A pyromechanical cutting element has a housing (2) in which an electrical conductor (3) is arranged, a cutting plunger (5) with a cutting tool (8) to cut through the electrical conductor (3), and pyrotechnic charge (13) to drive the cutting plunger (5), with the cutting tool (8) bending over the electrical conductor (3) after cutting through it and forming a bending tongue (18) that sticks out from the conductor (3) in a way that interrupts the conductor (3). The electrical conductor (3) has a cross-sectional area reduction in the longitudinal direction (4) consisting of two transverse sides and two longitudinal sides. The cutting tool (8) first cuts through the cross-sectional area reduction (4) just on one transverse side and upon further advancement bends over the longitudinal sides at least in part, and, upon further advancement, the cutting tool (8) clamps the bending tongue (18) thus created.

The invention relates to a pyromechanical cutting or separating element.
DE 197 32 650 A1 describes a pyromechanical cutting element having a housing, in which an electrical conductor is arranged, having a cutting plunger with a cutting tool to cut through the electrical conductor, and having a pyrotechnic charge to drive the cutting plunger, with the cutting tool bending the electrical conductor over after cutting through it and a bending tongue being formed thereby that sticks out from the conductor in a way that interrupts the conductor.
Such cutting elements can be used, for example, to interrupt the current supply to the on-board system of a motor vehicle. In the event of an accident, these cutting elements are triggered, as a result of which the current supply is interrupted and the risk of fire is thereby reduced.


A semiconductor device includes a through electrode vertically passing through the semiconductor device; a metal pad electrically coupling the through electrode and an exterior; a data input block suitable for transferring a data signal to the metal pad in response to a write command; a through electrode storage block suitable for storing the data signal transferred through the metal pad; and a data output block suitable for outputting the data signal, which is stored in the through electrode storage block, to the exterior in response to a read command.

1. Field
Various embodiments of the present invention relate to a semiconductor device, and more particularly, to a semiconductor device including a through-silicon via (TSV).
2. Description of the Related Art
Packaging technologies for semiconductor integrated circuits have continuously been developed to satisfy the demand for miniaturization and mounting reliability. As demand for miniaturization and high performance of electronic appliances increases, various techniques for a stacked package have been developed. In order to improve semiconductor device integration, a three-dimensional (3D) semiconductor device having a plurality of chips stacked in a single package has been developed. Recently, a TSV type semiconductor device has been disclosed in which TSVs are formed to pass through a plurality of stacked chips to provide an electrical connection.
TSVs and through electrodes are formed on the semiconductor chip to transfer electrical signals. In most applications, the semiconductor device has a master chip positioned lowermost and a plurality of slave chips stacked on the master chip. The master chip interfaces with an external controller that controls the plurality of slave chips using the through electrodes. The master chip may transfer address signals for accessing the rows/columns and banks of the slave chips, data signals, various command signals, internal/external power, and so forth, through the through electrodes.
A failure test for each of the slave chips is performed by writing data into a core region having a plurality of memory cells and then reading the written data from the core region. However, the failure test for the master chip is performed by latching data using a latch circuit and then outputting the latched data. In detail, as a write command is applied, a data signal from an external source is stored in the latch circuit of the master chip. Thereafter, as a read command is applied, the data signal stored in the latch circuit is outputted to the exterior through the through electrode. During the read operation, because data is outputted through the through electrode, data is not likely to fully swing due to the capacitance of the through electrode, the low operating voltage, and the high speed operating conditions.

Semiconductor device having through-silicon via


A gasification system includes a scrubber in communication with a particulate removal subsystem and a quench sub-system.

The present disclosure relates generally to gasifiers for converting a carbonaceous feedstock, such as coal, biomass or petcoke, into a synthesis gas.
The gasification of coal and petcoke to synthesis gas (syngas), e.g. a gas mixture primarily comprised of hydrogen and carbon monoxide, is an effective industrial process used in the chemical and power industries. Gasification units produce a very fine slag and water soluble species (hydrochloric acid, among others) that must be scrubbed from the product syngas stream prior to use downstream. The processes to scrub the syngas may be relatively complex, energy intensive and expensive. Furthermore, the process generates relatively large quantities of wastewater with existing gasification technologies, as these do not offer a convenient, cost-effective way to separate the ash and water soluble species from the scrubber water.


Disclosed is a throttle device for an internal-combustion engine, in which, on one side of the side wall of a throttle body, there are formed a space for mounting a reduction gear mechanism which transmits the power from a motor to a throttle valve shaft and a default opening setting mechanism for holding a throttle valve opening at a specific opening (default opening) when the ignition switch is in off position, and a gear cover mounting frame which edges the mounting space. The frame is formed lower than the mounting level of the reduction gear mechanism. A gear cover for covering the gear mounting space is attached on the frame. A stopper for defining the default opening and a stopper for defining the full-closed position of the throttle valve are juxtaposed so as to enable position adjustments in the same direction. These stoppers serve to stop a default lever and a throttle gear, thereby enabling downsizing, weight reduction, and rationalization of fabrication and adjustments of an electronically controlled throttle device.

