A power supply assembly that can be miniaturized even though an applied voltage to a load is rendered variable, and a semiconductor testing system using the same are put into practice. With an improvement of the power supply assembly for finding an error against a set voltage by feeding back an applied voltage applied to a load, and applying a predetermined voltage to the load by causing an output amplifier to increase and decrease amperage to be fed to the load on the basis of the error, it is characterized in provided a voltage converter causing a voltage level of a power supply voltage of the output amplifier to follow up a voltage level of the set voltage.

With a semiconductor testing system (including so-called an IC tester, LSI tester, and so forth; hereinafter referred to merely as a tester), it is necessary to supply a device as a test subject {hereinafter referred to as a DUT (Device Under Test)} with a voltage with high precision in order to inspect and test the DUT with good precision. Accordingly, a tester is provided with a power supply assembly capable of outputting a voltage with high precision. Determination on whether or not a DUT is acceptable has been made by taking measurements on current flowing from the power supply assembly to the DUT. The DUT includes, for example, an IC, LSI, and so forth (refer to, for example, Patent Document 1).
FIG. 6 is a block diagram showing a configuration of a tester using a conventional power supply assembly.
In FIG. 6, a power supply assembly 100 is installed in a tester main body, and comprises a voltage buffer 1, a DAC 2, an error amplifier 3, an output amplifier 4, a current detection circuit 5, and a current measurement circuit 6, wherein the power supply assembly 100 outputs voltage and current to a DUT 7 while monitoring a level of a voltage applied to the DUT 7.
The DUT 7 is a load, and has a plurality of terminals for input/output, and a predetermined voltage Vout is applied from the power supply assembly 100 to a desired terminal (a DUT terminal). Further, the DUT 7 is placed on the top of a performance board (not shown) of a test head (not shown) of the tester.
The voltage buffer 1 has a noninverting input terminal, to which an applied voltage Vout to the DUT 7 is inputted. The DAC 2 is a kind of a voltage generation circuit, and outputs a predetermined set voltage Vout. An output voltage from the voltage buffer 1, and an output voltage from the DAC 2 are inputted to the error amplifier 3.
An error signal from the error amplifier 3 is inputted to the output amplifier 4, which either increase or decrease amperage to the DUT terminal of the DUT 7, thereby applying a voltage Vout as corrected by an error portion to the DUT 7. Further, with the output amplifier 4, an output terminal is connected to an inverting input terminal. Still further, the output amplifier 4 is driven by a power supply voltage (voltage level: VDD on the plus side, and VEE on the minus side) from a power supply unit U 1. In this case, the power supply unit U 1 constantly outputs a voltage at a given level regardless of an output voltage, and an output current of the output amplifier 4.
The current detection circuit 5 is provided between the output amplifier 4, and the DUT 7. The current measurement circuit 6 takes measurements on current by the agency of a signal from the current detection circuit 5. Further, the power supply voltage from the power supply unit U 1 is also fed to the voltage buffer 1, the DAC 2, the error amplifier 3, the current detection circuit 5, and so forth, although not shown in the figure.
Operation of the tester is described hereinafter.
The DAC 2 outputs the predetermined set voltage Vout. A voltage signal from the DAC 2 is inputted to a noninverting input terminal of the error amplifier 3, and a voltage being applied to the DUT 7 is inputted to an inverting input terminal of the error amplifier 3 via the voltage buffer 1, as being fed back.
Further, the error amplifier 3 amplifies an error within a amplifier 4. Then, the output amplifier 4 increases or decreases the amperage fed to the DUT 7 on the basis of the error signal from the error amplifier 3 so as to reduce a voltage error at the error amplifier 3. That is, the set voltage of the DAC 2 is used as a reference.
The applied voltage to the DUT 7, after varied by an increase or a decrease in amperage, is fed back again to the error amplifier 3 via the voltage buffer 1, and the error amplifier 3 detects an error. Further, the output amplifier 4 causes an increase or a decrease in amperage so as to reduce the error. Thus, a level of the voltage applied to the DUT 7 is finally rendered equivalent to that of the set voltage Vout of the DAC 2 to be subsequently maintained.
Meanwhile, the current detection circuit 5 converts current applied to the DUT 7 into voltage, and an ADC (not shown) of the current measurement circuit 6 executes A/D conversion of the voltage to be then outputted to a determination circuit (not shown) in a later stage, whereupon the determination circuit determines whether or not the DUT 7 is acceptable.
FIG. 7 is a block diagram showing a configuration of a tester with a plurality of channels of the power supply assemblies 100 mounted therein. The power supply assemblies 100 each apply a voltage to different terminals of a DUT 7, however, the power supply voltage (VDD, VEE) from the same power supply unit U 1 is supplied to respective output amplifiers 4.
Further, a primary cause for occurrence of the error between the set voltage of the DAC 2, and the applied voltage to the DUT 7 is occurrence of a potential difference between a preference potential of the DAC 2, and a reference potential of the DUT 7. The DUT 7 is normally connected to the ground at a reference potential of a whole tester (the reference potential of the DAC 2 as well is equivalent to the ground potential as the reference potential of the whole tester). Upon flow of current at a large amperage to the DUT 7, however, a voltage drop occurs to a signal line form the DUT 7 to the ground. Accordingly, the reference potential of a system ground differs from the reference potential of the DUT 7 (voltages at respective terminals of the DUT 7, at the reference potential thereof), thereby causing a difference between the reference potential of the DAC 2, and the reference potential of the DUT 7. Other causes for the error include, for example, a voltage drop accompanying resistance in flow paths up to the current detection circuit 5, and up to the DUT 7, respectively.
[Patent Document 1] JP 2005-98896 A
With the structure of the power supply assembly and semiconductor testing system using same, the output voltage of the power supply assembly 100 has a variable voltage level, that is, the set voltage that can be outputted by the DAC 2 is rendered variable so as to be able to cope with the kind of a device, and various test items. To give an example of a specification, the output voltage is set in a range of 0 to 10 V. The power supply voltage level of the output amplifier 4 need to have a potential difference equivalent to the output voltage outputted by the output amplifier 4 with a bias voltage added thereto. For example, there is the need for the potential difference ΔV=approx. 5 V. Accordingly, because the level of the power supply voltage (VDD, VEE) supplied to the output amplifier 4 is fixed, the level of the power supply voltage VDD on the plus side need be at least 15 V in order to meet the specification in respect of the output voltage of the power supply assembly 100.
Further, in the case where a plus current Iout is consumed at the DUT 7, the current lout is fed to the DUT 7 via a plus side power supply voltage terminal (the voltage level VDD side) of the output amplifier 4. In the case where a minus current Iout is consumed at the DUT 7, the current Iout is absorbed from the DUT 7 via a minus side power supply voltage terminal (the voltage level VEE side) of the output amplifier 4.
And, the power supply voltage levels VDD, VEE (that is, the respective levels of the voltages outputted by the power supply unit U 1) of the output amplifier 4 are under control by a constant voltage operation without depending on the set voltage of the DAC 2, and the current Iout consumed at the DUT 7.
Now, FIG. 8 is a conceptual view showing consumed power of the output amplifier 4, as a loss of a plus side output. Assuming by way of example that VDD=15 V, Vout=1 V, and Iout=5 A, power loss at the output amplifier 4 will be 70 W={(the power supply voltage level−the output voltage level)×the output current}. Further, if Vout=0 V, a loss of consumed power will be 75 W at the maximum. Then, the consumed power is released in the form of heat from the output amplifier 4.
FIG. 9 is a conceptual view showing the total current and output power which the power supply assemblies 100 in whole can output when the plurality of the channels of the power supply assemblies 100 are mounted as shown in FIG. 7. Assuming by way of example that Vout=10 V (the maximum output level), ΔV=5 V, and rated output power of the power supply unit U 1=150 W, the total current will be 10 A at the maximum regardless of the set voltage of the DAC 2, so that the lower the voltage level of the set voltage, the lower will be utilization efficiency of electric power.
In particular, there have lately been seen trends for lower voltage and lager amperage in the case of a device used as the DUT 7 to be measured by a semiconductor testing system. In the case of outputting a large amperage at such a low voltage to the device, a heat release problem with the conventional power supply assembly 100 has posed a very significant problem. Accordingly, a heat release design for the power supply assembly 100 becomes larger in scale, thereby creating causes for an increase in size as well as cost of the power supply assembly 100.
In addition, because the semiconductor testing system has a multitude of the power supply assemblies 100, magnitude of heat release becomes significant, and reduction in size of the power supply assembly is difficult to implement, so that there has arisen a problem of difficulty in checking the cost thereof.

Power supply assembly and semiconductor testing system using same


A user interface to display and manage a plurality of entities as if a single entity is provided. The user interface includes a representation of the collection of entities as a whole, and a representation of members associated with the entity. If an action is performed on the representation of the entities as a whole, then the action is propagated to the collection of entities, if the action is performed on the representation of the member associated with the entity, then the action is directed to the member.

