An image forming apparatus includes an image carrying member, a developing unit, an image density detector, a toner concentration detector, a toner concentration controller, and an output adjustment unit. The image carrying member forms a reference latent image pattern. The developing unit develops the reference latent image pattern as a reference image pattern with a two-component developer. The image density detector detects an image density of the reference image pattern. The toner concentration detector detects a toner concentration in the two-component developer. The toner concentration controller controls the toner concentration based on the image density detected by the image density detector. The output adjustment unit adjusts a toner concentration sensing level of the toner concentration detector with a sensor control voltage. The toner concentration is controlled by a target voltage with reference to the image density. The toner concentration range is changed by changing the sensor control voltage.

1. Field of the Invention
The present disclosure generally relates to an image forming apparatus having an image density detector and a toner concentration detector, and more particularly to an image forming apparatus which adjusts a image density and toner concentration with an image density detector and toner concentration detector.
2. Discussion of the Background
An image forming apparatus includes a photoconductive member, a charger to charge the photoconductive member, an optical writing unit to write a latent image on the charged photoconductive member, a developing unit to develop the latent image formed on the photoconductive member as a toner image with an effect of developing bias voltage, and a transfer unit to transfer the toner image formed on the photoconductive member to a recording sheet.
Such image forming apparatus may further include a toner amount detector, which can be used to detect a relationship between the developing bias voltage and toner amount, and a controller, which controls conditions of the charger, optical writing unit, developing unit, and transfer unit based on a result detected by the toner amount detector.
In such image forming apparatus, the relationship between the developing bias voltage and toner amount can be expressed by a linear function based on information detected by the toner amount detector.
The image forming apparatus may further include a condition storing unit, which stores a plurality of patterns of controlling parameters consisting of parameters for a charger, optical writing unit, developing unit, and transfer unit in advance. Based on the developing bias voltage, the controller can select a pattern of controlling parameters from the condition storing unit, and control the charger, optical writing unit, developing unit, and transfer unit with the controlling parameters selected from the condition storing unit.
In such an image forming apparatus, a two component developer, having toners and carriers, may be used in the developing unit to develop an image on a recording sheet (e.g., transfer sheet).
If an image area ratio produced on the recording sheet becomes smaller, a toner amount to be adhered on the recording sheet becomes smaller, wherein the image area is an area where toner actually adheres on the recording sheet.
If an image area ratio produced on the recording sheet becomes smaller, a frequency of refilling fresh toners in the developing unit may become smaller. Accordingly, a ratio of toners that remain in the developing unit for a longer time becomes greater and such toners may have received an agitation effect of a screw with a longer time, wherein the screw is provided in the developing unit to constantly agitate and transport toner in the developing unit.
Accordingly, a charging potential of such toners may increase, and thereby a toner amount to be adhered on the recording sheet may become smaller because of an imbalance between a latent image potential on the photoconductive member (i.e., image carrying member) and the charging potential of such toners.
Such condition may downgrade a developability of toner, so that an image density on the recording sheet may become lower. In order to compensate for such lower developability of the toner, fresh toners may be refilled into the developing unit, by which a toner ratio against carriers may increase in the developing unit. Accordingly, the toner concentration in the developing unit may increase.
If the toner concentration has increased beyond a specified level, unpreferable phenomenon, such as toner scattering and fogging, may occur. Such unpreferable phenomenon may be suppressed by setting a range for toner concentration.
However, even if the toner concentration in the developing unit is maintained within a predetermined range, a change of developer condition may downgrade a developability of the developer. If the developability of the developer downgrades, an image having lower density may be produced on the recording sheet.
When images of smaller image area are printed continuously with lower image density, the image forming apparatus may control the image density to a preferable level with less emphasis on toner concentration. In this case, the toner concentration may unfavorably exceed the range set for the toner concentration.
In another case, when images of smaller image area are printed continuously with lower image density, the image forming apparatus may control the toner concentration to a preferable level with less emphasis on the image density. In this case, an image density may become unfavorably lower.
FIG. 1 is a schematic view of a conventional image forming apparatus 100, which can be used as a printer, for example. The image forming apparatus 100 includes a photoconductive member 1, a charge roller 2, a laser diode unit 3, a developing roller 4, a transfer unit 5, a transport belt 6, a fixing unit 7, a density sensor 8, and a controller 10, as shown in FIG. 1.
The photoconductive member 1 serving as an image carrying member forms an electrostatic latent image and a toner image corresponding to the electrostatic latent image on its surface, as discussed below.
The charge roller 2 charges the surface of the photoconductive member 1. The laser diode unit 3 irradiates a light beam to the charged surface of the photoconductive member 1 to write the electrostatic latent image on the photoconductive member 1. The developing roller 4 develops the electrostatic latent image on the photoconductive member 1 as the toner image by adhering toner on the electrostatic latent image. The electrostatic latent image is developed as the toner image by using a potential difference between a developing bias voltage and the electrostatic latent image potential.
The transfer unit 5 transfers the toner image from the photoconductive member 1 to a recording sheet at a transfer position (i.e., nip position). The transport belt 6 transports the recording sheet to the transfer position (i.e., nip position) and fixing position. The fixing unit 7 fixes the toner image on the recording sheet. After the toner image is fixed on the recording sheet by the fixing unit 7, the recording sheet is transported to an ejection port (not shown), and ejected to an outside of the image forming apparatus 100. The density sensor 8 detects a toner density of a toner image pattern, which is transferred on the recording sheet.
The controller 10 controls the image forming apparatus 100 as a whole. The controller 10 includes a read only memory (ROM) and non-volatile random access memory (NVRAM), for example. The ROM stores controlling parameters such as developing bias voltage, charging bias voltage, transfer bias voltage, and laser diode power, for example.
The image forming apparatus 100 includes a tandem configuration for the photoconductive members 1 for producing magenta, cyan, yellow, and black images. The following processes are repeatedly conducted at each of the photoconductive members 1.
The charge roller 2 charges the photoconductive member 1, and then the laser diode unit 3 writes an electrostatic latent image on the photoconductive member 1 with a light beam. The developing roller 4 develops the electrostatic latent image on the photoconductive member 1 as a toner image, and then the transfer unit 5 transfers the toner image to a recording sheet.
The image forming apparatus 100 conducts an image density adjustment when images are produced on a predetermined number of recording sheets or when the image forming apparatus 100 is activated and warmed up, for example. Such image density adjustment is referred to as process control, hereinafter.
FIG. 2 is a flow chart for explaining an image density adjustment process (i.e., process control) for the image forming apparatus 100.
In step S101, the charge roller 2, developing roller 4, and transfer unit 5 are activated, and a bias voltage is applied to each unit and a motor is activated.
In step S102, a calibration of the density sensor 8 is activated at a predetermined timing.
As shown in FIG. 3, the density sensor 8 includes an infrared LED (light emitting diode) and a phototransistor, wherein a light beam emitted from the infrared LED reflects on a detection face (e.g., recording sheet) and the reflected light beam is received by the phototransistor.
For example, the infrared LED emits a first light beam generated with an electric current of PWM=128(=255/2) to the detection face, wherein PWM is pulse width modulation.
The phototransistor receives light reflected at the detection face and outputs an output signal. A central processing unit (not shown) receives the output signal of the phototransistor.
The calibration of the density sensor 8 is conducted by setting an output signal of the phototransistor, which corresponds to an output signal of a background area (i.e., no image area) of a recording sheet, as discussed below.
If the output signal of the phototransistor for the background area is greater than 4.1V(=4.0+0.1V), for example, the infrared LED emits a second light beam with another electric current of "PWM(2)=PWM(1)−(PWM(1)/2)" to the detection face. Then, the phototransistor receives a light reflected at the detection face (i.e., background area), and outputs another output signal. The central processing unit (not shown) receives the output signal of the phototransistor.
Hereinafter, PWM(n) means an electric current to be supplied to the infrared LED at each "n-th" time of lighting when the infrared LED emits a light beam for each "n-th" time.
For example, PWM(1) means an electric current to be supplied to the infrared LED when the infrared LED emits a first light beam, PWM(2) means an electric current to be supplied to the infrared LED when the infrared LED emits a second light beam after the first light beam, and PWM(3) means an electric current to be supplied to the infrared LED when the infrared LED emits a third light beam after the second light beam.
If the output signal of the phototransistor for background area is smaller than 3.9V(=4.0−0.1V) for the first light beam, the infrared LED emits a second light beam with another electric current of "PWM(2)=PWM(1)+(PWM(1)/2)." The phototransistor receives a light reflected at the detection face, and outputs another output signal. The central processing unit (not shown) receives the output signal of the phototransistor.
If the output signal of the phototransistor for background area is greater than 4.1V(=4.0+0.1V) for the second light beam, the infrared LED emits a third light beam with another electric current of "PWM(3)=PWM(2)−(PWM(1)/4)." The phototransistor receives a light reflected at the detection face (i.e., background area), and outputs another output signal. The central processing unit (not shown) receives the output signal of the phototransistor.
If the output signal of the phototransistor for background area is smaller than 3.9V(=4.0−0.1V) for the second light beam, the infrared LED emits a third light beam with another electric current of "PWM(3)=PWM(2)+(PWM(1)/4)." The phototransistor receives a light reflected at the detection face (i.e., the background area), and outputs another output signal. The central processing unit (not shown) receives the output signal of the phototransistor.
Such adjustment is repeated until the output signal of the phototransistor can be adjusted within a range of 4.0±0.1V for the background area of the recording sheet.
An output signal of the phototransistor, which is received lastly by the central processing unit (not shown) in the above-described process, is set as an electric current value for calibrating the density sensor 8. Such electric current value can be used for calibrating the density sensor 8 until a next new calibration is conducted for the density sensor 8.
After completing the calibration of the density sensor 8, a detection pattern is formed on the photoconductive member 1 to detect an image density of the detection pattern.
The detection pattern may have a rectangular shape having 20 mm in main scanning direction, and 15 mm in sub-scanning direction, for example.
In step S103, a charge bias voltage is set for a detection pattern PN(1). For example, the charge bias voltage for a detection pattern PN(1) is set to −300V. Hereinafter, each of the detection patterns are referred as PN(n), wherein n represents natural numbers.
After setting the charge bias voltage for the detection pattern PN(1), the laser diode unit 3 emits a laser beam to scan the charged photoconductive member 1 with a maximum value of laser diode power (e.g., 255) in step S104 to scan the rectangular pattern (e.g., 20 mm in main scanning direction, and 15 mm in sub-scanning direction).
When the detection pattern PN(1) comes to a position facing the developing roller 4, a developing bias voltage is set for the detection pattern PN(1) (e.g., −100V).
In steps S105 to S108, detection patterns PN(2) to PN(n) are formed on the photoconductive member 1 as similar to PN(1), wherein the detection patterns PN(1) to PN(n) are formed at a predetermined interval (e.g., 10 mm) in sub-scanning direction, for example. For example, n can be set to ten (n=10) to form ten detection patterns on the photoconductive member 1.
The ten detection patterns are applied with a bias voltage (e.g., 10 μA) by the transfer unit 5 at a transfer position to transfer the ten detection patterns to a recording sheet.
The recording sheet having the transferred detection patterns is transported by the transport belt 6, and the image density of the detection patterns are detected by the density sensor 8 in step S109.
The phototransistor (i.e., photosensor) in the density sensor 8 optically receives a light reflected on the recording sheet.
When no toner images is formed on the recording sheet, an output signal (i.e., electric current) of the phototransistor becomes greater, and when a toner image is formed on the recording sheet, an output signal (i.e., electric current) of the phototransistor becomes smaller because of an increased image density of the detection pattern. With such method, an image density on the recording sheet can be detected.
The output signal of the phototransistor is converted to image density data with a conversion equation for output signal/image density, which is stored in a ROM (read only memory). The image density data can be stored in a NVRAM (non-volatile random access memory) in the controller 10.
In such a process, a graph for detection patterns can be plotted with the image density data and the developing bias voltage, in which the vertical axis of the graph represents the image density, and the horizontal axis of the graph represents the developing bias voltage. A relationship of the image density and the developing bias voltage can be collinearly approximated with a least-square method. The gradient of the straight line can be stored in the NVRAM as a developing coefficient.
The controller 10 computes a developing bias voltage Vb from the developing coefficient and a target amount of toner adhesion. The target amount of toner adhesion can be set to 0.6 mg/cm2, for example.
For example, if the developing coefficient is 2.0 (mg/cm2/kV), the developing bias voltage Vb can be computed as Vb=(1/2.0(mg/cm2/kV))×1000=500V.
After computing the developing bias voltage Vb, the controller 10 refers the table storing image forming conditions in step S110, wherein the table is stored in the ROM.
In step S110, the controller 10 selects a condition, which is closest to the computed developing bias voltage (e.g., Vb=500V) from the table.
FIG. 4 shows an example table, which stores image forming conditions.
In step S111, a charge bias voltage, developing bias voltage, transfer bias voltage, and laser diode power are determined using the table, and such conditions are stored in the NVRAM (non-volatile random access memory) until a next process control is conducted.
In step S112, the controller 10 completes operations for the process control.
Such process control can be conducted concurrently for a yellow, cyan, magenta, and black toner image by detecting detection patterns formed by each color of toner. Accordingly, process controls for yellow, cyan, magenta, and black toner images are conducted in a parallel manner.
In the image forming apparatus 100, a relationship between the developing bias voltage Vb and a charge voltage Vc needs to be maintained at a predetermined level. Especially, when a two-component developer is used, a value computed by "Vb minus Vc" needs to be maintained at a predetermined level to prevent an adhesion of carriers onto the photoconductive member 1.
A change of the charge voltage Vc may cause a change of adhering capability of toner to the photoconductive member 1, a change of transfer-ability of toner image, and unfavorable image development on the photoconductive member 1 by an excessive transfer bias voltage.
Furthermore, a change of the developing coefficient, developing bias voltage Vb, or charge voltage Vc may cause a change of toner adhering capability to a high-lighted area.
The image forming apparatus 100 can detect a relationship between the toner adhering amount and the developing bias voltage as above-mentioned, by which an image density at a shadow area can be stabilized.
Furthermore, the image forming apparatus 100 can adjust a transfer bias voltage to cope with a change of transfer-ability of toners and unfavorable image development on the photoconductive member 1 by an excessive transfer bias voltage.
Furthermore, the image forming apparatus 100 can stabilize a toner adhering amount to the high-lighted area by using a predetermined laser diode power.
As above described, the image forming apparatus 100 includes an image density detector and a toner amount detector. The image density detector optically detects an image density of detection pattern, formed by a process of forming a latent image and toner image. Based on information detected by the toner amount detector, a toner concentration in the developing unit can be adjusted. With a combination of the image density detector and the toner amount detector, the image forming apparatus 100 may stably produce a higher quality image over time.
However, a toner concentration in the developing unit may increase beyond a specified range if only an output signal of the image density detector (e.g., optical detector) is adjusted within one target range of the image density. Such a drawback may occur depending on conditions and a type of developer to be used in the image forming apparatus 100.

