A semiconductor device having: an underlie having a conductive region in the surface layer of the underlie; an insulating etch stopper film covering the surface of the underlie; an interlayer insulating film formed on the insulating etch stopper film; a wiring trench formed in the interlayer insulating film, the wiring trench having a first depth from the surface of the interlayer insulating film; a contact hole extending from the bottom surface of the wiring trench to the surface of the conductive region; and a dual damascene wiring layer embedded in the wiring trench and the contact hole, wherein the interlayer insulating film includes a first kind of an insulating layer surrounding the side wall and bottom surface of the wiring trench and a second kind of an insulating layer having etching characteristics different from the first kind of the insulating layer. The semiconductor device is provided which can protect the underlying conductive region sufficiently and has a dual damascene wiring layer having a high reliability and a small wiring capacitance.

a) Field of the Invention
The present invention relates to a semiconductor device and its manufacture method, and more particularly to a semiconductor device having a dual damascene wiring structure and its manufacture method.
In this embodiment, an "etch stopper" is intended to mean a layer having an etch rate of at most ⅕ times that of a layer to be etched. A "similar etch rate" is intended to mean an etch rate about ½ to about two times that of a layer to be etched.
b) Description of the Related Art
Demands for higher integration of semiconductor devices are increasing. A conventional conductive wire is made of Al, W or the like. After an Al wiring layer or W wiring layer is formed on an insulating layer, an etching mask such as a resist pattern is formed on the wiring layer. This wiring layer is patterned and embedded in an insulating layer to form a wiring pattern.
As the integration degree becomes higher, it is required to narrow the width of a wiring pattern and shorten a space between adjacent conductive wires. Such fine patterns increase the capacitance between wiring patterns. A reduced cross sectional area of a conductive wire results in an increased resistance. An increase in the capacitance or resistance lowers a signal transmission speed in the conductive wire and hinders speeding up the device operation.
In order to reduce the wiring resistance, Cu wiring having a lower resistivity than Al and W has been adopted. Cu is difficult to be patterned by etching. A damascene wiring process is used for forming a Cu wiring pattern. Namely, a wiring trench is formed in a surface layer of an insulating film, a wiring layer is embedded in this wiring trench, and an unnecessary wiring layer on the surface of the insulating film is removed by chemical mechanical polishing (CMP).
It is necessary to interconnect wiring layers by using via conductors. A single damascene process and a dual damascene process are known as the damascene process. In the single damascene process, after a via hole is embedded with a via conductor, a wiring trench is formed and embedded with wiring material. In the dual damascene process, after a via hole and a wiring trench are formed, they are embedded with wiring material at the same time. The dual damascene process is superior in terms of process simplification.
A via first process and a trench first process are known as the dual damascene process. The former forms first a via hole and then a wiring trench, whereas the latter forms first a wiring trench and then a via hole. The via first process is considered superior in terms of reliable connection to the underlie.
With reference to FIGS. 11A to 11H, an example of the via first dual damascene process will be described.
As shown in FIG. 11A, on the surface of an underlie 110 having a conductive region 111, a first etch stopper layer 112 of SiN or the like is formed. The underlie may be a semiconductor substrate or an insulating layer formed on the substrate. The conductive region 111 may be a semiconductor region or a wiring layer. If the conductive region 111 is a Cu wire, the etch stopper layer 112 is needed to cover the Cu wire because the surface of the Cu wire is oxidized very easily.
On the first etch stopper 112, a first interlayer insulting film 113 of silicon oxide or the like is formed. On the first interlayer insulating film 113, a second etch stopper 114 of SiN or the like is formed which functions as an etch stopper while a wiring trench is formed thereon. On the second etch stopper 114, a second interlayer insulating film 115 of silicon oxide or the like is formed in which the wiring trench is formed. On the second interlayer insulating film 115, an insulating antireflection film 116 of SiN or the like is formed which presents an antireflection function while a resist layer is patterned.
As shown in FIG. 11B, a resist layer is formed on the insulating antireflection film 116, and exposed and developed to form a resist pattern PR1. The resist pattern PR1 is formed with an opening 101 corresponding to a via hole.
By using the resist pattern PR1 as an etching mask, the antireflection film 116, second interlayer insulating film 115, second etch stopper layer 114 and first interlayer insulating film 113 are anisotropically etched to form a via hole 102 in register with the opening 101 in the resist pattern PR1. If an over-etch is performed, the first etch stopper layer 112 is etched slightly. In some cases, the first etch stopper layer 112 may be completely etched and the underlying conductive region 111 may be damaged. The resist pattern PR1 is thereafter removed.
As shown in FIG. 11C, a resist layer is formed on the antireflection film 116, and exposed and developed to form a second resist pattern PR2. The resist pattern PR2 is formed with an opening 103 corresponding to a wiring trench in an area inclusive of the via hole 102.
As shown in FIG. 11D, by using the resist pattern PR2 as an etching mask, the antireflection film 116 and second interlayer insulating film 115 are etched. In this etching, the second etch stopper layer 114 functions as an etching stopper.
During this etching process shown in FIG. 11D, if the quality and thickness of the first etch stopper layer 112 are insufficient, the first etch stopper 112 may be etched and the surface of the underlying conductive region 111 may be damaged.
As shown in FIG. 11E, the second resist pattern PR2 is removed by ashing with oxygen plasma. If the first etch stopper layer 112 is not left sufficiently, oxygen plasma during this ashing process may damage the surface of the conductive region 111.
As shown in FIG. 11F, the antireflection film 116 on the second interlayer insulating film 115, the second-etch stopper layer 114 exposed at the bottom of the wiring trench, and the first etch stopper layer 112 exposed in the via hole, are preferably anisotropically etched and removed. Thereafter, a damascene wiring layer 160 is formed.
During these processes, when the wiring trench is formed, the wiring trench etching is stopped at the second etch stopper layer 114. The etch stopper layer 114 is therefore left on the bottom of the wiring trench. Even if the exposed second etch stopper layer is removed, the side wall of the second etch stopper 114 layer contacts the side wall of the dual damascene wiring layer 160.
An insulating film having an etch stopper function has generally a high dielectric constant. If such an etch stopper exists at the side wall of the wiring trench, a capacitance between adjacent wiring patterns increases. In order to avoid this, a process has been proposed which does not use the second etch stopper layer when the wiring trench is etched.
As shown in FIG. 11G, after an etch stopper layer 112 and an interlayer insulating film 113 are formed on an underlie 110, an antireflection film 116 is formed on the surface of the interlayer insulating film 113. A resist pattern is formed on the antireflection film 116. Similar to the above-described processes, a via hole 102 is formed reaching the etch stopper 112. Thereafter, a resist pattern PR2 is formed for forming a wiring trench.
As shown in FIG. 11H, by using the resist pattern PR2 as a mask, the antireflection film 116 is etched and thereafter the first interlayer 113 is etched by a predetermined thickness through controlled etching. Since an etching stopper is not used, this etching depth is controlled by an etch time. In this manner, a wiring trench 104 continuous with the via hole 102 is formed. Because an etch stopper layer is not used, the shoulder of the via hole is etched so that the cross sectional area of the via hole gradually increases toward the upper area.
Also in this example, if the first etch stopper layer 112 is etched during etching of the via hole 102 and/or wiring trench 104, the surface of the underlying conductive region 111 may be damaged.
With the via first dual damascene process, there is a possibility that the etch stopper layer on the bottom of the via hole is damaged so that the underlying conductive region is damaged.
In order to make the conductive region under the via hole not susceptible to damages, a process has been proposed by which a filler is placed in a via hole.
FIGS. 12A to 12E illustrate an example of the process of placing a filler in a via hole and thereafter forming a wiring trench by utilizing an etch stopper layer.
As shown in FIG. 12A, on an underlie 110 having a conductive region 111, a laminated structure is formed having a first etch stopper layer 112, a first interlayer insulating film 113, a second etch stopper layer 114, a second interlayer insulating film 115 and an antireflection film 116. A via hole 102 reaching the first etch stopper layer 112 is formed by using a resist pattern.
A filler 155 used as an etching protective member or material is embedded in the via hole 102 at a deeper position. On the antireflection film 116, a resist pattern PR2 is formed having an opening 103 corresponding to a wiring trench.
As shown in FIG. 12B, by using the resist pattern PR2 as an etching mask, the antireflection film 116 and second interlayer insulating film 115 are anisotropically etched. In this case, the first etch stopper layer 112 on the bottom of the via hole 102 can be protected from etching because the layer 112 is covered with the filler 155.
As shown in FIG. 12C, the resist pattern PR2 is removed by ashing. If the filler 155 is made of organic substance, it can be removed at the same time by this ashing. It is also possible to remove the filler 155 and resist pattern PR2 by different processes.
The first etch stopper layer 112 is not etched by the etching process for the wiring trench. Therefore, the ashing process rarely damages the conductive region 111 under the first etch stopper layer 112.
As shown in FIG. 12D, the antireflection film 116 on the second interlayer insulating film 115, the second etch stopper layer 114 exposed on the bottom of the wiring trench, and the first etch stopper layer 112 exposed in the via hole, are etched and removed. In this manner, the wiring trench and via hole continuous with the underlying conductive region 111 are formed.
As shown in FIG. 12E, a wiring layer is deposited and this wiring layer on the surface of the second interlayer insulating film 115 is removed by CMP to form a dual damascene wiring pattern 160 embedded in the via hole and wiring trench.
As described above, unless a filler is used, a conventional dual damascene process is not always easy to sufficiently protect the surface of a conductive region disposed under a dual damascene wiring pattern and form a highly reliable wiring structure.

