Excess voltage is prevented from flowing through an electric storage cell. Included are an inductor, a first switching device, a second switching device and a control section supplying a control signal to control ON/OFF operations of the first switching device and the second switching device, to the first switching device and the second switching device, where the control section supplies the control signal so that the first switching device and the second switching device repeat ON/OFF operations alternately when a voltage of the first electric storage cell and a voltage of the second electric storage cell are lower than a predetermined value, and the control section supplies a control signal to stop the balance correction apparatus, when at least one of the voltage of the first electric storage cell and the voltage of the second electric storage cell is equal to the predetermined value or larger than the predetermined value.

1. Technical Field
The present invention relates to a balance correction apparatus and an electric storage system.
2. Related Art
Many electric storage cells connected in series may be used. In that case, when there is variation caused between voltage of these electric storage cells, the capacity of the electric storage cells cannot be effectively made use of to result in reduction in the availability of electricity amount. So as to tackle with this problem, a balance correction circuit that includes an inductor, a switching device, and a driving circuit for the switching device has been proposed to equalize the voltage of electric storage cells (Please refer to Patent Documents No. 1-No. 3).

Balance correction apparatus and electric storage system


The embodiment of the present invention relates to the technical field of wireless communication, and particularly to a method and a device for resource allocation, which are used to solve the problem existing in the prior art that, when an inter-neighborhood interference coordination method is used to reduce interference, it often results in a low resource utilization rate in neighborhoods or a limitation on the transmission power, which wastes the hardware resources in a base station and increases power consumption. The method in the embodiment of the present invention comprises: at least two frequency sub-bands are determined in a carrier bandwidth, wherein the central frequencies of frequency sub-bands are different, and there is an overlapping area in the frequency domain between at least two frequency sub-bands from all frequency sub-bands; the determined frequency sub-bands are allocated to individual neighborhoods in a deployment area, and the frequency sub-band allocated to a neighborhood is used as the system bandwidth of that neighborhood. By using the method in the embodiment of the present invention, the inter-neighborhood interference in common uplink channels and common downlink channels is decreased effectively, and thus the limitation on transmission power in those neighborhoods is reduced, which increases the available signal transmission power in the neighborhoods to a certain extent and at the same time reduces the hardware costs of the base station and power consumption, without increasing the costs for network deployment.

For a Long Term Evolution (LTE) system, interference in the system primarily results from inter-cell same-frequency interference. A general method for lowering inter-cell interference is to obviate interference by using an inter-cell interference coordination method. A general principle thereof is to limit the use of resources in an inter-cell coordination way, where available time and frequency resources are limited or transmission power is limited over specific time and frequency resources. A simple implementation method is to perform static inter-cell interference coordination, as illustrated in FIG. 1, in which there are two schemes:
In the first scheme, the entire system bandwidth is divided into four segments, where only one of three sub-bands A is available to each cell at the edge of adjacent cells, and only sub-band B is available at the center of the cell. It can be seen that at this time the entire system bandwidth can not actually be used by any cell for working, that is, for any cell, there are idle sub-bands in which no signal can be transmitted, but hardware devices of the cell still support the cell to work throughout the system bandwidth (i.e., 3A+B), thus resulting in costs of the hardware devices and useless power consumption.
In the second scheme, the entire system bandwidth is divided into three segments, where only one of three sub-bands A is available to each cell at the edge of adjacent cells, and only the entire system bandwidth is available at the center of the cell. However at this time, transmission power at the center of the cell need be lowered in order to alleviate interference of a user at the center of the cell to another user outside the cell. It can be seen that although at this time the entire frequency band can be used by any cell for working, transmission at full power can not be performed, thus reducing power amplification efficiency.
The foregoing inter-cell interference coordination schemes are applicable only to physical downlink shared channels and physical uplink shared channels, and for broadcast channels, synchronization channels, control channels and other common channels in LTE, since their occupied time and frequency resources are relatively fixed, interference can not be obviated by the simple resource coordination way. Moreover, although the existing inter-cell interference coordination schemes can lower inter-cell interference of shared channels effectively, they can not be applicable to transmission of broadcast, synchronization, control channels and other common channels; and when applied to shared channels, there are problems of wasting hardware resources in a base station and increasing useless power consumption. Furthermore, costs of network deployment are also increased.
In summary, lowering interference in the inter-cell interference coordination schemes at present typically results in a low resource utilization rate of the cell or a limitation on the transmission power, and consequently a waste of hardware resources in the base station and an increase in power consumption.

Method and device for resource allocation

DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD


Provided is a method for producing a high-quality boron nitride film grown by using a borazine oligomer as a precursor through a metal catalyst effect. The method solves the problems, such as control of a gaseous precursor and vapor pressure control, occurring in CVD (Chemical vapor deposition) according to the related art, and a high-quality hexagonal boron nitride film is obtained through a simple process at low cost. In addition, the hexagonal boron nitride film may be coated onto various structures and materials. Further, selective coating is allowed so as to carry out coating in a predetermined area and scale-up is also allowed. Therefore, the method may be useful for coating applications of composite materials and various materials.

1. Field
The present disclosure relates to a method for producing a hexagonal boron nitride film by using a borazine oligomer as a precursor and a boron nitride film obtained thereby.
2. Description of the Related Art
Boron nitride (also referred to as BN hereinafter) is a material having a boron atom (atomic number 5) and a nitrogen atom (atomic number 7) bound to each other at a stoichiometric ratio of 1:1. Between the boron atom and the nitrogen atom bound to each other, a strong sp2 covalent bonding is formed. In addition, weak van der waals force is present between two layers of boron nitride. Due to the difference in interatomic distance and in distance between two layers of boron nitride depending on bonding structures and types, different structures, such as cubic-boron nitride (c-BN), hexagonal-boron nitride (h-BN) and wurtzite-boron nitride (w-BN), are present.
Among those, hexagonal boron nitride (white graphene, h-BN) film is an insulator and is transparent and flexible. Basically, it is stable at high temperature, has thermal properties characterized by high heat conductivity, and shows mechanical properties, including a low elastic modulus and heat expansion coefficient, and high heat resistance and thermal shock resistance. In addition, such a hexagonal boron nitride film has a low dielectric constant and dielectric loss and shows a band gap of about 5.5-6.06 eV, thereby providing characteristics as a dielectric material. Meanwhile, it has a hexagonal structure, which is the same as the structure of graphene, a two-dimensional material having excellent physical properties and shows a lattice mismatch of merely about 1.7%, and thus may form various structures together with graphene. Therefore, by virtue of the excellent thermal properties, mechanical properties, electrical properties and structural characteristics as described above, a hexagonal BN film may be used for various industrial fields, and may be utilized particularly as a next-generation electronic material.
There are several methods for producing a hexagonal boron nitride film. Typical methods include a mechanical method, chemical exfoliation of bulk flake, vapor deposition using sputtering, ion implantation, atomic layer deposition (ALD), or the like. Particularly, chemical vapor deposition (CVD) method is used most frequently.
The mechanical method includes exfoliation of at least two layers of hexagonal boron nitride using Scotch tape. Upon exfoliation, weal van der waals force exists between two layers of boron nitride. Thus, the mechanical method is problematic in that it is limited in size of the exfoliated hexagonal boron nitride and in productivity.
The chemical exfoliation of bulk flake includes exfoliating bulk flake of hexagonal boron nitride by way of sonication in the presence of a solvent, such as dimethyl formamide and dichloroethane. The hexagonal boron nitride exfoliated by the chemical exfoliation has problems of its limited size and thickness control.
The CVD method includes gasifying borazine to allow its flow, decomposing borazine into boron and nitrogen at high temperature and allowing the reaction of boron and nitrogen on the surface of a specific metal catalyst substrate to form a hexagonal boron nitride film. The hexagonal boron nitride film obtained by the CVD method has low defects. However, the CVD method is problematic in that the film thus obtained has a different number of layers due to the difference in growth rate, an expensive gas controller or vacuum system is required, and gases showing a difficulty in handling are used.

Method for producing hexagonal boron nitride film using borazine oligomer as a precursor

KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY


Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.

