A case for receiving a breast prosthesis includes a main body and a cover for closing the main body, with the main body being filled with elastic material such as to include a depression which opens toward the cover. The depression is funnel-shaped in unstressed state i.e. when the case is empty, and essentially conforms to the configuration of a breast prosthesis when the latter is placed in the case.

The invention refers to a case for receiving a breast prosthesis, and in particular to a case of the type having a main body which is closable by a cover and is filled with elastic material in a manner to include a depression which opens towards the cover.
A case of this type is commercially available and includes a square carrier bag of plastic material which contains a foamed body. Provided in the foamed body is a concave recess for receiving in form-fitting manner a breast prosthesis so that the tip of the prosthesis points to the bottom of the case. A part of the top of the carrier bag constitutes a cover with two zippers for opening and closing and prevents the prosthesis placed in the concave recess from falling out of the recess. A carrying strap by which both zippers are connected allows a simultaneous use of the zippers and serves as a handle.
A case of this type has the drawback that the foamed body of the carrier bag is molded as a negative to precisely conform to the configuration and size of a particular breast prosthesis. Thus, when using this case for a different configuration and/or size of a breast prosthesis, a different foamed body with the negative configuration of such breast prosthesis must be inserted in the case. Consequently, this prior art case requires a particular foam body for each configuration and size of a breast prosthesis. This requirement not only increases manufacturing costs for the case but also increases the storage costs since for each shape and size of a breast prosthesis, a respective case with a carrier bag and a foamed body must be made available. The user must therefore acquire a separate prosthesis case or at least a separate foamed body when changing the prosthesis shape and/or size for placement therein.

Dr. Helbig GmbH & Co Orthopadische Produkte KG


A system for managing data in a plurality of storage locations. In response to a least recently used algorithm wanting to move data from a cache to a storage location, an aging table is searched for an associated entry for the data. In response to finding the associated entry for the data in the aging table, an indicator is enabled on the data. In response to determining that the indicator is enabled on the data, the data is kept in the cache despite the least recently used algorithm wanting to move the data to the storage location.

1. Field of the Invention
The present invention relates generally to an improved data processing system and in particular to a method and system for processing data. Still more particularly, the present invention is directed to a computer implemented method, system, and computer usable program code for managing data in a cache.
2. Description of the Related Art
A cache is a section of memory that stores frequently used data by a processor. Typically, the processor uses the cache to reduce time required to access data from main memory. In other words, the cache is a memory bank that bridges main memory and the processor. The cache is faster, or has a reduced latency, than main memory and allows the processor to execute instructions and read and write data at higher speeds. However, the cache is small compared to the main memory, so space is at a premium. Instructions and data are transferred from main memory to the cache in lines or blocks, possibly using some kind of look-ahead algorithm.
A level 1 (L1) cache is a memory bank, such as processor registers, built into the processor chip. The L1, or primary cache, is the memory closest to the processor, itself. A level 2 (L2) cache is a secondary staging area that feeds the L1 cache. The L2 cache may also be built into the processor chip or may reside on a separate chip on the motherboard. If the L2 cache is built into the processor chip, then a cache on the motherboard may be a Level 3 (L3) cache. The L3 cache feeds the L2 cache, which feeds the L1 cache, which feeds the processor. In addition, the L1 cache is faster than the L2 cache, which is faster than the L3 cache, which is faster than main memory. In other words, the latency increases as the memory hierarchy moves away from the processor. So, keeping "hot" data close to the processor is a desirable condition.
When a processor needs data from main memory, the needed data is brought into the L2 cache. If the processor does not reference that data for a certain amount of time, a cache replacement mechanism moves that data out of the L2 cache into the L3 cache. If the processor again needs that data, then that data is moved back into the L2 cache from the L3 cache. On the other hand, if that data is not referenced in the L3 cache for a certain amount of time, then that data is moved out of the L3 cache back into main memory.
The Least Recently Used (LRU) algorithm is widely employed for data management in a cache. The LRU algorithm replaces a cache line in the cache that the processor has not referenced or accessed for the longest period of time. The LRU algorithm is based on an observation that cache lines, which the processor referenced in the recent past, will most likely be referenced again in the near future.
Currently, when a cache line is removed from the L2 cache, the cache line is moved to the L3 cache and is given the highest ranking in the L3 cache by the LRU algorithm because the cache line is the newest referenced entry in the L3 cache. However, a drawback with this current cache line ranking method is that it only takes into account that the removed cache line is the least recently used among the set of cache lines presently in the L2 cache. This current cache line ranking method does not take into account that during the time the removed cache line was resident in the L2 cache, the processor may have accessed that cache line more frequently than many of the other L2 cache lines. In other words, in terms of performance that cache line was "hot," but because the processor did not recently access that cache line in the L2 cache, that cache line is moved out to the L3 cache.
Removal of this once hot cache line from the L2 cache, and possibly from the L3 cache as well, may be due to the fact that many new memory references pushed that cache line out of the limited cache space. When the processor makes many new memory references, this once hot cache line falls victim to the LRU algorithm. The LRU algorithm pushes the once hot cache line out of the L2 and L3 caches to make room for these new entries. However, the processor may reference these new entries only once and then may again need to access the once hot cache line.
Therefore, it would be beneficial to have a computer implemented method, system, and computer usable program code for preserving a hot cache line in a lower level cache using an improved ranking mechanism to efficiently make use of premium cache space, while reducing latency.

Method and system for using upper cache history information to improve lower cache data replacement

International Business Machines Corporation


A method for testing a network interface is provided that includes generating a data pattern file based on a pseudocode file and testing the interface using the data pattern file. The pseudocode file defines an order for a plurality of data patterns in the data pattern file. The data pattern file is provided to a testing device that may test the interface using the data pattern file by applying the data patterns from the data pattern file to the interface.

The use of wireless communication devices and wireless networks has become increasingly widespread. As the use of wireless communication devices increases, products are being developed with complex network interfaces that require extensive testing to ensure acceptable performance in the network.
In order to thoroughly test a new interface, all data combinations should be tested to verify that the new design is robust and free of faults. Accomplishing this type of testing, however, requires complex data patterns that are unique to the new interface being tested, including data patterns that simulate interface impairment.
Conventional devices used for testing new interfaces only provide for limited impairment testing. Thus, these testing devices fail to provide complete coverage of all network conditions. For example, in a standard testing device for testing a high-level data link control (HDLC) interface, testing impairment of the interface is limited to the insertion of frame check sequence errors. Conventional test equipment systems do not provide an operator with a flexible method of applying customizes patterns of stimuli to a unit-under-test (UUT), such as an HDLC interface.
Therefore, there is a need in the art for an improved system for testing network interfaces. In particular, there is a need for a thorough test that incorporates essentially all valid data patterns that may be applied to a network interface without limiting impairment options and without requiring a designer to design every possible data pattern.

Method and system for testing a network interface


An interconnecting device for electrically interconnecting a number of device terminals to a number of board terminals. The interconnecting device includes a housing which has a number of contact receiving slots wherein each slot receives one of a number of contacts. A shielding layer is provided to enhance noise immunity by shielding each contact against electromagnetic interference (EMI). The shielding layer absorbs stray radiated EMI from each one of the number of contacts and dissipates the absorbed energy as thermal energy.

1. Field of the Invention
This invention relates to the field of electrical interconnecting systems. More particularly it relates to an integrated circuit operational or test socket incorporating a shielding layer in the socket to enhance noise immunity by absorbing and dissipating stray radiated electromagnetic energy (EMI).
2. Description of the Prior Art
Electromagnetic Interference (EMI) is a source of noise which can disrupt normal operation of electronic systems. Sources of EMI can include computer systems and electromechanical devices, and may also include signals from cellular phones, television or radio. Sources of EMI can also include cabling, power supplies, and integrated circuit boards. Electronic devices, such as computers, often generate high frequency signals and radiate electrical noise, which can couple to other electronic devices. EMI may leak out of or into interconnecting and multi-pin connectors or integrated circuit sockets used to couple integrated circuit devices to the integrated circuit boards within the electronic devices. As the device switching speed performance and power dissipation requirements for electronic devices used within computer systems continues to increase, the ability of the interconnecting and multi-pin connectors or integrated circuit sockets to provide high noise immunity during operation continues to decrease. The result is that the interconnecting and multi-pin connectors or integrated circuit sockets are not only increasingly susceptible to externally generated EMI, but are increasingly prolific sources of EMI as well.
Many attempts have been made in the prior art to improve EMI performance of computer systems. Shielding has been utilized which consists of extensive and cumbersome metallic elements having conduits for cables. The shielding elements are typically placed in close proximity to and surrounding the socket or the fixture. While this approach is effective, it is also bulky and expensive to implement. This approach, by incorporating the shielding elements, may also add substantial weight to a system. This is a concern for the avionics industry, where the size and weight of systems must be held to a minimum. A disadvantage with this approach however is that it attenuates EMI from external sources, and is wholly ineffective against EMI from internal proximal sources, such as between the terminals of a device.
Another approach for providing an EMI filter is shown in U.S. Pat. No. 5,528,205, issued Jun. 18, 1996, to Wong, which teaches an integrated and drop-in EMI filter which is made out of a ferrite material. The ferrite material has a cutaway space region configured to define a conductor winding portion and a through hole region configured to allow electrical conductors to pass through. Although this approach does filter EMI from externally generated sources, it has the disadvantage of being difficult to assemble and manufacture due to the construction of the winding. This approach may not be easily adapted to be integrated circuit device socket and would not provide proximally located shielding between individual conductor pins with the socket.
Another approach for providing filtering is seen in U.S. Pat. No. 4,761,147, issued Aug. 2, 1988 to Gauthier. Gauthier teaches a ferrite plate placed within the inner space formed by the front and rear shells of a multi-pin connector. This approach also filters EMI from externally generated sources. This approach has the ferrite plate connected to a point of reference potential to dissipate EMI coupled to the pins of the connector, but does not provide proximal shielding between connectors to prevent the EMI from being coupled to the connectors in the first place, and may not be easily adapted to an integrated circuit test socket.
Yet another approach is seen in U.S. Pat. No. 5,360,353, issued Nov. 1, 1994, to Kinoshita. Kinoshita teaches a concave portion being formed on the surface of a connector body, wherein an EMI filter array is fitted to the concave portion to be inserted between and connected to the contact terminals. This approach, however, is not integrated within the socket itself and requires an external element. This approach also does not provide proximal shielding between connectors to prevent EMI from being coupled to the connectors, and would not be easily adapted to an integrated circuit test socket.

