The degradation of deposited low dielectric constant interlayer dielectrics and gap fill layers, such as HSQ layers, during formation of contacts/vias is significantly reduced or prevented by employing a water vapor plasma to remove the photoresist mask. The use of a water vapor also enables rapid photoresist stripping at a rate of about 10 to about 20 Kxc3x85/min. Embodiments include photoresist stripping with a water vapor plasma to prevent reduction of the number of Sixe2x80x94H bonds of an as-deposited HSQ layer below about 70%.

The present invention relates to high density, multi-metal layer semiconductor device with reliable interconnection patterns. The present invention has particular applicability in manufacturing ultra large scale integration multi-metal layer semiconductor devices with a design rule of about 0.15 micron and under, e.g., about 0.12 micron and under.
The escalating demands for high density and performance associated with ultra large scale integration semiconductor devices require a design rule of about 0.15 micron and under, such as about 0.12 micron and under, increased transistor and circuit speeds, high reliability and increased manufacturing throughput. The reduction of design rules to about 0.15 micron and under challenges the limitations of conventional interconnection technology, including conventional photolithographic, etching and deposition techniques.
Conventional semiconductor devices typically comprise a semiconductor substrate, typically doped monocrystalline silicon, and a plurality of sequentially formed inter-layer dielectrics and patterned metal layers. An integrated circuit is formed containing a plurality of conductive patterns comprising conductive lines separated by interwiring spacings, and a plurality of interconnect lines, such as bus lines, bit lines, word lines and logic interconnect lines. Typically, the conductive patterns on different layers, i.e., upper and lower layers, are electrically connected by a conductive plug filling a via opening, while a conductive plug filling a contact opening establishes electrical contact with an active region on a semiconductor substrate, such as a source/drain region. Conductive lines are formed in trenches which typically extend substantially horizontal with respect to the semiconductor substrate. Semiconductor xe2x80x9cchipsxe2x80x9d comprising five or more levels of metallization are becoming more prevalent as device geometries shrink into the deep submicron range.
A conductive plug filling a via opening is typically formed by depositing an inter-layer dielectric on a patterned conductive (metal) layer comprising at least one metal feature, forming an opening in the inter-layer dielectric by conventional photolithographic and etching techniques, and filling the opening with a conductive material, such as tungsten (W). Excess conductive material on the surface of the inter-layer dielectric is removed by chemical-mechanical polishing (CMP). One such method is known as damascene and basically involves the formation of an opening which is filled in with a metal. Dual damascene techniques involve the formation of an opening comprising a lower contact or via opening section in communication with an upper trench opening section, which opening is filled with a conductive material, typically a metal, to simultaneously form a conductive plug in electrical contact with a conductive line.
The conventional practice of forming a landing pad completely enclosing the bottom surface of a contact or via utilizes a significant amount of precious real estate on a semiconductor ship which is antithetic to escalating demands for high density. In addition, it is extremely difficult to voidlessly fill through-holes having such reduced dimensions because of the extremely high aspect ratio, i.e., height/width of the through-hole opening. Accordingly, conventional remedial techniques comprise purposely widening the diameter of the through-hole to decrease the aspect ratio. As a result, misalignment occurs wherein the bottom surface of the conductive via is not completely enclosed by the underlying metal feature. This type of via is called a xe2x80x9cborderless viaxe2x80x9d, which also conserves chip real estate.
High performance microprocessor applications require rapid speed of semiconductor circuitry. The speed of semiconductor circuitry varies inversely with the resistance and capacitance of the interconnection pattern. As integrated circuits become more complex and feature sizes and spacings become smaller, the integrated circuit speed becomes less dependent upon the transistor itself and more dependent upon the interconnection pattern. Miniaturization demands long interconnects having small contacts and small cross-sections. As the length of metal interconnects increases and cross-sectional areas and distances between interconnects decrease, the resistance capacitance (RC) delay caused by the interconnect wiring increases. If the interconnection node is routed over a considerable distance, e.g., hundreds of microns or more, as in submicron technologies, the interconnection capacitance limits the circuit node capacitance loading and, hence, the circuit speed. As design rules are reduced to about 0.15 micron and below, the rejection rate due to integrated circuit speed delays severely limits production throughput and significantly increases manufacturing costs. Moreover, as line widths decrease, electrical conductivity and electromigration resistance become increasingly important.
As device geometries shrink and functional density increases, it becomes increasingly imperative to reduce the capacitance between metal lines. Line-to-line capacitance can build up to a point where delay time and cross talk may hinder device performance. Reducing the capacitance within multi-level metallization systems will reduce the RC constant, cross talk voltage, and power dissipation between the lines.
One way to increase the speed of semiconductor circuitry is to reduce the resistance of a conductive pattern. Conventional metallization patterns are typically formed by depositing a layer of conductive material, notable aluminum or an alloy thereof, and etching, or by damascene techniques where trenches are formed in dielectric layers and filled with conductive material. The use of metals having a lower resistivity than aluminum, such as copper, engenders various problems which limit their utility. For example, copper readily diffuses through silicon dioxide, the typical dielectric material employed in the manufacture of semiconductor devices, and adversely affects the devices. In addition, copper does not form a passivation film, as does aluminum. Hence, a separate passivation layer is required to protect copper from corrosion.
The dielectric constant of materials currently employed in the manufacture of semiconductor devices for an inter-layer dielectric (ILD) spans from about 3.5 for dense silicon dioxide to over 8 for deposited silicon nitride and spin-on glass. Prior attempts have been made to reduce the interconnect capacitance and, hence, increase the integrated circuit speed, by developing dielectric materials having a lower dielectric constant than that of silicon dioxide. New materials having low dielectric constants, such as low dielectric constant polymers, e.g., methyl silsesquioxane (MSQ) and hydrogen silsesquioxane (HSQ), teflon, aerogels and porous polymers have been developed. There has been some use of certain polyimide materials for ILDs which have a dielectric constant slightly below 3.0.
Low dielectric constant (low-k) polymers, such as HSQ, offer many advantages for use in interconnect patterns. HSQ is relatively carbon free, thereby avoiding poison via problems. Moreover, due to the virtual absence of carbon, it is not necessary to etch back HSQ below the upper surface of the metal lines to avoid shorting. In addition, HSQ exhibits excellent planarity and is capable of gap filling interwiring spacings less than 0.15 microns employing conventional spin-on equipment. HSQ undergoes a melting phase at approximately 200xc2x0 C., but does not convert to the high dielectric constant glass phase until reaching temperatures of about 400xc2x0 C. for intermetal applications and about 700xc2x0 C. to about 800xc2x0 C. for premetal applications.
However, low-k polymers, such as MSQ and HSQ, are susceptible to degradation during processing leading to various problems, such as voids, particularly when used as gap fill layers or ILDs during contact or via formations, particularly when forming borderless vias. For example, when forming a conventional contact or via a through-hole is etched through an ILD, e.g., HSQ, exposing surfaces forming the through-hole. When forming a borderless via, a photoresist mask is deposited and the misaligned through-hole etched to expose a portion of an upper surface and a portion of a side surface of a metal line, and penetrate into and expose the gap fill layer. The photoresist mask is then stripped, typically employing an oxygen (O2)-containing plasma. Subsequently, solvent cleaning is performed. It was found that the O2-containing plasma employed to strip the photoresist mask degrades low-k materials, such as HSQ, employed for ILDs and for gap fill layers when forming contacts and vias. After stripping a photoresist mask after forming a conventional contact or via opening, the low-k ILD is found to be degraded manifested by an increase in the dielectric constant of the low-k dielectric material. In addition, when employing a low-k dielectric material as a gap fill layer in forming a borderless via, upon subsequent filling of the misaligned through-hole, as with a barrier material, such as titanium nitride or titanium-titanium nitride, spiking occurs, i.e., the barrier material penetrates through the HSQ gap fill layer to the substrate or underlying conductive feature.
The precise mechanism involved in degrading low-k materials upon O2-plasma stripping of a photoresist mask after anisotropic etching to form a contact or via opening is not known with certainty, but would depend, in part, upon the particular low-k dielectric material employed for the ILD and/or gap fill layer. Various silsesquioxanes are particularly affected by O2-plasmas. For example, HSQ typically contains between about 70% and about 90% Sixe2x80x94H bonds. However, upon exposure to an O2-containing plasma, a considerable number of Sixe2x80x94H bonds are broken and Sixe2x80x94OH bonds are formed. Upon treatment with an O2-containing plasma, as much as about 20% to about 30% of the Sixe2x80x94H bonds in the deposited HSQ film remained. In addition, it was found that exposure to an O2-containing plasma increased the moisture content of the as deposited HSQ film and its propensity to absorb moisture. An HSQ film having reduced Sixe2x80x94H bonds and high Sixe2x80x94OH bonds tends to absorb moisture from the ambient, which moisture outgasses during subsequent barrier metal deposition. Thus, it was found that during subsequent barrier and metal deposition, e.g., titanium-titanium nitride and tungsten, outgassing occurred thereby creating voids leading to incomplete electrical connection.
Solis, et al. in xe2x80x9cNovel CF4+H2O Ashing Process for Reduction of Via Resistancexe2x80x9d, ISSM Proceedings, 1997, pages F-25 through F-27, disclose the use of ashing chemistry incorporating H2O and CF4 for improved polymer stripability and reduced via resistance. Solis, in U.S. Pat. No. 5,851,302, discloses the use of a plasma containing CF4 and H2O for stripping sidewall polymer from etched via holes and from etched metal lines. Solis et al., in U.S. Pat. No. 5,814,155, disclose the use of a plasma containing O2, CF4 and H2O for ashing to selectively remove sidewall polymer formation from etched metal lines.
In copending U.S. patent application Ser. No. 08/933,430, filed on Dec. 18, 1997, a method is disclosed for selectively heating portions of a deposited HSQ layer adjoining a metal feature to increase the resistance of such adjoining portions to penetration when etching a misaligned through-hole for a borderless via. In copending U.S. patent application Ser. No. 08/933,125, filed on Dec. 18, 1997, a method is disclosed for preventing the degradation of deposited HSQ layers during formation of a borderless via comprising stripping the photoresist mask employing a hydrogen-containing stripping plasma to prevent reduction in the number of Sixe2x80x94H bonds of the deposited HSQ gap filled layer below about 70%.
In view of the manifest advantages attendant upon employing low-k materials, such as HSQ, in interconnection systems, as for ILDs and gap fill layers, there exists a need to provide efficient methodology enabling such use of low-k materials without degradation.
An advantage of the present invention is a method of manufacturing a high density multi-metal layer semiconductor device with a design rule of about 0.15 micron and under, and an interconnection pattern comprising high integrity contact/vias and low-k materials without degradation.
Another advantage of the present invention is a method of forming interconnection patterns employing low-k materials for ILDs and/or gap fill layers without degradation upon forming contact/vias.
Additional advantages and other features of the present invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from the practice of the present invention. The advantages of the present invention may be realized and obtained as particularly pointed out in the appended claims.
According to the present invention, the foregoing and other advantages are achieved in part by a method of manufacturing a semiconductor device, the method comprising: forming a first dielectric layer on a substrate; forming a first patterned conductive layer having gaps on the first dielectric layer, the first patterned conductive layer comprising a first conductive feature having an upper surface and side surfaces; depositing a dielectric gap fill layer to fill the gaps; depositing a second dielectric layer on the first patterned conductive layer and on the gap fill layer; forming a photoresist mask on the second dielectric layer; forming a through-hole in the second dielectric layer exposing the upper surface of the first conductive feature; and removing the photoresist mask employing a water vapor-containing plasma; wherein, the gap fill layer and/or second dielectric layer have an as-deposited dielectric constant no greater than about 3.
Another advantage of the present invention is a method of manufacturing a semiconductor device, the method comprising: depositing a layer of dielectric material, having an as-deposited dielectric constant no greater than about 3, over a conductive region or conductive feature; forming a through-hole in the dielectric layer exposing the upper surface of the conductive region or conductive feature; and removing the photoresist mask with a water vapor-containing plasma.
Embodiments of the present invention include the use of a low-k dielectric material, e.g., a dielectric material having a dielectric constant of about 1.8 to about 3.0, as an ILD and/or gap fill layer, and removing the photoresist mask employing a water vapor-containing plasma at a removal rate of about 10,000 to about 20,00 xc3x85/min such that the dielectric constant of the low-k material does not increase more than about 10%. Embodiments of the present invention comprise employing a silsesquioxane, such as HSQ, as an ILD and/or gap fill layer and removing the photoresist mask with a water vapor-containing plasma at a rate of about 10,000 to about 20,000 xc3x85/min such that the number of Sixe2x80x94H bonds in the HSQ layer is not reduced below about 70% of the number of Sixe2x80x94H bonds in the as-deposited HSQ layer.
Additional advantages of the present invention will become readily apparent to those skilled in this art from the following detailed description, wherein only the preferred embodiment of the present invention is shown and described, simply by way of illustration of the best mode contemplated for carrying out the present invention. As will be realized, the present invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, all without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature, and not as restrictive.

