In one embodiment, an image sensor includes an area pixel array, column readout lines, and array readout lines, wherein the area pixel array includes columns of pixels, each including pixels of a first type, each column readout line is selectively coupled to outputs of the pixels of the first type that are included in a respective column of pixels, and each array readout line is selectively coupled to at least one of the first column readout lines. In another embodiment, an image sensor includes a pixel array, column readout lines, and array readout lines, wherein the pixel array includes a row of pixels which includes pixels of a first type, each column readout line is selectively coupled to an output of a respective pixel of the first type that is included in the row of pixels, and each array readout line is selectively coupled to at least one of the column readout lines.

1. Field of the Invention
The present invention is directed to image sensors and, more particularly, to systems for reading out the contents of pixels in image sensors.
2. Discussion of Related Art
Image sensors are used to generate images based upon the outputs of a large number of light-sensitive pixels. Pixels commonly are arranged in an area array of "n-by-m" pixels (an area sensor). Each pixel in such an array generates an output signal that is proportional to an amount of light that is incident on that pixel during a so-called "integration period." All of the pixels in the array generally are permitted to "integrate" for a predetermined amount of time during an integration period and the contents of the pixels in the array are individually "read out" during a so-called "read out period." In this manner, an image may be generated based upon the contents of the pixels in the array.
FIG. 1 shows an area array of pixels and a prior art system for reading out the contents of each pixel in the array. As shown, the array includes "n+1" rows and "m+1" columns of pixels. Only the pixels in the comers of the array are illustrated in FIG. 1. The first row of pixels (i.e., row "0") includes pixels P0,0 through P0,m, and the final row of pixels (i.e., row "n") includes pixels Pn,0 through Pn,m. Similarly, the first column of pixels (i.e., column "0") includes pixels P0,0 through Pn,0, and the final column of pixels (i.e., column "m") includes pixels P0,m through Pn,m.
Each column of pixels in FIG. 1 is associated with a column readout line (CRL), a correlated double-sampling (CDS) circuit, and a row-select switch (RSS). In the example shown, pixel column "0" is associated with column readout line CRL0, correlated double-sampling circuit CDS0 and column-select switch CSS0, and pixel column "m" is associated with column readout line CRLm, correlated double-sampling circuit CDSm and column-select switch CSSm. Each column-select switch is connected to a common array readout line ARL.
Each row of pixels in the FIG. 1 circuit has a group of row-select switches (RSSs) associated with it. Each group of row-select switches selectively connects the outputs of the pixels in a particular row to respective column readout lines. In the example shown, pixel row "0" includes row-select switches RSS0,0 through RSS0,m, which selectively connect the outputs of pixels P0,0 through P0,m, respectively, to column readout lines CRL[0 . . . m]. Similarly, pixel row "n" includes row-select switches RSSn,0 through RSSn,m, which selectively connect the outputs of pixels Pn,0 through Pn,m, respectively, to column readout lines CRL[0 . . . m].
Typically, all pixels in the array, i.e., pixels P0,0 through Pn,m, are simultaneously caused to integrated charge using signals on control lines (not shown). After an integration period, each of pixels P0,0 through Pn,m stores a charge that is proportional to the intensity of the light that was incident on it during the integration period. Commonly, circuitry in each of the pixels converts this charge into a voltage and this voltage is provided at the output of the pixel. Rows of pixels are selected one-at-a-time by sequentially closing one group of row-select switches at a time. For example, pixel row "0" may be selected by closing row-select switches RSS0,0 through RSS0,m to provide the contents of pixels P0,0 through P0,m, respectively, to column readout lines CRL[0 . . . m].
After a particular row of pixels has been selected, control signals cause each of correlated double-sampling circuits CDS[0 . . . m] to sample the voltages presented on column readout lines CRL[0 . . . m], respectively, by the pixels in the selected row. Correlated double-sampling circuits CDS[0 . . . m] operate simultaneously for each row. After the output voltages of a particular row of pixels has been sampled by correlated double-sampling circuits CDS[0 . . . m], each of the pixels in the selected row is reset to its non-integrated state. Correlated double-sampling circuits CDS[0 . . . m] then sample the voltages from the outputs of the selected row of pixels a second time. The configuration of correlated double-sampling circuits CDS[0 . . . m] during this second sampling period cause voltages equal to the differences between the first voltages sampled and the second voltages sampled to be provided at their outputs.
After both samples have been taken by correlated double-sampling circuits CDS[0 . . . m] column-select switches CSS[0 . . . m] are closed one at a time to permit external circuitry (not shown) to measure the amplitude of the voltage on array readout line ARL when each column-select switch is closed, to amplify this voltage, and to convert the voltage into a digital output signal.
Thus, row-select switches RSS0,0 through RSSn,m and correlated double-sampling circuits CDS[0 . . . m] sample the output voltages of one row of pixels at a time, and column-select switches CSS[0 . . . m] select the outputs of correlated sampling circuits CDS[0 . . . m] one at a time, thereby providing the output voltage of each of pixels P0,0 through Pn,m to array readout line ARL one at a time.
When each of column-select switches CSS[0 . . . m] is closed to provide the output of the corresponding correlated double-sampling circuit to array readout line ARL, a certain period of time is required to allow the signal on array readout line ARL to settle before using external circuitry to measure the voltage on the line. This settling time is determined primarily by the capacitance of array readout line ARL.
Column-select switches CSS[0 . . . m] generally are implemented using metal oxide semiconductor (MOS) transistors. Each of these MOS transistors has a gate-to-source or gate-to-drain capacitance associated with it that, when connected to array readout line ARL, incrementally increases the readout line's overall capacitance. An area array having a large number of columns requires a large number of column-select switches to selectively provide the outputs of the correlated double-sampling circuits to the readout line for the array. The capacitance added by each of these column-select switches to the total capacitance of array readout line ARL limits the rate at which the outputs of the correlated double-sampling circuits can be selected and therefore limits the rate at which the contents of the pixels in the array may be read out.
Similarly, because each of column-select switches CSS[0 . . . m] is connected to array readout line ARL via a circuit trace having a particular length, each such circuit trace incrementally increases the overall capacitance of array readout line ARL. The capacitance added by each of these circuit traces to the total capacitance of array readout line ARL also limits the rate at which the outputs of the correlated double-sampling circuit can be selected and therefore further limits the rate at which the contents of the pixels in the array may be read out.
What is needed, therefore, is an improved pixel readout scheme for image sensors.

This patent is subject to a terminal disclaimer.

Image sensor using multiple array readout lines


A collapsible two tier support as for use in camping dishwashing is formed by four uprights connected by pivoted cross brace sets and having a fabric panel defining on upper support connected to the tops. Additional cross brace sets support a second fabric panel at a lower level adjacent the uprights. The entire assemblage is collapsible by pivoting action of the cross brace members.

This invention concerns collapsible portable supports as used in camping for chairs, tables, etc. The collapsible design allows these items to be brought along on camping trips since the amount of space required in a vehicle is greatly reduced.
Camping usually involves cooking and washing of utensils, dishes, etc. Heretofore, washing the dishes has been quite inconvenient when, with the water stored in an often collapsible heavy jug and rinsing and washing in separate dishpan being quite awkward. Dispensing water from a large jug is also itself inconvenient.
It is an object of the present invention to provide a collapsible two tier support for convenient washing of dishes in a pan on a lower support and dispensing of water from a water jug on an adjacent upper support.


A power transformation device of a powered device in a power over Ethernet system includes a first transformer coupled between a first pin and a second pin of an Ethernet terminal, a second transformer coupled between a third pin and a sixth pin of the Ethernet terminal, and a bridge rectifier coupled between a center tap of the first transformer and a center tap of the second transformer, for rectifying power outputted from the center taps of the first transformer and the second transformer, so as to provide power for the powered device.

1. Field of the Invention
The present invention provides a power transformation device of a powered device in a power over Ethernet system, and more particularly, a power transformation device applicable to 10 Mbs, 100 Mbs, and 1000 Mbs powered devices in a power over Ethernet system
2. Description of the Prior Art
Power over Ethernet (POE) means a technique for providing DC power for terminal equipments (ex. IP phone, wireless network access point, web-camera, etc.) during data transmission in a present Ethernet. A POE system is also named as a power over LAN (POL) system or an active Ethernet system, and is compatible with the present Ethernet system. The IEEE 802.3af standard is a new protocol of the POE system, and is extended from the IEEE 802.3 standard.
According to the IEEE 802.3af standard, a POE system comprises a power sourcing equipment (PSE) and a powered device (PD). The PSE, the management equipment of the POE system, provides power for the PD. The PD, which is a web-phone, web-camera, network access point, PDA, or other Ethernet devices, obtains power from an RJ-45 socket.
Powering the PD over the PSE system can be classified into two ways. One is powering the PD through the fourth and fifth pins and through the seven and eighth pins of an RJ-45 terminal as shown in FIG. 1, and the other is through the first and second pins and through the third and sixth pins of an RJ-45 terminal as shown in FIG. 2. Note that, Arabic numerals (1, 2 . . . 8) shown in FIG. 1 and FIG. 2 represent pin numbers of a catalog-5 (Cat. 5) cable. When the PSE powers the PD through the fourth and fifth pins and through the seventh and eighth pins, the fourth and fifth pins are coupled to a positive electrode, and the seventh and eighth pins are coupled to a negative electrode. When the PSE powers the PD through the first and second pins and through the third and sixth pins, the first and second pins and the third and sixth pins are coupled to electrodes with opposite poles.
In addition, structures of the POE system can be also classified into two types. One is an end-span structure, and the other is a mid-span structure. Under the end-span structure, the PSE provides power for the PD by the way of FIG. 1 or FIG. 2. Under the mid-span structure as shown in FIG. 3, the PSE provides power for the PD through a midspan PSE by the way of FIG. 1.
According to the IEEE 802.3af standard, the PSE can provide power by either the way of FIG. 1 or the way of FIG. 2, while the PD must be applicable to both ways. Such requirement is easily achieved for designs of 10 Mbs and 100 Mbs PDs, because both of the 10 Mbs and the 100 Mbs PDs apply two twisted pairs of a Cat. 5 cable (the first and second pins and the third and sixth pins) for exchanging data, while the other two twisted pairs (the fourth and fifth pins and the seventh and eighth pin) are unused. Therefore, the 10 Mbs and the 100 Mbs PDs applicable to FIG. 1 or FIG. 2 can be easily achieved. However, a 1000 Mbs Ethernet equipment, unlike the 10 Mbs and the 100 Mbs PDs, applies all twist-pairs of a Cat. 5 cable for exchanging data, so that the prior art POE system shown in FIG. 1 to FIG. 3 is not suitable for 10 Mbs, 100 Mbs, and 1000 Mbs PDs.

