A beach towel made of terry cloth which is round, square and rectangular.

People go to the beach for relaxation. One of the usual objects that is brought to the beach for comfort is a towel. It can be a big towel that is spread on the sand and where people sit or lie on. The ordinary towel comes in many sizes and shapes. It is square, rectangular or round. The beach umbrella is almost always round. When the heat becomes uncomfortable, a beach umbrella is brought out to provide shade.
Ordinarily, comfort given by the towel and the umbrella is limited to one side and is not maximized. With a round, rectangular or square towel that has one hole in the middle and one hole in any of the edges or perimeter where the handle of the umbrella is planted in any of the two holes, shade is maximized and comfort enjoyed by whoever is seated, lying down or standing on the towel.
The beach towel is made of terry cloth for easy maintenance. Since the towel is light to carry, it can be used in any place where an umbrella's handle can be planted.
The beach towel can be used in the frontyards, backyards, parks, along rivers, beaches and lakes, at camps and anywhere where there is a need for one.
So far, there is no comparable beach towel in the market with one hole in the middle and a second hole in any of the edges or perimeter for an umbrella's handle to be planted.
The prior art cited below describes examples of attempts to provide for some or all the noted capabilities but, as shall be seen, each falls short of completely achieving these goals.
U.S. Pat. No. 4,278,719 issued to Sarnecki discloses a waterproof backed towel comprised of a backing sheet of waterproof nylon and a terrycloth cover sheet.
U.S. Pat. No. 4,794,029 issued to Tennant et al. discloses a round towel that converts into a handbag.
U.S. Pat. No. 293,060 issued to Botbol discloses a circular towel used for sunbathing.
U.S. Pat. No. 5,059,463 issued to Peters discloses a circular mat having an outer rim that is reinforced by a steel ribbon keeps its shape while laid out and also allows for ready folding and storage.
Accordingly, there exists a need for a towel that can be used with a beach umbrella. With respect to the above description of the beach towel, it is to be understood that the invention is not limited to its application in the beach but it can be used in parks, frontyards, backyards of residential houses and playgrounds. It is to be understood also that the terminology and phraseology employed herein are for the purpose of description and should not be regarded as limiting.
As such, those skilled in the art will appreciate that the conception upon which this disclosure is based may readily be utilized as a basis for designing other materials, methods and systems for carrying out the purposes of the disclosed invention.
It is important, therefore, that the object and claims be regarded as including such equivalent constructions and methodology in so far as they do not depart from the spirit and scope of the present invention.
Further objectives of the invention will be brought out in the following part of the specifications where detailed prescription is for the purpose of fully disclosing the invention without placing limitations thereon.

Abstract: A round, square, or rectangular beach towel made of terry cloth has two holes—one in the middle and the second along the perimeter of the round beach towel and along any edge of the square or rectangular beach towel. Comfort provided by the beach towel when paired by a beach umbrella whose handle is planted either in the middle hole or in any hole along the perimeter or edge it shade. This kind of beach towel may be used not only in beaches but also in front and back yards, parks, playgrounds, camps, picnic areas or any place where relaxation and comfort benefit users who prefer lying down or sitting on towels rather than sitting on chairs.


A boom arrangement (1) for a scaling device including a scaling boom for supporting a scaling hammer, wherein the scaling boom is arranged for connection to a carrier vehicle, is distinguished in that the scaling boom (4,5) is pivotally supported by a boom column unit (3), which is arranged for pivotal connection to the carrier vehicle, that the boom column unit (3)includes a boom column (7), and a column bar unit (8) extending at a distance from that element, that the boom column and the column bar unit are pivotally connected to a column link (9) for forming a four-link mechanism, and that the column link (9) supports a bearing for a boom lift cylinder (12). The invention also concerns a scaling device.

Scaling means in rock engineering clearing and loosening of loose rock after for example blasting in tunnelling, drifting etc. A known equipment for mechanized scaling includes a carrier vehicle, whereon is arranged a rotatable and pivotable scaling boom having an outer pivotal arm, at the free end of which is pivotally arranged a percussive hammer.
When performing the scaling operation with the known equipment, the operator is directing the hammer against the surfaces to be worked on by controlling the hydraulic cylinders of the boom arrangement. This means relatively complicated control work, since the operator has to control and compensate the different cylinders of the unit in dependent of the position of the boom with respect to the carrier vehicle. In practice, therefore, long term training is required for the operator to be able to handle the equipment at least somewhat efficiently with good precision.
One of the reasons for this is that the character of the scaling work is such that the equipment needs to be very robust and that different types of sensors are undesired. A solution with program control has therefore not been considered to be sufficiently reliable in the environment which prevails where the equipment is to be used. This is because the equipment constantly risks to be subjected to falling stones and even stone blocks.
Even if the above mentioned known scaling device is operated by an experienced and trained operator, its drawbacks lead to slow and thereby uneconomic procedure.
Aim and Most Important Features of the Invention
It is an aim of the present invention to provide a boom arrangement for a scaling device which allows better possibilities of control, and thereby provides provisions for more efficient and more economic scaling. This aim is achieved in a boom arrangement of the above mentioned kind through the features of the characterising portion of claim 1.
Hereby is achieved a boom geometry which allows an essentially more advantageous motion of the hammer essentially irrespective of which position the boom is standing in. In any case this concerns the positions that define the working area of the equipment. The greatest part of the scaling is typically performed in the roof of the space to be scaled, which means that a natural, horizontal movement of the hammer along the roof, which is achieved through the invention, is very suitable.
It is achieved through the invention with the pivoting of the boom column, an essentially horizontal movement of the hammer along a considerable length of the movement. According to the known art there is no corresponding horizontal movement achieved whatsoever. The small vertical movement which occurs because the upper end of the boom column, as well as the hammer itself, moves along a circular arch, can be essentially neglected in relation to the considerable horizontal movement which occurs in operation. The small vertical movement is very easily compensated for by the operator.
By it being so that the boom lift cylinder is positioned below the scaling boom, said cylinder is protected from falling stones.
Even if the invention is particularly advantageous for scaling work along horizontal surfaces such as tunnel roofs etc. it is also advantageously applicable for scaling on vertical surfaces such as tunnel walls etc. In this regard the invention is not inferior in comparison with the known art.
A scaling equipment as intended here works in a very unusual environment. It is common that very large pieces of rock falls down on the boom during operation. Through the invention, the boom lift cylinder will be protected against such pieces of rock to a high extent while maintaining the very advantageous working geometry which is provided by the further features of claim 1.
The central position of the cylinder which is made possible through the invention also brings along possibilities of enhanced view for the operator and enhanced rigidity for the boom.
The latter is of particular importance for scaling work sideways, when torsional stiffness is of great importance, which the forked embodiment allows.
It is preferred that the boom column and the column bar unit are essentially parallel and it is particularly preferred that the four-link mechanism forms a parallelogram. Hereby the lower pivot axes for the boom column and the column bar unit are preferably at the same horizontal level, whereby also the pivot axes of the column link formed with the boom column and the column bar unit are also positioned essentially on the same horizontal level for achieving said parallel displacement of the hammer.
When the support arm or the corresponding element is made in one piece with the column link, a stable and robust construction of these elements is achieved.
The boom column is preferably constructed with an enlarged lower portion having sideways considerably separated bearings for achieving the required sideways stability. In order to achieve the necessary stiffness of the boom column, that element has a section with at least partially U-shaped, or rectangular closed section.
Suitably the boom column is constructed such that with retracted boom column, the support arm or the corresponding element is retracted into a space formed in the upper portion of the column. This gives the possibility of a compact construction.
The corresponding advantages are obtained in connection with a scaling device according to claim 16.
Further features and advantages will be evident from the following detailed description of embodiments.

Boom arrangement for a scaling device and scaling device


To preserve error context during a reboot of a computing device, firmware within the computing device can be configured to implement a method that includes determining where the error context is stored in volatile memory. The method can also include identifying a plurality of recorder regions in non-volatile memory that have been assigned to store the error context. The plurality of recorder regions can be disaggregated across a plurality of distinct non-volatile memory regions. The method can also include flushing the error context from a plurality of different volatile memory locations to the plurality of recorder regions in response to detecting a trigger. The flushing can occur prior to the reboot of the computing device. The method can also include restoring at least some of the error context to the volatile memory after the computing device has been rebooted.