Semiconductor device with dual damascene wiring


Heat exchange tubes are mounted on the upper face of the sole plates of the main screed and screed extenders on an asphalt paving machine. Hot oil is circulated through the heat exchange tubes to preheat the sole plates. The heating system for the oil includes a heat exchanger in the exhaust system of the internal combustion engine for driving the tractor of the paving machine. The heating oil is pressurized by a pump driven by a hydraulic motor supplied with pressurized oil in a second hydraulic circuit from a pump driven by the engine. This second circuit is also used to operated the vibratory mechanisms on the screeds.

The sole plates of screeds on asphalt paving machines must be preheated to about 175.degree. F. to 200.degree. F. before paving commences to keep the hot asphalt from congealing on the sole face of the screeds. Prior to my inventions identified above, the preheating has been accomplished by oil or propane burners mounted on the moldboard and directly heating the top surface of the screeds. When using such burners, particular care must be taken to avoid overheating since this can result in permanent warping of the screed.
My prior invention provided an improved preheating system applicable to both primary and extension screeds which eliminated the use of oil or propane burners by utilizing the heat created by dropping the pressure of high pressure oil at a flow restrictor. In the case of extender screeds, a reservoir was initially mounted in direct contact with the top surface of each screed, and oil from the reservoir was pressurized by a pump and circulated through a flow restrictor to create a large pressure drop. This pressure drop is adjusted to result in an output oil temperature of about 275.degree. F. which normally is sufficient to establish the desired screed temperature of about 200.degree. F.
In the case of the primary screed, instead of providing a reservoir on the top of the screed, my previous invention provided flat-sided heat exchange tubes attached directly to the upper surface of the screed through which the heated oil is circulated. This arrangement reduces the amount of oil required in the system.
In the preferred operation of my previous invention directed particularly at heating a primary screed for an asphalt paver having a primary floating screed equipped with screed extensions and towed by a tractor, a hydraulic pump on the tractor supplies pressurized oil to a control unit on the primary screed from which the oil is selectively distributed to drive hydraulic motors in the heating and vibratory systems for the screeds. The hydraulic motor in the heating system drives a high pressure pump whose output is circulated in a closed independent system through a flow restriction causing the circulating oil to be heated responsive to the resulting pressure drop. Heated oil is circulated through heat exchange tubes mounted on the sole plate of the primary screed and returns to a small reservoir tank from which the high pressure pump takes its suction. Heated oil is also circulated through head exchange tubes on the sole plates of the extender screeds or through shallow tanks on the sole plates. One or more temperature sensors are is provided in the heating system to detect overheating of the components and cause most of the oil supplied to the hydraulic motor or motors in the heating system to be cut off in the control manifold when an overheating condition is sensed. After being utilized to heat the screeds, the pressurized oil from the tractor is diverted at the control manifold to hydraulic motors in the vibratory system which drive eccentric carrying shafts mounted on the screed units.

Method and apparatus for heating an asphalt paving screed


A rework station and a metrology device(s) are incorporated into a lithographic processing cell so that a faulty substrate can be reworked directly and reprocessed without, for example, an overhead involved in changing masks, etc.

A lithographic apparatus is a machine that applies a desired pattern onto a target portion of a substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that circumstance, a patterning device, such as a mask, may be used to generate a circuit pattern corresponding to an individual layer of the IC, and this pattern can be imaged onto a target portion (e.g. comprising part of, one or several dies) on a substrate (e.g. a silicon wafer) that has a layer of radiation-sensitive material (resist). In general, a single substrate will contain a network of adjacent target portions that are successively exposed. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion in one go, and so-called scanners, in which each target portion is irradiated by scanning the pattern through the projection beam in a given direction (the "scanning" -direction) while synchronously scanning the substrate parallel or anti-parallel to this direction.
In a factory, commonly referred to as a "fab" or "foundry", in which semiconductor or other devices are manufactured, each lithographic apparatus is commonly grouped with a "track" comprising substrate handling devices and pre- and post-processing devices to form a lithographic processing cell commonly referred to as "lithocell". Substrates (e.g., wafers), which may be blank or have already been processed to include one or more process or device layers, are delivered to the lithocell in lots (also referred to as batches) for processing. A lot is, in general, a group of substrates which are to processed by the lithocell in the same way and is accompanied by a "recipe" which specifies the processes to be carried out. The lot size may be arbitrary or determined by the size of carrier used to transport substrates around the fab. The recipe may include details of the resist coating to be applied, temperature and duration of pre- and post-exposure bakes, details of the pattern to be exposed and the exposure settings for that, development duration, etc.
Inevitably, errors occur in the processing of substrates, e.g. focus spots caused by dust on the substrate table and overlay errors, and various measurement techniques, collectively referred to as metrology, for detecting them are known. If an error can be detected before an irreversible process step, e.g. an etch, has been carried out, the developed resist may be stripped from the substrate and the substrate reprocessed with the aim of producing a correct layer. Existing metrology devices are generally off-line, that is stand alone devices outside the lithocell to which exposed substrates are taken to be measured. The measurement processes may be time consuming, so that often only a sample of the substrates in a lot are measured and in the event that errors are detected the whole lot is stripped and reprocessed. This can be inefficient in that many perfectly good substrates may be reprocessed and ineffective in that the sampling of substrates may not detect a few bad substrates in a lot.

This patent is subject to a terminal disclaimer.

Lithographic processing cell, lithographic apparatus, track and device manufacturing method


In accordance with a first aspect of the present disclosure, an enrollment device is provided, comprising: a token interface unit configured to couple the enrollment device to an external user authentication token; a user interface unit configured to provide visual information to a user through a plurality of optical output elements, said visual information being indicative of a progress of a biometric template enrollment in the authentication token; a user interface control unit configured to receive input data indicative of said progress from the authentication token through the token interface unit and to control the user interface unit using said input data.

Fingerprint sensing devices, such as capacitive fingerprint sensors, may be integrated into user authentication tokens, for example into smart cards. In order to personalize such a user authentication token, fingerprint reference data should be enrolled into the user authentication token. More specifically, a fingerprint template should be stored in a secure element of the token, so that—in operation—a captured fingerprint can be compared with said template in order to authenticate a user. A secure element may for example be an embedded chip, more specifically a tamper-resistant integrated circuit with installed or pre-installed smart-card-grade applications, for instance payment applications, which have a prescribed functionality and a prescribed level of security. Furthermore, a secure element may implement security functions, such as cryptographic functions and authentication functions. The enrollment of fingerprint reference data is often performed under supervision in a secure environment, for example at the premises of a bank. This process is often not user-friendly and time-consuming. Thus, it is desirable to facilitate enrolling fingerprint reference data into user authentication tokens of the kind set forth.

Enrollment device and method of facilitating enrollment of a biometric template


Methods are provided for accurately blending biodiesel into distillate streams to achieve a pre-determined percentage of biodiesel in the distillate, applicable to wild-type distillate streams as well as distillate streams that already contain some percentage of biodiesel.

Petroleum pipelines are a critical element of world-wide fuel distribution networks, delivering refined fuel products from ports and refineries to storage facilities in various geographic locations. Through an intricate network of coordinated deliveries from multiple sources, batches of varying grades and types of fuel travel through these pipelines to predetermined locations. Tank farms are used to store fuel delivered through these pipelines, and to distribute the fuel to other tank farms and ultimately to tanker trucks that deliver the fuel to end user outlets such as retail fuel stations and airports. Petroleum products are typically dispensed to tanker trucks in what is known as a rack, which usually comprises several outlet ports to which different gasoline and diesel transports may be coupled.
The United States Environmental Protection Agency (EPA) and other regulatory authorities have promulgated regulations and fuel standards that mandate a certain amount of biodiesel that must be blended with diesel each year. These regulations generally apply in aggregate for the year. However, due to the effects of cold temperature on the diesel properties, most biodiesel blending occurs in the warmest months of cold climate geographic areas. State and local regulations also establish labeling requirements for diesel based on the amount of biodiesel blended with the diesel that vary by the region in which the diesel will be dispensed and sold.
Biodiesel is often blended with diesel at tank farms, racks, and retail locations. This blending can occur in-line, so that biodiesel is added directly to a line that is transporting the diesel to a terminal or in-line delivery to a tank truck. Alternatively, blending can occur in batches, as when biodiesel is added to a storage tank or tank truck. The addition of biodiesel to a storage tank in a separate batch from the diesel is referred to as "tank blending." The addition of biodiesel to a tank truck in a separate batch from the diesel is referred to as "splash blending."
As explained by Kram J, No need to splash, BIODIESEL MAGAZINE (Jan. 17, 2008), blending of biodiesel into diesel fuel is typically governed by percentage limits. Thus, when blending on a pipeline into a wild diesel stream to which no biodiesel has been added, a pipeline operator simply blends biodiesel to the target percentage, using a process known as "ratio blending." An exemplary system for carrying out this ratio blending is the Multi-Stream Blender™ by Honeywell Enraf Americas Inc. However, this type of "ratio blending" is not possible when biodiesel has already been added to the stream, because ratio blending to a mixed biodiesel/diesel stream could cause the stream to exceed its biodiesel percentage target.
The same holds true for splash building, which is commonly based on the volumes or weights of diesel and biodiesel added to a tanker truck. Using the volume method, a truck will receive a measured volume of diesel, and then add a measured volume of biodiesel to complete the target blend. Using the weight method, a truck is often weighed on a scale, filled, weighed again and the difference between the weights is the amount of biodiesel that's been added. To make a blend such as B5 that contains 5% biodiesel, a proportional volume or weight of biodiesel is splash blended with the petroleum diesel. Once again, this process cannot be used if the diesel already contains biodiesel, because of the potential for exceeding the percentage limit on biodiesel in the blend.
Biodiesel blending can be especially challenging on the multi-product pipelines that carry the vast majority of fuels from ports and refineries, because of the potential for mixing biodiesel with incompatible fuels, particularly aviation turbine fuels. Because biodiesel contamination of aviation turbine fuel is limited to almost undetectable levels in ASTM specification D1655, common carrier pipelines have responded by banning biodiesel-containing distillate on most of their line segments, thus relegating biodiesel blending to splash blending or tank blending processes individually at the tank farms and retail locations at the end of the pipelines.
Therefore, it is an object of the present invention to provide more versatile methods for blending biodiesel into diesel streams and other fuel streams where biodiesel is permitted, that can be used regardless of the biodiesel content of the stream, to achieve target concentrations of biodiesel in the blend.
Another object is to provide automated methods for monitoring the biodiesel content of a diesel or other fuel stream, and for controlling the blending of biodiesel into the diesel or other fuel stream based on the biodiesel content based on real-time biodiesel percentage measurements.
Another object of the present invention is to facilitate biodiesel blending into diesel and other fuel streams to achieve defined biodiesel limits in the diesel or other fuel.
Still another object of the present invention is to facilitate blending of biodiesel into distillate streams along multi-product fuel pipelines, including pipelines that carry aviation turbine fuel.

