Methods, apparatuses, and systems for providing a body connection to a vertical access device. The vertical access device may include a digit line extending along a substrate to a digit line contact pillar, a body connection line extending along the substrate to a body connection line contact pillar, a body region disposed on the body connection line, an electrode disposed on the body region, and a word line extending to form a gate to the body region. A method for operation includes applying a first voltage to the body connection line, and applying a second voltage to the word line to cause a conductive channel to form through the body region. A memory cell array may include a plurality of vertical access devices.

The use of an access device with a storage element in memory cells is well known in the art. Examples of memory devices that utilize access devices include dynamic random-access memory (DRAM), resistive random-access memory (RRAM), magnetoresistive random-access memory (MRAM), and phase-change random-access memory (PRAM).
An ever-increasing demand for higher-density memory cell arrays has lead to the development of vertical memory cell devices. Vertical memory cell devices may enable higher-density cell arrays by offsetting an access device vertically from a storage element, thereby requiring less horizontal area than if the access device were offset horizontally from the storage element.
FIG. 1A is a simplified plan view of a portion of a conventional memory cell array 100. The conventional memory cell array 100 includes a plurality of vertical memory cells 101, a plurality of digit lines 104 (in dashed lines to show they are buried), and a plurality of word lines 114 (in dashed lines to show they are buried). The vertical memory cells 101 are arranged in rows (coupled to a common digit line 104) and columns (coupled to a common word line 114). Individual vertical memory cells 101 are located at a cross-point of a digit line 104 and a word line 114.
FIG. 1B is a simplified cross-sectional view of a vertical memory cell 101 taken along line 1B of FIG. 1A. The vertical memory cell 101 may be formed on a substrate 102. The vertical memory cell 101 includes a digit line 104, a body region 106 disposed on the digit line 104, an electrode 108 disposed on the body region 106, a word line 114 proximate to the body region 106, and a storage element 110 (e.g., a capacitor) disposed on the electrode 108. The vertical memory cell 101 also includes a dielectric material 112 on the substrate 102, and surrounding the vertical memory cell 101. The dielectric material 112 insulates the body region 106 from the word line 114.
A portion of the dielectric material 112 located between the body region 106 and the word line 114 is configured as a gate dielectric, and may comprise a dielectric with properties that are different from those of the remainder of the dielectric material 112.
The vertical memory cell 101 is configured to establish electrical connection and isolation between the digit line 104 and the storage element 110. In other words, the digit line 104, the body region 106, and the electrode 108 form an access transistor, with the word line 114 acting as its gate. In operation, a first voltage is applied to the word line 114, which may attract charge carriers to a segment of the body region 106 that is proximate to the word line 114. As a result, a conductive channel 116 (in dashed lines to show intermittent presence) may be formed through the body region 106 between the digit line 104 and the electrode 108. The conductive channel 116 enables the digit line 104 to access the storage element 110 for read or write operations.
If the first voltage is removed from the word line 114, the conductive channel 116 may be cut off, electrically isolating the storage element 110 from the digit line 104. As a result, by selectively applying the first voltage to the word line 114, electrical connection and isolation between the digit line 104 and the storage element 110 may be established. In addition, different combinations of voltages may be applied to the word line 114 and the digit line 104 to select a particular vertical memory cell 101 from the conventional memory cell array 100 for a read or write operation.
Although the vertical memory cell 101 may successfully establish electrical connection and isolation between the digit line 104 and the storage element 110, the body region 106 is a floating body. Consequently, the vertical memory cell 101 suffers from floating body effects, which may result in degraded charge retention time in the case of DRAM devices, and power distribution problems in the conventional memory cell array 100.

Apparatuses having a vertical memory cell


A refrigerator is provided comprising a cabinet, a door for providing access within the cabinet, an ice maker for making ice operably connected to the cabinet, an ice bin comprising a pair of opposite-facing walls and a bottom wall, disposed within the cabinet and located adjacent the ice maker, and a stir assembly positioned within the ice bin, comprising a stir stick, a cam rod, and a pair of breaker walls; wherein the stir stick is configured to oscillate about an axis of rotation, the cam rod is coupled to the stir stick; and the pair of breaker walls are engaged with the cam rod near the bottom of the breaker walls, and hingedly attached to the pair of opposite-facing walls.

Ice makers may be included with refrigerators, or may be stand-alone units. In general, the ice maker includes a water source, a cooling source, a mold, and an ejecting mechanism. Water is added to the mold, and the cooling source removes heat from the water to lower the temperature below freezing, at which time ice cubes are formed. Once the cubes have formed, the ejecting mechanism operates to remove or eject the formed cubes from the molds, at which point new water can be added and the process repeated.
The ejected ice cubes are generally directed towards an ice container or ice storage bin. In refrigerators and in stand-alone units, the ice container is located generally adjacent the ice maker so that the formed ice cubes do not have to travel a long distance from the ice maker. Furthermore, the cooled air of the cooling source may be used to direct cold air to the ice container to keep the ice cubes in the ice container below freezing to prevent the cubes from melting.
In a refrigerator, the ice maker and ice container may be positioned on the inside of a refrigerator compartment or freezer compartment door, with the ice maker generally positioned above the ice container such that gravity causes the formed ice cubes to fall from the ice maker to the ice container. The cooling source in a refrigerator may be cold air that is directed from the freezer compartment to the ice maker. The cooling source may also be any other cooling source known to those skilled in the art such as additional evaporators. The below-freezing air from the freezer removes enough heat to freeze the water in the ice molds. The same air may also be passed into the ice container to prevent the cubes from melting.
However, as the amount of cubes accumulate in the ice container, it becomes more difficult to ensure that all of the cubes are at a temperature to prevent melting. If air is passed into the container, it may not reach cubes that are located below other cubes. Warm air may also be introduced to the ice container if a door is opened or the ice container is opened to retrieve ice from the container. In any sense, the cubes in the container may experience some melting and refreezing. The melting and refreezing of the cubes can cause multiple cubes to freeze together, forming ice clumps. Sublimation may also lead to ice cubes clumping. The ice clumps are too large to fit through a dispenser opening, and therefore, it is important to provide means to prevent clumping, or to break up the clumps.
Stir sticks have been added to ice containers to aid in preventing and breaking up ice clumps. The stir sticks are configured to rotate within an ice container to move the cubes and to direct the cubes towards a dispensing area. However, the size and shape of ice containers do not make it feasible for the stir sticks to reach the full area within the containers. Therefore, there are areas within the container that still include conditions that allow the formation of ice clumps.

Stir stick and breaker walls for an ice container


In some embodiments, a valve prosthesis includes an inlet portion that is substantially s-shaped and configured to engage the floor of the outflow tract of the native heart atrium. In some embodiments, a valve prosthesis includes a chordae guiding element configured to reduce bending of the chordae to reduce stress on the chordae during the cardiac cycle. In some embodiments, a valve prosthesis includes a central portion having an hourglass shape configured to pinch a native annulus in order to provide axial fixation of the valve prosthesis within a valve site. In some embodiments, a valve prosthesis includes a frame having an outflow end that is flared to provide a gap between an outflow end of the frame and an outflow end of prosthetic leaflets when the prosthetic leaflets are fully opened.

1. Field
Certain embodiments of the present invention are related to artificial heart valve prostheses, frames, and methods of delivery thereof.
2. Background Art
Diseased or otherwise deficient cardiac valves can exhibit pathologies such as regurgitation and stenosis. Such valves can be repaired or replaced with prosthetic heart valves using a variety of techniques. For example, an open-heart surgical procedure can be conducted during which the heart can be stopped while blood flow is controlled by a heart-lung bypass machine. Alternatively, a minimally invasive percutaneous technique can be used to repair or replace a cardiac valve. For example, in some percutaneous techniques, a valve assembly can be compressed and loaded into a delivery device, which is then passed through a body lumen of the patient to be delivered to the valve site. There is a continuous need for improved valve prostheses for use in such techniques.

Valve prosthesis and method for delivery


Control systems and methods suitable for combination with power production systems and methods are provided herein. The control systems and methods may be used with, for example, closed power cycles as well as semi-closed power cycles. The combined control systems and methods and power production systems and methods can provide dynamic control of the power production systems and methods that can be carried out automatically based upon inputs received by controllers and outputs from the controllers to one or more components of the power production systems.

There is a great need for the development of power systems that can meet increasing consumption needs. While much work is directed to systems that do not utilize combustion of fossil fuels, cost factors and availability of fossil fuels, especially coals and natural gas (as well as waste hydrocarbons, such as residual oil products), drive a continued need for systems configured to combust such fuels, particularly with high efficiency and complete carbon capture. To meet these needs, there is a continued desire for the development of control systems that can provide for precise control of power systems.

Control systems and methods suitable for use with power production systems and methods


A defect generated at a portion to be treated of a machine component is removed, a porous deposition is formed by employing a molded electrode composed of a molded body or such molded from powder of a metal or such and generating a pulsing electric discharge between a removed portion from which the defect in the machine component is removed and the molded electrode so that a material of the molded electrode or such is deposited or so at the removed portion of the machine component by energy of the electric discharge and finish machining to required dimension is carried out so as to make a thickness of the deposition to be a predetermined thickness.

