An improved heating system is disclosed for providing heated air to a heated space, preferably using a gaseous fuel as the energy source. The system preferably includes an air heating sub-system, a compact combustion chamber, a separate cold air supply sub-system for conveying cold air from the heated space to the air heating sub-system, a combustion chamber heat exchanger in fluid communication with the cold air supply sub-system for transferring heat thereto, and a separate air circulating sub-system for withdrawing cold circulating air from the heated space. A mixing chamber is provided for mixing heated air from the air heating sub-system with the cold circulating air to provide heated air to the space. The system also preferably includes separate sub-systems for supplying pressurized combustion air and pressurized gaseous fuel to the air heating sub-system and for forcibly conveying exhaust gases therefrom without the need for a draft-type chimney or stack. In one preferred embodiment, a vortex-type air separator separates higher temperature and lower temperature combustion air, with the higher temperature air being used for combustion and the lower temperature air being heated in an exhaust gas heat exchanger before being conveyed to the heated space. A novel control sub-system is also provided for controlling the system, preferably in response to both indoor and outdoor temperatures, and for minimizing the number of energy wasting on/off cycles in operating the system.

The invention relates generally to heating systems primarily adapted to providing heated air to a space to be heated, such as a building or an enclosed portion thereof. More specifically, the invention relates to such a heating system fueled by a gaseous fuel, although the invention is also applicable to heating systems using other fuels.
Previous conventional forced-air heating systems for residential or commercial buildings, or for enclosed portions thereof, have included furnaces that burn a mixture of fuel and air in order to produce heat. Heat exchangers are included for transferring the heat from such combustion to an air flow system that is circulated through the heated space and then returned to the heat exchanger. Such conventional furnace systems have been found, however, to be wasteful in terms of their use of the thermal energy available from the combustion process, largely because exhaust gases are discharged into the atmosphere at considerably high temperatures, frequently in excess of 300 F. (149 C.), which is well in excess of the desired room temperature in the space to be heated.
Even the best of the above-described conventional furnace systems are estimated to waste up to fifteen percent to twenty percent of the gross heating value of the fuel consumed when operating at steady state conditions. Such waste of thermal energy is further compounded by the fact that when the furnace and the circulating fan of such conventional heating systems are shut off in response to a signal from a thermostat in the heated space, the typical draft-type chimney continues to draw warm air from the furnace and from inside the building and then discharges such warm air to the atmosphere. Then when the thermostat again calls for heat, the system must restart and warm up before being capable of supplying heated air. In the northern states of the United States, this on/off cycling operation is estimated to occur over twenty thousand times per year in a typical forced-air heating system, thus resulting in an overall loss or waste of thermal energy estimated to be approximately forty percent of the available heating value of the fuel consumed.
In addition to the above disadvantages, such conventional heating systems have become economically unfeasible in large residential or commercial structures requiring very high draft-type chimneys. Because of the low cost effectiveness of the construction and maintenance of such large chimneys, such heating systems have frequently been constructed and installed on the roof of such buildings, therefore complicating their installation and increasing their cost. Alternately, especially in multi-tenant or multi-dwelling residential or commercial buildings, electric heating systems have been installed in order to reduce the initial construction cost, allow individual heating control for multiple units of the building, and eliminate the need for the building management to account for, and separately re-bill, the cost of each unit's share of the overall cost of operating a centralized heating system. Such alternate electric heating systems have included electric resistance-type heating units or heat pumps, for example, but suffer the disadvantage of being relatively expensive to operate in comparison with heating systems fueled by gaseous fuels, such as natural gas.
Because of the above-discussed disadvantages and shortcomings of conventional forced-air heating system and of typical electric heating systems, one of the primary objects of the present invention is to provide a forced air heating system, preferably fueled by a gaseous fuel, that effectively uses a much higher percentage of the available heating value of the fuel being consumed and that more effectively recovers a high percentage of the thermal energy present in the exhaust gases discharged to the atmosphere.
Another object of the present invention is to provide such a heating system that does not require a conventional chimney or other draft-type exhaust gas discharge conduit.
Another object of the present invention is to provide a heating system that maximizes the control over the function of the heating system and operates at a lower thermal energy input, but that operates for longer periods of time, thereby minimizing the number of on/off cycles required to maintain a desired temperature in the heated space, thereby maximizing the efficiency of the heating system.
Still another object of the present invention is to provide a heating system that employs a separate system for air circulating at a relatively low velocity to and from the heated space and separate high-velocity air system for transferring the heat of combustion to the air supplied to the heated space, as well as providing separate pressurized combustion air and fuel supply systems that forcibly convey combustion exhaust gases out of the heating system.
In accordance with one aspect of the present invention, a heating system for heating a space generally includes an air heating sub-system with a relatively compact combustion chamber adapted for burning a mixture of combustion air and fuel in order to produce heat, a separate cold air supply sub-system for conveying cold air from the heated space to the air heating sub-system, a combustion chamber heat exchanger in fluid communication with the cold air supply sub-system for transferring heat from the combustion chamber to the cold air withdrawn from the heated space by the cold air supply sub-system, and a separate air circulating sub-system for withdrawing cold circulating air from the heated space. The heating system also preferably includes an air mixing chamber in fluid communication with both the combustion chamber heat exchanger and the air circulating sub-system for mixing heated air with cold circulating air in order to provide heated circulating air to the heated space.
In accordance with another aspect of the present invention, the heating system includes a combustion air supply sub-system having a combustion air compressor for supplying the combustion air to the combustion chamber at an elevated pressure, a gaseous fuel supply sub-system having a gaseous fuel compressor for conveying gaseous fuel from a gaseous fuel source to the combustion chamber at an elevated pressure substantially equal to the elevated pressure of the combustion air, with the pressure of the combustion air and the gaseous fuel being sufficient to forcibly convey the mixture of combustion air and gaseous fuel into the combustion chamber and to forcibly convey the products of combustion through a relatively small exhaust discharge conduit without the need for a draft-type chimney or conduit.
In accordance with still another aspect of the present invention, the combustion air supply sub-system for a heating system includes a separator device, such as a vortex-type separator, that separates combustion air above a predetermined temperature from combustion air that is below such predetermined temperature. Such higher temperature combustion air is conveyed to the combustion chamber of the heating system, and the relatively lower temperature combustion air is conveyed to an exhaust gas heat exchanger for transferring heat from the exhaust gas to such relatively lower temperature combustion air. The combustion air that has been heated in the exhaust gas heat exchanger is then conveyed back to the heated space in order to effectively recover thermal energy that would otherwise have been wasted as the exhaust gas from the combustion chamber is discharged to the atmosphere.
A further aspect of the present invention is the provision of combustion air and gaseous fuel bypass systems, including automatic bypass valves, for bypassing quantities of combustion air and gaseous fuel from the discharges to the intakes of the respective combustion air and gaseous fuel compressors. The bypass systems allow for selective control of the quantities of fuel and air being supplied to the combustion chamber in order to control the heat being supplied to the heated space without the need for the wasteful frequent on/off cycling operation mentioned above in connection with conventional heating systems. In addition, the heating system of the present invention preferably includes a microprocessor control system that operates and controls the above bypass systems and other components of the heating system in response to temperature input signals from both the heated space and the exterior surroundings.
Many or all of these objectives and features were obtained by the invention described and claimed in a previous patent, U.S. Pat. No. 4,669,656, issued Jun. 2., 1987, to the same inventor and assignee as the present invention. However, the present invention builds upon, and provides even further developments over, that of such previous patent.
Such developments include combustion chamber apparatuses that provide for an improved, more evenly distributed flame pattern that more efficiently and more effectively conveys the thermal energy of the preferred gaseous fuel to the surrounding heat exchanger device. Other of such developments include improved heat exchanger devices and arrangements for even more efficient, effective heat transfer to the air being heated. Also, an innovative remote pilot system can optionally be employed in conjunction with any or all of the various disclosed embodiments of the invention.
In this regard it should be emphasized that any of the improved combustion chamber, heat exchanger, or remote pilot developments disclosed herein can be interchangeably incorporated into, or combined with, the disclosed embodiments of the above-mentioned previous patent, either separately or in various combinations that will readily occur to those skilled in the art from the following discussion. Similarly, the corresponding components disclosed in such previous patent can be interchangeably incorporated into, or combined with, those disclosed herein. For this reason such previous patent, U.S. Pat. No. 4,669,656, is expressly incorporated by reference as part of the disclosure herein.
Additional objects, advantages and features of the present invention will become apparent from the following description and appended claims, taken in conjunction with the accompanying drawings.


A method of level assist feature OPC layout is described using frequency model-based approach. Through low-pass spatial frequency filtering of a mask function, the local influence of zero diffraction energy can be determined. By determining isofocal intensity threshold requirements of an imaging process, a mask equalizing function can be designed. This provides the basis for frequency model-based assist feature layout. By choosing assist feature parameters that meet the requirements of the equalizing function, through-pitch focus and dose matching is possible for large two dimensional mask fields. The concepts introduced also lead to additional assist feature options and design flexibility.

