A driving unit for a LCD device, including: a ramp signal generating unit for dividing a ramp signal into a first ramp signal and a second ramp signal; an input register unit for sequentially storing N-bit image data; a counter unit for outputting control signals by receiving bits of image data except for the most significant bit and counting based upon the received bits; a ramp signal selecting unit for selecting the first ramp signal or the second ramp signal according to the most significant bit and outputting the selected ramp signal upon receiving the most significant bit from the input register unit; and a switching unit for sampling the first ramp signal or the second ramp signal provided from the ramp signal selecting unit by the control signals of the counter unit and outputting the sampled ramp signal to data lines.

1. Field of the Invention
The present invention relates to driving a liquid crystal display device, and more particularly, to a driving unit for a LCD device.
2. Description of the Background Art
In general, a liquid crystal display (LCD) device includes a liquid crystal display panel formed by attaching a thin film transistor array substrate to a color filter substrate with a uniform gap therebetween. A liquid crystal material fills the gap between the two attached substrates, which face each other. The LCD panel also includes a data driving unit for providing image data to the LCD panel and a gate driving unit for providing a scan signal to the LCD panel.
The thin film transistor array substrate has a plurality of data lines arranged at regular intervals in a first direction and a plurality of gate lines arranged at regular intervals in a second direction, which is orthogonal to the first direction. Pixels are defined by the gate lines and the data lines. Each pixel is provided with a switching device.
A pixel electrode and a common electrode are provided at the inner surfaces of the thin film transistor array substrate and the color filter substrate that face each others. The liquid crystal material between the thin film transistor array substrate and the color filter substrate is driven by a voltage difference between the pixel electrode and the common electrode. The brightness of an image displayed on the LCD panel changes in accordance to the voltage of an image data applied to the pixel electrode. The pixels are electrically connected to the data lines through the thin film transistors in response to signals on the gate lines. Accordingly, if the scan signal from the gate driving unit are sequentially supplied to the gate lines, the switching device of the pixels connected to the gate lines to which the scan signal are supplied are turned-on, and the data driving unit provides the pixels with image data through the data lines.
To provide viewers with a high quality image, digital image data is used so that the image data can be easily compressed and an image having a high color content and high resolution can be implemented. The digital image data can be applied to the LCD device using a ramp signal sampling method or a digital/analog converting method. A gamma correction can be more easily done on a pixel in the ramp sampling method by controlling the ramp signals as compared to the digital/analog converting method. Further, a gamma correction in the ramp sampling method does not require an analog circuit.
In the ramp signal sampling method, analog ramp signals are sampled based upon digital image data, and the sampled signals are supplied to the pixels of the LCD device. The ramp signal is a normalized waveform corresponding to the brightness change of an image according to a voltage potential of the image data applied to the LCD device. A related art unit for driving a LCD device using the ramp signal sampling method will be described in detail with reference to FIGS. 1 and 2.
FIG. 1 is an exemplary view of a unit for driving a LCD device in which the related art ramp signal sampling method is applied. As shown in FIG. 1, the related art driving unit of the LCD device includes an input register unit 12 for sequentially sampling and storing N-bit digital image data (DATA[R, G and B]) according to control signals (CS1 to CS3) of a shift register unit 10; a counter unit 20 for outputting control signals (C11 to C13) by individually counting the N-bit digital image data (DATA[R, G and B]) input from the input register unit 12 by a load signal (LOAD) and a clock signal (CLK); and switching units (SW1, SW2 and SW3) for sampling ramp signals (R_RAMP, G_RAMP and B-RAMP) respectively and outputting them to data lines (D1, D2 and D3). The operation of the related art unit of driving an LCD device having such construction will be described in detail with reference to a view showing waveforms in FIG. 2.
FIG. 2 shows graphs of ramp signals, control signals of the counter unit (shown in FIG. 1), and voltages applied to the data lines (shown in FIG. 1). First, the input register unit 12 (shown in FIG. 1) sequentially samples and store N-bit digital image data (DATA[R, G and B]) according to the control signals (CS1 to SC3) of the shift register unit 10. Then, the counter unit 20 receives the N-bit digital image data (DAT[R, G and B]) from the input register 10 by the load signal (LOAD), individually counts each bit of the N-bit digital image data (DATA[R, G and B]) by the clock signal CLK and outputs the control signals (C11 to C13). The N-bit digital image data (DATA[R, G and B]) input from the input register 10 by the load signal is stored in a storage latch formed in the counter unit 20.
In the case that the 6-bit digital image data (DATA[R]) is input into the counter unit 20 as '000100', the counter unit 20 is driven by the clock signal (CLK) and counts the digital image data until '000000' becomes '000100', and outputs the control signal (C11), which is at a high potential during the counting of the image data and transitions to a low potential when the counting is completed. In the case the 6-bit digital image data (DATA[R, G and B]) is provided as '100110', the counter unit 20 is driven by the clock signal (CLK) and counts the digital image data until '000000' becomes '100110', and outputs the control signal 12 as a high potential during the counting of the image data and transitions to a low potential when the counting is completed. In addition, when the 6-bit digital image data (DATA[R, G and B]) is provided as '111111', the counter unit 20 is driven by the clock signal (CLK) and counts the digital image data until '000000' becomes '111111', and outputs the control signal 13 as a high potential during the counting of the image data and transitions to a low potential when the counting is completed.
Meanwhile, the switching units (SW1, SW2 and SW3) receive the control signals (C11, C12 and C13) individually from the counter unit 20 and are turned-on by the high potential control signals (C11, C12 and C13) such that sample waveforms of the ramp signal (R_RAMP, G-RAMP and B_RAMP) are supplied to the data lines (D1, D2 and D3). The highest potential of the sampled waveforms (R_RAMP, G-RAMP and B_RAMP) according to digital information of the N-bit digital image data (DATA[R, G and B]) is set as a pixel voltage and then supplied to the data lines (D1, D2 and D3). The sample waveforms are provided to the pixels of the gate lines turned-on by a scan signal as well as the pixel voltage, which is maintained for one frame.
In the LCD device using the ramp signal sampling method, a gamma correction on the pixels can be easily performed in comparison to the LCD device using a digital/analog converting method. That is, in the LCD device using the digital/analog converting method, the value of a resistance in an analog device has to be precisely adjusted. However, in the LCD device using the ramp signal sampling method, waveforms of a ramp signal supplied to a pixel can be changed such that the gamma correction can be easily performed.
In addition, the LCD device employing the ramp signal sampling method is not largely affected by characteristic differences of transistors as compared to the LCD device employing the digital/analog converting method, which samples the digital image data as an analog form and applies it to the pixels. That is, the LCD device using the digital/analog converting method requires an analog circuit such as an operational amplifier (OP-AMP) for converting a digital signal to an analog signal. Since the operational amplifier is very sensitive to characteristic differences of the transistors, it has a high offset voltage and consumes much power. However, since the LCD device using the ramp signal sampling method samples the ramp signal having an analog form according to the digital image data and applies the sampled ramp signal to the pixel, an LCD device using the ramp signal sampling method does not require the analog circuit such as an operational amplifier and is not largely affected by differences in the characteristics of the transistors.
To display a high-definition image using the related art ramp signal sampling method, a large number of image data have to be processed. Therefore, counting using a related art counter unit for counting the digital image data for each pixel becomes complicated. Moreover, image data in one frame is counted such that the ramp signal is sampled to appropriately determine a pixel voltage to display an image. As the number of bits is increased, the correcting section is decreased. Thus, the ramp signal can be sampled before it reaches a desired level for a particular image data. Accordingly, a poor picture quality can be generated by an improper ramp signal for an image data that is processed late.

Driving unit for liquid crystal display device


A VOC (volatile organic compounds) adsorbent material is treated with a masking agent to reduce its affinity for VOC's to a level that the material can be regenerated at a predetermined low temperature which will not desorb the masking agent. Preferably, the adsorbent material is a water adsorbent desiccant which is treated with water vapor. The treated adsorbent material is used to adsorb VOC's from gas and is periodically regenerated with heated air. The desorbed VOC's may be destroyed by oxidizing, for example, with a catalyst.

