The present invention discloses a xanthine derivative having the structure of the following general formula (I) or a pharmaceutically acceptable salt thereof; further discloses a preparation method for the xanthine derivative or a pharmaceutically acceptable salt thereof; and further discloses the use of the xanthine derivative or a pharmaceutically acceptable salt thereof. Through experiments of DPP-IV activity inhibition experiments in vitro, impact on glucose tolerance in normal mice and impact on blood glucose in spontaneous diabetic mice, it proves that the compounds and pharmaceutically acceptable salts thereof show good DPP-IV inhibition activity, can be applied to prepare medicines for treating dipeptidyl peptidase IV-related diseases, and more particularly, can be applied to the use of medicines for treating type II diabetes or diseases of abnormal glucose tolerance.

Diabetes is a multi-cause metabolic disease, which is characterized by chronic high blood glucose, accompanied by sugar, fat and protein metabolism disorder caused by the defect of insulin secretion and/or action. Diabetes is also a very old disease, which is due to the relative or absolute lack of insulin in the human body, causing the increased concentration of blood glucose, resulting in sugar discharged in a large amount with the urine, and accompanied by polydipsia, polyuria, polyphagia, weight loss, dizziness, fatigue and other symptoms.
In the treatment of diabetes, exercise therapy and diet therapy are two essential treatments of diabetes. When these two treatments are not sufficient to control the disease condition, insulin or oral hypoglycemic agents can be used. However, since these existing hypoglycemic agents have too many side effects, it is particularly important to develop a novel drug with less side effects and more therapeutic effects in the treatment of diabetes.
Dipeptidyl peptidase IV (DPP-IV) is a serine protease, which can selectively cleave the N-terminus dipeptide of the peptide chain containing one proline residue at the penultimate position from the N-terminal. Although the physiological effect of DPP-IV on mammals has not been fully confirmed, it plays an important role in neuropeptide metabolism, T-cell activation, adhesion of cancer cells and endothelium, process of HIV virus coming into lymphocytes, and other processes (see WO 98/19998).
Studies have shown that, DPP-IV can degrade glucagon-like peptide (GLP-1), i.e., by cleaving the histidine-alanine dipeptide at N-terminal of GLP-1, the GLP-1 in its active form can be degraded into inactive GLP-1-(7-36) amide, which is further degraded into inactive GLP-1-(9-36) amide (see, Hansen L, Deacon C F, Ørskov C, et al., Endocrinology, 1999, 140: 5356-5363). In physiological conditions, the half-life of intact GLP-1 in circulatory blood is very short, and the inactive metabolites obtained from the degradation of GLP-1 by DPP-IV can bind with the GLP-1 receptor to antagonize the active GLP-1, so as to shorten the physiological responses of GLP 1 receptor to GLP-1, while the DPP-IV inhibitors can completely protect endogenous, even exogenous GLP-1 from being inactivated by DPP-IV, and thus greatly increase the physiology activity of GLP-1 (by 5-10 times). GLP-1 is an important stimulus to the secretion of pancreatic insulin and can directly influence the distribution of glucose, therefore, DPP-IV inhibitors play a very positive role in the treatment of patients with non-insulin-dependent diabetes (U.S. Pat. No. 6,110,949).


A substrate processing method of a substrate provided with an anti-reflective coating which extends to or beyond a peripheral edge of the substrate is disclosed. The method includes removing a portion of the anti-reflective coating adjacent to and around a periphery of the substrate using a back-side removal process, depositing a layer of radiation sensitive material onto the anti-reflective coating, depositing a top-coat layer onto the layer of radiation sensitive material, and simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate using a top-side removal process.

A lithographic apparatus is a machine that applies a desired pattern onto a target portion of a substrate. Lithographic apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In that circumstance, a patterning device, which is alternatively referred to as a mask or a reticle, may be used to generate a circuit pattern corresponding to an individual layer of the IC, and this pattern can be imaged onto a target portion (e.g. comprising part of, one or several dies) on a substrate (e.g. a silicon wafer) that has a layer of radiation-sensitive material (resist). In general, a single substrate will contain a network of adjacent target portions that are successively exposed. Known lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion in one go, and so-called scanners, in which each target portion is irradiated by scanning the pattern through the beam in a given direction (the "scanning"-direction) while synchronously scanning the substrate parallel or anti-parallel to this direction.
A layer of resist (or other material) is often provided on the surface of a substrate using a spin-coating process. The material used to form the layer is dropped onto the center of the substrate, and the substrate is then rotated. The material flows out towards the edge of the substrate and provides a layer of generally uniform thickness across the surface of the substrate. During the spin-coating process, a thick bead of material is known to form around the edge of the substrate. This bead around the edge of the substrate is commonly referred to as an edge bead. It is desirable to remove this edge bead for a number of reasons. Firstly, it may be difficult or impossible to apply a uniform pattern to, for example, resist forming the edge bead since it is of a greater thickness than resist towards the center of the substrate. Furthermore or alternatively, material forming the edge bead may break off and contaminate the substrate or parts of the lithographic apparatus.

Lithographic method and device manufactured thereby


A method and apparatus is provided for attaching a tire chain to a vehicle tire without necessarily crawling under the vehicle. Two members are connected to a tire chain. The members are then drawn together using a tensioning device, which allows connection of the tire chain.

Attaching a tire chain onto the tire of a motor vehicle is often an extremely difficult and messy process. A major difficulty with attaching a tire chain is trying to connect the inner chain links, those on the far side of the tire. This can often require crawling under the fender of the motor vehicle alongside a busy road during a howling snowstorm. In addition, once the tire chains are attached to the tires, they are invariably loose and require a second roadside stop for retightening. Tire chain mounting devices have been developed that attempt either to obviate the need for attaching the inner links or to align the inner links to make the attachment simpler. Each of those devices has disadvantages, though, and none has been adopted widely in the marketplace.

Tire chain attachment apparatus and method


An electrical connector includes a number of contact elements that, in the preferred embodiment, are pins. Each pin includes an electrically conductive contact surface that is configured to engage an electrically conductive surface within a mating connector to achieve an electrical connection. Each pin also includes a leading surface that is integral with the contact surface and is configured to contact the conductive surface of the mating connector during connection and disconnection with the mating connector. One advantageous feature of the invention is the provision of a detent between the leading surface and the contact surface. The detent collects surface debris from the leading surface before the debris can be swept onto said contact surface during connection. As a result, any debris that is collected in the detent will not interfere with the electrical connection between the pin and the conductive surface in the mating connector.

1. Field of the Invention
This invention relates to an improved contact element for an electrical connector. More specifically, this invention relates to an improved contact element that has a detent defined therein for collecting surface debris during mating and unmating of the contact element with a mating connector.
2. Description of the Prior Art
Contact elements for electrical connectors come in a wide degree of configurations, sizes and materials. Many contact elements, such as the pins that are used in modern high density electrical connectors, are constructed and arranged for sliding engagement with an electrically conductive surface on a mating connector. For example, a mating connector may be a socket that has flexible arms for receiving such a pin element.
It is well known that the presence of contaminants on a contact surface of an electrical connector will adversely affect the quality of the electrical connection that can be achieved. Contamination may result from corrosion of the surface of the contact element, from dust, from marine or perspiration-induced salt contamination, or from a myriad of other factors.
To prevent corrosion of the contact surface, high quality electrical connectors often include contact elements made of a copper base material that is coated or plated with gold. If the gold coating or plating is without imperfections, the contact surface should theoretically be free from the effects of corrosion. Unfortunately, the presence of micropores in the gold coating or plating can permit corrosion of the underlying copper to take place. As a result, corrosion products such as copper chloride can end up on the contact surface and affect the quality of the connection.
By increasing the thickness of the gold coating, the number of micropores can be reduced, or, at some thickness, completely eliminated. However, it will be appreciated that increasing the thickness of the gold coating can significantly add to the cost of the connector.
It is clear that there has existed a long and unfilled need in the prior art for an electrical connector that includes contact elements that are constructed to maintain a high quality electrical connection with a mating connector in a corrosive environment, without requiring a relatively thick, expensive coating of gold thereon.

Contact element for an electrical connector


A cassette-type roll stand for a two-high roll pair, wherein the bearing chocks of the roll stand are guided in a cassette formed by two housing frames which can be moved into and out of the roll stand. The housing frames are constructed as upwardly open U-shaped frames having oppositely located side members, wherein the side members are provided with guides for the bearing chocks of the lower roll and wherein one of the side members has extension projections with pivot bearings for the sides of the bearings chocks of the upper roll facing the pivot bearings. The other sides of the bearing chocks facing away from the extension projections are connected through spring-elastic connecting rods to the corresponding sides of the bearing chocks of the lower roll. In addition, an adjusting device and support and measuring devices for the cassette-type roll stand are arranged in the support frame.

1. Field of the Invention
The present invention relates a cassette-type roll stand for a two-high roll pair, wherein the bearing chocks of the roll stand are guided in a cassette formed by two housing frames which can be moved into and out of the roll stand.
2. Description of the Related Art
Cassette-type roll stands of the above-described type are always constructed as complete roll stands with their own adjusting devices and partially with their own roll fittings as well as other support devices and measuring devices. The roll stands are usually moved on rails into the support structure and are then secured and aligned in the support structure. This complete configuration, which must also be present in the cassette-type roll stands which are used for the support structure and are intended for replacement, is technically difficult and expensive; the configuration is also technically difficult with respect to the preassembly of the cassette-type roll stands to be replaced.