Optical proximity effect reduction methods using sub-resolution assist features have been in use for several years. Reduction methods are referred to as Optical Proximity Correction (OPC) and specific approaches include the use of scatter bars. See for instance J. F. Chen, U.S. Pat. No. 5,242,770 and sub-resolution assist features (SRAFs) as in S. Mansfield, L. Liebmann, A. Molless, and A. Wong, "Lithographic Comparison of Assist Feature Design Strategies," Proc. SPIE 4000, pp. 63–76, 2000. Assist feature OPC has been shown to improve across pitch imaging performance of low k1 features where k1=pNA/2? and p equals pitch, NA equals the numerical aperture of the objective lens, and ? equals the exposure wavelength. Assist feature OPC has been described using various treatments but it can be most useful to consider the diffraction field effects introduced. Description and analysis has been carried out for a variety of resolution enhancement technique (RET) combinations with assist feature OPC, such as B. W. Smith, "Mutual Optimization of Resolution Enhancement Techniques", J. of Microlithography, Microfabrication, and Microsystems, 2, 2002, and B. W. Smith, "Mutual Optimization of Resolution Enhancement Techniques", J. of Microlithography, Microfabrication, and Microsystems, 2, 2002. For multiple assist features, bars are evenly spaced within a space opening between main features. Bars are sub-resolution and the bar frequency is generally beyond the diffraction limits of the imaging system. Because of this, no first order diffraction energy is collected from the bars making the bar frequency inconsequential. As an example, consider an imaging situation for 150 nm main features with a 1:5 duty ratio using 248 nm wavelength and a 0.70 NA objective lens. A typical bar size may be 60 nm and three evenly spaced bars can be inserted between features with a bar pitch of 187.5 nm. The resulting k1 for the bars is 0.27, effectively eliminating lens capture of first diffraction orders using σ values of 0.95 and below. With only zero diffraction order collection, the entire space between the main features experiences a reduction in intensity as a function of the bar width (b) and bar pitch (pb):
                              Space                                                              intensity                                                              reduction                =                                            (                                                                    p                    b                                    -                  b                                                  p                  b                                            )                        2                    =                                                    (                0.68                )                            2                        =            0.46                                              (        1        )
The result is exactly that which would be expected if the space transmission was equivalently reduced. It has been suggested that the effect of the adding multiple assist bars corresponds to the introduction of frequency terms to isolated features so as to resemble that of the dense features. This analysis is problematic on two accounts. First, as shown above, the frequency of the bars is often beyond imaging limits, eliminating all but their zero diffraction order influence. Second, if the bars are placed at a frequency that matches that of the dense main features, the likelihood that the bars will print increases when using modified illumination. The frequency of the bars would be such that off-axis distribution of diffraction energy will increase the modulation and the depth of focus of the bars themselves.
Current methods used for OPC layout are based on sets of rules for best pattern performance (known as rules-based OPC) or the extraction of models based on the parameters that result in best pattern performance (known as model-based OPC). With rules-based approaches, adjustments are applied to feature edges, bar sizes, and spacing based on pattern width and edge location. Model-based approaches are based on the convolution of predefined kernel functions with a mask function. See for example J. P. Stirniman, M. L. Rieger, "Fast Proximity Correction with Zone Sampling," Proc. SPIE 2197, pp. 294–376, 1994. Kernel functions may incorporate specific optical, resist, and etch behavior. Both methods are concerned with the spatial (X-Y) fidelity between the structure layout, the mask function, the intensity images, and the images formed in photoresist. It is difficult to optimize lithographic imaging parameters such as OPC strictly from the traditional standpoint of dimensional analysis. Furthermore, it is difficult to perform optimum OPC layout using models or rules based on spatial (or X-Y) information and performance. Such approaches usually lead to sets of rules that are only valid around a small factor sample space. Furthermore, the current approaches do not address the unique nature of a masking layer that consists of a series of contact features or vias.
In order to connect a one level of a device to another, the device must have an array of contacts. Some devices have many contacts and the pattern of a contact mask may have a number of dense features and semi-isolated features. It is desirable to fabricate devices with about the same size contacts. However, often the density of contact features will enlarge contacts in the dense region and contacts in a semi-isolated region will be reduced in size. The disparities in sizes of contact openings or vias is undesired and there is need to correct this problem and provide a lithographic technique that will provide local correction of contact mask to provide uniform contact features.
At present, the rule based systems and model based systems and combinations of the two are complex and often interfere with one another. In other words, corrections made by the rule based systems may offset corrections provided by the model based system.

Method of photomask correction and its optimization using localized frequency analysis


An electronic device made by a process that includes forming a first layer over a substrate and placing a first liquid composition over a first portion of the first layer. The first liquid composition includes at least a first guest material and a first liquid medium. The first liquid composition comes in contact with the first layer and a substantial amount of the first guest material intermixes with the first layer. An electronic device includes a substrate and a continuous first layer overlying the substrate. The continuous layer includes a first portion in which an electronic component lies and a second portion where no electronic component lies. The first portion is at least 30 nm thick and includes a first guest material, and the second portion is no more than 40 nm thick.

1. Field of the Invention
The invention relates generally to electronic devices and processes for forming the same, and more specifically, to electronic devices including one or more guest materials within a layer and processes for forming the same.
2. Description of the Related Art
Electronic devices, including organic electronic devices, continue to be more extensively used in everyday life. Examples of organic electronic device include Organic Light-Emitting Diodes ("OLEDs"). Current research in the production of full color OLEDs is directed toward the development of cost effective, high throughput processes for producing color pixels. For the manufacture of monochromatic displays, spin-coating processes have been widely adopted. However, manufacture of full color displays usually requires certain modifications to procedures used in manufacture of monochromatic displays. For example, to make a display with full color images, each display pixel is divided into three subpixels, each emitting one of the three primary colors: red, green, and blue. This division of full-color pixels into three subpixels has resulted in a need to modify current processes for depositing different organic polymeric materials onto a single substrate during the manufacture of OLED displays.
One such process for depositing organic material layers on a substrate is ink-jet printing. Referring to FIG. 1, first electrodes 120 (e.g., anodes) are formed over a substrate 100. In addition, in order to form pixels and subpixels, a well structure 130 is formed on the substrate 100 to confine the ink drops to certain locations on the substrate 100. The well structure 130 typically is 1 to 5 microns thick and is made of an electrical insulator. A charge-transport layer 140 (e.g., a hole-transport layer) and organic active layer 150 may be formed by sequentially ink-jet printing each of the layers 140 and 150 over the first electrodes 120.
One or more guest materials may or may not be mixed with the organic active layer 150. For example, the organic active layer 150 within openings of the well structure 130 closest to the left-hand side of FIG. 1 may include a red guest material, and the organic active layer 150 within openings of the well structure 130 near the center of FIG. 1 may include a green guest material, and the organic active layer 150 within openings of the well structure 130 closest to the right-hand side of FIG. 1 may include a blue guest material. The well structure 130 tends to reduce the aperture ratio of a display, and therefore, higher current is needed to achieve sufficient emission intensity as seen by a user of the display.
In an alternative process, the charge-transport layer 140 and organic active layer 150 may be formed with or without a well structure. Inks with different guest materials may be placed on regions of the organic active layer 150. The inks may include a conjugated polymer. After the ink is placed on the organic active layer 150, a diffusion step is performed to drive guest material from the overlying polymer into the organic active layer 150. A second electrode (not illustrated) is formed over the organic active layer 150 and the ink.
Many problems occur when using this process for organic electronic devices formed by such processes. First, most of the guest material does not diffuse into the organic active layer 150. Typically, 25% or less of the guest material from the ink is diffused into the organic active layer 150. Therefore most of the guest material lies outside the organic active layer 150.
Second, the electronic components formed using this ink diffusion process have poor efficiency. As a basis for comparison, the same host material (as the organic active layer 150) and guest material may be mixed before the organic active layer is formed over the substrate. The combination of the host material and guest material may be spin coated and subsequently processed to form an electronic component. The spin-coated electronic component will be referred to as a corresponding conventional electronic component because the organic active layer has the same host material and guest material as the diffused component. Electronic components formed by the ink diffusion process have efficiencies that are lower than their corresponding conventional electronic components. Due to lower efficiency, the electronic components formed using the ink diffusion process have intensities too low to be used for commercially-sold displays.
Third, this ink diffusion process causes a very non-uniform distribution of guest material concentration, resulting in a high concentration gradient (change in concentration divided by distance) between electrodes with an electronic device. The guest material concentration within the organic active layer 150 near the second electrode is typically at least two and usually several orders of magnitude higher than the guest material concentration within the organic active layer 150 near the first electrodes 120. The high guest material concentration gradient makes the display nearly impossible to use, particularly over time. As the potential difference between the first and second electrodes are changed, the location for recombination of electrons and holes within the organic active layer 150 also changes, moving closer to or further from first electrodes 120 (depending on the relative change in potential difference). When the recombination is closer to the second electrode, more guest material is present at the recombination location. When the recombination is closer to the first electrode 120, less guest material is present at the recombination location.
This guest material concentration gradient in the organic active layer 150 causes a different spectrum to be emitted from the electronic component as the potential difference between the first and second electrodes changes. Note that higher intensity is typically achieved by increasing the current, which in turn typically occurs by increasing the potential difference between the first and second electrodes. Therefore, intensity control of a single color (i.e., "gray-scale") is difficult because the emission spectrum shifts with a change in intensity, both of which are caused by a change in the potential difference between the first and second electrodes.
As a component ages, the amount of current needed for the same intensity typically increases. If the host material is capable of emitting blue light, as the intensity decays over time and current is increased (to try to keep intensity relatively constant over time), the emission of red and green doped pixels may become more blue with respect to their initial characteristic emission. As the component ages the operating voltage is increased to maintain constant luminance. If the guest material concentration profile in the host material is not sufficiently uniform, then as the operating voltage is increased to offset luminance decay, the emission spectrum of the red and green pixels may begin to include a blue component as a result of changes in the recombination zone position and width within the emissive layer.
Fourth, the ink diffusion process is nearly impossible to use in manufacturing because of the sensitivity to thickness of the organic active layer 150. Relatively small changes in thickness can have a large impact on the guest material concentration profile within the organic active layer 150. For displays, a user will observe variation from display to display, or even within the array of a single display, due to variation in the thickness of the organic active layer 150 during the fabrication process.
A different conventional process uses a vapor or solid phase diffusion process. Both processes suffer from similar problems previously described. If the diffusion is long enough to make the concentration of a guest material more uniform throughout a thickness of the layer (i.e., reduce the concentration gradient between the electrodes), lateral diffusion will be too large and can result in low resolution because the pixels will need to be large. Alternatively, if lateral diffusion can be kept at an acceptable level for high resolution, the guest material concentration gradient throughout the thickness of the organic layer may be unacceptably large. In some instances, both problems may occur (i.e., unacceptably large laterally diffusion while having too severe of a concentration gradient between the electrodes of the electronic device).

