Various proposed schemes pertaining to interleaving of combinations of multiple resource units (RUs) in wireless local area networks (WLANs) are described. In one example, data in a service data unit (SDU) is processed. The process data is then transmitted to a receiving entity over at least some of a plurality of resource units (RUs). The processing of the data involves either: (i) performing tone mapping by using one joint tone interleaver on one or more combinations of multiple RUs of the plurality of RUs within one frequency segment of a predefined bandwidth; or (ii) performing tone mapping by using multiple tone interleavers on the one or more combinations of multiple RUs of the plurality of RUs over multiple frequency segments of the predefined bandwidth.

Unless otherwise indicated herein, approaches described in this section are not prior art to the claims listed below and are not admitted as prior art by inclusion in this section.
For next-generation WLANs based on the upcoming Institute of Electrical and Electronics Engineers (IEEE) standards such as the IEEE 802.11 be, a resource unit (RU) is defined as a group of subcarriers that are allocated and available for transmission. The size of an RU can be 26, 52, 106, 242, 484, 996 and 2*996 subcarriers with subcarrier spacing of about 78.1 kHz. Correspondingly, the number of data tones NSD for each RU can be 24, 48, 102, 234, 468 and 980, respectively.
To improve spectral usage, IEEE 802.11be allows multiple RUs to be assigned to a single station (STA). Regarding transmissions over multiple RUs (or multi-RUs), data over multi-RUs for one STA can be transmitted at a physical (PHY) layer of a transmitting entity using one Physical Layer Convergence Procedure (PLCP) service data unit (PSDU) received from a medium access control (MAC) layer of the transmitting entity, and information bits for multi-RUs are encoded jointly. However, there is a need for different interleaving schemes for multi-RUs to achieve a good tradeoff between system complexity and performance.

Interleaving of combinations of multiple resource units in WLAN


An interactive television system is provided with an interactive information system by which channels or services interact together. The information system provides informational messages that prompt a user to select an associated channel or service. If selected, the system transfers control to the selected channels or services. If necessary, information associated with the informational messages is provided to the selected channel or service. In a preferred embodiment the informational messages are sequentially displayed video segments. The video segments may be associated with other channels or services in the interactive viewing system. The user may use an input device, by depressing a single button, and launch another channel or service that is associated with the currently displayed video segment.

As communication technology continues to expand, individuals are faced with an ever increasing number of information sources. For example, many cable television services offer dozens of different channels from which a user can choose. Some available satellite systems claim to offer hundreds of channels and it is widely expected that cable services will expand in an effort to match or exceed this capability. Similar gains in the quantity of available programs and services are anticipated in areas of communication other than television.
This dramatic increase in the amount of available programs and services greatly increases the amount and type of information accessible to a user. One common form of information accessible to users is advertising or product promotion. For example, home shopping networks are television channels dedicated to displaying and advertising various products. Consumers can typically purchase desired products by calling a telephone number displayed with the product.
Television users are also provided product information through "infomercials." A typical informercial provides information and promotional material about a specific product or product line for an extended period of time, typically for thirty minutes to an hour. Infomercials generally include interviews with satisfied customers and detailed examples of how to use the product. Again, a user can generally purchase desired products by calling or writing to a source identified in the informercial.
A problem with these services is that a user can only passively watch information and cannot interactively respond to the informational messages. For example, a customer who desires to purchase a product displayed cannot do so through the television, but has to use a different communication medium, such as a telephone or a mail service. This process is inconvenient and prone to error in that the user may incorrectly record or miss the opportunity to record the telephone number or address, resulting in a lost opportunity to purchase the product.

System and method for linking video, services and applications in an interactive television system


A plurality of N-type diffusion layers are formed a specified distance apart on a P-type semiconductor layer. A P-type leak prevention layer formed between at least N-type diffusion layers prevents leaking between the diffusion layers. A dielectric film is formed in at least a light incident area on a P-type semiconductor layer including the diffusion layers and the leak prevention layer. Accordingly, provided are a split type light receiving element positively functioning as a split type light receiving element even when charge is accumulated in the dielectric film and having a uniform sensitivity throughout the entire area on a light receiving surface, and a circuit-built-in light receiving element and an optical disk device using the split type light receiving element.

Conventionally, an optical pickup section used in an optical disk apparatus has an optical construction in which semiconductor laser light is concentrated on and applied to a disk by a lens, reflected light has its light intensity modulated according to the signal written on the disk and this reflected light is further made incident on a light-receiving device (or a circuit-integrated type light-receiving device in which the light-receiving device and a transistor for processing an electric signal taken out of this light-receiving device are integrated on an identical substrate). This light-receiving device (or the circuit-integrated type light-receiving device) employed in this optical pickup section also detects a focus signal and a servo signal according to the shapes of a plurality of light rays applied to and reflected on the disk besides the detection of the data signal written on the disk. Then, control is executed so that light is accurately applied to the disk, in which the data signal is written, on the basis of the detected focus signal and servo signal.
Then, the optical pickup section employs a segmented type light-receiving device constructed of a plurality of pn junctions that can receive a plurality of light rays (refer to Japanese Laid-open Publication No. H9-213920). A dielectric film is formed on the light-receiving device surface, on which light is incident, of the segmented type light-receiving device in order to control the reflectance on the device surface. When a single-layer oxide film is employed as this dielectric film construction, a condition of λ/4n (n represents the refractive index of the oxide film, and λ represents the wavelength of light) of an optimum film thickness is satisfied, and the oxide film thickness is 70 nm with respect to, for example, light of a wavelength of 400 nm. Moreover, a multilayer structure, which has a low reflectance with respect to the wavelength to be used, is also employed as the aforementioned dielectric film construction.
As shown in FIG. 20, in the case where, for example, two light-receiving sections are formed by providing n-type semiconductor layers 901 and 902 on a p-type semiconductor layer 900 (there is shown none of the electrode leads, the interlayer films and so on of the n-type semiconductor layer and the p-type semiconductor layer), electric charges are accumulated in a dielectric film 903. Therefore, an N-type inversion layer 904 is formed by the inversion of the conductive type in the surface of the p-type semiconductor layer 900, and the two light-receiving sections are disadvantageously connected together by this n-type inversion layer 904. Consequently, there is a problem that signals cannot be individually taken out of the two light-receiving sections and the device does not function as a segmented type light-receiving device. The problem of the segmented type light-receiving device easily occurs particularly when the concentration of the p-type semiconductor layer on which the n-type semiconductor layer is provided is reduced to improve the frequency characteristic determined by a CR time constant by reducing the capacitance of the pn junction of the segmented type light-receiving device.

Split type light receiving element and circuit-built-in light-receiving element and optical disk drive


A process for producing a ceramic honeycomb structural body, comprises the steps of placing a green ceramic honeycomb structural body on a ceramic plate, and then firing the green ceramic honeycomb structural body. The green ceramic honeycomb structural body is placed on the ceramic plate in the state that a cell-opened end face contacts the ceramic plate. The ceramic plate is composed mainly of heat-resistive inorganic fibers, and has a bulk density of not less than 1.00 g/cm.sup.3.

(1) Field of the Invention
The present invention relates to a process for producing ceramic honeycomb structural bodies. More particularly, the invention relates to the ceramic honeycomb structural body-producing process including an improved firing step.
(2) Related Art Statement
Heretofore, it has been common practice to fire extruded green ceramic honeycomb structural bodies by passing the honeycomb structural bodies through a tunnel kiln, wherein the honeycomb bodies are placed on a shelf plate of a truck, while cell-opened end surfaces contact the shelf plate. In order to improve this firing process, examined Japanese patent publication No. 1-54,636 discloses a process for firing green ceramic honeycomb structural bodies 21 in the state that a setter 23 is placed between the honeycomb structural body 21 and a shelf plate 22 as shown in FIG. 4. This setter is a ceramic plate having a honeycomb structure with an upper edge being chamfered. Japanese patent application Laid-open No. 2-199,067 discloses a process for firing green ceramic honeycomb structural bodies in the state that an alumina base solid plate is placed between the honeycomb structural body and the shelf plate.
However, the process using the setters as disclosed in examined Japanese patent publication No. 1-54,636 has the following problems:
(i) With increase in the number of times of passing the setter through the tunnel kiln, the setter is largely deformed (warped) by heat, or the surface of the setter becomes coarse due to fusing-out of the silica contained in the setter. As a result, the lower end face of the honeycomb structural body is deformed, or ribs are deformed or cracked.
(ii) The service life of the setter is short, i.e., the number of times of passing the setter through the tunnel kiln is as small as 35 to 40 due to the above problems.
(iii) Difference in dimension between upper and lower portions of the product is great due to difference in temperature between them.
On the other hand, the process using the alumina base plate as disclosed in the above unexamined Japanese patent application Laid-open No. 2-199,067 has the following problems:
(i) With increase in the number of times of passing the alumina base plate through the tunnel kiln, the base plate is warped or deformed due to the thermal deformation of the shelf plate, when the alumina base plate is thin. As a result, the lower end face of the honeycomb structural body is deformed or cracked.
(ii) When the alumina base plate is thick, the weight per unit area is increased which increases heat capacity.
(iii) The lower end face of the honeycomb structural body changes color by reacting with the alumina base plate. It is believed that the lower end face of the honeycomb structural body changes color since the composition of cordierite constituting the honeycomb structural body at the lower end face slightly changes due to the reaction between the alumina base plate and the cordierite during firing.

