A carbon nanotube hybrid system includes: a carbide-derived carbon prepared by reacting a carbide compound and a halogen group containing gas to extract elements of the carbide compound except carbons; metals supported on the carbide-derived carbon or remaining in the carbide-derived carbon; and carbon sources from which carbon nanotubes are grown from the carbide-derived carbon. A method of preparing the carbon nanotube hybrid system includes preparing the carbide-derived carbon, extracting elements therefrom, and growing carbon nanotubes from the carbide-derived carbon. The carbon nanotube hybrid system has excellent uniformity and a long lifetime. An electron emitter having improved electron emitting properties can be inexpensively prepared using the carbon nanotube hybrid system compared to conventional carbon nanotubes. An electron emission device having excellent electron emitting properties can be prepared using the electron emitter.

1. Field of the Invention
Aspects of the present invention relate to a carbon nanotube hybrid system using carbide-derived carbon, an electron emitter including the same, and an electron emission device including the electron emitter, and more particularly, to a carbon nanotube hybrid system that can be prepared using a less expensive method than that used to manufacture conventional carbon nanotubes and that has excellent uniformity and a long lifetime, an electron emitter including the same, and an electron emission device including the electron emitter.
2. Description of the Related Art
In general, electron emission devices can be classified into electron emission devices using hot cathodes as an electron emission source and electron emission devices using cold cathodes as an electron emission source. Examples of electron emission devices using cold cathodes as an electron emission source include field emitter array (FEA) type electron emission devices, surface conduction emitter (SCE) type electron emission devices, metal insulator metal (MIM) type electron emission devices, metal insulator semiconductor (MIS) type electron emission devices, and ballistic electron surface emitting (BSE) type electron emission devices.
FEA type electron emission devices operate based on a principle that a low work function material or high beta function material as an electron emission source easily emits electrons due to an electric charge difference under a vacuum condition. Recently, tip-shaped structures mainly formed of Mo, Si, or the like; carbonaceous material, such as graphite, diamond like carbon (DLC), or the like; and nano materials such as nanotubes, nanowires, or the like have been developed as electron emission sources for FEA type electron emission devices.
In an SCE type electron emission device, a first electrode faces a second electrode on a first substrate, and a conductive thin film having fine cracks is located between the first and second electrodes. These fine cracks are used as an electron emission source. In this structure, when a voltage is applied to the device, current flows in the surface of the conductive thin film and electrons are emitted through the fine cracks acting as an electron emission source.
MIM type electron emission devices and MIS type electron emission devices respectively include an electron emission source having a metal-dielectric layer-metal (MIM) structure and an electron emission source having a metal-dielectric layer-semiconductor structure. When a voltage is applied between the metals or between a metal and a semiconductor separated by a dielectric layer, electrons move, are accelerated, and are emitted from the metal or semiconductor having a higher electron charge to the metal having lower electron charge.
BSE type electron emission devices operate based on a principle that when a semiconductor is miniaturized to a dimension smaller than a mean free path of the electrons of the semiconductor, electrons travel without being dispersed. In particular, an electron supply layer formed of a metal or a semiconductor is formed on an ohmic electrode, an insulating layer and a thin metal film are formed on the electron supply layer, and a voltage is applied to the ohmic electrode and the thin metal film to emit electrons.
In addition, FEA type electron emission devices can be categorized into top gate type electron emission devices and bottom gate type electron emission devices according to locations of cathodes and gate electrodes. Furthermore, FEA type electron emission devices can be categorized into diode emission devices, triode electron emission devices, tetrode electron emission devices, etc., according to the number of electrodes used.
In the electron emission devices described above, carbon-based materials, included in an emitter, for example, carbon nanotubes, which have good conductivity, electric field concentration, electric emission properties and a low work function, are commonly used.
However, carbon nanotubes commonly have a fiber shape having a high field enhancement factor β, and fiber type carbon nanotube materials have many problems, such as poor uniformity and a short lifetime. Further, when fiber type carbon nanotubes are manufactured in a paste, an ink, a slurry, or the like, problems occur during manufacturing processes compared with other particle type materials, and raw materials of the fiber type carbon nanotubes are expensive.
Recently, research on materials consisting of inexpensive carbide-based compounds that can be substituted for carbon nanotubes have been conducted in order to overcome these disadvantages (Korean Patent Publication No. 2001-13225).

Carbon nanotube hybrid system using carbide-derived carbon, a method of making the same, an electron emitter comprising the same, and an electron emission device comprising the electron emitter


A process for continuously preparing a wet powder of PTFE, comprising the step of continuously slurrying a PTFE aqueous dispersion with a high shear machine having a rotating element, and the step of continuously granulating the slurry by using vertical agitator. The process can be carried out for a long time without trouble, and can continuously provide a dry powder having good powder properties. The powder properties can be controlled by regulating operation conditions.

The present invention relates to a continuous preparation process of polytetrafluoroethylene wet powder.
Polytetrafluoroethylene (hereinafter referred to as "PTFE") dispersions are prepared by emulsion-polymerizing tetrafluoroethylene and are present in a form of aqueous dispersion in which fine particles of the emulsion-polymerized product having a particle size of 0.1 to 0.5 .mu.m are dispersed. It is difficult to obtain a PTFE fine powder directly from the aqueous dispersion, and also if possible, the resulting separated and dried powder is worse in handling. Therefore, hitherto a product (dry powder) of fine powder is prepared by applying a shear to the aqueous dispersion, flocculating the dispersed fine particles to produce a slurry, granulating the slurry with stirring to give a wet powder (these sequencial steps being, hereinafter, referred to as "agglomeration process"), and then drying the wet powder.
The agglomeration process is carried out by batch system or continuous system. In the batch system, the slurrying and granulation of the aqueous dispersion is carried out by only agitating in one agitation tank. This system, however, is inferior in workability and further the controlling of properties of the product such as an apparent density is difficult.
The continuous system is proposed in U.S. Pat. No. 3,046,263 and is a process by using a centrifugal pump and a capillary and a horizontal cylindrical agitation tank. According to this process, a PTFE aqueous dispersion is introduced to the capillary through the centrifugal pump to produce a slurry by shearing due to velocity gradient, and then the obtained slurry is granulated by the horizontal agitation tank to give a wet powder.
The prior continuous agglomeration system has, however, the following disadvantages. Namely, since the aqueous dispersion is supplied through the centrifugal pump to the capillary, when the centrifugal pump applies a shear, the fine particles partially flocculate to plug the capillary. Therefore, the capillary must be frequently changed due to plugging. Further, the shear velocity gradient becomes sometimes ununiform to give aggromelates having a wide particle size distribution. Amount of unagglomerated fine particles is not negligible. The horizontal agitation tank used for granulation usually has a both end supported shaft, and proper sealing is required at the end supports. In the agitation tank, the granules are taken off by introducing air into the agglomerates to rise to the surface. The floated granules, however, are broken by the agitation blades, and thus the produced powder becomes fine or deformed in shape. When an amount of fine powder is increased, an apparent density of the product powder becomes low, which makes handling property bad.
Accordingly, the production of PTFE powder is now carried out mainly by the batch system.

Continuous process for preparing polytetrafluoroethylene wet powder


An apparatus processes a video image. The apparatus includes an imaging device, a frame grabber device, and a host computer. The imaging device (20) produces a gray level image representing the video image. The frame grabber device conducts preprocessing functions on the gray level image and produces a plurality of image types from the gray level image. The host computer has a memory for storing the plurality of image types. The plurality of image types are transferred directly from the frame grabber device to the memory of the host computer.

Video image acquisition systems, such as optical character recognition and bar code decoding, typically require intensive operations by a central processing unit. In such systems, preprocessing of raw image data is often utilized to enhance features, reduce noise, and compress image data. Additionally, multiple images may be generated from an acquired raw image to provide a distinctive and expanded data set for downstream processing.

Reconfigurable, multi-output frame grabber for machine vision applications


Filters for EUV lithography, methods of manufacture thereof, and methods of filtering in an EUV lithography system are disclosed. The filter comprises a nanotube material layer sandwiched by two thin material layers that are highly transmissive and provide structural support for the nanotube material layer. The filter is supported on at least one side by a patterned structural support. The filter mitigates debris, provides spectral purity filtering, or both.