Image forming apparatus for controlling variation of image density and toner concentration


A folding electronic device includes an operation unit, a display unit, a memory unit, a pair of speakers, a detection switch, and a switch. A plurality of information input keys are arranged on the operation unit. The display unit is integrated with the operation unit so as to be foldable, and displays at least image information. Sound source data is stored in the memory unit. A pair of speakers for a left channel and a right channel can be driven in a closed state in which the display unit is folded. The detection switch detects the open state in which the display unit is not folded or the closed state in which the display unit is folded. The switch switches paths through which the sound source data stored in the memory unit is output to the pair of speakers on the basis of an output from the detection switch.

The present invention relates to a folding electronic device and, more particularly, to a folding electronic device including left- and right-channel speakers which can be driven independently.
For the purpose of improving portability, most types of portable electronic devices (to be also simply referred to as electronic devices hereinafter) such as cellular phones are configured such that a display unit which displays character information or image information and an operation unit on which keys for information input are arranged are integrated into a foldable unit. As disclosed in Japanese Patent Laid-Open No. 2001-177609 (reference 1), some current folding cellular phones have a music function as well as a telephone function.
Of cellular phones with a music function, popular cellular phones are those which include left- and right-channel speakers which can be driven independently and are designed to improve acoustic quality by outputting stereo sounds. A folding cellular phone having such an arrangement allows the user to enjoy stereo sounds while watching images on the display unit by driving the left- and right-channel speakers even in the closed state of the cellular phone in which it is folded as well as in the open state in which the cellular phone is not folded.
As shown in FIG. 7, a conventional folding cellular phone 50 having left- and right-channel speakers which can be driven independently includes a radio transmission/reception unit 52 which transmits/receives radio signals through an extendible transmission/reception antenna 51, a control unit 53 which forms the main part of the cellular phone 50, a memory unit 55 which stores external sound source data downloaded through the radio transmission/reception unit 52, internal sound source data, and the like as sound source data 54, a detection switch 56 which detects the open or closed state of the cellular phone 50, and a left (L)-channel speaker 57L and right (R)-channel speaker 57R which can be driven independently.
The control unit 53 is comprised of a switching control unit 58 formed of a CPU (Central Processing Unit) which controls the switching operation of a switch (to be described later) in accordance with the detection result obtained by the detection switch 56, a left-channel DA (Digital to Analog) converter 59L and right-channel DA converter 59R which convert the sound source data 54 stored in the memory unit 55 into analog data, and a left-channel amplifier 60L and right-channel amplifier 60R which respectively amplify outputs from the DA converters 59L and 59R. Reference numeral 61 denotes a pull-up resistor connected to a power supply; and 62L and 62R, capacitors.
FIG. 8 shows another conventional cellular phone having left- and right-channel amplifiers formed of BTL (Balanced Transformerless Amplifier) amplifiers. A folding cellular phone 70 includes a left-channel BTL amplifier 72L and right-channel BTL amplifier 72R. The BTL amplifier 72L is comprised of first and second amplifiers 71A and 71B which amplify an output from the left-channel DA converter 59L. The BTL amplifier 72R is comprised of third and fourth amplifiers 74A and 74B which amplify an output from the right-channel DA converter 59R. Phase inversion circuits 75L and 75R are respectively connected to the input terminals of the amplifier 71B of the BTL amplifier 72L and the amplifier 74B of the BTL amplifier 72R. Except for this, the arrangement of this cellular phone is almost the same as that shown in FIG. 7. Therefore, the same reference numerals as in FIG. 7 denote the same components in FIG. 8, and a description thereof will be omitted.
In the conventional folding cellular phones 50 and 70 shown in FIGS. 7 and 8, sounds output from the speakers 57L and 57R flow in laterally opposite directions in the open state and closed state. This results in unnatural sound reproduction in terms of human hearing sense. More specifically, in the open state, stereo sounds are output from the speakers 57L and 57R in synchronism with images on the display unit, and hence natural sounds can be produced in terms of human hearing sense like sounds produced when a car passes by. In the closed state, however, since the positions of the speakers 57L and 57R become laterally opposite to those in the open state, output stereo sounds are not synchronized with images. For this reason, the sounds inevitably become unnatural in terms of human hearing sense.
An audio set designed to improve such unnaturalness in terms of human hearing sense is disclosed in, for example, Japanese Patent Laid-Open No. 2002-78073 (reference 2). As shown in FIG. 9A, in the audio set disclosed in reference 2, a main body 100 includes left and right speaker boxes 103 and 102 respectively housing speakers 107 and 106, which are provided on side surfaces of the main body so as to be pivotal in the back-and-forth direction as indicated by the arrows. This audio set is provided with an angle detection means (not shown) for detecting a state in which the boxes 103 and 102 pivot backward through 90° or more as shown in FIG. 9B. In such an arrangement, when the angle detection means detects that both the left and right speaker boxes 103 and 102 have pivoted backward through 90° or more, drive signals to the speakers 107 and 106 are interchanged.
In the audio set disclosed in reference 2, since control is made to interchange drive signals to the speakers 107 and 106 when the angle detection means mechanically detects that the speakers 107 and 106 have pivoted through a predetermined angle or more, the control becomes complicated. In addition, since this set requires the speaker boxes 103 and 102 housing the speakers 107 and 106, it is difficult to apply this technique to folding electronic devices like folding cellular phones which are required to satisfy conditions for excellent portability in terms of size, weight, and the like.
These problems will be described in detail. In the audio set disclosed in reference 2, the speaker boxes 103 and 102 are configured to pivot backward through 90° or more from the open state to the closed state. For this reason, only when the speaker boxes 103 and 102 have pivoted through 90° or more, drive signals to the speakers 107 and 106 must be interchanged. This complicates the control.
The audio set disclosed in reference 2 is directed to an electronic device which is not required to have portability in terms of size, weight, and the like and allowed to include the speaker boxes 103 and 102 housing the speakers 107 and 106. It is difficult for an electronic device required to satisfy conditions for excellent portability in terms of size, weight, and the like to include the speaker boxes 103 and 102 housing the speakers 107 and 106. Even if a device includes the speaker boxes 103 and 102, it is practically impossible to pivot the speaker boxes 103 and 102 to the back side of the main body.


