A method for selectively and completely disinserting the ocular vitreous body, epiretinal membranes and/or fibrocellular membranes from the neural retina, ciliary epithelium and posterior lens surface of the mammalian eye as an adjunct to vitrectomy comprises administering to the eye an effective amount of a protease-free glycosaminoglycanase enzyme, such as chondroitinase ABC, adapted to disrupt and/or degrade chondroitin sulfate glycosaminoglycan/proteoglycan localized specifically to sites of vitreoretinal adhesion and thereby permit complete disinsertion of the vitreous body and/or epiretinal membranes.

This invention relates to enzymatic disruption of the vitreoretinal interface and, more particularly, to enzymatic disinsertion or complete removal of the vitreous body in association with surgical vitrectomy.
The vitreous body, a connective tissue compartment which occupies four-fifths of the volume of the eye, provides structural and metabolic support for ocular tissues and assists in the maintenance of intraocular pressure while at the same time allowing light access to the retina. This structure is bound anteriorly by the lens and ciliary body epithelium and posteriorly by the retina. The vitreous exists as a semi-solid, highly transparent gel and is composed of approximately 99% water and 1% macromolecules including collagen, hyaluronic acid, a number of unidentified, soluble glycoproteins, sugars and various low molecular weight metabolites. The distribution of type II collagen, the major structural protein within the vitreous, is quite regular and essential for the mechanical properties of this highly diluted gel. During the earlier years of life, the vitreous is differentiated into a cortex of high density and a semifluid central vitreous; in early adolescence destruction of the vitreous framework begins, leading to the formation of liquified cavities and fibrillar strands within the vitreous gel during later years.
Normal anatomic attachments between the vitreous body and retina occur in a number of regions, although the molecular basis for normal vitreoretinal adhesion is still unknown (see FIG. 1). The zone of strongest vitreoretinal adherence, the vitreous base, straddles the ora serrata and measures approximately 3.2 mm in the anterior-to-posterior meridian (FIG. 1). Its anterior border is associated with the posterior pars plana; the posterior border expands gradually from the ora serrata towards the equator with age. The connection between the retinal basal lamina and the collagen fibrils in the region of the vitreous base is so strong in the normal human that, when the vitreous is pulled in an attempt to separate them, either the vitreous cortex breaks away from the rest of the vitreous or part of the cells of the retina and ciliary body break away from the ocular wall. In other words, the attachment is mechanically stronger than that of the vitreous gel itself. Other zones of vitreoretinal attachment, although weaker, exist at the borders of "cortical holes" including those around the optic disc ("peripallary"), around the fovea ("posterior vitreous base"), along major retinal vessels and at sights of developmental anomalies. Secondary sites of strong vitreoretinal attachment often develop at the border of degenerative or inflammatory lesions providing tractional pivot points on the surface of the retina which often cause its detachment.
Vitrectomy, the surgical removal of a portion of the vitreous body and/or associated "membranes" (epiretinal; fibrous), is indicated for the treatment or prevention of a variety of pathologic, operative, or postoperative conditions which, if untreated, can result in blindness. Typically, vitrectomy is performed secondary to complications which affect the normal vitreoretinal interface. These complications can be placed into three basic categories; 1) the development of secondary attachments between the vitreous and the retina, such as those which develop at sites of chorioretinal scars or in the vicinity of retinal neovascularization; 2) loss of normal adhesion between the retina and vitreous resulting in partial or complete vitreous detachment; and 3) the formation of cellular and/or fibrous membranes along the vitreoretinal interface and/or within the vitreous framework. Indications for vitreous surgery include proliferative retinopathy, complicated rhegmatogenous retinal detachment, epiretinal membrane formation, secondary (pathologic) vitreous detachment, vitreomacular traction, retinal detachment associated with retinopathy of prematurity, vitreous hemorrhage, perforating trauma, cataract removal, endophthalmitis, persistent hyperplastic primary vitreous, and a number of operative and posteroperative complications which affect the vitreous secondarily. The primary concern in most cases of vitreoretinal pathology is the production of retinal tears and ultimately, detachment of the retina. Retinal detachment, if not treated immediately, will lead to photoreceptor cell (those cells responsible for transduction of light impulses into electrical impulses) death and, consequently, loss of vision. For example, in cases of imcomplete vitreous detachment, the vitreous gel remains attached to the retina at the optic disc and/or the macula, and to the vitreous base. Secondary fibrous proliferation associated with these sites of adhesion leads to vitreopapillary and/or vitreomacular traction which can create tears in the retina.
Proliferative vitreoretinopathy (PVR), another example of a vitreoretinal abnormality, continues to be one of the most devastating types of vitreoretinal pathology leading to retinal detachment. In the most common type of PVR, that following retinal detachment, retinal pigment epithelial cells migrate into and proliferate within the vitreous scaffold, contributing to the formation of cellular (and fibrocellular) membranes which contract and cause retinal tears and/or retinal detachment. Peeling and/or delaminating these and other membranes from the retinal surface has become a standard procedure during vitrectomy. However, these procedures pose a great surgical risk and most often result in the creation of retinal tears and detachment. In addition, retinal tears can be created when the surgeon comes too close to the retinal surface with various instruments or when too much suction is applied on the vitreous at sites of firm vitreoretinal adhesion.
Despite the continued development and improvement of surgical techniques, creation of retinal tears and detachment is often unavoidable, due largely to our lack of knowledge pertaining to the fundamental mechanism and biology of vitreoretinal attachment. Major advances in the prevention and management of retinal detachment resulting from abnormal vitreoretinal adhesion will require detailed anatomical, biochemical and physiological research on the vitreoretinal interface if the causes of abnormal vitreous adhesion and shrinkage are to be understood.
The prior art is devoid of any disclosure of methodology for effectively insuring the selective and complete disinsertion of the ocular vitreous body, epiretinal membranes and/or fibrocellular membranes from the neural retina, ciliary epithelium, and posterior lens surface of the eye as an adjunct to vitrectomy.
Moorhead et al. (Retina, 5:98-100, 1985; Arch. Ophthalmol. 101:265-274, 1983) discloses enzyme-assisted vitrectomy using bacterial collagenase (Clostridiopeptidase A) for facilitating removal of fibroproliferative tissue and epiretinal membranes by partial digestion of the fibrous membrane prior to removal. The bacterial collagenase is stated to act by partial digestion of the fibrous membrane, thereby facilitating the removal of intravitreal fibroproliferative tissue.
Cope U.S. Pat. No. 4,174,389 discloses a method for the selective lysis of collagen fibrils located in the vitreous of the ocular region of a mammal through the administration of collagenase. According to the Cope patent, a significant amount of liquifaction occurs when the vitreous is contacted with collagenase.
Shehab et al. (Invest. Ophthalmol. Vis. Sci. Suppl. 27:317, 1986) disclose the effectiveness of six enzymes, including collagenase and chondroitinase ABC, to liquify the vitreous of freshly enucleated pig eyes by measuring the time required for total vitrectomy. Based upon the results obtained, Shehab et al. utilized protease-containing chondroitinase ABC.
Brown U.S. Pat. No. 4,696,816 discloses a method for the treatment of intervertebral disc displacement in humans using the enzyme chondroitinase ABC or AC to bring about the selective chemonucleolysis of the nucleus pulposus which contains proteoglycans and randomly dispersed collagen fibers.
Yamagata et al. (Chem. Abstracts, 68:84511g, 1968) disclose that the enzyme chondroitinase ABC selectively degrades chondroitin sulfates A, B, and C at pH 8.
There remains a need for improved methods for complete enzymatic removal or disinsertion of vitreous body as an adjunct to surgical vitrectomy, which methods are based upon the identification of the component(s) responsible for vitreoretinal adhesion.

Method for the disinsertion of vitreous body by an enzyme which disrupts or degrades chondroitin sulfate proteoglycan


Various embodiments of the present invention are directed to a multipurpose therapeutic device for managing musculoskeletal pain and administering traction. In one embodiment of the present invention, a multipurpose therapeutic device includes a front side, a rear side, a first end, and a second end. An outer gripping surface is positioned in proximity to each of the two ends and a number of invaginating contact surfaces extend from the perimeter of the front side and/or the rear side. In one embodiment of the present invention, a user may place his or her neck against one of the contact surfaces. The user may then grip the outer gripping surfaces with his or her hands and move the multipurpose therapeutic device superiorly and inferiorly along his or her neck while applying pressure against his or her neck to massage sore neck muscles or to stretch his or her spine.