Process for producing ceramic honeycomb structural bodies


There is described a low-cost imaging device fixed focus type which is to be provided in a portable terminal equipment and enables easy assembly. An opening section is formed in a substrate. An imaging element is secured on the substrate such that a plane including a light-receiving surface for receiving an optical signal closes the opening section. An optical element having an imaging lens section for providing optical information is attached to the light-receiving surface. The optical element is arranged so as to come into contact with the upper surface of the imaging element by way of the opening section of the substrate.

1. Field of the Invention
The present invention relates to an imaging device, and more particularly, to a compact imaging device suitable for being mounted on a portable terminal equipment having image pickup capability.
2. Description of the Background Art
FIG. 70 is a cross-sectional view showing the structure of a related-art imaging device described in Japanese Patent Application Laid-Open No. Hei6-85222. In the drawing, reference numeral 2 designates an imaging element; 22 designates a lead frame; and 10 designates a peripheral element. The imaging element 2 is three-dimensionally provided on top of an island 31, and the peripheral element 10 is three-dimensionally provided on the lower surface of the island 31.
As shown in FIG. 70, reference numeral 11 designates wires for wire bonding purpose which electrically connect the imaging element 2 and the peripheral element 10 to the lead frame 22; and 23 designates a premolded material. The premolded material 23 has an opening which goes through the imaging element 2 so as to ensure an optical path. Reference numeral 32 designates a light-shielding liquid crystal plate which is to be fastened on the premolded material 23 by means of an adhesive in the manner as illustrated.
The related-art imaging device has an unillustrated separate lens. By way of the separate lens and the light-shielding liquid-crystal plate 32, optical information is focused in the form of an image on the solid-state imaging element 2. The thus-imaged optical information is converted into an electrical signal by means of the solid-state imaging element 2, and the resultant signal is output. The peripheral element 10 delivers appropriate performance in accordance with the type of an imaging device. Here, the function of the peripheral element 10 is not the feature of the related-art imaging device, and hence explanations of operation of the peripheral element 10 are omitted.
As mentioned above, the related-art imaging device shown in FIG. 70 involves the peripheral element 10 and the imaging element 2 in a single package. For this reason, there is required a smaller area for mounting the imaging device than that required when the peripheral element 10 and the imaging element 2 are packaged separately. Hence, the related-art imaging device promotes miniaturization of a portable terminal equipment, such as a video camera.
FIG. 71 is a cross-sectional view showing a related-art imaging device described in Japanese Patent Application Laid-Open No. Hei10-32323. As shown in FIG. 71, reference numeral 33 designates a lead electrode; 2 designates an imaging element; 3 designates an optical element whose lens mount section is integrally formed with an imaging lens 3a; and 10 designates a peripheral element bonded to the underside of the imaging element 2 by means of an adhesive. A metallized electrode film 34 is formed on the underside of a lens mount section of the optical element 3. The electrode of the imaging element 2 is electrically connected to and integrated with the lead electrode 33 by way of the metallized electrode film 34. The peripheral element 10 is electrically connected to the lead electrode 33 by means of a wire 11 for wire bonding purpose.
In the related-art imaging device shown in FIG. 71, the peripheral element 10 is bonded directly to the underside of the imaging element 2 by way of an adhesive. The imaging device shown in FIG. 71 obviates the island section required by the related-art imaging device shown in FIG. 70 (i.e., the device described in Japanese Patent Application Laid-Open No. Hei6-85222). Therefore, the construction shown in FIG. 71 renders the imaging device more compact than in the case where the construction shown in FIG. 70 is employed.
FIG. 72 is a perspective view of a related-art imaging device described in Japanese Patent Application Laid-Open No. Hei9-283569. In the drawing, reference numeral 2 designates an imaging element; and 2a designates a figure of a light-receiving surface of the imaging element 2 which can be shown on the reverse side of the imaging element 2. Reference numeral 8 designates an anisotropic conductive film. The center of the film 8 is cut out to form an opening for the light-receiving surface 2a of the imaging element 2. Reference numeral 35 designates a translucent circuit board. Terminal sections 35a are arranged on the surface of the circuit board 35. The imaging element 2 is electrically connected to the terminal sections 35a by means of flip chip bonding by way of the anisotropic conductive film 8 and is integrated with the circuit board 35 in a face down manner.
A lens section is omitted in the imaging device shown in FIG. 72. In this imaging device, optical information is focused on the imaging element 2 by way of the translucent circuit board 35 and the center section (i.e., an opening formed by means of cutout) of the anisotropic conductive film 8. The related-art imaging device shown in FIG. 72 is made compact, by means of connecting the imaging element 2 to the circuit board 35 by use of the flip chip bonding technique.
In the descriptions of the related-art technique, the devices described in the Laid-Open Patent Applications are simplified. Further, in order to match the descriptions of the related-art devices with the descriptions of preferred embodiments of the present invention, the reference numerals and names assigned to individual sections of the related-art devices are employed also in the description of the preferred embodiments of the present invention.
In the related-art imaging device shown in FIG. 70 or 72, the imaging lens section is separate from the unit containing the imaging element 2. In order to implement the function of the imaging device, lens components must be assembled separately. In this case, in order to enable correct imaging of optical information, a lens is provided with a mechanism for adjusting a focal point, and a focal length must be controlled at the time of assembly of the lens. Such a focus control mechanism affects the outer dimensions of an imaging device, thereby hindering miniaturization of the imaging device.
In the imaging device shown in FIG. 71, an imaging lens is constituted by means of assembling an imaging lens section and a lens mount section into a single molded component, thereby obviating a necessity of assembling lens components separately. However, the imaging device requires an advanced technique, such as a technique for forming a metallized electrode on the underside of the lens mount section, thereby involving high machining costs and imposing difficulty in reducing the price of the lens mount section. Further, lens components are assembled around the periphery of the imaging element 2, with the result that the imaging element 2 is susceptible to chipping.

Imaging device having an imaging element mounted on a substrate


In a Pb-free copper-based sintered alloy containing from 1 to 30% of Bi and from 0.1 to 10% of hard matter particles having from 10 to 50 μm of average particle diameter, the Bi phase has a smaller average particle diameter than that of the hard matter particles and is dispersed in the Cu matrix, or the hard matter particles having 50% or less of a contact length ratio with the Bi phase based on the total circumferential length of the hard particle, which are in contact with said Bi phase, are present in a ratio of 70% or more based on the entire number of the hard matter particles.

