A binding for athletic gear having a retaining device for a shoe which consists of a heel element and an instep element pivotally mounted with respect to each other by means of a coupling device. The heel element and the instep element can pivot into an open position in which the shoe can be inserted into the retaining device, then pivot into a closed position in which the heel element and the instep element are held by a locking device and in which the shoe is securely attached to the athletic gear.

The invention pertains to a binding for athletic gear which attaches the shoe or foot of the user to the athletic gear. Athletic gear of the kind defined here is, for example, single-track roller blades (so-called in-line skates), other multiple-track roller skates, ski boots, snowboards, alpine skis, water skis, wind surfers and all other athletic gear in which a relatively tight connection is needed between the athletic gear and the shoe or foot of the user.
In the case of in-line roller blades, for example, like the kind known from EP 0610652 A1, a chassis is provided to which the rollers are mounted located in a row one behind the other. A shoe is permanently mounted to the chassis which extends out beyond the ankle of a foot inserted into the shoe, and consists of relatively rigid material, thereby ensuring a good mount. Externally, the shoe is provided with adjusting devices, by which the shoe can be adapted within tight limits to the individual shoe, where said adjusting devices can consist of known snap clamps, snap locks and stepped belts, or of cable locks, comparable with known ski boots, or a possible combination of these devices.
The shoe is securely attached by rivets to the chassis, so that removal of the shoe from the chassis is not possible. This results in the user having to use a special roller skate corresponding to his foot, such that these roller skates cannot be used by others with different shoe sizes. Likewise, a roller skate of this kind can be used by a growing person only as long as the person does not "grow out of the shoe."
Another disadvantage is the fact that when using these roller skates as a means of transportation, street shoes also have to be carried along, which the user must pull on after arrival at the destination, whereupon the cumbersome roller skates have to be carried. Therefore, the known, in-line roller skates have a use as athletic gear, but have disadvantages in everyday use as a means of transportation.
A similar problem comes up with ice skates, where the runner has to be riveted or screwed to the sole of a special shoe, so that, again, the user has to use a special ice skate fitted to his foot.
Even with other athletic gear, such as snowboards, the binding and the shoe have to be coordinated with each other, so that the user has very little option in selecting which shoe he uses, and in most cases the binding still has to be adjusted individually to a selected shoe.


The slide unit includes a rodless power cylinder having a cylinder tube. End caps are attached to both ends of the cylinder tube. A slit extending in parallel with the axis of the cylinder tube is formed on the wall of the cylinder tube. A piston is disposed in the bore of the cylinder tube and is movable along the slit. An external carriage is connected with the piston by a yoke extending through the slit. An inner seal band and an outer seal band extending along the slit for closing the opening of the slit from the inside and outside, respectively, are provided. The ends of the inner seal band and the outer seal band are inserted into corresponding recesses formed on each of the inner end faces of the end caps. A pin hole crossing the recesses and extending to the upper face of each end cap is provided. A fitting hole is disposed on each end of the inner seal band and the outer seal band at the position corresponding to the pin hole. The inner seal band and the outer seal band are secured to each end cap by inserting a fitting pin into the fitting holes at the ends of the seal bands through the pin hole. Since the seal bands are secured to each end cap only by a fitting pin, the assembly of the seal bands is largely simplified.

1. Field of the Invention
The present invention relates to a slide unit which uses a rodless power cylinder having an external carriage driven by a piston in a cylinder barrel. The external carriage is connected to the piston by a coupling member protruding from the cylinder barrel through a slit formed in the wall of the cylinder barrel. The slit in the cylinder barrel is sealed by an inner seal band and an outer seal band.
2. Description of the Related Art
A slide unit utilizing a rodless power cylinder is known in the art. A rodless power cylinder includes a cylinder barrel having an axial slit in the wall and a piston disposed in the bore of the cylinder barrel. The bore of the cylinder barrel is divided by the piston and forms two pressure chambers, one on each side of the piston. The piston is moved within the bore by introducing pressurized fluid into the pressure chambers. The movement of the piston is transferred to an external carriage by a coupling member which connects the external carriage to the piston through the slit in the cylinder barrel. Usually, an inner seal band is disposed on the inner wall surface of the bore along the slit in order to prevent leakage of the pressurized fluid. Further, an outer seal band is disposed outer wall surface of the cylinder barrel along the slit in order to prevent an incursion of dust into the cylinder barrel.
Slide units of this type are disclosed in various publications.
For example;
(A) Japanese Unexamined Patent Publications (Kokai) No. 63-190906, No. 60-237208, No. 62-177304 and No. 3-4005 disclose rodless power cylinders in which the ends of the seal bands are secured to end members (end caps) disposed on the both ends of the cylinder barrel by clamping the seal bands between fitting screws screwed into threaded holes formed on the wall of the cylinder barrel and the side surface of the end members.
(B) Japanese Unexamined Patent Publications (Kokai) No. 62-266206 and No. 63-225708 disclose rodless power cylinders in which the ends of the seal bands are secured to the end members by clamping the seal bands between fitting plate and the end members. Further, a fitting pin which penetrates the seal band through a fitting hole disposed on each end of the seal bands is used for securing the seal band to each end member.
(C) Japanese Unexamined Patent Publication (Kokai) No. 50-89775 discloses a rodless power cylinder in which the seal bands are secured to the end members by inserting the bottom portion of a T-shaped fitting piece into a fitting hole disposed on each end of the seal bands and by securing the fitting pieces to the end members by securing screws.
(D) Japanese Unexamined Utility Model Publications (Kokai) No. 3-12006, No. 7-44795 and No. 2-21305 disclose slide units having end members at the both ends of the cylinder barrel. The end members of the slide units in these publications are provided with mounting bolt holes through which mounting bolts are passed and tightened to external structures in order to mount the slide units to the structures. The end members in these publications are made of aluminum alloy so that the end members withstand the tightening load of the mounting bolts.
(E) Further, Japanese Unexamined Utility Model Publication (Kokai) No. 1-132804 discloses a slide unit having end members made of synthetic resin such as polyacetal. However in this case, since the strength of polyacetal is not sufficient for withstanding the tightening loads of the mounting bolts, separate L-shaped metal brackets are used for mounting the slide unit to the external structure. These brackets are attached to the end members by screwing fitting bolts into threaded bolt holes formed on the heads of fitting bolts used for fitting the end members to the cylinder barrel. The slide unit is mounted to an external structure via the L-shaped metal bracket.
(F) Japanese Unexamined Utility Model Publication (Kokai) No. 49-77388 discloses a rodless power cylinder having end members. In this publication, the end members are attached to the ends of the cylinder barrel using fitting bolts screwed into threaded bolt holes on the end faces of the cylinder barrel.
(G) Japanese Unexamined Utility Model Publication (Kokai) No. 3-7506 and Japanese Unexamined Patent Publication (Kokai) No. 7-158612 disclose slide units having stoppers for the external carriages. The stoppers in these publications are attached to the cylinder barrels using clamp members fitted to guide grooves or recesses formed on the outer surfaces of the cylinder barrels.
In the rodless power cylinders of the publications (A), since the seal bands are clamped between the fitting screws and the circumferences of the end members, it is necessary to screw the fitting bolts into the threaded holes of the cylinder barrels. This increases the number of steps required for assembling the rodeless power cylinders. Further, if the fitting screws become loose, the sealing abilities of the seal bands may be lowered due to a decrease in the tension of the seal bands. In addition to that, since the heads of the fitting screws are visible from the outside of the cylinder barrel, the exterior views of the rodless power cylinders are deteriorated by the heads of the fitting screws.
Further, when the end members are made of soft materials, for example, a synthetic resin such as polyacetal, the clamping force may become insufficient due to softness of the material and a creep inherent to synthetic resin. This also causes an insufficient sealing performance of the seal bands.
In the rodless power cylinders of the publications (B) and (C), since fitting pins or fitting pieces are used for securing the seal bands, the problem caused by the loosening of the fitting screws does not occur. However, additional fitting plates or T-shaped fitting pieces are required for securing the seal band. Further, since these fitting plates and fitting pieces must be secured to the cylinder barrel, problems of the increase in the number of steps for assembling the rodless power cylinder and the deterioration of the exterior view also occur in the rodless power cylinder of the publications (A).
In the slide units of the publications (D), since the end members are made of aluminum alloy, the manufacturing process of the end members is complicated and the cost incurred increases. Further, the weight of a whole slide unit increases due to the heavy aluminum end members.
Further, in the slide units of the publications (E) and (F), the configurations for fitting the end members to the cylinder barrels are complicated. This causes increase in the manufacturing cost of the slide unit.
In the slide unit of the publications (G), since the stoppers are attached to the cylinder barrel using clamping members engaging the guide grooves or recesses formed on the surfaces of the cylinder barrels, the guide grooves and the recesses are easily damaged when excessive forces are exerted thereon from the clamping members. Also a complicated process is required for attaching the end members to the cylinder barrels.


A wireless access point includes, in one embodiment, circuitry with a radio transceiver that determines substantially optimal antenna orientation for one or more radio hosts with which an access point is in communication. Received RF signals are down-converted to baseband frequencies and produced to a baseband processor. At least one received signal strength indicator provides signal strength measurements for received communication channels to the baseband processor in the described embodiment. The baseband processor produces control signals to prompt the user to orient at least one antenna into a specified location. In one embodiment, logic prompts the user to move the antenna into a plurality of positions and then evaluates signal strength indication in each position to determine an overall substantially optimal orientation for all of the radio transceivers in communication with the access point.

