A push switch includes a lower case having a recess therein, an inner and outer fixed contacts exposing from a bottom of the recess, a movable contact accommodated in the recess, an upper case attached to the lower case, an elastic operation body for sealing the recess of the lower case, and a push button provided on the elastic operation body. The movable contact has a dome shape having a concave surface facing the inner fixed contact by a distance, a convex surface opposite to the concave surface, and an outer peripheral end placed on the outer fixed contact. The upper case has a through-hole located above the recess of the lower case. The has a lower surface contacting the convex surface of the movable contact, an upper surface opposite to the lower surface, and an outer edge held between the upper case and the lower case while being compressed. The push button is inserted into the through-hole of the upper case movably. This push switch prevents dust from entering in the switch and operates reliably.

A push switch providing a light click feeling has been often used for an input/operation section of various electronic devices. A push switch is demanded to be activated with a light operation force to reduce a burden to fingers and to have a long operation stroke particularly for use as an input device, such as a mouse, of a personal computer.
FIGS. 6 and 7 are a cross-sectional view and an exploded perspective view of conventional push switch 501 disclosed in Japanese Patent Laid-Open Publication No. 9-147666. Lower case 1 has a box shape and is made of insulating resin and opens at its upper side. Lower case 1 has an recess having a bottom. Inner fixed contact 2A and outer fixed contacts 3A and 3B are exposed from the bottom surface and are fixed by an insert molding. Inner fixed contact 2A is fixed at the center of the bottom. Outer fixed contacts 3A and 3B are located at an outer periphery of the bottom. Inner fixed contact 2A is located at the midpoint between outer fixed contacts 3A and 3B. Outer fixed contacts 3A and 3B are electrically independent from inner fixed contact 2. Inner fixed contact 2A connected to terminal 2 for connection to an external circuit extends outwardly from side wall 1A of lower case 1. Outer fixed contacts 3A and 3B connected to terminal 3 for connection to an external circuit extend outwardly from side wall 1A.
Movable contact 4 is made of thin plate if conductive and elastic metal and is shaped to have a circular dome shape having an opening at its lower part. Edges of the outer peripheral end of movable contact 4 are located on outer fixed contacts 3A and 3B, respectively. The deepest point of the dome shape of the lower surface of movable contact 4 faces inner fixed contact 2A by a distance.
Elastic operation body 5 is located on movable contact 4. Elastic operation body 5 has flange section 5A having a circular disk shape, upper projection 5B projecting from the center of an upper surface of flange section 5A, lower projection 5C projecting from the center of an upper surface of flange section 5A, and tubular section 5D protruding from an outer peripheral edge of flange section 5A. Lower projection 5C has a lower end contacting an upper surface of the top of the dome shape of movable contact 4.
Push button 6 is made of insulating resin and has columnar section 6A and flange 6B provided at the lower part of columnar section 6A. Columnar section 6A has a lower surface having recess 6C provided at the center thereof. Push button 6 is provided on elastic operation body 5, such that the upper part of upper projection 5B of elastic operation body 5 is inserted in recess 6C.
Upper case 7 made of insulating resin is attached to lower case 1 by being caulked with projection 1B of lower case 1 to cover the recess of lower case 1. Upper case 7 has through-hole 7A.
Columnar section 6A of push button 6 is inserted into through-hole 7A of upper case 7 and is supported movably in up-and-down directions. The upper part of columnar section 6A protrudes from through-hole 7A in an upward direction. An upper surface of flange 6B of push button 6 contacts a lower surface of upper case 7. When push button 6 is not activated, push button 6 has recess 6C slightly push upper projection 5B of elastic operation body 5. Elastic operation body 5 urges push button 6 towards upper case 7, thereby preventing push button 6 from wobbling.
An operation of push switch 501 will be described below. FIG. 8 is a cross-sectional view of push switch 501 which is activated.
When columnar section 6A of push button 6 protruding from through-hole 7A of upper case 7 is depressed, push button 6 moves downward while being supported by through-hole 7A. When push button 6 moves, a pressing force is applied to upper projection 5B of elastic operation body 5 inserted into recess 6C of push button 6. The force pressurizes and compresses elastic operation body 5 in its longitudinal direction provided from upper projection 5B to lower projection 5C, accordingly applying a pressure via elastic operation body 5 to the top of the dome shape of movable contact 4 contacting lower projection 5C. When the pressure exceeds a predetermined value, the top of the dome shape of movable contact 4 is elastically inverted to have the lower surface of movable contact 4 contact inner fixed contact 2A with a click feeling, and connects outer fixed contacts 3A and 3B with inner fixed contact 2A via movable contact 4, thereby turning on push switch 501.
When movable contact 4 contacts inner fixed contact 2A, push button can be further pushed with a further pressing force downwardly. In this situation, outer fixed contacts 3A and 3B are electrically connected with inner fixed contact 2A via movable contact 4, as shown in FIG. 8, and upper projection 5B and lower projection 5C of elastic operation body 5 are compressed further elastically.
When the pressing force applied to push button 6 is removed, the pressure applied to elastic operation body 5 is canceled. Upper projection 5B and lower projection 5C accordingly return to have their original shapes and push up push button 6. Then, movable contact 4 is inverted to return to have its original dome shape. Then, movable contact 4 is removed away from inner fixed contact 2A, as shown in FIG. 6, to electrically disconnect outer fixed contacts 3A and 3B from inner fixed contact 2A, thereby turning off push switch 501.
In order to allow push button 6 to be movable, narrow gap 501A must be provided between through-hole 7A of upper case 7 and columnar section 6A of push button 6. When push switch 501 is activated, the upper surface of flange 6B of push button 6 is removed from the lower surface of upper case 7, as shown in FIG. 8, and an inside of the recess of lower case 1 communicates with the outside of push switch 501 via gap 501A. This may allow dust existing the outside of switch 501 to enter into the recess of lower case 1 through gap 501A during the activation of push switch 501. The dust would prevent movable contact 4 from contacting the fixed contacts, thereby preventing push switch 501 from operating appropriately.


A self-calibrating radio is described. In one exemplary implementation, a radio signal from its local voltage controlled oscillator. The calibration system automatically calibrates the radio by: (i) receiving a reference signal having a calibrated reference frequency, (ii) comparing the local frequency to the reference frequency to determine whether there is a difference between the local frequency and the reference frequency and (iii) adjusting the local frequency by an offset frequency, if the difference between the local frequency and the reference frequency is greater than a threshold value.

Government regulations in most countries require wireless devices to transmit signals within defined frequency bandwidths for a particular channel. With an ever-increasing demand for usage of wireless devices, many governments are shrinking the frequency bandwidths allowable for each channel. For instance, in the United States, the Federal Communications Commission (FCC) has reduced the public safety channel bandwidth for mobile radios from 25 KHz to 12.5 KHz with future plans to allow 6.25 kHz channel spacing. With the reduction of channel bandwidths, it has become ever more critical that each radio transmit information at accurate modulation frequencies within the maximum tolerated channel bandwidths.
Frequencies produced by radios are derived from crystals driving voltage controlled oscillators within the radios. The accuracy of the frequencies produced by the oscillators tend be affected by temperature, humidity, voltage, and a number of other factors. Such factors tend to cause the frequencies produced by the oscillators to drift over time. As a result of this frequency drift phenomenon and in light of narrower bandwidths requirements, radios need to be serviced and recalibrated more often to ensure they are operating within tolerated bandwidths.
Calibration involves removing the radios from operation and bringing them in for servicing. With larger demand for calibration maintenance due to the more stringent requirements for narrow bandwidth channels, the quantity of qualified personnel and centers able to perform these calibrations is limited. Consequently, radios can be subject to long periods of removal from operation while they are waiting to be serviced as well as an increased cost of maintenance to the user community.
Servicing involves connecting the radios to expensive calibration and test equipment and performing a large amount of manual processes that require well-educated service technicians. These manual processes tend be slow, tedious, and are prone to errors.


Disclosed are data transmission-reception system and data transmission method, in which a communication system includes: a first communication device for transmitting outgoing data including content identification data, transmitting party identification data, receiving party identification data, and date and time data; a second communication device for receiving the outgoing data and for transmitting content data identified by the content identification data to a receiving party identified by the receiving party identification data at a date and time corresponding to the date and time data; and a third communication device for receiving and reproducing the content data transmitted from the second communication device.

The present invention relates to a data transmission-reception system and a data transmission-reception method whereby content data such as greeting messages and advertisements are received at their destination at a date and time designated by a transmitting party.
A conventional data transmission-reception system is typically made up of a first terminal device acting as a transmitting party, a server device to which data are uploaded from the first terminal device, and a second terminal device which accesses the server device to download data transmitted from the first terminal device. The first and second terminals are structured as an ordinary personal computer each and are installed in households or other locations.
Illustratively, suppose that the first terminal device transmits a greeting message for a celebration to the second terminal device. In that case, the transmitting party creates the greeting message on the first terminal device, designates an e-mail address as a destination ID of a receiving party, and uploads the message to the server device. Meanwhile, the second terminal device is operated by a user (i.e., owner) accessing the server device to see if any e-mail addressed to the user has arrived at the server. The e-mail, if found to have arrived, is downloaded from the server device. In this manner, the owner of the second terminal device is able to know whether there is any greeting message addressed to him or her at the server.
When launching an advertising campaign using e-mail, a sponsor designates e-mail addresses of receiving parties before uploading advertisement data from the first terminal device to the server device. The second terminal device, in response to the user's operation, accesses the server device to see whether any advertisement data addressed to the user have arrived at the server. The advertisement data, if found, are downloaded from the server device. In that fashion, the owner of the second terminal device is able to know whether there are any advertisement data addressed to him or her at the server.
One disadvantage of the conventional data transmission-reception system outlined above is that the user is unable to know whether there is any greeting message or advertisement data addressed to him or her unless and until the user accesses the server device from his or her terminal device to verify whether there is any e-mail addressed to him or her at the server. Another disadvantage is that the transmitting party has no way of making sure that the greeting message or advertisement data arrive at the intended destination at a desired date and time.
In the meantime, mobile communication terminal devices such as mobile phones are usually carried by users in their bag or pocket, i.e., in a location close enough for a ring tone of the terminal to be heard by its user. That means greeting messages or advertisement data could be arranged to reach the intended users immediately.