Pb, which is ordinarily added to the copper-alloy for sliding use, expands and is elongated on the sliding surface upon temperature rise during the sliding. As a result, because Pb cools the sliding surface and simultaneously realizes its excellent self-lubricating properties, seizure is, consequently, prevented. In addition, since Pb forms a soft dispersing phase, Pb has conformability and such property that foreign matters are embedded in Pb.
However, Pb is liable to be corroded by acids other than sulfuric acid. When Pb is present in the form of coarse particles in the Cu alloy, the load ability of a bearing is lowered. Therefore, Patent Document 1 (Japanese Examined Patent Publication (kokoku) Hei 8-19945) proposes to disperse Pb in the form of fine particles expressed by a particular calculation equation. The equation can be interpreted to mean the following. The total Pb particles in the visual field of 0.1 mm2 (105 μm2) are observed. The average area ratio of these particles is converted to one particle, which is 0.1% or less. According to an example of this publication, a Cu—Pb—Sn pre-alloy powder is used. In addition, it is described that a finer Pb structure is obtained at lower sintering temperature. It is, therefore, understood that the technique employed in this publication is to suppress the precipitation and growth of Pb by low-temperature sintering.
It is known from Patent Document 2 (Japanese Examined Patent Publication (kokoku) No. Hei 7-9046 that, in order to enhance the wear resistance of the sintered copper alloy, such carbides as Cr2C3, Mo2C, WC, VC and NbC are added in the sintered copper alloy as hard matters. According to this publication, the copper-alloy powder having from 10 to 100 μm of average particle-diameter and the hard-matter powder having 5 to 150 μm of the average particle-diameter are mixed by a V type blender, followed by compacting and sintering. The description that Pb is present in the grain boundaries of the copper particles (column 4, lines 21 through 22) is not inconsistent with knowledge derived from an equilibrium phase diagram, that is, Pb is hardly not dissolved in the solid Cu.
A Pb-free alloy, which attains the sliding properties equivalent to the Cu—Pb based sintered alloy, is known from Patent Document 3 (Japanese Unexamined Patent Publication (kokai) No. Hei 10-330868. It is apparent from the drawings of this publication that the location of the Bi (alloy) phase is the grain-boundary triple points and the grain boundaries in the vicinity to the triple points.
It is proposed in Patent Document 4 (Japanese Patent No. 3421724) that the hard matters incorporated into the Pb or Bi phase prevent Pb and Bi from flowing out of the sintered copper alloy; the Pb or Bi phase behaves as a cushion of the hard matters, the attacking property of which against the opposite shaft is mitigated; the separated hard matters are again captured by the Pb or Bi phase, thereby mitigating abrasive wear. In this patent, the presence of the hard matters is such that they are enveloped in the Bi phase. The dimension of the Bi phase is, therefore, larger than that of the hard matters.
It is disclosed in Patent Document 5 (Japanese Unexamined Patent Publication (kokai) No. 2001-220630) that an intermetallic compound is added to enhance the wear resistance of the Cu—Bi(Pb) based sintered alloy; its micro-structure is such that the intermetallic compound is present around the Bi or Pb phase. During sliding, the intermetallic compound is convex and the Bi or Pb phase as well as the Cu matrix are concave on the surface of copper alloy to form oil reserving portions. As a result, seizure resistance and fatigue resistance of the sliding material are improved. An example of the sintering condition proposed is from 800 to 920° C. for approximately 15 minutes.
Patent Document 1: Japanese Examined Patent Publication (kokoku) No. Hei 8-19945
Patent Document 2: Japanese Examined Patent Publication (kokoku) No. Hei 7-9046
Patent Document 3: Japanese Unexamined Patent Publication (kokai) No. Hei 10-330868
Patent Document 4: Japanese Patent No. 3421724
Patent Document 5: Japanese Unexamined Patent Publication (kokai) No. 2001-220630
Patent Document 6: Japanese Unexamined Patent Publication (kokai) No. 2002-12902


Disclosed herein are a data processing system implemented method, a data processing system and an article of manufacture for managing a plurality of data processing system executable tasks each having a script associated therewith. The data processing system includes a task selector for selecting, from the plurality of computer executable tasks, a selection of tasks, a script selector for selecting scripts, the selected scripts associated with the selected selection of tasks, and a script editor for editing the selected scripts, the edited selected scripts being executable by the data processing system.

Computing platforms execute software implemented applications that are often referred to as tasks. A computing platform can execute a number of tasks in succession including some executing concurrently. A user of such a computing platform will want to execute one or more tasks, view the progress of each task, prioritize executing tasks, determine if tasks have succeeded or failed, and repeat these same tasks several times with the same or different input parameters.
It is known to provide a task management application with a user interface that allows a human operator (user) to view the identifying information, current or completion status, and other useful information with respect to executing task and recently completed tasks. An example of such a task management application is provided by the Microsoft® Windows® Task Manager. The Windows® Task Manager allows a user to view a list of executing tasks (applications) and to terminate execution of a designated task. Once a task has terminated, no information regarding the task is available in the Windows® Task Manager.
Typically the information presented in the user interface of a task management application is read-only. That is, the user can not interact with the information presented in the interface for the purpose of manipulating it or perform actions on it. The information provided is commonly sufficient to identify a task but does not include details of parameters (inputs) provided to the task on execution. Therefore, the information is not always sufficient to permit the user to re-execute a displayed task.
What is required is a task management application with a user interface that permits a user to manipulate information presented in the interface and to re-execute tasks based on the parameters previously provided to the task.

Method, system and program for managing executable tasks

International Business Machines Corporation


A hearing aid having a microphone for conversion of sound into an input audiosignal, a signal processor for processing the input audiosignal, a receiver for conversion of the processed signal into sound, an audio amplifier for supplying current to the receiver in response to the processed signal, a battery for current supply of the signal processor, the audio amplifier, and the receiver, and a current limiter connected in series between the battery and the audio amplifier for analogue limitation of the current supplied by the battery to the audio amplifier in response to the battery output voltage.

Today's modern hearing aids typically include electronic circuits driving an audio amplifier, which in turn drives a receiver to generate sound into the ear of the user. The electronic circuits and the amplifier are both powered from a battery. Typically, the electronics inside the hearing aid is a combination of digital and analogue circuitry. Such a hearing aid is illustrated in FIG. 1.
With reference to FIG. 1, when the audio amplifier 20 drives the receiver 16 to produce sound, large currents 22 may flow from the battery 24. Because of the impedance 25 of the battery 24, the large currents 22 result in voltage fluctuations on the battery supply line 28 as shown in FIG. 2.
The battery voltage fluctuations appear also on the supply terminals to the hearing aid electronics. Unfortunately the hearing aid electronics will always have a threshold 38 below which the circuitry is not guaranteed to work. This is also shown in FIG. 2. Below the indicated threshold 38 for example analogue circuit cannot be guaranteed to operate as intended, and digital processors/state machines etc. may malfunction or crash at time 40 in FIG. 2.
Because of the limited internal volume for accommodation of electronic components in a hearing aid, typically, there is not sufficient space available for a decoupling capacitor large enough to supply the audio amplifier during output transients.
In WO 2004/034073, a method of current management in a battery powered device is disclosed. The method comprises the steps of comparing the actual supply voltage with a reference, generating a control signal when the supply voltage is below the reference, use the control signal to reduce the load current by disconnection of the load whereby the supply voltage increases, and repeat the previous steps as long as the supply voltage is below the reference voltage. The current limitation is a sampled current limitation. Although the sampling frequency is well above the audible range, frequency convolution may lead to audible deterioration of the output sound due to the time discrete nature of the current limitation.
Thus, there is a need for a hearing aid wherein voltage drops caused by sound amplification is avoided with less deterioration of the sound quality.


Compositions containing polyacrylate rubbers having dual curing sites are cured using an improved curing system comprising an alkali metal of a long chain carboxylic acid, a tertiary amine having a two methyl groups and a longer chain alkyl group, and a disubstituted urea. The compositions are shelf stable, have a high degree of scorch safety and cure rapidly at curing temperatures without adversely affecting the compression set of the cured article.

Polyacrylate rubbers having dual cure sites, when cured, exhibit good weatherability, high temperature serviceability and resistance to oil. Such rubbers are particularly suitable for use as gaskets, seals, packings, belts and hoses, particularly under-the-hood in automobiles, and for out-of-door uses such as weather stripping.
Various curing systems for compositions containing polyacrylate rubbers having dual cure sites are taught by Morris, U.S. Pat. Nos. 3,910,866, 3,912,672 and 3,919,143. However, articles fabricated from such compositions may not be completely cured and may change their properties during normal use. It is apparent that fabricated articles, depending on their intended uses, are required to meet certain specifications, and changes in properties which take the articles out-of-specification would be unacceptable. Such changes can generally be avoided by adding a post-curing step when the articles are being fabricated. However, the post-curing step can be very time consuming.
Wolf, U.S. Pat. Nos. 5,008,345 and 5,081,194, teaches a no-post-cure method for curing compositions containing polyacrylate polymers having dual cure sites, particularly halogen and carboxyl cure sites, using a metallic acid salt and an ammonium or phosphonium quaternary salt as the curing system. The compositions are shelf stable prior to curing and give products having good compression set when cured.
Scorch is the cross-linking which occurs during processing of a curable system prior to curing and is a problem encountered with reactive curing systems. A retarder can be added to the curable system to retard scorch, and De Marco, U.S. Pat. No. 5,079,304 teaches using a substituted urea as the retarding agent with the acid salt and quaternary salt curing system of Wolf. However, those curable compositions generally have insufficient scorch safety for use in high speed injection molding.
Curable compositions exhibiting improved resistance to scorch, but where compression set of the cured compositions is not adversely affected are required for high speed injection molding. The present invention provides such curable compositions.


