Apparatus, methods, and program products for storing data address a first cache and a second cache. The second cache is capable of operating in a first mode wherein data read for storage in the first cache is also stored in the second cache, and is capable of operating in a second mode wherein the data stored in the second cache does not include at least some of the data read for storage in the first cache. The data stored in the second cache includes data that has been removed from the first cache. Thus the contents of the second cache are at least partially exclusive of the contents of the first cache. The described apparatus, methods, and program products are advantageously employed in multi-level caching systems wherein the caches may be approximately the same size.

Today's communications systems include many elements such as servers, desktop computers, storage devices, and network systems, all of which include processors and memory. The speeds at which these processors operate have greatly increased as these systems have evolved. Processor speeds have generally increased faster than the speeds of memory devices, for instance dynamic random access memories, that are typically used to implement main memory systems.
One known way to improve the performance of a system including a fast processor and slower main memory is to employ a cache memory between the processor and the main memory. The cache memory is relatively small as compared to the main memory, and is typically constructed of high speed memory devices that are more expensive than the devices used to implement the main memory. Processor accesses to the main memory are stored in the cache. The purpose of the cache is to provide the processor access to high speed memory during a majority of the processor's memory accesses. The processor tends to find the data it needs in the cache because of the principle of "locality of reference", wherein the processor tends to utilize relatively close memory addresses during a given period of time.
The concept of caching has been extended to storage systems. Large storage systems of today can include many gigabytes of data stored on fixed media such as hard disk drives or optical drives. Access to the data on such drives is slower than access to memory devices such as dynamic random access memory. Therefore, some large storage systems contain memory for caching disk data, so that recently accessed disk data can be returned more quickly. The performance of the storage system is thus enhanced.
As system performance requirements increase, caches become more prevalent. It is now likely that a computer system, such as a database server, will contain a cache for caching I/O operations. It is also likely that such a computer system is coupled with another system, such as a storage system, that also contains a cache. It would be desirable to maximize the efficiency of the caching operations in such systems.

This patent is subject to a terminal disclaimer.

Provision of a victim cache within a storage cache hierarchy


The present invention is directed to novel immunogenic compositions that protect swine from disease caused by porcine epidemic diarrhea virus (PEDV). The present invention is also directed to novel immunogenic compositions that protect swine from disease caused by porcine deltacoronavirus (PDCoV), alone or as combination vaccine to protect against PEDV. The compositions of the invention provide killed viruses whose effectiveness is enhanced by the selection of preferred adjuvants. Novel culture methods are also employed to increase reproducible yield of cultured viruses. Live vaccines are also provided from the Calaf14 PEDV isolate.

Porcine epidemic diarrhea (PED) is highly contagious and is characterized by dehydration, diarrhea, and high mortality in swine, particularly young piglets. The causative agent, porcine epidemic diarrhea virus (PEDV), is a single stranded, positive sense RNA virus identified to the Alphacoronoavirus genus of the family Coronaviridae. PEDV has a total genome size of approximately 28 kb and contains 7 open reading frames. Symptoms of PEDV infection are often similar to those caused by transmissible gastroenteritis virus (TGEV), also a member of the Coronaviridae. It should be noted that cross protection between PEDV and TGEV is not generally observed, the overall viral nucleotide sequences being at most about 60% similar.
PED was likely first observed in Europe circa 1970, and the causative virus was subsequently characterized (see for example M. Pensaert et al. Arch. Virol, v. 58, pp 243-247, 1978 and D. Chasey et al., Res. Vet Sci, v. 25, pp 255-256, 1978). PED disease was generally considered unknown in North America until 2013, at which point widespread outbreaks commenced, and severe economic losses to the swine industry resulted. Prototype North American isolates have remained genetically closely related (i.e. with overall nucleotide identity generally over 99%), and are similar to Asian strains characterized there within a few years prior to the North American outbreaks. PEDV generally grows poorly in culture, and there is a need to identify both particular strains and culture conditions that are appropriate for the culturing of sufficient virus for commercial vaccine preparation. Additionally, there is a need to develop vaccines that provide effective cross protection against known isolates of PEDV, and which are expected to provide effective cross protection against evolving, non-prototype PEDV strains.
Additionally, variant strains of PEDV (for example Calaf14, see SEQ ID NOS 1, 4 for S protein sequence) have been recently identified in Europe, which are recognizably different from known European strains. Such variant strains (similar to Calaf14 based on spike protein sequence) have also appeared in North America, and previously in Asia, and may be more similar to each other than to prototype strains. Accordingly, there is a need to identity both vaccine strains and appropriate vaccine compositions that will be effective against current and emerging worldwide outbreaks of PEDV, thus providing needed cross protection.
Porcine deltacoronavirus (PDCoV) is a member of a novel group of coronaviruses which were initially identified as "Group 3c coronaviruses" by Woo et al. (J Virol., 83(2):908-917, 2009) in various avian species. Subsequently, these viruses were reclassified as "deltacoronaviruses", and have been identified in other avian species, as well as in pigs (Woo et al., J Virol., 86(7):3995-4007, 2012; Marthaler et al., Genome Announc., 2(2):e00278-14, 2014; Li et al., Genome Announc., 2(2):e00278-14, 2014; Wang et al., Genome Announc., 2(2):e00291-14, 2014; Wang et al., Emerg. Infect. Dis., 20(7):1227-1230, 2014). The genome size of deltacoronaviruses (˜25-26 kb) is smaller in size than PEDV and other alphacoronaviruses, which can approach 32 kb.
PDCoV has to date been detected at least in Hong Kong, Canada, China and the US, and while the death rate in piglets reported for PDCoV infections (30-40%) is apparently lower than that typically observed with PEDV infection, interpretation of field data is often difficult since co-infections with PEDV and other intestinal pathogens are common (EFSA Journal, 12(10):3877, 2014). While more knowledge on the pathogenesis and clinical implications of PDCoV is needed, this recently-identified virus appears to be an emerging pathogen in pigs. Thus, efficacious vaccine compositions for treating and preventing disease caused by PDCoV are desired, as are combination vaccines that prevent and/or treat both PEDV and PDCoV diseases.

Vaccine compositions for porcine epidemic diarrhea virus and porcine deltacoronavirus


A curved optical device includes a pair of initially flat opposed flexible substrates that may have a fluid material with spacers disbursed therein disposed between the pair of substrates and sealed. The substrates have a uniform controlled distance therebetween. The substrates are permanently curved by applying heat and pressure with a mold while maintaining the controlled distance therebetween. The fluid material maybe a liquid crystal to provide the optical device with enhanced optical properties.

One critical aspect of many optical elements is the curvature of the surface of the element. Indeed, refractive lenses derive their ability to converge or diverge light rays from the difference in curvature of their front and rear surfaces. Similarly, the focal plane of curved mirrors is determined by the mirror curvature. For most lenses and mirror applications, the surfaces in question have a spherical shape. One exception to this are lenses for correcting astigmatism which have a curvature that is a combination of spherical and cylindrical surfaces. The key feature of all these elements is that they have two-dimensional surfaces and, therefore, they have two principle curvatures. For example, a flat surface has both curvatures equal to zero. A cylindrical surface has one curvature zero while the other curvature is non-zero. A sphere may be defined as having both curvatures equal to one another and are non-zero. Accordingly, it will be appreciated that optical elements, with almost no exceptions, are constructed using surfaces for which both curvatures are non-zero and non-equal. Accordingly, those skilled in the art refer to these types of elements as doubly curved.
The most common optical element is the vision-correction lens used in spectacles. For all but the most severe prescriptions, these lenses are meniscus lenses, in which both surfaces are doubly curved. Corrective lenses may be fabricated having one surface doubly curved and the other flat, but this construction is undesirable for esthetic reasons, inasmuch as human faces are also doubly curved. In addition to vision correction, spectacles with doubly curved lenses are worn to protect the eyes from sunlight, glare, and foreign objects, and of course, they are also used as fashion accessories. Other types of eyewear having doubly curved surfaces are goggles, visors, and helmet face plates. Other examples of doubly curved surfaces which light must pass either through or reflect from are windshields, glass block windows, automobile headlamps, skylights, and related optical devices.
For these and many other applications, it is common to affix a solid layer or layers unto the surface of an optical element. The layer or layers usually are affixed to provide additional optical functionality, such as light transmission control, or anti-reflective properties. Accordingly, each additional layer acts as an optical element in its own right and when it is attached to another element, the result is a compound element. Various difficulties arise when attempting to manufacture optical elements and one of these layers is attached to a doubly curved surface. In particular, the layer to be affixed to the doubly curved surface is initially flat. For example, one may create a pair of "mirrored sunglasses" by affixing aluminized Mylar® onto the lenses of an ordinary pair of glasses. It is quickly seen that unless the initially flat Mylar® is either stretched or cut, it cannot be conformally attached to the doubly curved lens surface. Alternatively, the initially flat layer may be affixed by changing the state of the layer material during the affixing process. If the layer is softened, or even melted and affixed to the state, it can be conformally attached. Obviously, the resulting compound optical element must then be operated at a temperature lower than the temperature at which the layer was affixed.
Although affixing solid layers in the manner described above has been accomplished, many more difficulties arise when it is desired to affix multiple layers to an optical element, especially when these two layers are separated from one another by a controlled distance. In other words, this controlled distance provides a gap between the two optical layers and this gap, extending over the area of the optical element, creates an encapsulated volume. This encapsulated volume may be occupied by a fluid substance or substances that perform desired optical, protective, or other functions. One such device is disclosed in U.S. Pat. No. 6,239,778, which is incorporated herein by reference. The resulting compound optical element would then have electronically controllable light transmission. Those skilled in the art will appreciate that maintaining the gap in such devices is critical to ensure correct operation.
Attempts at providing a controlled gap between two doubly curved surfaces with a fluid material therebetween has been found to be quite problematic. One attempt at solving this problem is to employ doubly curved half-lenses which are separated by spacers of the desired gap distance. However, due to the small cell gaps that are required for such devices—on the order of microns—it is difficult to properly align both lenses while maintaining the required gap distance over the entire area of the lenses. It will be appreciated if the proper gap spacing is not maintained, the desired optical properties are likewise unattainable. And it is has been found to be quite difficult to properly shape the outer surfaces of such devices so that they conform to the shape of adjacent optical elements.
Other methods for obtaining ophthalmic lenses can be tailored to correcting individual's vision by cementing together two stock "half-lenses" such that the resulting compound lens has the correct prescription. This method of producing of laminated lenses is described in U.S. Pat. Nos. 4,883,548 and 6,180,033. However, these disclosures do not address the need for maintaining a controlled gap distance between the lenses so that a fluid material can be employed to control light transmission or reflection properties. Accordingly, there is a need in the art for a device and a method for making the same that provides curved surfaces in which a gap can be repeatably maintained between the curved surfaces.