Water vapor plasma for effective low-k dielectric resist stripping


Radiological imaging device comprising an emitter of an X-ray beam and a receiver of the X-ray beam after it has crossed an organ, the organ being capable of being placed between the receiver and a compression element, capable of being removably fixed on the device. A calculation unit includes a means for optimizing the image quality over a particular area defined by the compression element.

The present invention belongs to the field of radiology intended for study of object in particular of the human body in general and of certain organs in particular, such as the breasts, the heart, the circulatory system, etc.
As is standard, a radiology device comprises an X-ray tube capable of emitting an X-ray beam along a given axis, an X-ray receiver placed on the path of the X-ray beam, the organ to be studied being interposed between the X-ray tube and the receiver, and a support of the X-ray tube and receiver capable of displacing them along at least one axis, with a view to obtaining the positioning desired in relation to the organ to be studied. The radiology device further contains an electric power supply intended for the X-ray tube and possibly different electric motor or actuators, and a control of the X-ray tube making it possible to obtain the proper adjustments. The X-ray receiver is equipped with a digital type X-ray detector to display the image obtained on a video screen and/or to print it. U.S. Pat. No. 5,539,797 is an example of a known device.
When used the operator could commit errors resulting in serious disadvantages. For example, in the case of mammography, a lateral error can lead to taking a biopsy not on the breast presenting microcalcifications or other symptoms, but on the other breast with none of these symptoms.

Radiological imaging device, method and program of control associated with the device

GE Medical Systems Global Technology Company, LLC


An optional apparatus for an image forming apparatus which forms an image on a print medium, which is detachably connected to the image forming apparatus and performs predetermined optional processing for a print medium supplied from the image forming apparatus, is provided. The optional apparatus includes a storage battery which can be charged/discharged, an optional processing unit configured to execute the predetermined optional processing upon receiving supply of power at least from the image forming apparatus or from the storage battery, and a switch unit configured to cut off supply of power from the storage battery to the optional processing unit when the optional apparatus is detached from the image forming apparatus or a door of the optional apparatus is opened.

Recently, the market has demanded more that new values, such as option expandability and energy saving, be added to image forming apparatuses. In addition, it has been required to supply power from an image forming apparatus to an optional apparatus so as to improve the design of the optional apparatus when it is mounted and allow a user to easily detach/attach it.
When, however, power is to be supplied from the image forming apparatus body to, for example, an optional apparatus designed to perform stapling processing, since high power is required for stapling operation, a large-capacity power supply circuit must be prepared for the image forming apparatus body in expectation of the maximum load on the optional apparatus. This leads to an unnecessary increase in cost for a user who uses only the image forming apparatus. It has therefore been required to minimize an increase in the cost of the image forming apparatus body by reducing the maximum power consumed by the optional apparatus itself.
In addition, a demand has arisen for a means for reducing the maximum powers of an image forming apparatus and optional apparatus to prevent the maximum power of the system from exceeding the maximum power that can be supplied from a one-system commercial power supply so as to prevent a protective means such as the circuit breaker of the commercial power supply from activation.
On the other hand, an image forming apparatus or an optional apparatus individually having a power supply uses an arrangement designed to cut off, for safety, power supplied to a driving means, heating means, or the like placed at a position where a user can touch when the user opens the image forming apparatus in case of paper jam.
When a storage battery is provided for an optional apparatus which receives power from an image forming apparatus, the following problem arises. Although power from the image forming apparatus to the optional apparatus is cut off when the optional apparatus is detached from the image forming apparatus or the optional apparatus is opened, electric charge remaining in the storage battery may allow a driving means of the optional apparatus to operate.

Optional apparatus for image forming apparatus


Apparatus for moving a toilet between a position where it is accessible to a person of restricted mobility and a storage position when not in use. The apparatus comprises two cooperating platforms, a first platform which rests on the floor of a room which houses the apparatus and a second platform. The first platform has a guide along an edge, and the second platform has an edge that is slidably received in the guide, and is supported so that it is capable of limited translational movement without rotation relative to the first platform. A physically impaired person can occupy a chair on the first platform, and can slide the second platform relative to the first to move a portable toilet on the second platform between a position in which it can be used and a storage position.

