A nonvolatile memory apparatus includes a memory cell array including a plurality of sub arrays. A plurality of analog-to-digital converters (ADCs) configured to sense sensing voltages outputted from memory cells of the plurality of sub arrays and a path selection unit configured to electrically couple the plurality of sub arrays with the plurality of ADCs in one-to-one correspondence in a first operation mode, and electrically couple the plurality of ADCs with a terminal of a power supply voltage in a second operation mode.

1. Technical Field
Various embodiments relate to a semiconductor apparatus, and more particularly, to a memory apparatus including nonvolatile memory cells and a semiconductor system using the same.
2. Related Art
In general, a DRAM includes a memory cell constituted by a capacitor, and data is stored by charging or discharging the capacitor of the memory cell. However, since the capacitor has a leakage due to the characteristics thereof, the DRAM has a disadvantage in that it is a volatile memory. In order to overcome the disadvantage, memories which are nonvolatile and do not need the refreshing of data have been developed. In particular, attempts have continuously been made to realize nonvolatility by modifying the structure of a memory cell. One of these attempts is a resistive memory apparatus which includes a resistive memory cell.
A resistive memory apparatus includes a memory cell which is formed of a variable resistance substance, and the variable resistance substance may have a resistance value that is changed according to the magnitude of current flowing through it. Accordingly, by controlling the magnitude of current to be applied to the memory cell, desired data may be written in the memory cell. For instance, in the case where the memory cell is a high resistance state, the memory cell may have stored data of 0, and, in the case where the memory cell is a low resistance state, the memory cell may have stored data of 1. The variable resistance substance may have at least three resistance states. Therefore, the memory cell of the resistive memory apparatus may be utilized as a multi-level cell capable of storing multi-bit data.
FIG. 1 is a diagram schematically showing the configuration of a conventional resistive memory apparatus 10. In FIG. 1, the resistive memory apparatus 10 includes a memory cell array 11, a row decoding unit 12, a column decoding unit 13, and a read driver 14. In the memory cell array 11, a plurality of word lines including WL0 to WL2 and a plurality of bit lines including BL0 to BL2 are disposed, and memory cells MC are electrically coupled to the crossing points of the word lines and the bit lines. The row decoding unit 12 selects a word line to access, in response to a row address, and the column decoding unit 13 selects a bit line to access, in response a column address. Accordingly, as a specified word line and a specified bit line are selected, a specified memory cell MC may be accessed.
The read driver 14 applies sensing current and/or a voltage to the accessed memory cell MC in a read operation. By sensing a voltage and/or current which changes according to the resistance value of the memory cell MC, it is possible to read the data stored in the memory cell MC. In the case where the memory cell MC is a multi-level cell, in order to precisely read the multi-bit data stored in the memory cell MC, the read driver 14 may include an analog-to-digital converter (ADC).

Nonvolatile memory apparatus, and semiconductor system and computer device using the same


A method for automatically assigning multimedia features to map views selected "on the fly" in a computer-based multimedia atlas program. The atlas program allows a user to pan and zoom over the globe so that the map views selected by the user are not necessarily the best-view map of any particular map entity. The multimedia atlas program assigns a "place context" to a selected map view, which identifies and serves as the title of the map. The place context is a particular map entity that has an associated set of multimedia features, such as videos, music, pictures, etc. Control items associated with the multimedia features for the place context are then displayed for selection by the user. A "parent context," which identifies a larger map that the selected map view is a part of, is also assigned to the selected map view. The user may select a parent context control item to cause the control items for selecting the multimedia features for the parent context to be displayed for selection by the user. Selecting the parent context control item may also change the map view to a best-view map of the parent entity.

Lewis and Clark had to cross the Nation by canoe and horseback to obtain the information necessary to create the first rudimentary maps the vast Northwest territories of the fledgling United States. Modern "desktop explorers" are not so hindered. Thanks to personal computers and world atlas software, accurate maps of the surface of the Earth can be accessed in seconds from the comfort of one's home or office. Modern atlas software, however, provides much more than accurate maps. Increasingly powerful personal computers and atlas software allow specific locales to be correlated with multimedia features, such as tabular, pictorial, graphical, video, and audio information to reward the desktop explorer with entertaining and informative multimedia visits to far away places.
These multimedia features make computer software "come alive" in an entertaining and user-friendly manner that allows children and adults with only basic computer skills to enjoy and learn as never before. Consumer demand is therefore strong for increasingly entertaining and informative multimedia software. The increasing data storage and processing capabilities of personal computers drive the need for innovation in the development of multimedia atlas software. New computer software techniques are constantly in demand to take advantage of the ever increasing hardware capabilities of personal computers. Much effort therefore goes into improving the speed, accuracy, and content of multimedia atlas software for personal computers.
In a multimedia atlas program, a particular map entity may have an associated set of multimedia features. A particular city, for instance, may have multimedia features such as videos describing the local culture and history, audio clips from famous sporting events and speeches held in the area, pictures from local universities and museums, etc. A user typically selects a multimedia feature by clicking on a control item displayed in a multimedia selection menu. These control items are usually correlated with the map displayed on the monitor. For example, the multimedia control items associated with Chicago are displayed when a map of Chicago is displayed, the multimedia control items associated with the Ohio are displayed when a map of the Ohio is displayed, etc.
Multimedia features are typically associated with significant political or geologic formations, such as continents, bodies of water, countries, regions, cities, mountain ranges, rivers, and so forth. Any particular map view may include all or part of more than one map entity that has associated multimedia features. For example, a map view of a portion of the Great Lakes region might include all or part of the following map entities, each of which has its own set of multimedia features: North America, United States, Canada, Great Lakes region, Michigan, Wisconsin, Illinois, Indiana, Ohio, Lake Michigan, Chicago, Green Bay, and so forth. In fact, the vast majority of map views include more than one map entity that has associated multimedia features. A low-altitude map of Chicago, for instance, displays a portion of North America, the United States, the Great Lakes region, Illinois, Lake Michigan, and Chicago.
Producing atlas software with real-time interactive tools, along with a generous complement of multimedia features, is a challenging task for the computer cartographer. A particularly compelling multimedia experience is produced when the user interacts with the atlas software in real-time by panning or zooming over a map image in response to user commands to simulate flying over the Earth. Such an interactive presentation of map data, together with a generous complement of multimedia features, is both entertaining and informative for users. With this type system, the user may "fly" over the globe from one locale to another, stopping along the way to experience multimedia visits at various locations.
The ability of the user to stop "flying" over virtually any position, orientation, and altitude allows the user to select from a very large number of possible map views. Once the user stops "flying" to select a particular map view, the multimedia atlas program renders the selected map view. Since the user has selected a new map view, it would be advantageous for the multimedia atlas program to update the multimedia selection menu to display the control items associated with the newly displayed map view. But allowing the user to select a map view by panning or zooming may make it difficult to determine which set of the multimedia features to associate with a particular map view.
To illustrate, consider a user who pans to a map view showing a portion of the Great Lakes region. In response, the multimedia selection menu could display the multimedia control items associated with any or all of the map entities in that map view that have associated multimedia features, which may include the World, North America, United States, Canada, Great Lakes region, Michigan, Wisconsin, Illinois, Indiana, Ohio, Lake Michigan, Chicago, Green Bay, etc. Since only a limited number of control items can be displayed at one time, it may not be possible to simultaneously display all of the control items associated with all of these map entities. In addition, prior art multimedia atlas programs are not configured to select a set of multimedia control items to display in association with a map view that has been selected using the panning or zooming tools.
One way to update the multimedia control items to correspond to new map views selected using the panning or zooming tools would be to store a predefined set of multimedia control items for every possible map view. But doing so would require a prohibitively large amount of memory. Prior art multimedia atlas programs, such as ENCARTA96 WORLD ATLAS, address this problem by displaying the multimedia control items for a particular map entity only in association with a best-view map of that locale. Thus, the multimedia control items for the United States are displayed only when the best-view map of the United states is displayed on the monitor, the multimedia control items for the Great Lakes region are displayed only when the best-view map of the Great Lakes region is displayed on the monitor, and so forth.
To facilitate the selection of map entities that have associated multimedia features, these prior art multimedia atlas programs typically include a "find" user interface tool that allows a user to type in the name of a desired map entity. Alternatively, the user may select a desired map entity from an alphabetized scroll list. In response to selection of a map entity using the "find" user interface tool, the best-view map of the selected map entity is displayed along with the multimedia control items for the selected map entity. The user may then select among the multimedia control items while viewing the best-view map of that map entity. If the user pans or zooms away from the best-view map, the multimedia control items are typically disabled.
Thus, if a user pans or zooms to a map view that shows a particular locale, the multimedia control items for the map entities in that map view are not automatically displayed. This limitation occurs because it is difficult for the multimedia atlas program to determine the appropriate context for a map view that a user has panned or zoomed to. That is, since most map view may display all or part of a number of map entities that have associated multimedia features, the multimedia atlas program cannot readily ascertain which control items to display in association with a particular map view. This aspect to the prior art multimedia atlas programs makes the selection of multimedia features cumbersome when the user selects map views using the pan and zoom modes.
Specifically, once a user pans or zooms to a particular map view, the user must then use the "find" user interface tool to fill the multimedia selection menu with the control items associated with a desired map entity. Making this selection replaces the map view with the best-view map of the selected map entity, which typically changes the position, altitude, and orientation of the displayed map view. In fact, selecting a relatively large scale map entity from a relatively low altitude map view, or vice verse, may drastically change the altitude of the map view. For example, selecting the best-view map of the Great Lakes region while viewing a low-altitude map of Chicago would drastically increase the altitude of the map view.
Thus, the prior art procedure for selecting multimedia features from the pan or zoom mode requires several steps, which novice users may not be familiar with. In addition, the procedure for selecting a multimedia feature causes the screen to be repainted with the best-view map of a selected map entity. This may break the continuity of the panning or zooming sequence, and thus diminish the experience of virtually "flying" from one locale to another and enjoying multimedia experiences at the various stops.
Therefore, there is a need for a multimedia atlas program that automatically associates multimedia control items with map views selected using a panning or zooming tool. There is a further need for a multimedia atlas program that automatically associates multimedia control items with map views without repainting the screen with the best-view map of a particular map entity.

