Provided is an operation microscope apparatus for easily and speedily obtaining a suitable separation state between illumination light and observation light in a case where a front lens is replaced by another one. An illumination optical system includes a slit plate in which slit holes having different slit widths are formed. Each of a plurality of front lens having different refractive powers is integrally formed with corresponding one of storing sections. One of the storing sections is attached to an elevation regulating member. The elevation regulating member includes micro-switches. Each of the storing sections includes a protruding portion for turning on corresponding one of the micro-switches at the time of attachment. A control unit sets an illumination angle of the illumination light and a slit width of a slit based on a detection signal from a micro-switch which becomes an on state.

1. Field of the Invention
The present invention relates to an operation microscope apparatus used for an ophthalmologic operation, and more particularly, to an operation microscope apparatus including a front lens for condensing illumination light to illuminate an interior of an eye.
2. Description of the Related Art
Up to now, when a retina and vitreous body operation in an ophthalmologic field is performed, as shown in FIG. 13, an operation contact lens 200 is placed on a cornea Ec of an eye to be operated E. Then, while a light guide (optical fiber) 201 is inserted into an interior of the eye to illuminate an operation region, an operation instrument 202 such as a cutter or a forceps is inserted into the interior of the eye to perform the operation. In FIG. 13, reference symbol Ec denotes the cornea and Ev denotes a vitreous chamber. When the operation is to be performed using the operation method as shown in FIG. 13, it is necessary that an operator hold the light guide 201 in his/her one hand and hold the operation instrument 202 in his/her other hand. This raises a problem in that, for example, it is difficult to perform a fine operation.
In order to deal with the problem, there has been proposed an operation microscope apparatus using a front lens for illuminating the interior of the eye to be operated with illumination light condensed between the eye to be operated and a front focus position of an objective lens (see, for example, JP 2003-062003 A). A plurality of front lenses whose refractive powers are different from one another is prepared. A suitable front lens is selected corresponding to, for example, an observation position of a fundus Er of the eye and attached to the operation microscope apparatus.
FIG. 14 shows an external structure of an operation microscope apparatus 100 using a front lens. The operation microscope apparatus 100 includes a pillar 2 for supporting the operation microscope apparatus 100, a first arm 3 whose one end is connected with an upper end of the pillar 2, a second arm 4 whose one end is connected with the other end of the first arm 3, a drive device 5 connected with the other end of the second arm 4, an operator's microscope 6 suspended from the drive device 5, an assistant's microscope 7 provided adjacent to the operator's microscope 6, and a foot switch 8 for performing various manipulations by a foot. The operator's microscope 6 and the assistant's microscope 7 are three-dimensionally moved in a longitudinal direction and a lateral direction by the drive device 5 in response to manipulation performed by an operator or the like.
The operator's microscope 6 includes a lens barrel section 10 housing, for example, various optical systems and various drive systems. An inverter section 12 housing a known optical unit (image erecting prism) for converting an observation image obtained as an inverted image into an erect image is provided on an upper portion of the lens barrel section 10. A pair of left and right eyepiece sections 11L and 11R are provided on an upper portion of the inverter section 12. The operator looks through the eyepiece sections 11L and 11R to observe the eye to be operated E with both eyes.
The operator's microscope 6 is connected with a front lens 13 through a holding arm 14. The holding arm 14 includes an upper end portion provided to be pivotable in a longitudinal direction, so that the front lens 14 can be removed from a position between the eye to be operated E and a front focus position of an objective lens (not shown). The front lens 13 and the holding arm 14 are stored in a storing section (not shown).
When an eye with the natural lens (phakia) or an eye with the implanted intraocular lens (pseudophakia) is an observation object, relatively weak reflection light on the natural lens or the intraocular lens (IOL) causes a reduction in sharpness of the observation image. Dispersion light from a sclera causes a reduction in contrast of the observation image.
In view of this, it is desirable that the operation microscope apparatus have, for example, (1) a function capable of adjusting a size of an illumination filed and a shape thereof, (2) a function capable of shifting the illumination field, and (3) a function capable of adjusting an angle (illumination angle) between an optical axis (observation optical axis) of an observation optical system and an optical axis (illumination optical axis) of an illumination optical system. In order to realize the functions (1) and (2), there has been known a method of illuminating the interior of the eye with slit light from a slit mechanism incorporated in the illumination optical system (see, for example, JP 2003-062003 A).
FIG. 15 shows a structure of an optical system of the above-mentioned operation microscope apparatus. In the case of the operation microscope apparatus 100 shown in FIG. 14, the optical system is housed in the lens barrel section 10 of the operator's microscope 6 and includes an illumination optical system 20 and a pair of right and left observation optical systems 30. Note that FIG. 15 is a side view showing the optical system as viewed from the assistant's microscope 7 side.
The pair of right and left observation optical systems 30 are provided so as to sandwich an optical axis O of an objective lens 15 on both ends thereof. Each of the right and left observation optical systems 30 includes a zoom lens system 31, a beam splitter 32, an imaging lens 33, an image erecting prism 34, an interpupillary distance adjusting prism 35, a field stop 36, and an eyepiece 37. The zoom lens system 31 is composed of a plurality of zoom lenses 31a, 31b, and 31c. The beam splitter 32 is used to separate a part of observation light exited from the eye to be operated E from the other part thereof to lead the separated part to the assistant's microscope 7 or a TV camera (not shown).
The illumination optical system 20 includes an illumination light source 21, a condenser lens 22, an illumination field stop 23, a slit plate 24, an illumination prism 25, and a collimator lens 27.
The slit plate 24 has a slit hole 24a formed therein. The slit plate 24 can be inserted to and removed from an illumination optical path of the illumination optical system 20. In particular, when the slit plate 24 is to be inserted to the illumination path, the slit plate 24 is moved in a direction orthogonal to an illumination optical axis O′. The slit hole 24a is formed in a direction orthogonal to both the illumination optical axis O′ and a movable direction of the slit plate 24. An image projected onto the fundus of the eye is extended in parallel with a plane including the right and left observation optical axes of the right and left observation optical systems 30.
The illumination field stop 23 is provided in a position optically conjugate with a front focus position F of the objective lens 15. The slit plate 24 is provided near the illumination field stop 23. The slit hole 24a is formed in a position substantially optically conjugate with the front focus position F of the objective lens 15. The objective lens 15 is disposed such that the front focus position F becomes conjugate with the fundus Er (retina) of the eye.
The illumination light source 21 can be housed in the lens barrel section 10 of the operator's microscope 6 or provided outside the lens barrel section 10 to guide the illumination light to the condenser lens 22 of the lens barrel section 10 through an optical fiber.
In order to prevent reflection light of the illumination light on the surface of an operation contact lens or the cornea from entering the observation optical system to cause glare, a structure in which an illumination optical path and an observation optical path are separated from each other on an interface surface on which the reflection light is produced is employed for the conventional operation microscope apparatus.
FIGS. 16A and 16B show suitable separation states in which the illumination optical path and the observation optical path are separated from each other in the cornea Ec of the eye to be operated E. Here, FIG. 16A shows the case where a front lens 13A whose refractive power is 40 diopters (D) is used and FIG. 16B shows the case where a front lens 13B whose refractive power is 80 D is used. FIGS. 17A and 17B show the cases where the separation state shown in FIG. 16A is viewed from above the observation optical system 30. FIGS. 18A and 18B show the cases where the separation state shown in FIG. 16B is viewed from above the observation optical system 30.
The front lens 13A of 40 D as shown in FIG. 16A is used when the fundus Er of the eye and vicinities thereof are observed. Illumination light 301 condensed by the front lens 13A passes through a region 301a on the cornea Ec which is distant from the optical axis O of the objective lens 15 and is incident on the interior of the eye, thereby illuminating the fundus Er of the eye and the vicinities thereof. On the other hand, reflection light (observation light) 401 of the illumination light 301 on the fundus Er of the eye and the vicinities thereof exits from the interior of the eye through a region 401a including the optical axis O of the objective lens 15 and travels to the front lens 13A. Here, it is necessary to provide the region 301a on the cornea Ec through which the illumination light 301 passes and the region 401a through which the observation light 401 passes so as not to overlap with each other, thereby preventing cornea reflection light of the illumination light 301 from mixing with the observation light 401.
At this time, an illumination optical path T and left and right observation optical paths QL and QR in the optical lens 15 become a separation state as shown in FIG. 17A. In the cornea Ec, the region 301a through which the illumination light passes, a region 401aL through which the observation light 401 to be incident on the left observation optical system passes, and a region 401aR through which the observation light 401 to be incident on the right observation optical system passes become a separation state as shown in FIG. 17B.
On the other hand, the front lens 13B of 80 D as shown in FIG. 16B is used when a region distant from the fundus Er of the eye is observed. Even in such a case, it is necessary to provide a region 302a on the cornea Ec through which illumination light 302 passes and a region 402a through which the observation light 402 passes so as not to overlap with each other, thereby preventing cornea reflection light of the illumination light 302 from mixing with the observation light 402.
At this time, the illumination optical path T and left and right observation optical paths QL and QR in the optical lens 15 become a separation state as shown in FIG. 18A. In the cornea Ec, a region 302a through which the illumination light passes, a region 402aL through which the observation light 402 to be incident on the left observation optical system passes, and a region 402aR through which the observation light 402 to be incident on the right observation optical system passes become a separation state as shown in FIG. 18B.
When the operation contact lens is used, although not shown, it is necessary to separate a region on the surface thereof through which the illumination light passes and a region on the surface thereof through which the observation light passes from each other. In addition to this, it is necessary to separate a region on the cornea through which the illumination light passes and a region on the cornea through which the observation light passes from each other.
When the eye to be operated E is significantly displaced in the optical axis O direction of the objective lens 15, the separation state between the illumination light and the observation light is broken. Therefore, it is necessary to ensure the suitable separation states as shown in FIGS. 16A, 16B, 17A, 17B, 18A and 18B in view of the amount of displacement of the eye to be operated E, which moves for the operation.
In the conventional operation microscope apparatus, the separation states are manually ensured by an operation or the like. However, for example, when the operator is not a skilled operator, it is difficult to realize the suitable separation states.
As shown in each of FIGS. 16A and 16B, the suitable separation state between the illumination light and the observation light is changed corresponding to the refractive power of the front lens 13 (13A or 13B). Therefore, every time the front lens 13 is replaced by another one, it is necessary to adjust an illumination angle of the illumination light and a slit width to ensure the suitable separation state, so that the manipulation is troublesome. When the front lens 13 is replaced by another one for the operation, it takes a time to ensure the separation state, with the result that it is likely to unnecessarily prolong the operation.