1. Field of the Invention
The present invention relates generally to a toilet and, specifically, to a toilet that is not plumbed, and is adapted to be moved into and out of a use position with a minimum of effort, especially by persons with reduced or impaired mobility who, nonetheless, have some mobility.
2. Description of the Prior Art
There are numerous toilets that have been specifically designed for people who, because they are recovering from a surgical procedure or an illness or have impaired mobility for some other reason or reasons, would have difficulty getting up and getting to and using a conventionally plumbed toilet in a rest room. During a search of US patents that was made in respect of the present invention, the following patents were noted:
U.S. Pat. No. 4,161,793 discloses a combination stool and toilet device. The device is on spring loaded wheels that retract under the weight of a user so that the device rests firmly and securely on its lower edge. A toilet paper feeding system is connected to one of the wheel mechanisms.
U.S. Pat. No. 4,300,249 discloses a wheel type chair for persons with neurological impairment. The chair includes a built in toilet that is accessed through a trap door in the seat of the chair.
U.S. Pat. No. 4,888,833 discloses a mobile cart for use by handicapped persons and for transporting handicapped persons to a plumbed toilet.
U.S. Pat. No. 4,920,587 discloses a bedside toilet for bed ridden patients. The toilet includes a platform that is convertible to a seat and back again and mechanisms for raising and lowering the platform to a height corresponding with the top of a bed. With the platform in place on the edge of a bed, a bed ridden patient is "rolled" onto the platform which is then manipulated into a seat configuration and used as a toilet.
U.S. Pat. No. 5,184,653 discloses a toilet dolly for moving and holding a plumbed toilet when it is temporarily removed from a closet flange in the floor. The dolly includes a reservoir for receiving any water that might remain in the toilet after it is removed from the closet flange.
U.S. Pat. No. 5,373,593 discloses a handcart for lifting, transporting and installing toilets which facilitates the placement of a toilet over a closet flange and wax ring.
U.S. Pat. No. 5,787,518 discloses a convertible toilet seat for use in combination with a plumbed toilet, especially for children.
U.S. Pat. No. 6,418,571 discloses a toilet chair on wheels. A two piece cushion includes a removable cushion portion and is supported above a container pot that is accessible when the removable cushion portion is removed.

Toilet system to accommodate users with impaired mobility


A method of capping printheads positioned along a curved media path having an apex. The method includes the steps of: providing a first printhead upstream of the apex and a corresponding first capper downstream of the first printhead; providing a second printhead downstream of the apex and a corresponding second capper upstream of the second printhead; moving the first capper towards the first printhead and capping the first printhead; and moving the second capper towards the second printhead and capping the second printhead. The first and second cappers are moved in opposite directions away from the apex for capping the first and second printheads.

Inkjet printers employing Memjet® technology are commercially available for a number of different printing formats, including desktop printers, digital inkjet presses and wideformat printers. Memjet® printers typically comprise one or more stationary inkjet printhead cartridges, which are user-replaceable. For example, a desktop label printer comprises a single user-replaceable multi-colored printhead cartridge, a high-speed label printer comprises a plurality of user-replaceable monochrome printhead cartridges aligned along a media feed direction, and a wideformat printer comprises a plurality of user-replaceable printhead cartridges in a staggered overlapping arrangement so as to span across a wideformat pagewidth.
U.S. application Ser. No. 15/582,998 filed 1 May 2017, the contents of which are incorporated herein by reference, describes a commercial pagewide printing system comprising an N×M two-dimensional array of print modules. Providing OEM customers with the flexibility to select the dimensions and number of printheads in an N×M array in a modular, cost-effective kit form enables access to a wider range of commercial digital printing markets that are traditionally served by offset printing systems.
Typically, web-based printers print onto print media fed over a convexly curved media path. By imparting a convex curvature to the media path, the web can be readily tensioned over a set of radially positioned rollers. With a curved media path, each printhead must also be arranged radially about the rollers. Moreover, in order to perform printhead maintenance, the printheads should ideally be lifted radially with respect to the curved media path. This ensures that a distance between the printheads and maintenance components (e.g. cappers and wipers) is consistent for all printheads in the printer. U.S. application Ser. No. 15/582,998 describes one means by which printheads may be lifted radially with respect to a curved media path: each printhead is mounted on a respective print bar having a dedicated lift mechanism mounted on a maintenance chassis.
However, it is convenient to lift radially-arranged printheads in a print engine simultaneously using a common lift mechanism without requiring each printhead (or print bar) to have its own dedicated lift mechanism. U.S. Provisional Application 62/563,584 filed 26 Sep. 2017, the contents of which are incorporated herein by reference, describes a print engine having a common lift mechanism for an array of four printheads radially arranged around a curved media path. The lift mechanism described in U.S. Provisional Application 62/563,584 employs a scissor lift mechanism in combination with a print module mounting arrangement that provides radial movement of each print module. Nevertheless, this print module mounting arrangement adds complexity to the print engine design.
It would be desirable to provide a print engine which allows radially-arranged printheads to be maintained using a common lift mechanism. It would be further desirable to avoid complex print module mounting arrangements in the print engine.

This patent is subject to a terminal disclaimer.

Method of capping printheads arranged along curved media path


A magnetoelastic torque sensor (1) has an emission coil (7) for generating a magnetic field in an object (3), the torque of which is to be determined. The emission coil is axially oriented (A) and has an axial emission coil end surface (15) which can be guided towards the object (3). At least two reception coils (9, 33, 43) at a distance from the emission coil and having, respectively, a receiving coil end surface (17) which can be guided towards the object (3) to capture a response signal induced in the object (3) by the magnetic field of the emission coil (7, 31, 41). At least the receiver coil end surface (17) of one of the receiver coils protrudes beyond the emission coil end surface (15) to a selected distance from the object (3).

The present invention relates to an electromagnetic torque sensor comprising an emission coil for generating a magnetic field in an object whose torque is to be determined, having at least two reception coils which receive a response signal which is induced in the object by the magnetic field of the emission coil.
A magnetoelastic torque sensor is based on the inverse magnetostrictive effect, that is to say the effect according to which ferromagnetic materials experience a change in the magnetic susceptibility if mechanical stresses occur. Since mechanical stresses are induced not only by tensile forces and compressive forces but also by torsion, the inverse magnetostrictive effect can be used to measure torque, for example to measure the torque on a shaft in a contactless fashion. If a magnetic field is induced in a ferromagnetic layer or a shaft, a response signal, which can be detected by the reception coils, is generated in the layer as a function of the stresses which occur. Since the response signal is influenced by the stresses occurring due to torsion in the ferromagnetic material and which are caused in turn by the torque, the torque of the shaft can be inferred from the response signal. The detected measurement signal is dependent on the distance of the torque sensor from the ferromagnetic layer and on the temperature of the ferromagnetic layer. The accuracy with which the torque can be determined from the response signal therefore depends, inter alia, on how well the torque sensor can be positioned with respect to the object of which the torque is to be determined.


Apparatus for deploying an articulated panel array comprises a spring motor between adjacent panels and a latch between adjacent panels. The latch between a given pair of panels is released by an abutment on the panel which is adjacent to the pair and toward the proximal end of the array only when the more proximally disposed panel of the pair moves to its fully deployed position. With this arrangement, only a single group of panels of the array moves at any given time providing an accurate deployment envelope.

1. Field of the Invention
This invention relates to apparatus for deploying an articulated panel array.
2. Description of the Related Art
Heretofore, in deploying the panels of a satellite solar panel array, two basic approaches have been taken. Firstly, some deployment systems do not kinematically link neighbouring panels so that the panels deploy independently. With this approach, the deployment mechanism is mechanically relatively simple but the deployment trajectories of the elements are ill-defined. Hence, a great deal of uncertainty exists as to the transient geometry of the deploying array. This is disadvantageous as it risks the array knocking into other portions of the satellite during deployment.
The second approach used in deploying a satellite solar panel array kinematically links neighbouring panels with a coordinating device (comprising cables, pulleys or the like). While a coordinating device should provide a more defined deployment geometry, in practice, because of the finite stiffness of the coordinating linkage, sufficient divergence occurs between the theoretical and actual deployment envelopes as to potentially cause difficulties. Furthermore, the linkage mechanism of the coordinating device itself adds to the weight, cost and complexity of the satellite. Furthermore, the increased complexity reduces the overall reliability of the mechanical assembly.
The subject invention seeks to overcome drawbacks of known satellite solar panel array deployment apparatus by providing apparaus which offers a well-defined deployment trajectory while avoiding the use of coordinating linkages.


A sensor system for a vehicle includes a central module and a plurality of sub modules mounted in a frame of the vehicle, the sub modules being independently removable. The sub modules include sensors configured to capture image data and distance data in a vicinity of the vehicle. The central module is connected to each of the plurality of sub modules through a first network including a switching hub. The sub modules are individually connected to an external processor through a second network. The central processor is configured to synchronize the sub modules based on absolute time information through the first network, and the sub modules are configured to output the captured image data and distance data appended with synchronized time information to the external processor by communicating through the second network.

In recent years, autonomous driving has emerged as an important area of technological research and development. Vehicles adapted for autonomous driving, especially higher level autonomous driving, are typically provided with an advanced sensor system for capturing various types of data, such as image data and distance data. These sensor systems may be installed during the manufacturing process of the vehicle, or may be installed as an after-market add on system. Such sensor systems are subject to improvement in design.


The invention relates to a long afterglow phosphor and a process for preparing the phosphor, characterized in that the phosphor comprises the sinter expressed by a general formula MO.multidot.(n-x)a Al.sub.2 O.sub.3.sup..alpha. .div.(1-a)Al.sub.2 O.sub.3.sup..gamma. !.multidot.B.sub.2 O.sub.3 : R, where, M represents and alkaline earth metal, R represents a rare earth element, 0.5<a.ltoreq.0.99, 0.001.ltoreq.x.ltoreq.0.35, and 1.ltoreq.n.ltoreq.8, and a part of M may be replaced with at least one alkaline earth metal selected from Mg, Ca and Ba. R may also use other rare earth elements in addition to Eu as additional activators. The process for preparing the long afterglow phosphor of the present invention comprises several steps, wherein the sintering temperature needs to be 800.degree.-1200.degree. C.