Electronic device including a guest material within a layer and a process for forming the same


The present invention relates to a refractory for casting process composed mainly of 0.3 to 10 wt % light burned magnesia, 3 to 30 wt % micro fine calcined alumina, and the remainder of either sintered alumina, fused alumina and MgO-Al.sub.2 O.sub.3 spinel or sintered alumina and MgO-Al.sub.2 O.sub.3 spinel or fused alumina and MgO-Al.sub.2 O.sub.3 spinel.

The present invention relates to refractories for casting process which are highly erosion resistant, especially to slag with a high FeO content. These refractories for casting process are effective for the lining of RH type, DH type and other vacuum degassing furnaces where slag with a high FeO content exists, and can also be used as refractories for converters, ladles, torpedo cars, gas blowing lances, etc.
RH type, DH type and other vacuum degassing furnaces are known as molten steel processors. Magnesia-chromite direct bonded bricks have principally been used as lining materials for such vacuum degassing furnaces to date, however, the inherent problems are that burning the brick requires considerable energy and that the construction of the furnaces requires special skill and is very labor-intensive.
In addition, due to the chrome content of magnesia-chromite direct bonded bricks, a problem concerning environmental protection exists as to suitable brick disposal methods after use. Lining vacuum degassing furnaces with monolithic refractories overcomes the high labor and environmental costs otherwise generated in operating such furnaces.
In the operation of vacuum degassing furnaces, however, molten steel and slag are vigorously stirred inside, causing considerable wear of the lining materials. Bricks other than the direct bonded magnesia-chromite types are of insufficient durability and monolithic refractories are far less durable.
Refractories for casting process containing alumina-spinel have been proposed as monolithic refractories for the lining of molten steel vessels. For example, Japanese Provisional Patent publication No. 50-60985 discloses a material containing at least 60 wt % spinel, 10 to 35 wt % alumina and 3 to 10 wt % alumina cement. Japanese Provisional Patent Publication No. 1-87577 discloses another material composed of 50 to 90 wt % alumina, 10 to 40 wt % spinel and 3 to 25 wt % alumina cement. Also, Japanese Provisional patent No. 53-218585 discloses a refractory for casting process having fine magnesia and ultra-fine alumina powder arranged in the matrix section of an alumina material.
These refractories for casting process are highly durable due to the synergistic effect of the erosion resistance of alumina and the slag penetration-proof property of spinel and cause no pollution problem because they contain no chrome.
However, these conventional alumina-spinel or alumina-magnesia refractories for casting process are used only for the lining of molten steel ladles or blast furnace troughs, and are not sufficiently durable for the severe working conditions of vacuum degassing furnaces and, as a result, have not been put to practical use for such a purpose.
In the case of vacuum degassing furnaces, slag has a high FeO content as compared with other molten steel vessels. In conventional refractories for casting process which use alumina cement as the binder, Al.sub.2 O.sub.3 from aggregates and CaO from cement react with FeO present in the slag and produce substances of low-melting point such as Al.sub.2 O.sub.3 -FeO or Al.sub.2 O.sub.3 -FeO-CaO. In the case of vacuum degassing furnaces, one of the major causes of lower lining erosion resistance is that slag has a high FeO content which causes substances of low-melting point to be produced.


Resistor devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The conductive materials comprise between about 20% and about 50% of the total weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

(1) Field of the Invention
This invention relates to resistors and, more particularly, to resistors molded of conductive loaded resin-based materials comprising micron conductive powders, micron conductive fibers, or a combination thereof, homogenized within a base resin when molded. This manufacturing process yields a conductive part or material usable within the EMF or electronic spectrum(s).
(2) Description of the Prior Art
Resistors are a basic building block in electrical and electronic systems. Resistors are based on a fundamental property of a material, namely the resistivity or, inversely, the conductivity of the material. Resistivity, or, conversely conductivity, is based on the relative ability, or inability, of a material to conduct current under a voltage bias. Low resistivity materials permit easy current flow and are typically called conductors. Metals, such as copper and aluminum, are examples of excellent conductors. High resistivity materials permit little or no current flow and are typically called insulators. Metal oxides, ceramics, and air are examples of excellent insulators.
The resistance of an object or device is simply a measure of the ratio of voltage to current in that object or a device. Resistance is defined, electrically, by the equation:Resistance=Voltage/Current,and is expressed in Ohms. Resistance depends, mostly, on two factors: (1) the inherent resistivity of the material that makes up the object or device and (2) the physical shape of the device. Resistivity is a material property that is essentially constant, excluding variation due to temperature, for the material once the composition of the material is established. Resistivity (ρ) is expressed in Ohms-cm. The shape of the object is important because actual resistance varies inversely with the available cross sectional area through which current may flow. Resistance may be easily calculated for a simple object once the physical shape and size are known and once the resistivity is known. Resistance is given by:Resistance=ρ×(Areacross-secton/Length),where ρ is the material resistivity. Another useful metric for resistance calculation is sheet resistance. Sheet resistance is defined as the resistance of a square area of a material and is particularly useful in technologies, such as integrated circuit devices, where resistor structures have one fixed dimension, such as depth, and two variable dimensions, such as length and width. Sheet resistance is given in ohms/square and may be used to calculate a resistance value using the equation:Resistance=Sheet Resistance×(Length/Width).
All objects, even metal conductors, have a measurable resistance value across the object. In a metal conductor, this value is usually considered to be an undesirable feature and is termed "parasitic resistance." In other cases, the resistance value is not only desired but, further, it is essential to correct operation of the electrical or electronics circuit. In this case the object or device is typically called a resistor. A resistor comprises two terminals, or connection points to the rest of the circuit, that are separated by the resistor bulk region. Resistors are constructed using a variety of techniques and materials.
Resistors may be categorized in a number of ways. For example, resistors may be discrete devices or may be integrated devices. Discrete resistors are manufactured as individual devices and then placed into, or onto, a circuit. Typically, discrete resistors are further electrically and mechanically attached by soldering. Integrated resistors are formed as part of the fabrication process of the overall circuit. For example, in a semiconductor integrated circuit device, a resistor may be formed by as a patterned line in a polysilicon layer where this same polysilicon layer is also fabricated into a transistor gate in another location on the circuit. This type of resistor is completely integrated into the design and manufacture of the article.
Resistor devices are manufactured using any of several approaches in the art. Film resistors are formed by covering a ceramic substrate with a resistive film. Carbon films and metal films, such as nichrome, are frequently used to create high value, low current resistors. Metal oxide resistors are formed by oxidizing a chemical, such as tin-chloride, on a ceramic substrate. Carbon composition resistors comprise a bulk piece of carbon-based material into which terminals are embedded. Wire wound resistors comprise a long metal wire that is wound around a core and encased in an insulator.
Resin-based polymer materials are used in many arts for the manufacture of a wide array of articles. These polymer materials combine many outstanding characteristics, such as excellent strength to weight ratio, corrosion resistance, electrical isolation, and the like, with an ease of manufacture using a variety of well-established molding processes. Many resin-based polymer materials have been introduced into the market to provide useful combinations of characteristics. However, most resin-based polymer materials are electrical insulators. Attempts to increase the conductivity of resin-based materials have been made in the art. However, the manufacture of useful resistors from resin-based materials has not been successful, to date, in the art. An important object of the present invention is to provide a new type of resistor device from a resin-based material.
Several prior art inventions relate to resistors and methods of manufacturing resistors. U.S. Patent Publication US 2003/0197589 A1 to Taguchi et al. teaches a variable resistor and its means of production. The resistor is formed on a substrate by means of screen printing and utilizes a thermosetting binder resin, a solvent for dissolving the binder resin, and carbon black as the conductive filler. U.S. Patent Publication US 2004/0012479 A1 to Yamada et al teaches a method of manufacturing a chip resistor with a superior surge property. U.S. Pat. No. 4,365,230 to Feldman teaches a lead screw type variable resistor wherein the lead screw is a conductive plastic and acts as a resistive element. U.S. Pat. No. 2,901,381 to Teal teaches a method of manufacture for film resistors. U.S. Pat. No. 6,359,545 B1 to Bressers teaches an adjustable resistor with a slider made of conductive rubber or a conductive plastic and formed with dual resistance strips. U.S. Pat. No. 4,036,786 to Tiedemann teaches a resistor comprising a fluorinated carbon composition as the essential conductive component. This invention also teaches 35% by weight of a conductive filler comprising partially fluorinated acetylene black and utilizes a polysulfone resin as the base resin.

This patent is subject to a terminal disclaimer.

