An apparatus for retorting granulated material containing mercury such as ores and precipitates wherein the granulated material is stirred by means of a plurality of paddles while under vacuum and at high temperature within a drum of the apparatus. The vaporized mercury is drawn from the drum and condensed for recovery thereof. Multiple retorting apparatuses can be used for a continuous retorting operation.

1. Field
The field of the invention is retorting apparatus and methods for removal of mercury from ores and mercury contaminated materials.
2. State of the Art
Mercury is a toxic material to many living organisms, including humans, and its presence in ores or in other materials constitutes a hazard when such materials are processed. Thus extraction of valuable metals such as silver and gold from ores is often complicated by the presence of mercury. The mercury is generally in elemental form, or alloy form (amalgam), or as a sulfide and is easily vaporized. Since the refining of such ores often involves the application of heat, the mercury tends to change to highly toxic vapor.
Removal of the mercury by retorting involves the application of heat to the ore or other mercury bearing material to cause this vaporization. The ore is heated in a reduced pressure environment to accelerate the vaporization. However, although mercury is relatively easily vaporized by contact with high temperature gases such as air, it is difficult to create enough actual liquid mercury contact with the hot gases because both mercury vapor and liquid inherently resist migration through the ores, even though the ores are finely ground. Because of this characteristic, prior art methods of ridding ores of mercury by heating under vacuum is a slow process. The mercury bearing material must be spread very thinly upon trays or pans within the heating oven before the mercury can be thoroughly removed. The toxic nature of the mercury vapor adds to the difficulty of retorting using such pans. Access to the pans for manual stirring in the high temperature vacuum environment is virtually impossible. The oven must be shut down, and allowed to thoroughly cool before the trays can be removed and replaced with fresh unretorted material.
There is therefore a strong need for a method of retorting mercury bearing materials using elevated temperatures and lowered pressure which is not limited by the requirements of prior art retorts for treating only very thin layers of the material.

Apparatus for removal of the mercury from granulated materials

Summit Valley Equipment and Engineering, Inc.


This superconducting wire includes: a strand including a superconducting material; and a stabilizer material for superconductor arranged in contact with the strand, wherein the stabilizer material for superconductor includes a copper material which contains one kind or two kinds or more of additive elements selected from Ca, Sr, Ba, and rare earth elements (RE) for a total amount of 3 ppm by mass or more and 400 ppm by mass or less, with the remainder being Cu and unavoidable impurities, the total concentration of the unavoidable impurities other than O, H, C, N, and S, which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, and compounds including one kind or two kinds or more selected from CaS, CaSO4, SrS, SrSO4, BaS, BaSO4, (RE)S, and (RE)2SO2 are present in the matrix.

The superconducting wire described above is, for example, used in fields such as MRI, NMR, particle accelerators, maglev trains, and power storage apparatuses.
This superconducting wire has a multi-core structure in which a plurality of strands consisting of a superconducting material such as Nb—Ti or Nb3Sn are bundled with a stabilizer material for superconductor interposed therebetween. In addition, a tape-shaped superconducting wire in which a superconducting material and a stabilizer material for superconductor are laminated is also provided. In order to further improve stability and safety, a superconducting wire including a channel member consisting of pure copper is also provided.
In the superconducting wire described above, in the case when the superconducting state is destroyed in a part of the superconducting material, the resistance increases greatly at that part, and thereby, the temperature of the superconducting material increases, and there is a concern that the temperature of the entire superconducting material exceeds the critical temperature and transition to a normal conducting state occurs. Therefore, in the superconducting wire, a stabilizer material for superconductor having a comparatively low resistance such as copper is arranged so as to be in contact with the superconducting material (strands). In the case when the superconducting state is partially destroyed, the current flowing through the superconducting material is temporarily bypassed to the stabilizer material for superconductor and the superconducting material is cooled to return to the superconducting state in the meantime.
The structure of the superconducting wire consists of wire strands of the superconducting material represented by Nb—Ti or Nb3Sn and the stabilizer material for superconductor consisting of a copper material which are processed so as to be in contact with each other, and in which the plurality of strands including the superconducting material and the stabilizer material for superconductor are processed to be a single structural body. This process includes extrusion, rolling, wire drawing, drawing, and twisting.
In the stabilizer material for superconductor described above, in order to efficiently bypass the current, it is required that the resistance at extremely low temperatures be sufficiently low. Residual resistance ratio (RRR) is widely used as an indicator of electric resistance at extremely low temperatures. The residual resistance ratio (RRR) is the ratio ρ293K/ρ4.2K of the electrical resistivity ρ293K at room temperature (293 K) to the electrical resistivity ρ4.2K at the temperature of liquid helium (4.2 K), and the higher the residual resistance ratio (RRR) is, the better the performance as a stabilizer material for superconductor is exhibited.
For example, Japanese Unexamined Publication No. H04-224662, Japanese Unexamined Publication No. 2011-236484 and Japanese Unexamined Publication No. H05-025565 propose a Cu material having a high residual resistance ratio (RRR).
Japanese Unexamined Publication No. H04-224662 discloses that a copper material having a high residual resistance ratio (RRR) is obtained by heating a copper material having a purity of 99.999% or more at temperatures of 650 to 800° C. in an inert gas atmosphere for at least 30 minutes or more. Japanese Unexamined Publication No. 2011-236484 proposes a high-purity copper having an extremely low impurity concentration in which the amounts of specific elements (Fe, P, Al, As, Sn and S) are defined.
In addition, Japanese Unexamined Publication No. H05-025565 proposes a Cu alloy in which a trace amount of Zr is added to high-purity copper having a low oxygen concentration.
It is known that the residual resistance ratio (RRR) is sufficiently high in an ultra-high purity copper where amounts of impurity elements are reduced to an extremely low level. However, there are problems in that, in order to purify copper to a high degree of purity, the production process becomes extremely complex and the production costs greatly increase.
Japanese Unexamined Publication No. H04-224662 shows a method of producing pure copper or a copper alloy having a high residual resistance ratio (RRR) using pure copper having a purity of 99.999% or more, but there is a problem in that the pure copper having a purity of 99.999% or more is used as the raw material; and thereby, the production costs greatly increases.
In addition, in Japanese Unexamined Publication No. 2011-236484, the amounts of the specific elements (Fe, P, Al, As, Sn and S) are limited to less than 0.1 ppm; however, it is not easy to reduce the amounts of these elements to less than 0.1 ppm and the problem in which the production process becomes complex remains.
Furthermore, although the amounts of oxygen and Zr are defined in Japanese Unexamined Publication No. H05-025565, there are problems in that it is difficult to control the amounts of oxygen and Zr and it is difficult to stably produce a copper alloy having a high residual resistance ratio (RRR).
Furthermore, in recent years, there has been a demand for superconducting wires including a stabilizer material for superconductor having a higher residual resistance ratio (RRR) than that in the related art.

This patent is subject to a terminal disclaimer.

Superconducting wire and superconducting coil


A method of grouping retail units of a set of units in a chain uses, store and market-specific characteristics, including store profitability, to group stores into like economic markets. The relation between profits and prices defines markets; stores facing the same relation, that is the same profit function, are in the same economic market. These stores can follow similar pricing and promotion strategies. Multiple regression analysis is used to identify those characteristics that affect the relation between prices and profits (not simply variables correlated with profits). Upon suitable standardization and weighting, these variables are subsequently used with a statistical cluster analysis to classify units in two markets. Based on the estimated relationship and homegenity valuations from discriminant analysis, new stores can be more accurately added to the appropriate group.

In the prior art market segmentation studies often identify characteristics associated with profitability such as urban location, high income area, the existence of a drive through, etc. These studies then determine the effect of these variables on profits. The problem with this technique is that is fails to take into account the effect of prices on profitability.
Accordingly, a need exists to provide an improved method to group stores in common economic markets. The present invention solves this need via a method for assigning retail units to distinct economic markets by identifying observable characteristics that affect the relationship between price and profits, and for using these characteristics to group stores economically.