Semiconductor devices are manufactured by depositing many different types of material layers over a semiconductor workpiece or wafer, and patterning the various material layers using lithography. The material layers typically comprise thin films of conductive, semiconductive, and insulating materials that are patterned and etched to form integrated circuits (IC's).
For many years in the semiconductor industry, optical lithography techniques such as contact printing, proximity printing, and projection printing have been used to pattern material layers of integrated circuits. Projection printing is commonly used in the semiconductor industry using wavelengths of 248 nm or 193 nm, as examples. At such wavelengths, lens projection systems and transmission lithography masks are used for patterning, wherein light is passed through the lithography mask to impinge upon a wafer.
However, as the minimum feature sizes of IC's are decreased, the semiconductor industry is trending towards the use of very short wavelength, immersion lithography technologies or non-optical lithographic techniques to achieve the decreased feature sizes demanded by the industry.
For lithographic printing of integrated circuit patterns below about 50 nm feature sizes, EUVL technology using light in the soft x-ray range (e.g., about 10 to 15 nm) is under development. Ultraviolet (UV) light has a shorter wavelength than visible light. For example, UV light is usually considered to fall within the wavelength range of about 157 to 400 nm. In EUVL, extreme UV (EUV) light, having a shorter wavelength than UV light, e.g., about 13.5 nm, is used as the wavelength. In EUVL, plasma is used to generate a broadband radiation with significant EUV radiation. The EUV radiation is collected by a system of mirrors coated with EUV reflecting interference films, also known as Bragg reflectors. The EUV radiation is then used to illuminate an EUV reflection lithography mask. The pattern on the lithography mask is imaged and de-magnified onto a resist-coated wafer. The entire lithography mask pattern is exposed onto the wafer by synchronously scanning the lithography mask and the wafer.
EUV radiation or EUV light used in EUV lithography (EUVL) systems may be generated by heating fuel materials such as xenon, lithium, or tin via discharge produce plasmas (DPP) or via laser produced plasmas (LPP). In DPP EUV sources, fuel is heated via magnetic compression, while in LPP, fuel is bombarded with a focused laser beam to produce the heating. However, in the process of generating EUV radiation, in these methods, additional unwanted radiation and debris are produced. The debris includes particle debris, e.g., micron sized particles, and high energetic atomic species. This debris can include particles (neutral or charged), ions, neutral atoms, molecules (neutral and ions), and electrons, as examples.
In an EUV lithography system, in order to extract the EUV light, an optic mirror is used. The optic mirror is costly, has a certain useful lifetime, and cannot be replaced frequently, and thus needs to be protected from the debris. The optic mirror needs to be protected such that as much of the EUV light passes through as possible, while the debris is prevented from reaching the optic mirror. The kinetic energy of the debris can be very high and may cause erosion of the EUV system collecting optics, such as a grazing incidence collector, multilayer mirrors, or near normal incident Bragg reflector mirrors used in the sources as EUV light collectors. The erosion of the EUV system collecting optics is caused by kinetic energy sputtering of the debris produced by the generation of the EUV radiation, while there may be other contributing factors to this erosion, such as potential sputtering and chemical erosion, as examples.
In addition, some of the debris comprises highly charged ions that are generated by the EUV producing plasma. The highly charged ion debris can be very damaging to EUV system collecting optics surfaces, even at very low kinetic energies. This erosion is caused by potential energy sputtering of the highly charged ion debris. The damage caused by this kind of debris to the EUV collecting optics in EUV sources significantly reduces the lifetime of the EUV lenses and mirrors, and increases cost of ownership (COO) for EUV sources and EUV lithography systems.
Mitigating debris to prevent the debris from reaching the collecting optics is considered one of the largest challenges in the development of EUV lithography. Extending the lifetime of the plasma-facing collector mirror, which delivers the EUV light into focus, is one of the most critical issues for EUV lithography development, for example. "Foil trap" based debris mitigation devices are generally used today by the industry to mitigate the debris, i.e., to prevent it from reaching EUV mirror surfaces, as described by Shmaenok, L. A., et al., in "Demonstration of a Foil Trap Technique to Eliminate Laser Plasma Atomic Debris and Small Particulates," Proceedings of SPIE, 1998, pp. 90-94, Vol. 3331, which is incorporated herein by reference, and also in U.S. Pat. No. 6,838,684, issued on Jan. 4, 2005 to Bakker et al., which is also incorporated herein by reference. The foil trap devices trap debris on a system of foils near the EUV light source, or divert particles by bouncing them off surfaces. However, there are limitations of using foil trap based debris mitigation devices. The transmission loss of such devices is typically about 40 to 60% of the EUV light generated by the plasma. Furthermore, a significantly large amount of the debris passes through the foil trap debris mitigation devices, causing erosion and damage, and debris build-up on the collecting optics for EUV light.
Other debris mitigation devices and methods include repeller fields, in which an electric field is used to repel ions or charged particles, as described by Takenoshita, K., et al., in "The Repeller Field Debris Mitigation Approach for EUV Sources," Proceedings of SPIE, 2003, pp. 792-799, Vol. 5037, which is incorporated herein by reference, and also in U.S. Pat. No. 6,377,651 issued on Apr. 23, 2002 to Richardson et al. on Apr. 23, 2002, and U.S. Pat. No. 6,614,505 issued on Sep. 2, 2003 to Koster et al., which are incorporated herein by reference. Uncharged particles are, however, allowed to pass through repeller fields. Other debris mitigation attempts include using metal meshes coated with a material; background gases like Krypton, Argon, or Helium; Cu or Ta tape; and RF plasma in combination with a foil trap, as examples. While these methods and devices increase optics protection, these methods do not completely eliminate the debris emanating from EUV light sources that causes damage to and built-up on the collecting optics and other components of the EUV lithography system. Also, these prior art methods and devices significantly reduce the EUV light transmission, thereby increasing the time it takes to expose a wafer and thus significantly increasing cost of ownership for EUV lithography systems.
Furthermore, the lifetime of existing EUV light collection optics in the EUV lithography systems is about 500 million pulses, due to the large amount of debris that causes damage to the optical components. A lifetime of about 50 to 100 billion pulses is needed in the art, for EUV lithography to be a viable and cost-effective lithography method in high volume production.
Thus, what are needed in the art are improved devices and methods of filtering debris that do not excessively lower the EUV light transmission in EUV lithography systems.


A cryptographic process is provided which allows a server to verify that a client device is genuine. The client device is provisioned with first and second data elements and a key which can be stored in fuses at the time of manufacture. When the client device requests digital content such as multimedia from the server, the server issues a genuineness challenge to the client device. The genuineness challenge is a message which includes a message authentication code (MAC) derived from a secret key of the server, in addition to an encrypted timestamp nonce. The client device prepares a response which includes a MAC derived from the client's key and the genuineness challenge. The response also includes the first and second data elements but not the client's key. The server processes the response to confirm that the client device is genuine.

Client devices such as laptops, personal computers, game consoles, tablets and smart phones are commonly used to allow a user to consume digital content. This content can include audio such as music and lectures, video such as movies, software such as video games and other applications, and other types of digital data. However, the owners of the digital content desire to control how the content is distributed, e.g., to gain revenue from the content and to ensure that the content is appropriate for a computing device to protect the user experience.


Example uplink reference signal sending methods and apparatus are described. One example method includes sending signaling to a terminal device by an access network device. The terminal device determines a sequence type of an uplink reference signal based on the signaling. The terminal device determines transmit power of the uplink reference signal based on the sequence type of the uplink reference signal, and sends the uplink reference signal by using the transmit power of the uplink reference signal.

In a long term evolution (LTE) network, a single carrier-orthogonal frequency division multiplexing (SC-OFDM) technology is used for uplink data transmission, and a cyclic prefix-orthogonal frequency division multiplexing (CP-OFDM) technology is used for downlink data transmission.
When a terminal device uses the SC-OFDM technology, a transmitted uplink reference signal, for example, a sounding reference signal (SRS), and a signal on an uplink shared channel (PUSCH) occupy consecutive frequency domain resources. Usually, in the LTE network, the SRS is transmitted on the last symbol of a subframe, and the subframe is not used for transmitting another signal. With the development of technologies, it is desired that the CP-OFDM technology can also be used for uplink data transmission. In addition, when a terminal device uses the CP-OFDM technology to send data, a more flexible resource mapping manner may be used. For example, the terminal device may send a signal in a frequency division multiplexing manner. For example, an uplink reference signal and a PUSCH may be frequency division multiplexed on one OFDM symbol.
In a 5th generation (5G) mobile communications system or a new radio access technology (NR), a terminal device may use the SC-OFDM technology and the CP-OFDM technology in an uplink transmission process, and the CP-OFDM technology allows an uplink reference signal and another signal to be frequency division multiplexed on one OFDM symbol. In the prior art, transmit power of an uplink reference signal is determined for a case that only the SC-OFDM technology is used. If transmit power of an uplink reference signal is still determined in the prior-art manner, uplink reference signal transmission reliability may be reduced.

Uplink reference signal sending method and apparatus


A portable electronic (200) device using a cover mechanism (100) to close off two or more interface holes (3512, 3522 and 353) is described. The portable electronic device includes a base portion (30). The cover mechanism includes a first cover member (50) and a second cover member (70). The first cover member has a first cover portion (51) to close off one or more interface holes. The second cover member has a second cover portion (71) to close off another one or more interface holes. The second cover member is latched to the base, and the first cover member is latched to the base and the second cover member.