Cassette-type roll stand for a two-high roll pair


A mobile communication system capable of increasing communication efficiency and a method therefor are provided, including a receiver for grouping n MCS levels (where n>0) into continuous m MCS levels (where n>m>0) according to the quality of a data channel for transmitting an information signal, and sending information on an MCS group using a pilot signal, and an ACK or an NACK signal, which indicates whether the information signal is completely received; and a transmitter for storing information on the n MCS levels, extracting the m MCS levels according to the information on the MCS group transmitted from the receiver, determining one of the extracted m MCS levels as an initial MCS level, modulating and coding information data to be transmitted according to the initial MCS level and transmitting the result to the receiver, and changing the current MCS level in response to the ACK or the NACK signal.

1. Field of the Invention
The present invention relates to a mobile communication system. More particularly, the present invention relates to a mobile communication system capable of increasing communication efficiency with an adaptive modulation and coding (AMC) scheme, and a method therefor.
2. Description of the Related Art
In order to transmit a large quantity of data to a wireless channel environment, information regarding a current channel obtained from a receiver must be sent to a transmitter at a precise time. In this arrangement, it is possible to change a modulation mode and a coding mode according to the condition of a current channel, and transmit a large amount of data without a loss in data. Here, much attention is directed to how to transmit information regarding a channel from the receiver to the transmitter with the least amount of feedback bits and without an error or delay in transmission, thereby saving wireless channel resources. Additionally, the transmitter is required to select the optimum level out of a plurality of levels of a modulation and coding scheme (MCS), using the channel information transmitted from a receiver, and to transmit a large amount of data to a wireless channel environment.
In general, a common pilot channel (CPICH) method or a cyclic redundancy check (CRC) method is adopted to identify the channel environment of a receiver and to change a combination level of an MCS level according to the detected channel environment.
FIG. 1 is a schematic block diagram of a conventional mobile communication system adopting the CPICH method. This mobile communication system includes a transmitter 10, a data channel 20, a receiver 30, and a feedback channel 22. The transmitter 10 includes an adaptive modulation and coding (AMC) unit 12. The receiver 30 includes a demodulation & decoding unit 32, a channel quality measurement unit 34, and an MCS level selection controller 36.
FIG. 2 is a view explaining a process of exchanging data between the transmitter 10 and the receiver 30.
Referring to FIGS. 1 and 2, in step 40 of FIG. 2, the transmitter 10 sends channel information together with a pilot signal CPICH, which is used to measure the quality of a channel, to the receiver 30 via a pilot channel (not shown). Then, the channel quality measurement unit 34 of the receiver 30 receives the pilot signal CPICH together with the channel information from the transmitter 10, measures a signal-to-interference ratio (SIR) or a signal-to-noise ratio (SNR) as the quality of a channel using the pilot signal CPICH, and transmits the result to the MCS level selection controller 36.
The MCS level selection controller 36 selects a level of MCS according to the quality of the channel measured by the channel quality measurement unit 34. FIG. 3 is a view of MCS levels MCS1 through MCS7, and boundary values TH1 through TH6 that define the boundaries between the MCS levels MCS1 through MCS7 in the case of W-CDMA (code division multiple access). Next, in step 42, the MCS level selection controller 36 compares each boundary value with the quality value of a channel measured by the channel quality measurement unit 34, selects a current MCS level based on the comparing result, and transmits information on the selected MCS level to the AMC unit 12 of the transmitter 10.
Referring to FIG. 1, in step 44 of FIG. 2, the AMC unit 12 sends a signal x[i], which is a transmission signal s[i] modulated and coded according to the MCS level transmitted from the MCS level selection controller 36, to the receiver 30 via the data channel 20. While passing through the data channel 20, the signal x[i] is combined with channel noise G[i] and white noise n[i] and becomes a signal y[i]. Finally, the signal y[i] is transmitted to the receiver 30.
Although not shown in FIG. 1, in step 46 of FIG. 2, either the receiver 30 sends an acknowledgement (ACK) signal to the transmitter 10 when it completely receives data from the transmitter 10 or the receiver 30 sends a signal NACK when it fails to completely receive the data. In step 48, when the transmitter 10 receives the NACK signal from the receiver 30, it resends the data to the receiver 30.
As previously mentioned, according to the CPICH method, the receiver 30 measures the quality of a current channel, using a pilot signal transmitted from the transmitter, and selects and transmits the optimum MCS level to the transmitter. Then, the transmitter determines the degree of modulation and coding according to the optimum MCS level, and returns the result to the receiver.
This conventional CPICH method, however, wastes uplink wireless channel resources because MCS selection bits corresponding to the number of MCS levels must be periodically transmitted to a transmitter at predetermined instants of time. For instance, in current W-CDMA that classifies the MCS into seven levels, the channel quality measurement unit 34 transmits three bit MCS selection bits to the transmitter at every three slots. In addition, six comparators are required to compare a measured quality value of a channel with each of the boundary values TH1 through TH6, thereby complicating the circuit structure of a mobile communication system. These comparators are installed in a receiver, i.e., a handset, which causes an increase in the power consumption of the handset.
Further, when the receiver has an error in measuring a channel and a delay in feedback, the actual conditions of the channel may be different from the measured conditions of the channel at the time when a transmitter modulates and codes a signal and transmits the result to the receiver based on channel information measured by the receiver. This will lower throughput. Here, the delay in feedback is the delay of time that is spent while the channel quality measurement unit 34 measures the quality of a channel and the MCS selection controller 34 selects the optimum MCS level according to the measured quality of the channel. In other words, the greater the number of MCS levels, the longer the time lost in selecting the optimum MCS level and the longer a delay in feedback become.
The CRC method has been recently suggested as an alternative of the CPICH. FIG. 4 is a view explaining a process of exchanging data between a receiver and a transmitter according to a conventional CRC method.
Referring to FIG. 4, in step 50, the transmitter 10 directly sends CRC information, which is used to detect an error in an actual channel, along with data to the receiver 30 without receiving any feedback regarding an MCS level according to the quality of the channel from the receiver 30. At this time, the transmitter 10 transmits the CRC information and data to the receiver 30 at the lowest MCS level. Then, in step 52, the receiver 30 checks whether the CRC information contains an error, and sends an ACK signal if no error is detected. In step 54, if the ACK signal is continuously transmitted from the receiver 30 to the transmitter 10 a predetermined number of times, the transmitter 10 raises the MCS level by one level and then, sends CRC information and data to the receiver 10. However, if the receiver 30 detects an error during the check of the CRC information, in step 56, the receiver 30 sends an NACK signal to the transmitter 10. Subsequently, in step 58, the transmitter 10 lowers the MCS level by one level and resends the data to the receiver 30.
In conclusion, according to the conventional CRC method, the transmitter 10 begins sending data together with CRC information at the lowest MCS level without information on the quality of a channel, and optimizes the MCS level in response to the ACK signal, which is transmitted from the receiver 30 as confirmation of safe receipt of the data, or the NACK signal which is transmitted from the receiver 30 when an error is detected in the CRC information. Therefore, if conditions of a channel are sufficient to transmit data at the highest MCS level, the CRC method requires a long time to achieve a desired MCS level. Also, while the level of the channel increases to a desired MCS level, the transmitter 10 transmits only a small amount of data, which does not match the transmission capability of the channel, thereby reducing data throughput.
As a result, in a conventional mobile communication system, uplink frequency resources are wasted due to the amount of feedback information regarding the quality of a channel and frequent reports on channel information. Further, it is difficult for a transmitter to use to correct channel information at a desired time due to a feedback error and a delay in the transmission of feedback information. Otherwise, an MCS level cannot be adjusted to correspond to the quality of a current channel until information is exchanged between a transmitter and a receiver for considerable time. During this time, a small amount of the transmission of data, which does not match the quality of a channel, is transmitted from a transmitter to a receiver, thereby reducing data throughput.

Communication system and method for increasing communication efficiency


The present invention relates generally to a method of eliciting or otherwise inducing an effective immune response to a micro-organism and compositions for use therein. More particularly, the present invention relates to a method of inducing an immune response to a parasite utilising an immunogenic composition comprising a glycosylphosphatidylinositol (referred to herein as “GPI”) inositolglycan domain or its derivatives. Even more particularly, the present invention contemplates an immunogenic composition comprising the Plasmodium falciparum GPI inositolglycan domain or its derivatives. The present invention is useful, inter alia, as a prophylactic and/or therapeutic treatment for disease conditions such as, for example, infection by parasites and in particular infection by Plasmodium species.