Integrated circuit test socket with enhanced noise imminity


A process for preparing an ethylene polymer including the step of homopolymerizing ethylene or copolymerizing ethylene with one or more comonomers in a gas-phase polymerization reactor including a riser unit wherein growing polymer particles flow upwards under fluidization, fast fluidization or transport conditions and a downcomer wherein growing polymer particles flow downward in a densified form, wherein the hold-up of polymer particles in the downcomer is from 55 wt. % to 80 wt. % of the total hold-up of polymer particles in the gas-phase polymerization reactor.

Polymerizing olefins in circulating gas-phase polymerization reactor allows for the production of olefin polymers with a high productivity per unit volume of the reactor and with a high flexibility in the composition of the resulting polymers.
Producing polyolefins in gas-phase polymerization processes should avoid or at least to minimize the formation of agglomerates or chunks or of deposits on the reactor wall. In some instances, the agglomerates, chunks, or deposits falling off the reactor wall result in a quality reduction for the prepared olefin polymers and plugging of the product discharge system. In some instances, plugging of the products discharge system results in shutting down the polymerization process. In some instances, these effects are enhanced when the gas-phase alpha-olefin polymerization process is carried out in the presence of highly active catalysts. In some instances, the highly active catalysts are made from or contain the reaction product of an aluminum alkyl with a titanium compound supported on a magnesium halide. In some instances, the formation of such chunks or deposits occurs when the generated heat of polymerization is not dissipated adequately and local hot spots are formed.
In some instances, chunks or deposits are generated during homopolymerizing ethylene or copolymerizing ethylene with one or more comonomers. It is believed that the chucks or deposits result from the mass-referred heat of polymerization being about 50% higher in ethylene polymerization than in propylene polymerization.

This patent is subject to a terminal disclaimer.

Olefin polymerization process in a gas-phase reactor comprising a riser unit and a downcomer


Interpacket delay times are modified in full-duplex Ethernet network devices by calculating for each network station a delay interval based on a time to transmit a data packet at the network rate and a calculated time to transmit the data packet at a desired transmission rate. The network station waits the calculated delay time following a packet transmission before transmitting the next data packet, ensuring that the overall output transmission rate of the network station corresponds to the assigned desired transmission rate. The desired transmission rate is received as a media access control (MAC) control frame from a network management entity, such as a switched hub. Hence, each network station operates at the desired transmission rate, minimizing the occurrence of congestion and eliminating the necessity of PAUSE frames.

Many communications networks such as local area networks (LANs) use a network cable or other media to link network stations together on the network. Typically, each network station is free to communicate with other network stations on the network subject to the particular communications protocol used. However, when large amounts of data are transferred over networks, data congestion and data collisions often prevent the smooth transfer of data.
One solution to reduce data congestion and data collisions requires each network station to wait until data traffic on the media has temporarily subsided, providing a transmission window during which the network station can transmit its own data without collision. For example, the Ethernet protocol ISO/IEC 8802-3 (ANSI/IEEE Std. 802.3, 1993 edition) defines a half-duplex media access mechanism that permits all network stations to access the network channel with equality. Traffic is not distinguished or prioritized over the medium. According to this approach, each network station includes an Ethernet interface card that uses carrier-sense multiple-access with collision detection (CSMA/CD) to listen for traffic on the media. The absence of network traffic is detected by sensing a deassertion of a receive carrier on the media. A network station having data to send attempts to access the channel by waiting a predetermined time after the deassertion of a receive carrier on the media, known as the interpacket gap (IPG) interval.
Another approach has been to use a switched hub to marshal data flow on the network and allow network stations on the network to simultaneously transmit and receive data packets between each other without collisions. A full duplex environment has been proposed for Ethernet networks, referred to as IEEE 802.3.times., Full Duplex with Flow Control-Working Draft (0.3). The full duplex environment provides a two-way, point-to-point communication link between two network stations using a switched hub. Hence, two network stations can simultaneously transmit and receive Ethernet data packets between each other without collisions. However, network congestion occurs if a receiving network station or a switched hub is unable to receive data at the transmission rate of the transmitting network station. For example, traffic in a client-server environment is often dominated by client requests followed by a burst of frames from the server to the requesting client.
Although the full duplex environment enables the server to transmit packets while receiving requests from other clients, only a limited number of client requests can be output from the switched hub to the server. If the number of client requests exceeds the capacity of the hub switching port assigned to the server, some of the data packets will be lost. Alternatively, a client having limited buffer space may be unable to keep up with the transmission rate of the server, resulting in lost packets.
As an alternative to the CSMA/CD and switched hub approaches, various data flow control techniques have been implemented to regulate data flow on networks. One approach to reducing network congestion involves a sending network station temporarily suspending transmission of data packets. A proposed flow control arrangement for a full duplex environment, referred to as IEEE 802.3.times.[2], specifies generation of a flow control message, for example a PAUSE frame. A transmitting network station that receives the PAUSE frame enters a pause state in which no frames are sent on the network for a time interval specified in the PAUSE frame.
Another proposed flow control arrangement for a half duplex environment, referred to as "backpressure", causes a receiving network station to force a collision with the transmitting network station when the receive buffer of the receiving network station reaches a "receive buffer unavailable" state.
Although these approaches reduce data congestion and collisions, they also reduce the effective bandwidth of the network media. For example, if a full-duplex receiving network station repeatedly sends PAUSE frames specifying small pause intervals to a transmitting network station, the effective bandwidth of the media is reduced due to the transmission of a plurality of 64-byte PAUSE messages instead of data. If a switched hub has a transmit buffer for data to be sent to a network station, repeated transmission of PAUSE frames by the switched hub to that network station reduces the removal rate of the data from the transmit buffer. Hence, the transmit buffer containing the data for the network station may tend to overflow.
Network throughput may also be reduced if the specified pause interval is too long, resulting in the transmitting network station remaining idle after the receiving network station has eliminated the congestion.
Data loss may also occur if data packets are sent by the transmitting network station after generation of the PAUSE frame by the receiving network station. For example, the transmitting network station may send a number of data packets before receipt of the PAUSE frame due to propagation delays between the transmitting and receiving network stations. The network throughput is further reduced if upper layer protocol requires the last data to be resent.

Method and apparatus for regulating data flow in networks


A printing system is provided for color job matching of the output from a plurality of image marking engines. The system includes a first test image printed by a first image marking engine on a media document. The first test image having a data glyph and a plurality of reference patches. The system further includes a second test image printed by a second image marking engine on the media document. The second test image having a data glyph and a plurality of reference patches. The first and second test images are printed on the same side of the media document. A scanner is provided for scanning the media document. The scanned first and second test images provide calibration data for matching color correction tables of the first image marking engine and the second image marking engine, wherein the data glyph and the reference patches of the scanned image data are compared with retrieved color correction tables for generating compensation values based on a difference between the scanned image set-up data and the color correction tables for at least a first subsequent image document on the first image marking engine or the second image marking engine.

In a color xerographic printing system that comprises multiple xerographic engines or image marking engines, a problem of color consistency and color matching can arise between individual image marking engines of an integrated system and/or between the same image marking engine from one print job relative to another subsequent print job. The present disclosure is directed to a method and system for maintaining color consistency and color matching of each engine's output. The present disclosure provides an efficient system and method for providing color accuracy and/or color consistency for a single print job and/or from one print job to another print job utilizing multiple image marking engines while minimizing media consumption.

Color job output matching for a printing system


A rocking piston vacuum pump or compressor may have a sound attenuation assembly. The sound attenuation assembly may comprise a sound attenuation chamber. The chamber may have a first silencer disposed therein with sound dampening foam disposed therein. A second silencer may be disposed in series relative to the first silencer and may be disposed externally of the sound attenuation chamber.

Sound attenuation and vibration reduction are desired for rocking piston vacuum pumps and compressors. In medical and dental applications, multiple pieces of equipment may be in the same proximate location. As multiple pieces of equipment are used, the decibel level may increase. After reaching a certain decibel level, sound in a room may become distracting. Discussion between a health care provider and patient difficult. Further, the noise may cause feelings of uneasiness if a patient is anxious. As such, reducing noise produced by rocking piston vacuum pumps and rocking pistons in medical and dental applications is desired.