Phosphorescent materials are those that can absorb energy when excited by solar, fluorescent and other artificial lights. In particular, when these materials are excited by ultraviolet light, they deviate from their initial equilibrium states, and convert the absorbed energy to visible light after they return to the equilibrium states so as to continue to glow after the excitation has stopped. Material which can maintain a long glowing time is referred to as a "long afterglow phosphor".
Luminous paints applied on watch dials and safe marks have usually been formed by admixing phosphorescent material, using zinc sulfide mixed with copper (ZnS:Cu) as an activator, into paint, ink and the like. The sulfides can absorb energy when excited by ultraviolet light with certain wavelengths and then release the energy in the form of visible light in accordance with the above light-emitting principle of the phosphorescent material. Since the sulfides, however, have a very short span of afterglow, have unstable chemical structures and are not lightproof, there exist many problems when they are used in a practical situation. For example, the visible light emitted by such materials can last only for 20-30 minutes when they are used for luminous watches. There may also be the phenomenon of light decomposition and even loss of light-emitting ability of the material when it is radiated with ultraviolet radiation. Therefore, they can not be used in outdoor environments.
To prolong the time of afterglow, radioactive materials, such as Pm, are sometimes added to give phophors themselves the light-emitting ability. However, with radioactive materials the requirement for the treatment of the materials is very strict, and high costs arise for the aparatus used and the treatment of waste materials such as waste water, so this method is not used at present.
Besides sulfide phosphorescent material, it has been suggested that phosphorescent materials be prepared by adding the rare earth element europium to alkaline earth metal aluminates. For example, U.S. Pat. No. 3,294,699, to Lange, discloses a light-emitting material of strontium aluminate (SrAl.sub.2 O.sub.4 : Eu), in which divalent Eu is utilized as an activator and the amount added is 2-8 mol % of strontium aluminate. This fluorescent material has a light-emitting peak of 520 nm when excited by ultraviolet light. However, this fluorescent material has little afterglow.
Other examples of preparing fluorescent materials by adding other alkaline earth metals to strontium aluminate are disclosed in, for example, UK Patent No. 1,190,520, which discloses a divalent Eu-activated fluorescent material comprising (Ba)x, (Sr)y, (Ca)z, (Eu)p, Al.sub.12 O.sub.19 (wherein x+y+z+p=1, one or two of x, y and z may be 0,and 0.001.ltoreq.p.ltoreq.0.1). This sort of fluorescent material has a light-emitting peak of 380-440 nm wavelength when excited by ultraviolet. The material emits visible light only when excited by ultraviolet light or electrons, and is mainly used in CRT and the like.
Recently, other desirable light-emitting materials which can emit light for long periods when excited by a certain energy have been developed. For example, Chinese Patent Application No. CN 1,053,807A discloses a light-emitting material of long afterglow, which has a general formula of M{Sr(1-x)Eu x}O.multidot.nAl.sub.2 O.sub.3 .multidot.yB.sub.2 O.sub.3 (1.ltoreq.m.ltoreq.5, 1.ltoreq.n.ltoreq.8, and 0.001.ltoreq.y.ltoreq.0.35). This long afterglow light-emitting material is formed by using oxide of aluminum, strontium and europium, or salts which can produce these oxides when heated, as starting materials, sintering at 1200.degree.-1600.degree. C., and reducing at 1000.degree.-1400.degree. C. under N.sub.2 and H.sub.2. However, the actual time of afterglow of this light-emitting material of long afterglow is only 4-5 hours, and it has a low initial brightness and poor applicablity.
To solve the above-described problems, the inventors of the present invention have improved the light-emitting combination of activators of alkaline earth metal aluminates and rare earth metals, studied various structures and new crystals, and developed a phosphor which exibits higher initial brightness and longer afterglow than the light-emitting materials of combination of known sulfides and activators of alkaline earth metal aluminates and rare earth metals.

Long afterglow phosphor and a process for the preparing thereof


The compact image pickup module includes an imaging lens, a lens-barrel holding the imaging lens, an image pickup element, an image pickup element holder holding the pickup element and into which the barrel is fitted so as to be rotatable about an optical axis of the imaging lens and movable in a direction of the optical axis, a cylindrical cam having as an upper or a lower surface thereof, an annular cam surface whose center is set at the optical axis and being formed in one of the barrel and the element holder and an abutment member being abutted against the cam surface under a state where the barrel is fitted into the element holder and formed in the other. After focusing is performed through relative rotation of the barrel and the element holder, the barrel and the element holder are fixed to each other. The lens unit includes the barrel and the imaging lens having multiple lenses held by the barrel.

The present invention relates to a compact image pickup module that is attached to a mobile telephone or a PDA with a photographing function or the like, and a lens unit suitable for a compact image pickup module or the like, and more specifically to a compact image pickup module that is capable of performing appropriate focusing, preventing inclination of the optical axis of an imaging lens with respect to an image pickup element such as a CCD sensor, and performing alignment of the image pickup element such as a CCD sensor with ease, a compact image pickup module where macro photographing is realized with a simple mechanism, and a lens unit that includes multiple lenses and is capable of preventing displacements between the optical axes of the lenses.
A compact image pickup module installed in a mobile telephone, a PDA (Personal Digital Assistant), a compact digital camera, or the like is ordinarily constructed by combining an image pickup element (such as a CCD sensor or a CMOS sensor; hereinafter the CCD sensor will be described as a representative), a holding member (hereinafter referred to as "CCD holder") that holds the CCD sensor, an imaging lens (hereinafter also simply referred to as "lens"), and a cylindrical lens-barrel that holds the lens.
Such a compact image pickup module generally uses a CCD holder having a through hole and is assembled by fixing a CCD sensor to one end of the through hole, accommodating a lens-barrel holding an imaging lens from the other end of the through hole, and fixing the lens-barrel.
More specifically, as is well known, screw threads are cut into the inner wall surface of the CCD holder and the outer wall surface of the lens-barrel and are caused to mesh with each other. Then, focus adjustment (focusing) is performed by adjusting a distance between the light receiving surface of the CCD sensor and the imaging lens through adjustment of the screw-in amount of the lens-barrel. After the focus adjustment is performed, the CCD holder and the lens-barrel are fixed to each other using an adhesive or the like when the compact image pickup module is a fixed focus module.
Also, as a result of technological advancement in recent years, the image pickup element, such as the CCD sensor, has a highly reduced size and increased resolution. Therefore, the imaging lens (lens unit) applied to the compact image pickup module is also required to have resolving power with which it is possible to separate thin lines at a level of 150 to 200 [lp/mm] from each other. That is, an imaging lens having such high resolving power needs to be used as the imaging lens.
It is difficult to realize an imaging lens (lens unit) having such resolving power using a single lens. Therefore, an imaging lens (lens unit) having intended resolving power or precision is ordinarily realized using a combination lens obtained by combining multiple lenses with each other.
As schematically shown in FIG. 11, such an imaging lens (lens unit) produced by combining multiple lenses with each other ordinarily uses lenses 100 (100a, 100b, and 100c) having mutually different outer diameters and a lens-barrel 102 obtained by forming a lens holding portion, whose size is changed stepwise so as to correspond to the respective lens diameters, and is constructed by incorporating the lenses into the lens-barrel 102 in the order of the lens 100c, the lens 100b, and the lens 100a in accordance with the lens diameters and fixing the lenses 100 to the lens-barrel (see, for example, JP 2002-82272 A).
As a matter of course, in order to obtain a high-quality photography image, it is required that the imaging lens is fixed so that the optical axis of the imaging lens, that is, the lens-barrel is not inclined with respect to the light receiving surface of the CCD sensor.
When the optical axis is inclined, an imaging surface is also of course inclined, so a photographed image is not appropriately formed on the light receiving surface of the CCD sensor and image quality is degraded.
As described above, however, in the conventional compact image pickup module, the screw threads of the lens-barrel and the CCD holder are caused to mesh with each other, focus adjustment is performed by adjusting the screw-in amount, and then the lens-barrel and the CCD holder are fixed to each other. With this construction, gaps inevitably exist between the screw threads, so the lens-barrel is inclined and the optical axis of the imaging lens is inclined.
As described above, the CCD sensor has a highly reduced size and increased resolution due to the recent technological advancement and therefore an imaging lens having high resolving power, with which it is possible to separate thin lines at a level of 150 to 200 [lp/mm] from each other, is used as the imaging lens applied to the compact image pickup module. Therefore, when the optical axis is inclined, even if the degree of the inclination is small, there occurs extremely significant image quality degradation.
Also, in recent years, there are many cases where a compact image pickup module installed in a mobile telephone has a so-called macro photographing function that enables photographing in a close range or photographing of a small object by changing a photographing distance through movement of an imaging lens from an ordinary position toward the front (toward a subject).
In general, however, many components are used to realize the macro function (for instance, multiple springs are required) and the macro function also has a complicated structure, so a compact image pickup module where the macro photographing function is realized using a simpler construction is desired.
Further, in a like manner, as a matter of course, in order to obtain high-quality photography images with stability, it is required that positioning of the CCD sensor has been performed so that the optical axis of the imaging lens and the center of the light receiving portion (light receiving surface) of the CCD sensor appropriately coincide with each other.
In the compact image pickup module, for instance, the CCD sensor is incorporated into the CCD holder by performing rough positioning in a direction (hereinafter referred to as "x-y direction") orthogonal to the optical axis of the imaging leans through abutment of an end portion of the CCD sensor in the x-y direction against a reference portion provided for a sensor holding portion formed for the CCD holder.
Here, generally, accuracy in positional relation between the outer surface and the light receiving portion of the CCD sensor is in no way high. Consequently, when the positioning of the CCD sensor in the x-y direction is performed in the manner described above, it is impossible to perform the positioning of the CCD sensor in the x-y direction accurately so that the optical axis of the imaging lens and the center of the light receiving portion coincide with each other.
Therefore, in course of manufacture of the compact image pickup module, after the rough positioning in the x-y direction is performed using the outer surface in the manner described above, fine positioning in the x-y direction is performed so that the optical axis of the imaging lens and the center of the light receiving portion of the CCD sensor coincide with each other by taking a reference image and adjusting the positions of the lens-barrel and the CCD sensor while viewing an image obtained through the photographing. Following this, the CCD sensor is fixed to the CCD holder using an adhesive or the like.
Such CCD sensor incorporation work takes a very long time and is a factor of a reduction in productivity of the compact image pickup module and an increase in manufacturing cost thereof. In addition, with such positional adjustment in the x-y direction based on images obtained through photographing, there is also a case where stable manufacture of products of appropriate quality where the optical axes of imaging lenses and the centers of light receiving surfaces of CCD sensors coincide with each other becomes impossible depending on the skill of an operator, the precision of an adjustment jig, or the like.
Further, in a like manner, as a matter of course, in order to obtain a high-quality photography image, it is required that the optical axes of the lenses 100 incorporated into the lens-barrel 102 appropriately coincide with each other. In particular, in the compact image pickup unit, the imaging lens is required to have high resolving power as described above. Therefore, when displacements (hereinafter referred to as "inter-lens eccentricity") between the optical axes of the lenses 100 occur, even if the degrees of the displacements are small, there occurs extremely significant image quality degradation.
Between the lens-barrel 102 and the lenses 100, however, gaps (clearances) for incorporating the lenses 100 into the lens-barrel 102 exist, so the incorporated lenses 100 move in the lens-barrel 102 and the inter-lens eccentricity occurs.

