In a comb-like or wedge-like electron emitting device, an emitter or both an emitter and an anode electrode are processed from a single-crystal silicon thin film of an SOI wafer. The single-crystal silicon thin film in portions other than the processed portion is removed so that the silicon oxide layer is dug down further slightly. A gate electrode for applying an electric field in order to draw electrons out of the emitter is provided in the dug-down portion. When the end and side faces of the emitter are formed as (111) faces by anisotropic etching in the condition that the single-crystal silicon thin film is oriented to a (100) face, the emitter has a sharp edge at about 55.degree. with respect to the substrate. In a conical electron emitting device, the gate electrode is constituted by a single-crystal silicon thin film of an SOI wafer so that a pyramid surrounded by the (111) faces is formed on the single-crystal silicon substrate.

1. Field of the Invention
The present invention relates to a structure of a field emission type electron emitting device using a semiconductor fine processing technique and relates to a method of producing the same.
2. Description of the Related Art
In recent years, micro vacuum electronic tubes have been produced so as to be applied to display units, high-speed switching devices, various kinds of sensors, etc. Hereupon, a technique of forming a micro electron source skillfully has become a key technology. Heretofore, a hot cathode type electron emitting device using thermoelectrons emitted from a heated filament, or the like, has been used popularly as an electron source. The hot cathode type electron emitting device, however, has problems in the large loss of energy caused by heating, the necessity of preparatory heating, etc. To solve these problems, public attention has been paid onto a field emission type (cold cathode type) electron emitting device, and some proposals have been made.
FIG. 11 is a partly perspective view showing an example of the field emission type electron emitting device. This is now called "conical (or pyramidal) electron emitting device 101". As shown in the drawing, a conical emitter 12 made of molybdenum (hereinafter simply referred to as "Mo") or the like is provided on a silicon substrate 11. There is formed an insulating layer 14 of a silicon oxide, or the like, having a portion opened around the emitter 12. Further, a gate electrode 13 having an end portion formed in the vicinity of the pointed end portion of the conical emitter 12 is provided thereon. In the field emission type electron emitting device configured as described above, when a voltage is applied between the silicon substrate 11 and the gate electrode 13, electrons are emitted from the pointed end portion of the emitter 12 which is high in the intensity of electric field.
FIGS. 13A to 13E are partly sectional views in respective steps for explaining the method of producing the conical electron emitting device 101 shown in FIG. 11. The steps will be described below with reference to the drawings.
An insulating layer 14 is formed on a silicon substrate 11. Further, by an electron beam vapor deposition method, the insulating layer 14 is coated with an Mo layer 131 which constitutes a gate electrode 13. Then, a photoresist is applied thereonto and then subjected to exposure and development so that a first pattern 161 is formed as shown in FIG. 13A. Then, the Mo layer 131 and the insulating layer 14 are selectively etched with use of the photoresist pattern 161 as a mask to thereby form a first opening portion 181 and a second opening portion 182. The Mo layer 131 having the first opening portion 181 is formed as a gate electrode 13 as shown in FIG. 13B. Then, the silicon substrate 11 is inclined by a predetermined angle .theta. while rotated in a substrate plane, so that aluminum (hereinafter abbreviated to Al) is evaporated so as to be deposited on an upper face of the gate electrode 13 and on a side face of the first opening portion 181 to thereby form an Al layer 191 as shown in FIG. 13C. Then, by an electron beam vapor deposition method, Mo is applied perpendicularly to the silicon substrate 11. In this occasion, Mo is deposited not only both on the upper face of the Al layer 191 and on the silicon substrate 11 but also on the side face of the Al layer 191. Accordingly, the diameter of the first opening portion 181 decreases as the Mo layer 192 is deposited. Because the vapor deposition range of Mo deposited on the silicon substrate 11 decreases as the diameter of the first opening portion 181 gradually decreases, a nearly conical emitter 12 is formed on the silicon substrate 11 as shown in FIG. 13D. Finally, the deposited Mo and Al layers 192 and 191 are removed to thereby form a conical electron emitting device 101 having such a nearly conical emitter 12 as shown in FIG. 13E.
In the field emission type electron emitting device of FIG. 11 according to the aforementioned producing method, there is however such a tendency that reproducibility in the case where the same shape is repeatedly formed is not satisfied because the conical emitter 12 is formed by vapor deposition. For this reason, there arises a disadvantage in that electron emitting characteristic particularly sensitively influenced by the radius of curvature of the topmost end of the emitter 12 and by the distance between the emitter 12 and the gate electrode 13 varies widely.
Upon such a background, an electron emitting device having a new shape and being good in uniformity of electron emitting characteristic has been published recently in Journal of Semiconductor World, March 1992, p. 62, by Kanamaru and Ito. FIG. 12 is a partly perspective view of the electron emitting device. This is now called "a comb-like electron emitting device 102". An insulating layer convex portion 241 and an insulating layer concave portion 242 are formed in an insulating layer 24 on a silicon substrate 21 (FIGS. 14A-14D). An emitter 22 made of Mo and having a plurality of emitter end portions 221 on one side is disposed on the insulating layer convex portion 241. On the other hand, a gate electrode 23 is formed on the insulating layer concave portion 242 so as to be opposite to the emitter end portion 221. Also in this electron emitting device, by applying a voltage between the emitter 22 and the gate electrode 23, electrons are emitted from the end of the emitter end portion 221 which is high in the intensity of electric field. This structure can be produced relatively easily by a conventional semiconductor producing process, so that this producing method is a method considerably improved in reduction of scattering in the producing steps. Further, not only the emitter 22 and the gate electrode 23 shown in FIG. 12 can be formed but also other electrodes such as an anode electrode for collecting emitted electrons, a control electrode for controlling electrons reaching the anode electrode, and so on, can be formed.
FIGS. 14A to 14D and FIGS. 15A to 15C are partly sectional views showing the steps of producing the comb-like electron emitting device 102 shown in FIG. 12. The steps will be described below successively. For example, an oxide film as an insulating layer 24 is applied onto a silicon substrate 21. Further, a tungsten film (hereinafter simply referred to as "a W film") 222 which constitutes an emitter is deposited on the whole surface of the insulating film 24 by means of sputtering (FIG. 14A). Then, a photoresist is applied onto the W film 222 so that a first pattern 261 is formed by using a photomask not shown. The W film 222 is etched by reactive ion etching (RIE) with use of the photoresist pattern 261 as a mask (FIG. 14B). Further, the insulating layer 24 is etched by about 1 .mu.m with use of the resist pattern 261 and the W film 222 as a mask so that an insulating layer convex portion 241 and an insulating layer concave portion 242 are formed (FIG. 14C). A niobium film (hereinafter abbreviated to "an Nb film") 231 which constitutes a gate electrode 23, and an aluminum film (hereinafter abbreviated to "an Al film")/Mo film 232 are applied onto the substrate by vacuum vapor deposition. The Al film/Mo film 232 and the Nb film 231 on the insulating layer convex portion 241 are removed by a lift-off method (FIG. 14D). A photoresist is applied again so that a second pattern 262 is formed by using a second mask not shown. The Al film/Mo film 232 and the Nb film 231 are etched by reactive ion etching (RIE) with use of the photoresist pattern 262 as a mask (FIG. 15A). Further, a photoresist is applied once more so that a comb-like pattern 263 is formed by using a third mask not shown. By reactive ion etching (RIE) with use of the photoresist pattern 263 as a mask, a comb-like emitter 22 is formed. In this occasion, the gate electrode 23 is not masked but the AL film serves as a protection film so that the gate electrode 23 is not processed into a comb shape (FIG. 15B). Finally, the Al film/Mo film 232 is etched and the surface of the insulating layer 24 is further etched with a buffer hydrofluoric acid, so that electrical insulation between the emitter and the gate electrode is improved. Thus, this process is completed (FIG. 15C). As metal materials used for the emitter and the gate electrode, W, Mo, Nb, etc. are selected on the basis of work function expressing the degree of easiness of flying of electrons, surface stability in the process and after the process, durability in a long term, etc.
As FIGS. 14A to 14D and FIGS. 15A to 15C show the producing steps, not only the comb-like electron emitting device 102 of FIG. 12 is large in the number of photoetching steps, that is, large in the number of times for forming a photoresist pattern and for performing etching with use of the photoresist pattern as a mask, but also many kinds of metal materials are used in the comb-like electron emitting device 102 of FIG. 12 compared with the structure of the conical electron emitting device 101 shown in FIG. 11. Accordingly, there is a limitation in selection of the etching method and etching solution to be used. Further, the emitter is produced from a polycrystalline metal thin film. In the thin film, there is some crystal grain boundary between crystals having a size of about 0.1 .mu.m. Because there is difference in etching speed, for example, in dry etching, between the inside and the outside with respect to the grain boundary, the shape of the end portion of the emitter is apt to be formed along the grain boundary. There arises a disadvantage in that as a result, the shape varies widely. Because the shape of the end portion of the emitter has a direct influence onto a field emission current emitted from the emitter, it is difficult to practically use the emitter the shape of which varies widely.
As described above, the conventional field emission type electron emitting device is not sufficient for the design concerning the combination of structures and materials. As a result, not only it is a matter of course that electron emitting characteristic varies correspondingly to each lot, but also the characteristic is not uniform in the same substrate in the same lot. Further, in the producing process, a measure to solve the problem caused by the defect in the combination of structures and materials is not taken, either.

