increases the Kerr rotational angle sufficiently involves large internal stresses therein, the film has often been peeled off after the preparation of the disk and lacks in the reliability. Furthermore, since the silicon nitride films deposited on the inner surface of the sputtering system peel off owing to the large internal stresses, there is a problem that dusts increase in the sputtering system and result in high defect density of the disk.


A cabinet door assembly having a wooden cabinet door with a peripheral frame and an open center is provided with features enabling a fabric panel to be mounted on the door in a manner such that panels may be readily removed and replaced with other panels. An upper member of the frame has a slot which receives a dowel pin carried in an upper loop of the panel fabric, and a lower frame member has a slot which receives the lower end of the panel and directs a lower dowel pin carried at the lower end into a capturing position. The panel is pulled tightly by tension applied to the dowel pins. Side frame members each have on an inner side a narrow slot receiving edges of the panel. The panel is secured in place by the lower dowel pin, which is being restrained by projections at end locations past side edges of the panel.

One of the most common structures for cabinet doors, and particularly doors for kitchen cabinets, comprises an outer rectangular frame and a central panel supported by and connected to the frame. The central frame lends itself to use as a location for placement of a decorative display, which may be a component of an overall decorative scheme. A desired feature for a decorative center panel location would be a capability of the panel for being easily installed, removed and replaced without damaging or marring the structure. This would enable use of selected decorative materials for special occasions or with changes of the seasons.
Modifications of center panel structure to obtain decorative variety have been made previously, with rigid, slideably installed panels being substituted for or used in addition to existing panels. It is desired to provide replacement panels in the form of flexible fabric which may be readily installed and removed without use of any tools.

Cabinet door with changeable decorative panel


A work fixing device capable of stably fixing the work, without any biasing, in the longitudinal direction of the work, of the fastening force for fixing the work. The moving mechanism of clamps is constructed by comprising a scroll disc as working disc forming a circular hole in which to insert the work at the center and scroll guides in spiral shape the winding direction of which is opposite to each other from the center toward the outer circumference on the both side faces, a rotary drive mechanism for rotatably driving this scroll disc, and scroll pieces having a fitting portion to be engaged with the scroll guides of the scroll disc and disposed on both sides of the scroll disc in a way to correspond to a plurality of clamps respectively.

The present invention relates to a work fixing device, more specifically a work fixing device for gripping a work with circular section inserted in a hole formed in the main body of the work fixing device, comprising a plurality of clamps disposed movably along a guide groove formed in the radial direction in the main body of the work fixing device; and a clamp moving mechanism for synchronously moving the plurality of clamps in the radial direction.
Conventionally, when executing processing such as spinning, cutting, etc. on works with circular section (also including hollow works in tubular shape, in this specification), a variety of work fixing devices are used (JP 07-227733 A, for example), because of the necessity of fixing the work.
By the way, this type of work fixing device usually comprises, as shown in FIG. 11, a clamp moving mechanism 3 for moving a plurality of clamps 2. However, with this arrangement, in which the clamp is supported and moved by the moving mechanism 3 disposed on either the back face or a side face of the clamp 2, the fixing of work was liable to be limited only to the central part of the work or biased to one side.
For that reason, in the case of a long work or a work of soft metal such as aluminum, etc. or a hollow work in tubular shape with little rigidity, or in the case where the dimensional accuracy is rather low and variable, there was a problem that the work cannot be fixed accurately, eventually having negative influences on the working accuracy and operating efficiency.


An apparatus and a method are provided for selectively eliminating weeds in agriculture operations. To provide selective elimination, at least two light (radiation) emitters, powered by an internal power source, are modulated to switch on and off at very high speeds. Each emitter emits radiation of a different emitter wavelength. The on/off modulation of one emitter is phase shifted by approximately 90.degree. with respect to the modulation of the other emitter. The pair of emitters are focused on a particular spot on the ground. The light beams, provided by the emitters, are reflected off a plant or the soil and are intercepted by a photodetector. Because plants have a characteristic spectral reflectance in regions of the electromagnetic spectrum which can be discriminated from the spectral reflectance of the background earth, the relative amplitudes of the reflected radiation at the two emitter wavelengths varies depending on whether the radiation is reflected off a plant or the soil. A ratio of the radiation at the two emitter wavelengths received by the photodetector is converted to a phase. This phase is compared to an initial reference phase of the modulation of one of the emitters. A controller uses this phase information to determine the presence or absence of a plant and then eliminates the weed.

