A switch includes an arbiter that receives a plurality of requests from N input ports, and determines N round robin arbitration option winners by performing N round robin arbitration options on the requests, each of the N round robin arbitration options performed assuming that a different one of the N input ports was a previous round robin arbitration winner. After the actual previous round robin arbitration winner is identified, a current round robin arbitration winner from among the N round robin arbitration option winners is determined by selecting the round robin arbitration option winner in which the assumed previous round robin arbitration winner is the actual previous round robin arbitration winner.

Modern telecommunication networks include switching networks for transmitting data from a source device to a destination device. Circuit switching and packet switching are commonly used in high-capacity networks. In circuit-switched networks, network resources are established from the sender to receiver before the start of the transfer of the data. The resources remain dedicated to the circuit during the transfer of the data and all of the data follows the same path. By contrast, in packet-switched networks, the data is broken into packets, each of which can take a different route to the destination where the packets are recompiled into the original message.
In packet switching networks the data to be transmitted is split up and encapsulated into data packets along with a destination address of the data. The packet switching network individually routes each data packet through a network of interconnected packet switches based on the destination address in the data packet. The data packets may be routed through different paths in the packet switching network and generally arrive at the destination device in an arbitrary order. At the destination device, the data is reconstructed from the data packets.
Because the packet switch may receive multiple data packets at the input ports that are destined for the same output port, the packet switch often includes an arbiter that determines an order for routing data packets through the packet switch. The input ports of the packet switch issue grant requests to the arbiter for routing data contained in data packets to the output ports. The arbiter then determines whether the output port identified by each grant request is available to receive data. If an output port identified by a grant request is available to receive data, the arbiter selects a grant request that identifies the output port and issues a grant to the input port that issued the selected grant request. The packet switch then routes data contained in a data packet of each input port that received a grant to the output port identified by the selected grant request issued by the input port.
In determining which input port should be granted access, the arbiter commonly performs a form of round robin arbitration to ensure that all the input ports requesting access to the output ports have equal access time. Round robin arbitration is a method of choosing all elements in a list, set, or group equally in some rational order, usually from the top to the bottom of a list and then starting again at the top of the list. Typical round robin arbitration involves assigning priorities according to a predetermined order among the input ports. As message traffic is received, the priorities change so that the last input granted access to a particular output is then given the lowest priority, and the next input in order of priority now has the highest priority. The remaining input ports will have their priorities similarly changed according to the predetermined order.
Round robin algorithms are commonly used for round robin arbitration to select from one among a number of candidates, while insuring that each candidate is treated fairly. In the implementation of a packet switch, the candidates are the input ports. In a round robin algorithm for N candidates, the candidates are typically arranged in a vector such that candidate 1 populates bit 1, candidate 2 populates bit 2, and so on, to create an N bit bus. If candidate A is the winner in the current round, then candidate A+1 has the highest priority in the next round, if A<N, while candidate 1 has the highest priority in the next round if A=N. As such, the candidate from the previous selection always has the lowest priority and N always has a higher priority than 1, unless the previous selection was N.
A typical implementation of the round robin algorithm involves two steps. First, the candidate vector is shifted or rotated so that its bits are organized with the highest priority candidate in bit position 1 according to the algorithm, with the priority successively decreasing until the lowest priority bit is in position N. Then, the lowest bit index with an active candidate is selected as the winning candidate. There is an inherent delay associated with waiting for the candidate vector to be rotated prior to making the winning selection in a round robin arbitration algorithm. The delay resulting from the round robin arbitration ultimately affects the performance of the switch. Accordingly, it is advantageous to reduce this delay as much as possible.
Additionally, some applications of the round robin algorithm require evaluating the acceptability of candidates prior to performing a round robin selection. Typically, this requires testing some attribute of the candidate, accepting all candidates that possess this attribute, and then submitting the accepted candidates to the round robin process. As such, selection of the accepted candidates must be delayed until the attribute on which the selection is based becomes available. This delay also affects the performance of the switch and should be reduced as much as possible.
In light of the above, a need exists for reducing the time required for an arbiter to select data for routing through a switch. A further need exists for reducing the time required for an arbiter to perform a round robin arbitration to select a winning candidate.

System and method for round robin arbitration


A copper-based alloy that has the soundness of alloy enhanced by restraining the concentrated occurrence of microporosities while suppressing the lead content and an ingot and a liquid-contacting part using the alloy are provided. The copper-based alloy has the soundness of alloy improved during the course of solidification of the copper-based alloy by crystallizing an intermetallic compound capable of solidifying at a temperature exceeding a solidus line in dendritic gaps of the alloy, suppressing migration of a solute, thereby allowing dispersion of microporosities, utilizing crystallization of the intermetallic compound as well for effecting dispersed crystallization of a low melting metal or a low melting intermetallic compound capable of solidifying at a temperature falling short of a liquidus line, and relying on the low melting metal or low melting intermetallic compound to enter the microporosities and suppress occurrence of microporosities.

Generally, while the alloy casing is in the process of solidifying, it possibly gives rise to a defect of shrinkage cavity due to volumetric shrinkage. The casting in the process of solidifying begins cooling from the surface and forms the finally solidified part in the central part of wall thickness. In this central part, the liquid phase that awaits solidification is attracted in the direction of the formerly solidified surface part and, as a result, disposed to induce volumetric shrinkage. This defect of shrinkage cavity varies in form with the composition of the relevant alloy, the condition of cooling, etc. Particularly, in the case of such a copper alloy that tends to induce solute segregation (deviation of concentration) and exhibits a wide range of solidifying temperature, the defect possibly occurs in the form of minute shrinkage holes (shrinkage cavity) called microporosities. The technique which crystallizes a low melting metal or intermetallic compound in an alloy with a view to suppressing the occurrence of this defect and securing the pressure resistance expected in ordinary plumbing materials, such as valves, cocks and joints has been known to the art.
In the bronze casting (CAC406 JIS), for example, lead is added and crystallized as a low melting metal. The CAC406 contains about 5% of lead in weight ratio. Since this lead functions to fill up shrinkage holes occurring in the central part, it permits easy production of such a sound casting that does not have many casting defects like shrinkage cavities. Since this casting excels particularly in machinability, it is copiously utilized for liquid-contacting metal parts in the plumbing materials of the kind under discussion. When this bronze alloy is used as the raw material for liquid-contacting metal parts, such as valves, however, the lead that scarcely forms a solid solution in the bronze casting and manages to crystallize has the possibility of eluting into the ambient water and deteriorating the quality of the water. This phenomenon becomes particularly conspicuous when water stagnates in the liquid-contacting metal part.
Thus, the development of the so-called leadless copper alloy is being promoted and has succeeded in proposing several new alloys (refer, for example, to Patent Documents 1 to 4).
JP-B HEI 5-63536 (Patent Document 1), for example, discloses a leadless copper alloy that is enabled by adding Bi in the place of lead in the copper alloy to enhance machinability and prevents dezincification.
Japanese Patent No. 2889829 (Patent Document 2) discloses a leadless bronze which adds Bi for the sake of enhancing machinability and adds Sb to suppress the occurrence of porosities during the course of casting and enhance mechanical strength.
JP-A 2000-336442 (Patent Document 3) discloses a leadless free-cutting bronze alloy that acquires machinability and enhances anti-seizing property by adding Bi and secures resistance to dezincification and mechanical properties by addition of Sn, Ni and P.
JP-A 2002-60868 (Patent Document 4) discloses a leadless bronze alloy which is enabled by adding not more than 1 weight % of Bi and Sb as impurities and taking into consideration the recycling property to secure castability, workability and mechanical properties.
Patent Document 1: JP-B HEI 5-63536
Patent Document 2: Japanese Patent No. 2889829
Patent Document 3: JP-A 2000-336442
Patent Document 4: JP-A 2002-60868

This patent is subject to a terminal disclaimer.

