An optical communication system for transmitting wavelength division multiplexed (WDM) signal light through an optical fiber. The optical communication system includes a decoupling unit and a monitoring unit. The decoupling unit decouples a portion of the WDM signal light from the optical fiber as a monitoring signal. The monitoring unit determines the spectrum of the WDM signal light from the monitoring signal and performs control processing in accordance with the determined spectrum. Control processing includes performing at least one of the following: (1) controlling light sources to maintain a constant wavelength of each light signal in the WDM signal light, (b) determining a noise figure of an optical amplifier which amplifies the WDM signal light, (c) controlling the optical amplifier to achieve a desired noise figure, (d) detecting a signal-to-noise ratio of the WDM signal light, (e) detecting a true signal power of the WDM signal light, (f) maintaining the true signal power to be at a constant level, (g) counting the number of channels in the WDM signal light, (h) equalizing the gain of an optical amplifier to maintain a flat gain, (i) selecting a light source from among redundant light sources for providing a light signal on a respective channel of the WDM signal light, or (j) selecting a respective channel of the WDM signal light for signal enhancement.

1. Field of the Invention
The present invention relates to an optical communication system using wavelength division multiplexed signal light to transmit a relatively large amount of data over an optical fiber. More particularly, the present invention relates to an optical communication system which determines the spectrum of wavelength division multiplexed signal light and controls an optical characteristic of the wavelength division multiplexed signal light or a parameter of the optical communication system in accordance with the spectrum.
2. Description of the Related Art
Multimedia networks continue to require larger capacity optical communication systems. Therefore, a significant amount of research is being performed in the area of wavelength-division multiplexing (WDM) to increase the capacity of optical communication systems.
FIG. 1 is a diagram illustrating a multiplexing portion of a conventional WDM optical communication system. Referring now to FIG. 1, a plurality of channels, CH.sub.1. . . CH.sub.N, are combined by an optical multiplexer 100 into a wavelength division multiplexed (WDM) signal light 102. An erbium doped fiber amplifier (EDFA) 104 has a wide gain band and is therefore used to amplify WDM signal light 102. An optical communication system as illustrated in FIG. 1 can be described, generally, as a transmission line medium network.
A path network, generally, is a network of various services and transmission line medium networks connected together. The individual transmission line medium networks are essentially "invisible" to individual users. Path networks typically perform functions such as multiplexing, cross-connect processing and branching/inserting. These functions usually require very high-speed signal processing. Unfortunately, a path network can easily reach an upper limit on allowable high-speed signal processing by the network. Wavelength division multiplexing may be useful to increase the high-speed signal processing of such path networks. Therefore, proposals have been set forth to increase signal processing in a path network by using wavelength division multiplexing. See, for example, K. Sato, et al, "Network Performance and . . . " IEEE, JACSC, vol. 12, No. 1, p. 159.
Moreover, an optical wave network using wavelength division multiplexing is proposed in H. Ishida, "A Transport Network with . . . ", GLOBCOM'93). Such an optical wave network is expected to improve high-speed processing, flexibility, and simplification of a network.
To realize wavelength division multiplexing in future optical wave networks, it will likely be necessary to monitor various characteristics of the WDM signal light, and to perform various control based on the monitored characteristics. For example, it may be necessary to monitor (a) the number of transmission wavelengths in the WDM signal light, (b) the spacing between wavelengths of the WDM signal light, (c) an absolute value of optical power in each channel or variations in optical power between channels in the WDM signal light, (c) a signal-to-noise ratio (SNR) in each channel in the WDM signal light, (e) a modulation factor (modulation index) in each channel or a prechirp (phase modulation component additionally superimposed in modulating a signal) in each channel of the WDM signal light, and (f) a change in spectrum of the WDM signal light due to nonlinear effect of a transmission line.
A commercially available optical spectrum analyzer can be used to monitor characteristics of WDM signal light. For example, see M. Born and E. Wolf, "Principles of Optics", 4th ed., p. 412, and "Hewlett-Packard Lightwave Test and Measurement Catalog", 1994, p. 48. In a typical optical spectrum analyzer, light is dispersed by a diffraction grating, and a light component having a specific wavelength of the dispersed light is passed through a slit. The light component passing through the slit is received by a photodetector to measure the power of the light component. A different light component having a different wavelength is obtained by rotating the diffraction grating. Accordingly, rotation of the diffraction grating and measurement of optical power are synchronously performed to allow measurement of a wavelength distribution (optical spectrum) of optical power.
However, this type of optical spectrum analyzer has a mechanical movable part for rotating or moving the diffraction grating. As a result, this type of optical spectrum analyzer lacks long-term stability and reliability. Further, this type of optical spectrum analyzer requires a time period of approximately one second for measurement of an optical spectrum, and therefore cannot provide fast enough response for many types of monitoring and control functions. Therefore, this type of optical spectrum analyzer will not allow for appropriate characteristics of WDM signal light to be monitored and controlled.
A scanning Fabry-Perot interferometer can also be used to monitor WDM signal light. See, for example, A. Yariv, "Optical Electronics", 3rd Edition, p. 92-95. However, the interferometer has a reflecting mirror which must be moved to monitor WDM signal light. As a result, the interferometer lacks long-term stability and reliability. In addition, such a device will not provide a fast enough response to allow WDM signal light providing a high-speed data transmission to be appropriately monitored and controlled.
In view of the above, conventional devices are available to determine the spectrum of an optical signal. However, these devices will not allow various characteristics of a WDM signal light or parameters of the communication system to be controlled in accordance with the spectrum.

Optical communication system which determines the spectrum of a wavelength division multiplexed signal and performs various processes in accordance with the determined spectrum


Method and system for managing a buffers pool. The system may include a first processor coupled to a general memory having allocation ring and de-allocation ring portions; and a second processor to perform internal accounting of pointer(s) buffer(s). The second processor has an internal storage array logically divided into first and second storage spaces. The second processor releases temporarily un-required buffer(s) pointer(s) to the first storage space, or to the second storage space if the first storage space is full. The second processor utilizes allocated buffer(s) pointer(s) accumulated in the first storage space. The second processor is to cause a DMA engine to move a bulk of two or more buffer(s) pointer(s) from the allocation ring to the first storage space, and to move a bulk of two or more buffer(s) pointer(s) from the second storage space to the de-allocation ring.

Memory units, or elements, in which data and execution code words are stored, have long been playing a major role in computer systems. This is even more so with the ongoing increase in the number of information to be processed and the growth in the amount of, and the rate at which, data is exchanged between computer systems. A typical computer application involves insertion and retrieval of data into/from a memory of a computer. Since, in many cases, computers are required to process data at very high speeds, fast and efficient insertions/retrievals of data to/from memories are a must.
Typically, a computer system has a memory unit with fixed size, and managing the content of the memory is relatively easy if the computer system is based on a single processor, or controller. However, in many cases, computer systems include two or more processors, generally referred to as "multi processor environment", for enabling them to process, or handle, several tasks simultaneously. For example, one processor of a computer system may handle tasks relating to a display screen, whereas a second processor may handle tasks relating to multimedia data. A third processor may handle communications between the computer system and another computer system, and so on. Managing a physical memory that is shared by several processors is harder than managing a memory that is used by a single processor, because each processor has its own memory requirements. That is, each processor has to be able to store and fetch data from the shared physical memory without being interfered by, or interfering with, normal operation of other processors. A memory sharing methodology has to be applied in order to enable fast and efficient usage of a memory in a multi-processor environment.
A popular memory sharing methodology involves using a number of independent memory buffer pools while allocating the available memory space of a computer system among the memory buffer pools. Memory buffer pools may then be allocated to each processor according to its memory requirements. If a processor no longer needs (for a certain amount of time) a buffer pool allocated to it, the buffer pool may be de-allocated from it for the sake of another processor that might need it. The process of, and the considerations (or policy used) for, allocating and de-allocating memory buffer pools is generally termed "management of buffer pools". De-allocating a memory buffer pool is also termed "freeing a memory buffer pool".
The way memory buffer pools are managed greatly influences the performance of the computer system. In general, when adopting a particular memory buffers pools managing methodology, one has to factor in workload and system properties that may vary over time. Another major factor is response time, which is the time required, for example, for allocating (for or during a task being processed) a single buffer from the buffer pool or to release a buffer back to the free buffer pool. More about memory buffers pools may be found, for example, in "Autonomic Buffer Pool Configuration in PostgresSQL" by Wendy Powley et al. (School of Computing, Queen's University, Kingston, ON, Canada).
U.S. Pat. No. 6,931,497, by Clayton et al. (Aug. 16, 2005), discloses shared memory management utilizing a free list of buffers indices. U.S. Pat. No. 6,931,497 teaches "receiving a first buffer allocation command from a first processor, the allocation command including a register address associated with a pool of buffers in a shared memory, determining whether a buffer is available in the buffer pool based upon a buffer index corresponding to a free buffer, and if a buffer is determined available allocating the buffer to the first processor". The solution disclosed by U.S. Pat. No. 6,931,497 includes using a cenfralized hardware implementation of a buffer manager, and a dedicated memory is used for the buffer pools management, which resides within the buffer manager.
U.S. Pat. No. 5,432,908, by Heddes et al. (Jul. 11, 1995), discloses high speed buffer management of share memory using linked lists and plural buffer managers for processing multiple requests concurrently. U.S. Pat. No. 5,432,908 teaches a buffer control memory having as many sections for buffer-control records as buffers which is employed together with a buffer manager, which is problematic because this solution necessitates a dedicated memory and buffer manager.
In a typical computer system, the processor(s) accesses the physical memory by using a direct memory access ("DMA") engine. In general, whenever a processor needs to read (fetch) or to write (store) data from/to the physical memory, the processor forwards to the DMA engine a corresponding DMA-read or DMA-write request, whichever the case may be. If a processor issues a DMA-read request, the DMA seeks the requested data in the memory and fetches a copy thereof to the requesting processor. Likewise, if a processor issues a DMA-write request, the DMA seeks a free space in the memory and stores the data in the free space. However, using a DMA engine is costly in terms of processing time because a DMA request typically consumes several clock cycles. Therefore, an aspect of "good" management of memory buffer pools is associated with reducing the number of DMA requests that are issued by the processor(s).

