The present invention provides a capsule made of a biologically compatible material with sufficient mechanical strength to form a very thin membrane shell having at least a region with approximately uniformly sized and spaced holes or pores that are large enough to let a desired biologically active molecular product through, while blocking the passage of all larger immunological molecules. The present invention thus provides an immunological isolation of cell transplants contained therein. The present invention also provides a free standing thin film structure that may be used as a component of such a capsule and method for the fabrication of such component and capsules.

The present invention relates generally to microfabricated capsules, and more particularly to microfabricated porous capsules for immunological isolation of cell transplants.
Medical researchers have demonstrated that the concept of microencapsulation to provide immunological isolation is valid. The islets of Langerhans, which produce insulin in mammals, have been transplanted between different species. For example, pig islets have been transplanted into diabetic dogs to produce insulin. However, these unprotected islets function only for a short time before the immune system of the host kills the donor cells.
Encapsulation of islets in order to protect them from immune system macromolecules has been shown to prolong the survival of donor cells. By using various means of encapsulation, insulin production from pig islets has been maintained for over one hundred days in dogs. Encapsulation methods to date have used semipermeable amorphous organic polymeric membranes, sintered together particles, and intermeshed ceramic needles. Significant problems have been encountered, however, limiting the useful life of these capsules to not much more than one hundred days.
The two principal problems with existing capsules are inadequate mechanical strength and insufficient control of pore size and pore distribution. Specifically, if the thickness of an organic membrane capsule wall is increased to provide the required mechanical strength, molecules cannot diffuse through the capsule wall quickly enough to provide the appropriate physiological response when needed. Moreover, if the size and distribution of pores cannot be controlled, such as with sintered together particles or amorphous polymeric membranes, there is a high probability of oversized or overlapping pores which could provide an opening large enough for immunological macromolecules to enter the capsule.
An improved capsule should combine mechanical strength with the ability to allow the free diffusion of small molecules such as oxygen, water, carbon dioxide, and glucose, while preventing the passage of larger molecules such as the immunoglobins and major histocompatibility (MHC) antigens. Also, the intermediate sized molecular products, such as insulin, produced by the donor cells should be able to diffuse out to the host at a sufficient rate to provide the needed metabolic function. Such a device would provide a longer lasting alternative to presently available capsules, and eliminate the need for anti-rejection drugs by the simple strategy of physically isolating the transplanted cells so that no immunological reaction can take place. Cells from any source could then be implanted in any host. Tissue matching of donor to recipient would not be a concern.
The ideal structure would be a capsule made of a biologically compatible material with sufficient mechanical strength to form a very thin membrane having at least a region with uniformly sized and spaced holes that are just large enough to let the desired biologically active molecular product through, while totally blocking the passage of all larger immunological molecules. Such a structure cannot be made from a polymer with an amorphous molecular structure, by sintering together particles, or by intermeshed ceramic needles.
Accordingly, an object of the present invention is to provide a capsule made of a biologically compatible material with sufficient mechanical strength to form a very thin membrane shell having at least a region with approximately uniformly sized and spaced holes in it that are large enough to let the desired biologically active molecular product through, while blocking the passage of all larger immunological molecules, thus providing an immunological isolation of cell transplants contained therein.
It is a further object of the present invention to provide a free standing thin film structure that may be used as a component of such a capsule.
It is another object of the present invention to provide methods for the fabrication of such components and such capsules.
Another object of the invention is to provide a method of filling such capsules.
Yet another object of the invention is to provide an apparatus for filling such capsules.
Still another object of the invention is to provide a method of administering a biologically active molecule to a host organism deficient in endogenous production of said biologically active molecule using such capsules.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the claims.

Microfabricated capsules for immunological isolation of cell transplants


Methods and arrangements for facilitating and streamlining patch management in “road warrior” and analogous contexts. Particularly, there are broadly contemplated herein, in accordance with at least one presently preferred embodiment of the present invention, methods and arrangements for facilitating determinations of suitable times for enabling system updates and/or downloads.

Patch management has become a significant issue for all PC users. Generally, all users can relate to pop-ups and warnings that indicate the downloading of a "patch", such as a software update, as might originate from one's internet service provider or another entity. Patch management is also common in corporate contexts, where a corporate IT (information technology) department will frequently send patches to individual desktops for download. Of course, the annoyance factor for a typical user is often quite significant as delays associated with patch downloads can interfere with one's work.
"Road warriors", or corporate individuals who find themselves traveling a great deal with a portable PC such as a laptop, find patch management to present problems on different levels. For one thing, road warriors might not have access to high-bandwidth connections which would make patch management a more feasible or accessible procedure; in some contexts lacking high-bandwidth connections patch management downloads might not even be attainable or, if they are, might come through only at a considerably slow transmission rate. On the other hand, because of the transient nature of road warriors' connections to any network, the time windows for even accepting a patch management download might be severely limited. It would thus often oblige them to ignore, deflect or reject patch management downloads when possible so that the limited time during which they may be connected is not monopolized by cumbersome download procedures. Similar challenges of course often present themselves to users in non-corporate contexts involving a great deal of travel and/or transient computer usage, so the term "road warrior" need not necessarily be construed to apply to the corporate context just described.
U.S. Patent Publication No. 20060190938 (Lenovo) discloses a procedure for pre-emptively rejecting patch management downloads by way of an "away" button which communicates to external sources that the user will be "away" from the machine for a period of time. However, this solution essentially requires the user to be keenly knowledgeable of the away button function and highly diligent in using it. Thus, one who has not had time to become well-versed in such a function or cannot find the time to adequately manage its use will not get the most productive use out of the function.
Accordingly, a compelling need has been recognized in connection with providing a more user-friendly and efficient arrangement for pre-emptively rejecting patch management downloads in road warrior (and analogous) contexts.

Computer patch management in “road warrior” contexts


The present disclosure is directed to an apparatus and method for growing a sapphire sheet via edge-defined film-fed growth (EFG) including an angled heat shield with respect to the a side surface of a die tip. The present disclosure is further directed to an sapphire sheets and batches of such sheets having features such as a particular maximum low spot thickness.

Sapphire crystals are used in a variety of applications. For example, sapphire sheets can be used for various demanding, high performance military and commercial applications, such as ballistic and targeting windows. Further improvement of sapphire sheets, in particular in the dimensional stability during production of large and thick sapphire sheets is desired.
Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the invention.

Sapphire sheets and apparatus and method for producing sapphire sheets with angled heat shields


A roasting apparatus for cooking skewered food constituted by food and a skewer skewering the food includes a main apparatus body having a wall member forming a cooking space maintained within the food during cooking, a heater provided in such a manner that a heat-emitting section is positioned at an upper part of the cooking space, and a food holding mechanism for positioning food downwards from the heat-emitting section and being capable of holding horizontally laid skewers in a manner enabling free rotation about a center axis of the skewers, so as to enable heat from the heating means to be used effectively and enable the skewered food to be effectively cooked.

1. Field of the Invention
The present invention relates to cooking apparatus for cooking skewered food constituted by food and a skewer skewering the food. The present invention particularly relates to cooking apparatus suited to the cooking of Japanese food referred to as "yakitori", where meat, vegetables, or seafood etc. are skewered by a skewer.
2. Background Art
Various apparatus for cooking food on a skewer such as "yakitori" are known in the related art. In a traditional method, lit charcoal is arranged in a heater cooker that is long in a widthwise direction, and the skewered food is lined up next to each other in parallel so as to be positioned above the charcoal, with a person then rotating the skewers as necessary. The food is then cooked by heat radiated from the charcoal. In this traditional method, it is necessary for a person to always be watching the skewered food.
With the above apparatus, a holding member used when cooking the food and heating means for cooking the food are located in the apparatus in a manner exposed to the outside. As a result, the food is cooked with part of the heat from the heating means being radiated to the outside and it is therefore not possible to effectively utilize heat from the heating means.
The present invention is therefore advantageous in providing a skewered food cooking apparatus and food supporting member for skewered food that is capable of cooking the food while effectively utilizing heat from a heating means.


Combinations of hydrophilic and hydrophobic entities in a biodegradable sustained release implant are shown to modulate each other's rate of release. Formulations of a therapeutically active agent and modulator provide controlled, sustained drug release for an extended period of time.

Solid pharmaceutically active implants that provide sustained release of an active ingredient are able to provide a relatively uniform concentration of active ingredients in the body. Implants are particularly useful for providing a high local concentration at a particular target site for extended periods of time. These sustained release forms reduce the number of doses of the drug to be administered, and avoid the peaks and troughs of drug concentration found with traditional drug therapies. Use of a biodegradable drug delivery system has the further benefit that the spent implant need not be removed from the target site.
Many of the anticipated benefits of delayed release implants are dependent upon sustained release at a relatively constant level. However, formulations of hydrophobic drugs with biodegradable matrices may have a release profile which shows little or no release until erosion of the matrix occurs, at which point there is a dumping of drug.
The eye is of particular interest when formulating implantable drugs, because one can reduce the amount of surgical manipulation required, and provide effective levels of the drug specifically to the eye. When a solution is injected directly into the eye, the drug quickly washes out or is depleted from within the eye into the general circulation. From the therapeutic standpoint, this may be as useless as giving no drug at all. Because of this inherent difficulty of delivering drugs into the eye, successful medical treatment of ocular diseases is inadequate.
Improved sustained release formulations which allow for a constant drug release rate are of considerable interest for medical and veterinary uses.

