The present invention is a system for nebulizing sample analyte containing solutions which allows liquid solution and gas entry, and is tyically utilized in combination or integration with an interface for directing sample analyte containing solution which is nebulized. The present invention provides improvement in the form of system design that prevents sample delivery tube component damage, sample solution electrical charging, sample solution "re-nebulization" effects, and sample analyte carry-over memory effects during a present invention method of use for introducing nebulized sample analyte containing solution into, for instance, a mass-spectrometer sample analysis system.

The sample analyte analysis capabilities of Inductively Coupled Plasma-Mass Spectrometer (ICP-MS) and Microwave Coupled Plasma-Mass Spectrometer (uW-MS) systems and the like, are well established.
For insight, it is noted that (ICP-MS) systems can comprise an Inductively Coupled Plasma (ICP) system followed by a Mass-Spectrometer (MS) system, wherein the (ICP) system is an (ICP) "Torch" with an enclosed space therein in which a plasma is inductively formed by application of high frequency electrical energy, via a coil situated around said enclosed space. An (ICP) Torch, it is mentioned, typically comprises a "Sample Injector Tube" present centrally within various other concentrically surrounding tubes, which various other concentrically surrounding tubes typically project beyond the projecting end of said sample injector tube, thereby providing an enclosed space therewithin, beyond the projecting end of said sample injector tube. Typically, during use, a sample solution is distally nebulized, (ie. atomized into small diameter droplets), and the nebulized droplets are caused to flow through said sample delivery tube into said plasma containing enclosed space. Gas is simultaneously caused to flow through annular space(s) between concentric tubes within said (ICP) Torch with the effect being that nebulized sample is directed into the plasma containing enclosed space in a plume. When a sample component is injected into said plasma containing enclosed space of an (ICP) Torch, electrons therein are excited into high energy atomic orbitals and some are dislodged entirely, thereby providing ionized sample components which are suitable for analysis in a mass-spectrometer system.
Other sample analyte ionization system configurations eliminate the need for an (ICP) Torch and provide for ionization of nebulized sample analyte injected thereinto by functionally equivalent means. For instance, entry stage ionization chambers contained within a Mass-Spectrometer (MS) system are such functionally equivalent means.
It is to be understood that Mass-Spectrometer (MS) systems comprise means for identifying ionized, (charged), sample components, (ie. analytes), based upon their mass and charge, as mediated and evidenced by said ionized charged sample component trajectory in the presence of electric and/or magnetic fields. For instance, which detector, (in an array of detectors oriented so as to intercept charged particles), a charged particle of a certain mass and charge which is caused to move in an electric field, enters, is determined by factors including the strength of the electric field, the particle velocity, charge and mass.
To provide additional insight it is disclosed that known means for nebulizing sample analyte containing sample solution, prior to injection into an (ICP), include Direct Injection Micronebulizer (DIN) systems. Briefly, (DIN) systems are well suited for directly entering small volumes of nebulized sample analyte containing solution into a plasma, and comprise a sample delivery tube centrally present within an essentially elongated tubular space through a "primary body element", such that during use sample analyte containing solution can be caused to eject from an end of said sample delivery tube simultaneous with the ejecting of a gas from an annular space concentrically formed between an outer surface of said sample delivery tube, and an inner surface of the elongated tubular space through said primary body element. Interaction between said ejecting sample analyte containing solution and said ejecting gas causes said sample analyte containing solution to become subjected to shearing forces and thereby nebulized into small droplets. Preferred (DIN) systems produced by CETAC/TRANSGENOMIC Inc. (which is headquartered in Omaha, Neb., and which is the Assignee for all Wiederin and Zhu Patents cited herein), typically include means for adjusting the positioning of an end of a sample delivery tube with respect to the end of the concentrically surrounding primary body element. Said positioning, it is noted, is often critical to successful nebulization of entered sample analyte containing solution.
Additional known systems for nebulizing sample analyte containing sample solution are known as Micro-Concentric Nebulizer Systems, (eg. MCN systems), and while (MCN) systems are generally functionally similar to (DIN) systems, (MCN's) are often simpler in that they comprise a primary body element with provision for simultaneous entry of both sample analyte containing sample solution and a flow of gas, and with provision for securing to a Spray Chamber which is sequentially present prior to a an Inductively Coupled Plasma (ICP) or Mass-Spectrometer (MS) system. That is, (MCN) systems need not be of a shape and size such that they can be easily inserted into an (ICP) Torch, and need not provide means for enabling the positioning of a sample solution ejecting end thereof near to an (ICP) in use. Instead, an (MCN) system need provide only means for simultaneous entry of sample analyte containing sample solution and a flow of gas, and means for coupling to a sequentially next stage, (eg. a spray chamber).
A Search of relevant references has identified a Fassel et al. U.S. Pat. No. 4,575,609 which describes a micro-nebulizer which inserts in, and mounts directly to a sample injector tube of a standard (ICP) torch. U.S. Pat. Nos. 5,212,365 and 5,272,308 to Wiederin describe improved (DIN) systems which do not require the presence of an (ICP) Torch sample injector tube as a part of their construction, but rather provide an elongated primary body element with a longitudinally oriented hole therethrough, through which longitudinally oriented hole a centrally located sample delivery tube extends. The Wiederin (DIN) systems allows for easy access to the space inside the Primary Body Element to allow non-destructive cleaning, and allows easy adjustment of the location of the relative positions of the sample ejecting end of the Sample Delivery Tube and the end of the Primary Body Element. Said adjustment allows optimizing the nebulizing ability of the Wiederin (DIN). A Meyer U.S. Pat. No. 4,990,740 describes a low operational pressure (DIN)-like system at a lower aspect thereof, with a series of impactors thereabove. Said impactors serve to deflect large diameter droplets, (over approximately fifteen (15) microns in diameter), away from injection into an upper aspect of said system.
A Chan et al. U.S. Pat. No. 5,233,156 is also known and teaches Torches of the type used in (ICP) systems, which Torches are designed for use with high solids content samples. Standard (ICP) torches are also described therein.
Another known U.S. Pat. No. 5,192,865 to Zhu is also disclosed as it describes entry of a nebulized sample analyte into a (MS) system via an Atmospheric Pressure Afterglow Ionization System. Nebulized sample analyte is injected into said 865 Patent system sequentially after the location of a carrier gas ionization means which serves to produce metastable species in use. In addition, another known Zhu U.S. Pat. No. 5,259,254 is also disclosed as it describes nebulization of a sample analyte containing solution, (by ultrasonic means), in a system which comprises a spray-chamber.
As mentioned, in some applications of sample solution nebulizing systems, it is not necessary to position an end of the sample solution nebulizing system from which nebulized sample solution is caused to exit in use, near a plasma in, for instance, an (ICP) system. The 308 Patent to Wiederin et al. describes such a system wherein is present, (between a (DIN) and a (MS) system), sequentially intervening desolvation and enclosed filter solvent removal systems, the purpose thereof being to remove and dispose of solvent in nebulized sample analyte containing sample solution droplets prior to entry of desolvated nebulized sample analyte to said (MS) system.
Importantly, it has been noted that in certain applications of (DIN) and (MCN) systems, at times sample solution delivery tubes, (ie. tubes which carry sample analyte containing sample solution), become crushed, thereby blocking flow of sample analyte containing solution therethrough. This is especially true where a utility providing thin-walled capillary is utilized as sample delivery tube. It has also been noted that flow of sample analyte containing solution through (DIN) or (MCN) systems can, during use, cause sample analyte containing solution therein to become electrically charged. Discharge of said electrical charge has been noted to induce untoward spikes in (MS) system output, thereby reducing sample analyte analysis capability. In addition, where a (DIN) or (MCN) is secured to a spray chamber means, it has been found that relatively large droplets of nebulized sample analyte containing solution can condense therein, onto the end of the (DIN) or (MCN) from which exits nebulized sample analyte containing solution in use. This can interrupt smooth flow of nebulized sample analyte containing solution, and can result in an undesirable effective "re-nebulization" of said condensed sample analyte containing solution, by gas exiting the (DIN) or (MCN). This effect is undesirable as it complicates interpretation of results provided by use of a (MS) system into which resulting nebulized sample solution is entered. It is also noted that systems for nebulizing, and analyzing, analytes in sample analyte containing solutions which have crevasses therein are prone to sample analyte carry-over "memory effects", wherein sample analyte entered during one analysis procedure is retained and undesirably released during a subsequent sample analysis procedure. Said "memory effect" is undesirable as it can lead to erroneous indication of the presence of a sample analyte in a specific sample analyte containing solution in which it is not actually present.
It should then be appreciated that even in view of the identified known art, need remains for convenient-to-use systems which include a relatively physically simple, (eg. MCN), system for subjecting a sample analyte containing solution to a nebulization procedure, followed by injection of the results into an (ICP), or functionally equivalent sample analyte ionization system, wherein ionization of sample analyte analytes occurs in use, so that a sequentially following (MS) system can be applied to the detection, and analysis, of sample analyte(s) present therein. Said relatively simple system for subjecting a sample analyte containing solution to a nebulization procedure, should provide for use with spray-chamber and/or desolvation means and/or solvent removal means, between it and a sample analysis system such as an (MS) system without introducing identified difficulties associated with sample delivery tube kinking and/or crushing at points of securement to said sample analyte containing solution nebulizing means, electrostatic spike development, the occurrence of sample solution "re-nebulization" and sample analyte memory effects, in addition to providing function enhancing interface system means for interconnecting said relatively simple system for subjecting a sample analyte containing solution to a nebulization procedure, to a spray-chamber and/or desolvation means and/or solvent removal system means.