Data transmission-reception system and data transmission-reception method


The disclosed technology relates to a semiconductor device comprising a diode junction between two semiconductor regions of different doping types. In one aspect, the diode comprises a junction formed between an upper portion of an active area and a remainder of the active area, where the active area is defined in a substrate between two field dielectric regions. The upper portion is a portion of the active area that has a width smaller than a width of the active area itself. In another aspect, the semiconductor device is an electrostatic discharge protection device (ESD) comprising such a diode. In addition, the active area has a doping profile that exhibits a maximum value at the surface of the active area, and changes to a minimum value at a first depth, where the first depth can be greater in value than half of a depth of the upper portion. In another aspect, a method of fabrication the device does not require a separate ESD implant for lowering the holding voltage and can allow for a reduction in the number of processing steps as well as other devices comprising a diode junction.

1. Field of the Invention
The disclosed technology is relates generally to a semiconductor device including a diode, which can be integrated in integrated circuit packages provided with Electrostatic Discharge (ESD) protection on an interposer chip.
2. Description of the Related Technology
As a cost-reducing measure in IC-packaging, it is known to produce electrostatic discharge protection circuitry on the interposer chip instead of on the IC's themselves. This is described for example in document U.S. Pat. No. 5,644,167 and may be referred to as the introduction of an 'active interposer'. An advantage of this approach is that the processing cost of the IC package is reduced. As a larger area is available on the interposer, older CMOS technology manufacturing nodes can be applied on the interposer, leading to a further cost reduction, e.g. 65 nm node technology is used on the interposer compared to 32 nm node or less on the IC's.
However, the IC-packaging industry continues to look for improvements in terms of cost-effectiveness of the applied processes. ESD protection devices are major examples of semiconductor devices comprising a diode junction. For this type of device, as for others comprising a diode junction, an optimization is needed in terms of the process technology itself, such as the number of process steps and the number of lithography masks applied in the process, in order to further obtain a cost reduction in the production of such devices, for example on an interposer chip.

Semiconductor device comprising a diode and a method for producing such a device


An airborne delivery system employs unmanned aerial vehicles (UAVs) released from an airborne platform, such as a Joint Precision Airdrop System (JPAD), to more accurately deliver supplies. The airborne delivery system is configured to be mounted on a JPAD, or similar airborne platform. As with a conventional JPAD, the JPAD is then released from an airborne vehicle. After a certain amount of flight time, one or more UAVs are released mid-flight from the airborne delivery system.

Aerial supply has long been used to deliver supplies to areas inaccessible by other land or naval vehicles. In particular, aerial supply has been a vital component of many military and humanitarian operations. Use in the commercial sector is also bound to expand as businesses contemplate aerial delivery of goods and services.
In military applications, aerial supply allows military personnel to operate cut off from a logistics base in hostile or inaccessible terrain. Autonomous aerial resupply systems can expedite sustainment operations and minimize soldiers' exposure to risk.
The Joint Precision Airdrop System (JPADS) is an autonomous airborne payload delivery system currently used by the United States Army that consists of a steerable canopy, a guidance unit and a payload. Though reliable, the JPADS is only accurate in delivering supplies to within a large radius of a specified target.
A need exists for an autonomous aerial delivery system which is more accurate than conventional aerial supply systems.

The United States of America as Represented by the Secretary of the Army


A conveyance pump having a substantially constant output pressure. The pump includes a chamber having a circular periphery. A vane is mounted within the pump chamber for oscillation through an arc and a valve chamber includes opening to each boundary of this arc, and with input and output conduits. Within the valve chamber is a valve which may move between two positions, allowing communication between alternate pairs of openings and conduits. An hydraulic motor is connected to the vane to cause its oscillation between the limit positions, and a motor rotates the valve between its positions. In operation the vane will rotate, drawing material from the input opening into the pump chamber behind the advancing vane, and pushing, and thus pressurizing, the material out of the pump chamber in front of the advancing vane and out of the output opening. Reversing the vane continues this process. If a product flow stoppage occurs downstream of the pump the output pressure on the vane will exceed the pressure generated by the hydraulic motor, thus causing the vane to automatically stop oscillation. When the downstream stoppage has been removed, the output pressure will begin to lower, and the vane will again automatically resume oscillation.

1. Field of the Invention
The present invention relates in general to pumps for material conveyance. In particular, the present invention relates to an improved conveyance pump providing a substantially constant output pressure.
2. Description of the Related Art
For the conveyance of flowable materials, such as granular material, liquid material, and liquid material containing solid elements, and gasses, it is know to provide various pump arrangements. One typical example is the use of a rotating auger within an exterior sleeve. A feed hopper or input pipe leads to a first end of the auger sleeve, and the rotating helical lands of the auger move the material to the second end of the sleeve to an exit opening. The constantly rotating auger may thus be employed to maintain a pressure upon the output flow, assuming there is some restriction upon the output flow downstream of the auger exit.
Such pressurization is employed in many fields of endeavor, including the production of food for human consumption. For example, solid food bits, such as cut carrots or other material, may be conveyed with a certain amount of water and steam at high pressure to effect sterilization of the food items. It is important to maintain the pressure on the product to ensure penetration of the steam and full sterilization.
However, it is often the case that such an auger pump will be employed to provide a pressurized flow to a downstream operation which is not entirely continuous. For example, there may be occasional product flow stoppages due to an intermittent downstream process, jamming of the product within the output conduit, etc. While the downstream flow of the product may be interrupted, the auger pump continues to operate, forcing additional product into the output conduit, thus raising the pressure within the output conduit.
For those situations or processes where a constant output pressure, or at least a maximum desired output pressure, are desired, it would be necessary to place a pressure sensor within the output conduit and have this pressure sensor operatively connected to the control system of the auger. Such an arrangement is expensive, not particularly reliable, and provides pressure fluctuations within the output conduit.


In a process for the display of three-dimensional video images, in which at least two associated stereoscopic left-hand and right-hand partial images are electro-optically sensed at a given read-in frequency and the partial images are then sequentially reproduced on a display, the sensing of the two partial images takes place with a constant delay time with respect to each other, so that a delay which remains constant is ensured between the image formation in the camera and the reproduction of the partial image.

1. Field of the Invention
The present invention relates to a process, and also an apparatus, for displaying three-dimensional video images.
2. Discussion of Prior Art
So-called sequential 3D-TV systems are known, for example from the International Patent Application WO 93/08665 of Applicant's assignee, Carl-Zeiss-Stiftung, which is incorporated herein by reference, and from U.S. Pat. No. 4,562,463. In these patent documents, the three-dimensional image to be displayed is simultaneously sensed by two respective video cameras from two perspectives, and the stereoscopic partial images obtained are stored intermediately in suitable memory units. After the intermediate storage has been completed, the stereoscopic partial images are displayed alternatingly on a suitable display. The viewer, in order to perceive a spatial impression, wears so-called shutter spectacles, which at any given time release the view of one of the two partial images and which are synchronized with the switching frequency of the stereoscopic partial images on the display. It is known, as an alternative to this, to place a screen shutter element having a large area directly in front of the display, while the viewer wears corresponding polarizing spectacles.
In the cited International Patent Application WO 93/08665, partial memories are provided for flicker-free display of the three-dimensional images. These partial memories can be read out as a partial image is read in. The synchronization cost for signal processing is thereby reduced in comparison with U.S. Pat. No. 4,562,463. The process disclosed in International Patent Application WO 93/08665 is fully satisfactory for three-dimensional display of images that contain little motion, such as, for example, in minimally invasive surgery. However, known disadvantages can result in the case of rapidly moving images or moving cameras. Thus, because of the selected reproduction sequence of the stereoscopic partial images, partial images that were taken earlier are displayed on the display at a later reproduction instant. A known "jittering" of the three-dimensionally perceived image can result for the observer.

Process and apparatus for displaying three-dimensional video images


A system for controlling a transmission of a vehicle includes an engine control module that generates a command, while the vehicle is rolling in either a forward or reverse direction, to change a transmission of the vehicle from a reverse drive gear to a forward drive gear. The transmission includes a first clutch, a second clutch, a third clutch, and a fourth clutch. A transmission control module, in response to the command, maintains a first clutch in an engaged state, releases a second clutch and a fourth clutch, with the first clutch in the engaged state and the second clutch and the fourth clutch released, applies a third clutch with a synchronizer to engage the third clutch, and, after the third clutch is engaged, reapplies the fourth clutch to engage the fourth clutch.