Mehtod for automatically associating multimedia features with map views displayed by a computer-implemented atlas program


A Pipe Wrench with: reasonable coordination on distance between—Center of Arcuate Teeth and Link-Hole, eccentric length of Tips of Arcuate Teeth and Link-Hole; Instant Grip and Release, Time-Saving, Power-Saving, easy Operation is disclosed. It is composed of Heading-Hook, Main Body, Arcuate Jaw-Block, Spring-Guard Plate, Spring, Oil-Rope, Pin and Screw Bolt. The Jaw-Block designed by two (2) different sizes of Arc is inlaid in Slot B on Handle, due to designed size of Link-Hole being eccentric from center of Arcs of Jaw-Block is well coordinated with Arcs on Tip Teeth of Jaw-Block, which enables this Invention with Reliable and Firm Self-Lock on workpiece as well as its Open-Width being enlarged.

Common Pipe Wrench is made with Leading Screw and Screw Nut, the adjustment of its opening and closing is realized by coordination between these two (2) parts, continuous regulating is needed being operated, waste time and manpower, the workpiece is easily damaged, due to its device; in addition, causing non-average pressure on workpiece and slippage. The existing Pipe Wrench has also function of 3-pointed contact on workpiece, but its Operating Open-Width does not come up to the requirement being operated, resulted from irrational device on the distance between Heading-Hook and Top-Teeth of Arcuate Jaw-Block and the distance between the Centers of Arc of Jaw-Block Teeth-Tips+Heading-Hook teeth-Tips and Pin Hole, leading to inconvenience to operation.
The aim of this invention is to avoid above mentioned inadequateness, supplying a sort of Pipe Wrench with good performance, larger size of Operating Open-Width, reliable gripping, instant locking, manpower-save, convenient operation that resulted from reasonable design in coordination of the distance between center of Arcuate Teeth and Linking Hole, eccentric distance between Tip of Arcuate Teeth and Link-Hole.


Gelatin microcapsules for magnetic display enclosing therein dispersion medium, magnetic powder and nonmagnetic powder, characterized in that that the dispersion medium in the microcapsules is composed of at least low boiling point solvent, particle diameter of the microcapsules is ion a range of 400 .mu.m tap 800 .mu.m and particles bigger than average are removed out. And solvents with boiling point higher than 175 .degree. C., dispersant and suspension are contained in the dispersion medium, magnetic powder and nonmagnetic powder are affinity-treated. The microcapsule magnetic display sheet is produced by coating the above-described microcapsules. Therefore, recording speed and erasing speed are fast and recorded words or pictures are clear even if a magnetic force lower than 1100 gauss is used.

1. Field of the Invention
The present invention relates to gelatinized microcapsules for magnetic display in which a dispersion medium, magnetic powder and nonmagnetic powder are enclosed.
2. Description of the Prior Art
Many methods of magnetic display are well known to date; for example, a magnetic display method that makes small rooms between two plates, seals ball-shaped magnetic powder and tungsten oxides particles in liquid in the small rooms and makes a display by moving the magnetic powder to the surface by magnetic force (So-called as moving type as noted below) was published in Japanese Patent Publication Kokoku S51-10959. Furthermore, inventions published in Japanese Patent Publication Kokoku S57-27463, S59-31710, S59-47676 and S62-53359 have made an improvement of the dispersion medium in order to afford a good dispersion of the magnetic powder and the tungsten oxide particles. Among them, there is an invention concerning a magnetic display system in practical use that makes small rooms with a size of 4 mm.sup.3, having honeycomb shape on a supporting plate, injects liquid having a white pigment and magnetic powder therein in the honeycombs and laminates and seals a transparent sheet on it to finish it. According to this display system, a display may be made by scanning a magnet on the back surface of the magnetic display plate from one side to the opposite so as to attract the magnetic powder in the honeycombs to the back surface and to make the surface white. While making contact using a permanent magnetic pen with the surface of the magnetic display, the magnetic powder in the contact part moves to the surface and image appears.
On the other hand, in Publication of Japanese Patent Publication Kokoku S54-29895, a magnetic record medium that is produced by coating microcapsules having sensitive flakes in it that have sensitivity to a magnetic field and are floating in a liquid on a base plate is described. According to this invention, when a magnetic field is brought to bear on the magnetic record medium, the sensitive flakes in the microcapsules are oriented in a perpendicular direction, only a part of the sensitive flakes is under the magnetic field, moves in longitudinal direction, orients to horizontal to the magnetic record medium and shows an image (so-called as deflection type as below). The same magnetic display method using the magnetic flakes are also published in a Publication of Japanese Patent Application Laid-open S63-153197, S64-19384 and H1-145637. The two types of moving type and deflection type are also published in a Publication of Japanese Patent Publication Kokoku S55-29880. In the magnetic display system using ball-shaped magnetic powder, an invention according to which a better display may be made by specifying the size of microcapsules and mixing two kinds of microcapsules of different sizes is described in Japanese Patent Publication Kokoku H4-233581.
There are some problems among the inventions published to date, particularly in Japanese Patent Publication Kokoku H4-233581. The magnetic display method by using microcapsules consisting of the ball-shaped magnetic powder in it can not be put into practical use, because although a good display may be made, the images are not clear and the recording speed and erasing speed are slow when the magnetic force is weak.
Further, the microcapsule particles may be destroyed gradually while writing repeatedly by a magnetic pen and clearness of the display sheet diminishes. Durability of the display sheet has to be improved.
Therefore, the inventors of the invention have conducted many researches and discovered that the durability of microcapsule magnetic display sheet depends on the thickness and hardness of the transparent film and the arrangement of a cushion element (pressure-proofing film) adjacent to the microcapsule dispersoid and the destruction of the microcapsules caused by pressure is relieved by the thickness and hardness of the transparent film. The inventions have been accomplished based on the discoveries mentioned above.

Microcapsules for magnetic display and magnetic display sheet comprising such microcapsules


An inadvertent invocation of power management is avoided by having an application program set a storage location to a predetermined value. The application program then calls a BIOS software interrupt from the application program. The BIOS software interrupt routine determines if the storage location contains the predetermined value and if so, resets the power management timers, thus preventing power management from being inadvertently invoked.

1. Field of the Invention
This invention relates to power management in computers.
2. Description of the Related Art
Computers with power-management capabilities are known. Power management causes the computer to turn off a large portion of its circuitry in order to conserve power. Such power management techniques are common on portables and on "green" computers. For instance, such computers utilize a power management timer that will cause the computer to go into a power management mode when the timer has timed out. However, the timer is reset by such activity as keyboard or mouse activity. Thus, when the keyboard or mouse is active, the computer will not go into a power management mode.
When computers with power management are used with applications such as serial communication programs, the power management feature can be invoked inadvertently, during, e.g., a long download, when there is no keyboard or mouse activity. That can disrupt the serial protocol and cause an error or an abort of the download or other serial communication.
One solution to the problem of inadvertent invocation of power management is to turn off power management through the setup screen prior to starting the serial communications program. The user must then remember to turn power management back on after the serial communications program has completed its task. In many cases that requires a reboot of the computer system.
It would be desirable to provide a power management system in which application programs will not be disrupted on account of inadvertent invocation of power management mode. Further, it would be desirable to provide such a power management system which requires no user intervention.

Method and apparatus for preventing inadvertent power management time-outs


In the present invention, a gas pipe integrated block has a plurality of internal pipe paths. The plurality of internal pipe paths are connected to an ozone generator, control means, a raw gas supply port, an ozone gas output port, and cooling water inlet/outlet ports, to thereby form a unit in which a raw gas input pipe path and an ozone gas output pipe path are integrated. The raw gas input pipe path extends from the raw gas supply port through an automatic pressure controller to the ozone generator. The ozone gas output pipe path extends from the ozone generator through a gas filter, an ozone concentration meter, and a flow rate controller, to the ozone gas output port.

