A novel electrophotographic photoreceptor and a method of preparation therof are disclosed. The photoreceptor is characterized in that the photosensitive layer contain a specific carbonate resin binder resin having a weight average molecular weight on not less than 200,000. The resin is preferably a polycarbonate resin which contains repeating units represented by the formula ##STR1## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are respectively and independently a hydrogen atom, a lower alkyl group, a halogen atom or an unsubstituted or substituted aromatic group; and R.sup.9 and R.sup.10 are respectively and independently a hydrogen atom, a lower alkyl group, an unsubstituted or substituted aromatic group, or form a ring or a carbonyl group together with the linking carbon atom. The method is characterized in that the photosensitive layer contains a polyocarbonate having a weight average molecular weight of not less than 200,000 as a binder resin and is formed by spray coating or spiral coating.

For photosensitive layers of the electrophotographic photoreceptor, inorganic photoconductive materials such as selenium, cadmium sulfide, zinc oxide, etc, have been generally used. However, they have defects. Selenium and cadmium sulfide are poisonous and they must be recovered after use. Selenium is inferior in heat resistance because it is crystallized by heat. Zinc oxide is inferior in moisture resistance and lacks printing durability. Therefore, many attempts are being made in development of new photoreceptors.
Recently, use of organic photoconductive materials for photosensitive layers of the electrophotographic photoreceptor has been studied and some of them now has come into practical use. Organic photoconductive materials have advantages in comparison with inorganic ones in that they are of light-weight, easily formable into a film and a photoreceptor and some of them can give transparent photoreceptor.
Although organic photoconductive materials have many such advantages, they are not widely used because they are inferior to inorganic ones in sensitivity and durability.
In the mean time, it was found that the so-called layered type photoreceptor comprising a charge generating layer and a charge transporting layer provided on an elctroconductive support is advantageous in enhancement of sensitivity and thus the layered type photoreceptor is the main stream of development, in which organic photosensitive materials have now come into use.
However, layered type photoreceptors now in practical use are inferior to inorganic photoreceptors in durability in particular. One of the elements which decide durability is physical properties. That is, organic photoreceptors are liable to suffer abrasion and scratching by development with toner, friction with paper, friction with a cleaning member (although load is different according to type of apparatuses), etc. Therefore, organic photoreceptors practically have only limited printing durability. In the layered type photoreceptor, it is generally the charge transporting layer that bears such load. A charge transporting layer usually comprises a binder resin and a charge transporting material and the strength of the layer depends on the binder. As the amount of the doped charge transporting material is considerably large, the layer is not provided with sufficient mechanical strength.
For charge transporting layers, polymers or copolymers of vinyl compounds such as styrene, vinyl acetate, vinyl chloride, acryl esters, methacryl esters, butadiene, etc. and thermoplastic and thermosetting resins such as polyvinylacetal, polycarbonate, polyester, polysulfone, poly(phenylene oxide), polyurethane, cellulose esters, cellulose ethers, phenoxy resins, silicon resins, epoxy resins, etc. are used as binders. Among many binder resins, polycarbonate resins have comparatively excellent properties and many kinds of polycarbonate resins have been developed and some are practically in use.
However, even these polycarbonate resins are still insufficient in abrasion resistance, scratch resistance, etc., especially in abrasion resistance when polycarbonate resins are used for the electrophotography and thus development of binder resins which are provided with excellent abrasion resistance is strongly desired.
The present invention was made in order to overcome the above-described problem and is intended to provide a binder resin which enables manufacturing of highly abrasion-resistant photoreceptors having excellent durability.
In this respect, we conducted an intensive study in search of binder resins which can provide durable electrophotographic photoreceptors and found that a particular polycarbonate resin having a weight average molecular weight of not less than 200,000.
In the mean time, photoreceptors are conventionally prepared by dip coating. For instance, a cylindrical substrate is dipped in a batch of a coating liquid. In this method, run (local flow-down) of the liquid on the coated surface is apt to occur. Also local nonuniformity in concentration of the coating liquid is caused in the batch. Thus it is difficult to form a coating layer of an even thickness. Generally, binder resins of higher molecular weights have higher viscosities and thus are liable to promote occurrence of the above-mentioned run and concentration nonuniformity. Generally, as the molecular weight of the binder resin increases, the viscosity thereof increases, and thus the coating liquid which contains the polycarbonate resin in accordance with this invention becomes viscous. Such a viscous coating liquid easily develop concentration nonuniformity and bubbling and that the once caused concentration uniformity and bubbles will not be remedied. The means to solve this problem is to reduce the solid content of the coating liquid. However, if the coating is effected with a coating liquid with a low solid concentration, the above-mentioned run is easier to occur when a cylinder is coated by dip coating since the solvent content in the wet coating is large. Therefore, it is not easy to form a photosensitive layer of even thickness from the coating liquid containing the polycarbonate resin having a weight average molecular weight not less than 200,000.
Thus we conducted an intensive study concerning method for forming photosensitive layer of uniform thickness from the above described polycarbonate resin of the present invention and found that spiral coating or spray coating is effective.

Electrophotographic photoreceptor containing polycarbonate resin as a binder and method for preparation thereof


An evaporation donor substrate that makes it possible to evaporate only a desired evaporation material in the case of performing deposition by an evaporation method. Thus, the use efficiency of an evaporation material can be increased resulting in reduction in production cost, and further a film with high uniformity can be deposited. The evaporation donor substrate can be obtained by forming a reflective layer having an opening over a substrate, forming a thermal insulation layer having a light-transmitting property separately over the substrate and the reflective layer, forming a light absorption layer over the thermal insulation layer, and forming a material layer over the light absorption layer.

1. Field of the Invention
The present invention relates to an evaporation donor substrate used for deposition of materials that can be deposited by an evaporation method, a method for manufacturing the evaporation donor substrate, and a method for manufacturing a light-emitting device using the evaporation donor substrate.
2. Description of the Related Art
Light-emitting elements using an organic compound as a light emitter, which are characterized by thinness, lightweight, fast response, and direct current low voltage driving, have been expected to be applied to next-generation flat panel displays. In particular, display devices in which light-emitting elements are arranged in matrix have been considered to be superior to conventional liquid crystal display devices in terms of a wide viewing angle and good visibility.
It is considered that the light emission mechanism of a light-emitting element is as follows: when a voltage is applied between a pair of electrodes with an EL layer interposed therebetween, electrons injected from the cathode and holes injected from the anode are recombined in the light emission center of the EL layer to form molecular excitons, and energy is released to emit light when the molecular excitons relax to the ground state. A singlet excited state and a triplet excited state are known as the excited states, and it is thought that light emission can be obtained through either of the excited states.
An EL layer included in a light-emitting element has at least a light-emitting layer. In addition to the light-emitting layer, the EL layer can have stacked layers of structure including a hole-injecting layer, a hole-transporting layer, an electron-transporting layer, an electron-injecting layer, and the like.
EL materials for forming an EL layer are broadly classified into a low molecular (a monomer) material and a high molecular (a polymer) material. In general, a low molecular material is often deposited by an evaporation method and a high molecular material is often deposited by ink-jet or the like.
An evaporation apparatus that is used in an evaporation method includes a substrate holder onto which a substrate is mounted; a crucible (or an evaporation boat) containing an EL material, that is, an evaporation material; a heater for heating the EL material in the crucible; and a shutter for preventing the EL material from being scattered during sublimation. The EL material that is heated by the heater is sublimed and deposited on the substrate.
Note that in order to achieve uniform deposition, actually, a deposition target substrate needs to be rotated and the substrate and the crucible need to be separated from each other by at least a certain distance. In addition, when films of different colors are separately formed using a plurality of EL materials through a mask such as a metal mask, it is necessary that the distance between pixels be designed to be large and that the width of a partition wall (bank) formed of an insulator between the pixels be large. Such needs are major problems in advancing miniaturization of display pixel pitches along with higher definition (an increase in the number of pixels) and reduction in size of a light-emitting device including a light-emitting element.
Therefore, in order to achieve higher definition and higher reliability of flat panel displays, it has been required to solve those problems as well as to achieve high productivity and cost reduction.
Thus, a method for forming an EL layer of a light-emitting element through laser thermal transfer has been proposed (see Reference 1: Japanese Published Patent Application No. 2006-309995). Disclosed in Reference 1 is a transfer substrate in which a photothermal conversion layer including a low reflective layer and a high reflective layer and a transfer layer are provided over a supporting substrate. Irradiation of such a transfer substrate with laser light allows the transfer layer to be transferred to an element forming substrate.
However, in the transfer substrate of Reference 1, the high reflective layer and the low reflective layer are stacked on one side of the substrate. Therefore, even with the use of the high reflective layer, some heat absorption cannot be avoided. Thus, when the energy of the laser light is large, not only a portion of the transfer layer over the low reflective layer but also a portion of the transfer layer over the high reflective layer may be transferred.
In addition, in the structure illustrated in FIG. 3 of Reference 1, as also described in paragraph [0041], the low reflective layer and the high reflective layer must be formed with no space therebetween, which requires highly accurate patterning.
Furthermore, in the structure illustrated in FIG. 7 of Reference 1, the low reflective layer is patterned, the high reflective layer is then formed over the entire surface, and after that, the transfer layer is formed. In this structure, heat from the low reflective layer that is heated by absorbing laser light is transferred to the transfer layer through the high reflective layer. Thus, not only a desired portion of the transfer layer but also a portion of the transfer layer around the desired portion may be transferred.