A shaving system with two main components: an electric shaver and a remote device which has a display unit for presenting specific data to the user. The remote device may further comprise a mirror. The mirror and the display unit may be combined to form a single unit. The display unit may be incorporated in the mirror, which for this purpose may be implemented as a partly transparent mirror with the display unit mounted on the backside of the mirror. Additionally, the remote device may perform the function of charging stand for a rechargeable battery of the shaver. In that case the remote device has a docking bay for receiving the shaver. The shaver's battery is charged via electrical contacts between the remote device and the electric shaver, or by means of coils in the remote device and the shaver. The display unit displays status information of the shaver and provides feedback to the user during shaving. The remote device may further be implemented with knobs, buttons or slide controls to adjust shaving parameters in the shaver. Also environmental sensors may be incorporated in the remote device to inform the electric shaver of information relevant to shaving comfort. The data exchange between the remote device and the electric shaver is performed through wireless communication, which for some functions is a two-way communication.

The present invention relates to an electric shaving system. An electric shaver is known in which the remaining battery capacity is displayed on the electric shaver body by means of a liquid crystal display mounted on the shaver body. In this known electric shaving system the user cannot verify the present state of the electric shaver in use, for example, the information such as a pressure with which the electric shaver blade presses the user's skin. This is because even if the information such as the pressure is displayed on the electric shaver body itself, like the remaining battery capacity, it is difficult for the user to see the electric shaver body during the time when the user is using the electric shaver.
Another electric shaving system consisting of an electric shaver body and a charging box or stand is known. Such a system makes it possible to reduce the number of parts in the shaver body. Such a system further allows the electric shaver body to be washed with water. The charging box or stand carries out charging of the shaver battery with the electric shaver fitted therein. Since the electric shaver used for the known electric shaving system is electrically connected to the charging box, it has a plurality of exposed terminals such as a charging terminal and a control terminal. This presents a problem in that when the electric shaver is washed with water, the plural exposed terminals are corroded electrically. Also, the charging box from the known shaving system has a problem in that if a metallic object such as a pin accidentally enters the charging box, erroneous charging is carried out.


The present invention provides a packaged cementitious product including a bag formed of a polymeric material. The bag has first and second sealed ends. The first end has a first tab extending therefrom defining at least one aperture therethrough so that the first tab defines a first handle. The second end has a second tab extending therefrom defining at least one aperture therethrough so that the second tab defines a second handle. A cementitious product is sealed within the bag, and wherein the first and second handles facilitate the handling of the packaged cementitious product.

1. Field of the Invention
The present invention relates generally to packaging and, more particularly, to packaging and methods for packaging for particulate and granular materials.
2. Description of Related Art
Particulate and granular materials are commonly packaged in bags, sacks or other packaging materials (collectively referred to herein as "bags") constructed of paper. As used herein, the term "particulate materials" refers to powdery materials that generate dust when disturbed, such as during packaging. For purposes of example only and not limitation, particulate materials can include cementitious materials, such as cement and concrete mixes, limestone, fly ash, bottom ash, powdered sugar, etc. As used herein, the term "granular materials" refers to materials that are composed of granules or grains, or have a grainy texture, and which may or may not generate dust when disturbed. For purposes of example only and not limitation, granular materials can include sand, pea gravel, sugar, salt, etc.
The conventional paper bags used to package particulate and granular materials are generally closed at one end either when the bag is made or prior to filling by folding the sides of the bag inwardly in an overlapping configuration and then securing the sides together using an adhesive. The bags are filled with the particulate or granular material through the open end of the bag, which is then closed by folding the sides of the bag inwardly in an overlapping configuration and then securing the sides together using an adhesive.
Conventional paper bags are structured to allow air to escape from the interior of the bags so that the bags can be compressed when the bags are stacked, such as on a pallet. However, conventional paper bags have several disadvantages. For example, in addition to allowing air to escape, conventional paper bags also can allow fine particles from the particulate or granular material inside the bag to escape, which can result in appreciable amounts of dust, particularly when storing the bags in an enclosed space such as a warehouse or inside a store. Conventional paper bags also are susceptible to rupturing or tearing if not handled properly, which can result in product spillage and waste. Conventional paper bags also allow moisture to permeate the bag, which will typically have an adverse effect on the particulate or granular material inside the bag. For example, where the bag is used to package cementitious material, moisture can lead to curing of the cementitious material inside the bag thereby rendering the product useless. This can be particularly problematic when storing or handling the bags outside where the bags can be exposed to rain, condensation or other wet ambient conditions. Conventional paper bags also can be difficult to load and unload manually when the bags are filled with particulate or granular material. For example, bags used to package cementitious material are typically offered in 29 lb, 44 lb, 50 lb, 60 lb and 80 lb bags, which are heavy and can be difficulty to carry.
Accordingly, there remains a need for packaging for particulate and granular material generally and cementitious materials in particular. The packaging should be capable of being filled and sealed using an automated filling machine and should allow the particulate or granular material to be stored so as to minimize leakage, spillage and exposure to moisture. The packaging should also be stackable when filled with particulate or granular material, such as on a pallet, and should also facilitate manual loading and unloading of the filled packaging.

Packaging for particulate and granular materials


A method of local temperature measurement in a sample is provided. The method comprises the stimulation, at a location in the sample, of anti-Stokes and Stokes emission from fluorophores which are present at the location in the sample, measuring the intensities of the stimulated radiation and calculating the temperature at the location from the measured intensities. The method can be used to obtain a thermal image of the sample.

Thermal mapping gives information about thermal loading within a body. Examples are heat distribution inside a microchip, and the location of energetically active structures of a living organism, such as a cell. Heretofore, thermal mapping or imaging has been realized for macro-objects using thermo-vision cameras, i.e., devices which convert thermal emission into visible radiation. However, the thermal emission wavelength utilized by these cameras is around 7-13 μm, and thus the technology cannot be applied to the study of micro-objects, which have sizes that are close to the wavelength of thermal emission. For such applications, other technology is required.
Current imaging methods, including thermal imaging, are limited by their ability to resolve dynamic processes which occur on time scales faster than approximately 0.1 seconds. Laser scanning microscopy is extensively used in bio-imaging due to the high resolution provided by this technique. In many applications, imaging is done with, for example, two different laser excitations to calculate the ratio of two chromophore populations in living cells. Typically this is achieved by switching the laser beam after each frame of data acquisition using raster scanning of the laser beam. However, in the case of fast dynamical processes under investigation, such a strategy is often insufficient, as by the time the second laser begins to acquire an image (typically 100s of milliseconds) the dynamical picture has changed, giving erroneous signals.

The Research Foundation of State University of New York


A non-aqueous electrolyte secondary cell includes a positive electrode containing lithium-contained complex oxide, a negative electrode containing a material which can absorb and desorb lithium or lithium ion, and a separator which is filled with an organic electrolyte. The separator is composed of a plurality of laminated blend polymer fine porous films each containing polyethylene and polypropylene, and at least one of the laminated blend polymer fine porous films has a different ratio of polyethylene and polypropylene from the other blend polymer fine porous films. In this construction, a blend polymer fine porous film having a higher ratio of polypropylene increases the piercing strength of the separator, and at the same time a blend polymer fine porous film having a higher ratio of polyethylene increases the shut-down characteristic.