Method for assigning retail units to economic markets


In an embodiment, a method of forming a gate structure for a semiconductor device includes forming a preliminary gate structure on a semiconductor substrate. The preliminary gate structure includes a gate oxide pattern and a conductive pattern sequentially stacked on the substrate. Then, a re-oxidation process is performed to the substrate having the preliminary gate structure using an oxygen radical including at least one oxygen atom, so that an oxide layer is formed on a surface of the substrate and sidewalls of the preliminary gate structure to form the gate structure for a semiconductor device. The thickness of the gate oxide pattern is prevented from increasing, and the quality of the oxide layer is improved.

1. Field of the Invention
Embodiments of the present invention relate to a method of forming a gate structure for a semiconductor device and a method of a forming a cell gate structure for a non-volatile memory device using the same. More particularly, the present invention relates to a method of forming a gate structure having a minute line width for a semiconductor device and a method of forming a cell gate structure for a non-volatile memory device using the same.
2. Description of the Related Art
In general, semiconductor memory devices are classified into a volatile memory device, such as a random-access-memory (RAM) device and a non-volatile memory device, such as a read-only-memory (ROM) device. This classification is based on whether the data stored in the memory device is erased or not when its power is turned off. Data stored in a volatile memory device such as a dynamic RAM (DRAM) and a static RAM (SRAM) are volatile and erased when power is turned off. Data stored in the non-volatile memory device is not erased and its stored charge is maintained over time even though the power is turned off. While the volatile memory device has a high operation speed, the non-volatile memory device has a relatively low operation speed.
Typically, when a plurality of chips is fabricated on a silicon wafer, each of the chips is individually manufactured into the semiconductor memory device. Recently, as semiconductor devices have been highly integrated to fabricate more chips per wafer, a line width of a feature, such as a gate electrode, in a semiconductor device has been correspondingly reduced.
FIGS. 1 and 2 are cross-sectional views illustrating processing steps for a method of forming a cell gate structure for a conventional non-volatile memory device.
Referring to FIG. 1, a tunnel oxide pattern 12, a first conductive pattern 14, a dielectric interlayer pattern 22, a second conductive pattern 24, a metal silicide layer 26 and a hard mask pattern 28 are sequentially stacked on a semiconductor substrate 10 to form a preliminary cell gate structure 30.
In detail, a tunnel oxide layer is formed on the semiconductor substrate 10, and a first conductive layer is formed on the tunnel oxide layer. The first conductive layer is formed to be a floating gate electrode in a subsequent process. Polysilicon doped in-situ with N type or P type impurities is deposited on the tunnel oxide layer to form a first conductive layer.
Then, a dielectric (or insulating) interlayer is formed on the first conductive layer. The dielectric interlayer is multi-layer, including a first oxide layer, a silicon nitride layer, and a second oxide layer that are sequentially stacked on the first conductive layer, which is conventionally known as an ONO structure. A second conductive layer is formed on the dielectric interlayer, and is formed into a control gate electrode in a subsequent process. Polysilicon doped in-situ with N type or P type impurities is also deposited on the dielectric interlayer, thereby forming the second conductive layer.
A metal silicide layer is formed on the second conductive layer for reducing an electrical resistance of a cell gate structure that is to be formed in a subsequent process. In general, a tungsten silicide layer is formed as the metal silicide layer. Then, a hard mask layer is formed on the metal silicide layer for protecting the cell gate structure. In general, a silicon nitride layer is utilized as the hard mask layer.
Then, the hard mask layer, the metal silicide layer, the second conductive layer, the dielectric interlayer, the first conductive layer, and the tunnel oxide layer are sequentially patterned using a conventional photolithography process including an exposing process, a developing process, an etching process, etc. As a result, the tunnel oxide pattern 12, the first conductive pattern 14, the dielectric interlayer pattern 22, the second conductive pattern 24, the metal silicide layer 26, and the hard mask pattern 28 are sequentially stacked on the substrate 10 to thereby form the preliminary cell gate structure 30. The dielectric interlayer pattern 22 includes a first oxide pattern 16, a silicon nitride pattern 18, and a second oxide pattern 20.
Referring to FIG. 2, a re-oxidation process is performed to the substrate 10 including the preliminary cell gate structure 30. Thus an oxide layer 32 is formed on a surface of the substrate 10 and sidewalls of the preliminary cell gate structure 30 to form a cell gate structure 34. The substrate 10, including the preliminary cell gate structure 30, is loaded into a furnace, and a heat treatment is performed on the substrate 10 at a temperature of no less than about 800° C. and at an atmospheric pressure in an oxidation atmosphere. In general, when an etching process is performed on the layers above the substrate 10 to form the preliminary cell gate structure 30, high-energy ions cause damage to the surface of the substrate 10 and the sidewalls of the preliminary cell gate structure 30. The oxide layer formed by the re-oxidation process compensates for the damage and cures the damaged surfaces. In addition, the oxide layer formed by the re-oxidation process reduces the intensity of an electric field generated at an edge portion of the cell gate structure 34, thus the tunnel oxide pattern 12 in the cell gate structure 34 is prevented from breaking down.
However, when the re-oxidation process is completed, oxidants diffuse into both sidewalls of the tunnel oxide pattern 12 to generate a processing failure at the tunnel oxide pattern 12 known as a bird's beak, denoted as 'a' in FIG. 2. In addition, the oxidants are also diffused into both sidewalls of the dielectric interlayer pattern 22 to generate another bird's beak, denoted as 'b' at the dielectric interlayer pattern 22.
Recently, as semiconductor devices become highly integrated and features of the cell gate structure 34, such as those having a line width 'c' are reduced, the bird's beak extends towards central portions of the tunnel oxide pattern 12 and the dielectric interlayer pattern 22. The extended bird's beak increases the thickness of the tunnel oxide pattern 12 and the dielectric interlayer pattern 22, reducing the operating speed of the semiconductor device.
FIG. 3 is a view illustrating the extended bird's beak in the conventional non-volatile memory device.
When the conventional line width c of the cell gate structure 34 shown in FIG. 2 is reduced to a line width c′ shown in FIG. 3, the oxidants are diffused into the central portion of the tunnel oxide pattern 12 as well as the sidewalls, thus the substrate 10 under the central portion of the tunnel oxide pattern 12 and the first conductive pattern 14 on the central portion of the tunnel oxide pattern 12 are also partially oxidized during the re-oxidation process. That is, the bird's beak at sidewalls of the tunnel oxide pattern 12 is extended into the central portion, and an oxidized area is vertically enlarged in the tunnel oxide pattern 12 to increase the thickness of the tunnel oxide pattern 12.
In addition, the oxidants are also diffused into the central portion of the dielectric interlayer pattern 22 as well as the sidewalls, thus the first conductive layer 14 under the central portion of the dielectric interlayer pattern 22 and the second conductive pattern 24 on the central portion of the dielectric interlayer pattern 22 are also partially oxidized during the re-oxidation process. That is, the bird's beak at sidewalls of the dielectric interlayer pattern 22 is extended into the central portion, and an oxidized area is vertically enlarged in the dielectric interlayer pattern 22 to increase a thickness of the dielectric interlayer pattern 22. For these reasons, programming speed and erasing speed are reduced in the non-volatile memory device.
In addition, a programming threshold voltage differs greatly from an erasing threshold voltage due to a difference of line widths of a plurality of cell gate structures in the non-volatile memory device.
From the theoretical view, the line widths of cell gate structures in a conventional non-volatile memory device are all the same, but actual line widths of the cell gate structures are different from each other in an acceptable processing variation. Accordingly, when the re-oxidation process is performed in a cell gate structure having a relatively small line width, the oxidants are diffused further into a central portion of the cell gate structure than when the re-oxidation process is performed in a cell gate structure having a relatively large line width. That is, the bird's beak is more significant at a cell gate structure having a relatively small line width than at a cell gate structure having a relatively large line width, so that the thickness of the tunnel oxide pattern is proportionally greater at a cell gate structure having the relatively small line width. Accordingly, the thickness of the tunnel oxide pattern varies in accordance with the line width of the cell gate structure, and the thickness variation of the tunnel oxide pattern causes the threshold voltage difference.
Reducing the processing time for the re-oxidation process has been suggested for preventing the diffusion of the oxidants into the central portion of the cell gate structure. However, reducing the processing time also causes a problem in that the tunnel oxide pattern is insufficiently cured to deteriorate a bake-retention characteristic of a non-volatile memory device.

