A system, method and apparatus for taking a Raman spectrum of a sample is disclosed. In one embodiment, for example, an integrated Raman spectrometer is provided. In another embodiment, a portable Raman spectrometer is provided. In another embodiment, a Raman spectrometer is provided comprising a collimated beam tube for transmitting excitation radiation to an external optical system, such as a microscope, a telescope or a camera lens. In another embodiment, a method for correcting a Raman spectrum for background interference is provided. In yet another embodiment, a method for rejecting fluorescence in a Raman spectrometer is provided. A chemical reactor comprising a built-in Raman detector for monitoring a chemical reaction in a reaction chamber of the reactor is also provided.

Spectroscopy is a general term for the process of measuring energy or intensity as a function of wavelength in a beam of light or radiation. Many conventional spectrometers, and components comprising a spectrometer system, also referred to as an instrument, may include basic features and components such as a slit and a collimator for producing a parallel beam of radiation, one or more prisms or gratings for dispersing radiation through differing angles of deviation based on wavelength, and apparatus for viewing dispersed radiation. Spectroscopy uses absorption, emission, or scattering of electromagnetic radiation by atoms, molecules or ions to qualitatively and quantitatively study physical properties and processes of matter.
Light or radiation directed at a target, or sample of physical matter, during operation of a spectrometer system may be referred to as incident radiation. Redirection of incident radiation following contact with a sample of physical matter ("sample") commonly is referred to as scattering of radiation. To the extent that atoms or molecules in a sample absorb all or a portion of incident radiation, rather than reflect incident radiation, a sample may become excited, and the energy level of the sample may be increased to a higher energy level. Electromagnetic radiation, including incident radiation, that passes through a sample, may produce a small portion of light that is scattered in a variety of directions. Light that is scattered but continues to have the same wavelength as the incident radiation will also have the same energy, a condition often referred to as Rayleigh or elastically scattered light. Incident radiation that is scattered during a change of vibrational state in molecules may be scattered with a different energy, and such scattered light may be called Raman scattered light. Such phenomena have been used in conjunction with spectroscopy to qualitatively and quantitatively study physical properties and processes, including identification of chemical properties, compositions, and structures of a sample.
A wave associated with electromagnetic radiation may be described by wavelength, the physical length of one complete oscillation, and by frequency of the wave, the number of oscillations per second that pass a point. If incident radiation is directed at a sample, the wavelength of the incident radiation may remain substantially unchanged in scattered radiation. Alternatively, if incident radiation is directed at a sample, the wavelength in the scattered radiation may acquire one or more different wavelengths than the incident wavelength. The energy differential between the incident radiation and the scattered radiation may be referred to as a Raman shift. Spectroscopic measurement of Raman scattered light seeks in part to measure the resulting wavelength of such scattered light.
Raman scattered light may occur at wavelengths shifted from the incident light by quanta of molecular vibrations. The phenomenon of Raman scattered light, therefore, is useful in spectroscopy applications for studying qualities and quantities of physical properties and processes, including identification of chemical properties, compositions, and structure in a sample. Currently, Raman shift spectroscopic analytical techniques are used for qualitative and quantitative studies of samples. If incident radiation is used to scatter light from a sample, and scattered radiation data is measured, the scattered radiation may provide one or more frequencies associated with the sample, as well as the intensities of those shifted frequencies. The frequencies may be used to identify the chemical composition of a sample. If, for example, intensities are plotted on a Y-axis, and frequency or frequencies are plotted on an X-axis, the frequency or frequencies may be expressed as a wave number, the reciprocal of the wavelength expressed in centimeters. The X-axis, showing frequency or frequencies, may be converted to a Raman shift in wave numbers, the measure of the difference between the observed wave number position of spectral bands, and the wave number of radiation appearing in the incident radiation.
While these principles and phenomena are known, until recently efforts to apply the principles and phenomena to qualitative and quantitative analyses of samples have not always resulted in uniform, predictable results, or in acceptable levels of precision and accuracy of Raman spectra. Because of instrumentation variabilities, inherent weakness of a Raman scattered signal, fluorescence, and other limitations associated with spectroscopy instruments, the goal of producing a standard Raman spectrum for use in sample analyses was, until recently, a challenge not achieved by apparatus and methods known in the art.
At least one problem that had to be overcome was the fact that spectroscopic measurements of Raman scattered light seeking to measure wavelength or intensities, or both, of scattered light, could be affected by the instrument, or spectroscopic system, itself. A number of components of an instrument may contribute individually and collectively to undesirable instrumentation variabilities that affect spectral data measured by the instrument. Raman scattered radiation from a sample may be observed, measured, and directed through an instrument by optics of a spectrometer, may be coded by a device such as an interferometer, and may be directed to one or more detectors to record Raman spectra. Any one, or all, of such components of a conventional spectrometer system induced or contributed to instrumentation variabilities that reduced or adversely affected the precision and accuracy of measurements of Raman scattered light.
In addition to fluorescence, spectral measurements of a source of incident radiation such as a laser, including semiconductor or diode lasers, will evidence other varying baseline components, artifactual or real, that preferably could be eliminated, suppressed, or compensated for to provide an accurate Raman spectrum for analytical purposes. In instrumentation designs preferred by users of Raman technology, semiconductor diode lasers would be the choice of incident radiation due to small and compact sizing, low heat dissipation, and high energy conversion efficiency. Use of semiconductor or diode lasers, while useful because of a number of important characteristics, also engender unique problems that, if solved, would advance Raman technology. However, at least one other problem associated with semiconductor diode lasers is the tendency for the output to change from one frequency to another during operation, commonly referred to as frequency drift. Frequency drift is generally related to temperature variations that may cause either slow frequency drifts or drastic frequency changes. Semiconductor diode lasers also are susceptible to mode hops when the laser switches output from one frequency to a new preferred frequency.
Some of the problems associated with frequency shifts were discussed as early as 1991 in Semiconductor Diode Lasers Volume I, edited by William Streifer and Michael Ettenberg, IEEE Press (1991), a work incorporated by reference into this document. In general, frequency shifts, or mode hops, are inherent in laser light, and can be eliminated only by redesigning the laser at excessive cost. Solutions for overcoming the effects of frequency shifts have included redesign of the internal cavity of lasers, designing what is known as an external cavity for lasers, and tuning a range of modes into a single mode. All of those solutions are achieved at considerable expense, and generally shorten the useful life of a semiconductor laser.
A further problem related to diode lasers includes variations in output intensity that directly affect the measured Raman shift. Rather than eliminate the problem physically, which is expensive and limits the effective life of the laser, it would also be useful to compensate for the frequency shifts and intensity variabilities. Thus, it is at least an objective of the present invention to overcome problems associated with using excitation sources in the visible range of light, including, for example, removal of fluorescence and other common mode noise from acquired spectra. U.S. Pat. No. 6,281,971 issued to Allen et al., for example, attempts to solve problems related to frequency drift in semiconductor or diode lasers. The '971 patent, however, requires monitoring the laser output frequency and performing complex integration routines to obtain a Raman spectrum for a sample.
Raman scattering is a comparatively weak effect when compared with Rayleigh or elastic scattering. Nevertheless, Raman scattering offers a significant opportunity for qualitative and quantitative studies of physical properties and processes, including identification of chemical compositions and structure in samples of physical matter. To appreciate these phenomena, as well as understand the problems solved by the present invention, it should be noted that depending on the compound comprising a sample, only about one scattered photon in 10.sup.6-8 tends to be Raman shifted. Because Raman scattering, therefore, is such a comparatively weak phenomenon, an instrument used to disperse radiation for measurement purposes should have minimal stray light and be able to substantially reject Rayleigh scattering; otherwise, a Raman shift may not be measurable.
As earlier described, Raman phenomena result in spectral information that is shifted relative to the excitation source, or source of incident radiation. Thus, any variations in the excitation source will result in a relative change, or shift, in spectral information. Spectrally shifted Raman information also is directly related to the intensity of the excitation source. A further complication arises from multiple lines in the frequency of the source of incident radiation that may cause shifted, multiple sets of spectra from a sample. Therefore, conventional Raman experimentation discloses that a source or sources of incident radiation that causes or cause excitation in a sample used in connection with a spectrograph should be substantially monochromatic, preferably providing a single frequency or wavelength. Recognition that the source of incident radiation requires a substantially monochromatic frequency has led to use of a variety of laser light sources as a source of incident radiation because of the substantially monochromatic frequency and high intensity of a laser. Gas lasers such as helium-neon, helium-cadmium, argon-ion, krypton-ion, as well as solid state lasers including Nd-YAG, and diode lasers, solid state tunable lasers, liquid dye lasers, and other lasers, have been used.
An undesirable result of incident radiation on a sample occurs if a sample generates red shifted radiation as part of a radiation absorption process, a phenomenon commonly referred to as fluorescence. Fluorescence occurs when absorbed radiation is reduced in frequency by internal molecular processes and emitted as radiation that is closer to the red end of the visible light spectrum. Fluorescence sometimes may be strong enough in comparison with the Raman shift to swamp, or substantially eliminate, the weaker Raman signal. Fluorescence is a major interference for samples using excitation wavelengths in the visible region of the light spectrum, and has therefore made use of blue and green excitation sources problematic. Using excitation sources in the far end of the red end of the light spectrum mitigates the fluorescence effect, however, particularly in connection with silicon detectors, but substantially restricts use of instrument components that tend to provide radiation far into the infrared ("IR") region of the light spectrum.