Low cost and versatile resistors manufactured from conductive loaded resin-based materials


An integrated circuit structure is described, and includes a substrate, a contact window, and a Schottky contact metal layer. A heavily doped region and a lightly doped region are formed in the substrate. The contact window is disposed above the heavily doped region, and the Schottky contact metal layer is disposed above the lightly doped region. The Schottky contact metal layer and the substrate form a Schottky diode. The material of the contact window is different from that of the Schottky contact metal layer.

1. Field of Invention
The present invention relates to an integrated circuit structure and manufacturing methods thereof. More particularly, the present invention relates to an integrated circuit structure comprising a Schottky diode and manufacturing methods thereof.
2. Description of Related Art
The Schottky diode is a rectifying device and is composed of a lightly doped semiconductor layer and a metal layer thereon. As a power rectifying device, the Schottky diode has been widely applied to various high speed electric power switches such as power supply switches, motor control drives, telecommunication switches, and switches for factory automation and electronic automation.
However, with the gradually reduced line width of the device, tungsten metal of superior trench filling ability is used to form the contact window during the back process of an integrated circuit. The fabrication of the Schottky diode cannot be integrated with the process of the tungsten contact window and the Schottky diode is usually formed on another chip. Therefore, extra layout designs or assembly are required to integrate the Schottky diode with the integrated circuit having interconnection lines. In this case, the cost of designs and assembly is increased, and the integrity of the device is adversely influenced.
Furthermore, since the Schottky diode achieves rectification by utilizing the work function difference between the lightly doped semiconductor layer and the metal layer thereon, the metal layer must be formed of a low-resistance metal. Otherwise, the efficiency of the Schottky diode will be degraded, and the entire electrical property of the product will be adversely influenced.

Integrated circuit structure and manufacturing method thereof


In a PON system by WDM, IP broadcast can be received without oppressing a band used by a user for Internet communication. An OLT provides a first wavelength received in common by respective ONUs and plural second wavelengths by which the OLT and the respective ONUs perform communication individually. With respect to signals in the downstream direction, each of the OLTs includes a transmitter to transmit the first wavelength and plural transmitters to transmit the second wavelengths used for the individual communication with the respective ONUs. Each of the ONUs includes a receiver to receive the first wavelength and a receiver to receive the second wavelength used in the ONU itself. The OLT transmits data of the IP broadcast by the first wavelength and transmits individual data of each of the ONUs by the second wavelength corresponding to the ONU.

1. Field of the Invention
The present invention relates to a passive optical network system, an optical line terminal and an optical network unit, and particularly to a passive optical network system in which communication is performed by wavelength division multiplexing in an access network using an optical technique or an optical access system using a PON (Passive Optical network) system, an optical line terminal and an optical network unit.
2. Description of Related Art
In recent years, as the Internet becomes widespread, user's methods of using the Internet are diversified. In addition to mail and WEB access, file download by Peer to Peer (P2P) and viewing of movies on the network become general, and from now, broadcast is expected to be performed through the Internet. With this, a demand for speed-up of the network is raised, and Asymmetric Digital Subscriber line (ADSL), Broadband PON (B-PON), Gigabit Ethernet PON (GE-PON) (Ethernet is a registered trademark), or Gigabit Capable PON (G-PON) comes into wide use. Especially, in the PON system, when a local switch (OLT: Optical Line Terminal) installed in a station and a network unit (ONU: Optical Network Unit) installed in each user's house are connected to each other, one fiber is taken out from the OLT and is branched using an optical splitter to connect each user. Thus, the cost of laying the fiber is low, and high-speed communication can be performed since the optical transmission is used, and therefore, the PON system has become widespread in various countries in the world.
Optical transmission systems includes Time Division Multiplexing (TDM), Wavelength Division Multiplexing (WDM), Code Division Multiplexing (CDM) and the like. The B-PON, GE-PON, or G-PON is a system which uses different wavelengths in upstream and downstream and in which with respect to communication between the local switch (OLT: Optical Line Terminal) installed in the station and the network unit (ONU: Optical Network Unit) installed in each user, the communication of signals is performed by time division (TDM) in which signal communication time is assigned to each ONU.
In addition to the optical access system, a further high-speed PON system has been considered. As an approach to speed-up, a system of further increasing communication frequency in the TDM system, a system of increasing the speed by the CDM, or the like has been considered, and as another effective system, a speed-up system by the WDM has been considered.
In the WDM system, the OLT and the ONUs are connected through waves of plural different wavelengths in both an upstream signal and a downstream signal, and each of the ONUs receives and transmits a specific wavelength so that the communication is performed. The individual wavelength is assigned to each ONU from the OLT and the communication is performed, so that a communication band can be remarkably improved, and therefore, the WDM system is expected as a next generation optical access system.
Besides, there is disclosed an example of initial setting of a path on the B-PON system (see, for example, U.S. Pat. No. 6,097,736). Further, there is disclosed a system in which communication between the OLT and the ONUs is performed by the TDM in which signal communication time is assigned to each of the ONUs (see, for example, ITU-T Recommendation G.984.3).
In the WDM system, as described above, the communication band can be improved. On the other hand, one of future applications in the Internet is Internet broadcast. The feature of the broadcast is that the same information is simultaneously distributed to the respective ONUs, and viewing is performed by an IP function-supporting TV or a personal computer connected to each of the ONUs.
In the PON of the WDM system, in the case where a broadcast is delivered from the OLT to the ONUs, since the wavelengths of lights received by the respective ONUs are different from each other, it is necessary that the OLT copies and transmits the broadcast signal for the respective waves.
In the case where waves having the communication capacity of 1 Gbps are assigned to the respective ONUs one by one, for example, when the IP broadcast of 100 ch (about 10 Mbps per 1 ch) is assigned, 1 Gbps is used for the transmission of the broadcast. A band which can be used by the user for the other communication is not left. As stated above, when the IP broadcast is realized on the WDM-PON, the band is oppressed.
Further, in order to transmit the IP broadcast signal to the respective wavelengths, the OLT is required to have a function of copying the IP broadcast and multiplexing it to the respective waves, and the scale of this circuit becomes very large.
On the other hand, in the WDM-PON, each of the ONUs is requested to select a specific wavelength in order to connect with the OLT and to start the communication. When an ONU is installed, it is troublesome that an installer sets a wavelength other than those used in the OLT and the other ONUs. For convenience of the work, it is necessary that each ONU automatically negotiates with the OLT and is connected thereto. However, in the initial state, since it is difficult for the ONU to know which wavelength is to be used to perform the connection, each ONU can not perform the communication for negotiating with the OLT about which wavelength is to be used to perform the communication.

Passive optical network system, optical line terminal, and optical network unit


Methods and systems for identifying a network threat are disclosed. The methods described herein may involve receiving at least one permutation of a domain name, wherein the at least one permutation is registered with a domain name registrar. The methods described herein may further involve executing a scanning function to identify an active service on the at least one permutation registered with the domain name registrar and implementing a threat prevention procedure upon identifying an active service on the at least one permutation.

Due to their prevalence in today's society, the internet and other types of networks have become hubs for criminal activity. Often times cyber-criminals or other threat actors attempt to install or otherwise deploy harmful applications on unprotected systems. Once a threat actor obtains access to a target system or device, they may perform further actions such as stealing data, escalating their privileges, or the like.
Oftentimes, malicious actors gain access to networks by registering a fake domain name that is reminiscent of a legitimate domain name. The malicious actors may then use this fake domain name to engage in targeted attacks against employees, customers, or service providers that would typically interact with the owner of the legitimate domain name.
Defenders generally maintain a reactive posture to address these fake domains, and respond only when informed of the fake domain name or when some malicious event has occurred. For example, security personnel often address phishing campaigns only after they have been launched against unsuspecting personnel. At that point, the malicious actors may have already gained access to a network and may perform additional malicious actions.
A need exists, therefore, for systems and methods that identify these types of network threats.


A thin client terminal that can perform information processing in an off-line state is provided. A thin client terminal 101a sends a request for registration of data to be used off-line and designation of application software to be used off-line to a management server 107 through a remote computer 104. The management server 107 registers the data and application software according to the request. The thin client terminal 101 requests the management server 107 to acquire the requested data and application software, receives the data and application software, and stores the received data and application software into a storage medium 110.

The present invention relates to a thin client system, and particularly to a technique of managing application programs (hereinafter, referred to as application software) and data used in a thin client terminal.
A problem in information management in an organization is that information recorded in a computer or a storage medium such as a Universal Serial Bus (USB) memory leaks out when the computer or the storage medium is lost or stolen.
As a method of preventing such information leakage, there is system architecture in which the minimum necessary processing is performed on a client terminal used by a user and most kinds of processing are concentratedly performed on a server. In this architecture, information and programs for dealing with the information are placed in a computer (a conventional personal computer (PC), a conventional server, a blade PC, a virtual PC in a server, or the like) within an organization such as a business enterprise, and the minimum necessary information and programs dealing with the minimum necessary information are installed on a thin client terminal. When the user uses the thin client terminal, the thin client terminal is subject to restrictions such as inhibition of data writing to a main body storage medium, restriction on enabling (connecting to) or disabling (disconnecting) an external device, a peripheral device or a storage medium, inhibition of rewriting an execution program, inhibition of activating an unauthorized program, and the like. In a thin client system, such a thin client terminal is used for remote control of a computer (hereinafter, referred to as a remote computer) placed in an organization such as a business enterprise through a network, to perform information processing.
Japanese Un-examined Patent Application, Laid-Open No. 2005-235159 discloses a remote access system in which a storage device equipped with a tamper resistant device having authentication information is connected to a client terminal and the authentication information is used for remote control of a server through a network. This can reduce secret information remaining in the client terminal and improve security.