In a case of supplying an ozone gas to a multiple ozone treatment apparatus including a plurality of ozone treatment apparatuses, it is generally conceivable to build an ozone gas supply system in which a plurality of ozone generation mechanisms (means) each including an ozone power source, a flow rate controller (MFC), and the like, are provided corresponding to the plurality of ozone treatment apparatuses, respectively, so that the ozone generation mechanisms independently supply an ozone gas to the corresponding ozone treatment apparatuses. A raw gas such as a high-purity oxygen gas having a purity of 99.99% and a dew point of −70° C. or lower is supplied to an ozone generator of each ozone generation mechanism.
More specifically, in the ozone gas supply system, an ozone power source, a raw gas pipe system line, an output gas pipe system line, and the like, are provided, and the number of each of them is equal to the number of system lines included in the multiple ozone treatment apparatus. The raw gas pipe system line supplies a raw gas such as a high-purity oxygen gas having a purity of 99.99% and a dew point of −70° C. or lower to the ozone generator via flow rate adjusting means such as an MFC for controlling a flow rate of the ozone gas or the raw gas. The output gas pipe system line includes pressure adjusting means such as an automatic pressure controller (APC) for controlling gas atmosphere pressure in the ozone generator, an ozone concentration detector for detecting a concentration of the ozone gas outputted from the ozone generator, and an ozone flow meter.
In a case of supplying an ozone gas to a multiple ozone treatment apparatus including a plurality of ozone treatment apparatuses, it is generally conceivable to build an ozone gas supply system in which a plurality of ozone generation mechanisms each including an ozone power source, a flow rate controller (MFC), and the like, are provided corresponding to the plurality of ozone treatment apparatuses, respectively, so that the ozone generation mechanisms independently supply an ozone gas to the corresponding ozone treatment apparatuses.
More specifically, in the ozone gas supply system, an ozone generator, an ozone power source, a raw gas pipe system line, an output gas pipe system line, and the like, are provided, and the number of each of them is equal to the number of system lines included in the multiple ozone treatment apparatus. The raw gas pipe system line supplies a raw gas to the ozone generator via an MFC or the like for controlling a flow rate of the raw gas. The output gas pipe system line includes an ozone concentration detector for detecting a concentration of the ozone gas outputted from the ozone generator, and an ozone flow meter.
A very large space is required for building an ozone generation system compatible with such a multiple ozone treatment apparatus, and moreover, a still larger system configuration is required for building a system that supplies an ozone gas while coordinately controlling the multiple ozone treatment apparatus. Thus, there are problems of costs, an installation space, and the like, to cause many disadvantages in a practical use.
Therefore, in a conventional method for ozone supply to a multiple ozone treatment apparatus, an ozone gas supply system is adopted in which the capacity of a single-type ozone generator is increased and a pipe system line for outputting an ozone gas is divided into a plurality of pipes, so that an ozone gas having a predetermined flow rate and a predetermined concentration is stepwise outputted to a multiple ozone treatment apparatus, as disclosed in Patent Document 1, for example.
FIG. 24 is a block diagram showing an internal configuration of a conventional ozone gas supply system 70, which can be simulated based on the disclosure of the Patent Document 1.
FIG. 24 shows an ozone generator 71, an ozone power source 72, a raw gas pipe system line, and an output gas pipe system line. The raw gas pipe system line supplies a raw gas to the ozone generator 71 via a flow rate controller (MFC) 73 for controlling a flow rate of the raw gas and a pressure meter 62 for monitoring pressure in the generator. A part of the output gas pipe system line subsequent to an output pipe having a valve switch 61, an ozone concentration meter 75, and an ozone flow meter 67, is divided into a plurality of pipes. The valve switch 61 adjusts opening/closing of a valve depending on a pressure fluctuation in the ozone generator 71. Additionally, in the ozone gas supply system 70, individual ozone-gas flow rate controllers (MFC) 68-1 to 68-n are provided to the divided parts of the output gas pipe system line, respectively, so that the ozone gas can be independently supplied to a plurality of ozone treatment apparatuses 12-1 to 12-n that are provided corresponding to the individual MFCs 68-1 to 68-n, respectively. An amount of ozone gas exceeding the amount to be supplied by the individual MFCs 68-1 to 68-n is discharged by a flow rate discharge unit 69.

This patent is subject to a terminal disclaimer.

Ozone gas generation unit and ozone gas supply system

TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION


An image distribution method for distributing an image acquired by a camera on a network includes the steps of receiving control information for the camera from an image reception apparatus via a packet-switched network; and sending an image acquired by the camera to the image reception apparatus via a circuit-switched network.

1. Field of the Invention
The present invention relates to an image distribution system that is suitable for use, for example, with a monitoring camera.
2. Description of the Related Art
In a known system for monitoring image acquired by a video camera from a plurality of remote locations, remote control of camera status, such as pan, tilt angle, and zoom factor of the camera, is allowed in addition to observing image acquired by the camera. For example, in a system product available, using packet-switched communications, a camera that can be controlled by a computer is connected to a WWW (World Wide Web) server on the Internet so that a person that has accessed is allowed to receive real-time image acquired by the camera and also to control the camera.
Many mobile apparatuses such as cellular phones have the capability of accessing the Internet using packet-switched communications to allow browsing WWW and exchanging electronic mails, in addition to the capability of circuit-switched communications, in which an end-to-end connection is maintained throughout a call.
Generally, circuit-switched communications are suitable for continuously transmitting a large amount of a particular type of data since the bandwidth is assured. For example, circuit-switched communications are used for a system that requires an assured bandwidth for particular data (e.g., video data), such as a videophone system. However, circuit-switched communications are not suitable for specifically controlling a camera on the other end.
Furthermore, when a continuous image such as a moving image is to be transferred, packet-switched communications are not suitable since the bandwidth is not assured.

Image distribution method employing both a first network whose bandwidth is not assured and second network whose bandwidth is assured for control and image transmission


Tunable cajón devices, including tuning and adjustment during a performance, are disclosed. In an aspect, the present disclosure provides a tunable cajón device wherein internal strings or cords under tension may be tuned via the manual manipulation of tuners accessible via a top surface of the cajón. As such, a cajón player may view tuner position and adjust the tuner from the traditional playing position. Adjustments (i.e., tuning of internal strings) may be done before, during, or after a performance.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
A wide variety of percussion musical instruments have been developed in used in virtually every instrument-accompanied musical genre. One type of percussion instrument, the box-shaped cajón, originated in Peru and first achieved widespread popularity in the 1850s. In fact, the cajón has been the most widely used Afro-Perusian musical instrument since the 19th century. The origins of the instrument are subject to debate, however the cajón was most likely developed by slave musicians in the Spanish colonial Americas. It is believed that these musicians modified crates, dresser drawers and other boxes into musical instruments similar to the Angola and the Antilles instruments of west and central Africa. By disguising these instruments as common crates, the slaves were able to avoid 19th century Spanish colonial bans on possession of music and music-related equipment by slaves.
Today, the cajón, also known as a drum kit in a box, cajón box, or Cuban box drum, is an integral part of Peruvian and Cuban music. Cajóns often accompany acoustic guitars in modern, western contemporary music. The Cajón is also becoming popular in styles such as blues, pop, rock, funk, fusion, and jazz.
Cajóns may be constructed in a variety of sizes. Typically, a cajón comprises a wooden box. Five of the sides are constructed of half to three-quarter inch thick wood. A thinner sheet of wood (e.g., plywood) is fastened on as the sixth side and acts as the striking surface or head of the drum. This striking surface is often called the tapa. The side opposite the tapa may comprise one or more sound hole openings. Alternatively, the sound hole may be positioned on the side, bottom, or top of the cajón.
Cajóns may additionally comprise one or more cords, guitar strings, rattles, or drum snares pressed against the inner surface of the tapa in order to alter the sound profile of the cajón. Such additional elements may add a buzz-like effect or tone to the cajón. The addition of guitar strings may expand the sound profile of the cajón by adding one or more frequencies to the sounds produced by the cajón. Such guitar strings must be tuned in order to produce the desired sound.
A cajón is played by tapping, slapping, and striking the tapa with the hands, feet and, in some cases, mallets. Typically, the top and bottom edges of the tapa may be left unattached (or loosely connected) and may be slapped against the frame of the box. A cajón player typically sits astride the box and strikes the tapa located between their knees. The cajón produces markedly different sounds depending on the location the tapa is struck. This wide variety contributes to the cajón's popularity. Further expanding the variety of sounds a cajón may produce is needed.
Given the foregoing, systems, methods, and apparatuses are needed that allow for tuning of a guitar-string equipped cajón, including during a performance.


Testing is performed on an amplifier wafer housing a transimpedance amplifier prior to packaging the transimpedance amplifier with an external photodetector, wherein the transimpedance amplifier includes a small, auxiliary, integrated silicon photodetector provided at the input of the transimpedance, in parallel with external photodetector attachment points. Totest the transimpedance amplifier, the transimpedance amplifier is stimulated by optically exciting the small auxiliary photodetector, wherein the small auxiliary photodetector is excited using short wavelength light, whereby advantages such as higher efficiency may be obtained. The testing method includes placing the amplifier wafer in a testing system, probing the power and ground connections on the amplifier wafer, illuminating the small auxiliary photodetector on the amplifier wafer, and detecting the output of the transimpedance amplifier housed on the amplifier wafer.