(1) Field of the Invention
The present invention relates to a non-aqueous electrolyte secondary cell which is composed of a positive electrode containing a lithium-contained complex oxide, a negative electrode containing material that can absorb and desorb lithium or lithium ion, and a separator filled with an organic electrolyte.
(2) Description of the Related Art
In spite of the advantage of high-density energy, this type of cells have the following disadvantages: When the cells are externally short-circuited, large short-circuit current runs inside the cells. As a result, Joulean heat is caused, and the cell temperature rises to an extreme level. This might cause the organic electrolyte to react with the electrodes, especially the positive electrode, and to burn. In order to secure the safety of the cells against such an extreme temperature increase, the current supply is shut down by making the separators composed of polyolefin fine porous films melt down, thereby closing their fine pores. However, the films are as thin as 25 to 35 .mu.m, so that they tend to be damaged by the unevenness of the electrodes, thereby causing the cells to be slightly short-circuited. This leads to the self discharge.
In order to prevent the separator from being damaged by the unevenness of the electrodes, it has been suggested to use polypropylene (hereinafter PP) or polyethylene (hereinafter PE) that has high molecular weight for the separator, thereby enhancing the piercing strength of the separator. However, the separator containing PP or PE that has high molecular weight does not melt down until the cell temperature reaches a high level because the melting point of the separator is also high. This might cause the cell temperature to rise extraordinarily, or the shut-down characteristic of the separator to be deteriorated.
It has also been suggested to use a blend polymer fine porous film which contains both PP and PE for the separator, in order to enhance the piercing strength. However, the mere use of the blend polymer fine porous film containing PP and PE does not achieve an increase in the piercing strength and an increase in the shut-down characteristic at the same time. The reason for this is as follows: When the ratio of PE to PP is low, the fine pores of the film are not completely closed when PE reaches its melting point, whereas when the ratio of PE to PP is high, the piercing strength is low due to the influence of PE.


An electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.

An electronic device, such as a smartphone, a tablet PC, or the like, may perform various functions, for example, wireless data communication, media output, or the like. Electrical elements (e.g., a CPU, a GPU, a communication IC, a display driver IC, and the like) required for performing various functions may be included in the electronic device. The electrical elements may be mounted on a printed circuit board to operate. The electrical elements may generate heat while operating. As data processing speed of the electrical elements increases, required power also increases and a large amount of heat may be generated correspondingly.
The electrical elements, surrounding parts, and the electronic device may break down if the heat generated by the electrical elements is not effectively dispersed or cooled. A processor (e.g., a CPU or an AP) included in the electronic device may generate a larger amount of heat than other parts, and the temperature of the processor may instantaneously rise. A failure to effectively disperse the heat generated by the processor may cause a breakdown in the processor itself or integrated chips (ICs) around the processor.
An electronic device in the related art may diffuse heat throughout the electronic device, or may cool the heat, by using a cooling module, such as a fan, a heat sink, or the like, which is disposed around an electrical element such as a CPU, a GPU, or the like. In this case, the cooling module disposed around the CPU, the GPU, or the like is large in size and designed with a heavy metal material and has a structure (e.g., a spring screw) located next to the CPU, the GPU, or the like so as not to be separated due to drop or impact.
Among cooling modules, a fan has problems in that the fan is thick due to a motor inside and it is difficult to mount the fan in a slim electronic device that lacks a mounting space.
In accordance with an aspect of the present disclosure, an electronic device according to various embodiments of the present disclosure includes a housing, a printed circuit board located inside the housing, an electrical element mounted on the printed circuit board, and a shield can that covers the electrical element. A recess area is formed on at least a portion of the shield can, and a metal structure is mounted in the recess area to cool heat generated by the electrical element.
An electronic device according to various embodiments of the present disclosure may have a thin cooling module mounted therein, which is obtained by bonding different types of metal plates, and thus slimness of the electronic device may be realized.
The electronic device according to various embodiments of the present disclosure may have a water-cooled tube or a metal plate mounted in a shield can to effectively cool heat radiating from various electrical elements, such as a CPU, a GPU, a memory, and the like.
The electronic device according to various embodiments of the present disclosure may disperse the heat radiating from the electrical elements into surroundings through a thermal sheet or an air layer and may reduce inconvenience that a user feels due to a rise in surface temperature of the electronic device.

Electronic device including cooling structure


A CCD sensor includes a readout register formed in substrate, the readout register including a channel, a bus structure and a connection structure. The bus structure includes plural spaced element sets, each element set including a first clock conductor. The first clock conductor of a first element set is a dual function conductor. The connection structure isolates the dual function conductor while coupling together the first clock conductor of each other set of the element sets. Alternatively, the sensor includes vertical and readout registers formed in a well in a substrate. The vertical register includes a vertical channel, a vertical bus structure and a vertical connection structure, and the readout register includes a readout channel, a readout bus structure and a readout connection structure. The readout bus structure includes plural spaced readout element sets, each readout element set including a first readout clock conductor. The first readout clock conductor of a first readout element set is a dual function readout clock conductor. The readout connection structure isolates the dual function readout clock conductor while coupling together the first readout clock conductor of each other set of the readout element sets. The vertical bus structure includes plural spaced vertical element sets, each vertical element set including a first vertical clock conductor. The first vertical clock conductor of a first vertical element set is a dual function vertical clock conductor. The vertical connection structure isolates the dual function vertical clock conductor while coupling together the first vertical clock conductor of each other set of the vertical element sets.

1. Field of the Invention
The present invention relates to selectable resolution in a CCD imaging sensor. In particular, the invention relates to use of a dual function clock conductor in the clocking structure to mechanize a two dimensional selectable resolution feature in area and TDI sensors and a one dimensional selectable resolution feature in the readout register of the sensor and in one dimensional linear sensors.
2. Description of Related Art
Charge coupled devices (hereinafter CCDs) are widely used in video imaging and recording applications. For example, the architecture of a CCD video sensor may follow the form dictated by the National Television Standards Committee (NTSC) for video broadcast standards. Such CCD video sensor designs need at least 488 TV lines vertically, 500 to 800 pixels per TV line, have an optical format of 4/3 aspect ratio, and generate field interlaced video at a frame rate of 30 Hz. CCD architectures which achieved the goals of the video format imaging requirements generally fall into two categories: Interline Transfer (ILT) or Frame Transfer (FT) image sensors.
An alternative application of a CCD sensor is industrial inspection or vision equipment. The architecture of a CCD video sensor for this application may be optimized for maximum pixel resolution, or to maximize image frame rate, or both. Often inspection cameras used to inspect moving objects (e.g., on a continuous conveyor belt or rolled goods such as rolls of cloth) employ a line scan CCD sensor where a linear CCD sensor is oriented in a direction perpendicular to the direction of movement of the object being imaged. Advanced linear CCD sensors often employ a time delay and integrate technology and are referred to as TDI CCD sensors.
In FIG. 7, known frame transfer sensor 10 includes imaging section 2 coupled to storage section 4. Frame transfer sensors rely on the quick transfer of image field data from an array of photo-sensitive photo-sites in imaging section 2 where photo-charge is integrated (i.e., the imaging section) to an optically opaque analog storage array (i.e., storage section 4), and the subsequent parallel to serial transfer of the video data through horizontal CCD readout shift register 6 (HCCD shift register) through output node structure 7, through buffer 8 to a camera circuit. An optically opaque storage array is a storage array that is covered by an optically opaque material such as an aluminum film so that the storage array is not photo-sensitive. The rapid vertical transfer of the image data from integration of the first video field is vital since the optical input onto the imaging section of the CCD sensor is continuous (not strobed or modulated during transfer).
In FIG. 8, known interline transfer CCD image sensor 20 (i.e., an ILT CCD sensor) includes imaging section 12 in a plurality of columns of photo-sites, each column disposed adjacent to an optically opaque interline transfer register 14 (e.g., covered with aluminum to render the transfer register insensitive to optical input). An ILT CCD sensor generally has no optically opaque storage section as does the frame transfer sensor. In an ILT CCD sensor, optical input is integrated in photo-sites 12 and then transferred to interline transfer registers 14. Then, during the integration of the next field of data, the field of image data in interline transfer registers 14 are parallel to serial transferred through horizontal CCD shift register 16 (HCCD shift register) through output node structure 17, through buffer 18 to a camera circuit.
In FIG. 9, known time delay and integrate (TDI) linear array sensor 30 includes imaging section 22 as in a frame transfer sensor, but the imaging section is generally coupled directly to horizontal CCD readout shift register 26, and from there through output node structure 27, through buffer 28 to a camera circuit. Imaging section 22 includes a plurality of columns, each column including a plurality of photo-sites. In operation, a camera lens focuses the image on the TDI CCD sensor. The image, that is the optical input to the TDI CCD sensor, is moving (e.g., on a conveyor belt). An image conjugate focused on the sensor appears to be moving. A portion of the image first appears on one pixel of the TDI CCD sensor, and then appears on another pixel of the sensor. The camera and sensor are arranged so that a portion of the moving image moves in a direction from the top of a column of photo-sites to the bottom of the column. The TDI CCD sensor is clocked to transfer charge down the columns of photo-sites at a rate equal to the rate that the portion of the image moves down the column. Charge generated at a first photo-site is transferred to the next photo-site at the same time that the image portion that generated the charge at the first photo-site moves to the next photo-site. In this way photo-charge is accumulated at the photo-site under the image portion as the image portion moves down the column. Thus the name, time delay and integrate (TDI).
Two-dimensional imaging arrays (e.g., in frame transfer sensors and in interline transfer sensors) generally take a snap shot of an image. The whole photo-active array of pixels integrates photo-charge for a period of time. At the end of the integration time, the information is transferred from the sensor to an external circuit element using a parallel to serial transfer scheme. Each horizontal line of pixel data is transferred into a horizontal CCD readout shift register. The line of data is then transferred serially through an output node structure at the end of the register and then through a buffer amplifier.
Similarly, in a TDI CCD sensor, the last pixel in each integrating column of photo-sites (i.e., the last horizontal line) is transferred into a horizontal CCD readout shift register. The line of data is then transferred serially through an output node structure at the end of the register and then through a buffer amplifier.
In TDI CCD sensors, it is sometimes desirable to adjust the responsivity of the sensor to the brightness of the light illuminating the scene being imaged. In applications of two dimensional imaging arrays (e.g., in frame transfer sensors and in interline transfer sensors), it is sometimes desirable to provide a reduced format sensor (i.e., only the lower half or quarter of the image area is output). In applications of two-imensional imaging arrays (e.g., in frame transfer sensors and in interline transfer sensors) or in a TDI sensor, it is sometimes desirable to provide a selectable resolution in the horizontal direction (i.e., only the right or left half or quarter of the image area is output). In one dimensional line scan applications, it is sometimes desirable to provide a one dimensional selectable resolution in the horizontal direction (i.e., only the right or left half or quarter of the line array is output).