Delta Nu a division of CC Technology, Inc.


Provided is a method and composition for reducing the rate of, and rendering more uniform the oxidation of alignment mark trench side walls by CMP slurry accumulating in an alignment mark trench during CMP processing. In a preferred embodiment, a nucleation layer of tungsten having an equiaxed grain structure with fine grain size and conformity is deposited over a conventionally applied bulk tungsten layer prior to commencing CMP operations. The fine grain size and equiaxed grain structure of this nucleation layer make it more resistant and more uniform in response to slurry attack. As a result, the tungsten trench profile remains a consistent and reliable alignment mark.

The present invention relates to the formation of alignment marks for photolithographic masks in semiconductor wafer fabrication. More particularly, the present invention relates to alignment marks having a fine equiaxed grain protective nucleation layer of tungsten over a tungsten alignment trench in the surface of a semiconductor wafer.
Semiconductor wafer fabrication involves a series of processes used to create semiconductor devices and integrated circuits (ICs) in and on a semiconductor wafer surface. Fabrication typically involves the basic operations of layering and patterning, together with others such as doping, and heat treatments. Layering is an operation used to add thin layers of material (typically insulator, semi-conductor or conductor) to the surface of the semiconductor wafer. Layers are typically either grown (for example, thermal oxidation of silicon to grow a silicon dioxide insulation layer) or deposited by a variety of techniques such as chemical vapor deposition (CVD) and physical vapor deposition (PVD), including evaporation and sputtering. Patterning, is an operation that is used to remove specific portions of the top layer or layers on the wafer surface. Patterning is usually accomplished through the use of photolithography (also known as photomasking) to transfer the semiconductor design to the wafer surface.
The objective of the photolithographic process is to create in or on the wafer surface the various parts of a device or circuit in the exact dimensions specified by the circuit design ("resolution"), and to locate them in their proper location on the wafer surface ("alignment"). In order for the finished circuit to function properly, the entire circuit pattern circuit must be correctly placed on the wafer surface, and the individual parts of the circuit must be in the correct positions relative to each other. Since the final wafer pattern is generated from several photomasks applied to the wafer sequentially, misalignment of even a single mask layer can cause the entire circuit to fail.
In order to provide proper alignment of mask layers, photolithography tools are equipped to locate certain alignment marks on preceding layers. The alignment of two features on successive layers is straight forward. However, when, as is frequently the case, two features on non-successive layers require alignment, the location of the alignment marks through an intervening layer is more complicated. In many instances during fabrication, the preceding layer is transparent or translucent, allowing alignment marks on an underlying wafer to be optically detected by techniques well known in the art, such as bright field or dark field alignment. For example, a metal layer is typically covered by an oxide insulating layer. A photolithography stepper using bright field alignment will be able to locate the metal lines in the metal layer, to which contact holes must be aligned, through the transparent oxide layer. The stepper may then properly align the mask for the via holes.
However, in some cases alignment of non-successive layers in which the intervening layer is opaque is required. This is the case with metal layer alignment, where it may be necessary to align a mask to a mark on a layer that is covered with an opaque metal layer. Alignment in such cases has been achieved by providing some topography in, for example, the underlying the metal layer. An example of this technique is illustrated in FIGS. 1A through 1D.
FIG. 1A shows a cross-section of a portion of a semiconductor wafer 101 during fabrication having a trench 100 etched in a surface layer 102 to provide a mold for an alignment mark. The alignment mark trench is typically adjacent to a die on the semiconductor wafer, and each die typically has several alignment marks associated with it. In a preferred embodiment, the surface layer 102 is a dielectric layer, such as an oxide, nitride, polymer, or composite of these, and will generally be referred to as such in this application.
The mark is typically formed by deposition of tungsten 104 by CVD in the mold trench 100. Conventional tungsten deposition is typically preceded by deposition of a thin layer of PVD or CVD titanium nitride (TiN) as a glue layer (not shown) for the subsequently deposited tungsten. The deposition typically has two phases. First a relatively thin nucleation layer 103 of tungsten with fine grain size and conformity having an equiaxed grain structure is deposited over the oxide 202 and glue layer. This nucleation layer 103 provides a good base on the substrate material for subsequent bulk deposition of tungsten. The bulk tungsten 105, which is typically used to form the main body of the alignment mark due to its high deposition rate, has a columnar grain structure with uneven grain size and distribution and variable defect density relative to the nucleation layer 103. Since the CVD tungsten is conformal, a deposition trench 106, which follows the contours of the mold trench 100, remains in the surface of the wafer 108 following tungsten deposition. This deposition trench 106 ultimately serves as an alignment mark.
FIG. 1B shows the same wafer portion cross-section as in FIG. 1A following planarization of the wafer surface 108 according to an etch back technique well known in the art. The tungsten layer 104 above the level of the oxide has been removed, and the deposition trench 106 in the wafer surface is maintained by removal of tungsten in the mold trench 100 by the etch back. FIG. 1C shows the portion of the wafer 101 following deposition of a metal layer 110, typically AlCu, by PVD. While the PVD deposition is directional rather than conformal, it does deposit the metal layer 10 in a predictable manner so that the topographical pattern produced by the deposition trench 106 is reproducible.
As shown in FIG. 1D, metal deposition is followed by application of a conformal photoresist layer 112 which is subsequently patterned for the next layer (not shown). The result of this process is that the deposition trench 106 is maintained in a reproducible manner, providing a reliable alignment mark for the stepper when patterning the photoresist layer 112. The alignment mark is detectable, due to the topography it produces in the wafer surface, and provides detection accuracy, since the intervening process steps maintain the topography in a reproducible manner.
While the adoption of chemical mechanical polishing (CMP) of wafer surfaces during fabrication produced improved planarization results over etch back techniques, it has presented further problems for mask alignment. For example, as illustrated in FIG. 2A, a trench 200 is etched in an oxide layer 202 at the surface of a wafer 204 to serve as a mold for an alignment mark. A tungsten layer 206 is conformally deposited over the wafer surface 208 by CVD. As described above, a conventional tungsten layer is composed of a thin nucleation layer 205 deposited over the oxide 202, and bulk tungsten layer 207 over the nucleation layer 205. The CVD tungsten is conformal and forms a deposition trench 210 following the contours of the mold trench 200, with the bulk tungsten forming the walls 212 of the deposition trench.
As illustrated in FIG. 2B, as the wafer surface 208 is planarized by CMP, slurry (not shown) accumulates in the deposition trench 210. Since the polishing pad (not shown) does not contact the deposition trench walls 212 to polish them or remove the slurry, the walls 212 of the trench 210 are attacked by the oxidizing slurry. Due to the irregular structure of the bulk tungsten, discussed above, from which they are formed, the walls 212 are rendered uneven in an unpredictable way by the CMP slurry attack. As a result, the profile of the deposition trench 210 following CMP may be asymmetric and non-reproducible, as shown in FIG. 2B. This, in turn, results in an asymmetric and non-reproducible topography in the wafer surface 208 following deposition of the metal layer 214 and photoresist 216, illustrated in FIGS. 2C and 2D, respectively. Therefore, while the deposition trench alignment mark 210 may be detectable due to its topography, its detection accuracy is unreliable due to its unpredictable deformation by the CMP slurry.
Accordingly, what is needed are methods and compositions for obtaining consistent alignment mark profiles with both detectability and detection accuracy for use in conjunction with CMP processes during semiconductor fabrication.

Consistent alignment mark profiles on semiconductor wafers using fine grain tungsten protective layer


A disclosed transmitting apparatus includes a paging indicator information generating unit generating paging indicator information including a group ID of users who are to receive a paging channel and information indicating a radio resource in which the paging channel is transmitted; and a multiplexing unit multiplexing the paging indicator information.