Cloud computing is the delivery of computing services over the internet. Some examples of computing services that can be provided by a cloud computing system include storage, databases, networking, software, and analytics. The use of cloud computing technology has grown rapidly in recent years, due at least in part to the development of high-capacity networks as well as relatively low-cost computers and storage devices.
Broadly speaking, a cloud computing system includes two sections, a front end and a back end, that are in communication with one another via the internet. The front end includes the interface that users encounter through a client device. The back end includes the resources that deliver cloud-computing services, including processors, memory, storage, and networking hardware. These resources are connected by one or more communication networks. Advantageously, the group of networked elements providing services does not have to be individually addressed or managed by users. Instead, the entire provider-managed suite of hardware and software can be thought of as a "cloud."
The back end of a cloud computing system typically includes one or more datacenters. A datacenter is a physical facility that is used to house computing systems and associated components. A datacenter typically includes a large number of computing systems (e.g., servers), which can be stacked in racks that are placed in rows. An entity that owns and/or operates a cloud computing system can be referred to as a cloud computing provider. A cloud computing provider can have a plurality of datacenters, and these datacenters can be located in different geographical areas.
A "private cloud" is cloud infrastructure operated solely for a single organization, whether managed internally or by a third party, and hosted either internally or externally. A cloud is called a "public cloud" when the services are rendered over a network that is open for public use. Generally, public cloud service providers own and operate the cloud infrastructure at their datacenters and access to users generally occurs via the internet.
From time to time, a server in a cloud computing system can experience an unexpected failure. There are many different reasons why a server can fail. For example, a failure can occur when a computer program such as a software application or an operating system stops functioning properly. As another example, a failure can be caused by the malfunctioning of one or more hardware components.
It can be desirable to take certain actions when a failure occurs. For example, it can be desirable to capture error context. The term "error context" can refer to some or all of the contents of the server's memory when a failure occurs. Analyzing the error context can provide clues as to the cause of the server's failure. When a server experiences a failure, it can be desirable to capture the error context so that the error context can subsequently be analyzed.
The subject matter in the background section is intended to provide an overview of the overall context for the subject matter disclosed herein. The subject matter discussed in the background section should not be assumed to be prior art merely as a result of its mention in the background section. Similarly, a problem mentioned in the background section or associated with the subject matter of the background section should not be assumed to have been previously recognized in the prior art.

Preserving error context during a reboot of a computing device


A water tub including a fluid delivery system utilizes a removeable carrier to provide fluids to the fluid delivery system. In some instances, the carrier is disposable such that depletion of the fluids within the container results in the carrier being thrown away and replaced by an unused carrier. In other instances, the carrier is re-usable and is removed from the fluid delivery system when the fluids within the carrier need to be replenished. In some instances, the carrier can be manually attached and removed from the fluid delivery system without the use of any tools. In some such instances it will include a latching mechanism temporarily coupling the carrier to the fluid delivery system. The carrier may include a plurality of fluid containers, each container containing a fluid used for different types of maintenance of the water tub. The delivery system may utilize a dosing engine.

Water tubs are frequently used for recreational and/or therapeutic purposes. However, repeated and/or long term use tends to have a negative impact on water quality when water within such tubs is not replaced. As replacement of water in a water tub between uses is generally not convenient or cost effective, it is desirable to provide means for maintaining and/or improving water quality. Moreover, the benefits provided by a water tub are often enhanced by directing one or more streams/jets of water into the tub. As such, water tubs are frequently coupled to water circulation and/or filtration system.
As used herein, a water tub is any apparatus comprising a cavity sized and dimensioned to permit a person to submerge all or at least part of his/her body within water held in a cavity of the water tub. As such, a water tubs may be a spa, hot tub, or whirlpool bath. Such a water tub frequently has one or more support systems such as water circulation and/or filtering systems to maintain water temperature and/or quality. In many instances, such a tub will also include one or more outlets used to direct a stream/jet of water into the cavity in a direction likely to impact a person seated or standing within the cavity, or having a limb positioned within the cavity, particularly if the cavity contains the number of people it is adapted to hold. In some instances the cavity may be sized and dimensioned to allow one or more people to sit within the cavity and be submerged to chest or shoulder height. In other instances, the cavity may be sized and dimensioned to only permit a limb of a person to be submerged such as with a whirlpool bath sized for soaking a person's foot, ankle, and calf. As used herein, water tubs generally do not include tanks or other containers that are not adapted for human use in that they are not easily entered and exited by a person or animal, are overly large or to small for bathing and/or soaking, and/or comprise systems for creating or maintaining conditions not suitable for bathing and/or soaking such as extreme temperatures or maintaining a cavity filled with chemicals not suitable for a person or animal to bathe or soak in. Examples of various water tubs, water tub support systems, and related methods can be found by referring to U.S. Patents referencing one or more of classes U.S. Pat. Nos. D23/277, 4/488, 4/538, and/or any related subclasses. It should be noted that such patents are not necessarily all prior art, and referencing them herein is not an assertion or admission that they are prior art.
Although prior water tubs are known, there is a need for novel water tubs at least in part because previously known water tubs, support systems, and related methods do not provide a balance between features such as reduced cost and increased maintainability, operability, and portability that is suitable in all instances.

Fluid delivery system for a water tub using a removeable chemical carrier


A coating apparatus includes a rotating and holding mechanism which holds and rotates an object to be coated, a container which encloses the rotating and holding mechanism and prevents the dispersion of coating liquid supplied to the object, a washing fitting provided to the rotating and holding mechanism and which supplies washing liquid for washing off coating liquid which has attached to the inside of container. This washing fitting has a collection pool for collecting the washing liquid, and discharge holes through which the washing liquid in the collection pool is discharged by rotation of the rotating and holding mechanism. Thus, it is possible to evenly wash off coating liquid which has attached to the inside of the container in a short time with a small amount of washing liquid.

The present invention relates to a coating apparatus which rotates an object such as a semiconductor wafer to be coated, and coats a coating liquid to the surface thereof, and more particularly relates to a coating apparatus which can clean an inside of a container to which coating liquid dispersed by rotation of a spinner has been attached.
Conventionally, a resist rotary coating apparatus such as that shown in FIG. 17 has been used as a coating apparatus for rotating an object such as a semiconductor wafer to be coated and applying a coating thereon with a coating liquid. This coating apparatus is configured from a spin chuck 61 which is the rotation and holding means which holds a semiconductor wafer 60 horizontal and rotates it at high speed, a resist supply nozzle 62 which drops the coating liquid of resist liquid onto the semiconductor wafer 60, and an outer cup 63 and an inner cup 64 which form a container provided so as to enclose the semiconductor wafer 60 on the spin chuck 61.
The resist liquid which is dropped onto the semiconductor wafer 60 from the resist supply nozzle 62 is uniformly coated onto the semiconductor wafer 60 by the high-speed rotation of the spin chuck 61 and excess resist liquid is dispersed in the direction of the periphery of the semiconductor wafer 60 and attaches to the wall surfaces of the outer cup 63 and the inner cup 64. If the resist liquid which has attached to the wall surfaces of the outer cup 63 and the inner cup 64 stays there, then the resist will form a layer and dry. The dried resist liquid will then flake from the wall surfaces of the outer cup 63 and the inner cup 64 when there is an impact force or the like and will be dispersed as particles which will contaminate the semiconductor wafer 60 and lower the yield of wafers. Because of this, the outer cup 63 and the inner cup 64 are periodically removed and the substances attached to them are removed by washing. However, this washing operation takes a large amount of time and trouble.
With respect to this, this coating apparatus is provided with a washing mechanism which automatically removes the resist which has adhered to the outer cup 63 and the inner cup 64. More specifically, as shown in FIG. 17 and FIG. 18, the cups 63, 64 are formed with lead-in paths 65a, 65b which lead the washing liquid L which dissolves the resist, ring-shaped supply paths 66a, 66b for the distribution and supply of the washing liquid L which has been led in from the lead-in paths 65a, 65b to around the entire periphery of the cups 63, 64, and a plural number of small holes 67 for conducting the washing liquid L of the ring-shaped supply paths 66a, 66b to the surface to which the resist is attached. A washing liquid lead-in tube 69 is connected to the lead-in path 65 via a connector 68. Then, the washing liquid L which has been supplied to the ring-shaped supply paths 66a,66b passes through each of the small holes 67 and flows out over the entire outer peripheral surface of the inner cup 64 and the entire inner peripheral surface of the outer cup 63.
In addition, as shown in FIG. 19, there has been proposed a technology (See Japanese Patent Laid-Open Publication No. 184725-1983, Japanese Patent Laid-Open Publication No. 73630-1987) wherein a separate washing means has a dummy wafer 70 mounted on a spin chuck 61 and the washing liquid L is supplied to the dummy wafer 70 from a washing liquid supply nozzle 62 while the spin chuck 61 is being rotated at high speed.
In addition to this, technologies have also been disclosed for this type of washing apparatus, as for example in Japanese Patent Laid-Open Publication Nos. 211226-1984, 73629-1987, 41630-1988 and Japanese Utility Model Laid-Open Publication No. 25665-1989.
However, with the washing mechanisms in the coating apparatus described above, as shown in FIG. 17 and in FIG. 18, the structure of the outer cup 63 and the inner cup 64 becomes complex and expensive, as a consequence, and the processing and mounting are also difficult. In addition, the washing liquid L flows through hundreds of small holes 67 but since the washing liquid L flows more easily along paths in which it has flowed before, the washing liquid L does not flow uniformly across the entire surface of the outer cup 63 and inner cup 64, and there is therefore the problem of uneven washing. Furthermore, with this washing mechanism, the method is such that the washing liquid L flows a little at a time and dissolves the resist and so washing not only takes a long time, but there is also a high consumption of the washing liquid L. In addition, there is also the danger of various types of trouble such as the washing liquid L leaking from the connector 68. Furthermore, it is difficult to control the direction of dispersion of the washing liquid, and here is also the problem that the cup cannot be effectively cleaned.
In addition, with the latter apparatus, that is, the apparatus shown in FIG. 18, there is the possibility that the amount of washing liquid consumed can be reduced along with the time required for washing but the carrying in and out of the dummy wafer 70 takes time, and it is also necessary to manually take the standby spacer for the dummy wafer 70 in and out. Furthermore, there is also the problem that the particles, which have adhered to the surface of the dummy wafer 70, attach to the spin chuck 61 and contaminate the semiconductor wafer 60.