Governments have become increasingly concerned with and have increasingly regulated the emissions of VOC's such as organic paint and adhesive solvents and organic fabric dry cleaning solvents. Typical organic paint solvents include MEK, xylene, toluene, isopropyl alcohol and lacquer thinner. Two methods have been used in the past to abate the discharge into the atmosphere of VOC emissions from paint spray booths. According to one method, at least a portion of the air circulated through a paint spray booth is withdrawn and passed through a burner which incinerates the VOC's. Direct incineration of the VOC's can consume a large amount of energy, since the exhausted air must be heated to approximately 1500.degree. F. to 1700.degree. F. (815.degree. C. to 925.degree. C.) during the entire time that the VOC's are emitted. Further, in colder climates it may be necessary to heat a large amount of make up air which must be supplied to the spray booth to replace the exhausted air.
A second VOC abatement method involves collection of the VOC's in a filter bed, such as a charcoal filter bed. However, the filter bed either must be frequently replaced and properly disposed of or must be periodically regenerated by desorbing the accumulated VOC's. A charcoal filter bed requires about 600.degree. F. (about 315.degree. C.) for regeneration. When a charcoal filter bed is used for collecting VOC's, there is a risk that an exothermic reaction can occur, creating sufficient heat to cause combustion. It also is known that certain adsorbent materials such as zeolite have a high molecular affinity for VOC's and other vapors and gases, and may be used as a filter material for separating components of a gaseous mixture. A zeolite filter typically requires heating to about 300.degree. F. to 350.degree. F. (about 150.degree. C. to 175.degree. C.), or more, for regeneration. Because of the intense heat required for regeneration, it was necessary to transfer a carbon filter bed or a zeolite filter bed from the adsorption location in a spray booth to a separate furnace for regeneration. Separate heat sources were required for heating the paint in the spray booth to cure the applied paint and for regenerating the filter.
It also is known that VOC's can be eliminated from a gas stream by oxidation without reaching the combustion temperature. The VOC vapor in a gas stream can be oxidized by heating and contacting with a catalyst such as platinum. Typically, the catalyst is coated on a porous substrate, such as a ceramic honeycomb or foam, which provides a very large surface area for contact with the gas. Both catalytic oxidation and incineration are effective to reduce the emitted VOC's to carbon dioxide and water before the exhaust gas is released to the atmosphere.
Spray booths are generally used, for example, in commercial shops which repaint vehicles, in order to confine paint overspray and to evacuate VOC's released during painting. Generally, the spray booth air has been exhausted to the atmosphere. Filtered spray booth air has been recirculated back to the booth only when the booth is unmanned. Preferably, a high flow of air is passed through the spray booth filtered during painting in order to maintain clean filtered air inside the spray booth to reduce the risk of paint overspray, dust and environmental contaminants from outside the booth from contacting and damaging the wet finish. The exhausted booth air is easily filtered to remove particulate overspray. However, the highest level of VOC's are released during and immediately after the paint spraying operation. The booth air could not be recirculated during spraying in a manned booth since the painter would be subjected to an increasing VOC vapor level in the booth as painting progresses. If the spray booth air is exhausted to the atmosphere, a large quantity of clean, warm make up air is required. In colder climates, the make up air often needs to be heated. Preferably, the spray booth air is maintained at about 70.degree. F. (21.degree. C.) during painting and the booth temperature may be increased significantly during the drying and baking stage. For example, the painted surfaces and the booth air may be heated to reach about 140.degree. F. to 180.degree. F. (60.degree. C. to 82.degree. C.) during drying. A paint spray booth of a sufficient size for enclosing a vehicle may have an air flow rate on the order of 10,000 cubic feet per minute (283 cubic meters per minute). To exhaust this amount of air from the booth and replace it with clean, warm make up air can consume a large amount of energy in addition to the energy required for removing the VOC's from the exhausted air. This adds significantly to the cost of painting a vehicle. Ideally, any particulates such as paint overspray and the VOC's is filtered or otherwise separated from the warm spray booth air and the warm filtered air is then returned to the booth.


Efficient evaluation of resource version history queries is enabled by using a data container storing records corresponding to links between successive versions of a resource. The records include: (a) a record identifier, (b) a predecessor identifier, (c) a successor identifier, (d) a predecessor rowset, which comprises the record identifier of each record in which the predecessor identifier in this record is the successor identifier, and (e) a successor rowset, which comprises the record identifier of each record in which the successor identifier in this record is the predecessor identifier. Depending on the nature of a request, a record is identified in which a particular version is identified by either the predecessor identifier or the successor identifier. Either the predecessor or successor rowsets are recursively read, while the predecessor or successor identifiers corresponding to each record read are added to a result set, thereby forming the ancestor or descendant version history.

A database may provide a file repository that can be accessed via a variety of file system-based interfaces, such as those utilizing HTTP/WebDAV (Web Distributed Authoring and Versioning) or NFS (Network File System). Through such interfaces to the repository, a file is located, for example, via its URL or path and the repository is exposed as a hierarchical set of files and folders (e.g., directories). Further, data-oriented access mechanisms can be used to access a file repository, which expose the repository as a flat set of files that can be queried based on file content or attributes.
Files (i.e., generally, "resources") can be versioned, for example, in order to keep a record of changes to files, to provide the option to revert to an older version of a file, and to get information on who made each change to a file and the progression of changes to the file. Thus, a version-controlled file is one whose versions are tracked by the repository. Because each version may need to be indexed and accessed as a separate entity, each version is typically stored in a separate row of a database table.
When a version-controlled file is checked out of the repository, updated and then checked back into the repository, a new version is created. This new, checked-in version is known as a successor of the old, checked-out version. Similarly, the old version is known as a predecessor of the new version. A version may have multiple successors, due to branches in the version history. Likewise, a version may have multiple predecessors, due to version merges. When a version is connected to another version by traversing one or more predecessor relations, it is called an "ancestor" of that version. When a version is connected to another version by traversing one or more successor relations, it is called a "descendant" of that version.
When tracking changes to a file, it is often necessary to find out what versions were the ancestors (or sometimes just the predecessors) of a given version and what versions were the descendants of the given version. This predecessor/descendant information assists in building a visualization of the version history tree, or parts of the version history tree, for a user. It becomes especially important in data-oriented access mechanisms, such as repository views, where one can use this functionality to restrict a given query to all versions prior to a given version, for example.
In view of the foregoing, there is a need for techniques for efficiently locating ancestors and descendants of a given version in a version history, in a repository that supports versioning of resources.
The approaches described in this section are approaches that could be pursued, but not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.

Efficient queriability of version histories in a repository


Provided are a methods and apparatuses for encoding/decoding an audio signal to efficiently encode/decode a harmonic envelope. The method of encoding an audio signal includes performing harmonic analysis with respect to an input signal to determine harmonic parameters with respect to harmonic signals; correlating the amplitudes of the harmonic signals to signals in a time domain instead of signals in a frequency domain; applying a time-frequency transformation operation to the amplitudes in the time domain to generate time-frequency transformed values in the frequency domain; and encoding the time-frequency transformed values. When expressing a harmonic envelope, the amplitudes of the harmonic signals are regarded as signals in the time domain so as to perform a time-frequency transformation and only a part from among the transformed values is selected to be encoded. Therefore, sound quality is not affected and coding efficiency greatly improves.

1. Field of the Invention
Apparatuses and methods consistent with the present invention relate to encoding of an audio signal, and more particularly, to encoding an envelope of a harmonic signal and decoding encoded data.
2. Description of the Related Art
Parametric coding is an example of a method of encoding an audio signal. Assuming that the audio signal to be encoded is formed of only sinusoidal signals and noise signals, the parametric coding method firstly extracts sinusoidal signals from the audio signal to be encoded and encodes remaining signals. In a Harmonic and Individual Lines and Noise (HILN) method which is one of the parametric coding methods, harmonic signals from among the sinusoidal signals are firstly encoded (harmonic coding), then the sinusoidal signals which are non-harmonic signals are encoded (Individual Line Coding), and finally noise signals are encoded.
The harmonic signals are referred to as the sinusoidal signals having frequency (ω, 2ω, 3ω, . . . ), that is, a multiple of frequency ω of a fundamental frequency signal or the sinusoidal signal having a predetermined correction value (ω, 2ω+ε0, 3ω+ε1, . . . ) for a multiple of the fundamental frequency signal. The correction value can be expressed by a specific equation. Since frequency is known when the harmonic signals are encoded, only amplitude and phase need to be coded and thus efficient coding is possible. The efficient coding means that information can be represented by using smaller sized data.
On the other hand, when sinusoidal signals that are not harmonic signals are encoded, the frequency, amplitude, and phase should all be encoded.
When representing the amplitudes of the harmonic signals, a Linear Predictive Coding (LPC) method is used in a HILN coding method. Encoding the amplitudes of the harmonic signals is called encoding an envelope. In envelope coding, an LPC method is used. However, a more efficient method will be suggested in the present invention.

Method and apparatus for encoding envelopes of harmonic signals and method and apparatus for decoding envelopes of harmonic signals


A method and apparatus for interfacing the motion of an object with a digital processing system includes a sensor for detecting movement of the object along a degree of freedom. A passive pneumatic or hydraulic damper is coupled to the object to provide a damping resistance to the object along the degree of freedom and resist a movement of the object. The damping resistance is provided by regulating the control of a fluid with a digital computing apparatus, thus providing a low-cost, low-power force-feedback interface that is safe for the user. The damper and sensor provide an electromechanical interface between the object and the electrical system. A gimbal or other interface mechanism can be coupled between the damper and the object. The interface is well suited for simulations or video games in which an object such as a joystick is moved and manipulated by the user.