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
A vehicle having an automatic or manual transmission may execute a garage shift. A garage shift includes a shift from park or neutral to forward or reverse. Under certain conditions, a garage shift may cause torque driveline disturbance.

Rolling and regular garage shifts in new rear wheel drive powerflows


The method 600 renders a self-overlapping polygon, wherein the polygon is a set of one or more closed curves each comprising line segments. The method performs, for a currently scanned pixel that overlaps both sides of a line segment of the self-overlapping polygon within a currently scanned scanline, the following steps. The method 600 decomposes 618 that portion of the polygon that lies within the currently scanned pixel into a number of closed loops comprising at least those portions of those line segments that lie within the currently scanned pixel, the closed loops are such that when they are combined the combination is substantially equivalent to that portion of the polygon that lies within the currently scanned pixel. The method 600 combines 623 incrementally the closed loops and determines one or more winding count values representative of respective weighted averages of winding counts of the combined closed loops. The method 600 then determines 622 a real opacity of the currently scanned pixel according to a predetermined fill rule utilizing an intrinsic opacity of said polygon and the one or more winding count values. The method 600 finally renders 624 the currently scanned pixel with the determined real opacity.

Scan conversion is a computer graphics process in which geometrical objects such as lines and polygons are converted into pixel data for displaying on a raster device. Scan conversion can either operate in a simple "aliased" or more sophisticated "anti-aliased" mode.
In aliased mode, each display pixel is assigned one of two values according to whether it is classified as being inside or outside of the object being scan converted. It is well known that in this mode, "aliasing" effects can occur along the edges of objects, which give rise to "jagged" appearance. Techniques aimed at reducing or eliminating this effect are referred to as anti-aliasing techniques. They work by blending the object's colour with the colour of the background along pixels lying on the edges of the object to create smooth transitions between pixels lying outside and inside the object. Scan conversion methods that incorporate these techniques are said to be operating in "anti-aliased" mode.
Existing anti-aliasing techniques generally fall into one of three types: filtering, multi-point sampling, and area sampling. Filtering techniques work by applying a low-pass filter to the pixel values produced by an aliased scan conversion of an object to remove the high spatial frequency components that give rise to the "jagged" appearance of edges. Since this requires a matrix multiplication at each pixel, filtering techniques are computationally expensive. Filtering also has the effect of blurring horizontal and vertical edges that fall exactly on pixel boundaries that would otherwise appear sharp when scan converted using other anti-aliasing techniques, which may be undesirable.
In multi-point sampling, each pixel is sampled at several different locations at which tests are made to identify which of these points lie inside the object being scan converted. The pixel is then assigned a value based on the number of such points. Variations of this technique also exist where sampling is performed along several continuous horizontal or vertical line segments within each pixel instead of at discrete locations. The pixel is assigned a value based on the total length of these line segments that lie inside the object being scan converted.
A disadvantage of multi-point sampling is that it does not handle thin edges well. Consider the examples shown in FIG. 1 and FIG. 2. The object being scan converted in both cases is a thin, near-horizontal line 10. In FIG. 1, sampling is performed at nine equally spaced points within each pixel. The white and black circles represent sampling points that lie outside and inside of the line 10 respectively. It can be seen that since all sampling points in pixels 3 and 6 lie outside of the line 10, these pixels will be treated as if they lie completely outside of the line 10, and hence the scan converted line 10 will appear broken.
A similar problem exists in FIG. 2, where sampling is performed over three horizontal line segments per pixel denoted by the dotted lines. The portion of these dotted line segments that lie inside the line 10 being scan converted is highlighted in solid black lines in FIG. 2. Again, the scan converted line 10 will appear broken at pixels 3 and 6.
The third type of anti-aliasing technique is area sampling, where each pixel is assigned a value according to the percentage area of the pixel that falls inside the object being drawn. Its advantage over multi-point sampling is that it does not suffer from the problem illustrated in FIG. 1 and FIG. 2 that arise when scan converting thin lines. The overriding disadvantage of area sampling is that whilst straight lines and simple polygons can easily be handled, complex, self-overlapping (or self-intersecting) polygons pose a problem because of the computational intensive nature of processing such polygons. It has been suggested to convert these complex and/or self-overlapping polygon into a plurality of simple mutually exclusive non-intersecting polygons prior to area sampling. However, the procedure involved is potentially time consuming since it requires the calculations of the intersections between every pair of edges of the polygon. This has the disadvantage of adding an extra burden to the already costly area sampling process.
When scan converting a complex or self-overlapping polygon, it is necessary to select a fill rule. A polygon is a set of one or more closed curves each comprising of a number of vertices connected by straight line segments. Each closed curve is also known as a contour and has an associated direction. A polygon is said to be simple if it comprises of only a single contour, otherwise it is said to be complex. A polygon is also said to be self-overlapping or self-intersecting if one or more of its contours crosses over itself or over other contours. Examples of the possible different types of polygons are shown in FIGS. 3(A), 3(B), 3(C), and 3(D).
Odd-even and non-zero winding are two fill rules well known to those skilled in the art based on the winding count of a point. The winding count of a point is defined as follows: draw an arbitrary path from any point outside of the polygon to this point. Count the number of times a contour crosses the path from one side of the path to the other, and the number of times a contour crosses the path in the opposite direction. The winding count of the point is the obtained by subtracting the second number from the first.
When using the odd-even fill rule, points that have odd winding counts are considered to be inside the polygon and are hence filled with the polygon's colour and opacity, whilst points with even winding counts are considered to be outside the polygon and are not filled.
When using the non-zero winding fill rule, points that have zero winding counts are considered to be outside the polygon, whilst points with non-zero winding counts are considered to be inside the polygon.
The publication U.S. Pat. No. 6,084,596 discloses a third fill rule, called "winding-counting". Unlike the non-zero winding fill rules, in which all pixels classified as being inside the polygon are rendered with uniform colour and opacity, winding-counting assigns an opacity value to a pixel according to its absolute winding count. More specifically, pixels with a zero winding count are classified as being outside the polygon and are not filled, and pixels with a +1 or −1 winding count are filled in the same manner as in the odd-even and non-zero winding rule.
The pixels with a winding count of n, where |n|>1, are rendered by performing |n| repeated rendering operations, each time using a pixel with the colour and opacity of the polygon. For fully opaque polygons, this produces identical results to the non-zero winding fill rule. For partially transparent, complex and/or self-overlapping polygons however, winding-counting gives the effect of the polygons being made up of several overlapping layers.
A comparison between the three fill rules is shown in FIGS. 4(a), 4(b), and FIG. 4(c). In FIG. 4(a), a partially transparent polygon is rendered using the odd-even fill rule. In (b) and (c), the same polygon is rendered using the non-zero winding and the winding-counting fill rules respectively. The centre region of FIG. 4(c) has a winding count of 2 and hence has been drawn with a higher opacity than the surrounding region.
However, the scan conversion method of the publication U.S. Pat. No. 6,084,596 suffers from "aliasing" effects.


A method and system suitable for grouping a plurality of multifunction devices (MFDs), the system including a storage station for storing information gathered from the plurality of MFDs by selectively polling the plurality of MFDs; wherein the information is selectively processed based on static performance data and dynamic performance data relating to the plurality of MFDs.

1. Field of the Related Art
The present disclosure relates to printing systems, and more particularly, to a method and system for grouping a plurality of MFDs based on performance criteria.
2. Background of the Related Art
In general, a multifunction device (MFD) operates as a plurality of different imaging devices, including, but not limited to, a printer, copier, fax machine, and/or scanner. In recent years the basic office copier has evolved into what can be referred to as a MFD. With digital technology, a machine with the basic outward appearance of a traditional copier can perform at least the additional functions of printing documents submitted in digital form over a network, sending and receiving messages via facsimile, recording hard-copy original images in digital form and sending the resulting data over a network, such as in electronic mail and/or recording hard-copy original images in digital form on a compact disc or equivalent medium.
In the area of digital printing and copying, there has been a growth in demand for MFDs. Such MFD devices may assume the form of an arrangement in which a single print engine (e.g., xerographic or thermal ink jet print engine) is coupled with a plurality of different image input devices (or "services"), with such devices being adapted to produce image related information for use by the printer or transmitted over a network. The image related information, in one example, could have its origin in video facsimile signals, microfilm, data processing information, light scanning platens for full size documents, aperture cards, and microfiche. MFDs provide a broader range of functionality than traditional single-function devices, such as dedicated printers, copiers, and scanners. As a result, because of their network transmission capabilities combined with their functionality, it would be useful to poll MFDs into one or more groups based on performance criteria.
Polling is an alternative method to interrupts by which the processor (CPU) may process device requests. A CPU may, for example, poll a network device to determine if there are any packets to be processed. Network appliances, including software-based switches, firewalls, proxy servers, and even first-tier web servers are increasingly making use of polled input/output (I/O) to actively coalesce interrupts, and increase overall system performance by reducing the latencies involved with context switching during interrupt handling.
However, polling can be an inefficient mechanism due to the unnecessary and continuous checking of device status when the rate of device activities such as network traffic is not relatively high. Additionally, polling can be detrimental to power consumption since it occurs constantly, whether there is work to do or not, thus preventing the system from ever entering a "sleep" state where appropriate instructions can be issued to conserve power spent by the CPU. Thus, polling can adversely affect power conservation and the average time to gather information from a plurality of MFDs.
Currently network management tools poll MFDs to get current status information. It is desirable to have the most current status information. However, this comes at an expense of a high amount of network traffic being generated. It is also desirable to obtain a current status on a large number of network devices. However, communication with some devices takes a larger amount of time and some devices fail to communicate at all. Proposed alternatives, such as registering for events on devices (e.g., SNMP traps), is not standardized, and generates excessive traffic on unwanted events.
Thus, in conventional systems, there is no method for grouping devices based on performance criteria. Instead, conventional polling systems have focused on polling network devices for status information in large groups by using a single maximum Timeout (TO) and Retry (RT) value for network communication. The request for status information typically requires many Object Identifier (OID) objects, which often results in multiple Communication Requests (CR) with the Network Device (ND). With a sufficiently large number of network devices, and with different types of devices, and different states (able to communicate or not) and varying network environments, the resulting communication varies enough so that the maximum timeout and retry values will always be exceeded for each communication request to all devices. As a result, this is an inefficient and time-consuming process.
Consequently, current systems lack the capability to effectively group devices based on performance criteria. The present disclosure is intended to overcome the drawbacks of other methods by providing for grouping a plurality of MFDs based on one or more specific performance criteria.

