Wafer level packaging process for packaging MEMS or other devices. In some embodiments, a MEMS wafer with normal thickness is firstly bonded to a cap wafer of normal thickness, followed by a thinning on the backside of the MEMS wafer. After this, the bonded wafer stack and the capping of the hermetically packaged MEMS devices are still rigid enough to do further processing. On this basis, through vias on the thinned substrate can be easily formed and stopped on the regions to be led out (e.g., metal pads/electrodes, highly doped silicon, etc.). Vias can be partially filled as this is the final surface of process. Even thick metal coated/patterned vias have much more space to relax possible thermal stress, as long as the vias are not completely filled with hard metal(s). Various embodiments are disclosed.

1. Field of the Invention
The present invention relates to the field of wafer level packaging.
2. Prior Art
Wafer level packaging of micro-electro-mechanical system (MEMS) devices has been an attractive and challenging topic in recent years. A hermetic package can greatly improve the device performance and reliability. Consequently, hermetic bonding is highly preferred in many MEMS devices. Bonding techniques used in the field have included adhesives/polymer/epoxy bond (which are not hermetic bonds), solder eutectic bonds, Si/metal eutectic bonds, metal-metal thermal compression bonds, glass frit bonds, anodic bonds, etc.
A common way of providing electrical lead-outs is through lateral feed-through lines to the edge of the die, which is then sealed by a cap wafer bonded over the die. The feed-through lines crossing the bond rim usually don't allow a metal-related bond. Instead, a dielectric-bond is necessary in this arrangement. However, this lateral lead-out has relatively long feed-through lines, which leads to large parasitic capacitances, cross-talk and substantial interconnection resistances. This technique also precludes any wafer level bumping process.
In order to solve the above-mentioned issues, wafer-level-packages with vertical feed-throughs have been disclosed. Via forming, metal(s) filling and both side metallization are done on a separate single dielectric wafer, such as glass or ceramic. This wafer bonded to a MEMS wafer completes the wafer process, or alternatively, this wafer is just a base material on top of which MEMS devices are built. U.S. Pat. No. 6,384,353 also discloses a method of building a MEMS device on a substrate with filled vias and metallization on both sides, though little processing is described. For reasonably large format wafer processes (e.g., 4-inch or 6-inch above), a wafer with vias calls for substrate rigidity (i.e., wafer thickness) that increases the difficulty/cost of the via process, and also leads to high parasitic coupling capacitances.
In one case, through holes as vertical feed-through paths are firstly formed in a glass wafer. Then the glass wafer is bonded to a MEMS silicon wafer by anodic bonding to form a hermetic package, while the metal pads on the silicon substrate are aligned to the glass vias and thus exposed. The exposed pads allow a further metallization process on the outer surface of the glass wafer to complete the interconnection. Another approach is to fill up the glass vias with metal(s) electro-plated studs and metallization on the glass surface, followed by the anodic bonding to the MEMS wafer to complete the whole process.
Another approach has adopted a combined metallized glass via and lateral feed-through process using glass frit bonding. This process starts the glass wafer with via forming before bonding to another substrate, hence the rigidity of the glass wafer becomes a problem. Normally thin glass of around 150 um thick is used in a small wafer format (e.g., no more than 3-inch), as forming through vias on a thicker wafer will tremendously increase the process difficulty and thus the fabrication cost, and also increases the parasitic capacitances and cross-talk between feed-through paths.
U.S. Pat. No. 6,528,344 discloses another way of forming vertical feed-throughs by use of a cap of silicon. Deep trenches are etched on the silicon cap wafer (only those silicon areas for feed-throughs are not etched), filled with dielectric material, and formed recess of dielectric material for cap gap. After bonding this wafer and the MEMS wafer, contact pads/electrodes of MEMS devices are connected to the silicon islands. Then the cap silicon side of the bonded stack is thinned down to reach or exceed the dielectric materials from the bottom side, so that the silicon islands are exposed and ready for further process to make interconnection. This approach uses silicon as part of the feed-through material and thus a relatively large series resistance is expected. Some of the required process steps, like the dielectric filling, polishing and recessing, and final dielectric membrane releasing, etc., increases the process difficulty and may lead to a stress issue.
In most of the disclosed approaches, vias are solidly filled with metal(s) as feed-through paths. This might cause thermal stress issue due to the large thermal mismatch between substrate and metal(s) and hence device reliability issue.


An apparatus is provided having an active material forming a surface thereof in contact with a rheological fluid. The active material is controllable to vary a surface geometry thereof between a rough or nonsmooth surface geometry to increase drag, and achieve an increase in stress transmitted through the fluid, when a field is applied, while allowing a smooth surface geometry and an associated reduction in stress transmitted through the fluid when the field is removed. A method of enhancing performance of an apparatus that includes a rheological fluid is also provided.

Rheological fluid devices, such as magnetorheological (MR) and electrorheological (ER) fluid clutches, polishing devices, and damping mechanisms, such as shock absorbers, utilize the increased yield stress exhibited by a rheological fluid when exposed to a field (e.g., a magnetic or electrical field) in order to control the interface of two mechanical members, such as the coupling of a stator and a rotor that are relatively rotatable. The transmission of torsional or axial forces between the members is controlled by turning the field on and off. Rheological fluids include magnetorheological and electrorheological fluids, and are sometimes referral to as controllable rheological fluids or field-responsive fluids.
For example, an MR fluid is a suspension of magnetizable particles in a carrier fluid. When exposed to a sufficiently high magnetic field, and when the MR fluid is under shear flow, the magnetizable particles will line up in columns of higher concentration, aligned with the direction of applied magnetic field. It has been observed that forming a grooved surface on one or both mechanical members of a torque-transmitting device, with the grooved surface in contact with an MR fluid in an annular space between the members, enhances the stress transmitted through the MR fluid relative to that of a surface without grooves. The grooved surface creates drag in the fluid, inhibiting slip at the boundary of the fluid and the member or members having the grooved surface. The drag is thus beneficial for intended operation in "clutch on" (i.e., magnetic field applied) conditions.

Apparatus with active material surface in contact with rheological fluid and method of enhancing performance thereof


A method for fitting or retrofitting a sinter cooler, which sinter cooler has a cooler grate chain with an endless chain of cooler cars, the method including, installing a lamella grate for holding sinter material and allowing air flow through the grate so that a support structure is connected to the cooler car and a plurality of lamellae are supported by and individually movable with respect to the support structure, and are disposed to allow air flow between neighbouring lamellae, where the support structure has at least one support element disposed underneath the plurality of lamellae to support the plurality of lamellae, and at least one downholder that is adapted to limit an upward motion of at least one lamella installed such that at least a portion of the downholder is disposed above the at least one lamella.

In iron metallurgy, travelling grate machines are used for several purposes, e.g. for performing a sintering process or for cooling sinter material. In each case, material is loaded onto a travelling grate and is thermally treated as it is conveyed on the travelling grate. The travelling grate, which may be used in sintering machines as well as in sinter coolers, is realised by an endless chain of grate cars which move along rails. In the context of sinter coolers, the travelling grate is also referred to as cooler grate chain and grate cars can be referred to as cooler cars.
In this context, the annular dip-rail cooler, e.g. of the Lurgi type, has found extensive use during the last decades. It comprises an annular cooler that is divided into several cooler cars with grates. Hot sinter material is loaded onto the cooler and cooled with ambient air that is blown through the sinter layer. After the sinter has been cooled sufficiently, the cooler car is tilted and the sinter falls into a bunker or bin below. Effectiveness of such coolers mainly depends on the amount of cooling air available. To this respect, the grates through which cooling air passes are a decisive component of the process. The design of the grates and their condition during operation has a decisive impact on cooling effectiveness.
A problem related to e.g. annular sinter coolers of the Lurgi type, which is the basis for many other technology providers, is that fine sinter material can fall through the rigid grate and thus contaminate or clog other components that are relevant for the process. The current solution for this problem is to install collecting pans below the grate, which are supposed to collect any spilled material and which are afterwards emptied in the discharge area. The intention is to protect the inner components of the plant, like air channels or wind boxes or sealing elements, from increasing contamination. Such contamination can block process air flow such that the general amount of air flow available for cooling will be reduced. The collecting pans, however, seriously impair the airflow through the sinter material. Another drawback of the current grate design or annular dip rail cooler design is that it comprises rigid gratings that are susceptible to blockage by fine sinter material (near-mesh particles). The effective gap for cooling air is often blocked, since these grates have no self-cleaning functionality. This has a serious negative impact on the cooling efficiency of the sinter cooler.