Evaporation donor substrate, method for manufacturing the same, and method for manufacturing light-emitting device

Semiconductor Energy Laboratory Co., Ltd.


A wheel end (A) has a housing (2, 70, 80, 90) and a hub (4) provided with a spindle (32) that projects into the housing, and the hub rotates relative to the housing on an antifriction bearing (6) located between the housing and hub spindle. The housing has a tubular core (12, 72, 82, 92) that encloses the bearing and ring mounts (14, 74, 84, 94) spaced outwardly from the core and also webs (16,76,86,96) that connect the ring mounts to the core. A road wheel (B) is attached to the hub and rotates with the hub relative to the housing. The housing is secured to a suspension upright (C) at its ring mounts. The core deflects relative to the ring mounts, owning to forces and moments transferred through the bearing from the suspension upright to the road wheel and vice versa, and the magnitude of those forces and moments are reflected in signals derived from strain sensor modules (SM) attached to the webs of the housing.

Dynamic control systems for automotive vehicles operate the brakes and torque distribution systems on such vehicles so as to enhance driving comfort, vehicle stability and safety. These systems rely on wheel loads for control, but obtaining wheel loads accurately, reliably and at a reasonable cost has proven to be a challenging task for engineers. Great effort has been made over the years, and various means have been proposed. One example includes a magnetic sensor having a sensing component attached at the end of an arm, the other end of which is fixed to a suspension system component. The sensor monitor is a magnetic material molded into the sidewall of a tire. Another example is a wheel end with a non-rotating section and a rotating section. At least one sensor is attached to the non-rotating section to measure the distance between the non-rotating and rotating sections.
The above mentioned methods of load sensing in general are not very accurate or reliable and are susceptible to changes in environmental conditions. What is needed is an wheel bearing with improved load sensing capability.

Wheel end with load sensing capabilities


A motor vehicle clutch hand control for the assistance of handicapped drivers, especially those handicapped in the lower limbs, is provided. The system includes a hand control valve mounted on the gear shift lever for operating a piston controlling the position of the clutch pedal and thereby engaging and disengaging the clutch, an air storage cylinder pressurized to provide operating air for the control system, an air distribution system for transmitting commands from the hand control to the clutch pedal air operated piston and a means for recharging the pressurized air storage cylinder. The hand control system may be employed in any motor vehicle with a mechanical gear box.

1. Field of the Invention
The invention relates to operating the clutch pedal for a motor vehicle having a manual transmission by handicapped drivers who have lost the functional mobility of the lower extremities.
2. Description of the Related Art
Conventional motor vehicles in corporate foot controls, a typical motor vehicle with an automatic transmission having accelerator and brake pedals and a manual transmission having accelerator, brake and clutch pedals. To permit operation by handicapped persons having restricted or no use of their legs, such vehicles may be fitted with hand controls which permit hand operation of the accelerator and brake pedals, however there are no similar hand controls for hand operation of the clutch pedal. Handicapped persons are normally restricted to the use of automatic transmission vehicles.
The majority of hand controls which have been considered previously utilize systems of levers and push rods of varying complexity, and are installed in the motor vehicle in various ways
In U.S. Pat. No. 5,666,857 issued to Sebazco in 1997 is disclosed a steering and braking control system. This invention provides a means to brake a car without use of the brake pedal, and does not address the activation of a clutch. U.S. Pat. No. 5,662,002 issued to Venturini in 1997 discloses a control device mounted within the steering wheel for control of acceleration and braking. This device is not used for operating the clutch or clutch pedal. This device uses levers in the steering wheel which activate electrical controls for control of the automobile.
U.S. Pat. No. 5,603,674 issued in 1997 to Rivas discloses a set of vehicle controls for brake, clutch and accelerator pedals. The accelerator control is mounted on the steering wheel and the brake and clutch controls are mounted on the gear shift level. Signals are transmitted electrically from the control to a motor with a wire-free connection to operate the pedal. This patent uses an electronic control unit to send a signal to an electrical motor which then operates a which to move selected pedal. Chang in U.S. Pat. No. 5,363,946 issued in 1994 discloses a system for automatic operation of a clutch pump in place of a conventional clutch pedal. This invention uses compressed air to operate a clutch pump which directly operates the clutch and eliminates the use of the clutch pedal. Lenz in U.S. Pat. No. 5,129,492 issued in 1992 demonstrates a hand control device mounted on the steering column, but which controls only the acceleration and braking systems. This invention does not operate the clutch.
Parson's U.S. Pat. No. 5,038,901 issued in 1991 discloses a clutch control system which is activated by control of the gear shift level. When pressure is applied to the gear knob control an electrical signal is sent to the clutch control automatically disengaging the clutch. A second electrical signal is sent when the new gear is selected and the clutch is again engaged. This invention operates directly on the clutch and does not operate the clutch pedal. U.S. Pat. No. 5,012,689 by Smith issued in 1991 discloses a apparatus for depressing a foot pedal. The operator sends an electrical signal to a motor which moves a rod connected to the pedal and the rod moves the pedal. This invention is mounted on the floor directly under the driver and connected to the seat. It uses electrical and mechanical means to move the pedals.
U.S. Pat. No. 4,790,177 by King 1988 discloses a shifting control for an automated manual transmission shifter. This invention relates to an electronic control system and does not address the actual moving of the vehicle pedals. Reichenberger's U.S. Pat. No. 4,078,628 issued in 1978 discloses a double wheel control system for controlling brake pedal and accelerator pedal, however it does not address the clutch pedal.


A control rod handling apparatus and method for exchanging a control rod connected to a control rod drive mechanism by a bayonet coupling. The control rod handling apparatus comprises a member or connection to a fuel exchange apparatus, a fixing part having guides to be seated at the top face of an upper grid plate in a reactor vessel and to e supported by the upper rid plate, a body provided at the lower part of the fixing part, a control rod handling part having a control rod grasping instrument provided at the bottom part of the body, a fuel support piece handling part having a fuel support piece grasping instrument and means for positioning the fuel support piece grasping instrument, which is provided outside the control rod handling part, means for vertically moving the fuel support piece handling part along with the outside of the control rod handling part, and means for rotating the control rod handling part, the fuel support piece handling part, and the means for vertical motion.

(1) Field of the Invention
The present invention relates to an apparatus and a method for control rod exchange work during the regular inspection of a nuclear power plant using a boiling water reactor (referred to BWR), and more particularly an apparatus and a method for attaching or taking off a control rod (referred to CR), and for easily handling a fuel support piece (referred to FS).
(2) Description of the Prior Art
Conventionally, the spud coupling is used for connecting a CR and a control rod drive mechanism (referred to CRD) in a BWR. In the CR exchange work, such fittings as described in Japanese Patent Laid-Open No. 103399/1981 were presented.
However, in a BWR where the above-mentioned spud coupling is adapted, there is the possibility that the connection between a CR and a CRD is disconnected for some reason during plant operation. If such disconnection takes place during plant operation, normal power control become impossible and it is needed to shut down the plant operation.
The bayonet coupling is a way solving the above-mentioned problem of the CR-CRD disconnection. In the work of exchanging a CR to which the bayonet coupling is applied, a coupling socket, namely, a CR must be rotated by a predetermined angle for disconnecting the connection. Then, it is necessary to provide an apparatus for rotating a CR in the work of exchanging a CR to which the bayonet coupling is applied. A method for exchanging a CR to which the bayonet coupling is applied was proposed in Japanese Patent Laid-Open No. 205795/1990. In this method, after a FS is taken out above the upper grid plate by using an exclusive handling equipment for a FS, the CR is grasped by use of a CR handling apparatus attached to a fuel exchange apparatus, disconnected from the CRD by rotation and taken out above the upper grid plate by a subsidiary hoist of a fuel exchange apparatus. In attaching a new CR, the CR is connected to the CRD by using the above-mentioned CR handling apparatus in reverse procedures to the above-mentioned procedures and the FS is attached to a reactor core support plate by using an exclusive handling equipment for a FS. This prior art premises that the FS is taken out by the exclusive handling equipment for a FS. Therefore, in applying the prior art, many steps such as attaching or taking off the exclusive handling equipment for a FS and the CR handling apparatus to or from the subsidiary hoist, winching up or down the exclusive handling equipment for a FS and the control rod handling apparatus into or out of the reactor core and so forth are needed, which brings about much time consuming work.

Apparatus and a method for handling a control rod


A refrigeration system is disposed within a refrigerator having a freezer compartment and a refrigeration compartment. The refrigeration system includes an evaporator having an inlet and an outlet. A damper is positioned so as to direct air flow into the freezer compartment or the refrigeration compartment and correspondingly block air flow to the other. A compressor is coupled to the evaporator via a conduit and a control valve is coupled to the inlet of the evaporator to control flow of refrigerant. A condenser is coupled to the control valve by a liquid line. A first temperature sensor is positioned so as to detect refrigerant temperature within the evaporator and a second temperature sensor is positioned so as to detect refrigerant temperature at the outlet of the evaporator. A first controller is coupled to the control valve and to the first and second temperature sensors to receive temperature signals therefrom. A second controller is coupled to the compressor to provide compressor signals thereto and to the damper to send damper signals thereto. The first controller controls the duty cycle of the control valve.