Power transformation device of a powered device in a power over ethernet system


A wafer polishing method is provided. First, a wafer, having a first surface, a second surface, and a plurality of opening portions depressed on the first surface, is provided. A plastic adhesive is filled in the opening portions and cured later. A polishing step is performed to thin the thickness of the wafer. Therefore, the yield of the wafer in the polishing process can be improved by the protection of the plastic adhesive.

1. Field of the Invention
The present invention generally relates to a wafer polishing method, in particular, to a wafer polishing method capable of preventing wafer cracks.
2. Description of Related Art
Microelectromechanical system (MEMS) is a microelectromechanical component fabricated in a microminiaturized package structure, and the fabricating technique thereof is quite similar to the technique of fabricating integrated circuits (ICs). However, interactions, for example, about mechanics, optics, or magnetic force between the MEMS device and surrounding environment are more than that of the conventional IC.
The MEMS device may include micro-sized electromechanical components (for example, switches, mirrors, capacitors, accelerometers, sensors, capacitive sensors, or actuators etc.), and the MEMS device may be integrated with the IC in a manner of single block, thereby greatly modifying insertion loss or electrical isolation effect of the overall solid-state device. However, in the macroscopic world of the entire package structure, the MEMS device is extremely weak and may be impacted by slight static electricity or surface tension at any moment to cause failure. Therefore, in order to prevent the MEMS device from contaminations or damages, usually the MEMS device is sealed in a cavity of the wafer.
FIG. 1 is a schematic view of cracks generated in a conventional wafer polishing process. Referring to FIG. 1A, the wafer 100 has a plurality of lattice opening portions 102 (or cavities). However, in the polishing process, since the strength at regions A and B becomes weak, the regions A and B (for example, the edges) of the wafer are usually cracked, and silicon residue 104 easily clogs the opening portions 102. Therefore, the present invention is mainly directed to overcome serious defects such as cracks and residues occurred in the polishing process.

Advanced Semiconductor Engineering, Inc.


A reactor system that can safely use general purpose electrical devices and unregulated surface temperature heat sources even though a flammable and/or combustible substance is being processed in the reactor or is within the processing area. The reactor system includes a reaction vessel and at least one process control device proximate the reaction vessel which is a possible ignition source for flammable and combustible materials. A shroud encloses the ignition source within a chamber and the chamber is provided with an inactive environment which is effective for preventing the ignition source from igniting any flammable or combustible substance that may enter the chamber.

As the demand for high performance materials and closely controlled processing parameters increases, there is a growing need for reactor systems that permits the use of ignition sources, such as general purpose electrical devices and high temperature heat sources, near flammable or combustible substances. However, general purpose electrical devices usually have exposed electrical contacts that can contain enough energy to ignite flammable and combustible vapors, while high temperature heat sources can produce surface temperatures that approach and exceed the autoignition temperature of flammable and combustible substances.
Flammable and combustible substances that can be ignited by exposed electrical contact sources are well defined in safety literature. Such substances typically have a low flash point, which is defined by the National Fire Protection Association (NFPA) as the temperature at which a liquid or a volatile solid gives off sufficient vapor to form an ignitable mixture with air near the surface of the liquid or within a test vessel. Flammable or combustible substances also generally have concentration ranges above and below which ignition will not occur. Flammable materials and combustible materials are differentiated by the ease with which they burn.
Flammable materials are those solids, liquids, vapors and gases that ignite easily and burn rapidly. Flammable solids can generally be classified as: (1) dusts or fine powders, (e.g., various metals and organic substances such as cellulose and flour); (2) films, fibers and fabrics constructed of materials having a low ignition point; (3) low temperature autoignition solids such as white phosphorus; and (4) biodegradable solids in which internal heat can be generated by microbial or other degradation activity, (e.g., fish meal and wet cellulosics). Flammable liquids are defined by NFPA and the United States Department of Transportation as liquids having (i) a flash point below 37.7.degree. C. (100.degree. F.), as measured in a closed cup apparatus, and (ii) a vapor pressure of less than 377 kN/m.sup.2 (40 psig). Flammable gases are gases which ignite very easily and sustain a flame and heat propagation rate which is so great as to resemble an explosion, especially when the gas is confined. Flammable gases are extremely dangerous fire hazards and require precisely regulated storage conditions.
A combustible material is generally defined as a solid that is comparatively difficult to ignite and burns relatively slowly, or a liquid having a flash point above 37.7.degree. C. (100.degree. F.). The rate and ease with which solids combust often depends as much on their state of subdivision (e.g., fibrous whiskers versus solid block) as on their chemical composition. For example, many metals will ignite and burn rapidly when in powder or flake form, while most will not burn when formed as a bulk solids. Cellulose is combustible when formed as a textile fabric or paper, but is flammable when provided as a fine fiber such as cotton linters. A plastic that burns at flame temperature is a greater fire hazard when formed as a foam rather than a bulk solid.
NFPA has developed safety standards to permit the safe processing of materials around flammable or combustible substances. These standards are based upon defined classified areas which include (i) Class 1, Group A to D classified areas which involve the presence of flammable vapors, (ii) Class 2, Group E to G classified areas which involve the presence of combustible dust, and (iii) Class 3 classified areas which involve the presence of ignitable figers and flyings. NFPA restricts the use of ignition sources in all of these classified areas. For example, exposed electrical contact sources and unregulated surface temperature heat sources are prohibit in Class 1, Group D areas. Hence, flammable and combustible vapors and gases, as well as materials that emit such vapors and gases, may be stored or processed in areas which include only those types of equipment which have been specially designed for use in such environments.
Equipment suitable for use around flammable and combustible airborne materials is designed to prevent the equipment from serving as an ignition source. Generally, equipment suitable for such uses falls into at least one of five categories: (1) pneumatic or hydraulic equipment, (2) intrinsically safe electrical equipment, (3) explosion proof equipment, (4) remotely located equipment and (5) equipment with regulated surface temperature interlocks. Pneumatic and hydraulic devices use air or fluid to operate and therefore do not serve as ignition sources. Intrinsically safe electrical devices are designed to utilize insufficient electrical current to ignite a flammable or combustible airborne material. Explosion proof devices are retained within shells designed to contain any resultant explosion in order to prevent damage to surrounding objects and people. Remote devices are located outside the area containing the flammable or combustible airborne materials and are attached to a reaction vessel located in the classified area by tubes or insulated wires and connectors. Regulated surface temperature devices are devices whose surface temperature is controlled so that it cannot exceed 80 percent of the lowest autoignition temperature of those flammable and combustible substance which may be present in the area. All five types of these specially designed equipment are typically (i) larger, (ii) more expensive, (iii) less responsive, and/or (iv) produce lower conversion rates, than general purpose electrical devices and unregulated surface temperature heat sources.
Hence, there remains a growing need for a reactor system that permits the use of general purpose electrical devices and/or unregulated surface temperature heat sources on or near reaction vessels that contain or are, of necessity, located in an area containing flammable or combustible substances.

Minnesota Mining and Manufacturing Company


Air ducts for airflow management of the engine compartment, and associated methods are disclosed herein. In one embodiment, an air duct for venting an engine compartment of a tractor includes an inlet that faces the engine compartment, an outlet at an outer surface of a tractor fender, a body of the duct configured generally inside the fender, and one or more shutters that restrict flow of air at the inlet. In some embodiments, the outlet faces a low pressure zone that is downstream of the fender, and a pressure in the low pressure zone depends on a speed of the tractor.