Method for managing buffers pool and a system using the method


A control mode changing over method for a servo control system, which is capable of reducing a shock occurring in changing over a control mode from a torque control mode to a position/velocity control mode. In the torque control mode, a value of an integrator in a velocity loop for the position/velocity control mode is rewritten into a torque command value for torque control so that the value of the integrator is always set to the same value as the torque command. When a control mode is changed over from the torque control mode to the position/velocity control mode, a torque command value for a servo motor is obtained based on the value of the integrator rewritten in the torque control mode. Thus, a continuous torque command value is given to the servo motor in changing over the control mode.

In controlling a servo motor for driving a feed shaft of a machine tool, an arm of a robot, etc., there are a case where the servo motor is controlled in a position/velocity control mode for controlling a position and a velocity, and a case where the servo motor is controlled in a torque control mode for controlling a force. The torque control mode is for making a servo motor output a torque commanded by a controller to provide an object driven by the servo motor with a force according to the command. The torque control mode is adopted in carrying out an operation for giving a constant tension to an object, an operation for pressing an object and an operation for fitting an object having indefinite profile, for example.
The position/velocity control mode and the torque control mode are often used in combination. For example, these modes are combined in a manner such that an object driven by the servo motor is moved to a specified position in the position control mode, the torque is controlled at the specified position in the torque control mode, and the object is moved again in the position control mode.
In the case where the servo motor is controlled by the combination of the position/velocity control mode and the torque control mode, the control mode is changed over between the above two control modes. When the control mode is changed in moving the movable part of the machine driven by the servo motor, a shock occurs inevitably. Thus, the changing over of the control mode is usually carried out when the movable part is stopped. In the above conventional change-over method, however, when a control mode is changed over from the torque control mode to the position/velocity control mode, an object of control may receive a shock due to discontinuity of a torque command value.
FIG. 6 shows a conventional servo control system for controlling a servo motor by changing over the control mode. In FIG. 6, the servo motor is controlled based on either a torque command Tcmd1 or a position command from a CNC. When controlling the servo motor based on the torque command Tcmdl from the CNC, a switch 5 is changed over to a torque command side to set the torque command Tcmd1 as a torque command Tcmd to the servo motor. When controlling the servo motor based on a position command, the position command is processed by a position control loop 6 and a velocity control loop 7 to obtain a torque command Tcmd2, and the switch 5 is changed over to a position command side to set the torque command Tcmd2 as a torque command Tcmd to the servo motor.
In the above conventional servo motor control, when the control mode is changed over from the torque control mode to the position/velocity control mode, a value of the torque command Tcmd for the servo motor differs before and after the changing over, to cause the discontinuity of the value of the torque command Tcmd so that a shock may be applied to the object of control.
Conventionally, the shock in the changing over may be allowed or there has been taken a measure for reducing the shock by carrying out servo control in the position/velocity control mode after setting a torque command in the torque control mode to "0" in changing over the control mode. This method, however, could not sufficiently eliminate the shock in changing over the control mode.

Control mode changing over method for servo control system


An inspection apparatus for a sheet includes: white LED illuminators which irradiate a sheet of paper with light containing visible light: IR-LED illuminators which irradiate the sheet of paper with light containing infrared rays: two visible color cameras; one IR monochrome camera: an IR filter which eliminates the visible light in the light emitted from the white LED illuminators and the IR-LED illuminators and reflected off the sheet of paper, and makes only the infrared rays incident on the IR monochrome camera; and a control device which determines appropriateness of a pattern portion on the sheet of paper on the basis of the visible light made incident on the visible color cameras, and determines appropriateness of pattern portions on the sheet of paper on the basis of the infrared rays made incident on the IR monochrome camera.

A conventional inspection apparatus of this type is disclosed in Patent Literature 1.
The inspection apparatus of Patent Literature 1 includes: a sheet holding device provided on an endless conveyor and configured to hold an end portion of a sheet; an arc-shaped track portion provided in part of a movement track of the sheet holding device in such a manner as to be directed inward of a loop formed by the movement track; multiple inspection apparatuses provided inside the loop of the arc-shaped track portion: and a guide member provided outside the loop of the arc-shaped track portion, in which the multiple inspection apparatuses inspect the sheet traveling along the arc-shaped track portion under the guidance of the guiding member.
In addition, the inspection apparatuses include: multiple imaging means such as CCD-line cameras; and multiple light sources such as LED illuminators and the like paired with the CCD-line cameras, as well as are radially arranged around the arc-shaped track portion.


Systems and methods for performing handover coordination between base stations are disclosed. In a first embodiment, a method is disclosed, comprising: receiving, at a base station, a first serving cell signal measurement and a first neighbor cell signal measurement from a particular user equipment (UE); sending an adjustment message, from the base station to the UE, containing a cell-specific offset of the serving cell and a cell-specific offset of the neighbor cell in a reporting threshold based on at least one handover adjustment factor received from a coordinating node; receiving, at the base station and subsequent to adjusting the cell-specific offsets, a second serving cell signal measurement and a second neighbor cell signal measurement; and deciding whether to trigger a handover event based on the first and the second serving cell signal measurement and the first and the second neighbor cell signal measurement and the cell-specific offsets.

Small cell base stations are base stations that have less transmit power and range than a macro base station, which typically provides approximately 40 watts of transmit power or more. Small cells are typically part of a heterogeneous network (HetNet). It is understood that the embodiments described below pertain to Long Term Evolution (LTE) networks and technologies, but not to the exclusion of 3G, UMTS and/or other networks and technologies.


A coupling arrangement for a system for endotracheal ventilation of a patient is disclosed. The system includes an endotracheal tube and a manifold configured for allowing ventilation of the patient via the endotracheal tube, which manifold has a first coupling element with an axial extent and with engagement element; and which endotracheal tube has a second coupling element with an axial extent and with engagement element; wherein the coupling arrangement is configured to produce, when the first and the second coupling elements are moved together in the axial direction, a locking engagement between the engagement elements.

It is commonly known to configure the end of an endotracheal tube with a conically tapering male coupling means that is introduced into a complementarily configured female coupling means on the manifold for establishing a sealing frictional connection. In order to separate the parts from each other it is necessary to produce an axial separation force. This force is typically produced by means of a disengagement means in the form of a wedge-shaped manifold or fork that is wedged between two protruding flanges located at the end of the female and the male coupling means, respectively.
However, it has been found that by use of said manifold in practice, it is difficult for the hospital staff to avoid laterally oriented power influences on the coupling means and thus on the endotracheal tube that has been inserted into the patient with ensuing traumatic consequences for the patient. Besides, the prior art solutions involve a risk that the manifold disappears. In given situations, the latter has entailed that the hospital staff have attempted to separate the coupling means manually, which has, to an even wider extent, traumatically influenced the patient due to laterally oriented power influences.


A sealed pouch constructed of thermally conductive flexible material containing a low melting point, thermally conductive material is placed between two components that require thermal continuity. This assembly is then loaded in compression and heated to the melting point of the low melting point, thermally conductive material, which then melts within the sealed pouch, and conforms to the shape of the two components. The sealed pouch also may contain a springy material made of a metal, or a solder compatible plastic or organic to help maintain shape of the pouch in some applications.