A portable hard disk casing includes a hollow body with a front opening, a rear opening and two pairs of guiding tracks each formed on an inner face of the hollow body to be opposite to each other, two carriers for carrying thereon a storing unit, each carrier having two coupling ribs respectively formed on a side of the carrier to be opposite to one another to correspond to and to be received in the guiding tracks of the hollow body, a front cover to connect to the hollow body to cover the front opening of the hollow body and a rear cover to connect to the hollow body to cover the rear opening of the hollow body such that the storing unit is enclosed in the portable hard disk casing.

1. Field of the Invention
The present invention relates to a portable hard disk casing, and more particularly to the portable hard disk casing enabling the user to easily assemble the casing and maintain overall appearance of the portable hard disk casing.
2. Description of Related Art
A conventional hard disk casing normally is composed of a front cover, a rear cover, and a hollow body. After a storing unit is mounted on a face of the front cover or the rear cover, the front cover and the rear cover are assembled with two opposite sides of the hollow body. Another type of conventional portable hard disk casing is further provided with a carrier on which the storing unit is mounted. The carrier is then connected to the rear cover after the storing unit is secured. No matter what kind of structure of the conventional portable hard disk drive casing is, the weight of the storing unit will easily break the bonding with the rear cover due to torque between the rear cover and the storing unit. Furthermore, the conventional portable hard disk drive is not provided with a supporting device to stand the portable hard disk drive on a surface such that the operation of the hard disk is not convenient.
In order to overcome the aforementioned shortcomings, the present invention is to provide a portable hard disk casing that is easy for the user to assemble the storing unit inside the casing and does not worry about bonding breakage between the casing and the storing unit.
Other objects, advantages, and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.


A termination enclosure includes a chassis configured to hold optical terminations and optical splices. The optical splices are mounted to a removable splice drawer. In certain examples, the splice drawer is removed through a rear of the chassis while the optical terminations remain at the chassis. Optical splices can be made at a workstation remote from the chassis and stored in the splice drawer, which is inserted back into the chassis.

In fiber optic telecommunications systems, it is common for optical fibers of transmission cables to be split into multiple strands. Further, when such systems are installed, it is known to provide excess capacity in the installations to support future growth and utilization of the fibers. Often in these installations, modules including splitters or multiplexers may be used to provide the connection between transmission fibers and customer fibers.
Improvements are required.


To appropriately prevent an image with disadvantageous or inappropriate imaged content from being transmitted when such imaged content is generated in a use case such as real-time distribution of a captured image, and to prevent mistrust of a viewer due to malfunction or the like. Therefore, a transmission unit is caused to execute transmission of a first image that is delayed by a delay processing unit. If a switching trigger is detected during this time, the image that the transmission unit is caused to transmit is switched from a first image to a second image that is reproduced by a reproduction unit.

In recent years, a video camera or the like capable of live distribution, through a network, of image content such as a moving image or a stationary image that is being captured has become known as described in Patent Literature 1 listed below.
Also, services capable of real-time distribution of images to an unspecified large number of persons have also been widely used.
Note that, transmission of a face image using an image captured in advance instead of a real-time image of a speaker in a television telephone is described in Patent Literature 2 listed below.
A technology of extracting an appropriate section as a digest image from a moving image is disclosed in Patent Literature 3 listed below.

Image transmission apparatus and image transmission method


A pneumatic controller configured to regulate the opening and closing of a controlled device in response to a measured variable, such as temperature. The pneumatic controller includes a sensor providing an output proportional to the measured variable as well as a gas supply inlet and a gas outlet. A pneumatic relay is disposed between the inlet and the outlet for regulating the pressure of gas passing through the inlet to the outlet to the controlled device. A pneumatic actuator system is connected to the relay and regulates the relay via cooperation between an inflatable bladder and a pneumatic pilot circuit in the relay. The pneumatic actuator system includes a first electric microvalve which selectively permits passage of a gas into the inflatable bladder and a second electric microvalve which selectively permits passage of a gas out of the inflatable bladder in response to a digital controller connected to the sensor.

Pneumatic controllers, such as thermostats, are connected between a sensing element located in a regulated space and a controlled device operable to change the conditions of the space (e.g. HVAC systems and components). The sensor is sensitive to changes in the controlled space and able to consistently provide an output signal proportional to the level of a controlled variable, e.g. temperature or humidity. In response to the output signal, the controller actuates the controlled device to prevent excessive deviation of the variable from the desired setpoint. Generally, there are two main elements in a controller, a sensing element and a relay which produces an output in response to the sensing element to actuate the controlled device. The controlled device may take a variety of forms including, for instance, a valve or damper for admitting warm air into a room.
Often with heating, ventilating, and air conditioning systems, pneumatic controllers are used to provide a controlled pressure output which regulates the position of the controlled device. For example, a typical pneumatic system includes a compressor for supplying a pressurized source of air, typically at 15 or 20 PSIG. This supply air is delivered through conduits to a pneumatic relay having a valve for selectively permitting passage of the supply air through the relay to the controlled device. The valve is typically a diaphragm type valve whose position is controlled by the pressure level in a pilot circuit. The pilot circuit is a passage which allows a portion of the supply air to pass along one side of the diaphragm before exiting through a control port. The amount of resistance to air passing from the control port controls the pressure build-up within the pilot circuit and thus the position of the control valve.
A sensor, such as a bi-metal element, is disposed in proximity to the control port to change the amount of resistance relative to the level of the controlled variable. For instance, when the controlled variable, e.g. temperature, is at an equilibrium level with the setpoint, the bi-metal element will be at an equilibrium position. However, if the temperature deviates from the setpoint in one direction, the bi-metal element will bend away from the control port allowing free passage of supply air. On the other hand, as the temperature moves beyond the setpoint in the opposite direction, the bi-metal element will bend towards the control port tending to further restrict passage of air from the control port as the temperature change continues. This will of course change the pressure in the pilot chamber which, in turn, changes the position of the control valve to thereby increase or decrease the airflow and pressure to the controlled device as required in a particular application.
Although pneumatic control systems like the one described above work well in certain applications, other applications present greater difficulties. One difficulty is that use of a bi-metal element to sense a given variable and then control the pneumatic relay is often less precise than desired. For example, the bi-metal element may not react consistently to temperature change or it may react too slowly. This type of system makes it more difficult to maintain the temperature, for instance, of a room within a close range from the setpoint.
In other systems, digital controllers have been used to control the flow of air to the controlled device. For example, in Lilja et al., U.S. Pat. No. 5,114,070, a pneumatic thermostat is disclosed which uses an electronic to pneumatic transducer controlled by a microprocessor. This, of course, presents further obstacles because either electric wires must be run to the microprocessor to provide power or a remote power supply must be used. In Lilja, the use of a battery, solar cell, or air turbine is suggested to supply or supplement electric power to the microprocessor. One problem with this system is that when the battery goes dead the control system is no longer powered. Similarly, if there is an insufficient light or air supply to run the solar cell or air turbine, the pneumatic thermostat will not function.
The electronic to pneumatic transducer disclosed in Lilja uses a pair of solenoids to allow passage of air between the inlet pipe and the outlet pipe of the transducer or between the outlet pipe and atmosphere respectively. The solenoid valves are controlled by the microprocessor. This system requires solenoids capable of regulating the substantial air volume and air pressure in the main air supply conduit. Manipulating such solenoid valves requires a relatively large amount of power from the power source which increases the rate at which the power source is depleted. It would be advantageous to have a digitally controlled system that did not operate directly in the main air supply conduits and thus did not require such a substantial amount of energy.


The antenna apparatus, comprises a coaxial cable having a core conductive wire for feeding signal, a radiation unit coupled to the coaxial cable, wherein the material and character of the radiation unit is substantially the same with the one of the coaxial cable, wherein the length of the radiation unit is approximately ((¼)+n) λ of an operation frequency of the antenna apparatus, wherein the n is an integer number that is greater than or equal to zero.

Various types of antennas are rapidly improvement along with the development of the communication technology. The IC technology is also developed with fast pace to provide a product with smaller size and lighter weight. The volume fact is one of important considerations to the antenna used for transmitting and receiving signal. One goal of the manufacture is to achieve the small product with light weight.
Antenna is employed to transmit or receive EM wave. The characters of the antenna can be obtained from the operating frequency, radiation pattern, return loss and antenna Gain. Small size, good performance and low cost are the most important facts for the current antenna to share larger marketing.
Typically, the well-known 2.4 GHz omni-directional antenna mainly involves the so-called sleeve antenna structure or spring structure antenna. However, both of the systems are too huge, it is unlikely to achieve the size reduction purpose and can not adapted to the wireless USB adaptor that are configured in small space. On the other hand, the signal feeding end of the antenna needs additional control IC to adjust the impedance match. The design of the apparatus is complicated, thereby increasing the manufacture cost.
Thus, what is desired is to develop a cable type antenna to provide a product with smaller size, lighter weight, and with the omni-directional capability for achieving the reduction purpose. No additional impedance match circuit is needed.


In order to suppress generation of the line bow phenomenon created when light from a light source is collected into a linear form on the surface of an original document by a toric mirror, for example, and in order to obtain uniform lighting, the optical axis of the light source is made to be in a common plane with a line normal to the surface of the toric mirror. Accordingly, the light travelling to the toric mirror, between the light source and the toric mirror, and the light reflected by the toric mirror, travelling between the toric mirror and the second mirror, is not inclined relative to the toric mirror normal line. The second mirror, the optical path conversion mirror, can be a half-mirror positioned between the light source and the toric mirror. Alternatively, a separate light source can be provided on opposite sides of the second mirror. As another alternative, the second mirror can be divided into two portions, with the light source being provided between the two portions.