1. Field of the Invention
The exemplary invention relates to cover mechanisms used in electronic devices.
2. Description of Related Art
Electronic devices usually have external interfaces for electrically connecting peripheral devices, accessories or networks to the electronic device. Such external interfaces should be protected by the cover mechanisms for continued proper functioning.
Cover mechanisms usually include covers with locks. When the cover mechanisms are used in electronic devices (e.g., mobile phones), the covers are typically locked to the electronic devices by the locking means and, used to cover holes through which the interfaces (e.g., universal serial bus (USB)) of electronic devices are exposed. However, it can be difficult to close off two or more interfaces with one cover mechanism.
Therefore, there is room for improvement within the art.

Cover mechanism and electronic device using same

Shenzhen Futaihong Precision Industry Co., Ltd.


Methods for providing users with information in audible form are provided. One such method comprises determining content sources from which information is to be retrieved for responding to a request from a user, retrieving grammar fragments corresponding to the content sources determined, providing a menu format including information for providing the grammar fragments to the user in audible form, and aggregating the grammar fragments retrieved such that the grammar fragments can be provided to the user in audible form in conformance with the menu format. Systems and computer-readable media are also provided.

1. Field of the Invention
The present invention generally relates to interactive voice technologies and, in particular, to systems and methods for providing users with information in audible form.
2. Description of the Related Art
Information provided to users by computing devices typically is provided in a graphical form. For instance, a personal computer can be used to access a Web site that provides a user with images and/or text via a display device. In this visual context, it is known to combine graphical information provided by a variety of sources and to display the combined graphical information to the user. This enables a user to visually scan the combined graphical information and identify a topic about which the user desires to receive additional information. Once identified, the user can select the topic, such as by actuating a corresponding icon, and be provided with information related to that topic. Typically, the additional information is presented in a maximized format, i.e., at least some of the previously identified topics are no longer displayed to the user and/or the information is presented on a larger portion of the display device.
It is also desirable to provide information to users in non-graphical form, i.e., audible form. However, creating an audible analogue to the aforementioned visual context has not been adequately achieved. This is because sources of audible information typically provide grammar fragments that, when combined, cannot be interpreted by voice-rendering applications and/or, if renderable, are unnecessarily impractical. For instance, multiple grammar fragments that are received from multiple sources can be stacked (grouped together) to form a valid VoiceXML document. However, a VoiceXML document with stated grammar fragments is not properly formatted for use by a VoiceXML interpreter that typically is used to render (provide voice) corresponding to VoiceXML documents. By way of further example, if each source of audible information provides a grammar fragment that includes "If you would like to access information on ______, please say '______', " and an interpreter could render the stacked fragments, the user would be provided with redundant audible information, e.g., "If you would like to access information on" is repeated for each source.

Systems and methods for providing users with information in audible form

Hewlett-Packard Development Company, L.P.


A method for producing an oxide superconducting composite wire is disclosed, which comprises the steps of: (a) molding a powdered oxide superconductor material to form a wire; (b) heat treating the wire in an oxygen atmosphere thereby forming the wire into an oxide superconducting member; (c) forming a non-oxidizing metal intermediate layer on a surface of the oxide superconducting member; (d) bundling a plurality of the oxide superconducting members containing the intermediate layer; (e) inserting the bundled oxide superconducting members into an oxidizing metal support tube; and (f) drawing the product of step (e) to reduce its diameter and heat-treating it.

In recent times, various oxide superconductors have increasingly been discovered which show very high values of the critical temperature (Tc) at which the transition from a normal conductive sate to a superconductive state takes place. Since such an oxide superconductor shows a higher critical temperature than conventional alloy or intermetallic compound superconductors, it is considered that oxide superconductors will highly promise for practical superconducting materials.
However, this sort of superconductor is made of ceramics and is thus very brittle, cracks being easily produced. We have attempted the production of various superconducting wires each comprising an oxide superconductor as the conducting portion, in which a metal sheath was charged with an oxide superconducting material in a powder form, and the oxide superconductor charged metal sheath was then subjected to diameter reduction and then to heat treatment.
In the above-described method, however, the oxide superconducting material powder is contact with the metal sheath which contains an oxidizing metal such as copper, a copper alloy, or stainless steel, during the heat treatment, in which this oxidizing metal takes oxygen away from the superconducting material and is oxidized. As a result, the contact portions between the superconducting material powder and the oxidizing metal lacks oxygen. Consequently, a problem occurs in reductions both in the critical temperature and in the critical current density of the product superconductor.

Method for producing oxide superconducting composite wire


An applicator device serves for application of a liquid medium. The applicator device has a reservoir for the medium and an applicator. The applicator is surrounded by a protective sleeve in the reservoir. The protective sleeve is rigidly connected with the reservoir. The inner diameter of the protective sleeve is constant in the vicinity of an applicator tip of the applicator and exceeds the outer diameter of the applicator penetrating into the reservoir. The protective sleeve extends down to a bottom of the reservoir and bears against the bottom via a resilient sleeve portion. As a result, an applicator device is obtained which provides for protection of the applicator tip and is easy to fabricate.

1. Field of the Invention
The invention concerns an applicator device for applying a liquid medium comprising a reservoir for the medium, an applicator, a protective sleeve which surrounds the applicator in the reservoir and is rigidly connected with the reservoir, wherein the inner diameter of the protective sleeve is constant in the vicinity of an applicator tip of the applicator and exceeds the outer diameter of the applicator penetrating into the reservoir.
2. Background of the Invention
An applicator device of this type is disclosed in EP 0 743 830 B1. The fabrication of an applicator device of this type is rather complex.

Applicator device for application of a liquid medium


A compact hand-holdable implement or key for controlling an electronic lock mechanism is disclosed. The implement is sized and configured for easy, convenient and comfortable gripping, aligning with a mating receptacle of the lock mechanism, and bringing into and out of desired engagement with the receptacle. The illustrated implement includes a memory chip. It has an elongated handle with a front-to-rear axis and electrical implement contacts at its front end connected to the memory chip. The user grips the handle with the user's thumb and at least one finger generally aligned with the handle axis for clear visibility of the front end and the receptacle. This also allows for easy and comfortable combined movement which both aligns the implement with the receptacle and moves it forwardly into the receptacle. The implement contacts are arranged to be engaged with and then disengaged from mating lock contacts in the receptacle, solely by axial movement of the implement and without requiring rotational or transverse movement of the implement. This initiates desired transfer of data from the memory chip to the lock mechanism. A new and advantageous method of use and method of assembly of the implement are also disclosed.

There has been a wide variety of electronic mechanisms for locking and securing things. In this connection cards, badges, variously shaped and configured keys and the like having electronic or electromagnetic data imprinted upon them have been used in connection with readers (with or without computer support) to identify and control locking and unlocking of the mechanisms and access to various facilities and devices. Many of these arrangements are extremely sophisticated and expensive to initially install, as well as to maintain and to reprogram.
Dallas Semiconductor of Dallas Tex. has developed what they call their "Touch Memory" chip that is able to read or write with momentary contact. They have housed this chip as described in U.S. Pat. No. 5,025,141 in a stainless steel container which they call their "MicroCan". This coin-shaped container is 16.3 mm in diameter and 3.2/5.8 mm in height. They have mounted it with one flat circular face of the can secured to the flat surface of a generally rectangular thin flat ID card or a thin flat generally oblong-shaped key fob (See FIG. 1). The user holds and manipulates the card or fob so as to insert the "MicroCan" into a generally forwardly facing lock receptacle.
Such manipulation of this type of device is awkward and difficult to the point of being merely annoying for some, but virtually unusable for others. The motion involved to position the "MicroCan" in the proper orientation with regard to the lock mechanism receptacle, and then insert the "MicroCan" into the receptacle is not one that is usual or comfortable for most people. It involves first a side-to-side and up-and-down aligning with a receptacle that is, to a large extent, blocked from view by the hand of the user and by the card or fob structure. This alignment cannot be approximated, but must be rather exact for the following reason: the "MicroCan" must make sufficient electrical contact at its peripheral edge as well as at its flat forward face, so there must be a close contact fit between the peripheral edge of the "MicroCan" and the receptacle. In other words, there is a very close fit between the "MicroCan" and the receptacle. To the extent the user holds the card or fob away from the "MicroCan" to avoid blocking the user's view, the less aligned the user's hand is with the "MicroCan"; this increases the awkward feeling of the operation. The converse is also true: moving the user's hand closer to the "MicroCan" may lessen the awkward feeling but will tend to increase the interference with the user's free view of the "MicroCan" relative to the receptacle.
It is also noted that when gripping the card or fob for such an operation, the user's thumb and fingers are in general alignment with the plane of the card or fob but transverse to the direction of forward and rearward movement of the "MicroCan" into and out of the receptacle. This tends to amplify the sense and feeling that multiple successive movements are required: first, the transverse aligning movement in the direction the fingers are aligned, then the separate forward movement in a direction at right angles to the direction in which the fingers are aligned. If the alignment is inaccurate at first, additional transverse aligning and forward inserting movements are required.
It will also be noted that it is important that the forward face of the "Microcan" be generally parallel to the face of the receptacle during the insertion. This in turn requires that the long axis of the fob handle not only be generally parallel with the receptacle face but that the correct rotational attitude of the fob handle about the long axis be maintained.
Fumbling around to achieve such alignment and insertion tends to be frustrating, like struggling to insert a key in a dark hallway or at night.