Method of forming a gate structure for a semiconductor device and method of forming a cell gate structure for a non-volatile memory device


A magnetic recording medium having a nonmagnetic polymer substrate, a magnetic layer and a backcoating layer, wherein surface profile of the magnetic and the backcoating layers satisfies the following condition (i), and the nonmagnetic polymer substrate satisfies the following conditions (ii) and (iii): (i) the skewness of the surface roughness profiled of the backcoating layer is greater than that of the magnetic layer; (ii) the nonmagnetic polymer substrate has a molecular orientation ratio of 1.11 or greater; and (iii) the angle between the main axial direction of the polymer chains in the nonmagnetic polymer substrate and the longitudinal direction of the nonmagnetic polymer substrate is 7.degree. or smaller, has excellent electromagnetic conversion characteristics and running stability.

1. Field of the Invention
The present invention relates to a magnetic recording medium, such as a magnetic tape, which can accept high density recording, has a high reproduction output and excellent running stability.
2. Description of the Related Art
A variety of magnetic recording media, such as magnetic tapes (e.g., a video tape) and magnetic disks for computer memories, have been in use. The demand for high performance of these magnetic recording media, particularly the demand for high recording density and running durability has been increasing from year to year.
An increase in recording density is achieved by a reduction in recording wavelength, which can result in insufficient reproduction output. In order to maintain a sufficient output level, it has been proposed to adopt a multilayer structure in which an intermediate layer for improving electromagnetic conversion characteristics is provided under a magnetic layer.
It is essential that the track of a magnetic recording medium in contact with a magnetic head should be stable during running in order to obtain stable output during running. For this purpose it is desirable for the tape to run stably.
In order to obtain a high output in a stable manner in a high-density magnetic recording medium, it has been a practice to provide a recording layer having a multilayer structure and to make the surface of the magnetic layer smooth, i.e., to reduce the surface roughness. However, today's increased recording density has made it more difficult to obtain a sufficiently high output by applying conventional techniques. Further, a mere improvement in surface smoothness causes an increase in the coefficient of friction between a magnetic head and the recording medium, and sticking can occur between them, which impairs running stability.
Related art concerning the surface roughness of a magnetic layer or a backcoating layer in a magnetic recording medium is found in Japanese Patent Laid-Open No. 1914/92 and U.S. Pat. No. 5,547,772. The former discloses a magnetic recording medium having a magnetic layer whose surface roughness is 6 nm or less and a backcoating layer whose surface roughness is 8 nm or less, the backcoating layer having 500 to 5000 projections having a height of 0.05 to 0.8 .mu.m per mm.sup.2. The magnetic recording medium disclosed is not deemed suitable for high-density recording because the magnetic layer is as thick as 3 .mu.m and the total medium is as thick as 13.5 .mu.m. In addition, there is no mention of the molecular orientation ratio of the substrate and the skewness of the magnetic layer and the backcoating layer, as well as no mention of the influences of the molecular orientation ratio and skewness upon the wobbling of a magnetic recording medium in the width direction during running.
U.S. Pat. No. 5,547,772 discloses a magnetic recording medium in which the magnetic layer has a thickness of 1.2 .mu.m or smaller and a surface roughness of 0.006 .mu.m or less. U.S. patent also does not refer to the molecular orientation ratio of the substrate and the skewness of the magnetic layer and backcoating layer, and also does not refer to the influences of these factors on the wobbling of a magnetic recording medium in the width direction during running.


A desktop organization and display stand system generally providing an integrated system for desks and workstations that is convertible between a conventional working surface, and a display shelf to support a variety of objects including electronic media, such as a tablet computer, laptop computer, smart phone, electronic display, flat panel monitor, television, books, magazines, other printed materials, other suitable object and/or electronic media, or any combination thereof.

With the rapid evolution of media and technology in recent years, tablet computers, smart phones and other such electronic media have become major components of everyday life. Such tools are becoming increasingly common for use during educational study and work. Conventional desk systems typically comprise standard, flat desktops, and are generally not designed to accommodate or provide easy access or secure storage for such devices during use.

Desktop organization and display stand system


A platform executing on a computer system configures an application and components that provide capabilities to the application based on an application descriptor of the application, the application and the components to be run on a plurality of nodes of the platform that are arranged in a cluster. The platform assigns a first set of the components to run on a first node of the plurality of nodes and a second set of on the components to run on a second node of the plurality of nodes. The platform installs the first set of the components on the first node and the second set of the components on the second node.

Most web applications typically implement multiple layers of functionality to operate. For example, a common web application may use a database layer, an application server layer and the actual web application layer. Components within each of these layers may have their own resource preferences, dependencies, and so forth. Additionally, these components may operate on a single machine or may operate on different machines. In traditional computing platforms, to launch a new application, an administrator writes application code, selects support components, determines nodes that the application and components will run on, installs the application and components on the nodes, and configures the application and components to work with each other. To launch an application using traditional computing platforms accordingly may be time consuming and prone to error. Moreover, when services relied upon by the application change, the administrator typically manually reconfigures the application and its support components to account for such changes.

Automated deployment of an application in a computing platform


A deterministic microcontroller includes a plurality of blocks of cache memories formed on the same integrated circuit as the microprocessor unit. A corresponding plurality of hardware contexts for the microcontroller is provided by the plurality of sets of hardware registers. A context manager controls the selection of the hardware registers such that contexts are changed within one bus cycle and a plurality of hardware contexts are provided. The deterministic microcontroller includes a configurable input/output interface that is programmable to handle any one of a plurality of interfaces that embedded applications might have, including communication protocols and bus interfaces, data acquisition from multiple sensors and actuators, and controls of various motors.

