A color adjustment apparatus includes a color space conversion circuit for obtaining a chromaticity signal in a rectangular coordinate system of a plane representing hue and saturation components. A pointed color chromaticity signal setting circuit sets a pointed color chromaticity signal, which is the prominent color chromaticity signal desired to be changed. A color adjustment area setting circuit sets a color adjustment area of which the center is the pointed color chromaticity signal. A target color chromaticity signal setting circuit sets a target color chromaticity signal. A color conversion circuit generates a converted chromaticity signal (u.sub.h *, v.sub.h *). The converted chromaticity signal is obtained by shifting an original chromaticity signal (u*, v*) by an amount equal to a change from said pointed color chromaticity signal to said target color chromaticity signal. A weighting coefficient setting circuit sets a weighting coefficient (.omega.). And a color adjustment operating circuit generates a corrected chromaticity signal (u.sub.0 *, v.sub.0 *) which is a sum of the converted chromaticity signal and the original chromaticity signal added at the rate of the weighting coefficient (.omega.).

1. Field of the invention
The present invention relates to a selective color adjustment apparatus for use in color printers, color photocopiers, color televisions, and other color image processing devices and, more particularly, to a selective color adjustment apparatus which can change the color of a selected part of an image while maintaining the color of other parts unchanged and retaining color continuity between the changed part and unchanged part.
2. Prior art
As color imaging devices have been improved to provide higher image quality and some intelligent control capabilities in recent years, an improved color adjustment capability has become necessary to meet the more sophisticated needs of the end user. The color adjustment function of a typical conventional device is described below with reference to FIGS. 18-20.
FIG. 18 is a block diagram showing the basic construction of a conventional color adjustment device comprising a color space conversion circuit 100, polar coordinate conversion circuit 101, a selective color adjustment circuit 102, and a color space reconversion circuit 103. The color space conversion circuit 100 takes an RGB trichromatic expression of the input color and converts it through the XYZ color system to a uniform color space L*a*b* expression of the color. The polar coordinate conversion circuit 101 then converts the uniform color space L*a*b* expression to the L*a*b* coordinate system's internal polar coordinate system (H.sup.o Cab, L*, C*ab). After selective color adjustment is applied by the selective color adjustment circuit 102 as described below, the color space reconversion circuit 103 reverses the color expression conversion process, converting the (H*ab, L*, C*ab) expression to the uniform color space L*a*b*, and through the XYZ system to obtain the RGB line output.
Operation of the selective color adjustment circuit 102 is described with reference to FIG. 19, a graph of the method of specifying the color adjustment area, and FIG. 20, a graph of the color adjustment specification method.
Colors are adjusted on the a*b* polar coordinate plane, i.e., the chromaticity plane, using only the hue angle H.degree.ab and saturation C*ab values. The hue is specified using the range angle HA(.degree. ) and the median hue angle HC(.degree. ), saturation is specified using the band width CA* and the median saturation value CC*, and the target area for color adjustment is specified from the combination of these two areas as indicated by the shaded area in FIG. 19. The direction and amount of color change are specified using two color adjustment parameters in the H*ab, C*ab coordinate system, hue rotation of the amount DH(.degree. ) plus or minus the median hue angle, and saturation is increased or decreased Kc times.
This adjustment made using just two parameters results in a loss of continuity in the hue and saturation of the input and output colors because certain colors are suddenly changed to different colors in the color space. In addition, the median values and range of the color distribution used to specify the target color area may vary and cannot be precisely specified because of the wide differences between input images.
Membership functions allowing a certain degree of latitude are therefore applied to specify the target color area. By thus weighting the color adjustment using the membership function value, continuity in the color space can also be maintained. The selective color adjustment can be quantified as shown by equation (2) when the two-dimensional membership function in the a*b* plane is obtained by equation (1). ##EQU1## where (H*ab, C*ab) are the color coordinates before color adjustment, (H*ab', C*ab') are the color coordinates after color adjustment, DH is the angle of rotation of hue H*ab, and Kc is the multiple of saturation C*ab. The color adjustment is thus determined uniquely by the membership function WH(H*ab), WC(C*ab), and DH, Kc.
The color adjustment device described above operates as follows.
The RGB trichromatic expression of the input color is converted through the XYZ color system to the CIE 1976 uniform color space L*a*b* expression by the color space conversion circuit 100. The uniform color space L*a*b* expression is then converted to the internal polar coordinate system (H.degree.ab, C*ab) of the L*a*b* coordinate system by the polar coordinate conversion circuit 101 as defined by equation (3). ##EQU2##
The selective color adjustment circuit 102 then adjusts the color using the two-dimensional membership function described above. The color coordinates (H.degree.ab, C*ab) and L* resulting from the adjustment are then reconverted to a standard L*a*b* expression, to an XYZ system expression, and finally to an RGB trichromatic expression to obtain a selectively adjusted color signal (see Journal of the Electronic Imaging Association, Vol. 18, No. 5, pp. 302-312).
The following problems are presented by this color adjustment method.
First, selective color adjustment requires a polar coordinate conversion to convert the RGB trichromatic signal to the uniform color space L*a*b* system and to the L*a*b* internal polar coordinate system (H.degree.ab, L*, C*ab), and rectangular coordinate conversion to convert from the (H.degree. ab, L*, C*ab) system to the L*a*b* system after color adjustment, and these operations are difficult to perform in real-time because they are non-linear operations.
Furthermore, while look-up tables can be used to increase the processing speed of these non-linear operations, it is difficult to generate these conversion tables and a large number of conversion tables is needed, increasing the required circuit (device) size. In addition, if the precision of these non-linear operations is increased, the required circuit size is increased even further because of the large number of bits required.
Analog processing of this color adjustment process is also extremely difficult because of the polar coordinate conversion and other non-linear conversions required, and this method is not suited to real-time color adjustment processing of a video signal.
In addition, if the operating precision is to be increased, a large number of bits is required at the uniform color space L*a*b* stage before conversion to the polar coordinate system because of the matrix operations performed in the polar coordinate system as shown in equation (2).
Finally, while this color adjustment method can change the hue and saturation of the source signal, it cannot adjust the brightness.

Matsushita Electric Industrial Co., Ltd.


A device and method for providing computer operation diagnostics. The method includes coupling a mobile device (such as a mobile smartphone) to the computer via a diagnostic port. The smartphone has a diagnostic program (application) thereon that is initiated so as to be able to communicate with a diagnostic module within the computer to request and receive information from the computer.

Many areas, including emerging regions often recycle and reuse computing components. This habit provides that these markets want to buy inexpensive but fully capable PC desktops. These PC desktops can be repaired and upgraded as needed due to the wide availability of repair/upgrade parts.
However, PCs are still complicated for novices to build and repair and tend to use cheap, easily damaged connectors that are not intended for many physical connect/disconnect cycles. Wires and connectors are typically marked in a single language (frequently English) when marked at all, which often presents problems for English as a second language (ESL) and non-English speakers. Further, many of the pin headers look very similar. Still further, just because a wire fits in a connector or a card fits in a socket does not ensure that the wire/card is suitable for working with the connector/socket. Overall, each interchangeable piece presents a possible point of failure. Furthermore, some failures result in the CPU being non-responsive such that any sort of self-diagnosis or reporting by the CPU is not possible.
Beyond emerging markets, knowledgeable hobbyists consider PCs easy to snap together and often a PC build boots the first time it is assembled, but if something goes wrong it is very difficult to diagnose problems.
Regardless of the geographic location, the lack of function makes remote diagnostics (such as a helpdesk, knowledgeable individual, or otherwise) difficult if not impossible.
Accordingly, there exists a need for an improved method and apparatus that permits remote diagnostics for a computer where the device providing the diagnosis is one readily available to emerging markets and can be provided at low cost.

Modular computing architecture enabling diagnostics


Multi tonal cymbals are provided having a metallic structure, the structure having a plurality of radial cuts therein defining a plurality of segments, each of the plurality of segments providing a tone different than another of the plurality of segments. The different tone may be achieved with radial cuts having different dimensions and/or placed on different locations on the cymbal to create different shaped/sized segments.

The present application relates to musical instruments and more particularly percussion instruments.
Modern cymbals evolved from the ancient Turkish style cymbal. These cymbals have one main sound characteristic that may be altered by either varying the diameter, general shape, weight, the production method of the cymbal i.e., hammering, spin forming or spin casting, etc., or the intensity of the musicians' striking of the cymbal or by striking the cymbal in different areas. The end result or effect is that one cymbal has a limited range of tonal frequencies when the cymbal is struck with a drumstick, mallet or by hand. Percussionists therefore must use multiple cymbals each with different characteristics to achieve a broader range of tonal frequencies.
Accordingly, there is a need for percussion instruments that are not so limited.


There is provided a solid-state image pickup device including: a pixel array portion which includes a plurality of unit pixels each having a photoelectric conversion element and an output transistor for outputting a signal according to charge obtained by photoelectric conversion of the photoelectric conversion element; a comparing portion which compares the signal output from each of the unit pixels with a ramp-shaped reference signal; a measuring portion which starts an operation in synchronization with the supply of the reference signal to the comparing portion, performs the operation until the comparison output of the comparing portion is inverted, and measures a time until the comparison of the comparing portion is finished; and a detecting portion which detects a predetermined image pickup condition and fixes the comparison output of the comparing portion to a state before the comparison starts when the image pickup condition is detected.