Method for fitting or retrofitting a sinter cooler


A voice coil actuator includes a magnetic flux conductive material core, a magnet and an electrical current conductive coil. The core has a first surface and a continuous channel disposed in said first surface. The channel has a pair of opposing walls. The magnet is disposed in intimate contact with a first one of said walls and spaced from a second one of said walls so that a gap remains between the magnet and the second one of the walls. The magnet has a first face of a first magnetic polarity facing the first one of the walls and a second face of a second, opposite magnetic polarity facing the gap. The magnet is further spaced from a bottom of the channel so that magnetic flux is substantially normal from the second face across said gap to the second one of the walls. The electrical current conductive coil is disposed moveably in the gap such that an electrical current in the coil develops a magnetic force on the coil in a direction substantially normal to the magnetic flux to displace said coil in response to said magnetic force.

In a typical voice coil actuator, an electrical current conductive coil is suspended at a zero current bias position within a magnetic field formed in a gap. It is highly desirous that the flux path of the field within this gap be optimally radial with respect to the axis of the coil so that when an externally applied current conducts through the coil, the coil will be displaced axially from its zero current bias position in an amount linearly proportional to such current. However, as will be seen from the following discussion, the flux path is, in the known prior art voice coil actuator, is not at an ideal radial orientation with respect to the coil.
In the known prior art voice coil actuator, the magnetic field in the gap is derived from a permanent magnet core. Referring to prior art FIG. 1, there is shown a long coil actuator 10 which is one particular type of prior art voice coil actuator. The construction of its core 12 is based on an axially polarized cylindrical magnet 14 which has a first end face 16 at a first magnetic polarity and a second end face 18 at a second, opposite magnetic polarity. The first end face 16 of the magnet 14 is coaxially mounted on a disk shaped base plate 20 of the core 12. The base plate 20 is formed from magnetic flux conductive material and has a diameter commensurate with the outer diameter of the magnet 14. Mounted on the base plate 20 coaxially within the magnet 14 is a rod 22 of magnetic flux conductive material wherein the rod 22 has a diameter less than the inner diameter of the magnet 14 so that a space therebetween remains. The distal free end 24 of the rod 22 is elevationally commensurate with the second end face 18 of the magnet 14. Completing the core 12 construction, a ring shaped first pole piece 26 and a disk shaped second pole piece 28 are coaxially mounted respectively to the second end face 18 of the magnet 14 and the distal end 24 of the rod 22. Each pole piece 26, 28 is formed from magnet flux conductive material. The first pole piece 26 has an inner diameter less than the inner diameter of the magnet 14 and the second pole piece 28 has a diameter greater than the diameter of the rod 22 with each of these diameters being selected so that a gap remains between the respective facing sides 30,32 of each pole piece 26,28.
A coil 34 is mounted to the above core 12 construction and coaxially suspended within the gap. The overall length of the coil 34 and the height of the gap are selected so that as the coil 34 is moved through its total stroke, defined as the maximum positive and negative axial deviation from its zero current bias position, the number of coil turns within the gap, defining the effective length, L, of the coil 34 remains constant. In the long coil actuator 10, an equal length of the coil 34 extends axially from each end of the gap when the coil 34 is in the zero current bias position as best seen in prior art FIG. 1. The positive and negative stroke limit is then equal to the axially projecting length.
In any prior art voice coil actuator, this condition on the constancy of the coil turns within the gap is necessary to maintain the linearity of the relationship between magnetic force, F, on the coil with respect to current, i, within the coil so that F.varies.i. Since F=iL B, where B is the magnetic flux density which is assumed to be uniform and radially confined within the gap, it is seen that the force, F, is only dependent on the coil current, i, or F/i=LB, with LB being the constant of proportionality, wherein the cross product drops out since the current is assumed to be perpendicular to the uniform radially confined flux. The above statement that the gap height and the effective coil length, L, are identical for the long coil actuator 10 may only be made if the magnet flux density, B, is assumed to be radially confined and uniformly distributed within the gap.
Another type of known prior art voice coil actuators is known as a short coil actuator. In the short coil actuator, the axial length of the coil is less than the height of the gap and, at zero current bias is centered therein. The positive and negative stroke limit is then equal to one-half of the gap height less the coil length so that the coil is always confined within the gap. Based on the above assumption, the effective length, L, of the coil is then equal to its actual length.
Considering only the geometry of the construction of the long and short coil actuator designs, it would appear that the above condition for linearity exist as long as the magnetic flux density within the gap is assumed to be radially confined and uniformly distributed therein. However, it will be shown that in the prior art voice coil actuators, this assumption is not true. It will therefore become apparent that for either the long coil or short coil actuator, the force, F, is a function of each of the current, i, length, L, and flux density, B, or F=f(i,L,B) wherein .differential.F/.differential.L and .differential.F/.differential.B are nonzero quantities as the coil moves axially due to magnetic flux leakage at the edges of the gap and nonumiformity of flux density along the length of the gap, as set forth in greater detail hereinbelow. This nonzero dependency of the force, F, on each of the effective coil length, L, and flux density, B, causes a nonlinear response to the coil current, i, and results in harmonic distortion of the coil actuation. This harmonic distortion is one disadvantage and limitation of the prior art voice coil actuator is that the sound produced by the actuation of the voice coil driving a speaker cone is not a pure analog of the coil current. Another disadvantage and limitation is a reduction of efficiency due to leaking magnetic fields not contributing to the flux passing through the coil.
The assumption on the radial confinement and uniform distribution of the flux density within the gap is false for two reasons which although demonstrated in reference to the long coil actuator 10 are also applicable to the short coil actuator. First, since the respective lower 36,38 and upper 40,42 edges of the first and second pole pieces 26,28 present a discontinuity, the flux density fringes outside of the gap from the edges 36,38,40,42 of the pole pieces 26,28 such that the flux is not radially confined within the gap. Secondly, since magnetic flux follows the path of least resistance, the flux density in the gap is therefore greatest at the lower edge 36 of the first pole piece 26 where the first pole piece 26 is adjacent the magnet 14 and decreases toward the upper edge 42 of the second pole piece 28 such the the flux is not uniformly distributed. The nonuniformity of distribution also occurs at the fringing fields at either end of the gap.
In either the long or short coil actuator, the nonuniformity of the flux distribution results in the flux which interacts with the coil to be dependent on the instantaneous position, x, of the coil in the gap as determined at the center of the coil. Since the coil has a finite length within the gap, the current through each loop will be effected by a different value of flux density. The total force, F, acting on the coil will therefore be a summation over the length of the coil of the force developed by the current in each loop of the coil interacting with the flux resulting in the expression F=.intg.i(x) B(x)dx, where the lower and upper limits of integration are x-L/2 and x+L/2, respectively. Since the coil is continuous over its length, the current in each loop is identical, or i(x)=i so that the above expression simplifies to F=i.intg.B(x)dx. Therefore, .differential.F=(.intg.B(x)dx).differential.i+(i.intg.B(x)dx).differential .B.
Therefore, it is seen that the change of force, .differential.F, is not linear with respect to the change of current, .differential.i, but depends on the coil position, x, within the gap, the length of the coil, L, since these terms are within the limits of integration, and the variation of the flux density, B, over the length of the coil. This nonuniformity is especially prevalent in the short coil actuator since the gap height being much greater than the coil length causes the coil to be exposed to a greater degree of nonuniformity of the flux density along the length of the gap. An additional nonlinearity is introduced in the long coil actuator since the coil at either stroke extreme is removed from a fringing field external of the gap, thereby making the effective coil length, L, also a function of the coil position, x, or L=L(x), which therefore introduces a nonlinear variable into the limits of integration.
In addition to the above described nonlinearities of the known voice coil actuator, a further limitation and disadvantage is the magnetic flux leakage external of the core. For example with reference to prior art FIG. 1, the flux will also fringe from each pole end face 16,18 of the magnet 14 external from the core 12. First, this external fringe results in a waste of useable flux, thereby reducing conversion efficiency of the prior art voice coil actuator. Secondly, this external fringe can also detrimentally interact with nearby electronic circuitry, which often requires the prior art voice coil actuator to be heavily shielded which adds to its size, weight and cost.


An object to provide a vent pipe isolation balloon for a liquefied gas storage tank, which has excellent physical strength, inflatability, and durability at cryogenic temperatures, and a vent pipe isolation device including the balloon. The vent pipe isolation balloon has inner and outer membranes made of silicon rubber, and a reinforcing substrate sandwiched between the inner membrane and the outer membrane. The balloon has an outer shape of a cylindrical shape or a truncated cone shape with both ends opened, and is inflated when an inert gas is injected into the balloon with the openings sealed. The reinforcing substrate is composed of a fiber bundle and has a network structure.