Field emission type electron emitting device and method of producing the same

Director-General, Jiro Hiraishi, Agency of Industrial Science and Technology


The present invention provides an interconnect system. The interconnect system includes a substrate, a first dielectric layer deposited upon the substrate. The interconnect system further includes at least two electrically conductive interconnect lines formed upon the first dielectric layer. Each of the at least two interconnect lines have a top surface and side surfaces. Adjacent side surfaces of two adjacent interconnect lines define therebetween a space that has a dielectric constant substantially equal to 1. A dielectric film is bonded upon the top surface of the at least two interconnect lines. The dielectric film substantially prevents obstruction of the space by further process.

(1) Field of the Invention
The present invention relates generally to integrated electronic circuits. More specifically, the present invention relates to an interconnect system for an integrated circuit and a method of fabricating the interconnect system.
(2) Description of the Related Art
Modern integrated circuits are generally made up of millions of active and passive devices such as transistors, capacitors, and resistors disposed onto a silicon wafer. These devices are initially isolated from one another, but are later interconnected together by an interconnect system to form functional circuits. The quality of the interconnect system drastically affects the performance and reliability of the fabricated circuit.
An interconnect system typically includes metal lines, spaced apart from each other, which interconnect the various active and passive devices found in a silicon wafer onto which the interconnect system had been deposited and fabricated. Insulating dielectric layers are deposited between the metal lines for isolating the metal lines from one another. Inherent in the structure of the interconnect system is a capacitance associated with the metal lines spaced apart from each other. As the capacitance is to first order inversely proportional with the distance between the metal lines, one way to reduce the capacitance between two lines would be to increase the space between the lines. However, this option is limited by the integration capacity of the integrated circuit.
A preferable way to reduce the capacitance between two lines of the interconnect system is to reduce the dielectric constant k of the dielectric material deposited between the metal lines, as the capacitance is directly proportional to the dielectric constant of the dielectric material between the metal lines. Typically, interconnect systems use a dielectric material such as Silicon Dioxide (SiO.sub.2). The dielectric constant of SiO.sub.2 is approximately 4. Other dielectric materials can be used such as Silicon Oxifluoride (SiOF) with a dielectric constant of 3-3.5, or Aerogel which is a foam with vacuum or air pores with a dielectric constant which can approach the dielectric constant of air, i.e., 1. The problem with dielectric materials having lower dielectric constants is that they may not adequately support the structure of the interconnect system as these materials have a relatively high Young's modulus which makes them relatively soft, especially for materials with the dielectric constant k<2.
FIG. 1 shows a cross-sectional view of an interconnect system 100. The interconnect system 1 has a substrate 2 which typically includes active and passive electronic structures. An insulating layer 4 is deposited over substrate 2. The insulating layer 4 is made of a dielectric material which provides electrical insulation between the substrate 2 and any other electrically conductive layer deposited upon layer 4. Layer 4 could be, by way of non-limiting example, silicon dioxide (SiO.sub.2) either doped or undoped, silicon nitride (Si.sub.3 N.sub.4) or silicon oxinitride (SiO.sub.x N.sub.y). Following the deposition of the insulating layer 4 a metal layer is deposited thereon. Electrically conductive interconnect lines 10 are then formed by etching out selected portions of the metal layer. The electrically conductive interconnect lines 10 serve the purpose of interconnecting various electronic devices, active or passive, which reside in the substrate 2. The interconnect lines 10 are spaced apart from each other in order not to short circuit the various devices to which the interconnect lines are connected. The space between interconnect lines 10 is typically filled with a dielectric material 8 which is deposited upon interconnect lines 10 forming the pattern shown in FIG. 1. A second electrically conductive layer of interconnect lines 26 is formed over the dielectric layer 8 in a direction usually orthogonal to the direction of the interconnect lines 10. Continuing the above process, more insulating layers followed by conducting layers could be deposited to finally form the interconnect system.
The interconnect system illustrated in FIG. 1 uses SiO.sub.2 for the dielectric layer 8. While this type of material can provide the mechanical support necessary to withstand the stress of the structures deposited thereupon, the resulting large capacitance between lines, due to the relatively high dielectric constant of SiO.sub.2, makes this material less and less desirable in the high performance interconnect systems of the future.
FIG. 2 shows a cross sectional view of an interconnect system 200 wherein the dielectric layer 8 has been applied over interconnect lines 10 so as not to fill out completely the gaps between the interconnect lines 10 and, thus, to provide for air gaps 16 between the interconnect lines 10. However, due to the nature of the structure of the interconnect system and of the various processes for deposition of the dielectric layer 8, which include physical deposition, chemical vapor deposition, and plasma deposition, a certain amount of the dielectric is incorporated between the metal lines 10. As one can see, the dielectric material 8 is still deposited between the metal lines 10 leaving small voids 16. This is undesirable as the dielectric constant and thus the capacitance between the adjacent lines increases with the amount of dielectric material between the lines.
It is desirable to provide for an interconnect system wherein the space between the interconnect lines has a dielectric constant as low as possible and substantially uniform throughout that space.

Capping layer in interconnect system and method for bonding the capping layer onto the interconnect system


A security cassette (100) for valuable papers (1), including                a cover (101),        a receiving area (102) for receiving a plurality of the valuable papers, wherein the receiving area (102) is closeable with the cover (101),        a protective device (110, 112) for the valuable papers in order to enable devaluation of the valuable papers in the receiving area (102),        wherein the security cassette (100) includes at least one sub-divider (120) which divides the receiving area (102) and holds valuable paper bundles (2) respectively with a plurality of bundles of valuable papers such that the valuable paper bundles (2) held by the sub-divider (120) are arranged parallel upright in the receiving area (102), and that two adjacent valuable paper bundles (2) held by the sub-divider (120) are respectively separated from one another by an intermediate space.

Security cassettes are used to hold valuable papers, especially paper money, during storage on the one hand, for example after filling in cash centers and during transport. The safety cassettes usually have a trough-like container (referred to here as the lower part) with an access opening that can be closed by a cover element or a flap. Special tools and/or measures must be used to close and, in particular, open the access opening.
In addition, the security cassettes have a protective device. The protective device is used to make the theft of the security cassettes and the valuable papers located therein unattractive to a potential thief. This is done by devaluing the valuable papers as soon as there is deviation from the intended situation of the security cassette. The protective device can also be configured to emit alarm signals.
The terms "situation" and "deviation from the intended situation" or like terminology are to be understood in a broad sense. For example, "situation" may refer not only to the local situation, but also to the respective time and the respective threat situation. A "deviation" may mean that the location, time and threat situation are different than intended. A "deviation" may be caused, for example, by an attempt by unauthorized persons to open a security cassette, in particular in an improper manner, or to remove it from a receptacle, or to expose it to certain mechanical loads, or to transport it over a greater distance or for a longer period than intended.
Prior to the present invention, devaluating usually took place by the protective device applying a suitable liquid, e.g., ink, to the valuable papers, by which the valuable papers are colored or stained. However, there existed other means of devaluation, such as foam that expands and hardens.
The protective device of the security cassette can typically be brought from an idle state to an armed state. The protective device cannot be tripped in the idle mode. In the armed state, automatic tripping always occurs when the current situation of the security cassette, which may also be regarded as the actual current situation, deviates from the intended situation or target situation. In order to avoid undesirable devaluation of the valuable papers, an armed protective device must be put back to idle state if, for example, the security cassette is to be opened by authorized personnel.
The protective device is armed in accordance with a respective intended situation of the security cassette. In other words, the protective device of the security cassette can, depending on the type of the current or planned situation of the security cassette, be brought into different arming modes. In this case, the aim is to prevent unnecessary tripping of the protective device and at the same time not to block any necessary tripping of the protective device. For example, the protective device of a security cassette must be was more sensitive to mechanical influences such as knocks or movements when the security cassette is stationary in one place than when the security cassette is in transit. The intended situation or target situation or parameters which determine the corresponding arming mode of the protective device of the security cassette are programmed into the protective device or are fixed.
Prior to the present invention, security containers have been used to transport security cassettes. These security containers can also be used to hold the security cassettes during their storage, filling and transport. The security containers generally have several receptacles of the same or different design, each of which can hold a security cassette. The receptacles on the one hand and the security cassettes on the other have interacting locking means or closure means with which the security cassettes can be locked, locked away or sealed in the receptacles. The security cassettes are not necessarily completely surrounded by the receptacles or security containers, but can only be docked there, so that they can be at least partially visible or directly accessible from outside the security containers, for example, to remove them from the receptacles.
It has been recognized that the effort and the associated costs for the logistics of security cassettes can sometimes be very high. In addition, people are still a factor that must be taken into account in the overall security concept of such a logistics chain. However, not only people can prove to be a weak point in the security concept under certain circumstances. This also entails training, further education, and personnel costs, which contribute to a further increase in the cost of the logistics chain.
A typical or exemplary procedure for using the security cassettes follows: The security cassettes are filled manually in a cash center. They are then picked up by a driver and transported by a transport vehicle to their place of use, for example a bank or ATM station. Before and after transport in the transport vehicle, short, locally restricted transports can be carried out using a trolley. In the cash center, in the transport trolley, in the transport vehicles and in the ATM station, the security cassettes are located in the security containers therein. The security containers of the different locations can be different, but were designed in such a way that different receptacles are present in order to be able to receive and lock different types of security cassettes. The security containers or receptacles may have monitoring devices that react to unforeseen situations.
An overall system included, for example, several security cassettes, several stationary and mobile security containers (e.g. transport trolleys) as well as a monitoring system to monitor the security cassettes as permanently as possible.
Until today, the monitoring of security cassettes is similar to the monitoring of shipments transported by courier companies, namely with the help of manually operated PDA devices which are designed to read the identifiers of the individual security cassettes and to link them with associated information such as time and/or location. The selection or programming of the desired arming mode for the protection systems of the security cassettes is also carried out with the help of such PDA devices.
It is obvious that this conventional method of monitoring and arming or programming the security cassettes is demanding, time-consuming, prone to failure, and can be manipulated.

