A leak detection apparatus detects leaks or premature wearing in a lined fluid filled vessel. A leak detection apparatus comprises a current density meter, a power supply, and a probe. The probe is inserted into the fluid filled vessel. The power supply supplies an AC or DC electric current to a directional amplifier of the probe. A torroid of the probe senses the current density in the fluid and sends an electrical signal to the current density meter. The current density meter measures the electrical signal and communicates a current density readout to a display. This readout indicates to an operator whether or not there is a crack, premature wearing, or a bypass.

Storing and transporting hazardous fluids in vessels can be a dangerous business. Hazardous fluids are often extremely corrosive causing vessel interiors to deteriorate very rapidly. To slow the deterioration, many vessel interiors are coated with a non-corrosive lining, such as Teflon, Rubber, Fiberglass Reinforced Plastic, and others. Even with the use of non-corrosive linings, all vessels eventually wear and deteriorate ultimately producing cracks that can leak hazardous fluid into the environment. In addition to harming the environment, these leaks can be violations of the law. In an effort to protect the environment and follow the law, an entire industry has developed creative technology to detect and prevent leaks in these vessels. While some of this technology has been successful in detecting leaks, it has also proven to be expensive, labor-intensive, and sometimes unreliable.
One popular method for detecting leaks in a vessel is Holiday spark testing. This method comes in two varieties, low-voltage and high-voltage. Using the low voltage method, a ground wire and a lead wire are connected to a low-voltage battery. The ground wire is connected to the outside of a vessel and the lead wire is connected to a wet sponge. In operation, the wet sponge is moved over the non-corrosive lining. If there is a crack in the lining, the circuit is completed activating an audible or visual indicator.
While this device is inexpensive and relatively easy to use, it has drawbacks. First, the vessel in service must be completely empty of fluid and dry before spark testing can begin due to safety and operational concerns. This has a number of consequences. If not completely dry, any remaining fluid in the vessel can cause a short and falsely indicate a crack or the wrong location. Even worse, if the vessel contained flammable fluids there is the risk of igniting the remaining fluid. Another consequence of removing the fluid from the tank is that some cracks may become undetectable with the fluid removed.
When a vessel is filled with fluid, the pressure exerted on the vessel by the specific gravity and temperature of the fluid can enlarge cracks that otherwise shrink and disappear when the fluid is removed and the pressure is relieved. A second drawback of low-voltage testing is that spark testing is not sensitive enough to indicate inadequate thickness in the tank lining, which leads to premature failure of the lining. Third, locating a crack in the lining with this device is very time consuming. To operate a spark tester, an operator must manually sweep the spark tester over the entire lining of the tank. Not only is this process time consuming, but it also requires a degree of skill and experience from the operator. Finally, this method is not capable of early detection of weakness in the lining, such as thinning. It only detects weaknesses that have developed into full-fledged cracks. As a result, spark testing must be routinely performed to detect cracks quickly after they develop to prevent leaking. All of these disadvantages result in high maintenance and repair costs along with loss of production time.
High-voltage spark testing is very similar to low-voltage spark testing, except an electrode is used instead of a wet sponge and a high-voltage power source is used instead of a low-voltage battery. When a crack in the lining is detected, an electrical arc is visible between the electrode and the lining. The electrical arc acts as a visual indicator of a crack in the lining. The high-voltage power source allows this method to indicate inadequate thickness in the tank lining. Like low-voltage spark testing, the tank must be empty of fluid and dry. This method has all the same drawbacks as low-voltage spark testing. In fact, there is an increased risk of igniting residual flammable fluids. Additionally, repeated high-voltage spark testing leads to breakdown of the lining. Again, these disadvantages result in high maintenance and repair costs along with loss of production time.
Other methods for detecting leaks allow for continuous testing while the vessel is still filled with fluid. One such method is specifically described in U.S. Pat. No. 5,214,387, hereafter referred to as '387. Multiple probes are embedded in a vessel wall at various depths. A separate probe is submerged in the fluid within the vessel. An electrical monitor connected to all the probes communicates an electrical signal through the submerged probe into the fluid. If a crack in the vessel lining develops, fluid will penetrate the crack and contact the probes in the vessel wall, thus, completing an electrical circuit. The electrical monitor registers this signal and activates an audible or visible indicator.
However, there are numerous problems with this method of leak detection. First, the ability to detect leaks is dependent on the number and placement of the probes. Therefore, leaks that develop in an area not monitored by a probe may never be detected. To address this concern, '387, discloses a mat built within the entire structure of the vessel. However, this only results in another problem. A mat will detect a leak anywhere in the vessel, but will not indicate exactly where the leak is located. Consequently, Holiday spark testing must be subsequently performed to identify the actual location of the leak. A second problem with this method is contamination and corrosion of the probes. When this happens, the probes become ineffective preventing detection of leaks. These problems can result in the non-detection or late detection of a leak resulting in increased expenses for maintenance and repair.
Another method for continuous testing while the vessel is still filled with fluid is specifically described in U.S. Pat. No. 5,378,991, hereafter referred to as '991. In this method, the vessel has an inner conductive layer. It also has a probe that is submerged in the fluid. An electrical monitor connected to the inner conductive layer communicates an electrical signal through the submerged probe into the fluid. If a crack in the vessel lining develops, fluid will penetrate the crack and contact the inner conductive layer, thus, completing an electrical circuit. The electrical monitor registers this signal and activates an audible or visible indicator.
However, the problems with this method of leak detection are similar to the method in '387. First, the inner conductive layer will detect any leak present in the vessel, but will not indicate exactly where the leak is located. Consequently, Holiday spark testing must be subsequently performed to identify the actual location of the leak. A second problem with this method is contamination and corrosion of the probe. When this happens, the probe becomes ineffective preventing detection of leaks. These problems can result in the non-detection or late detection of a leak resulting in increased expenses for maintenance and repair.
Fortunately, the present invention overcomes the problems associated with methods described above. Using the present invention, both leaks and premature wearing can be detected while a vessel is filled with fluid, preventing high maintenance costs along with lost production time. In addition, the present invention specifically pinpoints the location of leaks in a vessel.

Leak detection apparatus for lined vessels and method of use


An extension tube for an electrical floor box that includes a first section and a second section. Each section has a curved wall with an interior surface and an exterior surface, a top portion, a bottom portion and first and second side edges. The bottom portion is offset radially outwardly from the top portion by a ledge and the side edges have connecting mechanisms which join the two sections together to form the extension tube. The extension tube includes a top portion and a belled bottom portion which are formed so that the top portion of one extension tube can be inserted into the bottom portion of another extension tube.

The use of an electrical junction or outlet box to accommodate electrical cable terminations is well known in the art. These boxes typically house electrical components, such as electrical receptacles, jacks and plugs and other devices. The junction box permits the electrical cables to either pass through or connect to the electrical components housed inside the box. In certain applications, these junction boxes are used in floor installations, and are referred to as floor boxes. Electrical cable distribution takes place beneath the surface of the floor and the junction boxes are designed to be supported within a poured concrete floor. One of the problems in positioning a floor box is that the installer must assure that the top of the floor box is both flush and level with the top of the poured floor in which it is set. Variations in the thicknesses of poured floors require a user to either stock several types of floor boxes with different dimensions or modify floor boxes to the requirements of a particular application.
In the prior art, it is known to provide floor boxes which are set in poured concrete floors and then sawed off to accommodate the depth of the poured floor. Examples of these cuttable floor boxes are shown in U.S. Pat. No. 3,343,704 to Terry and U.S. Pat. No. 5,466,886 to Lengyel et al. However, these cuttable floor boxes have certain disadvantages. The cuttable floor boxes typically have an open end and thus require a separate cover to protect the interior of the box from debris and extraneous concrete during pouring of the concrete floor. Furthermore, many of these cuttable floor boxes require complicated assemblies to assure that the terminations housed at the upper end of the box are level with the concrete floor. Additionally, many electrical standards, such as the National Electrical Code (NEC), require floor boxes that accommodate multiple services (e.g., power and communication services) be designed to maintain physical separation between the various services within the box.
In many floor applications, the junction box is positioned on a deck and concrete is poured over the deck to form the floor. The deck typically includes ducts, conduits or corrugations for the passage of the cables under the floor. In these applications, the junction box is positioned on the deck and connected to the duct, conduit or corrugations prior to pouring the concrete. Once the box is properly positioned, the concrete is poured onto the deck and around the junction box to form a concrete floor.
In order to accommodate variations in the poured concrete floor thickness, the junction box is typically constructed so that the upper end of the box extends above the level of the poured concrete floor. Once the concrete floor has set, the installer cuts away the portion of the box extending above the surface of the floor so that the top of the box is flush with the surface of the poured concrete floor. The cutting may be accomplished by hand sawing the extending portion of the box. During this process, especially with respect to plastic floor boxes, the sides of the box may flex under the force of the saw. This flexing can create a space between the outside walls of the box and the surrounding concrete floor. Loose pieces of concrete and other debris in the area have a tendency to back-fill into the space between the flexed wall of the box and the concrete floor. As a result of the collection of debris in the space, the wall of the box assumes a permanent internal bow or deformation, which can make internal adjustment of the box difficult to accomplish. Also, internal bowing reduces the useable interior space and makes it more difficult for the installer to make connections inside the box. This problem is especially prevalent in plastic rectangular floor boxes where the elongate side walls have a greater tendency to bow or flex either when sawed or due to the force of the poured concrete on the outside wall.
At the present time, there is no approved method for the installation of electrical boxes in thick concrete slabs, such as post-tensioned slabs. In some cases, the installer glues and/or tapes the open ends of two conventional boxes together and places them on the ground. This is primarily so that the length of the joined boxes is greater than the thickness of the concrete slab. It also serves to prevent concrete from entering the interior of the box. After the concrete is poured and set, the closed end of the box protruding from the top of the concrete is cut flush with the top surface of the slab.
It is, therefore, desirable to provide a floor box for installation in a poured concrete floor which can easily be modified to accommodate concrete floors of different thicknesses. It is also desirable to provide a floor box that can be securely anchored within a poured concrete floor without bowing or flexing of the side walls due to cutting the upper end of the box flush with the floor. Moreover, there is a need for an electrical box extension that can be used with concrete floors of different depths. Further, there is a need for a floor box with a structure that prevents concrete from entering the box.