When a gas pipe is repaired, a gasbag may be used to temporarily shut off gas. After the gasbag is inserted into the gas pipe, air is inserted to inflate the gasbag to a full inner diameter of the gas pipe, so that the gas pipe can be temporarily isolated (Patent Literatures 1 to 3).
On the other hand, a tanker that transports liquefied gas such as liquefied natural gas (LNG) or liquefied petroleum gas (LPG) includes a tank storing liquefied gas obtained by liquefying gas such as methane, propane, butane, ethylene, or ammonia at a cryogenic temperature. In such a storage tank of the tanker, a vent pipe is vertically connected to an upper portion of the tank, and a safety valve is provided at the top of the pipe. Although the safety valve needs to be inspected regularly, during the inspection, the vent pipe on the downstream side of the safety valve must be isolated to prevent leakage of vaporized gas to the outside. In the event of an emergency such as a failure of the safety valve, the vent pipe on the downstream side of the safety valve must be isolated in the same manner.
Here, tankers that transport liquefied gas are subjected to the International Gas Carrier Code (IGC Code) for ships that will begin construction on or after Jul. 1, 2016. The IGC code (8.2.9) stipulates that "a vent pipe device on the downstream side of a pressure relief valve should not be equipped with a stop valve". Unlike general pipes, a pipe cannot be isolated by the stop valve when safety valves (pressure relief valves) are checked or repaired. Thus, when the safety valve is checked or repaired, the pipe provided with the safety valve may be isolated using a device called a balloon.
On a vent pipe of a tanker that transports liquefied gas, a balloon insertion pipe is provided upstream of the safety valve. First, a lid of the insertion pipe is opened, and an insertion device balloon attached to the tip is attached to an inlet of the insertion pipe. Thereafter, the balloon attachment portion is inserted into the vent pipe, and an inert gas such as nitrogen gas is injected into the balloon to inflate the balloon and occlude the vent pipe. After the inert gas is injected into the balloon to a predetermined pressure, the safety valve is checked, repaired or replaced.
After completion of check or the like, the inert gas is extracted to deflate the balloon, the insertion device is pulled back, and the balloon is extracted from the vent pipe. A balloon insertion device is detached from the insertion pipe, and the lid of the insertion pipe is closed.
The balloon used for the purpose of isolating the vent pipe is generally a balloon which is formed into a bag shape by sewing a high-strength fabric and in which silicon rubber is applied to a portion in contact with an inner surface of the vent pipe in order to improve adhesion to the inner surface of the vent pipe. FIG. 1 shows an example of a conventional balloon (during inflation). FIG. 1(a) shows an appearance photograph, and FIG. 1(b) shows a configuration diagram thereof. Conventional balloons are generally based on a high-strength fabric made of a material such as nylon, aramid, or polyethylene. In FIG. 1(a), a top end portion (corresponding to an opening 206 in FIG. 1(b)) is airtightly fixed to an inert gas injection pipe. A balloon body is constituted of three portions including, an upper portion 202, an intermediate portion 203, and a lower portion 203, which are stitched by stitching portions 205a and 205b, respectively. A convex portion 208 is formed on the upper portion 202, and a balloon insertion device is fixed to an opening 206. A silicon rubber layer 207 is formed on the surface of the intermediate portion 203, and an engaging force due to the frictional resistance occludes the vent pipe.

Vent pipe isolation balloon for liquefied gas storage tank and vent pipe isolation device


During the application of heat the intumescent coating is transformed into a swollen char material, which acts as a thermal barrier to eliminate or minimize incoming heat flux. It also acts as a mass transfer barrier, inhibiting oxygen from reaching the thermally insulative ablative material. During the intumescence process, the swollen material will also back fill into interstices within the ablative material and char to enhance their strength. The intumescent coating also acts as a moisture barrier to protect the thermally insulative ablative material from ambient elements such as moisture.

1. Field of the Invention
The present invention relates to ablator compositions and more particularly to an ablator composition, which utilizes an intumescent coating.
2. Description of the Related Art
Launch vehicle configurations often employ solid rocket boosters (SRB""s) to augment the thrust of the main engine. Because of the proximity of the SRB plumes to the base region of the main engine, the convective and radiative heating augmentations to the base region of the main engine due to these SRBs are substantial. A layer of low temperature ablative (LTA) is needed to protect the structure in this region. The thermal, mechanical and chemical performances of the ablatives in the hostile environment produced by the rocket exhaust are of importance in the design of the thermal protection system. The requirements imposed on the insulation are as follows:
1. Ability to withstand the aerodynamic loads and aeroheating encountered during flight;
2. Protection and maintenance of the substructure below a critical temperature;
3. Light weight, low cost and ease to manufacture and to install;
4. Ability to withstand thermal shock due to launch plume heating;
5. Ability to withstand the mechanical and acoustic vibration environment; and
6. Chemical and mechanical compatibility with adhesive and substructure throughout the entire flight.
When an external heat flux is applied to the base of the main engine, the LTA material protecting this region may decompose in-depth and recede at its surface. The modes of surface recession may include combinations of phase change processes such as melting, sublimation, as well as, exothermic or endothermic chemical reactions such as oxidation and combustion. Similarly, in-depth decomposition, such as pyrolysis, may involve outgassing, phase change and chemical reactions. The ablation performance of these LTA are often characterized by q* or
37 heat of ablationxe2x80x9d defined as
q*=qdot/mdot,
where qdot is the net heat flux=qhwxe2x88x92qrad;
mdot is the rate of mass loss;
qhw=convective hot wall flux; and
qrad=net radiative heat flux.
The primary mechanisms for the LTA to counter the applied heat flux are high heat of ablation and low thermal conduction. Thus, the ideal properties of LTA include low density and thermal conductivity, ease of manufacturing and installation, and the ability to withstand flight conditions.
Another desirable property of an ideal LTA is to form strong char during the ablation process. If the strength of the char adhering to the surface is sufficient to keep it from being swept away by aerodynamic shear forces and acoustic vibrations, the performance of the insulation can be improved because of:
a) Increased thermal protection since less material is removed;
b) Increased thermal protection since the char in general is porous, lightweight and has low thermal conductivity; and
c) Increased radiant heat loss from surface since the char in general has higher emissivity and can withstand high temperature. The higher surface temperature also reduces convective heat gain.
Cork, with over 200 million cells per cubic inch, is often chosen as the LTA thermal protection system (TPS) because of the structure and mechanics of these cells. It is used as insulation material for launch vehicles because of its low density yet resilient mechanical properties; minimal cost; its ability to absorb vibration and withstand acoustic noise; and, its chemically stability. This natural product is cleaned, ground, mixed with various resins such as phenolic and formed into complex shapes. Common cork based TPS materials include cork epoxy, cork phenolic and cork silicone.
The combustion of cork and phenolic resin to form weakened char is the single most important failure mode of the cork phenolic heatshield materials. When the material is exposed to high heat flux and oxygen from ambient atmosphere, the cork-based ablatives quickly char and begin burning. Once ignited, the ablatives will continue to burn even after the external heat source is turned off. As the cork phenolic TPS ablates, the surface of the TPS will form char with cracks, the size of which increases with time. Eventually the remaining material will break and erode away due to the mechanical load or aerodynamic shear.
A typical launch vehicle may sit on the launch pad for days prior to flight, and often the TPS can absorb a significant amount of moisture if left unprotected. Existing families of launch vehicles often employ a coating of paint to seal the TPS. The launch vehicles may also have an additional layer of electrically conductive paint to ground electrical charges in the atmosphere.
The layer of LTA needed to protect the structure from excessive convective and radiative heating can add substantial weight, cost, technical risk and performance penalties to the launch vehicle""s manufacturer and integration team.
It is therefore a principal object of the present invention to provide an improved ablative composition, which can be applied to a substrate to protect the substrate from external heat flux.
It is another object to coat an ablative material such that during exposure to heat, the coating will swell to provide a thermal barrier, inhibit ambient air from contacting the ablative material, and provide a back fill into interstices within the ablative material and char to enhance their strength.
Another object is to provide an ablative composition with a moisture barrier.
Still another object is to provide an ablative composition with a layer of electrically conductive coating to ground electrical charges in the atmosphere.
Yet another object is to provide an ablative composition with a coating to reflect incoming radiant heat flux.
These and other objects are achieved by the present invention, which in its broadest aspects comprises a thermally insulative ablative material and an intumescent coating covering the thermally insulative ablative material. During the application of heat the intumescent coating is transformed into a swollen char material, which acts as a thermal barrier to eliminate or minimize incoming heat flux. It also acts as a mass transfer barrier, inhibiting oxygen from reaching the thermally insulative ablative material. During the intumescence process, the swollen material will also back fill into interstices within the ablative material and char to enhance their strength. The intumescent coating also acts as a moisture barrier to protect the thermally insulative ablative material from ambient elements such as moisture. The intumescent coating also acts as the electrically conductive paint to ground electrical charges in the atmosphere. The intumescent coating preferably contains particulate to reflect incoming radiant heat flux.
Other objects, advantages and novel features of the present invention will become apparent from the following detailed description of the invention when considered in conjunction with the accompanying drawings.