In an optical communication system, a transimpedance amplifier may be used to amplify an electrical current and convert the electrical current into a voltage. A transimpedance amplifier fabricated in silicon CMOS or bipolar technology, for example, may be provided in an optical receiver along with a photodetector.
FIG. 1 shows an exemplary embodiment of an optical receiver in an optical link. As shown in FIG. 1, an optical receiver 100 may comprise of a photodetector 300, and a transimpedance amplifier 400 connected to the photodetector 300 via wirebonds 210.
As shown in FIG. 1, the photodetector 300 receives optical input and converts the light to a proportional photocurrent. The photocurrent is input to the transimpedance amplifier 400 via an electrical connection 210, where it is converted to a peak-to-peak voltage Vout that is conditioned and amplified.
As a current trend, optical receivers are widely used in optical links. Many optical links operate at wavelengths of 1.3 um or 1.55 um using single mode optical fiber. Optical links may be manufactured at lower costs using multimode fiber and using a wavelength of 0.85 um. In these optical links, the requirements of the photodetectors in the optical receiver include, for example:                high speed, of typically 1-10 Gb/s;        high quantum efficiency of greater than 75%;        large area of 50-75 um diameter, since the core diameter of multimode fiber is 50 um or 62.5 um; and        low bias voltage of 2-5V.
Given the large absorption length of silicon at a wavelength of 0.85 um, and since silicon is not sensitive to the single-mode fiber wavelengths of 1.3 um and 1.55 um, it is extremely difficult for a silicon photodetector to meet all of the requirements for operating in an optical link. For example, since all CMOS and bipolar processes fabricate the active devices very close to the semiconductor surface, such as within 1.0 um, it is difficult to maintain a high quantum efficiency of greater than 75%.
Accordingly, in optical receivers, photodetectors may be fabricated from materials other than silicon. In such cases, the transimpedance amplifier and the photodetector are fabricated separately, and then packaged together with wirebonds or flip-chip attachment after fabrication in the amplifier circuit.
FIG. 2 shows an exemplary embodiment of a transimpedance amplifier for use in optical receivers where the transimpedance amplifier and the photodetector are fabricated separately. As shown in FIG. 2, the transimpedance amplifier 2000 comprises a substrate 200, and power supply 500, and ground 600, and amplifier circuit 400 formed on the substrate 200. Further, as shown in FIG. 2, a photodetector wiring bond pad 100 for wirebonds or flip-chip attachment to the photodetector after fabrication is also fabricated on the transimpedance amplifier 2000.
In these embodiments, at least due to a lack of high speed current sources to drive the input of the transimpedance amplifier, the transimpedance amplifier 2000 is not tested at high speed until it is diced and packaged with a photodetector. In addition, because one and two dimensional arrays of optical receivers in new packaging technologies, such as silicon carrier, may produce individual contact pads as small as 15 um diameter on a pitch of 30 um, and since high speed probes are typically limited to a minimum pitch of 50-100 um, wafer level probing of the high speed output signals may become extremely difficult. Therefore, the transimpedance amplifier 2000 is tested after being packaged with a photodetector. Deferring testing to this stage of fabrication is undesirable since fallout of parts at this stage may be very costly.

International Business Machines Corporation


Numerous embodiments of analog neural memory arrays are disclosed. In one embodiment, an analog neural memory system comprises an array of non-volatile memory cells, wherein the cells are arranged in rows and columns, the columns arranged in physically adjacent pairs of columns, wherein within each adjacent pair one column in the adjacent pair comprises cells storing W+ values and one column in the adjacent pair comprises cells storing W− values, wherein adjacent cells in the adjacent pair store a differential weight, W, according to the formula W=(W+)−(W−). In another embodiment, an analog neural memory system comprises a first array of non-volatile memory cells storing W+ values and a second array storing W− values.

Artificial neural networks mimic biological neural networks (the central nervous systems of animals, in particular the brain) and are used to estimate or approximate functions that can depend on a large number of inputs and are generally unknown. Artificial neural networks generally include layers of interconnected "neurons" which exchange messages between each other.
FIG. 1 illustrates an artificial neural network, where the circles represent the inputs or layers of neurons. The connections (called synapses) are represented by arrows, and have numeric weights that can be tuned based on experience. This makes the artificial neural network adaptive to inputs and capable of learning. Typically, artificial neural networks include a layer of multiple inputs. There are typically one or more intermediate layers of neurons, and an output layer of neurons that provide the output of the neural network. The neurons at each level individually or collectively make a decision based on the received data from the synapses.
One of the major challenges in the development of artificial neural networks for high-performance information processing is a lack of adequate hardware technology. Indeed, practical artificial neural networks rely on a very large number of synapses, enabling high connectivity between neurons, i.e. a very high computational parallelism. In principle, such complexity can be achieved with digital supercomputers or specialized graphics processing unit clusters. However, in addition to high cost, these approaches also suffer from mediocre energy efficiency as compared to biological networks, which consume much less energy primarily because they perform low-precision analog computation. CMOS analog circuits have been used for artificial neural networks, but most CMOS-implemented synapses have been too bulky given the high number of neurons and synapses.
Applicant previously disclosed an artificial (analog) neural network that utilizes one or more non-volatile memory arrays as the synapses in U.S. patent application Ser. No. 15/594,439, published as US Patent Publication 2017/0337466, which is incorporated by reference. The non-volatile memory arrays operate as an analog neuromorphic memory. The term neuromorphic, as used herein, means circuitry that implement models of neural systems. The analog neuromorphic memory includes a first plurality of synapses configured to receive a first plurality of inputs and to generate therefrom a first plurality of outputs, and a first plurality of neurons configured to receive the first plurality of outputs. The first plurality of synapses includes a plurality of memory cells, wherein each of the memory cells includes spaced apart source and drain regions formed in a semiconductor substrate with a channel region extending there between, a floating gate disposed over and insulated from a first portion of the channel region and a non-floating gate disposed over and insulated from a second portion of the channel region. Each of the plurality of memory cells is configured to store a weight value corresponding to a number of electrons on the floating gate. The plurality of memory cells is configured to multiply the first plurality of inputs by the stored weight values to generate the first plurality of outputs. An array of memory cells arranged in this manner can be referred to as a vector by matrix multiplication (VMM) array.
Examples of different non-volatile memory cells that can be used in VMMs will now be discussed.
Non-Volatile Memory Cells
Various types of known non-volatile memory cells can be used in the VMM arrays. For example, U.S. Pat. No. 5,029,130 ("the '130 patent"), which is incorporated herein by reference, discloses an array of split gate non-volatile memory cells, which are a type of flash memory cells. Such a memory cell 210 is shown in FIG. 2. Each memory cell 210 includes source region 14 and drain region 16 formed in semiconductor substrate 12, with channel region 18 there between. Floating gate 20 is formed over and insulated from (and controls the conductivity of) a first portion of the channel region 18, and over a portion of the source region 14. Word line terminal 22 (which is typically coupled to a word line) has a first portion that is disposed over and insulated from (and controls the conductivity of) a second portion of the channel region 18, and a second portion that extends up and over the floating gate 20. The floating gate 20 and word line terminal 22 are insulated from the substrate 12 by a gate oxide. Bitline terminal 24 is coupled to drain region 16.
Memory cell 210 is erased (where electrons are removed from the floating gate) by placing a high positive voltage on the word line terminal 22, which causes electrons on the floating gate 20 to tunnel through the intermediate insulation from the floating gate 20 to the word line terminal 22 via Fowler-Nordheim tunneling.
Memory cell 210 is programmed (where electrons are placed on the floating gate) by placing a positive voltage on the word line terminal 22, and a positive voltage on the source region 14. Electron current will flow from the drain region 16 towards the source region 14 (source line terminal). The electrons will accelerate and become energized (heated) when they reach the gap between the word line terminal 22 and the floating gate 20. Some of the heated electrons will be injected through the gate oxide onto the floating gate 20 due to the attractive electrostatic force from the floating gate 20.