A thermally stabilized silicone liquid composition and a toner fusing system using the thermally stabilized silicone liquid composition as a release agent are described, wherein the thermally stabilized silicone liquid composition is composed of a silicone liquid and a thermal stabilizer composition including a reaction product from at least a polyorganosiloxane and a platinum metal compound such as a ruthenium compound, excluding platinum.

In a typical electrostatographic reproducing apparatus, a light image of an original to be copied is recorded in the form of an electrostatic latent image upon a photosensitive member and the latent image is subsequently rendered visible by the application of toner. The visible toner image is then in a loose powdered form and can be easily disturbed or destroyed. The toner image is usually fixed or fused upon a support which may be a photosensitive member itself or other support sheet such as plain paper.
The use of thermal energy for fixing toner images onto a support member is well known. In order to fuse toner material onto a support surface permanently by heat, it is necessary to elevate the temperature of the toner material to a point at which the constituents of the toner material coalesce and become tacky. This heating causes the toner to flow to some extent into the fibers or pores of the support member. Thereafter, as the toner material cools, solidification of the toner material causes the toner material to be firmly bonded to the support.
Typically, toner particles are fused to the substrate by heating to a temperature of between about 90.degree. C. to about 160.degree. C. or higher depending upon the softening range of the particular resin used in the toner. It is not desirable, however, to raise the temperature of the substrate substantially higher than about 200.degree. C. because of the tendency of the substrate to discolor at such elevated temperatures particularly when the substrate is paper.
Several approaches to thermal fusing of toner images have been described in the prior art. These methods include providing the application of heat and pressure substantially concurrently by various means: a roll pair maintained in pressure contact; a belt member in pressure contact with a roll; and the like. Heat may be applied by heating one or both of the rolls, plate members or belt members. The fusing of the toner particles takes place when the proper combination of heat, pressure and contact time is provided. The balancing of these parameters to bring about the fusing of the toner particles is well known in the art, and they can be adjusted to suit particular machines or process conditions.
During operation of a fusing system in which heat is applied to cause thermal fusing of the toner particles onto a support, both the toner image and the support are passed through a nip formed between the roll pair, or plate or belt members. The concurrent transfer of heat and the application of pressure in the nip effects the fusing of the toner image onto the support. It is important in the fusing process that no offset of the toner particles from the support to the fuser member takes place during normal operations. Toner particles offset onto the fuser member may subsequently transfer to other parts of the machine or onto the support in subsequent copying cycles, thus increasing the background or otherwise degrading the resulting output. The so called "hot offset" occurs when the temperature of the toner is raised to a point where the toner particles liquefy and a splitting of the molten toner takes place during the fusing operation with a portion remaining on the fuser member. The hot offset temperature is a measure of the release property of the fuser roll, and accordingly it is desired to provide a fusing surface which has a low surface energy to provide the necessary release. To ensure and maintain good release properties of the fuser roll, it has become customary to apply release agents to the fuser members to ensure that the toner is completely released from the fuser roll during the fusing operation. Typically, these materials are applied as thin films of, for example, silicone oils to prevent toner offset.
The silicone oils employed as release agents in these practices are typically polyorganosiloxanes, more specifically, polydimethylsiloxanes, which are used in a range of viscosities of from about 100 centistokes to 13,000 centistokes. While capable of performing satisfactorily these silicone oil release agents suffer from certain deficiencies. In particular, they tend to show an increase in viscosity with eventual gelling when held at elevated temperatures with the consequence that the release agent management delivery system can be adversely affected. For example, the release agent oil can gel while on the fuser roll or in the supply lines of the release agent management system. As previously discussed the typical fusing systems in electrostatographic printing apparatus have a heated fuser roll heated to temperatures of the order of 90.degree. to 160.degree. C. and sometimes to temperatures approaching 200.degree. C. An additional problem associated with these silicone oils at elevated temperatures is the generation of silicone oil vapor which is a detrimental byproduct in that it tends to form insulating layers on the electrical circuits and contacts and may therefore interfere with the proper functioning of these circuits and contacts. Furthermore, depending on the chemical makeup of the silicone oils the vapors released at elevated temperatures may include environmentally undesirable materials such as benzene, formaldehyde, trifluoropropionaldehyde. Thus, there is a need, which the present invention addresses, for new thermal stabilizer compositions for functional and nonfunctional silicone liquids.
The following information may be pertinent:
Materials used in conventional fusing systems are disclosed in Heeks, U.S. Pat. No. 5,493,376, Shoji et al., U.S. Pat. No. 5,157,445, and Swift et al., U.S. Pat. No. 4,146,659.
The chemistry of the platinum metals is discussed in W. P. Griffith, The Chemistry of the RARER PLATINUM METALS (Os, Ru, Ir and Rh), Interscience Publishers, pp. 141-142 (1967); and RUBBER TECHNOLOGY, edited by Maurice Morton, Van Nostrand Reinhold Company, pp. 407-408 (3rd Edition).
The phrase platinum metal used herein is defined in Hawley's Condensed Chemical Dictionary, Van Nostrand Reinhold Company, p. 927 (11th Edition) as follows: "Any of a group of six metals, all members of group VIII of the periodic system: ruthenium, rhodium, palladium, osmium, iridium, and platinum. All of these are also transition metals."

Thermally stabilized silicone liquid and a fusing system using the thermally stabilized silicone liquid


An image forming apparatus includes a deterioration determining device to determine a deterioration degree of a latent image bearer based on a potential detected by a surface potential detector. The deterioration determining device calculates a relative value indicating the deterioration degree based on the aggregated number of pixels and a time value for each of virtually divided regions. The deterioration determining device determines a deterioration degree of a detecting target region of the virtually divided region based on a potential detected by the surface potential detector. The deterioration determining device further determines deterioration degrees of non-detecting target respective regions of the virtually divided regions based on the relative values of the non-detecting target respective regions, the relative value of the detecting target region, and the deterioration degree of the detecting target region.

1. Technical Field
This invention relates to an image forming apparatus having a determining device that determines a deterioration degree of a latent image bearer based on a result of detecting a surface potential of the latent image bearer.
2. Related Art
Conventionally, an image forming apparatus to form an image by using the below described electro-photography is known. Specifically, a surface of a latent image bearer is uniformly charged electrically by an electric charger such as a corona charger, etc. Subsequently, a latent image having a potential different from (e.g., opposite) the uniformly charge potential is written onto the latent image bearer by executing optical scanning. Subsequently, the latent image on the latent image bearer is developed by a developing unit as it selectively attaches toner thereto. While transferring the toner image obtained in this way onto a recording sheet by either directly or indirectly via an intermediate transferring member, the recording sheet with the toner image is output. Subsequently, residual electric charge is removed from the latent image bearer by an electric charge-removing device after the toner image is transferred therefrom. Subsequently, to prepare for the next latent image formation, the latent image bearer is uniformly charged again by the electric charger.
In such a system that conducts the electro-photography, as the latent image bearer repeats charging uniformly, writing the latent image, and removing the electric charge remaining on the latent image bearer, charging performance gradually deteriorates. Consequently, the latent image bearer markedly degrades the charging performance and becomes difficult to form a latent image with a stable potential thereby degrading image quality.
In a conventional image forming apparatus, immediately after a surface of a rotatable drum-type photoconductor as a latent image bearer is uniformly charged by an electric charger, a voltage sensor detects the uniformly charged potential. When the detection result is below a prescribed lower limit, the photoconductor is regarded as deteriorated and reaches the end of its working life, and is replaced with a new photoconductor.
By encouraging the user to replace the old photoconductor with the new photoconductor before the old photoconductor degrades to the point where it is difficult to form a latent image with a stable potential, image deterioration caused by such deterioration of the photoconductor can be minimized.
However, when a deterioration degree of the photoconductor is not uniform axially, the expiration of the photoconductor cannot be timely detected and may cause the deterioration of image quality.
Further, as a frequency of writing latent images on the photoconductor increases, the photoconductor is more quickly degraded. Accordingly, when the frequency of writing the latent image on the photoconductor deviates axially, the deterioration degree of photoconductor also deviates according to the deviation of the writing frequency. That is, in a region in which the latent images are relatively frequently written, deterioration progresses rapidly. By contrast, in another region in which the latent images are relatively rarely written, the deterioration does not progress rapidly.
Although the deterioration degree of the photoconductor deviates axially in this way, only a potential of a central region out of the whole region of the photoconductor axially is detected by a voltage sensor and whether or not the photoconductor as a whole has worn out is determined based only on its detection result in the conventional image forming apparatus. With such a system, however, when a side region more quickly deteriorates and wears out than a central region, such an effect cannot be detected and may end up causing deterioration of image quality.