The present invention relates generally to interface devices between humans and computers, and more particularly to computer input devices that provide force feedback to the user.
Computer systems are used extensively in the home entertainment industry to implement video games, video simulations, and the like. In the video game industry, a video game computer system displays a visual game environment to a user on a display screen or other visual output device. Users can interact with the displayed environment to play a game, experience a simulation or xe2x80x9cvirtual realityxe2x80x9d environment, or otherwise influence events depicted on the screen. Such user interaction is implemented through the use of a human-computer interface device, such as a joystick, xe2x80x9cjoypadxe2x80x9d button controller, mouse, stylus and tablet, or the like, that is connected to the computer system controlling the game environment.
One common interface device to game environments is a joystick controller. A joystick usually includes a member for the user to grasp and move in one or more degrees of freedom. The user""s manipulations of the joystick are input to the computer system and the results or effects of these manipulations are typically displayed to the user on the display screen. While a standard joystick is effective in allowing a user to input commands to a game environment, it is limited to providing only input to the game computer system. The user can receive feedback about the results of his, or her actions only through the visual medium of the display screen and, usually, the auditory medium. A standard joystick cannot itself provide feedback information to the user. For example, if the simulated aircraft that the user is controlling in a game environment collides with another aircraft, the user only receives the visual and auditory feedback that such a collision occurred. The standard joystick has no means of conveying such collision information to the user.
Joysticks and other input devices have been developed to provide tactile (xe2x80x9chapticxe2x80x9d) feedback to a user, more generally known as xe2x80x9cforce feedback.xe2x80x9d These types of joysticks can provide physical sensations to the user manipulating the joystick. Typically, motors are coupled to the joystick and are connected to the controlling computer system. The computer system can provide forces on the joystick in conjunction with gaming events by controlling the motors. Through such a joystick, the computer system can convey to the user the physical sensation of colliding into a wall, moving through a liquid, driving over a bumpy road, and other sensations. The user can thus experience an entire sensory dimension in the gaming experience that was previously absent. Force feedback joysticks can provide a whole new modality for human-computer interaction.
Force feedback input devices of the prior art have concentrated on providing maximum haptic fidelity, i.e., the realism of the tactile feedback was desired to be optimized. This is because most of the force feedback devices have been targeted at the specific needs of highly industrial applications. To attain such realism, important design concerns such as size, weight, complexity, power consumption, programming compatibility, cost, aesthetics, and safety have been sacrificed. As a result, typical force feedback mechanisms are complex robotic mechanisms which require precision components, high speed interface electronics, and expensive actuators.
To provide realistic force feedback, the devices of the prior art typically use servo motors under computer control. Pneumatic and hydraulic devices are also used as actuators in force feedback devices. In pneumatic and hydraulic devices, a source of pressurized fluid is usually coupled to a piston in a cylinder, and the flow of the pressurized fluid is controlled by a computer system to provide active forces to the user. For example, a pneumatic system is described by Burdea et al. in U.S. Pat. No. 5,143,505, in which active pneumatic actuators are provided on an interface glove to provide force feedback to a user""s fingers. These systems regulate pressurized air to generate active forces to the user.
While the potential market and applications of force feedback controllers in the home video game industry is immense, a number of concerns face the potential providers of force feedback joysticks to the general public for video game and similar applications. Foremost among these concerns is the issue of user safety. Because a force feedback device can impart physical forces upon the user, the potential for injury must be carefully addressed. One type of potential injury is an impact injury, which is caused by a driving blow to the user from the joystick handle. Equally as important are repetitive motion injuries, which are debilitative injuries that are caused by moderate jarring of the user""s hand over an extended period of game play. Such injury issues must be resolved before force feedback joysticks can be practically sold to the general public.
In the prior art feedback controllers, active forces are directly applied to the user to provide an inherently unsafe controller. In addition, high accelerations are usually produced to provide a wide range of force signal frequencies and achieve the desired high realism. However, such accelerations are even more unsafe for a user operating the device. These joysticks and other devices are thus unfit for the home market of video games and the like.
Other concerns regarding force feedback joysticks include the efficiency of manufacturing and marketing the joysticks. The cost, complexity, reliability, and size of a force feedback joystick for home use should be practical enough to mass produce the devices. In addition, aesthetic concerns such as compactness and operating noise level of a force feedback device are of concern in the home market. Since the prior art feedback controllers are mainly addressed to specific applications in industry, most force feedback mechanisms are costly, large, heavy, have significant power requirements, are difficult to program for applications. The prior art devices require high speed control signals from a controlling computer for stability, which usually requires more expensive and complex electronics. In addition, the prior art force feedback devices are typically large and noisy. These factors provide many obstacles to the would-be manufacturer of force feedback joysticks to the home video game market.
For example, the pneumatic force feedback device of Burdea et al. mentioned above includes many disadvantages to a would-be provider of force feedback devices in the home video game industry. The force feedback interface of Burdea et al. requires a large interface box including bulky pressure regulators, pressurized air supply, and a large 24-volt power supply. The active pneumatic actuators of Burdea et al. require high speed control signals to operate effectively and provide stability. Finally, Burdea et al""s pneumatic actuators can potentially be dangerous for a user when strong or unexpected forces are generated on a user of the interface.
Therefore, a safer, less expensive, less complex, more compact, more reliable, easier programmed, more aesthetic alternative to force feedback interface devices is desired for certain applications.
The present invention provides a human/computer fluid-resistance interface device that provides force feedback to a user operating the device. The device includes computer-controlled pneumatic or hydraulic dampers that provide a modulated passive damping resistance to the motion of an object that is controlled by a user. The interface device of the present invention is inherently safer for a user, requires lower power, and is less costly to produce than active actuators and other types of pneumatic/hydraulic actuators.
More particularly, an apparatus of the present invention for interfacing the motion of an object with an electrical system includes a sensor, such as a digital encoder, that detects movement of an object along a degree of freedom and develops an electrical sensor signal for the electrical system. The sensor is coupled to the object in the preferred embodiment. The apparatus also includes a passive fluid-resistance mechanism, such as a pneumatic or hydraulic damper, coupled to the object to transmit a drag to the object along the degree of freedom and resist a movement of the object. The damper is responsive to an electrical resistance signal provided by the electrical system and, with the sensor, provides an electromechanical interface between the object and the electrical system. In the preferred embodiment, the object is a joystick controller.
In the preferred embodiment, the passive damper uses air (or a different gas) flow to control the damping resistance output by the damper. In alternate embodiments, the passive damper can be a hydraulic brake utilizing liquid flow. The passive damper includes a cylinder and a piston operative to move within the cylinder. A valve is included for regulating a flow of a fluid through the cylinder, the valve being controlled by a digital computing apparatus to transmit a variable drag to the movement of the object. The valve can be an on-off valve which provides only two magnitudes of drag to the object. These two magnitudes include negligible drag when the valve is open, and maximum drag when the valve is closed to allow substantially no movement of the object along the degree of freedom. The valve can alternatively be a variable valve that provides multiple magnitudes of drag to the object. A solenoid can be coupled to the valve to control the opening and closing of the valve from the digital computing apparatus. A gimbal mechanism or slotted yoke mechanism can be coupled between the object and the damper. A play mechanism can also be coupled between the damper and the object for providing a desired amount of play between the damper and the object along the degree of freedom. The play can include rotary backlash provided by a coupling coupled to the object and having a keyed bore which is smaller than a keyed shaft that is received by the keyed bore. The keyed shaft is coupled to the damper. The desired play allows the sensor to detect movement of the object even when maximum resistive force is applied to the object.
Another apparatus for interfacing the motion of an object with an electrical system in accordance with the present invention includes a gimbal mechanism providing a first revolute degree of freedom to an object engaged with the gimbal mechanism about an axis of rotation. The gimbal mechanism includes a closed loop five member linkage in a preferred embodiment. A sensor is rigidly coupled to the gimbal mechanism for sensing positions of the object along the first degree of freedom. A braking mechanism is coupled to the gimbal mechanism to create a passive damping resistance to movement of the object along the first degree of freedom. The braking mechanism provides the damping resistance by regulating the flow of a fluid. The braking mechanism and the sensor provide an electromechanical interface between the object and the electrical system. This electrical system preferably includes a digital processing system for providing a braking signal to the braking mechanism and for receiving an electrical signal from the sensor.
The gimbal mechanism preferably provides a second degree of freedom to the object about a second axis of rotation, and a second sensor senses positions of the object along the second degree of freedom. A second braking mechanism creates a passive damping resistance along the second degree of freedom by regulating the flow of a second fluid. The braking mechanism preferably includes a piston assembly and a valve, where the piston assembly includes a cylinder and a piston operative to move within the cylinder. A piston rod couples the piston to the object and includes two ends, each end connected by a ball joint.
A method for interfacing motion of an object with an electrical system includes providing an object having a degree of freedom. Positions of the object along the degree of freedom are sensed with a sensor and electrical signals are produced from the sensor. A resistance to movement of the object is created along the degree of freedom by controlling the flow of a fluid. The degree of freedom, can be a rotary degree of freedom or a linear degree of freedom. The step of creating a resistance to the object""s movement includes coupling a passive brake to the object. The passive brake can include a piston assembly and a valve to control the flow of the fluid. In an alternate embodiment, the brake can include a piston assembly having a cylinder and a piston. An electrorheological fluid is provided in the cylinder, and a voltage is applied to electrodes in the cylinder. The voltage induces an electric field, which, in turn, controls a viscosity of the electrorheological fluid and thereby allows the flow of the fluid to be regulated. A gimbal mechanism or slotted yoke mechanism can also be included to provide two or more degrees of freedom to the object. The gimbal mechanism can be a closed loop five member linkage.
In yet another embodiment of the present invention, a system for controlling an electromechanical interface apparatus manipulated by a user includes a digital computer system for receiving an input control signal and for providing an output control signal which updates a process, such as a simulation or video game process, in response to the input control signal. A passive damper for receiving the output control signal provides a resistive force along a degree of freedom to an object coupled to the passive damper. The object is preferably grasped and moved by the user. The resistive force is based on a flow of a fluid within the passive damper, and the flow of the fluid is based on information in the output control signal. The force resists a user force applied to the object by the user along the degree of freedom. A sensor detects motion of the object and outputs the input control signal including information representative of the position and motion of the object to the digital computer system.
Preferably, the digital computer updates a simulation process in response to the input control signal and displays a simulation (or video game) to the user on a display screen. The passive damper is a pneumatic or hydraulic brake that includes a piston assembly and valve for regulating the flow of the fluid. The digital computer system preferably regulates the fluid flow by controlling the valve. Preferably, a local processor is coupled between the digital computer system and the damper/sensor that receives the output control signal from said digital computer system and provides a second output control signal to the passive damper. The local processor also receives a second input control signal from the sensor and outputs the input control signal to the digital computer system. The local processor can provide the second output control signal to the passive damper in response to the position and motion of the object. This can be accomplished independently of the output control signal from the digital computer system in a xe2x80x9creflex process. A serial interface can output the output control signal from the computer system and can receive the input control signal to the computer system. A digital to analog converter can receive the output control signal, convert the output control signal to an analog control signal, and output the analog control signal to the passive damper. The output control signal can control the resistive force on the object to simulate the object moving into an obstacle, moving over a textured surface, or moving through a damping environment in accordance with the simulation or video game.
The force feedback of the present invention is provided by passive dampers, which do not generate forces on a user but instead provide a damping resistance to the motion of a joystick moved by a user. The present invention is thus inherently safe for a user to operate, In addition, the dampers require less power and slower control signals than active actuators such as active pneumatic or hydraulic actuators and motors. In addition, the dampers are less costly and require simpler computer control electronics than other types of passive actuators. These improvements allow a computer system to have accurate control over a low-cost, safe interface providing realistic force feedback.
These and other advantages of the present invention will become apparent to those skilled in the art upon a reading of the following specification of the invention and a study of the several figures of the drawing.