1. Field of the Invention
The present invention relates to a light-supplying optical device used in an image reading system that electrically reads image information of an original document, and, in particular it relates to a light-supplying optical device capable of suppressing the line bow phenomenon produced by a mirror, such as for example, a toric mirror that collects light from the light source into a linear form.
2. Description of Related Art
FIGS. 7 through 10 show the structure of one type of conventional image reading system. Referring to FIGS. 7 and 8, the image reading system includes an illuminating unit 3 that conducts light supplied from a light source 1 to the surface of an original document 2. The image reading system also includes a carriage 4 that supports and moves the original document 2, and a projection unit 6 that forms the light that passes through the original document 2 into an image on a linear sensor 5 (e.g., a CCD:Charge-Coupled-Device).
The illuminating unit 3 includes a plate-like base member 7 on top of which are attached a light source 1 that emits light radially, a first mirror 8 and a second mirror 9 that change the direction of the light so that it is formed into a line on the surface of the original document 2. An illuminating unit lid 11 containing a slit 10 through which light can pass is fixed to the base member 7 by means of a hook-shaped fastener 11a so as to cover the light source 1, the first mirror 8 and the second mirror 9. Light from the light source 1 is collected by the first mirror 8 so as to form a line on the surface of the original document, and is bent (i.e., reflected) in the direction of the original document, i.e. in the vertical direction, by the second mirror 9.
Accordingly, light from the second mirror 9 is formed into the shape of a long, thin rectangle (i.e., an area of light extending in a primary scan direction) close to where it passes through the slit 10 in the lid 11. Because the slit 10 provided in the lid 11 should be the size needed for the passage of light, it is in the shape of a rectangle, slightly larger than the rectangular shape of the light. In addition, a plate 11b is bent inward on part of the slit 10 so as to prevent external light from the opening 12 provided in the front of the base member 7 from reaching the light source 1 by passing through the slit 10.
The upper carriage portion 4a and lower carriage portion 4b that support the original document 2 are guided by two parallel guide bars 13 so as to be capable of moving to the left and right as shown by arrow A--A (in what is known as the secondary scan direction). A rack unit, not shown in the drawing, is provided on part of the upper carriage 4a, and is engaged with a pinion gear. The carriage 4 moves back and forth by means of the pinion gear engaging with the carriage rack, the pinion gear being driven by a stepping motor or similar means.
The projection unit 6 includes a third mirror 14, a lens 15, a CCD 5 and a projection unit lid 17 that covers the entire unit and is provided with a slit 16 that allows light passing through the original document to enter the projection unit 6. In addition, a plate 17a is bent inward from the slit 16 in the projection unit lid 17 as was the case with the illuminating unit lid 11, the plate 17a preventing external light from the opening 12 from entering the projection unit 6 through the slit 16. The illuminating unit lid 11 and the projection unit lid 17 both have surfaces that are black and have been deglossed so that the lids themselves do not reflect external light.
FIGS. 9 and 10 show the composition of the light source of such a conventional device. The light source 1 has six blue LEDs 21, which function as a first light producing means, and four green LEDs 22 and two red LEDs 23, which function as a second light producing means, each of the LEDs 21, 22 and 23 being mounted on a stem 24. The blue LEDs 21 are arranged in a single straight line, and the green LEDs 22 and red LEDs 23 are arranged in a parallel straight line. The optical axis of light produced by the LEDs 21, 22 and 23 and reflected by the surface of a mirror 25 provided in the light source 1 as a reflecting optical system is positioned so as to fall in a single plane.
The 12 LEDs 21, 22 and 23 are mounted on a stem 24 formed of electrically conductive materials in a plate shape, one electrode of each LED 21, 22 and 23 being connected to the stem 24. The other electrode of each of the LEDs 21, 22 and 23 is connected via a wire 28 to an electrode 27 mounted on the stem 24 by means of an insulating material 26. A conical reflector 24a that reflects light produced in the sideways direction and directs it upward is formed in the stem 24 around each of the LEDs 21, 22 and 23. Light reflected by each of the reflectors 24a is reflected by the reflecting mirror 25 and directed toward the front (the right in FIGS. 9 and 10), and is further collected in a linear form on the surface of the original document 2 by mirrors 8 and 9.
The light produced by the blue LEDs 21 is reflected by a blue reflecting film 25a formed on a first surface of the reflecting mirror 25, while light from the green LEDs 22 and red LEDs 23 is reflected by a wholly reflecting film 25b, formed on a second surface of the reflecting mirror 25. As a result, when viewed from the front, it appears that all three colors of light are emitted from the same position. In addition, switching between the three colors blue, green and red is controlled electrically, making it possible to read the original document 2 at high speed. A 45.degree. prism 29 also is provided on the light-emitting surface of the reflecting mirror 25.
A toric mirror is used as the first mirror 8. The toric mirror 8 is comprised of a curved surface having curvature in both the lengthwise direction (i.e., the horizontal direction as shown in FIG. 8) and in a direction perpendicular to the lengthwise direction (i.e., the vertical direction as shown in FIG. 7). The arrangement is such that light produced by the light source 1 illuminates a width of one line on the document by means of the curved surface in the lengthwise direction. That is, the curvature R1 in the lengthwise direction causes the rectangle of light reflected by toric mirror 8 to have a certain length. The light image provided by light source 1 is formed into a linear image onto the surface of the original document by means of the curved surface in the direction perpendicular to the lengthwise direction. That is, the curvature R2 in the direction perpendicular to the lengthwise direction causes the rectangle of light reflected by toric mirror 8 to have a certain width, which usually is much less than the length.
Light emitted from the light source 1 is incident on the toric mirror 8 at an angle .THETA. relative to a line 18 normal to a central portion of the mirror 8. Accordingly, the light reflected by the toric mirror 8 is reflected at the angle .THETA. relative to the line 18. Such light is formed into an image on the surface of the original document 2 by means of the second mirror 9, which also is referred to as an optical path conversion mirror. By moving the carriage 4 that holds the original document 2 in the secondary scan direction indicated by arrows A--A, the CCD 5 successively reads image information from the entire surface of the original document (one line at a time).
However, with the described conventional image reading system, light emitted from the light source 1 is incident at the angle .THETA. from the line 18 normal to the toric mirror, while the toric mirror has curvatures R1 and R2 in the perpendicular directions as shown in FIGS. 11A and 11B, which are top and side views, respectively, of the light-supplying optical system in an unfolded state. Consequently, the angle of light reflection varies between the ends and the center of the toric mirror 8. As a result, the light source image 31 formed on the surface of the original document 2 is bow-shaped, as shown in FIG. 11C, thus creating the so-called line bow phenomenon. On the other hand, because the reading line 32 of the CCD 5 on the surface of the original document is a straight line, a problem arises in that lighting cannot be obtained that is uniform at both the center and at the ends of the reading line 32, as indicated in FIG. 11D, which is a graph showing the amount of light received by the CCD 5 relative to positions along the CCD 5.


A method of reading data includes: receiving a digital signal, wherein the digital signal includes a sync signal and a data signal; performing an oversampling operation to the digital signal, and calculating a plurality of sampling points according to the oversampling operation; by a first counter counting the sampling points to obtain a first count value; based on the first count value defining a second count value; defining a unit interval; in the unit interval, defining a data reading range; and in the data reading range, reading the data signal corresponding to data of the unit interval as a first value when a potential of each of the sampling points counted is changed from a first potential to a second potential.

The DisplayPort is a digital multimedia interface standard set by the Video Electronics Standards Association (VESA). In the DisplayPort specification, a signal channel comprises a main link and an auxiliary channel. The main link is configured to transmit video data, and belongs to high speed one manner output. The auxiliary channel comprises an auxiliary signal pair configured to transmit information other than video data, for example information about status of a transmitter device and a receiver device, instructions for controlling the transmitter device and the receiver device, audio frequency, etc., and it belongs to low speed two-way communication and is configured to serve as communication between the transmitter device and the receiver device before the main link starts to transmit the video data.
FIG. 1 illustrates a conventional system framework diagram applied with a DisplayPort interface. With reference to FIG. 1, the DisplayPort interface comprises a main link 30, an auxiliary channel 31 and a hot plug detect (HPD) signal line 32. A transmission bandwidth of 1 Mbps provided by the auxiliary channel 31 is for two manner transmission between a transmitter device (source device) 1 and a receiver device (sink device) 2.
In the conventional chip design, to lower the cost and power, a method without phase-locked loops (PLLs) is employed. Therefore, if it is necessary to sample a transmission signal of the auxiliary channel 31, a ring oscillator clock can be used to sample the transmission signal. However, the designed method sometimes has variation of sampling frequency resulting from the pressure in the working environment, the temperature, the instantaneous voltage of a circuit, which causes sampling frequency to fluctuate to be imprecise. For example, when a frequency of a predetermined annular oscillator is 10 MHz, because influence of the pressure in the working environment, voltage, and temperature, an actual sampling frequency of the annular oscillator is merely 8 MHz, which does not reach an ideal value (i.e. 10 MHz). Alternatively, a first sampling frequency is 8 MHz, and a second sampling frequency is 8.5 MHZ, which has shifting frequency phenomenon. Because a sampling frequency of a conventional circular oscillator varies in a large range, it is challenging to correct obtain data.