Fuel efficiency is a significant element of the overall economics of a road transportation vehicle, e.g., semi-truck ("tractor") with a trailer. Fuel efficiency of the road vehicles is mostly determined by engine efficiency, rolling resistance of the wheels, stop-and-go traffic (i.e., acceleration and deceleration), drag coefficient, and trailer loading. At relatively high and steady velocity, typically referred to as "highway driving," the air flow drag often dominates energy losses of the vehicle. Conversely, at lower speeds or at idle, high temperature in the engine compartment may reduce engine efficiency, and may also increase harmful emissions.
Some conventional technologies attempt to improve the cooling of the engine compartment by installing ducts on the sides of the engine hood for better venting of the engine compartment. FIG. 1A is an example of the conventional technology for the engine compartment venting. The illustrated engine compartment panel 15 has several ducts 1 with side vents 6 that allow hot air to escape from the engine compartment.
FIG. 1B shows a detail of the side vent 6 from FIG. 1A. In operation, when pressure inside the engine compartment exceeds certain predetermined value, a flap 8 bends to allow hot air from the interior of the engine compartment to escape through the side vent 6. In general, higher pressure within the engine compartment bends the flap 8 more, allowing for faster venting of the hot air. When the pressure inside the engine compartment falls below certain design value, the flap 8 bends back to its original position to close the vent 6.
However, the operation of the conventional ducts generally does not relate to the speed of the vehicle or the temperature under the hood, therefore resulting in under-venting or over-venting in comparison to the needed amount of venting and cooling of the engine compartment. Furthermore, with the conventional technology illustrated in FIGS. 1A and 1B, the venting ducts protrude into the engine compartment—generally an already crowded space that is mostly occupied by the engine and the auxiliary systems.
Accordingly, there remains a need for cost- and space-effective venting of the engine compartment that also improves the aerodynamics of the vehicle.

Air ducts for airflow management, and associated systems and methods


Congestion in connection-oriented data networks is alleviated by simulating the rerouting of circuits to uncongested parts of the network and then rerouting such circuits in a manner that causes little, or no, disruption to other parts of the network.

From telecommunications to financial services, network planners and managers must make the best use of their existing network assets and strategically plan for the future.
As a network changes, the traffic carried on the network may exceed its capacity. As a result, the network may develop hot spots and congestion points (sometimes collectively referred to as "congestion") causing service to the network's customers to degrade. Furthermore, such a mismatch in traffic load versus capacity may limit the number of new customers that a network can attract and add.
Accordingly, it is desirable to provide methods and systems for detecting such mismatches in order to alleviate congestion. It is also desirable to provide methods and systems that modify traffic flows to reduce the negative effects of such mismatches while causing little or no disruption to the operation of a network or the services it offers.

Methods and systems for alleviating congestion in a connection-oriented data network


A process and apparatus for the fine dispersion of liquid or powder in a gaseous medium, preferably in air. The liquid or powder is placed into an ejection tube (2) and pressurized gaseous propellant (4) is conducted at explosion-like speed behind the charge (1). The apparatus has an ejection tube (2) containing the liquid or powder charge (1), a propellant container (3) connected with one end of the ejection tube (2). The ejection tube (2) and propellant container (3) are interconnected by at least one transfer port (8) closed by a quick-action locking element.

It is well known that the fine dispersion of liquids or powders in the air, or in other medium or surface is often necessary. The fields of application can be divided into two main groups.
One of them includes the applications where the quantity of the product discharged on each occasion is not considerable (therapeutic, cosmetic, household applications etc). The aerosol products were developed just for this purpose. These products are filled into pressurized containers and by actuating a valve mechanism, they pass to the air through an atomizer system. The finely dispersed liquid drops (aerosol drops) are produced by the atomizing nozzle.
Though the size could be increased, containers liter volume are usually not produced.
In the other group of applications a considerable amount of product is to be used on each occasion, as acceptable result will be attained only this way. Such fields of application are for example the disinfection of buildings, fire fighting, etc. Sprayers or atomizers of continuous operation are used for this purpose.
One cf these solutions is described in the HU-PS 185 548. This device is an improvement of the apparatus described in the DE-PS 28 40 723, U.S. Pat. No. 1,399,490, U.S. Pat. No. 4,116,387 and U.S. Pat. No. 4,251,033 for the purpose of administering active ingredients for therapeutic or immunogenic treatment of animals kept in stable. The apparatus consists of a high capacity rotary atomizer and conical drop separators opening by way of shutter. These drop separators prevent the passage of drops greater than 5 micron into the air space.
The apparatus according to the U.S. Pat. No. 4,687,135 was developed for discharge into the air space with high energy. The propellant in the apparatus is brought about by the explosion-like burning of gas, and pulverized metal, metal-ceramic, wear- and heat-resistant electrically insulating or electrically conducting material are admitted into the nozzle. The pulverized substance flowing out of the nozzle heated to the vicinity of its melting point, precipitates with high energy on the treated surface, forming a layer on it. The apparatus functions periodically.
These apparatuses are capable to discharge theoretically unlimited amount of product, but in fact they slow, because increasing the quantity discharged in time unit is restricted by the atomizing system. The slowness is unfavourable especially in apparatuses used for fire fighting, e.g. in fire extinguishers.
There are instances, among which the underground fire is the most characteristic, when very large amount of product has to be dispersed nearly all at once into a very large space. With the currently known spraying systems this is impossible, or it can be realized only with apparatuses of unacceptable size.

Process and apparatus for the fine dispersion of liquids or powders in a gaseous medium


A multimode input circuit comprises a input terminal, first outputting circuit including a buffer circuit, for receiving a first signal having a first amplitude variation via the input terminal and outputting the first signal of a preset potential; second outputting circuit for receiving a second signal having a second amplitude variation different from the first amplitude variation via the input terminal and outputting a third signal of a preset potential, the second outputting circuit including a power source supplying terminal for supplying the same potential as the maximum potential of the second signal, a first FET having a source connected to said power source supplying terminal, a gate supplied with a selection signal for specifying one of the input signals to be selected by the multimode input circuit and a drain, and a second FET formed to make a complementary structure together with the first FET and having a drain connected to the drain of the first FET, a gate connected to the input terminal and a source connected to a circuit ground, and selecting circuit for receiving the first and third signals from the first and second outputting circuit and a selection signal from the exterior and selecting and outputting one of the first and third signals according to the state of the selection signal.

1. Field of the Invention
This invention relates to a multimode input circuit formed in a liquid crystal display (LCD) driving integrated circuit, for example, and more particularly to a multimode input circuit for receiving two signals having amplitude variations different from each other, converting the received signal into a preset potential and supplying the converted potential to an internal circuit of the integrated circuit.
2. Description of the Related Art
An LCD data driving integrated circuit (IC) for serially receiving LCD display data inputs, converting them into the parallel form, converting them into LCD driving voltages and then outputting the driving voltages may be sometimes divided into plural sections which are arranged in the horizontal direction of the LCD panel. With the above arrangement, in a case where a plurality of data driving ICs are cascade-connected to serially transfer LCD display data inputs, the signal level of the display data input to the first-stage data driving IC and the signal level of the display data input to one of the succeeding stage data driving ICs are different from each other, and respectively set to 12 V and 5 V, for example. That is, as the input signal to the data driving ICs, a first input signal (for example, 12 V system) having an amplitude varying in a range between a first reference potential and a first power source potential and a second input signal (for example, 5 V system) having an amplitude varying in a range between a second reference potential and a second power source potential may be used.
Therefore, at the time of design, it is necessary to form circuit patterns for the input circuits having different circuit constructions for the signals having two different amplitude variations.

Multimode input circuit receiving two signals having amplitude variations different from each other


A method of producing an aromatic polycarbonate resin includes the step of carrying out solution polymerization of a diphenol compound having a triarylamine structure with a diol compound of formula (I):