A microdermabrasion system includes an applicator tool including a central handle portion with a treatment tip at a distal end of the handle, where the treatment tip includes an abrading surface formed on a front surface of the tip. A proximal end of the elongated handle is coupled to first and second arms, forming an opening in the hand piece through which a user can insert one or more fingers. The handle supports a bottom side of a user's finger while the user grips the handle. In an implementation, the handle includes an indentation for at least one finger. In an implementation, the treatment tip is removable and replaceable.

The invention relates to the field of devices to treat human skin and more specifically to a microdermabrasion tool.
As people age, they look for ways to maintain a youthful appearance. Some invasive cosmetic techniques include surgical approaches including eye lifts, face lifts, skin grafts, and breast lifts. However, these invasive techniques also have risks and potential complications. Some people have died during cosmetic surgery operations. Therefore, it is desirable to have noninvasive cosmetic techniques.
A noninvasive technique for obtaining a more youthful appearance is through microdermabrasion. Microdermabrasion is a process for removing dead cells from the outermost layer of the skin (the epidermis) to provide a younger and healthier looking appearance, remove wrinkles, clean out blocked pores, remove some types of undesirable skin conditions that can develop, and enhance skin tone.
The process of microdermabrasion must be performed with a certain degree of accuracy, so that underlying live layers of skin tissue are not removed or damaged, but that enough dead cells are removed to give effective results. There is a continuing demand for microdermabrasion systems that are easier, safer, and more comfortable to use. Therefore, there is a need for improved system, devices, and techniques for performing microdermabrasion.

This patent is subject to a terminal disclaimer.

Microdermabrasion system with ergonomic handle


An image apparatus, comprising a image capture device that captures an image, a display device that displays the image, a display control block that enlarges and displays a first area, included in a first image, on the display device, a target setting block that sets an object in the first area as a target for tracking and a detecting block that detects a second area, including the object, in a second image which is specified to be displayed next on the display device in place of the first image, the display control block enlarging and displaying the second area on the display device.

1. Field of the Invention
The present invention relates to an image apparatus, an image display apparatus and an image display method.
2. Description of the Related Art
Conventionally, a digital still camera (such as an image apparatus) records an image, captured by an imaging device having about ten million pixels, at about 30 fps to 60 fps (frames per second) with a full number of pixels. This is possible because imaging devices and the corresponding control technology has improved. If the number of recorded pixels is reduced, the image devices record images with a high frame rate, for example 1,200 fps. Some digital still cameras have a continuous shooting function, which allows the digital still camera to record plural images at a high frame rate continuously while the user keeps a release button pressed. This function is suitable for recording an image in the case of a fast moving object (such as a car and train) or an object moving unpredictably (such as a child and animal) to prevent the user from mistiming the photograph.
Plural images captured by the continuous shooting function are usually merged into one image file and saved in a memory card. Japanese laid open 2008-167067 discloses the technology in which plural images are merged and saved into one image file. A file format including plural images is defined by the Multi-Picture Format standard issued by Camera & Imaging Products Association in February 2009.
When the user has recorded plural images by the continuous shooting function, the user may wish to read out the image file and confirm the image, frame by frame, on the screen in order to select the best image. Hereinafter, the operation by which the plural images are displayed frame by frame is called frame-by-frame-forward-(backward). By the display, the user confirms the degree of focus and the expression of a face as being an object of interest (e.g. the face of child or animal) which is enlarged and displayed on the screen. In this manner, when a part of the image is enlarged and displayed on the screen, the user operation of reviewing frame-by-frame-forward-(backward) typically means that the position of the enlarged part on the screen and the magnification ratio to enlarge are fixed for the next (previous) images.
As described above, the continuous shooting function is used to record a moving object. Therefore, the position of the moving object may change frame by frame. As a result, when a part of an image is enlarged and displayed on the screen, if the user operates frame-by-frame-forward-(backward), the moving object may no longer be in the enlarged part of the screen in the next (previous) frames. Thus, in order to see the object, the user has to modify the position manually. This becomes cumbersome and problematic. Further, this problem is not limited only to the case of continuous shooting function. A similar problem will occur in the case of plural images recorded independently.
One purpose of the present embodiments of the invention is to provide an image apparatus, image display apparatus and image display method which are able to solve the above noted problem. In other words, as a result of the present improvements, when the user is confirming plural images with a part of the images being enlarged and displayed on the screen, the user is able to confirm the plural images efficiently without cumbersome operation.

Image apparatus, image display apparatus and image display method


The open joint wall panel system includes panels having a standardized shape attached to an extrudable track that, in turn, is attached to an exterior wall. Each panel is vertically positioned using dead load anchors and positioned relative to the exterior wall with anchor clips.

1. Field of the Invention
This invention relates to open joint wall panel systems. In particular, this invention relates to an open joint rain screen wall panel system that does not require wet sealant and that uses an anchoring guttering system with standardized metal panels.
2. Description of Related Art
Some conventional rain screen wall panel systems require frequent maintenance. These rain screen systems use wet sealants that have been applied either at the manufacturing facility or in the field. The sealants prevent the ingress of water between the panels of the wall system. However, these wet sealants degrade over time due to exposure to the elements. Degradation of these sealants mars the appearance of the building. Therefore, conventional wall systems require frequent maintenance of the sealants to avoid excessive degradation by replacing old sealant with fresh sealant.
Wet sealants also restrict the ability of associated metal panels to move in response to temperature and pressure differentials between the exterior and interior surfaces of the panels. If the panels are restricted and exposed to thermal fluctuations, the panels may warp, xe2x80x9coil-canxe2x80x9dor develop kinks in the surface.
A conventional rain screen system 10 that does not use a wet sealant is shown in FIG. 1. This system 10 has brackets 12 attached to an exterior wall 14 of a building. The brackets 12 support a vertical track 16. The vertical track includes pins 18. Panels 20 of the system 10 include hooks 22 that each receive an isolator 24 and which engage a corresponding pin 18. The system 10 is difficult to install because each pin 18 must be precisely vertically positioned to align with a corresponding hook 22. The pins 18 are also difficult to manufacture.
The present invention provides an open joint, back-ventilated rain screen panel system that uses dead load anchors, anchor clips and a track system. The panel system of the present invention does not require wet sealants and, therefore, avoids the necessity for regular maintenance. An exemplary embodiment of the panel system of the present invention uses standardized metal panels that are anchored by a guttering system. The system of the present invention permits movement of the panels in response to temperature changes. An exemplary embodiment of the panel system of the present invention uses nylon anchor blocks which minimize the friction between the individual wall panels and the track and enable the use of differing panel materials.
The panel system of the present invention does not use the difficult and restrictive hook and pin design of some conventional panel systems. The panel system of the present invention allows for much quicker installation and also reduces the number of penetrations of the wall of the building in comparison to conventional panel systems.


A card connector capable of preventing a card from accidental disengagement therefrom includes a housing having a base plate, a stationary terminal area located at a first side of the base plate, and a concave portion located at a second side of the base plate; a slide member slidably mounted in the concave portion; and an anti-run member having a main body, a fastening piece formed at a rear end of the main body, and a buckle portion formed at a front end of the main body. An elongated slide way is formed in the concave portion and located close to the stationary terminal area. An inclined guide portion is formed at a front end of the slide way. A recess is formed at a front end of the guide portion. The main body of the anti-run member further has a support piece extending toward the first side therefrom.

