A connector assembly includes a header and a receptacle adapted to mate with the header. The header comprises an insulative body and multiple-length contact pins arranged in columns. Tails connected to the contact pins are press fit or soldered to a printed circuit board or back plane such that tails of adjacent columns are offset by one-half pitch. The receptacle comprises a column of m contacts that extend through an insulative lead assembly and tails oriented at a right angle to the contacts that also extend through the insulative lead assembly. The tails are press fit or solder to a printed circuit board, such as a daughter board. The receptacles are adapted to be stacked together in n layers to form an m x n array of contacts that is housed within a receptacle housing.

The present invention relates generally to electrical connectors and more particularly, to a connector assembly comprising a receptacle and a header, having a high signal density and enhanced signal carrying capability.
As electronic circuits and components become increasingly miniaturized, the demand for electrical connectors to electrically and mechanically interconnect a first PCB, such as a back panel or mother board, to a second PCB, such as a daughter board has also increased. As existing and additional components are enhanced or added to circuit boards, the electrical connectors that interconnect the circuit boards must accommodate the resulting additional connections. Further, as clock speeds increase other demands are being placed on the electrical connectors that interconnect circuit boards.
Typically, high density connectors have a signal density of 50-65 signals per inch of connector. Conventional techniques to increase signal density have been directed to minimizing the amount of space occupied by each receptacle or contact of the connector assembly. However, closely spaced electrical signals can interfere with one another. The interference phenomenon is referred to as xe2x80x9ccross talk.xe2x80x9d Density and pin count are often viewed interchangeably, but there are important differences. Density refers to the number of contacts provided per unit length. In contrast, the number of contact elements that can reasonably withstand the mating and unmating forces is referred to as the pin count.
As more functions become integrated on semiconductor chips or on flexible circuit substrates and more chips are provided on printed circuit boards (PCBs), each PCB or flexible circuit must provide more inputs and outputs (I/Os). The demand for more I/Os directly translates to a demand for greater density. In addition, many system components are capable of operation at faster speeds than previously. Faster speed can result in the generation of potentially interfering signals, i.e., crosstalk and noise. The connectors used in such high-speed board-to-board, board-to-cable and cable-to-cable communications may be treated for design purposes like transmission lines in which crosstalk and noise become significant concerns. Indeed, the electrical performance of high-speed board-to-board, board-to-cable and cable-to-cable communications is dependent upon the amount of crosstalk and noise introduced at the connector interface.
One method of controlling cross talk is to connect certain terminals of the high density connector to grounded conductive areas of a printed circuit board. This solution is provided externally to the connector and provides for flexibility of design. In particular, a designer may configure the number of grounds and/or signals passed by the connector based on the particulars of the connections to the printed circuit board.
For example, U.S. Pat. No. 4,900,258, to Hnatuck et al., entitled xe2x80x9cMulti-port Coaxial Printed Circuit Board Connectorxe2x80x9d, discloses a connector having plural coaxial subassemblies. Each coaxial subassembly is provided with a center contact for passing a signal and an outer contact which is connected to ground. The individual coaxial subassemblies are arranged in rows and columns within the connector assembly which is then mounted at a right angle to a motherboard.
U.S. Pat. No. 5,547,385, to Spangler, entitled xe2x80x9cBlind Mating Guides on Backwards Compatible Connectorxe2x80x9d, discloses an electrical connector assembly comprising a first electrical connector having alignment posts which mate with receiving cavities provided in a second mating electrical connector. The ground contacts which extend from the first connector are longer than the signal contacts so the ground contacts engage respective conductors in the mating electrical connector prior to the signal contacts engaging their respective conductors in order to discharge electrostatic charge to a chassis ground.
According to another method of controlling cross talk, conductive material is disposed between rows and/or columns of signal carrying terminals in the high density connector. The conductive material is generally separated from the signal leads by a dielectric material such as plastic. According to this method, the conductive material is connected to a corresponding grounded conductive area of the printed circuit board. Such connectors have been termed in the art as strip-line or micro-strip connectors. Unlike the first method above, this solution is provided within the connector itself.
For example, U.S. Pat. No. 4,705,332, to Sadigh-Behzadi, entitled xe2x80x9cHigh Density, Controlled Impedance Connectorsxe2x80x9d, discloses a modular connector where discrete wafers having signal carrying conductors are stacked together. The discrete wafers are formed having multiple signal carrying contact elements which may be mounted at a right angle to a mother board or daughter board. Locating pins are provided, which are received by apertures in the mother board. Between each wafer is a planar ground element such that a strip line configuration is created.
U.S. Pat. No. 4,806,107, to Arnold et al., entitled xe2x80x9cHigh Frequency Connectorxe2x80x9d discloses a strip line type connector having ground plates that extend from the connector. The ground plates are inserted into a complementary connector and are formed by bending single metal sheets into a U-shape. The extending portion of the U-shaped metal sheet form pairs of ground plates. A flexible connector attached near the base of the xe2x80x9cUxe2x80x9d is connected to a ground contact on a mother board.
U.S. Pat. No. 5,632,635, to VanBesien et al., entitled xe2x80x9cElectrical Connector Arrayxe2x80x9d, discloses an electrical connector array having a plurality of signal contacts separated by a ground strip. The ground strip is provided with connection points which are spaced in an manner to minimally affect the particular routing of the connector.
In addition to the above-mentioned methods of controlling cross talk, the dielectric material used to separate conductive leads may affect cross talk by altering the characteristic impedance of the connector. Conventionally, non-conductive materials such as plastic are used as a dielectric to insulate regions between conductors within a connector.
For example, U.S. Pat. No. 4,070,048, to Hutchinson, entitled xe2x80x9cControlled Impedance Connectorxe2x80x9d, discloses a connector for a computer backplane or printed circuit board where the signal carrying conductors are embedded in a dielectric block. A metallic foil is provided as a ground plane between rows of right angle pins. The metallic foil is connected with ground pins which are spaced apart in the connector assembly and are used as a reference to all signal carrying conductors and to obtain a desired impedance. Hutchinson also discloses embedding a flexible micro strip having signal carrying conductors and a ground plane within the dielectric block. Ground reference sockets, provided at each corner, are connected to the round plane on the micro strip.
While the prior art teaches connectors having a high pin count, the prior art connectors fails to teach a connector having a signal density which meets the demands of ever-increasing miniaturization of printed circuit boards. The prior art also fails to address increasing signal density by eliminating space consuming dielectric and insulative elements from the header array, such as plastic slots into which circuit cards are inserted. Moreover, the prior art fails to adequately address the problem of increased insertion forces that are generated and sequential mating concerns when a large number of header contacts are inserted into a receptacle. Still further, the prior art fails to teach a connector that uses air as a dielectric material to insulate signal leads while adequately reducing cross talk and maintaining a proper characteristic impedance.
In view of the above, the present invention, through one or more of its various aspects and/or embodiments is thus presented to accomplish one or more objects and advantages, such as those noted below.
A primary object of the present invention is to provide connector assemblies having a configuration characterized by enhanced signal carrying capacity, a low signal to ground ratio and preferably minimal cross talk, as required by the particular application for which the connector is intended.
The present invention provides a header, a receptacle, and a high density connector assembly comprising a combination of the receptacle and the header adapted to mate with each other. In accordance with an aspect of the present invention, a header for mating with a receptacle is provided which includes an insulative body comprising an outer surface and defining at least one notch, a plurality of tails extending through the insulative body, a guide pin integrally formed within the insulative body, and a plurality of conductive blades disposed on the outer surface of the insulative body, where each of the conductive pins being in electrical communication with one of the plurality of tails.
According to a feature of the present invention, the plurality of conductive blades are disposed in columns and at least three of the conductive blades are of unequal lengths. According to another feature, the at least three conductive blades are disposed in the columns such that adjacent conductive blades in each of the columns have different lengths.
According to yet another feature, each of the plurality of tails in a first column is aligned with a first edge of a corresponding conductive strip, and each of the plurality of tails in an adjacent column to the first column is aligned with a second edge of each of the conductive blades, the second edge being an opposite edge of the conductive strip with respect to the first edge.
According to a further feature, the at least one notch is provided at a corner of the insulative body.
According to a feature, the header further comprises a plurality of notches and a plurality of guide pins integrally formed within the insulative body.
According to another feature, the header is adapted to be joined on a printed circuit board to at least one other header. According to yet another feature, the joined headers may be mounted to opposing faces of a printed circuit board.
According to another aspect, a receptacle for mating with a header is provided which includes an insulative assembly frame, a plurality of pins extending through a first member of the insulative assembly frame, a plurality of tails extending through a second member of the insulative body, a plurality of leads connecting the plurality of pins to the plurality of tails, and a non-conductive protrusion extending from the second member of the insulative body.
According to a feature of the present invention, the first member and the second member are formed at a right angle.
According to another feature, the insulative member further comprises a base portion, a dimension of the base portion being defined by a distance the second member is offset from an edge of the first member.
According to yet another feature, a surface of the first member, through which the leads extend, is formed at a predetermined angle other than a right angle with respect to the second member. According to a feature, a surface of the first member, through which the leads extend, is formed at a right angle with respect to the second member.
According to another feature, the receptacle further comprises a diagonal member, the diagonal member extending from an end of the first member opposite the second member to an end of the second member opposite the first member.
According to yet another feature, the receptacle further comprises a third member, the third member disposed substantially parallel to the first member; and a fourth member, the fourth member disposed substantially parallel to the second member.
According to a further feature, a region of intersection of the first member and the second member has a cross section defining a triangular. According to yet another feature, a region of intersection of the first member and the second member has a cross section defining a semi-circular arc.
According to a further feature, the receptacle is adapted to be stacked with at least one other receptacle and the stacked receptacles may be mounted within a receptacle housing.
According to yet another aspect, a connector assembly is provided which includes the header and a receptacle housing containing at least one of the receptacles of the present invention. The receptacle housing and the header are adapted to be mated to each other, and each of the receptacle pins is adapted to mate with a corresponding one of the conductive blades when the receptacle housing and the header are mated.
According to a feature of the present invention, the conductive pins are disposed in columns on the outer member of the insulative body and at least two of the conductive pins in each of the columns having unequal lengths. The at least two conductive pins are disposed in the columns such that adjacent conductive pins in each column have different lengths.
According to another feature, the receptacle housing is adapted to mate with the header in accordance with a location of the guide pin.
According to yet another feature, the header is arranged as an array of plural headers having plural guide pins which provide for at least two points of guidance of the receptacle upon mating with the header.
According to still another feature, a plurality of notches and a plurality of guide pins are provided where the plurality of guide pins are aligned in a row.
According to a further feature, the receptacle housing is adapted to mate in an orientation parallel to the row of guide pins.
According to another feature, the header is arranged as an array of plural headers having plural guide pins which provide for at least two diagonally opposed points of guidance of the receptacle upon mating with the header.
According to yet another feature, the plurality of conductive pins and the plurality of terminals are arranged to have an interstitial ground pattern.
According to still another feature, a leading portion of each of the plurality of terminals is disposed within the receptacle housing, and a remaining portion of each of the plurality of terminals is external to the receptacle housing.
According to yet another feature, the header comprises a plurality of conductive pins arranged in parallel and the receptacle housing comprises a plurality of leads arranged in parallel, such that signal lead and ground lead connections between first and second printed circuit boards or back planes follow substantially parallel paths.
According to a further feature, an edge of one of the leads is arranged to be proximate to an edge of an adjacent lead, and a distance separating edges of the leads in the connector assembly is less than a thickness of the leads.
According to another aspect of the present invention, a header adapted to be mounted on opposing sides of a printed circuit board is provided which comprises an insulative body comprising an outer surface, a plurality of tails extending through the insulative body, and a plurality of conductive pins disposed on the outer surface of the insulative body where each of the conductive pins being in electrical communication with one of the plurality of tails. A plurality of tails of a first header, mounted to a first side of the printed circuit board, are fixed within corresponding holes in the printed circuit board, and a plurality of tails of a second header, mounted to second side of the printed circuit board, are fixed within the corresponding holes in the printed circuit board.
Other features of the invention are described below.