With the advent of Internet applications, computing system requirements and demands have increased dramatically. Many businesses, for example, have made important investments relating to Internet technology to support growing electronic businesses such as E-Commerce. Since companies are relying on an ever increasing amount of network commerce to support their businesses, computing systems generally have become more complex in order to substantially ensure that servers providing network services never fail. Consequently, system reliability is an important aspect to the modern business model.
A first approach for providing powerful and reliable services may be associated with a large multiprocessor system (e.g., mainframe) for managing a server, for example. Since more than one processor may be involved within a large system, services may continue even if one of the plurality of processors fail. Unfortunately, these large systems may be extraordinarily expensive and may be available to only the largest of corporations. A second approach for providing services may involve employing a plurality of lesser expensive systems (e.g., off the shelf PC) individually configured as an array to support the desired service. Although these systems may provide a more economical hardware solution, system management and administration of individual servers is generally more complex and time consuming.
Currently, management of a plurality of servers is a time intensive and problematic endeavor. For example, managing server content (e.g., software, configuration, data files, components, etc.) requires administrators to explicitly distribute (e.g., manually and/or through custom script files) new or updated content and/or configurations (e.g., web server configuration, network settings, etc.) across the servers. If a server's content becomes corrupted, an administrator often has no automatic means of correcting the problem. Furthermore, configuration, load-balance adjusting/load balance tool selection, and monitoring generally must be achieved via separate applications. Thus, management of the entity (e.g., plurality of computers acting collectively) as a whole generally requires individual configuration of loosely coupled servers whereby errors and time expended are increased.
Presently, there is not a straightforward and efficient system and/or process for managing and administering a collection of independent servers. Many problems are thereby created since administrators may be generally required to work with machines individually to setup content, tools, monitor server state and administer each server. Due to the need to administer and modify content on each machine individually, errors are a common occurrence. For example, it is routine for portions of server content to get out of sync with a master copy of content associated with the collection of servers. Additionally, setting up load-balancing for servers, wherein each server may be given a suitable amount of work, is often a painful and error prone process. For example, load-balancing often requires knowledge of intimate details of load-balancing tools which are often difficult and complex to work with.
Another problem associated with management of a plurality of servers is related to adding additional servers to the system. Adding servers is generally time intensive and error prone since the new server generally must be manually configured as well as having the system content copied to the new server. Furthermore, server configuration settings generally need to be adjusted along with the content.
Still yet another problem associated with management is related to receiving system wide performance results and/or status views of the collection of servers. Some applications may exist that provide performance or status of an individual server, however, these applications generally do not provide performance or status across the logical collection of loosely coupled servers. For example, many times it is important to view information from the collection of servers to determine relevant system-wide performance. Thus, getting a quick response view of pertinent performance information (e.g., requests/second, memory used) associated with the plurality of servers may be problematic, however, since each server generally must be searched independently.
Currently, there is not an efficient and straightforward interface for managing and administering an entity without substantial and sometimes complex individual configuration/monitoring of each member associated with the entity. Consequently, there is an unsolved need in the art for a user interface to manage, create, administer, configure and monitor a group of servers operating as an entity.

User interface to display and manage an entity and associated resources


A mobile vehicle 1A includes a front-wheel support mechanism 4 having a trail adjustment mechanism 9, a steering actuator 8 which generates a steering force for steering a front wheel 3f, a trail adjustment actuator 15 which generates a driving force for changing a trail of the front wheel 3f, and a control device 50. The control device 50 has a function of controlling the steering actuator 8 so as to stabilize the posture of a vehicle body 2, and a function of controlling the trail adjustment actuator 15 in accordance with an observed value of the vehicle speed.

1. Field of the Invention
The present invention relates to a mobile vehicle (mobile object) such as a two-wheeled vehicle having a front wheel and a rear wheel.
2. Description of the Related Art
In a mobile vehicle, for example a motorcycle, having a front wheel and a rear wheel arranged spaced apart from each other in the longitudinal direction of the vehicle body, the front wheel usually serves as a steered wheel.
Further, a motorcycle in which the rear wheel is made steerable, in addition to the front wheel, is also known as seen, for example, in Japanese Patent Application Laid-Open No. 2008-260316 (hereinafter, referred to as "Patent Literature 1"). In the motorcycle of this Patent Literature 1, the rear wheel is steered as appropriate, in accordance with the traveling conditions, to improve the turning performance, for example, of the vehicle.
In a motorcycle of this type, the steering axis of the front wheel (rotational axis of steering of the front wheel) is generally arranged such that the point of intersection of the steering axis and the ground surface with which the wheels come into contact lies in front of the ground contact point of the front wheel (i.e. such that the trail becomes positive).


A layout designing apparatus and a layout designing method that can improve the uniformity of the pattern density of a layout pattern in which dummy patterns are formed, and a semiconductor device manufactured using the layout designing method can be obtained. The layout designing method includes the steps of entering a plurality of circuit patterns of a semiconductor device; recognizing the positional data of the entered plurality of circuit patterns; producing a dummy pattern group including a plurality of dummy patterns, each of which being arranged per repetitive distance determined based on the recognized positional data of the circuit patterns; extracting a final dummy pattern including a dummy pattern located in a region not overlapping with the circuit patterns from the dummy pattern group; and outputting a layout pattern including the extracted final dummy pattern and the circuit patterns.