In general, a machine component such as a turbine rotor blade applied to a gas turbine engine will be subject to various repairs until coming to the end of its life. In a case where a defect such as a crack occurs to a portion to be repaired of the turbine rotor blade, the repairs are carried out in accordance with the following manner.
More specifically, the defect generated at the portion to be repaired of the turbine rotor blade is removed by grinding machining. Subsequently, a deposition is formed by cladding by welding at a removed portion from which the defect in the turbine rotor blade is removed. Thereby the turbine rotor blade as the machine component can be repaired and, in other words, a restored turbine rotor blade as a restored machine component can be produced from an original turbine rotor blade as an original machine component which is a subject of repair.

Method for repairing machine part, method for forming restored machine part, method for manufacturing machine part, gas turbine engine, electric discharge machine, method for repairing turbine component, and method for forming restored turbine component

Ishikawajima-Harima Heavy Industries Co., Ltd.


A display device for at least one modular merchandise unit having a substantially flat base includes a base, a housing supported by the base, a cover, at least one wheel connected to the base, and at least one shelf supported in the housing for receiving the base of the merchandise unit. The housing includes parallel first and second side walls and a third side wall connected to the first and second side walls. The cover is disposed on an upper portion of the first, second and third side walls.

1. Field of the Invention
The present invention relates to display devices and more particularly to a display device having shelves designed to hold modular merchandise units such as packet boxes that may be transported to a point of sale location filled with merchandise and readily arranged with similar display units in different configurations.
2. The Prior Art
Batteries and other articles of merchandise are often packaged in modular merchandise units such as packet boxes, called "MODS" or "PDQs" which have a substantially flat base. At the present time, these modular merchandise units are loaded on disposable display devices made of corrugated cardboard. These cardboard display devices usually have capacity for receiving only one horizontal row of modular merchandise units. If the device were constructed to hold more than one unit deep of merchandise, it would be impractical to ship the device with merchandise to the retail establishment due to the weight of the product. Moreover, such know display devices lack durability and typically are discarded at the retail establishment once all the products in the display device have been dispensed. Most of the time, therefore, a partially-filled display device is presented to the customer as products removed from the display device are not replaced, leaving empty spaces in the display device. In addition, such display devices are difficult to move when filled with product. As a result, once placed at a particular location, the display device is not moved until emptied and discarded.
Hence, there is a need for a simple and economic display device which may be filled with more than one row of modular merchandise units, may be shipped fully loaded with such units to a retail establishment, may be reused by the retail establishment and replenished with products, and may be readily and easily moved while filled with products to different locations at the retail establishment.