Memory cell 210 is read by placing positive read voltages on the drain region 16 and word line terminal 22 (which turns on the portion of the channel region 18 under the word line terminal). If the floating gate 20 is positively charged (i.e. erased of electrons), then the portion of the channel region 18 under the floating gate 20 is turned on as well, and current will flow across the channel region 18, which is sensed as the erased or "1" state. If the floating gate 20 is negatively charged (i.e. programmed with electrons), then the portion of the channel region under the floating gate 20 is mostly or entirely turned off, and current will not flow (or there will be little flow) across the channel region 18, which is sensed as the programmed or "0" state.
Table No. 1 depicts typical voltage ranges that can be applied to the terminals of memory cell 110 for performing read, erase, and program operations:
TABLE No. 1Operation of Flash Memory Cell 210 of FIG. 2WLBLSLRead 1  0.5-3 V0.1-2 V   0 VRead 2  0.5-3 V  0-2 V2-0.1 VErase−11-13 V   0 V   0 VProgram  1-2 V  1-3 μA 9-10 V"Read 1" is a read mode in which the cell current is output on the bit line. "Read 2" is a read mode in which the cell current is output on the source line terminal.
FIG. 3 shows memory cell 310, which is similar to memory cell 210 of FIG. 2 with the addition of control gate (CG) terminal 28. Control gate terminal 28 is biased at a high voltage, e.g., 10V, in programming, low or negative in erase, e.g., 0 v/−8V, low or mid range in read, e.g., 0 v/2.5V. Other terminals are biased similarly to that of FIG. 2.
FIG. 4 depicts four-gate memory cell 410 comprising source region 14, drain region 16, floating gate 20 over a first portion of channel region 18, a select gate 22 (typically coupled to a word line, WL) over a second portion of the channel region 18, a control gate 28 over the floating gate 20, and an erase gate 30 over the source region 14. This configuration is described in U.S. Pat. No. 6,747,310, which is incorporated herein by reference for all purposes. Here, all gates are non-floating gates except floating gate 20, meaning that they are electrically connected or connectable to a voltage source. Programming is performed by heated electrons from the channel region 18 injecting themselves onto the floating gate 20. Erasing is performed by electrons tunneling from the floating gate 20 to the erase gate 30.
Table No. 2 depicts typical voltage ranges that can be applied to the terminals of memory cell 410 for performing read, erase, and program operations:
TABLE No. 2Operation of Flash Memory Cell 410 of FIG. 4WL/SGBLCGEGSLRead 1  0.5-2 V0.1-2 V  0-2.6 V0-2.6 V   0 VRead 2  0.5-2 V  0-2 V  0-2.6 V0-2.6 V2-0.1 VErase−0.5 V/0 V  0 V0 V/−8 V 8-12 V   0 VProgram   1 V  1 μA 8-11 V4.5-9 V4.5-5 V"Read 1" is a read mode in which the cell current is output on the bit line. "Read 2" is a read mode in which the cell current is output on the source line terminal.
FIG. 5 shows memory cell 510, which is similar to memory cell 410 of FIG. 4 except that memory cell 510 does not contain an erase gate EG terminal. An erase is performed by biasing the substrate 18 to a high voltage and biasing the control gate CG terminal 28 to a low or negative voltage. Alternatively, an erase is performed by biasing word line terminal 22 to a positive voltage and biasing control gate terminal 28 to a negative voltage. Programming and reading is similar to that of FIG. 4.
FIG. 6 depicts a three-gate memory cell 610, which is another type of flash memory cell. Memory cell 610 is identical to the memory cell 410 of FIG. 4 except that memory cell 610 does not have a separate control gate terminal. The erase operation (whereby erasing occurs through use of the erase gate terminal) and read operation are similar to that of the FIG. 4 except there is no control gate bias applied. The programming operation also is done without the control gate bias, and as a result, a higher voltage must be applied on the source line terminal during a program operation to compensate for a lack of control gate bias.
Table No. 3 depicts typical voltage ranges that can be applied to the terminals of memory cell 610 for performing read, erase, and program operations:
TABLE No. 3Operation of Flash Memory Cell 610 of FIG. 6WL/SGBLEGSLRead 1  0.5-2.2 V0.1-2 V0-2.6 V   0 VRead 2  0.5-2.2 V  0-2 V0-2.6 V2-0.1 VErase−0.5 V/0 V   0 V 11.5 V   0 VProgram     1 V  2-3 μA  4.5 V  7-9 V"Read 1" is a read mode in which the cell current is output on the bit line. "Read 2" is a read mode in which the cell current is output on the source line terminal.
FIG. 7 depicts stacked gate memory cell 710, which is another type of flash memory cell. Memory cell 710 is similar to memory cell 210 of FIG. 2, except that floating gate 20 extends over the entire channel region 18, and control gate terminal 22 (which here will be coupled to a word line) extends over floating gate 20, separated by an insulating layer (not shown). Programming is performed using hot electron injection from channel 18 to floating gate 20 in the channel region next to the drain region 16, and erasing is performed using by Fowler-Nordheim electron tunneling from floating gate 20 to substrate 12. The read operations operate in a similar manner to that described previously for memory cell 210.
Table No. 4 depicts typical voltage ranges that can be applied to the terminals of memory cell 710 and substrate 12 for performing read, erase, and program operations:
TABLE No. 4Operation of Flash Memory Cell 710 of FIH. 7CGBLSLSubstrateRead 1  0-5 V0.1-2 V  0-2 V   0 VRead 2  0.5-2 V  0-2 V2-0.1 V   0 VErase   −8 to FLTFLT  8-10 V/−10 V/0 V15-20 VProgram  8-12 V  3-5 V/   0 V/   0 V  0 V 3-5 V
"Read 1" is a read mode in which the cell current is output on the bit line. "Read 2" is a read mode in which the cell current is output on the source line terminal. Optionally, in arrays comprising rows and columns of memory cells 210, 310, 410, 510, 610, or 710, source lines can be coupled to one row of memory cells or to two adjacent rows of memory cells. That is, source line terminals can be shared by adjacent rows of memory cells.
FIG. 8 depicts twin split-gate memory cell 810. Twin split-gate memory cell 810 comprises a pair of memory cells (A on the left and B on the right), wherein each of the memory cells comprise a floating gate (FGA, FGB) 20 disposed over and insulated from the substrate 12, a control gate 28 (CGA, CGB) disposed over and insulated from the floating gate 20, an erase gate 30 (EG) disposed adjacent to and insulated from the floating and control gates 20/28 and disposed over and insulated from the substrate 12, where the erase gate is created with a T shape such that a top corner of each control gate CGA, CGB faces the respective inside corner of the T shaped erase gate to improve erase efficiency, and a drain region 16 (DRA, DRB) in the substrate adjacent the floating gate 20 (with a bit line contact 24 (BLA, BLB) connected to the respective drain diffusion regions 16 (DRA, DRB). The memory cells are formed as pairs of memory cells sharing a common erase gate 30. This cell design differs from that the memory cells discussed above with reference to FIGS. 2-7 at least in that it lacks a source region under the erase gate EG, lacks a select gate (also referred to as a word line), and lacks a channel region for each memory cell. Instead, a single continuous channel region 18 extends under both memory cells (i.e. extends from the drain region 16 of one memory cell to the drain region 16 of the other memory cell). To read or program one memory cell, the control gate 28 of the other memory cell is raised to a sufficient voltage to turn on the underlying channel region portion via voltage coupling to the floating gate 20 there between (e.g. to read or program cell A, the voltage on FGB is raised via voltage coupling from CGB to turn on the channel region portion under FGB). Erasing is performed using Fowler Nordheim electron tunneling from floating gate 20A and/or floating gate 20B to erase gate 30. Programming is performed using hot electron injection from channel 18 to floating gate 20.
Table No. 5 depicts typical voltage ranges that can be applied to the terminals of memory cell 810 for performing read, erase, and program operations. Cell A (FG,CGA,BLA) is selected for read, program, and erase operation
TABLE No. 5Operation of Flash Memory Cell 810 of Figure 8CGABLAEGCGBBLBREAD1.5-4 V0.1-0.8 V2.5 V    1.5-4 V0ERASE   0 V to    0 V  8 V to0 V to 4 V0 V  8 V11.5 V (Vcginhe)PROGRAM 110.5 V  4.5 V1.5 V     4IprogPROGRAM 2   4 V to    0 V  −4 V to     0 V0 V  8 V−8 V  to −2 V(Vcginhp)
In order to utilize the memory arrays comprising one of the types of non-volatile memory cells described above in an artificial neural network, in one embodiment, two modifications are made. First, the lines are configured so that each memory cell can be individually programmed, erased, and read without adversely affecting the memory state of other memory cells in the array, as further explained below. Second, continuous (analog) programming of the memory cells is provided.
Specifically, the memory state (i.e. charge on the floating gate) of each memory cell in the array can be continuously changed from a fully erased state to a fully programmed state, independently and with minimal disturbance of other memory cells. In another embodiment, the memory state (i.e., charge on the floating gate) of each memory cell in the array can be continuously changed from a fully programmed state to a fully erased state or from a fully erased state to a fully programmed state, independently and with minimal disturbance of other memory cells. This means the cell storage is analog or at the very least can store one of many discrete values (such as 16 or 256 different values), which allows for very precise and individual tuning of all the cells in the memory array, and which makes the memory array ideal for storing and making finely tuned synapsis weights of the neural network.
The methods and means described herein may apply to other non-volatile memory technologies such as FINFET split gate flash or stack gate flash, SONOS (silicon-oxide-nitride-oxide-silicon, charge trap in nitride), MONOS (metal-oxide-nitride-oxide-silicon, metal charge trap in nitride), ReRAM (resistive ram), PCM (phase change memory), MRAM (magnetic ram), FeRAM (ferroelectric ram), OTP (bi-level or multi-level one time programmable), and CeRAM (correlated electron ram), without limitation. The methods and means described herein may apply to volatile memory technologies used for neural network such as SRAM, DRAM, and other volatile synapse cells, without limitation.