Implement for controlling an electronic lock mechanism


According to one embodiment, a first correlation calculator calculates a correlation between first pixel blocks, and detects as first reference pixels actual pixels contained respectively in the first pixel blocks with the highest correlation. A second correlation calculator calculates a correlation between second pixel blocks, and detects as second reference pixels actual pixels contained respectively in the second pixel blocks with the highest correlation. The first pixel blocks include pixels arranged in a plurality of rows and columns The second pixel blocks include pixels arranged in at least one row less than the rows of the first pixel blocks and a plurality of columns. An interpolation calculator calculates, when the first reference pixels are located perpendicular to the actual pixel lines, the pixel value of the interpolation pixel based on the second reference pixels.

1. Field
One embodiment of the invention relates to an image expansion apparatus that expands an image by pixel interpolation and a method thereof.
2. Description of the Related Art
An image expansion apparatus is used in, for example, a digital television apparatus, to enlarge a digital image. Such an image expansion apparatus creates a new pixel line between already existing pixel lines, thereby enlarging a digital image. Upon creating the new pixel line, the image expansion apparatus calculates a pixel value of a pixel to be interpolated based on pixel values of already existing pixels.
As an example of such an image expansion apparatus, Japanese Patent Application Publication (KOKAI) No. 2007-60104 discloses an interpolation pixel generating apparatus that generates an interpolation pixel to be interpolated at a position based on an input image containing a plurality of input pixels. More specifically, the interpolation pixel generating apparatus calculates, based on the input image, an autocorrelation value in a range including the position with respect to each of a plurality of directions from the position. The interpolation pixel generating apparatus then detects a direction with a maximum autocorrelation value, and, based on the input image, generates the interpolation pixel using an interpolation filter corresponding to the direction with the maximum autocorrelation value.
When the pixel value of a newly generated pixel is obtained based on the pixel values of pixels located in a diagonal direction with respect to the new pixel, the pixel value may be erroneously interpolated. Especially, when an edge extends at an angle in an image and the angle is large, the edge may be jagged (so-called "jaggies" may occur along the edge).

Image expansion apparatus and image expansion method


A temperature insensitive DEMUX/MUX device whose wavelength does not change by environment temperature is provided for WDM application. The temperature insensitive DEMUX/MUX device includes a waveguide-based delay-line-interferometer configured to receive an input light bearing multiplexed wavelengths and output a first output light bearing the same multiplexed wavelengths but with a shifted intensity peak position. The first output light is transmitted into a DEMUX device through a first free space coupler and a grating fiber or waveguide to be demultiplexed for forming a plurality of second output lights each bearing an individual wavelength. The DEMUX device includes a second free space coupler for refocusing each second output light to corresponding output channel. The shifted intensity peak position of the first output light is tunable to make each second output light free from any temperature-induced drift off corresponding output channel.

The present invention relates to optical telecommunication techniques. More particularly, the present invention provides a silicon photonic device configuration of temperature insensitive DEMUX/MUX silicon and methods thereof.
Over the last few decades, the use of communication networks exploded. In the early days Internet, popular applications were limited to emails, bulletin board, and mostly informational and text-based web page surfing, and the amount of data transferred was usually relatively small. Today, Internet and mobile applications demand a huge amount of bandwidth for transferring photo, video, music, and other multimedia files. For example, a social network like Facebook processes more than 500 TB of data daily. With such high demands on data and data transfer, existing data communication systems need to be improved to address these needs.
Progress in computer technology (and the continuation of Moore's Law) is becoming increasingly dependent on faster data transfer between and within microchips. Optical interconnects may provide a way forward, and silicon photonics may prove particularly useful, once integrated on the standard silicon chips. 40-Gbit/s and then 100-Gbit/s data rates wavelength-division multiplexing (WDM) optical transmission over existing single-mode fiber is a target for the next generation of fiber-optic communication networks. The big hangup so far has been the fiber impairments like chromatic dispersion that are slowing the communication signal down. Everything is okay up to 10 Gbits/s plus a little, but beyond that, distortion and attenuation take their toll. Many approaches are proposed on modulation methods for transmitting two or more bits per symbol so that higher communication rates can be achieved. Mach-Zehnder modulators (MZM) can handle the higher data rates but require a driver that is differential with a wide output voltage swing. Beyond the light modulation for data transmission, the MUX/DEMUX of light signals is an essential building block for the optical network based on silicon photonics.
Silicon photonic devices can be made using existing semiconductor fabrication techniques, and because silicon-on-insulator is already used as the substrate for most integrated circuits, it is possible to create hybrid devices in which the optical and electronic components are integrated onto a single microchip. In particular, silicon photonic devices have been applied in WDM, especially dense-wavelength-division multiplexing (DWDM), optical transmission networks, in which DEMUX/MUX wavelengths may be changed by environment temperature to cause problems to optical signals transmitted through the networks. Conventionally, wavelength control may be performed in the arrayed waveguide grating (AWG) DEMUX using a TEC circuit which is usually associated with high power consumption. Therefore, improved wavelength control techniques on temperature insensitive DEMUX/MUX devices with much reduced power consumption are desired.

Temperature insensitive DEMUX/MUX in silicon photonics


The ink delivery hole 11 of the support member 10 made of ceramics that supports the recording head 2 consists of the elongated hole 12 provided with the inclined bottom surface 13 that opens on the ink jet recording head side and deepens toward the center and the small-diameter hole 14 that communicates therewith, while surface roughness of at least the inclined bottom surface 13 of the ink delivery hole 11 is set in a range from 0.4 to 1.0 μm in terms of arithmetic mean roughness (Ra) and the void ratio is set in a range from 5 to 30%. This constitution prevents bubbles, if ever entered, from staying in the ink delivery hole of the support member that supports the ink jet recording head, and enables it to stably discharge ink droplets of a predetermined quantity.