Lens unit and compact image pickup module


A turbomachine with at least one rotor (6), no or at least one stator (7), and a casing (1), with the rotor (6) comprising several rotor blades (8) attached to a rotating shaft, and with the stator (7) being provided with stationary stator blades (9). The casing (1) is passed by a fluid flowing through rotor (6) and stator (7), and means for the supply of fluid are provided on at least one blade (8, 9) of a blade row of the rotor (6) and/or the stator (7) on aerodynamically critical locations on trailing edge and rim-near surfaces (HRO).

The present invention relates to turbomachines, such as blowers, compressors, pumps and fans of the axial, semi-axial and radial type. The working medium may be gaseous or liquid.
More particularly, this invention relates to a turbomachine with at least one rotor, with the rotor comprising several rotor blades attached to a rotating shaft. At least one stator can exist, with the stator being provided with stationary stator blades. A casing can exist which confines the passage of fluid through the rotor and the stator in the outward direction.
The aerodynamic loadability and the efficiency of turbomachines, for example blowers, compressors, pumps and fans, is limited by the growth and the separation of boundary layers on the blades as well as on the hub and casing walls.
The state of the art only partly provides solution to this fundamental problem. While various concepts for the fluid supply on turbine blades exist, these are not transferable to turbomachines since they primarily serve for surface cooling, not for boundary layer energization. Concepts are known from compressor cascade experiments in which air is blown out from a pressurized chamber inside the blade to the blade suction side to energize the two-dimensional profile boundary layer. Related alternative solutions provide for direct passage of the fluid from the blade pressure side to the blade suction side. Additionally, for rotors, a concept exists for the supply of air on hub and casing via axially symmetrical slots to influence the wall boundary layers there. Finally, publications of research institutes exist showing concepts in which rotors are blown at by individual nozzles near the casing to favorably influence the radial gap flow there. Accordingly, the general concept of influencing the boundary layer by blowing in or supplying fluid is provided in the state of the start, but the known solutions are trivial and only partly effective.
FIG. 1 schematically shows the solutions known from the state of the art. The figure schematically shows a hub 11 and a casing 1 between which a fluid flow passes from the left-hand side, as indicated by the big arrow. Also shown is a blade 2, belonging either to a rotor 6 or a stator 5, with the visible area of this blade being the suction side. As indicated by the arrows, drafts exist for a local air supply at different points of the turbomachine. In the case of rotor and stator blading, as well as plane experimental blade cascades, it is known to blow in fluid on the blade suction side between the leading edge and approximately 60 percent of the profile depth via slots 4 to influence the two-dimensional profile boundary layer. Here, the necessary fluid enters the main flow path from a pressurized cavity inside the blade 2. In alternative solutions, the blade profile is divided to enable fluid to be supplied by direct passage from the blade pressure side to the blade suction side.
In the case of a rotor, it is known to supply fluid on the hub 11 and/or the casing 1 before or within the area of the forward 50 percent of the profile depth via an axially symmetrical slot 3 to influence the boundary layer on the wall. Additionally, for rotors with radial gap of the casing, concepts exist according to which fluid is locally blown in on the casing via a number of nozzles 3 protruding into the flow path to influence the gap flow of the rotor at discrete locations on the circumference.
Only one solution, which is not described herein, provides for removal on the blade suction side and reflow on another location of the same blade, viz. the blade tip.
Accordingly, the state of the art describes the following methods of fluid supply:    1.) by straight slots in the forward and middle area of the blade suction side on rotors and stators,    2.) by axially symmetrical, areally flush slots in hub and/or casing far before the blade trailing edge on rotors with radial gap of the casing,    3.) by a number of circumferentially distributed, protruding individual nozzles on the casing before rotors with radial gap of the casing.
Most of these concepts either are only partially geared to aerodynamically particularly problematic zones within the blade passage or are simply orientated to a two-dimensional profile envelopment, without considering the complex, three-dimensional aerodynamic processes in the side wall area (near the hub and the casing). Others are only of limited effectiveness, although they are geared to locally critical flow zones.
Usually, in the state of the art, auxiliary air with higher pressure is externally supplied. Only one Patent Specification provides for air supply via slots on a further downstream location of the turbomachine.
The above described state of the art is documented in writing in the following publications:
U.S. Pat. No. 5,690,473 (Turbine blade having transpiration strip cooling and method of manufacture)
U.S. Pat. No. 6,334,753 (Streamlined bodies with counter-flow fluid injection)
U.S. Pat. No. 2,870,957 (Compressors)
U.S. Pat. No. 2,933,238 (Axial flow compressors incorporating boundary layer control)
U.S. Pat. No. 5,480,284 (Self bleeding rotor blade)
In the state of the art, it is disadvantageous that the existing solutions are not highly effective and, in particular, are unfavorable with regard to the efficiency of the turbomachinery. Rather, the existing blow-in concepts are relatively primitive and provide for blowing-in fluid either on the blade suction side only or in combination with blowing-in fluid before or within the blade row via axially symmetric annular slots on the hub and/or the casing. Apparently, there is a lack of concepts for specifically influencing the flow in the rim-near area and for influencing the airfoil boundary layers in a radially variable way (in the direction of the blade height). A non-axially symmetrical fluid supply on the side walls before or within the bladed region or also on blade tips in the running gap is not taken into consideration, although it is particularly advisable to have influence on the side wall boundary layers at the problem origin. Specifically influencing the three-dimensional flow processes in the area of the blade ends (and the associated flow exchange in the direction of the blade height) is not taken into account in the existing concepts.


A stator coil includes a coil portion wound around a stator core and a terminal board serving as a bus bar array board. The coil portion is arranged by sequentially connected segment conductors. The terminal board is a molded ring plate member disposed adjacently to a head coil end of the coil portion in the axial direction and elongated in the radial direction. The turn number of the stator coil is easily adjustable by selecting an optimum one of a plurality of terminal boards.