Many people suffer the ill effects of musculoskeletal pain. Musculoskeletal pain may be caused by a number of different factors, including muscle strain and tension, degenerative disc disease, herniated discs, overexertion, fatigue, arthritis, whiplash, vertebral fractures, and other musculoskeletal-pain-causing factors. Some people try and manage musculoskeletal pain by using nonprescription non-steroidal anti-inflammatory drugs ("NSAIDs"), including ibuprofen, aspirin, acetaminophen, topical ointments, and other NSAIDs. Certain home remedies are often used as well, including applying heat and/or ice to the painful area, performing slow range-of-motion exercises, having a partner gently massage the sore or painful areas, and sleeping on a firm mattress with one or more therapeutic pillows, such as a neck pillow, body pillow, or other type of therapeutic pillow.
However, some musculoskeletal pain cannot be managed entirely by using NSAIDs and home remedies. Accordingly, some musculoskeletal pain sufferers opt to visit a health practitioner, such as a physician, a physical therapist, a massage therapist, or a chiropractor to manage pain. A physician may be able to manage musculoskeletal pain by prescribing local muscle relaxants and/or analgesics, applying electrical stimulation to muscle tissues, administering bed or table traction, performing surgery, fitting a patient with a device to minimize movement, and/or prescribing specific exercises, stretches, and physical therapy. A massage therapist may be able to manage muscle pain by applying pressure, tension, motion, and/or vibration to soft painful muscles or muscle groups, tendons, ligaments, and joints. A chiropractor may be able to manage pain from mechanical disorders of the spine and musculoskeletal system by making adjustments to a patient's spine.
Patients with prolonged or chronic musculoskeletal pain may try to manage the pain by combining the application of a number of different home remedies with regular therapy sessions with one or more different types of health practitioners. However, frequently scheduling appointments with health practitioners can be aggravating. Therapists and/or therapeutic equipment may not available when therapy is needed. Also, regularly attending therapeutic sessions at remote locations may be inconvenient and time-consuming. Additionally, the cost of regular therapy sessions may be too expensive for many people to afford.
Spinal traction devices are commonly used to stretch, decompress, and unload a Patient's spine to manage certain types of musculoskeletal pain. Spinal traction devices often utilize gravity or weights to apply tension to a patient in order to alleviate compressive forces on a patient's spine. However, spinal traction devices often involve cumbersome straps and supports and/or complicated weight-and-pulley systems. Additionally, controlling the amount of force employed by many spinal traction devices can be difficult. Excessive force can cause additional pain and injury while insufficient force may provide no benefit to a user. People suffering the ill effects of musculoskeletal pain have, therefore, recognized a need for a device that can be used outside of a clinical setting for managing musculoskeletal pain and administering traction.


An chromatography kit is described, a representative one of which includes: an examination container one end of which has an inlet for receiving a sample, and an chromatography examination strip used by inserting from the inlet into the examination container wherein the examination container comprises a prevention part for preventing from the adherence of the examination strip on the inner wall of the examination container.

There is a method to which an chromatographic technique is applied as a manner for assaying simply a variety of diseases by using a body fluid such as blood, blood serum, a laryngeal wiped fluid, a nasal cavity wiped fluid, a nasal discharge, and urine as the specimen material.
The chromatography may be conducted by applying an immunochromatography kit composed of an immunochromatography examination strip for assaying an analyte (pathogenic virus) in a sample, and an examination container which can contain the sample. The examination strip is provided with a sample addition part immersed in the sample, a label holding part for holding a label material for causing an antigen-antibody reaction with respect to the material to be detected in the sample, and a judgment part to which an immobilization material causing an antigen-antibody reaction with respect to the material to be detected is immobilized, these parts being usually disposed on a substrate.
A conventional immunochromatography kit is used commonly in accordance with such a manner that a sample is transferred to an examination container, an examination strip is further inserted in the examination container, thereafter the examination container is disposed in an examination container holder such as a container casing placed on a desk, they are allowed to stand for about 20 minutes, and then, the examination container is taken out from the examination container holder to confirm the presence of lines exhibiting the presence of the material to be detected. During the assay, the sample flows through the sample addition part, the label holding part, and the judgment part in the examination strip.
However, when the substrate of the examination strip inserted in the examination container adheres to the inner wall of the examination container, there is such a case where the sample flows through a gap between the substrate and the examination container due to a capillary phenomenon. As a result, there is a case where an amount of the sample flowing through the sample addition part, the label holding part, and the judgment part decreases, whereby an adequate assay cannot be made. On one hand, when a plane on which the judgment part and the like have been formed adheres on the inner wall of the examination container, there is a case where the assay accuracy decreases.
Furthermore, there is a case where the examination container is inclined or turned over carelessly in case of placing the examination container in the examination container holder, or confirming the presence of the lines. As a consequence, there is a case where the sample in the examination container is flown off, so that the assay result cannot be obtained. In such a case, a body fluid must be collected again from the person being examined; and the reexamination must be conducted. Besides, when such sample is leaked out from the examination container, there is a possibility of the contact between the sample and the assayer.

Chromatography kit, examination container, and method for manufacturing the same


A variable gain amplifier includes a variable resistor, a first MOS transistor and a second MOS transistor. The variable resistor has one end coupled to a ground. The first MOS transistor with transconductance 2gm amplifies a first differential input signal to provide a first current between an output node and other end of the variable resistor. The second MOS transistor with transconductance gm amplifies a second differential input signal to provide a second current between the output node and the ground. The variable resistor can be implemented using a MOS transistor operating in a linear region. The variable gain amplifier has an exponentially varying output current responsive to adjusting a gate voltage of the MOS transistor. Therefore, the transconductance of the variable gain amplifier has a linear-in-decibel characteristic.

1. Field of the Invention
The present invention relates to a variable gain amplifier, and more particularly to a variable gain amplifier having linear-in-decibel transconductance.
2. Description of the Related Art
An exponential gain characteristic is required in many automatic gain control (AGC) applications. In order to obtain the exponential gain characteristic, a bipolar semiconductor process and a bipolar complementary metal oxide semiconductor (BICMOS) process have been widely used. A variable gain amplifier, which has a linear-in-dB gain characteristic, manufactured by a bipolar semiconductor process, is disclosed in U.S. Pat. No. 5,999,053, which is entitled "Current Steering Variable Gain Amplifier With Linearizer". In recent years, a CMOS process has been widely used in designing integrated circuits, thus, designing amplifiers with exponential gain characteristics using the CMOS process has also been necessary. Although a MOS transistor has no inherent exponential transmission characteristic, a circuit having linear-in-decibel gain characteristic may be implemented using a CMOS process by applying the Taylor series expansion, exp(−2x)=(1−x)/(1+x) so as to approximate the linear-in-decibel gain characteristic.

Variable gain amplifier having linear-in-decibel transconductance


An IC-card manufacturing apparatus includes paired press platens and a laminated-substrate sandwiching unit. Each of the press platens has a pressure-application surface. The laminated-substrate sandwiching unit includes upper and lower sandwiching members for sandwiching a laminated substrate in a sealed state. Each of the upper and lower sandwiching members has a plate portion equal in size and shape with the corresponding pressure-application surface or projecting outward from the pressure-application surface by a predetermined amount, a frame portion bigger than the plate portion, and a connection portion which connects the plate portion and the frame portion and absorbs thermal deformation of the plate portion. The IC-card manufacturing apparatus further includes an air supply unit for supplying air to air passages having air jetting openings formed on the pressure-application surfaces of the press platens, and a control unit for controlling the air supply unit so as to supply air to the air passages for a preset period of time when the paired press platens are opened. A plurality of air cushion units are disposed between a press-platen main body and a press-platen base to be located at different positions, and a pressure setting unit for independently controlling the respective pressures of the air cushion units is provided.