1. Field of the Invention
The present invention relates to an ink jet recording head structure to be mounted on a recording apparatus of ink jet printing system, an ink jet printer, a powder molding method, a method of manufacturing a recording head structure supporting member that employs the former and a powder molding press apparatus
2. Description of the Related Art
Recording apparatuses of ink jet printing system have been used as means for printing characters and images in colors on paper. Recently there are demands for higher density of printing as the resolution of the output images becomes higher.
An ink jet recording head mounted on a recording apparatus of ink jet printing system may utilize the thermal energy generated by a heat generating resistor, deformation of a piezoelectric element, the heat generated by irradiation of electromagnetic radiation or other means for the pressurizing mechanism that ejects ink droplets toward recording paper.
An ink jet recording head structure that employs the thermal energy generated by a heat generating resistor as the pressurizing mechanism, for example, comprises a flow passage member 23 having a plurality of ink chambers 24 and heat generating resistors 25 for pressurizing ink in the respective ink chambers 24, an ink jet recording head 22 constituted from a nozzle plate 29 that has ink discharge holes 28 communicating with the ink chambers 28, and a support member 30 made of ceramics that has ink delivery holes 31 communicating with the ink chambers 24 of the flow passage member 23 and supports the ink jet recording head 22. The Ink delivery hole 31 consists of an elongated hole 32 having an inclined bottom surface 33 that opens on the ink jet recording head side and deepens toward the center and a small-diameter hole 34 that communicates therewith.
In order to print on recording paper by using the ink jet recording head structure 21, a heat generating resistor 25 is caused to generate heat under the condition that ink is supplied through the ink delivery hole 31 into the ink chambers 24. This causes the generation of bubbles in the ink chambers 24 so as to pressurize the ink in the ink chambers 24, so that ink droplets are discharged through the ink discharge holes 28, thereby printing the ink on the recording paper (see, for example, Japanese Unexamined Patent Publication (Kokai) No. 2001-130004).
In the ink jet recording head structure 21 that utilizes the thermal energy generated by the heat generating resistor 25, interruption of bubbles may occur such that part of bubbles generated in the ink chamber 24 by the heat generated by the heat generating resistor 25 are broken, resulting in separated tiny bubbles staying in the ink chamber 24 and/or the ink delivery hole 31. When these tiny bubbles join with tiny bubbles, which are generated as the ink droplets are continuously discharged, or with subsequently generated bubbles so as to form larger bubbles, pressure in the ink chamber 24 changes leading to a change in the quantity of ink droplets discharged from the ink discharge hole 28, thus affecting the resolution of printing.
When the tiny bubbles staying in the ink delivery hole 31 join with other tiny bubbles and turn into larger bubbles staying therein, ink flow in the ink delivery hole 31 and discharge of ink droplets are impeded, resulting in such troubles as considerably uneven printing density, white spots due to ink application failure and lower printing resolution.
Since the ink delivery hole 31 of the support member 30 is generally formed by blasting or grinding process, there are machining chips and dust that have entered the pores and recesses that open on an inclined bottom surface 33 of elongated hole 32. These machining chips and dust cannot be completely removed by cleaning operation. When ink is supplied into the ink delivery hole 31 that has such elongated hole 32, the machining chips and dust that have entered the pores and recesses which open on the inclined bottom surface 33 mix into the ink. This may cause clogging of the ink discharge holes 28, in the case of a recording head structure provided with the ink discharge holes 28 of which diameter is made smaller as the printing resolution is improved.
The support member 30 is made of sintered ceramics. Press molding method has been employed in the powder molding process in order to efficiently produce a large quantity of such sintered ceramics.
Pressing process by means of an ordinary powder molding press apparatus is schematically shown in FIG. 9(a) through (c). First, ceramic material powder P is poured into a recess 38 formed by a die 35 and a lower punch 37, as shown in FIG. 9(a). Then as shown in FIG. 9(b), an upper punch 36 is lowered so as to press the ceramic material powder P thereby to form a ceramic compact. After pressing, the upper punch 36 is lifted while lowering the die 35, so that the ceramic compact S is taken out from the top of the die 35.
When molding a simple plate-shaped compact as described above, substantially uniform pressure can be applied over the entire surface of the ceramic compact. As a result, variation in density is small throughout the inside of the ceramic compact that is produced, and sintered ceramic body having good quality can be mass-produced without crack due to uneven shrinkage in the ceramic compact during the processes of molding and subsequent firing.
In order to produce sintered ceramics having a step, the molds are divided as shown in FIG. 10(a) through (c), and pressures applied to different portions are individually controlled so as to reduce the differences in density among portions of different thickness.
Specifically, ceramic material powder P is poured into a recess 45 formed by a die 41, a stationary punch 43, and a floating punch 44, as shown in FIG. 10(a). At this time, the floating punch 45 is positioned higher than the stationary punch 43 by a distance of the step height of the ceramic compact multiplied by the compression ratio of the ceramic material powder P. Then as shown in FIG. 10(b), an upper punch 42 is lowered so as to press the ceramic material powder P. At this time, the floating punch 44 lowers due to the pressure to the height of the step of the ceramic compact, so that density of the compact becomes equal between the flat portion and the stepped portion. Then as shown in FIG. 10(c), the upper punch 42 is lifted while lowering the die 41 and the floating punch 44, so that the ceramic compact S is taken out from the top of the die 41.
When manufacturing the support member 30 from ceramics having a through hole of different diameters as shown in FIG. 8(a) through (c), first a plate-shaped ceramic compact is made by a powder molding press apparatus as shown in FIG. 9(a) through (c), and then a compact having a groove 22 and a through hole 23 of small diameter communicating with the groove 22 formed by blasting or the like is sintered, or a compact made by injection molding process is sintered.
However, when manufacturing the support member 30 from ceramics as shown in FIG. 8(a) through (c), the method of forming the through hole of different diameters in a plate-shaped ceramic compact formed by the powder molding press apparatus by blasting or the like as shown in FIG. 8(a) through (c) has such problems as shape and dimensions are subject to variations, longer time is taken for processing operation and problem in the product quality, and the method is not suited for mass production.
In the case of forming a ceramic molding having through hole of different diameters by injection molding, on the other hand, although such a complicated shape as described above can be formed accurately relatively easily, it is necessary to use a mold of complicated shape corresponding to the complicated product shape which leads to a high manufacturing cost, and the speed of molding is low. As a result, the injection molding process is inferior to the powder molding press apparatus in terms of applicability to mass production. Moreover, since the material used in the production includes much binder, the injection molded compact takes time for degreasing four to five times longer than that for the ceramic compact formed by the powder molding press apparatus, thus providing lower productivity.
With this background, the inventors of the present application studied the possibility of integral molding of a ceramic compact that constitutes the support member 30 having a through hole of different diameters shown in FIG. 8(a) through (c) by the powder molding press apparatus shown in FIG. 10(a) through (c) which is superior in mass production. However, it was found that, since such a ceramic compact as shown in FIG. 8(a) through (c) has the inclined bottom surface 33 of which thickness changes continuously as shown in section A, it is difficult to maintain uniform density of the compact in the tapered portion of the inclined bottom surface 33 simply by splitting the mold as shown in FIG. 10(a) through (c), and such problems occur as cracks in the molding and deformation due to shrinkage during sintering.

Ink jet recording head structure, ink jet printer, powder molding method, method of manufacturing recording head structure supporting member, and powder molding press apparatus


A tool and an associated bit driver are provided. The tool includes a handle and a bit driver carried by the handle. The bit driver can include a body defining a cavity for receiving a bit and a pivotable lock configured to move between a locked position in which the lock engages the bit and an unlocked position in which the lock is spaced and thereby disengaged from the bit. The pivotable lock can include a pivot pin, an engagement member for engaging the bit and an actuation member with the engagement and actuation members extending along the body in opposite directions from the pivot pin.

Tools, such as multipurpose tools are widely popular for their utility in a substantial number of different applications. As its name suggests, a multipurpose tool includes a number of tools carried by common frame. A multipurpose tool may include different combinations of tools depending upon its intended application. For example, multipurpose tools that are designed for a more universal or generic application can include pliers, a wire cutter, a bit driver, one or more knife blades, a saw blade, a bottle opener or the like. Other multipurpose tools are designed to service more specific applications or niche markets and correspondingly include tools that are useful for the intended application. For example, multipurpose tools may be specifically designed for automobile repairs, hunting, fishing or other outdoor applications, gardening, military applications and the like.
As multipurpose tools are frequently carried by users in the field it is desirable for the multipurpose tools to be relatively small and lightweight while remaining rugged so as to resist damage. In order to reduce the overall size of a multipurpose tool, some multipurpose tools have been designed to be foldable. In this regard, foldable multipurpose tools are designed to move between a closed position and an open position. Generally, the closed position is more compact with the multipurpose tool frequently being carried in the closed position. Conversely, while the open position is generally less compact than the closed position, the open position generally allows the deployment of one or more of the tools that are stowed and relatively inaccessible when the multipurpose tool is in the closed position.
For example, a multipurpose tool may include pliers having a pair of jaws connected to respective handles. In the open position, the pliers are deployed and capable of being actuated by movement of the handles toward and away from one another. In the closed position, the handles may be folded about the pliers such that the pliers are no longer functional. In the closed position, however, the multipurpose tool is more compact with the form factor generally defined by the proximal relationship of the handles.
One reason for the popularity of multipurpose tools is the capability provided by a multipurpose tool to provide a wide range of functionality with a single tool, thereby reducing the need to carry a number of different tools to perform those same functions. For example, a single multipurpose tool may be carried instead of a pair of pliers, one or more screwdrivers, a knife and a bottle opener. As such, the burden upon a user is reduced since the user need only carry a single multipurpose tool.
As noted above, one common tool of a multipurpose tool is a bit driver. A bit driver is advantageously designed to receive a variety of different bits in order to increase the functionality of the multipurpose tool. Bit drivers may frictionally engage a bit so as to secure the bit within the bit driver during use. In order to remove the bit, such as in instances in which the user desires to utilize a different bit, the user can pull the bit from the bit driver, thereby overcoming the frictional force that otherwise retains the bit within the bit driver. At least some bit drivers have included a spring member to frictionally engage the bit. For example, one conventional bit driver includes a spring disposed in a sidewall of the bit driver and having an inwardly turned portion for engaging a bit and for securing the bit within the bit driver during use. In order to remove the bit, a user could pull the bit from the bit driver by applying a force sufficient to overcome the force applied by the spring and to cause the spring to flex outwardly by the amount necessary to permit the bit to be removed.
While conventional bit drivers have been serviceable, it would be desirable to design a bit driver that more securely retains the bit within the bit driver, such as during use of the bit. Moreover, it would be desirable to design a bit driver that could be selectably actuated in order more readily release the bit to facilitate the removal and insertion of bits.


A room temperature curing composition of this invention comprises an emulsion obtained by multi-stage emulsion polymerization of monomers, the emulsion comprising emulsion particles, a core of which comprises (A) 1 to 30% by weight of silyl group-containing vinyl monomer, (B) 70 to 99% by weight of vinyl monomer copolymerizable with component (A), the outermost shell of which comprises (A) 0.1 to 30% by weight of silyl group-containing vinyl monomer and (B) 40 to 99.4% by weight of vinyl monomer copolymerizable with component (A), and (D) 0.5 to 30% by weight of hydrophilic vinyl monomer. The room temperature curing composition of this invention has a stable silyl group, and a much improved film-forming ability after long-term storage and it also shows excellent mechanical stability, water-resistance, durability and white enamel gloss.