High density electrical connector assembly


On an automatic winder, at the time of doffing, a signal is sent from a doffing device to a winding unit, a drum motor of the winding unit is driven at a low speed in response to said signal to rotate a package on a traverse drum, and a bobbin yarn is picked up. The automatic winder has a number of winding units juxtaposed, the doffing device is provided to freely travel along the winding units a paper tube supply system for delivering one or more kinds of paper tubes is installed at one end of the automatic winder, a conveyor for carrying paper tubes from the paper tube supply system is provided parallel with a travel path of the doffing device, and a paper tube holding device for receiving paper tubes carried by the conveyor is provided on the doffing device.

1. Field of the Invention
The present invention relates to a doffing method and an automated paper tube supply system which can supply paper tubes of desired kinds to an automatic winder having a number of winding units juxaposed or an automatic winder divided into spans of two kinds or more.
2. Prior Art
First, a conventional paper tube supply system in an automatic winder will be described with reference to FIG. 9. Reference numeral 1 designates a frame for an automatic winder; 2 winding units installed in parallel on the frame 1; 3 a paper tube box; 4 a discharge conveyor installed along the back surface of the automatic winder; 5 a rail installed above the automatic winder; and 6 a doffing device which can travel along the automatic winder on the rail 5. This doffing device carries out a series of the following operations. When a specific winding unit 2 terminates to wind a package P, unwinding stops and a lamp 11 is lit. The doffing device 6 detects lighting of the lamp 11 and stops before a spindle thereof. Then, a yarn Y is picked up. Subsequently, a cutter cuts the yarn Y and holds a lower yarn. Next, a cradle arm 10 is opened to discharge the package P onto the discharge conveyor 4. Then, a paper tube 13 is gripped from the box 3 to carry it to the cradle arm 10. The yarn Y is sandwiched between a paper tube and the cradle arm 10, and the sandwiched yarn Y is moved to a bunch winding position to effect the bunch winding. A button 12 is depressed to start the winding unit 2.
As described above, a conventional paper tube supply is carried out every spindle, and a paper tube supply to the box is carried out by an operator. In the case where there are two or more kinds, an operator replenishes paper tubes to the box 3 while sorting the various kinds of paper tubes.
In the aforementioned conventional paper tube supply system, there is a limitation of the number of paper tubes 13 which can be accommodated in the paper tube box 3 of each spindle (about four paper tubes). Therefore, it is necessary to always monitor the state of the paper tube box 3 to replenish paper tubes corresponding to the kinds to the paper tube box, giving rise to a problem in that labor is required.
In an automatic winder, when a yarn end is subjected to selvedge winding, the yarn end is wound close to the package. Therefore, (as shown, for example, in FIG. 18) this prevents the yarn end from being disengaged from the bobbin at the time of winding or at the time of termination of winding.

Doffing method and paper tube supply system for an automatic winder


A multi-function concurrent processing device that is capable of performing a plurality of functions by using time sharing methods to concurrently process at least two control programs. The multi-function concurrent processing device includes a computer having a ROM storing a plurality of control programs corresponding to a plurality of functions; a display unit having a display commonly used for the plurality of functions; and a plurality of display data buffers provided in a one-to-one correspondence with the plurality of control programs stored in the ROM, each of the plurality of display data buffers exclusively storing display data for displaying, on the display, display information generated in association with execution of a corresponding one of the plurality of control programs stored in the ROM.

1. Field of the Invention
The present invention relates to a multi-function concurrent processing device capable of concurrently processing a plurality of control programs using time sharing methods.
2. Description of the Related Art
Recently, many electronic devices, such as information processing devices, include an internal computer of some sort. In order to more rapidly process a plurality of functions, such as a computation process function or a process function for inputting and outputting information, one such electronic device uses a type of multi-function concurrent processing called multi-processing to concurrently process the plurality of functions. The electronic device includes a plurality of central processing units connected in series. In order to perform the plurality of functions, an operation system with a concurrent process management system uses the CPUs to separately execute a plurality of control programs that correspond to the plurality of functions.
The electronic device that utilizes multi-function concurrent processing includes a display, such as a liquid crystal display (LCD) or a cathode ray tube display (CRT display). A variety of messages relating to errors and changes in condition of the electronic device are generated in association with execution of the variety of control programs. Each message is displayed at a predetermined region of the display allotted for display of that message. The user can grasp and gain an understanding of the present execution condition of the plurality of functions by viewing the corresponding messages displayed on the display.
It should be noted that other electronic devices use time sharing methods to more rapidly process a plurality of functions. During time sharing processes, a single processing unit executes a plurality of control programs one after the other in a predetermined order each time a short predetermined processing time elapses.

Multi-function parallel processing electronic device


A process variable transmitter for measuring a process variable includes a process variable sensor configured to sense a process variable and provide a sensor output. Measurement circuitry receives the sensor output and provides a measured output related to the process variable. Output circuitry provides a device output on a two-wire process control loop based upon the measured output. The output circuitry has a transfer function that is a function of an adjustable analog circuit component. A motorized actuator is configured to adjust the adjustable analog circuit component to thereby change the transfer function of the output circuitry. An optional calibration controller is also provided.

The present invention relates to analog process variable transmitters of the type used in control and monitoring of industrial processes. More specifically, the invention relates to calibration of such analog transmitters.
Two-wire transmitters find widespread use in industrial process control systems. A two-wire transmitter includes a pair of terminals which are connected in a current loop together with a power source and a load. The two-wire transmitter may be powered by the loop current flowing through the current loop, and varies the magnitude of the loop current as a function of a parameter or condition which is sensed. In general, the transmitters comprise energized electrical circuits which are enclosed in a sealed housing such that ignition of any combustible atmosphere by faults or sparks from the energized circuit is contained in the housing.
Although a variety of operating ranges are possible, one widely used two-wire transmitter output varies from 4 to 20 milliamperes (mA) as a function of a sensed process variable. It is typical with a two-wire transmitter to provide adjustment of the transmitter output so that a minimum or zero value of the parameter sensed corresponds to the minimum output (for example, a loop current of 4 milliamperes) and that the maximum parameter value to be sensed corresponds to the maximum output (for example, 20 milliamperes). This is referred to as zero and span adjustment.
The minimum and maximum parameter values will vary from one industrial process installation to another. It is desirable, therefore, to provide some means for setting (calibration) the maximum and minimum output levels in the field. In transmitters implemented using analog circuitry this is done typically with electrically energized zero and span potentiometers sealed in the housing. With some transmitters, a housing cover must be removed to gain access to the potentiometers. This exposes the atmosphere surrounding the transmitter to the live circuits in the transmitter. A variety of techniques, however, are available for adjusting the potentiometers while sealing potentially explosive atmospheres surrounding the transmitter from the electrically live circuits in the transmitter. In some transmitters, a rotary adjustment shaft for adjusting a potentiometer is closely fitted through a bore in the housing to provide a long flame path for quenching ignition in the housing before it reaches the atmosphere surrounding the housing. In yet another arrangement, the potentiometers are mechanically coupled to a relatively large bar magnet which is then rotated magnetically by another bar magnet outside the live circuit's enclosure. This arrangement with bar magnets can have the disadvantage of mechanical hysteresis, making precise span and zero setting difficult. Actuated switches are also used for setting span and zero in transmitters, such switches require an opening through the wall of the transmitter's housing to provide for mechanical coupling to the switch.
Thus, it is often difficult to adjust the zero and span potentiometers which are sealed within the transmitter housing. Potential leak paths must be sealed and this may be particularly problematic in a process variable transmitter which must operate in a submersible nuclear environment. The configurations also add constraints to the design, packaging and size of the process variable transmitter.