1. Field of the Invention
The present invention relates to equipment for polishing both sides of a rectangular substrate, such as a glass substrate, a quartz substrate, a sapphire substrate, a GaAs substrate, or a silicon substrate, etc., simultaneously in order to planarize the substrate and reduce the thickness thereof, and a method to planarize both sides of the rectangular substrate. In particular, the double-sided polishing equipment for the rectangular substrate is typically used to polish both sides of a glass plate for LCD devices, between which liquid crystal is injected, a glass laminate for a flat panel display, or a glass substrate for a display device, within which electrodes are provided and between which liquid crystal is injected.
2. Description of the Related Art
Glass plate for LCD devices, between which liquid crystal is injected, or glass substrates for display devices, within which electrodes are provided and between which liquid crystal is injected, are known and used for LCD panels. (For example, see Japanese Unexamined Patent Application Publication 2003-255291, Japanese Unexamined Patent Application Publication 2004-21016, and Japanese Unexamined Patent Application Publication 2005-3845.)
Typically, the thickness of rectangular glass plate used for such LCD panels is reduced by grinding the surface or using a lapping process. Furthermore, its ground or lapped surface is planarized by an etching process or a polishing process performed on each side or on both sides at the same time.
Either a method of polishing both sides of the rectangular glass plate with polishing pads at the same time, or a method of separately polishing each side can be used. The double-sided polishing method has a carrier main body forming a gear part around the periphery and provides a pocket about the size and shape of the rectangular glass plate. The carrier main body has a supporting member placed between the flat edge of the rectangular glass plate and the perimeter part of the pocket provided in the carrier main body. The carrier main body is made from a high rigid material. Further, the carrier is typically made of a flexible material that is not prone to damaging the rectangular glass plate at least when the contact site of the supporting member of the glass plate with the rectangular glass plate is brought into contact with the rectangular glass plate. When the rectangular glass plate is supported by the carrier, a driving mechanism for the double-sided polishing equipment will rotate the carrier by means of a gear part on the carrier main body to rub both sides of the rectangular glass with a pair of round polishing pads that are coaxial in order to polish both sides of the rectangular glass plate. (For example, see Japanese Unexamined Patent Application Publication H6-218667.)
As a method of polishing LCD devices, another manufacturing method is suggested in which a spacer member is provided on one glass substrate on which a driver for driving liquid crystals is to be fitted so as to polish liquid crystal cells after the processing vertical and horizontal dimensions of liquid crystal cells. A pair of rectangular glass substrates in a product size are rubbed with a pair of round polishing pads provided coaxially at centers of axes of the polishing heads on both sides of the liquid crystal cell (rectangular glass plate) in order to make the liquid crystal cell thinner. (For example, see Japanese Unexamined Patent Application Publication 2003-255291.)
As a method of polishing each side of a large rectangular glass plate with the polishing pad, a polishing method for a rectangular glass plate is suggested, including a process of putting a rectangular glass plate into a film frame where the film on which a rectangular glass plate can be applied is applied. The method includes attaching the frame to the carrier or a process of attaching the film frame where the film on which a rectangular glass plate can be applied is applied onto the carrier. The method further includes applying the rectangular glass plate onto the film frame and a process of polishing by moving the carrier on which the film frame is attached and the polishing pad closer to each other. The method further includes pressing the surface to be polished of the rectangular glass plate applied on the film onto the polishing pads, and a process of, after polishing the rectangular glass plate, removing the film frame from the carrier and then the rectangular glass plate from the film frame or a process of, after polishing the rectangular glass plate, removing the rectangular glass plate from the film frame and then the film frame from the carrier. (For example, see Japanese Unexamined Patent Application Publication 2004-122351.)
The method of polishing each side of a rectangular glass plate has the advantage that the rectangular glass plate hardly deviates from the polishing equipment during polishing. However, polishing each side separately requires more polishing-process stages as well as a procedure to turn over the rectangular glass plate halfway through the process, so polishing equipment becomes more bulky than double-sided polishing equipment that can polish both sides of a rectangular glass plate at the same time. In other words, single-sided polishing equipment requires a big footprint, which is a disadvantage.
Although double-sided polishing equipment has the advantage of shorter polishing time than is necessary for the method of polishing each side separately, there is a concern that, while polishing, the rectangular glass plate within the carrier may deviate from the polishing equipment if the substrate is thin, with differences in thickness of up to 1 mm.

Equipment and method for polishing both sides of a rectangular substrate


A tape measure device for measuring lengths is provided. The tape measure device comprises a housing having a slotted opening. A retractable measuring tape is wound within the housing with the measuring tape having a free end extending through the slotted opening and a secured end secured within the housing and the measuring tape being alternatingly extractable from and receivable into the housing. A viewing slot is formed in the measuring tape. A triangular-shaped tab is secured to the free end of the measuring tape. A rotating mechanism provides rotation of the tab relative to the free end of the measuring tape.

1. Field of the Invention
This invention relates generally to a tape measure device and, more particularly, the invention relates to a tape measure device having a triangular tab pivotably attached to the end of the tape measure.
2. Description of the Prior Art
One of the most basic tools required for making accurate measurements, a tool that can be used for literally hundreds of applications, is a tape measure. Tape measures provide an accurate means of measurement for virtually any purpose and are available in varying lengths.
Tape measures are made available in versions having tape enclosure casings of durable plastic or metal, with the retractable tape generally being manufactured from spring steel. Carpenters and many other types of tradesmen, cabinetmakers, do-it-yourselfers, and others extensively use tape measures. Although tape measures are very effective measuring tools, anyone that has ever used a tape measure has experienced the problem of trying to check for squareness of a rectangular or diagonal surface with corners, when the starting point is in a corner. The end of a tape measure is squared off on the end and the only way to take an accurate measurement is to have another individual hold the end of the tape in place on the number 1. This problem is frequently experienced in many situations and takes more time than it does when taking measurements without the assistance of another person.


A food menu having electronic labels is disclosed. The food menu comprises at least one ordering page and at least one electronic label. Each ordering page has at least one product data. The electronic label is installed on the ordering page, and each electronic label includes an IC data, a first sensing unit, a second sensing unit and a fixed pad. The IC data is corresponding to the product data. The fixed pad is provided for fixing the first sensing unit and the second sensing unit, and enabling the first sensing unit to rotate. When the customer rotates the first sensing unit till the first sensing section of the first sensing unit corresponds to the second sensing section of the second sensing unit, the electronic label is triggered to generate a sensing signal for transmitting the IC data of the product so as to select the product data corresponding thereto.

(a) Field of the Invention
The present invention relates to technology of the Radio Frequency Identification (RFID), and more particularly to a food menu having electronic labels based on the RFID technology.
(b) Description of the Prior Art
Traditionally, when the customer proceeds to order in the restaurants, the service personnel writes the desired ordering, such as the name, the quantity and the flavor of the ordered, by hand on the order slip, then the order slip is delivered to the kitchen, this is not only time-consuming and laborious but also easy to make mistakes. Once the order slips are lost carelessly or miswritten by service personnel resulted in out-of-order service, thereby may cause the customer's complaints, and further influence the business due by reduced number of customers.
Additionally, a conventional portable food menu mentioned is disclosed in which the electronic label is associated with each dish inside the food menu page, meanwhile, the service personnel are equipped with a portable sensing device. After the customer tells the service personnel what he/she would like to order, the service personnel takes order for customers by the radio portable sensing device to display the dish information, such as dish name, on the display interface of the portable sensing device. Such information is thus transmitted from the local area network of the restaurant to the server, and then transmitted to the kitchen for the further serving procedure. Lastly, the ordered food is placed on the customer's table.
However, the drawback of the conventional portable food menu lies in that the service personnel has to provide assistance to the customer for ordering, for example, as the customer wants to order the dish listed on the first page or any other pages, the service personnel has to use the portable sensing device to instantly sense that dish's electronic labels on the food menu. This ordering method is not only labor-consuming, but also imperceptibly prolongs the operation procedure for serving the food to customers in the restaurant.
In view of the drawbacks of the prior art, the inventor of the present invention based on years of experience in the related industry to conduct extensive researches and experiments, and finally developed a food menu having electronic labels in accordance with the present invention to overcome the aforementioned drawbacks.


A fabrication system for a liquid crystal display device includes an alignment layer line for forming an alignment layer on a first substrate and a second substrate, the first substrate and the second substrate being separately supplied thereto, a spacer scattering line for scattering spacers on one of the first substrate and the second substrate, a sealant coating line for coating a sealant material on one of the first substrate and the second substrate, an assembling line for bonding the first and second substrates together, a cutting line for separating the bonded first and second substrates into a plurality of liquid crystal display cells, and a liquid crystal layer line for injecting liquid crystal material into each of the liquid crystal display cells, wherein the alignment layer line, the spacer scattering line, the sealant coating line, the assembling line, the cutting line, and the liquid crystal line are positioned along a single fabrication line.