Bibliographic details of the publications numerically referred to in this specification are collected at the end of the description.
The malaria parasite is considered to be one of the single most serious infectious agents in the world, infecting 5% of the global population and causing serious mortality and morbidity to sensitive populations and hampering socioeconomic development.
Severe malaria infection shares several clinical features in common with bacterial septic shock. In both conditions, the excess production by macrophages of pro-inflammatory cytokines such as Tumor Necrosis Factor (TNF), Interleukin-1 (IL-1) and IL-6 occurs in response to malaria "toxins" and lipopolysaccharide (LPS), respectively, leading to complications such as fever and hyperpyrexia, leukopenia, thrombocytopenia, hypotension, disseminated intravascular coagulation, leukocyte infiltration, vascular permeability and multi-organ inflammation, which may lead eventually to death. Thus, many signs, symptoms and syndromes in acute and severe malaria infection result from the activity of a parasite "toxin" released into the circulation during the blood-stage developmental cycle of the infection.
GPI has been identified as a candidate toxin of parasite origin (Schofield and Hackett, 1993 and Tachado et al, 1997). The structure of the molecule has been elucidated (Gerold et al, 1992 and Gerold et al, 1996) and it comprises a lipidic domain and a glycan domain. Intact GPI occurs in two closely related forms, Pfglα (NH—CH2—CH2—PO4-(Manα1-2)-6Manα1-2Manα1-6Manα1-4GlcN—H2α1-6(myristoyl)-myo-Inositol-1-PO4-dipalmitoylglycerol), and Pfglβ (NH—CH2—CH2—PO4-6Manα1-2Manα1-6Manα1,4GlcN—H2α1-6(myristoyl)-myo-Inositol-1-PO4-dipalmitoylglycerol).
The parasite derived GPI molecule regulates host cell function and gene expression in various tissues by activating endogenous GPI-based signal transduction pathways, involving hydrolysis into second messengers and the activation of both tyrosine and serine/threonine kinases. This leads to the activation of the NFκB/c-rel family of transcription factors, which regulate the expression of numerous pro-inflammatory loci implicated in malarial pathology, such as TN-F IL-1, iNOS and ICAM-1.
The toxin theory of malarial pathogenesis can be ascribed to Camillo Golgi, in 1886, who hypothesized that the proximal cause of the febrile paroxysm was a released toxin of parasite origin (Golgi, 1886). Clark proposed that the systemic inflammation of malaria infection resulted from a functional malarial endotoxin, and suggested that this agent exerts systemic effects largely through the induction of endogenous pyrogens of host origin. Clark correctly identified TNF as a major host mediator of disease (Clark, 1978 and Clark et al, 1981). Consequently, the production of this and related pyrogenic cytokines (IL-1, IL-6) from monocyte/macrophages is often taken as a useful surrogate marker for the initiation of pathological processes in malaria infection. John Playfair and his colleagues extended this work to show that crude extracts of rodent malaria parasites could induce macrophages to secrete TNF in vitro (Bate et al, 1988 and Bate et al, 1989) and inferred that the toxin included a phospholipid moiety. Nonetheless, prior to the advent of the present invention, the specific biochemical identity of the parasite toxin, and its mechanism of action, have remained obscure.
In work leading up to the present invention, the inventors investigated the use of portions of GPI to induce protective immunity against malarial pathology. The inventors have surprisingly discovered that GPI portions which exclude the lipidic domain induce protective immunity whereas portions carrying the lipidic domain do not.

Immunogenic compositions and uses thereof

The Walter and Eliza Hall Institute of Medical Research


An energy monitoring device including procedures for secure communication of data from the device is disclosed. The energy monitoring device includes a public/private key pair used to encrypt and/or digitally sign communications by the device. This allows the receivers of these communications to authenticate the communications to ensure that the device and/or communications have not been compromised. The energy monitoring device is further capable of communications via an ad-hoc “mesh” network, thereby facilitating communications among devices which are substantially inaccessible due to either physical or economic limitations.

In facilities, e.g. buildings or installations, where a significant amount of power is used among a variety of units, it would be desirable to allow the building owner to allocate energy costs to the different units, i.e. consumers, within the facility. For a commercial office building, these units may include the different tenants within the building or the common loads for the facility, such as the elevators or HVAC systems. For an industrial facility, these units may include the different production lines, machines or processes within the facility. As opposed to allocating costs based on a fixed or formulaic approach (such as pro-rata, e.g. dollars per square foot or based on the theoretical consumption of a process/machine), an allocation based on actual measurements using appropriate monitoring devices may result in more accurate and useful information as well as a more equitable cost distribution.
Both installation and ongoing, i.e. operational and maintenance, costs for these monitoring devices are important considerations in deciding whether a monitoring system is worth the investment. While monitoring devices may be read manually, which does not increase the installation cost, manual data collection may increase on-going/operational costs. Alternatively, monitoring devices may be interconnected and be automatically read via a communications link. However, typical communication links require wiring to interconnect the devices which increases the installation cost. In addition, a particular tenant in the building may wish to verify that they are being billed correctly by reading the energy meter or other energy monitoring device that is accumulating their energy usage. This may be a straightforward, although labor intensive and cumbersome, process with a typical energy meter which provides a display viewable by the tenant.
Emerging wireless mesh (or ad-hoc) networking technologies can be used to reduce the installation costs of monitoring devices while providing for automated data collection. Also called mesh topology or a mesh network, mesh is a network topology in which devices are connected with many redundant interconnections between network nodes. Effectively, each network node acts as a repeater/router with respect to received communications where the device is not the intended recipient in order to facilitate communications between devices across the network. Using wireless interconnections permits simpler and cost-effective implementation of mesh topologies wherein each device is a node and wirelessly interconnects with at least some of the other devices within its proximity using RF based links. Mesh networking technologies generally fall into two categories: high-speed, high bandwidth; and low speed, low bandwidth, low power. The first category of devices are typically more complex and costly that the second. Since energy monitoring does not typically require high speed/high bandwidth communication, the second category of devices is often sufficient in terms of data throughput.
Energy monitoring devices may include electrical energy meters that measure at least one of kWh, kVAh, kVARh, kW demand, kVA demand, kVAR demand, voltage, current, etc. Energy monitoring devices may also include devices that measure the consumption of water, air, gas and/or steam.

Methods and apparatus for retrieving energy readings from an energy monitoring device


Automatically adjust the size of a Physical Uplink Control Channel, PUCCH, of an uplink communication subframe. In a particular embodiment, the size of a semi-static region of the PUCCH is adjusted. The adjustment is based on a utilization factor of the PUCCH over a time period. The adjustment can also be based on the connection factor (connections between the wireless terminals and the cell) and/or based on the utilization factor of a PUSCH (Physical Uplink Shared Channel). The result is an efficient resource utilization on the PUCCH, and a properly dimensioned PUCCH region.

Long Term Evolution, also referred to as "LTE", is a radio access technology being standardized by the 3rd Generation Partnership Project, hereinafter referred to as "3GPP". In LTE, all services are supported through a packet switched domain. Downlink and uplink transmission in LTE use multiple access technologies—orthogonal frequency division multiple access, referred to as "OFDMA", for the downlink, and single-carrier frequency division multiple access, referred to as "SC-FDMA" for the uplink.
FIG. 1 graphically represents an example subframe of an OFDMA/SC-FDMA radio signaling. In both OFDMA and SC-FDMA, a large number of closely spaced orthogonal subcarriers are transmitted in parallel. Thus, the signaling is defined by both frequency and time components.
In LTE, radio communication between a user equipment, hereinafter referred to as "UE" and an eNodeB is performed through defined radio frames. Each frame is 10 ms long and is divided into 10 subframes, each 1 ms long. Each subframe is further subdivided into two slots each with 0.5 ms duration. Thus, a transmitted signal in each slot or subframe is defined by a resource grid of a number of subcarriers in the frequency domain and a number of symbols in the time domain.
In FIG. 1, one downlink/uplink subframe, i.e., two slots, of LTE's radio resource is illustrated. The subframe is allocated in units of one or more physical resource blocks, hereinafter referred to as "PRB". That is, the PRB is the smallest unit of radio resource assigned by the eNodeB for any UE. Depending on the configuration, each PRB spans a number of subcarriers in the frequency domain and spans a number of symbols, either OFDM or SC-FDMA, in the time domain. One symbol on one subcarrier is a resource element or simply "RE".
In each PRB, there are 12 consecutive subcarriers in the frequency domain. With a normal spacing of 15 kHz between adjacent subcarriers, the frequency bandwidth of each PRB is 180 kHz. The PRB also spans 7 symbols in the time domain, i.e., the PRB spans one slot or 0.5 ms.
No dedicated channels are used in LTE to transport user data. Instead shared transport channel resources are used in both the downlink and the uplink. For the uplink, the uplink shared channel is controlled by a scheduler on the eNodeB that assigns different parts of the shared channel to different UEs for transmission of user data to the eNodeB. The uplink shared channel is mapped to the physical uplink shared channel, hereinafter referred to as "PUSCH", on the downlink SC-FDMA subframe. The PUSCH is used primarily for data transport, and therefore, is designed to achieve high data rates.
The SC-FDMA subframe also includes the physical uplink control channel, hereinafter referred to as "PUCCH". The PUCCH is used to carry uplink control information, or simply "UCI", from the UEs to the eNodeB as will be explained further below.
FIG. 2 illustrates a simplified view of the SC-FDMA subframe. The view is simplified in that only the PUSCH and PUCCH resources are illustrated. It is recognized that in addition to the PUSCH and the PUCCH, the SC-FDMA subframe can also carry the physical random access channel, referred to as "PRACH" and the reference signal. But in general, the amount of the SC-FDMA subframe resources allocated to the PRACH and the reference signal is minor in relation to the PUSCH and the PUCCH. FIG. 2 reflects the observation that the SC-FDMA subframe is predominantly shared between the PUSCH and the PUCCH.
The PUSCH resource occupies the middle subcarriers of the SC-FDMA frequency spectrum. On the spectrum band edges, a control region is located on which the PUCCHs are transmitted. As mentioned above, the PUCCHs are allocated to allow the UEs to transfer the UCIs to the eNodeB. The UCI includes channel quality indication reports, scheduling requests, and ACK/NACK responses from UEs to previously scheduled downlink user data transmission from the eNodeB. The channel quality indication and the scheduling requests may also be referred to as "CQI" and "SR", respectively.
To enable efficient resource utilization of the PUCCH, the SR, CQI, and ACK/NACK responses of several UEs are multiplexed on the PUCCH through code division multiplexing, also referred to as "CDM". This allows several UEs to share one PRB of the PUCCH.
As noted previously and illustrated in FIG. 2, the uplink SC-FDMA subframe is primarily shared between the PUCCH and the PDCCH. That is, when a greater portion of the SC-FDMA subframe is allocated to the PUCCH, less is available for the PUSCH and vice versa.
Since the PUSCH carry user data, then to increase user data throughput, the PUSCH allocation should be maximized. This can be accomplished by an aggressive allocation of the PUCCH, e.g., assigning many CDM codes so that many UEs can simultaneously transmit the CQI reports, SRs, and ACK/NACK responses, etc., on the same time-frequency resource, i.e., share the same PRB of the PUCCH to minimize the PUCCH and correspondingly increase the PUSCH. However, many UEs simultaneously using the same PRB carries a risk of unacceptable error probability due to interferences. This in turn would decrease the system and/or user throughput and degrade overall system performance.
On the other hand, an unnecessarily cautious allocation—either through increasing the amount of resources allocated to the PUCCH or reducing the amount of signaling sent on the PUCCH—also carries risks. Increase in the of PUCCH allocation correspondingly reduces the uplink resources available for the PUSCH, which can lead to reduced data throughput. A reduction in the signaling amount can lead to a performance degradation due to delay caused by sparser SR opportunities, less accurate channel information due to sparser CQI reports, and restrictions on the scheduler due to less flexibility in the number of ACK/NACK responses.

