A query processing system of a database using multi-operation processing includes a task retrieval unit for retrieving relational algebra as tasks from a query tree, a unit for dividing retrieved tasks into groups for each relation of database, a synthetic relational operation unit for creating a synthetic relational operation by collecting tasks having common sub-expression for the grouped tasks into sub-groups and creating a task of a synthetic relational operation for each sub-group, wherein when there is a plurality of tasks of join operation in the grouped tasks, the synthetic relational operation unit further divides the grouped tasks into sub-groups for each common sub-expression of join operation, collects a plurality of tasks of the join operation into a sub-group, and creates a single task of a synthetic join operation by using logical union to concatenate each task of the join operation collected in the sub-group.

When a large number of queries are sent to a database management system (DBMS) simultaneously, a database management system uses a concurrency control to process each query. The search only transactions are called queries and each query is processed separately. Therefore query processing in a conventional database management system has the following problems for processing a large number of queries.
Problem (1):
For processing queries, data of a database is accessed, and when a large number of queries perform operations on a common relation of the database, same data is accessed from disk and loaded into main memory to be processed repeatedly. Therefore it is not efficient, and the query processing speed decreases.
Problem (2):
In query processing of a conventional database management system, when a task (operation) in a query is processed, a processing result of the task is created on disk every time as an intermediate result of the query. However since the processing result of each task has overlapped selections of records and attributes, many processing results having overlapped selections are created on disk. As a result, the number of disk access increases and the query processing speed decrease.
Problem (3):
For processing join operations in a query, the query processing of a conventional database management system uses the join method such as hash join to process each join operation.
However every time the join operation is processed, records in a relation used for retrievals of the join operation are accessed from disk, and a hash table which is used as an index to each record in the relation is created in main memory. Since each join operation uses a different relation for its retrievals, a separate hash table is created for each join operation. Therefore if many hash tables are created in main memory, there is not enough main memory space to process many queries, so the query processing speed decreases.
(Problems of Cashing Operations and Operation Results)
In order to reduce the number of disk accesses and to improve the query processing speed, the method of temporary storing (caching) frequently requested queries and query processing results, and operations in a query (relational algebra such as select operation, project operation, and join operation) and operation results (intermediate result of query) on disk is used.
When a query is requested from a user, a database management system checks whether a processing result of the query is already stored on disk. If it is stored, the stored query processing result is returned to the user as it is, instead of processing the query.
Also, even if the query is different, an operation in the query is same as the one already stored on disk, then the stored result of the operation is used to process the query instead of processing the operation.
The purpose of this method is to improve the query processing speed by increasing the number of query processing results and operations results to be stored, so that same queries and same operations are not processed repeatedly. However, this method requires that the queries and the operations must be same as the ones stored on disk, and it cannot utilize the stored results if the queries and the operations are different from the ones stored on disk.
Also in this method, if new records are added into the database and the database is updated, some stored processing results become old, so the database management system must dispose the processing results that became old. Therefore if database updates are performed frequently, the stored processing results that become old must be disposed every time, so that this method becomes no longer effective.
A database management system such as Microsoft SQL server does not immediately dispose the query processing results that become old in order to maintain the query processing speed; instead it returns old processing results to users for a while.
(Problems of Caching to Main Memory)
Another method for reducing the number of disk accesses and improving the query processing speed is the method of caching frequently accessed blocks from disk in main memory. In this method, when a query is requested from a user, it checks to see if the blocks to be accessed from disk for processing the query are already cached in main memory. If they are cached, the cached blocks are used.
The purpose of this method is to reduce the number of disk accesses and to improve the query processing speed by increasing the number of blocks to be cached in main memory.
However, this method requires that the block on disk and the cached block in main memory need be synchronized, so when a content of the block is changed, both the block on disk and the cached block in main memory need to be updated.
Also, when a linear search is performed for a relation of database having gigabytes of data to process a query, almost all blocks, except the blocks that are cached in main memory, need to be accessed from disk, so this method is no longer effective.
Also an operating system itself performs such memory management; so if a database management system increases the amount of blocks to be cached in main memory, the blocks that are cached in main memory are transferred to virtual memory (disk) by the operation system, so the query processing speed decreases.
(Problems of Pipelining Queries)
The method of pipelining queries is used as a method of reducing the number of disk accesses and improving the query processing speed by not creating intermediate results of queries on disk.
This method pipelines the operations in a query by using multiple microprocessors to process these operations in parallel on a computer system with multiple microprocessors.
In this method, the processing result of each operation in the query is streamed to the next operation in the query, so that the next operation does not wait for the previous operation to complete, and performs its operation on the partially finished result.
However, the operations that can be pipelined are limited to operations such as a select operation and a project operation, and cannot pipeline a join operation, because the join operation requires its previous operations to complete before processing.
This method also requires that the computer system have multiple microprocessors, so the computer system with a single processor is not effective.
(Problem of Multiple-Query Optimizations)
Multiple-query optimization is another method of processing queries which is different from a conventional method of processing queries where each query is processed separately. This method combines multiple queries to create a single query graph (for obtaining multiple query processing results, a query graph is used instead of a query tree), and executes the query graph to process multiple queries simultaneously. In order to do this, if multiple queries have same operations, a query graph is created to replace these same operations by a single operation, and the processing result of the single operation is shared.
Also, even if multiple queries have different operations, if one operation is a subset of another operation, a query graph is created to perform one operation on the processing result of another operation. The purpose of this method is to reduce the number of disk accesses and improve the query processing speed by utilizing processing results of the other operations.
However, if one operation is processed on the processing result of another operation, the indices of the relation in the database are not utilized, and records are searched linearly from the processing result of another operation. Therefore it rather increases the number of disk accesses and decreases the query processing speed.
Also there is a problem that when a number of queries increase, many different query graphs are created, and it takes time to find the best query graph with the lowest processing cost from these query graphs that are created.
In addition, Multiple-query optimizations does not immediately process a query requested from a user. Instead, queries which were given for a certain period of time are processed simultaneously. Therefore it cannot respond to each query quickly.

Query processing system of a database using multi-operation processing utilizing a synthetic relational operation in consideration of improvement in a processing capability of a join operation


To provide electrical conduction between front and back surfaces of a thin film multi-layered circuit board, such as an MCM, at low cost without using a simultaneous firing process for ceramic. The thin film multi-layered circuit board has at least one thin film circuit layer on a first surface of a substrate, wherein a conductor layer is disposed in the lowermost layer of the thin film circuit layer in contact with the first surface of the substrate, and is characterized in that holes for providing the electrical conduction between front and back surfaces of the substrate are formed through the substrate from the first surface to a second surface thereof so that the conductor layer is exposed in the hole, wherein the diameter of the hole is gradually enlarged from the first surface to the second surface.

1. Field of the Invention
The present invention relates to a structure of a high density multi-layered thin film circuit board for mounting electronic elements thereon, such as large scale integrated circuits (LSI) or input/output pins, particularly to a structure for obtaining an electrical conduction between front and back surfaces of such a multi-layered thin film circuit board.
2. Description of the Related Art
Recently, a thin film circuit board capable of providing high density circuits, a so-called MCM (multi-chip module) substrate, and applicable to an electronic equipment such as a computer, has been put into practical use. In the circuit board, the formation of an extremely thin dielectric layer of polyimide has become possible by means of a spin coating method.
In this case, since signal patterns are also formable by a sputtering method and an etching method using a high-density resist, it is possible to realize high density patterns more dense than those of an ordinary printed circuit board.
In the prior art, an MCM called an MCM-D/C (D is an abridgment of xe2x80x9cdepositxe2x80x9d and C is that of xe2x80x9cco-firingxe2x80x9d) has been developed, and put into practice, wherein thin film circuits are formed in a multi-layered manner on a ceramic substrate and thick film circuits are formed in the interior thereof. This is because it enables a number of terminals to be mounted thereon and a wire length necessary therefor to be shortened by mounting functional elements such as an LSI or the like on one surface and input/output terminals on the other surface, resulting in a significant advantage in the performance thereof.
In this regard, as a prior art, Japanese Unexamined Patent Publication No. 9-18144 discloses a multi-layered circuit board of glass ceramic wherein connector electrodes, capable of carrying input/output terminals on a glass ceramic member with sufficient strength and reliability, are provided on a back surface of the glass ceramic multi-layered circuit board. This circuit board has conductors of copper or copper alloy at least in the interior thereof used as connector terminals for arranging input/output terminals on the back surface and thick film pads of copper or copper alloy embedded in a back surface and connected to the conductors.
The thick film ceramic substrate formed by the co-firing method, however, has drawbacks of high production cost, which is particularly true of that having no signal circuits in the respective layer but only having vias bored between front and back surfaces thereof. Accordingly, a substrate is required which has a structure low in production cost and capable of achieving a desired function.
Accordingly, an object of the present invention is to provide a high density thin film circuit board and a process for producing the same, which board is capable of providing electrical conduction between front and back surfaces of the multi-layered thin film circuit board such as an MCM or the like at a low cost.
To achieve the above-mentioned object, according to the present invention, a high density thin film circuit board is provided, having at least one thin film circuit layer on a first surface of a substrate, wherein a conductor layer is disposed in the lowermost layer of the thin film circuit layer in contact with the first surface of the substrate, characterized in that holes for providing electrical conduction between front and back surfaces of the substrate are formed through the substrate from the first surface to a second surface thereof so that the conductor layer is exposed in the hole, wherein the diameter of the hole is gradually enlarged from the first surface to the second surface.
Advantageously, a solder bump to be in contact with the conductor layer is formed in the interior of the hole. In this case, the inner surface of the hole is preferably provided with an Ni-plated layer for preventing the solder from diffusing and an Au-plated layer for improving the wettability to solder.
Favorably, a metallic input/output pad is formed on the inner surface of the hole. In this case, a solder bump is preferably formed on the input/output pad. Also, an input/output pin is favorably mounted onto the input/output pad.
Advantageously, etchable glass, metal or Si wafer is used as the substrate.
Further, according to the present invention, a process for producing a high density thin film circuit board is provided, having at least one thin film circuit layer on a first surface of a substrate, wherein a conductor layer is disposed in the lowermost layer of the thin film circuit layer in contact with the first surface of the substrate, characterized in that the process comprises the steps of: forming the at least one thin film circuit layer on the first surface of the substrate, and etching the substrate from a second surface thereof to form a hole so that the conductor layer is exposed in the hole.
Preferably, the process further comprises a step for forming a solder bump by adhering solder to a metallic surface of the conductor layer exposed in the bottom of the hole and heating the solder until it is melted. In this case, the solder may be supplied to the interior of the hole by a printing, or the solder may be supplied to the interior of the hole as a solder ball.
Preferably, prior to supplying the solder, Ni/Au-plated layers may be formed on the inner surface of the hole for the purpose of an improvement in wettability to solder.
Or, the process may comprise a step of forming a metallic input/output pad on the inner surface of the hole. In this case, the process may further comprise a step for mounting an input/output pin onto the input/output pad.
Favorably, prior to forming the hole by etching, a guide hole is formed in advance, by the use of a laser beam, and is thereafter enlarged by the etching operation to complete the hole.
As described above, according to the present invention, an MCM can be provided which is capable of mounting electronic elements on opposite surfaces of a substrate without using a ceramic substrate having vias for conducting front and back surfaces thereof as in the prior art and which allows more inexpensive materials to be employed for this purpose.