Application software and data management method, management system, and thin client terminal, management server and remote computer used therefor


The invention relates to a composition comprising: (A) a propylene-based polymer which is a propylene homopolymer or a propylene copolymer consisting of at least 90 wt % of propylene monomer units and at most 10 wt % of ethylene monomer units and/or an α-olefin monomer units having 4 to 10 carbon atoms, (B) an elastomer of ethylene and an α-olefin comonomer having 4 to 10 carbon atoms, wherein the elastomer has a density of 0.850 to 0.865 g/cm 3 and a melt flow index of 0.1 to 20 dg/min measured in accordance with ASTM D1238 using a 2.16 kg weight and at a temperature of 190° C. and (C) a block copolymer comprising a terminal block comprising styrene or alpha-methylstyrene.

The present invention relates to a polyolefin composition and an article comprising such polyolefin composition.
Packaging applications are important for polyolefin compositions, also in the medical area and for pharmaceutical packaging where the material is mostly sterilised. Especially in food packaging and medical applications, films have to be sterilised. The most common sterilisation procedures are the use of heat (steam), radiation (beta radiation, electrons or gamma radiation) or chemicals (usually ethylene oxide). This sterilisation procedure usually affects the mechanical and optical properties, and decreases the sealing strength.
Use of a composition comprising a propylene polymer and styrene-ethylene-butadiene-styrene block copolymer in a medical multilayer film is known. The composition may further comprise an ethylene copolymer, which has a cost advantage compared to a composition consisting of a propylene polymer and styrene-ethylene-butadiene-styrene block copolymer. For example, U.S. Pat. No. 9,040,132 discloses a multilayer film comprising a layer comprising a copolymer of propylene, ethylene and 1-butene, a copolymer of ethylene and alph-olefin and styrene-ethylene-butadiene-styrene block copolymer. U.S. Pat. No. 6,261,655 discloses a multilayer film comprising a layer comprising polypropylene, ultra-low density polyethylene and styrene-ethylene-butadiene-styrene block copolymer.
There is a need in the art for a polyolefin composition having a good sealing strength even after sterilisation.


A method of forming a thermoplastic sheet for use with a vehicle interior panel includes a negative thermoforming process. The negative thermoforming process can provide a grained and/or coated show surface of the thermoplastic sheet with decorative features that are more sharply defined that those produced using a positive thermoforming process.

Vehicle interior panels, such as door panels, dashboard panels, instrument panels, and headliner panels, are often formed from of a thermoplastic sheet. A grain or other texture is sometimes formed in the show surface (i.e., the exposed surface of the eventual panel that can be observed by a vehicle occupant) to provide enhanced aesthetics, such as to simulate leather. A coating may be applied to the show surface of the thermoplastic sheet and to raised portions of individual granules of the grained surface in a so-called tipping process to enhance the appearance of the surface, and in some cases to furnish surface qualities like softness and matte. The coating can be a gloss, paint, or other material. In some applications, the thermoplastic sheet is formed to its product shape by a positive thermoforming process, in which the thermoplastic sheet is heated and the side of the sheet opposite the show surface is brought into contact with a thermoforming tool surface to form the thermoplastic sheet to the desired shape. Such positive thermoforming processes can limit the sharpness or definition of features formed in the show surface.

Negative thermoforming process for vehicle interior coverings


In a stride measuring apparatus, a signal wave emitter and a signal wave detector are opposed to each other in a direction intersecting with a predetermined direction in which the running surface is driven. The signal wave emitter emits a light beam. The signal wave detector outputs an ON signal when receiving the light beam, and outputs an OFF signal when the light beam is intercepted. A detector part calculates a moving speed on the basis of a difference between a fall time and a rise time of one OFF signal out of two OFF signals outputted in succession from the signal wave detector, and a foot size of a subject. The detector part calculates a difference between output times of the two OFF signals (stride time) and calculates a stride on the basis of a product of the moving speed and the stride time.

1. Field of the Invention
The present invention relates to stride measuring apparatus capable of measuring a stride of a subject running or walking on a running surface of a belt.
2. Related Background of the Invention
A running machine with a belt driven at predetermined speed, so called a treadmill, is in widespread use at sports clubs and others. It is important in view of checking a running posture, to accurately measure a stride of a subject running or walking (hereinafter, both being referred to as running) on a running surface of a belt of a treadmill. As a conventional stride measuring apparatus for measuring a stride of a subject running on the running surface, there is an apparatus provided with a video camera as a sensor and configured to calculate the stride of the subject on the basis of images of feet of the running subject taken by the video camera (e.g., reference is made to Japanese Patent Application Laid-Open No. JP-A-2002-277213).


Methods and apparatus for detecting low impedance short circuits in a secondary winding circuit of a coil of a distributorless ignition system (DIS) by analyzing spark discharge signals on a primary winding of the ignition coil. In one embodiment, the duration times of the spark discharge signals are compared to a threshold spark duration time, with a low impedance short circuit being indicated if the threshold spark duration time is exceeded. In another embodiment, two or more spark dwell signals are applied to the primary of the ignition coil for each spark event of each associated pair of engine cylinders. A first or base time period is determined for the first dwell signal by measuring the time it takes the first dwell signal to produce a preselected current flow in the primary winding. A second time period is then determined by measuring the time it takes the second dwell signal to produce the same preselected current flow in the primary winding. The second time period is then compared to the first time period to determine whether a short circuit exists in the secondary winding circuit. A guard-band time period is subtracted from the first time period to define a minimum duration time for the second time period. If the second time period is equal to or exceeds the minimum duration time, a normal secondary winding circuit is indicated. If the second time period is less than the minimum duration time, a short circuited secondary winding circuit is indicated.

The present invention relates generally to internal combustion engine ignition systems and, more particularly, to a method and apparatus for detecting a low impedance short circuit in an ignition coil secondary winding circuit of an internal combustion engine having a distributorless ignition system (DIS). Distributorless ignition system (DIS) will be used herein to designate an ignition system wherein spark is simultaneously provided to both cylinders of each of one or more pairs of cylinders making up an engine. For such ignition systems, while spark is provided at the correct time for ignition of a fuel charge in one of the cylinders of a pair, spark is also provided in the other one of the cylinders of the pair, which other cylinder is at the end of its exhaust stroke and beginning of its induction stroke.
Stricter vehicle emission standards now required in the United States, Europe and other industrialized countries have created substantial interest in the detection and diagnostics of engine misfiring which is frequently caused by faults in the secondary winding circuit of an ignition coil. Once a misfire has been detected, the fuel control system can be controlled to eliminate or reduce fuel to a malfunctioning cylinder. If fuel continues to be provided to a malfunctioning cylinder, it will result in increased unburned fuel or hydrocarbon (HC) emissions and can lead to damage of a catalytic converter associated with the engine.
Misfiring in conventional ignition systems of internal combustion engines is detected in U.S. Pat. No. 4,918,389 based on a shorter duration of secondary and consequently primary voltage during a misfire. Detected misfires are typically caused by an open circuit in the ignition system due to worn spark plugs, disconnected secondary wiring and the like. A signal indicating the voltage induced in the primary winding of an ignition coil is detected, a reference voltage representing normal firing is generated and the two are compared. The reference voltage is a pulse of predetermined magnitude and duration and the detected voltage on the primary is compared to the pulse to detect if the magnitude of the detected voltage falls below the predetermined magnitude before the end of the pulse. Unfortunately, the disclosed arrangement does not function properly for a DIS.
Open circuit conditions in the secondary winding of a DIS are detected and protected against as described in U.S. Pat. No. 4,969,443. However, the disclosed system does not provide for the detection of a low impedance short circuit in the secondary winding circuit of an engine coil. Such low impedance short circuits are one of the most probable failure modes of an ignition system, for example due to spark plug carbon/ash fouling, and one of the most difficult to accurately detect.
Accordingly, there is a need for reliable and accurate detection of low impedance short circuits in the secondary winding circuits of DIS's to enable an engine controller to adapt fueling in compliance with Federal clean air requirements during such ignition system malfunctions.

Methods and apparatus for detecting short circuited secondary coil winding via monitoring primary coil winding


A process for making absorbent cellulosic paper products such as sheet for towel, tissue and the like, includes compactively dewatering a nascent web followed by wet belt creping the web at an intermediate consistency of anywhere from about 30 to about 60 percent under conditions operative to redistribute the fiber on the belt, which is preferably a fabric. In preferred embodiments, the web is thereafter adhesively applied to a Yankee dryer using a creping adhesive operative to enable high speed transfer of the web of intermediate consistency such as a poly(vinyl alcohol)/polyamide adhesive. An absorbent sheet so prepared from a papermaking furnish exhibits an absorbency of at least about 5 g/g, a CD stretch of at least about 4 percent, and an MD/CD tensile ratio of less than about 1.1, and also exhibits a maximum CD modulus at a CD strain of less than 1 percent and sustains a CD modulus of at least 50 percent of its maximum CD modulus to a CD strain of at least about 4 percent. Products of the invention may also exhibit an MD modulus at break 1.5 to 2 times their initial MD modulus.