A pushpin device of one embodiment preferably comprises a head adapted to allow a user to apply pressure to the head without discomfort. A longitudinally extending fastening member comprises a point at a distal end and is coupled to the head at a proximal end. A base comprises an aperture. The aperture is configured to allow the fastening member to pass through the base as the head moves proximate to the base. An outer member is coupled to the head and the base. The outer member comprises a first position in which the head is spaced from the base and the outer member encloses a longitudinal segment of the fastening member. In a second position the head is proximate to the base and the outer member is deformed, thereby allowing the fastening member to extend through the aperture. The outer member exerts a countering force on the base and the head. One of the head and the base comprises magnetically susceptible material and the other comprises magnetic material. A magnetic force between the head and the base maintains the outer member in the second position in opposition to the countering force.

Push pins or thumbtacks are used to secure articles such as papers, drawings, photos and the like to vertical walls, bulletin boards, and ceilings. Push pins or thumbtacks typically have a head from which protrudes a pin from one side. The pin has a tip which is customarily inserted through an article and secured to a support surface.
One drawback to the conventional pushpin is that the sharp tips are always exposed and, when handled by or around a user, can create bodily injury. Furthermore, push pins can cause damage to articles that they are inserted through. Magnets also have drawbacks in that they need a ferrous surface to adhere to. Without a metal surface, magnetic bulletin board, or the like, they are rendered useless.


A method of creating a secure intellectual property (IP) representation of a circuit design for use with a software-based simulator can include translating a hardware description language representation of the circuit design into an encrypted intermediate form and compiling the intermediate form of the circuit design to produce encrypted object code. The method further can include linking the encrypted object code with a simulation kernel library thereby creating the secure IP representation of the circuit design. The secure IP can include an encrypted simulation model of the circuit design and a simulation kernel configured to execute the encrypted simulation model.

1. Field of the Invention
The embodiments disclosed herein relate to the field of integrated circuits and, more particularly, to creating a secure software representation of a circuit design for use in testing and/or verification with a software-based simulator.
2. Description of the Related Art
Modern integrated circuits (ICs) are developed through the use of hardware description languages (HDLs). HDLs such as Verilog®, VHDL®, and the like allow developers to create software-based representations of circuit designs. One advantage of using an HDL is the potential for code reuse from one design to another. This concept has been realized with the commercial availability of intellectual property (IP) cores. In general, an IP core refers to a software representation of a semiconductor, a circuit design, or any portion thereof, that provides a processing function.
IP cores are made available by hardware vendors and other third party suppliers. Presently, there is a strong demand for IP cores as designers use these software components to create and simulate embedded designs and digital signal processing designs. IP cores typically are implemented in an HDL. If distributed in this form, however, all information, whether licensed or not, relating to the supplier's IP core or the circuit design represented by the IP core would be revealed to third parties. Accordingly, IP core providers have an interest in securing IP cores prior to distribution and protecting them from reverse engineering.
One technique for securing an IP core is to pre-compile it prior to distribution to third parties. The IP core is distributed as compiled object code, which effectively encrypts the IP core. This manner of protection requires that the IP core be compiled specifically for use with each different third party simulation tool with which the IP core is to be used. The IP core is compiled using a third party compiler intended for use with the target simulator. Because the IP core is originally coded in a particular type of HDL, such as Verilog® for example, the resulting compiled object code must be executed in a particular type of Simulator. For example, simulation of a Verilog® IP core requires a Verilog® simulator. Alternatively, the user can purchase a mixed language simulator capable of executing both Verilog® and VHDL® IP cores. Mixed language simulators, however, can be very costly for the end user.
Another disadvantage of providing a pre-compiled IP cores is that the IP core may not be completely secure. Because the IP core is compiled using a third party compiler, it may be possible for the compiler creator, or another party, to inadvertently or deliberately reconstitute the object code into human readable form. This would expose the IP core provider's sensitive information.
Even if the IP core is not de-compiled, many third party encryption mechanisms still leave design details, such as the design hierarchy, exposed when the compiled IP core is used within the simulator. For example, when the compiled code of the IP is loaded into an HDL simulator, details such as the design hierarchy, names of signals, widths of signals, and the like, typically can be viewed. Also, the values of internal signals can be traced and/or viewed during simulation.
Another technique for securing an IP core is to provide the IP core in encrypted form. In that case, the IP core provider provides an interface, for example a SWIFT model (a description can be found at www.synopsys.com/products/ipmodeling/vmc_ds.html), to the encrypted IP core. This manner of protection, however, is not suited for use with parameterizable IP cores. A parameterizable IP core allows a user to specify a particular value for an attribute "X" of the IP core, thereby altering the functionality and/or interface of the IP core in some fashion according to the assigned value of "X". To produce a parameterizable, encrypted IP core, a different interface would have to be created for each possible value of "X" for the end user to utilize the full range of functionality offered by the parameterizable IP core. If the IP core has more than one adjustable attribute, such an interface would need to be created for each possible combination of attribute values, leading to a combinatorially large, and infeasible, number of interfaces to be created.
It would be beneficial to provide a technique for creating and using secure IP cores in a manner which overcomes the limitations described above.

Event-driven simulation of IP using third party event-driven simulators


A process for the in-line, high speed manufacturing of magnetic products is disclosed. The process comprises the steps of printing onto a substrate, drying the ink print, making the appropriate cuts or scores on the substrate, applying a slurry of magnetizable material onto the substrate to create the magnet, drying the applied material, magnetizing the magnetic material and cutting and forming the substrate to the desired dimensions. Each of these steps may be performed in a single, in-line manufacturing operation running at high speeds.

Flexible magnets today typically consist of a magnetic powder such as barium ferrite in a rubber-like or rigid binder extruded by commonly known techniques for extruding rubber or polymer materials. The extrusion is usually in the form of self-supporting sheets of various thicknesses. The magnetization of the material is performed commonly by moving these sheets through a device which employs high intensity magnetic fields to impart permanent magnetic properties to the sheet. The magnetized material may then be cut into any desired shape and adhered to steel walled appliances such as refrigerators, steel file cabinets and bulletin boards in offices or to certain furniture in the home.
A sheet of a suitable material, printed with advertising information, decorative patterns or any other desired graphic design may be adhered before or after the cutting by methods disclosed in U.S. Pat. No. 4,310,978. The use of magnets as an advertising tool, however, is not always commercially feasible because of the expense involved in adhering a magnet to such a sheet. This is particularly true where one is trying both to: 1) produce the separate magnet and printed sheet components; and 2) combine the two items into one package.
It is accordingly an object of the present invention to provide a simple, low-cost, in-line apparatus and process for the manufacturing of magnetic products which may be formed as an integral part of a large non-magnetic substrate.
Another object of the invention is to waste less magnetic material compared to present manufacturing processes which use, for example, conventional rubberized, pre-magnetized sheets or rolls of material.
Yet another object of the invention is to provide an efficient apparatus and process for the in-line production of magnets.
Still another object of this invention is to provide a high speed apparatus for magnetization.

Process for the in-line, high speed manufacturing of magnetic products


When a device desired to acquire emission right information is selected on a selection screen displayed on a display unit and a “SEND” icon is manipulated, a control unit causes the display unit to display consumables information of consumables granted with emission rights and consumables not granted with emission rights that is received from a server. When a user selects a consumable item that is desired to be ordered from among consumables indicated by the consumables information displayed on the display unit, and manipulates a “SEND ORDER SHEET” icon on the ordering screen, the control unit sends an order sheet to the server. The control unit causes the display unit to display, in the case of receiving order sheet receipt notification from the server in response to the sent order sheet, the received order sheet receipt notification.