Manufacturers of microcontrollers typically target the consumer and automotive markets and sell the same microcontrollers to the industrial markets. A wide variety of product families are offered, each of which offers multiple products differentiated with specific feature sets.
In the Industrial market, there is a demand for a wide variety of peripherals integrated on-chip with the microcontroller. This is due to the large number of applications; communication protocols and bus interfaces; data acquisition from multiple sensors and actuators; and controls of various motors.
This approach does not efficiently serve the needs of customers as it does not permit providing a 'perfect' match with customer requirements. Typically this approach forces customers to use products that are supersets of what are actually needed.
Prior microcontrollers do not effectively provide for the variety of peripherals needed in varied applications. Users of these microcontrollers must pick one of many microcontrollers that has the closest peripheral set that matches their requirements. In each application, a new microcontroller must be selected, or, alternatively, select one microcontroller that meets a superset of all requirements of all applications. The approach of using a separate microcontroller for each application increases costs by requiring the user to stock and buy each microcontroller. The approach of using a superset increases cost by making each microcontroller cost more.
In many, if not most, applications microcontrollers must provide for task-switching and multi-threading. Certain time-critical events, e.g., interrupts from timers, communication ports, or external circuits, interrupt whatever the microprocessor utilized in the microcontroller is doing at the time and re-direct the microprocessor to perform a higher priority task.
Software developers working on microcontroller based "hard real-time" embedded systems would often prefer not to use an RTOS (Real-Time Operating System), because by eliminating the RTOS, they could get complete control over the execution of their code thereby more easily obtaining very precise timing and control that are necessary for real-time or safety-critical functions. The down side of this approach was that without an RTOS, all of the other higher level, non real-time functions normally carried out by the RTOS also had to be developed as a proprietary software package. This often led to large proprietary software packages that were very difficult to debug and maintain over time.
Over time, as software development and maintenance costs continued to grow, embedded software developers migrated to using RTOS. RTOS vendors provide support, keeping the RTOS updated with new capabilities and fixing bugs etc. Although RTOS vendors provide methods for enabling real-time and safety-critical functions to be performed, the efficiency and determinism of these functions is impacted because the software developer has no direct control over code execution and must rely on the RTOS to manage multi-threaded context switches and interrupts.
Typical applications also require multi-threaded real time processing to handle various control and communications functions. These applications require a microprocessor to execute several hundreds of task switches per second and up to approximately 20 concurrent threads. This places an enormous amount of overhead burden on the microprocessor and increases firmware development schedule and cost.
When multiple tasks need to run on a prior art microprocessor, the RTOS grants each task a time slot on the microprocessor. A running task, "X", sometimes needs to be suspended temporarily so that another task, "Y", can be run for a time, after which task "X" is resumed. This suspension function is referred to as context switching. In prior systems context switching is performed by the RTOS saving the context of the task in the processor's memory at a predefined location.
The context of a task denotes its state: all the information required to resume the task at the point where it was interrupted. For a task running in software on a microprocessor, context includes the contents of the processor's registers, the data in the memory on which the task is operating, and information regarding the current state of execution of the task, such as the program counter. Software context switching presents functional and operational limitations. Reconfigurable hardware requires special handling. Both the software states and also the hardware states of the same task must be represented consistently.
Many of the features of modern microprocessors that improve their performance do so in a stochastic fashion, i.e. they increase average-case performance at the cost of a wide variation in the actual execution time from one time to another. Chief among these features is the cached memory architecture. If the code/data currently needed is in cache, then the operation is fast. If the code/data currently needed is not in cache, then the operation is delayed while the cache is filled. Stated another way, on one pass through a point in the control loop, the cache may contain all the information needed and the task is performed very fast, on another pass, the information may not be in cache and the task takes substantially longer.
In the description that follows, the term "deterministic" is utilized. In the context of the present invention, determinism pertains to time. A system that is "deterministic" is one in which every time a sequence of events is to occur, then the time that it takes to perform that sequence of events will always be the same or the variation in time will not be significant.

Deterministic microcontroller with configurable input/output interface


A ram head for possibly two-part ammunition which is provided at its bottom with a central rotationally symmetrical form-locking zone. In order to be able to unload the ammunition, a housing (1) is provided with a ring (11) that is arranged to be axially displaceable therein and is provided with a plurality of radially pivotally articulated extraction levers (12), with the extraction levers (12) being spreadable against a spring bias by a plunger (25). The ring is coupled with a slide sleeve (22) that is provided with a centering ring (23) having a shape corresponding to the form locking zone of the ammunition and the axial movement of the ring (11) and of the plunger (25) is controllable by an eccentric shaft (8) mounted on the housing.

The present invention relates to a ram head for possibly two part ammunition which at its bottom is provided with a central, rotationally symmetrical form locking zone whereby the ram head can be utilized for extracting the ammunition if desired.
Ram heads are employed in large caliber guns to ram the ammunition that has been supplied to the gun either manually or automatically into the gun barrel up to a collar provided at the casing bottom of the ammunition unit. The removal of the casing or casing bottom (stub casing) after firing from the gun barrel is effected by way of a separate casing ejector having ejector claws which engage the collar of the casing bottom, which after firing is disposed at a distance from the end of the gun barrel.
If, because of a misfire or an order to unload, the ammunition must be removed again from the gun barrel without having been fired, it would be expedient to have an appropriate extraction device that is able to engage the casing bottom of the ammunition (for which the known casing ejector is not suitable since the collar of the casing bottom lies firmly against the end of the gun barrel) so as to prevent the ammunition from having to be ejected toward the rear by a rod or the like inserted into the muzzle of the gun barrel. A rotationally symmetrical form-locking zone disposed on the ammunition components would be suitable for extraction or unloading.


In a semiconductor device comprising a copper lead brazed to a metal member of the device in a thermal process causing annealing and undesirable softening of the lead, the lead is stiffened in a process comprising applying a tensile force along the length of the lead and between it and the member to which it is brazed for stretching the lead beyond its elastic limit. The stretching process causes sitffening of the lead, removes bends in the lead, if present, and serves as a test for defective brazed joints.

This invention relates to semiconductor devices and to the fabrication thereof, and particularly to semiconductor devices having terminal leads of copper.
One type of semiconductor device with which the present invention has utility is shown in U.S. Pat. No. 3,996,602, the subject matter of which is incorporated herein by reference.
This patent shows a semiconductor chip which is brazed between two molybdenum blocks and a pair of copper terminal leads brazed to respective ones of the blocks. The leads are co-axial, and extend in opposite directions from the molybdenum blocks.
In the assembly of the device, the chip, blocks and terminal leads are simultaneously brazed in a batch processing step in which a plurality of assembled devices are passed through a heating oven.
Copper is used for the terminal leads because of the high electrical and thermal conductivities thereof. The copper leads, which may comprise simple lengths of straight wire or leads of the "nail-head" type, i.e., having a radial flange at the ends brazed to the molybdenum blocks, are formed by known cold working methods including drawing the copper wire through a die. Such cold working, as known, tends to stiffen the normally relatively soft copper leads. However, during the batch brazing process, the copper leads are heated to a temperature, e.g., around 700 degrees Cent., which is sufficiently high to cause annealing and softening of the copper leads. The leads are thus easily bent which leads to numerous problems such as lead entanglement when the devices are bulk handled, and the need to straighten the leads for device testing and assembly into end use equipment.
Solutions in the past to the problems associated with soft terminal leads have generally relied upon more careful handling, and in some instances, individual rather than bulk processing and transporting of the devices. Such solutions are undesirable as increasing the cost of the devices.

Semiconductor devices having copper terminal leads


To enable easy replacement of a soiled fingerprint reading window. To reduce the number of light sources and achieve miniaturization.