1. Field of the Invention
The present invention relates to an electrophotographic photoconductor comprising an electroconductive support and a photoconductive layer formed thereon, comprising an aromatic polycarbonate resin having charge transporting properties. In addition, the present invention also relates to a method of producing the above-mentioned aromatic polycarbonate resin with charge transporting properties.
2. Discussion of Background
Recently organic photoconductors are used in many copying machines and printers. These organic photoconductors have a layered structure comprising a charge generation layer (CGL) and a charge transport layer (CTL) which are successively overlaid on an electroconductive support. The charge transport layer (CTL) comprises a binder resin and a low-molecular-weight charge transport material (CTM) dissolved therein. The addition of such a low-molecular-weight gorge transport material (CTM) to the binder resin lowers the intrinsic mechanical strength of the binder resin, so that the CTL film becomes fragile. Such lowering of the mechanical strength of the CTL causes the wearing of the photoconductor or forms scratches and cracks in the surface of the photoconductor.
Although some vinyl polymers such as polyvinyl anthracene, polyvinyl pyrene and poly-N-vinylcarbazole have been studied as high-molecular-weight photoconductive materials for forming a charge transport complex for use in the conventional organic photoconductor, such polymers are not satisfactory from the viewpoint of photosensitivity.
In addition, high-molecular-weight materials having charge transporting properties have been also studied to eliminate the shortcomings of the above-mentioned layered photoconductor. For instance, there are proposed an acrylic resin raving a triphenylamine structure as reported by M. Stokla et al., in xe2x80x9cJ. Polym. Sci., vol 21, 969 (1983)xe2x80x9d; a vinyl polymer having a hydrazone structure as described in xe2x80x9cJapan Hard Copy ""89 p. 67xe2x80x9d; and polycarbonate resins having a triarylamine structure as disclosed in U.S. Pat. Nos. 9,801,517, 4,806,443, 4,806,444, 4,937,165, 4,959,298, 5,030,532, 5,034,296, and 5,080,909, and Japanese Laid-Open Patent Applications Nos. 64-9964, 3-221522, 2-304456, 4-11627, 9-175337, 4-18371, 4-31404 and 4-133065. However, any materials have not yet been put to practical use.
According to the report of xe2x80x9cPhysical Review B46 6705 (1992)xe2x80x9d by M. A. Abkowitz et al., it is confirmed that the drift mobility of a high-molecular weight charge transport material is lower than that of a low-molecular weight material by one figure. This report is based on the comparison between the photoconductor comprising a low-molecular weight tetraarylbenzidine derivative dispersed in the photoconductive layer and the one comprising a high-molecular polycarbonate having a tetraarylbenzidine structure in its molecule. The reason for this has not been clarified, but it is suggested that the photoconductor employing the high-molecular weight charge transport material produces poor results in terms of the photosensitivity and the residual potential although the mechanical strength of the photoconductor is improved.
Conventionally known representative aromatic polycarbonate resins are obtained by allowing 2,2-bis(4-hydroxyphenyl)propane (hereinafter referred to as bisphenol A) to react with a carbonate precursor material such as phosgene or diphenylcarbonate. Such polycarbonate resins made from bisphenol A are used in many fields because of their excellent characteristics, such as high transparency, high heat resistance, high dimensional accuracy, and high mechanical strength.
For example, this kind of polycarbonate resin is intensively studied as a binder resin for use in an organic photoconductor in the field of electrophotography. A variety of aromatic polycarbonate resins have been proposed as the binder resins for use in the charge transport layer of the layered photoconductor.
As previously mentioned, however, the mechanical strength of the aforementioned aromatic polycarbonate resin is decreased by the addition of the low-molecular-weight charge transport material in the charge transport layer of the layered electrophotographic photoconductor.
It is therefore a first object of the present invention to provide an electrophotographic photoconductor free from the conventional shortcomings, which can show high sensitivity and high durability.
The above-mentioned first object of the present invention cap be achieved by an electrophotographic photoconductor comprising an electroconductive support, and a photoconductive layer formed thereon, comprising as an effective component an aromatic polycarbonate resin which is prepared by solution polymerization of a diphenol compound having a triarylamine structure with a dial compound of formula (I)
wherein R1 and R2 are each independently an alkyl group which may have a substituent, an aryl group which may have a substituent, or a halogen atom: a and b are each independently an integer of 0 to 4: and Y is xe2x80x94COOxe2x80x94 or
in which Z is a bivalent aliphatic group which may have a substituent or an, arylene group which may have a substituent.
A second object of the present invention is to provide a method or producing an aromatic polycarbonate resin that is remarkably useful as a high-molecular-weight charge transport material for use in an organic electrophotographic photoconductor.
The interfacial polymerization is widely used in the industrial production of aromatic polycarbonate resins. However, the interfacial polymerization has the drawbacks that impurities, that is, various electrolytes such as a salt and an alkali must be completely removed from the obtained polymer solution. Therefore, the industrial production by the interfacial polymerization needs many complicated techniques. In particular, some industrial skills of a high order are required to obtain the aromatic polycarbonate resin as a high-molecular-weight charge transport material with high purity.
The method of producing the aromatic polycarbonate by solution polymerization using a chloroformate is proposed in Japanese Laid-Open Patent Applications 8-269183, 9-151248 and 9-22135. However, the synthesis of chloroformate restricts the diversity of reaction, and in addition, it is difficult to obtain, a polymer with a high molecular weight by the above-mentioned solution polymerization method.
Furthermore, a diphenol compound having an ester linkage cannot be turned into a desired polymer by the interfacial polymerizaton because the diphenol compound undergoes the hydrolysis in the course of interfacial polymerization.
A third object is therefore to provide a method of producing an aromatic polycarbonate resin with a high molecular weight with no difficulty.
A fourth object of the present invention is to provide a method of producing an aromatic polycarbonate resin with charge transporting properties by carrying out the solution polymerization in a uniform liquid phase around at room temperature using a simple apparatus.
The second to fourth objects of the present invention can be achieved by a method of producing an aromatic polycarbonate resin, comprising the step of carrying out solution polymerization of a diphenol compound having a triarylamine structure with a diol compound of formula (I):
wherein R1 and R2 are each independently an alkyl group which may have a substituent, an aryl group which may have a substituent or a halogen atom; a and b are each independently an integer of 0 to 4; and Y is xe2x80x94COOxe2x80x94 or
in which Z is a bivalent aliphatic group which may have a substituent or an arylene group which may have a substituent.

Electrophotographic photoconductor and method of producing aromatic polycarbonate resin for use in the photoconductor

Abstract: wherein R1 and R2 are each independently a substituted or unsubstituted alkyl croup, a substituted or unsubstituted aryl group, or a halogen atom; a and b are each independently an integer of 0 to 4: and Y is xe2x80x94COOxe2x80x94 or

Abstract: in which Z is a substituted or unsubstituted bivalent aliphatic group or a substituted or unsubstituted arylene group. In addition, an electrophotographic photoconductor has an electroconductive support, and a photoconductive layer formed thereon containing as an effective component the above-mentioned aromatic polycarbonate resin prepared by the solution polymerization.


The invention relates to an ultrasonic atomizer device (2) for a fluid (60), in particular a bronchospasmolytic agent, in which a propelling element (10) operable by an electronic circuit (6) to deliver the fluid to an atomization surface (28) that is also supplied with ultrasound waves from the electronic circuit (6) is provided in a housing (4), the propelling element (10) having a coupling member (32) which is meshing with a further coupling member (34) of a replaceable dosating unit (14) for transferring propelling power to the dosating unit (14) to effect a linear movement (68) of a piston (66) arranged in an ampoule (28) within the dosating unit (14). The invention also relates to a system comprising a device (2) as described and a dosating unit (14) inserted into that device (2).

1. Field of the Invention
The present invention relates to the atomization of a liquid, and more particularly, to an inhaler device with a removable dosating unit for delivering precise amounts of medicament to an ultrasonic atomizer device for atomizing the medicament for inhalation by a patient.
2. Description of the Prior Art
Liquid atomizers are well known and come in several types, including aerosol, manual and ultrasonic. For example, there are aerosol atomizers for various applications, such as dispensing cosmetic and hygienic products (hair spray, deodorant, etc.) and cleaning solutions (disinfectants, air fresheners, etc.). Aerosol atomizers can also be used for dispensing medicaments although they have significant drawbacks when used for that purpose. For one thing, they dispense medicaments at a high velocity, which can adversely affect a patient's ability to coordinate dispensing and inhaling the medicament. Moreover, medicament atomized and dispensed by aerosol is usually very cold and can irritate the patient's throat, and the aerosol propellant may have adverse affects on the patient as well as on the environment.
Manual atomizers are also available. In this type of device, the medicament is dispensed by a manual force provided by the patient to atomize the medicament. The most significant advantage of such atomizers is their simplicity, which makes them capable of being made small enough to be carried by patients and thus be readily available for use at any time.
However, difficulties with purely manual atomizers include non-uniformity of dosage from one patient to another (since different people will inevitably use different amounts of force to operate the device and because such devices sometimes deliver different dosages from one use to another), difficulty in coordinating the required manual actuation and inhalation of the expelled medicament (a problem particularly with very young and very old or infirm patients) and inability to protect the medicament from contamination.
Ultrasonic atomizers include one type using a piezoelectric element to atomize a liquid medicament deposited thereon by manually moving a piston within a cylinder containing the medicament to be atomized. The piston forces the liquid from an outlet in the cylinder, which deposits it onto the piezoelectric atomizer, which in turn is activated as part of the manual medicament-dispensing operation.
Examples of this type of ultrasonic atomizer (using a manually dispensed medicament) are shown in U.S. Pat. No. 4,294,407, U.S. Pat. No. 4,877,989 and U.S. Pat. No. 5,134,993. Although such atomizers are better in some respects than their purely manual counterparts, they do not completely solve the problem of providing a uniform dosage under all conditions and for all patients, and they are limited in the amount of medicament that can be atomized because of power considerations relating to the piezoelectric ultrasonic atomizer.
An ultrasonic atomizer is also proposed in European Patent Application EP 0 689 879 A1.
Another type of ultrasonic atomizer includes a pump to deliver liquid from a reservoir to a piezoelectric vibrator. Examples of this type of device are shown in British Patents No. 1,434,746 and No. 2,099,710 and European Patent Application EP 0 569 611 A1. These devices are capable of better uniformity in the amount of liquid atomized at each actuation, but they still have significant drawbacks as portable medication-delivery systems. For example, the atomizers shown in British Patents No. 1,434,746 and No. 2,099,710 clearly would be difficult to miniaturize sufficiently to make them small enough to carry in a patient's pocket or purse for convenient or, in the case of an asthma sufferer, emergency use. Further, the technique in British Patent No. 2,099,710 for dispensing the liquid to be atomized, by crumpling the liquid container, does not allow sufficient dosage precision because of the unpredictability of exactly how the container will deform.
On the other hand, the atomizer of EP 0 569 611 A1 is specifically designed to be a fully-portable, hand-held atomizer for medicament fluids such as bronchospasmolytic agents used to treat asthma. And while it is a significant advance over previously known devices, it, too, has proven unsuitable for various reasons.
A principal problem is the peristaltic tube pump disclosed in EP 0 569 611 A1 as the mechanism for delivering the medicament liquid to the piezoelectric atomizer. Although it is more precise than prior delivery systems, it still is subject to large variations in the amount of liquid it delivers. This is the result of several factors. One such factor is that any bubbles which form in the tube can significantly affect dosage amounts because those amounts are so small. Second, manufacturing tolerances in the tube diameter can also significantly affect dosage amounts for the same reason. EP 0 569 611 A1 also discloses a spring-valve system for pressurizing the liquid storage container and metering fluid therefrom, instead of the tube pump, but that still does not provide the precision dosing required in many applications, such as in a medical device, and is unduly complicated.
The device in EP 0 569 611 A1 has other drawbacks as well. The dosating system, containing the pump (or the spring-valve system) and medicament reservoir, is fairly large, and when attached to the device forms a significant part of its outside envelope. As such, it is prone to becoming detached when the unit is carried in a pocket or purse. In addition, the dosating system is difficult to seal in a manner that maintains suitable microbiological conditions over long periods. Finally, any medicament remaining after actuation at the end of the tube delivering it to the piezoelectric element will be exposed to the atmosphere until the next actuation, and thus be prone to contamination. Because that potentially contaminated medicament is then atomized and inhaled by the patient in the next actuation, it is necessary to address that issue from the standpoint of patient safety.
In addition, all types of prior ultrasonic atomizers suffer from the problem of being unable efficiently and effectively to atomize sufficient amounts of medication. For example, a piezoelectric element of a certain size can only atomize a given amount of liquid on its surface. If that is a smaller amount than the dosage amount for a particular medicament, then the atomizer will be inherently incapable of performing its intended function as an inhalable-medication delivery system. Making the piezoelectric element larger is a potential solution, but the amount of power required to operate a piezoelectric element at a given frequency increases exponentially as the size of the element increases. Accordingly, the size of the piezoelectric element is perforce limited because the atomizer, to be practicable, must be capable of a significant number of operations using batteries small enough to fit into a pocket-size device.