Controlled blending of biodiesel into distillate streams


A polymer alloy is obtained by adding a hydrophobic compound (1) having a hydrophobic main chain and a functional group containing an active hydrogen atom and a bisoxazoline compound (2) shown by the following formula to a composition containing plural polymers incompatible with each other: ##STR1## wherein D represents an optionally substituted alkylene group, cycloalkylene group or arylene group, R.sup.1, R.sup.2, R.sup.3 and R.sup.4 respectively represent a hydrogen atom or an optionally substituted alkyl group or aryl group. The compound (1) includes a compound having an aliphatic hydrocarbon group as a main chain, containing a carboxyl group and having a molecular weight of 10,000 or less (e.g. higher fatty acids). A compatibilizing agent as produced by reacting the compound (1) and an excess amount of the compound (2) can also be used.

Alloying techniques of mixing plural polymers different in characteristics have been investigated in order to exhibit characteristics of such plurality of polymers effectively. In this polymer alloy, plural polymers being incompatible with each other are generally employed, and the resultant polymer alloy constitutes a heterogenous polymer system.
On the other hand, a heterogenous polymer system comprising plural polymers is usually poor in mechanical characteristics such as impact resistance, strength (steeliness) or the like. Accordingly, a polymer containing unit(s) as the same with, or similar to, the constituent units of the plural polymers are usually added in the polymer alloy. By way of illustration, Japanese Patent Application Laid-open No. 76743/1991 (JP-A-3-76743) discloses a thermoplastic resin composition containing a composition comprising a specific engineering plastic and a rubber-reinforced styrenic resin, and an oxazoline-modified copolymer as produced from vinyloxazoline, an aromatic vinyl monomer and other vinyl monomer.
Further, Japanese Patent Application Laid-open No. 172347/1991 (JP-A-3-172347) discloses a thermoplastic resin composition comprising a polyester, an aromatic vinyl polymer having a functional group and a polycarbonate, while the aromatic vinyl polymer has been obtained by copolymerizing a monomer having vinyloxazoline or glycidyl group, and styrene.
Japanese Patent Application Laid-open No. 255857/1990 (JP-A-2-255857) discloses an aromatic polycarbonate composition comprising an aromatic polycarbonate resin and a functional elastic polymer. This functional elastic polymer contains a reaction product derived from an ethylene elastomer having a reactive group and a polystyrene functionalized by an oxazoline.
The oxazoline-modified copolymer and the like described in these literatures are useful for alloying specific polymers. However, the use the oxazoline-modified copolymer, for example, can only be applied for alloying polymers being categorized to a narrow range, and it is difficult to alloying the polymers by using a small amount of the compound.
Japanese Patent Application Laid-open No. 184224/1994 (JP-A-6-184224) discloses a method of producing a compatibilizing agent which comprises allowing a polymer having, in a terminal or side chain of a hydrophobic main chain, a functional group containing an active hydrogen atom, such as carboxyl group (e.g. a modified olefinic polymer), to react with an oxazoline. The compatibilizing agent obtained by this method is serviceable for obtaining a polymer alloy by adding the same in a small amount to a polymer composition comprising plural polymers incompatible with each other. It is necessary, however, to allow the polymer having a functional group containing an active hydrogen atom to previously react with an oxazoline for obtaining the compatibilizing agent. Accordingly, there is possibility that choiceable or selectable range of the polymer and the oxazoline would narrow in the design of the compatibilizing agent, and a composition containing polymers incompatible with each other can hardly be compatibilized economically in a simple and easy manner.
It is also proposed that scrap polymers incompatible with each other (e.g. a polyester and a polyamide) which have been degraded in molecular weights due to time-series change or hydrolysis are reutilized as a compatible system by allowing the scrap resins to react with bis-2-oxazoline to convert a block copolymer. This reaction is based on the use of an ester amide bond of an oxazoline group of the bis-2-oxazoline and terminal carboxyl groups in 2 or more molecular chains to give a high molecular weight polymer ("Plastic Age", 114-118, March 1995). British Patent No. 1426409 proposes a process of modifying a polyester by adding a bisoxazoline to a polyester with a high molecular weight having a carboxyl group, in order to inhibit decomposition of the polyester and decrease of its molecular weight in a melting-extruding step for spinning. These literatures, however, fail to describe a process of utilizing a bis-2-oxazoline compound as a compatibilizing agent. Further, since the resin has a high molecular weight, it is difficult to alloy plural polymers incompatible with each other by adding a small amount of the reaction product.

Compatibilizing agent and method of producing the same


A multiport array comprises a read section which is separated from an array of memory cells and which forms a plurality of data-out ports each consisting of a predetermined number of output lines. The read section comprises a multiplex network containing a plurality of multiplex arrays each associated with one of the data-out ports (0,1, . . . ,15). The multiplex arrays are connected to the data read lines of the memory cells and are selected by read addresses. The multiplex arrays comprise transmission elements which connect selected ones of the data read lines to the associated data-out port.

Multiport arrays are important for computer systems which require concurrent access to a data storage at the same time. This in particular applies to parallel systems comprising a large number of processors. In such systems typically a large amount of instructions and data are processed in parallel including a multiple access to the same memory.
Various dynamic static multiport memory cells are known for the use in random access memory arrays in the VLSI system design. For example, EP 0 591 752 discloses a dynamic multiport memory cell comprising pairs of memory cells at the intersections of a pair of bit lines and a pair of word lines. This device uses a random access port and a serial access port. Data are transmitted from the random access port to serial access port via a data register.
U.S. Pat. No. 5,754,468 discloses a static random access memory cell which comprises three P-type transistors and three N-type transistors to form a two port memory cell which can be configured to perform as a one port or two port memory cell. Additional ports can be added to allow, for example, the use of the cell in a three port register array.
Implementations of multiport arrays require normally as many input/output terminals as the number of concurrent accesses occur at the same time. Major problems of the physical implementation of multiport arrays are the available chip area per memory cell and the power consumption. The more ports an array has the more chip area is needed for the implementation where the increase follows a square function. These problems usually require a custom design which is time consuming and inflexible for being extended or otherwise changed later one.
Real multiport arrays have the structure of a matrix of signal lines, one of which selecting a cell and another one for reading/writing the data, where each cross lays above an storage element. Increasing the number of ports from 1 to 2 would mean to design a matrix of 2 by 2 signal lines with the same single bit as storage element below this matrix and so on. This leads to a rapid increase of the cell area when the number of ports is increased.
Conventional implementation techniques of real multiport arrays use a matrix structure which results in an area increase function x2 (x=number of ports). The exact number depends on the ratio silicon to wire and is also dependant whether a SRAM cell or a register cell is used. Data out control and signal lines for data out ports are combined with the storage elements within the same area.
There are also possibilities to built logical n-port arrays by implementing n physical single port arrays which hold the same data. It needs n times the area of the single port array.
If the array operation cycle is long enough it is also possible to read the storage elements several times in sequence within one cycle. In this manner a logical n-port array can be implemented as a single port array which is read n times in order to provide the same information as a real n port array.
It is also known to use multiport structures in programmable logic arrays (PLA). U.S. Pat. No. 3,975,623 discloses a PLA which comprises a segmented OR part where the segments are arranged at opposite sides of an AND part of the array. The output lines of the AND part are splitted into two groups of ports each of which is connected to the segments of the OR array.

International Business Machines Corporation


Purified rapamycin and a chemical process for obtaining the purified rapamycin are described.