Recently, in the field of coatings and adhesives, organic solvent-based systems are being replaced with water-soluble or dispersible systems as an anti-pollution measure or resource saving.
However, the conventional water-based coatings have disadvantages in that, since they have no crosslinkable functional group in the molecules, they are subject to the strong influence of surfactants used in the polymerization, which remarkably deteriorate the weatherability, water resistance and stain resistance of formed coating films, resulting in inferior film performances as compared with solvent-based paints.
Therefore, to provide crosslinkable functional groups in the molecules, an application of an alkoxysilyl group-containing emulsion to the field of coatings has been proposed. However, the alkoxysilyl group is easily hydrolyzed in the presence of water so that the film-forming performance of the emulsion is deteriorated considerably after aging and, moreover, the emulsion is poor in mechanical stability and white enamel gloss.


A semiconductor memory device includes first structure bodies and second structure bodies arranged alternately along a first direction. The first structure body includes electrode films arranged along a second direction. The second structure body includes columnar members, first insulating members, and second insulating members. The columnar member includes a semiconductor member extending in the second direction and a charge storage member provided between the semiconductor member and the electrode film. The second insulating members are arranged along a third direction. Lengths in the first direction of the second insulating members are longer than lengths in the first direction of the first insulating members. Positions of the second insulating members in the third direction are different from each other between the second structure bodies adjacent to each other in the first direction. The columnar members and the first insulating members are arranged alternately between the second insulating members.

A three-dimensional semiconductor memory device has been developed in recent years. In the three-dimensional semiconductor memory device, a stacked body in which multiple electrode films are stacked is provided on a substrate; multiple semiconductor members that pierce the stacked body are provided; and memory cell transistors are formed at the crossing portions between the electrode films and the semiconductor members. In the three-dimensional semiconductor memory device as well, even higher integration of the memory cell transistors is desirable.


A ballast (10) for powering at least one gas discharge lamp (20) comprises a switching converter (100) and an inverter (900). Switching converter (100) includes a transistor (130) and a control circuit (200) that provides substantially zero voltage switching of the transistor (130) at a very high frequency. Preferably, control circuit (200) includes a drive circuit (300), a turn-on synchronization circuit (400), a current mirror circuit (500), a rail voltage regulator circuit (600), and a lamp current regulator circuit (700). Drive circuit (300) is preferably realized by a circuit arrangement that includes a standard pulse-width modulation integrated circuit (310).

A need exists for a ballast that includes a zero voltage switching converter that is capable of operating at a very high frequency (e.g., up to 900 kilohertz) and that includes a control circuit that may be implemented using standard (i.e., "off-the-shelf") components. Zero voltage switching (ZVS) is desirable because it reduces switching power losses in the converter transistor and thus enhances the overall energy efficiency of the ballast. Standard components are preferred due to a number of practical considerations, including material cost, part availability, and design flexibility. High frequency operation is desirable because it makes possible the use of planar type magnetic components (instead of conventional core-and-bobbin type components) and the elimination of large electrolytic capacitors (which are physically large and which tend to significantly detract from the useful operating life of the ballast). Such a ballast, in comparison with existing ballasts, would provide higher energy efficiency, reduced physical size, material cost, enhanced operating life, and lower material cost, and would thus represent a significant advance over the prior art.

Ballast with zero voltage switching converter


A Schmitt trigger input buffer circuit includes two inverting gates with different threshold voltages, which receive an input signal, a dual-input-AND pair and dual-input-NOR composite gate, and another inverting gate. Two of the inputs of the composite gate receive the outputs from the two inverting gates. The output signal of the composite gate and its inverted version are fed back respectively to the remaining two inputs of the composite gate.

Known types of Schmitt trigger input buffer circuits include one which uses a combination of CMOS inverters and a resistor, one which uses a R-S flip-flop comprising two NOR gates or two NAND gates, and one which uses three or more NAND gates.
An example of Schmitt trigger input buffer circuit using CMOS inverters and a resistor is shown in FIG. 6 of Japanese Unexamined Patent Publication No. SHO 62-292014 published on Dec. 18, 1987. The Schmitt trigger input buffer circuit of this type includes three inverters connected in series with an input terminal, a resistor connected in parallel with the series combination of the second and third inverters, and an output terminal connected to the output of the second inverter. A resistor may be substituted for the first inverter. Further, an inverting output terminal may be connected to the output of the third inverter. This type of Schmitt trigger input buffer circuit has disadvantages since the adjustment of its hysteresis characteristic is not easy and its input impedance cannot be large.
The second one of the above-mentioned types of Schmitt trigger input buffer circuits, which includes a R-S flip-flop employing NOR gates, is shown, for example, in FIG. 7 of Japanese Unexamined Patent Publication No. HEI 1-123517 published on May 16, 1989. An example of this type of Schmitt trigger input buffer circuit is shown in accompanying FIG. 1. The circuit of FIG. 1 includes an input terminal 1, a first input gate 2 comprising an inverting gate, a second input gate 3 comprising an inverting gate, an output terminal 4, and a third input gate 9 which is connected in series with the second input gate 3 and which comprises an inverting gate. The circuit further includes a first NOR gate 10 having two input terminals 10a and 10b, and a second NOR gate 11 having two input terminals 11a and 11b. In the above-cited Japanese Unexamined Patent Publication No. HEI 1-123517, a dual inverting input AND gate is used in place of the NOR gate 10, but its function is the same as that of NOR gate 10. The first and second NOR gates 10 and 11 form a R-S flip-flop 30.
An input signal SIN is applied at the input terminal 1 and coupled through two signal paths which respectively include the input gate 2, and the series combination of the input gates 3 and 9, to the R-S flip-flop circuit 30, as two inputs which are inverted with respect to each other. In the illustrated example, in FIG. 1, the input terminals 10a and 11b of the respective NOR gates 10 and 11 provide input terminals of R-S flip-flop circuit 30. An output signal SOUT is derived from an output terminal of R-S flip-flop circuit 30 or terminal 4, which is an output of the NOR gate 10.
In the R-S flip-flop 30, one input terminal 10a of the NOR gate 10 is connected to the output of the input gate 2, as stated above, and the other input terminal 10b of the NOR gate 10 is connected to the output of the NOR gate 11. One input terminal 11a of the NOR gate 11 is connected to the output of the NOR gate 10, and the other input terminal 11b is connected to the output of the input gate 9.
In the Schmitt trigger input buffer circuit with the above-described structure, a SET signal (not shown) having the same logic value (1 or 0) as the input signal SIN is applied from the input gate 9, a RESET signal (not shown) having a different logic value (0 or 1) is applied from the input gate 2, and, therefore, the output signal SOUT, having the same logic value as the input signal SIN, is developed at the output terminal 4. Hysteresis is provided for the output signal SOUT with respect to the input signal SIN by setting different threshold voltages VT2 and VT3 for the input gates 2 and 3, respectively.
Now, the operation of this Schmitt trigger input buffer circuit, when the amplitude of the input signal SIN applied to the input terminal 1 rises from the ground potential GND to a supply potential VDD, is explained.
When the input terminal 1 is at the ground potential GND, the outputs of the input gates 2 and 3 are at the supply potential VDD. Thus, the output of the third input gate 9 is at the ground potential GND. The first NOR gate 10 to which the output at the ground potential GND of the first input gate 2 is applied develops the ground potential GND as its output. The second NOR gate 11 receives the output value, i.e. the ground potential GND, of the third input gate 9, and also the output value, i.e. the ground potential GND, of the first NOR gate 10, and develops the supply potential VDD as its output.
As stated previously, input gates 2 and 3 have operating threshold values VT2 and VT3, respectively. Let it be assumed that VT2<VT3. When the input signal voltage SIN increases and a condition in which VT3>SIN>VT2 occurs, the output of the first input gate 2 is inverted to the ground potential GND. However, since the output of the NOR gate 11 remains at the supply potential VDD, no change occurs in the outputs of the NOR gates 10 and 11.
When the input signal SIN further increases to a value above the threshold voltage VT3 of the second input gate 3, the outputs of the input gates 3 and 9 are inverted so that the ground potential GND and the supply potential VDD are respectively developed. The second NOR gate 11 receives the supply potential VDD which is the output of the input gate 9, and develops the ground potential GND as its output. Therefore, first NOR gate receives the output GND from the NOR gate 11 and the output GND from the first input gate 2, and develops the supply potential VDD at its output.
Next, the operation in which the voltage of the input signal SIN at the input terminal 1 changes from the supply potential VDD down to the ground potential GND, is considered.
When the input terminal 1 is at the supply potential VDD, the outputs of both input gates 2 and 3 are at the ground potential GND. Accordingly, the output of the third gate 9 is at the supply potential VDD. This output of gate 9 causes the second NOR gate 11 to develop an output at the ground potential GND. The first NOR gate 10 receives the output at the ground potential GND of the input gate 2 and the output potential GND of the second NOR gate 11, and develops an output at the supply potential VDD as its output.
When the input signal SIN decreases and becomes below the lower one of the threshold voltages VT2 and VT3 of the input gates 2 and 3, VT3 in the present example, the outputs of the input gates 3 and 9 are inverted, so the output of the input gate 9 becomes the ground potential GND. This, however, does not affect the outputs of the NOR gates 10 and 11. When the input signal voltage SIN further decreases and becomes lower than the threshold voltage VT2 of the input gate 2, the output of the input gate 2 becomes the supply potential VDD and the output of the NOR gate 10 becomes the ground potential GND, while the NOR gate 11 develops an output at the supply potential VDD.
As is understood from the above-described operation, when the input signal SIN rises, the inversion of the output signal SOUT occurs at the higher threshold voltage VT3, while it occurs at the lower threshold voltage VT2 when the input signal SIN falls. Like this, the conventional Schmitt trigger input buffer circuit shown in FIG. 1 has different threshold voltages VT2 and VT3 for the input gates 2 and 3 (e.g. VT2<VT3), which provides the output signal SOUT with a hysteresis characteristic relative to the input signal SIN and, thus, provides a desired wave shaping function.
Because the hysteresis characteristic is determined by properly setting the operating threshold voltages of the two input gates, the adjustment of the hysteresis characteristic is easy, and the input impedance of this Schmitt trigger input buffer circuit can be chosen as desired.
However, the conventional Schmitt trigger input buffer circuit shown in FIG. 1 has a disadvantage because the R-S flip-flop circuit 30 is subject to external noise, such as noise contained in the input signal and noise undesirably introduced into it from power supply circuitry, it could operate erroneously.
For instance, let it be assumed that the input signal SIN slowly falls from the supply potential VDD toward the ground potential GND. When the input signal SIN decreases and crosses VT2, the output of the input gate 2 gradually increases toward the supply potential VDD. As explained above, in this condition, changes of the outputs of the NOR gates 10 and 11 are dependent on changes of the output of the input gate 2. Accordingly, when the potential at the input terminal 10a comes to have a value close to the threshold voltage of the NOR gate 10 as the output of the input gate 2 increases, the outputs of the NOR gates 10 and 11 change accordingly so that the other input terminal 10b of the gate 10 also receives a voltage near the threshold of the NOR gate 10.
This condition, however, is an unstable condition in which the output has not yet been changed completely. Therefore, if noise is applied through the input line, the power supply circuit or the like under this unstable condition, it is highly probable that the R-S flip-flop circuit 30 may operate erroneously in response to such noise.
Furthermore, if this Schmitt trigger input buffer circuit is formed as a CMOS circuit, unstable operating periods may occur because of an operating speed of P-channel MOSFET's which is slower than that of N-channel MOSFET's, and, therefore, if noise is applied during such unstable operating periods, the circuit may operate erroneously.
The third type of Schmitt trigger input buffer circuit which employs a R-S flip-flop comprising NAND gates is shown, for example, in FIGS. 7, 1 and 5 of Japanese Unexamined Patent Publication No. SHO 62-292014. This type of circuit includes a pair of dual-input NAND gates. One input of each of the NAND gates is coupled to the output of the other NAND gate, and anti-phased inputs are applied to the other inputs through appropriate input gates, such as inverters and NAND gates. Anti-phased outputs are derived from the pair of NAND gates. As in the case of the above-described second type of Schmitt trigger input buffer circuit, the adjustment of the hysteresis characteristic is relatively easy and an appropriate value of the input impedance can be obtained in this third type, too. However, it is impossible to prevent this circuit from being subject to erroneous operation caused by noise, too.
The fourth type of Schmitt trigger input buffer circuit which uses three or more NAND gates is shown, for example, in FIG. 4 of Japanese Unexamined Patent Publication No. SHO 61-223671 published on Oct. 4, 1987. This circuit includes first and second dual-input NAND gates. An input signal is applied to one of inputs of each NAND gates. The outputs of the two NAND gates are applied to first and second inputs of a third dual-input NAND gate, respectively. The output of the third NAND gate is coupled back to the other input of the second NAND gate. The two inputs of the first NAND gate are coupled together.
Adjustment of the hysteresis characteristic of this circuit is relatively easy, but the circuit tends to erroneously operate in response to noise.