The present invention relates to a stator coil including sequentially connected segment conductors preferably applicable to an electric rotary machine.
From the view point of providing compact automotive electric rotary machines and increasing the output of these machines, a stator coil including sequentially connected segment conductors is preferably employed for an electric rotary machine because this stator coil can reduce the size of the coil end (refer to the Japanese patent No. 3118837 or the Japanese patent application laid-open No. 2002-58189).
For example, the Japanese patent No. 3118837 discloses a U-shaped segment (i.e. a rectangular conductor wire covered with insulating film, which is referred to as a segment conductor in the following description) having a pair of leg portions individually inserted into a pair of slots of a rotor mutually spaced at substantially one magnetic pole pitch, with both end portions protruding out of the rotor and being bent substantially in the circumferential direction. The front ends of the leg portions of respective segments are sequentially connected to arrange a stator coil consisting of sequentially connected segment conductors. Accordingly, the head portions of respective segment conductors cooperatively form a head coil end of the stator coil. The end portions of respective segment conductors protruding from the slots cooperatively form a tail coil end of the stator coil.
However, this kind of segment sequentially connected electric rotary machine requires a special or dedicated facility for forming the stator coil. Usually, the stator coil is differentiated according to the type of automotive vehicle and the purpose of its use. Thus, preparing a special or dedicated facility for each vehicle type is disadvantageous and not practical. To solve this problem, the Japanese patent application laid-open No. 2002-58189 proposes changing the wire connection method of the segment sequentially connected stator coil to change the serial turn number of the stator coil.
However, if the above method is employed for a high voltage, high output automotive driving generator motor, the bus bar arrangement for changing the wire connection will become very complicated and accordingly the work will not be easy.

Stator coil including sequentially connected segment conductors preferably applicable to an electric rotary machine


In a digital recording device, image data recorded in a recording portion has its resolution decreased to be recorded in the recording portion when it is determined that the digital recording device is not being used. In other words, when it is determined that a power switch is turned off, a system portion allows an MPEG decoder to convert a bit stream of a program data at high definition recorded in a hard disk drive to image data at low resolution and allows an MPEG encoder to convert the converted image data at low resolution to a bit stream to be stored in the hard disk drive.

1. Field of the Invention
The present invention relates to a digital recording device and a recording method, and more particularly to a digital recording device converting recorded data at high definition to standard definition and a recording method therefor.
2. Description of the Background Art
A device of interest to the present invention that converts an encoding scheme of an image is disclosed for example in Japanese Patent Laying-Open No. 2001-128170. This publication discloses a configuration for encoding an image with a converted resolution to output a bit stream.
Japanese Patent Laying-Open No. 11-331613 discloses a configuration for converting a resolution of a high-definition image signal for output as a standard-definition image signal.
The conventional resolution-converting devices have been configured as described above. A high-definition image signal has been converted to a standard-definition image signal, and the image signal having a converted resolution has been encoded and stored or transmitted for display in the form of a bit stream.
In the convention resolution-conversion, however, no consideration is given to a resolution-conversion for that image data which has once been recorded. Therefore where image data recorded in a recording portion has a high definition, the data volume thereof is so large that a heavy load is imposed on the recording portion.

Digital recording device capable of converting and recording resolution of image data of digital television broadcast and recording method therefor


A design tool for printed circuit boards displays a graphical representation of a printed circuit board layout through a graphical user interface (GUI). Comments for particular components of the printed circuit board layout can be entered through the graphical user interface. The comments are stored in a data file associated with the printed circuit board layout. Comments can be entered and viewed by multiple users in real time. Comments can be displayed through the graphical user interface in proximity to the component associated with the comment, thereby improving the efficiency with which designers can review and implement suggested changes to the PCB layout.

As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option is an information handling system. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes. Because technology and information handling needs and requirements may vary between different applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
Printed circuit boards (PCBs) are used in many information handling systems and other electronic devices. The layout of a PCB is designed so that the PCB can fit within the physical dimensions of the electronic device and also so that the PCB can perform its designed functions. Frequently multiple designers are involved in design of the PCB layout. Layout design software tools can be employed by each designer to propose the layout for a portion of the PCB board. A design review process is typically employed to ensure that conflicts between proposed layouts are resolved. Typically, the design review process involves review of text-based spreadsheet feedback or of paintbrush type markups. This review is cumbersome and prone to errors, as development engineers typically manually interpret and communicate feedback comments to ensure that they are implemented. These problems can be exacerbated when designers of the PCB board are geographically remote from each other. Accordingly, there is a need in the art for an improved technique for circuit board design.


When a wafer is pressed on a rotating polishing pad and its surface is polished, a retainer retains the periphery of the wafer to prevent the wafer from being detached from the polishing pad. The retainer includes a first ring which surrounds the wafer and contacts the polishing pad and a second ring which is provided outside the first ring in the radial direction of the wafer and contacts the polishing pad. The second ring has wear resistance that is higher than that of the first ring.

1. Field of the Invention
The present invention relates to a wafer polishing apparatus for polishing the surface of a wafer and, more particularly, to the structure of a retainer for retaining the periphery of a wafer.
2. Description of the Related Art
A wafer manufacturing process includes a polishing step of mirror-finishing the surface of a wafer. In this polishing step, a wafer polishing apparatus is used to polish the surface of a wafer by pressing the wafer on the surface of a polishing pad that is rotating.
The wafer polishing apparatus has a polishing table that is rotated by a drive shaft. A polishing pad is provided on the top surface of the polishing table, and a wafer retaining head for retaining and rotating a wafer is provided on the top surface of the polishing pad.
The wafer retaining head has an up-and-down driving mechanism and allows the retained wafer to be pressed on the surface of the polishing pad at a desired contact pressure. The surface of the wafer pressed on the polishing pad is polished and mirror-finished by friction with the polishing pad.
A great force is exerted on a wafer under polishing toward the outer radius of the wafer retaining head by friction with the polishing pad that is rotating. A retainer is therefore disposed on the outer region of the underside of the wafer retaining head to retain the periphery of a rotating wafer, thereby preventing the wafer from jumping out of the underside of the wafer retaining head.
The polishing pad is usually formed of viscoelastic materials. The viscoelastic materials have a viscous region whose stress is proportionate to the speed of deformation. As shown in FIG. 8, therefore, a great pressure is exerted on the periphery of a wafer W due to the compression and deformation of the polishing pad 101 when a (non-compressed) portion of the polishing pad 101, which is located ahead of the wafer W in its moving direction, goes under the wafer W. This causes a problem of a so-called outer sag in which the periphery of the wafer W is polished more than the central part thereof, as illustrated in FIG. 10.
In order to resolve the above problem, recently, the polishing pad 101 that is located ahead of the wafer W in its moving direction has been compressed in advance by pressing the retainer 102 on the polishing pad 101, as shown in FIG. 9. When the polishing pad 101 goes under the wafer W, no great pressure is exerted on the periphery of the wafer W; therefore, an outer sag can be prevented from occurring on the wafer W.
FIG. 11 shows the structure of a wafer retaining head 103 corresponding to the above-described wafer retaining head.
In the wafer retaining head 103, the wafer W and retainer 102 are brought into contact with the polishing pad 101 by applying the load of one press platen 104 to the wafer W and retainer 102. This structure can simplify the structure of the wafer polishing apparatus, whereas it causes the following problem. Due to the friction between the polishing pad 101 and the underside of the retainer 102, no desired load can be applied to the polishing pad 101 as time elapses.
When the load of the retainer 102 on the polishing pad 101 lowers, the polishing pad 101 on the underside of the retainer 102 increases in thickness, thereby causing a difference in thickness between the polishing pad 101 on the underside of the retainer 102 and the polishing pad 101 on the underside of the wafer W. The stress due to the compression and deformation of the polishing pad 101 is therefore likely to cause an outer sag on the periphery of the wafer W.
In order to resolve the above problem, a wafer retaining head 105 is used to control the load applied to the wafer W and the load applied to the retainer 102 independently of each other. The structure of the wafer retaining head 105 is shown in FIG. 12.
With the structure shown in FIG. 12, the polishing pad 101 can always be pressed by the same load even though the retainer 102 is worn out by friction between the retainer 102 and the polishing pad 101. Since, however, the retainer 102 plays a role in retaining the periphery of the wafer W as described above, the retainer 102 needs to be disposed close to the outer circumference of the wafer W. Since the retainer 102 presses the polishing pad 101, a prominence 110 arising from the polishing pad 101 is likely to interfere with the periphery of the wafer W and cause an outer sag.
In order to resolve the above problem, another wafer retaining head 108 is developed in which a groove 107 is formed at the inner radius of the retainer 102 to escape the prominence 110 and a portion of the retainer 102 which presses the polishing pad 101 and another portion thereof which retains the wafer W are separated from each other (disclosed in, e.g., Jpn. Pat. Appln. KOKAI Publication No. 2002-18709). The structure of the wafer retaining head 108 is shown in FIG. 13.
Since the wafer retaining head 108 can control the load applied to the wafer W and the load applied to the retainer 102 independently of each other, it can always press the polishing pad 101 at a constant force. Moreover, the prominence 110 that is formed at the inner radius of the retainer 102 does not interfere with the periphery of the wafer W and thus no outer sag occurs.
In the wafer retaining head 108, however, the contact portion of the retainer 102 with the polishing pad 101 is gradually worn out by friction. Consequently, the groove 107 is gradually shallowed and finally vanished.
As a result, the entire underside of the retainer 102 presses the polishing pad 101, and the prominence 110 that is formed at the inner radius of the retainer 102 causes an outer sag on the periphery of the wafer W.