This invention relates to a chemical process for the purification of rapamycin.
Rapamycin is a macrocyclic triene antibiotic produced naturally by Streptomyces hygroscopicus. It has been found useful in an array of applications based on its antitumoral and immunosuppressive effects. Uses include preventing or treating systemic lupus erythematosis, pulmonary inflammation, insulin dependent diabetes mellitus, smooth muscle cell proliferation and intimal thickening following vascular surgery, adult T-cell leukemia/lymphoma, and ocular inflammation. Rapamycin and rapamycin derivatives continue to be studied for treatment of these and other conditions.
Isomers of rapamycin are known which have structures below, referred to herein as Isomer B and Isomer C:

Conventional production of rapamycin is by way of fermentation. The fermentation process yields a low grade rapamycin product containing impurities, which is often colored (including troublesome yellow color), as opposed to a pure white product. Current purification methods require isopropanol recrystallization and/or charcoal treatment methods. The product obtained by these methods has a purity of approximately 94% (based on the sum of the individual purities of isomers B and C), and a yellow index of about 2. Repeated recrystallizations are often necessary to increase rapamycin purity, reduce the yellow index and increase the low B:C isomeric ratio to meet a minimum of approximately 23:1, resulting in low yields upon crystallization. As a result, production costs remain high.
What is needed is a chemical purification process to increase yield of rapamycin having sufficient purity and yield to meet quality and regulatory standards for pre-clinical and commercial use.


The present invention relates to a fuse arrangement, which is particularly suited to high voltage applications, but also has applications across a broad voltage range. The fuse arrangement comprises a fuse link arranged to be connected in a current carrying circuit and a parallel-connected resistor. On occurrence of a fault, conditioning the current carrying circuit, the fuse link is arranged to generate relatively high voltage such that current is commutated to the resistor and electrical energy associated with the fault current is absorbed by the resistor. The resistor element is preferably a varistor and, for high voltage applications, a fuse link preferably comprises a deeply confined expulsion fuse. Because electrical energy flowing in the circuit is diverted to the resistance element on occurrence of a fault condition, the current carrying circuit is thus protected from damage.

I. Field of the Invention
The present invention relates to a and, particularly, but not exclusively, to a fuse arrangement having application in high voltage current carrying circuits, such as found in country-wide electrical distribution networks.
Fuses are provided in electrical distribution networks to prevent damage from fault currents such as may be caused by overload and short-circuit conditions. The function of a fuse is to prevent large amounts of electrical energy flowing in the circuit in short periods of time, thereby avoiding damage to circuit components and devices connected to the circuit. To perform this energy limiting task, some fuses operate to, firstly, limit the current flowing in the current carrying circuit following the occurrence of a fault current and, secondly, to break the current carrying circuit to prevent further current flow.
Fuse operation is a complex process and breaking of a circuit takes a finite amount of time during which current will still be flowing. Hence the need, particularly in circuits generating high currents, for fuses which also perform a current limiting operation. Fuse operation generally involves fusing of the fuse element, formation of a fuse arc (at this time current is still flowing in the circuit) and cut-off of the fuse arc (at this stage current is "broken").
II. Description of Related Art
Sand fuses, consisting of a long fuse element surrounded by sand in a tube, are fuses which operate to cut-off current flow very rapidly following the occurrence of a fault current. They are said to have high "breaking capacity" and can cope with very large values of fault current (12 KA or more). The sand operates to "quench" the fuse arc, usually before the current wave-form has reached its peak (in an a.c. system). Sand fuses are said in the art to have a "current limiting" operation, because they operate to cut the current off very rapidly, together with a current breaking operation. They protect the circuit from damaging quantities of electrical energy by virtue of the rapid cut-off of current.
In another arrangement the fuse is mounted within metal or insulation enclosed switch gear, indoors or in pad mounted substations. In these applications a separate load break switch is provided to permit complete disconnection of all fuses in the event that one operates on fault current. The fuse usually incorporates a mechanical triggering device designed to operate the load break switch.
A problem with sand fuses is that their operation on occurrence of fault currents of relatively low value is limited. At a relatively low value current, the fuse element "burns back" and the arc is not quenched at all, resulting in a large amount of energy being dissipated in the sand fuse (possibly causing explosion).
In some current carrying circuits, such as in electrical distribution networks, for example, fault currents may occur which vary widely in their value. An ideal fuse in such circuits must be able to deal with fault currents of very large value (12 KA or more) as well as fault currents of relatively low value. Such fuses must have a wide "operating range".
It is possible to design sand fuses with a wide range, but this necessitates complicated and expensive process engineering of the fuse element and the provision of a back-up fuse to deal with the "minimum breaking-capacity" current (lowest value fault current at which the fuse must break the current carrying circuit). Such complex fuses are one-shot only and their replacement is expensive. That is, there is a relatively high cost of "fault clearing" for these fuses.
An expulsion fuse is a simple type of fuse merely comprising a fuse element which may extend in a tube, with no sand. The expulsion fuse element is generally relatively short compared with the elements used in sand fuses. Traditional expulsion fuses operate in a different way to sand fuses. They have no "current limiting" function, merely operating to break the current in the current carrying circuit. The fuse arc in an expulsion fuse is not quenched until current flow approaches naturally to zero. This means that up to half an a.c. wave form of current may flow before the circuit is broken. Such a long time of operation increases the energy dissipated in the fuse. To restrict this, moderate breaking currents only are permitted. That is why expulsion fuses only have medium rated breaking capacities. They are not useful with very large currents, such as some fault currents which can be expected in electrical distribution networks because the amount of electrical energy which may flow in the current carrying circuit may be sufficient to cause the fuse carrier (the housing mounting the fuse element) to explode, causing damage to the current carrying circuit in the immediate vicinity of the fuse. Even the medium rated expulsion fuses will operate with a very loud noise as the energy of the fuse arc is dissipated within them. Expulsion fuses, however, can operate at relatively low current levels. They are therefore suitable for low to medium range applications. In addition, they are relatively cheap and the cost of fault clearing with these types of fuses is low.
One known expulsion fuse is mounted in a carrier arranged to "drop out" mechanically from the circuit once the fuse element has broken. These are known as "drop out" fuses.

Dropout fuse having electrical energy absorbing device


A method is for calculating a height of a chuck top. A height of the top surface of the chuck top which corresponds to an arbitrary position specified on the XY coordinate plane by a computer is calculated in each of the four quadrants based on a coordinate transformation formulas. The method includes setting, by using the computer, a conical model in which two adjacent points other than the center point of the chuck top which correspond to the specified coordinates in a predetermined quadrant of the XY coordinate plane are obtained on a circumference having the center point of the chuck top as the origin and specifying an arbitrary point in the predetermined quadrant by using the computer and calculating a height of the arbitrary point of the chuck top based on the conical model, the coordinate transformation formulas and the specified coordinates.

