A rod-type flame glow plug, with a glow tube (5), an inner pole (7), a coil combination having at least one control and glow coil (4) located in series with an ignition coil (3.2) in the glow tube (5), the ignition coil (3.2) being located at the tip of glow tube (5), making in contact with the glow tube, avoids problems associated with nonuniform centering of the coils in the glow tube by the coil combination being located predominantly within a tubular component (1) made of a heat-resistant material. The inner surface of the tubular component (1) adjoins the coil combination, and the outer surface of the tubular component (1) adjoining the inner surface of glow plug (5).

1. Field of the Invention
The invention relates to a rod-type flame glow plug for preheating the intake air of an internal combust ion engine, especially a diesel engine. More specifically, the present invention relates to a rod-type flame glow plug having a glow tube with an inn er p ole, a coil combination of at least one control and glow coil located in series in the glow tube with an ignition coil, the ignition coil being located at the tip of glow tube and making contact with the glow tube.
2. Description of Related Art
Rod-type flame glow plugs of the type to which the invention is directed are known, for example, from German Patent 43 01 252 and corresponding U.S. Pat. No. 5,468,993. The disadvantage of these rod-type flame glow plugs is the difficulty of arranging the coils exactly concentrically in the glow tube so that the distance from the outside edges of the coils to the inside edge of the glow tube is the same; this, in turn, is the prerequisite for heating taking place uniformly so that carbonization does not occur in the vaporizer area due to nonuniform heat formation on the adjacent glow tube wall. In addition, short circuits can occur which are caused by coil areas touching the glow tube. Short circuits can, likewise, be caused by destruction of conventional heating rod seals in the entry area of the inner pole into the glow tube of the plug.
The danger of nonconcentric arrangement of the coil(s) is especially problematic in the area of the glow tube tip at which the end of the glow coil is welded to the glow tube; but can also easily occur when the glow tube into which the coil or coil combination is inserted is filled with insulating material, such as MgO or AlN, for example, because the coils, and especially the 24 volt coils, are easily moved, especially in the control coil area, accordingly the fuel preheating and vaporizer area; however, bending of the coils can also occur during the conventional process of caulking the coil end in the inner pole connection. Here, it should be mentioned that 24 volt coils, as compared to 12 volt coils, have a much thinner cross section; this leads to a very soft spring rate of the 24 volt coils. Thus, 12 V/24 V control coils have diameters of roughly 0.6/0.35 mm and 12 V/24 V heating coils roughly 1.00/0.55 mm.
Finally, lack of roundness occurs with the same aforementioned disadvantages in the production of the coil combinations; this applies especially in the so-called 24 volt coils. The proportion of coils which are bent by careless transport is also not inconsiderable.


A wiring layer structure of a resin sealed semiconductor integrated circuit, which is free from slide of wiring layer during heat cycle test, is disclosed. The slide is prevented by making an effective width of the wiring layer smaller by means of slits formed in the wiring layer. A reduction of area to be occupied by the wiring layer is realized by reducing a total width of the wiring layers by increasing the density of slits with increase of a distance from a corner of the chip.