High density thin film circuit board and method of production thereof


There are determined by measurements: the maximum -A of the positional displacement, which is caused by a deflection when a machining point is moved in a +X direction; and a movement command D in effect until the machining point is reversed to a -X direction while the maximum deflection -A is maintained and the deflection A in the reverse direction is produced. It is assumed that the deflection proportionally changes from -A to +A while the movement command is outputted by D, that is, while the actual position of the machining point is moved by (D-2A). The correction amount is determined on the bases of the proportion of two times the deflection A with respect to (D-2A) and the movement command value after the reversal of the moving direction, and is added to the movement command value so that the resultant sum is outputted as the movement command value.

When a delay of action occurs by the deflection of a machine, between the drive point and the machining point of a driven member to which the force from a drive source is applied, there arises a problem that an inconsistency or action occurs between the machining point, as commanded by a control system, and the actual machining point. This positional displacement due to the deflection is conspicuous in an industrial machine having a distance between the drive point and the machining point, such as a wire electric discharge machine.
Therefore, a representative example of the electric wire electric discharge machine is schematically shown in FIG. 1. The components of this wire electric discharge machine not described with reference numerals are omitted from FIG. 1.
A column 2, fixed on the bed 1 of the wire electric discharge machine, has UV axes and Z axis 3 fixed on its upper end and an arm for supporting a lower wire guide fixed on its intermediate portion. The arm extends through an arm cover 4 which is fixed on the column 2. On the bed 1, there is mounted a cross table 5, which can be moved in the directions of X- and Y-axes. On the cross table 5, there are mounted a work carriage and a machining bath 6 for dipping the workpiece. Between the upper wire guide, disposed at the leading end of the Z-axis, and the lower wire guide, disposed at the leading end of the arm, there is a wire electrode 7 extended for performing the electric discharge machining.
The arm, integrally fixed to the column 2, is extended passing through the arm cover 4 into the machining bath 6, and the workpiece, fixed on the workpiece carriage mounted on the machining bath 6 and the cross table 5, is movable relative to the arm, so that it is necessary to ensure that the machining liquid can be prevented from leaking at the joint between the arm and the machining bath 6 during the aforementioned relative movements.
The cross table 5, the machining bath 6 and the workpiece are moved in the X-Y plane by driving and controlling an X-axis driving servo motor Mx and a Y-axis driving servo motor My through servo control circuits 12 and 13 of a control system 11.
The wire electric discharge machine body is provided with a jet nozzle at the leading end of the Z-axis, a machining liquid circulator for supplying the machining liquid to the machining bath 6, various motors for feeding the wire, and a discharge machining power source for applying the machining voltage to the wire electrode 7. These equipments are individually driven and controlled by the control system 11 through a machining liquid control circuit 14, a wire control circuit 15 and a discharge control circuit 16.
The control system 11 is provided with a CPU 19 for the CNC to drive and control the individual axes of the discharge machining apparatus on the basis of the system program, as stored in a ROM 17, and a machining program, as stored in a RAM 18. The CNC CPU 19 is connected with the aforementioned servo control circuits 12 and 13 through a bus 20. The CNC CPU 19 outputs distributed pulses to the servo control circuits 12 and 13 for the individual axes to drive the servo motors of individual axes, move the cross table 5, and establish the discharge for the machining between the face of the workpiece, as carried on the workpiece carriage of the machining bath 6, and the wire electrode 7.
A CPU 21 for the PMC drives and controls the discharge control circuit 16, the wire control circuit 15 and the machining liquid control circuit 14 in accordance with the system program, stored in the ROM 17, and the power supply conditions and the machining conditions stored in the RAM 18.
The CNC CPU 19 is connected through a display control circuit 22 to a manual data input unit 23 with a display, so that the machining program and the power supply and machining conditions can be manually inputted. Furthermore, the machining route and the setting conditions can be monitored in the display screen of the manual data input unit 23.
With reference to the schematic diagram of FIG. 2, here will be described the detail of the joint portion between the arm cover 4 and the machining bath 6 in the electric wire electric discharge machine of FIG. 1. Incidentally, the components of the joint portion not denoted with reference numerals are omitted from FIG. 2.
On the back of the machining bath 6, there is mounted a seal plate 9, which is provided with a flange 8 for fixing the arm cover 4. This seal plate 9 is fitted to the back of the machining bath 6 by being pressed thereto with a number of bearings 10 so as to stop the hole, which is formed in the back of the machining bath 6 and extends in the X direction. A seal base is mounted on the outer circumference of the hole to prevent the leakage of the machining liquid from around the seal plate 9. On the inner circumference of the flange 8, there is fitted a V-packing for preventing the leakage of the machining liquid from around the arm extending therethrough.
As a result, when the cross table 5 is driven to move the machining bath 6 and the workpiece, especially when the machining bath 6 is moved in the X-axis direction, the seal plate 9, pressed to be fitted against the machining bath 6, will be dragged to move together with the machining bath 6 by the sliding resistance acting therebetween. Thus, a bending moment in the X-axis direction occurs to cause a deflection in the transmission mechanism, comprising the cross table 5 and the ball screws/nuts for driving the cross table 5, and in the joint between the transmission mechanism and the cross table 5 (hereinafter referred to together as the "workpiece drive unit"), so that the actual machining point delays from the commanded machining point. In this case,. the machining point is a position where the workpiece and the wire electrode 7 confront each other.
It is assumed, for example, that no external force in the X-axis direction is exerted upon the workpiece drive unit when the machining point commanded by the control system is located at (x, y)=(x1, y1), and that a command is given to move the wire electrode 7 from this state to the position (X, Y)=(x1+a, y1) (a>0) (although the actual movement is made by the cross table 5).
In such a case, the aforementioned deflection occurs in the workpiece drive unit, causing the workpiece on the workpiece carriage of the cross table 5 to make a delayed movement. If the positional displacement due to this deflection is given as Ca' (Ca'>0), the actual machining point is located at (x, y)=(x1+a-Ca', y1) so that the delay of Ca' occurs from the commanded machining point (x, y)=(x1+a, y1). The maximum A of this delay Ca' is dependent on the magnitude of the sliding resistance between the machining bath 6 and the seal plate 9 and by the rigidity and span of the individual members of the workpiece drive unit, and will not exceed the delay Ca' no matter how far the machining point is moved.
In other words, while the force to be applied in the +X direction from the machining bath 6 to the seal plate 9 is lower than the sliding resistance between the seal plate 9 and the machining bath 9, the seal plate 9 moves together with the machining oath 6 to increase the deflection Ca' of the workpiece drive unit in the -X direction. However, when the deflection of the workpiece drive unit increases until the reaction in the +X direction exceeds the sliding resistance between the seal plate 9 and the machining bath 6, a slip occurs between the seal plate 9 and the machining bath 6 to allow only the machining bath 6 to move. In short, the value of the deflection Ca' corresponding to the reaction, as acting in the +X direction when the slip occurs, takes the maximum value A.
As the correction method for correcting the positional displacement of a machine, there is known the pitch error correction for correcting the positional displacement caused by the pitch error of the feed screw, or the backlash correction for correcting the play of the power transmission mechanism occurring at the time of reversed movement of a driven member. However, neither of these methods can be applied to the correction of the positional displacement which is caused by the deflection.
More particularly, the pitch error correction determines the correction amount univocally according to the present position (i.e., the present position of the driven member with respect to the feed screw) of the driven member such as the cross table 5 in the mechanical coordinate system, so that it cannot cope with the mechanical deflection varying according to the moving distance after the reversal when the movement of the driven member is reversed at an indefinite position. On the other hand, the backlash correction for outputting, when reversing the movement of the driven member, the amount of correction for eliminating the play to be caused at the time of the change of the rotational direction of the gears or the like cannot cope with the deflection which gradually varies with the moving distance from the position at which the movement is reversed.
In short, there has never been proposed the correction method for eliminating the positional displacement caused by the deflection of the machine.