Security cassette, complete device with a security cassette and method for handling valuable papers


In a typical computer network, at least some of the managed resources are monitored to determine whether those resources are meeting predetermined performance goals or service level objectives. To simplify the process of configuring a network monitor, information about the service level objectives is loaded into the resource itself. When the resource is detected, the service level objective information is extracted from the resource information and made available to a translating engine. The translating engine converts the extracted information to monitoring directions that are used to configure the network monitor. Embodiments in which new resources are detected either buying a registration process or a polling process are described.

The present invention relates to computer networks and more particularly to the real time monitoring of network resources that have performance goals (service level objectives).
The term "network resource" is a term that should be interpreted broadly enough to cover almost any hardware or software included in a computer network. The term includes, but is not limited to, special-purpose hardware devices such as switches, routers, hubs, content servers, network storage devices, etc., including the control programs for such hardware devices. The term also includes application programs that execute on either special-purpose or general purpose hardware components.
Some network resources are expected to meet certain performance goals or service level objectives during their operation. A simple example of a service level objective is that queries received from preferred customers must be responded to within two seconds. Typically, the performance of managed network resources is tracked by a network monitor, itself another network resource to whom events occurring at a managed network resource are reported. The network monitor is aware of the performance goals of the managed network resource and applies rules to the reported events in order to determine whether the service level objectives of the managed resource are being met.
A network monitor is, of course, expected to monitor more than a single network resource. Dozens or even hundreds of network resources may be monitored by a single network monitor. To keep track of the network resources that it manages, a network monitor makes use of a configuration management database (CMDB), a repository that stores authorized configurations of the managed network resources and the relationships among such resources. The network monitor may work directly with a configuration management database or indirectly with the database through a higher level network manager that works with multiple network monitors.
When a new network resource is added to a computer network, the network manager usually learns of the presence of the new resource in one of two ways. In one type of system, commonly called a registration system, the new resource advertises its own presence by broadcasting one or more registration request messages. When a registration request message is received at a network manager, the manager takes the steps necessary to see that the new resource is added to a list of managed resources and is associated with a particular network monitor. In another type of system, commonly called a polling system, a network manager periodically sends out polling messages that request information from devices receiving the polling messages. A new device responds to a polling message by making its presence known to the network manager.
While the presence of new resources in a computer network may be automatically detected, the process of configuring those new resources is still largely a manual process performed by system administrators. Information about the resources, including any service level objectives, is obtained independently of the registration or polling process, and used to establish the configuration recorded in the configuration management database.

Monitoring of computer network resources having service level objectives

INTERNATIONAL BUSINESS MACHINES CORPORATION


In order to achieve a good brake feeling, a brake control system includes a master cylinder which discharges pressurized operating fluid according to an operating amount of a brake operating member by a driver, a stroke simulator which is connected to the master cylinder and creates a reaction force with respect to that operation according to the operating amount of the brake operating member, and a control portion which calculates a target deceleration using hydraulic pressure in the stroke simulator. The brake control system is also provided with a master cylinder pressure sensor that measures the hydraulic pressure in the master cylinder. The control portion may also calculate the target deceleration using an estimated value of the hydraulic pressure in the stroke simulator calculated based on the measured value from the master cylinder pressure sensor.

1. Field of the Invention
The invention relates to a brake control system which controls braking force applied to a wheel provided on a vehicle.
2. Description of the Related Art
Japanese Patent Application Publication No. JP-A-2005-41319, for example, describes a known braking force control system which calculates a target deceleration based on a hydraulic pressure in a master cylinder and a pedal stroke of a brake pedal, and controls the braking force so that the target deceleration is applied to the vehicle. In this braking force control system, the target deceleration is calculated to be larger the greater the master cylinder pressure or the larger the pedal stroke. Also, a stroke simulator which creates a reaction force with respect to an operation of the brake pedal by a driver is connected to the master cylinder.
In the foregoing braking force control system, when the driver depresses the brake pedal, the hydraulic pressure in the master cylinder increases in response to the depression force and operating fluid flows out from the master cylinder to the stroke simulator. The transient response of the master cylinder pressure at this time differs depending on the speed or rate at which the brake pedal is depressed. That is, when the brake is operated suddenly, the master cylinder pressure first becomes relatively high and then drops to an equilibrium master cylinder pressure as operating fluid flows out to the stroke simulator. When the brake is operated slowly, on the other hand, the master cylinder pressure approaches the equilibrium master cylinder pressure without becoming all that high.
As a result, the master cylinder pressure immediately after the brake operating member is operated tends to become larger the more sudden an operation of the brake operating member and the faster the speed of that operation. Therefore, as the speed at which the brake operating member is operated increases the target deceleration does so, as well. As a result, the speed at which the brake operating member is operated ends up affecting the brake feeling in such a way that the braking effect is keenly felt by the driver.

Brake control system and brake control method


In a secondary battery (1) comprising a battery case (2) for accommodating an electrode plate group (3) and an electrolyte, with one open end of the battery case (2) being sealed with an assembled sealing plate (11) that accommodates a safety mechanism (17) for exhausting pressure in the event of pressure build-up in the battery case (2) exceeding a predetermined level, at least one part (13a) of vent holes (13a, 13b, 13c) in the assembled sealing plate (11) facing the inside of the battery case (2) is constituted of an aperture that results from formation of a turned-out portion (23), the distal end of the turned-out portion (23) being allowed to abut on an insulating plate (4a) that makes contact with one end of the electrode plate group (3) so as to restrict movement of the electrode plate group (3). This can prevent malfunctioning due to displacement of the electrode plate group (3) when an impact or vibration is applied.

In a known secondary battery 31 as a secondary battery such as a lithium ion battery or a nickel metal-hydride battery, as shown in FIG. 9, a bottomed cylindrical battery case 32 accommodates an electrode plate group 33 and an electrolyte as power generation elements, a opening of the battery case 32 is sealed with an assembled sealing plate 35 via an insulating gasket 34, a lead (not shown) of one polarity extending from one end of the electrode plate group 33 is connected to the assembled sealing plate 35, and another lead (not shown) of the opposite polarity extending from the other end of the electrode plate group 33 is connected to the inner bottom face of the battery case 32. Insulating plates 36a and 36b are arranged on both ends of the electrode plate group 33.
The assembled sealing plate 35 includes, as shown in FIG. 10, a filter 37 being formed with vent holes 38, an inner surface of which faces the inside of the battery case 32, a cap 40 formed with exhaust holes 41, a outer surface of which faces the outside in a state of being insulated from the filter 37 by a gasket 39, and a safety vent mechanism 42 accommodated in the space between the filter 37 and the cap 40, which breaks when the pressure in the battery case 32 exceeds a predetermined pressure to interrupt the current path between the electrode plate group 33 and the cap 40 and to communicate the vent holes 38 with the exhaust holes 41. The safety vent mechanism 42 is made up of a lower valve body 43 and an upper valve body 44. The outer peripheries of the lower and upper valve bodies 43 and 44 are held between the filter 37 and the cap 40 with the gasket 39 interposed therebetween to provide insulation. The center parts of the lower and upper valve bodies 43 and 44 are connected to each other, and a breakable part is formed around the center, which breaks when pressure exceeding the predetermined level is applied (see, for example, Patent Document 1).
Another known conventional technique for improving the shock resistance of batteries is to set a plastic insulating ring between the electrode plate group and the sealing plate such that the upper part of the ring makes contact with the bottom of the sealing plate while the lower part makes pressure contact with the electrode plate group to retain the electrode plate group securely in place to restrict deformation of the leads due to impact or vibration (see, for example, Patent Document 2).
Yet another known conventional battery incorporates a feature for ensuring safe escape of gas wherein a plurality of projections are formed around gas outlet holes in the lower face of the sealing plate so as to prevent the holes from being blocked by the strip-shaped lead that connects the electrode plate group with the sealing plate even when the lead is pushed up towards the sealing plate due to a rapid build-up of gas pressure in the battery case (see, for example, Patent Document 3).
[Patent Document 1] Japanese Patent Laid-Open Publication No. 9-129195
[Patent Document 2] Japanese Patent Laid-Open Publication No. 2000-182592
[Patent Document 3] Japanese Patent No. 3596918

Secondary battery with improved shock resistance


A compression and decompression apparatus to be used for transferring test pattern data from a storage device of a host computer to a pattern memory in a semiconductor test system for testing a semiconductor device to decrease the time required for the data transfer. The compression and decompression apparatus includes: a compression means for classifying vector data in the test pattern data into a first group to be compressed to a short code and a second group not to be compressed, and for producing a look-up table showing relationship between the short code and the vector data in the first group; a compressed test pattern file storing compressed test pattern including the short code, data vector in the second group and the look-up table; and a hardware decompression circuit provided in the semiconductor test system or proximity thereto for decompressing the compressed test pattern based on the short code and the relationship shown in the look-up table and for sending decompressed test pattern to the pattern memory in the semiconductor test system.