The present invention relates to a resin sealed semiconductor integrated circuit.
In a semiconductor integrated circuit chip (referred to as semiconductor chip hereinafter), a wiring layer of a metal film such as aluminum or copper or an alloy film led from bonding pads is used as a ground wiring or a power supply wiring for supplying an externally supplied power source potential to an internal circuit node. Due to the necessity of making resistance low and life until breakage due to electromigration long enough, practically, such power source wiring or ground wiring is made as wide as possible. Further, in order to prevent wirings connecting leads to bonding pads from being tangled, the bonding pads are arranged in a peripheral portion of the semiconductor chip. The wiring layer is coated with a passivation film of a hard material such as phospho-silicate glass (PSG) or silicon nitride to prevent errosion by water (water vapor). Then, the semiconductor chip is adhered to a metal plate called an island by means of conductive material and, after necessary connections are made by means of leads and wires, it is resin-sealed.
The passivation film functions to not only prevent water immigration but also to protect semiconductor circuit elements against contamination by substances contained in the sealing resin. Therefore, the thickness of the passivation film is designed to a value of about 1 .mu.m or more. With such large thickness of the passivation film, the latter on wiring layers tends to be cracked as pointed out in U.S. Pat. No. 4,467,345 issued to Ozawa on Aug. 21, 1984 and assigned to Nippon Electric Co., Ltd. This problem is due to the fact that grain size of the passivation film becomes larger on the wiring layers. This problem may be solved by limiting the width of wiring layer smaller than 50 .mu.m.
The crack problem of the passivation film as well as slide or destruction of the wiring layer also occurs in assembling step of the chip, such as resin sealing step. Such phenomena are due to difference in thermal expansion coefficient between a semiconductor chip and a resin seal. However, such problems are also solved by providing slits so that an effective width of portions of the wiring layer at corner portions of the semiconductor chip are made not less than 10 .mu.m and not more than 40 .mu.m, as disclosed in international publication Gazette WO 91/00616.
Further, such destruction and/or slide of wiring layers may occur during a heat cycle test for confirming reliability of a semiconductor chip under severe thermal conditions such as its use on a vehicle or in a desert, which is to be performed after resin sealing. This is solved by limiting the width of wiring layer not more than 5 .mu.m as disclosed in JP-A-62-174948. Since the width reduction of wiring layer necessarily increase possibility of breakage of wiring layer due to electromigration, it is usual to use a plurality of narrow parallel wiring layers instead of a single wide wiring layer. However, this approach, in which the width of each narrow wiring is not more then 5 .mu.m increases an area to be occupied by the wiring layers, causing an improvement of integration density to be difficult.
There is the trend, in the field of semiconductor integrated circuit, of both increase of integrated circuit scale and miniturization thereof. For example, for a semiconductor memory, while the number of bits for each memory element is increased at a rate of four times per several years, the increase of chip area is restricted to twice at most owing to miniturization of constitutional elements.
Further, recent power source current becomes substantially constant, say, 100 mA, regardless of bit number. The thickness of wiring layer tends to decrease with increase of bit number. Since electromigration depends upon current density, the width of wiring layer constituting a power source wiring and a ground wiring (the width is a total width of a plurality of narrow parallel wiring layers corresponding to a single wide wiring layer) can not be reduced with increase of bit number. This is obstructive to improvement of integration density of power source wiring and ground wiring. Such problem may be avoided by providing a plurality of conductor sets each including power source wiring, ground wiring and bonding pads. On the other hand, the number of lead wires increases necessarily with increase of semiconductor integrated circuit scale such as increase of bit number, while the number of leads per package is limited. Therefore, the above-mentioned approach is not preferable.
As other approaches than those mentioned above in which the width of wiring layer is reduced to prevent destruction or slide of wiring layers in a resin sealed semiconductor device, the following approaches are proposed:
A first approach is to coat the passivation film with polyimide film. Although this approach had been developed to prevent soft-error due to radiation, it has been found that this is also effective to relax stress exerted on a structure including the passivation film and the wiring layer to thereby prevent destruction or slide of the wiring layer. This method, however, requires the additional step of coating the passivation layer with polyimide film.
A second approach is to flatten a cover layer. That is, after a usual passivation film such as PSG film which has water repelling function and flatness of which is low is provided, a SOG (Spin-On-Glass) film is formed thereon to improve the surface flatness. With this method, it has been proved that, with such improved flatness, the destruction of wiring layer is reduced. The reason why such effect is provided is that, contrary to the stress relaxation of the polyimide film, the SOG film fills portions of the passivation film on side faces of wiring layer in which coverage is low and film thickness is small, causing mechanical strength to be increased. This method also requires such additional step.
These two methods have been not used widely for, not only the economical reason of requirement of additional step, but also reasons that manufacturers had neither effective techniques for formations of polyimide coating and passivation film having acceptable coverage nor knowledges of the aforementioned effects of the polyimide film and the flat cover film.
A method which has been used widely is to provide wiring layer on a chip except corners thereof and their peripheries where destruction of wiring layer may occur. On these portions of the chip, bonding pads and a minimum wiring layer may be provided. Since, in this conventional method, non-use portions may be left in a peripheral portion of the chip, the chip area is increased so that a minimum wiring layer might be destroyed.

Resin sealed semiconductor integrated circuit


A peer-to-peer (P2P) probing/network quality of service (QoS) analysis system utilizes a UDP-based probing tool for determining latency, bandwidth, and packet loss ratio between peers in a network. The probing tool enables network QoS probing between peers that connect through a network address translator. The list of peers to probe is provided by a connection server based on prior probe results and an estimate of the network condition. The list includes those peers which are predicted to have the best QoS with the requesting peer. Once the list is obtained, the requesting peer probes the actual QoS to each peer on the list, and returns these results to the connection server. P2P probing in parallel using a modified packet-pair scheme is utilized. If anomalous results are obtained, a hop-by-hop probing scheme is utilized to determine the QoS of each link. In such a scheme, differential destination measurement is utilized.