Method of reading data and data-reading device


A method implemented in a node to forward data packets via a communication link to another node. The method includes receiving an indication of a resource level associated with one or more ports among the other node's ingress and egress ports. The indication to be received via a side-band communication link coupled to the other node. The method further includes forwarding one or more data packets associated with data to the other node based on the indicated resource level received via the side-band communication link.

In networking environments communication mediums linking nodes are continually operating at higher link speeds (e.g., 1 gigabits/second or greater). In addition, some nodes in a network may have numerous ports to receive or forward data packets associated with data. This data may follow a data or a control path as it is processed and/or is forwarded by the receiving node. The data path requires less node resources since it is primarily port specific. But the control path uses more node resources (e.g., processing power, memory and bandwidth). More node resources are used because the control path needs the node's resources to support many features for all the ports in the node, e.g., various lookups, access control, port arbitration, etc.
In one example, resource constraints at a receiving node on a communication link may lead to congestion. In this example, a forwarding node may forward the data at a rate faster than the receiving node can process. The resource constraints at the receiving node may lead to a throughput/processing disparity between the two nodes. As a result, congestion in the receiving node may occur for data that follows either a data or control path.
Flow control is an example way of addressing congestion at the receiving end of a communication link. One typical way to implement flow control is to send a message via the communication link (in-band), for example, a pause frame. The message instructs one or more other nodes to stop forwarding data to a congested node until another message is sent from the congested node that instructs the transmitting node(s) to remove the pause and begin/continue to forward the data. This type of in-band flow control is used, for example, between nodes communicating in an Ethernet Local Area Network (LAN) operating in compliance with the Institute for Electrical and Electronic Engineers (IEEE) 802.3 standard for the CSMA/CD (Carrier Sense Multiple Access with Collision Detection) protocol. See IEEE 802.3-2002: IEEE Standard for Information technology—Telecommunications and information exchange between systems—Local and metropolitan area networks—Specific requirements Part 3: CSMA/CD Access Method and Physical Layer Specifications, published August 2002, and/or later versions of the standard (the "Ethernet standard").
Another way to implement flow control is using a given Packet to Packet Gap (PPG) at the transmitting node. In one example, PPG is a sum of an Inter Packet Gap (IPG) and a packet length or size. Stated differently, PPG may be the gap between the start times of two consecutive packets. The given PPG is typically determined based on the disparity in the throughput capability (e.g., packets/unit of time) of the transmitting node as compared to the receiving node over a communication medium.


The apparatus has a balanced capacitive probe for collecting a small portion of a carrier signal on a pair of wires. The collected portion of the carrier signal is mixed with a local oscillator signal so as to produce a heterodyned signal having a low frequency component and a high frequency component. The frequency of the local oscillator signal is selected to be within a few Kilohertz of the carrier signal so that the low frequency component is within an audible range. A low pass filter removes the high frequency component. The low frequency component is amplified and converted to sound. The audible signal is a representation of the carrier signal and allows a technician to determine the relative strength of the carrier signal and to identify the type of carrier signal on the wire pair. The probe enhances discrimination between uncoupled signals and coupled signals such as cross-talk.

Telephone systems in general use both copper wires and optical fibers to carry telephone signals. Much of the physical equipment already in place is copper wire and its associated equipment. Traditionally, a pair of copper wires was used to carry only a single conversation. Nowadays a single pair of copper wires can carry multiple conversations by way of multiplexing. Multiplexing increases the capacity of the telephone system by allowing the system to carry more calls. One type of multiplexing uses a digital carrier signal. The audio information is digitized and sent over the wires on the digital carrier. Examples of standard digital carriers that have been adopted by the telephone industry are T-1 and T-2. These are pulse code modulation carriers.
Field technicians working on a telephone cable of copper wire must frequently locate those particular copper wires in the cable bundle that have carrier signals on them. The field technician may be tracing a particular pair of wires or he may be attempting to locate an unused pair, that is a pair without a carrier signal thereon, in the cable. He can then use this unused pair to communicate with other technicians along the cable.
At voice frequencies, where a pair of copper wires carries only a single conversation, the technician can use simple test equipment to detect a pair that is in service. The test equipment may either capacitively or conductively load the wire pair. At voice frequencies (about 200-3200 Hz), this is acceptable because there is little or no degradation of service. However, at the higher frequencies used by digital carriers (772 KHz on up), such loading by test equipment can cause degradation and interruption of telephone services on the wire pair. Thus, some type of non-invasive equipment must be used when testing a pair of wires to determine the presence or absence of a digital carrier.
In the prior art of which we are aware, there is a non-invasive apparatus for detecting digital carriers. The prior art apparatus uses inductive or capacitive coupling to obtain a signal from the wire pair. The signal is filtered so as to pass only carrier frequencies. The signal is then amplified and detected. When the signal exceeds a certain threshold, it sounds a buzzer, thereby indicating the presence of a carrier.
The prior art apparatus suffers from the disadvantages of being unable to provide information on relative carrier signal strength and on carrier identity. Relative carrier signal strength is useful to determine if the carrier signal that is detected on a particular pair of wires is due to the pair actually being in service or instead is due to only a crosstalk signal that has been coupled to the pair that is being probed. Determination of carrier identity is useful in tracing lines through the local network and in particular in the central office.

Method and apparatus for detecting digital carrier signals on telephone cables


The disclosed embodiments relate to a method for the production of a layer arrangement, a layer arrangement and a memory arrangement. According to one aspect at least one respectively laterally defined first layer sequence is embodied on a first surface area of a substrate and at least one respectively laterally defined second layer sequence is embodied on a second surface area of the substrate in order to produce a layer arrangement. A first side wall having a first thickness is respectively produced from a first electrically insulating material on at least one partial area of the side walls of the first and second layer sequences. A second side wall layer having a second thickness is respectively produced from a second electrically insulating material on at least one partial area of the first side wall layers and the second side wall layers are removed from the first layer sequences.

In view of the rapid ongoing development of computer technology, there is a need for a memory medium which makes it possible to store an ever greater quantity of information on ever smaller arrangements. In the field of non-volatile memories, which, once they have been programmed with the information item to be stored, retain this information item permanently without ever losing it, it is customary for data quantities of one bit or more to be stored in each transistor of a large arrangement of transistors. By way of example, Widmann, D, Mader, H, Friedrich, H (1996) "Technologie hochintegrierter Schaltungen" [Large-scale integrated circuit technology], Chapter 8.4, Springer Verlag, Berlin, ISBN 3-540-59357-8, provides a summary of non-volatile memories.
As miniaturization continues, conventional silicon microelectronics will reach its limits. In particular, the development of ever smaller and more densely arranged transistors, which has by now reached several hundred millions of transistors per chip, will come up against basic physical problems in the next ten years. When feature sizes drop below 80 nm, the components are disruptively affected by quantum effects, and these effects become dominant at sizes of below approximately 30 nm. Also, the increasing integration density of the components on a chip leads to a dramatic rise in the waste heat which is generated. Therefore, increasing the storage density of transistor arrangements by means of ongoing miniaturization of the structure dimensions is a concept which imposes high technological demands on the basic fabrication methods.
In the case of what is known as embedded technology, transistors with different requirements are integrated in a single integrated circuit, i.e. in a chip. For example, it may be necessary to integrate transistors of different configurations in a memory region of the chip (for example in a flash memory arrangement or an EEPROM) and in a logic region of the integrated circuit. In a scenario of this nature, different demands are imposed on the structural and physical parameters of the integrated transistors.
To form a transistor in a logic region, which logic region is to be sufficiently fast, a logic transistor of this type needs to be separated from its surroundings by a side wall oxide layer which is as thin as possible. A thin side wall oxide layer is necessary in a logic transistor in order to ensure a low connection resistance: a layer arrangement which serves as a logic transistor on a substrate can be coupled to the surroundings by doping atoms being injected into the boundary regions on both sides between the laterally delimited layer arrangement and the substrate ("lightly doped drain"). If in the case of a logic transistor, the side wall oxide layer is too thick, the region of overlap between the doped region in the silicon substrate and the gate oxide region of the transistor is small, and consequently the logic transistor has a high impedance. In other words, the further the lightly doped drain regions are formed outside the end sections of the logic transistor on both sides, the higher the impedance of the logic transistor becomes. To ensure that the logic transistor is sufficiently fast, the side wall oxide layer of the logic transistor should therefore be sufficiently thin (e.g. approx. 5 nm to 7 nm for the 130 nm technology generation). On the other hand, it is important for a side wall oxide layer to be present in a logic region, in order to form a well-defined surface at the side wall of the gate electrode made from polysilicon (polycrystalline silicon), in order to saturate surface charges as occur, for example, during the method of fabricating the logic transistor and to anneal plasma etching damage as may occur, for example, during the CVD (chemical vapor deposition) process which is frequently used in the fabrication of transistors.
On the other hand, it is aimed for the side wall oxide layer of a memory transistor in a flash memory or an EEPROM memory to be a sufficiently thick side wall oxide layer. A sufficiently thick side wall oxide layer ensures in a charge-storage layer that the information which is stored in the memory transistor and is coded in the amount of electric charge contained in the charge-storage layer is reliably retained. This leads to a sufficiently long hold time for the stored information, which is essential for the functionality of a memory transistor. Furthermore, a thick side wall oxide layer in a memory transistor leads to the avoidance of ion damage at the tunnel oxide edge, which adversely affects the functionality of a memory transistor, and to the avoidance of undesirable charging of the floating gate by subsequent implantations of ions for forming doped regions in surface regions of a substrate. Furthermore, a sufficiently thick side wall oxide layer keeps boundary charges caused by a silicon nitride spacer which is often formed during fabrication of the memory transistor away from the floating gate or from the gate oxide layer, thus ensuring perfect functionality of the memory transistor. The thickness of the side wall oxide in a memory transistor should be at least 10 nm.
The contradictory demands imposed on the thicknesses of the side wall oxide layers in a logic transistor and in a memory transistor on a chip which has both a logic region with rapid integrated logic for driving the memory region and a memory region with a multiplicity of memory transistors are often only taken into account in the prior art to the extent that a uniform thickness is selected for the side wall oxide layers of the logic transistors and the memory transistors. This uniform thickness is selected to be sufficiently small to obtain a logic transistor with a side wall thickness which is reasonably acceptable in the logic region and is also selected to be sufficiently great to obtain a memory transistor with a reasonably acceptable side wall thickness in the memory region. However, this compromise solution adversely affects the functionality of both types of transistors for the reasons listed above.
A compromise solution of this type is increasingly unsuitable for technologies which deal with transistors with a gate region length of 130 nm and below, if perfect functionality of the integrated circuits which these technologies produce is to be ensured. For a transistor with a gate region length of 130 nm and below, a side wall oxide thickness of significantly less than 10 nm is required for a perfectly functioning, sufficiently fast logic transistor, but this thickness is much too low for a memory transistor in a flash memory or an EEPROM.
The prior art has disclosed a method which makes it possible to fabricate an integrated circuit having a logic region with a logic transistor and a memory region with a memory transistor integrated on a common chip and in which the side wall oxide of the logic transistor and of the memory transistor can be formed in different thicknesses.
A method of this type, which involves the formation of logic transistors with a side wall oxide which is thinner than the side wall oxide of memory transistors formed on the same integrated circuit is described below with reference to FIGS. 1A-1I.
In the abovementioned figures, a left-hand region of the layer structures shown in each case represents a logic region of an integrated circuit (or more specifically a logic transistor of the logic region), and the region shown on the right-hand side represents a memory region (or more specifically a memory transistor of the memory region) of the integrated circuit. This is visually indicated in FIGS. 1A-1I by the fact that a dashed vertical line is included in the drawing, separating the logic region formed to the left of the dashed line from the memory region shown to the right of the dashed line.
To arrive at the layer structure 100 shown in FIG. 1A, a first silicon dioxide layer 102, a first polysilicon layer 103 and an ONO layer sequence 104 are deposited on a silicon substrate 101. An ONO layer sequence is a three-layer sequence comprising in each case one layer of silicon dioxide, silicon nitride and silicon dioxide. The first of the silicon dioxide layers of the ONO layer sequence 104 is deposited on the first polysilicon layer 103, the silicon nitride layer of the ONO layer sequence 104 is deposited on the first silicon dioxide layer of the ONO layer sequence 104, and the second silicon dioxide layer of the ONO layer sequence 104 is deposited on the silicon nitride layer of the ONO layer sequence 104.
The layer structure 105 shown in FIG. 1B is obtained by removing the first silicon dioxide layer 102, the first polysilicon layer 103 and the ONO layer sequence 104 from the entire logic region using a lithography process and an etching process.
To convert the layer structure 105 shown in FIG. 1B into the layer structure 106 shown in FIG. 1C, a second silicon dioxide layer 107, a second polysilicon layer 108 and a suitable hard mask 109 are deposited over the entire surface of the layer structure 105.
The layer structure 110 shown in FIG. 1D is obtained by the layer structure being patterned in the memory region (i.e. in the region to the right of the dashed line in FIG. 1C, FIG. 1D), whereas the logic region (region to the left of the dashed line in FIG. 1C, FIG. 1D) is covered. Since the structures formed in the memory region must lie within a small structural tolerance range, this patterning step is of crucial importance. This means that even slight inaccuracies in this method step will have a considerable influence on the functionality of the integrated circuit fabricated in this way. Therefore, this method step requires accurate setting of the process conditions, making this method step complex and expensive. As shown in FIG. 1D, only the top five layers are patterned in the memory region, whereas the first silicon dioxide layer 102 is retained in the memory region as well. This can be achieved by using a suitable etching process which is set up in such a manner that the etching process stops before the first silicon dioxide layer 102.
To achieve the layer structure 111 shown in FIG. 1E, the laterally delimited layer sequence which remains in the memory region after the patterning is covered with a first side wall oxide layer 112. This side wall oxide initially also grows on surface regions other than the laterally delimited layer sequence, including over the layers 102 and 109, and can be etched back, resulting in the layer sequence 111 shown in FIG. 1E. This leads to only a slight raising of the hard mask layer 109 (not shown) in the entire logic region during this method step. In other words, the side wall of the laterally delimited layer sequence in the memory region is covered with the first side wall oxide layer 112, whereas the logic region remains virtually unchanged.
The layer structure 113 shown in FIG. 1F is obtained by keeping the logic region covered while doping atoms are introduced into those surface regions of the silicon substrate 101 which are not covered by the laterally delimited layer sequence, using an ion implantation method, with the result that the LDD (lightly doped drain) regions 114a, 114b are formed.
To achieve the layer structure 115 shown in FIG. 1G, the memory region is then completely covered and the logic region is patterned using a lithography process and an etching process. To pattern the logic region into a laterally delimited layer sequence, a further patterning step of crucial importance is required. This means that even slight fluctuations in the procedure will immediately have an adverse effect on the functionality of the logic regions formed in this way. As with the first critical patterning step described above, this method step too requires a complex and expensive procedure which needs to be highly accurate. As shown in FIG. 1G, only the top two layers, namely the second polysilicon layer 108 and the hard mask 109, are patterned, whereas the second silicon dioxide layer 107 is not removed from the surface of the layer structure arranged in the logic region as a result of a suitable etching process being used. Consequently, the laterally delimited layer sequence which is shown in FIG. 1G and comprises the second polysilicon layer 108 and the hard mask 109 remains in place on the logic region.
The layer structure 116 shown in FIG. 1H is obtained by in each case applying a second side wall oxide layer 117 to the laterally delimited layer sequences in both the logic region and in the memory region of the flash memory or EEPROM. This is achieved by thermal oxidation of the side walls. The second side wall oxide layer 117 has a lower thickness than the first side wall oxide layer 112. As shown in FIG. 1H, the laterally delimited layer sequence in the logic region therefore includes a side wall oxide which corresponds to the thickness of the second side wall oxide layer 117, whereas the laterally delimited layer sequence in the memory region includes a side wall oxide layer whose thickness is composed of the thickness of the first side wall oxide layer 112 and the thickness of the second side wall oxide layer 117.
To achieve the layer structure 118 shown in FIG. 1I, implantation steps are carried out in both the logic region and the memory region, with the result that the first doped region 119a and the second doped region 119b are obtained in the logic region. In this way, the first HDD region 120a and the second HDD region 120b are produced in the memory region at the end sections of the laterally delimited layer sequences on both sides. HDD means highly doped drain, expressing the fact that the concentration of doping atoms in the HDD regions 120a, 120b is greater than in the LDD regions 114a, 114b. The laterally delimited layer sequence formed in the logic region forms a transistor with a side wall oxide having the thickness of the second side wall oxide layer 117. The first doped region 119a represents the first source/drain region, whereas the second doped region 119b forms the second source/drain region. The second silicon oxide layer 107 in the logic region forms the gate oxide layer, and the second polysilicon layer 108 forms the gate electrode in the logic region. The second side wall oxide layer 117 is used to laterally shield the transistor, and the hard mask 109 is likewise used as a protective layer.
The laterally delimited layer sequence formed in the memory region can be used as a memory transistor. The first LDD region 114a and the first HDD region 120a form the first source/drain region, the second LDD region 114b and the second HDD region 120b form the second source/drain region. The first silicon dioxide layer 102 constitutes the gate oxide region. The first polysilicon layer 103 can fulfill the functionality of a floating gate into which charge carriers can be permanently injected, for example by means of Fowler-Nordheim tunneling or by means of hot electrons. The ONO layer sequence 104 and the second silicon dioxide layer 107 effect electrical decoupling of the floating gate from the second polysilicon layer 108, which can perform the functionality of a gate electrode. The hard mask 109 represents a protective layer, and a sufficiently thick side wall oxide layer of the memory transistor is produced by means of the first side wall oxide layer 112 and the second side wall oxide layer 117.
However, the above-described method for forming logic transistors and memory transistors with different side wall oxide thicknesses has a number of drawbacks. As described above, two critical lithography steps are required during the method, and even slight deviations in these steps lead to wide-ranging negative consequences for the functionality of the arrangement. The execution of these two critical lithography steps makes fabrication of the layer structure 118 complex and expensive.
A further drawback of the fabrication method described is based on the fact that the gate patterning of the logic transistors, on the one hand, and of the memory transistors, on the other hand, are carried out in two separate method steps. The patterning of the memory transistors takes place in the method step in which the layer structure 110 shown in FIG. 1D is formed from the layer structure 106 shown in FIG. 1C. By contrast, the patterning of the logic transistors takes place in the method step in which the layer structure 115 shown in FIG. 1G is formed from the layer structure 113 shown in FIG. 1F. In practice, it is not possible to set absolutely identical conditions for these two method steps. However, it is important to provide structures with a homogenous surface coverage density in the logic region, on the one hand, and in the memory region, on the other hand. The surface coverage density is defined as the ratio of the sum of the areas which are covered in the logic or memory region divided by the total surface area of the logic region or of the memory region. The surface coverage density should ideally be as homogenous as possible over the entire chip, in order to be able to ensure minimal tolerances during fabrication of the gate electrodes.
If the surface coverage densities achieved by the two above-described method steps for patterning of the logic transistors, on the one hand, and the memory transistors, on the other hand, deviate from one another, the result will be a variation in the geometry of the gate electrode. Adverse effects which result from an uneven surface coverage density are referred to as etch loading effects. These have an adverse effect on the functionality of the integrated circuit formed. Therefore, the quality of the transistors which are fabricated using the method described is often poor.
U.S. Pat. No. 5,291,052 discloses a CMOS semiconductor device with a p-MOS transistor and with an n-MOS transistor on a wafer.
U.S. Pat. No. 6,160,317 discloses a method for fabricating a semiconductor device which allows etching of a field oxide while minimizing damage to the silicon.
German Patent No. DE 196 54 738 A1 discloses a method for fabricating a semiconductor memory device with n-MOS and p-MOS transistors with different properties.
Great Britain Patent No. GB 2,359,662 discloses a semiconductor device with a DRAM cell.
Accordingly, there is an need to overcome the problem of providing laterally delimited layer sequences with different side wall thicknesses on a common substrate with a reduced level of outlay and in an improved quality.

Method for fabricating a layer arrangement, layer arrangement and memory arrangement


A photo-patternable dielectric material is provided to a structure which includes a substrate having at least one gate structure. The photo-patternable dielectric material is then patterned forming a plurality of sacrificial contact structures adjacent the at least one gate structure. A planarized middle-of-the-line dielectric material is then provided in which an uppermost surface of each of the sacrificial contact structures is exposed. Each of the exposed sacrificial contact structures is then removed providing contact openings within the planarized middle-of-the-line dielectric material. A conductive metal-containing material is formed within each contact opening.

The present disclosure relates to a semiconductor structure and a method of fabricating the same. More particularly, the present disclosure relates to a semiconductor structure containing self-aligned borderless contacts and methods of forming the same.
The formation of electrical contacts to electronic and memory devices is a considerable challenge as the integration density of these devices is increased as a consequence of technology scaling. For example, the projected contact pitch for the 32 nm, 22 nm, and 15 nm nodes are 130 nm, 100 nm, and 80 nm, respectively. In order to fit the contact between adjacent gates, contacts must be made at dimensions approaching the gate length of the device unlike previous technologies where the contacts were many times larger than the gate. Definition of this contact is a lithographic challenge. Alignment of the contact to the source, drain, and gate of the device is critical. In particular, misalignment of the source and drain contacts with respect to the gate can cause electrical shorts, rendering the device inoperable.
Therefore a need exists to overcome the problems with the prior art as discussed above.

Self-aligned borderless contacts using a photo-patternable dielectric material as a replacement contact


A self-regulating valve assembly for a compressed gas gun includes a valve housing and a valve body disposed within the valve housing. The rearward end of the valve body defined an outlet port. The forward end of the valve body defines a gas balance reservoir open to and in communication with the breech of the gun. A valve gas passage is provided between the valve body and the valve housing, the valve gas passage providing communication between the outlet port of the valve body and the gas balance reservoir of the valve body. A slidable valve poppet is disposed within the valve body and includes a sensing end adjacent to and at least partially within the gas balance reservoir, the sensing end having a sensing face adapted to react to gas pressure within the gas balance reservoir. The valve poppet is slidable between a closed position and an open position. A valve spring within the valve body biases the valve poppet toward the closed position. Pressure in the gas balance reservoir exerts a force on the sensing face to urge the valve poppet toward the closed position.

Compressed gas guns, such as paintball markers used in the sport of paintball, using compressed gas or air for firing projectiles are well known. As used herein, the term "compressed gas gun" refers to any gun or similar launching mechanism for use in sport wherein a projectile is fired via the force of compressed gas, and includes paintball markers. As used herein, the term "projectiles" refers to both paintballs and other projectiles used in sport and game-play.
There are a few basic mechanisms employed in compressed gas guns for firing a projectile during a firing operation. A compressed gas gun generally includes an interior portion including passages for receiving the operating parts of the gun. These passages are often provided as generally cylindrical openings. Loading a projectile into the breech of a compressed gas gun involves a bolt having a bolt passage therethrough that reciprocates from a loading position, allowing a projectile into the breech to a firing position.
A valve system is employed to release compressed gas from a source of compressed gas to fire the projectile from the gun. The valve system generally utilizes a hammer or ram that moves under spring force or pneumatic force upon actuation of a trigger to strike the stem of a poppet or Nelson-style valve to allow compressed gas from a compressed gas chamber to flow through the valve body. The compressed gas flows through the opened valve body and through a passage in the bolt, thereby firing a projectile in the breech of the paintball marker from the chamber and down the barrel. While other types of valve systems are employed, generally, most involve directing compressed gas under pressure to fire a projectile from the compressed gas gun.
In many cases, compressed gas guns utilize a hammer, striker, or ram arrangement to actuate a poppet-type or valve as the firing valve, i.e., as the valve that releases compressed gas from a compressed gas source to fire a projectile from the gun. A prior art valve 10 is shown in a closed position in FIGS. 1A and 1B. This type of prior art valve, or a Nelson-style valve, or generally similar variations, have been used in paintball markers (guns) sold under, for example, the brand names INDIAN CREEK DESIGNS, TIPPMANN and BT. Similar valve arrangement, in various orientations, are shown in U.S. Pat. No. 4,936,282 and U.S. Pat. No. 5,257,614. A valve spring 14 is provided, biasing the seat 16 or cup seal of the valve 10 to a closed position. A stem or pin 24 that is attached to the seat 16 or cup seal extends out the rear end of the valve 10. In known compressed gas guns, a spring biased hammer 12 is provided, retained in a cocked or ready position by a sear 18 that pivots to engage a portion of the hammer 12. A schematic representation of such a compressed gas gun operation is shown in FIG. 1A and the valve is shown in greater detail in FIG. 1B. Actuation of a trigger 20 (such as by pulling) disengages the sear 18 from the hammer 12, allowing the hammer 12 to spring forward under the bias force of a hammer spring 22, to contact the stem 24 of the valve 10. When the hammer 12 contacts the stem 24, the seat 16 moves away from the valve body, opening the valve 10, and allowing compressed gas to flow through the opening in the valve body. These types of compressed gas guns move the hammer back to the loading or start position by "blow back," i.e., some of the air from a high pressure chamber returns the hammer to the cocked or loading position, thus "blowing" the hammer back to the starting position.
As can be appreciated, if pressure inside the valve body increases, there is more force pushing against the valve seat or cup seal. The compressed gas within the valve body exerts a force on the effective surface area of the seat or cup seal 16, which exerts a force toward the valve pin or stem 24, thereby tending to keep the valve closed. Thus, a greater force is needed to move the seat or cup seal away from the valve opening to actuate the valve. This mechanism has drawbacks. For example, it requires a heavy hammer propelled forward by a heavy hammer spring. A heavier hammer and hammer spring is needed to overcome the combined force of the compressed gas on the effective surface area of the valve seat or cup seal, combined with the biasing force of the valve spring. In turn, more energy is absorbed from the moving hammer when it hits the valve pin, and more force is required to open the valve. This reduces the amount of time the valve poppet is open.
As can be further appreciated, the force of the valve spring must be strong to return the seat of the poppet valve to a closed position. Moreover, the force of the hammer spring moving the hammer must be strong enough overcome the valve spring. This arrangement creates inefficiencies and wastes compressed gas.
Accordingly, there remains a need for a valve utilizing a lighter hammer and a lighter main spring in order to reduce the reciprocating mass inside the paintball marker, reduce the weight of the trigger pull, and reduce the force with which the marker chambers a paintball, all while maintaining a stable velocity over a wide range of input pressures.


A variable geometry mechanism include an annular nozzle ring, a drive ring rotatable about a central axis of the nozzle ring, wherein the drive ring includes, a plurality of attachment portions formed on a surface of the drive ring and a self-stopper projecting from the surface of the drive ring on which the attachment portions are formed, wherein the self-stopper is located radially inward from the attachment portions so as to be closer to the central axis of the nozzle ring, a plurality of nozzle vanes rotatably coupled to the nozzle ring and a plurality of nozzle link plates extending from the nozzle ring to the drive ring, wherein the self-stopper is configured to regulate a moving range of at least one of the nozzle link plates during the rotation of the drive ring.

A variable geometry mechanism is known which includes a plate, a drive ring that is disposed rotatable relative to the plate, and nozzle link plates that are attached to the plate and the drive ring. For example, in such a mechanism described in Japanese Unexamined Patent Publication No. 2006-177318, an end of each nozzle link plate is fit into a recess formed in an inner circumferential surface of the drive ring. When the drive ring rotates relative to the plate, each nozzle link plate rotates about a pin. When this rotation is transmitted to the pin, a nozzle vane connected to the pin rotates together with the nozzle link plate and the pin.

Variable geometry mechanism and turbocharger


A laser light detect/emit package 3 and a biaxial drive portion 5 for driving the objective lens 4 are supported on a wiring board 1 having wiring patterns 2a and 2b to electrically connect them to the wiring patterns 2a and 2b. Packaged in the laser light detect/emit package 3 are a laser coupler 11 having an optical prism 15 and a laser chip 16 formed on a photo diode IC 14 including photo diodes 12 and 13 for detecting optical signals. In lieu of the laser light detect/emit package 3, an auxiliary wiring board supporting the laser coupler 11 may be inserted and held in a recess formed in the wiring board 1.

The present invention relates to an optical pickup device suitable for use in, for example, a portable or on-board optical disc device.
FIGS. 15 and 16 show two conventional optical pickup devices.
The conventional optical pickup device shown in FIG. 15 includes a base portion 101 made of die-cast zinc or aluminum on which biaxial drive portion 103 for moving an objective lens 102 in X, Y and Z directions, a laser light emitting portion 104 for emitting laser light, and an optical signal detecting portion 105 in form of a photo diode, for example, are fixed. In addition to these, the base portion 101 supports connection substrate materials 106 and 107 in form of a flexible substrate, glass epoxy substrate, or the like, that are fixed to the base portion 106 by an adhesive or a screws. These connection substrate materials 106 and 107 connect the biaxial drive portion 103, laser light emitting portion 104 and optical signal detecting portion 105 to an external servo circuit or RF signal processor not shown. Numeral 108 denotes a cover protecting the biaxial drive portion 103, and numeral 109 denotes a feeding guide.
Another conventional pickup device shown in FIG. 16 includes a base portion 201 of die cast zinc or aluminum similar to the base portion 101 mentioned above, on which are secured by a biaxial drive portion (not shown), protected by a cover 202, for moving an objective lens 203 in X, Y and Z directions, and a laser light detect/emit portion 204 packaging a laser light emitting portion for emitting laser light and an optical signal detecting portion. The biaxial drive portion and the laser light emitting portion 204 are connected to an external servo circuit, an RF signal processor, and so forth, by connection substrate materials 205 and 206 fixed to the base portion 201, which are similar to the connection substrate materials 106 and 107 mentioned above.
However, with respect to the conventional optical pick up devices shown in FIGS. 15 and 16 there are difficulties in decreasing their dimensions and thicknesses and in simplifying their manufacturing process because of their structures which use packaged parts put on the base portions and which must fix to the base portions the connection substrate materials for connecting the packaged parts to external servo circuits, RF signal processors, or the like.

Optical pickup device with biaxial drive for objective lens


An application view control can allow users of a software tool to interact with Enterprise applications using simple Java APIs. This can allow a user who is not an expert in the use of a given Enterprise system to utilize its capabilities in a manner a Java programmer can understand. A developer can invoke application view services both synchronously and asynchronously, and can subscribe to application view events. The developer can use simple Java objects in both the service and event cases. The developer need not understand XML, or the particular protocol or client API for the Enterprise application, such as an Enterprise Information System (EIS).

E-commerce has become a major driving factor in the new economy. To be successful in the long-term, e-commerce will require many companies to engage in cross-enterprise collaborations. To achieve cross-enterprise integration, a company must first integrate its internal applications. Using existing technology and tools, application integration can be an expensive proposition. No integration solution exists that is easy to use, affordable, and based on industry standards. Neither does a solution exist that is based on an industry standard infrastructure, has universal connectivity, is capable of massive scalability, and has accessible business process tools.
Application integration to this point has been very inward-focused. Many existing integration systems have not focused on integrating applications between enterprises. Even when integration solutions were used for cross-enterprise integration, the solutions were still narrowly focused and aimed at vertical markets. This inward focus did little to help companies' external business-to-consumer and business-to-business applications, such as applications that can utilize the Internet to generate revenue and reduce costs. The requirement for Internet-enabled applications led to the rise of the application server market. To date, application servers have primarily been used to host external applications targeted at customers and partners. Application servers are themselves packaged applications that, instead of solving a specific problem, are general-purpose platforms that host vertical solutions.
The first attempts at application integration were primarily focused on low-level implementation details such as the format of the data, the byte ordering between machines, and character encoding. The focus on low-level data formats was necessary because, for the first generation of application integration solutions, there were no widely adopted standards for data encoding that could be deployed across multiple vertical applications.
The traditional approach involved connecting individual systems to, in effect, hardwire the systems together. This approach can be complex, as connecting different systems can require an intimate, low-level knowledge of the proprietary technologies of multiple systems. To remove this complexity, businesses began developing and using adapters.
Adapters are software components that applications can use to programmatically access enterprise data. For example, an adapter can use a Java class to represent enterprise data, and can provide methods that applications can invoke to access the data. When an application invokes an access method, the adapter can execute the method to retrieve the enterprise data.
These integration systems, however, suffer from a lack of standards. Each integration vendor typically provides a proprietary solution for application adapters, message transformation, message formats, message transport, and routing. Not one of these systems to date has achieved significant market share to enable its technologies to become the de-facto standard. This lack of standards has given packaged application vendors little incentive to create adapters to their applications. Further, each of these integration servers has its own proprietary API for constructing adapters, so packaged application vendors cannot leverage the development of an adapter beyond a single integration server. This fragmentation of the integration market has provided little financial incentive for third parties to build adapters.
Application views were developed as a solution to this problem. An application view provides a layer of abstraction between an adapter and Enterprise Information System (EIS) functions exposed by that adapter. Instead of accessing an EIS by directly programming the EIS, a user can simply edit the application views for the adapter, create new application views, or delete obsolete application views. This layer of abstraction, formed by application views, makes it easy for non-programmers to maintain the services and events exposed by the adapter. Each application view is adapter-specific, and defines a set of business functions on the adapter's EIS. Such application views provide a view of the application capabilities exposed by an adapter. Presently, there is no analogous functionality for users of tools such Cajun, a Java 2 Enterprise Edition (J2EE)-based Web services development framework available from BEA Systems Inc. of San Jose, Calif., that can allow tool developers to easily interact with information systems.

This patent is subject to a terminal disclaimer.

System and method for enterprise application interactions


A method for repairing damaged valve stem assemblies includes enlarging a bore within a body of a valve stem to form an enlarged bore portion and creating a conical hole in an end of the valve stem body around the enlarged bore portion. Internal threads are created within the enlarged bore portion, and a valve stem repair extension is installed in the enlarged bore portion. The valve stem repair extension has a beveled surface that mates with the conical hole to form a hermetic seal between the valve stem body and the valve stem repair extension. The steps of enlarging the bore and creating the conical hole may both be performed using a countersinking drill bit having a beveled cutting portion.

Modern pneumatic tires are constructed of a rubber-containing body and tread, and can include an inner tube or can be tubeless. Tires including an inner tube can be found on bicycles, motorcycles, and many large vehicles. Tubeless tires are used in many applications, including nearly all cars and light trucks. For both types of pneumatic tires, a volume of gas is contained within, and provides support to, the other portions of the tire. Pneumatic tires almost universally include a device that allows the tire to be inflated or deflated, thereby providing control over the volume of gas. Typically, this device is a valve stem that contains a valve and provides a point of access that is in fluid communication with the volume of gas and allow gas to be added to or removed from the tire.
Valve caps are used with valve stems and protect the valve components from dirt, water, and other contaminants. Valve caps constructed of plain black plastic are common, but other materials have been used, including metal. However, using a metal valve cap on an aluminum valve stem has proven problematic. The aluminum valve stem reacts with the metal of the valve cap, especially in the presence of humidity, leading to corrosion. It has been observed that when the valve stem and the valve cover are dissimilar metals, the corrosion process may be accelerated. Valve stem damage caused by corrosion can be severe, in some cases leading to the valve stem breaking, especially near the area of the valve stem contacting the valve cap. If a valve stem breaks, it is possible that its air containing functions could be compromised, leading to the rapid deflation of a tire.
Tire pressure monitoring systems (TPMS) have been developed for monitoring the air pressure inside pneumatic tires and can provide real-time pressure information to a driver of a vehicle having such a system. For many designs of TPMS used with tubeless tires, a pressure sensor is connected to, or is integral with, a section of the valve stem within the tire. The combination of a valve stem and a TPMS sensor may be referred to as a TPMS valve stem assembly. The sensor measures the pressure in the tire and communicates the pressure measurement to a receiver, which in turn relays pressure information to an instrument perceivable by a driver. TPMS valve stem assemblies are more susceptible to damage by corrosion than other valve stems that are not associated with a TPMS sensor because they are made of aluminum, rather than brass.
Damaged TPMS valve stem assemblies can require especially costly repairs. For TPMS valve stem assemblies that have become damaged (such as by corrosion), the tire must be disassembled and the entire TPMS valve stem assembly replaced. This is expensive, time-consuming, and inconvenient. Specifically, the tire and wheel assembly must be removed from the vehicle and the tire demounted from the wheel. Then, a new TPMS valve stem assembly is installed and the tire is remounted on the wheel and re-inflated. The tire and wheel assembly is then re-balanced and re-installed on the vehicle. Finally, the new TPMS sensor is programmed to work with the vehicle's system. And because the TPMS sensor is connected to or integral with the valve stem, the entire TPMS valve stem assembly must be replaced, even though the sensor component may be perfectly functional. Alternatively, a replacement valve stem may be installed on a TPMS rather than replacing the entire unit. However, installing a replacement valve stem still requires that the tire be removed from the wheel and the TPMS unit be removed from the wheel. Once a new stem has been installed, the TPMS and tire must be reassembled.
Thus, a need exists for improvements in addressing damaged TPMS valve stems and the costs associated with their replacement.