A work machine includes an IC engine having an output, an IVT having an input coupled with the IC engine output, and a ground speed actuator. A desired speed sensor associated with the ground speed actuator provides an output signal indicating a slower ground speed. At least one electrical processing circuit is configured for increasing an input/output (I/O) ratio of the IVT, dependent upon the sensor output signal, such that a net torque transfer back-driven from the IVT input to the IC engine output is substantially zero.

A work machine, such as a construction work machine, an agricultural work machine or a forestry work machine, typically includes a prime mover in the form of an internal combustion (IC) engine. The IC engine may either be in the form of a compression ignition engine (i.e., diesel engine) or a spark ignition engine (i.e., gasoline engine). For most heavy work machines, the prime mover is in the form of a diesel engine having better lugging, pull-down and torques characteristics for associated work operations.
An IC engine may be coupled with an IVT which provides continuous variable output speed from 0 to maximum in a stepless fashion. An IVT typically includes hydrostatic and mechanical gearing components. The hydrostatic components convert rotating shaft power to hydraulic flow and vice versa. The power flow through an IVT can be through the hydrostatic components only, through the mechanical components only, or through a combination of both depending on the design and output speed.
One example of an IVT for use in a work machine is a hydromechanical transmission which includes a hydraulic module coupled with a planetary gear set. Another example of an IVT for a work machine is a hydrostatic transmission which includes a hydraulic module coupled with a gear set.
The deceleration rate with an IVT can be more abrupt than a traditional torque
converter powershift transmission when the ground speed control pedal is fully released. The IVT ratio of input to output speed increases as the speed control pedal is released and the vehicle inertia back drives the engine and abruptly slows down the vehicle. This brings the vehicle to a stop quickly and is undesirable to the operator.
What is needed in the art is a work machine with an IVT which is configured and controlled to allow the work machine to be slowed down or stopped without abrupt and objectionable deceleration.

Work machine coast and brake control with an infinitely variable transmission


A thin film transistor array substrate may include a thin film transistor including an active layer, a gate electrode, source and drain electrodes, a first insulation layer arranged between the active layer and the gate electrode, and a second insulation layer arranged between the gate electrode and the source and drain electrodes, a pixel electrode arranged on the first insulation layer and comprising the same material as the gate electrode, a capacitor comprising a first electrode arranged on the same layer as the active layer and a second electrode arranged on the same layer as the gate electrode, a pad electrode arranged on the second insulation layer and comprising the same material as the source and drain electrodes, a protection layer formed on the pad electrode, and a third insulation layer formed on the protection layer and exposing the pixel electrode.

1. Field of the Invention
The present invention relates to a thin film transistor array substrate, an organic light emitting display device comprising the thin film transistor array substrate, and a method of manufacturing the thin film transistor array substrate.
2. Description of the Related Art
Flat panel display devices such as organic light emitting display devices or liquid crystal display devices include thin film transistors (TFTs), capacitors, wirings connecting the above circuit parts, etc. TFTs, capacitors, wirings, etc. are provided as micro-patterns formed on a substrate used for manufacturing a flat panel display device. The micro-patterns of the substrate are formed mainly by a photolithography process that transfers a pattern using a mask.
According to a photolithography process, photoresist is uniformly coated on a substrate on which a pattern is to be formed. The photoresist is exposed by an exposure apparatus such as a stepper. In the case of positive photoresist, exposed photoresist undergoes a development process. After the photoresist is developed, the pattern on the substrate is etched by using the remaining photoresist. After a pattern is formed, unnecessary photoresist is removed.
In the above process of transferring a pattern using a mask, a mask having a necessary pattern needs to be prepared so that costs for preparing a mask rise as the number of processes using a mask increases. Also, since the above-described many operations are needed, a manufacturing process becomes sophisticated, a manufacturing time is prolonged, and manufacturing costs rise.

Thin film transistor array substrate, organic light emitting display device comprising the same, and method of manufacturing the thin film transistor array substrate

Samsung-ro, Giheung-Gu, Yongin-si, Gyeonggi-Do


Deuterated organic salts useful in nonlinear optical applications are disclosed herein. More particularly, optoelectronic devices and systems are prepared from said deuterated organic salts and the preferred salt is perdeuterated 4'-dimethylamino-4-methylstilbazolium p-toluenesulfonate.

The optics and electronics industries rely upon inorganic compounds for fabrication of various components. However, these industries may benefit largely from the plethora of organic compounds, both known and unknown. Of the many potential applications of organic compounds to the above-mentioned industries, many relate to the electro-optic effect as described by Kerr (1875) and Pockels (1906). Additionally, frequency doubling by second harmonic generation (SHG) is often considered. SHG may be defined as the doubling of light's fundamental frequency.
A test to study SHG has been developed (Kurtz and Perry, 1968) which analyzes, for instance, the noncentrosymmetric crystal structure of organic compounds. Organic compounds which possess a noncentrosymmetric structure are generally said to be nonlinear.
Organic nonlinear optical materials displaying high SHG properties are potentially useful in applications which require high speed optical modulators. Such applications include high speed long distance data links and electric field sensors for use in electromagnetically noisy environments. In addition, such materials provide efficient wavelength shifting capability for optical and infrared remote sensing (e.g., of pollutant particulate concentration) and diode laser frequency doubling for optical data storage.
A common obstacle with nonlinear optical materials, such as nondeuterated 4'-dimethylamino-4-methylstilbazolium toluenesulfonate, is the existence of a group of infrared absorbances in the 1600-2000 nm region, a region which is extremely useful for optical applications like long distance optical fiber communications and eye-safe remote sensing. It is of increasing interest to prepare nonlinear optical materials which, while maintaining their conventional optical properties, do not exhibit infrared absorbances in the 1600-2000 nm region. Such absorbances are an obstacle since they interfere with, not only the optical properties, but the stability of the nonlinear optical materials as well. The instant invention, therefore, is based on the preparation of deuterated organic salts, such as the compound perdeuterated 4'-dimethylamino-4-methylstilbazolium p-toluenesulfonate and homologs thereof, which do not display infrared absorption in the 1600-2000 nm region. In the instant invention, deuterated organic salts are defined as salts containing deuterium including perdeuterated salts. Also included are optical devices comprising the same.


A pneumatic handling and recoating apparatus for handling workpieces, such as glass, is provided. The apparatus utilizes a holding device operatively connected to a vacuum assembly. The holding device engages workpieces by vacuum and subsequently releases them by a burst of gas. The burst of gas also facilitates the application of a coating material, such as a stain-retardant agent, to a workpiece upon release from the holding device.

It is a conventional feature of automatic machines for moving materials, particularly sheet-like materials, that the material is handled using suction devices connected to air lines of a pneumatic system. Systems of this nature, for example, are commonly used in moving glass sheets. In such operations, suction cups are typically connected to vacuum pumps and invested with translatory motion such that they can be made to approach and grip the outermost sheet of a stack. The outermost sheet, which may be at the top, bottom, front, or back of a stack, is then separated from the stack and translated toward the final destination by a distancing movement of the suction cups.
When the suction cups are to be detached from the sheet to allow further processing, the connection with the vacuum pumps is terminated, and the cups are vented to the atmosphere. Alternatively, the connection with the vacuum pumps can be terminated, and the cups subjected to a burst of compressed gas. The connections in question are controlled in most instances by means of pneumatically actuated valves, which are incorporated into the delivery system. For example, the use of three-way valves is conventional in this field.
In practice, these suction cups can leave traces of contact on the surface of a workpiece, which is typically a rigid sheet of material. For example, upon release of a suction device, suction cup shaped markings can be left on the handled surface. The suction device can also remove powders and/or other coatings that have been applied to the workpiece. Sheets of glass, for example, are often treated with protective powders (or "separators"), as discussed below. Removal of these powders by the suction device can have adverse effects on the glass. For example, the surface of the glass from which the powder is removed will subsequently be vulnerable to soiling, staining, and corrosion by water and/or other materials.
It is noted that moisture corrosion roughens the surface of glass. In fact, the longer water sits on a glass surface, the more the surface is typically affected. For example, as water sits on glass, alkali components are leached from the glass, thereby changing the pH of the water to alkaline. Thus, when water is allowed to remain on unprotected glass for a significant period of time, it tends to remove elements from the glass, particularly sodium ions. This process leaves a mark on the glass that, in some cases, can be so objectionable as to render the glass unsaleable.
As noted above, glass is typically treated with stain-retardants that prevent or minimize damage from moisture corrosion. For example, acidic buffers, such as adipic acid and maleic acid, are commonly sprayed onto the glass. These buffers are sometimes mixed into a powder which, as noted above, is generally referred to as a "separator". The separator also provides protection during storage and transportation against abrasion between adjacent glass sheets in a stack.
As noted above, conventional pneumatic handling devices tend to remove some of the protective material from glass sheets during handling. For example, when glass is engaged by a pneumatic handling device, each suction cup acts somewhat like a vacuum cleaner. In effect, the protective material is vacuumed from the surface of the glass. Further, to effect disengagement of the suction cup from the glass, a short blast of pressurized air is sometimes applied. This blast of air can carry away even more of the protective powder. Finally, the portions of the suction cup that contact the glass tend to carry away protective material from the glass surface.
Often, it may not be immediately apparent that the protective powder has been displaced. In fact, suction cup marks may only appear after extended periods of storage. While these marks can be made visible by fogging the glass with steam, this procedure is so time-consuming as to be economically unfeasible. Even if no suction cup marks appear following storage, these marks may show up once the glass has been coated. To make matters worse, some suction cup marks only appear after the coated glass has been tempered. Of course, suction cup marks decrease the quality and value of glass. Moreover, depending on the severity of the marks, such damaged glass may be rejected in the marketplace.
It would be desirable to provide material handing devices and methods, particularly for glass sheets, which facilitate handling workpieces coated with protective material (e.g., powder) without removing such material during handling or replacing material upon release.