Formulation for controlled release of drugs by combining hydrophilic and hydrophobic agents


A monolithic optical transmitter photonic integrated circuit (TxPIC) comprises a plurality of integrated modulated sources which, when all operated at constant current, display a power output that varies as a function of array position similar to a quadratic-shaped curve and, further, forming an array of signal channels each having a different wavelength output. An optical combiner/decombiner is integrated in the circuit and has at least one free space region with a plurality of ordered bands along its edge where the zero order band is substantially at a longitudinal centerline of the free space region and where, on either side of this band, is a first order band followed by additional higher order bands. The ends of the output waveguides from the modulated sources are coupled approximate to the free space region edge along a region of the zero order band between one of the adjacent first order bands and a longitudinal centerline of the zero order band so that the inputs of the signal channels to the combiner of are titled or offset with respect to the longitudinal centerline of the combiner free space region so the combined outputs from the optical combiner will be aligned along the slope of the quadric-shaped curve of the combiner output passband envelope. The tilted combiner/decombiner may also be deployed in a receiver photonic integrated circuit (RxPIC) or other circuit employing such a device.

1. Field of the Invention
This invention relates generally to combiners/decombiners, both of the selective wavelength type such as optical multiplexers/demultiplexers, for example, arrayed waveguide gratings (AWGs) or elliptical supergratings (ESGs) and of the non-selective wavelength type such as free space region couplers, star couplers or multi-mode interference (MMI) couplers. More particularly, this invention relates to the deployment of what we refer to as "tilted" optical combiners/decombiners of both the wavelength selective and the non-selective type.
2. General Definitions
Reference is made in this disclosure to a "optical combiner/decombiner" when only the application of the optical combiner itself is generally discussed. However, as it will be evident to those skilled in the art, the principals of such optical combiners shown in this disclosure can be equally be utilized as optical decombiners such as illustrated in an optical receiver photonic integrated circuit (RxPIC) disclosed in U.S. patent application Ser. No. 10/267,304, filed Oct. 8, 2002 and published on Feb. 19, 2004 as Pub. No. 2004/0033004, which application is incorporated herein by its reference.
Reference in this description to signal channels is nominally either a modulated semiconductor laser source or a semiconductor laser source and its associated modulator, each referred to as a "modulated source" and providing a modulated signal output. In this context, such a signal channel is also an optical waveguide with one or more accompanying integrated elements, such as, but not limited to, a laser source, a modulator, a photodetector or a semiconductor optical amplifier (SOA), a variable optical attenuator (VOA) or a combination VOA/SOA. Thus, a train of elements formed in each signal channel comprising a modulated source and other accompanying integrated elements for a signal channel array comprising two or more such channels integrated in a photonic integrated circuit (PIC).
"Laser emission wavelength" means emission output wavelength of a laser source in a particular signal channel formed in a photonic integrated circuit (PIC) such as an optical transmitter photonic integrated circuit or TxPIC.
"Active region wavelength" means the wavelength of the photoluminescence (PL) peak or the gain peak of an active region wavelength spectrum, for example, of laser source and/or modulator formed in a photonic integrated circuit (PIC) signal channel where the channel laser source and modulator share the same active region and active region bandgap and/or share the same active region and active region bandgap with adjacent, integrated signal channels. For purposes of brevity in this invention, PL peak and gain peak are used interchangeably although they are slightly different as is known in the art.
The terms, "laser(s)" and "laser source(s)", are used interchangeably in this disclosure.
An "active region" as employed in the description of this disclosure means the region in a semiconductor device where carrier recombination and/or light absorption occurs which may be comprised of a single semiconductor active layer or multiple semiconductor layers with any associated optical confinement layers, as is well known to those skilled in the art. An active layer, for example, may be a single high refractive index active layer or may be multiple active layers such as in the case of multiple quantum well layers and barrier layers which are, together, commonly referred to as an active region.
Also, examples of the inventive optical combiners/decombiners illustrated in this disclosure are referred to as "tilted" in the sense that the inputs or the outputs of the combiner free space region or regions are spaced from or offset relative to a longitudinal centerline of the free space region, but still remain within a zero order band of the combiner free space region, rather than being positioned on and about that centerline of a zero order band of an input free space region of the combiner, which is the common practice in such devices for optimized combiner passband results. In terms of the foregoing description, "offset" of the inputs or outputs, as the case may be, means that they are spatially to one side of the longitudinal centerline of the free space region, i.e., they are spatially offset.
3. Description of the Related Art
Reference is made to FIG. 1 which shows a transmitter photonic integrated circuit or TxPIC 10 which has been disclosed in U.S. patent application Ser. No. 10/267,331, filed Oct. 8, 2002, and published on May 22, 2003 as Pub. No. US 2003/0095737 A1, as well as disclosed in U.S. patent application Ser. No. 11/268,325, filed Nov. 7, 2005, both of which applications are owned by a common assignee herein and are incorporated herein by their reference. As shown in FIG. 1, monolithic PIC chip 10 comprises groups of integrated and optically coupled active and passive components formed in a series of signal channels, identified as channel Nos. 1 through 12 in FIG. 1. It should be noted that any number, N, of channels can be formed in chip 10, such as less than twelve channels or greater than twelve channels. Each signal channel includes a modulated source 13 comprising a laser diode 12, such as a DFB semiconductor laser or a DBR semiconductor laser, and an electro-optic modulator 14. Each laser source 12 operates at a different wavelength, λ1-λN where N here is equal to twelve, where the group of wavelengths provides a wavelength grid that may be commensurate with a standardized wavelength grid, such as the ITU wavelength grid, but may also operate on a non-standard or form a wavelength grid with nonuniform wavelength spacing. On the other hand, the wavelength grid need not be any particular standard. Laser diodes 12 are respectively provided with an associated electro-optic modulator 14 as shown in the example here. Thus, the CW outputs of laser diode sources 12 are shown optically coupled to respective modulators 14. Modulators 14 may be electro-absorption modulators (EAMs) or Mach-Zehnder modulators (MZMs) as detailed in patent application Ser. No. 10/267,331, supra. It is within the scope of this disclosure that rather deploying electro-optic modulators 14, laser diode sources 12, themselves, may be directly modulated. Modulators 14 each apply an electrical modulated signal to the CW light from laser diodes 12 producing an optical modulated signal for transmission on an optical link of an optical transmission network. The modulated source outputs from modulators 14 may be optically coupled to a photodetector 16 for the purposes of monitoring the output power or signal characteristics received from modulators 14. The on-chip deployment of photodetectors 16 is optional. Photodetectors 16 may also be fabricated off-axis of a channel or in-tandem with the optical train elements 12, 14 and 15. Photodetectors 16 may be PIN photodiodes, MSM photodetectors, or avalanche photodiodes (APDs). Also, each signal channel may include an electro-optical amplitude varying element (AVE) 15. An AVE channel element 15 may be a variable optical attenuator (VOA), a semiconductor optical amplifier (SOA), a gain-clamped SOA (GC-SOA), or a combination VOA/SOA, the latter of which is also referred to in the second of the above identified and incorporated patent applications as a "ZOA". A ZOA is capable of biasing either positive or negative to adjust the optical power level in a channel to be higher or lower, respectively. The train of these elements 12, 14, 15 and 16 are numerically identified for only signal channel No. 1 in FIG. 1 so that it should be understood in this description that they are all the same for the remaining signal channel Nos. 2 through 12.
An approach in the operation of TxPIC 10 is to operate all semiconductor lasers 12 at a predetermined power level throughout the life of the PIC chip 10. In this way, the need for control logic to vary laser current to control power level changes over life is eliminated, which current changes can also change the effective emission wavelength of the laser which must be maintained on a desired wavelength grid in optical transmission systems. Over the life of the semiconductor lasers 12, the power levels will fall naturally due to certain deleterious aging effects so that the on-chip AVE channel elements 15 are deployed to maintain the predetermined power level such as by boosting the power of the modulated signal. The semiconductor laser deleterious aging effects are the development of leakage current paths in the laser and dopants in the laser semiconductor layers will migrate over time reducing its slope efficiency as well as, to some extent, misalignment of the TxPIC chip output to its package output fiber due to constant temperature variations imposed upon the chip package over time.
