A sulfur-containing compound has a structure represented by formula (1):

Plastic lenses have recently rapidly been widespread as optical materials for eyeglasses, camera lenses, and the like because the plastic lenses are lightweight and less broken and can be dyed, as compared with inorganic lenses.
The performances required for the plastic lenses include optical performances such as a high refractive index and a high Abbe's number, and physical and chemical properties such as high impact resistance, ease of dyeing, no problem about heat resistance, and a low specific gravity. The performances further include the property that the lens producing method and monomer compound used have safety of the human body and ease of handling.
Of these performances, high heat resistance and a low specific gravity are realized at a high level even by using an existing high-refractive-index plastic lens. An example of resins which are currently used for a variety of plastic lenses is a resin produced by radical polymerization of diethylene glycol bis(allyl carbonate) (referred to as "D. A. C" hereinafter). This resin has various properties such as excellent impact resistance, a light weight, excellent dyeing performance, good processability such as cutting ability, polishing ability, and the like, etc. However, this resin has a refractive index nd of as low as about 1.50, and thus the central thickness and edge thickness of a plastic lens are increased. Therefore, a resin having a higher refractive index is demanded for the plastic lenses.
Known examples of a resin having a higher refractive index than that of the D. A. C resin include sulfur atom-containing resins such as a polythiourethane resin, a sulfur-containing o-(meth)acrylate resin, and thio(meth)acrylate resin. The polythiourethane resin is a well-balanced resin having a high refractive index, excellent impact resistance, excellent dyeing performance, and the like. For other resins having a high refractive index and high Abbe's number, a method using a polyepisulfide compound is proposed (refer to, for example, Publication No. WO89/10575, Japanese Unexamined Patent Application Publication Nos. 9-110979 and 11-322930).
Also, a method of adding a known sulfur-containing compound to a polyepidithio compound or polyepisulfide compound is proposed for achieving a higher refractive index. However, the producing method and identification data for the compound are not described in examples, and a method of adding a known sulfur-containing compound to the polyepisulfide compound decreases the crosslinking property of a resin to decrease heat resistance. Therefore, this method has low practicability (refer to, for example, Japanese Unexamined Patent Application Publication Nos. 2000-281787, 2001-002783, and 2002-040201).
In the above-described method of adding a known sulfur-containing compound to the polyepisulfide compound, an example of compounds to be added is a monofunctional thietane compound. A typical known example of the thietane compound is methacryloyloxyalkylthietane which is used as a photopolymerizable compound for a photosensitive composition. This composition has a low refractive index and no transparency, and thus cannot be used for some optical applications required to have such a high refractive index as in the present invention (refer to, for example, Japanese Unexamined Patent Application Publication Nos. 55-066909 and 59-180544).
In the above-described conditions, the proposed method using the polyepisulfide compound having a high refractive index and high Abbe's number in a well-balanced state has been advanced to practical use. However, the method causes a handling problem due to the low thermal stability of the polyepisulfide compound in some cases. In order to solve the problem, a method for improving the thermal stability of the polyepisulfide compound is required, and various methods have been proposed. However, any one of the proposed methods is not satisfactory (refer to, for example, Japanese Unexamined Patent Application Publication No. 11-256038).
Furthermore, a resin produced by curing the polyepisulfide compound is brittle, and thus cannot be subjected to special processing such as two-point processing or the like, particularly, in the application to eyeglasses. Also, in some cases, there is the problem of cracking a lens in releasing after casting polymerization. Furthermore, in some of the applications to eyeglasses required to have safety, necessary physical properties are not sufficiently satisfied because of the low impact resistance of the resin. Therefore, various methods have been proposed for improving the resin, but any one of the methods is unsatisfactory (refer to, for example, Japanese Unexamined Patent Application Publication Nos. 2001-131257).
In a condition in which a plastic lens is required to have a higher refractive index and higher Abbe's number, it is greatly demanded to propose a novel compound which can be replaced with the polyepisulfide compound, which has a high refractive index and high Abbe's number, and which permits improvements in brittleness and impact resistance.
Therefore, the inventors conducted studies for improving the refractive index of a compound different from the polyepisulfide compound without decreasing the Abbe's number to provide a material complying with the requirements of a higher refractive index and higher Abbe's number.

Polymerizable composition containing novel cyclic sulfur compound and resin obtained by curing the polymerizable composition

Abstract: (wherein R1 represents a hydrogen atom, a reactive terminal group, a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms and a reactive terminal group or its thia derivative thereof, an aryl group, or an aralkyl group; Y represents an oxygen atom, a sulfur atom, a selenium atom, or a tellurium atom; R represents a substituted or unsubstituted bivalent hydrocarbon group having 1 to 10 carbon atoms, which may be thianated; n represents an integer of 0 to 3; X1 is substituted for any one of groups R2 to R7 of a partial structure represented by formula (2) in which the groups R2 to R7 other than the group substituted by X1 are independently a hydrogen atom or a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms; and R1 is not a group having a (meth)acryl group when Y is an oxygen atom.)

Abstract: The compound has a high refractive index and high Abbe's number, and produces a resin having excellent impact resistance.


In a disc axis adjusting mechanism in a gas turbine, the gas turbine has an exhaust gas diffuser provided between a casing wall and a bearing case which are connected to a downstream side of a turbine, a plurality of struts provided at intervals in a circumferential direction, and strut covers coupling an outer diffuser and an inner diffuser of the exhaust gas diffuser so as to cover the struts, and the mechanism comprises: a plurality of air introduction holes formed in the casing wall so as to allow the interior and exterior of the wall to communicate with each other; a sensor unit configured to detect a parameter corresponding to the thermal elongation of each of the struts; and a flow rate adjustor configured to adjust the flow rate of air flowing through each of the air introduction holes based on a detection value detected by the sensor unit.

In the related art, in a turbine section of a gas turbine, an exhaust gas diffuser of a duplex tube structure connected to a combustion gas outlet of the turbine is used in order to recover the static pressure of a combustion gas from the turbine. However, in general, a gas turbine exhaust section including the exhaust gas diffuser is also an object to be cooled.
Usually, the gas turbine exhaust section is generally configured to include an exhaust gas diffuser having an outer diffuser and an Inner diffuser; an exhaust cavity having a casing wall and a bearing case provided so as to cover this exhaust gas diffuser; struts that couple the casing wall and the bearing case through the exhaust gas diffuser; and strut covers that couple the outer diffuser and the inner diffuser so as to cover the struts.
In such a gas turbine, for example, a cooling structure adapted to promote substitution of air within each strut or an exhaust tunnel, using a cooling system, and to enhance the cooling effect of the gas turbine exhaust section is disclosed in PTL 1.
PTL 1 describes a structure including the cooling system in which an air intake port that allows an exhaust tunnel communicating with an exhaust cavity through an exhaust gas diffuser on a downstream side of the exhaust cavity to communicate with a casing exterior is provided inside the exhaust gas diffuser, and air introduced from this air intake port is emitted from a space between the strut and the strut cover to the outside of the exhaust cavity through a pipe as suction exhaust means.

Disc axis adjusting mechanism in gas turbine


A transport stream TSd generated from a digital broadcast signal and a transport stream TSa generated from an analog broadcast signal are recorded simultaneously and a portion of TSd wherein the reception state of the digital broadcast is bad is replaced with TSa corresponding to the defective portion for compensation. A composite TS consisting of good TSd and TSa corresponding to defective TSd 102 is formed and recorded.

1. Field of the Invention
The present invention relates to a digital broadcast/analog broadcast receiving and recording apparatus for receiving a digital broadcast signal and an analog broadcast signal, outputting a video signal and an audio signal of a selected channel, and recording digital data generated based on the digital broadcast signal and the analog broadcast signal.
2. Description of the Related Art
A digital broadcast/analog broadcast receiving and recording apparatus includes a circuit for receiving a digital broadcast signal and a circuit for receiving an analog broadcast signal and converts the received broadcast signal into digital data in a specific format such as an MPEG format, and records the digital data on a record medium such as a hard disk.
Upon reception of digital broadcast waves and analog broadcast waves, a tuner extracts and amplifies the digital broadcast signal or the analog broadcast signal of the selected channel. When the selected channel is of the digital broadcast signal, the digital broadcast signal is transmitted to a digital signal demodulation section, which then converts the digital broadcast signal into a transport stream (TSd) of digital data. When the selected channel is of the analog broadcast signal, an analog signal demodulation section demodulates the analog broadcast signal into a video signal and an audio signal and transmits the signals to an encoder, which then converts the signals into a transport stream (TSa) of digital data. Each of the transport streams (TSd and Tsa) is input through a system controller to a decoder, converted by the decoder into a video signal and an audio signal, and output from the decoder. The output video signal and audio signal are input to an analog television receiver for a viewer to view any desired program. When the viewer uses a remote controller to perform record operation, a CPU gives a record instruction to the system controller. The system controller stores received transport streams (TSd and Tsa) on a record medium separately.
As the C/N ratio of a digital broadcast signal falls below a predetermined threshold value, neither video nor audio is provided. Thus, when the reception state of a digital broadcast signal worsens, namely, the C/N ratio of the digital broadcast signal falls below the predetermined threshold value as an airplane passes through the face of an antenna, for example, while a digital broadcast receiving and recording apparatus (digital broadcast/analog broadcast receiving and recording apparatus) is receiving the digital broadcast signal, it is made impossible to view or record the video and audio during the worsened reception state. As the video and audio are thus interrupted, it is made impossible for the viewer to understand or follow the story of the program.
When recording a program, if digital broadcast signals are recorded from the beginning of the program, the portions of providing clear video before and after the broadcast is interrupted and the portion of no video are recorded. Thus, the viewer can later see only the program with the video interrupted and a problem as described above occurs. A Japanese unexamined patent publication JP-A-2001-285734 discloses a technique wherein when the digital broadcast is interrupted, a transition is made to the analog broadcast of the same program as interrupted to continue recording the program. However, when the digital broadcast is recovered from the interruption, recording the program in the analog broadcast is continued and thus when the viewer programs the apparatus to record a digital broadcast program by preference, the program in the analog broadcast is recorded and satisfactory video and audio cannot be provided for the viewer. As disclosed in a Japanese unexamined patent publication, JP-A-2001-320639, a technique is available wherein when the reception state of a digital broadcast worsens, the same program broadcast in a different time period is found and if the program exists, the same program in the different time is recorded. However, there is a sufficient probability that the program is not yet broadcasted at the point in time at which the viewer wants to play back the program; the program cannot reliably be recorded. If the program broadcast in the different time period is an analog broadcast, satisfactory video and audio cannot be provided against a viewer's will.
Since the viewer is to record the digital broadcast program because the digital broadcast provides better video and audio quality than the analog broadcast, it is desirable that the programs to be recorded should be those in digital broadcasts as much as possible.