Analog neural memory array storing synapsis weights in differential cell pairs in artificial neural network


When a recess is formed in a SiCOH film, C is removed from the film to form a damage layer. If the damage layer is removed by hydrofluoric acid or the like, the surface becomes hydrophobic. By supplying a boron compound gas, a silicon compound gas or a gas containing trimethyl aluminum to the SiCOH film, B, Si or Al is adsorbed on the SiCOH film. These atoms bond with Ru and a Ru film is easily formed on the SiCOH film. The Ru film is formed using, for example, Ru3(CO)12 gas and CO gas. Copper is filled in the recess and an upper side wiring structure is formed by carrying out CMP processing.

In a process of forming a multilayer wiring structure of a semiconductor device, the following process is performed. For example, a SiCOH film that is a low dielectric constant film made of silicon (Si), carbon (C), hydrogen (H) and oxygen (O) is formed as an interlayer insulating film on a substrate, and a recess including a trench and a via hole is formed in the interlayer insulating film. Then, copper (Cu) is filled in the recess to form an upper layer side wiring connected to a lower layer side wiring. Further, in order to prevent copper from diffusing into the interlayer insulating film, for example, tantalum (Ta), tantalum nitride (TaN) or a laminated film thereof is used as a so-called barrier film between the copper wiring and the interlayer insulating film. In addition, titanium (Ti), titanium nitride (TiN) or a laminated film thereof is known as a barrier film.
When miniaturization of the line width of a copper wiring is advanced along with miniaturization of a pattern of a semiconductor device, an increase in wiring resistance or electrode resistance (via resistance) in a via hole affects the performance of the semiconductor device. In order to reduce the resistance of conductive paths (wiring and electrode), it is important to increase the volume of copper, to reduce the thickness of an adhesion layer or a barrier layer of the bottom of the via hole, and to suppress the via resistance by reducing the number of interfaces.
However, in the case of using the above-mentioned materials as a barrier film, when the line width of the recess is fine and an aspect ratio of the recess increases, the filling characteristics become poor. Also, it is disadvantageous that the resistance of the material itself is large.
From this point of view, the use of Ru with a small resistance and good filling characteristics, instead of the above-mentioned materials, as a barrier film has been proposed in U.S. Application Publication No. US2008/237860A1 (FIG. 1). FIGS. 22A to 22E are diagrams showing a process of forming the copper wiring in the case of using Ru as a barrier film. First, after a recess 2 including a trench and a via hole is formed in an interlayer insulating film (SiCOH film) 1 of the upper layer side (FIG. 22A), a base film 3 such as Ta or TaN described above is formed in the recess 2 (FIG. 22B), and a Ru film 4 is formed on the base film 3 (FIG. 22C). Then, copper (filling material made of copper) 5 is filled in the recess 2 (FIG. 22D), and excess copper 5 is removed by chemical mechanical polishing (CMP) to form a wiring structure of the upper layer side (FIG. 22E). Reference numerals 61 to 63 denote an interlayer insulating film, a copper wiring and a barrier layer, respectively. Reference numeral 64 denotes an etching stopper film (which performs a stopper function during etching) having a function of preventing diffusion of copper.
The reason that the base film 3 is interposed between the interlayer insulating film 1 and the Ru film 4 is as follows. In the SiCOH film that is the interlayer insulating film 1, bonds in the film are cut off by a plasma during etching or asking and C is eliminated from the film. Then, moisture or the like in the atmosphere is coupled to the dangling bonds generated by the elimination of C to form Si—OH. Thus, a surface portion becomes a damage layer. Since the content of C decreases in the damage layer, the relative permittivity increases. For this reason, the surface portion is removed by, for example, hydrofluoric acid. Thus, the surface state of the interlayer insulating film 1 immediately before the barrier film is formed becomes hydrophobic.
Meanwhile, since Ru has large Gibbs free energy of oxide formation, Ru is difficult to bond with O of the SiCOH film. Thus, a thin base film 3 made of Ta or the like and having small Gibbs free energy of oxide formation is thinly formed before the formation of the Ru film 4. In this case, since the Ru film 4 is used as a barrier film, it is less affected by high resistance or poor filling characteristics of the base film 3. However, since the base film 3 is interposed, in addition to the Ru film 4, between copper of the lower layer side and copper of the upper layer side at the bottom of the via hole, it is demanded to reduce the resistance of the conductive path, and further improvements are desired.
Further, in Japanese Patent Application Publication No. 2005-347472 (FIGS. 1 and 3), there is described a problem that when a SiCOH film is plasma etched, a portion of the film is bonded to a recess to generate nucleation of a seed such as methyl group or the like, and the film quality deteriorates when a barrier film is formed in this state. In order to solve this problem, there has been proposed a technique in which the SiCOH film is processed by a hydrogen plasma to remove methyl groups or the like on the surface of the recess and the bonds are terminated with H atoms. In this technique, the surface of the recess to be processed is hydrophilic, and this technique differs from the technique of the present invention.
In addition, in J. Vac. Sci. Technol. A 26(4), July/August 2008 pp. 974-979, there is described a method of forming amorphous alloy of Ru and phosphorus (P) on an insulating film directly without using a base film by chemical vapor deposition (CVD). However, it has also been demonstrated that the adhesion strength of Ru atoms at the interface of Cu is inferior to Cu—Ru bonds of a crystalline structure due to interposed P atoms.

Method for manufacturing semiconductor device


A method of temperature control for maintaining actual temperature at a set point uses a learning period from which to acquire parameters that are used to control temperature. The method defines a learning period as one complete oscillation of the actual temperature about the set temperature. During such an oscillation period, the actual temperature will have been exclusively above and below the set temperature for one segment each. The invention provides a method for adjusting a variable in order to maintain a process measurement at a predetermined constant value, the method defining a sample period, wherein the sample period is a period of time represented by a complete oscillation of the process measurement about the predetermined constant value and wherein the complete oscillation includes a first time period during which the adaptable measurement is continuously above the predetermined constant value and a second time period during which the adaptable measurement is continuously below the predetermined value and wherein the first time period and second time period occur substantially sequentially.

1. Field of the Invention
The present disclosure relates generally to a method for controlling temperature. More particularly, the invention relates to an adaptive feed forward method for PID temperature control in the context of a smoker controller. The inventive method improves temperature control performance by adjusting feed forward parameters depending on smoker controller output and process response over time.
2. Description of the Related Art
A PID controller, also known as a proportional-integral-derivative controller, provides a versatile feedback compensator structure that improves system performance. A PID controller is a control loop feedback mechanism commonly used in industrial control systems. A PID controller continuously calculates an error value as the difference between a measured process variable and a desired set point. A PID controller responds to error signals and attempts to correct errors where the system over or undershoots a set point. Thus, the controller attempts to minimize the error over time by adjustment of a control variable. The set point is where you would like the measurement to be. Error is defined as the difference between set point and measurement.Error=Set Point−Measurement
The variable being adjusted is called the manipulated variable, which usually is equal to the output of the controller. Thus, the output of PID controllers will change in response to a change in measurement or set point.
PID controllers are designed to eliminate the need for continuous operator attention. For instance, cruise control in a car and a house thermostat are common examples of how controllers are used to automatically adjust some variable to hold the measurement (or process variable) at the set point.
In a closed loop system, the tracking error is the difference between the desired input value and the actual output value. Typically, the value of the tracking error will be sent to the PID controller, and the controller computes both the derivative and the integral of the tracking error. The control signal is equal to the proportional gain multiplied by the tracking error plus the integral gain multiplied by the integral of the error plus the derivative gain multiplied by the derivative of the error.
A proportional controller will have the effect of reducing the rise time and will reduce but never eliminate the steady state error.
An integral controller will have the effect of eliminating the steady-state error for a constant or step input, but it may make the transient response slower.
A derivative controller will have the effect of increasing the stability of the system, reducing the overshoot, and improving the transient response.
The proportional, integral and derivative parameters of a PID controller can be modified or tuned to deal with specific process requirements.
In the framework of a PID controller, P (proportional gain) accounts for the present values of the error. That is the variance between the set point and the current process temperature. For example, if the error is large and positive the control variable will be large and negative). I (integral gain) accounts for past values of the error. That is, the previous variance from the set point. For example, if the output is not sufficient to reduce the size of the error, the control variable will accumulate over time, causing the controller to apply a stronger action. D (derivative gain) accounts for possible future values of the error, based on its current rate of change. That is, the predicted future variance based on previous and current variance.
Adaptive control is the method used by a controller that adapts to a controlled system with parameters that vary, or are initially uncertain.
It is noted that the temperature indicated on the controller display is only the temperature measured by the temperature sensor and may not be a true indication of the actual temperature. In the context of temperature control, having an accurate temperature measurement and the ability to maintain a constant temperature whether using a barbecue, a batch oven or continuous oven is key to successful and quality temperature control.
Thus, process and temperature controllers provide useful tools to maintain the actual temperature at a set point despite disturbances that may vary the temperature from the ideal set point. Process and temperature controllers are powerful process control tools that take a signal from a temperature device, such as a thermocouple or other sensor and maintain a set point using an output signal.
It is known to control temperature using an adjustment input. U.S. Pat. No. 5,099,442 to Furuta et al. discloses a temperature control apparatus of a learning type for a furnace that runs repetitively with a certain operating pattern of temperature change with time. The apparatus has a dual system model with respect to an enlarged system consisting of the furnace and its controller. For each cycle of the repetition of the certain operating pattern, adjustment input is calculated by using the dual system model and the error between the preset temperature values for the pattern and the actual inside temperatures of the furnace which adjustment input is applied to the enlarged system to cause the inside temperatures to track the preset temperature values. After each cycle of operation, the adjustment input is renewed using the latest value of the above error.
U.S. Pat. No. 4,193,320 (to Sato et al.) teaches a system and method for the adaptive control of a process in which a feed forward control signal corresponding to a process demand is calculated according to a predetermined algebraic function, while a feedback correction signal is calculated on the basis of an error of a process feedback signal indicative of an error of a controlled variable from a predetermined setting, and the controlled variable of the process is controlled on the basis of the sum of these two signals. The adaptive control is such that, when a set point of the function deviates from the actual process demand, a value corresponding to the error appears in the feedback correction signal, and this value is used for automatically modifying the function itself to ensure the adaptive control of the process. A determination is made whether or not the process is in the steady state and when steady state operation is determined, the function of the feed forward control signal is modified.
In the context of a smoker controller, it is desirable to achieve precise temperature control. Thus it is desirable to implement an improved temperature control method using an improved adaptive feed-forward method with a PID temperature controller for regulating temperature control.

Adaptive feed forward method for temperature control


A mop head made from a plurality of fibers of polyvinyl alcohol that are only water soluble at temperatures above 37.degree. C., where the fibers are formed into a mop head. A disposable cleaning rag made from at least one layer of a plurality of fibers of polyvinyl alcohol that are only water soluble at temperatures above 37.degree. C., wherein the fibers are formed into a disposable cleaning rag.