Method and apparatus for providing passive fluid force feedback


Methods and nodes are disclosed for OAM configuring one or more tandem connection monitoring layers through GMPLS signaling during GMPLS sub-network connection (SNC) establishment. Additionally, methods and nodes are disclosed for OAM configuring one or more tandem connection monitoring layers through GMPLS signaling after GMPLS sub-network connection establishment, that is, for existing connections.

Traffic Engineering (TE) is a technology that is concerned with performance optimization of networks. In general, Traffic Engineering includes a set of applications mechanisms, tools, and scientific principles that allow for measuring, modeling, characterizing and control of user data traffic in order to achieve specific performance objectives.
Multiprotocol label switching (MPLS) is a scheme in a high-performance telecommunication network which directs and carries data from one node to the next node in the network. In MPLS, labels are assigned to data packets. Packet forwarding decisions from one node to the next node in the network are made based on the contents of the label for each data packet, without the need to examine the data packet itself.
A circuit switched network usually includes multiple switch nodes (also referred to as "nodes") which are arranged in a topology referred to in the art as a "shared mesh network." Within the shared mesh network, user traffic can be transported between any two locations using predefined connections specifying particular links and/or switch nodes for conveying the user traffic.
The switch nodes are each provided with a control module. The control modules of the switch nodes function together to aid in the control and management of the circuit switched networks. The control modules can run a variety of protocols for conducting the control and management (Operation, Administration and Maintenance—referred to as OAM) of the circuit switched networks. One prominent protocol is referred to in the art as Generalized Multiprotocol Label Switching (GMPLS).
Generalized Multiprotocol Label Switching (GMPLS) is a type of protocol which extends multiprotocol label switching (MPLS) to encompass network schemes based upon time-division multiplexing (e.g. SONET/SDH, PDH, G.709), wavelength multiplexing, and spatial switching (e.g. incoming port or fiber to outgoing port or fiber). Multiplexing, such as time-division multiplexing is when two or more signals or bit streams are transferred over a common channel. In particular, time-division multiplexing (TDM) is a type of digital multiplexing in which two or more signals or bit streams are transferred as sub-channels in one communication channel, but are physically taking turns on the communication channel. The time domain is divided into several recurrent timeslots of fixed length, one for each sub-channel. After the last sub-channel, the cycle starts over again. Time-division multiplexing is commonly used for circuit mode communication with a fixed number of channels and constant bandwidth per channel. Time-division multiplexing differs from statistical multiplexing, such as packet switching, in that the timeslots are returned in a fixed order and preallocated to the channels, rather than scheduled on a packet by packet basis.
Generalized Multiprotocol Label Switching (GMPLS) includes multiple types of optical channel data unit (ODU) label switched paths (LSPs) including protection and recovery mechanisms which specify predefined (1) working connections within a shared mesh network having multiple nodes and communication links for transmitting data between a headend node and a tailend node; and (2) protecting connections specifying a different group of nodes and/or communication links for transmitting data between the headend node to the tailend node in the event that one or more of the working connections fail. A first node of a path is referred to as a headend node. A last node of a path is referred to as a tailend node. Data is initially transmitted over the optical channel data unit (ODU) Label Switched Path (LSP), referred to as the working connection, and then, when a working connection fails, the headend node or tailend node activates one of the protecting connections for redirecting data within the shared mesh network. Shared Mesh Protection (SMP) is a common protection and recovery mechanism in transport networks, where multiple paths can share the same set of network resources for protection purposes.
GMPLS protocols can be used for dynamic signaling to setup or teardown Optical channel Data Unit (ODUk/ODUj) connections, which may be known as working or protecting connections. These ODUk/ODUj connections are known as Sub-Network Connections (SNC). Sub-network connections are logical connections between two or more connected nodes and may be as small as a section between two nodes. A sub-network exists within a single layer and is typically a subsection of a larger network. The entire route a signal takes through a network from headend node to tailend node may be referred to as a path.
Current GMPLS mechanisms for setting up ODUk/ODUj Label Switched Path (LSP)/Sub-Network Connections (SNCs) are detailed, for example, in RFC3473 and RFC4328, and sub-network connections are further defined in ITU-T G.805.
Both a path and a sub-network connection can be monitored for alarm and/or error conditions. A tandem connection can be defined on a path or a sub-network connection for the purpose of monitoring for alarm and/or error conditions. This monitoring is known as Path Monitoring (PM) and Tandem Connection Monitoring (TCM). Monitoring can determine signal fail (SF) and signal degrade (SD) conditions. Monitoring can also be used for fault localization, protection, and/or restoration under failure conditions. Monitoring the characteristics of a connection or path may include, for example, determining capacity, ability, defects, errors, alarms, signal fail conditions, signal degrade conditions, fault localization, connection protection, and/or connection restoration. Other characteristics of the connection may be monitored as well.
Activation and deactivation of tandem connections requires a sequence of configuration steps at one or more nodes. Activation of monitoring in a node, for example—activation of a Tandem Connection Monitoring layer, creates an entity within the node. Tandem connections are further explained in ITU-T G.709, G.805, and G874.1.
Tandem Connection Monitoring utilizes fields within the data overhead transmitted on the data plane in an optical transport network (OTN). The optical transport hierarchy (OTH) supports the operation and management aspects of optical transport networks (OTN) of various architectures, e.g., point-to-point (linear), ring and mesh architectures. One part of the optical transport hierarchy is a multiplex hierarchy, which is a hierarchy consisting of an ordered repetition of tandem digital multiplexers that produce signals of successively higher data rates at each level of the hierarchy. An exemplary multiplexing hierarchy may be specified by way of optical channel data units, i.e., ODUj, where j varies from 0 to 4; and optical channel transport units, i.e., OTUk, where k varies from 1 to 4. The optical channel data units refer to a frame format for transmitting data which can be either fixed in the amount of data and data rate or variable in the amount of data and/or data rate.
Like all other ODUjs, the ODU0 frame format includes a structure of four rows and 3824 columns. The ODU0 frame format is further divided into an ODUk overhead area (the first fourteen columns) and an optical channel payload unit (OPU) area. The optical channel payload unit (OPU) area contains two columns of overhead and 3808 columns of payload area which is available for the mapping of client data.
The ODUk overhead area is comprised of multiple fields including six Tandem Connection Monitoring (TCMi) overhead fields (TCM1, TCM2, TCM3, TCM4, TCM5, and TCM6) and a Path Monitoring (PM) overhead field. Tandem Connection Monitoring and Path Monitoring fields can be used in Tandem Connection Monitoring and in Path Monitoring to monitor connections and paths within optical transport networks. One or more Tandem Connection Monitoring fields can be used for fault localization, fast Sub-Network Connection restoration, segment protection, and/or fast segment restoration ITU-T G.709 further defines TCM fields and PM fields and defines TCM overhead bytes for six layers of TCM per ODUk connection.
TCMi Fields
The six Tandem Connection Monitoring fields are dedicated to six levels of tandem connection monitoring per ODUk connection. The number of monitored connections along an ODUk trail may vary between zero and six. The monitored connections may be nested, cascaded, or both nested and cascaded, or overlapped. The TCMi fields are each three bytes long and each includes the following sub-fields: a Trail Trace Identifier (TTI) field, a Bit Interleaved Parity 8 (BIP-8) field, a Backward Defect Indication (BDI) field, a Backward Error Indication and Backward Incoming Alignment Error (BEI/BIAE) field, and a status bits field indicating the presence of TCM overhead, incoming alignment error, or maintenance signal (STAT).
The TTI field can transport a 64 byte TTI signal broken up over a number of ODUk frames. The TTI field includes the following sub-fields: a Source Access Point Identifier (SAPI) field, a Destination Access Point Identifier (DAPI) field, and a network Operator Specific field. The SAPI field identifies the tandem connection trail source point. The DAPI field identifies the expected tandem connection trail sink (i.e. the trail end point). Access Point Identifiers (APIs) are globally unique in the APIs' layer network. The set of all APIs belonging to a single administrative layer network form a single API scheme. However, the scheme of APIs for each administrative layer network can be independent from the scheme in any other administrative layer network. The APIs may be available to other network operators. APIs typically do not change while the access point remains in existence. Normally, the API can identify the country and network operator which is responsible for routing to and from the access point.
The BIP-8 field is a one-byte Error Detection Code (EDC) signal. The BIP-8 field provides a bit interleaved parity-8 code. The contents of BIP-8 field are computed over the bits in the OPUk area of the ODUk frame I, and inserted in the BIP-8 field (associated with the tandem connection monitoring level) in ODUk frame i+2. The BIP-8 field is further described in ITU-T G.707.
The single-bit BDI field can convey, towards the source, a signal fail status detected in a tandem connection termination sink function.
The BEI/BIAE field is a four bit field which can convey, towards the source (upstream), the count of interleaved-bit blocks that have been detected as being in error by the corresponding ODUk tandem connection monitoring sink using the BIP-8 field code. The BEI/BIAE field is also used to convey in the upstream direction an incoming alignment error (IAE) condition that is detected in the corresponding ODUk tandem connection monitoring sink in the IAE overhead.
The STAT field is a three bit status field. The STAT field can be used to indicate the presence of a maintenance signal, or if there is no source tandem connection monitoring end point active, or if there is an incoming alignment error at the source tandem connection monitoring end point.
PM Field
The ODUk overhead portion also includes the Path Monitoring (PM) field. The PM field has similar sub-fields as those described for the TCM fields. The PM field is used for monitoring the end-to-end connection through the network. The PM field is further described in ITU-T G.709.
PM&TCM Field
The ODUk overhead portion also includes the PM&TCM field. The PM&TCM field includes the following sub-fields: six ODUk TCM Delay Measurement (DMti) fields (DM1, DMt2, DMt3, DMt4, DMt5, and DMt6); a Path Delay Measurement (DMp) field; and a reserved (RES) field.
For ODUk tandem connection monitoring, the one-bit tandem connection Delay Measurement (DMti) signals are defined to convey the start of the delay measurement test.
For ODUk path monitoring, the one-bit Path Delay Measurement (DMp) signal is defined to convey the start of the delay measurement test.
The DMti fields, the DMp field, and the associated signals are further described in ITU-T G.798.
The ODUk Reserved Overhead (RES) fields contain eight bytes and one bit (where the one bit is located in a sub-field in the PM&TCM field) and are reserved for future standardization.
Currently, GMPLS mechanisms exist for setting up ODUk/ODUj label switched paths/sub-network connections. However, a node in a connection oriented network must be manually and individually configured in order to enable the node in an optical transport network to utilize the ODUk Tandem Connection Monitoring fields and Path Monitoring fields for monitoring the sub-network connections in the optical transport network. The node is manually configured at each port connected to the client. This manual configuration of the node typically takes place after a connection is established. Additionally, typically only the nodes at the beginning and the end of the connection (known as the head end and tail end nodes, respectively) are configured in this manner to monitor the connection in the optical transport network (OTN), although intermediate nodes can also be configured.
Once the node is configured to monitor paths and/or tandem connections, the node is adapted to utilize the data in the PM and TCM fields, as well as to input data into the PM and TCM fields.
However, there currently is not a method or system within GMPLS protocol for dynamic signaling configuration and setup of Tandem Connection Monitoring layers for ODUk/ODUj connections on Label Switched Paths (LSPs).