Curved optical device and method having a pair of opposed thermoplastic substrates with spacers therebetween to permanently retain a curved shape


A sensor for detection and measurement of a particular substance present in a liquid is disclosed. The sensor includes a non-circular or non-symmetrically fixed electrode for detection and measurement of a particular substance present in a liquid in which said sensor is submersed. The sensor with non-circular or non-symmetrically fixed electrode and method of using the same reduces or eliminates electrode deformation upon residue removal therefrom thereby prolonging operating life.

Sensors used to measure the presence of a particular substance in a liquid typically use metallic electrodes. Over a period of sensor use, these electrodes must be periodically cleaned. Today, cleaning of sensor electrodes is accomplished using a rotating ceramic cleaning and grinding "stone". The electrode to be cleaned is a relatively thin metallic ring set in a plastic base. To clean the electrode, a planar surface of the rotating ceramic stone is brought into contact with an exposed electrode ring surface that extends beyond the surface of the plastic base. As such, the rotation of the ceramic stone removes residue from the exposed surface of the electrode ring. Over time, both the electrode ring wears down and the ceramic stone wears down. When the ceramic stone wears down, a groove is formed in the formerly planar surface thereof. Upon using such a worn ceramic stone to clean an electrode, the groove formed in the surface of the ceramic stone modifies the grinding and cleaning capabilities of the ceramic stone. As a result, effective grinding and cleaning of the electrode is compromised. In cleaning and grinding an electrode with a worn ceramic stone, the electrode becomes "smeared out" or deformed over a portion of the surface of the adjacent plastic base in which the electrode is set. This smearing or deformation of the electrode changes the surface area and functioning of the electrode. As such, electrode deformation compromises the electrode's signaling capabilities. Because compromises to electrode signaling are unacceptable as causing detection inaccuracies, electrodes and ceramic stones for cleaning and grinding must be replaced often.
Due to capital costs and operational costs associated with frequent electrode and ceramic stone replacement, a need exists for improvement.

Cleaning and grinding of sulfite sensor head


A semiconductor device including a semiconductor substrate, first and second bipolar transistors formed at the major surface of the semiconductor substrate, a Schottky-barrier diode formed on a predetermined area of each of the first and second bipolar transistors, a capacitor formed on each of the first and second bipolar transistors, each capacitor including an insulating layer covering a surface of a respective one of the first and second bipolar transistors, a polysilicon layer formed on the insulating layer in a pattern that extends around the predetermined area, a dielectric film formed covering the polysilicon layer, and a conductive film covering the dielectric film.

1. Field of the Invention
The present invention relates to a bipolar memory cell and, more particularly, to a bipolar memory cell having capacitors and Schottky-barrier diodes (hereafter referred to as SBD).
2. Description of the Prior Art
FIG. 15 is an equivalent circuit diagram showing one memory cell, which includes a bipolar memory. The bipolar memory cell consists of a flip-flop circuit using two bipolar transistors 51, 52 in which a base b1 is connected to a collector n2 of the transistor 52 and an upper word line W1 through a parallel connecting object having a resistor r2, a SBD d2 and a capacitor c2. A base b2 of the transistor 52 is connected to a collector n1 of the transistor 51 and the word line W1 through a parallel connecting object having a resistor r1, a SBD d1 and a capacitor c1. The transistors 51, 52 have two emitters, respectively. One emitter e1d of the transistor 51 is connected to a digit line D1, the other emitter e1h thereof is connected to a lower word line W2. One emitter e2d of the transistor 52 is connected to a digit line D2, the other emitter e2h thereof is connected to the word line W2.
For example, as prior art of the bipolar memory cell, a device structure is disclosed in "SOFT-ERROR CHARACTERISTICS IN BIPOLAR MEMORY CELLS WITH SMALL CRITICAL CHARGE" by Y. Idei et al. in VLSI Symposium circuit, pp. 27-28, 1989. FIG. 14A shows a plane diagram showing a semi-device region of the bipolar memory cell and FIG. 14B is a sectional diagram along an E--E line of the divided FIG. 14A. In general, to form the memory cell the two device regions shown in FIG. 14A are connected by wirings. An N.sup.+ type buried layer 42 is formed on a P type semiconductor substrate 41, an N.sup.- type epitaxial layer 43 is formed on the buried layer 42. Further, the substrate 41 is divided into multiple device regions. The epitaxial layer 43 comprises a base region 46 having two emitter regions 47, high density N type region extending from a capacitor forming region 49 near the substrate surface to the N.sup.+ type buried layer 42, and a platinum silicide layer near a surface of an SBD forming region 48. Moreover, a dielectric film (tantalum pentoxide) may be formed on the high density N type region of the capacitor forming region 49. A barrier metal film is formed on the dielectric film, and extended to a surface of the platinum silicide of the SBD forming region 48. Therefore, a capacitor and an SBD are constructed, respectively.
There is a problem that the bipolar memory cell having the SBD is affected by the so-called soft-error, easily. That is, the flip-flop state is inverted by a current through the OFF-state SBD, for example, in response to a noise current caused by an alpha ray incidence. To solve this problem, it has been considered to increase a junction capacitance by extending the SBD forming region 48, so that the soft-error occurrence may be controlled desirably. However, this causes difficulty in realizing high integration of a semiconductor device. To solve this, the prior art described above proposes to increase the soft-error tolerance by connecting the capacitor formed by using ferroelectric material with the SBD.
Recently, considering the high integration of a semiconductor device, a new bipolar memory cell is desirable which enables further high integration of the semiconductor device. The bipolar memory cell of the prior art described above has a problem in that reduction in the SBD forming region 49 causes a decrease in the soft-error tolerance. Otherwise, a large-capacity capacitor is required to reduce the SBD forming region 49 and maintain the soft-error tolerance. However, an increase in the capacitor capacitance results in a requirement for an expansion of the capacitor forming region 49, and high integration of the semiconductor device is difficult.
Therefore, an object of the present invention is to provide a novel bipolar memory cell which is characterized by a superior soft-error tolerance, and is suitable for a highly integrated memory device.


A method and system is provided for updating a sensor disposed within a mobile unit. The method includes the steps of: a) providing a remote server and at least one sensor, which remote server and sensor are located in the mobile unit and are in communications with one another through a first wireless network, and wherein the sensor has a first functionality; b) receiving an update signal transmitted from a base server to the remote server over a second wireless network; c) transmitting the received update signal from the remote server to the sensor over the first wireless network; and d) reconfiguring the sensor from the first functionality to a second functionality based upon the transmitted update signal.

1. Technical Field
This disclosure relates generally to updating sensors and, more particularly to methods for remotely updating wireless sensors within a mobile unit.
2. Background Information
Typically, modern aircraft have sensor systems that include a plurality of wired or wireless sensors routinely used during operation. The sensors often require routine and/or frequent software updates to meet relevant requirements, to correct problems, and/or to increase the performance of the sensors. Generally, there are two prior art methods utilized to update the software in the sensors. First, each sensor or a part of each sensor (e.g., a memory) may be physically replaced. Second, the sensors may be physically connected via hard wire to an update module configured to load updated software into the sensors. However, these methods require physical interaction with the aircraft. As a result, the sensors generally may only be updated when the aircraft is grounded and being serviced.
What is needed is a method for updating one or more sensors disposed within a mobile unit, such as an aircraft, that overcomes the problems and shortcomings of the prior art.

