A component includes a chip having a first chip face and a second chip face, where the first chip face includes component structures and connector metallizations associated with the component structures. The component also includes a frame structure on the first chip face and adjacent to the component structures, and a cover over the frame structure. The cover has a first cover face and a second cover face. The first cover face is closer to the chip than the second cover face. A back metallization is on the second chip face, on sides of the frame structure, and on sides of the cover. A contact is on the second cover face. There is a connection through the cover, which electrically connects the component structures and the contact. The connection is metallized and sealed.

For almost four decades, the integration density in microelectronics has been following "Moore's Law," which states a doubling approximately every 18 months, with simultaneous halving of the production costs. Traditionally, the production of microelectronic products has been divided into the so-called front end (essentially application and structuring of thin films on wafers) and, after these are sawed into individual chips, the so-called back end (assembly of the chips on carriers, electrical contacting, and enclosure or enveloping).
The mechanical and electrical connections of the chip to the carrier are brought together into a single step with the flip-chip technique. In this way, significant miniaturization and better signal transmission due to low inductance values is made possible by means of this connection technique.
The combination of flip-chip assembly with a utilization technique in which a plurality of chips is mounted on a common carrier is particularly advantageous. In this manner, components are now being implemented whose footprint does not exceed the actual chip area required for active structures and connections by more than 20%, with the term chip sized package (CSP) being commonly used for this.
Lateral chip dimensions of approximately 1 mm are below dimensions where conventional housings ("tub" with lid) could be used. For these reasons, leading semiconductor manufacturers have developed packaging concepts in recent years, which provide for encapsulation on the wafer level, i.e., before individualization of the components, after wafer structuring.
A true wafer level packaging avoids the individual handling of individual chips. With this, the implementation of a true CSP is made possible even with very small chip dimensions. Fundamentally, all the housing functionalities can be implemented on the wafer level. Aside from the protection against mechanical and climatic influences, as well as the provision of electrical connections that are compatible with industry standards such as surface assembly and re-flow solders, re-wiring can also take place here, for example. In this connection, chip connectors can be freely positioned on the outside housing surface. This is made possible by means of one or more insulation layers, interfacial connections, and conductive structures. Internal connections are also possible in this manner.
The demand for true CSP is further emphasized by the pressure towards miniaturization and, to a particular degree, in the case of expensive substrates (e.g., LiTaO3, GaAs).
For semiconductor components that do not require any housing cavity, on the basis of their method of functioning, there are a large number of appropriate concepts. Some of them have already become so broadly established that they are offered on the packaging of specialized service providers. An example is the method known under the trademark UltraCSP.
A fundamental technical problem of all solutions paths that have been proposed until now is the long-term reliability of the components, since the internal and external connections become fatigued due to temperature change stress. This must particularly be taken into account by means of coordinating the thermal expansion properties of the materials used.
The stated task is made even more difficult as soon as the demand for a housing cavity for the component structures is added, for example in the case of SAW (surface acoustic wave) components. Often, a hermetic seal in the sense of a diffusion seal of this cavity is also demanded, since otherwise the resistance to damp heat can be insufficient, resulting in corrosion, problems caused by condensate on active structures, problems with the moisture content of polymers used in soldering processes, etc.). A hermetic seal can fundamentally not be achieved with polymer-based molding masses, resins, or adhesives, since these materials are more or less permeable for gases and moisture, due to permeation processes.
In WO2000/3508A1, an active structure on a wafer is surrounded with a frame of photoresist, for example, onto which a circuit board is glued as a cover. Interfacial connections guide the electrical connectors from the chip to contacts on the circuit board. No sufficient hermetic seal is achieved with the sealing layer that covers the back of the chip as well as the side surfaces of the component, since the circuit board is not completely covered, because the usual resin laminates with fiber reinforcement recommended as the sealing layer are particularly disadvantageous in terms of their diffusion seal, since moisture can spread along the border layer between the polymer and the fibers. However, the decisive disadvantage is that the sealing layer described can no longer be applied on the wafer level, but only afterwards, on the individual component.
From WO2001/4318A1, another method for packaging is known. Here, the wafer is glued between two covers. Frame-shaped spacers define a cavity above the active chip structure, if necessary. The electrical contacts run around the chip to contacts (110) on the back cover, by means of metal structures that were originally produced on the wafer and those that are structured in sawed notches along the separation lines (108). The joining materials are polymers, with which no diffusion seal can be achieved, as was explained. The concept does not permit complete metallization (and therefore a seal), since the electrical connections require several metal structures that are electrically separated from one another.
It is therefore the task of the present invention to indicate a simple and cost-effective method for true CSP, on the wafer level, for SAW filters and other components, with which method components having a diffusion seal can be produced.

Encapsulated component and method for the production thereof


Connections between a Java 2 enterprise edition (J2EE) application server and a common object request broker architecture (CORBA) enterprise information system are managed. A resource adapter is integrated with the application server. The resource adapter includes an encapsulated CORBA interface to the enterprise information system. Additionally, a persistent CORBA connection is established between the application server and the enterprise information system.

1. Field of the Invention
The present invention relates to a Java 2 enterprise edition—common object request broker architecture connector. More particularly, the present invention relates to a connector for managing common object request broker architecture connections from a Java 2 enterprise edition compliant application server to an enterprise information system.
2. Background Information
A client connected to an application server program through a computer network may request the services of an enterprise information system (EIS). For example, a client may be connected to a web application server program through the internet. The web application server program may enable the client to request the services of an external enterprise information system that provides the information infrastructure for an enterprise to clients of the enterprise. For example, an enterprise information system may offer a set of information services to clients of an enterprise.
Common object request broker architecture (CORBA) defines interfaces for each individual unit of running software that combines functionality and data, i.e., for each object. A client that wants to invoke an operation on an object must use the defined interface to specify the operation it wants to perform. For example, a service manager in a telecommunications environment may process only CORBA requests from a client to access and change service information.
Currently, vendor-specific architectures are used to integrate application servers and enterprise information systems. The Java 2 enterprise edition (J2EE) specification is being developed to define a standard architecture for integrating application servers and enterprise information systems. Nevertheless, even if J2EE is widely adopted, a legacy enterprise information system such as a telecommunications service manager may still process only CORBA requests from an application server program. If an application server program operates according to the J2EE architecture that is being developed, a J2EE—CORBA connector will be required to establish and maintain CORBA connections with an enterprise information system. For example, a J2EE—CORBA connector will be required to enable a J2EE compliant application server program to convey client requests to the legacy service manager.
Accordingly, a J2EE—CORBA connector is required to integrate a J2EE compliant application server and a enterprise information system that uses CORBA. A customizable deployment descriptor is also required to customize the deployment and management of each CORBA connection. Moreover, a method of integrating the J2EE—CORBA connector with the application server is required.
To fulfill the needs set forth above, a J2EE enterprise information system (EIS) common object request broker architecture (CORBA) connector is provided.


An electronic catalog system, which may be implemented as a web site or another type of interactive system, presents context-sensitive account information to customers during browsing of an electronic catalog of products. In one embodiment, when a customer accesses a detail page for a particular product, the detail page is supplemented with information, such as status information, about a related order placed by the customer. The related order may be an order for the product represented in the detail page or may be for a related product. Information about related orders may additionally or alternatively be added to other types of pages, such as product category pages and shopping cart pages. In one embodiment, a customer's related order information is maintained in a cache during the customer's browsing session, and the cache is updated in real time to reflect actions performed by the customer.

With the increasing popularity of computer networks, it has become common for merchants to set up online stores for marketing and selling products. These stores typically include electronic catalogs that can be browsed interactively by potential customers via the Internet, an online services network, or another type of system that supports interactive browsing.
Many online stores provide services for customers to access information about their pending and past transactions. The transaction information may include, for example, descriptions of orders placed, the fulfillment status of such orders, and other details of the underlying transaction (payment method, delivery method, etc.). Typically, the online store also permits each customer to create and edit a personal profile, which may include such information as a shipping address, an email address, an electronic wish list, and information about the customer's preferences.
Customers typically may access their account information by choosing to enter an "accounts" section of the online store (e.g., by selecting a "My Account" or "My Profile" link) wherein the customers may track orders, alter contact information, change preferences, sign up for new promotions, and so forth. While an accounts section provides customers with detailed information about their accounts, accessing the accounts section while using the online store is sometimes inconvenient and disruptive of the online shopping experience. Further, the task of locating a particular transaction may be tedious and time consuming if the customer's transaction history is large.

Contextual presentation of information about related orders during browsing of an electronic catalog


A fastener system for mounting to a panel includes a twist-in fastener that rotatably engages an opening in the panel. The fastener includes a fastener body defining an opening extending through the fastener body for receiving a mating fastener, a plurality of facets positioned around the fastener body opening for facilitating the mounting of the fastener onto the panel, and a fastener base. Panel-engaging members extend outwardly from the fastener base to rotatably mount the fastener through the panel opening and onto the panel. At least one anti-rotation member also extends outwardly from the fastener base to prevent the mounted fastener from backing out of the panel opening upon the removal of the mating fastener.

