A invention relates to a ceiling element (1) for a ceiling (D) consisting of several ceiling elements, comprising a lower metal support (4) which is divided up by links (7) and has holes; and an active sound layer (5) which is arranged in the metal support. The layer is a sound insulation layer or a sound absorption layer for example, especially in the form of an open-pore foam such as a melamine-resin foam. The active sound layer (5) is bonded to the metal support (4). According to the invention, the adhesive (6) is only applied to the link areas (11) and only the inner surfaces of the link areas (11) are bonded. This guarantees a simple, economical construction.

The invention relates to a ceiling element for a ceiling composed-of a plurality of ceiling elements, having a lower metal support, which has apertures separated by webs, and an active sound layer, such as a sound insulation layer or sound absorption layer accommodated in the metal support, the layer being in particular in the form of an open-pore foam, for example, a melamine resin foam, the active sound layer being bonded to the metal support.
A very wide variety of configurations of ceiling elements of this type are known. They are used in a ceiling-forming manner so as to provide a xe2x80x9csuspended ceilingxe2x80x9d in a building below an intermediate floor. The gap between intermediate floor and suspended ceiling can be used in advantageous manner for concealed routing of supply lines. The suspended ceiling generally also supports functional elements, such as lights, loudspeakers and sound insulation features. Reference should be made in this regard to DE 44 30 292 A1.
The active sound layer can be connected to the metal support by an adhesive layer, serving as a bonding agent, on the sound insulation layer or sound absorption layer. The conventional, detachable protective covering is generally also needed here. The corresponding complete installation is costly.
It is an object of the invention to provide a configuration which is structurally simple and is more favorable economically.
This object is first and foremost achieved in a ceiling element having the introductory-mentioned features wherein the adhesive is only applied to the web regions, and the bonding is only carried out on the inner surfaces of the web regions. The apertures in the metal support are kept free of adhesive. It is therefore not possible for any airborne particles to adhere here. The proportion of the surface area used for securing the metal support to the active sound layer can be strictly minimized, but nevertheless provides a good load-bearing bond. Even portions of adhesive spreading somewhat over the border of the webs or web regions are negligible; they do not constitute any significant reduction in the opening of the apertures. Said apertures are dimensioned in such a manner that an adhesive membrane does not arise. Provision is furthermore made for the bonding to be strengthened at web intersections. In the case of lattice-like network structures, these are the xe2x80x9cintersecting pointsxe2x80x9d. The latter generally turn out to be somewhat larger in terms of surface area. This results in correspondingly larger bonding surfaces for the adhesive. Whereas when a lower metal support is used, the active sound layer can only be seen within the framework of the apertures, a solution may also be resorted to the effect that an upper metal support is provided, and that the active sound layer is bonded thereto. The metal support is therefore situated more closely to the intermediate floor than the active sound layer which it carries on its lower side. As regards the bonding, the same advantages are present if the upper metal support has apertures separated by webs and the bonding is only carried out in the region of the webs. It is expedient for the upper and lower metal supports to consist of expanded metal. Under some circumstances, the expanded metal may have a different fine-meshed structure. A solution is even conceivable to the effect that two metal supports are used for one ceiling element. The procedure here is for the lower metal support and the upper metal support to be connected only by means of the active sound layer. The latter acts as a retaining bridge. Moreover, it is favorable for the lower metal support and the upper metal support also to have, in comparison with the extent of the surface, an angled border region running at an angle of 30 to 45xc2x0 with respect to said surface extent. This gives a type of shell-like border. At the same time, appropriate deep-drawing increases the surface stability of the ceiling element. Provision is then made for the angled portion of the angled border region to run toward the active sound layer. It has proven favorable, both in terms of reinforcing and with regard to exact fitting of the ceiling element into a support structure, for the angled border region to merge at its border edge into a flattened portion. This lies parallel in space to the dominant, remaining surface extent. In order also to ensure the same insulation or absorption effect right to the periphery of the ceiling elements, it is further provided for the active sound layer to be carried through in a continuous manner into the angled border region. In order, even in the angled border region, to obtain a contour-corresponding profile for the active sound layer, it is furthermore proposed for the angled border region to be formed after the active sound layer is bonded to the metal support.
On a ceiling element for a ceiling composed of a plurality of ceiling elements, having a lower metal support, which has apertures separated by webs, and an active surface layer, such as a sound insulation layer or sound absorption layer, incorporated in the metal support, an advantageous configuration is obtained by means of an upper metal support. This produces a solution which is particularly suitable for load-supporting and can cover large surface areas. Provision is also made here for the upper metal support to have apertures separated by webs. A particularly stable solution is provided if the upper metal support is connected at its border to the lower metal support. A hinged or folding-box-like xe2x80x9ccagexe2x80x9d for the active sound layer may even be obtained if the connection is hinge-like at one border region and is positively-locking at the opposite side. Positive-locking goes as far as including in its meaning a latching connection. The advantage of this solution also resides in the possibility of fitting anew or refitting the layer of this ceiling element. If such a more elaborate implementation is not desired, it is also sufficient for the upper metal support and the lower metal support to be connected in a simple manner, for example in a material-combining manner. Welding, e.g. spot welding, is meant here. Even soldering may be used as a connecting means. With regard to the upper metal support, the special configuration which has already been explained may be selected by the upper metal support also consisting of expanded metal. The further configuration of the upper metal support having protruding fixing sections has proven advantageous in mounting terms with regard to the ceiling elements. Fixing sections of this type are formed integrally on opposite border regions. Attention is paid here to being able to release ceiling elements in a manner which does not affect the surrounding area, i.e. the other ceiling elements, in terms of position. In detail, measures of this type reside in the fact that one fixing section is formed in a vertical projection with the lower metal support. The lower metal support therefore conceals the retaining means from sight. Provision is furthermore made on the mutually opposite border regions for fixing sections to be formed in a vertical projection within, on the one hand, and outside, on the other hand, the lower metal support. Specifically, provision for this is made in such a manner that the offset dimension of the one fixing section corresponds to the projecting dimension of the other fixing section of the adjacent ceiling element. The measure that when there is a vertical projection within the lower metal support below the fixing sections, a lifting clearance for angling out a ceiling element from the ceiling is formed, has proven to facilitate the release of the ceiling element. The lifting clearance serving for the corresponding manoeuvering has adequate dimensions, if, in the vertical direction, it corresponds approximately to half the thickness dimension of an active sound layer. Finally, provision is also made for the fixing sections to be strengthened by being double-layered. In this case, there is a simple means to hand using the technical basic concept in that the double-layered state is obtained by folding the border under. The upper metal support has the sufficient plastic deformability necessary for this. This enables the cut border edge of the expanded metal to disappear. The risk of injury in this regard is thereby minimized.


A system for adaptive laser scanning correction includes a laser scanner coupled to a controller. The controller develops control signals for the laser scanner for a directed scan pattern that is modified to compensate for a characteristic scan-pattern distortion introduced by the laser scanner. The laser scanner responds to the control signals to provide an actual scan pattern approaching a target scan-pattern shape. The system may be useful for ophthalmologic laser surgery and other applications requiring precise control over scan pattern shape and a high scanning speed.