1. Field of the Invention
This invention relates to a throttle device for an internal-combustion engine and, more particularly, to an electronically controlled throttle device which controls the opening and closing operation of a throttle valve by driving an electric actuator according to a control signal.
2. Description of Related Art
In an electronically controlled throttle device which controls an engine throttle valve by driving an electric actuator (e.g., a D C motor and a stepping motor), there has been known such a technology that the amount of initial opening (default opening) of the throttle valve is set larger than a full-closed position when an ignition switch is in off position (in other words, when no current is being supplied to the electric actuator).
Here, the full-closed position of the throttle valve is not meant by a position in which the intake air passage is full-closed; especially in a throttle device having no bypass around the throttle valve and controlling the idling speed only by means of the throttle valve, the full-closed position is defined as a mechanically full-closed position and an electrically full-closed position which will be described below.
The mechanically full-closed position is the minimum opening position of the throttle valve defined by a stopper. The minimum opening is set at a position where the intake air passage is slightly opened from a full-closed position to thereby prevent the throttle valve from galling. The electrically full-closed position is the minimum opening position within the range of opening used in engine control, and is set, by the control of the electric actuator, at a position of a slightly wider opening than the mechanically full-closed position (e.g., about 1 deg. larger than the mechanically full-closed position).
In the electronically controlled throttle, the electrically full-closed position (the minimum opening for control) and the idle opening (an opening required for controlling the idle speed) do not necessarily agree. This is because the amount of opening of the throttle valve is controlled by a feed-back control system according to an idle speed detection signal in order to keep a target idle speed, and for this purpose the amount of opening is allowed to vary.
The full-open position has also a mechanically full-open position defined by the stopper and an electrically full-open position in which the throttle valve is opened to the maximum control amount of opening. The full-closed position stated herein includes the mechanically full-closed position and the electrically full-closed position as well. In normal control, the throttle valve is controlled within the range from the electrically full-closed position (the minimum opening for control) to the electrically full-open position (the maximum opening for control), so that a part of the throttle valve shaft will not hit on the stopper which determines the mechanically full-closed and full-open positions, when the throttle valve is being controlled to the minimum or maximum opening. Thus it becomes possible to protect the stopper and throttle components from mechanical fatigue, abrasion, and damage, and also to prevent galling to the stopper.
The default opening (i.e., the initial opening when the ignition switch is in off position) is set to the amount of opening of the throttle valve which is opened wider than the full-closed position (the mechanically full-closed position and the electrically full-closed position) (e.g., 4 to 13 deg. wider than the mechanically full-closed position).
The default opening is set from the reason for achieving the air flow rate necessary for fuel combustion for operation to be performed prior to engine warm-up at the time of engine starting (cold starting) without providing an auxiliary air passage (an air passage bypassing the throttle valve). During idling, the throttle valve is controlled towards decreasing the amount of opening from the default opening as the engine warm-up proceeds (in this case, however, the electrically full-closed position is the lower limit position).
Furthermore, the default opening is adopted to meet requirements for insuring self-running (limping home) in the event of a throttle control system trouble or insuring an intake air flow rate necessary for preventing an engine stop, and for preventing the throttle valve from being stuck with a viscous substance, ice, or other, on the inside wall of the throttle body.
As a conventional example of a default opening setting mechanism, various mechanisms have been proposed.
A known prior art has been stated in, for example, Japanese Laid-Open No. Sho 63-150449 Patent Publication, U.S. Pat. No. 4,947,815 specification, Japanese Translation of PCT Application No. Hei 2-500677 corresponding to the US patent, Japanese Laid Open No. Sho 62-82238 Patent Publication and its corresponding U.S. Pat. No. 4,735,179 specification, Japanese Laid-Open No. Hei 10-89096 Patent Publication, and Japanese Laid Open No. Hei 10-131771 Patent Publication.
There are various types of default opening setting mechanisms, a typical type of which for example is as follows.
One type is of such a system that a default opening setting engagement element (a default lever) which is fitted on the throttle valve to enable the rotation of the engagement element on the throttle valve shaft is engaged via a spring with an element secured on the throttle valve, thereby allowing the default lever to turn together with the throttle valve shaft between the range from the default opening position to the valve full-open position. When the ignition switch isin off position, the default lever is held in contact with the default stopper, to thereby hold the throttle valve opening at the default opening. To close the throttle valve to the default opening or less, the default lever is disengaged from the throttle valve shaft to allow the throttle valve shaft to rotate independently against a spring force towards closing the throttle valve.
Another type is of such a system that, reversely to the above-described system, the default lever and the throttle valve shaft are turned together from the throttle valve full-close position to the default opening position. When the ignition switch is off, the default lever is held in contact with the default stopper to hold the throttle valve opening at the default opening. When the throttle valve is opened over the throttle opening, the default lever is disengaged from the throttle valve shaft, to allow the throttle valve shaft to turn towards opening independently against the spring force.
The electronically controlled throttle device can perform more accurately the air flow rate control suitable for the operation of the internal-combustion engine than a mechanical throttle device which transmits the amount of depression of the accelerator pedal to the throttle valve shaft through an accelerator cable. The component count is increased to provide an electric actuator, a default opening setting mechanism, and a throttle sensor. Therefore, downsizing, weight reduction and simplification, rationalization of fabrication and adjustment jobs, and further improvement in operation stability and accuracy of the throttle body, are demanded.
To solve the above-described problem, therefore, it is an object of the invention to realize the downsizing, weight reduction and simplification of the throttle body equipped with an electric actuator, a gear mechanism and a default opening setting mechanism, the rationalization of fabrication and adjustment jobs, and further improvement in operation stability and accuracy.
This invention basically has the following constitution.
The first aspect of the invention pertains to the throttle device for an internal-combustion engine which is driven by an electric actuator to open and close the throttle valve to thereby control the amount of intake air aspirated by the internal-combustion engine. In the throttle device, there are formed, on one surface of the side wall of the throttle body, a reduction gear mechanism mounting space which transmits to the throttle valve shaft the power of the electric actuator, and a frame for mounting a gear cover formed to define the space for mounting the reduction gear mechanism. The frame is built lower than the mounting height of the gear mounted on one end of the throttle valve shaft. On the frame is attached the gear cover for covering reduction gear mechanism mounting space.
According to the above-described constitution, the reduction gear mechanism mounting space is covered with a gear cover, which covers most of the mounting space, in place of a gearcase and a gear cover mounted on the side wall of a conventional throttle body. In this sense, the gear cover plays a role of the gearcase. Unlike the conventional type, therefore, the throttle body itself is not needed to be formed integrally with a gearcase having a relatively large volume. A gear cover made of a synthetic resin should be increased in the volume; generally, therefore, it is possible to reduce the size and weight of the metal throttle body formed by mold casting.
The second aspect of the invention pertains to the throttle device of the internal-combustion engine having the default opening setting mechanism to hold the amount of opening of the throttle valve at a specific opening (the default opening) which is larger than the full-close position when the electric actuator is off.
In this throttle device, the stopper for defining the default opening position and the stopper for defining the mechanically full-closed position of the throttle valve are comprised of adjusting screws. These stoppers are so juxtaposed as to enable adjustment of their position in the same direction.
According to the above-described constitution, it is possible to freely adjust the default opening and the mechanical full-closed position of the throttle valve. Besides, since the adjusting screw of the default opening stopper (the default stopper) and the adjusting screw of the full-closed stopper are juxtaposed to allow position adjustment from the same direction, it is possible to drill screw holes for these stoppers (screws) in the same direction, and moreover to perform the adjustment of the stopper positions in close positions from the same direction, thereby enabling simplification of adjustment jobs.
The third aspect of the invention is application of the first and second aspects of the invention, pertaining to the throttle device of the internal-combustion engine. In the aspect, the full-closed stopper stops the reduction gear (the final gear) fixedly attached on the throttle valve shaft, to thereby define the mechanical full-closed position, while the default stopper stops an engagement element for setting the default opening (this engagement element is a default lever freely fitted on the throttle valve shaft to enable rotation of the shaft and engaged with the final gear through a spring), thus defining the default opening.
In the throttle device, there are formed, on one surface of the side wall of the throttle body, a space for mounting a reduction gear mechanism which transmits to the throttle valve shaft the power of the electric actuator, and a frame for mounting a gear cover formed to define the space for mounting the reduction gear. The frame is built lower than the mounting height of the final gear. In the position covered by the gear cover, there is provided a projecting portion, which is higher than the frame, for mounting the full-closed stopper. Mounted on this projecting portion is the full-closed stopper, at the same mounting height as the final gear of the reduction gear. On the other hand, the default stopper is juxtaposed with the full-closed stopper at the position of the said engagement element (the default lever) which is located at the lower level than the said frame.
According to the above-described constitution, the space for mounting the reduction gear mechanism is covered almost by the gear cover like in the first aspect of the invention. it is, therefore, possible to reduce the size and weight of the metal throttle body.
The final gear of the reduction gear protrudes out of the gear cover mounting frame on the throttle body side wall; therefore, the final gear can not be stopped if the full-closed stopper is provided on this frame. In the aspect, there is provided a projecting portion for mounting the full-closed stopper which stops the final gear. The projecting portion protrudes high over the frame. On this projecting portion the full-closed stopper is arranged at the same mounting height as the final gear.
According to this arrangement, it is possible to stop the final gear by the full-closed stopper if the gear cover mounting frame is built low.
The fourth aspect of the invention pertains to a throttle device for an internal-combustion engine having the default opening setting mechanism.
The throttle valve shaft protrudes out at one end from the bearing boss formed on the throttle body side wall, and the final gear of the reduction gear for transmitting the power of the electric actuator is fixedly attached on the one end of the throttle valve shaft. Between the final gear and the bearing boss, the engagement element (the default lever) of the default opening setting mechanism capable of engaging with the final gear is rotatable with respect to the throttle valve shaft.
A return spring is arranged around the bearing boss for exerting the spring force to the throttle valve in the direction the throttle valve is closed. The return spring engages at one end with the default lever; and between the default lever and the final gear there is mounted a spring (the default spring) for attracting the default lever and the final gear towards mutual engagement.
A throttle valve shaft insertion boss is formed only on the surface side (one surface side) of the final gear which receives the default spring. The default lever also has a throttle valve shaft insertion boss formed correspondingly to the final gear boss. And around these bosses the default spring is mounted.
According to the above-described constitution, the return spring and the default spring can be installed in a free space inevitably formed around each boss. That is, rational utilization of space is realized. Moreover, since the boss of the final gear of the reduction gear is protrusively formed on one side only, the amount of projection of the boss (the length of boss axis) protruding out from one side of the final gear can be made longer than the amount of projection of the boss on one side of double-sided bosses (bosses protruded on both sides of the final gear). Therefore, it becomes possible to provide the default opening setting mechanism with a spring mounting space without wasted space while realizing a downsized throttle device.
The fifth aspect of the invention pertains to a throttle device for an internal-combustion engine having the default opening setting mechanism.
In the throttle device, the final gear of the reduction gear which transmits the power of the electric actuator is secured on one end of the throttle valve shaft, and the engagement element (the default lever) of the default opening setting mechanism is relatively rotatably fitted on the throttle valve shaft.
Between the default lever and the final gear there is installed a spring (a default spring) for setting the default opening which pulls the default lever and the final gear towards mutual engagement. The default spring is characterized by the spring stop mechanism that the default spring is supported by the default lever and the final gear.
According to the above-described constitution, the default lever and the final gear of the reduction gear serve also as a default spring bracket, thereby enabling simplification of component parts.
It is, therefore, proposed as an example of application that at least a portion forming the boss and a portion receiving the default spring of the default lever are made of a synthetic resin.
According to the above-described constitution, since the synthetic resin is of a less coefficient of friction than a metal member, friction between the default spring and a member (the spring stop portion in the default lever, and the boss portion) which contacts the default spring will be decreased to reduce a burden on the motor if the default spring is twisted by the relative rotation of the default lever and the final gear, thereby achieving smooth movement of the throttle valve driven by the motor and a decreased motor power consumption during operation.
Furthermore, the use of the return spring and the default spring coated for reducing a coefficient of friction can further decrease its friction with its mating member in case of distortion of the spring.
The sixth aspect of the invention pertains to a throttle device for an internal-combustion engine having the default opening setting mechanism.
In the throttle device, the engagement element (the default lever) for setting the default opening is fitted on one end of the throttle valve shaft in such a manner that the engagement element can rotate in relation to the throttle valve shaft.
On both sides of the engagement element, the return spring exerting a spring force to turn the throttle valve towards closing and the default opening setting spring (the default spring) exerting the spring force from the full-close position of the throttle valve to the default opening side are oppositely arranged in the direction of the throttle valve shaft. These springs which are torsion coil springs seat on both sides of the engagement element serve as spring stopper, thereby retaining these springs at one end. These springs differ in coil diameter and are axially compressed when installed. Furthermore, the compressive stress F of the spring of large coil diameter is made greater than the compressive stress f of the spring of small coil diameter. The compressive stress of the spring stated above is spring rebound which occurs when the spring is compressed.
The throttle valve shaft is required to be disengaged from the engagement element for setting the default opening and to turn independently when turned within a specific range of throttle valve opening (e.g., from the default opening to the electrically full-closed position, or from the default opening to the electrically full-open position of the throttle valve), and accordingly the engagement element for setting the default opening is attached loose-fit on the throttle valve shaft so that the engagement element can rotate with respect to the throttle valve shaft.
Therefore, there exists a clearance between the outer periphery of the throttle valve shaft and the engagement element for setting the default opening. Therefore, the engagement element for setting the default opening will vary (displace) with vibrations if in an unstable state. If the engagement element for setting the default opening is held by the compressive force of the coil return spring and the default spring, and if the compressive stresses of these springs are equal, and also if these springs get out of balance, the engagement element for setting the default opening is liable to vibrate, becoming unstable. Consequently, the default opening will vary, and no smooth operation of the engagement element can be expected.
In the present invention, to cope with this problem, it is necessary to increase the compressive stress F of the return spring or the default spring having a large coil diameter than the compressive stress f of the spring having a small coil diameter. The compressive force F thus increased can overcome the compressive force f, and unidirectionally press the engagement element in a stable state in a position close to the outside diameter, thereby preventing the engagement element for setting the default opening from displacing to enable to maintain a proper condition and accordingly preventing above-described trouble.
The seventh aspect of the invention pertains to a throttle device for an internal-combustion engine, wherein the throttle device is provided with a reduction gear for transmitting the power of the electric actuator to the throttle valve shaft; the final gear of the reduction gear is pressed in and fixed on one end side protruding out of the side wall surface of the throttle body of the throttle valve shaft; and the final gear thus pressed in and fixed can contact the stopper for defining the mechanical full-closed position of the throttle valve, by driving the electric actuator.
According to the above-described constitution, since the final gear of the reduction gear serves also as a defining element on the movable side which restricts the mechanical full-closed position and also the defining element (the final gear) is pressed in and fixed on the throttle valve shaft, the reduction gear position is constantly held in a fixed relation with the throttle valve shaft even in case of a shock caused by the contact of the reduction gear with the full-closed stopper. Therefore, the throttle valve opening set with reference to the mechanically full-closed position will not vary, thus doing much towards keeping a control accuracy.
The eighth aspect of the invention pertains to a throttle device for an internal-combustion engine which is driven by an electric actuator to open and close the throttle valve to control the amount of intake air being aspirated by the internal-combustion engine.
In the throttle device, the motor used as the electric actuator has a yoke forming a motor housing. The yoke is provided with two opposite flat surfaces. The motor casing containing the motor has flat opposite inner surfaces formed to the contour of the motor housing, and is mounted on the side wall of the throttle body, intersecting the line orthogonal with the throttle valve shaft. Of the opposite flat inner surfaces of the motor casing, all or most part of one inner surface makes up the outside wall surface of the intake air passage downstream of the idle opening position for throttle valve control (e.g., downstream of the electrically full-closed position for throttle valve control).
According to the above-described constitution, using the flat motor housing and accordingly the flat motor casing can contribute to the downsizing of the throttle body. Besides, since one of the flat inner surfaces of the motor casing makes up the outside wall surface of the intake air passage downstream of the idle opening position for throttle valve control, the motor casing is most efficiently cooled by the adiabatic expansion of the intake air occurring downstream immediately after passing the throttle valve during an idle turn even if the intake air flow rate is little like during idle turn. Therefore, The cooling of the motor casing interior and the heat dissipation of the motor housing can be improved, thereby contributing to achieving a higher motor cooling effect.
The ninth aspect of the invention pertains to a throttle device for an internal-combustion engine, in which the motor casing for containing the motor, as previously stated, has opposite flat inner surfaces formed to the contour of the motor housing, and is installed on the side wall of the throttle body, intersecting the line orthogonal with the throttle valve shaft. Of the opposite flat inner surfaces of the motor casing, one inner surface is formed lower than the surrounding outside wall surface of the intake passage.
According to the above-described constitution, the motor casing wall adjacent to the intake passage is decreased in thickness to bring the inner surface of the motor casing closer to the intake passage side, thereby enabling to efficiently benefit from the cooling effect of the intake air passing through the intake air passage.
Other objects and advantages of the invention will become apparent upon reading the detailed description and upon reference to the accompanying drawings.