Modem electronics have benefited from the ability to fabricate devices on a smaller and smaller scale. As the ability to shrink devices has improved, so has their performance. Unfortunately, this improvement in performance is accompanied by an increase in power as well as power density in devices. In order to maintain the reliability of these devices, the industry must find new methods to remove this heat efficiently.
By definition, heat sinking means that one attaches a cooling device to a heat-generating component and thereby removes the heat to some cooling medium, such as air or water. Unfortunately, one of the major problems in joining two devices to transfer heat is that a thermal interface is created at the junction. This thermal interface is characterized by a thermal contact impedance. Thermal contact impedance is a function of contact pressure and the absence or presence of material filling small gaps or surface variations in the interface.
The heat-sinking problem is particularly difficult in devices such as multi-chip modules ("MCMs") where multiple components need to have topside cooling into a single cold plate or heat sink. The various components within the multi-chip module may not be of equal thickness, creating a non-coplanar surface that often must be contacted to a single planar surface of the cold plate or heat sink. Engineers have developed a variety of approaches to solving the non-coplanar surface problem, such as, gap fillers comprising thick thermal pads capable of absorbing 10 to 20 mils of stack up differences. However, the thickness and composition of these thermal pads often results in a relatively high thermal resistance making them suitable only for low power devices. Others have used pistons with springs attached to them attached to a plurality of small cold plates or heat sinks to account for the irregularity of the stack up. However, this can become an expensive solution to the problem. Still others have used an array of small cold plates connected together by flexible tubing allowing some flexibility between the plates to account for the variations in height of the components. However, once again, this solution may become too expensive for many products.
Other solutions include the use of thermal grease or phase change materials, such as paraffin, to fill in small gaps, such as the microscopic roughness between two surfaces. However, thermal grease and phase change materials are unable to fill larger gaps such as those present in multi-chip modules.

Hewlett-Packard Development Company, L.P.


A digital assay for a micro RNA (miRNA) or other target analyte in a sample makes use of nanoparticles that absorb light at the resonant wavelength of a photonic crystal (PC). Such nanoparticles locally quench the resonant reflection of light from the PC when present on the surface of the PC. The nanoparticles are functionalized to specifically bind to the target analyte, and the PC surface is functionalized to specifically bind to the nanoparticles that have bound to the target analyte. The sample is exposed to the functionalized nanoparticles, and the individual nanoparticles bound to the PC surface can be identified and counted based on reduced intensity values in the reflected light from the PC. The number of bound nanoparticles that are counted in this way can be correlated to the abundance of the target analyte in the sample.

Traditionally, drug development and cancer therapeutic selection has targeted patient and tumor histology characteristics for potential drug testing for efficacy. However over the last decade, a paradigm shift in this practice has taken place because of the tremendous progress achieved in detection instrumentation and molecular techniques allowing the identification of aberrant genes and/or pathways that drive tumor biology and patient response to treatments. This has led to the incorporation of molecular pathology-driven tumor profiling and diagnostics into clinical practice. Subtyping the genetic heterogeneity of tumors that is undecipherable with histology alone has provided knowledge of novel molecular targets that are currently being exploited for therapeutic gain, prognosis, and prediction of therapeutic responses to specific treatments.
Recent therapeutic advances in treating prostate cancer have resulted in significant improvements by enhancing the quality of life and longevity. Advanced metastatic prostate cancer is initially hormone sensitive, and is treated with androgen deprivation therapy (ADT) that controls progression, but which is not a cure. Patients inevitably progress with a median time period of 20 months to the metastatic castrate resistant prostate cancer (mCRPC) stage. Since 2010, the FDA has approved six novel treatments to control mCRPC, of which Abiraterone Acetate (AA) is one of the first drugs to use after ADT failure. It is a selective steroidal irreversible inhibitor of CYP17 (17 hydroxylase/C17,20-lyase) which blocks two important enzymatic activities in the synthesis of testosterone. This results in depleted androgen levels in the cancer tissue and clinically translates (in both pre- and post-docetaxel chemotherapy mCRPC stage) to durable control of cancer progression. In the pre-chemotherapy setting, 62% patients have a PSA decrease, with 30-40% patients having an objective response. Similarly the five other approved therapies in this stage have also demonstrated the ability to slow disease progression, but only for some patients for different durations of time. These advances, while rewarding, have led to the challenge of deciding how to choose from the therapeutic menu of options for treating individual patients, as there are no predictive factors for any of these treatments.
There is a major current interest in replacing this age-old clinical paradigm of approaches based upon clinical estimates with a gene-based treatment paradigm by harnessing the ability to identify aberrations in the cancer genome. The coupling of genomic markers with therapeutic advances is increasingly relevant as cancer medicines target stage-specific genetic abnormalities. The promise of "precision medicine" which seeks to match personalized medicine to personalized genomes may soon be realized due to the rapid advances in next-generation sequencing, which can rapidly decipher the mutational landscapes of cancers. It may be further possible to characterize of the genomic landscape of the primary tumor, in metastases, and in blood. Detection in blood, especially if a sample can be noninvasively gathered in the form of a droplet from a finger stick, represents a compelling advance for diagnostic technology, as it avoids performing invasive biopsies.
The term "liquid biopsy" describes the screening of genomic abnormalities attributable to circulating molecules that are shed by cancer cells in the blood of cancer patients from a blood draw or in a drop of blood. For example, in advanced prostate cancer, patients who have developed castrate resistance correlate with the presence of microRNAs (miRNA) miR-375 and miR-1290 in their plasma. See X. Huang et al., "Exosomal miR-1290 and miR-375 as Prognostic Markers in Castration-resistant Prostate Cancer," European Urology, pp. 33-41, 2015. These miRNAs are small (˜22 nt) regulatory RNA molecules whose function is to modulate the activity of specific mRNA targets that play important roles in a wide range of pathologies, particularly in cancer. More generally, miRNAs are a powerful class of blood-based biomarkers for cancer detection because their expression is frequently dysregulated in cancer, their expression patterns are tissue specific, and they are stable in plasma or serum through encapsulation by exosomes. Due to the increased use of genome sequencing tools to identify new miRNA biomarkers and related efforts to validate them, specific miRNA sequences can be identified that are expressed by cancer cells at moderate or high levels, but are present at very low (or undetectable) levels in healthy individuals, and different types of tumors have distinct miRNA profiles. As a result, detection of miRNAs is now considered to be useful for early diagnosis, staging, and monitoring of cancer.
Reverse transcriptase quantitative PCR (RT-qPCR) and microarrays have been developed for detection of miRNAs. However, because the short length of miRNAs makes it difficult to design primers, these methods suffer from error-prone amplification, cross hybridization, and a lack of valid internal controls that hinder their sensitivity and specificity. These techniques involve highly complex assay protocols, chemical or enzymatic amplification, and expensive detection instruments that make them suitable only for laboratory-based usage at low throughput. Although various approaches have been applied toward miRNA detection, most approaches require chemical or enzymatic amplification of the target, and large expensive instruments. Thus, there is a need to provide techniques for detection of miRNAs that are more efficient, more reliable, less expensive, and suitable for more widespread application.

Photonic resonator absorption microscopy (PRAM) for digital resolution biomolecular diagnostics

The Board of Trustees of the University of Illinois


A contactless data storage medium having a principal circuit component and a coupling element, with a controllable load provided for performing offloading modulation. A drawn-current controller is able to reduce the current drawn by the principal circuit component and simultaneously increase the size of the current through the load in order to provide an offloading potential for performing the offloading modulation.

To send data from a contactless data storage medium to a read/write unit, it is known practice to vary the power drawn by the contactless data storage medium from the electromagnetic field generated by the read/write unit. The change in power drawn can be detected by the read/write unit and in this way data transmitted by means of appropriate modulation and demodulation can be detected. A currently applicable standard for such contactless data storage media or chip cards is ISO 14443 or ISO 15693. The known data storage media operate using resistive or capacitive loading modulation. For modulation purposes, the size of the load connected in parallel with the principal circuit component is thus increased, so that the power drawn by the contactless data storage medium power increases.
A problem with loading modulation is that the loading for modulation purposes also lowers the voltage which is available for supplying the principal circuit component. This can result in operating faults, for example as a result of an undervoltage detector circuit responding or else the clock detection circuit, which evaluates a clock signal transmitted using the electromagnetic field from the read/write unit, failing. Although it is possible to keep down the power level change, that is to say the level of load connection, a minimum modulation amplitude is required in order for the read/write unit to be able to detect the modulation. Overall, the loading modulation results in unwanted range limitation. Under these constraints, the load resistors are normally dimensioned with a compromise.
In addition, nonlinear modulation is also known, where the depth of modulation decreases before the supply voltage reaches the lower permissible voltage threshold. In the case of this form of a contactless data storage medium too, however, the modulation signal becomes weaker, which means that the likelihood of erroneous data transmission increases.
To get around these problems, it is known practice to provide offloading modulation instead of loading modulation. A contactless data storage medium operating on the basis of such a method is known from EP 1 042 731 B1, for example. The circuit shown in this document is provided with a shunt transistor which can be connected and disconnected. In this case, the power level change is dependent on the power dissipated in the shunt. In a normal operating state, when no data are intended to be sent, the shunt is connected and increases the current drawn by the contactless data storage medium. For modulation purposes, the shunt is disconnected, which results in a reduction in the drawn current, which in turn can be detected by the read/write unit. In the read/write unit, the contactless data storage medium's modulation signals are AC coupled, so that just the spectral amplitude of the modulation sidebands is taken into account. It therefore does not matter whether loading or offloading modulation takes place, which means that contactless data storage media operating on the basis of the principle of offloading modulation are also compatible with the existing read/write units. If the shunt has been disconnected in order to obtain the greatest possible range for the read mode, the shunt is not active and therefore also cannot be offloaded. It is therefore no longer possible to send data. In addition, the load connected in the normal operating state results in unwanted range limitation.

