A waveguide-microstripline transformer comprises a waveguide which is closed at one end and has a slit at a side wall thereof, a dielectric substrate plate placed on the slit, a microstripline placed on the dielectric substrate plate, and a shield case covering the dielectric substrate plate, whereby less blocking of the incident electromagnetic wave is attained.

This invention relates to a waveguide-microstripline transformer, which is used in a down converter etc. for broadcasting or communication by man-made satellites, and more particularly to a waveguide-microstripline transformer in which the mode of the electromagnetic wave is transformed from a mode for propagating in a waveguide to a mode for propagating in a microstripline.
In recent years, commercial satellite (CS) broadcasting has become popular, and CS broadcasts which use commercial communication satellites are now being implemented. This has resulted in increased occasions for general households to receive broadcasts from plural satellites. In the course of this development, in addition to the demands for reduced size and lower costs for the receiving antenna, a new problem has arisen due to the interference of a polarized wave from one satellite with a differently polarized wave from another satellite. As such, there is a renewed interest in the importance of a low-noise down-converter having excellent performance, which has the ability to discriminate cross-polarization waves in order to determine when a parabola antenna is used, regardless of whether there is suppression of the interference.
What follows is an explanation of a conventional waveguide-microstripline transformer, as shown in FIGS. 3(a)-3(d). A conventional waveguide-microstripline transformer comprises a cylindrical waveguide 1, a shield case 2, dielectric substrate plate 3, and two microstriplines 4 and 5 working as probes. The shield case 2 or a short cylinder with a bottom plate has an inside diameter the same as the waveguide 1, a depth equal to 1/4 of the wave length and closes the end of the waveguide 1 with a dielectric substrate plate 3 in between. On the dielectric substrate plate 3, there are microstriplines 4 and 5 working as probes.
When an electromagnetic wave (assuming the wave is single polarized) is propagated through the waveguide 1, it is totally reflected by the shield case 2, and the reflected wave excites the microstripline probe 4 so as to be transformed to an electromagnetic wave which propagates along the microstripline. If the incident electromagnetic waves are of cross-polarized type, providing another microstripline probe 5 makes it possible to transform two mutually orthogonal polarized waves into waves propagating on the microstriplines.
However, in the above conventional structure it is necessary to make the waveguide 1 and the dielectric substrate plate 3 perpendicular to each other. This proves problematic when used in combination with a parabolic reflector such as an antenna, because there will be an undesirably large area that can block the electromagnetic wave incident upon the reflector. This conventional structure also is inferior when receiving cross-polarized waves, as the orthogonally polarized waves either interfere with each other or the structure's ability to discriminate between them decreases, because the two microstripline probes 4 and 5 must be formed on the same dielectric substrate plate 3 intersecting the waveguide 1.
There thus exists a need in the art for a waveguide-microstripline transformer that reduces the possibility of the electromagnetic waves being blocked before reaching the reflector. Further, there is a need for a waveguide-microstripline transformer that will effectively separate and discriminate between two incident orthogonally polarized waves.


Apparatus for analyzing components in a mixture by the steps of introducing the mixture into the ion source of a mass spectrometer, ionizing some of the individual molecules representative of the mixture, using the mass spectrometer to select a beam of ions of a single ion mass which may be characteristic of a target compound in the mixture, passing the resultant single-mass beam of ions through a gas-filled collision chamber, and then, using a second mass spectrometer, determining the mass spectrum of the collision fragment ions to confirm the identity of the target compound, and by measuring the intensity of all or part of the mass spectrum, determine its concentration or amount in the original sample mixture. The same apparatus is suitable for fundamental measurements of the collision processes, which in addition to fragmentation include ion molecule reactions, charge changing collisions, and others, in addition to analytical applications. The collision region simultaneously provides collision gas confinement, primary and fragment ion confinement, variability of collision energy, and variability of drift field in the collision chamber. It is composed of a leaky dielectric material, in the form of a cylindrical tube joining the exit of the first quadrupole mass spectrometer to the entrance of the second mass spectrometer. Methods of data collection and handling are also disclosed.

1. Field of the Invention
The invention relates to the field of analytical mass spectrometry. Specifically it introduces new apparatus and methods for rapid identification and quantification of target compounds in a mixture by means of selection of a single mass ion beam from the multi-mass ion beam derived from the mixture, and further analyzing the single mass ion beam by controlled collision in a gas cell, followed by mass analysis of the resulting fragment ions and other secondary ions. More specifically, the invention relates to a unique new type of collision cell, which allows analytical and economic advantages over previous embodiments of the mass spectrometry--collisional fragmentation--mass spectrometry concept. Furthermore, the invention relates to new methods of automated apparatus control and data collection.
2. Discussion of the Prior Art
Many versions of ion selection--ion collision--fragment ion mass analysis systems for chemical mixture analysis have been described, for example, in the review article by R. G. Cooks in National Bureau of Standards Special Publication 519, Trace Organic Analysis: A New Frontier in Analytical Chemistry, Proceedings of the 9th Materials Research Symposium, April 10-13, 1978, (Issued April 1979). Most versions use one or another form of magnetic mass spectrometer instrument. More recently, several laboratories have described quadrupole mass spectrometer based systems, for example, R. A. Yost and C. G. Enke writing in Analytical Chemistry, 51, 1251A-1274A (1979). The consistent feature of these systems is the use of three quadrupoles in tandem. The first quadrupole is operated in the normal manner, in which both RF and DC voltages are imposed on the rods, and sufficient resolution (determined by the ratio of DC to peak RF voltage) is chosen to select one ion mass for injection into the second quadrupole. The second quadrupole is operated in a well-known but less usual manner, in which no DC voltage, and only a relatively small RF voltage, is imposed on the rods. In this mode, the quadrupole acts as a high pass mass filter, i.e., the amplitude of the RF voltage determines the lowest mass that can successfully traverse the length of the rods, lower masses being rejected and higher masses being transmitted. In these embodiments of the concept, the collision gas is introduced into the enclosure of the second quadrupole, and the amplitude of the RF voltage is chosen sufficiently small that even the low mass collision fragment ions are transmitted. The third quadrupole, operated in the normal manner, then serves to produce a mass specturm of the collision fragment ions emerging from the second quadrupole.

Methods and apparatus for analysis of mixtures by mass spectrometry


A stack of hygiene sheet products including first and second webs that are interfolded with each other. The stack includes a top panel of the first web and a top panel of the second web, wherein the top panel of the first web overlays the top panel of the second web but has been cut away so that the top panel of the second web is revealed by the top panel of the first web. An adherence layer is placed on the top panel of the first web and the top panel of the second web and is exposed at the top of the stack so that it can adhere to an adjacent stack so that when the last sheets of the adjacent stack are pulled through a dispenser opening of a dispenser, the first and second sheets are pulled securely through with it as a result of the direct adherence.

WO 00/00072 discloses interfolded napkins comprising first and second napkin sheets. The first napkin sheet is divided into many napkins connected to one another by tab parts of a line of perforation. The second napkin sheet is similarly formed. The first and second napkin sheets are interfolded with each other to form a stack of interfolded napkins. The lines of perforation of the first sheet may be aligned with folds of the second sheet so that the first sheet is folded at the lines of perforation in the interfolded stack. In an alternative stack disclosed in WO 00/00072, the interfolding is such that the lines of perforation are positioned between adjacent folds so that folds are not formed at lines of perforation. In both versions, the first and second sheets can be described as being interfolded with each other in an offset way since the lines of perforation of the first and second sheets are offset with respect to one another along the longitudinal direction of the first and second sheets.
In WO 00/00072, napkins of the stack are dispensed from a dispenser through a dispenser opening and torn away from the corresponding napkin sheet at the lines of perforation. The longitudinal offset of the lines of perforations of the first sheet relative to the lines of perforations of the second sheet result in the dispenser revealing just one more forwardly protruding sheet at the dispensing opening to reduce the chance of both sheets being grasped as would occur if the offset was marginal or non-existent. The interfolding of the sheets means that when a napkin of the first sheet is pulled through the opening of the dispenser, part of a napkin of the second sheet comes through the opening with it. The protruding part of the napkin of the second sheet can be grasped by a user for dispensing convenience. As compared to interfolded napkins where each napkin is pre-separated from one another in the stack (in contrast to interfolded offset sheets where each napkin is connected to an adjacent napkin by a line of perforation), there is a reduced risk for a dispensing failure to occur whereby the next napkin in the stack is not pulled through with the napkin being dispensed.
U.S. Pat. No. 1,381,307 and EP 0287766 also disclose stacks of interfolded offset sheets.
The prior art interfolded sheet stacks enable a first sheet hygiene product (e.g. napkin, towel, tissue or the like) of one sheet to be pulled partly through a dispensing opening of a dispenser when a second sheet hygiene product of the second sheet is dispensed through the dispensing opening for convenience in revealing to a user the next product to be dispensed. While the prior art interfolded stacks are generally successful in pulling a product of the other sheet with the product of the other sheet being dispensed for most of the stack, the present inventors have found that a dispensing failure can still occur at the transition from one stack to a next stack in the dispenser.

Stack of interfolded first and second sheets


A bird feeder that uses the standard size half-gallon rectangular milk type containers commonly used for liquids. The bird feeder includes a base having a front and back. A back support is attached near the back of the base. Two side supports are attached to the base and the back support. A front support is attached between the two side supports. A feed lip is attached to the base near the front of the base. A container area is formed by the front, back, and side supports and is sized just enough to receive and fit the milk type container. A container lip support mounted in the container area between the side supports and near the base to aid in retaining a lip of the milk type container in position.