1. Field of the Invention
This invention relates to a structure and a method for differentiating one object from another, and in particular to a structure which optically detects weeds and then eliminates those weeds.
2. Description of Related Art
In many situations it is necessary to distinguish one type of object from another. While this is essential in such diverse areas as manufacturing, data processing and mail delivery, object differentiation is particularly important in agriculture. For example, the ability to distinguish weeds from desired plants is essential to allow weeds to be destroyed because even sparse weed populations decrease the moisture, light and nutrients available to crop plants, thereby significantly reducing yields of these crops. Additionally, weeds can clog machinery and impede access to crops during farm operations such as harvesting. Spraying of herbicide is a conventional method of controlling weeds. However, when spraying herbicide to control scattered weeds, most of the herbicide is wasted by being deposited on bare soil where the herbicide has no effect. Because herbicides are expensive, many growers attempt to save money by using less herbicide. However, larger chemically-tolerant weeds often escape control because of insufficient herbicide application. Moreover, herbicides may have highly undesirable effects on the environment, for example, by causing contamination of ground water or causing chemical burning of different crops in adjacent fields during floods. Thus, a need exists to reduce both herbicide cost and environmental impact by selectively spraying only the weeds.
Methods for optically distinguishing between soil and plants are currently known in the art. However, many of these methods use devices which rely on natural sunlight to create a reflected image. Thus, the devices cannot operate at night, and are seriously impaired under cloudy conditions, or even when operated in shadows. Other methods for optically distinguishing between soil and plants use devices which rely on an artificial white light source to create the reflected image. However, under normal (i.e. sunny) operating conditions, this artificial light source must compete with the sun which is thousands of times brighter and constantly changing in brightness and spectral distribution. Therefore, either method, i.e. using natural sunlight or an artificial white light source, fails to reliably provide an accurate wavelength signature of objects in the field of view of the device sufficient to eliminate individual weeds. Indeed, applications for these methods have been limited to weed control of low-till or no-till field crops where this lack of precision can be tolerated. However, orchards, vineyards, and row crops require a high degree of accuracy in weed control. Thus, a need exists for a device which provides accurate optical sensing of the weeds and efficient elimination of those weeds.

Structure and method for differentiating one object from another object


A pipe connection which the insertion piece fits into a sleeve and presses a retaining ring there against. The retaining ring has a compression rib and is constructed so as to be urged into a channel in the sleeve, The ring body is formed unitarily with a sealed lip and a closure lip and a compression-relieving groove opens axially in the direction of insertion and extends almost to but is spaced from a radial plane of the compression rib.

A pipe connection of the male and female type is known in which the female part is in the form of a sleeve connected with or unitarily formed on one of the two pipes to be connected, while an insert, which is generally cylindrical and tubular, is formed on the other pipe to constitute the male member which is insertable into the sleeve.
The sleeve can be provided with an inlet guide member forming the mouth of the sleeve, a final guide part or member axially inwardly of the sleeve and an enlargement between the guide members which forms a receiving channel accommodating a retaining ring.
A sealing chamber can be provided between the final guide member and the channel to accommodate a sealing lip which, in the absence of the insert part, extends frustoconically inwardly from the body of the ring. The sealing lip may have a gripping or closure lip formed thereon which conically widens away from the funnel-shaped sealing lip, i.e. axially inwardly.
The inner surface of the retaining ring can be formed with a compression rib which can define a ramp inclined toward the inlet guide member so that it is engaged by the insert part and can be pressed outwardly upon such insertion to seat the ring body firmly in the channel.
A pipe connection of this type is described in the German Patent 28 00 408. Pipe connections and pipe systems with such connections are utilized, for example, as subterranean conduits, especially to form cable-protecting tubing or as cable-guide tubing.
The pipe connections can be described as two-phase pipe connections because the arrangement of the sleeve structure and the retaining ring has a dual function. Firstly, the compression rib of the retaining ring provides upon insertion of the insert part, an initial centering of the insert part. Thereafter the sealing lip with the closure or gripping lip formed thereon, provides a sealing and gripping action. The earlier system required a relatively high insertion force and thus significant insertion effort to overcome the resistance to insertion of the insert part provided by the ring which, although, composed of rubber and thus elastically deformable, is substantially incompressible.
Of course the absolute value of the force required to fit the parts together and hence the insertion effort will depend upon the Shore hardness of the rubber.

