In a power conversion module device of the present invention, a transformer, a primary power element and a secondary power element are mounted on a printed wiring board in surface-to-surface contact therewith, and no control circuit is mounted thereon. In addition to reducing impedance and loss in the wiring, this constitution improves the voltage waveform of the primary power element. Thus, noise reduction can be achieved. Further, because heat can be transferred to the printed wiring board, heat generated from the transformer, the primary power element and the secondary power element can be reduced. The size of the transformer can also be reduced.

In the recent large increase in the amount of telecommunications, power consumption tends to increase in any electronic equipment, and lower power consumption is becoming a social concern. In particular, many of the power supply parts of such electronic equipment are mainly made of switching power supplies. Enhancing the efficiency, and reducing the size and noise of this power supply part are technical problems to be addressed. Development of this power supply at high speeds is an important breakthrough in the development of electronic equipment.
Conventionally, this kind of switching power supply has been structured as shown in FIGS. 8 and 9.
Hereinafter, a description is provided of a conventional example with reference to FIGS. 8 and 9. FIG. 8 is a circuit block diagram of a conventional switching power supply. FIG. 9 is a perspective view showing an appearance of the conventional switching power supply.
As shown in FIGS. 8 and 9, generally, a conventional switching power supply is structured so that input circuit part 1, converter part 2, and output circuit part 3 are mounted on single main substrate 9.
Input circuit part 1 is made of input filter 1a, input rectifier circuit 1b, power-factor improvement circuit 4, smoothing circuit 1c and other components. Converter part 2 is made of control circuit 5, transformer 6, primary power element 7, secondary power element 8 and other components. Now, in many cases, a field-effect transistor (hereinafter referred to as a FET) is used as primary power element 7, and a diode is used as secondary power element 8. However, as a switch instead of a diode, a FET is used in some cases. Further, output circuit part 3 is made of output smoothing section 3a, output conversion circuit 3b, output filters 3c and other components.
According to some of the technical references of the prior art of this application, a circuit block including a control circuit is modularized, as disclosed in Japanese Patent Unexamined Publication No. 2001-359281 (Reference 1), No. H5-198445 (Reference 2), and No. 2001-103756 (Reference 3), for example.
According to another technical reference of the prior art of this application, a wiring pattern for transferring the heat of a heat sink attached to a printed coil transformer, primary power element, and secondary rectifier circuit is provided on a mounting substrate, as disclosed in Japanese Patent Unexamined Publication No. H8-45748 (Reference 4).
However, in the constitution of FIGS. 8 and 9, which shows the most common conventional example, each circuit block and all the components are mounted on single main substrate 9. For this reason, the specification of each component delicately relates to and interferes with each other, and thus the determination of final specifications is difficult. This poses the following problems in the efficiency of development and design: a highly experienced person familiar with designing and an extremely long development lead time are necessary. Additionally, when the output of the power supply is increased, the size of transformer 6 mounted on converter part 2 must be extremely increased. The size exceeds the limitation on the shape of the power supply, and the temperature of the transformer rises and exceeds a specified value. Thus, the conventional example also has problems in reduction in the size and heat generation.
In each of the inventions of References 1 through 3, a specific portion is modularized to reduce the size. However, because the portion is a complicated module block that has many components and many functions, including a control circuit, determination of the specifications is much more difficult than that of the conventional example of FIGS. 8 and 9. This significantly increases the time and cost for development, and provides an expensive power supply block. For this reason, these inventions have many problems, e.g. limited fields and applications in market deployment.
In the invention of Reference 4, because the terminals of the transformer and the heat sink are connected by wiring patterns, the pattern design is limited. Additionally, long wirings increase the impedance, noise, and loss in the wirings. Further, because heat is transferred via the wiring patterns and the distance to the heat sink is long, improvement of the heat transfer effect is limited to a certain level. Thus, this invention has many problems.

Power conversion module device and power unit using the same

Matsushita Electric Industrial Co., Ltd.


A communication network comprises a broadcast teleservice message center generating broadcast teleservice messages. The broadcast teleservice message center is connected to a circuit-switched network over an interface that uses a first messaging protocol. The broadcast teleservice message center includes an interworking function to connect the broadcast teleservice message center to a packet-switched network over an interface that uses a second messaging protocol. Broadcast teleservice messages transmitted over said first interface to mobile terminals having service with the said circuit-switched network are converted by the interworking function to a format specified by the second messaging protocol for delivery over the packet-switched network to mobile terminals having service with the packet-switched network.

The present invention relates to broadcast teleservices for mobile communications networks and more particularly to a method for delivering broadcast teleservice messages over packet data networks.
In a conventional mobile communication network, a mobile terminal must register with the network in order to receive services. The mobile communication network typically provides voice services, but may also include more advanced services such as short message services (SMS), data services, and broadcast teleservices. Data services allow users to send and receive data, such as facsimile data, over wireless communication channels. SMS allows a user to send and receive short text messages. Broadcast teleservices allow a user to receive messages that are broadcast over a geographic area to all users or to a group of users. Broadcast teleservices are used, for example, to broadcast weather forecasts, sports scores, news, and other information to mobile terminals.
The Telecommunications Industry Association/Electronic Industry Alliance (TIA/EIA) has developed a protocol to provide transport for broadcast teleservices, which has been incorporated into its standard for PCS/Cellular Systems (known as TIA/EIA-136). This protocol is known as the Broadcast Air Interface Transport Service (BATS). BATS allows a mobile terminal camped on a digital control channel (DCCH) to receive broadcast teleservice messages. To briefly summarize, the forward DCCH includes a logical channel, called the Broadcast Control Channel (BCCH), that carries broadcast teleservice messages. The BCCH comprises three sub-channels—the Fast Broadcast Control Channel (F-BCCH), the Extended Broadcast Control Channel (E-BCCH), and the SMS Broadcast Control Channel (S-BCCH). The F-BCCH and E-BCCH carry system-related information and operating parameters needed to mobile terminals to acquire and maintain service on the network. The S-BCCH carries SMS messages and other broadcast teleservice messages. A BATS-specific protocol includes functions for assigning and announcing sub-channels of the S-BCCH that carry specific types of broadcast teleservice messages. For example, different sub-channels may be defined to carry weather, new, sports scores, etc. This protocol allows mobile terminals to receive the desired broadcast teleservices in which the user has an interest.
Data services are also becoming more popular and demand for such services is growing rapidly. As demand for data services grows, mobile communication service providers are moving from circuit-switched networks, which were originally designed for voice communications, to packet-switched networks, which are better suited for data communications.
In a circuit-switched (CS) network, the communication path between the originating and terminating users is fixed for the entire duration of the call. That is, the mobile switching center (MSC) dedicates a voice channel connection between the calling party and called party for the entire duration of the call. A call-setup procedure is required to allocate network resources. Since the transmission path is fixed, data arrives at the final destination in the exact order it was transmitted. A CS network relies heavily on error control coding to protect messages from errors in transmission. In general, CS networks work well for voice communications but are not well-suited for certain types of data services.
In a packet-switched (PS) network, a dedicated connection is not required. Instead of a dedicated connection that is allocated for the duration of a call, a PS network breaks the message into packets and transmits each packet individually over the network. Each packet contains routing information and is individually routed over the network to the final destination. Thus, successive packets in the same message may arrive at the final destination through different routes. If some packets get lost during transmission, there is sufficient redundancy to allow the entire message to be reconstructed at the final destination. Because a dedicated connection is not required, packet-switched networks are sometimes referred to as being connectionless. While requiring more overhead to transmit each packet, a packet-switched network does not tie up system resources and a call set-up procedure is not required. PS networks are ideal for data communications, particularly data communications of a bursty nature, such as Internet browsing.
A Class B mobile terminal is defined as a terminal that may connect to a conventional, CS network for voice communications, or to PS network for data communications. For data services, the mobile terminal registers with the PS network in order to receive packet data services, also known as datagram services, and then camps on a control channel called the Packet Common Control Channel (PCCCH). After registration with the PS network, the mobile terminal may also register with a conventional CS network for voice communications while still camping on the PCCCH. Registration with the CS network may be accomplished through a tunneled connection between the PS network and the CS network. After registration, paging messages originating in the CS network are routed via the PS network and transmitted to the mobile terminal on the PCCCH.
Currently, broadcast teleservices are not provided on the PCCCH. Broadcast teleservice is provided only on the DCCH in the CS mobile communication network. Thus, when a Class B mobile terminal is camping on the PCCCH, it is unable to receive BATS-based broadcast teleservice messages.

Delivery of broadcast teleservice messages over packet data networks


A case for a portable terminal using a color liquid crystal uses a Peltier device to vary the color of the case by means of electrical heating and cooling the interior of the case. The case includes a temperature control apparatus for emitting electrical heat, when an electrical current is applied thereto, and simultaneously cooling the opposite side; a liquid crystal application agent positioned on the upper portion of the temperature control apparatus and adapted to vary the color by means of the electrical heat; and a cooling unit positioned opposite to an upper portion of the temperature control apparatus to cool heat-generating devices inside the terminal.