There are many bird feeders currently on the market. Most of these bird feeders are designed to keep animals and even certain types of birds from using the bird feeder. These type of bird feeders are expensive, and can be difficult to set up and use.
It is an object of the present invention to provide a bird feeder which uses existing milk type containers filled with bird feed and is simple to use.
A bird feeder that uses the standard size half-gallon rectangular milk type containers commonly used for liquids, such as milk or orange juice. The bird feeder includes a a base having a front and back. A back support is attached near the back of the base. Two side supports are attached to the base and the back support. A front support is attached between the two side supports. A feed lip is attached to the base near the front of the base. A container area is formed by the front, back, and side supports and is sized just enough to receive and fit the milk type container. A container lip support mounted in the container area between the side supports and near the base to aid in retaining a lip of the milk type container in position.


A safety flag includes reflective material, a light source and a controller. The safety flag meets legal requirements when used for extended loads in vehicles in day and night use.

1. Field
The embodiments relate to safety flags, and in particular to safety flags including highly reflective material and lighting.
2. Description of the Related Art
Safety flags are required by state and federal laws on loads that extend a vehicles length and/or width. Typically, when a safety flag is required, a rag or plastic flag is placed on a load to enable other motorists and pedestrians to see the extended load. These "flags" or markers, however, typically do not meet the requirements of state and federal regulations/laws. Further, these rags or plastic material flags only work to apprise other motorists and pedestrians during daylight.


An anti-adjusting rotary valve type carburetor includes a high speed adjustment oil needle having an eccentric hole and an idle adjustment oil needle having an eccentric hole. Also disclosed is a specialized adjustment tool having an eccentric convex platform for adjusting the high speed adjustment oil needle and the idle adjustment oil needle. Also disclosed is a high speed adjustment oil needle having an eccentric convex platform and an idle speed adjustment oil needle having an eccentric convex platform. Also disclosed is a specialized adjustment tool having an eccentric hole for adjusting the high speed adjustment oil needle and the idle speed adjustment oil needle.

The carburetor is vacuum produced in the engine work; the gasoline can be mixed with air for a certain proportion. The carburetor, as a precision device, plays an important role in the engine and can be called "the heart of the engine". The device should include a starting device, idle device, and throttle control device. According to the requirements of the different work state for the engine, the carburetor automatically matches the corresponding mixed gas concentration, puts out the corresponding amount of mixed gas, in order to make the distribution of the mixed gas mixed evenly, and the carburetor has the effect of fuel atomization, for the normal operation of the machine.
In order to make the carburetor always work stably in the optimum mixture ratio of the fuel and air, usually carburetor manufacturers in the carburetor factory have the carburetor fuel and air mixing ratio adjusted to the optimal state, which can not only play the best working performance of the engine, and significantly extend the carburetor normal working life, but also make the carburetor reach optimal oil state at work, thus greatly saving fuel resources. In order to enable the carburetor to be stable in the optimum mixture ratio of the fuel and air, and play the optimal performance of engine, and also to substantially extend the carburetor normal service life and save fuel resources, it is necessary to set up an anti-adjusting mechanism on the carburetor to prevent non-specialized users from randomly adjusting the fuel and air mixing proportion of the carburetor. However, existing carburetors cannot meet the above requirements. For example, U.S. Pat. No. 6,394,424 discloses a rotary valve carburetor, including: the structure of the regulating head of the idle adjustment oil needle is linear type, and a steel ball is pressed on the top of the regulation structure; this anti-adjusting structure is very complex, economic performance is very poor, and engine manufacturers or carburetor manufacturers will not be able to adjust the idle oil needle when they need to adjust the carburetor technical parameters.

Anti-adjusting rotary valve type carburetor


The present invention relates to an integrated circuit, at least one portion of which includes at least one group of standby cells for possible connection to said portion of the integrated circuit by replacement connections, the length of which cannot exceed a predetermined value. The inputs and outputs of the standby cells are connected to metal standby tracks being disposed on the circuit such that any node of the circuit portion is distant by at most said predetermined value from any point on the tracks.

1. Field of the Invention
The present invention relates to the field of integrated circuits.
2. Discussion of the Related Art
The fast development of technology has led to an increase in circuit complexity at the same time as a decrease in the commercial lifetime of circuits. Conversely, the time required by a manufacturing cycle (mask patterning, processing of the silicon wafers, circuit testing and encapsulating) remains significant.
Inevitably, after designing a complex integrated circuit, the first manufactured circuits frequently exhibit errors. The circuit can then be run back through the design steps to attempt to correct the error, prior to starting again a manufacturing batch. This requires a new thorough cycle of manufacturing, which is costly and long and can put the commercial interest of the circuit at risk.
It is thus often preferred to correct the hardware element formed by the integrated circuit itself. This, with the purpose of validating the correction on a few prototypes only. The correction on circuits produced in series can only be done by modifying the masks. An integrated circuit generally includes a semiconductor substrate currently made of silicon in which the several primary circuit components are formed. This substrate is topped by several levels of conductive layers (polysilicon, metallizations, generally called xe2x80x9cmetallization levelsxe2x80x9d). Once a defect has been identified in the integrated circuit, such as a missing logic function, high precision machines (MDL 1000 of Bertin/Spectra Physics for the laser cut, FIB (Focus Ion Beam) of Schlumberger for the cut and the perforation, the metal deposition and the oxide deposition) are used to perforate the metallization levels to obtain access to the terminals of the primary components, to disconnect these components and to connect back the inputs and the outputs of these components to a xe2x80x9cstandby cellxe2x80x9d in order to add the missing logic function.
Standby cells have no function in the circuit as long as this circuit does not require correction, and their inputs are conventionally grounded to avoid useless power consumption. Standby cells are conventionally implanted by groups. FIG. 1A schematically shows a conventional group 11 of standby cells formed of a NAND gate (1), of a D flip-flop (2) and of a tri-state gate (3) that enable a great variety of corrections.
FIG. 1B shows as an example a very simplified top view of an integrated circuit, the basic components of which have not been shown. In this integrated circuit 10, a great number of groups of standby cells 11 is implanted. These cells, in a repair, are to be connected to selected circuit nodes. These cells must be very numerous since a limitation of the above-mentioned correction method is that machines for establishing the replacement connections (conventionally by implantation of metal at the circuit surface) do not allow, for technical reasons, replacement connections to exceed a given length (xcex94). For a circuit to be possibly repaired at each of its nodes, each of its nodes must not be further than length xcex94 from a group of standby cells. Thus, standby cell groups 11 are conventionally arranged according to rows and columns distant by 2xcex94/{square root over ( )}2 from one another across the entire circuit 10 that is desired to be made repairable. Also, the groups of cells can be at a distance of xcex94/{square root over ( )}2 from the edges of the circuit that is desired to be made repairable. The standby cells, implanted among the basic circuit components, occupy a surface which is far from being negligible and increase the circuit surface, and thereby its cost.
Taking as an example a circuit such as shown in FIG. 1B, of 10 mmxc3x9710 mm, xcex94 being equal to 400 xcexcm, the number of implanted standby cell groups will be (10,000xc3x97{square root over ( )}2/400)xc3x97(10,000xc3x97{square root over ( )}2/400)=10,000/8=1,250. Assuming that a group of standby cells is formed of approximately forty transistors, the groups of standby cells in this embodiment according to prior art altogether amount to 1,250xc3x9740=50,000 transistors. A chip of 10 mmxc3x9710 mm conventionally amounts to one million transistors, and the standby cells represent in this case 5% of the chip surface, which will increase the chip price by at least 5%.
To maintain reasonable prices, there is a temptation to reduce the number of standby cell groups, and to place them only in the circuit areas which are the most likely to exhibit errors, but the insurance of being able to perform a repair at any node of the circuit is thereby lost, and problems of impossible repairs sometimes arise.
Another limitation of this method is associated with the fact that the cutting or the establishing of a connection leads to digging the upper surfaces of the circuit to the connection to be cut, and to the terminals of the standby cell which is desired to be connected. The deeper the elements to be reached, the more the subsequent digging operation and connection operation will be delicate, long and costly.
An object of the present invention is to overcome the disadvantages of the above-mentioned correction methods.
A more specific object of the present invention is to reduce the silicon surface occupied by the standby cells.
Another object of the present invention is to facilitate repair operations by reducing metallization layer crossing operations.
These objects as well as others are achieved by an integrated circuit including at least one group of standby cells connected to metal tracks arranged on the circuit so that any node of the circuit is distant from these tracks by at most the maximum value xcex94 allowed for an emergency repair. So connected, a single group of standby cells is sufficient to guarantee that at least one repair can be performed at any node of the circuit.
According to an embodiment of the present invention, the standby tracks are made in a single metal level as close as possible to the circuit surface, to facilitate a possible repair.
More specifically, the present invention provides an integrated circuit, at least one portion of which includes at least one group of standby cells for possible connection to said portion of the integrated circuit after manufacturing thereof by replacement connections, the length of which cannot exceed a predetermined value, and in which the inputs and outputs of the standby cells are connected to metal standby tracks being disposed oil the circuit such that any node of the circuit portion is distant by at most said predetermined value from any point the tracks.
According to an embodiment of the present invention, the circuit includes several metallization levels, and the standby tracks are mostly made in the highest possible metallization level.
According to an embodiment of the present invention, the inputs of a first group of standby cells are connected to a ground of the circuit and other groups of standby cells are connected in series with the first group by standby tracks arranged side by side in groups of standby tracks, so that no input of a standby cell is floating.
According to an embodiment of the present invention, the groups of standby cells are implanted substantially regularly along the groups of standby tracks.
According to an embodiment of the present invention, the groups of standby tracks are arranged in a zigzag pattern on the circuit portion in a succession of lines of same direction, extending across the entire width of the circuit portion, these lines being interconnected at each end by a portion of perpendicular column substantially equal to twice the predetermined value of a replacement connection.
According to an embodiment of the present invention, a group of standby cells is arranged substantially at one end of each line of a group of standby tracks.
According to an embodiment of the present invention, the inputs of the first group of standby cells are connected to the circuit ground by small segments of standby tracks.
According to an embodiment of the present invention, the outputs of a standby cell unconnected to a following standby cell are connected to small segments of standby tracks which have been left floating.
According to an embodiment of the present invention, a group of standby cells includes standard elements such as a NAND gate, a D flip-flop, and a tri-state gate.
The present invention also relates to a method comprising implanting in a portion of an integrated circuit at least one group of standby cells meant to be possibly connected to nodes of said integrated circuit portion after the manufacturing thereof by replacement connections, the length of which cannot exceed a predetermined value, and of connecting the inputs and outputs of the standby cells to metal tracks called standby tracks, being disposed on the circuit such that any node of said circuit portion is distant by at most said predetermined value from any point on these tracks, the standby tracks being made in the highest possible metallization level.
The foregoing objects, features and advantages of the present invention will be discussed in detail in the following non-limiting description of specific embodiments made in connection with the accompanying drawings.