1. Field of the Invention
The present invention relates to a fabrication system of a display device and a method of fabricating a device using a fabrication system, and more particularly, to a fabrication system of a liquid crystal display (LCD) device and a method of fabricating a liquid crystal display device using the fabrication system.
2. Description of the Related Art
LCD devices are commonly implemented in various types of electronic equipment, such as mobile telephones, personal digital assistants (PDA), and notebook computers, due to their light weight, slim shape, and high image definition. Among the different types of LCD devices, active matrix TFT (thin film transistor) LCD devices have rapid response times and produce lower amounts of residual images.
FIG. 1 is a schematic circuit diagram of an LCD device according to the related art. In FIG. 1, a liquid crystal display panel 1 includes a plurality of gate lines 3 disposed along a first direction and a plurality of data lines 5 disposed along a second direction perpendicular to the first direction, thereby defining a plurality of pixel regions. In addition, a thin film transistor (TFT) 7 is arranged within each of the pixel regions and is enabled when a scan signal is input through the gate line 3 in order to supply a data signal input through the data line 5 to a liquid crystal layer 9. Moreover, a storage capacitor 11 is provided for maintaining the input data signal until a next scan signal is supplied.
FIG. 2 is a cross sectional view of an LCD device according to the related art. In FIG. 2, a gate electrode 22 is formed on a lower substrate 20, and a gate insulating layer 24 is deposited on an entire surface of the lower substrate 20. In addition, a semiconductor layer 26 is formed on the gate insulating layer 24, and source/drain electrodes 28 are formed on the semiconductor layer 26. Furthermore, a passivation layer 32 is deposited over an entire surface of the lower substrate 20, and a pixel electrode 30 made of transparent metal, such as ITO (indium tin oxide), is formed in a display region and is electrically connected to the source/drain electrodes 28 through a contact hole in the passivation layer 32.
A black matrix 42, which functions as a light shielding layer, is formed in a non-display region of an upper substrate 40 in order to prevent reduction of image quality, and a color filter layer 44 is formed in the display region. In addition, a common electrode 46 made of transparent metal, such as ITO, is formed on the black matrix 42 and the color filter layer 44. A spacer 52 is provided between the lower substrate 20 and the upper substrate 40 to maintain a uniform cell gap. In addition, a liquid crystal material is injected between the lower and upper substrates 20 and 40 to form a liquid crystal material layer 50. Although not shown, alignment layers for aligning liquid crystal molecules of the liquid crystal material layer 50 are deposited on the pixel electrode 30 of the lower substrate 20 and on the common electrode 46 of the upper substrate 40.
In FIG. 2, the semiconductor layer 26 is activated to form a channel layer when the scan signal input through the gate line 3, wherein the data signal input from the data line 5 is supplied to the liquid crystal material layer 50 through the channel layer. Each of the gate electrodes 22 of the TFTs are connected to at least one of the gate lines 3, which are arranged along the first direction. Accordingly, by supplying the scan signal to the gate line 3, the semiconductor layer connected to the corresponding gate line 3 is activated, so that the data signal is supplied to the liquid crystal material layer 50 of the pixel through the data line 5 to control the liquid crystal molecules of the corresponding pixel.
FIG. 3 is a flow chart of a fabrication method of an LCD device according to the related art. In FIG. 3, a fabrication method of an LCD device includes a TFT array process for forming thin film transistors (7 in FIG. 1) on the lower substrate 20, a color filter process for forming a color filter 44 (in FIG. 1) on the upper substrate 40, and a cell production process.
A step S101 includes the TFT array process, wherein the gate lines 3 and the data lines 5 are formed on the lower substrate 20, and the TFTs 7 connected to the gate lines 3 and the data lines 5 are formed at each pixel region. Furthermore, the pixel electrode 30 connected to the TFTs 7 are formed to control the liquid crystal material layer 50 when the signal is supplied through the TFTs 7.
A step S104 includes the color filter process, wherein the color filter layer 44 and the common electrode 46 are formed on the upper substrate 40.
Steps S102 and S105 include forming alignment layers on the lower substrate 20 and the upper substrate 40, and rubbing the alignment layers to provide aligning controlling forces or surface fixing forces (i.e., pretilt angles and alignment directions) to the liquid crystal molecules of the liquid crystal layer 50 between the lower and upper substrates 20 and 40.
A step S103 includes scattering spacers 52 on the lower substrate 20 to maintain a uniform cell gap.
A step S106 includes coating a sealant material along an edge area of the upper substrate 40.
A step S107 includes assembling the lower and upper substrates 20 and 40 by bonding the lower and upper substrates 20 and 40 together by applying pressure.
A step S108 includes a cell production process, wherein the bonded lower and upper substrates 20 and 40 are cut to produce a plurality of individual liquid crystal display cells.
A step S109 includes injecting the liquid crystal material into each of the individual liquid crystal display cells through a liquid crystal injection hole formed in the sealant material. In addition, an encapsulation process includes sealing the liquid crystal injection hole.
A step S110 includes inspecting the individual liquid crystal display cells.
As described above, the LCD device is fabricated through the TFT array process, the color filter process, and the cell production process. However, each of the processes are performed using different fabrication systems. For example, the TFT substrate is fabricated using a TFT array fabrication system (i.e., a TFT line), the C/F substrate is fabricated using a color filter fabrication system (i.e., a C/F line), and the TFT substrate and the C/F substrate are attached and processed using a cell fabrication system (i.e., a cell line) to fabricate the individual liquid crystal display cells. In addition, the TFT line, the C/F line, and the cell line each include a plurality of individual process lines, respectively.
FIGS. 4A-4D are schematic flow charts showing a system for fabricating an LCD device according to the related art. FIGS. 4A and 4B show a TFT line and a C/F line, respectively, and FIGS. 4C and 4D show a cell line. In FIG. 4A, the lower substrate 20 upon which the TFTs 7 are formed passes an alignment layer line, a rubbing line, and a spacer scattering line of the TFT line. In the alignment layer line, the lower substrate 20 is cleaned, an alignment layer material is deposited, and the deposited alignment layer material is heated at a high temperature to plasticize the alignment layer material. In the rubbing line, the alignment layer of the lower substrate 20 is rubbed to provide the aligning controlling force. In the spacer scattering line, the spacers, such as ball spacers, are scattered on the lower substrate 20 after the lower substrate 20 is cleaned. Then, the lower substrate 20 is provided to a first transferring device.
In FIG. 4B, the upper substrate 40 upon which the color filter layer 42 is formed passes an alignment layer line, a rubbing line, and a spacer scattering line. In the alignment layer line, the upper substrate 40 is cleaned, an alignment layer material is deposited, and the deposited alignment layer material is heated at a high temperature to plasticize the alignment layer material. In the rubbing line, the alignment layer of the upper substrate 40 is rubbed to provide the aligning controlling force. In the spacer scattering line, the spacers, such as ball spacers, are scattered on the lower substrate 40 after the lower substrate 40 is cleaned. Then, the upper substrate 40 is provided to a second transferring device.
In FIGS. 4A and 4B, the alignment layer line and the rubbing line, the rubbing line and the spacer scattering line, the rubbing line and the sealant coating line are not continuous fabrication lines, respectively. Although not shown, a transferring means, such as a robot (i.e., loader or unloader), is installed between each of the alignment layer line, the rubbing line, and the spacer scattering line.
The alignment layer line and the spacer scattering line, as shown in FIG. 4A, are performed on the TFT line. Furthermore, the alignment layer line and the sealant coating line, as shown in FIG. 4B, are performed on the C/F line. For example, during the TFT process, the alignment layer process and the spacer scattering process are performed on the lower substrate 20, and during the C/F process, the alignment layer/rubbing process and the sealant coating process are performed on the upper substrate 40. These processes are separately performed on the lower and upper substrates 20 and 40.
In FIG. 4C, the lower substrate 20 (i.e., TFT substrate) passes through the TFT line and is transferred to an assembling line using a first transferring device. Similarly, the upper substrate 40 (i.e., C/F substrate) passes through the C/F line and is transferred to an assembling line using a second transferring device. In the assembling line, the TFT substrate and the C/F substrate are aligned and bonded together by pressure, the bonded substrates are heated to harden the sealant material. Then, the bonded substrates are cut into separate liquid crystal cells in the cutting line.
In FIG. 4D, the separated liquid crystal display cells are transferred to a grinding line using a third transferring device, wherein each of the liquid crystal display cells undergo grinding and cleaning processes. Next, the liquid crystal display cells are input to a liquid crystal injection line to inject the liquid crystal material through the liquid crystal injection hole and to encapsulate the liquid crystal injecting hole with the encapsulation material. Then, the encapsulated liquid crystal display cells are input to an inspection line to clean in the liquid crystal display cells and inspect the liquid crystal display cells.
Accordingly, the alignment layers are formed on the lower and upper substrates 20 and 40 along the TFT line and the C/F line, respectively, the bonded lower and upper substrates 20 and 40 proceeds through the assembling and cutting lines, the liquid crystal material is injected into the liquid crystal display cells, the inspection of the liquid crystal panel is performed, and LCD device is fabricated.
The alignment layer and spacer scattering lines, as shown in FIG. 4A, and the alignment layer and sealant coating lines, as shown in FIG. 4B, may be arranged in a fabrication facility along parallel directions and spaced apart from each other. In addition, the assembling and cutting lines, as shown in FIG. 4C, and the grinding and liquid crystal injecting lines, as shown in FIG. 4D, are arranged to be separated from the alignment layer and spacer scattering lines, as shown in FIG. 4A, and the alignment layer and sealant coating lines, as shown in FIG. 4B. Accordingly, the TFT substrate output from the alignment layer and spacer scattering lines is mounted on a first transferring device to be transferred to the assembling and cutting line, and input to the assembling and cutting lines by a loading device, such as a robot. Similaryl, the C/F substrate output from the alignment layer and sealant coating lines is mounted on a second transferring device to be transferred to the assembling and cutting line, and input to the assembling and cutting lines by another loading device, such as another robot. In addition, the liquid crystal display cells in the assembling and cutting lines are individually mounted on a third transferring device to be transferred to the liquid crystal injecting line. The first, second, and third transferring devices move automatically between the process lines to transfer the substrates into each of the lines, wherein a plurality of substrates (or display cells) are fixed by a cassette mounted on the transferring device.
Accordingly, large amounts of open spaces are required since the process lines shown in FIGS. 4A-4D are arranged separately in a fabrication facility, thereby increasing fabrication costs of the LCD device. In addition, automated transfer devices are required to proceed between each process along one process line, thereby further increasing the fabrication costs of the LCD device. Furthermore, since the automated transfer devices are very expensive, the fabrication costs of the LCD device are further increased. Moreover, the processes can be delayed due to the time required to transfer each of the substrates.

Fabrication system for liquid crystal display device and method of fabricating liquid crystal display device using the same


An investment casting model for the creation of a mold for investment casting of a plurality of objects, the investment casting model being realized in solidifiable resin, and includes: a base defining a Z axis; a plurality of wire-like elements all extending from the base, the wire-like elements intersecting each other to form a plurality of simple closed curves, which form a net around the Z axis. At least two of the simple closed curves of the plurality are identical to each other and the net includes: at least a first and a second sets of simple closed curves, each set forming a net sub-structure around the Z axis, the second set being adjacent to the first set along the Z axis; a plurality of object models; and a plurality of connecting branches joining the plurality of object models to the wire-like elements forming the net.