OAM in OTN networks: GMPLS signaling for TCM


A doctor for a paper machine that according to some implementations includes a blade, a wearing element located in or on the blade so that at least a portion of the wearing element is exposed to wear as the blade is worn, and a reading element positioned in proximity to the wearing element. The reading element is configured to emit a magnetic signal to excite the wearing element and the wearing element is configured to respond to the magnetic signal with a magnetic response signal. The reading element is in turn configured to receive the magnetic response signal, the magnetic response signal comprising a frequency that varies with the wear of the wearing element such that the frequency of the magnetic response signal is representative of the wear of the wearing element.

Some tools or elements in some machines are exposed to wear and must be periodically replaced. This is the case of paper machines used for manufacturing paper where a doctor with at least one blade that wears with use and must be periodically replaced is used.
Such machines have at least one roller from which the paper is generated, and the doctor can have different uses such as for cleaning the surface of the rollers or peeling the sheet of paper from the surface on which it adheres, for example. As mentioned, the doctor comprises at least one blade which acts on the roller by contact and which suffers wear, and further comprises a blade holder which supports the blade and allows assembling and removing same.
A way for detecting the wear of the blade before it becomes pernicious is by means of actual user experience, or even visually. These are not the most advisable techniques because the detection of the wear before it becomes pernicious is not assured in all cases (due to user oversight, for example) and also because it is not a comfortable and fast way for detecting same.
Other methods are also known where the wear of the blade is manually measured by means of devices that are suitable for such purpose in order to detect whether or not it is acceptable. For this purpose, the machine must be stopped periodically (periods which can depend on user experience or on previously established time, for example), accessing the blade with the relevant device and taking the measurement (there are cases in which it may even be necessary to completely or partially remove the blade from the doctor to take the measurement).
Document EP 1310592 A2 discloses measurement means for measuring the wear of the blade. The measurement can be taken contacting or without contacting the blade and in both cases a relative movement is required between the measurement means and the blade which allows measuring the wear of a blade when the blade is being changed, for example.
Document EP 1244850 A1 discloses a doctor in which the wear of the blade can be detected or measured during the operation thereof. The doctor comprises a blade, a support or blade holder which holds the blade and a main support which in turn holds the support, the support being able to rotate with respect to the main support. In one embodiment, the doctor comprises a sensor in the blade holder or in the main support for detecting the rotation or the movement between them, the wear of the blade being estimated depending on this detection. In another embodiment, the doctor comprises a plurality of optical fibers arranged in parallel in the blade, whereby light is passed there through such that, if a fiber is broken due to the wear of the blade, light no longer goes through the fiber and this event is detected, the wear thus being detected.


A support bracket is designed to support a reel member rotatably mounted on a horizontal portion of an upstanding tube, the reel member having a pair of annular flanges projecting outwardly from a hub to form an annular channel for receiving a hose thereon. The lower end of the upstanding tube is rotatably mounted to one end of a support arm so that the entire reel and upstanding tube member will rotate around a vertical axis. The support arm has a short depending arm which is slidably mounted within a tubular support.

Various types of hose reels have been known for a long period of time. In the field of high pressure washers, a hose reel is utilized to permit the extension and retraction of a spray nozzle from the washer unit.
One problem with prior art hose reels for pressure washers was in their limitation on the direction in which the hose could be retracted. Typically, the hose could only be retracted forwardly from the reel, thereby requiring the user to move the entire washer in order to retract the hose from a rearward direction. Furthermore, while hose guides have been utilized in various types of reels, they were typically fixed, thereby limiting the direction in which the hose could be extended or retracted on the hose reel.
Yet another problem with prior hose reels is in their method of mounting on or adjacent to the high pressure washer. In most cases, the reel is permanently mounted to the washer, or affixed in a fashion which prevented quick and easy removal. Thus, it was necessary to utilize separate and additional hose reels for each various task.