1. Field of the Invention
The present invention relates to a solid-state image pickup device, a method of driving the solid-state image pickup device and an imaging apparatus.
2. Description of the Related Art
A solid-state image pickup device such as a charge coupled device (CCD) type image sensor or a complementary metal oxide semiconductor (CMOS) type image sensor has been widely used as an imaging pickup device mounted in a mobile terminal such as a mobile telephone, the device being formed as one chip or as a module, or an image input device (image pickup device) of an imaging apparatus such as a digital still camera or a digital video camera.
FIG. 1 is a circuit diagram showing the configuration example of a pixel portion of a general solid-state image pickup device. As shown in FIG. 1, a unit pixel 100 according to the present example includes a photoelectric converting element such as a photodiode 101 and four transistors including a transport transistor 102, a reset transistor 103, an amplifying transistor 104 and a selection transistor 105. These transistors 102 to 105 are, for example, n-channel type MOS transistors.
The transport transistor 102 is connected between the cathode electrode of the photodiode 101 and a floating diffusion (FD) portion 106 and the gate electrode of the transport transistor 102 is connected to a transport control line 111 supplied with a transport gate pulse TG. The drain electrode of the reset transistor 103 is connected to a power source Vdd, the source electrode thereof is connected to the FD portion 106, and the gate electrode thereof is connected to a reset control line 112 supplied a reset pulse RS.
The gate electrode of the amplifying transistor 104 is connected to the FD portion 106 and the source electrode thereof is connected to a signal line 121 in a source follower circuit configuration. One end of the signal line 121 is connected to a constant current source 122. The drain electrode of the selection transistor 105 is connected to the power source Vdd, the source electrode thereof is connected to the drain electrode of the amplifying transistor 104 and the gate electrode thereof is connected to a selection control line 113 supplied with a selection pulse SEL.
FIG. 2 is a cross-sectional view showing a cross-sectional structure of a pixel portion except the amplifying transistor 104 and the selection transistor 105.
N-type diffusion regions 132, 133 and 134 are formed in the surface layer of a p-type substrate 131. On the p-type substrate 131, a gate electrode 135 is formed between then-type diffusion region 132 and the n-type diffusion region 133 and a gate electrode 136 is formed between the n-type diffusion region 133 and the n-type diffusion region 134 through a gate oxide film (SiO2) (not shown).
In the correspondence between FIG. 1 and FIG. 2, the photodiode 101 is formed by the pn junction between the p-type substrate 131 and the n-type diffusion region 132. The transport transistor 102 is formed by the n-type diffusion region 132, the n-type diffusion region 133, and the gate electrode 135 interposed therebetween. The reset transistor 103 is formed by the n-type diffusion region 133, the n-type diffusion region 134 and the gate electrode 136 interposed therebetween.
The n-type diffusion region 133 becomes the FD portion 106 and is electrically connected to the gate electrode of the amplifying transistor 104. The power source potential Vdd is applied to the n-type diffusion region 134 which becomes the drain region of the reset transistor 103. The upper surface of the p-type substrate 131 except the photodiode 101 is covered with a light shielding layer 137.
Next, based on the cross-sectional view of FIG. 2, the circuit operation of the pixel 100 will be described with reference to the waveform diagram of FIG. 3.
As shown in FIG. 2, when light is irradiated to the photodiode 101, a pair of electron (−) and hole (+1) is induced depending on the intensity of the light (photoelectric conversion). In FIG. 3, the selection pulse SEL is applied to the gate electrode of the selection transistor 105 at a time T1 and at the same time the reset pulse RS is applied to the gate electrode of the reset transistor 103. As a result, the reset transistor 103 falls into a conductive state and the FD portion 106 is reset to the power source potential Vdd at a time T2.
When the FD portion 106 is reset, the potential of the FD portion 106 is output to the signal line 121 through the amplifying transistor 104 as a reset level Vn. This reset revel corresponds to an inherent noise component of the pixel 100. The reset pulse RS is in an active ("H" level) state only during a predetermined period (time T1 to T3). The FD portion 106 is maintained in a reset state even after the reset pulse RS transitions from the active state to an inactive ("L" level) state. The period when the FD portion 106 is in the reset state is referred to as a reset period.
Next, in a state that the selection signal SEL is in the active state, the transport gate pulse TG is applied to the gate electrode of the transport transistor 102 at a time T4. Then, the transport transistor 102 falls into the conductive state, and signal charge which is photoelectrically converted and stored in the photodiode 101 is transmitted to the FD portion 106. As a result, the potential of the FD portion 106 varies depending on the amount of the signal charge (time T4 to T5). The potential of the FD portion 106 at this time is output to the signal line 121 through the amplifying transistor 104 as a signal level Vs (signal read period). The difference RSI1 between the signal level Vs and the reset level Vn becomes an inherent pixel signal level without the noise component.
In general, when the image of a bright subject is picked up, the amount of the charge stored in the photodiode 101 in the reset period is larger than that of when the image of a dark subject is picked up. Thus, the level difference RSI1 on the signal line 121 increases.
(Generation Mechanism of Blackening Phenomenon)
However, the solid-state image pickup device configured above, particularly, when significantly strong light such as solar light enters the pixel 100, a phenomenon in which a brightest portion blackens, that is, a blackening phenomenon, occurs.
The generation mechanism of the blackening phenomenon will be described with reference to FIGS. 4 and 5. FIG. 4 is a schematic diagram showing a portion for generating the blackening phenomenon and has the substantially same structure as FIG. 2. FIG. 5 is a waveform diagram at the time of the blackening phenomenon.
In the reset period, similar to that of FIG. 2, the selection pulse SEL is applied to the gate electrode of the selection transistor 105 at a time T1′ and at the same time the reset pulse RS is applied to the gate electrode of the reset transistor 103. As a result, the reset transistor 103 falls into a conductive state and the FD portion 106 is reset to the power source potential Vdd at a time T2′. The potential of the FD portion 106 at the time of the reset is output to the signal line 121 through the amplifying transistor 104 as the reset level Vn.
However, as shown in FIG. 4, when significantly strong light such as solar light is irradiated to the photodiode 101, a large amount of pairs of electron (−) and hole (+) is induced in the pn junction formed by the p-type substrate 131 and the n-type diffusion region 132 compared with FIG. 2. As a result, excessive photoelectric-converted electrons flow out of the photodiode 101. Thus, even if the transport gate pulse is in the inactive state, the excessive electrons pass through the transport transistor 102 and reach the FD portion 106. Accordingly, the potential of the FD portion 106 decreases and, as a result, the potential of the signal line 121 decreases (time T2′ to T4′).
Similarly, in the signal read period, in a state that the selection signal SEL is in the active state, when the transport gate pulse TG is applied to the gate electrode of the transport transistor 102 at the time T4′, the transport transistor 102 falls into the conductive state and signal charge which is photoelectrically converted and stored in the photodiode 101 is transmitted to the FD portion 106. As a result, the potential of the FD portion 106 varies depending on the amount of the signal charge (time T4′ to T5′). The potential of the FD portion 106 at this time is output to the signal line 121 through the amplifying transistor 104 as the signal level Vs.
At this time, since the excessive electrons leak in the reset period, as can be seen from FIG. 5, the potential of the signal line 121 decreases compared with when applying the reset pulse RS. As a result, even if strong light is irradiated, the potential difference RSI2 in the signal read period decreases.
That is, as shown in FIG. 6, in general, the difference Vs−Vn between the signal level Vs of the signal read period and the reset level Vn of the reset period is output as the inherent pixel signal level, and, when incident light amount exceeds predetermined light amount B, the signal level Vs is saturated and a constant pixel signal level is output. When the incident light amount exceeds predetermined light amount C larger than the light amount B, the excessive electrons flow out of the photodiode 101 and thus the reset level Vn varies as described above. As a result, even if strong light is irradiated, the difference Vs−Vn decreases. Accordingly, in spite of a significantly bright subject, the blackening phenomenon occurs.
In order to avoid such a blackening phenomenon, there was provided a technology for detecting whether incident light is significantly strong or not depending on whether a signal level Vs is in a saturation area or a reset level Vn is in a varying area and correcting a process for obtaining a difference Vs−Vn based on the detected result (for example, see Patent Document 1).
Patent Document 1: JP-A-2004-248304
More specifically, as shown in FIG. 7, a switch 206 is provided in the signal line of a reset level Vn between an amplifier 204 for amplifying the reset level Vn and a signal level Vs which are respectively output from a pixel array portion 201 through an N memory 202 and S memory 203 and a differential amplifier 205 for obtaining the difference between the signal level Vs and the reset level Vn. When it is detected that the signal level Vs is equal to or larger than a predetermined level Va or the reset level Vn is a predetermined level Vb in a light level detection circuit 207, the switch 206 is turned off (opening) to stop the process for obtaining the difference in the differential amplifier 205 and a signal before the A/D conversion of an A/D conversion circuit 208 is corrected, thereby avoiding the blackening phenomenon.
Alternatively, as shown in FIG. 8, even if it is detected that the signal level Vs is equal to or larger than the predetermined level Va or the reset level Vn is the predetermined level Vb in the light level detection circuit 207, the process for obtaining the difference in the differential amplifier 205 is performed, the difference is converted into a digital signal in the A/D conversion circuit 208 and stored in a memory 209. At the time of detecting the above-described state by the light level detection circuit 207, when the difference signal is read from a memory 209, the difference signal is converted into a signal having a predetermined level (signal level Va) by a conversion circuit 210 or the digital data of the A/D conversion circuit 209 is converted into saturation data by the saturation detection signal of the light level detection circuit 207, thereby avoiding the blackening phenomenon.
However, in the former technology, in order to correct the signal before the A/D conversion of the A/D conversion circuit 208, a circuit for a correction signal such as a constant voltage circuit is necessary in addition to the light level detection circuit 207 and thus the size of the circuit increases as a circuit for avoiding the blackening phenomenon.
In the latter technology, in order to correct the value of the memory 209, since the conversion circuit 210 for inserting a correction signal into the memory 209 is necessary in addition to the light level detection circuit 207 and thus the size of the circuit increases as a circuit for avoiding the blackening phenomenon.