Investment casting (also called lost wax casting) is the technique of creating metal objects, such as jewelry, which involves pouring a liquid metal alloy into a mold. The casting mold is made using a wax model, that is then dissolved to leave an empty space inside the mold.
The first step in the lost wax casting process is thus forming the wax model, for example by wax molding: the wax is injected into special molds that give the wax the shape of the objects to be reproduced. The wax objects produced by injection molding of the wax are assembled on a sprue structure, having often the form of a casting shaft. The casting shaft itself is made of wax; the wax objects are attached to the casting shaft by heating and fusion of more wax. The casting shaft generally includes a "central trunk" from which various "branches" branch out. The wax objects to be reproduced are attached to these branches. The process of attaching the wax objects to the branches of the casting shaft is generally carried out by hand by the so-called "wax mold makers", who attach the wax objects to the branches according to an arrangement that tries to maximize the number of objects per casting shaft.
The entire wax model, including the sprue structure and the wax objects thus assembled, is immersed in a bath of a special material. The special material is selected depending on the characteristics of the final objects to be made and in particular on the metal used. The bath can be made for example of plaster or ceramic, in order to create an inert shell that can withstand the melting temperature of the metal subsequently introduced. Once the bath is dry, the wax is removed from the shell by heating. For example, the wax can be collected and reused for a new process.
The metal is then poured inside the cavity left in the shell by the removed wax. The metal pouring may be done by gravity.
When the metal has cooled and solidified, the shell is broken and the pattern (i.e. sprue structure and objects) once formed in wax is now formed in metal. The raw objects are removed from the casting shaft (now made of metal), for example by cutting. The objects are then possibly further processed and finished, if required.
In this process, the step of attaching wax objects to the branches of the casting shaft requires considerable manual work, which increases the costs of the process as a whole. Furthermore, the process—being manual—is never perfectly reproducible.
With the advent of 3D printing machines (such as stereolithographic machines), it has been realized that it is possible to obtain the "wax model" through a 3D printing process, using—instead of wax—a resin that could be both polymerizable by laser and then molten at a desired temperature in order to be removed from the shell.
However, a casting shaft having the central trunk of "considerable" dimensions so as to obtain the desired cavity in the mold is not easy to realize through modern stereolithographic techniques. As known, in 3D printing, a resin is inserted inside a tank or chamber. The resin is generally polymerized layer by layer. Each layer represents a section of the finished object to be printed. In each layer, light irradiation is performed, such as UV radiation, or a laser light is "scanned" over the desired portion. Once the scan or irradiation has been carried out, a displacement is made along the vertical axis to form a new layer above (or below) the layer just irradiated, so as to create the object section by section, developing it vertically. However, if in each layer a portion of resin having substantially the same coordinates in a (X, Y) plane is polymerized, a rapid deterioration of the resin tank is obtained. Indeed, a continuous irradiation of the same area for each layer, or the scanning of the laser on the same area of each layer, causes damage to the material forming the tank. Since there is a vertical "central trunk" in the casting shaft, resin needs to be polymerized always in the same area in all layers. In order to solve this problem, either the size of the "casting trunk" is kept smaller than required, to minimize the damage, or a continuous replacement of the resin tank is required.
The object of the present invention is therefore to provide a model for the creation of a mold for investment casting having the same functions as the "wax" model described above, but which is made in resin polymerizable by 3D printing and also does not require a quick substitution of the resin tank. Further, another object of the invention is to provide a method for investment casting of an object which can use the 3D technologies known in the art without major modifications.

Model for the creation of a mold for investment casting and method for investment casting of an object


The invention relates to the papermaking art and, in particular, to the manufacture of paper substrates, paper-containing articles such as multilayered paper or paperboard packaging, containing a fluorine-containing compound and having enhanced glueability and/or grease resistance.

Grease-resistant papers have been a desired commodity for some time. More specifically, paper substrates of cellulose fibers require additional components thereto, including chemistries, which render the substrate grease-resistant. Grease-resistant papers are not, per se, 100% resistant for an indefinite period of time, but instead are papers that provide grease holdout over a defined temporal space. Many commercial applications of grease resistant papers require longer and longer periods of time of grease holdout (either inside the paper substrate and/or outside the paper product).
In many commercial uses, grease resistant paper substrates must be glued together or to itself. The glueability of the substrate is critically dependent, in part, to the substrate's structural integrity. The structural integrity of the substrate is critically dependent upon the substrate's ability to contain and/or carry grease-containing products. While there are many conventional methods and chemistries that are available to be provided in paper substrates that would render such substrates grease resistant, such conventional chemistries and methods reduce the glueability of the substrates. The reduction in glueability causes the substrates to have a reduced structural integrity, severely limiting the strength of any substrate as well as its ability to carry heavy grease containing products.

Paper substrate containing a fluorine containing compound and having enhanced grease-resistance and glueability


A system, method and computer-readable medium for displaying a message over a network are disclosed. A distribution indicator is associated with a defined distribution rule for displaying messages over the network. A message includes the distribution indicator in the message. The message is displayed over the network according to the distribution rule indicated by the distribution indicator included in the message.

The present invention relates to network communication, and more specifically, to sending messages to a group of individuals.
A social network makes it possible for a user to form connections with other people using a profile stored at a social network site. In many cases, the user will form connections to several people based on different relations, interest, affiliations, backgrounds, etc. In many cases, the social networking site allows the user to form groups based on these relations, interests, etc. and to aggregate people into these groups accordingly. Once connections are formed, the user may wish to communicate with people within the network. While it is possible to send a message to every person in a social network, generally the user may wish to send a message only to a particular person or to particular group of people.

Message distribution and viewing rules in a network

International Business Machines Corporation


The present invention provides a computer system which electronically and automatically detects the maximum rated operating frequency of a microprocessor installed in the computer system. The present invention also electronically and automatically detects, selects and generates a "common" external/internal operating clock frequency in a multiprocessor system when more than one microprocessor is installed in the computer system. More particularly, a computer system is disclosed which includes at least one microprocessor and a main memory coupled to each microprocessor. Each microprocessor includes an electronic stamp with a value of a maximum rated operating frequency for the microprocessor written therein. The computer system includes a clock generating section for electronically detecting the value of the maximum rated operating frequency of the each microprocessor and for selecting and generating an operating frequency for the computer system. In one embodiment of the present invention, the electronic stamp on each microprocessor includes a nonvolatile memory module, such as an electrically erasable reprogrammable nonvolatile memory, coupled to each microprocessor with the value of the maximum rated operating frequency of the microprocessor stored in, for example, a register. In another embodiment of the present invention, the electronic stamp on each microprocessor includes an encoded strapping circuit integrated into each microprocessor which provides the value of the maximum rated operating frequency in an electronically coded form, such as pins on the microprocessor with a coded setup.

1. Field of the Invention
This invention relates to clock frequencies in a computer system and more particularly to microprocessor frequency detection and selection.
2. Description of the Related Art
Modern day computer systems, particularly personal computer systems, include a system unit having a system processor or microprocessor with associated volatile and non-volatile memory, a display monitor, a keyboard, one or more floppy diskette drives, a hard disk storage device and an optional printer. One of the distinguishing characteristics of these systems is the use of a system board or motherboard to electrically connect these components together. A personal computer system may also include one or a plurality of I/O devices (i.e. peripheral devices) which are coupled to the system processor and which perform specialized functions.
Computer systems operate under the control of one or more "clocks" or signal lines carrying a signal of a predetermined frequency and duty cycle. The clock signal is provided to various components in the computer system and these components typically carry out some operation or set of operations during one or more "clock cycles" or cycles of the signal. The coordination of all the processes between a microprocessor and main memory is carried out using the clock signal from the clock generator. Without this signal, complete chaos would arise, and correct data transfer would be impossible. However, the clock signals lead to correct execution, and give the individual circuits enough time to fulfill their tasks.
Of course, the various components of the computer system must be designed to match the clock speed or frequency. The computer system must be designed to provide a clock signal of the appropriate clock speed to circuits used in the computer system. This creates a special problem in multiple microprocessor computer systems where it is desired to operate all components under the control of a single clock and, for example, only one of the processor modules is upgraded with a higher speed microprocessor. Synchronization between microprocessors is a continuing critical issue in a very wide variety of multiprocessor systems.
Current methods of producing microprocessors includes fabricating and assembling the microprocessor and then testing for its maximum allowable operating clock speed. After testing the microprocessor, it is visibly labeled with a part number and rated clock frequency and then shipped to the end users or customers. The microprocessors are labeled manually and there is no automatic or electronic process for a computer system to know what the maximum rated clock frequency is for that installed microprocessor. Jumpers must be manually set within the computer system when installing the microprocessor. Also, in multiprocessor environments where microprocessors of the same family could be installed in the same system bus, each with different maximum rated frequencies, a problem of synchronization of the multiple microprocessors to the same clock frequency (i.e. usually the lowest common frequency) may occur. Therefore, a system is needed to automatically detect and select the common operating external/internal clock frequencies in a multiprocessor system when the microprocessors are installed.

Process to allow automatic microprocessor clock frequency detection and selection


A method for producing antithrombin-III from an antithrombin-III-containing aqueous solution, comprising at least one of the following steps (a) and (b): (a) heating the antithrombin-III-containing aqueous solution in the presence of a stabilizing agent so that 85% or more of the activity of antithrombin-III before the heating is maintained after the heating, and that the ratio of an antithrombin-III monomer after the heating is maintained at 95% or more; and (b) treating the antithrombin-III-containing aqueous solution with a metal chelate resin and recovering a purified antithrombin-III.