Bronze alloy, and ingot and liquid-contacting part using the alloy


A main spindle apparatus for machine tools wherein a tool holder (T) having an anchoring edge on an inner circumferential surface and inserted into an attachment hole of a main spindle (1) is anchored to the main spindle (1) by expanding a collet (12) having an anchoring portion on the outer circumferential surface so that the anchoring portion engages with the anchoring edge. Pressure receiving surfaces (12b, 12c) which gradually decrease in diameter in approaching the tip are formed on the inner circumferential surface of the collet (12). The main spindle (1) is provided with a push rod (2) which expands the collet by means of pressure applying surfaces (2d, 2e) formed on the outer circumferential surface and gradually decreasing in diameter in approaching the tip, which press the pressure receiving surfaces (12b, 12c) of the collet (12) when the push rod (2) is moved forward so as to approach the tool holder (T).

1. Technical Field of the Invention
The present invention relates to main spindle devices for removably attaching tools to the spindles of machine tools.
2. Background Art
As a conventional main spindle device for machine tools, the type shown in FIG. 8 is commonly known. This main spindle device is inserted into a main spindle 31, and is composed of a pipe-shaped draw bar 32 which moves right and left in the view shown in FIG. 8 by means of a motion means, a tube member 33 affixed to the tip of the draw bar 32, and a collet 34 with an expandable diameter fitted onto the outer circumference of the tube member 33. Pressure applying surfaces 33a and 33b which gradually expand in approaching the tip are formed on the outer circumferential surface of the tube member 33, pressure receiving surfaces 34a and 34b which gradually expand in approaching the tip are formed on the inner circumferential surface of the collet 34, and an anchoring portion 34c is formed on the outer circumferential surface of the collet 34.
When attaching a tool to the main spindle device, the tool holder T is first inserted into an attachment hole 31a in the main spindle 31, and a coolant connecting tube portion Ta is fitted onto the tube member 33 (see the top half of FIG. 8). Then, upon moving the draw bar 32 to the right in FIG. 8, the pressure receiving surfaces 34a and 34b are pressed against the pressure applying surfaces 33a and 33b so as to expand the diameter of the collet 34. As a result, the anchoring portion 34c is engaged with the anchoring end Tb of the tool holder T so as to anchor the tool holder T to the main spindle 31 as shown in the bottom half of FIG. 8.
However, the conventional main spindle device described above has a structure wherein the coolant connecting tube portion Ta is fitted onto the tube member 33 when the tool holder T is inserted into the attachment hole 31a of the main spindle 31. For this reason, the tool T must be moved linearly and precisely so as to be aligned with the central axis of the main spindle 31 (tube member 33). Therefore, when using an automatic tool exchange apparatus which inserts tools into the attachment hole 31a of the main spindle 31 along a curved path, the gap between the coolant connecting tube portion Ta and the tube member 33 must be enlarged, thereby making it difficult to seal the coolant.
Additionally, with the above-described conventional main spindle device, the retraction of the draw bar 32 causes the collet 34 to expand and the tool holder T to contact the main spindle 31 simultaneously. Therefore, the maximum amount of retraction of the draw bar 32 is restricted by the amount of retraction of the collet 34 and the final amount of insertion of the coolant connecting tube portion Ta into the tube member 33. Consequently, it becomes difficult to increase the magnifying ability by reducing the angle of inclination between the pressure applying surfaces 33a and 33b, and the pressure receiving surfaces 34a and 34b. Moreover, since the allowance of the clamp between the pressure applying surfaces 33a and 33b and the pressure receiving surfaces 34a and 34b is determined by the widths of the gaps A and B, if the positions of the boldface lines in FIG. 8 are not aligned, the gaps A and B will disappear and clamping will not be possible. Thus, good work precision is a stringent requirement.
Furthermore, a disc spring is used to reinforce the anchoring force of the collet 34 on the tool holder T by increasing the retraction of the draw bar 32, but this makes vibrations more likely to occur during high-speed rotation of the tool because the disc spring 35 is a non-continuous element. Additionally, when the tools are removed from the main spindle 31 by contracting the collet 34, hysteresis causes a large return force to be necessary, and the amount of work increases. Moreover, disc springs 35 have comparatively short lifespans, and their maintenance requires care.
On the other hand, the guiding precision of automatic tool exchanging devices is comparatively low, and the tool insertion path with respect to the main spindle 31 easily becomes misaligned with the central axis of the tube member 33. Consequently, the inner circumferential surface of the tube member 33 and the sealing member 36 attached thereto tend to become worn quickly, not only in the case of the above-described tool exchange devices which trace a curved insertion path, but also in the case of tool exchange devices with linear insertion paths, and these also require care for maintenance.


A self-adjustable pitch marine vessel propeller attached to a shaft is driven by an engine of a marine vessel, and includes a substantially cylindrical hollow hub and a plurality of blades extending radially outwardly from the hub and being capable of rotating around an axis being in a radial direction relative to the hub. The propeller comprises an actuator movable linearly along the axis of the hub and at least one motion transmission means communicating with the actuator and each blade for converting the linear motion of the actuator into the rotational motion of each blade in a radial direction relative to the axis of the hub and a resilient member communicating with the actuator.

The present invention relates to a self-adjustable pitch propeller for marine vessels.
A propeller is designed by taking many parameters into account in order to provide the optimum thrust to the marine vessel provided therewith. For example, design parameters such as dimensions of the marine vessel body, load of the marine vessel, engine power, density of the water the marine vessel cruises on are important inputs for determining the diameter and pitch of the propeller to be produced. Once a propeller designed with the blades thereof being static relative to the hub thereof has been produced, the propeller may become heavy in torque against the cruise conditions if the pitch thereof is large and it requires more power from the engine. However, if the pitch is low, i.e. if it is 'light', it cannot deliver enough engine power as thrust. In either case, performance of the propeller falls. Such a propeller designed with the blades thereof being static relative to its hub (not adjustable pitch) is known as the 'fixed pitch propeller'.
Modification attempts against the lightness of the propeller do not work and a new propeller needs to be used. In the case where the propeller is heavy as term, the diameter can be downsized, however this brings along a number of problems (e.g. mass balancing problem of the propeller can take place due to the centrifugal force exerted, it cannot be possible for each blade to uniformly face water). Nevertheless such modification does not mean obtaining a propeller providing high performance in changing cruise condition, because when the conditions of the marine vessel changes, when the load thereof increases for instance, the performance of fixed pitch propeller falls again. For this reason, variable pitch type propellers have been proposed. Use of variable pitch propellers against variable conditions such as marine vessel speed and load improves the performance (and therefore reduces fuel consumption). On the other hand, blades of the variable pitch propellers are rotated by a certain amount relative to the blade hub so as to provide the optimum pitch by being controlled according to each changing condition. This often requires using a complex and costly control/drive mechanism.
Typically, the pitch of a propeller is calculated according to shaft torque at which the motor that the propeller attached to is in its maximum speed (rpm). However, it is known that there is a considerable torque (and so power) difference between the shaft and propeller when the motor is run at moderate and lower speeds for maintaining fuel consumption lesser. At moderate and lower motor speeds, propellers produce less torque and therefore propellers should have a higher pitch to be economic in terms of fuel consumption and to increase cruise speed at such motor speeds. There seems to be no affordable and straightforward solution for self-adjusting the pitch of a propeller according to the motor speed.
Therefore, a propeller providing optimum thrust to a marine vessel according to the changed cruise conditions such as load and speed by adjusting the pitch in a simple and inexpensive way is needed.


The present invention relates to chimeric chemical compounds which are used to recruit antibodies to cancer cells, in particular, prostate cancer cells or metastasized prostate cancer cells. The compounds according to the present invention comprise an antibody binding terminus (ABT) moiety covalently bonded to a cell binding terminus (CBT) and Toll-like receptor agonist (TLR) through a linker and a multifunctional connector group or molecule.