1. Field of the Invention
The present invention relates to a case for a portable terminal using a color liquid crystal, and more particularly to a case for a portable terminal using a color liquid crystal which incorporates a Peltier device to vary the color of the case by electrical heating and cooling of the interior of the case.
2. Description of the Related Art
In general, a "portable communication apparatus" refers to an electronic apparatus that a user can carry to perform wireless communication with a desired party. The portable communication apparatus includes a Hand-Held Phone (HHP), a Cordless Telephony (CT-2) cellular phone, a digital phone, a Personal Communication Service (PCS) phone, and a Personal Digital Assistant (PDA). The portable communication apparatus may be classified into various categories according to its appearance, such as a bar-type portable communication apparatus, a flip-type portable communication apparatus, and a folder-type portable communication apparatus. The bar-type communication apparatus has a single housing shaped like a bar. The flip-type communication apparatus has a flip or cover, rotatably coupled to a bar-shaped housing by a hinge device. The folder-type communication apparatus has a folder, connected to a single bar-shaped housing by a hinge device in such a manner that the folder can be rotated to fold on or unfold from the housing. The portable communication apparatus may also be classified as a neck-wearable type portable communication apparatus or a wrist-wearable type portable communication apparatus according to the position or way in which a user puts on the portable communication apparatus. The neck-wearable type portable communication apparatus is worn around the user's neck using a strap or cord. The wrist-wearable type portable communication apparatus is worn around the user's wrist. In addition, the portable communication apparatus, may be classified as a rotation-type portable communication apparatus or a sliding-type portable communication apparatus according to the manner of opening and closing the portable communication apparatus. In the rotation-type portable communication apparatus, two housings are coupled to each other in such a manner that one housing rotates to be opened or closed relative to the other while they face each other. In the sliding-type portable communication apparatus, two housings are coupled to each other in such a manner that one housing slides along a longitudinal direction to be opened or closed relative to the other housing while they face each other. These variously classified portable communication apparatuses can be easily understood by those skilled in the art.
Consistent with the current trend towards an information society and the rapid development of information communication technology, portable communication apparatuses are widely recognized as daily necessities.
Portable communication apparatuses tend to be light and compact for improved portability. Recently, portable terminals small enough to be placed on the palm have become available.
Currently, great importance is attached to the external design of portable terminals, particularly among young people. Various accessories (for example, a doll attached to the terminal by a cord) are used to decorate portable terminals.
For this reason, accessories for portable terminals have become commercial products that are available from many manufacturers.
Some youngsters even express their personalities by uniquely decorating their portable terminals with accessories including toys, strings, and rings.
In addition, young people, being sensitive to the current trends, are very inclined to choose portable telephones based on the external design. Accordingly, portable telephones have been developed in various colors and shapes to satisfy such preferences.
Two methods are mainly used in the industry for manufacturing cases for portable terminals using a color liquid crystal. The first method involves spraying a specific color and modifying the gloss through processing. The second method induces two kinds of color changes by modifying light.
For a conventional portable terminal having a case sprayed with a specific color and processed, if the user wants a different color, then the case itself must be replaced or a sticker and an auxiliary case made of a fiber or leather material must be adhered to the case. This adds the extra expense of replacing the case or buying an auxiliary case. In addition, such additional charge may be incurred every time a different color or shape is desired. As such, conventional terminal cases cannot satisfy desires by young people for unique self-expression.
Conventional portable terminals also have a problem in that heat-generating devices (for example, Liquid Crystal Display (LCD) panels, Printed Circuit Boards (PCBs), and modem chips) positioned therein may overheat the terminals and melt the components. In warm weather, furthermore, high ambient temperature may interfere with convenient use of terminals.

Case for portable terminal using color liquid crystal


A surface-mounted flat package for a laser diode has the laser diode and light sensor diode mounted on top of a printed wiring insulating substrate. These diodes are connected to electrodes at the corners of the package. These electrodes may be fed through plated through via holes to form bottom electrodes. These via holes may be located at the four corners of the substrate or inside the edges of the package.. For mass production, a matrix of laser diode and sensor diode assemblies are mounted on a common substrate. The substrate is sawed orthogonally through or outside the via holes to yield a large number of dice.

This invention relates to packages for laser diodes, in particular to surface-mounted packages.
In a conventional laser diode package, a laser diode is attached to a light sensor by means of manual spot welding, where corresponding terminals are mated. This method is slow and the quality is unstable. This process is not conducive to automatic production.


This invention relates to an improved pack mixture composition useful for the formation of a SiC pack cementation coating for protecting a carbonaceous substrate from degradation at temperatures above about 800.degree. F. comprising: Si from about 15% to about 50% by weight of the total composition; B up to about 25% by weight of the total composition when present; SiO.sub.2 from about 0.01% to about 3% by weight of the total composition; and SiC from about 40% to about 85% by weight of the total composition.. The invention also relates to a method for protecting a carbonaceous substrate from degradation at temperatures above about 800.degree. F. comprising: preparing a pack mixture composition of from about 15% to about 50% Si, up to about 25% B, from about 0.01% to about 3% SiO.sub.2 and from about 40% to about 85% SiC, all by weight of the total pack mixture composition; coating the carbonaceous substrate with release agent; surrounding the release agent-coated carbonaceous substrate with the pack mixture composition; and firing the carbonaceous substrate for a period of time sufficient to effectuate the formation of a protective SiC pack cementation coating on the carbonaceous substrate.. The invention further relates to a cork release agent composition for providing the clean release of spent pack composition from a carbonaceous substrate.

Carbonaceous substrates, and more specifically carbon-carbon composites are widely used in the aerospace and aviation industries due to the physical and mechanical properties of such materials. The high strength-to-weight ratio of carbon-carbon composites provides weight savings to aircraft components. This characteristic, coupled with the mechanical strength, toughness and dimensional stability of carbon-carbon composites to temperatures in excess of 4000.degree. F. makes these materials ideal for aerospace applications.
A potentially limiting characteristic of carbon-carbon composites is that such materials tend to rapidly oxidize at temperatures above 800.degree. F. in oxygen-containing environments. The degradation of the material due to oxidation causes loss of mechanical and physical properties. This problem must be prevented in order for these materials to be effectively used for aerospace applications, such as turbine engine exhaust nozzles the invention that follows, and in the examples and claims appended hereto.

Pack mixture composition for SiC pack cementation coating of carbonaceous substrates


A multi-purpose pet leash for tethering an animal with a plurality of components to better care for a pet on the go. The pet leash incorporates dispensable disposable bag(s), reservoir for storing a dispensable product, such as water and/or food and detachable deployable dish for holding the dispensable product.

1. Field of the Invention
The present invention relates generally to animal restraints and, more specifically, to a leash for pets having a plurality of compartments and functions that may be expediently and conveniently accessed by the user to cleanup after or care for their pet.
Comprising the leash is a retractable leash with a clip and latch for restraining a pet, a clip on/off fluid reservoir with a fold out bowl that is stored in the handle to provide nourishment for the pet on the go, and a waste bag storage area for storing of waste bags.
Additionally the present invention has means for attaching and detaching the fluid reservoir by means of clips should the user decide it is un-needed.
2. Description of the Prior Art
There are other leash devices designed for tethering pets. While these leash devices may be suitable for the purposes for which they where designed, they would not be as suitable for the purposes of the present invention as heretofore described.
It is thus desirable to provide a pet leash incorporating an extendable, retractable leash and disposable bag storage housing freeing the user from carrying the disposable bag prior to use.
It is further desirable to incorporate detachable reservoir housing for storage of a fluid, preferably water, and a collapsible dish stored within the pet lease hand grip for use as desired.

Pet leash incorporating compartments for storage and pet care ancillary supplies


A method of extending a peer-to-peer platform to a mobile communication device comprises assigning an identifier to a Voice over Internet Protocol identity and sending a license key to a trusted register in the mobile communication device. The method further comprises cross listing the identifier with the Voice over Internet Protocol identity, wherein a call placed to the Voice over Internet Protocol identity is routed to both an electronic device and the mobile communication device and routing a Voice Over Internet Protocol call addressed to the Voice over Internet Protocol identity to both the electronic device and the mobile communication device, wherein the call routing to the mobile communication device is based on the identifier and the cross listing.

Electronic devices, such as personal computers, may engage in Voice over Internet Protocol (VoIP) communications. VoIP is a methodology for delivering voice communications and multimedia over Internet Protocol (IP) networks rather than over the Public Switched Telephone Network (PSTN). VoIP communications in which electronic devices engage include videoconferencing which may allow participants to view multimedia images of communicating parties. VoIP videoconferencing can occur over peer-to-peer network architectures in which the communicating electronic devices act as peer nodes in a system that lacks central infrastructure. By acting as peer nodes, the communicating electronic devices each share a client-server role in the peer-to-peer communication.

Secure peer-to-peer call forking facilitated by trusted 3rd party voice server provisioning


An amplification device, comprising a device input receiving a device input signal, an amplifier unit comprising a zero crossing detector unit, an output filter and a lead-lag compensation network. The zero crossing detector unit compares the device input signal with a reference potential and switches a pulse width modulated detector output signal between first and second voltage levels dependent on the comparison. The amplifier unit provides an actual device output signal, e.g., an amplified representation of the device input signal. The amplification device further comprises a device output providing the actual device output signal, a control loop bridging the amplifier unit and comprising a forward filter, e.g., an integrating filter, for increasing loop gain improving the signal-to-noise ratio of the actual device output signal, and a deviation detection unit detecting over modulation of the amplifier unit, so that the amplification device disables forward filter functioning upon over modulation.