Dosating unit for an ultrasonic atomizer device


A controller for driving permanent magnet type synchronous motor. A motor terminal voltage or IPM (intelligent power module) input voltage necessary to achieve a target operating point is computed based on torque command and motor revolution. When the computed voltage exceeds an actual battery voltage, a booster is inserted between the battery and IPM, and the battery voltage, after being boosted, is applied between the direct current terminals of the IPM. Since the motor terminal voltage can be made so as to not exceed the boosted voltage even if the motor terminal voltage rises along with a rise in revolution and speed voltage, field weakening control becomes unnecessary.

1. Field of the Invention
The present invention relates to a controller for driving a permanent magnet type synchronous motor (hereinafter referred to as a PM motor).
2. Description of the Related Art
There is a strong demand for the miniaturization of vehicle driving motors for electric vehicles. A PM motor is a type of motor that uses permanent magnets as a generating means for excitation magnetic flux and is characterized by having a large field magnetomotive force per unit volume. Therefore, since the PM motor is easier to miniaturize than other types of motors, various electric vehicles using the PM motor as the driving motor have heretofore been proposed.
Vector control is widely used as a method for controlling the vehicle driving motors of electric vehicles. Vector control is a method where target control is performed by separating the motor current IM into a torque current component Iq and a field current component Id. Of these components, Iq generates a torque (magnet torque) from an interaction with the main flux, namely, the excitation magnetic flux obtained at the permanent magnet. Id generates the excitation magnetic flux that partially strengthens or weakens the main flux. If the motor has pole saliency, Id also generates a torque (reluctance torque) proportional to Id.cndot.Iq.
When using vector control in a system having a battery for a power supply, such as an electric vehicle, the following problems arise. First, within the motor, the main flux E0 interacts with the winding at a rotor angular velocity .omega. of the motor. A voltage induced in the winding by this interaction is called a speed voltage. The speed voltage is an electromotive force that is directly proportional to the rotor angular velocity .omega. of the motor and can be expressed as .omega..cndot.E0. Therefore, as the rotor angular velocity .omega. of the motor rises, the speed voltage .omega..cndot.E0 also rises. As the speed voltage .omega..cndot.E0 rises, the voltage across the ends of the winding rises, and in turn the terminal voltage of the motor rises. If the terminal voltage rises significantly so as to exceed a value corresponding to a battery voltage VB, which is the supply voltage, it can be appreciated that a load is placed on the circuitry and electrical components located between the motor terminals and the battery. To avoid this load, the rotor angular velocity .omega. or the revolution N of the motor must be limited so that the terminal voltage of the motor does not exceed the value corresponding to the battery voltage. This sort of limitation on the operable revolution range is, in other words, an upper limit on the speed range that can be attained in an electric vehicle.
A method called field weakening control has been the most widely used method to solve this sort of problem and is presently handled partially using vector control. Field weakening control is a method for generating the excitation magnetic flux in a direction that weakens main flux E0 through control of Id when rotor angular velocity .omega. of the motor is high, and for further extending the operable region of the motor to the field weakening range at the high revolution side (refer to FIG. 6). Using this method, a high revolution region can be covered even for a motor with a relatively small output. Vector control also includes a mode based on an absolute value and torque angle, which is equivalent to the mode based on Id and Iq, so no distinction is made between them in this application.
Although field weakening control features this sort of advantage, it also results in a drop in efficiency. First, field weakening control increases the absolute value of Id at high revolutions. As mentioned earlier, Id is a current component that contributes little or nothing to torque generation. Thus, if Id (hereinafter referred to as a field weakening current) is excessively large when field weakening control is performed, loss increases. Conversely, if the field weakening current is excessively small, it hinders the achievement of the original object of the field weakening. In other words, the circuitry and electrical components provided between the motor terminals and battery, such as a power converter for motor output control, is subjected to stress so that the required Iq cannot be output. As a method to resolve these problems, the assignee for the present invention has previously proposed a method for varying the value of the field weakening current according to VB (refer to Japanese Patent Laid-Open Publication No. Hei 7-107772). According to this method, the loss generated in field weakening control can be minimized and optimized in the relationship with the voltage or the state of charge of the battery. However, as long as field weakening control is performed, the generation of loss caused by the field weakening current and the resulting drop in system efficiency cannot be eliminated.

Controller for driving a permanent magnet type synchronous motor


Embodiments of a digital cymbal displacement control device for an electronic hi-hat are provided. A digital cymbal displacement detection unit in accordance with the present disclosure is configured to be directly mounted on the tube above the stand of an electronic hi-hat, as with any conventional hi-hat, without any need of changing the way how the electronic hi-hat is operated. The digital cymbal displacement detection unit includes at least one displacement detection unit and a plurality of sliding elastic elements that slide along a contact surface of the at least one displacement detection unit. Variation in an electrical parameter of at least one of the at least one displacement detection unit is utilized to determine the displacement of an electronic cymbal set of the electronic hi-hat.

1. Technical Field
The present disclosure relates to the field of electronic musical instruments and, more particularly, to electronic percussion instruments.
2. Description of the Related Art
Cymbals are a common percussion instrument. Cymbals typically consist of thin, normally round plates of various alloys. There are various types of cymbals, including hi-hats.
A hi-hat, or hihat, is a type of cymbal and stand used as a typical part of a drum kit by percussionists in various forms of contemporary popular music, and is a standard part of the modern drum kit. A hi-hat typically consists of two cymbals that are mounted on a stand, one on top of the other (and hence the two cymbals consists of a top cymbal and a bottom cymbal), and a pedal which can be used to clash and hold the cymbals together. The pedal is usually directly below the cymbals, which are supported by a hollow vertical tube. The top cymbal is mounted horizontal and bell up, while an adjustment screw allows the bottom cymbal to be either horizontal or slightly tilted. A narrow metal shaft or pull rod runs through the top and bottom cymbals as well as the tube, and connects to the pedal. The top cymbal is connected to the pull rod with a clutch or clutch assembly, and can be lowered by operating the pedal against a spring which holds it up in the "open" position, while the bottom cymbal remains stationary. The height of the top cymbal with the pedal released is typically adjustable by varying the position of the clutch assembly on the pull rod. When the cymbals are closed, the pressure holding them together can be varied by varying the foot pressure.
When the foot plate of the pedal is pressed, the top cymbal crashes onto the bottom cymbal (a state known as closed hi-hat). When the foot plate of the pedal is released, the top cymbal returns to its original position above the bottom cymbal (a state known as open hi-hat). Tension of the spring controls the amount of pressure required to lower the top cymbal, as well as how fast the top cymbal returns to its open position, and can also be varied.
There are several patterns of clutch assembly used to support the top cymbal, but the most common uses a knurled collar that is part threaded below the cymbal, and a pair of knurled rings above it. The collar is tightened against the end of the thread, while the rings are tightened against each other.

Digital cymbal displacement control device for electronic cymbal


The present invention provides a wafer support tool for heat treatment easy in working and capable of realizing reduction in cost without generating damages or slip dislocations that would be otherwise caused by high temperature heat treatment and a heat treatment apparatus. The present invention is directed to a wafer support tool for heat treatment comprising: a plurality of wafer support members for supporting a wafer to be heat treated; and a support member holder for holding the wafer support members, wherein the wafer support members each has a contact portion with the wafer, at least one of the contact portions being movable relative to the support member holder.

In a wafer support tool used for batch type heat treatment, there has been generally adopted a design that plural wafers are inserted and held in parallel to one another in grooves of a structure called a boat, which has support poles with the grooves. Especially in heat treatment at 1000° C. or higher, SiC is generally adopted as material of a wafer support tool because of its heat resistance and other properties. A method is adopted to cut grooves directly in the support poles with a diamond cutter or the like.
Since limitation is, however, placed on a shape of a work piece in this method, it is difficult to work the work piece into an intricate shape such as a curved surface. There also arises a problem that burrs are easily generated on surfaces of the grooves during cutting operation. In addition, there arises a problem that difficulties are encountered in additional working for removing the generated burrs and in polishing for decreasing surface roughness of the grooves with which a wafer is brought in contact, so damages or slip dislocations occur on wafers in the contact portions with the boat during heat treatment (see JP-A 7-161654 and 8-107081). Since the support poles are easy to be broken during working, which requires great labor and a working time, leading to poor productivity and difficulty in cost reduction.
The batch type heat treatment is to heat treat many wafers at a time using resistance heating (with a heater). In recent years, in addition to the batch type heat treatment apparatus, there also has been used frequently an RTP (Rapid Thermal Processing) apparatus for single wafer treatment in which rapid heating and rapid cooling treatment is performed by the use of a lamp heating method or the like.
Examples of heat treatment using an RTP apparatus can include: heat treatment for annihilating defects on a wafer surface, heat treatment for annihilating oxygen donors, heat treatment for producing a shallow diffused layer (RTA: Rapid Thermal Annealing), heat treatment for producing a thin oxide film (RTO: Rapid Thermal Oxidation) or the like. Single wafer epitaxial growth and vapor phase growth for an insulating film or the like using lamp heating can be included in the heat treatment using an RTP apparatus in a broad sense.
In the RTP treatment, as in the batch type heat treatment apparatus, a wafer support tool (may be called "a susceptor") for heat treatment is employed; therefore, a problem has remained unsolved that slip dislocations are easy to occur in contact portions of the wafer support tool with a wafer (see JP-A 2002-164300).