As the number of users and traffic volume continue to grow on the Internet, it becomes essential that a set of network performance metrics and measurement methodologies should be available that allow both the users and network service providers to have an accurate, common understanding of the performance and reliability of given Internet paths. On the users' side, once equipped with a set of network performance metrics and measurement tools, it will become much easier to have an accurate knowledge of what kind of service is available via different connections. With this information the users will be able to compare the relative performance of the various network service providers and peers. A user can then intelligently make a connection decision that will provide the best network performance and on-line experience. Similarly, knowledge from network performance measurements will also enable the network providers themselves to intelligently deploy more powerful switches to boost network capacity. Likewise, content-based service providers can use this information to optimally deploy and manage their service servers.
That is, this performance information may be used by many Internet services and systems to enable the creation of robust overlays for peer-to-peer systems or application-level multicast trees, by users to enable the selection of a server among multiple server mirrors, and by service providers to determine the placement of server replicas to improve the performance of content distribution networks. In an on-line peer-to-peer (P2P) gaming environment, this information may be used to determine where to deploy additional connection servers, and by content providers to deploy additional game servers. Despite many proposals on building an Internet measurement infrastructure from the research community, however, it is hard for such an infrastructure to be fully deployed and operational in the near future, due to both the scale and the complexity of the Internet.
In an on-line P2P gaming environment this scale and complexity is apparent. Specifically, there are now or will be in the near future several million game consoles or boxes deployed worldwide. One such game box, sold by the assignee of the instant application, is the Microsoft XBox. However, while there are a large number of game boxes deployed, there are only a relatively small number of connection servers deployed that will facilitate the location of and connection to multi-player gaming servers and to other peers running the desired game.
The connection decision, i.e. to which of the available peers and peers serving as game servers should a player connect, requires that the network performance or quality of service (QoS) between the player and the game server or peer be known. It is known that there are several types of QoS parameters, such as end-to-end delay, bandwidth, packet loss ratio, etc. All these metrics have tradeoffs, so the whole picture should be taken into consideration rather than focusing on one. Indeed, the tradeoffs may depend on the requirement of the particular gaming application running over the network.
For gaming applications, latency is the most important parameter for QoS selection. With the deployment of a broadband network, more and more games are utilizing multimedia technology to improve their representation ability. As a result, the network performance monitoring system should also pay attention to bandwidth and other QoS components. However, current low level network performance monitoring techniques are inadequate because some internet service providers (ISPs) use traffic filtering techniques within their networks, for example by blocking Internet Control Message Protocol (ICMP) echo packets, etc. Measurements using such packets (e.g., ping, traceroute, etc.) can only achieve a rather low accuracy, and are therefore unacceptable.
To further complicate the issue, many game boxes are deployed onto the network behind a Network Address Translator (NAT). Therefore, to determine the network QoS performance between those peers, a probing connection between those peers must be established. Unfortunately, NAT characteristics vary widely in their ability and willingness to allow such connections. However, the on-line gaming user will not tolerate a long delay while different probing techniques are tried to determine the network performance to those peers. Any long delay before a connection is made to play the game or otherwise run the application desired will detract from the user experience. Additionally, with potentially millions of peers available on the network, the sheer volume of probing traffic that could be generated as each peer tries to determine the network performance to the other peers might very well introduce network delays. Further, the amount of probing data that would result from such probes could quickly fill up the available memory of the game boxes, further detracting from the gaming performance.

Peer-to-peer method of quality of service (QoS) probing and analysis and infrastructure employing same


An improved process and apparatus for the production of a polyester or other condensation polymer is disclosed. In particular, polymerization is conducted in a reaction vessel equipped with a specially designed agitator that exposes the polymer melt partially filling the reaction vessel to inert gas flowing through the vessel. The agitator comprises a plurality of elements that lift a portion of a polymer melt in the reaction vessel and generate films of the polymer melt which films extends in planes that are parallel to the axis of the agitator and the flow of gas through the reaction vessel. In a preferred process, a melt of bis(2-hydroxyethyl) terephthalate, or its low molecular oligomers, obtained by esterifying terephthalic acid or transesterifying dimethyl terephthalate with ethylene glycol, is contacted with an inert gas at about atmospheric pressure in order to remove the reaction by-products and facilitate polymerization.