1. Field of the Invention
The present invention relates to an IC-card manufacturing apparatus suitable for manufacture of thin, non-contact-type IC cards.
2. Description of the Related Art
IC cards containing electronic components such as IC chips are generally known. Such an IC card must be manufactured such that the card has no uneven surface which would otherwise result due to accommodation of an electronic component therein. Therefore, methods and apparatuses for manufacturing such an IC card have been proposed in Japanese Patent Publication No. 2(1990)-16234 and in Japanese Patent Application Laid-Open Nos. 6(1994)-176214, 9(1997)-277766, and 11(1999)-48660.
Meanwhile, a thin, flexible, non-contact-type IC card having a thickness of a few hundreds of micrometers has recently been put in practical use. FIG. 17 shows a typical IC-card manufacturing apparatus 100 for manufacturing such a thin, non-contact-type IC card. The IC-card manufacturing apparatus 100 includes a lower press platen 101 and an upper press platen 102. The lower press platen 101 is attached to a base 104 via a heat-insulating plate 103, and the upper press platen 102 is attached to an elevation member 106 via a heat-insulating plate 105. Thus, the lower press platen 101 serves as a stationary platen, and the upper press platen 102 serves as a movable platen. Heaters 107 and coolant passages 108 are provided within the lower press platen 101, and heaters 109 and coolant passages 110 are provided within the upper press platen 102. Further, a tubular lower chamber member 111 is provided on the base 104 in order to cover the circumference of the lower press platen 101, and an upper chamber member 112 is provided on the elevation member 106 in order to cover the circumference of the upper press platen 102. When the upper press platen 102 is lowered, the lower chamber member 111 and the upper chamber member 112 mate to thereby form a sealed chamber 113. Reference numeral 114 denotes an evacuation port provided on the upper chamber member 112. An unillustrated evacuator (e.g., a vacuum pump) is connected to the evacuation port 114 in order to enable evacuation of air from the chamber 113. Reference numeral 115 denotes a seal member provided on the upper chamber 112.
In such an IC-card manufacturing apparatus 100, a laminated substrate M used for fabrication of an IC card is placed on the lower press platen 101. The laminated substrate M is configured as shown in FIG. 16. Reference character P denotes an electronic component which is composed of an IC chip Pi and an antenna Pa and is mounted on a base sheet S. The base sheet S and the electronic component P are sandwiched by hot-melt sheets Ta and Tb, which are in turn sandwiched by thermoplastic resin sheets (sheets of, for example, polyethylene terephthalate) La and Lb, which carry adhesive layers Ba and Bb, respectively. Subsequently, the laminated substrate M is subjected to thermocompression bonding. Specifically, after the elevation member 106 shown in FIG. 17 is lowered, air is evacuated from the chamber 113, and the laminated substrate M is pressed by means of the lower press platen 101 and the upper press platen 102, which have been heated through supply of electricity to the heaters 107 and 109. Thus, the laminated substrate M undergoes thermocompression bonding in a state in which air bubbles have been removed from the interior of the laminated substrate M. Subsequently, the supply of electricity to the heaters 107 and 109 is stopped, and cooling water is supplied to the coolant passages 108 and 110, whereby the laminated substrate M is cooled.
Incidentally, when a thin, flexible IC card is manufactured, the states of heating and pressure-application during thermocompression bonding of the laminated substrate M greatly affect production quality. For example, when heating control is not performed properly, a manufactured product loses its flatness due to generation of warpage or distortion, and when pressure control is not performed properly, problems such as layer shifting and partial delamination occur easily, resulting in deterioration and variation in quality and decreased commercial value.
In view of the forgoing, the above-described conventional IC-card manufacturing apparatus 100 is designed such that each of the lower press platen 101 and the upper press platen 102 performs the heating step and the cooling step to thereby, secure continuity in heating control and pressure control. However, since a longer production cycle time is needed to complete fabrication of the laminated substrate M, productivity and mass-production efficiency are low, and increased energy consumption makes energy conservation and economy difficult to achieve.
The above-described problems can be solved through employment of a system in which the heating step and the cooling step are performed at different stages (locations). However, in this case, when the laminated substrate M is transferred from the stage for the heating step to the stage for the cooling step, heating and pressure application are cancelled, resulting in deterioration and variation in quality and decreased commercial value.
In view of the foregoing, the assignee of the present invention has proposed an IC-card manufacturing apparatus (basic apparatus) which comprises a laminated-substrate sandwiching unit including upper and lower sandwiching members for sandwiching a laminated substrate M in a sealed state; an evacuation unit for evacuating air from the interior of the laminated-substrate sandwiching unit; a pre-heating press unit for elevating the temperature of the evacuated laminated-substrate sandwiching unitxe2x80x94which holds the laminated substrate Mxe2x80x94to a pre-heating temperature lower than a regular heating temperature; a thermocompression-bonding press unit for receiving the laminated-substrate sandwiching unit transferred from the pre-heating press unit and for heating the laminated-substrate sandwiching unit to the regular heating temperature to thereby effect thermocompression bonding; and a cooling press unit for receiving the laminated-substrate sandwiching unit transferred from the thermocompression-bonding press unit and for cooling the laminated-substrate sandwiching unit (Japanese Patent Application Laid-Open No. 2000-182014).
Since this basic apparatus is equipped with a laminated-substrate sandwiching unit, the laminated substrate M can be accommodated within the evacuated laminated-substrate sandwiching unit in a sealed state, so that the heated state and the pressurized state can be maintained continuously; i.e., the temperature and pressure of the laminated substrate M can be maintained. As a result, commercial value can be increased greatly by means of improved quality,and homogeneity.
Incidentally, the laminated-substrate sandwiching unit provided in the above-described basic apparatus has upper and lower sandwiching members each consisting of a frame portion and a plate portion. The plate portion projects outward from the pressure-application surface of the press platen, and its circumferential edge portion is fixed to the frame portion. Therefore, the frame portion and a peripheral portion of the plate portion located outside the press platen are not heated, even if the interior portion of the plate portion in direct contact with the press platen is heated to high temperature, so that the plate portion assumes a shape of a wok (a convex shape) due to the difference in thermal expansion between the central and peripheral portions of the plate portion.
In this case, when the plate portion is thin, the deformation of the plate portion is suppressed by means of pressure applied from the press platen. However, when the thickness of the plate portion is 1 mm or greater, the plate portion deforms even in a state of pressure being applied from the press platen. Although the amount of deformation is relatively small, the deformation makes it impossible to press the laminated substrate M into a precise thickness or to effect pressing itself, when the laminated substrate M has a thickness of a few hundreds of micrometers. Further, when pressure applied to the plate portion is removed, the laminated substrate M (IC card) separates from the plate portion, causing: a variation in cooling speed with resultant variation in glossiness and/or generation of wrinkles. As described above, when the thickness of the plate portion increases, the basic apparatus causes various problems such as deterioration and variation in quality, decrease in commercial value, and decrease in yield (productivity).
Moreover, in order to increase the productivity of the basic apparatus, each press unit must be opened and closed at high speed. However, since the basic apparatus is equipped with a laminated-substrate sandwiching unit including upper and lower sandwiching members for sandwiching a laminated substrate M in a sealed state, opening a press unit at high speed causes a phenomenon such that the plates of the upper and lower sandwiching membersxe2x80x94which are in close contact with the opposite pressure-application surfaces of the press unitxe2x80x94are attracted by the opposite pressure-application surfaces, so that the upper and lower sandwiching members may be deformed and pull apart from each other. Although the deformation is small, the influence of the deformation on fabrication becomes impossible to ignore when the laminated substrate M (IC card) has a thickness of a few hundred micrometers, with the result that fabrication failure such as failure in thermocompression bonding occurs. Accordingly, the quality of IC cards deteriorates and varies, and the commercial value and yield of the IC cards decrease. In addition, the limit in relation to high speed open/close operation of each press unit lowers productivity and mass-production efficiency.
Furthermore, in such a basic apparatus, at the beginning of a pressure application step, the laminated substrate M is pressed by means of the upper and lower press platens in a state in which the thermoplastic sheets La and Lb of the laminated substrate M have not yet been plasticized sufficiently. Therefore, a relatively large pressure acts on the IC chip Pi itself, resulting in possible breakage of the IC chip Pi. Further, since the laminated substrate M has a sheet-like shape and a thickness of a few hundreds of micrometers, slight displacement of the press platen causes a great variation:in the applied pressure, with the result that pressure cannot be applied to the laminated substrate M in an accurate and stable manner. In order to solve this problem, an improved manufacturing apparatus has been proposed (see, for example, Japanese Patent Publication Nos. 1(1989)-54173 and 4(1992)-26299). In the improved apparatus, at least one of press platens is supported by an air cushion unit. Thus, the pressure applied to the press platen by means of a drive mechanism can be varied from a considerably low pressure to an intermediate pressure (or high pressure) in an accurate and stable manner. Such a conventional manufacturing apparatus has a single air cushion unit, which is suitable for applying a uniform pressure across the entire surface of a substrate to be pressed, but is not suitable for fabrication of thin IC cards, which must be of highly uniform thickness.
An object of the present invention is to provide an IC-card manufacturing apparatus which can bond a laminated substrate through thermocompression bonding by use of paired plate portions which always have a high degree of parallelism, to thereby increase production yield (productivity).
Another object of the present invention is to provide an IC-card manufacturing apparatus which can improve the quality and homogeneity of IC cards, remarkably increase yield and commercial value of the IC cards, and improve productivity and mass-production efficiency through realization of high speed open/close operation of a press unit.
Still another object of the present invention is to provide an IC-card manufacturing apparatus which can apply to a laminated substrate an accurate and stable pressure ranging from a considerably low pressure to an intermediate pressure (or high pressure), without being affected by the thickness of the laminated substrate, thereby enabling production of high-quality IC cards of uniform thickness.
In order to achieve the above objects, the present invention provides an IC-card manufacturing apparatus for manufacturing an IC card from a laminated substrate consisting of an electronic component, such as an IC chip, and sheet members, including thermoplastic-resin sheets, which sandwich the electronic component. The IC-card manufacturing apparatus is equipped with a thermocompression-bonding press unit which applies heat and pressure to the laminated substrate from opposite sides thereof by use of paired press platens having pressure-application surfaces to thereby effect thermocompression bonding. According to one aspect of the present invention, the IC-card manufacturing apparatus comprises a laminated-substrate sandwiching unit which is independent of the main body of the IC-card manufacturing apparatus and includes upper and lower sandwiching members for sandwiching the laminated substrate in a sealed state. Each of the upper and lower sandwiching members has a plate portion equal in size and shape with the corresponding pressure-application surface or projecting outward from the pressure-application surface by a predetermined amount; a frame portion bigger than the plate portion; and a connection portion which connects the plate portion and the frame portion and absorbs thermal deformation of the plate portion. During a process for applying pressure and heat to the laminated substrate, each press platen is brought into pressure contact with the corresponding plate portion so as to apply pressure and heat to the plate portion. In this process, each plate portion may deform (expand) due to heat (high temperature). However, by virtue of this configuration, such deformation is absorbed by the connection portion (a plurality of connection strips), so that the laminated substrate is bonded through thermocompression bonding by the paired plate portions which have high degree of parallelism at all times.
According to another aspect of the present invention, the IC-card manufacturing apparatus comprises at least one air passage which is formed in each press platen and has at least one air jetting opening formed on the pressure-application surface of the press platen; an air supply unit for supplying air to the air passage; and a control unit for controlling the air supply unit so as to supply air to the air passage for a preset period of time when the paired press platens are opened. By virtue of this configuration, when the paired press platens are opened, for a preset period of time air is supplied to each air passage from the air supply unit controlled by the control unit. Thus, air is jetted from the air jetting opening provided on each pressure-application surface. As a result, the laminated-substrate sandwiching unit is quickly separated from the pressure-application surfaces simultaneously with the opening of the press platens.
According to still another aspect of the present invention, at least one of the press platens is composed of a press-platen main body having a pressure-application surface and a press-platen base for applying pressure to the press-platen main body. A plurality of air cushion units are disposed between the press-platen main body and the press-platen base to be located at different positions; and a pressure setting unit for independently setting the respective pressures of the air cushion units is provided. By virtue of this configuration, when the thickness of the laminated substrate varies with position, the pressures of the respective air cushion units at different positions are set individually by the pressure setting unit; specifically, the pressure in a region corresponding to a thick portion of the laminated substrate is increased, whereas the pressure in a region corresponding to a thin portion of the laminated substrate is decreased. Through this pressure setting, the paired pressure-application surfaces for pressing the laminated substrate can be made parallel.