1. Field of the Invention
The present invention relates to a fingerprint recognition device and fingerprint reading window construction.
2. Description of the Related Art
Instead of the use of a password to confirm an authorized person""s identity, confirmation of the identity of the authorized person is often made by a fingerprint recognition device used for this purpose. In the case of an optical fingerprint recognition device, the surface irregularities of the fingerprint are converted into variations in optical intensity which are then converted into electrical signals (image signals corresponding to the fingerprint) by an image pick-up element and the electrical signals obtained are compared with the electrical signals for the authorized person, which are stored beforehand, and confirmation of the identity of the authorized person is thereby made. In such an optical fingerprint recognition device, a fingerprint reading window that is contacted by the fingertip is provided, and detection light rays from a light source installed on the inside thereof are directed onto the fingerprint reading window, so that the reflected light from this fingerprint reading window can finally be input to an image pick-up element. An example of disclosure of an optical fingerprint recognition device is to be found in Laid-open Japanese Patent Application Number H. 10-289304; however, in all prior art recognition devices, the fingerprint reading window that is contacted by the finger tip is arranged within the case of the fingerprint recognition device and is fitted in such a way that it cannot easily be removed from outside.
However, the fingerprint reading window easily becomes soiled due to repeated contact with fingertips. In particular, it becomes more liable to become soiled when a coating layer such as a silicone film is formed on the surface in order to emphasize variations of optical intensity produced by surface irregularities of the fingerprint. When the fingerprint reading window becomes soiled, accuracy of reading the fingerprint deteriorates, with an adverse effect on the accuracy of recognition of authorized persons. As a result, although, when the fingerprint reading window has been soiled, consideration might be given to replacing this, conventionally, no provision was made for replacing the window member, so the only alternatives were either to replace the entire fingerprint recognition device or to request the manufacturer of the fingerprint recognition device to replace the window member, in which case the fingerprint recognition device could not be used while replacement was being requested.
On the other hand, the detection light rays that are directed onto the window member for fingerprint reading, due to considerations regarding illumination of the entire fingertip, must be planar emitted light. In order to obtain such planar emitted light, conventionally, a construction was adopted in which a multiplicity of light-emitting elements were arranged in dispersed fashion on a substrate arranged facing the window member.
However, with a construction as conventionally in which a multiplicity of light-emitting elements are arranged in dispersed fashion on a substrate, a multiplicity of expensive light-emitting elements must be employed, making the device as a whole extremely costly, and also resulting in extremely large power consumption. In addition, due to the need to disperse the detection light rays from the light-emitting elements sufficiently, considerable separation must be ensured between the substrate and the window member, resulting in the problem that the fingerprint recognition device becomes quite large.
The present invention was made in view of the above circumstances, a first object thereof being to provide a fingerprint recognition device wherein a soiled fingerprint reading window can easily be replaced.
A second object of the present invention is to provide a fingerprint-reading window construction that is suitable for a fingerprint-reading window replacement.
A third object of the present inventions is to provide a fingerprint recognition device wherein the number of light sources can be reduced and miniaturization thereby achieved.
It should be noted that the objects of the present invention are not restricted to what is explicitly stated above, but implicitly include the provision of features, to be described, which are essentially desirable or are expressed as advantages.
In order to achieve the above first object, according to the present invention essentially the following technique for solution is adopted. Specifically, as described in Claim 1, part of the case that constitutes the outer shell of the fingerprint recognition device is constituted by a window member for fingerprint reading, which is composed of an optically transparent member that is formed as a separate element from this case, and the above-mentioned window member is removably mounted with respect to the case from outside the above-mentioned case. By adopting such a technique for solution, the window member for fingerprint reading can easily be mounted/removed with respect to the case, with the result that replacement of a soiled window member can easily be performed.
By separately providing the cover member (which also provides a frame member of the window member) having an aperture covered by a window member, this cover member is made to constitute part of the case and can be freely mounted/demounted from outside with respect to the case. If this is done, the window member can be removed from the case by first of all removing the cover member from the case. Since the periphery of the window member, i.e. the cover member, also tends to become soiled by contact with the fingertip, the cover member can also be replaced jointly together with the window member.
A holding part for holding the window member may also be formed on the cover member; if this is done, by holding the window member on the cover member beforehand, mounting of the window member with respect to the case can be achieved by mounting the cover member with respect to the case, and removal of the window member from the case can be achieved by removing the cover member from the case.
A supporting face for supporting the window member may be formed within the case; this is desirable in that it enables the window member that is pressed by the fingertip to be securely received.
Freely demountable mounting of the cover member with respect to the case may be achieved by using the engagement/disengagement of an abutment part provided on the case and an engagement part provided on the cover member; if this is done, the cover member i.e. the window member may be mounted and removed with respect to the case extremely easily without employing a separate fixing element, such as a screw, or a tool for manipulating the fixing element. Such engagement/disengagement of the abutment part and engagement part, i.e. mounting/removal of the cover member with respect to the case, may be performed by causing the cover member to execute a prescribed movement with respect to the case; as this prescribed movement, for example rocking or sliding of the cover member may be suitably selected.
The inner peripheral portion of the aperture in the cover member may be formed with a pair of left and right cut-away apertures to allow passage of light rays for detection of a fingertip.
A fingerprint recognition device according to the present invention may be employed in suitable applications such as use for control of access to a room.
In order to achieve the second object, according to the present invention, the following technique for solution may be adopted. Specifically, as described in Claim 7, a fingerprint reading window is constructed to comprise a window member made of an optically transparent member and a cover member formed with an aperture covered by this window member, and an engagement part for mounting this cover member is formed on the cover member. By adopting such a technique for solution, the window member may be provided for replacement together with the cover member, which provides a frame member at the periphery of the window member. Also, by mounting using an engagement part, the task of replacement is facilitated.
In order to achieve the third object, according to the present invention, the following techniques for solution are adopted. Specifically, as described in Claim 12, in a fingerprint recognition device of the optical type constructed such that detection light rays from a light source are directed onto a window member for fingerprint reading, the fingerprint recognition device has a light-guide plate arranged such that its plate surface faces said window member, the detection light rays from said light source is input from one end face of said light-guide plate and said detection light rays is thereby turned into planar emitted light emitted from the entire plate surface of this light-guide plate. By this technique for solution, detection light rays from the light source are sufficiently diffused while passing through the light-guide plate and are emitted in planar fashion from the entire plate surface of the light-guide plate. Thanks to the diffusion of the detection light rays by the light-guide plate, it becomes possible to employ a small number of light sources, which is advantageous as regards costs and also enables power consumption to be reduced. Also, the separation between the light-guide plate and the fingerprint reading window member can be made closer, making it possible to miniaturize the fingerprint recognition device and in particular making it possible to reduce its thickness.
Preferably the light-guide plate is arranged in inclined fashion with respect to the window member for fingerprint reading; if this is done, a margin can be ensured in respect of the detection light ray path whereby the reflected light from the window member is led to the image pick-up element.
The light-guide plate may comprise a main plate and a surface plate arranged on the surface of this main plate (surface facing the window member); in this case, a multiplicity of grooves may be formed extending in a direction approximately parallel with the input direction of the detection rays from the light source, while being spaced from one another in the direction approximately perpendicular to the input direction of these detection light rays; the diffusion action produced by the light-guide plate is thereby increased, and the detection light rays emitted in planar fashion can be rectified to uniform light rays by the surface plate.
In order to achieve the first and third objects together, the following techniques for solution can be adopted according to the present invention. Specifically, as described in Claim 18, in a fingerprint recognition device of the optical type constructed such that detection light rays from a light source are directed onto a window member for fingerprinting comprising an optically transparent member, and that the detection light rays reflected by the window member are input to an image pick-up element, the window member is formed as a separate element from a case constituting the outer shell of the fingerprint recognition device and is attached removably to the case from outside the case, a light-guide plate is provided such that the plate surface faces the window member, and the detection light rays from the light source are input from one end face of the light-guide plate, whereby the detection light rays are turned into planar emitted light emitted from the entire plate surface of the light-guide plate. By adopting this technique for solution, replacement of the window member for fingerprint reading can be facilitated and the planar emitted light can be obtained while decreasing the number of light sources.
On the preposition that the above technique for solution is adopted, it is preferred that the optical system may be configured as follows. Specifically, a first reflecting mirror for reflecting the detection light rays reflected from the window member is arranged in the direction of extension of the above-mentioned light-guide plate, a second reflecting mirror, for reflecting the detection light rays reflected by the first reflecting mirror towards the image pick-up lens, is arranged below the light-guide plate, and a holding body is arranged below the window member so that the holding member holds the light source, light-guide plate, image pick-up element, image pick-up lens, first reflecting mirror and second reflecting mirror.
As a result of such configuration as above, all the components constituting the optical engine for comparing fingerprints can be held by the holding body, so that the positional relationship among the components can be established with a high precision. In this case, in order to enable the positional and sizing relationship between the window member and the holding body to be established with a high precision as well, it is preferred to provide the above-mentioned holding body with a supporting face for supporting the window member so that the window member is immovably clamped between the supporting face and the cover member in a condition where the cover member is attached to the case.
The case may be a special-purpose case exclusively for a fingerprint recognition device, or the case of another type of equipment in which a fingerprint recognition device is incorporated, such as the keyboard case in an information processing device typified by a notebook personal computer may be effectively utilized without modification.

Fingerprint recognition device and fingerprint reading window construction

Abstract: An aperture 5 is formed in part of a case K constituting the outer shell of a fingerprint recognition device, aperture 5 being covered by a cover member 4. Cover member 4 that covers aperture 5 constitutes part of case K. An aperture 6 formed in cover member 4 is covered by a window member 7 for fingerprint reading consisting of an optically transparent member. Window member 7 is arranged on the under-surface of cover member 4 and is resiliently held by the holding feet 11 formed on cover member 4. Light source 42, light-guide plate 43, reflection mirrors 33 and 34, image pick-up lens 35 and image pick-up element 36 are held by holding body H which is fixedly arranged in case K. Window member 7 is clamped between supporting faces 38 of holding body H and cover member 4 so as to be immovable.