An apparatus and method are provided for capturing and containing SF6 gas leakage from a gas enclosure. The apparatus includes a portage flexible gas storage container of material which is substantially impermeable to SF6 gas. The container includes a gas inlet which is adapted to be coupled in a sealable manner to a surface surrounding a leakage source thereby capturing the SF6 gas in the container. The container inflates under pressure from the captured gas in order to accommodate up to a predetermined capacity of SF6 gas. The apparatus can be adapted to act as a container for transporting SF6 gas from a gas source to an enclosure.

There are a number of industries wherein equipment is required to operate in an atmosphere of sulphur hexafluoride (SF6) gas. One particular industry is the electrical supply industry. SF6 has very low electric conductivity characteristics and so lends itself as being a highly suitable insulating gas for high voltage equipment, for example, electric circuit breakers and transformers.
However, SF6 has serious environmental concerns with respect to its potential contribution to the greenhouse effect if released to the atmosphere. Furthermore, SF6 is an expensive gas to replace if lost to the atmosphere through leakage and, hence, the chance to reclaim it.
For some large indoor installations, measures have been employed to deal with preventing the spread of leaked gas. These measures involve environmental control to confine the spread of gas within a zone surrounding the equipment and means for sealing the zone and containing the gas therein. Such measures are extremely costly to implement and have no application for outdoor installations.
It is an object of the present invention to provide a cost effective alternative for capturing and containing SF6 gas leakage, which can be employed in any installation.

Apparatus and method for capturing and containing sulphur hexafluoride gas leakage


Telecommunication systems including a terminal, a switch and on Internet/Intranet having a memory for storing information blocks at locations defined by addresses, can be made more user-friendly by introducing a detector for detecting speech-recognition/non-speech recognition related parts in control signals originating from the terminal and defining the addresses or n response signals sent from memory to terminal and including said information blocks. A processor is coupled to the detector for routing, in dependence on the detection, routing (parts of) the signals to a server for either conversion of (parts of) the signals or for information purposes.

The invention relates to a telecommunication system comprising a terminal, a switch and at least a part of an I-net comprising a memory for storing I-net information blocks at locations defined by I-net addresses, with at least parts of said I-net addresses being generated in response to control signals originating from said terminal, and with at least parts of said I-net information blocks being sent from said memory to said terminal in the form of response signals.
Such a telecommunication system is known in the form of a telecommunication network for fixed and/or mobile communication, with said terminal being a fixed (PSTN, ISDN etc.) terminal (telephone, screenphone, pc etc.) or a wireless (cordless: DECT etc.) or mobile (GSM, UMTS etc.) terminal (wireless handset etc.), and with said I-net being an Internet and/or Intranet. Said I-net information blocks (HTML pages, web pages, WAP pages etc.) are stored at locations defined by I-net addresses (directly by Internet Protocol—IP—addresses, indirectly by Uniform Resource Locators—URLs—etc.) to be generated in response to control signals originating from said terminal and for example generated by pressing one or more keys and/or clicking on a mouse. As a result, said response signals comprising said I-net information blocks are sent from said memory to said terminal.
Such a telecommunication system is disadvantageous, inter alia, due to being user-friendly insufficiently.

Telecommunication system, and switch, and server, and method


There is provided a strip casting method using a twin roll strip casting process in which molten steel is supplied through an injection nozzle to a region between twin rolls rotating in opposite directions to produce a strip having a predetermined thickness and a high degree of edge quality. The twin roll strip casting method includes: performing the casting process by setting a casting thickness to have a minimal value during an early stage of the casting process in which edge bulging occurs; and performing the casting process by increasing the casting thickness to a maximum value after the molten steel reaches a pre-set target temperature as the casting process proceeds.

The present disclosure relates to a twin roll strip casting method, and more particularly, to a twin roll strip casting method for producing strips having a high degree of edge quality.
In general, strips are produced as follows. A slab is produced from molten steel through a continuous casting process, and the slab is formed as a hot-rolled coil through a reheating and hot-rolling process. The hot-rolled coil undergoes hot band annealing and pickling in a hot annealing & pickling line, and then the hot-rolled coil is formed as a final product through a cold rolling process.
The above-mentioned continuous casting method is complex because casting and rolling processes are performed separately. In addition, since reheating slab is necessary to allow the rolling process to be performed after the casting process, a large amount of energy is consumed, and thus the continuous casting method is not favored in terms of economical and environmental aspects. In order to overcome demerits of the continuous casting method, a twin roll strip casting method in which a thin steel sheet (strip) is produced directly using twin rolls has been developed.
FIG. 1 is a schematic view illustrating a twin roll strip casting process of the related art.
In a twin roll strip casting method of the related art, as shown in FIG. 1, a pair of internal water-cooled rolls 110 are rapidly rotated in mutually engaging directions, and while molten steel 130 is supplied to a region between the rolls 110 through an injection nozzle 120, a strip 140 having a thickness of 10 mm or less is drawn out therefrom.
When strips are produced by such a twin roll strip casting method, defects such as edge bulges or edge cracks may be formed. Edge bulges make it difficult to perform a hot rolling process and cause edge cracks or shape errors during a rolling process, thereby decreasing the process yield.
If 200 mm to 300 mm wide edge regions of a strip are relatively hot, as compared to the other regions of the strip, due to an edge region solidification delay phenomenon, the thickness of the strip may be locally increased (to about 50 mm) in the edge regions, or the strip may be torn. This is a phenomenon is known as "edge bulging." The edge region solidification delay phenomenon may be considered to be a characteristic of a twin roll strip casting process. When shells undergo solidification and shrinkage, if edge regions of the shells that are relatively free, as compared to center regions of the shells, are separated from casting rolls, edge region solidification delay may occur due to a relatively poor heat transfer rate in the separated edge regions. If the edge region solidification delay occurs severely, edge bulging may occur. In this case, the edge regions may crack or molten steel may leak during a casting process. Furthermore, during a rolling process, a reduction ratio may be varied in the width of a strip as the edge regions may be relatively thick or hot. Therefore, the shape of the strip may be deformed, or due to poor rolling conditions caused by edge waves, cracks may be formed, thereby lowering the process yield.


Overhead transport system for the selective drawing of garment lots, making use of a box-shaped support rail (1) on which the garment hanger books (G) are hanging, inside which liftable tracks (5) are provided, through which a closed circuit chain (7) is guided. The chain being able to seize and draw the said hooks when the said liftable tracks are selectively push upwards due to to the inflation of corresponding rubber tubes (4).

It is generally known that overhead transport systems able to move forward garments hung on hangers have been used for some time; accordingly, these systems basically have the capacity of handling and drawing the hooks of the above-mentioned hangers.
However, these systems are not only used to make the garments move forward one by one; they also more and more often perform the function of sorting these garments in a predetermined order, thanks to their capacity of automatically creating selective garment lots and automatically unloading the subsequent lots that have just been created.
More particularly, the creation of the said lots is made possible by systems equipped with a rotating threaded rail, in a horizontal position, on which appropriate switch devices gradually unload the garments (hung on their hangers) for the purpose of forming every separate lot.
In this case, the hanger hooks that are supported by the said threaded rail are moved forward, precisely thanks to the rotatory motion of the rail, towards the unloading station; in this context, it is obvious that theoretically, every single hanger supported by the rail should rapidly be conveyed towards the unloading station.
Yet considering the fact that the purpose of such a system is to create garment lots (and only afterwards to perform the contemporaneous unloading of each lot), it is easy to understand why the said threaded rail is supplied with a lever which, as long as the garments are accumulating in order to form a lot, is in such a position as to interfere with the hanger hooks, obstructing their forward movement towards the unloading station.
More particularly, this lever which, when in its operational position, is placed very near the said rotating rail, has the function of intercepting the lot's first garment's hanger hook; this first hanger is therefore not only unable to move forwards (although the threaded rail is still rotating), but it naturally also holds up all the hangers of the same lot's subsequent garments that, drawn forward by the rail itself, end up by accumulating tightly behind the first hanger.
Logically, as soon as the required lot formation is complete, the above-mentioned stop lever is removed, so that the whole lot can rapidly be conveyed to the unloading station.
In this connection, it is important to note that the necessity of using the said hook stop lever is linked to the fact that the threaded rail rotation can never be stopped, as it permanently performs a twofold function: on one hand it brings together the separate garments that will then be part of the same lot, and on the other hand it unloads a lot that has been created, while another lot is simultaneously being created behind the stop lever.
In other versions of these traditional transport and sorting systems, the feature that enables the hangers to move forward and therefore the lots to be formed, in collaboration with the same stop lever, consists of a closed circuit chain which is in any case capable of making the hanger hooks which it supports continuously move forward.
However, in both the versions described above, these traditional systems are disadvantaged by some considerable drawbacks with negative effects that appear precisely when the subsequent lots are being formed, in other words when the said hanger hook stop lever is in operational position.
Indeed, the gradually increasing number of hangers that accumulate behind the said stop lever—as a consequence of the drawing action due to the threaded rail or, alternatively, to the closed circuit chain—provokes an increasing resistance which is detrimental to the rotation of the threaded rail itself or to the forward closed circuit motion of the chain itself.
All this means a particularly important stress is put on the devices that are in charge of the rail rotation or the chain forward motion which, in order to take this stress without any risk, must possibly be of a much bigger size than necessary.
Furthermore, this considerable stress put on the said systems naturally also requires a significant consumption of energy, particularly around those "peak" times that occur when the resistance to the forward motion of the systems themselves turns out to be greater because of the substantial number of hangers tightly accumulated one against the other.