Sound reduction device for rocking piston pumps and compressors


Provided are: an imprinting method which suppresses volatilization of a photocurable resin applied on a transfer-receiving substrate by an inkjet method, satisfactorily maintains the wet-spreading property of the resin at the time of transfer, maintains cleanness of the environment for transfer, and can fill the environment for transfer with a particular gas appropriate for transfer; and an imprinting apparatus. Disclosed is an imprinting method of using a template having a concavo-convex pattern formed thereon, and transferring the pattern of the template by imprinting to a photocurable resin on a transfer-receiving substrate, characterized in that, in a space where the template and the photocurable resin are brought into contact, clean air is sent to the space through an air blowing port during a standby mode of not performing imprinting, and the flow rate of clean air in the space is reduced or clean air is not sent during an imprinting mode.

In recent years, particularly in regard to semiconductor devices, high speed operation and low power consumption operation are demanded as a result of further progress of micronization, and there is a demand for high-end technologies such as integration of functions called by the name of system LSI. Among such, regarding the lithography technology that becomes the key of the production of a pattern of a semiconductor device, it has been pointed out that there are limitations on the photolithographic method in view of the problem of exposure wavelength and the like occurring along the progress of micronization of a device pattern, and exposure apparatuses are extremely expensive.
As an alternative measure, a nanoimprint lithography (NIL) method using a fine concavo-convex pattern is attracting more attention. The nanoimprinting method suggested by Chou and others of Princeton University in 1995 is expected as a technology capable for forming a fine pattern having a high resolution of about 10 nm while the apparatus price, materials used and the like are inexpensive.
An imprinting method is a technology of pressing a template (also called a mold or a stamper) on which a nanometer-sized concavo-convex pattern has been formed in advance on the surface, on a transfer material such as a resin that has been formed by coating on the surface of a transfer-receiving substrate, so as to mechanically transform the substrate surface, thereby precisely transferring the concavo-convex pattern, and processing the transfer-receiving substrate using the imprint material having a pattern formed thereon as a resist mask. Once a template is produced, since a nanostructure can be repeatedly molded in a simple manner, a high throughput is obtained, and thus it is economically efficient. Also, since the technology is a nanoprocessing technology which produces hazardous waste materials to a less extent, in recent years, application of the technology is not limited to semiconductor devices, and application thereof in a variety of fields is in progress.
Regarding such an imprinting method, a thermal imprinting method of thermally transferring a concavo-convex pattern using a thermoplastic material; a photoimprinting method of transferring a concavo-convex pattern by ultraviolet radiation using a photocurable material; and the like are known. For the transfer material, a thermoplastic resin is used in the thermal imprinting method, and a photocurable resin or the like is used in the photoimprinting method. In the photoimprinting method, pattern transfer can be achieved at a low applied pressure at room temperature, so that heating/cooling cycles such as those employed in the thermal imprinting method are unnecessary, and dimensional changes in the template or the resin caused by heat do not occur. Therefore, it is said that the photoimprinting method is excellent in view of resolution, the extent of alignment, productivity and the like. Hereinafter, in the present invention, a photoimprinting method is simply referred to as imprinting method.
The imprinting method has a problem that, as the processing process is repeated, generated nanometer-sized fine particles tend to adhere to the template or the like, and machining defects are increased. Thus, there has been suggested a microprocessing apparatus which sends clean air to the interior of an imprinting apparatus in order to create a satisfactory transfer environment inside the imprinting apparatus (see Patent Literature 1).
Furthermore, the imprinting method has a problem that a gas such as air penetrates between the template and the transfer-receiving layer, causing the occurrence of areas where the resin of the transfer material is not filled into the concavities of the pattern on the template, and transferability is deteriorated thereby. Thus, there have been suggested an imprinting system and an imprinting method, by which a first gas having a solubility in the transfer-receiving layer lower than that of air is supplied when a transfer-receiving layer is formed, and a second gas having a solubility in the transfer-receiving layer higher than that of air is supplied when the pattern is transferred, so as to eliminate areas where the resin is not filled in, and to enhance transferability (see Patent Literature 2).

Imprinting method and imprinting apparatus


A fuel charge for use with a melting plate candle assembly includes an outer shell of fuel material surrounding an inner core of fuel material having different properties than the fuel material of the outer shell. The outer shell is substantially solid and may contain fuel additive that slows capillary flow of liquid fuel to the flame through the wick. The inner core may include liquid fuel, discrete solid fuel particles, or a solid fuel mass. The fuel additive is disposed in the fuel charge so as to slow migration of liquefied fuel to a flame on a wick only after a substantial portion of the fuel charge has been liquefied by heat from the flame.

1. Field of the Invention
The present invention relates to fuel charges for candles, and more particularly to fuel charges having a plurality of distinct fuel constituents.
2. Description of the Background of the Invention
Candle fuel charges having a plurality of distinct constituents are often used to provide decorative and functional benefits. For example, some candles have a solid outer shell of a first wax surrounding a solid inner core of a second wax having a lower melting temperature than the first wax. The second wax includes a soft mixture of fragrance oil and a carrier, such as petrolatum or a low melting point wax. When a wick disposed in the inner core is burned, the first wax of the inner core is melted and burned, and the second wax of the outer shell contains the molten first wax therein. In one such candle, the solid outer shell may be refilled with replacement paraffin beads placed around a replacement wick after the original inner core wax is consumed.
Other multi-constituent candle fuel charges have gas bubbles, glass spheres, glitter, and/or other types of decorative materials entrained in a gel fuel material contained in a non-flammable container. Often the decorative materials are entrained into the gel fuel material while the gel fuel material is still molten immediately after being poured into a mold. The bubbles, glass spheres, and/or glitter are dispersed throughout and encapsulated by a substantially solid matrix of the gel fuel material after the gel fuel material cools below the melt temperature thereof. Different colorants and fragrances may be added to each layer of gel fuel material to create a multi-fragrance candle.
Yet other multi-constituent candle fuel charges have a glass vial containing fragrance oil partly embedded in a wax body parallel to and spaced from a wick. An open end of the glass vial extends upwardly from a top surface of the wax body through which the wick extends. Heat from a flame located at the wick warms the fragrance oil and disperses fragrance to the surrounding atmosphere without burning the fragrance oil.
In another multi-constituent candle, wax prill, i.e., wax pellets ranging in size between 500 microns and 2000 microns, embedded with scented volatile actives is compressed in a compression mold into a multi-layered candle. At least one layer has a different color than an adjacent layer thereto. A smooth or textured outer surface finish may be created by applying a heat source to the compression mold while the candle is being compressed or by applying an overdip coating.

Fuel charge for melting plate candle assembly and method of supplying liquefied fuel to a wick


On the surface of a tread portion (1), one central main groove (2) extends in a tire circumferential direction (C) at a pattern center, and a pair of outer main grooves (4a, 4b) extend in the tire circumferential direction (C) each at a position between the central main groove (2) and a respective one of two tread ends (3a, 3b). The central main groove (2) and the outer main grooves (4a, 4b) define central land portions (5a, 5b), and the outer main grooves (4a, 4b) and the tread ends (3a, 3b) define outer land portions (6a, 6b). Among the central land portions (5a, 5b) and the outer land portions (6a, 6b), first circumferential narrow grooves (7a, 7b) are provided only in the central land portions (5a, 5b), extend in the tire circumferential direction (C), have a narrower opening width and a shallower depth than those of the central main groove (2), and have a first groove wall (8) on the side of the outer main groove (4a, 4b) and a second groove wall (9) on the side of the central main groove (2) such that an intersection angle (θ1) between a tread surface (10) and the first groove wall (8) is larger than an intersection angle (θ2) between the tread surface (10) and the second groove wall (9).

Pneumatic tires of course require sufficient steering stability on a dry road surface. Depending on the season and changes in the weather, however, such tires may also be driven on a snowy road surface and thus require on-snow performance as well.
One effective method for improving steering stability on a dry road surface is, for example, to increase the tire ground contact area of the tread surface that contacts the road surface, thereby increasing the rigidity of the land portions in the entire tread.
On the other hand, one effective method for improving on-snow performance is to set a high negative ratio by, for example, increasing the number of tread grooves formed on the tread surface or increasing the groove width of the tread grooves, thereby making it easier for snow to enter the tread grooves. Snow in the grooves is then packed during tire ground contact so as to be compressed into a snow column, resulting in the tire gripping the snowy road surface firmly without slipping.
For this reason, there is generally a tradeoff between steering stability on a dry road surface and on-snow performance.
Patent Literature 1, previously submitted by the present applicant, is an example of a conventional pneumatic tire developed to achieve a balance between steering stability on a dry road surface and on-snow performance.
The pneumatic tire disclosed in Patent Literature 1 is a pneumatic tire having, on the tread surface portion, a plurality of circumferential main grooves extending in the tire circumferential direction and a plurality of land portion rows defined by the circumferential main grooves. In at least one of the plurality of land portion rows, a circumferential auxiliary groove is formed extending in the tire circumferential direction at a location other than the tire equator. The circumferential auxiliary groove has a narrower width and a shallower depth than those of the circumferential main grooves. Of the two side faces defined by this circumferential auxiliary groove, the side face on the tire equator side extends along the normal direction of the tread surface portion or is inclined to the tire equator side by 5° or less with respect to the normal direction. The other side face on the side opposite the tire equator side is inclined to the side opposite the tire equator side by 10° to 30° with respect to the normal direction. This structure improves turning performance on snowy roads without decreasing steering stability or quietness when driving on a dry road surface.
The applicant subsequently examined how to achieve both steering stability on a dry road surface and on-snow performance to an even greater degree and discovered the following. In the tire of Patent Literature 1, the circumferential auxiliary groove needs to be provided in at least one of the central land portion and a outer land portion. Therefore, the circumferential auxiliary groove may be provided in the outer land portion. In this case, although the relationship with the tire ground contact width is a factor, there is a high probability that the circumferential auxiliary groove provided in one of the outer land portions will be outside the tire ground contact region when turning on a snowy road surface. In such a case, if the other side face of the circumferential auxiliary groove on the side opposite the tire equator side is inclined to the side opposite the tire equator side by 10° to 30° with respect to the normal direction, snow cannot be sufficiently drawn into the circumferential auxiliary groove and formed into a snow column, leading to the risk of slipping and also reducing the steering stability due to a reduction in the tire ground contact area when driving straight on a dry road surface. In particular when the tires are mounted on the front and rear wheels and the tire applied load differs between the front and rear tires, for example when the tire applied load is higher on the front tires than on the rear tires, the circumferential auxiliary grooves on the front tires are within the tire ground contact region whereas the circumferential auxiliary grooves on the rear tires are outside of the tire ground contact region. As a result, a difference in grip on a snowy road surface occurs between the front and rear tires, which worsens the front and rear balance and makes the above tendency to slip when turning on a snowy road surface pronounced.