1. Technical Field
The present invention relates to wireless communications and, more particularly, wireless communication system base stations and access points.
2. Related Art
Communication systems are known to support wireless and wire lined communications between wireless and/or wire lined communication devices. Such communication systems range from national and/or international cellular telephone systems to the Internet to point-to-point in-home wireless networks. Each type of communication system is constructed, and hence operates, in accordance with one or more communication standards. For instance, wireless communication systems may operate in accordance with one or more standards, including, but not limited to, IEEE 802.11, Bluetooth, Advanced Mobile Phone Services (AMPS), digital AMPS, Global System for Mobile Communications (GSM), Code Division Multiple Access (CDMA), Local Multipoint Distribution Systems (LMDS), Multipoint Multichannel Distribution Services (MMDS), and/or variations thereof.
Depending on the type of wireless communication system, a wireless communication device, such as a cellular telephone, two-way radio, personal digital assistant (PDA), personal computer (PC), laptop computer, home entertainment equipment, etc., communicates directly or indirectly with other wireless communication devices. For direct communications (also known as point-to-point communications), the participating wireless communication devices tune their receivers and transmitters to the same channel or channels (e.g., one of a plurality of radio frequency (RF) carriers of the wireless communication system) and communicate over that channel(s). For indirect wireless communications, each wireless communication device communicates directly with an associated base station (e.g., for cellular services) and/or an associated access point (e.g., for an in-home or in-building wireless network) via an assigned channel. To complete a communication connection between the wireless communication devices, the associated base stations and/or associated access points communicate with each other directly, via a system controller, via the Public Switched Telephone Network (PSTN), via the Internet, and/or via some other wide area network.
Each wireless communication device includes a built-in radio transceiver (i.e., receiver and transmitter) or is coupled to an associated radio transceiver (e.g., a station for in-home and/or in-building wireless communication networks, RF modem, etc.). As is known, the transmitter includes a data modulation stage, one or more intermediate frequency stages, and a power amplifier. The data modulation stage converts raw data into baseband signals in accordance with the particular wireless communication standard. The baseband signals are mixed with one or more local oscillations to produce RF signals either directly or through an intermediate frequency stage. The power amplifier amplifies the RF signals prior to transmission via an antenna.
As is also known, the receiver is coupled to the antenna and includes a low noise amplifier, one or more optional intermediate frequency stages, a filtering stage, and a data recovery stage. The low noise amplifier receives an inbound RF signal via the antenna and amplifies it. The one or more intermediate frequency stages (if present) mix the amplified RF signal with one or more local oscillations to convert the amplified RF signal into a baseband signal or an intermediate frequency (IF) signal. As used herein, the term "low IF" refers to both baseband and intermediate frequency signals. A filtering stage filters the low IF signals to attenuate unwanted out of band signals to produce a filtered signal. The data recovery stage recovers raw data from the filtered signal in accordance with the particular wireless communication standard.
To carry out filtering at the intermediate frequencies, Surface Acoustic Wave (SAW) filters are commonly used. The SAW filters have the drawback, however, of being bulky, heavy and expensive. An alternate approach to using a higher intermediate frequency that requires the SAW filters is to convert the RF signal to an intermediate frequency sufficiently low to allow the integration of on-chip channel selection filters. For example, some narrow band or low data rate systems, such as Bluetooth, use this low intermediate frequency design approach. This approach is advantageous in that the use of an intermediate conversion step is avoided.
In a wireless local area network, one common challenge is to maximize the effectiveness of the communication channels to each communication device wirelessly communicating with the access point. Generally, however, structural interference and multi-path interference within a building or dwelling reduce effectiveness of one or more communication links. Moreover, antennas are somewhat directional thereby resulting in signal quality being reduced or improved based upon antenna placement and orientation. Accordingly, it is common for a user to continuously move an access point or host device into different locations and/or orientations to find a placement for which each communication device, in its current location, may establish a communication link between the host and the access point. Generally, however, determining a satisfactory location and orientation of the host or access point is a hit or miss proposition. Moreover, while a location may be determined as satisfactory, the quality of the communication link may not be optimal thereby potentially reducing throughput rates and overall signal quality. What is needed, therefore, is a system and method for indicating, to a user of a base station, an access point or a WLAN host device, of an antenna orientation for a given position that substantially maximizes signal quality to each communication device communicatively coupled to the base station or access point.

Transceiver with optimal antenna direction indicators


A method for performing emergency calls includes: camping a first subscription of a mobile communication device on a first cell on a first communication network; camping a second subscription of the mobile communication device on a second cell on a second communication network; determining by the mobile communication device whether one of the first and second subscriptions supports emergency calls; and initiating an emergency call on the determined subscription.

Some Global System for Mobile communications (GSM) networks may not allow emergency calls because the access class for allowing emergency calls is not set by the network. The Third Generation Partnership Project (3GPP) access class 10 indicates whether emergency calls are allowed or not on a particular cell. Access class 10 and other access class restrictions are broadcast in the random access channel (RACH) control parameters information element (IE) of the one or more system information messages on the Broadcast Control Channel (BCCH). In some cases the received signal strength indication (RSSI) and signal-to-noise ratio (SNR) of the particular cell may be high and normal calls are allowed on the cell, but emergency calls may not be allowed due to access class restrictions.
Subscriber Identity Modules (SIMs) in a mobile communication device are provisioned with an access class level between 0 and 15. Most SIMs are coded with a random access class level between 0 and 9. For special case mobile customers, for example, emergency services, government officials, civil defense, etc., a SIM with a high access class value may be issued (between 10 and 15). Cell sites may be configured to transmit an access class value in the broadcast channel (i.e., the RACH control parameters IE of the system information message) of the cell. In most cases, access class levels 0-15 are allowed. However, some GSM networks may not allow emergency calls because the access class for allowing emergency calls is not set by the network.
The SIM compares the broadcast access class level with the SIM's own access class level. If the allowed access class level broadcast by the cell site does not match the access class level of the SIM, then the mobile communication device cannot access that cell for any services. If access class 10 is indicated as barred in a cell, a mobile communication device having a SIM with access class 0 to 9 or without an International Mobile Subscriber Identity (IMSI) is not allowed to initiate emergency calls in this cell. However, emergency calls may not be restricted on one or more subscriptions of a multi-SIM mobile communication device.

Efficient way of performing emergency calls in multi-subscriber identity module solutions


In a wireless network node, the MAC protocol is implemented through an extended finite state machine executed by the node. The operation of the wireless network node is changed by establishing a wireless connection between the present wireless network node and a remote wireless network node. One or more data packets containing a coded extended finite state machine corresponding to a specific MAC protocol are sent through the wireless connection from the remote wireless network node to the present wireless network node. An activation command from the remote wireless network node to the present wireless network node is sent through the wireless connection for activating the specific MAC protocol. This may be done during normal operation of the present wireless network node.

1. Technical Field
The present invention relates to a method of changing the operation of wireless network nodes as well as to wireless network nodes arranged to implement the same.
2. Related Art
Some time ago, i.e. in March 2012, the present inventors conceived the idea of a wireless Media Access Control (MAC) processor, and disclosed it in an article entitled "Wireless MAC Processor: Programming MAC Protocols on Commodity Hardware" contained in the Proceedings of IEEE INFOCOM 2012; such processor may advantageously be used in wireless network nodes for implementing a MAC protocol.
It is to be noted that all current commercial wireless access points and all current commercial wireless stations are designed to work with only one and predetermined specific Media Access Control (MAC) protocol and that the above mentioned article describes an advanced research solution far away from the commercial solutions.

Method of changing the operation of wireless network nodes


This invention relates to a process for preparing polyurethanes by reacting, in accordance with the resin transfer molding technique at an isocyanate index of about 80 to about 120,. (a) an organic polyisocyanate; PA0 (b) about 60 to about 98 percent by weight, based on the total amount of components (b) and (c), of at least one isocyanate-reactive compound containing at least two isocyanate-reactive hydrogen atoms and having a molecular weight of from about 400 to about 10,000; PA0 (c) about 2 to about 40 percent by weight, based on the total amount of components (b) and (c), of (i) 2-methyl-1,3-propanediol or (ii) a mixture of 2-methyl-1,3-propanediol with (1) up to about 30% by weight, based on the total amount of component (c), of a chain extender other than 2-methyl-1,3-propanediol and/or (2) up to about 5% by weight, based on the total amount of component (c), of a crosslinking agent; and PA0 (d) one or more catalysts and, optionally, one or more other auxiliaries and/or additives.