Methods of making paper tissue, towel, and the like are well known, including various features such as Yankee drying, throughdrying, fabric creping, dry creping, wet creping and so forth. Conventional wet pressing processes have certain advantages over conventional through-air drying processes including: (1) lower energy costs associated with the mechanical removal of water rather than transpiration drying with hot air; and (2) higher production speeds which are more readily achieved with processes which utilize wet pressing to form a web. On the other hand, through-air drying processes have become the method of choice for new capital investment, particularly for the production of soft, bulky, premium quality tissue and towel products.
Fabric creping has been employed in connection with papermaking processes which include mechanical or compactive dewatering of the paper web as a means to influence product properties. See, U.S. Pat. Nos. 4,689,119 and 4,551,199 of Weldon; 4,849,054 of Klowak, and 6,287,426 of Edwards et al. Operation of fabric creping processes has been hampered by the difficulty of effectively transferring a web of high or intermediate consistency to a dryer. Further patents relating to fabric creping include the following: U.S. Pat. Nos. 4,834,838; 4,482,429 as well as 4,445,638. Note also U.S. Pat. No. 6,350,349 to Hermans et al. which discloses wet transfer of a web from a rotating transfer surface to a fabric.
In connection with papermaking processes, fabric molding has also been employed as a means to provide texture and bulk. In this respect, there is seen in U.S. Pat. No. 6,610,173 to Lindsay et al. a method for imprinting a paper web during a wet pressing event which results in asymmetrical protrusions corresponding to the deflection conduits of a deflection member. The '173 patent reports that a differential velocity transfer during a pressing event serves to improve the molding and imprinting of a web with a deflection member. The tissue webs produced are reported as having particular sets of physical and geometrical properties, such as a pattern densified network and a repeating pattern of protrusions having asymmetrical structures. With respect to wet-molding of a web using textured fabrics, see, also, the following U.S. Pat. Nos. 6,017,417 and 5,672,248 both to Wendt et al.; 5,505,818 to Hermans et al. and 4,637,859 to Trokhan. With respect to the use of fabrics used to impart texture to a mostly dry sheet, see U.S. Pat. No. 6,585,855 to Drew et al., as well as United States Publication No. US 2003/0000664.
U.S. Pat. No. 5,503,715 to Trokhan et al. discloses a cellulosic fibrous structure having multiple regions distinguished from one another by basis weight. The structure is reported as having an essentially continuous high basis weight network, and discrete regions of low basis weight which circumscribe discrete regions of intermediate basis weight. The cellulosic fibers forming the low basis weight regions may be radially oriented relative to the centers of the regions. The paper may be formed by using a forming belt having zones with different flow resistances. The basis weight of a region of the paper is generally inversely proportional to the flow resistance of the zone of the forming belt, upon which such region was formed. The zones of different flow resistances provide for selectively draining a liquid carrier having suspended cellulosic fibers through the different zones of the forming belt. A similar structure is reported in U.S. Pat. No. 5,935,381 also to Trokhan et al. where the features are achieved by using different fiber types.
More generally, a method of making throughdried products is disclosed in U.S. Pat. No. 5,607,551 to Farrington, Jr. et al. wherein uncreped, throughdried products are described. According to the '551 patent, a stream of an aqueous suspension of papermaking fibers is deposited onto a forming fabric and partially dewatered to a consistency of about 10 percent. The wet web is then transferred to a transfer fabric traveling at a slower speed than the forming fabric in order to impart increased stretch into the web. The web is thereafter transferred to a throughdrying fabric where it is dried to a final consistency of about 95 percent or greater.
There is disclosed in U.S. Pat. No. 5,510,002 to Hermans et al. various throughdried, creped products. There is taught in connection with FIG. 2, for example, a throughdried/wet-pressed method of making creped tissue wherein an aqueous suspension of papermaking fibers is deposited onto a forming fabric, dewatered in a press nip between a pair of felts, then wet-strained onto a through-air drying fabric for subsequent through-air drying. The throughdried web is adhered to a Yankee dryer, further dried, and creped to yield the final product.
Throughdried, creped products are also disclosed in the following patents: U.S. Pat. No. 3,994,771 to Morgan, Jr. et al.; U.S. Pat. No. 4,102,737 to Morton; and U.S. Pat. No. 4,529,480 to Trokhan. The processes described in these patents comprise, very generally, forming a web on a foraminous support, thermally pre-drying the web, applying the web to a Yankee dryer with a nip defined, in part, by an impression fabric, and creping the product from the Yankee dryer. A relatively permeable web is typically required, making it difficult to employ recycle furnish at levels which may be desired. Transfer to the Yankee typically takes place at web consistencies of from about 60% to about 70%.
Conventional thoughdrying processes do not take full advantage of the drying potential of Yankee dryers because, in part, it is difficult to adhere a partially dried web of intermediate consistency to a surface rotating at high speed, particularly from an open mesh fabric where the fabric contacts typically less than 50% of the web during transfer to the cylinder. The dryer is thus constrained to operate at speeds below its potential and with heated air impingement jet velocities in the hood well below those employed in connection with conventional wet-press ("CWP") technologies.
As noted in the above, throughdried products tend to exhibit enhanced bulk and softness; however, thermal dewatering with hot air tends to be energy intensive and requires a relatively permeable substrate. Thus, wet-press operations wherein the webs are mechanically dewatered are preferable from an energy perspective and are more readily applied to furnishes containing recycle fiber which tends to form webs with less permeability than virgin fiber. A Yankee dryer can be more effectively employed because a web is transferred thereto at consistencies of 30 percent or so which enables the web to be firmly adhered for drying.
Wet press/wet or dry crepe processes have been employed widely as is seen throughout the papermaking literature as noted below. Many improvements relate to increasing the bulk and absorbency of compactively dewatered products which are typically dewatered in part with a papermaking felt.
U.S. Pat. No. 5,851,353 to Fiscus et al. teaches a method for can drying wet webs for tissue products wherein a partially dewatered wet web is restrained between a pair of molding fabrics. The restrained wet web is processed over a plurality of can dryers, for example, from a consistency of about 40 percent to a consistency of at least about 70 percent. The sheet molding fabrics protect the web from direct contact with the can dryers and impart an impression on the web.
U.S. Pat. No. 5,087,324 to Awofeso et al. discloses a delaminated stratified paper towel. The towel includes a dense first layer of chemical fiber blend and a second layer of a bulky anfractuous fiber blend unitary with the first layer. The first and second layers enhance the rate of absorption and water holding capacity of the paper towel. The method of forming a delaminated stratified web of paper towel material includes supplying a first furnish directly to a wire and supplying a second furnish of a bulky anfractuous fiber blend directly onto the first furnish disposed on the wire. Thereafter, a web of paper towel is creped and embossed.
U.S. Pat. No. 5,494,554 to Edwards et al. illustrates the formation of wet press tissue webs used for facial tissue, bath tissue, paper towels, or the like, produced by forming the wet tissue in layers in which the second formed layer has a consistency which is significantly less than the consistency of the first formed layer. The resulting improvement in web formation enables uniform debonding during dry creping which, in turn, provides a significant improvement in softness and a reduction in linting. Wet pressed tissues made with the process according to the '554 patent are internally debonded as measured by a high void volume index. See, also, U.S. Pat. No. 3,432,936 to Cole et al. The process disclosed in the '936 patent includes: forming a nascent web on a forming fabric; wet pressing the web; drying the web on a Yankee dryer; creping the web off of the Yankee dryer; and through-air drying the product; similar in many respects to the process described in U.S. Pat. No. 4,356,059 to Hostetler.
It has been found in accordance with the present invention that the absorbency, bulk and stretch of a wet-pressed web can be vastly improved by wet fabric creping a web, while preserving the high speed, thermal efficiency, and furnish tolerance to recycle fiber of wet-press technology by way of operating the process under conditions operative to rearrange an apparently randomly formed wet web.

Fabric crepe process for making absorbent sheet


A solar cell lead wire includes a molten solder plated layer on a strip-shaped conductive material formed rectangular in a cross section thereof so as to be bonded by soldering to an electrode of a solar cell, using a flux. A thickness of an oxide film on a surface of the molten solder plated layer, which is a sum of a thickness of an SnO layer and a thickness of an SnO2 layer on the surface of the molten solder plated layer, is not more than 7 nm.