A balanced-type mixer having easier mounting of a circuit board into a dielectric line apparatus, easier matching between a dielectric line and diodes, and reduced conversion loss. A first conductor pattern is disposed in a direction substantially perpendicular to first dielectric strips which constitute a first NRD guide, first and second filter circuits are provided at positions on opposite sides of the first dielectric strips, thus forming a first resonance circuit, and beam lead diodes are mounted in series within the resonance circuit. Further, a second conductor pattern is extended substantially from the midpoint between the filter circuits, and a third filter circuit is provided, thus forming a second resonance circuit. A second NRD guide based on second dielectric strips is connected to the second resonance circuit.

1. Field of the Invention
The present invention relates to a balanced-type mixer for use in a transmitter-receiver at millimeter-wave and microwave frequencies.
2. Description of the Related Art
A diode mount structure in a nonradiative dielectric line (hereinafter referred to as an "NRD guide") and a mixer using such structure are disclosed in "Nonradiative Dielectric Line Circuit Elements using Beam Lead Diodes", Journal of The Institute of Electronics, Information and Communication Engineers, by Kuroki and Yoneyama, C-I, Vol. J73-C-I, No.2, pp.71-76, February 1989.
This mixer is structured in such a way that a coupler is formed based on an NRD guide, and a circuit board having diodes mounted thereon is perpendicularly interposed between dielectric strips in order to couple the diodes to the NRD guide.
However, in the structure shown in the above reference, since a circuit board having diodes mounted thereon is disposed perpendicular to the direction along the length of a dielectric strip, it is difficult to fix the circuit board within the apparatus and the circuit board is likely to incline; therefore, ease of mounting is poor. Further, since a thin plate having a high dielectric constant must be inserted into an NRD guide or a gap must be provided to achieve matching, design and manufacturing are not easy.
Further, the coupler of the NRD guide has problems in that, as shown in FIG. 12, the frequency at which the power distribution ratio becomes equal is at one point. The farther away from that frequency, the more the balance of the power distribution ratio is distorted, and the advantages of the balanced-type mixer, such as suppression of image signals and cancellation of the effect of the drift of local signals, are decreased. In addition, in a conventional balanced-type mixer, since a coupler based on an NRD guide is formed, the line length of the NRD guide is increased, and losses in the coupler portion become a problem.

Balanced-type mixer having circuit board


The switching device of at least one embodiment includes at least two switching contacts for interruption of a current path, with the switching contacts being arranged in a quenching chamber in order to quench an arc which is struck on opening. The quenching chamber opens into a gas outlet channel for overpressure which is produced during the striking of the arc to escape from. A pressure sensor for pressure detection is provided in the gas outlet channel and trips a switching mechanism, which is at least indirectly connected thereto, of the switching device on reaching a predeterminable pressure value. According to at least one embodiment of the invention, the gas outlet channel includes a Venturi nozzle. A reduced pressure, which is created in the Venturi nozzle as the gas flow passes through, is detectable by way of the pressure sensor.

Switching devices are designed in particular to interrupt current paths in the event of a short circuit or in the event of an overcurrent. Furthermore, the switching devices may be designed with one or more poles, in particular with three poles. They can have one or more switching contact pairs for each pole. In particular, the switching devices are designed to disconnect currents of more than 100 A, in particular of several thousand A.
A release for a circuit breaker with a dielectric housing which comprises two contacts, which are pressed against one another in a sprung manner when the circuit breaker is in the connected position, per pole is disclosed in the German translation DE 691 10 540 T2 or European patent specification EP 0 455 564 B1, the entire contents of each of which is hereby incorporated herein by reference. The contacts can be separated by the effect of electrodynamic repulsion forces when the current flowing through the contacts exceeds a specific threshold value, in order in this way to limit the current. The release comprises an overload and/or short-circuit detection element in order to act on a switching mechanism which automatically disconnects the circuit breaker in the event of a fault.
Furthermore, the release comprises an operating member which responds to an overpressure which is produced in the separation zone of the contacts by an arc that is struck on electrodynamic repulsion of the contacts, in order to operate the disconnection mechanism of the circuit breaker. The operating member is a gas-tight unit which is connected exclusively to the separation zone of the contacts and comprises a moving element such as a piston or a membrane with a limited control travel. The moving element first has the overpressure applied to it, and secondly a return apparatus with a matched active force. Its movement results in tripping of the disconnection mechanism of the circuit breaker, with the return apparatus being designed with a matched active force so as to prevent inadvertent tripping in the event of a simple overload or response of a downstream current-limiting circuit breaker.
U.S. Pat. No. 3,631,369 A discloses a release with a moving armature. The armature is in the form of a bimetallic strip, and the electromagnetic release can act on it. An extension from the armature projects into the gas outlet channel of the arc quenching chamber. During disconnection, the armature is moved by the gas flow to the tripping position.
The power switching devices under consideration are, for example, so-called MCCB switching devices (Molded-Case Circuit Breakers). In the case of a switching device such as this, the current to be interrupted is interrupted before it reaches its maximum value, in that the switching contacts of the MCCB are drawn apart from one another by electromagnetic repulsion of adjacent conductors, thus interrupting the current.
Alternatively or additionally, the switching contacts may be operated, for example, by way of an actuator, which can preferably be operated electromagnetically. The actuator may be operated, for example, by an overload and/or short-circuit detection element.
A splitter stack for cooling the hot arc plasma during opening of the switching contacts is typically provided in the area of the switching contacts. Cooling the plasma down decreases the electrical conductivity such that the voltage required to maintain the arc is no longer sufficient. The arc breaks down and the current is interrupted.
In the case of the switching device mentioned initially according to EP 0 455 564 B1, the switching mechanism can be tripped not only by the overload and/or short-circuit detection element but also by a pressure-dependent operating member which acts independently thereof. The overpressure created when the arc is struck is used as a tripping criterion, and this is directly related to the arc energy. In other words, the pressure increases to a greater extent, the higher the arc energy is. Energy-selective disconnection of the switching device is therefore possible by evaluation of the overpressure.

Switching device, in particular power switching device


Low temperature wafer bonding process enhancement makes a wafer surface hydrophobic, preparing it with a buffered oxide etchant and then exposing it to H.sub.2 O.sub.2 before thermoelectric bonding. Has particular application to diaphragm-based pressure sensor construction.

This patent relates to the formation of diaphragm based microstructures used primarily for sensors at this time, in which the diaphragm may be used by sensing a change in deflection, resonance, or curvature as a result of environmental influences which are allowed to reach the sensor diaphragm. Particular sensors are described which may be constructed from the method of manufacture. The method described and structures shown are primarily silicon based, either single crystal form or polycrystalline in form, but other materials could also be used. Recently there has been a substantial interest in microstructures. A survey of structures and methods was published in Scientific American in April 1983, Angel et al, "Silicon Micromechanical Devices". The article describes a sensor similar to the pressure sensor of FIG. 1 of this patent, constructed through micromachining or chemical etching including "pits, holes, pyramids, trenches, hemispheres, cantilevers, diaphragms, needles and walls".
However, it was found that there are process reliability problems, particularly with producing diaphragm structures. Also, there is now a desire to produce more complex diaphragm structures. For example, where a wafer having a diaphragm on one side is placed over another wafer with a corresponding cavity below the diaphragm, bonding the two wafers at high temperatures may cause the diaphragm to permanently deform due to expansion of gases trapped on one side but not on the other. Attempting to provide a bond by merely contacting the two wafers having clean surfaces, is a well known method, and it is also described in U.S. Pat. No. 4,638,552 but it does not produce a satisfactory strong bond for the purpose of producing reliable sensors. In contrast, it has long been known that high temperature bonding of silicon can produce a strong bond.
Diaphragm-based sensors usually have within them electrical sensor elements, such as piezoresistors or capacitor elements, and these elements, once fabricated, can be damaged by subsequent high temperature processing. An additional problem thus arises in the fabrication of multiple wafer diaphragm structures, where the bonding of some wafers must occur after the formation of such electrical sensor elements.
One approach to manufacturing steps for diaphragm microstructures are taught in European Patent Application 89304173.1, entitled "Laminated Semiconductor Sensor With Overpressure Protection", filed Apr. 26, 1989. The process described in it, however, not only does not protect the diaphragm during processing, but adds the piezoresistive sensors before the high temperature fusing of the wafers and therefore creates a risk that these resistors or other sensitive electrical components will also be damaged by subsequent processing. No process previously known teaches how to adequately protect the sensor through the bonding process.
Also, where it is useful or desired to have a very flat or polished surface in which one surface of the diaphragm forms a contiguous part thereof, there has heretofore not been known a satisfactory method for polishing, without causing damage to the diaphragm.
Other known methods for building diaphragm based microsensors are either more difficult manufacturing processes than fusion bonding of wafers as shown in the European Application No. 89304173.1 (above-mentioned), or do not yield the same result sought here. An example of a "depositing" method can be found in U.S. Pat. No. 4,744,863 issued to Guckel and Burns. Their work was used in U.S. Pat. No. 4,592,238 by Busta. The Guckel/Burns process, as related by Busta, employs "post" oxide (column 2, line 50 et seq) which is deposited onto the substrate layer and the diaphragm (polycrystalline silicon) is deposited onto this post oxide. The post oxide is later removed by leaving a diaphragm supported by deposited material only along its edges.
As an additional form of protection for sensitive electrical elements, this invention employs a low temperature electrostatic bonding process after the creation of such elements without using backfill in situations where the diaphragm itself is not likely to be too damaged.
Certain enhancements to the design and method of manufacture of these diaphragm sensors is also described herein. These features enhance the flexibility of uses to which the sensors can be put.