As indicated above and as explained in more detail in patent application Ser. No. 10/267,331, supra, modulators 14 may be fabricated as electro-absorption modulators (EAMs), Mach-Zehnder modulators (MZMs) or band edge Mach-Zehnder modulators. The modulated optical signal outputs of modulators 14, via photodetectors 16, are respectively coupled, via waveguides 18(1) . . . 18(12), to an on-chip or integrated wavelength selective combiner, shown here as an arrayed waveguide grating or AWG 20. Waveguides 18(1) . . . 18(12) receive the modulated channel signals from the N channels and provide them as an input to AWG 20. Combiner or multiplexer 20 may also be substituted by another type of wavelength-selective combiner/decombiner, such as an elliptical supergrating, an Echelle grating, a cascaded Mach-Zehnder interferometers (CMZIs), broadband multiplexers of the type shown, for example, in U.S. Pat. No. 6,580,844 (which is also incorporated herein by its reference), a so-called free-space diffraction grating (FSDG) or a quasi-selective wavelength star coupler having a multimode coupling region comprised of waveguides as disclosed in U.S. patent application, publication No. 2003/0012510 (which is also incorporated herein by its reference). Such wavelength-selective combiners or multiplexers are more conducive to high channel signal count on a TxPIC chip 10. However, it is within the scope of this disclosure to practice the invention in connection with non-wavelength selective couplers, such as power couplers, star couplers or MMI couplers which can be employed in particular circumstances. Each of the modulated sources 13 is, therefore, representative of an optical signal channel Nos. 1 through 12 on TxPIC chip 10. There may be, for example, as many as forty (40) signal channels or more formed on a single TxPIC 10.
Each signal channel is typically assigned a minimum channel bandwidth spacing to avoid crosstalk with adjacent optical channels. Currently, for example, 50 GHz, 100 GHz, 200 GHz, or 400 GHz are common channel spacings between signal channels. The physical channel spacing or center-to-center spacing 28 of the signal channels may be 100 μm to 1,000 μm or more to minimize electrical or thermal cross-talk at data rates, for example, of 10 Gbit per second or greater, and facilitate routing of interconnections between bondpad groups 27 for the multiple PIC optical elements 12, 14, 15 and 16. Although not shown for the sake of simplicity, bonding pads may be provided in the interior of PIC chip 10 to accommodate wire bonding to particular on-chip interior electro-optic elements in addition to bond pad groups 27 comprising chip edge-formed bonding pads.
As indicated previously, the respective modulated outputs from electro-optic modulators 16 are coupled into optical waveguides 18(1) to 18(12) to the input of AWG 20 as shown in FIG. 1. AWG 20 comprises an input free space region 19 coupled to a plurality of diffraction grating waveguides 21 which are coupled to an output free space region 22. The multiplexed optical signal output from AWG 20 is shown as provided with a plurality of output waveguides 23 which comprise output venires, or what might be referred to as a plurality of spare outputs that provide optimum performance of the multiplexer to the same set of multiplexer inputs, which outputs are along the zero order Brillouin zone at output face 22A of output free space region 22 of AWG 20. However, the deployment of spare outputs 23 is optional and the output may be to a single output waveguide. Spare output waveguides 23 extend to output facet 29 of TxPIC chip 10 where a selected output may be optically coupled to an output fiber (not shown). The outputs may also be disposed at a small angle relative to a line normal to the plane of output facet 29 to prevent internal reflections from facet 29 back into vernier outputs 23 that may affect stabilized laser wavelength operation. The deployment of multiple vernier or spare outputs 23 provides a means by which the best or optimum output from AWG 20 can be selected having the best overall passband response of AWG 20 with the established wavelength grid of the group of channel signal outputs from the array of laser sources 12. Seven outputs 23 are shown in FIG. 1. It should be realized that any number of such vernier outputs may be utilized beginning with the provision of two of such outputs. Also, the number of such outputs may be an odd or even number.
In operation, AWG 20 receives N optical signals, λ1-λN, from coupled input waveguides 18 which propagate through input free space region 19 where the wavelengths are distributed into the diffraction grating waveguides 21. The diffraction grating waveguides 21 are a plurality of grating arms of different lengths, ΔL, relative to adjacent waveguides, so that a predetermined phase difference is established in waveguides 21 according to the wavelengths λ1-λN. Due to the predetermined phase difference among the wavelengths in grating arms 21, the focusing position of each of the signals in grating arms 21 in output free space region 22 are substantially the same so that the respective signal wavelengths, λ1-λN, are focused predominately at the center portion or the zero order Brillouin zone of output face 22A. Verniers 23 receive various passband representations of the multiplexed signal output from AWG 20. Higher order Brillouin zones along output face 22A receive repeated passband representations of the multiplexed signal output at lower intensities. The focus of the grating arm outputs to the zero order Brillouin zone may not be uniform along face 22A due to inaccuracies inherent in fabrication techniques employed in the manufacture of TxPIC chip 10. However, with multiple output verniers 23, an output vernier can be selected having the best or optimum combined WDM signal output in terms of power and responsivity.
Power output across an array of lasers, when forward biased at identical currents may vary as a function of position across the array for a number of reasons. One possibility is systematic variation from the design specifications to fabrication tolerance. Another is the predictable variation one gets from the application of selective area growth in a fabrication step, for example. Regardless of the cause of the output power variation across the array, power equalization at the chip output is very desirable so that a desired signal to noise ratio (SNR) will be achieved at an optical receiver in an optical transmission network. One approach to the signal output power equalization is to adjust the bias current of each of the lasers to follow the power spectrum curve such that more bias current is provided to the weaker lasers and less bias current is provided to the stronger lasers. However, this not a successful approach because the weaker lasers often have higher current thresholds compared to the stronger lasers. As a result, the weaker lasers will have less power output. To increase the bias current on the weaker lasers to provide improved power equalization across the signal channel outputs means that some lasers will be operating at higher current levels relative to the respective laser current thresholds (ITH) than other lasers so that the overall life expectancy of the TxPIC may be shorter than what is actually possible.
Another approach is to operate all of the lasers at their highest rated power level and then employ in each signal channel an amplitude varying element (AVE), particularly a loss element such as a variable optical attenuator (VOA), to reduce the highest rating power level across the laser array output to a substantially equalized level. As the laser sources age over time, their power intensity reduces so that the negative bias applied to the VOAs, relative to each element, can be correspondingly reduced to maintain the same and original power output level across the laser array over the life of the TxPIC. This approach includes, alternatively, the utilization of ZOAs (or in addition to the VOAs, SOAs) in each signal channel where the power in some of the channels reduced while the power in some of the other channels is increased to achieve power equalization across the signal channels. The downside to this approach is the throwing away of laser power in addition to providing a channel array of biased elements in the circuit that increase both the power budget and thermal budget of the TxPIC chip.
In ordinary combiners/decombiners known in the art, particularly of the wavelength selective type, the output waveguides are coupled to the center of the zero order band about the centerline of the free space region. In this case, all of the inputs and/or outputs to and from the free space region would be substantially parallel with the free space region longitudinal centerline. In this connection, reference is made to FIG. 2 which illustrates how the waveguide inputs of the twelve (12) signal channels are provided to the input free space region 19 of arrayed waveguide grating (AWG) 20 along the free space input edge 33. The inputs, which shown here number thirty-one (31) are formed into the zero order band 34 providing input channels 30 for the purposes of this description which will become clearer later on. Within the input signal channels 30 are the twelve input signal channels 32 from modulated sources 13 shown in FIG. 1, where the channel inputs 18 are centered about the centerline 38 of the zero order band 34 of free space region 19. Also, shown in FIG. 2 is one approximate edge 36 of zero order band 34. It is standard practice to center the waveguide inputs 32 at the center of the zero order band 34 of input free space region 19 of AWG 20. This is because the optimum power in the passband of AWG 20 is generally centered on the centerline 38 of the center or zero order band 34 of input space region 19 as illustrated in FIG. 3. FIG. 3 is a graphic illustration of the power output passband envelope of AWG comprising passband curve or envelope 40. Each dot on curve 40 represents an input channel 30 along the passband envelope or curve 40. The twelve centered channel inputs 18 in TxPIC 10, designated by rectangle 42 in FIG. 3, are the twelve channels approximate to or abounding either side of the peak of normal power distribution through free space region 19 of AWG 20, i.e., the region in curve 40 where its passband envelope is optimum and the most uniform in terms of flatness as compared to other regions of the same curve 40.
We have discovered a new approach that at least reduces, if not eliminates in certain cases, the necessity of an increase in power and thermal budget brought about by the inclusion of at least one AVE in each signal channel. This new approach involves the passband spectrum of the optical combiner integrated in the TxPIC or any other photonic integrated circuit for that matter, such as, for example, the design of arrayed waveguide grating (AWG) 20 and other such wavelength selective combiners/decombiners mentioned later in this disclosure and, more particularly, the particular placement of the input waveguides or channels 18(1) . . . 18(N) relative to the zero order band 34 of input free space region 19 of AWG 20.