Analog process variable transmitter with electronic calibration


The present invention relates to a method for inhibiting the etiology of disease in patients having a disease state caused by an excess of 12-lipoxygenase or its products. In particular, the invention provides for administration of a human leukocyte 12-lipoxygenase pathway inhibitor to inhibit disease etiology, to inhibit the proliferation of breast cancer and to increase insulin receptor phosphorylation in a patient having Type II diabetics.

This invention pertains to a human leucocyte type of 12-LO and its role in the pathogenesis of several major disease states.
AA=Arachidonic acid
AII=Angiotensin II
EGF=Epidermal Growth Factor
FN=Fibronectin
GAPDH=Glyceraldehyde-3-phosphate dehydrogenase
GF=Growth Factor
HAEC=Human Aortic Endothelial Cells
HETE=Hydroxyeicosatetraenoic Acid
12 HETE=12-Hydroxyeicosatetraenoic Acid
HG=High Glucose
hl 12-LO=Human Leukocyte 12-Lipoxygenase
hl 15-LO=Human Leukocyte 15-Lipoxygenase
HODE=Hydroxyoctadecadienoic acid
12-HPETE=12-Hydroperoxyeicosatetraenoic Acid
HSMC=Human Aortic Smooth Muscle Cells
HPLC=High Pressure Liquid Chromatography
IL-1 =Interleukin-1
LDL=Low Density Lipoprotein
LO=Lipoxygenase
12-LO=12-Lipoxygenase
15-LO=15-Lipoxygenase
MAPK=Mitogen Activated Kinase
mmLDL=Minimally Modified Low Density Lipoprotein
MO=Monocytes
NIDDM=Non-insulin Dependent Diabetes Mellitus
NG=Normal Glucose
PDGF=Platelet Derived Growth Factor
PKC=Protein Kinase C
pl 12-LO=Human platelet 12-Lipoxygenase
PVSMC=Porcine Vascular Smooth Muscle Cells
RT-PCR=Reverse Transcriptase Polymerase Chain Reaction
SMC=Smooth Muscle Cells
TGFB=Transforming Growth Factor Beta
TNF=Tumor Necrosis Factor 1
VSMC=Vascular Smooth Muscle Cells
The three mammalian lipoxygenases are named according to the carbon position (1, 2 or 3) at which they oxygenate arachidonic acid (4). There is increasing evidence that certain LO enzymes are involved in the pathogenesis and acceleration of atherosclerosis by inducing oxidation of LDL to its atherogenic form (5,6) and increasing the growth or migration of smooth muscle cells (1, 7-9). In addition, evidence suggests that a 12-LO protein plays a role in mediating angiotensin II (AII) induced vascular and adrenal actions (10-12). Recent studies indicate that at least two forms of 12-LO exist, i.e., pl 12-LO cloned from human erythroleukemia cells (2,13) and a porcine leukocyte 12-LO which has been isolated and cloned from porcine mononuclear cells, pituitary (14) and bovine tracheal cells (15).
Applicants have demonstrated the presence of a leukocyte type of 12-LO in human adrenal glomerulose cells (3). The human 15-LO has been purified from human and rabbit reticulocytes (16,17). The human platelet and porcine leukocyte type 12-LO share 65% amino acid homology (13). However, porcine leukocyte type 12-LO is highly homologous to human 15-LO (86%) (14). Recently, it has been shown that 15-LO is expressed in macrophages of human atherosclerotic lesions but not in unstimulated monocytes (18).
This application describes evidence for the presence of a human leucocyte type of 12-LO enzyme (hl 12-LO) and its role in the pathogenesis of several major disease states or processes, including atherosclerosis, breast cancer, autoimmune and inflammatory disease, diabetic vascular and kidney disease and insulin resistance. There are several features of this unique enzyme that can link several seemingly diverse conditions.
1. hl 12-LO Can utilize arachidonic and linoleic acid as fatty acid substrates generating hydroperoxides and other lipid mediators which can activate important signal transduction pathways commonly associated with these disorders. These mediators include (a) kinases such as specific isoforms of protein kinase C and mitogen activated kineses (MAPK), (b) transcription factors such as NFkB and oncogenes which have clearly been implicated in inflammatory and autoimmune conditions, atherosclerosis, cancer growth and metastasis.
2. Activation of the hl 12-LO enzyme can itself generate superoxide anions which can lead to the propagation of free radical processes which could accelerate the oxidative modification of lipids and proteins. These processes are involved in the pathogenesis of inflammatory, neoplastic and atherogenic conditions.
3. The hl 12-LO enzyme is strategically located. Evidence is presented showing the presence of the leucocyte type 12-LO in human monocytes, aortic vascular smooth muscle and endothelial cells, cardiac myocytes, skeletal muscle, the kidney and breast cancer cells and beta cells of pancreatic islets. These sites of activity of this enzyme allow a tissue specific role in leading to pathologic states. For instance, in the beta cells of the pancreatic islets, activation of 12-LO activity by inflammatory cytokines (e.g., IL-1) could explain the selective dysfunction and destruction of the beta or insulin producing cells of the pancreas. Furthermore, activation or increased expression of the 12-LO pathway by glucose in the beta cells could explain the dysfunctional secretion of insulin in the common form of adult diabetes (non-insulin dependent diabetes).
4. Factors increasing 12-LO expression and activity are linked to inflammatory, atherosclerotic, renal and neoplastic disease.
The factors demonstrated to increase the activity and expression of 12-LO include, (a) inflammatory cytokines associated with autoimmune disease (Type I diabetes) atherosclerosis and neoplastic growth such as interleukin-1xcex2 (IL-1), (b) growth factors such as platelet derived growth factor (PDGF) and angiotensin II (AII) which have been implicated in accelerated vascular and kidney disease, and (c) hyperglycemia which has been linked to the microvascular (eye, kidney and nerve) and microvascular (heart attack, stroke and peripheral vascular disease) complications of both type I or type II diabetes.
5. Applicants have found that glucose which accounts for much of the acquired insulin resistance in diabetes increases 12-LO activity and expression in all tissues tested. Therefore, 12-LO activation could provide a common link between glucose-induced oxidative stress and development of end-organ dysfunction or damage.
Pursuant to this invention, blockade of the hl 12-LO expression or enzyme activation provides novel treatments to prevent these disease states.
Applicants have now evaluated the precise type of LO present in unstimulated human aortic smooth muscle cells (HSMC), endothelial cells (HAEC) and monocytes (MO). Furthermore, since AII can increase the expression of 12-LO in human adrenal cells, applicants have also evaluated the effects of AII on 12-LO regulation in HSMC. Finally, applicants determined whether immunohistochemical analysis of atherosclerotic lesions demonstrates the presence of a leukocyte type of 12-LO. The results show that a 12-LO similar to that found in human adrenal glomerulose is expressed in the normal HSMC, HAEC and MO. Furthermore, this 12-LO is markedly upregulated by AII in HSMC and is present in human atherosclerotic lesions.

Human leukocutye 12-lipoxygenase and its role in the pathogenesis of disease states


A suspending strap lodging device allows a suspending strap to be extracted from or withdrawn into a portable object, such as a bag, depending upon whether or not the strap is needed. The device includes a mechanism for allowing the strap to be withdrawn or extracted to a desired length; a locking mechanism for controlling movements of the strap steplessly in both the withdrawing and the extracting directions; and a mechanism for releasing the locking mechanism. The locking mechanism provided in the withdrawing and extracting mechanism prevents the weight of the portable object, or the impact load caused when the object is lifted, from being directly exerted on the strap, thereby enabling the strap to be securely locked in position and allowing it to enjoy a long service life. Also a strap may be equipped with its own strap lodging device. Since it is equipped with a lodging device of its own, this strap can easily replace the straps of existing portable objects. Further, a mounting structure allows a strap lodging device to be mounted on a portable object. The structure, which can be applied, for example, to a video camera, adopts a single strap which serves as a shoulder strap, a grip strap and a hand grip.