1. Field of the Technology
The present technology relates to an image forming apparatus, a consumables ordering system and a consumables ordering method capable of using consumables to which emission rights of greenhouse gases are granted.
2. Description of the Related Art
As an idea for reducing emissions of greenhouse gases such as carbon dioxide, a carbon offset has been proposed. The carbon offset means activities for compensating for all or a part of the emissions, which is difficult to be reduced even though citizens, companies, governments, and other social entities recognize their own greenhouse gas emissions and make efforts to voluntarily reduce their emissions together, by purchasing a reduction or absorption amount (hereinafter, referred to as "credits") of greenhouse gas emissions realized in other positions, carrying out projects and activities for reducing and absorbing greenhouse gas emissions in other positions, or the like.
As one carbon offset initiative, there is a trade in greenhouse gas emission rights. For example, emission rights, corresponding to greenhouse gas emission discharged to generate electricity consumed by the image forming apparatus during an operational time period in which consumables are used, are purchased by a manufacturer or a vendor as a credit on behalf of a user and are provided to the user who purchases the consumables. The image forming apparatus identifies consumables having the emission right and manages exchange, recovery, and the like of the identified consumables. For example, as a credit, there is a Kyoto mechanism credit issued on the basis of procedures determined by the Kyoto Protocol.
As a conventional art concerning transfer of emission rights of greenhouse gases, there is an electronic apparatus that is described in Japanese Unexamined Patent Publication JP-A 2010-2442. This electronic apparatus uses a consumables unit that is sold in a form in which emission rights of greenhouse gases are granted as a consumables unit attachable/detachable to/from the electronic apparatus. Then, evaluation is performed for reduction of greenhouse gases according to a continued usage state of this consumables unit, and the evaluation result is displayed on a manipulation panel or the like, or printed on a sheet. Thereby, user's awareness of greenhouse gas reduction is attempted to be increased.
However, in the above-described conventional art, the consumables unit that is sold in the form in which emission rights of greenhouse gases are granted is used, thus making it possible to increase user's awareness of greenhouse gas reduction, however, for a user who uses consumables at extremely less use frequency, or a user who extremely less frequently uses an image forming apparatus, purchase of consumables to which the emission rights are granted increases a burden by expense of the emission rights that are granted to the consumables. Such a user purchases an image forming apparatus with the conventional art only capable of using consumables to which the emission rights are not granted, and tends to avoid purchase of consumables to which the emission rights are granted or an image forming apparatus to which the emission rights are granted.

Image forming apparatus, consumables ordering system and consumables ordering method


A high temperature flexible pipe and method of making a high temperature flexible pipe is provided. The pipe can have an inner tubular layer formed of a high temperature thermoplastic, a first reinforcing layer, a second reinforcing layer and an outer sheath. In one aspect, an insulating layer may be provided between the second reinforcing layer and the outer sheath. A method of making a flexible pipe is also provided. The first reinforcing layer is wound around the inner tubular layer and the second reinforcing layer is wound around the first reinforcing layer. An outer sheaf can be formed over the second reinforcing layer. In another aspect, an insulating layer can be formed over the second reinforcing layer before an outer jacket is formed over the insulating layer.

Flexible pipes are needed for conveying fluids under pressure such as natural gas, sour gas, carbon dioxide, hydrocarbons, etc. In some applications these fluids are at elevated temperatures which can decrease the life and performance of flexible pipes made of conventional materials.
It is desirable that the pipe be capable of being spoolable, handled, bent, etc. without collapsing, buckling, splitting, cracking, etc., even in low temperature environments, yet also be capable of containing high pressure flows at elevated temperatures under conditions of use, such as when buried, unrestrained and bent.


A pneumatic tire with a designated rotational direction comprises a tread portion, a pair of center circumferential main grooves extending on both sides of a tire equatorial plane, a center land portion between the center circumferential main grooves, a ripe provided with the center land portion, a plurality of V-shaped grooves each provided separately in the center land portion, each V-shaped groove having a peak located in a middle area of the center land portion, the first inclined portion extending from the peak to one side edge of the center land portion, and the second inclined portion extending from the peak to the other side edge of the center land portion, and a first inclined sub-groove and a second inclined sub-groove provided between a pair of V-shaped grooves, the first inclined sub-groove and the second inclined sub-groove being provided separately in the circumferential direction of the tire.

1. Field of the Invention
The present invention relates to a pneumatic tire that is suitable for a studless tire or the like, and can be improved in on-ice performance without exerting any influence on other tire performance.
2. Description of the Related Art
To achieve improvement of on-ice performance, studless tires have a large number of sipes on blocks or the like at a tread portion so as to increase a tread surface scratching force (edge effect) by the edges of the sipes. In addition, studless tires have a higher land ratio of a tread pattern to increase a ground-contact area and enhance a traction force with respect to an ice surface.
In recent years, for decreasing side slips on an icy road and enhancing grip performance on cornering (lateral grip performance), there has been demand that sipes be inclined in a tire axial direction so as to have a larger edge component in a circumferential direction thereof. However, as shown in FIG. 4, if an inclined angle θ of sipes "a" with respect to a tire axial direction is large, brock parts "b" divided by the sipes "a" become virtually small in thickness t, which leads to reduction in block rigidity, thereby resulting in deteriorated wear resistance, for example.
In light of such circumstances, the inventor of the subject invention has conducted research and revealed the following matters.
First, a center region of a tread portion on a tire equatorial plane side is under a higher ground-contact pressure compared with other regions. Accordingly, the center region delivers high levels of edge effect and traction force, which makes high contribution to on-ice performance. Therefore, it is possible to improve on-ice performance with a limited land ratio by increasing relatively a width of a center land portion disposed in the center region in the tire axial direction.
Next, it is possible to increase circumferential edge components and further improve on-ice performance by providing the center land portion with v-shaped grooves. This achieves further higher block rigidity and suppresses an adverse effect on other tire performance, such as deterioration in wear resistance, as compared with the case of providing the center land portion with inclined grooves, for example.


A catalyst composition for the polymerization of propylene comprising one or more Ziegler-Natta procatalyst compositions comprising one or more transition metal compounds and one or more monoesters of aromatic carboxylic acid internal electron donors; one or more aluminum containing cocatalyst; and a mixture of two or more different selectivity control agents, said SCA mixture comprising from 70 to 98 mol percent of one or more esters of one or more aromatic monocarboxylic acids or substituted derivatives thereof, and from 30 to 2 mol percent of one or more alkoxysilane compounds containing one or more 5- or 6-membered cyclic groups optionally containing one or more Group 14, 15 or 16 heteroatoms.

The present invention relates to stereoselective Ziegler-Natta catalyst compositions for use in the polymerization of propylene having improved control over polymerization activity and reactor process continuity through the use of carefully chosen mixtures of selectivity control agents. Ziegler-Natta propylene polymerization catalyst compositions are well known in the art. Typically, these compositions include a transition metal compound, especially a mixed titanium, magnesium and halide containing compound in combination with an internal electron donor (referred to as a procatalyst); a co-catalyst, usually an organoaluminum compound; and a selectivity control agent (SCA). Examples of such Ziegler-Natta catalyst compositions are shown in: U.S. Pat. Nos. 4,107,413; 4,115,319; 4,220,554; 4,294,721; 4,330,649; 4,439,540; 4,442,276; 4,460,701; 4,472,521; 4,540,679; 4,547,476; 4,548,915; 4,562,173; 4,728,705; 4,816,433; 4,829,037; 4,927,797; 4,990,479; 5,028,671; 5,034,361; 5,066,737; 5,066,738; 5,077,357; 5,082,907; 5,106,806; 5,146,028; 5,151,399; 5,153,158; 5,229,342; 5,247,031; 5,247,032 and U.S. Pat. No. 5,432,244.
Catalyst compositions designed primarily for the polymerization of propylene or mixtures of propylene and ethylene generally include a selectivity control agent in order to affect polymer properties, especially tacticity or stereoregularity of the polymer backbone. As one indication of the level of tacticity, especially the isotacticity of polypropylene, the quantity of such polymer that is soluble in xylene or similar liquid that is a non-solvent for the tactic polymer is often used. The quantity of polymer that is soluble in xylene is referred to as xylene solubles content or XS. In addition to tacticity control, molecular weight distribution (MWD), melt flow (MF), and other properties of the resulting polymer are affected by use of a SCA as well. It has also been observed that the activity of the catalyst composition as a function of temperature may be affected by the choice of SCA. Often however, a SCA which gives desirable control over one polymer property, is ineffective or detrimental with respect to additional properties or features. Conversely, an SCA that is effective in combination with one procatalyst may not be effective when used in combination with a different procatalyst.
It is known that the use of certain alkoxy derivatives of aromatic carboxylic acid esters, especially ethyl p-ethoxybenzoate (PEEB), in combination with a Ziegler-Natta procatalyst composition containing a monoester of an aromatic monocarboxylic acid, exemplified by ethyl benzoate, results in an inferior catalyst composition possessing lower overall polymerization activity and polymers having relatively low isotacticities and increased oligomer contents, all of which are generally undesired results.
Disadvantageously however, alkoxysilane SCA's, exemplified by dicyclopentyldimethoxysilane (DCPDMS), methylcyclohexyldimethoxysilane (MCHDMS) and n-propyltrimethoxysilane (NPTMS) when used in combination with ethylbenzoate internal electron donor results in catalyst compositions that are not generally self-extinguishing. That is, these compositions can give polymerization process control problems, especially sheeting and formation of large polymer chunks due to hard to control temperature excursions allowing polymer particles to form agglomerates. Such catalyst compositions are not "self-extinguishing". Rather, at higher reaction temperatures, they tend to be more active, resulting in difficult to control processes. In addition, under conditions of a reactor upset or a power outage, the normally fluidized reaction bed of a gas phase polymerization reactor may settle to the diffuser plate of the reactor. In that state, continued polymerization may generate excessive temperatures, resulting in fusion of the entire reactor contents into a solid mass which requires opening of the reactor and laborious effort to remove the polymer mass.
Use of mixtures of SCA's in order to adjust polymer properties is known. Examples of prior art disclosures of catalyst compositions making use of mixed SCA's, especially mixtures of silane or alkoxysilane SCA's include: U.S. Pat. Nos. 5,100,981, 5,192,732, 5,414,063, 5,432,244, 5,652,303, 5,844,046, 5,849,654, 5,869,418, 6,066,702, 6,087,459, 6,096,844, 6,111,039, 6,127,303, 6,133,385, 6,147,024, 6,184,328, 6,303,698, 6,337,377, WO 95/21203, WO 99/20663, and WO 99/58585. References generally showing mixtures of silanes with monocarboxylic acid ester internal electron donors or other SCA's include: U.S. Pat. Nos. 5,432,244, 5,414,063, JP61/203,105, and EP-A-490,451.
Despite the advances occasioned by the foregoing disclosures, there remains a need in the art to provide an aromatic monocarboxylic acid ester internal electron donor containing Ziegler-Natta catalyst composition for the polymerization of olefins, especially propylene and propylene containing mixtures, wherein the catalyst composition retains the advantages of alkoxysilane SCA containing catalyst compositions with regard to polymer properties, but additionally possesses improved temperature/activity properties. Especially desired are such compositions that are inherently self-extinguishing with regard to catalyst activity as a function of temperature, thereby leading to reduced polymer agglomerate formation, improved polymerization process control, and increased immunity to reactor upset or power outages.