Contactless data storage medium and method for operating contactless data storage medium


An RFID tag (20) has an electrically non-conductive substrate (22) with a mounting surface (24), an electrically conductive member (26), a conductive bridge (28), a dielectric strip (30), and a semiconductor device (32). The member (26) is mounted to the surface (24) and has an inner section (38), an outer section (40) and a connecting section (42). The section (38) has windings (44) and a free end (46) extending from one of the windings. The section (40) substantially surrounds the section (38) and has a winding (50) and a free end (52) that extends from a portion (54) of the winding (50) towards the section (38). A segment (56) of the section (42) is disposed between the ends (46, 52). The bridge (28) spans from the end (46) to the end (52). With the strip (30) disposed between the bridge (28) and the member (26), capacitive sections are thereby formed along the strip (30).

In a radio frequency identification (RFID) system, RFID transponders or tags are usually mounted onto objects to provide information upon receiving interrogating signals transmitted by a transceiver. In the art, such a transceiver is referred to as a reader. Information provided by an RFID tag upon activation by an interrogating signal can include status, location, or presence of an object to which the RFID tag is mounted. Typically, such information is provided either with data extracted from a semiconductor device of the RFID tag or when the RFID tag interacts with an RF signal to generate a response signal back to the reader.
An RFID system has many different applications. For example, one common application of an RFID system is in electronic article surveillance (EAS) to detect movement of items within surveilled area. Typically, in such an RFID system, an active RFID tag attached to an item is deactivated when movement is authorized. Otherwise, if the active RFID tag is not deactivated, then an alert signal is generated by the RFID system when the item with an active RF tag is conveyed into an area where interrogating signals are present.
Interrogating signals transmitted to an RFID tag are received via an antenna. Such an antenna typically forms part of a resonant circuit of the RFID tag. Generally, the resonant circuit is tuned to a resonant frequency corresponding to the frequency of the interrogating signals. FIG. 1 illustrates a prior art RFID tag 10 having a substrate 12 with a semiconductor device 14 that is coupled to coil windings 16.
A problem with existing RFID tags is that objects with electromagnetic properties adversely affect resonant frequencies of these existing RFID tags. One technique of overcoming this problem is described in U.S. Pat. No. 5,276,431 Piccoli et al. in which a security tag has a resonant circuit that compensates for inherent capacitance of an article to thereby shift a resonant frequency of the resonant circuit closer to the center frequency of a detection frequency range. However, the resonant circuit described in U.S. Pat. No. 5,276,431 Piccoli et al. provides for a predetermined detection frequency range and, therefore, is not optimized for accurate detection of a specific detection frequency.
Another prior art RFID tag is described by U.S. Pat. No. 5,541,399 de Vail in which an RF transponder is fabricated on a single side of a substrate and has a lead line that yields capacitances in crossing over windings of an antenna for the RF transponder. Although this technique reduces cost of the RFID transponder that is easier to attach to many different types of packages, the total capacitance provided at crossover sites along the lead line is limited because of the width of the antenna windings. Hence, a discrete capacitor may still be needed to increase the total capacitance to attain a desired antenna resonant frequency.
Although the above existing RFID tags overcome various problems, there is still a need for a more effective RFID tag that is easier to manufacture and has a wider capacitive range without having to use discrete capacitors. Also, metallic portions of some objects or products are known to interfere RF or electromagnetic fields and this reduces effective range of RFID tags mounted to such objects. For example, metallic portions in compact discs and the like are known to disrupt RF or electromagnetic fields around RFID tags attached to the compact discs.
Furthermore, RF or electromagnetic fields of an RFID tag are typically weakened when the RFID tag is mounted to a metallic product such a compact discs and the like and housed within a carrier. In this situation, the RFID tag is less effective and this adversely affects sensing range of a reader that interrogates the RFID tag.
Therefore, what is needed is RFID tag that overcomes poor RF or electromagnetic fields when mounted to an object having metallic portions. What is also needed is a tag coupler for an RFID tag mounted to a metallic product to thereby improve detecting range of a reader that interrogates the RFID tag when the product is housed within a product carrier.

RFID tag for an object having metallic portions, tag coupler and method thereof


A thermal-mechanical testing apparatus for use with an electrically conductive specimen testing system. In one embodiment, the apparatus includes a first compression anvil assembly, a mounting frame coupled to the first compression anvil assembly, and a second compression anvil assembly positioned opposite the first compression anvil assembly and the mounting frame. The first compression anvil assembly includes a mounting plate, a first compression anvil coupled to the mounting plate, and a heating current ground system coupled to the mounting plate. The mounting frame includes a set of conductive end plates, a set of insulating connectors connecting the conductive end plates, and a plurality of mounting components coupled to the insulating connectors. The mounting components are also coupled to the mounting plate. The second compression anvil assembly includes a conductive mounting plate, a second compression anvil coupled to the conductive mounting plate, and a heating current by-pass system coupled to the conductive mounting plate and one of the conductive end plates.

1. Technical Field
The disclosure is related generally to electrical conductive specimen testing systems. More particularly, the disclosure is related to a thermal-mechanical testing apparatus for electrically conductive specimen testing systems, and a method for using the thermal-mechanical testing apparatus.
2. Related Art
Physical simulation of material processing involves the reproduction of the thermal and/or mechanical processes in the laboratory that the material is subjected to during an actual fabrication process or actual end use process. During the physical simulation, a sample of the actual material is used in a material testing machine or system capable of subjecting the sample material to the same thermal and/or mechanical processes that the material may undergo during a fabrication process or actual end use process. That is, the material testing machine or system simulates the material following the same thermal and/or mechanical profile that it would in the full scale fabrication process or end use process of the material. Typically, a sample of a material is heated and mechanically worked while various performance parameters of interest are measured and recorded by the material testing machine or system for later analysis. After the simulation is complete, the microstructure of the material may also be examined in order to verify that the material meets expected results and/or to understand the properties of the material produced during the physical simulation.
Depending on the capability of the material testing machine or system performing the simulation, the results can be extremely useful. These simulations have a variety of applications across the materials industry, including, Development of new processes, process improvements, and the discovery and implementation of new materials. When the physical simulation is accurate, the results can be readily transferred from the laboratory to the full size production process.
Two conventional fabrication processes simulated by material testing machines or systems are multi-stand rolling mills and multi-hit forging processes. These two simulated fabrication processes involve multiple-hit, high-speed deformation of the material during fabrication. The material testing machine or system used to simulate a multi-stand rolling mill and/or multi-hit forging typically includes two oppositely facing anvils capable of providing a compression force on a sample material positioned between the anvils. More specifically, the anvils of the testing machine or system are coupled to one or more hydraulic systems configured to allow the anvils to strike the sample material with a desired compression force and desired rate of deformation. Additionally, to properly simulate the multi-stand roll milling and/or multi-hit forging process, the material testing machine or system also provides a system for heating the sample material. More specifically, the sample material is heated during the simulation, to replicate the heating of the material during fabrication (e.g., multi-stand roll milling, multi-hit forging). The heating systems used in the simulation are typically a sub-system within material testing machine or system, or may be an independent system. These conventional heating systems typically heat only a small area (e.g., striking/compression area) of the sample material during simulation due to spatial constraints within the material testing machine or system and the need to rapidly heat and cool the material to replicate the process under study. That is, because of the limited testing space and need to heat and cool rapidly only a small area of the sample material can be heated without interfering with the simulation. In order to achieve accurate results during the simulation, it is imperative that the anvils strike or compress the heated area of the sample material.

Thermal-mechanical testing apparatus for electrically conductive specimen testing systems and method for use thereof


The present invention discloses an easy-to-assemble one-piece surround speaker structure, wherein a plurality of integrable speaker housings realizes a size-adjustable audio structure, and whereby an user can self-adjust the length of a surround speaker in accordance to the size of television or available space The speaker housings can contain various types of speakers, including: a main speaker, a center speaker, a surround speaker, a subwoofer speaker, etc. Thereby, an user can organize speakers to achieve the audio effect he desires. Each speaker has a plurality of I/O terminals for mutual signal and power connection. Thus, no matter what type of speaker combination is arranged or what number of speaker housings is integrated, the present invention can perform perfectly.

1. Field of the Invention
The present invention relates to an easy-to-assemble one-piece surround speaker structure, particularly to a one-piece surround speaker structure, wherein an user can optionally arrange different numbers of speakers to build different-size audio systems.
2. Description of the Related Art
With the rising demand of standard of audio and video entertainment, more people want to possess a home theater—a miniature edition of a professional theater system, wherein the video display is upgraded, and it would be even better if there is a surround speaker system to go along with. Thus, surround speaker systems imitating a theater audio effect are persistently developed to satisfy these people's needs. The surround speaker systems currently sold in markets are usually of multi-part type. Thus, users have to arrange different audio units around their room to achieve a surround effect. Such a type of surround speaker system not only occupies considerable space but also troubles the user with the problem of cable connection. Each speaker needs individually wiring, which makes the installation of a surround speaker system expensive.
Recently, some technologies for one-piece surround speaker systems have been proposed, wherein the sound bounced from walls is used to realize the audio effect of the traditional multi-part surround speaker systems. However, the audio effect of the bounced sound varies with the dimensions of users' house. Besides, users cannot arrange speakers as they wishes because all speakers have been integrated into a single and fixed body. In addition, when an single speaker or the control unit of the surrounded speaker system fails, the entire audio system, including normal speakers, has to be carried to a maintenance center for repair, which brings many inconveniences to users.
In order to solve the abovementioned problems, the present invention proposes an easy-to-assemble surround speaker structure, wherein a design of assembly housings is used to assemble different types of speakers and control devices, and whereby an user can arrange various combinations of speakers to achieve audio effects he desires, and whereby the maintenance and repair of a surround speaker system is simplified which reduces the cost of maintenance and repair.