In a mobile communication system, when a call to a terminal has arrived, it is required to inform the terminal of the arrival of the call. A network of the mobile communication system manages the location information of the terminal using a location registration area, and a Location Area Identifier (LAI) is assigned to each location registration area. In the network, the message indicating the arrival of the call to the terminal is broadcasted to each of the terminals in the location registration area where the location of the terminal is registered. This process is called "paging" (see, for example, Non Patent Document 1).
A receiving process of paging information in a W-CDMA system is described with reference to FIG. 1.
First, a receiving apparatus receives a paging indicator channel (PICH) (step S2). The PICH includes a group ID of users who are to receive a paging channel (PCH). For example, as shown in FIG. 2, a flag for each group ID is provided. When, for example, the number of the user groups is 72, seventy two bits (flags) are provided. By using the PICH, more than one group ID may be called at a time.
Next, the receiving apparatus receives the PCH (step S4). The PCH is to be received by a user whose group ID is designated by the PICH. The PCH includes the user ID of a user who is being called. For example, the user ID is called "TMSI (Temporary Mobile Subscriber Identity)" and is expressed by 32 bits. In a W-CDMA system, a single PCH may call up to five user IDs. Further, a "Cause ID" indicating the reason of the call is added. The "Cause ID" may indicate communication types such as voice and has approximately 2 or 3 bits.
Next, the receiving apparatus receives a broadcast channel (BCH). The user who is called by the PCH checks current restrictions and receives the latest interference amount information before transmitting a random access channel (RACH) to perform an Initial Access (step S6).    Non Patent Document 1: "W-CDMA mobile communication system" by Keiji TACHIKAWA, Maruzen K.K. pp. 255-256.

Transmitting apparatus, receiving apparatus, and paging information reception method


Example embodiments include micro-heater arrays including first and second micro-heaters disposed perpendicular to or parallel with each other on a substrate and methods of fabricating pn junctions between first and second heating portions using the heat generated from the first and second heating portions, respectively, when applying a voltage to the micro-heater array. Accordingly, when forming pn junctions using micro-heaters, a high-quality pn junction may be fabricated on a glass substrate over a large area.

1. Field
Example embodiments relate to micro-heater arrays, methods for fabricating pn junctions using the same, and pn-junction devices having micro-heater arrays. Example embodiments also relate to micro-heater arrays including at least one first and second micro-heaters perpendicular to or parallel with each other on a substrate, and methods for fabricating pn junctions using a relatively high temperature generated by applying a voltage to the micro-heater arrays including at least one first and second micro-heaters perpendicular to or parallel with each other.
2. Discussion of the Related Art
Pn junctions are widely used for diodes that perform rectifying operations and also for opto-electronic devices, e.g., solar cells, light emitting diodes (LEDs) and image sensors. To fabricate solar cells including pn junctions, silicon (Si) is mainly used as a host material, and phosphorus (P) and boron (B) may be added as n-type and p-type doping materials, respectively. To fabricate LEDs, gallium nitride (GaN) is mainly used as a host material, and magnesium (Mg) and Si may be added as n-type and p-type doping materials, respectively.
To fabricate a high-quality pn junction with excellent thin-film characteristics such as high crystallinity, a relatively high temperature is generally required. A pn junction in which amorphous silicon is used as a host material may be fabricated at a growth temperature of about 300° C. However, a pn junction of single crystalline GaN, which may be used for an LED, may be fabricated at a growth temperature of about 1000° C. Due to the relatively high temperature, a glass substrate may soften and therefore the fabrication of pn junctions over a large area becomes difficult. Also, due to the relatively high temperature, a substrate on which the pn junction of single crystalline GaN may be formed may be limited to high-priced substrates, for example, silicon wafers, Al2O3, SiC, etc.

Micro-heater arrays and pn-junction devices having micro-heater arrays, and methods for fabricating the same


A measuring machine includes a measuring device and a protective cover covering the measuring device. The measuring device is configured to measure parameters of a work piece. The measuring device includes a control box, a supporting board, a light ring configured to illuminate the work piece, and a camera module configured to obtain images of the work piece. The cover is made of non-transparent material. A first side of the cover defines a cut-out and a first slot. A second side of the cover opposite to the first side defines a second slot corresponding in size and alignment with the first slot. One side of the control box is exposed from the cut. Two ends of the supporting board are positioned on the first and second slots and exposed from the first and second slots.

1. Technical Field
The disclosure generally relates to measuring machines, and particularly to a measuring machine using imaging technology and having a protective cover.
2. Description of Related Art
Measuring machines are widely used in precision measurement field to measure parameters such as dimensions, assembly positions, and forms (i.e. contour or shape) of workpieces. The measuring machines play an important role in ensuring quality of the work pieces. Such measuring machines often use imaging technology to determine the various measured parameters.
In use, the measuring machine is commonly in an uncovered state. Components, such as a camera module are exposed to the nearby environment and therefore, for example, can be polluted by dust, which may negatively influence a measured result. Furthermore, the measuring machine usually has a plurality of light sources (i.e. LED lights) which emit strong light to illuminate the workpieces. The strong light may hurt eyes of an operator if the operator operates the measuring machine for a long time and without adequate eye protection.
Therefore, there is room for improvement within the art.

Measuring machine having a protective cover

HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.


An optical pulse generator, capable of generating ultrashort optical pulses suitable for optical soliton transmission, includes a DFB laser 10 for continuous laser oscillation, an electroabsorbtion modulator 12 for creating a sequence of optical pulses of the pulse width 14.6 ps from optical output of the laser 10. Output from an optical modulator 12 enters into a dispersion decreasing fiber 16 via an optical isolator 14. The dispersion decreasing fiber 16 has chromatic dispersion that decreases from 13.7 ps/nm/km to 2.3 ps/nm/km with distance, and its fiber length is 15 km. Pump laser beams from pump lasers 20, 24 are introduced to the dispersion decreasing fiber 16 by optical couplers 18, 22, and the fiber 16 functions as a Raman amplifier. When the Raman gain is 2.4 dB, the pulse width is compressed from 14.6 ps to 5.8 ps, approximately, even when the power of input pulses to the dispersion decreasing fiber 16 complies with the soliton condition.

High-speed optical soliton transmission using bit rates of decades of gigabits per second or more needs ultrashort optical pulses shorter than 10 ps. Optical pulses having a pulse width of 10 ps or more can relatively easily be generated by a method of driving a semiconductor laser with short pulses or by a method using an electroabsorbtion modulator as an optical gate to transmit a continuous wave light for a short time. With these methods, however, it is difficult to obtain ultrashort optical pulses in the order of several picoseconds required for high-speed optical soliton transmission. As means for compressing the pulse width of optical pulses having an ordinary pulse width, a Dispersion Decreasing Fiber is well known(for example, Morita et al., "Pre-emphasis Optical Soliton Compression Using DDF", The Institute of Electronics, Information and Communication, Digest for the Communications Society Symposium 1995, p. 398).
Dispersion decreasing fibers are optical fibers whose chromatic dispersion values decrease with transmission distance. Such optical fibers exhibit, for example, chromatic dispersion of 12 ps/nm/km to 14 ps/km/nm at their input ends but 1 ps/km/nm to 2 ps/nm/km at their output ends in the wavelength band of 1,500 nm which is regarded useful for long-distance optical transmission.
Japanese Patent Laid-Open No. 6(1994)-281896 discloses an optical pulse generator for generating ultrashort optical pulses usable for optical soliton transmission. This generator uses serially connected two electroabsorbtion modulators that are driven in phases different by 180 degrees to generate ultrashort pulses around 2 ps. This prior art, however, involves difficulties in practical use, such as wide spectral width.
The peak power and the soliton distance required for optical soliton transmission are theoretically given by the following equations. The soliton distance pertains to a transmission distance for characterizing solitons.
The peak power Psol (fundamental soliton) is: EQU Psol=0.776(.lambda.3 A.sub.eff D)/(n.sup.2 cn.sub.2 t.sup.2)(Eq.1)
where .lambda. is the signal wavelength (m), A.sub.eff is the effective core area (m.sup.2), D is the chromatic dispersion value (s/m.sup.2), c is the speed of light (3.0*10.sup.8 m/s), n.sub.2 is the nonlinear refractive index (m.sup.2 /W), and t is the pulse width (s).
The soliton distance z.sub.0 is: EQU z.sub.0 =0.322(n.sup.2 c/.lambda..sup.2)(t.sup.2 /D) (Eq.2)
where .lambda. is the signal wavelength (m), D is the chromatic dispersion value (s/m.sup.2), c is the speed of light (3.0*10.sup.8 m/s), and t is the pulse width (s).
In case of optical soliton pulses, since the product of the energy E and the pulse width t is proportional to the chromatic dispersion D, the pulse width t can be decreased by decreasing the chromatic dispersion D amply slowly (adiabatically) in the propagating direction by a ratio larger than the decrease in energy due to the propagation loss. Dispersion decreasing fibers use this theory. Note here that the pulse width compression ratio is equal to the decreasing ratio of the chromatic dispersion D under an ideal condition with no propagation loss; however, if any optical loss a exists, then the pulse width compression ratio becomes a value obtained by multiplying the chromatic dispersion decreasing ratio by exp(aL) where L is the fiber length.
The conventional device combining a pulse-driven semiconductor laser and a dispersion decreasing fiber is subject to variations in laser oscillating frequency due to the pulsative activation of the laser, which results in broadening the spectrum width of the optical pulse too much. To cope with the problem, the conventional device uses a narrow band optical filter to remove undesired frequency components. This approach, however, involves the disadvantage that pulse widths are limited by the band width of the narrow band optical filter. Additionally, it is almost impossible to fully remove varieties in oscillating frequency due to direct modulation of the semiconductor laser.
In devices combining an electroabsorbtion modulator and a dispersion decreasing fiber, for example, optical pulses of 14.6 ps produced by the electroabsorbtion modulator can be compressed to 8 ps by introducing them to a 15 km-long dispersion decreasing fiber whose dispersion decreases from 13.7 ps/nm/km to 2.3 ps/nm/km. For this purpose, however, the input power to the dispersion decreasing fiber is up to or beyond a value satisfying the soliton condition. That is, since the pulse width of optical pulses introduced to the dispersion decreasing fiber is relatively wide, as wide as 14.6 ps, the soliton length becomes long, and the length of the dispersion decreasing fiber also becomes long, as understood from Eq. 2. As a result, the propagation loss increases. In order to compensate the propagation loss, the conventional device increases the peak power of input optical pulses to the dispersion decreasing fiber beyond the theoretical value obtained from Eq. 1, and hence results in a mode of use which does not meet the soliton condition.
Unless the soliton condition is satisfied, the time waveform and the spectral shape of optical pulses are distorted unacceptably for use in optical soliton transmission. In contrast, if the soliton condition is satisfied, then the pulse width compression effect by the dispersion decreasing fiber is restricted.