This invention relates to a resin transfer molding process in which the use of 2-methyl-1,3-propanediol as the chain extender provides polyurethane elastomers having excellent and unexpected physical properties.
Resin transfer molding is a form of liquid composite molding in which the reaction conditions typically involve longer reaction times, lower temperatures, and lower pressures than the commonly used reaction injection molding ("RIM") technique. In fact, open molds are often suitable for resin transfer molding. Consequently, resin transfer molding is particularly suited to the production of fiber-reinforced plastic articles, for which wetting and impregnation of the reinforcement material is often difficult, and the production of very large articles, for which the high pressure molds used in the RIM technique are impractical or unavailable. See, e.g., E. B. Stark and W. V. Breitigam, "Resin Transfer Molding Materials," and C. F. Johnson, "Resin Transfer Molding," in Engineered Materials Handbook, Vol 1 ("Compositites") (Metals Park, Ohio: ASM International, 1987), pages 168-171 and 565-568, respectively; G. R. Smoluk, Modern Plastics, 66, 57-65 (January, 1989); J. K. Rogers, Plastics Technology, 35, 50-58 (1989); and R. V. Wilder, Modern Plastics, 66, 48-50 (July, 989).
Although the resin transfer molding technique has most commonly been used for polymers other than polyurethanes, the technique can also be used with reactive urethane-based systems. For example, U.S. Pat. Nos. 4,695,509, 4,919,876, and 5,009,821 disclose the preparation of polyurethane composites by resin transfer molding and U.S. Pat. Nos. 4,757,123 and 4,800,058 disclose the preparation of modified rigid polyisocyanurate polymer compositions by resin transfer molding.
An object of the present invention was to find a process for preparing elastomers that gives higher quality product and is more easily controlled than open-mold casting techniques and that, when used to prepare reinforced products, is less likely to disturb or damage the reinforcing materials than reaction injection molding techniques. The present invention provides polyurethane elastomers having unexpectedly high elongation values and high resiliency to compression in combination with overall good physical properties when compared with elastomers extended with 1,4-butanediol using the standard molding techniques.


An optical rotary encoder includes a light source, a rotation body including a reflecting diffraction grating, a light receiving unit including a plurality of light receiving elements, a synthetic unit that combines output signals output from the plurality of light receiving elements to obtain a signal, which represents a fringe pattern component at a certain cycle, included in a light reflected by the reflecting diffraction grating and, and a detection unit that detects a direction based on a first signal and a second signal, the direction being a direction in which a distance between the rotation body and the light receiving unit varies, the first signal and the second signal being obtained by the synthetic unit, the first signal indicating a fringe pattern component having a cycle shorter than the certain cycle, the second signal indicating a fringe pattern component having a cycle longer than the certain cycle.

There are some known technologies that are related to an optical rotary encoder. For example, a technology is known by which a rotation speed and rotation angle of a detection target in which a member to be detected is installed is highly accurately detected. In such a technology, first, three rotation sensors that are arranged at 90° intervals in the circumferential direction of a disc-like code wheel attached to an output shaft of a motor individually output signals that correspond to a rotation speed of the code wheel. An error component of one cycle (one-cycle component) occurs per rotation when the code wheel is eccentric to the output shaft, and an error component of two cycles (two-cycle component) occurs per rotation when the code wheel is deformed into an oval shape. Here, subtraction or addition is performed on a correction signal that is obtained by removing the two-cycle component by averaging outputs of a first rotation sensor and a second rotation sensor and a correction signal that is obtained by removing the two-cycle component by obtaining a difference between outputs of the first rotation sensor and a third rotation sensor, in accordance with a phase and amplitude of the remaining one-cycle component. As described above, in such a technology, both of the error component of one-cycle per rotation and the error component of two-cycle per rotation are removed by one rotation of the member to be detected (see, for example, Japanese Laid-open Patent Publication No. 2005-168280).
In addition, a technology of a rotary encoder is known by which an eccentricity amount may be appropriately corrected even if eccentricity of a disk varies for each rotation. In such a technology, the rotary encoder includes a rotation disk, a main sensor, and an auxiliary sensor. Here, the rotation disk has a main slit pattern that is used to detect a rotation angle of the rotation disk and a plurality of concentric auxiliary slit patterns that are used to detect eccentricity of the rotation disk. The main sensor reads the main slit pattern. In addition, the auxiliary sensor is arranged at a position of 90° with respect to the main sensor and detects the auxiliary slit pattern. In such a technology, an angle detection signal of the main sensor is corrected using a signal from the auxiliary sensor (see, for example, Japanese Laid-open Patent Publication No. 2001-264119).
In addition, a technology of an optical encoder is known by which a measurement error due to eccentricity of a pulse plate is minimized with a configuration at low cost. In such a technology, a slit pattern of the pulse plate is formed so as to generate an angle (for example, 45°) with respect to the traveling direction of the pulse plate (see, for example, Japanese Laid-open Patent Publication No. 2004-109074).
In addition, a technology is known by which eccentricity of an encoder scale member of a rotation encoder is determined. In such a technology, first, an encoder scale material having the geometric center is prepared. Next, the center of the encoder scale material is located at a certain position. Next, the encoder scale member is formed by creating a scale in the encoder scale material. As a result, the center of the scale of the encoder scale member is located at the certain position. In such a technology, here, eccentricity between the above-described geometric center and the above-described certain position is measured (see, for example, Japanese National Publication of International Patent Application No. 2008-539407).

Optical rotary encoder with correction method reducing variation of a distance between a rotation body and a light receiving unit


A heater for a sheet material comprises an insulating substrate and a main resistor strip formed on the substrate. The substrate is further formed with auxiliary resistor strips adjacent to both ends of the main resistor strip. In operation, the main and auxiliary resistor strips are actuated simultaneously for heat generation. As a result, the additional heat generated by the auxiliary resistor strips compensates for higher heat dissipation at both ends of the heater, thereby equalizing the temperature distribution longitudinally of the heater.

1. Field of the Invention
This invention relates generally to heaters. More specifically, the present invention relates to a linear heater which can be advantageously used in an office automation apparatus such as a photocopier or electrophotographic printer for fixing images on a paper sheet for example.
2. Description of the Prior Art
Various types of linear heaters are known for fixing images (deposited toner) on a paper sheet in photocopiers or electrophotographic printers (e.g. laser beam printer). Typical examples include a lamp heater and a roller heater.
However, the lamp heater and roller heater are equally disadvantageous in that there is a limitation in reducing size (thickness) and cost. Further, the lamp heater is easily damaged due to the nature of material, whereas the roller heater has a complicated structure due to the necessity of incorporating plural heating elements within the roller.
To eliminate the problems of the conventional heaters, it has been proposed to use a strip heater for fixing images on a paper sheet in electrophotography. For the convenience of explanation, a typical arrangement of a prior art strip heater is shown in FIG. 14 of the accompanying drawings.
As shown in FIG. 14, the typical prior art strip heater comprises an elongate insulating substrate 100 having a surface formed with a printed resistor strip 101. Each end of the resistor strip 101 is connected to an enlarged terminal electrode 102 made of silver for connection to a power source (not shown). The resistor strip 101, which is made of e.g. silver-palladium alloy, generates heat when a current is passed therethrough.
Obviously, the prior art strip heater is very simple in arrangement. Further, the strip heater can be made very thin and light by reducing the thickness of the substrate 100. Moreover, the strip heater is also advantageous in that the time required for warming up is very short. However, the prior art strip heater still has the following problem.
Specifically, the enlarged terminal electrodes 102 made of silver are the portions where heat dissipation occurs most easily. Thus, when the resistor strip 101 is made to have a constant width over the entire length thereof, an uneven temperature distribution will result in which the surface temperature of the resistor strip is lower near the respective electrodes than at a central portion, as shown in FIG. 15. As a result, the heater will have an effective heating length A' which is non-negligibly smaller than the overall length A of the resistor strip 101. If the entire length A of the resistor strip 101 is utilized for heating, uneven image fixation will result. On the other hand, an attempt to increase the effective heating length A' will inevitably result in unacceptable elongation of the heater.
The above-described problem of the typical prior art strip heater can be solved by forming a resistor strip 101' which has a pair of end portions 101a' progressively reducing in width toward the respective electrodes 102, as shown in FIG. 16 and as taught in U.S. Pat. No. 5,068,517 to Tsuyuki et. al (Patented: Nov. 26, 1991; Filed: Aug. 22, 1989). However, such a solution gives rise to a new problem that the narrower end portions 101a' of the resistor strip 101' are more easily broken because, in spite of the reduced width, the narrower end portions 101a' generate a greater amount of heat than the central portion.


A method and apparatus for endpoint detection for the stripping of a particular material, such as photo-resist material, from a substrate surface. A beam of light is projected onto the substrate surface and the fluoresced and/or reflected light intensity at a particular wavelength band is measured by a light detector. The light intensity is converted to a numerical value and transmitted electronically to a control mechanism which determines the proper disposition of the substrate. The control mechanism controls the cessation of the stripping process and may control a substrate-handling device which sequentially transfers substrates to and from a stripping chamber.