Self-organizing network control for PUCCH resources


The present disclosure includes a first housing configured in a cylindrical shape, an inlet port provided to the first housing to suck air therein, an inlet pipe communicating with the inlet port and extending to a front side of the housing with a length-directional axis positioned side by side with a ground surface, a cyclone forming part provided to separate dust from air flowing into the first housing, a second housing communicating with the first housing and coupled to a rear side of the first housing, a fan provided with the second housing to provide a suction force to enable air to be sucked into the first housing through the inlet port, a battery provided to supply power to the fan, and a handle part including a handle base coupled to a top side of the first housing and a handle body connected to the handle base.

Generally, a cleaner is an appliance for discharging air from a body of the cleaner in a manner of sucking external air containing particles such as dust and the like using a negative pressure generated by a fan installed in the body, filtering off the particles, and then discharging the air from the body.
According to the power supply types, cleaners can be mainly categorized into a wired cleaner having power supplied from a power socket using a wire externally extended from a body and a wireless cleaner having a secondary battery installed in itself.
As the wireless cleaner market is fast growing, although the relevant technologies tend to be developed together, there are still many tasks including fatigue caused by cleaner weight, user's displeasure due to the discharged air, a problem of air suction efficiency and the like.
A related art cleaner is shown in FIG. 1. Problems of the related art are described with reference to FIG. 1 as follows.
First of all, in a related art cleaner, a fan is provided within a housing C and a handle A is disposed in rear of the fan. In doing the cleaning, fatigue on user's wrist, shoulder, arm, waist and the like may be aggravated disadvantageously.
Namely, as center of gravity of the fan that is one of the heavy components of the cleaner is relatively spaced apart from a center of the handle A, when the cleaner is moved in back-and-forth or top-and-down directions or a high spot such as a ceiling is cleaned, a relatively more force is required.
Secondly, as a related art cleaner is generally configured to discharge air into a space in front of a user, hot air stays on a user's moving route, thereby causing a problem of displeasure to a user.
Thirdly, regarding a related art cleaner, since an air inlet of a fan housing is located above and an air outlet is located below, a flow path resistance generated from an inside of the housing C due to unnecessary flow path bending is disadvantageously high.


Encapsulated liquid crystal is deposited onto an electrode by providing a substrate having an electrode pattern thereon; placing the substrate and the electrode pattern in contact with an electrodeposition medium comprising a liquid crystal composition, a containment medium or precursor therefor, and optionally a carrier medium; and depositing encapsulated liquid crystal material comprising the liquid crystal composition dispersed in the containment medium onto the electrode pattern or selected portions thereof by applying a voltage to the electrode pattern or selected portions thereof. The coated substrate-electrode combination can then be made into displays, privacy screens, signs, architectural partitions, and the like.

Liquid crystal displays ("LCD's") and other devices in which the electro-optically active element comprises liquid crystal material are well known.
One type of device employs an encapsulated liquid crystal structure in which a liquid crystal composition is encapsulated or dispersed in a containment medium such as a polymer. When a voltage corresponding to a sufficiently strong electric field is applied via an electrode across the encapsulated liquid crystal structure (the "field-on" condition), the alignment of the liquid crystal molecules therein is re-oriented in accordance with the field, so that incident light is transmitted. Conversely, in the absence of such a voltage (the "field-off" condition) the alignment of the liquid crystal molecules is random and/or influenced by the liquid crystal-matrix interface, so that the structure scatters and/or absorbs incident light. The applied voltage at which the structure changes from its field-off condition to its field-on condition is generally referred to as the threshold voltage. Such devices can be used in displays, architectural partitions, automobile sun-roofs, privacy screens, and signs.
Generally, the encapsulated liquid crystal material is applied to a substrate-electrode combination in a fluid, spreadable precursor form and allowed to convert to its final form by evaporation of a solvent or carrier medium, by a chemical reaction such as polymerization, or by a physical change such as solidification upon cooling. An alternative method is to prepare a film or sheet of encapsulated liquid crystal material and then laminate it to the substrate-electrode combination.
Fergason, U.S. Pat. No. 4,435,047 (1984), discloses making an encapsulated liquid crystal device by preparing an emulsion comprising liquid crystals, a containment medium, and a carrier medium, laying a layer of the emulsion onto a substrate-supported electrode, and allowing the emulsion to dry.
Doane et al., U.S. Pat. No. 4,688,900 (1987), discloses the preparation of encapsulated liquid crystal devices by applying a combination of unpolymerized containment medium precursor monomer and liquid crystal onto a substrate/electrode and polymerizing the monomer.
West et al., U.S. Pat. No. 4,685,771 (1987), discloses the preparation of encapsulated liquid crystal devices by a solvent- or temperature-induced phase separation technique.
The prior art methods have a number of limitations. It is difficult to selectively coat only the portions of the device which are actually electro-optically active, i.e., where the electrode material is present, so that in practice almost the entire substrate is coated. Where the electrode pattern is intricate but relatively small in terms of over-all area, a large proportion of the encapsulated liquid crystal material is effectively wasted. They cannot conveniently apply different types of encapsulated liquid crystal materials to different areas of the electrode/substrate combination, for example in making colored displays. Where the substrate is not planar, for example, in automobile sunroofs or certain architectural applications, it is difficult to coat.
I have discovered a new method of applying encapsulated liquid crystal material to electrodes which overcomes the foregoing limitations.

Electrodeposition method of applying encapsulated liquid crystal material to electrodes


A semiconductor storage device is provided with: a memory cell array which includes a normal area and a redundancy area which replaces a defective memory cell in the normal area; a normal area refresh circuit which performs a CBR refresh operation of a memory cell which is connected to a word line in the normal area; and a redundancy area refresh circuit which performs a CBR refresh operation of a memory cell which is connected to a word line in the redundancy area in parallel with the CBR refresh operation of the memory cell in the normal area.