Method for remotely updating wireless sensors


A fuel cell including a plurality of tubular unit cells each including: a first electrode layer, an electrolyte layer, and a second electrode layer, stacked radially in a direction from a center axis to an outer region thereof; an internal current collector in an interior of the unit cell; and an external current collector arranged at an outer circumferential surface of the unit cell, the external current collector including a plurality of connecting portions configured to electrically connect between the unit cell and at least one another unit cell of the plurality of unit cells, and the connecting portions form two or more electrical paths between a unit cell of the plurality of unit cells and another unit cell of the plurality of unit cells.

1. Field
Aspects of embodiments of the present invention relate to a fuel cell.
2. Description of the Related Art
Solid oxide fuel cells may be categorized as tubular solid oxide fuel cells and planar solid oxide fuel cells. Among these solid oxide fuel cells, the tubular solid oxide fuel cell has a slightly lower power density in a stack itself than the planar solid oxide fuel cell. However, the tubular solid oxide fuel cell has a similar power density in the entire system to the planar solid oxide fuel cell. The tubular solid oxide fuel cell is frequently used because of easy sealing between unit cells that constitute a stack, high resistance to heat stress, and high mechanical strength of the stack.
Tubular solid oxide fuel cells are classified into a cathode-supported fuel cell using a cathode as a support and an anode-supported fuel cell using an anode as a support. Recently, studies on solid oxide fuel cells have been conducted to develop anode-supported fuel cells. Wire made of silver (Ag) or the like is used as a current collector, and current is collected using a method of winding the wire around a cathode.

Tubular solid oxide fuel cell including external current collector with plurality of connection portions


Systems and methods for authorizing a blockchain transaction. A verification network receives a transaction request for the blockchain transaction from a payer device including a first signature generated by a first private key associated with a payer. The verification network broadcasts a verification request to verification system(s) which assess pre-agreed threshold parameters. If the parameter(s) are satisfied, at least one verification system perfects the transaction by generating a second signature using a second private key, and broadcasts the transaction to the blockchain network. If the parameter(s) are not satisfied, verification offer(s) from among the verification system(s) including the second signature(s) are used to prompt the payer device to confirm the blockchain transaction by selecting at least one of the offer(s). The verification network receives selected offer(s) from the payer device and broadcasts the transaction to the blockchain network, in accordance with the selected offer(s) and the transaction request.

The use of blockchain technology for transactions involving digital assets such as cryptocurrencies has become increasingly popular due to the decentralized nature of transactions, the use of a mathematically verifiable ledger, near-immediate settlement, and isolation from operational, technical, or geo-political concentration risks. Although blockchain technology presents these advantages, managing cryptographic keys is burdensome and dangerous, exposing users to the dual threats of electronic theft and accidental loss of assets. Further, with near-immediate settlement comes a lack of "claw-back" reversibility of transactions, increasing the impact of fraud. Accordingly, there is a need to provide the security, safety, and reversibility of traditional centralized payment systems without reinstating concentration risks posed by relying on any single service provider.

Intercontinental Exchange Holdings, Inc.


A voltage booster and a memory structure using the same are provided. When a data storage unit in the memory structure is in normal operation, all voltage pumps in the voltage booster are turned on for boosting a supply voltage. However, when the data storage unit is in standby state, in the voltage booster, some voltage pumps are turned on while other voltage pumps are turned off, for boosting the supply voltage. Accordingly, the standby current and power consumption are reduced and the pump efficiency is improved.

1. Field of the Invention
The present invention generally relates to a memory structure, in particular, to a memory structure having reduced standby current and low power consumption.
2. Description of Related Art
Dynamic random access memory (DRAM) is adopted in many electronic system products as the optimal and indispensable memory solution due to its advantages of low cost and large volume. Presently, DRAM is mainly used in information products, such as desktop computers, notebook computers, DRAM upgrade modules, servers, and workstations etc.
Supply voltage VDD in DRAM has been lowered along with the advancement of fabricating process and increasing demand to low power consumption. However, voltage VPP for turning on word lines in memory cells is still higher than the supply voltage VDD. Accordingly, a voltage booster is required for boosting the supply voltage VDD up to the word line voltage VPP.
Generally speaking, a voltage booster includes a plurality of voltage pumps. Since the supply voltage VDD is being developed lower and lower, the number of voltage pumps used for voltage boosting is getting more and more. However, a large number of voltage pumps may reduce pump efficiency. Pump efficiency PE is defined as following:PE=I—VPP/I—VDD   (1)
In the above formula, I_VDD represents current provided by the power supply, and I_VPP represents current provided by the voltage pumps.
In addition, a memory which is not in operation will be switched to a standby state so as to reduce the power consumption thereof. A high standby current also causes unnecessary power consumption when a memory is in standby state. Moreover, reduced pump efficiency may further increase the standby current and accordingly the power consumption.
Accordingly, a voltage booster having high pump efficiency, low standby current, and reduced power consumption and a memory structure using the voltage booster are provided by the present invention.

Voltage booster and memory structure using the same


A ground connector including a first section and a second section. The first section includes a first member with a threaded post, and a system including a screw configured to clamp the first section against opposite sides of a support. The second section is movably located on the threaded post and configured to directly contact and clamp a conductor towards the support.

1. Field of the Invention
The invention relates to a raised floor system and, more particularly, to grounding in a raised floor system.
2. Brief Description of Prior Developments
It is known in raised floor structures, used in a building having numerous computer or telephone or electrical devices, to provide a grounding network. The understructure of a raised floor system includes multiple pedestals and perhaps stringers and seismic supports. Floor panels are located on top of the pedestals. The panels can include, for example, aluminum panels, or steel panels such as hollow, perforated, grated, concrete filled, wood filled and calcium chloride filled.
A grounding network of a raised floor system can comprise ground conductors or cables arranged in a parallel grid or a perpendicular grid. A ground connector is used to connect the cable to the pedestal of the raised floor system. U.S. Pat. No. 5,286,211 discloses a ground connector where conductors can be clamped directly against a post in two orthogonal orientations. There is a desire for a faster and less expensive way to connect a ground conductor to a pedestal of a raised floor system.


The invention relates to a method for the production of both MOS transistors with extremely low leakage currents at the pn junctions and logic/switching transistors, whose gates are laterally defined by spacers in a p-substrate or a p-well in an n-substrate. The aim of the invention is to provide a method for the production of MOS transistors with extremely low leakage currents that allows for parallel logic/switching transistors. This is achieved by initially carrying out an LDD ion implantation via the edges of the gates in order to form an LDD region and subsequently removing the spacers by means of an anisotropic etching step exhibiting high selectivity in relation to the gate and substrate materials, including the covering layers thereof, or by covering the MOS transistors with an extremely low leakage currents prior to isotropic spacer production such that the spacers are formed exclusively on the edges of the gates of the logic/switching transistors, while the MOS transistors with an extremely low leakage current always remain connected solely via the LDD region, and there is no high dose implantation in the S/D regions of these MOS transistors with extremely low leakage currents.

1. Field of the Invention
The invention relates to a method for the production of MOS transistors with extremely low leakage currents at the pn junctions, and also of logic/switching transistors, whose gates are laterally limited with spacers in a p-substrate or a p-well in an n-substrate.
2. Discussion of the Related Art
In standard DSM-MOS transistors (DSM: Deep Submicron Silicon Technology), the poly/silicide/salicide gates are provided with spacers to limit the leakage currents. In this manner, different materials are superimposed in the regions between the spacers. As a general rule, though, these materials are not exclusively silicon, polysilicon, silicon oxides and silicon nitrides. These materials naturally have different material properties, such as different coefficients of expansion. In connection with the deposition temperatures and the temperature loads that in particular the spacers experience during the overall production process, a mechanical stress arises at the spacer edges, among other places, finally resulting in increased leakage currents. These increased leakage currents are also initiated or increased via the implantation of high As doses (e.g., >E15/cm2).
Furthermore, lattice defects cannot be completely annealed out because of the limited thermal budget of the production process, so that leakage currents can likewise be generated. The pn leakage currents are entirely acceptable for digital CMOS applications, but not for analog dynamic memories (e.g., image sensors). These leakage currents would substantially degrade the image information in the image sensors.
One known way to reduce these leakage currents is to perform an additional deep p diffusion, while retaining the spacers and the high-dose As implantation. This does not eliminate the causes of the leakage current, but reduces the effects of the leakage current. The defects are now within n regions, where most of them are inactive. However, a statistical number of these defects "grows" out of the additional p diffusion regions, and is hence active again. It is hardly possible to prevent that, so that significant and difficult to quantify yield risks remain and arise.
However, since diffusion is not just vertical, but also lateral, this leads to greater channel length, lower packing densities, increased parasitic elements (e.g., capacitances, propagation times), lower performance and, finally, higher costs.

Method for the production of MOS transistors


Permanent magnets are implanted in bone to unload compressive forces at joints using the repulsive force therebetween. A porous metal container is implanted first and becomes fixed in place by bone growth. The permanent magnet is then inserted in the container and retained in place. A magnet prescription system includes a display and input device which enables a user to alter parameters such as magnet size, strength and placement and calculate and display the repulsive force that will result.