1. Field of the Invention
The field of the present invention relates laser scanners such as used in laser eye surgery or other applications, and more particularly to procedures for incising the cornea using a laser, and systems for making such incisions, during ophthalmic surgery.
2. Description of Related Art
Laser Assisted In-Situ Keratomileusis (LASIK) and other ophthalmic surgical procedures involve forming a flap of corneal tissue, which is separated from the cornea and folded back to expose underlying stromal tissue. The stromal tissue is then reshaped to correct for conditions such as near-sightedness or astigmatism using a pulsed laser. The laser emits pulses at a known frequency, and each pulse photoalters tissue at the focal point of the laser beam. The focal point of the laser beam is swept over the stromal tissue in a scan pattern, such as a raster pattern, under computer control until the stroma is reshaped as desired. The flap is then folded back over the stroma, to which it becomes reattached during the healing process.
The flap may be cut using a microkeratome, which is a precision surgical instrument with an oscillating blade. In the alternative, the flap may be created using a pattern of laser pulses. To create the corneal flap using a laser, two steps are performed. In one step, a sidecut is created around a desired perimeter of the flap. Both ends of the sidecut terminate without intersecting, thereby leaving an uncut segment that later serves as a hinge for the corneal flap. In another step, the flap is separated from the underlying stromal tissue by scanning the laser focal point over an area called the "resection bed," the perimeter of which is approximately defined by, and slightly larger than, the sidecut. Once the sidecut and the resection bed are made, then the flap can be lifted and folded back to reveal the stromal tissue for reshaping. Suitable surgical equipment for creating the corneal flap using a laser is known in the art.
Laser scanners for ophthalmic surgical systems generally utilize a pair of scanning mirrors or other optics to angularly deflect and scan the laser beam. Scanning mirrors driven by galvanometers may be employed, each scanning the laser along one of two orthogonal axes. A focusing objective, whether one lens or several lenses, images the laser beam onto a focal plane of the optical system. The focal point of the laser beam may thus be scanned in two dimensions (x and y) within the focal plane of the optical system. Scanning along the third dimension, i.e., moving the focal plane along the optical axis (z-axis), may be achieved by moving the focusing objective, or one or more lenses within the focusing objective, along the optical axis. In preparing a corneal bed for flap separation, for example, a circular area may be scanned using a raster pattern driven by the scanning mirrors. The laser photoalters the stromal tissue by scanning the focal point of the laser in a pattern of spots, the distribution of which is determined by the pulse frequency, the scan rate, and the amount of scan line separation.
Generally, higher scan rates, i.e., the step rate at which the focal point of the laser is moved, enable shorter surgical times by increasing the rate at which corneal tissue can be photoaltered. Shorter surgical times are less stressful for the patient, and may reduce the likelihood of errors introduced by excessive movement of the patient. As scan rates increase, greater demands are placed on the laser scanner used to direct the laser beam. Laser scanners used to control the scanning motion may begin to introduce mechanical lag errors in focal point positioning at higher scan rates. It is desirable to correct these errors, without requiring potentially costly changes to laser scanner hardware.

Adaptive pattern correction for laser scanners


During scanned exposure of target portions at the edge of the substrate, the position of an edge of the illumination field is changed so as to prevent or reduce radiation falling onto the substrate table or to expose an L-shaped area. In this way the heat load on the substrate table can be reduced and dummy structures can fill a mouse bite without overlapping an alignment mark.

1. Field of the Invention
The present invention relates to a method of manufacturing a device, a device manufactured thereby, a computer program for controlling a lithographic apparatus, and a lithographic apparatus.
2. Brief Description of Related Art
A lithographic apparatus is a machine that applies a desired pattern onto a target portion of a substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that circumstance, a patterning device, such as a mask, may be used to generate a circuit pattern corresponding to an individual layer of the IC, and this pattern can be imaged onto a target portion (e.g. comprising part of, one or several dies) on a substrate (e.g. a silicon wafer) that has a layer of radiation-sensitive material (resist). In general, a single substrate will contain a network of adjacent target portions that are successively exposed. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion in one go, and so-called scanners, in which each target portion is irradiated by scanning the pattern through the projection beam in a given direction (the "scanning" direction) while synchronously scanning the substrate parallel or anti-parallel to this direction.
When exposing a plurality of rectangular dies on a circular (except for the flat, if provided) substrate, it will be appreciated that not all of the substrate can be filled with whole dies; around the edges so-called mouse bites would be left unexposed. To ensure uniformity in subsequent processing, it is customary to perform exposures of dummy structures in the areas where complete dies cannot be fitted. The purpose is that complete dies near the edge of the substrate have neighborhoods that appear similar to the neighborhoods of dies in the center of the substrate and thus their subsequent processing is more similar. Otherwise, no structures would build up on the unexposed areas and the unexposed areas would remain smooth and after several process layers would be at a different level than the exposed areas. This can lead to undesirable effects such as variations in resist thickness at the edges, since the resist runs off more easily over the smooth unexposed areas, incorrect level measurements and/or undesirably abrupt leveling movements during a scan. It can also be desirable to expose dies that overlap the edge of the substrate if the mask contains more than one device and a whole device or devices, but not the whole mask image, can be accommodated by an edge die. The additional devices that are made in this way increase yield.
However, if exposures that overlap the edge of the substrate are carried out, the beam of radiation will fall on the substrate table leading to undesirable heating thereof. The substrate table will in general carry mirrors for the interferometric displacement measuring system (for which reason it is often referred to as the mirror block) which measures movements of the substrate table and these mirrors are maintained flat to a very high degree of accuracy. Localized heating of the substrate table leading to thermal expansion can distort the mirrors and cause errors in the measurement of the position of the substrate table, leading to overlay errors in exposures. U.S. Pat No. 6,232,051 and U.S. Pat. No. 5,331,371 disclose the use of masking blades in step and repeat type lithographic apparatus to prevent unwanted radiation from falling on the substrate table during the exposure of edge dies but do not suggest how the problem may be overcome in a scanned exposure.
Also, in some cases, alignment marks may be located in the mouse bites and these are protected from subsequent exposures. As shown in FIG. 2 of the accompanying drawings, to expose dummy structures in the part of the mouse bite not occupied by the alignment marker P2 whilst not exposing the alignment marker, requires the performance of two exposures 11, 12 to expose an L-shaped area on the substrate bordering the whole dies C but not covering the alignment marker P2. The necessity to perform two exposures is an undesirable loss of throughput. U.S. Pat No. 5,760,881 discloses shields at substrate level that can be moved over the substrate to protect alignment marks.

Method of manufacturing a device, device manufactured thereby, computer program and lithographic apparatus


Method for acquiring network knowledge in the individual operating locations of a digital transmission network having a plurality of network nodes.. Following a computer outage, digital signal connections set up via central computers can no longer be reconstructed within the individual network nodes, so that no emergency operation is possible.. The method is intended to place every participating network node into the position of maintaining the original or momentary path of the digital signal connection given computer outage or to restore it or, respectively, to independently set up or alternately route a connection.. At the start of the digital signal connection, the digital signal is provided with an identifier in every transmission direction in the transmitting network node, this identifier being supplemented in every following, through-connecting and terminating network node. This identifier can be evaluated in each of these network nodes.. The method can be employed in all digital transmission networks having computer-controlled network nodes.

The invention is directed to a method for acquiring network knowledge in the individual transmission-associated operating locations of a digital transmission network comprising a plurality of network nodes, whereby an auxiliary information is mixed into the overhead of digital signals for the transmission of said digital signals.
European Patent Application EP 0 048 853 A1, German Published Application DE-OS 24 41 099 and the Proceedings IEEE, Vol. 2, 9.6.1987, International Conference on Communications, 7-10.06.1987, Seattle, Wash. respectively disclosed telephone switching networks having switching centers via which subscribers are connected.
In transmission systems of digital technology, it is prior art that various digital signal connections DSV are further through-connected in the network nodes either as a whole or separated into individual digital signal connections DSV. Distributors wherein these digital signal connections DSV are allocated to the respective equipment corresponding to the desired connection management and, thus, wherein these connections are through-connected are arranged preceding and following every equipment of a hierarchy level.
It is also prior art that these distributors are computer-controlled and are functionally executed as coordination switches. It is likewise known within the course of a computer-controlled digital signal connections DSV that the various multiplexers and the appertaining distributors are combined to form a combined equipment. The distributors and the corresponding multiplexing stages can thus be driven and administered via a central computer. Given faults occurring in the transmission system, this central controller enables a standby circuit as would otherwise be implemented on site with operating personnel. The disadvantage of the prior art is that, given an outage of the central computer, the original path information of a digital signal group can no longer be reconstructed within the network node since all of the information about the line management is situated in the central computer.
The external servicing and display arrangements or, respectively, sub-computers situated in the individual network nodes are not in the position to restore the original or the momentary path of the connection.
European Patent Application EP 0 214 398 A1 discloses a method for monitoring and controlling the traffic in digital transmission networks having network nodes via a control network. Every digital signal thereby contains an identifier that covers information about the traffic conditions of the individual digital connections such as, for example, a continuous numbering of all sources having directional indication or indication of locality or area. The identifier of a desired digital signal connection is communicated via the control network to the appertaining network nodes that are correspondingly controlled. The identifier of the digital signals is also monitored therein. It in fact contains an information about the connection but not about the path, so that a connection can no longer be set up given the absence of path information via the control network.