System and method for producing nebulized sample analyte containing solution for introduction to sample analysis systems


A degasifier is provided in which the deterioration in sealing property (deterioration in airtightness) is prevented while sealing members to be placed between a container and covers that compose a decompression chamber can be omitted. A degasifier includes a decompression chamber provided with a container and covers, and a gas-permeable tube. The container is a tubular body extending along the central axis. The covers seal the openings of the ends of the tubular body. The gas-permeable tube is contained in the decompression chamber in such a manner that a liquid to be degassed that has entered from the outside of the decompression chamber flows therethrough and the liquid to be degassed that has flowed therethrough flows out of the decompression chamber. The inner circumference surfaces in the vicinities of the openings of the container each are provided with a first slope that is formed to be tilted at a predetermined angle θ with respect to the central axis and to extend away from the central axis toward the opening side of the container. A portion of each of the covers that is in contact with the container is provided with a second slope that is formed to be tilted at the angle θ with respect to the central axis and to extend to approach the central axis toward the inner side of the decompression chamber, with the openings being sealed. The openings are sealed with the container and the covers being joined to each other in the state where the first slopes and the second slopes are in contact with each other, respectively.

A dissolved gas in a liquid may cause corrosion of tubes through which a liquid flows, decrease in heat exchanger effectiveness and pressure due to bubble generation, or uneven application of a liquid due to generated bubbles. Hence, depending on the method and purpose of using a liquid, degassing is required.
For instance, a separation membrane module (see FIG. 2) that is disclosed in JP2002-253936A (Reference 1) can be used for degassing a liquid (a liquid to be degassed). The separation membrane module 101 shown in FIG. 2 is provided with a tubular housing 102 and flanges 103 that seal the openings of the housing 102. In the separation membrane module 101, polytetrafluoroethylene (PTFE) porous tubes 109 are contained in the housing 102 as gas-permeable tubes. The respective ends of the PTFE porous tubes 109 are connected to an inlet (liquid inlet) 105 and an outlet (liquid outlet) 106 for the liquid to be degassed. In such a separation membrane module 101, a liquid to be degassed is allowed to enter from the liquid inlet 105 and to flow through the PTFE porous tubes 109, while the inside of the housing 102 is decompressed through a gas supply port 107 and/or a gas exhaust 108 formed in the housing 102. Thus the liquid can be degassed (as described in paragraph [0017] in Reference 1).
In the separation membrane module 101 disclosed in Reference 1, the housing 102 and the flanges 103 are joined to each other by a method such as welding, bonding, screwing, etc. (as described in paragraph [0018] in Reference 1). When they are joined to each other by welding, the property of sealing between the housing 102 and the flanges 103 is excellent. However, members contained in the housing 102, for example, the gas-permeable tubes may be damaged by the heat that is applied during welding. In the case of joining them to each other by bonding, an adhesive may be deteriorated by the substance that has permeated the gas-permeable tube in a gaseous state. This may cause the deterioration in the property of sealing between the housing 102 and each flange 103. In the case of joining them to each other by screwing, in order to maintain the property of sealing between the housing 102 and each flange 103, it is necessary to provide sealing members such as a seal tape, an O ring, a gland packing, etc. Furthermore, the use of a sealing member having chemical resistance to the liquid to be degassed may be required depending on the type of the above-mentioned liquid. However, suitable sealing members are unavailable or even if they are available, they are very expensive.


The present invention relates to method of detecting activity of a sample. Some methods involve detecting a neo-binding-site created by the activity such as detecting an activity of a protease by detecting a neo-binding-site created by cleavage of a substrate by the protease.

The detection of enzymatic activity is important in many aspects of biological research and in medical diagnosis and treatment. Abnormal enzymatic activity can be the cause of a disease state and/or a diagnostic and/or prognostic marker for a particular condition. There is a need in the art for improved assays for enzymatic activity such as protease activity.
For example, factor Xa (FXa), an activated serine endopeptidase, is a common blood factor involved in multiple coagulation pathways. Measurement of FXa activity is commonly employed in the determination of the activity of upstream coagulation factors including factor VIII (FVIII) and factor IX (FIX), as well as in the determination of the anticoagulant properties of pharmaceutical compounds such as heparin. Commercially available kits for these purposes typically contain chromogenic based substrates containing the amino acid sequence IEGR (SEQ ID NO:1), which is recognized and cleaved by FXa, resulting in the severing of the peptide bond between the arginine residue and the next amino acid or molecule toward the carboxy-terminus. For example, substrate S2222, Bz-Ile-Glu[γ-OR]-Gly-Arg-pNA.HCl (Para-Nitro-Aniline) [R═H (50%) and R═CH3 (50%)], a polypeptide with a pNA conjugated at its C-terminus, is found in several colorimetric kits for FVIII and FIX detection. FXa can digest this substrate and release pNA which, in its free form, produces a bright yellow color which can be quantitatively measured in an absorbance reader. Commercially available FVIII detection kits include BIOPHEN Factor IX (Ref. A221802. Aniara, Mason, Ohio 45040), BIOPHEN FVIII:C (Ref. A221406. Aniara), CHROMOGENIX COATEST® SP4 Factor VIII (Cat. K824094. DiaPharma Group, Inc. West Chester, Ohio 45069) and Rox Factor IX (Cat. 900020. DiaPharma Group, Inc.). An assay for detecting FVIII activity is described in U.S. Pat. No. 5,506,112.
Additionally, caspase enzymes are proteases involved in cellular inflammation and apoptotic cascades. The assessment of caspase enzymatic activity can be used to evaluate cell death pathways and new apoptosis-modulating agents. Failure of apoptosis has been implicated as one of the causes of many different diseases including tumor development and autoimmune diseases. Additionally, undesirable apoptosis can occur with ischemia or Alzheimer's disease.
Citation or discussion of a reference herein shall not be construed as an admission that such is prior art to the present invention.


A method for manufacturing plate stacks for the production of coolers, cooler elements or heat sinks made of at least one plate stack for cooling electric or opto-electric components. The process includes the manufacture of plates or boards of metal, stacking the plates to form a plate stack, joining of the plates with the application of heat and pressure to form a stack, and post-treatment of the plate stack.

The invention relates to a method for manufacturing plate stacks, particularly for manufacturing coolers or cooler elements or heat sinks consisting of at least one plate stack according.
Heat sinks or coolers, also known as micro-coolers, are known in the art and are designed especially for cooling electrical components or modules, particularly also high-power components or modules, consisting of thin metal (metal foil) plates joined with each other to form a stack, the inner plates of the stack being structured, i.e. provided with openings or passages, so as to form cooling channels or flow paths for a coolant in the interior of the plate stack or cooler. For surface joining of the plates, they are provided with a joining material on their joining surfaces, i.e. on their surface sides. In order to join or connect the plates, the latter are then stacked one on top of the other in a stack and then heated to a suitable process temperature, in which a fusible metal area (joining or hot-melt layer) is produced on the joining surfaces using the joining material, so that after cooling of the stacks they are joined with each other to form the plate stack.
The disadvantage of such methods is that especially at the junction between two plates of the plate stack, micro cavities remain, which promote corrosion and can therefore cause leaks in coolers, heat pipes, etc.
It is an object of the invention is to demonstrate a method that eliminates this disadvantage.

Method for manufacturing plate stacks, particularly coolers or cooler elements consisting of plate stacks


A driver circuit of solid state light bulb assemblies including light emitting diodes comprises a first power converter stage converting an input voltage into an intermediate voltage; a second power converter stage converting the intermediate voltage into a drive voltage for the light source; and a controller. The controller comprises a first control unit generating a first control signal for the first power converter stage; a second control unit generating a second control signal for the second power converter stage; and a state control unit determining a target state of the light source; wherein the first and second control units are receiving information indicative of the target state; and wherein the first and second control units are generating the first and second control signals based on the information indicative of the target state.