Programmable logic devices and techniques for programming and/or reconfiguring these devices are disclosed. For example, in accordance with an embodiment of the present invention, a programmable logic device is disclosed that incorporates flash memory and SRAM and includes multiple data ports for programming the flash memory and/or the SRAM.

Programmable logic devices (PLDs), such as for example complex programmable logic devices (CPLDs) and field programmable gate arrays (FPGAs), utilize various types of memory to store their configuration data, which defines the functionality of the PLD. For example, CPLDs generally employ electrically erasable complementary metal oxide semiconductor (EECMOS) technology, which is non-volatile but can be programmed (e.g., receive and store data) only a limited number of times and takes longer to program than some other types of memory (e.g., static random access memory (SRAM)). CPLDs typically provide numerous benefits, such as fast, predictable timing and single-level, wide-logic support.
As another example, FPGAs typically provide benefits, such as high logic density and low standby power and generally utilize SRAM technology. SRAM is infinitely reconfigurable, but loses its programming upon power loss (i.e., volatile memory) and generally requires an external non-volatile source to supply it with configuration data upon power-up.
Various types of non-volatile technology have been introduced for FPGAs to replace SRAM. For example, antifuse-based technology provides non-volatility, but can not be reprogrammed and so is not reconfigurable. Other types of non-volatile technology have been introduced, but typically suffer from various drawbacks, such as limited programmability.
Furthermore, conventional PLDs generally provide a limited number of ways to program internal memory. For example, a PLD employing EECMOS technology (e.g., electrically erasable programmable read only memory or EEPROM) may be programmable only through a JTAG interface. As a result, there is a need for improved programmable logic devices and techniques for programming the programmable logic devices.

This patent is subject to a terminal disclaimer.

Upgradeable and reconfigurable programmable logic device


In an example, an apparatus can include an array of variable resistance memory cells and a neural memory controller coupled to the array of variable resistance memory cells and configured to apply a sub-threshold voltage pulse to a variable resistance memory cell of the array to change a threshold voltage of the variable resistance memory cell in an analog fashion from a voltage associated with a reset state to effectuate a first synaptic weight change; and apply additional sub-threshold voltage pulses to the variable resistance memory cell to effectuate each subsequent synaptic weight change.

Memory devices may typically be provided as internal, semiconductor, integrated circuits in computers or other electronic devices. There are various types of memory including volatile and non-volatile memory.
Various memory arrays can be organized in a cross-point architecture with memory cells (e.g., two terminal cells) being located at intersections of a first and second signal lines used to access the cells (e.g., at intersections of access lines and sense lines). Some memory cells can be, for example, resistance variable memory cells whose logic state (e.g., stored data value) depends on the programmed resistance of the memory cell. Some variable resistance memory cells, which may be referred to as self-selecting memory cells, comprise a single material which can serve as both a select element and a storage element for the memory cell.

Neural network memory with an array of variable resistance memory cells


A method, system, and non-transitory computer-readable storage medium for managing inter-cell interference in a wireless network is provided. The method may be executed by at least one processor at a small cell gateway and may include receiving, uplink interference power corresponding to a first small cell base station (SCBS). The method may further include receiving neighboring cell information of the first SCBS, the neighboring cell information including information on a first plurality of SCBSs neighboring the first SCBS. The method may further include determining based on the received uplink interference power, that the first SCBS is experiencing inter-cell interference and determining a second plurality of SCBSs from among the first plurality of SCBSs that are interfering with the first SCBS. The method may further include adjusting uplink power allocation corresponding to a second SCBS from among the second plurality of SCBSs.

Rapid increases in the mobile subscriber base and the recent emergence of new applications (e.g., MMOG (Multimedia Online Gaming), mobile TV, Web 2.0, high definition video streaming), combined with an increasing level of penetration of data-intensive devices (e.g., smart phones, broadband enabled laptops, tablets and other devices), has resulted in the explosion of internet data traffic carried by mobile networks. To increase the capacity of a cellular network, small cell deployments are being investigated vigorously by industry and standardization bodies.
Generally, small cells (e.g., "nanocells" or "femtocells") may be personal miniature base stations installed on the subscriber's premises for providing cellular services within a home or enterprise. In contrast with a typical mobile macro cell which might have a range of up to several tens of kilometers, small cells may be low-powered radio access nodes that operate in licensed and unlicensed spectrums with a range of, for example, between ten meters to several hundred meters. Typically, small cells may be connected to the Internet and the cellular operator's core network via a small cell gateway ("SC-GW").
As an example, small cells are being implemented in wireless networks implementing the 3GPP Long-Term Evolution (LTE) standards. In 3GPP LTE standards, a small cell is termed as a Home eNodeB (HeNB) or small cell base station (SCBS). Throughout this document, HeNB and SCBS are used interchangeably to refer generically to a small cell or small cell base station. The HeNB is connected to the Evolved Packet Core (EPC) via the SC-GW.
Each SCBS may cater to multiple user equipments (UEs) or mobile terminals under its coverage area. UEs in a coverage area of one SCBS (e.g., within a given cell) may be subjected to interference from the UEs or mobile terminals from other SCBS coverage area or from surrounding macro base stations coverage area. As the number of UEs or mobile terminals increases, the magnitude of the interference may also increase. This interference may affect the quality of service of the application packets sent from UEs or mobile terminals to the SCBS, or vice versa, due to packet corruption or packet drop.
According to a conventional technique that has attempted to address this interference problem between different cells, neighboring SCBSs exchange power control and interference coordination messages with each other. Based on this message exchange, interference coordination takes place. However, such exchanging of interference coordination messages between SCBSs every time the resource allocation is done may be overwhelming for the SCBS given that, in some instances, SCBSs may be embedded devices with low capacity and processing power.

Method and system for inter-cell interference coordination in wireless networks


There are described a system and method for operating a thrust reverser of an aircraft engine, the thrust reverser having a deployed state and a stowed state. The method comprises placing the thrust reverser in the stowed state when the thrust reverser is in the deployed state, a thrust lever associated with the engine is in a forward position, and the engine is rotating at a speed below an idle speed, wherein hydraulic pressure for stowing the thrust reverser is provided by a pump driven by the engine rotating at the speed below the idle speed.

A thrust reverser is used on aircraft engines to allow for more rapid deceleration during landing. By acting against the aircraft's forward movement, the thrust reverser helps the aircraft slow down just after touchdown, reducing wear on brakes and allowing for shorter landing distances. The thrust reverser has two states: deployed and stowed.
A deploy sequence is initiated when a pilot pulls an engine thrust lever into a reverse position while the engine is running. A stow sequence is initiated when the pilot pushes the engine thrust lever into a forward position while the thrust reverser doors are open and the engine is running. The running engine provides hydraulic pressure to deploy/stow the thrust reverser. If the engine is shut down, an external hydraulic pressure cart is used to provide the required pressure to deploy/stow the thrust reverser.
While existing approaches for deploying and stowing a thrust reverser are suitable for their purposes, improvements remain desirable.

Method and system for thrust reverser operation


A location within a cycle is determined by reading a portion of a cyclic bit sequence, the bit sequence containing several interspersed bit-group sets that each contain a plurality of series that each consist of several consecutively-placed identical bit-groups. On a data surface in a disc drive, each bit group can be stored and accessed in unused bits of each servo sector's digital portion.

Cyclic bit sequences can be used in a variety of monitoring applications, and they are particularly useful for determining a coarse location (e.g. a sector number) in an electromechanical data storage device. A typical disc drive, for example, includes a spindle motor rotating one or more discs at a constant high speed. Information is ordinarily written to and read from circular tracks on the discs through the use of an actuator assembly that includes a head that flies in close proximity above the corresponding surface of the associated disc. In a disc drive utilizing an embedded sector servo system, each track includes servo sectors that are separated by data sectors. Each servo sector includes a track identification code that can be unscrambled to determine a track number that uniquely identifies the track. Track identification codes are typically encoded in Gray code, a system for reducing the impact of an error due to a radial position change that occurs while reading a track identifier.
In a typical cyclic bit sequence, each servo sector also includes one bit that identifies an index location on the track. For example, one servo sector (the index servo sector) on each track can include a "1" in the index bit, while all other servo sectors include a "0" in the index bit. The index bit serves as the starting point for determining angular (or circumferential) position of a head relative to a data surface of a disc. Once the index bit has been encountered, the disc drive includes a counter that increments each time another servo sector is encountered. Thus, the index servo sector is often servo sector number zero; the next servo sector encountered by the head is servo sector number one, etc.
There are a variety of circumstances when it is desirable to know the circumferential position without waiting for the index bit to be detected, which may take an entire disc revolution or more. For example, drives with multiple discs frequently switch heads so that a different data surface can be read or written to. This may necessitate a detection of the position, unless angular alignment between the surfaces can be presumed. This may not be the case, for example, due to recent changes in manufacturing technology or due to a small displacement from a mechanical shock. The above-described bit sequence is also vulnerable to a read error or a point defect that may prevent a successful index mark detection.
Accordingly there is a need for better systems for determining a location by using a cyclic bit sequence, ones that create a more favorable combination of speed and robustness, yet maintain a suitable degree of format efficiency. The present invention provides a solution to this and other problems, and offers other advantages over existing systems.