An upper wiring layer formed with a bonding pad portion has a stacked structure of a first titanium nitride film, a titanium film, a second titanium nitride film and an aluminum alloy film on the upper surface of an interlayer insulation layer. Also, the upper wiring has a stacked structure of titanium silicide film, the titanium film, the titanium nitride film and the aluminum alloy film. The fabrication process includes forming the interlayer insulation layer having a silicon oxide film by plasma CVD using silane and N.sub.2 O and processing an upper surface of the interlayer insulation layer by plasma under a nitrogen atmosphere to form a plasma processed nitrogen layer.

1. Field of the Invention
The present invention relates generally to a semiconductor device and a fabrication process therefor. More specifically, the invention relates to a semiconductor device having an upper wiring layer provided with a bonding pad portion, and a fabrication process therefor.
2. Description of the Related Art
A semiconductor device fabricated on a silicon substrate includes a lower wiring layer (diffusion layer, lower layer wiring and so forth) formed in the silicon substrate surface or on the silicon substrate, an interlayer insulation layer covering the lower wiring layer, a connection hole (contact hole) formed through the interlayer insulation layer and extending to the lower wiring layer, an upper wiring layer, a surface protection layer covering the upper wiring layer and the interlayer insulation layer and a bonding pad portion including an opening formed in the surface protection layer and extending to the upper wiring layer. The semiconductor elements are formed only with the diffusion layer (in this case, the lower wiring layer is formed with only diffusion layer) or the diffusion layer and the lower wiring layer (in this case, the lower wiring layer is formed with the diffusion layer and the lower wiring layer). In the case where the lower wiring layer is formed with the diffusion layer and the lower wiring layer, a contact hole connecting the upper wiring layer and the lower wiring layer includes a contact hole connecting at least the upper and lower wiring layers. The semiconductor device is mounted in a package and electrically connected to a plurality of external lead portions of the package. A plurality of bonding pad portions provided in the upper wiring layer have a size of approximately 100 .mu.m of length in each edge, and connected to respective external lead portions by bonding lines formed with aluminum wire or gold wire.
For realizing high package density of the semiconductor device, the wire widths of upper layer wiring and so forth are reduced. Associating therewith, in the bottom of the contact hole, a barrier layer is formed between the upper wiring layer and the lower wiring layer. This is for controlling mutual diffusion of conductive materials forming the upper wiring layer and the lower wiring layer. On the other hand, the upper layer wiring primarily formed of an aluminum or aluminum alloy is constituted of a stacked film of a film of a refractory metal or refractory metal alloy and a film of aluminum or aluminum alloy for improving stress migration strength (and electro-migration strength). In this case, the high melting metal film or the refractory metal alloy is directly in contact with the interlayer insulation layer.
In the upper wiring layer having the stacked structure as set forth above, special attention becomes necessary for connection of the bonding wire (of aluminum wire or gold wire) for connecting the external lead portions to the bonding pad portions. This is because low bonding ability between the interlayer insulation layer and the refractory metal film or refractory metal alloy film. Namely, when connection of the bonding wire is performed with applying ultrasonic vibration to the bonding pad portion, the upper wiring layer at the corresponding portion tends to be peeled off from the interlayer insulation layer. One solution for this problem is disclosed in Japanese Unexamined Patent Publication (Kokai) No. Heisei 3-127843.
FIG. 1 shows a section of a semiconductor device disclosed in the above-identified publication. As shown in FIG. 1, on the surface of a semiconductor substrate 401, a field oxide layer 402 is formed. An interlayer insulation layer covering the field oxide layer 402 is formed with stacked films of a BPSG film 431 directly covering the field oxide layer 402 and a TEOS oxide film 433 formed on the BPSG film 431. On this interlayer insulation layer, an upper wiring pattern or upper wiring layer is formed. The upper wiring is constituted of a stacked film of a titanium nitride film 441 directly contacting with the upper surface of the TEOS oxide film 433 and an aluminum film 443. The upper wiring is covered with a surface protective layer 451. A part of the surface protective layer 451 above the upper wiring is locally removed to define an opening to access the aluminum film 443. With the opening reaching the aluminum film 443 formed through the surface protective layer 451, bonding pad portion 456 is formed.
With the construction set forth above, upon connection of the bonding wire, peeling off of the upper wiring from the interlayer insulation layer can be successfully prevented. Also, it is discussed in the publication that, by forming the upper film portion of the interlayer insulation layer with TEOS oxide layer 433, firm fitting ability of the titanium nitride film 441 and the interlayer insulation layer can be improved.
In the semiconductor device disclosed in the above-identified publication, the problem of peeling off of the upper wiring from the interlayer insulation layer upon connection of the bonding wire to the bonding pad portion of the upper wiring, can be solved. In this case, in the bottom of the contact hole provided in the interlayer insulation layer and extending to the lower wiring layer, the titanium nitride film forming the upper wiring directly contacts with the lower layer wiring. However, in the upper wiring of the construction set forth above, a contact resistance between the upper wiring and the lower wiring connected through the contact hole becomes greater, on the order of hundreds of times than that in the case where no titanium nitride film is present.
As a method for suppressing increasing of the contact resistance, it has been considered to take a method for forming the upper wiring in the construction at least including a stacked film consisted of three layers of titanium film directly contacting with the upper surface of the interlayer insulation layer, the titanium nitride film and aluminum film or aluminum alloy film. In the stacked three layer structure of the upper wiring as set forth above, in the bottom of the contact hole formed in the interlayer insulation layer and extending to the lower wiring layer, the titanium film forming the upper wiring or titanium alloy film of titanium and the conductive material forming the lower wiring directly contacts the lower wiring layer, and the titanium nitride is not directly contacted with the lower wiring layer. Therefore, increasing of the contact resistance can be limited. However, in the upper wiring including such stacked three layer structure, the problem that the upper wiring tends to peel off the interlayer insulation layer upon connection of the bonding wire to the bonding pad of the upper wiring, becomes significant.
The inventors have reported in 1993, Spring, 40th Applied Physics United Lecture Meeting, Lecture Paper, pp 671 (Lecture No. 29p-ZY-3) about a cause which makes the upper wiring to be easily peeled off the interlayer insulation layer upon connecting the bonding wire to the bonding pad portion in the upper wiring including the above-mentioned three layer structure.
Here, method of measurement of direct peeling was according to MIL specification, method 2011.4 bonding strength (destructive bond tensile test). The interlayer insulation layers were the following three kinds.
A: BPSG film formed by a low pressure CVD method (LPCVD method) with taking TEOS as one of materials; PA1 B: silicon oxide film formed by a plasma CVD method with taking TEOS as one of materials; and PA1 C: silicon oxide film formed by a plasma CVD method with taking silane type gas and dinitrogen monoxide gas. PA1 A: BPSG film formed by a low pressure CVD method (LPCVD method) with taking TEOS as one of the materials; PA1 B: silicon oxide film formed by a plasma CVD method with taking TEOS as one of the materials; and PA1 C: silicon oxide film formed by a plasma CVD method with taking silane type gas and dinitrogen monoxide gas. PA1 a silicon substrate having a field oxide layer which is selectively formed; PA1 a lower wiring layer provided on at least the surface of the silicon substrate; PA1 an interlayer insulation layer covering the silicon substrate and the lower wiring layer and having a connection hole formed at a predetermined position and extending to the lower wiring layer: PA1 an upper wiring having a stacked structure at least including first titanium nitride film directly covering the upper surface of the interlayer insulation layer, a titanium film, a second titanium nitride film and an aluminum or aluminum alloy film, on the interlayer insulation layer, and one of a stacked structure at least including the titanium film, the second titanium nitride film and the aluminum or aluminum alloy film, a stacked structure at least including a titanium alloy film, the second titanium nitride film and the aluminum or aluminum alloy film and a stacked structure at least including the titanium alloy film, the titanium film, the second titanium nitride film and the aluminum or aluminum alloy film; PA1 a surface protection layer covering the interlayer insulation layer and the upper wiring; and PA1 a bonding pad portion constituted of an opening provided through the surface protection layer and reaching to the upper wiring and the portion of the upper wiring exposed through the opening. PA1 forming a field oxide layer on the surface of a silicon substrate; PA1 forming a lower wiring layer at least on the surface of the silicon substrate; PA1 forming an interlayer insulation layer covering the silicon substrate and the lower wiring layer, and forming a first titanium nitride film covering the interlayer insulation layer; PA1 sequentially performing etching sequentially for the first titanium nitride film and the interlayer insulation layer at a predetermined position for forming a connection hole extending to the lower wiring layer; PA1 forming a titanium film and a second titanium nitride film in order over the entire surface and further forming at least an aluminum or aluminum alloy film over the entire surface; PA1 performing etching at least for the aluminum or aluminum alloy film and further sequentially performing for the second titanium nitride film, the titanium film and the first titanium nitride film for forming an upper wiring; and PA1 forming a surface protection layer over the entire surface and performing etching at a predetermined position to form an opening reaching to the upper wiring. PA1 forming a field oxide layer on the surface of a silicon substrate; PA1 forming a lower wiring layer at least on the surface of the silicon substrate; PA1 forming an interlayer insulation layer of a silicon oxide film formed by way of plasma CVD method with materials of silane type gas and dinitrogen monoxide gas at least over the entire surface; PA1 processing the upper surface of the interlayer insulation layer by plasma; PA1 performing etching for the interlayer insulation layer at a predetermined position for forming a connection hole extending to the lower wiring layer; PA1 forming a titanium film and a titanium nitride film in order over the entire surface and further forming at least an aluminum or aluminum alloy film over the entire surface; PA1 performing etching at least for the aluminum or aluminum alloy film and further sequentially performing for the second titanium nitride film and, the titanium film for forming an upper wiring; and PA1 forming a surface protection layer over the entire surface and performing etching at a predetermined position to form an opening reaching to the upper wiring. PA1 forming a field oxide layer on the surface of a silicon substrate; PA1 forming a lower wiring layer at least on the surface of the silicon substrate; PA1 forming an interlayer insulation layer of a silicon oxide film formed by way of plasma CVD method with materials of silane type gas and dinitrogen monoxide gas at least over the entire surface; PA1 performing etching for the interlayer insulation layer at a predetermined position for forming a connection hole extending to the lower wiring layer; PA1 forming a titanium film and a titanium nitride film in order over the entire surface and further forming at least an aluminum or aluminum alloy film over the entire surface; PA1 performing etching at least for the aluminum or aluminum alloy film and further sequentially performing for the second titanium nitride film and, the titanium film for forming an upper wiring; and PA1 forming a surface protection layer over the entire surface and performing etching at a predetermined position to form an opening reaching to the upper wiring.
On the other hand, as the bonding wire, aluminum wire was employed. Also, as the bonding method, an ultrasonic bonding was employed.
With respect to samples thus obtained, rate of occurrence of peeling off was compared with the method set forth above, then, the result, A:B:C=7.1%:0.7%:0.0% was obtained. The peeling off occurring rate is closely associated with the load upon occurrence of peeling off in the scratch test. The inventors have attained the conclusion that practically no problem will arise if the load upon occurrence of peeling off is greater than or equal to 53 g in the scratch test.
In the additional test performed by the inventors, in the construction of the semiconductor device disclosed in the above-identified publication, when the upper wiring is provided directly on the BPSG film, namely when the interlayer insulation layer is formed with only BPSG film, the load upon occurrence of peeling off in the scratch test becomes greater than or equal to 90 g. Therefore, no problem will arise in practical use.
FIG. 2 is a section of the semiconductor device showing the structure of the sample used in the scratch test and so forth in the foregoing report. As shown in FIG. 2, on a P-type silicon substrate 501, a field oxide layer 502 is formed. The field oxide layer 502 is covered with an interlayer insulation layer 531 having a thickness of 600 nm. The interlayer insulation layer 531 is the following three kinds similarly to the sample used for checking the peeling off occurring rate.
After forming the samples of the structure as set forth above, rapid thermal annealing (RTA) was performed by heating at 650.degree. C. for 30 seconds, then the scratch test was performed. Comparing the load upon occurrence of peeling off depending upon difference of the interlayer insulation layer, the result, A:B:C=4.00 g:50.2 g:63.8 g was obtained.
Measuring the interfaces between the titanium layers 542 and the interlayer insulation layers 531 of the samples of the structures as set forth above by way of X-ray electron spectroscopy (XPS), the result was obtained that titanium oxide (TiO.sub.x (x=2-.alpha.) was present, and the number of count per one second of this TiO.sub.x depends upon the composition of the interlayer insulation layer.
FIG. 3 is a graph showing a relationship between the XPS intensity of TiO.sub.x and load at occurrence of peeling off in the scratch test. As can be seen from FIG. 3, smaller amount of TiO.sub.x at the interface between the titanium film 542 and the interlayer insulation layer 531 results in greater load at the occurrence of peeling off in the scratch test.