Tilted combiners/decombiners and photonic integrated circuits (PICs) employing the same


A pupil expander carrier has a block having a support surface. A first post extends upwardly from this surface in spaced relation to a first pair of spaced secondary posts. These three posts normally hold and stabilize a circular pupil expander during storage conditions. A second pair of spaced secondary posts extend upwardly from the support surface and are spaced from said first post a distance greater than the normal diameter of the pupil expander whereby when the pupil expander is moved to supporting engagement with the first post and the second pair of secondary posts, it is changed from a circular configuration to an elongated and generally rectangular configuration. A retention post extends outwardly from an edge portion of the block adjacent the second pair of secondary posts to engage the strap of the pupil expander just before removal thereof from the block. The forceps used to remove the elongated pupil expander from the carrier block have two elongated forcep tips which are rectangular in cross section and which have a width greater than the height thereof for insertion in the outer peripheral opening of the pupil expander.

The pupil expander of my application Ser. No. 07/836,361, comprises a ring of silicone or other suitable soft plastic tubular material (e.g. Silastic .RTM. silicone, Dow Corning, durometer value of about 80) with an outside diameter of 8.2 millimeters and an inside diameter of 7.0 millimeters. The ring has a "C" cross section configuration with a peripheral opening at the outside edge. The ring is incomplete with approximately a 3.5 millimeter gap to permit surgical maneuvers within it, and that gap is bridged by a strap between the open ends of the ring. There are also two tabs with holes, which are used for manipulation of the device inside and outside the eye.
The method of use of this pupil expander comprises the moving of the pupil expander, which is inserted into the anterior chamber of the eye through a previously prepared scleral incision. The expander is advanced across the anterior chamber until the flared end of the expander engages the iris at a 6 o'clock position. A spatula or lens manipulator is used to hold the expander in place against the iris sphincter while the forceps tips are partially withdrawn. The tips are then closed on the expander, and the tips are advanced into the eye causing the expander to enlarge horizontally engaging additional iris. The tips are then withdrawn an additional millimeter or two, and the above maneuver is repeated until the expander has been advanced onto the sphincter and the pupil has been gradually dilated. When the forceps have been withdrawn until they are opposite the tabs on the expander, the handle is lifted pushing the tips and the contained expander down toward the lens permitting the tabs to come down against the iris and completing the placement of the expander entirely within the pupil.
When the surgical maneuvers are completed, a small scissors is used to cut the silicone strap joining the ends of the pupil expander, and a forceps is used to lift one end of the expander by grasping the tab and moving it toward the center and lifting it to disengage the iris. Once one edge has been disengaged from the sphincter, the expander can simply be pulled from the eye under a layer of viscoelastic material.
Because of the extremely small size of the pupil expander, the handling thereof is very delicate and sensitive, and ordinary forceps are not adapted for easily handling thereof. In addition, the strap of the ring sometimes gets in the way of grasping the pupil expander for removal thereof from a carrier device.
It is therefore a principal object of the invention to provide means for easily grasping and manipulating the pupil expander of my co-pending application.
A further object of the invention is to provide a carrier means for storage of the pupil expander which facilitates the elongation and ultimate removal of the pupil expander therefrom at the time of use thereof.
These and other objects will be apparent to those skilled in the art.

Pupil expander carrier and means for manipulating a pupil expander


The invention provides a method for eliminating HIV in human blood and a device for treating AIDS with non-pharmacotherapy. The method includes (1) pumping the blood containing HIV virus into a soft thin plastic tube while adding air through a T-tube at a definite frequency so that the blood is evenly divided into very small blood droplets (2) introducing the small blood droplets into a screw-shaped quartz tube and exposing the quartz tube under a definite dosage of radiation to kill the HIV virus in the blood droplets is (3) collecting the treated blood in a storage bottle. Results show that after the HIV infected blood is divided into very small blood droplets and is irradiated with a definite dosage of ultraviolet (253.7 nm) for 90 seconds, more than 92% HIV loads in the blood is eliminated, while the lymphocyte (CD4+), erythrocyte, leucocyte and haemoglobin remain almost unchanged.

There has been no therapy in the world so far to cure AIDS radically. The conventional therapies are mainly to lower the level of HIV or restrain the replication of HIV virus in human bodies using medicines (pharmacotherapy). These therapies, such as the "cocktail" therapy, have insurmountable problems of strong side effects and drug-resistance, although their curative effect is improving rapidly. The medicines commonly used for AIDS treatment can cause nausea, headache, anemia, decrease in neutrophil leucocyte, pancreatic inflammation and acid toxicosis, and sometimes peripheral neuropathy, diabetes, hepatitis and alimentary canal symptoms. Moreover, as these therapies are usually expensive, they can hardly be effective to the large population of AIDS patients with ordinary incomes in many countries.
In recent years, ideas of extracorporeal blood treatment have been brought forward, as described in the American Patents, Nos. 272535, 068510 and 549961. This method is to take a certain amount of blood from an AIDS patient, treat it with volatile organic solvent diethyl ether to kill the dissociative or intracellular HIV, and then transfuse the treated blood back to the patient. In this method organic solvent is mixed with human blood, which may inevitably impose side effects on the normal cells in the blood, though the solvent can volatilize from the blood eventually. Furthermore, this method involves chemical treatment to blood and a series of complicated operations, leaving a lot to work on for practical application.

Method for eliminating HIV in human blood and a device for treating AIDS with non-pharmacotherapy

Research Center for Eco-Environmental Sciences, The Chinese Academy of Sciences


A low profile, high capacity load cell suitable for use in connection with in motion weighing or other weighing scales and systems. Also disclosed are scales for use with the load cell, and systems for using the scales. The load cells are especially suited for use in high speed in-motion weighing.

1. Field of the Invention
The present invention relates, generally, to weighing systems, apparatus and methods. Particularly, the invention relates to elongated, low profile load cells used for example in a scale to weigh vehicles or other articles. The load cells are particularly well suited for use in strip-type scales, that weigh vehicles or articles while they are in motion, most particularly high speed motion of up to 80 miles per hour.
2. Background Information
Existing technology in this field is believed to have significant limitations and shortcomings.
All US patents and patent applications, and all other published documents mentioned anywhere in this application are incorporated by reference in their entirety.

Low profile load cells for use with a scale


An optical waveguide includes an optical waveguide main body and mirrors. The optical waveguide main body includes a first cladding layer, a second cladding layer and a core portion provided between the first cladding layer and the second cladding layer. The optical waveguide main body has a first region in which the core portion and the mirrors are arranged and the light signal is transmitted, and a second region arranged on both sides of the first region and not contributing to a transmission of a light signal. Through vias that pass through the optical waveguide main body is provided in the second region. The first region on a side that faces the light emitting element or the light receiving element is protruded larger than the second region on a side that faces the light emitting element or the light receiving element.