There is an increasing interest in electric light bulbs which do not make use of incandescent filaments, since filament-based light bulbs are considered to be inefficient and energy hungry. Indeed, recent legislative changes mean that traditional incandescent light bulbs are being phased out in many parts of the world. One existing replacement for the incandescent light bulb is the compact fluorescent tube bulb.
Solid state lighting (SSL), for example light emitting diode (LED) or organic light emitting diode (OLED) based retrofit lamps, offer superior performance over compact fluorescent lamp (CFL) based retrofit lamps in terms of efficiency, instant light output, light quality, and lifetime. The main barrier to penetrate the market is product cost, since the shop price of today's LED-based lamps can be up to 10 times of CFL lamps.
A key element of an LED lamp assembly is the LED light source. The luminous efficiency, measured in lumen per watt, has been improved significantly over the last 10 years, and continues to increase further to levels of 250 lm/W for white light LEDs, with potential for further improvement.
Another strong advantage of using LED light sources is that they offer superior lifetime since the only failure mode is a slow depreciation of the outcoupling optics of the light source.
SSL lamp assemblies are generally operated using mains or power line electrical supplies, which provide an AC voltage, typically having a level of 110/120V or 230V/240V, at frequencies of between 50 and 60 Hz. This alternating nature of supply voltage consequently causes the power into the SSL lamp assembly to be inherently time dependent. The power typically changes between zero and multiples of the average system power within one power cycle.
The SSL device needs to be supplied with a DC drive signal. Any fluctuation of the DC drive signal can lead to visible effects such as flickering and to a degradation of the SSL efficiency due to so called droop effects at increased current levels.
Whenever the instantaneous input power is higher than the instantaneous output power the excess power has to be stored inside the power converter. Whenever the instantaneous input power is lower than the instantaneous output power the missing power has to be delivered from inside the power converter. Therefore, power converters usually include an electrical storage element.
Electrical energy can be stored as current using inductors or as voltage using capacitors. To store electrical energy of reasonable amount in the time domain of higher than milliseconds, inductive storage elements tend to become extremely large and bulky. Power converters typically use capacitors for energy storage.
In one previously-considered design, a single stage is provided which includes one switching element. The switching element being a MOSFET or a bipolar device or any other device is capable of switching electrical magnitudes at reasonably high frequencies.
Typical example single stage converters include flyback converters, buck converters or buck/boost converters. If a single stage converter is used said capacitive storage element can be connected to either the input or the output of the converter.
If the storage element is placed at the input, mains current is drawn only in a very short period of time causing large distortion of mains current which has to be filtered to comply with legal standards. Further the capacitive storage element has to withstand very high voltages typically above the peak of the mains voltage at the typical ambient temperature that occurs inside the SSL lamp assembly.
Such capacitive storage elements are typically aluminum electrolytic capacitors with a wet electrolyte which tends to slowly evaporate or diffuse causing degradation of the device especially at increased temperature levels. Such devices are expensive, sensitive to lifetime limitations and bulky.
If the storage element is placed at the output of the power converter, it is inherently placed in parallel to the SSL device. SSL devices inherently produce a very low incremental resistance. Consequently the capacitance of the energy storing device must be very large in order to achieve reasonable filtering of the current fluctuation into the SSL device. Typically capacitances substantially higher than 100 uF are needed. In many cases capacitances at 1000 uF or higher are needed.
Such capacitive storage elements are typically aluminum electrolytic capacitors with a wet electrolyte which tends to slowly evaporate or diffuse causing degradation of the device especially at increased temperature levels. Such devices are expensive, sensitive to lifetime limitations and bulky.
One previously-considered power converter topology has a common reference potential of input, output and power switch. Such a topology offers the advantage of simple control but has a significant disadvantage in that the output voltage is higher than the input voltage. These topologies are also referred to as boost circuits. To be used inside an SSL lamp assembly the output voltages become higher than the peak mains voltage yielding output voltages as high as 400V and above. The required capacitors are bulky, costly and strongly limited in their lifetime under elevated temperature conditions.

Driver circuits for solid state light bulb assemblies


An injection valve may include: a valve needle moving from a closed position to an open position; a calibration spring biasing the needle towards the closed position; an armature moving toward the pole piece to take the valve needle towards the open position with respect to the valve needle; and a pole piece. Some valves include a magnetic ring moving between a first position, with a top side spaced apart from the pole piece and an underside in contact with the valve needle, and a second position where the top side is in contact with the pole piece. A second spring is in parallel to the calibration spring. An upper retaining element connected to a shaft extends in radial direction to limit movement of the armature relative to the valve needle so that the armature connects to the upper retaining element to displace the valve needle towards the open position.

Typically, injection valves are so-called "normally closed valves" and have a valve needle biased towards a closing position by a calibration spring. A fundamental problem with such injection valves is that during the closing phase a high calibration spring preload is desirable, because it leads to a faster closing and better injector dynamic behavior, while at the same time a high calibration spring preload leads to a decreased injector maximum opening pressure. Hence, the spring preload has always been a compromise between behavior during opening and closing phase and maximum opening pressure of the injector. In case of high fuel pressure, the problem is particularly prominent since high spring rates of the calibration spring are required.
DE 10332812 A1 discloses a fuel injection valve that has a magnetic coil which cooperates with an armature which is acted upon by a return spring. An additional mass is located in the recess of the armature. The additional mass hits the armature with predetermined acceleration after an additional lift. The additional mass is acted upon by a spring in the closure direction of the fuel injection valve.

Injection valve with a magnetic ring element


In a two-position pushbutton switch, a cushioning member is placed on at least one of first and second click springs, and the click spring is pressed via the cushioning member, thereby making a first press stroke long. A guide member is provided to guide the motion of a driving member. The driving member is slid along the guide member in the pressing direction of a key top.