It is known to use panel fasteners for various applications. Conventional panel fasteners include a threaded nut that is anchored over an opening in a panel, and a bolt that is engageable with the threaded nut to secure a component or device to the panel. Typically, the threaded nut of the fastener is welded onto the panel and over the opening in the panel. Problems exist, however, with respect to welding fastener nuts onto panels. For instance, it is often difficult to properly locate and weld the fastener nut over the opening in the panel. In addition, it is often difficult to consistently and completely weld the nut onto the panel. Moreover, a large capital investment is required for equipment that will accurately locate and completely weld the fastener nut onto the panel.
Alternatively, another technique for securing a fastener to a panel includes force fitting the fastener into the opening in the panel. Drawbacks also exist with respect to this technique. For example, one known drawback with the force fitting technique is the potential for the panel to yield or deform under the force applied to the panel. In addition, as with the welding technique, the press fitting technique requires a large capital investment in equipment, such as hydraulic presses to press the fastener onto the panel. Still another drawback with this technique is that once the fastener is pressed into the panel opening, the fastener will back out or become detached from the panel upon the application of relatively low torque forces.
The present invention is directed at overcoming these and other known problems and disadvantages with existing techniques for anchoring fasteners to panels.


A soil repellency aqueous dispersion for treating various fibers, yarns, and textiles is disclosed. The dispersion provides superior soil resistance when compared to known fluorochemical and silicone fiber treatments. The dispersion comprises clay nanoparticle components and fluorochemicals that can be applied to the fibers, yarns, and textiles using known methods.

Sub-micron particles of inorganic oxides (i.e. silica) have been applied topically to polyamide fibers in the past to provide anti-soil deposition benefits, but have suffered from poor durability and harsh texture. Additionally, the silica treated surfaces can have an unappealing white haze at certain deposition concentrations. Fluorochemical resin emulsions have been used to create low soiling soft surfaces.
U.S. Pat. No. 6,225,403 teaches the use of surface treating compositions comprised of a blend of fluorochemical resins with colloidal sol dispersions of organosiloxane co-polymers. This blend allows for significantly reduced add-on levels of fluorochemicals on soft-surfaces to achieve acceptable soil repellency. However, these colloidal siloxane fluorine extenders can impart a harsh feel to the soft surface which is undesirable.

Soil repellency aqueous dispersions, soil repellant soft articles, and methods of making the same


A multiprocessor computer system comprises a plurality of processors, wherein each processor includes an execution unit, a program counter, a result buffer containing a plurality of entries, each entry being allocated to hold an output value of an instruction executed by the execution unit, and an operation counter containing an operation count that is incremented at least when an instruction storing an output value to the result buffer is executed by the execution unit. A particular entry allocated in the result buffer for a given output value is selected as a function of the operation count at the time the instruction generating that given output value is executed. Each processor further includes a decoder that extracts a processor identifier from an instruction to be executed that identifies one of the plurality of processors, wherein one or more input values of the instruction are retrieved from the result buffer of the identified processor. Each decoder also extracts a displacement value from the instruction to be executed that provides a relative difference between the current operation count of the executing processor and an expected operation count of the identified processor when the desired input values are stored in the result buffer of the identified processor. The decoder generates an access key as a function of the displacement value and the current operation count of the processor executing the instruction and retrieves an input value from the result buffer of the identified processor at the entry indexed by the access key.

1. Technical Field
The present invention relates to improvements in data processing in a multiprocessor computer system.
2. Description of the Related Art
A block diagram of a conventional multiprocessor computer system, abstracted in its simplest terms, is shown in FIG. 1. The processors 101, 111, 121 interact with memory 102 via system bus 122. The program counter 103 belonging to processor 101 specifies a location in memory 102 from which an instruction is fetched. The instruction, formatted as shown in FIG. 2, is dispatched to the execution unit 104 in processor 101. The execution unit 104 performs the operation 201 specified by the instruction. The input values 202 to the operation 201 may be fetched from a location in memory 102 or from a location in register file 105, belonging to processor 101 as represented graphically in FIG. 2. The output values 203 from the operation 201 may be stored to a location in memory 102, or to a location in register file 105, or to the program counter 103, as shown graphically in FIG. 2.
When the input values for an operation executed by one processor are results (i.e. output values) of another instruction executed by another processor within the shared memory multiprocessor environment, the processing of the operation becomes more complex. First, in order for the first processor--for example, processor 101--to obtain such results to be utilized as input values, the second processor--for example, processor 111--must first store those output values to memory 102 so that processor 101 may then retrieve those results from memory 102 to be utilized as input values for the execution of its instruction. As will appreciated, these prerequisite steps consume additional instructions and clock cycles to store and load these values from one processor to the other, thereby creating substantial inefficiencies and undesirable consumption of processor power. Also, the execution of instructions requiring the results of other executed instructions as inputs requires that the processors be synchronized to ensure that the first processor is indeed accessing the appropriate results in memory 102 and not some prior, out-dated values. In the prior art, complicated procedures of data management are required to insure that memory coherency is maintained in the system.
The inefficiencies of sharing data among instructions executing on different processors in a shared memory multiprocessor configuration relative to sharing data among instructions executing on the same processor have shaped the way in which algorithms are defined. For example, an algorithm written for a shared memory multiprocessor is carefully partitioned to minimize the performance degradation due to sharing data produced by an instruction stream executing on one of the processors with an instruction stream executing on another of the processors. This data is typically shared via memory operations and synchronized via locking primitives. Alternatively, an algorithm written for a single processor has no such constraints. Data produced by one instruction is shared with other instructions via a register file, a high bandwidth, low latency mechanism, and synchronized via the linear sequence of instruction execution.
Since the lower bandwidth, higher latency, high overhead parallelism afforded by shared memory multiprocessors is not suitable for exploiting the fine-grained instruction level parallelism (ILP) inherent in many algorithms, processor architects have employed other approaches to construct systems which efficiently execute such algorithms. By employing pipelining techniques, multiple execution units, and sophisticated hardware and software instruction scheduling techniques, they have achieved the parallel execution on a single processor of instructions found within a single instruction stream (which share data via a register file), and have provided a means to efficiently execute algorithms which exhibit ILP.
Unfortunately, two drawbacks limit the overall effectiveness of such approaches. The first drawback is an increase in processor complexity. When a simple, one-instruction-at-a-time, in-order execution processor is extended to execute several instructions at a time, possibly scheduling them for out-of-order execution, the number of circuits, the silicon area, the circuit complexity, the testing complexity, the development time, the risk, and hence the development cost all typically increase dramatically.
The second drawback is due to the fact that not all algorithms are able to take advantage of the computational bandwidth afforded by single processors which are capable of executing multiple instructions in parallel. In other words, these algorithms tend to execute nearly as efficiently on simple, one-instruction-at-a-time processors as they do on complex, multiple-instruction-at-a-time processors. Furthermore, many such algorithms typically scale well when executed in multiprocessor environments.
Thus, in the past, the ideal execution environment for the first class of algorithms has been a single, complex, multiple-instruction-at-a-time, expensive-to-develop processor, while the ideal execution environment for the second class of algorithms has been a shared memory or distributed memory multiprocessor configuration, comprised of several simple, one-instruction-at-a-time inexpensive-to-develop processors.

Apparatus and method for executing instructions that select a storage location for output values in response to an operation count

International Business Machines Corporation


In a brushless motor (1), a stator base board (10) has three grooves (14) which are cut radially of a mounting hole (103). A core holder (32) holding a stator core (31) has three protrusions (33) which extend downwardly in the direction of the axis of the motor (1). Each of the protrusions (33) has a first engaging portion (331) having a width which is substantially equal to a width of the grooves (14), and a second engaging portion (332) which is semi-circularly protruded from the outer cylindrical surface of the first engaging portion (331). When each of the protrusions (33) is fitted in the respective cut portions (14), two gaps (34) are formed between the outer surfaces of the second engaging portion (332) and the inner surfaces of the cut portions (14). Through the gaps (34), coil terminals (351) are extended from the upper surface (102) of the stator base board (10) to the lower surface, and are then soldered to lands (43) of the wiring pattern.