Pneumatic handling and recoating apparatus and method of use


For use in verifying the identity of a user, an identity verifier comprising an optical fingerprint sensor coupled to an ID (identification) card reader. In one embodiment of the present invention, the optical fingerprint sensor includes a light source on a PCB assembly, a diffuser that receives light from the light source, a right angle prism that receives light from the diffuser, a collimating lens that receives light from the prism, a first mirror that receives light from the collimating lens, a second mirror that receives light from the first mirror, a third mirror that receives light from the second mirror, an imaging lens that receives light from the third mirror, and an image sensor on the same PCB assembly as the light source that receives light from the imaging lens. In one embodiment of the present invention, an ID (identification) card reader reads an ID card that contains biometric information about the user, and compares the biometric information on the card with the fingerprint of the user captured by the optical fingerprint sensor captured by the optical fingerprint sensor.

1. Field of the Invention
The present invention is directed in general to biometric identity verifier devices, and more specifically to optical fingerprint identity verifier hardware systems.
2. Description of Related Art
Existing optical fingerprint sensors generally use a right angle prism to capture the fingerprint image. The characteristic optical path in such sensors is illustrated in FIG. 1. Collimated light rays from a light source pass through one side of the prism. These light rays then travels to the top of the prism where a finger is placed. If a light ray impinges on a location where the finger is not in direct contact with the top of the prism, the light ray undergoes total internal reflection, and emerges through the other side of the prism where it is captured by an imaging sensor that is oriented perpendicular to the light ray. Alternatively, if the light ray impinges on a location where the finger is in direct contact with the top of the prism, the light ray does not undergo total internal reflection but is instead absorbed by the skin. Thus, the optical fingerprint sensor captures a pattern of light and dark bands representing the fingerprint.
As a consequence of the characteristic optical path described above, existing optical fingerprint sensors have the following drawbacks: (1) the sensor module has a large volume thereby limiting the range of commercial applications, (2) the non-planar orientation of the light source and the imaging sensor increases the cost to manufacture the sensor module and also limits commercial applications, and (3) the fingerprint image captured by the image sensor is compressed along one direction necessitating software correction of the fingerprint image which increases the cost to manufacture the sensor module and further limits commercial applications.
U.S. Pat. Nos. 5,892,599 and 5,629,764 added a holographic phase grating to the prism so that the image capture plane is normal to the optical axis of the imaging lens in order to remove the image distortion. U.S. Pat. No. 6,240,200 added a series of prisms as an alternative means to remove the image distortion. The problem with these approaches is that they necessitate a bulky and expensive sensor module.
U.S. Pat. No. 5,796,858 used a grating to replace the prism. The problem with this approach is that the fingerprint image quality suffers due to the optical imperfections of the grating.
Accordingly, there is a need for an optical fingerprint sensor that reduces the size and cost of the sensor module while ensuring a high quality of the fingerprint image.

Biometric identity verifiers and methods


A vehicle door assembly includes a door module and a door panel. The door module has a back plate with a periphery bearing attachment orifices defining a base plane. At least one guide rail extends in a rail direction in a rail plane offset from the base plane and has a connected edge and a free edge. The connected edge is attached to the back plate, and the free edge is shaped for slidably attaching a carrier plate for a window. The guide rail vertically protrudes beyond the periphery of the back platen. A void in the rail plane intersects a trajectory of the connected edge. The void provides access through the rail plane to the periphery of the back plate, wherein an attachment orifice is disposed in the void. The door panel has a central hole and attachment openings aligned with the attachment orifices of the door module.

Such a door module is configured for mounting on an inner door panel and includes through-holes for the insertion of attachment clips.
The guide rail or rails of some designs protrude beyond an upper edge of the back plate surface, in order to provide a longer travel path for the window pane to be adjusted. For such a solution, the back plate is mounted to the inner door panel by inserting the protruding end portion of the guide rail or rails from the vehicle-inner side (dry side) to the vehicle-outer side (wet side) into the mounting opening of the door panel and then by attaching the periphery of the back plate to the dry side of the door panel. A seal extends along the periphery of the back plate between the back plate and the door panel for ensuring a water-resistant separation of the wet side from the dry side of the door module.
The through-holes for the attachment clips distributed along the periphery of the back plate are generally limited to locations that are outside of the areas covered by the guide rails. In molded plastic door modules, this may result in a distance between the through-holes that is greater than desirable. A large space between the attachment clips makes it a challenge to establish a proper seal between the through-holes. Furthermore, the structural support provided by the door panel to the plastic back plate is limited to a few attachment points determined by the locations of the through-holes. As the back plate carries the window regulator that in turn carries a window pane, the back plate needs to withstand various forces resulting from the weight and movement of the window pane. It is thus desirable to provide a good support of the back plate by the door panel, which is typically made of sturdy sheet metal.

Automotive door module for window regulator


A photo-detecting device includes a buried doping layer of a first conductivity type and disposed at an upper portion of a silicon substrate. A first silicon epitaxial layer of first conductivity type is disposed on the buried doping layer, and a second silicon epitaxial layer of second conductivity type is disposed on the first silicon epitaxial layer. An isolation doping layer doped of first conductivity type is disposed at a predetermined region of the second silicon epitaxial layer to define a body region of second conductivity type. A silicon germanium epitaxial layer of second conductivity type is disposed on the body region.