When electrical characteristics of a target object, e.g., a semiconductor wafer, are inspected, there is used a probe device for directly inspecting the semiconductor wafer. Such a probe device includes: a vertically movable wafer chuck provided in an inspection chamber, on which the semiconductor wafer is mounted; an XY stage for moving the wafer chuck in X and Y directions; a probe card disposed above the XY stage; and an alignment mechanism for aligning the semiconductor wafer on a the wafer chuck with a plurality of probes of the probe card. The probe device performs the electrical characteristic inspection while electrically contacting chips of the semiconductor wafer and the probes by overdriving the aligned semiconductor wafer. The alignment mechanism has, e.g., a lower camera attached to the wafer chuck and an upper camera, attached to an alignment bridge, capable of moving to a portion just below the probe card.
When electrodes in the chips and the probes are brought into electrical contact with each other, a chuck top is controlled so that a uniform overdrive can be applied to all the chips. However, it is difficult to apply a uniform overdrive due to manufacturing errors of the wafer chuck or the like. Therefore, a height of the chuck top is calculated by measuring heights of five points including a center point of a semiconductor wafer surface on the chuck top and right, left, upper and lower points thereof and calculating an average value for contact positions (contact coordinates) in four quadrants obtained by dividing the semiconductor wafer surface while setting a height of the center point as the origin. Since the semiconductor wafer is vacuum-attracted on the chuck top, the semiconductor wafer surface on the chuck top can be treated as a plane along a top surface of the chuck top.
Therefore, it is crucial to measure the height of the chuck top with high precision. For example, FIGS. 4A and 4B show a principal of a conventional method for calculating a height of a chuck top in a first quadrant on a top surface of the chuck. Heights of the chuck top in a second to a fourth quadrant can also be obtained in the same sequence applied in the first quadrant.
In the conventional method, XY coordinates of three points for defining XY coordinates in the first quadrant of the chuck top are specified on an XY coordinate plane of a computer (hereinafter, referred to as "ideal coordinate plane"). Based on these specified coordinates, three points on the chuck top 1 are required as shown in FIGS. 4A and 4B. As for the top surface of the first quadrant of the chuck top 1, there is set a planar model, e.g., a plane OAB formed by a center point O of the chuck top 1 and straight lines OA and OB perpendicular to each other at the center point O as shown in FIG. 4A. Further, the origin O on the ideal coordinate plane specified by the computer coincides with the center point O of the chuck top 1, and a plane including the center point O, point a in X axis and point b in Y axis on the ideal coordinate plane is defined as a plane Oab. Points A and B on the chuck top 1, which are coordinates of an actual chuck top 1 including heights thereof, are obtained in correspondence to the points a and b specified on the ideal coordinate plane. FIG. 4B depicts a relationship between the plane OAB formed of those three points on the chuck top 1 and the plane Oab on the ideal coordinate plane.
As can be seen from FIG. 4B, when the point a (xo, O) in the X axis and the point b (O, yo) in the Y axis on the ideal coordinate plane are specified by the computer, the specified positions of the chuck top 1, which correspond to the points a and b, are led directly under the position where the height of chuck top 1 is detected. Heights of the chuck top 1 in those positions are measured, and coordinates of the points A and B corresponding to the points a and b can be obtained based on the moving distance of the chuck top 1 at this time.
Following coordinate transformation formulas are used for calculating arbitrary coordinates specified on the ideal coordinate plane and heights of the chuck top 1 which correspond thereto. In the coordinate transformation formulas, contact coordinates X and Y are obtained as a function of specified coordinates x and y, and a coordinate Z is obtained as a function of the coordinates X and Y. Moreover, in the following coordinate transformation formulas, one point on the plane Oab of the ideal coordinate plane is defined as a point p (x, y), and one point on the plane OAB of the chuck top 1 which correspond to the point p is defined as a point P (X, Y, Z).X=ax+by Y=cx+dy Z=eX+fY
Each of the coefficients in the coordinate transformation formulas is calculated by substituting the specified coordinates on the ideal coordinate plane and the measurement values of the chuck top 1 which correspond thereto. After the calculation of the coefficients, arbitrary contact coordinates x and y are specified by the computer and the coordinates are substituted to the coordinate transformation formulas in the computer. As a result, the contact coordinates X and Y of the chuck top 1 which correspond to the specified contact coordinates are obtained, and the contact coordinate Z, i.e., the height Z of the chuck top 1, is calculated based on the coordinates X and Y.a=XA/xO b=XB/yO c=YA/xO d=YB/yO e=(YB*ZA−YA*ZB)/(XA*YB−XB*YA)f=−−(XB*ZA−XA*ZB)/(XA*YB−XB*YA)
Japanese Patent Publication No. H07-105414 discloses therein a technique for making an electrical contact between a semiconductor wafer and a probe under a uniform pressure. Further, Japanese Patent No. 2986141 discloses therein a technique capable of performing alignment between chips and probes with high precision.
However, in the conventional method for calculating a height of a chuck top, it is assumed that the top surface of the chuck top 1 is a plane on the computer. With this assumption, a height of the chuck top 1 is obtained, on average, based on the specified coordinates x and y. Therefore, as the contact positions of the probes keep away from the measured points, the difference between the actual height of the chuck top 1 and the contact coordinate Z calculated based on the measured points increases. Accordingly, a variation in the contact positions increases, and especially a variation in a direction of 45° with respect to the straight lines OA and OB increases to the most. As a result, even if the chuck top 1 is overdriven in that portion, the reliability of the inspection is not ensured.

Method for calculating height of chuck top and program storage medium for storing same method


A low-pressure mercury discharge lamp is provided with a discharge vessel (1) which encloses a discharge space (2) in a gastight manner and in which a filling including mercury is accommodated. The lamp is provided with means (3a, 3b) for maintaining an electric discharge in the discharge space. The discharge vessel is provided with a luminescent layer (5). The lamp generates light during operation with a spectrum which is substantially composed of radiation in a first wavelength region from 590 to 630 nm, a second wavelength region from 520 to 565 nm, and in a third wavelength region from 430 to 490 nm. The radiation in the wavelength interval from 590 to 600 nm accounts for at least 50% of the power of the radiation in the entire first wavelength region. A preferred embodiment of the lamp includes a luminescent material that complies with the formula M1.sub.x M2.sub.(1-x-y) BO.sub.3 :Eu.sup.3+.sub.y, in which M1 is an element from the group formed by Sc, In, and Lu, and in which M2 is an element from the group formed by Sc, Y, La, Gd, Ga, In, and Lu, where M1 is different from M2, with 0.01.ltoreq.y.ltoreq.0.2, x>0, x+y<1, while the luminescent material has a calcite lattice structure.

The invention relates to a low-pressure mercury discharge lamp provided with a discharge vessel which encloses a discharge space in a gastight manner and in which a filling comprising mercury is accommodated, and with means for maintaining an electric discharge in the discharge space. The discharge vessel is provided with a luminescent layer, generating light during operation with a spectrum which is substantially composed of radiation in a first wavelength region from 590 to 630 nm, in a second wavelength region from 520 to 565 nm, and in a third wavelength region from 430 to 490 nm.
Low-pressure mercury discharge lamps are widely used for general lighting purposes. The radiation generated in the discharge space is mainly ultraviolet radiation which is converted into visible radiation by the luminescent layer. The discharge may be maintained by electrodes between which a potential difference obtains and which may be arranged inside or outside the discharge space. Alternatively, the discharge may be maintained by means of a coil which generates a high-frequency magnetic field in the discharge space during operation, or the means for maintaining the discharge may be formed by a microwave generator.
Standard lamps are mostly used in surroundings where color rendering plays only a limited part, such as industrial lighting and street lighting, in which case the luminescent layer is composed of halophosphates such as calcium halophosphate activated by Sb and Mn. This is because of the low cost price of halophosphates. Such lamps have a mediocre color rendering (Ra=50 to 60) and a reasonable luminous efficacy (.eta.=80 lm/W). Ra represents the general color rendering index as defined in CIE Publication No. 13, 1965, of the Commission Internationale de l'Eclairage.
Low-pressure mercury discharge lamps having a high luminous efficacy are disclosed in U.S. Pat. No. 4,075,532. The luminescent layer here has an emission spectrum with a narrow blue and a wide yellow emission band. A disadvantage of these lamps is that the color rendering is substantially worse than that of the standard lamps mentioned earlier.
W.A. Thornton, Three Color Visual Response, J. Opt. Soc. Am. Vol. 62, No. 3, 457-459, states that the spectral colors adjacent 450, 540, and 610 nm contribute most to the color perception and that on the contrary wavelengths adjacent 500 and 580 nm are unfavorable.
A lamp of the kind mentioned in the opening paragraph is known from U.S. Pat. No. 3,937,998. Luminescent materials activated by rare earth metals are used in the luminescent layer of this lamp on account of the generally comparatively narrow emission spectra of these materials. Emission in the wavelength region from 520 to 565 nm is generated here by means of aluminates activated by terbium. Furthermore, bariummagnesium aluminate activated by bivalent europium and various other luminescent materials suitable for emission in the wavelength region from 430 to 490 nm are mentioned therein. Yttrium oxide activated by trivalent europium, whose emission spectrum has a maximum at 611 nm and a half-value width of 2 nm, serves as a luminescent material here for emission in a wavelength region from 590 to 630 nm. Such light sources have a good color rendering (Ra.apprxeq.80) and a high luminous efficacy (.eta..apprxeq.90 lm/W).
It is noted that a luminescent material for the 430 to 490 nm wavelength region is not always necessary in lamps of this kind. The visible radiation emitted by the mercury discharge in that wavelength region forms a sufficient contribution especially in lamps whose emitted radiation has a low color temperature.
As described in U.S. Pat. No. 4,335,330 (Peters et al.), many of such luminescent materials activated by rare earth metals are suitable for lamps with high wall loads (>500 W/m.sup.2), provided certain conditions are complied with.
A disadvantage, however, is the comparatively high cost price of luminescent materials activated by rare earth metals as compared with the standard lamps mentioned further above, which renders the known lamp unattractive in those applications where a mediocre color rendering can suffice.

Low-pressure mercury discharge lamp with luminescent layer


A sleeve slidable along an axial direction of the impeller shaft produces a variable width of the channels leading into and out of the bypass. The sleeve can be a single unit, a telescopic slide, or a slide of two relatively movable parts.

This application claims the priority of German patent document 196 47 605.4, the disclosure of which is expressly incorporated by reference herein.
The invention relates to an exhaust turbocharger for internal combustion engines.
Exhaust turbochargers of the generic type are known. As a centrifugal-compressor map stabilizing measure, along the contour of the compressor impeller, approximately in the first quarter of the length of the impeller, parallel to the intake duct, a bypass is provided within the compressor housing in the form of an annular gap. The bypass is composed of a radial inlet groove located upstream from the compressor impeller, a radial contour groove located downstream from the inlet edge of the compressor impeller, and an annular chamber connecting these two grooves. The annular gap located parallel to the intake channel (and hence parallel to the inlet to the impeller itself) produces bypass mass flows which, in the area of the surge line, (that is, in the area of minimal volume flow delivery) and in the area of the plug limit (the area of maximum volume flow delivery), permit a shift toward smaller and/or larger volume flows by comparison with machines of the same design without a bypass.
The advantageous and desirable centrifugal-compressor map expansion thus achieved is attained at the expense of disadvantages in efficiency that are reflected in a disturbing higher noise level. For this reason, the object of the invention is to avoid these disadvantages while retaining the desired centrifugal-compressor map expansion.
According to the invention, this is accomplished by providing an exhaust turbocharger with a bypass which stabilizes the centrifugal compressor map. The bypass has a variable effective cross section, which is preferably set to an optimum width only in those areas of the centrifugal-compressor map field of the compressor that are near the surge line and/or the plug limit of the compressor. In other words, the bypass has an optimized cross section, but can be closed in between.
For this purpose, it may be advantageous within the scope of the invention to provide the inlet groove and/or the contour groove with variable widths, preferably to make them closable.
As a sealing element, an annular slide can be provided, which can be made in several parts, so that both grooves can be covered by telescopic adjustment.
Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.