Pulse width modulation is a technique that can be used for converting an analogue signal into a binary signal, by comparing the analogue signal with a periodic reference signal. Pulse width modulation is amongst others applied in class D amplifiers, which are often used in portable audiovisual appliances. Class D amplifiers are known for their relatively high power efficiency (energy losses are small), and relatively straightforward circuit design. This allows these amplification devices to be small, and makes them suitable for portable applications. Class D amplifiers are based on the principle that an incoming signal is compared with a periodic reference signal, such as a saw tooth or triangle wave. The amplification device comprises a switched amplifier which switches between a first and second voltage level dependent on whether the input voltage is higher or lower than the reference voltage than the voltage level of the reference signal.
The output of this switched amplifier is a high-frequency square wave with varying duty cycle. Prior to delivery to the load, this signal is first low-pass filtered by an LC low pass filter. The low pass filter prevents the fast on/off portion of the signal from reaching the load, while passing the average value without attenuation.
An amplifier constructed in this manner suffers from various imperfections. The first and second voltage levels are normally not stable and affect the overall gain dynamically. The switched output stage takes a finite time to switch from the first to second voltage levels and back, and the output state is uncertain during this interval. This manifests itself in harmonic distortion. Moreover, the LC output filter, as seen from the load, constitutes a parallel resonant circuit that has a high output impedance near the cut-off frequency of the filter. A low output impedance is desirable to make the frequency response of the amplifier independent of the load impedance.
These problems are most efficiently addressed using feedback error control. Apart from improving the reproduction quality of a class D amplifier, the feedback loop can also be advantageously used to cause a controlled oscillation, thus operating the amplifier in a self-oscillating mode, obviating the need to provide an external periodic reference signal, e.g. provided by a triangle wave oscillator.
High order control loops having at least one amplitude-limited state variable usually have several stable limit cycles (oscillation conditions) or "modes". In linear (i.e. non-switching) systems, operation at any of these limit cycles is considered "instability". In switching systems, intentional operation at one of these modes is called "self-oscillation". In particular, self-oscillation can be applied in class D amplifiers as a means of significantly increasing their loop gain. Since in a self-oscillating class D amplifier it is no longer necessary to provide a periodic reference signal, the design may be simplified considerably.
Self-oscillating control loops only work well when operating in one particular mode, usually the highest frequency mode. Operation at another mode will either result in greatly deteriorated performance or may even be destructive. Self-oscillation is achieved by closing a suitable feedback loop around a zero crossing detector, i.e. around for example a class D amplifier.
The oscillation modes of a self-oscillating class D amplifier are usually calculated using the following two criteria, which are based on the Barkhausen criterium for sinewave oscillators:Arg(H(j·2·π·f))=0  (Eq. 1a)andd(Arg(H(j·2·π·f)))/df<0  (Eq. 1b)wherein H(s) is the loop function of the oscillation loop and f is the frequency. What this formula basically says is that the system can oscillate at a frequency where the phase shift of the loop is 2π (or 0) radians. These criteria settle at several frequencies, also known as modes of operation.
High order loop control entails several problems. Firstly, when an amplifier containing one or multiple integrators is overmodulated (clipped), the error between input and output is large. The integrators will keep integrating this error for the entire time the output spends in clip. Once the input signal returns to the normal range, the output remains clipped until the integrated error becomes zero again. Recovery from clipping therefore happens rather slowly, causing a distortion in the output signal that lasts until the circuit is fully recovered.
Secondly, in view of the Barkhausen criterium a loop may be potentially capable of oscillating at unwanted frequencies. This is will almost certainly happen when the loop is optimised for maximum loop gain. A designer then counts on gain margin (the surplus gain over unity in a loop magnitude response being greater than unity when the phase difference is at (multiples of) 2π), not phase margin, to prevent the circuit from oscillating at unwanted frequencies. However, when a high order control loop is clipped, gain margin effectively collapses giving the circuit the opportunity to oscillate at a lower (unstable) frequency mode.
Thirdly, a control loop has only enough degrees of freedom for a designer to fix either the closed loop response (out of which the open loop response follows) or the open loop response (out of which the closed loop response follows) but not both. The normal procedure in class D amplifiers is to design for loop gain and to correct the frequency response externally.

Self oscillating class D amplification device


The present invention relates to an inexpensive material and method of making the material having superior heat insulation capacity for use in furnaces and other apparatus. The method comprises grinding flexible graphite foil, preferably recycled material, to a small particle size, thermally shocking the particles to expand them, mixing the expanded graphite with a thermoset phenolic resin, heating the mixture under pressure to form a solid sheet and then heat treating the solid sheet. The present invention also includes a method for making a plastic material by using a thermoplastic material mixed with re-expanded graphite. The compound of thermo plastic material and re-expanded graphite is fed into an injection molding system at a relatively high temperature and injected into a mold where a plastic material is formed. The plastic material is then removed from the mold when the material is still very hot but hard set.

1. Field of the Invention
The invention relates to graphite foam material, of the type used for high temperature insulation and the like, and to a method of making the same.
2. Art Background
In the prior art, various forms of graphite material have been used as insulating materials in high temperature applications including industrial ovens and furnaces, vacuum furnaces and controlled atmosphere heating apparatus and the like.
One of the first such graphite insulating materials was powdered carbon black which had an appropriate amount of insulating capacity, but was very difficult to handle, relatively heavy, and extremely time consuming to replace. As a result with the advent of foam and resin chemistry, a number of newer materials were developed which were lighter and easier to handle, but which had the requisite insulating capacity. One such material is a carbon fiber insulating material made of a carbon fiber held in a matrix by a phenolic resin material, and formed into a board or block.
Another advantage is the reduced weight loss due to oxidation, resulting in longer furnace life between successive rebuilding of the furnace.
According to the present invention, one may use finished low density blocks, boards, billets, etc. to make higher density parts by cutting (i.e., using, for example, a cork bore or saw) to shape or mold the material into a desired shape and pressing using different pressures to the obtain desired density. For example, die formed rings can be made using the present invention. The compressive strength of the die formed rings was greater than or equal to the strength of some monolithic graphites of the prior art.
The present invention also includes a graphite material and a method for making the graphite material by using a thermoplastic material mixed with re-expanded graphite. The compound of thermo plastic material and re-expanded graphite is fed into an injection molding system at a relatively high temperature and injected into a mold where a plastic material is formed. The plastic material is then removed from the mold when the material is still very hot but hard set.

Injection molding graphite material and thermoplastic material


A tool cabinet has a housing and a hanging device. The housing has a work surface, at least one drawer and at least one opening. The at least one drawer is defined in the housing. The hanging device has at least one hanger mounted inside the at least one opening. The at least one hanger has two telescopic stands, a hanging plate and a locking device. The telescopic stands are mounted in the at least one opening and face each other. The hanging plate is mounted between the telescopic stands and extends as the telescopic stands extend. The locking device mounted on the telescopic tubes to hold the inner tube in position. When the tool cabinet is used, the hanging device can be extended out to hang and store tools. The tools can be organized and the work surface will not in be cluttered.

1. Field of Invention
The present invention relates to a tool cabinet, and more particularly to a tool cabinet with a device for hanging tools.
2. Description of the Related Art
A conventional tool cabinet is used for storing tools and has many drawers for that propose. A conventional tool cabinet has a top surface that can serve as a work surface. However, it can become difficult to work on the limited area of the top surface as tools begin to clutter the work area. The tools stored in the drawers can be taken out to be used and then returned, but this can cause inconvenience.
Thus, a real need exists for a tool cabinet that is convenient to use as a work surface and for storage.


An organic electroluminescence display device include: a substrate where a plurality of red (R), green (G) and blue (B) pixel regions are defined; a plurality of transparent electrodes on the substrate, each transparent electrode disposed in each pixel region; a buffer layer on the substrate in intervals among the transparent electrodes, the buffer layer overlapping side portions of the transparent electrodes; a separator on the buffer layer and arranged on one direction; a hole injection/transporting layer over the substrate covering the plurality of transparent electrodes, the buffer layer and the separator; a luminous layer on the hole injection/transporting layer and divided into each R, G or B pixel region; and a cathode electrode on the hole injection/transporting layer covering the divided luminous layer, the cathode electrode disposed all over the substrate to connect the R, G and B pixel regions.