A growing wealth of data indicates that targeted therapies can mobilize a patient's own immune system to destroy malignancies with fewer side effects than traditional chemotherapy. Since it is estimated that 41% of Americans—almost 1 in 2 people—born in 2011 will develop cancer in their lifetime,8 the generation of more effective cancer immunotherapies is a high priority. These therapies include monoclonal antibodies (mAbs) that direct innate immune cells to tumor-associated antigens (TAA) as well as cancer "vaccines" that take many forms (including injections of tumor proteins with adjuvants or ex vivo primed dendritic cells) and are designed with the intention of inducing long-lasting anti-tumor T-cells.1 The objective of the present inventors' research is to develop novel compounds capable of stimulating both innate and adaptive immune responses against tumors, thereby combining the immunologic strengths of both mAbs and cancer vaccines in a small molecule format.
To date, mAbs have demonstrated the greatest clinical efficacy of all cancer immunotherapeutics, with nine unconjugated mAbs against TAA approved by the FDA over the past 15 years.9 To capitalize on this therapeutic success but reduce the disadvantages of mAbs (expensive to produce, can provoke allergic reactions, lack oral bioavailability), the present inventors have developed small-molecule antibody recruiting molecules (ARMs)2. ARMs take advantage of the high prevalence of preexisting antibodies against dinitrophenol (DNP) in human serum, possibly caused by pesticide exposure. These molecules redirect anti-DNP antibodies to prostate cancer and other cancer cells expressing prostate specific membrane antigen (PSMA). PSMA is a membrane protein expressed at high abundance in human prostate carcinoma, but present at low levels in normal prostate and non-prostatic tissues.10 We have shown that ARMs are able to mediate prostate cancer destruction both in vitro2 and in vivo11 through both antibody dependent cellular cytotoxicity (ADCC) and phagocytosis (ADCP) by innate effector cells.
While the traditional view holds that mAbs act primarily through the innate immune system, burgeoning evidence highlights their link to adaptive immunity.12 Antibody-opsonized tumors or soluble TAA immune complexes induce phagocytosis or endocytosis through Fcγ receptors (FcγRs) on dendritic cells (DCs).3, 4 This mode of internalization leads to increased presentation of TAA peptides on MHC I and II, increased costimulatory molecule expression, and increased generation of antigen-specific CD4+ and CD8+ T-cells as compared to unopsonized antigen.13-16 In mice, anti-CD20 and anti-Her2/neu mAbs were shown to induce adaptive anti-tumor immunity,17,18 while in humans, clinical response following anti-Her2/neu therapy correlates with greater increases in endogenous anti-Her2/neu antibodies and anti-tumor CD4+ T-cells.19,20
Unfortunately, across all monoclonal antibodies used for tumor therapy, only about 30% of treated patients experience increased progression-free or overall survival.20,21 The tumor microenvironment can be highly immunosuppressive, characterized by release of anti-inflammatory paracrine factors, consumption of metabolites necessary for Teff proliferation, and recruitment of tolerogenic cells such as regulatory T-cells (Tregs).5 Many tumors are also poorly immunogenic in that, despite their malignant transformation, they consist of mostly self-proteins to which the immune system is tolerant Immunogenic epitopes arising from mutated gene products, expression of oncofetal proteins, or aberrant posttranslational modifications may represent only a small fraction of a tumor's total protein. Clearly, additional immuno stimulation beyond unmodified anti-tumor mAbs is required to mount a successful adaptive immune response in the majority of patients.
Advances in the cancer vaccine field have underlined the importance of adjuvants in generating immunity. Toll-like receptor (TLR) agonists are particularly powerful adjuvants, since the natural ligands of these receptors are highly conserved pathogen-associated molecular patterns that are recognized as primal danger signals by the immune system.22 pursuant to the present invention, the inventors propose to attach the synthetic small-molecule TLR7/8 agonist imiquimod and related TLR7/8 agonists to the ARM scaffold. Located in endosomes, TLRs 7/8 mediate production of proinflammatory cytokines and induce maturation of antigen presenting cells (APCs).6,7 TLR7/8 agonists can heighten innate responses, especially through plasmacytoid dendritic cells, as well as potentiate adaptive Th1 polarization and cytotoxic T-cell (CTL) generation.23 Imiquimod is already FDA-approved for topical use against skin malignancies and has also been tested systemically as an experimental vaccine adjuvant.24,25 It is the present inventors' view that the conjugation of imiquimod to an ARM will better stimulate APC activation and generate anti-tumor T-cells while also improving the ARM's ability to mediate tumor lysis by innate immune cells.
The direct conjugation of imiquimod and other TLR7/8 agonists to the ARM offers crucial advantages over co-administration of unlinked molecules. Several mouse studies have shown that antigen-specific CD4+ and CD8+ T-cell generation dramatically improved when injected antigen was directly linked to TLR7/8 agonists.26-28 Systemically administered TLR7/8 agonists in human trials have provoked significant adverse effects including fever, fatigue, nausea, chills, and myalgia without demonstrating much efficacy.29, 29, 30 Physical conjugation to the larger ARM should (1) increase the therapeutic index of the TLR7/8 agonist's (e.g. imiquimod's) therapeutic index by preventing its interaction with endosomal TLR7/8 until phagocytosis of an ARM-opsonized target cell has occurred and (2) localize the immunostimulant to the tumor site. Beyond this superior pharmacokinetic profile, there is some evidence that control of antigen presentation is phagosome-autonomous, meaning that TLR agonists must be located in the same endosome as phagocytosed TAA to best enhance TAA peptide presentation on MHC I or II.27, 31, 32 Extensive preclinical and clinical data thus support the conjugation of TLR7/8 agonists to antibody recruiting molecules for greater induction of anti-tumor immunity.

TLR-agonist-conjugated antibody recruiting molecules (TLR-ARMs)


An optical recording medium having an organic dye layer as a recording layer on a substrate, wherein at least one benzobisazole-based compound represented by a general formula (1) is contained in the recording layer:

A CD-R (CD-Recordable) is widely used as a recordable optical recording medium that is adapted to specifications of a compact disk (to be abbreviated as "CD" hereinafter). A recording capacity of the CD-R is about 680 MB. Along with a dramatic increase in an amount of information, demand for an information-recording medium with higher density and higher capacity has been increasing.
Use of laser beams for recording and reproducing which have short wavelengths can make a beam spot small, thereby making high-density optical recording possible. Lately, development of a short-wavelength semiconductor laser to be used in an optical disk system has been proceeding, and red semiconductor lasers for wavelengths of 680 nm, 660 nm, 650 nm and 635 nm are actually currently used (for example, refer to page 65 of Nikkei Electronics No. 592 published on Oct. 11, 1993). A DVD in which over two hours of motion pictures are digital-recorded by use of these semiconductor lasers has actually been used. Since the DVD is a playback-only medium, development of a recordable optical recording medium (DVD-R) corresponding to the capacity of the DVD is also under way.
In addition, development of a blue semiconductor laser for wavelengths ranging from 400 to 500 nm which makes ultra high density recording possible has been rapidly proceeding (for example, refer to page 117 of Nikkei Electronics No. 708 published on Jan. 26, 1998), and development of a recordable optical recording medium corresponding to the blue semiconductor laser is also under way.
In forming a pit by irradiating a recording layer of a recordable optical recording medium with a laser beam so as to cause a physical change and/or a chemical change in the recording layer, an optical constant and decomposition behavior of a compound are important factors for forming good pits. When the compound is not easily decomposed, sensitivity lowers, while when the compound is fiercely decomposed or susceptible to changes, influences between pits and in a radial direction become large, thereby making it difficult to form a reliable pit. When data is to be recorded on a conventional CD-R medium by use of a blue semiconductor laser wavelength, a refractive index of its recording layer is low and an extinction coefficient of the recording layer is also not an appropriate value, so that high recording properties cannot be attained. For this reason, as a compound used in the recording layer, a compound having appropriate optical properties and decomposition behavior against a blue semiconductor laser must be selected. As currently known examples of an organic dye compound for recording with a blue semiconductor laser, polyene-based dye compounds described in Japanese Patent Application Laid-Open Nos. 78576/1992 and 89279/1992, a styryl-based dye compound described in Japanese Patent Application Laid-Open No. 34489/1999, an indigoid-based dye compound described in Japanese Patent Application Laid-Open No. 78239/1999, a cyanoethene-based dye compound described in Japanese Patent Application Laid-Open No. 105423/1999 and a squarylium-based dye compound described in Japanese Patent Application Laid-Open No. 110815/1999 have been proposed in addition to cyanine-based dye compounds described in Japanese Patent Application Laid-Open Nos. 74690/1992 and 40161/1994 and porphyrin-based dye compounds described in Japanese Patent Application Laid-Open Nos. 304256/1995, 304257/1995, 127174/1996, 101953/1999 and 144312/1999.
Further, a variety of optical recording media having an improved layer structure such as an optical recording medium described in Japanese Patent Application Laid-Open No. 53758/1999 which comprises a recording layer comprised essentially of a porphyrin dye or a cyanine dye as an organic dye for forming the recording layer and a metal reflecting layer composed essentially of silver and an optical recording medium described in Japanese Patent Application Laid-Open No. 203729/1999 which makes recording over two wavelength ranges possible by having a blue sensitive dye layer containing a cyanine dye which is sensitive to a blue laser as well as a red sensitive dye layer or infrared sensitive dye layer have also been proposed.
Lately, a blue-violet semiconductor laser for wavelengths ranging from 400 to 410 nm has been developed, thereby making possible ultra high density optical recording of 15 to 30 GB capacity. Thus, development of a recordable optical recording medium which is the most suitable for the wavelength laser has been increasingly active (for example, refer to page 33 of Nikkei Electronics No. 736 published on Feb. 8, 1999, page 28 of Nikkei Electronics No. 741 published on Apr. 19, 1999, page 19 of Nikkei Electronics No. 748 published on Jul. 26, 1999, and page 117 of Nikkei Electronics No. 751 published on Sep. 6, 1999). However, it is a current situation that the aforementioned optical recording media for a blue semiconductor laser are not adapted to a laser beam having a wavelength of 400 to 410 nm sufficiently. That is, the present inventors have found that the aforementioned media using organic dyes have such a problem that signals recorded on the media may not be always able to be read satisfactorily since a carrier to noise ratio (C/N) is not always a good value. It has been an urgent necessity to solve the problem and develop an optical recording medium which makes possible high density recording/reproducing using a laser beam having a wavelength of 400 to 410 nm.