1. Field of the Invention
This invention relates to a brushless motor, a typical example of which is a spindle motor for a video tape recorder (VTR), and more particularly to a coil terminal extending structure of extending the terminals of a coil from the front surface of a wiring board to the rear surface.
2. Related Art
In a brushless motor, the rotary position of the rotor is detected with a magnetic sensor, and according to the result of detection, a motor driving IC on the wiring board controls the supply of current to the drive coil. In general, on the front surface of the wiring board, a stator on which a plurality of phases of drive coils are wound is mounted, and the end portions of those drive coils are drawn out from the front surface of the wiring board to the rear surface, and connected to wiring patterns formed thereon. Therefore, heretofore, the terminal parts are disposed in a core holder holding the stator core, and the end portion of the coil are connected to the front side ends of the terminal parts, and the rear side ends of the terminal parts are wired to the wringing patterns.
Sometimes, without use of terminal parts, the end portion of the coils are directly connected to the wiring patterns. In this case, holes are formed in the wiring board, and the coil terminal parts are inserted in the holes thus formed, so that the coils are drawn out from the front surface of the wiring board to the rear surfaces. In another method, no such holes are formed in the wiring board, and after being laid outside of the printed circuit board, the coils are drawn out from the front surface of the wiring board to the rear surface.
In the case where, as was described above, the coils are connected to the wiring patterns through the terminal parts, the number of components is increased as much as the number of the terminal parts, and accordingly the resultant brushless motor is increased in manufacturing cost as much. Furthermore, in the case of use of the terminal parts, it is necessary to wire the end portions of the coil and lead wires to both ends of each of the terminal parts. Therefore, the manufacture of the brushless motor is low in work efficiency and in productivity.
In the case where holes are formed in the wiring board, and the end portions of the coil are inserted into the holes thus formed, the manufacturing cost is increased as much as the holes are formed in the printed circuit board; that is, the resultant brushless motor is increased in manufacturing cost as much.
On the other hand, in the case where the coils are laid outside the wiring board, the coils come outside the wiring board. Hence, the parts of the coils which come outside the wiring board may touch other components such as a rotor, thus being broken. That is, the brushless motor is low in reliability.

Brushless motor having core holder mounting to base board forming gap for wire insertion

Kabushiki Kaisha Sankyo Seiki Seisakusho


A dust containment system for removing dust from the environment of a workpiece which is being blast cleaned comprises a water screen including a downwardly flowing curtain of water placed in the path of deflected blast media from the workpiece, a rearward wall spaced from the water screen and also in the path of the deflected stream of blast media and means to remove the blast media from the space between the water screen and the rearward wall.

In order to clean a solid surface so that such surface can again be coated such as, for example, to preserve metal against deterioration, remove graffiti from stone or simply to degrease or remove dirt from a solid surface, it has become common practice to use an abrasive blasting technique wherein abrasive particles are propelled by a high pressure fluid against the solid surface in order to dislodge previously applied coatings, scale, dirt, grease or other contaminants. Various abrasive blasting techniques have been utilized to remove coatings, grease and the like from solid surfaces. Thus, blasting techniques comprising dry blasting which involves directing the abrasive particles to a surface by means of pressurized air typically ranging from 30 to 150 psi, wet blasting in which the abrasive blast media is directed to the surface by a highly pressurized stream of water typically 3,000 psi and above, multi-step processes comprising dry or wet blasting and a mechanical technique such as sanding, chipping, etc. and a single step process in which both air and water are utilized either in combination at high pressures to propel the abrasive blast media to the surface as disclosed in U.S. Pat. No. 4,817,342, or in combination with relatively low pressure water used as a dust control agent or to control substrate damage have been used. Water for dust control has been mixed with the air either internally in the blast nozzle or external of the nozzle at the targeted surface to be cleaned and such latter process, although primarily a dry blasting technique, is considered wet blasting inasmuch as media recovery and clean up is substantially different from that utilized in a purely dry blasting operation.
The blast media or abrasive particles most widely used for blasting surfaces to remove adherent material therefrom is sand. Sand is a hard abrasive which is very useful in removing adherent materials such as paint, scale and other materials from metal surfaces such as steel. While sand is a most useful abrasive for each type of blasting technique, there are disadvantages in using sand as a blast media. For one, sand, i.e., silica, is friable and upon hitting a metal surface will break into minute particles which are small enough to enter the lungs. These minute silica particles pose a substantial health hazard. Additionally, much effort is needed to remove the sand from the surrounding area after completion of blasting. Still another disadvantage is the hardness of sand itself. Thus, sand cannot readily be used as an abrasive to remove coatings from relatively soft metals such as aluminum or any other soft substrate such as plastic, plastic composite structures, concrete or wood, as such relatively soft substrates can be excessively damaged by the abrasiveness of sand. Moreover, sand cannot be used around moving parts of machinery inasmuch as the sand particles can enter bearing surfaces and the like.
An alternative to sand as a blast media, particularly, for removing adherent coatings from relatively soft substrates such as softer metals as aluminum, composite surfaces, plastics, ceramic tile, concrete and the like is sodium bicarbonate. While sodium bicarbonate is softer than sand, it is sufficiently hard to remove coatings from aluminum surfaces and as well remove other coatings including paint, dirt, and grease from non-metallic surfaces without harming the substrate surface. Sodium bicarbonate is not harmful to the environment and is most advantageously water soluble such that the particles which remain subsequent to blasting can be simply washed away without yielding environmental harm. Since sodium bicarbonate is water soluble and is benign to the environment, this particular blast media has found increasing use in cleaning dirt, grease and oil and the like from hard surfaces such as steel as well as interior surfaces such as those which contact food such as in environments of food processing or handling.
Sodium bicarbonate is also a friable abrasive and, like sand, will form a considerable amount of dust during the blast cleaning process. To control the dust formed by the sodium bicarbonate blast media as it contacts the targeted surface, water has been included in the pressurized fluid carrier medium. Thus, water has been used as the primary carrier fluid or, more preferably, injected into a pressurized air stream which carries the blast media from the blast nozzle to the targeted surface. Water as a means to control dust has been mixed with the air stream internally in the blast nozzle or into the air stream externally of the nozzle. The addition of water to the pressurized air stream has been very effective in controlling dust formed by the sodium bicarbonate blast media. However, the addition of water can reduce productivity and, thus, purely dry blast cleaning processes are widely used.
Water has also been used as a dust control agent utilizing sand as the blast media. Moreover, most of the blast media which is utilized including the harder abrasives such as sand or alumina and the softer abrasives including the water soluble blast media such as sodium bicarbonate, sodium sulfate, sodium silicate and water insoluble soft media such as plastics, corn cobs, rice hulls, walnut shells, etc., are friable and will form a considerable amount of dust as the blast media contacts the targeted surface and strips the adherent contaminants therefrom. In an outdoor environment, the use of water as the carrier fluid or the addition of water to the pressurized air stream is useful in removing the dust formed during blast cleaning from the immediate environment of the substrate and the operator who is performing the blasting. Any dust which is not contained and removed disperses throughout the environment.
The use of blast chambers to strip contaminants from the surfaces of articles, in particular, articles which are of relatively small size is an important technique of cleaning such articles especially if blast cleaning is done on a regular basis. For example, automobile manufacturers use blast chambers to clean auto parts such as door panels, hoods, trunk tops, bumpers, etc. which have been over or unevenly painted for repainting. Blast equipment manufacturers and blast media formulators constantly test products in blast chambers. Thus, if blast cleaning is done on a regular basis, it is important to control noise levels, capture, examine and, if possible, recycle used abrasive media and control the dust which is formed so as to provide for the visibility of the blast nozzle operator. Dust control in blast chambers is extremely important in view of the enclosed environment which is used for the cleaning process. In the more enclosed environment of a blast chamber, the use of a secondary water stream does not effectively control the dust and, may in fact, add to visibility problems by forming a mist which stagnates in the chamber. Additionally, as before-said, the use of a secondary water stream for dust control may reduce the productivity of stripping and, thus, it may be desired to blast clean using a purely dry blast cleaning process. In a dry blast cleaning process, a considerably large amount of dust engulfs the environment of the target substrate. Accordingly, there is a continuing need to contain dust from blast cleaning operations, in particular, when such blast cleaning is done within a blast chamber.
It is well known to capture paint overspray whether as a liquid or as a powder by use of water curtains which are placed behind the substrate being painted. The curtains are provided by directing water downward on a flat support to form a coherent sheet of water which catches the paint particles or droplets. In blast cleaning operations, however, the abrasive blast media particles are orders of magnitude more massive than paint and the pressurized fluid which directs the blast media to the substrate is provided at a substantially greater volume than that used for paint spraying. Presently, many painting procedures even use airless systems. Consequently, the momentum of the blast media/air mixture is orders of magnitude greater than that found in painting systems such that mere water curtains are not sufficient to capture much of the deflected media and dust formed therefrom. Blast media effluent would literally pass through the water curtain and deflect off the support surface without being captured.
Accordingly, it is the primary objective of the present invention to provide a means for controlling the dust which is formed by blast cleaning a substrate in a relatively enclosed environment.
Another object of the present invention is to provide a means for dust containment and capture for use in an enclosed blast chamber which is relatively easy to manufacture, install and use.
Still another object of the present invention is to provide an improved process for blast cleaning articles within the confines of a blast chamber and whereby the dust formed during the blast cleaning process is readily removed from the environment of the operator and workpiece and eventually removed from the interior of the blast chamber.

