An electric drive unit for a vehicle includes an electric motor, two output shafts, a first speed reduction planetary gearset driven by the motor, a second speed reduction gearset driven by an output of the first gearset, and a compound planetary differential gearset including an input driveably connected to the output of the second gearset, a first differential output driveably connected to the first output shaft, and a second differential output driveably connected to the second output shaft.

The present invention relates to a drive system for a motor vehicle. More specifically, the present invention relates to an electric motor drive unit for use in hybrid electric motor vehicles.
To reduce the volume of pollutants exhausted into the air by automotive powertrains driven exclusively by an internal combustion engine, hybrid powertrains that include an electric motor and an IC engine, which operate independently or and in combination, have been developed.
Hybrid electric powertrains are being developed for use in four-wheel drive vehicles such that the motor and the engine can transmit power to both a front set of driven wheels and rear set of driven wheels. Hybrid four-wheel drive systems, however, present packaging difficulties to the vehicle designer. When packaging an electric motor drive unit for a front axle or rear axle it is preferable to place the motor drive unit on the axle centerline for best packaging efficiency.
Packaging an electric motor on an axle and eliminating the need for a 90-degree bevel gear differential provides an electric hybrid powertrain with a substantial improvement in packaging efficiency. Performance improvement and better fuel economy accompany the packaging efficiency.
A need exists for hybrid electric powertrains applicable to four-wheel drive vehicles that use conventional powertrain components, minimize package space, and reduce manufacturing and assembly costs.

Speed reduction gear train with planetary differential for electric motor axle drive


A carbon fiber of a high tenacity and a high modulus of elasticity having a fiber diameter of 1 to 6 .mu.m, a strand tenacity of 430 kg/mm.sup.2 or more, a strand modulus of elasticity of 28 ton/mm.sup.2 or more and a density of 1.755 g/cm.sup.3 or more, and a process for producing the same.. The above-mentioned carbon fiber has extremely useful properties as a raw material for composite materials to be used not only for sporting goods such as fishing rods or golf clubs but also in aerospace industries.

In recent years, carbon fiber composite materials have been used in a wide field of applications including sports, aerospaces and industries and the consumption thereof is remarkably increasing in quantity. In correspondence to such conditions, the properties of carbon fibers used are also being improved by leaps and bounds.
In regard to the modulus of elasticity of carbon fibers, whereas it was about 20 ton/mm.sup.2 ten years ago, 23-24 ton/mm.sup.2 became its standard value several years ago. Further, recent efforts in development are being directed to attaining a modulus of elasticity of about 30 ton/mm.sup.2, and it is generally believed that such a value would become the mainstream of the moduli of elasticity of carbon fibers.
However, if such improvement of the modulus of elasticity of a carbon fiber is achieved while keeping the tenacity of the carbon fiber at a constant value, it will naturally cause the decrease of elongation of the carbon fiber, which will result in brittleness of carbon fiber composite materials produced by using such carbon fibers and in lowering the reliability of the properties of the composite materials.
Accordingly, there is a strong need at present for a carbon fiber having a high modulus of elasticity and a high elongation, in other words, a carbon fiber having a characteristic that it has a high elongation and at the same time has a high tenacity.
Conventional methods for improving the modulus of elasticity of a carbon fiber comprised increasing the carbonization temperature, namely the ultimate heat-treatment temperature, of the carbon fiber. However, though such a method is effective in improving the modulus of elasticity of carbon fibers, it has a defect in that the improvement is accompanied by the decrease in the tenacity of the carbon fibers and consequently results in the decrease in the elongation of the fibers. The attached drawing is a graph showing the correlation between the carbonization temperature of a carbon fiber and the physical properties of the resulting carbon fiber to illustrate such situations. As shown in the drawing, with the increase of the carbonization temperature of a carbon fiber, the modulus of elasticity of the fiber increases as indicated by curve A, whereas the tenacity and the density of the carbon fiber decrease as shown by curves B and C in the drawing in keeping with the above increase of the modulus.
For example, a temperature of about 1800.degree. C. is fibers obtained according to the above invention has a tenacity of 360 to 420 kg/mm.sup.2 and a modulus of elasticity of fiber strand of high tenacity and high modulus of elasticity.

Carbon fibers having high tenacity and high modulus of elasticity and process for producing the same


In order to provide the processing required to prevent a semiconductor substrate from becoming contaminated or damaged, without heating it in a kiln, a combustion flame of a gas that is a mixture of hydrogen and oxygen is applied to the surface of the semiconductor substrate, so that only the substrate surface is heated. Oxidizing or reducing processing can be provided by varying the ratio of hydrogen to oxygen. A device that enables this processing method comprises a first conduit (6) for guiding hydrogen; a second conduit (7) for guiding oxygen; a flame generation means (5) for combusting the hydrogen and the oxygen in a mixed state to generate a downward-pointing flame over a range wider than the diameter of a semiconductor substrate (1) that is being processed; a flow regulation means (8) and (9) provided midway in each of the first tube and the second tube, for regulating the fluid passing through each of the first tube and the second tube; and a conveyor means (2), (3), and (14) for conveying the semiconductor substrate that is being processed, provided below the flame generation means.

In addition to basic processes such as photolithography, etching, and film growth during the sequence of steps in the manufacture of an LSI, processing that improves the quality of the surface of the semiconductor substrate material is required. There are many different types of such processing, depending on purpose and method--typical examples are described below.

Semiconductor substrate surface processing method using combustion flame


A thermal barrier coating system consists of two layers of a zirconia-yttria ceramic. The first layer is applied by low pressure plasma spraying. The second layer is applied by conventional atmospheric pressure plasma spraying. This facilitates the attachment of a durable thermally insulating ceramic coating directly t the surface of a highly oxidation resistant NiAl-based intermetallic alloy after the alloy has been preoxidized to promote the formation of a desirable Al.sub.2 O.sub.3 scale.

Goward et al U.S. Pat. No. 4,248,940 is directed to a process for the coating of nickel-based superalloys with a graded thermal barrier coating of multiple layers, each having an increased proportion of ceramic materials. The concentration of gradient facilitates smooth transition from a bond material having small quantities of ceramic material to a top layer thermal barrier coating which is predominantly of ceramic material.
Gedwill et al U.S. Pat. No. 4,451,496 is concerned with a coating system comprising a metal/ceramic cermet applied to a substrate with a metallic layer subsequently applied to the cermet layer.
Naik U.S. Pat. No. 4,714,624 describes a method of applying a metal coating system comprising two metallic layers. The outer layer is an MCrAlY coating, and the inner layer is an aluminide coating.
Vine et al U.S. Pat. No. 4,861,618 is concerned with a specific thermal barrier coating for superalloys comprising a specific NiCoCrAlY composition for the metallic layer and a specific ZrO.sub.2 --Y.sub.2 O.sub.3.
Gupta U.S. Pat. No. 4,897,315 discloses an aluminized MCrAlY coating. Merz et al U.S. Pat. No. 5,032,469 describes a metallic coating of stainless steel plus titanium, zirconium, hafnium, niobium, tantalum, molybdenum and/or tungsten.

Plasma sprayed ceramic thermal barrier coating for NiAl-based intermetallic alloys

The United States of America as represented by the Administrator of the National Aeronautics and Space Administration


An equine weight training system for efficiently weight training a horse so that the horse may comfortably carry a bouncing load (e.g. individual, etc.) upon their back. The equine weight training system generally includes a saddle tree to be positioned upon a back of a horse and a harness device including a plurality of straps to loop over and attach to the saddle tree and around the horse, wherein the plurality of straps extend outwardly from the harness device. A plurality of pouches extend from the harness device, wherein a plurality of weighted objects are removably positioned within the plurality of pouches. The plurality of weighted objects are inserted and removed from the plurality of pouches to accustom a horse to weight positioned upon a back of a horse.

1. Field of the Invention
The present invention relates generally to devices for training horses and more specifically it relates to an equine weight training system for efficiently weight training a horse so that the horse may comfortably carry a bouncing load (e.g. individual, etc.) upon their back.
2. Description of the Related Art
Any discussion of the related art throughout the specification should in no way be considered as an admission that such related art is widely known or forms part of common general knowledge in the field.
Horses have been used for many years for various purposes, such as but not limited to riding, hauling cargo, pulling objects and various other uses. Typically before placing any excessive amount of weight upon the horses back, the horse must be trained into carrying the respective weight to prevent injuring the horse.
Various methods have been utilized in the past to weight train the horse so that the horse is accustomed to carrying large amounts of weight upon the horse's back. However, many of these methods are not efficient in that they either do not provide enough weight increments; they do not easily and comfortably attach to the horse, or do not efficiently simulate a rider. Because of the inherent problems with the related art, there is a need for a new and improved equine weight training system for efficiently weight training a horse so that the horse may comfortably carry a bouncing load (e.g. individual, etc.) upon their back.


The present invention includes an apparatus for inserting a radio frequency device into a label. A ribbon of labels has a plurality of labels and a cavity formed in each of the labels. A mechanism linearly advances the ribbon of labels. A device inserts at least one radio frequency device into the cavity of a respective label. An upper layer of the ribbon of labels is slit along the channel to form an opening along a top of each of the cavities and at least one RFID device, such as a tag or coin is inserted within at least one of the plurality of cavities. A label for removably holding the RFID device includes an upper and lower layer of material. The cavity is formed between the upper and lower layers. An area of interference is located at a top of the cavity for holding the RFID device within the cavity.

1. Field of the Invention
The present invention relates to a label having a cavity for receiving a circular or coin sized RFID device, and more particularly, to an apparatus and method of inserting the RFID device into the label cavity in a free floating fashion.
2. Description of the Related Art
The attachment of labels to cloth goods such as clothing, linens and towels is a common practice used to set forth information such as trademarks and trade names, material identification and characteristics, sizes, care instructions, and so forth. In addition, legal requirements necessitate the use of labels in clothing or on linens. A method and apparatus for producing individual folded labels from a ribbon of labels is presented in published PCT application WO 00/50239 and is incorporated in its entirety herein.
U.S. Pat. No. 6,827,817, incorporated in its entirety herein, discloses a folded label having radio frequency identification device (RFID) disposed therein. RFID tags typically consist of an antenna or a coil, to collect RF energy, and an integrated circuit (IC) which contains identification code or other information in its on-chip memory. The RFID device stores and transmits identifying information, such as inventory control, pricing control and the tracking of the origin of the merchandise.
Commercially available RFID tags generally operate at low frequencies, typically below 1 MHz. Many 13.56 and 915 MHz tags are currently commercially available in the market today. 915 Mhz tags are commercially available due to the current mandates by large retailers and the DOD requiring 915 Mhz tags on case goods for their larger suppliers. Although lower frequency devices are more common, a wide range of high frequencies are available, for example, 13.56 MHz, 915 MHz, 2.45 GHz and 5.6 GHz. Low frequency tags usually employ a multi-turn coil resulting in a tag having a thickness much greater than a standard sheet of paper. 2.45 GHz and 5.6 GHz can be done in a single turn or as a die pole antenna. High frequency passive RFID tags, which operate at around 2.54 GHz, typically consist of a single turn, flat antenna, printed onto a flat single layer sheet of plastic or paper.
The numerous different sized RFID tags can also take different shapes. The coin shaped tags can be a RFID tag encased in durable packaging. This packaging provides the tag with protection from a hostile environment that may other wise damage or destroy the tag. Environments such as heat, steam, chemicals, water and other acute demands. Due to the longevity this packaging provides such an RFID tag has the capability to survive many product life cycles.
A RFID tag embedded in a woven label is easily sewn onto a garment. This garment may be used at a garment rental facility or commercial laundry facility. After 40-50 wash cycles the garments quality and integrity is somewhat damaged from the environment it has been exposed to, however, the RFID tag embedded in the woven label is not effected. By embedding the RFID tag into the woven label, with out any permanent means such as adhesives or other attachment method that will combine the RFID tag and the woven carrier, the RFID tag can be removed without any damage or residue that could effect reprocessing of that RFID tag into another label. Thus, an RFID tag that is attachable without the use of adhesive, easily removed and reused by attaching it to another item or garment is also desirable.
As fully disclosed in U.S. patent application Ser. No. 10/143,842, commonly owned by the assignee of the present invention and incorporated in its entirety herein, a ribbon of labels with RF devices encapsulated therein can be subdivided into individual RF labels using ultrasonic means resulting in individual folded RF labels that are both soft to the touch, i.e., having edges that are generally scratchless to the apparel consumer, and capable of storing and transmitting identifying information and at the same time virtually free of defects.
It would be desirable to be able to produce labels incorporated with RF devices for storing and transmitting identifying information and that are more comfortable to the apparel customer than current labels. In addition, it is desirable to produce such labels at a higher speed and at a greater efficiency of production for both label and end product manufacturers, and with fewer defects than current methods.
Apparel items and other goods have certain identifying specifications that can be broken down into different factors and these factors contain certain options. Therefore, for example, apparel items are sorted at distribution centers by several factors, i.e., style, color, size, authenticity, date of manufacture, shipping instructions, contractor, etc. These factors can contain several options. A defining factor such as product color would contain several options, such as red, blue, and/or green. A defining factor such as size would contain several options, such as small, medium, large.
It would be useful at the point of sale or before to know and identify the date of manufacture, authenticity or season code of a given item. It also would be desirable to be able to account for the necessary identifying factors in a simplified, inexpensive manner to provide a record on the item as to its specification.
Another inconvenience the prior art labels having RFID devices is that the devices cannot be removed without destroying the label. RFID devices can be used to designate an individual's information, for example, in assigned uniforms. Thus, when a wearer returns his or her uniforms to an employer for cleaning, the RFID device can be used to identify the number of uniforms, etc., returned to an individual employee. The prior art RFID labels do not provide means to remove and reuse the RFID device.
Thus, there is a need to provide a comfortable label having a RFID device that can be removable and reused.

Label having a cavity for receiving a RFID device and an apparatus and method of making and assembling the same


The edging or tapering equipment requires that each of the two shaped pads, for the plastic deformation of the two edges of a respective can body, be positioned so that the longitudinal axis of the pads lies at an angle to the longitudinal axis of the can body located in an operating position zone, and that the pads be set at opposite angles to one another; each of these shaped pads also moves independently, rotating and traversing around and along their respective longitudinal axis and simultaneously traversing along a determined longitudinal axis so as to obtain, at an operating contact position, induced rotation of the can body in a direction concording with the rotation of the shaped pads and designed to allow contact between each operating head and the respective edge in a zone for the definition of the profile of said edge, a profile which is created gradually, by simultaneous linear traversing and rotation of the shaped pads along the axis.

The present invention concerns an equipment for the conveying, edging or tapering of at least one edge of body cans, in particular but not exclusively cylindrical body metal cans, made by sealing their respective overlapping longitudinal edges or by drawing and re-drawing, and the method for conveying and edging or tapering one or both of the two edges of the respective can body.
In the metal cylindrical body can production sector (products normally used for foodstuffs, preserves and drinks), one of the most delicate stages is the definition of the circular edges of can bodies; these edges must, in fact, be "deformed" so that, in the first instance, they have an arched profile with diameter larger than the diameter of the cylindrical section of the can body; (the said operation is called edging), alternatively, an inward narrowing of the edge towards the internal surface of the said body (this operation is called tapering).
To obtain these edge shapes, machines equipped for the corresponding plastic deformation techniques are used, the equipment selected in accordance with the dimensions of the can bodies to be worked: for edging the respective two edges of can bodies, either a pair of opposing shaped pads or a or a pair opposing rotating heads with numerous shaped pads or a or a pair opposing rotating heads with numerous shaped rollers are used, whilst for tapering, traversing shaped pads only are used, described in further detail below.
Machines which use such equipment generally have a can body feeder station which supplies them to an individual can body pick-up station, also used to position the can body at an edging station. This station consists of traversing shaped pads or traversing-rotating heads with rollers: the case examined herein concerns the first of these two types of equipment.
The said equipment consists of two cylindrical operating heads, positioned opposite one another, each with a shaped pad whose profile defines the `negative" of the profile to be created on the edge if the can body; each operating head is supported by a respective shaft which moves along longitudinal axis so that the two operating heads can be moved towards and away from each other. For tapering, an internal pad is employed, with axial movement relative to the operating head, and which determines the extent to which the external edge is tapered, and facilitates removal of the can body from the relative shaped pads.
In practice, the can body is, therefore, placed between the two shaped pads, its longitudinal axis placed coaxially to the pads' traversing axis; the shaped pads are then moved towards the can body, fixed in the said position, until they gradually make contact with the respective edges of the can body with enough force to obtain the desired plastic deformation of the edges when the two shaped pads reach the limit or their forward travel
This "pad" edging or tapering technique, however, limits the diameter and thickness of the can body, since the force necessary to obtain plastic deformation of the can body edges, being simultaneously distributed on the entire edge circumference, is greater than that applied using the traversing and rotating rollers which, in contrast, cause "punctiform" deformation of the edge surface; pad edging, for example, is carried out on cans with a larger diameter which, if they are of suitable thickness, bear the force applied to the entire end without problems. As well as this size limitation, it has been observed that, during pad edging, and especially where can bodies have reduced diameter and thickness, buckling or abnormal plastic deformation may occur on the edge where the edge joins the aforementioned can body longitudinal edges.

Equipment and method for edging and tapering cylindrical body cans


A microelectronic element assembly such as a semiconductor chip assembly uses a connection component incorporating a dielectric sheet with electrically conductive elements therein. Each electrically conductive element may include a flexible shell. The flexible shells can be formed to assure reliable engagement with mating contact pads.

Microelectronic devices such as semiconductor chips require large numbers of electrical connections in a small area. For example, a complex semiconductor chip may have hundreds of contacts for signal input and output and for power supply, all within an area of a few cm.sup.2. These contacts must be reliably connected to corresponding contact pads on a substrate such as a chip mount, circuit panel or multichip module. The connection between the chip and the substrate must meet numerous, often contradictory requirements and desires. It should be low in cost, and yet highly reliable. It should require only the minimum amount of area on the substrate. Ideally, the connected chip should be accommodated in an area of the substrate approximately equal to that of the chip itself. The connections should be robust and capable of withstanding repeated changes in the temperature of the chip and the substrate, and the associated differential thermal expansion and contraction of the chip and substrate. Moreover, the connection systems should not impose unusual or costly requirements in fabrication of the chip or substrate. The connection system desirably should facilitate testing of the chip, and the connection system itself, before the chip is finally assembled to the substrate. All of these considerations, taken together, represent a formidable engineering challenge. These considerations are present, to a greater or lesser degree, in other connections used in microelectronic devices as, for example, connections between substrates or circuit panels.
Numerous solutions to these problems have been proposed heretofore. One common method of making connections to a semiconductor chip or a similar device is wire bonding. In wire bonding, numerous fine wires are connected to the contact pads of the chip and extend outwardly, over the edges of the chip, to corresponding contact pads on a substrate. The process requires individual connections of each contact on the chip and also requires an area of the substrate substantially larger than the chip itself. In a further method referred to as tape automated bonding or "TAB", fine metallic leads are disposed on a polymeric tape. The leads may be connected individually or en masse to the contact pads of the chip and to the contact pads of the substrate. This method also requires a substantial area of the chip substrate surface. In so-called "flip-chip" bonding, the front or contact-bearing surface of the chip faces downwardly to the substrate, and each contact on the chip is connected to the corresponding contact pad on the substrate by a solder column. This method can mount a chip in an area of the substrate substantially equal to the area of the chip itself, but suffers from drawbacks such as poor resistance to thermal cycling, cost and process difficulties.
Numerous other chip mounting methods have been proposed. For example, Patraw, U.S. Pat. Nos. 4,695,870 and 4,716,049 disclose a package for a microelectronic chip utilizing hollow metallic "compressive pedestals" engaged between the chip and the substrate and making a spring loaded electrical connection. McMahon, U.S. Pat. No. 5,321,583, discloses a second level interconnect, i.e., an interconnect arranged to connect an already packaged device to a circuit panel. This interconnect uses apparently solid metallic spheres disposed between the package and the circuit panel and an external spring to maintain engagement of all of the components. Tsukagoshi et al., U.S. Pat. No. 5,120,665, discloses an isotropic electrically conductive adhesive with numerous deformable electroconductive particles disposed therein. The particles may include a polymeric core with a thin metallic layer, typically less than about 1 micron thick. These particles are distributed at random between a chip and a substrate, so that those particles which are engaged between contacts of the chip and contact pads on the substrate will permit electrical conduction between the so-engaged pad and contact. As noted in International Interconnection Intelligence Flip Chip Technology Impact Report, pp. 3-79 to 3-80, a Seiko Epson Corporation process uses gold plated resin balls mixed with adhesive and printed onto a substrate contact. The substrate is then engaged with a chip and secured by a separate adhesive. Despite these efforts in the art, still further improvement would be desirable.

Microelectronic component mounting with deformable shell terminals


Stackable and portable data carriers, with non-volatile semiconductor memories have contact faces on their surfaces. When such data carriers are stacked on top of one another they electrically contact the respectively adjacent data carriers and a bus system at the same time. The contour of the data carriers is embodied such that, when neighboring data carriers of the same kind rest on one another, the data carrier are interlaced in a form and force lock to a mechanically fixed, but detachable composite unit. At the same time, the respectively adjacent data carriers of the composite unit come into resilient contact with one another via their respective contact faces.

1. Field of the Invention
The invention pertains to stackable and portable data carriers including a card-shaped carrier element, on which there are disposed at least one electrically programmable, non-volatile semiconductor memory and at least one external connection of the data carrier that is electrically connected to the memory. The external connection has contact faces disposed on the surfaces of the data carrier in such a way that when data carriers of the same kind are resting on one another, they electrically contact the respective neighboring data carriers and a bus system at the same time.
Data carriers with standardized dimensions have been known in the art generally as chip cards. Conventional chip cards contain semiconductor elements with relatively small storage capacity and a logic circuit in the foreground. With the increasing availability of semiconductor memories that can be inexpensively produced and that have a storage capacity at least in the megabyte range, comes the desire to rapidly and easily access a large number of data carriers of the same kind with the greatest possible storage capacity. These data carriers are intended, for example, for digitized music signals, image signals received by an electronic camera, texts (such as entire dictionaries), electronic maps, software for data processing systems, etc. The semiconductors can be writable and erasable memories or read-only memories (ROM). The data are preferably stored in a compressed format with regard to their redundancy.
2. Description of the Related Art
Commonly owned, copending application Ser. No. 08/828,697, filed Mar. 31, 1997 (publ. WO 96/10804), which is here incorporated by reference, describes a stackable data carrier of the above-mentioned kind. There, the contact faces should preferably be disposed running flush around one of the edge faces of the carrier element. As a result, a number of these cards can be easily stacked one on top of the other so that a large number of data carriers of the same kind can be simultaneously connected to a processing device without an expensive additional device. Connection faces that run flush around an edge achieve a direct reciprocal contacting of the cards stacked on top of each other without a contact rail. Mention is also made of a loosely manageable connecting socket that secures the stacked data carrier cards in a mechanically fixed composite unit.
The corresponding connections, which are directly or indirectly connected to one another and belong to a number of cards disposed one on top of the other, function logically as a data bus so that all of the data carriers of the stack are simultaneously connected on-line the moment even one of the stacked data carriers is connected to the device.
The copending application further proposes, in connection with the possibility of combining a number of mutually stacked data carrier cards in a connecting piece or in a housing, positioning means which force the chip cards as precisely on top of one another as possible and, as a result, assure an exact overlapping of their connections. These positioning means include at least one projection on a main face of the carrier element and a corresponding recess on the opposite main face, which can receive the projection of another data carrier. The knob-like projections disclosed there, however, particularly due to insufficient elasticity, are not suited to assure a durable fixing of the stacked data carriers even with the exertion of external force. Furthermore, even with an exact overlap of the connections, no assurance of sufficient contact force or a tolerance compensation in the stacking direction between the different connection contact points is made.

Stackable data carrier that can be operated on a data bus


The present invention relates to a method for positioning a mobile station and a repeater thereof. Said method comprises: the mobile communication network, when receiving a positioning request from a mobile station, instructing repeaters to send auxiliary positioning signals, and the mobile station performs measurement according to the received auxiliary positioning signals sent from the repeaters and downlink signals sent from the base station, and then estimating the position of the mobile station according to the measurement results, and thereby implementing the positioning of the mobile station. Said repeater is implemented through adding an auxiliary positioning unit in the downlink processing channel of a traditional repeater; said auxiliary positioning unit comprises a communication module, a frame timing recovery module, a timing control module, and a pilot modulating module. The present invention achieves the object of improving the accuracy of positioning the mobile station within the coverage area of repeaters; in addition, the repeater with auxiliary positioning function according to the present invention is simple to be implemented and doesn't affect the structure and signaling flow of the traditional mobile station.

To enable the mobile communication network to provide new services, mobile station positioning technique needs to be introduced to determine the position of mobile stations. In a cellular mobile communication network, there are three basic positioning methods: 1) Time Of Arrival (TOA) positioning method, which obtains the distances from a mobile station to the corresponding base stations through measuring TOAs from the mobile station to three or more base stations, and then estimates the position of the mobile station through solving a set of circular equations; 2) Time Difference Of Arrival (TDOA) positioning method, which obtains the differences in distance from a mobile station to the corresponding base stations through measuring TDOAs from the mobile station to three or more base stations, and then estimates the position of the mobile station through solving a set of hyperbolic equations; 3) CELL Identifier (CELL-ID)+TOA positioning method, which firstly determines the position of the serving cell where the mobile station is located with the CELL-IDs configured by the network, and then further determines the position of the mobile station in the cell with the TOA from the mobile station to the serving base station.
However, in traditional mobile communication systems, to ensure normal communication between mobile stations and base stations, repeaters are deployed in some areas that can't be covered by base stations; a repeater is essentially a bidirectional radio frequency signal amplifier, which amplifies and forwards both uplink signals sent from a mobile station and downlink signals sent from a base station; as shown in FIG. 1, in the downlink direction, the donating antenna (antenna of the serving base station) picks up signals from the existing coverage area, filters out-of-band signals through a bandpass filter, amplifies the filtered signals through a power amplifier, and then resends the amplified signals to the area to be covered; in the uplink direction, signals from the mobile station in the coverage area are processed in a similar way and then sent to the corresponding base station; thus, signal transmission between the base station and the mobile station is implemented. The introduction of a repeater implements normal communication between the mobile station in the base station's coverage area and the base station.
The introduction of repeaters results in that the mobile stations in the coverage area of the repeater can't be positioned effectively. When a mobile station required to be positioned is in the coverage area of a repeater, for the TDOA positioning method, the TDOA positioning process will fail because of the number of detectable base stations being too small; even if enough base stations can be detected, there will be very big deviations in the measured values because the signals from the base stations are forwarded by the repeater; as a result, the measured TDOAs can't correctly reflect the differences in distance between different base stations and the mobile; if the measurement result is used for position estimation, there will be a very big deviation in the determined position of the mobile station; furthermore, the positioning system is unable to determine whether the mobile station is within coverage area of the repeater or not and whether the measurement result is affected by the repeater or not. Likewise, when the mobile station requested to be positioned is in coverage of the repeater, for the TOA+CELL-ID positioning method, there will be bigger errors in TOAs due to the time delay effect resulted from the repeater and the TOA positioning accuracy will be degraded severely; as the result, it is unable to positioned the mobile station accurately.

Method for positioning mobile station and repeater thereof


An apparatus and methods for disambiguating data elements transmitted by exception over a multi-path, multi-tiered communications network of nodes from at least one originating node to a destination node. A method includes the steps of receiving counter data from each node operable to originate data elements, receiving a data element name, evaluating counter data from nodes forming at least one possible path between the named data element's originating node and said destination node; and indicating as unambiguous data associated with the data element name if each of the nodes forming the possible path are transmitting counter data to the destination node. The apparatus includes a processor coupled to the destination node and to a source of data element names, a memory containing a path database and instructions for searching the database for paths of the named data element and to update the database with data relating to counter data reception.

Some aerospace systems, such as the International Space Station (ISS) and the Space Transportation System (STS), or Space Shuttle, produce large volumes of telemetry which must be transmitted to terrestrial stations for use by mission controllers and vehicle health managers, among others. The transmission occurs over multi-nodal, multi-tiered networks which include nodes within and exterior to the space vehicles. Because bandwidth for transmitting the telemetry data is limited, various approaches to bandwidth compression have been attempted, one of which is the transmit-by-exception approach.
In a transmit-by-exception telemetry data transfer, the only data transmitted are those telemetry values which have undergone a significant change since they were last transmitted. This approach can provide substantial bandwidth compression. A resulting difficulty, however, is that the user on the ground cannot tell the difference between data that is not changing because it has not required transmission and data that is not changing because some portion of the network is malfunctioning. Network anomalies may be intermittent, making some telemetry faulty and leaving some telemetry valid. Unchanging data is ambiguous at the point of reception as to the cause for the lack of change.
The problem is exacerbated when the telemetry data is to be used in Integrated Vehicle Health Management Systems (IVHMSs). IVHMSs access telemetry data for use by diagnostic and prognostic software to support vehicle health maintenance. Experience has shown that ambiguous telemetry data may cause known IVHM algorithms to produce erroneous results.
One approach is to observe a constantly-changing telemetry data element, or counter, transmitted from the same source node as the transmit-by-exception data to be disambiguated, or target data. The target data may be evaluated as valid if the frequently-changing telemetry data element is seen to change over the time period when the target data was sent. The approach has several weaknesses. First, in a multi-path, multi-tiered communications network signal noise can cause false data values in the counter data, leading an algorithm to conclude that the counter is operating when, in fact, it is not operating. Thus, target data that is invalid may be erroneously seen as valid.
Second, counters that change at different rates on different nodes are utilized. The temporal resolution of a pairing disambiguation scheme for an individual node is the period of that node's counter minus the pulse width of the data bit. The temporal resolution of the disambiguation scheme for the network as a whole is the resolution of the slowest counter in the network. The temporal resolution for the network as a whole matters because IVHM systems need a series of complete "snapshots" of the vehicle system that give, as closely as possible, the state of the vehicle at particular times. If some of the data has gone bad without notice, the snapshots will be flawed and the IVHM system will reach an erroneous conclusion.
Designers and operators of large networks such as those used with ISS and STS often use their own commercial-off-the-shelf (COTS) equipment. Counters of different frequencies are inevitable, and the counter frequency for a particular node may be selected based upon vendor-unique or situational criteria rather than a desire for uniformity. Ideally, each node might be equipped with a high-speed clock, but this would quickly recreate the bandwidth-saturation problem that transmit-by-exception telemetry was designed to solve. For some existing networks, retrofitting each network node with a counter would be impractical. If one counter in a network operates at a frequency of 0.1 Hz, it could be nearly 10 seconds before a problem becomes apparent. Disambiguation schemes with low temporal resolutions are problematic in IVHM systems, so the pairing approach is rejected.
Networks are reconfigurable by nature, making the process of tracking network health an expensive and energetic undertaking. For example, whenever a new module is added to the ISS, at least one sub-net must be added to the network and new telemetry points must be added. The same may be true for additions, such as a robotic arm, incorporated into an STS.
Accordingly, it is desirable to disambiguate transmit-by-exception telemetry to improve the performance of IVHM and other systems. It is therefore desired to avoid poor temporal resolution and noise-induced false validations. In addition, it is desirable to provide a user-friendly process of providing telemetry disambiguation that is adaptable to changes in the structure of the network and the set of telemetry variables sent over the network. Avoiding physical upgrades to existing network equipment while creating the desirable features just mentioned is also desirable. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description of the invention and the appended claims, taken in conjunction with the accompanying drawings and this background of the invention.

Method and apparatus for disambiguating transmit-by-exception telemetry from a multi-path, multi-tier network


Disclosed is an apparatus and method to perform a pairing process with a limited input wireless device. A host device includes a transceiver and a processor. The processor may be configured to execute instructions to: receive from the transceiver a pairing process request from the limited input wireless device, wherein the pairing process request includes a private code based upon a physical user action implemented with the limited input wireless device; and implement a pairing process to validate the limited input wireless device for a particular host device function associated with the private code.

1. Field
The present invention relates generally to a pairing and authentication process between a host device and a limited input wireless device.
2. Relevant Background
Today, the use of mobile electronic devices is widespread. Such mobile devices can provide a user with wireless phone access, Internet access, allow the user to perform on-line transactions such as on-line shopping, on-line banking, as well as other applications such as finding maps to particular locations, etc. Thus, today's mobile devices allow for wireless communication as well as almost all of the Internet features associated with non-mobile computer systems. Examples of such mobile electronic devices include: mobile devices, smart phones, cellular phones, personal digital assistants (PDAs), digital cameras, mobile computers, etc.
Differing digital wireless network standards often include a security measure to ensure that two devices that are in operative reach of each other are mutually accepted. This procedure is termed pairing and may involve the exchange of a passkey.
For example, an initial pairing is typically implemented between a host device and a limited input wireless device such that the limited input wireless device is allowed to gain access to functions of the host device. In order to make sure that an intended limited input wireless device is paired, typically a code, such as a PIN, is automatically transmitted from the limited input wireless device to the host device. An example of this would be a mobile phone and a limited wireless headset device (e.g. a BLUETOOTH headset) being paired together. Because limited input wireless devices are typically small and typically only have one or two available buttons (or none at all), a user typically has no way to enter a secure private code or key on the limited input wireless device in order to pair with the host device in a secure manner such that the user has a particular user-defined private key to securely authenticate the user to the host device.
Unfortunately, with typical limited input wireless devices, the pairing operation is simply implemented by the limited input wireless device transmitting a pre-set code, such as the PIN, to the host device. In other words, the PIN or some other pre-set code is used as the security code. After that, anyone using the limited wireless input device can access the functions of the host device. For example, when a BLUETOOTH headset is paired with a cellular phone, the PIN is automatically transmitted and is used as the security code during the pairing process, such that anyone can use the BLUETOOTH headset with the cellular phone after pairing.
Therefore, there is a need for a limited input wireless device that can be paired with the host device based upon a secret code or key entered by the user such that the limited input wireless device can thereafter be authenticated by the host device to utilize its functions based upon the secret key entered by the user.

Pairing and authentication process between a host device and a limited input wireless device


In one embodiment there is provided a radar signature and induced aerodynamic drag minimizing, externally mountable, internally configurable pod structure optimized for internal placement of one or more deployable stores through configuration and optimal kinematic operation of a pod door assembly. The pod structure has an externally mountable pod housing, a predetermined pod housing cross-sectional configuration optimized to provide a configurable interior volume accommodating multiple different store configurations, and a predetermined pod housing configuration having a cross-sectional configuration optimized to minimize a radar signature and an induced aerodynamic drag. The pod structure further has a pod door assembly integral with the pod housing and having a plurality of pod doors and one or more seal door mechanism assemblies. The pod structure is optimized in kinematic operational combination of the pod doors and seal door mechanism assemblies controlling ejection launch envelopes.

1) Field of the Disclosure
The disclosure relates generally to store stowage and deployment systems and methods, and more particularly, to externally mounted store stowage and deployment systems and methods for use on aerial vehicles, such as stealth and military aircraft.
2) Description of Related Art
Store stowage and deployment systems are commonly used on stealth and military aircraft to carry and release missiles, bombs, and other weapons and materials, generally referred to as "stores". Such store stowage and deployment systems are typically mounted on an underside of the aircraft, such as on a wing pylon or within a fuselage bay.
A primary mission of stealth aircraft is typically to perform a mission, such as deploying stores, while avoiding a target's sensors, such as radar. Known stealth aircraft exist that internally stow mission stores within the aircraft in order to minimize a radar signature. However, internal carriage of stores occupies valuable aircraft volume and leads to design compromises that may affect the aircraft's performance characteristics. For example, volume reserved for internal stores may displace or reduce space for fuel, engines, avionics, or other subsystems. The design tradeoffs that result may have an impact on the aircraft performance, for example, reduced range, acceleration, and top speed. The resultant payload of the stealth aircraft may be significantly less than comparable external carriage aircraft. The stealth characteristics of an aircraft may only be needed in the presence of air defenses. Once the air defenses are neutralized, internal carriage of stores may no longer be needed and use of the stealth aircraft may be reduced in favor of higher payload, external carriage aircraft. Moreover, known internal stores or weapons bays may require a design as part of a new aircraft as it may be difficult to retrofit such internal stores or weapons bay or carriage onto an existing aircraft.
Known external store carriage systems exist for use with military aerial vehicles, such as combat aircraft, attack helicopters, and the like. However, like radar signature, such known external store carriage systems may create negative effects on the aerodynamic performance of the military aerial vehicles due to increased aerodynamic drag.
Moreover, such known external store carriage systems may be designed for a specific internal store configuration or loadout and changing the desired internal store configuration or loadout means changing to a structurally and/or mechanically different external store carriage system or structure. Finally, the internal configuration and door opening mechanisms of known external store carriage systems may not provide sufficient clearance for a store to be separately ejected without interference from the other stores if a store ejector device fails to deploy a store or there is a some other problem with a store deploying.
Accordingly, there is a need in the art for externally mounted, internally configurable store stowage and deployment devices, systems and methods that provide advantages over known devices, systems and methods.

Configurable pod structure and store stowage and deployment system and method


Disclosed is an atomic-scale processing method by combining extreme ultraviolet light and plasma. The method includes synergistically applying extreme ultraviolet (EUV) light and plasma to treat a surface of a material, enabling atomic-scale processing of the surface of the material.

The performance of components in high-tech fields such as information, energy and materials depends on their precision, and the realization of high precision requires advanced manufacturing technologies. Taking integrated circuit chips as an example, the number of transistors per unit area has been growing in accordance with Moore's Law since the 1970s, which is inseparable from the development of manufacturing technologies such as photolithography, ultra-precision machining and measurement. With the development of line width from the current 7 nm, 5 nm, to 3 nm and even smaller, the urgent need for manufacturing technologies with atomic and close-to-atomic level precision has become a natural consequence. Whether next-generation chips are based on quantum effects, photonics, biomolecular interactions, or other operating principles, the ability to add, subtract, or transfer materials at a controllable atomic scale with high efficiency for mass production is the key problem and challenge for manufacturing technologies.
While some of the existing laboratory techniques for atomic and close-to-atomic scale manipulation, such as scanning tunneling microscopy, atomic force microscopy, and scanning transmission electron microscopy, can be used to manipulate individual atoms, their extremely low efficiency prevents them from being ideal solutions for product manufacturing. For example, quantum chips require the distribution of quantum dots on an atomically flat stepped surface, and the extremely long time and resulting stability issues are unacceptable if such surface is obtained by removing atoms individually only. Therefore, mature atomic-scale manufacturing methods have not yet emerged.
Optical processing is another important class of micro and nano fabrication method and is expected to evolve into the atomic and close-to-atomic scale manufacturing techniques with high efficiency and environmental friendliness more suitable for future manufacturing. Material removal with atomic-level precision is theoretically possible as long as the effective range of action of the incident beam can be limited to the atomic layer scale. Extreme ultraviolet (EUV) light is strongly absorbed in all materials, and energy deposition occurs only at the topmost surface; further, since the single photon energy of EUV is higher than the typical value of chemical bonding energy, the EUV light can significantly change the electronic state or even directly break chemical bonds, thereby effectively suppressing the thermal effects that accompany the material removal during conventional laser processing, making it a potentially ideal waveband for atomic-scale processing. However, factors such as the stability of the light source and differences in the local environment of the material atoms may have an impact on the selectivity of the processing (e.g., planning to remove one layer of atoms, while multiple layers are actually removed). Therefore, the introduction of a self-limiting mechanism may effectively improve the ultimate accuracy and controllability of the EUV atomic layer processing technology.

Atomic-scale processing method by combining extreme ultraviolet light and plasma


The invention relates to self-adhesive addition-crosslinking silicone compositions which contain the components

1. Field of the Invention
The invention relates to self-adhesive addition-crosslinking silicone compositions and addition-crosslinked silicone elastomers and composite materials prepared therefrom.
2. Background Art
It is known that the adhesion of addition-crosslinked silicone elastomers to numerous substrates, such as plastics, metals and glasses, is poor, i.e. if an addition-crosslinking silicone elastomer material is applied to a substrate and then crosslinked, the silicone elastomer formed can, as a rule, be peeled off the substrate surface without difficulty, for example by applying only small tensile forces. Frequently, spontaneous delamination of silicone elastomers from the substrate may occur. However, since strong and permanent adhesion of the silicone elastomer to the substrate is of decisive importance in numerous applications, a large number of special measures have been proposed for achieving a strong bond between substrates and silicone elastomers.
In principle, the adhesive strength of the silicone elastomer/substrate composite can be increased by suitably changing the chemical and/or physical characteristics of the substrate, or at least its surface, prior to application of the addition-crosslinking silicone elastomer composition. This can be effected, for example, by pretreating the substrate surface with adhesion-promoting additives, so-called primers; by subjecting the substrate surface to plasma treatment; by mixing special additives into the substrate; by selectively adjusting the morphology of the substrate, for example by increasing the surface roughness, etc. These measures have, inter alia, the disadvantage that additional process steps are required or that the characteristics of the substrate have to meet special requirements.
The adhesive strength of the silicone elastomer/substrate composite can also be increased by selectively changing the chemical and/or physical characteristics of the addition-crosslinking silicone elastomer material. Numerous adhesion-promoting additives are known which promote self-adhesion of the resulting silicone elastomer to various substrates when mixed with the uncrosslinked silicone material. These include compounds which contain highly reactive functional groups, such as alkoxy, epoxy, carboxyl, amino, etc., these groups generally being chosen so that the adhesion promoter is capable of reacting both with the substrate and with a silicone elastomer component. Although incorporation of such adhesion promoters may make it possible to dispense with pretreatment of the substrate, the adhesive strength achieved frequently does not meet minimal requirements, in particular where vulcanizing temperatures are limited to less than 100xc2x0 C., important for some applications. In addition, further increases in adhesive strength by employing higher contents of these adhesion promoters is possible only to a limited extent, since the highly reactive groups borne by the adhesion promoters have an increasingly disadvantageous effect on performance characteristics such as shelf-life, crosslinking characteristics (inhibition), toxicological safety, etc. For these reasons, interest has been focused on keeping the content of adhesion promoters as low as possible.
The adhesion promoters most frequently used for self-adhesive addition-crosslinking silicone elastomers are epoxy-functional silanes such as glycidyloxypropyltrimethoxysilane; or methacrylate-functional silanes such as methacryloxypropyltrimethoxysilane; or vinyl silanes such as vinyltrimethoxysilane, or combinations thereof. The organic functional groups relevant for the buildup of composite strength, however, are too unreactive at temperatures below 100xc2x0 C. to bring about sufficient adhesion to the substrate. In the case of many important applications of self-adhesive silicone elastomers, the maximum vulcanizing temperature is limited, one example being the encapsulation of electronic circuits. The temperature-sensitive components such as coils, capacitors, and ICs, permit only very limited thermal loads without risking loss of function. Frequently, only brief heating at temperatures from 50xc2x0 C. to 80xc2x0 C. is possible.
U.S. Pat. No. 5,164,461 and European published application EP-A-451 946 describe addition-crosslinking silicone elastomers with intrinsic adhesion to the substrates that are contacted during vulcanization. The most common adhesion promoters here are epoxide- and/or methacrylate-functional alkoxysilanes. The vulcanizing temperatures are required to be at least 130xc2x0 C. Using the maleate- and fumarate-functional alkoxysilane additives claimed in U.S. Pat. No. 5,164,461, self-adhesion is achieved at crosslinking temperatures of at least 100xc2x0 C.
U.S. Pat. No. 5,595,826 describes adhesion promoters based on reaction products of aliphatically unsaturated monoalcohols or polyalcohols with organofunctional alkoxysilanes such as methacryloxypropyltrimethoxysilane or glycidyloxypropyltrimethoxysilane. Additives of this kind bring about self-adhesion of addition-crosslinking silicone elastomers at vulcanizing temperatures from 70 to 100xc2x0 C. However, high adhesive strengths are achieved exclusively with metallic and inorganic substrates, for example steel, aluminum, glass and copper.
U.S. Pat. Nos. 5,416,144 and 5,567,752 describe adhesion promoters based on reaction products of amines or aminoalkoxysilanes with methacryloxypropyl- or glycidyloxypropyltrimethoxysilane. With these additives, self-adhesion is achieved at vulcanizing temperatures from 80 to 100xc2x0 C. A problem in this case is the strong inhibition on the Pt-catalyzed crosslinking reaction caused by amine compounds, as is well known. Furthermore, contact between amine compounds and SiH components constitutes a potential risk, since formation of hydrogen gas must be expected. Moreover, due to the loss of SiH groups, undervulcanization is expected. A further disadvantage of highly polar additives of this kind is severe thixotroping of the siloxane composition and the associated reduction in fluidity.
EP-A-286 387 describes organosilicon compounds with a xcex2-keto ester function. In particular, alkoxysilanes having at least one alkyl-bonded xcex2-keto ester function are described. Numerous applications of such structures are indicated, including applications as constituents of primers for epoxy resin/glass fiber composites. EP-A-295 657 describes metal chelate complexes formed, for example, from titanium and the chelating ligand, trialkoxysilylpropylacetoacetate. Structures of this kind are claimed to be adhesion-promoting additives in epoxy resin formulations.
U.S. Pat. No. 5,041,481 describes adhesion promoters obtained by the reaction of 1,3-diketone compounds with aminoalkylalkoxy silanes. The latter are claimed, inter alia, to be additives in condensation-crosslinking silicone elastomers. It must be noted that all the adhesion-promoting additives described based on 1,3-diketone compounds necessitate complicated reactions with alkoxysilanes for attachment of alkoxysilyl functionality. Disadvantages in this context are that in some cases, highly toxic reactants such as trimethoxysilane are required. Further, owing to keto/enol tautomerism, a difficult reaction regime is created, with numerous secondary reactions such as propene elimination or reduction of the keto group by SiH groups. Distillative purification and isolation of the reaction products are possible only with massive loss of yield, owing to gellation as a result of the reaction of the enol groups of the 1,3-diketone structure with alkoxysilyl groups with elimination of alcohol. Owing to their known effect of strong inhibition of hydrosilylation, adhesion promoters based on amino-functional alkoxysilanes are of only limited usefulness in addition-crosslinking silicone elastomers.
The present invention pertains to addition crosslinking compositions containing (A), an organopolysiloxane with unsaturated hydrocarbon group functionality; (B), an Sixe2x80x94H functional crosslinker containing compatability decreasing groups; (C), an adhesion promoter containing minimally one aliphatically unsaturated hydrocarbon group and at least one xcex2-diketone or xcex2-ketoester group; and (D) a hydrosilylation catalyst. The particular combination of compatibility-reducing crosslinker (B) and adhesion promoter (C) have a synergistic effect on adhesion. The compositions exhibit excellent adhesion to a variety of substrates without the disadvantages of prior adhesion-promoting additives.
The invention thus relates to self-adhesive addition-crosslinking silicone compositions which contain:
(A) a diorganopolysiloxane of the general formula (1)
R1aR2bSiO(4-a-b)/2xe2x80x83xe2x80x83(1),
in which
R1 is a hydroxyl radical or a monovalent, optionally halogen-substituted C1-20 hydrocarbon radical optionally containing O, N, S or P atoms, and free of aliphatically unsaturated groups,
R2 is a monovalent, aliphatically unsaturated, optionally halogen-substituted C2-10 hydrocarbon radical optionally containing O, N, S or P atoms, and
b is on average from 0.003 to 2, with the proviso that 1.5 less than (a+b) less than 3.0, that on average at least two aliphatically unsaturated radicals R2 are present per molecule, and that the viscosity of the diorganopolysiloxane (A), determined at 25xc2x0 C., is 1 mPaxc2x7s to 40,000 Paxc2x7s;
(B) an organohydrogenpolysiloxane of the general formula (2)
R3cR4dR5eHfSiO(4-c-d-2e-f)/2xe2x80x83xe2x80x83(2),
in which
R3 is a monovalent aliphatically saturated C1-20 hydrocarbon radical, R4 is (a) an optionally halogen-substituted monovalent C6-15 hydrocarbon radical which contains at least one aromatic C6-ring, or
(b) a halogen-substituted, saturated monovalent C2-20 hydrocarbon radical optionally containing O, N, S or P atoms,
R5 is a bivalent, optionally halogen-substituted C6-20 hydrocarbon radical Si-bonded at both ends, optionally containing O, N, S or P atoms, and c, d, e and f denote positive numbers, with the proviso that the relationship: 0.05 less than 100 (d+e)/(c+d+e+f) less than 12 is fulfilled and that the viscosity of the organo-hydrogenpolysiloxane (B), determined at 25xc2x0 C., is 1 mPaxc2x7s to 100 Paxc2x7s;
(C) compounds containing at least one aliphatically unsaturated radical and at least one xcex2-diketone or xcex2-keto ester function, of the general formula (3):
R7xe2x80x94COxe2x80x94CHR8xe2x80x94COxe2x80x94(O)gxe2x80x94R9xe2x80x83xe2x80x83(3),
where
R7 and R9 are each an identical or different,
(a) monovalent, aliphatically unsaturated, optionally halogen-substituted C2-12 hydrocarbon radical, and optionally containing O, N, S or P atoms, or
(b) a monovalent aliphatically saturated C1-20 hydrocarbon radical,
R8 is hydrogen,
(a) a monovalent, aliphatically unsaturated, optionally halogen-substituted C2-12 hydrocarbon radical, and optionally containing O, N, S or P atoms, or
(b) a monovalent aliphatically saturated C1-20 hydrocarbon radical,
g is 0 or 1; and
(D) a hydrosilylation catalyst.
Organohydrogenpolysiloxane (B) acts as an adhesion promoter and simultaneously as a crosslinking agent.
The advantageous properties of the silicone compositions of the present invention include the fact that the self-adhesion is achieved, in part, by a component required by every addition-crosslinking material, namely the SiH-containing crosslinking agent (B), in combination with the xcex2-diketone-functional or xcex2-keto-ester-functional compound (C), it merely being necessary for the SiH crosslinking agent (B) to contain a few groups which reduce compatibility with the other components of the material, especially with the diorganopolysiloxane. These comparability reducing groups are not reactive functional groups, but are preferably phenyl groups, with the result that the toxicological safety of the material, i.e., drinking water approval, BGA/FDA approval is preserved; no vulcanization problems occur; the shelf-life is sufficient; the transparency of the crosslinked silicone elastomer is maintained; and no components which exude or are extractable are added.
The combination of the SiH crosslinking agent (B) having reduced compatibility, with a xcex2-diketone- or xcex2-keto-ester-functional, and alkenyl-functional compound (C), makes it possible, first, to keep the content of incompatible groups in the SiH crosslinking agent low, and secondly, to achieve the adhesion-promoting activity of the xcex2-diketone- or xcex2-keto-ester-functional and alkenyl-functional compound (C) even when employing SiH crosslinking agents with relatively low SiH functionality. Only the combination of the two components (B) and (C) leads to synergistic self-adhesion effects of these two components.
In particular, the present composition is distinguished by the facts that
a) adhesion to a variety of substrates, such as PBT, PA6, PA66, and PPS, as well as steel, aluminum and glass, is achieved at vulcanizing temperatures below 100xc2x0 C.;
b) the crosslinking rate is only minimally affected;
c) the transparency of the crosslinked silicone elastomers is not impaired;
d) there is no need to accept any disadvantageous changes in the mechanical elastomer properties;
e) the adhesion-promoting component (B) simultaneously acts as a crosslinking agent;
f) the fluidity of the uncrosslinked material is minimally reduced; and
g) strong self-adhesion can be achieved even on metals without hindering the deformability from metal vulcanization molds.
In the latter respect, it was found that the adhesion to metal shortly after crosslinking permits demolding of the silicone elastomer part. If, however, the silicone elastomer/metal composite is stored prior to demolding, the silicone elastomer adheres strongly and permanently onto the metal surface within a short time.
Although the adhesion-promoting component (B) of the present invention also has reduced compatibility with the other components of the material, which is evident from turbidity upon admixing, this turbidity disappears completely as soon as the material is heated for the purpose of crosslinking, indicating homogeneous distribution of the molecules of the crosslinking agent in the material at the time of crosslinking.
The second adhesion-promoting constituent, constituent (C) of the present invention, contains a xcex2-diketo function or xcex2-keto ester function. This 1,3-diketone structure is present both in xcex2-diketones and in xcex2-keto esters, such as acetoacetic esters, for example. This 1,3-diketone structure brings about an increase in adhesion at low vulcanizing temperature. Responsibility for this effect is attributed to strong dipolar interactions of the 1,3-diketo function or to hydrogen bonding of the enol form of the additive with polar groups of the substrates. The anchoring of the substrate-interacting xcex2-diketo function into the siloxane network is provided by the aliphatically unsaturated radical, which is amenable to hydrosilylation with the SiH crosslinker. The synergy of the constituents (B) and (C) is believed to reside in the migration behavior of the SiH crosslinker causing an increased concentration of the latter at the siloxane/substrate interface. This migration behavior is believed brought about by the incompatibility of the SiH crosslinker with the siloxane composition, with the result that sufficient SiH crosslinker functionality is present at the laminate interface for the incorporation of the substrate-interacting xcex2-diketo function by hydrosilylative crosslinking, this incorporation by crosslinking believed responsible for the buildup of adhesion.
Each of components (A), (B) and (C) may comprise a single compound or a mixture of different compounds. The terms xe2x80x9caxe2x80x9d and xe2x80x9canxe2x80x9d mean xe2x80x9cone or morexe2x80x9d unless indicated to the contrary.
Examples of the radicals R1 are alkyl radicals such as the methyl, ethyl, propyl, isopropyl, tert-butyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, n-octyl, 2-ethylhexyl, 2,2,4-trimethylpentyl, n-nonyl and octadecyl radicals; cycloalkyl radicals such as the cyclopentyl, cyclohexyl, cycloheptyl, norbornyl, adamantylethyl or bornyl radicals; aryl or aralkyl radicals such as the phenyl, ethylphenyl, tolyl, xylyl, mesityl or naphthyl radicals; aralkyl radicals such as the benzyl, 2-phenylpropyl or phenylethyl radicals; and those derivatives of the above radicals which are halogenated and/or functionalized with organic groups, for example the 3,3,3-trifluoropropyl, 3-iodopropyl, 3-isocyanatopropyl, aminopropyl, methacryloyloxymethyl or cyanoethyl radicals. Preferred radicals R1 contain 1 to 10 carbon atoms and optionally halogen substituents. Particularly preferred radicals R1 are the methyl, phenyl and 3,3,3-trifluoropropyl radicals, in particular the methyl radical.
The radicals R2 are obtainable by a hydrosilylation reaction. Examples of these are alkenyl and alkynyl radicals, such as the vinyl, allyl, isopropenyl, 3-butenyl, 2,4-pentadienyl, butadienyl, 5-hexenyl, undecenyl, ethynyl, propynyl and hexynyl radicals; cycloalkenyl radicals, such as the cyclopentenyl, cyclohexenyl, 3-cyclohexenylethyl, 5-bicycloheptenyl, norbornenyl, 4-cyclooctenyl or cyclooctadienyl radicals; alkenylaryl radicals, such as the styryl or styrylethyl radicals; and those derivatives of the above radicals which are halogenated and/or contain heteroatoms, such as the 2-bromovinyl, 3-bromo-1-propynyl, 1-chloro-2-methallyl, 2-(chloromethyl)allyl, styryloxy, allyloxypropyl, 1-methoxyvinyl, cyclopentenyloxy, 3-cyclohexenyloxy, acryloyl, acryloyloxy, methacryloyl or methacryloyloxy radicals. Preferred radicals R2 are the vinyl, allyl and 5-hexenyl radical, in particular the vinyl radicals.
In the case of the diorganopolysiloxanes (A) of the general formula (1), the viscosity determined at 25xc2x0 C. is preferably 100 mPaxc2x7s to 30,000 Paxc2x7s. Most preferably, the viscosity range is from 1 to 30,000 Paxc2x7s. Depending on the type of the addition-crosslinking material, different viscosity ranges are particularly preferred. Viscosities from 100 to 10,000 mPaxc2x7s are particularly preferred for the materials known as RTV-2 (two-component, room temperature vulcanizing); from 1 to 100 Paxc2x7s for LSR (liquid silicone rubber); and from 2000 to 40,000 Paxc2x7s for HTV (high temperature vulcanizing).
Examples of R3 are alkyl radicals such as the methyl, ethyl, propyl, isopropyl, tert-butyl, n-octyl, 2-ethylhexyl or octadecyl radicals, and cycloalkyl radicals such as the cyclopentyl, cyclohexyl, norbornyl or bornyl radicals. Preferred radicals R3 are hydrocarbon radicals having 1 to 10 carbon atoms. A particularly preferred radical R3 is the methyl radical.
Examples of radicals R4 (a) are the phenyl, tolyl, xylyl, biphenylyl, anthryl, indenyl, phenanthryl, naphthyl, benzyl, phenylethyl or phenylpropyl radical, and those derivatives of the above radicals which are halogenated and functionalized with organic groups, such as o-, m- or p-chlorophenyl, pentafluorophenyl, bromotolyl, trifluorotolyl, phenoxy, benzyloxy, benzyloxyethyl, benzoyl, benzoyloxy, p-tert-butylphenoxypropyl, 4-nitrophenyl, quinolinyl or pentafluorobenzoyloxy radicals.
Examples of hydrocarbon radicals R4 (b) having 2 to 20 carbon atoms are the 3-chloropropyl, 3-bromopropyl, 3,3,3-trifluoropropyl, 2-fluoroethyl, 1,1-dihydroperfluorododecyl or 2-cyanoethyl radicals. Particularly preferred radicals R4 are the phenyl radical and the 3,3,3-trifluoropropyl radical.
Preferred radicals R5 correspond to the general formula (4)
xe2x80x94(O)sxe2x80x94(R6)txe2x80x94(O)uxe2x80x94(X)w(O)uxe2x80x94(R6)txe2x80x94(O)sxe2x80x83xe2x80x83(4)
in which
s, t, u and w, independently of one another, denote the values 0, 1 or 2,
R6 may be identical or different and denote a bivalent, optionally halogen-substituted hydrocarbon radical which optionally contains O, N, S or P atoms, is free of aliphatically unsaturated aliphatic groups and contains 1 to 10 carbon atoms, such as xe2x80x94CH2-, xe2x80x94CH2xe2x80x94CH2-, xe2x80x94CH2xe2x80x94CH2xe2x80x94CH2-, xe2x80x94CF2-, xe2x80x94CH2xe2x80x94CF2-, xe2x80x94CH2xe2x80x94CH(CH3)-, xe2x80x94C(CH3)2-, xe2x80x94CH2xe2x80x94C(CH3)2-, xe2x80x94C(CH3)2xe2x80x94CH2-, xe2x80x94CH2xe2x80x94CH2xe2x80x94O- or xe2x80x94CF2xe2x80x94CF2xe2x80x94O-,
xe2x80x94(X)- denotes a bivalent radical which is selected from xe2x80x94Ph-, xe2x80x94Phxe2x80x94Oxe2x80x94Ph-, xe2x80x94Phxe2x80x94Sxe2x80x94Ph-, xe2x80x94Phxe2x80x94SO2xe2x80x94Ph-, xe2x80x94Phxe2x80x94C(CH3)2xe2x80x94Ph-, xe2x80x94Phxe2x80x94C(CF3)2xe2x80x94Ph-, xe2x80x94Phxe2x80x94C(O)xe2x80x94Ph-, cyclohexylene or norbornylene, xe2x80x94Ph- designating a phenylene group. It is preferable that s and u be 0 or 1. A particularly preferred radical R5 is the phenylene radical.
The organohydrogenpolysiloxane (B) preferably contains 5 to 50 SiH groups, in particular 8 to 25 SiH groups, per molecule. The viscosity of component (B), measured at 25xc2x0 C., is preferably 2 mPaxc2x7s to 1 Paxc2x7s. Owing to the labile nature of the SiH group, the component (B) may have a low content, typically less than 100 ppm by weight, of Si-bonded OH groups, arising, for example, from its preparation.
At least one of the radicals R7, R8 and R9 in compound (C) is aliphatically unsaturated and amenable to a hydrosilylation reaction. Examples of aliphatically unsaturated radicals (a) are alkenyl and alkynyl radicals such as vinyl, allyl, isopropenyl, 3-butenyl, 2,4-pentadienyl, butadienyl, 5-hexenyl, undecenyl, ethynyl, propynyl and hexynyl radicals; cycloalkenyl radicals such as cyclopentenyl, cyclohexenyl, 3-cyclohexenylethyl, 5-bicycloheptenyl, norbornenyl, 4-cyclooctenyl or cyclooctadienyl radicals; alkenylaryl radicals such as styryl or styrylethyl radicals, and also halogenated and heteroatom-containing derivatives of the aforementioned radicals, such as vinyloxy, allyloxy, 5-hexenyloxy, 2-bromovinyl, 3-bromo-1-propynyl, 1-chloro-2-methylallyl, 2-(chloromethyl)allyl, styryloxy, allyloxypropyl, 1-methoxyvinyl, cyclopentenyloxy, 3-cyclohexenyloxy, adryloyl, acryloyloxy, methacryloyl or methacryloyloxy radicals. Preferred aliphatically unsaturated radicals are vinyloxy, allyloxy and 5-hexenyloxy radicals, especially the allyloxy radical.
Examples of aliphatically saturated hydrocarbon radicals R7, R8 or R9 (b) are alkyl radicals such as methyl, ethyl, propyl, isopropyl, tert-butyl, n-pentyl, isopentyl, neopentyl, tert-pentyl, n-octyl, 2-ethylhexyl, 2,2,4-trimethylpentyl, n-nonyl and octadecyl radicals; cycloalkyl radicals such as cyclopentyl, cyclohexyl, cycloheptyl, norbornyl, adamantylethyl or bornyl radical; aryl or alkaryl radicals such as phenyl, ethylphenyl, tolyl, xylyl, mesityl or naphthyl radicals; aralkyl radicals such as benzyl, 2-phenylpropyl or phenylethyl radicals, and also halogenated or heteroatom-containing derivatives, or derivatives of the aforementioned radicals functionalized with organic groups. Preferred radicals contain 1 to 10 carbon atoms and also, if desired, halogen substituents. Preferred aliphatically saturated radicals are methyl, ethyl, propyl, and butyl radicals. The methyl radical is a particularly preferred radical.
Examples of the radical R8, furthermore, are hydrogen, or an aliphatically unsaturated or aliphatically saturated radical as defined above. A preferred radical R8 is hydrogen.
In the general formula (3), g is preferably 1, i.e., compound (C) is a keto ester. A particularly preferred compound (C) is allyl acetoacetate.
The radicals R1 to R9 in all above formulae may be identical or different. Preferred heteroatoms are N, O and S. Preferred halogen substituents are F, Cl and Br.
Preferably 0.1 to 50 parts by weight, more preferably 0.5 to 10 parts by weight of organohydrogenpolysiloxane (B), and 0.1 to 10 parts by weight, more preferably 0.3 to 3 parts by weight of compound (C) are used per 100 parts by weight of diorganopolysiloxane (A).
The hydrosilylation catalyst (D) serves as a catalyst for the addition reaction, termed hydrosilylation, between the aliphatically unsaturated hydrocarbon radicals R2 of the diorganopolysiloxanes (A) and the silicon-bonded hydrogen atoms of the organohydrogenpolysiloxanes (B). Numerous suitable hydrosilylation catalysts are described in the literature. In principle, all hydrosilylation catalysts corresponding to the prior art and used in addition-crosslinking silicone rubber materials can be used.
Metals and their compounds such as platinum, rhodium, palladium, ruthenium and iridium, preferably platinum, can be used as hydrosilylation catalysts (D). The metals can optionally be fixed on finely divided support materials, such as active carbon, metal oxides, such as alumina, or silica.
Platinum and platinum compounds are preferably used. Particularly preferred platinum compounds are those which are soluble in polyorganosiloxanes. The soluble platinum compounds used may be, for example, the platinum-olefin complexes of the formulae (PtCl2xc2x7olefin)2 and H(PtCl3xc2x7olefin), with preference given to alkenes having 2 to 8 carbon atoms, such as ethylene, propylene, isomers of butene and of octene, or cycloalkanes having 5 to 7 carbon atoms, such as cyclopentene, cyclohexene and cycloheptene. Additional soluble platinum catalysts are the platinum-cyclopropane complexes of the formula (PtCl2C3H6)2, the reaction products of hexachloroplatinic acid with alcohols, ethers and aldehydes and mixtures thereof, or the reaction product of hexachloroplatinic acid with methyl-vinylcyclotetrasiloxane in the presence of sodium bicarbonate in ethanolic solution. Platinum catalysts with phosphorous, sulfur and amine ligands may also be used, e.g. (Ph3P)2PtCl2. Complexes of platinum with vinylsiloxanes, such as symdivinyltetramethyldisiloxane, are particularly preferred.
The amount of hydrosilylation catalyst (D) used depends on the desired crosslinking rate and economic considerations. Preferably 1xc3x9710xe2x88x925 to 5xc3x9710xe2x88x922 parts by weight, in particular 1xc3x9710xe2x88x923 to 1xc3x9710xe2x88x923 parts by weight of platinum catalysts, calculated as platinum metal, are used per 100 parts by weight of diorganopolysiloxanes (A).
The self-adhesive addition-crosslinking silicone compositions can optionally contain further components (E), such as fillers, inhibitors, stabilizers, pigments and catalysts. For the buildup of cohesive adhesion on aluminum and steel substrates, the further addition of organotitanium or organozirconium compounds such as titanium tetrabutylate or zirconium tetrabutylate, for example, is particularly preferred.
In order to achieve sufficiently high mechanical strength of the crosslinked silicone rubber, it is preferable to incorporate actively reinforcing fillers as component (F) into the addition-crosslinking silicone compositions. The actively reinforcing fillers (F) used are in particular precipitated and pyrogenic silicas, and mixtures thereof. The specific surface area of these actively reinforcing fillers should be at least 50 m2/g, and preferably in the range from 100 to 400 m2/g determined according to the BET method. Such actively reinforcing fillers are very well known materials in the area of silicone rubbers.
The compounding of the self-adhesive addition-crosslinking silicone compositions is effected by mixing the abovementioned ingredients in any desired sequence. The crosslinking of the self-adhesive addition-crosslinking silicone compositions is preferably effected by heating, preferably at 30xc2x0 C. to 250xc2x0 C., preferably between 50xc2x0 C. and 80xc2x0 C.
The invention also relates to the addition-crosslinked silicone elastomers prepared from the crosslinkable compositions. The silicone compositions can be bonded to a substrate by applying the silicone compositions to the substrate and then crosslinking them, preferably by heating to 30 to 250xc2x0 C., to give a composite material.
The self-adhesive addition-crosslinking silicone composition can advantageously be used, in particular, where good adhesive strength between the addition-crosslinked silicone elastomer and a substrate, preferably consisting of organic plastics, ie id metals or glasses is desired and the vulcanizing temperature is limited to temperatures of not more than 100xc2x0 C., in particular not more than 80xc2x0 C. The substrate may be present as a shaped article, film or coating.
The self-adhesive addition-crosslinking silicone compositions are suitable for the production of composite materials by coating, adhesive bonding or casting and for the production of shaped articles. The self-adhesive addition-crosslinking silicone compositions are particularly suitable for casting and for adhesively bonding electrical and electronic parts and for the production of composite shaped articles. Composite shaped articles are understood here as meaning a uniform shaped article comprising a composite material which is composed of a silicone elastomer part produced from the silicone compositions and at least one substrate, so that there is a strong, permanent bond between the two parts. Such a composite shaped article is preferably produced by processing an organic plastic to give a shaped article and then bringing the silicone compositions into contact with this shaped article and crosslinking them, which can be effected, for example, by the injection molding method, by means of extrusion and in the so-called press-molding method. Composite materials and in particular composite shaped articles can be used in a very wide range of applications, for example in the electronics, household appliances, consumables, construction and automotive industry, in medical technology, in the production of sport and leisure articles, etc.

Self-adhesive addition-crosslinking silicone compositions

Abstract: (A) diorganopolysiloxanes having aliphatic unsaturation,

Abstract: (B) organohydrogenpolysiloxanes bearing compatability decreasing substituents,

Abstract: (C) compounds having at least one aliphatically unsaturated radical and at least one xcex2-diketone function or xcex2-keto ester function and

Abstract: (D) a hydrosilylation catalyst. The compositions are cost effective, and exhibit excellent adhesion to both metallic and non-metallic substrates while maintaining other desirable physical properties.