Abstract: Light-guide plate 43 is arranged adjacent and inclined with respect to window member 7. Detection light rays from light-emitting elements 42 are sufficiently diffused while passing through light-guide plate 43 and are emitted in planar fashion from light-guide plate 43 towards window member 7.


Disclosed are a light-emitting device and a manufacturing method thereof. A light-emitting device according to an exemplary embodiment of the present invention includes a base, a lighting element disposed on the base, the lighting element including an epitaxial layer and a substrate disposed on the epitaxial layer, a contact member disposed between the lighting element and the base, the contact member electrically connecting the lighting element and the base, and a lens disposed on the substrate.

1. Field
The present invention relates to a light-emitting device comprising a light-emitting device and a manufacturing method thereof.
2. Discussion
Light-emitting devices fabricated as individual chips are packaged so that they are electrically connected to printed circuit boards, power supplies or control means. When a chip is packaged, it is protected from the external environment, and its electrical connection with an external terminal is achieved smoothly. In particular, a light-emitting device functions to allow the light generated by supply of electric power to be easily emitted to the outside and also functions to allow the heat generated to be dissipated to the outside.
With the recent advancement of technologies for the formation of compound semiconductor single crystals and the control of dopants, high-output light-emitting devices have been realized. The realization of high output of light-emitting devices requires high power supply and causes problems associated with the dissipation of the heat generated.
Particularly, when the heat generated in a light-emitting device is not smoothly dissipated to the outside, it may result in the deterioration of the light-emitting device. In an attempt to solve this problem, ceramic materials or metals have recently been used as package materials.
Ceramic materials have the advantage of blocking external heat, because they have low heat transfer properties. However, these ceramic materials have a problem in that they do not easily dissipate the heat generated in packages. In addition, the ceramic materials have a problem in that a separate reflective material needs to be provided below a light-emitting chip so that the light generated in packages is easily emitted to the outside.
The use of a metal material as a package material has an advantage in that high heat transfer properties can be ensured. However, the use of a polymer material as a molding material makes it difficult to ensure heat dissipation properties, even when a frame made of a metal material is used.
FIG. 1 is a cross-sectional view showing a light-emitting device according to the prior art.
Referring to FIG. 1, the light-emitting device according to the prior art has a frame 1, a molded portion 3, a chip mounting portion 5 and a lens portion 7.
The frame 1 is made of a metal material, and the molded portion 3 is provided on the peripheral portion of the frame 1. The molded portion 3 forms the sidewall of the light-emitting device and extends vertically. The molded portion 3 includes a polymer material different from the metal material forming the frame 1.
Also, the chip mounting portion 5 is provided in the internal space defined by the surface of the frame 1 and the molded portion 3. The chip mounting portion 5 may be a chip or a chip-mounted substrate. The chip mounting portion 5 is electrically connected to the frame 1 by wire bonding or surface mounting.
Further, the lens portion 7 is provided on the upper end of the molded portion 3. The lens portion 7 is made of a transparent material and bonded to the molded portion 3.
The above-described configuration has a problem in that, because the molded portion 3 forming the sidewall of the light-emitting device cannot easily dissipate the heat generated in the package, the heat transfer properties of the light-emitting device are deteriorated. Moreover, the decrease in heat transfer to the outside leads to deterioration in the light emitting properties of the light-emitting chip. In addition, because the molded portion 3 forming the sidewall of the package is made of a black polymer material, it cannot sufficiently reflect the light emitted.
Particularly, when the light-emitting device emits light in the ultraviolet region, the light reflecting properties of the package will be deteriorated due to the frame 1 made of a metal material or the molded portion 3 made of a black polymer material, and the reliability of the light emitting device will be deteriorated due to the low heat transfer properties of the package. In addition, when heat is generated in the light-emitting device, the lens portion 7 can be detached from the molded portion 3, because it is made of a material having an expansion coefficient different from that of the molded portion 7.
Additionally, if the frame 1 is completely made of a metal such as Al in order to increase the reflectivity, a chip or a submount is mounted on the frame 1 using an Ag paste containing an organic material such as epoxy or silicone, because soldering is impossible as a Sn-based solder is not bonded onto the Al frame.
However, when the chip or the submount is mounted using the Ag paste containing the organic material as described above, the organic material will be influenced by the light (particularly UV light) from the chip for a long period of time, and thus the Ag paste will be delaminated from the frame 1, or the chip or the submount will be delaminated from the Ag paste, resulting in deterioration in the reliability of the device.
In addition, a conventional surface-mount device (SMD) type ceramic package having a cavity is manufactured by mounting a light-emitting device in the cavity, and then bonding a window-type or hemisphere-type glass lens directly to the upper end of the cavity. Alternatively, instead of placing the glass lens on the upper end of the cavity, a polymer such as a fluoropolymer or a silica-based polymer is injected into the cavity by a molding process so as to function as a lens while protecting the light-emitting device.
However, the conventional ceramic package comprising the glass lens placed directly on the upper end of the cavity is not satisfactory in terms of optical efficiency and light intensity, because light extraction is performed through the lens spaced away from the light-emitting device. Moreover, the ceramic package comprising the polymer lens filled in the cavity in place of the glass lens has a shortcoming in that the light transmittance is somewhat low, because the thickness of the polymer is inevitably thick. Particularly, in the case of light-emitting devices that emit UV C light (deep UV light), the optical efficiency is significantly reduced as the thickness of the polymer becomes thicker.
Further, in the case of STEM packages, a lens-integrated cap is bonded to a head by eutectic bonding to protect the light-emitting device. However, the STEM packages are not difficult to produce using automatic systems, and thus cannot be produced in large amounts. In addition, because the package surface is plated with Au having low reflectivity, a relatively low light intensity is shown even when the same light-emitting device is applied.
In recent years, in order to solve the costly problem of conventional STEM packages, which results from high material costs and production costs, there have been attempts to use inexpensive packages such as ceramic packages or general plastic packages as LED packages for UV light.
For example, a lens can be attached to a package body using an adhesive after mounting a LED in the cavity of the package body. The cavity is sealed with the adhesive so as to prevent water from penetrating from the outside. The cavity is closed by the package body, the lens and the adhesive, and thus the penetration of external water and the like into the cavity is prevented. However, during the attachment of the lens, the lens can be detached from the package body by compressed air produced in the cavity, thus causing adhesion failure. For example, when the lens is pressed against the package body using a lens holder with the adhesive interposed therebetween, compressed air is produced in the cavity. When the lens holder is removed, the lens can be detached from the package body by the compressed air. In addition, during curing of the adhesive, air in the cavity can be expanded, and the lens can be detached from the package body due to an increase in air pressure in the cavity.

Light-emitting device and method of manufacturing the same


Present novel and non-trivial system, device, and method for correcting misaligned images are disclosed. A system may be comprised of a source of first model data, a source of second model data, and an image generator (“IG”). The IG may be configured to perform a method comprised of receiving first model data representative of a first three-dimensional model; determining feature data of one or more first features located in an outside scene; receiving second model data representative of a second three-dimensional model in which one or more second features are located in the outside scene; determining differences data representative of feature differences between at least one first feature and at least one second feature; and applying the differences data to one or more pixel data sets, where such modification may be based upon a comparison between one or more first features and one or more correlating second features.

Field of the Invention
This invention pertains generally to the field of display systems such as, but not limited to, aircraft display systems.
Description of the Related Art
Two vision systems employed commonly in the aviation industry are the synthetic vision system ("SVS") and the enhanced vision system ("EVS"). The SVS typically employs a terrain and/or obstacle database to create a three-dimensional perspective of the scene in front of the aircraft on a two-dimensional display unit, whereas the EVS typically employs image sensor(s) to acquire real-world image data representative of an image that may be presented on the screen of one or more display units. Each vision system has its advantages and its disadvantages. One of the advantages of the SVS is that the image is not affected by meteorological conditions; however, one of its disadvantages is its inability to display actual terrain/object located in a scene in front of the aircraft.
There are systems which simultaneously combine SVS image data with EVS image data. One such system has been disclosed by Wenger et al in U.S. Pat. No. 7,605,719 entitled "System and Methods for Displaying a Partial Images and Non-Overlapping, Shared-Screen Partial Images Acquired from Vision Systems," wherein a visual spectrum camera system may be used to determine the employment of an EVS image data set and an SVS image data set to form a combined image data set.
To enhance a pilot's situational awareness, image data of a scene located outside the aircraft acquired by the EVS may be overlaid, blended, or fused with image data of the scene generated by the SVS. For various reasons, common terrain and/or objects located in the scene and depicted in the two images of two image data sets may be misaligned.