Information recording discs comprise a disc substrate having a recording layer on one side thereof, one hub having an insertion portion to be inserted into a center hole of the disc substrate and a flange portion to cover the disc substrate in the vicinity of the center hole, at least an apex of the insertion portion being composed of a magnetic material, the hub being inserted into the center hole so that the flange portion is positioned on the recording layer side of the disc substrate, and an adhesive layer is provided between the flange portion and the disc substrate. By this construction, a portion of the hub which protrudes from the back surface of the disc substrate, facing toward the spindle of a turn table can be altered in dimension and/or the diameter of the protrusion portion of the hub can be made smaller than that of the center hole of the disc substrate. Thus, the hub has a large degree of freedom of shape and can have a structure fitted to the shape of a turn table, while still providing a large adhesive surface between the hub and the disc substrate for strength.

Information recording discs to perform storing and reading information by converging rays of light such as laser beam and the like on recording layers of the discs are known, said information recording discs being prepared by laminating at least two plastic disc substrates, each having a recording layer on one surface thereof, directly or via spacers with adhesives so that the recording layers face to each other. A magnet clamping system is one of clamping systems for clamping such information recording discs of the type as referred to above.
In the accompanying drawings, FIG. 4 is a sectional view of an information recording disc, showing the state wherein the disc is going to be clamped by a conventional magnet clamping system, for example, such as disclosed in Japanese Patent L-O-P Publn. No. 167663/1987. In FIG. 4, 1 is an information recording disc, which is so assembled that two transparent plastic disc substrates 2 are laminated together via an inner peripheral spacer 4 and an outer peripheral spacer (not shown) so that recording layers 3 face to each other, hubs 6 are fitted individually from above and below to a center hole 5 of the two disc substrates 2 and bonded with adhesive layers 7 to the top and bottom surfaces of the laminated disc substrate. The information recording disc 1 thus assembled is contained in a cartridge 8 and fitted onto a turn table 9 to effect storing and reading of information. In the turn table 9, it is so designed that a concavity 10 equipped with a magnet 11 and a yoke 12 is provided so as to attract and set the hubs 6 on the turn table 9 and said hubs 6 are positioned by inserting a spindle 13 into center holes of the hubs 6, thereby setting and holding the information recording disc 1 on the turn table 9.
The information recording disc 1 set on the turn table 9 in the manner now described is rotated, and information is stored in or read from the recording layers 3 by irradiation from the bottom with a laser beam or the like through the laminated disc substrate 2.
The information recording disc 1 comprises two disc substrates 2 laminated together, each having a recording layer, and is assembled and used in the manner as illustrated above. When an amount of information to be recorded is small, however, it is taken into consideration that the information is stored or read by means of an information recording disc comprising one disc substrate having a recording layer, said information recording disc being used for storing or reading information likewise after containing it in the cartridge 8.
FIG. 5 is a sectional view of a conventional single substrate type information recording disc which is one of the two parts obtained by simply dividing the information recording disc of FIG. 4 into two halves. That is, this information recording disc 1 is assembled by inserting an insertion portion 6a of a hub 6 having a flange portion 6b into a center hole of a disc substrate 2 having a recording layer 3 from the side opposite to the recording layer 3, and bonding the disc substrate 2 with an adhesive layer 7 to the flange portion 6b. In the same manner as in the case of the information recording disc of FIG. 4, the information recording disc 1 of FIG. 5 is used likewise for storing or reading information after inserting the hub 6 into a concavity 10 equipped with a magnet 11 and a yoke 12 of a turn table 9 to attract the hub 6 thereto, and inserting a spindle 13 into a center hole 14 of the hub 6 to position and set the information recording disc on the turn table 9.
In the conventional single substrate type information recording disc as mentioned above, however, there were such problems that because the flange portion 6b of the hub 6 is positioned at the side of the disc substrate 2 opposite to the recording layer 3, in a case wherein a clamping area 15 on the concavity 10 of the turn table 9 is small in diameter, the diameter of the flange portion 6b becomes small and an adhesive surface thereof also becomes small, and in a case wherein the diameter of the clamping area 15 is the same as or smaller than that of the center hole 5, the flange portion 6b disappears, so adhesion of the disc substrate 2 to the hub 6 is attained only at the edge face of the insertion portion 6a, thus in either case the adhesion strength between the disc substrate 2 and the hub 6 decreases. Further, there was a similar problem when the clamping area formed on the concavity 10 of the turn table 9 is shallow, and when no concavity 10 is present at all in the clamping area 15, that is, when the back surface of the hub 6 and that of the disc substrate 2 are on the same level, there was also such problem that the disc substrate 2 is bonded to the hub 6 only at the edge face thereof.


A semiconductor device includes a III-N layer, a plurality of parallel conductive fingers on the III-N layer, an insulator layer over the III-N layer, and a gate. The plurality of parallel conductive fingers includes a source and drain bus, a plurality of source fingers coupled to the source bus and extending from the source bus towards the drain bus to respective source finger ends, and a plurality of drain fingers coupled to the drain bus and extending from the drain bus towards the source bus to respective drain finger ends, the drain fingers being interdigitated between the source fingers. The gate comprises a plurality of straight and a plurality of connecting sections, each straight section between a source finger and adjacent drain finger, and the connecting sections each joining two adjacent straight sections and curving around a respective source or drain finger end.

Transistors used in power electronic applications have typically been fabricated with silicon (Si) semiconductor materials. Common transistor devices for power applications include Si CoolMOS, Si Power MOSFETs, and Si Insulated Gate Bipolar Transistors (IGBTs). While Si power devices are inexpensive, they can suffer from a number of disadvantages, including relatively low switching speeds and high levels of electrical noise. More recently, silicon carbide (SiC) power devices have been considered due to their superior properties. III-Nitride or III-N semiconductor devices, such as gallium nitride (GaN) devices, are now emerging as attractive candidates to carry large currents, support high voltages, and to provide very low on-resistance and fast switching times.
Multi-finger transistors can be made using III-N semiconductor technology. Some multi-finger transistors include multiple source and drain electrodes ("fingers") that are arranged in parallel to each other and interdigitated. One or more gate electrodes separate the source and drain electrodes and can be used, e.g., to turn a multi-finger transistor on and off.


A mounting assembly contains a plate including a first fringe, a second fringe, a third fringe, and a fourth fringe. The first fringe has a first raised portion, and the second fringe has a semi-circular groove. The plate includes a plurality of first adjusting apertures, at least one pair of second adjusting apertures, and at least one pair of third adjusting apertures. The at least one pair of third adjusting apertures is defined between the at least one pair of second adjusting apertures, a distance between the at least one pair of second adjusting apertures is equal to that of two opposite orifices, two supporting members are symmetrically connected with the third fringe and the fourth fringe, and each supporting member has a plurality of first eyelets so that the first bolt inserts through the through hole to screw with one of the plurality of first eyelets.

A conventional mounting assembly is applied to fix a toilet on a floor of a building as disclosed in U.S. Pat. Nos. 5,421,036, 6,065,160, 6,634,034 and 8,281,421.
With reference to FIG. 1, a toilet flange is connected with an outlet tube via a connecting tube and fixed on the floor, thereafter a wax ring is sealed a gap between the toilet flange and a bottom end of the toilet, and a conventional toilet 1 has two saddle portions 2, each having a fixing hole 3. In addition, the toilet 1 is mounted on the toilet flange 5 by ways of a bolt 4.
As shown in FIG. 2, another toilet 6 cannot be fixed on the toilet flange 5 by using a bolt. Referring further to FIGS. 3 and 4, a conventional mounting assembly for a toilet contains two L-shaped supporting members 7, and each having a horizontal extension 7a on which a fixing hole 7b is defined, such that a first bolt 5a on the toilet is inserted into the fixing hole 7b so as to screw with a nut 5b, thus fixing the two supporting members 7 on the two sides of the toilet flange 5, the each supporting member 7c has a plurality of first orifices 7d relative to a respective one of two second orifices 6b of two longitudinal fences 6a of two sides of the toilet 6. As illustrated in FIG. 2, a second bolt 8 is inserted through the respective one of the two second orifices 6b to screw with a respective one of the plurality of first orifices 7d, such that the toilet 6 is fixed on the toilet flange 5 by means of the two supporting members 7.
However, the outlet of the conventional toilet offsets forwardly or backwardly, the outlet tube of the floor offsets forwardly or backwardly, and a connecting portion of the each supporting member 7 and the toilet 6 offsets forwardly or backwardly as well, so when the toilet 6 does not contact with the floor flatly, thereby using the toilet discomfortably and insecurely.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.