Throttle device for internal-combustion engine


A button mechanism includes a base, a button and two resilient components. The base includes an accommodating slot structure and two guiding pillars, the pillars are disposed by sides of the accommodating slot structure. The button includes a pressing portion and two supporting portions. The pressing portion is movably disposed inside the accommodating slot structure. The supporting portions are respectively disposed by opposite sides of the pressing portion. A first end of the supporting portion is connected to the pressing portion, and a second end of the supporting portion is slidably disposed on the guiding pillar. Two ends of the resilient component respectively contact against an optical disk driver and the supporting portion. The supporting portion slides relative to the guiding pillar to compress the resilient component, and a resilient recovering force of the resilient component drives the supporting portion to slide relative to the guiding pillar inversely.

1. Field of the Invention
The present invention relates to a button mechanism and a related electronic device, and more particularly, to a button mechanism and a related electronic device with strong structure and stably touching feel.
2. Description of the Prior Art
Please refer to FIG. 1 and FIG. 2. FIG. 1 is an exploded diagram of a button mechanism 10 in prior art. FIG. 2 is an assembly diagram of the button mechanism 10 in prior art. The button mechanism 10 includes a base 12, a body 14 and two resilient arms 16. The body 14 is movably disposed inside a sunken slot 121 on the base 12. The base 12 further includes two guiding bars 123 respectively disposed by sides of the sunken slot 121. Ends of the resilient arms 16 are disposed on a side of the body 14 not adjacent to the guiding bar 123, and the other end of each resilient arm 16 is fixed on the corresponding guiding bar 123. As shown in FIG. 1, the resilient arm 16 is a curved structure, which includes two perpendicular stretching portions 161 and a horizontal stretching portion 163. Two edges of the horizontal stretching portion 163 are respectively connected to the perpendicular stretching portions 161 to form a Z-shaped structure.
As shown in FIG. 2, two ends of the resilient arm 16 are fixed on the body 14 and the guiding bar 123. The resilient arm 16 is resiliently deformed when the body 14 is pressed, and the body 14 moves relative to the sunken slot 121 to drive an external electronic switch. However, the resilient arm 16 is the Z-shaped structure, which forms structural defect easily due to difficult manufacturing, and the resilient arm 16 is easy to be resiliently deformed unexpectedly. In addition, the button mechanism 10 has small structural configuring space, the resilient arm 16 is often designed as thin-typed structure, which is easily broken or losses resilient recovering force after long-period operation, and the button mechanism 10 can not provide touching feel. Thus, design of a button mechanism having strong structure and stably touching feel is an important issue in the computer mechanical design industry.

Button mechanism and related electronic device


A cranial protective helmet having a pair of components made of an exterior hard plastic shell with sufficient flexibility to accommodate comfort for the patient with interior cushioning liners conforming to a side of the patient's skull. Each component of the helmet can conform to a side of the patient's head and accommodate an insertion of the patient's head by relative movement with one or more fastener units securing the helmet components to the patient. Openings can be provided to accommodate monitoring instrumentation after a craniectomy operation. The components can be separate or minimally connected to enable a rotational opening. Fastener units can provide a secure connection of the components and an elastic attachment about the patient's head.

1. Field of the Invention
In the orthopedic field there is frequently a requirement to provide a protective covering such as a helmet to protect a patient's head, for example after cranial surgery, such a protective helmet assists in preventing injury to a decompressed craniectomy surgical site where a portion of the skull has been removed to treat traumatic brain injury, cerebral edema and elevated intracranial pressure.
2. Description of Related Art
Protective helmets for children and particularly infants with a plagiocaphalic cranium are found in U.S. Pat. No. 4,776,324 and U.S. Pat. No. 6,428,494. A purportedly cosmetically acceptable cranial prosthesis is disclosed in U.S. Pat. No. 4,809,690, U.S. Pat. No. 5,218,975 and U.S. Pat. No. 5,549,678.
The human skull is initially formed from a substantial number of individual bone elements. As the child grows during the pregnancy and the first 18 months after birth, an endocrhondra ossification occurs and the respective bony elements will tend to fuse together into a solid bone that forms a cranial vault for the brain. Thus, the cranial anatomy basically includes a frontal bone that extends from the eye cavity or supra orbital process upward to the top of the skull where a pair of parietal bones on either side of the skull are fused together with the frontal bone by a coronal suture. A sagittal suture joins the respective parietal bones extending rearward until they meet a rear occipital bone with the junction of the parietal bones being defined by a lambdoidal suture. On either side of both the frontal bone and the parietal bones are a respective temporal bone and sphenoid bone that are joined by a squamosal suture. The final bone fusion of the skull occurs in adulthood and provides a relatively non-deformable protection from the brain during normal activities.
A traumatic injury such as a severe fall, auto accident or gunshot wound can compromise the skull. Additionally, a stroke patient can be subject to cerebral edema and elevated intracranial pressures necessitating an intervention and a removal of a portion of the skull to allow space for the swelling brain to expand in an effort to prevent brain tissue damage with a potential compromise of cerebral circulation and function.
In such a post-operative environment, there is still a need to provide improvements in cranial protective systems such as an orthopedic protective helmet while facilitating intensive care of the patient to accommodate surgical dressings and post operative treatments including monitoring intracranial pressure sensors and cranial fluid release in a relatively lightweight orthopedic helmet.


A stopper device for a linear guide device, the linear guide device comprising a guide rail having axial rolling member-rolling grooves at opposite side surfaces thereof, and a slider loosely fitted on the guide rail so as to move along the guide rail, the slider having rolling member-rolling grooves disposed in opposed relation to the rolling member-rolling grooves of the guide rail, respectively, the slider and the guide rail being movable relative to each other through the rolling of a number rolling members held between the opposed rolling member-rolling grooves. The stopper device comprises a stopper body of a generally U-shaped cross-section mounted astride an upper surface of the guide rail; a hole before threading which is formed through one end portion of the stopper body, and is open toward the side surface of the guide rail; and a covering member of an elastic material which covers at least an inner surface of that portion of the stopper body which is disposed in opposed relation to the guide rail and includes the open end of the hole before threading.