A semiconductor integrated circuit includes a first controlling circuit section, a level transforming circuit, a first buffer circuit, a second buffer circuit, and an overvoltage protecting circuit. A first n-channel type MOS transistor is provided in the first buffer circuit and a second p-channel type MOS transistor is provided in the second buffer circuit. Thus, faster operation can be obtained, and voltage between the source and drain of a third p-channel type MOS transistor and a third n-channel type MOS transistor of the overvoltage protecting circuit, impressed when output signal OUT changes, can be decreased.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit equipped with an output circuit for serving as an interface of a digital circuit, which operates with different electricity source voltages.
2. Description of Related Art
The finer the structure of a MOS transistor becomes, the weaker the strength of a gate oxide film becomes. For example, a MOS transistor produced in a fine process of an extent of 0.35 μm, is able to operate with an electricity source voltage of an extent of 3.3V. Further, MOS transistor produced in a latest fine process of an extent of 0.18 μm, is able to operate with an electricity source voltage of an extent of 1.8V. In order to make an interface with a circuit of 0.35 μm fine process, both of a MOS transistor able to be connected with an electricity source voltage of an extent of 1.8V and a MOS transistor able to be connected with an electricity source voltage of an extent of 3.3V are formed in a circuit of 0.18 μm fine process of the conventional art, so as to transform signal level from 1.8V to 3.3V. This the signal level transforming circuit includes an output circuit.
(First Prior Art)
FIG. 13 is a circuit diagram showing a structure of a level transforming circuit of a first prior art disclosed in Japanese patent publication No. 6-216752. This level transforming circuit comprises with MOS transistors which have a dielectric strength of a gate oxide film that is lower than a high voltage (5V), so as to transform level from a low voltage electricity source system to a high voltage electricity source system. As shown in FIG. 13, this level transforming circuit comprises a level transforming section comprising MOS transistors 300 to 313, and an output section comprising MOS transistors 314 to 317. The level transforming section has input there to the signal a IN of low voltage (VCC:3V) electricity source system, so as to output a signal for transforming a level to node N21, N22. The output section has input thereto a control signal from the level transforming section mentioned above, so as to output an output signal OUT1 having an amplitude of 0V to 5V as a signal of a high voltage (VDD:5V) electricity source system, an output signal OUT2 having an amplitude of an intermediate electric potential to 5V as a signal of the same, and an output signal OUT3 having an amplitude of 0V to an intermediate electric potential as a signal of the same.
Here, described is an occasion when an output enable signal OE and its inverse signal OEB are inputted with the H level and the L level respectively. If input signal IN becomes the L level, PMOS 306, 307 turns on and NMOS 305, 312 turns off. As a result, node N23, N24 becomes the H level, and NMOS 304 turns on. Then, a source electric potential of NMOS 302 decreases, and a route of current comprised of NMOS 302, PMOS 301 is taken. On the other hand, node N25 is pulled down, and, PMOS 308 turns on. When PMOS 308 turns on, node N21 becomes the H level, and, PMOS 309 turns on. Then, drain electric potential of NMOS 310 is pulled up to the high voltage VDD. Moreover, when node N24 becomes the H level, NMOS 311 is on, because the output enable signal EB is the H level. Then, node N22 becomes H level, and output signal OUT3 becomes 0V. When node N21 becomes the H level, PMOS 314 turns off, and output signal OUT2 becomes an intermediate electric potential. Output signal OUT1 becomes 0V, as NMOS 316 turns on, because output signal OUT3 is 0V.
On the other hand, if input signal IN becomes H level, NMOS 305, 312 turns on and PMOS 306, 307 turns off. Then, the electric potential of nodes N22, N23 are pulled down, and NMOS 317 turns off. Since NMOS 311 is on, node N24 is pulled down, and a route of current comprised of PMOS 309, NMOS 310 is taken, and PMOS 314 turns on, when node N21 is pulled down, and PMOS 300 turns on, so as to pull up node N25, Output signal OUT1 becomes 5V, output signal OUT2 becomes 5V, and output signal OUT3 becomes an intermediate electric potential.
(Second Prior Art)
FIG. 14 is a circuit diagram showing a structure of a level transforming circuit of a second prior art disclosed in Japanese patent No. 3258229. This level transforming circuit comprises MOS transistors which have a dielectric strength of gate oxide film that is lower than a high voltage (5V), so as to transform a level from a low voltage electricity source system to a high voltage electricity source system, similar to the first prior art. As shown in FIG. 14, this level transforming circuit comprises CMOS circuit 410, intermediate circuit 430, 440, and CMOS circuit 420.
CMOS circuit 410 comprises PMOS 411, 412 and NMOS 413, 414. PMOS 411, 412 are connected in series between the high voltage electricity source (VDD: 5V) and output node N1. NMOS 413, 414 are connected in series between the node N1 and the ground. The gate of PMOS 411 for pulling up is connected with node N4. On the other hand, the gate of NMOS 414 for pulling down has input thereto inputted with a signal IN which amplitude is between a low voltage (VCC:3V) and the ground. On the other hand, each gate of PMOS 412 and NMOS 413 is impressed with the low voltage in common.
The intermediate circuit 430 comprises PMOS 431, 432. PMOS 431 is connected between the high voltage electricity source VDD and output node N3, and its gate is connected with node N4. On the other hand, PMOS 432 is connected between node N3 and the low voltage electricity source VCC. and its gate is connected with output node N1 of CMOS circuit 410.
The intermediate circuit 440 comprises PMOS 441, 442. PMOS 441 is connected between the high voltage electricity source VDD and output node N4, and its gate is connected with node N3. On the other hand, PMOS 432 is connected between node N4 and the low voltage electricity source VCC, and its gate is impressed with output signal OUT1.
CMOS circuit 420 comprises PMOS 421, 422 and NMOS 423, 424. PMOS 421, 422 are connected in series between the high voltage electricity source VDD and output node N2. NMOS 423, 424 are connected in series between the output node N2 and the ground. The gate of PMOS 421 for pulling up is connected with node N3. On the other hand, the gate of NMOS 424 for pulling down, is inputted with an inverse signal of the input signal IN. On the other hand, each gate of PMOS 422 and NMOS 423 is impressed with the low voltage VCC in common.
Hereafter, the operation of this circuit is described.
When the input signal IN is the low voltage level VCC, NMOS 414 turns on, and PMOS 432 turns on. As a result, PMOS 441, 421 turn on. On the other hand, NMOS 424 turns off by the inverse signal of the input signal, and PMOS 442 turns off. Therefore, an output signal of the high voltage level VDD is output to OUT1. In this state, direct current does not pass through the circuit, because PMOS 411, 431, 442 and NMOS 424 are in the off state.
On the other hand, when the input signal changes from the low voltage level VCC to the ground level (0V level), NMOS 424 turns on, and PMOS 442 turns on. As a result, PMOS 411, 431 turn on, and NMOS 414 turns off by the inverse signal of the input signal. Then, PMOS 432 turns off. Therefore, an output signal of the ground level (0V level) is output. In this state, direct current does not pass through the circuit, because PMOS 421, 441, 432 and NMOS 414 are in the off state.
FIG. 15 is a circuit diagram showing the structure of a three state output circuit equipped with the level transforming circuit mentioned above. The logic circuit of the low voltage electricity source system has a data terminal 451 and an enable terminal 452, and it comprises a NAND gate 453, inverters 454, 455, and a NOR gate 456. Further, with the output side of said level transforming circuit, connected is a pre-buffer circuit 460, and with this, connected is a main buffer circuit 470. The pre-buffer circuit 460 comprises PMOS 461, 462, and it provides PMOS 471 with a signal having an amplitude between the high voltage VDD and the low voltage VCC. On the other hand, the main buffer circuit 470 comprises PMOS 471, 472 and NMOS 473, 474, and outputs an output signal OUT from an output pad 480 to the outside of the integrated circuit.
When the ground level 0V is inputted to the enable terminal 452, the high voltage level VDD is impressed with the gate of PMOS 471 and the ground level 0V is impressed with the gate of NMOS 474. Then, the output signal OUT becomes a high impedance state.
On the other hand, when the low voltage level VCC is impressed with the enable terminal 452 and the low voltage level VCC is impressed with the data terminal 451, the low voltage level VCC is impressed with the gate of PMOS 471 and the ground level 0V is impressed with the gate of NMOS 474. Then, the output signal OUT becomes the high voltage level VDD.
Moreover, when the low voltage level VCC is impressed with the enable terminal 452 and the ground level 0V is impressed with the data terminal 451, the high voltage level VDD is impressed with the gate of PMOS 471 and the low voltage level VCC is impressed with the gate of NMOS 474. Then, the output signal OUT becomes the ground level 0V. Therefore, the three state buffer circuit functions.
However, the output circuit of the conventional art mentioned above has the following problems.
Transistors operating with the low voltage electricity source and transistors having a gate oxide film strength stronger than the voltage level VDD of high voltage electricity source, must be formed together. Therefore, the gate oxide films of some transistors must be thick and their gate length must be long, and this kind of MOS transistors available for the output circuit, must be formed partially on some portions of an integrated circuit on a semiconductor chip. Thus, there is a problem that the manufacturing process becomes complicated.
Moreover, as for the first prior art (FIG. 13), an output circuit is able to comprise only transistors having a gate oxide film strength lower than the high voltage level VDD. However, the first prior art limits the amplitude of a gate voltage (node N21) of PMOS 314, by using the effect of turning off PMOS 309, so as to restrain the gate voltage under the strength of gate oxide film less than the high voltage level VDD. Meanwhile, the gate of PMOS 309 is impressed with an electric potential VB. Therefore, the electric potential of the gate of PMOS 309 does not decrease less than VB+Vth, even if a logical value of node N21 is the L level. Here, Vth is threshold voltage of PMOS.
While PMOS 309 is turning off, the electric potential of node N1 gradually comes to VB+Vth. The level transforming circuit of the first prior art uses this motion. Thus, there is a problem that it cannot operate rapidly.
Moreover, the gate voltage of PMOS 314 (electric potential of node N21) becomes VDD−(VB+Vth). So, if (VB+Vth) is higher than 3V, the gate voltage becomes a low value. Therefore, there is another problem that the ability to a bear load of the output section decreases. Moreover, the output signal OUT1 rises to 5V from 0V, when NMOS 317 turns off and PMOS 314 turns on. In this occasion, the source electric potential of PMOS 315 is pulled up rapidly. Therefore, the voltage Vgs between gate and source of PMOS 315 becomes certain voltage, so that the current flowing in PMOS 315 is equal to the current flowing in PMOS 314. So, between the source and drain of PMOS 315, voltage of VCC+Vgs is impressed. Similarly, output signal OUT1 drops to 0V from 5V, when PMOS 314 turns off and NMOS 317 turns on. In this occasion, the source potential of NMOS 316 is pulled down rapidly. Therefore, the voltage Vgs between the gate and source of NMOS 316 becomes a certain voltage, so that the current flowing in NMOS 316 is equal to the current flowing in NMOS 317. So, between source and drain of NMOS 316, voltage of VCC+Vgs is impressed. Therefore, voltage exceeding the voltage preferred in a low voltage electricity source system, is transiently impressed between the source and drain. Thus, the ability of the device is deteriorated by a hot carrier. As a result, a problem is caused that the reliability of the device deteriorates.
Moreover, as for second prior art (FIG. 14, 15), an output circuit is able to comprise only transistors having a gate oxide film strength lower than the high voltage level VDD, as well. However, the second prior art has the following problem.
When the enable terminal 452 is impressed with the low voltage level VCC, the data terminal 451 becomes the ground level VCC from the low voltage level VCC. In this occasion, the gate voltage of PMOS 471 becomes the high voltage level VDD from the low voltage level VCC, and the gate voltage of NMOS 474 becomes the low voltage level VCC from the ground level. As a result, the output signal OUT becomes the ground level from the high voltage level VDD. In this occasion, in order to bear a load connected to the output pad 480, the voltage between the source and drain of NMOS 473 becomes VDD−VCC+Vgs. Here, Vgs is the gate source voltage of NMOS 474, which flows current in NMOS 473 the same as current flowing in NMOS 474. So, the voltage between the source and drain transiently becomes higher than VCC. Similarly, the voltage between the gate and source of PMOS 472 becomes VCC+Vgs. Here, Vgs is gate source voltage of PMOS 472, which flows current in PMOS 472 the same as current flowing in PMOS 471. So, the voltage between the source and drain transiently becomes higher than VCC. Therefore, voltage exceeding the voltage preferred in low voltage electricity source system, is transiently impressed between source and drain. Moreover, voltage exceeding the voltage preferred in a low voltage electricity source system, is transiently impressed between the gate and source. Thus, the ability of the device is deteriorated by a hot carrier. As a result, a problem is caused that the reliability of the device deteriorates.
Moreover, with dropping of output node N3, output node N2 is pulled up by the turning on current of PMOS 421 flowing through PMOS 422. As shown in FIG. 15, a buffer to drive succeeding output stage is provided to the level transforming circuit. This buffer comprises two PMOS 461, 462, which are connected in series between the high voltage electricity source VDD and the low voltage electricity source VCC. The source of PMOS 461 is connected with the high voltage electricity source VDD. The drain of PMOS 462 is connected with the low voltage electricity source VCC. The gate of PMOS 461 is connected with output node N3. The gate of PMOS 462 is connected with output node N2. Therefore, PMOS 461 comes into on state, while PMOS 462 is still in on state. Therefore, passing current flows from the high voltage electricity source VDD to the low voltage electricity source VCC. As a result, a problem is caused of increasing electricity consumption in vain.
Moreover, as described in Japanese patent 3258229, in the occasion when the output stage of a semiconductor integrated circuit is driven, each transistor of the output stage usually has a gate width of several hundreds μm. So, as for gate the width of each transistor of a buffer driving this transistor of the output stage, if it is narrower than several hundreds μm, current flowing through the output stage decreases. As a result, a problem is caused of decreasing the drivability of the output stage.
The present invention is aimed at providing a novel and improved semiconductor integrated circuit, which is able to operate fast and to restrain drivability drop, so as to solve the problems contained in the semiconductor integrated circuit of the prior art mentioned above.


A method for maintaining constant position of a bearing outer race relative to an axial bore of a pulley comprising providing a pulley having a central axial hub exhibiting a concentric axial bore therethrough, the concentric axial bore having an axial bore surface; providing a bearing having an outer axial race, an inner axial race, and a plurality of bearing elements rotatably positioned between the outer axial race and the inner axial race; applying at least one drop or bead of a fastening element onto an outer surface of the outer race, wherein the fastening element acts to maintain constant position of the bearing relative to the pulley; and coupling the bearing to the pulley, and a pulley having a bearing integral therewith which exhibit the characteristic of maintaining constant position of the bearing relative to the pulley are disclosed.