The field of the invention is the implantation of permanent magnets in bone to reduce the contact pressure between bones at a joint or between a bone and a prosthetic device.
Primary osteoarthritis is a disabling condition, which destroys the joint surfaces through degenerative changes, as age advances. It is the leading cause of limitations in activities of daily living and is second only to heart disease in causing work disability. The direct traditional medical costs and indirect economic and wage loss from arthritis in individuals in the United States has reached an excess of $65 billion annually. In 1994, the Center for Disease Control, reported that by the year 2020, osteoarthritis will have the largest increase in the numbers of new patients of any disease in the United States.
Initial management of most arthritis patients includes changes in lifestyle, NSAIDs, analgesics, physical therapy, bracing and ambulatory aids. Surgical treatment comes into play only when consecutive treatment fails to improve the symptoms. Common surgical options include arthroscopic debridement of the knee, high tibial osteotomy, and unicompartmental or tricompartmental knee replacement, depending on the predominantly involved compartment. Surgical procedures, short of joint replacement surgery or high tibial osteotomy which include arthroscopic lavage, microfracture, chondrocyte or osteochondral transplants are not cost effective and have no reliable long term results.
High tibial osteotomy is mostly done in patients who have osteoarthritis and have varus malaligned knees. It relieves pressure from the medial joint line and redistributes the body weight passing through the knee so that the lateral compartment, which is relatively spared from the wear and tear process of osteoarthritis, can bear most of the weight. Pain is relieved and function is restored in more than 60% of the patients even 10 years after the operation. The results are best if at least 7 to 10 degrees of valgus alignment is achieved at operation and the weight of the person is not more than 30% of the ideal body weight. Clearly, procedures which reduce the pressure between arthritic bones reduces pain.
The idea of implanted magnets to produce forces between bones at a joint or between a bone and a prosthesis has been known for many years. The use of permanent magnets in bones to either assist in holding joints together or to reduce pressure between two bones at a joint or a bone and a prosthesis was disclosed initially in U.S. Pat. No. 4,024,588. More recently the use of arrays of permanent magnets implanted in bone have been disclosed in U.S. Pat. Nos. 5,507,835; 5,879,386; and 6,387,096 and published U.S. Appln. 2002/0032484A1. The permanent magnets are either mounted in prosthetic elements which are fastened to a bone, or the permanent magnets are encased in a biocompatible material and inserted into a hole drilled in the bone.
There are two practical problems with prior magnet implantation methods which have precluded their clinical use. First, there is no method suitable for clinical use to determine the strength of permanent magnets to be implanted and there is no suitable method for implanting the permanent magnets in bone.

Implantation of magnets in bone to reduce contact pressure

Mayo Foundation for Medical Education and Research


An electric drive device includes a housing with a motor-housing-side annular groove portion formed on an outer peripheral surface of an end surface portion of the housing, on an opposite side to an output portion of a rotation shaft of an electric motor section. The groove portion is formed by an annular groove retreating inward in the radial direction orthogonal to the axial line of the housing. A metal-cover-side distal end portion is formed at the opening end of a metal cover covering an electronic control unit that controls the electric motor section, and faces the groove from the outer side. A space between the groove portion and the distal end portion is filled with a liquid sealant, and an annular inclined surface is inclined so it is widened outward in the radial direction of the metal cover is formed on the inner peripheral surface of the groove portion.

In a general industrial machine field, although a mechanical system control element is driven by an electric motor, recently, a so-called mechanically and electrically-integrated electric drive device in which an electronic control unit composed of a semiconductor element for controlling the rotation speed and the rotation torque of an electric motor is integrally incorporated in the electric motor has been adopted.
As an example of the mechanically and electrically-integrated electric drive device, for example, in an electric power steering device of a vehicle, the rotation direction and the rotation torque of a steering shaft which is rotated by the operation of a steering wheel by a driver are detected, and, based on the detected values, an electric motor is driven so as to rotate in the same direction as the rotation direction of the steering shaft, so as to generate steering assist torque. In order to control the electric motor, an electronic control unit (ECU: Electronic Control Unit) is provided to the power steering device.
As a conventional electric power steering device, for example, one described in a Japanese Patent Application publication No. 2015-134598 (patent document 1) has been known. In the patent document 1, an electric power steering device composed of an electric motor section and an electronic control unit is described. An electric motor of the electric motor section is accommodated in a cylindrical motor housing made of, for example, an aluminum alloy, and a substrate mounting electronic components of the electronic control unit is attached to a heat sink which functions as an ECU housing disposed on the opposite side to the output shaft in the axial direction of the motor housing.
The substrate attached to the heat sink is provided with a power source circuit part, a power conversion circuit part having a power switching element, such as IGBT or MOSFET for driving and controlling the electric motor, and a control circuit part for controlling the power switching element, and the output terminal of the power switching element is electrically connected with the input terminal of the electric motor via a bus bar.
Then, power is supplied from a power source to the electronic control part attached to the heat sink via a connector case made of synthetic resin, and detected signals of a driving condition and the like are supplied thereto from detection sensors. The connector case functions as a lid, and is fixed to the outer peripheral surface of the heat sink with fixing screws so as to be fixed to tightly close the heat sink.
In addition, although, as an electric drive device integrating an electronic control device, an electric brake and an electrohydraulic controller for various hydraulic controls have been known, in the following explanation, an electric power steering device will be explained as a representative.

Electric drive device and electric power steering device


There is provided a signal processing apparatus including a focus position control unit that controls transmission focus positions to be focus positions of transmission waves transmitted by a plurality of ultrasonic vibrators and reception focus positions to be focus positions of reception waves received by the plurality of vibrators on the basis of position information regarding relative positions of the plurality of ultrasonic vibrators of which the relative positions are changeable.

The present disclosure relates to a signal processing apparatus, a signal processing system, a probe, a signal processing method, and a program, and particularly, to a signal processing apparatus, a signal processing system, a probe, a signal processing method, and a program that are suitable for imaging an ultrasonic image.
In a conventional ultrasonic diagnostic apparatus that images an ultrasonic image, beamforming for individually controlling timing (a delay amount) when each vibrator in a probe transmits or receives an ultrasonic wave to control focus positions of a transmission wave and a reception wave is performed.
In the conventional ultrasonic diagnostic apparatus, because the position of each vibrator in the probe is fixed, the delay amount to perform the beamforming is calculated previously on the basis of the position and is stored as a fixed value in a storage device of the apparatus.
Conventionally, technology for calculating a delay amount to perform beamforming on the basis of arrangement information of vibratos in a probe has been suggested (for example, refer to Japanese Laid-Open Patent Publication No. 5-31107). Conventionally, technology for connecting a plurality of probes, providing angle sensors in connection portions of the probes, calculating a relative position relation of ultrasonic images imaged using the probes on the basis of angles detected by the angle sensors, and synthesizing the ultrasonic images has been suggested (for example, refer to Japanese Laid-Open Patent Publication No. 2005-137581).

Signal processing apparatus, signal processing system, probe, signal processing method, and program


The present invention is an orally administered liquid pharmaceutical composition that demonstrates excellent physical stability while delivering concentrated levels of the pharmaceutical active(s). Specifically, these compositions for extended periods do not allow the active to precipitate or settle out of solution. Among the advantages of this invention is that the compositions do not require agitation/shaking prior to use as a method to re-suspend or dissolve active drug material to insure even and consistent dosing.