1. Field of the Invention
The present invention relates to semiconductor storage devices such as a dynamic random access memory (DRAM) which include a redundancy area as an area provided in a memory cell array, and in particular to a semiconductor storage device for which a refresh test of a redundancy area is performed.
Priority is claimed on Japanese Patent Application No. 2007-331550, filed Dec. 25, 2007, the content of which is incorporated herein by reference.
2. Description of Related Art
In semiconductor storage devices such as a DRAM, data retained in memory cells is refreshed at a predetermined cycle. A column-address-strobe (CAS) before row-address-strobe (RAS) refresh (hereinafter referred to as "a CBR refresh") is frequently used as such a refresh.
In a refresh operation in accordance with the CBR refresh, after a CBR refresh command has been input to a semiconductor storage device chip, a refresh address is automatically determined by the semiconductor storage device, a word line corresponding to the refresh address is activated by an X (row) decoder, and a refresh operation is automatically performed in the semiconductor storage device. Moreover, the refresh address is incremented or decremented every time that a CBR refresh command is input, so that different word lines are activated successively and refresh operations of memory cells connected to the respective different word lines are performed successively.
There is also a refresh method in which a refresh operation is performed in response to the input of an Activate command and to the subsequent input of a Precharge command (hereinafter referred to as "Activate command→Precharge command"). In this refresh operation, an Activate command for a memory cell array is input to a semiconductor storage device, and a refresh address is input to the semiconductor storage device at the same time. Subsequently, after a predetermined time tRAS (i.e., a waiting time from when the Activate command has been input until when a Precharge command is input) has elapsed, the Precharge command is input to the semiconductor storage device to precharge bit lines, and then a refresh operation is performed. In accordance with this refresh method, it is necessary to input a refresh address every time an Activate command is input. Moreover, the time required for the refresh operation is determined by the interval between commands input from the outside of the semiconductor storage device (i.e., an input interval between the Activate command and the Precharge command).
The present inventor recognized the following matters.
There are several problems in methods for performing a refresh test of a redundancy area in a semiconductor storage device.
As a first problem, although semiconductor storage devices may be configured to allow inputting CBR refresh commands for a normal area, such semiconductor storage devices are not configured to allow inputting CBR refresh commands for a redundancy area. For this reason, it is impossible to perform CBR refresh operations for the redundancy area, and hence refresh operations in accordance with the sequence of "Activate command→Precharge command" are used instead of the CBR refresh operations.
As a second problem, defective bits detected by a refresh test in accordance with a refresh method for a normal area may be different from those detected by a refresh test in accordance with a refresh method for a redundancy area due to a difference between these refresh methods. This problem is caused by a difference in internal operation timing between refresh operations in accordance with a CBR refresh command and those in accordance with the sequence of "Activate command→Precharge command". Specifically, in accordance with the CBR refresh command, the refresh operations are realized by automatically performing an activation operation followed by a precharge operation (hereinafter referred to as "Activate→Precharge") in the chip. In contrast, in accordance with the sequence of "Activate command→Precharge command", the refresh operations are performed in response to the commands supplied from a tester.
Therefore, it is desirable to avoid a situation in which defective memory cells cannot be detected by a refresh test of a redundancy area, which is caused by a difference in timing between refresh operations in accordance with the CBR refresh command and refresh operations in accordance with the sequence of "Activate command→Precharge command", by making it possible to input CBR refresh commands for the redundancy area. In other words, it is desirable to detect unstable bits (memory cells) having poor hold characteristics by performing CBR refresh operations for the redundancy area under the same conditions as those when semiconductor storage devices are actually used after the shipment thereof, thereby allowing the replacement of the unstable memory cells with redundancy memory cells. It is also desirable to solve the problem in that when CBR refresh operations for memory cells in the redundancy area are performed, the time required for the refresh operations increases in proportion to the number of the word lines in the redundancy area (hereinafter may be referred to as "redundancy word lines").
Meanwhile, there is a semiconductor storage device which performs CBR refresh operations for a redundancy area (see Japanese Unexamined Patent Application, First Publication No. 2002-124096 (hereinafter referred to as "Patent Document 1")). The Patent Document 1 aims at providing a semiconductor storage device which is capable of performing CBR refresh tests in the same manner as those for normal memory cells by inputting CBR commands of the same number of times as the number of the redundancy word lines and thereby ensuring the reliability of the redundancy word lines. To this end, the Patent Document 1 is provided with a redundancy CBR refresh counter. When performing a refresh test for redundancy memory cells, the redundancy CBR refresh counter is activated every time a control signal is input, the number of CBR commands which have been input is counted by the redundancy CBR refresh counter, and the counted value is output to an X address buffer as a redundancy counter signal. The X address buffer switches between an address counter signal output from a CBR refresh counter and the redundancy counter signal output from the redundancy CBR refresh counter so as to correspond to a case of performing a refresh test of memory cells and a case of performing a refresh test of redundancy memory cells, and outputs the switched counter signal as a counter signal used for generating an internal X address (XA0-XA11).
In this way, the semiconductor storage device of the Patent Document 1 switches between the address counter signal output from the CBR refresh counter and the redundancy counter signal output from the redundancy CBR refresh counter so as to correspond to the refresh test of the memory cells and the refresh test of the redundancy memory cells, and outputs the switched counter signal. As a result, it is impossible to test both the memory cells and the redundancy memory cells simultaneously, and hence it is necessary to test the memory cells and the redundancy memory cells separately, resulting in an increase in time required for the refresh test. There is also a problem in that control becomes complex because it is necessary to switch between the address counter signal output from the CBR refresh counter and the redundancy counter signal output from the redundancy CBR refresh counter, and to output the switched counter signal.

Semiconductor storage device having redundancy area


A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.

1. Field of the Invention
The present invention relates generally to sensor housing construction, and more particularly, to preformed sensor housings and methods to produce thin metal diaphragms.
2. Background of the Invention
Diaphragms and membranes are structures that play a critical role in pressure sensors. Diaphragms are used in pressure sensors such that pressure is usually measured by detecting and quantifying the deflection of a diaphragm onto which pressure is applied. Another important application of diaphragms is to isolate two different media from each other, but still allow transmission of pressure from one medium to another. This is normally done to protect a pressure-sensing element from an incompatible environment by encapsulating the sensor in a housing that is filled with a neutral fluid such as silicone oil. The external pressure is transmitted to the oil, and therefore to the pressure sensor, through a flexible membrane that is hermetically attached to the housing. In this application, the diaphragm also functions as an isolation membrane to "isolate" one environment from the other. When these diaphragms and isolation membranes are metallic, they may be attached to housings by various methods such as welding, brazing, or with the use of adhesives. These attachment methods, however, are difficult to implement when the application requires very small diaphragms or membranes (i.e., diaphragms and membranes having very small diameters, or sizes). An example of such applications is implantable medical catheters used to measure pressure inside the body.

Preformed sensor housings and methods to produce thin metal diaphragms


A light emitting device includes a first layer that generates light by an injection current, the first layer is provided with a first optical waveguide extending from a first light emitting section disposed on a first side surface to a first light reflecting section disposed on a second side surface, a second optical waveguide extending from the first light reflecting section to a second light reflecting section disposed on a third side surface, and a third optical waveguide extending from the second light reflecting section to a second light emitting section disposed on the first side surface, and an element of the group II or the group XII is diffused in the first light reflecting section and the second light reflecting section.

1. Technical Field
The present invention relates to a light emitting device, a super-luminescent diode, and a projector.
2. Related Art
A super-luminescent diode (hereinafter also referred to as an "SLD") is a semiconductor light emitting device capable of providing an output up to several hundreds of mW with a single device similarly to a semiconductor laser, while showing a broadband spectrum and thus being incoherent shape similarly to an ordinary light emitting diode.
The SLD can be used as, for example, alight source of a projector, and for realizing a small-sized and high-brightness projector, it is required to use a light source with high light output and low etendue. In order to achieve this, it is preferable that the lights emitted from a plurality of gain regions travel in the same direction. In JP-A-2010-3833 (Document 1), by combining the gain region having a linear shape and the gain region having a winded shape at a reflection surface, the lights respectively emitted from the light emitting sections of the two gain regions are made to proceed in the same direction.
To reduce loss of the optical system and number of optical components, there has been proposed a type of a projector that can perform light collection (including light collimation or reduction in diffusion angle of light) and uniform illumination at the same time by providing the SLD immediately below the light valve and using a lens array. In the projector of that type described above, it is required to provide the light emitting sections in accordance with the intervals of the lens array. In the technology described in Document 1, it is difficult to arrange the plurality of light emitting sections with intervals corresponding to a variety of lens arrays with different pitches, and therefore, it is not achievable to apply the technology to the projector of the type described above.

This patent is subject to a terminal disclaimer.

Light emitting device and super-luminescent diode having layer with first, second and third waveguides


System and method for determining distance in navigation of an electric aircraft is illustrated. The system and method comprise a sensor and a computing device. The sensor is configured to detect a surface and transmit at least a first signal and a first frequency and at least a second signal at a second frequency to a computing device, wherein the first signal and the second signal comprise a corresponding distance. The computing device is configured to receive a returned signal from the sensor, wherein the returned signal comprises an intermodulation product associated to the first signal and the second signal, detect an amplitude of the returned signal as a function of the frequency, identify a distance datum as a function of the amplitude and an amplitude threshold, determine an aircraft adjustment as a function of the distance datum, and transmit the distance datum and aircraft adjustment to a remote device.

During flight, it is important to know the distance between the aircraft and other objects to avoid any collisions or other types of harmful accidents. It is also important to know how far the aircraft is from a surface, like the ground or a building, especially during takeoff and descent.


A semiconductor device includes a first well that is disposed in a semiconductor substrate. The semiconductor device further includes a second well that is disposed in the semiconductor substrate. The semiconductor device further includes a source region, a drain region, and a gate structure between the source region and the drain region. The gate structure is disposed above the first well. The source region includes a first conducting contact above the first well and. The drain region includes a second conducting contact above the second well, the drain region being connected with the second well at least partially through a first epi region. The first epi region and the second well are configured to lower a first driving voltage applied on the source region and the drain region to a second voltage applied on the gate structure.