Method and system for polling multifunction devices based on performance criteria


A method for configuring carrier resources and reporting carrier information of a multi-carrier cell includes a radio network controller (RNC) that configures each carrier with a carrier processing module (CPM) ID in Node B, and Node B allocates a CPM for each carrier based on CPM ID received. The RNC configures a CPM ID for each newly added secondary carrier. Node B allocates a CPM for the secondary carrier based on the CPM ID received. The audit response message and the resource state indication message, which Node B sends to the RNC contains one or more resource state information (RSI) elements of the CPM, and each RSI element contains the ID of the CPM corresponding to it. The configuration of the carrier resources and the report of the carrier RSI during the cell setup, cell reconfiguration, resource indication and audit response of the multi-carrier cell system are realized.

In a node (Node B) of the TD-SCDMA system, a carrier corresponds to a specific carrier processing resource, and they can be combined as a carrier processing module. In a conventional single-carrier cell system, one carrier in a sector is defined as a cell, thus a cell in the Node B only corresponds to one specific carrier processing resource. The logic processing resource of a cell in the Node B is defined as a local cell, thus in a single-carrier cell, a local cell refers to a carrier processing module, and then a local cell ID is an ID of the carrier processing module.
In the conventional single-carrier cell system, the Node B can include a plurality of local cells, and when a radio network controller (RNC) configures the resources of the cell using a cell setup request message or a cell reconfiguration request message, the cell can be configured with a carrier processing module in the Node B as long as the radio network controller uniquely configures each local cell with a local cell ID. Similarly, when the Node B, which supports a plurality of cells, sends a resource state indication message and an audit response message, it can indicate the resource state of each carrier as long as it reports the state information of each carrier processing module respectively with its local cell ID.
In order to expand cellular capacity so as to meet the demand of macro-cellular capacity in the market, currently, a multi-carrier cell system is adopted to expand system capacity, that is, a cell has multiple carriers, wherein there is only one primary carrier, and the others are secondary carriers. In the current standards or solutions, for a multi-carrier cell system, it is only defined that the processing resource of a multi-carrier cell in Node B is a local cell (including a plurality of carrier processing modules), and a local cell ID is configured. As for each carrier in the multi-carrier cell, corresponding carrier processing module and ID are not defined. Therefore, in the multi-carrier cell system, when a multi-carrier cell is configured in the Node B, uniquely configuring the multi-carrier cell with a local cell ID cannot perform the function of configuring each carrier of the cell with a carrier processing module. And similarly, when the Node B, which supports the multi-carrier cell, sends a resource state indication message and an audit response message to the radio network controller, the resource state information of different carrier processing modules cannot be distinguished even if Node B reports the resource state information of the local cell according to the local cell ID. That is, according to the current method, it cannot realize the configuration of the carrier resources or the report of the carrier resource state information during the cell setup, cell reconfiguration, resource indication and audit response procedure of the multi-carrier cell system.

Method for reporting the frequency resource arrangement and frequency information of the multi-frequency cell


A network interface controller controls communication between a host system and a network transceiver coupled to a network comprises a memory outside of the host address space in which receive and transmit buffers are managed, host interface logic emulating memory mapped registers in the host address space, for transferring data between the host address space and the buffer memory, and network interface logic coupled with the network transceiver, for transferring data between the buffers in the buffer memory and the network transceiver. The buffer memory includes a transmit descriptor ring buffer, transmit data buffer, transfer descriptor buffer, and receive ring buffer all managed by operations transparent to the host.

1. Field of the Invention
The present invention relates to architectures for network interface controllers, and particularly to architectures for managing the transmission and reception of data between a host system and a network.
2. Description of Related Art
Network interface controllers are involved in the management of the transfer of data between a host computer system and a communications network which is typically asynchronous and independent of the host system. Thus, data may be received across the network at times when the host is unable to process the received information directly. Similarly, when the host desires to transmit information on the network, the flow of data from the host system to the network must be managed. Prior art network interface controllers manage this asynchronous interface with the use of buffers in host managed memory. Received data is typically supplied from a media access controller (MAC) through a FIFO buffer on a network interface controller card into a host managed receive area buffer, either in the host address space or in adapter memory that is managed by the host, using DMA techniques that relieve the host processor from many of the sequential addressing tasks involved in uploading the data from the network into the receive area buffers. When the host desires to utilize or review the information received, h reads from the host receive area buffers, and transfers information out of the receive area buffers to permanent locations for use by the host system.
Similarly, when the host system transmits data, in prior art systems, it typically writes the data into a host managed transmit buffer area, and the network interface controller transfers that data from the host managed space using DMA techniques through a FIFO buffer in the interface controller and on to the network through a MAC.
Various devices have been developed which tend to optimize the DMA techniques used for managing the flow of data between the host system address space and the network interface controller. Representative prior art systems include the National Semiconductor DP83932B, a Systems-Oriented Network Interface Controller (SONIC) and the Intel 82586 Local Area Network Coprocessor. However, these prior art systems rely on host system address space for the receive and transmit buffers, and utilize a significant portion of the host processor overhead and host bus bandwidth.
It is desirable to provide a network interface controller which minimizes the use of host processor overhead and host system bus bandwidth, and simplifies the software executed by the host required for managing the interface.

Network interface with host independent buffer management


A high-temperature superconducting system comprising M-Tl-Ba-Cu-O wherein: M is selected from the group consisting of Ti, Zr, and Hf. In one embodiment, the M-Tl-Ba-Cu-O system forms a high Tc phase of approximately 90 K wherein: M is selected from the group consisting of Zr and Hf. In another embodiment, a nominal ZrTl.sub.2 Ba.sub.2 Cu.sub.3 O.sub.10 sample forms a high Tc phase of above 100 K.

The present invention relates to high temperature superconductor systems and processes for making same.
A variety of superconducting systems have been created. In particular, several systems are based on thallium (Tl), including Tl-Ba-Cu-O, Tl-Sr-Ba-Cu-O, and Tl-Ca-Ba-Cu-O. For example, U.S. patent application Ser. No. 144,114, filed on Jan. 15, 1988 in the names of Z. Z. Sheng and A. M. Hermann, discloses Tl-Ba-Cu-O superconductor systems and processes for making them. This 90 K system is the first non-rare earth superconducting system above liquid nitrogen temperature.
In addition, U.S. patent application Ser. No. 155,247, filed on Feb. 12, 1988 in the names of Sheng and Hermann, discloses Tl-Ca-Ba-Cu-O and Tl-Sr-Ba-Cu-O superconductor systems and processes of making same. The addition of Ca into the Tl-Ba-Cu-O system resulted in superconductivity in excess of 120 K, the highest reproducible Tc to date.
Although superconducting systems disclosed in the above-identified patent applications have produced high-temperature superconductors and processes for making same, new systems are desirable for several reasons. A new superconducting system could:
1) Facilitate the discovery of the correct theory on oxide superconductivity; PA1 2) Extend the framework of the search for higher-temperature superconductors; and
3) Provide low cost processing and manufacturability.

M-Tl-Ba-Cu-O high temperature superconductors wherein M is selected from the group consisting of Ti, Zr and Hf


In a cathode with an electron-emissive material layer formed on a base containing a reducing element, a relationship of 0.24xe2x89xa6B/Axe2x89xa60.93 is satisfied, where A denotes a surface for layer formation of the base and B represents an area where the base and the electron-emissive material layer are in contact with each other. In addition, a relationship of 0.4xe2x89xa6D/Cxe2x89xa60.7 is satisfied, where C and D denote thicknesses of the base and the electron-emissive material layer, respectively. Thus, a cathode structure is provided in which sufficient electron emission can be obtained, a decrease in electron emission with the passage of time is not much during the operation, and variations in cut-off voltage are small.