Solid-state image pickup device, method of driving solid-state image pickup device and imaging apparatus


A refrigerator has a door-coupling structure facilitating the connection or disconnection of a door relative to a main body. The main body forms a food storage chamber which is opened and closed by the door. The door is hingedly mounted to the body by a hinge plate. An auxiliary hinge plate is fixed to the main body, and the rear end of the hinge plate is placed on the auxiliary plate. A fixing plate is disposed on the hinge plate and detachably coupled with the auxiliary hinge plate by a snap-on connection so as to secure the hinge plate onto the auxiliary hinge plate in the absence of separate fasteners such as bolts or screws.

(1) Field of the Invention
The present invention generally relates to a refrigerator. More particularly, it relates to a refrigerator having an improved hinge assembly for a door that opens and closes the food storage chamber of the refrigerator.
(2) Description of the Prior Art
In a conventional refrigerator, air cooled by an evaporator during the refrigerating cycle, is furnished to the freezing and refrigerating compartments of the refrigerator so as to keep various foods fresh longer and retard decay.
Recently, large-capacity refrigerators have gained popularity. These refrigerators' food storage chambers are divided into right and left compartments by a partition within a main case that forms an external main body. Doors to each compartment are hinged respectively on the right and left of the front of the main body by upper and lower hinge members. The upper hinge members that are bolted to the top of the main body respectively make axial connections with the doors' upper ends. The lower hinge members that are joined to the bottom of the main body are respectively connected with the lower ends of the doors.
As shown in FIG. 4, an upper hinge member 3 is formed of the combination of a hinge plate 3a and a downward hinge shaft 3b provided to a front end of the hinge plate 3a. The hinge plate 3a is fastened to the top of the main body 1 with bolts 3c. A door coupling hole 2a is formed on the top of the door 2 in a place that corresponds to location of the hinge shaft 3b. The hinge shaft 3b of the hinge plate 3a is inserted into the door coupling hole 2a, the bottom of the door 2 is connected with the lower hinge member (not illustrated) in a similar manner. This arrangement allows the door to open and close the food storage chamber (not illustrated) by rotating about the hinge shaft 3b.
Often, this large-capacity refrigerator is too big to pass through the front door of an apartment, so carriers have to disconnect the door 2 from the refrigerator and carry the main body 1 and the door 2 separately, and rejoin the door 2 to the main body 1 after it has been brought into the apartment. Unfortunately, it takes time to unfasten and fasten each of the bolts 3c when disconnecting and rejoining the door 2, and the repetition of their procedure can cause the bolts 3c' screw thread to be worn away, making them unusable. Lastly, the extra tools needed to fasten and unfasten the bolts 3c further complicates the removal and reattachment process.

Screwless mounting for a door hinge plate of a refrigerator


A control circuit operably couples to a plurality of home-automation edge-component interfaces. This control circuit is configured to compatibly interact with a plurality of home-automation edge components where at least some of the plurality of home-automation edge components are operationally incompatible with one another.

Modern homes typically include a wide variety of installed and non-permanently-deployed appliances. Examples in these regards include, but are not limited to, apparatuses that, once installed, comprise a part of the residence's infrastructure (often hidden from view, such as behind walls or doors or in garages or basements). Illustrative examples include, but are not limited to, installed pumps (such as a water pump in a well, a sump pump, or a sewage pump, to note but a few examples in these regards), a central furnace (including heat pumps), a central air conditioner, a central humidity controller, a movable barrier operator (such as a garage door opener, a driveway gate opener, and so forth), a water softener, a garbage disposal, an electronic surveillance and/or security system, an installed electricity generator (such as a gas or natural gas generator, a wind-powered generator, a solar-powered electricity source, and so forth), and lighting fixtures of various kinds.
Other appliance examples include such things as window-installed air conditioners and installed kitchen and laundry appliances (such as, but not limited to, clothes washers, clothes dryers, stoves, ovens, indoor grills, installed exhaust fans, automatic dishwashers, refrigerators, freezers, microwave ovens, trash compactors, and so forth). Other residential appliances are not installed per se and are simply non-permanently set or placed where desired. Examples in these regards include lamps, home-entertainment systems and components, communication-network interfaces (such as land-line telephones, cable connections, and so forth), stand-alone fans, aquarium equipment (such as pumps, filters, and heaters), coffee makers, towel warmers, robotic floor-based vacuum cleaners, and so forth.
"Home automation" refers in general to the automated operation of such residential appliances (typically pursuant to some planned schedule or in response to pre-identified conditions of interest). The nature and modality of the automated operation can vary with the appliance itself. In some cases the automated operation can include physical movement of some part or all of the appliance. In other cases the automated operation can include an operational change of state.
Home-automation systems typically rely upon one or more edge components to effect the desired operation. Numerous examples are known in these regards and included actuators that range from simple electronic switches (having a selectable "on" and "off" state) to sophisticated multi-state electro-mechanical mechanisms. In many cases an edge-component interface serves to control one or more such edge components. Again, numerous examples abound for such edge-component interfaces.
Unfortunately, home-automation systems and components constitute a heterogeneous lot. As a result, considerable incompatibilities exist in terms of communications protocols, instructions, and so forth. This, in turn, makes it considerably more difficult to design, install, access, modify, maintain, operate, and update or expand a home-automation system.
Elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions and/or relative positioning of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of various embodiments of the present invention. Also, common but well-understood elements that are useful or necessary in a commercially feasible embodiment are often not depicted in order to facilitate a less obstructed view of these various embodiments of the present invention. Certain actions and/or steps may be described or depicted in a particular order of occurrence while those skilled in the art will understand that such specificity with respect to sequence is not actually required. The terms and expressions used herein have the ordinary technical meaning as is accorded to such terms and expressions by persons skilled in the technical field as set forth above except where different specific meanings have otherwise been set forth herein.

Facilitated use of heterogeneous home-automation edge components


A method for manufacturing facemask structure includes following steps. A facemask with first folds is placed on a seat and a pressing body forces the facemask so as to form step-shaped structures. Then, two movable plates are used to form the step-shaped structures as second folds on the facemask. Thereby, the mask can be stretched both vertically and horizontally, in a way that the mask body becomes more three-dimensional, fitting more firmly to the contours of a wearer's face, and providing more comfort and convenience than the conventional facemasks.

1. Field of the Invention
The present invention relates to a method for manufacturing facemasks, but more precisely, it is a method for manufacturing facemask structures that renders them more three-dimensional as to fit better to the face of the wearer.
2. Description of Related Art
The major function of a facemask lies in creating a special breathing cavity, which harmful substances in the air are kept from entering that cavity, and harmful substances exhaled by the wearer are prevented from exiting that cavity. This keeps the hazardous substances in the air from being inhaled, and the exhaled hazardous substances from affecting the environment.
Different facemasks are used for different needs. Generally, the common facemasks are disposable and are usually referred to as simple facemasks. A simple facemask is one in which the filtering materials themselves are made into the face configuration, in a way that the filtering face configuration comes in direct contact with the face of the wearer. The simple facemask is well known and popular since it is cheap, easy to use, and widely available.
Referring to FIG. 1, a disposable facemask as disclosed includes a mask body 80 and two ear bands 90. The mask body 80 is made of a filtering material and is rectangular in shape, covering over the nose and mouth of the wearer. The two ear bands 90 are respectively connected to the two sides of the mask body 80 and loops around the ears of the wearer, so that the mask body 80 can be held in place to cover over the nose and mouth of the wearer.
The disposable facemask is generally made planar shaped, with ear bands 90 thereof used to loop around the ears of the wearer. Since people's faces are not planar, facemasks such as these have serious leakage problems. To resolve this problem, a plurality of folds 81 are placed on the mask body 80 of a disposable facemask extending horizontally, forming a cambered shape to cover over part of the face of the wearer.
However, the afore said conventional facemask structure has a rather cramped shape because the mask body 80 merely provides a plurality of horizontal extending folds 81 and thus the mask body 80 can only be stretched vertically. Hence, the conventional facemask cannot conform closely to the contours of the face of the wearer, allowing gaps to form causing leakages. Moreover, the conventional facemask provides a very limited cavity for the wearer to breath and converse, and comes in direct contact with mouth of the wearer when he or she tries to speak. On the other hand, there is a traditional facemask only with vertical folds. However, in the facemask industry, there is no facemask with multi-direction folds (i.e., the vertical and the horizontal folds) in the market.
Therefore, due to these inconvenience and disadvantages, the conventional facemask was meant to be improved.