Antithrombin-III (hereinafter referred to as "AT-III") is a glycoprotein belonging to .alpha..sub.2 globulin, and is present in blood plasma. AT-III has a molecular weight of 65,000 to 68,000 and a protease inhibition activity. AT-III strongly inhibits coagulation activity of thrombin.
Also, AT-III possesses inhibition activities against not only thrombin but also against other coagulation factors, such as activated factor X and activated factor IX. Furthermore, it has been reported that AT-III possesses inhibition activities against plasmin and trypsin.
These inhibition activities are generally more rapid in the coexistence of heparin.
AT-III having such activities has been used for treating abnormal hypercoaglulability, specifically disseminated intravascular coagulation (DIC) and various other diseases caused by the decreased availability of AT-III.
Moreover, AT-III has an affinity for heparin, and a number of purification methods have been reported in which immobilized heparin is used based on such affinity property (e.g., JP-A-63-23896; the term "JP-A" as used herein means an "unexamined published Japanese patent application").
In addition, since AT-III is a protein which is present in blood plasma, inactivation of virus potentially contained therein is required when it is used as a therapeutic preparation.
Among these virus inactivation treatments, a liquid state heat treatment at 60.degree. C. for 10 hours is known as a specific example. However, it has been reported that AT-III is stable at pH 6 to 8, but 80% of the activity is lost by a heat treatment at 56.degree. C. for 6 hours (J. Biol. Chem., 246:3694 (1971)). On the other hand, there are many reports stating that the activity of AT-III is stably maintained when AT-III is subjected to a liquid state heat treatment at 60.degree. C. for 10 hours in the presence of 14.7 w/v % sodium citrate (Thrombosis Research, 22:233 (1981) and J. Biol. Chem., 256:12140 (1981)). However, when AT-III is heated in the liquid state even in the presence of 0.35 to 1.5 M (10.29 to 44.12 w/v %) sodium citrate, denaturation of AT-III is observed by immunoelectrophoresis analysis (Vox Sang, 48:325 (1985)).
Since such inactivation treatment of viruses also generates denatured protein such as inactivated AT-III, polymerized protein or the like as discussed above, methods have been reported for elimination of such impurities, for example, by carrying out the immobilized heparin treatment again (JP-A-63-23896) or carrying out a hydrophobic chromatography treatment (JP-A-1-275600). However, the immobilized heparin treatment results in low activity recovery yield even by a single treatment, and the hydrophobic chromatography treatment has a possibility of leaving contaminant proteins, such as prealbumin, transferrin, IgG and the like, so that it is necessary that the purification step is carried out again for removing these proteins, and as a result, the activity recovering yield is reduced.

Method for producing antithrombin-III, method for purifying it, and preparation containing it

Yoshitomi Pharmaceutical Industries, Ltd.


Systems and methods reduce electromagnetic interference from high speed data carried by wired interconnects with a radio receiver for at least one protected radio frequency band. A spectral encoder changes the encoding of the high speed data to modify its frequency spectrum and reduce its spectral in the protected frequency band. The wired interconnect carries the spectrally encoded data to its destination, where it is spectrally decoded back to its original form. Spectral encoding may include polynomial scrambling. The data may be encoded with different coding parameters in parallel and the best result selected for communication over the wired interconnect. The coding parameters may be changed depending on which radio receivers and/or protected frequency bands are in use at any given time.

A broad array of electronic systems comprise both a high-speed wired interconnect and a wireless radio receiver. A wired interconnect carrying high-speed data has the undesired effect of radiating part of its electromagnetic (EM) energy, which may result in loss of data fidelity in the wired interconnect on the one hand, and in interference with a radio receive signal on the other hand. The spectrum of electromagnetic interference (EMI) emitted from high-speed wired interconnects may be broad, whereas radio receive signals are typically in a relatively narrow radio frequency range. Unfortunately, high-speed interconnect protocols are generally optimized for data transfer fidelity over the intended wired link and disregard the problem of EMI with wireless radios.
FIG. 1 illustrates an example conventional system 100 with a radio receiver 150 receiving interference radiated from one or more full or partial wired interconnects. With respect to drawings herewith, receivers, whether wired or wireless, may be indicated as Rx, whereas transmitters may be indicated as Tx. The radio receiver 150 generally operates to receive radio signals 142 transmitted by radio transmitter 140, which is generally located outside the system 100. The radio signal 142 may be very weak if the transmitter 140 is at a large distance, or in other words, the capability of radio receiver 150 to receive signals from a faraway transmitter 140 is determined by its capability to receive a weak radio signal 142. EMI that overlaps the spectrum or the frequency range of radio signal 142 generally reduces such capability.
System 100 may include one or more partial or full high-speed wired interconnects. For example, it may partially include wired interconnect 110, comprising a transmitter 110.1 outside of system 100 and a receiver 110.3 inside system 100, electrically coupled by wired link 110.2. Similarly, system 100 may fully include wired interconnect 120, comprising transmitter 120.1, wired link 120.2, and receiver 120.3. Again similarly, system 100 may partially include wired interconnect 130, comprising a transmitter 130.1 inside of system 100 and a receiver 110.3 outside, electrically coupled by wired link 130.2.
Wired interconnect 110 may produce EMI 112, wired interconnect 120 may produce EMI 122, and wired interconnect 130 may produce EMI 132. In general, each and every wired interconnect that carries high-speed data is likely to produce EMI that may effectively lower the capabilities of radio receiver 150 to receive a radio signal 142 from a weak or far away radio transmitter 140.
This problem is very common in many electronic systems, including for example consumer devices such as smartphones, smart TVs, computers, laptops, and tablets. These systems often include multiple radio receivers, as well as multiple partial and full wired interconnects. Some of the current radio systems often affected are WiFi, Bluetooth, GPS, CDMA, LTE, etc. Some popular wired interconnect systems that may cause the problems include serial data systems such as Ethernet, USB, and HDMI; video data buses such as internal and embedded DisplayPort and V-by-One; general memory and data buses for computing such as PCIe, HyperTransport, SAS, and SATA. In some of these cases, data can be bidirectional and each end of the wired interconnect may include both a wired data transmitter and a wired data receiver.
FIG. 2 illustrates a wired interconnect 200 with various locations from which it may radiate energy contained in transmitted data. Transmitter 210 provides a stream of data bits represented as a signal of time-varying voltages and/or currents. This time-varying signal can be translated back to a stream of data bits by receiver 270. To get from transmitter 210 to receiver 270, the signal may be coupled via printed card board (PCB) trace 220 with male/female connector pair 230, cable 240, male/female connector pair 250, and PCB trace 260. The signal could be a single time-varying voltage/current, or it could comprise multiple parallel time-varying voltages/currents. The signal could be single-ended or differential. In respective cases, there could be a single path or multiple parallel paths between transmitter 210 and receiver 270. Due to losses in the EM field, including those that cause EMI, there is potentially a large signal attenuation between transmitter 210 and receiver 270. To provide the receiver 270 with adequate signal, the transmitter 210 may be designed to provide extra energy, worsening EMI. Leak of energy, and hence a cause for EMI, may occur at each of the depicted components 210 through 270. The problem is worst near transmitter 210, PCB trace 220, and connector pair 230, but may persist all the way through receiver 270. Therefore, any part of wired interconnect 200 that may be contained in a system 100 may be cause for EMI concern.
Some wired interconnects do not contain all components depicted in FIG. 2. For instance if the wired interconnect is a memory data bus, block 210 might represent a processor containing both a transmit and receive function, block 270 might represent a memory chip containing both a transmit and receive function, and if the processor 210 and the memory chip 270 are both soldered directly onto a PCB, there may only be PCB traces 220 or 260 in between. Should the memory be part of a memory module, then the memory chip may be soldered onto a different PCB than the processor. In that case, processor 210 would be coupled with connector pair 230 or 250 through PCB traces 220, and memory chip 270 would be coupled with connector pair 230 or 250 through PCB traces 260.
In another example, a notebook computer processor may transmit video data to a display panel. The processor is usually contained in the body of the computer, whereas the display panel is contained in the lid. The processor would hold transmitter 210, which is coupled with a single female connector 230 through PCB wires 220. Cable 240 is a flat cable with wires that are etched from or printed onto a flexible substrate. The cable 240 sticks directly into female connector 230 on one end, and into female connector 250 on the other end. The display panel contains circuitry with receiver 270, which is coupled with connector 250 through PCB traces 260.
Regardless of which components are included in an actual wired interconnect, most or all components may leak energy when high-speed data is passed through, and therefore cause EMI.
Common approaches against EMI include differential signaling and shielded cabling and traces. While useful, the reduction can be limited and still allow significant residual EMI. Placing components far from radio receivers helps too, but can be difficult in systems with small form factors, such as hand-held devices. Radios often use metal shielding and larger antennas and associated cable shielding to protect themselves from EMI. Such solutions may be expensive and only partially effective.
Another problem with uncontrolled radiation of EM energy is that it may be difficult to obtain regulatory approvals, such as from the FCC. Furthermore, there is an unmet need for a method to reduce EMI from a high-speed interconnect without degrading the signal integrity over the interconnect.
Therefore, there is an unmet need for a low-cost method to reduce EM radiation emitted by high-speed wired interconnects.