1. Field of the Invention
The present invention relates to a two-position pushbutton switch suitable for use in a digital camera.
2. Description of the Related Art
A conventional two-position pushbutton switch will be described below with reference to FIGS. 32 to 35. First, second, and third switch sections S3, S4, and S5 are held in a casing 51.
The first switch section S3 is formed of a membrane switch in which an insulating sheet 54 with an opening is interposed in a folded sheet 53 having a fixed contact and a movable contact, as shown in FIG. 34.
The second switch section S4 is formed of a membrane switch in which a fixed contact formed on a sheet 52 and a movable contact formed on a sheet 53 are opposed to each other via the opening of the sheet 54.
In the casing 51, a platelike support member 55 is also placed, and an operating member 56 is mounted on the support member 55.
The operating member 56 includes a mounting portion 56a mounted on the support member 55, an elastic portion 56b connected to the mounting portion 56a, a projection 56c formed at one end of the elastic portion 56b, an operating portion 56e connected to the mounting portion 56a via hinge portions 56d, a projection 56f formed at the end of the operating portion 56e, and a projection 56g formed at the bottom center of the operating portion 56e.
The sheet 53 is bent in the shape of the letter U, and the first switch section S3 at the leading end thereof is placed on the upper surface of the operating portion 56e. A dome-shaped click spring 57 having a small working force and a small diameter is laid on the first switch section S3.
The second switch section S4, composed of three stacked sheets 52, 53, and 54, is placed on the upper surface of the support member 55, and a dome-shaped click spring. 58 having a great working force and a large diameter is laid on the second switch section S4 and below the projection 56g. The third switch section S5 is placed below the projection 56f.
A key top 59 includes an operating portion 59a, two projections 59b and 59c formed on the lower side of the operating portion 59a, a support portion 59d formed at one end of the operating portion 59a, and a retaining portion 59e formed at the other end of the operating portion 59a. The key top 59 is supported in a cantilevered manner at the support portion 59d.
When the key top 59 is mounted, the operating portion 59a is exposed from an opening portion 51a of the casing 51, the projection 59b is in contact with the projection 56c of the operating member 56, and the projection 59c is in contact with the click spring 57. Furthermore, the retaining portion 59e is retained on the inner surface of the casing 51 by the resilient force of the elastic portion 56b of the operating member 56.
The operation of the conventional two-position pushbutton switch will now be described. First, when the operating portion 59a of the key top 59 is pressed, the key top 59 tilts relative to the support portion 59d so as to simultaneously push the projection 56c and the click spring 57.
Then, the click spring 57 with a small working force is first inverted and presses the sheet 53 (folded portion) so that the movable contact is put into contact with the fixed contact thereon, thereby turning on the first switch section S3.
In this case, the relationship between the stroke A and the working force B of the key top 59 is represented by a curve C3, and the stroke A3 is short, as shown in FIG. 35.
When the key top 59 is further pressed in this state, the operating portion 56e of the operating member 56 is tilted via the hinge portions 56d, and therefore, the projection 56g of the operating portion 56e presses the click spring 58.
Subsequently, the click spring 58 with a large working force is inverted and presses the sheet 53 so that the movable contact is put into contact with the fixed contact of the sheet 52, thereby turning on the second switch section S4.
In this case, the stroke A and the working force B of the key top 59 have a relationship represented by a curve C4, as shown in FIG. 35.
In response to the tilting of the operating portion 56e, the projection 56f operates the third switch section S5 so as to switch from the ON state to an OFF state.
When the key top 59 is then released from pressing, it is pushed back by the elastic portion 56b, and the operating portion 56e is returned to its initial state by-the hinge portions 56d. Furthermore, the click springs 57 and 58 are inverted into their initial states because of their own resilient forces. This turns off the first and second switch sections S3 and S4, and returns the third switch section S5 into an ON state.
In a case in which such a two-position pushbutton switch is adopted-in a digital camera, focusing is performed by operating the first switch section S3 by a first press, and a shutter is released. by operating the second switch section S4 by a second press.
In the conventional two-state pushbutton switch, however, since the click spring 57 is pressed and inverted immediately after the key top 59 abuts the click spring 57, a stroke A3 of the first press is short, as shown in FIG. 35.
For this reason, when such a two-position pushbutton switch is adopted in a digital camera, the press stroke for focusing is short and the focusing operation is difficult. This decreases ease of use.
Furthermore, the operating member 56 includes the, mounting portion 56a and the operating portion 56e supported on the mounting portion 56a via the hinge portions 56d, and the operating 56e is able to move via the hinge portions 56d. This requires a large space in the lateral direction and increases the size of the switch.
Accordingly, an object of the present invention is to provide a two-position pushbutton switch in which operability is improved by extending the stroke of a key top for switching between switch sections.
Another object of the present invention is to provide a compact two-position pushbutton switch which allows smooth operation.
In order to overcome the above problems, according to an aspect of the present invention, there is provided a two-position pushbutton switch including: a first click spring to be inverted by a first working force; a first switch section to be operated by the inversion of the first click spring; a driving member disposed opposed to the first click spring so as to press the first click spring; a second switch section laid on the driving member; a second click spring to be inverted by a second working force, different from the first working force, so as to operate the second switch section; and a key top for pressing the second click spring, wherein a cushioning member is placed on at least one of the first and second click springs and the click spring is pressed via the cushioning member.
This can make a first press stroke long. For this reason, in a case in which such a two-position pushbutton switch is adopted in a digital camera, a press stroke for focusing can be made long, and the focusing operation is easy. This improves ease of use of the pushbutton switch.
The cushioning member may be placed on the second click spring.
This can make the first press stroke long. Moreover, since the key top and the second click spring are not in direct contact with each other, even when the key top rattles, no sound is produced by the contact therebetween.
The cushioning member may be placed on the first click spring.
This can make the first press stroke long. The first press stroke can be further extended by using the cushioning member in combination with a cushioning member placed on the second click spring.
Preferably, the two-position pushbutton switch further includes a casing for holding the key top, an operating portion of the key top is exposed from an opening portion of the casing, and the key top is elastically pressed against the casing and supported therein by the cushioning,member.
In this case, the cushioning member also serves to press the key top and to thereby prevent the key top from rattling. This also reduces the number of components and lowers the cost.
Preferably, the first working force for the first click spring is greater than the second working force for the second click spring.
In this case, after the second click spring at the upper position is inverted, the lower first click spring is inverted. The driving member can be stably supported by the lower click spring with a large working force.
Preferably, the diameter of the first click spring is smaller than that of the second click spring, and the thickness of the first click spring is greater than that of the second click spring.
This makes it possible to reliably make the working force for the first click spring greater than that for the second click spring and to thereby allow reliable operation.
Preferably, the first and second click springs are made of a metal leaf spring and also serve as movable contacts of the first and second switch sections.
This reduces the number of components, improves assembly efficiency, and lowers the cost.
Preferably, the two-position pushbutton switch further includes a flexible insulating substrate having fixed contacts for the first and second switch sections, and the flexible insulating substrate is bent in the shape of the letter S and is placed opposed to the first and second-click springs.
In this case, the fixed contacts can be formed in the same plane of the flexible insulating substrate, and therefore, productivity is increased.
Preferably, the two-position pushbutton switch further includes a support member for supporting the first switch section, the support member has a plurality of guide projections extending in the pressing direction of the key top, and the driving member is slid along the guide projections in the pressing direction.
This makes it possible to reduce the space for supporting the driving member and to thereby reduce the size, and to make the sliding motion of the driving member smooth.
According to another aspect of the present invention, there is provided a two-position pushbutton switch including: a first click spring to be inverted by a first working force; a first switch section to be operated by the inversion of the first click spring; a driving member placed opposed to the first click spring so as to press the first click spring; a second switch section placed on the driving member; a second click spring to be inverted by a second working force, different from the first working force, so as to operate the second switch section; a key top for pressing, the second click spring; and a guide member for guiding the motion of the driving member, wherein the driving member is slid along the guide member in the pressing direction of the key top.
Since the space for holding the driving member can be reduced, the size of the two-position pushbutton switch can also be reduced. Moreover, since the driving member can be moved stably, operability is enhanced.
Preferably, the guide member includes a plurality of guide projections arranged to surround the second switch section, and a support member is further provided so as to support the first switch section.
This reduces the size of the pushbutton switch and allows the driving member to be moved stably.
Preferably, the guide projections are shaped like a bendable column, and hook portions are formed at the leading ends of the guide projections so as to retain the driving member.
In this case, the driving member can be easily assembled and the position thereof can be regulated reliably.
The guide member may have a connecting portion for connecting the guide projections.
This facilitates assembly of the guide member and improves productivity.
Preferably, the first switch section is placed on a flexible insulating substrate, a projection is formed at the bottom of the connecting portion of the guide member, the guide member is mounted on the support member by the projection, and the flexible insulating substrate laid on the support member is sandwiched between the support member and the connecting portion.
In this case, the guide member and the flexible insulating substrate can be mounted simultaneously. This increases productivity and prevents the first switch section from lifting.
Preferably, the driving member has a flat portion for holding the second switch section thereon, and the flat portion has a plurality of guide portions to be guided by the guide projections.
This allows the driving member to be moved stably and smoothly.
Preferably, fixed contacts of the first and second switch sections are formed-on the same flexible insulating substrate, and the flexible insulating substrate is placed in a form bent in the shape of the letter S.
Since the fixed contacts can be formed on the same plane of the flexible insulating substrate, productivity is increased.
Preferably, the driving member has a pair of projecting latch portions, the flexible insulating substrate has a pair of holes, and the second switch section is held on the driving member by latching the latch portions in the holes.
In this case, the position of the second switch section with respect to the driving member can be reliably ensured, and the second switch section can be mounted without lifting.
Preferably, the first and second click springs are made of a metal leaf spring, and also function as movable contacts of the first and second switch sections.
This reduces the number of components, improves assembly efficiency, and lowers the cost.
Further objects. features, and advantages of the present invention will become apparent from the following description of the preferred embodiments with reference-to the attached drawings.


The embodiments of the present application relate to a method and device for configuring hybrid automatic repeat request (HARQ) feedback between terminal nodes. The method of the embodiments of the present application includes: a base station configuring a HARQ feedback enable rule of a sidelink interface for a terminal; indicating to said terminal the HARQ feedback enable rule of the configured sidelink interface, to enable the terminal to determine, according to the HARQ feedback enable rule of the configured sidelink interface, to enable or not enable HARQ feedback on the sidelink interface.

In a network transmission standard new radio vehicle to everything (NR V2X) system, a hybrid automatic repeat request (HARQ) feedback mechanism of a Sidelink interface (also called the PC5 interface in 3GPP) is introduced. The HARQ feedback mechanism is a feedback mechanism in which a receiver saves received data when decoding fails and asks a sender to retransmit the data, the receiver combines the retransmitted data with the previously received data and then decodes them, the number of retransmissions is reduced by the diversity gain, and thus the delay is reduced.
In the NR V2X system, direct communication is allowed between terminals close to each other. The communication mode is shown in FIG. 1A, which mainly includes the following two modes.
One is communication between a network side device and terminals through cellular communication link device to network (D2N) link, or cellular communication interface Uu interfaces.
The other is communication between terminals through a device-to-device (D2D) link between devices, or a Sidelink interface. The communication scenarios of direct communication include the following three types:
1. unicast communication, one-to-one communication between direct communication terminals;
2. multicast communication, a terminal can send the same data to all terminals in a communication group at a time; and
3. broadcast communication, a device can send the same data to all nearby devices at a time.
The resource allocation modes for direct communication include the following two.
1. The resource allocation mode of network side scheduling, the network side device allocates direct link resources to the terminals on the Uu interfaces according to Sidelink buffer state reporting (BSR) reported by the terminals, and the resource allocation mode is called mode 1 in 5G, called mode 3 in long term evolution (LTE), and called NR V2X mode 1 in NR V2X.
2. The allocation mode in which a terminal side autonomously selects resources, the terminals select resources from resources pre-configured for the terminals or a transmission resource pool broadcast by a network-side device to send the direct communication link, and the resource allocation mode is called mode 2 in 5G, called mode 4 in LTE, and called NR V2X mode 2 in NR V2X.
The NR V2X system supports broadcast, multicast, and unicast communications of the terminals on the Sidelink interface. When multicast or unicast communication is adopted, a receiving terminal can send HARQ feedback to a sending terminal so that the sending terminal can perform HARQ retransmission. As shown in FIG. 1B, the HARQ feedback mechanism of the Sidelink interface supports the resource allocation mode of network side scheduling. As shown in FIG. 1C, the HARQ feedback mechanism of the Sidelink interface also supports the allocation mode in which the terminal side autonomously selects resources.
The different terminals that directly communicate in the NR V2X system may be all online terminals, or all offline terminals, or some terminals are online terminals, and some are offline terminals. Where online terminals refer to that the terminals participating in the direct communication are located within the coverage range of the 3rd generation partner project (3GPP) direct communication carrier, the terminals can search for a 3GPP base station, and if necessary, the terminals can be controlled by the 3GPP base station, and the offline terminals refer to that the terminals participating in the direct communication are not within the coverage range of the 3GPP direct communication carrier.
In summary, the HARQ feedback mechanism in the NR V2X system has the following disadvantages:
on one hand, the transmission of HARQ feedback signals occupies the resources of the Sidelink interface, due to the half-duplex nature of the Sidelink interface, the receiving terminal cannot send and receive other signaling or data when sending the HARQ feedback signals; and on the other hand, too frequent HARQ feedback signals may cause interference to the transmission of other terminals.
In the prior art, although the feedback resources of the Sidelink interface are introduced in the NR V2X system, the HARQ feedback mechanism in the NR V2X system has not been improved to overcome the above disadvantages.