Determining a location based on a cyclic bit sequence containing consecutively-placed identical bit-groups


Methods and systems are provided for adjusting a compression ratio. In one example, a system may include rotating an eccentric ring of a crankshaft by flowing hydraulic fluid to first and second chambers to actuate the eccentric ring.

As emissions standards become increasingly strict, manufacturers are looking for ways to decrease emissions while maintain or increasing vehicle power output. One such approach in gasoline engines may include variable compression engines. Therein, a compression ratio may be adjusted to increase fuel efficiency while maintaining or increasing torque.
One example approach is shown by Moteki et al. in U.S. Pat. No. 6,505,582. Therein, a variable compression ratio mechanism includes an upper link coupled at one end of a piston pin and a lower link connecting the other end of the upper link to a crankpin. The variable compression ratio further comprises a control link, which is shaped to adjust an angle of the lower link. By adjusting an angle of the lower link, the crankpin orientation is correspondingly adjusted and the compression ratio is adjusted. The control link is oscillatingly supported via an eccentric cam fixed to a control shaft which is rotated via a compression-ratio control actuator.
However, the inventors herein have recognized potential issues with such systems. As one example, energy losses may incur in response to an inaccurate inclination angle of the upper link. Therefore, the compression ratio mechanism of Moteki is entirely dependent on the various mechanical components rotating exactly as desired for substantially energy losses to be prevented. Additionally, if the desired inclination angle is not reached, then piston thrust face (between the cylinder wall and the piston) may increase and piston slapping noise may increase. These mechanical components and gears are arranged in an environment have high temperatures and high mechanical stress, which may lead to degradation. That is to say, the convoluted make-up of the variable compression ratio, which relies on the compression-ratio control actuator to actuate the control link, which actuates the lower link, which actuates the crankpin, to finally adjust the upper link angle to adjust the compression ratio comprises many different pieces which may degrade and inhibit the domino effect of this Rube Goldberg-type device.
In one example, the issues described above may be addressed by a system comprising a crankshaft eccentric ring comprising a first protrusion and a second protrusion rotated by hydraulic fluid in one or more of a first chamber and a second chamber. In this way, a number of components used to adjust the compression ratio may be reduced relative to other examples.
As one example, the first and second protrusions may be arranged on opposite sides of the eccentric ring. The first and second chambers may be arranged in first and second counterweights flanking the eccentric ring, wherein the first protrusion is arranged in the first chamber and the second protrusion is arranged in the second chamber. Hydraulic fluid may flow into the first and second chambers, wherein the first and second chambers may be shaped such that they are filled with hydraulic fluid in opposite directions relative to one another. Thus, hydraulic fluid in the first and second chambers may press against the first and second protrusions in opposite directions to adjust a compression ratio of the engine. Furthermore, an amount of hydraulic fluid flowing to the first and second chambers may be adjusted so that a highest compression ratio, a lowest compression ratio, and compression ratios therebetween may be achieved.
It should be understood that the summary above is provided to introduce in simplified form a selection of concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is defined uniquely by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure.

Methods and systems for a variable compression engine


A door grip for a vehicle. The door grip comprises a base member having a central opening. A bracket is positioned proximate an interior portion of the base member. A cover having a shape generally corresponding to the base member at least partially encloses the interior portion of the base member. A mounting portion of the bracket is attachable to a vehicle door interior panel such that a handle portion of the door grip is cantilevered away from a vehicle door interior panel.

A vehicle door assembly generally comprises an outer panel, an interior panel to which an interior door grip is attached, a lock mechanism and a window regulator device. The door grip is grasped by an occupant of the vehicle to open the door for egress and to close it during ingress. A release lever may be located proximate the door grip to unlatch the door, though in some vehicles the release lever is located remotely from the grip handle.
Vehicle door grips typically are longitudinally shaped to allow an occupant's hand to easily wrap around the grip when opening and closing the door. The grip is usually attached to the door at opposing ends of the grip in order to provide a sufficiently robust assembly capable of withstanding the forces imposed upon it when the grip (and, consequently, the door) is pushed and pulled by an occupant of the vehicle. Longitudinal grips are often incorporated into an armrest. Other configurations of longitudinal door grips include straps. A significant drawback of longitudinal door grips is that they limit the design of vehicle interiors because sufficient space must be made in the interior door panel to accommodate the relatively large grip and its opposing mounting points. Accordingly, there is a need for a robust door grip that consumes less space on the interior of the door and thus can be more flexibly located on the interior door panel.


Positions of a plurality of nozzles of at least one first nozzle array of a plurality of nozzle arrays and positions of a plurality of nozzles of at least one second nozzle array of the plurality of nozzle arrays other than the at least one first nozzle array are offset from one another in a nozzle arrangement direction. A controller is configured to control ejection timings of ink from the plurality of nozzle arrays such that dots of the ink of the colors for each same pixel are offset from each other by an equal offset amount in the nozzle arrangement direction and a relative movement direction orthogonal to the nozzle arrangement direction.

1. Technical Field
This disclosure relates to an inkjet printer configured to perform printing by ejecting inks to a print medium.
2. Related Art
Japanese Patent Application Publication No. 2010-162755 proposes an inkjet printer configured to print an image by ejecting droplets of ink from nozzles of an inkjet head to a sheet.
An inkjet printer capable of performing color printing by using multiple color inks includes multiple inkjet heads configured to respectively eject these color inks. In color printing, the color inks ejected from nozzles of the inkjet heads are landed on the sheet in an overlapping manner for each pixel.
Among line inkjet printers, there is one using inkjet heads which each include two nozzle arrays and in which nozzle positions of the two nozzle arrays in the main scanning direction are offset from each other by half the nozzle pitch (half pitch). Moreover, among such inkjet heads, there is one in which the inkjet head can eject different color inks from the two nozzle arrays. This can reduce the number of inkjet heads in an inkjet printer capable of color printing, compared to a case of using inkjet heads each having one nozzle array only.

Inkjet printer having offset nozzle arrays


A computer-implemented redundant-coverage discard method and apparatus for reducing pixel shader work in a tile-based graphics rendering pipeline is disclosed. A coverage block information (CBI) FIFO buffer is disposed within an early coverage discard (ECD) logic section. The FIFO buffer receives and buffers coverage blocks in FIFO order. At least one coverage block that matches the block position within the TCPM is updated. The TCPM stores per-pixel primitive coverage information. The FIFO buffer buffers a moving window of the coverage blocks. Incoming primitive information associated with the coverage blocks is compared with the per-pixel primitive coverage information stored in the tile coverage-primitive map (TCPM) table at the corresponding positions for the live coverages only. Any preceding overlapping coverage within the moving window of the coverage blocks is rejected. An alternate embodiment uses a doubly linked-list rather than a FIFO buffer.

The present disclosure relates to graphics processing units (GPUs), and more particularly, to a device and method for reducing pixel shader work in a tile-based graphics rendering pipeline of a GPU.
GPUs are specialized devices that accelerate the processing of computer generated graphics. GPUs are also used in a variety of modern-day computing environments such as neural networks, artificial intelligence (AI), high performance systems, autonomous vehicles, mobile devices, gaming systems, and the like. Hidden surface removal (HSR) is a conventional part of the GPU hardware. Pixel shading is one of the most power-hungry and time-consuming tasks of graphics frame rendering in a GPU. HSR helps by reducing overdraw, that is the unnecessary rendering of pixels which will be completely overwritten by following pixels and thus not contribute to the final image. As a result, overall frame processing performance is improved. In addition, reduced pixel shading saves energy consumption. However, conventional approaches to HSR and pixel shading reduction still lack the necessary performance and energy savings needed by ever-increasing computational demands in complex technology environments.

Efficient redundant coverage discard mechanism to reduce pixel shader work in a tile-based graphics rendering pipeline


A head-mounted visual display apparatus which uses two or more two-dimensional display devices and which is compact, lightweight and enables an image which is clear as far as the periphery of the observation image field to be observed at a wide field angle and high resolution. The apparatus has a first two-dimensional display device (4) and a second two-dimensional display device (5). An ocular optical system (3) includes a first surface (11) having both reflecting and transmitting actions, a second surface (12) having at least reflecting action, and a third surface (13) having at least reflecting action. The first surface (11) is disposed to face an observer's eyeball (6). The second surface (12) is disposed to face the first surface (11). The third surface (13) is disposed to face the first surface (11) in a side-by-side relation to the second surface (12). Thus, images displayed by the first and second two-dimensional display devices (4 and 5) are led to the observer's eyeball (6).