Provided is a cleaning solution and its applications. The cleaning solution comprises a mixture of a basic chemical compound and a solvent solution. In some embodiments, the basic chemical compound is tetramethylammonium hydroxide (TMAH) and the solvent solution includes a solution of water and at least one of propylene glycol ethyl ether (PGEE), propylene glycol monomethylether (PGME), and propylene glycol monomethylether acetate (PGMEA). The cleaning solution is effective in removing silicon-containing material off a surface of a system or a surface of a semiconductor substrate. In some embodiments, the system comprises a pipeline for delivering the silicon-containing material in semiconductor spin-coating processes. In some embodiments, the system comprises a drain for collecting waste fluid in semiconductor spin-coating processes. In some embodiments, the silicon-containing material has a first pH value, the cleaning solution has a second pH value, and the silicon-containing material is unstable at the second pH value.

The electronics industry has experienced an ever increasing demand for smaller and faster electronic devices which are simultaneously able to support a greater number of increasingly complex and sophisticated functions. Accordingly, there is a continuing trend in the semiconductor industry to manufacture low-cost, high-performance, and low-power integrated circuits (ICs). Thus far these goals have been achieved in large part by scaling down semiconductor IC dimensions (e.g., minimum feature size) and thereby improving production efficiency and lowering associated costs. However, such scaling has also introduced increased complexity to the semiconductor manufacturing process. Thus, the realization of continued advances in semiconductor ICs and devices calls for similar advances in semiconductor manufacturing processes and technology.
As merely one example, semiconductor lithography processes may be used to optically transfer patterns (e.g., using a photomask or reticle) onto a substrate. For instance, in various lithography processes, a resist film is spin-coated onto a surface of a wafer and is subsequently exposed and developed to form a pattern that can be transferred to the wafer (e.g., by a subsequent etching process). With the continued scaling down of IC dimensions, there has been a demand for a reduction in resist film thickness as well as resist materials offering improved reflectivity control, substrate planarization, adhesion promotion, chemical matching, and protection from contamination. Accordingly, various new resist materials and processes have been developed. For example, some lithography processes may employ a silicon-containing resist over a bottom anti-reflective coating (BARC) layer to reduce resist film thickness. In addition, some lithography processes use a tri-layer stack that includes a resist over a silicon-containing BARC layer over an organic underlayer. However, these approaches present new challenges.
For example, the silicon-containing material used in such processes may form a hardened gel by forming cros slinks therein, for example, when solvents of the silicon-containing material dry out. Moreover, the equipment that handles such material must undergo frequent cleaning processes to avoid becoming clogged or otherwise contaminated, and to avoid defect formation on production wafers processed by such equipment. Thus, existing techniques have not proved entirely satisfactory in all respects.

Cleaning composition and methods thereof

Taiwan Semiconductor Manufacturing Company, Ltd.


Systems and methods of configuring a computer network are provided. The network can include a first stage of M nodes and a second stage of N nodes. Each node in the first stage can form F communication links with nodes in the second stage and each node in the second stage can form S communication links with nodes in the first stage. Nodes in the first stage are connected to each other only through communication links connecting nodes in the first stage to nodes in the second stage. Communication links between the nodes can be assigned such that the minimum value of the throughput between any pair of nodes in the first stage is maximized.

Cloud computing and its applications are effecting a qualitative shift in the way people communicate and share information. The underlying computer networks that support cloud computing can be divided into two major categories: intra-datacenter and inter-datacenter. Intra-datacenter networks interconnect the computing infrastructure (servers, disks) within the same building or among different buildings of a datacenter campus; inter-datacenter networks connect multiple datacenters distributed at different geographic locations. Many modern high-speed data links use optical transmission technologies via optical fibers for both intra- and inter-datacenter networks.

Achieving balanced interconnectivity in a computer network


For an image-capturing unit having a light source and mirrors directing light reflected from a scanned document into a lens condensing the light onto a photoelectrically converting image sensor, a synthetic resin housing. The housing is composed of an open-ended upper frame having a top plate from which sidewalls extend, encompassing an internal space. A mounting surface for anchoring the light-source is formed on the upper side of the upper-frame top plate, and formed on the lower side of the upper-frame top plate is a pedestal on which the lens is supported. Mirror-support projections are formed on the lower side of the upper-frame top plate, or on the upper-frame sidewalls, to support the mirrors from below the lens. With this housing, the influence of heat from the light source on the optics is minimized, improving the mirrors' positional accuracy.

1. Technical Field
The present invention relates to image-capturing units that capture image information from documents, and to image-capturing apparatus furnished with such image-capturing units.
2. Description of the Related Art
Recent years have seen demands for the speed at which scanners capture information to be made faster. To make the capturing speed faster while acquiring satisfactory images requires a light source with an increased quantity of light.
However, the light sources, such as xenon lamps, often used for scanners generate an increased quantity of heat when providing an increased quantity of light. A consequent problem that arises is that heat from the light source deleteriously deforms the mirrors and other optical components.
Furthermore, a unit frame on which the optical members are supported has been composed of a synthetic resin in order to reduce the weight of the unit frame. The unit frame has thus been integrally molded by a technique of pouring an aqueous synthetic resin into a mold. When mirrors are located below a lens as in the case of the unit shown in FIGS. 1 and 2 of Japanese Unexamined Pat. App. Pub. No. H09-66915, a fixing member for the mirrors needs to be formed below a fixing member for the lens. This complicates the shape of the mold. Moreover, if only the upper side of the frame is open and the frame must be extracted from the mold through this opening, the mold-extraction direction needs to be taken into account. This further complicates the shape of the mold. In particular, the level of complexity of the shape of the mold increases with decreasing distance to the bottom the frame; that is, the level of complexity increases consistently with the distance from the opening in the unit. This reduces molding accuracy. Thus, if the mirrors are fixed to the bottom of the unit, the positional accuracy of the mirrors decreases. To solve this problem, an adjustment mechanism for the mirrors may be provided. However, this may increase the number of parts required and the number of assembly steps, sharply increasing costs.

Image-capturing unit and image-capturing apparatus


A positional information outputting device comprising: a display screen; a positional information outputting circuit for outputting the information of a position designated on the display screen; and an output circuit for outputting a display signal for displaying a first image corresponding to a portion of an image, which can be formed with an image signal inputted, on a first area and a second area of the display screen. The positional information outputting circuit outputs, in case the inside of the first area on the display screen is designated, the information on the designated position, but does not output, in case the inside of the second area is designated, the information on the designated position.

1. Field of the Invention
The present invention relates to a positional information outputting device using a touch panel, a pen or the like.
2. Description of the Related Art
As the display device such as a large-sized flat display, there have been heretofore practiced various types such as a liquid crystal type or a plasma type, which have been extended in their application ranges to not only the home TV but also presentations at offices.
When the display device is applied to preliminary arrangements or collaboration systems involving several persons in the office, on the other hand, editing operations are indispensable so that the display has to be combined position detecting means such as the touch panel or pen for designating a position on the display screen.
Thus, it is expected that conveniences are further increased, if a single display device can split its screen and can display identical contents in a face-to-face relation so that the displayed contents can be simultaneously confirmed by an operator and a facing person.
This split face-to-face display device is disclosed in Patent Publication 1. Moreover, a display system, in which a position in a split display device can be designated with a pen, is disclosed in Patent Publication 2.
Patent Publication 1: JP-A-05-197507
Patent Publication 2: JP-A-2001-175376

Positional information outputting device, positional information outputting method, and signal processing method


A circuit and method for compensating for an electrode motion artifact in which the electrode motion artifact is generated because impedance between a subject and a measuring electrode changes during measurement of the subject's biosignal, and the electrode motion artifact can be differentially measured and an electrocardiogram signal can be compensated by introducing a predetermined voltage or an electric current to the subject. A circuit and method for compensating electrode motion artifact, which can differentially measure the difference information between impedance components by introducing a predetermined voltage or electric current to a subject, in association with the electrode motion artifact. In this instance, the impedance component is a component of electrode motion artifact and the electrode motion artifact is generated when measuring a biosignal.