Image misalignment correcting system, device, and method


A method for analyzing a sample of wafers includes identifying F failure metrics applicable to at least one pattern on each wafer within the sample. Z spatial and/or reticle zones are identified on each wafer, where Z and F are integers. Values are provided for each failure metric, for each zone on each wafer. A point is defined for each respective wafer in an N-dimensional space, where N=F*Z, and each point has coordinates corresponding to values of the F failure metrics in each of the zones of the corresponding wafer. The sample of wafers is partitioned into a plurality of clusters, so that the wafers within each clusters are close to each other in the N-dimensional space. A plurality of clusters is thus identified from the sample of wafers so that within each individual cluster, the wafers have similar defects to each other.

The fundamental task of yield analysis is to determine the root cause of yield loss so that the consultant, factory engineer and/or designer can take action to mitigate the yield loss mechanism(s). The fundamental challenge is to connect the yield loss, as manifested in failure bit map (FBM) failures or die sort fail bins, as presented by e-test data, to its root cause. Typically, the source of the bin failures from the test data is unknown, but without this information a course of action cannot be taken to resolve the issue. Standard techniques for finding yield loss mechanisms include correlation analysis of yield vs. inline data, e-test data, defect, or wafer process history data. However, straightforward correlation analysis is hampered by the fact that in the manufacture of IC's, hundreds of process steps involving many pieces of associated equipment are employed, anyone of which may contribute to yield loss. Because of the superposition of yield impacting signals, correlation analysis signals may be weak or obscured because multiple failure modes may be present in a given population of wafers.
Generally, yield loss in semiconductor processing may be characterized as being composed of two components; systematic yield loss and random yield loss. This systematic yield loss may occur due to poor processing conditions or centering at a given process step, or perhaps the yield loss may be associated with a design marginality or flaw. Random yield loss tends to be associated with normal operating conditions where the background levels of defectivity from the fab ambient environment and/or ambient within tools contribute to defects on the wafer. Partitioning methods attempt to discern the random yield loss from the systematic yield loss so that subsequent investigation into root cause(s) can address each issue as deemed necessary. One such method uses a wafer tiling algorithm whereby die are aggregated into groups of die of varying size such that the slope of the logarithm of group yields vs. group size is an estimate of the random defectivity (Do) assuming Poisson statistics, and the y-intercept is an estimate of the systematic yield (Ys) (Segal et al., 2000). In this latter approach, one is able to get an estimate of Ys for a given wafer(s), but it is not readily possible to group wafers with similar Ys values as belonging to the same root cause group or cluster of wafers because no spatial distribution information is maintained. In other words, different root causes may have similar Ys values. Other methods do not rely on the test data but utilize test chips that contain representative attributes that can define the systematic yield values as they are related to an IC product.
A first method of identifying yield loss and drill down analysis (identifying the fundamental root cause of failure) is disclosed in U.S. Pat. No. 6,393,602 by Atchison et al., which discloses a yield management method by which clustering is done in a similar manner as prescribed by Segal et al., "Reducing baseline defect density through modeling random defect limited yield", MicroMagazine, January 2000. They employ a negative binomial statistic to estimate the systematic and defect limited yield. In this case, a clustering factor is estimated but this clustering factor is an aggregate across the wafer or wafers. In other words, assuming a fairly symmetric wafer, this method would not discriminate between N chips failing in the upper left corner versus N chips failing in the lower right corner, but the physical mechanisms for these yield losses are likely very different. Further, Atchison et al. go on to disclose the use of spatial analysis but only in a straightforward and rudimentary manner whereby wafer region yields are simply plotted in 2-D projections for visual review.
U.S. Pat. No. 6,470,229 by Wang et al, discloses a comprehensive yield management system and method using data pre-processing to remove bad data and data mining techniques to generate a decision tree for an automated analysis system. The data mining system is used to build a decision tree to find relationships between the response variable and the predictor variable(s) to find the best decision-split based on each predictor. In this way, the response variable, typically yield, may be related to one or more predictor variables. These types of generalized data mining techniques, while in principle are very elegant and attractive, in practice fall short of expectations due to large amounts of noise in the system.
In the semiconductor manufacturing process the process wafers are subject to random and non-random spatial defect sources/root causes. Some clustering algorithms attempt to discern between the random and non-random defect components by assigning the non-random defect pattern(s) to a given cluster. Clustering has been applied to optical defect inspection data to determine if a given defect is actually part of a group of other defects, e.g., associated with a scratch. Other clustering algorithms may not specifically attempt to discern between random and non-random responses but rather simply group wafers with similar patterns inclusive of random and non-random responses. This latter approach is more generally used when looking at patterns of bin data. Differentiating between different clusters is an additional burden that an algorithm must properly perform to be useful so as to distinguish different patterns and hence root causes.
To accomplish this separation, a clustering metric is applied and a clustering criteria and/or threshold are set. Some metric of difference criteria is set to provide a threshold of association. Hansen and James (Bell Labs Technical Journal, 1997) discuss an approach where they applied smoothing to spatial pass/fail bin die sort data based on a user selected smoothing threshold. They then test the resulting wafer map for spatial randomness based on joint count statistics. If the wafer map fails the spatial randomness test it is compared with other wafers that have failed the same test using a hierarchical clustering method using the "thresholded maps". The association of wafers in clusters suggests that the wafers in the group may likely have similar root causes for their die failures. In this way, clustering of wafers may aid in the diagnosis of yield limiting issues in the fabrication process. The "thresholded maps" constitute a library of known wafer patterns that are correlated against process wafers coming from the production line. In this way, wafers can be classified as belonging to a certain group of previously defined patterns. The problem with this approach is that it is only strictly valid for a given process and product layout which is relatively mature because the catalog or library of patterns is not necessarily static, especially as technology nodes change and as new process steps and materials are introduced (See "International Technology Roadmap for Semiconductors," 2001 Edition. Semiconductor Industry Association, 2001.) Also, this technique has been applied to the overall fail bin vs. pass bin case but does not seem readily amenable to exploring the generalized bin failure case as is the case for the invention disclosed herein. Other software applications (e.g. S-Wafers) essentially divide all wafers up and the engineer has to visually group the wafers with similar patterns together.

Method and system for failure signal detection analysis


Disclosed is a process for applying a kinetic spray coating of powder particles onto a substrate covered in a plastic-type material without first removing the plastic-type material. In one use of the process a mask is used to enable a single kinetic spray pass to both remove the plastic covering and bind particles having average nominal diameters of from 60 to 250 microns to the underlying substrate. In another use of the process the particles have an average nominal diameter of from 250 to 1400 microns and the use of a mask is optional because the particles can penetrate the plastic material and bind directly to the substrate. The process finds special use in forming electrical connections or solderable pads anywhere along the length of a flexible circuit.