A waste collection device operable by movement of one's hand to actuate opposing pivotable jaws around waste material. The jaws each have hinged blades that fold out to slide under the waste material as the jaws are closed. A bag is preferable used in conjunction with the device so that the waste material is captured within the bag as the jaws are closed around it.

This application relates to waste collection devices, and more specifically to hand held devices for sanitarily retrieving solid or semi-solid animal waste and the like from the ground.
Pet owners generally need to clean up after their pets. Typically, a pet owner would use a bag around their hand to retrieve and dispose of animal waste, which creates a highly unpleasant tactile sensation. Various other methods have been devised to avoid this manual retrieval of animal waste, such as the use of scoops, shovels, rakes or other cumbersome tools that are inconvenient to transport, require more than one hand to operate, or not very effective in grassy or sandy environments. Furthermore, use of these tools, including just a bag, usually requires one to carry the device and/or the used bag with them in one hand while holding a leash in the other. In addition to securing animal waste, the removal of other undesirable objects, such as small deceased animals like birds and mice may call for the use of a bag or other device that faces many of the same challenges that animal waste presents. There is therefore a need for a convenient, effective solution for the sanitary retrieval of waste that eliminates the feel of the waste through a bag, can be utilized with one hand, and which can allow for efficient transportation of the device and used waste bag.


A flame detection system is disclosed. The system may have a flame chamber and a filter, wherein the filter includes filter media configured to collect matter from an engine exhaust. Additionally, the filter may be disposed downstream of the flame chamber. An ignition device may be disposed in the flame chamber and may be configured to ignite a flame in the flame chamber to regenerate the filter. A sensor may be disposed proximate the ignition device, and may be configured to sense a change in electrical conductivity that is indicative of a presence of the flame in the flame chamber.

Emissions from a diesel engine, gasoline engine, natural gas engine, and other engines known in the art, may include particulate matter and other pollutants carried with engine exhaust. Exhaust aftertreatment systems generally include a diesel particulate filter, a diesel oxidation catalyst, and a selective catalytic reduction catalyst placed in the engine exhaust to reduce the amount of pollutants released into the atmosphere. The exhaust aftertreatment systems may separate or convert the pollutants to less noxious compounds.
A diesel particulate filter may collect particulate matter and remove it from the exhaust. However, over time, particulate matter may build-up and clog the filter, thereby impairing filter performance. Filter regeneration methods are designed to remove the built-up particulate matter from the filter, and improve filtration capacity/characteristics of the filter. An active regeneration method includes burning the accumulated particulate matter at elevated temperatures to thereby increase the filtration capacity of the filter. During the regeneration process, a fuel and air mixture is typically injected into a flame chamber upstream of the filter. The mixture is then ignited with a flame to burn the particulate matter captured by the downstream filter.
U.S. Pat. No. 7,406,822 issued to Funke et al. on Aug. 5, 2008 (the '822 patent), describes an exemplary system and method for active filter regeneration. In particular, a flame sensing system of the '822 patent uses thermocouples to detect whether a flame is present upstream of a particulate filter, and to monitor the amount of fuel required to maintain a sufficient flame. When no flame is present, the system may terminate the injection of fuel. However, when a flame is present, the amount of fuel may be adequate and the system may monitor the presence of fuel.
While the system disclosed in the '882 patent may be capable of detecting the presence of a flame, such systems are typically plagued with several disadvantages. For example, although thermocouples may be configured to detect the presence of a flame, thermocouples typically have a slower response time than other sensors. As a result, systems injecting fuel based on signals received from such thermocouples may continue to inadvertently inject fuel into the flame chamber while a flame is no longer present. Such excess fuel may flow downstream into the filter, and may crack or melt the filter causing permanent damage to the filter. Additionally, thermocouple sensors may be required to be located directly in the flame. The extreme temperatures of the flame may decay the thermocouple so that it may no longer work properly.
The disclosed system is directed to overcoming one or more of the problems set forth above and/or other problems of the prior art.

Flame detection system for particulate filter regeneration


As a result that a switching circuit switches between a first power source for supplying power when illuminating a light emitting diode and a second power source for supplying a predetermined bias to the light emitting diode, a reference signal output from a reference power source is compared with a leak current of an LED lighting device using the light emitting diode, a control signal is generated based on the comparison result, and a display means displays a leakage result when the leak current of the lighting device using the light emitting diode is higher than a reference value; a bias is set to a value, by which a current flowing to the light emitting diode can be ignored, and a leak current flowing to the lighting device using the light emitting diode is detected.

1. Field of the Invention
The present invention relates to a leakage detecting device for detecting a leak current of a display device with a plurality of light emitting diodes (LED), etc. and generating an alarm (display) signal.
2. Description of the Related Art
Generally, a large number of lighting equipments using a plurality of LEDs as a light source have appeared on the market. There are, for example, a rope type alarm illumination device for notifying of a construction site on the road side and a display device for displaying letters, pictures and signs, etc. by using a decoration display device incorporating a large number of LED for decorating buildings and shops in place of conventional neon signs and, furthermore, there are lighting equipments using LEDs as a light source recently as typified by a traffic light.
These lighting equipments are used not only indoors but often used outdoors, so that when processing in electric connections is weak, leakage may be caused due to an influence by humidity and dust.
Other than the above, an insulation defect caused by deterioration over time due to long time use may cause leakage, and damage by animals may cause leakage.
Next, a specific example of a key part of an LED display device using LED will be explained below. A configuration example of a line light source 100 produced by mounting a plurality of LEDs on a printed substrate will be explained. As shown in FIG. 1A, a wiring pattern is formed on a printed circuit board made by a glass epoxy, etc., a plurality of LEDs are arranged at predetermined intervals thereon and, furthermore, a power source IC, resistor, capacitance and other components are mounted.
An equivalent circuit thereof is shown in FIG. 1B. a plurality of LEDs (LED-1, LED-2, . . . , LED-6) as a first group are serially connected between a power supply (voltage) line (+24V) 101 and ground line (GND) 102, a power source circuit IC101 is connected to an output of the LED-6, and an LED-7 and a resistance R101 are serially connected between an output of the power source circuit IC101 and the GND. In the same way, LEDs (LED-1A, LED-2A, . . . , LED-6A) as a next group are serially connected, an output of the LED-6A is connected to a power source circuit IC102, and an LED7A and a resistance R102 are serially connected between an output of the power source circuit IC102 and the GND. Such connection is considered as one group and arranged repeatedly.
As explained above, a display unit of a display device composed of LEDs arranged repeatedly on a substrate is cut to be any length for use in accordance with need. However, dirt, etc. may adhere to a cut surface of the substrate and cause a leak current in some cases.
Also, for example, dusts may adhere to both terminals of the LEDs and resistances and cause a tracking phenomenon, which results in leakage. Furthermore, when a high current flows, an electromigration, wherein wires are short-circuited, may be caused to generate leakage and, in the extreme case, short-circuiting results in a high current flow.
Other than the leak currents as explained above, leak currents of the LEDs themselves also arise. Electric characteristics of an output current (a forward current) with respect to an application voltage (forward voltage) of an LED are shown in FIG. 2A and FIG. 2B.
FIG. 2B shows forward bias characteristics of each LED. In a graph in FIG. 2B, the abscissa axis indicates a forward voltage from 1.0V to 6.0V and the ordinate axis indicates a forward current in a log-scale in a range of 0.1 mA to 100 mA. A red LED exhibits a forward current of 5 mA when a forward voltage is about 2.0V, and 0.001 mA or lower when 1V at the room temperature (25° C.). A green LED exhibits a forward current of 2 mA when a forward voltage is about 3.0V, and 0.001 mA or lower when 1V, and a blue LED exhibits a forward current of 2.0 mA when a forward voltage is about 3.0V, and 0.001 mA or lower when 1V.
From the data, a blue LED and red LED exhibit a forward current of 0.001 mA or lower even when a forward voltage of, for example, 2.0 V is applied, so that it can be deemed that a current virtually does not flow.
Accordingly, in a lighting device using an LED, it is possible to detect a leak current excepting that in the LED under a condition, under which a current flowing in the LED can be ignored, by supplying an equal voltage to or lower voltage than the voltage applied to the LED.
Generally, a current limit has been set in the supply power source to prevent a leakage in a lighting device or an LED lighting device, however, a high current has to flow for lighting and it has been also the same in the case of an LED. When a high current flows to an LED, even if a leakage (a leak current) arises, as explained above, it is often the case that the leak current cannot be detected only by a current limit because the leak current is very small.
Furthermore, as a result that a current flows to the leakage side and a supply to the LED reduces, a change of the current due to the leakage may be not enough to be detected comparing with the normal change. Therefore, it has been desired to detect a leakage by other method than the current limiting method for preventing it.
As explained above, a leakage preventing device of the related art reduced an abnormal current and an excessive current by detecting an abnormal current being in proportional with a leak current between a power source and a load or by detecting an excessive current when it flows to the load.