Method of correcting positional displacement of machining point


Embodiments of the present invention that pertain to methods and systems for the calculation of resource requirements for a composite application are described. In one embodiment, information describing what component applications are associated with the composite application is received. Information describing metrics that are to be measured for the component applications is received. Information describing interrelationships between the component applications associated with the composite application is received. Information describing rules for calculating the resource requirements for the component applications is received. The rules are based on the interrelationships between the component applications and the metrics that are to be measured.

In today's environment, resources such as processors, memory, and firewalls, among other things, are dynamically allocated (also commonly known as "provisioned") to applications when a need for the resources arises. For example, a large application for providing Internet services may include several smaller applications, such as web server applications, intermediate server applications and one or more database managers. A user interacting with the Internet may request to see a webpage. A web server application will receive the request to display the web page, then an intermediate application server will receive the request and finally data may be obtained from the database manager in order to display the web page.
Conventional workload management software is used for determining how resources are to be dynamically allocated to applications. Since the application executing on the web server is the first application to receive the request for the web page, the conventional workload management software will detect that the demand for the web server application has increased. The conventional workload management software will allocate additional resources to the application executing on the web server in order to satisfy its increased demand for resources. In order to provide these additional resources to the web server application, resources may be taken away from other parts of the system, such as one of the intermediate server applications or the database manager.
Then the demand on the application executing on the intermediate application servers will increase. So the conventional workload management server will allocate additional resources to the application executing on the intermediate servers. The resources allocated to the intermediate server application may be taken away from other parts of the system, such as one of the web server applications or the database manager. Finally, the demand on the database manager will increase, so the conventional workload management software will allocate additional resources to the database manager. The resources allocated to the database manager may be taken away from other parts of the system, such as one of the web server applications or one of the intermediate server applications.
In the meantime, the user is waiting to see their web page and will become impatient. The user may impatiently start to click on buttons which only increases the demand on the applications (e.g., web server applications, intermediate server applications, and the database manager) and therefore increases the need for more resources and the moving of resources around. Therefore, conventional workload management software is not able to adequately allocate resources.
The drawings referred to in this description should not be understood as being drawn to scale unless specifically noted.

Method and a system that enables the calculation of resource requirements for a composite application

Hewlett-Packard Development Company, L.P.


The present disclosure relates to a mirrored serial interface (MSI) for accessing peripherals through four wire serial interface. More particularly, the present disclosure is related to serial peripheral protocol with looped back mechanism in which contents of source data line are looped back onto the destination line and compared at every clock edge to ensure data sanity and to assert presence of slave and master device during and between cycles.

The serial peripheral interface (SPI) protocol is related to the serial communication between a master device and a slave device. Slave device may in turn cater to its own independent peripherals.
SPI bus is a synchronous serial data link standard that operates in full duplex mode with a single master device and one or more slave devices. Its implementation uses four signal lines for data and control i.e. SCLK, MOSI, MISO and SS, wherein SCLK refers to serial clock (output from master); MOSI or SIMO refers to master output-slave input (output from master); MISO or SOMI refers to master input-slave output (output from slave) and SS refers to slave select (active low, output from master). The shift register of master and slave are connected in a ring formation as shown in FIG. 1.
In a conventional SPI protocol, data frame or data transfer cycle is initiated by the master by asserting the SS line low and enabling the clock for the selected slave. The shift register of master and slave are connected in a ring formation. Hence, the master is writing the data and reading from it at the same time. This process continues until all the data bits are transferred to and from master and slave. It is for the controllers of the master and slave to decide if the data is meaningful or not.
However, the conventional SPI protocol suffers from the following disadvantages:                SPI does not have an acknowledgement mechanism to confirm receipt of data. Data sanity is not ensured. Slave may receive inverted bits due to timing violations, channel noise or temperature changes.        SPI master has no knowledge of whether a slave even exists, until complete transaction is executed. Master may continue to send data without even knowing if it is being received correctly.        SPI also offers no flow control (no handshaking signals or acknowledgement) like REQ and ACK to tell whether slave has completed transacting with any slow peripheral it is serving. There is no mechanism to tell when slave is ready to transmit data during read cycle, in case of slower access at the secondary end of slave.
US 2006/0143348 relates to a system, method, and apparatus for interchip communication between an extended serial peripheral interface (EPSI) master chip having clocking capability and an EPSI slave chip. The method comprises the master chip selecting a slave chip, the master clocking data into the slave chip from the master chip and at the same time clocking data from the slave chip into the master chip, and processing the clocked in data to negotiate further data transfer between the master chip and the slave chip. Selection of a slave chip by the master chip may also take place in response to an interrupt received by the master chip from the slave chip, with the master then clocking data in both directions to negotiate further data transfer between the master chip and the slave chip. However, this prior art document does not provide any provision for error detection and physical layer and it uses two general purpose lines for flow control.
US20020133662 related to the serial peripheral interface and high performance buffering scheme. An improved high performance buffering scheme is provided with a serial peripheral interface (SPI) to enable microcontroller-based products and other components and devices to achieve a higher serial transmit and receive data rate. The SPI comprises a single buffer having a high data rate, for example, at least the throughput of double buffer schemes, but without the increased size in logic area. To facilitate the throughput of data, the SPI single buffer can be configured with a queuing arrangement. The queuing arrangement for the SPI single buffer can comprise any queuing configuration, such as, for example, a circular queuing arrangement or a linear queuing arrangement. Through operation of the queuing arrangement, the SPI can be configured to provide for the receiving of new data in a register at substantially the same time that stored data can be transmitted to another device, thus the SPI can realize a high data rate. The queuing arrangement is configured in a FIFO buffer having a pointer and counter arrangement. In addition the buffering scheme can provide a high data rate without requiring frequent CPU polling or high interrupt overhead wherein the buffering scheme is configured with an interrupt configuration for identifying when data is ready for transmitting or for reading by the CPU. However, this prior art document does not provide any provision for error detection and aims to increase data rate over the serial link.
U.S. Pat. No. 6,529,979 relates to method and apparatus for a high-speed serial communications bus protocol with positive acknowledgement. There is two-wire serial bus consisting of an address line and a data line that connects a plurality of satellites in a daisy-chain fashion to a central source where address packet is modified by clearing the stop bit of the address packet to provide a positive acknowledgment of a receipt of the address packet back to the central source of the transaction. However, this prior art document does not ensure data sanity and does not provide provision for data flow control and physical layer.
U.S. Pat. No. 5,260,933 provides acknowledgement protocol for serial data network with out-of-order delivery. The data frames transmitted by the initiator node to the recipient node include frame serial number or sequence count information; Acknowledgment frames, transmitted by the recipient node to indicate delivery of the data frame or packet, include matching serial number or sequence count information; acknowledgement is received for each data frame transmission. However, this prior art document does not ensure data sanity and does not provide provision for error detection and it uses two general purpose lines for flow control.

Method and a mirrored serial interface (MSI) for transferring data

CENTRE FOR DEVELOPMENT OF TELEMATICS (C-DOT)


A fine ratio measuring device that measures a ratio of fines adhering to the surface of a material in the form of lumps, the fine ratio measuring device includes: an illumination unit that illuminates the material in the form of lumps; a spectrometer that performs spectral analysis on light reflected from the material in the form of lumps to measure spectral reflectance; and an arithmetic device that extracts at least one feature quantity from the spectral reflectance measured by the spectrometer and computes the fine ratio from the extracted at least one feature quantity.