1. Field of the Invention
The present invention relates generally to electronic card connectors, and more particularly, to a card connector capable of preventing a card from accidental disengagement therefrom.
2. Description of the Related Art
A conventional card connector, as shown in FIG. 12, includes a slide member 4′ and an anti-run buckle 5′ fixed to the slide member 4′ and having a buckle portion 56′. While a card 7′ is inserted into the card connector, the card 7′ pushes the slide member 4′ to move backward and the buckle portion 56′ is correspondingly buckled into a concavity located at a side of the card 7′. When the card connector is violently shocked or wobbled, the buckle portion 56′ of the anti-run buckle 5′ likely disengages from the concavity of the card 7′ to further disengage the card 7′ from the card connector.

Card connector capable of preventing electronic card from accidental disengagement therefrom


A kit and method for learning rhythms, composing music, to play a musical instrument, and then read music; in that particular order of events. The kit comprises a set of hands on manipulatives that assemble into a structured system of interactive musical instrument concept training components. The method comprises employing the kit according to instructions in at least one or more training manuals to assemble the hands on manipulatives into a structured system of interactive musical instrument concept training components.

1. Field of the Invention
The present invention relates to a kit and method for learning to read music and play music on an instrument, for example, a kit and method for learning to play piano.
2. Description of Related Art
Music is an art form in which the medium is sound. Elements of music are pitch (which governs melody and harmony), rhythm (and its associated concepts of tempo and meter), articulation (specific ways indicated by the composer in the music in which the sound is to be produced by the performer), dynamics (various levels of loud and soft), and theory (rules which give the melody and harmony structure).
Notation is the written expression of music notes and rhythms on paper using symbols. When music is written down, the pitches and rhythm of the music is notated, along with instructions on how to perform the music. The study of how to read notation involves music theory, harmony, the study of performance practice technique (the best way to physically produce the desired sound or effect desired by the composer), and in some cases an understanding of historical performance practices.
Notated music is produced as sheet music, or assembled in books or collections of pieces. To perform music from notation requires an understanding of both the musical style and the performance practice that is associated with a piece of music or genre. Additionally, performance of music on an instrument requires knowledge of the particular instrument and the ability to coordinate between the process of reading notated music and manipulating the instrument.
Gaining the knowledge and skills required to play music on an instrument is an abstract and practice intensive process. Having an ability to conceptualize abstract concepts of musical theory, such as those concepts discussed above, increases knowledge retention and hastens skill development. It is an object of the present invention to provide a unique approach to teaching a user to play a musical instrument by employing a kit, and method of using the kit, to quantify and solidify abstract musical concepts. The invention simplifies the music reading process by integrating abstract concepts with the use of hands on manipulatives and musical instrument concept training components, which, in conjunction with training manuals fully equip a user of the kit with a thorough knowledge and understanding of all aspects of reading musical notation while fortifying the skills required for playing the musical instrument.

Kit and method for learning to play an instrument


Provided are a method, system, an program for tuning a database query. Provided are a base access plan to implement the database query and statistics including information on a layout of the database against which the query will be executed. The statistics are processed to determine performance problems with the base access plan as part of a first analysis of the base access plan and the determined performance problems are processed as part of a second analysis to provide an analysis of the determined performance problems and processing cost of the base access plan. Recommendations are generated to tune the base access plan to improve performance.

1. Field of the Invention
The present invention relates to a method, system, and program for performance tuning a database query.
2. Description of the Related Art
Data records in a relational database management system (RDBMS) in a computer are maintained in tables, which are a collection of rows all having the same columns. Each column maintains information on a particular type of data for the data records which comprise the rows. One or more indexes may be associated with each table. An index is an ordered set of pointers to data records in the table based on the data in one or more columns of the table. In some cases, all the information needed by a query may be found in the index, making it unnecessary to search the actual table. An index is comprised of rows or index entries which include an index key and a pointer to a database record in the table having the key column values of the index entry key. An index key is comprised of key columns that provide an ordering to records in a table. The index key columns are comprised of the columns of the table, and may include any of the values that are possible for that particular column. Columns that are used frequently to access a table may be used as key columns. Using an index to search and access rows in the associated table substantially improves query performance.
Database tables may be accessed using the Structured Query Language (SQL) commands, which comprises a recognized language to query, access and manipulate data in a database. The SQL language includes set operators that define operations to be performed when searching columns of database tables. For instance, a SQL set operator may look for all records having a field that satisfies a certain search condition, such as equal to, less than, etc. to a certain value. Moreover, the search may involve joins. A join operation combines or concatenates the rows from different tables and then searches for those concatenated rows that satisfy a search predicate. Rows from the tables involved in a join operation that do not satisfy the predicate or condition are excluded from the join result.
The method for retrieving data from a specific table or joined tables, such as whether indexes are used or not, is called the access path. The access plan for an SQL query involves a set of access paths. The component within the DB2 query engine that determines the access plan to be used is known as the optimizer. During the static preparation of an SQL statement, the SQL compiler is called to generate an access plan. The access plan contains the data access strategy, including index usage, sort methods, locking semantics, and join methods. The executable form of the SQL statement is stored in the system catalog tables when a BIND command is executed (assuming a deferred binding method). This is called a package.
One challenge in managing a relational database involves providing techniques to optimize the SQL queries, also known as SQL tuning. SQL tuning is the process of identifying poorly structured access plans, analyzing why the plan is poorly structured, and taking some action to improve the performance of the query. The access plan may provide poor performance because the physical design of the database does not coincide with an efficient access path, the SQL statement is coded inefficiently, information (or statistics) provided to the optimizer are insfficient or inaccurate, and the cost model is inaacurate and imperfect. Further, for complex queries, the optimizer uses heuristic algorithms which may trim the search space to conserve time and space. Such heuristic algorithms might adversely effect a determination of a preferable access plan.
Some prior art SQL tuning programs are deployed when database administrators or application developers encounter a performance problem due to an SQL statement with an inefficient access path. In the prior art, the administrator might look at the access plan and attempt to determine the performance bottleneck, e.g., an inefficient access method, bad join sequence, etc., rewrite the query, collect statistics, such as the cardinality and frequency, alter the physical design, perform database maintenance, such as reorganization on the table spaces and indexes, alter statistics to influence the optimizer, and provide optimization hints to the optimizer. Examples of an SQL tuner include the International Business Machines Corp. (IBM) Visual Explain software product, described in the publications "Using AS/400 Database Monitor and Visual Explain To Identify and Tune SQL Queries", published as a Redpaper, (January 2001) and "DB2 UDB for AS/400 Visual Explain Illustrating the Secrets", Redpaper No. 0505 (January 2001), which publications are incorporated herein by reference in their entirety. SQL tuning techniques are also described in the IBM publication "DB2 UDB V7.1 Performance Tuning Guide", IBM publication no. SG24-6012-00 (December 2000), which publication is incorporated herein by reference in its entirety.
There are drawbacks in administrators using SQL tuning tools. Often, the database administrator lacks the skill and time to investigate the root cause of the SQL performance problems and implement adequate solutions, thereby resulting in inconsistent methods of analysis and solutions to SQL tuning that are limited by the skill and experience of the database administrator. In fact, there are a limited number of database administrators that possess sufficient expertise to collect statistics, build indexes, rewrite an SQL statement, consider all possible solutions and then select a best access plan. Further, even though certain SQL tools provide a visualization of an access plan in a Graphical User Interface (GUI), many database administrators are still unable to select an optimal path merely based on a visualization of an access path graph.
For these reasons, there is a need in the art to provide improved techniques for SQL tuning.

Method, system, and program for performance tuning a database query

International Business Machines Corporation


An electro-optical device and a method for displaying an image are disclosed. A clear image with a clear profile can be displayed therein by processing input image data, for example input image data of TV broadcasting received by the device.