1. Field of the Invention
This invention relates to a device for lodging a suspending strap for a portable object. The device enables the suspending strap of a portable object (e.g., a shoulder strap, a handle or the like), which is attached to a portable object (e.g., a bag, a camera, a box, etc.), to be extracted or withdrawn depending upon whether or not such a strap is needed.
2. Description of the Related Art
Generally speaking, a portable object of the above-mentioned category, for example, a briefcase or a sports bag, is equipped with a handle so that it may be carried by hand. In some cases, however, such a portable object may be so heavy that it tires the hand when it is carried by the handle alone for a long time, or it may prove inconvenient when the person carrying it wishes to use both hands for something else. For this reason, a suspending strap, such as a shoulder strap, has to be attached to the portable object.
A suspending strap attached to a portable object, for example, the shoulder strap of a bag, is so designed that its length can be varied by means of an adjusting member such as a buckle. In other words, the length of the suspending strap must be adjusted to fit the person using the bag, which is rather bothersome. Moreover, since it is rather long, the strap may hang loose from the portable object. This condition is undesirable because the strap may be caught by some protruding object, causing the portable object to drop when it is being carried. In some cases, that condition could even lead to an accident. In addition, the suspending strap may become dirty when the portable object is put on the ground, with the result that it stains the clothes of the person carrying the portable object. In any case, such a strap is in the way when it is not being used, which is very inconvenient.
There exists a conventionally known structure which aims to eliminate the above problems by means of a so-called hook fixture or the like which allows the suspending strap to be attached to or detached from the portable object depending upon whether or not the strap is needed. However, such a suspending strap is not attached or detached to or from the associated portable object each time it becomes necessary or unnecessary. It is usually while the portable object is being carried about that the suspending strap becomes necessary or unnecessary. In other words, the strap is not usually detached even if it becomes unnecessary. Accordingly, this known structure is not useful in eliminating the above problems and inconveniences. On the contrary, this conventional structure is inconvenient in that, when the strap is not needed, the part of the strap hanging from the portable object has to be put away in the portable object so that it will not be in the way, or it has to be gripped together with the handle. Thus, at present, only such primitive measures are available to cope with the above inconvenience.
In view of this, a variety of strap lodging devices have been proposed in which the strap can be withdrawn into the portable object (by winding it up) or extracted therefrom depending upon whether or not the strap is to be regularly used. These conventional lodging devices adopt either of the following two types of locking mechanism: (1) the strap itself is press-locked so as to prevent it from being extracted or withdrawn inadvertently; or (2) a so-called ratchet mechanism allows the winder of the strap to rotate in one direction only. The structure of the former mechanism is fatally defective in that locking cannot be securely effected since the lock position is subject to displacement due to the weight of the associated portable object and the impact load generated when the object is lifted. Accordingly, the strap of such a mechanism does not have a long service life. The problem with the latter mechanism is that locking is only effected in either the winding or the extracting direction, which means it is not suitable for the strap lodging device of a portable object.
Apart from this, these conventional lodging devices, adapted to portable objects such as bags, are all meant to be provided in the associated portable objects during manufacture, which means they are difficult to retrofit to previously manufactured portable objects. Moreover, these conventional devices will deprive the portable object of part of its effective space. Further, in some types of portable objects, for example, a video camera, little space is available for mounting to the lodging device, which means it cannot be easily adapted to such a portable object.

Device for lodging a suspending strap for a portable object


An instruction generates a value for use in processing within a computing environment. The instruction obtains a sign control associated with the instruction, and shifts an input value of the instruction in a specified direction by a selected amount to provide a result. The result is placed in a first designated location in a register, and the sign, which is based on the sign control, is placed in a second designated location of the register. The result and the sign provide a signed value to be used in processing within the computing environment.

One or more aspects relate, in general, to processing within a computing environment, and in particular, to improving such processing.
Applications executing within a processor of a computing environment control the behavior of the processor. The applications are created using programming languages which are designed to communicate instructions to the processor.
There are various types of programming languages, and each language may use one or more types of encodings to represent data. For example, COBOL and PL/I programming languages use binary coded decimal (BCD) to encode decimal numbers. With BCD encodings, each decimal digit is represented by a fixed number of bits, such as 4 bits, in one example.
Decimal numbers may contain up to 31 digits, as well as a sign digit. This represents a 16-byte value in memory. Many computations are performed using small constants. To load a constant into a register, it is loaded from memory. Because of this, instruction latency is incurred, memory bandwidth is used, and data sizes within binary executables are increased.

This patent is subject to a terminal disclaimer.

INTERNATIONAL BUSINESS MACHINES CORPORATION


In one example, an electronic device may be configured to receive over a network a user selection of media information that corresponds to a media streaming server, wherein the received user selection corresponds to a first account of the media streaming server. The electronic device may be configured to determine a second account that corresponds to an electronic messaging server in response to receiving the user selection. The second account may be different than the first account. The electronic device may be configured to cause a message including at least a portion of the media information to be electronically delivered to the electronic messaging server using the second account.

A known streaming service may stream a media object, e.g., a movie, a television program, or the like, to a subscriber on demand. In the known streaming service, a media streaming server may have access to a plurality of media objects. The media streaming server may be coupled to subscriber equipment, e.g., a set-top box, a desktop computer, a gaming console, a mobile device, or the like. The subscriber equipment may be configured to indicate available media objects, and may be configured to enable a subscriber to select one of the available media objects using a user interface of the subscriber equipment. The subscriber equipment may be configured to upload, over a network, a message to the media streaming server in response to receiving a selection from the user interface. The media streaming server may stream a corresponding one of the media objects to the subscriber equipment in response to receiving the message.
In the known streaming service, subscribers may make a selection to receive a stream of a corresponding media object, but may not share media information, e.g., content of a received media stream or metadata for the received media stream, with other subscribers or endpoints.

Methods, devices, and mediums associated with manipulating social data from streaming services


A system including an adaptive code book and a fixed code book for code excited linear prediction coding of speech signals is provided. The invention includes an embedded adaptive code book in the fixed code book and the selection procedure for selecting excitation vector parameters. A code book update system updates the fixed code book with embedded adaptive code book based on the long term processing excitation vector parameters with previous synthesized excitation.

1. Field of the Invention
The present invention relates to code excited linear prediction of speech signals and more particularly to a fixed code book with an embedded adaptive code book.
2. Background of the Invention
Code excited linear prediction coders are used to generate human speech signals in bandwidth limited environments, using what is sometimes referred to as "analysis by synthesis." In particular, a code excited linear prediction coder uses a fixed code book excitation signal that relies on stored excitation vector parameter codes that are selected from a code book, and adaptive code book excitation vectors parameters that are representative of long-term processing. The adaptive code book typically contains candidate vectors constructed from past synthesized excitation which are available in the decoder. The number of the candidates in the adaptive code book is usually much smaller than the number in the fixed code book, and the adaptive code book is continually updated based on past excitation vector parameters.
Although such fixed and adaptive excitation code books provide acceptable speech encoding in most cases, when a significant difference in the spectrum or pitch lag of the voice signal occurs, long term processing through the use of adaptive code book entries can occasionally fail. Although a switch to traditional long term processing can be made when long term processing in a CELP coder fails, the switching can cause the algorithm to be less robust to bit errors, such that noticeable speech errors are generated. When the pitch lag is coded in a differential way to save the bit rate, even the traditional long term prediction could fail.

Fixed code book with embedded adaptive code book


A method of configuring a transfer of an image of a patterning device pattern onto a substrate with a lithographic apparatus. The method includes determining an intermediate illumination arrangement parameter and an intermediate patterning device parameter by varying an initial illumination arrangement parameter and an initial patterning device parameter using a calibrated model until the calculated image of the pattern printed on the substrate is within predetermined specification; calculating a metric that represents a lithographic response of the printed pattern over a process range, where the pattern would be imaged with the intermediate illumination arrangement and patterning device parameters over the process range, and depending on a result of the metric, adjusting the initial patterning device and illumination arrangement parameters.