Silicon semiconductor processing has evolved sophisticated operations for fabricating integrated circuits. As advancement in fabrication process technology continues, the core and Input/Output (I/O) operating voltages of integrated circuits have decreased. However, operating voltages of auxiliary devices have remained about the same. The auxiliary devices include devices interfaced to the integrated circuits. For example, the auxiliary devices may be printers, scanners, disk drives, tape drives, microphones, speakers, or cameras. Improvements in the design and fabrication of semiconductor devices will continue to drive evolution in the capabilities and performance of integrated circuits.

Metal oxide semiconductor devices and fabrication methods


A data processing apparatus is provided having a plurality of functional units. At least one of the functional units is operable to perform data processing operations and at least a subset of the plurality of functional units have at least one of a respective co-processor register for storing configuration data and a respective debug register for storing debug data. A debug controller outputs debug data and co-ordinates debug operations. A configuration ring-bus provides a ring path for communication of configuration instructions between a first ring sequence of the plurality of functional units and a debug ring-bus provides a ring path for communication of the debug data between a second ring sequence of the plurality of functional units. Separate provision of the debug ring-bus and the configuration ring-bus provides independent access to the co-processor register and to the debug register.

1. Field of the Invention
The present invention relates to data processing. In particular, the present invention relates to performing debug operations for data processing hardware.
2. Description of the Prior Art
It is known to provide debug functionality for production testing of data processing hardware using a serial scan-chain interface. One such scan interface is the IEEE 1149 standard "Standard Test Access Port and Boundary-Scan Architecture", written by the Joint Test Action Group (JTAG). The JTAG standard defines a five-pin serial protocol for accessing and controlling signal-levels within a digital circuit using serial scan chains.
It is known to configure a data processing apparatus by sending configuration data to each of a plurality of functional units of the data processing apparatus across a bus. The configuration data comprises access operations for transferring data from main registers to co-processor registers associated with at least a subset of the functional units. Although re-use of a functional data path for debug operations would provide for more flexibility and greater efficiency in performing debug operations, there is a risk that by communicating functional data, such as processor configuration data, on the same bus as the debug data that the debug operations themselves could interfere with the data processing operations being performed. For example, if a data processing operation tries to execute a configuration instruction whilst a debug access is being communicated on the bus, then this configuration instruction will have to have at least one stall-cycle inserted. Thus, the use of the functional bus to distribute debug data can be intrusive to the processing operations themselves. It is highly desirable that a debug system should not in any way impact upon the actual execution of the process in operation. Insertion of extra stall cycles can itself introduce or remove bugs in a system. Hence, there is a requirement to provide a debug system that is non-intrusive to the processing operations of the system that is being debugged.

Provision of debug via a separate ring bus in a data processing apparatus


An electrostatic atomizer includes an atomizing electrode, a water supply unit for supplying water to the atomizing electrode, a high voltage power circuit and a control unit. The high voltage power circuit applies a high voltage to the atomizing electrode to electrostatically atomizing water supplied to the atomizing electrode and to generate electrically charged water particles. The control unit controls the high voltage power circuit such that the voltage applied to the atomizing electrode is gradually increased at the time of starting the electrostatic atomizer. Further, the control unit may control the high voltage power circuit such that the voltage is increased to a target voltage in steps at the time of starting the electrostatic atomizer, and an increment of the voltage at each step is decreased as the voltage approaches the target voltage.

Conventionally, there is known an electrostatic atomizer for generating electrically charged water particles by cooling an atomizing electrode to allow moisture in air to be condensed on the atomizing electrode, applying high voltage to the condensate water on the atomizing electrode by a high voltage power circuit and thus electrostatically atomizing the condensate water.
In the electrostatic atomizer, when a starting voltage is applied to the atomizing electrode of the electrostatic atomizer, Coulomb's force acts on the water on the tip portion of the atomizing electrode, so that the level of the water locally swells in the shape of a needle having a pointed leading end (called a "Taylor cone"). Electric charges are concentrated on the leading end of the Taylor cone, and thus become densified, so that electric field intensity and Coulomb's force therearound are increased and the Taylor cone grows. The water around the leading end of Taylor cone receives great energy (repulsive force of the densified charges) and is repeatedly segmented and scattered (called Rayleigh scattering), thereby generating charged water particles of nanometer size.
However, when a voltage is applied to the atomizing electrode from the high voltage power circuit at the time of starting the electrostatic atomizer, rush current flows, so that idle discharge (minus ion discharge) occurs in a state in which the Taylor cone is not formed. To that end, the tip portion of the atomizing electrode is vaporized, worn and deteriorated due to long periodic use, thereby resulting in unstable electrostatic atomization.
Further, it is disclosed in, e.g., Japanese Patent Laid-open Publication No. 2007-21370 that, in the electrostatic atomizer, the output of a discharge voltage is fed back to the high voltage power circuit, thus decreasing the variation in high voltage. However, Japanese Patent Laid-open Publication No. 2007-21370 does not disclose a technology of preventing the deterioration of the atomizing electrode due to the idle discharge at the time of starting the electrostatic atomizer.


A semiconductor device includes a capacitor which has: a lower electrode formed along an opening provided above a semiconductor substrate to have a concave cross section; a capacitor insulating film formed on the inner and top surfaces of the lower electrode; and an upper electrode formed on the capacitor insulating film. The upper electrode includes: a first conductive film formed on the inner surface of the capacitor insulating film and filling the opening; and a second conductive film formed to extend from the top surface of the first conductive film to the top surface of the capacitor insulating film.

(a) Fields of the Invention
The present invention relates to semiconductor devices used as, for example, DRAMs (Dynamic Random Access Memories), and to their fabrication methods.
(b) Description of Related Art
In recent years, as DRAMs as semiconductor memory devices have been increasing in capacity, miniaturization thereof has been advancing. Capacitor structures of the DRAMs are roughly classified into: a trench structure in which a trench is formed in a silicon substrate and a capacitor is formed inside the formed trench; and a stacked structure in which a capacitor is formed in a stacked film over a substrate. In order to accomplish miniaturization of the DRAM, a trench-shaped stacked capacitor structure is employed as the stacked capacitor. This structure is constructed so that a trench for forming a capacitor is formed in an interlayer insulating film, and a lower electrode, a capacitor insulating film, and an upper electrode are sequentially provided on a side wall and a bottom surface of the trench. For such a trench-shaped stacked capacitor structure, in order to maintain the charge retention capability and ensure a sufficient cell capacitance, the trench for forming the capacitor should be formed to have a greater depth. Along with this formation, a contact plug for connecting an interconnect layer to the substrate should also be elongated. Therefore, the following requirements are demanded of the trench-shaped stacked capacitor structure: suppression of parasitic capacitance, which is produced between the upper electrode and the interconnect, by providing the sufficiently-thick interlayer insulating film on the upper electrode; and easy formation of the contact plug penetrating the interlayer insulating film.
Herein, description will be made of a conventional DRAM with a typical trench-shaped stacked capacitor as shown in, for example, Japanese Unexamined Patent Publication No. 2004-349462 and its fabrication method. FIG. 4 is a sectional view showing the structure of the conventional DRAM with the stacked capacitor.
Referring to FIG. 4, the conventional DRAM includes: a silicon substrate 501; a DRAM cell transistor gate 502 formed over the silicon substrate 501; a first interlayer film 503 formed on the silicon substrate 501 and the DRAM cell transistor gate 502; first contact plugs 504a and 504b which are formed on impurity diffusion layers (not shown) provided in the silicon substrate 501, respectively, and which penetrate the first interlayer film 503; a silicon nitride film 505 formed on the first interlayer film 503; and a second interlayer film 506 formed on the silicon nitride film 505 and provided with a trench reaching the top surface of the first contact plug 504a.
Furthermore, the conventional DRAM is formed with: a lower electrode 509, a capacitor insulating film 510, and an upper electrode 513 sequentially formed from bottom to top in the trench provided in the second interlayer film 506; a third interlayer film 515 formed on the upper electrode 513 and the second interlayer film 506; and a second contact plug 516 formed on the first contact plug 504b and penetrating the second interlayer film 506 and the third interlayer film 515. Through the first contact plug 504a, the impurity diffusion layer and the lower electrode 509 are electrically connected to each other.
As described above, the conventional DRAM shown in FIG. 4 has the structure in which a portion of the upper electrode 513 is formed above the second interlayer film 506 and the top surface of the upper electrode 513 and the side surface of the top end thereof are in contact with the third interlayer film 515.
Next, a conventional method for fabricating a DRAM with a stacked capacitor will be described with reference to the accompanying drawings. FIGS. 5A to 5I and 6A to 6C are sectional views showing the conventional method for fabricating a DRAM, respectively.
Referring to FIG. 5A, first, the DRAM cell transistor gate 502 is formed above the silicon substrate 501, and then the first interlayer film 503 is formed on the silicon substrate 501 and the DRAM cell transistor gate 502. Then, the first contact plugs 504a and 504b penetrating the first interlayer film 503 are formed on the impurity diffusion layers (not shown) formed in the silicon substrate 501, respectively.
Next, as shown in FIG. 5B, the silicon nitride film 505 is deposited on the first interlayer film 503 and the first contact plugs 504a and 504b. Thereafter, as shown in FIG. 5C, on the silicon nitride film 505, the second interlayer film 506 is formed by a chemical vapor deposition (CVD) method.
Subsequently, as shown in FIG. 5D, through the second interlayer film 506, a trench 507 reaching the top surface of the first contact plug 504a is formed by a lithography method and a dry etching. Thereafter, as shown in FIG. 5E, a first conductive film 508 is deposited on the inner surface of the trench 507 and the top surface of the second interlayer film 506. Then, as shown in FIG. 5F, by a lithography method and a dry etching, the first conductive film 508 deposited on the top surface of the second interlayer film 506 is removed so that it remains only on the inner surface of the trench 507, thereby forming the lower electrode 509 made of the first conductive film.
As shown in FIG. 5G, the capacitor insulating film 510 is deposited on the second interlayer film 506 and the lower electrode 509, and then a second conductive film 511 is deposited on the capacitor insulating film 510.
Next, as shown in FIG. 5H, on the second conductive film 511, a photoresist mask 512 is formed by a lithography method. Thereafter, as shown in FIG. 5I, portions of the capacitor insulating film 510 and the second conductive film 511 are removed by a dry etching using the photoresist mask 512 as a mask to form a capacitor having the lower electrode 509, the capacitor insulating film 510, and the upper electrode made of the second conductive film 511. In the manner described above, the portion of the upper electrode 513 is formed above the second interlayer film 506.
Subsequently, as shown in FIG. 6A, for example, a silicon oxide film 514 is deposited on the second interlayer film 506 and the upper electrode 513. In this deposition, the silicon oxide film 514 is made thicker than the upper electrode 513.
As shown in FIG. 6B, the silicon oxide film 514 is planarized by polishing through a chemical mechanical polishing (CMP) method, thereby forming the third interlayer film 515. Thereafter, as shown in FIG. 6C, the second contact plug 516 penetrating the second interlayer film 506 and the third interlayer film 515 is formed on the first contact plug 504b.
In the conventional DRAM fabrication method described above, in forming the third interlayer film 515, the insulating film having a greater thickness than the upper electrode 513 is deposited. Thereby, a step resulting from the height difference between the upper electrode 513 and the second interlayer film 506 is made gentle, and then planarization is performed by the CMP method or the like.