A trusted platform field upgrade system comprises a trusted platform module (TPM) having a volatile memory, the volatile memory having a flag for verifying physical presence in a non-ownership state of the TPM, the TPM configured to enable a field upgrade to the TPM in an operating system (OS) environment based on assertion of the physical presence flag.

The Trusted Computing Group (TCG) develops and promotes industry standard specifications for hardware-enabled trusted computing and security technologies such as a trusted platform module (TPM). A TPM enables secure storage of digital keys, certificates and passwords and is less vulnerable to software and hardware attacks. In general, TPMs are delivered to a customer without an "owner" so that the customer can take "ownership" of the TPM which in turn facilitates enablement/disablement of the TPM and activation/deactivation of TPM capabilities. Once in the field (e.g., "manufacturing complete"), an upgrade to TPM capabilities may be desired or required. However, when a field upgrade is ready to be implemented or executed, ownership of the TPM has not necessarily been established, thereby hindering application of the field upgrade.

Trusted platform field upgrade system and method

Hewlett-Packard Development Company, L.P.


Techniques and mechanisms for providing access to a storage device of a computer platform. In an embodiment, an agent executing on the platform may be registered for access to the storage device, the agent being allocated a memory space by a host operating system of the platform. Registration of the agent may result in a location in the allocated memory space being mapped to a location in the storage device. In another embodiment, the agent may write to the location in the allocated memory space to request access to the storage device, wherein the request is independent of any system call to the host OS which describes the requested access.

1. Technical Field
Embodiments discussed herein generally relate to techniques for accessing a storage device of a computer platform. More particularly, certain embodiments relate to accessing a storage device of a platform independent of a call to a host operating system of the platform to request such access.
2. Background Art
In a conventional computer platform, access control mechanisms are enforced by native file management of a host operating system (OS) on the platform. In a typical example, the host OS may receive a request from an agent of the platform to access some storage medium of the platform. In response to such a request, the host OS will refer to its file management system to determine, for example, whether an access permission indicates that the requested access is to be allowed (or denied). If an access permission is identified as allowing the requested access, the host OS will implement a driver process to access the storage device on behalf of the requesting application.
With continued advancement in various computer technologies (e.g. system management, virtualization, cloud networking, etc.) comes increasingly varied and/or complex relationships between a host OS of a computer platform and one or more agents on (or communicating with) that platform. For example, as computer platforms are asked to support increasingly complex security management operations, basic input/output system (BIOS) provisioning, cloud computing, virtualization and/or the like, such platforms face increasing performance overhead under increasingly time-sensitive performance constraints. For certain types of access to a platform storage device, the need to enforce access control mechanisms via the host OS has, to date, been considered an inherent part of such performance overhead.

Method, system and apparatus for region access control


A liquid discharge device includes a platen, a head unit and an air blower. The platen is configured and arranged to support a medium. The head unit is configured and arranged to discharge liquid on the medium supported by the platen. The air blower is configured and arranged to send air toward the medium supported by the platen. The air blower is attached to the liquid discharge device such that the air sent by the air blower toward the medium flows in a direction at an angle to a normal line direction of the medium.

1. Technical Field
The present invention relates to a liquid discharge device and air blowing method.
2. Related Art
A liquid discharge having a platen for supporting a medium and a head unit for discharging liquid on the medium supported by the platen is already known. Inkjet printers are an example of this kind of liquid discharge device (for example, Japanese Laid-Open Patent Application Publication No. 2005-246908).

Liquid discharge device and air blowing method


A method, non-transitory computer readable medium, and web content management server device that receives a cascading style sheet (CSS) selector expression comprising a plurality of expression components. Whether an equivalent XML path language (XPath) expression can be generated for each of the expression components is determined. Each of the expression components for which an equivalent XPath expression cannot be generated is transformed into a transformed expression comprising at least one XPath expression and an extension function.

A web content management server is a server that optimizes web pages and web page interactions for client devices with special requirements, such as smartphones. By way of example, a client device can send an HTTP request for a web page which is retrieved from a server device by the web content management server. Next, the web content management server can optimize the content of the web page by applying transformation rules tailored to the requesting client device. This optimization process can include extracting content relevant to the requesting client device and adapting the extracted content to fit the specifications of the requesting client device. In order to adapt the content, the web content management server can perform transformations including JavaScript removal, content linearization, and small screen adaptation, for example.
Although this process works well to optimize content for display at the requesting client device, the web page may not function properly when the original content heavily depends on JavaScript technology that cannot be implemented on some client devices. For example, if the requested web page includes JavaScript code responsible for populating form fields, validating form submissions, retrieving data from external resources (e.g., based on AJAX technology), and even generating components that may change the structure of the web page, the page at the client device will not be able to properly function.
Accordingly, JavaScript included in web pages can be removed, stored by the web content management server, and replaced by a hidden field with an identifier, for example. The identifier is subsequently sent by the client device in an HTTP request in response to a web page interaction requiring execution of the JavaScript, such as a request for validation of login credentials. Based on the identifier, the web content management server can retrieve the JavaScript, execute the JavaScript in an emulated JavaScript environment on behalf of the client device, and return a result to the client device.
In some implementations, the emulated JavaScript environment can support application programming interfaces (APIs) such as those defined by hypertext markup language (HTML), events, cascading style sheet (CSS), range, traversal, and views models, for example. Some of the supported APIs can allow web page developers to embed JavaScript defining functionality for accessing a document object model (DOM) associated with a web page in order to perform an operation. For example, the selector API provides CSS selector expressions or queries configured to be applied to a DOM to obtain a result set of elements of the DOM.
However, CSS selector expressions can be difficult to implement, can be complex, and can require specific code or libraries to be implemented. While some CSS selector expressions can be translated into XML path language (XPath) expressions or queries, which are relatively efficient to execute, many CSS selector expressions are not translatable.

Methods for extending a selector application programming interface and devices thereof


The invention discloses an isolated, biologically pure culture of Bacillus amyloliquefaciens strain NRRL B-50349 and its use as an environmentally desirable biofungicide. The invention also discloses a formulation comprising the bacterium and a method for controlling plant fungal diseases and infestation of fungal organisms utilizing the strain.

Diseases caused by fungal species are considered among the most widespread and damaging to plants worldwide. Presently, control of plant fungal diseases is largely dependent upon the application of certain chemicals. Although some of these chemicals are known to have negative environmental and human health problems, nevertheless such chemical agents continue to be in wide use due to their strong activity against important fungal diseases, and limited availability of environmentally safer and effective alternatives.
Generally, biological control of diseases commonly infecting plants in the root zone (rhizosphere) and the leaf zone (phylloplane) are preferred over more traditional synthetic chemical control methodologies. Such biocontrol agents usually cause little or no injury to the plant host or the environment, and some may even favor normal plant development. However, most such biocontrol organisms are typically very limited either in the scope of their effectiveness against fungal diseases, or in their ability to survive under practical field conditions and during treatment applications.
Attempts have been made to control plant fungal diseases by using certain microorganisms. For example, U.S. Pat. No. 5,589,381 (Neyra and Sadasivan, 1996) describes a Bacillus licheniformis strain PR1-36a with some ability to inhibit certain plant pathogens. However, efforts to apply certain live biological control organisms have been greatly limited by the narrow range of their effectiveness against plant pathogens, or by the inherent instability of these organisms. Many strains often succumb within weeks to standard storage conditions, or within hours to typical field conditions involving relatively high temperatures, desiccation after spraying, and harmful effects of ultraviolet sunlight (UV) on the actively growing organism. Attempts to culture such organisms on-site at the location where the biocontrol strain would be applied have found some utility. However, serious difficulties with culture contamination, and the necessity for evening application to avoid temperature and UV effects often prove difficult, labor intensive, expensive, and impractical. Therefore, an environmentally safe and effective biological control method of inhibiting damage to plants caused by fungal diseases has heretofore not been achieved and it remains a long felt need in the agricultural industry over currently used hazardous chemicals.
TAEGRO® is a biofungicide product sold by Novozymes Biologicals Inc. for plant enhancement, growth enhancement, and suppression of certain diseases. The active ingredient is Bacillus amyloliquefaciens strain NZB24, which is also known as Bacillus amyloliquefaciens strain SB3615.
It is an object of the present invention to provide an environmentally favorable and effective biological agent for the control of a broad range of plant fungal diseases and other fungal organisms.

This patent is subject to a terminal disclaimer.


Systems and methods for treating a patient's pain using ramped therapeutic signals for modulating inhibitory interneurons, and associated systems and methods are disclosed. A representative method for treating a patient includes positioning an implantable signal delivery device proximate to a target location at or near the patient's spinal cord, and delivering an electrical therapy signal to the target location via the implantable signal delivery device, wherein the electrical therapy signal has a frequency in a frequency range of from about 1 kHz to about 100 kHz, and wherein the frequency is increased or decreased from a first value to a second value during delivery.