Benzobisazole compound and optical recording medium containing the compound

Abstract: (wherein substituents X and Y each independently represent an aryl group or a heteroaryl group, rings A and B each independently represent an oxazole ring or a thiazole ring, and Q1 and Q2 each independently represent a hydrogen atom, a halogen atom or an alkyl group, with a proviso that, aryl group(s) or heteroaryl group(s) represented by the substituents X and Y each independently may be substituted by a halogen atom, a hydroxyl group, a cyano group, an amino group or a substituted or unsubstituted alkyl, aralkyl, aryl, alkenyl, alkoxy, aralkyloxy, aryloxy, alkenyloxy, alkylthio, aralkylthio, arylthio, alkenylthio, mono-substituted amino, di-substituted amino, acyl, alkoxycarbonyl, aralkyloxycarbonyl, aryloxycarbonyl, alkenyloxycarbonyl, mono-substituted aminocarbonyl, di-substituted aminocarbonyl, acyloxy or heterocyclic ring group).


A high frequency power amplifying device has two amplifying lines. Each amplifying line has a configuration in which a plurality of amplifying stages are connected in cascade having two source voltage terminals, of which one is connected to the first amplifying stage of one amplifying line and to the remaining amplifying stages of the other amplifying line, and the other, to the first amplifying stage of the latter amplifying line and to the remaining amplifying stages of the former amplifying line. An air core coil with a low D.C. resistance, formed by spirally winding a copper wire of about 0.1 mm in diameter, is connected in series between the final amplifying stage of each amplifying line and the source voltage terminal.