The present invention relates to the field of pulleys. In particular, the invention relates to plastic pulleys with an insert molded bearing assembly comprising an outer race, an inner race, and a plurality of roller bearings seated between the outer and inner races. More particularly, the pulleys of the invention are adapted to have resistance to rotation of the axial bearing relative to the pulley. The present invention also relates to a method for manufacturing such pulleys. In the present invention, the terms "bearing," "metal bearing," "metal rolling bearing," and "integral bearing" are interchangeable; and the terms "insert," "rigid insert," "bearing insert," and "metal tubular insert" are interchangeable.
Plastic pulleys are known in the art as taught by U.S. Pat. Nos. 6,220,635; 6,200,513; 6,181,239; 6,120,401; 6,102,822; 6,090,001; 6,086,809; 6,032,635; 5,830,046; 5,782,709; 5,725,448; 5,724,930 and 5,176,580. Such plastic pulleys have heretofore been made by either molding-in a bearing, incorporated as an insert in the molding process, or by force fitting a bearing into a molded bore in the plastic part. For example, U.S. Pat. Nos. 4,468,210 and 4,473,363 describe examples of a plastic outer pulley body molded on a metal disc; and U.S. Pat. Nos. 4,913,688 and 5,476,423 describe examples of a two-step assembly wherein first a plastic outer pulley body is molded and then the metal insert is placed into the already molded pulley body.
Traditionally, when a pulley produced by the one-step process of injection molding the plastic pulley body about the metal bearing, the bearing can be physically altered to include one or more projections such as radially extending scallops or knurls on the outer periphery of the bearing.
Pulleys are also produced by the two-step process wherein a metal bearing is attached to a molded plastic outer pulley by forcing the bearing into the bore of the pulley. An adhesive is generally applied between the outer metal surface of the insert and the inner surface of the plastic pulley body to assist in bonding the bearing to the pulley body. In each of the methods, the bearing retention is less than desirable since the clamping force, which secures the bearing, is dependent upon the modulus of the plastic material and upon the surface of the outer bearing race. Typically, the outer bearing is smooth and made from material having relatively little affinity for the plastic pulley. Furthermore, asymmetric forces, which may occur during the molding process or during use, can distort the bearing to an out-of-round condition, thereby, shortening its useful life. For example, when a pulley is subjected to a heavy radial load from a belt, such as a v-ribbed belt, entrained therearound, the pulley and the bearing are slightly deformed and, since the deformation patterns of the plastic pulley and the insert are different, a slight clearance is defined between the inner surface of the pulley and the outer surface of the bearing. This clearance becomes wider as the radial force from the belt increases and over time, results in the wear of the fit surfaces of the pulley and the outer surface of the bearing, thus decreasing the joining force between the pulley and the bearing.
U.S. Pat. No. 4,822,111 to Albert teaches a two-part wheel assembly, such as used for wheelbarrows, wherein the two parts are joined together and a plain type anti-frictional bearing, usually molded plastic such as nylon, modified with a material, which provides good thermal, mechanical and bearing properties.
All journal bearings, e.g., engine main bearings and connecting rod bearings, incorporate some type of anti-rotation device, usually in the form of an outwardly-deflected tab which mates with a relief in the bearing cavity. It is also generally known to knurl or otherwise physically texture the outer surface of the outer race of a rolling-element bearing to be molded or captured in a bearing cavity. Also, it is generally known to glue the outer race of the bearing into its cavity, either directly in the part or in a separate shell insert. The use of a separate shell insert is disclosed in copending commonly assigned U.S. patent application Ser. No. 10/654,567, filed Aug. 29, 2003, the contents of which are incorporated herein by reference thereto. However, the process of bonding the bearing assembly and/or an insert to the pulley with an adhesive or glue presents undesirable clean-up and environmental problems generated by the large amounts of adhesive or glue employed. Accordingly, there is a need, particularly in the area of an endless drive belt of a vehicle accessories drive system, for a plastic pulley with a metal bearing that may be easily manufactured without the problems associated with prior art pulleys.

Pulley assembly for maintaining constant position of a bearing outer race relative to a pulley, and method


In order to simply and decently cover the clearance between the vehicle panel and the roll bar or support strut thereof, which extends through the vehicle panel, notches 12.sub.1 and 13.sub.1 in elements of a roll bar strut cover 10 formed in a foldable plate member made of resin are, by folding, made to form a circular enclosure, without any clearance, about a roll bar or strut thereof which is secured to a vehicle frame and which extends outside from an opening 9.sub.1 in a vehicle panel 9. A trim member 15 is mounted to the vehicle panel 9 from above the cover 10 such that the cover 10 is sandwiched between the trim member 15 and an upper surface of the vehicle panel 9. Even if there is a slight error in the mounting position of the roll bar strut 5, the strut cover 10 can move to follow the roll bar strut 5 and therefore, no clearance is generated between the cover 10 and the strut 5.

1. Technical Field
The present invention relates to a cover structure for enclosing a tubular support member, such as a roll bar or strut therefor which passes through a vehicle panel.
2. Prior Art
Because a vehicle roll bar needs to support a large load, it is mounted to a vehicle frame which is a strong member, and passes through an opening formed in the vehicle panel (or a trim member mounted to the vehicle panel) and extends outside. Since it is difficult to prevent slight errors in the mounting position of the roll bar from being generated, a size of the opening to receive the roll bar or a strut member for supporting the roll bar is set slightly larger than the roll bar or strut so as to avoid interference therewith. Consequently, a clearance is inevitably generated between an outer periphery of the roll bar or strut and the opening in the vehicle panel. Conventionally, such a clearance is closed by welding a metal clearance-cover about the outer periphery of the roll bar or strut within the vehicle panel, or by adhering or pressing under pressure a clearance-cover made of resin to or into the opening about the outer periphery of the roll bar or strut.

Cover structure for tubular support member


The device includes a screw which turn allows adjusting the distance between the rail of a power window device and the inner portion of motor vehicle door and it is surrounded, at an end thereof, by a first adjusting through block formed integral to the door of the motor vehicle, and a second adjusting block for roughly adjusting or tightening the thread inwardly which is fixed to the power window device, the opposed end of said screw being threadingly received to the rail of the power window device. The device permits adjusting of the window pane in a very simple manner, with a highly reduced cost of production and with a considerably strong mechanism which, in turn, allows a fine adjustment of the lateral distance of the assembly of the power window device.

The power window devices of motor vehicles, whether they are manually or electrically driven, basically comprise a movable window pane, driving means for the window pane and gripping means therefor. The gripping means for the window pane includes at least a clamp which holds it by its lower edge and it is attached to a sliding member running through a guiding rail.
Both on the assembly process of the power window device and in operations of maintenance thereof it is important to be allowed to adjust the position of the window pane appropriately in the power window device with the purpose of correcting errors of distortions in the door of the vehicle and, in turn, to provide for the sealing conditions of the assembly.
Therefore, there exists a need for a capability of adjusting the power window device in a direction perpendicular to the axis of the door and for this purpose the present invention provides a device for lateral adjusting of a power window device of motor vehicles and the like.

Device for the lateral adjustment of a window regulator for motor vehicles or similar


A fluidized bed reactor is provided. The fluidized bed reactor includes a screw conveyor configured to penetrate through an upper portion of the fluidized bed reactor and to discharge solid particles to an outside from the fluidized bed reactor. The screw conveyor is configured to have an upper end protrude from the upper portion of the fluidized bed reactor and a lower end located at a height equal to or higher than a height of a distributor of the fluidized bed reactor.

A fluidized bed reactor is a device that injects solid particles therein and injects gas through a plenum and a gas distributor located on a lower portion of the reactor, and changes behavior of the solid particles to be similar that of fluids by making the solid particles float.
Due to improved solid mixing and mass and heat transfer characteristics in comparison with other reactors, a fluidized bed process using such a fluidized bed reactor is widely used in: physical process such as drying, adsorption, cooling, freezing, coating, moving, heat control, filtering, temperature control, etc.; a chemical reaction occurring by a catalytic reaction such as fluid catalytic cracking (FCC), oxychlorination, phthalic anhydride production, polymerization, etc.; a non-catalytic reaction such as coal combustion, coal gasification, calcinations, mineral roasting, waste incineration, etc., and an energy conversion processes.
In the case of a process in which two reactions occur simultaneously, such as a carbon dioxide absorption and regeneration process using a dry regenerable sorbent, an oxidation-reduction process of a chemical-looping combustor, a Fisher-Tropsch process, a sorption enhanced steam methane reforming of natural gas, a chemical-looping hydrogen generation process, etc., two fluidized bed reactors are used and solid conveyance and circulation are required between the two fluidized bed reactors.
As a related-art method used for solid circulation between the two fluidized bed reactors, a fluidized bed solid circulation system shown in FIG. 1A or FIG. 1B is used. FIG. 1A illustrates a solid circulation system including a fast fluidized bed 1 and a bubbling fluidized bed 4, and FIG. 1B illustrates a solid circulation system including a fast fluidized bed 1, a first bubbling fluidized bed 4, and a second bubbling fluidized bed 7.
In the system of FIG. 1A, the fast fluidized bed 1 may be used for both reaction and solid conveyance. A first reaction of two reactions that has a lower reaction rate is performed in the bubbling fluidized bed 4, and the fast fluidized bed 1 is used for another reaction and solid circulation. However, when the reaction rate of the two reactions is low or a sufficient residence time is required, or when there is a limit to a ratio of a gas flow, the two reactions are performed in the first and second bubbling fluidized beds 4 and 7 in which a gas velocity is low, and the fast fluidized bed 1 is additionally used only for solid conveyance as shown in FIG. 1B.
However, when the fast fluidized bed is used as described above, additional gas is required to move up solids by using the fast fluidized bed, and inert (e.g., nitrogen, argon, helium, etc.) should be injected or a steam should be used to facilitate separation from the gas discharged by the reactions. In particular, when the two reactions occur at high temperature and high pressure, gas having high temperature and high pressure should be injected. Therefore, a cost for pre-heating and pressurizing may be additionally incurred. In addition, the gas velocity of the fast fluidized bed should increase to increase the amount of circulated solid, and thus the cost for gas increases further. In addition, when the height over which the solids should go is high, much gas is required.