Easy-to-assemble one-piece surround speaker structure


An embodiment of the invention includes a device for collecting body tissue. The device includes an inner end effector comprising a hollow portion, a distal edge that defines an opening of the hollow portion at least a portion of which is sufficiently sharpened to cut body tissue, and a proximal end configured to receive an inner tubular member. The device also includes an outer end effector comprising a flexible extension on a distal end with an edge at least a portion of which is sufficiently sharpened to cut body tissue and biased inwardly toward the hollow portion of the inner end effector to cover the opening, and a proximal end configured to receive an outer tubular member. The inner end effector is slidably disposed within the outer end effector.

1. Field of the Invention
The present invention relates to surgical instruments and, particularly, to an instrument for biopsy sampling of tissue. Still more particularly, the present invention relates to an endoscopic biopsy instrument that obtains core biopsy samples and integrates two or more biopsy-sampling modalities.
2. Background of Related Art
Biopsy is the removal and study of body tissue for medical diagnosis. Typically, physicians obtain biopsy samples in order to detect abnormalities such as cancer and determine the extent to which cancerous tissue has spread. They use various biopsy instruments to acquire tissue samples from different areas of the body. Many current biopsy instruments, however, cannot retrieve full core samples of tissue, do not provide versatility in sampling methods, or are overly intricate in design and manufacture.
During a biopsy tissue-sample procedure performed on a body lumen, a physician generally uses an endoscope to provide a passageway for entry of the biopsy instrument into the body. Having thus secured access to the biopsy site, the physician uses some device to extract a tissue sample from the wall of the target body lumen. Usually, the walls of body lumen, such as the esophagus, the gastrointestinal tract, or the urinary tract, have three layers: the surface mucosal or epithelial layer comprised of mucus; the submucosal layer, which is below the mucosal layer; and the muscle layer. Many current biopsy devices can only take tissue from the surface mucosal layer and also cannot retrieve full core samples.
In many situations, physicians may desire full core samples because, with larger cross-sections sections of tissue types, they can more accurately determine the extent to which cancer has spread. It is also desirable to obtain full, clean core samples that have not been crushed by devices penetrating into tissue. Moreover, it may be desirable to obtain a full core sample without having to penetrate past a desired depth of tissue in order to obtain a corresponding desired depth of core sample. It would be preferable to insert a biopsy needle only as far as necessary to obtain a full core sample to minimize trauma to the patient.
Further, many current devices lack versatility. Many devices today extract tissue samples through aspiration, brush cytology, or pinch biopsy. In the case of aspiration, a physician inserts a very fine needle into the wall of the target tissue and draws fluid, typically saline, through the needle. The physician thus collects some surface tissue cells. In the case of brush cytology, a physician introduces a brush through the lumen of the endoscope to collect tissue cells by scraping the surface of the target site. In the case of pinch biopsy, a physician inserts a bioptome, having a pair of opposed jaw cups, through the lumen of the endoscope, to the tissue site. The physician may then close the jaws around the target surface and pinch away a sample from the surrounding tissue.
Typically, current devices may employ only one of these methods to obtain tissue samples. Thus, a physician who desires tissue samples obtained through both aspiration and brush cytology, for example, must insert one instrument, take a sample, retrieve the instrument, insert a second instrument, take a second sample, and then retrieve the second instrument. Such practice is time consuming and leads to procedural inefficiency.
Many current instruments also have an overly complex design. Devices that might otherwise fulfill one of the aforementioned needs, such as the need to capture core samples, for example, often employ complex cutting mechanisms held in sheaths or housings requiring very exact tolerances.
In light of the foregoing, there exists a need for a biopsy tissue-sampling device that effectively obtains a full core tissue sample, accommodates multiple sampling modes, and is simple in design and inexpensive to manufacture.

This patent is subject to a terminal disclaimer.

Endoscopic submucosal core biopsy device


A composition with a polypeptide including amino acid sequence LKKTET or a conservative variant thereof, the composition further including a carrier for application to a surface of a body.

Field of the Invention
The present invention relates to the field of LKKTET [SEQ ID NO:1] and/or LKKTNT [SEQ ID NO:2] compositions and methods.
Description of the Background Art
Thymosin beta 4 initially was identified as a protein that is up-regulated during endothelial cell migration and differentiation in vitro. Thymosin beta 4 was originally isolated from the thymus and is a 43 amino acid, 4.9 kDa ubiquitous polypeptide identified in a variety of tissues. Several roles have been ascribed to this protein including a role in a endothelial cell differentiation and migration, T cell differentiation, actin sequestration, vascularization and wound healing.
Many Tβ4 isoforms have been identified and have about 70%, or about 75%, or about 80% or more homology to the known amino add sequence of Tβ4. Such isoforms include, for example, Tβ4ala, Tβ9, Tβ10, Tβ11, Tβ12, Tβ13, Tβ14 and Tβ15. Similar to Tβ4, the Tβ10 and Tβ15 isoforms have been shown to sequester actin. Tβ4, Tβ10 and Tβ15, as well as these other isoforms share an amino acid sequence, LKKTET [SEQ ID NO:1] or LKKTNT [SEQ ID NO:2], that appears to be involved in mediating actin sequestration or binding. Although not wishing to be bound by any particular theory, the activity of peptide agents as described herein may be due, at least in part, to the anti-inflammatory activity of such agents. Tβ4 also can modulate actin polymerization (e.g. β-thymosins appear to depolymerize F-actin by sequestering free G-actin). Tβ4'S ability to modulate actin polymerization may be due to its ability to bind to or sequester actin via the LKKTET [SEQ ID NO:1] or LKKTNT [SEQ ID NO:2] sequence.
There remains a need in the art for LKKTET [SEQ ID NO:1] and/or LKKTNT [SEQ ID NO:2] compositions and methods.


A removable sunglass assembly to be attached to a conventional eyeglass assembly having lenses, a lens frame, and bow members extending aft from the frame. The preferred embodiment of the removable sunglass assembly includes a one-piece lens member having side support members with the lens member serving as the frame, side support members, and a top support member. The resiliency of the one-piece arcuate lens member provides a clamping force by which the removable sunglass assembly can be attached to the conventional eyeglass assembly. The side support members locate and attach the removable sunglass assembly to the bow members of the conventional eyeglass assembly while a top support member locates the removable sunglass assembly to the top of the conventional eyeglass assembly. Reliable securing elements are provided by resilience of the material used to construct the arcuate lens member and the high-friction, resilient, and anti-skid material used to construct the side support members. A second embodiment of the removable sunglass assembly provides a main top support member achieving the function of the arcuate lens member as noted above.

About 50% of the people in the U.S. require prescription eyewear. The vast majority of these people wear conventional eyeglasses and even the people who wear contact lenses will wear eyeglasses from time to time. For these people, the solutions for addressing their sunglasses needs are not satisfactory.
One solution is to wear photo-gray lenses in their glasses. This solution is reasonably good at providing an "all-in-one" solution. However, these lenses usually take a while to change plus they are not as stylish as most sunglasses, and can be very heavy as the lenses must be made of glass. Another possible solution is to maintain two pairs of glasses, one with regular lenses and one with tinted lenses. This solution is attractive and feasible if the individual can afford both pairs and wear the sunglasses for extended periods, thus avoiding frequent switching of glasses.
Yet another solution is to wear a pair of tinted goggles over the prescription glasses. These are functional, but awkward and not very stylish. The final alternative is the conventional clip-on which is generally flimsy and not very stylish, standing out obviously as clip-ons. The clip-ons are not very versatile with each type of clip-on fitting only a limited set of eyeglass frames. Even if a person is able to find a clip-on that fits, the attachment is likely to be unreliable and lost or damaged in a strenuous activity such as snow skiing.
As a consequence, it is the object of this invention to provide to those who wear conventional eyeglasses an improved removable sunglasses design that is 1) easily attached and detached to and from a large variety of eyeglass frames; 2) securely mounted with respect to the frames; 3) comparable to conventional sunglasses in fashion and attractiveness; 4) simple and economical to manufacture; and 5) designed for reliability with a minimum number of parts with no conventional clips, springs, screws, or moving parts.

Removable sunglass assembly for attachment to a conventional eyeglass assembly


Inspection wire is formed along at least a portion of the outer periphery of, and preferably along the entire perimeter of, a chip area enclosed by scribe areas, using an arbitrary wiring layer, conductive material, or diffusion layer of the semiconductor chip, and the opposite ends of the inspection wire are connected, via a wiring layer and contact plugs, to pads on the semiconductor chip, either directly or via prescribed switching means. By measuring the resistance of the inspection wire before and after dicing using the pads, chips and cracks occurring during dicing of the semiconductor chip, as well as chipping which progresses in subsequent packaging and assembly processes, or due to the application of stress, shocks, thermal cycles or similar after incorporation into products, can be detected.