1. Field of the Invention
This invention relates to a display device such as a direct-projection type of television receiver, a projection type display device, an image output device for a computer, etc., which utilizes a cathode-ray-tube (CRT), a liquid crystal device, a plasma device, an electroluminescence device, an electrochromic device or the like. Also, this invention relates to a method for displaying an image.
2. Description of the Prior Art
When a color image is displayed with plural dots in a conventional display device, plural colored areas such as A-colored area, B-colored area, C-colored area, D-colored area, etc., are separately displayed for any color image. Also, in both cases of monochromatic image and color image, the image is displayed with areas having different brightness being separated respectively. In this display manner, a mixing color frequently occurs at a boundary between the different colored areas on the display device, and thus a clear image can not be displayed. Also, color becomes ambiguous at a boundary between the areas having different brightness. This is not only because of the problem of the ability of the display device, but also because high frequency components in the image signal are cut when the image signal is created or processed to send the image signal to the display device, that is, before the image signal is received by the display device. The signal waveform becomes gentle by the cut. This becomes a problem particularly in the case of the display for office automation which requires high definition.
In order to overcome the above disadvantage, the following method has been adopted.
That is, as shown in FIG. 3, an original image data 1 is subjected to a profiling processing to obtain a profile image data 2, and then the original image data 1 and the profile image data 2 are synthesized with each other to obtain a synthesized image data 3, thereby displaying the synthesized image data 3 on the display device.
However, this method requires a very high-speed calculation per frame, and thus has been unsuitable for a dynamical image displaying operation which requires a displaying speed above 60 frames per second.
It is an object of the present invention to provide novel methods for displaying an image with a clear outline (profile).
It is another object of the present invention to provide an electro-optical device capable of displaying an image with a clear outline (profile).
According to one of the novel methods, the most marginal profile of neighboring same color areas is colored with black, thereby depressing the color mixing between neighboring different color areas.
In accordance with the present invention, an electro-optical device for displaying a color image with a dot matrix comprising dots on plural X-axes and Y-axes in a dot-sequential scanning operation or a line-sequential scanning operation, includes means for converting color data of most marginal positions of plural adjacent image data of same color on the X-axes into a back-color data when the image data of same color are adjacently arranged on any one of the X-axes.
According to the same concept, color data of most marginal positions of plural adjacent image data of same color on the Y-axes can be converted into a black-color data when the image data of same color are adjacently arranged on any one of the Y-axes.
According to the electro-optical device thus constructed, such a clear image (data 3) as shown in FIG. 3 can be obtained without a high-speed displaying operation utilized in the conventional display device.
In the foregoing description, when plural image data of same color are adjacently arranged, the color data at the most marginal positions of the image data are converted into back-color data to obtain a clear image. In place of the color conversion, when plural image data of same luminance (light intensity) are adjacently arranged in a gradation displaying operation, the luminance (light intensity) data at the most marginal positions of the image data may be changed to high or low luminance (great or weak light intensity) data to obtain a clear image. This technique is applied to a case where when a high-luminance image (more retina-stimulating image) is displayed with a background of low luminance, a profile of the high-luminance image (that is, a more recognizable image) is further stressed (that is, the light intensity of the profile of the image is further intensified) to thereby bring an image to be displayed (e.g., a white letter) into relief from a background (e.g., a white background) and obtain a clear image.
Therefore, in this invention, not only color-conversion to back color, but also variation of luminance (light intensity) can be performed individually or in combination when plural same color image data are adjacently arranged on the display device.
In a combination of special colors, there is a case where colors other than black color are required as the color into which the color data of the most marginal positions of the adjacently-arranged image data should be converted. This invention is also applicable to this case by changing the color conversion to the black color to the color conversion to another color.
Methods obtained by generalizing a bit mathematically the above idea are as follows.
One method is to calculate an average brightness of input image data in a specific section and then to divide the specific section into areas having brightness of input image data not lower than the average brightness and areas having brightness of input image data not higher than the average brightness. And a maximal value (maximum value) and a minimal value (minimum value) of the areas are used as output data for displaying those areas. The discontinuous maximal and minimal values of those areas may be outputted, however, tone and brightness are steeply changed between the areas in this case, so that the image thus displayed might give an unnatural impression visually. This unnaturalness can be avoided by providing a transition section between the area of the maximal value and the area of the minimal value to connect the area of the maximal value to the area of the minimal value and vice versa by new data of the transition section which are continuously changed in the brightness thereof. For example, the gradient of input image data at a cross point of input image data with the average is calculated and then a straight line having the gradient and passing through the cross point is used as the image data for the transition section.
Another method is to calculate absolute values of a derived function of the input image data and to use, as output image data for a section sandwiched between addresses having absolute values showing peaks in the derived function, the input image data at the lowest absolute values in the same section in the derived function. In this case too, discontinuous brightness is displayed as in the above method, so that the problem as mentioned above can be overcome in the same way.
Further, another method is to calculate absolute values of a derived function of the input image data and to use, as output image data, data obtained by emphasizing only the adjacency of the absolute values showing peaks. That is, since tone and brightness of the image are transiting at the peak points of the absolute values of the derived function, the presence of the transition section can be emphasized by emphasizing the adjacency of the peak points.
The above methods are effective for emphasizing the boundary between adjacent areas having different tone and brightness. That is, in the above methods, the display device has a system to distinguish boundaries and to correct images in accordance with the boundaries by some mechanical or automatic means. The display device having such a system is effective not only as a usual office automation instruments but also as a display device for amusement.
For example, 525 scanning lines are used for TV broadcasting of NTSC system. When the width of the image plane is made 1.5 times as long as the height thereof to increase the horizontal resolution to 800 lines, which is 525 lines xc3x971.5, a wideband carrier wave of at least 30 MHz is required. However, only a few MHz was applied actually, so that it was impossible to transmit fine images. In particular, the image in the width direction became blurry or ambiguous though that in the height direction had high definition. This is because high frequency components of the image carrier wave band were cut, that is, image signals were made gentle.
On the other hand, the ambiguousness of images has not been recognized in the case of CRT system. Since the CRT system utilizes dot sequential scanning system, special high frequency circuit for processing signals, e.g. electron beam having such a high frequency as 30 MHz, is indispensable.
However, conditions are different in displays such as LCD and PDP which utilize line sequential scanning system. For example, in the devices such as LCD and PDP in 800xc3x97525 matrix as the above, image signals per column are processed parallel, so that the process time is 800 times as short as that of CRT system display. Hence, the above-mentioned image processing is considered to be suitable to, specifically, LCD and PDP.

Method for displaying an image having a maximal brightness

Semiconductor Energy Laboratory Co., Ltd.


Ball striking devices, such as golf club heads (including putter heads), have a high moment of inertia about their center, to help prevent twisting and mis-hits, particularly when the ball striking device hits the ball at a somewhat off-center position. The ball striking head of the ball striking device may be structured and/or weighted (optionally with separately attachable weight elements) to have a moment of inertia about a center of the ball striking surface of at least 10,000 g-cm2, and in some examples, the moment of inertia may be at least 11,000 g-cm2, or even at least 12,000 g-cm2. In some examples, the moment of inertia may be at least 20,000 g-cm2, or even at least 25,000 g-cm2 or at least 28,000 g-cm2.

Golf is enjoyed by a wide variety of players—players of different genders, and players of dramatically different ages and skill levels. Golf is somewhat unique in the sporting world in that such diverse collections of players can play together in golf events, even in direct competition with one another (e.g., using handicapped scoring, different tee boxes, etc.), and still enjoy the golf outing or competition. These factors, together with increased golf programming on television (e.g., golf tournaments, golf news, golf history, and/or other golf programming) and the rise of well known golf superstars, at least in part, have increased golf's popularity in recent years, both in the United States and across the world. The number of individuals participating in the game and the number of golf courses have increased steadily over recent years.
Golfers at all skill levels seek to improve their performance, lower their golf scores, and reach that next performance "level." Manufacturers of all types of golf equipment have responded to these demands, and recent years have seen dramatic changes and improvements in golf equipment. For example, a wide range of different golf ball models now are available, with some balls designed to fly farther and straighter, provide higher or flatter trajectory, provide more spin, control, and feel (particularly around the greens), etc.
Being the sole instrument that sets a golf ball in motion during play, the golf club also has been the subject of much technological research and advancement in recent years. For example, the market has seen improvements in golf club heads, shafts, and grips in recent years. Additionally, other technological advancements have been made in an effort to better match the various elements of the golf club and characteristics of a golf ball to a particular user's swing features or characteristics (e.g., club fitting technology, ball launch angle measurement technology, etc.).
Despite the various technological improvements, golf remains a difficult game to play at a high level. To reliably fly straight and in the desired direction, a golf club must meet the golf ball square (or substantially square) to the desired target path. Moreover, the golf club must meet the golf ball at or close to a desired location on the club head face (i.e., on or near a "desired" or "optimal" ball contact location") to reliably fly straight, in the desired direction, and for a desired distance. Off-center hits may tend to "twist" the club face when it contacts the ball, thereby sending the ball in the wrong direction, imparting undesired hook or slice spin, and/or robbing the shot of distance. Club face/ball contact that deviates from square and/or is located away from the club's desired ball contact location, even by a relatively minor amount, also can launch the golf ball in the wrong direction, often with undesired hook or slice spin, and/or can rob the shot of distance. Accordingly, club head structures that can help a user keep the club face square through the contact zone and/or resist twisting during the swing and/or at contact would tend to help the ball fly straighter and truer, in the desired direction, and often with improved and/or reliable distance.
Like other golf clubs, putters also must make square contact with the golf ball, in the desired direction or path, in order to produce straight and true rolls in the desired direction. If the putter head twists during the stroke, this will tend to send the ball off-line and/or decrease the distance the putt travels. Additionally, off-center hits on the putter's face (i.e., hits away from the putter's desired ball contact location) will tend to cause the putter head to twist when it contacts the ball, which again tends to send the ball off-line and/or decrease the roll distance. Accordingly, putter head structures that can help users keep the club face square to the target line through the contact zone and/or prevent the club head from twisting during the swing and/or at contact will tend to help the ball roll straighter, truer, and in the desired direction.