This invention relates to a stopper device for a linear guide device which is attached to a guide rail so as to prevent a slider from being disengaged from the guide rail during the transport of the linear guide device and also to function as a mechanical stopper during the operation of the linear guide device.
A conventional stopper device for a linear guide device is disclosed, for example, in Japanese Laid-Open Patent Application No. 2-300517. In this conventional construction, a stopper body, formed by bending a steel plate into a C-shape, has a pair of hook portions formed respectively at opposite side edges thereof, the hook portions being engaged respectively in guide member rolling grooves formed respectively in opposite side surfaces of the guide rail. A threaded hole is formed through the central portion of the stopper body. A screw member threaded into the threaded hole is pressed at its distal end against the upper surface of the guide rail, and the reaction force of this pressing force increases the force of engagement between the hook portions and the rolling member-rolling grooves so as to fix the stopper device relative to the guide rail, thereby limiting an accidental movement of the slider.
In such a conventional stopper device for the linear guide device, however, the screw member is threaded in a direction perpendicular to the hook portions, engaged in the respective grooves of the rail, to thereby raise the central portion of the stopper body upward to resiliently deform the same. As a result, a fixing force for holding the rail between the hook portions is produced by the bending moment causing the hook portions to be engaged in the respective guide member grooves.
Therefore, there has been encountered a problem that the important groove surfaces of the rail and the upper surface of the rail are damaged by the hook portions of steel, engaged in the guide member grooves of the guide rail, and the distal end of the screw member pressed against the upper surface of the guide rail.
Moreover, when the stopper device is to be attached and detached, this must be done from the axial end of the guide rail, and the position of mounting of the stopper device must avoid a bolt insertion hole of the guide rail. Thus, there have been problems that there are many limitations with respect to the mounting manner and that much time and labor are required.
Further, since the steel plate is pressed into a C-shape, many manhours are required for and additionally high degree of accuracy is required for properly engaging the ends with the groove surfaces of the rail. As a result, there is a high manufacturing cost.


An image formation processing simulation apparatus includes: a receiving unit that receives image data to which image formation processing is applied in an image formation processing device; a performing unit that performs simulation of image formation processing applied to the image data in the image formation processing device using the image data; a memory management unit that allocates a memory area for the image formation processing before the simulation, monitors the memory size required for the image formation processing in the simulation, and compares between the required memory size and the size of the allocated memory area; and an output unit that outputs information concerning the comparison result.

Hitherto, when a defective condition occurred in image formation processing (such as print processing) in an image formation processing device (such as a printer), for example, the user of the image formation processing device has caused the image formation processing device to simulate image formation processing or has transmitted information concerning the defective condition to the service center of the image formation processing device, thereby handling the defective condition.
However, the related arts described above deal with a defective condition occurring as a result of actually using the image formation processing device. Thus, for example, the user cannot previously check whether or not the size of memory installed in the image formation processing device is sufficient for performing print processing desired by the user without actually using the image formation processing device.

Image formation processing simulation apparatus and image formation processing simulation method


The purpose of the present invention is to provide a sheet bundle binding processing apparatus capable of performing a binding process on a sheet bundle set at a manual setting portion and a sheet bundle set on a processing tray, respectively, with a simple structure at low cost. The present invention comprises a sheet bundle binding processing apparatus including an external casing, a manual setting portion which is integrally formed with the external casing and to which a sheet bundle is inserted, a binding device which performs a staple-binding process on the sheet bundle inserted to the manual setting portion as being movable between a binding position where the sheet bundle of the manual setting portion is bound and a staple replenishment position where staples are replenished, and an open-close cover which is arranged at the external casing at a position being different from the manual setting portion.

1. Field of the Invention
The present invention relates to a sheet bundle binding processing apparatus which performs a binding process on sheets fed from an image forming apparatus or the like after stacking the sheets into a bundle shape, and relates to improvement of a binding process mechanism which performs a binding process on sequentially-fed sheets and a binding process on a sheet bundle set from the outside.
2. Description of Related Arts
In general, as a post-processing apparatus, there has been widely known an apparatus which performs a binding process with a stapling unit after stacking, on a processing tray, sheets fed from an image forming apparatus and stores the sheets on a stack tray at the downstream side. In a structure thereof, a sheet introducing path is connected to a sheet discharging port of an image forming apparatus, image-formed sheets are collated and stacked on the processing tray arranged at the sheet discharging port, a binding process is performed on the sheets with the binding processing unit arranged at the processing tray, and then, the sheets are stored in a stack tray arranged at the downstream side.
For example, Japanese Patent Application Laid-open No. 2005-096392 (FIG. 2) discloses a post-processing apparatus having a binding processing function located at the downstream side of an image forming apparatus. Here, sheets fed from the image forming apparatus are collated and stacked on a processing tray and a binding process is performed thereon, and then, the sheets are stored in a stack tray at the downstream side. Further, an inserter apparatus is arranged between the image forming apparatus and the post-processing apparatus to serve an inserter function of mixing and binding a front sheet inserted thereto. Here, there is disclosed a manual binding processing mechanism to perform a binding process as setting a sheet bundle from the outside to a manual setting portion which is arranged at an external casing of the inserter apparatus.
Further, Japanese Patent Application Laid-open No. 2001-058756 (FIG. 11) discloses an apparatus which is connected to a sheet discharging port of an image forming apparatus as a unit. Here, discharged image-formed sheets are stacked on a processing tray and staple-bound, and then, are conveyed to a stack tray at the downstream side. Further, there is disclosed a structure that a staple cartridge is inserted to a staple unit at the inside of an external casing through an open-close cover portion which is arranged at the external casing.
Thus, the staple unit is designed to accommodate staples as a cartridge and to facilitate replenishment of staples.

Sheet bundle binding processing apparatus and image forming system having the same


The invention discloses smart Artificial Intelligence powered body harness system for support animals or pets such as a dog and which is capable of real time monitoring of human health, wellbeing, behavior and status of an owner or handler or any of the person of interest within proximity of the equipped support animal or pet. Further, the smart body harness and armor system is capable of monitoring the emotional state and body biometrics and health of the support animals or pet and to transmit in real time the collected data to a centralized monitoring center for AI and human analysis and then reporting on those results to the pet owner and any interested person or organization granted secure access via his/her smartphone or any other network enabled device. The smart body harness system of present invention is comprising of: a flexible body of a harness capable of conforming the body shape of the pet support animals which is further augmented with a network of plurality of electronically connected housings built within the flexible body of harness to support the real time monitoring instruments; each such base stations of the body harness incorporates one or more electronic sensor base plate or mounting platform all of which are networked together as a part of global monitoring network; a plurality of weatherproof, waterproof and shock resistant container having not less than a microcomputer with integrated peripheral devices including but not limited to, a camera, a microphone, a 4G and 5G wireless network components, a Bluetooth module, a Wi-Fi, Battery pack and many more mounted within the base stations of the body harness which acts as a mounting receptacle for the container. Further, each such container has transparent housing for its camera device and each container device is interchangeable with other container device due to the ability of containers to snap-in to the housings via mechanical, magnetic or clip-on mechanisms.

Support animals and pets, particularly dogs, have for thousands of years been integrated into the fabric of human society and the family. The military, police, emergency responders and rescue teams, agriculture and even medicine have relied on the acute senses, endurance, intelligence, loyalty and empathy that dogs in particular have demonstrated time and time again. Humans also tend to bond for life to their support animals and pets.
However, it is impossible for support animals and pets to communicate information on their surroundings, or on the status and wellbeing of their handlers or even their own state of health. While a support animal may emotionally empathize and witness the distress of its handler or owner, it has no biological tools or enough intelligence to communicate such conditions to a 3rd party and in a meaningful way. Yet, support animals and pets, particularly dogs and their handlers or owners, will form emotional bonds in such a way that they become inseparable. And unlike a human partner, a support animal or pet typically has a single unwavering focus to be in the presence of its human partner.
Therefore, there exists a need of a monitoring and reporting system that can remotely monitor human beings within the same physical space and surroundings shared by a support or pet animal, and to collect data and report on the behavior, state of health and wellbeing of a human handler or any subject human within the proximity of the animal. Further, there is need of a monitoring and reporting system for the animal that can monitor the behavior of the animal and report on its health. Moreover, there is a need for a network and system that wirelessly transmits in real time all collected data on both the human and animal subject to a centralized monitoring center for AI and human analysis and then reporting on those results to an interested party granted secure access via his/her smartphone or any network enabled device.

Smart AI powered animal body harness and armour system for real time monitoring of human health and behaviour when within proximity to any support animal or pet


Monitoring device (30) for monitoring a drive element (12) of a conveyor (1), in which the drive element (12) extends in a conveyance direction. The monitoring device (30) comprises a mechanism (39) attached to the drive element (12) and configured for mechanically monitoring a distance between two predetermined locations of the drive element (12) spaced apart in the conveyance direction. The monitoring device (30) is further configured for triggering an alarm signal in case the monitored distance exceeds a predetermined limit.

The invention relates to a monitoring device for a conveyor, in particular a people conveyor. The invention also relates to a conveyor comprising such a monitoring device.
Conveyors, such as people conveyors, usually comprise a plurality of conveyance elements, e.g. pallets or steps, at least some of which are drivingly coupled to at least one drive element, such as a belt or a chain.
It would be beneficial to be able to continuously monitor the at least one drive element for detecting wear or a forthcoming failure, such as a rupture, of the at least one drive element as soon as possible, in order to reduce or even prevent further damage.