1. Field of the Invention
The present invention relates to a method for optimizing illumination in a lithographic apparatus. More specifically, the invention relates to a method for optimizing illumination using computer simulation.
2. Description of the Related Art
The term "patterning structure" as here employed should be broadly interpreted as referring to a device that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate. The term "light valve" can also be used in this context. Generally, the pattern will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit or other device. An example of such a patterning structure is a mask. The concept of a mask is well known in lithography, and it includes mask types such as binary, alternating phase shift, and attenuated phase shift, as well as various hybrid mask types. Placement of such a mask in the radiation beam causes selective transmission (in the case of a transmissive mask) or reflection (in the case of a reflective mask) of the radiation impinging on the mask, according to the pattern on the mask. In the case of a mask, the support structure will generally be a mask table, which ensures that the mask can be held at a desired position in the incoming radiation beam, and that it can be moved relative to the beam if so desired.
Another example of a patterning structure is a programmable mirror array. One example of such an array is a matrix-addressable surface having a viscoelastic control layer and a reflective surface. The basic principle behind such an apparatus is that, for example, addressed areas of the reflective surface reflect incident light as diffracted light, whereas unaddressed areas reflect incident light as undiffracted light. Using an appropriate filter, the undiffracted light can be filtered out of the reflected beam, leaving only the diffracted light behind. In this manner, the beam becomes patterned according to the addressing pattern of the matrix addressable surface. An alternative embodiment of a programmable mirror array employs a matrix arrangement of tiny mirrors, each of which can be individually tilted about an axis by applying a suitable localized electric field, or by employing piezoelectric actuators. Once again, the mirrors are matrix addressable, such that addressed mirrors will reflect an incoming radiation beam in a different direction to unaddressed mirrors. In this manner, the reflected beam is patterned according to the addressing pattern of the matrix-addressable mirrors. The required matrix addressing can be performed using suitable electronics. In both of the situations described hereabove, the patterning structure can include one or more programmable mirror arrays. More information on mirror arrays as here referred to can be seen, for example, from U.S. Pat. Nos. 5,296,891 and 5,523,193, and PCT Publication Nos. WO 98/38597 and WO 98/33096. In the case of a programmable mirror array, the support structure may be embodied as a frame or table, for example, which may be fixed or movable as required.
Another example of a patterning structure is a programmable LCD array. An example of such a construction is given in U.S. Pat. No. 5,229,872. As above, the support structure in this case may be embodied as a frame or table, for example, which may be fixed or movable as required.
For purposes of simplicity, the rest of this text may, at certain locations, specifically direct itself to examples involving a mask and mask table. However, the general principles discussed in such instances should be seen in the broader context of the patterning structure as hereabove set forth.
Lithographic projection apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, the patterning structure may generate a circuit pattern corresponding to an individual layer of the IC, and this pattern can be imaged onto a target portion (e.g., including one or more dies on a substrate (silicon wafer) that has been coated with a layer of radiation sensitive material (resist). In general, a single wafer will contain a whole network of adjacent target portions that are successively irradiated via the projection system, one at a time. In current apparatuses, employing patterning by a mask on a mask table, a distinction can be made between two different types of machines. In one type of lithographic projection apparatus, each target portion is irradiated by exposing the entire mask pattern onto the target portion at once. Such an apparatus is commonly referred to as a wafer stepper. In an alternative apparatus, commonly referred to as a step and scan apparatus, each target portion is irradiated by progressively scanning the mask pattern under the projection beam in a given reference direction (the "scanning" direction) while synchronously scanning the substrate table parallel or anti-parallel to this direction. Since, in general, the projection system will have a magnification factor M (generally<1), the speed V at which the substrate table is scanned will be a factor M times that at which the mask table is scanned. More information with regard to lithographic devices as here described can be seen, for example, from U.S. Pat. No. 6,046,792.
In a known manufacturing process using a lithographic projection apparatus, a
pattern (e.g. in a mask) is imaged onto a substrate that is at least partially covered by a layer of radiation sensitive material (resist). Prior to this imaging, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures, such as a post-exposure bake (PEB), development, a hard bake and measurement and/or inspection of the imaged features. This array of procedures is used as a basis to pattern an individual layer of a device, e.g., an IC. Such a patterned layer may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemical, mechanical polishing, etc., all intended to finish off an individual layer. If several layers are required, then the whole procedure, or a variant thereof, will have to be repeated for each new layer. It is important to ensure that the overlay (juxtaposition) of the various stacked layers is as accurate as possible. For this purpose, a small reference mark is provided at one or more positions on the wafer, thus defining the origin of a coordinate system on the wafer. Using optical and electronic devices in combination with the substrate holder positioning device (referred to hereinafter as "alignment system"), this mark can then be relocated each time a new layer has to be juxtaposed on an existing layer, and can be used as an alignment reference. Eventually, an array of devices will be present on the substrate (wafer). These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc. Further information regarding such processes can be obtained, for example, from the book "Microchip Fabrication: A Practical Guide to Semiconductor Processing," Third Edition, by Peter van Zant, McGraw Hill Publishing Co., 1997, ISBN 0-07-067250-4.
For the sake of simplicity, the projection system may hereinafter be referred to as the "lens." However, this term should be broadly interpreted as encompassing various types of projection systems, including refractive optics, reflective optics, and catadioptric systems, for example. The radiation system may also include components operating according to any of these design types for directing, shaping or controlling the projection beam of radiation, and such components may also be referred to below, collectively or singularly, as a "lens." Further, the lithographic apparatus may be of a type having two or more substrate tables (and/or two or more mask tables). In such "multiple stage" devices the additional tables may be used in parallel or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposures. Dual stage lithographic apparatuses are described, for example, in U.S. Pat. Nos. 5,969,441 and 6,262,796.
Photolithography is widely recognized as one of the key steps in the manufacturing of integrated semiconductor circuits. At present, no alternative technology provides the desired pattern architecture with similar accuracy, speed, and economic productivity. However, as the dimensions of the ICs become smaller, photolithography is becoming one of the most, if not the most, critical gating factors for enabling miniature semiconductor device structures to be manufactured on a truly massive scale.
A theoretical estimate of the limits of pattern printing can be given by the Rayleigh criterion for resolution R as shown in equation (1):
                    R        =                              k            1                    *                      λ            NA                                              (        1        )
where λ is the wavelength of the radiation used, NA is the numerical aperture of the lens in the projection system and k1 is a process dependent adjustment factor.
It follows from equation (1) that the resolution can be improved in three ways: by shortening the exposure wavelength λ, by increasing the numerical aperture NA or by decreasing the value of k1. All of these strategies have been pursued simultaneously in the past and are expected to continue in the future.
The performance of the lithographic apparatus and its limitation may also be explained and characterized with the Depth Of Focus (DOF), which is generally viewed as one of the most critical factors in determining the resolution of the lithographic projection apparatus. The DOF, defined in equation (2), is defined as the distance along the optical axis over which the image of the pattern is adequately sharp.
                    DOF        =                              +                          /                              -                                  k                  2                                                              *                      λ                          NA              2                                                          (        2        )
where k2 is an empirical constant.
Additional important responses/measures that provide more insight into the real difficulties associated with photolithography at the resolution limit include the Exposure Latitude (EL), the Dense Isolated Bias (DIB), and the Mask Error Enhancement Factor (MEEF). The Exposure Latitude describes the percentage dose range where the printed pattern's critical dimension (CD) is acceptable, typically 10%. It is used along with the DOF to determine the process window, i.e. the regions of focus and exposure that keep the final resist profile within prescribed specifications. As for the DIB, it is a measure of the size difference between similar features, depending on the pattern density. Finally, the MEEF describes how reticle CD errors are transmitted into wafer CD errors.
As the semiconductor industry moves into the deep submicron regime, the resolution limit of currently available lithographic techniques is being reached due to a decrease in the depth of focus, difficulty in the design of lenses and complexities in the lens fabrication technology. In order to address this issue, there have been continued endeavors to develop resolution enhancement techniques.
Historically, the resolution limit of a lithographic projection tool was optimized by the control of the relative size of the illumination system numerical aperture (NA). Control of this NA with respect to the projection system's objective lens NA allows for modification of spatial coherence at the mask plane, commonly referred to as partial coherence σ. This is accomplished through specification of the condenser lens pupil in a Köhler illumination system. Essentially, this allows for manipulation of the optical processing of diffraction information. Optimization of the partial coherence of a projection imaging system is conventionally accomplished using full circular illuminator apertures. By controlling the distribution of diffraction information in the objective lens with the illuminator pupil size, maximum image modulation can be obtained. Illumination systems can be further refined by considering variations to full circular illumination apertures. A system where illumination is obliquely incident on the mask at an angle so that the zero-th and first diffraction orders are distributed on alternative sides of the optical axis may allow for improvements. Such an approach is generally referred to as off-axis illumination.
Off-axis illumination improves resolution by illuminating the mask with radiation that is at an angle to the optical axis of the lens. The incidence of the radiation on the mask, which acts as a diffraction grating, improves the contrast of the image by transmitting more of the diffracted orders through the lens. Off-axis illumination techniques used with conventional masks produce resolution enhancement effects similar to resolution enhancement effects obtained with phase shifting masks.
Various other enhancement techniques that have been developed to increase the resolution and the DOF include optical proximity correction (OPC) of optical proximity errors (OPE), phase shifting masks (PSM), and sub-resolution assist features (SRAF). Each technique may be used alone, or in combination with other techniques to enhance the resolution of the lithographic projection tool.
One approach to generate off-axis illumination is to incorporate a metal aperture plate filter into the fly eye lens assembly of the projection system illuminator providing oblique illumination. A pattern on such a metal plate would have four symmetrically arranged openings (zones) with sizing and spacing set to allow diffraction order overlap for specific geometry sizing and duty ratio on the photomask. Such an approach results in a significant loss in intensity available to the mask, lowering throughput and making the approach less than desirable. Additionally, the four circular openings need to be designed specifically for certain mask geometry and pitch and do not improve the performance of other geometry sizes and spacings. The previous work in this area describes such a method using either two or four openings in the aperture plate. See, for example, EP 0 500 393, U.S. Pat. Nos. 5,305,054, 5,673,103, 5,638,211, EP 0 496 891 and EP 0 486 316.
Another approach to off-axis illumination using the four-zone configuration, which is disclosed in U.S. Pat. No. 6,452,662 is to divide the illumination field of the projection system into beams that can be shaped to distribute off-axis illumination to the photomask. By incorporating the ability to shape off-axis illumination, throughput and flexibility of the exposure source is maintained. Additionally, this approach allows for illumination that combines off-axis and on-axis (conventional) characteristics. By doing so, the improvement to dense features that are targeted with off-axis illumination is less significant than straight off-axis illumination. The performance of less dense features, however, is more optimal because of the more preferred on-axis illumination for these features. The result is a reduction in the optical proximity effect between dense and isolated features. Optimization is less dependent on feature geometry and more universal illumination conditions can be selected.
Referring to FIGS. 2–5, currently available illumination intensity distributions or arrangements include small, or low, sigma (FIG. 2), annular (FIG. 3), quadrupole (FIG. 4), and quasar (FIG. 5), with the illuminated areas (hereinafter referred to as the aperture(s)) shown in cross section. The annular, quadrupole and quasar illumination techniques of FIGS. 3–5 are examples of off-axis illumination schemes.
Small sigma illumination is incident on the mask with approximately zero illumination angle (i.e., almost perpendicular to the mask) and produces good results with phase shifting masks to improve resolution and increase the depth of focus. Annular illumination is incident on the mask at angles that are circularly symmetrical and improves resolution and increases depth of focus while being less pattern dependent than other illumination schemes. Quadrupole and quasar illumination are incident on the mask with four main angles and provide improved resolution and increased depth of focus while being strongly pattern dependent.
Referring to FIGS. 6 and 7, two illumination systems are schematically illustrated. The systems illustrated in FIGS. 6 and 7 include light collecting/collimating optics 10; an axicon/zoom module 12; and light integrating and projecting optics 14. The illumination systems define an optical axis 16, a pupil plane 18, and a mask plane 20. The axicon/zoom module 12 comprises a pair of axicons 22, one concave and one convex, whose separation can be varied. The module 12 also comprises a zoom lens 24.
For the case of conical axicons, some examples of the illumination intensity distributions achievable at the pupil plane 18 are shown in FIG. 8. The spot size can be varied between states A and B by changing the zoom lens position. Similarly, the annularity can be changed between states A and C by varying the axicon opening (separation between the axicons).
To improve the illumination homogeneity, an optical integrator 26 is used. In FIG. 6 the optical integrator takes the form of a light pipe 26, such as a glass, calcium fluoride or quartz rod. A coupler 28 couples the illumination at the pupil plane 18 into the rod 26, and rod exit imaging optics 30 are also provided. In FIG. 7 a fly's eye element 32 acts as the integrator. The fly's eye element 32 is a composite lens comprising an array or honeycomb of small lenses. Further, objective lenses 34 and 36 complete the projection optics.
It results from the foregoing discussion that numerous options are available to the process engineer for increasing the resolution of the lithographic projection apparatus and for maximizing the process window. Yet, given the cost and time to perform experiments in a semiconductor fabrication facility (fab), the approach that would consist of testing these options across the board to develop a robust process is simply unrealistic. As the product cycle times in the semiconductor field are relatively short, severe limitations are put on the amount of time that can be spent on research and development for each new product line or manufacturing process.
In response to this concern, there has been a growing interest in photolithographic simulations within the industry. Given the fact that a simulation experiment for optimizing the optical proximity correction features for a new mask test may only take one day, instead of months with experiments on wafers, simulations are viewed today as a useful tool to aid in the development and optimization of lithographic apparatuses.
It follows that simulations can be extremely helpful as a development tool, by quickly evaluating options, optimizing processes, and saving time and money by reducing the number of required experiments. Simulations can also aid in the research context to understand many physical phenomena that occur when pushing the limits of resolution to achieve feature size in the order of or below the wavelength of the lithographic apparatus. Finally, simulations can be a tremendous tool to extend the optical lithography to the sub-150 nm regime and to prolong the lifetimes of million dollar steppers and billion dollar fabs.