Catalyst composition with monocarboxylic acid ester internal donor and propylene polymerization process


An element is formed on the major surface of a semiconductor wafer, and a groove is formed in the back surface of the semiconductor wafer along a dicing line or chip dividing line by a mechanical or chemical method. A modified layer is formed by irradiating the groove with a laser, and the semiconductor wafer is divided by using the modified layer as a starting point. The back surface of the semiconductor wafer is removed to at least the depth of the groove.

1. Field of the Invention
The present invention relates to a semiconductor device fabrication method and, more particularly, to a technique of cutting and dividing a semiconductor wafer having undergone element formation into semiconductor chips.
2. Description of the Related Art
Conventionally, a mechanical method such as using a dicing blade or scriber forms cutting grooves along dicing lines or chip dividing lines of a semiconductor wafer having undergone element formation, and a breaking method or expanding method divides the wafer (e.g., Jpn. Pat. Appln. KOKAI Publication No. 2002-198326). It is also possible to use a method which forms modified layers (brittle layers) by irradiating a wafer along chip dividing lines with a laser or the like, thereby dividing the wafer (e.g., Jpn. Pat. Appln. KOKAI Publication No. 2004-79746).
When the breaking method or expanding method divides a semiconductor wafer, however, the starting point of breakage (cleavage) of the wafer often becomes unstable, allowing the cleavage plane to reach an interconnection region formed inside a chip, thereby producing defective products. This is so because the starting point of cleavage is, e.g., a flaw, strain, or crystal defect produced when a dicing blade or scriber mechanically forms a cutting groove. Also, even when cleavage does not reach the interconnection region and hence has no influence on an internal circuit, variations in chip shape or undulation of the edge pose problems in later steps, thereby decreasing the fabrication yield.
On the other hand, the method which forms modified layers by laser irradiation or the like can avoid the problems of the mechanical method as described above. However, a distance (depth) in the direction of thickness of a chip which can be modified by laser irradiation is presently at most about 20 to 30 μm. To divide a wafer by laser irradiation, it is necessary to modify a distance equal to or larger than the final thickness (the cleavage plane on a side surface) of a semiconductor chip, and equal to or larger than about 50% of the thickness of a wafer when it is divided. For example, when the thickness of a wafer when it is divided is 500 μm and the thickness of a chip when it is finally encapsulated into a package is 100 μm, it is necessary to form a modified layer having a thickness of at least 300 to 400 μm (inclusive). Therefore, a modified layer must be formed by irradiating the same line with a laser about 10 to 13 times while the focal position in the direction of depth (the formation position of the modified layer) is changed. This prolongs the time necessary before cutting, and worsens the productivity.
Also, the back surface of a semiconductor wafer having a diameter of 8 inches or less is a satinized surface. When a laser irradiates the back surface, therefore, no modified layer is formed inside the wafer because the roughened surface irregularly reflects the laser. Accordingly, the back surface of the semiconductor wafer must be planarized to a plane surface having a grit of #2000 or more by grinding or etching. This reduces productivity.


A machine and method for converting a web having an indefinite length which includes a plurality of converting stations circumferentially spaced about an process drum. At least one of the converting stations includes a helical follower gear operatively meshing with a helical drive gear attached to the process drum. Movement of the follower gear along its axial direction provides for the relative rotational registration of a tool on the registrable converting station relative to the web.

The high speed conversion of materials in continuous web form is well known. Such "converting" processes include die cutting, slitting, sheeting and placement of components on a moving web. Traditionally, each converting step is carried out at a different location or converting station located along a linear piece of production equipment. As used herein the terms "continuous web" and "web having an indefinite length" refer to webs that have a length sufficiently great relative to converting machine and process that for a reasonable period of time the web does not have an end passing through the converting machine or process.
One problem with converting equipment is controlling registration along the web between stations which are performing converting steps on the web. Registration has been achieved by using individual drives at each converting station which are controlled electronically to maintain both registration with respect to the converting steps as well as proper web tension between stations. Such systems are, however, typically expensive and may require elaborate programming to maintain proper web tension and registration between stations.
Earlier designs of converting equipment relied on mechanical registration between stations by providing a central driveshaft which was used to drive individual stations located in a linear arrangement. The length of such systems resulted in an accumulation of tolerances along the driveshaft. As a result, it was difficult to maintain those systems in registration because of the tendency of the machine to drift out of registration due to the variations induced by those tolerances. Furthermore, the mechanical registration drive control systems also suffered from a lack of independent registration control at each of the converting stations. In addition, where tension control was important, such systems required relatively elaborate and expensive tension controls including nip rolls and tension rolls.
The problems of controlling both registration and tension with any converting system are substantially increased when converting elastic and/or delicate web materials which are much more sensitive to tension variations than more stable web materials. Lack of tension control and corresponding registration problems make such materials difficult to convert and result in high waste and low productivity.
Another disadvantage of linear web converting lines, whether relying on electrical or mechanical registration control, is that they require relatively large amounts of floor space for converting processes which increases the cost of goods produced using the converting lines.
U.S. Pat. No. 4,854,983 to Bryniarski et al. discloses a method of heat sealing a web by directing it over a central roll around which a plurality of nip rolls are placed. The central roll is preferably heated at certain areas to affect heat sealing of the plastic web material in the transverse web direction. Although this design does disclose a series of nip rolls circumferentially spaced around a central roll, there is no discussion regarding registration problems because the nip rolls do not perform converting operations which require registration. Instead, heat sealing is performed by heated sections on the central roll, around which spacing is constant.
U.S. Pat. No. 5,017,184 to Takahori et al. discloses a single converting station design in which rotary registration is accomplished between a tool roll and an anvil roll through the movement of helical gears to effect a relative rotation between the tool roll and anvil roll. This system is not, however, deployed on the circumference of a central anvil roll along with other converting steps requiring registration.


Structures include a tunneling device disposed over first and second lattice-mismatched semiconductor materials. Process embodiments include forming tunneling devices over lattice-mismatched materials.

Electronic devices utilizing quantum tunneling mechanism are potential candidates to replace conventional Si-based devices as a new type of logic device, or to enhance the performance of conventional Si-based devices and circuits when used together with the conventional Si devices. Quantum tunneling devices inherently have very high speeds and also can enable more functionality. Their negative differential resistance (NDR) characteristics result in an inherent latching mechanism that enables very compact circuit configurations. They may be utilized to construct high speed and low power dissipation logic and memory circuits. A tunneling device-based circuit also has a much smaller footprint since fewer devices are needed in constructing a functional circuit, in comparison to a conventional circuit.

Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures

Taiwan Semiconductor Manufacturing Company, Ltd.


A radiography order information request to request a radiography order information of an information system is transmitted to the information system through a network. Radiography order information corresponding to the radiography order information request is received from the information system through the network. The received radiography order information is stored. Connection to the network is sensed. On the basis of the sensing result, the radiography order information corresponding to the radiography order information request is obtained.