In production facilities such as blast furnaces that use raw materials such as minerals, the particle sizes of the raw materials affect the operations of production processes. Therefore, to stabilize the production processes, it is necessary to obtain the information about the particle sizes of the raw materials in advance. In a production process in a blast furnace, it is important to know the particle sizes of raw materials such as, in particular, coke, iron ore, and sintered ore, and it is also necessary to operate the blast furnace with attention to the ratios of fine-grained fines adhering to the raw materials to be charged into the blast furnace to ensure gas permeability in the furnace. The fine ratio is the ratio of the mass of fines to the total mass of the charged materials.
To maintain gas permeability in the blast furnace, it is important to provide spaces formed between lumps of the raw materials. When the raw materials contain a large amount of small lumps and fines, the spaces formed between the lumps of the raw materials are filled with the small lumps and fines, and the gas permeability deteriorates. Therefore, the raw materials to be charged are sieved in advance, and only the lumps on the sieve are charged into the blast furnace. Generally, by performing sieving before charging the raw materials into the blast furnace, the particle size of coke is often adjusted to 25 to 35 mm or more, and the particle size of iron ore or sintered ore is often adjusted to 5 to 25 mm or more. It is however difficult to completely remove the fines by a general sieving operation. In particular, fines adhering to lumps of the raw materials are charged together with the lumps into the blast furnace, and the lumps and the fines are separated in the blast furnace so that the gas permeability in the blast furnace deteriorates. Therefore, there is a need to know the amount of fines adhering to the lumps of the raw materials in advance to control the amount of fines charged into the blast furnace.
The particle sizes of raw materials charged into a blast furnace and their fine ratios are conventionally measured by periodic sampling of the raw materials and sieve analysis. However, since the sieve analysis is time consuming, it is difficult to reflect the results of the sieve analysis on the operation of the blast furnace in real time. This has led to the desire for a technique to obtain the particle size distribution of the raw materials conveyed to the blast furnace in real time. In a device disclosed in Japanese Unexamined Patent Application Publication No. 2005-134301, a raw material on a conveyor that conveys the raw material is sampled. The sample is automatically sieved using, for example, a robot, and the distribution of the particle size is measured.
Devices capable of measuring the particle size of a raw material in real time using, for example, a camera have been disclosed. Japanese Unexamined Patent Application Publication No. 2000-329683 discloses a method of detecting the particle size of a bulk raw material conveyed on a conveyor by capturing an image of the bulk raw material on the conveyor to produce image data, determining the distribution of brightness from the image data, and detecting the particle size of the bulk raw material using the maximum peak height in the brightness distribution. Japanese Unexamined Patent Application Publication No. 2015-124436 discloses a device that detects a material to be charged into a blast furnace. In that detection device, the water content of the material to be charged is detected from spectroscopic information obtained from reflected light in the near infrared range that is included in light reflected from the material to be charged into the blast furnace. The detection device detects the fine ratio in the material to be charged in real time by obtaining the relation between the water content of the material to be charged and the ratio of fines adhering to the material to be charged.
However, a problem with the device disclosed in Japanese Unexamined Patent Application Publication No. 2005-134301 is that, when the frequency of sampling is excessively high, the operation process is delayed. Since the inspection is sampling inspection, there is a problem of sampling representativeness.
In the method disclosed in Japanese Unexamined Patent Application Publication No. 2000-329683, a plurality of sets of data about the maximum peak height in a brightness distribution measured for a bulk raw material with a known particle size are prepared in advance for different particle sizes. The particle size of a bulk raw material is detected by comparing the maximum peak height in a brightness distribution computed from measured image data to the maximum peak height prepared in advance. That method does not quantitatively measure the ratio of fines. It is not stated that the ratio of fines adhering to a material in the form of lumps can be measured. Therefore, a problem with the method disclosed in Japanese Unexamined Patent Application Publication No. 2000-329683 is that the ratio of fines adhering to the surface of a material in the form of lumps cannot be measured quantitatively.
The device that detects a material to be charged that is disclosed in Japanese Unexamined Patent Application Publication No. 2015-124436 detects the water content of the material to be charged from the spectroscopic information about near infrared radiation, and the fine ratio in the material to be charged is detected from the relation between the water content of the material to be charged and the fine ratio in the material to be charged. However, the correlation between the water content of the material to be charged and the fine ratio in the material to be charged is not high, and a problem with that device is that the accuracy of the measurement of the fine ratio is low.
It could therefore be helpful to provide a fine ratio measuring device and a fine ratio measuring system that can accurately measure in real time the ratio of fines adhering to the surface of a material in the form of lumps used as a raw material for an operation process in, for example, a blast furnace and to provide a blast furnace operating method that uses the fine ratio measuring system.

Fine ratio measuring device, fine ratio measuring system, and blast furnace operating method


Methods, systems, and computer-readable media related to a technique for combining two or more aspects of predictive information for auto-completion of user input, in particular, user commands directed to an intelligent digital assistant. Specifically, predictive information based on (1) usage frequency, (2) usage recency, and (3) semantic information encapsulated in an ontology (e.g., a network of domains) implemented by the digital assistant, are integrated in a balanced and sensible way within a unified framework, such that a consistent ranking of all completion candidates across all domains may be achieved. Auto-completions are selected and presented based on the unified ranking of all completion candidates.

Auto-completion of user queries improves the efficiency and ease by which users interact with a database or a search service. Word-level auto-completion allows a user to type the first few characters of an intended input word, and select the intended input word from a list of most likely completions of the inputted characters. Phrase-level auto-completion allows a user to provide the first few characters or the first one or more words of an intended input phrase, and select the intended input phrase from a list of most likely completions of the inputted characters or word(s).
Many techniques, statistical or otherwise, have been employed to improve the accuracy (e.g., as measured by user selection) of the list of auto-completions provided to the user. However, different state of the art techniques are biased toward different aspects of predictive information, and are not conducive to being combined with other techniques. As a result, it is challenging to provide an integrated method that effectively combines multiple aspects of predictive information to generate suitable completion candidates for the user.

Unified ranking with entropy-weighted information for phrase-based semantic auto-completion


Disclosed is an image forming apparatus including a command receiving unit that receives a print command, a detector that detects a state of the operation unit, and a controller. When the detector detects that the state of the operation unit is a predetermined state subsequent to receiving the print command by the command receiving unit and prior to completion of printing based on the print command, the controller causes the printing to be terminated. When the detector detects that the state of the operation unit is not the predetermined state subsequent to receiving the print command by the command receiving unit and prior to the completion of the printing based on the print command, the controller causes the printing to be executed.

1. Field of the Invention
The present invention relates to an image forming apparatus that can detect a malfunction of an operation unit, and that can control execution of a print job.
2. Description of the Related Art
A touch panel has been used for an image forming apparatus according to related art. Due to recent popularization of a smart phone and a tablet computer, operability of a touch panel is improved. For example, text input by flick input and an operation by multi-touch are possible. A main cause of the improvement of the operability may be popularization of an operating system (OS) which is referred to as "Android (registered trademark)." An attempt is made to apply this OS to an operations panel of an image forming apparatus.
In general, robustness and stability of a new OS is improved as upgrading of the new OS is continued. When a new OS is implemented for a touch panel, it is possible that the OS is abnormally terminated (the OS abends) at an unexpected timing during operation.
When an OS is abnormally terminated, a user's operation may not be accepted. Thus, cancellation of a print job may be desirable. A technique is known which is for cancelling a print job (cf. Patent Document 1 (Japanese Unexamined Patent Publication No. 2008-207539), for example). Patent Document 1 discloses an image forming apparatus such that it starts measurement of time after a print job is cancelled by a user by pressing a print stop/restart key, and it restarts the print job at a time at which an elapsed time exceeds the set time, provided that the print stop/restart key is not pressed again.
Unfortunately, according to the image forming apparatus which is disclosed in Patent Document 1, a print job may not be cancelled unless a user performs an operation to cancel the print job. Namely, when the OS is abnormally terminated at the unexpected time, the OS is in a state where the OS is not operable, until the OS is restarted. For example, it is possible that the OS is abnormally terminated immediately after the user erroneously made a print request. When the OS is abnormally terminated, the user may not cancel or stop the printing which is accepted by the operations panel, until the OS is restarted. A problem is that a sheet of paper which is not desired by the user may be output.
In view of the above problem, an objective of the present invention is to provide an image forming apparatus that can prevent outputting of a document during a state where a user may not cancel printing by operating an operations panel.

Image forming apparatus, image forming method, and print system


In response to a command to start restrictions on a communication service of a computer, the communication service is restricted by a countermeasures apparatus which replaces the communication address of a second computer, which has been stored in a first computer, with the communication address of the countermeasures apparatus, and replaces a communication address of the first computer, which has been stored in the second computer, with the communication address of the countermeasures apparatus. Accordingly, the countermeasures apparatus acquires a packet from the first computer to the second computer and determines whether or not this acquired packet is to be transmitted to the second computer.