The present invention relates to a visual display apparatus and, more particularly, to a visual display apparatus, e.g. a head-mounted display apparatus, which enables observation of an image at a wide field angle and high resolution.
In recent years, helmet- and goggle-type head-mounted display apparatuses have been developed for virtual reality or for the purpose of enabling the user to enjoy a wide-screen image personally.
Incidentally, a conventional head-mounted display apparatus is arranged as shown in FIG. 16 [see Japanese Patent Application Unexamined Publication (KOKAI) No. 3-188777]. An image displayed on a two-dimensional display device 51, e.g. a liquid-crystal display device, is reflected by a half-mirror 52 disposed in front of a user's eyeball at a tilt angle of 45 degrees. The reflected display image is enlarged by a concave mirror 53 disposed forward of the half-mirror 52, and the enlarged display image is viewed through the half-mirror 52. It should be noted that the two-dimensional display device 51 is disposed near the front focal point of the concave mirror 53.
Assuming that in the optical system shown in FIG. 16, WD is the distance (working distance) between the optical system and the user's eyeball, D is the diameter of the concave mirror 53, and t is the thickness of the optical system, and considering the passing area for principal rays, the following equations hold. It should be noted that D and t are approximately equal to the vertical and horizontal widths (as viewed in the figure), respectively, of the half-mirror 52, which is tilted at 45 degrees; therefore, D and t are approximately equal to each other.
D=2(t+WD)tan(.theta./2) PA1 t=D PA1 t{1-2tan(.theta./2)}=2WDtan(.theta./2) PA1 t=2WDtan(.theta./2)/{1-2tan(.theta./2)}
In view of the operability of the head-mounted display apparatus, it is necessary to set WD in the range of from 10 millimeters to 40 millimeters. In a case where WD is 20 millimeters and the field angle .theta. is 40 degrees, for example, the thickness t of the optical system becomes as large as 53 millimeters as will be understood from the above equations. Moreover, it is necessary in actual practice to ensure a passing area for subordinate rays in addition to the principal rays. Accordingly, a larger optical system is needed.
There is another problem that because a small-sized two-dimensional display device does not have a large number of pixels, the enlarged image of the display device for observation cannot have sufficiently high resolution. Under these circumstances, the present inventor examined a scheme of obtaining a wide image display area by providing a plurality of two-dimensional display devices in a side-by-side relation to each other. However, another problem is associated with this scheme. That is, a lightweight liquid-crystal display device is commonly used in a display apparatus of the type which is fitted to an observer's head as in a head-mounted display apparatus, and the liquid-crystal display device has an image display structure in which, as shown in the front view of FIG. 17, an image display area G is surrounded by a substrate portion K. Therefore, if a plurality of such liquid-crystal display devices are disposed in a side-by-side relation to each other, the substrate portions K of each pair of adjacent display devices interfere with each other, making it difficult to obtain the desired wide image display area.
Attempts have heretofore been made to widen the observation field angle by combining two or more two-dimensional display devices. However, U.S. Pat. No. 5,157,503 and German Pat. No. 4,127,924 are not such compact and lightweight apparatuses as to be fittable to an observer's head. In Japanese Patent Application Unexamined Publication (KOKAI) No. 6-308425, aberrations occur to a considerable extent because an ocular optical system is formed by using a convex lens. Moreover, aberrations change considerably when the observer's eyeball position is shifted from the proper position. Accordingly, a variety of observers having different interpupillary distances cannot stably observe the displayed image.


A method for starting a gas generating system serving to generate a hydrogenous gas used for operating a fuel cell. The gas generating system includes: devices for converting starting materials into the hydrogenous gas; devices for conditioning at least a portion of the starting materials; devices for purifying the hydrogenous gas by removing unwanted gas constituents, and; a starting burner. According to the method, in a first method step, at least one fuel is combusted inside the starting burner. The hot waste gases resulting from this combustion firstly heat the devices provided for conditioning at least a portion of the starting materials, and the residual heat of these waste gases subsequently heats at least one additional component. In parallel thereto, the devices for converting the starting materials are heated by an electric heating. In a second method step, the starting materials are subsequently fed into the respective components of the aforementioned devices after a starting temperature has been reached. In a third method step, the quantitative proportions of the starting materials are then continuously modified in the direction towards the quantitative proportions provided for the normal operation of the gas generating system.

The invention relates to a method for starting a gas generation system for generating a hydrogen-containing gas for operating a fuel cell, having devices for converting starting substances into the hydrogen-containing gas, having devices for conditioning at least some of the starting substances, having devices for removing undesirable gas constituents from the hydrogen-containing gas and having a starting burner.
It is known from the general prior art that a hydrogen-containing gas can be generated by conversion of hydrocarbon-containing compounds in what are known as reformers and can be used, for example, to operate a fuel cell. In particular when fuel cells are used in motor vehicles, the hydrogen required can be generated on board from a hydrocarbon-containing compound, such as for example gasoline, diesel, naphtha, natural gas or from an alcohol, such as for example methanol. One particular requirement for all possible applications, but in particular for use in motor vehicles, is for it to be possible for the gas generation system to be started within the shortest possible time. For this purpose, in particular the components which are responsible for reforming the hydrocarbon-containing compound and for removing undesirable gas constituents from the hydrogen-containing gas have to be brought to their normal operating state as quickly as possible.
U.S. Pat. No. 4,820,594 A1 has disclosed a method for starting a gas generation system in a fuel cell system. In the starting phase of the gas generation system, the fuel which is reformed during subsequent operation in the fuel cell system is used to provide the thermal energy required to heat up the gas generation system through direct combustion of this fuel in the region of at least some components of the gas generation system. However, one drawback is that it is very difficult or even impossible to control the temperature of the thermal energy generated by the combustion. In particular when heating components with catalytically active materials, such as for example reformers, selective oxidation stages and the like, at least punctiform overheating may occur, leading to long-term damage to the catalytically active material. Moreover, a further drawback lies in the components having to be designed specially for direct heating, making it more difficult to optimize the components and if appropriate also to thermally insulate them. A further drawback which is certainly also worth noting is that the proposed starting method cannot provide for the heating of further components which require a lower temperature.
Although it would in principle be possible to devise solutions for controlling the temperature, for example by means of substoichiometric or superstoichiometric combustion, such solutions would have the drawback of very high emissions of particulates and/or unburnt residues of the fuel, and in general certainly of a hydrocarbon or the like, or of the provision of large quantities of air.
Other documents, such as for example DE 196 39 150 A1 or U.S. Pat. No. 6,268,075 B1, use catalytic burners to heat the components of the gas generation system. The drawback of such a use of catalytic burners is that only relatively low-boiling fuels can be used. The use of higher-chain and correspondingly higher-boiling hydrocarbon mixtures, such as for example diesel, is not possible or is only possible with considerable outlay for preparing the fuel prior to the actual conversion in the catalytic burners.

Method for starting a gas generating system


A NOR operation is performed on the address bit by bit by a NOR circuit, and when the final address in a page is detected from the result of the NOR operation by a final address detection circuit, a program starting circuit executes data writing to a memory cell. This can ensure detection of the final address in a page without using a counter circuit. It is therefore possible to simplify the structure of the final address detection circuit and reduce the circuit area occupying in a semiconductor memory device.

1. Field of the Invention
The present invention relates to a semiconductor memory device, for example, NAND type EEPROM (Electrically Erasable and Programmable ROM).
2. Description of the Related Art
In this type of NAND EEPROM, data is basically written page by page. Since the page-by-page writing is done in such a way that programming is effected after all of one page of data is input to a latch circuit, the data input cycle should be discriminated from the program cycle. It is thus necessary to acknowledge the completion of input of the entire one page of data.
The end of the data input cycle is conventionally detected by counting the number of pieces of input data using a counter circuit.
Counter circuits conventionally used each occupy a large area in a semiconductor memory device and have a complicated structure.

Page-mode type memory writing control circuit using end-of-page address


Disclosed is a semiconductor device including: a semiconductor substrate; a plurality of diffusion layer patterns formed on the semiconductor substrate; an insulation film formed between the plural diffusion layer patterns on the semiconductor substrate; and a through plug formed to be partly surrounded by the insulation film without being in contact with the plural diffusion layer patterns and to pass through the insulation film and the semiconductor substrate. Further disclosed is a semiconductor device including: a semiconductor substrate; a plurality of diffusion layer patterns formed on the semiconductor substrate; an insulation film formed between the plural diffusion layer patterns on the semiconductor substrate; and a through plug formed to be partly surrounded by the diffusion layer pattern without being in contact with the insulation film and to pass through the diffusion layer pattern and the semiconductor substrate.