1. Field of the Invention
Embodiments of the invention relate generally to semiconductor devices and related methods of fabrication. More particularly, embodiments of the invention relation to semiconductor devices comprising a photo-detecting device adapted to convert optical signals into electrical signals and related methods of formation.
This application claims priority to Korean Patent Application 2004-108791 filed on Dec. 20, 2004, the subject matter of which is hereby incorporated by reference.
2. Description of Related Art
Photo-detecting devices are common constituents of contemporary semiconductor devices adapted to detect externally provided optical signals and converting these to corresponding electrical signals. For example, photo-detecting devices have been used as a driver (or optical pick-up component) adapted to read data recorded on optical storage media, such as compact disc (CD) or digital versatile disc (DVD). Recent product design trends are demanding better access speeds from drivers, and in general photo-detecting devices face increasing pressure to operate at ever faster operating speeds.
Conventional photo-detecting devices typically include a photodiode serving as a light receiving portion of the device. A typical conventional photodiode will now be described below with reference to FIGS. 1 through 4.
FIG. 1 is a plan view of a photodiode included within a conventional photo-detecting device. FIG. 2 is a cross-sectional view taken along a line I-I′ of FIG. 1.
Referring to FIGS. 1 and 2, a buried p-type (e.g. doped with p-type impurities) doping layer 3 is disposed on a silicon substrate 1. (Throughout hit description the term "on" in this context means either one layer, device, and/or region "directly on" another layer, device and/or region, or one layer, device, and/or region on another with intervening layers, regions and/or devices present). A p-type silicon epitaxial layer 5 and an n-type silicon epitaxial layer 7 are then sequentially stacked on buried doping layer 3.
An isolation doping layer 8 defines an n-type silicon body region 7′ within n-type epitaxial layer 7. P-type isolation doping layer 8 extends downward through n-type epitaxial layer 7 to electrically connect p-type epitaxial layer 5. N-type body region 7′ is thus isolated by isolation doping layer 8 and n-type epitaxial layer 5.
A p-type buffer doping layer 6 is disposed at the portion of p-type silicon epitaxial layer 5 contacting isolation doping layer 8. The doping concentration for buffer doping layer 6 is higher than that of p-type epitaxial layer 5.
A heavily doped n-type layer 10, having a doping concentration higher than that of n-type body region 7′, is formed on an upper portion of n-type body region 7′. Heavily doped n-type layer 10 and n-type body region 7′ correspond to an "n-region" of the photodiode being formed, and p-type epitaxial layer 5 and buried doping layer 3 disposed below the n-region correspond to a "p-region" of the photodiode.
An interlayer oxide layer 12 is formed on the resulting structure. An opening is formed in interlayer oxide layer 12 to expose heavily doped n-type layer 12. However, interlayer oxide layer 12 covers an edge portion of heavily doped n-type layer 10. First and second interconnections 15a and 15b are formed through interlayer oxide layer 12. First interconnection 15a is electrically connected to isolation doping layer 8 through interlayer oxide layer 12. Accordingly, first interconnection 15a is electrically connected with the p-region of the photodiode through isolation doping layer 8 and buffer doping layer 6. Second interconnection 15b is connected to the edge portion of heavily doped n-type layer 10 through interlayer oxide layer 12.
An operating method of this exemplary, conventional photodiode structure now will be described in the context of the energy band diagram illustrated in FIG. 3. In FIG. 3, reference numerals "a", "b" and "c" denote respectively the n-type neutral region, a depletion region, and a p-type neutral region, of the photodiode.
Referring to FIGS. 1-3, a reverse bias may be applied to the photodiode at a standby state. The depletion region "b" may include a majority of n-type body region 7′, as well as a majority of p-type epitaxial layer 5 below n-type body region 7′.
The photodiode is divided into the n-type neutral region "a", the depletion region "b", and the p-type neutral region "c" by a PN junction. The n-type and the p-type neutral regions "a" and "c" are placed in a neutral state under conditions wherein electric fields are not established. An internal electric field 20 is established in depletion region "b".
In the standby state, an external optical signal is applied to the photodiode through heavily n-type doped layer 10. The applied optical signal generates electron-hole pairs (EHPs) in the photodiode. The generated electrons migrate along a conductivity band Ec and the generated holes migrate along a valence band Ev, allowing signal current to flow between first and second interconnections 15a and 15b.
In the conventional photodiode, the electrons and holes generated in depletion region "b" in response to the applied optical signal are accelerated by internal electric fields 20 in depletion region "b". In contrast, electrons and holes generated in depletion regions "a" and "c" migrate by means of diffusion. This migration path for the electrons and holes increases their migration time, so that the response characteristics of the photodiode (i.e., a reactive speed with respect to the optical signal) are degraded.
More particularly, the optical signal is applied with greatest intensity to the surface of n-type neutral region "a" (i.e., a surface of heavily n-type layer 10). The greater the depth of this intensity from the surface of n-type neutral region "a", the stronger the intensity of the optical signal. Therefore, diffusion migration of the electrons and holes generated in n-type neutral region "a" is a major factor in the degradation of response characteristics for the photodiode.
Exemplary response characteristics for the conventional photodiode now will be described with reference to FIG. 4. In FIG. 4, the x-axis represents time required for applying an optical signal, and the y-axis represents the amount of signal current generated by the optical signal. Additionally, a reference numeral "t" indicates an instance in time at which the optical signal is no longer applied to the photodiode.
Referring to FIGS. 1-4, when an optical signal having a determined intensity is applied to the photodiode, electron-hole pairs are generated mainly in n-type neutral regions "a" and depletion regions "b". The generated electrons and holes migrate due to diffusion and internal electric fields 20, allowing signal current to flow between interconnections 15a and 15b. For a given optical signal intensity, signal current will flow at a corresponding rate.
From time "t" forward when the optical signal is no longer applied to the photodiode, the amount of the signal current flowing from the photodiode decreases rapidly. Ideally, this signal current would stop immediately at time "t". However, some diminishing amount of signal current, or tail current 25, continues to flow after time "t" due to the migration time lag of electrons and holes generated in the photodiode.
At time "t", the holes generated in depletion region "b" migrate more quickly under the influence of internal field 20 while the holes generated in n-type neutral region "a" migrate to depletion region "b" via diffusion effects. Therefore, the migration time for holes generated in n-type neutral region tends to increase the length of tail current 25.
Unfortunately, as the tail current 25 increases in length, the response characteristics of the photodiode are degraded, thereby decreasing the overall operating speed of the photodiode. Moreover, tail current 25 may actually result in increased noise distorting the output signal characteristics of the photodiode.

Photo-detecting device and related method of formation


The process and apparatus for transforming combustible pollutants and waste materials into non-polluting, clean and useful energy, by completely removing the pollutants from raw materials while avoiding the formation of potential pollutants, involve the use of oxygen or a gas mixture containing oxygen, such as air, and steam.

This invention relates to a process and a machine for the transformation of combustibile pollutants or waste materials into clean energy and utilizable products.
It is known to carry out the thermodecomposition of combustible pollutants, such as urban or industrial waste materials, by oxidizing such wastes in controlled conditions of temperature and excess of air and to use the elevated heat developed by the fumes to produce both thermic and electric energy.
However, this well known technique of waste disposal with energy regeneration is only modestly efficient and causes dangerous emissions of harmful substances and micropollutants.
"Plasma Chemistry and Plasma Processing" Vol. 4, No. 4, December 1984, Plenum Publishing Corp., New York, U.S.A., discloses a gasification method of peat by using a steam plasma in order to obtain a high gasification efficiency.
EP-A1-0 194 252 discloses a gasification method which purifies the raw gas produced from tar.
However, up to date the gasification method has not found a wide spread since the problems concerning the high total energetic yield, the elimination of pollutants and the economical convenience have not found a satisfactory unitary solution.

Process and machine for the transformation of combustible pollutants of waste materials into clean energy and usable products


A motor may include a rotor having a rotor shaft and a magnet, at least a stator core disposed around the rotor and provided with a plurality of pole teeth, and at least a coil mounted on the stator core. The stator core includes a terminal block mounting part which is formed so as to protrude on an outer side from the stator core, and a terminal block supporting terminals for the coil is integrally mounted on the terminal block mounting part. The terminal block mounting part may be formed with at least an engaging protruded part and the terminal block is integrated with the engaging protruded part by insert molding or outsert molding.

A conventional PM type (Permanent Magnet Type) stepping motor 100 in which a permanent magnet is used in a rotor has been known as described, for example, in Japanese Patent Laid-Open No. 2004-112985.
A schematic structure of the conventional stepping motor will be described as follows with reference to FIG. 6. A pair of inner stator cores 104 for two phases are superposed on each other in a back-to-back manner. A plurality of pole teeth 106 is formed upright at an inner circumferential edge of the respective stator cores 104 at nearly equal intervals, and bobbin-less coils 110 are respectively mounted on the outer periphery of the pole teeth 106. A rotor 116 in which a magnet (permanent magnet) 114 is integrally fixed to a rotor shaft 112 is rotatably supported on mounting plates 120 through bearings 118 on an inner peripheral side of the pole teeth 106 of the inner stator cores 104.
Outer stator cores 122 are assembled to the inner stator cores 104 and a plurality of pole teeth is formed at an inner circumferential edge of the respective outer stator cores 122 so as to be alternately disposed to the pole teeth 106 of the inner stator core 104.
In the stepping motor 100 which is structured as described above, wire ends 110a of coils 110 are wound around terminal pins 102 provided on the respective inner stator cores 104. An electric current is supplied to the respective coils 110 through the terminal pins 102 and, as a result, a rotation drive force is applied to the rotor shaft 112 by generated magnetic field and rotation is outputted from one end side of the rotor shaft 112.
In the stepping motor 100 as described above, a terminal block 130 supporting the terminal pins 102 is mounted on the inner stator core 104 by adhesively bonding with an adhesive.
However, when the terminal block 130 is mounted by adhesively bonding with an adhesive, mounting position of the terminal block 130 on the inner stator core 104 may be easily displaced and the terminal block 130 may be easily mounted in an inclined state. In addition, the terminal block 130 is formed of resin and the inner stator core 104 is formed of metal and thus, when adhesive strength is low, a problem may occur, for example, the terminal block 130 is disengaged from the inner stator core 140.
As described above, when a problem such as displacement of the mounting position or disengagement of the terminal block 130 from the inner stator core 104 may occur due to low fixing strength of the terminal block 130 to the inner stator core 104, the wire end of the coil 110 connected to the terminal pin which is supported to the terminal block 130 may be disengaged or the wire end may be disconnected and thus an electric current is unable to be supplied to the coil 110 stably, which causes a problem in control for the stepping motor 100.

Motor with terminal block integrally mounted on terminal block mounting part and manufacturing method therefor


A rotary clutch device includes: a tooth-partially-lacking gear that can mesh with a drive gear and is given initial rotation force; a rotatable cam body that is concentric with the tooth-partially-lacking gear, having an engagement step; and an elastic body. An engagement lever is engaged with and disengaged from the engagement step according to an intermittent operation of an actuator so that the tooth-partially-lacking gear starts and stops to rotate. Rotation force of the tooth-partially-lacking gear is transmitted to the cam body via the elastic body.