Polyester production from aromatic dicarboxylic acids or their esters such as dimethyl terephthalate (DMT), and glycols is known. This has been accomplished by stage-wise melt polymerization of the dihydroxy ester of the aromatic dicarboxylic acid, or low molecular weight oligomers thereof, under successively higher vacuum conditions. In order for the polymerization to continue to the degree needed for most commercial applications, the condensation by-products, especially ethylene glycol, must be removed from the reaction system at vacuums as high as 1-3 mm Hg. Such processes require costly high vacuum equipment, multistage steam jets to create the vacuum, and N.sub.2 purged seals and flanges to minimize leakage of air into the system. Condensate from the steam jets and organic by-products from the system end up as a waste water stream that requires treatment and contributes to volatile organic emissions to the air. The present invention relates to a less costly polymerization process that can be carried out at atmospheric pressure.
Atmospheric pressure processes employing an inert gas have been disclosed in the prior art, but these suffer from one or more drawbacks such as (1) the quantity of inert gas used is too large to be economical; (2) the reactor size might not be feasible for commercial-scale operation; (3) inert-gas velocities may be too high to be feasible for commercial-scale production, or (4) contact between the inert gas and the polymer melt in the reactor be inadequate or non-uniform. Because of such drawbacks, the processes presently employed for commercial production of polyester continue to be conducted under high vacuum. One object of the present invention is to provide further improvement in a process, at about atmospheric pressure, for continuous or batchwise production of polyesters, particularly polyethylene terephthalate, of high molecular weight. In another aspect of the present invention, an improved apparatus that may be employed in a reaction process involving mass transfer of a volatile by-product into an inert gas, is disclosed.

Apparatus and process for a polycondensation reaction


Novel serine/threonine receptor proteins and BMP receptor proteins are disclosed, as well as DNA molecules encoding the BMP receptor proteins and methods of using the receptor proteins. Further disclosed are truncated BMP receptor proteins and molecules which act as ligands to the BMP receptor proteins.

Bone morphogenetic proteins (BMPs) are a family of proteins which have been identified as having the ability to induce the formation of bone and cartilage in tissue extracts. BMPs are a subfamily within the TGF-β superfamily. BMPs have multiple therapeutic uses, including a wide variety of settings where bone has been lost through physicological or traumatic processes.
The TGF-β superfamily of proteins have been shown to bind to serine/threonine kinase receptors. Massague, Cell, 69:1067–1070 (1992); Attisano et al., Cell 68:97–108 (1992); Lin et al., Cell, 68:775–785 (1992); Wang et al., Cell 67:797–805 (1991). Similarly, activin receptors have been isolated and characterized as a predicted transmembrane serine kinase. Mathews et al., Cell 65:973–982 (1991); Nakamura et al., J. Biol. Chem. 267:18924–18928 (1992). Ebner et al., Science, 260:1344–1348 (1993) describe the existence of Type I and Type II TGF-β receptors, and the effects of the Type I receptor on binding of TGF-β to the Type II receptor.
Type I receptor proteins have been reported not to bind to their ligand molecules independently, but, acting in concert with Type II receptor proteins, are observed to contribute to increased binding to the ligand. See Matsuzaki et al., J. Biol. Chem., 268:12719–12723 (1993); Ebner et al., Science, 260:1344–1348 (1993).
Paralkar et al., PNAS USA 88:3397–3401 (1991) describes the presence of high affinity binding sites for BMP-4 on MC3T3E1 and NIH3T3 cells. No competition by TGF-β) was found for the BMP-4 binding proteins, nor was competition by BMP-4 for TGF-β receptors observed in Attisano et al., Cell 68:97–108 (1992).

DNA molecules encoding BMP receptor proteins


Apparatus is provided, including a plurality of islets, and a hydrogel configured to macroencapsulate the plurality of islets. The hydrogel is implantable in a subcapsular space (21) of a kidney (22) of a subject and is shaped to define a planar configuration. Other applications are also described.