1. Field of the Invention
This invention relates generally to the manufacture of semiconductor devices prepared by a method including photolithography. More particularly, this invention pertains to a method for inspecting semiconductor substrates to determine the completion of stripping ("endpoint") during a plasma stripping process to remove a photo-resist material from a semiconductor substrate surface after photolithography.
2. State of the Art
Semiconductor chips are produced in a multi-step process by which a plurality of identical electronic circuits is typically formed on a semiconductor substrate, such as a silicon wafer. The semiconductor substrate is then subdivided (diced) into individual chips which are further processed into packaged semiconductor devices or otherwise secured in higher-level packaging for ultimate use.
The electronic circuits are generally patterned into a semiconductor substrate by a series of steps including photolithography. To elaborate, a photo-resist material is coated onto the semiconductor substrate surface. As disclosed in commonly owned U.S. Pat. No. 5,350,236 issued Sep. 27, 1994, hereby incorporated herein by reference, the temperature of a semiconductor substrate during the application of a material can be monitored by measuring light reflected from a surface of the semiconductor substrate, such that the material and semiconductor substrate are not overheated.
After the photo-resist material has been coated on the semiconductor substrate surface, it is selectively exposed to a radiation source, such as by the passage of radiation (i.e., light, e-beam, or X-rays) through a mask having a desired aperture pattern defined therein. If a positive photo-resist material is used, the exposure to the radiation source converts the positive photo-resist material to a more soluble state which allows the exposed positive photo-resist to be removed with a solvent, thereby leaving a pattern substantially identical to the mask. If a negative photo-resist material is used, the exposure to the radiation source converts the negative photo-resist material to a less soluble state which allows the unexposed positive photo-resist to be removed with a solvent, thereby leaving a pattern substantially identical to the openings in the mask. Whether a positive or a negative photo-resist material is used, the photolithographic process results in a photo-resist pattern which will become the electronic circuit pattern on a semiconductor substrate.
Following the removal of the portions of the photo-resist material in the development process, the semiconductor substrate is subjected to further processing steps which may include doping, etching, and/or deposition of conductive materials in unprotected areas, i.e., areas devoid of photo-resist material. After one or more of these processing steps, the semiconductor substrate is subjected to a stripping step to remove the photo-resist material remaining on the semiconductor substrate.
The stripping of photo-resist material is commonly achieved using plasma etching. In plasma etching, a glow discharge is used to produce at least one reactive species, such as atoms, radicals, and/or ions, from relatively inert gas molecules. Basically, a plasma etching process comprises 1) is generated at least one reactive species in a plasma from a bulk gas, 2) the reactive species diffuses to a surface of a material being etched, 3) the reactive species is absorbed on the surface of the material being etched, 4) a chemical reaction occurs which results in the formation of at least one volatile by-product, 5) the by-product is desorbed from the surface of the material being etched, and 6) the desorbed by-product diffuses into the bulk gas. The materials used as photo-resist are generally organic polymers, such as phenol-formaldehyde, polyisoprene, poly-methyl methacrylate, poly-methyl isopropenyl ketone, poly-butene-1-sulfone, poly-trifluoroethyl chloroacrylate, and the like. Such photo-resist materials are generally etched in plasmas containing pure oxygen to produce species that attack the organic materials to form CO, CO.sub.2, and H.sub.2 O as volatile by-products.
After the removal of the photo-resist material, a subsequent processing step may include heating the semiconductor substrate in a diffusion furnace or applying a layer of material with a chemical vapor deposition system. Occasionally, a semiconductor substrate is inadvertently passed to a thermal furnace or vapor deposition system with incomplete removal of the photo-resist material. The resulting damage to the processing equipment may be severe. For example, furnace diffusion tubes are irreparably damaged by vaporized hydrocarbons and carbon from the photo-resist material and, thus, the furnace diffusion tubes must be replaced. The replacement equipment and/or the downtime to repair the processing equipment is usually very costly.
Furthermore, the photo-resist carrying semiconductor substrate and one or more subsequent semiconductor substrates entering the processing equipment prior to shutdown of the equipment are usually also contaminated and must be discarded. At a late stage of manufacture, a semiconductor substrate may have a value between about $10,000 and $20,000. Thus, even an occasional loss is significant.
Therefore, it is very important that completion ("endpoint") of the photo-resist stripping be accurately detected. A common endpoint detection method with plasma etching is disclosed in U.S. Pat. No. 4,377,436 issued Mar. 22, 1983 to Donnelly et al. wherein endpoint detection during plasma-assisted etching is signaled by cessation or onset of spatially confined luminescence resulting from an etch reaction product. The light source for the luminescence comes from the plasma generation. However, as the use of microwave plasma etching has developed, the generation of the plasma has been removed from the etching chamber. The removal of the plasma generation from the etching chamber prevents excess heat buildup in the etching chamber caused by the plasma generation and allows for different frequencies and wavelengths to be used to create free radials (i.e., the reactive species).
The reactive species is formed remotely in a microwave reaction chamber and transported to the etching chamber, such as shown in U.S. Pat. No. 5,489,362 issued Feb. 6, 1996 to Steinhardt et al. No plasma is present in the stripping chamber with such a microwave plasma system. Therefore, there is no light source present in the chamber that can be used for detection of the endpoint removal of the photo-resist material.
Therefore, it would be advantageous to develop an apparatus and method of luminescent endpoint detection for the stripping of materials in a microwave plasma etching system employing a plasma chamber separate from its etching chamber.

Method and apparatus employing external light source for endpoint detection


A device for electrically interconnecting the wire leads of various electronic elements within a microminiature package. A non-conducting base member having a plurality of electronic element barriers and wire lead through-holes is provided. The through-holes are generally located within the interior regions of the base element to minimize potentially detrimental field interactions or capacitive coupling between the leads and the external package terminals. During package assembly, the electronic elements are placed within recesses created within the base member by the aforementioned barriers. These recesses and barriers align the elements and help maintain electrical separation and uniformity during manufacturing. The wire leads from two or more elements are interconnected by twisting them together and inserting them into one of the through-holes. The leads are inserted into the through-holes such that they protrude below the bottom surface of the base element, thereby facilitating soldering of all such connections in a single process step. This arrangement reduces manufacturing and labor costs and increases component and overall package reliability.

1. Field of the Invention
The present invention relates generally to non-semiconductor electrical and electronic elements used in printed circuit board applications and particularly to an improved package and method of packaging microminiature electronic components.
2. Description of Related Technology
Dual in-line chip carrier packages (DIPs) are well known in the field of electronics. A common example of a DIP is an integrated circuit, which is typically bonded to a ceramic carrier and electrically connected to a lead frame providing opposed rows of parallel electrical leads. The integrated circuit and ceramic carrier are normally encased in a black, rectangular plastic housing from which the leads extend.
The continuing miniaturization of electrical and electronic elements and high density mounting thereof have created increasing challenges relating to electrical isolation and mechanical interconnection. In particular, substantial difficulty exists in establishing reliable and efficient connections between fine gauge (AWG24 to AWG50) copper wire leads associated with various electronic elements within a given DIP. Presently known interconnect methods severely limit the ability to provide dense and reliable electrical connections or electrical isolation of such leads from DIP egress terminals.
One common prior art approach to electrically interconnecting two or more element leads is to manually form the connection or joint by twisting the wires together. The joint may then be individually soldered or sealed to make the connection more permanent. This technique requires significant labor in that each connection must be manually formed and soldered. Furthermore, such an arrangement requires space that is not always available in such microminiature packages, and often does not allow adequate electrical separation for the comparatively high voltages that may be carried in the circuit and the egress terminals. Another problem with this approach is that element leads are frequently broken or sheared during the subsequent package encapsulation process since they are not adequately captured or protected. The leads may also break as the result of thermal expansion and contraction.
A second prior art method of connecting element leads to the leadframe terminals (or interconnecting the leads of two or more electronic elements) is disclosed in U.S. Pat. No.5,015,981, which is illustrated herein as FIG. 1. This method involves routing the lead(s) 2 to an unused leadframe slot 3 located at the edge of the non-conducting base member 10, as shown in FIG. 1. Each of these slots is designed to receive a single conductive leadframe egress terminal element 4, which when assembled asserts an inward bias on the package thereby forcing contact between the conductive terminal element 4 of the leadframe and the electronic element lead(s) 2. However, this method suffers many of the same disabilities as the method previously described, since the wires must be routed to the edge of the package in proximity to the egress terminals. Such an arrangement also makes the connections susceptible to capacitive coupling or field effects relating to the egress terminals.
A third approach to solving these problems is set forth in U.S. Pat. No. 5,455,741, which discloses a wire-lead through hole interconnect device used for packaging electronic components. As shown in the aforementioned patent and FIGS. 2 and 3 herein, this device is characterized by a non-conductive base 10 with one or more component cavities 6, a plurality of through-holes 15 penetrating the thickness of the base in proximity to the cavities, and recesses 7 at the lower ends of the through holes to receive both electrically conductive printed circuit strips 8 and the solder joint 50 formed between the lead and the conductive strip. Electrical connection between the egress terminals of the package and the component leads 22 is provided by, inter alia, a conductive strip running 9 from the aforementioned solder joint outward around the edge or periphery of the base. This through-hole design provides a flat, "bump-free" bottom surface of the device, and aids the manufacturing and assembly process by allowing greater repeatability and reliability of component placement and joint formation, while reducing the required labor. It also permits the connection between the leads and the egress terminals to be formed more reliably. However, interconnection of the leads from various elements within the device is accomplished through use of the aforementioned conductive strips 8. Hence, to interconnect two electronic element leads, the presence of 1) a second through-hole; 2) a conductive strip; and 3) the recess necessary to receive the conductive strip and the soldered leads is required. Furthermore, two solder joints are required. Similarly, to connect three leads together, three through-holes and three solder joints are required.
It would therefore be desirable to provide a method of connecting two or more of such leads using a single solder joint, such a method furthermore allowing the soldering of all such joints simultaneously in one process step. This would not only save space within the package, but would also eliminate the labor and materials associated with forming the recess(es), installing the printed circuit elements, and soldering each lead individually. Ideally, these joints would be located internally within the package and away from the leadframe elements to minimize any capacitive or electrical interaction between the leads and the egress terminals and to minimize the length of wire runs required to make the connection.
In addition to the foregoing problems associated with lead/lead interconnection, electronic component placement within the package is of concern. The placement of various components is critical from the standpoint of electrical separation (i.e., reducing the interaction of localized electric and magnetic fields emanating from the elements), manufacturing repeatability and reduced labor costs, and device reliability. Heretofore, the placement of electronic elements within the package has been primarily dictated by physical considerations such as reducing the profile or dimensions of the package, and not necessarily with regard to the aforementioned factors. For example, the toroidal coil placement disclosed in the prior art interconnect devices does not specifically address electric or magnetic field interaction, the minimization of wire run length, or physical separation of the elements. Hence, it would be desirable to provide a package design which incorporates both an improved method of lead interconnection as previously described, and improved component placement.