1. Field of the Invention
The present invention relates to a layout designing apparatus, a layout designing method and a semiconductor device, and more particularly, to a layout designing apparatus outputting a layout pattern including a dummy pattern, a layout designing method, and a semiconductor device manufactured using the same.
2. Description of the Background Art
Conventionally, a photolithographic processing technology has been used for forming predetermined interconnections, electrodes and so forth in the process of manufacturing a semiconductor device. In the photolithographic processing technology, a resist film is formed on the surface of a semiconductor substrate, and thereafter transfers a pattern to be transferred (hereinafter referred to as xe2x80x9ctransfer patternxe2x80x9d) formed on a photomask onto this resist film by exposure and development processes.
Here, the resist film onto which the transfer pattern is transferred is formed on an interlayer insulating film or the like formed on the surface of the semiconductor substrate. A substructure such as interconnections or electrodes are generally formed under the interlayer insulating film. Because of such a substructure, an irregular portion may be formed on the upper surface of the interlayer insulating film. Existence of such an irregular portion forms a resist-film irregular portion corresponding to the irregular portion on the upper surface of the resist film formed on the interlayer insulating film. In a region where such a resist-film irregular portion is formed, the distance between the photomask and the upper surface of the resist film will be locally varied in the exposure step of transferring the transfer pattern of the photomask onto the resist film. This has caused problems such that the dimension of the transfer pattern transferred onto the resist film is varied, or that the transfer pattern is not resolved.
To prevent such problems from occurring, a step of planarizing the upper surface of the interlayer insulating film by the CMP (Chemical Mechanical Polishing) method is carried out before forming of the resist film. However, when the density of interconnections or the like in the substructure is not uniform and steps in the irregular portion on the upper surface of the interlayer insulating film are large, it was sometimes difficult to sufficiently planarize the upper surface of the interlayer insulating film by the CMP method.
Therefore, conventionally, a method has been employed in which dummy interconnections are formed in a region where no interconnection exists as the substructure to make the density of structures such as the interconnections uniform in the substructure in order to reduce the steps in the irregular portion (to increase the flatness) on the upper surface of the interlayer insulating film. To form such dummy interconnections, a layout designing method as described below is executed in a layout designing step in the manufacturing process of a semiconductor device.
FIG. 30 is a flow chart for illustrating a conventional layout designing method. Further, FIG. 31 is a schematic view showing a layout pattern obtained by the layout designing method shown in FIG. 30. Referring to FIGS. 30 and 31, the conventional layout designing method will be described.
Referring to FIGS. 30 and 31, in a dummy pattern arrangement method of the conventional layout designing method, first, the step of entering circuit patterns 101a to 101c such as interconnections constituting a circuit of the semiconductor device (S110) is executed. In this step of entering the circuit patterns (S110), data of the coordinates of circuit patterns 101a to 101c are entered and held in a memory of a computer system in which a software executing the layout designing method is installed.
Next, the step of producing dummy patterns 103a and 103b (S130) on the entire surface of a chip region in which circuit patterns 101a to 101c are arranged is executed. In the step of producing dummy patterns (S130), dummy patterns 103a and 103b are arranged in a matrix with a predetermined pitch. Further, the size of dummy patterns 103a and 103b are also predetermined. These dummy patterns 103a and 103b are the patterns for forming dummy interconnections.
Subsequently, the step of extracting dummy patterns 103a (S140), which are located in regions that are not overlapping with circuit patterns 101a to 101c and are spaced by predetermined distances from circuit patterns 101a to 101c, is executed.
Thereafter, the step of outputting a layout pattern (S150), including dummy patterns 103a extracted in the step of extracting the dummy patterns (S140) and circuit patterns 101a to 101c, is executed. Thus, the layout pattern can be obtained in which dummy patterns 103a indicated by the solid line are arranged in the regions where none of circuit patterns 101a to 101c is formed, as shown in FIG. 31.
Then, the transfer pattern of a photomask is formed based on such a layout pattern. Moreover, interconnections and dummy interconnections are formed on the semiconductor substrate based on this transfer pattern by the photolithographic processing.
The above-described conventional layout designing method had a problem as described below. In the conventional layout designing method, values that were predetermined irrespective of circuit patterns 101a to 101c were used for the size and the pitch of dummy patterns 103a and 103b in the step of producing dummy patterns (S130). In such a case, the pitches with which circuit patterns 101a to 101c are formed and the pitch with which dummy patterns 103a and 103b are formed may be different. Thus, circuit patterns 101a to 101c and dummy patterns 103a and 103b would overlap with each other more than necessary as shown in FIG. 31, and hence the number of dummy patterns 103b not extracted in the step of extracting dummy patterns (S140) would be increased. As a result, there were some cases in the layout pattern obtained in the step of outputting the layout pattern (S150), such that dummy patterns were not arranged in portions with enough spaces for the dummy patterns to be arranged (e.g. the region between circuit pattern 101b and circuit pattern 101c), and the uniformity of the pattern density were insufficient.
As such, when the pattern density is not sufficiently made uniform, not enough dummy interconnections will be arranged around the interconnections in the structure of the semiconductor device formed based on this layout pattern. This results in formation of an irregular portion on the upper surface of the interlayer insulating film formed on the structure of such interconnections or the like, which was sometimes impossible to be planarized by the CMP method.
It is an object of the present invention to provide a layout designing apparatus and a layout designing method capable of improving uniformity of the pattern density of a layout pattern in which a dummy pattern is formed, and to provide a semiconductor device manufactured using the layout designing method.
A layout designing apparatus according to one aspect of the present invention includes an entry unit for entering a plurality of circuit patterns of a semiconductor device; a recognition unit for recognizing positional data of the entered plurality of circuit patterns; a dummy pattern arrangement unit for producing a dummy pattern group including a plurality of dummy patterns, each of the plurality of dummy patterns being arranged per repetitive distance determined based on the recognized positional data of the circuit patterns; an extraction unit for extracting a final dummy pattern including a dummy pattern located in a region other than a region overlapping with the circuit patterns, from the dummy pattern group; and an output unit for outputting a layout pattern including the extracted final dummy pattern and the circuit patterns.
A case is now considered where dummy patterns are arranged between two adjacent circuit patterns spaced such that the dummy patterns can be arranged in between. When the repetitive distance and the arrangement of the dummy patterns are determined independent of the circuit patterns as in the conventional case, even if a plurality of dummy patterns were arranged between the circuit patterns as described earlier, all of the dummy patterns would be partially overlapped with the circuit patterns, which may result that no dummy pattern would be arranged between these circuit patterns in the final dummy pattern. However, according to the present invention, the repetitive distance of the dummy patterns is determined based on the positional data of the circuit patterns, so that the repetitive distance can be selected such that the dummy patterns can be arranged between two circuit patterns so as not to overlap with the two circuit patterns. Thus, the dummy patterns can reliably be arranged between the two circuit patterns in the final dummy pattern. Therefore, the region, in which no dummy pattern is arranged even though there is a space for dummy patterns to be arranged, can be reduced. As a result, a layout pattern having a more uniform pattern density compared to that of the conventional case can be attained using the layout designing apparatus according to the present invention.
In the layout designing apparatus according to the above-described one aspect of the present invention, the recognition unit may include a pitch recognition unit for recognizing a pitch in one direction of the circuit patterns, and the dummy pattern arrangement unit may include a unit for determining a submultiple distance of the recognized pitch as the repetitive distance.
In this case, the dummy patterns can be arranged with a pitch smaller than the pitch of the circuit patterns in one direction of the circuit patterns, so that the dummy patterns can reliably be arranged between the circuit patterns. Thus, the size of the region where no dummy pattern is arranged between the circuit patterns can be reduced in the final dummy pattern. As a result, the pattern density can be more uniform in the layout pattern.
In the layout designing apparatus according to the above-described one aspect of the present invention, the dummy pattern group may include a plurality of additional dummy patterns located between the plurality of dummy patterns, and the final dummy pattern includes the additional dummy patterns located in a region other than a region overlapping with the circuit patterns.
In this case, the additional dummy patterns will be arranged at positions displaced from the dummy patterns by a distance smaller than the repetitive distance.
Here, a case is considered where convex or concave portions are locally formed in the two-dimensional geometry of the circuit patterns. In a region near such convex or concave portions, it may be difficult to sufficiently improve the pattern density by the dummy patterns alone that are arranged with the above-described repetitive distance. Specifically, in the portion where, for example, a convex portion is formed in a circuit pattern, the distance between dummy patterns and the convex portion of the circuit pattern would be shorter, or the convex portion and the dummy patterns are partially overlapped with each other, resulting that no dummy patterns can be arranged in the final dummy pattern. Further, in the portion where, for example, a concave portion is formed in a circuit pattern, the distance between the dummy patterns and the concave portion of the circuit pattern would be larger, decreasing the pattern density compared to the other portions.
Thereat, application of the additional dummy patterns in such a region is considered, that are arranged at positions displaced from the dummy patterns as described above. For example, in the region where a convex portion is formed in a circuit pattern, application of the additional dummy patterns displaced from the dummy patterns in the direction away from the convex portion allows the additional dummy patterns to be arranged in this region so as not to overlap with the convex portion, in such a case that the dummy patterns are partially overlapped with the convex portion. Moreover, in the region where the concave portion is formed in the circuit pattern, the application of the additional dummy patterns displaced from the dummy patterns in the direction approaching the concave portion allows reduction of the distance between the concave portion and the additional dummy patterns. Furthermore, in a case where only one of the dummy patterns arranged per repetitive distance can be arranged in the region described above, application of the additional dummy patterns allows arrangement of more additional dummy patterns in the region. Thus, more uniform pattern density can be attained in the layout pattern.
In the layout designing apparatus according to the above-described one aspect of the present invention, each of the plurality of dummy patterns is preferably arranged per repetitive distance using positions of the circuit patterns as a reference.
In this case, the dummy patterns can reliably be arranged between the circuit patterns by using the positions of the circuit patterns as a reference. This can reduce the number of dummy patterns that are partially overlapping with the circuit patterns. Therefore, the region where dummy patterns are formed can be increased in the final dummy pattern, so that a layout pattern having an improved uniformity of the pattern density can be obtained.
In the layout designing apparatus according to the above-described one aspect of the present invention, the dummy pattern arrangement unit may arrange the dummy patterns in a partial region including the circuit patterns, of a region forming a layout pattern, and the output unit may output a layout pattern including a partial layout pattern for the partial region.
As for the layout designing, in a portion of a region forming the layout pattern (hereinafter referred to as a chip region) of a semiconductor device of which the layout is designed, the layout of a partial region, i.e. a part of the chip region, may be determined using an automatic arrangement/interconnection software. Moreover, one chip region may have a plurality of such partial regions arranged therein. Furthermore, the pitch with which the circuit patterns are formed may be different for each partial region. In such a case, optimal dummy patterns can be obtained for each of the partial regions if a layout pattern is to be output per partial region. As a result, generation of the region having a non-uniform pattern density can be prevented in the layout pattern.
In the layout designing apparatus according to the above-described one aspect of the present invention, the output unit may output a layout pattern including a peripheral dummy pattern located in a region other than a region occupied by the partial layout pattern, of the region forming the layout pattern.
In this case, the arrangement of the dummy patterns can be optimized in the partial region (the region occupied by the partial layout pattern) in a region forming the layout pattern, and the pattern density can be made uniform for the entire region forming the layout pattern by arranging the peripheral dummy pattern also in the region other than the partial region.
In the layout designing apparatus according to the above-described one aspect of the present invention, the peripheral dummy pattern is arranged based on a repetitive distance determined independently of a distance between the plurality of circuit patterns.
In this case, the repetitive distance or the like can be predetermined for the peripheral dummy pattern, so that the arrangement step of the peripheral dummy pattern can be simplified. Therefore, the time needed for the layout designing using the layout designing apparatus according to the present invention can be shortened.
A layout designing method according to another aspect of the present invention includes the steps of entering a plurality of circuit patterns of a semiconductor device; recognizing positional data of the entered plurality of circuit patterns; producing a dummy pattern group including a plurality of dummy patterns, each of the plurality of dummy patterns being arranged per repetitive distance determined based on the recognized positional data of the circuit patterns; extracting a final dummy pattern including a dummy pattern located in a region other than a region overlapping with the circuit patterns, from the dummy pattern group; and outputting a layout pattern including the extracted final dummy pattern and the circuit patterns.
A case is now considered where dummy patterns are arranged between two adjacent circuit patterns spaced such that the dummy patterns can be arranged in between. In such a case, according to the present invention, the repetitive distance of the dummy patterns is determined based on the positional data of the circuit patterns, so that the repetitive distance can be selected such that the dummy patterns can be arranged between two circuit patterns so as not to overlap with the two circuit patterns. Thus, the dummy patterns can reliably be arranged between the two circuit patterns in the final dummy pattern. Therefore, the region, in which no dummy pattern is arranged even though there is a space for dummy patterns to be arranged, can be reduced. As a result, the pattern density of the layout pattern can be improved while being made uniform.
In the layout designing method according to the above-described another aspect of the present invention, the step of recognizing may include a step of recognizing a pitch in one direction of the circuit patterns; and the step of producing the dummy pattern group may include a step of determining a submultiple distance of the recognized pitch as the repetitive distance.
In this case, the dummy patterns can be arranged with a pitch smaller than the pitch of the circuit patterns in one direction of the circuit patterns, so that the dummy patterns can reliably be arranged between the circuit patterns. Thus, the size of the region where no dummy pattern is arranged between the circuit patterns can be reduced in the final dummy pattern. As a result, the pattern density can be more uniform in the layout pattern.
In the layout designing method according to the above-described another aspect of the present invention, the dummy pattern group may include a plurality of additional dummy patterns located between the plurality of dummy patterns, and the final dummy pattern may include the additional dummy patterns located in a region other than a region overlapping with the circuit patterns.
In this case, the additional dummy patterns will be arranged at positions displaced from the dummy patterns by a distance smaller than the repetitive distance. When convex or concave portions are locally formed in the circuit patterns, it may be difficult to sufficiently improve the pattern density by the dummy patterns alone that are arranged with the above-described repetitive distance, in a region near the portion in which the convex or concave portions are formed as described above.
Thereat, the additional dummy patterns that are arranged at positions displaced from the dummy patterns as described above are applied in such a region. For example, in the region where a convex portion is formed in a circuit pattern, application of the additional dummy patterns displaced from the dummy patterns in the direction away from this convex portion allows the additional dummy patterns to be arranged in this region so as not to overlap with the convex portion, in such a case that the dummy patterns are partially overlapped with the convex portion as described above. Moreover, when a concave portion is formed in the circuit pattern, the additional dummy patterns can be arranged near the concave portion as described above. Thus, more uniform pattern density can be attained in the layout pattern.
In the layout designing method according to the above-described another aspect of the present invention, each of the plurality of dummy patterns is preferably arranged per repetitive distance using positions of the circuit patterns as a reference.
In this case, the dummy patterns can reliably be arranged between the circuit patterns by using the positions of the circuit patterns as a reference. This can reduce the number of dummy patterns that are partially overlapping with the circuit patterns. Therefore, the region where dummy patterns are formed can be increased in the final dummy pattern, so that a layout pattern having an improved uniformity of the pattern density can be obtained.
In the layout designing method according to the above-described another aspect of the present invention, the step of producing the dummy pattern group may include arrangement of the dummy patterns in a partial region including the circuit patterns, of a region forming a layout pattern, and the step of outputting may include outputting of a layout pattern including a partial layout pattern for the partial region.
As for the layout designing, in a portion of a region forming the layout pattern (chip region) of a semiconductor device of which the layout is designed, the layout of a partial region, i.e. a part of the chip region, may be determined using an automatic arrangement/interconnection software. Moreover, one chip region may have a plurality of such partial regions arranged therein. Furthermore, the pitch with which the circuit patterns are formed may be different for each partial region. In such a case, optimal dummy patterns can be obtained for each of the partial regions if a layout pattern is to be output per partial region.
In the layout designing method according to the above-described another aspect of the present invention, the step of outputting may include outputting of a layout pattern including a peripheral dummy pattern located in a region other than a region occupied by the partial layout pattern of the region forming the layout pattern.
In this case, the arrangement of the dummy patterns can be optimized in the partial region (the region occupied by the partial layout pattern) in a region forming the layout pattern, and the pattern density can be made uniform for the entire region forming the layout pattern by arranging the peripheral dummy pattern also in the region other than the partial region.
In the layout designing method according to the above-described another aspect of the present invention, the peripheral dummy pattern may be arranged based on a repetitive distance determined independently of a distance between the plurality of circuit patterns.
In this case, by predetermining the repetitive distance or the like for the peripheral dummy pattern, the arrangement step of the peripheral dummy pattern can be simplified. Therefore, the time needed for the layout designing using the layout designing apparatus according to the present invention can be shortened.
A semiconductor device according to a further aspect of the present invention is manufactured using the layout designing method according to the above-described another aspect of the present invention.
In such a manner, the pattern density can be made uniform in the layout pattern, and hence interconnections corresponding to the circuit patterns and dummy interconnections corresponding to the dummy patterns can be made more uniform in the interconnection layer or the like corresponding to the layout pattern in the semiconductor device. As a result, when an interlayer insulating film is formed on the interconnections and the dummy interconnections, the flatness of the upper surface of the interlayer insulating film can be improved.
The foregoing and other objects, features, aspects and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings.