A method and system for forming a dynamic model for the behavior of machines from sensed data. The method and system generates a dynamic model of the machine by applying a canonical variate analysis (CVA) method to subspace system identification extending to parameter varying (LPV) systems and nonlinear (NL) systems in order to make implementation of the computation feasible and accurate.

The modeling of nonlinear and time-varying dynamic processes or systems from measured output data and possibly input data is an emerging area of technology. Depending on the area of theory or application, it may be called time series analysis in statistics, system identification in engineering, longitudinal analysis in psychology, and forecasting in financial analysis.
In the past there has been the innovation of subspace system identification methods and considerable development and refinement including optimal methods for systems involving feedback, exploration of methods for nonlinear systems including bilinear systems and linear parameter varying (LPV) systems. Subspace methods can avoid iterative nonlinear parameter optimization that may not converge, and use numerically stable methods of considerable value for high order large scale systems.
In the area of time-varying and nonlinear systems there has been work undertaken, albeit without the desired results. The work undertaken was typical of the present state of the art in that rather direct extensions of linear subspace methods are used for modeling nonlinear systems. This approach expresses the past and future as linear combinations of nonlinear functions of past inputs and outputs. One consequence of such an approach is that the dimension of the past and future expand exponentially in the number of measured inputs, outputs, states, and lags of the past that are used. When using only a few of each of these variables, the dimension of the past can number or 104 or even more than 106. For typical industrial processes, the dimension of the past can easily exceed 109 or even 1012. Such extreme numbers result in inefficient exploitation and results, at best.
Other techniques use an iterative subspace approach to estimating the nonlinear terms in the model and as a result require very modest computation. The iterative approach involves a heuristic algorithm, and has been used for high accuracy model identification in the case of LPV systems with a random scheduling function, i.e. with white noise characteristics. One of the problems, however, is that in most LPV systems the scheduling function is usually determined by the particular application, and is often very non-random in character. In several modifications that have been implemented to attempt to improve the accuracy for the case of nonrandom scheduling functions, the result is that the attempted modifications did not succeed in substantially improving the modeling accuracy.
In a more general context, the general problem of identification of nonlinear systems is known as a general nonlinear canonical variate analysis (CVA) procedure. The problem was illustrated with the Lorenz attractor, a chaotic nonlinear system described by a simple nonlinear difference equation. Thus nonlinear functions of the past and future are determined to describe the state of the process that is, in turn used to express the nonlinear state equations for the system. One major difficulty in this approach is to find a feasible computational implementation since the number of required nonlinear functions of past and future expand exponentially as is well known. This difficulty has often been encountered in finding a solution to the system identification problem that applies to general nonlinear systems.
Thus, in some exemplary embodiments described below, methods and systems may be described that can achieve considerable improvement and also produce optimal results in the case where a 'large sample' of observations is available. In addition, the method is not 'ad hoc' but can involve optimal statistical methods.

This patent is subject to a terminal disclaimer.

Method and system of dynamic model identification for monitoring and control of dynamic machines with variable structure or variable operation conditions


By moving a substrate relative to a shadow mask in a reactive ion etching system, we are able to precisely tailor the thickness of critical layers. To minimize disturbing the plasma, all the mechanical components are kept below the anode. The system is highly reproducible, and can be programmed to yield arbitrary vertical profiles along one horizontal axis. Using silicon-on-insulator substrates, the resonance wavelength was modified as a function of position with better than 1 nm control in the vertical dimension. This technique should prove useful for optical devices where the thickness of the layers controls the device characteristics.

While lateral patterning of semiconductors is readily obtained through photolithography, there is a need for an improved method to vary the thickness or composition of layers along a device. A simple technique to controllably adjust the vertical dimension would be extremely useful for many optical devices. For example, in Vertical Cavity Surface-Emitting Lasers (VCSELs), or resonant cavity photodetectors, the thickness of the resonator controls the wavelength, and by varying this thickness along a device or in any array, multiple wavelength operation can be achieved.
The simplest method for varying the thickness along a wafer is by relying on growth-induced non-uniformities. This method has been used to yield multiple wavelength layer arrays and LEDs. A more advanced technique, selective area epitaxy, uses an oxide mask to shield part of the wafer during metalorganic chemical vapor deposition (MOCVD) growth and thus cause an increased growth rate on the un-masked portions. This method has been successfully used to form waveguide laser arrays and in a modified form used for vertical cavity lasers. Another technique in molecular beam epitaxy (MBE) uses local heating to decrease the growth rate to yield a somewhat controllable taper in the thickness. Masks have also been used in an MBE chamber to shield parts of the wafer during growth and give discrete changes in the thickness. Finally, repeated lithographic and etching steps have also been used for multiple wavelength arrays.