Fluidized bed reactor having screw conveyor and fluidized bed solid circulation system using the same


An ESD protection element can have a high ESD protection characteristic which has a desired breakdown voltage and flows a large discharge current. A junction diode is formed by an N+ type buried layer having a proper impurity concentration and a P+ type buried layer. The P+ type buried layer is combined with a P+ type drawing layer to penetrate an N− type epitaxial layer and be connected to an anode element. An N+ type diffusion layer and a P+ typed diffusion layer connected to an surrounding the N+ type diffusion layer are formed in the N− epitaxial layer surrounded by the P+ type buried layer etc. The N+ type diffusion layer and P+ type diffusion layer are connected to a cathode electrode. An ESD protection element is formed by the PN junction diode and a parasitic PNP bipolar transistor which uses the P+ type diffusion layer as an emitted, the N− type epitaxial layer as the base, and the P+ type drawing layer etc. as the collector.

Field of the Invention
The disclosure relates to circuits that include resistive elements, diodes, and switches and method of using the circuits.
Description of the Related Art
Conventionally, for addressing ESD, various types of semiconductor devices having protection circuits for the semiconductor devices are proposed. For example, typically as shown in FIG. 7, an internal circuit 56 is protected by connecting a PN junction diode 52 between an input output terminal 50 and a power supply line 51, connecting a PN junction diode 54 between the input output terminal 50 and a ground line 53, and connecting a PN junction diode 55 between the power supply line 51 and the ground line 53. The ESD is an abbreviation of Electro-Static Discharge and means the discharge of static electricity.
However, as the miniaturization of elements is enhanced for a demand for higher speed and so on, the electrostatic breakdown tolerance of a semiconductor device is decreased and thus a more proper ESD protection element is essential. Japanese Patent Application publication No. 2006-128293 discloses a BiCMOS type integrated circuit including a MOS type transistor as a high breakdown voltage element and an NPN bipolar transistor as a low breakdown voltage element, which uses the low breakdown voltage NPN transistor as the ESD protection element, its problem, and a means of solving the problem.
Furthermore, Japanese Patent Application Publication No. Hei 05-90481 discloses using an NPN bipolar transistor between a power supply line and a ground line as an ESD protection element instead of using a PN junction diode, in which the base and emitter are connected by a resistor. Japanese Patent Application Publication No. Hei 06-177328 discloses using a MOS type transistor as an ESD protection element of which the snapback voltage is decreased so as to enhance the ESD protection characteristic.
Although details will be described below, the snapback voltage means a trigger voltage to start discharging static electricity to a ground line when a surge voltage by large static electricity is applied to an input output terminal or the like. When the snapback voltage of a protection element is lower than the snapback voltage of an element to be protected, static electricity is discharged to the ground line through the protection element, and the element to be protected is protected from the static electricity.
Japanese Patent Application Publication No. Hei 05-90481 discloses an additional ESD protection element 59 as shown in FIG. 8 in the same structure as the structure shown in FIG. 7 for a case in which static electricity is applied between a highest potential terminal as a power supply line 51 and a lowest potential terminal as a ground line 53. Conventionally, a parasitic PN junction diode 55a shown by a dotted line which uses the N type epitaxial layer as the cathode and uses the P type semiconductor substrate as the anode becomes a discharge path of static electricity applied between both the terminals and protects an internal circuit 56. The parasitic PN junction diode 55a is a replacement of the PN junction diode 55 in FIG. 7.
However, since the enhancement of miniaturization and so on cause the increase of the impedance of the discharge path of static electricity and so on, the parasitic PN junction diode 55a does not effectively work and a discharge path of static electricity occurs through some junction in the internal circuit 56, thereby causing a problem of breaking the junction in the internal circuit 56. Therefore, for addressing static electricity, the additional ESD protection element 59 is provided in which an NPN bipolar transistor 57 of which the base and emitter are shunted by a resistor 58 is connected in parallel with the parasitic PN junction diode 55a.
When a positive voltage by static electricity is applied from the power supply line 51 to the collector of the NPN bipolar transistor 57 connected to the power supply line 51 and a negative voltage is applied from the ground line 53 to the emitter connected to the ground line 53, the NPN bipolar transistor 57 breaks down at the time when the voltage reaches a collector-emitter breakdown voltage BVCER or more in the state where the resistor 58 is connected between the base and emitter of the NPN bipolar transistor 57. On the contrary, when static electricity is applied as a negative voltage to the power supply line 51 and as a positive voltage to the ground line 53, the base-collector junction is forward-biased through the resistor 58 and clamped.
Therefore, the internal circuit 56 between the power supply line 51 and the ground line 53 is protected from static electricity by the additional ESD protection element 59 which is formed by the NPN bipolar transistor 57 and the resistor 58, is connected in parallel with the conventional parasitic ESD protection PN junction diode 55a, and has a lower breakdown voltage. A portion of the discharge path of static electricity lies inside the semiconductor substrate, and other portion lies on the surface of the semiconductor substrate.
However, a semiconductor device used in a mobile phone or the like which requires a lower voltage operation needs other ESD protection element which breaks down by a still lower voltage and forms a static electricity discharge path such that a more portion of the path lies inside the semiconductor substrate for heat radiation when static electricity is applied.

Circuit including a resistive element, a diode, and a switch and a method of using the same

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC


A first mask includes a well mask formed over a first portion of the wafer to define a first conductive type well in the wafer. A first polysilicon mask is formed over the well mask including a plurality of first structures and a plurality of second structures to cover a first polysilicon layer, thereby defining polysilicon gates. A first implanting mask is formed over the first polysilicon mask for forming second conductive type region. A second implanting mask is formed over the first polysilicon mask for forming first conductive type region. A second polysilicon mask is formed between gates of a second conductive type MOS and gates of a first conductive type MOS. A contact hole mask is formed over the second polysilicon mask for forming contact holes. A metal mask is formed over the contact hole mask for forming connection.

The challenge to pact a greater density of electronic components on a semiconductor die has frequently caused faulty logic components, such as an inverter, a PMOS transistor, a NMOS transistor, a NAND gate, or other type of basic logic components to falter. A faulty logic component on a semiconductor die, without means to rectify the fault, renders integrated circuits to be unusable. Several different approaches have been used to replace these faulty components on a semiconductor die to repair the faulty logic components and permits the circuit to resume to normal operations.
One conventional approach is to use redundant components on a semiconductor die in which each of the redundant components is available to replace a faulty component. However, this solution could be costly because there are several different logic components and to manufacture redundant components for every type of logic components can be prohibitly expensive and cumbersome. A typical use of a redundant circuit occurs in placing redundant memory, not the redundant logic circuit, on a semiconductor die.
Advance in the formation of a semiconductor integrated circuits has primarily been directed towards the increase in the density of devices on an integrated circuit. The size of various devices must be precisely determined and their exact positions on the substrate established. In order to construct semiconductor devices with small and exact features, photolithography processes with high resolution capabilities must be available. The elements of the integrated circuits, from the active region of transistor to metal connections, have to be precisely connected to perform some desired functions. The layout of an integrated circuits provides such function available.
A die is typically and primly divided into a device area and a periphery circuit area. The devices or memory cells are formed in the device area of the die, circuits and some electrical connections are manufactured in the periphery circuit area. In addition, the dummy decoupling capacitors are manufactured in any unused area on the die which leave spaces available to imprint dummy decoupling capacitors on the die. These dummy decoupling capacitors can be used to replace or alter the logic functions of the integrated circuit by reconstruct the electrical connections between the integrated circuits and the decoupling capacitors. However, the conventional method for performing the aforesaid function of the dummy decoupling capacitor needs at least three masks, such as metal 1, metal 2 or visa to construct decoupling capacitors.
Accordingly, there is a need to provide a structure on a semiconductor die which has a multi-use in replacing the various types of faulty components.

Layout structure of multi-use coupling capacitors in reducing ground bounces and replacing faulty logic components

Vanguard International Semiconductor Corporation


Stapling assemblies for use with a surgical stapler and methods for manufacturing the same are provided. Three dimensional adjuncts for use with a surgical stapling assembly and methods for manufacturing the same are also provided.