Apparatus for layout designing of semiconductor device, method of layout designing, and semiconductor device


A posterior stabilized femoral trial apparatus for preparing a patient's femur to receive a posterior stabilized femoral prosthesis includes a trial body with proximal and distal portions, the distal portion having an articulating surface for articulating with a patient's tibial component. A module fits the trial body at the proximal surface, the module being selected from a kit or group of modules of differing sizes and shapes. The module includes a rasping surface that extends longitudinally. The trial body includes cutting surfaces at the posterior condyles. The module is removably attachable to the trial body at the proximal surface. During use, the apparatus of the present invention enables the surgeon to resect the patient's femur in a revision surgical case using the trial itself and more particularly the rasping surface and cutting surface thereon.

1. Field of the Invention
The present invention relates to orthopedic surgical instrumentation, and more particularly to an improved femoral trial prosthesis apparatus having particular utility in knee joint replacement surgery (particularly revision surgical cases) wherein a previous femoral prosthesis has been removed by a surgeon. Even more particularly, the present invention relates to an improved posterior stabilized-type femoral trial apparatus for preparing a patient's femur to receive a posterior stabilized femoral prosthesis wherein a trial body carries a module selected from a kit of modules, each module including cutting and rasping surfaces that extend longitudinally and a stem portion for accepting a stem member from a kit of various stem members of differing sizes and diameters.
2. General Background of the Invention
When a surgeon removes a previous femoral implant, it is known in the art as a "revision" case. A surgeon must remove that previous femoral implant and replace it with a new implant. However, often the patient has weakened or reduced bone tissue for attachment.
In the case of revision femoral implant surgery, surgeons often use a posterior stabilized-type femoral implant. Such a posterior stabilized femoral implant is sold by Smith & Nephew of Memphis, Tennessee as part of the Genesis Total Knee System or the Profix Total Knee System.
The surgeon may attempt to use a trial prosthesis to first determine the appropriate size and shape of the final prosthesis to be implanted.

Trial femoral prosthesis for use in knee joint replacement surgery


A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.

To ensure thickness uniformity of thin films coated on chips in a chamber for sputter deposition, air cooling is often performed to maintain temperature uniformity among the chips. However, referring to FIG. 1, for a conventional chip carrier device that includes an adhesive film 201 where chips 202 are adhered thereto, cooling air 101 blown toward the adhesive film 201 may cause deformation of the adhesive film 201 because the adhesive film 201 is soft and is supported merely by a surrounding frame 203 at a peripheral portion of the adhesive film 201, which is disposed on a platform 100. The deformation of the adhesive film 201 would move the chips 202 adhered thereto from their original positions with respect to the platform 100, disrupting temperature uniformity among the chips 202 and as a result, thickness uniformity of thin films coated on the chips 202 may not be ensured.
U.S. Patent Application Publication No. 20170117184 discloses a double-sided adhesive film that is utilized to hold chips on one side and have a supporting plate adhered to the opposite side. The supporting plate is perforated, and has a shape corresponding to that of the double-sided adhesive film to provide full support. In this way, the aforementioned issue of deformation of the adhesive film may be alleviated. However, utilization of the double-sided adhesive film may increase manufacturing cost, and the chamber for sputter deposition may be contaminated by chemical substances coming from the dual-sided adhesive film during sputter deposition.


Systems and methods for securing a catheter to an implantable port are disclosed. The system includes a collar having a catheter gripping protrusion and a port lock cavity. A port having an outlet stem with a constant cross-sectional profile is utilized. The collar is configured to mate with a port lock protrusion connected to the port.