Method for acquiring network knowledge about a digital transmission network

Hans Kolbe & Co. Nachrichtenubertragungstechnik

Standard Elektrik Lorenz Aktiengesellschaft


A method, apparatus and system for fabricating a stencil mask for ion beam and electron beam lithography are provided. The stencil mask includes a silicon substrate, a membrane formed from the substrate, and a mask pattern formed by through openings in the membrane. The method includes defining the mask pattern and membrane area using semiconductor fabrication processes, and then forming the membrane by back side etching the substrate. The apparatus is configured to electrochemically wet etch the substrate, and to equalize pressure on either side of the substrate during the etch process. The system includes an ion implanter for defining a membrane area on the substrate, optical or e-beam pattern generators for patterning various masks on the substrate, a reactive ion etcher for etching the mask pattern in the substrate, and the apparatus for etching the back side of the substrate.

Ion and electron beam lithographic systems utilize a stencil mask to pattern a resist coated target. These stencil masks can include a thin membrane which carries the mask pattern. Typically, the stencil mask includes a substrate, and the membrane is an area of reduced thickness on the substrate. The mask pattern can be formed by solid areas and openings in the membrane. The membrane can also include an ion absorbing layer formed of a conductive material deposited on the solid areas of the membrane. The conductivity of the ion absorbing layer can be used to provide a ground path to prevent charge build up on the membrane. In addition, the ion absorbing layer preferably has a high emissivity to facilitate radiative heat removal due to absorption of incident ions.
FIG. 1 schematically illustrates a prior art stencil mask 10. The stencil mask 10 includes a substrate 12 which has been etched to form a membrane 14. A mask pattern 16 has been formed on the membrane 14 by etching a desired pattern of openings 18 through the membrane 14. In addition, an ion absorbing layer 20 has been formed on one side of the membrane 14 on solid areas of the mask pattern 16. Typically, the substrate 12 and membrane 14 comprise silicon. Other deposited or grown materials, such as SiC, SiN, and BN, can also be used to form portions of the substrate 12 and membrane 14. A representative thickness for the membrane 14 is from 2-10 .mu.m.
One prior art process for forming a thin membrane is described in U.S. Pat. No. 5,110,373 entitled "Silicon Membrane With Controlled Stress". This process includes electrochemically etching a backside of a substrate with a required membrane pattern. A thickness of the membrane is controlled by initially doping the substrate to a required depth with dopants of a predetermined concentration. One aspect of prior art membrane formation processes is that the membrane can be difficult to uniformly etch with the required dimensional accuracy.
In addition, any layers of material added to portions of the membrane, such as the ion absorbing layer, can produce stresses and distortion in the membrane. For example, resist masks and hard masks, required for forming the ion absorbing layer, can stress the membrane. These stresses can distort the mask pattern, and contribute to membrane rupture. Some membrane fabrication processes may also require dry etching and handling of the thin membrane, which can lead to stressinduced distortion, as well as breakage of the membrane.
In view of the foregoing, improved methods are needed for fabricating stencil masks for electron beam and ion beam lithography. The present invention is directed to an improved method for fabricating stencil masks. The method is characterized by reduced complexity and an improved stencil mask.

Method for fabricating lithographic stencil masks


Disclosed herein are gene signature sets expressed by kidney allograft recipients prior to transplant that determine the risk for acute rejection (AR) post-transplant and methods of using the gene signature sets for identifying renal allograft recipients at risk for acute rejection. Also disclosed herein are kits for use in the invention which comprise primer pairs for the gene signature sets.

Kidney transplantation is the treatment of choice for subjects with end stage renal disease (ESRD). However, despite remarkable improvements in 1-year graft loss over the last decade, in each subsequent year after transplant, approximately 3% of kidney allograft recipients return to dialysis or require re-transplantation. Though recent data may indicate an uptick in intermediate-term graft loss since 2006 associated with better renal function, rates of late graft failure are relatively unchanged since the 1990s.
Chronic allograft damage, or interstitial fibrosis and tubular atrophy of unknown cause account for most of the cases of graft loss. This has boosted research aimed at understanding and contrasting the mechanisms responsible for these late events, including, among others, alloantibody formation and recurrence of primary disease. Indeed, lack of long-term improvements despite dramatic reduction of acute rejection has challenged the assumption that acute rejection represents a major determinant of long term graft outcomes. This assumption, however, contrasts with evidence that early acute rejection (EAR,) with an inflammation/tubulitis score of 1 or above based on kidney biopsies obtained before 6 months after transplant, both clinically manifested and subclinical, negatively impacts long-term graft loss in patients receiving current immunosuppressive regimens. Therefore, EAR still represents one of the major targets for immunosuppressive therapy after transplantation.
One of the major issues of current immunosuppressive protocols is the fact that they are not tailored to the single patient needs. Current clinical practice depends on broad clinical criteria including anti-HLA antibodies, race, prior transplantation and recipient age to predict individual immunological risk post-transplantation. These indicators perform poorly. As a result, most patients receive a standardized immunosuppressive protocol resulting in some individuals being exposed to too much or too little immunosuppression, with resultant complications. Early identification of individuals at highest risk of acute rejection could allow targeted therapies aimed at improving long-term outcomes.
Evidence exists that the composition and function of the immune system in patients prior to renal transplantation affects the risk for subsequent acute rejection (AR) after transplantation, but no biomarker has been identified to quantify this risk. What is needed are gene signature sets that can be used for transcript profiling of patients' blood prior to renal transplant to predict acute rejection episodes.

Method for prediction of acute rejection and renal allograft loss using pre-transplant transcriptomic signatures in recipient blood


A pressure regulator is described. The pressure regulator includes a diaphragm, a vent limiting component, a relief valve stem, and a main spring. The diaphragm has an inner edge that defines a main relief opening. The vent limiting component is positioned within the main relief opening and adjacent to an upper side of the diaphragm about the inner edge. The vent limiting component defines an orifice, wherein the lower side of the diaphragm is in fluid communication with the upper side of the diaphragm through the orifice. The relief valve stem is positioned adjacent to a lower side of the diaphragm about the inner edge. The main spring is configured to provide a force to the vent limiting component to removably secure the vent limiting component to the diaphragm.

Users of gas pressure regulators are increasingly being restricted on location of regulator installations by government regulations. Customers are actively seeking products to control volume of gas released to atmosphere (vented) during operation, which allows flexibility in meeting the government mandates.
The foregoing background discussion is intended solely to aid the reader. It is not intended to limit the innovations described herein. Thus, the foregoing discussion should not be taken to indicate that any particular element of a prior system is unsuitable for use with the innovations described herein, nor is it intended to indicate that any element is essential in implementing the innovations described herein. The implementations and application of the innovations described herein are defined by the appended claims.

Gas regulator internal vent limiting device


A circular knitting machine having a needle selection device and a device for axially shifting needles which has an axially movable cam. The axially movable cam defines a contour and is movable to three levels corresponding to a knitting position, a tuck position, and a float position. The device is arranged in correspondence with the feed stations of a circular knitting machine, such that butts of needles not moved into operation by jacks traverse the contour of the axially movable cam. The contour raises the needles not moved into operation by the jacks with a substantial delay with respect to other needles moved into operation by the jacks under control of the needle selection device.

The tricks slidably accommodate and guide needles which during their vertical travel, form the stitch loops in cooperation with the sinkers.
The number of tricks is equal to the number of needles which slide in them with reciprocating movement by the effect of raising and lowering cams.
Generally, in hosiery machines the number of tricks and needles is between 200 and 400.
The cylinder is rotated and with it there rotate the needles which, during their reciprocating movement, are fed with yarn. The yarn is fed at angular positions, when the needles reach their highest point of travel, by feed stations. The feed stations consist of one or more yarn guides which are selectively presented to the needle hooks so that the needles seize the yarn from the guides.
To produce hosiery articles, generally only a fraction of the available needles are used at the same time and in the same manner, except for the plain knitwork parts of the hose. During the formation of the plain knitwork, all the needles are operated between their maximum and minimum level, all needles are fed with yarn at each knitting course, and all of the needles are moved in the same manner.
When the machine is not producing plain knitwork, in order to produce other types of knitwork some needles are required to produce stitch loops and therefore be raised to the maximum level at the feed station in order to seize the yarn. Other needles have to be raised to an intermediate level to take up yarn without clearing the previous stitch in order to form a tuck stitch, or have to be raised with a certain delay so that they do not seize the yarn fed in that feed station and therefore do not form new loops with it. In other words a needle selection has to be made. This means that before each feed, means have to be provided for determining how many needles must undergo a certain travel, which and how many other needles must undergo a certain different travel, and which needles undergo no travel.