Reducing electromagnetic radiation emitted from high-speed interconnects


An undersea probe which can be attached to marine animals for collecting data as to light intensity and temperature in regions where the marine animals travel. The probe is essentially omnidirectional in its light acceptance capability so that light intensity measurements will not be dependent upon any particular orientation of the probe. The probe includes a central optical fiber containing a fluorescent dye enclosed in a transparent or translucent, protective and fouling-resistant sheath. The optical fiber is provided at its outer end with a fiber terminator which blocks entry of light into the end of the fiber. At its opposite inner end, the fiber is coupled to a light detector in a housing which may be implanted in the marine animal. The optical fiber exhibits radial changes in its refractive index to trap light which approaches the surface of the fiber from inside and which makes a small enough angle with that surface. Such light is propagated along the fiber to the light detector.

1. Field of the Invention
The invention relates to a probe for attachment to land and marine animals which is capable of detecting and measuring light, and more particularly to such a probe which is wavelength-selective and which detects light from essentially all directions so that the measurements are not dependent upon any particular orientation of the probe.
2. Description of Related Art
Attempts have been made to determine and study the migration and/or wandering patterns of certain forms of marine life, particularly species of fish which have been threatened with extinction due to, for example, intense fishing pressure. For example, due to their high value in the far east marketplace, blue fin tuna have been particularly victimized in recent years to the point where the population of this tuna has dropped by a factor of about ten.
One way which has been used to learn some information about the movements of fish is by tagging the fish with markers such as color-coded visible implant tags. Such tags allow for the identification of fish, so that upon recapture of a particular fish, it can be learned to what location that fish travelled.
Although the tagging method provides information as to the ultimate location of a particular fish upon recapture, this method does not yield any information as to the route by which the fish moved from a point A to a point B. It would be desirable to learn more information as to the route which the fish took in its journey for the purpose of determining, for example, whether the particular fish migrates or merely wanders.
In an attempt to learn more information about the journey of a fish from one location to another, photo detecting devices and thermistors have been developed for attachment to the fish. Upon recapture of the fish, the light intensity information measured by the photo detector and recorded along with time-of-day information by some means in the device can be interpreted to learn the geographic longitude of the fish each day by noting the time of sunrise and sunset and performing standard calculations of celestial navigation. Temperature measurements taken by the thermistor and also recorded can be compared to known reference values of ocean temperature to yield information about the latitude of the fish during its travels.
One major problem encountered with the use of such photo detecting devices is that the measurement of the ambient light intensity may depend on the orientation of the detector because it is not held in a fixed orientation with respect to both the water surface and the direction of the sun. This can result in data which is not useful because it will not accurately reflect the true location of the fish. Therefore, it would be desirable for the photo detector to have a very broad light acceptance angle, or, ideally, that it be omnidirectional so that the measurement of ambient light intensity does not depend on the instrument's orientation.
Another problem encountered is that when the light measurement is made at some depth in the ocean some light is absorbed by the intervening water. The values measured must be corrected to take into account this absorption.
Yet another problem encountered with the use of light detecting devices is that ocean water is a conductive fluid which readily promotes corrosion of exposed metallic surfaces. In addition, sea water is known to promote the fouling of exposed photo detector surfaces.
Photo detectors with an optical filter which passes only a narrow range of wavelengths and with a diffuser which broadens its acceptance angle are known. In addition, it is known to arrange multiple sensors in a single probe so that only nonmetallic and fouling-resistant surfaces are exposed to the sea water. However, heretofore, it has not been possible to combine these known structures in the form of a thin, flexible probe which can extend through the skin of the fish into the surrounding sea water. In particular, a major problem in creating such a device is the fact that an effective diffuser is ordinarily large compared to the detector surface itself. Therefore, it would be an improvement in the art to integrate all of the above-referenced functions in a thin, flexible structure.


A liquid crystal display device comprising a lighting unit of the present invention is aimed to inhibit a liquid crystal panel 111 from breaking by a pressure from a display surface side of a liquid crystal cell 111, and to inhibit entry of dust having influence on display. Such lighting unit is structured in a way that a fluorescent discharge tube 2 is disposed close to an incident side end face E1 of a light guiding plate 1, and the end face E1 of the light guiding plate 1 and the fluorescent discharge tube 2, an end face E2 and a bottom surface of the light guiding plate 1 are covered with a reflecting sheet 3. A light correction sheet 4 is disposed on an emanating surface of the light guiding plate 1, and these components are stored in an electrically conductive casing 9. A spacing H of a space between the light correction sheet 4 and the light guiding plate 1 is set to not larger than one pixel dimension of the liquid crystal cell 111. The casing 9 has an opening portion J on a light emanating surface side, and a display rear surface side polarizer 13a of a liquid crystal panel 11 is disposed in direct contact with a front surface of the light correction sheet 4 within the opening portion J.

Recently, a liquid crystal display device has been widely used as a display device of an information device such as a notebook-type personal computer, a word processor and the like, or as a display device of a video device such as a portable television, a video movie, a car navigation system and the like, by taking advantage of a characteristic in which the liquid crystal device is light and thin, and consumes small electricity. Such liquid crystal display device typically has a structure in which a liquid crystal panel is illuminated from behind by a built-in lighting unit for obtaining a bright display screen. The liquid crystal panel comprises at least a liquid crystal cell comprising a pair of transparent substrates such as glass substrates, with a liquid crystal layer interposed therebetween, and a pair of polarizers provided so as to retain the liquid crystal cell between them. As a structure of such a lighting unit, there is an edge light type in which a light guiding plate is disposed on a rear surface of the liquid crystal panel, and a linear light source such as a fluorescent discharge tube is disposed on an end face of the light guiding plate, for example. The edge light type excels in achieving a thin liquid crystal display device and a light emitting surface thereof with a uniform luminance. So, this is commonly adopted as a backlight type of the liquid crystal display device used in the notebook-type personal computer or the like. In the liquid crystal display device used in the portable television, the car navigation system and the like, the edge light type using two or more fluorescent discharge tubes, or the edge light type using an L-shaped or a U-shaped fluorescent discharge tube is commonly adopted, for obtaining a thin and luminous liquid crystal display.
In the edge light type in which the fluorescent discharge tube is disposed on the end face of the light guiding plate, it is important to reduce the size of the liquid crystal display device by storing components such as the light guiding plate, the fluorescent discharge tube, a lead wire or the like within a casing, for improving a characteristic of the liquid crystal display device such as portability and compactness.
Today, the liquid crystal display device is used in all household appliances in addition to the above-described uses. For example, the liquid crystal display device is commonly used in products used in severe surroundings, such as outside, owing to a portability thereof. Therefore, it becomes more important to consider about a warranty for a function of such products.
FIG. 4 is a cross-sectional view schematically showing a structure of the lighting unit of a conventional edge light type, comprising the fluorescent discharge tube, and of the liquid crystal display device comprising the lighting unit. FIGS. 5(a) and 5(b) are views schematically showing a structure of the lighting unit in FIG. 4, wherein FIG. 5(a) is a plan view and FIG. 5(b) is a side view. As shown in FIGS. 4, 5(a), and 5(b), the lighting unit comprises a flat-plate shaped transparent light guiding plate 1, configured to transmit light, an L-shaped fluorescent discharge tube 2 provided close to two of four sides of the light guiding plate 1, a reflecting sheet 3 for inhibiting light emitted from the fluorescent discharge tube 2 from emanating out of the light guiding plate 1, a casing 9 for holding these components, and a light correction sheet 4 provided on a light emanating surface side of the light guiding plate 1,
The reflecting sheet 3 is bent so as to enclose the fluorescent discharge tube 2 disposed on an end face E1 of the light guiding plate 1, and an end portion of the reflecting sheet 3 is bonded to the light emanating surface of the light guiding plate 1 by a double face adhesive tape 10. Thereby, the light emitted from the fluorescent discharge tube 2 is guided into the light guiding plate 1 from the end face E1 of the light guiding plate 1 without leakage. The reflecting sheet 3 is also disposed on a rear surface (an opposite surface of the light emanating surface) of the light guiding plate 1, for reflecting the light emanating from the rear surface of the light guiding plate 1, and for returning the light into the light guiding plate 1. Furthermore, the reflecting sheet 3 is bent along an end face E2 of the light guiding plate 1 so as to cover the end face E2, on which the fluorescent discharge tube 2 is not provided. Thus structured, the light emanating from the end face E2 of the light guiding plate 1 is reflected by the reflecting sheet 3 and is returned into the light guiding plate 1. By thus returning the light emanating from the light guiding plate 1 into the same by the reflecting sheet 3, the light (i.e., an illumination light) emanating from the light emanating surface of the light guiding plate 1 is increased, thereby enabling the light to be used more efficiently.
As the reflecting sheet 3, a white resinous film having a high reflectivity is used, for example. The reflecting sheet 3 may be structured by using separate sheets disposed so as to correspond to a periphery of the fluorescent discharge tube 2, the rear surface of the light guiding plate 1, and the end face E2 of the light guiding plate 1. In this case, an integral-type sheet that continuously covers these portions is used. By using the integral-type reflecting sheet 3, a thin lighting unit, a cost reduction thereof, and a reduction of the number of assembly processes thereof are realized.
The light correction sheet 4 is disposed on the light emanating surface of the light guiding plate 1, for obtaining a uniform and highly luminous illumination light. The light correction sheet 4 comprises a plurality of optical sheets of various specifications as necessary. Herein, two light correction sheets 4 are provided, as shown in FIG. 4.
The light guiding plate 1 and the fluorescent discharge tube 2, which are covered with the reflecting sheet 3, and the light correction sheet 4, are held by the casing 9. The lighting unit is formed by these components thus stored in the casing 9. The casing 9 is frame-shaped so as to have an opening portion J and comprises an edge portion 9a and a side portion 9b. By forming the opening portion J, a display region A of a liquid crystal panel 11 to be described below is located within the opening portion J, and the edge portion 9a of the casing 9 encloses the display region A, in a plan view. A through-hole G which communicates with outside is provided on the side portion 9b of the casing 9, for a weight saving and an installation by a user. Furthermore, the light correction sheet 4 and the light guiding plate 1 are disposed so as to form a space (hereinafter, referred to as a clearance F) between them and an inner wall of the casing 9. By forming the clearance F, it becomes possible to absorb a dimension difference by the clearance F, when the light correction sheet 4, the light guiding plate 1, and the casing 9 expand with different expansion rates due to a temperature variation, thereby resulting in the dimension difference. Therefore, it becomes possible to inhibit occurrence of distortion or the like due to the dimension difference.
Furthermore, on the edge portion 9a of the casing 9 of the lighting unit, a liquid crystal panel 11 comprising a display rear surface side polarizer 13a, a display front surface side polarizer 13b, and a liquid crystal cell 111 comprising at least a pair of transparent substrates which retain a liquid crystal layer between them is provided. The liquid crystal panel 11 is fixed to the edge portion 9a of the casing 9 by a double face adhesive tape 14. And, a front cover 12 is provided so as to cover these components. A liquid crystal display device is obtained by thus disposing the liquid crystal panel 11 on the light emanating surface side of the lighting unit.
Since the display rear surface side polarizer 13a is disposed on the casing 9, as described above, a space 15 is formed between a bottom surface of the polarizer 13a and the light emanating surface of the lighting unit (an upper surface of the light correction sheet 4, to be more precise). Therefore, there is a problem that, the liquid crystal cell 111 deflects as much as the space 15 when a user accidentally pushes the display surface of the liquid crystal display device, so that the liquid crystal cell 111 comprising the glass substrates or the like is broken.
On the other hand, as described above, since the casing 9 has the through-hole G, dust might enter the casing (i. e., the lighting unit) from outside through the through-hole G. The entering dust might also enter the display region such as a vicinity of the light correction sheet 4 and the light guiding plate 1 through the clearance F. In the lighting unit and the liquid crystal display device thus structured, an outer size thereof is limited for obtaining a compact device, and thus it is often impossible to provide a component for inhibiting entry of the dust. Therefore, the dust entering from outside as described above, or being generated inside when assembling the device passes through the clearance F and enters a space between the light guiding plate 1 and the light correction sheet 4, or between the light correction sheet 4 or the like and the liquid crystal panel 11. The dust entering the space interrupts an output light when displaying an image, thereby causing non-uniform luminance to occur, or conceals pixels, thereby causing display defects. Also, there is a possibility that a component of the display region side such as the light correction sheet 4 is damaged by a friction between components and the dust. Once the dust enters a space between the liquid crystal panel 11 and the lighting unit, it is very difficult to clear the dust away without disassembling the device. Therefore, it is very important to inhibit the dust from entering the display region.