Method and device for configuring HARQ feedback between terminal nodes

DATANG MOBILE COMMUNICATIONS EQUIPMENT CO., LTD.


A focus detection apparatus comprises a line sensor including a photoelectric conversion element and an integrating capacitor, a storage unit configured to store information concerning a defective pixel, a first comparison unit configured to compare a signal from the defective pixel with a predetermined threshold, a switching unit configured to switch between a first accumulation mode and a second accumulation mode, and a control unit configured to control the switching unit so as to set the line sensor in the first accumulation mode if the first comparison unit determines that a signal from the defective pixel is not more than the predetermined threshold and set the line sensor in the second accumulation mode if the first comparison unit determines that a signal from the defective pixel is larger than the threshold.

Field of the Invention
The present invention relates to a technique of improving focus detection accuracy in a focus detection apparatus.
Description of the Related Art
Conventionally, a phase difference detection method is generally known as an automatic focus detection method for a camera. According to the phase difference detection method, light beams from an object which have passed through different exit pupil areas of an imaging lens are formed into images on a pair of line sensors provided in an AF sensor. The relative positions of a pair of object images obtained by photoelectrical conversion using a pair of line sensors are computed to detect the defocus amount of the imaging lens (focus detection computation).
In such focus detection apparatuses, for the purpose of increasing the number of detection points of defocus amounts with respect to a plurality of objects and improving resolution, there is recently a tendency toward increasing the number of photoelectric conversion portions for acquiring focus detection images. On the other hand, an increase in the number of photoelectric conversion portions makes it very difficult to completely remove defects in the manufacture.
The following are known literatures concerning automatic focus detection techniques based on such a phase difference detection method. For example, Japanese Patent Laid-Open No. 2003-222786 discloses an AF sensor which performs gain control and accumulation time control based on the maximum value signals of line sensor signals and the difference signal between the maximum value signal and the minimum value signal. In addition, Japanese Patent Laid-Open No. 2001-177756 discloses a technique of obtaining a signal for focus detection by excluding a signal from a defective photoelectric conversion portion based on information concerning a defective pixel portion checked in advance in a manufacturing process or the like.
The technique disclosed in Japanese Patent Laid-Open No. 2003-222786 described above, however, has a problem that if there is a defect in a photoelectric conversion pixel portion of a line sensor, charge accumulation is finished before a sufficient object image signal is obtained.
The following is a detailed description of this problem. Assume that one of the images of an object formed on a pair of line sensors is represented by A image, and the other image is represented by B image. FIGS. 17A and 17B each show an example of a signal obtained from object images when there is no defective pixel portion. When an output signal reaches the maximum value determination voltage, an accumulation stop is determined, and the accumulation period is finished. In contrast, FIGS. 18A to 18C each show an example of a dark-time waveform when there is a defective pixel portion. A signal increase due to a dark current in the defective pixel portion is larger than that in a normal pixel portion. FIG. 19 shows how accumulation control is performed based on the maximum value signal for the same object as that in the case shown in FIGS. 17A and 17B when there is a defective pixel portion like that in the case shown in FIGS. 18A to 18C. Since an accumulation stop is determined when the defective pixel signal reaches the maximum value of the signal, the accumulation period is finished before signals are accumulated to an intended amount. As a result, the object signals in FIGS. 17A and 17B become those shown in FIGS. 20A and 20B. This makes it impossible to obtain a sufficient signal amount, leading to a decrease in the S/N ratio of a signal and a deterioration in focus detection computation accuracy.
In addition, as disclosed in Japanese Patent Laid-Open No. 2001-177756, it is possible to perform accumulation control upon excluding a signal from a defective photoelectric conversion portion based on information concerning a defective pixel portion checked in advance in a manufacturing process or the like. However, since focus detection computation is performed while a value is compensated from other pixel signals, it is not always possible to obtain a correct computation result.

Focus detection apparatus, method of controlling the same, and storage medium


An integrated circuit package system including providing a base substrate, attaching a base integrated circuit on the base substrate, attaching a core substrate over the base integrated circuit, attaching a substrate electrical connector between the core substrate and the base substrate, and applying an encapsulant having the core substrate partially exposed over the base integrated circuit.

The very small and very large numbers of circuits on the integrated circuit die, generally require some housing and protection from the system or product environment. This housing and protection often takes the form of an integrated circuit package that provides a mechanism for making electrical interconnection between the circuits on the integrated circuit die and the leads that are utilized to make electrical interconnections to circuits, power, and ground external to the integrated circuit die. For early types of integrated circuits, the packaging of the integrated circuits was relatively straightforward and generally involved an array of leads arranged around a die cavity to be electrically connected to associated die pads. There were also relatively few circuits on each integrated circuit die, and the circuit operational rates were by modern day standards relatively slow.
Across virtually all applications, there continues to be growing demand for reducing size and increasing performance of integrated circuits. The seemingly endless restrictions and requirements are no more visible than with products in our daily lives. Smaller and denser integrated circuits are required in many portable electronic products, such as cell phones, portable computers, voice recorders, etc. as well as in many larger electronic systems, such as cars, planes, industrial control systems, etc. As the demand grows for smaller electronic products with more features, manufacturers are seeking ways to include more features as well as reduce the size of the integrated circuit packages. To meet these needs, packaging technologies are increasingly using smaller form factors with more circuits.
Wafer manufacturers strive to reduce transistor or capacitor feature size in order to increase circuit density and enhance functionality. Device geometries with sub-micron line widths are so common that individual chips routinely contain millions of electronic devices. Reduced feature size has been quite successful in improving electronic systems, and continuous development is expected in the future. However, significant obstacles to further reduction in feature size are being encountered. These obstacles include defect density control, optical system resolution limits, and availability of processing material and equipment. Attention has therefore increasingly shifted to integrated circuit packaging as a means to fulfill the relentless demands for enhanced system performance.
Drawbacks of conventional designs include a relatively large footprint of the package on the mounting surface of motherboard. The footprint typically reflects the maximum planar dimension of the package, namely, the x-y dimension of the package. In applications where mounting space is at a premium, such as pagers, portable telephones, and personal computers, among others, a large footprint is undesirable at best. With the goal of increasing the amount of circuitry in a package without increasing the area of the package, so that the package does not take up any more space on the circuit board, manufacturers have been stacking two or more die within a single package. Unfortunately, sufficient overlap for electrical interconnect and large footprint top packages have plagued previous stacked package or package on package designs.
Thus, a need still remains for an integrated circuit package system to provide improved function, area, volume, and manufacturing yield. In view of the increasing demand for improved integrated circuits and particularly more functions in smaller products at lower costs, it is increasingly critical that answers be found to these problems.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Stacked integrated circuit package system and method of manufacture therefor


In one embodiment, conductors of a semiconductor device are routed to a contact platform of the semiconductor device by using electroless plating and screen-printing techniques.

The present invention relates, in general, to electronics, and more particularly, to semiconductor devices and methods of forming semiconductor devices.
In the past, the semiconductor industry utilized various methods and structures to form electrical connections to a semiconductor die or semiconductor device. For example, wire bonding was one technique used to form an electrical connection between a bonding pad on the semiconductor die and an attachment point on a leadframe of a semiconductor package. Typically, the bonding pad was formed in a non-active area of the semiconductor die. Leadless connection techniques, such as solder balls or flip chip techniques, applied spheres or balls of solder to a bonding pad or other type of connection platform of a semiconductor die. The solder balls were thereafter placed in contact with conductors on a printed circuit board or other type of supporting substrate and soldered to the conductors. In some cases, and particularly in leadless applications such as flip chip, connection platforms were formed in an active area of the semiconductor die. Often, it was desirable to route conductors from the connection platform to a different portion of the semiconductor die in order to facilitate forming the leadless or other type of connection to the semiconductor die.
FIG. 1 through FIG. 3 illustrate some steps in a typical prior art method for routing electrical connection from a connection platform 22 to another area of a semiconductor die 20. Typically, a semiconductor substrate 21 had a connection platform 22 formed somewhere on the surface of substrate 21. A passivation dielectric 23 generally was formed on the surface of semiconductor die 20. An inter-layer dielectric 24 was formed overlying passivation dielectric 23 and over a portion of platform 22. Semiconductor processing techniques were utilized to form dielectric 23 and to form an opening through dielectric 23 to expose a portion of the surface of platform 22. Thereafter, a plating base metal was sputtered on to the exposed portions of platform 22 to form a base 26 that would be used for a subsequent electro-plating operation. The material used for base 26 was a conductor to facilitate the electro-plating and typically was a multilayer metal such layers of aluminum/nickel-vanadium/copper (Al/NiV/Cu), or titanium-tungsten/copper (TiW/Cu), or may be evaporated chrome/copper. Typically, semiconductor processing techniques were used to form a photo-resist mask, not show, that was used in sputtering or evaporating base 26. As is well know in the art, sputtering or evaporating techniques require equipment and procedures that form a vacuum and operate at high temperatures in order to accomplish the sputtering operation. Such equipment, the maintenance thereof, and the operation thereof are expensive. Thereafter, semiconductor processing techniques were again utilized to form a photoresist layer, not shown, covering layer 26 in addition to forming a mask for subsequent electroplating operation. Then, conductor material, such as copper (Cu) or a nickel-gold (NiAu) alloy was electro-plated through an opening in the mask and onto layer 26 in order to form conductor 27. Thereafter, the photo-resist was removed leaving conductor 27 electro-plated onto base 26. Subsequently, semiconductor processing techniques were again utilized to form a dielectric 29 covering electro-plated conductor 27, and to form an opening through dielectric 29 to expose a portion of conductor 27. Thereafter, semiconductor processing techniques were once again utilized to deposit a conductor material into the opening to form an electrical contact 31 to platform 22. The semiconductor processing techniques, sputtering techniques, and electro-plating operations added additional cost to the semiconductor device. Additionally, the cost of the associated equipment and the maintenance of the equipment also added to the costs of the semiconductor device.
Accordingly, it is desirable to have a method of forming an electrical contact to a semiconductor device that does not require semiconductor processing techniques and equipment, that does not require sputtering, that does not utilize each electro-plating, and that has a low cost.
For simplicity and clarity of illustration, elements in the figures are not necessarily to scale, and the same reference numbers in different figures denote the same elements. Additionally, descriptions and details of well-known steps and elements are omitted for simplicity of the description.