Device for axially shifting within a circular knitting machine those needles which have not been raised by jacks


A process is provided for the production of a gasoline blending fraction rich in isooctane by the dimerization of isobutylene using tertiary butyl alcohol modifier and isoalkane diluent; advantageously the isobutylene is derived from the dehydration of tertiary butyl alcohol and the isoalkane used as diluent in the dimerization is the product formed by hydrogenation of the oligomerization product.

1. Field of the Invention
The present invention relates to an integrated process for the selective dimerization of isobutylene and especially to the use of isooctane formed by diisobutylene hydrogenation as a dimerization solvent. Especially advantageous features include the use of tertiary butanol as from the Oxirane propylene oxide/tertiary butanol process as feed and the provision of tertiary butanol as a selectivity enhancing modifier during the dimerization.
2. Description of the Prior Art
The oligomerization of olefins such as isobutylene using acidic catalysts is a known reaction.
As described in U.S. Pat. No. 3,760,026, a number of catalysts are known for this reaction including cold sulfuric acid, phosphoric acid on Kieselguhr, silica/alumina sometimes promoted with Ni, Co, Fe, Pt or Pd; activated natural clays plus activating substances such as ZnO metallic phosphates such as those of iron (III) and cerium optionally supported on carriers such as activated carbon, bauxite, activated carbon alone and with metal haliders such as TiCl.sub.2 heteropolyacids such as silicotungstic acid on silica gel and phosphomolybdic acid; BF.sub.3 H.sub.3 PO.sub.4 and BF.sub.3 HPO.sub.3 ; dihydroxyfluroboric acid HF and fluorides or oxyfluorides of S, Se, N, P, Mo, Te, W, V and Si boiling below 300.degree. C.; BF.sub.3 dimethyl ether complexes; BF.sub.3 hydrocarbon complexes; BF.sub.3 SO.sub.2 ; and AlCl.sub.3 with cocatalysts such as dimethyl ether, HCl, and nitromethane. These catalysts and dimerization processes, including operating conditions, are known in the art.
An especially preferred catalyst is a sulfonic acid-type ion exchange resin such as Amberlyst A-15. U.S. Pat. No. 4,447,668 describes isobutylene dimerization using A-15 with methyl t-butyl ether as solvent.
Considerations associated with the isobutylene dimerization involve removal of the substantial heat of reaction and the requirement that high selectivity to the dimer product be maintained. The instant invention provides a process wherein these objectives are achieved.

Isobutylene oligomerization using isooctane diluent


A casting method and cast article are provided. The casting method includes providing a casting furnace, the casting furnace including a withdrawal region in a lower end, positioning a mold within the casting furnace, positioning a molten material in the mold, partially withdrawing the mold a withdrawal distance through the withdrawal region in the casting furnace, the withdrawal distance providing a partially withdrawn portion, then reinserting at least a portion of the partially withdrawn portion into the casting furnace through the withdrawal region, and then completely withdrawing the mold from the casting furnace. The reinserting partially re-melts a solidified portion within the partially withdrawn portion to fill pores formed therein with the molten material. The cast article includes a microstructure and a porosity corresponding to being formed by a process comprising partially withdrawing, reinserting, and completely withdrawing of a mold from a casting furnace to form the cast article.

Various components, such as turbine buckets for gas turbine engines, are often formed by directional solidification (DS)/single crystal (SC) casting techniques. More specifically, many components are often formed by a casting "withdrawal" technique where a melt-filled investment mold is withdrawn from a casting furnace. Withdrawing the melt-filled investment mold from the casting furnace permits a molten metal or alloy in the mold to cool and solidify, forming the component within the mold.
As the molten metal or alloy cools it may shrink, leading to the formation of porosity within portions of the component, such as a turbine bucket tip shroud. One method of filling the pores formed in the component includes a hot isostatic pressing (hipping) process. The hipping process is expensive.
A casting method and a cast article with improvements in the process and/or the properties of the components formed would be desirable in the art.


A reading process is performed to read data of each area, which is divided from image data, from a buffer storing the image data to be performed on a predetermined image process. A transmitting process is performed to transmit the read data of the area to an image processor. A reception process is performed to receive data generated in the predetermined image process from the image processor. A parameter for a writing process is set based on an area size of the received data. A writing process is performed to write the received data to the buffer by data transfer using direct memory access (DMA).

Field of the Invention
The present invention relates to data transfer processing between an image processor and a buffer that stores image data to be processed.
Description of the Related Art
When outputting an image by image formation processing, local image processing such as spatial filter processing is performed. In the local image processing, a predetermined operation is performed using all or most pixels in a spatial filter region including pixels to be processed.
Japanese Patent Laid-Open No. 2006-139606 (literature 1) describes a technique of performing local image processing as parallel distributed processing. According to the technique of literature 1, an image is divided into a plurality of regions in the sub-scanning direction (to be referred to as "one dimensional division" hereinafter), and image processing using sequential processing or parallel distributed processing is performed for the divided regions. The method of processing each region obtained by one dimensional division of an image will be referred to as "band processing".
In the band processing, to perform local image processing closely between band regions, a contrivance is made such that images partially overlap at the boundary between a band region and an adjacent band region. In literature 1, when performing local image processing for a band region, the pixels are scanned one by one in the height direction (sub-scanning direction) of the band region. The memory amount of a delay memory for holding the values of pixels necessary for the local image processing is thus defined to the height of the band region, thereby implementing saving of the capacity of the delay memory.
Region division processing for dividing an image into partial images and performing sequential processing or parallel distributed processing has various advantages such as speedup by parallel distributed processing and capacity saving of the delay memory.
One of local image processes is resolution conversion processing of converting an input image into an image of a desired size by enlargement or reduction. According to the resolution conversion processing, since the number of input pixels and the number of output pixels after the processing largely differ from each other, hardware implementation is difficult as compared to other local image processes that do not change the number of pixels between input and output of image data. Hardware implementation becomes more difficult when the resolution conversion processing is combined with the region division processing.
For example, assume that image data on a page space or the like is divided into regions (for example, bands), and resolution conversion (arbitrary magnification) is performed for each of the divided image regions. If the magnification ratio of the resolution conversion is an integer, the size of the image region after conversion is an integer multiple. It is therefore unnecessary to consider a pixel having a size represented by a fraction, that is, smaller than the one-pixel size.
On the other hand, if the magnification ratio is not an integer, a pixel having a size represented by a fraction may be generated in the image region after resolution conversion depending on the size of the input image region. When writing data of the processed image region in a storage device, it is impossible to write the pixel smaller than the one-pixel size. For this reason, it is necessary to perform "rounding" processing to represent the number of pixels by an integer by a method of, for example, writing the pixel smaller than the one-pixel size as one pixel, or neglecting it and prohibiting write, as a matter of course.
When rounding a pixel smaller than the one-pixel size, which is generated by image processing, the set value of a DMA (Direct Memory Access) used to transfer image data may change between the divided regions, and it may be impossible to continuously use the same set value. For example, a set value such as a "start address" or "number of repetitions" needed for transfer using the DMA needs to be calculated and set for each divided region in consideration of the contents of a series of image processes. In this case, the set value of the DMA according to the contents of the series of image processes is calculated for each divided region by firmware that operates on a microprocessor (CPU), and the set value calculated for each divided region is set in a DMA controller (DMAC), and the image processor is sequentially caused to operate.
An image processing apparatus is formed from many units such as a CPU that controls the entire apparatus, a storage device serving as a global buffer for storing image data to be processed, a DMAC that transfers image data on a process unit basis, and an image processor that executes image processing. These units simultaneously and/or cooperatively operate, thereby implementing desired image processing at a desired speed.
In the image processing apparatus, when inputting image data to be processed, partial image data to processed is sequentially read out from the global buffer and temporarily stored in the input local buffer of the image processor, and image processing is executed. When outputting processed image data, partial image data after image processing is temporarily stored in the output local buffer of the image processor and sequentially written in the global buffer. The image processing apparatus thus transfers image data with respect to the global buffer through the input/output local buffer, thereby implementing the simultaneous operation of the units of the image processing apparatus and the cooperative operation between the units.
When calculating the set value of the DMA for each divided region, processing of the CPU is needed for each divided region. Hence, the image processor cannot continuously process the plurality of divided regions.
In addition, when controlling data transfer to the global buffer through the local buffer to control the operations of the plurality of units, if the number of pixels of the input/output image data changes between the divided regions as in the resolution conversion processing, the data transfer cannot uniformly be defined. For this reason, for example, the number of pixels of output data is obtained for each divided region, the setting of the DMA is changed for each divided region, and the image processor is activated. When image processing of one band is completed, the image processor needs to notify the CPU of the completion of processing using an interrupt or the like and synchronize with the CPU. The CPU needs a time of, for example, several ms to receive the interrupt, check the interrupt factor, and transit to the next operation. As a result, a processing load to some degree is always applied to the CPU for synchronization with the processing of the image processor, and the CPU is not released during the image processing. Hence, a delay is needed for the simultaneous operation of the units of the image processing apparatus, and the cooperative operation between the units cannot continuously be executed.