This application relates to refrigeration systems and in particular relates to refrigeration expansion control for vapor compression refrigeration cycles.
Household refrigerators typically operate on a simple vapor compression cycle. Such a cycle typically includes a compressor, a condenser, an expansion device, and an evaporator connected in series and charged with a refrigerant. The evaporator is a specific type of heat exchanger which transfers heat from air passing over the evaporator to refrigerant flowing through the evaporator, thereby causing the refrigerant to vaporize. The cooled air is then used to refrigerate one or more freezer or fresh food compartments.
In conventional single-evaporator refrigerators, since the freezer compartment and the fresh food compartment are simultaneously cooled with one evaporator, the temperature of the evaporator must be maintained at a temperature lower than about -18.degree. C., which is typically the temperature of the freezer compartment. Accordingly, an evaporator with a lower temperature than is necessary is used to cool the fresh food compartment, causing the efficiency of the overall system to be relatively low.
In an attempt to address this problem, some conventional refrigerators are designed so that the cool air of the freezer compartment and that of fresh food compartment are completely separated, and an evaporator is provided in both the freezer compartment and the fresh food compartment. Since an additional evaporator is needed, however, the manufacturing cost of the refrigerator is increased and the capacity of the refrigerator is reduced.
Other conventional refrigerators require at least two capillary tubes to control expansion. Each capillary tube is preceded in the refrigerant flow path by an electrically activated valve in order to control liquid discharge from the condenser to selectively flow through one of the capillary tubes. An air flow direction control scheme directs air flow to and from the sole evaporator to be either fresh food or freezer compartment air. When the air flow coupling is with the fresh food compartment (about 5.degree. C.) the refrigerant operates at a relatively high evaporator saturation temperature and when the air flow coupling is with the freezer compartment (about -15.degree. C.), the refrigerant operates at a relatively lower saturation temperature.
Higher evaporator refrigerant saturation temperature is desirable since the higher the saturation temperature, the greater the obtainable cycle efficiency. The cycle efficiency, however, will only be greater for higher temperatures if the evaporator exit state is such that the refrigerant is substantially a saturated vapor. Accordingly, this is the purpose for two switchable capillary tubes. A higher evaporator saturation temperature produces a high pressure, thus a higher vapor density, thereby generating a greater compressor mass flow rate. To support a higher compressor mass flow rate, a less restrictive capillary tube is required. This system will work satisfactorily near operating conditions for which the capillary tubes were optimized. At off design conditions, the evaporator exit state will be either a vapor quality or superheat and cycle efficiency will be lower.
Therefore, it is apparent from the above that there exists a need in the art for a simplified refrigeration expansion control. It is the purpose of this invention to fulfill this and other needs in the art in a manner more apparent to the skilled artisan once given the following disclosure.


Various aspects as described herein are directed to piezoelectric materials. As consistent with one or more embodiments, an apparatus includes a nanomaterial and structures coupled to the nanomaterial. This nanomaterial-structure combination manifests piezoelectric characteristics, via the combination. In certain implementations, neither the nanomaterial nor the coupled structures independently exhibit piezoelectric characteristics, yet do so in combination.

Advances in nanoscale fabrication are leading to remarkably innovative devices for electronics, photonics, energy harvesting, and other applications. Microelectromechanical systems (MEMS) are being extended to the nanoscale (NEMS) in the context of nanosized actuators, motors, robots, and locomotive devices.
A challenge with these technologies relates to dynamically controlling motion and deformation at the nanoscale level. Piezoelectric materials have been used for dynamical control of material deformation by the application of an external electromagnetic field, in a wide variety of applications from pressure sensors to acoustic transducers to high voltage generators. Piezoelectricity is traditionally thought to be an intrinsic property of a particular material phase, for example, wurtzite structure.
However, many piezoelectric materials are limited in application due to one or more of composition, size and relatively limited interactivity variation.

Piezoelectric apparatuses, systems and methods therefor

The Board of Trustees of the Leland Stanford Junior University


The present invention relates to a drone controller capable of controlling a movement and a rotation of a drone. The present invention discloses a drone controller capable of controlling a rotation and a movement of a drone, the drone controller including: a main body which is formed in a cylindrical shape and may be held by a user with one hand; a lever which is disposed at one side of the main body, formed such that the user's finger may be inserted into the lever, and operated to move the drone in front and rear directions or left and right directions; and a button unit which is disposed at a predetermined portion of the main body, and operated so that the drone may be rotated.

A drone or unmanned aerial vehicle (UAV) refers to a flight vehicle that flies by being operated in a wireless manner without a human aboard. A multi-copter drone has been initially developed for the military purpose, but because of convenience in transportation and storage, the drone is widely used to capture videos for broadcasting, and recently, the drone (unmanned flight vehicle) becomes commercially available. Because a fuselage of the drone is light in weight, the drone is conveniently and quickly carried and has excellent economic feasibility, and as a result, the drone is utilized for aerial photography, low-altitude reconnaissance patrol, and the like.
In addition, the drone is utilized in various fields in order to capture videos by using a camera at a location which it is difficult for a human to access, or to deliver an object by loading the object on the drone and moving the drone. In addition, a number of researches are being conducted to use the drone for monitoring disasters and transporting products.
Recently, the drone is in the limelight even in leisure and sports fields in which general users carry the drones and use the drones for aerial photography by using cameras. The drone becomes light in weight and small in size in comparison with the related art, and in some instances, a high-performance small camera is mounted on the drone.
Since the drone is an unmanned flight vehicle without a human aboard, the drone is operated by receiving operating signals in a wireless manner from a user typically on the ground surface. The most of the drones up to now are operated by manual operations that require a manipulation of a human.
However, a controller in the related art for operating the drone is typically controlled by the user in a state in which the user holds the controller. In addition, it is difficult to operate the drone, which causes a high barrier to use the drone. For this reason, the drones are classified in terms of type into beginner, intermediate, and expert levels and one sale. In addition, the drone uses spend much time to operate the drones in order to operate the drone well.
However, as the utilization field of the drone is expanded to the leisure and sports fields, there is a need for a drone controller that enables a user with no training in operating the drone to more conveniently and intuitively operate the drone.


An anti-tamper module is provided for protecting the contents and functionality of an integrated circuit incorporated in the module. The anti-tamper module is arranged in a stacked configuration having multiple layers. A connection layer is provided for connecting the module to an external system. A configurable logic device is provided for routing connections between the integrated circuit and the connection layer. Specifically, the configurable logic device is programmable to create logical circuits connecting at least one of the input/output connectors of the integrated circuit to at least one of the input/output connectors of the connection layer. Configuration information for programming the reconfigurable logic device is stored in a memory within the module.

Maintaining technological advantages over an opponent is often a critical factor for success both in the business world and on the battlefield. These advantages become difficult to maintain once the opponent gains access to the technology. For example, a business competitor may obtain an early version of a new product to examine it in order to identify its key features and functionality. Similarly, a military vehicle or weapon may be lost into enemy hands. The enemy can then examine the electrical components in an effort to understand features and functionality of the vehicle or weapon in order to devise technology to defeat the vehicle or weapon in the future.
Custom made devices are often the most difficult to analyze. However, increasing demands to reduce both development time and overall costs have led to an increased reliance on off-the-shelf components to implement devices. The use of off-the-shelf components gives an opponent a head start at examining the device since the features and functionality of the individual components are easily obtained. Additionally, conventional techniques for arranging the components within a device often facilitate visual identification of both the individual components and many of the connections between the components.
Accordingly, a need exists to develop anti-tamper technology that inhibits the ability of an opponent to examine and/or reverse engineer sensitive devices to learn key features and functionality. This need has been increased due to a directive issued by the United States government that critical designs in military applications must be tamper proof.


According to the preferred embodiment of the present invention, an improved resistor and method of fabrication is provided. The method for fabricating a resistive element into an integrated circuit semiconductor device comprises the steps of: depositing a dielectric film, such as silicon nitride; depositing a titanium film upon the dielectric film; and annealing the titanium and dielectric films. This causes titanium to be diffused into the dielectric film. This creates a resistive element having a relatively high resistivity. The preferred embodiment method has the advantage of being easily integrated into conventional integrated circuit fabrication techniques.