Exhaust turbocharger for internal combustion engines


A woven material is described in which optical fibers are positioned and held in the material in a manner to maximize their optical efficiency. The material consists of fibers extending in both the warp and woof direction, the optical fibers are positioned in channels between the supporting fibers in the warp direction. The material is manufactured using conventional weaving equipment by positioning both the optical fibers and the warp fibers, and then weaving the woof fibers into place without bending the optical fibers. The fibers are thusly woven so that the optical fibers have zero warp. The woven grid-like mat can be coated with a protective material that either enables it to form a flexible sheet of ribbon or a rigid, hard, grid-like mat which has aligned zero warp optical fibers embedded therein. The material shown can be used to provide sensing, imaging or communications. It can be utilized for optical backplanes for optoelectronic systems or a housing for optoelectronic components.

This invention relates to optical systems and optical fibers, and particularly to optical fibers woven into other material to provide sensors or "smart" skins for aircraft and other applications.
Fiber optic sensor technology has become increasingly desirable for monitoring for numerous applications such as aircraft and spacecraft. The size, weight, communications density, immunity to interference, and ruggedness, are pushing fiber optic technology into more and more applications.
A recent concept in the manufacture of aircraft and spacecraft has been the employment of fiber optics within the skin of the craft itself, thereby creating a "smart" skin which enables sensors embedded into the composite material to convey information about the aircraft or spacecraft throughout the craft without need for separate communications links and their associated disadvantages.
The mechanical properties of cloth woven from glass fibers are reasonably well known. Such material provides desirable mechanical properties including high tensile strength, flexibility, resistance to weather as well as chemicals, high tear strength, dimensional stability, and abrasion resistance.
It is also known that individual optical fibers can be used to transmit optical signals throughout the length of the fiber and have very high bandwidths. Individual optical fibers have excellent optical properties, but are very fragile. A variety of techniques have been developed to hold individual fibers in a manner to prevent damage to them. For example, they are frequently encased in cables or other protective material. In addition, individual fibers can be grouped together to provide cables capable of carrying increased amounts of information.
One technique widely used for protection of optical fibers is to encapsulate them in an epoxy material to provide rigidity and strength. For example, U.S. Pat. No. 4,547,040 describes an optical fiber assembly where optical fibers are held in an embedding material.
Individual optical fibers have also been woven into sheets. For example, U.S. Pat. No. 4,907,132 describes a device where optical fibers are woven into a panel. The fibers are positioned in the warp direction of the weave. Where the fibers cross the woof fibers, the coating is removed so that the fibers emit light. In this manner, a panel made from the fibers emits light. U.S. Pat. No. 4,885,663 shows woven optical fibers where the bends in the fibers where they cross the woof provide discontinuities for the emission of light. The purpose of this structure is provide a light-emitting panel.
Other prior art such as U.S. Pat. Nos. 4,952,020 and 4,468,089 show optical fibers which are encapsulated in various ways to form cable assemblies such as described above. Unfortunately, cable assemblies such as described in these patents are relatively expensive and cannot be used to form sheet-like structures.
Many papers have been written on the application of optical fibers to the formation of "smart" skins for aircraft or spacecraft. In "Fiber Optic Skin and Structural Sensors," by Eric Udd, Industrial Metrology 1 (1990) 3-18, the use of optical fibers in a skin-like material for use as sensors is described. The paper, however, describes the fibers as being merely embedded in a structural material. Embedding the fibers in that manner suffers from the disadvantages discussed in the paper discussed below.
In a paper entitled, "Smart Skins and Fiber-optic Sensors Application and Issues," Kausar Talat, Boeing Defense & Space Group, Seattle, Wash. (unpublished), describes material with embedded optical fibers where the physical properties of the fiber itself were used as a sensor. The composite described in this article includes optical fibers disposed inside a laminated structure. At the end of the structure, the optical fibers pass through a tube inserted to prevent micro-bending of the fiber where it exists from between the laminated sheets. As described in the article, the laminated structure causes the fibers to kink during curing, creating losses as well as having other disadvantages discussed in the paper.

Smart skin array woven fiber optic ribbon and arrays and packaging thereof

Page Automated Telecommunications Systems, Inc.


A focusable camera module for an endoscope, including a housing including a lens assembly in a distal end of the housing, a carrier disposed within the housing, the carrier having a distal end with an aperture, an image sensor attached inside the carrier adjacent to the aperture, a flexible circuit attached to an edge of the image sensor, and a motor slideably displacing the carrier between a retracted position and an extended position, the aperture adjacent to the lens assembly in the extended position, and an endoscope including the focusable camera module.

Video endoscope imager assemblies are generally fixed focus systems in which the distance between the objective lens and the image sensor is fixed. The depth of field achieved is therefore strictly determined by the capability of the objective lens. As such, most endoscopes cannot achieve a focused image at both far and very short distal distances. A typical endoscope will not focus closer than 3 to 5 mm from the distal face.
Further, imager assemblies for endoscopes have lateral size restrictions which places restrictions on focusing mechanisms. While most applications try to reduce the axial height of the imager, endoscopes require imager assemblies that can typically fit into a 5 mm diameter (or smaller) hole.
Some attempts have been made to achieve a focusable camera system using a fixed image sensor with a camera lens that can move axially to adjust the distance between the lens and the image sensor. However, for an endoscope, this is not practical for many reasons. The outside of an endoscope has to be sealed, and the window of the objective lens has to be stationary to achieve this. Also, a typical opto-mechanical system to move a lens assembly is very wide making the camera module much too big to fit into an endoscope.
U.S. Pat. No. 8,305,486 to Mo et al. discloses an auto-focus camera for optical system with a movable sensor for intra-oral use. However, the imager is mounted separate from and distal to the motor, without sufficient supporting structure, and is therefore not adequately secured from unwanted movement or tilting. Mo et al. also does not disclose how to adapt the device being for use in the distal tip of an endoscope, nor does the design appear to be readily scalable to accommodate such applications. Further, Mo et al. concerns auto-focusing only and does not provide a means for manual adjustment by the user.


Provided are an image forming apparatus and an image forming method in which a decline in the recognition rate of voice recognition ascribable to operating sound during printing can be prevented by starting voice recognition after the printing operation has been suspended. The image forming apparatus is provided with a voice recognition unit (103) for recognizing entered voice, and a image printing unit (107) for printing prescribed print information. Whether the image printing unit (107) is currently printing is discriminated by an image-printing-state holding unit (106). Further, a request to start operation of a voice recognition unit (103) is accepted. If the request to start operation of the voice recognition unit (103) is accepted during printing of print information by the image printing unit (107), then printing of the print information by the image printing unit (107) is suspended. The state of a voice-recognition-state holding unit (102) is then changed and the voice recognition unit (103) starts performing recognition of input voice.

Some conventional image forming apparatus such as facsimile machines, copiers and printers come equipped with a voice recognition function to make the apparatus more user friendly. For example, a technique that utilizes voice recognition in a case where mail is created by a facsimile machine has been disclosed (see the specification of Japanese Patent Application Laid-Open No. 11-136490, by way of example). Further, a technique that utilizes voice recognition to specify a telephone number or facsimile-transmission destination number has been disclosed (see the specification of Japanese Patent Application Laid-Open No. 2000-115327, by way of example).
With these conventional examples of an image forming apparatus, however, a problem which arises is that the voice recognition rate declines during output because of excessive operating noise.


A method and device for performing the process of discovering neighbors for Wi-Fi P2P communication. The method includes: checking at a first WFD P2P device whether there is WFD P2P group in which participation is possible; performing, at the first WFD P2P device, the operation for participating in the WFD P2P group in which participation is possible, if there is a WFD P2P group in which participation is possible, or performing, at the first WFD P2P device, the operation for creating a new WFD P2P group or entering a sleep mode, if there is no WFD P2P group in which participation is possible.

Wireless communication systems have been widely used to provide various kinds of communication services such as voice or data services. Generally, a wireless communication system is a multiple access system that can communicate with multiple users by sharing available system resources (bandwidth, transmission (Tx) power, and the like). A variety of multiple access systems can be used. For example, a Code Division Multiple Access (CDMA) system, a Frequency Division Multiple Access (FDMA) system, a Time Division Multiple Access (TDMA) system, an Orthogonal Frequency Division Multiple Access (OFDMA) system, a Single Carrier Frequency-Division Multiple Access (SC-FDMA) system, and the like.
Standards for Wireless Local Area Network (WLAN) technology have been developed as Institute of Electrical and Electronics Engineers (IEEE) 802.11 specifications. IEEE 802.11b may provide a maximum transfer rate of 11 Mbps, and IEEE 802.11a may provide a maximum transfer rate of 54 Mbps. IEEE 802.11g may use Orthogonal Frequency Division Multiplexing (OFDM) at 2.4 GHz, and provide a transfer rate of 54 Mbps. IEEE 802.11n may use Multiple Input Multiple Output (MIMO)-OFDM, and provide a transfer rate of 300 Mbps to four spatial streams. IEEE 802.11a and 802.11b use an unlicensed band at 2.4 GHz or 5 GHz. IEEE 802.11b provides a transmission rate of 11 Mbps and IEEE 802.11a provides a transmission rate of 54 Mbps. IEEE 802.11g applies Orthogonal Frequency-Division Multiplexing (OFDM) at 2.4 GHz to provide a transmission rate of 54 Mbps. IEEE 802.11n may use Multiple Input Multiple Output (MIMO)-OFDM, and provide a transfer rate of 300 Mbps. IEEE 802.11n may support a channel bandwidth up to 40 MHz to provide a transfer rate of 600 Mbps. IEEE 802.11p is a standard for supporting Wireless Access in Vehicular Environment (WAVE). For example, IEEE 802.11p provides improvement matters needed for supporting Intelligent Transportation Systems (ITS). IEEE 802.11ai is a standard for supporting fast initial link setup of an IEEE 802.11 station (STA).