A resonant circuit has two parallel resonant branches and one assistant inductor connecting the two resonant branches. Each resonant branch has a series capacitor and a series inductor connected in series. The other end of the series inductor is for connecting to a primary side of a transformer unit. The resonant circuit can provide two characteristic resonant frequencies fr and fm, so that a resonant power converter using the resonant circuit has an operating frequency fs that satisfies fs>fr or fm<fs<fr. The combination of the two resonant branches and the assistant inductor can reduce the frequency switch range of the resonant power converter within a specific voltage gain.

1. Field of the Invention
The invention relates to a resonant circuit and, in particular, to a resonant circuit used in a power converter.
2. Description of Related Art
With reference to FIG. 24, the U.S. Pat. No. 6,344,979, entitled "LLC series resonant DC-to-DC converter" has disclosed a LLC resonant power converter. The power converter mainly includes a square wave generator 100, a transformer 110, a resonant unit 120, a rectifying unit 130 and a filtering unit 140. The resonant unit 120 is connected between the primary side of the transformer 110 and the output terminal of the square wave generator 100. The rectifying unit is connected to the secondary side of the transformer 110. The filtering unit 140 is connected to the output terminal of the rectifying unit 130 for connecting to a load 150.
The resonant unit 120 has a series capacitor Cr connected with a series inductor Ls in series. Both the series capacitor Cr and the series inductor Ls are further connected with an inductor Lm provided by the transformer 110 in parallel. A first characteristic resonant frequency fr of the resonant unit 120 is determined by the series capacitor Cr and the series inductor Ls together. A second characteristic resonant frequency fm is determined by the series capacitor Cr, the series inductor Ls, and the inductor Lm altogether.
With reference to FIG. 25, the U.S. published application No. 2005/0207180 entitled "LLC half-bridge converter" discloses another resonant power converter. The power converter has a basic configuration and circuit operations being similar to the above-mentioned circuit. However, it can enhance the conversion efficiency of the converter. The transformer 110 provides two primary windings and two secondary windings. Two inductors Lm1 and Lm2 provided by the two primary windings are connected in series, whereas the two secondary windings are connected in parallel.
Either of the above-mentioned circuits uses the LLC resonant design. An obvious drawback of the LLC circuit is that the resonant power converter has to be operated in a wider operating frequency bandwidth in order to adjust its output voltage. Only by this can the circuit provide a stable operating voltage in a range to a load. In cases where a wider operating frequency bandwidth is impossible, it will be difficult for the LLC resonant design to effectively make the conversion or it simply reduces its conversion efficiency.

Resonant circuit and resonant power converter with a narrow operating frequency bandwidth


A laser source (10) for emitting a set of sequential, different wavelength output beams (12) includes a gain medium (16), a feedback assembly (26) and a control system (30). The gain medium (16) includes a first facet (16A), and the gain medium (16) generates a beam (12A) that exits the first facet (16A). The feedback assembly (26) includes a feedback device (40) and a device mover (42). The feedback device (40) is positioned in the path of the beam (12A) that exits the first facet (16A) and the feedback device (40) redirects at least a portion of the beam (12A) back to the gain medium (16). The device mover (42) continuously adjusts an angle of incidence (θ) of the beam (12A) on the feedback device (40). The control system (30) selectively directs pulses of power to the gain medium (16) as the device mover (42) is continuously adjusting the angle of incidence (θ) of the beam (12A). Further, the laser source (10) can include a position detector (28) that generates a position signal that relates to the angle of incidence (θ) of the beam (12A) on the feedback device (40). In this embodiment, the control system (30) can selectively direct pulses of power to the gain medium (16) based on the position signal from the position detector (28). Further, the control system (30) can determine a center wavelength of the output beam (12) based on the position signal.

The usage, transportation, and storage of hazardous materials create many safety and environmental issues. More specifically, during usage, transportation, and storage of hazardous materials, leaks can release toxic or explosive gas into the surrounding environment. For example, industrial equipment used in the oil, gas, utility, and chemical industries can release toxic gas into the surrounding environment. As another example, hazardous gases can pose a threat to homeland security. In many cases, the hazardous gas is odorless, colorless, and spreads quickly. As a result thereof, it can be quite difficult to detect and locate the source of the leak.
Recently, it has been determined that laser sources that generate light in the mid infrared range ("MIR range") are particularly useful in absorption spectroscopy applications since many gases of interest have their fundamental vibrational modes in the MIR range, and thus present strong, unique absorption signatures within the MIR range. In order to detect a wide range of gases, the laser source must generate a set of sequential, specific output beams that span a portion or the entire the MIR range.
Unfortunately, emitting gases in many atmospheric environments are susceptible to intensity fluctuations due to air turbulence. This can make it very difficult to detect these emitting gases.

Laser source that generates a plurality of alternative wavelength output beams


A system, apparatus and method of notifying a user that there may be a possibility of communicating with a computer system other than an intended one are provided. When a host in use by the user is to request a DNS name service, the request is sent to two or more DNS servers. If all the servers return the same IP address, then there is a likelihood that the user may communicate with the intended computer system. If, however, two or more different IP addresses are returned, there is a high likelihood that the user may communicate with a computer system other than the intended one. When this occurs a warning is generated notifying the user of such a likelihood.

1. Technical Field
The present invention is directed to network computing. More specifically, the present invention is directed to a method, system and apparatus for double-checking DNS provided IP addresses.
2. Description of Related Art
Domain Name System or Service (DNS) is an Internet service that translates domain names into Internet Protocol (IP) addresses. IP addresses, which are a group of four numbers separated by colons (e.g., 184.108.40.206), are used when communicating with computer systems on the Internet. However, since it is easier to remember names than it is to remember numbers, users are allowed to use computer names (i.e., www.ibm.com) when communicating with computer systems. The names are then translated into their corresponding IP addresses.
When a process needs to determine an IP address given a DNS name, it calls upon a local host to map the DNS name to an IP address. Specifically, UNIX hosts have a file (i.e., /etc/resolv.conf) that contains a list of DNS servers that can be contacted to map DNS names to IP addresses. The DNS servers are contacted, if some or all of them on the list have to be contacted, in an orderly fashion. For example, one DNS server in the list is usually designated as the default server to contact when a DNS service is needed. Thus, that DNS server will be contacted first. However, if communication between the client and the DNS server fails, another DNS server in the list, which is designated as a secondary server, will be contacted and so on.
The DNS servers have a table that cross-references a computer system's name with its IP address. If the computer system's name being looked up is not in the cross-referencing table of the DNS server contacted, that DNS server will contact another DNS server to see whether it can map the computer system's name to its IP address. This process will continue until a DNS server is able to provide the IP address associated with the DNS name of the computer system in question. The IP address will be passed down to the requesting client in the same order the request was passed up. Each DNS server that was involved in passing the request up the chain will be involved in passing the answer down to the requesting client. When they receive the answer, they will cache it for future references. The process of one DNS server requesting another DNS server to map a DNS name to its IP address is called a recursive resolution of requests.
Users have been known to intercept DNS service requests between two DNS servers and to return IP addresses of their choosing in response to the requests. When this occurs, all communications between a client that requested a DNS service and the computer system for which the DNS service was requested will effectively be routed to the users' chosen computer system.
This scheme can be used to compromise secure transactions between customers and financial institutions or commercial enterprises. For example, a customer who believes that he/she is in a financial transaction with a bank may nonchalantly provide all pertinent information that an unauthorized user may need to access the customer's bank account or credit card account etc. Further, enterprises that are being run by unscrupulous managers may re-route all Internet traffic destined to a competitor's Website to the enterprises' own Websites. Indeed, a whole host of deceptive activities may ensue by using this scheme.
Thus, what is needed is a system, apparatus and method of notifying a user when there is a possibility that the user may be communicating with other than an intended computer system.

Apparatus, system and method of double-checking DNS provided IP addresses


This document generally describes docking stations for portable computing devices with one or more of a variety of features, such as a near horizontal tray into which a portable computing device can be placed (e.g., a tray with an angle between 5-25 degrees from horizontal), embedded microphones and/or speakers, and/or input jacks for external microphones and/or speakers.

Portable computing devices, such as cell phones and/or data enabled portable electronic communication devices (e.g., smartphones), are commonly used today. In the last decade, such devices have found widespread acceptance for personal and business use. Some of the latest advances have resulted in such devices including computation/graphics intensive functionality that rivals the functionality of personal computers (PCs) and similar electronic devices. Docking stations have been developed to interface with portable computing devices through one or more physical connections with portable computing devices.