Data transfer apparatus and method thereof


A vehicle support structure is provided with a floor impact restriction device coupled between a structural floor member of a vehicle floor and a vehicle suspension member supporting the vehicle floor. The floor impact restriction device basically has a suspension attachment member and a floor attachment member. The suspension attachment member has a suspension mounting portion fixedly attached to the vehicle suspension member and a first connecting portion rigidly coupled to the suspension mounting portion. The floor attachment member has a floor mounting portion fixedly attached to the structural floor member and a second connecting portion rigidly coupled to the floor mounting portion. The first and second connecting portions are interlinked together with a limited range of non-contacting movement between the first and second connecting portions.

1. Field of the Invention
The present invention generally relates to a vehicle support structure with a floor impact movement restriction device. More specifically, the present invention relates to a vehicle floor impact movement restriction device that is coupled between a suspension member of a vehicle and a structural floor member of the vehicle.
2. Background Information
In the United States, Federal regulation FMVSS210 establishes requirements for seat belt anchorage points for vehicles to ensure that seats and/or seatbelts within the passenger compartment of a vehicle undergo minimal movement relative to the frame of the vehicle. In Europe, a similar regulation ECE R 14 exists for establishing requirements for seat belt anchorage points in vehicles. To meet these regulations, some vehicles are provided with an impact movement restriction device that connects a floor cross member of the floor to a suspension cross member to limit relative movement therebetween in the event of a collision. For example, in the past, an impact movement restriction device was provided that used a steel wire to interconnect the floor cross member of the floor to a suspension cross member.
While the above mentioned type of impact movement restriction device performs well, it has several drawbacks from a manufacturing perspective. For example, this type of impact movement restriction device can be costly to manufacture and/or assemble. Also, it is desirable to minimize the mass of an impact movement restriction device.
In view of the above, it will be apparent to those skilled in the art from this disclosure that there exists a need for an improved floor impact movement restriction device that meets the above mentioned regulations. This invention addresses this need in the art as well as other needs, which will become apparent to those skilled in the art from this disclosure.

This patent is subject to a terminal disclaimer.

Vehicle support structure with floor impact movement restriction device

Nissan Technical Center North America, Inc.


An IC socket (1) includes a base (2), a cover (5) slidably engaged upon the base, and a lever (4) for driving the cover to slide on the base. The lever includes a lateral rod (41) and a longitudinal rod (42) connected to the lateral rod. The lateral rod is received in between the cover and the base. The longitudinal rod is exposed out of the cover and the base, with a connecting section (421) of the longitudinal rod parallel to one side face of the cover, and an acting section (423) joined to the connecting section and configured to be laterally tilted towards the one side face of the cover. Thus, this configuration of the acting section of the longitudinal rod will occupy less room on a printed circuit board, and enables the lever to be engagably retained on the cover side face so as to prevent the lever from being removed by accidental touching or vibration.

1. Field of the Invention
The present invention relates to the art of electrical connectors, and more particularly to a lever for use in an IC socket for occupying less room on a printed circuit board.
2. Description of the Related Art
One conventional IC socket 9 is shown in FIGS. 4 and 5. The IC socket 9 comprises a base 91, a cover 94 slidably engaged on the base 91, a lever 93 received in between the cover 94 and the base 91 for driving the cover 94 to slide on the base 91. The cover 94 defines a plurality of holes 941 in rows therein. Two ears 942 and 943 are formed on one side of the cover 94. The base 91 defines a plurality of slots 911, each of which corresponds to a hole 941 of the cover 94 and remains in communication with the hole 941 when the cover 94 is driven to slide on the base 91 by the lever 93. The lever 93 comprises a lateral portion 931 and a longitudinal portion 932 joined to the lateral portion 931. The lateral portion 931 of the lever 93 is received in between the cover 94 and the base 91, while the longitudinal portion 932 thereof is exposed out of the cover 94 and the base 91. Normally the IC socket 9 is defined as in a tight status where the longitudinal portion 932 is arranged parallel to and proximate to the side face where the two ears 942 are formed, and the longitudinal portion 932 is retained in between the two ears 942. In the tight status, each pair of the hole 941 and the slot 911 firmly receives an IC pin of an IC (not shown), therefore the IC pin is not easily pulled out from the IC socket 9. When a user lifts the longitudinal portion 932 of the lever 93, the cover 94 is driven to slide forward by the lever 93 for a distance less than a width of the slot 911, thus releasing retention on the IC pin and allowing the user to pull the IC from the IC socket 9 easily. However, the conventional IC socket 9 may be accidentally loosened from its tight status due to transportation shaking or accidental touch on the longitudinal portion 932 of the lever 93. FIG. 5 illustrates the longitudinal portion 932 of the lever 93 is retained in between the two ears 942. Since the whole longitudinal portion 932 is arranged parallel to the two ears side, and only a part of the periphery of the longitudinal portion 932 is separately grasped by the two ears 942, the retention on the longitudinal portion 932 of the lever 93 is apt to be removed by accidental touching or vibration. Further, in some instances, an end of the lever longitudinal portion 932 may take up a "real estate" on a printed circuit board, where a few electronic component are needed to be equipped thereon, due to having the whole longitudinal portion 932 parallel to the two ears side. Therefore, there is a need to provide a new IC socket to resolve the above-mentioned shortcomings.


A method which enables an optical element having a large refractive index difference and a stabilized refractive index distribution to be produced in a short time. When a gel prepared by a sol-gel method is immersed in a solution containing at least one substance selected from the group consisting of an organic solvent, water, an acid, and an alkali, or in a solution having a metal salt dissolved in the at least one substance selected from the above group, a component eluted into the solution from the gel and/or a foreign substance which is produced or mixed in the solution during the solution immersing step is removed, and a component diffused into the gel from the solution is supplemented to the solution.