Wafer support tool for heat treatment and heat treatment apparatus


A tube made of profiled strip has an inner edge, an outer edge parallel to the inner edge and projecting away from the inner edge, a double-thickness outwardly directed inner lip forming between the edges an outwardly open inner slot, and a double-thickness inwardly directed outer lip forming between the inner slot and the outer edge an inwardly open outer slot. The strip is formed into turns centered on an axis with the inner slot of each turn axially slidably receiving the outer lip of the adjacent turn on an inner side and the outer slot of each turn axially slidably receiving the inner lip of the adjacent turn on an outer side.

The present invention relates to tubing. More particularly this invention concerns a multilayer tube formed of profiled strip.
A multilayer tube formed of profiled strip is known from German patent document 3,441,064. The strip has inner and outer edges, is formed between them with a double-thickness outwardly directed lip defining an outwardly open inner slot, and is bent back under at its outer edge to form an inwardly open outer slot with the outer edge extending backward toward the inner edge. Where two turns of the strip material overlap, the outwardly directed double-thickness lip of each turn is engaged in the outer slot under the bent-back outer lip of the adjacent turn. Thus the turns are locked together and can shift limitedly relative to each other to allow the tube to be bent. What is more the interfit is so tight that the tube can easily be sealed to safely transport gas or liquid under pressure.
The disadvantage of this system is that, when stretched, relatively wide radially outwardly directed openings are formed that can catch and fill with dirt and the like. Furthermore the tube thus formed is at most two layers thick in many locations so it is not strong. The inner surface of the tube is shingled, with overlapping sections that make flow in the tube turbulent.
It is therefore an object of the present invention to provide an improved tube made of profiled strip.
Another object is the provision of such an improved tube made of profiled strip which overcomes the above-given disadvantages, that is which has smooth outer and inner surfaces even when bent or extended, and which is very strong.
A tube made of profiled strip has according to the invention an inner edge, an outer edge parallel to the inner edge and projecting away from the inner edge, a double-thickness outwardly directed inner lip forming between the edges an outwardly open inner slot, and a double-thickness inwardly directed outer lip forming between the inner slot and the outer edge an inwardly open outer slot. The strip is formed into turns centered on an axis with the inner slot of each turn axially slidably receiving the outer lip of the adjacent turn on an inner side and the outer slot of each turn axially slidably receiving the inner lip of the adjacent turn on an outer side.
As a result whether the tube is axially compressed or extended, the outer surface is generally smooth so particles cannot get between the turns. Furthermore at any point along the tube the strip is at least three layers thick, making it possible for the turns to seal well against each other and providing excellent strength. This makes the tube ideal for use passing hot motor-vehicle exhaust gas, as a tight seal and strength are needed for safety.
In accordance with the invention the inner slots are radially outward of the outer slots. In addition the inner edges are radially inward of the outer edges. Each turn is radially outwardly overlain by an outer-edge portion of the turn on the inner side and is radially inwardly overlain by an inner-edge portion of the turn on the outer side.
According to another feature of the invention respective inner and outer parallel helicoidal elastomeric seals flanking the strip between the slots thereof. The strip is formed between the lips with a web extending generally radially of the axis and the seals lie on opposite axial sides of the web.
It is also possible according to the invention to provide a seal compressed against an edge portions. This seal is compressed against an outer-edge portion.

Multilayer tube formed of profiled strip

Westfalia Metallformtechnik GmbH and Co.


A positive photosensitive siloxane composition having high photosensitivity and having such properties as high heat resistance, high transparency and low dielectric constant may be used to form a planarization film for a TFT substrate, an interlayer dielectrics or a core or cladding of an optical waveguide. The positive photosensitive siloxane composition includes a siloxane polymer, quinonediazide compound and solvent, and a cured film formed of the composition has a light transmittance per 3 μm of film thickness at a wavelength of 400 nm of 95% or more.

In recent years, for example, in liquid crystal displays and organic EL displays, a method for enhancing the aperture ratio of a display device is known as a method for achieving further higher precision and higher resolution (U.S. Pat. No. 5,953,084). In this method, a transparent planarization film is provided on a TFT substrate as a protective film, to allow data lines and pixel electrodes to overlap on each other, for enhancing the aperture ratio compared with the prior art.
The materials used as the planarization films for TFT substrates are required to have high heat resistance, high transparency and low dielectric constant, and the conventional materials include a material made by combining a phenyl-based resin and a quinonediazide compound (JP7-98502A) and a material made by combining an acrylic resin and a quinonediazide compound (JP10-153854A, JP2001-281853A). However, these materials are insufficient in heat resistance and have a problem that if they are treated at a high temperature as substrates made by using them, the cured films made of them are colored to decline in transparency.
On the other hand, a siloxane polymer is known as a material having high heat resistance, high transparency and low dielectric constant. As materials made by combining a quinonediazide compound with a siloxane polymer to let the siloxane polymer have positive photosensitivity, known are a material made by combining a siloxane polymer having phenolic hydroxyl groups at the ends and a quinonediazide compound (U.S. Patent Publication No. 2003/211407), and a material made by combining a siloxane polymer having phenolic hydroxyl groups, carboxyl groups or the like added by cyclization and heat addition reaction and a quinonediazide compound (JP3-59667A). However, these materials cannot be used as highly transparent materials, for such reasons that since they contain a large amount of a quinonediazide compound or have phenolic hydroxyl groups existing in the siloxane polymer, the coating films formed of them are likely to be opaqued or colored during curing. Furthermore, they also have a problem that the photosensitivity during patterning is low, since they are low in transparency.

Positive type photo-sensitive siloxane composition, cured film formed from the composition and device incorporating the cured film


A nanowire electronmechanical device with an improved structure and a method of fabricating the same prevent burning of two nanowires which are switched due to contact with each other while providing stable on-off switching characteristics. The nanowire electromechanical device comprises: an insulating substrate; first and third electrodes spaced apart from each other on the insulating substrate, wherein a negative voltage and a positive voltage, varying within a predetermined range, are applied to the first and third electrodes, respectively; a second electrode interposed between the first and third electrodes, a constant positive voltage, lower than the voltage applied to the third electrode, being applied to the second electrode; a first nanowire vertically grown on the first electrode and charged with a negative charge; a second nanowire vertically grown on the second electrode and charged with a positive charge; and a third nanowire vertically grown on the third electrode and charged with an amount of positive charge corresponding to the magnitude of the varying voltage applied to the third electrode.

1. Technical Field
The present invention relates to a switching device and, more particularly, to a nanowire electronmechanical device with an improved structure that can prevent burning of two nanowires caused by their being switched on by contacting each other, while providing stable on-off switching characteristics, and a method of fabricating the same.
2. Related Art
A nanowire switching device includes an insulating substrate, first and second electrodes disposed on the insulating substrate, and first and second nanowires vertically grown on the first and second electrodes, respectively. When a predetermined voltage difference is applied between the first and second electrodes, positive and negative charges are accumulated on the first and second nanowires, respectively. An attractive electrostatic force acts between the first and second nanowires to electrically deform the first and second nanowires so that distal ends of the first and second nanowires contact each other and are switched on. However, a high driving voltage of 25 V to 50 V should be applied between the first and second electrodes to induce elastic deformation of the nanowires for the two-electrode switching device. When the high driving voltage is applied, high current flows through the nanowires, which can lead to arcing or burning of the distal ends of the nanowires when they contact each other. The arcing or burning not only degrades switching characteristics but also reduces the lift span of the switching device.

Nanowire electromechanical device and method of fabricating the same


A headlamp which includes a pivoting lamp body is presented. The headlamp includes a support with a fixing for a retaining strip on the head of a user. The support has a horizontal base, a first left lateral part and a first right lateral part perpendicular to the base of the support. A lamp body has a light source associated with electrical circuits allowing the control and regulation of the light source. The lamp body is housed between the first and second lateral parts. The lamp body is fixed to the support by means of a mechanical connection combining a pivot function and a translation function to hold the lamp body as close as possible to the support.