A high frequency power amplifying device for use in wireless communication devices, such as car telephones or mobile telephones, has a multi-stage configuration in which a plurality of amplifiers, each consisting of a semiconductor amplifying element (transistor), are connected in cascade in two, three or more stages. The amplifier of the final stage (final amplifying stage) of the multi-stage configuration constitutes the output stage, and the amplifiers of the preceding stages (amplifying stages) constitute drive stages. In addition, inductors are incorporated in a number of positions to regulate circuit impedance.
Required performance characteristics of high frequency power amplifying devices include high efficiency, high gain, compactness and low cost. In addition, portable devices in particular require consideration for the resistance of amplifying element of the final stage (semiconductor amplifying element) against a high voltage that may work on it as a result of reflection that would result from a substantial variation in the impedance of the antenna and consequent load mismatching.
FIG. 33 is a block diagram of the circuit configuration of a high frequency power amplifying device studied by the present inventors before their attempt at the present invention. This high frequency power amplifying device is a dual band device capable of amplification for two communication systems, including the Global System for Mobile Communication (GSM) and the Digital Cellular System (DCS).
This high frequency power amplifying device 1 has as its external electrode terminals a GSM input terminal (Pin GSM {circle around (1)}), a control terminal (Vapc {circle around (2)}), one source voltage terminal of a source voltage Vdd (Ydd1 {circle around (3)}), a GSM output terminal (Pout GSM {circle around (4)}), a DCS output terminal (Pout DCS{circle around (5)}), the other source voltage terminal of the source voltage Vdd (Vdd-2 {circle around (6)}), a communication band switching terminal (Vct1 {circle around (7)}), a DCS input terminal (Pin DCS {circle around (8)}) and a ground voltage terminal (GND) (not shown).
The amplifying lines of both DCS and GSM are configured in three amplifying stages. The DCS amplifying line consists of amplifying stages denoted by 1st, 2nd and 3rd in the diagram (amp1, amp2 and amp3), while the GSM amplifying line consists of amplifying stages similarly denoted by 1st, 2nd and 3rd (amp4, amp5 and amp6). Each amplifying stage consists of a field effect transistor (FET) though not shown.
In this configuration, Pin DCS {circle around (8)} is connected to amp1; Pout DCS {circle around (5)}, to amp3; Pin GSM {circle around (1)}, to amp4 and Pout GSM {circle around (4)}, to amp6.
Vapc {circle around (2)} is connected to a bias circuit 2, and amp1 through amp6 are controlled with signals inputted to this Vapc {circle around (2 )}.
Vdd1 {circle around (1)} is connected to amp4 via a microstrip line MS3, to amp5 via a microstrip line MS4 and to amp6 via an inductor L2. Further to stabilize the high frequency performance, a capacitance C1, of which one end is grounded through GND, is externally connected to Vdd1 {circle around (3)}.
Vdd2 {circle around (6)} is connected to amp1 via a microstrip line MS1, to amp2 via a microstrip line MS2 and to amp3 via an inductor L1. Further to stabilize the high frequency performance, a capacitance C2, of which one end is grounded through GND, is externally connected to Vdd2 {circle around (6)}.
Vct1 {circle around (7)} is connected to a band select circuit 3. This band select circuit 3 is composed of three n-channel type field effect transistors (FET) Q8, Q9 and Q10, whose sources are grounded, and one resistor R1. The gate terminal of Q8 and Q9 are connected to Vct1 {circle around (7)}. The gate terminal of Q10 is connected to the drain terminal of Q9, which is connected to the output side of amp5 via a resistor R2. The drain terminal of Q9 is connected to Vdd2 {circle around (6)} via the resistor R1. The drain terminal of Q8 is connected to the input side of amp3 via an inductor L3.
Band switching is accomplished with a signal supplied to Vct1 {circle around (7)} to carry out amplification for DCS communication or for GSM communication.
In the circuitry shown in FIG. 33, a common power supply line is used by the GSM circuit chain and the DCS circuit chain. It has been found that, as a result of this, there is formed a feedback loop (indicated by bold arrows in FIG. 33) for leak signals from the 3rd FET to return to the 1st FET, inviting susceptibility to oscillation.
On the other hand, the inductors used according to the prior art are chip inductors. However, chip inductors have high DC resistances and accordingly constitute restraints on output and efficiency in high frequency power amplifying devices (high frequency power amplifier modules) for mobile telephones. Thus, chip inductors require a current capacity of 2 A or more when they are to be used on the power supply line of a high frequency power amplifying device, and therefore have to be produced to a special specification, which means a correspondingly high price and difficulty of urgent procurement.
Commercially available air core coils are too large in external dimensions to be mounted on a module which has a prescribed height limit. Thus, chip-shaped electronic parts such as chip resistors and chip capacitors incorporated into high frequency power amplifying devices are commonly known as "1005" products, measuring 1 mm in length and 0.5 mm in width, smaller than commercially available air core coils.
Moreover, conventional chip inductors are expensive, and their high prices constitute a constraint to cost reduction of hybrid integrated circuit devices. Whereas chip inductors are diverse in structure, the mainstream structures of those used in high frequency power amplifying devices comprise one consisting of a wire wound around a ceramic base member, a spiral one formed by stacking conductors, such as Ag and Ni over a ceramic base and another produced by plating the surface of a ceramic core to form a metal layer and spirally cutting this metal layer with a laser beam.
In view of these circumstances, the present applicants studied, with a view to reducing the size and cost and weakening the DC resistance, a coil formed by spirally winding a highly conductive metal wire, and proposed a new type of coil (coil inductor) (Japanese Patent Application No. 2000-367762).
This type of coil, to cite an example, has a structure consisting of a copper wire of 0.1 mm in diameter, whose surface is covered with an insulating film (e.g., polyethylene film), is spirally wound into a shape measuring 0.56 mm in outer diameter and 0.9 mm in length, both approximately. Before spirally winding the coil, the insulating film at both end portions of the copper wire is removed to a fixed length each, or these parts are covered with no insulating film from the outset. Therefore, one or more rounds of the coil not covered by the insulating film serve as electrodes. This coil is very light, weighing only about 0.0725 mg. Since this air core coil proposed by the present applicants is manufactured by winding a copper wire, the air coil of 8 nH in inductance has a D.C. resistance of about 20 mΩ, much lower than the 100 mΩ D.C. resistance of a conventional chip inductor of 8 nH (for instance, a "1005" product structured by spirally cutting a small metal layer with a laser beam).
The air core coil proposed here of 8 nH in inductance is 20 mΩ in D.C. resistance, or ⅕ of that of the conventional inductor, with a corresponding cost advantage.
Applicants, intending to incorporate this air core coil into a high frequency power amplifying device, which also is a hybrid integrated circuit device, attempted assembly using a conventional bulk feeder.
However, the applicants have found that it is difficult to stably supply such extremely light coils (air core coils) with the conventional bulk feeder.
An example of bulk feeder, which also is a semiconductor manufacturing apparatus, is disclosed in Matsushita Technical Journal, Vol. 45, No. 4, August 1999, pp. 86-90. This literature describes a hopper type bulk feeder suitable for packaging of surface-mountable electronic parts such as laminated chip capacitors and thick film chip resistors.
FIG. 34 through FIG. 42 illustrate a conventional bulk feeder. As shown in FIG. 34, the conventional bulk feeder has a bulk accommodating case 10 for accommodating bulk, a hopper 11 arranged underneath this bulk accommodating case 10, and a conveyor rail 13 for guiding the bulk accepted through the hopper 11 toward a bulk feed section 12 at the tip.
The bulk accommodating case 10 is structured as a thin box, whose inner bottom constitutes slopes 14 for gathering the bulk from both sides toward the center. The hopper 11, arranged to pierce the center of these slopes 14 and to take out the bulk gathered on the inner bottom parts of the slopes 14 from the bulk accommodating case 10 in an aligned state is configured of a guide 16 having a frustum concave 15 at the upper end, and a feed shaft 18 consisting of an angular pipe and having a guide hole 17 for guiding one component at a time of the bulk through this guide 16 along the center axis, as shown in FIG. 35. The guide 16 is structured to oscillate up and down so that the bulk enter the guide hole 17 from the upper end of the feed shaft 18. It oscillates in an amplitude of, for instance, about three times the length of the bulk (one stroke: abbreviated to 1 St).
The guide hole 17 has a rectangular section as shown in FIG. 36. The feed shaft 18 measures 2.6 mm in diameter, and has at its center the rectangular guide hole 17 of 0.63 mm in width and 0.87 mm in length.
It was found that, when coils (air core coils) 9 each measuring 0.56 mm×0.85 mm were fed in bulk with such a bulk feeder, a number of feed faults would arise as shown in FIG. 35 and FIG. 36.
One is a feed fault A in which the air core coil 9 rides on the upper end of the feed shaft 18 on account of the wall thickness of the cylindrical feed shaft 18 and therefore fails to enter the guide hole 17.
Another is a feed fault B in which a gap 19 occurs between the slope of the frustum concave 15 and the outer circumference of the feed shaft 18 when the guide 16 has come down, and the air core coil 9 is caught in this gap 19.
Still another is a feed fault C in which the air core coil 9 measuring 0.53 mm×0.85 mm, because it has some dimensional fluctuations, is toppled sideways and caught on the way of the guide hole 17 measuring 0.63 mm×0.87 mm.
Also, as the conveyor rail 13 of the conventional bulk feeder has a seam D as shown in FIG. 34, the air core coil 9 may be caught by that seam and invite a feed fault.
On the other hand, the bulk feed section 12 is structured as shown in FIG. 37, and acts as illustrated in FIG. 37 through FIG. 42. Thus, as shown in FIG. 37, toward the tip of the conveyor rail 13, the upper side of the tip of the conveyor rail body 25 is a step lower, and a slider 26 is fitted to this lower portion to be able to reciprocate along the shifting direction of the air core coil 9.
A rail 27 provided with the guide hole 17 to guide the air core coil 9 extends to the stepped portion of the conveyor rail body 25. The conveyor rail body 25 has a stopper portion 28 for stopping the forward end of the air core coil 9 having entered the guide hole 17 of the rail 27 and moved on. This stopper portion 28 is in contact with the upper side of the air core coil 9, and its lower portion is a partially open space. This constitutes a vacuum suction passage 30a for subjecting the air core coil 9 to vacuum suction to bring it into contact with the stopper portion 28.
The slider 26 is brought into contact on its left end face with a side of the stepped portion by a spring 29. The state in which the left end face of the slider 26 is in contact with the side of the stepped portion constitutes the position of the stopper portion 28 to position the air core coil 9, i.e. its positioning reference face.
A shutter 31 overlaps the slider 26, and is shiftable relative to the slider 26. The shutter 31 reciprocates in the shifting direction of air core coils 9, and spans a slightly longer range than the length of the leading one of the air core coils 9 moving in the guide hole 17 of the rail 27. Therefore, the tip of the rail 27 has a structure in which the part of the rail 27 over the upper face of the guide hole 17 is removed. The shutter 31 forms a vacuum suction passage 30b between it and the slider 26. Holes are bored in the shutter 31, the slider 26 and the conveyor rail body 25 to form vacuum suction passages 30c, 30d and 30e. When the slider 26 moves towards the left end and the shutter 31 hangs over the guide hole 17, these three holes overlap one another to subject the air core coils 9 to vacuum suction as indicated by thick arrows in FIG. 37 to bring the leading one of the air core coils 9 into contact with the stopper portion 28. This vacuum suction also aligns the succeeding air core coils 9 in the guide hole 17 as shown in FIG. 38.
As illustrated in FIG. 39, when the shutter 31 is opened towards the right hand side, i.e. away from the end of the guide hole 17, the leading air core coil 9 and the leading edge of the second air core coil 9 in a slight length are exposed. This opening action causes the vacuum suction passage 30d to be blocked by the shutter 31, and therefore the vacuum suction stops. The shutter 31 is shifted by, for instance, as long as three times the length (3 St) of the air core coil 9. FIG. 40 shows an enlarged section of these relationships.
Then, a collet 32 shifts, holds the air core coil 9 by vacuum suction, and brings it to above the module substrate, and the air core coil 9 is mounted.
Incidentally, since air core coils are extremely light as mentioned above, they may be easily moved by a variation in air flow (air pressure) at the time of switching vacuum suction or by vibration, and the ends of consecutive air core coils 9 may overlap each other as shown in FIG. 44 for example. In this case, the collet 32 becomes unable to securely hold the air core coil 9 by vacuum suction and carry it, making it impossible to mount the air core coil 9 over the module substrate. If the vacuum suction force is increased to strengthen vacuum suction by the collet, that vacuum suction force may disturb the coil alignment, and therefore the vacuum suction force of the collet cannot be increased more than necessary, making its control delicate. FIG. 43 illustrates an undisturbed line of air core coils 9.
An object of the present invention is to provide a semiconductor device excelling in high frequency characteristics and permitting enhancement of output and efficiency and a reduction of manufacturing cost, and an electronic device into which the semiconductor device is incorporated.
Another object of the invention is to provide a high frequency power amplifying device excelling in high frequency characteristics and permitting enhancement of output and efficiency and a reduction of manufacturing cost, and a wireless communication device into which the high frequency power amplifying device is incorporated.
Another object of the invention is to provide a semiconductor device mounted with air core coils of low D.C. resistance, and an electronic device into which the semiconductor device is incorporated.
Another object of the invention is to provide a high frequency power amplifying device mounted with air core coils of low D.C. resistance, and a wireless communication device into which the high frequency power amplifying device is incorporated.
Another object of the invention is to provide a high frequency power amplifying device whose oscillation margin can be improved, and a wireless communication device into which the high frequency power amplifying device is incorporated and which excels in speech communicating performance.
Another object of the invention is to provide a semiconductor device manufacturing method permitting accurate and secure mounting of components fed in bulk on a wiring board.
Another object of the invention is to provide a semiconductor device manufacturing method permitting accurate and secure mounting of coils fed in bulk on a wiring board.
Another object of the invention is to provide a semiconductor manufacturing apparatus capable of achieving steady supply of components in bulk.
Another object of the invention is to provide a semiconductor manufacturing apparatus capable of achieving capable of achieving steady supply of coils in bulk.
The aforementioned and other objects and novel features of the present invention will become more apparent from the description in this specification and the accompanying drawings.