1. Field of the Invention
The present invention relates to a rotary clutch device and a sheet feeder using the same. The present invention also relates to an image forming apparatus such as a laser printer, a copier, or a facsimile machine.
2. Background Art
A rotary clutch device provided in a sheet feeder of a laser printer is known in which a cam body having an engagement step on its outer circumferential surface is formed integrally with a tooth-partially-lacking gear that is linked to a D-shaped sheet feed roller. An engagement lever is provided so as to be engageable with and disengageable from the engagement step. When the mesh between the tooth-partially-lacking gear and a drive gear is canceled, the engagement lever engages the engagement step, whereby the tooth-partially-lacking gear and the sheet feed roller are stopped (e.g., JP-A-11-190410).
The engagement lever is operated intermittently with prescribed timing by an actuator such as a solenoid. An urging spring for imparting initial rotation force to the tooth-partially-lacking gear to cause the tooth-partially-lacking gear to mesh with the gear portion of the drive gear when an engagement nail located at the tip of the engagement lever is disengaged from the engagement step is connected to the tooth-partially-lacking gear. Therefore, immediately after the disengagement of the engagement lever from the engagement step, the cam body that is integral with the tooth-partially-lacking gear is rotated by the urging spring. The engagement lever is then returned to the original position due to the intermittent operation of the solenoid and hence the engagement nail of the engagement lever touches the outer circumferential surface of the cam body. At this time, an impact sound (a click) that occurs when the engagement nail of the engagement lever collides with the outer circumferential surface of the cam body.
In the technique disclosed in JP-A-11-190410, to reduce the impact sound, a cam release surface is formed, as part of the outer circumferential surface of the cam body, upstream of the engagement step in the rotation direction and a cam recovery surface is formed upstream of and adjacent to the cam release surface in such a manner that the radius (i.e., height) of the cam recovery surface is set laser than that of the cam release surface.
In the technique disclosed in JP-A-11-190410, by virtue of the above structure, the impact sound that occurs when the engagement nail touches the outer circumferential surface of the cam body approximately perpendicularly. However, the impact sound (a click) that occurs when the engagement nail of the engagement lever engages with the engagement step of the cam body that is given initial rotation force by the urging spring after the non-tooth portion of the tooth-partially-lacking gear is opposed to the drive gear and hence the mesh between the tooth-partially-lacking gear and the drive gear is canceled cannot be eliminated.

Rotary clutch device and sheet feeder using the same


A method and system for content display. The method includes: capturing, by an imaging device, a plurality of images of an environment; generating, by a computing device, first user profiles based on appearance of users recognized in the images; detecting devices in the environment and associating the detected devices to the users to obtain associated devices that are held by the users; retrieving, by the computing device, second user profiles of the users based on identifications of the associated devices; selecting at least one content based on the first user profiles and the second user profiles; and displaying the at least one selected content.

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
E-commerce has been a significant part of social life. E-commerce platforms often provide membership systems, collecting profiles of users, and provided users with targeted products and services based on the collected profiles. In contrast, an offline advertisement uses a display to display the products or service, but cannot takes advantage of user information.
Therefore, a demand exists in the art to address the aforementioned deficiencies and inadequacies.

System and method for interactive perception and content presentation

BEIJING JINGDONG SHANGKE INFORMATION TECHNOLOGY CO., LTD.

JD.COM AMERICAN TECHNOLOGIES CORPORATION


A variable impedence photodiode detector circuit for use in detecting signals in the infrared (IR) includes circuitry to maintain a constant reverse bias voltage on the photodetector to maintain the best signal transfer characteristics regarding frequency response, analog bandwidth, sensitivity, output current range, and signal-to-noise ratio over an operating range from total darkness to maximum daylight. A series current source varies the current to the photodiode in response to variations in detector impedence.

Prior Art
Devices such as photodiodes used to detect and receive electromagnetic signals are well known and widely used. Generally speaking, the photodiode is used in an environment which highly restricts the variations in background or environmental lighting conditions that exist. For example, IR detectors used in TV set remote control receivers are usually recessed in cavities and those used in fiber-optic communications may be totally enclosed.
In the most basic receiver circuit, the resistance of a reverse-biased photodiode changes with incident light resulting in a change of the current in the circuit and the voltage that is developed across a resistor. The result of changing voltage across the resistor is, of course, a change in the bias voltage across the diode with a resultant change in the junction capacitance and a change in the frequency response of the diode. The value of resistance is chosen to provide the best signal-to-noise (S/N) ratio for a given diode. For a highly restricted range of light inputs, the total variation in junction capacitance may not be sufficient to prevent near optimum values for frequency response, S/N, and sensitivity over that light level range. Alternative circuits can be used for the purpose of holding the reverse bias constant via op amps or similar circuits.
In applications where the environmental incident light level may vary from total darkness to unshielded daylight, the problems discussed above become more severe. First, the current range through the diode may extend to the limits of device operation. Second, maintaining a constant bias voltage becomes more difficult over the wider current range. Third, the tradeoffs regarding current and current noise and the effects of resistor size on the S/N ratio become more serious when using the diode over a very wide range.
The desired circuit should have a high output impedence for the photodiode in order to provide maximum sensitivity. A constant bias voltage over the operating range is also needed to provide a constant frequency response. Finally, the photodiode must be able to operate over the widest possible current range without degrading frequency response or sensitivity and without requiring output voltage swings that are difficult to accomplish in practice. None of the prior art circuits are suitable for operation from direct sunlight to total darkness.

Detection circuit for maintaining constant signal transfer characteristics of a light-sensitive detector


A catheter for hemodialysis comprises a flexible catheter tube defining a plurality of separate lumens. The catheter defines an arc angle of generally U-shape in its natural, unstressed configuration. Thus, the catheter may be implanted with a distal catheter portion residing in a vein of the patient, the distal catheter portion being of substantially the shape of the vein in its natural, unstressed condition. Also, a proximal catheter portion resides in a surgically created tunnel extending from the vein and through the skin of the patient, this section of the catheter also being typically in its natural, unstressed condition. Thus blood may be removed from the vein through one lumen of the catheter, and blood may be returned to the vein through another lumen of the catheter, while the catheter is subject to long term indwelling in the body. Improved results are achieved because of the lack of mechanical stress in the shape of the catheter, which stress causes the catheter to press unduly against adjacent tissues.

Double lumen catheters have been used as permanent blood access devices for easy and safe access to a patient's arteriovenous system for hemodialysis. Such double lumen catheters have been clinically used and commercially sold. One example of such double lumen catheters is disclosed in Mahurkar U.S. Pat. No. 4,568,329, with other examples of such catheters being disclosed as cited references in that patent.
The use of an indwelling hemodialysis catheter has significant advantages. Particularly, the patient does not have to endure a needle puncture to gain access to his arteriovenous system in every dialysis procedure, but, rather, the indwelling catheter can be simply periodically hooked up to the dialyzer system to provide a blood flow path between the patient and the dialyzer system.
However, as a disadvantage, indwelling catheters which connect to the arteriovenous system are subject to risks of infection and clotting.
Additionally, with a multiple lumen catheter, one lumen serves as a blood outflow path from the arteriovenous (A.V.) system and another lumen serves as an inflow passage for blood to be returned to the A.V. system. As a continuing problem with multiple lumen hemodialysis catheters, the suction at the entrance of the outflow port through which blood flows can cause the outflow port to be occluded by intimal tissues within the vein. This, in turn, can cause tissue damage and results in clotting, which has significantly limited the use of multiple lumen indwelling catheters for hemodialysis.
Furthermore, most multiple-lumen hemodialysis catheters are semi-rigid, with a result that they cannot be anchored securely, and consequently are prone to piston-like movements while they indwell a vein. This movement inside the vein tends to further irritate the intima of the vein wall tissue, leading to further clot formation and vein inflammation. Likewise, outward movements of the subcutaneous and external segments of such a catheter tend to collect contaminants, and to infect the subcutaneous tunnel through the tissue as these segments once again move inwardly.
Other hemodialysis catheters are more flexible, but are molded and cured in a generally straight configuration. Such catheters, however, are usually installed into the venous system in a substantially curved position. Thus, the elastic memory of these catheters causes them to press against some of the vein intima in certain places, with a resulting irritation thereof, and an increase in clotting potential. Likewise, it has been found that catheters which press against the vein walls also uncover vessel wall collage, which attract and activate platelets and the clotting system for an increase in clotting potential, which can cause catheter occlusion by clot attachment to the vein wall, subsequent fibrosis of the clot, and vein stenosis.
By this invention, a multiple-lumen, intravenous catheter, particularly for hemodialysis and also for any other desired use, is provided. The outflow port of the catheter, where a suction is developed, is protected against engagement with the vein intima tissues and the like.
Additionally, the catheter of this invention may be of a desired, curved configuration in its as-manufactured, unstressed configuration, so that the catheter occupies its indwelling site with less irritation of the vein or duct walls, wherever the catheter may be emplaced. The result of this is a catheter which is less likely to generate blood clotting or tissue irritation, and also with a reduction in its potential for causing infection. Such an indwelling catheter may thus be carried by a patient on hemodialysis for long-term use, providing the patient with relief from the anxiety and pain of the normal and frequent needle sticks that are required to accomplish hemodialysis with an A.V. fistula, and facilitating the hemodialysis procedure in other ways as well.