Method of routing an electrical connection on a semiconductor device and structure therefor

Semiconductor Components Industries, LLC


A power supply wiring method for a semiconductor integrated circuit is disclosed in which power supply provision for logic cells can be performed without invading the wiring area, and a semiconductor integrated circuit is also disclosed. In the power supply wiring method, a power supply is fed to logic cells located between the functional blocks of a semiconductor integrated circuit comprising a plurality of functional blocks. In the method, power supply provision similar to that for logic cells in the functional blocks is performed for the logic cells between the functional blocks by aligning logic cell rows in the functional blocks and logic cell rows located between the functional blocks. Thus, power supply provision similar to a power supply feeding method for the logic cells in the functional blocks is also possible for the logic cells located between the functional blocks.

1. Field of the Invention
The present invention relates to a power supply wiring method for a semiconductor integrated circuit for providing a power supply to repeater cells inserted in wiring between the blocks. The present invention also relates to a semiconductor integrated circuit.
2. Description of the Related Art
For reducing the wiring delay of signal wiring connected between functional blocks, as shown in FIG. 12A, a repeater cell inserting method for inserting logic cells 100 and 101 into wiring between blocks is often used. When a power supply is provided for repeater cells inserted in the wiring between the blocks, for example, when the repeater cells are directly connected to a power supply provided around the functional blocks, vias are provided for connecting a power supply layer for the logic cells and a power supply layer provided around the blocks. If thus provided vias are present around the functional blocks, the wiring area is invaded, so that wiring between the blocks is difficult to perform. Therefore, usually, the repeater cells are moved inside the block as shown in FIG. 12B, or a repeater cell block 103 is made as shown in FIG. 12C.
Also, conventionally, when cells are located between blocks, power supply wiring is provided on the wiring area between the blocks, the cells are located below the power supply, and cell power supply wiring and cell ground wiring are provided to intersect the power supply between the blocks and connected to the power supply wiring between the blocks via contacts (For example see Japanese Unexamined Patent Application No. H 2000-331051).
However, the integration size of LSIs increases significantly in the present large scale miniaturization process, so that the number of repeaters inserted in the signal wiring between blocks is several thousands. If the above repeater cell inserting methods are used in such a condition, many steps are required for the process after insertion of repeater cells (moving into blocks, or making repeater blocks) Therefore, in order to reduce the LSI design period, it is required that the repeater cells can be located between functional blocks. Thus, a method of providing a power supply for repeater cells without invading the wiring area is required.

Power supply wiring method for semiconductor integrated circuit and semiconductor integrated circuit

Matsushita Electric Industrial Co., Ltd.


The present invention provides a flexible wire grid polarizer used in a visible ray band and a fabricating method thereof. The present invention includes the steps of forming a non-adhesive layer on an inner area of a lower substrate, forming a flexible polymer substrate on the lower substrate including the non-adhesive layer, forming a thin metal layer on the flexible polymer substrate, forming a metal grid pattern by etching the thin metal layer, dicing a wafer staying within a boundary of the non-adhesive layer on the lower substrate, and separating the lower substrate including the non-adhesive layer from the diced wafer to complete the flexible wire grid polarizer.

1. Field of the Invention
The present invention relates to a flexible wire grid polarizer used in a visible ray band and a fabricating method thereof.
2. Discussion of the Related Art
Generally, an array of parallel conductive wires arranged in parallel to polarize a specific polarized light has been used about 110 years. Such a parallel conductive wire array is called a wire grid in general. And, the wire grid is used on a transparent substrate as a polarizer in an infrared area among electromagnetic waves.
Major factors of determining polarizer performance of the wire grid are parallel lines and a distance between centers of the parallel lines, i.e., a relation between a cycle and a wavelength of an incident wave.
If an interval of a wire grid or a cycle is longer than a wavelength of an incident wave, the wire grid operative as a diffraction grid rather than a polarizer to diffract a polarized light. Hence, diffraction occurs regardless of the polarized light to form theoretically well-known diffraction interference patterns attributed to the phase difference.
If the difference between centers of lines or cycle is shorter than a wavelength, the wire grid is operative as a polarizer to reflect an electromagnetic wave polarized in parallel to the wire grid or to transmit the electromagnetic wave of orthogonal polarization. In this case, a transmissive area, in which a cycle of the wire grid lies within a range of 0.5*wavelength ˜2*wavelength, depends on variations of transmission and reflection characteristics of the wire grid.
Specifically, a rapid increase of reflectivity for an orthogonally polarized light to the wire grid and a corresponding transmitivity decrease take place on at least one specific wavelength in a predefined incident angle.
Meanwhile, cycle, line width, line thickness, property of grid material, characteristic of substrate (refractive index), wavelength of incident wave, incident angle of incident wave and the like are taken into consideration as important factors in manufacturing a polarized beam splitter using a wire grid.
It has been well known that metal wires arranged parallel in the aforesaid manner selectively reflect or transmit a polarized light of electromagnetic wave. If a cycle of the metal wire arrangement is shorter than a wavelength of an incident electromagnetic wave, a polarized (S-wave) component parallel to the metal wires is reflected and a polarized (P-wave) component orthogonal to the metal wires is transmitted.
A light of S-polarization, which has a polarization vector orthogonal to an incident plane, is parallel to a conductive factor. And, a light of P-polarization, which has a polarization vector parallel to the incident plane, is orthogonal to the conductive factor. Using such a phenomenon, it is able to fabricate a planar polarizer having excellent polarization efficiency, high transmitivity and wide viewing angle. Such a device can be called a wire grid polarizer. The wire grid polarizer consists of a glass substrate and an aluminum grid of which cycle is set to 200 nm or less to be provided with a polarizing function in visible rays. Namely, the wire grid polarizer consists of several parallel conductive electrodes supported by the glass substrate.
The wire grid polarizer generally reflects light having an electric field vector parallel to a conductive wire of a grid and transmits light having an electric field vector orthogonal to the conductive wire. In this case, an incident plane may be orthogonal to the wire grid or may not.
Ideally, the wire grid is a perfect mirror like S-polarization for one light polarization and is perfectly transparent for another polarization like P-polarization. Substantially, a mirror-like reflective metal absorbs a small quantity of incident angle and reflects about 90˜95%, whereas a plane mirror does not transmit 100% of incident light due to surface reflection.
FIGS. 1 to 8 are cross-sectional diagrams of a process of fabricating a wire grid polarizer according to a related art. A transparent glass substrate 100, as shown in FIG. 1, is prepared. In this case, both sides of the transparent glass substrate 100 are grinded. A thin metal layer 111 is deposited on the prepared glass substrate 100. In this case, Al, Ag, Cr or the like can be used as the thin metal layer 111.
After the thin metal layer 111 has been coated on the glass substrate 100, a polymer 121, as shown in FIG. 3, is coated on the thin metal layer 111. By pressurizing the polymer 121 with a prepared mold 130, a pattern 131 of the mold 130 is transcribed to the polymer 121. In this case, if the polymer 121 is a thermo-hardening material, a metal mold is used. If the polymer 12 is a UV-hardening material, a transparent polymer mold is used.
Once the pattern of the mold 130 is transcribed to the polymer 121, the mold 130, as shown in FIG. 4, is placed parallel to the polymer 121 after the polymer 121 has been coated on the thin metal layer 111. Heat or UV-ray is then applied to the mold 130 to harden the polymer 121. Namely, if the polymer 212 is the thermo-hardening material, the polymer is hardened by hot stamping. If the polymer is the UV-hardening material, a transparent mold is used by UV stamping instead of hardening the coated polymer.
After the polymer 121 has been hardened, the mold 130, as shown in FIG. 5, is separated from the polymer 122. Hence, a pattern 122 identical to the pattern 131 of the mold 130 is transcribed to the polymer 121 from which the mol 130 has been removed. In this case, tops and bottoms of the pattern 122 are opposite to those of the pattern 131 of the mold 130. In case of using hot stamping, the mold 130 is separated from the polymer 121 after a temperature of the substrate has been lowered. In case using UV stamping, the mold 130 is separated from the polymer 122 after completion of UV hardening.
After the mold 130 has been separated from the polymer 121, dry etch is carried out on an entire surface of the polymer pattern to expose a surface of the thin metal layer, as shown in FIG. 6, is exposed. Since prominence and depression is formed on the dry-etched polymer 121 by the mold 130 to have a step difference, the thin polymer is removed by the etch process to expose the surface of the thin metal layer.
Once the dry-etched polymer 123 is formed, a metal grid pattern 112, as shown in FIG. 7, is formed by etching the exposed thin metal layer 111 by dry or wet etch.
Subsequently, the polymer 123 remaining on the metal grid pattern 112 is removed to complete the wire grid polarizer, as shown in FIG. 8, having the specific metal grid pattern 112 on the substrate 100.
However, since the related art wire grid polarizer is fabricated on the glass substrate by a general semiconductor fabricating process, it is difficult to use the glass substrate that is thin.
And, the glass substrate is not fit for lightweight and duration.
Moreover, in case of a polarizing device having flexibility such as a flexible display and the like, it is unable to use the wire grid polarizer fabricated on the glass substrate.