The present invention relates to, for example, an apparatus for restricting a communication service. More particularly, the present invention relates to an apparatus and a method for restricting a communication service between computers capable of communicating with a server and the like.
Along with development of network technologies in recent years, a number of computers serving as client terminals have been connected to a network. Accordingly, damages by computer viruses and the like and damages caused by intrusion of hackers and crackers have been increasing. Thus, security measures for the client terminals have been important.
Moreover, execution of prohibited software within a subnetwork by a client terminal can make subnetwork security vulnerable. Meanwhile, sometimes it is wished to use only a specific communication service by a specific computer. For example, for computers of an educational institution and the like, it is preferable that communication services which are not suitable from an educational standpoint can be restricted in computers for students.
In addition, for unregistered computers which are not registered in a server or a resource register (a database stored in the server), elimination of unnecessary connection of the server and the like to a network makes it possible to effectively use network resources.
As described above, for a network administrator and a service provider, it is preferable that communication services of computers connected to the subnetwork (access to the server by computers lacking security measures, use of prohibited software, and the like) can be restricted.
For a computer lacking security measures (computer requiring installation of a virus pattern file or a security patch) (hereinafter referred to as a "computer to be controlled"), it is required that the computer access the server through a LAN (local area network) in order to install the pattern file or the security patch. However, this computer to be controlled lacks security measures. Thus, it is preferable that availability of all usual communication services using the server and the LAN can be restricted from the viewpoint of prevention of virus and worm infection, and the like.
Specifically, for the computer to be controlled, it is desired that it be made possible to execute only a communication service for security measures and to restrict communication services irrelevant to the security measures, such as access to files and use of server applications.
It has been known that such restrictions on a communication service can be realized by providing a firewall (for example, Japanese Published Unexamined Patent Application No. 2003-273936). Specifically, there has been known a method for permitting or restricting a communication service by acquiring a packet between a PC (personal computer) and a server and examining contents of the packet by the firewall. Japanese Published Unexamined Patent Application No. 2003-273936 describes that a packet is filtered by the firewall in performing a communication between a terminal for control and a central server.
Nevertheless, in the method of Japanese Published Unexamined Patent Application No. 2003-273936, if all communications of a computer to be controlled are performed through the firewall, communication services of the computer to be controlled can be restricted. However, when the computer to be controlled is connected inside the subnetwork (such as LAN) in the firewall so that its communication is completed within the network without passing through the firewall, it is not possible to restrict a communication service.
Meanwhile, there has been known a method for restricting a communication service by use of network devices called a layer 3 switch and a layer 7 switch. The layer 3 switch and the layer 7 switch are, for example, switches capable of controlling a destination of a packet by recognizing an application level protocol. Thus, a specific communication service can be restricted by permitting or blocking a communication with a server by acquiring a packet from a computer to be controlled and recognizing this packet.
However, in order to restrict the communication service of the computer to be controlled by use of the layer 3 switch and the layer 7 switch, it is required to use the layer 3 switch and the layer 7 switch for all switches or hubs within a subnetwork. Specifically, all hubs, switches and the like within a subnetwork to which the computer to be controlled may be connected have to be replaced with the layer 3 switch and the layer 7 switch, which are expensive. As another switch, use of an intelligent switch is conceivable. However, this intelligent switch can only block a packet and cannot restrict a communication service.
Furthermore, it is preferable that a communication service can be restricted at an arbitrary timing by an administrator of the subnetwork. For example, even in the case of a computer to be controlled in which security measures are fully implemented once and a communication service is not restricted, when a new virus is circulated, it is preferable that the communication service can be restricted again. It is preferable that restrictions on the communication service can be removed after security measures for the new virus are fully implemented.
As described above, it has been desired that an apparatus or a method capable of restricting a communication service of a computer to be controlled which is connected within a subnetwork through no firewall be provided. In the case of the apparatus or the method, without installation of a number of intelligent switches within the subnetwork, the communication service of the computer to be controlled can be restricted at an arbitrary timing desired by an administrator.

This patent is subject to a terminal disclaimer.

International Business Machines Corporation


A detection unit and a method for detecting an implanted medical device in an MRI environment employ a telemetry transmission from the implanted medical device.

Many implantable medical devices (IMD's), for example, including pacemakers, cardioverter-defibrillators and neural stimulators, are operatively coupled to electrodes, which are joined to elongate lead wires that extend from the devices to a target site either on or within a body of a patient. The electrodes sense electrical signals from the patient, for example cardiac depolarization signals, which are used to diagnose the patient and, in many cases, may be used to guide or dictate therapy delivery. Having such an IMD may be a contraindication for MRI, due, at least in part, to the lead wires acting as antennae, which pick up radio-frequency (RF) energy transmitted during MRI; the RF energy can cause heating of the electrodes, which are coupled to the lead wires, and may introduce sensing artifact, causing erroneous cardiac event detection that can compromise therapy delivery during MRI. Thus, there is a need to detect if a patient has an IMD before allowing the patient to undergo MRI.


A multi-composition pyrotechnic material is provided for an inflatable restraint device (for example, an airbag system or pretensioner for a vehicle). The multi-composition pyrotechnic material can be a gas generant, a micro gas generant, or an igniter, for example. The multi-composition pyrotechnic material comprises a first pyrotechnic material that defines one or more void regions. A second pyrotechnic material, compositionally distinct from the first pyrotechnic material, is introduced into at least one of the void regions and forms a second region of the pyrotechnic materials. The second composition can be introduced to the void regions in the form of a slurry. Methods of forming such multi-composition pyrotechnic materials are also provided.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
Passive inflatable restraint systems are often used in a variety of applications, such as in motor vehicles. Certain types of passive inflatable restraint systems minimize occupant injuries by using a pyrotechnic gas generant to inflate an airbag cushion (gas initiators and/or inflators) or to actuate a seatbelt tensioner (micro gas generators), for example.
Improvements in gas generant performance remain desirable. Tailoring the performance of the gas generant in an inflatable device system, such as an airbag, can require a complex design of not only the gas generant, but also hardware systems that control gas flow.
Often current gas generants require dry mixing of two or three loose pyrotechnic materials or different shapes of pyrotechnics (discs or multiple-perforation grains and the like) to achieve unique output characteristics for state of the art automotive initiators and micro gas generators. Moreover, loose materials may classify or separate leading to variable burn characteristics.
It would be desirable to eliminate or reduce the need for dry mixing of multiple loose pyrotechnic materials and/or different shaped pyrotechnic materials to achieve unique and desirable output characteristics (tailored or tunable rates) for state of the art automotive initiators and micro gas generators. For example, it would be highly desirable to design an initiator or micro gas generator having a controlled onset or altered burn time, including tailoring the burn profile of the gas generant to have a sustained output with a slower or more progressive burn rate or characteristic as compared with conventional gas generant grains, thereby reducing variability, improving safety and handling, and increasing performance capabilities of pyrotechnic materials.

Methods of forming a multi-composition pyrotechnic grain


Methods are provided for the modulation of the effects of GDF-8 and BMP-11, particularly on neural and muscular disorders administration of follistatin for treating neural, muscle, disorders which are characterized by an abnormality in the levels or activity of GDF-8 or BMP-11.

Bone morphogenetic proteins (BMPs) and growth/differentiation factors (GDFs) are part of a family of proteins which have been identified as having the ability to induce the growth, formation, differentiation and maintenance of various tissues, including bone, cartilage, tendon/ligament, muscle, neural, and various organs. BMPs and GDFs are subfamilies within the TGF-.beta. superfamily.
The TGF-.beta. superfamily of proteins have been shown to bind to serine/threonine kinase receptors. Massague, Cell 69:1067-1070 (1992); Attisano et al., Cell 68:97-108 (1992); Lin et al., Cell 68:775-785 (1992); Wang, et al., Cell 67:797-805 (1991). Similarly, activin receptors have been isolated and characterized as a predicted transmembrane serine kinase. Mathews et al., Cell 65:973-982 (1991); Nakamura et al., J. Biol. Chem. 267:18924-18928 (1992). Ebner et al., Science, 260:1344-1348 (1993) describe the existence of Type I and Type II TGF-.beta. receptors, and the effects of the Type I receptor on binding of TGF-.beta. to the Type II receptor.
Follistatin is a protein which has been identified as a molecule which is able to bind to activin, another member of the TGF-.beta. superfamily, and as a possible antagonist of activin. U.S. Pat. No. 5,545,616. Accordingly, follistatin has been suggested for possible use to predict and/or prevent preterm labor and to suppress FSH secretion from the pituitary [U.S. Pat. No. 5,545,616]; to have inhibin like activity [U.S. Pat. No. 5,041,538]; and for use in rheumatoid arthritis [AU9675056, Kaneka Corp].

Use of follistatin to modulate growth and differentiation factor 8 [GDF-8] and bone morphogenic protein 11 [BMP-11]


Isolation methods for integrated circuits use plasma chemical vapor deposition of an insulating layer followed by lift-off to remove at least portions of the insulating layer. In particular, a lift-off layer is formed on an integrated circuit substrate. The lift-off layer and the integrated circuit substrate beneath the lift-off layer are etched to form a trench in the integrated circuit substrate. The trench defines a first region on one side of the trench and a second region that is narrower than the first region on the other side of the trench. Plasma chemical vapor deposition is then performed to form an insulating layer filling the trench, on the first region and on the second region, with the insulating layer on the first region being thicker than on the second region. The insulating layer is then etched to expose the lift-off layer in the second region. The lift-off layer is then lifted off from the first region. Isolation trenches so formed can have improved isolation characteristics and can be planarized with reduced dishing effects.