In a solar cell, a polycrystalline or single crystal Si cell is used as a semiconductor substrate.
A configuration of a conventional solar cell will be described based on a solar cell 50 of the present invention shown in FIGS. 4A and 4B. The solar cell 50 is manufactured by bonding solar cell lead wires 10a and 10b to a predetermined region of a semiconductor substrate 52, i.e., to a front surface electrode 54 provided on a front surface of the semiconductor substrate 52 and to a back surface electrode 55 provided on a back surface thereof, using a solder. Electricity generated in the semiconductor substrate 52 is transmitted to the outside through the solar cell lead wire.
A configuration of a conventional solar cell lead wire will be described based on a solar cell lead wire 10 of the present invention shown in FIGS. 1A and 1B. A solar cell lead wire 10 is provided with a strip-shaped conductive material 12 and a molten solder plated layer 13 formed on upper and lower surfaces of the strip-shaped conductive material 12. The strip-shaped conductive material 12 is, e.g., a circular cross-section conductor roll-processed into a strip shape, which is called a flat conductor or a flat wire.
The molten solder plated layer 13 is formed by supplying a molten solder on the upper and lower surfaces of the strip-shaped conductive material 12 using a hot-dip coating method.
The hot-dip coating method is a method in which the upper and lower surfaces of the strip-shaped conductive material 12 are cleaned by acid pickling, etc., and a solder is laminated on the upper and lower surfaces 12a and 12b of the strip-shaped conductive material 12 by passing the strip-shaped conductive material 12 through a molten solder bath. As shown in FIG. 1A, the molten solder plated layer 13 is formed in a shape bulging from a side portion in a width direction to a center portion, so-called a mountain-like shape, by an effect of surface tension at the time of solidification of the molten solder adhered on the upper and lower surfaces 12a and 12b of the strip-shaped conductive material 12.
The solar cell lead wire 10 is cut to a predetermined length, is sucked up by air suction and moved onto a front surface electrode (grid) 54 of the semiconductor substrate 52, and is soldered to the front surface electrode 54 of the semiconductor substrate 52. An electrode band (finger) (not shown) electrically conducting with the front surface electrode 54 is preliminarily formed on the front surface electrode 54. The molten solder plated layer 13 of the solar cell lead wire 10a is brought in contact with the front surface electrode 54, and soldering is carried out in this state. The soldering of the solar cell lead wire 10b to the back surface electrode 55 of the semiconductor substrate 52 is carried out in the same way.
Conventionally, the front surface electrode 54 is impregnated with solder of the same nature as the molten solder plated layer 13 of the solar cell lead wire 10 in order to impart good solder bondability (or soldering strength) between the front surface electrode 54 of the semiconductor substrate 52 and the solar cell lead wire 10. However, the semiconductor substrate 52 has become thinner in recent years and a problem of damage to the semiconductor substrate 52 at the time of impregnating the front surface electrode 54 with the solder has emerged. Therefore, omission of solder impregnation process performed on the front surface electrode 54 has been promoted in order to avoid damage to the semiconductor substrate 52.
Due to the omission of solder impregnation process which is performed to impart good solder bondability between the front surface electrode 54 of the semiconductor substrate 52 and the solar cell lead wire 10, the case in which sufficient bondability is not obtain is often seen even in the case of using a solar cell lead wire which conventionally has no problem of bondability. The semiconductor substrate 52 is bonded to the solar cell lead wire 10 by a formation of an intermetallic compound (e.g., Ag3Sn) between an electrode material of the front surface electrode 54 (e.g., Ag) and a bonding material of the molten solder plated layer 13 (e.g., Sn). This bonding requires that a metal atom of the solder (Sn) directly collides with a metal atom of the electrode (Ag) after an oxide film is removed from a surface of the molten solder plated layer 13 and from a surface of the front surface electrode 54 due to flux effect, and that diffusion of an Sn atom present in the solder into a lattice of another atom (Ag) is enhanced by heating. That is, when the oxide film on the surface of the molten solder plated layer 13 is very thick, the removal of the oxide film by flux is not sufficient and a soldering defect occurs.
Since the bonding between the semiconductor substrate 52 and the solar cell lead wire 10 becomes insufficient when the soldering failure occurs between the front surface electrode 54 and the solar cell lead wire 10, a module output decreases due to mechanical removal or conductivity failure.
The patent document 1 suggests a method in which 0.002 to 0.015 mass % of P is added to solder in order to suppress generation of an oxide film on the solder surface during manufacture or in use.
In the solar cell lead wire of the patent document 1, the oxide film has a thickness of about 1 to 2 μm without discoloration up to a heating temperature of 300° C., and the oxide film has a thickness of about 5 μm with slight discoloration only after reaching 350° C. On the other hand, it is described that the oxide film already has a thickness of more than 6 μm with significant discoloration at 250° C. in the prior art. Further, the patent document 1 describes that both the invention and the prior art have an oxide film with a thickness of about 1 μm in the case without heating.

Lead wire for solar cell, manufacturing method and storage method thereof, and solar cell


A system for cleaning and etching a wafer. The system includes few buffer tanks to complete the cleaning and etching process. The system further includes a loader for loading the wafer, each buffer tank storing a unique chemical solution. At least one process tank is provided for retaining the loaded wafer, and is coupled to the buffer tank to receive the chemical solution from said buffer tank and to perform the cleaning and etching of the wafer.

1. Field of the Invention
The invention relates in general to a system for cleaning and etching wafers, and more particularly to a system for cleaning and etching, that does not need to clamp wafers frequently and saves space.
2. Description of the Related Art
Wet etching is the earliest etching technique that has been used. It removes thin film that is not covered by photoresist, using the chemical reaction between the thin film and a chemical solution. It has the benefits of simplicity and high throughput.
A conventional wet etching process is shown in FIG. 1. It uses a loader 1, a plurality of process tanks, quick drain clean tanks, a dryer 8, and an unloader 9. The quick drain clean tanks here are QDR (quick down rinse) tanks. First, wafers are loaded by the loader 1 and clamped by a robot, and then sequentially soaked in and taken out from the process tanks and quick drain clean tanks in order to perform chemical reactions with chemical solutions. For example, wafers are put into a hydrogen fluoric acid (FF) tank 2. After a predetermined period, these wafers are taken out from tank 2 and put into QDR tank 3 to be washed by deionized water (DI water) to remove residual chemical solution. Then wafers are taken out from tank 3 and put into another process tank 4 with a chemical solution such as a mixture of sulfuric acid and hydrogen peroxide (SPM) or mixture of hydrochloric acid and hydrogen peroxide (HPM). If the chemical solution contains fluorine, it must be stored in a tank made of materials that resist strong acid and corrosion, such as polytetrafluorethylene. If the chemical solution does not contain fluorine, it can be stored in a tank made of conventional materials, such as quartz. As shown in FIG. 1, after being processed through HF tank 2, QDR tank 3, SPM tank 4, QDR tank 5, HPM tank 6 and QDR tank 7, the wafers are dried by a dryer 8, and then moved out to the next process stage by an unloader 9.
There are some deficiencies in the conventional wet etch process. For example, it requires many tanks, which take up considerable space. Moreover, too many wafer movement steps result in chuck miss, e.g. dropping of wafers, and induces formation of particles on the wafers. These deficiencies lead to defects and increased cost.


A toner path opening and closing apparatus of an image forming device includes a first shutter elastically supported by a first elastic member to open and close a first toner path, and a second shutter elastically supported by a second elastic member having an elastic modulus smaller than the first elastic member to open and close a second toner path by the first shutter. After the second toner path is opened by the first shutter, the first is opened, so that the first and second toner paths communicate with each other. The first toner path is a toner supplying pipeline to which a toner is supplied from a toner cartridge, and the second toner path is a toner injecting port disposed in a developing unit. In mounting of the developing unit, after the toner injecting port disposed in the developing unit is first opened, the toner supplying pipeline is opened, and in dismounting of the developing unit, after the toner supplying pipeline is first closed, the toner injecting port is closed, so that in mounting and dismounting of the developing unit, toner is prevented from being leaked through the toner paths.

1. Field of the Invention
Aspects of the present invention relate to an image forming apparatus. More particularly, aspects of the present invention relate to a toner path opening and closing apparatus having an improved structure to regulate the inflow and outflow of toner that is supplied to a developing unit from a toner cartridge, an image forming apparatus having the same and a toner path opening and closing method thereof.
2. Description of the Related Art
In general, a small image forming apparatus, such as a printer, has a developing unit in which a photoconductive medium and a toner containing part are integrally formed. However, a large image forming apparatus, such as a copier or a large printer, is configured with a developing unit having a photoconductive medium, such as an OPC drum, disposed therein and a toner cartridge containing a toner formed apart from the developing unit. In these large image forming apparatuses, the developing unit is often designed to be detached from the image forming apparatus, and another one put in its place.
FIGS. 1 and 2 are schematic prior art views of parts of a large image forming device exemplifying a developing unit detachably disposed from a main body and a toner supplying pipeline provided on part of the main body. A toner supplying pipeline 2 to which a toner cartridge (not illustrated) is connected is disposed in the main body 1 of the image forming device. The toner supplying pipeline 2 is opened and closed by a first shutter 3. A first sponge 4 is interposed between the toner supplying pipeline 2 and the first shutter 3. The first shutter 3 is elastically supported by a first elastic member 5, so that if an external force is not applied, it can close down the toner supplying pipeline 2.
A toner injecting port 11 is disposed in a developing unit 10, and the developing unit 10 is connected to the toner supplying pipeline 2. The toner injecting port 11 is opened and closed by a second shutter 12. A second sponge 14 is interposed between the toner injecting port 11 and the second shutter 12. The second shutter 12 is elastically supported by a second elastic member 15, so that if an external force is not applied, it can close down the toner injecting port 11.
FIGS. 3A through 3F are schematic views exemplifying prior art designs by which the toner supplying pipeline 2 and the toner injecting port 11 are connected to each other as the developing unit is mounted in the main body 1. In FIGS. 3A and 3B, when the developing unit 10 is mounted in the main body 1, an end tip of the developing unit 10 pushes a first shutter protrusion 3a projecting from the first shutter 3 to push and open the first shutter 3 in the direction of arrow A illustrated in FIG. 3A, and another end of the developing unit mount provided in the main body 1 pushes a second shutter protrusion 12a projecting from the second shutter 12 to push and open the second shutter 12 in the direction of arrow B illustrated in FIG. 3A.
Then, as illustrated in FIGS. 3C and 3D, a portion of the first sponge 4 where the first shutter 3 is opened and a portion of the second sponge 14 where the second shutter 12 is opened are pushed together and engage with each other to form a toner path. When the toner supplying pipeline 2 and the toner injecting port 11 are simultaneously opened and therefore communicate with each other by way of the toner path, toner in the toner supplying pipeline 2 begins to flow through the toner injecting port 11.
When the toner supplying pipeline 2 and the toner injecting port 11 are opened as described above and the first and the second shutter 3 and 12 are in a fully open state, the toner supplying pipeline 2 and the toner injecting port 11 are completely connected with each other, as illustrated in FIGS. 3E and 3F. However, when the toner supplying pipeline 2 and the toner injecting port 11 simultaneously start opening as described above, there is a period of time where the toner supplying pipeline 2 and the toner injecting port 11 do not coincide with each other while the first and the second shutter 3 and 12 are opened. That is, when the toner supplying pipeline 2 and the toner injecting port 11 start opening, toner that is injected through the portion of the toner supplying pipeline 2 hatched in FIG. 4A is not supplied to the developing unit 10 through the open portion of the toner injecting port 11 hatched in FIG. 4B. As a result, the portion or section of the toner pipeline 2 that is shaded in FIG. 4C is contaminated.
If the developing unit is repeatedly mounted and dismounted, toner accumulates in this section of the toner pipeline 2, and the toner in the contaminated section is spreads in the toner injecting port as a result of opening and closing of the second shutter 12. As the amount of toner that accumulates in the contaminated section increases as described above, the accumulated toner scatters and contaminates the inside of the image forming device, thereby resulting in image contamination and malfunction of the image forming device.