The present invention relates to an oral delivery system containing a group c streptococcal phage associated lysin enzyme for the prophylactic and therapeutic treatment of Streptococcal A throat infections, commonly known as strep throat.

1. Field of the Invention
The present invention relates to an oral delivery means, such as a candy, chewing gum, lozenge, troche, tablet, a powder, an aerosol, a liquid or a liquid spray, containing a group C streptococcal phage associated lysin enzyme for the prophylactic and therapeutic treatment of Streptococcal A throat infections, commonly known as strep throat.
2. Description of the Prior Art
Group A streptococci have been shown to be an important pathogen capable of existing both in a carrier state in an asymptomatic individual and in a symptomatic individual with symptoms of disease ranging from a mild sore throat, tonsillitis, or impetigo. If untreated these streptococcal infections could lead to glomerulonephritis, rheumatic fever and possibly permanent rheumatic heart disease. With the advent of antimicrobial agents, specifically penicillin derived antibiotics, the causative organism can be readily eliminated following the prescribed regimen of appropriate antibiotic therapy.
The fact that an infected individual (usually children & young adults) can pass group A streptococcal organisms to others, particularly in daycare centers and schools, necessitates the isolation of the known infected individual away from these environments for at least 24 to 72 hours after antimicrobial therapy has been initiated. It has been shown in controlled studies that early detection and appropriate treatment results in a reduction in the overall pattern of cyclic transmission of the troublesome pathogen as well as a reduction or elimination of the sequelae of group A infections (rheumatic fever or nephritis).
The first individual to identify the serological and immunological groups of streptococci was Dr. Rebecca Lancefield, (Lancefield, R. C., "A Serological Differentiation of Human and other Groups of Hemolytic Streptococci," J. Exp. Med., Vol. 57, pp 571-595 1933), after whom the grouping system was named. The group A streptococcus was identified on the basis of B-1, 4 N-acetylglucosamine terminal sugar moieties on a repeating rhamnose sugar backbone found as part of the structure of the organism's cell wall. Antiserum raised against group A streptococci and subsequent absorptions to remove cross-reactions were shown to specifically react with the cell wall component of these organisms and became the grouping antisera for group A streptococci. A number of methods have been devised to fragment the group A streptococcal cell wall carbohydrate. These methods include heating by boiling at pH 2.0, autoclaving, trichloroacetic acid extraction, hot formamide digestion, nitrous acid extraction and enzyme digestion by enzymes derived from the soil microorganisms of species streptomyces, and the phage-associated enzyme lysin. Each of these methods have various advantages and disadvantages.
The rapid diagnosis of group A streptococcal pharyngitis has become more readily available to both physicians and clinical laboratories by replacing time consuming culturing methods requiring a minimum of 24 to 72 hours to identify the presence of group A streptococci with a rapid antigen-antibody test capable of being performed and read in less than one hour. Culturing methods vary in the degree of sensitivity of detection. In one case, a simple 5% sheep blood agar plate may be used in conjunction with a Bacitracin disc and culturing 24 hours at 37 degree(s) C. aerobically to identify group A streptococci. Alternatively, a selective media and anaerobic conditions may be used to inhibit overgrowth by other organisms and incubation at 35 degree(s) C. for a minimum of 48 hours. In addition, depending on the transport media, the delay in testing, and any antibacterial agents that the patient may have taken, culturing may result in nonviable organisms that fail to grow in the media although the patient is indeed colonized by the group A streptococcus. In the latter case a sensitive immunoassay for group A streptococcal antigen can detect these nonviable organisms.
The sensitivity of the immunoassay procedure is effected by the amount of group A streptococcal carbohydrate antigen released and recognized by the specific immunological reagent. Enzymatic digestion by enzymes such as that produced by the species streptomyces, have proven to be quite effective in antigen release over some chemical methods and micro-nitrous acid but the poor specific activity and the presence of proteases makes it slow and incompatible for prolonged contact with immunological reagents. Maxted, (Maxted, W. R., "The Active Agent in Nascent Phage Lysis of Streptococci," J. Gen Micro, vol 16, pp 585-595 1957), Krause, (Krause, R. M., "Studies on the Bacteriophages of Hemolytic Streptococci," J. Exp Med, vol 108, pp 803-821 1958), and Fischetti, (Fischetti, V. A., et al, "Purification and Physical Properties of Group C Streptococcal Phage Associated Lysin," J. Exp Med, Vol 133 pp 1105-1117 1971, have reported the characteristics of an enzyme produced by the group C streptococcal organism after being infected with a particular bacteriophage identified as C1. The enzyme was given the name lysin and was found to specifically cleave the cell wall of group A, group C and group E streptococci. These investigators provided information on the characteristics and activities of this enzyme with regards to lysing the group A streptococci and releasing the cell wall carbohydrate. They never reported on the utility of this enzyme in an immunological diagnostic test for the detection of group A streptococci from throat swabs in patients. The failure to use this enzyme for a clinical diagnostic test was due to a number of problems associated with the enzyme such as: the difficulty in growing large amounts of bacteriophage in the group C streptococci, the time delays in inactivating the residual enzyme when trying to obtain phage stocks, the instability of the enzyme itself to oxidative conditions and heat, and nonspecific reactions in immunoassays performed in the presence of other organisms and the biological components in the sample.
U.S. Pat. No. 5,604,109 (Fischetti et al.) teaches the rapid and sensitive detection of group A streptococcal antigens by a diagnostic test kit which utilizes a sampling device consisting of a throat swab made of synthetic or natural fibers such as Dacron or rayon and some type of shaft which holds the fibers and which is long enough to place the fibers in the tonsillar area and capable of being used to swab the area to remove sufficient numbers of colonizing or infecting organisms. The swab can then be placed in the enzyme extraction reagent in several configurations and subsequently used in an immunoassay. The invention can comprise a test kit for detecting Group A streptococci, comprising an extraction reagent containing lysin enzyme for releasing Group A streptococcal components, and a ligand capable of binding with a component of the Group A streptococcus.

Therapeutic treatment of group A streptococcal infections


A method for making an epitaxial base includes the following steps. A plurality of grooves and a plurality of bulges are formed on an epitaxial growth surface of a substrate by etching the epitaxial growth surface. A carbon nanotube layer is located on the epitaxial growth surface, wherein the carbon nanotube layer defines a first part attached on top surface of bulges, and a second part suspended on the grooves. The second part of the carbon nanotube layer is attached on bottom surface of the grooves by treating the carbon nanotube layer.

1. Technical Field
The present disclosure relates to an epitaxial base, a method for making the epitaxial base and an epitaxial structure.
2. Description of Related Art
Light emitting devices such as light emitting diodes (LEDs) based upon group III-V nitride semiconductors such as gallium nitride (GaN) have been used in many fields.
Since wide GaN substrates cannot be produced, the LEDs have been produced on a heteroepitaxial base such as sapphire. The use of sapphire substrate is problematic due to lattice mismatches and thermal expansion mismatches between the GaN and the sapphire substrates. One consequence of the thermal expansion mismatches is straining the GaN/sapphire substrate structure, which leads to cracking of the GaN/sapphire substrate and difficulty in fabricating devices with small feature sizes. A solution to cure the thermal expansion mismatches is to form a plurality of grooves on the surface of the sapphire substrate by lithography or by etching before growing the GaN layer. However, both the processes of lithography and etching are complex, high in cost, and may contaminate the sapphire substrate.
What is needed, therefore, is to provide a method for growing an epitaxial structure that overcomes the problems as discussed above.