Structure and method of repair of integrated circuits


Suppressor tRNA""s are used to regulate expression of transgenes that are toxic, or the expression thereof requires a factor that is toxic, to the host cell.

The production of desirable genetically engineered products can be less than efficient because the gene product itself or accessory molecules required for the proper production of the genetically engineered product of interest can be toxic to the host cell. For example, the rep proteins of adeno-associated virus (AAV), which are necessary for the integration and replication of the AAV genome in the host cell, often are toxic to the host cell and to, for example, the helper adenovirus.
Other examples of gene products which are used commonly in the art of genetic engineering and which are toxic to host cells are the E4 ORF6 protein of adenovirus, the VSV-G gene product of vesicular stomatitis virus and the HIV tat gene product.
The first object of the instant invention is to provide a method for expressing a recombinant gene product in a host cell under conditions that minimize exposure of the host cell to any foreign elements or products thereof, whether endogenous or not, that may be toxic to that host cell. The method relies on the use of a termination codon introduced into the coding sequence of a gene encoding a toxic protein and a sufficient amount of complementing suppressor tRNA""s to overcome the presence of the termination codon engineered into the coding sequence of the gene encoding the toxic gene product, as well as releasing factors, termination factors and so on that normally interact with termination codons, to regulate expression of the toxic gene product. The toxic protein may be the product of interest or may be a protein required for efficient expression of the desired gene product of interest. The genes coding for the molecules that are toxic to the host cell are configured to contain one or more termination codons. Multiple toxic proteins can be manipulated in that fashion in a single cell. Also, multiple toxic proteins may be regulated by a single species of suppressor tRNA by introducing a termination codon at the same amino acid residue in the plural toxic proteins. Sufficient amounts of the suppressor tRNA""s are made available in the host cell, for example, by transfecting the host cell with adenoviral vectors carrying the tRNA coding sequence.
Yet another object of the instant invention is to provide a method for minimizing the exposure of a host cell to the toxic adeno-associated virus (AAV) rep and cap proteins by introducing termination codons into the coding sequence of, for example, a rep gene, and using sufficient amounts of complementing suppressor tRNA""s to overcome the presence of the termination mutation and endogenous termination factors, to therefore regulate the expression of that rep gene carrying the termination codon. The suppressor tRNA""s can be targeted to one, two, three or four of the rep proteins. Moreover, the suppressor tRNA""s can be directed to any amino acid codon. A suitable target is serine that appears in all four rep proteins. In that way, only a single species of suppressor tRNA would be required to regulate the expression of the four rep proteins.
Yet another object of the instant invention is to provide specific nucleic acid constructs, cells, vectors and the like for regulating the expression of toxic gene products in a host cell, such as the rep protein in the production of recombinant AAV.
Those and other objects have been achieved by the development of materials and methods for regulating the expression of toxic gene products that limit the establishment and productivity of a host cell in the production of recombinant gene products. For example, termination codons can be engineered into the coding sequence of a gene that encodes a toxic gene product. Then a suppressor tRNA which recognizes the termination codon and carries an aminoacyl group and thus incorporates an amino acid into the growing polypeptide instead of resulting in termination of translation is used. The suppressor tRNA complements the termination mutant and enables translation to occur when expression of the foreign gene product is desired. A suitable target is the rep protein of AAV that is toxic to the host cell. Yet another suitable target is the cap protein of AAV.
The instant method can be applied to regulate a number of genes which encode products which are toxic to host cells and which are commonplace in the art of recombinant nucleic acid technology.

Use of suppressor tRNA""s to regulate cytotoxicity during the production of recombinant gene products


An optical writing head allows the formation of a light collective spot with a small diameter and the acquisition of a deep focal depth to go together. An optical writing head includes a light emitting element array in which a plurality of light emitting elements is arranged, and a lens system including a lens array configured to concentrate luminous flux radiated from the light emitting element to a predetermined image plane, in which the lens system is telecentric on the image side and satisfies the following conditional expression, where a wavelength at which luminous flux radiated from the light emitting element has a peak light intensity is λ0, axial chromatic aberration of a wavelength having a light intensity approximately 0.81 times the peak light intensity is Δsk, and the numerical aperture of the lens system on the image side is NA.

1. Field of the Invention
Embodiments of the present invention relate to an optical writing head and an image forming apparatus and, in particular, to an optical writing head which is used for an electrophotographic copying machine, a printer, and a facsimile machine and forms an imaging spot by a lens array projecting beams from a plurality of light emitting elements onto a light receiving surface and an image forming apparatus using the optical writing head.
2. Description of the Related Art
Until now, an optical writing head used for electrophotographic copying machine and other devices includes a light emitting element array in which a plurality of light emitting elements such as a light emitting diode (LED) is arranged, and a lens array in which a plurality of lenses is arranged in parallel between photosensitive drums which are image carriers.
Luminous flux modulated according to an image signal is emitted from a light emitting element and concentrated by the lens array at the surface of the photosensitive drum in a spot shape to record an image.
Such an optical writing head is required to perform higher-definition printing.
The photosensitive drum is cylindrical and is rotated around the axis of the cylinder as a rotation axis. The rotation axis deviates from the center axis of the photosensitive drum due to a production error and an installation error at the time of assembly.
For this reason, an image plane moves back and forth in the optical-axis direction according to the rotation of the photosensitive drum. As a result, a spot position and a spot diameter formed on the surface of the photosensitive drum are varied according to the rotation of the photosensitive drum, which produces uneven density and color change on the recorded image.
Hitherto, U.S. Patent Application Publication US2009/0086328A1 discusses a unit capable of reducing a change in a spot position caused by an image plane moving back and forth in the optical-axis direction by making an image side of a lens array telecentric. According to such a configuration, a principal ray is parallel to the optical axis, so that a change in a spot position is smaller even if the image plane moves back and forth and a change in a spot diameter may be reduced within the focal depth of the lens array.
In order for a conventional method to perform a higher-definition printing, it is required to increase the numerical aperture on the image side (image-side NA) and form a light collective spot to be small in diameter on the surface of a photosensitive drum.
On the other hand, the increase of the image-side NA of the lens array decreases the focal depth of the lens array, which narrows the tolerance of a change in position of the image plane.
Thus, in order to perform a higher-definition printing, the photosensitive drum needs to be accurately installed at the time of production and assembly. This increases the cost of an optical writing head and a photosensitive drum.
Accordingly, the above situation demands an optical writing head in which a light collective spot of a small diameter and a deep focal depth go together.

Optical writing head and image forming apparatus

Abstract: Δ    sk    >                    λ        0            2                  1                        NA                                (                          λ              0                        )                          2


A controlled release liquid urea formaldehyde fertilizer which has a nitrogen level at least 31% and its method of manufacture.