1. Technical Field
The present disclosure relates to an optical waveguide and a method of manufacturing the same and a method of manufacturing an optical/electrical hybrid substrate and, more particularly, to an optical waveguide for transmitting a light signal between a light emitting element and a light receiving element, and a method of manufacturing the same, and a method of manufacturing an optical/electrical hybrid substrate.
2. Related Art
In recent years, with the speed-up of an information communication, a light is employed instead of an electric signal as the medium of the information communication. In such optical communication field, the conversion from a light signal to an electric signal and the conversion from the electric signal to the light signal are required, and also various processes such as the optical modulation, etc. in the optical communication are required. Therefore, the development of the optical/electrical hybrid substrate for handling the above converting processes is proceeding.
FIG. 1 is a sectional view showing an optical/electrical hybrid substrate in the related art.
As shown in FIG. 1, an optical/electrical hybrid substrate in the related art includes a wiring substrate 201, an optical waveguide 202, a light emitting element 203, a light receiving element 204, and underfill resins 206, 207.
The wiring substrate 201 has a substrate main body 211, through vias 212 and 213, upper wirings 215, 216, 223 and 224, insulating layers 218 and 231, vias 221, 222, 233 and 234, solder resists 226 and 239, and lower wirings 228, 229, 236 and 237.
The substrate main body 211 is a core substrate shaped like a plate. The through vias 212, 213 are provided to pass through the substrate main body 211. An upper end portion of the through vias 212 is connected to the upper wiring 215, and a lower end portion is connected electrically to the lower wiring 228. An upper end portion of the through vias 213 is connected to the upper wiring 216, and a lower end portion is connected electrically to the lower wiring 229.
The upper wirings 215, 216 are provided on an upper surface 211A of the substrate main body 211. The insulating layer 218 is provided on the upper surface 211A of the substrate main body 211 to cover the upper wirings 215, 216. The via 221 is provided to pass through the insulating layer 218 arranged on the upper wiring 215. A lower end portion of the via 221 is connected to the upper wiring 215. The via 222 is provided to pass through the insulating layer 218 arranged on the upper wiring 216. A lower end portion of the via 222 is connected to the upper wiring 216.
The upper wiring 223 is provided on a portion of the insulating layer 218 corresponding to a forming position of the via 221. The upper wiring 223 is connected to an upper end portion of the via 221. The upper wiring 223 has a pad portion 241 connected electrically to the light emitting element 203. The upper wiring 224 is provided on a portion of the insulating layer 218 corresponding to a forming position of the via 222. The upper wiring 224 is connected to an upper end portion of the via 222. The upper wiring 224 has a pad portion 242 connected electrically to the light receiving element 204.
The solder resist 226 has opening portions that expose the pad portions 241, 242. The solder resist 226 is provided on the insulating layer 218 to cover portions of the upper wirings 223, 224 except the pad portions 241, 242.
The lower wirings 228, 229 are provided on a lower surface 211B of the substrate main body 211. The insulating layer 231 is provided on the lower surface 211B of the substrate main body 211 to cover the lower wirings 228, 229. The via 233 is provided to pass through the insulating layer 231 arranged under the lower wiring 228. An upper end portion of the via 233 is connected to the lower wiring 228. The via 234 is provided to pass through the insulating layer 231 arranged under the lower wiring 229. An upper end portion of the via 234 is connected to the lower wiring 229.
The lower wiring 236 is provided on a lower surface of a portion of the insulating layer 231 corresponding to a forming position of the via 233. The lower wiring 236 is connected to a lower end portion of the via 233. The lower wiring 236 has an external connection pad portion 245. The lower wiring 237 is provided on a lower surface of a portion of the insulating layer 231 corresponding to a forming position of the via 234. The lower wiring 237 is connected to a lower end portion of the via 234. The lower wiring 237 has an external connection pad portion 246.
The solder resist 239 has opening portions that expose the external connection pad portions 245 and 246. The solder resist 239 is provided on the insulating layer 231 to cover portions of the lower wirings 236, 237 except the external connection pad portions 245, 246.
The optical waveguide 202 is bonded to the solder resist 226 with an adhesive agent. The optical waveguide 202 includes: an optical waveguide main body 251 constructed by stacking a cladding layer 255, a core portion 256 and a cladding layer 257; a mirror 253 provided on an inclined surface 251A of the optical waveguide main body 251; and a mirror 254 provided on an inclined surface 251B of the optical waveguide main body 251.
FIG. 2 is a sectional view showing a portion, to which the light emitting element shown in FIG. 1 is connected, of the optical/electrical hybrid substrate in an enlarged manner.
By reference to FIG. 1 and FIG. 2, the light emitting element 203 has a terminal 261 and a light emitting portion 262 for emitting a light signal. The terminal 261 is fixed to the pad portion 241 by a solder 264. The light emitting portion 262 is arranged over the mirror 253 to oppose to the mirror 253 provided to the core portion 256. A light signal emitted from the light emitting portion 262 is reflected to the core portion 256 by the mirror 253.
As the characteristics of an optical/electrical hybrid substrate 200, it is important that a transmission loss of the light signal between the light emitting element 203 and the optical waveguide 202 should be small. In order to reduce a transmission loss of the light signal between the light emitting element 203 and the optical waveguide 202, it is important that a distance R1 from a center position S1 (a center position on an optical axis) of the mirror 253 provided to the core portion 256 to a center position of the pad portion 241 should be set to a predetermined distance RA and also a distance N1 from the light emitting portion 262 to the center position S1 (the center position the optical axis) of the mirror 253 provided to the core portion 256 should be set to a given distance NA.
FIG. 3 is a sectional view showing a portion, to which the light receiving element shown in FIG. 1 is connected, of the optical/electrical hybrid substrate in an enlarged manner.
By reference to FIG. 1 and FIG. 3, the light receiving element 204 has a terminal 266 and a light receiving portion 267 for receiving the light signal. The terminal 266 is fixed onto the pad portion 242 by the solder 264. The light receiving portion 267 is arranged over the mirror 254 to oppose to the mirror 254 provided to the core portion 256. The light receiving portion 267 is provided to receive the light signal reflected by the mirror 254.
As the characteristics of the optical/electrical hybrid substrate 200, it is important that a transmission loss of the light signal between the light receiving element 204 and the optical waveguide 202 should be small. In order to reduce a transmission loss of the light signal between the light receiving element 204 and the optical waveguide 202, it is important that a distance R2 from a center position S2 (a center position on an optical axis) of the mirror 254 provided to the core portion 256 to a center position of the pad portion 242 should be set to a given distance RB and also a distance N2 from the light receiving portion 267 to the center position S2 (the center position on the optical axis) of the mirror 254 provided to the core portion 256 should be set to a given distance NB.
The underfill resin 206 is a translucent resin capable of transmitting the light signal, and is provided to fill a clearance between the light emitting element 203 and the wiring substrate 201 and the optical waveguide 202. The underfill resin 207 is a translucent resin capable of transmitting the light signal, and is provided to fill a clearance between the light receiving element 204 and the wiring substrate 201 and the optical waveguide 202.
FIG. 4 to FIG. 7 are views showing steps of manufacturing the optical/electrical hybrid substrate in the related art. In FIG. 4 to FIG. 7, the same reference symbols are affixed to the same constituent portions as those of the optical/electrical hybrid substrate 200 in the related art.
By reference to FIG. 4 to FIG. 7, a method of manufacturing the optical/electrical hybrid substrate 200 in the related art will be described hereunder. At first, in steps shown in FIG. 4, the wiring substrate 201 is formed by the well-known approach.
Then, in steps shown in FIG. 5, the optical waveguide 202 is formed by the well-known approach. Concretely, the cladding layer 257, the core portion 256, and the cladding layer 255 are stacked sequentially on a supporting substrate (concretely, a substrate made of a resin). Then, both end portions of the structure composed of the cladding layer 257, the core portion 256, and the cladding layer 255 are cut by the dicing blade to form the inclined surfaces 251A, 251B. Then, the mirrors 253, 254 are formed by forming a metal film on the inclined surfaces 251A, 251B, and then the supporting substrate is removed. Thus, the optical waveguide 202 is formed.
Then, in steps shown in FIG. 6, the optical waveguide 202 is bonded onto the solder resist 226 of the wiring substrate 201. Then, in steps shown in FIG. 7, the light emitting element 203 and the light receiving element 204 are mounted on the wiring substrate 201, and then the underfill resins 206, 207 are formed. Thus, the optical/electrical hybrid substrate 200 is manufactured (see JP-A-2001-281479, for example).
However, in the optical/electrical hybrid substrate 200 in the related art, the terminal 261 of the light emitting element 203 and the terminal 266 of the light receiving element 204 are connected to the pad portions 241, 242 of the wiring substrate 201 manufactured separately from the optical waveguide 202, respectively. Therefore, it was difficult to position the optical waveguide 202, the light emitting element 203, and the light receiving element 204 on the wiring substrate 201 with good precision such that the distance R1 from the center position S1 (the center position on the optical axis) of the mirror 253 to the center position of the pad portion 241, the distance N1 from the light emitting portion 262 to the center position S1 (the center position on the optical axis) of the mirror 253, the distance R2 from the center position S2 (the center position on the optical axis) of the mirror 254 to the center position of the pad portion 242, and the distance N2 from the light receiving portion 267 to the center position S2 (the center position on the optical axis) of the mirror 254 coincide with the given distances RA, NA, RB, NB respectively.
As a result, such a problem existed that a transmission loss of the light signal between the light emitting element 203 and the optical waveguide 202 and a transmission loss of the light signal between the light receiving element 204 and the optical waveguide 202 are increased.

Optical waveguide and method of manufacturing the same, and method of manufacturing optical/electrical hybrid substrate


A battery charger having a battery charger converter, which converter consists of a battery voltage detector for detecting the voltage of a secondary battery and a differential amplifier disposed between the battery voltage detector and an A/D converter. This battery charger is capable of reliably detecting when any battery has become fully charged, including inactive batteries such as batteries that are still warm from recently being discharged and batteries that have been inactive for a long period of time.

1. Field of the Invention
The present invention relates to a battery charger for charging a secondary battery, such as a nickel cadmium battery, which battery charger is capable of rapidly and reliably charging a variety of batteries with varying cell numbers.
2. Description of the Prior Art
U.S. Pat. No. 4,998,057 describes a technology for rapidly and reliably charging a variety of secondary batteries with varying cell numbers. This technology includes a plurality of voltage division resistors having different resistances. The voltage division resistors are used to divide the voltage across the battery. A relevant voltage division resistor is selected by a microcomputer depending on the battery voltage so that an input voltage applied to an A/D converter may fall within a predetermined range regardless of the number of cells, that is, regardless of the battery voltage.
With this technology, the fully charged condition of the battery can be accurately detected by a so-called -.DELTA.V detection method in which charging of the battery is stopped when a predetermined voltage drop (-.DELTA.V) is detected after the voltage of the battery in the charging process reaches the peak. This technology can also be used in conjunction with other methods for detecting the fully charged condition of the battery, such as a method for stopping charging before the battery voltage reaches the peak or a second order differential detection method. The former method is advantageous in preventing the battery from being overcharged and improving the recharging cycle life of the battery, that is, the number of times the battery can be charged. The latter method uses a second order differential of the battery voltage during charging process differentiated by time. When the second order differential of the battery voltage becomes negative, it is determined that the battery voltage has reached the peak.
Among others, the second order differential detection method, which allows fewer overcharges than the -.DELTA.V detection method, is gradually becoming the main detection method in use. The second order differential detection method increases the cycle life of batteries by allowing fewer overcharges than the -.DELTA.V detection method, decreasing the number of times pressure increases occur in the battery as a result of oxygen gas being generated in the final stages of charging. Further, leakage of electrolytic solution in the battery is decreased through the operation of a safety valve included in the battery. The second order differential detection method is particularly widely used for charging batteries in which charging and discharging is performed with a large current, as is with the batteries in electric tools.
However, when charging inactive batteries, such as batteries that are new or have been left unused for a long period of time, the amount of voltage change is small, and such batteries are, therefore, very difficult to determine the fully charged condition using the second order differential detection method.
FIG. 3 is a graphical representation showing a battery voltage during the charging process and also a digital value corresponding to the voltage increase. The battery voltage is sampled at a predetermined time interval, and the voltage sampled is converted by an 8-bit A/D converter to a digital value ranging from 0 to 255 in decimal notation. The new digital value of the battery voltage is compared with a previous digital value and the increase in the digital value corresponding to the voltage increase is shown in the graph of FIG. 3.
As seen in this graph, the rise in voltage over time when charging an inactive battery is gentle in comparison to that of an active battery, shown in FIG. 5. The voltage in the final stage of charging the inactive battery peaks slowly, and since the amount of voltage change is small, it is not possible to reliably detect that the battery has reached the fully charged condition using the second order differential detection method to determine when the second order differential of the battery voltage becomes negative. As shown in FIG. 3, the digital value representing the voltage increase of the inactive battery is only 1. This example uses a 10-cell battery. The voltage developed across the battery is subjected to a voltage division with a ratio of 0.203. Therefore, the voltage increase corresponding to one digital value would be 5/0.203.times.1/255 =96.6 mV, or 9.66 mV/cell where the reference voltage of the 8-bit A/D converter is 5 volts. In this example, the second order differential value for the battery voltage is determined negative when the voltage drops from 1 to 0 in digital value. Since such change in the digital values occurs frequently from the beginning of the charging process, a fully charged condition of the battery cannot be reliably detected. Hence, in order to reliably detect a full charge by determining when the second order differential value of the battery voltage becomes negative, the converted voltage increase must be at least 2 in digital value. The charging process would then be stopped when the converted voltage drops at least 2 in digital values. In this case, a full charge cannot be reliably determined when charging an inactive battery.
FIG. 4 shows the charging of a battery that is warm because it is just after discharge. The voltage of this battery in the final stage also peaks slowly. For the same reasons as described above, a charging control method that detects a negative change in voltage cannot reliably detect the amount of voltage change with the limited resolution of an A/D converter.
In recent years, the demand to replace nickel cadmium batteries with nickel hydrogen batteries has grown in response to a need for higher capacity. Still, nickel hydrogen batteries have the same problems as described above, because the peak at full charge is not as sharp as nickel cadmium batteries.
Further, for a universal battery charger designed to charge batteries with varying cell numbers, for example all batteries with an even number of cells from a 4-cell battery to a 20-cell battery, a total of nine voltage division ratio settings are required. Naturally, in order to select one of the voltage division resistors to suit a battery voltage using a microcomputer, the microcomputer must be equipped with nine output ports, increasing the number of pins in the microcomputer and, as a result, increasing the size of the microcomputer.