Implantable ports are vascular access devices commonly used to deliver or aspirate fluids to or from a target site within a patient for medical treatment. Ports generally have a reservoir that can be accessed by a needle through a self-sealing septum. The reservoir has an outlet stem that is connected to a catheter terminating at a target site within the body, such as the junction of the right atrium and the superior vena cava. The catheter is typically secured to the stem by a locking mechanism, such as a push collar or a twisting lock. The catheter can be connected to the port during various stages of the implantation process, dependent on the preferences of the medical professional performing the procedure, the specifications of the port system, and the nature of the treatment being provided.
Ports can have one or more reservoirs, the most common ports being single or dual reservoir ports. While single reservoir ports typically have a single stem for fluid communication between the reservoir and the catheter, dual reservoir ports typically have two stems arranged in an opposing D-shaped stem profile. The double D stem design features a first and second outlet from a respective first and second reservoir, merging into an opposing D-shaped stem configuration to maintain a circular profile.
Various port locking of varying geometries have been designed to ensure that the catheter remains secured to the outlet stem, and leak-free connection is maintained after implantation. For instance, snap-locks that load over a barbed outlet stem have been used to secure the port catheter. These designs usually feature interlocking elements that mate a collar and catheter to a port body via one or more barbs on the outlet stem. Alternatively, twist looks have been used, which feature a flanged locking member that mates with a void in the port body to secure the lock to the port. In other designs, locking mechanisms have included features such as resilient prongs or live hinges for engaging the locking mechanism to the port body and catheter, securing the catheter to the outlet stem.
There are however a number of drawbacks to types of locking mechanisms described above. Advancing a catheter over a barbed stem can be difficult since the catheter stretches and tightens around the barbs. Since the catheter is flexible, it often kinks as the medical professional tries to advance it over the barbs. Unsuccessful attempts to push the catheter over the barbs can lead to excessive kinking, material deformation, and premature wear and tear on the catheter, compromising its integrity and durability. Pushability of the catheter over the stem is further encumbered by the fact that the medical professional connecting the catheter to the stem is wearing sterile gloves. In addition, gloves are often wet and slippery from contact with fluids associated with performing port insertion procedures. Further, locks with engaging components such as flanges or live hinges require twisting the lock to a particular radial orientation prior to loading, so that the engaging components are in-line to mate. The complexity of these systems also adds to the profile of the locking mechanism at the catheter/port junction, increasing the footprint of the port in the port pocket. Complex locking systems also increase manufacturing and end user costs. Additionally, locking mechanisms with resilient members be less durable and more difficult to manufacture. There remains a need for an improved locking system that allows for easy catheter loading over a barb-free stem, ensures a secure and leak-free connection, is operable to engage under any radial orientation and is simple to manufacture at a low cost.


An improved surgical fastener applying apparatus includes a cartridge half-section and an anvil half-section with the cartridge and anvil half-sections being relatively movable from an unclamped position to a fully clamped position. The apparatus includes a replaceable staple cartridge assembly having a plurality of surgical staples and a pivotably mounted safety lock-out. The safety lock-out is pivotable between an initial position in which a relative movement of the cartridge and anvil half-sections to the fully clamped position is permitted and a blocking position in which a relative movement of the cartridge and anvil half-sections to return them to their fully clamped position after the plurality of staples have been at least partially fired is prevented. The apparatus further includes a pivotably mounted firing lever for moving a pair of camming surfaces longitudinally. In addition, each of the presently disclosed cartridge and anvil half-sections of the fastener applying apparatus includes a clamping lever, which clamping levers are configured and adapted to enable the applying apparatus to be opened by either one of the cartridge half-section and the anvil half-section.

1. Technical Field
The present disclosure relates to surgical fastener applying apparatus and more particularly to surgical fastener appliers for sequentially applying a plurality of surgical fasteners to body tissue.
2. Discussion of Related Art
Surgical devices wherein tissue is first grasped or clamped between opposing jaw structures and then joined by means of surgical fasteners are well known in the art. In some such instruments a knife is provided to cut the tissue which has been joined by the fasteners. The fasteners are typically in the form of surgical staples however, other surgical fasteners may also be utilized, for example, clips or two part polymeric surgical fasteners.
Instruments for applying surgical fasteners typically include two elongated beam members which are respectively used to capture or clamp tissue therebetween. Typically, one of the beam members carries a disposable cartridge which houses a plurality of staples arranged in at least two lateral rows while the other beam member comprises an anvil which defines a surface for forming the staple legs as the staples are driven from the cartridge. Where two part fasteners are used, this beam member carries the mating part, e.g. the receiver, to the fasteners driven from the cartridge. Generally, the staple formation process is effected by the interaction between a longitudinally moving camming surface and a series of individual staple pusher member. As the camming surface travels longitudinally through the cartridge carrying member, the individual pusher members are biased laterally acting upon the staples to sequentially eject them from the cartridge. A knife may travel with the pusher between the staple rows to longitudinally cut the tissue between the rows of formed staples. Examples of such instruments are disclosed in U.S. Pat. Nos. 3,079,606 and 3,490,675.
A later stapler disclosed in U.S. Pat. No. 3,499,591 applies a double row of staples on each side of the incision. This is accomplished by providing a cartridge assembly in which a cam member moves through an elongate guide path between two sets of staggered staple carrying grooves. Staple drive members are located within the grooves and are positioned in such a manner so as to be contacted by the longitudinally moving cam to effect ejection of the staples.


Disclosed herein are TiNb-phosphate glasses that present several advantages over traditional Ti-phosphate glass compositions. The glasses disclosed herein have a low devitrification tendency and can be processed by melt quenching and formed into macroscopic components. Despite the presence of niobium, the glasses have high stability indices and are chemically durable. The glasses disclosed herein are transparent and have high refractive indices, as well, making them suitable for optical applications.

Glass formation in the TiO2—P2O5 system is unusual as it is centered around a relatively low concentration (about 27 mol %) of the network-forming phosphate component. Due to the high titanium content of such glasses, they are characterized by a high refractive index (˜1.9) as well as excellent chemical durability. Moreover, due to the absence of components such as lead, the high refractive index is achieved in these glasses without accompanying environmental and human health concerns.
Unfortunately, simple binary Ti-phosphate glasses have a high devitrification tendency and must be made by rapid quenching techniques such as roller quenching. These techniques preclude the fabrication of macroscopic pieces. If it were possible to stabilize such glasses against crystallization through the introduction of additional components, ideally ones that would not diminish the refractive index, it would then be possible to form sufficiently large samples to be used in optical applications that require a transparent and highly refractive material. One such application is for virtual and augmented reality systems.
Further, many high-P2O5 content phosphate glasses are not chemically durable and exhibit degradation or corrosion under high moisture and/or humidity conditions, thus limiting the range of applications over which they are useful.
It would thus be desirable to develop Ti-phosphate glasses with a low devitrification tendency, which would permit the use of processing techniques such as melt quenching, press molding, and the like. This, in turn, would allow the glasses to be formed into macroscopic objects and optical elements that are transparent and have high refractive indices. Further, it would be desirable if the glasses could be produced from compositions containing no lead to minimize environmental and health concerns. Even further, it would be desirable to produce a glass with lower dispersion than in comparable high refractive index glasses that contain lead or bismuth. Finally, it would be desirable for these glasses to be characterized by excellent chemical durability and not show the moisture/humidity corrosion that is typical of many phosphate glasses. The present invention addresses these needs.

High refractive index titanium-niobium phosphate glass


The level of a respiration signal obtained from a laser sensor or the like is indicated on a respiration monitor according to an output condition set by synchronizing signal output control device. While the level of the respiration signal is indicated on the respiration monitor, a synchronizing signal output device outputs a synchronizing signal according to the output condition and the respiration signal to an X-ray control device, which controls a high-voltage generating device to energize an X-ray source to apply X-rays to an examinee.

1. Field of the Invention
The present invention relates to an apparatus for generating a synchronizing signal for applying a radiation to a respiratory moving object.
2. Description of the Related Art
In recent years, computer-assisted diagnosis apparatus such as CT (Computed Tomography) apparatus, CR (Computed Radiography) apparatus, MRI (Magnetic Resonance Imaging) apparatus have widely been used in the medical field.
For imaging the thoracic or abdominal region of an examinee to produce a highly accurate image, it is necessary to take into account the motion of organs in the body of the examinee caused by respiration of the examinee. Though it is customary to ask the examinee to stop its spontaneous breathing during the imaging period, the practice is often burdensome for the examinee. The examinee may possibly be a patient who is unable to stop breathing
The above problems are not limited to the process of imaging examinees. When using radiotherapeutic apparatus, which applies radiation to an affected area of a patient for treatment, it can be difficult to direct radiation accurately if the affected area moves.
Various apparatuses have been proposed for detecting a motion of a respiratory moving object such as an examinee, predicting a position of the respiratory moving object from the detected motion, and applying radiation to the respiratory moving object at a timing based on the detected position. For example, Japanese laid-open patent publication No. 2000-262513 discloses an apparatus for generating X-rays within an exhaling period where the examinee has stable volume fluctuations based on an output signal from a respiratory sensor attached to the examinee, and collecting data from the examinee based on the X-rays applied. According to another apparatus disclosed in Japanese laid-open patent publication No. 7-246245, a synchronizing signal for applying radiation to an examinee is generated based on a signal which is detected by a pressure detector in contact with the body surface of the examinee or an air flow rate detector coupled to the mouth of the examinee.
The conventional apparatuses are capable of applying radiation to the examinee in view of the respiratory action of the examinee. However, the apparatus may not necessarily produce an optimum synchronizing signal because the respiration of the examinee varies widely depending on the age or the respiratory condition of the examinee, and the detected signal changes greatly depending on how the sensor for detecting the respiration is attached to the examinee. In order to generate an optimum synchronizing signal, it is necessary that the examinee or patient be forced to breathe stably. The attachment of the sensor and the adjustment of the sensor output signal must be done by a skilled operator.

Apparatus for generating radiation application synchronizing signal


A file management system and method for implementing special handling of files, useful for such applications as migration, compression, encryption, and logging access to files. A layer is superimposed between an underlying file system and programs' requests to access files. The layer initiates special handling in response to a file's normal attributes or information in the contents of the file and then passes the request to the underlying file system for normal proceeding. In the preferred embodiment, a file is recognized as a representation of a migrated file if the length attribute has a predetermined value and the file contains a unique pattern of bits.