Pharmaceutical actives are generally delivered using dosage forms designed to promote ease in using while encouraging maximum efficacy of the active. Among the challenges regarding creating dosage forms taken by mouth is formulating such a product in a form small enough to be easily swallowed.
When the desired dosage form is a liquid, then the pharmaceutical actives or actives must be solubilized in a vehicle wherein the composition is easy to use and maximizes therapeutic effectiveness. One such composition is a pharmaceutical suspension. A suspension is where solid active particles are dispersed within a liquid vehicle. Although suspensions are a very useful way to concentrate an active in a small volume, they possess some inherent disadvantages. One disadvantage is that over time the active particles settle to the bottom or float to the top of the liquid, resulting in a suspension that is not homogenous. Thus, a patient who uses a suspension in such a condition is likely to receive more or less active than the intended dose. In some cases this could result in a consumer taking a high and potentially a hazardous dose or conversely, a dose that lacks the minimum level of active required to provide the intended therapeutic benefit. Another disadvantage of suspensions relates to absorption of the active. For absorption to take place, a pharmaceutical active must first be in a solubilized state. Thus, suspensions that contain actives not previously solubilized must undergo dissolution in bodily fluids prior to absorption. Such a dissolution step may slow down the onset of the desired therapeutic effect.
In light of the disadvantages of suspensions mentioned above, those skilled in the art have created solutions in the form of elixirs and syrups for delivery of actives. These solutions can be easily and conveniently swallowed in 5, 10 or even 50 ml volumes. In certain cases, however, it is desirable to deliver the active in a true solution that is in a small volume of less than about 3 ml, even less than 1 ml. Up to now, achieving such small volumes has been problematic and for some actives nearly impossible. The problem is exacerbated where the dose level of the active is required to be large, or wherein the active agent is especially insoluble in the usual vehicles used for pharmaceuticals.
Liquid-filled, soft gelatin capsules were developed in response to this challenge. There are, however, limits to using such capsules. One limitation is when the requisite level of actives cannot be contained in a small volume. Liquid-centered, soft gelatin capsules containing acetaminophen has been the subject of a great deal of effort in order to solve problems such as those mentioned above. For example, in U.S. Pat. No. 5,505,961, assigned to R. P. Scherer reputes to have solved such problems associated with soft gelatin capsules, particularly where high dose levels of acetaminophen is required to provide therapeutic benefits. It is disclosed therein that acetaminophen, with or without other actives, is soluble in solvents including polyethylene glycol, water, propylene glycol, a solubilizing agent including potassium (or sodium) acetate and polyvinylpyrrolidone or PVP. It is disclosed therein, PVP is essential for inhibiting crystallization in such compositions. PCT Application WO 93/00072, Coapman, discloses a process for solubilizing pharmaceutical actives considered difficult to solubilize. This process requires PVP to aid in solubilizing the active agent and preventing precipitation. Similar limitation are disclosed for the acetaminophen solutions described in PCT Application WO 95/23595, by Dhabhar, wherein PVP is disclosed as an essential component of the compositions that are the subject matter of the patent.
PVP is a high molecular weight polymer that while inhibiting crystallization, also is responsible for increasing compositional viscosity of the liquid compositions. Such a viscosity increase is not significant for products contained in capsules intended for swallowing. The high viscosity associated with such liquid compositions containing PVP, however, does inhibit effective oral dosing of low volume products particularly from exact dosing implements such as medicine droppers, oral syringes, dosing cups and sachets. High viscosity liquid compositions are an impediment to being easily dosed from these types of exact dosing implements and do not spread easily over large surface areas of oral mucosal tissue.
When avoiding PVP and its related problems, new problems associated with oral dosing can develop. For example, U.S. Pat. No. 5,360,615, assigned to R. P. Scherer, discloses solubilizing the active by adding acid or base to cause the partial ionization of the active. It has been found, however, that this approach is undesirable in the case of liquid solutions to be delivered into the mouth for absorption through mucosal membranes since the active's ionization inhibits such absorption.
One very important consideration in choosing a product form, therefore, is determining the active's intended delivery site within the body. The prior art describing medicaments to be delivered to the stomach include liquid-center gelatin capsules. The liquids contained in these capsules are not intended to contact the body until the gelatin shell dissolves in the stomach. In such a product it is superfluous whether the liquid in the gelatin is highly viscous, or even a paste or solid. For administration into the mouth, however, the composition's ability to flow is critical. Low viscosity liquids permit accurate administration from current or developing exacting dispensing or dosing devices for administering a liquid composition to a person. Low viscosity liquids are easier to swallow and make the composition acceptably palatable. Such consumer acceptance is very important for encouraging consumers to comply with dosing instructions to receive the intended therapeutic benefit. Aside from the aesthetic considerations, it's desired that the formulation spread over a large surface area of mucosal tissue to enhance the diffusion of the respective actives within the formulation through the mucosal membranes.


A high strength, high modulus structural fabric product and the method of manufacturing the product are disclosed. The incorporation of a specific fiber/fabric treatment coupled with a resin impregnation and coating process produces a composite material. This composite material comprises high strength and modulus fibers embedded in and linked to a matrix. The resulting fabric product is useable in the formation of seamed structures, which carry and distribute high-level loads under extreme environmental conditions.

Woven or knitted fabrics coated with a resin such as Poly-Vinyl Chloride (PVC), polytetrafluorethylene (PTFE), urethane or other suitable resin have been used to provide structures. The fibers or fiber bundles of the woven fabric are coated with a resin, thereby forming a matrix surrounding the fibers. The matrix material is typically the medium, by which seams in the construction, can transfer load across the joints in the fabric. One example of such a structure is a radome, which is a dome shaped protective housing used to cover a radar antenna. A radome may be subject to a severe set of conditions such as supporting heavy loads for extended periods of time at extreme temperatures and humidity.
Traditional fabric structures apply resin-based coatings to the fabric substrate via 'knife-over-roll' or film lamination techniques. In order to take structural advantage of a fiber structure, applied loads should be able to transfer from one fiber bundle to another and the full load capability of the fabric should be able to be transferred across joints in the fabric. The resin system applied to the fabric assists with load transfer. However, the effectivity of this load transferring ability is directly related to the interface between the fiber and the resin. This interface is dependent both on the volume of surface contacted, the linkage between the fiber surface and the resin, and the resin properties. When a fabric is coated with resin, the coating is only in contact with the exposed outer surface of the fiber bundles and, effectively, the fiber/resin product (also referred to as the fabric product) is full of voids or air pockets within the fiber bundles. When an applied load encounters a void, the load cannot be transferred or carried from fiber filament to filament. The propagation of the load effectively stops and a stress concentration develops that eventually exceeds the fabric load resistance, resulting in a failure of the fabric product. This effect is most pronounced at the fabric seam locations where the fiber bundles are not continuous across the joint.
A drawback associated with these coated woven fabrics and seams is that when they are utilized to provide a structure such as a radome, they typically do not withstand the long duration, high level working loads and extreme environmental conditions.
One attempt to resolve the above-mentioned drawback was to increase the base fabric load carrying capability, load transfer capability and fiber bundle load sharing capability by modifying existing fabric weave designs. These attempts did not produce a fabric/seam system product, which could withstand the working loads and environmental conditions mentioned above. Another attempt to overcome the above mentioned drawback involved development of new fabric/fiber technology. Although this attempt utilized innovative fiber and fabric designs, this attempt relied on traditional fabric coating technology that failed to achieve the required combination of properties between the fiber system and the resin matrix, resulting in premature seam failure. The net result of both attempts was unacceptable operation in the area of seam performance of the structure.

High strength, long durability structural fabric/seam system


Provided are methods and systems for monitoring cardiac function. A series of heartbeat waveforms is collected during a pre-determined time period. The series is collected either from an individual or a plurality of individuals. A heartbeat waveform space is generated based on the series of heartbeat waveforms. A test heartbeat waveform is projected onto the heartbeat waveform space. The projected heartbeat waveform is subtracted from the test heartbeat waveform to obtain a pathology descriptive deflections (PDD) vector. A score is calculated based on the PDD vector. Based on the score, a clinical indication associated with at least one disease is provided. The clinical indication includes a warning message regarding an upcoming cardiac episode or a measure of progression or regression of at least one cardiac pathology.

It should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.
The first practical electrocardiogram (ECG) was invented over 100 years ago, and its usage basically remains unchanged. The ECG revolutionized the diagnosis and management of cardiac pathology; however, an ECG diagnosis alone is often insufficient as it provides only partial information on cardiac function.
For example, once a myocardial infarction (MI) is detected, an ECG diagnosis is highly specific and effective in localization of the related ischemia. However, when used for screening, ECG diagnostics reveal only about 50% of life threatening MIs in patients admitted with chest pain, which is why biochemical marker analysis, despite being non real-time, is commonly used for a more definitive diagnosis.
Given that coronary artery disease is a main cause of morbidity and mortality in the modern world, and that therapeutic measures are more effective when administered early rather than late, there is a clear need for fast, sensitive, and specific means for early detection of cardiac pathology.

Monitoring procedure for early warning of cardiac episodes


A reticle pod includes an outer pod, an inner pod cover and an inner base plate. A reticle is supported on the base and is contained within the environment created by the inner pod cover and the inner pod base. The inner pod cover can include a plurality of reticle retainers configured to contact a side wall of the reticle and limit movement of the reticle in a horizontal direction.

One of the process steps commonly encountered in the fabrication of integrated circuits and other semiconductor devices is photolithography. Broadly, photolithography involves selectively exposing a specially prepared wafer surface to a source of radiation using a patterned template to create an etched surface layer. Typically, the patterned template is a reticle, which is a very flat glass plate that contains the patterns to be reproduced on the wafer. For example, the wafer surface may be prepared by first depositing silicon nitride on it followed by a coating of a light-sensitive liquid polymer or photoresist. Next, ultraviolet (UV) light is shone through or reflected off a surface of a mask or reticle to project the desired pattern onto the photoresist-covered wafer. The portion of the photoresist exposed to the light is chemically modified and remains unaffected when the wafer is subsequently subjected to a chemical media that removes the unexposed photoresist leaving the modified photoresist on the wafer in the exact shape of the pattern on the mask. The wafer is then subjected to an etch process that removes the exposed portion of the nitride layer leaving a nitride pattern on the wafer in the exact design of the mask. This etched layer, singly or in combination with other similarly created layers, represent the devices and interconnects between devices characterizing the "circuitry" of a particular integrated circuit or semiconductor chip.
With EUV, reflection from the patterned surface is used as opposed to transmission through the reticle characteristic of deep ultraviolet light photolithography. Consequently, the reflective photomask (reticle) employed in EUV photolithography is susceptible to contamination and damage to a far greater degree than reticles used in conventional photolithography. Unnecessary and unintended contact between the reticle and other surfaces during manufacturing, processing, shipping, handling, transport or storage is undesirable in view of the susceptibility of the reticle's delicate features to damage due to sliding friction and/or abrasion.