The present invention relates to a cathode structure provided in an electron gun of a cathode-ray tube used in a television, a computer monitor, or the like.
As shown in FIG. 2, a cathode-ray tube 1 includes a faceplate portion 3 having a phosphor screen 2 on its inner face, a funnel portion 4 bonded at the rear of the faceplate portion 3, and an electron gun 6 for emitting electron beams 5 placed inside a neck portion 7 of the funnel portion 4.
An indirectly heated cathode structure 108 is provided at an end of an electron gun. As shown in FIG. 8, in the cathode structure 108, one end of a cylindrical sleeve 109 is covered with a cap-like base 110, and an electron-emissive material layer 111 is formed on the surface of the base 110. The electron-emissive material layer 111 is formed of an electron emitter for emitting thermoelectrons. A coiled heater 115 is provided inside the cylindrical sleeve 109 and includes an alumina electrical insulating layer 113 on a metal-wire coil 112 and a dark layer 114 as an upper layer thereof. Generally, the electron-emissive material layer 111 is formed on the whole base surface 120 facing an electron emitting side.
A cathode structure also has been proposed in which an electron-emissive material layer containing alkaline-earth metal or the like is allowed to adhere only to the center portion of a base surface by spraying or the like (JP 5(1993)-334954 A). In this cathode structure, the electron-emissive material layer located at the periphery, which does not participate much in electron emission, is omitted, so that the heat from a heater can be absorbed efficiently by the electron-emissive material layer.
In a step of activating a cathode, a reducing element (for instance, magnesium, silicon, or the like) contained in the base diffuses thermally to the interface between the electron-emissive material and the base, reduces the electron-emissive material (whose main component is an alkaline earth oxide such as barium oxide), and thus produces free barium. This enables electron emission. This reductive reaction is expressed by the following equations:
2 BaO+1/2 Si=Ba+(1/2)Ba2SiO4
and
BaO+Mg=Ba+MgO.
In the conventional cathode structure described above, however, there have been problems in that sufficient electron emission cannot be obtained at an initial activating step and a decrease in electron emission during operation with the passage of time is worsened. In addition, there also has been a problem in that excessive shrinkage of the electron-emissive material layer is caused during operation due to the progress of the reductive reaction and this increases variations in cut-off voltage (electron beam erase voltage) inversely proportional to the distance between a counter electrode and the electron-emissive material.
According to the investigation by the present inventor, from an entirely different viewpoint from the improvement in thermal efficiency as described in JP 5(1993)-334954 A, it was found that the above-mentioned reductive reaction progressed suitably when the amount of the electron-emissive material and the size of the base were adjusted to satisfy predetermined relationships and thus the above-mentioned problems were solved.
The present invention is intended to provide a cathode structure with characteristics improved by optimization of the relationship between the sizes of a base and an electron-emissive material layer.
An embodiment of a cathode structure according to the present invention is a cathode structure for a cathode-ray tube having an electron-emissive material layer formed on a base containing a reducing element. The cathode structure is characterized by satisfying the relationship of 0.24xe2x89xa6B/A less than 0.93, wherein A denotes an area of a surface for layer formation of the base and B represents an area where the base and the electron-emissive material layer are in contact with each other, and having a zero-electric-field saturation current density of at least 6.4 A/cm2 after an implementation of an accelerated life test for 5000 hours under conditions of a vacuum of 10xe2x88x927 mmHg, a cathode temperature of 820xc2x0 C., and a current led out from a cathode of DC 300 xcexcA.
In this context, the surface for layer formation of the base refers to the surface of the base facing the electron emission side and does not include side faces of the base. When the surface for layer formation has a circular shape, the area of this surface can be determined by a formula of Π(d/2)2 based on its diameter d.
According to this cathode structure, a practically sufficient cathode current can be obtained even after long-term use, and in addition, the variations in initial cathode current among cathodes can be reduced considerably. When the size of the base is determined, the size of the electron-emissive material layer required for a practical operation can be determined easily.
Furthermore, another embodiment of a cathode structure of the present invention is a cathode with an electron-emissive material layer formed on a base containing a reducing element. The cathode is characterized by satisfying the relationships of 0.24xe2x89xa6B/Axe2x89xa60.93 and 0.4xe2x89xa6D/Cxe2x89xa60.7, wherein A denotes an area of a surface for layer formation of the base, B an area where the base and the electron-emissive material layer are in contact with each other, C the thickness of the base, and D the thickness of the electron-emissive material layer. This cathode structure has a long life and allows variations in cut-off voltage to be reduced.

Matsushita Electric Industrial Co., Ltd.


Resin having a susceptibility to electrostatic charge which is opposite in polarity to the susceptibility to electrostatic charge of a filter sheet or member forming a filter element is impregnated into the filter member. For example, when the filter member is composed of polyester of 50-70 weight percentage and glass fiber of 5-25 weight percentage as well as pulp of 15-35 weight percentage, resin composed of phenol resin of 5-20 weight percentage and melamine resin of 80-95 weight percentage is impregnated into the filter member so that the susceptibility to electrostatic charge of the filter member can be neutralized. Thus, static electricity generated by friction between the filter element and fuel flowing therethrough can be controlled.

1. Field of the Invention
The present invention relates to a filter element which is used in a fuel filter for a vehicle to prevent generation of static electricity.
2. Description of Related Art
Since static electricity is generated in a filter element when fuel is filtered by a filter element, various techniques for preventing the static electricity have been proposed.
For example, a filtering material for a fuel filter is disclosed in JP-A 50-38861. The filter sheet is composed of pulp mixed with acryl type fiber which is impregnated with composite resin to form a solid filter element.
Generally, when the fuel filter element formed of filter sheet is held in all insulating resin case, static electricity is generated when fuel is passing through the filter element. Therefore, the above publication proposes a filter member composed of pulp which is charged with minus electricity and acryl type fiber which is charged with plus electricity when fuel passes through the filtering material so that they neutralize the static electricities of minus and plus at the same time, thereby preventing generation of the static electricity even if the filter element is held in an insulating case.
The above conventional filter member is formed by the following steps. That is, fiber of cotton linter pulp mixed with acryl type fiber of 10 weight percentages is formed into a sheet having a specified thickness, permeability and porosity and, thereafter, the sheet is hardened by adding phenol resin. The acryl type fiber in this case is mixed as a composition to be charged with plus electricity for neutralizing the fiber of the cotton linter pulp which is charged with minus electricity when it filtrates fuel.
However, in the conventional filter element described above, it is difficult to provide a filter element which satisfies both the desired filter performance and the desired anti-static effect.


Maintenance unit for modular public telephone, the unit being made up based on a microprocessor, a block for communication with the modular telephone, a rotating switch to take measurements and a condenser charger for the modular public telephone, with a rapid condenser charger to feed the modular telephone that will load the logic and the activators, allowing the unit to communicate through any telephone situated on a line protected by a validation and identification unit, and carrying out the same through the selection of the identification number on turning switches. The unit also has circuit blocks to measure feed condenser voltage, line current, alternative voltage with respect to grounding and the state of the battery.

Various systems and units are currently known that cover the work of identifying breakdowns in equipment connected to them and which it is desired to control.
However, none of the systems and units known until now have maintenance functions and characteristics as well as those of identification, covering at the same time the communication requirements representing as a whole any object similar to the modular public telephone maintenance unit object of the present invention.
This unit, which is specifically applicable within the management system of the modular public telephone, arose from the need for the rapid charging of feed condensers for the modular public telephone itself, aside from the measurement of a series of parameters through the validation and identification unit (V.I.U.), in order to allow rapid identification of breakdowns and having to carry out the communications protocols with the validation and identification unit in order to initiate and conclude a telephone call.


An interconnect for testing semiconductor wafers, and a method and system for testing wafers using the interconnect are provided. The interconnect includes a substrate with contact members configured to establish temporary electrical communication with contact locations (e.g., bond pads, test pads) on the wafer. For flat contact locations (e.g., thin film bond pads), the contact members comprise raised members with penetrating projections. For bumped contact locations (e.g., solder bumps), the contact members comprise indentations with a conductive layer. The interconnect also includes a pressure sensing mechanism for monitoring and controlling contact forces between the interconnect and wafer. In an illustrative embodiment the pressure sensing mechanism comprises a piezoresistive or piezoelectric layer and resistance measuring device.

Semiconductor wafers must be tested during the manufacturing process to evaluate the electrical characteristics of the integrated circuits formed on the wafer. Standard tests for gross functionality are typically performed by probe testing the wafers using probe cards and wafer steppers. Other tests such as burn-in, and high speed testing are typically performed after the dice have been singulated and packaged. Among the tests performed are dynamic burn-in, input/output leakage, speed verification, opens, shorts, refresh and a range of algorithms to verify AC parameters.
In the past, burn-in and speed testing have been performed at the die level rather than at the wafer level. One reason that these test procedures are not performed at the wafer level is because the tests require interconnects with a large number of contact members and input/output paths to the wafer. For example, a wafer can include several hundred dice each having twenty or more bond pads. The total number of bond pads on the wafer can be in the thousands. For some tests procedures a contact member and input/output path must be provided to each bond pad. Even with wafer stepping techniques, conventionally formed interconnects, such as probe cards, usually do not include enough contact members (e.g., probes) to test dice having a large number of bond pads.
In addition to contact density limitations, force application and damage to the wafer must be minimized during the wafer testing procedure. In general, a large number of bond pads on the wafer will require that high contact forces be generated between the wafer and interconnect. The high contact forces can damage the wafer, particularly the bond pads that can have a thickness of only 1 .mu.m or less. Damage to thin film metal bond pads can also result from the necessity to penetrate the metal oxide layer on the bond pads to make a good electrical connection.
It would be advantageous for an interconnect to include contact members capable of testing a wafer with a large number of bond pads. This would permit both gross functionality as well as burn-in, dynamic burn-in, and high speed tests to be performed at the wafer level. It would also be advantageous to test all of the dice on the wafer simultaneously so that wafer stepping techniques do not need to be employed. This would decrease the time for testing and improve wafer throughput. Still further, it would be advantageous to be able to control the amount of contact force exerted on the wafer by an interconnect in order to minimize damage to the wafer and bond pads. In view of the foregoing, the present invention is directed to an improved interconnect and method for testing semiconductor wafers.