Semiconductor device and method for fabricating the same


A safety draw-latch which can be opened by normal adults but not by people with less coordination such as children or mental defectives. It differs from normal latches in that a complex set of actions must be carried out in one continous movement.

1. Field of the Invention
An improvement on the common draw latch which, while allowing normal adults to open or close it at will, inhibits its use by people not possesing the degree of coordination normal to adults, i.e. children or mental defectives.
2. Description of the Prior Art
A drawlatch is a device which enables any person to open or close the opening locked by it without the use of a key. If a person can reach it he can open it. In a number of cases, e.g. medicine cabinets or kitchen cupboards, there is however a need for a latch which will not allow access to certain people. The alternative to a latch is a lock, which requires a key. The key itself tends to be mislaid and sometimes to get into the wrong hands. The act of locking and unlocking the lock and inserting and removing the key is often inconvenient.


A system and method for troubleshooting the installation, operation and troubleshooting software on a remote security system computer is disclosed. The system by the installation of special software components on a remote and host computer allows a centrally located host computer to emulate the operation of a remotely located security computer that is operating special security system software, which software on the remote computer in turn controls the function of other remotely located security units running companion software and hardware.

Security systems for controlling accesses to a restricted area are very common today. Apartment complexes, gated communities, individual residences, office complexes and research facilities often have these systems. At a minimum they consist of security gate at an entrance into the complex that requires someone arriving at the gate or barrier to either enter an access code into a gate controller system to open the gate or to call on a communication device located at the gate an individual in one of the units in the complex and have the individual authorize entry, typically by pressing the appropriate button of the key pad on the units communication device, usually the telephone.
Over the year these systems have become quite sophisticated and now quite often consist of systems controlled by computers. In larger systems this can include a primary computer located at a central control office that connects through local telephone lines or a separate private communication system to the gate controller units at several gated access entry locations around the restricted area. The local unit at each gated entry has its own computer controlled system. The local system at each gate will typically have saved in computer memory various access codes that occupants of the secure area can enter by keypad, transponder or otherwise to open the gate and gain access. The local units at each gate will typically have a communication unit that includes a display and directory of occupants so an individual arriving at the gate can contact a party in the restricted area and thereby gain entry. These systems typically have diagnostic systems that allow the central control office to monitor operation of the local units and diagnose operational problems at the local unit. An example of such a commercially available system is the Elite Icon™, Elite Pro™ and similar systems, which is a product of the assignee of this application.
Given the sophistication of current security systems, customers that purchase these systems are much more dependent for support on the vendors of these products. Since all but the most rudimentary systems use computers in their operation a sign percent of the problems encountered with the installation, operation and maintenance of these systems involves the computers and software that runs on these computers. This in fact has been a problem for a significant number of years. Often telephone assistance by the vendors service department is not sufficient to resolve these problems for a variety of reasons. The computers used by various customers will vary significantly in features and functions resulting in problems in installation and operation. Additionally, given the sophistication of the systems there is a need for the software to work seamlessly with various hardware components and the electromechanical gate systems as well as various vehicle detection systems and communications systems the possibility of problems in installation and use are only compounded. Often simply providing telephone assistance to a customer is not enough and a technician from the vendor's service staff has to make a trip to the customer's site. Often the problems consist of a failure to property install or configure the software. Additionally, given the sophistication of the software systems, if it had been property used and or understood the problems could not have occurred or are easily diagnosed. These more sophisticated systems have been in existence for a good number of years and no one has found a suitable solution to resolving software installation problems.
Thus, what is need is a system and method that will allow a vendor of security systems to quickly and easily troubleshoot problems with installation and operational problems of security system software and hardware. A system and method that is easy to implement and operate without the need for the vendor's service personnel to make a trip to the customer's facility every time there is a significant problem in the installation and/or operation of the security system.

Method and apparatus for troubleshooting a security gate system remotely


A cDNA clone (HEV1) encoding hevein was isolated via polymerase chain reaction (PCR) using mixed oligonucleotides corresponding to two regions of hevein as primers and a Hevea brasiliensis latex cDNA library as a template. HEV1 is 1018 nucleotides long and includes an open reading frame of 204 amino acids. The deduced amino acid sequence contains a putative signal sequence of 17 amino acid residues followed by a 187 amino acid polypeptide. The amino-terminal region (43 amino acids) is identical to hevein and shows homology to several chitin-binding proteins and to the amino-termini of wound-induced genes in potato and poplar. The carboxyl-terminal portion of the polypeptide (144 amino acids) is 74-79% homologous to the carboxyl-terminal region of wound-inducible genes of potato. Wounding, as well as application of the plant hormones abscisic acid and ethylene, resulted in accumulation of hevein transcripts in leaves, stems and latex, but not in roots, as shown by using the cDNA as a probe. A fusion protein was produced in E. coli from the protein of the present invention and maltose binding protein produced by the E. coli.