Neurological stimulators have been developed to treat pain, movement disorders, functional disorders, spasticity, cancer, cardiac disorders, and various other medical conditions. Implantable neurological stimulation systems generally have an implantable pulse generator and one or more leads that deliver electrical pulses to neurological tissue or muscle tissue. For example, several neurological stimulation systems for spinal cord stimulation (SCS) have cylindrical or paddle leads that include a lead body with a circular or rectangular/triangular/trapezoidal cross-sectional shape and multiple conductive rings or materials spaced apart from each other at the distal end of the lead body. The conductive rings and/or materials operate as individual electrodes or contacts, and the SCS leads are typically implanted either surgically or externally through a needle inserted into the epidural space, often with the assistance of a stylet.
Once implanted, the pulse generator applies electrical pulses to the electrodes, which in turn modify the function of or information transmitted by the patient's nervous system, such as by altering the patient's responsiveness to sensory stimuli and/or altering the patient's motor circuit and/or internal neural circuit output. The electrical pulses can generate sensations that mask or otherwise alter the patient's sensation of pain. For example, in many cases, patients report a tingling or paresthesia that is perceived as more pleasant and/or less uncomfortable than the underlying pain sensation. In other cases, the patients can receive pain relief without paresthesia or other sensations.

Ramped therapeutic signals for modulating inhibitory interneurons, and associated systems and methods


An image pickup apparatus includes a first white balance adjusting circuit for generating a control signal for white balance adjustment by using a signal output from an image pickup element, a second white balance adjusting circuit for generating a control signal for white balance adjustment by using a signal output from a color measure sensor arranged independently of the image pickup element, and a synthesizing circuit for setting and outputting a variable synthesis ratio of the control signals from the two white balance adjusting circuits in accordance with information from an optical system.

1. Field of the Invention
The present invention relates to an image pickup apparatus and, more particularly, to an image pickup apparatus having a white balance adjusting means.
2. Related Background Art
Conventional white balance adjusting devices of image pickup apparatuses are classified into an outer measure mode device for performing white balance adjustment by an output signal from an external color measure sensor shown in FIG. 1 and a through-the-lens (to be referred to as a TTL hereinafter) device for performing white balance adjustment in accordance with an output signal from an image pickup element, as shown in FIG. 2. Conventional examples will be described with reference to FIGS. 1 and 2.
FIG. 1 is a block diagram of a conventional outer measure mode device. This device includes an image pickup optical system 1a, a solid-state image pickup element 1, a luminance signal processing unit 2, a chromaticity signal processing unit (to be referred to as a chrominance signal processing unit hereinafter) 3, R and B gain control units 4 and 5, differential amplifiers 6 and 7, a modulation unit 8, an adder 9, a color temperature sensor 10, and a control signal derivation unit 11. The solid-state image pickup element 1 is an image pickup element for converting optical information into an electric signal. The luminance signal processing unit 2 performs appropriate processing of an output from the image pickup element 1 and derives a luminance signal Y. The chrominance signal processing unit 3 performs appropriate processing of the output from the image pickup element 1 and derives a low-frequency luminance signal Y.sub.L and chrominance signals R and B. The R and B gain control units 4 and 5 control levels of outputs R and B from the chrominance signal processing unit 3 and output signals R.sub.1 and B.sub.1. The differential amplifier 6 derives a color difference signal R-Y from the luminance signal Y.sub.L and the chrominance signal R.sub.1. The differential amplifier 7 derives a color difference signal B-Y from the luminance signal Y.sub.L and the chrominance signal B.sub.1. The modulation unit 8 derives a modulation signal defined in NTSC or PAL scheme in accordance with the color difference signals R-Y and B-Y. The adder 9 derives a predetermined video signal from the output Y from the luminance signal processing unit 2 and an output from the modulation unit 8. The color temperature sensor 10 comprises a color measure sensor arranged independently of an image pickup element to measure a color temperature of a light source for illuminating an object. The control voltage derivation unit 11 derives a voltage for controlling amplifier gains of the R and B gain control units 4 and 5 in accordance with an output from the color temperature sensor 10.
An operation of the above circuit arrangement will be described with reference to FIG. 1.
A Y signal is derived by the luminance signal processing unit 2 in accordance with an output from the image pickup element 1, and the Y.sub.L, R, and B signals are obtained by the chrominance signal processing unit 3. A color temperature of the light source which illuminates the object is measured by the color temperature sensor 10, and a control voltage to be applied to the R and B gain control units 4 and 5 for correcting white balance is obtained from the control voltage derivation unit 11. The R and B gain control units 4 and 5 output the color signals R.sub.1 and B.sub.1 whose white balance is corrected. A predetermined video signal having the adjusted white balance is derived from the signals Y, Y.sub.L, R.sub.1, and B.sub.1 through the differential amplifiers 6 and 7, the modulation unit 8, and the adder 9.
FIG. 2 is a block diagram of a conventional TTL mode device. Blocks 1 to 9 correspond to the identical blocks in FIG. 1. Averaging units 12 and 13 comprise low-pass filters for averaging the color differential signals R-Y and B-Y and converting them into DC voltages. In accordance with the average signals from the averaging units 12 and 13, a control voltage derivation unit 14 derives a control voltage applied to the R and B gain control units 4 and 5 for correcting white balance.
An operation of the TTL mode device described above will be described below.
Operations of the blocks 1 to 9 are the same as those in FIG. 1. The R-Y and B-Y signals averaged for one frame or several frames by the averaging units 12 and 13 are compared with a specific voltage corresponding to the zero level of the color difference signals by the control voltage derivation unit 14 so as to determine whether the R-Y and B-Y signals have levels higher or lower than the zero level. The control voltage derivation unit 14 outputs a control level so as to set the R-Y and B-Y levels to be closest to the zero level. This control voltage is input to the R and B gain control units 4 and 5 to adjust the white balance.
Still another conventional system as an addition system which is a combination of the outer measure mode and the TTL mode is available in addition to the above two conventional systems.
FIG. 3 is a block diagram showing this addition system.
Referring to FIG. 3, blocks 1 to 14 identical to those in the conventional arrangements in FIGS. 1 and 2. The control voltage derivation unit 11 is referred to as a first control voltage derivation unit, and the control voltage derivation unit 14 is referred to as the second control voltage derivation unit. Adders 27 and 28 add a control voltage from the first control voltage derivation unit 14 and a control voltage from the second control voltage derivation unit 14 at predetermined ratios. The sum voltages from the adders 27 and 28 are used to adjust the white balance.
In the conventional arrangements, a signal from the image pickup element 1 and a signal from the color temperature sensor serving as a color measure sensor 10 arranged independently of the image pickup element are added at a predetermined ratio to appropriately adjust the white balance.
Still another white balance adjustment scheme is also proposed in Japanese Laid-Open Patent Application No. 63-314424 filed by the present applicant. According to this scheme, one of two color measure methods is selected by a detection output to adjust the white balance.
In the above conventional outer measure mode in FIG. 1, precision of white balance adjustment is greatly degraded when light sources which illuminate an image pickup apparatus body and an object due to large separation of the image pickup apparatus body from the object or when a photographic condition is given as a sunset glow.
In the conventional TTL mode in FIG. 2, when the most of the object area is given as a chromatic color area or when most of the frame is occupied with a monotone, precision of white balance adjustment is degraded because the monotone tends to be corrected to white.
In the addition scheme in FIG. 3, although precision tends to be improved by adding the control voltages derived from the outer measure and TTL modes to each other so as to compensate for drawbacks of these conventional schemes, white balance adjusting effects unique to these conventional schemes are mutually cancel each other to degrade the precision. In the example described in Japanese Laid-Open Patent Application No. 63-314424, this scheme serves as a remedy only when an environmental condition is dark. This scheme is not suitable for white balance adjustment when a scene is bright.


A semiconductor chip is bonded onto a die pad portion of a lead frame including nickel/palladium/gold stacked plate layers. Then, a first bonding procedure is carried out with a metal wire of gold pressed against an electrode pad of the semiconductor chip while applying a load of approximately 60 g and ultrasonic waves with a power of approximately 55 mW by using a bonding tool. Subsequently, a second bonding procedure is carried out with the metal wire pressed against an inner lead portion of the lead frame while applying a load of 150 through 250 g and the ultrasonic waves with a power of 0 through 20 mW. In the second bonding procedure, the wire bonding in conformity with the property of the stacked plate layers can be conducted using a large load and a small ultrasonic power, resulting in attaining firm bonding in a short period of time without causing peeling of the gold plate layer.