Illumination unit and liquid crystal display apparatus comprising same

Matsushita Electric Industrial Co., Ltd.


A pipe handling assembly includes: a pipe engaging apparatus including a pipe gripping mechanism connectable to a top drive such that the top drive transmits rotational movement and axial movement to the pipe gripping mechanism; a pipe handling device for mounting onto the pipe engaging apparatus, the pipe handling device including a link hanger mounted on the pipe engaging apparatus, a link arm having a first end pivotally connectable to the link hanger and an outboard end selected to carry a pipe into a position to be gripped by the pipe engaging apparatus; a bearing for isolating rotational movement to the pipe gripping mechanism from the link hanger; and a connection for rigidly connecting the link hanger to the pipe engaging apparatus during operation of the pipe handling assembly, the connection selected to substantially prevent the link hanger from rotating with the pipe gripping mechanism should the bearing seize.

A top drive can be used in a drilling rig for handling a pipe string during drilling or lining a wellbore. In some well operations, an engaging apparatus, including an internal or external pipe gripping mechanism, can be connected below the top drive to grip a joint of pipe, such as casing, so that the engaging apparatus and the joint of pipe can be driven axially and/or rotationally by the top drive. Some engaging apparatus for casing pipe are described in U.S. Pat. No. 6,311,792, issued November 2001 and International application WO00/05483, published February 2000, both to TESCO Corporation.
In a drilling rig, the top drive can be hung in the mast with the engaging apparatus connected in drive communication and in substantial axial alignment therebelow. The top drive and engaging apparatus are hung in the mast above the well center, the top drive and engaging apparatus define a main axis of the drilling rig that is aligned with well center. Joints of pipe, for connection into the drill or liner string, can be supported, for example in a V-door, adjacent the main axis of the drilling rig. For connection into the drill or liner string, the pipe joints can be engaged by an elevator and brought under the drive system for engagement and handling. Generally, the elevator is supported on link arms.
To pick up a pipe joint, the top drive is lowered to permit the elevator, either on conventional link arms or with the cables attached to the link arms, to be manually moved over and engaged about a pipe joint on the V-door. The top drive is then hoisted to pull the pipe joint off the V-door. Once free of the V-door, the pipe joint can be swung by gravity under the engaging apparatus so that the gripping mechanism can engage the pipe joint.
Recently, as described in applicant's U.S. application 2005-009835, published May 12, 2005, a pipe handling device has been introduced wherein the link arms are mounted to move with the top drive but are mounted below the quill of the top drive such that the link arms can be reduced in length and may be closer to the point of implementation over previous systems. In such assemblies of a pipe handling device with a pipe engaging apparatus, the pipe engaging apparatus includes a pipe gripping mechanism that is selected to grip a pipe for rotation thereof, as driven by a top drive and the pipe handling device includes at least one link arm that are, in normal operation, isolated from such rotation in order to hold and position a pipe for gripping by the pipe gripping mechanism, but not itself be rotated. Although the link arm of the pipe handling device is mounted on the pipe engaging apparatus, a bearing is positioned between the link arms and the pipe gripping mechanism to permit rotational isolation of the link arms from the rotation of the pipe gripping mechanism. The bearing can be provided at various points between the pipe gripping mechanism and the at least one link arm depending on the parts of the pipe engaging apparatus that are connected for rotation with the pipe gripping mechanism and top drive.
For example, in one embodiment, with reference to prior art FIG. 1, a pipe handling device 10 may be provided for mounting onto a pipe engaging apparatus 12. The pipe engaging apparatus may include a main housing 14, a mandrel 16 and a pipe gripping mechanism 17 selected to grip a pipe, for example pipe 22 in the Figure. The apparatus is connectable to a top drive 20, for example through an upper end 18 of mandrel 16 and the top drive provides axial and rotational drive for the pipe gripping mechanism and mandrel of the apparatus, which in turn transmits this rotational and axial movement to a pipe being gripped. In this illustrated embodiment, pipe gripping mechanism 17 and mandrel 16 rotate within a main housing 14 as facilitated by a pipe engaging apparatus bearing 32. Main housing 14 in this embodiment generally is maintained stationary relative to the rotating mechanism 17 and mandrel 16 by use of an anti-rotation bracket 21 installed between top drive 20 and housing 14.
The pipe handling device 10 includes at least one link arm 24 having a first end 25 supported on the pipe engaging apparatus and able to pivotally move thereon and an outboard end 27 pivotally connectable to a pipe elevator segment 30, the link arm being sized to present pipe 22 into a position to be gripped by the pipe engaging apparatus. In the illustrated embodiment, link arm 24 is mounted onto main housing 14 of apparatus 12 through a link hanger 29 formed on a link carrier bracket 31. Link hanger 29 forms a shaft on which link arm 24 can pivot. In this way, link carrier bracket and therefore link arm are moved with the main housing and isolated from rotation with the pipe gripping mechanism by bearing 32 and anti-rotation bracket 21.
Although isolated therefrom by bearing 32, the pipe handling device is located in the rotational drive path of the top drive. Thus, in the event that engaging apparatus bearing 32 should fail and seize, link carrier bracket 19 and link arm 24 have the potential to rotate with the top drive. While anti-rotation bracket 21 is intended to resist rotation of the housing 14, link carrier bracket 19 and the link arm, a seized condition of bearing 32 may cause bracket 21 to also fail, as by breaking or ripping away from its installed position, such that the link arm may begin to rotate as driven by the top drive. Although the top drive would be shut down in this situation, such a situation of uncontrolled rotation of the link arms with the top drive could create significant safety concerns.

Pipe handling device and safety mechanism


The present invention relates to the prognosis, therapeutic stratification and treatment of colorectal cancer. More in particular, the present invention discloses that significantly increased levels of transmembrane type 1 neuregulin-1 in tumor-associated mesenchymal cells present in a sample of a patient indicate that the patient has a worse prognosis when compared to patients having low levels of transmembrane type 1 neuregulin-1 in tumor-associated mesenchymal cells. Moreover, the present invention relates to the usage of transmembrane type 1 neuregulin-1 expression in tumor-associated mesenchymal cells to predict resistance to HER1 inhibitors during colorectal cancer therapy and/or to predict whether a patient would benefit from a therapy based on the prevention of neuregulin-1 and/or HER3 activity.