Surgical staplers are used in surgical procedures to close openings in tissue, blood vessels, ducts, shunts, or other objects or body parts involved in the particular procedure. The openings can be naturally occurring, such as passageways in blood vessels or an internal organ like the stomach, or they can be formed by the surgeon during a surgical procedure, such as by puncturing tissue or blood vessels to form a bypass or an anastomosis, or by cutting tissue during a stapling procedure.
Some surgical staplers require a surgeon to select the appropriate staples having the appropriate staple height for the tissue being stapled. For example, a surgeon could select tall staples for use with thick tissue and short staples for use with thin tissue. In some instances, however, the tissue being stapled does not have a consistent thickness and, thus the staples cannot achieve the desired fired configuration at each staple site. As a result, a desirable seal at or near all of the stapled sites cannot be formed, thereby allowing blood, air, gastrointestinal fluids, and other fluids to seep through the unsealed sites.
Further, staples, as well as other objects and materials that can be implanted in conjunction with procedures like stapling, generally lack some characteristics of the tissue in which they are implanted. For example, staples and other objects and materials can lack the natural flexibility of the tissue in which they are implanted, and therefore are unable to withstand the varying intra-tissue pressures at the implantation site. This can lead to undesirable tissue tearing, and consequently leakage, at or near the staple site.
Accordingly, there remains a need for improved instruments and methods that address current issues with surgical staplers.


The invention provides a method for lubricating one or more surfaces, comprising applying gel-phase liposomes onto said one or more surfaces, wherein the temperature of said surface(s) at the time of lubrication is below the phase transition temperature Tm of said liposomes. The method can be used for lubricating non-biological surfaces, and also for lubricating the surfaces of a biological tissue in a mammalian subject, e.g., for treating joint dysfunction.

Liposomes are vesicles whose membranes in most cases are based on phospholipid bilayers. They are generally biocompatible and, when modified with other molecules, are widely used in clinical applications, primarily as drug delivery vehicles, as well as in gene therapy and for diagnostic imaging.
WO 08/038292, by some of the present inventors, disclosed, inter alia, multilamellar vesicles (MLVs) of several phospholipids above their liquid-crystalline-phase to gel-phase transition temperature Tm as possible boundary lubricants in the articular cartilage environment.
Presently, there is a serious lack of good solutions to the problem of boundary lubrication in aqueous media. Boundary lubrication in aqueous media is often problematic as water on its own is not a good lubricant, while common surfaces or surface coatings in water frequently exhibit quite high friction (with friction coefficients μ>0.01-0.05), especially at high pressures.
The problem is even more evident when extremely low friction is required, particularly at high pressures (up to 100 atmospheres or more) and at low sliding velocities. For example, Values of ca. 2×10−3 or lower have been measured between some physically-attached boundary lubricants, but these were at mean contact pressures of only up to 0.3 MPa (3 atmospheres) or less. In Chen, M., Briscoe, W. H., Armes, S. P., and Klein, J [Lubrication at Physiological Pressures by Polyzwitterionic Brushes, Science 323, 1698 (2009)] it is reported that boundary lubricants which were covalently grown on surfaces demonstrate low friction coefficients, around 10−3, up to 75 atmospheres pressure.
Vecchio, P.; Thomas, R.; Hills [B. A. Rheumatology 1999, 38(10), 1020-1021] describe the injection of dipalmitoylphosphatidylcholine (DPPC) solutions in propylene glycol into joints.
U.S. Pat. No. 6,800,298 describes a lubricant composition comprising dextran-based hydrogel with lipids.
There is a need for an alternative physically-attached boundary lubricant in aqueous media, which would have a low friction coefficient even at contact pressures substantially higher than 0.3 MPa.

Phosphatidylcholine lipid liposomes as boundary lubricants in aqueous media

YISSUM RESEARCH DEVELOPMENT COMPANY OF THE HEBREW UNIVERSITY OF JERUSALEM, LTD.


A recording apparatus in which a level of an input signal is adjusted by a variable gain amplifying circuit, and the input signal is recorded onto a recording medium. The level of the input signal is detected, a gain adjustment amount of the variable gain amplifying circuit is determined in accordance with the level of the input signal, a gain of the variable gain amplifying circuit is changed by the determined gain adjustment amount, and the gain adjustment amount is increased as the level of the input signal becomes larger. When the input signal level is low, therefore, the gain control amount is suppressed and, when a possibility such that the input signal level is the peak level of the music source is high and the input signal level is large, the gain adjustment amount is increased in accordance with the input signal level.

1. Field of the Invention
The present invention relates to a recording apparatus for automatically adjusting a level of a recording signal.
2. Description of the Related Art
In a conventional recording apparatus such as a tape recorder, an audio signal as an input signal is supplied to a signal recording stage through a variable gain amplifying circuit such as a VCA (voltage controlled amplifier). When a level of a recording signal as an output signal of the variable gain amplifying circuit is smaller than a target signal level, a gain of the variable gain amplifying circuit is increased and, when the recording signal level exceeds the target recording level, the gain of the variable gain amplifying circuit is reduced. Thus, the recording signal level is controlled so as to coincide with the target recording level.
When a state in which an input signal level is low continues after the start of the recording, however, since the gain of the variable gain amplifying circuit is raised on the basis of the low signal level, the gain is extremely high. When a peak of the input signal appears after that the high gain was obtained as mentioned above, the recording signal level is fairly higher than the target recording level and there is a problem such that the signal recorded on a recording medium is remarkably distorted at the signal recording stage.

Recording apparatus with a control for selecting a gain adjustment amount


An apparatus comprising a mattress, a mattress support, cast shoes, a footboard support, a drive for causing the reciprocating movement, and a box frame to contain and support the reciprocating movement platform is disclosed. The apparatus provides medical treatments, which are also described, by externally applying periodic acceleration to the body of a subject on the mattress.