The present invention relates to aqueous compositions comprising amidoxime compounds and methods for cleaning plasma etch residue from semiconductor substrates including such dilute aqueous solutions. The compositions of the invention may optionally contain one or more other acid compounds, one or more basic compounds, and a fluoride-containing compound and additional components such as organic solvents, chelating agents, amines, and surfactants. The invention also relates to a method of removing residue from a substrate during integrated circuit fabrication.

Front End Of Line process (FEOL) operations are performed on the semiconductor wafer in the course of device manufacturing up to the first metallization. Back End Of Line process (BEOL) operation perform on the semiconductor wafer in the course of device manufacturing following the first metallization.
The present invention relates to the fabrication of semiconductor integrated circuits, and in particular, to the use of cleaning compositions comprising amidoxime compounds in the fabrication of semiconductor integrated circuits. Such cleaning compositions are useful in methods for cleaning plasma etch residue from semiconductor substrates and in methods for cleaning surfaces during fabrication, in particular, surfaces where the active components (transistors, resistors, etc.) are interconnected with wiring on the wafer—i.e., in the BEOL process.
BEOL generally begins when the first layer of metal is deposited on the wafer. It includes contacts, insulator, metal levels, and bonding sites for chip-to-package connections. Dicing the wafer into individual integrated circuit chips is also a BEOL process. More than 100 steps are involved in a standard integrated circuit ("IC") manufacturing process that involves wafer cleaning or surface preparation. Wafer cleaning and surface preparation includes post-resist strip/ash residue removal, native oxide removal, and even selective etching. Although dry processes continue to evolve and offer unique advantages for some applications, most cleaning/surface preparation processes are "wet," involving the use of a mixture of chemicals such as hydrofluoric; hydrochloric (HCl), sulfuric or phosphoric acid; or hydrogen peroxide, along with copious amounts of deionized water for dilution and rinsing. Wafers are typically processed in a batch immersion or batch spray system or, increasingly, with a single-wafer approach. The trend is toward more dilute chemistries, aided by the use of some form of mechanical energy, such as megasonics or jet-spray processing.
An important distinction in wafer cleaning today is that the main goal is not only particle removal, but some other function, such as removing oxide and photoresist residues after etching, stripping and/or ashing steps.
Surfaces may also be characterized as hydrophobic or hydrophilic. Hydrophilic surfaces in semiconductor substrates, include, for example, SiO2, carbon doped oxide (low k dielectric), copper oxide surfaces and benzotriazole treated copper surfaces. Hydrophobic surfaces are more difficult to clean, in part because cleaning solutions do not wet as well due to the high contact angle. During the drying step, the solutions tend to "bead" up on the surface, leaving particles on the surface instead of keeping the particles in solution. Hydrophobic surfaces are easily wetted by cleaning solutions, and, during drying, any particles on the surface tend to stay in solution until the solution is removed from the surface.
The analytical method for describing wetting and determining whether a surface is hydrophobic or hydrophilic is to measure contact angle.
Contact angle is a quantitative measure of the wetting of a solid by a liquid. It is defined geometrically as the angle formed by a liquid at the three phase boundary where a liquid, gas and solid intersect as shown below. Contact angle measurement characterizes the interfacial tension between a solid and a liquid drop. The technique provides a simple method to generate a great amount of information for surface analysis. And because the technique is extremely surface sensitive, it can be used in semiconductor cleaning applications. Contact angle measurement is a simplified method of characterizing the interfacial tension present between a solid, a liquid, and a vapor. As shown in FIG. 1, when a droplet of a high surface tension liquid rests on a solid of low surface energy, the liquid surface tension will cause the droplet to form a spherical shape (lowest energy shape). Conversely, when the solid surface energy exceeds the liquid surface tension, the droplet is a flatter, lower profile shape.
Most cleaning challenges are evolutionary as structures get smaller and specifications get tighter. The evolution is driven by a variety of new materials, new integration schemes and process flows.
Another common problem with cleaning semiconductor surfaces is the deposition of contaminants on the surface of the semiconductor device. Any cleaning solutions that deposit even a few molecules of undesirable composition, such as carbon or sodium, will adversely affect the performance of the semiconductor device. Cleaning solutions that require a rinsing step can also result in depositing contaminants on the surface. Thus, it is desirable to use a cleaning chemistry that is will leave little to no residue on the semiconductor surface.
It may also be desirable to have a surface wetting agent in the cleaning solution. Surface wetting agents prevent contamination of the semiconductor work-piece by helping to stop spotting of the surface caused by droplets clinging to the surface. Spotting (also called watermarks) on the surface can saturate metrology tools that measure light point defects, thus masking defects in the semiconductor work-piece.
In the manufacture of integrated circuits, interconnects are used to couple active and passive devices together and to couple together conductive lines formed on different layers of the integrated circuits. To keep the resistivity low, interconnects are generally fabricated from good conductors, such as gold, silver, aluminum, copper, or alloys of aluminum or copper. Keeping interconnects resistivity low will decreases the heat generated in the circuit, which permits the fabrication of higher density circuits. Unfortunately, even using conducting metals having a low resistivity, the interface between interconnects and an active or passive device or the interfaces between interconnect and a conductive line may have a high resistivity. High resistivity at an interconnect interface is often caused by an unclean surface at the interface.
More than one hundred steps are involved in a standard IC manufacturing process which involve wafer cleaning or surface preparation including post-resist strip/ash residue removal, native oxide removal, and even selective etching. Although dry processes continue to evolve and offer unique advantages for some applications, most cleaning/surface prep processes are "wet," sometimes involving the use of other chemicals that may offer environmental challenges. Due to in part of environmental reasons, the use of more dilute chemistries has increased, aided by the use of some form of mechanical energy, such as megasonics or jet-spray processing. Accordingly, there is a need for chemistries that can effectively be used in diluted form.
Devices with critical dimensions on the order of 65 nanometers or less have involved integration of copper conductors and low-k dielectrics. Devices with critical dimensions on the order of 65 nanometers or less require alternating material deposition processes and planarization processes. Following almost each step in the fabrication process, e.g., a planarization step, a trenching step, or an etching step, cleaning processes are required to remove residues of the plasma etch, oxidizer, abrasive, metal or other liquids or particles remaining which contaminate the surface of the copper wafer. Fabrication of the current advanced generation of devices require copper conductors and low-k dielectric materials (typically carbon-silica or porous silica materials), both of which can react with and be damaged by various classes of prior art removers.
Low-k dielectrics in particular may be damaged in the cleaning process as evidenced by etching, changes in porosity/size, and ultimately changes in dielectric properties. Continuous wet process is required to remove the residues without any effect on damaged low-k layer, for instance k-value shift and CD loss. In addition, copper surface control is considered to be important for reliable electrical properties: Oxide layer on copper surface (CuOx) is required to be removed in the wet process and re-oxidation on the bare copper surface needs to be prevented.
In juxtaposition, cleaning needs and goals have become more demanding. Increasingly, wafers are being processed with a single-wafer approach, as compared to a batch immersion or batch spray system or, increasingly, with a single-wafer approach. This requires faster and effective chemical cleaning. Further, in wafer cleaning applications, particle removal may not be the main goal, but some other goal, such as removing native oxide or photoresist residue removal after strip/ash. Accordingly, there is a need for chemistries that can be used in both single-wafer and batch processing, while addressing a variety of goals in the removal process.
This concern in semiconductor cleaning processes increase the need to use chemistries containing more effective complexing agents.
Complexing agents for metal ions are required for a wide variety of industries. Examples of relevant purposes and uses are: detergents and cleaners, industrial cleaners, electroplating, water treatment and polymerizations, the photographic industry, the textile industry and the papermaking industry, and various applications in pharmaceuticals, in cosmetics, in foodstuffs and in plant feeding.
Most formulations being used in cleaning semiconductor substrates also contain complexing agents, sometimes called chelating agents.
Examples of complexing agents are nitrilotriacetic acid (NTA), ethylenediaminetetraacetic acid (EDTA), N,N′-bis(2-hydroxyphenyl)ethylenediiminodiacetic acid (HPED), triethylenetetranitrilohexaacetic acid (TTHA), desferriferrioxamin B,N,N′,N″-tris[2-(N-hydroxycarbonyl)ethyl]-1,3,5-benzenetricarboxamide (BAMTPH), and ethylenediaminediorthohydroxyphenylacetic acid (EDDHA), ethylenediaminetetramethylenephosphonic acid (EDTMP), propylenediaminetetraacetic acid (PDTA), hydroxypropylenediaminetetraacetic acid (HPDTA), isoserinediacetic acid (ISDA), β-alaninediacetic acid ({tilde over (β)}-ADA), hydroxyethanediphosphonic acid, diethylenetriaminetetraacetic acid, diethylenetriaminetetramethylenephosphonic acid, hydroxyethyleneaminodiacetic acid, hydroxyethylethylenediaminetriacetic acid, diethylenetriaminepentaacetic acid and, furthermore, diethanolglycine, ethanolglycine, citric acid, glycolic acid, glyoxylic acid, lactic acid, phosphonic acid, glucoheptonic acid or tartaric acid, polyacrylates, carbonates, phosphonates, and gluconates.
In some cases, the biodegradability is also unsatisfactory. Thus, EDTA proves to have inadequate biodegradability in conventional tests, as does PDTA or HPDTA and corresponding aminomethylenephosphonates which, moreover, are often undesirable because of their phosphorus content. Phosphorus is also a dopant in semiconductor devices; therefore it is desirable to have cleaning solutions with non-phosphor containing compounds.
Much metal-chelating functionality is known. Metal chelation is when a central metal ion attaches by coordination links to two or more nonmetal atoms (ligands) in the same molecule. Heterocyclic rings are formed with the central (metal) atom as part of each ring. When the complex becomes more soluble in the solution, it functions as a cleaning process. If the complexed product is not soluble in the solution, it becomes a passivating agent by forming an insoluble film on top of the metal surface.
The current complexing agents being used as complexing agent for semiconductor cleaning include compounds, such as, glycolic acid, glyoxylic acid, lactic acid, phosphonic acid etc. They are acidic in nature and have a tendency to attack the residue and remove both metals and metal oxides, such as copper and copper oxide. This presents a problem for formulators where a chelating function is sought but only selectively to metal oxide and not the metal itself, e.g., in an application involving metal, such as copper. Accordingly, there is a need for complexing agents that are not aggressive toward metal substrates, while effectively providing for the chelation of metal ions residue created during the manufacturing processes.
The present invention addresses these problems.

Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions


An on-chip function call aware software code profiling counter system and method is disclosed. When building software code a compiler/tool-chain can modify prologues and epilogues of functions to add instrumentation code which uniquely identifies the function. Each function included in the instrumented source code tree is assigned a unique identifier (ID) by the compiler/tool-chain. Writing a unique ID for a function to a register starts profiling for the function. The profiling is performed by a counter that counts the number of instruction cycles since the last unique ID was written to the register. When a unique ID for a next function to be profiled is written to the register, the old register value and the counter value are latched to one or more buffers and the counter is cleared to start the next count sequence for the next function to be profiled.

Software code profiling is a form of dynamic program analysis for aiding software program optimization. Profiling measures memory or time complexity of a program, the usage of particular instructions or frequency and duration of function calls. Profiling is achieved by instrumenting either the program source code or its binary executable form using a tool commonly called a code profiler. A number of different techniques may be used by profilers, such as event-based, statistical, instrumented and simulation methods. The output data from a code profiler can be displayed to the user as a set of bar-graphs with % central processing unit (CPU) cycles as a measurement unit. Conventional recording of profiling data relies on instruction trace output or instrumentation of code with logging to off-chip data recorders or post-processors.


A client subsystem is provided for use with a network printing system including a client communicating with one or more of a plurality of print-related devices by way of a network connection. An electronic document is developed at the client and placed into a printable format with a print driver. The electronic document in the printable format includes a set of attributes respectively corresponding with a set of attribute values, the set of attribute values controlling a manner in which the electronic document is to be processed at a selected one of the plurality of print-related devices. The client subsystem includes a document routing system, communicating with the print driver and a spooler, for facilitating transmission of the electronic document in the printable format from the print driver to the spooler. A print assistant, communicating with the document routing system, changes the set of attribute values, independently of the print driver, when at least a portion of the electronic document in the printable format has been routed to the spooler by the document routing system. The set of attribute values is finalized at the spooler when the user indicates that the job is ready to be printed, at which point the job submission is completed.