Through-hole interconnect device with isolated wire-leads and component barriers


A sealed microelectronic structure which provides mechanical stress endurance and includes at least two chips being electrically connected to a semiconductor structure at a plurality of locations. Each chip includes a continuous bonding material along it's perimeter and at least one support column connected to each of the chips positioned within the perimeter of each chip. Each support column extends outwardly such that when the at least two chips are positioned over one another the support columns are in mating relation to each other. A seal between the at least two chips results from the overlapping relation of the chip to one another such that the bonding material and support columns are in mating relation to each other. Thus, the seal is formed when the at least two chips are mated together, and results in a bonded chip structure.

Integrated circuits (ICs) form the basis for many electronic systems. Essentially, an integrated circuit (IC) or chip includes a vast number of transistors and other circuit elements that are formed on a single semiconductor wafer and are interconnected to implement a desired function. The complexity of these integrated circuits (ICs) requires the use of an increasing number of linked transistors and other circuit elements.
Many modern electronic systems are created through the use of a variety of different integrated circuits, where each integrated circuit (IC or chip) performs one or more specific functions. For example, computer systems include at least one microprocessor and a number of memory chips. Conventionally, each of these integrated circuits (ICs) are formed on a separate chip, packaged independently and interconnected on, for example, a printed circuit board (PCB).
In microelectronics, a wafer is a thin slice of semiconducting material, such as a silicon crystal, upon which microcircuits are constructed for example, by doping, etching, or deposition. Wafers are used in the fabrication of semiconductor devices such as integrated circuits or chips or dies. A single wafer may have a plurality of chips formed on the wafer. The wafer may be used having a plurality of chips formed therein, or the wafer may be cut to provide individual dies or chips. The wafers and chips or dies can form a stack by positioning the wafers and/or chips on top of one another. Copper bonding (Cu bonding) processes can be used to stack dies/chips at a chip-to-chip, chip-to-wafer, or wafer-to-wafer level.
As integrated circuit (IC) technology progresses, a need for a "system on a chip" in which the functionality of all of the IC devices of the system are packaged together without a conventional printed circuit board (PCB). Ideally, a computing system should be fabricated with all the necessary IC devices on a single chip. In practice, however, it is very difficult to implement a truly high-performance "system on a chip" because of vastly different fabrication processes and different manufacturing yields for the logic and memory circuits.
As a compromise, various "system modules" have been introduced that electrically connect and package integrated circuit (IC) devices which are fabricated on the same or on different semiconductor wafers. Initially, system modules have been created by simply stacking two chips, e.g., a logic and memory chip, on top of one another in an arrangement commonly referred to as chip-on-chip structure. Subsequently, multi-chip module (MCM) technology has been utilized to stack a number of chips on a common substrate to reduce the overall size and weight of the package which directly translates into reduced system size.
Existing multi-chip module (MCM) technology provides performance enhancements over single chip or chip-on-chip (COC) packaging approaches. For example, when several semiconductor chips are mounted and interconnected on a common substrate through very high density interconnects, higher silicon packaging density and shorter chip-to-chip interconnections can be achieved. In addition, low dielectric constant materials and higher wiring density can also be obtained which lead to increased system speed and reliability, reduced weight, volume, power consumption, and heat to be dissipated for the same level of performance. However, MCM approaches still suffer from additional problems, such as, bulky packaging, wire length and wire bonding that gives rise to stray inductances which interfere with the operation of the system module.
Typically, optimization of Cu bonding was achieved by utilizing one pattern density with specific bond pad dimensions and/or via dimensions. Vias and electrically connected pads refer to vias/pads with a plated hole that connects conductive tracks from one layer of a chip to another layer(s). Current solutions are not compatible with standard CMOS processes in which a variety of pattern densities and pad/via sizes may be used. Additionally, due to mechanical stability issues most of the bonding fails occur at the edge of the bonded pattern which often, in addition to degraded bonding yield, leads to corrosion issues. Additionally, for 3D applications, a method or device is needed to provide additional protection from mechanical damage (such as crack propagation, chipping, dicing, etc.) caused during the semiconductor fabrication process.
In the current state of the art, electrically active bonded pads and/or vias had to be often placed in the central location of the pattern to provide good reliability for these contacts. One major challenge of three dimensional (3-D) wafer-to-wafer vertical stack integration technology is the metal bonding between wafers and between die in a single chip, and the wafer protection from possible corrosion and contamination caused or generated, by process steps after the wafers are bonded from reaching active IC devices on the bonded wafers.
Therefore, a need exists to erect a barrier structure by the edge of bonded wafers and individual die to protect the bonded wafers and die against corrosion and contamination in a three-dimensional (3-D) wafer-to-wafer vertical stack. It would also be desirable to provide an improved metal bonding method having acceptable bonding yield and reliability without being limited to pattern density or pad/via dimensions.

Hermetic seal and reliable bonding structures for 3D applications

International Business Machines Corporation


The invention relates to a process for preparing a heat treatment atmosphere by a catalytic reaction in a catalytic reactor (16) between a first gas mixture (12) containing oxygen and a second gas mixture (26) containing a hydrocarbon, characterized in that the catalytic reactor is arranged in substantially vertical position and in that the reaction mixtures are introduced into the catalytic reactor through the bottom (19) of the reactor with recovery of the heat treatment atmosphere resulting from the reaction at the top (20) of the reactor.

(i) Field of the Invention
The present invention relates to the field of the atmospheres used in heat treatment furnaces. More particularly, it is concerned with atmospheres as afforded by the deoxygenation of an oxygen-containing gas mixture (such as, for example, consisting of air, or a mixture of air and cryogenically obtained nitrogen, or an impure nitrogen produced by the separation of air by permeation or adsorption) by the reaction of this mixture with hydrocarbon in a catalytic deoxygenation reactor.
These atmospheres usually contain a majority species which is generally nitrogen, which may be supplemented, depending on the type of heat treatment performed and the nature of the treated materials, with additional more or less active species such as H.sub.2, CO, H.sub.2 O, CO.sub.2, or hydrocarbons.
(ii) Description of Related Art
In EP-A 482,992 the applicant proposed a catalytic method for preparing such heat treatment atmospheres in which the reaction of impure nitrogen+hydrocarbon is carried out over a precious metal-based catalyst at a temperature between 400.degree. C. and 900.degree. C.
Studies pursued by the applicant on this subject showed that the performance of this process required improvement, particularly in the following areas:
improvement in the composition of the prepared atmosphere in order to decrease when necessary the concentration of oxidizing species and decarburizing species such as CO.sub.2 and H.sub.2 O; and PA1 improvement in the operating conditions for the catalyst for the purpose of extending its life. PA1 better control of the reactions taking place within the catalytic reactor; PA1 a more favorable temperature distribution within the catalyst, which functions to prolong its life and improve its performance. PA1 CH.sub.4 +O.sub.2 .fwdarw.CO.sub.2 +2H.sub.2 PA1 CH.sub.4 +2O.sub.2 .fwdarw.2H.sub.2 O+CO.sub.2 PA1 CH.sub.4 +H.sub.2 O.fwdarw.CO+3H.sub.2 PA1 CH.sub.4 +CO.sub.2 .fwdarw.2CO+2H.sub.2 PA1 i) The heat introduced by the reactor's electric heating resistances naturally has a tendency to rise from the bottom of the reactor toward the top of the reactor (natural convection). PA1 ii) Moreover, this heat, which thus accumulates in the top part of the reactor, in fact accumulates in the zone where the exothermic reactions that consume little energy occur, which as a consequence does not favor the endothermic reactions which as previously noted are essentially localized in the lower part of the reactor. PA1 results in a more homogeneous temperature profile within the catalyst, thus limiting the formation of hot spots; PA1 results in a lowering of the amounts of carbon dioxide and water vapor in the prepared atmosphere; and PA1 all other operating conditions being held the same, results in the possibility as desired of lowering the setpoint for the catalyst heating temperature by tens of degrees, which unquestionably represents an economic advantage. PA1 the heat treatment atmosphere exiting the catalytic reactor, between exit from this reactor and arrival of the atmosphere at the use location or at a storage location: PA1 the oxygen-containing first gas mixture, before its entry into the bottom of the catalytic reactor. PA1 a source of an oxygen-containing first gas mixture; PA1 a source of a hydrocarbon-containing second gas mixture; PA1 a catalytic reactor for gas deoxygenation; PA1 an inlet conduit system suitable for supplying the catalytic reactor with the first gas mixture and second gas mixture; PA1 an outlet conduit system suitable for removing from the catalytic reactor the heat treatment atmosphere resulting from the reaction in the reactor between the first gas mixture and the second gas mixture; PA1 which is characterized in that the catalytic reactor is incorporated into the installation in substantially vertical position, and in that the inlet conduit system is connected at its downstream end with the bottom of the reactor and the outlet conduit system is connected at its upstream end with the top of the reactor.