Thickness control of semiconductor device layers in reactive ion etch processes

International Business Machines Corporation


In a method of wagering, one or more primary bettors place wagers having an applicable base take-out or rake rate, and thus yielding a base payout for winning wagers. One or more secondary bettors may place wagers having an applicable modified take-out or rake rate (preferably lower than the base take-out or rake rate), thus yielding a higher payout for winning wagers than the base payout. The wagering may occur relative to card games such as poker, or other types of games or events, including sports betting. Bets may be placed with a host, such as a casino or track, or an off-track entity.

Pari-mutuel wagering is a well established method of wagering. In accordance with pari-mutuel wagering, bettors' wagers are aggregated into a pool, less a house commission. This commission, which may be referred to as the "take-out" or "vig", may comprise a percentage of each wager. For example, relative to horse racing wagers, the house or track take-out may be 10-30%, depending upon the particular wager and race track. The results of the wagered-upon event are determined and the number of bettors who won their wagers is determined. The winning bettors each share the winnings pool in proportion to the size of their wager to the other winning wagers.
For example, ten bettors may each wager $100, five of the bettors wagering that Horse 1 will win a certain race and five of the bettors wagering that Horse 2 will win the race. Assuming that the house take-out is 15%, $15 of each bettor's $100 wager is taken by the house (for a total house take-out of $150) and the remaining $85 of each bettor's $100 wager is placed into the winnings pool (for a total winnings pool of $850). Assuming that Horse 1 wins the race, the five bettors who correctly wagered upon Horse 1 each share in the $850 winnings pool and are each thus paid $850/5, or $170.
This arrangement has been utilized for many years at racetracks and similar locations. Originally, bettors had to travel to the racetrack in order to place their wagers. This meant that many bettors who wanted to place bets couldn't, and also meant that tracks often missed the opportunity to accept wagers from certain bettors.
In order to solve this problem, off-track betting (OTB) locations were created. OTB operators take bets from bettors and place them with the track host. For example, an OTB operator in Nevada may accept wagers from bettors in Las Vegas and place them with the host of a horse track in New York. In this arrangement, track hosts are able to garner a higher volume of wagers. In order to facilitate these OTB operators, track hosts typically permit the OTB operator to place their bettors' wagers subject to a commission payable to the track host. For example, a track host may require that an OTB pay a commission on the gross wagers placed with the OTB. The OTB charges the same take-out of 10-30% to their bettors and then pays the track host commission from that take-out. This allows the OTB operator who charges a 15% take-out to their bettors, and who pays a 3% commission to the track host, to retain 12% of the wagers placed at an OTB—an incentive which drives a higher level of betting to the track, on which addition betting the track host still collects 3%.
However, OTB's have a desire to provide their bettors with further incentive to place bets.

Method and system for varying the take-out or rake rate on wagers placed in a wagering pool


The systems, methods and related software products which enable users to temporarily store and subsequently retrieve information are disclosed. The system includes a plurality of input devices, client computers (each having a user-specific personal finance application) and a web-site server with a database. The input devices, client computers and server are communicatively linked via a communication network so that a plurality of users can temporarily store and/or manipulate financial transaction information on the server from any of the input devices. Each user can also transmit financial profile information to the server. This information enables the server to replicate the unique profile characteristics for each of the finance applications. This, in turn, simplifies remote entry of information, subsequent download of that information and integration of such information into each user's personal finance application.

1. Field of the Invention
The present invention relates to the exchange of financial information over a global communication network. More particularly, the invention relates to centrally storing financial information received from mobile users and subsequently providing that information back to the respective users so that it can be integrated into the users' personal finance software.
2. Description of the Related Art
Computer-based record keeping of financial information by individuals has been extremely popular in recent years. With improvements in, and the wide-spread increase in the popularity of, personal computers, more and more individuals have begun using home desktop computers to compile their financial records. Today, software packages for use on personal computers allow users to track their investments and loans, bank and pay bills online, monitor expenditures, create detailed financial reports and prepare tax returns. One such personal finance application is Quicken® deluxe 98 manufactured and sold by Intuit, Inc. of Mountain View, Calif. The various features of this software package are fully described in the software user's manual entitled "Getting More from Your Money," 2nd printing (Intuit part number 250036) published in October 1998, the entire contents of which are hereby incorporated by reference.
The use of personal finance software has enabled users to more effectively control their finances which, naturally, leads to more efficient utilization of personal resources. For example, by monitoring monthly expenditures on dining, automobile-related expenses, utilities and/or healthcare, individuals are now, more than ever, capable of controlling such expenses. Moreover, individuals using personal finance software are more capable of predicting their financial obligations well into the future. Accordingly, individuals can now better predict whether they have the financial wherewithal to fulfill the obligations associated with potential financial transactions. These and other benefits of using personal finance software on home computers has yielded a virtual revolution in the ability of individuals to control their personal finances.
A number of deficiencies associated with such personal finance applications, however, arise from the facts that most personal finance applications are customizable and are resident on personal computers that remain stationary in the user's home. Generally, a user defines a particular financial profile (i.e., the personalized set of values selected to, at least in part, define a user's own financial model) when using a personal finance application. This financial profile describes the user's financial relationships and obligations, assets and other modalities by which the user creates or describes financial transactions. By way of example only, one financial profile parameter may describe the types of accounts utilized by an individual. Some of the possible values for the account parameter may include a checking account, a savings account, a credit card account, a money market account, a liability account, a bills/payables account, an asset account, an invoice/receivables account, a cash account, etc. Numerous other examples of financial profile parameters and parameter values are disclosed herein and others will readily occur to those of skill in the art.
While the above-discussed attributes of personal finance software packages offer many advantages to users, they also virtually inescapably lead to the limitation that, in order to input financial transaction information, a given user must have access to the computer in the user's home. In part, this is because, once customized, the financial profile of each user's personal finance application is unique. For example, each profile may include a different set of accounts, categories and, often, classes to permit the user to more efficiently organize transactions. Similarly, each value in each set of accounts, categories and classes can have a user-specified name. Moreover, insofar as a given personal finance application will, at any point in time, contain an accumulated amount of previously inputted financial information, users cannot practically utilize personal finance applications other than their own. Accordingly, a user who wishes to use a personal finance application must, as a practical matter, return to the same computer each time new transaction information is to be added to the application.
This deficiency leads to the possibility that delays in entering information will yield errors in the inputted transaction information, or worse, will lead to omissions to enter such information entirely. For example, a user on a day-long shopping trip will typically purchase items at a number of different stores, stop for gasoline and dine out twice before returning home. When the user finally gets the opportunity to access the user's personal computer to enter the transaction information for the day, the user may have forgotten some details of a given transaction or may have entirely forgotten about some transactions. Such errors may not be corrected, if at all, until much later. Therefore, such errors will skew all further financial analyses and reports which rely on the integrity of the information entered into the personal finance software.
Deficiencies of the general nature discussed above, are particularly acute when the user is away from home for an extended period of time such as while on a vacation or business trip. In cases such as this, when a user's personal computer may be inaccessible for weeks on end, the likelihood of compromising the integrity of the user's financial records increases markedly. For example, a week-long vacation easily could result in dozens of financial transactions totaling thousands of dollars. Obviously, significant delays in recording such transactions can have a substantial impact on the quality of the information subsequently entered into and retrieved from a personal finance application.
Attempts have been made to reduce the chance of erroneous entries being made in personal finance applications by increasing the timeliness with which transactions are recorded. For example, the advent of personal digital assistants ("PDA"), such as the Palm Pilot® made by 3Com, Inc. of Milpitas, Calif., can now be used to promptly record personal financial transactions as long as a user has a PDA at the time of a given transaction. In particular, personal finance software designed to integrate with, and to complement, companion software on a home-based personal computer is now available for PDAs. With a PDA and such software, a user simply enters financial transaction information on the PDA and, upon returning home, downloads the recorded transactions into the user's personal computer. Since such PDA software products are compatible with the desktop version of the personal finance software, they enable users to capture checking, credit card and cash transactions while on the road. Naturally, such systems have increased the accuracy of personal financial record keeping.
The use of PDAs, however, has not entirely solved the problems of erroneous and/or omitted entries because, for example, there are a significant number of individuals who do not have PDAs. Thus, individuals who dislike PDAs and/or who are unwilling to bear the often significant expense of purchasing and using a PDA continue to be plagued by the above-described deficiencies. Moreover, attempts to enter financial transactions on a PDA can be thwarted if a user inadvertently leaves the user's PDA at home or if the user's PDA is damaged in some way.
Therefore, there remains a need in the art for alternative systems, methods and related software products for recording personal financial transactions by individuals who do not have immediate access to their personal computers.
There remains an additional need in the art for alternative systems, methods and related software products which are capable of (1) temporarily storing financial information provided by a plurality of users while preserving the confidentiality of each user's information; and (2) permitting those users to subsequently retrieve the stored information so that it can be integrated into the user's personal finance software.
There remains yet another need in the art for alternative systems methods and related software products of the type described above which offer users an optimal combination of simplicity, reliability, efficiency and versatility.

Web-based entry of financial transaction information and subsequent download of such information