Water screen for blast media dust containment


A transport and storage container for liquids, with a pallet-like underframe, an inner container of synthetic material with four side walls, a bottom wall and a top wall, and a closeable filler connection integrally formed on the top wall, and an outlet connection with a discharge fitting integrally formed in a lower portion of a side wall, an outer casing composed of vertical and horizontal grate rods or constructed as a sheet metal casing, and a removable protective cover of sheet metal or synthetic material fastened to the outer casing and provided with a central entry opening to the filler connection of the inner container which is closeable by a screw cap. Fastening eyes are integrally formed at the top wall of the inner container and slots are arranged in the protective cover for passing therethrough the fastening eyes when fastening the protective cover to the outer casing of the transport container, and securing elements for insertion through the fastening eyes of the inner container which protrude upwardly above the protective cover.

1. Field of the Invention
The present invention relates to transport and storage containers for liquids, with a pallet-like underframe, an inner container of synthetic material with four side walls, a bottom wall and a top wall, and a closeable filler connection integrally formed on the top wall, and an outlet connection with a discharge fitting integrally formed in a lower portion of a side wall, an outer casing composed of vertical and horizontal grate rods or constructed as a sheet metal casing, and a removable protective cover of sheet metal or synthetic material fastened to the outer casing and provided with a central entry opening to the filler connection of the inner container which is closeable by a screw cap (DE 38 19 911 C2).
2. Description of the Related Art
When these known transport and storage containers are filled with hot liquids and when the liquids subsequently cool, there is the danger that, under the influence of the negative pressure building up in the inner container, the top wall of the inner container of synthetic material is lowered to such an extent that the closing cover of the filler connection integrally formed with the top wall of the inner container can no longer be opened with a commercially available wrench. The danger of lowering of the top wall of the inner container also exists when an agitating mechanism is placed on the filler connection.

Transport and storage container for liquids


This invention relates generally to an apparatus for rotationally casting a portion of a tire, and, more specifically, to an apparatus that has a floating alignment mechanism that allows a portion of a mold to move in the radial direction of the tire, which is at least partially formed by the mold, allowing the molding apparatus to omit the use of tie bars. The mechanism may comprise two set of needle roller bearings that are orthogonally arranged to allow radial movement of a portion of a mold.

1. Field of the Invention
This invention relates generally to an apparatus for rotationally casting a portion of a tire, and, more specifically, to an apparatus that has a floating alignment mechanism that allows a portion of a mold to move in the radial direction of the tire, which it at least partially forms, allowing the molding apparatus to omit the use of tie bars.
2. Description of the Related Art
An emerging field in tire development involves the manufacture and use of non-pneumatic or hybrid tires that do not depend solely on gas to support the tire structurally as these tires are not prone to deflation, which can render standard pneumatic tires inoperable. An example of such a tire is disclosed by U.S. Pat. No. 7,201,194, which is commonly owned by the applicant of the present application. The content of this patent is incorporated herein by reference for all purposes in its entirety. In an exemplary embodiment of the '194 patent, the non-pneumatic tire includes an outer annular shear band and as plurality of web spokes that extend transversely across and radially inward from the annular shear band and are anchored in a wheel or hub. In certain embodiments, the annular shear band may further comprise a shear layer, at least a first membrane adhered to the radially inward extent of the shear layer and at least a second membrane adhered to the radially outward extent of the shear layer. In addition to the ability to operate without a required inflation pressure, invention of U.S. Pat. No. 7,201,194 also provides advantages that include a more uniform ground contact pressure throughout the length of the contact area. Hence, this tire mimics the performance of a pneumatic tire.
FIG. 1 shows such a tire that defines a radial direction R. For reference, all the reference numerals in the 100's used herein refer to the tire features while all reference numerals in the 200's used herein refer to a molding apparatus for making such a tire and reference numerals in the 300's used herein refer to a features of a floating mold alignment mechanism according to an embodiment of the present invention. The tire 100 comprises a tread 102 that is attached to the outward extent 104 of the spokes 106, which in turn, are connected to a hub or wheel 108 at their inward extent 110 by means known in the art such as by molding spokes between the hub 108 and the tread 102, which have been prepared for suitable bonding to the polyurethane. An outer annular band 105 is located between the outward extent of the spokes and the tread and an inner annular band 107 is found at the inward extent of the spokes, connecting them together. This inner annular band 107 can be used to attach the tire to a hub or wheel.
For the version of the tire 100 shown, the annular bands 105, 107 and spokes 106 are formed by pouring a polyurethane liquid into a rotational mold where the liquid is spread via centrifugation and then cured or hardened. It can also be seen that the spokes 106 are grouped in pairs and that the individual spokes 106′, 106″ within each pair are consistently spaced from each other and that each pair is spaced consistently from the adjacent pair around the circumference of the tire. The spacing within each pair and the spacing between each adjacent pair do not need to be the same. As described by the Abstract and col. 2, lines 28-41 of the '494 patent, the spokes 106 support the tire 100 in tension near the top of the tire 100 and not in compression. Instead, the spokes 106 at the bottom of the tire near the contact patch, which is where the tread 102 of the tire 100 contacts the road, compress or buckle easily. This helps the tire to simulate the pneumatic support function of a pneumatic tire.
Due to the sensitive and important function that the annular bands 105, 107 serve, i.e. to create the bond between the tread and the hub or wheel, as well as aesthetic concerns, it is desirable that the thickness of the bands remain constant. Looking at FIG. 2, mold cores 238″ found on a bottom mold half 234 are shown that form the spokes and inside surfaces 101 of the annular bands. These mold cores are drafted on the surfaces 237 that form the spokes themselves as mold cores coming from one side of the mold interarticulate with similarly configured mold cores coming from the other half (as better described later) so that the thickness of the spokes can remain constant even if there is draft present. However, these mold cores are undrafted on the surfaces 235 that form the inside surfaces of the annular bands. In the case of the inside surface of the outer annular band 105, the inside surface of the tread is substantially cylindrical, requiring that the inside surface of the outer annular band also be cylindrical to maintain the thickness of the annular band and to avoid aesthetic inconsistencies on the outer annular band from one side of the tire to the other. A similar situation exists for the inside annular band.
The depth of the mold cores is equal to or greater than 150 mm, which is a deeper draw than is typical. This added to the fact there are surfaces lacking draft means that the spokes are proned to stick often when demolding. This can cause distortion of the spokes and annular bands and/or undesirable and non-uniform appearance. Any misalignment of the mold halves in the radial direction further exacerbates this problem. Therefore, this problem could be helped if a high degree of mold alignment were present to make sure that movement of mold halves and their associated mold cores was purely translational as mold opening and demolding occurred. This could be facilitated by the use of traditional tie bars that connect the mold platens and guide their movement. However, the molding press and associated platens are designed to open rotationally, about the vertical and horizontal axes, as well as translate for opening and closing the mold. This wide range of movement in addition to the desire to have free access to the interior of the mold for accessing its components as well as a tire being made therein make the use of such tie bars impractical. In addition, the lack of tie bars means that mold platens and mold halves may be misaligned, which during demolding, can cause distortion of the spokes of the tire.
Consequently, damage to the tine often occurs. Accordingly, it is desirable to find an apparatus that allows such tires to be manufactured using mold cores with surfaces that are undrafted using some sort of alignment mechanism. It would be particularly useful if such an apparatus could be designed without the use of tie bars. Finally, providing means allowing adjustment or movement of a mold half in the radial direction of the tire would be helpful.

Apparatus for casting a non-pneumatic tire having a floating mold alignment mechanism

Compagnie Generale des Etablissements Michelin


A light source portion having laser light sources emitting red light, green light, and blue light and conventionally disposed integrally with the liquid crystal display panel is spatially separated from the liquid crystal display panel. Accordingly, the power supply, the optical system, and the heat source are incorporated into the light source portion and are thereby completely separated from the liquid crystal display panel. A laser beam emitted from the light source portion is guided to the liquid crystal display panel via a fiber. In this manner, it is possible to achieve a liquid crystal display device capable of significantly reducing the liquid crystal display panel in thickness and weight.