Multiple lumen catheter for hemodialysis

Curators of the University of Missouri, The University of Missouri


A thin film transistor substrate includes a first conductive layer formed on a substrate, an anti-diffusion layer deposited on the first conductive layer, a semiconductor layer formed on the anti-diffusion layer, a gate insulating layer deposited on the semiconductor layer, a second conductive layer formed on the gate insulating layer, an interlayer insulating layer deposited on the second conductive layer, and a third conductive layer formed on the interlayer insulating layer, in a first contact hole penetrating through the interlayer insulating layer and the gate insulating layer to reach the semiconductor layer, and in a second contact hole penetrating through the interlayer insulating layer, the gate insulating layer and the anti-diffusion layer to reach the first conductive layer. The third conductive layer includes a pixel electrode formed in island shape on the interlayer insulating layer.

1. Field of the Invention
The present invention relates to a thin film transistor substrate, a manufacturing method of a thin film transistor, and a display device using the same.
2. Description of Related Art
An active matrix liquid crystal display device which uses a thin film transistor (TFT) substrate is widely used, as described in Japanese Unexamined Patent Application Publication Nos. 2001-217423 (Hayashi), 2002-26330 (Nakamura), and H10-178177 (Takeguchi). A TFT substrate of a related art is described hereinafter with reference to FIG. 3. FIG. 3 is a sectional view showing the sectional structure of a top-gate TFT substrate according to a related art. In the TFT substrate 101 in FIG. 3, a SiN (Silicon Nitride) film 12, which serves as an anti-diffusion layer, is deposited on a glass substrate 11. On the SiN film 12, a semiconductor layer 13, which includes a channel region 131, a source region 132 and a drain region 133, and a lower capacitor electrode 13a, which is made of the same material as the semiconductor layer 13, are formed in island shapes. The lower capacitor electrode 13a serves as an auxiliary capacitor region of a TFT 22.
Further, a SiO2 (Silicon Dioxide) film 14, which serves as a gate insulating layer, is deposited to cover the semiconductor layer 13 and the lower capacitor electrode 13a. An island-shaped gate electrode 15 is then formed above the channel region 131 with the SiO2 film 14 placed therebetween. Specifically, the SiO2 film 14 is placed between the gate electrode 15 and the channel region 131, so that the gate electrode 15 is placed opposite to the channel region 131 of the semiconductor layer 13 with the SiO2 film 14 interposed therebetween. The channel region 131 of the semiconductor layer 13 and the gate electrode 15 are thus placed opposite to each other with the SiO2 film 14 interposed therebetween. Further, an island-shaped upper capacitor electrode 15a is formed above the lower capacitor electrode 13a with the SiO2 film 14 placed therebetween. The upper capacitor electrode 15a is made of the same material as the gate electrode 15.
Then, a SiO2 film 16, which serves as an interlayer insulating layer, is deposited on the gate electrode 15. The source region 132, the drain region 133, and the lower capacitor electrode 13a are respectively connected with a line electrode 17 through contact holes 20 which are formed in the SiO2 film 14 and the SiO2 film 16. The line electrode 17 is connected with the source region 132 to supply a display voltage to the TFT 22. The line electrode 17 is also connected with the drain region 133 to form a given circuit, such as supplying a display voltage to a pixel electrode.
Further, an upper insulating layer 18 is deposited on the line electrode 17. The line electrode 17 is connected with a pixel electrode 19 through a contact hole 21 which is formed in the upper insulating layer 18. The line electrode 17 is electrically connected with the source region 132 and the drain region 133 to transmit a picture signal or a control signal from the outside or the inside of a circuit on the substrate. As described above, in the top-gate TFT substrate of a related art, the line electrode 17 for connecting a plurality of elements such as a TFT and a capacitor is placed in an upper layer of the TFT substrate 101.
However, the present inventor has recognized the followings. In order to establish a connection of the line electrode 17 with the source region 132, the drain region 133 and with the lower capacitor electrode 13a to supply a display voltage to the pixel electrode 19, it is necessary to form the contact holes 20 and 21. The manufacturing process thus requires two steps of contact hole formation. Specifically, the process needs to form the contact holes 20 between the line electrode 17 and the source region 132, between the line electrode 17 and the drain region 133, and between the line electrode 17 and the lower capacitor electrode 13a, and further form the contact hole 21 between the line electrode 17 and the pixel electrode 19. Therefore, the number of masks and manufacturing steps which is required for forming contact holes is two, which is an disadvantage in manufacturing cost reduction.
In view of the foregoing, it is an object of the present invention to provide a thin film transistor substrate, a manufacturing method of a thin film transistor, and a display device which require a smaller number of masks and manufacturing steps by integrating contact hole formation steps.

Thin film transistor substrate, manufacturing method of thin film transistor, and display device


A method of handling security key change for a user equipment in a wireless communication system includes applying a radio resource control procedure to activate key change, where the radio resource control procedure covers two conditions where the key change is accompanied with an authentication and key agreement run and without an authentication and key agreement run.

1. Field of the Invention
The present invention relates to a method and related communication device for a wireless communication system and more particularly, to a method of handling a security key change for a wireless communication system and related communication device.
2. Description of the Prior Art
The third generation (3G) mobile communications system has adopted a Wideband Code Division Multiple Access (WCDMA) wireless air interface access method for a cellular network. WCDMA can provide high frequency spectrum utilization, universal coverage, and high quality, high speed multimedia data transmission. The WCDMA method also meets all kinds of QoS (Quality of Service) requirements simultaneously, providing diverse flexible two-way transmission services and better communication quality to reduce transmission interruption rates.
In order to protect user data and signaling information from being intercepted by unauthorized devices, the prior art 3G mobile communications system can trigger ciphering or integrity protection (IP) through a Security Mode Control (SMC) procedure and make sure that data transmission is more secure. The ciphering procedure calculates keystream data through a ciphering algorithm, then the transmitter encrypts plain-text data with the keystream data to generate cipher-text data, and the receiver can decipher the received cipher-text data with keystream data the same as the keystream data used in the transmitter, so as to obtain the plain-text data.
Regarding security of data transfer, the 3rd Generation Partnership Project, 3GPP develops a security architecture specification to provide an Authentication and Key Agreement (AKA) for use between the UE and the core network (CN). With Authentication and Key Agreement, the UE and the CN can authenticate each other and ensure data security and ciphering. That is, a new key set will be allocated to the UE after the AKA is run in a mobile management (MM) layer.
Please refer to FIG. 1, which is a schematic diagram of a key hierarchy for a long term evolution (LTE) in wireless communication system. Based on different security levels, the UE includes a permanent key K, a ciphering key (CK), an integrity key (IK), a base key KASME, a non-access stratum encryption key K(NAS, enc), a non-access stratum integrity K(NAS, int) and a base station level key KeNB. The permanent key K exists in universal subscriber identity module (USIM). CK and IK are used for ciphering and integrity protection in universal mobile telecommunication system (UMTS). The KASME is used between the UE and an access security management entity (ASME). As for a non-access stratum (NAS), K(NAS, enc) and K(NAS, int) are used for encryption and integrity protection of non-access stratum message, respectively. A user plane (UP) key KeNB-UP-enc and radio resource control (RRC) keys KeNB-RRC-int and KeNB-RRC-enc are derived from the KeNB and used for encryption for user plane data, integrity for RRC messages, and encryption for the RRC messages, respectively. The derivative relationship of keys between each level is illustrated in FIG. 1. For example, the KeNB can be derived from the KASME via a particular algorithm and so on. When the UE is operated in a radio resource control connected (RRC_CONNECTED) mode or a LTE_ACTIVE mode, the UE and the eNB derive the UP and RRC keys (i.e. KeNB-UP-enc,KeNB-RRC-int and KeNB-RRC-enc) from the KeNB. When the UE enters an RRC_IDLE or LTE_IDLE mode, the KeNB, KeNB-UP-enc, KeNB-RRC-int, and KeNB-RRC-enc are deleted from the eNB. In addition, as a result of an AKA run in the UE, each key shown in FIG. 1 must be refreshed when a key change is performed following the AKA run.
When the UE is operated in the RRC_CONNECTED or LTE_ACTIVE mode, the four requirements regarding the change of keys in the eNB are described as follows in order to ensure data security:
(1) If the sequence numbers that have a length of finite bits and used for the UP or RRC ciphering/integrity protection are about to wrap around, the respective keys shall be changed.
(2) If a UE has been in LTE_ACTIVE for a long period of time, the keys for UP and RRC ciphering/integrity protection shall be changed, even though the sequence numbers are not close to wrapping-around.
(3) Lifetime of KASME shall be restricted.
(4) If the UE has performed an inter-RAT handover from UTRAN/GERAN to LTE, all keys shall be updated within seconds.
However, in cases of (1) and (2), the AKA is unnecessary to run to get new keys. Changes of eNB-local UP and RRC keys are sufficient. This can, for example, be achieved by deriving new UP and RRC keys from the existing KeNB in the eNB itself, or by deriving a new KeNB from the existing KASME. In cases of (3) and (4), the whole key hierarchy based on KASME must be updated based on a new AKA run.
According to the related specifications, the approach for activating the key change in a RRC_CONNECTED or LTE_ACTIVE mode has not been decided yet. One approach could be an intra-cell handover procedure. Regarding the intra-cell handover procedure, the network performs a handover to the same cell which the UE is already in. Only the AS (Access Stratum) keys are refreshed by the intra-cell handover in similarity with an inter-cell handover. The new AS keys are derived from the previous AS keys.
When the UE is operated in the RRC_CONNECTED or LTE_ACTIVE mode, there are two types of key changes to consider: the key change with the AKA run and the key change without the AKA run. It is not clear in the prior art how the key change should be performed.