Overhead transport system able to activate the selective drawing of garment lots


An engine includes a catalyst disposed inside an exhaust passage that guides exhaust discharged from a combustion chamber and a controller programmed to control a throttle valve and a fuel injector. If the engine is overheating, the controller is programmed to control the opening degree of the throttle valve or the injection amount of fuel from the fuel injector to decrease the rotational speed of the crankshaft and to control the injection amount of fuel from the fuel injector to set a target air-fuel ratio to a value richer than a stoichiometric air-fuel ratio.

1. Field of the Invention
The present invention relates to an engine including a catalyst that purifies exhaust and to an outboard motor powered by the engine.
2. Description of the Related Art
With a vessel, even if engine overheating occurs, the engine is not stopped and the operation of the engine is continued in a state of restricted engine speed to return the vessel to port. With the outboard motor disclosed in Japanese Unexamined Patent Publication No. H11-72040, the engine speed is decreased by misfiring when the engine overheats. With the outboard motor described in U.S. Patent Application Publication No. 2002/0088429 A1, the engine speed is decreased by at least one of misfiring and stopping the fuel supply when the engine overheats.
When the engine output is decreased to decrease the engine speed, the amount of heat generated by the engine decreases and, therefore, the temperature rise rate of the engine decreases gradually and the temperature of the engine begins to decrease. However, as shall be described below, if the amount of heat generated by the engine is large, the temperature of the engine continues to rise even when the engine speed is decreased.
For example, with an engine that includes a catalyst, not only combustion heat but heat due to reaction of the catalyst and exhaust is also generated. Further with the engine that includes the catalyst, an air-fuel ratio (A/F) of an air-fuel mixture is set at a stoichiometric air-fuel ratio (air-fuel ratio at which the oxygen and the fuel in the air-fuel mixture react in just proportions) in many operation conditions and, therefore, the temperature of the exhaust is high. There is thus a possibility that the temperature rise rate of the engine cannot be decreased rapidly by simply decreasing the engine speed. Further with the conventional outboard motors mentioned above, exhaust containing uncombusted fuel is discharged from the combustion chamber because the engine speed is decreased by misfiring. Therefore, if a catalyst is installed in the engine, the exhaust containing the uncombusted fuel contacts the catalyst and accelerates the degradation of the catalyst.


A component includes a substrate that has outer and inner surfaces. The inner surface defines at least one hollow, interior space. The outer surface defines pressure and suction sidewalls that are joined together at leading and trailing edges of the component and together form an airfoil portion of the component. The outer substrate surface further defines at least one platform and at least one fillet that extends between and integrally connects the airfoil to the respective platform. The outer surface defines one or more grooves that extend at least partially along a respective fillet. Each groove is in fluid communication with a respective hollow, interior space. The component further includes a coating disposed over at least a portion of the outer substrate surface and including at least a structural coating that extends over the groove(s). The groove(s) and the structural coating together define channel(s) for cooling the respective fillet.

The invention relates generally to gas turbine engines, and, more specifically, to micro-channel cooling therein.
In a gas turbine engine, air is pressurized in a compressor and mixed with fuel in a combustor for generating hot combustion gases. Energy is extracted from the gases in a high pressure turbine (HPT), which powers the compressor, and in a low pressure turbine (LPT), which powers a fan in a turbofan aircraft engine application, or powers an external shaft for marine and industrial applications.
Engine efficiency increases with temperature of combustion gases. However, the combustion gases heat the various components along their flowpath, which in turn requires cooling thereof to achieve a long engine lifetime. Typically, the hot gas path components are cooled by bleeding air from the compressor. This cooling process reduces engine efficiency, as the bled air is not used in the combustion process.
Gas turbine engine cooling art is mature and includes numerous patents for various aspects of cooling circuits and features in the various hot gas path components. For example, the combustor includes radially outer and inner liners, which require cooling during operation. Turbine nozzles include hollow vanes supported between outer and inner bands, which also require cooling. Turbine rotor blades are hollow and typically include cooling circuits therein, with the blades being surrounded by turbine shrouds, which also require cooling. The hot combustion gases are discharged through an exhaust which may also be lined, and suitably cooled.
In all of these exemplary gas turbine engine components, thin walls of high strength superalloy metals are typically used to reduce component weight and minimize the need for cooling thereof. Various cooling circuits and features are tailored for these individual components in their corresponding environments in the engine. For example, a series of internal cooling passages, or serpentines, may be formed in a hot gas path component. A cooling fluid may be provided to the serpentines from a plenum, and the cooling fluid may flow through the passages, cooling the hot gas path component substrate and any associated coatings. However, this cooling strategy typically results in comparatively low heat transfer rates and non-uniform component temperature profiles.
For example, the conventional design for cooling of turbine airfoils and endwalls/platforms utilizes investment cast cooling passages in the airfoil and platform. Because the cooling medium is on the opposite side of the cast wall thickness from the heat source (hot gas), there is a substantial thermal resistance and a large thermal gradient and stress through the fillets. Thus, it is convention that the fillets are made as small as feasible to decrease thermal issues, while also satisfying load requirements. (The fillets require thicker walls to carry the load of the blades in rotation.) Thus, the thermal requirements are at odds with the load requirements for the fillets, for conventionally cooled hot gas path components.
It would therefore be desirable to provide improved cooling of the fillets for hot gas path components.

Components with microchannel cooled platforms and fillets and methods of manufacture


A medical syringe for collecting blood samples is provided, comprising a cylindrical body having an open end and a closed end. A plunger assembly including a piston is slidably inserted into the open end, defining a fluid chamber between the piston face and the closed end. A distal opening in the closed end provides passage between the syringe and a patient, and includes a restriction therein. A conduit extends from the fluid chamber through the plunger assembly to a tube-holding device, or may extend peripherally from the cylindrical body to the tube-holding device. Fluid is drawn into the fluid chamber, and a vacuum specimen tube is inserted into the tube-holding device, the vacuum drawing fluid into the tube. The restriction in the distal opening imposes a viscous resistance to flow, slowing blood flow into the syringe, preferentially drawing fluid into the specimen tube from the fluid chamber, and decelerating movement of the plunger assembly. Alternatively a cannula extends between the distal opening and the conduit, the restriction substantially isolating a fluid sample in the fluid chamber from a sample drawn through the cannula.

Many conventional devices are available for obtaining blood samples from a patient for laboratory testing. For example, a conventional syringe and a hypodermic needle are often used as is well known to those skilled in the art.
When multiple samples are needed for laboratory tests, traditionally, a blood collection needle is used. Generally, such devices include a pair of needles disposed in line axially on a central hub or housing. These needles are generally provided in a tube-holding device, typically a hollow cylindrical body with open ends. The hub of the blood collection needle is generally attached to one end such that one needle extends into the cylindrical body, while the other needle extends axially beyond the end of the cylindrical body for percutaneous introduction into a patient.
Conventional vacuum specimen tubes are then inserted into the other end of the cylindrical body. The rubber stopper of the specimen tube is punctured by the needle inside the cylindrical body, creating a continuous passage from the percutaneous needle tip to the specimen tube. Thus, after the blood collection needle has been introduced into a patient, a series of specimen tubes may be inserted into the cylinder to collect separate samples for testing.
One of the problems related to the use of such traditional devices is hemolysis. When the specimen tube is inserted into the blood collection device, the fixed vacuum of the tube draws blood through the passage quickly. The uncontrolled flow of blood caused by the force of this vacuum often causes red blood cells to shear and break down. Potassium is released from the cells into the blood fluid, creating inaccuracies in the laboratory tests performed on the samples.
Additionally, such conventional devices present problems in obtaining samples from patients having poor peripheral access, such as young and elderly patients whose veins are smaller or more susceptible to collapse.
Attempts have been made to modify these conventional blood collection devices to respond to these problems. For example, U.S. Pat. No. 5,133,362, by Moss, discloses a blood collection needle which uses a smaller gauge needle for introduction into the patient than is used for the specimen tubes. The device uses such smaller gauge needles to provide improved peripheral access, while also slowing blood flow through the needle to reduce hemolysis. As will be shown below, however, this device fails to address the viscous effects of blood flow through the needles, which contributes substantially to hemolysis in the resulting blood samples.
Thus, there is a need for an apparatus for drawing blood from a patient which substantially reduces the risk of hemolysis as blood is drawn into vacuum specimen tubes.
There is also a need for an apparatus for drawing blood which provides improved introduction into patients having poor peripheral access without the associated higher likelihood of hemolysis.