A semiconductor quantum dot device using a semiconductor quantum dot comprises a semiconductor quantum dot formed on a semiconductor wafer, a field effect transistor formed on said semiconductor wafer and comprising a gate electrode formed in a vicinity of said semiconductor quantum dot, and a coupling means to couple said gate electrode and said semiconductor quantum dot capacitively.

a) Field of the Invention
The present invention relates to a micro dimension electronic device, and more particularly to a micro dimension electronic device using semiconductor quantum dot. Here, the term "micro" means "very small" and usually expresses a dimension less than the order of micron.
b) Description of the Related Art
In recent years, associated with a progress of techniques on fine processing, micro dimension electronic devices including portions of such dimensions as generating quantum effects are starting to be manufactured.
Elements having such structures that confine carriers of charge in a one-dimensional direction as quantum well, in two-dimensional directions as quantum wire, in three-dimensional directions as quantum dot, or the like, have been manufactured. For such elements, not a small number of new phenomena which have been impossible to be attained in conventional devices are being found. Researches to work out new devices or systems using such phenomena are being focused.
Such a quantum effect device, having a micro dimension, generates an output signal which is also very small. Consequently, a serious problem arise how to take out signal from the inside of the device to an external circuit.
Electron devices using quantum dot can be considered to have a function of carrying out a logical operation or of storing a memory by utilizing an in/out behavior of a single electron to the quantum dot. Even when such function can be performed, it is, however, difficult to practically utilize the phenomenon unless detection of the state, for example, detecting a change in the number of electrons within a quantum dot, is made possible.
A method that detects a change of electric potential in a quantum dot by electrically connecting a gate electrode of an insulated gate type field effect transistor to the quantum dot could be considered. In connecting the gate electrode of a field effect transistor of the actual size to the quantum dot, however,parasitic capacitance of the quantum dot becomes so large, that a change in electric potential when a single electron moves into and out of the quantum dot becomes so small to be detected under thermal noise even at a considerable low temperature.
When a plurality of electrodes are disposed in the vicinity of a quantum well layer and depletion layers are developed into the quantum well by application of reverse bias voltage to the electrodes, a plurality of quantum dots can be formed within a quantum well layer. By connecting an electrode associated with a quantum dot with another electrode associated with another quantum dot, the voltage of a quantum dot can be transferred to another quantum dot. In this case, when there is a current flow in the other quantum dot, a change in voltage can be converted to a change in current.
However, considering this kind of signal transfer as the change in voltage, only a change in voltage of at most the order of mV is converted to a change in voltage at most of the order of mV. Thus, no solution is given to the problem of how to take out an output signal to the external circuit.
Thus, in an electronic device using quantum dot, it has been difficult to take out a state of quantum dot to an external circuit as an electric signal. It has been particularly difficult to detect the change in number of electron within a quantum dot.


A vehicle heat exchange system includes a coolant circulation circuit, a refrigerant circulation circuit, a pump controller, and a detector. In the coolant circulation circuit, a coolant is circulated. In the refrigerant circulation circuit, a refrigerant is circulated. The pump controller controls a flow rate of the coolant. The detector detects a liquid temperature of the coolant before cooling an electric unit. The coolant circulation circuit includes a radiator that dissipates heat of the coolant having cooled the electric unit. The refrigerant circulation circuit includes an exterior heat exchanger in rear of the radiator. The exterior heat exchanger causes the refrigerant to absorb heat from external air. When the detected liquid temperature is equal to or higher than a predetermined temperature, the pump controller maintains or increases the flow rate. When the detected liquid temperature is lower than the predetermined temperature, the pump controller decreases the flow rate.

The disclosure relates to a vehicle heat exchange system, and more particularly, to a vehicle heat exchange system mounted on a vehicle using electricity as power.
In recent years, as electric vehicles (EV vehicles) and hybrid vehicles (HV vehicles) have been put into practical use, the capacity of a battery mounted on these vehicles has increased, and an output voltage of the battery has also increased. Electric power supplied from the battery is used not only for allowing a vehicle to travel but also for an air conditioner.
In the electric vehicles and hybrid vehicle, heat is generated during charging or discharging of a battery. A temperature of the battery may become high. In that case, the battery is to be cooled in order to secure the performance of the battery. Therefore, there has been proposed a battery cooling device that detects a temperature of a battery, causes a battery cooler to circulate a refrigerant when the temperature of the battery exceeds a preset upper limit temperature, and causes the battery cooler to stop the circulation of the refrigerant when the temperature of the battery falls below a preset lower limit temperature.
The above-described battery cooling device is configured such that the refrigerant does not flow to an air conditioner side while the refrigerant is flowing to the battery cooler, which may lower the cooling performance of an air conditioner during cooling of the battery. Therefore, a battery cooling device has been proposed in which a branching passage is provided in a refrigerant passage and an amount of the refrigerant flowing to the branching path and the refrigerant passage is adjusted (see Japanese Unexamined Patent Application Publication No. 2012-248393).
Here, the air conditioner for a vehicle provided with the battery cooling device as described above employs a vehicle air conditioner using a heat pump system. Such a vehicle air conditioner circulates a refrigerant in a circulation circuit including a compressor, an interior condenser (that is, an interior heat exchanger), and an exterior heat exchanger, so as to achieve a low temperature and a high temperature with a small amount of energy.
For example, in a heating operation of the vehicle air conditioner, the refrigerant is expanded by an expansion valve, and the refrigerant having a decreased temperature is sent to the exterior heat exchanger. In the exterior heat exchanger, the refrigerant absorbs heat from external air, and the refrigerant is suctioned into the compressor. The compressor compresses the refrigerant, and the refrigerant having a high temperature and a high pressure is discharged from the compressor and is sent to an interior condenser. Conditioned air is heated while passing through the interior condenser, and is supplied into a vehicle cabin for heating. The refrigerant which has dissipated heat in the interior condenser is expanded again by the expansion valve. Accordingly, the refrigerant of the vehicle air conditioner is to absorb heat from the external air in the exterior heat exchanger.