1. Field of the Invention
The invention relates to a controlled release liquid urea-formaldehyde fertilizer which has a nitrogen level greater than about 31%.
2. Description of Related Art
Urea-formaldehyde based liquid fertilizers have been used for some time to provide nitrogen to the soil. It is desirable that such fertilizers be stable and provide a steady, evenly supplied, amount of nitrogen.
In the past, long term stability of high nitrogen (around 30%) liquid urea-formaldehyde fertilizers was achieved by forming either a high percentage (more than 30%) of cyclic triazone structures or by condensing the urea-formaldehyde resin into small urea-formaldehyde polymer chains.
Several patents issued to Hawkins describe the preparation of urea-formaldehyde resins having high triazone contents. U.S. Pat. No. 4,554,005 describes a reaction that produces at least about 30% triazone and has a preferred urea, formaldehyde, ammonia ratio of 1.2/1.0/0.28. U.S. Pat. No. 4,599,102 describes a reaction that produces at least about 30% triazone and has a urea, formaldehyde, ammonia ratio of 1.2/1.0/0.5. Both of these resins have a high percentage of ammonia. U.S. Pat. No. 4776,879 describes a reaction that produces at least about 75% triazone in water insoluble forms. This material is then crystallized out and re-dissolved at low solids levels for use. U.S. Pat. No. 4,778,510 describes a reaction that produces at least about 48% triazone. Nitrogen release from triazone is extremely slow, therefore, methylolated urea is preferred. The nitrogen is the useful part of the fertilizer to the plant and thus the higher the % of nitrogen, the more efficient the fertilizer.
Other patents describe condensing the resin into small chains. U.S. Pat. No. 4,781,749 to Moore reacts 1.5 to 2.5 mols formaldehyde per mole of urea in the presence of ammonium compounds such as ammonia. This initial mole ratio is below the initial mole ratio of 5 to 4 mols formaldehyde per mole of urea of the present invention. The pH is maintained at near neutral conditions (6.9-8.5) throughout the reaction. Condensed UF chains have lower solubility than methylolated ureas and could continue to advance, leading to extremely slow release.
U.S. Pat. No. 3,970,625 to Moore et al. describes a process for preparing urea-formaldehyde concentrates for use as slow release fertilizers or as adhesives. Urea and formaldehyde are mixed in a molar ratio of 1/4.4-7.3 with no more than 0.015 wt. % of ammonia present in the urea. The pH is adjusted to 8.8-9.5 and the mixture is heated to 50-60xc2x0 C. for 30-60 minutes. Thereafter, water is removed by distillation under reduced pressure until solids comprise 60-90% of the remaining residue. For producing fertilizers, the residue is heated for another 48 hours at a temperature of 45-50xc2x0 C.
U.S. Pat. No. 5,449,394 to Moore relates to liquid non-polymeric controlled-release nitrogen plant food compositions containing the condensation products of one part ammonia, two parts urea and three parts formaldehyde at a base buffered pH slightly above 7. The reaction is accomplished at a temperature of about 100xc2x0 C. for 30-300 minutes. Water may be removed by evaporation until the nitrogen content of the formulation is between 20 and 30%. The solution is cooled before polymerization producing chains of more than 3 urea moieties can occur.
It is desirable to have a method of making a stable urea-formaldehyde resin suitable for fertilizer use that uses significantly less triazone and no condensation, and has a higher nitrogen concentration.
The invention describes a method of making a stable urea-formaldehyde resin suitable for fertilizer use which uses significantly less triazone than the Hawkins"" process and no condensation reaction like the Moore processes, has a high nitrogen concentration, and yet is very stable, for instance, for at least two months at 25xc2x0 C.
In particular, the invention is directed to a urea-formaldehyde resin prepared by the method comprising:
1) combining formaldehyde, urea, and ammonia in a basic solution at a formaldehyde/urea/ammonia ratio of about 5.4-3.6/1/0.45-0.65;
2) heating the solution to about 85 to about 95xc2x0 C., and holding to ensure triazone formation;
3) cooling the solution to less than about 50xc2x0 C., and adjusting the pH to about 9.5 to about 10.5;
4) adding sufficient urea and ammonia to the solution to change the ratios to about 1.1-0.6/1/0.11-0.08;
5) reheating the solution to about 80xc2x0 C. to about reflux, at a pH of between about 9 and about 11, for about 1 to about 2.5 hours; and
6) post charging urea to bring the mole ratio to about 0.9-0.6/1/0.1-0.08;
wherein the nitrogen content of the resin is at least about 31% based on 100% resin solids.
The present invention is directed to a controlled release liquid urea formaldehyde fertilizer prepared from a solution prepared by the reaction of formaldehyde, urea, and ammonia and having a nitrogen level at least about 31% and a final mole ratio of formaldehyde:urea:ammonia of about 0.9-0.6:1:0.1-0.08.
In accordance with the process of the present invention:
1) Formaldehyde, urea, and ammonia are combined in a basic solution at a formaldehyde/urea/ammonia ratio of about 5.4-3.6/1/0.45-0.65, preferably about 5.0-4.0/1/0.5-0.6, and most preferably about 4.8/1/0.54. The pH level of the basic solution is preferably about 7.5 to about 9.5, more preferably about 8 to about 8.6.
2) The solution is heated to about 85 to about 95xc2x0 C., preferably about 88 to about 92, and held for about 10 to about 30 minutes, preferably about 15 to about 20 minutes, to ensure triazone formation.
3) The solution is cooled to less than about 50xc2x0 C., preferably about 35 to about 45, and the pH is adjusted to about 9.5 to about 10.5, preferably about 9.8 to about 10.4.
4) Sufficient urea and ammonia are added to the solution to change the ratios to about 1.1-0.6/1/0.11-0.08, preferably about 1-0.7/1/0.1-0.09, and most preferably about 0.7/1/0.09.
5) The solution is reheated to about 80xc2x0 C. to about reflux, preferably about 85 to about 95xc2x0 C. at a pH of between about 9 and about 11, preferably about 9.5 to about 10.5 for about 1 to about 2.5 hours, preferably about 2 hours.
6) Urea is post charged to bring the mole ratio to 0.9-0.6/1/0.1-0.08.
The process of the invention provides triazone amounts of less than about 22 weight % based on 100% resin solids.
The pH may be maintained or adjusted by adding a compound, such as triethanolamine, borax, sodium or potassium bicarbonate, or sodium or potassium carbonate, preferably triethanolamine, at the start of the batch that will buffer the pH of the batch at the desired pH level. Alternatively, the pH may be maintained by any suitable base which is added during the reaction. While any base can be used to increase the pH of the reaction mix, preferably alkali metal hydroxides are used such as potassium hydroxide, lithium hydroxide, and sodium hydroxide.
Skilled practitioners recognize that the reactants are commercially available in many forms. Any form which can react with the other reactants and which does not introduce extraneous moieties deleterious to the desired reaction and reaction product can be used in the preparation of the urea-formaldehyde resin of the invention.
Formaldehyde is available in many forms. Paraform (solid, polymerized formaldehyde) and formalin solutions (aqueous solutions of formaldehyde, sometimes with methanol, in 37 percent, 44 percent, or 50 percent formaldehyde concentrations) are commonly used forms. Formaldehyde also is available as a gas. Any of these forms is suitable for use in the practice of the invention. Typically, formalin solutions are preferred as the formaldehyde source. In addition, formaldehyde may be substituted in part or in whole with substituted aldehydes such as acetaldehyde and or propylaldehyde. Glyxal may also be used in place of formaldehyde as may other aldehydes not listed. It is to be recognized that the aldehyde is dissolved (solubilized) in water or other appropriate non-reactive organic of any desired or conventional nature, known in the art.
Similarly, urea is available in many forms. Solid urea, such as prill, and urea solutions, typically aqueous solutions, are commonly available. Further, urea may be combined with another moiety, most typically formaldehyde and urea-formaldehyde, often in aqueous solution. Any form of urea or urea in combination with formaldehyde is suitable for use in the practice of the invention. Both urea prill and combined urea formaldehyde products are preferred, such as Urea Formaldehyde Concentrate or UFC 85. These types of products are disclosed in, for example, U.S. Pat. Nos. 5,362,842 and 5,389,716.
Commercially-available aqueous formaldehyde and urea-containing solutions are preferred. Such solutions typically contain between about 10 and 35 percent formaldehyde and urea.
A solution having 35% ammonia can be used providing stability and control problems can be overcome. An aqueous solution containing about 28 percent ammonia is particularly preferred. Anhydrous ammonia may also be used.
In substitution in part or in whole, for the ammonia, any primary amine or substituted primary amine may be used such as methyl amine, monomethanol amine, amino propanol and the like. Further, difunctional amines may be used such and ethylene diamine or any combination of organic amines provided that one primary amine group is available to form the triazone ring. The reaction rates are much faster and more straight forward. Another reactant of interest is sodium sulfamate to make the cyclic urea sulfonate.
In a preferred embodiment of the invention, the urea-formaldehyde liquid fertilizer resins have a free urea content of 30-47%, a cyclic urea content of 15-22%, a monomethylol urea content of 6-12% and a di/trimethylurea content of 25-36% based on the urea-formaldehyde resin and, based on a 60-70% urea solution, a free urea content of 20-31%, a cyclic urea content of 9.9-14.5%, a monomethylol urea content of 4-8% and a di/trimethylurea content of 16-23% wherein the rest of the solution is composed of water, ammonia, and formaldehyde.
The urea-formaldehyde liquid resin of the invention may then be used as a fertilizer. Other additives may be mixed into the liquid fertilizer prior to use such as any of a wide variety of well-known inorganic fertilizer nutrients based on phosphorous and potassium. Pesticides may also be mixed in, e.g., to control weeds and kill insect larvae. Suitable additives are within the skill of the art.
The following examples are for purposes of illustration and are not intended to limit the scope of the claimed invention.

Controlled release urea-formaldehyde liquid fertilizer resins with high nitrogen levels


An amorphous electrochromic film prepared by vacuum evaporation under relatively high pressure of 2.times.10.sup.-4 -2.times.10.sup.-3 torr.. The evaporated film is porous with packing density less than 0.65 and exhibits excellent reversibility after heat treatment at 250.degree. C.-350.degree. C. whereby it is optimum for an electrochromic device sealed with a sealant of tetrafluoroethylene-ethylene copolymer having no reactivity with electrolyte, low moisture permeability, excellent chemical properties and good adhesiveness.