Structure of a golf club head or other ball striking device


An apparatus constructed from a combination of a magnetic north orienting lodestone, magnetostrictive ferrogel, and piezoelectric crystals can generate electrical current when exposed to kinetic motion. The apparatus is built in the shape of a geodesic sphere with two sections, an inner sphere with a lodestone in the center surrounded by outward-facing magnets, and an outer sphere with sections of stacked magnetostrictive ferrogel and piezoelectric crystals interspaced with inward-facing magnets. Upon the apparatus being given a kinetic impulse, the inner sphere will orient to magnetic north, which will cause the outward-facing magnets to pass next to stacks of ferrogel/piezoelectric crystals. The ferrogel will react by physically changing in size, imparting an impulse to the piezoelectric crystal, which will in turn release a pulse of electrical current.

A lodestone, either naturally occurring or man-made, will, if given freedom of movement, always orient itself along the Earth's magnetic field lines. Magnetostriction is the principle where a material with the correct properties will physically change shape when exposed to a magnetic field. Ferrogel is a gelatinous compound with magnetostrictive properties. A piezoelectric crystal will generate a spike of electrical current when physically deformed.

Kinetic micro-generator: a method of generating electrical current via magnetostriction and the piezoelectric effect


A configuration includes a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

In recent years, in accordance with reduction in size, reduction in thickness, and high performance of mobile terminal equipment represented by a mobile phone, the further reduction in thickness and the further reduction in size of a chip component of an electronic component have been required. However, with mere reduction in size and mere reduction in thickness of the chip component, it is expected that there will be great difficulty in performing a manufacturing step such as mounting of the chip components on a circuit substrate or the like.
On the contrary, in Unexamined Japanese Patent Publication No. 9-171959, an electronic component having an organic film of a predetermined size and a plurality of functional components mounted on this film in a predetermined order and a method for manufacturing thereof are disclosed. This method for manufacturing the electronic component is characterized by having a first feeding step for feeding a tape with a predetermined width, a second feeding step for feeding a plurality of tapes on which the functional components are mounted, and a mounting step for mounting a plurality of functional components on a tape to be supplied in the first feeding step in a predetermined order.
In this composite electronic component, a resistor, a capacitor, and an inductor or the like are mounted in plural on one piece of a unit substrate. Accordingly, as compared to a method for individually mounting an electronic component manufactured individually, for example, a chip component or the like on a circuit substrate, this composite electronic component can be made with high density. However, this composite electronic component is composed in such a manner that the electronic components formed by a thin film are aligned on a flat surface and in such an arrangement configuration on a flat surface, there is a limitation in an integration degree of the electronic component.
On the contrary, in Unexamined Japanese Patent Publication No. 2005-45112, for example, it is disclosed that the electronic components are laminated and formed on a base material to be made into a three-dimensional configuration. This component-incorporated flexible circuit substrate has a base material made of a flexible heat-resistant resin film; and at least one piece of a thin film passive component configured by sandwiching a functional thin film formed by using any material of a dielectric body, a resistor, and a conductor by a first electrode circuit wiring and a second electrode circuit wiring, which are formed by a conductor thin film. Then, the component-incorporated flexible circuit substrate is configured in such a manner that the film thickness of any of the first electrode circuit wiring, the second electrode circuit wiring, and the functional thin film is thinner than that of the base material and a plurality of layers of the thin film passive components is laminated on the base material to form a passive component lamination.
This component-incorporated flexible circuit substrate uses a technique to directly form a functional thin film such as a capacitor and a resistor of a thickness not more than 1 μm on a thin organic film base material, and as compared to a conventional chip component, it is possible to make the thickness into about 1/100. Further, if a base material that is thin and flexible is used, it is also possible to arrange a device in limited space. In addition, by laminating the sheets having a device function with each other and connecting them, a wiring length between the devices can be made very short, so that transmission loss of a high frequency signal can be reduced. Further, since a plurality of passive components can be laminated, it is possible to largely improve the freedom of design of a circuit.
In the Unexamined Japanese Patent Publication No. 9-171959, since each electronic component is formed by a thin film forming method or a printing method, as compared to a conventional chip component, each electronic component can be made largely thin. In addition, by examining individual electronic components in advance or trimming them, properties of the individual electronic components can be adjusted, so that only a good-quality product is mounted on a master tape to be made into a composite electronic component. However, according to this example, an electronic component of a flat surface configuration to align and mount respective electronic components on a flat surface is only obtained.
On the other hand, in Unexamined Japanese Patent Publication No. 2005-45112, since the electronic components are laminated three-dimensionally by using the thin film forming method, reduction in size and reduction in thickness of the electronic component can be made. Although, according to this example, for example, an example that a capacitor, capacitors with each other, or a capacitor and an inductor are laminated is indicated, in order to laminate them by using the thin film forming method, a film formation step and a pattern processing step should be repeated many times, so that the step is made very complex. In addition, the case that the previously manufactured thin film electronic component becomes defective due to the influence of a manufacturing step of the thin film electronic component to be laminated on this is easily generated. For example, in the case of forming a resistor on the capacitor that has been manufactured previously, short-circuiting of a capacitor and deterioration of a property are easily generated by heating when forming the resistor and etching to make a predetermined pattern or the like. As a result, a yield rate as a laminated finished component-incorporated flexible circuit substrate is made low, so that there is a problem that the cost becomes high.

Sheet-like composite electronic component and method for manufacturing same


An apparatus and method is disclosed for facilitating a dark field inspection. The workpiece inspection apparatus comprises three sides and a light-blocking top and defines a dark field inspection area. Light incident on the top is substantially blocked while a clean room environment is maintained by allowing air to permeate through the top.