A paint brush cleaning accessory that includes a supporting mechanism for supporting the bristle portion of a paint brush entirely below the surface of a volume of a cleaning solvent within a cleaning solvent container while ensuring the tip ends of the bristle portion of the bristle portion are suspended above the bottom surface of the cleaning solvent container.

Most painters use expensive paint brushes in order to achieve a better paint job as well as to make painting easier. Because these paint brushes are expensive, it would be a benefit to have a paint brush cleaning accessory that included a supporting mechanism for supporting the bristle portion of a paint brush entirely below the surface of a volume of cleaning solvent contained within a cleaning solvent container while ensuring the tip ends of the bristle portion are suspended above the bottom surface of the cleaning solvent container.


An auxiliary contact configuration for a switching device, the switching device comprising a frame part (2) and the auxiliary contact configuration comprising a first auxiliary contact position (5) provided in the frame part (2) and arranged to receive an auxiliary contact (8), and a movable auxiliary contact control device (10) comprising a first control element (11) arranged to control the auxiliary contact (8) installed in the first position (5). The auxiliary contact configuration comprises a second auxiliary contact position (6) provided near the first auxiliary contact position (5), and the auxiliary contact control device (10) comprises a second control element (12) arranged to control the auxiliary contact (8) installed in the second position (6) in a manner different from the manner in which the first control element (11) is arranged to control the auxiliary contact (8) installed in the first position (5).

The invention relates to auxiliary contact configurations for a switching device.
Switching devices are equipment used for opening and closing a current circuit. A switching device comprises at least one pole and a control device arranged to open and close the pole. Switching devices include e.g. switches and switch-fuses. Switching devices often comprise auxiliary contacts arranged to open and close e.g. locking, alarming, position indication and auxiliary current circuits. Auxiliary contacts are adapted for currents substantially lower than said at least one pole of a switching device. Auxiliary contacts are controlled by an auxiliary contact control device which, in turn, is usually controlled by the same control device as used for controlling the poles of the switching device.
An auxiliary contact configuration may comprise an auxiliary contact, which is in its first switching position when the control device for the switching device is in a 0-position or in a I-position, and in its second switching position when the control device for the switching device is in a testing position. Alternatively, the auxiliary contact configuration may comprise e.g. an auxiliary contact, which is in its first switching position when the control device for the switching device is in the 0-position, and in its second switching position when the control device for the switching device is in the I-position or in the testing position. A desired change of position of each auxiliary contact of the switching device between its first and second switching position is achieved by designing the auxiliary contact control device appropriately.
A problem with the above-described arrangement is that the auxiliary contact control device has to be designed differently for different configurations, depending on the way in which each auxiliary contact is to change its position between the first and the second position.

Auxiliary contact configuration for switching device


The present invention generally relates to a seat cushion comprising an air chamber with the shape and size corresponding to those of the buttock print of a user. Specifically, embodiments of the present invention are directed to a seat cushion comprising an air chamber and with an areas corresponding the coccyx, perineum area, left and right thighs of a user when the user is in a standard sitting position. In preferred embodiments of the present invention, no part of the air chamber is excluded from a single air dissipation and flow. Preferred embodiments of the present invention are further configured with one or more air valves allowing for adjustment of inflation of said air chamber.

Prolonged sitting has brought significant health issues and discomforts to sedentary population. It is important to help sedentary people improve pressure distribution underneath the buttocks, help people with damaged or sensitive coccyx prevent compression on the coccyx, and help people with enlarged or sensitive prostates, or with hemorrhoids or mothers who recently gave birth in order to reduce pressure in the perineum area. It is of special importance to help sedentary people to reduce physical inactivity without overtly intruding their concentration on their tasks on hand, while sitting. American Institute for cancer research has linked numerous common cancers to physical inactivity of sitting.
There are various products tackling one or more of the above mentioned issues. However there is no solution that is capable of addressing all above issues. Furthermore, current devices tend to be less user friendly and less comfortable to use. And, none has succeeded to reduce physical inactivity without being risky, uncomfortable or overtly distractive to use.
Further, while there are certain support cushions and seats that provide support for one or more areas of a user's legs or other body portions, none of these support cushions provide a single air bladder capable of providing support for all of the regions identified above, such as the buttocks, thighs and coccyx.
Finally, none of the support cushions in the prior art provide a seating platform that (i) prevents the backward rolling tendency of a user's pelvis; (ii) works to prevent slouching; and (iii) provides stability stimulation for a user's upper body.
Therefore, there is a need in the art for a seat cushion helping users improve pressure distribution underneath buttocks and thighs, reduce pressure on perineum area and prevent compression on coccyx while sitting, and helps reduce, relieve or prevent many health issues related to prolonged sitting. It is important to offer sufficient proprioceptive stimulation and support to users without being risky, uncomfortable or overtly distractive to users. These and other features and advantages of the present invention will be explained and will become obvious to one skilled in the art through the summary of the invention that follows.


Disclosed is a new process and intermediates for preparing benzazepines of Formula (I):

Integrins are a superfamily of cell adhesion receptors, which are transmembrane glycoproteins expressed on a variety of cells. These cell surface adhesion receptors include gpIIb/IIIa (the fibrinogen receptor) and αvβ3 (the vitronectin receptor). The fibrinogen receptor gpIIb/IIIa is expressed on the platelet surface, and mediates. The vitronectin receptor is known to refer to three different integrins, designated αvβ1, αvβ3 and αvβ5 Compounds that inhibit the activity of these receptors and associated integrins may be useful for the treatment of inflammation, cancer and cardiovascular disorders, such as atherosclerosis and restenosis, and diseases wherein bone resorption is a factor, such as osteoporosis. Benzazepine compounds that are potent inhibitors of the αvβ3 and αvβ5 receptors are described in U.S. Pat. Nos. 5,939,412 and 6,127,359.
Each of the above publications describes a variety of procedures for constructing benzazepines, however these processes employ expensive reagents and generally require a large number of steps in the synthetic sequence. Accordingly, it would be useful to develop an efficient and cost-effective process for the preparation of benzazepine compounds.

Process and intermediates for preparing benzazepines

Abstract: wherein R1 and R2 are as defined herein.


A method of determining a thermal coefficient of expansion of a substance, the method including providing a first liquid holder containing a solution including the substance, and a second liquid holder containing a liquid in which the substance is not present; applying a pressure perturbation to the solution in the first liquid holder and to the liquid in the second liquid holder at a known temperature; determining a differential heat effect between the first and second liquid holders in response to the pressure perturbation; calculating, from the differential heat effect, the heat effect of the substance in response to the pressure perturbation; and determining, from the calculated heat effect, the thermal coefficient of expansion of the substance at the known temperature.