Method for manufacturing a facemask structure


A driving apparatus includes a driving gear connected to a driving motor, a driven gear engaged with the driving gear, and a driving force coupling part coupling the driving gear and the driven gear to not move with respect to each other. The driving force coupling part includes an axle distance maintaining member to maintain a substantially constant distance between axes of the driving gear and the driven gear. The driving apparatus couples the driving gear and the driven gear to not move with respect to each other when a driving force is transmitted from the driving gear to the driven gear, thereby maintaining a substantially uniform distance between axes of the driving gear and the driven gear. Accordingly, a driven gear shaft is substantially prevented from changing position and deformation of a process cartridge is substantially prevented due to a driving torque of the driving gear and a load torque of the driven gear. Thus, a change in a gap between a developing roller and a photoconductive medium is minimized.

1. Field of the Invention
The present invention relates to an electrophotographic image forming device, such as a laser printer, digital photocopier and facsimile machine. More particularly, the present invention relates to a driving apparatus to transmit a driving force from a driving gear to a driven gear, a process cartridge and an image forming device which have the driving apparatus.
2. Description of the Related Art
Generally, electrophotographic image forming devices, such as laser printers, digital photocopiers, and facsimile machines, include one or a plurality of process cartridges. The process cartridge integrates a photoconductive medium unit and a developing unit as a single modular unit. The photoconductive unit has a photoconductive medium that is scanned with laser beams to form an electrostatic latent image thereon, and the developing unit has a developing roller to develop an electrostatic latent image into a developer image. The process cartridge may include only the developing unit as a single modular unit.
The process cartridge is mountable and dismountable for conveniently repairing or replacing the process cartridge.
Also, when the process cartridge includes the photoconductive medium unit and the developing unit as a single modular unit, the developing unit is driven by a driving force transmitted from a driving motor of a body to the photoconductive medium unit, along with the photoconductive medium unit, or it is driven by a driving force transmitted from the driving motor of the body, independently from the photoconductive medium unit.
When the developing unit is driven by a driving force transmitted to the photoconductive medium unit along with the photoconductive medium unit, the developing unit is still driven along with the photoconductive medium unit even when the photoconductive medium idly rotates, that is, when the developing unit does not need to develop an electrostatic latent image formed on the photoconductive medium. The unnecessary driving operation of the developing unit as described above causes friction between a developing roller and a supplying roller for supplying the developing roller with a developer and between the developing roller and a developer regulation blade for regulating the thickness of a developer layer, thereby increasing a developer stress. The increased developer stress deteriorates the uniformity of development and thus degrades quality of image.
Also, because the developing roller and the photoconductive medium are connected to each other through a plurality of gears, the number of teeth of each gear and distances between axes of gears must be taken into account to adjust a velocity ratio between the photoconductive medium and the developing roller to control the developing capability. Therefore, it is difficult to adjust the velocity ratio.
For the above-described reason, a process cartridge that separately drives the developing unit and the photoconductive medium unit is coming into increasing use.
FIG. 1 is an exploded, perspective view illustrating a general process cartridge 1 that separately drives a developing unit and a photoconductive medium unit.
The process cartridge 1 includes a photoconductive medium unit 2, a developing unit 8, and a housing 10.
The photoconductive medium unit 10 includes a drum-type photoconductive medium 4 that is rotatably disposed in a photoconductive medium casing 11 of the housing 10.
As shown in FIG. 3, a first driven gear 6 is disposed on a first end portion 5a of a photoconductive medium shaft 5 that outwardly protrudes from a first lateral frame 11a of the photoconductive medium casing 11 and is covered by a first lateral cover 33. The first driven gear 6 is engaged with a first driving gear 16 of a gear train connected to a driving motor (not shown) disposed in a body when the process cartridge 1 is pushed in the direction indicated by arrow 'A' and mounted in the body.
Accordingly, when the driving motor of the body is driven after the process cartridge 1 is mounted in the body as shown in FIG. 2, the first driven gear 6 is rotated by the first driving gear 16 in one direction, for example, in a clockwise direction (see FIG. 3). When the first driven gear 6 is rotated in a clockwise direction, the photoconductive medium 4 coaxially disposed with the first driven gear 6 is rotated in a clockwise direction.
As shown in FIG. 3, a charging roller (not shown) for charging the surface of the photoconductive medium 4, a cleaning member (not shown), such as a cleaning roller or cleaning blade, for cleaning the photoconductive medium 4, and a developing roller 7 of the developing unit 8 are arranged along the photoconductive medium 4.
The developing unit 8 includes the developing roller 7 disposed in a developing casing 13 of the housing 10 and contacting the photoconductive medium 4 with a constant gap therebetween, a supplying roller 14 for supplying the developing roller 7 with a developer, and a developer regulation blade (not shown) for regulating the thickness of a developer layer in contact with the developing roller 7.
A developing roller gear 7b is disposed on a developing roller shaft 7a protruding from a first lateral frame 13a of the developing casing 13 and covered by a second lateral cover 28. The developing roller gear 7b is connected to a second driven gear 19 via a driving force transmission gear 15 and a deceleration gear 17 that are rotatably disposed between the first lateral frame 13a and the second lateral cover 28. A supplying roller gear 14b, which is coaxially disposed with the supplying roller 14, is connected to a lower portion of the driving force transmission gear 15 connected to the developing roller gear 7b.
As shown in FIG. 3, the second driven gear 19 is engaged with a second driving gear 18 of a gear train connected to the driving motor disposed in the body when the process cartridge 1 is mounted in the body. Accordingly, when the driving motor of the body is driven after the process cartridge 1 is mounted in the body, the second driven gear 19 is rotated in relation to the second driving gear 18 in one direction, for example, in a counterclockwise direction. The clockwise rotational force of the second driven gear 19 is transmitted to the developing roller gear 7b and the supplying roller gear 14b via the deceleration gear 17 and the driving force transmission gear 15. As a result, the developing roller 7 and the supply roller 14 are respectively rotated in a counter clockwise direction.
The housing 10 includes the photoconductive medium casing 11 and the developing casing 13.
The photoconductive medium casing 11 includes the first lateral frame 11a and a second lateral frame 11b, which support shafts of the components of the photoconductive medium unit 2, for example, shafts of the photoconductive medium 4 and the charging roller, and the first lateral cover 33 for sealing the first driven gear 6 disposed on an outer surface of the first lateral frame 11a.
The developing casing 13 includes the first lateral frame 13a and a second lateral frame 13b, which support shafts of the components of the developing unit 8, for example, shafts of the developing roller 7, the supplying roller 14, the driving force transmission gear 15, the deceleration gear 17, and the second driven gear 19, and the second lateral cover 28 for sealing the developing roller gear 7b, the supplying roller gear 14b, the driving force transmission gear 15, the deceleration gear 17, and the second driven gear 19, which are disposed on an outer surface of the first lateral frame 13a.
The photoconductive casing 11 and the developing casing 13 are connected to each other via a slide groove 12a formed in a lower portion 12 (see FIG. 3) of the first lateral frame 11a of the photoconductive medium casing 11 to receive the developing roller shaft 7a, and a fixing hole (not shown) of a fixing part (not shown) formed at a rear portion of the second lateral frame 13b of the developing casing 13 to receive and rotatably support a second end portion (not shown) of the photoconductive medium shaft 5.
First and second protruding seating members 20 and 21 and first and second locking springs 23 and 24 are disposed at portions of the body that correspond to the first and the second end portions 5a of the photoconductive medium shaft 5 that protrude outwardly from the rear portions of the first and the second lateral frames 11a and 11b of the photoconductive medium casing 11.
First and second mounting guide recesses 29 (only the first mounting guide recess 29 is illustrated in the drawings) are formed in front portions of the second lateral cover 28 of the developing casing 13 (the right in the drawings) to receive and guide first and second mounting protrusions 26 and 27 formed on the body, when the process cartridge 1 is mounted in the body.
Accordingly, when the process cartridge 1 is mounted in the body by being pushed in the direction indicated by arrow 'A' as shown in FIG. 1, the first and second mounting guide recesses 29 of the process cartridge 1 receive and guide the first and second mounting protrusions 26 and 27. Also, the first and second end portions 5a of the photoconductive medium shaft 5 upwardly push supporting ends of the first and second locking springs 23 and 24, which are seated in the first and second protruding seating members 20 and 21, and then are elastically locked into the first and second protruding seating members 20 and 21 by the supporting ends of the first and the second locking springs 23 and 24.
On the other hand, when the process cartridge 1 is pulled out in the direction indicated by arrow 'B' and is dismounted from the body, the first and second mounting guide recesses 29 guide the first and the second mounting protrusions 26 and 27 to remove them, and the first and the second end portions 5a of the photoconductive medium shaft 5 upwardly push the supporting ends of the first and the second locking springs 23 and 24 against the elastic force of the first and second locking springs 23 and 24, thereby escaping from the first and second protruding seating members 20 and 21.
However, according to the conventional process cartridge 1 as constructed above, because the first driven gear 6 transmits a driving force to only the photoconductive medium 4 and the second driven gear 19 transmits a driving force to both the developing roller 7 and the supplying roller 14 through the plurality of gears 17, 15, 7b, 14b, a load torque of the second driven gear 19 in response to a rotational force of the second driving gear 18 connected to the gear train connected to the driving motor of the body, in other words, a load torque of the second driven gear 19 in response to a driving torque of the second driving gear 18 is greater than a load torque of the first driven gear 6 in response to a driving torque of the first driving gear 16.
Also, the photoconductive medium 4 is supported by the first and second lateral frames 11a and 11b of the photoconductive medium casing 11, whereas the second driven gear 19 is supported by only the first lateral frame 13a of the developing casing 13.
Accordingly, when a driving force of the driving motor of the body is transmitted from the second driving gear 18 to the second driven gear 19, the second driven gear 19 is subjected to a force 'F1' that is generated by a load torque in response to the driving torque of the second driving gear 18. Although the process cartridge 1 at both sides is supported at the first and second protruding seating members 20 and 21 and the first and the second mounting protrusions 26 and 27 by the first and the second end portions 5a of the photoconductive medium shaft 5 and the first and second mounting guide recesses 29, the first lateral frame 13a of the developing casing 13 is pushed by the force 'F1' generated by the load torque because the first lateral frame 13a of the developing casing 13, to which the second driven gear shaft 19a is fixed, and the first lateral frame 11a of the photoconductive medium casing 11 are movably fixed each other through the slide groove 12a and the developing roller shaft 7a. As a result, the second driven gear 19 does not maintain a constant position and changes a distance between its axis and the axis of the second driving gear 18, depending on the change in the load torque. Thus, the second driven gear shaft 19a changes position. Simultaneously, the process cartridge 1 suffers from a warp deformation, such that the photoconductive medium casing 11 and the developing casing 13 become warped downwardly with respect to the developing roller shaft 7a.
Also, because the process cartridge 1 is in the shape of both arm beams, such that both ends thereof are supported at the first and the second protruding seating members 20 and 21 and the first and the second mounting protrusions 26 and 27 by the first and second end portions 5a of the photoconductive medium shaft 5 and the first and second mounting guide recesses 29, the second driven gear 19, which is located in the middle of the process cartridge 1, generates a vibration due to repulsive forces F2 and F3 of the first and the second protruding seating members 20 and 21 and the first and the second mounting protrusions 26 and 27 in response to the driving torques of the first and the second driving gears 16 and 18. Accordingly, the second driven gear shaft 19a greatly changes position due to the load torque of the second driven gear 19.
When the second driven gear shaft 19a changes position due to the vibration and thus the process cartridge 1 is deformed, the developing roller 7, which is fixed to the first and second lateral frames 13a and 13b of the developing casing 13 to maintain a constant gap with respect to the photoconductive medium 4 using a gap ring (not shown), changes a gap size with respect to the photoconductive medium 4. As a result, there occurs a defect, such as jittering, in an image obtained by the process cartridge 1 due to the change in the gap between the developing roller 7 and the photoconductive medium 4.
Accordingly, a need exists for an improved driving apparatus for an image forming device.