Digital broadcast/analog broadcast receiving and recording apparatus


A flexible strap guide for an overhead strapper having a feed head for feeding the strapping material from a supply to a strapping head being mounted to a movable platen. The guide includes an elongated flexible spine formed from a plurality of hinged elements. Each of the elements is hingedly connected to and independently movable relative to each adjacent element. The elements define a central channel therein defined by a contiguous inner periphery. A hollow tubular element is positioned within the flexible spine and is flexible with the spine. The tubular element defines a pathway for movement of the strapping material therethrough between feed head and the strapping head. The guide is flexible at points between the feed head and the strapping head and is configured to permit movement of the strapping head upward and downward and to retain the hollow tubular element in an unobstructed condition as the strapping head moves upward and downward. A strapping machine having the flexible strap guide is also disclosed.

The present invention is directed to an overhead strapper. More particularly, the present invention is directed to an improved flexible strap feed guide for an overhead strapper.
Strappers are in widespread use to, for example, position and tension strap material around a load. Strapping loads may be done for a number of reasons. Often, loads are strapped in order to facilitate handling and transport.
Many loads that require strapping are large, oversized loads. Loads may also be compressible. For example, the load may be a large stack of cardboard items or a bale of textile material.
In order to accommodate large or oversized loads, overhead strapping machines are used. One exemplary strapper is disclosed and described in pending U.S. patent application Ser. No. 10/999,084 to Ropers et al., in which the size of the strap chute can be varied by raising and lowering a horizontal platen that carries the upper portion of the strap chute. The platen is brought into close contact with the upper surface of a load prior to strapping to reduce the opportunity for strapper malfunction by maintaining the size (height) of the strap chute only to that required to accommodate the load.
Such a strapper includes a frame, an upper horizontally oriented platen mounted to the frame for vertical movement along the frame and a modular strapping head mounted to the platen and movable therewith. A modular feed head is fixedly mounted to the frame, spaced from the strapping head and stationary relative to the platen. A strap guide is mounted in part to the frame and in part to the platen. The strap guide provides a varying length pathway from the feed head to the strapping head.
In this strapper, the strap guide is formed from a plurality of pairs of discrete wall portions (tile-like elements) that move or pivot between a closed configuration to retain the strap within the pathway and an open configuration in which the strap is released from the pathway. The pairs of discrete wall portions are biased inwardly to the closed position. A turning assembly is mounted for movement with the platen and cooperates with the strap guide to redirect the strap as the strap exits from the pathway to the strapping head and an extension portion extends from the turning assembly to the strapping head. The vertical portion of the guide has a varying height strap path dependent upon the vertical position of the upper horizontally oriented platen. The varying height is provided by the discrete wall portions that close to form the strap guide or chute and open to release the strap.
While this arrangement functions well, in certain instances, the height of the vertical guide portion may be to high. That is, there may be instances in which although the elevated strapper height is needed, it may be desirable to lower or reduce the height of the vertical guide portion.
Accordingly, there is a need for an overhead strapping machine that uses a relocated feed head (off of the overhead platen), that incorporates a reduced height required vertical guide portion. Desirably, such a machine includes a simplified flexible guide arrangement that permits varying the height at which the platen can reside during machine operations.

Flexible strap feed guide for overhead strapper


An arrangement for providing improved efficiency in laser bonding is disclosed. In particular, at least one piece part in the arrangement is formed to include means for concentrating a beam of radiation at a predetermined attachment location (or several locations). The concentrating means may be in the form of an aperture, such as a conical or parabolic opening, which will concentrate the radiation to the area of interest. Alternatively, if the piece part is transparent to the wavelength of the radiation, the concentrating means may be in the form of a lens or grating formed on the surface of the piece part.

1. Technical Field
The present invention relates to laser bonding and, more particularly, to a scheme for improving the efficiency of a laser bonding process.
2. Description of the Prior Art
Laser bonding has been successfully utilized in a number of applications to provide joining of piece parts. See, for example, U.S. Pat. No. 4,990,741 entitled "Method of Laser Welding" and issued to R. J. Moores et al. on Feb. 5, 1991. As disclosed, first and second metallic components may be joined along a weld path, with the beam focused by a low turbulent flow of an inert shielding gas along a portion of the path. In most applications, the material used to form the piece part (plastic or metal, for example) is opaque to the optical radiation and the radiation must therefore impinge the material from the side of the point of contact. This limitation is considered to further complicate and increase the cost of laser welding systems.
Thus, a need remains in the art for increasing the utility of laser sources in various bonding applications.


Methods for rapidly confirming production of infectious viral vectors, for use in clinical grade personalized neo-antigen vaccines for subjects in need thereof, are provided.

Vaccines help the body fight disease by training the immune system to recognize and destroy harmful substances and diseased cells. Viral vector-based vaccines are currently being developed to help fight infectious diseases and cancers; however, significant limitations exist in the manufacture and scalability of efficiently and rapidly producing pure batches of virus vectors. In particular, significant challenges remain in cumbersome assay methods currently used to confirm successful production of infective viral particles. Existing assay methods, including hexon-based detection assays, can be time consuming, inefficient, and expensive in terms of reagent and labor costs. As such, there exists a need for improvements in the manufacture of clinical grade vaccines based on viral vectors, particularly at the stage of verifying productive generation of the viral vectors by cells.
The present invention addresses these limitations by introducing an ion-exchange based membrane method of purifying viral vectors from crude cell lysates. In particular, the present invention provides membrane methods purifying viral vector-based vaccines encoding for a neo-antigen or neo-epitope, which can be administered to a patient.

Rapid verification of virus particle production for a personalized vaccine


An optical module for a lighting and/or signaling device of a vehicle, comprising at least one light source capable of generating a light beam, a cooling device capable of dissipating heat and a device for focusing the light beam, characterized in that the focusing device is borne directly by the cooling device.

1. Field of the Invention
The technical field of the present invention is that of optical modules intended to produce a light beam in order to light a road taken by a vehicle bearing this optical module. Such an optical module is particularly applicable when it is installed inside a lighting and/or signaling device for a motor vehicle.
2. Description of the Related Art
It is known practice to produce a light function on a motor vehicle by focusing light rays emitted by a light source. The optical parts used to focus these light rays are, generally, installed between the light source, for example a xenon lamp, and an outer lens enclosing a headlight which receives this assembly.
Such an optical part is an isotropic and transparent element, with at least one face which is not planar, so as to make the light converge or diverge.
In the motor vehicle lighting sector, it is also known practice to use a light source of light-emitting diode type. This type of source is accompanied by a device for switching the source on or off, and these two elements give off heat that a cooling device is responsible for dissipating into the surrounding environment.
An optical part of the prior art is mounted with an assembly consisting of a light-emitting diode and its cooling device by interposing a part which maintains a certain distance between the optical part and the assembly. This is generally a plastic support which is fastened on one side to the periphery of the optical part and on the other side to the assembly consisting of the light-emitting diode and its cooling device.
The presence of this support comprises numerous drawbacks. Firstly, this support forms a part which has to be designed, manufactured and installed. This part thus represents a cost which puts a strain on the overall cost of the lighting function.
Another drawback lies in the fact that this support is a distinct and intermediate part between the assembly targeted above and the optical part. Since the latter has to be installed according to a precise orientation relative to the assembly, it is then necessary to manage, on the one hand, very accurately, the chain of banks linking these components, and, on the other hand, to guarantee a minimal manufacturing tolerance of this intermediate support.

Optical module with common part reference for motor vehicle lighting and/or signalling


An email filter updating system includes a tracking component, and a logic component. The tracking component is provided to track user navigation. This tracking compiles information about websites the user has visited and presumably may “trust” in the event an email associated with one such site or application is later received by the user's email application. The logic component uses information and a set of configurable rule-based criteria to output a characterization that a particular email message has been initiated from a site that the user has visited or should otherwise trust. The characterization is then provided to the email filter to control whether in-bound email is passed to the user's email client inbox. Further, the logic component is operative to generate filter update commands that update the email filter in an automated manner, i.e., without user input.