In testing semiconductor devices such as IC memories and IC processors by a semiconductor test system, test patterns are supplied to the semiconductor device under test and resultant outputs of the semiconductor device are compared with expected value patterns to determine whether the semiconductor device functions correctly or not. The test patterns and expected value patterns including associated control data are frequently called test vectors in the semiconductor test industry because the major portion of the patterns are repetitive based on, for example, a mathematical algorithm.
Generally, such test patterns and expected value patterns (collectively "test patterns") are generated by a test pattern generator provided in the semiconductor test system under the control of a test controller provided in the test system. Test patterns are unique to the types of semiconductor device or the kinds of device test. The test patterns are usually stored in a hard disk of a host computer, such as a Unix host, or external storage devices. The test pattern generator has a pattern memory with a large memory capacity to store the test patterns. Thus, prior to the test, the test pattern is transferred from the hard disk of the host computer to the pattern memory in the pattern generator through the test controller.
FIG. 1 shows a basic structure of a semiconductor test system. A host computer 11 is a user accessible computer whose operating system is, for example, Unix. A hardware semiconductor test system 10 includes a pattern generator 15, a wave formatter 17 and a comparator 19. The hardware test system (tester) 10 is directly controlled by a tester controller (TC) 13. The tester controller 13 is a computer exclusive to the semiconductor tests system 10 and not directly controlled by the user. A semiconductor device 12 under test (DUT) receives a test pattern through the wave formatter 17 and the resultant output signals are compared with an expected value pattern by the comparator 19.
The pattern generator 15 includes a pattern memory 18 to store test patterns (test patterns and expected value patters) transferred from the host computer 11 through the test controller 13 and a tester bus 14. The test patterns are usually stored in a hard disk 16 of the host computer 11 as pattern files and transferred to the pattern memory prior to the start of the testing.
Such a transfer of test patterns occur frequently when devices to be tested are changed or different test programs are executed. The size of the pattern files may be several megabytes or several tens of megabytes, or more, because of the complexities of modern semiconductor devices to be tested. Therefore, it takes significant time to transfer the test patterns from the host computer 11 to the pattern memory 18 in the pattern generator 15.
Because the semiconductor test system is an expensive large scale computer system, it is necessary for a user to use the test system, in a most cost effective way. Further, in the semiconductor industry, there is always a strong demand in increasing the test efficiency to reduce the overall production cost of the semiconductor devices. Therefore, for operating the semiconductor test system with utmost efficiency, it has become important to reduce the time required for transfer the test patterns from the host to the pattern memory.

Pattern data compression and decompression for semiconductor test system


Logical units of allocation may be designated as overhead and unallocated and made unavailable for use. During one or more write operations, when one or more logical unit is invalidated, one or more of the unallocated overhead logical units may be designated as available for use and one or more of the invalidated logical units may be designated as overhead.

In a flash memory system, memory locations are grouped together as blocks. Memory locations within the blocks are consumed as data is written to memory locations within the blocks. A data storage system may be used to map logical memory locations to physical memory locations within the blocks.
As data is deleted the storage space previously allocated for this data is flagged as "dirty" or invalid. When data is overwritten, or appended to, additional unallocated space is consumed and the space previously used may be flagged as dirty. Before the dirty space can be reused the entire block in which the dirty space resides must be erased. If there is still valid data within an erase block that data must first be moved to another block and all references to its location must be updated before an erase can be preformed.
Once this process has been completed the previously unusable dirty space is reclaimed as unallocated space available for reuse. This process of reclaiming dirty space within a block may be, depending upon the type of flash device employed, NOR/NAND, and the dynamics of the storage system itself, relatively time consuming, and has a negative effect on sustained write throughput performance especially as the data within a flash data storage system volume nears capacity such that dirtied space must be reclaimed before a write operation can be completed.

Data storage management for flash memory devices


Systems and methods are provided for adjusting atrioventricular timing of a cardiac resynchronization therapy device, based upon multi-modal sensory data. In one particular embodiment, one or more acoustic signals are processed and categorized into certain cardiac-related mechanical events. Impedance waveforms are obtained from implanted electrodes and analyzed to identify certain valvular events. The acoustic and impedance data is analyzed to optimize AV timing and improve cardiac performance.

Implantable devices for pacing, cardioversion, defibrillation and resynchronization of cardiac electrical and mechanical function are widely available to prevent and treat symptomatic bradyarrhythmias, tachyarrhythmias and dysynchronous myocardial mechanics. Impaired cardiac performance can result from several abnormalities. Such abnormalities include alterations in the normal electrical conduction patterns and mechanical abnormalities in myocardial contractility. These abnormalities are often (though not necessarily) connected to one another and, as such, electromechanical impairments can cause an impairment in cardiac performance as well. Such impairment in cardiac performance often stems from premature or delayed electrical and/or mechanical events in different cardiac chambers and within specific cardiac chambers. For example, conduction abnormalities may occur between the atria and the ventricular chambers, which are known as atrial-ventricular dysynchrony. Abnormalities between right and left ventricular chambers (inter-ventricular) or within the right or left ventricles (intra-ventricular) can result in dysynchrony as well. Dysynchrony leads to ineffective work as a result of forces being generated in specific regions at inappropriate times relative to the opening and closing of the heart valves. It can lead to myocardial relaxation during times where the generation of force in all myocardial segments should be occurring synchronously and in a symmetric fashion in relation to valvular events and myocardial thickening when all myocardial segments should be relaxing, diastole, and receiving oxygenated blood from the lungs. Multiple variations in the location and pattern of dysynchrony may exist in individual patients.
Methodologies exist for optimizing the timing of pacing impulses in such systems including extrinsic measurements using echocardiography and intrinsic methodologies described by the inventor and others. Intrinsic or closed loop systems for monitoring purposes and optimizing interval timing within such implanted devices are in development.
These systems may employ measurements of cardiac performance and indices of dysynchrony. Several methodologies have been proposed including pressure transducers, oxygen saturation sensors, ultrasonic dimension sensors, accelerometers, measurements of electrical activation patterns and impedance based measurements. Such technologies may require large lead bodies, multiple transducers and can place significant energy demands secondary to signal processing. The present disclosure employs an acoustic sensor, such as a sonomicrometer, that detects intrinsic cardiac sound and characterizes a wide range of acoustic properties including but not limited to intensity, frequency, duration and self-similarity. The system then relates this acoustic data to other sensed signals, such as intracardiac electrograms and impedance waveforms, to optimize timing of pacing impulses and to provide data for monitoring and diagnostic purposes.
References that relate to the present disclosure include the following U.S. patents and published patent applications, each of which is incorporated herein by reference: U.S. Pat. No. 6,804,559, "Electromedical Implant," issued Oct. 12, 2004 to Kraus et al.; U.S. Pat. No. 6,795,732, "Implantable Medical Device Employing Sonomicrometer Output Signals for Detection and Measurement of Cardiac Mechanical Function," issued Sep. 21, 2004 to Stadler et al.; U.S. Pat. No. 6,792,308, "Myocardial Performance Assessment," issued Sep. 14, 2004 to Corbucci; U.S. Pat. No. 6,816,301, "Micro-electromechanical Devices and Methods of Manufacture," issued Nov. 9, 2004 to Schiller; U.S. Pat. No. 6,572,560, "Multi-Modal Cardiac Diagnostic Decision Support System and Method," issued Jun. 3, 2003; U.S. published patent application number 20040176810A1, "Implantable Medical Device Employing Sonomicrometer Output Signals for Detection and Measurement of Cardiac Mechanical Function," published Sep. 9, 2004 to Stadler et al.; and U.S. published patent application number 20030083702, "Implantable Medical Device Employing Sonomicrometer Output Signals for Detection and Measurement of Cardiac Mechanical Function," published May 1, 2003 to Stadler et al.

Diastolic mechanical algorithm for optimization of AV timing using a plurality of sensors


A server system sends, via a linearly ordered communication orbit, to computational machines at a first subset of nodes in a computer network, a set of local environment verification tests and a set of mappings that map results of the local environment verification tests into a set of risk scores. Requests sent by the server system cause the computational machines at the plurality of nodes to: locally evaluate the set of local environment verification tests to produce test results, and locally map the test results using the set of mappings into a set of risk scores. Queries sent by the server cause the computational machines at the plurality of nodes to return to the server system at least a portion of the test results and risk scores. The server, identifies, based on the received test results and risk scores, computational machines and/or control categories having risk scores satisfying predefined criteria.

There are many circumstances in which multiple computational machines (e.g., computers, but sometimes including other electronic devices, such as ATMs, point-of-sale machines (sometimes call cash registers), network connected controllers, etc.) on the same local area network (LAN) need to execute local environment verification tests (sometimes called a local environment verification framework) for checking their respective performance, security configurations, and vulnerability. Execution of the local environment verification framework oftentimes makes heavy use of both hardware (distributed file servers) and wide area network (WAN) bandwidth, for example, by having each computational machine on the local area network separately obtain a copy of a local environment verification framework from a resource external to the local area network and separately report verification results to a remote administrator machine. It would be beneficial to have a more efficient environment verification mechanism than the current practice.
In large corporate networks, and the networks of machines/computers used by large organizations, the numbers of managed machines can number in the tens or hundreds of thousands, or even more, making security assessment and management very challenging. Administrators are typically presented with an ever expanding list of machines that have failed various environment verification tests, as well as alerts about suspicious behavior and security risks to mitigate. Conventional methods typically only show how many systems are affected by a respective test failure, security configuration, vulnerability, alert or security risk, giving the system administrators little basis for prioritizing their efforts to mitigate or remediate security risks. Under traditional approaches, security risks that require the most attention may not be brought to the system administrator's attention, or their criticality may not be accurately indicated in the information presented to the system administrator(s).