The present invention relates generally to an apparatus and method for detecting workpiece defects and, more particularly, to a dark field inspection apparatus and method for detecting defects on a workpiece in a clean room environment.
Workpieces such as, for example, wafers, are typically in the form of a flat, substantially planar disk. Workpieces may include semiconductor wafers, magnetic disks and optical disks. For many applications, particularly in the area of integrated circuits, the wafer serves as a high-tech building block. In order to produce quality microelectronic devices, it is desirable that the wafer surface be uniform, planar and devoid of any imperfections.
Chemical mechanical planarization (CMP) is an abrasive process used for polishing the surface of the wafer. The CMP process involves the use of chemical slurries and a circular (sanding) action to polish the surface of the wafer. Slurry is a chemical polishing agent deposed upon the wafer while on a polishing pad. After the polishing step, the wafer is cleaned and rinsed to remove the slurry. A wafer may undergo several steps of cleaning, rinsing, polishing and drying in the CMP machine to remove any debris from the wafer surface. For example, the manufacture of a semiconductor wafer generally includes xe2x80x9clayeringxe2x80x9d dielectrics or metals on the wafer surface. After each layer is formed, the wafer surface is typically cleaned, polished, rinsed and dried. The smooth surface is now ready for further processing steps or for the next layer to be applied to the surface.
The CMP process to some degree smooths out minor defects in the wafer surface which result from, for example, slicing the wafer from a silicon ingot. However, the CMP process itself can introduce or reveal several types of yield-limiting defects, including residual slurry, surface voids and surface particles. Residual slurry remaining on the wafer as a result of inadequate cleaning can unevenly raise the surface level.
Wafer surface defects are considered xe2x80x9ceventsxe2x80x9d that lead to or can lead to electrical faults in microelectronic circuitry. The events are first identified and then reviewed to determine if they represent defects that can adversely affect subsequent device performance. Defects are found on both patterned and unpatterned wafers. An unpatterned wafer is a bare silicon wafer or a wafer with various blanket films coated thereon. A patterned wafer has undergone a photolithography process wherein geometric shapes have been transferred to the surface of the wafer.
A surface void is a divot on the wafer surface caused by an embedded particle (e.g., dust) or a weak point in the top layer that is ripped out or dislodged during processing. For example, a small foreign particle may be xe2x80x9ccoatedxe2x80x9d on the surface during the layering step and subsequently dislodged from the surface. Thus, a void or dimple remains where the particle once was. Alternatively, surface particles may adhere to the surface after the layering step resulting in a small rise (mound) in the surface. Similarly, the dielectric or metal used in the layering step may become contaminated with a trapped particle prior to or during the layering step. Once applied, the layer will exhibit xe2x80x9croughxe2x80x9d areas where contaminates are present.
Microscratches on the wafer surface are caused by small particles, debris or similar foreign objects caught between the polishing pad and the wafer surface. During the polishing step, the particle causes a xe2x80x9cscratchxe2x80x9d on the wafer surface. In some cases, the microscratch may be inadvertently filled with a deposited material (e.g., tungsten) during a tungsten CMP process application.
After the wafer has undergone a CMP process, including layering the wafer with dielectrics or metals, the wafer proceeds to a photolithography process. Photolithography is a means for transferring shapes from a mask to the surface of a wafer, producing a patterned wafer. The steps involved in the photolithographic process will be briefly discussed. First, the wafer is chemically cleaned to remove any remaining foreign matter from the surface such as, for example, traces of organic, ionic and metallic impurities.
Silicon dioxide (SiO2) maybe deposited on the surface to serve as a barrier layer, whereupon a photoresist maybe applied to the surface. The wafer is spun at a high speed, called xe2x80x9cspin coating,xe2x80x9d to produce a thin uniform layer of photoresist on the surface. Traditionally, there have been two types of photoresist, positive and negative. Negative resists were common in the earlier years of integrated circuit processing, but more recently positive resists are the prevalent type of resist used in VLSI (very-large-scale-integration) fabrication processes. For positive resists, the wafer is exposed with UV (ultraviolet) light wherever the underlying material is to be removed. In this resist, exposure to the UV light changes the chemical structure of the resist so that it becomes more soluble in the developer. The exposed resist is then washed away by the developer solution, leaving windows of the bare underlying material. The mask used contains an exact copy of the pattern which is to remain on the wafer.
The photoresist coating becomes photosensitive, or imagable, after a soft-baking step. During soft-baking, nearly all of the solvents are removed from the photoresist coating. If considerable solvent remains in the coating, the positive resist may be incompletely exposed.
The mask is a glass plate with a patterned emulsion of metal film on one side. The mask must be aligned with the wafer in the location that the pattern is to be transferred to the surface. The glass plate is a lens which directs the UV light onto the wafer. Exposure time can vary depending upon, for example, the sensitivity of the resist and the lens aperture. Once aligned, the photoresist is exposed through the pattern on the mask with a high intensity UV light, creating on the wafer surface a xe2x80x9cprintedxe2x80x9d replica of the mask pattern.
The wafer is then placed in a developer solution until the resist becomes completely soluble (i.e., for positive resists), and then hard-baked to improve adhesion of the photoresist to the wafer surface and to cure the photoresist.
While not as common as in the CMP process, defects can and do occur during the photolithographic process. Briefly, the defects caused by photolithography can be grouped into three areas; (1) defects in the resist material, (2) problems with the pattern or equipment, and (3) errors in the printing or exposing processes. The photoresist material may become contaminated with a foreign particle, material or substance prior to spin-coating. As a result, the photoresist will contain small spurious particles causing an event. Additionally, residual resist (resist remaining after the developer step) creates xe2x80x9cwebbingxe2x80x9d between the printed lines on the wafer during the exposure step.
A printing defect can result from anomalies on the pattern. Any damage to the pattern (e.g., scratches) can affect the wafer duplication. Lastly, printing errors can cause defects such as, for example, a xe2x80x9cbridgingxe2x80x9d between two printed lines and large areas of unexposed photoresist.
Wafer manufactures ambitiously attempt to prevent defects due to the substantial threat of reduction in final wafer yields. Typically wafer production takes place in a clean room environment. A clean room is broadly defined as an uncontaminated or nearly uncontaminated room which is maintained for the manufacture or assembly of objects, e.g., semiconductor wafers. U.S. Federal standard 209E catagorizes clean rooms into classes defined by the levels of air cleanliness expressed in number of particles per cubic measure. For example, a class 100 room must have less than 100 particles per cubic foot; a class 10 room must have less than 10 particles per cubic foot, and so on. In general, as the class room number decreases, the number of particles per cubic measure allowed decreases.
Many of the particles present in the air, on clothing and on skin, if brought in to contact with a workpiece, can fatally contaminate the workpiece (i.e., workpiece must be discarded). Contaminates may include dust particles, skin, hair, body oils, fibers, and even small living organisms such as dust mites. Potentially, each of these contaminates can fall on a workpiece or in a material used to xe2x80x9ccoatxe2x80x9d the workpiece and subsequently result in an event.
Workpiece (e.g., wafer) defects can be reduced by limiting contaminates in the manufacturing room to less than 10 particles per cubic foot (class 10). To achieve such a low rate of xe2x80x9cloosexe2x80x9d particles in the air, on the equipment and on the human operators, clean room technologies are employed. Continuous air flow, ventilation and filtration are essential to maintaining low particle count. Hepa filters may be installed in the ceiling and floor to continuously draw air in for particle filtering. The floors may be raised in a grid-like fashion to allow air venting under foot. The operators can comfortably walk atop the grids without noticing the spacing between the grids which allows air and large contaminates to flow through the raised floor. This reduces the risk of operators xe2x80x9cpicking upxe2x80x9d fallen particles while working in the clean room.
Perhaps the most common source of contaminates and the hardest to control in a clean room environment are human contaminates. Skin fragments and hair follicles are continually shed from the human body. Each time a workpiece is handled by a human operator, skin, hair and body oils may be inadvertently transferred from the human to the workpiece surface. To prevent this, operators are typically required to wear full body suits made from lint-free material. Nearly every inch of human skin is covered as well as the operator""s shoes. The head is hooded with several layers of material to keep hair from dropping in the room. The nose and mouth must also be covered to help prevent particles from being cast into the air during exhale. Again, clean room ventilation plays an important part in filtering the air to collect exhaled particles.
Even with the precautions mentioned above, wafer defects nonetheless occur during manufacture (e.g., CMP and photolithography). Wafer defect detection, analysis, and resolution play an important role in keeping wafer processes and yields under control. In fact, as long as there has been semiconductor manufacturing, and more particularly VLSI circuitry, defect inspection has been vital to identifying sources of potential electrical faults. As disclosed previously, the types of defects can vary depending upon which production stage the defect originates (e.g., pre-CMP, post-CMP, lithography). Many manufacturers must perform intermittent inspections throughout production searching for different types of defects each time.
Companies such as KLA-Tencor Corp. have introduced high tech tools for patterned and unpatterned wafer inspection. For example, KLA-Tencor""s AIT II is a patterned defect inspection tool that offers automated double-dark field (DDF) laser scanning technology, real-time signal processing algorithms, and an automatic defect classification for analysis. The Surfscan(copyright)SP1 inspection tool, designed by KLA-Tencor, performs highly sensitive inspection of unpatterned wafers. The SP1 features multiple dark field collection optics and an optional bright field channel and can detect and classify defects on all types of unpatterned surfaces. An advanced feature of the SP1 called Surface NanoTopography(copyright) (SNT) provides quantitative measurements of topography variations with nanometer sensitivity over millimeter ranges.
New process technologies such as CMP introduce unknown classes of surface defects requiring companies to continuously update and advance their latest defection tools. As wafer manufacturing processes increase in complexity, defect detection costs are driven up. For example, an automated wafer detection tool as previously described can cost the wafer manufacturer $500,000 or more, and with each new advanced feature further increasing the overall cost. Keeping up with defect detection may pose a daunting economic challenge even the largest semiconductor manufacturers.
Human inspectors may also be employed to inspect workpieces and can after spot defects as small as 0.5 xcexcm. Typically, not every wafer is inspected, but rather a statistical sampling of wafers is inspected from a particular cassette or lot. In practice, the operator removes a wafer from a cassette and inspects the wafer for surface defects. Because the CMP and photolithography processes are generally performed on a cassette or xe2x80x9clotxe2x80x9d of wafers at a time, a periodic sampling of the cassette should give an accurate account of any post-production defects present in the entire cassette. If the inspector discovers a defect on a sampled wafer, additional wafers may be inspected from the cassette. Upon discovery of a defect, the inspector may view the wafer under a microscope located at the inspector""s inspection station. Microscope viewing is also useful for xe2x80x9cspot-checkingxe2x80x9d the printed lines on the wafer and may be performed at any time during the inspection process.
As previously discussed, a photoresist pattern is duplicated onto the wafer surface. FIG. 1 illustrates an exemplary resist pattern atop an oxide layer which is coated on the wafer surface. Both the resist patterns 100 and the oxide layer 125 are light transparent, therefore light can pass through to the wafer surface 150 where it is reflected back. Light which is directed on-axis to the wafer 130 is high intensity and can be easily detected with the human eye. The reflected light 140 is substantially equal in intensity to the incoming light 130 and is equally easily detected by the human eye.
Light photons are scattered from the edge of the resist features 160. The scattered light intensity is much less than the intensity of the incoming 130 or reflected light 140 and, hence, the contrast is very low making it extremely difficult to detect the patterned resist. Defects in the pattern are even more difficult to spot over the high intensity incoming and reflected light. To avoid this problem, the high intensity light is blocked to create a xe2x80x9cdark field option.xe2x80x9d The scattered light from the edge of the resist features is more easily seen in a dark field option.
Presently known dark field methods used by inspectors are grossly inadequate and include simulating a dark field by physically holding a covering over the wafer. Simply, the inspector uses one hand to hold an opaque, such as black or similar non-transparent hue, piece of paper over the workpiece (e.g., wafer) and the other hand to hold the workpiece. Ideally, the paper will block the surrounding light thus creating a dark field to view the wafer. In practice, however, to effectively block the light from all angles, the paper has to completely encompass the wafer or at least encompass the sides, top and back. Holding a light shielding structure large enough to adequately surround the dimensions of the wafer (i.e., wafers average about 8 to 10 inches in diameter), while permitting the inspector to move the wafer to observe the surface, is cumbersome and awkward.
Current dark field techniques are not well suited to a proper clean room environment. Even with the extensive measures discussed above for a class 10 clean room, particles such as dust, clothing fibers and debris are still present near the inspector""s work station. Introduction and movement of objects at or near the station causes the particles to xe2x80x9cstirxe2x80x9d and become afloat in the air. Proper ventilation at the inspection station helps to draw loose particles from the air into the filter systems either above or below the station. Presently, each time the inspector readjusts the handheld dark field structure, particles are stirred-up and set afloat. The air between the structure and the wafer is filled with loose particles which can drop upon the wafer. The structure does not contain adequate ventilation to draw the particles away from the wafer because even the smallest hole in the structure would allow light to shine through and thus destroy the operator""s dark field.
Accordingly, there exists a need for a workpiece inspection method and apparatus that is cost effective yet reliable. More particularly, there is a need for a dark field inspection method and apparatus to assist human inspectors in detecting workpiece, such as for example, wafer, defects. Further, there is a need for a method and apparatus that enables wafer inspectors to undergo defect detection with a dark field option while maintaining the integrity of a clean room environment.
The present invention overcomes the problems outlined above and provides an improved method and apparatus for workpiece inspection. More particularly, the present invention provides a dark field option for workpiece inspection particularly useful in a clean room application. A preferred embodiment of the present invention comprises a structure having three sides and a multi-dimensional top. Air is allowed through the top surface of the structure.
In a preferred embodiment, a dark field inspection structure includes a top having a plurality of spaced-apart slats. The slats of each layer are offset from the slats of the next layer. The offset configuration substantially blocks the incident light by either reflecting or absorbing the light. A spacing defined by each slat and layer of slats permits air to flow through the top.
In one embodiment, the inspection structure comprises a substantially opaque and antistatic material.
In another embodiment, the inspection structure comprises a thin slot for transporting a workpiece.