Battery charger capable of charging a variety of batteries with varying cell numbers


A method to reduce the viscosity of viscosified treatment fluids is disclosed herein. The method includes a water soluble polymer as viscosifying agent, preferably a synthetic water soluble polymer, optionally a crosslinker for the water soluble polymer, a breaker system containing an organic peroxide, mixing the viscosified treatment fluid and the breaker composition and allowing the viscosified treatment fluid and the breaker composition to interact whereby the viscosity of the viscosified treatment is reduced. The application of the process in the production of oil and gas is also discussed.

The present invention relates to a method to reduce the viscosity of viscosified treatment fluids comprising a water soluble polymer as viscosifying agent, preferably a synthetic water soluble polymer, optionally a crosslinker for the water soluble polymer, a breaker system containing an organic peroxide, mixing the viscosified treatment fluid and the breaker composition and allowing the viscosified treatment fluid and the breaker composition to interact whereby the viscosity of the viscosified treatment is reduced. The invention also relates to the application of the process in the production of oil and gas.
The resources for fossil fuels are highly exploited and also limited. With new and improved technologies these resources for oil and gas can be further exploited and unconventional reservoirs can be accessed. With the increasingly challenging conditions for the oil and gas production the requirements for the equipment and the chemicals also become more and more demanding.
Viscosified fluids are very common and widely used in almost all processes of the oil and gas production. They are applied for very different purposes and have to ensure various properties of the fluid:                In drilling the bore hole a mud is circulated that lubricates and cools the drill head, disperses the cuttings and transports them upwards.        In cementing the casing the fluid has to ensure a homogeneous transport of the cement particles downhole and to prevent sedimentation until the mixture is hardened.        Fluids are viscosified to reduce friction caused by turbulent flow.        Enhanced oil recovery of highly exploited formations can be achieved by flooding with viscosified water.        Viscosified fluids are applied in water bearing formations to control the water and oil flow (relative permeability modifier) or to separate water rich area form oil containing area (water shut off)        In well stimulation processes viscosified fluids transport solid particles (proppants) downhole into freshly created cracks in the formation. They prevent the sedimentation of the proppants and possibly blockade of the bore hole.                    Viscosified acids are also used in well stimulation processes. So it is ensured that the acid reacts slowly and can reach the desired regions especially in horizontal wells.
Water based fluids are typically made viscous by the addition of water soluble polymers. The polymers can be natural based polymers or synthetic polymers. The polymers fulfil various tasks. Amongst others they function as rheology modifier, fluid loss additive, friction reducer, viscosifier or precursor for crosslinked hydrogels.
As natural based polymers typically polysaccharides or modified polysaccharides are used. For instance, suitable hydratable polysaccharides include starch or its derivatives, galactomannan gums, glucomannan gums, cellulosic derivatives, preferably carboxymethyl cellulose; cellulose ether, preferably hydroxyethyl cellulose; guar gums or its derivatives, preferably hydroxyalkyl guar, carboxyalkyl guar, and carboxyalkyl hydroxyalkyl guar or hydrophobically modified guar alginates, carrageenans, tragacanth gums, glucan gums and xanthan gums.
All the natural based polymers have in common that due to their glycosidic bonds they are not stable at elevated temperatures and under acidic conditions. They are also easily attacked and degraded by bacteria and their dispersions and solutions have to be protected by biocides even when they are handles or stored only for short periods of time. Furthermore the availability of natural based polymers may depend on weather conditions and crop yield. This dependence impacts the availability and the price of natural based polymers.
Therefore often synthetic polymers based on acrylamide are used for applications in the oil and gas production as substitutes for natural based polymers. They are independent from bad weather conditions and distinguish themselves with marked better temperature and chemical stability and resistance against bacterial degradation.
Acrylamide can be copolymerized with a broad variety of monomers to adjust the properties of the resulting water soluble polymer. Amongst others, ethylenically unsaturated carboxylic, sulfonic or phosphonic acids, their esters, unsubstituted or N- and N,N-substituted derivatives of amides of ethylenically unsaturated carboxylic acids, N-substituted (cyclic) derivatives of ethylenically unsaturated amides can be used.
The viscosity of fluids containing polymers as thickener can be further increased by crosslinking the polymer chains to form a hydrogel, that is a three dimensional network of extremely high molecular weight.
Typically, polyvalent cations of group IIIA, IVB, VB, VIB, VIIB and/or VIIIB of the periodic table of the elements are used as crosslinking compound, preferred are compounds of boron, zirconium, titanium, aluminum or chromium, for both synthetic polymers and natural polymers.
The viscosity of the viscosified fluids or of the crosslinked hydrogels may range from almost as thin as water (1 mPas) to several 1000 mPas.
For some applications it is necessary to reduce the viscosity of the fluid after a desired time. Especially in well stimulation processes the viscosity of the frac fluid is reduced to ensure the removal of the fluid from the bore hole to prevent blockage of the pores and fractures by the highly viscos gel and to minimize formation damage.
For the reduction of the viscosity of the fluid typically the water soluble polymer is degraded by so called breakers. The breakers cleave the high molecular polymer chain into fragments of lower molecular weight and/or deactivate the crosslinking compound.
Solutions of high molecular weight polymers show a high viscosity. Cleaving bonds in the polymer chain gives fragments of lower molecular weight; the viscosity of their solution is reduced. The viscosity of polymer solutions is therefore related to the molecular weight of the polymer.
Analytically the degradation of the polymer chain or network can be characterized by rheological methods in determining the viscosity of the polymer solution. As polymer solutions typically are non-Newtonian fluids it is important to compare the results only when the methods for the determination of the viscosity were exactly the same.
The polymer degradation can be followed either directly in a rheometer or by determination of the viscosity of the polymer solution before and after breaking treatment.
Typically, oxidizers, enzymes or acids are used as breakers.
Enzymes are generally used for naturals based polymers in a low temperature range from about 20° C. to 70° C. At higher temperature they denature and become ineffective. Enzymes break selectively glycosidic linkages in polysaccharides, so very specific types of enzymes are used for different types of naturals based polymers. At lower temperature the reaction rate becomes very slow.
Acids also break the glycosidic linkage by hydrolysis. However the breaking process is difficult to control, the chemical compatibility with the viscosified fluid and its additives is difficult and corrosion of the metal equipment may occur.
Synthetic polymers, especially polyacrylamide based polymers are much more stable compared to natural based polymers. Polyacrylamide based polymers are considered to be very resistant towards thermal, acidic, enzymatic or biological degradation. Therefore they typically are used at high temperatures or otherwise harsh conditions. Under harsh conditions oxidative breakers are able to degrade also synthetic polymers.
The use of oxidative breakers is described in the literature for natural based polymers as well as for synthetic, polyacrylamide based polymers. In the literature a broad variety of oxidative breakers is described, e.g. persulfates, perborates, percarbonates, peroxides, bromates, chlorites. The oxidative breakers have in common that they are able to release hydrogen peroxide that is a strong oxidizing agent. The polymer chain is degraded by oxidative processes.
Typically persulfates are used in the low temperature range up to about 100° C. (212° F.). Sodium persulfate, ammonium persulfate, potassium persulfate are by far the most common oxidative breakers. The work properly in the temperature range that is also ideal for the application of natural based polymers as guar or hydroxypropyl guar for hydraulic fracturing.
At higher temperatures persulfates decompose too fast. At temperatures above 100° C. (212° F.) often bromates are applied. Their use is also described for synthetic polymers at very high temperatures above 150° C. (302° F.). Typical operation conditions of breakers are given for example in G. A. Al-Muntasheri, SPE Wetern North American and Rocky Mountain Joint Regional Meeting, Denver, Colo., USA, 16-18 Apr. 2014, SPE169552.
For every application the breaker must meet the specific needs. In hydraulic fracturing processes it is important that in the beginning the viscosity of the fluid is high and remains stable for a given time to ensure a proper transport of the proppants into the freshly created fractures. Only after proppant placement the viscosity of the frac fluid should decrease. It is desirable that the viscosity of the fluid then reaches values similar to water in a short time. Furthermore no residues should be left over that could block the fractures and diminish the flow of oil or gas.
The effectivity of every substance that is used as a breaker depends strongly on the conditions, especially on temperature, pH-value and concentrations of the breaker itself as well as of the polymer. Some of the conditions are given by the application and cannot be changed, for example the borehole temperature. Some conditions can be altered at least within certain limits to ensure an effective degradation of the polymers, for example the breaker concentration or the well closure time.
Especially the temperature is important for the breaker effectivity. The rate at which a persulfate molecule breaks into two radicals is temperature dependent. Typically, below 120° F. (49° C.) this process occurs very slowly, and the reaction must be catalysed to obtain acceptable break rates. A variety of catalysts, including various organic amines and inorganic materials, may be used for persulfate breakers. The optimum pH value for persulfate oxidation is around pH 10 at low temperatures (less than 150° F. or 66° C.). Above approximately 200° F. (93° C.), persulfate decomposes fast and cleaves the polymer chains very quickly (i.e. without delay in the breaking process). Therefore, persulfate is typically not recommended as breaker above 200° F. (93° C.).
Therefore, breakers and the breaking conditions must be selected carefully. Premature reduction of viscosity during pumping of the frac fluid can jeopardize the treatment. Width and length of the fractures is influenced in unknown extent and the proppant placement within the fractures is not ensured. On the other hand, inadequate reduction of the fluid viscosity after the pumping can also lead to severe reduction of oil and gas flow due to resistance of the viscous fluid.
The effect of breakers can be adjusted. For higher temperatures breakers can be encapsulated which allows release only after some time and early polymer degradation is prevented thereby.
For lower temperatures the use of activators is reported in the literature.
It is known from bleaching in laundry and cleaning processes that activators for bleaching agents, e.g. sodium perborate and sodium percarbonate can be used to enable an effective process at low temperatures. Typical activators are mainly N- and O-acyl compounds. They are able to react with hydrogen peroxide that is released from the bleaching agents and form very active peracids.
The most common activator is tetraacetyl ethylendiamine (TAED) that reacts with hydrogen peroxide from the bleaching agent to form peracetic acid. Nonanoyloxy benzenesulfonate (NOBS), dodecanoyl oxybenzenesulfonate (LOBS) or decanoyl oxybenzoic acid (DOBA) allow even lower temperatures. A great variety of N- and O-acyl compounds is claimed as activator for persalts in the open and patent literature, e.g. U.S. Pat. No. 4,412,934 or G. Reinhardt, 5th World Conference on Detergents, edit. A. Cahn, AOCS Publishing, 2003, p. 69 to 74.
Activators are also described for oxidative breakers for processes in the oil and gas production.
U.S. Pat. No. 7,923,417 claims a method for degrading xanthan at temperatures below 38° C. (100° F.) by using a breaker system comprising a source of hydrogen peroxide and a water soluble alkanoyl donor compound. The activator is selected from the group consisting of ethyl acetate, ethyl acetoacetate, tetraacetylethylendiamin, sodium nonanoyloxybenzenesulfonate and their combinations.
U.S. Pat. No. 8,415,278 also describes a breaker system for xanthan, diutan and succinogycan gums comprising a source of hydrogen peroxide and a water soluble alkanoyl donor compound. The activator is selected from tetraacetylethylendiamin, sodium nonanoyloxybenzenesulfonate and their combinations. The method is useful for applications when the temperature of the formation is less than 38° C. (100° F.).
Hydrogen peroxide released from breaker substances can also be activated by transition metal complexes. They catalyse the formation of superoxide or hydroxyl radical, the latter one is one of the most powerful oxidation compounds known having an oxidation potential of about 2.8 Volt, as reported by Wardman, J. Phys. Chem. Ref. Data, Vol. 18, No 4, 1989, 1637 ff.
U.S. Pat. No. 7,928,040 claims a method for degrading xanthan at temperatures below 38° C. (100° F.) by using a breaker system comprising a source of hydrogen peroxide and a chelated transition metal, a chelating agent and a transition metal and their combinations. The chelation agent comprises EDTA, alkali metal salt of EDTA, alkali metal citrate, citric acid, iminodiacetic acid, gluconate, NTS, tetraamidomacrocyclic ligand or their combinations.
Persulfates can also be activated by strong bases. At high pH the peroxodisulfate anion decomposes forming molecular oxygen.
U.S. Patent Application No. US 2013/0098611 describes the activation of persulfate by strong bases for the low temperature breaking of fluids viscosified with water soluble synthetic polymers.
All attempts to enable breaking of polymers at low temperatures therefore have in common that reactions are initiated which increase the oxidation potential of the breaker.
U.S. Patent Application No US 2013/0324445 describes the use of organic peroxides as breaker to reduce the viscosity of fluids gelled with polymers. The organic peroxides are dissolved in a non-aqueous oil phase and dispersed as micro-emulsion or nano-emulsion in an aqueous fluid. The micro-emulsion or nano-emulsion is then added to the aqueous fluid with a high viscosity due to gelling with a polymer. To stabilize the micro-emulsion or the nano-emulsion the non-aqueous oil phase contains at least one surfactant. It is claimed that the formulation has a delayed break profile.
The vast number of literature on breaking of polymers in treatment fluids for oil and gas production and especially on activation of breakers for low temperature makes clear that there is a wish for further improvement. This is especially required for the breaking of synthetic polymers that are much more stable compared to natural based polymers and therefore much more difficult to degrade chemically.
Further challenge for breaking polymers in treatment fluids is the use of formation water or produced water to save fresh water. Typically formation water or produced water contain salts, especially sodium, potassium, calcium and magnesium chlorides, solids and organic compounds that may be dissolved or emulsified. Even after treating those brines for reuse e.g. by filtration salts and dissolved organics remain in the treated water and may cause additional concern when polymers in such natural brines are degraded by oxidative processes.
Strong oxidizing compound are consumed by chloride to form chlorine. Chlorine further reacts aggressively with organic compound. Depending on the condition this may help to degrade the polymer but also can give chlorinated organic compounds. Chlorine also attacks metallic parts of the equipment and may cause severe corrosion.
Strong oxidizing compound can further oxidize Fe(II) being present in formation water or produced water to Fe(III) that can act as crosslinker ion. Therefore the crosslinking of polymers might be influenced by this side reaction and lead to crosslinking even when it is not desired or to gels with unwanted viscosities.
Furthermore the oxidative breaker is consumed by the dissolved organic compounds that are also degraded by oxidative processes. So a larger quantity of breaker is needed to degrade the polymer compared to treatment fluids with fresh water.