Risk scoring based on compliance verification test results in a local network


A process program such as an erasing/programming program is stored in a boot mat in a nonvolatile memory operational in a boot mode specified after reset start, and a transfer control program for the process program is also stored therein in advance. With an action of setting control information to a predetermined register as trigger, the state of an on-chip CPU is changed from placed in execution of an optional user program to enabled for execution of a transfer control program in the boot mat, and the CPU is returned to the re-execution state of the optional program, after the process program is transferred to an on-chip RAM.

This invention relates to a microcomputer and a data processing device having an erasable and programmable nonvolatile memory and a CPU (a central processing unit), and more particularly, to a microcomputer configured to enable the nonvolatile memory for erasing and programming under program control, inclusively of the microcomputer-related art applicable to a one-chip microcomputer having a flash memory, for instance.
An electrically erasable and programmable nonvolatile memory such as a flash memory is available for storing information depending on a difference of programmed threshold voltage in a memory cell. In the flash memory, its threshold voltage is made different at difference amounts of holes or electrons accumulated in a floating gate. A higher threshold voltage state relative to a thermal equilibrium threshold voltage state is called a program state, while a lower threshold voltage state relative to the thermal equilibrium threshold voltage state is called an erase state, for instance (the definition to the contrary is also applicable). In this place, a process of repeatedly verifying the threshold voltage state every application of high voltage pulse is required for erase operation of enabling the memory cell for erasing and programming operation of enabling the memory cell for programming. This process is subject to the control by the erasing and programming operations depending on its progress condition. In this case, an erase/program control sequence, when hardware-embodied, is hard to cope with a change of specifications and so on, and therefore, using the CPU software-embodies an erase/program sequence.
A more complicated erase/program sequence is required with the progress of a process generation of the flash memory, and besides, tuning of an erase/program mode to meet the memory characteristics of an individual device is also supposed to be inevitable even throughout mass production. Accordingly, leaving the development of such software to a user will be a considerable burden on the user.
In Japanese Unexamined Patent Publication No. Hei 7(1995)-261997, there is disclosed the related art which places an erasing/programming program and an erase/program control program in a flash ROM, and in the need for reprogramming, transfers these programs to a RAM to reprogram information in the flash ROM under control of the erase/program control program. The above art of providing the erasing/programming program in the state of being stored in the flash memory relieves the user of the burden to a certain degree.
Incidentally, the user defined in the present specification is equivalent to a microcomputer or like semiconductor device user in a broader sense. Accordingly, so far as a semiconductor device is placed at the service of its manufacturer in some meaning, the manufacturer itself is supposed to be a user as well.

Microcomputer and data processing device


An optical module includes: an optical plug that supports one end of an optical fiber; a receptacle unit having an optical element and a mounting surface to be abutted against the optical plug for optically coupling the optical plug and the optical element; and a holder having a leaf spring that forces the optical plug to the mounting surface of the receptacle unit, a window section for passing the optical fiber, and a fiber support section disposed at a position near the window section for affixing the optical fiber thereto, wherein the holder is engaged with the receptacle unit to connect the receptacle unit and the optical plug in one piece.

1. Technical Field
The present invention relates to optical modules that are used for optical communications.
2. Related Art
As a typical example of an optical module that is used for optical communications optical module, an optical module described in Japanese laid-open patent application JP-A-2003-207694 (patent document 1) is known. The optical module described in the above document uses a structure in which an optical fiber connector with an array of optical fibers being bonded thereto is pushed toward a package by a clamp thereby affixing the optical fiber connector to the package.
However, in the optical module described above, the optical fiber connector, the clamp and the package are composed as separate and independent members, such that the work in assembling these members is complex. Also, when an external force (such as, a force to pull up) is applied to the optical fibers, positions between the optical fiber connector, the clamp and the package would likely be shifted from one another, which may lower the optical coupling efficiency.


A zero-pressure accumulating conveyor including a bed defined by rotatable rollers mounted in parallel sidewalls and powered by an endless drive chain. Pneumatic actuators lift the drive chain into engagement with the rollers to empower same. Sensor rollers divide the bed into distinct zones. Sensor rollers are retained in operative position relative to the conveyor bed by unique sensor brackets. A primary sensor roller bracket includes a bore with a piston movable there within; the cooperating secondary sensor roller bracket is spring biased in a first direction. Valves, and pneumatic circuitry controlled by such valves, extend along the length of the conveyor. Such valves are operated by the primary sensor roller brackets to regulate the flow of air pressure into the bores of the brackets and into the actuators. The actuators, when the pressure therein is bled-off, allow the chain in a particular zone to drop out of contact with the rotatable rollers. When the bore in the primary sensor roller bracket is pressurized, the bracket moves in an arc that forces the sensor roller below the plane of the conveyor. In such position, the sensor roller is not actuated as items travel thereover, and the life of the accumulating conveyor is significantly extended.

Powered accumulating conveyors are utilized wherever sorting, handling, processing, or other considerations, require that the conveyed items either (1) be stopped, or (2) bunched up, before proceeding down the conveyor bed. Conventional accumulating conveyors, which may be a hundred or more feet in length, are usually divided into "zones" that are nominally thirty-six inches in length. Each zone has a mechanism, such as a sensor roller, a mechanical trigger, a pneumatic switch, a photodetector, etc. that engages, and disengages, the driving power to the rollers of the preceding zone. When an accumulation operation is initiated, an external signal (which may be provided manually by a human operator or automatically by a timer control, or a computer program) disengages the rollers of the last, or discharge, zone. When the next item travelling down the conveyor bed depresses the sensor in the discharge zone, the sensor disengages the drive mechanism in the preceding upstream zone. When an item contacts the sensor in the preceding upstream zone, the process is repeated, in a series of steps, in each preceding upstream zone.
To illustrate, U.S. Pat. No. 3,612,248, granted Oct. 12, 1971, to Charles W. Wallis, discloses an accumulating roller conveyor comprising a plurality of longitudinally spaced, transversely extending article carrying rollers 10 with a belt 11 positioned beneath the rollers. Pressure rollers 12 are normally held in position against the belt to press the belt against the article carrying rollers by expansible chambers (30) to which fluid is supplied. A fluidic switch (16) is provided along the path of the articles, and when an article is stopped in position overlying the switch, the fluidic switch functions to deflate the expansible Chamber, permitting the pressure rollers to move away from the belt, so that rotation of the article-carrying rollers is interrupted.
U.S. Pat. No. 3,768,630, granted Oct. 30, 1973 to R. A. Inwood et al, discloses a powered roller accumulator conveyor having a powered propelling member, such as belt 16, passing through a plurality of independent accumulating zones (zones A, B, C, etc.) arranged along the conveyor. The propelling member is shiftable between driving, and non-driving, positions (compare FIGS. 3 and 4), with respect to the powered rollers 14 by vertically. shiftable, supporting rollers 18, operated by pneumatically powered actuators, such as tube-like member 30 and support plate 32, that engage one end of shaft 20 for roller 18. Each actuator is controlled by a series of valves 100 connected to a source 122 of fluid pressure, as shown schematically in FIGS. 7 and 8.
In the accumulating position of FIG. 7, each actuator is connected through an article-detecting sensor-operated valve 44 to the source of fluid pressure. The plunger 66 of valve 44 is influenced by sensor roller 49 that pivots flange 58 relative to the plunger, when a parcel contacts the roller. The shank 99 of the plunger 66 cooperates with ball valve 86 to control the flow of fluid away from the actuator 30. Each sensing assembly 46 is biased upwardly by spring 62 above the plane of the pressure rollers to be contacted by each object moving along the accumulator conveyor, as shown in FIG. 2. In an override or discharge position, shuttle valves 100 associated with each actuator are series connected to the source of fluid pressure, through a main control valve (such as three-way valve 131). The valves and are operative to direct the flow of fluid from the sensor operated valve 44, to energize each of the actuators 30, in each of the zones, to shift all of the operating zones into driving position.
U.S. Pat. No. 3,840,110, granted Oct. 8, 1974, to R. P. Molt et al, discloses a live roller, zero pressure accumulation conveyor 11, including a drive shaft 16 and a plurality of axially aligned countershafts 20. Each countershaft is driven by the drive shaft through a clutch 25 for selective power transmission to individual groups of conveyor rollers 14. Each group of rollers has, at its downstream end, a trigger device 51 (FIGS. 8 and 9) which senses the presence of a conveyed article. The trigger devices, which are operatively associated with air valves 52, 53, operate to selectively engage, and disengage, the clutch associated therewith, to achieve, and maintain, the desired spicing between articles being transported on the conveyor. Preferably, dual trigger devices (51x; 51y) are used in a manner which requires coincident actuation of both trigger devices before the clutch associated with a given group of rollers is disengaged (note column 3, line 63--column 4, line 5).
U.S. Pat. No. 4,108,303, granted Aug. 22, 1978, to R. K. Vogt and M. A. Heit, discloses an accumulator conveyor that includes a plurality of article accumulating zones A-E extending between the infeed and discharge ends of the conveyor. Each zone of the conveyor includes at least one power transmission assembly 17. All of the assemblies are powered by a single flexible drive member, such as an endless chain 56a, 56b. Each power transmission assembly includes a fluid ram 36, with a flexible diaphragm 58, which cooperates with a power wheel 37 to move that power wheel into, and out of, driving engagement with the article propelling member(s), such as rollers 11, within the zone that it serves. Operation of the transmission assemblies is controlled by a fluid control circuit 80. The fluid control circuit is influenced by sensor devices 18, which provide sensor valve 33, with a mechanical signal indicating whether, or not, an article is present, or absent, from a particular zone; the signal activates, or deactivates, the transmission assemblies 17 within the zone. As shown in FIG. 1, each sensor device 18 includes a sensor roller 19, a bracket 20, and a spring 28 for urging the sensor device to an operative position slightly above the plane of the upper surface of the rollers and/or roller bed.
Other accumulator conveyors are disclosed in U.S. Pat. No. 4,109,783, granted Aug. 29, 1978, to Robert K. Vogt; in U.S. Pat. Nos. 4,344,527 and 4,473,149, granted to Robert K. Vogt and Martin A. Heit, on Aug. 17, 1982 and Sep. 25, 1984, respectively.