1. Field of the Invention
The present invention relates to a circuit and method for compensating for an electrode motion artifact in which the electrode motion artifact is generated because impedance between a subject and a measuring electrode changes during measurement of the subject's biosignal, and the electrode motion artifact can be differentially measured and an electrocardiogram signal can be adjusted by introducing a predetermined voltage Vc or an electric current Vi into the subject.
2. Description of Related Art
A biometric measurement device can collect and analyze a minute action current, an electrical change of the action current, and the like. An action current is generated within a subject, such as from the heart of a human body. A biometric measurement device can indicate various biometric information about a corresponding subject in forms that a predetermined medical examiner can recognize. The biometric measurement device connects an electrode and a subject that is a target for medical test and interprets the change of a voltage measured by the electrode to collect a biosignal.
In this case, the biometric measurement device has to physically contact the electrode on the surface of the subject to collect a biosignal. Accordingly, the change of impedance between the subject and the electrode inevitably occurs because of the characteristics in which the subject continually moves and the problem in which the electrode misses a predetermined measurement point.
The change of impedance may function as noise, such as an electrode motion artifact, with respect to biosignals collected in the biometric measurement device. Accordingly, the change of impedance may distort a waveform with respect to measurement results or interfere with measurement of generated information.
The most obvious case of the electrode motion artifact described above is when the attachment of an electrode is faulty. As an example of a configuration for recognizing the fault, U.S. Pat. No. 5,632,280 (hereinafter, referred to as 'conventional art') discloses a circuit monitoring whether the attachment of the electrode is faulty by using an amplifier having a gain of one and a voltage source. It is illustrated in FIG. 1.
FIG. 1 is a diagram illustrating monitoring with respect to a faulty attachment of an electrode in the conventional art.
As illustrated in FIG. 1, unidirectional electric current Ip is supplied to a plurality of electrodes in the conventional art. In the conventional art, output signal Vi may be calculated by 'Vi=Vprobe+Ip*(Rf1+Rf2+Rp)+Ip*(Z1+Z2)'. Also, an impedance component between electrodes and skin is measured by 'Z1+Z2'. Accordingly, it is possible to monitor whether the attachment of an electrode is a fault by using the change of the impedance component 'Z1+Z2'.
However, since a biosignal is differentially measured, an impedance component substantially contained in the biosignal, such as a component of electrode motion artifact, may be defined by the impedance difference between electrodes, such as Z1−Z2. Accordingly, the electrode motion artifact has to be removed. However, a method of measuring impedance component 'Z1+Z2' may not remove electrode motion artifact 'Z1−Z2' from the differentially measured biosignal.

Circuit and method for compensating for an electrode motion artifact


A camera (1) for monitoring a monitored area (2), including a camera sensor (4) for generating at least one unmasked surveillance image (6) of the monitored area (2) and/or of a subarea of the monitored area (2), the camera sensor (4) being configured for providing raw data, the raw data encompassing the at least one unmasked surveillance image (6), and including an integrated evaluation unit (5), the evaluation unit (5) encompassing an input interface (8) for receiving the raw data and encompassing an output interface (17) for providing output image data.

Cameras may be utilized for the monitoring of monitored areas. For example, production facilities are monitored, whereby the right of the employees in the production facility to the protection of personal rights may be extremely limited. By comparison, computer vision applications have evolved so far that camera monitoring represents a cost-effective approach to process monitoring.
Video monitoring systems may resort to blocking sensor systems, such as photoelectric barriers and inductive switches, in order to switch off cameras if a person is present in the monitored area.
Publication DE 10 2008 007 199 A1, which may be related art, discusses a masking module for a monitoring system, the monitoring system including at least one monitoring camera and being suitable and/or situated for observing monitored areas encompassing moving objects, including a selection unit for selecting objects as selection objects, the masking module being configured for outputting selection objects or portions thereof in a masked manner.

Camera for monitoring a monitored area and monitoring device, and method for monitoring a monitored area


This invention relates to a storage stable, aqueous, herbicidal formulation containing an ultra-high concentration of glyphosate in the isopropylamine, potassium or mixed salt form in combination with a surfactant system, to a method of making the formulation, and to a method of treating unwanted vegetation employing the formulation. The surfactant system employed in the concentrate comprises dialkoxylated alkylamine, water miscible solubilizer and amine oxide. The surfactant system unexpectedly permits the formulation of storage stable, ultra-high loaded aqueous glyphosate salt concentrates possessing high or no cloud points.

N-phosphonomethylglycine, commonly referred to as glyphosate, is well known in the art as a post emergent foliar applied herbicide. When glyphosate formulations are applied to green leaves or stems, glyphosate moves through the plant so the entire plant dies. Glyphosate works by disrupting a plant enzyme, EPSP synthase, involved in the production of amino acids that are essential to plant growth. Since the enzyme is not present in humans or animals glyphosate has very low toxicity to humans or animals.
The free acid form of glyphosate has the following structure:
In the free acid form, glyphosate has low water solubility. Accordingly, glyphosate is typically formulated and applied in the form of a water soluble agriculturally acceptable salt. Monobasic, dibasic and tribasic salts of glyphosate can be made, but the monobasic salts are generally preferred. The most widely employed salt of glyphosate is the isopropylamine salt. The salts of glyphosate are generally prepared by partial or complete neutralization of the acid with an appropriate base. Methods for making glyphosate and its salts are known and are disclosed in, e.g., U.S. Pat. Nos. 4,965,403, 4,481,026, 4,405,531, 4,315,765, 4,140,513, 3,977,860, 3,853,530 and 3,799,758, the entire contents of which are incorporated by reference herein for their teachings of such methods. Glyphosate salt formulations are provided in concentrate, dilute (ready to use) and solid (granulate) forms.
Surfactants have been employed as adjuvants in glyphosate salt formulations to enhance herbicidal effectiveness. Surfactants facilitate adherence of the formulations to the surfaces of leaves and thus enhance penetration. The surfactant may be blended with the glyphosate salt in the concentrate or solid forms or may be added by the user to the diluted spray solution. Cationic surfactants, in particular, have found widespread use in glyphosate salt formulations. Examples are long-chain (typically C12 to C18) tertiary alkylamine surfactants and quaternary alkylammonium surfactants. U.S. Pat. No. 7,135,437 discloses that an especially common tertiary alkylamine surfactant employed in aqueous solution concentrate formulations of glyphosate isopropylammonium salt has been the very hydrophilic surfactant diethoxylated tallowamine having in total about 15 moles of ethylene oxide. The patent further discloses that such surfactants are "highly incompatible" with aqueous solutions of glyphosate potassium salt. The patent cites PCT Publication No. WO 00/15037 for its teaching that alkoxylated alkylamine surfactants possess low compatibility with high-strength glyphosate concentrates in general.
U.S. Pat. No. 5,668,085 describes how it has been found desirable in certain applications to employ somewhat less hydrophilic alkylamine surfactants, such as one having about 8 or fewer alkoxy groups. This patent discloses aqueous compositions comprising such surfactants in combination with the isopropylamine, ammonium or potassium salts of glyphosate. The highest concentration of glyphosate in the potassium salt formulations shown in Table 3 of the patent is 300 g glyphosate salt a.e./l, with a weight ratio of glyphosate a.e. to surfactant of 2:1.
It is advantageous to produce a fully formulated product as quickly as possible for shipment and delivery to the market. For glyphosate formulations, this means that glyphosate acid (N-phosphonomethylglycine) is reacted with base to form the salt and surfactant is thereafter brought into contact with the resulting glyphosate salt formulation. However, the exothermic reaction of glyphosate acid and base releases heat, raising the temperature of the solution to about 75° C. If the surfactant is added to the "hot" glyphosate salt when the temperature of the solution is above the cloud point of the surfactant/glyphosate salt blend the mixture will form two phases with the less dense surfactant phase separating to the top of the vessel, e.g., tank, rail car, which is used to transport the surfactant/glyphosate salt blend. Cloud point is the temperature where a solution first turns cloudy when heated. The cloudiness is the result of the surfactant no longer being soluble in the solution, and thus begins to agglomerate with itself. Left at the temperature where the solution is cloudy, eventually all of the surfactant would agglomerate together and the solution would separate into two layers. To overcome this, one must wait for the reaction product to cool down sufficiently below the cloud point of the final mixture. It is therefore advantageous to provide a glyphosate/surfactant formulation containing a high cloud point (or no cloud point) which would obviate the necessity of waiting for the temperature of the glyphosate salt reaction product to cool down. It is also advantageous to provide a formulation that is stable at low temperatures typically encountered during shipment and storage, particularly during the early spring months when market demand for glyphosate is at its highest.
It is also advantageous to provide formulations wherein glyphosate salt is present in high concentrations. Concentrates containing high loadings of glyphosate salt reduce shipping costs and enable large volumes of dilute spray formulations to be prepared by the end user upon simple addition of water. The solubility of glyphosate potassium salt in water is about 61% by weight, or about 50% by weight glyphosate acid equivalent (a.e.). The solubility of the isopropylamine salt of glyphosate in water is very similar to that of the potassium salt, i.e., about 63% by weight, or about 47% by weight glyphosate acid equivalent. Above these limits of solubility, the formulation turns solid. It can be seen, therefore, that there is a practical upper limit on how high the formulator can go in terms of preparing concentrates having high loadings of glyphosate salt.
It is also advantageous to provide aqueous glyphosate concentrates containing lower concentrations of surfactant compared to industry standards while maintaining similar levels of herbicidal activity as compared to the industry standards. Lower surfactant use levels improve the value proposition for end users, as less surfactant is employed to achieve similar levels of control.
It is generally known in the art that certain commonly employed glyphosate adjuvants exhibit a tendency to cause eye irritancy. For example, it is known that glyphosate formulations containing diethoxylated tallowamine can cause eye irritation. It is advantageous to provide aqueous glyphosate concentrates containing surfactant systems that possess eye irritancy profiles lower than current industry standards.
U.S. Pat. No. 5,710,103 discloses glyphosate formulations containing at least one water-soluble long chain aliphatic hydrocarbyl dimethyl amine oxide and at least one water-soluble quaternary ammonium halide.
WO 2006/041702 discloses ultra-high loaded glyphosate concentrates having cloud points greater than 90° C. comprising glyphosate isopropylamine salt in an amount greater than about 580 g/L a.i., tallowamine alkoxylate and an ethylene diamine alkoxylate.