Technical Field
This disclosure relates generally to email processing and, in particular, to techniques to update an unwanted email message (or "spam") filter, e.g., based on tracking various forms of information collecting during user navigation.
Background of the Related Art
The use of email messages is commonplace for home and business. Email messages are used by individuals to keep in touch with and communicate with other users. Additionally, email messages provide a medium to collaborate and exchange documents. Unsolicited email messages are often received by users in their inboxes. These types of messages are also referred to as junk email, or unsolicited bulk email (or, more commonly, "spam"). The amount of undesired email messages sent to users has grown over time. With the amount of undesired email messages present, users often have to wade through numerous email messages to find the ones that they wish to read. While not a security risk per se, spam is one of the most common nuisances on the Internet. Spam is a broad term for e-mail messages of a commercial nature which are sent to a large number of users who had not requested the messages. Spam is disadvantageous because it consumes a significant quantity of computing resources. Spam must also frequently be manually deleted, which costs people a significant amount of time.
Many users of email use blacklists and whitelists included within their email software to control undesired spam, or junk, email from undesired email sources. A blacklist is a list of email addresses or domain names from which email is blocked. A whitelist is a list of email addresses or domain names from which email is allowed.
Typically, an email user's email software may provide a feature whereby if an email is received from an email address/domain name, a button or a link can be manually selected by a user to have the email address of the received email added to either a blacklist or a whitelist, that is to block or to allow email from that address in the future. In other cases, programs exist to mass-manage a large number of email and domain addresses and automatically blacklist or whitelist them. In either case, a user must still examine the email address and domain name of the received email to determine whether the email address/domain name should be whitelisted or blacklisted. There are also email programs that include a predefined, but regularly updated, list of email addresses/domain names that are known to be sources of spam email. When using such an email program, when a received email includes an address/domain name that matches an entry on the spam list, the received email is automatically blacklisted for the user by the email program.
However, there are times when a user is performing an online activity, such as making an online purchase on a website or registering for a blog, a newsletter or an online forum, such that the user desires and expects to receive emails from that site/domain. Unless the user adds the email address/domain name of that website manually to the whitelist of their email program or browser, emails from that source may end up being automatically tagged as spam, automatically added to their email blacklist, and unnecessarily blocked from being received in the future. Also, the user may not anticipate that an email address may be from a domain different from that of the actual website which was visited by the user, while still desiring to receive email from that other domain. This problem often occurs in the situation when a user registers to a site but then receives a confirmation email from some other domain that the user does not recognize; in response, the user may decide to register again and again until he or she gives up.
There remains a need to provide enhanced techniques for managing email that addresses these and related problems.

Automated spam filter updating by tracking user navigation

International Business Machines Corporation


A speaker cabinet according to an embodiment of the present invention includes: a pair of side plates whose outer peripheral portions define no apexes; and a bent plate curved in conformity with the outer peripheral portions of the pair of side plates and mounted to the pair of side plates.

1. Field of the Invention
The present invention relates to a speaker cabinet and a speaker using the same. To be more specific, the present invention relates to a speaker cabinet and a speaker using the same capable of producing a sound image space more natural and full of reality.
2. Description of the Related Art
The design principles for speaker cabinets have been polarized into two ways of thinking: the concept that the radiation sound from the cabinet is unnecessary and should be suppressed so as to reverberate as little as possible; and the concept that the radiation sound from the cabinet should be positively allowed to reverberate to attain a rich, full-bodied sound. As means for realizing the latter concept, the thickness of the plate materials forming the cabinet is reduced, or well-reverberating plate materials are used. For example, there has been proposed a cabinet whose plate materials are composed of resonance materials for musical instruments (see Japanese Utility Model Application No. Hei 6-23394). According to Japanese Utility Model Application No. Hei 6-23394, a front plate and a back plate are attached to a body portion formed of a cylindrical member to form a hollow cylindrical cabinet, and a speaker unit is mounted to the central portion of the front plate of the cabinet, thereby realizing a speaker producing a natural sound.
However, the speaker cabinet as disclosed in Japanese Utility Model Application No. Hei 6-23394 has the following problems. That is, of the radiation sounds from the resonance portions of a musical instrument such as a guitar, the radiation sound from the front plate (and the back plate) is larger than the radiation sound from the body portion. This is due to the fact that the front plate (and the back plate) are formed of a relatively thin plate material (typically having a thickness of approximately 3 mm) and that the musical instrument has a so-called drum structure whose body portion constrains the peripheral portion and whose central portion is easily allowed to vibrate. As a result, the vibration of the strings is richly flavored, and a full-bodied timbre is obtained. In contrast, in the speaker cabinet as disclosed in Japanese Utility Model Application No. Hei 6-23394, it is necessary to impart an appropriate strength allowing supporting of the speaker unit to the portion where the speaker unit is mounted (that is, front plate of the cabinet, which corresponds to the front plate of the guitar), so the thickness of the plate material must be increased. As a result, the radiation sound from the front plate is reduced, and no full-bodied sound is reproduced. If the cabinet is prepared with the thickness of the front plate being almost as thin as that of a musical instrument, the requisite strength for supporting the speaker cannot be obtained, which means that there are cases where the cabinet cannot be put into practical use, and the weight of the speaker must be limited (that is, use of a high-power speaker is impossible). Further, if, in such a cabinet, the drive power for the speaker unit is increased, an abnormal vibration of the front plate will be caused in some cases, resulting in generation of noise. Even if the speaker unit is mounted in a satisfactory manner, the weight of the front plate as a whole increases due to the weight of the speaker unit itself, so the vibration of the front plate is rather limited, and no full-bodied sound can be reproduced.

Speaker cabinet and speaker using the same


A mechanism is provided for caching backed-up data locally until successful replication of the backed-up data. Responsive to an indication to back up one or more pieces of identified data from a local storage device, a determination is made as to whether a primary storage device is available. Responsive to the primary storage device being available, the one or more pieces of identified data are backed up to the primary storage device and a local replication cache. Responsive to the backed-up data being replicated from the primary storage device to a secondary storage device, the backed-up data is removed from the local replication cache.

The present application relates generally to an improved data processing apparatus and method and more specifically to mechanisms for caching backed-up data locally until replication of the backed-up data is successful.
Replication in computing involves sharing information so as to ensure consistency between redundant resources, such as software or hardware components, to improve reliability, fault-tolerance, or accessibility. Two main types of replication are asynchronous replication and synchronous replication. Asynchronous replication is a "store and forward" approach to data backup. Asynchronous replication writes data to a storage array first and then, depending on the implementation approach, commits data to be replicated to a primary storage site. Asynchronous replication then copies the data in real-time or at scheduled intervals to a secondary storage site. However, one downside to asynchronous replication is the possibility of data loss if the primary site should happen to fail before the data has been written to the secondary site. In contrast, synchronous replication writes data to a primary site and a secondary site at the same time so that the data remains current between sites. However, synchronous replication is more expensive than other forms of replication and introduces latency that slows down the primary application.
In both asynchronous replication and synchronous replication, if there is a failure in a backup or a replication process, the most widely utilized recovery solution resets backups at the secondary site by performing a full backup. In fact, when using a full+incremental or a full+differential backup scheme, a full backup is a requirement. However, performing a full backup may not be acceptable to customers, such as in systems that rely upon, for example, journaling, which is a method to keep track of file system changes and are generally so large that it may not be possible to scan the files. The same is true for databases that may be many terabytes or petabytes in size and backing such databases up in the event of a failure is not reasonably feasible.

Caching backed-up data locally until successful replication


An upper rail assembly, an actuator that actuates between a retracted position and an extended position based on a signal that the platform is in one of a retracted position and an extended position with respect to the recreational vehicle, and a first drive chain combined to the actuator and connected to the upper rail assembly for moving the upper rail assembly between a retracted position and an extended position with respect to the platform is disclosed.

Generally, building codes and good safety practices require railings for stairways. In the prior art, railings are put on manually after the stairway is extended. This can sometimes be a difficult process if there are variances in the rail vertical spacing and the rail receptacles spacing in the platform. What are needed are automatic rails to ensure the stairway will have a rail during use, which is automatically stored when the stairway is retracted. Automatic stairway railings could utilize a vertical cylinder to actuate a railing to this specified height. However when collapsed, the height of the mechanism will be fairly tall, making it difficult to package. Height is extremely important on over the road applications, where floor height can't be too high and mechanisms can't extend too low.

Automatic railing for a retractable stairway


The present invention provides a storage apparatus including a variable resistance element having a recording layer between two electrodes. In the variable resistance element, a resistance value of the recording layer is reversibly changed to one of a value in a high-resistance state and a value in a low-resistance state by applying potentials of different polarities to the two electrodes. An absolute value of a threshold value of an applied signal at a time of change from the high-resistance state to the low-resistance state and an absolute value of a threshold value of an applied signal at a time of change from the low-resistance state to the high-resistance state differ from each other. A reading signal for detecting the resistance value of the recording layer in the variable resistance element is applied with a polarity of one of the threshold values of the applied signals which one has a higher absolute value and with a value lower than the absolute value.