Semiconductor device, and method and apparatus for manufacturing semiconductor device

Eastern Japan Semiconductor Technologies


To provide an optical device whereby the optical characteristics of a lightwave circuit element can be varied with low power consumption. There is provided an optical device comprising a lightwave circuit element having one or plurality of optical waveguides, and also having a refractive index adjusting portion composed of resin located in the one or plurality of optical waveguides and/or in a portion of the area in the one or plurality of optical waveguides. The lightwave circuit element comprises an adjustment-light waveguide for guiding adjustment light that varies the refractive index of the resin, and directing the adjustment light to the adjusting portion.

1. Field of the Invention
The present invention relates to an optical device having a lightwave circuit element.
2. Description of the Background Art
An example of an optical device is a directional coupler that has first and second optical waveguides disposed in mutual proximity in a fixed range and lightwaves guided respectively through each of the waveguides are coupled therebetween.
The optical device disclosed in Japanese Patent Application Publication No. 2003-215647 is provided with a hollow area filled with resin between the first and second optical waveguides in the optical coupling area of the directional coupler which is formed on a substrate. The temperature of the resin is adjusted via an overcladding layer or the substrate. By modifying the temperature of the resin, the refractive index of the resin is changed, and the optical characteristics (optical branching ratio, for example) of the directional coupler are thereby changed.
The optical device disclosed in Japanese Patent Application Publication No. 2000-066044 (corresponding European patent application publication No. 981 064) uses a polymer material in the core area or cladding area. The refractive index of the polymer material is changed and the state (phase, for example) of the light guided through the core area is modified by changing the temperature of the polymer material.
The optical device disclosed in Japanese Patent Application Publication No. 2000-111964 (corresponding U.S. Pat. No. 6,310,999) uses a polymer material in the periphery of the first and second waveguides in the optical coupling area of the directional coupler which is formed on a substrate. The refractive index of the polymer material is changed by modifying the temperature of the polymer material and thereby the optical branching ratio of the directional coupler is changed.
The power required to vary the temperature of the resins is considerable with the optical devices disclosed in the prior art.

Optical device with lightwave circuit element


This invention makes it possible to simplify a process of manufacturing an SOI substrate whose insulator is not exposed to the side surface. The SOI substrate manufacturing method includes a first step of forming a structure (230) in which an insulating layer (204b) and semiconductor layer (203b) are in turn formed on a semiconductor member (211) by bonding a first substrate (210) to a second substrate (220), a second step of making the edge portion of an insulating layer (204b) of the structure (230) retreat toward the center so that the edge portion of a semiconductor layer (203c) overhangs the edge portion of an insulating layer (204c), and a third step of moving atoms which form the edge portion of the semiconductor layer (203c) such that the edge portion of a semiconductor layer (203d) covers the periphery of the insulating layer (204c) and connects to the semiconductor member (211).

In manufacturing an SOI (Semiconductor On Insulator) by bonding two substrates, the following representative methods can be used.
In the first method, two substrates are bonded while inserting an oxide film between them. Grinding and polishing are performed from the lower surface of one of the two substrates to leave a semiconductor layer (SOI layer) having a desired thickness on the oxide film.
The second method uses porous Si (see Japanese Patent Laid-Open No. 5-21338). In the representative process of this technique, a porous Si layer, epitaxial Si layer, and oxide film are in turn formed on a seed substrate. After that, the resultant substrate is bonded to a handle substrate to manufacture a bonded substrate, and the bonded substrate is then divided using a porous layer.
The third method uses hydrogen ion implantation (see Japanese Patent Laid-Open No. 5-211128). In the representative process of this technique, hydrogen ions or rare gas ions are implanted into an Si substrate having an oxide film to form an ion-implanted layer. The resultant substrate is bonded to a handle substrate to manufacture a bonded substrate. The ion-implanted layer is then changed into a micro-cavity layer by annealing, thereby dividing the bonded substrate.
SOI substrates manufactured by the above manufacturing methods have a structure in which an insulating film (SiO2) is exposed to the side surface of the SOI substrate. As a result, the insulating film (SiO2) exposed to the side surface of the SOI substrate is selectively etched in forming devices such as a transistor. The SOI layer on the insulating layer overhangs like a terrace, and the strength becomes low. In this state, the SOI layer flakes off and produced Si fragments may cause damage to the substrate surface, resulting in a low yield.
Japanese Patent Laid-Open No. 8-195483 discloses a technique to solve the above problem. In this technique, the central portion of the Si substrate is oxidized while the peripheral portion of an Si substrate is masked by an Si3N4 film. After that, the surface of the Si substrate is polished, thereby manufacturing a first substrate having an oxide film whose peripheral portion is surrounded by Si. The first substrate is bonded to a second substrate to manufacture an SOI substrate.
The method described in Japanese Patent Laid-Open No. 8-195483 can prevent the SOI layer from flaking off by etching the oxide film in manufacturing devices since the oxide film is not exposed to the side surface of the SOI substrate.
However, the method described in Japanese Patent Laid-Open No. 8-195483 complicates the SOI substrate manufacturing process because masking of the peripheral portion of the Si substrate, and polishing after oxidation must be executed.


A coffee degassing device is disclosed and method. The coffee degassing device comprises a coffee bin and a hollow tree within the bin. The hollow tree has an opening in communication with the interior of the coffee bin. The tree provides an exit path for carbon dioxide off-gassing from the coffee. The device may have a diffusion gas supply conduit. The diffusion gas supply conduit is in communication with the hollow tree and is configured to supply nitrogen, or another diffusion gas, to the degassing tree for accelerating the degassing of coffee.