Driving apparatus, process cartridge and image forming device having the same


An apparatus and method for detecting and replacing a defective sector on an optical disk. Recording data and error correction data are recorded on an optical disk at a manufacturing time or an initial time. The recorded data and the error correction data are reproduced in units of one sector. A defective sector is determined when address data in an address field cannot be reproduced or when a number of errors in at least one sector exceeds a specified value. Address data of the defective sector is recorded in a defect list on the optical disk. Recording data and error correction data are successively recorded on the optical disk in a plurality of successive block areas. Defective sectors are skipped and recording data and error correction data are recorded in a unit of one block beginning in a next sector area. When a defective sector is detected after recording the recording data and the error correction data at a time other that the initial time or the manufacturing time, the recording data and the error correction data are recorded in a block area being different than a block area containing the defective sector.

This invention relates to a recording and reproducing device for recording data on an optical disk and reproducing data recorded on the optical disk, a recording device exclusively used for recording data on an optical disk, a reproducing device exclusively used for reproducing data recorded on the optical disk, and a replacement processing method for effecting replacement process for a defect area or defect areas in the optical disk device.
Conventionally, an optical disk device for recording data on an optical disk having recording tracks or reproducing data recorded on the optical disk uses laser light emitted from a semiconductor laser oscillator mounted on an optical head.
With the above optical disk device, data is recorded on the optical disk in units of one ECC block, each block being constructed by a plurality of sectors.
In this case, an optical disk device is proposed in which whether or not data is correctly recorded in units of one sector is determined at the manufacturing time or at the initial time such as the application starting time, and if a sector with a defect is detected by the above determination process, the ECC block containing the defective sector is classified as a defective block and is treated as an unusable block.
Therefore, when successive data items such as speeches or moving pictures are recorded and if an ECC block (defective block) which is unusable is present, a slip replacement process for recording data on a next ECC block after skipping over the defective ECC block is effected. That is, the data recording operation is interrupted for a period of time corresponding to one ECC block.
Thus, the conventional optical disk device has a defect that the reproducing operation is interrupted for a period of time corresponding to one ECC block, for example, when successive data items such as speeches or moving pictures are reproduced.
Further, the conventional device includes a process for determining whether or not data has been correctly recorded for each sector at the recording time after the initial time, dealing with a defective sector as an unusable sector if the defective sector is detected by the above determining process and recording data by use of a sector prepared in a different area for replacement.
In this case, if data recorded on the sector of the different area is not simultaneously reproduced when one ECC block is reproduced, reproduction of the whole ECC block cannot be effected. That is, originally, the sectors of one ECC block can be successively reproduced, but in this case, it becomes necessary to reproduce the sector for replacement in the course of reproduction of the ECC block and then successively reproduce the sectors of the original ECC block. Therefore, the reproduction speed is lowered.

Optical disk device method for detecting and replacing a defective sector within a block containing recording data and error correction data on an optical disk


A low-temperature fusing brazing material containing 10-70% by weight of silver, 10-75% by weight of antimony, 10-50% by weight of indium and/or tin and 0-15% by weight of copper, and wiring boards and semiconductor device-housing packages assembled with the foregoing brazing material.

1. Field of the Invention
The present invention relates to a brazing material which is used for brazing a metal member to another metal member of an electronic component such as a wiring board or a semiconductor device-housing package. More particularly, the present invention is concerned with a brazing material which is used to braze an outer lead terminal, heat sink, etc. to a metallized layer provided on a ceramic substrate.
2. Description of the Related Art
Conventional wiring boards with electronic components such as semiconductor devices, capacitors and resistors mounted or connected thereto are each constructed of a ceramic substrate composed of an aluminum oxide-based sinter, mullite-based sinter, silicon carbide-based sinter, aluminum nitride-based sinter or the like; a metallized wiring layer formed on the upper side of the ceramic substrate in a predetermined pattern, to which a semiconductor device, capacitor, etc. are electrically connected; and an outer lead terminal composed of an iron-nickel-cobalt alloy, iron-nickel alloy or the like which is attached to the metallized wiring layer via a brazing material to connect the metallized wiring layer to an external electric circuit, with a heat-sink member composed of a highly thermal-conductive material such as copper being attached to the underside of the ceramic substrate via a brazing material for satisfactory dissipation of heat generated by the semiconductor device, the resistor, etc. into the air.
Here, the heat-sink member is attached to the underside of the ceramic substrate by precoating the underside of the ceramic substrate with a backing metallized layer and brazing the member to the backing metallized layer via a brazing material.
The metallized wiring layer and the backing metallized layer to which the heat-sink member is brazed are composed of a high-melting metal such as tungsten, molybdenum or manganese, and are applied to the upper side or the underside of the ceramic substrate in a predetermined pattern by the well-known Mo-Mn method of the prior art.
A silver-copper alloy (silver brazing alloy) is usually used as the brazing material for brazing the outer lead terminal to the metallized wiring layer and as the brazing material for brazing the heat-sink member to the backing metallized layer.
Conventional semiconductor device-housing packages for housing semiconductor devices are each composed of a ceramic substrate with a semiconductor device-mounting portion (recessed portion) in the center of the upper side for mounting a semiconductor device; a metallized wiring layer which is formed as a coat extending from the periphery of the semiconductor-mounting portion to the perimeter of the upper side and leading out externally; a semiconductor device which is mounted in the semiconductor-mounting portion and is electrically connected to the metallized wiring layer (via a bonding wire, for example); an outer lead terminal which is attached to the outer end of the metallized wiring layer via a brazing material to connect the semiconductor device to an external electric circuit; and a lid bonded to the upper side of the ceramic substrate via a sealing material, with a heat-sink member which is composed of a highly thermal-conductive material such as copper and serves to satisfactorily dissipate heat generated by the semiconductor device into the air, being attached, via a brazing material, to the underside of the ceramic substrate, which are capable of housing the semiconductor devices in the inside.
Here, the heat-sink member is attached to the underside of the ceramic substrate by precoating the underside of the ceramic substrate with a backing metallized layer and brazing the member to the backing metallized layer via a brazing material.
The ceramic substrate, the outer lead terminal, the metallized wiring layer, the backing metallized layer, the heat-sink member, etc. of the semiconductor device-housing package are formed of the same or similar materials as those used for construction of the wiring board.
In the case of the semiconductor device-housing package as well, a silver-copper alloy (silver brazing alloy) is usually used as the brazing material for brazing the outer lead terminal to the metallized wiring layer and as the brazing material for brazing the heat-sink member to the backing metallized layer.
With the conventional wiring boards or semiconductor device-housing packages, however, when a silver-copper alloy (silver brazing alloy) is used as the brazing material for brazing the outer lead terminal to the metallized wiring layer or brazing the heat-sink member to the backing metallized layer applied to the underside of the ceramic substrate, since the silver-copper alloy has a fusing point as high as 780.degree. C., increased temperatures of the brazing material cause great variation in the degrees of thermal expansion of the ceramic substrate and the heat-sink member and of the ceramic substrate and the outer lead terminal, and this has presented drawbacks in that the ceramic substrate becomes cracked or impaired otherwise, the heat-sink member and the outer lead terminal peel off from the ceramic substrate thus preventing establishment of electric connection between the metallized wiring layer and the external electric circuit, the ceramic substrate is severely bent, and thus the semiconductor device, the capacitor, the resistor, etc. cannot be connected to the metallized wiring layer on the upper side of the ceramic substrate in a firm and precise manner.