1. Technical Field
This invention generally relates to semiconductor devices, and more specifically relates to fabricating resistors in semiconductor devices.
2. Background Art
The use of integrated circuits has spread to all types of products for many types of uses. These integrated circuits contain a wide variety of components, such as field-effect transistors, bipolar transistors, etc. Some of the necessary but also the more difficult and space intensive components to fabricate are resistive elements or resistors.
The types of resistors which can be fabricated in integrated circuit (I.C.) processing can be classified into three categories: (1) diffused resistors; (2) field effect resistors, and (3) thin-film resistors.
Diffused resistors are created by doping the semiconductor device with n or p type materials and annealing the semiconductor device. The resistance of the diffused resistor depends upon the length, width, depth of the diffusion and resistivity of the diffused material. The resistivity of the diffused material is dependent upon the dopant and junction profile of the dopant species after a high temperature anneal.
Field-effect resistors are transistors used in depletion-mode and modulated by the implantation that controls the threshold voltage of the transistors.
The diffused resistor and field-effect resistor each have the advantage of being easily integrated into the I. C. fabrication process. However, these types of resistors also have numerous disadvantages. Specifically, these types of resistors are usually limited in resistance and tolerance because the parameters controlling these resistances are the same parameters that must optimized for device performance. Thus, only low resistances are available with practical I.C. diffusion structures or field effect transistors. Additionally, the diffused resistors have the drawback of requiring excessive space on the I. C., a serious disadvantage as the size of I.C.s continues to shrink.
Conversely, the third category of resistors, thin film resistors, are typically resistive metal films which are deposited upon dielectric materials such silicon dioxide (SiO.sub.2). These thin film resistors have the advantage of sparing critical area upon the silicon (Si) substrate. Unfortunately, these resistors are typically produced only in Back-End-Of-Line (BEOL) processing and are thus limited in application.
There are several metallic films that can be used in thin film resistors with relatively high impedance (1000-10,000 ohms/sq.). For example, thin film resistors can be created using metals such as cermets (Ni/Cr, Cr/SiO.sub.2) and rhenium. Unfortunately, these resistor materials are not commonly used in standard VLSI processing, and thus are difficult and costly to implement into the fabrication process. Additionally, the required metallurgical contact to these resistors as well as to Si devices may require different materials which may be incompatible in Si device processing.
Thus, the prior art suffers from the inability to make small and easy to manufacture resistors in I.C. processing. Therefore, what is needed is improved resistors capable of offering high resistance which can be easily integrated into conventional processing methods.

Method for fabricating a titanium resistor

International Business Machines Corporation


A LED light assembly configurable in a plurality of manners to offer various ornamental appearances. The LED light assembly of the present invention includes at least one core mounting member wherein the core mounting member further includes an inner engagement section formed proximate the upper opening thereof. The inner engagement section includes a wall and a bottom formed to mateably receive a shade member. A plurality of connection members are secured above the inner engagement section and are aligned so as to facilitate an electrical connection between pins of a LED light integrally formed with a shade member that is operably coupled to the core mounting member. The present invention further includes a plurality of connection members that are operably coupled to the core mounting member so as to assemble a plurality of core mounting members to create a desired ornamental appearance of the LED light assembly.

LED lights and lighting apparatus are known in the art. Over the last decade numerous designs and applications for LED lights have been introduced as the market demand has increased. LED lights are typically low voltage lights but can also be powered by conventional alternating current voltage. There are a plurality of power connection configurations for existing LED light assemblies that include configuration such as direct power or pin contact with printed circuit boards.
The aforementioned pin contact with printed circuit boards are employed for various LED light applications. One problem with existing configurations is the LED light must be installed properly in order to ensure the pins do not engage the power strip having opposite polarity. Many conventional assemblies are labeled to provide warning of the correct installation but do not provide any additional assistance. Furthermore, most conventional LED assemblies are fixed in their layout and not configurable. By way of example but not limitation, there are no LED lamp style light assemblies that provide a user a technique or alternate method of changing the configuration of the light assembly.
It is intended within the scope of the present invention to provide a led light assembly that is modular in manner wherein there are various configurations available for the light assembly and furthermore provides a structure that facilitates operable connection with the LED light and the power source wherein the connection ensures a proper polarity connection.


In a liquid crystal display apparatus, a pair of substrates has surfaces which is so arranged as to be opposed to each other. The one of the opposed surfaces has a display region in which pixels are arrayed in a matrix. A liquid crystal layer is held between the opposed surfaces of the pair of substrates. A first shading portion is arranged to surround the display region. A second shading portion is arranged between the first shading portion and an outer peripheral end of the one of the substrates, and is formed as discontinuous segments.

A liquid crystal display panel is mounted on each of various electronic apparatuses in view of benefits such as a light weight and low power consumption. The liquid crystal display panel comprises an array substrate and a counter substrate opposed to each other, and a liquid crystal layer held between a pair of the substrates. First motherboards which serve as a plurality of array substrates are bonded to second motherboards which serve as a plurality of counter substrates so as to be opposed to each other, the motherboards are cleaved along a cleavage line, and the liquid crystal display panel is thereby cut out.
Recently, narrowing a frame region surrounding a display screen has been required in accordance with downsizing and weight reduction of an electronic apparatus. As the frame region is narrower, a distance between an end of the display screen and an end of the liquid crystal display panel is shorter, a light beam entering the frame region is diffracted to a display region side and visually recognized by a user, and display quality is thereby deteriorated.


Various techniques are disclosed for improving packet loss concealment to reduce artifacts by using audio character measures of the audio signal. These techniques include attenuation to a noise fill instead of attenuation to silence, varying how long to wait before attenuating the extrapolation, varying the rate of attenuation of the extrapolation, attenuating periodic extrapolation at a different rate than non-periodic extrapolation, and performing period extrapolation on successively longer fill data based on the audio character measures, adjusting weighting between periodic and non-periodic extrapolation based on the audio character measures, and adjusting weighting between periodic extrapolation and non-periodic extrapolation non-linearly.

Traditionally, voice and video conferencing systems have predominantly communicated over reliable networks such as the Plain Old Telephone Service (POTS), Integrated Services Digital Network (ISDN), or custom intranets. Increasingly, as people set up remote and home offices, voice and video conferencing systems are connecting over unreliable networks such as wireless networks or the public Internet. In such networks, packet loss and delay occur, sometimes at substantial levels. The effect is that audio packets do not arrive at their destined conferencing systems. In order to prevent the listener from hearing an audio drop out, typically a conferencing system will use some form of packet loss concealment (PLC).
PLC algorithms, also known as frame erasure concealment algorithms, hide transmission losses in an audio system where the input signal is encoded and packetized at a transmitter, sent over a network, and received at a receiver that decodes the packet and plays out the output. Many of the standard CELP-based speech coders, such as International Telecommunication Union Telecommunication Standardization Sector (ITU-T) Recommendations G.723.1, G.728, and G.729, have PLC algorithms built into their standards. ITU-T Recommendation G.711, Appendix I describes a PLC algorithm for audio transmissions. G.711-encoded audio data is sampled at 8 KHz, and is typically partitioned into 10 ms frames (80 samples). Other encodings, packet sizes, and sampling rates may be used.
The objective of PLC is to generate a synthetic speech signal to cover missing data (erasures) in a received bit stream. Ideally, the synthesized signal will have the same timbre and spectral characteristics as the missing signal, and will not create unnatural artifacts. Since speech signals are often locally stationary, it is possible to use the signals' history to generate a reasonable approximation to the missing segment. If the erasures are not too long, and the erasure does not land in a region where the signal is rapidly changing, the erasures may be inaudible after concealment.
The most popular PLC algorithms extrapolate from earlier pulse-code modulation (PCM) audio samples to synthesize a replacement for the lost audio packet. Two types of extrapolation are common: periodic extrapolation (PE) and non-periodic extrapolation (NPE). These two extrapolation techniques can also be used together, using a weighted sum technique.
FIG. 1 depicts one technique 100 for periodic extrapolation according to the prior art. This technique is often used for extrapolating audio segments that have periodic elements. During normal operation, the receiver decodes the received good packet or frame and sends its output to the audio port. To support PLC, a circular history buffer is typically provided to save a copy of the decoded output. The buffer is used to extract waveforms for performing the PLC.
A common PLC technique is to extrapolate new audio from the old audio for a fixed period. If the packet loss continues after the fixed period, the extrapolated audio will be attenuated to silence. Holding certain types of sounds too long without attenuation may create strange artifacts, even if the synthesized signal segment sounds natural in isolation. The extrapolated audio, attenuation, and silence become the outputs of the PLC technique.
The simplest way to extrapolate from good audio to conceal packet losses is to take the last cycle or frame of the periodic audio from the circular buffer and repeat it, as shown in box 110. While repeating a single cycle works well for short losses, on long erasures the technique eventually sounds artificial and may introduce unnatural harmonic artifacts (beeps), particularly if the erasure occurs in an unvoiced region of speech, or in a region of rapid transition such as a stop. Therefore, a PLC technique typically repeats one cycle for a fixed length of time, such as 10 ms, then starts to repeat two cycles of audio from the last audio frame as shown in box 120. After another fixed length of time, such as another 10 ms, the PLC algorithm may switch to repeating three cycles, as shown in box 130. Although the cycles are not played in the order they occurred in the original signal, the resulting output generally still sounds natural. The length of time used for each of the one cycle, two cycle, and three cycle repetitions is represented as the switch rate 140 in FIG. 1 and is always fixed in the prior art.
The output of FIG. 1 is PE. The total extrapolation output of PLC is typically generated as a weighted sum of PE and NPE components, where NPE is the non-periodic extrapolation. One prior art technique for generating NPE is shown in FIG. 2. In this technique, a noise generator 210 generates noise that is shaped by a shaping filter 220 to produce the NPE. This extrapolation technique works reasonably well on audio segments that have non-periodic elements.
Ideally PLC would create such natural audio that the listener is unaware of the packet losses. In practice, however, the use of PLC often results in audio artifacts. The dominant artifact may be described as a buzziness. Another artifact typically heard could subjectively be described as a choppiness. As the network packet loss rate increases, the artifacts become ever more objectionable.