Techniques of imaging a transmission intensity distribution of radiation with penetrability, represented by X-rays, have laid foundation for the developments of modern medical technologies. Since the discovery of X-rays, imaging of an X-ray intensity distribution obtained when X-rays pass through an object is done by converting the X-ray intensity distribution into visible light and then forming and developing a latent image on a silver halide film.
Recently, an X-ray image digitizing method using a so-called imaging plate has become popular. In this method, a photostimulable phosphor is used. A latent image that is formed by X-ray irradiation as a stored energy distribution on the photostimulable phosphor is excited by a laser beam, read, and converted into a digital image.
In addition, along with advance in semiconductor technologies, a large-sized solid-state image sensing element, i.e., a so-called flat panel detector having a size of a human body as an object under examination has also been developed. Hence, an X-ray image of an object can be directly digitized without forming a latent image, resulting in efficient diagnosis.
On the other hand, as an information network in a hospital has been built up, information systems for handling information on the network, such as a HIS (Hospital Information System), RIS (Radiology Information System), and PACS (Picture Archiving and Communication System), have been developed while being closely related to the operation of a radiography apparatus.
A hospital information system deals with management information in the hospital in general, including patient information (e.g., a patient ID, patient name, sex, and date of birth) and accounting information. The RIS manages information about imaging by e.g., receiving an imaging order from a clinic and issuing, to the department of radiology, an imaging order containing specific conditions such as the target patient, the part to be imaged, and the imaging equipment to be used for imaging. The RIS also manages imaging conditions by receiving an imaging start/end notification from the imaging order recipient. The PACS executes image data archive management by, e.g., archiving radiographed image data and, upon receiving a past radiographed image data review order, searching for and sending necessary radiographed image data.
Radiography apparatuses in a hospital are classified into stationary types fixed in imaging rooms and mobile types capable of moving in the hospital. A stationary radiography apparatus is connected online to each information system in the hospital. Hence, the apparatus can receive imaging order information from the RIS or transmit an imaging start/end condition to the RIS or a radiographed image to the PACS.
A mobile radiography apparatus can be carried to a hospital facility such as a sickroom, operation room, ICU, or ER to radiograph a patient who cannot come to the imaging room. The apparatus is of a mobile type and normally difficult to connect to a network through a cable. However, for example, patent reference 1 proposes a mobile radiography apparatus wirelessly connectable to a network. In patent reference 1, even the mobile radiography apparatus can access each information system in a hospital, like a stationary type.
[Patent Reference 1] Japanese Patent Laid-Open No. 2004-41698
As described above, a wireless equipment is necessary to make the conventional mobile radiography apparatus access an information system in a hospital.
In the hospital, however, there is a fear of operation errors of medical equipment or influence on patient's cardiac pacemakers. The use of devices that generate radio waves is sometimes limited, and it may be impossible to introduce a wireless equipment. In such an environment, the conventional wireless mobile radiography apparatus is inhibited from accessing the network through a wireless system and is therefore hard to introduce.

Mobile radiography apparatus, control method thereof, and program


Methods and apparatuses for inspecting a semiconductor device using electron beam are provided. The methods may include performing detection operations on a detection target pattern N times and determining a number of detection operations which have been performed until a maximum secondary electron amount of the detection target pattern is obtained. Each of the detection operations may include irradiating the detection target pattern with an electron beam, interrupting the irradiating and detecting a secondary electron amount of the detection target pattern after a detection waiting time has elapsed since the interrupting the irradiating.

Semiconductor devices are widely used in electronic industries because of those small sizes, multi-function, and/or low manufacture costs. Semiconductor devices may include various patterns formed through various manufacturing processes such as deposition, photolithography, etch or ion implantation.
Inspection apparatuses, using electron beams, may be used to identify manufacturing defects in semiconductor devices.

Methods and apparatuses for inspecting semiconductor devices using electron beams


A pusher centrifuge includes a rotatable filter drum having a drum body and a piston that are configured to be reciprocated axially relative to one another, a filter drum drive shaft rigidly connected to the filter drum, a hydraulic push mechanism for generating an axial oscillating push force and connected to the filter drum so as to cause the relative reciprocating movement between the piston and the drum body, a hydraulic pump including a pump input shaft and is in fluid connection with the hydraulic push mechanism, and a drive motor including at least one output shaft connected to the pump input shaft and the filter drum drive shaft to actuate both the pump input shaft and the filter drum drive shaft. The at least one output shaft of the drive motor is connected to the pump input shaft in a manner without an intervening gearbox, thereby forming a direct drive.

Pusher centrifuges are used in many applications in chemistry and in the processing of raw materials. In general, in a conventional pusher centrifuge, a solid portion and a liquid portion of a solid-liquid mixture are separated from each other in a filter drum device of the pusher centrifuge by means of a rotational movement and the solid portion is moved out of the filter drum device of the pusher centrifuge by means of an axial oscillating push movement. For this purpose, a conventional pusher centrifuge generally includes two electric motors, by which the generation of the rotational movement and the generation of the axial oscillating push movement are respectively caused, wherein for this purpose a respective torque of the two electric motors is indirectly transmitted by means of a belt to the filter drum device and to a hydraulic pump, by means of which a hydraulic pressure causing the axial oscillating push movement is generated.
Throughout the figures, identical or similar components are provided with the same reference signs.

Pusher centrifuge with direct drive transmission


A three-dimensional article making apparatus includes a build material dispenser for dispensing build material based upon the article defining data, and a deviation sensor for sensing a deviation during construction of the article. The apparatus may operate the build material dispensing means to adjust or recover for a sensed deviation during construction of the article. A portion of dispensed build material may be removed responsive to a sensed deviation. In addition, the deviation sensor may be operated a plurality of times during construction of the article, and a portion of dispensed build material may be removed down to a previous desired article portion. The deviation sensor may be provided by article formation deviation sensor, a build material dispenser sensor, an article defining data deviation sensor, and/or a build rate deviation sensor. The article deviation sensor may cooperate with a heated electrically conductive body used to periodically dimensionally normalize the article. Method aspects of the invention are also disclosed.

In the design and manufacture of a three-dimensional article, it is common practice to first create an initial design and then manually produce a custom prototype, or model, of the article based upon the initial design. After reviewing the initial prototype, design revisions are often made requiring the production of yet another prototype. This process of review and redesign may be repeated a number of times before finding the desired design thereby requiring a number of iterative steps to produce a single finished article. Accordingly, the process of designing and prototyping an article may involve considerable time, effort and expense.
Computer aided design (CAD) is commonly used for automating the design process. With the aid of a suitable computer, an operator is able to design a three-dimensional article and display the design on a two-dimensional medium, such as a display screen or paper. A significant advance in the art of three-dimensional design and modeling is disclosed in U.S. Pat. No. 4,665,492 to Masters entitled "Computer Automated Manufacturing Process and System." This patent discloses an apparatus including a positionable ejection head for ballistically emitting small mass particles to construct a three-dimensional article based upon article defining data. In other words, the patent discloses the advantageous combination of CAD with an apparatus for precisely constructing the article based upon the generated CAD data.
Another method and apparatus for forming three-dimensional objects is disclosed in U.S. Pat. No. 5,136,515 to Helinski entitled "Method and Means for Constructing Three-Dimensional Articles by Particle Deposition." This patent discloses a device including two positionable jetting heads with two feeder lines connected to respective remote sources of melted wax, for example, to provide both object and support material.
The formation of three-dimensional articles by jetting a photosetting or thermosetting material is disclosed in U.S. Pat. No. 5,059,266 to Yamane et al. entitled "Apparatus and Method for Forming Three-Dimensional Article." A jet sequentially or intermittently jets the photosetting or thermosetting material in a droplet form along a flight path to a stage on which the article is constructed.
A conventional jet or jetting head may require a constant, uninterrupted, supply of liquid build material delivered thereto. If the supply is interrupted, the processor or controller may still continue to position and attempt to fire the jet. However, a portion of the article may fail to be formed if the flow of material is interrupted.
U.S. Pat. No. 5,260,009 to Penn entitled "System, Method, and Process for Making Three-Dimensional Objects" discloses yet another apparatus for forming three-dimensional articles wherein a second or support material is dispensed with each layer of the three-dimensional article as it is formed, and wherein feeder lines provide a source of the liquid material to a plurality of jets carried by a movable head. An inspection station is provided for the jets and includes a conveyor belt which received drops of melted media from the jets. An optical sensor scans the parallel lines produced by simultaneous operation of the jets. If a jet is malfunctioning, the jets are directed to complete a purge-and-wipe for expulsion of any foreign matter. Proper operation of the jets is determined before beginning formation of an article; thus, errors occurring during construction of an article would go undetected. In addition, wiping of the jets may unfortunately serve to introduce foreign matter into the relatively small jet orifices, thereby plugging the orifices.
U.S. Pat. No. 5,303,141 to Batchelder et al. entitled "Model Generation System Having Closed-Loop Extrusion Nozzle Positioning" discloses an apparatus including an extrusion head for extruding a bead of material, such as a hot melt adhesive. A feedback sensor is provided to permit the extruder to adjust to a number of different mechanisms. For example, when the extruded bead is applied around a convex or concave contour the bead, while it is still hot enough to be pliable, the bead tends to distort to minimize its length. Also, and dependent on the distance from the nozzle to the underlying material, the extruded bead may change its deposited cross-section as a function of this distance. Also, back pressure from already deposited material that is near the nozzle may reduce the flow rate out of the nozzle, and changes in temperature or composition of the material to be extruded may change the rate at which the material flows out of the nozzle and, as a result, the rate at which the material solidifies to its final dimension. The patent discloses that the feedback provided by the sensor is important to permit the extruder to adjust to a number of different mechanisms which may operate to cause only the extruded material to have dimensions other than those intended. However, many other factors may affect accuracy, and the speed of construction of the intended article. In addition, the patent discloses that the deposition feedback sensor functions to provide information regarding only the most recently extruded material. Accordingly, errors which occur subsequently in the article may go undetected.