Flexible wire grid polarizer and fabricating method thereof


An electrically identifiable medical electrode lead. The lead includes a flexible lead body having a distal end and a connector end. The lead also includes a plurality of electrodes disposed near the distal end of the flexible lead body. The lead further includes a connector disposed at the connector end of the flexible lead body, the connector including a plurality of contacts. The lead additionally includes a plurality of conductors supported by and passing through the flexible lead body, the plurality of conductors including electrical conductors that provide paths for electrical current from the connector to the plurality of electrodes. Finally, the lead includes a memory circuit supported by the flexible lead body and being in electrical communication with a contact of the plurality of contacts in the connector.

The invention relates to electrically identifiable electrode leads and methods of electrically identifying medical electrode leads, such as an implantable medical electrode lead. An exemplary implantable medical electrode lead can be used with an implantable pulse generator (IPG) of an electrical stimulation system.
When a physician implants multiple leads and connects them to an IPG, for example, the positions of the leads and the characteristics of the individual leads may be unknown, for example to the clinician programmer. Thus, confusion may arise of what locations and characteristics of the individual leads relate to what stimulation channel, after they have been implanted.
Currently, when information about implanted leads is recorded, it is typically done manually and before the implantation has occurred. For example, during surgery, a lead packaging will be opened and the brand, model, and serial number recorded by hand into the patient's medical record or into a clinician programmer device. Further, a manual assignment is required of the lead connected to the bore of the IPG header. These manual entries leave room for error in the process of recording information and may lead to false stimulation programming. Thus, what is needed are means and methods for accurately, quickly, and reliably determining what types of leads are connected to an IPG and their respective positions within the patient.

Electrically identifiable electrode lead and method of electrically identifying an electrode lead


The invention provides anti-LgR5 antibodies and immunoconjugates and methods of using the same.

Leucine-rich repeat-containing G protein-coupled receptor 5 (LgR5) is a seven-transmembrane protein found on the surface of actively cycling intestinal stem cells (ISCs). LgR5-expressing ISCs are sensitive to Wnt modulation and are primarily responsible for homeostatic regeneration of the intestinal epithelium. Elimination of LgR5-expressing cells in mice does not affect homeostasis of intestinal epithelium, however, suggesting that other cell types can compensate for loss of this cell population. Tian et al., Nature 478: 255-259 (2011). R-spondins enhance WNT signaling by WNT3A, and all four R-spondins, RSPO1, RSPO2, RSPO3, and RSPO4, are able to bind to LgR5. Lau et al., Nature 476: 293-297 (2011).
Human LgR5 is a 907 amino acid protein, of which ˜540 amino acids are predicted to be in the extracellular space following cleavage of the amino-terminal signal sequence. LgR5 comprises 17 imperfect leucine-rich repeat motifs in the ectodomain, and a cysteine-rich region located between the leucine-rich repeats and the first transmembrane domain.
There is a need in the art for agents that target LgR5 for the diagnosis and treatment of LgR5-associated conditions, such as cancer. The invention fulfills that need and provides other benefits.

Anti-LGR5 antibodies and immunoconjugates


Provided is a projection-type charged particle optical system in which a projection magnification can be changed while a decrease in the accuracy in measuring a mass-to-charge ratio is being suppressed. A projection-type charged particle optical system according to the present invention includes a first electrode disposed so as to face a sample and having an opening formed therein for allowing a charged particle to pass, a second electrode disposed on a side of the first electrode opposite to where the sample is disposed and having an opening formed therein for allowing the charged particle to pass, and a flight-tube electrode disposed such that the charged particle that has been emitted from the sample and has passed through the second electrode enters the flight-tube electrode and being configured to form a substantially equipotential space thereinside. A principal plane is formed at at least two positions in a travel path of the charged particle.

Imaging mass spectrometry is receiving broad attention as a technique for detecting the distribution of substances within a sample, in the field of pathological studies, drug development, and so on. Typically, in mass spectrometry, a sample is irradiated with a laser beam, an ion beam, an electron beam, or the like so as to be ionized, and the resulting ions are separated in accordance with their mass-to-charge ratios. Thus, a spectrum of detected intensities as a function of the mass-to-charge ratio is obtained. In imaging mass spectrometry, a surface of an object to be measured (sample) is subjected to mass spectrometry two-dimensionally, and a two-dimensional distribution of detected intensities of the substances corresponding to the respective mass-to-charge ratios is obtained. Thus, information on the distribution of the substances at the surface of the sample is obtained. Imaging mass spectrometry enables biomolecules, such as protein, and drug molecules to be identified, and also makes it possible to measure the spatial distribution of such biomolecules and drug molecules at high spatial resolution.
A charged particle beam, such as a laser beam and an ion beam, is used in order to ionize a sample, and such a beam is generally referred to as a primary beam. In addition, an ion generated when an ion beam is used as a primary beam (primary ion beam) is referred to as a secondary ion, and a technique for detecting such secondary ions is known as secondary-ion mass spectrometry (SIMS). Furthermore, matrix-assisted laser desorption/ionization (MALDI) is a known example in which a laser beam is used as a primary beam, and a sample that has been crystallized by being mixed into a matrix is irradiated with a pulsed laser beam so as to be ionized.
A time-of-flight technique, which is suitable for detecting molecules having large mass, such as protein, is often employed for detecting an ionized sample by separating the ionized sample in accordance with the mass-to-charge ratio. In a time-of-flight mass spectrometry apparatus, ions are generated in pulses at a surface of a sample, and accelerated through an electric field; or ions are accelerated in pulses through an electric field in vacuum. Ions travel at different flight speeds in accordance with their mass-to-charge ratios, and thus the mass-to-charge ratio of a given ion can be determined by measuring the time (i.e., time of flight) it takes for the given ion to travel a predetermined distance to reach a detector after being emitted from the sample.
In addition, imaging mass spectrometry includes scanning imaging mass spectrometry and projection-type imaging mass spectrometry.
In scanning imaging mass spectrometry, small regions (the size is dependent on the beam diameter of a primary beam) on a sample are successively subjected to mass spectrometry, and the distribution of substances is reconstructed from the result of the mass spectrometry and the positional information of the small regions. Thus, the spatial resolution is determined by the beam diameter of the primary beam and the positional precision of the scanning primary beam.
In projection-type imaging mass spectrometry, a sample is irradiated with a primary beam so as to be ionized, and a position- and time-sensitive detector detects the time at which a generated ion has reached the detector and the position on the detection surface of the detector which the ion has reached. Furthermore, a projection-type charged particle optical system configured to form an image of the ion on the detector is provided, and thus the mass of the detected ion and the position of the ion on the surface of the sample are detected simultaneously. Accordingly, the spatial distribution of substances contained in the sample can be obtained. The projection-type charged particle optical system is formed by an electrostatic lens, a magnetic lens, or the like.
An electrostatic lens is often used as a projection-type charged particle optical system (PTL1). An electrostatic lens causes ions to converge through an electric field and forms an image of the ions on a detector. The spatial resolution of a projection-type charged particle optical system is determined by the accuracy in determining the positions on the detection surface where the ions have reached (positional resolution), the magnification or the aberration of the charged particle optical system, and so forth.
In the field of pathological studies or drug development, a minute structure in the order of microns needs to be observed when a cell or a microstructure is to be observed. In the meantime, a broader range in the order of millimeters or centimeters needs to be observed when a biological tissue is to be observed. Therefore, it is effective to switch the magnification in such a manner that, in the case of the former, the measurement is carried out in a condition in which the spatial resolution is high (high magnification), and in the case of the latter, the measurement is carried out in a condition in which the spatial resolution is low but the measurement range is broad (low magnification).