Method of handling security key change and related communication device


A non-woven fiber article for use in a food, medical, or pharmaceutical production environment including a melt-spun polymer fiber is provided having a cross-section and a length and a detectable particulate present in an amount of 20 to 80 weight percent loadings of metal or 10 to 80 weight percent loadings of radiopaque particles to render the polymer fiber detectable by magnetic or X-ray detection, alone or in combination with a secondary functional particulate distributed with the polymer fiber to render the polymer fiber chemically responsive to a chemical reactant, change in pH or temperature. The detectable particulate and the secondary functional particulate are each independently present in a core, a sheath, or both portions of polymer matrix. A process of detecting a fabric made from such a fiber. The fabric article passes through detector. A signal is collected from the detector indicative of the presence of the fabric article.

Many industries have a need for functional polymers and articles made therefrom. By way of example, a food, medical, or pharmaceutical production line maintains tight audit control of service articles that enter the medical or manufacturing facility to assure such articles do not accidently enter the process or production stream as a contaminant that can be fragmented into dangerous shards. Historically, plastics have been precluded from some environments due the inability to locate such articles with product screening metal or X-ray detectors. Recently, plastic articles have been developed that are filled with metal particulate or barium sulfate, as detailed US Patent Application Publication US20120241589 that are detectable with magnetic or X-ray detectors, yet still process as injection moldable thermoplastics and operate in manner similar to their unfilled conventional counterparts.
By way of example, U.S. Pat. No. 5,897,673 teaches fibers containing fine metallic particles that are cross-linked to the polymeric fiber. While various pure metals are contemplated in the literature, little attention has been paid to the unique problems associated with stainless steel particulate or other functional particulates. As many manufactured substances can only be exposed to stainless steel or other functional particulates, the lack of stainless steel or other functional particle filled fibers precludes the usage of many useful articles from these controlled manufacturing sites. By way of example various wipes, hair covers, suits, aprons and shoe covers and other manufacturing aids or personal protective equipment if made from stainless steel or other functional particulates containing fibers could allow better quality control of manufacturing with less stringent audit processes, as any such articles lost in a production stream could be detected by X-ray or magnetic anomaly. However, injection molded parts containing loading of metals or electron dense substances needed for detection are limiting in terms of the materials that can be formed.
Thus, there exists a need for a spun thermoplastic fiber filled with particulate, the particulate rendering a resultant non-woven article either detectable in a production context alone or also to include additional functional particulate. There also exists a need for such fibers that process and retain properties of conventional thermoplastic fibers to promote production of various articles from fibers that have the added benefit of imparting functional properties while operating in a manner similar to conventional articles.

Particle-filled fiber and articles formed from the same


A cloud-based, geospatially-enabled data recording, notification, and rendering system.

The present invention relates to the field of emergency applications, and, more particularly, a cloud-based, geospatially-enabled data recording, notification, and rendering system.
Presently, people (and machines) that are in duress and/or experiencing a health and/or a security-related crisis ("emergency situations") do not have a manual or automated, personalized, cloud-based, geospatially-enabled, video, audio and/or data recording and rendering system to automatically inform supportive entities or machines.
Current devices or systems in the field of this invention only provide disparate, uncoordinated pieces of situational awareness, and none provide integrated geospatial data and rendering (map, etc.) of the recorded/streamed data. Other devices also require the user(s) to manually program and/or reconfigure their own devices in an attempt to perform the function of the present invention, and none suitably do so; thereby, further confounding the users, especially those who are not technically savvy. Finally, no other systems provide the automated notification of recorded events to supportive entities/machines along with renderings based on recorded data, wherein the automated notification may include an alert and inform law enforcement (and other security-related, supportive entities) of the nature, location, and ongoing proceedings (via the recorded data, including live stream and other data) of the identified emergency situations.
Presently, there are systems for recording and rendering (streaming) video via social media platforms, but none are geospatially-enabled and provide the location of these stressful events (especially in relation to the viewer). Moreover, these social media streaming services do not automatically notify supportive individuals or machines when a particular individual (such as their loved one/companions) are in duress and/or experiencing a health and/or security-related crisis. Smartphones record video/audio/data, but most require extensive memory storage on the device to accommodate these types of large file sizes. If said smartphone is lost or destroyed, this recorded data is lost or destroyed, too, in most cases. Social media sites do not allow users to discriminately notify loved ones of the creation, presence, and availability of these files for retrieval or downloading. Social media sites also do not allow loved ones/companions to retrieve and/or download these files. The present invention solves all of these problems.
Social-media and/or device-based systems do not work well because they are not integrated and streamlined for ease of use, they do not provide automated notification of stressful events, and they are not geospatially-enabled to tell *where* these events are happening in real-time (or after the fact).
As can be seen, there is a need for a cloud-based, geospatially-enabled data recording, notification, and rendering system.
The present invention combines, streamlines, and integrates multiple disparate technologies into an easy-to-use, single system for data recording/streaming, storage, provisioning, and geospatial rendering. No other current system or technology combines and performs these functions, which when combined into one system, provides compounded effectivity, efficiency and geospatial awareness for the user(s), both human and machine.
The present invention integrates these various elements, provided in whole or part by either the user's recording device and/or social media platforms and/or other sources of data input. The present invention also provides a geolocation (map coordinates and rendering display) of said events. Finally, this invention automates the notification process of these events to the supportive people/machines and allows them to retrieve, analyze, download and/or share said recording and associated data.
As stated above, presently, people (and machines) that experience stressful personal and environmental events do not have a manual or automated, personalized, cloud-based, geospatially-enabled, video, audio and/or data recording and rendering system to automatically inform supportive entities or machines when they are in duress and/or experiencing a health and/or in a security-related crisis. The present invention claimed herein solves this problem.

Cloud-based, geospatially-enabled data recording, notification, and rendering system and method


A modular structure for providing electrical interconnections achieves greatly increased wiring density by forming vias and wiring patterns by chemical (e.g. lithographic) processes rather than by mechanical processes such as punching of vias and screening patterns of conductive paste. A basic module is a power core comprising an apertured metallic foil with an insulator applied to surfaces thereof, extending through at least one aperture and exposing the metallic foil in at least one aperture. The foil in the power core provides stiffness to facilitate subsequent handling and electrical shielding between conductive layers as well as a potential power connection. Via connections of increased conductivity and robustness are formed by plating the interior of vias after lamination of a desired combination of power cores and signal cores. Vias remain unfilled until after lamination and are available to facilitate optical alignment of composite layers including signal cores, power cores and laminated combinations thereof.

