A method manufactures non-volatile memory devices integrated on a semiconductor substrate and including a matrix of non-volatile memory cells and associated circuitry. The manufacturing method includes: forming a plurality of electrodes of the matrix memory cells, each electrode including a first dielectric layer, a first conductive layer, a second dielectric layer and a second conductive layer; and forming a plurality of electrodes of transistors of the circuitry each including a first dielectric layer and a first conductive layer. The method also includes forming first coating spacers on the side walls of the gate electrodes of the memory cell and second coating spacers on the side walls of the gate electrodes of the circuitry, the second spacers being wider than the first spacers.

1. Field of the Invention
The present invention relates to a method for manufacturing non-volatile memory devices integrated on a semiconductor substrate.
More specifically, the invention relates to a method for manufacturing non-volatile memory devices integrated on a semiconductor substrate comprising a matrix of non-volatile memory cells and associated circuitry, the manufacturing method comprising the following steps:                forming a plurality of gates of the matrix memory cells, comprising a first dielectric layer, a first conductive layer, a second dielectric layer and a second conductive layer,        forming a plurality of gates of high voltage (HV) transistors of said circuitry,        coating, with at least one protection dielectric layer, said gates of the matrix and of the circuitry.
The invention particularly, but not exclusively, relates to a method for realizing spacers of different lengths in memories of the EPROM, EEPROM, flash EEPROM type and the following description is made with reference to this field of application by way of illustration only.
2. Description of the Related Art
As it is well known, non-volatile memory electronic devices, for example of the EPROM and Flash EEPROM type, integrated on semiconductor, comprise a plurality of non-volatile memory cells organized in a matrix.
Each single non-volatile memory cell comprises a MOS transistor having a gate electrode, arranged above the channel region, that is floating, i.e., it as a high impedance in DC towards all the other terminals of the same cell and of the circuit wherein the cell is inserted. Generally, this floating gate electrode is realized by means of a polysilicon layer.
The cell also comprises a second electrode, called control gate electrode, which is capacitively coupled to the floating gate electrode through an intermediate dielectric layer, so called interpoly. Generally, the control electrode is realized by means of a polysilicon layer. This second electrode is driven through suitable control voltages. The other terminals of the transistor are the usual drain and source regions.
The matrix of memory cells is associated with control circuitry comprising a plurality of MOS transistors, each comprising a source region and a drain region separated by a channel region. A gate electrode is then formed on the channel region and insulated therefrom by means of a gate oxide layer. Moreover, insulating spacers are provided on the side walls of the gate electrode.
However, in new generation memory devices, in the circuitry associated with the memory matrix both MOS HV transistors suitable to sustain high voltages and MOS low voltage (LV) transistors suitable to sustain low voltages are integrated, which, together with the memory cells, have different specifications for the realization of the spacers.
To make the problems related to the realization of these spacers clearer, the known process steps are now described to form differential spacers in a conventional memory device comprising a matrix 2 of non-volatile memory cells and associated circuitry 3 comprising both HV transistors suitable to sustain high voltages and LV transistors suitable to sustain low voltages.
With reference to FIGS. 1 to 5, a portion of a semiconductor substrate 1 is shown where the memory cells of the memory matrix 2 and the HV transistors of the circuitry 3 are realized, while the portion of a semiconductor substrate 1 where the LV transistors are realized is not shown.
In particular, as shown in FIG. 1 on a semiconductor substrate 1 after having defined active areas for the memory matrix 2 and for the circuitry 3, in the memory matrix 2 a plurality of floating gates 4 of the memory cells is formed, each gate comprising a first gate dielectric layer 5, called tunnel oxide, a first conductive layer 6, for example of polysilicon, a second interpoly dielectric layer 7, which can be an oxide layer or the overlapping of more layers, for example ONO (oxide/nitride/oxide) and a second conductive layer 8, for example of polysilicon.
In these known configurations, pairs of adjacent memory cells share the same source region.
In the circuitry 3 a plurality of gates 9 of the HV transistors is instead formed. Each gate 9 of the HV transistors comprises, for example, a gate dielectric layer 7′ and a conductive layer 8′ of the circuitry 3. Advantageously, the gate dielectric layer 7′ of the circuitry 3 and the conductive layer 8′ of the circuitry 3 are formed, respectively, by the interpoly dielectric layer 7 and by the second conductive layer 8 used in the matrix 2.
After having carried out an oxidation step forming a protective film 9′ on all the devices present on the semiconductor substrate 1, a first oxide layer 10 is then deposited. This first oxide layer 10 has the function of reducing the stress generated by the deposition of a successive nitride layer 11 on the gates 4 and 9. Moreover, the first oxide layer 10 serves as "stopping layer" in the etching step of the successive nitride layer 11.
The nitride layer 11 is then deposited on the whole semiconductor substrate 1 which will be used for the formation of spacers of the LV transistors of the circuitry 3 and of spacers of the matrix 2 cell. This nitride layer 11 completely fills the space present between pairs of memory cells in correspondence with the shared source region.
On the nitride layer 11 a second oxide layer 12 is also deposited which will be used for the formation of differential spacers, those of the HV transistors in the circuitry 3.
As shown in FIG. 2, an etching step in plasma blanket is carried out of the second oxide layer 12, selective with respect to the nitride layer 11 to form oxide spacers 13 above the nitride layer 11 aligned with the side walls of the gates 4, 9.
In particular in the matrix 2, since the source region shared by two adjacent cells is completely covered by the nitride layer 11, the spacers 13 are formed only on the side walls of pairs of gates 4 of memory cells.
As shown in FIG. 3, by means of a conventional photo-lithographic technique a first mask 14 is formed for the differential spacers 13. This mask 14 for the differential spacers completely covers the HV transistors of the circuitry 3.
As shown in FIG. 4, a removal step of the differential spacers 13 is then carried out in the areas left exposed by the mask 14, for example in the matrix 2 and in the LV transistors of the circuitry, to which a removal step of this mask 14 for the differential spacers follows.
With this process step the spacers 13 are completely removed from the matrix 2 and from the LV transistors of the circuitry, but the spacers 13 remain for the HV transistors of the circuitry 3.
As shown in FIG. 5, an etching step in plasma blanket of the nitride layer 11 is carried out. In particular this etching step is highly selective with respect to the first oxide layer 10.
With this etching step, short first nitride differential spacers 15 are formed on the side walls of the electrodes 9 in the matrix 2 and in the portion of circuitry 3 where the LV transistors are realized, while long second nitride differential spacers 16 are formed in the portion of circuitry 3 where the HV transistors are realized.
The HDD implants are then carried out in circuitry and if necessary in matrix.
At this point of the process as shown in FIG. 6, a pre-silicidation cleaning step is carried out for the removal of oxide layers 9′, 10, if present.
A cobalt silicide layer is finally formed. In particular the silicide layer is formed in the matrix 2 in correspondence with the drain regions between the spacers 15 of corresponding pairs of memory cells.
The process is completed in a conventional way by means of the deposition of a borderless nitride layer and of the pre-metal dielectric layer, to which the definition and the formation of contacts is made follow.
Although advantageous under several aspects, this method shows some drawbacks.
In fact the continuous reduction of the sizes of memory devices involves the continuous decrease of the size of the cell drain and thus of the effective area for the drain contact in case devices are processed under alignment conditions close to the required specification limits and with a flow with borderless contacts wherein, thus, contacts can be self-aligned with the spacers.
This problem is generally complicated due to the need to form the spacers to define some source and drain regions of both Low Voltage (LV) and High Voltage (HV) transistors. The shape of the spacers in the matrix is, on the other hand, critical since it affects the deposition of the pre-metal dielectric risking to originate passing voids which would put the drain contacts in short. The size of the spacers is instead even more critical in the matrix since it reduces the size of the drain wherein the contacts are to be defined: in case of misalignment between contact mask and gate definition mask, the effective contact area is particularly reduced originating cell read/program problems due to the increase of the contact resistance. This problem is particularly evident in those process flows wherein nitride spacers and a borderless nitride layer are used under the pre-metal oxide to avoid the breaking of the field oxide in cases of misalignment of the contacts with respect to the active area. In this case the contact self-aligns to the spacer and thus in case of misalignment with respect to the gate definition mask, the contact area is particularly reduced.

Method for manufacturing non-volatile memory devices integrated in a semiconductor substrate


A suture anchor is disclosed which comprises a frusto-conical device having first and second axial ends, and a side surface extending therebetween. The first axial end has a larger diameter than the second axial end. The first axial end includes an internally threaded bore by which a driver is removably connected to the anchor. A passage extends through the suture anchor from the second axial end and to the side surface. Tissue is attached to a bone by first passing a length of suture material through the tissue. The suture ends are delivered to the anchor and are passed through the passage in a direction from the axial end to the side surface. The user then grasps the suture ends and inserts the anchor, by means of the driver, into a previously prepared bore in the bone. The anchor is wedged into the bore so that the suture is captured between the bone and the side surface of the anchor.