Method and device for discovering neighbors for wireless fidelity direct (WFD) peer to peer (P2P) communication


A method for driving a plasma display device including first electrodes and second electrodes. In one embodiment, the plurality of first electrodes are divided into a plurality of groups including first and second groups. During a first period of a sustain period, a second voltage is applied to the first and second groups of the first electrodes while a first voltage is applied to the second electrodes, the second voltage being higher than the first voltage. During a second period of the sustain period, while the second voltage is applied to the second electrodes, the first voltage is applied to the first group of the first electrodes, and the first voltage is applied to the second group of the first electrodes a period of time after when the first voltage is initially applied to the first group of the first electrodes.

1. Field of the Invention
The present invention relates to a plasma display device and a driving method thereof.
2. Description of the Related Art
A plasma display device is a display device employing a plasma display panel (PDP) that is configured to display characters and/or images using plasma generated by gas discharge. The PDP includes hundreds of thousands to millions of discharge cells arranged in a matrix format depending on its size.
The plasma display device is driven during frames, each of which is divided into a plurality of subfields having brightness weight values, and each subfield includes a reset period, an address period, and a sustain period.
The reset period is a period for initializing a state of each cell so as to smoothly perform an address operation in the cells, and the address period is a period wherein cells are selected to emit light among a plurality of cells through address discharges. In addition, the sustain period is for causing discharges for displaying an image at addressed (or selected) cells.
During the sustain period of the plasma display device, sustain discharges are generated in selected cells by applying sustain pulses alternately having a high level voltage and a low level voltage to scan electrodes and sustain electrodes. Here, phases of the sustain pulses applied to the scan and sustain electrodes are opposite to each other. In addition, a width of a first sustain pulse applied to the scan and sustain electrodes is increased to be longer than widths of subsequent sustain pulses to stably generate the sustain discharge at the cells selected to be turned on.
However, when the width of the first sustain pulse applied during the sustain period is increased as described above, a considerable amount of wall charges are formed between the scan and sustain electrodes. As such, when a second sustain pulse (i.e., a pulse for applying the low level voltage to the scan electrodes and the high level voltage to the sustain electrodes) is applied subsequent to the first sustain pulse, a strong discharge is generated between the scan and sustain electrodes, and a current that is stronger than the currents generated when the subsequent sustain pulses are applied, is generated. Since the stronger current may flow to one or more elements of a driving circuit for generating a sustain pulse waveform, the elements may be deteriorated.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the present invention, and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.

Plasma display device and driving method thereof


An improvement information generating unit (11) generates a plurality of types of improvement information for improving the image quality of an image (broadcast image) broadcast as a program. An integrating unit (12) embeds one or more of the plurality of types of improvement information generated by the improvement information generating unit (11) into the broadcast image, thus integrating the improvement information with the broadcast image, and outputs an integrated signal. The integrated signal is transmitted via a transmitting unit (13). Thus, images of various image qualities are provided.

Recently, provision of chargeable program broadcasting services such as cable television broadcast and digital satellite broadcast has become popular in Japan, too.
In the chargeable program broadcasting services, in general, accounting is carried out in accordance with available programs or in accordance with actually viewed programs. If the quality of images as programs can be changed in accordance with the viewing fee paid by users, better services can be provided.

Data processing device and method, and recording medium and program


In one embodiment according to the teachings of the present disclosure, an antenna generally includes a first, second, and third elements. The first and second elements form a first electro-magnetic radiator that is operable to transmit or receive a first signal having a first sense of polarization. The first and third elements form a second electro-magnetic radiator that is operable to transmit or receive a second signal having a second sense of polarization that is different than the first sense of polarization.

Wireless communication, ranging, detection, and direction finding may be provided by transmission and reception of electro-magnetic signals at various frequencies throughout the radio-frequency (RF) spectrum. Electro-magnetic radiation may have characteristics that may enable selectivity of electro-magnetic signals based upon their polarization. To control the sense of polarization, dual polarized antennas have been developed. These dual polarized antennas generally include two electro-magnetic radiators that are oriented orthogonally relative to one another such that the antenna may transmit or receive microwave frequencies at virtually any polarization sense.


A high pressure fuel hose for disposition between a fluid connector on a fuel pump canister in a fuel reservoir and a fluid connector through the reservoir wall. The fuel hose, located intermediate the fuel delivery system and a check valve at the fuel pump, has a flexible tubular body characterized by a plurality of annular sinusoidal convolutions well suited for accepting volumetric and pressure increases in the fuel trapped between the check valve and the fuel delivery system caused by temperature loading of the fuel following engine shut-down. A region of reduced wall thickness is formed in the tubular body to act as a pressure fuse having a predetermined burst pressure allowing system leakage due to overpressurization to be location controlled.

Manufacturing economies are realized by grouping several related components into a modular assembly which may be handled, installed and serviced as a unit. In automotive fuel systems for example, modular fuel delivery systems have been proposed for direct installation in a fuel tank. Such systems are typically installed through an opening in the top of the fuel tank and may include an electric fuel pump, a cover for the tank opening, elements for supporting the pump relative to the cover and means for electrically and fluidly connecting the pump to the electrical and fuel delivery systems of the internal combustion engine. A flexible, high pressure hose constructed of rubber or flexible plastic may be provided as a conduit between the pump outlet and the cover, with a check valve disposed downstream of the pump and operable to maintain fuel system pressure following engine and fuel system shut-down. A high pressure hose according to the present invention includes structural features which manage positive fuel pressure variation of fuel between the check valve and the fuel injectors of the fuel delivery system.


An illumination apparatus, usable for example as a slit lamp, comprises a light-emitter (2) and an optical element (12) having a free-form surface (13), and optionally a slit aperture (9) and an imaging optic (10). The concept of the present invention is that the free-form surface (13) is employed to generate a resultant illumination beam having a slit-shaped cross-section.

A "slit lamp" is understood to be a device that is used to observe the front portion of the eye (lens and proximal vitreous body), and to monitor contact lens fittings. The slit image facilitates diagnostic and surgical procedures. During operations, it is used as a contrast-enhancing illumination in the region of the retina.
Slit lamps of this kind are very well known, and are manufactured by several suppliers and used routinely by doctors.
The existing art includes slit lamps in which a slit aperture is illuminated, directly or via a light guide, by means of a light-emitting means. DE-C2-42 27 942, for example, describes an arrangement of a slit lamp with a light guide:
"Slit lamp illumination device for imaging a slit aperture into a target plane, comprising
                a light source, preferably of high intensity, after which is arranged a fiber-optic light guide;        a slit aperture arranged, without interposed optical elements, at a short distance after the light guide entry surface; and        a slit aperture arranged, without interposed optical elements, at a short distance after the light guide exit surface; and        an imaging device arranged after the slit aperture and having at least two optical systems each having a converging optical effect . . . "
In the aforesaid embodiment, a slit aperture is arranged directly after the light guide exit surface. The light guide exit surface, however, has a round cross section. A portion of the light emerging from the light guide illuminates the slit in the plane of the slit aperture. This slit is imaged by an imaging optic onto the patient's eye. A substantially larger portion of the light, however, is absorbed on the mechanical slit aperture and converted into heat, and thus does not contribute to the intensive illumination of the slit image onto the patient's eye.
This conventional embodiment thus creates the problem that because of the transition from the circular surface (exit surface of the light guide) to the rectangular surface (entrance surface of the slit aperture), considerable portions of the usable light from the light guide or from any other light-emitting means are lost.
This problem is not unknown, but the attempts to solve it, in order to eliminate the drawbacks arising therefrom, are insufficient. For example, a cylindrical lens is incorporated between the exit surface of the light-emitting means and the slit aperture. As a result, the illumination of the slit is no longer round, but instead is approximately oval or corresponds as much as possible to the slit shape. On the one hand, however, this action does not appreciably prevent the light loss, and on the other hand a cylindrical lens makes the light distribution in the slit inhomogeneous.
The inventor herein has recognized the problems of the approaches indicated above that attempt to increase the usable portion of the light. He has attempted, by way of the concept of the present invention, to achieve the most efficient possible light utilization in the slit image, while at the same time preventing absorption of the usable light on the slit aperture.

Illumination apparatus, in particular slit lamp


Various implementations include speaker systems. In some particular cases, a speaker system includes: at least two distinct loudspeakers each capable of outputting stereo audio on its own, wherein each loudspeaker comprises: a plurality of transducers, and a controller coupled with the plurality of transducers, where the controller in each loudspeaker is configured to: receive a left channel audio input signal and a right channel audio input signal; extract a center channel signal from the left channel audio input signal and the right channel audio input signal; and provide an audio output signal to at least one of the plurality of transducers for outputting the center channel signal.