Ultra-high loading glyphosate concentrate


An apparatus for unloading belly dump trucks into piles comprises a ramp onto which the unloading truck drives, a hopper for reception of dumped material, and a conveyor running under the hopper and onto a side conveyor arm for disposal of the material The conveyor arm can be raised and lowered and collapsed for transport An engine for powering the apparatus is disposed oppositely of the conveyor arm, and can be moved toward and away from the ramp for transport and operation, respectively. Rear wheel assemblies comprise a plate slidably mounted to the side of the ramp which can raise and lower the ramp. A steerable front wheel assembly can be raised and lowered for removal of the apparatus from the towing truck and local movement of the apparatus.

"Belly dump" trucks, i.e., trucks which empty their load through the bottom or "belly" of the truck, have become popular for hauling various products because of certain advantages that they have over conventional end dump trucks. The contents of a belly dump truck are often more conveniently and efficiently loaded and unloaded and transported. Instead of tipping back the loaded portion of the truck to dump out from its end, the belly dump truck simply opens doors located underneath the bed, i.e., in the "belly" of the truck, allowing its contents to exit through the force of gravity.
In contrast to end dump trucks, belly dump trucks usually dump their contents while moving, leaving a continuous pile or trail of material. End dump trucks dump while stationary, and when the pile reaches such a height that the material will no longer leave the truck, the bed is lowered and the truck is moved to an adjacent location to dump another installment of its contents. This process is repeated until the truck is fully emptied, resulting in a series of large piles of material.
Though belly dump trucks often have clear advantages of efficiency, cost, and time effectiveness, they have a distinct disadvantage when large piles of material are more desirable than trails. For example, in the road construction industry belly dump trucks are frequently used to transport "chip" and related material, chip being the gravel or crushed rock which is placed on the road to strengthen and reinforce the asphalt placed thereon. The road laying machinery requires the chip to be in piles such as result from the discharge of end dump trucks. When belly dump trucks are used to haul the chip, their mode of discharge requires further handling of the chip to get it from a trail into piles. When the chip contacts the ground in a trail, however, it is contaminated with dirt, foreign rock material, and other substances which get mixed in the pile of chip and compromise its purity. This not only lessens the quality of the road, it increases the likelihood that the chip will be rejected upon inspection by the client (usually a state road commission), requiring the contractor to bring in a new load. In gathering the chip into piles, therefore, large amounts of chip must be left on the ground to avoid contamination, increasing expense.
There is needed, therefore, an apparatus for unloading a bottom loader which loads the material into piles ready for subsequent use by other machinery, combining the advantages of an end dump truck and a belly dump truck.
On occasion it is also desirable to empty a truck directly into a railcar or other container, which belly dump trucks are presently unable to do.
Warner, U.S. Pat. No. 3,378,152, describes a truck loader onto which trucks drive and unload their contents, whether they be end or belly dump trucks. It provides for a ramp moved by track machinery onto which the trucks drive, and a hopper in the ramp into which the trucks dump their contents, after which the material is transferred to a conveyor which carries it directly to the road laying machinery. The apparatus is not easily transported from job to job, since the track transport system is necessarily slow. This would require that the apparatus be moved by crane or other means into a tractor-trailer or similar transport device to move the apparatus to a different job site. Even if the apparatus were driven under its own power, its width would constitute a problem on highways.
Other devices of interest in the art include Silver, U.S. Pat. No. 3,606,050, and White, U.S. Pat. No. 671,122.


The present invention presents a method and apparatus for reducing charging damage to a substrate is described. In particular, a method of operating a plasma processing system is described that leads to the removal of, or significant reduction of, the accumulated charge on the substrate.

The fabrication of integrated circuits (IC) in the semiconductor device manufacturing industry typically employs plasma to create and assist surface chemistry necessary to remove material from and deposit material to a substrate. In general, plasma is formed within a plasma processing system under vacuum conditions by heating electrons to energies sufficient to sustain ionizing collisions with a supplied process gas. Moreover, the heated electrons can have energy sufficient to sustain dissociative collisions and, therefore, a specific set of gases under predetermined conditions (e.g., chamber pressure, gas flow rate, etc.) are chosen to produce a population of charged species and chemically reactive species suitable to the particular process being performed within the processing system (e.g., etching processes where materials are removed from the substrate or deposition processes where materials are added to the substrate).
Subsequent to the use of plasma for IC fabrication, plasma charging damage has posed a very serious threat to the yield of acceptable devices when exposed to a processing plasma. As described above with regards to plasma processing, highly energetic particles, such as different ions, electrons, and photons, bombard the surface of the substrate and, depending on the nature of the material structures formed on the substrate, this energetic interaction with the substrate surface can lead to non-homogeneous charge accumulation and other forms of structural damage, either of which can be catastrophic to the ICs formed thereon. For example, substrate charging damage can manifest as physical damage to crystalline silicon by energetic ions, or electrical damage to SiO2.
Moreover, as described above, substrate charging damage can arise from non-homogeneous charge accumulation due to, for example, electron shading. Electron shading generally occurs when etching high aspect ratio contacts/vias or trenches in dielectric materials and, more recently, electron shading damage has been further exacerbated due to the continual reduction in feature size, and consequent increase in feature aspect ratio. During electron shading, electrons, being mostly isotropic in directionality, tend to have difficulty reaching the bottoms of high aspect ratio features and, therefore, they tend to accumulate at the tops of high aspect ratio features. Conversely, ions are mostly directional and tend to reach the bottoms of these features, hence, leading to electric fields induced by charge separation.
Furthermore, a non-homogeneous charge accumulation can arise from the development of a non-homogeneous plasma in electrical contact with the substrate surface. Consequently, static electric fields can develop laterally across the substrate surface, and they can become of sufficient strength to cause electrical breakdown.
In either case, the formation of static electric fields on the substrate can be sufficient to cause electrical breakdown (or arcing) in more extreme cases, and reduced IC lifetime in less extreme cases, each of which is capable of reducing IC yield.

Method and apparatus for reducing substrate charging damage


An exemplary method includes detecting a request to launch an application on a device, accessing metadata associated with the application over a network, using the metadata to determine whether sufficient resources are available to launch the application on the device, and performing at least one action based on said determination. The at least one action may include launching the application on the device when sufficient resources are available or blocking a launch of the application on the device when sufficient resources are not available. In certain embodiments, the method is performed by the device. In certain embodiments, the device includes a set-top box configured to access a media service over the network. Corresponding methods, systems, apparatuses, and computer-readable media are also disclosed.

A set-top box ("STB") is typically used by an end user to access media services and content provided over a media network such as a subscriber television network. Conventional STBs have limited resources, however. Typically, STB resources, such as memory and processing resources, are dedicated to operations of a main application resident on an STB. This significantly limits the ability of an STB to compile and/or run other applications, especially applications that require a virtual machine and/or an interpreter to be run on the STB.

Application launcher systems, methods, and apparatuses


A tool holder includes two opposite surfaces, a number of openings formed in the tool holder for receiving tools, and one or more projections formed in the tool holder for engaging with the tools so as to retain the tools in the openings, the openings are extended through the tool holder and opened in both of the opposite surfaces such that the tools can be easily reached from either side of the tool holder.

The present invention relates to a holder, and more particularly to a tool holder.
2. Description of the Prior Art
Typical tool holders, particularly the tool holders for holding sockets or wrenches, include a two part housing having a plurality of recesses formed therein for receiving the sockets and the wrenches, however, the sockets and the wrenches have only part of the outer surfaces thereof exposed, such that the sockets and the wrenches can not be easily taken out from the recesses.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages of the conventional tool holders.


A receiver IC provided with a SAW-based oscillator with an external SAW device. The receiver IC comprises an oscillating circuit. The oscillating circuit comprises an inverter stage, a first capacitor, a second capacitor, and a resistor. The inverter stage has input and output terminals respectively coupled to two ends of the external SAW device. The first and second capacitors are respectively coupled between the input/output terminal and a ground. The resistor is coupled between the input and output terminals of the inverter stage.

1. Field of the Invention
The invention relates to a receiver and, in particular, to a receiver IC with a SAW-based oscillator.
2. Description of the Related Art
In wireless communication, radio frequency integrated circuits (RFICs) are used in keyless entry systems, remote control systems, alarm systems, security systems, wireless sensors and the like. A receiver is an indispensable element in an RFIC.
A receiver typically comprises a local oscillator. The local oscillator generates a signal which is injected into a mixer along with a signal from an antenna. Thus, signals with frequencies equivalent to sum and difference in frequencies of the injected signals are generated by syperheterodyne. A frequency of one of the signals from the mixer falls in an intermediate frequency (IF) band. The signal in the IF band is processed by a demodulator and an output signal is generated.


A metal line of a semiconductor device comprising contact plugs, a plurality of first trenches, first metal lines, a plurality of second trenches, and second metal lines. The contact plugs are formed over a semiconductor substrate and are insulated from each other by a first insulating layer. The plurality of first trenches are formed in the first insulating layer and are connected to first contact plugs of the contact plugs. The first metal lines are formed within the first trenches and are connected to the first contact plugs. The plurality of second trenches are formed over the first metal lines and the first insulating layer and comprise a second insulating layer connected to second contact plugs of the contact plugs. The second metal lines are formed within the second trenches and are connected to the second contact plugs.