1. Field of the Invention
This invention relates to a semiconductor wafer, semiconductor chip, and method of inspection of a semiconductor chip, and in particular relates to a semiconductor wafer, semiconductor chip, and method of inspection of a semiconductor chip which are suitable for sorting defective chips arising from chipping during wafer cutting.
2. Description of the Related Art
Semiconductor wafers generally comprise scribe areas provided at equal intervals vertically and horizontally, and chip areas surrounded by scribe areas; as shown in FIG. 12A, pads 102a are arranged in the edge portions of the chip area 102 to connected the circuitry formed within to the outside. After forming the desired circuitry in the chip area 102, a dicing system or similar is used to cut the semiconductor wafer along the scribe center lines 103a, to form semiconductor chips 101.
Here, the dicing system physically cuts the semiconductor wafer by moving a thin disc-shaped cutting edge (blade), rotating at high speed, along scribe center lines 103a; hence the cut face is not flat, but a minute roughness (chipping) occurs, as in FIG. 12B. Because of this, the cutting groove (kerf) is set such that the chipping remains within the scribe area 103; but if there is deviation from the dicing conditions or if the blade is degraded, the chipping may increase to reach the chip areas 2, as a result of which damage (chip 108) may occur in semiconductor chips 101, cracks 109 may occur, visible defects may result, wiring lines may be broken, and there may be damage to pads 102a and circuits, among other problems.
Hence in the related art, a CCD camera provided in the dicing system is used to capture images of the cutting faces, and image processing is performed to observe the kerf state as appropriate, and the quantity and temperature of the cutting water which cools the blade are adjusted, damaged and worn blades are replaced, and similar. But using this method, the range of images obtained in one measurement is small, and the measurement data is discontinuous; and data obtained by image capture includes much useless data, so that there is the problem that time is required for data processing and analysis. In order to resolve these problems, Japanese Unexamined Patent Application Publication No. 2002-333309 (hereafter, Related Art Example 1) discloses a chipping measurement method comprising a process of irradiating an area wider than the standard kerf width, in which, at least, chipping does not occur, with a slit-shaped optical beam; a process of receiving the reflected light from the work face; and a process of measuring the kerf chipping state according to the amount of light received.
There are also methods which do not use optical techniques, but measure a physical quantity (resistance) which changes in correlation with the kerf width. For example, Japanese Unexamined Patent Application Publication No. 3-222446 (hereafter, Related Art Example 2), as shown in FIG. 13, discloses a semiconductor wafer comprising, within a scribe area 103 extending in one direction among the scribe areas 103, a pair of metal wiring layers 110 formed in parallel along the scribe area 103 and electrode pads 110a formed at both ends of the metal wiring layers 110. Japanese Unexamined Patent Application Publication No. 3-222447 (hereafter, Related Art Example 3) discloses a structure in which, in place of the above metal wiring layers, a pair of resistance layers, including one type of conductive impurity, are provided. By using such metal wiring layers 110 and resistance layers, when the blade is degraded and the kerf width increases, the resistance of the metal wiring layers 110 or of the resistance layers including the impurity becomes high, or the conduction path is broken, so that by measuring the resistance blade degradation can be inferred, and defects caused by chipping can be prevented.
By using the methods described in the above Related Art Examples 2 and 3, compared with methods in which the kerf shape is observed, blade degradation can be predicted by simple means. In the above methods, however, metal wiring layers 110 and resistance layers including an impurity are formed within the scribe areas 103, so that as a result of dicing, even if the metal wiring layers 110 and resistance layers are cut, all that is learned is that the blade has degraded and the kerf width has increased, but it is not possible to determine whether chips 108 and cracks 109 occurring due to dicing remain within the scribe areas 103, or extend to the chip areas 102.
In order to predict blade degradation, it is not necessary to form the above metal wiring layers 110 or resistance layers in all the scribe areas 103. Hence even in the above Related Art Examples 2 and 3, metal wiring layers 110 and resistance layers are provided only in a scribe area 103 in one direction at one edge of the semiconductor wafer. Hence even if chips 108 or cracks 109 occurred in scribe areas in the other direction, and the chips 108 or cracks 109 reached the chip areas 102 adjacent to the scribe area 103, defective chips could not be sorted.
Further, in the above Related Art Examples 2 and 3, the metal wiring layers 110 and resistance layers are formed from one end to the other end of the semiconductor wafer. Specifically, the layers are formed spanning a plurality of semiconductor chips 101, so that even if the resistance of the metal wiring layers 110 and resistance layers increased due to chips 108 and cracks 109, it is not possible to determine at what position the metal wiring layers 110 and resistance layers are cut or broken, and the result of resistance measurement cannot be used in pass/fail determinations of individual semiconductor chips.
Moreover, as a problem arising from dicing, in addition to the chips 108 and cracks 109 occurring during dicing, even if a chip 108 or crack 109 is within the range of tolerable sizes immediately after dicing, stresses, shocks, and thermal cycles occurring during mounting of the semiconductor chip 101, as well as stresses, shocks, thermal cycles and similar occurring after product assembly, may cause chips 108 to increase in size and cracks 109 to progress, to reach the interior of the semiconductor chip 1 with the passage of time. However, in the above Related Art Examples 2 and 3 it is assumed that the resistance is measured immediately after dicing, and the metal wiring layers 110 and resistance layers as well as the electrode pads 110a formed on the ends thereof are also formed within the scribe areas 103, so that the resistance cannot be measured at a desired time after chip mounting, and there is the problem that effective information cannot be provided with respect to chips 108 and cracks 109 which progress with the passage of time as described above.

Semiconductor wafer, semiconductor chip, and semiconductor chip inspection method


Aspects of the subject matter described herein relate to identity technology. In aspects, profile data is mined to determine claims providers with which a user may be familiar. These familiar claims providers are used in conjunction with claims providers that are allowed by a relying party to determine a candidate set of claims providers that are both familiar to the user and allowed by the relying party. This candidate set of claims providers is then displayed to a user so that the user may select one or more of the claims providers to obtain claims to provide to the relying party.

For many individuals, there is a great concern that their activities with entities on the Web may be tracked and linked to them. With sufficient identifying information, a criminal entity may be able to fake an identity and use it in harmful ways. Companies have tried to address this issue by developing various secure systems. Unfortunately, such systems are often too cumbersome or non-intuitive for users. Furthermore, such systems may allow a company to track activities of individuals on the Web. This leads to mistrust and poor adoption of such systems.
The subject matter claimed herein is not limited to embodiments that solve any disadvantages or that operate only in environments such as those described above. Rather, this background is only provided to illustrate one exemplary technology area where some embodiments described herein may be practiced.


The invention described herein details a protocol to improve analysis and peak identification in spectroscopic data. Bayesian methods are used to automatically identify peaks in data sets. After identifying peak shapes, the method tests the hypothesis that a given number of peaks is found within any given data window. If a peak is identified within a given window, then the likelihood function is maximized in order to estimate peak position and amplitude. This process yields a spectrum with high resolution and minimal artifacts. The method described herein is particularly useful for identifying peaks in data sets obtained from spectroscopy.

The invention is related to the field of analyzing data which includes multiple peak data and, in particular, pertains to an automatic method for analyzing data which includes multiple peak data resulting in high resolution estimates.
Work in chromatography, spectroscopy, engineering, pharmacology, and other fields frequently requires analysis of data sets exhibiting multiple peaks. Analysis of multi-peak data is particularly difficult when peaks overlap, or when data are noisy. Peak finding algorithms of many types are used to identify and interpret peaks and peak positions.
Present state-of-the-art peak finders are either based upon 1] simple matched filters, or wavelets, or searches for local maxima in the time series (resulting in less-than-optimal resolution), 2] parameter fitting to peaks using optimization methods, sometimes on the entire time series (such methods are slow), or 3] direct methods which involve significant operator interaction (i.e. by placing cursors over peaks on a computer screen, estimating baselines by eye, etc.). All of these methods have disadvantages. The method described herein runs essentially like a filter, results in much higher resolution estimates of peak positions and amplitudes than the existing state-of-the-art, and is almost completely automatic.


In production of a molded surface fastener with backing, molten resin is extruded to the surface of a die wheel, which has in the surface a multiplicity of engaging-element-forming cavities and, at the same time, the cavities are filled with the molten resin. During that time, the die wheel is rotated to continuously mold a multiplicity of engaging elements on the front surface of the substrate sheet. Meanwhile, the backing sheet is pressed against the rear surface of the substrate sheet on the die wheel by a pressing roller to integrally join the backing sheet and the substrate sheet together at a selected pattern of regions.