Interconnect with pressure sensing mechanism for testing semiconductor wafers


A method of connecting a terminal fitting and an electric wire, includes the steps of: providing a terminal fitting; providing an electric wire in which a core wire is covered with an insulating sheath; providing a conductive connecting member formed with an insertion hole; inserting the electric wire into the insertion hole of the connecting member; compressing the connecting member radially inwardly so as to caulk an inserted portion of the electric wire uniformly over a whole periphery thereof; and welding the connecting member and the terminal fitting by applying ultrasonic wave.

This invention relates to a wire-terminal connecting method in which a wire for feeding a power source current or a signal current to an on-vehicle part is connected to a terminal by ultrasonic welding.
One known related wire-terminal connecting method is disclosed in JP-A-54-43588.
As shown in FIG. 7, this related wire-terminal connecting method is directed to the method of an invention in which a distal end portion 51a of a wire 51 is beforehand fixed into a semi-circular shape, and thereafter this fixed distal end portion 51a, together with a flat-type aluminum wire 55 (serving as a connecting wire), is held between a tip 59 and an anvil 60 of an ultrasonic welding machine 56, and an interface 65 (FIG. 8) of joining between the wire 51 and the flat-type aluminum wire 55 is heated and melted by vibrational energy, thereby effecting the welding.
The distal end portion 51a of the wire 51 is fixed into the predetermined shape by the use of a resistance welding machine (not shown) including an upper electrode with a semi-circular fitting groove and a lower electrode disposed in opposed relation to this upper electrode.
In FIG. 7, reference numeral 55 denotes the flat-type aluminum wire to be connected to the wire 51, reference numeral 56 denotes the ultrasonic welding machine, reference numeral 57 denotes an ultrasonic wave-generating source, reference numeral 58 denotes a horn for transmitting ultrasonic waves from the ultrasonic wave-generating source 57, and reference numeral 59 denotes the tip provided at a distal end of the horn 58.
The tip 59 has a semicircular groove 59a extending in a direction perpendicular to a direction a of vibration of ultrasonic waves. Reference numeral 60 denotes the anvil provided in opposed relation to the tip 59. An upper surface of the anvil 60 is formed into a flat surface.
The flat-type aluminum wire 55 and the wire 51 are placed on the anvil 60 of the ultrasonic welding machine 56 in such a manner that the wire 51 is superposed on the aluminum wire 55, and then the tip 59 is moved toward the anvil 60, so that the distal end portion 51a of the wire 51 fits into the groove 59a in the tip 59. As a result, the wire 51 is pressed from the upper side, and is held in place since the depth of the groove 59a in the tip 59 is slightly smaller than the height of the semi-circular distal end portion 51a of the wire 51.
Then, when ultrasonic waves are applied from the ultrasonic wave-generating source 57 via the horn 58 and the tip 59, the vibrational energy propagates to the interface 65 of joining between the wire 51 and the flat-type aluminum wire 55 while the wire 51 is kept in a restrained condition since the direction of extending of the groove 59a in the tip 59 is substantially perpendicular to the vibrating direction a. As a result, this joining interface portion 65 is heated and melted by frictional heat, thereby connecting the wire 51 and the flat-type aluminum wire 55 together.
However, the above related wire-terminal connecting method has the following problems to be solved.
Firstly, when the wire (workpiece) 51 is pressed by the tip 59 as shown in FIG. 8, stresses concentration a boundary portion 51b between each edge portion 59b of the tip 59 and the wire 51, and besides when the tip 59 is ultrasonically vibrated, the edge portion 59b of the tip 59 and the wire 51 rub against each other at each boundary portion 51b, thus inviting a problem that wire elements 51c undergo damage such as cutting.
Secondly, the larger the pressing force, applied by the tip 59, is, and the higher the ultrasonic vibration frequency is, the shorter the time of heating and melting of the joining interface portion 65 is, and on the other hand there is encountered a problem that the plurality of wire elements 51c are more liable to become loose, and also are more liable to undergo damage such as cutting. Therefore, it has been desired to provide an ultrasonic connecting method in which even when the ultrasonic vibration frequency is high, the wire elements 51c will not undergo damage such as cutting, and the operation for connecting the wire 51 and the flat-type aluminum wire 55 together can be effected easily.
And besides, when a conductor portion of a thick wire (connected to a battery so as to supply a source current) or a conductor portion of a thin wire (connected to an on-vehicle part so as to feed a signal current) is kept in an exposed condition, waterdrops, dust and so on deposit on the conductor portion (conducting portion), which invites a problem that the performance of contact between the conductor portion and the terminal is lowered.

Method of connecting wire and terminal fitting


A method of controlling shrinkage in aligned green tape stacks during firing comprises providing a topmost layer of a ceramic material having a sintering temperature higher than that of the ceramic used to make the green tapes and firing above the sintering temperature of the green tape ceramic but below the sintering temperature of the topmost layer ceramic. The method of the invention provides improved shrinkage control for green tape stacks on a support substrate.

Ceramic multilayer printed circuit boards have been used for many years for circuits for electrical apparatus, such as mainframe computers. Such printed circuit boards are made by casting glass and/or ceramic powders together with an organic binder into tapes, called green tapes. A conductive metal circuit can be patterned onto the green tape by screen printing for example. Vias are formed in each green tape that are then filled with conductive materials, called via inks, to connect the circuits of the various layers electrically. The green tape layers are then stacked and aligned, pressed together under pressure, and fired to burn off organic residues and sinter the glass, thereby forming a fired ceramic multilayer circuit board.
Originally ceramics such as alumina were used to form the green tape layers, but these ceramics require high firing temperatures, up to 1500.degree. C. This necessitates the use of high melting, refractory conductor metals, such as tungsten or molybdenum, to form the circuit patterns because they can withstand these high firing temperatures. More recently, devitrifying glasses have been used to form the green tapes that can be fired at temperatures of 1000.degree. C. or less. Multilayer circuit boards made of these glasses can be used with lower melting, more conductive metals, such as silver, gold and copper. However, these glass-based printed circuit boards have the disadvantage that they are not as strong as alumina circuit boards.
Thus even more recently, low firing temperature glasses have been deposited on support substrates made of metal or ceramic to which the glasses will adhere. The support substrate can be made of thermally conductive materials such as nickel, Kovar, Invar, or composites of Kovar or Invar coated with copper for increased conductivity, as well as thermally conductive ceramics such as aluminum nitride, silicon carbide, diamond and the like. These substrates impart added strength to the composite. A bonding glass, such as described in U.S. Pat. No. 5,277,724 to Prabhu, can be used to improve adhesion of the green tape layers to the support substrate. In addition, if chosen correctly, the bonding glass can reduce shrinkage of the green tape with respect to the support substrate in at least the two lateral, x and y, dimensions, and thus all of the shrinkage of the green tape layers during firing occurs in the thickness, or z dimension, only. This in turn reduces problems of alignment of the circuit patterns in the glass layers and alignment of the circuit patterns to the via holes in the support substrate.
Active devices can also be mounted onto the planar surfaces of the fired glass. When it is desired to place active devices into cavities in the fired glass circuit boards, they have been made heretofore by hot pressing a cavity into the green tape using a shaped die and punch assembly. However, during the firing process, the green tapes shrink, not always controllably. When the green tape is laminated, the lamination pressure plastically deforms the resin in the green tape, causing the cavity walls to flow inwardly, with the result that the cavity is smaller than the punch used to make the cavity cutouts. The shrinkage that occurs during firing of the green tape further contributes to misalignment problems and cavity size problems. These problems are reduced when a support substrate is used because shrinkage is controlled in two, x and y, dimensions. However, there is still some residual shrinkage in these two dimensions, up to about 3%, and thus problems of process control and shrinkage have continued.
Thus improved methods of controlling cavity dimensions during the lamination and sintering of supported multilayer glass substrates would be highly desirable.

Method for the reduction of lateral shrinkage in multilayer circuit boards on a substrate


A method for producing a part from ductile iron, including the steps of designing the part in such a way that the part is composed of a plurality of part components, producing the part components from ductile iron, providing the part components in pairs, depositing buffer material onto the rim edge of the first part component and onto the rim edge of the second part component by means of deposition welding, laying the second part component with the rim section thereof on the rim section of the first part component so that the rim edges lie against each other with the buffer materials thereof, and welding the rim sections, wherein the buffer material is selected in such a way that a structure change in the ductile iron material of the part components is prevented when the rim sections are welded.