Colorectal cancer (CRC) is the third most common cancer in both men and women and accounts for 9% of all new cancer cases and cancer deaths in the United States (1). Upon diagnosis, 19% of CRC cases are metastatic and while the overall 5-year survival rate for patients with CRC is 65%, in metastatic disease it is only 12% (1). Emerging evidence demonstrates that tumor progression involves complex heterotypic multicellular interactions between cancer cells and tumor-associated mesenchymal cells (2). CRC is often accompanied by a well-orchestrated desmoplastic reaction, which involves the distant recruitment of bone marrow-derived mesenchymal stem cells (BM-MSC) in growing tumors. BM-MSC have the potential to differentiate into multiple cell lineages such as osteoblasts, chondrocytes and adipocytes (3). Mouse models reveal that BM-MSC migrate to colon tumor xenografts (4, 5) and are precursors of tumor-associated mesenchymal cells (6-8), which in turn stimulate cancer progression (9, 10). The tropism of MSC for tumors is thought to recapitulate their migration into wounds during wound healing and tissue repair (11, 12).
The human epidermal growth factor receptor (HER/ErbB) tyrosine kinases (RTKs) and their ligands are involved in cancer cell proliferation, survival, motility, invasion and metastasis. The following four HER receptors have been described in mammals: HER1 (ErbB1 or epidermal growth factor receptor [EGFR], HER2 [ErbB2 or neu], HER3 [ErbB3], and HER4 [ErbB4]). Activation of these receptors can occur by the following three different mechanisms: interaction with specific HER ligands, overexpression of the receptor, and molecular alterations such as point mutations or truncations. It is through dimerization and transphosphorylation that HER receptors perform their signaling functions. About 80% of all CRCs exhibit HER1 expression or overexpression correlating with increased metastasis and reduced patient's survival (13, 14). It has been indicated that HER3 expression is involved in CRC progression and that its phosphorylation is of prognostic value (15-17).
The neuregulin (NRG) family of growth factors comprises numerous heparin-binding glycoproteins that arise via alternative splicing off four distinct genes (NRG-1, NRG-2, NRG-3, and NRG-4). NRG-1 and NRG-2 are the most closely related: both interact with HER3. NRG-1 has a high binding affinity for HER3 and preferentially acts through HER2-dependent recruitment of PI3K (18-20). Alternative splicing and regulation through multiple promoters produce at least 15 different NRG-1 isoforms; most are synthesized as transmembrane precursors and released as soluble factors by action of cell surface proteases, such as tumor necrosis factor-alpha converting enzyme (TACE) (21, 22). NRGs are produced by epithelial cells in melanoma, breast and ovarian tumors (23, 24), but also by tumor-associated mesenchymal cells in gastric and breast tumors (25-27). US 2007/0275404 and Eschrich et al. (28) disclose that expression of the NRG-2 gene might be used as a prognostic marker for breast and colorectal cancer, respectively.
Yoshioka et al. (29) further disclose that NRG-1 (heregulin) might participate in a highly liver metastatic phenotype of a human colon cancer cell line via HER2/HER3 signalling. Liles et al. (30) disclose that fibroblast-derived NRG-1 promote proliferation of a pancreatic cancer cell line via phosphorylation of HER3 and that said proliferation can be best disrupted through combined HER1 (EGFR)-HER3(erbB3) inhibition. Venkateswarlu et al. (Oncogene 2002: 78-86) disclose that autocrine heregulin is responsible for cell cycle re-entry of colon cancer cells and that heregulin neutralizing antibody treatment generates apoptosis of the latter cells. Tatsuguchi et al. (Gastroenterology 2011, vol 140 No 5 suppl 1: S340) further disclose that significantly higher expression levels of heregulin are found in CRC tissue samples (i.e. predominantly in the cytoplasm of cancer cells) compared to normal tissue counterparts and concludes that heregulin may be a useful marker of prognostic significance in CRC patients. Yonezawa et al. (Gastroenterology 2004, vol 126 No 4 suppl 2: A263) disclose that heregulin overexpression was immunohistochemically observed in cancer cells and mesenchymal cells and that heregulin might regulate VEGF secretion through autocrine and paracrine mechanisms. However, no correlation has been described or suggested between high expression of transmembrane heregulin in solely mesenchymal cells and a worse prognosis.
About 19% of CRC patients present initially with metastatic disease and the standard chemotherapy regimen for these patients are the chemotherapeutic agents 5-fluorouracil, irinotecan, and oxaliplatin, often in combination with the monoclonal antibodies cetuximab or panitumumab (31, 32) (NCCN Clinical Practice Guidelines in Oncology. Colon Cancer. Version 3.2011). Cetuximab and panitumumab bind to HER1 (EGFR) on cancer cells, thereby blocking the downstream intracellular signaling pathways. One member of this cascade is KRAS, and over the recent years increasing evidence suggested that patients with KRAS mutations do not benefit from the addition of cetuximab or panitumumab to standard chemotherapy (33). KRAS mutations are found in approximately 40-60% of all CRC specimens. As a consequence, KRAS testing is mandatory for patients with metastatic CRC before receiving cetuximab or panitumumab (33).
Pertuzumab is a recombinant, humanized mAb that specifically binds HER2 (34) and prevents HER2 homo- and HER2/HER3 heterodimerisation (35). Because of this mechanism of action, pertuzumab antitumor activity is not restricted to tumors with HER2 overexpression and therefore differs from the therapeutic monoclonal antibody trastuzumab, which binds to a non-overlapping juxtamembrane region of HER2's extracellular domain and cannot inhibit HER2/HER3 heterodimerisation. In addition, a phase I/II clinical trial is currently ongoing in Canada and the United States to study the effectiveness of pertuzumab combined with cetuximab in patients with locally advanced or metastatic CRC who did not respond to cetuximab (36).
The present invention discloses that increased levels of transmembrane type 1 neuregulin-1 in tumor-associated mesenchymal cells in a sample of human colorectal cancer patients surprisingly and significantly correlate with a worse prognosis of said patients in terms of tumor stage, invasion depth and 5-year progression-free survival. The latter prognosis further indicates that these patients would benefit from a therapy based on the prevention of neuregulin-1 and/or HER3 activity. The latter prognosis is thus valuable to fine tune therapy of colorectal cancer by predicting whether a patient would benefit from a combined treatment of—for example—pertuzumab with cetuximab and/or whether a patient has resistance to HER1 inhibitors such as cetuximab.

Neuregulin-1-based prognosis and therapeutic stratification of colorectal cancer


A refillable lipstick includes a long cylinder, a guide rod extending in the cylinder to be pushed by a cone-shaped push button with an upper end of the guide rod and fitted in a cone-shaped hole of a stopper fixed in the upper end of the cylinder to let air enter and compressed to squeeze colloid lipstick to spread on a brush fixed under a cylindrical head threadably connected with a lower end of the cylinder. A guide brush fixed under a lower end of the guide rod is fitted in the brush to let colloid lipstick spread on the brush. The push button can be repeatedly pressed and pushed backby a compressing spring fitted between the push button and a position disc. The cylindrical head can be screwed off for refilling lipstick in case of lipstick stored in the cylinder used up.

This invention relates to a refillable lipstick, particularly to one utilizing a push button to force air into a long cylinder so as to push colloid lipstick to a brush fixed at a cylinder head, with colloid lipstick being painted with the brush on a lip of a user. Then colloid lipstick may be refilled in the cylinder for using the cylinder again and again, saving expense.
A known conventional lipstick shown in FIG. 1, includes a rotatable outer cylinder 10, a threaded rod 100 fixed in the outer cylinder 10, an inner cylinder 11 provided in the outer cylinder 10, and a lipstick movably fitted in the inner cylinder 11.
The inner cylinder 10 has an exit 110 formed in a front end, and a threaded sleeve 111 is fitted around a rear end of the inner cylinder 11 and threadbly connected with the threaded rod 100 in the outer cylinder 10. Further, a push disc 101 is provided to be located just behind a rear end of the lipstick 12, urged by a front end of the threaded rod 100. A tubular cap 13 closes a front end of the inner cylinder 11, having an inner annular wall 130 formed in a rear portion, and a cone-shaped inner wall 131 formed in front of the inner annular wall 130.
In using, the outer cylinder 10 is rotated clockwise, permitting the inner cylinder 11 to move in the outer cylinder 10 by means of the threaded rod 100 engaging with the threaded sleeve 111. Meanwhile, the threaded rod 100 pushes the push disc 101, forcing the lipstick to extend out of the exit 110 for use.
If the lower end of the lipstick 12 is needed to be shaped pointed owing to it flattening or becoming broken, the outer cylinder 10 is rotated to force the inner cylinder 11 move in the outer cylinder 10, with the threaded rod 100 pushing down the push disc 101, which then pushes the lipstick 12 to protrude gradually out of the exit 110, with the lower end of the lipstick 12 moving in the cone-shaped wall 131 and be squeezed and formed into the cone shape of the wall 131, convenient to be painted on a lip.
The conventional lipstick utilizes rotation of the threaded rod 100 to push the lower end of the lipstick 12 into the cone-shaped wall 131 to be shaped as a cone for use. However, chances are that the lipstick 12 may be either squeezed excessively to flow out of the exit 110 or squeezed not enough to shape it into a cone for use. Thus, flowing volume is not easy to control and the lipstick is liable to harden and stick on the cone-shaped wall 131 and not easy release. Besides, in cold winter weather the lipstick easily condenses into solid, and is difficult to be squeezed forward.