1. Field of the Invention
The present invention relates to a method for forming an electrochromic film and an electrochromic device using the same. More particularly, it relates to a method for forming an electrochromic film exhibits excellent reversibility after heat-treatment.
2. Description of the Prior Arts
An electrochromic device is prepared by facing a pair of substrate (1) having an amorphous electrochromic film (3) such as tungsten or molybdenum oxide film and a transparent electrode (2) made of tin oxide etc., and sealing them with a sealant (4) and filling an electrolyte (5) containing ions such as Li.sup.+ and H.sup.+ which colors the electrochromic films, as shown in FIG. 1. If necessary, a pigment such as TiO.sub.2 powder or a thin porous separator made of Al.sub.2 O.sub.3 is incorporated in the electrolyte.
The electrolytes used in the electrochromic device highly affects to reliability of the electrochromic device. Various electrolytes have been proposed. In view of long life of the electrochromic device, it has been well known to use an electrolyte prepared by dissolving LiClO.sub.4 in an organic solvent such as propylenecarbonate, and acetonitrile at a concentration of 1 mole/liter in U.S. Pat. Nos. 3,521,941; 3,708,220; 3,978,007 and 4,059,341.
The sealant for sealing such electrolyte is significantly important to highly affect to the reliability of the electrochromic device as well as the electrolyte. The required characteristics for the sealant include high bonding strength, low moisture permeability, chemical resistance to the electrolyte used and low sealing temperature. The sealing temperature is dependent upon the characteristics of the electrochromic film. The amorphous WO.sub.3 may lose its significant electrochromic characteristic by a heat-treatment at a temperature higher than 300.degree. C. even though it has been used.
Heretofore, amorphous WO.sub.3, and MoO.sub.3 have been used as the electrochromic film. Recently, V.sub.2 O.sub.5 have been known as the electrochromic film. Among them, the WO.sub.3 film has been widely studied and its electrochromic characteristic has been studied in detail.
It has been known to prepare a WO.sub.3 film by a spraying method, a vacuum evaporation method and a sputtering method. Because of low heat resistance of WO.sub.3, the electrochromic characteristic is lost when the temperature of the substrate in the formation of film is too high such as higher than about 320.degree. C. in the spraying method and higher than about 300.degree. C. in the vacuum evaporation method.
In the heat treatment of the resulting electrofilm, it has been known to substantially lose the electrochromic characteristic by heating it at about 300.degree. C. (H. R. Zeller and H. U. Beyeler, Electrochromism and Local Order in Amorphous WO.sub.3 ; Applied Physics Vol. 13, page 231-237 (1977)).
In the sputtering method, the characteristic of the resulting film is not stable. The authors have reported various films such as a film having no electrochromic characteristic and a film being similar to the film obtained by the vacuum evaporation method. These WO.sub.3 films concern to its heat resistance or non-stability.
Accordingly, a glass frit having high reliability which has been used in a liquid crystal device can not be used when the amorphous WO.sub.3 is used.
On the other hand, a sealant having lower sealing temperature range such as an epoxy sealand has not been enough to give reliability after sealing the electrolyte. Accordingly, the inventors have proposed an electrochromic device which is sealed with a sealant made of an ethylene-tetrafluoroethylene copolymer (Japanese Patent Application 6721/1978; filing date of Jan. 26, 1978). The temperature in the heat-treatment is ranging from 250.degree. C. to 350.degree. C. which causes to lose the electrochromic characteristic of the conventional amorphous WO.sub.3.


The present disclosure provides a display screen, a terminal display screen assembly, and a mobile terminal. The display screen defines a first through hole which penetrates the display screen in a thickness direction of the display screen, and may include: a frame, a display module and a positioning structure. The frame may include a first face and a second face opposite to the first face. The display module may be arranged on the first face of the frame. The positioning structure may be arranged on the second face of the frame. The first through hole may include a first sub-through hole defined in the display module and penetrating the display module in a thickness direction of the display module, and a second sub-through hole defined in the frame and penetrating the frame in a thickness direction of the frame and communicating to the first sub-through hole. The positioning structure is disposed to surround the second sub-through hole.

With the development of communication technologies, mobile terminals such as smart phones are becoming more and more popular. People use the mobile terminal such as taking pictures, chatting, playing games. Because more and more mobile terminal functions are required, more and more devices are mounted inside the mobile terminal. In particular, the more and more devices are mounted on one side of the mobile terminal where a screen is mounted. Therefore, in a case when a size of the mobile terminal does not change, a display area of a display screen is often sacrificed, so that the display area of the display screen becomes smaller.

Display screen, terminal display screen assembly, and mobile terminal

GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.


A plastic pipe seal for dual wall plastic pipe includes a plastic single piece or multi-piece fitting formed of rigid plastic sheet. At each inlet to the fitting, two formed grooves are radial to the line of flow through the fitting. The groove closest to the fitting inlet mates with a corresponding groove on the pipe, which groove receives a mechanical retainer. A second radial groove spaced from the retaining groove holds a gasket sealing device which provides a seal between the inside of the fitting and the outside diameter of the pipe. The retainer can be an extruded or molded plastic or metal spring cut to appropriate size, or a dual durometer structure, which allows for compression to a solid retainer.

Heretofore compensation for expansion and contraction due to temperature changes within plastic piping systems has been accomplished by using expansion joints or offset loops. While these techniques are acceptable for use in single wall piping systems, with the advent of "double wall piping" systems (i.e., double containment or dual containment piping), compensation for material expansion and contraction has required other solutions. Ziu U.S. Pat. No. 4,786,088, describes the use of restraint couplings for controlling expansion and contraction in double wall piping systems of similar materials. This system is unsuitable for dissimilar materials due to a lack of acceptable joining techniques. Other systems by Plexco (Chevron), George Fisher, and Asahi (as well as Ziu) recommend the use of expansion loops which are both costly and inadequately address the problem of expansion of dissimilar materials.
Standard bellows or piston type expansion joints are not suitable for double wall piping systems due to space limitations of the containment or outer pipe.

Containment piping system with expansion seal


An absorbent article for disposable use having at least one pattern (118) in the form of a text, image or the like. A background layer (146) and at least one intermediate layer (147) are arranged behind the pattern (118), in conjunction with which the intermediate layer or layers (147) exhibits or exhibit a first, essentially transparent state, and in conjunction with which the intermediate layer or layers (147) is or are transformed into a second, more opaque state when it or they is or are stretched.

In the case of absorbent articles such as diapers, sanitary towels, incontinence protection, etc., the application of patterns in the form of texts, images, symbols or the like to certain layers included in the article is previously disclosed. Combinations comprising at least two of the pattern forms are also encountered. The texts and the symbols are preferably of an informative nature, for example in the form of a user instruction, a warning text or product information such as a size indication. The images are preferably in the form of decorative patterns, product information or user instructions. Patterns in the form of trademarks and/or company logotypes are also commonly encountered.
The pattern is usually arranged on one of the layers that forms the outside of the article when it is used, for example on the front or the rear end part of the article, on fastening tabs or on a side panel. It is especially common for the pattern to be arranged on the outside of the article on or close to the waist area of the article.
The pattern sometimes relates to instructions in respect of how the article must be applied to the wearer, the suitable article size for a certain body weight and the like.
Such patterns are commonly positioned together with other types of pattern such as a distinctive product mark, purely decorative patterns, positioning indicators for example for attachment flaps, indicators to show which end of the article must be positioned towards the front on the wearer, and so on.
The articles thus comprise different types of patterns, some intended to inform the user about handling the article, some simply intended to make the article more visually attractive, and some intended to warn of incorrect handling.
Certain patterns, intended to warn of incorrect handling which may be associated with a risk, such as a warning of the risk of suffocation if a child places a baby's diaper over its head, must naturally be capable of being read by a parent before the incorrect handling occurs.
Certain other patterns inform of less serious incorrect handling, such as information to the effect that the size of the article is incorrect in relation to the body size of the wearer, that the attachment flaps have been tightened too tightly around the wearer's waist or the like. This type of information does not need to be made visible until the incorrect use has taken place, in conjunction with which the incorrect use can be corrected directly or on the next occasion that an absorbent article is changed on the wearer, or even on the next occasion on which new absorbent articles are purchased.
Indicators for demonstrating the excessive stretching of a layer of material are described in PCT document WO 96/31175. The document describes a layer of material comprising a pattern consisting of curved lines when the layer of material is not stretched. The curved lines face in the intended direction of stretching. When the layer of material is stretched, the radii of curvature of the lines increase, in conjunction with which the initially curved lines become straighter, in conjunction with which the curvature of the lines gives an indication of by how much the layer of material has been stretched.
One disadvantage associated with the solution in WO 96/31175 is that the curved lines, regardless of whether or not overstretching has occurred, are always visible on the absorbent article. Patterns which are always visible on the absorbent article must naturally exhibit a certain degree of harmony with other patterns on the article, for which reason the warning signal cannot be executed sufficiently clearly and distinctly. A very clear and distinct warning signal runs the risk of dominating the pattern of the article in relation to other patterns that it is wished to emphasize on the article.
Another disadvantage is that the user must understand the symbols in the form of curved lines, and must also understand what it means when the curvature of the initially curved lines is changed and the level of change at which excessively high stretching of the layer of material has been reached.
If the layer of material is elastic, or if the layer of material is attached to an elastic layer of material, a third problem arises because the curvature of the curved lines essentially reverts to the original curvature when stretching of the layer of material ceases. This means that it is not possible to perform a verification in order, for example, to investigate whether the absorbent article has been tightened too tightly around the wearer's waist.

Absorbent article comprising one or several patterns


An inclining toilet-seat lift is an apparatus that aids and supports a user while transitioning from a standing position to a sitting position, and vice versa, in order to relieve himself or herself. The apparatus includes a U-shaped base, a plurality of supporting legs, a platform, a posterior-bracing plate, an excrement-receiving hole, and a lifting mechanism. The U-shaped base upholds the plurality of supporting legs and the lifting mechanism. The plurality of supporting legs upholds the platform and the posterior-bracing plate. The platform supports and mounts the posterior-bracing plate, which rotates about a first edge of the platform and supports a user as the user sits down and stands up. The excrement-receiving hole allows a toilet or a bucket to collect excrement without the excrement coming into contact with the platform and the posterior-bracing plate. The lifting mechanism lowers and raises the posterior-bracing plate onto and from the platform.

Everyday tasks can be extremely challenging and sometimes fatal as a person ages. Such tasks included walking, taking the stairs, getting into and out of cars, and so on. One everyday task that can be extremely dangerous due to the number of surfaces of which an elderly person may hit his or her head on is using the restroom. More specifically, using a toilet can be extremely difficult and dangerous as an elderly person has to switch from a standing position to a sitting position, and vice versa. This transition affects the balance of the elderly person and strains the legs and knees of the elderly person. If an elderly person falls while attempting to sit on or get up from a toilet, the elderly person may easily hit his or her head against the toilet, a nearby sink, and so on.
The present invention supports and guides a user as the user attempts to relieve himself or herself. The present invention is compatible with existing toilets and is able to effectively collect the excrement of the user. The user is preferably an elderly person who may need aid while attempting to use a toilet. However, the present invention may assist anyone who is having difficulty switching from a standing position to a sitting position, and vice versa. The present invention provides a reliable stable surface that supports the user while transitioning between positions. The present invention may be used with a toilet or standalone with a bucket.