A testing device that tests an electronic device includes a detection-voltage outputting unit operable to output a current detection voltage based on a power source current that the electronic device receives from a power source, a transmission line operable to transmit the current detection voltage, a detection amplifier operable to output an amplifier output voltage based on the current detection voltage received through the transmission line, a switching unit operable to select whether the current detection voltage is supplied to the detection amplifier, an integrator operable to output an integral value that is obtained by integrating values based on the amplifier output voltage, and a decision unit operable to decide whether the electronic device is good or bad based on the integral value.

1. Field of the Invention
The present invention relates to a testing device and a testing method.
2. Description of Related Art
Conventionally, testing devices that measure a power source current in a device under test using an integrator are known as disclosed, for example, in Japanese Patent Laid-Open No. 2001-324552 and Japanese Patent Laid-Open No. 2000-241454. In these testing devices, a current detecting unit that detects the power source current and a current-voltage converting unit that outputs a voltage according to the current value detected by the current detecting unit have been provided in a device power source unit that supplies the power source current to the device under test.
However, when testing an electronic device such as large-scale integrated circuits, there was not space sufficient to mount a number of electronic circuits in the vicinity of the electronic device in some cases. In this case, it is difficult that the device power source unit is provided in the vicinity of the device under test. Therefore, it was difficult to measure the power source current that varies at high speed in the device under test with high precision, in some cases.
Therefore, it is an object of the present invention to provide a testing device, a testing method, and a current measuring device that can solve the foregoing problems. The above and other objects can be achieved by combinations described in the independent claims. The dependent claims define further advantageous and exemplary combinations of the present invention.

Testing device and testing method for testing an electronic device


The ultrasonic diagnostic apparatus according to the present embodiment includes processing circuitry. The processing circuitry is configured to: acquire multiple position data associated with respective multiple two-dimensional image data of ultrasonic related to multiple cross sections; smooth the acquired multiple position data; and arrange the multiple two-dimensional image data in accordance with the smoothed multiple position data to generate volume data.

In the medical field, an ultrasonic diagnostic apparatus is used for imaging the inside of a subject using ultrasonic waves generated by multiple transducers of an ultrasonic probe. The ultrasonic diagnostic apparatus causes the ultrasonic probe, which is connected to the ultrasonic diagnostic apparatus, to transmit ultrasonic waves into the subject, generates an echo signal based on a reflected wave, and acquires a desired ultrasonic image by image processing.
The ultrasonic diagnostic apparatus acquires multiple two-dimensional image data with different cross sections and respective multiple position data by moving-operating the ultrasonic probe, and arranges the multiple two-dimensional image data based on the respective multiple position data to generate volume data.

Ultrasonic diagnostic apparatus, medical image processing apparatus, and non-transitory computer medium storing computer program


A developing device includes a bearing member for rotatably supporting a developing roller for supplying developer to an electrostatic latent image and a holder for holding the bearing, which are positioned with respect to a container for containing the developer by use of a positioning member.

1. Field of the Invention
The present invention relates to a developing device used in an image forming apparatus such as an electrophotographic copying machine, an electrophotographic laser beam printer and the like, and a process cartridge including an image bearing member and such developing device and removable with respect to the image forming apparatus.
2. Related Background Art
As shown in FIG. 4, a developing device 3 incorporated into a process cartridge C comprises a container 6 for containing toner therein, an agitating member 7 for agitating the toner in the container 6, a developing roller 9 arranged in parallel with an electrophotographic photosensitive member 1 and rotated in a direction shown by the arrow R1, a magnet roller 10 arranged within the developing roller 9, and an elastic blade 11 for regulating an amount of the toner which is fed out from the container 6 by the developing roller 9 and is conveyed toward a developing zone where an electrostatic image is developed.
As shown in FIG. 5, holders 12L, 12R are secured to left and right end walls of the container 6 of the developing device 3 by screws 13. (In the specification, the terms "left" and "right" are referred to with respect to a longitudinal direction of the developing roller.) The holders 12L, 12R have central supporting holes 15L, 15R, respectively, by which the magnet roller 10 is positioned at a fixed position. Further, the developing roller 9 is rotatably supported by the holders 12L, 12R via bearings 17L, 17R firmly fitted on inner peripheral supporting surfaces 16L, 16R of the holders 12L, 12R. The developing roller 9 comprises a cylindrical sleeve member 19, and flange members 20L, 20R secured to left and right ends of the sleeve member. Shaft portions of the flange members 20L, 20R are firmly fitted in the bearings 17L, 17R.
Further, between the left and right ends of the sleeve member 19, and the bearings 17L, 17R, there are disposed spacer rings 21L, 21R for regulating an undesired movement of the developing roller 9 in the left and right direction. Between the spacer rings, side seal members 22L, 22R made of felt or the like are disposed between the sleeve member 19 and the container 6 to seal the clearance between these members 19, 6. The side seal members 22L, 22R serve to prevent the toner in the container 6 from leaking toward both ends of the developing roller 9.
The developing roller 9 is driven via a gear 23 secured to the left flange member 20L. A rotational driving force is transmitted from a drive source (not shown) to the gear 23 via a transmitting mechanism (not shown). As shown in FIG. 4, the elastic blade 11 secured to the container 6 is elastically urged against the outer peripheral surface of the developing roller 9 along the longitudinal direction of the latter.
However, in the above-mentioned conventional technique, although the magnet roller 10 could be attached to the left and right holders 12L, 12R with high accuracy, it was difficult to mount the developing roller 9 within the left and right holders 12L, 12R and accordingly within the container 6 with high accuracy, with the result that it was feared that the delicate vibration in the rotation of the developing roller 9 arose.
Incidentally, the poor mounting accuracy of the developing roller 9 with respect to the container 6 is caused by the delicate clearance (assembling allowance) between the holders 12L, 12R and the bearings 17L, 17R. That is to say, it is necessary to provide a moderate clearance, which may be minimum, for permitting the assembling and disassembling, between the outer peripheral surfaces of the bearings 17L, 17R and the inner peripheral supporting surfaces (fitting surfaces) 16L, 16R of the holders 12L, 12R, and this clearance causes the vibration during the rotation of the developing roller 9. However, if such clearance is omitted, the assembling and disassembling operations will be made troublesome and difficult; to the contrary, the provision of such clearance worsens the accuracy of the rotation of the developing roller 9.
Due to the above-mentioned vibration or play, the positioning accuracy of the developing roller 9 with respect to the magnet roller 10, elastic blade 11, side seal members 22L, 22R and the photosensitive member 2 is worsened, thus generating the poor accurate positionings regarding the latters, which cause the unevenness in application of toner t onto the developing roller 9, the unevenness in thickness of a layer of the toner t, leakage of the toner t, and the unevenness in a toner image on the photosensitive member 2, respectively. Further, the unevenness in the quality of a copied image and the penetration of the toner t into undesired zones are caused.

Developing device having bearing for supporting a developing roller


A method for contactless withdrawal at an automated teller machine includes: receiving, by a receiver of a computing device, a first signal indicating proximity to a first predetermined geographic location; displaying, by a display interfaced with the computing device, a prompt associated with the predetermined geographic location; receiving, by an input device interfaced with the computing device, one or more parameters and a credential selection; receiving, by the computing device, a second signal indicating proximity to a second predetermined geographic location; and transmitting, by a transmitter of the computing device, at least the one or more parameters and credentials associated with the credential selection to an automated teller machine located at the second predetermined geographic location.

Automated teller machines (ATMs) were created to provide customers of financial institutions with greater convenience. Rather than having to find a branch, go inside of the branch, wait for a teller, and supply paperwork in order to make a withdrawal from an account, a customer could go to an ATM, insert their card, and make a few quick selections to receive their cash and be on their way. The size and self-service nature of ATMs made them significantly more accessible and convenient for customers than traditional brick and mortar branches.
However, ATMs are not without their flaws. Most notably, skimming devices have become more sophisticated over time, often being undetectable to many customers who have their account details compromised when using an ATM. Less dangerous but no less inconvenient, ATMs that require a card be physically inserted often pose a risk that the customer may inadvertently leave their card at the ATM. In addition, foreign travelers may desire the use of an ATM but be unfamiliar with the local language and may thus struggle to make a withdrawal.
Some solutions have been created to enable a customer to make a withdrawal from an ATM without presenting their credit card. Such solutions may protect the customer against leaving their card, and, in some implementations, may be useful against skimming, but still require the customer to perform actions on the ATM itself. As such, these solutions still rely on the customer being able to understand the available languages for the ATM and may still take significant time for operation thereof.
Thus, there is a need for a technical solution to enable a completely contactless withdrawal experience at an ATM that requires little, or in some cases no, input on the ATM itself on the part of the customer.