Artifact reduction in packet loss concealment


A phase detector is comprised of two cross-coupled gates which are capable of phase discrimination down to a level of approximately 10 picoseconds. An arbiter circuit, responsive to the cross-coupled gates, generates mutually exclusive UP and DOWN pulse signals. The UP and DOWN pulse signals may be filtered and used to control the delay line of an all digital delay locked or phase locked loop.

1. Field of the Invention
The present invention is directed to phase detectors and, more particularly, to phase locked and delay locked loops comprised of all digital components.
2. Description of the Background
A phase locked loop is a circuit designed to minimize the phase difference between two signals. When the phase difference approaches zero, or is within a specified tolerance, the phase of the two signals is said to be "locked". A delay locked loop is similar to a phase locked loop, but instead of producing an output signal which has the same phase as an input or reference signal, the delay locked loop passes a reference or input signal into a delay line, and the output of the delay line has some predefined phase delay with respect to the reference or input signal.
Phase locked loops (PLL's) and delay locked loops (DLL's) are widely used circuits where it is necessary to have two signals which have a known relationship to one another. For example, when transmitting information from a sending device to a receiving device, it is necessary to have the local clock of the receiving device in sync with the clock of the sending device so that the information can be reliably transmitted. A PLL may be used for that purpose. Both PLL's and DLL's have been used for a long period of time, and numerous analog examples of these circuits can be found in the literature and in many devices.
A phase detector is a very important part of a PLL or DLL. The phase detector is used to provide phase discrimination and generate a control signal which is then used to speed up or slow down the local signal so that a desired relationship between the local signal and the reference signal is obtained.
FIG. 1 illustrates an analog prior art circuit used to produce a control signal Vc which is input to a voltage controlled oscillator (not shown) or voltage controlled delay line (not shown) to either advance or retard the phase of output signal Vo. The output signal Vo produced by the voltage controlled oscillator or voltage controlled delay line is then fed back to the phase detector 10. The phase detector also receives a reference signal Vref. The phase detector may be implemented by an edge-triggered D-type flipflop or an RS latch. Those devices generate an UP/DOWN signal having a pulse width that is proportional to the phase difference between the two signals. The UP/DOWN signal can then be used to control a charge pump circuit 12. The output of the charge pump circuit 12 is fed into a loop filter 13, which integrates and generates the analog voltage Vc used to control the voltage controlled oscillator or voltage controlled delay line.
FIG. 2 illustrates the relationship between the signals Vref, Vo and the UP/DOWN signal of FIG. 1. FIG. 2 illustrates the situation when the loop is close to "lock." Under those conditions, the pulse width of the UP and DOWN signals is narrow.
PLL's and DLL's are used in a variety of devices where the PLL or DLL can be constructed of all digital components. The all-digital approach has the benefits of being portable and scalable for other processes and applications. For example, all digital implementations of PLL's and DLL's are needed for such complex circuits as memory devices. The system clock of certain types of memory devices needs to be in sync with, for example, data so that data may be reliably written to or read from the memory. PLL's and DLL's are also needed when transferring data within the memory device to insure, for example, that data read out of the memory is properly presented to output pads.
A problem occurs when traditional phase detectors are used for all digital PLL's and DLL's. For all digital loops, there is no integration of the UP/DOWN signal as occurs in analog loops. As a result, mutually exclusive signals are needed to control all digital loops. More specifically, the UP signal and DOWN signal cannot occur at the same time. Furthermore, the control signals need to be well-defined digital pulses even when the loop is close to "lock" to insure that the appropriate action is taken. Thus, the need exists for a phase detector suitable for use in all digital PLL's and DLL's which can reliably produce control signals even when the loop is close to locked conditions.

This patent is subject to a terminal disclaimer.

Phase detector for all-digital phase locked and delay locked loops


A protective circuit board for a battery pack for controlling charge and discharge states of the battery pack includes an insulation layer and a first signal pattern disposed inside the insulation layer. The circuit can further include a second signal pattern disposed inside the insulation layer. The circuit can include a first dummy pattern spaced from a first side of the first signal pattern and a second dummy pattern spaced from a second side of the first signal pattern.

a. Technical Field
The present invention relates to a protective circuit board for a battery pack, and more particularly to a protective circuit board for a battery which minimizes the influence of external electromagnetic waves and static electricity.
b. Description of Related Art
In general, a protective circuit board for a battery pack controls charge and discharge states of the battery pack and interrupts the current of the battery pack when it is overcharged or over-discharged to protect the battery pack and the user.
The structure of a protective circuit board will now be described briefly with reference to FIG. 1.
As shown, a conventional protective circuit board includes an insulation layer 10, at least one conductive first signal pattern 20 formed on a surface of the insulation layer 10 or on the opposite surface, at least one second signal pattern 30 formed on a surface of the insulation layer 10 or on the opposite surface, at least one conductive via 40 for electrically connecting the first and second signal patterns 20 and 30 to each other, and various electronic components 50, such as semiconductor ICs, switches, and/or LEDs, mounted on the first or second signal pattern 20 or 30.
Battery packs having a protective circuit board mounted thereon are frequently exposed to extreme conditions. For example, they are usually used at a place where severe electromagnetic waves occur or are exposed to naturally generated static electricity. Such electromagnetic waves or static electricity generally affect various electronic components on the protective circuit board. Particularly, noise or static electricity may act on the electronic components along first or second signal patterns formed on the surface of the protective circuit board.
The larger the length or area of the first or second signal patterns are, the more likely it is that electromagnetic waves or static electricity will flow towards the electronic components along the first or second signal patterns. As a result, conventional battery packs frequently malfunction as various electronic components fail to operate correctly under the influence of electromagnetic waves or static electricity.
In an attempt to minimize the influence of electromagnetic waves or static electricity, a case, which encloses the protective circuit board, may be subjected to secondary shielding treatment. Alternatively, silicone glue or tape may be attached thereto. However, such measures raise the overall manufacturing cost of battery packs and increase the weight.

Protective circuit board for battery pack


Described are techniques for processing data requests in connection with an I/O operation. A write data request is sent from a host to a target data storage system. The host performs a data validation, such as a checksum calculation, using the data of the data request. The data request is sent to the target data storage system. The target data storage system may be enabled to perform data validation processing on a per device basis by setting one or more device flag bits for a device. The target data storage system performs data validation processing in accordance with the flag bit settings of a device associated with a data request. A target checksum value using the data received on the target data storage system is determined and compared to the host checksum value in order to determined data validity. Data recovery processing is performed if data corruption is determined. A partial write of the data requested may be performed for those data portions occurring prior to the corrupted data that have been successfully validated.

1. Technical Field
This application generally relates to a computer system, and more particularly to techniques used with I/O operations.
2. Description of Related Art
Computer systems may include different resources used by one or more host processors. Resources and host processors in a computer system may be interconnected by one or more communication connections. These resources may include, for example, data storage devices such as the Symmetrix™ family of data storage systems manufactured by EMC Corporation. These data storage systems may be coupled to one or more host processors and provide storage services to each host processor. An example data storage system may include one or more data storage devices, such as those of the Symmetrix™ family, that are connected together and may be used to provide common data storage for one or more host processors in a computer system.
A host processor may perform a variety of data processing tasks and operations using the data storage system. For example, a host processor may perform basic system I/O operations in connection with data requests, such as data read and write operations and also administrative tasks.
Host processor systems may store and retrieve data using a storage device containing a plurality of host interface units, disk drives, and disk interface units. Such storage devices are provided, for example, by EMC Corporation of Hopkinton, Mass. and disclosed in U.S. Pat. No. 5,206,939 to Yanai et al., U.S. Pat. No. 5,778,394 to Galtzur et al., U.S. Pat. No. 5,845,147 to Vishlitzky et al., and U.S. Pat. No. 5,857,208 to Ofek. The host systems access the storage device through a plurality of channels provided therewith. Host systems provide data and access control information through the channels to the storage device and storage device provides data to the host systems also through the channels. The host systems do not address the disk drives of the storage device directly, but rather, access what appears to the host systems as a plurality of logical disk units. The logical disk units may or may not correspond to the actual disk drives. Allowing multiple host systems to access the single storage device unit allows the host systems to share data stored therein.
An application may be executing on a host computer system. The application may issue I/O requests, such as a write request, to a storage device serving as a database device. The database may become corrupted for a variety of reasons. For example, the database may be left in an unknown state if the write request fails to complete properly, such as when the write request is interrupted in the event of a system reset. The database may be corrupted, for example, if the database records are written partially or include incorrect data creating corrupted data. Another application may also corrupt the database by performing non-database write operations to the database devices. The chance of a database corruption may further increase in a system including multiple communication paths accessed by one or more hosts performing I/O operations to the database.
If the database corruption is not detected until some amount of time after a corrupted record has been written to the database, the corrupted data may have also been further propagated to other sources, for example, in connection with subsequent reading and writing of the corrupt data.
When a database corruption is detected, the database is restored because of the unknown state of the data. The database restoration process may be characterized as expensive and time consuming. During the restoration process, the database is unavailable for a period of time while using computer system resources to restore the data included therein to a valid known state.
It may be desirable to have an efficient technique which provides for detection and determination of a database corruption associated with a write operation in a timely manner. It may also be desirable to provide for determination of corrupt data prior to writing the corrupt data to a device and to provide for processing when corrupted data is detected prior to writing the data such that the data on the device is left in a valid state.