Low-temperature fusing brazing material, and wiring board and semiconductor device-housing package assembled with the same


An image recording ink composition for use in a printer for recording letters and images with a liquid ink is disclosed, comprising water and a coloring material and containing at least one water-insoluble component. The ink composition is excellent in rapid drying properties, fixing properties, freedom from obstruction in a printing machine, and preservability, and provides an image excellent in terms of blurring, density, gloss, water resistance, and light resistance.

In the field of ink jet recording, water-based inks have been mostly used from the viewpoint of odor and safety. Currently employed water-based inks are solution type inks prepared by dissolving various water-soluble dyes in water or a mixed solvent of water and a water-soluble organic solvent and, if desired, by adding various additives to the solution. An ink jet recording system using these inks has many excellent features including: (1) the recording process is easy in nature of direct recording; (2) the recording process is silent; (3) color recording is easily achieved; (4) high-speed recording is feasible; (5) special paper is not required such that the operating cost is low; and (6) ink is jetted in the form of fine droplets such that an image can be formed with a high resolving power. Because of these advantages, ink jet recording technology is being considered for future recording systems.
However, conventional ink jet recording techniques are disadvantageous in that (1) the ink easily runs on paper (blurring) to deteriorate image quality; (2) the rate of ink drying is low which results in smearing or tailing of the ink on non-image areas (ink stain); (3) the fixing property of the ink is poor; (4) the nozzles and ink passageways tend to become obstructed; (5) the image density is low; and (6) the water resistance is poor.
In order to aleviate these disadvantages, it has been proposed to add a specific surface active agent to an ink composition to thereby reduce the surface tension of the ink and to increase absorption of the ink into the paper as disclosed in JP-A-55-29546 (the term "JP-A" as used herein means an "unexamined published Japanese patent application"). Furthermore, U.S. Pat. No. 4,352,691 proposes the use of a strongly basic substance to obtain an ink composition having a high pH value which, when transferred onto paper, chemically dissolves a sizing agent added as a waterproofing agent or a pulp to thereby control spread and absorption of ink dots in paper. JP-A-58-13675 teaches the addition of polyvinylpyrrolidone having a molecular weight of 40,000 or more to an ink composition to control spread of dots and absorption in paper. These proposals, however, did not provide a complete solution to the above-described problems.


A torque converter includes an input connected to an engine. An output is connected with a transmission. A lockup clutch is connected with the output and is disposed to engage the input to couple the input with the output via an apply pressure corresponding to a target lockup strategy based on at least one vehicle operating condition. A pressure regulator is configured to modulate the apply pressure. Systems and methods are disclosed.

Vehicle powertrains can include an internal combustion engine connected to an automatic transmission via a coupling device, for example, a torque converter to transfer engine torque to the transmission. The torque converter provides a fluid coupling that transfers torque between an output shaft of the engine and an input shaft of the transmission. The fluid coupling creates a torque converter slip when an impeller of the torque converter connected with the output shaft rotates at a rate that is different than a turbine of the torque converter connected with the input shaft. In some examples, torque converters are designed to slip at low vehicle speeds to enable the transmission to rotate at a slower rate relative to the engine. As the vehicle speed increases and/or other threshold vehicle operating conditions are met, the slip rate gradually diminishes. However, fuel efficiency may be reduced and/or only a portion of available engine power utilized as a result of slip.
In some examples, torque converters can include a lockup clutch that joins the separate rotating turbine and impeller in a direct mechanical connection to minimize slip and improve transmission efficiency of the torque converter. Engagement of the clutch can be determined and applied in relation to threshold vehicle operating conditions. In some examples, control systems of a vehicle attempt to execute a target slip for the torque converter according to vehicle operating conditions and control an engagement force of the clutch until the clutch is fully engaged or locked up. This disclosure describes an improvement over these prior art technologies.

Lockup clutch modulation system and method


A vehicle anti-skid control device includes an inlet valve and an outlet valve which can each open and close, thereby selectively applying hydraulic brake pressure to a wheel of a vehicle, along brake lines connected thereto. An electronic control device applies electronic signals to selectively open and close the inlet and outlet valves. The waveform of the signals is configured to operate the inlet valve in such a way as to prevent sudden changes in the brake pressure.

1. Field of the Invention
This invention relates to the anti-skid control of a vehicle.
2. Description of the Related Art
Conventionally, adjustment of brake pressure for anti-skid control of a vehicle is performed by pulsed on/off signals with a steep waveform, which open and close inlet and outlet valves of a brake system. This conventional use of pulsed signals with a steep waveform on the inlet valve causes a sudden opening and closing of the brake line, generating a large pulsation in the brake pressure. This creates an annoying noise and vibration, and reduces the responsiveness of the brake pedal.

Method and apparatus for anti-skid control


An on-the-fly error checking and correcting system and method of supporting a non-volatile memory processes data using an on-the-fly error correction method to be performed between a temporary memory and a flash memory. The flash memory stores actual data read from the temporary memory and parity generated on-the-fly in a write mode, and transmits the stored data to the temporary memory, computes a syndrome from the stored data on-the-fly, and generates an error correction information signal according to the result of computing in a read mode. Thus, error correction may only be selectively performed.

1. Field of the Invention
The present invention relates to an encoding and decoding (hereinafter referred to as "CODEC") system. More particularly, the present invention relates to a CODEC system and method for performing on-the-fly error checking and correcting (ECC) to support a non-volatile memory.
2. Description of the Related Art
FIG. 1 illustrates a block diagram of a conventional CODEC system 10. The CODEC system 10 includes an error correction unit 11, a temporary memory 12, e.g., a static random access memory (SRAM), and a non-volatile memory 13, e.g., a flash memory.
FIG. 2 illustrates an encoding process of accessing the flash memory 13 to write input data thereon in the CODEC system 10 of FIG. 1. Referring to FIG. 2, when the temporary memory 12 stores the input data, the error correction unit 11 accesses the temporary memory 12 to read the stored data (S21). Next, the error correction unit 11 generates parity from the read data (S22) and accesses the temporary memory 12 to store the parity therein (S23). Next, the flash memory 13 reads the input data and the parity from the temporary memory 12, and stores them as non-volatile data (S24).
FIG. 3 illustrates a decoding process of accessing the flash memory 13 and reading the non-volatile data from the flash memory 13 in the CODEC system 10 of FIG. 1. Referring to FIG. 3, the temporary memory 12 reads and stores data and corresponding parity from the flash memory 13 (S31). Next, the error correction unit 11 accesses the temporary memory 12 to read the stored data (S32). Thereafter, the error correction unit 11 corrects an error in the data using the parity (S33), and accesses the temporary memory 12 and stores the corrected data as output data in the temporary memory 12 (S34).
The output data stored in the temporary memory 12 may be transmitted to and processed by a processor (not shown), and output as multimedia data to be provided to users.
If the CODEC system 10 is an MP3 player, the flash memory 13 may be a multi-level cell (MLC) type flash memory. In this case, it is known that an error may occur in a maximum of four symbols among 512 byte memory cells corresponding to one page. Here, a symbol may be 9 bits. The encoding and decoding processes illustrated in FIGS. 2 and 3 are required to correct the error. When the CODEC system 10 encodes one page, the error correction unit 11 requires 512-byte read access and 9-byte write access to store 9-byte parity in the temporary memory 12. When the CODEC system 10 decodes one page, the error correction unit 11 requires at least 521-byte read access to read 512-byte data and 9-byte parity from the temporary memory 12.
However, conventionally, even if there is no error in the data, read/write access to the temporary memory 12 to generate parity in the encoding process, and read access to the temporary memory 12 to correct the error in the decoding process are performed unnecessarily. This increases power consumption and degrades system performance.