1. Field of the Invention
The present invention relates generally to a reciprocating motion platform for oscillating a subject in a back and forth, headward to footward manner in order to externally add pulses to the fluid channels of the subject. The external addition of pulses caused by the periodic acceleration of the subject results in many therapeutic benefits.
2. Description of the Related Art
This application builds on the work previously done in this field by Non-Invasive Monitoring Systems, Inc., located at 1666 Kennedy Causeway, Suite 400 in North Bay Village, Fla., as exemplified in U.S. Pat. No. 6,155,976 to Sackner et al. entitled "Reciprocating Movement Platform For Shifting Subject To and Fro in Headwards-Footwards Direction" (hereinafter referred to as the '976 patent), U.S. patent application Ser. No. 09/967,422 (U.S. Patent Application Publication Serial No. 2002/0103454) filed by Dr. Marvin Sackner and D. Michael Inman, entitled "External Addition of Pulses To Fluid Channels Of Body To Release Or Suppress Endothelial Mediators And To Determine Effectiveness Of Such Intervention" (hereinafter referred to as the '454 publication), and U.S. patent application Ser. No. 10/439,957 (U.S. Patent Application Publication Serial No. 2003/0236476), filed by Dr. Marvin Sackner and D. Michael Inman, entitled "Reciprocating Movement Platform For The External Addition of Pulses of The Fluid Channels of a Subject", (hereinafter referred to as the '957 application). All of the '976 patent, the '454 publication, and '957 application are hereby incorporated by reference.
Both the '976 patent and the '957 application describe reciprocating movement platforms which can be used in medical treatments based on the external addition of pulses, as well as various medical treatments based on the external addition of pulses. The '454 publication is directly mostly to medical treatments. Although the present application builds on these three works, it is not limited by them.
Although the three works are incorporated by reference, a description of one embodiment of a reciprocating movement platform in the '957 application is presented below to provide a background by which to understand the present invention. The placement of this description in the background section does not mean to suggest by any means that the applicant considers or admits that the '957 application is necessarily prior art to the present application. Its placement here is merely to demarcate the material disclosed in the '957 application from the new material described herein.
The '957 application described one embodiment of a reciprocating movement platform as shown in FIGS. 1, 4, 5, and 6. FIGS. 1, 4, 5, and 6 show a completely constructed reciprocating movement platform comprised of a mattress 101 for the subject to lie upon, a pillow 102 for the subject's head, a footboard frame 103 with cast shoes 104 attached in order to secure the subject, a mattress support 105 to hold the mattress 101 and to which the footboard frame 103 is attached, a box frame 800 which holds the drive machinery (or "drive") 200 onto which the mattress support 105 is attached, bumpers 820 attached to the top and bottom of the box frame 800, and casters 830 at the four corners of the bottom of the box frame 800 for moving the reciprocating movement platform.
The entire reciprocating movement platform system (without patient, i.e., mattress 101 and mattress support 105, footboard support 105, box frame 800, and drive machinery 200) weighs between 400 and 500 lbs. The entire reciprocating movement platform system is 30″ wide, which is the standard width of a hospital gurney, so that it may be easily moved through doorways, semi-crowded offices, etc. The length of the entire system from bumper to bumper is 88″, which is as long as a standard twin or king size bed. The mattress 101 is 30″ above the floor, and the top of the footboard support 103 is 42″ above the floor.
The mattress support 105 secures the mattress 101 by means of Velcro strips. The mattress support 105 and footboard support 105 together weigh roughly 120 lbs. total. When assembled, the combined mattress support 105 and footboard support 105 are 30″ wide and 82″ long. The mattress 101 is 6″ thick, 30″ wide, 80″ long, and weighs approximately 30 lbs. The top 3″ of the mattress foam is the "visco-elastic" type foam for form-fitting comfort while the subject is on the platform. The mattress 101 can be designed to fold in half for easier transport and storage.
FIG. 7 shows the cast shoes 104 and the footboard frame 103 to which they are attached. The cast shoes 104 of the footboard frame 103 are the only means by which the subject is secured to the mattress support 105, and thus, is the means by which the subject is "pulsed" by the reciprocating platform. The two cast shoes 104 are rigidly attached by nuts and bolts to the footboard frame 103. Once the subject is lying on the mattress 101, he or she will put his or her feet (with shoes on) into the cast shoes 104 and then the cast shoes 104 will be secured around the shoes by a system of Velcro and straps and cloth. Experiments have shown that "one size fits many", with the cast shoes 104 servicing most adults quite adequately due to the flexibility of the Velcro closure system. The feet may be fastened in the cast shoes 104 by other means, such as a ski boot-like apparatus, or another fastening means, such as a snap, a buckle, a lock, etc. connection.
The casters 830 on the bottom portion of the reciprocating movement platform are 6″ hospital bed casters with central locking features; these provide easy rolling and maneuvering, good ground clearance, easy locking (as shown by the brake petal), and an attractive appearance. The ground clearance is approximately 8″, which accommodates the use of equipment (such as hoists) to lift the reciprocating movement platform. The bumpers 820 make sure the reciprocating platform is not set too close to a wall by extending further out than the mattress support 105. The mattress support 105 is 82″ long and, when the platform is engaged in a reciprocating movement, has a range of movement of +/−2″. The bumpers 820 are built to extend 1″ beyond the furthest limit the mattress support 105 can travel so that the reciprocating movement platform will not be accidentally set too close to a wall where it might bump the wall during operation.
The drive machinery (or "drive") 200 is enclosed within the box frame 800 and, as such, cannot be seen from the outside of the fully assembled movement platform. Supported by the box frame 800 and attached to the mattress support 105, the drive 200 provides the reciprocating movement of the device. The reciprocating (headwards-footwards) movement preferably has a rate of about 120-180 rpm with a force in the range of about +/−0.2 to about +/−0.3 g. The relationship between the parts can be seen in the exploded view of the reciprocating movement platform shown in FIG. 1. Starting from the top, the mattress 101 attaches to the mattress support 105 with Velcro strips, while the footboard frame 103 (with attached cast shoes 104) is bolted onto the mattress support 105. The mattress support 105 is securely attached to the drive 200. The drive 200 has four track wheels 232 located in the four top corners of the drive 200. These wheels 232 sit in four similarly placed tracks in the box frame 800. Hence, the drive 200, mattress support 105, and mattress 101 form one part of the assembled movement platform, and the only physical connection between this top part and the bottom box frame 800 is the four wheels 232 of the drive 200 sitting in the four tracks of the box frame 800.
When the drive 200, by means which will be discussed further below, moves within the box frame 800, the wheels 232 move within the tracks, which serve to both support the drive 200 and limit the reciprocating motion of the drive 200. The track 810 on top of the box frame 800 has rounded ends so that the wheel 232 of the drive 200 may only move a certain distance in either direction. The track is beveled so that the track wheel 232 of the drive 200 will rest naturally in the center of the track. The track is also located near the metal support struts of the box frame 800 which thus transfer the weight of the drive 200 (and the attached mattress support 105, mattress 101, and subject) directly down to the caster 830 in the corner below.
The box frame 800 weighs about 120 lbs. and serves at least the following five purposes: 1) supporting the rest of the platform (the drive 200, mattress support 105, mattress 101, and subject); 2) providing a foundation that can be moved or anchored by means of the casters 830; 3) maintaining an adequate distance from surrounding walls by means of its bumpers 820; (4) carrying the system electronics; and (5) encasing the drive 200 for safety and noise reduction. In addition, the box frame 800 provides ground clearance for the hoist legs.
The drive 200 weighs 200 lbs and is 24″ wide. The displacement modules in the drive 200 take the form of two pairs of rotating counterweights, connecting belts, pulleys, springs, and motors. FIGS. 2A and 2B are drawings of a side view and a top view, respectively, of the drive 200 and its various mechanisms. In FIGS. 2A and 2B, the two pairs of drive weights 215A & 215B and 225A & 225B are shown attached to their respective horizontal shafts 210 and 220. These shafts are attached by means of struts to the frame of the drive 200. The four track wheels 232 can be seen in FIGS. 2A-2B. There are two motors, the drive rotation motor 1700 which drives the drive weights and a linear displacement motor 260 which sets the phase difference between the two pairs of drive weights. The drive rotation motor 1700 is a 180VDC ½ hp 0-1750 RPM motor, although only 1/10 hp is actually used. The linear displacement motor 260 is a 9″ per minute 400 lb. 110VAC linear displacer with 12″ of travel.
The movement of counterweights 215A and 215B as seen from above is shown in FIGS. 3A-E. In FIG. 3A, the centers of gravity of both drive weights 215A and 215B are on the same line 401 from center drive shaft 210. As center drive shaft 210 continues to rotate in FIG. 3B, drive weights 215A and 215B continue their rotations in opposite directions: drive weight 215A in a clockwise direction, drive weight 215B in a counter-clockwise direction. In FIG. 3C, the drive weights have moved into positions opposite each other. This is beneficial because the force of the two drive weights are also in opposite directions and thus, negate each other's effect. The rotation continues in FIG. 3D and then the drive weights end up adding the force of their weights in the same direction in FIG. 3E. FIGS. 3A-E show how the motion of the drive weights moves the drive 200 up and down the box frame tracks (i.e., headwards and footwards for a subject on the mattress 101), but not sideways within the box frame 800. If FIG. 3A is the position which causes the headward movement, FIG. 3C is the position which negates any movement, and FIG. 3E causes the footward movement.
As can be seen in FIGS. 2A-2B and 3A-3E, the drive weights are of unequal size. This is because the weights are located at different distances from the center of drive shaft 210. If the drive weights were the same mass, their effects would not be balanced and the drive 200 would rock sideways in the box frame 800. However, if drive weight 215B is a predetermined amount of mass less than drive weight 215A, the effect of the drive weights when rotating in opposite directions will cancel each other out. Because of this arrangement, the drive weights are in the same horizontal plane as shown in FIG. 2, which greatly reduces any shimmy effect that was produced in previous platform versions which had their drive weights in different horizontal planes. The outer edge of drive weight 215A is 12″ from drive shaft 210 and this outer edge travels past the very outside edge of the drive itself when rotating.
FIG. 2B shows the pulley system with drive belt 370 and the phase control belt 380. The drive belt 370 runs from drive rotation motor 1700 to drive shaft 210 and provides the power to rotate drive weights 215A and 215B around drive shaft 210 and indirectly provides the power to rotate drive weights 225A and 225B around shaft 220. Drive belt 370 is a ¾″ L pitch timing belt, although a timing belt is not required in this position. Because of the size of the wheel around drive shaft 210 which is driven by drive belt 370 in comparison to the size of rotation shaft, there is a 5:1 speed reduction from the drive rotation motor 1700 to the actual rotational speed of the drive weights.
Phase control belt 380 runs around four pulley wheels of equal size: a release pulley wheel, a drive shaft pulley wheel, secondary shaft pulley wheel, and a linear displacement pulley wheel. Because it is also attached to drive shaft 210, the drive pulley wheel drives the phase control belt. Secondary shaft pulley wheel receives the power to rotate the drive weights around shaft 220 from the drive shaft pulley wheel through phase control belt 380. The release pulley wheel provides required tension for phase control belt 380, and can also be used to release the tension on phase control belt 380 in order that phase control belt 380 can be taken off for repair or transport. Linear displacement pulley wheel can be moved in position up and down linear shaft under the control of linear displacement motor 260. It is by this means that the relative phases of the two pairs of drive weights are controlled.
The drive weights around each shaft make the same movements as shown in FIGS. 3A-3E. However, one pair of drive weights can be moved in and out of phase with the other pair of drive weights. The two pairs of drive weights are in phase when they are in the same rotational positions at the same time. Both pairs would look like FIG. 3A at the same time, like FIG. 3B at the same time, etc. The two pairs are out of phase when they are not in the same rotational positions at the same time. For instance, drive weights 215A & 215B might be in the position shown in FIG. 3A, while drive weights 225A & 225B might be in the positions shown in FIG. 3B. In that case, they would be 45° out of phase with each other. Although the sideways forces of these out-of-phase pairs of drive weights would still cancel themselves out (and thus not produce a rocking effect in the movement platform), the force produced in the headwards-footwards directions would lessen in comparison to when the pairs of drive weights are in phase.
The relative phases of the pairs of drive weights are controlled by the linear displacement motor 360, which controls the pulley system. The speed of rotation of the pairs of drive weights are controlled by increasing or decreasing the speed of the drive rotation motor 1700. Thus, one can control both the speed of the headwards-footwards movement (by increasing or decreasing the speed of the drive rotation motor 1700) and the force applied by the headwards-footwards movement (by moving the pairs of drive weights in and out of phase with each other through linear displacement pulley wheel under the control of linear displacement motor 360). In its simplest form, the control electronics of the present invention merely control these two variables in order to get the desired effect on the subject (as described, for example, in the '962 patent, the '454 publication, and the '957 application). A handheld controller with a communication link to the control electronics of the drive 200 may be used by the health care provider or the subject him- or herself, Readings of the speed and peak acceleration could also be available. The control electronics also incorporate a "patient stop switch" which may be given to the subject to hold. The motors would stop whenever the switch was activated.
Although this reciprocating movement platform is well designed for providing a wide range of controlled motions to a subject on it, it is fairly heavy, and, as such, may not be appropriate for usage in the more. Thus, there is a need for a reciprocating movement platform with reduced weight.