1. Field of the Invention
The present invention relates to an electroluminescence display device, and more particularly, to an organic electroluminescence display device and a method of fabricating the same.
2. Discussion of the Related Art
A cathode ray tube has been widely used as a display device such as a television and a computer monitor. However, the cathode ray tube has large size, heavy weight, and high driving voltage. Therefore, flat panel displays having characteristics of being thin, light weight, and low in power consumption have been in demand. The flat panel displays include a liquid crystal display device, a plasma display panel device, a field emission display device, and an electroluminescence display device.
The electroluminescence display device may be categorized into an inorganic electroluminescence display device and an organic electroluminescence display device depending upon a source material for exciting carriers. The organic electroluminescence display device has drawn a considerable attention due to its high brightness, low driving voltage, and natural color images from the entire visible light range. Additionally, the organic electroluminescence display device has a great contrast ratio because of self-luminescence. The organic electroluminescence display device can easily display moving images due to its short response time of several microseconds, and is not limited by a viewing angle. The organic electroluminescence display device is stable at a low temperature, and its driving circuit can be easily fabricated because it is driven by a low voltage. Besides, a manufacturing process of the organic electroluminescence display device is relatively simple.
In general, an organic electroluminescence display device emits light by injecting electrons from a cathode electrode and holes from an anode electrode into an emissive layer, combining the electrons with the holes, generating an exciton, and transitioning the exciton from an excited state to a ground state. Since its luminous mechanism is similar to a light emitting diode, the organic electroluminescence display device may be called an organic light emitting diode (OLED).
FIG. 1 is a schematic cross-sectional view illustrating a related art organic electroluminescent display device. As shown in the related art organic electroluminescent display device, an anode electrode 50 is disposed on a glass substrate 12. A hole injection layer 52, a luminous layer 54 and an electron injection layer 56 are formed in series on the anode electrode 50. A cathode electrode 58 is formed on the electron injection layer 56. Namely, the hole injection layer 52, the luminous layer 54 and the electron injection layer 56 are disposed between the anode electrode 50 and the cathode electrode 58. When the driving voltage is applied to the anode and cathode electrodes 50 and 58, the holes of the hole injection layer 52 and the electrons of the electron injection layer 56 are injected into the luminous layer 54. The injected electrons are combined with the injected holes, thereby producing the electron-hole pairs (the excitons). The electron-hole pair has a lower energy than when it is separated into the electron and the hole. Therefore, an energy gap occurs between the combination and the separation of electron-hole pairs, and this energy is converted into light by the luminous layer 54. That is, the luminous layer absorbs the energy generated due to the recombination of electrons and holes when a current flows.
An organic material for the organic electroluminescent display device is classified into an organic polymer and an organic monomer. Thus, the organic electroluminescent display device is also classified into a polymeric organic electroluminescent display device, a monomeric organic electroluminescent display device, and a mixture thereof. Further, the organic electroluminescent display device can be a combined organic electroluminescent display device that uses both the organic polymer and the organic monomer.
The monomeric organic electroluminescent display device is generally fabricated through a thermal evaporation method that deposits a low molecular substance. Such thermal evaporation method forms unit pixel pattern using a shadow mask. That is, the low molecular substance is thermal-evaporated onto the substrate by passing though pre-patterned openings of the shadow mask. However, the unit pixel becomes smaller in size because the deposition is repeated using the shadow mask to form R/G/B sub-pixels. The shadow mask is not utilized for fabricating the large display device because the shadow mask sags under its own weight and size.
Meanwhile, a high molecular substance is deposited on the substrate using a spin coating method. Since the high molecular substance has a superior impact resistance and makes qualitative and strong thin films as compared to the low molecular substance, it has been used for the organic light emitting diodes. However, when the full-color type organic electroluminescent display device is fabricated using the high molecular substance, the spin coating method is avoided because it produces some disadvantages, such as a high costs of production and a thickness deviation between the central part and the peripheral part of the substrate. Namely, the spin coating method produces a thin film having nonuniform thickness. Therefore, an ink-jet technique is utilized as a new method of forming an organic electroluminescent display device.
FIG. 2 is a schematic cross-sectional view of an organic electroluminescent display device fabricated by an ink-jet technique according to a related art.
In the case of ink jet process, the high molecular substance is simultaneously deposited and patterned, and thus the fabrication process can be conducted relatively in a short time. As shown in FIG. 2, a plurality of first electrodes 50 are formed in pixel regions on a transparent substrate 12. A separator 60 is also formed on the transparent substrate 12 among the first electrodes 50 and overlaps the side portions of the first electrodes 50. Thereafter, hole injection/transporting layers 52 and luminous layers 54 are sequentially formed on the first electrodes 50 by emitting the organic polymer from an ink-jet toner. At this time, each hole injection/transporting layer and each luminous layer 54 are disposed in intervals defined by the separators 60. Further, a second electrode 58 is formed over the whole of the transparent substrate 12, thereby completing the organic electroluminescent display device. However, the above-mentioned process is rather complicating and takes relatively long time because the high molecular substance is respectively deposited in the pixel region.
FIG. 3 is a schematic plan view especially illustrating separators and red (R), green (G) and blue (B) pixels of an organic electroluminescent display device that are fabricated by an ink-jet technique according to a related art. As shown FIGS. 2 and 3, the separator 60 divides the substrate into the lattice-like red (R), green (G) and blue (B) pixels. Since the separator 60 protrudes from the substrate 12 and then makes the step, as shown in FIG. 2, the second electrode 58 is broken and cut when forming the second electrode 58 over the transparent substrate 12.

Organic electroluminescence display device and method of fabricating the same


This disclosure refers to the securing of lenses in an ophthalmic mounting having a split rim eyewire using a spring loaded connecting device.

The invention relates to spectacle frames of the split rim type, usually made of metal materials, with the rim member having a cross sectional indentation to hold the beveled edge of the lens securely. The split allows the opening of the rim when inserting or removing a lens, and endpieces are attached to the ends of the split, by solder or other means, in order to provide a method for locking the split in a closed position.
It is important that the ends of the split be held firmly together so that the lens will be locked securely in place. A lens falling out of a frame is a major inconvenience to the wearer, and frequently results in the expense of a broken lens having to be replaced. Whatever means is used for holding the split closed must not only keep the frame closed tightly, but at the same time allow the frame to be opened for occasions where the replacement of a lens may be necessary.
In the history of related art, screws have been by far the most commonly used method for holding these described endpieces together and keeping the split rim tightly closed around the lens. Unfortunately, it is very common for such screws to gradually work loose, causing a lens in some cases to fall out. Even in cases where the lens may not fall out, it is still possible that the lens can rotate within the frame, thus altering the optical properties of the glasses when prescription lenses are involved. It is particularly critical that the cylinder axis of a lens for the correction of astigmatism is maintained in the proper rotational alignment to be effective. Therefore, even minor loosening of the frame is undesirable.
The threads of the typically tiny screws used, as well as the receptor threads in the eyeglass frame, often cause additional problems by stripping out. Quite frequently a perfectly good frame can be rendered useless only because of stripped threads. A nut and bolt combination can often provide a makeshift solution to this problem, but is generally unattractive and is also subject to loosening.
Many previous attempts have been made to solve the drawbacks of screws for this application, but have been either ineffective or have introduced other disadvantages. The continued predominance of the use of screws in this regard is a strong indication of the failure of previously proposed methods to adequately fulfill all of the requirements of spectacle frames.
Designs using clips which slide or snap either onto the eyewire endpieces (patent #'s 308,344 & 2,006,917) or over the screw to prevent it from backing out ( #1,882,153) have been proposed. Another approach has been the bending of certain parts to prevent loosening of the frame (#735,917) or turning of screws (#2,740,327). The problems introduced by these designs are numerous. In some cases they make insertion of the lenses during assembly of the eyeglasses awkward, which is an important consideration for the many optical laboratories which provide one hour service, where ease and speed of assembly are required. In other previous attempts the option of replacing a lens which may have been accidentally broken is impractical, particularly when parts of the frame must be restraightened and bent again during the lens replacement, leading to problems with metal fatigue. Sometimes the extra parts attached to the frame may be bulky and compromise the visual appeal of the eyewear, which is an important consideration of eyeglass wearers. In other previously designed systems, springs have been used to maintain a closing force on the opening in the eyewire (#'s 3,473,839, 3,609,018, 4,256,387, 4,360,252 & 4,813,775). None of these approaches solve the problems of screws without introducing others. In many cases, the frames are designed so that they can only be partly opened for lens insertion or removal. This can lead to problems and even hazards when trying to insert or remove glass lenses which can chip under these circumstances, thus causing lens spoilage. Some of the designs are not suitable for frames made of thin metal materials, therefore having limited application to only certain other types of frames. In other cases, the design does not allow any tolerance for lenses having anything but an absolutely precise fit for the frame. If the lenses are even the slightest amount too large, the device will not allow closure of the frame. Other methods, such as toggle levers or cam type arrangements have also been proposed ((#'s 2,730,012, 2,73,709 & 2,754,724) but are generally too bulky in appearance to be suitable for delicate frames made of thin materials. Soldering the frame closed has even been proposed (#2,104,503), but this is clearly impractical because of the adverse effects the high temperatures would have on plastic lens materials, as well as difficulties with lens replacement. Still another approach has been the design of frames where the screws are mounted transversely to the plane of the lens (#'s 1,590,719 & 3,762,804). These designs still use conventional screws, however, and in addition sometimes make assembly of the glasses more difficult because the frame must be held in a tightly closed position while the screw is being inserted. Those skilled in the art will readily admit the difficulty of holding a frame closed and keeping the lens positioned properly while simultaneously trying to engage the threads of a tiny screw into the frame.