Oxygen is essential to many physiological and metabolic processes, including aerobic metabolism. A lack of oxygen for implanted cells often leads to cell injury or death. Oxygen provision is a vital component in sustaining transplanted cells.
The success of many transplants is compromised not only due to graft-host rejections, but also by ischemic conditions generated by insufficient oxygen supply to the transplant. Following implantation of the cells, oxygen can be provided to the implanted cells from the body tissue (mainly via diffusion). However, the natural diffusion rate is too low in order to provide the cells with a significant, necessary amount of oxygen amount.
Islet transplantation in experimental models is conducted under the influence of immunosuppressive drugs. Such immunosuppression is typically associated with adverse effects such as increased infection and malignancy rates. Additionally, the immunosuppressive drugs are known to affect the viability and the functionality of the transplanted islets and to trigger insulin resistance in the animal model.
Islets have been microencapsulated in various polymeric hydrogel matrices including alginate, acrylic acid derivatives, polyethylene glycol (PEG) conformal micro-coatings, nanocoatings, cellulose, and/or agarose. Microencapsulated islets are typically transplanted within the peritoneal space, but have also been implanted within the liver, the spleen, and the subcapsular space of the kidney. Microencapsulating islets provides a low ratio (typically about 1:100) of (a) the volume of islets to (b) the volume of alginate hydrogel (i.e., capsule). The subcapsular space of the kidney cannot sufficiently support the relatively large volume of alginate microcapsules.
U.S. Pat. No. 6,165,225 to Antanavich et al. describes bioartificial implants and methods for their manufacture and use, particularly bioartificial pancreases. In particular, the implants may be thin sheets which enclose cells, may be completely biocompatible over extended periods of time and may not induce fibrosis. The high-density-cell-containing thin sheets are preferably completely retrievable, and have dimensions allowing maintenance of optimal tissue viability through rapid diffusion of nutrients and oxygen and also allowing rapid changes in the secretion rate of insulin and/or other bioactive agents in response to changing physiology. Implantations of living cells, tissue, drugs, medicines and/or enzymes, contained in the bioartificial implants may be made to treat and/or prevent disease.
PCT Publication WO 07/144389 to Durfane et al. describes cellular devices comprising a collagen matrix, cell layer, and gelled alginate layer, processes for producing the devices, methods of implanting the devices, and methods of treatment thereof.
In a conference report entitled, "Bioartificial Organs II: Conference Report," co-sponsored by The Engineering Foundation and the Juvenile Diabetes Foundation International, from a conference held in Banff, Alberta, Canada, Jul. 18-22, 1998, the portion relating to a bioartificial pancreas described the use of "medium-sized capsules" of 350 μm. This would correspond to a transplant volume of 35 mL for a 70 kg individual. A five-month diabetes reversal in dogs was observed in transplantation of the capsules in the peritoneum or omental pouch.
U.S. Pat. No. 6,960,351 to Dionne describes an immunoisolatory vehicle for the implantation into an individual of cells which produce a needed product or provide a needed metabolic function. The vehicle is comprised of a core region containing isolated cells and materials sufficient to maintain the cells, and a permselective, biocompatible, peripheral region free of the isolated cells, which immunoisolates the core yet provides for the delivery of the secreted product or metabolic function to the individual. The vehicle is described as being particularly well-suited to delivery of insulin from immunoisolated islets of Langerhans, and can also be used for delivery of high molecular weight products, such as products larger than IgG. A method of making a biocompatible, immunoisolatory implantable vehicle is described, consisting in a first embodiment of a coextrusion process, and in a second embodiment of a stepwise process. A method is also described for isolating cells within a biocompatible, immunoisolatory implantable vehicle, which protects the isolated cells from attack by the immune system of an individual in whom the vehicle is implanted. A method is provided for providing a needed biological product or metabolic function to an individual, comprising implanting into the individual an immunoisolatory vehicle containing isolated cells which produce the product or provide the metabolic function.
PCT Publication WO 01/50983 to Vardi et al., and U.S. patent application Ser. No. 10/466,069 in the national phase thereof, which are assigned to the assignee of the present application and are incorporated herein by reference, describe an implantable device comprising a chamber for holding functional cells and an oxygen generator for providing oxygen to the functional cells. In one embodiment, the oxygen generator is described as comprising photosynthetic cells that convert carbon dioxide to oxygen when illuminated. In another embodiment, the oxygen generator is described as comprising electrodes that produce oxygen by electrolysis.