This patent is subject to a terminal disclaimer.

Reciprocating movement platform for the external addition of pulses to the fluid channels of a subject


A front frame portion of an underframe which constitutes a lower portion of a vehicle body frame is formed in a triangular shape, and, at the same time, the front frame portion of the underframe is formed in a peaked shape in a plan view. The underframe is integrally formed by casting. An upper arm and a lower arm which support left and right front wheels are respectively mounted on the left and right sides of the front frame portion.

The present invention relates to an all terrain vehicle for traveling on a leveled land and an unleveled land, and more particularly to a vehicle body frame structure, a skid plate, a sub frame, and a suspension structure of the vehicle.
As a related vehicle body frame structure of a vehicle, there has been known a vehicle frame structure which is assembled by joining a plurality of pipe frames (see JP-B2-2671346, for example).
FIG. 3 of JP-B2-2671346 is explained hereinafter. Here, numerals described in JP-B2-2671346 are used as numerals here.
A vehicle body frame 11 includes a main pipe 18 which is formed on a center upper portion of a vehicle, a pair of left and right front tubes 19, 19 which extend frontwardly, obliquely and downwardly from a front portion of the main pipe 18, a pair of left and right body tubes 20, 20 which extend downwardly from a rear portion of the main pipe 18, a pair of left and right lower tubes 21, 21 which integrally extend frontwardly from lower portions of the body tubes 20, 20 and are connected with the above-mentioned front tubes 19, 19, a pair of left and right down tubes 26, 26 which are extended between the front tubes 19, 19 and between the lower tubes 21, 21 respectively, and reinforcements 27, 27 which are provided at positions where the front tubes 19, 19 and the down tubes 26, 26 cross each other. Here, numerals 28, 28 are mounting brackets on which upper ends of left and right front cushion units 29, 29 (see FIG. 1 of the publication) are mounted.
The above-mentioned front tubes 19 and lower tubes 21 constitute portions which support a front wheel, while the mounting brackets 28 constitute portions which support upper end of the front cushion units 29. Since a large load acts on these front tubes 19, the lower tubes 21 and the mounting brackets 28, it is desirable that these members have the high rigidity. Further, with respect to a saddle-ride type vehicle which travels on an unleveled land, since the vehicle body frame 11 has a large number of portions which are exposed to the outside, when the appearance of the vehicle body frame 11 is enhanced, the product value of the saddle-ride type vehicle is enhanced. Further, it is also desirable to reduce a cost with respect to the vehicle body frame.
Further, as a related skid plate of a vehicle, there has been known a skid plate mounted on a front end portion of a vehicle body frame along a vehicle body frame (for example, see JP-U-62-066894).
A technique disclosed in JP-U-62-066894 is explained hereinafter. Here, numerals described in JP-U-62-066894 are used as numerals here.
In FIG. 2 of the JP-U-62-066894, the following structure is described. On a front end portion of a vehicle body frame 1 of a vehicle, to be more specific, on curved portions 26, 26 of a pair of left and right guard members 23, 23, a skid plate 25 is formed along the curved portions 26, 26.
The skid plate 25 is a member which prevents a bottom portion of vehicle body from being brought into contact with and damaged by a ground when a wheel falls from the vehicle or the vehicle travels on an uneven ground.
With respect to the above-mentioned skid plate 25 is provided for protecting the front portion of the vehicle body, there has been a demand for a shape of the skid plate 25 which can more effectively protect parts in the vehicle body.
Further, as a related sub frame, there has been known a rear carrier mounted on a rear portion of a vehicle body frame (for example, see JP-A-11-198882).
A technique disclosed in JP-A-11-198882 is explained hereinafter. Here, numerals described in JP-A-11-198882 are used as numerals here.
In FIG. 3 of JP-A-11-198882, a vehicle body frame 2 having the following structure is described. A lower pipe 4 is connected with a lower portion of an upper pipe 3, a seat rail 17 is extended rearwardly from an upper portion of a rear portion of the upper pipe 3, and seat stay 18 is extended between the seat rail 17 and the lower pipe 4. Further, FIG. 3 of JP-A-11-198882 describes that a rear carrier 65 is mounted on the seat rail 17.
Further, FIG. 2 of JP-A-11-198882 describes a saddle-ride seat 25 which is mounted on the seat rail 17 (see the above-mentioned FIG. 3 of JP-A-11-198882), a rear cover 61 which covers a rear portion of a vehicle body, left and right rear fenders 62, 62 which are integrally formed with the rear cover 61, and tail lamps 63 which are respectively mounted on these rear fenders 62, 62.
The above-mentioned vehicle body frame 2 includes mounting portions for mounting the rear cover 61 and the rear fenders 62, 62. The seat rail 17 includes a mounting portion for mounting a saddle-ride seat 25. The rear fenders 62, 62 include mounting portions for mounting a tail lamp 63. By providing these mounting portions to one member, for example, it is possible to reduce the number of parts and the number of assembling man-hours whereby the reduction of cost can be achieved.
Further, since the above-mentioned rear carrier 65 is firmly supported on the vehicle body frame 2, for example, the rear carrier 65 is convenient as a support portion of parts. It is desirable that the rear carrier is not limited to a carrier and is expanded to other applications.
Further, as a related suspension structure, there has been known the suspension structure which connects a cushion unit to suspension arms through push-pull rods. (See JP-U-63-048690, for example.)
A technique disclosed in JP-U-63-048690 is explained hereinafter. Here, numerals described in JP-U-63-048690 are used as numerals here.
As shown in FIG. 2 of JP-U-63-048690 and FIG. 3 of JP-U-63-048690, a suspension having the following structure is shown. That is, upper arms 13 and lower arms 14 are vertically movably mounted on side portions of a front portion of a vehicle body frame 1, a push-pull rod 12 which extends in the substantially vehicle-width direction is extended between a cross member 15 which is mounted on the upper arm 13 and a link arm 9 of a cushion arm 7 which is swingably mounted on the vehicle body frame 1, and a cushion unit 10 is extended between a link arm 8 which is mounted on the cushion arm 7 and the vehicle body frame 1.
The up-and-down movement of the upper frame 13 is converted into the movement in the vehicle-width direction of the push-pull rod 12, and the movement in the vehicle-width direction of the push-pull rod 12 is converted into the movement in the front-to-rear direction of the cushion unit 10 by means of the cushion arm 7.
For example, in the suspension structure in which the cushion unit is directly connected to the suspension arm such as the upper arm or the lower arm and the cushion unit is extended in the substantially vertical direction, since the direction of the up-and-down movement of the suspension arm and the direction of a stroke of the cushion unit are substantially same, the up-and-down movement of the suspension arm can be effectively transmitted to the cushion unit.
However, in the structure of JP-U-63-048690, in converting the up-and-down movement of the upper arm 13 into the movement in the vehicle-width direction of the push-pull rod 12, since the direction of the up-and-down movement of the upper arm 13 and the direction of the movement in the vehicle-width direction of the push-pull rod 12 are arranged substantially orthogonal to each other, even when the upper arm 13 is largely moved in the up-and-down direction, a moving quantity of the push-pull rod 12 in the vehicle-width direction is small. Hence, the up-and-down movement of the upper arm 13 cannot be effectively transmitted to the push-pull rod 12, in the structure of JP-U-63-048690.
With respect to the above-mentioned suspension structure of the vehicle in which cushion unit is directly connected to the suspension arm, since the cushion unit is extended substantially upwardly from the suspension arm, a height of the vehicle is increased thus leading to the large-sizing of the vehicle body. Although it is possible to suppress the increased of the height of the vehicle by making a total length of the cushion unit short, it becomes impossible to ensure the stroke of the cushion unit. Further, when the vehicle body becomes large-sized, this adversely influences the traveling performance of the vehicle.