The invention relates to calorimeters, e.g., microcalorimeters, and calorimetry methods.
Microcalorimeters are devices that measure very small quantities of heat. In chemistry, biochemistry, cell biology, and pharmacology, ultrasensitive microcalorimeters are frequently used to measure thermodynamic properties of biological macromolecules, such as proteins.
A typical microcalorimeter has two cells, a xe2x80x9creference cellxe2x80x9d filled with a liquid, and a xe2x80x9csample cellxe2x80x9d filled with a dilute solution of a test substance, e.g., a macromolecule, in the same liquid. By comparing the heat evolved or absorbed by the two cells in response to changes in certain stimuli, such as temperature or concentration of a ligand, information about the test substance can be determined.
There are generally two popular types of microcalorimeters: the differential scanning calorimeter and the isothermal titration calorimeter. The differential scanning calorimeter automatically raises or lowers the temperature of the system at a given rate, while monitoring any temperature differential that arises between the two cells. From the temperature differential information, small differences between the amount of heat absorbed or released by the sample cell in comparison to the reference cell can be determined and attributed to the test substance.
In isothermal titration calorimetry, the instrument maintains a constant temperature while the concentration of an additional substance added to the cells is varied. The additional substance can be, e.g., a ligand that binds to the test substance in the sample cell. The instrument measures the heat absorbed or released as the newly introduced ligand binds to the test substance. By repeating the titration experiment using multiple additions of the ligand until binding is complete, various information concerning the interaction between the test substance and the ligand, e.g., stoichiometry, binding constant, and heat of binding, can be determined.
In general, in one aspect, the invention features a calorimeter that includes a sample cell, a reference cell, a pressure system that applies a variable pressure to the sample cell, and a pressure controller that controls the pressure applied by the pressure system to the sample cell.
Embodiments of this aspect of the invention may include one or more of the following features. The pressure system can apply the variable pressure to both the sample cell and the reference cell simultaneously. For example, the pressure system can be a pressure chamber that communicates continuously with both the sample cell and the reference cell. The pressure controller can include first and second pressure sources that apply first and second pressures, respectively, to the pressure chamber, and a control valve can be used to regulate whether the first or second pressure is applied to the chamber.
The calorimeter can further include a heat monitoring system that determines differences between the amount of heat absorbed or released by the sample cell and by the reference cell. The heat monitoring system can include a temperature sensor that monitors a temperature differential between the two cells that arises, e.g., in response to a change in the pressure applied by the pressure system.
The sample cell can be a vessel shaped to contain a liquid, and the pressure system can apply the variable pressure to a liquid holding portion of the sample cell. The reference cell can be substantially identical in mass and volume to the sample cell.
The reference cell can contain a liquid, and the sample cell can contain a solution that includes the liquid and a test substance, such as a biopolymer.
The calorimeter can also have an electrical control system electrically coupled to the pressure controller. The electrical control system includes, for example, a computer program that causes the pressure controller to periodically vary the pressure applied by the pressure system. In addition, the calorimeter can include a heating assembly thermally coupled to the sample and reference cells and electrically coupled to the control system. The same computer program can also cause the heating assembly to change the temperature of the sample and reference cells at a rate specified by a user, and can cause the pressure controller to periodically vary the pressure applied by the pressure system.
The calorimeter can also have a temperature sensor that monitors a temperature differential between the sample and reference cells. The computer program stores in memory information sufficient to determine temperature differentials between the sample and reference cells that arise in response to each change in the pressure applied by the pressure system. For example, the program can store either the actual temperature differentials between the cells or the differential power applied to the sample cell versus the reference cell in order to maintain the sample and reference cells at substantially equal temperatures.
In another aspect, the invention features a calorimeter that includes a sample cell, a reference cell, a pressure system in continuous communication with both the sample cell and the reference cell, and a pressure controller that controls pressure applied by the pressure system. The pressure system is configured to apply a pressure to both cells, and the pressure controller is configured to vary the pressure applied by the pressure system.
Embodiments of this aspect of the invention can further include, e.g., a heat monitoring system that determines the differential heat effect between the sample and reference cells in response to a change in the pressure applied by the pressure system.
In another aspect, the invention features a computer program, disposed on a computer-readable medium, for automating operation of a microcalorimeter that includes features of the calorimeters described above. The computer program includes instructions for causing a processor to periodically vary a pressure applied to the sample and reference cells, and store in memory information sufficient to determine temperature differentials that result when the pressure is varied. The computer program can also cause the heating assembly to scan the temperature of the sample and reference cells at a rate specified by a user.
In another aspect, the invention features a method of performing calorimetry. The method includes: (1) providing a calorimeter that has a reference cell and a sample cell, where the reference cell contains a liquid, and the sample cell contains a solution that includes the liquid and a test substance; (2) varying the pressure above the liquid in the sample cell and the solution in the reference cell; and (3) determining a differential heat effect between the sample cell and the reference cell in response to a change in the pressure applied by the pressure system.
Embodiments of this aspect of the invention may include one or more of the following features. The varying step can include applying a pressure perturbation to both the sample cell and the reference cell. The determining step can include measuring a difference between the temperature of the sample cell and the temperature of the reference cell.
In another aspect, the invention features a method of determining a thermal coefficient of expansion of a substance. The method includes: (1) providing a first liquid holder containing the substance, and a second liquid holder containing a solution in which the substance is not present; (2) applying a pressure perturbation to the solutions in the first and second liquid holders at a known temperature; (3) determining a differential heat effect between the first and second liquid holders in response to the pressure perturbation; (4) calculating, from the differential heat effect, the heat effect of the substance in response to the pressure perturbation; and (5) using the first and second laws of thermodynamics to determine the thermal coefficient of expansion of the substance at the known temperature. The applying step through the using step can then be repeated at a plurality of known temperatures, allowing construction of a function for the thermal coefficient of expansion of the substance as a function of temperature.
In another aspect, the invention features a method of determining the change in volume occupied by a target molecule (e.g., a protein, an oligonucleotide, a lipid, or a carbohydrate) as the molecule transitions from a first structure to a second structure in response to a change in temperature. The method includes: (1) providing a first liquid holder containing a plurality of the target molecules, and a second liquid holder containing no target molecules; (2) applying a pressure perturbation to the contents of the first and second liquid holders at a plurality of different temperatures, where the plurality of temperatures includes temperatures at which the molecules are transitioning from the first structure to the second structure; (3) determining a differential heat effect between the first and second liquid holders in response to each pressure perturbation; (4) calculating, from each differential heat effect, the heat effect of the molecule in response to each pressure perturbation; and (5) calculating the change in volume occupied by the molecule from a data set that includes the pressure perturbation values, the temperatures at which each pressure perturbation was applied, the volume of an individual target molecule in either its first or its second structure, and the heat effect of the molecule for each pressure perturbation.
The second calculating step can include: (a) determining the thermal coefficient of expansion, xcex1, of the molecule at each temperature T in the data set; (b) constructing a function xcex1(T) from the data set; (c) identifying, from the data set, a transition temperature range during which the molecule is actively transitioning from the first structure to the second structure; (d) constructing a second function xcex12(T) for the transition range, where xcex12(T) represents the thermal expansion coefficients that would have been measured in the transition range if the molecule did not change volume as it transitioned from its first to its second structure; (e) calculating the total area between xcex1(T) and xcex12(T) over the transition range; and (f) multiplying the total difference by the molar volume of the molecule.
Embodiments of the invention may include one or more of the following advantages. The new calorimeters allow a user to vary more than one intensive variable, e.g., temperature and pressure, or concentration and pressure, while conducting an experiment. The additional data gathered by applying pressure perturbations while varying temperature or concentration allows calculation of, e.g., the thermal coefficient of expansion of a test substance, and the change in volume occupied by a test substance as it changes structure in solution.
Operation of the new calorimeters can be automated by new software.

Pressure perturbation calorimetry instruments and methods


A motor mount repair system for use in a component assembly comprising a degradable member, a framework and a bolt-housing shaft of the component assembly includes an adhesion and sealing material comprising at least one resin. The degradable member of the component assembly is coupled in co-operative relationship to both the framework and to the bolt-housing shaft of the component assembly. When applied to the degradable member, the adhesion and sealing material adheres to and seals the degradable member permitting both repair of the degradable member and re-use of the component assembly. The component assembly comprises at least one of a motor mount, a shock absorber end, a sway bar bushing and a control arm bushing. Various methods of repairing the degradable member of the component assembly with the motor mount repair system are used.

In the past, engine driven vehicles were relatively noisy. Currently, motor vehicles, vessels (such as boats) and other pieces of equipment (such as compressors) which utilize an engine as their source of power typically have an engine coupled to one or more energy absorbing mounts. Typically these energy absorbing mounts dampen vibrations, attenuate sound or lessen destructive forces, which shorten the life of components. Examples of energy absorbing mounts include motor mounts, shock absorber ends, sway bar bushings and control arm bushings.
Initially, primitive energy absorbing mounts simply comprised rubber bushings for absorbing energy which were constrained between two metal plates and further comprised a mounting bolt for coupling to the engine. The construction of energy absorbing mounts has evolved over time as material science and vibration-absorbing technology has improved. Even though materials used for energy absorbing have improved, based on economical considerations and a desire to absorb a greater amount of vibration, sound and destructive forces, the energy absorbing portion of the mount has been made of softer materials without compensating for the reduced durability of the energy absorbing portion of the mount. The softening of this energy absorbing material has led to shorter mount life since the softer energy absorbing material degenerates more rapidly.
Typically, a motor mount comprises a component assembly including an outer framework, which is fastened to the structural frame of the vehicle (vessel or equipment). The motor mount further includes an energy absorbing material (compliant) in an interior portion of the component assembly, which is designed to absorb vibration and to attenuate sound and destructive forces. Typically, a secondary framework, consisting of a tube accommodating a mounting bolt, is suspended within this energy absorbing (compliant) material. This central bolt is coupled to a bracket, which is attached to the engine. Often, the component assembly cannot be disassembled without destruction of the energy absorbing (compliant) material in the interior portion of the component assembly. The energy absorbing material adheres to both the outer framework and the secondary framework having the tube and the mounting bolt. The purpose of the above described component assembly is to suspend and hold the engine in place so that vibration/force/sound transfer to the vehicle (vessel or equipment) is significantly reduced. Consequently this increases the life of the engine, structural framework and mounts, and provides improved operator comfort. The energy absorbing (compliant) portion of the component assembly eventually degenerates due to the forces applied to it by the engine through environmental factors such as temperature cycling, chemicals and mechanical fatiguing factors. Similar degradation occurs to other components as described above, where vibration, sound and force are absorbed by an energy absorbing (compliant) material suspended between at least two structural mounting brackets.
For illustration, in the specific case of motor mounts for vehicle engines, motor mounts were previously found on both sides of the engine at the lower side, and also attached to the frame of the vehicle. Modern motor mounts are found in a variety of locations such as the inner fender well, near the base of the radiator, at the base of the firewall, near the top of the radiator or as braces originating from the base of a motor/transmission to the frame of the vehicle. Most vehicles made in the past twenty years or so include three or four motor mounts.
When a component assembly such as a motor mount fails, a costly repair entailing replacement of the entire motor mount is required. A trade-off between the cost of labor and the cost of replacing a degraded motor mount with a new motor mount often dictates decisions about how a repair will be done. Bunker, U.S. Pat. No. 6,349,918 has disclosed a motor mount insert made of polyurethane to retrofit a clam-shell designed motor mount typically found in a truck. As discussed above, in many vehicles (vessels and equipment), the energy absorbing (compliant) material cannot be separated out and replaced as disclosed by Bunker, U.S. Pat. No. 6,349,918.
The inventors of this application disclose a repair material system for a component assembly of a vehicle (such as a motor mount) which is coupled to a vibrating member (such as an engine) of the vehicle and convenient procedures of using the repair material system to both repair and permit reuse of the component assembly. These procedures provide cost-effective repairs without requiring a complete retrofit of the component assembly.