A transmission Line Pulse (TLP) device calibration method wherein the TLP device includes a pulse generator for generating a pulse, a cable having an input terminal coupled to said pulse generator, an output terminal, and at least one ground return terminal, for coupling said pulse to a device under test (DUT) when it is connected to said output terminal, and a sensor for sensing the voltage and current at a selected point in said cable to measure the pulsed voltage and current of the DUT as the pulses travel in the cable to and from the DUT. The method for calibrating said TLP device comprises selectively shorting between said output terminal and said ground return terminal and selectively creating an open circuit between these terminals to enable the calculation of the series resistance RS at said selected point in said cable and calculating the shunt resistance RSH at said selected point in said cable, respectively, when a pulse is generated, and for calculating the corrected values of current and voltage according to a formula that uses these resistance values.

1. Field of the Invention
This invention relates generally to testing systems of integrated circuits and in particular to transmission line pulse systems and devices.
2. Description of the Related Art
Measurement of integrated circuit (IC) short pulse response is often made using Transmission Line Pulse (TLP) techniques as described in the ESD Association industry document ANSI/ESD SP5.5.1-2004 and U.S. Pat. No. 5,519,327. These documents describe the technique for measuring the response of a device under test (DUT) when pulses are coupled to the DUT. The technique comprises comparing the pulse that is received at the DUT with the reflected pulse from the DUT. The relative amplitudes of these pulses are controlled by the dynamic impedance of the DUT. Studies of DUT responses to short, high power pulses is a common goal of electrostatic discharge (ESD) studies.
In a TLP device, pulses are carried in a constant impedance cable between the pulse generator and the DUT to avoid pulse distortions. It is common to measure the current and voltage pulse waveforms in the cable connected to the DUT. Since these measurements are not exactly made at the DUT, some error is introduced by the interconnecting cable. ESDA/ANSI STM 5.5-HBM prescribes that such measurement distortions are to be measured using open circuit and short circuit test loads to enable the raw data to be corrected for these systemic errors.
The prior art method of TLP corrections is described in section 7 of the ESD Assoc. ANSI/ESD SP5.5.1 document. This document defines procedures including:
7 Test Requirements and Procedures
7.1 Error Correction
Adjustments of both current and voltage measurements are important to remove unavoidable non-ideal system characteristics such as system resistance, contact resistances, and shunt resistance. Periodic verification using simple components with known properties insures accurate measurements.
7.2 Tester Error Correction Methodology
Perform the error correction methodology, including the open and short circuit measurements, at least once per shift or when the equipment is modified or changed. Longer periods between error correction steps may be used if no changes in the error correction factors are observed for several consecutive checks. Create a separate set of adjustment values for each test pulse rise time, or configuration of cables and probes used to collect device data. The adjustments derived from the short circuit and open circuit measurements may be applied to the data within the operating system software, during post processing using spreadsheet or other data analysis software or can be done manually. To insure accurate results, all measurements should be performed on properly calibrated measurement instruments.
7.2.1 Error Correction Short Circuit Methodology
Measurements through a short circuit allow for correction of system and contact resistance.
220.127.116.11 Connect an electrical short circuit to the end of the device testing connections or needles at the DUT. In the case of wafer probes, placing probe needles on a low resistance clean metal can be considered as a good electrical short circuit. The short circuit should be made of the same type of material to be used during device measurements or verification, and should be verified by standard low resistance measurement techniques with accuracy to 1 m Ω.
22.214.171.124 Perform a TLP test (see section 7.4 for test procedure) with at least 5 points set to the maximum current. If the slope of a line through the test points is not 0 Ω, then the value of the slope of the line in V/A (Ω) represents the internal adjustment value and should be used to correct the DUT I-V test data.
22.214.171.124 Record the measured V/A values for reference and use until the next short circuit error correction.
184.108.40.206 For the greatest accuracy, use an I-V plot range of +/−1V with the current range set to highest value used in the TLP system.
7.2.2 Error Correction Open Circuit Methodology
Measurements through an open circuit allow the correction of shunt resistance contributions.
126.96.36.199 Provide an open circuit at the end of the device testing connections for a socket tester. For wafer probing, disconnecting the probe needles from the short circuit will provide an optimum open circuit.
184.108.40.206 Perform a TLP test (see section 7.4 for test procedure) with at least 5 points set to the maximum voltage. If the slope of a line through the test points is not infinite, then the value of the slope of the line represents the internal adjustment value and should be used to correct the DUT I-V test data.
184.108.40.206 Record the measured A/V values for reference and use until the next open circuit error correction.
220.127.116.11 For the greatest accuracy, use an I-V plot range of +/−10 mA with the voltage range set to the highest value used for device testing.
Note 2: Typically the current probe losses inject 1 ohm into the current carrying wire, thus the total V/A correction will be greater than 1 Ω. VF-TLP test leads running to a wafer probe station can add an additional 1 Ω to the V/A error correction. Therefore, the V/A error correction can be approximately 1 Ω for socket testing and 1 to 2 Ω for wafer testing. Unless a voltage probe with a lower resistance provides greater shunt losses, the A/V error correction will vary in the 10 k Ω to 100 k Ω.
7.3 Tester Verification Methodology
Verification of TLP test system accuracy should be performed on a regular basis and prior to system use to minimize error in the measurements. The verification procedure and methodology is dependent on the TLP method being utilized. Verification is performed using both a Zener diode and a resistor. The Zener diode is used to verify the system voltage error. Once the voltage error is known, a resistor is used to verify the system current error.
7.3.1 Choose a Zener diode. Measure the dc reverse bias breakdown voltage.
7.3.2 Perform a reverse bias TLP test (see section 7.4) on the Zener diode to a voltage above the Zener diode reverse bias breakdown voltage. Compare the VF-TLP and dc breakdown voltage.
7.3.3 Choose a resistor whose resistance value is comparable to the DUT resistance. Typical DUT resistances are between 1 and 50 Ω. Measure the resistance to within 10 mΩ. A four-wire (Kelvin) technique removes contact resistance from the measurement. For a socket system, insert the resistor into the test socket. For a wafer probing system, place the probe needles on the electrical terminals of the resistor element.
7.3.4 Perform a TLP I-V measurement (see section 7.4 for test procedure). The number of voltage steps should be chosen to minimize measurement error relative to the average resistance straight-line slope. Use the V/A and A/V error correction results to correct for system, contact, and shunt resistance.
7.3.5 After the test completion, calculate the V/A ratio (e.g., slope). Compare the calculated resistance and measured dc resistance. The difference is a measure of the amount of error in the TLP measured resistance. Given that the measured voltage has been found to be accurate (e.g., based on the Zener diode measurement), a determination of current measurement accuracy can be obtained by comparing the measured and calculated current. This is based on the measured voltage divided by the known resistance value.
7.3.6 Perform the resistance measurement for each rise time and cable configuration to be used. The accuracy should be approximately the same for each measurement.
The authors of this industry procedure had not studied the interaction of the "open/short correction" and the calibration of the voltage and current measurement components (the inventor is an author of the above procedure). Applying the correction as described will cause a shift in voltage and current calibration. More specifically, when such tests are performed according to prior art techniques, to make a shorted load (a 0 ohm DUT) measure as a short circuit (no DUT voltage) and to make an open load (infinite resistance or 0 siemens conductance) measure as an open circuit (no DUT current), errors are created. An error occurs in the current measurement when adjusting the voltage to properly record a low resistance DUT, and an error occurs in the voltage measurement when adjusting the current measurement to correctly record a high resistance.
As requirements for measurement accuracy increase, a method of providing open/short corrections without causing shifts in voltage and current calibrations is needed. A new correction technique is needed that will allow open/short corrections without changing the voltage and current calibration.
Therefore, in general, a need exits in the art of TLP systems and devices for testing the ESD protection structures for integrated circuits to improve measurement accuracies by making measurement corrections that do not introduce calibration errors.

Transmission line pulse (TLP) system calibration technique


A process is disclosed for the liquid phase separation and recovery of hydrogen fluoride from a mixture comprising hydrogen fluoride and a fluorinated organic hydrocarbon. The process requires that the mixture be treated with a sufficient amount of a coupled phase-separating agent comprising an organic or inorganic salt, an alkanolamine or mixtures thereof and a substituted or unsubstituted aromatic compound to form a first and a second phase. The first phase that is formed is a hydrogen fluoride-rich phase that additionally contains substantially all of said salt, said alkanolamine or mixtures thereof from the coupled phase-separating agent. The second phase comprises substantially all of said aromatic compound and the fluorinated organic hydrocarbon. It is substantially free of hydrogen fluoride. The phases are separated from each other. Hydrogen fluoride and the salt, alkanolamine or mixtures thereof are then recovered from the separated first phase and the aromatic compound and fluorinated organic hydrocarbon are recovered from the separated second phase.