Ductile iron is a cast iron comprising spheroidal graphite, with which large-dimensioned parts can be mass-produced economically. For example, the housing of a steam turbine is conventionally manufactured from ductile iron. The geometrical dimensions of a steam turbine in the upper power range, as are used for example for generating electricity in steam power plants, are however so large that problems can occur when casting ductile iron. For example, there is a high likelihood that nonuniformities and defects will occur in such a steam turbine housing, which compromise the strength of the steam turbine housing. Depending on the position in the part and the function of the positions affected, these nonuniformities and defects may be intolerable. There is therefore an upper limit on the maximum permissible size of housing parts made of ductile iron. A remedy would be provided by a housing part which is composed of a plurality of small pieces that are not critical in terms of casting technology. A prerequisite for this, however, would be that these pieces can form a housing when welded together. The pieces would need to be connected to one another by means of large-area welded connections, for which a suitable welding method would be necessary. However, no manufacturing method is known by which these types of large-area welded connections of ductile iron can be produced.
In general, nonuniformities and defects always occur in cast parts produced from ductile iron. The size and position of the nonuniformities and defects dictate whether the cast part in question must be discarded as a reject. For small local defects, repair welding methods are known. Such a repair welding method is, for example, cold welding with an iron-nickel alloy. However, the cold welding method produces a welded connection whose strength is less than the strength of the ductile iron. The cold welding method is therefore unsuitable for large-area welded connections. Another method is hot welding, although this can only be carried out by preheating of the part in the range of from 500° C. to 600° C., and subsequent heat re-treatment. Hot welding is therefore very complicated and generates distortion of the part, so that hot welding is unsuitable for large-area connection welding of ductile iron.

Method for the welding production of a large-dimensioned part from ductile iron by using laser-deposition-welded buffer materials and electric welding


Methods, systems, and software for efficiently creating virtual file systems including object files which contain data are described. In one aspect of the invention, a method for creating a virtual file system includes retrieving a data file from a file system. A snapshot of the data file is created and converted into an object data file. The converted object data file is linked to at least one other object file. The data file can be concatenated with at least one other data file to create the snapshot. A set of assembly instructions for creating an object file from the snapshot is generated. The assembly instructions include instructions to reserve space within the object file for data contained in the data file. The assembly instructions are converted into an object file and the snapshot of the data file is copied into the reserved space.

1. Field of Invention
The present invention relates generally to methods, apparatus, and software for managing and accessing computer files. More particularly, the present invention relates to software, methods, and apparatus for efficiently embedding data files and file names into object files to create a virtual file system for use by software running on a computer system.
2. Background
A networked computer system often includes file systems which are shared between different programs and even different operating systems. A kernel, which includes generally one or more programs that control basic system functions within an operating system, has to constantly access physical files, either remote or local, during the execution of the kernel or during the execution of an application program by the computer. Such requirements are both time consuming and utilize many computer system resources. By way of example, having to constantly access a file system which is located on a remote hard disk generally reduces the overall speed and efficiency at which the kernel can execute. This in turn can affect the performance of the entire computer system.
As a result, "virtual" file systems can be created in computer memory, i.e., either random access memory (RAM) or read-only memory (ROM). These virtual file systems can be loaded into computer memory simultaneously with a kernel or application program which is expected to use the file systems. Loading the virtual file systems at the same time as the kernel or programs are loaded is possible as virtual file systems comprise only that portion of the data contained in the file system that is relevant to the kernel or program. In other words, as the file systems which are used by a program are generally identifiable, it is possible to include virtual representations of the file systems with data which may be loaded with the program.
As file systems typically include data files, the creation of virtual file systems generally involves instantiating data files, as well as the names of data files, into object files which may be linked to obtain an image of executable code that is loaded into the computer memory as the virtual file system. As will be appreciated by those skilled in the art, an image of executable code is basically a computer program which includes computer instructions in a form which can be recognized and processed by a computer processor. Methods used to instantiate data files into object files typically either involve converting the data into source code for a higher level programming language, or converting the data directly into a higher-level language data structure, as for example an array created in the C language. In general, an object file may then be obtained by using either the source code version of the data contained in data files, or the higher-level language data structure.
Converting data files into source code or a higher-level language data structure is time consuming however. As data files generally must be converted each time a program associated with the data files is run in order to assure that the virtual data files used by the program will be current, the process of converting data can greatly reduce the speed at which a program may be built, i.e., converted, compiled, and linked, forcing the user to wait for access to operational software. What is desired, therefore, is an efficient method and apparatus for creating a virtual file system in computer memory.

Method and apparatus for embedding concatenated data files into object files during runtime in a virtual file system


A process for forming coatings and films from a gaseous reactant onto a semiconductor device is disclosed. The process includes preheating a gas to a temperature so that the gas will immediately react with the semiconductor wafer. After being preheated, the gas is contacted with the wafer under controlled conditions in order to form a uniform film. For instance, in one embodiment, a gas containing dinitrogen oxide is preheated until the dinitrogen oxide disassociates into nitric oxide. The nitric oxide is then contacted with the wafer to form an oxide coating. In an alternative embodiment, gaseous hydrogen and oxygen are preheated to a temperature sufficient to form steam, which subsequently chemically reacts with the wafer.

A thermal processing chamber as used herein refers to a device that rapidly heats objects such as semiconductor wafers. Such devices typically include a substrate holder for holding a semiconductor wafer and a light source that emits light energy for heating the wafer. During heat treatment, the semiconductor wafers are heated under controlled conditions according to a preset temperature regime. For monitoring the temperature of the semiconductor wafer during heat treatment, thermal processing chambers also typically include radiation sensing devices, such as pyrometers, that sense the radiation being emitted by the semiconductor wafer at a selected wavelength. By sensing the thermal radiation being emitted by the wafer, the temperature of the wafer can be calculated with reasonable accuracy.
Many semiconductor heating processes require a wafer to be heated to high temperatures so that various chemical and physical transformations can take place. For instance, semiconductor wafers are typically heated to temperatures of from about 400.degree. C. to about 1200.degree. C., for times which are typically less than a few minutes. During heat treating, one main goal is to heat the wafers as uniformly as possible. During some applications, a gas or gases can be circulated through the thermal processing chamber as the semiconductor wafer is being heat treated. The gas or gases can contain or can be converted to a gaseous reactant which is designed to react with the surface of the semiconductor wafer in order to form a film or coating on the wafer. For instance, the film or coating can be applied to the wafer in order to produce a semiconductor device having desired properties.
For example, in one particular application, a gas containing dinitrogen oxide is fed to a thermal processing chamber containing a semiconductor device in order to form an oxide coating on the surface of the semiconductor device. More particularly, as the gas is fed to the thermal processing chamber, the dinitrogen oxide increases in temperature due to exposure to the heat source in communication with the chamber and due to contact with the wafer itself. When the dinitrogen oxide reaches a certain temperature, the compound disassociates forming nitric oxide which reacts with silicon contained within the wafer to form silicon oxynitride.
In the past, various problems have been experienced in attempting to form films and coatings on semiconductor wafers according to the above-described process. For instance, since the gas or gases entering the thermal processing chamber must be heated before a reaction will occur with a semiconductor device, the process proceeds at a relatively slow rate which limits the speed at which the semiconductor devices can be fabricated.
Another problem that has been experienced in the past is the ability to form a coating on the semiconductor wafer that has a uniform thickness. For example, since the gas must be heated prior to reaction with the wafer, more reaction occurs at the far end of the wafer than at the end of the wafer that first contacts the gas. In some systems, the wafer is rotated during the process in order to promote a more uniform reaction with the gas over the surface of the wafer. Rotating the wafer, however, does not completely cure the above deficiencies and thus problems are still experienced in forming a coating or film having a uniform and controlled thickness.
Another problem experienced in thermal processing chambers in which a gas is circulated is the cooling effect the gas has on the semiconductor wafer. In particular, as the wafer is exposed to the flow of gas, increased convective cooling may occur over the surface of the wafer and along its edges, particularly where the gas first contacts the wafer. Ultimately, these energy losses can create different temperature zones within the wafer, which adversely impacts upon the heat treatment process and upon the quality of the final product.
For illustrative purposes, referring to FIG. 1, a schematic diagram of a conventional thermal processing chamber generally (10) is shown. Thermal processing chamber (10) includes a plurality of light sources (12) for heating a semiconductor wafer (14). As shown, a gas to be reacted with wafer (14) is fed through a gas inlet and over the surface of the wafer.
The gas is introduced into thermal processing chamber (10) at a temperature T.sub.i which is below the temperature at which the gas will react with the wafer. As the gas flows over the wafer, the gas increases in temperature until it reaches a critical temperature T.sub.c necessary for reaction with the wafer to occur. For instance, if the gas being circulated through the chamber contains dinitrogen oxide, the critical temperature is the temperature at which the dinitrogen oxide disassociates into nitric oxide.
As shown in the figure, typically the gas is not heated to its critical temperature until the gas has already traveled a substantial distance over the surface of the wafer. Thus, most of the reaction occurs at the far end of the wafer resulting in a coating having an uneven thickness. Also, as described above, the gas circulating through the chamber can cool the wafer and prevent the wafer from being heated uniformly.
In view of the above deficiencies and drawbacks of prior art constructions, currently, a need exists for a method of uniformly coating semiconductor wafers using a gaseous reactant. A need further exists for a method of coating semiconductor wafers with a gaseous reactant without adversely affecting the heat treating process.