Apparatus and method including deviation sensing and recovery features for making three-dimensional articles


Analysis of selected aspects of behavior of an application computer program are studied by instrumenting the program in a manner that does not affect the program behavior. A separate analysis file, called a probe instance file, is created apart from the application being instrumented. Innocuous probes are placed at selected locations in the application program to monitor progress and performance of the program. The probes can be implemented by placing markup specifications in a separate part of the file and checking the markup specifications after execution of each instruction in the application program to see whether a probe location is encountered. If so, execution is halted temporarily, and an instance of the corresponding probe code is appended to the probe instance file. Preferably, the probe bodies, i.e. the probe instance file, is subsequently executed as a separate thread. The application therefore runs at full speed. The probe bodies can be simple C statements or any other set of instructions.

Programming tools are important for analyzing the performance of computer programs. A variety of program analysis tools are known. Examples include call graph based profiling tools, instruction profiling tools, system call summary tools, dynamic instruction counters, cache memory modeling, input/output summary tools, load and store counters, etc. These tools help computer architects, for example, evaluate how well programs perform on new hardware platforms. Software authors use such tools to analyze their programs and identify critical pieces of code. Compiler writers often use such tools to find out how well their instruction scheduling or branch prediction algorithms perform.
Designing and building such tools or "instruments" can be challenging. In prior art, the instrumentation code itself necessarily affects operation of the computer and therefore sometimes provides inaccurate results. For example, one system known in the prior art for building customized program analysis tools is described in U.S. Pat. No. 5,539,907 to Srivastava. That system provides a single framework for building a wide range of customized program analysis tools. It provides a common infrastructure present in all code-instrument tools, and thus allows the tool designer to operate at a higher level. Essentially, that system allows a procedure call to be inserted before or after any program, procedure, basic block, or instruction. It separates the tool-specific part from the common infrastructure needed in all tools. It provides the infrastructure for object-code manipulation and a high-level view of the program in object-module form. The user defines the tool-specific part in "instrumentation routines" and specifies the points in the application program to be instrumented, the procedure calls to be made, and the arguments to be passed.
The Srivastava system creates a single, modified executable file such that the application program and the user's analysis routines run together in the same address space. See FIG. 1. Information is directly passed from the application program to the analysis routines, through simple procedure calls instead of inter-process communication. The system takes care that analysis routines do not interfere with the program's execution, but because it operates on the same CPU in the same address space, it necessarily affects the system performance. Moreover, that type of system will pollute the machine's resources, such as the instruction cache. Consequently, any behavior of the instruction cache will not be analyzable precisely. Additionally, since the instrumentation segments must be executed along with the application, it bloats the execution time of the application tremendously. Cases of 10 to 20-fold degradation in performance are not uncommon. Finally, the application must be protected from the instrumentation probes, since the probes will certainly change the register state of the machine. Hence, each probe must be encapsulated into a protective shield code. This shield code is quite "expensive."
In view of the foregoing background, a principal object of the present invention is to provide a non-intrusive means for instrumenting an application program. A goal of the present invention is to allow for studying program behavior without affecting the program behavior. That is, an object of the present invention is to allow instrumenting an application program without making any modification to the application program code, or modifying the code in a way that is transparent during execution.
Another object of the present invention is to provide for flexibility and customizing program instruments, by allowing a user to write custom "probes" as needed. A further object of the present invention is to provide for instrumenting the execution of an application program without affecting the machine's resources so that the program analysis is completely accurate.
A final object of the invention is to speed up execution of the analysis itself.

Transparent instrumentation for computer program behavior analysis


An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Advances continue to be made in the manufacture of solid-state electronic devices, resulting in increasing functionality, density and performance of the integrated circuits. The amount of heat generated, and accordingly the amount of power needed to be dissipated, by modern integrated circuits generally increases with increases in the density and speed of the circuits. Removal of heat produced by the integrated circuits therefore continues to be of significant concern of modern integrated circuit package and system designers, considering the loss of performance and the degradation in reliability of integrated circuits when operated at elevated temperatures.
In addition, the trend toward more compact electronic systems is also continuing, exacerbating the thermal problem produced by the high-complexity and high-performance integrated circuits. For example, laptop or notebook sized computers have recently become quite popular, with continuing market pressure toward even smaller computer systems such as personal digital assistants (PDA). However, these small systems eliminate many of the traditional techniques for heat removal available for large-scale computer systems, such as the use of fans for convection cooling of the integrated circuits. As such, many modern systems utilize thermal conduction as the primary mode of heat removal from the integrated circuits in the system.
Integrated circuit packages of the ball-grid-array (BGA) type have recently become popular in the field. Conventional BGA packages are similar in layout and arrangement to the pin-grid-array (PGA) packages, in providing a rectangular or square array of connections on the underside of the integrated circuit package. Instead of the pin connectors used in PGA packages, however, BGA packages utilize a solder ball located at each connector location. As is known in the art, the BGA package is attached to a printed circuit board by reflowing the solder balls to make connection to conductors at the surface of the printed circuit board. The BGA package provides the important advantage of being self-aligning, as the surface tension of the solder will tend to pull the BGA package into proper alignment with the corresponding conductors on the printed circuit board.
By way of further background, BGA integrated circuit packages of various types are known, including those of both the "cavity-up" and the "cavity-down" type. Conventional cavity-up BGA packages mount the integrated circuit chip with the circuitry facing up into a cavity (or onto the surface) of the package substrate, attach wire bonds between the package and the chip on its top side, and then either transfer mold or otherwise dispense a plastic over the chip and bond wires to provide environmental protection to the chip and wires. The solder balls are provided on the side of the substrate opposite the chip, and the packaged chip is then mounted to the system printed circuit board. It is known to use plated vias through the substrate at locations underlying the chip, but that are offset from conductors on the printed circuit board to which the packaged chip is mounted, to provide thermal conduction from the chip to its external environment.
Conventional cavity-down integrated circuit packages mount the integrated circuit chip into the cavity of, or onto the surface of, the package substrate, followed by attachment of bond wires thereto and molding or otherwise dispense a plastic around the chip. In this type of package, the solder balls are provided on the same side of the substrate as the chip, so that the chip is disposed up-side down or with the circuitry of the integrated circuit facing down after attachment of the packaged chip to the circuit board. It is known to mount the chip to a thermally conductive slug disposed within the substrate of a cavity-down package, with the slug exposed on its opposite side from the chip after mounting. A heat sink may be mounted to the exposed upper surface of the slug, so that the heat sink extends upwardly and facilitates convection cooling. This arrangement is not particularly well suited for modern small computing systems, such as laptop, notebook-sized, or hand-held computers, as these systems are not able to house a fan, and indeed are designed to have little or no flow of air within the housing ("zero-air-flow"), relying instead on conduction and natural convection heat transfer.
It is therefore an object of the present invention to provide an integrated circuit package having improved thermal conduction from the packaged chip to the system circuit board upon which it is mounted.
It is a further object of the present invention to provide such a package which is arranged in the cavity-up orientation.
It is a further object of the present invention to provide such a package that is of the ball-grid-array (BGA) type.
It is a further object of the present invention to provide such a package that reduces the need for convection cooling.
Other objects and advantages of the present invention will be apparent to those of ordinary skill in the art having reference to the following specification together with its drawings.

Ball grid array integrated circuit package with high thermal conductivity