Changing the representation of data in a file has many useful advantages. For example, compressing infrequently used files can save significant storage space. Encrypting an important file can secure secret information. However, the responsibility for remembering that some files require decompression, decryption, or some other kind of special handling before they can be used for normal reading and writing rests with the user. Failing to perform the special handling in the proper way wastes time. For example, failing to decompress a file before launching a process that reads the file wastes time by causing error conditions that must be cleared before processing can continue.
Another area involving files that require special handling is the area of file migration. File migration addresses the problems of how best to use multiple data repositories, for example on networks of workstations. Users frequently run out of space on the data repositories connected to their computers, and then must spend time deleting the less frequently used files, or, worse, users are unable to add significant amounts of important data to their systems because of insufficient space. In some situations, data will be lost because available storage space has dipped below a critical level at the same time a user is attempting to add data to his system, and the system has no means of recovery other than discarding buffers and killing processes.
One approach to solving this problem is to store frequently used data on high speed magnetic disk devices and store less frequently used data on slower but cheaper types of storage media or on removable storage media such as tapes or optical disks. This approach is only a partial solution to the storage problem and creates additional problems. For example, someone, either a user or a system administrator, is required to spend time moving the files, and each user has to keep track of which of his or her files have been moved and where they have been moved.
One proposed method of managing data repositories for networks of workstations and fileservers automatically moves files from high-speed storage to low speed storage. This process is called "migration" or "staging," and the repositories that receive the migrated files are called "migration stores." Using migration requires that there be some means of keeping track of which data files have been migrated to migration stores and an identification of the location of the files. Some existing systems use approaches that store this information in files that acts as catalogs of migrated files. This approach suffers from a number of problems. These systems have difficulty recovering from some types of common system or disk errors, and their implementation requires modifications to file system utilities.
One such system is described in Israel et al. Evolutionary Path To Network Storage Management. USENIX, Winter '91 pp.185-198. That article describes a staging method wherein each workstation file system has a file that is a catalog of the migrated files. The catalog lists all migrated files by their inode numbers. If the catalog file is lost, all migrated data files are potentially inaccessible to the workstation. Secondly, this approach requires rewriting some file system utilities. For example, some file system backup and restore utilities read or write directly from or to the raw disk. When a backup tape that was made using such a backup utility is restored the inode numbers of most of the files usually change, making the catalog file useless and the migrated files inaccessible. Consequently, to use this migration approach, the backup and restore utilities must be modified.
In other systems, such as BUMP and Novell 4.0, the underlying file system itself is modified. For example, the inode data structure can be modified to include an extra bit that identifies an inode as corresponding to a migrated file. This approach suffers from being highly unportable, and requiring rewriting an extensive amount of the file system and file system utilities.
It is an object of the invention to provide a file management system for effectively dealing with compressed files, encrypted files, migrated files, or any other data files that require special handling, in a way that is transparent to users, to application programs, and to system utilities, such as backup and restore packages.
It is an object of the invention to provide a file migration system that is free from single points of failure and that does not depend on file system details, such as inode numbers, for critical operation.
It is a further object of the invention to provide a file migration system which contains information indicating the files that have been migrated the information identifying the location of the contents of the original data file.
It is another object of the present invention to provide a file migration system wherein the migration system operating software determines whether a file on a primary data repository represents a migrated file simply by examining its attributes.
It is a further object of the invention to provide a file migration system wherein the migration system operating software determines whether a file represents a migrated file by first examining at least one normal attribute of the file and then, if necessary, examining the contents of the file.
It is yet a further object of the present invention to provide a file management system supporting the use of extended attributes.

Method and system for computer file management, including file migration, special handling, and associating extended attributes with files


A new single-use personal defense device for warding off, and marking, potential and actual attackers. The inventive device includes a housing containing a sealed container therein which contains a supply of pressurized attack-repellent chemical. The container includes a frangible surface which is pierced by a sharp piercing end of a hollow tube when the tube is actuated by a trigger. The chemical then flows through the hollow tube to a dispensing end where the chemical is discharged to the exterior of the housing. The chemical is an indelible dye and/or an odoriferous scent material, so that when sprayed onto an attacker, the attacker is marked by the chemical so that the attacker can be easily identified.

1. Field of the Invention
The present invention relates to personal defense devices and more particularly pertains to a new single-use personal defense device for warding off, and marking, potential and actual attackers.
2. Description of the Prior Art
The use of personal defense devices is known in the prior art. More specifically, personal defense devices heretofore devised and utilized are known to consist basically of familiar, expected and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which have been developed for the fulfillment of countless objectives and requirements.
Known prior art personal defense devices include U.S. Pat. No. 5,088,624; U.S. Pat. No. 4,223,804; U.S. Pat. No. 4,044,922; U.S. Pat. No. 4,434,914; U.S. Pat. No. Des. 360,674; and U.S. Pat. No. 4,220,263.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not disclose a new single-use personal defense device. The inventive device includes a housing containing a sealed container therein which contains a supply of pressurized attack-repellent chemical. The container includes a frangible surface which is pierced by a sharp piercing end of a hollow tube when the tube is actuated by a trigger. The chemical then flows through the hollow tube to a dispensing end where the chemical is discharged to the exterior of the housing. The chemical is an indelible dye and/or an odoriferous scent material, so that when sprayed onto an attacker, the attacker is marked by the chemical so that the attacker can be easily identified.
In these respects, the single-use personal defense device according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of warding off, and marking, potential and actual attackers.


An object of the present invention is to readily initiate an operation of a capsule medical apparatus which is inserted into a subject and executes a predetermined function. In a capsule endoscope 3 according to the present invention, a reed switch 14 connected to a power supply unit and a function executing unit is arranged parallel to a direction of a longitudinal axis t of a capsule-like casing 16 in the substantially cylindrical capsule-like casing 16 of the capsule endoscope 3. A pair of movable electrodes of the reed switch 14 operates according to magnetic induction of a magnetic field of a magnet 6 applied substantially parallel to the direction t of the longitudinal axis of the capsule-like casing 16, and come into contact with each other. As a result, power supply from the power supply unit to the function executing unit is allowed.

1. Field of the Invention
The present invention relates to a capsule medical apparatus which is inserted inside a subject and operates on supplied power to execute a predetermined function, and a current-carrying control method thereof.
2. Description of the Related Art
In recent years, a swallowable capsule medical apparatus has been proposed in a field of endoscope. One of the capsule medical apparatuses is a capsule endoscope which has an imaging function and a radio communication function provided inside a capsule-like casing. The capsule endoscope is swallowed by a subject (human body) from the mouth for observation (examination), moves through inside body cavities such as internal organs, e.g., a stomach and a small intestine, following peristaltic movements thereof and sequentially captures images until naturally discharged.
Image data acquired through imaging by the capsule endoscope while the capsule endoscope travels through the body cavities inside the body is sequentially transmitted outside by radio communication, and stored in a memory provided outside. When the subject carries a receiver which is provided with a radio communication function and a memory function, the subject can move freely after swallowing the capsule endoscope until discharging the same. After the capsule endoscope is discharged, a doctor or a nurse can make diagnosis by displaying images of internal organs on a screen based on the image data stored in the memory (see Japanese Patent Application Laid-Open No. 2003-210395).
In the capsule endoscope as described above, a reed switch, which operates according to an external magnetic field, is sometimes employed for supplying power to each function executing unit from a power supply. In general, a longitudinal direction of the conventional reed switch is set vertical to a direction of a longitudinal axis of the capsule endoscope, and a direction of a magnetic field and a lead extending direction of the reed switch are required to coincide with each other.
The capsule endoscope is formed rotationally-symmetrical about the direction of the longitudinal axis, and a position in the rotational direction is not particularly defined. Therefore, it is difficult to make the direction of the magnetic field and the lead extending direction of the reed switch coincide with each other. For example, in order to activate the reed switch, it is necessary to move a magnet which generates the magnetic field around the reed switch to check the orientation of the reed switch. Thus, on/off operations of the reed switch are cumbersome.

Capsule medical apparatus and current-carrying control method


A holder adapted for mounting on a flush valve housing, said holder including a body having a lower portion and an upper portion; a connector having a side wall forming at least part of the lower portion of said body, said connector dimensioned to engage the flush valve housing and having a flange adapted to make frictional contact therewith; a holder having a side wall forming at least part of the upper portion of said body, said holder providing a receptacle for holding an item; at least a first support forming a division between said connector and said holder to support an item placed in said holder; and one or more threaded fasteners positioned on the lower portion of said body to enhance the frictional contact.

Commercial sanitary fixtures such as urinals and toilets are in widespread use. These fixtures are installed in buildings and facilities where large groups of people often congregate for sporting events, concerts, conferences, and other gatherings. In addition, these fixtures are also commonly found in eating and drinking establishments such as restaurants, bars and nightclubs.
The public attending crowded events such as football games, or visiting a concert facility or nightclub, will eventually visit the restroom where these fixtures are installed. Many times, a person will be carrying a drink container of some kind, a cup, bottle or glass, for which the person will need to find a safe resting place while the person uses the toilet or urinal. Commonly, the person may try to balance the beverage container upon the edge of the sanitary fixture or on the associated plumbing, often resulting in a spilled drink, or broken bottle, and liquid and glass covering the floor of the restroom. Such spills create highly unsafe conditions for all patrons, and frustration for the patron who accidentally spills his/her beverage in that manner.