1. Field of the Invention
The present invention relates to a method of producing a glass material which is applicable to optical elements of cameras, microscopes, etc. The present invention also relates to a gel immersing apparatus which may be suitably employed to carry out the glass material producing method.
2. Description of the Related Art
In the sol-gel method, a sol is prepared by reaction of a metal alkoxide of silicon, which forms the matrix of glass, with a solvent such as ethanol, a catalyst such as hydrochloric acid, etc. When an optical glass is to be produced, various metal components are added to the sol in order to vary the refractive index. Addition of the metal components is effected by adding to the sol alcohol solutions of metal alkoxides or derivatives thereof, or solutions of metal salts.
The use of a metal salt is particularly advantageous in that the raw material is inexpensive and capable of being handled in the air. However, a gel that is obtained by using a metal salt has the disadvantage that the water and solvent in the gel volatilize when the gel shrinks on drying., causing coarse crystals of the metal salt to precipitate and grow. Since the gel is broken by the growth of the crystals, it may be impossible to obtain glass of desired configuration. Accordingly, the conventional practice is to immerse the gel in a solution in which the solubility of the metal salt is low, thereby precipitating crystallites of the metal salt in the gel. Thereafter, sintering is carried out.
Meanwhile, Japanese Patent Application Post-Examination Publication No. 2-39454 discloses a method in which a gel is immersed in an organic compound, e.g. an alcohol, dioxane, acetone, etc., in order to prevent cracking of the gel.
Incidentally, there is a distributed index optical element in which a refractive index distribution is imparted to a medium so that the medium itself has refractive power (refractive index). Since the distributed index optical element has excellent aberration correcting capability, it enables a reduction in the number of constituent lens elements. Therefore, the distributed index optical element has attracted attention as an optical element which is essential for next generation optical systems.
As methods of producing such a distributed index optical element, the sol-gel method, the ion-exchange method, the molecular stuffing method, etc. are generally employed. Particularly, the sol-gel method has the advantageous features that it is possible to obtain a glass material having a large aperture, and that a distribution can be imparted to an oxide of a multivalent metal, and further that it is possible to vary the optical characteristics of the distributed index optical element obtained. Thus, the sol-gel method is an effective production method.
As conventional methods of preparing a distributed index optical element by the sol-gel process, there have been known a method which is reported in Elect. Lett. 22 (1986), p.1108, and a method which is disclosed in U.S. Pat. No. 4,686,195.
In the method that is reported in Elect. Lett. 22 (1986), p.1108, a wet columnar gel is prepared from silicon alkoxide and germanium alkoxide or titanium alkoxide. Then, the gel is immersed in water or a dilute aqueous solution of hydrochloric acid. Germanium or titanium, which is a component that gives a high refractive index, is partly eluted by the water or dilute aqueous solution of hydrochloric acid, whereas substantially no silicon is eluted. Accordingly, only the germanium or titanium component in the gel is eluted into the water or dilute aqueous solution of hydrochloric acid. By drying and sintering the gel, it is possible to prepare a distributed index optical element in which the refractive index decreases toward the outer peripheral portion from the center.
In the method of U.S. Pat. No. 4,686,195, a solution mainly containing silicon alkoxide and a metal salt is hydrolyzed to obtain a sol, and the sol is allowed to gel. The resulting gel is immersed in a solution in which the solubility of the metal salt is low, thereby precipitating crystallites of the metal salt in the gel. The gel is then immersed in a solution containing a metal salt different from the above metal salt. Consequently, the metal salt contained in the solution gradually diffuses from the surface toward the inside of the gel. In addition, the crystallites of the metal salt contained in the gel are gradually eluted from the surface of the gel to the outside. Then, the gel is dried and sintered, thereby making it possible to prepare a distributed index optical element in which the refractive index decreases toward the outer peripheral portion from the center.
The method that is disclosed in Japanese Patent Application Post-Examination Publication No. 2-39454, and the method that is described in U.S. Pat. No. 4,686,195, that is, a method in which a gel is immersed in a solution in which the solubility of a metal salt is low, thereby precipitating crystallites of the metal salt in the gel, suffer, however, from problems as stated below. When a gel immersing treatment is actually carried out in the above-described conventional process, some portions of the meniscus or other part of the gel are likely to chip off during the immersing in the solution and disperse in the solution. The gel may crack or break into pieces even more severely. In such a case, some broken pieces of the gel are smashed into fragments by stirring, and the fragments get mixed in the treating solution in such a state that colloidal particles are dispersed in the solution, resulting in an increase in the amount of elution of metal components and organic solvent, water, acid and other components into the solution from the broken pieces of the gel and the fragments thereof. The increase in the amount of elution causes a change in the equilibrium of the solution, resulting in a change of the metal component concentration in the unbroken gel. Particularly, as the number of gels which are treated simultaneously in a single container increases, the gels are more affected by the eluted substances and the fragments of the gel, thus producing a serious adverse effect on the yield. When such a gel is used to impart a refractive index distribution thereto, there may be a variation in the distribution profile because there is a variation in the metal concentration distribution in the gel.
Further, since the dispersed fragments of the gel act as a nucleating agent, coarse crystals of the metal salt are likely to form in some portions of the gel, causing the gel to break. The fragments of the gel may also cause crystallization on sintering, resulting in a white opaque bulk material being formed. Therefore, it has heretofore been difficult to obtain a crack-free transparent glass material.
There is a fixation and distribution imparting process in which a single gel is put in a single container to precipitate crystallites of a metal salt in the gel. This fixation and distribution imparting process requires a large number of steps and facilities, and it is therefore inefficient. Accordingly, it is essential from the industrial point of view to employ an efficient production method in which a plurality of gels are simultaneously put in a single container to carry out fixation and distribution imparting operations. In a method wherein a plurality of gels are simultaneously treated, if an extremely large amount of solution is used to treat the gels, for example, the above-described change in the concentration of the solution reduces. Therefore, the adverse effect on the yield will reduce. However, this method causes an increase in the amount of solution used and also an increase in size of the system, and hence unfavorably requires a wider space and a great deal of cost. Accordingly, it has been demanded to establish a glass producing method which requires a small amount of solution for treatment, and which enables a plurality of gels to be simultaneously and readily treated in a short time by using a small-sized system. More particularly, it has been demanded to establish a glass producing method which enables a glass material stabilized in quality, e.g. refractive index, to be readily obtained in a short time at a reduced cost.
In a case where a distributed index optical element is used in a lens system of a camera or the like, the refractive index distribution profile is important. The following expression shows the relationship between the refractive index and the distance from the center of a distributed index optical element: EQU N(r)=N.sub.0 +N.sub.1 r.sup.2 +N.sub.2 r.sup.4 +N.sub.3 r.sup.6 +. . .
where N(r) is the refractive index at a point defined by a radius r from the center, N.sub.0 is the refractive index at the center, and N.sub.1, N.sub.2, N.sub.3. . . are distribution coefficients.
Matters of great concern in terms of the distribution profile are the refractive index difference .DELTA.n between the central and peripheral portions, and the distribution coefficient at the lens peripheral portion for correcting aberrations. The power of a distributed index optical element is determined by the value of N.sub.1. Therefore, as the absolute value of N.sub.1 increases, that is, as .DELTA.n increases, the effect of the distributed index optical element becomes more powerful. For the aberration correction at the lens peripheral portion, the distribution coefficients N.sub.2, N.sub.3. . ., which have a great effect on the distribution profile at the peripheral portion are important factors. It is generally known that a glass material which has a large refractive index difference and a parabolic refractive index distribution profile is useful from the viewpoint of aberration correcting capability and the readiness of lens design. Therefore, it has heretofore been considered necessary to establish a method of producing such a glass material.
However, neither of the methods disclosed in Elect. Lett. 22 (1986), p.1108 and U.S. Pat. No. 4,686,195 can produce the desired glass material. That is, the glass material produced by either of the conventional methods has an unfavorably small refractive index difference and a non-parabolic refractive index distribution profile, that is, a distribution profile in which the refractive index distribution curve is undesirably inflected at the lens peripheral portion. FIG. 10 is a conceptual view showing the refractive index distribution. In the figure, the dotted line shows a parabolic distribution profile, and the solid line shows a distribution profile obtained by the above-described prior art. When a lens system is prepared by using a glass material having such a non-parabolic distribution profile, since the value of An is small, the power of the medium itself is weak, and since the distribution curve has a point of inflection at the lens peripheral portion, light rays cannot effectively be converged. Accordingly, aberration correcting effect which is unique to the distributed index optical element cannot satisfactorily be obtained. If the glass peripheral portion is cut off so as to avoid the point of inflection at the peripheral portion, the effective aperture of the lens is undesirably limited.
The mechanism of the occurrence of a disorder in the distribution profile, which is a problem associated with the prior art, will be explained below by way of an example shown in U.S. Pat. No. 4,686,195. In the example, attempts were made to control the metal concentration distribution profile, that is, the refractive index distribution, by changing the time for which a gel containing lead acetate was immersed in a distribution imparting solution, to thereby control the amount of elution of lead acetate.
FIG. 11 shows the time for which the gel was immersed in the distribution imparting solution and the profile of the metal concentration in the gel. The gel was immersed in the distribution imparting solution for three different periods of time: 4 hours (characteristic curve a); 16 hours (characteristics curve b); and 24 hours (characteristic curve c). It will be understood from FIG. 11 that, as the immersing time becomes longer, the metal concentration at the gel peripheral portion increases, and the parabolic distribution profile is gradually deformed. As a result, it becomes impossible to obtain a gel having the desired parabolic lead concentration distribution. FIG. 12 shows the refractive index distributions of glass materials obtained by sintering the gels prepared as described above. In the figure, the characteristic curve a shows the refractive index distribution of a glass material produced from a gel immersed for 4 hours in the same way as in FIG. 11. The characteristic curve b shows the refractive index distribution of a glass material produced from a gel immersed for 16 hours. The characteristic curve c shows the refractive index distribution of a glass material produced from a gel immersed for 24 hours. As will be understood from FIG. 12, the parabolic distribution profile is deformed, resulting in a glass material having a refractive index distribution profile in which the distribution curve is undesirably inflected at the outer peripheral portion, as shown in the conceptual view of FIG. 10.
The above-described phenomenon may be explained as follows: It may be considered that, when a columnar gel containing a salt of metal species A is immersed in a distribution imparting solution containing a salt of metal species B, the formation of a radial concentration distribution of each of the metal species A and B during the distribution imparting process takes place according to the diffusion rule. More specifically, metal ions A diffuse into the distribution imparting solution having a relatively low concentration of metal species A from the gel having a relatively high concentration of metal species A. Conversely, the metal species B in the distribution imparting solution diffuse into the gel having a low concentration of metal species B from the solution having a relatively high concentration of metal species B. The reaction taking place at that time may be considered to be an ion-exchange reaction, and upon completion of the distribution impartation, the concentration gradients of metal species A and B from the central portion of the gel toward the peripheral portion thereof must have no point of inflection.
In actual practice, however, the metal species A in the gel are eluted into the distribution imparting solution. Therefore, the A concentration in the dipping solution increases, and thus the difference in the A concentration between the gel and the distribution imparting solution decreases. As a result, the dissolution equilibrium changes. Accordingly, the rate of dissolution of the metal species in the distribution imparting solution gradually reduces. The degree of reduction in the dissolution rate differs depending on the kind of metal species eluted from the gel and the kind of solution. In many cases, however, the dissolution rate reduces as shown in FIG. 13. That is, when a certain amount of metal species A has been eluted into the solution, the rate of dissolution reduces. As the rate of dissolution reduces, the elution of the metal species A from the gel becomes slow, and the time required for the metal species A to be eluted increases, resulting in a metal concentration distribution in which the rate of elution of the metal species A from the gel into the solution gradually reduces. That is, no parabolic distribution profile such as that shown by the dotted line in FIG. 10 can be obtained, and the resulting distribution profile has a point of inflection such that the distribution curve becomes undesirably gentle at the outer peripheral portion of the gel, as shown by the solid line in the figure.
Further, as the dipping time lengthens, the metal species B in the solution diffuse into pores of the gel. Consequently, the concentration of the metal species B in the solution gradually reduces. In other words, since the rate of diffusion of the metal species B to be supplied into the gel decreases, no ideal diffusion takes place, and thus the distribution profile is deformed.
Thus, since the distribution imparting conditions are greatly affected by the presence of metal ions eluted into the distribution imparting solution from the gel and metal ions diffused into the gel from the solution, a long time is required for the distribution impartation, and it is impossible to obtain a distributed index optical element having a parabolic distribution profile and a large refractive index difference.
Although in the forgoing the fixation of crystallites, the distribution impartation, etc., which are related to the chemical equilibrium of a solution have been described, it should be noted that an adverse effect is also produced when dust or the like, which is not related to the chemical equilibrium, is attached to the gel. For example, when dust is attached to the gel in the distribution imparting process, the way in which the distribution imparting solution contacts the gel changes. Therefore, it becomes impossible to impart a uniform distribution. Thus, the distribution is disordered.
Further, since foreign substances such as fragments of the gel act as a nucleating agent and cause crystallization, as described above, the resulting glass material may become opaque. For example, metal components such as Ti, Ba, Sn, Zr, Cu, and Nb in particular are likely to act as a nucleating agent, and when attached to the gel, these metal components cause crystallization and devitrification during sintering process.
Thus, with the prior art, the amount of fixation of a metal component to a gel and the amount of elution of a metal component from the gel are affected by the solubility in the solution, that is, the amount and composition of the solution (the kinds of metal, solvent and acid contained in the solution, and the concentrations thereof) and the existence of dust or other impurities. Unless these components and impurities are removed and the relationship between the gel and the dipping solution is kept constant at all times, the amount of metal component fixed in the gel varies, and the distribution rate changes, resulting in variation of the refractive index distribution profile. Consequently, it is impossible to obtain a glass material having a large refractive index difference and a parabolic distribution profile. Moreover, it is impossible to obtain an optical element stabilized in quality.