1. Field of the Invention
The present invention relates to a semiconductor device having through plugs, more particularly, to a semiconductor device in which highly reliable through plugs are formed with good productivity.
2. Description of the Related Art
In accordance with the reduction in size and weight of electronic equipment such as portable devices and mobile devices, downsizing and higher-density design are being demanded also for electronic components constituting the electronic equipment. As one of such electronic components, used is a stacked-type semiconductor device (multichip device) in which semiconductor integrated circuit chips (LSI chips) are three-dimensionally stacked.
Among multichip devices, a structure with the highest integration degree and thus allowing downsizing is such a type of multichip device having a three-dimensionally stacked structure in which through plugs are formed through semiconductor substrates having semiconductor devices formed thereon. In this type of device, the through plugs electrically connecting a face of the semiconductor substrate in which elements are formed to a rear face side are formed. The through plug is constituted of an insulating material covering a sidewall of a through hole and a low electrical resistance metal material (for example, Al, Cu, or the like) in a columnar shape that is positioned so as to be surrounded by the insulating material and that serves as a conductive member. The low resistance of the conductive member ensures the operating performance as a system.
Here, it is more advantageous in view of processes that a through plug forming step is carried out after the completion of a transistor forming step called a frontend process which requires a relatively high-temperature process, in other words, during a multilayer interconnection forming step that is a backend process. Usable methods of forming through holes in which the through plugs are to be formed are reactive ion etching (RIE) using plasma, which is anisotropic etching, and wet etching using an etchant of an alkali solution.
An example of a semiconductor device fabrication method including a through hole forming step is a method described in a patent document: Japanese Patent Laid-open Application No. Hei 10-223833.


An amplification circuit of a semiconductor apparatus includes a first amplification unit configured to amplify a difference between an input voltage and a reference voltage and generate a preliminary amplification signal, a second amplification unit configured to secondarily amplify the preliminary amplification signal and generate an amplification signal, and a compensation unit configured to form an addition current path.

1. Technical Field
Various embodiments relate to a semiconductor apparatus, and more particularly, to an amplification circuit of a semiconductor apparatus.
2. Description of the Related Art
In a semiconductor apparatus, as a process becomes fine, the level of an external voltage VDD is reduced, and the output characteristics of a transistor constituting the semiconductor apparatus is also reduced.
Accordingly, since the voltage gain of an amplification circuit used in the semiconductor apparatus is also reduced, it is necessary to provide an amplification circuit having a desired voltage gain characteristic in a condition that a low external voltage is used.

Amplification circuit of semiconductor apparatus


Features of electronically embodied games are logically categorized, analyzed, and compared. Features are preferably organized according to a hierarchical classification scheme, according to a classification scheme that is not strictly tautological. All suitable feature sets are contemplated, including sets corresponding to characteristics of personifications of players and non-players, types and/or uses of game space, methods of rewarding a player, etc. In other aspects comparisons are made between an evaluation game and one or more sets of historically available games. Such sets can be grouped by genre and the number of games in such sets can range anywhere from a single game to hundreds of games, or more. Reporting and guidance can include providing a risk assessment score or other risk analysis, feature assessment (prevalence), market placement, business model analysis, dynamic trend analysis, clustered pattern recognition, and image analysis.

All games, including video games, comprise sets of rules. Such rule sets define everything from the visuals of the environment, to the means by which a person or object moves through such an environment, manipulates that object or environment and, eventually, completes the game.
Significantly, no system has been developed for logically analyzing and comparing video games on a feature by feature basis. In fact, such analysis has not even been possible because a standard nomenclature for features of video game features has not been established. It is true that games are routinely classified into genres, (e.g., Action, Fighting, Role-playing, Massively Multiplayer Online, Platform, Simulation, Sports, and Strategy), and are also routinely classified according to their age and skill levels. But such classifications are subjective, and there appears to be no rigorous logical system for mapping between feature sets and game classifications.
The closest prior art seems to be U.S. Publication No.: 2003/0065978 (parameterizing errors of a software product already released to the public), U.S. Pat. No. 6,937,913 (parameterizing features of products that customers say they want or need), and U.S. Pat. No. 6,826,541 (applying a heuristic to criteria identifiers of products). These and all other extrinsic materials discussed herein are incorporated by reference in their entirety. Where a definition or use of a term in an incorporated reference is inconsistent or contrary to the definition of that term provided herein, the definition of that term provided herein applies and the definition of that term in the reference does not apply.
Many problems in the video game design process result from this absence of systems and methods for logically analyzing and comparing video games on a feature by feature basis. For example, game production is often hindered because genre-standard features are often forgotten or are remembered late in the design process, only to be hastily implemented at the last minute. On the flip side of the coin, non-standard features are often given undo emphasis and allotted a disproportionate amount of development resources. Additionally, without a standard for comparison, different departments within development studios and publishing houses can have difficulty even agreeing on what the core features of their video game should be, or deciding what percent of their development effort should be spent on innovation as opposed to delivering on core genre features.
The problems extend to the investment side of gaming as well. Most game developers who are seeking funding are also in a difficult position when attempting to convince investors that they have a product which can be successful in the marketplace. Many games which could have been very successful never make it off the ground because the studios simply can't sell their ideas effectively. From the investor's perspective, there is a total lack of tools and services which with the risk of the investment can be assessed. For the most part, investors must rely on experience, instinct, intuition and a great deal of luck.
Thus, there is still a need for systems and methods in which video and other electronically embodied games can be analyzed and compared according to a features, with appropriate guidance provided to interested parties.

Characteristics of players systems and methods for analyzing electronically embodied games

Electronic Entertainment Design and Research


An electrical connector includes an insulating housing and a retainer. The housing has a plurality of contact accommodating cavities. The retainer is moveable between a temporary locking position and a main locking position. The retainer has first retainer arms that extend into a front surface of the housing. The first retainer arms have a second locking member formed on a top surface in a vicinity of a free end of the first retainer arms and a third locking member formed on a bottom surface in substantially a center of the first retainer arms. The second and third locking members are configured to abut the housing in the temporary locking position so that the retainer is prevented from moving from the temporary locking position to the main locking position.