In fabricating integrated circuits, isolation regions are generally formed between active device regions to electrically isolate the regions from one another. One widely used isolation method is LOCal Oxidation of Silicon (LOCOS). Unfortunately, LOCOS isolation may create bird's beaks due to lateral oxidation, crystal defects in the integrated circuit substrates and/or redistribution of dopants that are ion implanted for channel stops. These and other disadvantages may make LOCOS isolation undesirable for high density integrated circuits.
Shallow Trench Isolation (STI) methods are also used to form isolation regions. In shallow trench isolation methods, an integrated circuit substrate is etched to form a trench and an insulating material is filled in the trench. Chemical-Mechanical Polishing (CMP) is then performed for form an insulation-filled trench. Since the shallow trench isolation method does not depend on a thermal oxidation process, at least some of the disadvantages of the LOCOS method can be avoided. Moreover, since narrow trenches may be formed in an integrated circuit substrate, high density integrated circuits may be formed.
Unfortunately, in shallow trench isolation methods, the insulating material is generally etched using chemical-mechanical polishing. The chemical-mechanical polishing may cause dishing in the middle of the trench, thereby recessing the trench surface. The recessed trench surface may degrade the isolation characteristics of the trench, and may also result in poor planarization of local regions.

Trench isolation methods including plasma chemical vapor deposition and lift off


A device to guide, shape, contain, or concentrate magnetic flux comprises a tube or conduit made of superconducting material to constrain the path of magnetic flux and guide it to a target volume. Below the transition point the material exhibits no resistance to electrical current flow and is impermeable to magnetic flux. In one embodiment, the superconducting material is configured into a cylindrical tube. Upon entrance into the tube the magnetic flux generated by a magnet is constrained to remain between the walls of the tube until it exits the open end where the flux passes through a target volume. In another embodiment, the magnet is situated between two hollow U-shaped arms of superconducting material. The target is situated between the opposite arms of the superconducting material. Magnetic flux generated by the magnet is confined within the U-shaped arms of the superconducting material and passes through the target volume.

The present invention relates generally to an air-core magnetic flux guide.
In free space, flux lines from a magnet (either permanent magnet or electromagnet) diverge after leaving a pole, as shown in FIG. 1. The magnet must therefore be located close to a target volume (a volume of space through which passage of the magnetic flux is desired) if significant flux is to pass through this volume.
It may be desirable to locate the magnet away from the target volume. Currently, a solid rod of ferromagnetic (high permeability) material may be used to guide flux to a target volume remote from the magnet, as in FIG. 2a. Another configuration is shown in FIG. 2b. The high permeability of the ferromagnetic material compared to free space provides a low reluctance path for the magnetic flux. The flux therefore tends to follow this path, in order to bring the system to the lowest energy state. A percentage of flux will take a free space path as leakage flux. There will also be fringing flux at sharp edges and other discontinuities.
Flux may also be concentrated by using a high permeability material. FIG. 2c illustrates this concept to demonstrate the principles involved. In accordance with Ampere's Law, the flux into a node must be equal to the flux out of that node. A reduction in cross-sectional area of a ferromagnetic medium will cause a proportional increase in magnetic flux density, at low flux density levels. This a commonly practiced technique for designing magnetic pole faces and will work until saturation of the ferromagnetic material is approached (typically around two Tesla).
One disadvantage of using ferromagnetic material in these applications is the large mass of the ferromagnetic flux guide. A further disadvantage is the leakage flux, which can cause interference with other devices and instruments near the magnet and flux guides, and reduces the amount of flux passing through the target volume. A third disadvantage is the fringing effect at the ends of the flux guide, which can interfere with the uniformity of the magnetic field through the target volume. A fourth disadvantage occurs as the magnetic flux density approaches the saturation density of the ferromagnetic material. For iron, this is about two Tesla. As saturation is approached, the material's permeability decreases to the point that it is not much higher than the free space surrounding the material. Consequently, much of the flux is not constrained by the material, and seeks a free-space path as leakage flux.
The following U.S. Patents are of interest.
U.S. Pat. No. 3,317,286--Sorbo PA1 U.S. Pat. No. 3,331,041--Bogner PA1 U.S. Pat. No. 3,378,691--Swartz PA1 U.S. Pat. No. 4,409,579--Clem
In particular, the Sorbo patent teaches a method of making superconductive material. The patent to Bogner teaches a superconductive device for shielding magnetic fields comprising a structure of hard superconductive material and sheet members of good heat conducting metal. The patent to Swartz teaches a method of shielding a low magnetic field from a high magnetic field by providing a plurality of concentric superconductor material around the low magnetic field. The patent to Clem teaches a device which includes a solenoid substantially extensive with and overlying the superconducting cylinder.

The United States of America as represented by the Secretary of the Air Force


An electrical connection box having an L-shaped rib on the inside wall of its lower cover to engage a fitting projection located on the bottom face of an electrical unit housed within the box. The connection between the side wall of the lower cover and the electrical unit reinforces the area adjacent the notch through which the wires pass and securely maintains the electric unit inside the box.

The present Invention relates to an electrical junction box for use in a motor vehicle and, more particularly, to reinforcing the area around the opening in the outer box, through which the wires pass while stabilizing the electrical unit contained therein.
Electrical junction boxes used in automobiles employ an outer box in which an electrical unit is housed. Typically, these electrical junction boxes are found in the engine compartment of a motor vehicle. The primary purpose of the outer box is to protect the electrical connection or electrical unit from dust and water. Conventionally, the outer box comprises an upper cover and a lower cover which fit around and house the electrical unit. Typically, the upper and lower covers of the outer box are made by molding resins or plastic. The outer box is often referred to as an auxiliary box while examples of electrical units, housed in the auxiliary box, include junction blocks, relay blocks, and fuse blocks.
In order to connect the electrical unit to the other electrical/mechanical parts of the vehicle, openings are generally molded into the lower cover of the outer box. These openings allow wires to pass into and out of the box.
FIGS. 1 and 2 illustrate a conventional electrical junction box arrangement used in a vehicle. Lower cover 1 has notch 1a disposed in its side wall. Typically, notch 1a is formed during the molding process and starts near the bottom surface of lower cover 1 and extends the complete length of the side wall as shown. Ledge 1b is disposed horizontally on the inner wall of lower cover 1 and typically extends around the complete inner perimeter surface thereof.
In order to assemble the electrical junction box, electrical unit 2, depicted as a relay block, is lowered into lower cover 1 through opening 1c until the bottom surface of electrical unit 2 rests on ledge 1b, as shown in FIG. 2. Wires are connected to electrical unit 2 and aligned with notch 1a; upper cover 3 is then placed on lower cover 1 and electrical unit 2 to complete the assembly.
A problem exists with the prior art arrangement in that, when notch 1a is large, the area around notch 1a in the side wall of lower cover 1 is weak. This is especially true if lower cover 1 has a plurality of notches. The overall strength of lower cover 1 may be insufficient to withstand the rigors of an automobile assembly plant or the life of the vehicle on the road. Decreasing the size of notch 1a is not a viable solution because it makes assembly difficult due to the number of wires that are connected to electrical unit 2.
Additionally, because electrical unit 2 merely rests on projection 1b, it is not securely held in the outer box and, vibrations due to the automobile traveling over the road, shake electrical unit 2 and can cause a weakening of the electrical connection between electrical unit 2 and the wires. The vibrations can also cause electrical unit 2 to shake inside the outer box and result in a noise which is annoying to the driver or passengers in the vehicle and result in the impression that something is wrong.
Furthermore, ledge 1b is usually positioned so that a portion of electrical unit 2 extends above the top of lower cover 1. This requires that the side wall of lower cover 1 meet the side wall of upper cover 3 in order to form a good dust proof and watertight seal.

Electrical junction box assembly with an electrical unit therein


A storage apparatus includes a processor. The processor calculates an upper limit of an input/output processing amount, which is determined based on priority levels set to a plurality of storage devices, for each storage device. The processor schedules an execution sequence of processes relating to input/output requests received from information processing apparatuses based on processing amounts relating to the input/output requests and the upper limits. The processor executes the processes relating to the input/output requests in the scheduled execution sequence. The processor is configured to determine, for each storage device, whether or not a processing amount of the storage device exceeds a processing bandwidth of the each storage device for a first predetermined time. The processor changes the upper limit for each storage device in a predetermined bandwidth accommodation unit in a case where the processing amount for each storage device is determined to exceed the processing bandwidth.