A shield connection between a pc-board for electrical and/or electronic components located in a housing and at least one connector socket located in a wall of the housing with a metal cylindrical socket casing that passes through the housing wall includes a receiving device for a plug with a corresponding metal coupling component, which is electrically connected with the shield of a cable connected to the plug. To create a shielded connection, the shield potential is automatically distributed further by the connection to the housing The shield connection consists of a metal ring-shaped shield element, which includes contact pins for the electrical and mechanical connection with the pc-board. The contact pins each protrude from the ring plane on the one ring side, with the spring tongues protruding on the other side of the ring for electrical and mechanical contact with the socket casing.

It is generally known to improve and simplify the electrically conducting coupling of an electrical lead shielding for connections to equipment provided within a housing. To this end, document DE 298 05 316 U1 describes an angle-shaped shield element with a spring contact that is located in the area of a housing entry of a shielded electrical lead, in order to establish a shield connection to the housing without additional expenditure of time when connecting the shield to the housing. Known from document DE 197 34 422 A1 are shield elements that are provided for connector devices with shielded electrical lines and that have the shape of protective caps or rectangular housings that must be plugged into a mounting frame.


A surfactant represented by the formula:

Surfactants are well known materials which are used broadly for industrial and personal uses. For example, surfactants are often used as rheology modifiers for drilling applications. And in other instances, surfactants are used in detergent compositions, such as hard surface cleaners, laundry detergents, and personal care compositions.
The demand for mild surfactant compounds in the area of detergents, personal products, cosmetics, oral hygiene and pharmaceuticals has been steadily rising. Recent advances in esterification and transesterification techniques have surprisingly enabled development of novel surfactants which may be sourced from a wide variety of feedstocks.
In general, most compositions contain surfactants derived from petrochemicals. Since petro-chemicals can sometimes have handling, storage, and environmental hazards associated with them, it would be most desirable to use surfactants which are instead derived from agriculturally grown materials, such as vegetable oil fatty acids. These naturally occurring compounds have the distinct advantage of being readily available, inexpensive, biodegradable, and aquatically favorable.
One of the drawbacks of naturally derived anionic surfactants has been an apparent decline in cleaning performance versus more traditional petrochemical surfactants. Among surfactants generally formed from petrochemical sources, sodium lauryl sulfate (SLS) is considered to be a highly effective surfactant for removing oil and residues. Shampoo compositions, for example, typically combine sodium lauryl sulfate and/or sodium laureth sulfate, and another co-surfactant. SLS is generally combined with other surfactants, and used in relatively low concentrations, because it is known to irritate sensitive skin. Baby shampoos may exclude SLS altogether because it may cause skin and eye irritation in small children. Therefore, there is a need for a mild surfactant which may supplement SLS in personal care compositions.
Based on the foregoing, there is a need for mild anionic surfactants which may be derived from petrochemical sources, but which may also be derived from natural and sustainable feedstocks, and which has excellent cleansing, foaming, viscosity building, and dermatological compatibility.

Mild anionic surfactants suitable for personal care compositions

Abstract: wherein:        R1 is CH3(CH2)m and may be interrupted with at least one heteroatom selected from the group consisting of amine, ether, ester, amide, sulfur, sulfur monoxide, sulfer dioxide, sulfamate, hydroxy, or mixtures thereof; and        m=6-16        n=0 or 1        R2=H or CH3; and        R3=H, SO3X, CO(CH)2COOH, or COCH(SO3X)CH2COOX1;        wherein X and X1 are the same or different, and each is selected from NH4+, an alkali metal, or an H atom.


Disclosed is a dispenser for padded tape handles.

Tape handles have been provided for adherence to an object to facilitate carrying and manipulation of the object. As shown in FIG. 1, a tape handle 10 is constructed with a flexible backing strip 12, usually polymeric. The tape handle includes an intermediate non-adhesive portion and a pair of end portions on either side of the intermediate non-adhesive portion. Each of the end portions are coated with a layer of pressure sensitive adhesive. In FIG. I, the tape handle 10 includes one major surface 14 coated with a layer 16 of pressure sensitive adhesive. Intermediate portion 20 of the layer of pressure sensitive adhesive is then masked or covered by a deadening strip 18, with both ends 22 and 24 of the layer of pressure sensitive adhesive on either side of the deadening strip remaining exposed and provided to adhere the tape handle to an object 26, such as a package, at spaced locations, as shown in FIG. 2. The intermediate, masked portion 20 projects away from the object to form a loop 28 that is presented for manual engagement and the end portions adhere to the object with sufficient strength to enable the package to be lifted, carried or otherwise manipulated by grasping the handle.
Alternatively, the flexible backing strip 12 may be preferentially coated with a layer of pressure sensitive adhesive adjacent either end 22, 24 of major surface 14 of backing strip 12, with a intermediate portion of that major surface remaining uncoated.
Since the tape handles are generally considered disposable once applied to an object, it is desirable to provide multiple tape handles in a form that is convenient to store and to dispense individual tape handles when needed. Although a plurality of tape handles may be detachably sequentially secured in end to end relation and stored in roll form, it is desirable in many situations to reciprocally releasably adhere a plurality of the tape handles to each other with the pressure sensitive adhesive coated portions of one tape handle releasably securing the tape handle to an adjacent tape handle in pad form, as shown in FIG. 1, extending from an uppermost tape handle 10a, to a lowermost tape handle 10b. It is to be understood that the terms "uppermost" and "lowermost" as applied to the present invention do not refer to the actual physical orientation of the pad, but rather to the relative positions of individual tape handle with respect to the pad of tape handles and the sequence in which the tape handles are most conveniently dispensed from the pad.
Such tape handle pad constructions 30 conventionally include a removable release liner 32 covering the exposed pressure sensitive adhesive surfaces of the lowermost tape handle. Of course, padded tape handles may be provided in a number of different arrangements utilizing varying methods of construction.
Ordinarily, the pad 30 of tape handles as shown in FIG. 1, must be grasped in one hand while the uppermost individual handle 10 is grasped by the other hand and pulled away from the pad. Once separated, the pad of handles is released and both hands are required to apply the separated tape handle to an object, as in FIG. 2. This is a somewhat cumbersome and time consuming operation. Simply removing the release liner from the pad and applying the lowermost tape handle to a surface to secure the pad to the surface has been found to be unsatisfactory in that each sequential uppermost tape handle that is removed from the pad has an undesirable tendency to curl or adhere to itself before the tape handle can be applied to an object.
Thus, in many situations, it would be desirable to provide a dispenser to conveniently, rapidly and repeatedly present the pad of tape handles for sequential dispensation of individual tape handles, preferably with one hand.

Minnesota Mining and Manufacturing Company


A LIDAR unit includes: an LD driver, a laser diode, and a scanner corresponding to an emission unit; a photo detector, a current/voltage conversion circuit, a A/D converter and an valuable segmenter that correspond to a light receiving unit; a landmark position prediction unit and landmark map acquisition unit that acquire position information indicating the position of a landmark on a map; and a synchronization controller that generates a valuable pulse trigger signal and a segment extraction signal. Based on a predicted current vehicle position value and the position of the landmark on the map, the landmark position prediction unit determines a predicted angular range of the landmark. The synchronization controller generates the valuable pulse trigger signal and the segment extraction signal such that the scan density of the light pulse is higher in the predicted angular range than the scan density of the light pulse in the other range.

Conventionally, there is known a technology for measuring the distance to a peripheral object. For example, Patent Reference-1 discloses a vehicle-mounted system equipped with a LIDAR which detects a point group of the surface of an object by scanning the horizontal direction with intermittently emitted laser light and by receiving the reflected laser light.
Patent Reference-1: Japanese Patent Application Laid-open under No. 2014-89691

Light control device, control method, program and storage medium


The present disclosure discloses a drip hose, comprising a hose body and a drip head inner plug. A sealing post is fixed in the opening of the hose body, a sealing ring is fixed in the interior of the drip head inner plug, the drip head inner plug is capped in the hose body, the sealing post blocks the sealing ring, the sealing post, the sealing ring and the drip head inner plug jointly form a storage space; a small liquid outlet aperture is arranged in the sealing ring, and a small liquid outlet hole is arranged in the head of the drip head inner plug, and the small liquid outlet aperture is in communication with both the storage space and the opening of the hose body.

In people's daily lives, daily necessities contained in packaging containers such as hoses are often used. When using, the user squeezes the hose body directly to push out the content.
However, for the ordinary hose on the market, when the content is squeezed out, the liquid sometimes flows out of the small outlet too fast under large pressure force, and the phenomenon of jetting water often occurs, which is inconvenient to use and easy to cause waste of content.


An electrical switching system includes a constant-power controller and a switching device electrically coupled between a first node and a second node. The constant-power controller is configured to (a) generate a digital control signal to control the switching device, (b) control a duration of an active phase of the digital control signal at least partially based on a voltage across the switching device, and (c) control a peak value of the digital control signal to regulate a peak magnitude of current flowing through the switching device.

Switching devices, such as transistors, are commonly used to control flow of current in electrical circuits. For example, a switching device may serve as a circuit breaker to interrupt flow of current in an electrical circuit, such as in response to a fault or an overload condition. Switching devices are sometimes electrically coupled to energy storage devices, such as capacitors, inductors, and/or batteries. Accordingly, a switching device may need to handle a large current magnitude associated with charging and/or discharging an energy storage device.