After coffee is roasted, the roasted coffee will release carbon dioxide (CO2). Some of the carbon dioxide in the coffee is released during roasting. Some of the carbon dioxide in the coffee is released during grinding after roasting. Further some carbon dioxide in coffee is release after grinding, in some cases, over about a 4 to 8 day period, depending on coffee origin, roast color, and grind.
Inasmuch as this carbon dioxide will cause impermeable pouches, cans, and other containers to "blow up," the coffee manufacturing process needs to account for off-gassing of carbon dioxide. Previously, provision for off-gassing has included holding coffee in silos or other storage vessels for a period of time ranging from 6 to 96 hours depending on the variables mentioned above as well as the type of packaging container being utilized. But, the present inventor has recognized that waiting up to 96 hours for off-gassing to complete in order to package coffee delays shipment of coffee and increases costs.
Some of the methodologies for eliminating the degree of hold time for off-gassing have included vacuum packing of can coffee and the use of expensive one-way valves in both can coffee as well as packages and pouches. Yet, in some applications, such as brick pack containers and capsules, the use of one-way valves is not possible. The present inventors recognized the need for a device and method for improved and accelerated coffee degassing. The present inventors recognized the need for a conduit within a coffee holding area of a coffee bin to accelerate the degassing and exhausting of carbon dioxide from coffee. The present inventors recognized the desirability of using a diffusion gas to accelerate coffee degassing with no or minimal effect on the valuable taste and aromatics of the coffee.


Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive signaling that configures a downlink bandwidth for a broadcast channel transmission (e.g., a physical downlink control channel transmission). The UE may determine a bandwidth of the capability is less than the downlink bandwidth, and monitor search space occasions in a period to receive samples of the broadcast channel. The period and the search space occasions may be associated with a control resource set and a search space set. The UE may receive the samples in non-overlapping subbands of the bandwidth according to the bandwidth capability, and detect the broadcast channel based on the samples. The UE may additionally monitor repeated transmission occasions in the period based on detecting the broadcast channel to detect a second broadcast channel (e.g., a physical downlink shared channel).

Wireless communications systems are widely deployed to provide various types of communication content such as voice, video, packet data, messaging, broadcast, and so on. These systems may be capable of supporting communication with multiple users by sharing the available system resources (e.g., time, frequency, and power). Examples of such multiple-access systems include fourth generation (4G) systems such as Long Term Evolution (LTE) systems, LTE-Advanced (LTE-A) systems, or LTE-A Pro systems, and fifth generation (5G) systems which may be referred to as New Radio (NR) systems. These systems may employ technologies such as code division multiple access (CDMA), time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal frequency division multiple access (OFDMA), or discrete Fourier transform spread orthogonal frequency division multiplexing (DFT-S-OFDM).
A wireless multiple-access communications system may include base stations or network access nodes, each simultaneously supporting communication for multiple communication devices, which may be otherwise known as user equipment (UE). Some wireless communications systems may support communication between base stations and UEs with various capabilities. Base stations may transmit broadcast channels to UEs, and UEs may perform channel detection processes for decoding and receiving information in the broadcast channels. As demand for UE efficiency increases, however, some wireless communications system may fail to manage broadcast channel transmissions for UEs with differing capabilities.

Managing broadcast channels based on bandwidth


A vegetation pruning device (102) includes a pair (114, 116) of pivotably coupled handles and a motor having a rotary output drive (130) for driving an endless flexible cutting chain (108). A guard (162) is moved relative to the chain (108) by pivoting the handles (114, 116) relative to each other to grip vegetation between the guard (162) and the chain (108). The guard is provided with a pair of curved upper surfaces (164) having teeth (166). The rotary output drive (130) of the motor is arranged generally coaxially with the axis of pivotal movement of the handles (114, 116).

There are a considerable array of tools available for the modern gardener in order to be able to keep growth of vegetation under control. The term "gardener" is meant not only to encompass small domestic concerns, but also larger more agricultural endeavours. Whatever the nature of the gardening, however, there will be a need to control the rate of growth of vegetation for either aesthetic or other purposes such as crop yields etc.
Among the many tools available for keeping vegetation growth under control are, for example, shears for pruning or cutting "light" vegetation such as grass or leaves or small twigs etc. Shears operate by pivoting a pair of blades located in parallel planes relative to each other so that shear forces are applied to vegetation placed in the angle between the blades, the cutting force being generated by manual force of the user, applied to handles attached to the blades. The size or thickness of vegetation which can be cut by shears is limited to the amount of manual force which can reasonably be applied to the handles by the average user. Known shears also suffer from the disadvantage that the act of pivoting the arms of the shears relative to each other to effect cutting tends to push vegetation being cut away from the gap between the blades of the shears, which makes the it more difficult to effect cutting of the vegetation.
At the other end of the scale there are hedge trimmers and the so-called chain saw used for "heavy" vegetation cutting such as trees (whether smaller branches or the entire tree).
Additionally there are smaller-scale tools such as secateurs or scissors used for more delicate pruning or cutting operations.
In any event it will be appreciated that the modern gardener will more usually choose a tool specific to the particular type of pruning operation required. For example, and with reference to the above, when light pruning is necessary of, for example, domestic flowers, then the secateurs are likely to be chosen. Alternatively if bushes are to be pruned, or grass is to be cut, then shears will often be chosen.
There exists, however, a gap in the tool array when moving from "light" bushes to "heavy" trees. Very often vegetation will be of such a size and nature (such as larger bushes or small trees) which are either of a density or branch diameter too large for shears or hedge trimmers to cope with but for which use of the chain saw is unnecessarily excessive.
It is, therefore, an object of the present invention to provide a vegetation pruning device which at least alleviates the above shortcomings by providing a novel form of tool which fits nicely in this gap. Provision of such a tool provides a compact and safe arrangement whereby pruning of the "heavier" vegetation is possible without the need to resort to the aggressive and particularly dangerous tool such as a chain saw.
A known type of chain saw is disclosed in U.S. Pat. No. 4,294,012 and has a guard pivotable relative to a blade of the chain saw and located in a plane parallel to the plane of the chain saw blade, to enable the guard to either be inserted beneath a log to be sawn, to reduce the tendency of the sawn piece of log to pinch the chain saw blade, or to grasp small branches to be sawn and force them into the chain saw. The chain saw has a first handle arranged on the chain saw body, and a second handle connected to the guard, so that the guard can be pivoted relative to the chain saw blade by pivoting the handles relative to each other.
However, this arrangement suffers from the drawback that the motor which drives the cutting chain is generally the heaviest component of the saw, and is arranged some distance from the axis about which the first and second handles pivot relative to each other. This in turn makes the chain saw more difficult to operate, since significant forces need to be applied to the handles to pivot them relative to each other.
Preferred embodiments of the present invention seek to overcome the above disadvantages of the prior art.


Disclosed are a modular lighting apparatus and a method of manufacturing the same. The modular lighting apparatus may be configured such that a volume of a heat radiating module may easily be changed to satisfy standards established by a variety of products groups. An optical module is configured to be interchangeable to provide different form factors that conform to different standards. The modular configuration and associated method of manufacturing the modular lighting apparatus provides enhanced assembly efficiency as well as reduced manufacturing costs.

1. Field
The present disclosure relates to a modular lighting apparatus and a method of manufacturing the same, and more particularly to a modular lighting apparatus which may easily vary a volume of a heat radiating module to satisfy standards established by a variety of products groups, and which achieve enhanced assembly efficiency as well as reduced manufacturing costs, and a method of manufacturing the same.
2. Background
Generally, light sources used primarily for lighting equipment are incandescent lamps, discharge lamps, fluorescent lamps, and the like for various purposes, such as home, landscape, industrial use, and the like. Among the aforementioned types of light sources, a resistive light source, such as, for example, an incandescent lamp, has low efficiency and serious heat radiation problems, a discharge lamp may be expensive and have high voltage problems, and a fluorescent lamp presents an environmental problem due to use of mercury.
To solve the problems of the aforementioned light sources, interest in Light Emitting Diode (LED) lighting equipment that has many advantages, including high efficiency, color diversity, design freedom, and the like, is increasing. LEDs are semiconductor devices that emit light when a forward voltage is applied thereto, and have an extended lifespan, low power consumption as well as electrical, optical, and physical characteristics suitable for mass production. Hence, incandescent lamps and fluorescent lamps are being replaced with LEDs.
LED lighting apparatuses are designed based on shape criteria defined in standards. The standards may be American National Standards Institute (ANSI) standards. For example, A, G, PS, PAR, and R products groups, assembled in an E-base manner, are manufactured as heat sinks having a predetermined volume by ANSI standards.
Manufacture of various lighting apparatuses based on shape criteria defined, for example, in ANSI standards requires additional production lines equal in number to the product groups. Thus, facilities and costs for the manufacture of lighting apparatuses may disadvantageously increase.
The above references are incorporated by reference herein where appropriate for appropriate teachings of additional or alternative details, features and/or technical background.