A fiber optic network architecture for distributing service to local subscribers is disclosed. The architecture includes a plurality of high-fiber count cables connected end-to-end at connectorized coupling locations to form a main cable trunk. The connectorized coupling locations include high-fiber count pass-through connections for optically connecting optical fibers of adjacent ones of the high-fiber count cables end. The connectorized coupling locations also including high-fiber count branch connections for optically connecting optical fibers of the high-fiber count cables to branch locations.

Fiber optic telecommunications technology has continued to expand as service providers strive to deliver higher bandwidth communication capabilities to customers/subscribers. The phrase "fiber to the x" (FTTX) generically refers to any network architecture that uses optical fiber in place of copper within a local distribution area. Example FTTX networks include fiber-to-the-node (FTTN) networks, fiber-to-the-curb (FTTC) networks and fiber-to-the-premises (FTTP) networks.
FTTN and FTTC networks use fiber optic cables that are run from a service provider's central office to a cabinet serving a neighborhood. Subscribers connect to the cabinet using traditional copper cable technology such as coaxial cable or twisted pair wiring. The difference between an FTTN network and an FTTC network relates to the area served by the cabinet. Typically, FTTC networks typically have cabinets closer to the subscribers that serve a smaller subscriber area than the cabinets of FTTN networks.
In an FTTP network, fiber optic cables are run from a service provider's central office all the way to the subscriber's premises. Example FTTP networks include fiber-to-the-home (FTTH) networks and fiber-to-the-building (FTTB) networks. In an FTTB network, optical fiber is routed from the central office over an optical distribution network to an optical network terminal (ONT) located in a building. The ONT typically includes active components that convert the optical signals into electrical signals in one direction and convert electrical signals to optical signals in the opposite direction. The electrical signals are typically routed from the ONT to the subscriber's residence or office space using traditional copper cable technology. In an FTTH network, fiber optic cable is run from the service provider's central office to an ONT located at the subscriber's residence or office space. Once again, at the ONT, optical signals are typically converted into electrical signals for use with the subscriber's devices. However, to the extent that an end user may have devices that are compatible with optical signals, conversion of the optical signals to electrical signals may not be necessary.
A typical passive FTTP network includes fiber optic cables routed from a central location (e.g., a service provider's central office) to a fiber distribution hub (FDH) located in a local area such as a neighborhood. The fiber distribution hub typically includes a cabinet in which one or more passive optical splitters are mounted. The splitters each are capable of splitting a signal carried by a single fiber to a plurality of fibers. A network of cables can be routed outwardly from the fiber distribution hub to subscriber locations. For example, fiber optic cables can be routed from the fiber distribution hub to drop terminals (i.e., multi-service terminals), and drop cables can be routed from the drop terminals to subscriber locations.

Fiber optic network architecture using high fiber-count fiber optic connectors


In a method for manufacturing ophthalmic, telescopic, microscopic, etc. lenses, the use of a radiation (e.g., UV or visible light) curable adhesive formulation containing a predominant amount of an acrylic capped organic prepolymer; a lesser amount of an ethylenically unsaturated diluent monomer; a minor amount of a non-reactive releasing agent and a suitable photoinitiator for blocking (bonding) and deblocking (debonding) a lens blank to a support member.

Various methods and means have been employed to mount individual lens blanks in a blocking tool which can be detachably connected to a spindle of an abrading machine in order to generate, grind and polish a surface on the lens. Conventional procedures utilized heretofore have employed a blocking pitch or wax to adhere the lens blank to the block so that the same may be processed. Such pitches have tended to be considered more or less trade secrets in the optical industry and have varied in accordance with the type of lens and glass composition to be ground, as well as the methodology and apparatus employed in the grinding process itself. Among other things, however, conventional pitches are known to include such materials as asphalt, coal tar, pine tar, rosin, beeswax, paraffin, shellac, turpentine, etc. in different proportions. Such pitches required considerable cooking and processing whereby cooking time and/or turpentine content was varied to alter the consistency or "temper" of the pitch, particularly with respect to its flow characteristics under processing conditions. Early forms of pitch had considerable flow at temperatures of over 90-95.degree. F. Since such temperatures are typically attained in grinding processes employing fast grinding speeds and/or significant pressure at the interface of the lens blank and the grinding element itself, more advanced, higher temperature pitches were ultimately formulated. Such pitches now attain flow temperatures of 140-200.degree. F., and higher.
While higher temperature pitches tend to allow for faster processing speeds and grinding pressures, they inherently transfer some of this heat to the lens blank during the bonding step creating thermal gradients within the glass resulting in lens "springing" or warpage. This warpage is particularly noted and magnified in lens geometries having a diameter-to-center thickness ratios (i.e., aspect ratios) exceeding 10:1. In addition to the difficulties associated with the thermal gradients induced by such pitches, it has been found that as pitches having greater adherent capabilities were produced, it became increasingly difficult, if not impossible, to remove the finished lens from the block without damaging the lens itself due to the strength of the bond provided by the pitch. Attempts to lessen the tenacity of the pitch generally resulted in a substantial number of lenses parting from blocks during the abrading process causing irreparable damage to the lenses. Although these detriments could be overcome by further modifying the natural pitches, the so modified pitches tended to produce various other defects in the lenses such as staining, scratching and striping.
Initial efforts to overcome the difficulties associated with the use of natural pitches focused on synthetic thermoplastic resins and cellulose derivative compositions (Hicks U.S. Pat. No. 2,434,614), as well as combinations of a selectively soluble resinous material such as polyvinylacetate in conjunction with low melting point fusible alloys (Cox et al. U.S. Pat. No. 3,404,488). Furthermore, Dent et al. (U.S. Pat. No. 4,619,082) taught the use of molten waxes in conjunction with a lens blank holder for providing added support and alignment precision in the lens manufacturing process. Such molten waxes generally had melt temperatures in the range of 60-70.degree. C.
While these latter improvements overcame some of the difficulties with the use of natural pitches, most notably the inconsistency in adhesive strength, the environmentally undesirable solvents and solutions necessary for fully removing and cleaning the pitch from the lens piece after deblocking, as well as the staining and striping noted with the use of pitches, such improved processes still subjected the lens element to thermal gradients during the blocking and deblocking processes. Furthermore, they still have the detriment of comparatively long setting time from the time at which the lens is seated on the block element and the time to which the molten adherent is sufficiently cooled to allow processing of the lens blank element.
In view of the foregoing, there continues to be a strong need and desire for the identification and development of other adhesive materials which may be used in the blocking and deblocking of lens blanks and lenses. In this respect, room temperature-hardenable adhesives, cyanoacrylate-type adhesives and two-part adhesives have been evaluated. Of these, room temperature-hardenable adhesives typically rely upon some environmental factor, most notably moisture, to initiate and bring about cure. Because these environmental factors are not readily controllable, at least not without difficulty and costly equipment, such compositions are not suitable for use as a lens blocking adhesive as there would be very little, if any, control of cure speed and bond strength. On the other hand, while cyanoacrylate-type adhesives cure instantly, because of the instant curability there is little if any time available in which to adjust the lens blank on the block element before the adhesive has fully bonded. Consequently, if the lens blank is not positioned accurately and correctly to begin with, the lens must be removed from the block element and reseated, perhaps repeatedly, until it is seated correctly. Furthermore, this type of adhesive exhibits excessively high bonding forces requiring longer deblocking times. Finally, as with any two-part adhesive, since, by definition, they require the mixing of two components to initiate cure, (which in itself is subject to variation and consequently performance variation), once the materials are mixed they must be used within a relatively short period of time due to their limited pot life. Although the pot life can be extended, it is done so at the expense of cure speed.


A method of in situ control for finishing semiconductor wafers to improve cost of ownership is discussed. A method to use business calculations combined with physical measurements to improve control. The use of boundary lubricating layer control in the operative finishing interface and business calculations to improve the cost of finishing semiconductor wafers is discussed. The method aids control of differential lubricating boundary layers and improved differential finishing of semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.