The replacement of chlorofluorocarbons (CFC's) widely used in refrigerant compositions, propellants and cooling fluids as well as blowing agents, solvents and rinse agents with environmentally acceptable alternatives has produced an abundance of compounds meeting one or more of these needs. The most acceptable replacement compounds are those having little or no chlorine, since it is generally accepted that chlorinated aliphatics lead to unacceptable reactive chlorine-containing radicals when present in the upper atmosphere. These radicals are thought to react with the ozone in the stratosphere depleting it to dangerously low levels.
One of the more promising alternatives to CFC's are the aliphatic compounds where chlorine has been partially or completely replaced with fluorine. These materials are known respectively as hydrochlorofluorocarbons (HCFC's) and hydrofluorocarbons (HFC's). Typical HCFC's and HFC's have atmospheric lifetimes and global warming potentials that are a fraction of their fully chlorinated analogs. However, many of their other physical properties (low flammability and toxicity, sufficient volatility, etc.) are identical or similar to the CFC's. Accordingly, they are attractive replacements for the chlorinated molecules.
In processes for preparing HCFC's and HFC's, a usual starting material is the chlorinated analog of the desired fluorinated compound. Thus, U.S. Pat. No. 2,787,646 discloses that SbF.sub.3 Cl.sub.2 and SbF.sub.3 are useful for converting compounds of the formula CMZ.sub.2 CX.dbd.CHY, for example 3,3,3-trichloroprop-1-ene or 1,1,3-trichloroprop-1-ene to compounds of the formula CF.sub.3 CX.dbd.CHY, for example 3,3,3-trifluoroprop-1-ene.
The preparation of 1-chloro-1,1,3,3,3-pentafluoropropane and of 1,1,1,3,3,3-hexafluoropropane from 1,1,1,3,3,3-hexachloro-propane in the liquid phase is described in EPO Publication No. 0 522 639 A1. While the preferred catalyst for the reaction is noted to be SbCl.sub.5, other catalysts disclosed are those metal chlorides, fluorides, and chloride fluorides of Group IIIa, IVa, IVb, Va, Vb and VIb of The Periodic Table of the Elements.
The processes disclosed above are illustrative of reactions that generate mixtures of hydrogen fluoride and fluorinated organic hydrocarbons. Also present in such mixture are organic by-products, hydrogen chloride, unreacted starting materials and the like. The most commonly practiced separation process for such a mixture is distillation, which facilitates the recovery of hydrogen fluoride for recycle. Unfortunately, the organic fraction that is recovered in these distillation processes also contains residual hydrogen fluoride, especially in cases where hydrogen fluoride/fluorinated organic hydrocarbon constant boiling mixtures occur. Typically, the residual hydrogen fluoride is removed by scrubbing with water and/or alkali. The process is expensive and time consuming generating wastes that require disposal and diminishing the yield of recovered hydrogen fluoride.
Unexamined Japanese Patent Application No. 56226-1996, filed Mar. 13, 1996, incorporated herein by reference, discloses a method for separating hydrogen fluoride from hydrogen fluoride mixtures with 1,1,1,3,3-pentafluoropropane by adding to such mixtures an aromatic compound such as benzene, toluene or trifluoromethylbenzene.
A method of recovering hydrogen fluoride from the above mixtures has been described in our patent U.S. Pat. No. 5,684,219, where an organic or inorganic salt is added to a mixture containing certain fluorinated propanes and hydrogen fluoride.
Other similar methods are disclosed in U.S. Pat. No. 5,632,966 and WO 97/13719.

Process for separating and recovering hydrogen fluoride from mixtures


An unsaturated polyester molding compound of which viscosity at 25.degree. C. is about 10.sup.7 centipoise or more, containing (1) glass fiber of about 0.05 to 3 mm in length, (2) 4-methyl-2,4-diphenylpentene-1, and (3) a transparent filler can give glossy, transparent, thick, profile articles without cracking even at high temperatures. Therefore, the molding compound is used advantageously for production, for example, of bathtubs, kitchen counters, and lavatory and dressing tables.

In general, transparent artificial marble articles are produced by compression molding of a sheet molding compound (abbreviated as SMC hereinafter), or a thick molding compound (abbreviated as TMC hereinafter), or a bulk molding compound (abbreviated as BMC hereinafter) containing glass or mineral powder, such as aluminum hydroxide powder, as the filler, and glass fiber. However, transparency is reduced when molding compound contains glass fiber of 1 inch in length because the fiber pattern remains inevitably on the surfaced article. Therefore BMC or TMC containing short fiber of 1/4 inch in length or glass chop of 3 mm in length is generally used for molding at 100.degree. C. to 160.degree. C. with metal toolings. In the case of a flat panel, it is possible to mold articles of 6 mm or more in thickness or of uneven thickness, but when molding a profile article, cracking will occur at the corner of the articles; therefore molding is carried out at a lower temperature by taking a longer time, or molding is carried out by using fiber reinforcement in addition to a molding material to prevent cracking.
A method has been proposed to prevent cracking and improve transparency by adding crosslinked styrene polymer and glass powder (Japanese Patent Application Laid-Open No. 64858/87). With this method, transparency is improved, though the method has a disadvantage that transparency is reduced when the amount of the additives is enough to prevent cracking.
Recently mass production of transparent, molded articles, such as bathtubs, lavatories dressing tables and kitchen counters, has been attempted by compression molding.
It is worth developing a technology to mold profile articles such as bathtubs or kitchen counters of uneven thickness: The general trend in these products is that glass fiber content is suppressed as far as possible to give transparency, while the thickness is increased to ensure the strength as well as massive and deep appearance. During molding of such thick articles, cracking tends to occur at the corner of the products. Cracking is prevented by lowering the molding temperature, but it causes poor surface gloss and long molding cycles.

Unsaturated polyester molding compounds and the articles thereof


A condenser microphone includes a volume restrictor disposed in a space inside a microphone case and an electronic circuit disposed in the space and encompassed by the volume restrictor. The volume restrictor reduces the volume of the space and prevents sound waves entering the space through openings on the microphone case from reaching the electronic circuit.

Microphones have been known that are used under high acoustic pressure near musical instruments to acquire sounds of the instruments. Condenser microphones are commonly employed for use near instruments, which can be more easily downsized than dynamic microphones so as not to obstruct the performer's action or view. Sounds of instruments acquired by the microphone are often subjected to amplification (also referred to as "PA (Public Address)") at a concert hall, for example. Such sounds have unidirectionality in general. A unidirectional condenser microphone includes a microphone case having openings on its side wall, the openings communicating with a rear acoustic terminal provided at a condenser microphone unit. The openings introduce sound waves to the rear acoustic terminal of the condenser microphone unit.
A condenser microphone requires an electronic circuit such as an impedance converter for reducing the output impedance of the microphone unit. In this respect, the condenser microphone differs from a dynamic microphone outputting signals from the both ends of a voice coil. The condenser microphone requires an electronic circuit as described above, and should be as small as possible. The condenser microphone therefore includes a circuit board having an electronic circuit thereon near the rear acoustic terminal of the microphone unit.
When such a condenser microphone is used near instruments, for example, sound waves with high acoustic pressure entering the microphone case cause vibration of the circuit board. The vibration of the electronic circuit mounted on the circuit board induces incidental noise other than intended sounds to be electro-acoustically converted by the microphone unit. Such incidental noise results in deterioration in sound quality. Thus, a solution to prevent the electronic circuit from vibrating in response to sound waves has been desired.
The microphone case has an internal space communicating with the openings of the microphone case and located behind the rear acoustic terminal of the microphone unit. The space accommodates the circuit board having the electronic circuit. Since the space serves as acoustic capacitance, the acoustic mass of the space and the openings of the microphone case generate resonance, which deteriorates the frequency response of the microphone. If the space has a large volume, the space could easily accommodate the circuit board and the electronic circuit elements thereof; however, the lowered impedance of the acoustic capacitance makes resonance more likely to occur in the main frequency range of acquired sounds.
A reduction in volume of the space should therefore increase the impedance of the acoustic capacitance. The reduced volume of the space leads to an increase in the impedance of the acoustic capacitance, thereby increasing the resonance frequency of the space. Thus, for a resonance frequency of the space higher than the upper limit of the main frequency range of acquired sounds, the directional frequency response does not deteriorate in a frequency range equal to or lower than the resonance frequency.
A known condenser microphone includes a space behind a rear acoustic terminal of a condenser microphone unit inside a microphone case, and further includes a filler functioning as acoustic resistance in the space to prevent the resonance of the space. In the condenser microphone disclosed in Japanese Unexamined Patent Application Publication No. 2011-9807, a filler is a sintered plastic material having countless continuous pores and disposed in the space inside the microphone case. The filler functions as acoustic resistance against sound waves entering the space through openings on the side wall of the microphone case, and prevents the resonance of the space.
The invention according to Japanese Unexamined Patent Application Publication No. 2011-9807 certainly prevents the resonance of the space inside the microphone case. However, the invention according to Japanese Unexamined Patent Application Publication No. 2011-9807 does not intend to include an electronic circuit in such a small space inside the microphone case, and also not intend to prevent the electronic circuit from vibrating in response to sound waves entering the microphone case.
An object of the present invention is to provide a condenser microphone that includes a space inside a microphone case for accommodating an electronic circuit with a reduced volume to prevent the resonance of the space, and can prevent the electronic circuit from vibrating in response to sound waves.


A structure and a method to increase the capacitance of a DRAM capacitor by forming a capacitor electrode with cellular voids to add surface area. According to the method: a transfer transistor with a gate electrode and source-drain electrode regions is formed on a semiconductor substrate. An insulating layer is formed on the semiconductor substrate and the transfer transistor, and the insulating layer is etched to form a contact void for exposing the surface of one of the source-drain electrode areas as a contact. A first conductive layer is formed on the insulating layer and is coupled to the contact through the contact void. On the first conductive layer, at least one middle insulating layer and one middle conductive layer are formed alternately to construct a multiple layer structure. Within the middle insulating layer(s), intercommunicating voids are formed through which the middle conductive layer is coupled to the first conductive layer is coupled to the first conductive layer. Thereafter, the middle conductive layer, the middle insulating layer and the first conductive layer are etched selectively to define an area of a capacitor. The middle insulating layer is removed by isotropic etching to form surface-increasing voids, and a cellular structure as a storage electrode is formed by the first conductive layer and the middle conductive layer. A dielectric layer is formed on the exposed surface of the storage electrode. A second conductive layer as an opposed electrode of the capacitor is then formed on the dielectric layer.