Stabler C et al., in an article entitled, "The effects of alginate composition on encapsulated βTC3 cells," (Biomaterials vol. 22, no 11, pp. 1301-1310 (2001)), describe the effects of alginate composition on the growth of murine insulinoma βTC3 cells encapsulated in alginate/poly-L-lysine/alginate (APA) beads, and on the overall metabolic and secretory characteristics of the encapsulated cell system for four different types of alginate. Two of the alginates used had a high guluronic acid content (73% in guluronic acid residues) with varying molecular weight, while the other two had a high mannuronic acid content (68% in mannuronic acid residues) with varying molecular weight. Each composition was tested using two different polymer concentrations. Their data show that βTC3 cells encapsulated in alginates with a high guluronic acid content experienced a transient hindrance in their metabolic and secretory activity because of growth inhibition. Conversely, βTC3 cells encapsulated in alginates with a high mannuronic acid content experienced a rapid increase in metabolic and secretory activity as a result of rapid cell growth. Their data also demonstrate that an increase in either molecular weight or concentration of high mannuronic acid alginates did not alter the behavior of the encapsulated βTC3 cells. Conversely, an increase in molecular weight and concentration of high guluronic acid alginates prolonged the hindrance of glucose metabolism, insulin secretion and cell growth. These observations were interpreted as resulting from changes in the microstructure of the alginate matrix, i.e., interaction between the contiguous guluronic acid residues and the Ca2 ions, as a result of the different compositions.
Cheng S Y et al., in an article entitled, "Insulin secretion dynamics of free and alginate-encapsulated insulinoma cells," (Cytotechnology 51:159-170 (2006)), describe the effect of alginate/poly-1-lysine/alginate (APA) encapsulation on the insulin secretion dynamics exhibited by an encapsulated cell system. Experiments were performed with the aid of a home-built perfusion apparatus providing 1 min temporal resolution. Insulin profiles were measured from: (i) murine insulinoma βTC3 cells encapsulated in calcium alginate/poly-1-lysine/alginate (APA) beads generated with high guluronic (G) or high mannuoric (M) content alginate, and (ii) murine insulinoma βTC-tet cells encapsulated in high M APA beads and propagated in the presence and absence of tetracycline. Results show that encapsulation in APA beads did not affect the insulin secretion profile shortly post-encapsulation. However, remodeling of the beads due to cell proliferation affected the insulin secretion profiles; and inhibiting remodeling by suppressing cell growth preserved the secretion profile. The implications of these findings regarding the in vivo function of encapsulated insulin secreting cells are discussed.
PCT Publication WO 86/03781 to Larsen et al. describes a process for producing alginates having improved physical properties, by the inoculation of alginates derived from brown algae or bacteria, with an enzyme preparation such as a mannuronan-C-5-epimerase preparation from Azotobacter vinelandii. The modified alginates are used for immobilizing enzymes, cell organelles or cells as well as for the microencapsulation of biocatalysts.
PCT Publication WO 02/024107 to Dorain et al. describes a method for making a physiologically active and biocompatible cellular implant for implantation into a host body. The method includes the steps of: (a) forming first and second layers of first and second polymer solutions, respectively, each layer having a first substantially uncross-linked surface and an opposing second cross-linked surface; (b) forming a sandwich of a cell suspension layer of physiologically active cells in a substantially uncross-linked third solution between the first and second, and (c) cross-linking the first and second polymer solutions in a direction toward the cell suspension layer, thereby forming a cellular implant. In another embodiment, all polymer solutions initially are uncross-linked and sequentially spread in layers followed by cross-linking.
The following references may be of interest:    PCT Publication WO 05/063147 to Wang et al.    PCT Publication WO 08/027420 to Kennedy et al.    U.S. Pat. No. 5,639,275 to Baetge    U.S. Pat. No. 6,368,592 to Colton et al.    U.S. Pat. No. 6,432,449 to Goldenberg et al    U.S. Pat. No. 6,960,351 to Dionne et al.    U.S. Pat. No. 7,361,333 to Latta    US Patent Application Publication 2005/0136092 to Rotem et al    Axen K V and Pi-Sunyer F X "Reversal of streptozotocin-induced diabetes in rats by intramuscular implantation of cultured islets," Transplantation 31: 439-441 (1981)    Clayton H A et al., "The effect of capsule composition on the biocompatibility of alginate-poly-1-lysine capsules," J Microencapsul. 8(2):221-33 (1991)    Cole D R et al., "Transplantation of microcapsules (a potential bio-artificial organ): biocompatibility and host reaction," Journal of Materials Science: Materials in Medicine Volume 4, Number 5, pp. 437-442 (1993)    Constantinidis I et al., "Effects of alginate composition on the metabolic, secretory, and growth characteristics of entrapped beta TC3 mouse insulinoma cells," Biomaterials 20(21):2019-27 (1999)    Cruise G M et al., "In vitro and in vivo performance of porcine islets encapsulated in interfacially photopolymerized poly (ethylene glycol) diacrylate membranes," Cell Transplant 8: 293-306 (1999)    de Vos P et al., "Alginate-based microcapsules for immunoisolation of pancreatic islets," Biomaterials 27, 5603-5617 (2006)    Dufrane D et al., "Six-month survival of microencapsulated pig islets and alginate biocompatibility in primates: Proof of concept," Transplantation. 