Chemical mechanical polishing (CMP) is generally known in the art. For example U.S. Pat. No. 5,177,908 issued to Tuttle in 1993 describes a finishing element for semiconductor wafers, having a face shaped to provide a constant, or nearly constant, surface contact rate to a workpiece such as a semiconductor wafer in order to effect improved planarity of the workpiece. U.S. Pat. No. 5,234,867 issued 867 to Schultz et. al. in 1993 describes an apparatus for planarizing semiconductor wafers which in a preferred form includes a rotatable platen for polishing a surface of the semiconductor wafer where a motor for rotating the platen and a non-circular pad is mounted atop the platen to engage and polish the surface of the semiconductor wafer. Fixed abrasive finishing elements are also known for polishing semiconductor layers. An example is WO 98118159 PCT application by Minnesota Mining and Manufacturing.
Semiconductor wafer fabrication generally requires the formation of layers of material having particularly small thicknesses. A typical conductor layer, such as a metallization layer, is generally 2,000 to 6,000 angstroms thick and a typical insulating layer, for example an oxide layer, is generally 3,000 to 5,000 angstroms thick. The actual thickness is at least partially dependent on the function of the layer along with the function and design of the semiconductor wafer. A gate oxide layer can be less than 100 angstroms thick while a field oxide is in the thousands of angstroms in thickness. In higher density and higher value semiconductor wafers the layers can be below 500 angstroms in thickness. Generally during semiconductor fabrication, layers thicker than necessary are formed and then thinned down to the required tolerances with techniques needed such as Chemical Mechanical Polishing. Because of the strict tolerances, extreme care is given to attaining the required thinned down tolerances. As such, it is important to accurately control the thinning of the layer during the thinning process and also as it reaches the required tolerances. The end point for the thinning or polishing operation is the final required tolerances. One current method to remove selected amounts of material is to remove the semiconductor wafer periodically from polishing for measurements such as thickness layer measurements. Although this can be done it is time consuming and adds extra expense to the operation. Further the expensive wafers can be damaged during transfer to or from the measurement process further decreasing process yields and increasing costs. Further, merely controlling finishing in a manner that stops polishing at the endpoint, misses the important aspect of controlling the polishing process itself where defects such as microscratches and other unwanted surface defects can occur. In fact, microscratches which are deep enough to penetrate the target surface can occur before the target surface depth is reached causing lower yields and lost product. Microscratches and other unwanted surface defects formed during polishing can adversely lower the polishing yield adding unnecessary expense to the polishing step in semiconductor wafer manufacture.
Confidential applicant evaluations show that the control of the finishing step is very complex. The chemical mechanical finishing step has multiple process control parameters. The manufacturing cost for the chemical mechanical finishing step is also complex. To effectively evaluate the cost of manufacture for a chemical mechanical finishing step requires the evaluation of multiple variables, and each with varying effects on the cost of manufacture. Further, some of the variables compete against each other. For instance, a higher finishing rate can lower some aspects of the cost of manufacture such as fixed costs but can also increase other aspects, such as reducing yields. Thus there is a need to evaluate in real time the effects on the cost of manufacture. Confidential analysis shows that there are some particularly preferred parameters of the cost of manufacture to use for real time process control of chemical mechanical polishing. Tracking the semiconductor wafer as it undergoes multiple polishing steps to update and change the manufacturing cost model used for effective cost control is unknown.
As discussed above, there is a need for an in situ control for a chemical mechanical polishing method which improves the cost of manufacture for a polishing step. There is a need for chemical mechanical polishing method which controls the operative finishing interface during polishing using a cost of manufacture model. There is a need for a cost of manufacture model which tracks the semiconductor wafer during its various polishing steps and uses a cost of manufacture model appropriate to that individual polishing step. There is a need for sensors which monitor the operative finishing interface in a manner that improves the ability to control and improve the cost of manufacture for a particular polishing step.
It is an advantage of this invention to develop is in an situ control subsystem which improves the cost of manufacture for a polishing step. It is an advantage of this invention to develop a finishing method which improves control of the operative finishing interface during polishing using a cost of manufacture model. It is an advantage of this invention to develop a method to use metrics related to cost of manufacture to improve control of the semiconductor wafer cost during its various polishing steps and to use this control to improve the manufacturing cost in situ at one or more individual finishing steps. It is an advantage of this invention to develop a preferred method which uses preferred sensors which monitor the operative finishing interface in a manner that improves the ability to control and improve the cost of manufacture for multiple and particular polishing steps.
These and other advantages of the invention will become readily apparent to those of ordinary skill in the art after reading the following disclosure of the invention.


A process capable of commercial scale manufacturing of inexpensive, shaped film products includes placing a mask over a substrate; delivering a film-forming composition through a nozzle to form a raw shape on the substrate; removing the mask; and solidifying the film-forming composition to provide the shaped film product disposed on the substrate. The mask has a delivery surface and an opposite substrate-facing surface and at least one aperture having a design corresponding to the desired shaped film product. The nozzle is disposed in sealing engagement with the delivery surface of the mask to the at least one aperture of the mask during delivery of the film-forming composition.

Film products have a wide variety of uses. These include decorative window decals, plasters, adhesive bandages, and oral strips (both medicated and otherwise).
Conventional production of such integral film products generally involves die-cutting the desired shaped product from film stock. While this production produces inexpensive film stock, die-cutting limits the efficiency and/or variability of final product forming. If the product shape is not completely rectangular or otherwise completely tessellated, the surrounding ladder scrap can produce significant waste. Therefore, products that have costly raw materials are often restricted to square or other completely tessellated shapes to substantially eliminate this expensive waste. This unfortunately prevents the formation of optimal shapes for some uses. Examples of die-cutting medical films include such production techniques are described in Pharmedica Ltd., WO 2012104834 A1, Pinna et al, U.S. Pat. No. 7,612,048 B2, and Smithkline Beecham Corp., WO 2005/009386 A2.
On the other hand, printing—including stencil printing and screen printing—are known processes that are capable of providing irregular shapes on substrates. Generally, the printed materials remain on permanently joined to the substrates, such as printed text and graphics on paper, printed circuits in the electronics industry, and printed designs on clothing and signage. However, such integration of a carrying substrate into a printed element prevents the usage of the printed product separate from the substrate.
What is needed is a process capable of commercial scale manufacturing of inexpensive, film products without the waste of die-cutting and which products are capable of use independent of a supporting structure on which they are formed.

This patent is subject to a terminal disclaimer.

Process for forming a shaped film product


A method of depositing tungsten on a substrate utilizing silicon reduction wherein the process is non-limiting as to the thickness of silicon that may be converted to tungsten. A silicon substrate is provided with at least one area of silicon material having a predetermined thickness and the substrate is exposed to a tungsten hexafluoride gas flow in a chemical vapor deposition environment. By adjusting the WF.sub.6 gas flow rate and the CVD process parameters, such as pressure, temperature and deposition time, the thickness of silicon converted to tungsten can be adjusted in order to convert the entire thickness. A novel structure having a midgap tungsten gate and tungsten source and drain metallized layers is also disclosed.

1. Field of the Invention
This invention generally relates to the deposition of metal layers on a substrate and more particularly to CVD methods for selectively converting silicon to a refractory metal and to MOS semiconductor devices formed thereby.
2. Description of the Prior Art
In the manufacture of semiconductor devices there is a continuing desire to increase device density on the semiconductor chips in order to increase the resulting operating speeds of the device. The tight packing of devices on the chips places a premium on manufacturing techniques to meet the high standards of reliability necessary for such devices. In the manufacture of MOS devices, there has been considerable investigation of the deposition of refractory metals, such as tungsten and molybdenum. Refractory metals have excellent diffusion barrier properties and low contact resistance with silicon.
Presently, selective deposition of tungsten is performed by silicon and hydrogen reduction of tungsten hexafluoride gas. It is well known that tungsten may be deposited by only silicon reduction of tungsten hexafluoride according to the following equation: EQU 2WF.sub.6 +3Si.fwdarw.2W+3SiF.sub.4.uparw.
The prior art has taught, however, that silicon reduction is self-limiting and results in encroachment problems. The addition of hydrogen reduction is used to deposit tungsten in the desired thickness. The hydrogen reduction method, however, also results in severe encroachment problems. In addition, the selectivity in depositing tungsten strictly depends on the predeposition condition of the wafer, deposition chamber design, vacuum capability, the method of heating the substrate, and elaborate bake and purge cycles. Poor reproduceability, slow growth rates at turret temperatures below 400.degree. C. (less than 10 nm per minute), and selectivity breakdown are the major drawbacks of this process. In addition, HF liberated in the hydrogen reduction process etches recess oxide isolation areas of the devices, resulting in penetration of tungsten hexafluoride along the oxide edges. Also, the density of exposed silicon determines the selectivity, therefore reducing the selectivity of the process.
Several prior art methods have been suggested to overcome the above problems in tungsten deposition. In the commonly assigned U.S. patent application Ser. No. 044,262, filed Apr. 30, 1987, the substrate, after being exposed to WF.sub.6 gas to convert a limited thickness of silicon, a subsequent layer of silicon is deposited using a plasma deposition and the wafer is then again exposed to the WF.sub.6 gas. These steps are repeated until the desired thickness of silicon is converted to tungsten. In U.S. Pat. No. 4,595,608, the substrate is periodically removed from the CVD deposition environment and moisture is applied to the areas on which tungsten is not to be deposited. The substrate is then redisposed in the CVD environment. The process uses tungsten and hydrogen reduction.

Method of depositing tungsten on silicon in a non-self-limiting CVD process and semiconductor device manufactured thereby

International Business Machines Corporation


The present invention relates to a system (10) operable to evaluate spasticity in a movable extremity (12). The system (10) comprises a fixation device (14) comprising a first part (14.sub.1) connected via a movable joint (16) to a second part (14.sub.2). The fixation device (14) is operable to fix the movable extremity (12) in such a way that the rotational axis of the fixation device (14) is aligned with the rotational axis of the joint of the movable extremity (12). The system (10) also comprises a moving device (18) operable to move the second part (14.sub.2) with a first, constant velocity (V.sub.1), without any reflex contribution, and with a second, constant velocity (V.sub.2) with reflex contribution. The system (10) also comprises a force sensor (20) operable to measure a first force trace in connection with the first velocity (V.sub.1), and a second force trace in connection with the second velocity (V.sub.2). The system (10) also comprises a processor means (22) connected to the force sensor (20), the processor means (22) is operable to extract a first point (P1) and second maximum point (P2) from the second force trace, and a third point (P3) from the first force trace, which three points (P1-P3) are used to evaluate spasticity.