Method and system for contactless withdrawal from an ATM


The present invention provides a method for reference signal dropping and an apparatus for the method. A method for CSI-RS dropping comprises receiving first CSI-RS configuration information including sub-frame information which is transmission resource information of a first CSI-RS and through which the first CSI-RS information is transmitted and resource element information which contains the first CSI-RS; receiving second CSI-RS configuration information including sub-frame information which is transmission resource information of a second CSI-RS and through which the second CSI-RS is transmitted and resource element information which contains the second CSI-RS; and in case transmission resources of the first CSI-RS according to the first CSI-RS configuration and transmission resources of the second CSI-RS according to the second CSI-RS configuration overlap with each other, determining according to a priority order whether a CSI-RS received from the overlapping transmission resources corresponds to the first or the second CSI-RS.

Data transmission rate is rapidly growing these days. The high data transmission rate is mainly due to advent and wide deployment of machine-to-machine (M2M) communication and various types of devices requiring high data transmission rate such as smart phones, tablet PCs, and the like. To meet the high data transmission rate required, novel technologies are recently getting attention, including carrier aggregation technology, cognitive radio technology, and the like which utilize more frequency bands efficiently; and multiple antenna technology, multiple base station collaboration technology, and the like for increasing data capacity with limited frequency resources.
Also, the current trend for wireless communication networks is toward increasing density of nodes that can be accessed in the vicinity of the user′ current location. Here, a node stands for an antenna or a group of antennas spaced apart by more than a predetermined distance from each other in a distributed antenna system (DAS); however, it can be used in a broader sense rather than limited to the above definition. In other words, a node may correspond to a pico-cell base station (PeNB), a home base station (HeNB), a remote radio head (RRH), a remote radio unit (RRU), a repeater, and so on. A wireless communication system incorporating high density of nodes can provide a lot higher system performance due to collaboration among the nodes. That is, compared with the case where each node operates as an independent base station (namely, a base station (BS), an advanced BS (ABS), a Node-B (NB), an eNode-B (eNB), an access point (AP), and so on) showing no collaboration between each other, if one control station manages transmission and reception of individual nodes and thus, the nodes operate as an antenna or a group of antennas in a cell, vastly superior performance can be achieved. In what follows, a wireless communication system incorporating a plurality of nodes is called a multiple node system.
A node can be defined not only for a group of antennas spaced apart at regular intervals but also for an arbitrary group of antennas regardless of intervals among the antennas. For example, a base station comprising cross polarized antennas can be regarded to consist of nodes of H-pol antennas and nodes of V-pol antennas.
In a multiple node system, different nodes may be used to transmit signals according to the respective user equipment types; at the same time, a plurality of nodes may be employed for the transmission. At this time, reference signals different from each other can be transmitted for each of the node types. In this case, a user equipment measures channel status between nodes by using a plurality of reference signals and channel status information can be obtained as feedback periodically or aperiodically.

Method and apparatus of reference signal dropping


A method and apparatus for providing positive fixation of medical components to a portion of pericardial tissue via both vacuum- and/or mechanically-assisted means. A source of vacuum couples via a lumen to a recessed portion of a body structure deployed into the pericardial space. The recessed portion is adapted to form a seal around its periphery with adjacent pericardial tissue so that when the recessed portion is evacuated, the tissue is drawn into the recessed portion. Then, a sharpened instrument, such as a stylet, is deployed through the lumen and pierces the tissue, thus anchoring the body structure. A source of fluid may also be included for delivery to the pericardial space (e.g., contrast media; saline solution; biological, genetic and pharmaceutical substances and the like).

Certain embodiments in the present disclosure pertain to medical component delivery and more particularly to tools for delivering active medical components for chronic attachment within the pericardial space.
In certain instances, a patient suffering from bradycardia, tachyarrhythmia and/or heart failure will benefit from electrical stimulation pacing and/or defibrillation electrodes implanted on an epicardial surface of the patient's heart.
Minimally invasive methods for accessing the epicardial surface, which is enclosed within a pericardial sac, have recently been developed; these methods provide for piercing through the pericardial sac in order to access the epicardial surface; an example of one such method is described in commonly assigned U.S. Pat. No.6,837,848. These methods may be used by way of a mini-thoracotomy or in conjunction with a trocar, canula or catheter that has been passed, via a percutaneous incision, through an interstitial space between the patient's ribs or by a sub-xiphoid approach; those skilled in the art are familiar with these techniques.
Once access to the epicardial surface is established, the implanting physician may desire to implant into the pericardial space a medical electrical lead, including an appropriate electrode configuration and/or one or more physiologic sensors suited to the patient's need. The physician will almost always need to maneuver the electrode-bearing portion of the lead within the space in order to implant the components at an appropriate location and in a way to provide effective and stable chronic cardiac therapy and/or monitoring of various physiologic parameters.

Apparatus and methods for vacuum- and mechanically-assisted fixation of medical electrical leads


Disclosed are compounds of the formula: ##STR1## or the pharmaceutically acceptable addition salts thereof wherein: R.sub.1 is halogen or C.sub.1 -C.sub.4 alkyl; and. R.sub.2 and R.sub.3 are the same or different and represent hydrogen, halogen, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, alkylthio, hydroxy, amino, mono(C.sub.1 -C.sub.4)alkylamino, di(C.sub.1 -C.sub.4)alkylamino, or PA1 R.sub.2 and R.sub.3 together represent a 4 carbon alkenylene moiety that together with the phenyl ring to which they are attached form a naphthyl moiety, PA1 which compounds are useful in the treatment of neuropsycological diseases such as schizophrenia, psychotic depression and mania.

1. Field of the Invention
This invention relates to certain 1-phenyl-4-benzylpiperazines and pharmaceutical compositions containing them. It also relates to the use of such compounds in the treatment or prevention of psychotic disorders such as schizophrenia and other central nervous system diseases. The use of the compounds of this invention to the treatment of these disorders is indicated by the ability of the compounds to bind selectively to dopamine receptor subtypes.
2. Description of the Related Art
The therapeutic effect of conventional antipsychotics, known as neuroleptics, is generally believed to be exerted through blockade of dopamine receptors. However, neuroleptics are frequently responsible for undesirable extrapyramidal side effects (EPS) and tardive dyskinesias, which are attributed to blockade of D2 receptors in the striatal region of the brain. The dopamine D4 receptor subtype has recently been identified (Van Tol, H. H. et al., Nature, 1991, 350, 610). Its unique localization in limbic brain areas and its differential recognition of various antipsychotics suggest that the D4 receptor play a role in the etiology of schizophrenia. Selective D4 antagonists are effective antipsychotics free from the neurological side effects displayed by conventional neuroleptics.
Since dopamine D4 receptors are concentrated in the limbic system which controls cognition and emotion, compounds which interact with these receptors have utility in the treatment of cognitive disorders. Such disorders include the cognitive deficits which are a significant component of the negative symptoms (social withdrawal and unresponsiveness) of schizophrenia. Other disorders involving memory impairment or attention deficit disorders can also be treated with compounds that interact specifically with the dopamine D4 receptor subtype.
Japanese patent JP 47017306 discloses m-trifluoromethylphenyl benzyl piperazines as tranquilizers and analgetic agents. Nucl. Med. Biol. 20(6), 777-94, 1993, discloses radiolabelled 1-(4-{fluoro-18F}phenyl!methyl)-4-(3-trifluoromethyl!phenylpiperazine as an imaging agent.
J. Med. Chem. 37, 1060-1062, 1994, and International Application No. WO 9304684 discloses 4-arylpiperazines and 4-arylpiperidines.
J. Med. Chem. 11, 1144-1150, 1968, discloses certain 1-phenyl-4-benzyl piperazines as antihypertensive agents.

1-phenyl-4-benzylpiperazines: dopamine receptor subtype specific ligands


The photocurable resin composition in the first aspect of the invention comprises, as essential components, (A) a binder resin having photopolymerizable functional groups and (B) inorganic superfine particles in the order of sub-micron which can be dispersed in a colloidal form; the photocurable resin composition in the second aspect comprises, as essential components, (C) a binder resin containing photopolymerizable functional groups and (D) hydrophobic fine silica particles; and the photocurable resin composition in the third aspect comprises, as essential components, (E) a binder resin containing acrylic resin and urethane acrylate resin and/or polyester acrylate having photopolymerizable functional groups and (F) an organometallic coupling agent. These photocurable resin compositions are excellent not only in fitting to the shape of a cavity in a stamper complementary to a finely embossed pattern on an optical article, thus enabling rapidly and accurately shaping a finely embossed pattern, but also in form retention after shaping and resistance to blocking, thus enabling exposure to light after removal of the stamper and storage in a rolled form to achieve excellent successive producibility.