The present invention relates, in general, to semiconductor devices and, more particularly, to a metal line of a semiconductor device and a method of fabricating the same, which can be applied to a bit line formation process of flash memory devices.
As the integration of flash memory gradually increases, the dimension of devices also decreases. In recent years, the loading capacitance of flash memory between bit lines is very high since the pitch of the bit line is very small. In particular, in a page buffer having a pitch smaller than that of a cell, loading capacitance between bit lines is very high. Thus, as interference between neighboring bit lines, a reduction in the cell current and the operating speed occur. Further, as the pitch of the bit line decreases, a bit line bridge phenomenon in which neighboring bit lines are adhered together can occur.

Metal line of semiconductor device and method of fabricating the same


A display control device is provided to realize a bypass function of a display controller by using fewer chip select signal lines without causing a malfunction. In the display control device, bypassing a display controller is realized by using one chip select signal line and one signal line for the general ports provided to a host. Therefore, bypassing the display controller can be realized by using fewer chip select signal lines. In addition, malfunctioning is prevented when a bypass mode is provided because the switching to/from the bypass mode and the transmission of the CS signal are not performed by one common chip select signal line.

1. Field of the Invention
The present invention relates to a display control device, controlling a display via a display driver.
2. Description of the Related Art
Conventionally, in devices such as cellular phones equipped with an LCD (Liquid Crystal Display) panel, the LCD panel is directly controlled by a display driver (hereinafter, simply referred to as a "driver"). In the basic configuration, the driver is controlled by a host equipped with a CPU (Central Processing Unit). However, recent cellular phones and the like have increased and sophisticated functions, and as a result, loads on hosts have become excessive.
For this reason, a configuration wherein the display controller takes part of the functions from the host has been increasing. The display controller is provided between the host and the driver, and is a device to perform part of the processing which the host has conventionally performed when the host outputs a control signal to the LCD panel, in place of the host. More specifically, the display controller takes functions to receive instructions from the host, to perform predetermined processing such as changing image size, and to output image data to the driver.
As for devices such as cellular phones equipped with a display controller in this way, when the display controller is not in use to provide power savings, the display controller is placed into a halt state (a state that a clock in the display controller is in a halt state). On the other hand, even when the display controller is in a halt state in such a case, a small amount of data may need to be discretely transmitted to the driver from the host. For example, a case that updating an indicator, indicating a radio wave receiving state, by only one scale in the whole screen on a display of cellular phone.
In such a case, in order to access the driver from the host with the display controller in a halt state, a bypass function is provided to transmit a signal through the display controller. FIG. 6 is a diagram showing a conventional display control device 100 equipped with a bypass function.
In FIG. 6, a host 110 is coupled to a display controller 120 by a chip select signal line (hereinafter, referred to as "CS signal line") and a sub-chip select signal line (hereinafter, referred to as "SCS signal line"). Furthermore, the display controller 120 is coupled to a driver 130 by a data signal line and a chip select signal line (hereinafter, referred to as "FPCS signal line"). Therefore, the host 110 can output a signal to the driver 130 only through the display controller 120.
As for the configuration shown in FIG. 6, when the display controller 120 is not in a halt state and a CS signal (chip select signal) is outputted to the display controller 120 from the host 110, the display controller 120 generates a signal (FPCS signal) corresponding to the CS signal in a computing unit 121 and outputs it to the driver 130.
On the other hand, when the display controller 120 is in a halt state, even when the CS signal is inputted from the host 110, the FPCS signal is not generated because the display controller 120 is in a halt state, therefore, the signal from the host 110 is not outputted to the driver 130. Thus, a selector 122 is provided in the display controller 120 and the selector 122 is set to a non-bypass mode (a state in which a bypass is not performed) in states other than the halt state, and the signal from the computing unit 121 in the display controller 120 is outputted to the driver 130.
When an access to the driver 130 from the host 110 is required in the halt state, the host 110 switches the selector 122 to the bypass mode (a state in which a bypass is performed) to pass the SCS signal (sub-chip select signal) outputted from the host 110, as it is, and outputs it to the driver 130.
However, according to the above-described scheme, the use of two CS signal lines (the chip select signal line and the sub-chip select signal line) is required so that the host 110 controls the display controller 120. Because the number of CS signal lines provided for the host 110 are limited, it is preferable that similar control is performed by using fewer of the CS signal lines.
Thus, outputting the above-described CS signal and SCS signal to the display driver 130 from the host 110 by using one CS signal line is considered. FIG. 7 is a diagram showing a configuration of a display control device 200 outputting the CS signal and the SCS signal by one common CS signal line. In FIG. 7, the host 210 is coupled to the display controller 220 by a CS signal line and outputs a CS signal and a SCS signal to a display controller 220 by the CS signal line. Furthermore, the display controller 220 is coupled to a driver 230 by a data signal line and a FPCS signal line. Except for the above-described configuration, each function unit in the display control device 200 is similar to the corresponding unit in the display controller 100 shown in FIG. 6.
As for the display control device 200 shown in FIG. 7, when a switching signal to the bypass mode is outputted by the CS signal line during the non-bypass mode, a selector 222 in the display controller 220 is switched to the bypass mode, and after that, the SCS signal outputted from the host 210 is outputted to the driver 230.
On the other hand, when switching to the non-bypass mode during the bypass mode, the host 210 outputs a signal for switching the selector 222 in the display controller 220 from the bypass mode to the non-bypass mode to the display controller 220. However, at this time, the selector 222 is in the bypass mode. Therefore, the signal for switching may be bypassed and outputted to the driver 230 due to a time lag when the selector 222 is switched. When the switching of the bypass mode and the transmission of the CS signal are performed by one common chip select signal line, the signal for switching the bypass mode becomes noise, which causes an LCD panel or the like to malfunction.
A related drive control of an LCD panel is disclosed in Japanese laid-open patent publication No. H7-239674.
The related art described in Japanese laid-open patent publication No. H7-239674 concerns solving a problem of signal processing of a driver, controlling an LCD panel, but it does not solve the above-described problem on a display controller. Thus, it has been difficult to realize a bypass function by using fewer of the chip select signal lines without causing a malfunction in the display controller.
Therefore, an object of the present invention is to realize a bypass function for a display controller by using fewer of chip select signal lines without causing a malfunction.


Disclosed are systems, computer-readable mediums, and methods for managing input-output operations within a system including at least one client and a storage system. A processor receives information regarding allocated input-output operations (IOPS) associated with a client accessing a storage system storing client data. The information includes a number of allocated total IOPS, a number of allocated read IOPS, and a number of allocated write IOPS. The processor also receives a requested number of write IOPS associated with the at least one client's request to write to the storage system. The processor determines a target write IOPS based on the number of allocated total IOPS, the number of allocated write IOPS and the requested number of write IOPS, and executes the determined target write IOPS within the first time period.

The following description is provided to assist the understanding of the reader. None of the information provided is admitted to be prior art.
In data storage architectures, a client's data may be stored in a volume. The client can access the client data from the volume via one or more volume servers coupled to the volume. The volume servers can map the locations of the data specified by the client, such as file name, drive name, etc., into unique identifiers that are specific to the location of the client's data on the volume. Using the volume server as an interface to the volume allows the freedom to distribute the data evenly over the one or more volumes. The even distribution of data can be beneficial in terms of volume and system performance.
Read and write requests of the client are typically transformed into read and/or write input-output operations (IOPS). For example, a file read request by a client can be transformed into one or more read IOPS of some size. Similarly, a file write request by the client can be transformed into one or more write IOPS.

This patent is subject to a terminal disclaimer.


The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

A conventional component-embedded printed wiring board (PWB) is described hereinafter. FIG. 24 shows a structure of the conventional PWB which includes electronic components built therein. As shown in FIG. 24, the conventional PWB comprises plate 1 made of metallic material, and substrates 2a-2e formed of thermoplastic resin and layered over metallic plate 1.
Holes 4 are opened through substrates 2c and 2d for embedding electronic component 3. Patterns 5 are provided on substrates 2a-2e, and via-holes 7 opened through substrates 2a-2e are filled with conductive paste 6. Electrodes 8 placed at both sides of component 3 are conductive to paste 6.
Conductive paste 6 is made by mixing tin grains with silver grains. Between component 3 and holes 4, clearance of 20 μm is provided surrounding component 3 for accurately positioning electrodes 8 with respect to via-holes 7 filled with paste 6. Thus it can be said that the outside dimension of component 3 is approx. equal to 20 μm.
The foregoing conventional PWB undergoes pressing and heating at 1-10 Mpa, 250-350° C. and in 10-20 minutes before completed. In other words, this pressing and heating process melts the tin to be unified with silver, and connects the tin to electrodes 8 of component 3 for fixing component 3 electrically and mechanically. The conventional component-embedded PWB is disclosed in, e.g. Japanese Patent Unexamined Publication No. 2003-86949.
The conventional PWB, however, has the following problem if components 3 are densely mounted. For instance, as shown in FIG. 25, electronic components 3a-3e are mounted at a narrow pitch to substrate 2c, and assume that an interval between the components adjacent to each other is 100 μm. FIG. 26A shows sectional views of substrates 2c and 2d, and FIG. 26B shows an enlarged view of the vicinity of components embedded. As shown in FIGS. 26A and 26B, width W1 of frame 10a placed between electronic components 3a and 3b is found by equation 1.W1=W0−W2×2  (1)
where W2 is, e.g. a distance between component 3a and substrate 2c surrounding component 3a. In this case, since W0=100 μm and W2=20 μm, W1 becomes 60 μm, i.e. the width of frame 10a is 60 μm.
Thickness T1 of substrate 2c is 75 μm, so that width W2 of frame 10a becomes smaller than thickness T1 of substrate 2c, and it becomes physically difficult to manufacture this conventional PWB.
To overcome this problem, holes 13 surrounding components 3a-3e mounted at narrow pitches can be provided as shown in FIG. 27 (plan view) and FIG. 28 (sectional view). In this case, however, space 14a between components 3a and 3b cannot be filled sufficiently with resin 15, so that air 16 sometimes remains. If substrate 2c in this status undergoes soldering in a reflow-oven, the reflow-temperature expands air 16 for applying heavy load between components 3a and 3b. The load has the possibility of damaging the connection of component 3, to be more specific, the conduction of paste 6 is cut, or component 3 sealed with resin produces cracks into which water leaks for rusting electrodes 8 and causing defective insulation.