Fabrication process for a semiconductor device


A cooling circuit comprises a cylinder block and a cylinder head block, these blocks each including cooling elements the form of integrated portions of circuit. The cooling circuit also includes at least a first, a second and a third separate external loops for external recirculation or reinjection mounted in parallel and looped on the integrated cooling elements. A circulating pump is connected fluidically to the integrated cooling element and to the three recirculation loops causing the fluid to circulate in the integrated cooling element and in the three recirculation loops. The at least three recirculation loops offer at least one common fluid node and are at least partially overlapping. A single actuator controls the flow of liquid circulating in the at least three recirculation loops.

Such a cooling circuit generally includes, in addition to the said integrated portions of cooling circuit, on the one hand, at least a first, a second and a third separate external loops for external recirculation or reinjection mounted in parallel and looped on the said integrated cooling means and, on the other hand, a circulating pump, connected fluidically to the integrated cooling means and to the three recirculation loops, causing the fluid to circulate in the said integrated cooling means and the said three recirculation loops. Each of the said loops includes a regulating component which regulates the flow of liquid circulating in the said loops.
The known circuits of the type referred to regulate temperature and require, for regulation of the fluid in each loop, multi-channel regulating components of complex structure which require multiple, elaborate control circuits, increasing the cost price, and have limited robustness, safety and reliability of operation.

Cooling circuit for an internal combustion engine


A digital manufacturing system for producing first and second objects comprises a platen, a gantry, a pantograph extrusion head system and first and second sets of extruders. The platen defines a workspace upon which the objects are produced. The gantry defines a headspace displaced from the workspace. The extrusion head system is mounted to the gantry for movement in the headspace. The sets of extruders are connected to the extrusion head system and are configured to deposit extrusion material on the workspace to build the objects. Each set of extruders comprises a first extruder mounted to the extrusion head system; a second extruder mounted to the extrusion head system so as to be actuatable from a first to a second position; and a flexible linkage connecting the extruders. The flexible linkages position the second extruders in approximately equal known spatial relationships to the first extruders in the second positions.

The present invention relates to digital manufacturing (DM) systems, such as rapid prototyping and rapid manufacturing systems, that use various methods, such as fused deposition modeling, stereo-lithography, selective laser sintering, and similar techniques, for building three-dimensional (3D) objects. In particular, the present invention relates to extrusion based layered deposition systems for producing multiple, identical objects.
An extrusion based layered deposition system deposits a flowable build material to build a 3D solid object from a computer-aided design (CAD) model, typically in a rapid prototyping or manufacturing setting. Various such systems are described in U.S. Pat. Nos. 5,968,561 to Batchelder et al., 6,722,872 to Swanson et al. and 7,314,591 to Priedeman, Jr., all of which are assigned to Stratasys, Inc., Eden Prairie, Minn. The build material is heated and extruded through a first extrusion nozzle carried by an extrusion head, and is deposited in a layer-by-layer manner as a sequence of roads on a substrate in a planar (X, Y) surface. The extruded build material fuses to previously deposited build material, and solidifies upon a decrease in temperature. The position of the extrusion head relative to the substrate is then incremented perpendicularly to the planar surface in a Z-direction, and the process is repeated to form a 3D object resembling the CAD model.
In fabricating 3D objects by depositing layers of build material atop previously deposited build material, it is often necessary to fabricate a support for layers of build material larger than the previously deposited layers, which are not supported by the build material itself. Typically, a second extrusion nozzle deposits layers of a support material to build up a support utilizing a deposition process similar to that used for depositing the build material. The support material is formulated to adhere to the build material during deposition, and to easily separate from the solidified build material after the build process is completed. In order to prevent interference of the inactive extrusion nozzle with the active extrusion process, the second extrusion nozzle is often movable in the Z-direction relative to first extrusion nozzle. It is necessary to calibrate movement of the second extrusion nozzle such that its position when active is known and the position of the substrate can be properly adjusted in the Z-direction. Typically, the calibration is conducted manually by shimming the second extrusion nozzle after running the extrusion head through a series of test patterns. Such a method is, however, time consuming and not repeatable, but produces movement of the second extrusion nozzle within an acceptable tolerance limit for production of a single 3D object.
Movement of the extrusion head within the (X, Y) plane relative to the substrate, movement of the substrate in the Z-direction relative to the extrusion head, and movement of the extrusion nozzles in the Z-direction relative to each other are coordinated through a computer that manipulates drive systems for the extrusion head. The computer converts data representing the CAD model into build data that determines when to activate the build and support extrusion nozzles. The build data is obtained by dividing the CAD model of the 3D object into multiple horizontally sliced layers and determining the location of support structures. Then, for each sliced layer, the computer generates a build path for depositing roads of build material and support material on the substrate to form the 3D object and corresponding supports. As such, a single extrusion based layered deposition system is capable of rapidly producing a single 3D object with build data generated from a CAD model through carefully orchestrated movements of the extrusion head, substrate and extruders.
In order to produce multiple 3D objects that are identical, it is conventionally required to run the deposition process multiple times using the same build data. Thus, throughput of a single deposition system is limited by the length of each deposition process. In order to increase throughput, multiple extrusion based layered deposition systems can be employed, each operating with the same build data. In addition to high costs, such multi-machine deposition systems require large amounts of floor space and redundant components. Conversely, when only a single prototype object is needed, multiple deposition system machines lay idle while a single machine produces the object. Various DM systems include multiple means for forming extrusion material in order to more rapidly produce a single object. For example, U.S. Pat. No. 6,406,658 to Manners et al, which is assigned to 3D Systems, Inc., Valencia, Calif., describes a stereo-lithography system having a dual spot scanner for solidifying material for a single object. Likewise, U.S. Pat. No. 7,077,638 to Leyden et al, also assigned to 3D Systems, Inc., describes a 3D modeling system using a multi-orifice head for dispensing a single material for building and supporting a single object. There is, however, a need for further increasing throughput of DM systems, particularly extrusion based layered deposition systems.