Toner path opening and closing apparatus, image forming device having the same and toner path opening and closing method thereof


A pneumatic table that adjusts to various positions. Pneumatic cylinders controlled by a pneumatic system raise and lower the tabletop to a desired position. Brakes are used to lock the tabletop once it is in its desired position. The tabletop tilts forward and backward to vary the operating position of a piece of machinery located on the tabletop. A self-adjusting foot treadle adjusts when the tabletop height is changed such that the linkage between the treadle and the tabletop is maintained. The treadle also adjusts to various positions for the comfort of the operator.

The present invention relates to adjustable tables and, more specifically, to height adjustable tables used in factories where machinery is located on the tables.
There have been several attempts to provide an adjustable table that can be used in industry where a continuous repetitive movement by a worker is needed in operating a piece of machinery. This continuous repetitive movement can cause injury, and tables that adjust in height and tilt vary this repetitive movement to help reduce injury.
One known adjustable table provides a mechanical means of adjusting the height and the tilt of the tabletop. This type table generally has a hand operated crank to adjust the height and tilt. These manual adjustments can be difficult and time consuming if the piece of equipment or machinery located on the tabletop is heavy or otherwise difficult to reposition.
Another type of adjustable table is moved by hydraulic cylinders located underneath the tabletop that are activated by a hand crank hydraulic pump to raise and lower the tabletop. One disadvantage of the hydraulic adjustable table is that a hydraulic system including a hydraulic pump must be part of the table. Another disadvantage is that hydraulic cylinders and lines often leak and cause an unclean and hazardous environment when the hydraulic fluid accumulates on the floor where the operator of the machinery is standing. This hydraulic table is particularly undesirable in industries where a clean environment is a necessity, such as in the textiles industry.
Therefore, an adjustable table is desired that is easily adjusted in height and tilt to help prevent injury to a worker due to repetitive movements. Also, an inherently clean adjustable table is desired for operation in a production facility where the environment necessitates cleanliness.


The invention is an absorbent article such as a sanitary napkin, comprising a main body portion which is divided into a first half and a second half by a principle transverse centerline, and an oriented hook fastening material joined to the first half and second half of the main body portion. The oriented hook fastening material is oriented in a direction having a vector component perpendicular to the principle transverse centerline of the main body portion. In an alternate embodiment of the present invention, the disposable absorbent article will have side flaps joined to the main body portion and an oriented hook fastening material joined to the side flaps. In another alternate embodiment of the present invention, the disposable absorbent article will have a combination of a pressure sensitive adhesive and an oriented hook fastening material joined to the main body portion.

All manner and variety of absorbent articles configured for the absorption of body fluids such as menses, urine, and feces are, of course, well known. Absorbent articles, particularly sanitary napkins, pantiliners, incontinent pads, and the like are disclosed in the literature and are available in the marketplace.
Generally, absorbent articles will comprise a central absorbent means or central pad which is provided with a means for securing the central pad to the crotch of a wearer's undergarment. Currently available absorbent articles, particularly sanitary napkins and pantiliners, are positioned in an undergarment, such as woman's panties, and secured thereto by pressure-sensitive adhesive. While the use of adhesive is common, there are a number of drawbacks such as comfort, adhesive contamination, residual build-up on panties, the inconvenience of and noise produced by the protective sheets, and the like.
Absorbent articles having wings or flaps are also disclosed in the literature and are available in the marketplace. Generally, the flaps of such absorbent articles extend laterally from a central absorbent means and are intended to be folded around the edges of the wearer's panties in the crotch region. Thus, the flaps are disposed between the edges of the wearer's panties in the crotch region and the wearer's thighs. Commonly, the flaps are provided with an adhesive attachment means, or flap adhesive, for affixing the flaps to the underside of the wearer's panties.
The flaps serve at least two purposes. First, the flaps prevent exudates which otherwise would soil the edges of the wearer's panties from doing such. Second, the flaps help stabilize the napkin from shifting out of place, especially when the flaps are affixed to the underside of the panties.
Sanitary napkins having flaps of various types are disclosed in U.S. Pat. No. 4,687,478, entitled "Shaped Sanitary Napkin With Flaps", which issued to Van Tilburg on Aug. 18, 1987, U.S. Pat. No. 4,608,047, entitled "Sanitary Napkin Attachment Means", which issued to Mattingly on Aug. 26, 1986, U.S. Pat. No. 4,589,876, entitled "Sanitary Napkin", which issued to Van Tilburg on May 20, 1986, U.S. Pat. No. 4,285,343, entitled "Sanitary Napkin", which issued to McNair on Aug. 25, 1981, U.S. Pat. No. 3,397,697, entitled "Disposable Sanitary Shield For Undergarments", which issued to Rickard on Aug. 20, 1968, and U.S. Pat. No. 2,787,271, entitled "Sanitary Napkin", which issued to Clark on Apr. 2, 1957, all of which patents are incorporated herein by reference.
A common problem with disposable absorbent articles such as sanitary napkins, is that the central absorbent means will frequently shift from its original position during wear due to stresses caused by body motion and/or the pressure of the thighs and buttocks. Shifting can also occur when the wearer's pants (or other outer garment) are being pulled up. This is particularly true if the wearer's pants are tight-fitting. If the fastener which holds the central absorbent means to the crotch of the wearer's panties is an adhesive fastener, then this shifting of the absorbent article can result in the central pad adhesive sticking to itself causing "bunching" of the central absorbent means within the panty. Shifting of the central absorbent means may also occur if the adhesive of the adhesive fastener is aged or if there is insufficient adhesive.
In addition to the shifting and bunching of the central absorbent means, a common problem with disposable absorbent articles having flaps or wings, is that the fasteners which hold the flaps to the wearer's panties will frequently "pop" loose from the panty when the panty is being pulled up or when the wearer's pants (or other outer garment) are being pulled up. Again, this is particularly true if the wearer's panty, pants, or other outer garment are tight-fitting. If the fastener which hold the flaps to the wearer's panties is an adhesive fastener, then this popping loose of the fastener can result in the flap adhesive sticking to itself, to the body of the wearer, or to an extraneous surface.
Mechanical fasteners are an alternative to pressure sensitive adhesives. Absorbent articles having mechanical fastener means are disclosed in the art. Although the use of mechanical fasteners avoids some of the drawbacks of the adhesive fasteners such as adhesive contamination, residual build-up on panties, and the inconvenience of and noise produced by the protective sheets, disposable absorbent articles using mechanical fasteners are still subject to the shifting of the central absorbent means and the popping loose of the flap adhesives upon application of the wearer's pants. Disposable absorbent articles using mechanical fasteners generally do not suffer from "bunching" as do disposable absorbent articles using adhesive fasteners. However, disposable absorbent articles using mechanical fasteners will still suffer from misalignment in the crotch of the wearer's panties as a result of shifting of the central absorbent means and will still suffer from the flaps popping loose.
Therefore, there is a need for an absorbent article comprising a mechanical fastener which can hold the flaps securely to the crotch of a wearer's undergarment without popping loose upon application of the wearer's pants or other outer garment. There is also a need for an absorbent article comprising a mechanical fastener which can hold the absorbent article securely in place without unwanted shifting of the central absorbent means upon application of the wearer's pants or other outer garment. There is also a need for an absorbent article comprising a mechanical fastener which can hold the absorbent article securely in place without unwanted shifting of the absorbent article during use.
It is therefore an object of the present invention to provide a disposable absorbent article comprising a mechanical fastener which can maintain the absorbent article securely in the panty of the user without popping loose upon pulling up the wearer's panty, pants, or other outer garment.
It is also an object of the present invention to provide a disposable absorbent article comprising a mechanical fastener which can maintain the absorbent article securely in the panty of the user without unwanted shifting of the absorbent article.
It is also an object of the present invention to provide an absorbent article comprising a mechanical fastener having engaging elements which are arranged such that any shifting of the absorbent article will tend to improve the positioning of the absorbent article in the undergarment.
It is an additional object of the present invention to provide a disposable absorbent article comprising a mechanical fastener which tends to maintain the absorbent article in intimate contact with the body of the wearer.
It is an additional object of the present invention to provide a disposable absorbent article comprising a mechanical fastener which does not need a dedicated receiving surface but which can be secured to the panty material or the materials of the disposable absorbent article itself.

Disposable absorbent article having an improved mechanical fastening system