Reticle pod having side containment of reticle


A device for data communications between a Wireless Application Protocol (WAP) terminal and a WAP server, and a data communication method thereof. The data communications device includes: a plurality of WAP terminals each having a protocol stack in which a Circuit Switch Data service (CSD) protocol layer is laid under a Wireless Transaction Protocol (WTP) layer and a Wireless Datagram Protocol (WDP) layer, for generating WAP data which is service request data; a plurality of WAP servers each having a protocol stack in which a Transmission Control Protocol (TCP) layer and an Internet Protocol (IP) layer are laid under a WTP layer and a WDP layer, for providing the WAP terminals with WAP server data according to the WAP data; and an interworking function (IWF) unit having a CSD protocol layer connected to the CSD protocol layers of each WAP terminal, and a TCP layer and an IP layer which are connected to the TCP and IP layers of each WAP server, for mapping the WAP terminals to the corresponding WAP servers, wherein each WAP terminal communicates with the IWF unit though a single Internet Protocol/Peer-to-Peer Protocol (IP/PPP) layer included in its own CSD protocol layer, and the IWF unit communicates through the Internet with each WAP server. Because there is no redundancy of IP/PPP protocol layers in the WAP terminal, overhead is considerably reduced. Also, the IWF unit is directly connected through the Internet to the WAP server, not through the PSTN and the ISP, so that connection time and costs can be reduced.

1.Field of the Invention
The present invention relates to data communications, and more particularly, to a device for data communications between a Wireless Application Protocol (WAP) terminal and a WAP server, and a method thereof.
2. Description of the Related Art
In general, a WAP server is connected between an Internet server which provides various information and a WAP terminal capable of receiving the information provided from the Internet server, to convert different data formats and different protocols between the Internet server and the WAP terminal. Also, the WAP server can provide the WAP terminal with its own information.
FIG. 1 is a block diagram of a conventional data communications device between a WAP terminal and a WAP server.
The data communications device of FIG. 1 comprises a WAP terminal 10, an interworking function (IWF) unit 12, a public switched telephone network (PSTN) 13, an Internet service provider (ISP) 14 and a WAP server 16.
The IWF unit 12 performs routing functions between the WAP terminal 10 and the ISP 14. The ISP 14 is one of companies providing general communication service such as HITEL or UNITEL. The WAP server 16 provides the WAP terminal 10 with its own information and much information from an Internet server (not shown).
FIG. 2 shows a protocol stack of each block of the data communications device shown in FIG. 1.
A protocol stack of the WAP terminal 10 consists of a plurality of protocol layers including a Circuit Switch Data services protocol (CSD(IS-707)), a Peer-to-Peer Protocol (PPP), an Internet Protocol (IP), a Wireless Transaction Protocol (WTP) and User Data Program Protocol (UDP), a Wireless Session Protocol (WSP) and a Wireless Application Environment protocol (WAE). Also, the CSD(IS-707) includes an IS-95 protocol, a Radio Link Protocol (RLP), a PPP, an IP and a TCP. The protocol layers are well known to those skilled in the art, so explanation thereof will be omitted.
FIG. 4 is a diagram illustrating data flow in the data communications device shown in FIG. 1.
The operation of the data communications device of FIG. 1 will be described with reference to FIG. 4.
It is assumed that the WAP terminal 10 intends to receive Internet or electronic mail (E-mail) services. Here, the WAP terminal 10 is ready to-receive a common call or data (Internet or E-mail) in a normal state. When a user of the WAP terminal 10 connects the WAP terminal 10 through the IWF unit 12 and the PSTN 13 to the ISP 14 using a telephone number for connection with the Internet, the ISP 14 connected to the WAP terminal 10 allows the user to receive the Internet or E-mail services. Also, when the user wants to stop receiving the Internet services, the ISP 14 disconnects the call from the WAP terminal 10, returning to the ready state.
In detail, the WAP terminal 10 sends an Origination Message requesting connection of its call to the IWF unit 12. The IWF unit 12 receives the Origination Message from the WAP terminal 10, and then sends an Origination Ack message acknowledging reception to the WAP terminal 10. The IWF unit 12 sends a Connect Request message for connection of a modem to the ISP 14. The ISP 14 receives the Connect Request message and sends a Connect  less than rate greater than  message indicating the connection of the modem through the PSTN 13 and the IWF unit 12 to the WAP terminal 10. Under conditions that the WAP terminal 10 and the IWF unit 12 are connected to each other, the WAP terminal 10 sends WAP data (Internet or E-mail services request data) which the user Wants to receive through the IWF 12 and the ISP 14, to the WAP server 16. After the WAP server 16 receives the WAP data, the WAP server 16 sends WAP server data which is retained in the WAP server itself, or data taken from an Internet server (not shown) through the ISP 14, the PSTN 13 and the IWP 12 to the WAP terminal 10.
The data communications device of FIG. 1, having the protocol stack as shown in FIG. 2, has the following problems.
First, because the CSD(IS-707) in the protocol stack of the WAP terminal 10 includes the IPIPPP as shown in FIG. 3, the protocol stack of the WAP terminal 10 has IP/PPP protocol layers in duplicate. As a result, there is much overhead during transmission of data, so that transmission efficiency becomes low. That is, the resources of the terminal are not efficiently used. Also, when a user intends to connect to the WAP server 16 or the Internet, connection with the ISP 14 is achieved through the PSTN 14. Thus, the connection rate becomes slow, and using the PSTN and the ISP 14 may be subject to charges by the telephone company or the ISP. Also, the transmission of data is inefficient because it requires multiple steps as shown in FIG. 4.
To solve the above problems, it is a first object of the present invention to provide a device for data communications between a Wireless Application Protocol (WAP) protocol and a WAP server, adopting a protocol stack in which a single Internet Protocol/Peer-to-Peer Protocol (IP/PPP) layer included in a Circuit Switch Data services (ISD) protocol of the WAP terminal is used and an interworking function (IWF) unit also acts as an Internet service provider (ISP).
It is a second object of the present invention to provide a communication method of the data communications device for the first object.
It is a third object of the present invention to provide a device for data communications between a WAP terminal and WAP server, which performs data communications while performing switching between the WAP terminal and a non-WAP terminal.
It is a fourth object of the present invention to provide a communication method of the data communications device for the third object.
Accordingly, to achieve the above first object, there is provided a device for data communications between a Wireless Application Protocol (WAP) terminal and a WAP server, comprising: a plurality of WAP terminals each having a protocol stack in which a Circuit Switch Data service (CSD) protocol layer is laid under a Wireless Transaction Protocol (WTP) layer and a Wireless Datagram Protocol (WDP) layer, for generating WAP data which is service request data; a plurality of WAP servers each having a protocol stack in which a Transmission Control Protocol (TCP) layer and an Internet Protocol (IP) layer are laid under a WTP layer and a WDP layer, for providing the WAP terminals with WAP server data according to the WAP data; and an interworking function (IWF) unit having a CSD protocol layer connected to the CSD protocol layers of each WAP terminal, and a TCP layer and an IP layer which are connected to the TCP and IP layers of each WAP server, for mapping the WAP terminals to the corresponding WAP servers, wherein each WAP terminal communicates with the IWF unit through a single Internet Protocol/Peer-to-Peer Protocol (IP/PPP) layer included in its own CSD protocol layer, and the IWF unit communicates through the Internet with each WAP server.
To achieve the second object, there is provided a communication method of a data communications device including a plurality of WAP terminals having a protocol stack in which a Circuit Switch Data service (CSD) protocol layer is laid under a Wireless Transaction Protocol (WTP) layer and a Wireless Datagram Protocol (WDP) layer, a plurality of WAP servers having a protocol stack in which a Transmission Control Protocol (TCP) layer and an Internet Protocol (IP) layer are laid under a WTP layer and a WDP layer, and an interworking function (IWF) unit having a CSD protocol layer connected to the CSD protocol layers of each WAP terminal, and a TCP layer and an IP layer which are connected to the TCP and IP layers of each WAP server, for communications between each WAP terminal and each WAP server, the method comprising the steps of: (a) transferring an Origination Message for a call connection from each WAP terminal to the IWF unit, and transferring an Origination ACK from the IWF unit to the corresponding WAP terminal in response to the Origination Message; (b) receiving WAP data which is service request data for the WAP servers from the WAP terminals, to map each WAP terminal to the corresponding WAP server in the IWF unit, and transferring the received WAP data through the Internet to the corresponding WAP server; (c) receiving the WAP data to generate WAP server data according to the received WAP data in each WAP server, and transferring the WAP server data through the Internet to the IWF unit; (d) receiving the WAP server data transferred in the step (c) to map the WAP servers to the corresponding WAP terminals in the IWF unit, and transferring the received WAP server data to the corresponding WAP terminals; and (e) communicating in the WAP terminals with the IWF unit through a single Internet Protocol/Peer-to-Peer Protocol (IP/PPP) layer contained in each Circuit Switch Data service (CSD) protocol layer of the WAP terminals.
To achieve the third object, there is provided a device for data communications between a Wireless Application Protocol (WAP) terminal and a WAP server, comprising: a plurality of WAP terminals each having a protocol stack in which a Circuit Switch Data service (CSD) protocol layer is laid under a Wireless Transaction Protocol (WTP) layer and a Wireless Datagram Protocol (WDP) layer, for generating WAP data which is service request data; a non-WAP terminal for generating a common circuit data; a plurality of WAP servers each having a protocol stack in which at least a Transmission Control Protocol (TCP) layer and an Internet Protocol (IP) layer are laid under a WTP layer and a WDP layer, for providing the WAP terminals with WAP server data according to the WAP data; an Internet server for providing the non-WAP terminal with Internet server data according to the common circuit data; an Internet service provider (ISP) having a public switched telephone network (PSTN) circuit layer, for transferring the common circuit data received through a PSTN from the non-WAP terminal, to the Internet server; and an interworking function (IWF) unit having a CSD protocol layer connected to the CSD protocol layers of each WAP terminal, and a TCP layer and an IP layer which are connected to the TCP and IP layers of each WAP server, for performing interfacing between each WAP terminal and each WAP server, and the non-WAP terminal and the ISP, wherein each WAP terminal communicates with the IWF unit through a single Internet Protocol/Peer-to-Peer Protocol (IP/PPP) layer included in its own CSD protocol layer, and the IWF unit communicates through the Internet with each WAP server.
To achieve the fourth object, there is provided a communication method of a data communications device including a plurality of WAP terminals each having a protocol stack in which a Circuit Switch Data service (CSD) protocol layer is laid under a Wireless Transaction Protocol (WTP) layer and a Wireless Datagram Protocol (WDP) layer, a non-WAP terminal for generating a common circuit data, a plurality of WAP servers each having a protocol stack in which at least a Transmission Control Protocol (TCP) layer and an Internet Protocol (IP) layer are laid under a WTP layer and a WDP layer, an Internet server for providing the non-WAP terminal with Internet server data according to the common circuit data, an Internet service provider (ISP) having a public switched telephone network (PSTN) circuit layer, for transferring the common circuit data received through a PSTN from the non-WAP terminal to the Internet server, an interworking function (IWF) unit having a CSD protocol layer connected to the CSD protocol layers of each WAP terminal, and a TCP layer and an IP layer which are connected to the TCP and IP layers of each WAP server, for data communications between each WAP terminal and each WAP server, the method comprising the steps of: (a) determining whether data input to the IWF unit is WAP data or the common circuit data; (b) transferring the WAP data through the Internet to the corresponding WAP server if the input data is determined to be the WAP data in the step (a) and transferring the common circuit data through the ISP to the Internet server if the input data is determined to be the common circuit data in the step (b); (c) determining whether the data input to the IWF unit is WAP server data or the Internet server data; and (d) transferring the WAP server data through the Internet to the corresponding WAP terminal if the input data is determined to be the WAP server data in the step (c), and transferring the Internet server data through the PSTN to the non-WAP terminal if the input data is determined to be the Internet server data in the step (c), wherein each WAP terminal communicates with the IWF unit through a single Internet Protocol/Peer-to-Peer Protocol (IP/PPP) layer included in its own CSD protocol layer.