1. Field of the Invention
The invention relates in general to a method of fabricating semiconductor memory devices, and more particularly to a method of fabricating a DRAM cell by forming a capacitor electrode with cellular voids, to increase the capacitance by adding surface area.
2. Description of the Related Art
A dynamic random access memory (DRAM) is a widely used integrated circuit device, that presently plays an indispensable role in the electronics industry. FIG. 1 is a schematic diagram illustrating the circuit of a DRAM cell. As shown in FIG. 1, a memory cell consists of a transfer transistor T and a storage capacitor C. The source electrode of the transfer transistor T is coupled to a corresponding bit line BL, the drain electrode of the transfer transistor T is coupled to a storage electrode 6 of the storage capacitor and the gate electrode of the transfer transistor T is coupled to a corresponding word line WL. An opposed electrode 8 of the storage capacitor C is coupled to a fixed voltage source. A dielectric layer 7 is disposed between the storage electrode 6 and the opposed electrode 8. As known by those who are skilled in this art, the storage capacitor C used for storing data should have enough capacity to avoid the loss of data.
In a conventional process of fabricating a DRAM having a storage capacity of less than one mega-bits (1 MB), a two dimensional capacitance device, e.g. planar-type capacitor, is widely used for storing data. As shown in FIG. 2, where structures corresponding to those in FIG. 1 are designated with the same reference numbers, a field oxide layer 11 is formed on a substrate 10 to define an active region, and then a gate oxide layer 12, a gate electrode layer 13 and source-drain electrode regions 14 are formed in sequence to provide a transfer transistor T. On the surface of the substrate 10, which defines the storage electrode 6, a dielectric layer 7 and a conductive layer forming the opposed electrode 8 are formed adjacent to the drain electrode. The dielectric layer 7, the conductive layer 8 and the surface 6 of the substrate 10 where the layers 7 and 8 are formed, define a storage capacitor C. Obviously, a planar-type capacitor will occupy a fairly large area to form the storage capacitor C, which is inappropriate in a high integration DRAM.
Highly integrated DRAM, e.g. with a storage capacity of 4 MB and above, requires a three dimensional capacitance structure, such as in a "stack-type" capacitance device or a "trench-type" capacitance device, in order to realize its capacity.
FIG. 3 is a cross-sectional view of a conventional stack-type capacitance device, wherein structures corresponding to those in FIGS. 1 and 2 are designated by the same reference numbers. On a substrate 10, a field oxide layer 11, a gate oxide layer 12, a gate electrode layer 13 and source-drain electrode regions 14 are formed in sequence to construct a transfer transistor T. Next, an insulating layer 15 is formed, and a void is formed for a contact by etching the insulating layer above the source-drain electrode areas 14. Thereafter, a first polysilicon layer which is used as a storage electrode 6, a dielectric layer 7 and a second polysilicon layer which is used as an opposed electrode 8 are formed in sequence on the contact to complete a DRAM memory cell with the stack-type capacitor C. This memory cell can offer enough capacitance to assure the quality of device as the size of the device is diminished. However, when memory cells must be more highly integrated, such as in fabricating a DRAM with a storage capacity of 64 MB or greater, the above described simple structure of a stack-type capacitor is no longer appropriate.
FIG. 4 is a cross-sectional view of a conventional trench-type capacitor, wherein structures corresponding to those in FIGS. 1-3 are designated by the same reference numbers. First, a transfer transistor T is formed on a substrate 10 by an ordinary process, and includes a gate oxide layer 12, a gate electrode layer 13, and source-drain electrode regions 14. On the surface of the substrate 10, a deep trench is etched adjacent to the drain electrode. Next, within the deep trench, a storage capacitor C is formed. The storage capacitor C includes a dielectric layer 7, an opposed electrode 8 formed of a polysilicon layer, and a storage electrode 6 formed by the side wall of the substrate 10. This kind of capacitor structure can increase the surface area of the storage electrode, to raise the capacity of the capacitor. However, while the deep trench is being formed by etching, lattice defects are generated on the substrate, that increase leakage current and influence the characteristics of the device. Moreover, as the aspect ratio is increased, the etching rate is decreased, which adds difficulty to the process, and affects the efficiency of production.

Method of fabricating a capacitor structure for a dynamic random access memory cell with cellular voids


A turbine housing section includes a radially inner case centered on a first axis, and a radially outer case spaced radially outwardly of the inner case, and centered on a second axis. The first and second axes are offset relative to each other. A plurality of tie rods include a threaded nut received on a tie rod, with the plurality of tie rods connecting the inner and outer cases. The plurality of tie rods are spaced circumferentially about both of the first and second axes, and extend for distinct lengths between the inner and outer cases such that the inner and outer cases are held at a position wherein the first and second axes are offset.

This application relates to a method and apparatus for adjusting a center line for a bearing mount relative to a turbine casing utilizing adjustable tie rods.
Gas turbine engines are known, and typically include a compressor compressing air and delivering it into a combustion section where it is mixed with fuel and ignited. Products of this combustion pass downstream over turbine rotors, driving them to rotate. The turbine rotors drive the compressor rotors.
In a gas turbine engine utilized on an aircraft, a fan typically delivers a portion of its air into a bypass duct, and a portion of air into the compressor. There are often two turbine rotors, and two compressor rotors. A first turbine rotor sees a higher pressure and rotates at a higher speed, and rotates a downstream or higher pressure compressor rotor. A second turbine rotor is downstream of the first, and thus sees a lower pressure and rotates at a lower speed than the first turbine rotor.
Historically, the lower pressure turbine drove the lower pressure compressor rotor and the fan at one speed. More recently, a gear reduction has been included between the fan and the low pressure turbine rotor, such that the fan and the low pressure compressor can be rotated at different speeds.
This development has led to freedom in the design of the turbine section. In one turbine section there is a mid-turbine casing or frame mounted between the low and higher pressure turbine rotors.
The mid-turbine casing includes an inner case and an outer case which are connected by threaded tie rods. A bearing is mounted within an inner bore in the inner case, and a turbine flow area is defined between an outer periphery of the inner case and an inner periphery of the outer turbine case.
For any number of reasons, it is often the case that a center line of the outer turbine case may desirably be offset from a center line of the bearing. This may occur due to a desire to optimize blade tip clearances within the engine. Further, the rotor may sag due to weight, deflection from maneuvers, and case distortion from thrust, pressure, temperature, and maneuvers. All of this may result in a nominal tip clearance being uneven around an engine circumference.
Thus, it is known to offset the bearing by machining the inner case bearing flanges to be nonconcentric with the outer case flanges. This requires a long lead time to coordinate manufacturing, additional offset tool setup, and is non-adjustable once machined.

Turbine case adjustment using Adjustable tie rods


A reflective type optical encoder has a light source, a scale which moves relatively with respect to the light source and which has a periodic optical pattern, and a photodetector which can detect a change in an intensity pattern of a light beam that is emitted from the light source and is reflected and modulated by the scale. The photodetector and a concave portion are formed on a semiconductor substrate, the light source is disposed at the concave portion on the semiconductor substrate, a slit is also disposed on the concave portion, and the light beam emitted from the light source irradiates the scale after passing through the slit.