Electrical switching systems including constant-power controllers and associated methods


With a docking device for the coupling of a handler or prober to a test head for electronic components, at least one locking unit is provided, which has an axially displaceable ball element clamping sleeve. This ball element clamping sleeve is surrounded by an annular pressure chamber, closing pressure-tight opposite the introduction area of the locking pin and can be moved in an axial direction by means of a ring piston, which can be actuated by a pressure means introduced into the pressure chamber.

The invention relates to a docking device for the coupling of a first device including a handler or prober with a second device including a test head for electronic components.
To test electronic components such as, for example, integrated circuits (IC), the principle is known of using a testing device with a test head, which must be connected to a handling device for the electronic components, such as a handler or prober. In order to allow for the docking of the test head, which may weigh up to 1,000 kg, to the handling device in the simplest, easiest, and most precise way possible, special docking devices, i.e. coupling devices, have been developed, which on the one hand are secured to the handling device and, on the other hand, to the test head. A disadvantage with such known docking devices, however, is the fact that the docking of the test head using these docking devices is not always possible in the simple, easy, and precise manner desired, and, in addition, they are frequently expensive or complex in their structure.
From DE 102 16 003 A1, a docking device is known, which avoids the disadvantages referred to above by means of a ball element clamping sleeve, which is arranged torsionally-resistant but displaceable in its axial direction inside the locking unit, and can be moved in the axial direction in the manner of a spindle by means of a threaded sleeve surrounding the ball element clamping sleeve. The rotation of the threaded sleeve is effected by means of a draw cable device. Although this known docking device already has perceptible advantages over other known devices, it nevertheless requires improvement with regard to its handling.

Docking device actuated by pressure means


The present disclosure provides a voice wakeup method, apparatus and system, a cloud server and a readable medium. The method comprises: receiving a first request input by the user in a voice manner after a smart device enters a voice recognition phase; judging whether the first request after semantic parsing is consistent with pre-stored wakeup words; determining that the received first request is used to re-wake up the smart device if the first request is consistent with the pre-stored wakeup words. According to the above technical solutions, after the smart device enters the voice recognition phase, if the received first request is the wakeup words, the smart device does not perform service satisfaction processing for the first request. Capability of recognizing that the first request is re-wakeup does not cause a command recognition error and thereby can satisfy the user's expectation. The voice wakeup solution according to the present disclosure can effectively process the user's request and thereby can effectively improve the user's experience in use.

As science and technology develops, many known smart devices support a user's voice input to enable the user to use the smart device more conveniently.
If a smart device is online for a long time period, this causes larger power consumption and shorter service life of the smart device. Therefore, the known smart device may be in a sleep state when not in use to save power consumption. When the user needs to use the smart device, he may wake up the smart device through wakeup words. Then the smart device gets into a voice recognition state. In this state, the smart device receives a user-input request in the form of voice, implements recognition of the user's voice and analysis of semantics in cooperation with a cloud server, and satisfies service requested by the user. In the prior art, when the user wakes up the smart device, if the wakeup words are input through voice at least twice, the wakeup words of the first time may be recognized as being used to wake up the smart device, and subsequent wakeup words are recognized as input of the voice request, whereupon the smart device inquires the user-requested service according to the wakeup words in cooperation with the cloud server.
Therefore, according to the voice wakeup solution in the prior art, if the wakeup words are input at least twice upon wakeup, the latter wakeup words are mistaken as the user's voice request, which causes command recognition errors and cannot satisfy the user's expectation.

Voice wakeup method, apparatus and system, cloud server and readable medium

BAIDU ONLINE NETWORK TECHNOLOGY (BEIJING) CO., LTD.


A method comprises computing a color factor value indicating an amount of color gradients in at least one color channel from the query image. The method comprises combining the color-keypoints with the gray-keypoints when the color factor value is greater than a threshold. A method for performing a visual search comprises extracting a plurality of local descriptors from a query image and then selecting a subset of them based on various criteria's such as visual meaning score. A method comprises aggregating each mean vector for each visual codeword from distances between each visual codeword and local descriptors. The method comprises aggregating variance vector for each visual codeword from the distance between each visual codeword, and local descriptors. The method comprises transmitting aggregated mean vector information and aggregated variance vector information to a search server for efficient image retrieval.

Visual search requires two steps in the retrieval part: (i) using the global descriptors for the query image to shortlist the database images, and (ii) by using the local descriptors within a geometric verification step, calculating the matching scores between the query image and all the database images in the retrieved shortlist.
Currently, MPEG standardizes a test model for Compact Descriptors for Visual Search (CDVS) with improved performance.

Apparatus and method for performing visual search


An electronic device comprising: a semiconductor chip having plural electrode pads on one main surface thereof; a wiring board having plural connection parts; and plural salient electrodes disposed respectively between the electrode pads of the semiconductor chip and the connection parts of the wiring board to provide electrical connections between the two, the salient electrodes being arranged in an array not providing balance of the semiconductor chip with respect to one main surface of the wiring board, the plural connection parts of the wiring board being arranged at a deeper position than one main surface of the wiring board in a depth direction from the one main surface.