(1) Field of the Invention
The present invention relates to a novel cDNA encoding a novel polypeptide including a hevein sequence of 43 amino acids. In particular the present invention relates to a novel cDNA encoding a polypeptide of 204 amino acids.
(2) Prior Art
Latex of the rubber tree (Hevea brasiliensis) is produced by highly specialized cells known as laticifers (de Fay, E., et al., in Physiology of Rubber Tree Latex, eds. d'Auzac, J., Jacob, J. L., and Chrestin, H. (CRC, Boca Raton, Fla.), pp. 3-14 (1989)). The contiguous end walls of adjacent laticifer cells are perforated, thus forming an anastomosing system. Upon wounding, the common cytoplasmic content of these cells is expelled in the form of latex. Sealing of wound sites occurs by coagulation of the outflowing latex. This process involves bursting of the lutoid bodies (organelles of vacuolar origin) and subsequent interaction of the released cationic proteins with the negatively charged rubber particles (d'Auzac, J, et al., in Physiology of Rubber Tree Latex, eds. d'Auzac, J., et al., (CRC, Boca Raton, Fla.), pp. 59-88 (1989)). Wound plugging may be important in preventing entry of pathogens in the phloem.
One of the major proteins in the lutoid bodies of rubber tree latex is hevein (Archer, B. L., et al., J. Rubber Res. Inst. Malaya 21, 560-569 (1969)). Hevein is a small, single chain protein of 43 amino acids unusually rich in cysteine and glycine (Walujono, K., et al., in Proc. Internat. Rubber Conf. 518-531 (1975)). Recently, hevein has been shown to bind chitin and to inhibit the growth of several chitin-containing fungi Van Parijs, J., et al., Planta 183:258-264 (1991). It has therefore been suggested that hevein plays a role in the protection of wound sites from fungal attack Van Parijs, J., et al., Planta 183:258-264 (1991).
Various classes of chitin-binding proteins have been reported to contain polypeptide domains homologous to the hevein sequence. The lectins from the monocotyledonous species wheat, barley and rice are composed of four repetitive hevein-like domains (Wright, C. S., et al. Biochemistry 23, 280-287 (1984); Raikhel & Wilkins, Proc. Natl. Acad. Sci. USA 84, 6745-6749 (1988); Lerner, D. R., et al., Plant Physiol. 91, 124-129 (1989); and Wilkins, T. A., et al., Plant Cell 1, 541-549 (1989)), whereas a related lectin from the dicotyledonous Urtica dioica is thought to be composed of two such domains arranged in tandem (Chapot, M. P., et al., FEBS Lett. 195, 231-234 (1986)). Basic chitinases from bean (Broglie, K. E., et al., Proc. Natl. Acad. Sci. USA 83, 6820-6824 (1986)), tobacco (Shinshi, H., et al., Proc. Natl. Acad. Sci. USA 84, 89-93 (1987)) and poplar (Parsons, T. J., et al. Proc. Natl. Acad. Sci. USA 86, 7895-7899 (1989)) have a single hevein-like domain located at the amino-terminus which is fused to an unrelated carboxyl portion. Likewise, two wound-induced genes from potato encode proteins with a hevein-like domain located at the amino-terminus and a carboxyl-terminal extension that differs from the chitinase carboxyl-terminus (Stanford, A., et al., Mol. Gen. Genet. 215, 200-208 (1989)).
Hevein was first isolated from the latex of the rubber tree (Hevea brasiliensis) (Archer, B. L., et al, J. Rubber Res. Inst. Malaya 21, 560-569 (1969)). In the latex, hevein is present in lutoid bodies, which are small, vacuole-derived organelles. Hevein is a major protein in these particles representing up to 70% of the total protein content (Archer et al., previously cited). It is not known at present whether hevein occurs in other parts of the plant. Hevein is a monomer and has an apparent molecular weight of 9.5 kDa as determined by gel filtration and SDS-PAGE Van Parijs, J., et al., Planta 183:258-264 (1991)). The amino acid sequence of hevein has a high degree of homology to WGA (Wright, C. S., et al., Biochemistry 23, 280-287 (1984)). The antifungal effects of hevein was examined on three different test organisms (Trichoderma hamatum, Phycomyces blakesleeanus, and Botrytis cinerea) by the hyphal growth inhibition assay. Dose-response experiments were carried out for each combination of hevein and fungus to determine the hevein concentration required for 50% inhibition of hyphal extension. Hevein caused 50% growth inhibition of T. hamatum, P. blakesleeanus, and B. cinerea at concentrations as low as 90, 300, and 250 ug/ml, respectively. Compared to tobacco chitinase (NTC), hevein is about one order of magnitude less active with T. hamatum and P. blakesleeanus, but more potent for inhibition of B. cinerea. Other fungi used in antifungal assays are Septoria nodorum, Pyricularia oryzae, Fusarium culmorum and Fusarium oxysporum which show a similar inhibition of hyphal growth as is shown for B. cinerea. Other chitin-binding lectins, WGA, Chelidonium majus agglutinin (CMA), Datura stramonium agglutinin (DSA) and Solanum tuberosum agglutinin (STA), did not affect fungal growth at concentrations below 2 mg/ml. To provide that the growth inhibiting effect of hevein was not due to contamination by chitinases or other compounds, this protein was subjected to several inhibitory treatments. The antifungal activity of hevein, and tobacco chitinase were reversed by addition of the specific ligand chitotriose (2 mM). However, hevein retained its antifungal properties when heated for 10 minutes at 90.degree. C., whereas chitinase activity was completely destroyed by the same treatment. Therefore, this small-sized chitin-binding protein, hevein has antifungal properties and represents a promising target gene for possible applications in genetic engineering experiments.
The hevein protein represents a promising target gene for genetic engineering experiments. First, this protein has been shown to be a potent inhibitor of fungal growth, and may thus contribute to the plant's own resistance to fungal infection. On a per gram basis, its antifungal potency is comparable to that of phytoalexins, which inhibit fungal growth in the concentration range of 50 to 100 ug/ml (Weinstein, L. I., et al., Plant Physiol., 68, 358-363 (1981)).

cDNA encoding a polypeptide including a hevein sequence

Board of Trustees operating Michigan State University


The present invention relates to a communication system and method in a ship area network. In a network of a structure including a plurality of shielded regions, communication is performed between terminals provided in the shielded region by using wireless communication, and communication is performed between terminals provided in different shielded regions by further using power line communication, optical communication, or the power line communication and the optical communication in addition to the wireless communication. Therefore, it is possible to obtain advantages of minimizing inconvenience, which is caused by using only wire communication in the related art, and enlarging a working area.

1. Field of the Invention
The present invention relates to a communication system and method in a ship area network, and more particularly, to a communication system and method between mobile terminals in a ship area network where electric waves are shielded.
This work was supported by the IT R&D program of MIC/IITA [2005-S-022-03, Embedded Software-based SmarTown Solution].
2. Description of the Related Art
The demand for a mobile communication terminal as personal portable communication means has increased in recent years, such that the mobile communication terminal becomes a necessity of life. Since it is not possible to satisfy the consumer's desire with a function of communication means for the transmission/reception of only voice, there has been released a mobile communication terminal having various and new functions and additional services.
However, wireless communication can not be performed between communication terminals by using a communication system in the related art in an environment such as a network in a ship area, which is generally surrounded by steel so that electric waves are shielded. Due to the above reason, only wire communication has been used. Therefore, there is a limitation on a working area where working is freely performed.

Communication system and method in ship area network

Electronics and Telecommunications Research Institute


An image capturing device includes a lens, a motor to move the lens, and a variety of modules. The variety of modules includes an interface control module, a module to control the lens movement, a determining module, and an analyzing module. The interface control module displays an input interface for inputting control data. The determining module determines an actual position of the lens according to the basic autofocus function. The analyzing module calculates an optimal autofocus position for the control data input, and determines a ratio between the actual position of the lens and the optimal autofocus position as a correction coefficient. When in use, after the correction coefficient has been set, the input control data is firstly modified according to the correction coefficient, and the lens is moved by the actuator to a modified autofocus position according to the corrected control data.

1. Technical Field
The present disclosure relates to image capturing devices, and particularly to an image capturing device and a method for correcting an autofocus function.
2. Description of Related Art
Autofocus technology is widely used in image capturing devices to capture high-quality images. Therefore, it is desirable to provide a method for how to determine a correction efficient for autofocus function, to allow the image capturing devices to reach or achieve more precise autofocus positions.

Image capturing device and method for determining correction coefficient of autofocus function


A device and method for forming an indented female connector where the dimension of the indented female connector provides for removing a male molding component without damaging a set of internal ribs formed inside the female connector. A structure comprising an indented female blow-molded connector having a first wall having a top surface and a thickness, with the first wall surrounding an opening. At least one inner wall extends substantially perpendicular to the first wall and borders the opening. At least one rib is formed in the inner wall. A bottom wall is joined to the inner wall and the distance from the rib to the top surface is greater than the thickness of the first wall. The structure further comprising a male connector having a contact edge that, when positioned inside the indented female blow-molded connector, engage the at least one rib, such that the male connector and indented female blow-molded connector are releaseably joinable with one another. Structures can be made that use the indented female blow molded connectors and male connectors including braced stools having three or four legs.

Blow molding of plastics to form hollow shapes such as bottles, containers and the like is well known to those having ordinary skill in the art. Some shapes, however, are difficult to mold into a hollow container with a blow molding process. An example of a shape that is difficult to mold is an indented female connector having a set of internal ribs for engaging with a male connector. Accordingly, there is a need for an improved device for molding an indented female connector as part of a hollow object. molded objects that can be assembled into sturdy durable structures, such as chairs, tables, stools, walls, and the like, without the need for extra components. There is a need for these structures to be sturdy, so that they can withstand-loads imposed on them without breaking or collapsing. There is also a need for the hollow molded objects to be formed such that they can be repeatedly manually joined and released from one another without the use of tools, wrenches, additional components, hammers, screw drivers, and/or power equipment.

Indented female blow-molded connector and male connector and method


There is disclosed a method of operating an informing radio node in a radio access network. The method comprises transmitting beam reception information, the beam reception information being based on measurements performed on beams of a set of beams. The beam reception information indicates one or more beams of the set of beams to belong to a first subset of the set of beams, the first subset comprising weakly received beams.

In modern wireless communication technology, beamforming is an increasingly important approach to provide efficient communication even in systems with a large number of devices communicating at the same time. For beamforming, a plurality of antenna elements (or radiators) in an antenna arrangement are used to provide a beam of radiation, e.g. in a desired angle or angular region, instead of (essentially) isotropically emitted radiation. With increasing number of antenna elements/radiators, beam forming becomes ever more useful, as the number of beams that can be provided or handled is related to the total number of available antennas/antenna elements, respectively to the total number of individually controllable antennas/antenna arrays. It should be noted that in many usage scenarios, the number of beams that can be provided simultaneously by one antenna arrangement, e.g. associated to a base station, will be lower than the number of nodes to be provided with beams.
With current approaches, the management of beams (beam management) in radio access networks may be inefficient, in particular in regard to interference between beams.

Measurement reporting in radio access networks for MU-MIMO operation

Abstract: The disclosure also pertains to related devices and methods.