Device for data communications between wireless application protocol terminal and wireless application server, and method thereof


A pulse signal drive circuit includes an energy storage device. A source of energy supplies a substantially constant flow of energy to the energy storage device. A switch circuit draws repetitive pulses of substantially constant energy from the energy storage device to generate corresponding pulse drive signals.

In an SpO2 transducer, light is generated by LEDs in response to pulse drive signals of substantially constant current through the LEDs. The optical signals produced by the LEDs are received by a photo-detector and converted to an electrical signal. The LEDs are sometimes conditioned to produce relatively low light levels (e.g. relatively low substantially constant current pulses). Under these operational conditions, it is possible for electronic (e.g. semiconductor) circuitry to induce sufficient noise in the driving pulse signals to become significant in subsequent generation of optical signals, and in reception and processing of the optical signals by the photo-detector. In addition, existing drive circuits draw pulses of current from a local power supply. The drawing of such pulses of current causes fluctuations in the power supply voltage output signal. These voltage fluctuations, in turn, induce corresponding fluctuations in signals within receiver circuitry, termed power supply crosstalk. Because of the timing of these disturbances, the receiver circuitry can incorrectly interpret them as representative of a received optical signal, thereby inducing a noise component into the received signal.


A polyester resin decreased in the amount of an organic gas generated therefrom during molding thereof and during use thereof at high temperatures, having a substantially linear structure mainly comprising constituent units of an aromatic dicarboxylic acid or an aliphatic dicarboxylic acid and constitutional units of an aliphatic diol, the terminals thereof are substituted by a monofunctional compound having a carboxyl or hydroxyl group, and the hydroxyl terminal group content thereof is 40 meq/kg or less.

1. Technical Field of the Invention
The present invention relates to a polyester resin decreased in the amount of an organic gas generated therefrom during molding thereof and during use thereof at high temperatures, and a process for preparing the same.
2. Description of Related Art
Polyester resins such as copolymers comprising a polybutylene terephthalate or polybutylene naphthalate and further a polytetrahydrofuran and adipic acid as the constituent units are used as materials for electric components and automotive parts by taking advantage of excellent properties of them. Particularly, in recent years, they have come to be used under severe conditions including a high temperature and a high humidity. When an ordinary polyester resin is used for such a purpose, it is easily hydrolyzed or pyrolyzed to generate a gas. Particularly when the resin is positioned near an electric contact, problems are posed that, for example, the generated gas is carbonized by the arc discharge to form a deposit near the electric contact to cause an abnormal conduction at the contact. Since this problem is serious particularly in a low-molecular material excellent in fluidity, the compatibility of a high fluidity with a decreased amount of the generated gas with each other has been a difficult problem. For solving these problems, for example, there were proposed a process wherein the amount of the carboxyl terminal group is reduced and, in particular, a process wherein solid phase polymerization is conducted, particularly, a process wherein solid phase polymerization is conducted after copolymerizing a polyfunctional compound and a monofunctional compound in a specified ratio (JP-A-4-272920).
However, in the process wherein the amount of the carboxyl terminal group is reduced, the decrease in the amount of the generated gas is yet insufficient; and in the process wherein solid phase polymerization is conducted, a problem that the fluidity of the resin is lost to make the formation of a thin molding difficult is caused. When solid phase polymerization is conducted after copolymerizing a polyfunctional compound and a monofunctional compound, the Theological characteristics of the resin are changed to increase the viscosity thereof under a low shearing condition and, therefore, such a process has the problem of a brittleness lower than that of a (co)polymer having the same fluidity but prepared by other processes.

Polyester resin and process for the production thereof


A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.

1. Field of the Invention
The present invention relates to a method for fabricating a wiring board provided with a passive element and to a wiring board provided with a passive element, in particular to a method for fabricating a wiring board provided with a passive element having an aptitude for improving characteristics of the passive element and to a wiring board provided with a passive element having an aptitude for improving characteristics of the passive element.
2. Description of the Related Art
As portable electronic devices become smaller in size, lighter in weight and thinner in thickness, smaller size chip components, such as L (inductor, coil), C (condenser, capacitor) and R (resistor), have been developed. Furthermore, by burying passive elements such as C and L in a wiring substrate, composite components have been developed. Such integration with a wiring substrate has been actively forwarded particularly in multi-layered ceramic substrates and adopted in, for instance, RF (radio frequency) modules for portable telephones.
A multi-layered ceramic substrate is fabricated by first preparing a necessary number of green sheets (ceramic material sheet before sintering) on which coil patterns and capacitor electrode patterns are formed by, for instance, printing a thick film of a conductive paste, followed by stacking these in a predetermined order and by performing simultaneous thermo-compression bonding and sintering.
Furthermore, a plurality of green sheets having different dielectric constants is prepared, and according to characteristics of a passive component to be incorporated, the green sheets are appropriately selected. This is performed by selecting a low dielectric constant green sheet that can set a high self-resonant frequency and secure a high Q-value for a ceramic material that constitutes an inductor, and a high dielectric constant green sheet for a ceramic layer that forms a capacitor, respectively. By use of such a combination, an LC composite component having higher function may be incorporated.
In the aforementioned technique, ceramics is used for wiring substrate material. It is expected that in future an operating frequency of an RF circuit that is used in a portable telephone may reach 10 to 20 GHz. In view of this, it is important from a viewpoint of product costs and so on that organic resins having lower relative dielectric constants are made available as the substrate material. As things are, when an organic resin that is lower in dielectric constant than the ceramics is used as a substrate material (inter-layer insulating layer), and passive elements such as capacitors and so on are incorporated similarly to the multilayer ceramic substrate, it is supposed that an element area may become larger and desired characteristics may not be obtained.
Furthermore, as to the so-called hybrid multi-layered substrates, there are the following reports. That is, first, according to characteristics of a passive element to be incorporated, a substrate material in which a dielectric material and a magnetic material are mingled with polymer is prepared. Thus obtained substrate material is etched, and thereby a patterned capacitor layer and a coil layer are formed. These are laminated in a predetermined order, and thereby a hybrid multi-layered substrate is obtained.
However, in this technique, the multi-layered substrate may warp due to the difference of characteristics such as thermal expansion coefficient and so on between the substrate materials. In addition, since only one specified kind of passive element may be formed in one layer, a design allowance when the passive elements are arranged is low. That is, it is inappropriate in obtaining a smaller size due to tendency to an increase in the number of layers as a whole.
Furthermore, there is another multi-layered organic resin substrate in which resistive paste, dielectric paste, and conductive paste are sequentially printed to incorporate R, L and C. However, since the paste that can be used in this case is restricted to kinds that allow completing heat treatment at temperatures lower than the heat resistance temperature of an organic resin that is used as an insulating layer, the desired characteristics may not be obtained in some cases.