1. Field of the Invention
The present invention relates to suture anchors and, in particular, to anchors having a substantially frusto-conical shape and a passage within the anchor to allow strands of suture to pass through the anchor between an end and the side surface thereof.
2. Description of the Art
Currently, most suture anchors that are used in the medical field are of the type that have tissue attached to an anchor which is embedded in bone. Typically, a suture is secured to an anchor which is affixed to the bone, and the suture is used to tie tissue to the bone. A problem with such conventional suture anchors is that it often is difficult to attach tissue, such as ligaments and tendons, to a bone at a desired location because of difficulties in securing an anchor to bone at the optimum site for the surgical repair being performed. Accordingly, there is a need for a suture anchor which is easy to use and which allows the surgeon to attach tissue to a bone in a relatively inaccessible location.
To that end, the present invention relates to a suture anchor having a generally frusto-conical configuration with a passage extending from the smaller diameter base of the anchor to an opening on the side thereof. The side of the anchor can be a smooth surface, or alternatively, it can be corrugated. When suture is inserted in the passage through the anchor and the anchor is forced into a bore provided in the bone, the suture is wedged between the side of the anchor and the sidewall of the bore. If the bore passes all the way through the bone, and the suture is introduced to the anchor from the side of the bone opposite that to which the anchor is embedded, tissue can be secured to the bone at a site separated from the location of the suture anchor.
Other objects, features and characteristics of the present invention, as well as the methods of operation and functions of the related elements of the structure, and the combination of parts and economies of manufacture, will become more apparent upon consideration of the following detailed description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification, wherein like reference numerals designate corresponding parts in the various figures.


A method for detecting the presence of or quantification of carbon black and/or black carbon in a sample or carrier medium. The method includes providing the sample or carrier medium without labelling or pre-treatment of the carbon black and/or black carbon particles; illuminating the sample or carrier medium at a temperature below 90° C. by a pulsed light with a pulse duration below 500 femtoseconds, a repetition rate above 1 MHz with an average power below 20 mW, and a wavelength of a femtosecond laser pulse ranging from 700 to 1200 nm, to generate non-incandescence related light emission from the carbon black and/or black carbon particles; and analysis of the light emission.

Two forms of carbonaceous materials are carbon black and black carbon. Carbon black (CB) consists of or comprises aciniform aggregates of primary particles with an elemental carbon content greater than 97% (ASTM International, West Conshohocken, Pa., 2013). It is produced through well controlled incomplete combustion of organics like heavy petroleum or vegetable oil. This distinguishes CB from soot or black carbon (BC), the unwanted byproduct released during incomplete combustion processes such as in the exhausts of diesel engines and one of the main contributing factors to atmospheric particulate pollution (L. Castro et al., Atmos. Environm., 1999, 33, 2771). Nonetheless, due to the (physico)chemical similarity CB is widely used as a model compound for soot (C. Arnal et al., Combust. Sci. Technol., 2012, 184, 1191). The total global black carbon emission was estimated to be approximately 8.5 million tons after having constantly increased throughout the preceding decade (R. Wang, Global Emission Inventory and Atmospheric Transport of Black Carbon: Evaluation of the Associated Exposure, 2015, Springer Thesis: Beijing, China). As a consequence of the increasing environmental and occupational exposure to these carbonaceous particles, deeper insight into the (eco-) toxicological impact of these materials is of critical importance. Carbonaceous material or carbon (black material) is generally considered to have low solubility in water and weak fluorescence (J. C. G. Esteves da Silva and H. M. R. Goncalves, Trends Anal. Chem., 2011, 30, 1327). However carbon nanoparticles with a very limited well-defined size range below 10 nm can be made luminescent by laborious synthetic modifications yielding fluorescent nanosized carbon structures (H. T. Li et al J. Mat. Chem., 2012, 22, 24230). Examples are the photoluminescent C-dots (carbon nano-dots) that can be prepared from carbon precursors such as candle soot (H. T. Li et al J. Mat. Chem., 2012, 22, 24230). Such a post-modification cannot be performed directly in vivo experiments on a sample containing CB or BC or other non-fluorescent carbon nanoparticles.
State of the art measurements in polluted air (J. C. Chow et al., Atmos. Res., 2009, 93, 874) concern absorption photometry and laser induced incandescence (LII) to determine particle concentrations. Furthermore, alternative labeling methods have been explored such as the technetium-99-m radionuclide labeling in epidemiological studies and toxicology research (A. Nemmar et al., Circulation, 2002, 105, 411).
In LII, the emission from carbonaceous materials has been linked to black-body radiation from the severely heated CB particles (A. Ferrari et al., Phys. Rev. Lett., 2006, 97, 187401), i.e. incandescence. Already various models have been proposed to explain the origin of incandescence and its dependence on illumination power and pulse duration (I. Belousova et al., Opt. Commun., 2004, 235, 445; S. Zelensky, Semicon. Phys. Quantum. Optoelectron., 2004, 7, 190; J. J. Rulik et al., Semicon. Phys. Quantum. Optoelectron., 2007, 10, 6). Recently, substantial scientific efforts have focused on white light (WL) from carbonaceous materials including graphene (W. Strek et al., Light. Sci. Appl., 2015, 4, e237), fullerenes (B. Hamilton et al., Adv. Mater., 1993, 5, 583) and carbon nanotubes (T. Imholt et al., Chem. Mater., 2003, 15, 3969). Also for these materials the emitted radiation has been linked to incandescence.
However, incandescence induced visible emission from CB particles in solution and biological matter has so far not been widely explored, despite reports of CB suspensions serving as optical limiters and nonlinear scatterers due to their broadband and flat absorption. Such incandescence induced nonlinear light scattering efficiency decreases with pulse duration shortening (I. Belousova et al., Opt. Commun., 2004, 235, 445; S. Zelensky, Semicon. Phys. Quantum. Optoelectron., 2004, 7, 190). The interpretation of these effects is not straightforward as they strongly depend on the experimental conditions (F. Fougeanet and J.-C. Fabre, MRS Proceedings, 1997, Cambridge Univ. Press, 293). Moreover, incandescence induced visible emission of CB particles in aqueous environments would require higher laser intensities because of the improved heat transport with respect to gaseous environments, additionally in biological fluids, cells, and tissues this would denature this biological environment due to heating of the particles.
While adverse health effects of CB and/or BC exposure are generally accepted, a direct, label-free approach for detecting CB/BC particles in fluids and at the cellular level is still lacking
Present invention provides methods that enable direct detection of carbonaceous particles, such as CB or BC, in relevant samples such as polluted liquids such as water and other solvents, body fluids and consumer products as well as exposed biological tissues and cells by means of non-incandescence related light detection and analysis under illumination with femtosecond/sub-picosecond pulse durations short enough to triggering an instantaneous optical response without the emission of heat-induced sample incandescence. In present invention we observed for four different CB species with diameters ranging from 13 to 500 nm, that this emission under femtosecond illumination is a general property of CB/BC particles.
A very distinguished character of the present invention, in contrast to C-dots which have a narrow emission band, is that CB or BC species under ultrafast femtosecond/sub-picosecond laser illumination show a broad spectral response spanning at least the whole visible range of wavelengths. A particular advantage is that when the ultrafast femtosecond laser is focused on the sample containing CB or BC species (for instance in urine or other liquid samples) the background emission coming from non-CB or non-BC species can be spectrally filtered out. For instance it is a particular embodiment of present invention that by varying the femtosecond/sub-picosecond illumination intensity and/or the femtosecond/sub-picosecond illumination wavelength the emission wavelengths can be fine-tuned into selected wavelength emission in the violet (380-450 nm), blue (450-500 nm), green (500-570 nm), yellow (570-590 nm), orange (560-620 nm) or red (620-750 nm) range. For instance in a particular embodiment of present invention when a sample comprising CB and/or BC species is illuminated by an ultrafast pulsed laser, for instance a femtosecond pulsed laser, the wavelength of the laser pulses can be changed within the 700 to 1200 nm range, preferably within the 750 to 950 nm range and/or the intensity of the femtosecond laser light can be changed, until the CB and/or BC species illumination distinguishes from any sample noise illumination. In an embodiment of present invention varying ultrafast laser intensity and/or varying ultrafast laser wavelength is used as a handle to separate noise, such as background emission and any other noise that interferes with the detection at BC/CB specific emission wavelengths, or any from CB and/or BC species emission. For instance, a 750 nm short pass dichroic filter can separate the visible emissions from the near infrared illumination of the CB and/or BC species.
In an embodiment of present invention after an emission signal is generated from CB and/or BC species by femtosecond/sub-picosecond pulsed laser illumination, the emission light signals are guided to a signal detection system for detecting the light signals from CB and/or BC species particles of interest. Input signals from different optical detectors, for instance two, that register photons of sufficiently separated spectral areas provide the input signal each to a separate digital multiplier, which is a combination of an amplifier and electronic filter. These signals are converted each into a binary signal stream by an analogue-to-digital converter (ADC). Consequently the signals, from the output of ADCs, are received as inputs to a digital multiplier. The digital multiplier can be implemented as a stand-alone digital hardware component, as a software program running on a computer processor, or as any other suitable mechanism for multiplying two signals. The output of the multiplier is a sampled, an analytical signal representing the (complex) product of the two signals. The output of the multiplier is provided to one or more integrators. Like the digital multiplier, the integrators can be implemented as digital hardware components, as a software program on a computer processor, or as any other suitable mechanism for summing the samples output from the multiplier. The integrator sums series of consecutive samples of the multiplier output to form the output signal. The length of each series of consecutive samples will depend on known or estimated properties of the signals of interest. Each signal train can have an associated start time related to the sample time of the first sample in the consecutive series. A particular advantage of this embodiment is that it allows to filter CB and/or BC species illuminations from sample or carrier medium illuminations.
In a particular embodiment the signal train is consequently transferred by output to auxiliary hardware such as a laser microscope, in particular such as a laser scanning microscope. In an alternative embodiment the signal train is provided to a search function for particle counting. This search function can be implemented as a digital signal processor, as a computer program operable in a data processing system, or as any other suitable signal processing means, including specialized digital hardware. The search function includes a threshold which can selectively pick a pulse which exceeds a certain signal magnitude. The search function counts these events.
In a particular embodiment of present invention, femtosecond/sub-picosecond pulsed illumination intensity and/or the femtosecond/sub-picosecond illumination wavelength on said CB and/or BC species or on said the sample which comprises CB and/or BC species is modulated to the near infrared emission excitation of said CB and/or BC species. A particular positive effect of this method is that this distinguishes the CB and/or BC species emission from background noise emission and this is particularly useful to filter out background autofluorescence or accidental sample medium autofluorescence. A particular embodiment of the present invention concerns modulation of the ultrafast femtosecond illumination of said BC and/or CB species in a urine sample until near infrared emission is reached. This is particular suitable to distinguish CB and/or BC particles from and any other noise that interferes with the detection at BC/CB specific emission wavelengths.
As the emitted radiation spreads over the whole visible spectrum, detection is straightforward and flexible. The unique property of the described light emission allows optical detection and unequivocal localization of CB/BC particles in (body) fluids as shown here using urine and in cellular environments while simultaneously co-localizing different cellular components using various specific fluorophores as shown here using human lung fibroblasts.

Method for detecting or quantifying carbon black and/or black carbon particles


What is disclosed is a system and method for assessing peripheral vascular disease from a thermal image captured using a thermal imaging system. In one embodiment the present method involves the following. First, a thermal image is received of a region of exposed skin of a peripheral body part of a subject being monitored for PVD. The thermal image was acquired by a thermal imaging system. Pixels in the thermal image each have a corresponding temperature value. The thermal image is analyzed to stratify the peripheral body part into a plurality of skin surface regions. A skin surface temperature for each respective skin surface region is identified based on pixels in the thermal image associated with those regions. The temperatures are then extracted such that a progression of temperatures can be ascertained. A method for forecasting the progression for future times is also disclosed.

Poor circulation in a limb often gives rise to symptoms such as muscle cramping, pain or discomfort, and the like. Such symptoms may be signs of peripheral vascular disease (PVD). The prevalence of PVD varies considerably depending on the age of the population being studied. The incidence of symptomatic PVD increases with age from about 0.3% per year for men aged 40-55 years to about 1% per year for men aged over 75 years. Normally, PVD is assessed using sophisticated tests involving ultrasound imaging, magnetic resonance angiogram, computer tomography (CT) angiogram, or a catheter-based angiogram. Diagnosis is critical, as people with PVD are at a higher risk for tissue necrosis including heart attack and/or stroke. The present invention is directed towards assessing PVD and the progression of PVD for future times.
Accordingly, what is needed is a system and method for assessing whether a subject of interest has peripheral vascular disease from a thermal image captured using a thermal imaging system.

Assessing peripheral vascular disease from a thermal image


Provided are an oxazole hydroxamic acid derivatives and pharmaceutically useful salt thereof as a histone deacetylase inhibitor. The oxazole hydroxamic acid derivative and pharmaceutically useful salt thereof, prepared in accordance with the present invention, can treat and/or prevent various cancers and inflammatory diseases caused by histone deacetylase.

Histones are basic proteins which are associated with nuclear DNA of eukaryotic cells and in which reversible acetylation of the lysine residues occurs at certain positions of histone molecules. It is considered that such acetylation of histone proteins is involved in formation of high-order structures of chromatin, which plays a role in regulation of expression of genetic information in conjunction with non-histone proteins.
Regulation of transcription is a critical factor in differentiation, proliferation and death of cells and such cellular processes are controlled by a degree of acetylation of nucleosomal histones. Histone deacetylase (hereinafter, referred to as HDAC) and histone acetyltransferase (hereinafter, referred to as HAT) are related to acetylation of histone which plays a role to regulate gene expression. In particular, among a variety of nuclear processes, regulation of transcription is crucial for regulation of a cell cycle, and occurrence of disorders or dysfunctions in cell cycle regulation may result in diseases such as cancers and inflammation.
There has recently been found the fact that an HDAC inhibitor inhibits growth of various types of cancer cells or induces apoptosis thereof (Bandyopadhyay D et al. (2004) Cancer Research, 64, 7706-7710). Numerous HDAC inhibitors are currently undergoing clinical testing on patients, for treatment purpose of blood cancers and solid cancers. In addition, it was also reported that the HDAC inhibitor is involved in cell proliferation and differentiation, and therefore exhibits anti-autoimmune properties against autoimmune diseases such as arthritis, lupus, and the like diseases, and has neuroprotective and anti-inflammatory effects (Spira et al. (2003) Current Opinion in Pharmacology, 3, 338-343, Marks et al. (2001) Nature review cancer, 1, 194-202). Further, the recently published article has reported the possibility that the HDAC inhibitor may exert therapeutic effects on obesity or diabetes (Picard et al. (2004), Nature, 429, 771-776). Additionally, the HDAC inhibitor, due to anti-cancer effects thereof, may be utilized as a sensitizing agent in chemotherapy or radiotherapy. Recently, it is known that the HDAC inhibitor may be used in treatments via virus-induction such as in HIV (Cohen J et al. (2005), Science, 12, 999-1000).

Oxazole hydroxamic acid derivatives and use thereof


An apparatus and method to detect a blood flow signal free from a motion artifact, and a stress test apparatus using the same, enhance data reliability of the blood flow signal by removing the motion artifact from the blood flow signal detected by photo-plethysmography. The apparatus to detect the blood flow signal includes a base pattern correlation coefficient calculating unit to determine peak points in the blood flow signal sensed from a body of an examinee using a blood flow sensing unit, and to calculate correlation coefficients of each peak point using a predetermined base pattern, and a motion artifact processing unit to determine the motion artifact using the calculated correlation coefficients and to remove the motion artifact from the blood flow signal. Thus, reliability of the blood flow signal is enhanced by effectively removing the motion artifact from the blood flow signal detected by the photo-plethysmography.

1. Field of the Invention
The present invention relates to an apparatus and method to detect a blood flow signal free from a motion artifact as well as a stress test apparatus using the same, in which the motion artifact caused by the motion of an examinee is removed from the blood flow signal detected by photo-plethysmography using a predetermined base pattern, thus performing exact detection of the blood flow signal as well as exact stress measurement using heartbeat information calculated through the detection.
2. Description of the Related Art
Generally, photo-plethysmography (hereinafter, referred to as "PPG") is used to detect a blood flow signal associated with a heartbeat by use of a predetermined number of LEDs (Light Emitting Diodes) and photo-detectors, for example, to extract blood flow information through a contact point at which a simple sensor module is in contact with a part of a human body (e.g., a finger or an ear).
The PPG has been widely used in test equipment to check a state of an examinee with or without a medical purpose, because the examinee may be easily examined compared to a heartbeat-detection test using an electrocardiogram (ECG), where two or more electrodes must be attached to the examinee.
Specifically, a representative example of the PPG is a stress test, in which a heart rate (referred to as HR hereinafter) and a heart rate variability (referred to as HRV hereinafter) are calculated using the blood flow signal obtained through the PPG, and then a stress level is measured by information on mental and/or physical states of the examinee, which is obtained through analysis of the HR and HRV.
Meanwhile, the PPG has a drawback in that even slight motion of the examinee brings about a noticeable motion artifact. The motion artifact is a noise signal caused by shaking or vibration of the examinee during detecting the blood flow signal, acting as a serious obstacle to exact detection of the HR and HRV.
There has been a proposal to overcome the drawback in U.S. Pat. No. 5,662,106, titled OXIMETER WITH MOTION DETECTION FOR ALARM MODIFICATION, in which a predetermined threshold value, which is obtained through a waveform of a derivative signal resulted from motion of an examinee, is set, and when a motion artifact is checked, an alarm is given to the examinee.
Specifically, as shown in FIG. 1, a ratio of the height of the positive peak of the derivative signal, A, and the height of the negative peak of the derivative signal, B, is greater than 1-1.4 for the blood flow pulse signal. Accordingly, a threshold value is set to 1-1.4, and signals having values less than the threshold value are determined to be the motion artifacts.
This method has a problem in that, during operation of a timer for a predetermined time and detecting a blood flow signal through a part of the body of the examinee, if it is determined that signals caused by the motion artifact are present, the timer is reset, and then the blood flow signal must be detected again. Thus, the whole measurement time is increased, causing a burden with respect to the detection of the blood flow signal.
Further, emission of an alarm sound indicating the presence of the motion artifact may cause the examinee to have a hesitating or shaking motion. Hence, the method does not function as an effective one for exact detection of the blood flow signal from which the motion artifact is removed.
For this reason, there is a need for an effective method to detect blood flow which is capable of providing exact information on the heartbeat and stress by more rapid and exact detection of the blood flow signal without imposing a burden on the examinee.

Apparatus and method for detecting blood flow signal free from motion artifact and stress test apparatus using the same


A processing system (10) and a corresponding method are provided for processing work products (WP), including food items, to locate and quantify voids, undercuts and similar anomalies in the work products. The work products are conveyed past an X-ray scanner (14) by a conveyance device (12). Data from the X-ray scanning is transmitted to control system (18). Simultaneously with the X-ray scanning of the work product, the work product is optically scanned at the same location on the work product where X-ray scanning is occurring. The data from the optical scanner is also transmitted to the control system. Such data is analyzed to develop or generate the thickness profile of the work product. From the differences in the thickness profiles generated from the X-ray scanning data versus the optical scanning data, the location of voids, undercuts and similar anomalies can be determined by the control system. This information is used by the processing system (10) to process the work product as desired, including adjusting for the locations and sizes of voids, undercuts and similar anomalies present in the work product.

Work products, including food products, are portioned or otherwise cut into smaller portions by processors in accordance with customer needs. Customers usually desire to portion and/or trim the work products into uniform sizes, for example, steaks to be served in restaurants, chicken fillets used in frozen dinners or in chicken burgers or bacon slabs cut from pork bellies. Much of the portioning/trimming of work products, in particular food products, is now carried out with the use of high-speed portioning machines. These machines rely on various scanning techniques to ascertain the size and shape of the food product as they are being advanced on a moving conveyor. This information is analyzed with the aid of a computer to determine how to most efficiently cut the food product into optimum sizes or portions. For example, a customer may desire bacon portioned into one-pound slabs or may desire chicken breast portions in two different weight sizes, but with no fat or with a limited amount of acceptable fat. The pork belly or chicken breast is scanned as it moves on an infeed conveyor belt and a determination is made through the use of a computer as how to best portion the pork belly or chicken breast to achieve the weight(s) desired by the customer, so as to use the pork belly or chicken breast most effectively.
Cutting and/or trimming of the work product can be carried out by various cutting devices, including high-speed liquid jet cutters, wherein the liquid may include, for example, water or liquid nitrogen. Alternatively, the cutting device may be composed of a rotary or reciprocating blade. Once the cutting/trimming has occurred, the resulting portions are off-loaded from the cutting conveyor and placed on a takeaway conveyor for further processing or perhaps to be placed in a storage bin.
Portioning machines of the foregoing type are known in the art. Such portioning machines, or portions thereof, are disclosed in prior patents, for example, U.S. Pat. Nos. 4,962,568 and 5,868,056, which are incorporated by reference herein. Typically, the work products are first carried by an infeed conveyor past the scanning station where at the work products are scanned to ascertain selected physical parameters, for example, the size and shape, including length, width and/or thickness profile. From this information, the weight of the work product, or portions thereof, can be determined by utilizing an assumed density for the work product.
The scanning of the work product can be carried out utilizing a variety of techniques, including X-ray scanning and optical scanning. In X-ray scanning, X-rays are passed through the work product, with the level of attenuation of the work product being related to mass of the work product. An optical scanning system may utilize a CCD camera or video camera to view a work product illuminated by one or more light sources. The optical camera is capable of determining the physical parameters of the overall exterior configuration of the work product, including its size and shape. These scanning techniques assume that the bottom of the work product lies flat on the conveyor on which the work product is being carried during scanning and subsequent trimming or cutting. However, the bottom side of the work product may not lie flat against the top surface of the conveyor belt, rather an undercut may exist beneath the work product. Also, an unseen void may exist within the interior of the work product. If these situations exist, then in typical scanning systems the undercut or void is not detected. Accordingly, the work product is analyzed as if the undercut or void did not exist. As such, erroneous information is utilized concerning the physical parameters of the work product. If the goal is to cut the work product into uniform portions by weight, then the presence of an undercut or void can cause the end portion to not be within the approved weight range for the portion(s) cut from the work product.
X-ray scanners can "see through" work products, including foods. However, X-ray scanners cannot detect undercuts or voids. Also, optical scanners are capable of ascertaining the physical aspects of the exterior of the work product, but are not able to ascertain the existence of a void within the work product or an undercut beneath the work product.
The present disclosure seeks to provide a method and system for locating voids, undercuts and similar anomalies in the work product and then analyzing the work product taking into consideration the existence of voids, undercuts or other anomalies so as to portion or otherwise process the work product knowing the existence, location, size and shape of any voids, undercuts or similar anomalies in the work product.

Determining the thickness profile of work products


The present invention provides a method of using an accurate three-dimensional shape without damaging a sample by making a probe contact the sample only at a measuring point, lifting and retracting the probe when moving to the next measuring point and making the probe approach the sample after moving to the next measuring point, wherein high frequency/minute amplitude cantilever excitation and vibration detection are performed and further horizontal direction excitation or vertical/horizontal double direction excitation are performed to improve the sensitivity of contacting force detection on a slope of steep inclination. The method uses unit for inclining the probe in accordance with the inclination of a measurement target and a structure capable of absorbing or adjusting the orientation of the light detecting the condition of contact between the probe and sample after reflection on the cantilever, which varies a great deal depending on the inclination of the probe.

1. Field of the Invention
The present invention relates to a scanning probe microscope technique and sample observation method using the same and device manufacturing method.
2. Description of the Related Art
As a technique for measuring minute three-dimensional shapes, a scanning probe microscope (SPM) is known. This is a widely employed technique whereby minute three-dimensional shapes of the atomic order can be measured, by scanning a sample whilst maintaining the contacting force at an extremely small value while controlling a probe with a sharp tip.
On the other hand, dimensional control using a CD-SEM (Critical Dimension SEM) is currently carried out in an LSI minute pattern formation process, but with the advance of pattern miniaturization, the pattern formation process is facing the following limits. (1) Problem with measurement accuracy. The gate width of a 65 nm node LSI, which is expected to become the mainstream in 2007, is 25 nm and if its allowable variation is assumed to be 10% and measurement accuracy is assumed to be 20% thereof, the required measurement accuracy is estimated to be 0.5 nm. (2) Demand for profile measurement. There is a growing demand for the introduction of APC (Advanced Process Control) for high-accuracy control of line widths and this requires a technique for measuring not only pattern wiring widths but also sectional shapes which have a considerable influence on electrical characteristics. (3) Problem with measuring target. There is a growing need for measurement of materials with low electron beam resistance such as resists for DUV (deep ultraviolet rays), low-k (low dielectric constant) film material.
It is difficult for the current CD-SEM to deal with the above described problems and requirements. For this reason, a scanning probe microscope technique seems to be a promising technique. What is required in this case is a scanning probe microscope technique applicable to a pattern having a large aspect ratio and an inclination of step locations of approximately 90 degrees.
On the other hand, Japanese Patent Laid-Open Publication No. 11-352135 discloses a method of scanning a sample while vibrating the sample or probe with certain amplitude to make the probe collide periodically with the sample and reduce damages to a soft, brittle sample and probe. Furthermore, Japanese Patent Laid-Open Publication No. 2001-33373 discloses a method of performing servo control on a probe at only discrete measuring points, measuring heights and moving to the next measuring point with the probe lifted. This method requires fewer contacts and has less damage to a soft, brittle sample and probe. This method does not drag the probe and thereby has an advantage of being able to measure shapes in step locations faithfully. Furthermore, Japanese Patent Laid-Open Publication No. 2002-206999 also discloses a method combining both operations.
However, there is a problem that the probe slips slightly in a steep incline and the measured shape is distorted even when the above described methods are used. Another problem is that the probe is worn due to the slippage of the probe and vibration of the probe.
In other words, it has been difficult for the techniques disclosed in the above described patent documents to measure shapes accurately because the probe slips slightly in a steep incline for a sample having a high aspect ratio, and the measured shapes are distorted. Furthermore, the probe is worn due to the slippage and vibration of the probe and it is difficult to measure the shapes stably and accurately.

Scanning probe microscope and sample observation method using the same


A sprinkler head shut off device, comprising of a handle with at least one jaw, a lever, a stopper arm, and a means for reciprocating the stopper arm as the lever is rotated, in order to bring a portion of the stopper arm in contact with the orifice of the sprinkler and stop water flow. The device further comprises a locking means to lock the lever in position. The locking means comprises a member attached to the lever which locks its rotary motion in one direction at a particular position by engaging with a portion of the means for reciprocating the stopper arm.

The present invention relates in general to sprinkler shut off tools for stopping the flow of water from activated fire sprinkler heads, and more particularly to an improved sprinkler head shut off tool.
The sprinkler heads of the automated fire protection sprinkler systems used in buildings and ships when activated by a fire sensor or accidentally, can cause water damage to buildings and other objects in the coverage area and other areas that the water can flow to.
Frequently, it is difficult to access the water valve to stop the flow of water from the sprinkler head. Therefore, it is desirable to have the means to stop the water flow. Several devices have been developed in art. For example, U.S. Pub. No. 20060042803 to Gallaher discloses a tool to stop the flow of water through an activated fire protection sprinkler head. This tool is designed to be a heavy duty, simple to operate mechanism capable of deactivating fire preventing sprinkler heads quickly. By simply turning the outer housing of the tool, by hand or by means of an adjustable extension pole, shut-off levers of this tool will be moved apart within the bracket of the sprinkler head until co-action between the bracket and one of the levers forces the other lever, preferably one bearing a shut-off gasket, against the open water orifice in the sprinkler head, thereby preventing the flow of water through it.
U.S. Pat. No. 3,976,141 to Harrington discloses a device useful for shutting off the flow of water from the heads to minimize the damage resulting from the continuous flow of water. The device is effective to shut off the water from the sprinkler heads whether or not the heads are mounted so that the opening is located at the top or bottom or with heads having openings at the top and also openings at the bottom. The device is so constructed as to seal off either type of opening when applied to a sprinkler head.
U.S. Pat. No. 3,191,685 to Warne discloses an invention whose principal object is to provide a simple, neat and light weight tool which can be instantly applied to an open sprinkler head to rapidly, completely and safely shutoff the discharging water. Tools have been designed for this purpose, but due to the wide variety of sprinkler heads activated in different ways; for instance by heat or impact. No one tool is designed to cover these possibilities. It is therefore another object of this invention to provide in a single tool for closing any of the conventional standard sprinkler heads regardless of whether they open downwardly or upwardly, whether they are bent or broken due to impact or activated by heat and regardless of whether they are of the fixed yoke or Cain suspension varieties.
Although prior art tools serve the same purpose but they differ structurally from the present invention. They use a thread mechanism which has to be rotated to operate the tool, whereas present tool is operated by turning a lever with hand. This and other features of the present invention will become better understood with reference to the appended Summary, Description, and Claims.


Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.

In the semiconductor industry, wafers are contained in wafer pods to prevent the wafers from pollution. In general, the wafers are inserted into a cassette of the wafer pod, and a wafer locker is used to fix the wafers in the cassette and to prevent the wafers from damage during transportation of the wafer pod.
The wafer locker is detachably disposed on the wafer pod to benefit the washing of the wafer pod. However, due to the detachable structure of the wafer locker, some parts of the wafer locker may drop off and damage the wafers.
Further, some particles may be generated by some assembled parts of the wafer pod, and the particles may fall down on the wafers. In addition, after the wafer pod is washed, some water may remain in the grooves of the pod shell, and the wafers may be polluted by the water remaining in the pod shell.
Therefore, there are challenges to improve the structure of the wafer pods.

Wafer pod and wafer positioning mechanism thereof

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD


An error correction decoding (ECC) processing scheme is disclosed that reduces computational complexity normally associated with multiuser detection (e.g., TurboMUD) solutions, without causing degradation in quality of service or decreasing the total throughput. Error correction decoding algorithms are applied only to portions of the estimates that were affected by the immediately previous MUD update process. Even though the MUD and/or ECC updating is targeted so as to reduce complexity of each iteration, all of the estimates are maintained and remain candidates for future updates. As such, there is no negative impact real-time or future performance. This targeting approach can be used in conjunction with many variations of MUD, including full-complexity or reduced complexity, and may include MUD with confidence ordering or voting, and other techniques for facilitating efficient and effective MUD processing.

Wireless networks are employed for communication between various devices, such as cell phones and computers. Digitally modulated signals such as binary phase shift keyed and quadrature phase shift keyed signals are transmitted between nodes of the network. Examples include satellite communications networks where terminals transmit through satellite transponders, terrestrial systems where terminals transmit through repeating towers, and indoor local area networks where terminals transmit through central repeating elements.
Computer elements connected to these networks provide a variety of user services. Examples include telephone traffic with digital voice encoding, video conferencing, local and wide area computer network connectivity, and internet service. In such applications, it is desirable to maximize the network traffic capacity in a given bandwidth in the presence of interference and noise. To that end, a variety of modulation and coding schemes exist for efficiently partitioning the network elements into communication channels.
For example, frequency domain multiple access (FDMA) schemes assign each network terminal to a separate, non-overlapping frequency band. Time domain multiple access (TDMA) schemes assign each terminal to a separate non-overlapping time slot. Code division multiple access (CDMA) schemes assign each terminal to a separate modulating waveform so that the cross correlation between each terminal is negligible. Orthogonal frequency division multiplexing (OFDM) schemes break up a single wideband channel into many narrowband channels. Each channel transmits a small piece of information on a different subcarrier that together with the other channels comprises a larger block of information for a single user. The bands are selected so adjacent bands do not interfere with each other.
New, emerging wireless networking systems based on OFDM, networking standard 802.11, and multicarrier code division multiple access (MC-CDMA) are increasing in popularity. As such networks increase the potential for performance degradation due to multiuser interference (sometimes referred to as multiaccess interference) when the systems are operating simultaneously in the same frequency band with similar modulation and spreading methods.
More specifically, a real world multiuser system includes a number of independent users simultaneously transmitting signals. Each of these transmissions are associated with real-time problems of multipath and multiuser interference that manifest in each of the received signals. Multipath occurs when a signal proceeds to its intended receiver along not one but many paths so that the receiver encounters echoes having different and randomly varying delays and amplitudes.
A multiuser detection (MUD) receiver can be used to jointly demodulate co-channel interfering digital signals. In general, MUD refers to the detection of data in non-orthogonal multiplexes. MUD processing increases the number of information bits available per chip or signaling dimension for interference limited systems. In some cases, the multiuser interference can be so severe that the signals are not detectable by conventional receiver processing techniques. Known receiver processing techniques include, for example, the use of: matched filters, without MUD; iterative TurboMUD, with either full-complexity (based on maximum likelihood principle) or reduced complexity (minimum mean square error, decorrelator, parallel interference cancellation, serial interference cancellation, and tree-pruned MUD); and partitioned MUD and error correction coding (ECC) techniques, where the MUD component can be full or reduced complexity.
The common problem associated with these receiver processing procedures is that they cannot be run in real-time and simultaneously operate at acceptable performance levels. For example, matched filters and partitioned MUD/ECC do not achieve acceptable bit error rate performance levels, particularly for highly loaded systems. In addition, some MUD/ECC solutions fail to address the exceptionally high complexity within the error correction decoding portion. TurboMUD, both full and reduced complexity approaches, encounters complexity increases as the number of iterations increases. In particular, single user decoders typically implement a BCJR algorithm, which is very computationally intensive.
What is needed, therefore, are techniques that reduce the complexity of MUD processing without negatively impacting real-time or future receiver performance.

Multiuser detection with targeted error correction coding

BAE Systems Information and Electronic Systems Integration Inc.


A temperature dependent electric element includes a phase change portion including at least one conductive phase change material having a predetermined phase transition temperature, a detector portion configured to detect a change in conductivity of the phase change material caused by a temperature change to a detect phase transition of the phase change material based on the detected change in conductivity of the phase change material, a temperature calibration part configured to conduct temperature calibration by adjusting a temperature at which the phase change material exhibits the phase transition detected by the detector portion based on the change in the conductivity of the phase change material to the predetermined phase transition temperature of the phase change material, and a substrate on which the phase change portion, the detector portion, and the temperature calibration part are integrally arranged.

Semiconductor devices such as integrated circuits (ICs) or large-scale integrated (LSI) circuits are generally produced by facilities provided by semiconductor manufacturers because the introduction of such facilities has lowered a barrier to entry in fabrication of the semiconductor devices. This has globalized manufacturing bases of the semiconductor devices. As a result, the price of semiconductor devices has become extremely low. In addition, a micro-electro-mechanical system (MEMS) technology utilizing a manufacturing process for semiconductor integrated circuits has enabled mass-production of sensors having consistent characteristics such as complementary metal-oxide semiconductors (CMOS) to be incorporated in semiconductor devices. The current sensor production facilities are mainly diverted from such semiconductor (IC or LSI) production facilities. In the manufacturing process for semiconductor integrated circuits, a temperature calibration process is necessary for a sensor to be calibrated in order to convert reactions detected by the sensor into a physical value such as a voltage. Such temperature calibration is generally conducted by comparing the reaction detected by the sensor with a standard of measurement.
Note that the sensor in this case is a temperature-dependent sensor such as a pressure sensor or a temperature sensor that is capable of outputting a measured value coupled with an expected temperature change. The temperature calibration of the temperature-dependent pressure sensor is generally carried out by a testing staff member or a user, who places the pressure sensor into a tester to compare pressure values output according to temperature changes in the tester with the data on the existing pressure values of the pressure sensor. The temperature sensor may be a thermocouple, a platinum resistance thermometer sensor and a thermistor. Among these, the thermocouple that is low cost and is capable of measuring a wide range of temperature is selected as a example of the temperature sensor for illustration of the temperature calibration below. A thermocouple is a temperature sensor composed of two different metallic wires (a pair of wires) either ends of which are connected. The thermocouple composed of the pair of metallic wires is configured to measure extremely feeble thermoelectric power generated in proportion to a temperature difference between either end of the pair of metallic wires and output a temperature value corresponding to the measured thermoelectric power. That is, this kind of temperature sensor outputs thermoelectric power in proportion to temperature change. Such temperature-dependent sensors may generally need temperature calibration in order to measure temperature accurately. A typical temperature calibration technique for the temperature-dependent sensors is as follows. A temperature sensor (i.e., thermocouple) is placed in a thermostatic chamber under a constant environment, and the temperature inside the thermostatic chamber is changed. The thermoelectric power output by the thermocouple is then measured while the temperature inside the thermostatic chamber is changed. The measured thermoelectric power output by the thermocouple is compared with the standard value of the thermoelectric power corresponding to the temperature change. The temperature calibration of each of temperature devices is conducted by utilizing this comparison value as a compensation value.
Japanese Patent No. 4178729 (hereinafter called "Patent Document 1") discloses an example of the temperature calibration technology for a thermal analysis device utilizing a thermocouple as a temperature sensor. In the temperature calibration technology disclosed in Patent Document 1, a standard temperature material having a known phase transition temperature and a thermocouple are placed inside a heater. When temperatures of the standard temperature material having a known phase transition temperature and the thermocouple in the heater are gradually changed, an endothermic reaction of the standard temperature material may be observed at a temperature around a melting point of the standard temperature material. The endothermic reaction of the standard temperature material is detected as a point of inflection in a linear output change of the thermocouple. A temperature detected at the time where the point of inflection is detected is determined as a standard temperature that corresponds to a melting-point temperature, and a temperature value of the thermocouple is calibrated utilizing a correction value computed based on the determined standard temperature.
Japanese Patent Application Laid-Open Publication No. 2-039213 (hereinafter called "Patent Document 2") discloses another example of the temperature calibration technology. In the temperature calibration technology disclosed in Patent Document 2, a heater connected in series with a high temperature pressure device. With this technology, the heater is configured to control power applied to the high temperature pressure device while detecting the temperature inside the high temperature pressure device. Thereafter, the heater continuously heats the high temperature pressure device until phase transition occurs in the standard temperature material, and the temperature at which the phase transition has occurred in the standard temperature material is detected based on the electric resistance of the heater or the voltage-current change in the heater when the phase transition has occurred in the standard temperature material. The temperature calibration of the high temperature pressure device is conducted based on the power applied to the high temperature pressure device when the phase transition has occurred in the standard temperature material.
However, in the temperature calibration technology disclosed in Patent Document 1, since the standard temperature material is placed inside the heater in a temperature calibration process, the calibration accuracy of the thermocouple may vary with a positional accuracy of the standard temperature material. That is, the positional accuracy of the standard temperature material may need improving in order to increase the calibration accuracy of the thermocouple. As a result, a capital investment may be required for improving the positional accuracy of the standard temperature material, which may result in an increase in manufacturing cost. In addition, in the temperature calibration technology disclosed in Patent Document 1, when the temperature calibration is conducted after the incorporation of the temperature sensor in a product, a user needs to remove the temperature sensor from the product. Accordingly, the temperature calibration itself may become a cumbersome task for the user. Further, in the temperature calibration technology disclosed in Patent Document 2, since the heater is electrically connected to the phase change material in series, electric conductivity in the phase transition material may be changed by the phase transition of the phase change material in addition to the electric conductivity change in the heater. Accordingly, even if the temperature calibration is conducted based on the temperature detected at which the phase transition has occurred in the phase change material, the accuracy of the temperature calibration may be lowered due to an adverse effect from the electric conductivity change in the heater.
Further, either of the disclosed technologies may require a large-scale facility having a constant temperature environment controlled based on a temperature standard. Moreover, since high-precision sensors such as temperature sensors or humidity sensors configured to absorb heat require highly accurate temperature calibration, a complicated temperature calibration process that is generally required for the high-precision sensors may need to be incorporated in the manufacturing process compared to the temperature calibration for general-purpose sensors, the manufacturing process of which includes no complicated temperature calibration process. Accordingly, the high-precision sensors need to be transferred inside a constant temperature chamber that maintains a constant temperature, and the temperature calibration is conducted by gradually changing the internal temperature in small steps, which may result in low production efficiency. Thus, this may be a bottleneck of a mass-production manufacturing process of the above-described high-precision sensors compared to transmission devices or optical devices having a simpler configuration the settings of which are much simpler than those of the high-precision sensors. Therefore, it may be difficult to reduce the manufacturing cost. The high-precision sensors further require additional cost for the temperature calibration, and hence the cost of the high-precision temperature sensors that require the temperature calibration may be several to dozens times the cost of the temperature sensors that require no temperature calibration. In particular, in order to produce much higher-precision sensors, higher cost and more time may be required for conducting highly accurate temperature calibration.
Further, despite the fact that the currently produced sensors are widely used, not many high-precision sensors are mass-produced compared to mass-produced general-purpose semiconductor devices, due to the slow progress of the temperature calibration technology. Thus, it may be most effective to eliminate the temperature calibration process itself entirely from the manufacturing process. It is preferable that the temperature calibration be easily and simply conducted every time the users use the high-precision sensors in order to maintain high accuracy of the high-precision sensors. However, it may be practically difficult for the users to carry out the temperature calibration after the shipping of the sensors. Thus, there is demand for an electric element capable of conducting temperature calibration by itself utilizing electric signals any time, anywhere in the same manner as a general-purpose semiconductor device that is simply driven by the electric signals alone.

This patent is subject to a terminal disclaimer.


An explosive bolt is provided for securing a brace in tension. The bolt includes a bar, a pair of explosives, a pair of detonators and a pair of anchors. The bar has opposing longitudinal ends and an outer thickness. Opposing bores extend inwardly from the longitudinal ends to corresponding depth ends. First and second notches reduce the thickness proximate to the corresponding depth ends. A center rod separates the notches from each other. Each explosive correspondingly inserts into a corresponding bore to a corresponding depth end. Each detonator correspondingly inserts into the corresponding bore. Each anchor secures the bar to the brace. In further embodiments, the longitudinal ends include helical male threads, and the anchors are nuts having helical female threads.

The invention relates generally to explosive bolts for component separation. In particular, the invention relates to an explosive bolt having integral redundancy for improved reliability in separation of a clamp in tension.
Explosively-releasable bolts have many uses on space vehicles and staged rocket motor assemblies. Additionally, and of particular interest, explosively releasable bolts are presently utilized to provide longitudinal restraint to encanistered missiles within the Mk41 Vertical Launching System (VLS) on USS Arleigh Burke class DDG and USS Ticonderoga class CG type surface combatants.
Conventional explosively-releasable bolts have a single explosive charge and a single fracture plane. In the event that any portion of the energetic chain reaction (initiation, explosive detonation, material fracture) malfunctions, the explosively releasable bolt fails to separate. In the case of the Mk41 VLS, this results in a costly restrained firing event, wherein the missile's booster burns while the missile is still restrained within the launcher.

Doubly-separating explosively releasable bolt

United States of America, as represented by the Secretary of the Navy


An audio photograph data storage system stores a printed image and a plurality of audio segments associated with the printed image. The audio segments are arranged in a plurality of audio layers.

Prior art systems for recording sound clips associated with a photographic image are known from several sources. Earlier systems often relied on a magnetic recording medium attached to a film sheet.
U.S. Pat. No. 3,439,598 discloses a still image camera having a sound recording device recording a message to a rotating sound recording medium on a film layer, and dates back to 1966. U.S. Pat. No. 4,270,853 discloses an instant camera which has a sweeping magnetic recording head which records sound on a magnetic band of a film. That system enables recording of sound both before and after capture of a photograph image, and has multiple magnetic sound recording tracks on an instant film photograph.
In U.S. Pat. No. 4,905,029 there is disclosed an audio still camera system which captures image and sound, which allows a user to play back a sound associated with a photograph after the photograph has been inserted into a photograph album or frame, and discloses an acoustic recording medium of an electronic chip embedded in a paper laminate of a photograph. Playback of the sound can be made by the same camera which captures the image and sound, or through a separate photo album or frame. U.S. Pat. No. 4,270,854 discloses a further variant of instant film having a magnetic sound recording strip, and recording mechanism, whereby after recording sound information, together with a photograph image, the sound recording can be reproduced, played back by the camera, or erased. U.S. Pat. No. 5,276,472 discloses a further variant of sound recording utilising parallel tracks in a magnetic recording layer on a film, and in which a camera system having a micro-controller controls recording of audio sound clips to one or a plurality of magnetic strips.
WO 00/48388 discloses a digital camera for capturing sound passages as well as still images, and allows for a flexible construction of sound and image composites representing a user's experience at the time of capture of a photograph image. One or more sound passage files form a link to a group of sound passage files, and the user interface can selectively link still images with one or more sound passage files, or unlink images with sound passage files, according to a user's preference. Mixtures of sound passage files with image data can be carried out using the user interface. Further, matching of different views of image data with different sound passage files can be carried out. In WO 00/48388, generally a single type of sound is associated with a single photograph.
WO 00/03299 discloses a self-contained data storage device capable of storing audio data, comprising a flash memory, EEPROM or PROM, and is intended for use in storing audio data relating to a photograph image.
More recently, digital still cameras and digital camcorder devices have appeared, which in the case of camcorders are capable of taking still images as well as video clips, and recording sound data at the same time as a still image or video clip. In the case of camcorders, a video clip is recorded contemporaneously with background sound, and individual frames of the video clip can be viewed on a separate screen. Recent camcorder devices are now the size and weight comparable to digital cameras for taking still images, and prices of such devices are comparable to the extent that a prospective purchaser of a still image camera may well select a camcorder device as a direct alternative.
Much of the prior art is concerned with the mechanics of capturing a sound, immediately before, at the same time, or immediately after the time of capturing an image.
Although there are many types of photograph which provide for recording of sound at or near the time of capture of the photograph, the manipulation and editing of recorded sounds and association with photograph images after the time of capture is not well addressed in the prior art.
Current prior art technology for audio photography such as it exists, usually allows for only a single type of sound to be associated with a photographic image. Although there are several disclosures of individual photographs having associated sound recording media, the presentation of photographs after they have been taken is a relatively neglected area in the prior art. A known prior art photograph album available from Brookstone Ltd supports the recording of sound clips with individual pages of an album. Details of such photograph album are available from Brooksone's Ltd. website. However, this technology deals with the association of a single layer of audio with image data.
Prior art multi-media sound and video editing software exists to allow the construction of complex multi-layered sound files, and their playback in time to a sequence of images. However, these software packages are typically hard to use for the consumer, are not tailored to photograph albums and do not allow arbitrary re-selection between layers at playback time. They also require the use of a personal computer or like computer.
EP 01,056,094 discloses a semi-conductor memory card, playback apparatus and recording apparatus for storing a plurality of audio object files and picture object files. Default play list information and sets of play list information show orders in which audio objects are to be reproduced. However EP 01,056,094 refers to a plurality of image and audio objects working together. The disclosure relates to the automatic presentation of displayed lyrics in time with karaoke music tracks and deals with how an image and audio object are associated and played or viewed in turn during the course of a play list or "play back route". The disclosure uses pointers within audio information to specific image objects.
Various recording devices for recording data with a book are disclosed in U.S. Pat. No. 6,167,233 and WO 00/13159. In the case of U.S. Pat. No. 6,167,233, the disclosure uses a variety of techniques for selecting one of a number of discrete audio files relating to a single image or page, and for labeling each file with a written label. As such, its organization of time and audio data is flat.
In EP 99 301045.3 "digital camera with sound recording", there is disclosed a method of supporting a plurality of images and sounds, where there is not just one sound for one image, but multiple images for a same piece of sound, or multiple sounds for a same image.
Prior art sound and video editing packages allow for manipulation of image data together with sound data. Many video editing packages support the notion of multi-media channels for editing and allow users to combine multiple audio and image streams. However, such packages have a cost and difficulty of use which makes them unsuitable to application for photograph albums, and actually represents a barrier to the adoption of an audio photo format, because they cannot be used to author physical versions of photograph albums.
An electronic or printed photograph album which allows multiple audio tracks to be associated with a single image over a period of time extending from or around the time of capture of an image, to an arbitrary time thereafter does not, to our knowledge, exist in the prior art.
The present disclosure addresses a new type of user interface for storage, presentation, and manipulation of image data and audio data.

Hewlett-Packard Development Company, L.P.


A method for continuously mixing a borehole fluid such as cement includes using a measurement of the solid fraction of a cement slurry as it is being mixed to determine the ratio of the solid and liquid components to be added to the slurry. A system for mixing the includes a liquid material (water) supply including a flow meter; a solid material (cement) supply; a mixer which receives the liquid and solid materials and includes an output for delivering materials from the mixer to a delivery system; a device for measuring the amount of material in the mixer; and a flow meter in the output; wherein measurements from the flow meters and the device for measuring the amount of material in the mixer are used to control the amount of solid and/or liquid material added to the mixer.

The present invention relates to a system for mixing fluids containing solid and liquid materials such as cement. In particular the invention provides a system for the continuous mixing of cements or other fluids used in the drilling, completion or stimulation of boreholes such as oil or gas wells.
When a well such as an oil or gas well has been drilled, it is often desired to isolate the various producing zones form each other or from the well itself in order to stabilise the well or prevent fluid communication between the zones or shut off unwanted fluid production such as water. This isolation is typically achieved by installing a tubular casing in the well and filling the annulus between the outside of the casing and the wall of the well (the formation) with cement. The cement is usually placed in the annulus by pumping a slurry of the cement down the casing such that it exits at the bottom of the well and passes back up the outside of the casing to fill the annulus. While it is possible to mix the cement as a batch prior to pumping into the well, it has become desirable to effect continuous mixing of the cement slurry at the surface just prior to pumping into the well. This has been found to provide better control of cement properties and more efficient use of materials.
The cement slurries used in such operations comprise a mixture of dry and liquid materials. The liquid phase is typically water and so is readily available and cheap. The solid materials define the slurry and cement properties when added to the water and mixed, the amount of solid materials in the slurry being important. Since the liquid phase is constant, the amount of solid material added is usually monitored by measuring the density of the slurry and maintaining this at the desired level by controlling the amount of the solid material being added. FIG. 1 shows a schematic diagram of a prior art mixing system. In the system of FIG. 1, mix water is pumped from a feed supply 10 via a pump 12 to a mixer 14 which feeds into a mixing tub 16. Solid materials are delivered to the mixer 14 from a surge can 18 via a flow control valve 20 and are carried into the mixing tub 16 with the mix water. The contents of the mixing tub 16 are recirculated through a recirculation pipe 22 and pump 24 to the mixer 14. The recirculation pipe 22 also includes a densitometer 26 which provides a measurement of the density of the slurry in the mixing tub 16. An output 28 is provided for slurry to be fed from the mixing tub 16 to further pumps (not shown) for pumping into the well. Control of the slurry mixture is achieved by controlling the density in the mixing tub 16 as provided by the densitometer 26 by addition of solid material to stay at a predetermined level for the slurry desired to be pumped. The densitometer 26 is typically a non-radioactive device such as a Coriolis meter.
While this system is effective for slurries using materials of much higher density than water, it is not effective for slurries using low density solid materials, especially when the density of the solids is close to that of water. In such cases, a density measurement is not sensitive enough to control the amounts of solid material added to the necessary accuracy.
The present invention seeks to provide a mixing system which avoid the problem of density measurement described above.
In its broadest aspect, the present invention comprises using a measurement of the solid fraction of a fluid as it is being mixed to determine the ratio of the solid and liquid components added to the slurry.
The invention is particularly applicable to the mixing of borehole cement slurries, in which case, solids fraction is determined as (slurry volxe2x88x92water vol)/slurry vol. An alternative but related parameter is porosity, determined as water vol/slurry vol (porosity+solids fraction=1).
A system for mixing cement in accordance with the invention comprises a water supply including a flow meter; a solid material supply; a mixer which receives the water and solid materials and includes an output for delivering materials from the mixer to a delivery system; a device for measuring the amount of material in the mixer; and a flow meter in the output; wherein measurements from the flow meters and the device for measuring the amount of material in the mixer are used to control the amount of solid material added to the mixer.
The flow meters can be mass flow meters or volumetric flow meters. Any suitable form of meter can be used, for example Coriolis meters or electromagnetic meters.
The mixer will typically include a tank or tub, in which case the device for measuring the amount of material in the mixer can be a level sensor. Such a level sensor is preferably a time domain reflectometry- or radar-type device although acoustic or float devices can also be used. It is preferred to mount such a device in an arrangement for damping transient fluctuations in the tank level, for example in an arrangement of concentric slotted tubes. An alternative or additional form of sensor can be a load cell which can be used to indicate the weight of the tank, or a pressure sensor.
Where the mixer includes some form of recirculation of the slurry through the tank, it is important that the output flow meter is downstream of this recirculation.
Where the solid materials comprise cement and other solid additives added separately to the mixer, separate flow meters can also be provided for each separate supply of additives.
In its simplest form, the measurement of solid fraction is used as a guide for the operator to add solids, particularly cement, to the slurry as it is mixed. In more advanced versions, the calculation of solids fraction is used to control the addition of solids directly by means of an automatic control system.


A thin film transistor array structure and a method for manufacturing the same are provided. The thin film transistor array structure comprises a substrate, including a transition area and a pad area. A patterned first metal layer is formed on the substrate, wherein the patterned first metal layer includes a data connecting line disposed in the transition area, and a data pad and a gate pad disposed in the pad area. A patterned first insulation layer is formed on the patterned first metal layer. The patterned first insulation layer at least defines a first opening on the gate pad, a second opening on the data pad, and a third opening in the transition area, so as to simplify following processes to increase the yield.

1. Field of the Invention
The present invention relates to a thin film transistor array substrate and a method for manufacturing the same, and more particularly, to a thin film transistor array substrate for a liquid crystal display (LCD) and a method for manufacturing the same.
2. Descriptions of the Related Art
Evolution of associated technologies has led to continuous development of various display manufacturing technologies, for example, those using a planarization insulation layer. According to technologies using the planarization insulation layer, a photosensitive planarization insulation layer is formed prior to formation of a transparent electrode. The planarization insulation layer, which has a thickness generally greater than that of an insulation layer formed of silicon nitride or silicon oxide and a lower dielectric constant, provides both planarization functionality and a desirable insulation effect, which are detailed as follows.
Referring to FIGS. 1A and 1B together, FIG. 1A is a top view of a prior art thin film transistor (TFT) array substrate, and FIG. 1B is a schematic cross-sectional view of the prior art TFT array substrate. For convenience to reveal features of the prior art, FIG. 1A illustrates only some portions of the structure, and a more detailed structure of the TFT array substrate is shown in FIG. 1B. Additionally, these structures are shown in a single cross-sectional view and divided by separating lines into regions A-A′, B-B′ and C-C′ to depict cross-sectional structures along the section lines A-A′, B-B′ and C-C′ of FIG. 1. The TFT array substrate 1 comprises a substrate 10, on which a display area 11 (the area indicated by the section line A-A′) and a pad area 12 (the area surrounded by the dashed line) are defined. The pad area 12 further comprises a gate pad area 12a and a data pad area 12b (areas indicated by the section lines B-B′ and C-C′ respectively). A patterned first metal layer 13 disposed on the substrate 10 comprises a gate 131 disposed in the display area 11, a gate pad 132 disposed in the gate pad area 12a and a gate line 133 for connecting the gate 131 with the gate pad 132. A patterned first insulation layer 14 covers the substrate 10 and the patterned first metal layer 13. A patterned semiconductor layer 15 is disposed on the patterned first insulation layer 14 above the gate 131. A patterned second metal layer 16 is disposed on the patterned first insulation layer 14 in the display area 11, and covers portions of the patterned semiconductor layer 15. The patterned second metal layer 16 comprises a source 161 and a drain 162 disposed in the display area 11, a data pad 163 disposed in the data pad area 12b, and a data line 164 for connecting the source 161 with the data pad 163. All these connections are depicted in FIG. 1A. It should be appreciated that, the source 161 and the drain 162 are at least partially disposed on the patterned semiconductor layer 15 at two sides of the gate 131 respectively.
Further, a patterned second insulation layer 17 covers the display area 11, the gate pad area 12a and the data pad area 12b. It should be appreciated that, for convenience to draw a top view of FIG. 1B and for sake of description, the patterned second insulation layer 17 is omitted from depiction in FIG. 1A. Subsequently, a patterned planarization layer 18 is disposed on the patterned second insulation layer 17 in the display area 11.
FIG. 2 is a schematic view of the prior art TFT array substrate 1 using a half tone mask 24. During formation of the structure shown in FIG. 1B, through a photolithographic process using a half tone mask 24, openings 19′, 20′ and 21′ are formed in the planarization layer 18′. Afterwards, by using the planarization layer 18′ as a mask, the first insulation layer 14 and the second insulation layer 17 are etched to expose a portion of the drain 162 through a drain contact opening 19, and to expose a portion of the gate pad 132 and a portion of the data pad 163 through the first contact opening 20 and the second contact opening 21 respectively. Next, the planarization layer 18′ is removed from the pad area 12 and a pixel electrode 22 is formed on the patterned planarization layer 18 to cover the drain contact opening 19 for electrical connection with the drain 162. A pad conduction layer 23 covering the first contact opening 20 and the second contact opening 21 is formed to electrically connect with the gate pad 132 and the data pad 163, thus completing the structure shown in FIG. 1B.
Unfortunately, the aforesaid structure has the following disadvantages. If the residue of the patterned planarization layer 18 in the gate pad area 12a and the data pad area 12b has an overlarge thickness, conductivity between the pad conduction layer 23 and other components or conductive layers attached thereon, for example, conductivity between the pad conduction layer 23 and a driving integrated circuit (IC), will be affected. Moreover, use of the half tone mask has strict requirements on uniformity control of the photolithographic process, causing increased difficulty in mass production.
In view of above, it is highly desirable in the art to provide a TFT array substrate for an LCD that can make the manufacturing process smoother and lower the production cost.

Thin film transistor array substrate and method for manufacturing the same


Based on the output signal of an area sensor 1, a level adjustment circuit 2 adjusts the bias voltage fed to the transistors provided within the individual pixels of the area sensor 1 and operating in a subthreshold region and thereby adjusts the level of the output signal of the area sensor 1. According to whether the subject is illuminated with intense or dim light, the level of the output signal is lowered or raised, respectively.

1. Field of the Invention
The present invention relates to an image-sensing device having a photoelectric conversion means that outputs a signal logarithmically proportional to the amount of incident light.
2. Description of the Prior Art
A conventional area sensor having photosensitive devices such as photodiodes outputs a signal that is linearly proportional to the brightness of the light incident on the photosensitive devices. When a subject is shot with such a linear-conversion-based area sensor (hereinafter referred to as a "linear sensor"), no brightness data is obtained outside the roughly two-digit brightness range within which the linear sensor can effectively perform image sensing (this brightness range will hereinafter be referred to as the "shootable brightness range"). Here, this brightness range is represented as Lmax/Lmin, assuming that the brightness of the subject distributes from a minimum value Lmin [cd/m2] to a maximum value Lmax [cd/m2], and the range of the output of the linear sensor that corresponds to the range of the shootable brightness range is called the "dynamic range".
Accordingly, when the signal from this linear sensor is reproduced as an image on a display or the like, the displayed image suffers from flat blackness in low-brightness portions thereof and saturation (flat whiteness) in high-brightness portions thereof outside the shootable brightness range. It is possible to alleviate such flat blackness or saturation by shifting the shootable brightness range. However, this requires varying the aperture value or shutter speed of a camera, or the integral time for which to allow light in, and thus spoils ease of use.
On the other hand, the applicant of the present invention once proposed an area sensor (hereinafter referred to as a "LOG sensor") provided with a light-sensing means that outputs a photocurrent proportional to the amount of incident light, a MOS transistor to which the photocurrent is fed, and a bias means for biasing the MOS transistor in such a way that a subthreshold current flows therethrough, so that the photocurrent is converted logarithmically (refer to U.S. Pat. No. 4,973,833). This LOG sensor outputs a signal whose level is natural-logarithmically proportional to the brightness of incident light, and thus offers a wide shootable brightness range that corresponds to a five- to six-digit brightness range. This permits, even when the brightness distribution of a given subject tends to shift, the brightness distribution of the subject to lie most probably within the shootable brightness range.
However, a typical subject has a two- to three-digit brightness range, and therefore, if it is shot with a LOG sensor that offers a five- to six-digit dynamic range, the shootable brightness range is too wide relative to the actual brightness distribution of the subject, and this tends to spoil the sharpness of the obtained image.


The hydraulic control system for an automatic transmission having a plurality of friction elements includes a pressure regulator which regulates hydraulic pressure produced by an oil pump, a plurality of valves selectively supplying hydraulic pressure to the plurality of friction elements, and a pressure controller controlling and selectively supplying hydraulic pressure to a plurality of pressure control lines operationally connected to the plurality of valves and at least one of the plurality of valves. The plurality of valves include a first valve operationally controlled by hydraulic pressure in a first one of the pressure control lines to pass the hydraulic pressure output by the pressure controller to at least one of the plurality of friction elements in each operational range except a first speed stage of a drive range. A second valve is operationally controlled by hydraulic pressure in a second one and third one of the pressure control lines to selectively pass the hydraulic pressure output from the first valve to a first and second friction element in the drive range. A control switch valve in the plurality of valves is operationally controlled by a fourth one of the pressure control lines to selectively supply hydraulic pressure from at least one of the first and second pressure control lines and the first valve to the second friction element in second, third and fourth speed stages of the drive range, and to a third friction element in the third and fourth speed stages, of the drive range.

The present invention relates to a hydraulic control system for automatic transmissions used in vehicles.
Generally, a conventional automatic transmission for a vehicle includes a torque convertor, a multi-stage gear shift mechanism, and a plurality of friction elements, actuated by hydraulic pressure and which select a gear range of the gear shift mechanism according to a driving state of a vehicle.
A hydraulic control system. for automatic transmissions used in vehicles operates by the selection of friction elements using hydraulic pressure, created in a hydraulic pump, which passes through a control valve. As a result, shifting can be realized automatically, and an appropriate driving state of the vehicle is achieved.
The above hydraulic control system includes a pressure regulator, which regulates hydraulic pressure created in a hydraulic pump; manual and automatic shift controllers, which control shifting; a hydraulic controller, which controls shift quality and shift response for a smooth shift; a damper clutch controller, for operation of a torque convertor damper clutch; and hydraulic pressure distributer, which supplies an appropriate amount of hydraulic pressure to each of the friction elements.
In the hydraulic control system structured as above, through the ON/OFF and duty control of solenoid valves by a transmission control unit, the hydraulic pressure distributer changes the hydraulic distribution and thus friction elements to be operated so as to control the shifting between shift stages.
However, when controlling shifting from the present shift stage to a different shift stage in the above hydraulic control system, the timing required to release hydraulic pressure operating on the present friction element and to supply hydraulic pressure to a new friction element greatly influences shift quality. Also, in the prior art hydraulic control system, engine rpms can quickly increase, the shift mechanism can become interlocked, and the engine can briefly enter a neutral state.
To improve shift quality by controlling the timing of supplying hydraulic pressure, the prior art changes a structure of the shift valves. But this change results in the drawback of complicating the shift valve structure, and if an ECU malfunctions, fail-safe functions can only operate for one shift stage.

Hydraulic control system for automatic transmissions used in vehicles