Protecting database records against a failed write operation


A removable external closure device is disclosed for managing female urinary incontinence. The device includes a resilient, deformable, hollow body portion and a flange which seals against the tissue surrounding the urethral orifice. When the body portion is squeezed and the flange positioned against the tissue surrounding the urethral orifice, the resilience of the body portion creates a vacuum which holds the device in place and closes the urethral orifice. The device is configured to promote tearing of the flange after a predetermined period of normal use so as to insure that the patient will change the device regularly and thus minimize the possibility of creating an infection or tissue irritation that could result from use of a contaminated or dirty device. In one aspect of the invention tearing is promoted by at least the flange being formed of a composition which exhibits a low tear strength. In another aspect of the invention tearing is promoted by an interruption, such as a short radial slit, in the periphery of the flange.

Female urinary incontinence is a widespread problem affecting millions of adult females worldwide. A wide variety of treatments have been proposed, ranging from surgical procedures to various devices which restrict or close the urethra. While the devices are less invasive than surgical procedures, they suffer their own disadvantages. Many of the proposed devices include components which reside within the urethra or the vagina. These devices can be uncomfortable to the patient when inserted or applied. They are often inconvenient and unsanitary to use. Further they can be a source of irritation and possible infection to the patient.
Thus there is a need for an improved device for managing female urinary incontinence which minimizes or eliminates discomfort to the patient when applied.
There is also a need for an improved device for managing female urinary incontinence which is convenient and sanitary to use.
There is a further need for an improved device for managing female urinary incontinence which is comfortable to wear and which minimizes the potential for infection.

Removable external closure device for managing female urinary incontinence


A planar support platform for mounting a pet washtub on the upper rim of a conventional bathtub. The platform comprises a generally H-shaped frame with a central beam slide-adjustable on a pair of spaced cross-bars that span the width of the bathtub to rest on the bathtub upper rim. The cross-bars include downwardly-extending vertical clamping posts shorter than the height of the bathtub, and adjustably positioned on the cross-bars to engage the inner faces of the bathtub sidewalls with an outward locking force. Pet washtubs for use in combination with the platform are also disclosed, the washtub in one form having a bottom locking plate structure configured to mate with inner and outer mounting features on the platform cross-bars.

Tubs for washing dogs and other pets at a convenient raised height are known. Commercial examples include those sold under the trademarks Booster Bath™ and Flying Pig™, both comprising plastic tubs raised on legs, and advertised for outdoor use with 360-degree access to the animal in the tub. The Booster Bath™ raised tub has a cutout in the rear tub wall for improved entry and exit, and the tub sidewall can be separated from the base for compact shipping, with a one-time, two-piece snap together connection.
U.S. Pat. No. 2,438,979 to Short shows a frame and harness for washing dogs in a bath tub, the frame expandable with screw members to press rubber caps against the inner walls of the bathtub to secure the frame in a desired position.
U.S. Pat. No. 5,092,001 to Ross et al shows an infant bathing tub with telescoping side members that expand to fit over and rest on the rim of a bathtub, and stowable legs for alternately supporting the infant tub from the bottom of the bathtub at a height level with the rim of the tub.
Spain Patent No. 2,384,962 to Campos Sanchez shows a tub for washing infants and pets, the tub body raised on a frame with telescoping tubular cross members adapted to expand over and rest on the rim of a bathtub.
It is also known to make small collapsible pet and infant washtubs. The Ningbo Big Ear Pet Products Co., Ltd. dog bath tub has a rigid oval rim supported on rigid legs, and a collapsible, corrugated silicone rubber tub body. The soft, collapsible tub body is expanded downwardly from the rim for tub use, and collapsed upwardly toward the rim for substantially flat storage. The legs fold flat against the bottom of the flattened, collapsed tub body for storage.

Pet bathtub platform with detachable pet washtub


A storage element and bicycle frame that work in conjunction with each other to make both the frame and storage element as aerodynamic as possible when the storage element is attached to the frame. The storage element is designed to function as an integral aerodynamic element of the frame.

A conventional bicycle water bottle is mounted in a carrier attached to the down tube or seat tube of the frame. A conventional tool containing pouch is mounted to the frame behind the rider's seat. Typically, the water bottle or tool pouch profile extends well outside the envelope of the bicycle frame, when viewed head on, and thus adds to the frontal area of the bicycle increasing the aerodynamic drag on the bicycle. Further, the shape of the tool pouch or water bottle disturbs the air flowing across the bicycle frame members, thus further adding to the overall drag of the bicycle.


Compounds are provided that, by way of their selective neurotransmitter binding useful for the treatment of various neurological and psychological disorders, e.g., ADHD. Such compounds are 4-phenyl substituted tetrahydroisoquinolines having the Formula IA, IB, IIA, IIB, IIIA or IIIC as set forth herein.

The treatment of a variety of neurological and psychiatric disorders, e.g., attention deficit-hyperactivity disorder ("ADHD"), is characterized by a number of side effects believed to be due to the lack of appropriate selectivities in the compounds used for the treatment, e.g., to the compounds' inability to selectively block certain neurochemicals, and not others. ADHD, for example, is a disease affecting 3-6% of school age children, and is also recognized in percentage of adults. Aside from hampering performance at school and at work ADHD is a significant risk factor for the subsequent development of anxiety disorders, depression, conduct disorder and drug abuse. Since current treatment regimes require psychostimulants, and since a substantial number of patients (30%) are resistant to stimulants or cannot tolerate their side effects, there is a need for a new drug or class of drugs which treats ADHD and does not have resistance or side effect problems. In addition, methylphenidate, the current drug of choice for the treatment of ADHD, induces a number of side effects; these include anorexia, insomnia and jittery feelings, tics, as well as increased blood pressure and heart rate secondary to the activation of the sympathetic nervous system. Methylphenidate also has a high selectivity for the dopamine transporter protein over the norepinephrine transporter protein (DAT/NET Ki ratio of 0.1), which can lead to addiction liability and requires multiple doses per day for optimal efficacy.
This invention provides an alternative to such known treatments with its novel 4-phenyl tetrahydroisoquinoline derivatives, said compounds being nowhere described in the art. U.S. Pat. No. 3,947,456 (the "'456 patent), for example, describes 4-phenyl substituted tetrahydroisoquinolines of the formula:
wherein R is hydroxy or lower alkoxy; the '456 patent does not describe any other groups at this position, let alone the substituents available at the position (R4) in the compounds provided herein. Phenyl-substituted tetrahydroisoquinolines are also described in Mondeshka et al (Il Farmaco, 1994, 49 pp. 475-481). However, the compounds described therein are not those provided herein.

4-Phenyl substituted tetrahydroisoquinolines and therapeutic use thereof


There is provided a two point mounting system for the outside end of a spiral spring. The mounting system induces a torsional load on the outside end of the spiral spring to overcome the tendency of the spiral spring coils to move into a non-concentric position. The mounting system comprises a single piece sleeve which has an elongated slot for contacting the spiral spring on opposite sides and inducing the torsional load.