Among the liquid crystal display devices, active matrix liquid crystal display devices have been used frequently as a display device for a personal computer or as a display device for a liquid crystal television. Moreover, the size of the screen has been increasing rapidly for such applications. Further, regardless of the size of the display screen, a high definition display in the wide color reproduction range at a high image quality is required for the active matrix liquid crystal display device. These are required in order to ensure superiority in competitiveness over other display devices, such as a plasma display panel (PDP). In addition, less power consumption is required at the same time.
The active matrix color liquid crystal display device displays a full-color image by providing red (R), green (G), and blue (B) color filters on sub-pixels forming each pixel and allowing white light from the backlight illumination device to pass through these filters. In short, a full-color image is displayed by forming each pixel by combining three sub-pixels for R, G, and B. Light conversion efficiency of the backlight illumination device is low and the rest of input power turns into heat. The heat sink portion therefore increases in size.
With the aim of not only expanding the color reproduction range but also extending the life, a backlight illumination device using a plurality of light emitting diodes (LEDs) for colors including three primary colors, red light (R light), green light (G light), and blue light (B light), is now put into practical use instead of the conventional backlight illumination device using a cold cathode fluorescent tube. Because the light emitting diode can expand the color reproduction range in comparison with the cold cathode fluorescent tube, it is possible to achieve a liquid crystal display device with a higher image quality.
However, in a case where the LED light source emitting light of at least three colors including R light, G light, and B light is used, a luminescent color varies from one LED to another. For example, the same G light may take on a reddish luminescent color or bluish luminescent color depending on the LEDs. Also, the luminescent color from the same element may possibly vary due to factors, such as a driving current and temperature characteristics. In the case of a full-color display using LEDs for R light, G light, and B light as described above, it is difficult to maintain the chromaticity of the while level constant. Further, although it is possible to adjust the chromaticity of the white level at a point in time when a liquid crystal display device is manufactured, the white level changes with a variation in deterioration with time over a long period.
Furthermore, in a case where the LEDs are used, the luminous wavelength and a light output vary with heat generation by the LEDs. Accordingly, even when the luminance and the tones are adjusted once, the luminance and the tones may possibly vary again after the adjustment. Deterioration with time can also give rise to such variations. Under these circumstances, there has been proposed a configuration in which a semiconductor laser element suitable to a high output at higher luminance than LEDs is used as a light emitting element for at least any one of the colors among the three colors of the light emitting elements, so that variations of the characteristics can be lessened by suppressing heat generation caused by an increase of the driving current. This first example concretely describes the use of a red semiconductor laser (for example, Patent Document 1).
In the first example, however, when adopting the conventional method of using a fluorescent tube or LEDs as the light source, because the light source is disposed behind or on the side of the panel and the light source is driven in this state, the thickness and the weight including those of the liquid crystal display panel are added. Also, input power that turns into heat without being converted to light is large. Hence, the heat radiation structure is required and the thickness and the weight of this structure are added, too. The liquid crystal panel is vulnerable to heat and it has to be spaced apart from the light source (lamp and LEDs), which is a heat generator. The device is thus increased in size.
Further, the first example above describes the use of a red semiconductor laser as the light source in the backlight illumination device. However, it fails to disclose any concrete configuration or the like. Hence, with the use of the red semiconductor laser, it is possible to lessen variations of the characteristics by suppressing heat generated caused by an increase of the driving current. However, no measure is taken against a size increase of the device itself. In addition, the main configuration of the first example above is to use the LEDs as the light source, and in a case where laser light sources for three colors including R light, G light, and B light and a white light source are used as the light source, a problem that the liquid crystal display panel becomes thicker and heavier still remains.
For a liquid crystal display system constituted by combining the liquid crystal display devices as described above into a system form, there has been a need for a larger screen and a higher image quality as it is now used not only as a display device for a personal computer but also as a television. Such a liquid crystal display system uses a planar light source device that illuminates the liquid crystal display panel from behind. A cold cathode fluorescent tube is often used as the light source of the planar light source device. In the case of a method adopting a cold cathode fluorescent tube, however, there is a problem that the display performance of the liquid crystal display system is deteriorated by heat generated from the cold cathode fluorescent tube. Also, there has been a need for a further higher image quality arising from an increasing demand as a television receiver in recent years, and the configuration using light emitting diodes (herein after, abbreviated as LEDs) as the light source is coming into practical use.
In order to avoid adverse influences of heat generation, there has been proposed a liquid crystal display system configured in such a manner that the liquid crystal display panel is illuminated by a backlight formed of a light source having, for example, a cold cathode fluorescent tube, a first light guide body forming a planar light source and having a wedge-shaped cross section, a second light guide body provided to the end face portion of the first light guide body to supply illumination light to the first light guide body, and an optical fiber connecting the light source and the second light guide body (for example, see Patent Document 2). Different from the conventional configuration, the second example prevents influences of heat generation from the cold cathode fluorescent tube and noises generated by application of a high-frequency voltage by connecting the cold cathode fluorescent tube and the first light guide body with the optical fiber.
Also, there has been proposed a planar light source device using a light guide plate having a wedge-shaped cross section in order to achieve a reduction of the device both in size and weight by reducing an invalid region inside the light guide plate even when a point source like LEDs is used (for example, see Patent Document 3). The planar light source device using the LEDs as in the third example can achieve satisfactory color reproducibility and a high image quality in comparison with those using the cold cathode fluorescent tube.
In addition, a planar light source device that achieves a higher image quality by using not only the LEDs for red light (R light), blue light (B light), and green light (G light) but also LEDs emitting light of other colors is coming into practical use. Further, a planar light source device in which a part of the LEDs are replaced with a semiconductor laser element is being discussed. This fourth example utilizes that the semiconductor laser element has higher luminance and a higher output than the LEDs and is thereby capable of reducing driving power and enhancing the image quality (for example, see Patent Document 1).
In addition, there has been disclosed an image display system configured with the aim of achieving large-screen display on the one hand and reducing the weight of the device on the other hand (for example, see Patent Document 4). The system of the fifth example is formed of a plurality of liquid crystal modules each including a liquid crystal panel and generating a partial image making up a part of an image, a screen that displays thereon the partial images generated by a plurality of the liquid crystal modules, and a light supply portion that supplies light to the liquid crystal panels of a plurality of the liquid crystal modules. It is configured in such a manner that light is supplied to the liquid crystal modules from the light supply portion via optical fiber cables. A projection-type display system with a large screen can be achieved by the configuration as above.
According to the second example described above, it is possible to prevent influences of heat generation from the cold cathode fluorescent tube and noises generated by application of a high-frequency voltage. It is, however, relatively difficult to further improve the image quality by expanding the color reproduction range. In addition, the method of guiding light emitted from the cold cathode fluorescent tube to the light guide body via the optical fibers has a difficulty in transmitting light at high intensity. This method is therefore not applicable to the liquid crystal display system with a large screen.
Also, according to the third example described above, not only can the color reproduction range be expanded but also the life can be extended. However, in a case where the LED light source that emits light of at least three colors including R light, G light, and B light, there are problems as follows. That is, because a luminescent color varies from one LED to another, for example, the luminescent color of the same G light may take on reddish color or bluish color depending on the LEDs. Also, the luminescent color of the same LED may possibly vary by factors, such as a driving current, temperature characteristics, or deterioration with time. Accordingly, even when the luminance and the tones are adjusted at the initial stage, the luminance and the tones vary after the adjustment or in use. It is therefore difficult to maintain the chromaticity of the white level constant over a long period.
Further, because the second and third examples adopt the method in which the liquid crystal display panel is illuminated by disposing the cold cathode fluorescent tube or the LEDs behind or on the side of the panel, influences of the thickness and the weight of the light source to the overall device become more significant as the screen of the liquid crystal system becomes larger. In addition, because the heat radiation structure is also necessary, the thickness and the weight increase further. These inconveniences impose the limitations on the further reduction in thickness and weight.
The fourth example described above also discloses the configuration to lessen variations of the characteristics by suppressing heat generation caused by an increase of the driving current with the use of the semiconductor laser element suitable to a high output at higher luminance than LEDs, and the use of a red semiconductor laser as the semiconductor laser element is described concretely. However, this example neither discloses nor suggests a concrete configuration of the device or the like. Accordingly, although it is possible to lessen variances of the characteristics by suppressing heat generation caused by an increase of the driving current with the use of the red semiconductor laser, no measure is disclosed against a size increase of the device itself.
Further, the fifth example above is configured in such a manner that a plurality of liquid crystal panels are illuminated from the light supply portion via optical fibers and thereby achieves a projection-type display system capable of increasing a size of the screen on one hand and reducing the weight on the other hand. However, the fifth example is applied to the projection type and it is difficult to apply this example to a direct-view-type liquid crystal display system that is used frequently in general. Accordingly, problems arising when increasing a size of the screen on one hand and reducing the weight on the other hand still remain in the direct-view-type liquid crystal display system.
Also, the fifth example above is configured in such a manner that the light source portion is basically disposed inside and integrally with the device. A configuration to completely separate the light source portion and the liquid crystal display unit is not disclosed, and naturally, there is a limit of reducing the thickness and the weight of the device. Further, there is no disclosure about a liquid crystal display system configured in such a manner that illumination light is supplied to a plurality of liquid crystal display units from one or two light source portions. A further discussion is therefore necessary in order to achieve a system that supplies illumination light to the liquid crystal units that are reduced both in thickness and weight from one or two light source portions.    Patent Document 1: JP-A-2005-64163    Patent Document 2: JP-A-11-167808    Patent Document 3: JP-A-2006-134661    Patent Document 4: JP-A-9-159985

Liquid crystal display device and liquid crystal display system


A color identifying device includes a mount block, a color detector, a lens and a color identifier. A reactive board having a plurality of surfaces to be measured in respective predetermined positions is mounted in the mount block. The color detector has a plurality of color measuring areas corresponding respectively to the reaction surfaces of the reactive board mounted in the mount block. The lens forms images of the surfaces of the reactive board mounted in the mount block on the respective color measuring areas. The color identifier identifies the colors of the surfaces based on output signals from the corresponding color measuring areas.