Process and installation for preparing a heat treatment atmosphere

L'Air Liquide, Societe Anonyme Pour L'Etude et L'Exploitation des Procedes Georges Claude


A light emitting diode module structural and a manufacturing method thereof are disclosed. The manufacturing method includes the steps as follows. A base and a light emitting diode die are provided. The light emitting diode die may include a first semiconductor layer and a second semiconductor layer. The light emitting diode die is disposed on the base. A buffer layer is formed to cover the light emitting diode die. A first opening and a second opening are formed on the first semiconductor layer and the second semiconductor layer, respectively. The second opening exposes the second semiconductor layer by penetrating the first semiconductor layer. A conductive pattern layer is formed on the buffer layer, and is electrically connected with the first semiconductor layer and the second semiconductor layer via the first opening and the second opening, respectively.

1. Field of the Invention
This application relates to a light emitting diode die module structure and a manufacturing method thereof, and more particularly, to integration and a one-time completed structure of a light emitting diode die and a manufacturing method thereof.
2. Description of the Related Art
Regarding the conventional method of manufacturing the light emitting diode module, it is mainly to form the necessary circuit on a substrate firstly, and when contacts are reserved on the circuit and the light emitting diode die is attached to a predetermined position on the substrate. Afterwards, the contacts on the light emitting diode die and that on the circuit are connected by bond wires.
The structure of the aforementioned module may be able to accomplish objective of the modulation design, but the heat conductivity between the light emitting diode die and the substrate may become badly off as sapphire layer with a certain thickness which is disposed therebetween. Besides, the bond wire is of tiny thread diameter, resulting that the thermal energy generated in a light emitting state of the light emitting diode die may hence incapable of being dissipated via the bond wire. As a result, the component quality may be degraded easily as the duration under a long-term high temperature condition.
In addition, the light emitting diode die is formed by disposing electrodes thereon, and when manufacturing a light emitting diode module, it is firstly to form a buffer layer (or a protective layer) on the light emitting diode die and then form openings on the buffer layer corresponding to the electrodes for further wire bonding. The size of the electrode, however, is extremely tiny, and for the sake of promoting the percentage of alignment, the size of the corresponding opening on the buffer layer may be designed larger to ensure that the electrode can be exposed sufficiently. But the oversized opening may lead to a lower open rate of the light emitting diode module, as well as to cause a requirement for higher alignment precision between the opening and the electrode.

Light emitting diode module structure and manufacturing method thereof


The present invention relates to a process for thinning a semiconductor wafer. Two surfaces of the wafer separately form a surface-bond glue (layer) and a surface protective glue (layer). The thinning process is applied to the wafer before forming the surface protective glue. Once the baking and drying process is applied to the surface-bond glue and the surface protective glue it then cuts the wafer. Finally, it dissolves the lower solubility of the surface protective glue to obtain the finished goods. The necessity of the selection of the wafer may serve to maintain quality standards. The wafer thinning process of the present invention is suitable for the extremely thin wafer. Thus, it reduces the production cost.

1. Field of the Invention
The present invention relates to a process for thinning a wafer, it relates to a wafer thinning process for reducing cost.
2. Description of the Prior Art
Please refer to FIG. 1, after the crystal column was cut into a plurality of the laminated wafer sheets, this laminated wafer sheet then undergoes a process of grinding and polishing, this process states as follows:
At step S11:
Grinds the wafer, the purpose of this step is to polish the surface of the wafer.
At step S12:
Washes and grinds the surface of the wafer in order to remove the residual impurity of the wafer surface.
At step S13:
Applies a thermal process to the wafer in order to remove the residual stress on the wafer surface, and then to improve the surface structure.
At step S14:
The final inspection of the wafer includes the process of polishing, washing and thermal treatment, to ensure the highest product quality before product release.

Grace Semiconductor Manufacturing Corporation


The present invention provides improved diverter assemblies (10) designed for installation on liquid-conveying conduit sections (12) having one or more joints susceptible to leakage of liquid. The assemblies (10) include a plurality of mating housing sections (34, 36) which are releasably interconnected and in surrounding relationship to the conduit sections (12) on opposite sides of the conduit joint(s) to form an overall housing (35) defining anon-sealed enclosure. The housing (35) is equipped with a sump (72) which gravitationally collects escaped liquid. The sump (72) includes a drain outlet (74) for conveying the collected liquid away from the conduit sections (12) for collection or reuse.

1. Field of the Invention
The present invention is broadly concerned with leak diverter assemblies used to divert and collect liquids escaping from a failed joint in a liquid-conveying conduit, pipe, or other structure (referred to generically herein as a "conduit"). More particularly, the invention is concerned with such assemblies, the combination thereof with jointed conduits, and corresponding methods, wherein the diverter assemblies include a housing installed on a conduit to provide a non-sealed enclosure about the conduit, and where the housing includes a drain sump for continuously diverting and collecting leaking liquid. The invention finds particular utility in the protection of jointed oil-conveying conduits associated with substation transformer oil tanks.
2. Description of the Prior Art
Substation electrical transformers include large tanks for holding oil used to cool the transformer during operation thereof. In order to maintain the oil temperature at an appropriate level, it is necessary to continuously circulate the oil from the tank to a heat exchanger. Consequently, conduits are provided between the oil tank and the heat exchanger for handling the flow of oil from the tank to the heat exchanger, and vice-versa. Such conduits typically include a short, flanged stub pipe extending from the oil tank and connected with similarly flanged conduits leading to and from the heat exchanger. These flanged connections or joints are sealed by use of elastomeric O-rings or similar expedients.
Over time, the joints tend to leak oil, usually owing to failure of the O-rings or other sealing devices. This presents a series of significant problems. For example, the leaking oil is an environmental hazard which must be controlled. The straightforward solution of replacing the joint seals is not a realistic proposition in the context of substation transformers. That is, these transformers cannot be easily taken out of service without significant disruptions in electrical output from the substation. Moreover, any effort to replace the joint seals necessitates some means of collecting the very large amount of oil within the transformer oil tank. As a consequence, utilities have not heretofore been able to effectively deal with oil conduit leaks, and have been forced to "live with" the problem. In one reported instance, a substation transformer has been leaking oil in this fashion since 1969, and the utility has been unable to adequately deal with the problem over four decades.
Efforts have been made in the past to provide a way of dealing with liquid-conveying conduit sections having one or more joints susceptible to liquid leakage, both in the context of transformer oil tank conduits and in other areas. Generally speaking, these efforts have been characterized by attempts to provide fully sealed structure which is mounted on the conduits in surrounding relationship to the leaking joint. The goal is thus to contain the leaking liquid in the belief that such would provide a permanent solution.
For example, AU 2009/100938 describes leakproof structure to be applied to an oil-conveying pipe. The intent is to thus contain leaking oil within a housing surrounding the conduit joint. However, this does not provide a permanent solution, inasmuch as the housing seals themselves will ultimately fail. Likewise, KR 2009/0038160 describes a pipe connection cover assembly designed to prevent escape of leaking fluid through use of an end-sealed housing disposed about a conduit joint. Other references of interest include U.S. Pat. Nos. 5,141,256, 6,305,719, 6,789,584, and 7,464,728, and U.S. Patent Publication No. 2004/0118467.
There is accordingly a need in the art for an improved apparatus and method for effectively dealing with liquid conveying conduits having joint(s) susceptible to leakage, and especially conduits which cannot readily be repaired, such as substation transformer oil-conveying conduits.

Leak diverter assembly for substation transformers


Sizing agent-free tangled multifilament yarn with an opening length of 1 to 6 cm and a knot strength of no more than 2, at least the majority of whose filaments have a thin film consisting mainly of hard wax constituting about 0.3 to 2% of the total weight of the filaments together with this film, and are glued, at least in places, via this film to adjacent filaments.