On-the fly error checking and correction CODEC system and method for supporting non-volatile memory


A system for and method of storing and automatically dispensing predetermined amounts of one or more food products from closed containers is described. The system preferably includes multi-compartment containers carried by a carrousel assembly and moved by a dispensing mechanism for automatically selecting the appropriate container and compartment for which food is dispensed. By using a control with memory for keeping inventory, the system can dispense any one of several food products on demand.

The present invention relates generally to frozen food storage and dispensing systems, and more particularly to an automated system for dispensing individual portions of one or a variety of frozen food products for use in conjunction with an automated deep fat fryer.
Generally, even though fryers are now available for cooking such food stuffs as french fries under computer controlled conditions, the operation used in most fast food chain restaurants uses manual labor to carry out a large part of the operation. In the typical operation, frying baskets are manually filled with pre-cut, partially cooked (parfried) strips of potatoes away from the fryer, and subsequently loaded onto a slack rack. When the operator wishes to cook the potatoes, a basket is manually removed from the slack rack and inserted into the basket lift arm of the fryer. The start button is pressed on the computer controlled fryer, and the basket lift arm lowers the basket into the preheated shortening. About thirty seconds into the cook, the operator usually manually raises the basket slightly and shakes it to break up strips of potatoes which may be stuck together. At the end of the cook cycle, the baskets are automatically raised by the lift arm out of the shortening. The baskets are then allowed to remain in a position above the fryer so that excess oil will drip back into the fryer. If done correctly, the basket is moderately shaken by the operator to remove as much oil as possible, and then manually removed from the lift arm. The french fried potatoes are then manually brought to a holding station, and emptied in the holding station. In the holding station, the fries are manually salted and packaged using a fry scoop. The current practice is to hold the french fries unpackaged for up to 7 minutes and package them to order. Unsalted orders generally require cooking to order. A typical store using two adjacent fryers at a fry station will cook 100 lbs/day, which represents approximately 60-100 baskets of french fries.
Next to food costs, direct labor currently represents the largest operating cost component of this deep fat frying operation, currently accounting for approximately 21% of the total operating cost. Furthermore, fry station workers are becoming increasingly difficult to recruit since the segment of the work force willing to work in the hot, grease-laden environment of fast food restaurants is currently steadily declining, especially in the Northeast portion of the United States.
There is an increased interest therefore in automating deep fat frying operations by automating material handling and production control so as to (1) minimize the impact of crew member shortage, (2) reduce labor cost, occupational hazards and associated liabilities, and (3) improve the fried product consistency. Recent advances in computer-controlled operation of deep fat fryers have been limited in their utility, however, by the need for an automated frozen food storage and dispensing system capable of operating in conjunction with the frying apparatus. Such a system must be capable of maintaining the food product in a frozen state until almost immediately prior to cooking, of repeatably and reliably delivering a predetermined quantity of food product to a fry basket as needed, and of being quickly and easily accessed for periodic refilling and cleaning. It is especially desirable that such a system be capable of accommodating and delivering on demand a variety of different frozen food products to different fry baskets.
In general, the prior art shows a variety of apparatuses for storing, conveying and dispensing food and non-food products in individualized containers or boxes. Several of these prior art patents show conveyors in various configurations and orientations. Several of the prior art patents also show the combination of a conveyor apparatus and a freezer or refrigeration compartment.
For example, U.S. Pat. No. 3,237,804 (Bardy et al.) teaches an automatic food storage and dispensing apparatus in which food portions are held in open pans or trays seated on hinged shelves on two spaced, parallel vertical conveyors positioned inside a temperature-controlled cabinet. At col. 2, lines 19-24, the Bardy et al. patent explains the intended use of the patented apparatus as follows: "One of the uses for which the presently disclosed apparatus has been specially developed is the refrigerated storage and dispensing of foods which are to be fried and placed on trays in a completely automated process. Examples of goods which are typically fried are: chicken, fish, shrimp, onion rings and potatoes." In the Bardy et al. patent, food is dispensed by sliding a food-carrying tray down an incline to a horizontal conveyor that, in turn, carries the tray to a "tray dumping mechanism," (col. 2, lines 61-62).
The complex Bardy et al. system, however, involving multiple conveyors and sliding trays, would be difficult and costly to control and maintain in practice. The combination of numerous different moving parts and the likelihood of contamination and frequent spillage from the open food trays while they are on the vertical or horizontal conveyors or while sliding from the cabinet to the horizontal conveyor virtually guarantees unsanitary and unsightly operating conditions and frequent down times for cleaning. Indeed, even in the absence of any spillage, the open food storage trays of Bardy et al. represent unacceptable sanitary conditions under modern health codes. Moreover, after "dumping" each food tray must be recovered, cleaned, refilled, and reloaded on one of the vertical conveyors, a costly and labor-intensive procedure. Reusing the food trays of Bardy et al. without cleaning them would compromise sanitary conditions because the trays are removed from the protection of the cabinet and exposed to various environmental contaminants while moving from the cabinet to the tray dumping position.
U.S. Pat. No. 2,497,219 (Haumann) describes a coin-operated vending machine "adapted to vend frozen articles such as ice cream bars and the like," (col. 1, lines 1-4). The apparatus comprises a freezer compartment and a continuous vertical conveyor having a plurality of receiving pockets for storing the ice cream bars (FIG. 5). The apparatus also includes an ejection/dispensing system whereby an ejection arm pushes each ice cream bar out of its receiving pocket and over the upper edge of an inclined discharge passage (FIGS. 6, 7 and 11). The ice cream bar slides down the discharge passage (numeral 73 in FIG. 11), out through door 74, and into discharge tray 77.
U.S. Pat. No. 3,685,432 (Hoeberigs) is directed to a coin-operated automatic vending machine for cooked or fried foods such as french-fried potatoes. The Hoeberigs apparatus comprises a cooled food storage compartment housing a continuous vertical conveyor that carries a series of 4-compartment food holders (FIGS. 1 and 2). The food holders are designed to freely hang so as to be rotatable about a horizontal axis so as to be capable of a tipping movement (FIG. 4) which results in emptying the contents of a holder into a 4-compartment funnel (FIG. 1, reference numeral 35) and thence along a guide surface (reference numerals 52 and 53) which directs the respective food products into a frying basket (reference numeral 54). An earlier version of this invention is shown in U.S. Pat. No. 3,398,672 (Hoeberigs) wherein food containers carried on a continuous vertical conveyor can be tipped so as to pour the food product into a ladle by action of gravity. The pivotally-mounted ladle then descends into a cooking cauldron.
U.S. Pat. Nos. 2,804,982 (Verrinder); 3,779,410 (Phillips et al.); 3,315,785 (Shiffer); and 4,979,864 (Cahlander et al.) show the general concept of tipping or inverting a box or container in order to empty the contents thereof by action of gravity. For example, Phillips et al. is directed to a machine for automatically unloading chewing gum base materials from cooling pans as the pans move along a horizontal conveyor. A filled pan is propelled out of the conveyor where it is inverted, lifted and vibrated to separate the gum base from the pan.
None of the aforementioned prior art patents, however, teaches a system intended for or capable of use as an automated frozen food storage and dispensing system consistent with modern sanitation requirements, efficiency and flexibility of operation and labor-saving needs, and compatible with computer-controlled automated frying systems (such as the one described in pending parent application, U.S. patent application Ser. No. 07/759,606, filed in the names of Richard N. Caron, David H. McFadden, John M. Collins, and John Dieckman, which application is a continuation of U.S. patent application Ser. No. 07/458,982, filed in the names of the same inventors and now abandoned), both applications being described hereinafter as the "Prior Applications". More particularly, none of the aforementioned prior art patents teaches an automated frozen food dispenser which, when operated as part of an automated, integrated frying system, can quickly and easily respond, with a minimum of manual labor, to the normal ebb and flow of business during the course of a day at a modern fast food restaurant. These and other problems with and limitations of the prior art are overcome with the frozen food dispensing freezer of this invention.

Frozen food storage and dispensing system


An apparatus and method measures the gap between one substantially planar object, such as a mask, and a second planar object, such as a substrate. A gapping mark is used for measuring a gap between the first and second plates. The gapping mark includes a first grating on a first surface of a first plate, the first grating having a first uniform period in a first direction. A second grating is located on the first surface of the first plate, the second grating being adjacent to the first grating in the first direction, the second grating having a second uniform period in the first direction. The gapping mark also includes a third grating on the first surface of the first plate, the third grating being adjacent to the first grating in a second direction, the second direction being substantially orthogonal to the first direction, the third grating having the second uniform period in the first direction. A fourth grating is located on the first surface of the first plate, the fourth grating being adjacent to the third grating in the first direction.