1. Field of the Invention
The present invention relates to a color identifying device and a gas identifying device, and more particularly to a color identifying device for identifying colors of reaction surfaces which are produced by a chemical reaction and a gas identifying device.
2. Description of the Related Art
There have heretofore been known gas detecting devices for causing a chemical reaction between a gas such as a toxic gas and chemical reagents to change the colors of the chemical reagents. For example, U.S. Pat. No. 6,228,657B1 discloses an M256 chemical agent detection kit.
The gas detecting device includes a plurality of ampules containing respective chemical reagents of different types and a plurality of mediums (reaction surfaces). When the ampules are crushed, the chemical reagents contained therein flow into the mediums.
The chemical reagents, as they flow into the mediums, chemically react with a gas that is held in contact with the mediums. The chemical reaction causes the chemical reagents to change their colors, and the mediums also change their colors depending on the color changes of the chemical reagents.
The user of the gas detecting device introduces different chemical reagents into the respective mediums, and recognizes the concentration of the gas based on the color changes of the mediums.
There are also known color identifying devices in the art. The user can objectively determine the colors of the mediums (chemical reagents) of the gas detecting device by using a color identifying device to identify the colors of the mediums.
One known color identifying device has three photodetectors and three optical filters associated respectively with the photodetectors.
If it is assumed that the photodetectors produce respective outputs X, Y, Z, then the color identifying device calculates values x=X/(X+Y+Z), y=Y/(X+Y+Z), and z=Z/(X+Y+Z). Of these values x, y, z, two, e.g., the values x and y, are plotted on a chromaticity diagram, and a color is determined from the position of the values on the chromaticity diagram.
U.S. Pat. No. 6,228,657B1 also reveals a reader device for outputting a signal depending on the color of a measuring surface (medium) using three photodiodes or a single color CCD sensitive to the colors of R, G, B (red, green, and blue).
The conventional color identifying device can measure the color of one medium only in one measuring cycle. If the user uses the conventional color identifying device to measure the colors of a plurality of mediums, then the user have to measure the colors of the mediums separately.
If the reader device revealed in U.S. Pat. No. 6,228,657B1 is used to measure the colors of a plurality of measuring surfaces at a time, the reader device needs to have three photodiodes or a single color CCD for each of the measuring surfaces. Consequently, as the number of measuring surfaces to be measured at a time increases, the number of photodiodes or color CCDs used also increases, resulting in an increased number of parts of the reader device.

Color identifying device for identifying colors of reaction surfaces produced by chemical reaction and gas identifying device


In an electronic circuit, a first circuit region is electrically connected to an input circuit region of an isolated switching power source, and a second circuit region is electrically connected to an output circuit region thereof. A driver of an IC is located in the second circuit region and drives a target device based on output power supplied to the second circuit region via the output circuit region from the isolated switching power source. A transferring module of the IC transfers a value of a parameter indicative of the output power from the second circuit region to the first circuit region while maintaining electrical isolation between the first and second circuit regions. An operating module of the IC performs on-off operations of a switching element to perform feedback control of the value of the parameter indicative of the output power to a target value.

There are known isolated switching power sources, an example of which is disclosed in Japanese Patent Application Publication No. 2011-244619. An isolated switching power source disclosed in the Patent Publication is comprised of a transformer that partitions the circuit region of the isolated switching power source into an input circuit region in which a power source lies and an output circuit region while the input circuit region is electrically isolated from the output circuit region. The isolated switching power source is designed to transfer power output from the power source to the output circuit region. Specifically, in addition to the transformer, the isolated switching power source is comprised of a control circuit designed specifically therefor. The control circuit performs feedback control of an output value, such as an output current value from the isolated switching power source, which adjusts the output value to a target value.

Electronic circuit operating based on isolated switching power source


A tool for installing threaded parts with lock nuts onto a machine is disclosed. The tool includes an outer tube and an inner mechanism that rotate together or independently using cogs. When the outer tube and inner mechanism rotate together, the threaded part is tightened onto a machine. When the outer tube and inner mechanism rotated independently, the lock nut is tightened onto the threaded part.

The ability to insert specific parts onto a machine where there is not much room or where it may be dangerous for a person to reach is important. Specifically, when inserting a sharp part on a machine in a hard to reach place, the user needs to be protected from injury. One way to do this is to use a tool that gives the user the ability to extend his or her reach while installing the specific part. However, the tool may not orient the part properly on the machine or securely tighten a lock nut on the part.
For example, the fluid injection machine described in U.S. Pat. No. 6,848,376 includes many sharp injection knives on its fluid distribution disc. The injection knives penetrate the ground and inject specialized fluids, such as fertilizer, into the soil. These injection knives are arranged close together and in a specific orientation around the entire circumference of the fluid distribution disc. The knives must be oriented in such a way that the correct side of the blade comes into contact with the ground so that the fluid is properly injected and the knife does not snap off when entering the ground. With the knives in this configuration, it is difficult to reach toward the back of the fluid distribution disc and install or replace a knife. Not only is it out of reach, but also the knives are sharp and could cause an injury. Additionally, it is important that when installing the knife and its corresponding lock nut, the installation tool should not cause the knife to rotate out of its proper orientation. A long installation tool that aids in threading the knife onto the fluid distribution disc and holds the knife in place while tightening its corresponding lock nut would provide an easy and safe way to install or change a knife without causing injury, and while still allowing the knife to be securely fastened to the fluid distribution disc in the proper orientation.
Currently, there are tools that allow a user to extend his or her reach when inserting a part on a machine. But each of these tools suffers from several disadvantages. First, the tools do not allow a part to be properly oriented on a machine. Second, the tools do not allow a lock nut to be independently tightened on the part with the same tool.
Presently, there is no installation tool that allows a part to be properly oriented on a machine and allows a lock nut to be independently tightened on the part with the same tool. For the foregoing reasons, there is a need for a tool that would allow a person to use an installation tool that properly orients a part on a machine and independently tightens a lock nut.

Tool for installing threaded knives with lock nuts


In a high field magnetic resonance imaging apparatus and a method for obtaining signals having a high signal-to-noise ratio with the receiving coil thereof, the apparatus has at least a basic magnet and a receiving coil, the basic magnet generating a basic magnetic field, and the receiving coil being disposed within the basic magnetic field and forming an accommodating cavity. The accommodating cavity of the receiving coil is perpendicular to the direction of the basic magnetic field and is positioned in the field of view of the apparatus. The receiving coil is a loop type coil. The apparatus can further have a bracket for fixing the receiving coil. In the method, a receiving coil is used to receive signals in a magnetic field, wherein the receiving coil is perpendicular to the direction of the magnetic field. By using the apparatus and the corresponding method since the receiving coil can have a loop type design, the signal-to-noise ratio is increased. Moreover, the receiving coil can be disposed at a position closer to the center of the field of view, so that the imaging quality is improved.

1. Field of the Invention
The present invention relates to a magnetic resonance imaging (MRI) apparatus, and particularly to a high field magnetic resonance imaging apparatus and a method for obtaining a high signal-to-noise ratio by a receiving coil thereof.
2. Description of the Prior Art
Magnetic resonance imaging is an imaging technology for obtaining the internal structural information of an object by means of the magnetic resonance phenomena. MRI is broadly used in the field of medical imaging due to its significant advantages, such as a large number of imaging parameters, high resolution, tomography in any layer required, non-destructive imaging, etc.
In a middle or low field MRI apparatus (basic magnetic field=0.5T), the direction of the basic magnetic field is perpendicular to the patient's limb in a receiving coil. A radio frequency (RF) receiving coil is usually a loop (i.e. loop type) coil, such as a single loop coil shown in FIG. 1, or a solenoid coil shown in FIG. 2 or a Helmholtz coil pair, etc. In a high field MRI apparatus (basic magnetic field=1.5T), since the patient's limb is parallel to the horizontal direction of the basic magnetic field, the RF receiving coil can only have a cage type or a surface loop coil structure, and the receiving coil of the surface loop coil structure is shown in FIG. 3. However, in practical applications, the signal-to-noise ratio (SNR) achievable by an RF receiving coil of the cage type or the surface loop structure is lower than that of a loop type RF receiving coil.
FIG. 4 shows a schematic view of the example of a wrist coil used in a high field MRI apparatus in the prior art. FIG. 5 shows a case of the application of the magnetic resonance imaging to a patient's wrist in the prior art, wherein the patient is lying on a bed 503 with the wrist to be scanned in a receiving coil 502, and the receiving coil 502 is positioned beside the patient's body and within the magnetic field generated by a basic magnet 501. FIG. 6 shows another case of the application of the magnetic resonance imaging to a patient's wrist in the prior art, wherein the patient is lying on a bed 603 with the wrist to be scanned in a receiving coil 602, and the receiving coil 602 is positioned beyond the patient's head and within the magnetic field generated by a basic magnet 601.
It can be clearly seen from FIGS. 5 and 6 that the patient's limb is parallel to the horizontal direction of the basic magnetic field, so the wrist coil can only have a surface loop coil, so its SNR is lower than that of a loop type wrist coil.
Moreover, in the case as shown in FIG. 5, since the patient's limb is placed flat beside his or her body, the wrist coil is nearly beyond the field of view (abbreviated as FOV) of the MRI apparatus. In the case as shown in FIG. 6, the receiving coil 602 and the patient's wrist are positioned beyond and to one side of the patient's head. Although the location of the receiving coil 602 in the case as shown in FIG. 6 is slightly better than that of the receiving coil 502 shown in FIG. 5, it is still not ideal, and the patient in this position is not comfortable, therefore it is not suitable to keep this position for a long time.
Generally, the MRI apparatus and method in the prior art have the following disadvantages:
1) due to the differences in the relationships of the patient's limb with the direction of the basic magnetic field and the manners of positioning the receiving coil between a middle or low field MRI and a high field MRI, a loop type receiving coil cannot be used in an current high field MRI apparatus;
2) the receiving coil for a high field MRI apparatus can only be of a case type or a surface loop structure, which cannot achieve a high SNR;
3) the specific position of a wrist coil is nearly beyond the FOV of the MRI apparatus; and
4) the specific position of the wrist coil affects the comfort of a patient when having an MRI operation.