Method for reducing the viscosity of viscosified fluids for applications in natural gas and oil fields


According to one embodiment, an apparatus includes a directed energy device configured to direct energy onto a remote target under control of a controller. The receives a distance measurement to the target using a rangefinder, determines whether the target is within an expected range; and modifies a power output of the directed energy device when the target is not within the expected range.

Directed energy devices include those devices that project an energy beam to a remotely located target. Examples of directed energy devices include lasers that project light beams, proton beam generating devices that project proton beams, and microwave beam generating device that generates a beam of radio-frequency (RF) energy.
Lasers are one particular type of directed energy device that has been developed for several different purposes. For example, High energy lasers (HELs) are a particular type of lasing devices configured to direct a large amount of light energy for destroying or otherwise disabling a target. Other types of lasers also include target designators or dazzlers. Target designators modulate its light beam with a signal that is used by a targeting element of a weapon, such as a smart bomb or missile for directing the weapon to its intended target. Dazzlers generate light beams with sufficient energy to temporarily blind or disorient its target.

Directed energy beam power control system and method


An electronic structure includes an electronic device coupled to a substrate by conductive bumps and ball limiting metallurgy (BLM). Underfill material having filler particles is disposed in a space between the electronic device and the substrate. A weight percentage of the filler particles is at least about 60%. A particle size of at least 90 wt % of the filler particles is less than about 2 μm and/or the filler particles are coated by an organic coupling agent. Once the underfill material is fully cured, its coefficient of thermal expansion is no more than 30 PPM/° C., and its glass transition temperature is at least 100° C., and its adhesion to a passivation layer of the electronic device, to the substrate and to the electronic device at its edges is such that the electronic structure passes standardized reliability tests without delamination of the ball limiting metallurgy.

Flip chip microelectronic assembly is the direct electrical connection of face-down (hence "flipped") electronic devices onto substrates by way of conductive bumps on the chip bond pads. The electronic devices are typically semiconductor devices, but may be passive filters, detector arrays, and microelectromechanical system (MEMS) devices. Flip chip is also known as Direct Chip Attach (DCA), since the chip is directly attached to the substrate by the conductive bumps.
The conductive bumps may be attached to the electronic device by ball limiting metallurgy (BLM), also known as under bump metallurgy (UBM) and pad limiting metallurgy (PLM).
Once the electronic device is attached to the substrate, mechanical strains may occur that, over time, result in damage to the conductive bumps and/or to the BLM and/or to a passivation layer of the electronic device.
A non-conductive underfill material introduced to the space between the electronic device and the substrate may protect the bumps from moisture or other environmental hazards, may provide additional mechanical strength to the electronic structure, and may compensate for any thermal expansion differences between the chip and the substrate.
It will be appreciated that for simplicity and clarity of illustration, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity.

Underfill material to reduce ball limiting metallurgy delamination and cracking potential in semiconductor devices


A method to minimize applying joint compound and sanding by illuminating an area of the gypsum board to show anomalies thereon includes a step of providing a plurality of wireless lighting devices operable by a common remote controller, a step of removably attaching these devices in a spaced-apart arrangement and using the remote controller to energize all lighting devices to identify remaining anomalies. All lighting devices are turned off once the next coat of joint compound is applied and then turned on after it dries to illuminate the remaining surface anomalies. Operation of lighting devices is accomplished without removing or repositioning thereof to assure consistency of illumination over the entire work period.