The present invention relates to a semiconductor device and a method of manufacturing the semiconductor device, in which stacked plate layers in a lead frame can be prevented from peeling in a wire bonding procedure so as to attain high reliability of the connection between a wire and the lead frame.
A recently developed lead frame includes stacked plate layers, which are formed by plating a plate-shaped body of copper (Cu) with nickel as underplate and plating the nickel-plated body with palladium (Pd) and further with gold (Au).
Now, a conventional semiconductor device utilizing the lead frame including such nickel/palladium/gold stacked plate layers will be described.
FIG. 9 is a sectional view for showing the structure of the conventional semiconductor device. As is shown in FIG. 9, the conventional semiconductor device comprises a lead frame 1 including a die pad portion 2, an inner lead portion 5 and an outer lead portion 8, a semiconductor chip 3 bonded and mounted onto the die pad portion 2 of the lead frame 1 with an adhesive agent such as silver paste, and a metal wire 6 for connecting an electrode 4 of the semiconductor chip 3 with a bonding area 5a of the inner lead portion 5 of the lead frame 1. The peripheral area of the semiconductor chip 3, namely, an area including the die pad portion 2, the inner lead portion 5, the semiconductor chip 3 and the metal wire 6, is sealed with a sealing resin 7, so that the outer lead portion 8 of the lead frame 1 projecting outward from the sealing resin 7 can be suitably connected with external equipment.
Next, a method of manufacturing the conventional semiconductor device will be described. FIGS. 10 through 13 are sectional views for showing the manufacturing procedures for the conventional semiconductor device.
First, as is shown in FIG. 10, the semiconductor chip 3 is bonded onto the die pad portion 2 of the lead frame 1 with the adhesive agent such as silver paste (which procedure is designated as a die bonding procedure).
Then, as is shown in FIG. 11, the electrode 4 of the semiconductor chip 3 mounted on the die pad portion 2 is electrically connected with the inner lead portion 5 of the lead frame 1 through the metal wire 6 (which procedure is designated as a wire bonding procedure). This procedure is generally carried out by a nail head bonding method when a gold wire is used as the metal wire. Specifically, a wire bonder having a bonding tool 20 designated as a capillary is used, so that the metal wire 6 with a ball-like tip is pressed against and connected with the electrode 4 of the semiconductor chip 3 in a first bonding procedure and the metal wire 6 is successively pressed against and connected with the bonding area 5a of the inner lead portion 5 in a second bonding procedure. Through these two bonding procedures, the electrode 4 of the semiconductor chip 3 is electrically connected with the bonding area 5a of the inner lead portion 5 through the metal wire 6.
In this wire bonding procedure for connecting the electrode 4 with the bonding area 5a, the first bonding procedure is carried out under conditions of a ultrasonic power of 55 mW and a pressing load of 60 g and the second bonding procedure is carried out under conditions of a ultrasonic power of 90 through 100 mW and a pressing load of 100 g. The metal wire 6 generally has a diameter of approximately 30 through 35 .mu.m.
After completing the wire bonding procedure, the area including the die pad portion 2, the inner lead portion 5, the semiconductor chip 3 and the metal wire 6 is sealed with the sealing resin 7 as is shown in FIG. 12. This procedure is carried out by transfer molding with the lead frame 1 mounting the semiconductor chip 3 placed in a mold.
Ultimately, as is shown in FIG. 13, the outer lead portion 8 projecting outward from the sealing resin 7 is shaped. Thus, the conventional semiconductor device is manufactured.
The semiconductor device manufactured through the conventional manufacturing procedures has, however, the following problem:
FIGS. 14(a) and 14(b) are enlarged sectional and perspective views, respectively, of the vicinity of the bonding area 5a of the inner lead portion 5 in the conventional semiconductor device. As is shown in FIG. 14(a), the lead frame 1 includes a nickel plate layer 10, a palladium plate layer 11 and a gold plate layer 12 successively stacked on a body 9 of copper. The nickel plate layer 10, the palladium plate layer 11 and the gold plate layer 12 have thicknesses of 0.5 .mu.m, 0.03 .mu.m and 0.002 .mu.m, respectively.
At this point, as is shown in FIGS. 14(a) and 14(b), in the bonding area 5a of the inner lead portion 5, a peeled area 13 where the gold plate layer 12 is peeled is found to have been formed in a half circular shape around a tip portion 6a of the metal wire 6 where the metal wire 6 is pressed and cut with the bonding tool 20. The peeled area 13 can reach not only the palladium plate layer 11 but also the nickel plate layer 10 and the body 9 underneath. Due to the peeled area 13, the nickel plate layer 10 can be corroded and the strength in connection with the wire can be degraded. Additionally, a peeled plate material can be disadvantageously adhered to the bonding tool 20 of the wire bonder, so that the ball-like tip of a subsequent wire can be deformed in the subsequent wire bonding procedure (first bonding procedure). Thus, the peeled plate material can cause a wire bonding defect.
As a result of pursuit for the mechanism of causing the peeled area 13 in the second bonding procedure, it is estimated that the plate layer is peeled because the second bonding procedure is carried out with applying a larger ultrasonic power than in the first bonding procedure. Specifically, the current wire bonding procedure is carried out indispensably with applying the ultrasonic waves, the load and heat for instant and firm wire connection, so as to secure a high speed (mass production) and reliability in the connection. Furthermore, the gold plate layer has a thickness as small as possible (approximately 0.002 .mu.m) for decrease in the manufacturing cost. When the electrode of the semiconductor chip is connected with the inner lead portion through the metal wire while applying the ultrasonic waves to the lead frame having such a structure by using the wire bonder, the ultrasonic vibration cannot be sufficiently absorbed within the thin gold plate layer. Therefore, a crack is formed in the boundary between the gold plate layer and the palladium plate layer, particularly the periphery of the area pressed with the bonding tool, so as to ultimately peel the plate layer.

Semiconductor device and method of manufacturing the same


The present disclosure provides a CSI acquisition method. A network side device indicates a CSI feedback configuration group for aperiodic CSI feedback to a UE, and transmits DCI to the UE, the DCI configured to indicate the UE to perform the aperiodic feedback in accordance with an optimum CSI feedback configuration in the CSI feedback configuration group.

In a conventional cellular system, antennae of an antenna array for a network side device (e.g., a base station) are usually arranged in a horizontal manner, e.g., a dual-polarized antenna array where the antennae are arranged in a horizontal manner as shown in FIG. 1A and an linear antenna array where the antennae are arranged in a horizontal manner as shown in FIG. 1B. A beam from a transmitting end of the network side device can merely be adjusted in a horizontal direction, and it has a fixed down-tilt angle in a vertical direction. Hence, various beamforming/precoding techniques are achieved on the basis of channel information in the horizontal direction. Actually, a radio signal is transmitted in a three-dimensional (3D) manner in the space, and it is impossible for a system with the fixed down-tilt angle to acquire optimum performance. The adjustment of the beam in the vertical direction plays a very important role in reducing inter-cell interference and improving the system performance. Along with the development of the antenna technology, an active antenna has been proposed so as to individually control each element. Through this antenna array (e.g., a dual-polarized antenna array where the antennae are arranged in both the horizontal direction and the vertical direction, i.e., in a 3D manner, as shown in FIG. 1C, and a linear antenna array where the antennae are arranged in both the horizontal direction and the vertical direction as shown in FIG. 1D), it is able to dynamically adjust the beam in the vertical direction.
For the 3D antenna array, a signal from the network side device can be beamformed not only in the horizontal direction but also in the vertical direction. In order to enable the network side device to determine a beamforming vector in the vertical direction and enable the beam in the vertical direction to be aligned with a User Equipment (UE), thereby to acquire a maximum beamforming gain, usually it is necessary for the UE to return CSI in the vertical direction.
In the case that the network side device supports a Full Dimension Multi-Input-Multi-Output (FD-MIMO) technique, i.e., supports a CSI beamforming transmission mode, it is necessary for the UE to report the CSI corresponding to an optimum CSI feedback configuration and position information about the CSI, so as to enable the network side device to acquire optimum beam information currently.
However, the UE does not support reporting the CSI corresponding to the optimum CSI feedback configuration and the position information about the CSI in a current aperiodic CSI feedback manner.
In a word, there is an urgent need to provide a CSI acquisition method and a CSI acquisition device, so as to enable the UE to support reporting the CSI corresponding to the optimum CSI feedback configuration and the position information about the CSI in an aperiodic CSI feedback manner.

Channel state information acquisition method and device

CHINA ACADEMY OF TELECOMMUNICATIONS TECHNOLOGY


Refrigerator appliances are provided. A refrigerator appliance includes a cabinet defining a fresh food chamber and a freezer chamber. The refrigerator appliance further includes a fresh food door rotatably hinged to the cabinet for accessing the fresh food chamber, the door comprising an inner surface, an outer surface and a side surface extending between the inner surface and the outer surface. The refrigerator appliance further includes a freezer door connected to the cabinet for accessing the freezer chamber. The refrigerator appliance further includes a mullion, the mullion comprising an outer surface, and a fan mounted within one of the mullion, the fresh food door, or the freezer door, the fan configured to flow ambient air across the mullion.

Generally, refrigerator appliances include a cabinet that defines a fresh food chamber for receipt of food items for storage. Many refrigerator appliances further include one or more freezer chambers for receipt of food items for freezing and storage. Various mullions typically divide the various chambers. For example, a stationary mullion can be disposed between the fresh food chamber and freezer chamber. In refrigerator appliances with multiple freezer chambers, a stationary mullion can be disposed between the freezer chambers. In "french door" style refrigerator appliances, an articulating mullion can be mounted to one of the fresh food chamber doors and positioned between the fresh food chamber doors when closed.
One issue with many known refrigerator appliances is the appearance of condensation on various exterior components thereof. Of particular concern is the appearance of condensation on mullions. Such condensation generally occurs when the surface temperature of the exterior component, such as the mullion, is below the dew point of the room in which the refrigerator appliance is located.
Various attempts to reduce such condensation have been made. For example, electric heaters have been embedded in the various components, such as the mullions, to heat the mullions and reduce condensation. However, the use of such heaters increases the energy use of the associated refrigerator appliance. Additionally, such electric heaters and associated components, such as humidity sensors, can increase the cost and the complexity of wiring of the associated refrigerator appliance.
Accordingly, improved refrigerator appliances are desired. In particular, improved apparatus for reducing mullion condensation which are cost-effective and energy efficient would be advantageous.


In a method for fabricating a FET of the present invention, first and second side walls are formed on a side surface of a gate electrode, and two n-GaAs layers are formed on an active layer by selective growth using the side walls as a mask. After that, the side walls are removed, whereby double recesses are formed around the gate electrode.