1. Field of the Invention
The present invention relates to the medical and cleaning product fields. In particular, the present invention provides a disposable article, such as a mop head or a rag, which may be disposed of after use and methods for the use and disposal of the articles.
2. Background
Hospital patient care generates considerable quantities of infectious medical waste in primary and acute care facilities. There has been a general conversion from reusable, cleanable items, to disposable items over the last three decades. These conversions were made to promote antiseptic techniques in patient care and to decrease the potential for cross-infections between patients, staff and the general public. Recent federal and state government regulations such as the Medical Waste Tracking Act of 1988 and OSHA Medical Facility rules have resulted in a substantial increase in medical waste that must be classifed as "infectious."
When a patient is admitted to a hospital, the patient produces approximately 55 pounds of medical waste per day. Approximately 20% of this waste is infectious. The current stated objective of the American Hospital Association and the Centers for Disease Control is to treat medical waste as soon as it is generated. Both organizations recognize that medical waste is primarily an occupational hazard for health care workers and not an environmental problem. The best way to handle infectious medical waste is to disinfect it at the point of generation and dispose of the treated medical waste with minimum on premises handling and storage. The need for an effective way to dispose of medical waste has been highlighted by the amendment made to 29 C.F.R. 1910.1030 which provides for the federal regulation under the Occupational Safety And Health Act, 29 U.S.C. 655, 657 to control bloodborne pathogens. Specifically, the Act calls for the establishment of an exposure control plan, the containment of specimens of blood or other potentially infectious materials and the general tightening of precautionary measures to minimize the spread of disease. A safe and effective way to dispose of hospital waste would greatly facilitate compliance with the above-referenced Act.
As a result, consumption of medical disposable woven or non-woven products has been growing at a rate of approximately 10% a year. In 1988, sales totaled approximately 1.155 Billion Dollars. It is projected that as of the end of 1996, sales of medical disposable non-woven products will have exceeded two and a half billion dollars. In the United States, there are at least 30 million surgical procedures performed each year. After each surgical procedure, it is necessary that the operating theater be disinfected before a new procedure is performed to minimize any exposure the patients may bring to other patients or staff. This is particularly important in light of today's increasingly stringent regulations regarding occupational exposure to blood and bodily fluids.
One of the most basic operations that is performed in the surgical theater as well as in the clinical environment, generally, is the mopping of floors. Fundamentally, cleaning a floor is perhaps one of the most hazardous duties in the hospital because likely infectious material will reside in the floor in the form of spills, splashes, drips or general runoff of potentially hazardous fluids such as blood, bodily liquids and irrigation products which are presently involved in virtually all operating procedures. Currently, floors are cleaned by employing conventional tools such as mops. It is a common practice in today's surgical venues or hospitals' surgical centers that conventional mops are used once and either disposed of via landfill or incineration or are washed, dried, sterilized and reused. It is practically impossible to clean a used mop head to remove all of the pathogens, infectious materials, needles, and other sharp objects that are caught in the interstices of the yarn constituting the mop itself. Cleaning the mop leads to considerable opportunity for additional hazardous exposure to people that are employed to clean the mops after they are used. Furthermore, conventional mops, when disposed of either through landfill or incineration, provide ample opportunity for reinfection.
In addition, the use of hand-held cleaning articles, such as rags presents a similar, if not heightened danger to the person using the rag.
Thus, there exists a need for a suitable cleaning article, such as a mop head or a rag, capable of being disposed of after use while avoiding additional burdens being placed upon landfills and other disposal sites. There is also a need to provide a disposable cleaning article, such as a mop head or a rag, which, after use, can be solubilized and substantially sterilized in a single operation.


An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the chip and the base. The chip is electrically connected to interconnects of the base. The adhesive pads are partitioned in a regular distribution over the entire surface area of the chip. A molding compound surrounds the chip and is disposed in the intermediate space between the chip and the base.

In the case of BGA (Ball Grid Array) or FBGA (Fine Ball Grid Array) packages, problems occur with respect to module reliability, in particular under exposure to changing temperatures. The reason for this can be seen in the different materials used and the resultant different coefficients of expansion, which, although reduced by appropriate material selection, cannot be eliminated.
In addition, the materials used, such as the molding compound, the substrate, the adhesives, etc., absorb water vapor from the surroundings, which depends in part on the ambient conditions and also on the storage times. This causes thermal stresses and stresses induced by the water vapor to occur between the individual components (chip, substrate, molding compound, solder balls). It is possible, that the forces acting on individual interfaces between the materials will reach critical values, which may lead to crack formation and partial or complete delamination (e.g., popcorning) of the package.
In detail, the package contains a chip, for example with at least one central row of bonding pads, the chip being attached on a substrate by means of an adhesive or else a tape (adhesive strip). The substrate, for example a single-layer or multi-layer glass fiber laminate, also referred to as a PCB (Printed Circuit Board), is provided on the side facing away from the chip with solder balls, which are mounted on contacts on the substrate. These contacts are electrically connected by means of interconnects to bonding islands, which are arranged laterally next to a bonding channel in the substrate. The electrical connection of the bonding pads on the chip to the bonding islands on the substrate takes place by wire bridges, which are drawn through the bonding channel. This bonding channel is sealed with a sealing compound after the electrical connections have been established. Furthermore, the chip side is enclosed by a molding compound, which also partly covers the substrate in order to protect the back side and the sensitive chip edges.
Substrate-based BGA packages of this type are usually constructed in such a way that the adhesive area provided for the chip mounting is aligned in a way corresponding to the chip size, in order to ensure secure attachment of the chip on the substrate. In this case, there are different versions with a slight adhesive set-back or projection with respect to the chip.
Particularly disadvantageous in the case of these substrate-based packages is the fact that the adhesive in particular (D/A material) and also the substrate can absorb a relatively large amount of moisture, with the result that the finished package only has a limited reliability, and at present it is usually only possible to achieve MSL3, that is Moisture Sensitivity Level 3. This means that, before soldering with a lead-free solder, the package first has to be heat-treated for a longer time at temperatures around 120° C. in order first to remove the moisture present in the package.
The aim is therefore to achieve Moisture Sensitivity Level 1, at which the package can be immediately soldered right away, without a so-called popcorn effect and resultant detachment of the molding compound and/or the chip from the substrate having to be feared.
In order to achieve favorable conditions here, a composition for an adhesive film that has a particularly high heat resistance and high resistance to moisture absorption is described in U.S. Patent Application Publication 2002/0159773 A1.
Furthermore, Japanese Patent Publications JP 243180/1985 and JP 138680/1986 disclose a printed circuit board material with improved vapor resistance, in which acrylic and epoxy adhesives and also urethane adhesive are used together with an inorganic filler.
However, these measures are not adequate to achieve MSL1. This is caused by the continuing high proportion of D/A material within the package, which can absorb a great amount of water in comparison with the molding compound. The consequence is the so-called popcorn effect, i.e., significant delamination after the preconditioning (storage in humid conditions and simulation of soldering).
The aforementioned problem is countered by a solution according to German Patent Publication DE 101 33 361 C2. In this document, it is proposed that the chip should not be adhesively attached to the substrate over its full surface area but that instead adhesive webs, adhesive strips or adhesive spots should be applied to the carrier substrate to form an adhesive layer, the adhesive consisting of a thermosetting adhesive. In this way, the chip is mounted on the carrier substrate with an intermediate space between the chip and the carrier substrate. However, an adhesive of this type is, by its nature, not yet mechanically stable. Solidifying of the adhesive spots, and with it mechanical stability, is only achieved by introducing a molding compound into the intermediate space between the chip and the carrier substrate and subsequent heating of this molding compound to a temperature which lies above the setting temperature of the adhesive. This does in fact reduce the use of adhesive under the chip; however, there are problems with coplanarity between the chip surface and the carrier substrate. This is so because, until the adhesive layer has set, it is still mechanically movable. If a displacement of the surface of the chip then occurs as a result of filling with the molding compound or other mechanical influences, this surface is no longer planar in relation to the carrier substrate. This is of considerable disadvantage for the subsequent processing processes. In particular, coplanarity is required for the construction of stacks, i.e., a stack of semiconductor chips.
In a similar way, the application of a layer of elastomer material to a substrate is disclosed in PCT Publication WO 01/09939 A1. This layer is pressed onto the substrate in the form of a film. After that, the semiconductor chip is pressed onto the film. Finally, the structure created by it is exposed to a relatively high temperature, to ensure that the semiconductor chip is firmly connected to the substrate. Here, on the one hand, it is likewise not ensured that surface displacements, and with them a risk to coplanarity, will not occur nevertheless when the chip is pressed onto the film. On the other hand, it is always necessary that the processes of applying an adhesive film and positioning a semiconductor chip on the carrier substrate are in close proximity in space and time. This virtually rules out fabrication in the wafer assembly, for instance.

Method for mounting a chip on a base and arrangement produced by this method


An apparatus, method and system for applying a liquid coating on an elongated work piece. One example is an arrow shaft. The apparatus comprises a body with a wiper on or in the body. A mounting interface allows the body to be mounted on a support, which in one example is the top of a can holding the liquid to be applied. An excess amount of liquid is applied to the work piece (e.g. by dipping an end or other application of the liquid to a location along the work piece, and the work piece is then moved past the wiper such that the wiper wipes the liquid on the work piece but gathers excess liquid for substantially even coating of the liquid along the work piece.