In a storage system in which a plurality of servers (hereinafter, referred to as hosts) share one storage apparatus, there are cases where input/output processes requested from the hosts contend inside the storage apparatus, and stable performance is not be maintained for each input/output process (application). Thus, there are cases where a storage apparatus has a quality of service (QoS) function for maintaining appropriate performance according to a priority level for each input/output process by performing the process with priority levels (degree of priority) being assigned to the processing requests from the hosts.
Relating to the QoS function (storage QoS) included in a storage apparatus, a technology for allocating internal resources such as a queue and the like based on a priority level designated by a host and executing a command is known. As an example, a case will be described in which, in a storage system in which two hosts A and B share one storage apparatus, host A transmits a command with a priority level being designated thereto. When the priority level is designated from host A, for example, the storage apparatus allocates internal resources that are three times those allocated to a process to which a priority level is not designated. As a result, the storage apparatus performs an input/output process requested from host A with priority over an input/output process requested from host B.
In addition, a technology for maintaining appropriate performance according to a priority level for each input/output process (application) by setting target performance or a bandwidth limit to each host or logical unit (LU) on the storage apparatus side is known.
Furthermore, a technology for responding to a change in the load status by changing a priority level set for a specific input/output process in a case where the load status of the input/output process changes is known. For example, according to such a technology, in a case where an actual input/output processing amount is continuously below the processing bandwidth of the whole storage within a predetermined time, priority levels set to LUs of which the input/output processing amount arrives at a bandwidth limit and the like are raised by one. By raising the priority levels of the LUs and the like by one, the bandwidth limits of the LUs and the like are changed to be high. Accordingly, the performance of the LU and the like is adjusted, and a change in the load status can be responded.
[Patent Document 1] Japanese Laid-open Patent Publication No. 2006-53601
[Patent Document 2] Japanese Laid-open Patent Publication No. 2009-93636
[Patent Document 3] Japanese Laid-open Patent Publication No. 2013-127758
However, according to the above-described QoS function, in a case where the performance of the storage apparatus that is requested from the host changes, the performance adjustment (flexibility of bandwidth, bandwidth accommodation) between resources (for example, LUs) inside the storage apparatus is difficult to be performed in accordance with the change in the performance according to the circumstances.
While technologies for responding to change in the load status by changing the priority level as described above are known, in a case where the performance is adjusted by changing the priority level, there are cases where a change interval of the bandwidth limit before and after the change of the priority level is extremely large. When the change interval of the bandwidth limit is large, the adjustment range according to raising/lowering the priority level is limited, and a change in the performance requested from the host is difficult to be delicately followed, and there are also cases where the processing bandwidth of the storage apparatus is degraded.

Storage apparatus, method of controlling storage apparatus, and computer-readable recording medium having stored therein storage apparatus control program


A vacuum plasma generator with an output for feeding a plasma discharge for treatment of workpieces in a vacuum chamber has a connection for the junction to AC voltage mains, a rectifier connected to a converter with a control input for the setting and/or regulation of the converter output voltage, and a controlled full bridge circuit connected to the converter output with a potential-free generator output, which transposes the converter output voltage into pulses of 1 to 500 kHz. A potential-isolating transformer is switched into the bridge for the galvanic decoupling of the generator output.

The invention relates to a vacuum plasma generator for feeding a plasma discharge for the purpose of treatment of workpieces in a vacuum chamber according to the claims, as well as a method for the production of a layer by reactive deposition out of a plasma.
Electrical feeding devices for operating gas discharges or plasma discharges for vacuum processes have already become variously known. Such electrical feeding devices are also known as generators in the technical world. It is important here to be able to exercise good control over the operating conditions, since the nature of the plasma discharge and the plasma process tied thereto make special demands. Apart from the voltage input, the current and the discharge power, the behavior during flash-overs in the plasma, also denoted as arcs, as well as possible shortcircuits must be especially well controlled. Such arc discharges, or arcs, occur repeatedly during the operation of plasma discharges and require special measures. In particular when coating with the aid of a sputtering process, also denoted as sputtering, such flash-overs occur and can negatively affect the quality of the product or even make coating impossible. Such problems occur especially severely if poorly conducting layers or even dielectric layers are to be generated. To deposit such layers, for example by means of magnetron sputtering, the so-called reactive sputtering is preferably employed. Herein, for example, the target of a magnetron source is supplied with negative DC voltage to attain a so-called DC plasma, which is maintained for example with a carrier gas such as argon, and the ionized argon particles sputter the target with the aid of an impact process. The sputter target is here developed metallically, thus is a conductive material, and during the sputtering is brought to reaction with additive reactive gas, for example oxygen, whereby subsequently an oxidic layer can be deposited. Due to the covering of the surrounding surfaces, but also of the target itself, with the oxidic layer, arc problems are herein encountered. The nonconducting coated surfaces become charged during the DC sputtering process and the undesirable arc discharges are generated.
Until now attempts at alleviating the problem have included, for example, detecting such arcs and subsequently briefly switching off the generator in order to run up the plasma again. Another known solution comprises carrying out high-frequency discharges in the MHz range or medium frequency discharges in the kHz range or superimpositions of such AC voltages with respect to a DC basic discharge. A further known possibility includes feeding the plasma during reactive sputtering processes with the aid of a DC pulsed generator. The AC voltage component contained in the pulse feeding, also referred to as AC component, and/or the pulse interspaces make possible the periodic discharge of the undesired charging in the vacuum space. Since the dielectric, respectively nonconducting, layers in these reactive processes are relatively thin, for example in the micrometer range or less, relatively low frequencies in the kilohertz range are sufficient for this purpose. Such DC-pulsed configurations are denoted as unipolar pulse configurations. In order to further advance the discharge process on these dielectric layers, it is helpful if the electrode during the interspace time is not only switched free of the feeding but rather is shortcircuited relative to the anode or ground. Hereby the discharge process is purposefully positively affected. Further acceleration of the discharge process can be attained if in the interspace time, which means when no argon ions are accelerated with the negative pulse toward the target, even to switch the voltage briefly into the positive range in order to generate a greater discharge gradient for electrons and to accelerate the discharge process once more. Consequently bipolar pulses are already employed here, however these preferably not being symmetric and the negative pulse time area being greater than the positive one in order to ensure high sputter rates. Typical discharge voltages in magnetron sputter configurations are within the range of a few hundred volts, typically approximately in the range from negative 400 to 800 volts. Depending on the layout of the magnetron source and the operating pressures, the voltage ranges can also be wider or narrower. For the accelerated discharge of dielectric chargings it is here sufficient to move briefly in the interspace time to a few volts or some ten volts positive.
Known furthermore is also the possibility of operating two electrodes as cathodes, where these are alternately switched cathodically and the other time anodically, meaning they are operated with a bipolar pulse generator. This configuration has also been referred to as Twin Mag. Herein, each electrode is alternately once the cathode and subsequently the anode. This is an especially advantageous configuration for reactive sputtering processes. Compared to the known high frequency-controlled AC plasma configurations, the unipolarly or bipolarly operated DC-clocked DC configurations have the advantage of high rates. The complicated reactive process, in addition, can be better controlled. Modern generators of this type are realized as controllable DC generators, where in particular the switched mode power supply technique, also known as DC voltage converter or known in English as switched mode power supply or converter configurations, have become known. As is customary in electronics, switched-mode power supplies of this type are structured such that first the AC voltage mains, for example the three-phase mains with 3×400 V AC 50 Hz is rectified in conventional manner to generate a DC voltage. The generated DC voltage down from the mains in this case is approximately 550 V and is subsequently converted with the aid of a switched-mode power supply or a so-called DC-DC converter to the desired voltage values. For this purpose the DC voltage is essentially chopped under control with the aid of semiconductor switches and via a transformer correspondingly step-transformed up or stepped-down, and the configuration can conventionally be controlled, for example in terms of pulse width, via the semiconductor switches in order to be able to generate a variably settable output voltage. It is understood that the configuration can also be regulated to the correspondingly desired output voltages, currents or powers.
Such switched-mode power supplies or DC-DC converters have become known as various types and by now there are many variation forms of implementation possibilities. For operating a plasma generator with unipolar starting pulses for the plasma feeding, such DC-DC converters are employed directly by controlling or clocking these at the primary side via switching transistors and at the output side a corresponding pulsing DC voltage is generated. In the case of higher powers and for the generation of bipolar output pulses, the use of semiconductor bridge circuits, as with transistors or thyristors, has become pervasive. In this case the bridge is utilized in known manner for the purpose of inverting the polarity of the DC voltage fed into the bridge. The load or the plasma discharge path is here always switched directly into the semiconductor bridge branch. Expenditures for the realization of these known configurations is considerable. Especially with respect to protective measures of the semiconductors at the high operating voltages and especially also at high powers, special protective measures are required for the semiconductors. A further problem consists therein that in the event of flash-overs or shortcircuits fast transient processes take place, which lead to induced voltage superelevations and to high current peaks, which can additionally destroy the sensitive power semiconductors. Operation with reactive processes, in particular with poorly conducting materials or even insulation layers at high powers or at high pulse powers, and especially with defined pulse rise times, has until now only yielded limited success with the known pulse generators.


A system for cleaning vessels that have been contaminated with oil field drilling and production waste materials such as oil well drilling fluid or hazardous waste using recycled wash water. As dirty wash water accumulates in a vessel during cleaning, it is transferred to a settlement section of the waste receiving barge. A cationic polymer is injected into the suction side of a waste water pump during transfer of dirty fluid from the vessel to the receiving barge. The polymers react with fluids to begin an initial settling process within the waste receiving barge. Decant water is subjected to secondary settlement and secondary chemical treatment after it leaves the primary settling section of the waste receiving barge. The laundered water is returned to the wash water storage facility for reusing and cleaning the same vessel or additional vessels. In this fashion, waste is continuously concentrated in the receiving vessel for ultimate disposal at a remote site and wash water is recycled for reuse.