A phosphor screen for image forming including phosphor material being excitable by light in a wavelength λ1. The phosphor screen receives an optical image from an image forming optical system and produces the optical image at a second wavelength λ2. The phosphor screen includes a phosphor layer comprising the phosphor material. A short-pass reflective coating is positioned on a first side of the phosphor layer. The short-pass reflective coating transmits the wavelength λ1 and reflects the wavelength λ2. A long-pass reflective coating is positioned on a second side of the phosphor layer. The long-pass reflective coating transmits the wavelength λ2 and reflects the wavelength λ1. A first substrate is positioned over the short-pass reflective coating. The first substrate is formed of optically clear and thermal conductive material. A second substrate is positioned over the long-pass reflective coating. The second substrate is formed of long-pass absorptive optical filter material that transmits the wavelength λ2 and absorbs wavelength λ1 from ambient light to prevent the phosphor layer from being excited by the ambient light. The phosphor screen may alternatively be used for a direct-view visual display apparatus. These principles can also be utilized for backlighting and general illumination applications.

1. Field of the Invention
The present invention is related to a photo-luminescent device for producing visible light upon excitation, or for producing visual images if the excitation light is modulated. More particularly, the present invention relates to the packaging of a photo-luminescent device to improve the effective use of the photo-luminescent material. The present invention also relates generally to visual display systems, and more particularly to visual display systems utilizing photo-luminescent materials in the image screen or in the illumination source of the display.
2. Description of the Related Art
Phosphors, as a type of luminescent material, have been used in the devices such as cathode-ray-tubes, x-ray screens, photo-luminescent displays, and lighting or illumination products such as florescent lamps and phosphor-converted white light-emitting diodes (LEDs). Phosphors can absorb the energy from the excitation source and convert it to visible light or other wavelengths. Photo-luminescent phosphors are the type of phosphors that can convert the radiant energy of the light from the excitation source to a different wavelength. For visual displays, the emission of the phosphors is in the visible range to human eyes, namely, in the 400 nm-750 nm region. The excitation source for these phosphors has a wavelength typically in a band with higher energy, i.e. from UV (180 nm-360 nm) to blue light (360 nm-480 nm) region.
Phosphors, upon absorbing the excitation energy, will generate heat because of the conversion loss. The emitted light from the phosphor radiate isotropically into the space, half forward and half backward about the phosphor plane. Phosphors that can be excited by blue light can also be excited not only by the blue light from the excitation source, but also the blue light in typical natural day light. The self-heating of phosphor, if not managed properly, can heat up the phosphor material, resulting in reduction in emission efficiency, and in extreme cases, thermal quenching of the light emission. Intense heating can also result in physical and chemical degradation of phosphor material, reducing the lifetime of the phosphor and performance of the device. The light emitted from the phosphor but backward toward the excitation source will not be usable if not re-directed toward the forward direction, resulting in loss of half of the light. It is critical in phosphor packaging design to utilize both backward and forward emission from the phosphor for maximal optical efficiency.
Conventional phosphor screens, such as the faceplate of a cathode ray tube (CRT) or the phosphor plate used for x-ray imaging, comprise a thin layer of highly reflective aluminum coating on the phosphor. This aluminum coating allows the electron beam or x-ray to penetrate through to excite the phosphor, but reflects the backward emission from the phosphor toward the forward direction, improving the effective optical efficiency of the phosphor. In addition, the aluminum coating helps dissipate the heat generated in the phosphor layer, because of the high thermal conductivity of aluminum.
For UV excited phosphors, such as phosphors used in the fluorescent lamps, the normal ambient light will not be able to provide excitation sufficient to produce significant phosphor emission. However, blue-excited phosphors, can be excited not only from the light from the excitation source, but also by the typical visible light in ambient. For lighting applications, this does not seem to be a problem. For display applications, the phosphor should be excited only by the controlled light from the excitation source. In image forming screen applications, the phosphor screens using blue excitation light but without consideration of controlling natural ambient light has a low contrast ratio because of the phosphor emission caused by the ambient light. This is not acceptable for high fidelity display systems.


The invention is concerned with novel piperidine-amide derivatives of formula (I)

The present invention relates to novel piperidine-amide, their manufacture, pharmaceutical compositions containing them and their use as medicaments. The active compounds of the present invention are inhibitors of liver carnitine palmitoyl transferase 1 (L-CPT1) activity.
High levels of free fatty acids (FFA) lead to an increase of liver mitochondrial β-oxidation, which is crucial to drive efficient gluconeogenesis. The mitochondrial oxidation of long-chain FFA requires the intervention of two membrane-bound carnitine-dependent palmitoyltransferases (CPTs). CPT1, the outer mitochondrial membrane enzyme, catalyzes the formation of long-chain acylcarnitines. Liver (L-CPT1) and muscle (M-CPT1) CPT1 isoforms are encoded by two different genes and inhibited by malonyl-CoA. The N-terminal domain of L-CPT1 confers its lower sensitivity to malonyl CoA. CPT2, the inner mitochondrial membrane enzyme, reconverts long-chain acylcarnitines into long-chain acyl CoA esters. Long-chain acyl-CoAs are then β-oxidized to acetyl-CoA, which activates pyruvate carboxylase and gluconeogenesis. According to the mechanism of action described above, pharmaceutically active substances which inhibit L-CPT1 reduce liver β-oxidation, consequently inhibiting gluconeogenesis and therefore counteract hyperglycemia.

Abstract: wherein R1, R2, X and Y are as defined in the description and in the claims, as well as physiologically acceptable salts and esters thereof. These compounds inhibit L-CPT1 and may be used to treat diseases associated with L-CPT1.


A graded-index optical member includes a core section which has a maximum portion of a refractive index at a substantial center of a cross-section, and has a refractive index distribution that a refractive index decreases according to distance from the maximum portion. A clad section which contacts at least partially with a periphery of the core section. Refractive index is substantially uniform, by making a concentration distribution of siloxane structure, where concentration increases according to distance from the maximum portion of the refractive index of the core section, formed in a sheet-like polysilane.