A. Field of the Invention
The present invention relates to an apparatus, method, and system for applying liquid coatings to elongated members such as arrow shafts and analogous pieces.
B. Problems in the Art
A variety of situations exist where it is desirable to apply a coating of liquid to an elongated object. A typical method of application is to use a brush, sponge, or cloth as an applicator. The applicator is dipped into the container of liquid. The worker holds the work piece (elongated member) in one hand and applies the liquid from the applicator along the work piece.
This presents well-known issues. One is uniform or consistent application of the liquid. Such is very dependent on the care or skill of the worker, and the effectiveness of the applicator. Results can easily be inconsistent or poor. Some application techniques use much more liquid than required and thus is wasteful. Some techniques over-apply to try to ensure full coverage. But over-application can not only waste liquid but could detrimentally affect operation of the work piece. Some techniques do not economically or efficiently transfer the liquid from the applicator to the member. For example, not all of the liquid on a brush or cloth is transferred to the member being coated. It is hard to use all the liquid from the applicator. It is also hard to recover unused liquid from the applicator.
Another issue is over-spill and clean-up. Typically, relevant liquids are packaged and stored in cans with removable lids. If brushes, sponges, or cloths are used as applicators, excess liquid on the applicator can be wiped off along the can top lip. But some can spill or drip down the side and/or some can be caught in the groove or channel around the top lip of the can. There can also be drips, over-spill, and splatters when applying liquid to the work piece. This also leads to the issue of clean-up. It takes time to clean-up. There are also disposal issues. Brushes, sponges and cloth either need to be washed out or cleaned up, if even possible, or disposed of.
Sometimes the work piece is mounted in some sort of holder like a clamp, work bench vice, or the like. This too presents issues because the part of the work piece being held in the clamp or vice cannot be coated. This could take extra steps.
These types of issues can be further appreciated with reference to a specific type of work piece. Some people like to construct their own arrows for hunting or target purposes. They must provide an elongated arrow shaft and then either create or add a tip or point on one end and the nock on the other, and then later add the fletching or vanes towards the nock end of the shaft. While some shafts are left without any finishing on the outer surface, many arrow makers want to finish them with some sort of coating. Examples would be protective coating, a stain, a lacquer, or paint. This might be desirable along the entire shaft or only a portion thereof. For example, some would want a color over just a section of the length of the shaft. This is sometimes called capping or cresting.
Attempts have been made to improve arrow shaft coating. One example is a dip tube, an elongated tube that must be filled with the liquid. A rubber gasket or grommet with a center opening about the same diameter as the arrow shaft is clamped across the top of the dip tube. The arrow shaft is inserted through the gasket and down into the liquid in the tube the length to be coated. For a whole shaft, the tube must be on the same order of length as the shaft. The shaft is then removed from the tube. The gasket stops excess liquid from moving past the gasket and leaves a coating of liquid on the shaft. The process can be repeated for as many coats of the liquid as desired. Some of the liquids used dry quite quickly (e.g. 15 seconds), so several coats (e.g. three is a typical number) can be finished in several minutes. Several examples of dip tubes and gaskets can be commercially purchased and are available from 3Rivers Archery Supply, Inc., Ashley, Ind. USA (see information regarding the same at: www.3RiversArchery.com/Arrow+Building+Tools+Dip+Tubes_c52_s8_p29_thumb.html).
However, dip tubes require the dip tube to be filled prior to coating. For a full shaft dip tube this can mean sometimes 1 and ½ pints must be poured from the can(s). The can(s) is/are then typically resealed (e.g. lid secured back on the can). Then the worker must return to the dip tube and the gasket must be clamped in. Then the arrow must be guided through the gasket down into the tube, and then withdrawn. Once done, the can lid must be removed again, the excess liquid in the dip tube must be poured back into the can(s) and the items cleaned up for storage. This can be time-consuming and somewhat cumbersome. It can also be wasteful of the liquid.
It would be beneficial and an improvement to provide a way to improve the efficiency, economy, and other aspects of coating arrow shafts. It would be beneficial to deter over-application, spillage, loss of liquid, and uneven application. These issues apply whether one arrow shaft is coated or a batch of them are coated. The issues apply to other work pieces.
Room for improvement in coating elongated work pieces has therefore been identified.

Apparatus, method, and system for applying liquid coating to elongated members including arrow shafts


Prosthetic heart valves, which are collapsible to a relatively small circumferential size for less invasive delivery into a patient and which then re-expand to operating size at an implant site in the patient, include a collapsible/expandable stent-like supporting structure and various components of flexible, sheet-like material that are attached to the supporting structure. For example, these sheet-like other components may include prosthetic valve leaflets, layers of buffering material, cuff material, etc. Improved structures and techniques are provided for securing such other components to the stent-like supporting structure of the valve.

Current collapsible prosthetic heart valve designs are for use within patients who may need a valve replacement (e.g., an aortic valve replacement), but who are not treated adequately by other means. A collapsible prosthetic heart valve is designed to be delivered into the patient in a collapsed condition via tube-like delivery apparatus. In the collapsed condition the valve has a reduced annular, radial, or circumferential size. Delivery of the valve into the patient can be less invasive than traditional open-chest/open-heart surgery. When the valve reaches the intended implant site in the patient, the valve re-expands or is expanded (e.g., balloon expanded) to operating size. The collapsing and re-expansion of the valve are preferably elastic, but may alternatively be plastic, the result of shape-memory properties of certain components of the valve, or various combinations of elastic, plastic, and/or shape-memory. Again, plastic expansion may be as a result of inflation of a balloon that is temporarily disposed inside the valve. Known designs of this general kind can be implanted percutaneously, trans-apically, or surgically, with or without resected and/or debrided native heart valve leaflets.


A display panel, an operation control method thereof and a display device for improving users' experience of display products. Wherein the display panel comprises a flexible substrate (1) and a sensor control circuit (3) and a sensitive element (4) provided on the flexible substrate (1), the sensor control circuit (3) is connected to the sensitive element (4), and a sensitive parameter of the sensitive element (4) varies with the bending degree of the flexible substrate (1) so that a detected signal passing through the sensitive element (4) varies with the bending degree of the flexible substrate (1); the sensor control circuit (3) includes a signal generating circuit for inputting the detected signal into the sensitive element (4), and a feedback circuit for converting the detected signal passing through the sensitive element (4) into a feedback signal indicating the bending degree of the flexible substrate (1) and for sending it to a control system connected to the display panel, so that the control system performs corresponding control operations in accordance with the feedback signal.

A flexible display panel which is made of flexible materials and thus can be bent, has become one of the most popular trends in the field of display technology, since it can meet users' higher demands for product experiences. However, in the prior art the operations on the display function of the flexible display panel (such as zoom-in and zoom-out of images, the opening and closing of programs, page flipping, etc.) are mainly performed by the user pressing control keys corresponding to the function or by the corresponding touch operation. With the development of the display technology, these operations have been unable to meet the users' demands for the product experience.

Display panel and operation control method thereof, and display device


Manufacturers test printed circuit boards (PCB) to ensure that all components have been soldered to the correctly. Some tests cause the boards to deflect, which can damage component-to-board interfaces (i.e., solder joints) or components. Embodiments of the present invention measure the amount of PCB deflection before, during, and after the PCB is subject to mechanical load using photoelectric amplifiers, which send and receive light beams to targets mounted on the PCB surface through optical fibers and lenses mounted in a head assembly. The intensity of received light beams are proportional to analog voltages output by the photoelectric amplifiers and to the distance between the head assemblies and the targets. A data acquisition system converts the analog voltages to digital voltages and a software interface correlates the digital voltages to PCB deflection/displacement. A GUI displays deflection before, during, and after the PCB is subject to mechanical load.

1. Field
Embodiments of the present invention relate to board handling equipment and in particular to board handling equipment for handling printed circuit boards with surface mounted integrated circuits.
2. Discussion of Related Art
When products are sold to original equipment manufacturers (OEMs) the products are usually accompanied by specifications. The specifications typically include acceptable operating conditions, connection recommendations, direct current (DC) specifications, alternating current (AC) specifications, etc. The product is commonly warranted to perform according to the specifications.
Product manufacturers perform certain tests to guarantee the product complies with the specifications. For example, manufacturers of printed circuit boards (PCB) with soldered components test the electrical connections throughout a board to ensure that all components have been soldered to the board correctly. Some tests require boards to be plugged in and removed from connectors repeatedly. The equipment used for these and other tests exert a significant amount of force on the board. The testing equipment can twist and bend the board as well.
When the force on the board is not well distributed or when the board is not well supported the board may be subject to deflection. As the board deflects, component-to-board interface (i.e., solder joints) can become damaged or the components can become damaged. If the board passes its testing and upon removal from the board handling equipment a component becomes damaged or the solder joints open, for example, the manufacturer would likely ship the board to customers without knowing that the board is defective. The shipped, defective board could cause intermittent problems in computer systems, which are difficult to isolate and repair. In some instances, the board may not function at all. As technology advance and components become more delicate, the likelihood of damaging components or compromising solder joints increases.

Board deflection metrology using photoelectric amplifiers


A container is provided. The container includes multiple sidewalls extending in a substantially vertical direction and a bottom wall. The bottom wall includes a central portion, a first curved portion and a second curved portion. The first curved portion includes a first radius of curvature with a first center of curvature located on a first side of the bottom wall of the container, while the second curved portion terminates at the sidewalls and include a second radius of curvature with a second center of curvature located on a second side of the bottom wall of the container. The container further includes multiple reinforcing ribs located on the second side, each of the reinforcing ribs having a minimum height proximate the first curved portion and a maximum height proximate the second curved portion.

The present disclosure relates generally to injection molded containers and more particularly to an injection molded container with a reinforced bottom. Containers for industrial products or consumer goods often undergo rigorous testing to ensure the safety of the products enclosed in the containers as well as the users handling the containers. For example, a common series of drop tests may require a container to withstand a drop from a height of 18 inches or more at a variety of temperatures (e.g., 35° F., room temperature, 145° F.) without damage. At the same time, product manufacturers desire the use of in-mold labeling techniques to create attractive and eye-catching containers for their products. A container optimized for both in-molding labeling and rough handling conditions would therefore be useful.


The present disclosure discloses a display substrate, a display panel, and a display device. The display substrate includes: a base, and a device layer and an insulation layer on the base. The base includes a display area and a non-display area located on a peripheral side of the display area. At least one blocking dam is provided in a portion, located on the non-display area, of the insulation layer, and each blocking dam corresponds to an edge portion of one side edge of the base. In each edge portion of a side edge corresponding to a blocking dam, the blocking dam includes a plurality of blocking strips arranged along an extension direction of the side edge, an extension direction of each blocking strip is perpendicular to the side edge, and each blocking strip has a zigzag structure extending along a direction perpendicular to the side edge.

In the related art, after a screen is cut to form a plurality of panels, cracks caused by external force will occur to the panels when they are taken, placed and transferred. At present, in order to prevent cracks from occurring and expanding, several blocking structures (as shown in FIG. 1) parallel to the edges of the panels are usually set in interlayer insulation layers and gate insulation layers, but product analysis results show that there are still many cracks generated, and some cracks even penetrate all the blocking structures and affect the panel display.

Display substrate, display panel and display device

Chengdu BOE Optoelectronics Technology Co., Ltd.