Pipe connection with sleeve, insert part and retaining ring

Dipl.-Ing. Dr. Ernst Vogelsang GmbH & Co. KG


Disclosed is a method for transmitting an ACK/NACK signal for an HARQ (Hybrid Automatic Repeat reQuest) in a CA (Carrier Aggregation) system, the method including obtaining at least one transmission resource among first and second transmission resources; configuring a first table showing a relationship in which a combination of at least one of the first and second transmission resources and modulation symbols is mapped to an ACK/NACK signal, and transmitting modulation symbols corresponding to a transmission target ACK/NACK signal in the first table by using transmission resource corresponding to the transmission target ACK/NACK signal in the first table.

1. Field
The present invention relates to wireless communication and, more particularly, to a wireless communication system supporting multiple carriers.
2. Discussion of the Background
A wireless communication system generally uses a single bandwidth for data transmission, and respective mobile communication generation use different bandwidths. For example, a 2nd-generation wireless communication system uses a bandwidth of 200 KHz to 1.25 MHz, a 3rd-wireless communication system uses a bandwidth of 5 MHz to 10 MHz. In order to support an increasing transmission capacity, recently, LTE (Long Term Evolution) or IEEE 802.16m continue to extend their bandwidth to 20 MHz or even higher. It may be requisite to increase the bandwidth to enhance transmission capacity, but it is not easy to allocate frequency of a large bandwidth, except for some areas globally.
A carrier aggregation (CA) technique for binding (or grouping) a plurality of physically non-continuous bands in a frequency domain to obtain an effect of using a logically large band has been developed in order to effectively use fragmented small bands. Individual unit carriers bound through carrier aggregation are called component carriers (CCs). Each of the component carriers (CCs) is defined by a single bandwidth and central frequency.
A system for transmitting and/or receiving data in a broadband through a plurality of component carriers is called a CA (Carrier Aggregation) system or a carrier aggregation environment. The CA system supports both a narrowband and a broadband by using one or more carriers. For example, when one carrier corresponds to a bandwidth of 5 MHz, a bandwidth of a maximum of 20 MHz is supported by using four carriers.
In order to operate the CA system, various control signaling is required between a base station (BS) and a user equipment (UE). For example, exchanging of ACK (ACKnowledgement)/NACK (Not-ACKnowledgement) information to perform HARQ (Hybrid Automatic Repeat reQuest), exchanging of CQI (Channel Quality Indicator) indicating downlink channel quality, and the like, are required.
In this connection, however, since a plurality of uplink CCs and a plurality of downlink CCs are used in the multi-CC system, an apparatus and method for exchanging various control signaling between a BS and a UE in such a communication environment are required.

Method of transmitting and receiving ACK/NACK signal and apparatus thereof


A communication unit for an electrical machine, in particular a hand-held machine tool, includes at least one electrical actuator, a control unit configured to control the at least one electrical actuator, and a receiving unit assigned to a mobile or stationary unit. The at least one electrical actuator and the control unit together form a transmission unit. The transmission unit is configured to transmit data, and the receiving unit is configured to receive the data. The receiving unit includes at least one microphone. To transmit data, via the transmission unit, the control unit is configured to trigger the electrical actuator to generate an acoustic signal that is detectable by the at least one microphone.

Communication facilities of the type mentioned at the outset are known from the prior art. Power tools, in particular hand-held power tools, are usually understood to be stand-alone appliances that themselves provide all control and information functions, such that the user can perform control inputs and read out information directly on the power tool. Due to the networking of products among one another by means of the so-called Internet of Things, new possibilities are being made available, by which it becomes possible for information to be output or controls to be input in a decentralized manner, i.e. separate from the power tool. For example, this enables the power tool to be remotely operated by an external, or separate, facility, or its operating status to be checked. Communication facilities, which use differing data transmission possibilities, are used for transmitting the data. Thus, communication facilities are known that transmit data wirelessly, by infrared or by visible light. Wired connections of communication facilities are also known.
In the case of the known communication facilities, it is disadvantageous that, in addition to electronics already present in the power tool, it is additionally necessary to integrate a transmission facility that, for example, wirelessly transmits operating data of the power tool to the separate facility.

Communication unit for an electrical machine tool, electrical machine tool system and method