Motor mount repair system and methods therefor


A device with a pivoting work arm for carrying and positioning a tool which is moved by a modified Watts linkage powered by a linear actuator is provided with shock absorption adjacent both the fully extended and fully retracted work arm positions. The modified Watts linkage engages a pawl which rotates a lever arm in the same direction to actuate the same shock absorber(s) when the work arm is moved to both its fully extended and fully retracted positions.

There are many previously known devices for positioning tools, welding guns and the like for mass production machining and assembly operations. Some previously known lift and carry workpiece transfer mechanisms have used a so called Watts linkage drive to raise and lower the workpieces.
A Watts linkage is a three link kinematic mechanism which has three long links pivotally connected together at adjacent ends with the remaining ends of two of the links pivoted about spaced apart and fixed pivot points. The links are constructed and arranged in a geometry that produces an essentially linear reciprocating motion of the center of the middle link. It is well understood that in a Watts linkage the links must be relatively long to produce this linear motion. Further, because the links do not move in a true straight line, a Watts linkage is not driven or powered by an actuator producing straight line or rectihinear motion.
The prior device disclosed in U.S. Pat. No. 5,216,930, utilizes a modified Watts linkage powered by an actuator having a straight line motion. While this device has been effective at powering the work arm with a linear actuator, it provides shock adsorption at only one end of the path of the work arm movement. Thus, at the end of the work arm movement where no shock absorption is provided, stresses can result on the system from the abrupt stoppage of the work arm which effects the durability and reliability of the system.

Power work arm with dual action shock absorber


The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arranged in the X or Y axis direction; moving the stage in the X axis direction, the Y axis direction, a Z axis direction, and a rotational direction around the Z axis for aligning the stage with a position detection unit for detecting positions of the semiconductor chips in the X axis direction and the Y axis direction; detecting the positions of abnormal semiconductor chips in the respective horizontal or longitudinal row that includes said abnormal semiconductor chips; and specifying the positions of said abnormal semiconductor chips on the X-Y axes.

1. Field of the Invention
This invention relates to a chip mis-position detection method for detecting a mis-position of a semiconductor chip on a dicing tape when an electrical characteristic inspection, of the semiconductor chips fixed to the dicing tape, is carried out.
2. Description of the Related Art
A large number of semiconductor devices (chips), forming the same electrical chip circuits, are formed on a surface of a wafer, and an approval/rejection judgment is made by using a prober to inspect electrical characteristics of each electrical chip circuit before the wafer is diced into discrete semiconductor devices (semiconductor chips). The prober generally has a construction in which a probe card having a probe corresponding to each semiconductor device of the wafer and connected to a tester is allowed to serially correspond to each semiconductor chip, brings its probes into contact with electrode pads of the semiconductor device and conducts electric measurement.
To reduce size, weight and thickness of electronic appliances such as cellular telephone units, digital cameras and mobile information terminals, a packaging technology for semiconductor integrated circuitry has now reached the stage of a chip size package (CSP) or a wafer level chip size package (WCSP). The CSP uses semiconductor chips arranged in a stack.
Therefore, a wafer having a reduced thickness of 100 μm or below has been required. In such thin wafers, the possibility of defect has become high during the process in which the wafer is diced into discrete semiconductor chips in a dicing step after the electrical characteristic test by using a prober. The demand is also high that the electrical characteristic test be conducted as much as possible in the last stage of the production of the semiconductor chips to reduce the percentage of defectives in the packaged products.
The electrical characteristic test of the semiconductor chips in the chip state has been made in the past by using a frame-carrying prober. In this case, to prevent the semiconductor chips diced during the dicing step from scattering, a dicing tape is bonded to a surface of the wafer on which the electronic chip circuits are not formed, and the wafer is then diced. The dicing tape has a round shape the same as the wafer and after the wafer is diced, the dicing tape is stretched in such a manner as to increase its diameter and is held under the stretched state by a ring-like metal frame. In other words, the discrete semiconductor chips diced are held as bonded to the dicing tape while the gaps (breaks) between the semiconductor chips are somewhat expanded. The semiconductor chips are carried under such a state by the frame and the electrical characteristic test of the discrete semiconductor chips is conducted while the semiconductor chips are held on the stage of the frame-carrying prober.
According to the prior art method described above, however, some semiconductor chips peel from the dicing tape from time to time. When the electrical characteristic test is started under this state, the semiconductor chips that are about to peel come into contact with probes of a probe card of the frame-carrying prober and breaks the probes and the chips. When alignment is conducted to position the semiconductor chips, the peeling semiconductor chips impinge against an alignment camera and break the alignment camera and the semiconductor chips.

This patent is subject to a terminal disclaimer.


A method of packing a glass base material (10, 20, 30), which is a base material of an optical fiber comprising packing the glass base material (10, 20, 30) into a cylindrical container (16, 26, 36). The packing has: putting the glass base material (10, 20, 30) into a plastic bag (12, 22, 32); and packing the glass base material (10, 20, 30), which is put into the plastic bag (12, 22, 32), into the cylindrical container (16, 26, 36). The packing further has: wrapping the glass base material (10, 20, 30), which is put into the plastic bag (12, 22, 32), with air packing material (14, 24, 34), which contains air inside; and packing the glass base material (10, 20, 30) wrapped with the air packing material (14, 24, 34) into the cylindrical container (16, 26, 36).

1. Field of the Invention
The present invention is related to a packing method for packing quartz glass or quartz glass base material, which is a base material of optical fibers used for optical communications.
2. Description of Related Art
Quartz glass or a quartz glass base material, which is a base material of optical fibers used for optical communications, is manufactured by sintering and vitrifying soot sediment. The soot sediment can be manufactured by one of vapor-phase axial deposition (VAD) method, outside vapor deposition (OVD) method, and modified chemical vapor deposition (MCVD) method. The glass base material is elongated to a predetermined diameter and then shipped.
If there is a crack on the surface of the glass base material, the optical fiber drawn from the glass base material having a crack will be cut during the drawing. Therefore, much care is needed in order not to damage the surface of the glass base material. Conventionally, glass base material was put into a square-shaped box, and the opening between the glass base material and the box was filled with a cushion for shipping.
Recently, because of the development of the optical fiber communication industry, the demand for quartz glass base material has increased, and the quantity of shipments of glass base material has also increased. A plurality of glass base materials is usually put together into one box to be shipped.
However, if a plurality of glass base materials are packed together in one box, the glass base materials may be damaged because the glass base materials may contact with each other due to the vibration occurring during the transportation of the glass base materials. The cushion is filled in the opening between the glass base material and the box to prevent the glass base material from contacting with each other. However, the conventional square-shaped box has large openings between the glass base material and the box and thus needs a large amount of cushion material. Furthermore, when packing a plurality of glass base materials in one box, if the cushion is made with soft material, the glass base materials inside the box may collide with each other due to the vibration during the transportation. In the worst case, the glass base materials may crack during the transportation.
Therefore, every individual glass base materials must be wrapped with buffer material for packing, such as air packing, which contains air inside. Then, one piece of the glass base material is packed in one box, or a plurality of glass base materials are packed together in one box to prevent cracking and breaking. However, the conventional packing method requires a large amount of buffer material and the box, and thus the conventional packing method has an economic disadvantage. Furthermore, the conventional packing method needs a large amount labor and time for packing. If there is space between the end of the glass base material and the end of the box in the longitudinal direction, the glass base material moves in the longitudinal direction during the transportation. Thereby, the end of the glass base material contacts with the box which may cause a crack or breakage of the glass base material.