1. Field of the Invention
The present invention generally relates to the fabrication of modular electronic circuit packages and, more particularly, to electronic circuit packages having multi-layer electrical interconnection patterns and which are capable of providing signal and power connections to one or more integrated circuit chips and/or interconnecting a plurality of integrated circuit chips.
2. Description of the Prior Art
The trend toward fabrication of electronic circuit devices at smaller sizes and higher integration densities is principally due to the higher circuit performance which is generally associated with reduced size and interconnection distances. Reduction in size of electronic circuits is often accompanied by reduced parasitic capacitances, shortened signal propagation times and reduced power dissipation. Additionally, the process cost is generally reduced with the size of a circuit of a given design complexity since such size reduction allows more such circuits to be formed on a single semiconductor wafer of a given size or through the use of equipment of a fixed processing capacity. Therefore process costs can be projected over a larger number of devices even though some process complexities and costs may be increased as feature sizes in the integrated circuit design approach the limits reliably available at any given time.
To fully exploit the performance improvements available from reduced propagation time as well as reduced costs deriving from increased integration density, chip interconnection systems must be able to mechanically support a potentially large plurality of integrated circuit chips in close proximity and provide potentially complex electrical interconnection thereof at relatively low cost and with high reliability. Such interconnection systems often cannot be provided as an incident of circuit integration on a single chip since incompatible processes are often required to form optimal integrated circuits having different functions. Accordingly, to meet the need for interconnection of a potentially large plurality of integrated circuit chips, so-called multi-layer modules (MLM's) have been developed which include a plurality of lamina having desired circuit interconnection patterns formed thereon. These lamina, which may be of a variety of materials such as ceramic or polymers (e.g. polyimide) are then stacked and formed into a single body by heat treatment such as sintering for ceramics or fusing for polymers.
Connections between conductive patterns formed on respective lamina of MLM's is achieved by the formation of vias (e.g. generally by punching or drilling) which are essentially perforations in the respective lamina which are later filled with a conductive material such as metal or a conductive paste such as that used to form the conductive patterns. Often, conductive spheres or cylinders will be embedded into the lamina to form vias with a reduced number of process steps. Preferred methods of via formation are not consistent for all materials of which the lamina may be made; requiring different machinery and process steps for different lamina and via materials.
The completion of vias in each lamina before the lamina are joined together, however, implies a requirement that the process for joining the lamina must also form good electrical connections at the via locations in one lamina to the conductive pattern on an adjacent lamina. This process, though presently well-developed and highly reliable generally causes residual stress in the lamina and the completed MLM. Additional stresses may occur during lamination or curing of the lamina, as well, with the result that there will generally be some dimensional distortion of the lamina during the process which may compromise alignment. Such stress is partially borne by the via connections and may be relieved during thermal cycling or other mechanisms after the MLM is placed in service with the result that via connections may become less reliable as stress is relieved.
Further, process tolerance for forming the via connections within the body of the MLM is relatively critical and inherently does not result in a structure of optimal robustness. It should also be recognized that the number of vias in each lamina may be in the thousands and the number of connections which are simultaneously formed is therefore many times larger and will increase as the number of lamina and or the number of vias per lamina required by the MLM design increases. Therefore, the possibility of the improper or less than ideal formation of one or more connections in the MLM greatly increases and robustness is compromised with increased complexity of the MLM design.
Additionally, it should be recognized that the process for forming MLM's in this way is expensive and complex; requiring numerous steps to be carried out with high precision, particularly as to positional registration as the lamina are stacked. Automated optical alignment cannot generally be accomplished without the formation of a plurality of transparent features or apertures which would occupy module space and further complicate manufacturing processes. Further, the formation of vias by punching or drilling carries the possibility of contamination of the lamina with the material removed from the vias. Punching and drilling processes usually must be performed serially (e.g. one via after another) and, even when carried out at high speed, the number of vias inherently extends the time required for the formation of vias in each lamina.
Sequential drilling and punching also allows the possibility of individual, relative, positional errors and via malformations such as may occur through so-called "wandering" of a drill bit as a hole is begun or through mechanical recoil or bounce of a punch. Correct formation of the via apertures and the filling thereof must also be verified by serial inspection or testing (e.g. optical inspection) of each via before and after filling. Therefore, punching and drilling processes and the inspection or testing processes required for verification of via formation and filling are inherently expensive since costly, high-precision machines are required for an extended period of time for each lamina and the cost of such machinery and its maintenance must be amortized over the number of devices produced, increasing the production cost of such devices.
Also, since the lamina are worked individually, while vias are formed, the potential for variation from uniformity is substantial and substantially exact repeatability is not assured. Filling of the vias is also difficult and less than fully reliable; often requiring inspection of each via in each lamina prior to lamination by stacking and joining.
As an additional complication, the electrical requirements for power and signal connections are very different. Signal connections require very little current to be carried and parasitic capacitances are relatively critical to the propagation of signals having significant voltage swings. Power connections, however, must carry substantial current but the current may vary widely while voltage variation must be kept to a minimum. Heat dissipation may also be an important consideration in the design of power connections. For this reason, power and signal connections are generally formed on different lamina of a multi-layer interconnection structure.
However, the use of different layers or lamina for different types of connections necessarily implies that some connections must pass through other layers or lamina by the use of vias. Short signal paths also generally implies that signal connection lamina and power connection lamina should be grouped together toward opposite sides of the multi-layer interconnections structure (i.e. the signal layers grouped near the top where integrated circuits are to be attached and power layers grouped in lower layers. The use of vias for interlayer connections also implies a substantial uniformity of conductor structures which must be used to meet the differing requirements of power and signal connections which are usually optimized in design for signals and a large plurality of vias used for power connections. For example, it is not unusual for 25% or more of the connections to integrated circuit chips to be dedicated to power connections and a similar fraction of available vias may be used for power connections in interconnection modules, as well. In fact, a higher percentage of vias may be required because of the relatively greater length of power connections through vias when power connection layers are grouped in the lower layers of a module. The number of power connections may also restrict design flexibility in regard to the number and location of vias available for signal connections. Due to the possibility of ohmic heating of power connections, circuitous connections through the MLM are undesirable and vias used for power connections are often formed by a group of adjacent vias of significant extent.
In practical effect, the combination of problems encountered in known multi-layer interconnection structures requires that wiring density be limited to a lower density than that which can be achieved at the present state of the art. For example, vias must be made larger and spacing between conductors must be increased to accommodate slight misregistration between lamina in order to achieve acceptable manufacturing yields. This limitation on wiring density also limits reduction of size and, hence, some performance parameters of electronic modules as well as limiting the economy with which such modules may be produced.

Modular circuit package having vertically aligned power and signal cores

International Business Machines Corporation


One embodiment provides a bar-handle vehicle brake control apparatus. The control apparatus includes an acceleration acquiring part and a control unit. The acceleration acquiring part acquires a tangential acceleration at a point where a straight line which connects a gravity center of a bar-handle vehicle and a front wheel axle intersects a circle which is centered at the front wheel axle. The control unit controls a front wheel brake based on the tangential acceleration.

In bar-handle vehicles, a so-called rear wheel lift phenomenon (rear lift) may occur in which a rear wheel is lifted when the load is shifted to the side of a front wheel as a result of abrupt braking while the vehicle is running
For example, JP-2002-029403-A proposes an anti-lock braking (ABS) control for a bar-handle vehicle in which a vehicle body deceleration is obtained based on wheel speeds and the occurrence of a rear lift is determined when the reduction degree of the vehicle body deceleration reaches the predetermined value.
Although it is intended for four-wheeled vehicles, JP-H06-255468-A proposes a technique in which, when abrupt braking is performed such that a temporal variation in vehicle body deceleration exceeds a predetermined value, the brake hydraulic pressures at front wheels are increased moderately so as to suppress the rear lift.
Although JP-2002-029403-A and JP-H06-255468-A disclose the technologies of suppressing the rear lift, in the field of bar-handle vehicles, there are still demands for a further improvement in the suppression of the rear lift to reduce further the influence on the running stability.

Bar-handle vehicle brake control apparatus


Display comprises static pixels and dots (individual element) arranged in a predetermined manner. Dynamic pixels are generated dynamically, comprising dots selected from at least two adjacent static pixels. Overlapping of dynamic pixels on the static pixels creates an enhanced resolution at the human's eyes.

The invention relates to a display comprising pixels and dots, including but not limited to the following display technologies: Cathode Ray Tube (CRT), Field Emission Display (FED), Vacuum Florescent Display (VFD), Plasma Display Panel (PDP), Liquid Crystal Display (LCD), Light Emitting Diode (LED), Organic Light Emitting Diode (OLED), Polymer Light Emitting Diode (PLED), Electroluminescence (EL), Electronic ink as well as a method for controlling the (said) display.
It is another objective of the present invention to adjust the light emitting area and space of different individual elements in a pixel contoured by black mask or barrier ribs of the same structure to optimize the luminance and the brightness of a display.
It is further objective of the present invention to provide a method to display high resolution video source like HDTV in a dynamic high resolution enhanced display of the present invention. Further to provide a method to display upscaling low resolution video source like SDTV, to be displayed on a dynamic high resolution enhanced display of the present invention.
It is another objective of the present invention to provide a dual mode (HDTV video mode and Computer text mode) in an HDTV enable WebTV for internet browsing as well as for watching HDTV quality video.

This patent is subject to a terminal disclaimer.

Dynamic pixel resolution, brightness and contrast for displays using spatial elements

Abstract: By adjusting the light emitting area and space of dots in a static pixel, maximum optimized brightness in a white balance equilibrium with good contrast can be obtained in finding an optimal ratio between the non light emitting area (black mask or black barrier ribs) and the light emitting area.


A method of completing a subterranean well and associated apparatus therefor provide efficient operation and convenience in completions where production of fluids from a lateral wellbore and a parent wellbore is desired. In one disclosed embodiment, the invention provides an efficient method of protecting a junction of multiple wellbore portions by positioning a tubular drilling guide within the well extending through the junction. In one aspect of the present invention, the drilling guide is sealingly engaged with certain ones of the wellbore portions while drilling operations are being performed.