Method of manufacturing component-embedded printed wiring board


An antenna cosite analysis system with: interactive displays for i) designing an antenna tower for placement of one or more antennas on the tower, ii) designing wireless communication circuits, and iii) relating the antennas on the tower to the wireless communication circuits; and an RF analysis system for analyzing interference between the wireless communication circuits. A process for determining intermodulation interference between transmitters and one or more receivers includes the steps of: determining a minimum susceptibility of the receivers; determining a highest order intermodulation product generated as a result of interference between the victim transmitter and each other transmitter with a power level sufficient to exceed the minimum susceptibility of the one or more receivers at the victim transmitter; and determining the intermodulation products generated as a result of interference between the victim transmitter and the other transmitters, the intermodulation products being determined up to the highest order intermodulation product of a minimum leakage transmitter-victim transmitter pair. Also disclosed is a process for determining intermodulation interference in a receiver, an apparatus for determining intermodulation interference in transmitter, and an apparatus for determining intermodulation interference in a receiver.

1. Field of the Invention
The present invention relates generally to an antenna cosite analysis system, and more particularly to an antenna cosite analysis system that is integrated with a tower and antenna layout system so as to enable more efficient design of antenna towers. The invention also relates to a faster antenna cosite analysis system in which intermodulation products that are not capable of causing interference are not processed.
2. Description of the Related Art
Antennas for wireless communication systems are often positioned on towers to improve the operating distance of the systems. Cellular telephone, AM/FM radio, paging services, and mobile telephone are just a few examples of wireless systems that utilize tower-mounted antennas. In order to reduce the cost of maintaining such towers and of operating wireless services, it is preferable for as many wireless systems as possible to use a given tower.
When multiple transmitters, receivers, and/or antennas are located on a tower, several types of interference may occur. Intermodulation occurs when the RF signal from one transmitter at the site leaks into other transmitters or receivers at the site causing intermodulation products to be generated. If the intermodulation products occur in a transmitter, they may escape from the transmitter and cause interference in the receivers at the site.
Another type of interference occurs when noise from the transmitters at the site interferes directly with the receivers at the site. A still further type of interference occurs when the power of the transmitters leaks into the receivers, thereby desensitizing the receivers.
Systems have been developed that predict the extent of interference between transmitters and receivers at a shared radio site. Such systems are described, for example, in the following documents, the contents of which are incorporated herein by reference for all purposes:
1) M. N. Lustgarten, "COSAM (Co-site Analysis Model)," IEEE Electromagnetic Compatibility Symposium Record, Anaheim, Calif., pp. 394-406, July 1970; PA1 2) J. W. Rockway, and S. T. Li, "Design Communication Algorithm (DECAL)," IEEE International Symposium on Electromagnetic Compatibility, Atlanta, Ga., pp. 288-292, June 1978; PA1 3) L. C. Minor, F. M. Koziuk, J. W. Rockway, and S. T. Li, "PECAL: A New Computer Program for the EMC Performance Evaluation of Communication Systems in a Cosite Configuration," IEEE International Symposium on Electromagnetic Compatibility, Atlanta, Ga., pp. 295-301, June 1978; PA1 4) P. Alexander, P. Magis, J. Holtzman, S. Roy, "A methodology for interoperability analysis," IEEE Military Communications Conference (MILCOM 89), Boston, Mass., pp. 905-910, October 1989; PA1 5) J. Low and A. S. Wong, "Systematic approach to cosite analysis and mitigation techniques," Proceedings of the Tactical Communications Conference, vol. 1, pp. 555-567, April 1990; and PA1 6) ComSitePlus User Manual, Douglas Integrated Software, Tallahassee, Fla., 1995. PA1 means for interactively designing an antenna tower for placement of one or more antennas on the tower; PA1 means for interactively designing wireless communication circuits; PA1 means for interactively relating the antennas on the tower to the wireless communication circuits; and PA1 RF analysis means for simulating the wireless communication circuits with their related antennas and for generating reports on the possible interference between the wireless communication circuits. PA1 a) at each transmitter, determining a minimum susceptibility to interference of the receivers; PA1 b) separately considering each transmitter as a victim transmitter paired with each other transmitter, and for each such other transmitter-victim transmitter pair, determining a highest order intermodulation product generated as a result of interference between the victim transmitter and the other transmitter with a power level sufficient to exceed the minimum susceptibility of the one or more receivers at the victim transmitter, and storing the highest order intermodulation product for each other transmitter-victim transmitter pair; and PA1 c) separately considering each transmitter as a victim transmitter, and for each victim transmitter determining the intermodulation products generated as a result of interference between the victim transmitter and all of the at least one other transmitters each other transmitter having a leakage power to the victim transmitter, the one of the at least one other transmitters having the lowest leakage power to the victim transmitter being the minimum leakage transmitter for that victim transmitter, the minimum leakage transmitter and the victim transmitter together constituting a minimum leakage transmitter-victim transmitter pair, the intermodulation products for each victim transmitter being determined in this step up to the highest order intermodulation product determined in step (b) for the other transmitter-victim transmitter pair that is the same as the minimum leakage transmitter-victim transmitter pair. PA1 for each individual transmitter at each order, determining the power level P.sub.INTatTX for such transmitter as sum of the power leakage L.sub.T2,T1 between such transmitter and the victim transmitter and the conversion loss for the victim transmitter at such order; and PA1 comparing the power level P.sub.INTatTX to the minimum susceptibility at the victim transmitter. PA1 a) determining a minimum susceptibility to interference of the receiver; PA1 b) for each transmitter, determining a highest order intermodulation product generated as a result of interference between the transmitter and the receiver with a power level sufficient to exceed the minimum susceptibility of the receiver, and storing the highest order intermodulation product for each transmitter; and PA1 c) separately considering each transmitter as a victim transmitter, and for each victim transmitter determining the intermodulation products generated in the receiver as a result of interference between the victim transmitter and all of the at least one other transmitters each at least one other transmitter having a leakage power to the victim transmitter, the one of the other transmitters having the lowest leakage power to the receiver being the minimum leakage transmitter, the intermodulation products being determined in this step up to the highest order intermodulation product of the minimum leakage transmitter determined in step (b) PA1 means for determining a minimum susceptibility to interference of the one or more receivers at each transmitter; PA1 means for separately considering each transmitter as a victim transmitter and for determining and storing a highest order intermodulation product generated as a result of interference between the victim transmitter and each other transmitter individually with a power level sufficient to exceed the minimum susceptibility at the victim transmitter; and PA1 means for separately considering each transmitter as a victim transmitter and for determining the intermodulation products generated as a result of interference between the victim transmitter and all of the at least one other transmitters each other transmitter having a leakage power to the victim transmitter, the one of the at least one other transmitters with the lowest leakage power to the victim transmitter being the minimum leakage transmitter, the intermodulation products being determined up to the highest order intermodulation product stored for the minimum leakage transmitter and victim transmitter. PA1 means for determining a minimum susceptibility to interference of the receiver; PA1 means for determining and storing, for each transmitter, a highest order intermodulation product generated as a result of interference between the transmitter and the receiver with a power level sufficient to exceed the minimum susceptibility of the receiver; and PA1 means for separately considering each transmitter as a victim transmitter and for determining the intermodulation products generated in the receiver as a result of interference between the victim transmitter and all of the at least one other transmitter, each other transmitter having a leakage power to the victim transmitter, the one of the at least one other transmitters having the lowest leakage power to the receiver being the minimum leakage transmitter, the intermodulation products being determined up to the highest order intermodulation product of the minimum leakage transmitter.
When the interference between the communication circuits on a tower exceeds a desired threshold, the antennas, transmitters and receivers at the site may be relocated or additional filtering elements may be added to the communication circuits in order to reduce the interference to within acceptable limits.
In general, the calculation of direct interference between transmitters and receivers, i.e., non-intermodulation interference, is relatively simple and will not be discussed herein in further detail. The computation of intermodulation interference, however, will be described with respect to a typical antenna site containing .alpha. number of transmitters and .beta. number of receivers, as shown in FIG. 1. In a conventional cosite analysis system, each intermodulation product frequency F.sub.INT and each intermodulation product bandwidth BW.sub.INT is calculated as follows: EQU F.sub.INT =.+-.M.sub.1 .times.F.sub.T1 .+-.M.sub.2 .times.F.sub.T2 + . . . .+-.M.sub..alpha. .times.F.sub.T.alpha. EQU BW.sub.INT =M.sub.1 .times.BW.sub.T1 +M.sub.2 .times.BW.sub.T2 + . . . +M.sub..alpha. .times.BW.sub.T.alpha.
where M.sub.1,M.sub.2, . . . , M.sub..alpha. ! are positive integers.
The order of F.sub.INT is M.sub.1 +M.sub.2 + . . . +M.sub..alpha..
As shown below, each intermodulation product frequency F.sub.INT is then compared to the frequency band of each receiver to determine if the intermodulation product falls within the frequency band of any receiver. ##EQU1##
If an intermodulation product falls within the band of a receiver RX.sub..beta. (the "victim receiver") at frequency F.sub.R.beta., then the power of the intermodulation product is calculated. As illustrated in FIG. 2, for any pair of transmitters, TX.sub.1 and TX.sub.2, the power leakage L.sub.T2,T1 from TX.sub.2 to TX.sub.1 is calculated as follows: EQU L.sub.T2,T1 =P.sub.T2 -C.sub.T2,T1
where P.sub.T2 is the power of TX.sub.2 and C.sub.T2,T1 is the coupling loss from TX.sub.2 to TX.sub.1 at F.sub.T2.
The power leaking into the target transmitter TX.sub.1 from each other transmitter is calculated in a similar fashion. The transmitter with the lowest leakage power L.sub.MIN to the target transmitter is used to calculate the intermodulation product power level. EQU L.sub.MIN =min (L.sub.T2,T1, . . . , L.sub.T.alpha.,T1)
Referring to FIG. 3, the intermodulation product power level P.sub.INTatT1 at TX.sub.1 is then calculated as follows: EQU P.sub.INTatT1 =L.sub.MIN +ConversionLoss(order)+FL.sub.T1 (atF.sub.INT)
where TX.sub.1 is the victim transmitter, i.e., the transmitter in which the mixing is occurring, L.sub.MIN is the minimum power leakage as calculated above, ConversionLoss is a lookup table unique to the victim transmitter (discussed in detail below), and FL is the output filter unique to victim transmitter. Order is the order of the intermodulation product under consideration.
The intermodulation product level P.sub.INT is then calculated at victim receiver RX.sub..beta. by adding the coupling losses C.sub.T1,R.beta. between the victim transmitter TX.sub.1 and the receiver RX.sub..beta. as follows: EQU P.sub.INTatRX =P.sub.INTatTX +C.sub.T1,R.beta.
where the coupling losses C.sub.T1,R.beta. include all losses between the victim transmitter and the victim receiver.
Referring to FIG. 4, the final step in the analysis is to compare the intermodulation product power level P.sub.INTatRX at the receiver R.sub..beta. to the susceptibility to interference of the receiver S.sub.R.beta.. If P.sub.INTatRX .ltoreq.S.sub.R.beta. then interference occurs.
In prior cosite analysis systems, this process is repeated for each intermodulation product, even for those with power levels below that necessary to cause interference in the most susceptible receiver. Only once the intermodulation product frequencies have been calculated are the power levels calculated for the intermodulation products. Since the actual number of possible intermodulation product frequencies is unlimited, these systems include several provisions to limit computing time to within acceptable limits.
The first provision of those systems is to limit the number of transmitter frequencies mixing together at any given time to a relatively low number, generally two, or at most three. This is because the number of frequency combinations at a complicated site, i.e., a site with many frequencies, increases by approximately the power of the number of frequencies being mixed. For example a site with 100 transmit frequencies will have approximately 100.sup.5 -100.sup.2 .ident.100.sup.5 more combinations of 5 frequencies mixing than with combinations of two frequencies mixing. This equates to an increase of 100.sup.5 /100.sup.2 =1,000,000 times longer in analysis time.
The second provision of those systems is to compute combinations of frequencies only up to a relatively low order, usually 5.sup.th or 7.sup.th order. The number of combinations for n orders is roughly n(n-1).ident.n.sup.2. So, for example, a system that calculates combinations of frequencies up to 11 orders will have approximately 11.sup.2 /5.sup.2 .ident.5 times more combinations that a system that only calculates 5 combinations.
Because the number of intermodulation products greatly increases as higher orders of intermodulation products are considered and as intermodulation products are calculated for more combinations of transmitters, conventional systems significantly limit each of these parameters with concomitant loss of quality of the analysis. Accordingly, it would be desirable to have a cosite analysis system in which it is possible to limit the number of intermodulation products that are considered by the system, even while higher orders of intermodulation products are considered and as intermodulation products are calculated for more combinations of transmitters, so as to reduce the amount of time required to analyze a site while improving the quality of the resulting analysis.
Another aspect of cosite analysis relates to the physical placement of antennas and other equipment on the tower. Typically, a civil engineer is responsible for the physical layout of the tower, including locating equipment on the tower and preparing drawings of the tower while the above-described type of analysis of possible RF interference is being conducted. If as a result of either the RF analysis or of the physical constraints of the tower it is necessary to move a piece of equipment on the tower, the tower layout and the RF analysis must both be redone. Thus, because the layout and RF aspects of the layout are not integrated, tower design is less efficient. The RF analysis and the tower layout must also be redone if any equipment is added to or removed from the tower.
Accordingly, it would be desirable to have an antenna cosite analysis system that is integrated with a tower layout system so as to enable more efficient design of antenna towers.

Method of and apparatus for performing antenna cosite analysis


The wheelchair umbrella includes an umbrella section with a circular canopy. Such a canopy has a center region statically attached to the top ends of the arms. The apparatus further includes a pair of coextensively shaped rectilinear arms with top ends directly connected to the umbrella section, a mechanism for removably attaching bottom ends of the arms to associated ones of the handles of the existing wheelchair, a mechanism for storing and transporting the wheelchair umbrella during non-operating conditions, and a mechanism for securing the storage and transport mechanism to the existing wheelchair during operating conditions.

1. Technical Field
This invention relates to umbrellas and, more particularly, to a wheelchair umbrella for providing a barrier between a user and the sun and rain thereby allowing the user to comfortably employ an existing wheelchair in outdoor environments.
2. Prior Art
Individuals who use manual wheelchairs generally have lower extremity weakness, paralysis, or amputation, which makes walking unsafe or difficult at best. They may include individuals with spinal cord injuries, hemi-plegia and other types of paralysis, multiple sclerosis, cerebral palsy, spina bifida, arthritis, and lower limb amputations. Manual chairs have a number of advantages over power chairs, and most people prefer to use a manual chair if at all possible. In fact, according to the Center for Injury Research and Control, there are over 1.4 million wheelchair users in the United States, and about 75% of them use manual wheelchairs.
As opposed to power models, manuals have unlimited range since they are not dependent on the charge capacity of a battery, they cost less to purchase than power chairs, and they have lower maintenance costs thanks to fewer working parts and their battery-free operation. In addition, manual chairs are more discreet than power chairs since they are less bulky, and with no motor noise, they are much quieter. While it may take more work to operate a manual chair, these lightweight mobiles are getting lighter all the time, and they now require less strength and energy to push than their predecessors. While the low cost and lack of maintenance required for manual wheelchairs encompass a large part of their appeal, many patients would attest to at least one drawback to their use.
Especially for those wheelchair-bound users who enjoy spending time outdoors, having to deal with weather conditions can present challenges. Like anyone else, these consumers have to have an umbrella at the ready in order to protect themselves from sudden rain or the excessive brightness or heat of the sun. However, with the limits to their mobility requiring them to use both hands to operate the wheelchair, holding on to an umbrella while trying to do so is not only impractical, but quite impossible. As a result, many wheelchair users are forced to remain inside even on the clearest of days, unsure if the weather will suddenly change and necessitate the use of an umbrella. Obviously, it would be advantageous to provide a means for protecting wheelchair users during inclement weather conditions while they are outdoors.
U.S. Pat. No. 4,789,200 to Munguia discloses a fisherman's boat chair that is provided with a tubular support for retaining an umbrella positionable over the chair. The height of the umbrella is adjustable by the selective positioning of a pin through one of a plurality of available through-extending apertures in the support, and the shank of the umbrella is supported by the pin. Velcro strips are used to prevent umbrella rotation and withdrawal from the support after it has been placed in position. The modified chair may also include a quickly removable and attachable beverage holder. Unfortunately, this prior art example is not designed to be used by handicapped persons.
U.S. Pat. No. 5,634,650 to Hensler discloses a recreational wheelchair that has four oversized low pressure tires for use on beaches, lakeshores or other soft or rough terrain environments. The structural members of the chair are made of rugged and corrosion resistant materials such as polyvinyl chloride, stainless steel or aluminum, and the chair is designed to be submerged into water of limited depths. The chair includes a high strength box chassis, removable armrest and accessories for recreation such as an umbrella bracket, fishing rod holder, and oxygen tank mounting. Unfortunately, this prior art example is not designed to shade a user from sun or rain.
U.S. Pat. No. 6,471,289 to Aguilar discloses an umbrella attached to a chair for self-supported deployment thereof and includes a cover of fabric stretched over hinged ribs radiating from a central pole for movement from a collapsed position around the pole to an extended position from the pole to provide shade to the chair occupant. One end of the pole is pivotally mounted allowing the pole to pivot from a downwardly depending position to a generally upwardly directed position where the fabric cover may be moved to its extended shade providing position. A latch device is attached to the pole for releasably holding it in an upwardly directed position. Unfortunately, this prior art example is not designed for the unique properties of a manual wheel chair.
Accordingly, the present invention is disclosed in order to overcome the above noted shortcoming. The present invention satisfies such a need by providing an apparatus that is convenient and easy to use, lightweight yet durable in design, and designed for providing a barrier between a user and the sun and rain thereby allowing the user to comfortably employ an existing wheelchair in outdoor environments. The apparatus offers wheelchair users a simple and convenient solution to weather challenges when spending time outdoors. A durable umbrella is made expressly for manual wheelchairs, and provides sufficient protection against the damaging rays of the sun, as well as unexpected downpours of rain, in a hands-free manner. As a result, a user may comfortably operate their chairs without the hassle of trying to manage an umbrella at the same time. In this manner, a user confined to a wheelchair is able to enjoy the refreshing outdoors, without any worry about weather conditions. A handy tote is offered along with the umbrella, and a user can transport virtually any personal item. Universal in concept, a wheel chair umbrella may accommodate manual wheelchairs of virtually any size. Constructed of high quality materials, this product should withstand years of continued use. The present invention is simple to use, inexpensive, and designed for many years of repeated use.

Wheelchair umbrella and associated method


An image acquiring method of a scanned image is applying to an image reading apparatus having an automatic sheet-feeding function. The method includes the steps of: acquiring a first image at a scan region of the image reading apparatus by performing a sheet-feeding operation and an image reading operation; analyzing the first image to recognize an effective area and an ineffective area outside the effective area; and adjusting a timing for starting acquiring a second image in relation to size of the ineffective area, so as to reduce the size of the ineffective area in the second image.

1. Field of the Invention
The invention is in general related to an image acquiring method, and more particularly to an area image acquiring method of generating a precise area image of a sheet in an image reading device.
2. Prior Art
Image reading devices, such as a sheet-fed scanner, a combination of a sheet feeder and a flatbed scanner, a multi-function peripheral, a copier and the like, having the sheet-feeding functions, use similar sheet-feeding and image reading methods. As shown in FIG. 1A, for example, an image reading apparatus 10 is composed of a sheet feeder and a flatbed scanner. The sheet feeder includes a feeding roller 11, a paper tray 12 and a switch 13. The switch 13 triggers an optical sensor to send a signal to a control unit of the image reading apparatus 10. When a sheet 14 is placed on the paper tray 12, the sheet 14 actuates the switch 13 and thus the image reading apparatus 10 obtains the information that the sheet 14 is in a position to be transported by the feeding roller 11. The feeding roller 11 rotates and moves the sheet 14 towards the position opposite a scanning module 15.
Because the feeding roller 11 and the scanning module 15 are separated by a distance, as indicated by a dashed line arrow, the scanning module 15 cannot acquire an image until the sheet 14 is moved by the distance. Usually, the path length is known, and it is possible to calculate and control in advance when for the scanning module 15 to start acquiring the image.
However, because the optical sensor is controlled by the mechanical switch 13, a mechanical tolerance Δd1 between the switch 13 and the optical sensor exists. Also, the feeding roller 11 tends to be worn, resulting in an outer diameter error Δd2 which increases with the using time.
When the sheet 14 reaches the position opposite the scanning module 15, the travel error equals to (Δd1□Δd2), which is about 3 to 4 mm in length. In other words, as shown in FIG. 1B, an image 16 contains an obvious leading edge error 17.
The outer diameter error (Δd2) can be reduced by replacing the feeding roller 11, but the mechanical tolerance (Δd1) between the switch 13 and the optical sensor cannot be overcome. In addition, the outer diameter error (Δd2) of the feeding roller becomes greater with the using time.

Area image acquiring method for image reading apparatus


A steering wheel has an airbag apparatus mounted on a core metal via a horn switch mechanism for activating a horn device. The horn switch mechanism includes a supporting member that is formed of an electrically conductive material, supported on the core metal, and extends rearward, a slider that is formed of an insulating resin material, is disposed outside the supporting member to be slidable with respect to the supporting member, and urged rearward by an urging member, a cap member that is formed of an insulating resin material and covers at least a rear end of each of the supporting member and the slider, and a movable side contact that is formed of an electrically conductive metal material and disposed between the cap member and the slider. The horn switch mechanism is configured to activate the horn device.

1. Technical Field
The present invention relates to a steering wheel, in which when an impact is exerted on conveyances, such as vehicles, from the front thereof, an airbag apparatus for protecting a driver from the impact is provided.
2. Related Art
One aspect of steering wheels of such a type is for example known, in which an airbag apparatus is mounted on a core metal via a horn switch mechanism for activating a horn device as described in JP-A-2013-71626.
As shown in FIG. 12, the horn switch mechanism 50 includes a supporting member 51, a slider 52, a cap member 53 and a movable side contact 54. The supporting member 51, which is formed of an electrically conductive metal material, is locked on the core metal 55 and extends rearward. A rear end of the supporting member 51 constitutes a fixed contact 51a. The slider 52, which is formed of an insulating resin material, is slidably disposed outside the supporting member 51 and urged rearward by a spring 59. The cap member 53 is formed of an insulating resin material and covers a rear end of each of the supporting member 51 and the slider 52. The movable side contact 54 is formed of an electrically conductive metal material and disposed between the cap member 53 and the slider 54. The movable side contact 54 is electrically contacted to the horn device 57 via a bag holder 56 and the like.
In the steering wheel 58 provided with the horn switch mechanism 50, when the airbag apparatus is not pressed down, the movable side contact 54 is located rearward apart from of the fixed contact 51a of the supporting member 51. Thus, electrical communication between both contacts 51a and 54 is interrupted and thus the horn device 57 is not activated.
Contrary, when the airbag apparatus is pressed down, a force exerted on the airbag apparatus is transferred to the movable side contact 54 and the slider 52 via the cap member 53. The slider 52 is pressed by the cap member 53 and the slider 52 is slid forward against the spring 59. Also, when the movable side contact 54, together with the cap member 53, is moved forward to be contacted and electrically communicated with the fixed contact 51a of the supporting member 51, the horn device 57 is activated.
Thus, in addition to exhibiting a function of being locked on the core metal 55 and a function of supporting the airbag apparatus to be movable relative to the core metal 55 in a front and rear direction, the supporting member 51 also serves as the fixed contact 51a. Therefore, the number of components in the steering wheel can be reduced, thereby obtaining simplification of the configurations thereof.
However, according to JP-A-2013-71626, a configuration in which the slider 52 is indirectly contacted with the cap member 53 via the movable side contact 54 is employed. Therefore, when the slider 52 made of resin is brushed against the movable side contact 54 made of metal, a part of the slider 52 contacted with the movable side contact 54 is cut to generate resin powders. Also, if resin powders are accumulated and thus an insulating layer is formed between the movable side contact 54 and the fixed contact 51a, there is a risk that, when the airbag apparatus is pressed down, electrical communication between the movable side contact 54 and the supporting member 51 is disturbed.
Accordingly, the present invention has been made keeping in mind the above problems, and an object thereof is to provide a steering wheel in which generation of resin powders due to contact of a slider with a movable side contact can be prevented.


A method of manufacturing a semiconductor device which can solve a problem in which a wafer is warped by the influence of thermal contraction of a sealing resin due to a difference in thermal contraction between the wafer and the sealing resin. A second wafer on which electrodes are formed is stacked on a first wafer such that the electrodes of the second wafer are electrically connected to the electrodes formed on the first wafer, a portion between the first wafer and the second wafer is sealed with a resin, the second wafer and the sealing resin are half cut to expose the conductive posts from the sealing resin, conductive bumps for performing electric connection to an external circuit are formed on the exposed conductive posts, and the wafer is diced into independent semiconductor devices. In the resin sealing step, since both the first and second semiconductor elements are stacked in wafer states, a problem in which the wafers are warped by the influence of thermal contraction of the sealing resin due to a difference in thermal contraction between the wafers and the sealing resin can be solved.

1. Field of the Invention
The present invention relates to a method of manufacturing a semiconductor device which is characterized by a stacking structure of a semiconductor element (chip).
2. Description of the Related Art
With decreases in the size of electronic devices in recent years, when semiconductor devices are packaged, various methods are used which make it possible to package the semiconductor devices at a high integration density. A semiconductor device called a wafer level chip size package (Wafer-level Chip-Package: be to referred to as W-CSP hereinafter)is known. It his a package size that is almost equal to that of a bare chip, or slightly larger than a bare chip.
A feature of the W-CSP will be described below.
A second semiconductor element having a size smaller than that of a first semiconductor element is stacked on the first semiconductor element. On the surfaces of the first and second semiconductor elements, an electronic circuit constituted by a transistor, a resistor, a capacitor, an inductor, and the like is formed. On the surface of the first semiconductor element, a plurality of electrode pads connected to the electronic circuit is formed. On the surface of the second semiconductor element, a plurality of electrodes connected to the electronic circuit is formed. The electrode pads formed on the first semiconductor element are electrically connected to the electrodes formed on the second semiconductor element to transmit electric signals.
A method of manufacturing the W-CSP will be described below.
A wafer which is diced into independent first semiconductor elements in the subsequent steps is prepared. An electric circuit for constituting the first semiconductor elements is formed on the surface of the wafer. Respective second semiconductor elements are placed on the wafer. At this time, electrodes formed on the second semiconductor elements are electrically connected to the electronic circuit formed on the surface of the wafer. Thereafter, the wafer and all the second semiconductor elements are sealed by a sealing resin, and then diced into independent semiconductor devices.
However, in the manufacturing method, the respective second semiconductor elements must be aligned to the wafer, so that the steps are complicated. In addition, since the wafer and the sealing resin are different in thermal contraction, the wafer may warp by the influence of thermal contraction of the sealing resin, disadvantageously.