Projection-type charged particle optical system and imaging mass spectrometry apparatus


A method and system for brokering frequencies for use in peer-to-peer communication sessions. A frequency broker receives session-participation messages from multiple parties wishing to communicate wirelessly with each other. The broker selects a frequency for the parties to use and then instructs the parties to communicate with each other on the selected frequency. And the parties then engage in peer-to-peer communication with each other over the selected frequency.

1. Field of the Invention
The present invention relates to wireless communications, and more particularly to establishment of peer-to-peer wireless communications.
2. Description of Related Art
In a typical peer-to-peer wireless communication session, all of the participating users tune their communication devices to a common frequency for the session. Each user can then send and receive signals over that common frequency so as to communicate with the other user(s).
In many cases, peer-to-peer wireless communications operate within a public-use frequency spectrum, which is a set of frequencies freely available for use by members of the public. (While governmental regulations might restrict the manner of use of public use frequencies, regulations usually do not restrict who can use the frequencies.) Contrasted with public-use frequencies, are licensed frequencies, such as those typically employed by wireless telecommunication carriers (e.g., in the 800 to 900 MHz and 1800 to 1900 MHz ranges), which are not freely available for use by members of the public. As a result, public use frequencies may also be referred to as "unlicensed" frequencies.
An example of a frequency range in the public use spectrum is the 462.5625 to 467.7125 MHz band allocated for "Family Radio Service" (FRS). Advanced FRS units, such as Talkabout® handheld radios manufactured by Motorola, Inc., for instance, allow users to select from 14 channels, each defined respectively within the FRS band. Users may also set their devices to use a particular squelch code, or CTCSS code, which effectively allows communication in the selected channel with other devices that are set to use the same CTCSS code. Thus, for instance, a group of users might agree in advance to tune their FRS devices to channel 9 and CTCSS code 20, and the users may then communicate with each other.
Commonly, the users will agree in advance what frequency to use. (In this regard, as used herein, the term "frequency" could mean a single frequency, a frequency range, and/or, more generally, any communication channel.) For instance, the users might call each other by telephone or meet in person to select a frequency to use, and each user will then tune his or her respective device to the selected frequency.
Unfortunately, however, it is often difficult to reliably select a frequency that will support communications in the public use spectrum. Many times, public use frequencies are busy or noisy. Thus, if a group of users decides to communicate on a given frequency and the users then disperse throughout a given area, it is possible that some or all of the users might encounter interference on the agreed frequency. Further, in many cases, a group of users might not be able to get together in advance to agree on a frequency to use.

This patent is subject to a terminal disclaimer.

Method and system for brokering frequencies to facilitate peer-to-peer communication


The present invention provides a controlled release device for sustained or pulsatile delivery of pharmaceutically active substances for a predetermined period of time. This invention further provides such device in which sustained or pulsatile delivery is obtained by the unique blend and intimate mixture of pharmaceutically active substances with a microbial polysaccharide and uncrosslinked linear polymer and optionally a crosslinked polymer and/or lipophillic polymer and/or saturated polyglycolyzed glyceride. The invention also provides a process for the manufacture of such devices and pharmaceutical compositions containing the same.

The prior art teaches many systems for the delivery of pharmaceutically beneficial agents. One such system operates by means of an osmotic pumping mechanism. However, it suffers from being very complex and is complicated to manufacture. A second type of pharmaceutical delivery system utilizes hydrogels either from a group consisting of uncrosslinked linear polymers or from a group consisting of crosslinked polymers. In devices using uncrosslinked polymers, viscosity is the rate controlling factor for drug release kinetics. In these systems a gelatinous layer is formed on the surface upon hydration. The thickness and durability of this gelatinous layer depends upon the concentration, as well as the molecular weight and viscosity of the polymer in the device. At higher concentrations the linear polymer chains entangle to a greater degree leading to virtual crosslinking and a stronger gel layer. Drug release is by the dissolution of polymer and erosion of the gel layer and hence the rate of erosion is what controls the release rate. Although viscosity is an important consideration in controlled drug release from hydrogel matrices, it is viscosity under low shear conditions that control diffusion through the matrix.
Several U.S. Patents are directed to the various pharmaceutical delivery systems as mentioned above, see for example U.S. Pat. Nos. 3,845,770, 3,916,899, 4,016,880, 4,160,452 and 4,200,098. While these systems do provide for the delivery of a selected pharmaceutical agent, none of these provide a controlled or pulsatile delivery of the pharmaceutical agent in which drug release is modulated by combining a microbial polysaccharide and uncrosslinked polymer. Furthermore, none of the prior art teaches a device comprising a microbial polysaccharide and uncrosslinked polymer and optionally a crosslinked polymer and/or lipophillic polymer and/or saturated polyglycolyzed glyceride.
There was therefore a need to develop a novel controlled release pharmaceutical delivery device which could be made in a cost efficient manner and provide for either sustained or pulsatile delivery of the selected pharmaceutical incorporated therein.

Controlled release delivery device for pharmaceutical agents incorporating microbial polysaccharide gum


A process comprising catalytically converting ethane to ethylene and acetic acid in the presence of oxygen at a temperature of 450° C. or less in the gas phase wherein the catalyst has the empirical formula MoVaNbbTecZdOn.

The invention relates to a process for low temperature dehydrogenation of ethane to ethylene and acetic acid in the presence of oxygen, and particularly to a process using a catalyst featuring good conversion and good selectivity.
Low temperature oxydehydrogenation of ethane to ethylene has become well known since the publication of "The Oxidative Dehydrogenation of Ethane over Catalyst Containing Mixed Oxide of Molybdenum and Vanadium" by E. M. Thorsteinson, T. P. Wilson, F. G. Young and P. H. Kasai, Journal of Catalysis 52, pp. 116-132 (1978). This article discloses mixed oxide catalysts containing molybdenum and vanadium together with another transition metal oxide (Ti, Cr, Mn, Fe, Co, Ni, Nb, Ta, or Ce). The catalysts are active at temperatures as low as 200° C. for the oxydehydrogenation of ethane to ethylene.
The effectiveness of the oxydehydrogenation of ethane to ethylene is usually primarily determined by two parameters: conversion of ethane, and selectivity (efficiency) to ethylene. As used herein, these terms are defined as follows:
            conversion                                      of                                      ethane        =                                        [            CO            ]                                          /            2                                          +                          [                              CO                2                            ]                                                        /          2                                  +                      [                                          C                2                                                          H                4                                      ]                                                                          [              CO              ]                                                  /              2                                                  +                              [                                  CO                  2                                ]                                                                    /            2                                          +                          [                                                C                  2                                                                  H                  4                                            ]                                      +                  [                                    C              2                                                  H              6                                ]                                selectivity                                              (        efficiency        )                                            to                                      ethylene        =                  [                              C            2                                          H            4                          ]                                          [            CO            ]                                          /            2                                          +                          [                              CO                2                            ]                                                        /          2                                  +                      [                                          C                2                                                          H                4                                      ]                              wherein: [ ]=relative moles of the component and the production of acetic acid is negligible. The terms in the art are sometimes calculated differently but the values calculated either way are substantially the same.
Under certain reaction conditions, substantial amounts of acetic acid can be formed as a co-product and the effectiveness of the reaction to ethylene and acetic acid is calculated by the following equations:
            conversion                                      of                                      ethane        =                                        [            CO            ]                    /          2                +                              [                          CO              2                        ]                    /          2                +                  [                                    C              2                                                  H              4                                ]                +                  [                                    CH              3                                    COOH                    ]                                                  [            CO            ]                    /          2                +                              [                          CO              2                        ]                    /          2                +                  [                                    C              2                                                  H              4                                ]                +                  [                                    C              2                                                  H              6                                ]                +                  [                                    CH              3                                    COOH                    ]                                selectivity                                              (        efficiency        )                                            to                                      ethylene                                      and                                      acetic                                      acid        =                            [                                    C              2                                                  H              4                                ]                +                  [                                    CH              3                                    COOH                    ]                                                  [            CO            ]                    /          2                +                              [                          CO              2                        ]                    /          2                +                  [                                    C              2                                                  H              4                                ]                +                  [                                    C              2                                                  H              6                                ]                +                  [                                    CH              3                                    COOH                    ]
One application of a catalytic ethane to ethylene and acetic acid process would be as a front end process for commercial vinyl acetate monomer (VAM) synthesis. The reaction of acetic acid with ethylene (acetoxylation) is the dominant route to vinyl acetate today. Because current vinyl acetate process technology is mature, accomplishing significant improvements has become increasingly difficult. A reduction in feedstock costs would lead to cost-savings in the production of VAM. The use of ethane and oxygen as starting feedstock would represent a significant savings in raw material cost over the currently-used ethylene and acetic acid.
It would be desirable to have a process which reacts ethane with oxygen over a catalyst to selectively coproduce a product stream comprising ethylene and acetic acid, which product stream could be used in VAM production.

Process for making ethylene and acetic acid