Headlamps, such as those originally used by miners, are subject to a great success in the field of leisure activities, including caving and hiking. They are also widely used professionally.
Generally speaking, headlamps are used in various configurations and professional and recreational uses. To ensure a wide variety of lighting situations, they are also often fitted with a pivoting lamp body allowing precise adjustment of the light beam projected in front of the user.
FIGS. 1A-1E illustrate an example of a conventional headlamp which comprises two distinct parts, each one being movable with respect to the other, namely a support 100 fixed to an elastic band and a lamp body 110 which can pivot with respect to a pivot 101 for allowing an adjustment of the angle of the projected light beam as desired by the user. Thanks to such an adjustable beam, the user can choose to have the light beam projected either directly in front of him or far away to allow him, for example, to use the headlamp in a very mobile activity such as running.
FIGS. 1A to 1E illustrate various angles of rotation of the lamp body 110 with respect to support 100. FIG. 1C corresponds to the configuration in which the axis of the support and the axis of the lamp body merge into a horizontal axis. As can be seen in this figure, but also in FIGS. 1B and 1D, this configuration requires, to allow a large pivoting of the lamp body 110 as illustrated in FIGS. 1A and 1E, to position the pivot 101 to a "certain" distance relatively distant from the base of the support 100, thus resulting a fairly large volume and bulk. To illustrate this relative size, FIG. 1C shows two characteristic distances D1 and D2 between the base of the support and two rear and front planes of the lamp body 110. D1 represents the distance from the base of the support 100 to the rear plane of the lamp body, while D2 illustrates the distance between the base of the support and the front plane of the lamp body.
We realized that this arrangement raises a difficulty when it comes to making a modern headlamp that will produce a strong light beam. In such a situation, it is indeed necessary to provide several high-power LED diodes associated with their electronic supply and control circuitry, as well as suitable cooling devices. In the end, we end up with a headlamp which has a relatively heavy and bulky lamp body 110, which exposes the user to a risk of tilting during sports or very active and dynamic uses, such as running.
In addition, we have also seen the development of a new use of the headlamp, practically worn "around the neck", like a necklace. This configuration has known some success with many users, but also raises the problem of a risk of tipping over of a relatively heavy and bulky lamp, the tilting of which can cause a fall and an accident.
In such a use "around the neck", the volume and the weight of the lamp body cause a risk of tilting making it difficult to adjust the pivot of the headlamp arranged around the neck.
The present invention aims to remedy this problem.

Compact headlamp having a pivoting lamp body


A connecting member between wiring films is provided in which: a normal copper foil, which is a general-purpose component and not expensive, or the like can be used as a material; formation of bumps is sufficiently achieved by conducting etching one time; and a necessary number of layers can be laminated and pressed collectively at a time. Bumps, which are formed approximately in a cone-shape, for connecting wiring films of a multilayer wiring substrate are embedded in a second resin film that serves as an interlayer insulating film.

1. Field of the Invention
The present invention relates to a connecting member between wiring films, a manufacturing method thereof, and a manufacturing method of a multilayer wiring substrate, and specifically, to a connecting member between wiring films, a manufacturing method thereof, and a manufacturing method of a multilayer wiring substrate which are preferably applied to the case where the connecting between wiring films of the multilayer wiring substrate is performed by using a bump made of copper, for example.
2. Description of the Related Art
As one of the methods of performing the connecting between wiring films of a multilayer wiring substrate, there is a method of using a bump made of copper, for example. The method will be simply described with reference to FIG. 26.
A. First, a multilayer metal plate 1 is prepared as shown in FIG. 26(A). The multilayer metal plate 1 is formed by laminating a wiring film forming metal layer 4 that is made of copper foil having a thickness of, for example, 18 μm, through an etching stopping layer 3 that is made of nickel having a thickness of, for example, 1 μm, on one of principal surfaces of a bump forming metal layer 2 that is made of copper foil having a thickness of, for example, 100 μm.
B. The bump forming metal layer 2 of the multilayer metal plate 1 is subjected to selective etching to form bumps 2a for connecting between the wiring films, as shown in FIG. 26(B).
C. When the etching treatment is completed, as shown in FIG. 26(C), an etching treatment with respect to the etching stopping layer 3 is conducted by using copper as a mask, copper being used in forming the bumps 2a and the wiring film forming metal layer 4.
D. An insulating film 5 made of, for example, thermosetting resin is then bonded to the formed surface of the bump 2a so as to expose the top portion of the bump 2a, as shown in FIG. 26(D).
E. Thereafter, a wiring film forming metal thin plate 6 made of, for example, copper is provided so as to face a surface of the multilayer metal plate 1 from which the top portion of the bump 2a is projected, as shown in FIG. 26(E).
F. The wiring film forming metal thin plate 6 is connected to the bump 2a to be laminated on the formed surface side of the bump 2a, as shown in FIG. 26(F).
G. The wiring film forming metal layer 4 of the multilayer metal plate 1 and the wiring film forming metal thin plate 6 are subjected to patterning treatment by selective etching, to thereby form wiring films 4a and 6a. Thus, a multilayer wiring substrate 7 is completed as shown in FIG. 26(G). The wiring films 4a become the wiring films of the upper layer, and the wiring films 6a become the wiring films of the lower layer. When the number of layers is further increased, a wiring substrate in the state shown in FIG. 26(D) is laminated on the multilayer wiring substrate 7, for example.
In the above-described conventional technique, the multilayer metal plate 1 is employed. As described above, the multilayer metal plate 1 has the three-layer structure made of, for example, a copper layer, a nickel layer and a copper layer. The multilayer metal plate 1 is not a general-purpose component such as a simple copper foil but a custom-made component. Therefore, the unit price is expensive.
Also, in the above-described conventional technique, the bumps 2a are formed by first etching, and the removal of the etching stopping layer 3 is performed by second etching. Thus, it is necessary that the different kinds of etching are performed at least twice. Therefore, the number of steps for the processes is increased, and the etching material cost is also increased since different materials are used for selective etching.
In the above-described conventional technique, when the number of the layers is increased, it is necessary to repeat the steps of, for example, forming the wiring films 4a on the wiring film forming metal layer 4 by etching, to laminate the wiring substrate in the state shown in FIG. 26(D) thereon; and forming the next wiring films 4a on the wiring film forming metal layer 4 by etching, to laminate the next wiring substrate in the state shown in FIG. 26(D) thereon. Therefore, it is impossible to stack a desired number of layers at a time to press them collectively.
Also, in the above-described conventional technique, etching resist patterns 8 corresponding to the bumps are formed on the bump forming metal layer 2 and the etching is conducted by using the patterns 8 as the masks, to thereby form the bumps 2a, as shown in FIG. 27. However, in this case, the diameter of each of the etching resist patterns 8 is not allowed to be set to a value equal to or smaller than a given value in relation to the depth of the etching. Also, it is necessary to provide gaps G having the distance equal to or larger than a given value between the etching resist patterns 8. Therefore, the pitch of the etching resist pattern 8, in other words, the pitch of the bump 2a, is not allowed to be set to a value smaller than a given value. For example, when the metal layer has a thickness of 0.1 mm, the pitch has a limitation of 0.4 mmP (Here, foot portion of the bump has a diameter of 0.15 mm.)
In the above-described conventional technique, the wiring film forming metal layer 4 is necessary to have the thickness capable of resisting the conveyance with a conveyor in order to support the bumps 2a to be formed. The metal layer 4 having an extremely thin thickness causes wrinkles, scars, and breaks in the process, and thus, can not be substantially adopted. The step that adopts the semi-additive process that enables minuteness compared with a subtracting process is convenient as long as metal foils with a thickness of about 3 to 5 μm can be used on both sides of the insulating film 5. However, with the above reason, it is difficult to form the wiring layers with a thickness of about 3 to 5 μm.
Also, in the above-described conventional technique, when the bump 2a is heightened, the diameter of a so-called foot portion of the bump 2a is also inevitably increased. Therefore, in the state where the bump 2a is heightened, it is impossible to set a pitch of the bump 2a to a value equal to or smaller than a certain degree.

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate


The application discloses an optical imaging lens. The optical imaging lens sequentially includes from an object side to an image side along an optical axis: a first lens having a focal power; a diaphragm; a second lens having a focal power; a third lens having a focal power, and provided with an object-side surface and an image-side surface, the object-side surface is convex surface, the image-side surface is a concave surface; a fourth lens having a positive focal power, and provided with an object-side surface and an image-side surface, the object-side surface is a concave surface, the image-side surface is a convex surface; and a fifth lens having a negative focal power; at least one aspherical mirror surface is included in an object-side surface of the first lens to an image-side surface of the fifth lens; the optical imaging lens meets the following relational expressions: f/EPD<1.5, and 2 mm<ImgH*EPD/f<3 mm.

In recent years, with the development of 5th Generation (5G) technologies, Internet-of-Things (IoT) technologies, Artificial Intelligence (AI) technologies and so on, various functions of devices, such as a man-machine interaction function and an environment recognition function, are increasingly perfected and enriched; and on the other hand, increasingly higher requirements are also imposed on accuracy, sensitivity and other performances of the devices.
For example, an Augmented Reality (AR) technology is a technology skillfully integrated with virtual information and a real word. With the utilization of multiple technological means like multimedia, Three-Dimensional (3D) modeling, real-time tracking and registration, intelligent interaction, and sensing, the virtual information generated by computers, such as texts, images, 3D models, music and videos, is simulated and applied to the real word; and the two types of information are complemented to each other to implement "augmentation" on the real world. In order to acquire environmental information in the AR technology, it is necessary for the devices to recognize the real world and 3D scenarios. In some working environments, for instance, when mobile phones and other devices are used, it is expected that a camera module thereon can work at a high resolution ratio. The camera module is often provided with a Charge-coupled Device (CCD) image sensor or a Complementary Metal Oxide Semiconductor (CMOS) image sensor, and further provided with an optical imaging lens. The optical imaging lens can gather light rays on an object side, and the imaging light rays travel along an optical path of the optical imaging lens and are irradiated onto the image sensor; and then, the image sensor converts an optical signal into an electrical signal to form an image data.
When the environmental information is acquired, a Time of Flight (ToF) distance measurement method may be used. In the technology, the sensor is typically used to transmit modulated near-infrared light, and the near-infrared light is reflected to the sensor when encountering an object. Then, the sensor calculates a time difference or a phase difference between transmission and reflection, and obtains a distance of a photographed scenery by conversion, thereby generating depth information. The ToF method has high measurement accuracy, a good environmental adaptability and a large recognizable depth, and thus is widely applied to the mobile phones, IoTs, AIs and other scenarios.
For the purpose of meeting the imaging requirements, an optical imaging lens having a large aperture and a high resolution ratio is desired on the market.