This invention is directed towards a two point system for mounting a spiral spring. While the term spiral spring will be used to describe the present invention, it is understood that the term spiral spring includes springs of similar designs which are sometimes termed clock wound springs or power springs. Normally, spiral springs are manufactured from a series of windings of a flat piece of spring wire material. Most of these springs have multiple coils generally having unrolled lengths of between 10 and 50 inches depending on the requirements of the particular application. Typical applications for these springs are counter-balances for vehicle windows, vehicle hoods or vehicle trunk lids.
When spiral springs are loaded, the coils are forced to one side causing adjacent coils to come into contact and position the spiral spring in a non-concentric position as illustrated in FIG. 1. In the non-concentric position, the contact of the coils creates a source of adjacent coil friction. This load in the coils caused by this adjacent coil friction will continue to build up as the spiral spring is wound until the load on the coils exceeds the frictional force holding the coils in contact with each other. The adjacent coils will then jump to a new position in contact with each other and the process will begin again. The continued build up of load and sudden release of the adjacent coils will have a chattering affect of the coils. The chattering of the coils can create an objectionable noise that will occur every time a trunk lid, a window or a hood is cycled.
Most of today's applications of spiral springs require some form of rust preventative coating. Because of the adjacent coil contact of the spiral spring in a loaded condition, applying the rust preventative after the assembly of the spring is not a viable option. Therefore, the rust preventative must be applied to the spring in an unloaded condition thus eliminating the opportunity of applying the rust preventative along with the mating components in an assembled condition.
Various attempts have been made at reducing or eliminating this adjacent coil friction build up. One method of reducing the amount of friction is to lubricate the coils prior to loading when the coils are in a concentric arrangement. This has the effect of lowering the coefficient of friction between adjacent coils and thus the load at which the adjacent coils will slip. The problems associated with lubrication of the coils is that it is a costly operation, and the lubricant will eventually be removed or squeezed out from in between the coils without the opportunity of having it replaced. The spiral spring is then operating as a non-lubricated spring with the associated chattering and noise problems.
U.S. Pat. No. 4,921,230 issued May 1, 1990 to H. Jay Thomsen discloses a method of eliminating adjacent coil contact and maintaining concentric coils of a spiral spring in a loaded condition. Thomsen discloses a clip which is part of the mounting of the spiral spring. The outer coil of the spring rides against the clip, the clip then stopping the movement of the spiral spring to a non-concentric position. While the retention clip in Thomsen works satisfactorily, it requires an additional piece and the orientation of the clip with respect to the spring must be maintained during the operation of the mechanism.
U.S. Pat. No. 3,091,447 issued May 28, 1963 to A. W. Donkin discloses another method of eliminating adjacent coil contact. Donkin uses a spring which is wound in an initial non-concentric form. The non-concentrically wound spring is used in conjunction with a two contact point staking arrangement. When load is applied to the spring, the spring has the tendency to move from its original non-concentric shape into a shape where the coils are concentric. The two contact point staking arrangement is either a two pin mounting system or an elongated bar contacting the spring at two points on the same side of the spring. The requirement of using a spiral spring having non-concentric adjacent coils presents both manufacturing problems and higher costs.
Accordingly, what is needed is a mounting system for a standard spiral spring which is simple, low cost and is able to maintain the concentric shape of the spiral spring after the spring is loaded and during the operation of the mechanism to which the spring is attached.


A multiply-add unit includes a digit alignment shift number and exponent generator unit, an addend digit alignment and sign adjusting unit, a multiplier array, a sticky-bit for addend lower digits generator unit, a leading digit detector unit, a carry propagate adder, an exponent normalizing unit, an addend higher digit incrementer, a sticky-bit generator unit, a normalizing shifter, a positive number conversion and rounder unit, and an exponent correction unit. The multiplier array is an array of carry save adders. The leading digit detector unit receives the two terms of carry and sum parts from the multiplier array, sequentially checks a digit pair of "0" to "1" at each corresponding digit position from the highest digit, and detects the leading non-zero digit of the absolute values depending upon what digit pair values are (11, 00, 10, 01) from higher to lower digit position.

1. Field of the Invention
The present invention relates to a multiply-add unit of a data processing apparatus such as a micro-processor, and more particularly to a multiply-add unit for executing a multiply-add instruction for normalizing a calculation result at high speed, and a data processing apparatus using such a multiply-add unit.
2. Description of the Related Art
An example of a conventional microprocessor which executes a multiply-add instruction for normalizing a calculation result is PowerPC 603 described in "The PowerPC 603 Microprocessor: A High Performance, Low Power, Superscaler RISC Microprocessor" (digest of papers SPRING COMPCON '94, pp. 300 to 306).
This processor detects the leading digit from a value obtained after carry propagate addition. If the addend flows higher than the product, the digits of the flowed addend are aligned with the lower digits, and incremented by the carry from the lower digits.

Multiply-add unit and data processing apparatus using it


Modified soy protein adhesives are provided which have increased bonding abilities. The adhesives are prepared by forming a dispersion of soy protein, water, and a modifier selected from two classes of modifiers. The preferred modifiers are urea, sodium dodecylbenzene sulfonate, sodium dodecyl sulfate, and guanidine hydrochloride. The resulting dispersion is stirred, freeze-dried, and milled into a powder to be stored until use. The adhesives of the invention have superior bonding qualities while being safe for the environment. The urea-modified, GH-modified, SDS-modified, and SDBS-modified soy protein adhesives have higher water resistance than non-modified soy protein adhesives.

1. Field of the Invention
The present invention is broadly concerned with modified soy protein adhesives, and methods of production and use thereof. More particularly, the invention relates to such adhesives produced by the reaction of soy protein with a modifier selected from two classes of compounds in an aqueous system wherein the adhesives exhibit higher water resistance than non-modified soy protein adhesives. In the use of the adhesives of the invention, the bonds between the adherends have high shear strengths. The adhesives are preferably formulated by mixing a quantity of soy protein with an aqueous dispersion comprising the modifier and reacting the mixture; the resultant adhesive may be used in a liquefied form or dried to a reconstitutable powder.
2. Description of the Prior Art
Large quantities of adhesives are used annually for such things as interior and exterior applications of plywood and particle board, paper manufacturing, book binding, textile sizing, abrasives, gummed tape, and matches. Petroleum-based and soy protein-based adhesives are two general types of adhesives used in such applications. Soy protein adhesives known in the art generally lack the gluing strength and water resistance compared to petroleum-based adhesives. Most of the petroleum-based adhesives, however, contain phenol formaldehyde which is harmful to the environment. Also, petroleum resources are naturally limited and politically controlled. Furthermore, petroleum-based adhesives are not biodegradable thus resulting in an unwanted accumulation of waste. As a result, soy protein polymers are being reconsidered as an alternative adhesive to reduce the usage of petroleum polymers and to prevent environmental pollution.
In soy protein-based adhesives, the protein molecules are dispersed, and thus partially unfolded, in dispersion. The unfolded molecules increase the contact area and adhesion of the protein molecules onto other surfaces and entangle each other during the curing process to provide bonding strength. However, while soy protein-based adhesives are environmental friendly and are derived from soybeans which are renewable and more abundant than petroleum resources, the currently available soy protein-based adhesives lack the increased gluing strength and water resistance which are advantageous in typical adhesive applications.
The present invention overcomes the problems noted above, and provides a soy protein-based adhesive having increased bonding abilities and high water resistance. The adhesives of the invention are formed by modifying soy protein (SP), preferably derived from soy protein isolate (SPI) with certain compounds (modifiers).
Two classes of mild chemical modifiers are preferred in the preparation of the adhesives of the invention. One preferred modifier class includes saturated and unsaturated alkali metal C8-C22 sulfate and sulfonate salts. Even more preferred are saturated and unsaturated alkali metal C10-C18 sulfate and sulfonate salts. Saturated alkali metal C8-C22 sulfate and sulfonate salts include all alkali metal alkyl (such as octyl and dodecyl) C8-C22 sulfate and sulfonate salts. Unsaturated alkali metal C8-C22 sulfate and sulfonate salts include all alkali metal alkenyl (such as decenyl and octadecenyl) C8-C22 sulfate and sulfonate salts and all alkali metal alkynyl (such as octynyl and tetradecynyl) C8-C22 sulfate and sulfonate salts. Two particularly preferred modifiers in this class are sodium dodecyl sulfate (SDS) and sodium dodecylbenzene sulfonate (SDBS).
Another preferred class of modifiers for forming the adhesives of the invention are those compounds having the formula I:
wherein each R is individually selected from the group consisting of H and C1-C4 saturated and unsaturated groups, and X is selected from the group consisting of O, NH, and S. The C1-C4 saturated and unsaturated groups refers to alkyl groups (both straight and branched chain) and unsaturated refers to alkenyl and alkynyl groups (both straight and branched chain). The preferred modifiers in this class are urea and guanidine complexed with hydrochloride.
Advantageously, the adhesives of the invention can be formed by utilizing mixtures of the foregoing modifiers. These mixtures can be within a class or they can contain modifiers from each class. For example, the modifier could be a mixture of urea and guanidine hydrochloride (which fall within the same class) or a mixture of urea and SDS.
When urea or guanidine hydrochloride (GH) is the modifier used to form the adhesives of the invention (hereinafter referred to as urea-modified soy protein adhesives or U-SPI and guanidine hydrochloride-modified soy protein adhesives or GH-SPI, respectively), the adhesives are preferably formed by preparing a mixture comprising (and preferably consisting essentially of) urea or guanidine hydrochloride (GH) and water with a quantity of soy protein thus forming a slurry or dispersion. Any source of soy protein (such as soybean concentrate or soybean meal) is suitable for making the adhesives of the invention, but a particularly preferred source of soy protein is soy protein isolate. The soy protein is preferably essentially free of urease, having less than about 10 activity units of urease. When urea is the modifier, the amount thereof should result in a urea content of at least about 6% by weight, preferably at least about 10% by weight, and more preferably at least about 15-18% by weight, based on the weight of the protein slurry. The amount of urea utilized is important in order to be certain that the protein molecules properly unravel in dispersion, thus increasing the contact area of the molecules as well as their adhesion onto other surfaces. These unraveled molecules will then entangle with each other during the curing process contributing to the increased bonding strength of the adhesives.
The resulting soy protein-urea or soy protein-GH aqueous dispersion is normally mixed for about 60 minutes. The forming of and mixing of the slurry is carried out at a temperature of from about 10 to about 80xc2x0 C., and preferably from about 20 to about 50xc2x0 C. Even more preferably, the forming and mixing of the dispersion takes place under ambient temperature and pressure conditions. The dispersion should have a pH of less than about 8, and more preferably less than about 7 (e.g., from about 2-7). After mixing, the reacted dispersion can be immediately used as an adhesive, or it can be freeze-dried, milled into a powder, and stored for later use. Or, if freeze-drying is not practical, the dispersion can be subjected to any known mechanism or process (such as spray drying) by which the moisture is substantially removed. This is just one example of how to form a modified soy protein adhesive utilizing a modifier (i.e., urea or GH) within this class of preferred modifiers. Any other modifiers having the formula I can be made in the same fashion, with appropriate process modifications depending upon the specific modifier chosen.
When sodium dodecyl sulfate or sodium dodecylbenzene sulfonate is the modifier used to form the adhesives of the invention (hereinafter referred to as SDS-SPI and SDBS-SPI adhesives, respectively), the process of forming the adhesives comprises mixing soy protein and water at room temperature for about 30 minutes to form a suspension or dispersion. Any source of soy protein (such as soybean concentrate or soybean meal) is suitable for making the adhesives, but a particularly preferred source of soy protein is soy protein isolate. SDS or SDBS is added to the suspension with the resulting dispersion being stirred for about 6 hours. Preferably, the SDS or SDBS is present in the resulting dispersion at a level from about 0.1 to about 15% by weight, and more preferably from about 0.5 to about 6% by weight based on the weight of said protein slurry. Preferably, the forming of the adhesive takes place under ambient temperature and pressure conditions. The final slurry should have the same pH ranges as the urea adhesives, and likewise such adhesives can be used in liquid or dried particulate form. This is just one example of how to form a modified soy protein adhesive utilizing a modifier (i.e., SDS or SDBS) which falls with the class of saturated and unsaturated alkali metal C8-C22 sulfate and sulfonate salts. Other adhesives made using modifiers within this class can be formed in a similar manner with appropriate process modifications depending upon the specific modifier chosen.
Regardless of the modifier utilized, the final dried adhesive powders should be small enough so that 90% of the powder particles pass through a 50 mesh screen, and preferably the powder particle size is such that 90% of the powder particles pass through a mesh screen having a size of at least about 100 mesh or higher (xe2x80x9chigherxe2x80x9d meaning e.g., 150 mesh or 200 mesh). The adhesive powders of the invention can be stored in powder form until the point-of-use. When the adhesive is needed, the powder is added to water (preferably distilled water) at a ratio of from about 1:20 to about 1:4, and preferably at a ratio of about 1:6 of SP powder:water. The powder is dispersed in the water at room temperature for about five minutes, preferably while heating to at least about 50xc2x0 C. The resulting aqueous adhesive can then be applied to an adherend by any conventional application means, such as by brushing the adhesive onto a surface of the adherend, or by placing the adhesive between and in contact with a pair of adherends. Preferably the adhesive application is followed by compressing of the adherends in order to facilitate adhesion.
In some applications, it may be desirable to modify a soy flour having at least about 50% protein to form the adhesives of the invention. Suitable modifiers for include all of those set forth above, with the exception of urea (because soy flours contains appreciable quantities of urease). Guanidine hydrochloride, SDS, and SDBS are particularly preferred for modifying soy flours. The modified soy flours have improved water resistance and gluing strengths as compared to non-modified soy flours.
The adhesives of the invention are particularly useful for adhering cellulosic components, such as those formed of wood or paper. The amount of adhesive necessary can be varied as required by the characteristics of the adherends. When the adhesives of the invention are applied to wooden adherends, the gluing strength (i.e., the shear strength) of the adhesive is at least about 30 kg/cm2, preferably at least about 50 kg/cm2, and more preferably about 65 kg/cm2.