High field magnetic resonance imaging apparatus and method for obtaining high signal-to-noise by its receiving coil


The present invention includes a plurality of lead terminals made of a conductive material having spring elasticity; and insulative housing that buries a part of the region of lead terminal and fixedly retains a plurality of lead terminals in an arrangement having been set in advance. Lead terminal is composed of a buried part that is a part of lead terminal buried in housing; bottom end joint that is extended from one end of the buried part, is exposed through bottom end surface of housing, and extracted in width direction of bottom end surface; and flexibly changing part that is exposed from another end of the buried part through one wall surface orthogonal to bottom end surface, and is extended along this wall surface to top end surface facing to bottom end surface, being spaced from wall surface and top end surface.

1. Field of the Invention
The present invention relates to a board connecting component (hereinafter, referred to as "board connector") that connects a plurality of boards mounting electronic parts such as semiconductor devices (hereinafter, referred to as "IC") and chip parts, and to a three-dimensional connecting structure using the board connector.
2. Background Art
Conventionally, a board connector for connecting between boards such as module boards mounting electronic parts such as ICs and chip parts uses a multi-contact connector composed of plug and socket parts, or a pin connector with a plurality of contact pins fixed through a resin spacer.
FIG. 10 is a sectional view showing a makeup in which two pieces of module boards 110 and 120 are connected by means of conventional pin connector 100. Pin connector 100 is composed of resin spacer 102; and a plurality of metal contact pins 104 fixed through this resin spacer 102. Meanwhile, module board 110 is formed with circuit pattern 114 on one surface of wiring board 112, and a given position of the circuit pattern 114 mounts electronic parts 116 such as chip parts and ICs thereon. In the same way, the other module board 120 is formed with circuit pattern 124 on one surface of wiring board 122, and a given position of the circuit pattern 124 mounts electronic parts 126 such as chip parts and ICs thereon.
Connection between module boards 110 and 120 using pin connector 100 is made as follows: That is, first position metal contact pin 104 of pin connector 100, with respective circuit patterns 114 and 124 of module boards 110 and 120. Next have the top and bottom ends of metal contact pin 104 penetrate respective circuit patterns 114 and 124. Then, join circuit pattern 114 and the bottom end of contact pin 104 together; and circuit pattern 124 and the top end of contact pin 104, respectively, at soldering joint 128 with solder. This completes connection between module boards 110 and 120 using pin connector 100.
Meanwhile, with reduction in size and weight and with higher functionality, of mobile devices and the like, the number of contact terminals between module boards tends to increase. Accordingly, a connector as a board connector needs to be smaller in area per one contact terminal, and thus the effort is being made to reduce the pitch of contact terminals of a pin connector.
However, in the connection method by a pin connector, a large stress is added to the joint of a pin connector with the difference in fluctuation in size due to temperature change between members composing the joint, or with an external impact force. Accordingly, a structure for absorbing such a stress is being studied.
Japanese Patent Unexamined Publication No. H06-310195, for example, shows the following connecting structure. That is, as a result that module boards 110 and 120 are connected together as shown in FIG. 12, using pin connector 130 as shown in FIGS. 11A and 11B, a stress due to thermal expansion of resin spacer 132 and others is absorbed. FIG. 11A is a plan view of the structure, and FIG. 11B is a sectional view of the structure as has been cut in a longitudinal direction. FIG. 12 is a sectional view showing a state in which module boards 110 and 120 are connected together using this pin connector 130.
A plurality of metal contact pins 134 vertically penetrating are insert molded and fixed to resin spacer 132 of this pin connector 130. Further, as shown in FIG. 11B, both the right and left ends of the bottom surface of pin connector 130 have flexible elastic piece 136 projecting obliquely downward.
As shown in FIG. 12, two pieces of module boards 110 and 120 are connected using this pin connector 130. The concrete procedure is as follows: That is, first have the top and bottom ends of metal contact pin 134 penetrate circuit patterns 114 and 124, respectively. Then, join the top end of contact pin 134 and circuit pattern 124; and the bottom end of contact pin 134 and circuit pattern 114, respectively, at soldering part 128 with solder. In this case, downside module board 110 is fixed so as to touch flexible elastic piece 136 on the bottom surface of resin spacer 132.
This makeup allows, even if resin spacer 132 of pin connector 130, and module boards 110 and 120 thermally expand due to heat generated by electronic parts 116 and 126 mounted on module boards 110 and 120, or the change in the ambient temperature, a stress generated thereby to be absorbed by flexible elastic piece 136. As a result, a stress is not added to soldering part 128 even if board connector 130 is heated by electronic parts 116 and 126 or the high ambient temperature, retaining a stable soldering condition. Here, flexible elastic piece 136 may be provided on the top surface of resin spacer 132, in addition to the bottom surface.
However, mobile devices have significantly higher functionality in recent years, further increasing the number of terminals of a connector, and strong devices against a drop impact and the like have been demanded as well. To cope with this matter, in the connecting structure with the above-mentioned pin connector, through-holes are provided on the module board, which is connected to the circuit pattern by having contact pins penetrate the through-holes, and a flexible elastic piece absorbs a heat stress as well. However, such a structure, although a thermal stress can be absorbed, disables circuit patterns or electronic parts to be implemented in a connection region and also makes it difficult to narrow the connection pitch.
An object of the present invention, for solving such a problem, is to provide a board connector capable of fine-pitch connection, with a highly reliable connection part against a drop impact and the like; and three-dimensional connecting structure using the board connector.

Board connecting component and three-dimensional connecting structure using thereof

Matsushita Electric Industrial Co., Ltd.


Arrangement for taking a CT scan and a SPECT scan of a patient in a single-pass diagnostic procedure. A SPECT scanner and a CT scanner are included. The SPECT scanner is mounted on a SPECT gantry and the CT scanner is mounted on a CT gantry. The SPECT and CT gantries are moveable with respect to one another between a mated operating configuration and a separated maintenance configuration. A pair of receiving brackets is fixedly mounted on the SPECT gantry. A pair of self-locating brackets is fixedly mounted on the CT gantry. Each of the pair of self-locating brackets is configured for assuming a prescribed position relative to a respective one of the pair of receiving brackets when in snug abutment together. A floating connection interconnects the CT scanner with the pair of self-locating brackets, and in this manner float-mounts the CT scanner with the SPECT scanner and facilitates the taking of the CT scan and a SPECT scan of a patient in a single-pass diagnostic procedure.

1. Field of the Invention
The present invention relates to systems and methods used in radiation imaging; and more particularly, to a linked combination of a CT scanner and a SPECT scanner for producing substantially simultaneous images from each scanner of a patient undergoing diagnostic analysis.
2. Description of the Background Art
Both Computed Tomography (CT) scanning and Single Photon Emission Computed Tomography (SPECT) scanning are well-known diagnostic tools for imaging internal portions of a patient. Conventionally, each of the two scanning procedures have been conducted independently using two separate station setups, each requiring its own scan process of the patient.
In view of desires to boost utilization of the two scanning arrangements and to economize staff and patient time, a need has been recognized for a one-pass procedure in which both scanning processes can be accomplished on the patient at substantially the same time, and preferably each of the two images will be complementary to one another for developing comprehensive internal images of the patient.

Releasably interconnected CT and SPECT scanners


A circuit configured to sample a signal of a source circuit and to provide calibration signals to a testing device of the signal sampled from the source circuit. The circuit may include an amplifier, a sampling circuit, and a calibration circuit. The amplifier may be configured to drive signals on an internal node to the testing device. The sampling circuit may be configured to provide a sample of a signal from the source circuit to the internal node. The calibration circuit may be configured to provide a first calibration signal and a second calibration signal to the internal node. The second calibration signal may be a known proportion of the first calibration signal.