A new technique for producing coatings on a wide variety of substrate surfaces by kinetic spray, or cold gas dynamic spray, was recently reported in two articles by T. H. Van Steenkiste et al. The first was entitled "Kinetic Spray Coatings," published in Surface and Coatings Technology, vol. 111, pages 62–71, Jan. 10, 1999 and the second was entitled "Aluminum coatings via kinetic spray with relatively large powder particles", published in Surface and Coatings Technology 154, pp. 237–252, 2002. The articles discuss producing continuous layer coatings having high adhesion, low oxide content and low thermal stress. The articles describe coatings being produced by entraining metal powders in an accelerated gas stream, through a converging-diverging de Laval type nozzle and projecting them against a target substrate surface. The particles are accelerated in the high velocity gas stream by the drag effect. The gas used can be any of a variety of gases including air, nitrogen, argon, neon or helium. It was found that the particles that formed the coating did not melt or thermally soften prior to impingement onto the substrate. It is theorized that the particles adhere to the substrate when their kinetic energy is converted to a sufficient level of thermal and mechanical deformation upon striking the substrate. Thus, it is believed that the particle velocity must exceed a critical velocity and be high enough to exceed the yield stress of the particle to permit it to adhere when it strikes the substrate. It was found that the deposition efficiency of a given particle mixture was increased as the inlet gas temperature was increased. Increasing the inlet gas temperature decreases its density and thus increases its velocity. The velocity varies approximately as the square root of the inlet gas temperature. The actual mechanism of bonding of the particles to the substrate surface is not fully known at this time. The critical velocity is dependent on the material of the particle and the material of the substrate. Once an initial layer of particles has been formed on a substrate subsequent particles bind not only in the voids between previous particles bound to the substrate but also engage in particle to particle bonds. The bonding process is not due to melting of the particles in the main gas stream because the temperature of the particles is always below their melting temperature.
Kinetic spray technology would greatly reduce the cost of manufacturing if it could be used to coat materials covered by plastic-type material without requiring prior removal of the plastic material. One area of special concern is flexible electrical circuitry. In these systems electrical conductors, typically ribbon wire, are covered in a plastic-type coating to protect them and to electrically isolate them from each other. Other plastic covered substrates of interest include ceramics. In the present specification and claims the term plastic-type material is meant to designate not only true plastics but also polyurethanes, polymers, nylons, rubbers, and elastomers. These coverings are relatively soft compared to the metals and ceramics that typically make up the underlying substrate. As mentioned, one common manufacturing environment that could benefit from the technology is the flexible circuit wiring area. This wiring is the typical plastic covered ribbon type wiring found in computers, automobiles and other electrical systems. Currently, when one desires to manufacture an electrical connection point or solderable pad somewhere along the flexible circuit it is necessary to remove the outer plastic covering in some manner prior to making the connection. Typically, this is done by laser ablation, using a punch wheel, or milling. The exposed wiring is then cleaned and finally, electroplated. These steps are very time consuming, require a large manufacturing footprint, and generate waste problems. It would be advantageous to develop a method for applying a kinetic spray coating onto a surface that is covered in a plastic-type material without requiring prior removal of the plastic-type material. The kinetic sprayed coating can serve as an electrical contact or solder point.

Kinetic spray application of coatings onto covered materials


Embodiments of methods, systems, or apparatuses relating to data processing and more particularly to methods, systems, or apparatuses to process, create, or transmit, one or more messages relating to goods or services.

1. Field
The subject matter disclosed herein relates to data processing and more particularly to methods, systems, or apparatuses to process, create, or transmit one or more messages relating to goods or services.
2. Information
Utilizing one or more computing platforms, users may search for goods or services providers, or attempt to communicate with one or more goods or services providers, in many different ways. For example, in an Internet context, such as on the World Wide Web, a user may interact with a web browser, or one or more other applications or programs having similar or the same capabilities, in an attempt to identify or communicate with one or more goods or services providers. Similarly, a user may attempt to search for one or more goods or services providers using other types of search applications, such as mobile applications, desktop applications, directory applications, or the like. Likewise, a user may attempt to communicate with one or more goods or services providers identified by a user's search using one or more communication environments associated with one or more goods or services providers. For example, a user may attempt to communicate with one or more goods or services providers by utilizing one or more communication environments associated with one or more goods or services providers, such as email, SMS messaging, telephonic communication, or the like, as non-limiting examples. With so much information relating to goods or services providers reposed in digital form, there may be a desire to provide useful techniques for searching for, identifying, or communicating with, one or more goods or services providers in a more efficient or cost effective manner.

Methods, systems, or apparatuses, to process, create, or transmit one or more messages relating to goods or services


A working instrument for use in a resectoscope with a pushing force-transmitting elongated support, whose proximal end area includes an attachment section for attachment in a resectoscope, and whose distal end area carries a working device. The working instrument includes, in its distal end area, a handle element. The handle element projects in a distal direction beyond the support and the working device and is connected to the working instrument so as to transmit pushing forces and can be removed.

Working instruments of the type of the present invention are used in conjunction with resectoscopes, e.g. in urology or gynaecology. For this purpose, the working instruments are inserted into the resectoscope and then advanced through orifices and channels of the body, e.g. the urethra, to the desired treatment site, e.g. the prostate.
Working instruments of this type consist of a long actuator rod, which can be attached in the sliding body of a resectoscope with their proximal end. On its distal end, the working instrument comprises a working device, e.g. a cutting loop to which a HF current can be applied, a cold knife, a curette or other devices known from the state-of-the-art, which allow the surgeon to perform the desired treatment, e.g. resection of the prostate, at the treatment site.
Modern resectoscopes are provided as continuous irrigation resectoscopes, in which the continuous irrigation of the operative field provides a clear view of the operative field to the surgeon. For this purpose, the resectoscopes comprise two separate channels, one of which is provided for the supply of irrigation fluid and the other is provided for the return of the contaminated fluid. A proven design providing these two channels are double-sheath endoscopes, such as shown e.g. in DE 100 42 097.4. In the following, the invention is illustrated in more detail as an example of a double-sheath endoscope without limiting the scope of the invention to this particular design of endoscope.
The resectoscope shown in DE 100 42 097.4 consists of an external and an internal sheath, a main body, a working instrument with cutting loop and guiding sleeve, a guiding tube with end-piece, a sliding body, and a telescope with eye-piece. For assembly, the telescope is inserted from a proximal end into the guiding tube, which is firmly connected to the main body and on which the sliding body is borne such that it can be displaced in an axial direction. Then, the working instrument with its attachment area leading is advanced from a distal end through a bore in the main body to the sliding body, and attached in the sliding body. During the advancement of the working instrument, the guiding sleeve slides over the telescope. Finally, the internal sheath, which is provided in the shape of an elongated tube, is pushed over the telescope and the working instrument, and coupled to the main body.
The external sheath, which is also provided in the shape of an elongated tube and may have a filling rod inserted into it, is introduced into the body of the patient by the surgeon. After removal of the filling rod, the resectoscope, assembled as described above, is then introduced through the hollow external sheath and the external sheath is also coupled to the resectoscope. At this point, the surgeon can commence the operation.
One problem associated with the type of assembly illustrated above is that the working instrument must be held with the fingers while it is being inserted through the bore in the main body and until it is locked in the sliding body. The working instrument is held either at the actuator rod, the guiding sleeve or at its distal end. However, neither of these areas possesses particularly good handling features, especially the distal end area of the working instrument which usually is not particularly resistant to the impact of forces applied to it. Consequently, there is a risk of damaging the working instrument. Moreover, there is a risk of injury if the working instrument bears a sharp-edged working device.
DE 101 22 465.6 shows a double-shaft resectoscope with a cutting loop as the working device, whereby the cutting loop has a larger diameter than the internal sheath. This means that the working instrument can no longer be guided through the internal sheath without damaging the cutting loop. For this reason, the assembly of this resectoscope must deviate from the procedure detailed above in that the internal sheath is pushed over the telescope and connected to the main body first. Only thereafter it is possible to insert the working instrument with its attachment area leading from a distal end through the internal sheath.
The internal sheath of the design shown in DE 101 22 465.6 is only slightly shorter than the working instrument. Therefore, almost the entire working instrument is inside the internal sheath during its insertion such that it can be grasped only at its distal end area, on which the cutting loop is arranged also. The handling problems described above are even more pronounced in this design.
It is therefore an object of the present invention to provide a working instrument, which simplifies the insertion into a resectoscope and remedies the described problems through the use of simple means.

Working instrument with handle element for use in a resectoscope, and handle element for a working instrument