Kansas State University Research Foundation


A back side illuminated image sensor may be provided with an array of image sensor pixels. Each image sensor pixel may include a substrate having a front surface and a back surface. The image sensor pixels may have a charge storage region formed at the back surface and a charge readout node formed at the front surface of the substrate. The image sensor pixels may receive image light at the back surface of the substrate. Photo-generated charge may be accumulated at the charge storage region during a charge integration cycle. Upon completion of the charge integration cycle, a transfer gate formed at the front surface may be pulsed high to move the charge from the charge storage region to the charge readout node. The charge may be converted to a voltage at the charge readout node and may be read out using a rolling shutter readout mode.

This relates to solid-state image sensor arrays and, more specifically, to image sensors with small size pixels that are illuminated from the back side of a pixel substrate. Small pixel sizes reduce the cost of manufacturing image sensor arrays, but it is important not to sacrifice image sensor performance when pixel size is reduced.
Conventional complementary metal-oxide-semiconductor (CMOS) image sensors sense light by converting impinging photons into electrons that are integrated (collected) in sensor pixels. Upon completion of each integration cycle, the collected charge is converted into voltage signals, which are supplied to corresponding output terminals associated with the image sensor. Typically, the charge-to-voltage conversion is performed directly within the pixels, and the resulting analog pixel voltage signals are transferred to the output terminals through various pixel addressing and scanning schemes. The analog voltage signal can sometimes be converted on-chip to a digital equivalent before being conveyed off-chip. Each pixel includes a buffer amplifier (i.e., source follower) that drives output sensing lines that are connected to the pixels via respective address transistors.
After the charge-to-voltage conversion is complete and after the resulting signals are transferred out from the pixels, the pixels are reset before a subsequent integration cycle begins. In pixels that include floating diffusions (FD) serving as the charge detection node, this reset operation is accomplished by momentarily turning on a reset transistor that connects the floating diffusion node to a voltage reference for draining (or removing) any charge transferred to the FD node. However, removing charge from the floating diffusion node using the reset transistor generates kTC-reset noise, as is well known in the art. This kTC noise must be removed using correlated double sampling (CDS) signal processing techniques in order to achieve desired low noise performance. Typical CMOS image sensors that utilize CDS require at least three transistors (3T) or four transistors (4T) per pixel. An example of the 4T pixel circuit with a pinned photodiode can be found in Lee (U.S. Pat. No. 5,625,210), incorporated herein as a reference.
In FIG. 1, a simplified drawing 100 of a pixel cross section is shown. As shown in drawing 100, a pixel substrate 101 includes p+ doped layer 102 deposited on the back surface of pixel substrate 101, which prevents the generation of excessive dark current by interface states. Substrate 101 includes epitaxial p-type doped layer 115 formed on top of p+ layer 102. Photons 90 that enter p-type doped layer 115 generate carriers that are collected in the potential well of the photodiode formed in region 108 at the front surface of substrate 101. The front (upper) surface of epitaxial p-type doped layer 115 is covered by oxide layer 109 that isolates doped poly-silicon charge transfer (TX) gate 110 from substrate 101. Transfer gate 110 includes masking oxide 111 deposited on an upper surface of transfer gate 110 that serves as a patterning hard mask as well as an additional blocking mask for ion implantation that forms the photodiode storage region.
The photodiode is formed by the p+ type doped potential pinning layer 107 and n-type doped layer 108 at the front surface of substrate 101. P+ type doped layer 107 reduces dark current generated by the interface states. Charge generated by impinging photons 90 is accumulated at region 108. Gate 110 includes sidewall spacers 116 formed on each side of gate 110 to control the mutual edge positions of p+ type doped layer 107 and charge storage layer 108. Floating diffusion (FD) diode 104 formed at the front surface of substrate 101 senses charge transferred from region 108 (i.e., as shown by arrow 121, charge is transferred from region 108 at the front side of pixel substrate 101 to region 104 at the front side of pixel substrate 101). Floating diffusion 104 is connected to a source follower (SF) transistor (not shown). The floating diffusion diode, source follower, and other pixel circuit components are built within p-type doped well 103.
The pixels are isolated from each other by p+ type doped regions 105 and 106 that may extend through epitaxial p-type doped layer 115 down to p+ type doped layer 102. The pixel is covered by inter-level (IL) oxide layers 112 that are used for the pixel metal wiring and interconnect isolation. The active pixel circuit components are connected to the wiring by metal via 114 deposited through contact holes 113.
As shown in drawing 100, a large portion of valuable pixel area is occupied by transfer gate 110. Other pixel circuit components (not shown) also occupy a large portion of the pixel, so there is not enough substrate area left for the photodiode that is disposed in a lateral direction from gate 110. This can lead to low photodiode charge storage capacity, poor pixel dynamic range, and poor noise performance.
In some cases, two pixel substrates are stacked on top of each other, with one substrate having a built in photodiode and the other substrate carrying the rest of the pixel circuits. An example of two substrate stacked pixel a can be found in http://www.sony.net/SonyInfo/News/Press/201201/12-009E/ by Sony. However, when stacking the two substrates, the substrates must be electrically connected using wafer-to-wafer contacts and must be precisely aligned, resulting in increased fabrication difficulty and high manufacturing costs.
It would therefore be desirable to be able to provide improved image sensors without a stacking requirement.

Back side illuminated image sensors with back side charge storage

Semiconductor Components Industries, LLC