81:1345-1353 (2006)    Elliott R B et al., "Intraperitoneal alginate-encapsulated neonatal porcine islets in a placebo-controlled study with 16 diabetic cynomolgus primates," Transplant Proc 37:3505-8 (2005)    Elliott R B et al., "Live encapsulated porcine islets from a type 1 diabetic patient 9.5 yr after xenotransplantation," Xenotransplantation Volume 14, Issue 2, Pages 157-161 (2007)    Gazda L S et al., "Encapsulation of porcine islets permits extended culture time and insulin independence in spontaneously diabetic BB rats," Cell Transplant 16(6):609-20 (2007)    Hara Y et al., "Influence of the numbers of islets on the models of rat syngeneic-islet and allogeneic-islet transplantations," Transplantation proceedings vol. 38, no. 8, pp. 2726-2728 (2006)    Inuma I M and Mardi A S et al., "Pancreatic islet number and volume weighted mean volume in weanling and young Wistar Kyoto rats," J Anat 205: 541-542 (2004)    Juang J H et al., "Islet transplantation at subcutaneous and intramuscular sites," Transplant Proc. 37:3479-81 (2005)    Kim Y Y et al., "Improved phenotype of rat islets in a macrocapsule by co-encapsulation with cross-linked Hb," J. Biomater. Sci. Polym. Ed., 16, 1521-1535 (2005)    Kin T et al., "Survival and metabolic function of syngeneic rat islet grafts transplanted in the omental pouch," Am. J. Transplant. 3, 281-285 (2003)    Larsen J L et al., "Tacrolimus and sirolimus cause insulin resistance in normal sprague dawley rats," Transplantation. 82(4):466-70 (2006)    Lim F and Sun A, "Microencapsulated Islets as Bioartificial Endocrine Pancreas," Science, 210:908-910 (1980)    Maria-Engler S S et al., "Microencapsulation and tissue engineering as an alternative treatment of diabetes," Braz J Med Biol Res, Volume 34(6) 691-697 (2001)    Matarazio M et al., "Islet Transplantation Under the Kidney Capsule Corrects the Defects in Glycogen Metabolism in Both Liver and Muscle of Streptozocin-Diabetic Rats," Cell Transplantation, Vol. 11, pp. 103-112 (2002)    Matsumoto S et al., "Insulin independence after living-donor distal pancreatectomy and islet allotransplantation," Lancet. 365:1642-4 (2005)    Napoli R et al., "Islet transplantation under the kidney capsule fully corrects the impaired skeletal muscle glucose transport system of streptozocin diabetic rats," J. Clin. Invest. 97(6): 1389-1397 (1996)    Narang A S et al., "Biological and biomaterial approaches for improved islet transplantation," Pharmacol Rev 58:194-243 (2006)    O'Connell P J et al, "Clinical islet transplantation in type 1 diabetes mellitus: results of Australia's first trial," MJA, Volume 184 Number 5 pp. 221-225 (2006)    Qi M et al., "PVA hydrogel sheet for macroencapsulation for the bioartificial pancreas," Biomaterials 25(27):5885 (2004)    Rafael E et al., "Intramuscular autotransplantation of pancreatic islets in a 7-year-old child: A 2-year follow-up," Am J Transplant 8: 458-462 (2008)    Rappel M J, "Maintaining islet quality during culture," a thesis published in the Massachusetts Institute of Technology. Dept. of Chemical Engineering. (2007)    Reach G et al., "A U-shaped bioartificial pancreas with rapid glucose-insulin kinetics. In vitro evaluation and kinetic modelling," Diabetes 33:752-761 (1984)    Reach G, "Bioartificial pancreas. Present state and future prospects," Biomed Biochim Acta 43: 569-576 (1984)    Rickels M R et al., "Evidence for allograft rejection in an islet transplant recipient and effect on beta-cell secretory capacity," J Clin Endocrinol Metab. 92:2410-4 (2007)    Ricordi C et al., "Low-temperature culture of human islets of in vivo treatment L3T4 antibody produces a marked prolongation of islet human-to-mouse xenograft survival," Proc. Natl. Acad. Sci. USA, 84:8080-84 (1987)    Risbud M V et al., "In vivo biocompatibility evaluation of cellulose macrocapsules for islet immunoisolation: Implications of low molecular weight cut-off," J Biomed Mater Res 66: 86-92 (2003)    Ryan E A et al., "Five-year follow-up after clinical islet transplantation," Diabetes, 54:2060-9 (2005)    Schaffellner S et al., "Porcine islet cells microencapsulated in sodium cellulose sulfate," Transplant Proc, 37:248-252 (2005)    Shapiro A M et al., "International multicenter trial of islet transplantation using the edmonton protocol in patients with type I diabetes," Am J Transplantation 3 (Suppl 5):152 (2003)    Shapiro A M et al., "Islet transplantation in seven patients with type 1 diabetes mellitus using a glucocorticoid-free immunosuppressive regimen," N Engl J Med 343:230-8 (2000)    Simpsona N E et al., "Effects of growth regulation on conditionally-transformed alginate-entrapped insulin secreting cell lines in vitro," Biomaterials Volume 26, Issue 22 pp. 4633-4641 (2005)    Storrs R et al., "Preclinical development of the islet sheet," Ann NY Acad Sci. 944:252-66 (2001)    Tatarkiewicz K et al., "Reversal of hyperglycemia in mice after subcutaneous transplantation of macroencapsulated islets transplantation," Volume 67(5)15 pp. 665-671 (1999)    Valdes-Gonzalez R A et al., "Three-yr follow-up of a type 1 diabetes mellitus patient with an islet xenotransplant," Clinical Transplantation, Volume 21 Issue 3, Pages 352-357 (2007)    Valdes-Gonzalez R A et al., "Xenotransplantation of porcine neonatal islets of Langerhans and Sertoli cells: a 4-year study," Eur J Endocrinol 153: 419-427 (2005)    Wahoff D C et al., "Free intraperitoneal islet autografts in pancreatectomized dogs—Impact of islet purity and posttransplantation exogenous insulin," Surgery 116:742-750 (1994)    Wang T et al., "Successful Allotransplantation of Encapsulated Islets in Pancreatectomized Canines for Diabetic Management Without the Use of Immunosuppression," Transplantation. 85:331-337 (2008)    Zekorn T et al. "Alginate coating of islets of Langerhans: in vitro studies on a new method for microencapsulation for immuno-isolated transplantation," Acta Diabetol 29:41-45 (1992)    Zekorn T et al. Islet transplantation in immunoseparating membranes for treatment of insulin-dependent diabetes mellitus," Exp Clin Endocrinol Diabetes 103 (Suppl 2):136-139 (1995)    Zekorn T D et al., "Biocompatibility and immunology in the encapsulation of islets of Langerhans (bioartificial pancreas)," Int J Artif Organs 19:251-257 (1996)    Zimmermann H et al., "Alginate-based Encapsulation of Cells: Past, Present, and Future," Curr Diab Rep. 7 (4):314-20 (2007)