In building construction, different types of claddings are used as panels for forming interior walls as well as ceiling surfaces. For simplicity, as used herein, it will be understood that the term "wall" also encompasses ceilings. Typically, the claddings are in the form of boards (also referred to as panels) affixed to framing members such as room framing arrangements known in the art. Examples of claddings include gypsum board faced with paper, fibrous mats (e.g., fiberglass), and the like. The use of gypsum board panels, also referred to as "sheetrock" or "drywall", became the preferred building practice for making interior walls and partitions in most types of buildings in the United States, primarily because of their relatively low cost, both of material as well as installation. These panels are essentially made of a hardened plaster-like gypsum material sandwiched between sheets of paper or cardboard material. All of these one or more panels are generally referred to as a "gypsum board" for the purposes of this description.
Sheetrock panels are typically nailed or screwed to spaced apart wooden studs or joists to provide a flat wall or ceiling surface which spans these wooden supporting studs, leaving the space between the studs or joists hollow behind the wall surface. These and other types of boards are typically cut to appropriate dimensions and then fastened to the framing members using screws, nails, or the like to form extended and continuous wall sections formed from multiple boards.
The surface of gypsum board wall sections is normally finished to provide aesthetically pleasing, uniform, and protected continuous surfaces. This is typically done by filling irregularities and indentations, such as those in the areas where nails or screws have been driven through the face of the panel. The small gaps between panels are similarly filled and taped over using paper tape which is sufficiently wide to bridge the gap between panels and which is held in place by the filler material. The filler used for this purpose is referred to as a "joint compound" or a "drywall compound," a mud-like material that is smoothed into place and allowed to dry and harden. However, even the dried filler material has relatively little structural integrity and provides primarily the cosmetic benefit of a smooth wall or ceiling surface. The filler material by itself also has a tendency to shrink while drying and is therefore susceptible to cracking, particularly where it is used in large quantities or in thick layers.
For example, two side-by-side boards disposed in the same plane will form a joint seam between them on vertical walls and horizontal ceilings. To finish the seam, joint reinforcement tape is embedded in the seam, along with a layer of a joint compound material dispensed under the tape, as well as multiple coats of joint compound applied over the tape. The installed reinforcement is then concealed with multiple layers of joint compound applied over the corner trim. Fasteners used to affix the board to framing members must also be concealed with multiple layers of joint compound applied over them. After the various joint compound applications are dried, the resulting wall surfaces can be sanded and painted to form the desired uniform and aesthetically pleasing continuous appearance.
The level of finish generally corresponds with the number of applications of joint compound to seams, trims, and fasteners. For example, level five is the highest level (on a scale from zero to five) and is usually achieved by applying a skim coat of joint compound across the entire wall surface.
The primary drawback to using gypsum board material is that a high degree of expertise and experience is required to successfully apply joint compound to these surfaces in preparation for finishing the gypsum board. Homeowners do not typically have that expertise and so it becomes difficult for a typical homeowner to achieve a high level of finish when installing a new section of drywall.
A simple, easy to use and inexpensive method for finishing sheetrock walls has eluded inventors, drywall professionals, handymen-homeowners, and building maintenance personnel, for as long as such materials have been in common use. Finishing gypsum boards can be relatively difficult, especially in the most common situation where drywall sheets are butted together with no height difference as compared to the rest of the wallboard surface.
In addition, the need for applying multiple coats of a joint compound requires that the user allows sufficient time between applications to achieve full drying of the joint compound. As the joint compound dries out, its shape may change, which creates a requirement for applying additional coats of the joint compound to eventually achieve the desired smooth finish.
Presently, gypsum board walls for new construction and remodeling applications are installed with screws and the seams are taped and spackled. The term "spackle" is used as an alternative term to describe application of a joint compound. There are roughly (36) screw heads and 12 feet of seam tape per each 4 ft×8 ft gypsum board to be spackled. Typically, (3) coats of joint compound followed by sanding are required in preparation for painting. Jobsite works lights are part of the process and are sometimes used to see where the filling and sanding are required, especially when determining how much of the joint compound to apply to even the levels of the joints and adjacent boards. With these types of work lights, the detail is mostly rendered in a two-dimensional (2-D) format with the fine details sometimes being overlooked. Additionally, moving the lights from one place to another disturbs the pattern of illumination and frequently conceals the defects that would otherwise be more visible when the locations of the lights are not disturbed.
A further difficulty with the present use of conventional construction site work lights is that the installer is frequently working in their own shadow due to the positioning of the work lights. Often surface imperfections that are not corrected before paint are visible after the job has been completed when illuminated with electric or natural light. These anomalies can be in the form of ridges and depressions as well as the edges of joint compound which have not been completely feathered out to zero.
There is a need for a novel way to pinpoint precisely where to apply joint compound prior to paint. This novel method would also reduce the amount of joint compound required and minimize or even eliminate the sanding process time. Consistent illumination of the gypsum board would also help in reducing the time to complete the project by visualizing the exact location of work without changing the lights between applications of the joint compound.

Method for minimizing and eliminating sheetrock sanding using an illuminating device


One example provides a spark plug including an axial centerline extending between a terminal end and a firing end, an insulative core including a central bore having a first diameter coincident with the axial centerline extending through the insulative core, an insulative nose proximate to the firing end, and a counter bore coincident with the axial centerline and extending axially into the insulative nose, the counter bore having a second diameter greater than the first diameter. A center electrode includes an electrode wire disposed within the central bore and having a first end extending into the counter bore, and an electrode head mechanically and electrically coupled to the first end of the electrode wire, a first portion of the electrode head seated within the counter bore to define an interface with the counter bore to provide a heat transfer path from the electrode head to the insulative core.

Spark plugs are employed in combustion chambers of combustion systems, such as within the cylinders of internal combustion engines of vehicles, for example, to ignite a pressurized air-fuel mixture therein. To increase the operational lifetime of spark plugs, hard metals, such as platinum and iridium, for example, have been increasingly used in place of nickel-copper alloys for spark plug electrodes. However, spark plugs employing such metals are costly and, in some cases, may reduce engine performance relative to so-called nickel spark plugs.

Spark plug with thermally coupled center electrode


Technologies are generally described for a multi-layer file system. In the multi-layer file system, a file is arranged into two or more data blocks respectively associated with corresponding multi-entry file indices. Each multi-entry file index can point to a location index at the beginning of a linked list (an initial entry in the linked list). The linked list may have at least one location index as an entry to identify a location in the storage device where the associated data block is stored.

Unless otherwise indicated herein, the materials described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section.
File systems in computing devices are designed to organize data by defining procedures to store, retrieve, and/or update data in hard drives, optical drives, solid state devices ("SSD"), or other computer readable storage. For example, in existing file systems, such as FAT32 and NTFS, data can be organized as files in hierarchical directories. The file systems track the files and/or directories with corresponding physical locations in a storage device to facilitate reading, writing, or performing other suitable file functions.

Computing devices with multi-layer file systems


Moisture diverters attachable to a region above the eye and below the eyebrow that prevents sweat, liquid, moisture, or the like from entering the eyes of a wearer is described. A moisture diverter may include a substrate having an inner surface facing the wearer and an outer surface facing away from the wearer. The inner surface comprises a lower adhesive section and an upper adhesive-free section, the adhesive section releasably attaches the diverter to the wearer at a point above the eye and below the eyebrow, the adhesive-free section shaped or shapeable to abut or protrude from eyebrow region of a wearer and to divert moisture away from the eye.

Living organisms require nutrients and water and give off waste from the metabolic processes. Strenuous activity increases metabolism and increases body core temperature where the body loses liquid through the lungs and skin. A thermal cooling effect is created when sweat is produced and evaporates from the skin. This mechanism is crucial in the regulation of body temperature. The surface area of the head and face contain sweat glands and produce perspiration that can collect and drip into the eye or eyes, obscuring one's ability to see clearly.
A number of known devices have been used in an attempt to keep sweat from dripping into or entering the eye or eyes, like sweatbands, hats with an absorbent browband and even eyeglass perspiration guards. Many of these devices are disposable and include an absorbent member. The main disadvantages of these prior art inventions are that they do not address the area below the eyebrow, are used mainly on the forehead, are meant to absorb sweat and when these products reach a certain saturation point of liquid absorption, they no longer perform as intended and allow excess sweat or perspiration to enter the eye or eyes. Sweat entering the eyes impairs the vision of surgeons, firefighters, police, athletes, military personnel, construction workers, tree trimmers, loggers and others who are involved in activities where clear vision is imperative to perform the task at hand and many times both hands are needed to perform that task. In addition to wearing an absorbent headband, some athletes also wear absorbent wristbands to wipe perspiration that gets past the headband and into the eye or eyes.
Headbands saturated with sweat also become heavy and sag, requiring the user to repeatedly adjust the apparatus from slipping lower on the head.
Some examples of these inventions are taught by Brown in U.S. Pat. No. 703,531, where an eye guard worn upon the forehead prevents perspiration from running into the eyes. In U.S. Pat. No. 1,084,596, Alexander teaches a perspiration band for headgear that includes a hollow tape and stiffening strip. In U.S. Pat. No. 4,626,247, Frankel teaches a sweat collecting headband worn on the forehead that channels the sweat to the runner's mouth. In U.S. Pat. No. 7,093,303, Thorson teaches a liquid absorbing component attached to eyeglasses. All of these inventions fail to address the sub eyebrow region or orbit of the eye. What is needed is a low cost, simple apparatus that contacts the skin and creates a liquid tight seal and diverting apparatus above the eye and below the brow, or above the eye and over the brow.
The diverting apparatus of the present invention directs movement of sweat or moisture away from the wearer's eye or eyes, maintaining optimum visual clarity, especially during strenuous activity. The present invention may also be used on animals such as racehorses or in instances where sweat or insects may hinder activity or vision.
Despite all the obvious inadequacies associated with the use of headbands or the like, no functional alternative exists that addresses the use of a light-weight moisture diverter that is attachable to a region above the eye and below the eyebrow of a wearer.
What is needed is a low-cost, sweat, liquid, moisture diverting apparatus that is easily manufactured and prevents sweat, liquid, moisture, or the like from entering the eye or eyes of the wearer.

Method and apparatus for diverting sweat, liquid, moisture, or the like from an eye