The present invention relates to an electronic device and a method of manufacturing the same. Particularly, the invention is concerned with a technique applicable effectively to an electronic device which adopts a flip-chip mounting technique.
As an electronic device there is known an electronic device called MCM (Multi Chip Module). In MCM, plural semiconductor chips each incorporating an integrated circuit are mounted on a wiring board to implement one synthetic function. In connection with MCM, the adoption of a flip-chip mounting technique is becoming more and more popular in which a semiconductor chip (flip-chip) with salient electrodes formed on electrode pads on a circuit-formed surface is mounted onto a wiring board. This is for increasing the data transfer speed and for the reduction of size.
As to the flip-chip mounting technique, various mounting methods have been proposed and put to practical use. For example, mounting methods called CCB (Controlled Collapse Bonding) and ACF (Anisotropic Conductive Film) mounting are adopted practically.
In CCB method, solder bumps of, for example, a ball shape are formed as bump electrodes (salient electrodes) on electrode pads of a semiconductor chip, then the semiconductor chip is put on a wiring board, and thereafter a heat treatment for melting the solder bumps is performed to connect connection parts as wiring portions on the wiring board with the electrode pads of the semiconductor chip electrically and mechanically.
In ACF mounting method, stud bumps of such as gold (Au) are formed as bump electrodes (salient electrodes) on electrode pads of a semiconductor chip, then the semiconductor chip is put on a wiring board through an anisotropic conductive resin (ACF) of a sheet shape as a bonding resin, thereafter the semiconductor chip is compression-bonded to the wiring board under heating and the stud bumps are electrically connected to connection parts on the wiring board. The anisotropic conductive resin comprises an insulating resin and a large number of conductive particles dispersed and mixed therein.
Having studied the foregoing flip-chip mounting techniques, the present inventors found out the following problems.
(1) There are various types of arrays as pad arrays of a semiconductor chip. Among them is included a central pad array in which plural electrode pads are arranged in a line along a central region which extends along a center line in X or Y direction of a circuit-formed surface of a semiconductor chip. This central pad array is adopted, for example, for a semiconductor chip in which is incorporated a DRAM (Dynamic Random Access Memory) as a memory circuit.
For example in the case of a DRAM there are the following requirements with respect to the arrangement of electrode pads (bonding pads). Electrode pads should be arranged near an input/output circuit for the reduction of wiring inductance. Moreover, for the prevention of device damage in bonding process, a semiconductor device should not be formed just under electrode pads. Further, for the purpose of improving the operating speed, the distance from an input/output circuit up to a remotest portion in a memory mat should be made as short as possible. Satisfying these requirements results in such a layout on DRAM chip as shown in FIG. 21, in which electrode pads are arranged centrally in a long side direction of the chip. In FIG. 21, the numeral 30 denotes a DRAM chip, MARY denotes a memory array, PC denotes a peripheral circuit, I/O denotes an input/output circuit, and BP denotes an electrode pad.
In the case of a central pad array, the array of bump electrodes formed respectively on the electrodes pads is also a central bump array. If such a semiconductor chip is used in flip chip mounting, it is impossible to take balance of the chip, so that the chip tilts with respect to one main surface of a wiring board. Thus, in the case of a semiconductor chip having a central pad array, it is difficult to effect flip chip mounting. As another example of a pad array (bump array) with a semiconductor chip not well-balanced, there is, other than the central pad array, a one-side pad array (one-side bump array) in which plural electrodes pads are arranged in a line along one of two opposed sides of the chip.
(2) In ACF mounting method, stud bumps are compression-bonded to connection parts on a wiring board with a thermoshrinking force (a shrinking force developed upon return to a state of normal temperature from a heated state) or a thermocuring shrinking force (a shrinking force developed upon curing of a thermosetting resin) of an anisotropic conductive resin interposed between a wiring board and a semiconductor chip. On the other hand, since the thermal expansion coefficient of an anisotropic conductive resin is generally larger than that of stud bumps, the amount of expansion in the thickness direction of the anisotropic conductive resin is larger than that in the height direction of stud bumps. Consequently, there may occur a poor connection such that stud bumps come off from connection parts on the wiring board due to the influence of heat. Therefore, it is necessary that the volume of the anisotropic conductive resin between the wiring board and the semiconductor chip be made as small as possible.
In this connection, a technique for diminishing the volume of an anisotropic conductive resin between a wiring board and a semiconductor chip is disclosed, for example, in Japanese Published Unexamined Patent Application No. Hei 10(1998)-270496 (U.S. Pat. No. 6,208,525). According to the technique disclosed in this unexamined publication, as shown in FIG. 12 thereof, xe2x80x9ca groove 19A is formed in a rigid wiring board 19, electrode pads 4A formed within the groove 19A, and the electrode pads 4A and bump electrodes 15 are connected together within the groove 19. According to this configuration, a gap between the wiring board 19 and a semiconductor chip 10 becomes narrower by an amount corresponding to the depth of the groove 19A in comparison with the case where there is no top insulating layer on the wiring board and the electrodes pads 4A and a top wiring layer are exposed, whereby it is possible to reduce the thickness of an adhesive (anisotropic conductive resin) 16 interposed between the wiring board 19 and the semiconductor chip 10.xe2x80x9d
However, according to the above configuration wherein a groove is formed in a wiring board and electrode pads (connection parts) on the wiring board and bump electrodes (stud bumps) are connected together within the groove, there arises a new problem.
In the case of electrode pads on a semiconductor chip, a plane size depends on the array pitch of the electrode pads (a pad array pitch) and the narrower the pad array pitch, the smaller the plane size. If a thinner gold wire is used to form stud bumps of a smaller diameter with such a decrease in size of the electrode pads, the height of each stud bump also becomes smaller accordingly. That is, if the pad array pitch differs, the stud bump height differs as well.
On the other hand, in a certain electronic device, such as MCM, several types of semiconductor chips different in the degree of integration and in function are mounted on a single wiring board, but these semiconductor chips are not always equal in pad array pitch. With different pad array pitches, there are different stud bump heights, so in the case of a semiconductor chip wherein the stud bump height is larger than the depth from one main surface of a wiring board to connection parts thereof, it is possible to easily effect connection between the wiring board connection parts and the stud bumps, but in the case of a semiconductor chip wherein the stud bump height is smaller than the depth from one main surface of a wiring board to connection parts thereof, it is difficult to effect connection between the wiring board connection parts and the stud bumps.
If a depth position of the wiring board connection parts is set to match the semiconductor chip having the smallest stud bump height out of the semiconductor chips to be mounted on the wiring board, stud bumps can be connected to the wiring board connection parts even in a semiconductor chip having the smallest stud bump height. In this case, however, in a semiconductor chip having a large stud bump height, the volume of an anisotropic conductive resin interposed between the semiconductor chip and the wiring board becomes large and there may occur a poor connection such that the stud bumps come off from the wiring board connection parts under the influence of heat.
It is an object of the present invention-to provide a technique capable of suppressing a tilt of a semiconductor chip relative to one main surface of a wiring board.
It is another object of the present invention to provide a technique which permits several types of semiconductor chips different in pad array pitch to be mounted on a single wiring board.
The above and other objects and novel features of the present invention will become apparent from the following description and the accompanying drawings.
A brief description will be given below about typical inventions out of those disclosed herein.
(1) An electronic device according to the present invention includes:
a semiconductor chip having a plurality of electrode pads on one main surface thereof;
a wiring board having a plurality of connection parts exposed on a surface thereof; and
a plurality of salient electrodes arranged in a line between the electrode pads of the semiconductor chip and the connection parts of the wiring board,
the plural connection parts of the wiring board being located at a deeper position than the one main surface of the wiring board in a depth direction from the one main surface.
The wiring board further includes an insulating film comprising the one main surface and an opening formed in the insulating film, and the plural connection parts are disposed in a bottom of the opening.
The insulating film is present straddling a peripheral edge of the semiconductor chip.
A plane size of the opening is smaller than that of the semiconductor chip, while a plane size of the insulating film is larger than that of the semiconductor chip.
According to the above means (1), the height of the salient electrodes is absorbed by the depth from the one main surface of the wiring board to the connection parts at the time of flip-chip mounting of the semiconductor chip, so that it is possible to suppress a tilt of the semiconductor chip relative to the one main surface of the wiring board.
(2) An electronic device according to the present invention includes:
a first semiconductor chip having a plurality of first electrode pads arranged at a first pad array pitch on one main surface thereof;
a second semiconductor chip having a plurality of second electrode pads arranged on one main surface thereof at a second pad array pitch smaller than the first pad array pitch;
a wiring board having in a first area of one main surface thereof a plurality of first connection parts arranged correspondingly to the plural first electrode pads and also having in a second area different from the first area on the one main surface a plurality of second connection parts arranged correspondingly to the plural second electrode pads;
a plurality of first salient electrodes each disposed between each of the first electrode pads and each of the first connection parts and providing an electrical connection between the two; and
a plurality of second salient electrodes each disposed between each of the second electrode pads and each of the second connection parts and providing an electrical connection between the two, the plural first connection parts and the plural second connection parts being disposed at a deeper position than the one main surface of the wiring board in a depth direction from the one main surface, and
the second plural salient electrodes having a multistage bump structure with a larger number of stages than the plural first salient electrodes.
The wiring board further includes an insulating film formed on the one main surface thereof, a first opening in the insulating film in the first area of the one main surface, and a second opening formed in the insulating film in the second area of the main surface, the plural first connection parts are disposed in a bottom of the first opening and the plural second connection parts are disposed in a bottom of the second opening.
The second salient electrodes have a multi-stage bump structure having base bumps connected to the second electrode pads of the second semiconductor chip and stack bumps stacked on the base bumps.
The second salient electrodes have a multi-stage bump structure having base bumps connected to the second electrode pads of the second semiconductor chips, first stack bumps stacked on the base bumps, and second stack bumps stacked on the first stack bumps.
According to the above means (2), at the time of flip-chip mounting the first and second semiconductor chips, salient electrodes can be connected to the second connection parts of the wiring board also in the second semiconductor chip, so that the first and second semiconductor chips different in pad array pitch can be mounted on a single wiring board.

Electronic device and a method of manufacturing the same


Hydrolysates and/or condensates of epoxy- and silane-functional oligomers and polymers, prepared by hydrolyzing and/or condensing at least one oligomer and/or polymer (A) containing at least one epoxide group (a1) and at least one hydrolyzable silane group (a2); and also (meth)acrylate copolymers (A) containing lateral and/or terminal epoxide groups (a1) and lateral and/or terminal hydrolyzable silane groups (a2), in a molar ratio (a1): (a2) of from 15:1 to 1: 1.5, processes for preparing them, and their use.

The present invention relates to new hydrolysates and/or condensates of epoxy- and silane-functional oligomers and polymers. The present invention also relates to a new process for preparing hydrolysates and/or condensates of epoxy- and silane-functional oligomers and polymers. The present invention further relates to the use of the new hydrolysates and/or condensates of epoxy- and silane-functional oligomers and polymers and of the hydrolysates and/or condensates of epoxy- and silane-functional oligomers and polymers prepared by the new process as new curable compositions or for preparing new curable compositions. The present invention relates not least to the use of the curable compositions for producing new cured compositions, especially coatings and paint systems, and also moldings, especially optical moldings, and self-supporting sheets.
Curable compositions based on hydrolysates and/or condensates of epoxy-functional silanes are known from, for example, patent applications EP 1 179 575 A 2, WO 00/35599 A, WO 99/52964 A, WO 99/54412 A, DE 197 26 829 A 1 or DE 195 40 623 A 1. They serve in particular to produce highly scratch-resistant coatings.
Curable compositions based on silanes which contain at least one olefinically unsaturated group, in particular a vinyl group or a methacrylate or acrylate group, such as vinyltrimethoxysilane or methacryloyloxypropyltrimethoxysilane (MPTS), for example, are known from patent applications WO 00/22052 A, WO 99/54412 A, DE 199 10 876 A 1 or DE 197 19 948 A 1
According to international patent application WO 99/54412 A, for example, MPTS is hydrolyzed and/or condensed in the presence of gamma-AlO(OH) nanoparticles. The resulting gel is evaporated down and used as a powder clearcoat material. The applied powder clearcoat material is cured thermally.
According to patent applications WO 00/22052 A, DE 199 10 876 A 1 or DE 197 19 948 A 1, for example SiO2 nanoparticles are silanized with MPTS and mixed with polyfunctional acrylates, such as trimethylolpropane triacrylate The resulting suspensions can be polymerized with UV radiation or electron beams.
Thermally curable compositions based on copolymers containing epoxide groups and hydrolyzable silane groups are known from American patent U.S. Pat. No. 4,772,672 A. The curable compositions must be cured using aluminum or zirconium chelate complexes. The curable compositions can have from 0.1 to 1% by weight of water added to them, based on their respective total amount, in order to accelerate the cure.
An essential objective of these developments is to provide curable compositions for producing cured compositions, especially coatings and paint systems, and also moldings, especially optical moldings, and self-supporting sheets.
The curable compositions ought to be easy to prepare with great reproducibility and for use in the liquid state ought to have a solids content >30% by weight without detriment thereby to their transportability, storage stability or processing properties, in particular their application properties
The curable compositions ought to give cured compositions, especially coatings and paint systems, more particularly clearcoats, moldings, especially optical moldings, and self-supporting sheets which are highly scratch-resistant and chemicals-stable. In particular it ought to be possible to produce the coatings and paint systems, more particularly the clearcoats, in film thicknesses>40 μm without the appearance of stress cracks. This is an essential prerequisite for the use of the coatings and paint systems, especially the clearcoats, in the technologically and esthetically particularly demanding segment of automotive OEM finishing. In this context they are required in particular to exhibit a particularly high carwash resistance, manifested in the AMTEC carwash test, which is relevant to practice, by a residual gloss (20° to DIN 67530>70% of the original gloss.
The existing curable and cured compositions are unable, however, to meet this profile of requirements to its full extent.
It is an object of the present invention to provide new materials containing epoxide groups and silane groups which allow the production of new curable and cured compositions which do meet the profile of requirements depicted above to its full extent. The new epoxy-functional and silane-functional materials ought, furthermore, to be easy to prepare with very great reproducibility, ought not to pose any environmental problems, and ought consequently not to require any approval under chemicals law.