1. Field of the Invention
This invention relates to a surface fastener molded of thermoplastic resin and having a multiplicity of engaging elements on the front surface of a substrate sheet and a backing sheet integrally joined with the rear surface of the substrate sheet, and also to a method of continuously manufacturing such molded surface fastener. More particularly, the invention relates to a molded surface fastener which secures adequate flexibility and effectively prevents any crack in a substrate sheet and which is firmly supported by a backing sheet to enable a wide variety of applications, and also to a method of effectively manufacturing such molded surface fastener.
2. Description of the Related Art
A molded surface fastener of the described type is known in which a multiplicity of engaging elements is molded on the front surface of a substrate sheet and a backing sheet is integrally joined with the rear surface of the substrate sheet by pressing the backing sheet against the substrate sheet in a semi-molten state. This known art is exemplified by Japanese Utility Model Publication No. Sho 55-55602. In this publication, fiber material such as a knit or a woven fiber fabric, a non-woven cloth, a paper sheet are fused on the rear surface of a molded surface fastener in which a multiplicity of hook elements are integrally molded on the front surface of a substrate sheet. This publication merely shows the idea of pressing the fiber material against the substrate sheet while it is in semi-molten state but is totally silent about a concrete method for manufacturing such molded surface fastener.
Methods for manufacturing such molded surface fastener are disclosed in, for example, U.S. Pat. Nos. 5,260,015 and 5,441,687. According to these U.S. Patents, while molten resin is introduced to the circumferential surface of a rotating die wheel, which has a multiplicity of engaging-element-forming cavities on the circumferential surface, to continuously mold on the wheel surface a substrate sheet and a multiplicity of engaging elements standing on the front surface of the substrate sheet, a backing sheet is integrally joined with the rear surface of the substrate sheet by pressing the backing sheet against the substrate sheet in semi-molten state by a pressing roller or other pressing means.
However, in the molded surface fastener disclosed in the above-mentioned publications, since the circumferential surface of the pressing roller, which presses the backing sheet against the substrate sheet, is flat entirely, the backing sheet is joined integrally with the entire rear surface of the substrate sheet. As is understood from a common knowledge that the joint surface, which is produced between the substrate sheet and the backing sheet would be rigid, the molded surface fastener with backing described above is very rigid throughout its entire surface and is therefore not suitable for modern molded surface fasteners to which an increased degree of flexibility is required.
Applications of this type molded surface fasteners, with or without backing, in various industrial fields are on the increase in recent years. For example, they are popular as fasteners for various kinds of bags, clothing, and other daily goods as well as for disposable diapers, interior ornaments, and various kinds of industrial materials such as sheet materials and machine parts. Molded surface fasteners to be used in various industrial fields should vary in characteristics to meet with a wide variety of demands. For use in disposable diapers, the molded fasteners should be excellent in softness and small in size but require a limited durability enough for repeated attaching operations two or three times. On the other hand, for use in fastening industrial materials, they require adequate rigidity and excellent engaging toughness and should have such a structure that the materials can be fastened surely by only a single fastening operation.
Flexible manufacturing is therefore inevitable to manufacture such molded surface fasteners different in size and shape to meet with various kinds of demands for functions.
For use in fastening interior ornaments in a car, mere variation of size and shape does not meet with the demands; for example, the molded surface fastener itself should be formed complementarily with a curved wall surface of a car in order to fasten an interior ornament on the wall. Further, on occasions, it is needed to tentatively attach the molded surface fastener to a tentative-attachment member. If the tentative-attachment member is made of magnetic metal such as iron, it is necessary to magnetize the molded surface fastener.
For providing the molded surface fastener with such function, merely changing the size and/or shape does not suffice. None of the conventional molded surface fasteners including those disclosed in the above-mentioned publications do satisfy all the foregoing demands.

Molded surface fastener with backing and method of manufacturing the same


A package providing a storage space with features capable of affecting atmospheric conditions therein, comprising a body having a first and at least one second storage space adjacent thereto, wherein the first storage space is defined by sidewalls, and the at least one second storage space is defined by sidewalls including at least a portion thereof which further defines the first storage space, the second storage space providing a reservoir for containing an antimicrobial agent therein, wherein the antimicrobial agent includes a precursor to chlorine dioxide gas and the portion of the sidewall which further defines the first storage space is configured to allow for the delivery of the chlorine dioxide gas from the second storage space into the first storage space.

1. Field of the Invention
The present invention is directed to packaging, and more particularly, to packages and packaging systems used for shipping items, such as food products, that include one or more features for reducing harmful microbial contaminants which may be associated therewith.
2. Background of the Related Art
The following description of the background and embodiments of the invention thereafter is provided to aid in understanding the invention, but is not admitted to describe or constitute prior art to the invention. The contents of the articles, patents, and patent applications, and all other documents and electronically available information mentioned or cited in this application, are hereby incorporated by reference in their entirety to the same extent as if each individual publication was specifically and individually indicated to be incorporated by reference, including any references cited in the articles, patents, patent applications and documents cited herein. Applicants reserve the right to physically incorporate into this application any and all materials and information from any such articles, patents, patent applications, or other documents.
Disposable containers for packaging, shipping, displaying or otherwise housing perishable products are of significant economic importance. Many such packaging products have been developed with features that significantly improve or extend the life span of perishable products during shipping. These packages advantageously provide substantial savings to companies involved in the production and sale of perishable items in the marketplace.
While many packaging products include features for creating a "modified atmosphere" intended to extend the lifespan of a perishable product, these packaging products lack features which address potentially harmful contamination associated with the perishable products.

Product packaging system with antimicrobial agent

BOARD OF TRUSTEES OF MICHIGAN STATE UNIVERSITY


A system and method for processing incoming mailed ballot packages having a voter ID code, a verification signature on the envelope, and a ballot enclosed within the envelope. Prior to receipt of the incoming ballots voter signatures have been electronically stored and associated with voter ID's. Ballot packages are fed and transported on automated machinery. Voter ID's are scanned and cameras are used for capturing images of the signatures from the ballot packages. Based on the scanned voter ID's, electronically stored voter signatures are retrieved. Next, the captured verification signatures are compared with the stored voter signatures corresponding to the scanned voter ID's. A validation file is generated that indicates which ballot packages had verification signatures that were successfully matched with stored voter signatures during the comparing step. Finally, the equipment sorts ballot packages to separate successfully matched and validated ballot packages from unvalidated ballot packages.

Voting by mail is becoming increasingly popular. Several western States use voting by mail as their primary method of voting. Voting by mail is also used extensively in connection with absentee voting. For voting by mail. a ballot package needs to be prepared by the voting authority and sent to the voter in advance of election day. The ballot package typically includes a ballot, some instructions, and a return envelope to send the ballot back in. The ballot package may also include a sample ballot and a security envelope. Different districts require different candidates/measures on the ballot. Also, within a district ballots are required for different language, different precincts, and rotation of vote choices.
To maintain voter privacy and anonymity, the ballots themselves must not include any way to identify the voter. However, there must be some way to verify that the vote came from the individual authorized to cast the absentee vote. For this purpose, the return envelope is typically signed. The signature on the envelope is compared to the signature of record for the voter to determine whether the absentee ballot can be validly counted. Once the return envelope is validated, the ballot can be removed and counted separately.
In the past, much of the work in preparing ballot package to send to voters has been done manually. Also, much of the work of receiving, validating and counting returned ballots has also been done manually. Such work has been costly, time consuming, and sometimes less reliable than desired. Some attempts at automating the processes have been tried. For example, U.S. Patent application US 2004/0041017, filed Mar. 4, 2004, (incorporated herein by reference) describes some of the difficulties and solutions for voting by mail processes.

Automated system and method for inbound processing of mailed ballots


An interruptible power supply with a power isolation circuit loop has a base with a battery chamber defined in the base, a fixed top cover, and a movable top cover. The battery chamber serves to receive a battery. The fixed top cover and the movable top cover are mounted on two ends of the base, and the movable top cover corresponds to the battery chamber. The fixed top cover has a loop switch therein connected with a power loop and having an actuation member to switch on or off the power loop. When the movable top cover is mounted on the base, an urging member formed on the movable top cover triggers the actuation member of the loop switch to connect with the power loop. When the movable top cover is removed, the power loop is disconnected. Accordingly, the UPS is economical in terms of parts, cost and space utilization.

1. Field of the Invention
The present invention relates to an uninterruptible power supply (UPS), and more particularly to a UPS with a power isolation circuit loop.
2. Description of the Related Art
Conventional UPSs in the market are connected to electric/electronic appliances and mainly serve to supply power during power outage. Certain UPSs also provide functions for irregular power prevention and noise immunity to protect electric/electronic equipment, especially for precision instruments requiring higher power quality. By and large, UPS is not major equipment to users unless users have a demand for higher power quality.
Taiwan Power Company announces that the average power outage time per power consumer in the science parks island-wide is 1.2 minute (about 72 seconds) in 2010. Such power supply performance can be ranked high in terms of power supply quality because those power consumers in the science parks are densely concentrate and mostly pertain to electronic, semiconductor, communication and photonics industries, which usually suffer heavy loss upon power outage.
Besides the production lines of manufacturers in the science parks, regular users also require UPS in their daily life. The commonly used UPSs are UPSs with replaceable batteries, and the circuit design of the UPSs is to design a circuit on a battery side as an isolation circuit for effectively isolating power coming from electric/electronic appliances connected to the UPSs, thereby protecting power users from the risk of high-voltage shock during battery replacement. However, additional isolated power source, optical coupler, isolated detection circuit, and the like are needed between a primary-side circuit and a secondary-side circuit, and the element cost and the challenge to internal space utilization are relatively higher. In addition, the disadvantages in terms of complicated circuits, more isolated elements, high UPS cost, and larger size of circuit board inside the UPSs also exist.