Lithographic apparatus and method for optimizing illumination using a photolithographic simulation


A CPR backboard is provided with a pair of straps disposed on opposite ends of the backboard, the straps being attached to hooks attachable to a bed frame. The straps are provided with adjustable self-locking buckles. In use, a mattress is placed between the backboard and a bed frame with the opposed hooks hooking opposite sides of the bed frame with the mattress disposed therebetween. The straps are adjustable to compress the mattress between the backboard and the bed frame with the self-locking buckle maintaining the straps at a preselected compressing position thereby providing for a firm surface on which chest compressions can be performed upon a patient.

This invention relates to a CPR backboard and particularly to a CPR backboard mounted onto a mattress and bed frame.
In a hospital setting when external chest compressions, or CPR, is performed, a patient is generally placed onto a backboard made of wood, plastic or other material, the backboard being placed upon a mattress in a position to receive the back of the patient. The backboard is approximately the width of a bed in a longitudinal direction and wide enough to receive the entire back of a patient in a latitudinal direction. The backboard provides a relatively firm surface for performing chest compressions. However, even though the backboard provides a firmer surface than a mattress alone, there is still considerable bounce in the patient due to the compressing and expansion of the mattress as the chest compressions are being performed.


A highway system for vehicular traffic which includes an intersection between a main road and a secondary road, each having two traffic directions separated by a center line. The main road has a barrier along its main section for preventing direct crossing by traffic from the second road, and bypasses for each traffic direction. It further has barriers for directing traffic into the bypasses. A further barrier defines a return stretch of the bypass, the return stretch not having a barrier and being such as to permit merging of the two opposite directions of the main road traffic.

1. Field of the Invention
The present invention relates to a vehicle highway system, and particularly to one having single-level intersections capable of uninterrupted traffic flow.
2. Description of Related Art
Highway systems which include intersections of a major road with secondary roads generally include either a stop sign or a traffic signal light in order to permit the traffic on the secondary road to cross the main road. If the traffic on the main road is relatively heavy, the danger of an accident occurring when a vehicle on the secondary road attempts to cross the main road generally requires that a traffic control signal be provided at the intersection, but such a signal seriously interrupts the continuous flow of the traffic on the main road. In many cases, this problem is answered by building overpasses or underpasses to permit the traffic on the secondary roads to cross the main road without interrupting the main road traffic, but such overpass and underpass constructions are relatively expensive.

Vehicle highway system having single-level uninterrupted traffic-flow intersection


An apparatus employing control words to present a synthesized output signal having an output frequency and a delay with respect to an input signal includes: (a) A multiplexer receiving the input signal and having an output and an address input. (b) An output unit generates the output signal in response to a drive signal from the multiplexer. (c) A first register coupled with the multiplexer output. (d) A second register coupled with the multiplexer and the first register. The first register responds to a multiplexer output signal to provide a first control signal to the second register based upon the control words. The second register responds to the multiplexer output signal to provide a second control signal to the address input based upon the first control signal and the control words. The multiplexer presents the drive signal in response to the second control signal.

One example of frequency synthesizer is known as a "Flying Adder" frequency synthesis architecture. The architecture is described in "An Architecture of High Performance Frequency and Phase Synthesis", by Hugh Mair and Liming Xiu; IEEE Journal of Solid-State Circuits, Vol. 35, No. 6, June 2000. Mair and Xiu describe a voltage controlled oscillator (VCO) presenting a VCO input reference signal having thirty-two phases as an input signal to a multiplexer device.
Referring preliminarily to FIG. 1 (which is described below in greater detail), a frequency synthesis section includes a frequency synthesizer multiplexer device that selects one of the thirty-two phases of the VCO input reference signal to present a drive signal VMUX to trigger a toggle flip-flop and generate a frequency output signal CLK having a rising edge and a falling edge. A control word FREQ (a digital word) determines the time (i.e., the number of phases) that should elapse between two adjacent selections of address by the frequency synthesizer multiplexer device. A frequency synthesis register provides and memorizes the extant selection address of the frequency synthesizer multiplexer device. Drive signal VMUX is applied as a clocking signal for the frequency synthesis register. The next subsequent frequency synthesizer multiplexer selection address stored in the frequency synthesis register is the sum of the extant selection address and the control word FREQ.
Additionally, the multiple VCO phases may be programmed to obtain a delay with respect to the input reference signal using a delay synthesis section that includes a delay synthesizer multiplexer device that selects one of the thirty-two phases of the VCO input reference signal to present a drive signal VMUX-D to trigger a toggle flip-flop and generate a delay output signal CLK-D. A control word DELAY (also a digital word) determines the incremental value (i.e., the number of phases) to be added to the frequency synthesizer multiplexer selection address. A delay synthesis register provides and memorizes the extant selection address (frequency address plus the delay shift) for the delay synthesizer multiplexer device. Drive signal VMUX-D is applied as a clocking signal for the delay synthesis register.
A result is that both the drive signals VMUX, VMUX-D have the same frequency that is determined by control word FREQ. However, the rising edge of drive signal VMUX-D is determined by control word DELAY and may therefore differ from the rising edge of drive signal VMUX. If drive signal VMUX (which is always earlier than VMUX-D), is offset with respect to drive signal VMUX-D by an amount less than computation time of the adder summing the two inputs (extant address in the frequency synthesizer multiplexer device and control word DELAY), a timing violation may be produced that will render the apparatus inoperative.
The requirement for using two multiplexing devices and the disparately timed clocking signals for the frequency synthesis register and the delay synthesis register contribute to disadvantages for signal synthesis apparatuses of the type represented in FIG. 1. Among the disadvantages are high part count and consequent large die area required for implementing the circuitry. A further disadvantage is the possible timing violation that may occur because of the disparately timed clocking signals used for the frequency synthesis register and the delay synthesis register.


A flexible screen module includes: a flexible screen, a camera component, and a driving component; wherein the flexible screen includes a first display area and a second display area, and the second display area comprises a sub-area, the camera component is provided in the sub-area of the second display area, and the driving component is configured to drive the flexible screen and the camera component to move synchronously to enable the second display area to be switched between a first position and a second position.

With the generation update of terminal devices, full screen is becoming an important development trend, but there are still many factors restricting the development of full screen. Taking a mobile phone as an example, components such as a front camera, a receiver and a sensor that occupy the area of the screen are usually integrated on the front side of the mobile phone. With the development of electronic technology, the influence from components such as the receiver and the sensor can be avoided by miniaturization or use of under-screen technology. However, in order to guarantee the imaging effect, it may be difficult to reduce the size of the front camera.

Flexible screen module, terminal device and photographing method

Beijing Xiaomi Mobile Software Co., Ltd.


An easy chair device has a leg frame, and a chair main body disposed on the leg frame. Two backrest support rods and two armrest support rods extend upward from the leg frame. The chair main body has a backrest, a seat, and two armrests. The armrests are supported by the armrest support rods and the backrest support rods. A back band is disposed on a back of the backrest. Two fasteners are disposed on two ends of the back band. Two fastening bands are disposed on the armrests to engage with the back band.