A GaAs-Schottkey gate type FET (MES-FET) is used as a high-power and high-frequency device or a low noise device in a microwave communication system. For a high power device, a MES-FET which is fabricated to have a recess structure, that is a portion surrounding a gate electrode which is recessed, has been proposed. In such a MES-FET of the recess structure type, it is known that a double recess structure having two recesses is especially useful or height output property.
A conventional MES-FET includes a semi-insulation GaAs substrate, an n-GaAs active layer, an ohmic electrode, an insulation layer and a gate electrode.
In fabrication, the n-GaAs function layer is formed on the semi-insulation substrate, and the ohmic electrode for a source/drain electrode is formed on the n-GaAs active layer. After that, the insulation layer is entirely formed on the substrate thus processed.
Then, a photoresist layer is formed on the insulation layer, and the insulation layer is etched to form a gate hole thereon by using the photoresist layer as a mask.
Then, the n-GaAs active layer is etched to form a first recess thereon by etching, and the insulation layer is etched on the side surface. After that, the n-GaAs active layer is etched to form a second recess.
Finally, gate metal is evaporated and lifted off to form the gate electrode, whereby the GaAs MES-FET is completely fabricated.
In the GaAs MES-FET fabricated by the conventional method, however, there are disadvantages in that the depth of the recesses is difficult to be stably constant as specified, because the recesses are formed by etching. Therefore, drain current tends to vary in wide range.
Further, a drain current or a break-down voltage for a gate is fluctuated, because the surface for the gate metal deposition is fluctuated at a pre-treatment stage, and the evaporation or sputtering process for the gate metal deposition is unstable. Still further, the control for precisely determining the side-etch amount of the insulation film to provide a predetermined size of the second recess is also difficult to be carried out. For these reasons, a GaAs MES-FET having a high performance is not fabricated with high yield.

Method for fabricating a field effect transistor


A ring oscillator and a phase error calibration method are provided. The ring oscillator may include a first voltage-current converter for controlling and outputting an amount of tail current Itail according to a magnitude of a first control voltage applied in feedback in a PLL circuit; a second voltage-current converter for controlling and outputting an amount of shift current according to a magnitude of a second control voltage applied from a system phase error detector; and differential amplifiers for controlling, for output signals, a delay time of signals based on the applied tail current amount and a shift time of the signals based on the shift current amount. Thus, a phase relation between in-phase and quadrature-phase signals outputted from the ring oscillator may be controlled.

1. Field of the Invention
Apparatuses and methods consistent with the present invention relate to a ring oscillator for calibrating a phase error between in-phase and quadrature-phase signals occurring in wireless communication systems and a phase-error calibration method therefor.
2. Description of the Related Art
In general, communication systems may carry and send data on both an in-phase channel (I-channel) and a quadrature-phase channel (Q-channel). Thus, such communication systems require both in-phase and quadrature-phase oscillation signals having a 90° phase difference therebetween in order to completely restore a desired signal.
Such oscillation signals are used as input signals to a down-converter for converting a signal down to a lower frequency band at a signal-receiving stage, and used as input signals to an up-converter for converting a signal up to a higher frequency band at a signal-transmitting stage. If the in-phase oscillation signal and the quadrature-phase oscillation signal do not form an exact 90° phase difference therebetween, the Bit Error Rate (BER) may become high when a signal is completely restored, so it is critical to generate signals having an exact phase difference therebetween.
In particular, a direct conversion receiver (DCR) that separates signals into both channels at high frequencies more severely exhibits the effect of I/Q phase mismatch. Thus, a phase error occurring between oscillation signals on both channels should be eliminated for precise operation of signal transmitters and receivers.
The methods for generating oscillation signals having a 90° phase difference therebetween may include the method (in a structure developed by Athena Semiconductors, Inc.) that uses a butterfly structure for calibrating a phase error of I/Q signals in a digital signal region and the method that uses Poly Phase Filters (PPFs) for calibrating a phase error of I/Q signals in an analog signal region.
The former structure of Athena Semiconductors, Inc. is for a method that measures the power of in-phase and quadrature-phase signals in order to determine an Rx gain error and measuring correlation of the in-phase and quadrature-phase signals in order to determine the Rx phase error, so as to calibrate the phase error, which has an advantage in that the butterfly structure can be used to calibrate the phase error of in-phase and quadrature-phase signals as well as a gain error.
The latter method does not need any extra circuits for calibrating the error of the in-phase and quadrature-phase signals, and can tune a phase in a wide range.
However, despite such advantages, the former structure of Athena Semiconductors, Inc. has a disadvantage due to calibration difficulties, long processing time due to complicated digital processing if the phase error of the in-phase and quadrature-phase signals becomes large, and requires the assumption that Rx calibrations are accomplished when the Tx calibrations are supposed to be perfect. Meanwhile, the latter method also has a problem in that it cannot be applied to systems that do not use PPFs.

Ring oscillator for calibrating phase error and phase-error calibration method therefor


A docking node transporter tug is disclosed. The tug can dock with various spacecraft to allow access by people between the spacecraft. Further, the tug may dock with other specialty tugs to form a custom system.

Space exploration is a rapidly developing field. The types of spacecraft cover a vast range including manned hard shelled space stations, space shuttles, and satellites—to name a few. There are also plans for inflatable spacecraft that can house people. Whether or not the spacecraft is designed for long term accommodations for astronauts, short term occupancy for conducting experiments or repairs, or even a destination for travel, there is a need to have a way of connecting numerous structures to form a space station or conglomeration of structures to address specific mission parameters.
It would be useful if elements of a space station could be added or detached depending upon mission requirements. Thus, a tug having a multiple access point docking node would be invaluable for attaching several habitable crafts together. Should the mission parameters change such that a multiple entry/access docking node was no longer necessary, then it would be advantageous to remove the docking tug from the station.
What is needed is a docking node transporter tug to allow multiple habitable spacecraft to connect to one another. The tug would be capable of being transported where needed.


Some embodiments of the present invention include apparatuses and methods relating to improved substrate patterning for multi-gate transistors.

In the production of microelectronic products, transistors are typically formed on a substrate and interconnected into integrated circuits that perform numerous useful functions. In some applications, multi-gate non-planar transistors, such as double gate or floating body cell (FBC) transistors, may be employed. In the fabrication of multi-gate transistors, a fin provides the channel region of the transistor. In double gate or FBC transistors, the fin typically includes a silicon element that provides the channel material of the transistor and an insulative cap over the silicon element.
FIGS. 1A-1D illustrate prior art methods of forming a fin for a multi-gate non-planar transistor. FIG. 1A illustrates a silicon on insulator (SOI) substrate 100 including a bulk silicon layer 105, an insulator layer 110, and a silicon layer 115. FIG. 1A also illustrates an oxide layer 120, a nitride layer 125, a hard mask layer 130, and a resist pattern 135.
As illustrated in FIG. 1B, an optional trim step may be performed to trim resist pattern 135 to resist pattern 140. Typically, resist pattern 140 has smaller critical dimensions than resist pattern 135.
As illustrated in FIG. 1C, an etch is typically performed to remove portions of hard mask layer 130 and nitride layer 125 that are not covered by resist pattern 135 to form a patterned hard mask layer 145 and a patterned nitride layer 150. Hard mask layer 130 and nitride layer 125 are typically etched with similar chemistries without an inherent etch selectivity between them.
The etch process that removes portions of nitride layer 125 and hard mask layer 130 has numerous difficulties. For example, as shown, resist pattern 140 is partially consumed during the etch process. The consumption of resist pattern 140 may cause poor profile control in patterned hard mask layer 145 and/or patterned nitride layer 150, and may cause a trapezoidal patterned hard mask layer 145 and/or nitride layer 145 as shown in FIG. 1C. Patterned hard mask layer 145 and patterned nitride layer 150 may also include undesired line edge roughness and poor critical dimension (CD) control. Further, in an effort to make transistors smaller and faster, critical dimensions must be reduced. However, the illustrated method limits the aspect ratio and critical dimension of patterned nitride layer 150 and therefore limits the desired scaling to smaller transistors.
As illustrated in FIG. 1D, resist pattern 140 may be removed, and portions of oxide layer 120 and silicon layer 115 may be removed to form pattered oxide layer 155 and patterned silicon layer 160. Patterned silicon layer 160, pattered oxide layer 155, patterned carbon doped nitride 150, and, optionally, patterned hard mask layer 145 make up a fin 160 that is used to form a multi-gate non-planar transistor by known methods.

Substrate patterning for multi-gate transistors


A construction kit for toy building structures includes a plurality of planar logs with opposed notches at the lateral ends thereof. The logs may be interconnected in a normal position by notch engagement or one atop the other by intermediate mounting plates. Roof logs and/or mounting plates utilize angularly positioned notches to mount logs in an angular relationship relative one to the other. Slider elements mount movable logs in a slidable relationship to a fixed log.