A testing device, such as an oscilloscope, may be used to view or analyze analog and/or digital signals in a source circuit. For example, the testing device may be used to determine an eye opening of a signal at a receiver to measure the integrity and other aspects of the signal.
In some circumstances, the testing device may be electrically coupled to a signal interface circuit that samples a signal. The signal interface circuit may include various circuit elements that may change the sampled signal before it is transmitted to the testing device. For example, the circuit elements may amplify, degrade, or otherwise change the sampled signal. In some circumstances, to allow for more accurate viewing and/or analyses of the sampled signal from the signal interface circuit, the testing device may be calibrated to account for changes to the sampled signal.
The subject matter claimed herein is not limited to embodiments that solve any disadvantages or that operate only in environments such as those described above. Rather, this background is only provided to illustrate one example technology area where some embodiments described herein may be practiced.

Signal sampler with a calibration circuit


Embodiments relate to finding correlations between periods of performance degradation of an application and failure rates of the application. Telemetry data reports results of operations performed by the application. The telemetry data is parsed to identify periods of performance degradation of the operations. Performance measures of successful operations during an identified period are aggregated, and performance measures of failed operations during the identified period are aggregated. For the identified periods, conclusions about positive and negative correlation between failures of the operation and degraded performance of the operations are derived based on the aggregate measures of success and failure and based on rates of failure of the operation during the periods.

For most software applications, achieving optimal speed is a never-ending goal of users, developers, and administrators. Speed is particularly important for interactive applications, where users must wait for tasks to complete before proceeding with their activities. Slow software components may also have collateral effects such as disrupting carefully designed workflows. Furthermore, software slowdowns may result in underutilization of expensive hardware resources. For instance, a processor waiting for a failed operation to timeout may be idle while other work is queued and waiting to be executed. In addition, poor performance may prevent some applications from completing within practical time limits, for example applications that process large datasets or that perform long-running compute-intensive algorithms.
One way that software performance can be improved is by analyzing diagnostic data such as telemetry logs. However, the complexity of applications and the voluminous amounts of telemetry data that can be generated by even a single application make it difficult to tease performance-relevant insights out of telemetry data. A period of poor performance might be evident in a stream of telemetry data, but the cause, if any, is often hard to diagnose. Many factors can influence performance of software, and variation in data being processed can invoke different execution paths and produce varying execution times. External components supplying necessary data may be lagging.
Developers are naturally interested in performance problems that are caused by software failures or errors that may appear in an application's telemetry data. However, isolating intrinsic causes from extrinsic causes is difficult. As noted above, a performance problem may have multiple potential causes. Furthermore, failures and performance can be positively and negatively correlated. That is, in some cases, failures might improve performance, and in other cases failures might decrease performance. Even a same type of failure might improve performance under some conditions (e.g., specific input data, time of day, external factors) and might harm performance under other conditions. It is also possible for a given type of failure to have no effect on performance.
There have been many techniques used to identify performance problems, and many methods have been employed to identify software failures. However, as observed only by the inventors, there is an unmet need to be able to understand, within a well-defined telemetry stream, the causal relationship between fluctuations in a rate of a particular application failure and detected periods of performance degradation of the application. It may be desirable to know whether a rate of a given failure in telemetry data is positively correlated with a specific performance degradation, whether it is negatively (inversely) correlated, or whether it is not correlated at all. Techniques for correlating failure rates and performance degradations are discussed below.

Correlating failures with performance in application telemetry data


A microgrid with a high voltage direct current (HVDC) source for efficiently and safely distributing power to decentralized loads includes: at least a main HVDC power supply connectable in input to an AC grid and in output to a main DC distribution network and loads system in output, the main HVDC power supply having energy reserve means and a main switch-based fault isolator or main FI, the main DC distribution network and loads system including: a maintrunk bus, and subtrunks buses and/or front end local loads cells connected in parallel to the maintrunk bus, and at each branching of a subtrunk bus and a load or of a subtrunk bus of rank n−1 and a subtrunk bus of rank n, a local switch-based fault isolator or local FI, n being an integer comprised in the range [1, N]. A smart main controller including microcontrollers for smart operation is also included.

However the invention is also targeting any power distribution system in telecom field in general, IT field or power energy distribution in a microgrid with renewable sources and multiple loads set at different locations.
In the frame of the present application, the property of resilience will qualify power grids or networks infrastructure and operations characteristics such as strength and ability to make a fast recovery, which helps the grid or network to minimize or altogether avoid disruptions during and after a fault event.
Modern telecom operators see a dramatic increase of their energy consumption and the introduction of 5G technology is still expected to strengthen this tendency.
At the time our societies develop greater concern for environment and energy saving, increased demand for grid connectivity oppositely boosts energy consumption. Concurrently, the power consumption also tends to be offset toward the edge of the network where active equipment is decentralized.
In this context, power grids face multiple problems that all impact their reliability, quality and resilience. Consequently, telecom infrastructures cannot be deployed without equipment specifically aimed to provide quality power and backup. Having power resources in remote locations poses multiple challenges for operation and maintenance. Remote locations are expected to face harsh environments, to be hard place to get and, in metropolitan areas, to be submitted to various restrictions for installation.
Telecom operators get premium reward when first offering new services. Revenue generation is impacted for a long time. Quick deployment at low CAPEX is a key to catch the early mover revenue. Therefore, scalable solutions, pay-as-you-grow and expandability can play a major role to optimize the capital investment. While operating in traditional ways, power gets stranded because it is common to overprovision power resources and equipment. The capacity of reclaiming stranded power enables an organization to better use the initial capital investment and postpone the construction of ramifications.
Nowadays telecom networks additionally intend to become software-centric. The transformation is already underway implementing virtual functions to run on commodity hardware. Moreover, future power backup systems must be smart enough to cope with the actual workload constantly changing and moving within the infrastructure. Making software-defined communication infrastructures brings flexibility and effectiveness in network operation. It makes perfect sense to apply a same logic to power equipment and bring agility to power generation and storage. By pooling the points of generation and the storage capacities under the control of a management software it becomes possible to optimize the power infrastructures in regard to their location, time of use and efficiency.
Microgrid demonstrations and deployments have shown their ability to provide higher reliability and higher power quality than utility power systems as well as improved energy utilization. Smart grids also enable a more efficient use of electricity, shaving losses incurred during delivery and encouraging more efficient energy behavior by customers.
Combining microgrid infrastructures with the latest developments in energy conversion should allow to face sustainability challenges of next generation telecom networks along with the power availability and the infrastructure flexibility that are required to run reliable and profitable business.
In particular wireless 5G technology for telecommunication services is the new standard to guarantee broadband (up to 10 Gbps) and low latency (less than 5 ms). It will require to increase frequencies (e.g. from 26 GHz to 300 GHz), using millimeter waves. They offer much higher flowrate than present lower frequency waves (e.g. 4G, etc.), but their range is shorter and their penetration rate is quite poor. A wall or a rain downpour is enough to slow them down. In order to obtain good network coverage, it will therefore be necessary to multiply antennas (small cells) to circumvent obstacles, the latter being located for example on the roof of buildings or on lighting poles. Moreover, the antennas will be directional, that is to say capable of focusing directly on a mobile phone in order to send, for example, a video, so as to be more efficient and less energy consuming. These antennas will also be able to manage a large number of connections at the same time, without saturation.
However deploying radio transmitters at the edge of telecom networks and distributing power at high DC voltage will also induce some safety challenges. Usual mid-point grounding and fault detection by leakage measurement provide solutions that impede proper operability of the deployed systems: too many interruptions of service, no way to rapidly locate the fault, high MTTR, etc.
The applicant of the present application designs, manufactures and markets a range of products for industrial operators with mission critical applications, who are not satisfied with existing AC backup systems performances and related maintenance costs.
In particular, the applicant already markets the so-called ECITM module (for Enhanced Conversion Innovation) that is an energy router that offers an innovative AC backup solution that is unlike other UPS's (patent family of U.S. Pat. No. 8,044,535, B2)
To better allocate power resources and dispatch the power from wherever it is available to wherever it is most needed, the applicant has developed this energy router providing facility managers and microgrid design engineers with a tool for directing the power under the control of dedicated software means as power generation and demand vary.
Additionally, the applicant already markets the so-called "Power Fusion" concept that proposes a similar infrastructure based upon microgrid topology to power up datacenters and reduce dramatically the stranded power (patent family of WO 2018/210917 A1).
Document US 2011/0279939 A1 discloses an electrical circuit comprising a power supply, a load, first and second trunks disposed there between and control means adapted to control the electrical status of the first and second trunks, in which the control means comprises monitoring means adapted to monitor the current and/or voltage of the first and second trunks and to detect current and/or voltage events which are indicative of faults occurring thereon, and isolation means adapted to isolate the first or second trunk when the monitoring means detects a current and/or voltage event which is indicative of a fault occurring thereon, in which the first and second trunks are electrically connected and arranged in parallel such that the power supplied to the load is distributed substantially equally between them, and in which the control means comprises compensation means adapted to prevent the isolation means from isolating one of said first or second trunks when a current and/or voltage event which is indicative of a fault occurs thereon which is caused by a fault occurring on the other of the first or second trunks.

Safe and resilient energy distribution for a highly efficient microgrid