The present invention relates to an easy chair device. More particularly, the present invention relates to an easy chair device which has a back band engaging with two fastening bands to fit a waist of a user.
A conventional easy chair does not have a back band to be adjusted in order to adjust a backrest according to a waist of a user. Therefore, a user will feel uncomfortable while the user sits on the conventional easy chair.
An object of the present invention is to provide an easy chair device which has a back band and two fastening bands to be adjusted in order to adjust a backrest according to a waist of a user.
Accordingly, an easy chair device comprises a leg frame, and a chair main body disposed on the leg frame. Two backrest support rods extend upward from the leg frame. Two armrest support rods extend upward from the leg frame. The chair main body has a backrest, a seat connected to the backrest, and two armrests. Two rear positioning mounts enclose the backrest support rods. Two front positioning mounts enclose the armrest support rods. The seat is supported by the rear positioning mounts and the front positioning mounts. The armrests are supported by the armrest support rods and the backrest support rods. A back band is disposed on a back of the backrest. Two fasteners are disposed on two ends of the back band. Two fastening bands are disposed on the armrests to engage with the back band.

3F, No. 8, Lone 295, Sec. 1, Fu Sing Nan Rd.


Implementations of the present disclosure provide computer-implemented methods for predicting a performance of a consolidated virtualized computing environment. Methods include processing benchmark workloads using a plurality of virtual machines to generate a plurality of traces, each trace including data corresponding to requests issued by a respective virtual machine operating in an isolated environment, storing the plurality of traces in one or more trace repositories, each trace repository provided as a computer-readable storage medium, selecting a trace from the plurality of traces stored in the one or more trace repositories, parameterizing a queuing model based on the trace, the queuing model representing request queuing in the consolidated virtualized computing environment, and processing the queuing model using one or more processors to generate one or more response time estimates for the consolidated virtualized computing environment.

The performance of input/output (I/O) bound applications is frequently dominated by the time required by the operating system to schedule read and write operations and by the response times of the storage devices in completing such operations. Changes in workload, as well as in the software and hardware environments, can affect the latency of disk I/O requests. Consequently, it is useful to define performance models to anticipate the effects of a change. This can be especially important in virtualized data centers, where the concurrent shared use of a storage device by several Virtual Machines (VMs) managed by a Virtual Machine Monitor (VMM) can lead to significant performance degradation.
In such systems, estimates of I/O contention for a given VM placement configuration can aid management and consolidation decisions. However, modeling the performance of disk requests can be challenging due to the joint interaction of the I/O flows issued by several VMs and because of the complexity of caching mechanisms, scheduling algorithms, device drivers, and communication protocols employed by both the VMs and the VMM.

Predicting performance of a consolidated virtualized computing environment


The present invention provides for methods of treating cardiovascular diseases in a mammal. The methods include a step of administering an effective amount of a botulinum toxin directly to a blood vessel of a mammal thereby treating a cardiovascular disease.