1. Field of the Invention
The present invention relates to a photocurable resin composition excellent in shaping and form retention, which is particularly suitable for formation of a finely embossed surface structure on an optical article, a method of forming a finely embossed pattern by using the composition, a finely embossed pattern receiptor (for example, a finely embossed pattern-forming sheet or a finely embossed pattern transfer sheet), an optical article and a stamper.
2. Description of the Related Art
Conventionally, a photocurable resin composition (coating) is applied onto a support such as polyester film to form a photocurable resin layer thereon, and then the surface of this photocurable resin layer is provided with various finely embossed patterns capable of exhibiting optical functions and exposed to active energy rays such as UV rays or electron rays to cure the resin layer, followed by laminating a metal-deposited layer or a layer having different refractive index on the surface of the formed embossed pattern, to form an optical article such as a diffraction grating or a relief hologram.
The optical article having a finely embossed pattern thereon is required of general properties such as embossed pattern accuracy, transparency, strength, resistance to wearing, heat resistance, water resistance, chemical resistance, adhesion to a substrate, flexibility or the like depending on its purpose. Accordingly, a photocurable resin composition forming the optical article should, first of all, satisfy these performance requirements.
The conventionally known method of forming a fine relief surface structure of an optical article includes the so-called 2P method (photo polymer method) for formation of e.g. a relief hologram wherein a press stamper (referred to hereinafter as "stamper") prepared from a master hologram having a desired finely embossed pattern formed thereon is pressure-welded with a liquid photocurable resin layer formed by applying a liquid photocurable resin composition onto a transparent support such as polyester film, and simultaneously irradiated at the side of the support with light to cure the resin layer, followed by removing the stamper therefrom.
For example, Japanese examined Patent Publication No. 4-5681 describes a photocurable resin composition usable in the 2P method, which comprises an oligomer having a hard segment (H), a soft segment (S) and a crosslinkable-terminal segment (E). This oligomer composition has the following advantages: an embossed pattern from a mold can be accurately reproduced; the composition is suitable for mass production because embossing can be successively carried out using one press stamper to produce a large number of articles; it is also excellent in releasability after curing by exposure to light and thus suitable for mass production in this respect too; optical articles excellent in strength, flexibility, optical transparency or uniformity, and resistance to common solvent can be obtained.
In the 2P method, however, there are the following problems: because the backside of the support is irradiated with light, curing is insufficient when the support is light-absorptive; the process is time-consuming because the stamper cannot be removed until curing is completed; because the photocurable resin layer is liquid, bubbles are easily introduced between the support and the stamper, to cause defects; and when the stamper is removed from the cured resin layer, the surface of the resin layer can string thus causing surface roughness.
As another method, there is a method wherein a photocurable resin composition which is highly viscous or solid at room temperature is applied onto a support to form a photocurable resin layer, then a stamper is pressure-welded therewith and then removed, and thereafter the photocurable resin layer is cured by irradiation with light (Japanese examined Patent Publication No. 5-46063, Japanese examined Patent Publication No. 6-85103).
In this method, there are the following advantages: the photocurable resin layer is irradiated directly with light, so the resin can be sufficiently cured; since the photocurable resin composition is highly viscous or solid, the support after coating can be rolled and stored or conveyed, that is, coating and reproduction can be carried out in separate processes; after the stamper is removed, the resin can be irradiated with light, so pressing with the stamper and curing can be carried out in separate processes; because bubbles are hardly introduced between the photocurable resin layer and the stamper, accurate patterning can be carried out; and when the stamper is removed from the photocurable resin layer, the surface of the resin layer hardly strings.
In the method of using the photocurable resin composition which is highly viscous or solid at room temperature, however, there are the following problems: because the stamper is removed from the resin layer in a un-cured state, apart of the photocurable resin composition easily adheres to and remains on the cavity of the stamper (phenomenon of partial remaining on the plate); accurate shaping cannot be achieved because as an embossed pattern to be reproduced is finer, the photocurable resin composition is more hardly filled in the cavity of the stamper; and after the stamper is removed, the resin layer in a un-cured state is irradiated with light, so the pattern can be easily deformed until curing is finished.
Japanese Patent Application Laid-open No. 2000-63459 describes a photocurable resin composition comprising a bulky group-containing urethane-modified acrylic resin and a release agent as essential ingredients. This photocurable resin composition comprises an urethane-modified acrylic polymer having crosslinkable groups, and has advantages such as accurate reproduction of an embossed pattern with a mold, suitability for mass production by virtue of excellent releasability from the mold even before curing, and other excellent general properties such as transparency, strength, resistance to wearing, heat resistance, water resistance, chemical resistance, adhesion to a base meterial, flexibility etc. Further, there is another advantage of excellent fitting after curing to the flex, expansion and contraction of the substrate.
According to the invention in Japanese Patent Application Laid-open No. 2000-63459 mentioned above, the photocurable resin composition comprising urethane-modified acrylic resin is applied onto a substrate and dried if necessary to form a photocurable resin layer, and a press stamper is pressed thereon (embossing), to form the embossed pattern of the press stamper (correctly a pattern complementary to the embossed pattern of the press stamper) on the resin layer, and thereafter the press stamper is removed from the resin layer, and then the resin is cured by exposure to light to fix the embossed pattern. Accordingly, embossing can be successively carried out without using the press stamper in the light exposure process, while light exposure is not hindered by the press stamper, and thus uniform and sufficient light exposure can be carried out in a short time.
When the stamper is removed from the photocurable resin layer in a un-cured state, a part of the photocurable resin adheres to and remains on the cavity of the stamper (phenomenon of partial remaining on the plate), thus causing a problem that successive and accurate embossing is hardly carried out using the same stamper. Against this problem, the photocurable resin composition described in the above Japanese Patent Application Laid-open No. 2000-63459 has the advantage that the photocurable resin composition is excellent in releasability even in a un-cured state and hardly adheres to the cavity of the stamper.
However, if as shown in the invention in Japanese Patent Application Laid-open No. 2000-63459 supra, the photocurable resin composition is applied onto a substrate and dried if necessary to form a layer on which a stamper is then pressed, the flexibility and fluidity of the photocurable resin composition can be insufficient so that the resin may not sufficiently spread throughout the cavity space, thus failing to accurately form the desired finely embossed pattern.
To improve the ability of a photocurable resin composition to be shaped (easiness of shaping and accuracy of shaping), there is a method of pressing a stamper with a layer comprising a photocurable resin composition formed on a support (that is, in a stamping or embossing process) wherein pressing is carried out under heating at a relatively high temperature and/or the speed of feeding the support is decreased to prolong the pressing time. However, there are problems such as damage to the stamper and deterioration in the support by increasing the pressing temperature and a drop in production efficiency by decreasing the speed of endowing a finely embossed pattern.
In an alternative method, a photocurable resin composition easily softened at room temperature can be used to improve easiness of shaping of a layer comprising the photocurable resin composition. However, if the photocurable resin composition easily softened at room temperature is used, a roll produced by rolling its photocurable resin layer formed on a support is sticky and liable to blocking, so there is inconvenience that it cannot be stored.
Further, even if the finely embossed pattern on the stamper can be accurately formed on the photocurable resin layer, the finely embossed pattern formed on the photocurable resin layer, when removed in a un-cured state from the stamper and exposed to light, is rounded and deformed to collapse its shape (called "sagging") due to the elasticity of the resin itself during the process of forming the finely embossed pattern. Such collapse of the shape is attributable mainly to e.g. heat transferred from the stamper to the un-cured photocurable resin layer upon heat embossing, heat upon UV irradiation of the photocurable resin layer having the finely embossed pattern formed thereon, etc.
For accurate and efficient reproduction of a finely embossed pattern having optical functions by using the photocurable resin composition, it is therefore necessary that the photocurable resin composition in the form of a layer containing less or no solvent has the ability to form a film sufficiently, to be shaped by fitting completely to the cavity of the stamper and to retain the sharp form formed by the press stamper even in the process after removal of the stamper from the photocurable resin.
In recent years, optical finely embossed patterns are becoming very complicate as precision processing technology is improved. These complicate optical finely embossed patterns can be used to form holograms of complicate design, information-recording elements, or optical elements highly regulating reflection, transmission, scattering, polarization, convergence or interference of whole rays and/or a light at a specific wavelength. However, such complicate and finely embossed patterns have narrower embossed pitches and/or deeper embossed portions than those of relatively simple holograms in the prior-art, thus making accurate reproduction more difficult, and satisfactory functions cannot be exhibited without reproduction of higher accuracy than in reproduction of relatively simple holograms in the prior-art.
Such complicate optical finely embossed patterns, even using the resin composition described in Japanese Patent Application Laid-open No. 2000-63459 supra, can not avoid the problems of the partial remaining of resin, the shaping ability of resin and the collapse of the pattern, and thus accurate reproduction is very difficult.
On one hand, Japanese Patent Application Laid-open No. 7-502128 describes an optical element having a surface structure obtained by embossing a transparent composite material having a 3-dimensional skeleton of inorganic or organic modified inorganic components in the form of nano-scale particles in a polymer matrix. According to this prior-art invention, shrink in the procedures of embossing and curing can be minimized. In the present invention, however, a photo- or thermosetting resin composition containing inorganic or organic modified inorganic components in the form of nano-scale particles is applied onto a substrate to form a photo- or thermosetting resin layer thereon, then cured by light exposure or heating while an embossing device is pressed on the resin layer, and subjected if necessary to pre-curing for increasing viscosity before attachment of the embossing device and/or post-curing for completion of copolymerization after removal of the embossing device. In this prior-art invention, basically the photo- or thermosetting resin layer is cured while the embossing device is pressed thereon, and it is not described therein that when the resin layer being still in the un-cured state is removed from the embossing device, collapse of the shape occurs due to the elasticity of the resin itself.

Photocurable resin composition, finely embossed pattern-forming sheet, finely embossed transfer sheet, optical article, stamper and method of forming finely embossed pattern