Oligomers and polymers containing hydrolysates and/or condensates of epoxide groups and silane groups, method for their production and use thereof


Provided herein are methods and devices to enrich trace quantities of impurities in gaseous mixtures, such as hydrogen fuel. The methods and devices rely on concentration of impurities so as to allow the detection of the impurities using commonly-available detection methods.

1. Field of the Invention
The invention relates to the field of detection of impurities in a fluid. Specifically, the invention relates to an apparatus and method that facilitates the detection of minimal quantities of impurities in hydrogen fuel through concentration of the impurities by a known amount and subsequent measurement of the concentrated impurities. When coupled with an appropriate detector or sensor, the device can provide quantitative analysis (or concentrations) of the impurities in the original sample gas.
2. Background of the Invention
Fuel cell and other hydrogen fueled vehicles are slated for commercial deployment in the US and around the world. A number of demonstration hydrogen refueling centers have been set up around the US. Several teams of vehicle manufacturers and fuel suppliers have worked with state and federal government1,2 in the demonstration of hydrogen refueling centers where the hydrogen is dispensed at the nozzle at elevated pressure (5,000-10,000 psig) into a vehicle's hydrogen storage tanks. Since fuel cells are very sensitive to gases like carbon monoxide, hydrogen sulfide, ammonia, etc., the fuel supplier must ensure that the concentrations of these species are limited to suggested guidelines. Examples of these guideline values suggested by the Society of Automotive Engineers (SAE) are shown in Table 1, and show that the limits on CO, NH3 and sulfur are extremely low and that they are at, or very close to, the detection limits of standardized analytical methods.
TABLE 1SAE suggested guideline values for the maximumallowable concentrations for impurities inhydrogen for fuel cell vehicles.Hydrogen, minimum99.97%Impurities & LimitsMaximum(Excluding helium, must be <100 ppm)Helium (He)300ppmNitrogen (N2) + Argon (Ar)100ppmTotal Hydrocarbons (HC) (C1 basis)2ppmCarbon Dioxide (CO2)2ppmCarbon Monoxide (CO)0.2ppmAmmonia (NH3)0.1ppmSulfur (S, as H2S, COS, etc.)0.004ppm                H2 suppliers (stations) will need to meet these specifications and certify the purity of the product they dispense.
Hydrogen-generation plants currently at the demonstration refueling centers operate at conservative operating conditions to ensure the desired quality of hydrogen. The gas dispensed to the vehicles is periodically sampled and analyzed using customized analytical methods and sophisticated equipments. Organizations such as the ASTM are developing new standardized methods for the analysis of hydrogen for fuel cells.
Meanwhile, the current practice is to harvest samples periodically and send the samples to analytical laboratories, where the fluids are analyzed. State of the art instrumentation is required, such as, for example, a gas chromatograph fitted with a pulse discharged helium ionization detector (GC/PDHID) to analyze for carbon monoxide at concentrations of 0.2 parts per million or lower, or a gas chromatograph fitted with a sulfur chemiluminescence detector (GC/SCD) to analyze for total sulfur species. These sensitive instruments are expensive, and they require considerable laboratory time of skilled analytical chemists.
The high cost of these analyses can be borne by the demonstration projects because of the large intervals between gas samples. However, with the larger deployment of fuel cell vehicles and the anticipated growth in the refueling infrastructure in the years ahead, refueling stations will have to conduct more frequent and rapid analysis and/or monitoring of the key species, using simpler and inexpensive technologies. Some of the key factors that necessitate the development of new analytical technology for analysis of hydrogen are:                Standardized methods for analysis of the trace species have not been defined and validated.        Current methods require the use of expensive equipment that can cost in excess of $100,000 per unit and are not suited for on-site analysis. Indeed, the pressures at which hydrogen is to be stored at refueling stations is much higher than state of the art current hydrogen sampling methods which operate at no more than atmospheric pressures, and usually less.        Current methods require considerable time and skilled operators.        Current analytical methods can add 4-10 cents/kg to the cost of hydrogen.
A need exists in the art for an in-situ apparatus and method to determine contaminant levels in hydrogen fuels. The apparatus and method should not require costly analytical tools or elaborate protocol so as to allow their use by minimally trained personnel at vehicle refilling stations. The apparatus and method should be operable at hydrogen gas pressures much higher than atmospheric pressure, and typically operable at pressures at which hydrogen gas is commercially stored.

Device for sampling and enriching impurities in hydrogen comprising hydrogen-permeable membrane


A system and method are provided for increasing the number of processors on a single integrated circuit to a number that is larger than would typically be possible to coordinate on a single bus. In an embodiment of the present invention a two-level memory coherency scheme is implemented for use by multiple processors operably coupled to multiple buses in the same integrated circuit. A control device, such as node controller, is used to control traffic between the two coherency levels. In an embodiment of the invention the first level of coherency is implemented using a “snoopy” protocol and the second level of coherency is a directory-based coherency scheme.

1. Field of the Invention
The present invention is directed in general to data communications. In one aspect, the present invention relates to a method and system for improving data transfer between a plurality of processors on a single integrated circuit.
2. Related Art
As is known, communication technologies that link electronic devices may use multiprocessor switching devices to route and process signal information. Some communication technologies interface a one or more processor devices for processing packet-based signals in a network of computer systems. Generally, packets are used to communicate among networked computer and electronic systems. Thus, each networked system must receive and transmit packets, and must process the packets directed to that system to determine what is being transmitted to that system.
Typically, each computer system includes one or more interfaces or ports on which packets are transmitted and received. Additionally, each interface generally includes a dedicated DMA engine used to transmit received packets to memory in the system and to read packets from the memory for transmission. If a given system includes two or more packet interfaces, the system includes DMA engines for each interface. Where a computer system processes multiple packet channels using the DMA engines, the processor(s) in the system must be able to monitor the status of the DMA transfers for each channel and other system-related functions associated with the channel transfers.
As the number of processors incorporated into a multiprocessor integrated circuit increases, it is difficult to manage data traffic between the processors on a single bus running certain protocols, such as a "snoopy" protocol. In particular, it is difficult to maintain a coherent memory architecture beyond a certain number of processors because such bus structures do not scale well. In view of the foregoing, there is a need for a method and apparatus for improving management of data exchanged between processors in a multiprocessor integrated circuit.

System and method for data transfer between multiple processors


The invention relates to a method for establishing an index for a given cancer grade. The method includes profiling glycan distribution pattern of a reference cancer cell sample; adsorbing the profiled reference cancer cell sample with adsorbents; measuring the amount of the adsorbents adhering onto the profiled reference cancer cell sample; and acquiring reference correlations between the glycan distribution pattern of the reference cancer cell sample and the amount of the adsorbents adhering onto the profiled reference cancer cell sample to form the index of the given cancer grade. An index for a given cancer grade and a method for grading cancer of a test cell sample are also provided.

At present, pathologists are responsible for the diagnosis of disease. Hematoxylin-eosin (H&E) stain and immunohistochemistry (IHC) are routine methods applied.
For example, a method of conventional diagnosis of colon cancer employs the colonoscopy or sigmoidoscopy for the detection of lesions and solid tumors. A biopsy is most frequently utilized for diagnosing the degree of malignancy of cancer, and tissue sections taken from the polyp or solid tumor are subjected to H&E staining or IHC staining Unfortunately, making a precisely histopathological examination and reasonable grading cancer and early cancer detection are quite hard. The possible factors include the counting percentage of glandule formation of the detection area and determining the level of degree of the morphology differentiation among well-differentiated benign tissue, precancerous, and malignant tissue at early stage.
Cancer grading of a tissue section is based on not only morphological examination of the tissue section and the percentage of glandule formation in the tissue section, but also the result of cancer grading must be confirmed consistently by three pathologists at least. The possibility of false-negative or false-positive results is still high due to errors caused by artificial operations, detection limit of instrument, and improper pathological examination from individual pathologist's diagnosis. However, the result of cancer grading would affect the follow-up therapy strategies for cancer patients.

NATIONAL SYNCHROTRON RADIATION RESEARCH CENTER