Modular lighting apparatus and method of manufacturing the same


The present invention includes a freeze dryer which has a housing defining a chamber. A condenser is remote from the chamber and has an interior coupled for communication with the chamber. A base supports the chamber and is configured to accommodate the chamber in a plurality of different positions relative to the base. A pump is coupled to the chamber to lower pressure in the chamber.

The present invention is drawn to freeze drying technology. More particularly, the present invention is drawn to an improved freeze dryer.
Preservation methods have long been the subject of human study. In fact, since the beginning of recorded history, man has struggled to find methods of preservation suitable to the long term storage of goods and other objects. The many methods developed include mummification which was essentially perfected by the Egyptians, freeze drying (also referred to as lyophilization) which was initially developed by the Ancient Indians of the High Andes Mountains. In addition, modern man has developed a variety of preservation techniques including chemical preservation, mechanical refrigeration, cryogenic preservation and dehydration.
Conventional freeze dryers require a vessel which is suitable for holding a specimen to be freeze dried under low pressure (or vacuum) conditions. The freeze dryer also includes a condenser surface which maintains a condensing surface temperature cold enough to create, and collect, vapor which the specimen yields throughout the sublimation process. Finally, conventional freeze dryers require a vacuum pumping system which has enough capacity to reduce the pressure in the vessel (or chamber) quickly, and to maintain low pressure (or high vacuum) conditions throughout the freeze drying cycle.
Prior freeze dryers have typically been very large metal freeze dryers which cost a great deal to run, and which had very long drying times. Significant advantages over such large metal systems were obtained by two freeze drying systems introduced by Applicant a number of years ago. The freeze drying systems were commercially referred to as the Sani-Dry.TM. Freeze Dryer and the Taxi-Dry.TM. Freeze Dryer. Both freeze drying units include a translucent freeze drying chamber which is connected to a remote condenser which is, in turn, connected to a vacuum pump. The remote condenser is typically filled with dry ice which maintains a condensing surface in the condenser at a temperature cold enough to condense and collect vapor yielded by the specimen to be freeze dried during the sublimation process. The vacuum pump is suitable for creating a vacuum within the freeze drying chamber. In addition, the translucent chamber allows energy to be injected into the system simply by utilizing a radiant light source.
However, all of the methods currently used suffer from disadvantages. The disadvantages associated with conventional freeze drying systems include the cost of freeze drying equipment, and the associated operating expenses, as well as excessive drying times with conventional large metal equipment. In addition, conventional freeze dryers include a freeze drying chamber which is fixed in one position. Therefore, the freeze drying chamber is unsuitable for accommodating some specimens requiring a particular orientation. Also, conventional freeze dryers incur difficulty in maintaining the specimen to be freeze dried in a solidly frozen state. Further, the operating expenses of conventional freeze dryers typically are quite high because the material used in cooling the condenser surface is commonly quite expensive. In addition, there is no practical means of controlling the amount of energy supplied to conventional systems in an efficient manner. Therefore, conventional freeze dryers suffer from widely varying controllability.


To increase a compactness of damping systems intended to operate in the event of a dynamic landing of an aircraft, a damping system comprises a primary damper device and a secondary damper device. The primary damper device comprises at least one beam, each beam extending along a direction of a longitudinal axis. The damping system is configured so that at rest, the primary damper device has a stiffness greater than a stiffness of the secondary damper device in the direction of the longitudinal axis. When a force is applied to the damping system along the direction of the longitudinal axis, with a value less than a limit value, each beam remains in a compression state. When the force applied has a value greater than or equal to the limit value, each beam undergoes buckling and the secondary damper device undergoes elastic deformation.

An aircraft comprises a set of mechanical elements, essential to the flight of the aircraft, including skins that are reinforced by circumferential frames and longitudinal stiffeners. This set of mechanical elements indispensable to the flight is generally called "primary structure."
The aircraft also comprises structures to which particular functions are assigned. For example, such a structure is a floor structure, for example a passenger cabin floor structure. According to another example, in the field of freight, such a structure is a vertical partition whose function is to separate the cockpit from a volume of the aircraft intended to receive containers.
Generally, such a structure comprises crosspieces connected to the circumferential frames by their ends, as well as a mesh of spacers. For example, each spacer is connected, at one of its ends, to a corresponding crosspiece of the structure and, at the other one of its ends, to a corresponding circumferential frame. Such a mesh of spacers is, for example, designed to support the structure, to stiffen it, or even to provide a damping function.
In the case of passenger transport, it is essential, during a dynamic landing, that the impact energy is optimally dissipated, so that the impact of the shock, including the vertical impact, on cabin passengers, remain below regulatory limits, or remain as low as possible.
In addition, in the case of freight, the containers may be thrown forward. It is therefore essential to try to protect the crew in the cockpit from shocks generated by such a displacement of the containers.
It has been envisaged to provide the previously described structures with spacers in the form of compression beams of composite material. For example, as described in patent document WO 2009/101372 A1, each such spacers comprises, at one of its ends, a gusset adapted to cut the spacer under the effect of a high level compression force such as that resulting from a dynamic landing. In this case, the spacers form damping devices.
However, such structures are not entirely satisfactory.
Indeed, in such structures, each spacer is sized to withstand the cutting means of the corresponding gusset when the spacer is subjected to a compression force corresponding to normal use (for example, in the case of a floor, a compression force induced by the loading of the floor), so that the cutting of the spacer only occurs in the case of a crash.
This generally leads to oversized spacers, which in turn results in an increase in the size of such spacers, compared to conventional spacers, which is particularly prejudicial in the field of aeronautics.
An object of the invention is therefore to provide a damping system which is able to dissipate the impact energy in a satisfactory fashion, while having a smaller size compared to damping devices of the state of the art.

Shock absorber system comprising a primary shock absorber device and a secondary shock absorber device of different stiffnesses, associated structure and aircraft


A subassembly for adsorbing hydrocarbons with an air intake system of a motor vehicle is provided. The subassembly includes a plurality of stacked layers constructed of a hydrocarbon adsorbing material. The plurality of stacked layers includes at least one lowermost layer and an uppermost layer. The at least one lowermost layer includes a solid shape within an outer boundary. The at least one lowermost layer is adapted for attachment to a component of the air intake system. The uppermost layer includes an opening such that the uppermost layer provides access from an upper side of the subassembly to the at least one lowermost layer through the opening for attaching the subassembly to the component.

This section provides background information related to the present disclosure and is not necessarily prior art.
Air induction systems are used in motor vehicles and for other applications to transport air from the environment to an engine for combustion. While operating, the engine continuously draws air through the air induction system and into the combustion chamber. When the engine shuts down, or otherwise ceases operating, air may flow in the reverse direction, into the air induction system and the environment from the combustion chamber or other portions of the engine. Air that flows from the engine into the air induction system may include hydrocarbons, formed by the evaporation or vaporization of un-combusted fuel. Government regulations require that the amount of hydrocarbons in the air that flows from the engine and into the atmosphere be minimized. For this reason, a hydrocarbon adsorber may be placed within a portion of the air induction system. The hydrocarbon adsorber can adsorb hydrocarbons that might otherwise be released into the atmosphere from the engine after engine shutdown.
While known hydrocarbon adsorbers have proven to be acceptable for their intended purposes, a continuous need for improvement in the relevant art remains. In this regard, it would be desirable to provide a hydrocarbon adsorber, and a related method of manufacturing and assembling a hydrocarbon adsorber, that would allow for the use and assembly of the hydrocarbon adsorber in a modular manner across various vehicles and/or vehicle platforms.

Hydrocarbon adsorber and related manufacturing methods