Glass material producing method and gel dipping apparatus


Laser jetting of droplets of a viscous material, such as an ink, is performed by coating a layer of ink on a mesh-like transport screen, with the ink being retained within spaces of the mesh-like transport screen. The ink-coated mesh-like transport screen is conveyed to a working area and a laser beam is used to heat the ink within the spaces of the mesh-like transport screen, thereby causing ink droplets to be jetted from the spaces of the mesh-like transport screen. Structures are formed on a receiving substrate arranged near the working area by jetting the ink droplets, either in an aggregation or sequentially, across a gap from the mesh-like transport screen to the receiving substrate and displacing the mesh-like transport screen and the laser beam relative to one another at times between the jetting of the droplets, or by directly printing ink droplets onto the receiving substrate.

A number of different drop-on-demand (DOD) printing techniques have been developed, some of which involve the fabrication of 2D or 3D objects from digital data files under computer control. In general, these techniques rely on piezoelectric and/or thermal actuators to eject small amounts (droplets) of liquid (ink) through a nozzle. While these processes may work well for some inks, they tend not to be well-suited for high viscosity inks which often clog the small nozzles. As a result, when working with viscous inks, the conventional DOD methods tend to require the use of large droplet sizes inasmuch as large bore nozzles are required and the droplets produced are approximately the same size as the nozzles from which they are ejected.

Laser-based droplet array jetting of high viscous materials


A transportable carrying cases for toiletries, cosmetics and personal hygiene items, for use in both wet and dry environments is disclosed. The carrying case has a main body portion with a top opening, and a perforate floor, a bottom portion configured to receive a lower portion of the main body portion in nesting or contiguous relationship, whereby excess moisture shed from articles contained in the main body portion is drained through the perforate floor into a reservoir provided in the bottom portion spaced below the perforate floor. A lid is secured in one of a plurality of telescoped positions to close the top opening of the main body portion, by a handle portion locking the lid in a closed configuration in one of a plurality of telescoped positions adjacent to the main body portion.

1. Field of the Invention
The present invention relates generally to transportable carrying cases for toiletries, cosmetics, personal hygiene and other personal articles and clothing, and more particularly to a transportable carrying case for use therewith in both wet and dry environments.
2. Background of the Invention
The use of portable carrying cases for transporting toiletry, personal hygiene and other personal articles and clothing is well known in the related art. In general such portable carrying cases are designed to accommodate a random selection of toiletry or other personal hygiene items such as shampoos and conditioners, hair treatments, deodorants, shaving cream and razors, toothbrushes, toothpastes, soaps, lotions, spray containers, deodorants, and other tonics and preparations. Additionally, some portable carrying cases are known for carrying damp items resulting from use of the above-described articles, including gym clothing, towels, toiletry or other personal hygiene items, or other articles that have been exposed to a damp or wet environment but which must be transported without benefit of on-site laundering or drying before transport. Often, those portable carrying cases may provide one or more air vents as the sole means for venting some excess moisture carried and retained within the carrying cage by the damp articles. It is well known that damp environments provide fertile breeding grounds for bacterial and fungal growth , and closed or minimally air-vented containers such as related art cosmetics cases, gym bags, conventional luggage, and portable lockers fail to provide means for positive displacement of excess moisture. Thus, the related art fails to address the long felt but unsolved need to separate wet or damp items from dry items, or to allow wet or damp items to drain a residual liquid away from the other items.
Accordingly, it is desirable to provide a portable carrying case for accommodating transport of the type of articles described above, among others, especially when the articles have been dampened through use, and moreover, it is desirable to remove the dampened items from the wet environment to a dry environment in a secure case as may be used during transport between, for example, home and gymnasium. Related art carrying cases further fail to provide means for allowing expansion to accommodate an overload, within a secured carrying case, while also allowing for positive draining.
The present invention is a carrying case having a main body portion including a base with a perforate floor, a bottom portion having an imperforate floor adapted to receive in nesting relationship the base of the main body portion, the perforate floor spaced above the imperforate floor to define a reservoir therebetween for receiving drainage through the perforate floor. A lid is removably affixed to the top opening of the main body portion by a handle secured for articulation to the main body portion, the handle including a gripping device for gripping one of a plurality of securement points provided on the lid, for securing the lid in a closed configuration in one of a plurality of telescoped positions relative to the top opening when the handle is articulated to a secured position.

Transportable case for wet/dry environments


The invention concerns a process to manufacture a flat-rolled product, notably for the aeronautic industry containing aluminum alloy, in which, notably a flattening and/or stretching is performed with a cumulated deformation of at least 0.5% and less than 3% and a short heat-treatment is performed in which the sheet reaches a temperature between 130° C. and 170° C. for a period of 0.1 to 13 hours. The invention notably makes it possible to simplify the forming process of fuselage skins and to improve the balance between static mechanical strength properties and damage tolerance properties.