The present invention relates generally to operations wherein a subterranean well is drilled and completed and, in a preferred embodiment thereof, more particularly provides a method and associated apparatus for drilling and completing a subterranean well.
If is well known in the art to drill an initial "parent" wellbore, and then to drill at least one "lateral" wellbore, that is, a wellbore intersecting and extending outwardly from the parent wellbore. Many methods and apparatus for drilling the lateral wellbore and for completing the parent and lateral wellbores have been conceived. For example, U.S. Pat. No. 4,807,704 to Hsu et al., discloses an apparatus and method wherein a whipstock is positioned in a cemented and cased parent wellbore to guide milling and drilling bits for forming the lateral wellbore, and the whipstock is then replaced with a guide member attached via a sealed conduit to a dual string packer. The guide member is utilized to guide a tubing string into the lateral wellbore after the guide member has been properly positioned in the parent wellbore and the packer has been set. The disclosure of U.S. Pat. No. 4,807,704 is hereby incorporated herein by this reference.
However, in keeping with the industry's efforts to provide advances in the state of this art, there is a need for more efficient, economical, convenient and safe methods and apparatus. From the foregoing, it can be seen that it would be quite desirable to provide a method and associated apparatus for completing a subterranean well which is generally economical and efficient in operation, and which provides increased functionality. It is accordingly an object of the present invention to provide such a method and associated apparatus. Other objects, features, and benefits of the present invention will become apparent upon careful consideration of the description hereinbelow.

Methods of completing a subterranean well and associated apparatus


A lens barrel and an image pickup apparatus include a flow path (70) that is provided at a position (A) where a first fixed lens frame (22) faces a movable lens frame (32) and a position (B) where the movable lens frame (32) faced the first fixed lens frame (22) as that air flow resistance can be generated when the air is released which is present between the first and second lens frames if these lens frames get close to each other. The flow path (70) is provided so that the air present between a fixed lens (20) and a movable lens (30) may also be passed through the flow paths when the first fixed lens frame (22) and the movable lens frame (32) get close to each other.

An image pickup apparatus such as a digital still camera or a digital video camera is equipped with a lens-barrel.
Such a lens-barrel has, on a position of a front of image pickup device for picking up an image of a subject, a lens that directs the image of subject toward the image pickup device, a lens frame that holds the lens and is provided as to be movable along a guide shaft extending along an optical axis of this lens, and a drive mechanism for moving the lens frame along the optical axis, in such a configuration that these lens, lens frame, and drive mechanism are arranged in the lens-barrel.
As such a drive mechanism, a lens-barrel employing a linear motor has been proposed (see Japanese Patent Application Publication No. Hei 11-150972).
That is, in this lens-barrel, a magnetic circuit configured by a magnet and a yoke is equipped to a barrel as a fixed part, and a coil is equipped to a lens frame as a movable part, in which passing an electric current through the coil allows to be generated magnetic interaction between the coil and the magnetic circuit, thereby enabling the lens frame to be moved along an optical axis.


A memory device can be directly mounted on a motherboard supporting DDR3 SDRAM, and then the memory device have advantages of the fly-by bus topology and the T branch topology established by the joint electron device engineering council (JEDEC). Thus, the system performance of a desktop computer in a unit interval can be enhanced.

1. Field of the Invention
The invention relates to a motherboard of a desktop computer and a memory device thereof and, more particularly, to a motherboard and a memory device which can process work at a higher frequency and enhance the system performance of a desktop computer in a unit interval.
2. Description of the Related Art
Generally speaking, the motherboard of a conventional desktop computer is usually provided with a memory slot for inserting a dual inline memory module (DIMM), which is a standard configuration established by the joint electron device engineering council (JEDEC) and commonly used by the motherboard of the conventional desktop computer.
The JEDEC establishes some reference design configuration for the unbuffered DIMM of the desktop computer. When memory chips on the unbuffered DIMM are double data rate two synchronous dynamic random access memory (DDR2 SDRAM), the JEDEC suggests using the T branch topology. When the memory chips on the unbuffered DIMM are double data rate three synchronous dynamic random access memory (DDR3 SDRAM), the JEDEC suggests using the fly-by bus topology.
FIG. 1 is a schematic diagram showing a conventional DIMM 100 using the T branch topology established by the JEDEC, and a terminator T is connected to a branch point A at the first layer. Theoretically, for the T branch topology established by the JEDEC, branch wires are completely symmetrical, and lengths of wires are balanced by bilateral symmetry. The branch wires are used to connect each of memory chips DDR2 SDRAM0 to DDR2 SDRAM7 on the unbuffered DIMM 100. Therefore, reflection effect of address line signals and command line signals sent out by a memory controller 101 is balanced off by each other to achieve the objective of not damaging the quality of the signals.
The address line signals and the command line signals sent out by the memory controller 101 are not delayed on their transmission path, and therefore, all the memory chips DDR2 SDRAM0 to DDR2 SDRAM7 can receive the address line signals and the command line signals sent out by the memory controller 101 at the same time. Then, the memory controller 101 can do read-write operation on the memory chips DDR2 SDRAM0 to DDR2 SDRAM7 at the same time to enhance the system performance of the desktop computer in a unit interval.
Under an actual condition, when the T branch topology established by the JEDEC is utilized to lay out the wires on a printed circuit board (PCB) for the unbuffered DIMM 100, branches are too much to obtain the completely symmetric branch wires and the wires with the balanced lengths. Then, the reflection effect of the address line signals and the command line signals sent out by the memory controller 101 cannot be balanced off by each other. Thus, the memory chips DDR2 SDRAM0 to DDR2 SDRAM7 receive the address line signals and command line signals which are deformed.
When the operation frequency of the unbuffered DIMM 100 is over a frequency range which is 533 MHz to 800 MHz and is established by the JEDEC, the address line signals and the command line signals sent out by the memory controller 101 may generate a resonant phenomenon. Then, the address line signals and the command line signals received by the memory chips DDR2 SDRAM0 to DDR2 SDRAM7 are seriously attenuated. The above deformed or attenuated signals are not wanted by designers in the computer industry.
FIG. 2 is a schematic diagram showing a conventional unbuffered DIMM 200 using the free-by bus topology established by the JEDEC. Theoretically, the signal transmission mode of the fly-by topology established by the JEDEC is illustrated as follows. A signal is transmitted from the memory chip DDR3 SDRAM0, and then it is transmitted to the memory chips DDR3 SDRAM1 to DDR3 SDRAM7 in series. Finally, a terminator T is connected to the end of the signal transmission path to prevent the address line signals and the command line signals sent out by the memory controller 201 from being reflected. Therefore, since the reflection effect is nearly nonexistent, the address line signals and the command line signals sent out by the memory controller 201 have preferred signal quality, and work at a higher frequency can be processed. The operation frequency established by the JEDEC is 800 MHz to 1600 MHz. Since the fly-by topology established by the JEDEC does not have many branches, the wiring mode of laying out the wires on the PCB is simple.
Under the fly-by bus topology established by the JEDEC, since the address line signals and the command line signals sent out by the memory controller 201 are transmitted from the memory chip DDR3 SDRAM0 to the memory chip DDR3 SDRAM7 in series, the transmitted signals are delayed. The memory chips DDR3 SDRAM0 to DDR3 SDRAM7 begin to work at different time after they receive the address line signals and the command line signals sent out by the memory controller 201, and therefore, the memory controller 201 has to wait for delay time before it does read-write operation on the memory chips DDR3 SDRAM0 to DDR3 SDRAM7. Therefore, the system performance of the desktop computer in a unit interval decreases.
Since the memory controller 201 has to wait for the delay time before it does the read-write operation on the memory chips DDR3 SDRAM0 to DDR3 SDRAM7, the memory controller 201 has to have the capability of independently controlling each of the memory chips DDR3 SDRAM0 to DDR3 SDRAM7 to finish the read-write operation. Therefore, the design of the memory controller 201 is relatively complex.


A composite product comprising an imitation leather microfibrous fabric and an impermeable polymer film coupled thereto by an adhesive material, said impermeable film being so selected that it will adhere as a coating on a polymeric plastic article manufactured in a mold by the cold injection molding technique at the time of the injection molding operations for preparing said polymeric plastic article when the composite product is present in the mold fitted to the inside surface of the mold and the impermeable polymer film side of the composite product faces the interior of the mold while preventing passage of the injected polymeric plastic through the imitation leather microfibrous fabric and the molded article coated with the composite product.

Woven or non-woven microfibrous materials, comprising synthetic polymer microfibers generally consisting of polyester or polyamide are known in the art. Said materials have the appearance of the natural leather and some among these materials, namely the ones in which the polymer microfibrous non-woven material is immersed in a polymer matrix, preferably polyurethane, exhibit "hand", lightweight, velour-like, fastness to light and nitrogen oxide characteristics even better than the natural leather. Moreover those materials, thanks to its good characteristics constitute a valuable product widely used in the garment industry, furniture manufacture, and interior decoration of vehicles, boats and other transportation equipment.

Composite product consisting of microfibrous material and a polymer film, useful for coating cold injection molding manufactured articles