Uninterruptible power supply with a power isolation circuit loop


An example of a method includes determining, electronically, a source location and a destination location in response to an input received through one of a first short message service (SMS) and a general packet radio service (GPRS). The method also includes determining, electronically, a first milestone between the source location and the destination location. Further, the method includes sending directions to reach the first milestone from the source location through a second SMS and an identifier associated with the first milestone. Furthermore, the method includes detecting when to send directions to reach one of a second milestone and the destination location from the first milestone. In addition, the method includes sending directions to reach one of the second milestone and the destination location through a third SMS based on detecting.

Over a period of years, use of mobile phones has increased. Many applications that were accessible through computers and laptops are now accessible through the mobile phones also. One of the applications includes providing driving directions to a user of a mobile phone. The driving directions can be obtained by the user by accessing various online applications, for example Google® Maps, Yahoo! ® Maps, and MapQuest®. However, in order to access the online applications, internet connectivity is required which may not always be feasible and available to the user of the mobile phone.
The driving directions can also be obtained by the user through a global positioning system (GPS) receiver present in the mobile phone. However, the GPS receiver increases cost of the mobile phone and also may not be feasible in some scenarios.

Method and system for providing driving directions


A luminaire includes a housing defined by a pair of sidewalls, a bottom wall, and a first end wall. The first end wall has a first open-ended slot adapted to receive one or more wires. The luminaire also includes a first bracket removably coupled to the first wall to partially close the open-end of the first slot such that a hole remains. The hole is adapted to securely retain the one or more wires. The luminaire further includes a closure coupled to the housing and configured to close the housing. The closure is configured to include one or more light-emitting components.

Many commercial buildings, parking structures, transportation areas or structures, and the like are equipped with lighting systems that typically include several luminaires or light fixtures configured to illuminate certain areas. Some luminaires with LEDs for example can be powered by drivers that are physically wired to the luminaires. In typical lighting systems, the drivers are located in proximity to the luminaires that they power, in part because this arrangement simplifies the installation and wiring of the components.
These typical lighting systems can prove to be quite difficult to install. When multiple luminaires are powered by the same driver, the wire(s) connecting the driver to the luminaires are conventionally manually fed through openings, for example, drilled through each individual luminaire housing. This typically requires the wire(s) to be inserted into one end of the luminaire housing, pulled through the luminaire housing, and then fed out at the other end. This process is repeated for each of the luminaires until all of the luminaires are connected to the driver. Wiring the luminaires in this way can be labor intensive, time consuming, and frustrating, particularly when the luminaires are installed in difficult-to-reach locations, such as a high ceiling or a high-traffic tunnel. Moreover, this process may need to be partially or fully repeated when one or more components of a luminaire, such as a light-emitting component, need to be replaced.


A printed circuit board and a routing scenario thereof are disclosed. The printed circuit board includes three dielectric layers, two signal layers and several differential pairs. Some differential pairs are disposed in one signal layer, while some differential pairs are interleavingly disposed in the adjacent other signal layer. The differential pairs in one signal layer carries signals that flows to one direction, while the differential pairs in the adjacent signal layer carries signals that flows to an opposite direction. Under such a routing scenario, the crosstalk between differential pairs in adjacent signal layers may be reduced.

1. Field of the Invention
The present invention relates generally to a printed circuit board and a routing scenario thereof, and more particularly to a printed circuit board and an interleaving routing scenario thereof for reducing the crosstalk between signal traces in the printed circuit board, and for saving the routing real estate.
2. Prior Art
The advancement of electronic industry demands more and more electronic components to be integrated on a single printed circuit board. Besides, smaller and smaller size of the printed circuit board is in need for smaller and smaller electronic products. As a result, a printed circuit board with a limited area requires disposing denser and denser routing scenario thereon. This narrows the spacing between signal traces.
Conventionally, a printed circuit board adopts a right-angle routing scenario, a 45 degrees routing scenario, a differential routing scenario or a zigzag routing scenario. In applications of high-speed design, one usually employs the differential routing scenario.
Referring to FIG. 1, the differential routing scenario of the conventional printed circuit board in stripline geometry is illustrated. As shown, the printed circuit board 100 comprises a first ground plate 110, a first dielectric layer 120, a signal layer 130, a second dielectric layer 140, and a second ground plate 150, wherein a plurality of differential pairs, such as a first differential pair 131 and a second differential pair 134, is disposed within the signal layer 130. The signal layer 130 is formed between the first dielectric layer 120 and the second dielectric layer 140. The first ground plate 110 is formed above the first dielectric layer 120, while the second ground plate 150 is formed beneath the second dielectric layer 140. The first dielectric layer 120 and the second dielectric layer 140 is made of either a homogeneous dielectric material or a non-homogeneous dielectric material. Data signals on the first differential pair 131 and the first differential pair 134 are directed and flowed to the same direction.
However, the conventional differential routing scenario, illustrated in FIG. 1, is disadvantageous in that the differential pairs are dispose layer. The denser the differential pairs are disposed in the same signal layer, the higher the crosstalk between differential pairs is increased. Besides, the denser the differential pairs are disposed in the same signal layer, the more likely the electromagnetic interference between differential pairs would incur. These would largely reduce the performance of the entire printed circuit board system. Therefore, there is a need for a differential routing scenario that may prevent the crosstalk and the electromagnetic interference between differential pairs from happening.

Printed circuit board and interleaving routing scenario thereof


An improved refractory investment material for use in making refractory molds is provided. The material comprises an investment powder including a binder, a refractory selected from calcined mullite and pyrophyllite, additives for controlling setting and about 0.01 to about 0.04% by weight of a sulfate salt. The investment powder is formed into a slurry with a solution of a water based colloidal silica in an amount providing about 3% to about 6% by weight colloidal silica based on the weight of the water and a chloride salt in an amount of at least about 0.5% by weight based on the weight of said investment powder.

The present invention relates generally to the investment casting art, and more specifically to a new investment material for use in making refractory molds.
Investment casting molds are typically made by preparing a pattern assembly or tree comprising of a plurality of patterns having the configurations of the desired metal castings, the patterns being made of wax, plastic or other expendable material. The combination of the tree or runner system and patterns is referred to as the set-up. To form the mold, the pattern or patterns are placed into a flask which is then filled with a refractory investment slurry. The slurry is allowed to harden in the flask around the pattern to form the mold. After the investment slurry has hardened, the patterns are melted out of the mold by heating in an oven, furnace or autoclave. The mold is then fired to an elevated temperature, e.g., 1350.degree. F., to remove water and burn off any residual pattern material in the casting cavities. In many instances, the mold is first cooled to a lower temperature in order to obtain optimum casting conditions before filling it with molten metal. For example, when casting aluminum it is the practice to cool the mold to anywhere from room temperature to about 400.degree. or 500.degree. F. before filling it with the molten metal.
Conventional investment formulations used for non-ferrous molds are comprised of a binder and a refractory made up of a blend of fine and coarse particles. The refractory usually is wholly or at least in part silica, such as quartz, cristobalite or trydymite. Other refractories such as calcined mullite and pyrophyllite can also be used as part of the refractory. The binder is typically fine gypsum powder (calcium sulfate hemihydrate).
The binder and refractory, together with minor chemical additives to control setting or hardening characteristics, are dry blended to produce the dry investment powder. The dry investment is then prepared for use by mixing it with a sufficient amount of liquid, such as water, to form a slurry which can be poured into the flask around the set-up. Vacuuming of the slurry and vibration of the flask are frequently employed steps to eliminate air bubbles and facilitate filling of the flask.
A serious problem encountered with conventional investment molds is the frequent occurrence of cracking during the heating and/or cooling cycles and during the metal casting operation itself. If a vacuum is applied to the molds during pouring of the molten metal, the molds are subjected to additional stresses which can contribute to the cracking. Mold cracking results in metal flash on the castings which must be removed by expensive finishing operations, and permits particles or flakes of investment to break loose and fall into the mold cavities. This can produce inclusions in the castings and cause them to be rejected. In instances where cracking is especially severe, the molten metal can leak through the mold wall so that the entire mold must be scrapped.
Another problem associated with the use of gypsum bonded refractory investments is the tendency for the refractory particles to settle away from underneath the surfaces of the disposable pattern materials after the investing operation is completed, but before the investment has hardened. This type of defect is a source of rejected castings and is believed to be the result of a watery layer that forms between the pattern surface and the slurry like investment when it is still relatively fluid.
Still another source of rejects is concerned with castings that are out of tolerance from a dimensional standpoint. There are many variables involved with dimensional problems including those resulting from sudden volumetric changes that occur due to dehydration of the binder during the firing of the mold, the thermal expansion characteristics of the refractory, and the temperature differential between different sections of the mold. All of these can contribute to the distortion of the mold cavity after the pattern has been eliminated.

Refractory containing investment material and method of making