Method for fabricating wiring board provided with passive element, and wiring board provided with passive element


A radiographic image processing device includes: an image acquisition section that acquires a subject image detected by a shielded detection portion and a non-shielded detection portion; an area information acquisition section that acquires area information which is information for specifying a non-shielded image area and a shielded image area; and a scattered ray suppression section that estimates spreading of scattered rays generated in a non-shielded subject portion, estimates that scattered rays that spread to the non-shielded image area from a shielded subject portion are not present, calculates a scattered ray component in each position in the non-shielded image area as the estimated scattered rays reach each position in the non-shielded image area, and suppresses the scattered ray component in each position in the non-shielded image area according to the calculated scattered ray component.

1. Field of the Invention
The present invention relates to a radiographic image processing device and a radiographic image processing method that perform image processing with respect to a radiographic image, and a recording medium on which a program for causing a computer to execute the radiographic image processing method is recorded.
2. Description of the Related Art
In the related art, when capturing a radiographic image of a subject by using radioactive rays that pass through the subject, if the thickness of the subject is especially large, the radioactive rays are scattered inside the subject, and the contrast of the acquired radiographic image may deteriorate due to the scattered radioactive rays (hereinafter, referred to as scattered rays).
In order to solve such a problem, various techniques for suppressing a scattered ray component from a radiographic image of a subject using image processing have been proposed. For example, JP3423828B, JP3540914B, and Non-Patent Document "A New Method for Eliminating Scattered Ray Components from a Digital X-ray Image by Laser Processing", Hideki Kato, Journal of Japanese Society of Radiological Technology, Vol. 62, No. 9, 2006-09, pp. 1359-1368, provide a technique for calculating a scattered ray component of scattered rays that reach each position in a subject image based on a relational expression indicating an intensity distribution function of scattered rays corresponding to the thickness of a subject, and reducing the calculated scattered ray component from a pixel value of a corresponding position in the subject image, to thereby suppress the scattered ray component.

Radiographic image processing device, radiographic image processing method, and recording medium


A method for preparing an aerogel comprising nano attapulgite and phenolic aldehyde and a method for preparing abrasion-resistant vehicle tire. 80-100 weight distributions of rubber, 3-8 weight distributions of SiO2.nH2O, 3-6 weight distributions of an anti-aging agent, 3-4 weight distributions of a heat stabilizer, 3-5 weight distributions of a compatibilizing agent, and 3-12 weight distributions of the aerogel comprising the nano attapulgite and the phenolic aldehyde is selected as a raw material of the abrasion-resistant rubber material to prepare rubber composite material for the abrasion-resistant vehicle tire.

Vehicle tires are essential to modern transportation. Rubber composite material is the main component of vehicle tires. Abrasion resistance, flame retardancy, heat dissipation performance, wet skid resistance, energy saving, and environmental protection are all very important factors for the rubber.
The development of energy-saving and abrasion-resistant tires is of vital importance to the tire industry. Since 2012, the fuel efficiency of automobile tires has been regarded as one of the important indicators by EU tire-related regulations. Since the construction of highways in China in 1988, the scale has developed rapidly. As of the end of 2019, the total mileage of highways reached 149,600 Kilometers and ranks first in the world. The growth rate of the highways has slowed down in recent years, which also reflects that the domestic highway construction layout improves day by day. Therefore, it is necessary to develop energy-saving and abrasion-resistant tires with high efficiency and flame retardancy. The abrasion resistance and cutting resistance of tires are important factors related to the service life of tires and the driving safety of vehicles. The existing production routes of tire rubber can no longer meet the national requirements for high-performance and safe vehicle tire manufacturing. It is necessary to modify the abrasion resistance of tires to obtain tires with good abrasion resistance, strong flame retardancy, and suitability for long-distance and long-term transportation. In addition, compared to light-duty tires that run on normal roads, tires that are widely used in mines, construction sites, and heavy-duty loaders have higher requirements for the abrasion resistance and cutting resistance of the carcass material.
Nano attapulgite rustic gel is a kind of nano material with excellent performance. The higher porosity, expansion volume, and larger specific surface area of nano attapulgite rustic gel make nano attapulgite rustic gel have better dispersion characteristics than original attapulgite soil, and the excellent mechanical and thermal properties enable the nano attapulgite rustic gel to be used as a reinforcing material in rubber composite materials. However, the nano attapulgite rustic gel has strong hydrophilicity, high surface energy, and is prone to aggregation, which make it difficult to achieve uniform dispersion in rubber and which hinders the possibility of improving rubber properties.

Method for preparing nano attapulgite and phenolic aerogel and method for preparing abrasion-resistant vehicle tire


A router with a routing layer that supports single or multiple routing protocols. The routing layer has at least two routing protocol computing entities, namely a first and a second routing protocol computing entities. Each routing protocol computing entity includes a CPU, a data storage medium in communication with the CPU and a program data stored in the data storage medium for execution by said CPU. The program data in each routing protocol computing entity implements different or the same routing protocols. This routing layer architecture is highly scalable.

Commercially available routers used in data networks are typically comprised of an interface layer defining a plurality of Input/Output (I/O) controllers implementing respective I/O ports, a switching layer that establishes signal pathways between the I/O ports, and a routing layer. The routing layer is responsible for communicating with other routers in the data network. Such peering communication sessions are conducted according to a routing protocol, and their purpose is to exchange route information.
The routing layer is implemented in software executed by a computing entity. The computing entity includes a Central Processing Unit (CPU) and a data storage medium that holds the program instructions executed by the CPU to implement the routing layer functionality.
An increase of the capacity of the routing layer, in terms of augmenting the number of simultaneous peering sessions that can be established, faster processing of the route information, etc., can be effected by increasing the speed of the CPU and providing a larger data storage medium. However, this approach provides a limited solution only and from a practical perspective can yield modest capacity increases at best. Therefore, there is a clear need in the industry to develop novel architectures for a router that are highly scalable.


Coatings such as high Tc superconductor material on substrates which incorporate reactive gases like oxygen and nitrogen are formed by providing the substrate so that it is spaced from the target region in a coating chamber, forming particles of the coating material by plasma from a cathodic target and entraining the particles to the substrate spaced from the plasma in a gas stream including the reactive gas and at a pressure of 0.1 to 20 mbar.

A variety of techniques have been developed for producing thin superconductor layers on a substrate. In one of these techniques, the material is constituted as a target or cathode material and the target is subjected to cathodic sputtering, thereby transferring particles of the material onto a substrate disposed in the immediate region of the coating source. The substrate is usually heated.
In an apparatus for this purpose, a vacuum chamber can be provided with the sputtering source and immediately in the vicinity thereof the substrate is disposed so that there is a direct transfer of the sputtered material from the cathode to the substrate.
The class of materials with which the invention is applicable, namely those which contain oxygen, nitrogen or other reactive gases, include high-temperature superconductors, including the YBa.sub.2 Cu.sub.3 O.sub.7-x, BiSrCaCuO or TlBaCaCuO types, where x is a fraction less than 1.
These compositions have a rather complex structure, referred to as a Perovskite structure and oxygen which is incorporated in situ therein.
A number of deposition techniques have been used to produce thin films of these materials, e.g. CVD, evaporation laser deposition and sputtering method. The preparation of uniform high quality films especially over large areas has been proven difficult due to certain limitations characteristic of each deposition technique. An important advantage of plasma sputtering over e.g. evaporation methods is among others given by the fact that this technique stoichiometric material as target material can be ablated in a very reproducible way at generally high reactive gas (i.e. oxygen) processes.
Earlier systems over which the present invention can be considered to be an improvement, are described, for example in X. X. Xi, G. Linker, O. Mayer, E. Nold, B. Obst, F. Ratzel, R. Smithey, B. Strehlau, F. Weschenfelder, and J. Geerk, Z. Phys. B 74 (1989), 13 or C. B. Eom, J. Z. Sun, K. Yamamoto, A. F. Marshall, K. E. Luther, T. H. Gaballe and S. S. Laderman, Appl. Phys. Lett. 55 (1989), P. 595. These techniques are referred to as "off axis" high pressure cathodic sputtering since the substrate is located with a spacing from the axis of the cathodic target.
A so-called back-sputter effect is described in L. R. Gilbert, R. Messier and S. V. Krishnaswamy, J. Vac. Sci. Technol. 17, (1980), according to which a coating deposited by conventional cathodic sputtering is removed partially by ions from the plasma.
This problem characterizes even off-axis high pressure cathodic sputtering as previously mentioned as well as other cathodic sputtering methods. In all of the earlier sputtering methods, moreover, undesirable and disadvantageous charge accumulation effects are observed.

Plasma-assisted deposition process for producing a thin layer on a substrate