Field of the Invention
The invention relates to aluminum-copper-lithium alloy products, and more particularly to such products, their manufacturing processes and use, designed in particular for aeronautical and aerospace engineering.
Description of Related Art
Flat-rolled products made of aluminum alloy are developed to produce parts of high strength designed for the aircraft and aerospace industry in particular.
Aluminum alloys containing lithium are of great interest in this respect because lithium can reduce the density of aluminum by 3% and increase the modulus of elasticity by 6% for each percent of lithium weight added. For these alloys to be selected for aircraft, their performance as compared to the other usual properties must attain that of alloys in regular use, in particular in terms of the balance between static mechanical strength properties (yield stress, ultimate tensile strength) and damage tolerance properties (toughness, resistance to fatigue crack propagation), these properties being in general in opposition to each other. The improvement in the balance between the mechanical strength and damage tolerance is constantly sought.
Another important property of thin Al—Cu—Li alloy sheets, notably those having a thickness between 0.5 mm and 12 mm, is the ability to be formed. These sheets are notably used to make aircraft fuselage elements or rocket elements that have a complex general 3-dimensional shape. In order to reduce the fabrication cost, aircraft manufacturers seek to minimize the number of sheet forming steps, and to use sheets that can be manufactured inexpensively by means of short transformation processes, i.e. comprising as few individual steps as possible.
For the fabrication of fuselage panels, there are currently several possible processing steps, which notably depend on the deformation required during the forming process. For small deformations during forming, typically less than 4%, it is possible to supply sheets in an as-quenched and naturally-aged temper (slightly tempered "T3" or "T4"), and to form sheets in this state.
However, in the majority of cases, the deformation sought is at least 5% or 6% locally. A current practice of aircraft manufacturers generally consists of procuring hot or cold-rolled sheets depending on the required thickness, as manufactured ("F" temper as per standard EN 515), naturally-aged temper ("T3" or "T4" temper), annealed ("O" temper), subjecting them to a solution heat-treatment followed by quenching, and then forming in an as-quenched state ("W" temper), before finally submitting them to natural or artificial aging, so as to obtain the required mechanical properties. Generally speaking, after solution heat-treatment and quenching, the sheets are in a state characterized by good formability, although this state is unstable ("W" temper), and forming must take place in an as-quenched condition, i.e. inside a brief delay after the quench, from roughly ten minutes to a few hours. If this is not possible for production management reasons, the sheet must be stored in a cold room at a sufficiently low temperature and for a sufficiently short duration to avoid natural maturation. In certain cases, it is noted that for excessively short durations after solution heat-treatment, Lüders lines appear after forming, which requires an additional requirement with a minimum waiting period. For voluminous and highly formed parts, this solution heat-treatment requires large-scale furnaces, which makes the operation cumbersome, including in relation to the same operation performed on flat sheet. The possible need for a cold room adds to the costs and drawbacks of the prior art. In addition, the sheet may be deformed after quenching and create problems associated with this deformation, for example, when positioning it in the jaws of the stretch-forming tool. For highly formed parts, this operation may be repeated if necessary, if the material does not have sufficient formability, in its current metallurgical state, enabling it to attain the desired shape in a single operation.
In another current practice, starting from an O-temper sheet, or even T3, T4 or F-temper sheet, an initial forming operation is performed from this temper, and a second forming operation is performed after the solution heat-treatment and quench. This variant is particularly used when the desired shape cannot be performed in a single operation starting from a W-temper, although it may be performed in two passes from O-temper. Furthermore, as O-temper sheets are more stable over time, they are easier to transform. However, the manufacture of O-temper sheets involves a final annealing of the as-rolled sheet, and thus generally an additional manufacturing process, and also solution heat-treatment and quenching on the product formed which is contrary to the aim of simplification covered by the present invention.
Forming complex structural elements in a T8 temper is limited to mild forming because elongation and the ratio Rm/Rp0.2 are too low in this temper.
Note that the optimal properties, in terms of the compromise of properties, must be obtained once the part is formed, particularly as a fuselage element, since it is the shaped part that must particularly have good performance characteristics in terms of damage tolerance in order to avoid excessively frequent repair of the fuselage elements. It is generally accepted that complex deformations after solution heat-treatment and quenching lead to an increase in mechanical strength but with a sharp deterioration in toughness.
U.S. Pat. No. 5,032,359 describes a vast family of aluminum-copper-lithium alloys in which the addition of magnesium and silver, in particular between 0.3 and 0.5 percent by weight, makes it possible to increase the mechanical strength.
U.S. Pat. No. 5,455,003 describes a process for manufacturing Al—Cu—Li alloys that have improved mechanical strength and fracture toughness at cryogenic temperature, in particular owing to appropriate strain hardening and aging. This patent particularly recommends the composition, expressed as a percentage by weight, Cu=3.0-4.5, Li=0.7-1.1. Ag=0-0.6, Mg=0.3-0.6 and Zn=0-0.75.
U.S. Pat. No. 7,438,772 describes alloys including, expressed as a percentage by weight, Cu: 3-5, Mg: 0.5-2, Li: 0.01-0.9 and discourages the use of higher lithium content because of a reduction in the balance between fracture toughness and mechanical strength.
U.S. Pat. No. 7,229,509 describes an alloy including (% by weight): (2.5-5.5) Cu, (0.1-2.5) Li, (0.2-1.0) Mg, (0.2-0.8) Ag, (0.2-0.8) Mn, 0.4 max Zr or other grain-refining agents such as Cr, Ti, Hf, Sc, and V.
US patent application 2009/142222 A1 describes alloys including (as a percentage by weight), 3.4% to 4.2% Cu, 0.9% to 1.4% Li, 0.3% to 0.7% Ag, 0.1% to 0.6%, Mg, 0.2% to 0.8% Zn, 0.1% to 0.6% Mn and 0.01% to 0.6% of at least one element for controlling the granular structure. This application also describes a process for manufacturing extruded products.
Patent EP 1,966,402 describes an alloy that does not contain zirconium designed for fuselage sheets with a primarily recrystallized structure including (as a % by weight) (2.1-2.8) Cu, (1.1-1.7) Li, (0.2-0.6) Mg, (0.1-0.8) Ag, and (0.2-0.6) Mn. The products obtained in a T8 temper are not suitable for forming, inter alia because the ratio Rm//Rp0.2 is less than 1.2 in the directions L and LT.
Patent EP 1,891,247 describes an alloy designed for fuselage sheets including (as a % by weight) (3.0-3.4) Cu, (0.8-1.2) Li, (0.2-0.6) Mg, (0.2-0.5) Ag and at least one element out of Zr, Mn, Cr, Sc, Hf and Ti, in which the Cu and Li contents meet the condition Cu+5/3 Li<5.2. The products obtained in a T8 temper are not suitable for forming, inter alia because the ratio Rm//Rp0.2 is less than 1.2 in the directions L and LT. It was further found that the total energy at break measured by Kahn test which is connected to toughness decreases with deformation and with a more brutal decrease for 6% strain, which poses the problem of obtaining high toughness regardless of the rate of local deformation during forming.
The patent EP 1,045,043 describes the process for manufacturing parts formed by AA2024 type alloy, and notably highly deformed parts, through the association of an optimized chemical composition and special manufacturing processes, enabling the solution heat-treatment on a formed sheet as much as possible.
In the article Al-(4.5-6.3)Cu-1.3Li-0.4Ag-0.4Mg-0.14Zr Alloy Weldalite 049 from Pickens, J. R.; Heubaum, F. H.; Langan, T. J.; Kramer, L. S. published in Aluminum-Lithium Alloys. Vol. III; Williamsburg, Va.; USA; 27-31 Mar. 1989. (Mar. 27, 1989), various heat treatments are described for these alloys with high copper content.
There exists a need for flat-rolled products made of aluminum-copper-lithium alloy presenting improved properties as compared with those of known products, particularly in terms of the balance between static mechanical strength properties and damage tolerance properties even after a high level of strain during forming, while being of low density.
There is also a need for a simplified manufacturing process for forming these products to economically obtain fuselage elements, while obtaining satisfactory mechanical characteristics.

Transformation process of Al—Cu—Li alloy sheets