1. Field of the Invention
The present invention relates to an optical encoder and an optical lens module.
2. Description of the Related Art
At present, a so-called encoder of an optical type, a magnetic type or the like for detecting a rectilinear displacement amount in a machine tool stage, a three-dimensional measuring instrument and the like, or for detecting a rotational angle in a servomotor and the like, is used.
The optical encoder is generally composed of a scale fixed to a member for detecting the displacement of the stage or the like, and a sensor head for detecting the displacement of the scale. The sensor head has a light emitting portion for irradiating light on the scale, and a light receiving portion for detecting a light beam modulated by the scale, and the movement of the scale is detected in accordance with an intensity change of a received light beam.
As a first prior art, a typical optical encoder will be described with reference to FIG. 33. FIG. 33 is a constitution diagram showing an optical encoder according to a prior art, using a surface emitting laser and a reflective type scale.
This optical encoder using a surface emitting laser and a reflective type scale is disclosed, for example, in U.S. Pat. No. 6,713,756.
As shown in FIG. 33, this encoder is configured by a reflective type scale 20 and a sensor head 30. A displacement amount detecting optical pattern 23 and a reference position detecting optical pattern 24 are formed on the surface of the scale 20, and these patterns are formed by patterning a metallic thin film such as chromium or the like on the surface of a transparent member such as a glass. In the sensor head 30, a displacement amount detecting photodetector 37 and a reference position detecting photodetector 39 are formed on a semiconductor substrate 34, a surface emitting laser 32 is disposed on the semiconductor substrate 34, and the positional relationship of a light source 32, and the photodetectors 37 and 39 is kept constant.
The scale 20 is interlocked with a stage (not shown) or the like, and moves relatively in the direction of the arrow of FIG. 33 with respect to the sensor head 30, and the sensor head 30 detects a movement amount, a moving direction, and a reference position thereof on the basis of an intensity change of the light beam modulated by the scale 20. The output signals from the sensor head are output as waveforms, for example, as those of FIG. 35. Here, A-phase and B-phase are waveforms which are output along with the movement of the scale 20, and are generally quasi sinusoidal waves. Further, Z-phase is a signal to be output when a reference position is detected. The A-phase and the B-phase are signals deviating from each other by 90 degrees in phase, and it is possible to detect the moving direction of the scale 20 on the basis of the phase relationship between the signals of the A-phase and the B-phase.
In this prior art, because the scale 20 displaces with respect to the sensor head 30 while maintaining a positional relationship by which a so-called Talbot image can be formed, a bright/dark pattern similar to a periodic pattern of the scale 20 is projected on the movement amount detecting photodetector 37, and the bright/dark pattern moves on the photodetector 37 along with the movement of the scale 20.
The Talbot image will be described by using FIG. 34. Here, the description will be carried out by supposing a transmission type encoder in order to simplify the description. However, the completely same argument is achieved with respect to the reflective type encoder as well.
As shown in FIG. 34, respective constituting parameters will be defined as follows.    z0: distance between the light source 1 and the surface of the scale 2 on which diffraction grating is formed    z2: distance between the surface of the scale 2 on which diffraction grating is formed and the photodetector 3    p1: pitch of the diffraction grating on the scale 2    p2: pitch of the bright/dark pattern to be projected on the light receiving surface of the photodetector 3
In accordance with optical diffraction theory, when z0 and z2 defined as described above are in or close to a specific relationship satisfying the relationship shown by the following equation (1), a bright/dark pattern similar to the diffraction grating pattern of the scale 2, i.e., a Talbot image is formed on the light receiving surface of the photodetector 3:(1/z0)+(1/z2)=λ/k(p1)2  (1)where, λ denotes a wavelength of a light beam emitted from a light source, and k denotes an integer.
In this case, the pitch p2 of the diffraction interference pattern on the light receiving surface can be determined by the following equation (2).P2=p1×(z0+z2)/z0  (2)
When the scale 2 is displaced in the pitch direction of the diffraction grating with respect to the light source 1, the bright/dark pattern projected on the photodetector 3 moves in a displacement direction of the scale 2 with the same space period being kept.
Therefore, provided that a period p20 of a light receiving portion 4 of the photodetector 3 is set to the same value as that of the pitch p2 of the bright/dark pattern determined by the equation (2), because a periodic intensity signal is obtained from the photodetector 3 every time the scale 2 moves by p1 in the pitch direction, the displacement amount of the scale 2 in the pitch direction can be detected.
Returning to FIG. 33 to continue the description, because the surface emitting laser light source 32, and the periodic optical pattern 23 and the photodetector 37 are disposed so as to have a positional relationship in which the above-described Talbot image can be formed and detected, the bright/dark pattern similar to the periodic optical pattern 23 formed on the scale 20 is projected on the photodetector 37. The period of the bright/dark pattern is the period p2 calculated by equation (2), and the photodetector 37 is formed so as to have the period of this p2. Accordingly, a movement of the bright/dark pattern can be detected by the photodetector 37.
Next, a second prior art will be described with reference to FIG. 36. FIG. 36 shows an encoder according to the prior art, in which the light source 1 is disposed at the side opposite to the scale with respect to the semiconductor substrate 5 on which the photodetector 3 is formed.
This encoder in accordance with the second prior art is disclosed, for example, in U.S. Pat. No. 6,603,114.
As shown in FIG. 36, in this encoder, the photodetector 3, a slit 100, and a blind hole 1000 are formed at a semiconductor substrate 5, and the light source 1 is disposed at the side opposite to the scale 2 so as to provide the slit 100 therebetween. The slit 100 is disposed at the depth of the blind hole 1000. This slit 100 is formed from a metallic film 74, and the metallic film 74 is sandwiched from the upper and lower portions by translucent films 76 such as a silicon oxide film.
It is configured such that the light beam emitted from the light source 1 passes through the translucent portion of the slit 100 formed in the depth of the blind hole 100, and irradiates the scale 2, and a signal light modulated by the scale 2 is detected by the photodetector 3 formed on the semiconductor substrate 5. Accordingly, it is configured such that a movement of the scale 2 can be detected on the basis of an intensity change of the signal light.
Because the optical encoder has the features of being highly precise, having a high resolution, being a non-contact type, and being superior in resistance to electromagnetic radiation problems, the optical encoder is utilized in various fields, and especially an encoder requiring high precision and high resolution is mainly of an optical type.

Optical encoder having a light source scale and photodetector and an optical lens module using the optical encoder


A waterproof protective case comprising a shell that at least partially encloses a portable electronic device, the shell having an aperture aligned with an opening of a storage area of the portable electronic device, the protective case including a cap that is removably attached to a stylus of the portable electronic device, the aperture of the shell configured to releasably retain a portion of the cap when the stylus is inserted into the opening of the storage area of the portable electronic device, the cap configured to form a waterproof seal when the cap is retained within the aperture of the shell, the cap configured to remove the stylus from the storage area of the protective electronic device while the portable electronic device is in the waterproof protective case.

Portable electronic devices are commonly used for communication, entertainment, and/or information purposes. Portable electronic devices include devices such as smartphones, cellular phones, mobile communication devices, computers, portable computing devices, mobile computing devices, tablet computers, cameras, video players, audio players, electronic media readers, two-way radios, global positioning satellite (GPS) devices, and/or other types of electronic computing or communication devices, including combinations thereof. Tablet computers and large smartphones often include stylus that can be utilized to interact with the display of the device. A stylus can be made of plastic, metal, or some other rigid or semi-rigid material in the shape of a writing utensil, allowing a user to interact with the display of the device in a more accurate manner than simply using a finger. A stylus can be electronically passive, or it can contain electronics, magnets, and sensors to allow a more accurate and flexible interaction with the device display. For example, the SAMSUNG® NOTE 4 device includes stylus that contains electronics and pressure sensors, and is stored in the housing of the device. The stylus includes a magnet that interacts with the device via a sensor, such as a Hall effect sensor, that allows the device to detect when the stylus is inserted and removed from the device housing.
Portable electronic devices are used in a wide variety of environments that can subject the sensitive components to damage from shock, vibration, impact, external forces, sharp objects, water, dirt, dust, snow, rain, sweat, chemicals, and/or other damaging elements. Protection of an electronic device from water and other liquids while allowing a user to easily access and use an associated stylus is desirable.

Protective case with stylus access feature


A ground fault circuit interrupter device having a feedthrough capacitor for substantially reducing interference from radio frequency signals such as those emitted from cell phones and 2-way radios. The ground fault circuit interrupter device includes a printed circuit board having a system ground terminal and a detection terminal for receiving a fault detection signal. A chip is provided having a ground pin connected to the system ground terminal and an input pin for receiving the fault detection signal. The feedthrough capacitor has a through conductor connected between the input pin and the detection terminal and a capacitor coupled between the through conductor and the system ground terminal.

1. Field of the Invention
This invention relates generally to ground fault circuit interrupters (GFCI's) and more specifically to a GFCI having reduced sensitivity to interference caused by radio frequency signals.
2. Description of the Related Art
Present day GFCI circuits include by-pass capacitors, inductive chokes, and noise filters on signal lines and sensitive parts of the circuitry to the direct current (DC) Ground terminal to suppress interference caused by radio frequencies. While the components that are currently being used are adequate for radio frequency signals used in the past, they are not fully effective for signals in the spectrum of radio frequencies which are now being used. For example, cell phones use signals having frequencies which can interfere with the operation of a GFCI by not only causing nuisance tripping of the GFCI, but can also cause a GFCI to fail by subjecting one or more of the components in the GFCI to excessive stress. What is needed is GFCI circuitry for reducing interference caused by radio frequencies.

Ground fault circuit interrupter with enhanced radio frequency interference suppression


Provided are circuits and methods for a digital controller for an electronic ballast for a fluorescent lamp, comprising a feed-forward loop that provides information about a voltage firing angle, and a pulse width modulator that controls a duty ratio of at least one power switch of the electronic ballast according to the information. The digital controller may include a duty ratio controller implemented in the pulse width modulator. The digital controller may include one or more functions such as dimming, maintaining high power factor throughout the dimming range, low lamp power detection, lamp soft-start, and DC-link capacitor over-voltage detection for end of life protection or lamp failure protection. In one embodiment the ballast is a single stage, single switch ballast.

The demand for fluorescent lighting is increasing primarily because of its greater efficiency relative to other types of lighting, such as incandescent. Fluorescent lamp ballasts made with discrete components may have reduced reliability and be susceptible to problems caused by variations in circuit component tolerances and ambient conditions (e.g., temperature). Furthermore, as fluorescent lamps replace incandescent lamps, there is increased demand for fluorescent lamps to have desirable features of incandescent lamps, such as small size and dimmability. However, such features are difficult to achieve with current ballast and controller technology.
Digital control has been used in several electronic ballast applications. A digital implementation of phase control was suggested in [1]. Digitized versions of variable frequency control have also been suggested in [2] and [3]. Both control methods were applied to a half-bridge resonant inverter where totempole-connected MOSFETS were controlled. However, since half-bridge resonant inverters were used as the ballast power circuit in the above literature, only variable frequency control or phase-shift control could be used to provide basic functions while at the same time, ensure zero voltage switching (ZVS) operation.

This patent is subject to a terminal disclaimer.

Digital controller for an electronic ballast