This invention relates to a construction set, and more particularly, to a toy building set having elements therein to build structures of selectable designs with slidable windows, doors and roofs.
Various building sets are known in the art having basic log-like or block-like elements to construct various structures. As most sets enable the user to build basic structures, manufacturers desire to introduce novel elements in such sets which allow various novel functions to be incorporated in the building design.
The present invention introduces a novel toy building set which presents a plurality of elongated, planar building logs intraconnected one to the other or by intermediate locking plates. The logs have upper and lower longitudinal edges with planar webs spanning therebetween. The ends of each log are defined by lateral edges. At the opposed ends of each log are a pair of opposed notches. Each vertical notch has a depth of approximately one-quarter of the width of each log for transverse engagement of a similar notch in another log or in the locking plate. A log likewise engages the opposed remaining notch in the log or mounting plate to allow for a flush mounting between the adjacent longitudinal edges of adjacent logs. A longitudinal sliding capability is Provided for doors and/or windows by means of slider elements similar in configuration to the locking plate. Each slider has a pair of opposed notches with the depth of one notch being one-fourth of the web width with the other notch having twice the depth of the other notch. Such a configuration allows the slider and an accompanying sliding log to be engaged to an adjacent fixed log in a flush slidable relationship therebetween. Roof logs present angled notches which allow for construction of a slanted roof along the top of the building proper.
It is therefore an object of this invention to provide a toy building set having interlocked planar logs therein.
It is another object of this invention to provide a building set, as aforesaid, which allows for construction of a slanted roof thereon.
A still further object of this invention is to provide a building set, as aforesaid, which has elements for mounting planar logs adjacent one another in a slidable over/under relationship therebetween.
Another particular object of this invention is to provide a building set, as aforesaid, having a plurality of planar logs which are interengageable so as to provide generally planar wall surfaces.
A still further object of this invention is to provide a building set which allows for a slidable relationship between fixed and movable logs.
Another particular object of this invention is to provide intermediate mounting plates in said building set, as aforesaid, which mounts the logs in a planar over/under relationship therebetween.
A further object of this invention is to provide a building set with mounting plates, as aforesaid, which mounts first and second planar logs in an angular relationship therebetween.
A further particular object of this invention is to provide a building set, as aforesaid, with the planar logs capable of being mounted in an angular relationship therebetween.
A further object of this invention is to provide a building set, as aforesaid, having a plurality of planar logs of various lengths which are capable of being mounted one to the other or by use of intermediate mounting plates.
Other objects and advantages of this invention will become apparent from the following description taken in connection with the accompanying drawings, wherein is set forth by way of illustration and example, an embodiment of this invention.


A method of tracking seismic activity through monitoring sunspots and sun disturbances and correlating them with a developed model in order to map out specific locations where an earthquake will consequently appear is provided (FP). The method of comprises mapping coordinates of electromagnetic disturbances on the sun, calculating the coordinates while taking into consideration Earth/sun geometry and relative positions (FP). These coordinates are consequently mapped to a location and time on earth wherein the location and time predicts the location and approximate time of the earthquake, which will consequently occur on earth.

Earthquakes are natural disasters generated by seismic waves and tectonic pressure. They are currently understood to be unpredictable and can be very destructive. Statistics show that during one year, more than 20-30 cases of strong and destructive earthquakes occur over the whole planet.
The time and location of earthquakes are understood to be non-predictable and are one of the major concerns in the world. The consequences may be harsh due to the destructive nature of the earthquake itself, as well as from its secondary effects such as fires, pollution, floods, etc.
At this time science is unable to predict the exact time and location of an earthquake through current scientific methods.
From all of the planets in our solar system, Earth is unique and is the only planet to exhibit tectonic activity (other similar planets, such as Mars and Venus, show signs of volcanic activity in the past but there appears to be no evidence of tectonic activity neither in the past nor today). The earth's crust is divided up into tectonic plates that move around the lithosphere. These plates buckle and grind up against each other at the edges. These plates are constantly active (due to convection processes that cause different phase changes by the core's heat, gravity and radioactive emissions from within the Earth). These different forces act together to cause earthquakes.
Before an earthquake takes place, the pressure and friction between the rocks builds up until it reaches a 'critical point' (the Earth's crust is made up from different minerals; mostly containing oxygen, that are locked into crystals). Electro-magnetic pulses are generated through these minerals (see, for example, in Freidman, January December 2005 and Brent D. Johnson, Spectrophotometer Observes Radiation from Rocks, (accessed 23.12.05) and are released into the Earth's atmosphere. The electromagnetic pulses that are emitted from Earth's crust into the atmosphere are characterized by coherent light and continue their spectral signature when they hit the sun's photosphere. Reed et al. in THz Science and Technology Network, terahertz (THz) radiation, Physical Review Letters, 13 Jan. 2006 found that measurable coherent light can be observed emerging from the crystal in experiments, whereby coherent light was produced by shock waves through a crystal.
The sun's photosphere is a thin layer that is highly sensitive to electro-magnetic changes (like the Earth's ionosphere). The model correlates sunspot disturbances and maps them to relative locations on Earth. In addition, the pattern of these disturbances, outlined in the EMI archive, exhibits unique characteristics that emanate from different source locations from Earth (drawing on crystallography, spectroscopia, and optical non-linearity).
In this way, the Earth may be compared to a pulsing projector (like a pulsar) where the sun acts as a responsive surface reflecting the pulses that leave their traces on its photosphere.
Scientific research has been driven by the relative size and energy levels of the Earth in relation to the sun, which has influenced past and current scientific research to explore the effect of the sun on the Earth. Notably, fewer sunspot activities have been recorded during The Little Ice Age (See FIG. 8a) but the exact relationship between sun disturbances and earthquakes has not been previously understood. The inventor of the present invention has developed a model that reverses the pre-supposition that the sun is acting on the earth, and suggests that the sun is exhibiting traces that are initiated on Earth. These traces can be identified as sun disturbances that evolve as local reactions that act in response to the trigger, which is the pre-earthquake activity.
In accordance with that, it must be presumed that the increase in seismic activity correlates directly with the number and specific location of sun disturbances taking into consideration the influences of the seasonal changes of the magnetic poles of the sun and their relationship to Earth. The correlation may be discerned once the properties of the declination, Earth's inclination, and the sun's BO angle between the Earth and the sun are determined. The disturbances may then be mapped to the past or potential location of an Earthquake epicentre. Using this 10-step model that is illustrated in FIG. 1, the inventor of the present invention tracked sun disturbances and cross-checked them over a period of four years to illustrate an occurring frequency, relative location, and global pattern as will be shown herein after. The model enables a correlation of the pertinent data and demonstrates not only a documentation of past earthquake activity, but can also be successfully implemented to predict future earthquake activity.


An automotive vehicle windshield sunshade includes a shade that can be folded horizontally in an overlapping manner for resting on a top of a vehicle dashboard when it is not used. At least two attaching points attach a bottom edge of the shade to the dashboard. A hook with a handle attaches to a top fold of the sunshade and may hook over the supporting beam of rearview mirror and hang the sunshade opened.

Vehicles, particularly cars are commonly parked unattendedly at some placed exposed to sunlight. Sunlight can go through transparent windows and heat up interior of a vehicle. Among all windows, a windshield allows least tinting or darken for reducing sunlight penetration; yet a dashboard directly beneath a windshield is designed to absorb sunlight to a maximum level so it do not cause gaze reflection to incident into driver's sight. That also means generating most heat when sunlight shines upon it.
The foldable sunshades of the present invention may be extended behind the windshield of a parked automobile to act as a barrier to sunlight, reducing heat buildup within the vehicle interior from exposure to sunlight.
In general, vehicle sunshades may be positioned to shield a vehicle interior from either an interior or exterior location. As an example, interior sun shades include folding cardboard sun shades for placement behind vehicle windshields such as those illustrated in the patent to Levy, U.S. Pat. No. 4,202,396. Other types of interior windshield sun shades include fan-like venetian blind arrangements, and designs consisting of fabric supported by elongated loops of spring-like material. The patent to Soukup, U.S. Pat. No. 1,927,137, shows an adjustable glare shield, for use within a motor vehicle. The patent to Lessard, U.S. Pat. No. 3,373,792, discloses an automobile rain visor. The patent to Surtin, U.S. Pat. No. 4,332,414, shows an automobile window shade device, comprising a pair of duplicate fan-shaped protectors for mounting to an automobile window. The patent to Maguire, U.S. Pat. No. 4,606,572, shows a similar type of dual fan arrangement for providing a sunshade for an automobile. The patent to Tung-Chow, U.S. Pat. No. 4,681,149, discloses window blinds for a vehicle, incorporating suction cups for adherence to a supporting surface adjacent the automobile window. The patent to Cheny, U.S. Pat. No. 3,046,048, discloses what is a magnetically secured windshield cover, which overlies and remains contiguous with the exterior of the automobile windshield.


This is an instrument for applying tension to a metal surgical cable used in certain surgical procedures. The cable tensioner has a ratchet feature which has the ability to steadily increase the tension in the cable. Also included is a scale incorporated into the cable tensioner so that the tension in the cable is directly measured and indicated at all times. Finally, the cable tensioner is ergonomically designed into an elongated cylindrical shape to easily fit in the cupped hand of a surgeon.

The present invention relates generally to a device for tensioning cable, and in particular, to a device for tensioning surgical cable in a variety of medical procedures.
Surgical cable is used in reconstructive spine surgery involving fusions, spine trauma surgery, total hip arthroplasty, fracture fixation, and other trauma surgery. Depending upon the application, the surgical cable can either be monofilament wire or a multifilament cable.
In a typical medical procedure in which surgical cable is utilized to secure two body parts together, a small permanent loop is made at one end of a length of surgical cable and held permanently by a tubular crimp member. The cable is wrapped around the two body parts and then the loose end of the cable is threaded through the permanent loop. A flanged tubular crimp member, sometimes referred to as a "tophat" because of its appearance, is threaded onto the loose end of the cable and slid down to abut the small loop. A cable tensioning device is then attached to the loose end of the cable. The tensioning device draws the cable through the small loop and tophat until the tension in the cable wrapped around the two body parts has achieved a desired amount. Next, the tophat is crimped in order to preserve the tension in the cable wrapped around the body parts and allow the cable tensioning device to be withdrawn. Finally, the loose cable extending from the crimped tophat is trimmed as necessary.
It is often desirable and usually critical that the tension in the surgical cable be ascertainable and controllable. Thus, it is desirable that the surgical tensioning device have the ability to tension the surgical cable in a controlled manner and afford the physician the ability to directly determine the tension in the cable at any time. In addition to these requisites, a usable surgical tensioning device should be designed in form and function to be ergonomic, easy to use, and reliable.