Process for forming coatings on semiconductor devices


In one example a method of deceiving an optical augmentation device includes receiving an interrogation beam at an optical system from the optical augmentation device, encoding the interrogation beam with a false signature mis-identifying the optical system, and retro-reflecting the encoded interrogation beam to the optical augmentation device, without retro-reflecting the original interrogation beam.

Imaging and optical sensing devices are widely used in both commercial and military applications. In traditional configurations of focused optical imaging or sensing systems, a sensor array is located in the image plane and oriented perpendicular to the optical axis. This configuration is necessary to keep the image in focus across the entire active area of the imaging detector; however this configuration makes the system retro-reflective. As a result, any light not absorbed by the sensor (e.g., a camera or focal plane array sensor) is reflected and imaged directly back to the source along the same optical path as the incident light (i.e., retro-reflected).
Optical augmentation (OA) systems use this property of retro-reflection to detect hidden optical systems. For example, an OA interrogator uses an active light source to sweep through an environment, illuminating any target optical devices. Traditional optical systems produce a "cat's eye" effect in which any unabsorbed light from the illuminating beam is retro-reflected back to the OA interrogator. The retro-reflection reveals the location of the illuminated target optical system, as well as type of sensor used in the system. The sensor type may be linked to the type of hardware it supports, along with its the associated capabilities and vulnerabilities.

Methods and apparatus for deceiving optical augmentation


In accordance with a setting which decides whether reception from a party other than a specific party is to be refused, the communication mode of the communicating party is discriminated from among a plurality of communication modes upon changing over an identification signal, and communication is carried out based upon the results of the discriminating operation.

This invention relates to a facsimile apparatus and to a method of communication. More particularly, the invention relates to a facsimile apparatus and communication method having a plurality of communication modes, in which reception from parties other than specific parties can be refused.
Facsimile apparatus having a plurality of communication modes include those having G2 and G3 functions. Among these apparatus, some are designed to enable refusal of reception from parties other than specific parties.
The operation of such a conventional facsimile apparatus will be described.
First, the telephone number of a specific party from which reception is allowed is registered in the facsimile apparatus in advance. When an incoming call is received by this facsimile apparatus, an initial identification signal of a G3-standardized transmission procedure is transmitted to the calling party in order to identify whether the mode is G2 or G3. If the corresponding NSS/TSI/DCS signal is received from the other party, communication is performed in the G3 mode. In a case where the telephone number of the TSI signal sent from the other party's transmitter coincides with the above-mentioned registered telephone number of the party, reception processing is executed. On the other hand, if the telephone number of the TSI signal does not coincide with the registered telephone number of the other party, or if the TSI signal is not sent from the other party's transmitter, reception processing is not executed.
If a GC2 signal is received in response to transmission of a G2-standardized initial identification signal, communication is performed in the G2 mode. In this case, however, a collation of telephone numbers cannot be carried out. Consequently, a response to GC2, LCS, PHS signals cannot be made, and a protocol error occurs.
In the example of the prior art described above, the G3 and G2 initial identification signals are transmitted in alternating fashion in order to identify whether the mode is G2 or G3. When the corresponding answer signal is received, a declaration is made to the effect that there is a reception capability in either of the two modes G2 and G3.
However, allowing reception solely from a specific party in the G2 mode is not feasible in actuality since collation of telephone numbers is impossible. Performing communication (specifically, transmitting GI2) upon declaring that a G2 function is available in response to a GC2 signal is wasteful of transmission time and is undesirable in terms of making effective use of the apparatus.

Facsimile apparatus, and method of communication


A manufacturing method for manufacturing a display device includes forming a discontinuous organic layer on at least one of a cover substrate and an insulating substrate provided with a display device element, arranging the insulating substrate and the cover substrate with facing each other for the organic layer to be interposed therebetween, and assembling the cover substrate and the insulating substrate by pressing the substrates together.

1. Field of the Invention
The present invention relates to a manufacturing method for display device, a manufacturing apparatus for the same, and a display device made by the same, particularly, to a manufacturing method that may minimize permeation of oxygen and moisture from a side surface of a display device, a manufacturing apparatus used for the display device, and a display device manufactured by the same.
2. Discussion of the Background
Recently, the organic light emitting diode (OLED) device has attracted attention and interest in the industry of flat panel display devices because of its low driving voltage, slim shape, light weight, and high-speed response.
An OLED device typically includes a thin film transistor including a gate electrode, a source electrode, and a drain electrode; a pixel electrode connected with the thin film transistor; a wall dividing the pixel electrodes; a light emitting layer formed on the pixel electrodes disposed on regions between the walls; and a common electrode formed on the light emitting layer.
The light emitting layer is formed of an organic material and is capable of emitting light. Moisture and oxygen may deteriorate the light emitting layer and decrease its quality and life time. In order to prevent the light emitting layer from deteriorating, the light emitting layer may be encapsulated with a cover substrate. Further, an organic material such as a sealant interposed between the insulating substrate and the cover substrate blocks the permeation of oxygen and moisture.
However, organic materials such as the sealant have a relatively high permeation rate of oxygen and moisture. Thus, the quality and life time of the display device may be decreased if there is a large gap to be sealed between the two substrates.

Manufacturing method for display device, manufacturing apparatus for the same and display device made by the same


A transfer pump for moving pellets of adhesive includes a pump housing with an adhesive inlet coupled to a supply hopper, an adhesive outlet coupled to an outlet hose, and an adhesive passage extending between the adhesive inlet and the adhesive outlet. A first air nozzle communicates with the adhesive passage adjacent the adhesive inlet and expels a first air jet that pushes pellets of adhesive through the adhesive passage. A second air nozzle communicates with the adhesive passage between the adhesive inlet and the adhesive outlet and expels a plurality of second air jets that draw pellets of adhesive through the adhesive passage by a vacuum force. The first and second air nozzles prevent clogging of pellets in the adhesive passage and enable movement of larger pellets than either air nozzle individually.

In adhesive dispensing systems, a dispensing module is generally fed liquid adhesive material from an adhesive melter or another similar supply device. These adhesive melters receive a controlled supply of solid adhesive material in the form of pellets from a supply hopper or some other storage unit. In this regard, transfer pumps for solid materials are used to control the supply of pellets of adhesive from the supply hopper to the adhesive melter. More particularly, transfer pumps remove pellets of adhesive from the supply hopper and force the pellets of adhesive with pressurized air through an outlet hose and to the adhesive melter, where the pellets of adhesive are melted to a liquid state for delivery to the dispensing module. The pellets of adhesive utilized in these adhesive dispensing systems have various shapes and sizes, but conventional transfer pumps are limited in what size and shape of pellets can be moved through the outlet hose to the adhesive melter.
In one example of a transfer pump known as a Venturi pump, the transfer pump expels one or more air jets through a passage to form a vacuum force that draws pellets of adhesive from the supply hopper and through the transfer pump. However, Venturi pumps are generally limited to creating a vacuum force of up to one atmosphere, thereby limiting the size of pellets that may be effectively drawn through the transfer pump. Additionally, the passage through which the air jets are expelled must be designed with a narrowed throat portion carefully tailored to maximize the vacuum force produced by the Venturi pump. The diameter of this narrowed throat portion may constrict or clog flow of pellets of adhesive through the transfer pump, thereby limiting the maximum size of pellets of adhesive that are moveable with the air jets.
In another example of a transfer pump known as a gravity eductor, the transfer pump expels an air jet to push pellets of adhesive from an inlet of the transfer pump and through the transfer pump. The pellets of adhesive are gravity fed into the inlet of the transfer pump by the supply hopper. Although the force exerted by the air jet in a gravity eductor can move a large number of larger pellets of adhesive, the resultant higher density of material within the transfer pump may clog the transfer pump, especially when the air jet is stopped and then restarted. As a result, gravity eductor transfer pumps cannot be stopped during operation unless the supply hopper feeding the gravity eductor is empty or the supply hopper includes additional valve structure for cutting off the gravity feed of pellets into the transfer pump. This additional valve structure is expensive and complicated, so most gravity eductors do not include the valve structure and are thus not stopped until the supply hopper is empty.
Consequently, it would be desirable to address these and other concerns associated with conventional transfer pumps.


A door for an automotive vehicle includes a bracket that is mounted to an upper portion of a door panel and projects upwards from the door panel, a key cylinder for locking or unlocking the door where a key insert hole of the key cylinder is mounted to the bracket and is directed towards the outside of the automotive vehicle body, a door handle base that is mounted to the bracket so that it covers the key cylinder from the outside of the automotive vehicle body such that the door handle base has an aperture positioned opposite from the key insert hole of the key cylinder, and a door handle for opening or closing the door that is mounted to the door handle base.

1. Field of the Invention
The present invention relates to the structure of a door for an automotive vehicle.
2. Description of the Related Art
The conventional structure of a door for an automotive vehicle, as disclosed in Japanese Patent Laid-open Publication (kokai) No. 63-66,318, is arranged so that a door handle base is disposed at the upper portion of a door handle base of the door projecting upwards therefrom and a key cylinder is mounted to the door handle base in addition to an outer door handle.
This structure requires an operator to bend its body forward for inserting the key into the key cylinder and opening or closing the door if the height of the vehicle were to be lowered. Further, this conventional structure of the door has the disadvantage that the material used for the door handle base is restricted to one a having ridigity higher than the rigidity of, for example, aluminum die cast because the key cylinder is mounted directly to the door handle base.

Structure of a door for an automotive vehicle