A multi-mode optical waveguide can reduce a mode variance by having a refractive index distribution of decreasing in a core centrosymmetrically. The physical structure of the refractive index distribution depends on materials and production processes like the following conventional example.
A conventional graded-index optical waveguide is equipped with a predetermined mask for an optical medium, and gives a distribution to a refractive index of the optical waveguide by diffusing a diffusion source in the optical medium through an aperture of the mask (refer to, for example, Japanese Patent Laid-Open No. 57-198410 (page 2, FIG. 3); hereafter, this is called document 1).
In addition, there are also some which each radiate light to an optical medium, including monomer whose refractive index becomes small by photopolymerization, with being equipped with a mask with a predetermined transmittance, and give a distribution to a refractive index of an optical waveguide (refer to, for example, Japanese Patent Laid-Open No. 60-64310 (pages 2 to 3, FIG. 1): hereafter, this is called document 2).
Furthermore, there are also some which each are a method of utilizing the same photopolymerization reaction as that in document 2, and irradiate ultraviolet rays from two different directions to produce a waveguide lens which has a concentric refractive index distribution (refer to, for example, Japanese Patent Laid-Open No. 60-175010 (FIG. 7): hereafter, this is called document 3).
Moreover, there are also some which each are a method of utilizing the same photopolymerization reaction as that in document 2, and produce a graded-index waveguide by changing irradiation amount (refer to, for example, Japanese Patent Laid-Open No. 1-134310 (FIG. 1): hereafter, this is called document 4).
In addition, there are also some which each are equipped with a mask, which has a predetermined aperture portion, for optical plastics including metal salt of an organic carboxylic acid, and give a distribution to a refractive index of an optical waveguide by performing dipping in a solvent such as ethanol or acetone to diffuse the organic carboxylic acid outside (refer to, for example, Japanese Patent Laid-Open No. 60-188906 (pages 3 to 5, FIGS. 2 to 4): hereafter, this is called document 5).
On the other hand, surface mounting can be mentioned as the technology of low-cost and mass production of optical modules used for optical communication or optical networks.
This is the technology of producing external forms of a semiconductor laser and a lens, which are required for an optical module, with high precision beforehand, and performing passive alignment by arranging them in submicron accuracy on a silicon substrate in which a V-groove and the like are formed, or arranging alignment marks for positioning with high precision on optical components, fetching the alignment marks with a CCD camera or the like, and arranging them with applying image processing technology. In the case of passive alignment, since each optical component is arranged without monitoring light amount inputted into an optical fiber, the process tolerance and arrangement accuracy of these optical components affect the light amount finally inputted into the optical fiber. Therefore, it is necessary to process each optical component precisely and to align it with high precision.
In addition, in the case of a multimode optical fiber (hereafter, this is abbreviated as an MMF) such as a plastic fiber, there is no photodiode which has a light-receiving area corresponding to its large-diameter core, and there are also no peripheral parts such as a small and low-loss coupler which controls full modes. On the other hand, in the case of a single mode optical fiber (hereafter, this is abbreviated as an SMF), mode control is easy and a core diameter is also small, and hence, it is possible to obtain small and low-price peripheral parts.
By the way, among conventional optical modules, there are some which each use a thin film waveguide which has a grating coupler and a waveguide lens, and couple light, inputted into the thin film waveguide through the waveguide lens with the grating coupler, with an external optical component (refer to, for example, Japanese Patent Laid-Open No. 62-280827 (FIG. 1); hereafter, this is called document 6).
In addition, there are some which each are constituted of a V-groove group which is formed in parallel on a Si substrate, an optical fiber group positioned by the V-groove group, a light source group arranged in the same pitches, and a Fresnel lens group positioned by the V-groove group (refer to, for example, Japanese Patent Application Laid-Open No. 2004-109498 (FIG. 1); hereafter, this is called document 7).
Furthermore, there are those which each make highly precise optical axis adjustment unnecessary in the assembly of an optical module by using a graded index lens (GRIN lens) (refer to, for example, Japanese Patent Laid-Open No. 11-271575; hereafter, this is called document 8).
FIG. 29 shows a side view of a conventional optical module 610 shown in document 8.
The optical module 610 is constituted of an optical fiber 614 which is sandwiched between and held by quartz blocks 613 which are arranged through a spacer 612 on a substrate 611 and are vertically dividable, and serves as an optical waveguide, a laser diode 616 which is equipped with a terminal 616a which is fixed to a holder 615, provided on the substrate 611, and into which an electric signal is inputted, a GRIN lens 617 which is arranged between the quartz block 613 and laser diode 616, and is coupled to the optical fiber 614.
When an electric signal is inputted into the terminal 616a of the laser diode from the external, the laser diode 616 emits light or quenches light according to the status change of this electric signal, for example, ON/OFF of the signal. An optical signal which this laser diode 616 emits is converged by the GRIN lens 617 to be introduced into the optical fiber 614, and finally, is outputted into the external of the optical module 610.
Nevertheless, since it is necessary to inject diffusion material into an optical medium from the aperture of the mask, the conventional method in document 1 has a first subject that process becomes complicated by the supply of the diffusion material, the corruption by the diffusion material, and the like.
In addition, since it is necessary to perform the wet processing of performing the dipping of an optical plastic including the metal salt of an organic carboxylic acid at a solvent such as ethanol or acetone, the conventional method in document 5 has a first subject that process becomes complicated also in this case.
Furthermore, although the conventional methods in documents 2 to 4 each can produce a graded-index waveguide by the installation of the mask which adjusts a light amount, and the simple process of optical irradiation since polymerizing monomer in an optical medium by light changes a refractive index, it has a second subject that its heatproof temperature is 80° C. or less, and it has no heat resistance beyond 100° C., since an acrylic resin such as PMMA is used for the material made by a photopolymerization reaction. Hence, although it is satisfactory in an indoor environment, it cannot be used for outdoor use or a car for which the heat resistance of 100° C. or more is required.
In addition, since a grating coupler is required in order to couple with a thin film waveguide, the conventional method in document 6 has a third subject that complicated process is required and expensive and it cannot be achieved in low cost.
Furthermore, since a Fresnel lens corresponding to the diameter level of an optical fiber currently used is expensive, the conventional method in document 7 also has a third subject that it is unrealizable in low cost.
Moreover, although being low cost since a bulk type GRIN lens (aperture of 1 mm or more) is used, the conventional method in document 8 has a fourth subject that the miniaturization of an optical module cannot be performed.
In addition, in this specification, an optical fiber diameter level is defined as the size of being tenfold or less of optical fiber diameter.
Furthermore, although it is possible to produce a small waveguide type graded index lens, any one of the conventional methods shown in documents 2 to 4 has a fifth subject that a step of producing a waveguide type graded index lens becomes a step different from a step of producing an optical module using the produced waveguide type graded index lens. Since an expense which is required in manufacturing process influences cost since the waveguide type graded index lens is very small and the resin material cost occupying a manufacturing expense is extremely small, a production expense of the optical module becomes high cost when the step of producing the waveguide type graded index lens and the step of producing the optical module are different steps in this manner.
FIG. 28 is a structural diagram of a production apparatus 511 of a conventional optical waveguide described in document 3.
A mask 514 is installed on a surface (top face) of a high polymer film 513. Two change sections 514c which make ultraviolet rays 515 permeate are formed in parallel in a predetermined interval on this mask 514. The change portions 514c each have a distribution of transmittance of the ultraviolet rays 515 changing in a transverse direction, and are constituted so that the transmittance of the ultraviolet rays 515 may become zero at both ends and the largest in the center. Then, a pair of mirrors 516 and a prism 517 are provided above the mask 514, the prism 517 being provided in the center.
The parallel ultraviolet rays 515 are irradiated from a light source, and the ultraviolet rays 515 are divided into the right and the left by the prism 517, and are reflected by each of the pair of mirrors 516 to be irradiated on the mask 514 from two directions. The ultraviolet rays 515 penetrate only the change portions 514c of the mask 514 to proceed into the film 513, and the ultraviolet rays 515 permeating both the change portions 514c intersect in the film 513 to produce a circular exposed portion. This exposed portion becomes an optical waveguide 512.
Thus, the optical waveguide 512 is produced by irradiating ultraviolet rays on the film 513, polymerizing monomer in the film 513, and making a refractive index distribution formed.
Then, since it is necessary further to perform the separated process of producing an optical module using this optical waveguide 512 in order to complete an optical module, it becomes in high cost.
A first object of the present invention is to provide a manufacturing method of a graded-index optical member which produces the graded-index optical member in a simple process by forming a core section by changing a refractive index by an oxidation reaction caused by UV irradiation and heating using sheet-like polysilane.
In addition, a second object of the present invention is to provide a graded-index optical member which has the heat resistance of 100° C. or more by forming a core section by changing a refractive index by an oxidation reaction caused by UV irradiation and heating using sheet-like polysilane.
In addition, a third object of the present invention is to provide an optical module which is possible to make an optical module in low cost which uses the graded-index optical member of the present invention which is produced in the simple process of forming a core section by changing a refractive index by an oxidation reaction caused by UV irradiation and heating using a sheet-like base material whose main component is polysilane.
In addition, a fourth object of the present invention is to provide an optical module which is possible to make a small optical module which uses the small graded-index optical member of the present invention which is produced in the process of forming a core section by changing a refractive index by an oxidation reaction caused by UV irradiation and heating using a sheet-like base material whose main component is polysilane.
In addition, a fifth object of the present invention is to provide optical modules and the manufacturing methods of an optical module of the present invention each of which produces a waveguide type graded index lens and is able to fix an optical component at the same time.

Refractive index distribution type optical member, and production method for refractive index distribution type optical member


When recording original data having a size greater than the height of a recording head, high-quality recording can be performed without unnatural connecting portions by performing smoothing processing for the original data. The original data is divided so as to have a size smaller than the height of the recording head, in such a manner that parts of divided data overlap with each other.

1. Field of the Invention
This invention relates to a recording apparatus and method having a smoothing function of virtually improving resolution, improving jagged portions, and improving the quality of recording.
2. Description of the Related Art
A conventional recording apparatus having the smoothing function includes a printing buffer, used when performing smoothing processing, for storing more data than data covering the width (height) of a recording head. When recording a character exceeding the width (height) of a print head, such as an enlarged character or the like, smoothing processing is performed in consideration of the connecting portions, each extending over a plurality of recording paths or scans. For that purpose, a printing buffer for storing more data than data covering the width (height) of a recording head is required, and a large memory capacity is required.
In a method in which such an extra memory capacity is not required, a printing buffer is provided for each band width (height) covering the width (height) of a recording head, and smoothing processing is performed for each band width (height).
In this method, however, since data of a lower portion cannot be taken into consideration for a portion extending over bands (paths), connecting portions look unnatural in an enlarged character, such as a double-height character or the like, so that the quality of the character is, in some cases, partially degraded as a result of smoothing processing.

Recording apparatus and method with smoothing function