The present invention relates to methods of preventing or reducing restenosis that may occur in blood vessels after mechanically expanding the diameter of an occluded blood vessel.
Atherosclerosis is a progressive disease wherein fatty, fibrous, calcific, or thrombotic deposits produce atheromatous plaques, within and beneath the intima which is the innermost layer of arteries. Atherosclerosis tends to involve large and medium sized arteries. The most commonly affected are the aorta, iliac, femoral, coronary, and cerebral arteries. Clinical symptoms occur because the mass of the atherosclerotic plaque reduces blood flow through the afflicted artery, thereby compromising tissue or organ function distal to it.
Percutaneous transluminal coronary angioplasty is a non-surgical method for treatment of coronary atherosclerosis. In this procedure, an inflatable balloon is inserted in a coronary artery in the region of arterial narrowing. Inflation of the balloon for 15–30 seconds results in an expansion of the narrowed lumen or passageway. Because residual narrowing is usually present after the first balloon inflation, multiple or prolonged inflations are routinely performed to reduce the severity of the residual tube narrowing.
Stents are often used in combination with coronary balloon angioplasty. Typically, a stent is used to brace the blood vessel open after an initial expansion of the narrowed blood vessel by a balloon. Self expanding stents are also used to expand and hold open occluded blood vessels. Various stents and their use are disclosed in U.S. Pat. Nos. 6,190,404; 6,344,055; 6,306,162; 6,293,959; 6,270,521; 6,264,671; 6,261,318; 6,241,758; 6,217,608; 6,196,230; 6,183,506; 5,989,280. The disclosure of each of these patents is incorporated in its entirety herein by reference.
One problem with angioplasty is that following the procedure restenosis, or recurrence of the obstruction, may occur. Tears in the wall expose blood to foreign material and proteins, such as collagen, which are highly thrombogenic. Resulting clots can contain growth hormones which may be released by platelets within the clot. Additionally, thrombosis may cause release of growth hormones and cytokines by cells from macrophages. Growth hormones may cause smooth muscle cells and fibroblasts to aggregate in the region and multiply. Further, following angioplasty there is often a loss of the single layer of cells that normally covers the internal surface of blood vessels which leads to thrombosis. The combination of tearing of the blood vessel wall and the loss of the endothelial layer often generates an internal blood vessel surface which is quite thrombogenic. Restenosis may result from the proliferation of smooth muscle cells, which normally reside within the arterial wall, in the area of the injury in response to the thrombosis.
Angioplasty procedures also produce injuries in the arterial wall which become associated with inflammation. Any kind of inflammatory response may cause growth of new tissue, for example, scar tissue, which may contribute to restenosis.
One of the other major causes of restenosis following angioplasty may be that the injured arterial wall may exhibit a reduced hemocompatability compared to that associated with a normal arterial wall. Adverse responses which are associated with reduced hemocompatability include platelet adhesion, aggregation, and activation; thrombosis; inflammatory cell reactions such as adhesion and activation of monocytes or macrophages; and the infiltration of leukocytes into the arterial wall.
Restenosis is a serious problem that may occur in over one third of all coronary angioplasty patients. Therefore, there exists a need for methods to reduce or eliminate the occurrence of restenosis which may follow procedures to mechanically expand an occluded blood vessel.
Botulinum Toxin
The anaerobic, Gram positive bacterium Clostridium botulinum produces a potent polypeptide neurotoxin, botulinum toxin, which causes a neuroparalytic illness in humans and animals referred to as botulism. The spores of Clostridium botulinum are found in soil and can grow in improperly sterilized and sealed food containers of home based canneries, which are the cause of many of the cases of botulism. The effects of botulism typically appear 18 to 36 hours after eating the foodstuffs infected with a Clostridium botulinum culture or spores. The botulinum toxin can apparently pass unattenuated through the lining of the gut and attack peripheral motor neurons. Symptoms of botulinum toxin intoxication can progress from difficulty walking, swallowing, and speaking to paralysis of the respiratory muscles and death.
Botulinum toxin type A ("BoNT/A") is the most lethal natural biological agent known to man. About 50 picograms of botulinum toxin (purified neurotoxin complex) serotype A is a LD50 in mice. One unit (U) of botulinum toxin is defined as the LD50 upon intraperitoneal injection into female Swiss Webster mice weighing 18–20 grams each. Seven immunologically distinct botulinum neurotoxins have been characterized, these being respectively botulinum neurotoxin serotypes A, B, C1, D, E, F and G each of which is distinguished by neutralization with serotype-specific antibodies. The different serotypes of botulinum toxin vary in the animal species that they affect and in the severity and duration of the paralysis they evoke. For example, it has been determined that BoNt/A is 500 times more potent, as measured by the rate of paralysis produced in the rat, than is botulinum toxin serotype B (BoNT/B). Additionally, botulinum toxin type B ("BoNt/B") has been determined to be non-toxic in primates at a dose of 480 U/kg which is about 12 times the primate LD50 for BoNt/A. botulinum toxin apparently binds with high affinity to cholinergic motor neurons, is translocated into the neuron and blocks the release of acetylcholine.
Botulinum toxins have been used in clinical settings for the treatment of neuromuscular disorders characterized by hyperactive skeletal muscles. BoNt/A has been approved by the U.S. Food and Drug Administration for the treatment of blepharospasm, strabismus, hemifacial spasm and cervical dystonia. Additionally, a botulinum toxin type B has been approved by the FDA for the treatment of cervical dystonia. Non-serotype A botulinum toxin serotypes apparently have a lower potency and/or a shorter duration of activity as compared to BoNt/A. Clinical effects of peripheral intramuscular BoNt/A are usually seen within one week of injection. The typical duration of symptomatic relief from a single intramuscular injection of BoNt/A averages about three months.
Although all the botulinum toxins serotypes apparently inhibit release of the neurotransmitter acetylcholine at the neuromuscular junction, they do so by affecting different neurosecretory proteins and/or cleaving these proteins at different sites. For example, botulinum serotypes A and E both cleave the 25 kiloDalton (kD) synaptosomal associated protein (SNAP-25), but they target different amino acid sequences within this protein. BoNT/B, D, F and G act on vesicle-associated protein (VAMP, also called synaptobrevin), with each serotype cleaving the protein at a different site. Finally, botulinum toxin serotype C1 (BoNT/C1) has been shown to cleave both syntaxin and SNAP-25. These differences in mechanism of action may affect the relative potency and/or duration of action of the various botulinum toxin serotypes.
Regardless of serotype, the molecular mechanism of toxin intoxication appears to be similar and to involve at least three steps or stages. In the first step of the process, the toxin binds to the presynaptic membrane of the target neuron through a specific interaction between the H chain and a cell surface receptor; the receptor is thought to be different for each serotype of botulinum toxin and for tetanus toxin. The carboxyl end segment of the H chain, Hc, appears to be important for targeting of the toxin to the cell surface.
In the second step, the toxin crosses the plasma membrane of the poisoned cell. The toxin is first engulfed by the cell through receptor-mediated endocytosis, and an endosome containing the toxin is formed. The toxin then escapes the endosome into the cytoplasm of the cell. This last step is thought to be mediated by the amino end segment of the H chain, HN, which triggers a conformational change of the toxin in response to a pH of about 5.5 or lower. Endosomes are known to possess a proton pump which decreases intra endosomal pH. The conformational shift exposes hydrophobic residues in the toxin, which permits the toxin to embed itself in the endosomal membrane. The toxin then translocates through the endosomal membrane into the cytosol.
The last step of the mechanism of botulinum toxin activity appears to involve reduction of the disulfide bond joining the H and L chain. The entire toxic activity of botulinum and tetanus toxins is contained in the L chain of the holotoxin; the L chain is a zinc (Zn++) endopeptidase which selectively cleaves proteins essential for recognition and docking of neurotransmitter-containing vesicles with the cytoplasmic surface of the plasma membrane, and fusion of the vesicles with the plasma membrane. Tetanus neurotoxin, botulinum toxin/B/D,/F, and /G cause degradation of synaptobrevin (also called vesicle-associated membrane protein (VAMP)), a synaptosomal membrane protein. Most of the VAMP present at the cytosolic surface of the synaptic vesicle is removed as a result of any one of these cleavage events. Each toxin specifically cleaves a different bond.
The molecular weight of the botulinum toxin protein molecule, for all seven of the known botulinum toxin serotypes, is about 150 kD. Interestingly, the botulinum toxins are released by Clostridial bacterium as complexes comprising the 150 kD botulinum toxin protein molecule along with associated non-toxin proteins. Thus, the BoNt/A complex can be produced by Clostridial bacterium as 900 kD, 500 kD and 300 kD forms. BoNT/B and C1 are apparently produced as only a 500 kD complex. BoNT/D is produced as both 300 kD and 500 kD complexes. Finally, BoNT/E and F are produced as only approximately 300 kD complexes. The complexes (i.e. molecular weight greater than about 150 kD) are believed to contain a non-toxin hemaglutinin protein and a non-toxin and non-toxic nonhemaglutinin protein. These two non-toxin proteins (which along with the botulinum toxin molecule comprise the relevant neurotoxin complex) may act to provide stability against denaturation to the botulinum toxin molecule and protection against digestive acids when toxin is ingested. Additionally, it is possible that the larger (greater than about 150 kD molecular weight) botulinum toxin complexes may result in a slower rate of diffusion of the botulinum toxin away from a site of intramuscular injection of a botulinum toxin complex.
In vitro studies have indicated that botulinum toxin inhibits potassium cation induced release of both acetylcholine and norepinephrine from primary cell cultures of brainstem tissue. Additionally, it has been reported that botulinum toxin inhibits the evoked release of both glycine and glutamate in primary cultures of spinal cord neurons and that in brain synaptosome preparations botulinum toxin inhibits the release of each of the neurotransmitters acetylcholine, dopamine, norepinephrine, CGRP and glutamate.
BoNt/A can be obtained by establishing and growing cultures of Clostridium botulinum in a fermenter and then harvesting and purifying the fermented mixture in accordance with known procedures. All the botulinum toxin serotypes are initially synthesized as inactive single chain proteins which must be cleaved or nicked by proteases to become neuroactive. The bacterial strains that make botulinum toxin serotypes A and G possess endogenous proteases and serotypes A and G can therefore be recovered from bacterial cultures in predominantly their active form. In contrast, botulinum toxin serotypes C1, D and E are synthesized by nonproteolytic strains and are therefore typically unactivated when recovered from culture. Serotypes B and F are produced by both proteolytic and nonproteolytic strains and therefore can be recovered in either the active or inactive form. However, even the proteolytic strains that produce, for example, the BoNt/B serotype only cleave a portion of the toxin produced. The exact proportion of nicked to unnicked molecules depends on the length of incubation and the temperature of the culture. Therefore, a certain percentage of any preparation of, for example, the BoNt/B toxin is likely to be inactive, possibly accounting for the known significantly lower potency of BoNt/B as compared to BoNt/A. The presence of inactive botulinum toxin molecules in a clinical preparation will contribute to the overall protein load of the preparation, which has been linked to increased antigenicity, without contributing to its clinical efficacy. Additionally, it is known that BoNt/B has, upon intramuscular injection, a shorter duration of activity and is also less potent than BoNt/A at the same dose level.
It has been reported (as exemplary examples) that BoNt/A has been used clinically as follows:                (1) about 75–125 units of BOTOX®1 per intramuscular injection (multiple muscles) to treat cervical dystonia;        (2) 5–10 units of BOTOX® per intramuscular injection to treat glabellar lines (brow furrows) (5 units injected intramuscularly into the procerus muscle and 10 units injected intramuscularly into each corrugator supercilii muscle);        (3) about 30–80 units of BOTOX® to treat constipation by intrasphincter injection of the puborectalis muscle;        (4) about 1–5 units per muscle of intramuscularly injected BOTOX® to treat blepharospasm by injecting the lateral pre-tarsal orbicularis oculi muscle of the upper lid and the lateral pre-tarsal orbicularis oculi of the lower lid.        (5) to treat strabismus, extraocular muscles have been injected intramuscularly with between about 1–5 units of BOTOXO®, the amount injected varying based upon both the size of the muscle to be injected and the extent of muscle paralysis desired (i.e. amount of diopter correction desired).        (6) to treat upper limb spasticity following stroke by intramuscular injections of BOTOX® into five different upper limb flexor muscles, as follows:                    (a) flexor digitorum profundus: 7.5 U to 30 U            (b) flexor digitorum sublimus: 7.5 U to 30 U            (c) flexor carpi ulnaris: 10 U to 40 U            (d) flexor carpi radialis: 15 U to 60 U            (e) biceps brachii: 50 U to 200 U. Each of the five indicated muscles has been injected at the same treatment session, so that the patient receives from 90 U to 360 U of upper limb flexor muscle BOTOX® by intramuscular injection at each treatment session.
The tetanus neurotoxin acts mainly in the central nervous system, while botulinum neurotoxin acts at the neuromuscular junction; both act by inhibiting acetylcholine release from the axon of the affected neuron into the synapse, resulting in paralysis. The effect of intoxication on the affected neuron is long-lasting and until recently has been thought to be irreversible. The tetanus neurotoxin is known to exist in one immunologically distinct serotype.
Acetylcholine
Typically only a single type of small molecule neurotransmitter is released by each type of neuron in the mammalian nervous system. The neurotransmitter acetylcholine is secreted by neurons in many areas of the brain, but specifically by the large pyramidal cells of the motor cortex, by several different neurons in the basal ganglia, by the motor neurons that innervate the skeletal muscles, by the preganglionic neurons of the autonomic nervous system (both sympathetic and parasympathetic), by the postganglionic neurons of the parasympathetic nervous system, and by some of the postganglionic neurons of the sympathetic nervous system. Essentially, only the postganglionic sympathetic nerve fibers to the sweat glands, the piloerector muscles and a few blood vessels are cholinergic and most of the postganglionic neurons of the sympathetic nervous system secret the neurotransmitter norepinephine. In most instances acetylcholine has an excitatory effect. However, acetylcholine is known to have inhibitory effects at some of the peripheral parasympathetic nerve endings, such as inhibition of the heart by the vagal nerve.
The efferent signals of the autonomic nervous system are transmitted to the body through either the sympathetic nervous system or the parasympathetic nervous system. The preganglionic neurons of the sympathetic nervous system extend from preganglionic sympathetic neuron cell bodies located in the intermediolateral horn of the spinal cord. The preganglionic sympathetic nerve fibers, extending from the cell body, synapse with postganglionic neurons located in either a paravertebral sympathetic ganglion or in a prevertebral ganglion. Since, the preganglionic neurons of both the sympathetic and parasympathetic nervous system are cholinergic, application of acetylcholine to the ganglia will excite both sympathetic and parasympathetic postganglionic neurons.
Acetylcholine activates two types of receptors, muscarinic and nicotinic receptors. The muscarinic receptors are found in all effector cells stimulated by the postganglionic neurons of the parasympathetic nervous system, as well as in those stimulated by the postganglionic cholinergic neurons of the sympathetic nervous system. The nicotinic receptors are found in the synapses between the preganglionic and postganglionic neurons of both the sympathetic and parasympathetic. The nicotinic receptors are also present in many membranes of skeletal muscle fibers at the neuromuscular junction.
Acetylcholine is released from cholinergic neurons when small, clear, intracellular vesicles fuse with the presynaptic neuronal cell membrane. A wide variety of non-neuronal secretory cells, such as, adrenal medulla (as well as the PC12 cell line) and pancreatic islet cells release catecholamines and insulin, respectively, from large dense-core vesicles. The PC12 cell line is a clone of rat pheochromocytoma cells extensively used as a tissue culture model for studies of sympathoadrenal development. botulinum toxin inhibits the release of both types of compounds from both types of cells in vitro, permeabilized (as by electroporation) or by direct injection of the toxin into the denervated cell. botulinum toxin is also known to block release of the neurotransmitter glutamate from cortical synaptosomes cell cultures.