Pantograph assembly for digital manufacturing system


A shift register has shift register units. The nth shift register unit includes first to third level control units and first and second driving units. The first and second level control units respectively provide a first clock signal and a first voltage to an output terminal. The first driving unit and the first level control unit are coupled to a first node, and a voltage on the first node is a first control signal. The first driving unit turns on and off the first level control unit in response to an input signal and second and third control signals. The second driving unit turns on and off the second level control unit in response to the first control signal. The third level control unit provides the first voltage to the output terminal in response to a front edge of the first control signal of the (n+2)th shift register unit.

1. Field of the Invention
The invention relates in general to a shift register, and more particularly to a shift register, in which an nth shift register unit is controlled by a specific voltage signal of an (n+1)th or (n+2)th shift register unit.
2. Description of the Related Art
With the changing development of the technology with each passing day, a liquid crystal display (LCD) has been widely applied to an electronic display product, such as a television, a computer display, a notebook computer, a mobile telephone or a personal digital assistant. The LCD includes a data driver, a scan driver and a LCD panel, which has a pixel array. The scan driver sequentially turns on a corresponding pixel row in the pixel array to scan pixel data outputted from the data driver to the pixel and thus to display the image to be displayed.
The present technology usually implements the scan driver capable of sequentially turning on the corresponding pixel row in the pixel array using a shift register. Because the scan driver greatly influences the displayed frame quality of the LCD, it is an important direction in this industry to design a shift register having a long lifetime and a slight distortion of the output signal so as to enhance the efficiency of the scan driver and the displayed frame quality of the LCD.

Shift register with each stage controlled by a specific voltage of the next stage and the stage after thereof


The present invention is directed to a continuous affinity chromatography method and to an apparatus to be used in such method. The method allows the use of high operational velocity while maintaining high binding capacities.

The purification of biopharmaceutical molecules involves using chromatographic separation methods as one of wide established technologies. The usual application involves capture and polishing of the target molecule. Various chromatographic methods and resins can be applied to fulfill these tasks (e.g. normal phase, reversed phase, size exclusion and ion exchange chromatography modes). In special areas this has developed to more specific and more efficient separation methods such as affinity chromatography. The current state of art of the antibody purification is the use of ProtA modified affinity chromatography support materials to bind and separate the target molecule from the greater part of most abundant impurities (host cell proteins, host cell DNA, sugars, amino acids, growth factors and etc.). More than 30 chromatographic resins with various properties are available today in the market, providing an opportunity for the customer to find the one best suited to his application. The main differences in those products are physical (support material, particle size, particle shape and pore size) as well as chemical properties (ProtA ligand, ligand density, support matrix type) which influence the binding capacity, mass transfer properties, compressibility and robustness.
The binding capacity strongly depends on the affinity ligand, its density on the surface and its accessibility. Due to the improvements in the modification technologies, high binding capacities >30 g/L can be reached at residence times of >3 min independently from the support matrix chemistry.
On the other hand, mass transfer properties are quite variable, causing radical differences in the application. Film mass transfer and pore diffusion are two main parameters, which influence the target molecule diffusivity towards the adsorption sites. Film mass transfer is mainly influenced by the particle size and shape. The smaller the particle and the interparticle volume the greater the mass transfer and the flow resistance. Therefore, for the analytical scale applications smaller particle size is used to assure a fast mass transfer and high efficiency. But due to the pressure resistance issues, the industrial scale operations are performed at <3 bar operation pressures. Bigger particles (60 μm-120 μm) are usually chosen.
Due to the above mentioned issues, the pore diffusion is one of the most influential properties defining the mass transfer. It was shown that some materials exhibit wide pores (50-500 nm) to enable a fast mass transfer. But these materials show low binding capacities (˜20 g/L), due to the low surface area. To enhance binding capacity, higher surface area is required, usually achieved through smaller pore size. Materials exhibiting ˜100 nm pore sizes have shown 40 g/L (PROSEP®-vA High Capacity (Millipore Bioprocessing, Consett, UK) binding capacities, even more ˜70 nm pore size exhibiting materials have shown 56 g/L (PROSEP®-vA Ultra (Millipore Bioprocessing, Consett, UK) binding capacities. Support materials with wide pore size distribution in the comparable range have shown also similar binding capacities (MABSELECT SURE® (GE Healthcare, Uppsala, Sweden). Due to the smaller pore size, the diffusion of the target molecule is slower, requiring certain target molecule residence time to achieve binding capacities above 40 g/l. The usual range of used residence times is in the range 3-6 minutes to assure that the target molecule diffuses towards the binding sites. This is important in the chromatographic process loading phase, where the support material is treated with a solution containing target molecule. The rest of the necessary affinity chromatography method steps (such as wash, elution, Strip, cleaning in place, reequilibration, etc.) can be performed faster to assure a shorter processing time. The operational velocity in this case is influenced by the support material rigidity.
Nevertheless, after the application of this specific, very selective method for about 20 years, there is an increasing need for further method optimization in pursuit of higher economic efficiency and productivity (g (target molecule)/ml (stationary phase)/h (operation time). The current status is to use big columns for higher throughput in the expense of higher investment for the higher resin amounts. Sometimes columns of 1.2 meter diameter and 10-20 cm bed height are used for mAb purification. It was recognized that there is an alternative technology that might enable economic processing, namely continuous chromatography. The basics of this method is higher resin utilization while loading to 80% of resin binding capacity instead of 60% as in standard batch without product loss, shorter operation times through splitting the sequential batch process into the parallel operation on numerous columns and therefore enabling the usage of smaller columns.
In continuous chromatography, several identical columns are connected in an arrangement that allows columns to be operated in series and/or in parallel, depending on the method requirements. Thus, all columns can be run in principle simultaneously, but slightly shifted in method steps. The procedure can be repeated, so that each column is loaded, eluted, and regenerated several times in the process. Compared to "conventional" chromatography, wherein a single chromatography cycle is based on several consecutive steps, such as loading, wash, elution and regeneration, in continuous chromatography based on multiple identical columns all these steps occur simultaneously but on different columns each. Continuous chromatography operation results in a better utilization of chromatography resin, reduced processing time and reduced buffer requirements, all of which benefits process economy. One example of continuous chromatography is simulated moving bed (SMB) chromatography. In the current years this simulated moving bed (SMB) technology was introduced to the biopharmaceutical market as well, especially to the purification of antibodies. If previously in normal batch chromatography the loading of the chromatographic column was stopped at a specific percentage of target molecule breakthrough, so now the loading can be continued in order to increase the binding capacity without target molecule losses, since a brake through fraction is loaded on the column that is following the first one.
Nevertheless, for a better economic efficiency the processing time is of the major importance since it directly influences productivity. The increase in the binding capacity is already increasing the productivity by the level on how much more material can be bound to the surface (˜20-40%), but decreasing the residence time required for the target molecule to be bound on the modified surface would enhance the economic efficiency even more. Presumably, decreasing the residence time to 0.3 min will lead to 10 times increased productivity if compared to 3 min residence time. Unfortunately, decreasing the residence time during the target molecule adsorption phase leads to the decrease in the dynamic binding capacity since the rate of the mass transfer is decreased. Consequently, column loading is typically performed with velocities going up to about 600 cm/h as disclosed in US 20090209736. But as it is also actually stated in E. Mahajan et el., Journal of Chromatography A, 1227 (2012) 154-162, at higher flow rates the column binding capacity is reduced so that high flow rates are not feasible for column loading.
Surprisingly we found that an appropriate support material physical property (particle size, pore size) selection coupled with a certain continuous chromatography method enables loading velocities above 800 cm/h and more.