The present invention provides a protective glove for ice hockey wherein the palm area can be quickly removed and replaced. The glove is formed of a back member covering the back of the user's hand and having the exterior surface of the back member covered with padding appropriate to protect the user's hand. A removable front portion is attached to the back member by a zipper which extends around the peripheral edges of the glove. An overlapping wrist closure mechanism with the overlapping flaps provided with Velcro.RTM. hook and loop type fastening devices assists in securing the ice hockey glove to the user.

1. Field of the Invention
The present invention relates to a protective glove for ice hockey, specifically the invention relates to an ice hockey glove in which the palm area for holding the stick can be removed and replaced quickly and easily.
2. Prior Art
During ice hockey when a player uses a pair of gloves for a prolonged period, the palm area of the glove collects moisture from melted ice as well as from player perspiration. This collection of moisture reduces the sensitivity of the player's hand and the gloves need to be replaced. Consequently, it is typical for an ice hockey player to keep a plurality of gloves in order to maintain sufficient sensitivity within the player's hands. The players require this sensitivity to maintain skillful stick-handling ability which is essential in the sport of ice hockey.
In a hockey glove, the portion on the back of the glove is usually protected with padding and is less susceptible to damage and wear during conventional use. The front or palm portion of the glove exhibits wear to a much greater extent during use due to constant engagement with the hockey stick. Consequently, the palm area of hockey gloves is more likely to abrade and tear than the back of the glove. Heretofore, the palm area of a glove is generally the determining factor of the durability and life of the hockey glove.
U.S. Pat. No. 3,605,117 to Latina discloses an ice hockey glove which addresses some of these issues. The hockey glove of the Latina patent discloses a hand receiver portion or inner glove which is attached to a padded back portion at the ends of the finger stalls and the outer sides of the palm area, but otherwise remains detached from the inner glove. The inner glove is coupled to the padding through lacing. Consequently, when the face of the inner glove wears out, the lacings need to be withdrawn and a new inner glove installed, thereby allowing reuse of the back padding. The Latina patent suffers from the disadvantage that it does not allow for quick replacement of the inner glove. Replacing the entire inner glove of the Latina patent is a time-consuming procedure requiring the user to remove and replace all of the laces in the hockey glove. Additionally, the replacement of the entire inner glove portion in the Latina patent is not the most efficient procedure since only the palm portion of the glove is generally damaged. Additionally, the attachment of the back padding to the glove at only distinct points may lead to the padding failing to conform to the configuration of the user's hand and possibly failing to adequately protect the user in certain positions.
The object of the present invention is to overcome the aforementioned drawbacks of the prior art. Additionally, the object of the present invention is to provide an ice hockey glove with a quick, efficient and economical palm area replacement. Another object of the present invention is to provide an efficient wrist closure mechanism for securing the glove to the user's hand and wrist.


Disclosed is transfer apparatus for use in an embossing dispenser capable of sequentially dispensing primary and secondary rolls of a sheet material. The transfer apparatus includes pivotally mounted transfer linkage which supports a primary roll contacting surface. Bar means attached to the transfer linkage has a comb projecting therefrom with a wing member extending from each end of the bar member. The transfer linkage is biased for rotational movement to maintain the primary roll contacting surface in contact with the primary roll as the primary roll is depleted. This biasing simultaneously rotates the bar means toward the embossing rollers. As the primary roll nears exhaustion, the wing members engage one of the embossing rollers to thereby position the comb means such that it partially invades the grooves of the embossing roller thereby moving the tail of the secondary roll into contact with one of the knuckled embossing rollers in close proximity to the nip such that the tail of the secondary roll is engaged by the knuckles of the embossing rollers and drawn through the nip. The wing members ensure that the comb means so positions the tail of the secondary roll without the comb interfering with either of the embossing rollers.

1. Field of the Invention
The present invention relates generally to embossing dispensers for dispensing multiple rolls of rolled paper products and more particularly, to means for transferring the tail of the secondary roll into the nip and, therefore, a dispensing position when the primary roll is exhausted.
2. Brief Description of the Prior Art
A variety of dispensing cabinets for sequentially dispensing two rolls of sheet material such as paper towel are known in the prior art. Upon depletion of sheet material from one roll, dispensing automatically begins from the second roll. These dispensing cabinets typically include a pair of rollers forming a nip through which the sheet material is passed. These feed rollers are usually attached to a crank or a lever which is used to drive one or both of the rollers so as to draw a portion of the sheet material therethrough. Initially, the sheet material from one roll is placed into the nip and, as the initial roll approaches exhaustion, the leading end of the sheet material from the second roll is transferred into the nip. In such manner, dispensing of the sheet material from the second roll is commenced.
An example of such a prior art dispenser is U.S. Pat. No. 3,628,743 to Bastian. Such dispenser includes a rotatably mounted transfer roller which is moveable against one of the feed rollers in response to substantial depletion of the sheet material on the primary roll. The leading end of the sheet material from the reserve roll is positioned between the transfer roller and the feed rollers while the primary roll is being used. Upon movement of the transfer roller toward the feed rollers, the sheet material from the reserve roll is pressed against the drive roller and the drive roller, as it is turned by an attached crank or lever, advances the reserve sheet material toward the feed roller nip. A prong holding the end of the reserve roll sheet material prevents advancement of the sheet material past the feed rollers and thereby directs the sheet material to crowd into the feed roller nip for dispensing.
Although adequate for a typical rolled paper dispenser, the transfer means as taught by Bastian is not adequate for an embossing dispenser. The sheet crowding disclosed by Bastian of the reserve sheet material is insufficient to produce enough aggregate friction as a result of geometric restrictions to successfully induce the reserve roll of sheet into the nip formed by knuckle-type embossing rollers.
U.S. Pat. No. 4,010,909 also to Bastian teaches a modified transfer device which uses two transfer rollers connected to opposite ends of a pivotally mounted and spring biased linking member. The first transfer roller contacts one feed roller and the second transfer roller contacts the other feed roller thereby bunching the lead sheet of the reserve roll into the nip formed between the feed rollers. Again, due to the geometry of the nip between the embossing rollers of the present invention, successful transfer of the reserve roll sheet material into the nip would not be accomplished by this design of Bastian. The bunching of the sheet material becomes so great before it is pressed into the nip between the knuckled rollers that the resultant wad is too large to crank through the nip.
U.S. Pat. No. 4,487,375 to Rassmussen, et al. teaches a dispenser for sequentially dispensing multiple rolls of paper toweling. Such dispenser includes what are described to be a pair of mating rollers wherein one of the mating rollers includes a plurality of annular recesses. The transfer mechanism includes spaced tucking fingers corresponding with the annular recesses such that, on transfer, the tucking fingers drive the web into the recesses and thus cause the web to engage in the nip.

Embossing dispenser roll transfer assembly


The invention relates to a method of manufacturing a circuit protector and to a circuit protector. The method comprises the steps of providing a substrate having opposing end portions, coupling an element layer to the top surface of the substrate, and laser machining the element layer to shape the element layer into a predetermined geometry. The circuit protector comprises a substrate having opposing end portions, termination pads coupled to the top surface at opposing end portions of the substrate, a fuse element disposed across a space between the termination pads and electrically connecting the termination pads, the fuse element having a predetermined geometry; the predetermined geometry having the narrowest width of about 0.025 to about 0.050 millimeters, a cover coupling the top surface and suffusing the substrate, the fuse element and the termination pads, and end terminations in electrical contact with the termination pads at the opposing end portions.

This invention relates generally to a circuit protector and, more particularly, to SMD and through-hole fuses and methods of manufacturing SMD and through-hole fuses. In particular, the present invention may be used in connection with all standard sizes of surface mountable devices and through-hole fuses including, but not limited to, 1206, 0805, 0603 and 0402 fuses, as well as with all non-standard fuse sizes. U.S. application Ser. No. 11/091,665, entitled, "Hybrid Chip Fuse Assembly Having Wire Leads And Fabrication Method", which was published on Sep. 28, 2006 as U.S. Publication No. 20060214259, relates to through-hole fuses and is incorporated by reference herein.
Subminiature circuit protectors are useful in applications in which size and space limitations are important, for example, on circuit boards for electronic equipment, for denser packing and miniaturization of electronic circuits.
Ceramic chip type fuses are typically manufactured by depositing an element layer on a ceramic or glass substrate plate, screen printing the element layer, printing the element layer to a predetermined thickness and width to obtain a certain resistance, attaching an insulating cover over the element layer, and cutting, or dicing, individual fuses from the finished structure. The element layer loses definition when the screen printing operation is performed. The screen printing operation is not very accurate and the edge acuity of the resulting element layer is not very good. Photolithography etching may be used as an alternative to the screen printing operation, but this process is relatively expensive due to additional required processing steps and the longer lead times.
There is a need for a method of manufacturing a subminiature circuit protector that is simple and relatively inexpensive. Additionally, there is also a need for a method of manufacturing a subminiature circuit protector, wherein the element layer may be designed to a certain geometry and also has a fine edge acuity.

Manufacturability of SMD and through-hole fuses using laser process