Lithography is conventionally performed by a variety of systems and methods. Optical projection lithography employs a mask which is then imaged onto a substrate using either refractive or reflective optics, or a combination of the two. The mask contains the pattern to be created on the substrate, or a representation thereof.
FIG. 1 illustrates a cross sectional view of a conventional lithographic mask 10 separated from substrate 20 by a small gap, G. The mask 10 includes a support frame 11, membrane 12, and alignment marks 13. Complementary alignment marks 21 are located on the substrate and face the mask alignment marks 13.
FIG. 2 illustrates a prior art mask 10, showing four alignment marks 13. The central region of mask 10 includes pattern region 14 that contains the pattern that is to be superimposed over a pattern on the substrate.
FIG. 3 illustrates a substrate containing multiple identical regions of patterns 22 over which mask pattern 14 is to be superimposed in a sequence of three steps: (1) move to one of the multiple sites; (2) align mask alignment marks with respect to substrate alignments marks; (3) expose mask pattern 14 on top of substrate pattern 22.
Visible or near-infrared light is preferably used as the illuminating source for alignment, spanning a wavelength band from 400 to 900 nm, but other wavelengths may also be used. The light must be collimated with good spatial coherence. In addition, it is necessary that grating periods exceed wavelengths used in the illuminating bandwidth, so that first order diffraction is possible. The first order diffraction angle is sin θ=λ/g where θ is the diffraction angle, λ is the wavelength, and g is the period. Hence, first-order diffraction with λ/g>1 is not possible. It is desirable that grating periods exceed twice the value of any wavelengths used in the illuminating bandwidth, to ensure that first order diffraction occurs at an angle of no more than 30 degrees. Preferably, the alignment marks should include 10 or more periods of each of the paired gratings.
FIG. 4 illustrates a prior art arrangement of pairs of complementary alignment marks with differing periods to increase the range of freedom from measuring ambiguity. This feature increases the range of misalignment that can be measured without ambiguity, or increases the capture range.
In one arrangement the substrate alignment mark 21 includes two simple linear gratings having different spatial periods, gs1 and gs2. The mask alignment mark 13 includes two simple linear gratings having different spatial periods, gm1 and gm2. In between the gratings gs1 and gs2, or between the gratings gm1 and gm2 (latter is shown in FIG. 4) is an unpaired reference grating having a period gr which is coarser than any of gm1, gm2, gm1, and gm2. The periods gr, gm1, gm2, gm1, and gm2 are chosen so that:gr=gs1*gm1/|gs1−gm1|=gs2*gm2/|gs2−gm2|
This relationship ensures that gr is also the period of the two interference fringe patterns formed by the overlap of beams diffracted by the gratings. One such pattern results from interference of beams diffracted by gratings gs1 and gm1. The second such pattern results from interference of beams diffracted by gratings gs2 and gm2.
FIG. 5 illustrates the viewing of the pairs of facing alignment marks 21 and 13 by a microscope. Alignment occurs upon attainment of a predetermined phase difference. For example, this phase difference could be zero, in which case the microscope image would appear as in FIG. 6 when alignment occurs. When the relative mask and substrate positions are slowly changed, the fringe patterns will translate at higher rates. This translation not only results in magnification of the relative motion, but also overcomes the ambiguity problem that would arise with only one grating pair when the relative motion is a multiple of a grating period.
FIG. 6 illustrates the interference fringe patterns, and the reference pattern, observed when the alignment marks of FIG. 4 are properly superimposed. FIG. 7 illustrates an example of how the fringe patterns of FIG. 6 are shifted relative to each other when mask and substrate are relatively displaced perpendicular to the lines of the grating pairs.
In zone plate array lithography, an array of Fresnel zone plates is placed one focal distance away from the substrate. Each Fresnel zone plate can be individually addressed by a spatial light modulator to create an arbitrary dot-illumination matrix.
Further examples of systems using interference fringe patterns for interferometric detection of alignment and small gaps are described in U.S. Pat. No. 5,414,514; U.S. Pat. No. 6,088,103; and U.S. Pat. No. 6,522,411. The entire contents of U.S. Pat. No. 5,414,514; U.S. Pat. No. 6,088,103; and U.S. Pat. No. 6,522,411 are hereby incorporated by reference.
In the various lithographic methods discussed above, in which a pattern on a mask or template is transferred to a second planar surface, such as a silicon wafer or substrate, it is necessary to arrange the two surfaces so that the two surfaces are highly parallel, prior to bringing the two surfaces into close proximity or contact. A high degree of parallelism is important for control of consistent feature sizes and to avoid destructive contact between the template and substrate. In other applications, the surfaces may be required to be held at a specific angle or a specific large gap.
Conventionally, capacitive sensors have been used for gap detection in nano-positioning systems to detect gaps of <100 μm. Detectivity scales with the gap range—for a gap range of 10 μm, detectivity can be <1 nm. Moreover, conventionally, for a capacitive sensor designed for a gap range of 500 μm, detectivity is only ˜50 nm.
In a mask-substrate aligner, capacitive sensors are typically used to measure gap at three points around the periphery of the mask stage. Since the capacitive sensors measure the mask-substrate gap indirectly, calibration of the capacitive measurements to the actual mask-substrate gap is required. Errors associated with this methodology include thermal drift, variations between dimensions of individual masks, and stress-induced deformation by the mask stage.
Capacitive sensors have also been embedded within part of the substrate stage, adjacent to the substrate, and scanned underneath the mask. Some problems with this conventional embodiment are the potential mismatch between the capacitive sensing plane and the substrate plane, the time required to move the sensor and measure gap at multiple points, and perturbations in the capacitive measurements caused by patterned regions on the mask.
Aside from the various problems discussed above, the intrinsic limitations of capacitive sensors lie in the tradeoff between range and resolution because the capacitance falls off linearly with gap, G, between the plates, as illustrated by the following:
  C  =                    ɛ        r                          ɛ        o                          A        p              G  wherein εr is the relative permittivity of the material between the plates, εo is the permittivity of vacuum, and Ap is the area of the plates.
At large gaps, electronic noise dominates and limits gap range. At small gaps, noise is reduced, but sensitivity to non-parallelism of the capacitor plates is increased. In combination, these effects serve to limit the useful operating range.
In some applications, such as scanning probes, capacitive sensors are used to find the probe position in six axes, requiring six separate sensors. Since the range of capacitive sensors is very small compared to the diameter of the plates and the points of measurement are separated from each other and the scanning probe by a few centimeters, thermal expansion of the intervening lengths of material can degrade measurement accuracy.
Furthermore, in a multi-axis capacitor arrangement, the area of capacitor plate overlap will come into play during orthogonal motions; as one axis in an XY stage is moved, the area of plate overlap in the orthogonal axis will decrease, and may cause an undesirable variation in capacitance along the orthogonal axis. Measurement error at a point of interest between the two planar surfaces will result.
Another method of conventional gap sensing utilizes optical methods to provide a direct measurement between the mask and substrate. One such conventional method utilizes the interference of beams reflected from a HeNe laser focused onto the mask at an oblique angle. The diverging reflections from the mask and substrate interfered, and the interference fringes are detected by a linear photodetector array. The gap is determined by the spatial frequency of the interference pattern, which increases with gap linearly (to first order), with a small gap-dependent deviation from linearity. The range of gap detection is between 25 and 120 μm, and the gap uncertainty is a percentage of gap, ranging between 120 nm and 600 nm.
In proximity lithography, a typical exposure gap (i.e., <5 μm) is below the minimum detection range in the above-described optical method. At such small gaps, the angular disparity between reflected beams is too small to produce measurable interference fringes. Also, the finite thickness of the template causes multiple spurious internal reflections, which can corrupt the measurement signal.
It is further noted that the above-described conventional optical gap sensing method fails to integrate well with Interferometric Spatial-Phase Imaging aligning schemes, such as described in U.S. Pat. No. 5,414,514 and U.S. Pat. No. 6,088,103, since the above-described conventional optical gap sensing method requires diverging illumination, instead of the collimated illumination used in Interferometric Spatial-Phase Imaging. In addition, the geometry of the above-described conventional optical gap sensing method is incompatible with Interferometric Spatial-Phase Imaging alignment microscopes since the above-described conventional optical gap sensing method requires a different illumination angle and a separate sensor that must be on the opposite side of the mask from the illumination.
A second conventional optical gap sensing method measures a gap based on the interference of diffracted beams, using a beat signal that is dependent upon interference of a first-order beam and a second-order beam, diffracted from a grating. Each order has a different diffraction angle, which also depends upon the laser frequency: a laser beam of frequency f1 is incident at an angle θ1, and another beam with frequency f2 is incident at an angle θ3. The two orders are arranged to diffract at the same angle, θ2. The gap is linearly related to the phase of the beat signal. Gap sensitivity is ˜32 nm.
Although this second conventional optical gap sensing method can detect small gaps used in proximity exposures, the inseparability of gap and alignment signals is significant and undesirable.
Therefore, it is desirable to provide a method of directly measuring the gap. Moreover, it is desirable to provide an optical method of directly measuring the gap that does not require a different illumination angle and a separate sensor on the opposite side of the mask from the illumination. Also, it is desirable to provide an optical method of directly measuring the gap that can operate with collimated illumination. Furthermore, it is desirable to provide an optical method of directly measuring the gap that has separable gap and alignment signals.

Long-range gap detection with interferometric sensitivity using spatial phase of interference patterns