The present invention relates generally to a network printing system and, more particularly, to a subsystem for print job submission. The invention permits the changing of an attribute set, associated with a job or one or more documents contained within the job, subsequent to compilation of the one or more documents with a print driver.
In network printing systems, client workstations ("clients") are communicatively coupled with printers by way of a network server. As shown in U.S. Pat. No. 5,467,434, a server may include, among other objects, a plurality of queues, corresponded with a plurality of printers and a server process for facilitating transmission of a job (including image data and a set of control instructions) to a selected plurality of printers. In practice, the client transmits the job to a selected one of the queues and the server processor, in turn, sees that the job is transmitted to a corresponding one of the printers associated with the queue. It is understood that each queue can correspond with one or more of the printers.
The following patents also disclose print servers or services appropriate for transmitting/processing jobs within a network: U.S. Pat. No. 5,113,494 to Menendez et al. (Issued: May 12, 1992); U.S. Pat. No. 5,179,637 to Nardozzi (Issued: Jan. 12, 1993); and U.S. Pat. No. 5,220,674 to Morgan et al. (Issued: Jun. 15, 1993).
U.S. Pat. No. 5,113,494 discloses an arrangement in which a plurality of nodes communicate with one another by way of a local area network communication line. In practice, a job can be created at one node, e.g. a scanner node, for transmission to and output at another node, e.g. a printer node.
U.S. Pat. No. 5,179,637 discloses a system for distributing print jobs received from a print image data source among a set of print engines and associated processors. One or more data files containing the information required to print one or more copies of an image are submitted to a scheduler and the scheduler interprets the job control information in the data file(s) for the image and passes the data files(s) to an image processor.
U.S. Pat. No. 5,220,674 discloses a local area print server which functions in cooperation with a plurality of clients and a plurality of printers to facilitate communication between the clients and the printers. More particularly, the local area print server both controls the servicing of printer requests by a printer and, in response to printer requests for resources needed to satisfy a printing request, either provides required resources, or obtains the resources from remote subsystems.
The system of U.S. Pat. No. 5,220,674 is suitable for use with a printing standard referred to as "DPA ISO 10175". An implementation of this standard (in conjunction with "POSIX.7 IEEE 1003.7a") can be found in various available network printing products, such as one of the "Document Centre" printing systems sold by Xerox Corporation. A description of the theory underlying this implementation is provided in further detail immediately below, the description including material excerpted from Palladium Design Document (V2.0), published in June, 1991 by the Massachusetts Institute of Technology:
A distributed printing system, developed in accordance with OSI Document Processing Architecture (DPA) ISO/IEC 10175, using the name "Palladium Print System" has been developed at MIT/Project Athena. The Palladium Print System uses the following subsystems to obtain a print service: (1) Print Clients; (2) Print Spoolers; (3) Printer Supervisors; and (4) Printers. This print system is based on a two-level client-server model in which the Printer Spooler and Print Supervisor act as servers. The Print Spooler further acts as a client to the Printer Supervisor, while the Print Client normally uses the Print Spooler as its server. In practice, remote procedure calls are used for communications between clients and servers. Each Printer has its own dedicated Printer Supervisor, the Supervisor communicating data and control information with the Printer in a manner that is suitable for the type of printer being employed.
The following will provide a brief background description of the four major subsystems comprising the Palladium Print System:
A Print Client serves as an agent that (1) accepts user commands, (2) submits requests to print services, (3) receives responses, (4) interprets and displays responses to the user, (5) and transmits the document(s) to be printed. A Print Spooler is a server that accepts operations from Print Clients using a RPC, and schedules print jobs on its Printer Supervisors. In one preferred approach, the Spooler communicates with the Printer Supervisors and uses Palladium operations with the RPC. In this preferred approach, the Print Spooler serves as a client for the Printer Supervisor.
A Printer Supervisor accepts requests from clients, namely, Printer Spoolers, to print a job on a Physical Printer. For those circumstances in which code is multi-threaded, each thread is considered a Printer Supervisor and controls its own Physical Printer. While the Printer Supervisor typically resides on the same machine as the Spooler, it may be installed on a different machine having network connectivity to the machine where the Spooler is located.
A Physical Printer is an actual piece of hardware that has its own Printer Supervisor controlling it, and the queue contains jobs waiting to be printed. Upon finishing or nearly finishing a job, a Printer Supervisor indicates to the Spooler its readiness to accept another print job. In turn, the Spooler scans those queues which feed the Physical Printer and the next job is selected with a scheduling algorithm. The job is then submitted to the Physical Printer by the Printer Supervisor using the ISO DPA Print operation.
A Logical Printer is an abstract entity that users employ to specifically indicate where their job is to be printed and/or what characteristics their job is to possess. Each Logical Printer employs default attributes when attributes have not been provided by a user or Print Client. In accordance with the attributes, a corresponding Spooler assigns a print job to one Queue based, at least in part, on a specified Logical Printer. Essentially, one or more Logical Printers feeds a Queue, while each queue feeds one or more Physical Printers as established by the system administrator of the Spooler.
The system of the present invention particularly facilitates operation within the Client/Spooler areas of the DPA Print Model. The Client is part of the print system that accepts commands, submits requests to print services, receives responses from service providers, interprets and displays responses to the user, and transmits the document(s) to be printed. In practice the Client communicates with service providers, through a predefined set of remote procedure calls (conforming with ISO 10175) and issues requests to a server. In turn, the server may authorize the request and pass it along to the Printer Supervisor, or reject the request and return a status value to the Client. A status value will also be returned to the Client by the server upon completing the request of the Client.
The design of the Client includes:
User Interface, PA1 Application Programmer's Interface, PA1 System Programmer's Interface, PA1 Infrastructure Libraries, and PA1 RPC Stubs and Run-Time Library Operating System.
The Client communicates with Service Providers by way off a RPCchannel.
In one contemplated embodiment of the Palladium Print Spooler, RPC calls are provided from the Client or Supervisor by way of a Request Handler Thread, which Thread works in conjunction with a Dispatcher Thread and/or a Job Transfer Thread, depending on the complexity of a request being handled by the Spooler. The Spooler includes a data base such that if a request requires a simple operation, the Request Thread accesses the data base and completes the operation requested. If, however, the operation required is a complex one, then a sub-thread is fired up. Further details regarding Print Spooler design can be obtained by reference to the Palladium Design Document.
It is not uncommon for a client to provide a document which includes conflicts in programming relative to a target printer to which the document is to be transmitted. For example, a client may program a document to be printed on a given stock type (i.e. assign a value to a stock attribute) and that stock type may not be available at the target printer. Accordingly, it is desirable to provide a client with as much capability, with respect to assessing what attributes are available at remote printers as possible. The following patents are devoted to systems which permit the client to assess attributes at remote printers: U.S. Pat. No. 5,129,639 to DeHority (Issued: Jul. 14, 1992); U.S. Pat. No. 5,450,571 to Rosekrans et al. (Issued: Sep. 12, 1995); and U.S. Pat. No. 5,467,434 to Hower, Jr. et al. (Issued: Nov. 14, 1995).
U.S. Pat. No. 5,129,639 is directed toward a control system in which a document is programmed at a client, with an attribute set, and then transmitted to a remote printer for processing. Pursuant to such processing, a determination is made, by reference to the programmed attribute set, as to whether a mismatch exists between such set and the attribute set made available at the remote printer. If a mismatch occurs, the client is provided with an opportunity to revise the document to overcome the mismatch.
U.S. Pat. No. 5,450,571 is directed toward an arrangement in which multiple queues, disposed at a server, are corresponded with multiple target printers. Attributes of each printer are registered with the server and a server ticket is developed to reflect the attributes of all of the multiple target printers. Moreover, each queue is associated with a mask file. Pursuant to operation, a client selects a queue and, in response to such selection, the queue's corresponding mask file is applied to the server ticket. As a result of the application, a ticket or dialog specific to the selected queue (and its associated printer(s)) is created for display at the client.
U.S. Pat. No. 5,467,434 is directed toward an arrangement in which attributes available at printers disposed remotely of a client are organized in sets of decision trees with each tree representing the attribute combinations available at one of the printers. Pursuant to programming a job with an attribute set, the client employs an attribute combination examiner to determine if that programmed attribute set is processable at one of the remote printers. By reference to the combination examiner, the client can program a job with an acceptable attribute set.
The DPA Print Model contemplates the printing of a job including a plurality of documents. This concept is similar, in principle, to a system disclosed by Xerox Corporation in its Viewpoint operating system wherein multiple documents are referenced with a single folder having a folder attribute set. The use of Viewpoint has been extended to the printing area by way of U.S. Pat. No. 5,442,732 to Matysek (Issued: Aug. 15, 1995) in which a print folder, as a whole, may be compiled, with a print driver, so that each of the documents in the print folder can be printed in accordance with the folder attribute set. Further flexibility in job programming is provided by now-allowed U.S. patent application Ser. No. 08/287,315 to Hamilton (Filed: Aug. 8, 1994) in which individual documents of the print folder can be provided with one of several stock or finishing attributes.
In accordance with common practice, when a document is revised by a client to overcome conflicts in programming, as in U.S. Pat. No. 5,129,639, the document is recompiled with a print driver prior to sending the document off for printing. Additionally, recompiling is required when an attribute is added to a document or a document is added to a job. It is understood that this recompiling, which can be time-consuming, may be avoided through use of certain DPA calls, such as a call to add a document to a job currently residing on a corresponding Print Spooler. To do this, however, it has been found that the conventional print driver(s) provided at the client would have to be rewritten for accommodating the use of such DPA call(s). Rewriting conventional print drivers can be both costly and time-consuming. Hence, it would be desirable to provide a system to the Client which permits the Client to make changes relative to a spooled document or job while avoiding the need to recompile the spooled document/job and/or rewrite conventional print drivers.
The present invention is particularly suited for use in a network environment, such as in the context of the world wide web, the internet or the like. Examples of some recent patents relating to network environments of plural remote terminal shared users of networked printers include Xerox Corporation U.S. Pat. Nos. 5,483,653, 5,243,518, 5,226,112, 5,170,340 and 5,287,194. Some patents on this subject by others include U.S. Pat. Nos. 5,113,355, 5,113,494 (originally filed Feb. 27, 1987), 5,181,162, 5,220,674, 5,247,670; 4,953,080 and 4,821,107. Further by way of background, some of the following Xerox.RTM. Corporation U.S. patents also include examples of networked systems with printers: U.S. Pat. Nos. 5,153,577; 5,113,517; 5,072,412; 5,065,347; 5,008,853; 4,947,345; 4,939,507; 4,937,036; 4,920,481; 4,914,586; 4,899,136; 4,453,128; 4,063,220; 4,099,024; 3,958,088; 3,920,895; and 3,597,071. Also noted are IBM Corp. U.S. Pat. Nos. 4,651,278 and 4,623,244, as well as Canon U.S. Pat. No. 4,760,458 and Jap. Pub. No. 59-63872 published Nov. 4, 1984. Some of these various above patents also disclose multi-functional printing systems.
Some other network system related publications include "Xerox Office Systems Technology" "Xerox 8000 Series Products: Workstations, Services, Ethernet, and Software Development" .COPYRGT.1982, 1984 by Xerox Corporation, OSD-R8203A, Ed. T. Linden and E. Harslem, with a "Table of Contents" citing its numerous prior publications sources, and an Abstract noting the April 1981 announcement of "the 8110 Star Informations System, A New Personal Computer . . . "; "Xerox System Integration Standard Printing Protocol XSIS 118404", April 1984; "Xerox Integrated Production Publishers Solutions: "Booklet No. " 610P50807" "11/85"; "Printing Protocol-Xerox System Integration Standard" .COPYRGT.1990 by Xerox Corporation, XNSS 119005 May 1990; "Xerox Network Systems Architecture", "General Information Manual", XNSG 068504 April 1985, with an extensive annotated bibliography, .COPYRGT.1985 by Xerox Corporation; "Interpress: The Source Book", Simon & Schuster, Inc., New York, N.Y., 1988, by Harrington, S. J. and Buckley, R. R.; Adobe Systems Incorporated "PostScript" Language Reference Manual", Addison-Wesley Co., 1990; "Mastering Novell" Netware.RTM.", 1990, SYBEX, Inc., Alameda, Calif., by Cheryl E. Currid and Craig A. Gillett; "Palladium Print System" .COPYRGT.MIT 1984, et sec; "Athena85" "Computing in Higher Education: The Athena Experience", E. Balkovich, et al, Communications of the ACM, 28(11) pp. 1214-1224, November, 1985; and "Apollo87 The Network Computing Architecture and System: An Environment for Developing Distributed Applications", T. H. Dineen, et al, Usenix Conference Proceedings, June 1987.
Noted regarding commercial network systems with printers and software therefor is the 1992 Xerox Corporation "Network Publisher" version of the 1990 "DocuTech.RTM." publishing system, including the "Network Server" to customer's Novell.RTM. 3.11 networks, supporting various different network protocols and "Ethernet"; and the Interpress Electronic Printing Standard, Version 3.0, Xerox System Integration Standard XNSS 048601 (Jan. 1986). Also, the much earlier Xerox Corporation "9700 Electronic printing System"; the "VP Local Laser Printing" software application package, which, together with the Xerox "4045" or other Laser Copier/Printer, the "6085" "Professional Computer System" using Xerox Corporation "ViewPoint" or "GlobalView.RTM." software and a "local printer [print service] Option" kit, comprises the "Documenter" system. The even earlier Xerox Corporation "8000" "Xerox Network Services Product Descriptions" further describe other earlier Xerox Corporation electronic document printing systems. Eastman Kodak "LionHeart.RTM." systems, first announced Sep. 13, 1990, are also noted.
Current popular commercial published "systems software" with LAN workstation connections include Novell DOS 7.0, "Windows.RTM." NT 3.1, and IBM OS/2 Version 2.1.
All of the references designated in the above Background section are incorporated herein by reference.

Client subsystem for changing document/job attributes in a network printing system


Geranylgeraniol-18-hydroxylase, which catalyzes the C-18 hydroxylation of geranylgeraniol to form plaunotol, is extracted from Croton sublyratus using an extraction buffer and is purified using a differential centrifugation separation technique. The purified enzyme is used to convert geranylgeraniol to plaunotol, an anti-peptic ulcer agent. The enzymatic activity of the hydroxylase can be increased by a factor of about three by heating the enzyme in boiling water for about 30 minutes. The enzyme activity is also increased by adding a coenzyme, NADPH, which increases enzyme activity by a factor of about 2 or NADH, which increases activity by a factor of about 1.4. The pH optimum for hydroxylase enzyme activity is 5.0 The hydroxylase is a complex enzyme with a diameter of about 20 to 40 nm.

1. Technical Field of the Invention
This invention relates to a process for extracting and purifying an enzyme that is useful in the preparation of an anti-peptic ulcer drug. More specifically it relates to the enzyme geranylgeraniol-18-hydroxylase, a method for its extraction from plant parts using an extraction buffer, its purification using differential centrifugation, its heat activation, and its use in the production of plaunotol, a known anti-ulcer medication.
2. Background Description
Plaunotol, the active ingredient of a commercial drug named Kelnac.RTM. is a mucosal protective factor-enhancing anti-ulcer agent. It was originally found in the leaves of Croton sublyratus Kurz (Euphorbiaceae), a tropical plant found throughout southeast Asia. Although the structure of plaunotol has been known for almost twenty years, very little is known about its biosynthetic pathway. Although attempts have been made to establish C. sublyratus callus and cell cultures that yield high plaunotol content, none have been successful. A synthetic route to the production of plaunotol is known; however, the main source of plaunotol remains the extraction and purification from tropical plants as described, for example, in U.S. Pat. No. 5,264,638, all of which is incorporated herein by reference as if completely written herein. A less cumbersome and more effective process for the production of plaunotol is clearly needed.

Geranylgeraniol-18-hydroxylase from croton sublyratus