There is disclosed a top foil for a foil thrust bearing including a main plate, a first hook comprising a first vertical portion bend upwardly from an end of the main plate and a first horizontal portion bend forwardly from an end of the first vertical portion, and a second hook comprising a second vertical portion bend downwardly from a rear end of the main plate and a second horizontal portion bend backwardly from an end of the second vertical portion.

Generally, thrust is generated in a rotary turbine and a foil thrust bearing is broadly used to support and suspend the thrust.
Such a foil thrust bearing consists of a bearing base plate, a top foil for making fluid layer, in contact with a rotary turbine structure, and a bump foil for keeping a whole baring profile.
At this time, the most important element composing the foil thrust bearing is the top foil. The structure for fixing the top foil to the base plate and the profile of the top foil are the most important.
Especially, unless the profile of the top foil is kept properly, the whole supporting force of the bearing might be reduced and abrasion occurs in the bearing to shorten a usage life of the bearing. The process of molding the profile of the top foil is critically important for the foil thrust bearing to secure a sufficient supporting force.
Such the molding process of the top foil has to be processed in accordance with a precisely designed curvature, such that the molding process can be disadvantageously difficult and complex.
In addition, a corresponding mold is required based on the size of each bearing and one corresponding mold has to be fabricated in accordance with a volume of a turbine structure, which might cause the increased cost and time taken by the bearing manufacture.
The plurality of the top foils may be secured to the base plate, respectively. In case one of the top foils is separated, the whole supporting force of the bearing might be reduced. In severe cases, there might be damage to the bearing.

Top foil for foil thrust bearing and foil thrust bearing including the same


A tool for applying strip material to a major face of a substrate including a tool body having a lower surface and a channel extending therethrough and a substrate positioning member adjacent the channel for guiding the tool along the edge of the substrate. The substrate positioning member includes spaced apart front and rear guide members contiguous with the edge. The rear guide member is mounted to a frame pivotally mounted to the tool body and includes two spaced apart rollers. The tool also includes an elevating means for elevating the lower surface of the tool from the major and a cutting means for cutting a slit into the strip material to a selected depth extending by part way into the strip material to permit the strip material to be bent about a corner of the substrate.

In general, when using rigid spacers, the spacer must be cut into precise lengths and the corners then joined by welding or the like. When using flexible spacers, if the degree of flexibility is sufficient to permit a spacer to be bent around a corner, the only problem then arising is the "bunching" of the material at the corner which can affect the performance of the spacer in an assembled IG unit.
Numerous strip applying tools have been proposed in the art, however, these tools have limitations in that many of them incorporate many moving parts, which are susceptible to mechanical failure. In addition, during an application procedure of strip material to a substrate and more particularly, when a corner needs to be formed in the strip, the application procedure using generally known tools must be interrupted and the corner formed therein. As such, this not only has a negative impact on productivity, but additionally provides a potential "weak spot" in terms of the insulation capacity of the strip.
In my earlier patents noted above, one solution was to punch out a portion of the flexible spacer internally of the spacer body so that a physical portion of the material was removed. Thus the spacer was able to form a tight 90.degree. corner. However, by physically removing a portion of the material on the internal face of the spacer strip, the integrity of the strip can be destroyed relative to vapour transmission. Spacers in use today include a desiccant strip or layer on the internal face and by removing a portion of the body at its internal face, the continuity of the desiccant layer is interrupted at several places throughout the IG assembly, which is undesirable.

Strip applying hand tool with corner forming apparatus


Structuring graphics with placeholders may be provided. A first diagram may be displayed configured to display data associated with a data model. The first diagram may have a first diagram type. Next, a request may be received to display the data model in a second diagram configured to display the data associated with the data model. The second diagram may have a second diagram type. Then, the second diagram may be displayed configured to show the data associated with the data model.

Single line placeholder text is used to show where text should go in a document. In some situations, placeholder text may be used, for example, to notify users when and what type of text should be added to various locations in the document. For example, data may be entered in a data model having a corresponding diagram including various graphic elements (i.e. areas or shapes.)
Different diagram types may be used and switched between when graphically representing the data model. With conventional systems, however, placeholder text is limited to one placeholder text string per graphic. Thus, the conventional strategy is to limit the placeholder text to one string per graphic and does not support multiple strings in a single graphic. Furthermore, conventional systems do not support structured graphics with image placeholders or adding and pruning leaf nodes from a hierarchical tree when switching between diagram types.


A light emitting diode and the method of the same are provided. The light emitting diode includes a substrate, a thermal spreading layer, a connecting layer and an epitaxial structure. The substrate is selected from a transparent substrate or a non-transparent substrate, which corresponds to different materials of the connecting layers respectively. The thermal spreading layer, configured to improve the thermal conduction of the light emitting diode, is selected from diamond, impurity-doped diamond or diamond-like materials.

Since the light emitting diodes (LEDs) are widely applied in various application fields, many different structures and manufacturing methods for making the light emitting diodes have been developed. For example, U.S. Pat. No. 6,462,358 issued to Lin et al., entitled "Light emitting diode and method for manufacturing the same" discloses a light emitting diode with a transparent substrate which is connected to an epitaxial structure by an adhesive layer. The light emitting diode of Lin et al. has better luminous efficiency due to the lower absorption of light, lower forward voltage and better current distribution of the transparent substrate. However, the light emitting diode may impose a local thermal concentration and further limit its performance due to the low thermal conductivity of the transparent substrate. U.S. Pat. No. 6,458,612 issued to Chen et al., entitled "Method of fabricating high efficiency light-emitting diode with a transparent substrate" also discloses a light emitting diode with a transparent substrate.
For another example, U.S. Pat. No. 6,812,067, issued to Chen et al., entitled "Method for integrating compound semiconductor with substrate of high thermal conductivity" discloses a compound semiconductor structure with a nontransparent substrate, which employs a metal of low melting point to form two bonding layers on the substrate and the epitaxial structure respectively, and connects the substrate with the epitaxial structure by connecting two bonding layers. However, the light emitting diode in U.S. Pat. No. 6,812,067 adopts the high conductivity material for the nontransparent substrate restricting the structure of the light diode.
Therefore, there is a need to provide a light emitting diode and a method making the same suitable for various structures of the light emitting diode to improve the thermal conductivity of the light emitting diode.

Light emitting diode with thermal spreading layer


A computing method receives a labeled sample from an annotator. The method may determine a plurality of reference model risk scores for the first labeled sample, where each reference model risk score corresponds to an amount of risk associated with adding the first labeled sample to a respective reference model of a plurality of reference models. The method may determine an overall risk score for the first labeled sample based on the plurality of reference model risk scores. The method may further determine a probe for confirmation of the first labeled sample and a trust score for the annotator by sending the probe to one or more annotators. In response to determining a trust score for the annotator the method may add the labeled sample to a ground truth or reject the labeled sample.

The present invention relates generally to the field of active learning systems, and more particularly to resilient active learning systems in the presence of untrusted annotators.
Active learning refers to a special case of semi-supervised machine learning where one or more users (also referred to as an "annotators") are iteratively queried to label selected training samples. Labeled samples received from annotators are added to the ground truth, which is used to train machine learning models. The accuracy of the machine learning model increases as more labeled samples received from annotators are added to the ground truth. In general, the goal of an active learning system is to increase the performance of the machine learning models while minimizing the number of samples presented to the annotators. To achieve this goal, active learning systems use specific policies to select training samples such as selecting those samples where the uncertainty of the learner is highest.

Filter for harmful training samples in active learning systems

International Business Machines Corporation


A leg brace includes a frame and a stirrup coupled to a lower end of the frame for engaging a ground surface during use. The leg brace further includes a first attachment assembly coupled to an upper end of the frame that is configured to removably secure the frame to a first portion of a user's leg and a second attachment assembly coupled to a lower end of the frame that is configured to removably secure the frame to a second portion of a user's leg.