Spasticity
Spasticity is a classical neurological symptom after brain injury. Simply, spasticity means that the resistance to passive movement in a body part increases, as muscles get stiffer and the normally inhibited stretch reflexes become hyperactive. Spasticity is also velocity dependent, so that a faster passive movement results in greater resistance to movement (Lance, 1980). It is occurs in about one fourth of all stroke patients (Sommerfeld et al, 2004; Watkins et al, 2002). Depending on the severity level it leads to functional impairments, pain, disability and reduced autonomy. Despite our lack of knowledge of the exact mechanisms, spasticity is treated with a variety of physical interventions (e.g. stretching, splinting, orthoses) and medication (e.g., botulinum toxin injections in the muscle, known as "Botox") in the clinical setting. In severe cases surgery may be indicated to help gain the joint range of motion (e.g., in spastic cerebral palsy).
There are (1) non-neural and (ii) neural components which contribute to the increased resistance to passive movement. The non-neural components include: spastic muscle cell atrophy and fibre type transformation (Dietz et at, 1986); reduced sarcomere length and changed muscle and extra cellular viscoelastic properties (O'Dwyer et al, 1996; Singer et al, 2003; Friden and Lieber, 2003; Olsson et al, 2006). Neural components include: reduced stretch reflex thresholds and increased gain of the stretch reflex (Thilmann et al, 1991; Ibrahim et al, 1993; Pierrot-Desseilligny and Burke, 2005; Nielsen et al, 2007).
Clinical Methods
Clinical practice of today lacks effective methods to reduce spasticity. Instruments which can be used for quantification of muscle tone are therefore needed. Clinical measurement of spasticity, by doctors and physical therapists, is today performed in a subjective way using a 5-point rating scale. The limb is manually moved passively, one feels the resistance and thereafter one rates it according to the Modified Ashworth rating scale (Bohannon and Smith, 1987).
The reliability of a diagnosis would increase if the clinical measurement was objective. Treatment and rehabilitation could be better targeted if the diagnosis could separate and estimate the influence of the mechanical muscle components and the neural stretch reflex components.
Experimental Studies
Early experimental studies of both the non-neural and neural components did not examine how these components related to other functional measures (Thilmann et al, 1991; Ibrahim et al, 1993). These studies used electromyography (EMG) to quantify neural activity in spasticity. However, EMG measurements are cumbersome and inter-subject comparisons remain problematic (Katz and Rymer, 1989). More recently some studies have examined the relationship between both non-neural and neural components and clinically assessed function at the ankle (Huang et al, 2006) and in the hand (Kamper et al, 2000+2003). However, these studies used specific in-house equipment (EMG and torque measures) that would be difficult to use routinely in the clinic. In addition, Kamper et al (2003) used local anaesthesia in finger muscles in order to isolate neural contribution to passive movement resistance. This method is therefore not suited as an easy-to-use clinical tool to quantify non-neural and neural contributions to increased passive movement resistance after stroke.
Experimental Studies Using Models
As there are multiple mechanical and neural factors which contribute to the passive movement resistance modelling can aid understanding of how these factors interact (Koo and Mak, 2006; He, 1998). Models have used joint position (He, 1998; Feng and Mak, 1998), EMG (Feng et al, 1999) or torque (Schmit et al, 1999; Koo and Mak, 2006) as input. Studies using joint position during passive movement indicate that posture and muscle length may effect measurements of spasticity (He, 1998) and that decreased stretch reflex thresholds and increased reflex gain may explain reduced movement during the pendulum test in the elbow in spastic patients (Feng and Mak, 1998). The importance of reflex activity was shown by Feng et al (1999) who were able to predict the passive movement trajectory by using EMG as model input. Koo and Mak (2006) performed detailed modelling of mechanical and neural factors effecting passive movement torque. A sensitivity analysis indicated that muscle spindle static gain and motoneuron pool threshold were the most sensitive parameters that could affect the stretch reflex responses of the elbow flexors. This was followed by motoneuron pool gain and spindle dynamic gain. The above results illustrate how mathematical modelling of the neuro-biomechanics at a joint is useful for understanding how mechanical and neural factors change with spasticity. However, none of the above studies investigated how the modelled factors related to function. In general, the modelling was detailed and time consuming making use of such modelling difficult in the clinical setting.
In order to develop an easy-to-use clinical spasticity measurement tool we have therefore developed a new method for separate quantification of non-neural and neural contributions to passive movement resistance. Different resistance characteristics during passive hand movements at different velocities are used to obtain values of non-neural and neural contributions via a mathematical model of the neuro-biomechanics of the human wrist (see Method for details).
The patent document US-A1-2007/0027631 describes an apparatus and method for evaluating a hypertonic condition such as spasticity in a movable extremity. The apparatus includes an accelerometer, a gyroscope, and a sensor adapted for quantifying force or pressure. The apparatus and method make use of a remote device 12 (e.g. see FIG. 5) which has a case 52, a strap 54 coupled to the case 52 so that the remote device 12 can be attached to the limb of a patient (see FIG. 6). An accelerometer 56, a gyroscope 58, and a pressure transducer 60 are mounted and connected on a circuit board 66. Also mounted and connected on the circuit board 66 are the power supply 34 and the electronic circuit devices 64 for processing and transmitting the data signals to the host processor 14.
The patent document WO-A1-2006/102764 describes a method and apparatus that advantageously measures spasticity in a reproducible way. In FIG. 1 an arm 10 is shown in which the elbow (the joint) is bent at an angle A. A joint angle sensing device such as a goniometer 12 is attached to the arm to provide angle measurements and muscle activity is monitored by an EMG 14 comprising electrodes 15. The data is processed by data processor 16 to assess spasticity by computing the angle A at which the onset of the stretch reflex (SR) is triggered. The results may be compared to results obtained for normal individuals or individuals with similar or different diseases.
Other Patents Related to Spasticity
                1. Apparatus and method for evaluating a hypertonic condition, Inventor: CABRERA MICHAEL NORMANN B (US); NORRIS JAMES A (US) Applicant: EC: IPC: G01 N33148; G01 N33/50; G01 N33148 (+1), Publication info: US2007027631-2007-02-01. [Differs from Spastiflex in the following: uses position, velocity, gyro, acceleration does not differentiate mechanical and neural contributions to muscle tone. Similarities: measures force, uses model        2. Method and apparatus for resistive characteristic assessment, Inventor: ENGSBERG JACK R (US); ENGSBERG DAVID P (US); (+1), Applicant: BARNES JEWISH HOSPITAL, EC: IPC:A61B5/22; A61B5/22, Publication info: US2007012105-200701        3. METHOD AND APPARATUS FOR DETERMINING SPASTICITY, Inventor: LEVIN MINDY (CA); FELDMAN ANATOL (CA); (+1), Applicant: VALORISATION RECH SOC EN COMMA (CA); UNIV MCGILL (CA); (+3), EC: A61B5/0488; A61B5/11, IPC: A61B5/11; A61B5/0488; A61B5/11 (+1), Publication info: W02006102764-2006-10-05.        4. Botulinum toxins for treating muscle spasm Inventor: AOKI ROGER K (US); GRAYSTON MICHAEL W (US); (+2), Applicant: ALLERGAN INC (US), EC: IPC: A61 K38148; A61 P21102; A61K38/43 (+3), Publication info: EP1486214-2004-12-15. [Common treatment of spastic muscles]        5. METHOD FOR SIMULATION OF SPASTICITY, Inventor: KARAMYSHEV VASILIJ D (SU), Applicant: KH MED INST (SU), EC: IPC: G09B23/28; G09B23/00; (IPC1-7): G09B23/28, Publication info: SU1649599-1991-05-15 [Document available In Russian language only]        6. METHOD OF MEASURING AND RECORDING DEGREE OF LIMBS SPASTICITY, Inventor: FRANEK ANDRZEJ; GORECKI IGNACY; (+1) Applicant: GORNICZE CT REHABILITACJI LECZ (PL), EC: IPC: A61B; (IPC1-7): A61B, Publication info: PL270374-1989-01-05 15 [Descriptive documents not available]        7. Quantification of muscle tone, Uppfinnare: KANDERIAN SAMI S (US); GOLDBERG RANDAL P (US); (+4) Sökande: EC: A61B5/0488; A61B5/22D IPC: A61 B5/0488; A61B5/22; A61B5/0488 (+3), Publication information: US2002156399-2002-10-24 [Differs from Spastiflex in the following: no estimation of reflex: "moving the patient's wrist in a non-sinusoidal and non ramp trajectory and determining the stiffness, viscosity and inertial parameters using the following relationship']

Quantification of mechanical and neural contributions to spasticity


A tool for removing a washing machine spin tube including a first member having an end surface which contacts the end of the spin tube. A pair of recesses on the end portion of the first member accomodates a pair of ears on the spin tube. A second member connects to the first member and is adapted for insertion within the spin tube and for contacting a bearing mounted within the tube. The second member is sized such that the first and second members contact the spin tube and bearing at substantially the same time.

The present invention relates to a novel tool for removing a washing machine spin tube.
Repair of automatic washers, particularly spent bearings, requires the removal of the spin tube and connected base assembly. The removal and recovery of the spin tube quickly and without damage thereto is the key step in this type of work.
In the past, spin tubes have invariably been damaged during washing machine repairs by the use of a hammer and other makeshift tools. In addition, a damaged spin tube requires the replacement of an expensive base assembly which is normally attached thereto. A tool for the removal of an automatic washing machine spin tube for recycling of the same is needed.

Tool for removing a spin tube from a washing machine


The present disclosure relates to a movable rack. For example, the movable rack includes an umbilical connection to deliver a fluid, an electrical current, or a network connection to the movable rack. The present disclosure further relates to the movable rack to include a translating frame to move the umbilical connection to correspond with a movement of the movable rack.

Server racks are designed to hold a variety of technologies including processors, storage, power supplies, networking equipment, input/output ports, and other related technologies. Some of these technologies generate heat that can cause overheating if not properly cooled. Server racks can be designed in a number of ways that increases the possible density of the rack. The rack may also be configured to allow servicing of components by a user or technician.

HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP