Optoelectronic composite consisting of two chips, the first chip 10 being made of a first material, the second one 13 being made of another material. The first chip 10, for example, comprises a multiplicity of active optoelectronic devices e.g. a laser diode 11 and a photo diode 12, all being monolithically integrated. A multiplicity of other optical devices, e.g. a waveguide 16, is monolithically integrated on the second chip 13. In addition this second chip 13 has depressions of the size of the devices 11,12 integrated on said first chip 10. These devices and the waveguide 16 of the second chip 13 are automatically aligned when flipping both chips together.

Similar to the increasing packaging density in the field of conventional semiconductor devices, which started from single elementary devices, as e.g. diodes and transistors, and has now reached a point where thousands of very small components are three-dimensionally integrated on one chip, the integration of optoelectronic components becomes more and more important. The trend in optoelectronics is towards integration of active optoelectronic devices, passive optical waveguide devices, and functional optical waveguide devices to form complete optoelectronic units such as for example optical heads for optical disks, optical multi/demultiplexers, and circuits for optical computers. Through the optoelectronic integration, a more compact, stable, and functional optical system can be achieved.
OptoElectronic Integrated Circuits (OEICs), also known as Optical Integrated Circuits (OICs), are divided into two main types from the standpoint of materials. When all components of the circuit are integrated on a single substrate, such as Si, GaAs or InP, the type of integration is called monolithic optoelectronic integrated circuit. A typical monolithic optoelectronic integrated circuit with GaAs laser diode 7 and photodiode 8, integrated on a GaAs substrate 5 with planar waveguide 6, is shown in FIG. 1 a). Typical monolithically integrated lasers and other components are described in the article "Integrated Optics Approach for Advanced Semiconductor Lasers", of Y. Suematsu et al., Proceedings of the IEEE, Vol. 75, No. 11, November 1987, pp. 1472-1487. Other examples for the monolithic integration of GaAs components on a Si substrate are given in the U.S. Pat. Nos. 4,890,895, and 4,774,205.
When the components are made of different materials and then bonded together, this is called a hybrid optoelectronic integrated circuit. For example, in a hybrid optical IC, as illustrated in FIG. 1 b), laser diode 3 is made of aluminum gallium arsenide (AlGaAs), the detector-diode 4 of silicon (Si), and the planar waveguide 2, grown on substrate 1, of lithium niobate (LiNbO.sub.3).
Although the monolithic-type OEIC is ideal as an OEIC, implementation is very difficult at present. While the performance of monolithically integrated GaAs components on Si substrates, see U.S. Pat. No. 4,890,895, is good, these components have not yet reached the quality of those fabricated using GaAs substrates. Since typical OEICs consist of a number of different optical components no one substrate material will be optimum for all of them. Thus, a compromise must be made.
The hybrid type, on the other hand, is relatively easy to fabricate, but there is a problem with assembling the basic components. Packaging and alignment of these components is time consuming and expensive. Nevertheless, the hybrid optoelectronic ICs have the great advantage in that what are currently the most appropriate materials and processing techniques for each device can be utilized. Because of these advantages, hybrid integrated optoelectronic circuits will be subject of intensive research and development.
Different hybrid optoelectronic packages are known in the art, where one or more optical fiber(s) is/are connected to an optoelectronic component or waveguide. A silicon chip coupling concept is reported on in the article "Permanent Attachment of Single-Mode Fiber Arrays to Waveguides", of E. J. Murphy et al., IEEE Journal of Lightwave Technology, Vol. LT-3, No. 4, August 1985, pp. 795-798. The coupling concept, described by E. J. Murphy, is based on a silicon chip having V-grooves for mounting a bundle of parallel single-mode fibers. The polished end facets of these fibers are butt-coupled to a substrate with waveguides, using optical cement. H. Kaufmann et al. describe in their article "Self-Adjusted Permanent Attachment of Fibers to GaAs Waveguide Components", published June 1986 in Electronics Letters, Vol. 22, No. 12, pp. 642-644, an alignment scheme for aligning optical fibers to a GaAs chip. This alignment scheme, called V-groove flip-chip mounting technique, is characterized in that two fibers and the GaAs chip are mounted on a substrate with V-groove, the alignment being achieved by moving the fibers towards the chip along this V-groove.
Another principle for the alignment of waveguides and/or fibers to optoelectronic components is reported on in the U.S. Pat. No. 4,892,374. As therein described, an optoelectronic component, e.g. a light emitting diode (LED), is bonded in a recessed part of a substrate such that its light emitting facet is coupled to a waveguide being integrated on this substrate. In the article "Multi-Waveguide/Laser Coupling", of E. B. Flint et al., IBM Technical Disclosure Bulletin, Vol. 31, No. 10, March 1989, pp. 384-386, a hybrid package is disclosed comprising fibers carried by a silicon alignment fixture. For lateral and axial alignments, grooves are formed in the top surface of the laser array which has to be coupled to the array of fibers, and in the alignment fixture. This package allows self-alignment of an array of lasers to an array of fibers. Another passive alignment scheme is described in the publication "Passive Coupling of InGaAsP/InP Laser Array and Singlemode Fibers using Silicon Waferboard", of C. A. Armiento et al., Electronics Letters, Vol. 27, No. 12, June 1991, pp. 1109-1111. A laser array is aligned to an array of fibers by providing for an integration platform with alignment pedestals and standoffs on a substrate with V-grooves in which the fibers are situated.
Some disadvantages of the different hybrid alignment schemes cited above are their cost and time intensive manufacturing and the non-efficient coupling. Another disadvantage is the difficult handling of the small components like lasers and other diodes which have to be precisely bonded to the substrate. The alignment problems are not known in the area of monolithically integrated circuits because the active-, passive-, and functional waveguide-devices are automatically aligned by using special photolithographic masks, with the drawback on the other hand, that all different components have to be made out of the same material.
These known approaches do not allow for an efficient integration of multiple components, waveguides and fibers. No prior art is known, relating to simultaneous and self-adjusting alignment schemes for hybrid integration of multiple active optoelectronic devices, functional optical waveguide devices, and passive optical waveguide devices.

Bilithic composite for optoelectronic integration


A multi-configuration mounting system has been disclosed. The multi-configuration mounting system comprises an adapter configured to couple to a first device, and a receptacle defining an opening within a surface of the adapter. The receptacle receives a tab of a clip housing that secures a second device, thereby forming an interference fit between the tab and the receptacle to couple the second device to the first device via the adapter.

Cameras, camera accessories, and other devices can be mounted to a variety of surfaces and structures. Typical mounts are limited in terms of interchangeability (e.g., only being able to receive devices using one type of coupling mechanism) and do not provide easy and seamless usage of the devices. In certain situations, such as when using multiple devices to capture various footage, it is desirable to be able to easily secure and remove the devices for usage. The present disclosure addresses such a need.


The present invention has an object to provide piezoelectric ceramics containing no lead, having a high Curie point, and further, having excellent piezoelectric properties, particularly large Qmax. The piezoelectric ceramics contain, as a main component, a bismuth layer-structured compound having (MII1-xLnx)Bi4Ti4O15 crystals (MII is an element selected from Sr, Ba, and Ca, Ln is an element selected from lanthanoids, and x is within a range of 0<x≦0.5) and further contain, as secondary components, at least one of Mn oxide and Co oxide, and lanthanoid, wherein the lanthanoid being the secondary component is contained within a range of 0.02 to 0.12 wt % in terms of oxide thereof.

Piezoelectric ceramics have been widely used not only in a field of electronic devices such as resonators and filters, but also in products and the like such as sensors and actuators that use electric charge and displacement.
The conventional piezoelectric ceramics are generally ferroelectrics having a perovskite structure, such as lead titanate zirconate of the tetragonal system or trigonal system (PbZrO3-PbTiO3 solid solution, hereinafter referred to as PZT), or lead titanate of the tetragonal system (PbTiO3, hereinafter referred to as PT). By adding secondary components to these materials, there have been obtained ones having various piezoelectric properties.
However, many of these PZT-based or PT-based piezoelectric ceramics have Curie points of about 200 to 400° C. and thus become paraelectrics at higher temperatures to lose the piezoelectric properties thereof so that they can not be applied to usage at high temperatures, for example, nuclear reactor control sensors and the like. Further, the foregoing PZT-based or PT-based piezoceramics contain about 60 to 70 wt % lead oxide (PbO) and therefore are not preferable also in terms of ecology and prevention of environmental pollution.
In order to meet such a demand, there is disclosed, as piezoelectric ceramics having a high Curie point and containing no lead oxide at all, for example, a piezoelectric ceramic element using a piezoelectric ceramic composition containing SrBi4Ti4O15 as a main component and further containing at least one of Sc and Y in a range of 0.1 mol or less relative to 1 mol Bi in the main component (Unexamined Patent Publication No. 2001-172078).
Further, there are disclosed piezoelectric ceramics composed of a bismuth layer-structured compound containing (SrxLn1-x)Bi4Ti4O15 crystals (Unexamined Patent Publication No. 2000-143340), and piezoelectric ceramics composed of a bismuth layer-structured compound containing MIIBi4Ti4O15 crystals (MII is an element selected from Sr, Ba, and Ca) (Unexamined Patent Publication No. 2001-192267).
Here, in case of a resonator, since it is used as an inductor, there are required piezoelectric ceramics in which Qm (mechanical quality factor), one of important properties in the piezoelectric properties, or Qmax (maximum value of Q=tan θ, θ:phase) between a resonant frequency and an antiresonant frequency, is large.
However, with respect to the piezoelectric ceramic element disclosed in Unexamined Patent Publication No. 2001-172078, there has been a problem that although an electromechanical coupling coefficient kt and a resonant frequency temperature change rate frTC from −20° C. to 80° C. are improved, the foregoing Qmax is insufficient and therefore it does not have the sufficient piezoelectric properties applicable to the resonator.
On the other hand, the piezoelectric ceramics disclosed in Unexamined Patent Publication No. 2000-143340 or Unexamined Patent Publication No. 2001-192267 have large Qmax, but demands have been made for ones having larger Qmax as piezoelectric ceramics using thickness longitudinal vibration.


Microfluidic, electrochemical devices are described. The microfluidic, electrochemical device comprises one or more electrode(s) on a substrate and a patterned porous, hydrophilic layer having a fluid-impermeable barrier which substantially permeates the thickness of the porous, hydrophilic layer and defines boundaries of one or more hydrophilic channels within the patterned porous, hydrophilic layer, wherein the hydrophilic channel(s) comprises a hydrophilic region which is in fluidic communication with the electrode(s). In some embodiments, the electrodes comprise a working electrode, a counter electrode, and a reference electrode. In some embodiments, the microfluidic, electrochemical device further comprises a fluid sink. The method of assembling the microfluidic, electrochemical device is described. The method of using the device for electrochemical analysis of one or more analytes is also described.

The disclosed subject matter relates generally to microfluidic devices.
In recent years, microfluidic systems have attracted increasing interests due to their diverse and widespread potential applications. For example, using very small volumes of samples, microfluidic systems could carry out complicated biochemical reactions to acquire important chemical and biological information. Among other advantages, microfluidic systems reduce the required amount of samples and reagents, shorten the response time of reactions, and decrease the amount of biohazard waste for disposal.
First developed in the early 1990s, microfluidic devices were initially fabricated in silicon and glass using photolithography and etching techniques adapted from the microelectronics industry. Current microfluidic devices are constructed from plastic, silicone, or other polymeric materials, e.g. polydimethylsiloxane (PDMS). Such devices are generally expensive, inflexible, and difficult to construct.
Electrochemical analysis involves methods of measuring the potential and/or current of a fluidic sample containing analytes, which is widely used in the medicinal field or in environmental studies. Electrochemical analysis usually utilizes sophisticated instruments and is conducted by specially-trained technicians. However, for use in developing countries, in the field, or in-home heath-care settings, there remains a need for analytical devices that are inexpensive, portable, and easy to construct and use.

President and Fellows of Harvard College


An information processing apparatus includes a storage for storing a plurality types of software licenses in association with a number of possessed licenses, a product type of a software product, and a device specification condition, a receiver for receiving information of a software product operating in a management target device and information of a device specification of the management target device, a determining module for determining a software license to be assigned to the management target device based on the number of possessed licenses, a number of the product types, or the device specification condition, when there is a plurality of software licenses, in which the software product is included in the product type and the device specification meets the device specification condition, among the plurality types of software licenses, and an assigning module for assigning a software license determined by the determining module to the management target device.

Generally, a software license defines a product usable by the license, a device specification condition relating to a specification of a management target device, such as a personal computer and a server device, in which the license can be assigned, and the like. Thus, even when a license is acquired for software that operates in a specific management target device, the license sometimes cannot be assigned to the management target device depending on a device specification condition or the like defined for the license.
A software license management device is disclosed that outputs a use state relating to overs and shorts of the number of software licenses or additional purchase information of the number of the software licenses. This software license management device automatically collects inventory information including software actually installed in computers in an organization. The software license management device calculates overs and shorts of the number of software licenses from a difference between the number of software licenses that the organization possesses and the number of software licenses that are actually used (see Japanese Laid-open Patent Publication No. 2001-222424).
Further, a software license management system is disclosed, that sorts software licenses into groups according to versions thereof and calculates the number of overs and shorts of the software licenses in each group. This software license management system manages software licenses including a downgrade right (see Japanese Laid-open Patent Publication No. 2006-92317).
Further, a license management device is disclosed, that manages software licenses for a server computer in which a virtual machine is established. This license management device determines whether software is used more than the number of obtained licenses when a licensing unit of the software is based on physical information of a server computer (see Japanese Laid-open Patent Publication No. 2012-208752).

Information processing device, license assignment method, and computer-readable, non-transitory medium


A high-resolution apparatus and method provide direct digital measurement of electrical properties such as resistance, capacitance or inductance. An excitation signal derived from a high-frequency source is applied to a network containing an unknown device to produce a network output signal with an amplitude that corresponds to the electrical property to be measured. Amplitude variations in the network output signal are converted to corresponding phase variations in a third signal by adding the network output signal to a reference signal that is phase shifted by 90-degrees with respect to the excitation. The third signal is then applied to a phaselocked loop that employs the above-mentioned high-frequency source in combination with a pulse delete circuit to produce an output that multiplies phase information contained in the third signal by orders of magnitude. Conventional methods can then be used to measure the resulting greatly magnified phase changes corresponding to minute changes in the electrical properties of the device under test.

The present invention is concerned with measurement of physical phenomena, properties or conditions such as values of resistance, capacitance or inductance, for example, and is more particularly concerned with apparatus and methods for direct digital measurement of minute changes in electrical properties that correspond to changes in related physical phenomena such as mechanical strain, displacement or temperature, for example.
Strain gages and resistive temperature sensors are inexpensive and have been widely used for decades for mechanical design, test and measurement. Various configurations of strain gages are widely employed to measure pressure, weight, torque and mechanical displacement in addition to the direct measurement of strain in engineering design and test. Far more widespread use of such sensors for monitoring, detection and warning of conditions that could, for example, indicate an impending failure has been impeded by the cost, and, to some extent, the size and complexity, of electronics required to convert resistance values to useful measurements. Similar considerations have also limited more extensive use of capacitance and inductance sensors.
Measurements of physical phenomena that produce resistance or reactance changes typically employ a four-element Wheatstone bridge comprising a combination of one or more sensor elements with fixed-value passive components. Such a network is termed a quarter-, half- or full-bridge configuration depending upon whether one, two or all four of the elements are sensors. The Wheatstone bridge configuration is ideal for maximizing measurement sensitivity. This is accomplished by selecting component values to provide zero output for the unstressed or no-load condition, allowing the bridge output signal to be greatly amplified.
In the prior art, a precisely-controlled, fixed DC voltage is applied to the Wheatstone bridge or other network containing the sensing elements. The output is then amplified, with additional circuitry employed to cancel DC offset errors introduced by the amplifier circuits. The amplified DC analog signal is then applied to an analog-to digital converter to obtain a digital output. This approach involves considerable cost and complexity and is susceptible to errors due to lead length, noise pickup and other error sources such as ambient temperature variations.
It is often required to measure outputs from multiple independent sensors, either simultaneously or in a repeating sequence. Prior art teaches the use of analog multiplexers, sample-and-hold circuits, together with associated control circuits such as scan, trigger, and address decode to implement such multi-channel systems. This additional cost and complexity further limits more widespread use of low-cost passive sensors.
It is accordingly an object of the present invention to provide an apparatus and method for precise, high-resolution direct digital measurement of phenomena which produce changes in electrical properties such as resistance, capacitance and inductance.
Another object of the invention to provide an apparatus and method of the above-described type capable of multiple independent, simultaneous measurements using a single reference oscillator and logic device.
Another object of the invention is to minimize noise sensitivity in an apparatus and method of the above-described type by employing synchronous detection of low-frequency sensor signals to achieve extremely narrow noise bandwidth.
Another object of the invention to provide an apparatus and method of the above-described type which is low in cost.
Another object of the invention is to minimize errors due to temperature and voltage variations in an apparatus and method of the above-described type through the use of excitation and reference signals derived from a common source.
It is a further object of the invention is to eliminate the need for DC offset correction by employing AC excitation.
Briefly stated, the present invention provides high-accuracy, high-resolution apparatus, systems and methods that employ phase shifts in a fixed-frequency signal for measurement of electrical properties such as capacitance, inductance or resistance.
In accordance with a preferred embodiment of the invention, two sinusoidal signals of identical frequency and 90 degrees out of phase are generated from a single reference oscillator. One is designated xe2x80x9cexcitation,xe2x80x9d the other, xe2x80x9creference.xe2x80x9d
The excitation signal is applied to a network such as a Wheatstone bridge comprising both fixed-value components and one or more sensing elements. The values of the bridge components are preferably selected to provide minimum voltage output when the sensing elements are unstressed and an output level (amplitude) proportional to stress applied to the sensing elements when a stress such as a force or temperature change is applied.
The output of the bridge is amplified and then applied as one input to a summing amplifier, the other input being the above-described reference signal. All signal levels are constrained to remain within the linear range of amplifier circuitry employed.
As the amplified output of the Wheatstone bridge ranges from zero to a maximum amplitude equal to that of the reference signal, the phase xcex8 of the summing amplifier output with respect to the reference signal will vary from 0xc2x0 to 45xc2x0.
High-resolution measurement of xcex8 is accomplished by applying the summing amplifier output to a unique phaselocked loop mechanization to produce a loop output signal that multiplies phase changes in the summing amplifier output by orders of magnitude. In the loop, the input from the summing amplifier and the loop feedback signal are applied to a phase detector, the output of which is used to produce a loop output signal at a frequency that is a multiple of the summing amplifier input frequency. The loop output signal is used to delete pulses from the reference oscillator signal, which is at a much higher frequency than the loop output signal. The output of the pulse delete circuit is then applied to a divider, the output of which is equal in frequency to the summing amplifier input signal. The result of this arrangement is that phase changes in the summing amplifier input to the loop are multiplied in the loop output by the same constant used to divide down the output of the pulse delete circuit.
The loop output signal is then compared with a signal at the same frequency derived from the reference oscillator using logic that converts cycle slips between the two signals into up/down counts. The resulting up/down counts can then be directly applied to an indicating device, recorder or to a microprocessor or microcontroller.

Apparatus and method for direct digital measurement of electrical properties of passive components

c/o Recognition Systems, Inc. 1520 S. Delaware Pl.


In a first aspect of the disclosure, a monument is shown having a movable element mounted in an opening therein for displaying information. The movable element may be partially or fully recessed in the opening but is constructed so as to be accessible for manual movement to change the information displayed. In a second aspect of the dislosure, a columbarium niche structure is shown having a movable element positioned behind an opening in a door. The movable element is preferably recessed so that no portion thereof extends beyond the front face of the door, but is constructed so as to be accessible for manual movement to change the information displayed. An adjustment system is provided for aligning the movable element with the door opening, and a bearing system is used to facillitate movement of the movable element. In a third aspect of the disclosure, grave markers, columbarium niches and monuments are shown which display both text information and imprinted images made by casting a shape, such as a body part of a deceased individual. In a fourth aspect of the disclosure, a flush mounted metallic grave marker displays summary information about a deceased individual and includes additional structure for displaying more detailed information which cannot be readily formed on the surface of the metallic marker.

A first aspect of this invention pertains to grave monuments containing components that perform an information-bearing or decorative function rather than a structural function. Grave monuments which contain non-structural elements are well known to those skilled in the art. Thus, by way of illustration and not limitation, reference may be had to U.S. Pat. No. D259,369 of Splendora (which discloses a transparent monument containing a decorative object within it), U.S. Pat. No. D310,419 of Morvant (which discloses a permanent photographic memorial marker), and U.S. Pat. No. 3,938,286 of Mochinski (which discloses a grave marker comprised of a LUCITE (TM) block), U.S. Pat. No. 3,962,836 of Carnes et al. (which discloses a grave marker with a transparent cover), U.S. Pat. No. 4,058,940 of McBrayer (which discloses a monument marker comprised of a clear plastic outer laminate), U.S. Pat. No. 4,202,144 of Patterson (which discloses a cemetery monument), U.S. Pat. No. 4,227,325 of Whitford (which discloses a grave marker comprised of a cylindrical chamber within which is mounted a picture), U.S. Pat. No. 4,259,381 of Narita (which discloses an ornament for burial monuments which contains a transparent body), U.S. Pat. No. 4,304,076 of Splendora (which discloses a transparent monument), U.S. Pat. No. 4,337,109 of Narita (which discloses a process for preparing a burial ornament), U.S. Pat. Nos. 4,428,168 and 4,428,169 of Tomer (which disclose a permanent floral decoration for use on grave sites), U.S. Pat. No. 4,550,537 of Smith (which discloses a grave monument), and the like. The disclosure of each of these United States patents is hereby incorporated by reference into this patent application.
To the best of applicant's knowledge, very few of the prior art publications relating to monuments disclose monuments with one or more movable elements affixed to them. Disclosures of such monuments may be found in U.S. Pat. No. 4,455,772 of Miller (which discloses a monument comprised of a sliding transparent panel), U.S. Pat. No. 4,463,527 of Schlosser (which discloses a grave marker with a removable cover), and U.S. Pat. No. 5,014,472 of Svensson (which discloses a tombstone with a openable inscription plate).
None of the prior art references discloses a monument with a movable element which can, at the option of the visitor, display selected portions of a relatively large amount of text information.
To the best of applicant's knowledge, there are also no prior art publications that disclose information-bearing elements for monuments that display other than text information or sculpted relief images.
It is an object of this invention to provide a monument with a rotatable element.
It is another object of this invention to provide a monument with a movable element which can display a relatively large amount of information such as text.
It is another object of this invention to provide a monument with an interactive movable element which requires a visitor to move such element to have all of its contents fully disclosed to him or her.
It is another object of this invention to provide a monument with a movable element, which contains a substantially large amount of usable information-bearing surface area.
A second aspect of this invention pertains to columbariums. Columbariums provide long term storage for urns holding cremated human remains. Typical columbariums are disclosed, e.g., in U.S. Pat. Nos. 4,614,066 and 5,195,812.
Columbariums generally have a number of small holding chambers, also known as niches, which each hold an urn and sometimes more than one urn. The niches are generally arranged in banks and with stone facing added to create a dignified appearance.
To the best of applicant's knowledge, none of the prior art publications relating to columbariums disclose columbariums with one or more movable elements affixed to them. Nor does the prior art disclose columbariums with one or more movable elements that are recessed so as not to extend beyond the front face of the columbarium.
It is an object of this invention to provide a columbarium with a rotatable element.
It is a further object of this invention to provide a columbarium with a rotatable element that is recessed so as not to extend beyond the front face of the columbarium.
A third aspect of the invention pertains to monuments, markers and columbariums which display non-verbal information. Such structures are known in the art but the non-verbal indicia are usually formed as sculpted relief images.
It is an object of this invention to provide monuments, markers and columbariums that display non-verbal imprinted images made by casting a shape.
It is a further object of this invention to provide monuments, markers and columbariums that display imprinted images made by casting body parts such as hands, feet, etc. of a deceased individual.
A fourth aspect of this invention pertains to metallic markers such as those that are designed to mount flush to the ground. A limitation of prior art designs is that only a limited amount of information can be cast into such markers do to the nature of the casting process.
It is an object of this invention to provide an improved metallic marker that is adapted for displaying both summary information and more detailed information than would be possible using prior art casting techniques.

Monuments, markers and columbariuims with improved display indicia


Systems and methods of providing test result management are disclosed herein. A first configuring command to trace a test event data stream can be received. The test event data stream comprises test messages produced from execution of a test application. A second configuring command to trace a debug event data stream can be received. The debug event data stream includes debugging messages produced from execution of a tested application. A third configuring command to trace an execution event data stream can be received. The execution event data stream includes function invocation messages produced from execution of the tested application. The test event data stream, the debug event data stream, and the execution event data stream can be received and interleafed into a collated data stream log.

As computer systems become more complex, testing of newly developed code, or introduced fixes to computer code, must be tested accurately, with sufficient coverage, and efficiently. Test result management is generally left to the individual tester's discretion, thus allowing the tester to implement tester-specific tracking of information about the test process. Software test coverage of a multi-component and multi-tester scenario is complex.


An electrically programmable reticle is made using at least one electrochromatic layer that changes its optical transmissibility in response to applied voltages. Transparent conductor layers are configured to the desired patterns. The electrically programmable reticles are either patterned in continuous forms that have separately applied voltages or in a matrix of rows and columns that are addressed by row and column selects such that desired patterns are formed with the application of a first voltage level and reset with the application of a second voltage level.

In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties. Deposition is any process that grows, coats, or otherwise transfers a material onto the wafer. Available technologies consist of physical vapor deposition (PVD), chemical vapor deposition (CVD), electrochemical deposition (ECD), molecular beam epitaxy (MBE) and more recently, atomic layer deposition (ALD) among others. Removal processes are any that remove material from the wafer either in bulk or selective form and consist primarily of etch processes, both wet etching and dry etching such as reactive ion etch (RIE). Chemical-mechanical planarization (CMP) is also a removal process used between levels. Patterning covers the series of processes that shape or alter the existing shape of the deposited materials and is generally referred to as lithography. For example, in conventional lithography, the wafer is coated with a chemical called a "photoresist." The photoresist is exposed by a "stepper," a machine that focuses, aligns, and moves the mask, exposing select portions of the wafer to short wavelength light. The unexposed regions are washed away by a developer solution. After etching or other processing, the remaining photoresist may be removed by plasma ashing.
Semiconductor manufacturing entails the formation of various patterns on wafers. These patterns define the structure of and interconnection between the different components and features of the integrated circuit. The patterns are formed on wafers using patterning tools known as masks and reticles.
A mask is defined as a tool that contains patterns which can be transferred to an entire wafer or another mask in just a single exposure. A reticle is defined as a tool that contains a pattern image that needs to be stepped and repeated in order to expose the entire wafer or mask. Reticles have two major applications: 1) printing of images directly onto wafers in equipment known as step-and-repeat aligners; and 2) printing of images onto masks which, in turn, transfer the images onto wafers. The patterns on a reticle are usually 2× to 20× the size of the patterns on the substrate. However, some reticle patterns are 1× the substrate pattern.
The equipment used for printing patterns on substrates that are smaller than the patterns on the reticles is also referred to as a 'reduction stepper', while one that's used for printing equal-size patterns is known as a 1× stepper. The 'polarity' of a mask or reticle can either be positive or negative. A positive mask or reticle has background areas (or fields) that are clear or transparent, which is why a positive mask or reticle is also known a 'clear-field' tool. A negative mask or reticle has fields that are opaque, which is why a negative mask or reticle is also known a 'dark-field' tool.
There are many ways by which a pattern may be transferred to a wafer using a mask, a reticle, or a combination of both. Regardless of the pattern transfer process, everything starts with a set of pattern data that are converted into an actual pattern by a 'pattern generator.' Commonly-used pattern generators include: 1) plotters; 2) optical pattern generators; and 3) electron beam pattern generators.
The patterns generated by the pattern generators are formed on either a mask or reticle. For example, plotter-generated patterns can be photo-reduced and formed on 10× emulsion reticle, while optically generated patterns can be formed on 5-20× hard-surface reticles. E-beam generated patterns can be formed on a 5-10× reticle, a 1× reticle, a 1× hard surface mask, or even directly to the wafer.
The patterns formed on a reticle can be transferred directly onto the wafer, or they may first go to a mask which is the one that transfers the patterns to the wafer. Patterns on masks generally get transferred to the wafer directly.
Currently reticles are patterned with fixed images which will block light in certain regions while allowing light to penetrate other regions. This allows an image of the design to be translated to the silicon through a lithographic system. Reticles are the source image for generating patterns in semiconductor processing. They suffer from high cost and slow turn-around times required when first fabricated or modified. In addition, each reticle is a fixed design which means that any changes in a design require a new reticle to be fabricated.
Therefore, there is a need for a multi-use reticle that may be programmed using electrical signals. This would allow for more flexible designs, a more rapid turn-around time from concept to test and an overall reduction in system costs.

Electrically programmable reticle and system


In a protective glove for a firefighter, an emergency rescue worker, or another worker in a high-heat area, a leather face has a peripheral edge, a leather back has a peripheral edge, a leather forchette has a peripheral edge sewn to the peripheral edge of the leather face and a peripheral edge sewn to the peripheral edge of the leather back, and a heat-resistant cover made from an aramid or polybenzamidazole fabric has a peripheral edge sewn to the peripheral edge of the leather back. The heat-resistant cover covers the leather back so as to protect the leather back against direct exposure to high heat that would tend to shrink the leather back if the leather back were not protected by the heat-resistant cover.

Conventionally, a protective glove for a firefighter, an emergency rescue worker, or another worker in a high-heat area has an outer shell, which is made from a suitable leather, such as cowhide or elkhide, and which comprises a leather face having a peripheral edge, a leather back having a peripheral edge, and a leather forchette. When the protective glove is worn, the leather face is worn over the palm of the wearer's hand, the leather back is worn over the back of the wearer's hand, and the leather forchette separates the leather face and the leather back.
The leather forchette has a peripheral edge, which is sewn to the peripheral edge of the leather face and a peripheral edge sewn to the peripheral edge of the leather back. In a protective glove of a simpler construction, the leather forchette is omitted and the peripheral edge of the leather back is sewn to the peripheral edge of the leather face.
Conventionally, whether or not the leather forchette is utilized, the protective glove has an intermediate liner providing a moisture barrier, or a moisture and chemical barrier, and an inner liner providing thermal insulation. When the protective glove is worn, air within the protective glove also provides thermal insulation.
Although an outer shell made from a suitable leather, such as cowhide or elkhide, provides multiple advantages including puncture resistance, abrasion resistance, and flexibility, an outer shell made from such a leather has an undesirable tendency to shrink around the wearer's hand, whereby to drive insulative air from the protective glove, when the outer shell is exposed to high heat, particularly at the leather back.

Protective glove having leather face, leather back, and heat-resistant cover covering leather back, for firefighter, emergency rescue worker, or other worker in high-heat area


A method for converting a digital signal to an analog signal, said method including a plurality of signal sources, preferably current sources, one or more of said signal sources being variable output signal magnitude sources, said method including the steps of setting the output signal magnitudes of the one or more variable output signal magnitude sources by individual setting signals being input signals for said respective variable output signal magnitude sources, wherein said conversion is adaptable on a per signal basis in response to needs concerning bandwidth and/or accuracy for achieving a trade-off between sample-rate and resolution of said conversion.

The present invention relates to converting a digital signal to an analog signal.
Digital to analog conversion is widely applied in electronic signal processing. Known conversion techniques use so-called current steering Nyquist digital to analog converters (DAC) summing binary weighted current sources to form the analog signal. Such Nyquist DACs offer high-speed conversion with relatively few current sources. The output analog signal shows inaccuracy due to mismatch of the weighted current sources, in particular with large current range. To minimize such mismatch requires a difficult layout. Furthermore a hardware filter is necessary, e.g. a low pass filter, for filtering the output signal to suppress harmonic content in the output signal.
Another known conversion technique uses a so-called multi-bit Delta-Sigma converter summing only equal current sources and thus offering high accuracy at reduced conversion speed due to over-sampling. A subset of n out of in total N equal current sources can be selected using a dynamic element matching (DEM) unit by randomly selecting a subset of equal current sources to further improve accuracy by averaging out mismatch errors of the individual equal current sources. The mismatch error is converted into noise. A hardware filter is still necessary for filtering the output signal.
Another known conversion technique uses so-called segmented NYQUIST DAC wherein a number of M most significant bits (MSB) are processed to 2M equal current sources and a number of L least significant bits (LSB) are processed to L binary weighted current sources. In an output stage the outputs of the 2M equal current sources and the L binary weighted sources are summed. Such segmented NYQUIST DACs offer a reduction of the current range of the weighted current sources used for the LSB. For the MSB a subset of equal current sources can be selected using a dynamic element matching (DEM) unit by randomly selecting a subset of equal current sources to further improve accuracy by averaging out mismatch errors of the individual equal current sources. The mismatch error is converted into noise. A hardware filter is still necessary for filtering the output signal.

Digital to analog conversion using summation of multiple DACs


An improved clamping fixture for bouncing apparatus to clamp two ends of a resilient stem of a bouncing apparatus includes two coupling members and two anchor members. The two coupling members are made from plastics and have respectively a first latch member and a second latch member to form a clamping space, and anchor bosses on two outer sides pivotally engageable with the anchor members. The two coupling members have coupling forces to clamp the two ends of the resilient stem, and the two anchor members are coupled on the upper end and lower end of the bouncing apparatus. The resilient stem can be positioned securely at two ends of the bouncing apparatus to facilitate bouncing operation without being scraped, damaged or fractured. Durability is greater.

A conventional bouncing apparatus usually has a clamping fixture to clamp two ends of a resilient stem 10 or 20 made from rubber (referring to U.S. Pat. Nos. 6,716,108 and 6,558,265 as shown in FIG. 1. The clamping fixture has two mating coupling members 11 and 11a and two anchor members 13 and 13a. The coupling members 11 and 11a have struts 110, a fastening hole 1100, a cavity 110a and a fastening hole 1100a on an inner side opposing each other. They aim to couple two ends of the resilient stem 10 and are fastened through fastening elements 12. The coupling member 11a further has a plurality of stubs 111 on an outer side corresponding to and engageable with coupling apertures 132 and 132a formed on coupling ends 131 and 131a of the two anchor member 13 and 13a. Such a structure is complex and difficult to fabricate and assemble. When in use for bouncing under a strong force, the coupling structure between the coupling apertures 132 and 132a formed on coupling ends 131 and 131a of the two anchor members 13 and 13a and the stubs 111 easily breaks away due to not latching means (referring to FIG. 2). Hence the resilient means has risk concern when in use. To use it on the bouncing apparatus creates a great safety issue.
As the resilient means shown in FIG. 1 is not desirable for fabrication and use, another clamping fixture made of aluminum that has two corresponding coupling members 21 and anchor members 22 has been developed to clamp two ends of the resilient stem 20 (referring to FIG. 3). The two coupling members 21 are made of metal and have a sharp latching inner rim 211. When the two ends of the resilient stem 20 are clamped, the coupling members 21 tend to scrape and damage the resilient stem 20 or even create fracture (referring to FIG. 4). Moreover, the coupling members 21 have respectively an indented portion 212 to be latched by a boss 221 formed on the anchor member 22. Referring to FIG. 3, when the resilient means of the bouncing apparatus is in use under a strong bouncing, as the boss 221 and indented portion 212 are coupled without latching. The boss 221 easily breaks away from the indented portion 212 and results in separating of the anchor member 22 and the coupling member 21. Hence it is also not desirable design.
Therefore there is a need to provide an improved clamping fixture for bouncing apparatus to provide rapid clamping without scraping or damaging the resilient stem, and form a secure clamping without loosening the coupling members in a strong bouncing condition.


A processing system includes multiple processors in which a first processor operates at a first clock frequency and first supply voltage at all times. At least one processor is dynamically switchable to operate at the first clock frequency and first supply voltage resulting in the first and second processors providing symmetrical multi-processing (SMP) or at a second clock frequency and a second supply voltage resulting in the first and second processors providing asymmetrical multi-processing (ASMP). An integrated controller (e.g., finite state-machine (FSM) controls not only voltage change, but also clock-switching. Various criteria can be used to determine when to switch the at least one switchable processor to improve power consumption and/or performance. Upon receipt of a switching command to switch between SMP and ASMP, a series or sequence of actions are performed to control a voltage supply and CPU/memory clock to the switchable processor and cache memory.

Multi-processing systems utilize multiple processors (e.g., central processing units (CPU)) to process data and perform desired functions. As will be appreciated, the term "processor" is used synonymously with the terms "CPU" or "core" and is readily understood by those skilled in the art. In the prior art, there exist two main types of disparate multi-processing systems: Symmetric multi-processing (SMP) and asymmetric multi-processing (ASMP).
SMP systems are typically characterized by the sharing of all system resources, a single synchronous L2 cache interface (and possibly asynchronous L2), processors are controlled at the same clock frequency and clock voltage. This also generally means the processors/cores are equally accessible to the shared memory system (such as L2 cache and memory). In SMP, clock frequencies and voltages are not individually adjustable and, therefore, cannot be changed on a per core/processor basis. In addition, the L2 cache is shared among all cores and the L2 cache frequency is not scalable on a per core basis. In most, if not all applications, workloads of the processors in SMP are unbalanced and this leads to higher power consumption. SMP may also be characterized as treating all processors/cores equally (equality).
In contrast, ASMP systems are typically characterized by having different clock frequencies and/or clock voltages individually for processors and the L2 cache clock frequency can be independently scaled. Thus, processor clock frequency and L2 cache frequency can be scaled based on workload (e.g., faster L2 cache relative to cores for memory intensive workloads). In general terms, ASMP systems are more power efficient than SMP systems, but potentially higher power consumption may be caused by the additional and more complex hardware. When the L1 cache miss rate is high, the processor will fetch data from the L2 cache. If the requested relevant data is stored in the lower clock frequency portion of the L2 cache, the processor has to wait for the data. This leads to higher latency and higher power consumption. ASMP may also be characterized as treating all processors/cores differently or unequally (inequality).
Prior U.S. patent application Ser. No. 14/580,044 (having a filing date of Dec. 22, 2014) illustrates (in its FIG. 1) and describes the basic architecture of a processing system 100 having multiple processors employing ASMP and that a similar prior art system is utilized for SMP, however, the processors operate at a single clock frequency and using a single supply voltage level—as readily understood by persons of ordinary skill in the art. Various improvements to the basic system, including (1) a hardware-based apparatus for fast and efficient dynamic switching between SMP/ASMP modes and (2) a low-cost version of an SMP/ASMP system focused on switching from one core to two cores, with the two cores operating in ASMP mode (and when more than two cores operate, operating them in SMP mode) are described therein.
Hardware-based or hardware-implemented switching, with no intervention by software, can provide faster transitioning between SMP/ASMP modes. Accordingly, there is needed a low-cost, low-power multiprocessing system or architecture that provides fast SMP/ASMP mode switching utilizing hardware-based switching methods and apparatus.

This patent is subject to a terminal disclaimer.

Fast SMP/ASMP mode-switching hardware apparatus for a low-cost low-power high performance multiple processor system


Bending machine (10) to obtain shaped elements from pre-cut profiles (11), equipped with a drawing assembly (14) which draws the profiles (11), first shearing means (13) arranged downstream of the drawing assembly (14) and bending means (12) arranged downstream of the first shearing means (13). Downstream of the bending means (12) are arranged second shearing means (15) to eliminate the terminal segments of the profiles (11) corresponding to the difference between the linear development of the shaped element to be produced and the length of the pre-cut profiles (11).

There are known bending machines for profiles, such as reinforcement round pieces or similar, either single or in bundles, wherein shearing means, usually consisting of a shears arranged downstream of the drawing assembly and upstream of the bending means, are able to shear said profiles.
Such bending machines, when they are working bars pre-cut to size, have the problem of discharging possible excess parts and off-cuts produced during working, deriving from the difference between the length of the bar and the linear development of the bracket formed.
To be more exact, once the profile has been shaped so as to form a bracket or other shaped profile, a terminal segment of the bar can be in excess with respect to the linear development of the shaped element, and remain gripped on the drawing assembly after shearing has been completed.
This sheared segment, or off-cut, must then be discharged from the machine and particularly from the drawing means in order to start a new production cycle.
In order to discharge said off-cut, a conventional solution provides ejector rollers downstream of the drawing assembly; these rollers are able to intervene after shearing has been carried out, so as to expel the off-cut from the machine, thus freeing the drawing assembly.
However, with this solution, there is the risk that the discharged off-cut can interfere with the bending means arranged immediately downstream of the shears, or with other operating assemblies which can be present on the bending machine, thus compromising the correct functioning thereof. Moreover, this conventional solution does not guarantee sufficient safety for the operator, since off-cuts discharged in this way can hit him.
It often happens, therefore, that the operator has to intervene manually to remove the off-cuts from the drawing assembly, with consequent waste of time and dangers to his safety.
The Applicant has devised and embodied this invention to overcome this shortcoming of the state of the art, and to obtain further advantages.

Bending machine for profiles such as reinforcement round pieces or similar

M.E.P. Macchine Elettroniche Piegatrici SpA


A catch is used to secure upper and lower receiver portions of a modern sporting rifle to one another. The catch may be mounted in either receiver portion and includes a shaft on which a body is mounted. The body has a hook and a cam follower positioned on opposite sides of the shaft. The cam follower engages a cam surface, which rotates the hook into engagement with a contact surface to secure the receiver portions to one another when they are pivoted into a closed configuration.

The receiver of many modern sporting rifles comprises an upper receiver portion and a lower receiver portion. The upper receiver portion houses, among other components, the barrel, the bolt carrier and the charging handle. The lower receiver portion includes the firing mechanism the magazine and the rifle stock. Many rifle designs use two pins, a forward pin (positioned near the barrel breech) and a rear pin (positioned near the rifle stock), which engage the upper and lower receiver portions and hold them together. In a popular rifle design the forward pin is mounted in a pivot bearing, which permits the upper and lower receiver portions to pivot relatively to one another between an open and a closed configuration. In this design the rear pin may be mounted on the lower receiver portion and engage a catch mounted within the upper receiver portion. The rear pin is designed to be removed from the lower receiver portion or otherwise displaced from engagement with the catch to permit the upper and lower receiver portions to pivot relatively to one another about the forward pin.
The many advantages of the pivotable upper and lower receiver designs include ease of cleaning the rifle, ease of repair, and access to the magazine, which is especially useful for reloading if the magazine is fixed in the lower receiver and the only access to it is when the upper and lower receiver portions are in the open configuration. These advantages, however, are not uniformly realized because it is often difficult to remove or displace the rear pin to disengage it from its catch and free the upper and lower receiver portions from one another. The difficulty may arise, for example, because of binding between the rear pin and the lower and upper receiver portions. Tolerances and misalignments vary the force required between different rifles to overcome this binding; some rear pins require a tool to displace them into and out of engagement. There is clearly an opportunity to improve the design of modern sporting rifles and better realize the advantages of pivotably attached upper and lower receiver portions.


Various example embodiments are disclosed. According to an example embodiment, a form factor adapter module may include a small form factor (SFF) host connector configured to receive a small form factor pluggable (SFP or SFP+) module and to transmit and receive data according to a Serializer-deserializer Framer Interface (SFI) protocol. The form factor adapter module may also include a 10 Gigabit Ethernet Small Form-Factor Pluggable (XFP) edge finger connector configured to transmit and receive data to and from the SFF host connector according to the SFI protocol and to mate with an XFP edge finger socket.

In general, a fiber optic transceiver is a communications device having an optical interface and an electrical interface. The optical interface transmits and receives fiber optic signals (e.g., through a set of fiber optic cables). The electrical interface transmits and receives electrical signals (e.g., through a circuit board connector mounted to a printed circuit board or PCB).
Ten Gigabit Ethernet Small Form-Factor Pluggable (XFP) is a standard "off-the-shelf" fiber optic transceiver package often used for IEEE 802.3ae Ethernet communications. The electrical interface of an XFP module operates according to an XFI protocol, and has a thirty-pin electrical interface. An XFP edge finger socket may receive and mate with an XFP edge finger connector.
Small form factor pluggable (SFP or SFP+) modules are also standard "off-the-shelf" fiber optic transceiver packages which are optimized for high-speed fiber optic channel applications. Both SFP modules and SFP+ modules include electrical interfaces and have twenty-pin electrical interfaces which plug into a small form factor (SFF) host connector. The electrical interface of an SFP module may operate according to an SFP protocol such as Serial Gigabit Media Independent Interface (SGMII). The electrical interface of an SFP+ module operates according to the SFI protocol. In general, the physical form factor of an SFP or SFP+ fiber optic transceiver is smaller than an XFP fiber optic transceiver.


A distortion compensation apparatus including: a memory configured to store a plurality of distortion compensation coefficients for compensating distortion to an input signal amplified by an amplifier, each of the plurality of distortion compensation coefficients being associated with a different combination of two addresses, and a processor configured to receive temperature information associated with a temperature of the amplifier, generate a first address based on the input signal at a first time, generate a second address based on an average of the input signal during a previous period preceding the first time, the average being calculated based on the temperature information, select a distortion compensation coefficient from the plurality of distortion compensation coefficients based on the first address and the second address, and compensate distortion to the input signal based on the selected distortion compensation coefficient.

In recent years, in wireless communications such as wideband code division multiple access (W-CDMA), improvement of transmission efficiency by digitization has been promoted. When multi-value phase modulation system is applied to wireless communications, a technology is used that linearizes the amplification characteristics of a power amplifier for transmission on the transmitting side and reduces nonlinear distortion, thereby reducing an adjacent channel leakage power.
For example, a known technology stores a plurality of distortion compensation coefficients used for distortion compensation in a look up table (LUT), and reads a distortion compensation coefficient from the LUT by designating an address according to the power value of a transmission signal. In addition, another known technology maintains distortion compensation performance in order to reduce memory effect in which the output of an amplifier at a certain time is affected by the past inputs due to an electrical transient response called an Idsq (drain current) drift in the amplifier.
For example, a known technology generates a second LUT address in addition to a first LUT address according to the power value of the current signal, and reads a distortion compensation coefficient from the LUT using the first LUT address and the second LUT address, the second LUT address being generated in consideration of a variation in the power value of the past signals (see, for example, Japanese Laid-open Patent Publication No. 2013-026631).

Distortion compensation apparatus, transmission apparatus, and distortion compensation method


According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing portion may also be provided on the valve shaft to seal the chamber when the valve shaft is inserted a second distance into the opening.

As processors advance in complexity and operating rate, the heat generated in processors during operation increases, and the demands on cooling systems for processors also escalate. It has been proposed to cool processors with systems that circulate a fluid proximate to a processor die. In some cases, the systems may be tested before being filled with fluid. It may be advantageous to provide an apparatus and/or method to facilitate the testing and/or filling of such systems in an efficient and cost effective manner.


In one embodiment, each of a plurality of sites may produce surplus power. All or a fraction of the surplus power may be supplied to the power grid according to an agreement between the user of a site and an electric utility. A computer of the utility is in communication with a computer at each of a plurality of sites having a local power source. Terms of power provision that include an amount of power to be provided during a specified time of day is communicated between a site and the utility.

This written description is in the field of distributed local power sources such as, for example, solar panels or wind turbines distributed among a plurality of houses or other buildings. More particularly, the description relates to using surplus power of the distributed local power sources.
With the high cost of oil, people are looking for renewable energy such as solar power, wind, micro-hydropower and other distributed sources. Some people have already installed solar power or wind power at their homes or businesses. These distributed sources may collectively provide a substantial amount of reserve and excess power to a power distribution system.

Distributed grid-interactive photovoltaic-based power dispatching

International Business Machines Corporation


The invention relates to channel coding in the air interface in telecommunication systems, and specifically to methods used in selecting coding methods. The network utilizes information reported by a power control channel quality reporting procedure, such as reporting procedures used for Enhanced Power Control or Fast Power Control, for controlling the TFC selection.

1. Field of the Invention
The invention relates to channel coding in the air interface in telecommunication systems, and specifically to methods used in selecting coding methods.
2. Description of the Related Art
In Release 6 of the third generation partnership project (3GPP), a Flexible Layer One (FLO) based on similar principles that are used in Universal Terrestrial Radio Access Network (UTRAN), is being standardised for the Global System for Mobile communications/Enhanced Data for GSM Evolution (GSM/EDGE) Radio Access Network (GERAN). Instead of having fixed coding schemes in specifications, Flexible Layer One (FLO) provides a framework that allows one or more coding schemes to be defined at call set-up according to the quality of service (QoS) requirements of the service to be supported and expected conditions of the radio channel. In the terms used in 3GPP standards, these coding schemes are referred to as Transport Format Combinations (TFCs).
TFC selection refers to the process of adaptively selecting an appropriate TFC during transmission in order to adapt to changes in the radio environment such as due to fading. It is analogous to the well known 'link adaptation' operation used in Adaptive Multi-Rate (AMR) channels.
On the uplink (UL), maximum TFC selection is, according to standard versions current at the time of writing of this patent application, controlled by the network. The network can signal in-band on the downlink (DL) the maximum TFC that shall be used on the uplink. The network is able select the maximum TFC since the network is aware of the UL radio environment. A similar approach has been proposed for the downlink. In a known proposal, presented during TSG-GERAN meeting #21 (23-27 Aug. 2004), TFC selection would be controlled by the mobile station by signalling in-band on the UL, the maximum TFC that shall be used on the DL. Having the mobile station control the TFC selection in the downlink would be a natural choice, as the mobile station is aware of the DL radio environment. This approach is similar to 'link adaptation' operation used in AMR.
However, the aforementioned proposal has the drawback of placing additional processing requirements on the mobile station. Further, it would be advantageous to retain control of TFC selection in the network. For these reasons, this proposal was not incorporated in a standard. Consequently, no method exists to perform TFC selection on the downlink direction.


A shoe rack includes an elongate shaft that is supported to extend generally vertically relative to the floor. A plurality of generally horizontal shelves are mounted to and disposed about the shaft such that the shaft extends generally centrally through the shelves. A heel elevating support includes a fastener section that is attached directly to the shaft above a respective shelf. A support rail is spaced outwardly from the fastener and extends at least partly about the shaft. An intermediate section interconnects the fastener section and the rail section such that the rail section is supported above the respective shelf. The rail section is engaged by the heel of a shoe stored on a respective shelf to elevate and support the heel of the shoe above the shelf.

Storing and organizing footwear has traditionally presented a number of problems. Closet space is often used inefficiently and shoes tend to become strewn about the floor of the closet. Locating and picking up shoes is usually quite aggravating.
My U.S. Pat. No. 5,050,746 (hereinafter, Patent No. '746) addresses and overcomes a number of these problems. That patent relates to a rotary shoe rack wherein a number of shoe supporting shelves are mounted along a vertical shaft that is rotatably mounted in a closet or other storage space. Each shelf of that apparatus carries a heel elevating support that is engaged by the heels of the shoes stored on the shelf. The support specifically disclosed in Patent No. '746 comprises a ring that encircles the shaft. The ring is mounted on the shelf by a plurality of support posts that are attached to an inner portion of the shelf. As explained in the patent, by elevating a heel portion above the shelf platform, proper ventilation is maintained around the shoe so that mildew does not collect on the sole of the shoe. Moreover, elevating the heel increases the inner circumference of the arrangement of shoes and therefore permits a greater number of pairs to be accommodated on each shelf.
Although my previously disclosed heel elevating support works quite well, it exhibits several drawbacks. Most significantly, the support is not vertically adjustable. The heels of the stored shoes are raised to a fixed height above the shelf. The support cannot be adjusted relative to the shelf, in order to accommodate different shoe sizes, men's and women's shoes and varying numbers of shoes as desired. In some cases larger sized footwear does not fit properly on the shelf because the heel support is fixed too low and the shoes extend beyond the periphery of the shelf. Additionally, my previous design requires that a number of posts be interconnected between the shelf and the heelsupporting rail. Manufacturing and assembling the apparatus can be fairly time consuming and tedious. I have also determined that an aesthetically improved heel rail support would be desirable.


The present invention relates to a reverse-stop mechanism of a curtain, especially for applying to a sheet- or cloth-type curtain, to rigidly stop a reactive force from a gravitation or an external force and also acquire varied speed output, with a characteristic by connecting a fixed first annular gear with a secondary annular gear of a larger pitch circle diameter, wherein a compound gear set, having two planet gears of varied pitch circle diameters, formed in the middle gearing both annular gears thereof, thereby a backwards rotation of the secondary annular gear will be transmitted, through the compound gear set, to the first annular gear, which stops the rotation. With different pitch circle diameters of the first and the secondary planet gear, power outputs will be transferred to varied speeds.

(a) Field of the Invention
The present invention relates to a reverse-stop mechanism of a curtain, and more particularly to an application to a vertical or horizontal type curtain that stops transmitting a reverse force, caused by gravitation or an external force, and also outputs varied powers through differential speeds formed by different pitch circle diameters of gears.
(b) Description of the Prior Art
Referring to FIG. 1. To enable a reverse-stop mechanism, a drive assembly 12 is formed in a conventional curtain 1.
Referring to FIG. 2. The drive assembly 12 is driven by operating a bead-chain 121 to rotate a chain wheel 126, which enabling a worm 125 to drive a worm wheel 124. Besides manual operation to provide a rotation force, an electric motor can be used to replace the chain wheel 126.
Referring to FIGS. 1 and 2. Through a transmission stick 122, the drive assembly 12 drives wire-collecting tubes 123, which wind up or down curtain sheets 14 through wires 141. Adjustment of angles of curtain sheets 14 is made by overturn plates 13 to move wires 142.
When blowing by wind, the curtain sheet 14 may slip downwards, transmitting a power through wire-collecting tubes 123 and the transmission stick 122 to slip the drive assembly 12.
The structure shown in FIG. 2 can be a better design till now. While the worm wheel 124, being formed inside the upper horizontal block 11, is slim and small and while the engaging force on the worm wheel 124 is limited to a face of a cog, damages can easily occur on the cog of the worm wheel 124 or the worm 125, thereby causing a slip and even losing locking capability.
The drive assembly 12 can also be applied to a cloth-curtain, which suffers similar wind pressure and self-weight effect, thereby necessitating a reverse-stop function to stop slipping.
Referring to FIGS. 3 and 3A. A horizontal type curtain includes a wire 140, an adjustment stick 120, and an upper horizontal block 11 connecting with a curtain sheet 14, which can be wound up or down by operating the wire 140. By operating the adjustment stick 120 to rotate a worm 125, a worm wheel 124, and a transmission stick 122, an angle of the curtain sheet 14 thereby being adjusted. With the worm 125 gearing the worm wheel 124, the transmission stick 122 thereby being able to resist an external or a self-weight force.
While the curtain can be as high as 30 meters, the adjustment stick 120 can't be that long, due to a packing size constraint, thereby, instead of using the adjustment stick 120, a chain wheel is used.
Referring to FIG. 4. As far as the chain wheel is concerned, a conventional design is to operate a bead-chain 121 to rotate a chain wheel 126 and other drive elements in a direction of the transmission stick 122 through a planet gear set 18. Driving by the chain wheel 126, a sun gear 181 will rotate to drive a planet gear 182 rotating round a fixed annular gear 183, which rotates a wheel disk 180 to drive a shaft 190 connecting to a main thrust shaft 191 through a stop spring 192, thereby enabling the main thrust shaft 191 to drive the transmission stick 122. The stop spring 192 can be de-compressed, when a force from the shaft 190, or compressed to stop transmitting a rotation when a force from the main thrust shaft 191, thereby forming a reverse-stop function.
The stop spring 192 is locked on an end and the de-compression is achieved when a shrinking of the diameter of the spring 192 is made by an external twisting force from the main thrust shaft 191. The design of the stop spring 192 is common in conventional curtains, thereby no further discussion regarding this subject.
The design in FIG. 4 can also be applied to drive structures in FIG. 1 such that by pulling the bead-chain 121 to enable the curtain sheet to wind up or down and also adjust incoming light angles.
With a force by pulling the bead-chain 121 or by wind pressure or self-weight effect in an opposite direction, the stop spring 192 will be de-compressed or compressed, thereby enabling the curtain being wound up or down or adjusted for different light incoming angles or enabling a reverse-stop mechanism. While the compression force and the outer perimeter of the shaft 190 exceeds limits, slipping and losing the reverse-stop capability can be happened.
Referring to FIG. 5. A conventional vertical type curtain includes a drive assembly 12, driven manually by a wire 16, formed on an upper horizontal block 11, wherein curtain sheets 14 suspended through suspension shafts 15.
Referring to FIG. 6. Curtain sheets 14 can be operated through a suspension shaft 15 connecting with a bevel wedge gear 17, to be driven by the drive assembly 12 in order to rotate a transmission stick 171.
When driven by the drive assembly 12, the bevel wedge gear 17 rotates suspension shafts 15 to alter different incoming light angles of curtain sheets. To prevent a wind pressure from causing a reverse driven force transmitting to the drive assembly 12, a structure similar to that in FIG. 2 is formed. As a result, cogs of the worm gear can be damaged, causing a slip and losing reverse-stop capability.
In recent years, other reverse-stop designs were developed, such as using an electromagnetic control switch or other electric automatic devices. As a result, defects can be relaying upon a power supply and also complex in structure.


An electronic still camera is disclosed which adjusts focus to an object image by mechanically moving an electronic sensor within the electronic still camera. The electronic sensor is moved along an optical path of the electronic still camera. In this way, the sensor follows the focal plane of the image, thus tracking a focused image.

The present invention relates generally to digital imaging cameras, and, more particularly, the invention relates to electronic still cameras having a mechanically adjustable sensor for adjusting image focus.
Conventional imaging cameras have long adjusted focus by physically moving a lens in an optical system of the conventional camera. The movement of the lens can be automatic movement driven by a motor, or manual movement under user control. In either case, the lens itself is mechanically moved relative to a film plane. It is well known in the art that as an object comes in from an infinite distance with respect to a lens, a focal plane on which the lens forms a sharp image when correctly focused is moved away from the lens. Thus, to correctly focus the image of an object onto a film plane, the lens is mechanically moved away from the film plane. Analogously, electronic still cameras have provided a similar function where, instead of a film in the film plane, there is an electronic sensor, such as a charge-coupled device ("CCD"), which is in the film plane. A problem with this type of focusing system is that lenses are often interchangeable on a camera, thus making a lens system that is individually moveable and interchangeable very costly. In addition, each lens system that is interchanged onto the camera must have the same functionality, i.e., each must be user adjustable or adapted to be driven by a motor.
Accordingly, it is an object of this invention to provide an electronic still camera that works with statically mounted lenses while optimizing image focus.
It is another object of this invention to provide an electronic still camera that reduces a cost of accessories by reducing an overall cost of interchangeable lens systems for the electronic still camera.
These and other objects of the invention will be obvious and will appear hereinafter.

Electronic still camera having mechanically adjustable CCD to effect focus


In a data storage environment, a caching system includes a synchronous I/O module to stage cache promotions, and an asynchronous I/O module to de-stage cache promotions. To reduce the likelihood that high priority cache promotions are not skipped, the caching system associations a configurable priority level with each logical storage device, and prioritizes cache promotions accordingly. Related methods are also described.

As is known in the art, computer systems which process and store large amounts of data typically include one or more applications (e.g., server applications) in communication with a shared data storage system in which the data is stored. The data storage system (or "storage array") may include one or more storage devices, usually of a fairly robust nature and useful for storage spanning various temporal requirements, e.g., hard disk drives (HDDs). The applications perform their respective operations using the storage system. Storage systems typically include an array ("storage array") of a plurality of storage devices with on-board intelligent and communications electronics and software. Within a storage system, storage devices (or partitions therein) are commonly identified using logical unit numbers (LUNs).
To improve data read performance, it is known to use a caching system (or "caching tier") positioned between the applications and the storage array. The caching system may include large-capacity Flash media devices. Applications issue read and write (i.e., I/O) operations to the caching tier which, in turn, issues forwarded read and write operations to the storage array based upon the cache state and cache strategy. According to one cache strategy, data is "promoted" from a storage device in the storage array (referred to herein as a "source LUN") to the cache in the case of a read miss. According to another cache strategy, writes issued from the application result in data being written both to the source LUN and to the cache. To improve performance, cache promotions may be performed asynchronously.


In a power-saving control module for an electrical appliance that includes a DC power supply and a remote control receiver, a switch component serves to make or break electrical connection between an AC power source and the DC power supply, a diode provides a path for supply of a DC power output from the DC power supply to the remote control receiver when connection between the DC power supply and the AC power source is made, and a rechargeable power source provides DC power to the remote control receiver when connection between the DC power supply and the AC power source is broken. A driver is controlled by the remote control receiver so as to cause the switch component to make or break the electrical connection between the AC power source and the DC power supply.

1. Field of the Invention
The invention relates to a power-saving control module, more particularly to a power-saving control module that enables supply of electric power to a remote control receiver of an electrical appliance even when connection of the electrical appliance to an alternating current power source is broken.
2. Description of the Related Art
For an electrical appliance with a remote control capability (that is, having a built-in remote control receiver for receiving remote control signals), in order to enable activation of the electrical appliance from a power-off state by remote control, connection between the electrical appliance and a commercial AC power source must be maintained so that power is always supplied to the remote control receiver. As such, the remote control receiver can be kept in a standby state so as to monitor the presence of a power-on signal for activating the electrical appliance received from a remote control transmitter. Hence, even when the electrical appliance is in an idle state, it still consumes some amount of electric power, which results in waste of energy.

Power-saving control module for an electrical appliance

Top Victory Electronics (Taiwan) Co., Ltd.


A switched-mode power supply includes a circuit device with which a primary side is fed by a significantly reduced rectified voltage derived from the AC mains power supply voltage, during a standby operating mode. A phase gating control configuration, a capacitive voltage divider or a step-down controller are preferably used therefor. Power consumption in the standby operating mode is reduced approximately in proportion to the square of the primary-voltage reduction factor.

Field of the Invention
The invention relates to a switched-mode power supply including a transformer which is cyclically supplied with a rectified voltage on the input side and serves for supplying a load on the output side.
Switched-mode power supplies for supplying electronic devices have a normal operating mode and in addition a so-called standby operating mode in which the load to be supplied with energy is significantly smaller as compared with the normal operating mode. The power consumption of the device is intended to be as low as possible during the standby operating mode. However, the intrinsic power loss of conventional switched-mode power supplies in the standby operating mode is relatively high as compared with the useful power that is tapped off. The efficiency is accordingly low.

Switched-mode power supply with low power loss standby operation


A hydraulic pump in the form of an oil pump for a vehicle engine has both its pinion, which is driven by the engine's crankshaft, and a ring-gear, which cooperates with the pinion, incorporated in an end-cover fastened to the end of the engine block. A cap is inserted in a collar on the side of the end-cover facing away from the engine and is only held in position there by means of a locking ring, which engages with a groove in the collar and presses the cap toward the engine. Outside the oil pump, a partly socket-shaped belt pulley is mounted on the crankshaft and its socket-shaped portion substantially grips the collar. Fitting and removal are thus simplified and engine overall length reduced. Simplified sealing also reduces oil leakage risks.

The present invention concerns a hydraulic pump, especially an oil pump, for a vehicle engine, provided with a pinion driven by the engine's crankshaft and with a centre-displaced ring-gear cooperating with it, and the pinion and the ring-gear are enclosed in a pump housing formed by an end cover fastened to the engine and another part secured thereto, of which at least the end cover has an aperture for the crankshaft.
The use of an oil pump in the form of a gearpump which is installed concentrically about, and is driven by, the engine's crankshaft is known for vehicle engines with pressure lubrication system. According to a usual design, the oil pump gear-wheel is placed in a separate pump housing which is bolted firmly to sealing contact with the outside of an end cover which is placed on one end of the engine block and creates together with the sides of the engine block part of the seal of the inside of the engine. This end-cover preferably forms a transmission cover which contains the engine's camshaft transmission and possibly also its balance-shaft transmission, both of which are driven by a drive placed on the end of the crankshaft. Outside the oil pump, there has usually been outermost on the end of the crankshaft a belt pulley for driving various auxiliary units such as cooling-water pump, generator and steering servo-pump. In such cases the end of the crankshaft passes through both the end-cover and the separate pump housing, which have cooperating machined planar contact surfaces which have to be sealed against leakage from the oil pressurised in the oil pump. The conventional version of the separate pump housing with all the feed and delivery ducts integrated in the pump housing has given the pump housing irregular contours. The seal between the contact planes is provided by an O-ring which is fitted in a groove in the contact plane of the pump housing and follows the irregular contours of the oil pump. This design results in relatively time-consuming fitting and removal of the oil pump, as a number of screws placed around the periphery of the pump housing are required for the fixing and sealing contact of the pump housing on the end-cover. Fitting a separate pump housing on the outside of the engine block end-cover also increases the engine's overall length. The irregular seal also entails leakage risks, as the O-ring may spring out of its groove while being fitted.
According to U.S. Pat. No. 4,382,756, fixing a cap in a pump housing by means of a grooved ring with circular cross-section is known per se in a hydraulic pump. In such cases the cap covers the shaft end and provides its bearing. To ensure good pump function, internal parts of the pump are spring-loaded towards the cap, which is thus pressed outwards and held against the locking ring.
Also known in another context is the fitting of a circular end-cap to a turbo-unit by means of a locking ring which is bevelled so as to press the cap inwards. The intention is to make it possible to fit the cap in the desired rotational position relative to the turbo-unit housing.
The automotive industry is increasingly endeavouring to simplify manufacture and assembly, but none of the previously known solutions for gearpumps installed about crankshaft ends achieves the desired simplicity in the case of an engine-mounted hydraulic pump.


The present invention provides a color image forming developer comprising yellow, magenta, and cyan toners each containing an infrared absorber, wherein the cyan toner has a maximum infrared absorbance in the infrared region lower than that of the magenta toner and that of the yellow toner, to simultaneously attain sufficient fixation capacity and sufficient resistance to void formation, and also provides an improved image forming method and an image forming device using the developer.

1. Field of the Invention
The present invention relates to a photo-fixed color image forming developer used in electrophotography, electrostatic recording, and magnetic recording, and to a color image forming method and a color image forming device using the same.
2. Description of the Prior Art
Generally, in electrophotography, which is widely employed in copiers and printers, a photoconductive insulator surface in a photoreceptor drum is electrified with uniform static charges, which may be positive or negative. A charged photoconductive insulator surface is then irradiated with light to form a latent image by means of partially erasing the static charges on the surface. For example, a latent image produced as a result of image information can be formed on a charged photoconductive insulator surface by irradiating the surface with laser beams in response to image information to erase the surface charges hit by the beams. Then, a toner in a developer assuming the form of fine particles is deposited onto the latent image charged on the surface, to thereby visualize the image. The toner image is formed on the photoconductive insulator surface. The resultant toner image is then electrostatically transferred onto a recording medium, such as paper.
The transferred toner image is fixed on the recording medium, where the toner is molten when transferred onto the medium, and then solidified/fixed on the surface. The toner is rendered molten by means of elevated pressure and/or temperature, or by the aid of light. Flash fusing has been attracting attention, because it is free of problems caused by elevated pressure or temperature.
Flash fusing generally has the following advantages: (i) deterioration of image resolution (repeatability) is lowered, because fixing the toner does not require pressurization of the toner, and therefore the toner does not have to come into contact with and receive pressure from a fuser roller; (ii) printing can be started as soon as the power source is switched on, unlike the case of conventional technique, which involves a time delay before a heat source (a fuser roller or the like) is preheated to a desired temperature level; (iii) provision of a high-temperature heat source is not necessary, and therefore the device does not undergo a substantial temperature rise; and (iv) there is avoided the situation where paper is ignited by heat from a heat source when jammed in the fuser device while the system is down.
In spite of these advantages, flash fusing involves a problem of insufficient fixation capacity when a color toner is used, because a color toner, which has lower light-absorbing capacity than a black toner, may fail to absorb sufficient light to convert its energy into heat, resulting in insufficient melting in the fixation step. Various attempts have been made to improve fixation capacity by means of incorporating into a toner an infrared absorber serving as a light absorber, as disclosed by a number of patent documents; e.g., Japanese Patent Laid-Open Publication Nos. 60-63545, 60-63546, 60-57858, 60-57857, 58-102248, 58-102247, 60-131544, 60-133460, 61-132959, 2000-147824, Hei 7-191492, 2000-155439, Hei 6-348056, Hei 10-39535, 2000-35689, Hei 11-38666, Hei 11-125930, Hei 11-125928, Hei 11-125929, and Hei 11-65167. These patent documents disclose techniques for incorporating into a toner an agent capable of absorbing light in the infrared region, serving as an infrared absorber, to improve flash fusing capacity, thereby solving problems resulting from insufficient melting capacity. In addition to use of the absorber, increasing emission capacity of a photo-fixer is another technique for improving fixation capacity of a toner.
Although exhibiting improved fixation capacity, a toner containing an excessive quantity of infrared absorber, generates excessive heat as a result of absorbing an excessive quantity of light, thereby causing printing defects referred to as "voids" that are left by the toner, moisture in the medium, or the like. Therefore, infrared absorber content of toner must be determined in view of its color, in order to simultaneously attain sufficient resistance to void formation and sufficient fixation capacity.
However, some of the color image forming developers proposed by the above patent documents comprise cyan, magenta, and yellow toners that contain an infrared absorber, and encounter difficulty in simultaneously attaining sufficient resistance to void formation and sufficient fixation capacity during the fixation step.
As a result of conducting extensive studies, the present inventors have found that the above problems result from a cyan pigment in a cyan toner having higher capacity of absorbing visible light in a wavelength range of 600 to 800 nm as compared with magenta and yellow toners. When the same infrared absorber in incorporated into the respective toners at the same content, total quantity of light absorbed varies according to visible ray absorbing capacity. This makes it difficult to simultaneously attain sufficient fixation capacity and sufficient resistance to void formation.
When emission intensity during the fixation step is increased in accordance with flash fusing capacity of magenta and yellow toners, although these toners exhibit good fixation capacity, resistance of the cyan toner to void formation may deteriorate, because the cyan toner can absorb excessive visible light to thereby form voids. Meanwhile, when emission intensity during the fixation step is lowered to an extent to avoid formation of voids by the cyan toner, although the cyan toner exhibits sufficient fixation capacity, sufficient fixation capacity of the magenta and yellow toners cannot be secured, because the magenta and yellow toners, which have lower visible light absorbing capacity than a cyan toner, cannot absorb sufficient light to melt sufficiently. Therefore, sufficient fixation capacity and sufficient resistance to void formation cannot be attained simultaneously when emission intensity is set in accordance with these properties for a cyan toner or magenta/yellow toners, the former having higher visible light absorption capacity than the latter.

Color image forming developer, color image forming method, and color image forming device