Method and apparatus for improving a dark field inspection environment


Child entertainment apparatus and methods of operating the same are disclosed. An example child entertainment apparatus includes a frame and a support suspended for swinging movement relative to the frame. The support is elastically elongatable. A child seat is carried by the support and thus is able to swing and bounce relative to the frame. A drive arm extends between the frame and the seat and includes a first end journalled for rotation relative to one of the frame or the seat and a second end slidably coupled to the other of the frame or the seat.

Infant swings of various types are known. One type of infant swing is an open top swing which, as its name suggests, does not include a bar or housing member above and across the seat. This opening above the seat facilitates inserting/removing an infant to/from the swing. Open top swings generally include a base or frame member which is disposed on the ground surface. A swing assembly is connected to and depends from the frame. The swing assembly is adapted to pivot relative to the frame assembly. The desired swinging movement is generated either manually or by a drive motor.
Infant jumpers of various types are also known. Some jumpers include a seat and spring supports for suspending the seat from a door frame or the like. A small child located in the seat can obtain exercise and entertainment by moving to cause the jumper to bounce within the door frame.
Bouncers which are constructed as reclined seats or bassinets are also known. These bouncers include a frame that positions the seat in a reclined position. The frame, which may be constructed of wire, experiences damped oscillatory movements when the child moves or when a care provider intentionally bounces the frame. Sometimes a mechanical vibrator is coupled to the frame to provide vibrations that can soothe or entertain an infant located in the bouncer.
In recent years, walker alternatives have been developed. Walker alternatives (sometimes referred to as bouncers, activity centers or child entertaining apparatus) generally include a base and a seat/sling that is suspended from a tray above the base. The tray is typically spaced a sufficient distance above the base such that the feet of a child seated in the seat/sling can reach the base to simulate standing. In some known walker alternatives, the tray is suspended above the base using adjustable columns to permit adjustment of the distance between the tray and the base to fit the height of the child.
The seats/slings of the known walker alternatives are typically rotatably suspended in the center of their trays such that the seats/slings are surrounded on all sides by their corresponding trays. Toys can be placed at various positions on the tray to encourage a child suspended in the seat/sling to use his/her legs to rotate themselves to reach the toys of interest. The bases of some known walker alternatives are cupped or bowled (e.g., semi-spherical) to permit rocking of the walker alternative. Some walker alternatives also suspend their trays, and, thus, their seats, using springs to permit bouncing of the tray, seat and/or child.

Child swing and jumper apparatus and methods of operating the same


Fire escape apparatus comprising a main elongated hollow tubular member with an elongated slot and a relatively short auxiliary tubular member of similar construction. The main member is mounted on an exterior building wall and the auxiliary member extends therefrom to a building opening such as a door or window. A spherical member at the end of a flexible connecting line running to a building occupant is entered in the auxiliary tubular member and is controlled in its descent by frictional engagement with gradually arcuate spring-like members.

In accordance with the present invention and in fulfillment of the foregoing object, a main elongated hollow tubular member is provided with an elongated slot opening through its sidewall substantially throughout its length. The member is mounted vertically on a building exterior wall adjacent to at least one opening such as a door or window above the ground floor. At least one relatively short hollow auxiliary tubular member open at opposite ends and with a slot opening though its side is mounted on the building exterior with one end adjacent the door or window opening and the other end adjacent the main tubular member. The intermediate portion of the member is inclined downwardly from the door or window to the main tubular member. An opening in the wall of the main tubular communicates with the interior of the auxiliary member at its lower end and the slots of the two members also communicate. The upper end of the auxiliary member is positioned within reach of an occupant of the building attempting to escape the door or window. Both the main and auxiliary tubular members have first braking means in their interior substantially throughout their length and a second braking means co-operable with the first braking means is also provided. A connecting device extends from the second braking means to the occupant enabling the latter to activate the two cooperating braking means and slowly and safely descend to the ground.
The first and second braking means are important aspects of the invention and respectively comprise a series of gradually arcuate spring members arranged generally in opposing pairs on opposite interior surfaces of the tubular members and a spherical member dimensioned to engage and pass between the spring members in a frictionally restrained downward movement at a predetermined safe rate of speed.
The tubular members each take a generally rectangular cross-sectional configuration with interior dimensions serving to substantially center the spherical member between the spring like members and to insure positive engagement therebetween.
Preferably, the spherical members are provided with a plurality of size-adjusting elements to accommodate building occupants of varying weight.
The connecting means between the spherical member and the occupant may be held manually by the occupant but in a preferred embodiment a harness is provided for the occupant and is readily attachable to a connecting means.


A cooking appliance includes a body that defines a cooking chamber therein, a door rotatably connected to the body and configured to open and close at least a portion of the cooking chamber, a hinge mechanism that rotatably connects the door to the body, and a control device disposed in the door. The control device includes a control housing that is configured to accommodate one or more components of the control device and that includes a first sidewall that defines an air inlet, and a second sidewall that defines an air outlet, an inlet-side cooling fan disposed at a first position of the control housing closer to the air inlet than the air outlet, and an outlet-side cooling fan disposed at a second position of the control housing closer to the air outlet than the air inlet.

A cooking appliance is an appliance that can cook food using heat from a heat source.
In some case, the cooking appliance may include a body having a cooking chamber, at least one heat source disposed at the body, and a door connected to the body and configured to open and close the cooking chamber.
The cooking appliance may further include a control device that inputs a command for controlling the cooking appliance and that displays information to a user. The control device may include an operation unit that receives an operation of a user and a display unit which displays information.
In some examples, the control device may be disposed in the body or the door.
In some examples, a cooking apparatus may include a control PCB disposed in a door.
The cooking apparatus may include a cabinet having a cabinet opening defined in a front surface thereof, a door that has a door air gap, that is configured to open and close the cabinet opening, and a control panel installed in the door.
The door may include a control panel portion on which a control panel is installed for integration with the control panel, and the control panel portion may be located at an upper side of the door air gap. The control panel portion may be blocked from the door air gap by a control panel bracket located inside the door.
In the example cooking apparatus described above, air flowing through the inside of the cabinet may discharge from the cabinet through a cabinet exhaust port, and then enter the door through a door opening. Air introduced into the door may flow downward along the door air gap to cool the door.
In some cases, cooling of the control panel may be achieved by preventing or reducing heat transfer from the hot cooking chamber toward the control panel based on a cool air flow in the door air gap.
In some cases, although heat may be also generated in components inside the control panel, the cool air flow in the door air gap may block the heat of the cooking chamber transmitted to the control panel. Therefore, the components inside the control panel may not be cooled by the cool air flow.
The components inside the control panel may be damaged or cause malfunction of the components due to heat.