When a person injures his or her foot, ankle, knee, or another portion of the leg, he or she is often required to refrain from applying any pressure to the injured area for a predetermined period of time prescribed for recovery. This typically requires that the person refrain from walking. To remain mobile, the injured person may use a mobility device, such as a wheelchair, crutches, a leg scooter, etc., as an aid when moving around. Although a wheelchair, crutches, or a leg scooter is effective in allowing the person to move independently without applying pressure to the injured area, none of the above-mentioned mobility devices allows the injured person to move around freely without restrictions or limitations.
For instance, a wheelchair is limited to buildings, vehicles, public spaces, or other areas that have wheelchair-accessible entrances, pathways, lifts, etc. Many buildings, vehicles, and public spaces are not wheelchair accessible; and as a result, the person must refrain from going certain places or engaging in certain activities. Moreover, using a wheelchair requires the use of at least one hand to either operate an electronic control panel or to drive the wheels of the chair. Thus, a person's hands are restricted when moving around in the wheelchair.
Crutches require the use of the person's arms to balance and move the crutches when moving the body on the non-injured foot and leg to the desired location. As such, the person cannot do many simple things while using crutches, for instance, carrying a cup of coffee, opening a door, etc. Moreover, to move on crutches, the person essentially plants the bottom of the crutches forward of his body and then "swings" his body and the weight-bearing leg forward to a new position. During this swinging movement, the person must balance on the crutches. Because this requires significant arm strength, the person normally ends up bracing the upper end of the crutch within his armpit or against the inner portion of his arm to relieve some of the load on his arms. As a result, not only do the person's arms tire, but he typically acquires bruises or sore spots beneath his arms. In addition, because of the difficulty balancing on crutches, it is often difficult and dangerous for the injured person to go up and down stairs, further restricting the mobility of the injured person.
The leg scooter has been recently developed to give an injured person the increased mobility of crutches without having to strain the arms during use. The scooter typically includes a platform on which the lower half of the leg may rest, wherein the platform is moveably suspended above the ground through a wheel system. A handlebar is coupled to the scooter, the handlebar being grippable while moving to improve balance. An example of a well-known leg scooter available to the public is the Roller Aid™ leg scooter available from Enhanced Mobility System, Inc., of Spokane, Wash. Such a leg scooter is more versatile than a wheelchair in that it can fit in smaller spaces; however, the person is still restricted to areas having ramps, platforms, etc., to move from a first level to a second level. Moreover, the person's arms are not completely free while moving since it is normally necessary to hold onto the handlebars while moving. Further, the leg scooter may only be used for injuries below the knee since the knee must rest on the leg scooter during use.
Thus, there is a need for a mobility device for use by a person having a leg injury, and particularly an injury of the foot, ankle, knee, or any other area below the knee, that isolates the injured area without substantially limiting the person's mobility and without restricting use of his or her arms while moving.
The need for such a mobility device may also arise for a person who has lost a portion of his or her leg. Modem prosthetic limbs can go a long way in helping amputees to regain essential capabilities. Moreover, prosthetic limbs can be constructed such that the prosthetic limb gives the amputee the sensation or feeling that it is a part of the leg.
However, because each patient and his or her amputation is unique, each prosthetic limb must be custom fitted and then built for that person. This process is not only costly the first time, but the prosthetic limb must also be replaced or refitted as the person's body changes due to atrophy of the muscles, growth, etc.
Thus, there is also a need for a low-cost mobility device that may be adapted for use by persons with varying leg amputations and that may be adjusted to accommodate changes in body size.


A load/unload mechanism for magnetic disks is described which allows the magnetic heads of a disk drive to be loaded and unloaded at highest possible speed in a secure manner and without collision with the surface of the disk. The slider is lifted off directly in the vicinity of the flexure without causing abrasion between the suspension of the slider and the load/unload element.

1. Field of the Invention
The invention relates to magnetic disk drives and, in particular, to a method and apparatus for automatic loading/unloading of a magnetic head in such a magnetic disk drive.
2. Description of the Prior Art
In computer systems, information is frequently stored on a magnetic film on the surface of a magnetic disk (hard disk). Magnetic hard disk storage devices, that is to say assemblies of several such magnetic disks, either have permanently fixed disks or removable cartridges which can be removed from a disk storage device and inserted into the next device of the same type. These disks are not perfectly flat; but due to the manufacturing process, the disks have fine curvatures. Information is read and written by means of magnetic heads (sliders) which are connected to the housing of the disk storage device by means of a carrier structure. The magnetic heads, together with their suspensions, are mounted on the arms of the carrier structure, the actuator.
FIG. 1 shows a part of such an assembly according to the state of the art. The magnetic head suspensions themselves consist of the loadbeam, the flexure, and the mounting block, collectively referred to as the suspension. The mounting block serves as a connecting element between the actuator arm (not shown) and the magnetic head suspension. The loadbeam is the backbone of this suspension. It has a relatively high rigidity against the slider. Toward the rear, it has a controlled flexibility defined in production. In this area, bending of the loadbeam in z direction furnishes the cross-sectional profile with a defined rigidity. When the actuator is subsequently fitted in the disk storage device, this controlled rigidity of the bend zone in the fitting position produces a pressure load (gramload) of the slider on the surface of the disk.
The flexure is welded onto the loadbeam. The slider is then bonded onto a lug of the flexure. Due to its shape, the flexure has a very high lateral rigidity to prevent the slider from oscillating uncontrolledly in the event of rapid actuator movements. The rigidity around the transverse axis, on the other hand, is very low, to allow the slider to flex in response to the minutest unevenness on the disk. The entire assembly is referred to as the Head Suspension Assembly (HSA).
During read and write operations, the slider floats on a cushion of air at a very low height above the disk, which rotates very fast. The bearing surface onto the disk is termed the Air Bearing Surface (ABS). In this way, direct contact between the slider and the disk is avoided. If, for example, the rotational speed of the disk is too low to create an adequate air cushion between the head and the disk, the two may touch, resulting in a "head crash", which may cause irreparable damage to the disk and head and may lead to loss of data.
Especially in replaceable cartridge systems in which the magnetic disk is inserted into and withdrawn from the storage device housing inside a cartridge system, a mechanism is required to lift the magnetic heads off of the disk surface and set them to a rest position when the drive is not in operation. Otherwise, there would be very great danger of damage, in transit for example. However, a mechanism of this kind is also necessary in fixed systems, to prevent the head sticking to the disk at rest position.
In earlier times, it was usual to start and stop a magnetic disk, or magnetic disk storage device, by means of a Contact Start/Stop System (CSS). In this process, the drive is started and stopped while the magnetic disk and head are in contact with each other. To prevent the head and disk sticking together as already mentioned when the drive is at rest, the surface of the disk had to be appropriately roughened. Due to the increasing miniaturization of hard disks and hard disk storage devices, however, the gap between the actuator and the surface of the disk is becoming ever smaller, so that this solution no longer corresponds to the state of the art. As a result, it is becoming more and more problematic to unload the magnetic heads with mechanisms of sufficient strength. Also, reducing the size of gap means that the influence of production and assembly tolerances is becoming ever greater.
For this reason, load/unload mechanisms have been developed which lift the head from the disk using a load/unload element (from now on, for the sake of simplicity, termed an unload element) when the disk is not rotating. When the disk is started again, i.e., the slider is brought back onto the disk surface, the appropriate air cushion must be reestablished fast enough to prevent contact between the disk and the head, dependent on the lifting speed of the head, the position of the ABS relative to the disk, and the defined height of flight of the head. Because users of such drives wish to read and write data very shortly after it starts operating, a mechanism of this kind must be furnished with the highest possible load/unload speed.
WO87/01853 discloses a load/unload mechanism for magnetic heads which has a comb-like structure as the unload element. The fingers of the element interact with the suspension of the magnetic heads to hold the heads at sufficient distance from the disk in the unloaded position. This device has the disadvantage that, due to its size, it can no longer be used for today's much more miniaturized magnetic disk drives.
U.S. Pat. No. 5,296,986 describes a device to hold the actuator of a disk drive in a secure position when the drive is at rest. For this, the slider is conveyed with the aid of a driver mechanism onto a ramp outside the magnetic disk, where it rests. The disadvantage of this device is that additional means such as cam followers are required to convey the head onto the ramp. Another disadvantage is that abrasion occurs in the contact zone between the ramp surface and the slider suspension. The abrasions very often take on magnetic properties due to changes in the grid structure. At the point at which such magnetic particles touch the disk surface, the data already written to it would be destroyed.
U.S. Pat. No. 5,394,281 describes a magnetic load/unload mechanism with a ramp as the unload element, having a piezoelectric element. In this mechanism, the static frictional force at the start of loading is replaced by a dynamic force. A magnetic solution of this kind has the disadvantage that the slider may drop out of control onto the surface of the disk, for example, if the power fails. Furthermore, this arrangement is not suitable for loading and unloading several magnetic heads simultaneously. In this case, coupling of several different transducers is not possible; and the available space for attachment of several such transducers is inadequate with today's low design heights.
A further disadvantage of the general state of the art is that when the suspension conveyed runs onto the unload element mounted outside the disk, the risk of collision between the magnetic head and disk is very great, for the following reason.
In production, the magnetic disk cannot be fully tested, i.e., the magnetic and mechanical properties are not precisely defined on the entire disk. Thus, due to technical factors, the outermost zone of the disk remains undefined. The consequence is the outer edge of the disk is much less flat than the zones further in. When the suspension is then moved onto the unload element with the disk rotating, the relative movement of the disk and the suspension causes the magnetic head to skew. This leads to a loss of flying height of the magnetic head and so to the risk of solid body contact between the head and the disk at the outermost, uneven, edge of the disk. For this reason, the suspension is normally unloaded in the outermost defined data field of the disk.
Accordingly, it can be seen that there is a need for a method and device for automatic loading and unloading of a magnet head over a disk surface in a magnetic disk drive which allows the magnetic heads of the drive to be loaded at the highest possible speed in a secure manner and without collision with the surface of the disk.

Device for the automatic loading/unloading of magnetic disks

International Business Machines Corporation