1. Field of the Invention
The invention relates to a sizing agent-free tangled multifilament yarn.
2. Description of Related Art
Tangled multifilament yarns are sufficiently familiar. They are generally manufactured by means of blowing with a fluid, preferably air. The disadvantage of normal tangled multifilament yarns is that they lend themselves only conditionally to subsequent processing. For example, if tangled multifilament yarns are employed as warp yarns in weaving, they are subject to a large number of stresses, as portrayed in detail in the introduction to DE-A-43 27 371. In order to limit these stresses such that as few disruptions as possible arise during weaving, this specification recommends the use of stabilized sizing agent-free multifilament yarns. All multifilament yarns are considered to be stabilized which, under the warp thread tensions occurring as a result of the stresses on the loom and even in the plain weave L1/1, which is classified as particularly critical, can be worked with practically no disruptions with high end spacing, e.g., with an end spacing of 40/26 threads per cm warp/weft, not only on traditional loom systems, but most especially on modern loom systems based on weft insertion via air or water. According to DE-A-43 27 371, all yarns which only possess protective twist and which are rubbed, heat-sealed, glued, melted together or, more especially, intermingled, are suitable for use as stabilized multifilament yarns. In order to weave the yarns described therein, care must be taken that the thread tension of the multifilament yarn does not exceed 1 cN/dtex throughout the processing and until it passes through the weaving reed. Thus, in DE-A-43 27 371, no mention is made of a special method by which a multifilament can be especially well stabilized, but instead it is pointed out that evidently the usual yarns can be used, as long as the thread tension of the yarns is selected low enough during subsequent processing. However, since the thread tensions in looms, especially in looms based on weft insertion via air or water, are predetermined by the construction of the machine and can only be influenced to a small degree, the method suggested therein seems hardly to be practicable.
Another well-known method of making multifilament yarns suitable for weaving consists of providing the multifilament yarns with sizing agents in a separate step prior to weaving, which must, however, be washed out of the finished fabric again after weaving. JP-A-52 63 334 makes known, for example, the method of initially tangling the multifilament yarns in order to obtain an opening length of 2 to 5 cm (20 to 50 knots per meter), after which they are provided with sizing agent amounting to 0.5 to 3%. As a separate process step is necessary for applying the sizing agent, i.e., sizing cannot be combined with the process steps required for manufacturing and subsequent processing, sized yarns are very expensive to manufacture. As already explained, an additional step, namely, removal of the sizing agent, is also required after weaving. In addition, in a further expensive step, the sizing agent must then be removed from the washing water in order to protect the environment.
Furthermore, JP-A-41 63 336 makes known the method of adding waxes such as carnauba wax, beeswax or candelilla wax to the sizing agent which is applied to the tangled multifilament yarns. By mixing sizing agent with wax, however, processing the washing water with which the sizing agent is washed out of the finished fabric, becomes even more expensive.

Sizing agent-free tangled multifilament yarn and process for its manufacture


A replacement heart valve structure including a structure of tissue which is an intact, mammalian heart valve that has been harvested and treated to preserve it. A conventional fabric sleeve is typically disposed concentrically around the outside of the tissue structure. A support structure is included to facilitate implanting the heart valve by somewhat increasing the stability of the heart valve structure, but without unduly rigidifying it. An annular sewing cuff may be added adjacent the blood inflow end of the valve structure to facilitate making the annular suture line that is required at that end.

One of the known techniques for replacing a heart valve in a human patient is to use a valve harvested from another mammal. Although the invention will be described for the most part with reference to replacing a patient's aortic valve (i.e., the valve between the left ventricle and the aorta), the principles of the invention can be adapted to other heart valve replacement procedures. Similarly, although heart valves harvested from pigs (porcine heart valves) are generally used, valves harvested from other mammals are possible alternatives.
In a known technique, a heart valve is harvested intact from a pig and treated to preserve it. (All references herein to such heart valves will be understood to include the immediately adjacent tissue, so that the structure thus referred to is an intact tube of tissue with the valve leaflets inside.) A so-called "stentless valve" is constructed by stitching a sleeve of fabric substantially concentrically around the outside of the harvested and preserved valve tissue. The resulting composite structure is sutured into the patient at the location from which the patient's natural valve leaflets have been removed. Two annular suture lines are typically employed. (Terms like "annular" and "annulus" are used herein solely as geometrical terms, and not to refer to any anatomical location or structure.) One suture line is located annularly around the valve adjacent the blood inflow ("proximal") end. The other suture line is located annularly around the valve adjacent the blood outflow ("distal") end. These two suture lines are generally regarded as necessary to ensure that there is no leakage of blood around the valve. The outflow suture line is also generally regarded as necessary to pin the commissure posts of the valve back (i.e., radially outward) against the root of the patient's aorta. The commissure posts of the valve are typically relatively long and flexible, and if they are not pinned back, they can fold over onto the valve leaflets in an undesirable way (e.g., impacting the leaflets and causing unnecessary wear). Over time (after implantation) the patient's natural body tissue is believed to advantageously grow into the fabric sleeve around the other material of the valve (i.e., the harvested and preserved valve tissue).
The high degree of flexibility of stentless valves of the type described above is believed to be beneficial to the patient. Such valves may compare favorably to the more rigid valves known as "stented" valves in respects such as the following: The rigidity of stented valves may stress the leaflets in the valve, which can cause tearing or calcification of the leaflets, which in turn can shorten the life of a stented valve. However, the stentless valves described above are thought by some to be somewhat more difficult to implant than stented valves or mechanical valves. As has been mentioned, stentless valves typically require two annular suture lines, whereas stented valves typically require only one annular suture line near the proximal end (because of the considerable stiffness imparted to the valve by the stent (typically metal) that forms part of the valve structure). Also, the high degree of flexibility of stentless valves can allow the commissure posts of the valve to fold down in the surgeon's way during placement of the first (inflow) suture line, and/or to permit one or more of those posts to be slightly mislocated when the final (outflow) suture line is made, with the possible result that the finally implanted valve may not close as completely and perfectly as it otherwise would.
In view of the foregoing, it is an object of this invention to improve heart valves of the stentless type described above.
It is another object of the invention to provide stentless heart valves that are more easily and more reliably implanted.


Features are disclosed for transferring the presentation or playback of content from device to device. The content may include, but is not limited to, aural, video, and multimedia content. A personal device may be detected playing content. A current play position of the content can be obtained, and playback can be halted. The play position can be transferred to a media device wherein playback is automatically resumed. Additionally, the playing of content may be transferred between two or more media devices, for example in response to the movement of a user. Personal device movements and content operations may be monitored in order to determine improvements to the automatic transfer of content consumption from device to device.

A personal device, such as a mobile phone, media player, or tablet computer, can be used to consume content while a user of the device is travelling. The content can include aural content, such as music and audio books, or it may be rich multimedia content, such as movies, video games, and the like. Personal devices, while often mobile and efficient, may have limited functionality and content consumption capabilities, including small or low resolution displays, low quality speakers, and limited computing power. Purpose-built media devices, such as televisions, stereos, video game systems, and desktop computers provide rich content consumption experiences. The media devices can have large high definition displays, high fidelity audio processing equipment and speakers, and large amounts of computing power.
Conventionally, if a user is viewing or listening to content via a personal device, such as a mobile phone, and wants to instead consume the content on an alternate media device, the user may have to manually load the content for playback on the alternate media device, and using the alternate media device, locate the point from which to resume playback of the content based on a current play position on the personal device (e.g., by fast forwarding playback of the content on the media device until the desired play position is reached). Some personal devices allow a user to manually instruct a given personal device playing back content to stream the content to another media device, which may then output the content to the user. For example, a user listening to music via a suitably equipped MP3 player may instruct the MP3 player to stream the music to a home stereo system for output on the speakers of the stereo. In such systems the execution and playback of the content continues to originate from the personal device, and the user needs to manually instruct the personal device at the desired time of playback to stream the content to the alternate media device.

This patent is subject to a terminal disclaimer.

Automated transition of content consumption across devices


A radiant electric heater arrangement is provided for connection to a dual voltage supply which provides a first alternating current supply voltage and a second alternating current supply voltage higher than the first. The arrangement includes a heater having at least one heating element and a manually operable multiple discrete position switch means for manually selecting in sequence a predetermined number of discrete different power settings for the at least one heating element from the voltage supply. The arrangement further includes control means co-operating between the switch means and the supply whereby in each position of a first sequential series of discrete positions of the switch means the at least one heating element is selectively energisable from the first supply voltage in such a way that at least one selected proportion of half cycles in a predetermined number of half cycles of the first supply voltage is or are arranged for application to the at least one heating element, and further whereby in each position of a second sequential series of discrete positions of the switch means, following the first sequential series, the at least one heating element is selectively energisable from the second supply voltage in such a way that at least one selected proportion of half cycles in a predetermined number of half cycles of the second supply voltage is arranged for application to the at least one heating element. In this way a stepwise increase in power output from the heater is obtainable in operation from one position of the switch means to the next through the first and second sequential series of switch positions.

Radiant electric heaters are well known in which one or more heating elements are supported, for example, on or above a layer of thermal insulation material in a metal dish. Heaters of this kind generally incorporate one or more heating elements selected, for example, from: coiled bare resistance wire; metal ribbon, particularly of corrugated form; infra-red lamp(s).
Such heaters are typically incorporated in cooking, or other heating, appliances having a flat glass-ceramic cooking/heating surface.
Different power levels have been provided by including two or more heating elements in the heater, with a switch arranged to couple the elements into different series and/or parallel configurations in different switch positions.
In designing such heaters various different and possibly conflicting requirements must be accommodated. The resistances of the different heating elements must be chosen so that differing combinations of the elements produce power levels which together form an appropriately distributed sequence between zero and full power. In particular it has been found generally desirable to include a very low power level, of the order of 5 percent of full power. Where possible the intensity of visible light radiation produced by the energised elements at each power setting should be indicative of the power level at that setting; in addition it may be desirable that one or more elements should be energised sufficiently to produce some visible radiation for as many power settings as possible, to provide assurance to the user that the heater is functioning. This is particularly the case for any infra-red lamp heating element that may be included in the heater; the presence of an infra-red lamp element in an appliance typically results in a premium price, so the user is likely to expect that element to be visible in use.