The present invention relates to a storage apparatus that has a variable resistance element in which the resistance value of a recording layer is changed reversibly by applying potentials of different polarities to two electrodes, and which stores information using a change in resistance of the variable resistance element.
Recently, with the dramatic spread of information communication devices, portable terminal devices and the like, higher performance such as a higher degree of integration, higher speed, lower power consumption and the like is required of elements such as a memory, a logic and the like forming these devices. Of such elements, nonvolatile memories, in particular, are considered to be essential in the ubiquitous age.
Nonvolatile memories enable protection of important information including personal information even when power supply exhaustion or trouble occurs, or a server and a network are disconnected due to some problem. Recent portable terminal devices are designed to minimize power consumption by setting an unused circuit block in a standby state. However, when a nonvolatile memory that can serve as a high-speed work memory and a high-capacity storage memory can be realized, wastes of power consumptions and memory can be eliminated. Further, when a high-speed and high-capacity nonvolatile memory can be realized, a so-called "instant on" function, which enables an instant start on turning on power, can also be realized.
Various nonvolatile memories have been proposed, and some nonvolatile memories, such as flash memories, for example, are put to practical use. On the other hand, a nonvolatile memory using a variable resistance element that stores information using a change in resistance has recently been proposed as a new-generation memory device that operates on a relatively low voltage, has a high storage density, and enables high-speed random access operation (see Japanese Patent Laid-open No. 2004-87069 and Japanese Translations of PCT for Patent No. 2002-536840, for example). The variable resistance element is formed such that a resistance value in the element is reversibly changed to a high resistance value or a low resistance value by applying potentials of different polarities to the element. Specifically, there are a variable resistance element using spin injection magnetization reversal as disclosed, for example, in Japanese Patent Laid-open No. 2004-87069 and a variable resistance element using mobile ions such as Ag and the like as disclosed, for example, in Japanese Translations of PCT for Patent No. 2002-536840.


An electronic data input apparatus comprises a receptacle, a tube, a housing for electronic components, and a harness. The receptacle is operable for use in a user's mouth. The tube connects the receptacle to the housing, which is attached to the harness. A user wears the harness on the upper part of the torso, such that the receptacle is accessible to the mouth. A cable connects the electronic component housing to a computing element and establishes serial communication from the input apparatus to the computing element. The apparatus may provide the same function as a conventional mouse pointing device by allowing the user to control the motion of a pointer on an electronic display by breathing in to and out of the receptacle.

1. Field of the Invention
Embodiments of the present invention relate to an apparatus and methods for controlling an input to an electronic device. More particularly, various embodiments of the present invention relate to controlling a pointer on an electronic display by receiving breath from a user.
2. Description of the Related Art
Interactive electronic devices, such as computers, personal digital assistants, and voting machines, generally accept input from a user through the operation of a data input element, such as a touchscreen, a keyboard, a mouse, or a tablet and stylus. The touchscreen generally requires applying pressure to a desired area of the screen. The keyboard generally requires pressing and releasing the keys, or typing. The mouse generally requires movement of its body over a designated area. The tablet and stylus generally require marking of the tablet with the stylus, typically in a fashion similar to handwriting.
The cited data input elements, as well as others not listed, generally require the user to have the use of at least one arm and hand in order to control and manipulate the data input element. However, users without the use of at least one arm and hand may have difficulty in performing the actions described above. Therefore, an apparatus and method for controlling an input to an interactive electronic device is required that does not involve manipulation by hand.


Some embodiments of the invention effectively shield signal traces on a substrate without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention provide improved power delivery without impacting the signal trace routing on the metal layers of the substrate. Other embodiments of the invention are described in the claims.

1. Technical Field of the Invention
This disclosure relates generally to the routing of signal traces on substrates and more particularly to a method and apparatus for providing improved trace shielding on substrates that consumes less circuit real estate.
2. Description of the Related Art
Crosstalk and electromagnetic interference (EMI) are two issues that every electronic system designer is familiar with. With the growing density and speed (as measured by frequency, i.e. Megahertz) of semiconductor devices and widespread use of such devices in wireless communication devices such as cellular phones and personal digital assistants, it becomes increasingly important to shield the signal traces connected to the semiconductor devices to prevent crosstalk and EMI.
FIG. 1A is a cross-sectional diagram illustrating a conventional two-layer substrate. The substrate 10 includes two metal layers 11 and 13. The upper metal layer 11 typically includes a number of signal traces (not shown) that are connected to a semiconductor die 14 by a jumper wire bond 9. The lower metal layer 13 typically includes a number of metal lands (not shown). Signal vias (not shown) connect the signal traces on the upper metal layer 11 to corresponding metal lands on the lower metal layer 13.
FIG. 1B is a cross-sectional diagram illustrating a conventional four-layer substrate. In addition to the elements illustrated in FIG. 1A, the four-layer substrate has two more metal layers 15 and 17. The metal layers 15 and 17 typically function as power or ground planes.
FIG. 2 is a plan diagram illustrating unshielded signal traces on a conventional substrate 10. In this diagram, the signal traces 20 that are part of the metal layer 11 of FIGS. 1A and 1B are illustrated. A number of signal pads 16 are located on the periphery of the die 14. A number of bond fingers 18 are on the substrate 10 surrounding the die 14, each bond finger 18 corresponding to a signal pad 16. The signal traces 20 are formed in contact with a corresponding bond finger 18, which is electrically connected to a corresponding signal pad 16 by a jumper wire bond 9. In FIG. 2, the substrate 10 is flexible and may be folded about the fold region 12.
FIG. 3 is a plan diagram illustrating shielded signal traces on a conventional substrate. FIG. 3 is the same as FIG. 2, except for the fact that each signal trace is routed between a ground trace 34 and a power trace 24. Each of the ground traces 34 and power traces 24 are connected to a ground via 35 or a power via 25, respectively. If the substrate 10 is a four-layer substrate such as that shown in FIG. 1B, each of the ground vias 35 and power vias 25 are connected to the ground plane and power plane, respectively. If the substrate 10 is a two-layer substrate such as the one shown in FIG. 1A, each of the ground vias 35 and power vias 25 must be connected to a metal land that supplies ground and power voltages, respectively.
The shielding scheme illustrated by FIG. 3 is problematic for a variety of reasons. Due to the increased density of semiconductor devices, routing the ground vias 35 and the power vias 25 in the locations shown is almost impossible for a two-layer substrate, since it does not provide a ground plane like the four-layer substrate does. Additionally, the ground vias 35 and the power vias 25 require a significant amount of surface real estate. The diameter of the vias 24 and 35 is typically on the order of 250 μm, which is significantly larger than the width of the signal traces 20. As a result, when placement is attempted between adjacent traces, the vias 24 and 25 tend to short the signal traces 20, as illustrated in FIG. 3.
Embodiments of the invention address these and other disadvantages of the conventional art.

Method and apparatus for trace shielding and routing on a substrate


Apparatuses, methods, and systems associated with and/or having components capable of, detecting a temperature of an integrated circuit in real time during testing are disclosed herein. In exemplary embodiments, an integrated circuit includes a register to store a temperature limit for the integrated circuit; a temperature sensor formed on the integrated circuit to sense a temperature of the integrated circuit, and output a signal indicative of the temperature sensed, based at least in part on the temperature sensed; and testing logic coupled to the register and the temperature sensor to record a temperature violation if at any time during a testing mode of operation the temperature sensed by the temperature sensor violates the stored temperature limit.

During the manufacturing of electronic devices, individual integrated circuits generally undergo testing for functional and other defects using automated test equipment. The tests sometimes are performed at various temperatures; for example, "hot" and "cold" testing. During such tests, it may be important to keep the junction temperature of the integrated circuit being tested ("Device Under Test"—DUT) substantially close to the selected temperature set points.
To maintain the temperature of the DUT at selected temperature set points, an automatic thermal control equipment handler (ATC) may be used. In general, the ATC attempts to maintain a constant temperature set point before test (sometimes called "T-soak") as well as actively cool the DUT during execution of the test pattern(s). The degree of cooling is modulated during the test as a function of the DUT temperature and the electrical power consumed by the DUT. Owing to the fact that this thermal control has a dynamic behavior, the temperature of the DUT is difficult to control. Specifically, the temperature of the DUT may undershoot (e.g., due to overcooling) or overshoot (e.g., due to less cooling) the desired set point. As a result, the DUT may be under-tested giving rise to potential quality issues, or may be over-tested affecting yield, reliability, and/or other issues.
A thermal diode disposed at the edges of the DUT is sometimes used to determine whether temperature overshoot or undershoot of the DUT occurred during a test. The diode is read only after the conclusion of a test and the reading is then compared to predetermined guardbands (e.g., minimum and/or maximum temperature limits). Due to the location of the diode, the estimation of the temperature generally can never be close to the true temperature at the core of the DUT. In addition, the diode is measured at the end of a test rather than during execution of the test, at which point the temperature of the DUT may have changed. Furthermore, analyzing such data after the test is completed adds a significant amount of additional processing time, which may be incompatible with high-volume manufacturing needs. As a result of these problems, the cooling of the DUT is usually very conservative and the guardband(s) are usually sizeable to ensure that passing DUT meet the desired standards.

Real-time temperture detection during test


Supporting leads extend from one side portion of a package to another side portion thereof and are arranged on both sides of an island such that both ends of the island are supported. An electrode for a fixing potential of a semiconductor chip is connected to these supporting leads by a bonding wire. One end of these supporting lead is located outside a column of an outer lead portion as the same structure as the outer lead portion. Thus, while a structure for commonly using each of the supporting leads as a lead for a fixing potential is adopted, a thermal distribution of the semiconductor chip can be uniformed and no island is inclined at a resin seal time.

1. Field of the Invention
The present invention relates to a semiconductor device having a structure in which signal pins are concentrated on one side of a package such as a Rambus DRAM (Dynamic Random Access Memory), etc.
2. Prior Art
A conventional semiconductor device of this kind will next be explained with reference to FIGS. 3A and 3B and 4.
FIGS. 3A and 3B are a view showing an SHP (Surface Horizontal Package) type Rambus DRAM. FIG. 3A is a side view of this SHP type Rambus DRAM and FIG. 3B is a plan view of this SHP type Rambus DRAM. FIG. 4 is a plan view showing a lead frame for the conventional SHP type DRAM and shows a state of the lead frame after a semiconductor chip is mounted to the lead frame and wire bonding is performed. In FIG. 4, only a forming portion of one semiconductor device is enlarged and drawn.
In FIGS. 3A and 3B, reference numeral 1 designates the conventional SHP type Rambus DRAM (hereinafter, simply called a semiconductor device). Reference numeral 2 designates seal resin for forming a package of this semiconductor device 1. In this semiconductor device 1, many pins 3 for external connection are projected in one side portion of the seal resin 2 and four pins 4 for support are projected in another side portion of the seal resin 2. The semiconductor device 1 is mounted onto the surface of an unillustrated printed wiring board by these pins. Only the above pins 3 for external connection among these pins are connected to a semiconductor chip described later within the seal resin 2.
A lead frame used to manufacture this semiconductor device 1 is formed as shown in FIG. 4. In FIG. 4, this lead frame is designated by reference numeral 5. This lead frame 5 is formed by two lead frame portions 6, 6 extending in a vertical direction in FIG. 4, tie bars 7, 8 for connecting these lead frame portions 6 to each other, an island 11 connected to these tie bars 7, 8 through supporting leads 9, 10, and many leads 12 for external connection extending from the tie bar 8 located on a lower side in FIG. 4 among the above tie bars 7, 8 to a side of the other tie bar 7. The semiconductor chip 13 is mounted to the above island 11. An electrode for a signal and an unillustrated electrode for a fixing potential (ground) on this semiconductor chip 13 are connected to an inner lead portion 12a of the above lead 12 for external connection by a bonding wire 14.
The above supporting lead 9 supports a center of the island 11 on its upper side. The above supporting lead 10 supports two island portions on both lower sides of the island 11. The supporting lead 9 and the supporting lead 10 are folded in their intermediate portions such that the island 11 is one-sided below the lead frame portion 6 and the tie bars 7, 8. These folding portions are designated by reference numerals 9a, 10a.
A basic end portion 10b of the above supporting lead 10 on a side of the tie bar 8, and an outer lead portion 12b of the lead 12 for external connection connected to the tie bar 8 form the pins 3 for external connection shown in FIG. 3. The pins 4 for support are formed integrally with the tie bar 7 and are not connected to the semiconductor chip 13.
When the semiconductor device 1 is manufactured by using this lead frame 5, the semiconductor chip 13 is mounted to the island 11 and wire bonding is performed as shown in FIG. 4. Thereafter, the seal resin 2 is first molded. This resin is sealed by mounting the lead frame 5 to a mold die of an unillustrated transfer molding machine and injecting the seal resin in a melting state into a cavity of this mold die and solidifying this seal resin. In this lead frame 5, a range sealed by the seal resin 2 is shown by a two-dotted chain line in FIG. 4.
After the resin seal process is terminated, a forming portion of the semiconductor device is separated from this lead frame 5. At this time, the outer lead portion 12b of the lead 12 for external connection, the basic end portion 10b of the supporting lead 10 and the pins 4 for support are set to be left on a side of the seal resin 2. Thereafter, the pins 3 for external connection and the pins 4 for support projected from the seal resin 2 onto its side are folded as shown in FIG. 3(a) so that a manufacture process of this semiconductor device 1 is terminated.
However, in this semiconductor device 1, there is a limit in an increase in an operating speed of the semiconductor chip 13. This is because no heat radiating property can be improved and no parasitic impedance of a signal system can be reduced.
The semiconductor device 1 of this kind, DRAMs, for example, Rambus, synchronous etc. attain an operating speed of several hundred MHz and a power assumption of several watts. Therefore, the semiconductor chip 13 is raised in temperature at an operating time of the semiconductor device. The semiconductor chip 13 of the semiconductor device 1 manufactured by using the lead frame shown in FIG. 4 is cooled by conducting lead through the supporting lead 10 and the seal resin 2 and externally radiating this heat. At this time, no electric current flows through the supporting lead 10. Accordingly, when the supporting lead 10 is soldered to a printed wiring board, the supporting lead 10 is not necessarily connected to a wiring pattern widely extending on the printed wiring board. Therefore, a ratio of heat conducted onto a side of the printed wiring board through the supporting lead 10 is extremely small so that the heat of this semiconductor device 1 is mainly radiated into the atmosphere through the seal resin 2. Namely, the heat must be radiated through the seal resin 2 having a low coefficient of thermal conductivity in comparison with a metal. Accordingly, no heat radiating property can be improved so that no semiconductor chip 13 can be operated at high speed.
Further, the lead 12 for external connection and the supporting lead 10 are connected to one tie bar 8 and the inner lead portion 12a must be arranged in a space except for the supporting lead 10 so that a degree of freedom is low in the designs of a shape and a size of the inner lead portion 12a. Namely, no signal system connected to an electrode of the semiconductor chip 13 can be formed in a mode for reducing parasitic impedance so that no operating speed of the semiconductor chip 13 can be increased.
To solve such disadvantages, for example, as disclosed in Japanese Patent Application Laid-Open No. 63-47351, it is considered that an electrode for a fixing potential of the semiconductor chip is connected to the supporting lead by a bonding wire and the function of a lead for a fixing potential is provided to this supporting lead. Namely, the supporting lead 10 is connected to a wiring pattern for a fixing potential of the printed wiring board by connecting the electrode for a fixing potential of the semiconductor chip 13 to the supporting lead 10 shown in FIG. 4 by the bonding wire. Accordingly, heat transmitted from the semiconductor chip 13 to the island 11 is radiated in a wide range of the printed wiring board so that the heat radiating property can be improved. Further, the lead 12 for external connection formed for the fixing potential and the supporting lead 10 can be constructed by one lead so that a space for extending the inner lead portion 12a is widened. Accordingly, a degree of freedom on design of the inner lead portion 12a is increased and the inner lead portion 12a can be formed such that parasitic impedance is reduced.
However, in the lead frame 5 shown in FIG. 4, two supporting leads 10 are connected to one side (one side on which the outer lead portion 12b is arranged in parallel) of the island 11. Accordingly, when the above structure is adopted, the heat of the semiconductor chip 13 is radiated from one side of the island 11 so that the heat radiating property is improved, but a thermal distribution of the operated semiconductor chip 13 is one-sided. It is considered that the number of supporting leads 10 is increased to uniform this thermal distribution. However, to do this, the island 11 must be constructed such that this island 11 can be supported by the supporting leads in well balance. This is because it is necessary that no island 11 is inclined by the seal resin when the seal resin in a melting state is injected into the mold die in the resin seal process. When the island 11 is inclined, there is a case in which the bonding wire 14 is pulled and disconnected and an upper side corner portion of the semiconductor chip 13 is exposed to a surface of the seal resin 2.

Horizontal package having die supports leads formed along lead column


Laboratory-scale dyeing of samples of lengths of material must correspond to the continuous process conditions as executed in practice in order to obtain comparable dyeing results. For this purpose, the provision is made of joining the sample piece into a tube and of pushing same onto a roll which revolves continuously during dyestuff application as well as during the steaming procedure. For performing this laboratory dyeing-steaming cycle, it is advantageous to arrange the dyeing roll on a rocking lever pivotable from i dyeing position below the dyestuff applicator into a steaming position below a steamer hood. The steamer hood, for steaming purposes, need merely be moved downwards to immerse the dyeing roller in total into the steam atmosphere.

This invention relates to a process for laboratory dyeing of, for example, carpet samples by the application of a defined amount of dyestuff onto the face of the carpet sample and transportation of this sample into a laboratory steamer wherein the sample is kept in motion.
In order to avoid rejects in the continuous dyeing manufacture of lengths of textile material, it is customary to test the respective dyeing effect at least on a laboratory scale. For this purpose, a sample piece of the length of material is conveyed over a dyestuff applicator and then introduced into the steamer for dye fixation. Only after the fixing step is the dye effect to be evaluated. For obtaining comparable production conditions even during laboratory dyeing, it is important to utilize the same application method and to record the exact amount of dyestuff applied. Also the steaming of the sample piece should, if at all possible, be carried out so that comparable production conditions are created. However, since a laboratory-scale continuous process dyeing plant is too expensive, one had to be satisfied, heretofore, with compromise solutions. Although the dyestuff was applied in accordance with the flow coating principle, the sample piece was disposed on an endless belt, with the drawback that the pile, for example when dyeing carpet material, was not opened up. Subsequently, the sample piece was transferred manually into the steamer. The best laboratory steamer was, heretofore, provided with a needle inlet, the sample piece being pinned to the needles thereof. On account of this fastening of the sample piece, the piece could then also be steamed in vertical extension ---- as customary in the production festoon steamers. Additionally, the sample piece could also be moved during the entire steaming period, namely repeatedly upwards and downwards.
It has been found time and again that this laboratory dyeing process is inadequate. Flawed continuous dyeing effects could not be avoided, solely due to the fact that also these laboratory dyeing conditions could not be reproduced in the continuous procedure.

Process for laboratory dyeing of sample pieces


The invention relates to an apparatus for cutting a workpiece made of a polymer. The apparatus combines a cutting tool operable to perform a feed movement along a desired line of cut relative to a portion of the workpiece to be cut, the cutting tool includes a cutter blade subjected to ultrasonic vibration as it cuts the portion of the workpiece, with a thermal control arranged to maintain the portion of the workpiece at a pre-selected temperature.

1. Field of the Invention
This invention relates to an apparatus for cutting workpieces made of polymers, particularly of synthetic thermoplastic polymers or fiber-reinforced polymers, wherein a cutting tool is caused to perform a feed movement along a desired line of cut.
2. Description of the Prior Art
Considerable difficulties usually arise in the cutting of numerous polymers, particularly synthetic thermoplastic polymers and fiber-reinforced polymers, to a desired shape because such polymers when cured have a high strength, which may be increased further by reinforcing fibers. For this reason such cutting operations had mainly to be performed in the past by contour milling although this is a rather expensive operation, which involves a considerable loss of chip material.

Apparatus for ultrasonically cutting workpieces made of polymers

GFM Gesellschaft fur Fertigungstechnik und Maschinenbau Aktiengesellschaft


The surface of a gas turbine blade is machined with a material-removing tool and simultaneously, an anti-oxidation coating is deposited on the surface using eletrospark deposition.

In small gas turbine engines, the shrouds located around the turbine blades are generally not provided with a layer of abradable material, as is the case for some larger engines. Reasons for this include the facts that large engines may have more carcass distortions and more misalignment between centerlines of the rotor and shrouds. A distortion or misalignment may cause a localized rub between a shroud segment and all blades. Without an abradable system, this may leave a relatively large gap around the periphery of the rotor and reduce the efficiency of the engine. Smaller engines take advantage of having less carcass distortions and misalignments by designing to have tighter tip clearances. One method of achieving tight tip clearances on smaller engines is to machine blades to their final dimensions so that the designed tip clearance is achieved even without a running-in period.
Whenever parts are machined to their final dimension, for instance using a grinder, some material is removed. Since the parts are coated with one or more protective layers before the final machining process, removing more material than the thickness of the protective layer or layers will leave the base material exposed. The exposed areas will then be prone to oxidation. Oxidation is particularly severe at the edge of the pressure side of blades This ultimately results in a premature wear of the blades.
Accordingly, there is a need to provide an improved way of protecting from oxidation the surfaces of the blades that are machined because their base material is exposed once machined to their final dimension.

Oxidation protected blade and method of manufacturing


A control method for a nonvolatile storage device having a storage mode in which in a memory cell provided with a trapping dielectric layer 1-bit data is stored depending on the presence or absence of charge in a first trapping region. In a dynamic reference cell initialization operation, a charge accumulation operation is performed, as a preset operation in the initialization operation, on second trapping regions of first and second dynamic reference cells to a charge accumulation operation on a second trapping region of the memory cell. In addition, at the time of data rewrite, preprogram verification and preprogramming are performed on the first trapping regions. This makes it possible to shorten the time taken for initialization and data rewrite.

Japanese Unexamined Patent Publication No. 2004-79602 discloses a nonvolatile memory cell which is configured such that it has, between a control gate and a semiconductor substrate, a nitride film as a charge trap layer which is sandwiched between two oxide films. Electric charge is trapped in the trap layer to thereby cause the cell transistor threshold to vary, and data "0" and data "1" are stored. Since the trap layer is a dielectric layer, the trapped charges are not allowed to migrate within the trap layer. One bit is stored in a first region of the nitride film in close proximity to a first source/drain region which is one of a pair of source/drain regions, and the other bit is stored in a second region of the nitride film in close proximity to a second source/drain region which is the other of the pair of source/drain regions. To sum up, 2-bit information can be stored in the nonvolatile memory cell.
In addition, in some usage cases, only 1-bit information is stored in a nonvolatile memory cell. To this end, the second region of the nitride film is used as a nonuse bit region and is placed in a charge trap state, with data to the nonvolatile memory cell retained, while the first region of the nitride film is used as a use bit region and data is stored depending on the presence or absence of charge in the first region.
The above nonvolatile memory cell is characterized in that, by trapping charge in the nonuse bit region, the time taken to trap (program) charge in the use bit region is shortened, and the retention characteristic of charge trapped in the use bit region, is improved.
On the other hand, Japanese Unexamined Patent Publication No. 2004-110881 discloses a technique in which, in order that the characteristic of a reference cell at the time of reading out data may match the characteristic of a nonvolatile memory cell where the data is stored, the reference cell is arranged in the layout region of the nonvolatile memory cell. The purpose of this is to cause the reference cell to undergo the same history as the history of the bias that is applied to the nonvolatile memory cell, whereby both the cells have the same cell characteristic.
In this case, the characteristic of reference cells may vary due to the variation taking place during fabrication process, the layout position in the nonvolatile memory cell layout region, and so on. In addition, it is also conceivable that the data read-out margin varies depending on, for example, the layout position relationship between a nonvolatile memory cell which is a read-out target and a reference cell. To cope with this, two dynamic reference cells are provided, and DATA "0" is written to one of the two dynamic reference cells, while DATA "1" is written to the other dynamic reference cell. Output currents from the two dynamic reference cells are merged, whereby the read-out margin is secured.
FIG. 13 illustrates by way of example a configuration of each dynamic reference cell having a charge accumulation layer formed by a trap layer, e.g. a nitride film et cetera. Nonvolatile memory cells (16 cells) which are not shown are connected to a common word line. The eight cells on the right hand side together form a block, while the eight cells on the left hand side together form another block. In each block, the nitride film's first and second regions of the nonvolatile memory cells (8 cells) are identified by ADDRESSES (from 8 to f) and by ADDRESSES (from 0 to 7), respectively. With reference to FIG. 13, nitride film's first regions in the blocks that are identified by one of ADDRESSES (from 8 to f) are selected at the same time, and a data parallel read-out operation is performed depending on the presence or absence of charge.
The dynamic reference cell (DRB, DRA) has the same device configuration as the nonvolatile memory cell, and is composed of sixteen cells which are connected to a common word line. In response to addressing to the nonvolatile memory cells, the first regions of the nitride film are identified by ADDRESSES (from 8 to f), while on the other hand the second regions of the nitride film are identified by ADDRESSES (from 0 to 7). The eight cells on the right hand side are a first dynamic reference cell DRB where DATA "01" is stored and the second eight cells on the left hand side are a second dynamic reference cell DRA where DATA "10" is stored.
Here, the notation of DATA "10" and DATA "01" is described. Of the two numeric values arranged side by side, the prefix numeric value is indicative of the presence or absence of charge in the nitride film's first regions of ADDRESSES (from 8 to f) and the postfix numeric value is indicative of the presence or absence of charge in the nitride film's second regions of ADDRESSES (from 0 to 7). The numeric value "1" is indicative of the absence of charge while on the other hand the numeric value "0" is indicative of the injection of charge. DATA "01" which is stored in the first dynamic reference cell DRB is indicative of the state in which charge has been injected to the nitride film's first regions, while no charge exists in the nitride film's second regions, and LOGIC VALUE "0" is stored. On the other hand, DATA "10" which is stored in the second dynamic reference cell DRA is indicative of the state in which no charge exists in the nitride film's first regions, while charge has been injected to the nitride film's second regions, and LOGIC VALUE "1" is stored.
If the nonvolatile memory disclosed in Japanese Unexamined Patent Publication No. 2004-79602 is used in a NAND interface, both the first and second regions of the nitride film of the nonvolatile memory cell must be subjected to an erase operation prior to performing a data program operation.
Generally, a plural number of nonvolatile memory cells are collectively data-erased. In this case, a bias for collective data erase is applied to a memory cell array which is a layout region for the nonvolatile memory cells, so that at the same time the bias is applied also to the dynamic reference cells DRB, DRA arranged in the memory cell array. With reference to FIG. 13, both the nonvolatile memory cells (16 cells) and the dynamic reference cells DRB, DRA (16 cells) are fed an erase operation bias, and they are erased. Such an erase operation places every nonvolatile memory cell and every dynamic reference cell in STATE "11" in which, in the nitride film, neither the first region nor the second region enters the no charged state.
If a nonvolatile memory cell is used as a 1-bit storage cell, charge is preinjected to a nitride film's second region. This operation is called a "preset operation" and is carried out by a program operation to the nitride film's second region. This places every nonvolatile memory cell in STATE "10" in which, in the nitride film, the first region is not charged, but the second region enters the charge injected state.
The above sequence allows the nonvolatile memory cells to enter the programmable state. On the other hand, at this point in time, the dynamic memory cells are held at STATE "11". Consequently, during the program operation period prior to starting a read-out operation, it becomes necessary to program each dynamic memory cell. With respect to the dynamic reference cell DRA, the second regions of the nitride film corresponding to ADDRESSES (from 0 to 7) are subjected to a program operation so that the dynamic reference cell DRA is placed in DATA "10" STATE. On the other hand, with respect to the dynamic reference cell DRB, the first regions of the nitride film corresponding to ADDRESSES (from 8 to f) are subjected to a program operation so that the dynamic reference cell DRB is placed in DATA "01" STATE. In some memories having a NAND interface, memory cells are programmed while sequentially generating a plural number of addresses within the device in a single program operation. In this case, ADDRESSES (from 8 to f), which are correspond to nitride film's first regions of the nonvolatile memory cells, sequentially vary. A nonvolatile memory cell that is a program target is subjected to a program operation, while simultaneously charge is injected to the first region of each nitride film of the dynamic reference cell DRB. In addition, ADDRESSES (from 0 to 7) sequentially vary, and charge is injected to the second region of each nitride film of the dynamic reference cell DRA. As a result of this, during the program operation period, data programming to the nonvolatile memory cells is carried out and, in addition, the dynamic reference cells DRB, DRA are preset to DATA "01" and to DATA "10", respectively.

Controlling a nonvolatile storage device


A system and method for secure access to a remote desktop across firewalls in an interactive grid environment is disclosed. Embodiments of the present invention include an interactive grid computing system comprising an interactive grid computing service provider comprising: a resource for use over the interactive grid, a first firewall for protecting the resource and a remote display server for providing a secure connection and for providing interactive graphical data associated with the resource. The system further comprises a client comprising: a second firewall protecting the client and a remote display resource for providing a secure connection and for viewing the interactive graphical data provided by the remote display server.

Grid computing is a method of harnessing the power of many computational resources in a network. Grid computing is a distributed computer infrastructure involving large-scale sharing applications and/or high performance processing and network bandwidth.
Referring to FIG. 1, a grid computing environment comprising a plurality of heterogeneous computing nodes distributed across multiple administrative domains. A virtual organization (e.g., VO-X, VO-Y, and VO-Z) may include nodes from different domains. For example, VO-Z includes nodes from each of Administrative Domains 110, 120, and 130.
A node (hereinafter also referred to as a computing resource) may be a member of several virtual organizations. An end-user (e.g., USER M, USER N, or USER O) may need to access remote nodes either in the same administrative domain, or across domains. For example, User O may access VO-Y from within Domain 120, or User N within Domain 130 may access the same node from outside of Domain 120. Similarly, User M of Domain 130 may access both VO-Y and VO-Z through a single node in Domain 110.
Traditionally, grid computing has provided for the execution of batch jobs in the scientific and academic community. Batch execution on a grid computing environment requires authentication, authorization, resource access, resource discovery, and other services. In support of batch processing of jobs on a grid computing environment, protocols, services, application programming interfaces, and software development kits have been developed. The conventional method and system are not particularly suited for interactive grid computing sessions.
In a grid computing environment, security can be a concern. As a result, a grid computing service, providing access to desktops for use, may reside behind a firewall. In addition, a user that is accessing a grid computing resource, may reside behind another firewall. Conventional methods for providing grid computing resources cannot traverse firewalls and provide a secure connection simultaneously.
Port forwarding can be used to traverse firewalls between organizations. In this solution a third party host is needed between firewalls which is accessible from both organizations. Both organizations need to connect to this bridge host to open a tunnel.
This solution may be fine for academic settings, but in commercial environments, the client may not want to go over an intermediate bridge for connecting to the ASP. Also, bridge host needs to be especially set up in order to do port forwarding.
A grid computing infrastructure that can hide the complexities of resource management from the user and that can provide secure graphical and multimedia interactive sessions is needed.

System and method for providing secure access to a remote desktop across firewalls in an interactive grid environment

Hewlett-Packard Development Company, L.P.


Representative implementations of devices and techniques provide dynamic secure sharing of resources. A resource module can be partitioned into a plurality of functional blocks, which may be allocated to non-secure and secure applications. A security monitor can monitor processor activity and determine when secure resources may be accessed.

Intellectual property (IP) piracy and other forms of potentially injurious activities are a major concern in many operating or computing environments. Often, microcontrollers, for example, do not offer trusted execution environments for executing proprietary or confidential routines, due to the configuration of the hardware. For instance, the architecture of the hardware may be based more on economical design considerations, particularly when the hardware is to be deployed in an industrial application. This can be problematic, when considering the potentially exposed environments that such microcontrollers may be operating within. Valuable IP assets such as firmware, software, data, and the like may be vulnerable to attack in these situations.
Proposed solutions often include duplication of resources, which may include additional hardware components or systems. For example, a system-on-chip (SoC) may include additional "secure" components (for digital rights management purposes, for example) in addition to like general purpose components on the chip. Secure components may only be used by trusted applications in a secure environment, for example. Such secure components may include clocks, interrupt controllers, keypad controllers, DMA modules, memory, and the like. In general, resource duplication entails additional die size and increased power consumption.
In other proposed solutions, designed time-partitioning may be used to switch modules from a non-secure mode to a secure mode and back, as needed to run secure applications. However, once a module is temporarily assigned to a non-secure application or to a secure application, the whole module is generally unavailable to the other "world" (e.g., secure applications/routines or non-secure applications/routines, respectively) for a time, until it is relinquished by the assigned application. This is generally true, even if the module includes several functional blocks, capable of being used concurrently and independently. In such a situation, many of the functional blocks of the module may be idle (a majority, for example), while the remainder of the blocks of the module (a few, for example) are being used by the assigned application. This technique can limit the range of applications and/or use cases for the design and can be inefficient.


A safety and arming unit with a safe separation distance device (14), which acts as a function of a free-flight incident flow and temperature, for the fuze (12) of a projectile (11), which fuze is hermetically sealed from environmental influences, has, as a measurement device for the cooling, as a function of the incident flow, of a conductor through which current passes, in the heating circuit (18) of a resistant heating element (16) which is fitted flat on the fuze casing surface (17), an electronic current measurement apparatus (21) which is connected upstream of an evaluation circuit (22), in order to ram a firing circuit. Two heating elements (16, 16″), which are fed in the same way, are preferably arranged one behind the other in the incident flow direction (15), and, additionally as an environmental temperature sensor, a comparison heating element (16′) which is not influenced by the incident flow (15). This results in a reliable safe separation distance, even for slow projectiles (11), without adversely affecting their aerodynamic behaviour and independently of the environmental atmosphere.

1. Field of the Invention
The invention relates to a safety and arming unit including a safe separation distance device, which acts as a function of an incident flow and temperature utilized for the fuze of a projectile
2. Discussion of the Prior Art
A safety and arming unit of this type is known from DE 31 26 289 C for a projectile in order to ensure its second safety criterion, the safe separation distance following the launch-dependent first safety criterion. There, ram-air pressure channels, into which an unlocking element which is deformed as a function of temperature projects, run approximately parallel to the axis through the fuze between inlet openings in the end surface and outlet openings in the truncated-conical coating surface of the fuze. Once this unlocking element has been heated sufficiently intensively by the ram-air flow resulting from sufficiently long free flight, it changes its geometric shape and in consequence unlocks the second arming element, which is spring-loaded, in order to enable the projectile fuze, which will respond later, for example on striking a target.
Mechanical unlocking such as this is, however, functionally critical and generally susceptible to defects, particularly after long depot storage times. Furthermore, the compressed incident flow emerging from the fuze casing surfaces adversely affects the ballistic behaviour of the projectile. Sufficiently rapid, strong ram-air pressure heating in flow channels such as this does not occur at all, where possible, in a relatively slow projectile such as a guided missile. When a projectile such as this is operated at low altitude and in particular in a sandy, dusty environment or one in which cold moisture results in a risk of icing, there is even a risk of the flow channels becoming blocked and therefore in failure of the second arming criterion, as a result of which the projectile becomes a misfire.
Against this background, the invention is based on the technical problem of designing a safety and arming unit of this generic type for reliable operation particularly and additionally in the case of relatively slow projectiles and in critical environmental conditions, and also of providing the capability to intervene in the second arming criterion, in this context.

Safety and arming unit for the fuze of a projectile


Provided is a resin molded body production method that enables production of a resin molded body in which mechanical strength is good, anisotropy of physical properties is low, and little warpage is developed. This production method is for a resin molded body containing a thermoplastic resin (A) and a cellulose nanofiber (B), the production method including: a step for preparing a main supply material (a1) containing the thermoplastic resin (A) and the cellulose nanofiber (B) and an auxiliary supply material (a2) that is a product of melting treatment of the main supply material (a1); a resin composition formation step for obtaining a resin composition (b) by melting and mixing of the main supply material (a1) and the auxiliary supply material (a2); and a step for obtaining the resin molded body by molding the resin composition (b).

Thermoplastic resins are light and have excellent processing characteristics, and are therefore widely used for a variety of purposes including automobile members, electrical and electronic parts, business machine housings and precision parts. With resins alone, however, the mechanical properties, slidability, thermal stability and dimensional stability are often inadequate, and it is common to use composites of resins with different types of inorganic materials.
Resin compositions comprising thermoplastic resins reinforced with reinforcing materials consisting of inorganic fillers such as glass fibers, carbon fibers, talc or clay have high specific gravity, and therefore the obtained resin molded bodies have higher weight. In recent years, cellulose has come to be used as a new reinforcing material for resins because of its lower environmental burden.
In terms of simple properties, cellulose is known to have a high elastic modulus similar to aramid fibers, and a lower linear expansion coefficient than glass fibers. In addition, it exhibits a low true density of 1.56 g/cm3, which is overwhelmingly lighter than glass (density: 2.4 to 2.6 g/cm3) or talc (density: 2.7 g/cm3) which are used as common reinforcing materials for thermoplastic resins.
Cellulose is obtained from a variety of sources, including trees as starting materials, as well as hemp, cotton, kenaf and cassava starting materials. Bacterial celluloses are also known, typical of which is nata de coco. These natural resources that are useful as starting materials are abundant throughout the Earth, and a great deal of effort has been focused on techniques for exploiting cellulose as fillers in resins in a manner so that they can be effectively utilized.
CNF (cellulose nanofibers) are obtained using pulp or the like as starting material, hydrolyzing the hemicellulose portion to weaken the pulp, and then defibrating it using a pulverizing method with a high-pressure homogenizer, microfluidizer, ball mill or disk mill, and in water they form a highly dispersed state and network on a level known as a fine nanodispersion.
For distribution of CNF in a resin it is necessary to dry the CNF into a powder form, but with CNF it has been a problem that they change from a microdispersed state to firm aggregates during the course of separation from water, making their redispersion difficult. Aggregating force is exhibited due to hydrogen bonding by the hydroxyl groups of the cellulose, and it is considered to be extremely strong.
In order to adequately exhibit the performance of CNF, therefore, it is necessary to relax hydrogen bonding by the hydroxyl groups of the cellulose. Even when relaxation of hydrogen bonding is achieved, however, it is still difficult to maintain a disentangled state (nanometer size, or <1 μm) in the resin.
PTL 1 describes a fiber-reinforced resin composition comprising (A) chemically modified cellulose nanofibers and (B) a thermoplastic resin, wherein the chemically modified cellulose nanofibers and thermoplastic resin satisfy the following conditions: (a) the ratio R (SPcnf/SPpol), between the solubility parameter (SPcnf) of the chemically modified cellulose nanofibers (A) and the solubility parameter (SPpol) of the thermoplastic resin (B), is in the range of 0.87 to 1.88, and (b) the degree of crystallinity of the chemically modified cellulose nanofibers (A) is 42.7% or greater.


There is provided a film electrode assembly for a fuel cell capable of preventing a polymer electrolyte film from being exposed. The film electrode assembly includes: a main body portion of a film electrode assembly having a polymer electrolyte film, and a pair of electrode layers having catalyst layers placed on the two surfaces of the polymer electrolyte film on the inner side from the peripheral edge portion thereof and diffusion layers each having a peripheral edge protruding from the catalyst layer, which are laminated on one another, with a gap being formed between the protruding portion of the diffusion layer and the peripheral edge portion of the polymer electrolyte film; a frame member that sandwiches the peripheral edge portion of the polymer electrolyte film between the paired electrode layers with a gap therebetween, and is formed so as to surround an outer edge of the polymer electrolyte film; and gaskets made of a thermoplastic resin, which are placed on the two surfaces of the frame member. Each gasket includes an annular portion that covers the peripheral edge portion of the main body portion of the film electrode assembly over the entire circumference thereof along the inner edge of the frame member and a gap filling portion that fills the gap.

A polymer electrolytic fuel cell (hereinafter referred to as PEFC) is a device which generates power and heat simultaneously by allowing a fuel gas containing hydrogen and an oxidant gas such as air containing oxygen to electrochemically react with each other.
In general, the PEFC is configured by laminating cells. A single cell is formed by sandwiching a film electrode assembly by using a pair of plate-shaped conductive separators, more specifically, an anode separator and a cathode separator. The film electrode assembly is provided with a main body portion of the film electrode assembly and a frame member that extends along the peripheral edge portion of the main body portion of the film electrode assembly to be placed thereon, in such a manner as to surround the main body portion of the film electrode assembly. The main body of the film electrode assembly is constituted by a polymer electrolyte film and a pair of electrode layers formed on the two surfaces thereof. Thus, a fuel gas and an oxidant gas are allowed to contact the two surfaces of the electrode layers to cause an electrochemical reaction. On the other hand, the frame member has a gasket, and the gap between the gasket and the separators is sealed, so that the fuel gas and the oxidant gas are prevented or restrained from leaking outside.
For example, the fuel cells having this structure are disclosed in Japanese Unexamined Patent Publication No. 2001-155745 and Japanese Patent No. 3368907. The fuel cell disclosed in Japanese Unexamined Patent Publication No. 2001-155745 relates to a gasket that is molded so as to cover the end face of a main body portion of a film electrode assembly and seal the end face. However, with this gasket, time-consuming tasks are required to place a sealing material that is made in close contact with the peripheral edge portion of the electrode layer just enough and evenly, with the result that this method is not suitable for mass production. Moreover, since the end face of the electrode layer of the main body portion of the film electrode assembly is covered with the gasket, the end face portion covered with the gasket fails to contribute to power generation, resulting in degradation in efficiency.
For this reason, by placing the gasket such that it does not cover the end portion of the electrode of the main body portion of the film electrode assembly, the entire face of the electrode layer can be used for power generation with this gasket. Japanese Patent No. 3368907 discloses a film electrode assembly shown in FIG. 3 thereof, which is provided with a gap between the electrode layer and the gasket (gas sealing member).

Film electrode assembly for fuel cell, polymer electrolytic cell for fuel cell and method for manufacturing polymer electrolytic fuel cell and film electrode assembly


A method of producing a semiconductor crystal is provided. The method includes the steps of preparing a longitudinal container with a seed crystal and an impurity-containing melt placed in a bottom section and with a suspension part arranged in an upper section and suspending a dropping raw material block made of a semiconductor material having an impurity concentration lower than the impurity concentration of the impurity-containing melt, and creating a temperature gradient in the longitudinal direction of the longitudinal container to melt the dropping raw material block, and solidifying the impurity-containing melt from the side that is in contact with the seed crystal (8) while dropping a produced melt into the impurity-containing melt, thereby producing a semiconductor crystal.

Conventionally, semiconductor crystals are suitably used as a substrate for an optical device such as a light emitting diode (LED) and a laser diode (LD), or a substrate for an electronic device such as a transistor.
It is known that device properties of such an optical device and an electronic device are greatly affected by the impurity concentration, carrier concentration and the like of a substrate. Therefore, to solve variations in device properties among optical devices and electronic devices, it is necessary, for example, to make the impurity concentration distribution in a used semiconductor crystal more uniform.
FIG. 6 shows a schematic cross sectional view of an example of a conventional apparatus for producing a semiconductor crystal. This production apparatus 200 includes a crucible 20, a heat-resistant container 21 that encloses crucible 20, heaters 22a to 22d provided outside heat-resistant container 21, a B2O3 seal 23 for sealing heat-resistant container 21, and a chamber 24 that stores these members.
According to a method of producing a semiconductor crystal using this production apparatus 200, first, a GaAs seed crystal 25 is disposed at the bottom of crucible 20, and a raw material made of a GaAs polycrystal containing Si as an impurity and a sealant 26 made of B2O3 are placed sequentially on this GaAs seed crystal 25. Then, heater 22d heats B2O3 seal 23. B2O3 is thereby melted to seal heat-resistant container 21. Then, heaters 22a to 22c heat crucible 20, so that the GaAs polycrystal in crucible 20 is once melted.
Thereafter, the temperature of a GaAs melt 27 derived from the GaAs polycrystal is gradually decreased upward from the bottom of crucible 20. Along with this temperature change, GaAs melt 27 solidifies from its lower side that is in contact with seed crystal 25 located at the bottom of crucible 20 toward its upper side, so that a Si-containing GaAs crystal 28 is produced. GaAs crystal 28 extracted from crucible 20 is cut out in a direction orthogonal to its growth direction for use as a substrate for an optical device or a substrate for an electronic device.
However, Si in GaAs melt 27 has a segregation coefficient less than or equal to 1 relative to GaAs crystal 28, and is thus incorporated into GaAs crystal 28 only in a concentration lower than the Si concentration in GaAs melt 27 due to a segregation phenomenon. Therefore, the Si decrease amount in GaAs melt 27 is less than the amount of decrease of GaAs melt 27, so that the Si concentration in GaAs melt 27 increases as GaAs crystal 28 grows. Accordingly, the Si concentration in GaAs crystal 28 increases gradually from its lower side to its upper side, which causes variations in impurity concentration among a plurality of substrates cut out from a single GaAs crystal 28.
On the other hand, Japanese Patent Laying-Open No. 2005-350295 (Patent Literature 1) discloses an apparatus in which a raw material as a semiconductor polycrystal is placed in a container arranged above a crucible, as shown in FIG. 7. In a crystal production apparatus 300 of FIG. 7, heaters 31a to 31e each generate heat, thereby creating a temperature gradient in the vertical direction in the crystal production apparatus. In this crystal production apparatus 300, a crucible 32 is heated with heaters 31a to 31c, so that a GaAs polycrystal in crucible 32 is melted. Then, the temperature of a GaAs melt 33 containing Si derived from the GaAs polycrystal decreases gradually from the lower side toward the upper side of crucible 32, so that Si-containing GaAs melt 33 placed in crucible 32 solidifies from the side (lower side) that is in contact with a seed crystal 34 to the upper side. On the other hand, simultaneously with the solidification of GaAs melt 33, a raw material 36 placed in a container 35 is melted from the lower side toward the upper side of container 35. Since a melt 37 derived from raw material 36 is dropped into Si-containing GaAs melt 33 located under a sealant 40, changes in Si concentration in the melt in the crucible along with crystal growth can be compensated for, as a result of which a GaAs crystal 38 having a uniform carrier concentration can be produced.
Japanese Patent Laying-Open No. 9-52788 (Patent Literature 2) discloses an apparatus in which a raw material is charged into a tapered-shape container arranged above a crucible. Also in this apparatus, a semiconductor polycrystal is melted from the lower side toward the upper side of the container simultaneously with crystal growth from the lower side toward the upper side of the crucible. Therefore, similarly to the apparatus disclosed in Patent Literature 1, changes in Si concentration in the melt in the crucible along with crystal growth can be compensated for by dropping of a melt of the raw material in the crucible.

Method and apparatus for producing semiconductor crystal, and semiconductor crystal