1. Field of the Invention
The present invention relates to the cleaning of boat tanks, bilges, and holds; barges; mobile or land based tanks; cutting boxes or container; and related vessels (sometimes hereinafter referred to as "vessels") that have been contaminated with oil and gas well drilling fluids such as oil well drilling mud and the like or with hazardous waste. More particularly, the present invention relates to a method and apparatus for the cleaning (in a marine and land based environment) of vessels that have been contaminated with oil and gas well drilling fluids, wherein a recycling water recovery system reuses the same wash water over and over, while continuously concentrating solid material in a receiving barge after the wash water leaves the vessel being cleaned and carrying oil and gas well drilling fluid waste products therewith (including solid material), and wherein various treatment stations remove solid material, oil, and like pollutants from the wash water stream before it is recycled to clean the vessel a second time or to clean a second vessel or a third vessel, etc.
2. General Background of the Invention
In the drilling of oil and gas wells, there are a number of fluids that are used in the drilling process. These fluids include for example drilling mud that contains heavy solids. This drilling mud becomes a pollutant when it is placed in a vessel that is used to transport drilling mud from land to oil and gas well and drilling production platforms located offshore.
Other oil and gas well drilling, completion and work over fluids include non-dispersed dispersed drilling mud, dispersed drilling mud, calcium treated drilling mud, drilling mud incorporating polymers, drilling muds prepared from fresh or brine water and sodium chloride, oil-based drilling mud and synthetic drilling mud. Other fluids used in the drilling of oil and gas wells include bactericides, calcium removers, corrosion inhibitors, defoamers, emulsifiers, filtrate reducers, flocculants, foaming agents, lost circulation materials, lubricants, pipe-freeing agents, shale control inhibitors, and surface active agents. A discussion of the various types of drilling, completion and workover fluids used in the oil and gas well drilling industry can be seen in the June 1994 issue of "World Oil".
Additionally, drilling fluids not used downhole in the drilling process or discarded hydrocarbon based waste fluids that have to be transported back to land are considered hazardous waste as defined by the United States Environmental Protection Agency.
The present method of cleaning such oil and gas well drilling fluids and hazardous waste from vessels is to simply wash the vessel while capturing the wash water in a barge. The wash water becomes contaminated with the oil and gas well drilling fluids and hazardous waste. The barge must then be shipped to a disposal site wherein the contaminated wash water is disposed of.
The disposal of a barge filled with wash water from such a vessel cleaning operation is an expensive and time consuming procedure. Each barge contains thousands of gallons of contaminated wash water and may have to be transported with a tug vessel to a disposal site.

Method of cleaning boats that have been contaminated with oil and gas well drilling fluids and hazardous waste


An architecture for minimizing calibration effort in an IEEE 802.11 device location measurement system. The calibration technique is based upon a regression function that produces adequately accurate location information as a function of signal strength regardless of gaps in the calibration data or minimally available data. The algorithm takes a set of signal strengths from known room locations in a building and generates a function giving (x,y) as a function of signal strength, which function may then be used for the estimation of new locations. Radial basis functions, which are simple to express and compute, are used for regression. The fact that the algorithm maps signal strength to continuous location makes it possible to skip rooms during calibration, yet still evaluate the location in those rooms.

Knowledge of locations of users and devices inside a building is an important prerequisite for location-based services and aspects of ubiquitous computing. One promising approach to determining location is through triangulation by measuring IEEE 802.11 wireless signal strengths of wireless devices. One of the most attractive features of an IEEE 802.11 location-based system is that it does not require any extra infrastructure beyond a wireless network that already exists in many buildings. This is in contrast to other person-tracking systems that employ active/passive badges and cameras, which in turn require installation and maintenance of extra equipment.
Using an 802.11 wireless client as a location sensor (e.g., a portable computer as a receiver) is becoming increasingly popular way of enabling location-based services. Triangulation of signal strengths from multiple access points (APs) may be used to pinpoint location of the receiving device down to a few meters. However, this level of accuracy comes at a price of requiring tedious and time-consuming manual labor in order to obtain spatially high-density calibration data of signal strengths as a function of location.
Knowing radio signal strength measurements on a network client from a few different APs, researchers have shown how to compute location down to a few meters. This type of location measurement is especially attractive because it uses existing devices of a building and its users, and because it functions indoors where global positioning system (GPS) and cell phone location signals often break down. However, the accuracy of such systems usually depends on a meticulous calibration procedure that consists of physically moving a wireless client receiver to many disparate known locations, and different orientations, inside the building. It is often be impracticable to expect anyone to spend resources on such work—when presented with such prospect as part of a new product, software product planners often balk, complaining that system administrators are reluctant to even keep locations of printers updated, much less create and maintain a high-resolution table of IEEE 802.11 signal strengths.
One alternative to manual calibration is to analytically predict signal strengths based on a floor plan of a building, physical simulation of radio frequency (RF) propagation, and knowledge of the locations of wireless access points. It was discovered, for the chosen simulation method, that physically simulating signal strengths increased median location error by approximately 46% (from 2.94 meters to 4.3 meters) over values obtained by manual calibration. Moreover, a good physical simulation usually requires a more detailed model of the building than is normally available.
In the realm of IEEE 802.11 locations, one published work was based on the RADAR system, an in-building RF-based location and tracking system. RADAR worked based on a table of indoor locations and corresponding signal strengths. Using a manually calibrated table, the nearest neighbor algorithm gave a median spatial error of approximately 2.94 meters. Another table based on simulated radio wave propagation allowed the avoidance of most of the calibration work at the cost of increasing the median error to 4.3 meters. The RADAR work also looked at the problem of reducing calibration effort. It was found that reducing the number of calibration points from seventy to forty had only a small negative impact on accuracy. In follow-on work, RADAR was enhanced to use a Viterbi-like algorithm on short paths through the building. This further reduced the median error to approximately 2.37 meters.
As part of Carnegie Mellon's Andrew system, a limited study of an IEEE 802.11 location system was performed using eight discrete locations in a hallway. A table of signal strength versus location was built. It was determined that upon returning to the eight locations, the system inferred the right location 87.5% of the time.
Another location service used signal-to-noise ratios, instead of the more commonly used raw signal strengths. The location algorithm was a Bayesian network, manually trained at discrete locations in two buildings. The Bayes formulation allowed the inclusion of a priori probabilities of a person's location, as well as transition probabilities between locations. In one test on twelve locations in a hallway, the service was capable of identifying the highest probability to the correct location 97% of the time, not counting the 15% of the time it was inconclusive.
In still another study, IEEE 802.11 was used to compute the location of wireless PocketPCs, both indoors and outdoors. Instead of manual calibration, a formula was used that approximated the distance to a wireless access point as a function of signal strength. Using a hill-climbing algorithm, the system computes location down to about ten meters (approximately thirty-five feet) using signal strengths from multiple access points.
In yet another study of an IEEE 802.11 location system, Bayesian reasoning and a hidden Markov model were used. Not only were signal strengths taken into account, but also the probability of seeing an access point from a given location. Like other work, it was based upon a manual calibration. The system explicitly modeled orientation and achieved a median spatial error of approximately one meter using calibration samples taken approximately every 1.5 meters in hallways. Although in terms of accuracy, this may be perhaps the best result, the study also acknowledges the problem of calibration effort, and suggests that calibrated locations could be automatically inferred by outfitting the calibrator with an accelerometer and magnetic compass.
Some of the conventional systems described hereinabove are explicitly working toward more accuracy, but at the expense of increased calibration effort.

Calibration of a device location measurement system that utilizes wireless signal strengths


An electronic device capable of receiving a member comprises a housing, a display unit, a first switch unit and a receiving device. The display unit is disposed in the housing and the receiving device is connected to the housing. The receiving device is movable between a first position and a second position to receive the member. When the display unit is switched from the first mode to the second mode by the first switch unit, the carriage moves from the first position to the second position.

The present invention relates to an electronic device capable of receiving a member, and in particular to an electronic device with a display unit comprising a receiving device for receiving a member.
For example, a monitor and a keyboard are two separate components required by a conventional Personal Computer (PC). After a host of the PC is shut down or the monitor is turned off, the keyboard is often stored on the table, or simply set aside on another surface.

Electronic device capable of receiving a member


A discharge device for reducing foaming of liquid flowing from a conduit (3) into a body of liquid. The discharge device (3) contains at least a porous permeable body (6) including a core (12) and an annular layer (15). To cause during normal operation liquid to leave the porous permeable body (6) in the form of a liquid bell (18) the resistance to flow through the porous permeable body (6) in the direction of its central longitudinal axis (9) is larger than the resistance to flow through the porous permeable body (6) in lateral direction towards the side surface (17) of the porous permeable body.

When the liquid flows out of a discharge deice and splashes into a body of liquid foam can be generated. Generally the amount of foam generated increases with increasing flow rate at which the liquid is discharged when other conditions are not changed. The generated foam can occupy a considerable amount of the volume of the tank into which the liquid is discharged, so that after settling out of the foam only a limited amount of liquid is present in the tank. This problem occurs for example when a fuel tank of a car is filled with diesel fuel at normal filling rate. The amount of foam generated in the tank during filling limits the fuel capacity of the tank considerably as in general about 10-20% by volume of a diesel tank is occupied by foam.
It is an object of the invention to overcome this problem which occurs during the flow of fluid from a conduit into a body of fluid.