FIGS. 10, 11A, and 11B (Japanese Patent Application Kokai No. H9-161875) show a first conventional electrical connector 101. The electrical connector 101 includes an insulating housing 110. The housing 110 includes a contact accommodating member 111 having a plurality of contact accommodating cavities (not shown) for receiving contacts (not shown). A hood 112 extends forward from the contact accommodating member 111. Each of the contact accommodating cavities (not shown) has a first locking arm (not shown) for initially locking the contacts in the housing 110. A flexible second locking arm 113 extends forward from the contact accommodating member 111 and is disposed inside the hood 112 of the housing 110. The second locking arm 113 has a locking member 114.
A retainer 120 that secures the contacts (not shown) in the housing 110 is inserted from a front surface (left side in FIG. 10) of the housing 110 into the hood 112. The retainer 120 can be locked to the housing 110 in a temporary locking position shown in FIG. 11A that allows insertion of the contacts (not shown) into the contact accommodating cavities (not shown) and in a main locking position shown in FIG. 11B that secures the contacts (not shown) in the housing 110. The retainer 120 has a first locking projection 121 and a second locking projection 122. The first locking projection 121 prevents the retainer 120 from being pulled in a forward direction toward the front surface of the housing 110 when the retainer 120 is in the temporary locking position. The second locking projection 122 contacts a front surface of the locking member 114 when the retainer 120 is in the temporary locking position, as shown in FIG. 11A, so that the retainer 120 is prevented from being pushed in toward a rear of the housing 110 when the retainer 120 is in the temporary locking position. The second locking projection 122 is positioned to a rear of the locking member 114 when the retainer 120 is in the main locking position, as shown in FIG. 11B, so that the retainer 120 is prevented from being pulled in the forward direction toward the front surface of the housing 110.
FIGS. 12A to 12F (Japanese Patent Application Kokai No. 2001-332335) show a second conventional electrical connector 201. The electrical connector 201 includes an insulating housing 210. A plurality of contact accommodating cavities (not shown) for receiving contacts (not shown) is formed in the housing 210. A locking arm (not shown) for initially locking the contacts (not shown) in the housing 210 is disposed inside each of the contact accommodating cavities (not shown). A retainer insertion opening 216 for inserting a retainer 220 is formed in the housing 210. First locking members 213 are formed on rear portions (left portion in FIG. 12A) of the retainer insertion openings 216. Second locking members 214 are formed on front portions of the retainer insertion openings 216 in positions lower than the first locking members 213. As shown in FIG. 12B, first locking openings 211 and second locking openings 212 are formed in both side walls of the housing 210.
The retainer 220 is constructed so that it is inserted into the retainer insertion opening 216 from a top surface (upper side in FIG. 12A) of the housing 210 to double-lock the contacts (not shown). As shown in FIG. 2A, first retainer arms 222 that protrude downward are formed on lower rear portions of two side walls of the retainer 220. First locking projections 223 are formed at tip ends of the first retainer arms 222. Second locking arms 224 that protrude downward are formed on lower front portions of the two side walls of the retainer 220. Second locking projections 225 are formed at tip ends of the second locking arms 224.
The retainer 220 can be locked to the housing 210 in a temporary locking position shown in FIGS. 12A to 12D that allows insertion of the contacts (not shown) into the contact accommodating cavities (not shown) and in a main locking position shown in FIGS. 12E and 12F that secures the contacts (not shown) in the housing 210. The temporary locking position consists of a first temporary locking position P1 shown in FIGS. 12A and 12B and a second temporary locking position P2 shown in FIGS. 12C and 12D that are successively different in a direction of insertion depth.
As shown in FIG. 12B, when the retainer 220 is in the first temporary locking position P1, temporary locking projections 221 that protrude to an outside from both side walls of the retainer 220 enter into the first locking openings 211 in the housing 210 and restrict vertical movement of the retainer 220. As shown in FIG. 12A, when the retainer 220 is in the first temporary locking position P1, the first locking projections 223 of the retainer 220 are positioned above the first locking members 213 of the housing 210 and restrict downward movement of the retainer 220.
As is shown in FIG. 12D, when the retainer 220 is in the second temporary locking position P2, the temporary locking projections 221 enter into the second locking openings 212 in the housing 210. At the same time, the first locking projections 223 are positioned beneath the first locking members 213 of the housing 210, as shown in FIG. 12C, and restrict upward movement of the retainer 220. The second locking projections 225 are positioned above the second locking members 214 of the housing 210 and restrict the downward movement of the retainer 220. Accordingly, the force that holds the retainer 220 in the temporary locking position is greater when the retainer is in the first temporary locking position P1 than in the second temporary locking position P2.
As shown in FIG. 12F, when the retainer 220 is in the main locking position, the temporary locking projections 221 are still positioned inside the second locking openings 212. Further, as shown in FIG. 12E, the second locking projections 225 are positioned beneath the second locking members 214 of the housing 210 and restrict the upward movement of the retainer 220.
FIGS. 13A to 13C (Japanese Patent Application Kokai No. 2002-260766) show a third conventional electrical connector 301. The electrical connector 301 includes an insulating housing 310. A plurality of contact accommodating cavities 311 for accommodating contacts 320 are formed in the housing 310. As shown in FIG. 3C, an inner peripheral wall member 315 is formed inside the housing 310. The inner peripheral wall member 315 protrudes forward from the contact accommodating cavities 311. Locking members 312 that correspond to the contact accommodating cavities 311 are formed to protrude forward inside the inner peripheral wall member 315. A locking arm 313 that has a locking opening 314 is formed on the inner peripheral wall member 315.
A retainer 330 is inserted from a front surface (left side in FIG. 13A) of the housing 310 and secures the contacts 230 in the housing 310. The retainer 330 is constructed so that it is inserted over the outer periphery of the inner peripheral wall member 315. The retainer 330 can be locked to the housing 310 in a temporary locking position shown in FIG. 13A that allows insertion of the contacts 320 into the contact accommodating cavities 311 and in a main locking position shown in FIG. 13C that secures the contacts 320 in the housing 310. A plurality of receptacle accommodating openings 331 that accommodate receptacles 321 of the contacts 320 are formed in the retainer 330. A lance 332 that initially secures the contacts 320 is disposed in each of the receptacle accommodating openings 331. Lance receiving openings 333 that permit flexing of the lances 332 are disposed above the respective lances 332. A first locking projection 334 and a second locking projection 335 protrude from a bottom portion of the retainer 330.
As shown in FIG. 13B, when the retainer 330 is in the temporary locking position, the first locking projection 334 is positioned to a front of the locking arm 313 and prevents the retainer 330 from being pushed toward a rear of the housing 310. As shown in FIG. 13B, when the retainer 330 is in the temporary locking position, the second locking projection 335 enters into the locking opening 314 of the locking arm 313 and prevents the retainer 330 from being pulled out in the forward direction. Because a back surface 334a of the first locking projection 334 is formed as a reversed tapered surface as shown in FIG. 13B, when a pressing force is applied to a front end surface of the locking arm 313, locking is reinforced. Consequently, the retainer 330 that is in the temporary locking position cannot be easily pushed into the main locking position.
As shown in FIG. 13C, when the retainer 330 is in the main locking position, the first locking projection 334 enters into the locking opening 314 of the locking arm 313 and prevents the retainer 330 from being pulled out in the forward direction. When the retainer 330 is moved to the main locking position, as shown in FIG. 13C, the retainer arms 312 of the housing 310 advance into the lance receiving openings 333 of the retainer 330 and prevent the upward movement of the lances 332 to ensure that the contacts 320 are prevented from slipping out of the housing 310.
The following problems have been encountered in the above-described conventional electrical connectors. In the first electrical connector 101, since the locking arm 113 possesses flexibility, the retainer 120 that is in the temporary locking position can easily be moved to the main locking position. Accordingly, there are cases in which the retainer 120 that is in the temporary locking position is unintentionally moved to the main locking position as a result of, for example, foreign matter or the like contacting the locking arm 113.
In the second electrical connector 201, in order to hold the retainer 220 in the second temporary locking position P2, the first retainer arms 222 that are disposed on the lower rear portions of the two side walls of the retainer 220 restrict upward movement of the retainer 220. The second locking arms 224 disposed on the lower front portions of the two side walls of the retainer 220 restrict downward movement of the retainer 230. Therefore, two kinds of locking arms are needed, which requires a large amount of space. Moreover, since there are two temporary locking positions, there is a danger that the second locking position P2 will erroneously be recognized as the main locking position.
In the third electrical connector 310, although the retainer 330 can not be easily pushed from the temporary locking position into the main locking position, it is difficult to set the angle of inclination of the back surface 334a of the first locking projection 334 so that the locking arm 313 is not damaged when moving the retainer 330 from the temporary locking position to the main locking position.


A computer readable recording medium stores a printer driver program to be installed in a computer in order to use a printer. The printer driver program includes a grasping processing for grasping version information of various kinds of printer related programs for executing a processing as to the printer, installed in the computer; and a version information displaying processing for, when a predetermined version information displaying instruction is input, displaying version information of the printer driver program together with version information of the printer related programs grasped by the grasping processing.

The present invention relates to a computer readable recording medium storing a printer driver program which is installed into a computer in order to use a printer.
As is well known, some kinds of printers having been on the market are each provided with a driver program for making the printer perform a printing operation and a monitor program for monitoring the operating state of the printer. Each of these programs is upgraded in its version at each program module constituting the program. Thus, each of the driver program and the monitor program for the printer is arranged (programmed) so as to be able to display the version information of the respective program modules of these programs.
However, in the existing driver program and monitor program, when a user wants to know various kinds of version information relating to the respective programs installed in a user's computer, the user is required to repeatedly input instructions by using a mouse etc. thereby to start the driver program to display the version information relating to the driver program and thereafter to start the monitor program to display the version information relating to the monitor program.

Computer readable recording medium storing printer drive program


A device and method of manufacturing a jointing together cylindrical bodies, in which one of the bodies is composed of two semi-cylindrical shells. Each body is provided with a flanged end which are locked against one another by a threaded clamping ring having a bevelled face 8. In an alternative embodiment, the clamping ring comprises a tapered circlip. The method is especially useful for the jointing together of the various cylindrical parts comprising a missile.

This invention relates to a tubular body having at least 3 parts joined together and a method for joining the same.
The invention is particularly useful for the joining cylindrical aerodynamic bodies, such as missiles for example. The missiles to which this invention is applicable are usually constructed by fitting two mating semi-cylindrical shells with necessary electronic control equipment and then clamping the mated shells onto a cylindrical body tube. The body tube may incorporate a propulsion unit. Known jointing methods involve the use of a series of fasteners or a manacle ring. These known fastener types have the disadvantage of making a marked contribution to the aerodynamic drag of the missile because they are not flush with the missile body skin.
Objects of this invention ar to provide a clamping arrangement which does not incur aerodynamic drag, which eliminates the need for joint clearances and which provides good geometric alignment.

Split section body joint with wedge ring

British Aerospace Public Limited Company


An assembly system for components of a pressurized fluid supply system for an agricultural vehicle includes a body having at least one fluid duct connectable at one end to a pressurized fluid supply and having a socket at the other end. A detachable component such as an accumulator or oil filter is connectable in releasable mechanical engagement with the body to receive pressurized fluid from the at least one fluid duct. The engagement results from insertion of at least a portion of the component into the socket and rotation of the component to a locked position. The body has at least one discharge duct extending therethrough. In a partially rotated position of the component portion within the socket, the component remains mechanically attached to the body and the fluid duct and discharge duct are in fluidic connection, discharging accumulated pressure in the fluid duct.

The consumers in a supply system are connected with lines which are also named as circuits in the following description. It will be understood that the term "circuit" as used herein is not limited to a closed loop arrangement of lines and may refer to arrangements as simple as a single line linking two components or consumers.
Furthermore, it will be understood that the terms "motor" and "pump" as used herein describe fluid driven machines or, especially hydraulically or hydrostatically driven motors and pumps.
Modern tractors are equipped with various consumers requiring hydraulic supply. The hydraulic supply is conventionally provided by a hydraulic pump supplying pressurized fluid from a tank or reservoir.
These supply systems contain components such as the accumulators, which provide damping reservoirs, and which require regular maintenance. To facilitate this, they are configured to be easily disassembled by using screw-in connections, bayonet joints, or any other means to allow quick detachment and reattachment of components.
In recent decades the increased power demand on tractors and especially for the hydraulic supply system has resulted in the required available pressure level in the hydraulic supply circuit to now be up to 250 bar, with the tendency to further increase. In construction equipment, pressure levels of 500 bar are already used.
As this pressure level may remain in the hydraulic circuit also during maintenance, serious accidents have happened when pressurized components (e.g., hydraulic accumulators or oil filters) are disassembled under high pressure.
Suggestions have been made to provide pressure monitoring and automatic shut-down. This monitoring can be costly and, in some circumstances, not feasible as it may be disadvantageous to shut off the supply during maintenance.
It is an object of the present disclosure to provide a component assembly including connection means that addresses the issue with minimum costs and installation space but high functional safety.