An exemplary backlight module (100) includes a housing (10), a reflective sheet (30), a number of point light sources (20). The housing includes a bottom plate (12) and at least one platform support (14) extending out from the bottom plate towards an interior of the housing. The reflective sheet is supported by the platform support, and defines a number of through holes (301). The point light sources are arranged in the housing corresponding to the through holes of the reflective sheet. Each point light source includes a base portion (22) and a light emitting portion (24). The base portion is secured at the bottom plate of the housing, and the light emitting portion protrudes through a corresponding one of the through holes.

1. Field of the Invention
The present invention generally relates to a direct type backlight module with point light sources, the direct type backlight module typically being used in a liquid crystal display (LCD) device.
2. Discussion of the Related Art
Most liquid crystal display (LCD) devices are passive devices in which images are displayed by controlling an amount of light input from an outside light source. Thus, a separate artificial light source (for example, a backlight module) is generally employed for irradiating an LCD panel that has the LCD device.
Generally, backlight modules are classified as edge type or direct type, based upon the arrangement of one or more lamps thereof. The edge type backlight module has a lamp arranged at a side portion of a light guiding plate that is used for guiding light. The edge type backlight module is commonly employed in small-sized LCDs because it is lightweight, small, and has low power consumption. However, the edge type backlight module is generally not suitable for large-sized LCDs (20 inches or more). A direct type backlight module usually has a plurality of lamps arranged in a regular array. The lamps directly illuminate an entire major surface of a light guiding plate. The light passes directly through the light guiding plate to illuminate an LCD panel. Direct type backlight modules have a higher efficiency of utilization of light energy and a longer operational service life than edge type backlight modules, and are commonly produced for large-sized LCDs.
The lamps of the direct type backlight module can be selected from the group consisting of cold cathode fluorescent lamps (CCFLs) and light emitting diodes (LEDs). LEDs provide a purer color, have a lower operation voltage, and are lighter compared to CCFLs. Thus LEDs are more commonly used in direct type backlight modules.
Referring to FIG. 10, a typical direct type backlight module is shown. The backlight module includes a housing 210, a plurality of LEDs 220 acting as light sources, a reflective sheet 230, a first optical sheet 240, a second optical sheet 250, and a third optical sheet 260. The LEDs 220 are arranged in the housing 210 at selected intervals. Each LED 220 includes a base portion 222 and a light emitting portion 224. The light emitting portion 224 is made of a plastic material. The first, second and third optical sheets 240, 250 and 260 can be selected from the group consisting of a diffusion panel, a diffusion sheet, and a prism sheet. The first, second and third optical sheets 240, 250 and 260 are arranged above the LEDs 220 in that order. The reflective sheet 230 defines a plurality of through holes (not labeled). The light emitting portions 224 of the LEDs 220 protrude through the corresponding through holes of the reflective sheet 230.
In the above-described backlight module, the reflective sheet 230 is substantially a plastic thin sheet. Thus, a metal sheet 270 is disposed beneath the reflective sheet 230 for supporting the reflective sheet 230. However, the metal sheet 270 increases a weight and a cost of the backlight module. In addition, the metal sheet 270 itself is thin and easily deformed. If the metal sheet 270 is accidentally bent, it is difficult to restore the metal sheet 270 to its original flatness. The deformed metal sheet 270 may displace the light emitting portions 224 of the LEDs 220, and may cause deformation of the reflective sheet 230. Either of these problems is liable to result in a lower efficiency of utilization of light emitted by the light emitting portions 224. Furthermore, in order that the metal sheet 270 can engage with the LEDs 220, a plurality of installation holes are defined in the metal sheet 270. When the metal sheet 270 is assembled in the backlight module, the light emitting portions 224 are liable to be damaged by the metal sheet 270 at the installation holes. This is because the light emitting portions 224 are made of plastic material.
Therefore, a new backlight module is desired in order to overcome the above-described shortcomings.

Direct type backlight module with platform support for optical plate


The present invention provides an aqueous ophthalmic composition containing (A) a terpenoid, (B) zinc chloride, and (C) at least one member selected from the group consisting of cellulose-based polymeric compounds, vinyl-based polymeric compounds, polyethylene glycols and dextran. According to the present invention, an aqueous ophthalmic composition is provided in which adsorption of the terpenoid to a container can be inhibited, thereby making it possible to inhibit the reduction in the terpenoid content for a long period of time, the aqueous ophthalmic composition having some excellent actions such as an inhibitory action for histamine release, and an inhibitory action for discharges from the eyes.

In ophthalmic compositions, a terpenoid such as menthol is contained in order to give a refreshing feel. However, when an ophthalmic composition containing a terpenoid is filled in a plastic container or the like, the terpenoid adsorbs to the container during storage, so that the content of the terpenoid is reduced. The reduction in the content of the terpenoid has some disadvantages of impairing feel of use because the reduction greatly influences the senses of the ophthalmic compositions, and further impairing qualities of the ophthalmic compositions. On the other hand, a method of inhibiting adsorption of a terpenoid to a plastic container by adding a surfactant (Patent Publications 1 and 2). However, surfactants may irritate ocular mucous membranes, so that it is said that some side effects are caused, such as disorders are caused in the cornea if, for example, eye drops containing surfactants are frequently dropped or if individuals having disorders in the cornea or individuals whose teard flow is are not normal showing dry eye symptoms and the like are dropped, so that there are some concerns in the aspect of safety.
On the other hand, a zinc salt such as zinc sulfate or zinc lactate has constrictive actions and anti-inflammatory actions, and has been used widely in eye drops as constrictive agents and anti-inflammatory agents, and zinc chloride or zinc sulfate has also been known as a bactericidal agent. However, the influences which these components would have on the aqueous ophthalmic compositions containing terpenoids have not been elucidated.


A sun tracking solar energy collection system can include torque tubes that can be configured to allow the cylindrical body of one torque tube to nest with projections extending from an adjacent torque tube. The torque tubes can be formed with a plurality of rotatable shafts connected to each other in an end to end fashion. The torque tubes may be connected with coupling flanges, shaped with a plurality of radially extending lobes. The coupling flanges can include a plurality of concave portions disposed between adjacent lobes. The rotatable shafts can be round and the concave portions can be curved with a radius of curvature that is about the same as a radius of curvature of outer surface of the rotatable shafts. The torque tubes can also have saddle mounts which can include a concave portion configured to nest with an adjacent torque tube.

Some known sun tracking photovoltaic solar power systems, such as utility-scale, photovoltaic installations, are designed to pivot a large number of solar modules so as to track the movement of the sun using the fewest possible number of driver motors. For example, some known systems include parallel rows of photovoltaic modules supported on torque tubes. The torque tubes can comprise a number of long, round shafts connected together in an end to end fashion, typically fabricated out of metal. Existing torque tubes consist of welded saddles mounting photovoltaic modules along the length of the shaft, and coupling flanges at one or both ends of the shaft.
Pre-fabricated torque tubes are often used to improve reliability, quality, and ease of installation. However, existing pre-fabricated torque tube designs have also resulted in a low density shipping arrangement due to an increased amount of packaging material used to protect the torque tubes from unintended movement or damage during storage and transportation. Wood, or other rigid weight-bearing materials, such as planks or blocks serve not only as a packaging material, but also help stabilize stacks of round torque tubes for more efficient storage and transportation.

Nested torque tubes for photovoltaic tracking systems


A guiding device includes a connecting member, a first clamping arm, and a second clamping arm. The first clamping arm defines a first restricting groove and a first receiving groove in an end, and the first restricting groove communicates with the first receiving groove. The second clamping arm defining a second restricting groove and a second receiving groove in an end, and the second restricting groove communicates with the second receiving groove. The first clamping arm and the second clamping arm are rotatably connected to the connecting member. When the first clamping arm resists the second clamping arm, the first restricting groove and the second restricting groove cooperatively form a guiding portion. The first receiving groove and the second receiving groove cooperatively form a receiving portion. The receiving portion is substantially perpendicularly to the guiding portion to form a T-shaped groove.

1. Technical Field
The present disclosure relates generally to guiding devices and, more particularly, to a guiding device for assembling screws.
2. Description of Related Art
In the manufacturing field, screws are used to connect two or more separate components. The screws are generally screwed into the components via a screw machine, in order to improve the assembling efficiency. The screw machine has a guiding device to ensure assembling the screws are assembled accurately.
A typical guiding device includes a guiding tube and an assembling tube. The guiding tube is obliquely connected and communicates with the assembling tube. A screw driver is partially received in the assembling tube. In use, the screws pass through the guiding tube, and enter in the assembling tube. The guiding tube is configured to guide the screw into the assembling tube, so that a screw cap of the screw can be opposite to the screw driver in the assembling tube. The screw driver drives the screws to engage in the components accurately.
However, when a length of the screws is equal to or less than a width of the screw caps, the screws may turn over in the guiding tube. Therefore, the screw cap may be not opposite to the screw driver in the assembling tube, and the screws may not face holes of the components, thus can not be engaged in the components driven by the screw driver.
Therefore, a guiding device which overcomes the above-described shortcomings is desired.

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.