Stereo paired speakers are distinct speaker units that are paired into a singular playback system for stereo signals containing both left and right channels. In a conventional stereo pair, one of the speaker units is designated as left (playing left-channel content) and the other is designated as right (playing right-channel content). However, for speaker units with multiple transducers, the orientation of those transducers in stereo pairs can create opposing firing patterns that diminish performance.

Stereo paired speaker system with center extraction


The present invention relates to a sterile feeding bottle which is manufactured in disposable plastic and/or rubber materials, resistant to heat, including that produced by microwaves, and which has the special feature of incorporating a solute and a solvent which are separate from each other but which can be mixed by simple and novel means which are incorporated in the feeding bottle, for the preparation of a compound, and without coming into contact with any of the components, or any of the elements of the feeding bottle itself, including the teat.

Feeding bottles that are currently being commercialized and used for administering feed for babies, are not only not disposable, but they also have to be sterilized and subsequently handled during the different stages of preparation before being administered. This is true both in their use in the home and in teaching or health centres, which is obviously detrimental to the health of children as there is a reduced guarantee of sterility with excess handling in each case.
Although disposable feeding bottles are known, their commercialization is for the administration of saline solutions, medicines and other pharmacological substances.
In short, the conventional feeding bottles used for administering formula to unweaned or new-born babies are designed for administering feed which requires a considerable amount of preparation time, as well as numerous and complicated steps for their preparation (washing, sterilizing, measuring, mixing, etc.). And, therefore, in rushed situations, emergencies or where there is uncertainty of having the adequate means, if there is no kitchen available, etc., for example when staying in a hotel, a tent or away from home in general, preparing a feeding bottle can be a real problem.
The inconvenience of each and every one of the above steps mentioned for preparing a feeding bottle and the handling thereof, is worth mentioning here. In both homes and teaching centres, including hospitals, there is a continuous risk to guaranteed hygiene and sterility, which is so important for infants of under one year, and especially for new-born and unweaned babies.


A method and apparatus for determining the position, relative to the grab (1, 2) transporting them, of the end heads used in packing paper, cellulose, and board rolls, when the end head is attached to the grab (1, 2). When measuring, a detector (7) is transported along such a circular curve, which is assumed to be intersected by the circular curve defined by the edge of the end head. the angle position of the detector (7) on the circular curve of its path is measured and the intersection points (x1, z1; x2, z2) of the curve travelled by the detector (7) and the edge of the head are detected. The position of the centre point (x0, z0) of the end head is calculated on the basis of (a) the radius of the circle travelled by the detector and the position of the centre point (xm, zm) of the circle, (b) the position (xt, zt) of the grab's tool point, (c) the assumed radius of the end head, and (d) the positions (x1, z1; x2, z2), of the detected intersection points. Finally, the position of the centre point (x0, z0) of the end head is calculated in the set of coordinates of the grab.

The present invention relates to a method for determining the location, relative to the grab transporting it, of the end heads of rolls used for packing rolls of paper, cellulose, and board.
The invention also relates to an apparatus intended to apply the method.
The wide roll of paper coming from a paper machine is first of all transported to a slitter-winder and cut into rolls of suitable width. Next, the rolls are packed for transport. When paper rolls are packed, inner end heads are first of all placed on their ends, after which the necessary amount of wrapping is wrapped around the roll, the ends of which are folded on top of the inner end heads at the ends of the roll. An outer end head is glued on top of the folded wrapping and the internal end head, usually by hot-sealing. The inner end head is normally quite thick and protects the end of the roll from mechanical damage. The outer end head is, in turn, thinner and its task is to secure the package on the end of the roll and protect the roll from moisture. Often the color and patterning of the outer end head are used to give the roll a neat appearance. The length and diameter of the roll being packed are measured prior to packing and suitably sized end heads are selected for the ends of the roll of the basis of the measurement results.
End heads can be placed on the ends of rolls in many different ways. Placing the heads by hand is the oldest method, which is still very suitable for packing lines with a reasonably small capacity, or in applications in which there is no need to increase the level of automation. In this case, the packer simply places the inner heads by hand on the ends of the roll and correspondingly the outer heads onto heat-press plates, which press the outer heads onto the ends of the roll. The inner heads can also be moved manually with the aid of an air blast, or mechanically without touching them. The inner end heads are held on the end of the roll using a separate arm while the ends of the edges of the wrapping are being folded. The outer heads are, in turn, attached to the press plates by vacuum suction. In manual placing, the packer ensures that the heads of the right size are used on the roll and that they are correctly placed.
Various kinds of automatic end-head setting devices have been used already for a long time and many different kinds of them exist. A common feature of nearly all automatic head-setters is that there is a device including a grip for both ends of the roll, which transfers the head from a pile of heads onto the end of the roll. In one known end-head setter, there is a rotating arm located in a vertical guide, at the end of which is a rotating vacuum grip for gripping the heads. Such a head setter is usually used with separate head shelves located next to the setter. Heads are set on the end of the roll using this device, in such a way that the arm is moved along the vertical arm to the height of the shelf on which there are the correctly sized heads. The grab arm and the grab are rotated until the grab is parallel with the shelf top, after which the head is picked off the shelf and transferred to the end of the roll by rotating the arm and grab and moving them along the guide. In this type of device, there is usually no separate device for measuring the size and position of the end heads.
In another system, the end heads are placed in piles on the floor of the mill hall and are transferred to the end of the rolls using a portal-operation head setter. The transfer portal is built above the piles of heads and the head setters are generally installed on the same transversely movable guides. Thus, there must be a separate pile of heads of a specific size for each grab. U.S. Pat. No. 5,157,265 discloses a method for determining the size and position of end heads, which is suitable for use in connection with the above system. In this measurement method, the end head lifted by the grab is taken at a known speed past two pairs of photoelectric cells, so that the arrival of the front edge of the head at the position of the cells and the passing of the rear edge of the head are detected on the basis of the change in the signals of the photoelectric cells. The distance between the points of intersection can be calculated form the known speed of the head and the difference in the time of change in the signals. Because the shape of the head is known, its position and size can be determined. Because the lifting position of the grab relative to the head pile is known, the real position of the head pile can be determined from the position of the head on the grab.
Instead of the end-head handling methods described above, it is possible to use a standard model industrial robot with several degrees of freedom in head handling. Such a robot can be located in connection with a packing line, in such a way that it can be used to place an end head on each end of a roll. In order to make the robot operate efficiently, it must use a two-sided grab, by means of which it can pick up heads for both sides one after the other, by rotating the grab in between, thus eliminating the need for two lifting movements. Two robots can also be used, in which case a shorter stage time will be achieved.
The method disclosed in U.S. Pat. No. 5,157,265 has, however, several weaknesses, due to which it is not suitable for use in the transfer of end heads taking place with a robot. Because a two-side grab, in which the heads are on top of each other, must be used with the robot, the photoelectric cells are not able to distinguish from which edge of the head the signal changes, so that this method cannot be used when using a two-sided grab, unless depth-range detection is set for the photoelectric cells, so that they will detect only the desired head from heads lying on top of each other. Because only two photoelectric cells are used in the method, it cannot be used to detect edge damage. If a faulty part of the edge coincides with the path of the photoelectric cell, the size and position of the head will be calculated wrongly and the head may be taken to broke, even though in fact it might be completely usable. The rejection of a head is not in itself a problem, but after rejection a new head must be lifted, which of course will disturb the operation of the packing line. Usually, however, the head is taken to the press plate and the operator is given an error notification, when he will correct the position of the head visually or place a new head on the press plate. This can only be done when the movements of the robot are sufficiently slow while correction of error situations greatly disturbs the operation of the packing line. The movements of the robot must be slowed for reading of the position of the end head to be made with sufficient precision. Similarly, in an error situation, the movement must be stopped, so that the operator can safely enter the area of movement of the robot. Thus, it is possible to operate in the manner described above also when using robot head setting, but the greatest benefit will not, however, be gained from the robot, due to the necessarily slow speed of movement of the robot.
In addition, in this system the position of the head is compared with the position of the reference point of the grab, the location of which is known the whole time on the basis of the signal given by the movement sensors of the transfer apparatus. Thus, the method cannot be applied when using industrial robots, because with rapid movements the position data of the robot cannot be determined continuously. In the case of robot head setting, the reference point of the grab must be determined in some other way than from the position data of the robot, because the movement of the robot cannot be slowed/is not worth slowing during the measurement to such an extent that the position data can be read.
U.S. Pat. No. 5,376,805 discloses a method for determining the size and position of an end head relative to the grab transporting the head. The grab is moved by a robot with several degrees of freedom and the measurement of the head takes place in a separate measuring station. The measuring station has three photoelectric cells, passed which the head is taken. A detection element is fitted to the grab, with the aid of which the position of the tool-point of the grab is determined when the grab passes the first detection element. The position and size of the head is determined on the basis of the segments obtained with the aid of the signals given by the detectors from the edges of the head. In this solution too, a separate measuring station is used, so that the transfer of the head to the end of the roll is slow, or else a high-efficiency robot must be used, by means of which a high acceleration and deceleration can be achieved. If the size of the head is not determined, but is instead given as initial data to the system, only two photoelectric cells will be needed and two points for determining the position of the end head.

Method and apparatus for measuring the position of an end head of a roll