Optimization of alginate encapsulation of islets for transplantation


A multi-layer sealant film having a high transparency, which comprises: (1) a high-density polyethylene layer comprising a high-density polyethylene having a melting point of not less than 122.degree. C. and a crystallization temperature of not less than 110.degree. C.; and (2) a polyolefin layer comprising a polyolefin having a crystallization temperature of not more than 109.degree. C., wherein the multi-layer sealant film is produced by co-extruding the high-density polyethylene and the polyolefin to form a multi-layer film, and the high-density polyethylene layer is used as a heat seal layer. Also disclosed are a multi-layer packaging film comprising the multi-layer sealant film having a transparent substrate on the side opposite to layer (1), and a pouch obtained by heat-sealing the packaging film so that layer (1) comes to be the innermost layer thereof.

Many types of thermoplastic resin films are currently on the market as transparent films for packaging. As transparent films for food or medicine, high-pressure low-density polyethylene films and linear low-density polyethylene films are generally widely used. However, these films have poor heat resistance, and can not withstand heat sterilization treatment at 121.degree. C. for 30 minutes.
Polypropylene films are also excellent in transparency and strength, and therefore widely used. However, polypropylene resins must be compounded with stabilizers such as antioxidants because of their poor oxidation resistance, light stability and heat stability, which makes it impossible to use them for contents requiring extraction characteristics, particularly food for babies and medicine. Further, polypropylene films can not be used for packaging for cold or refrigeration storage because the polypropylene resins have poor low-temperature characteristics and become brittle at low temperatures.
Polyethylene terephthalate films, which are transparent and have excellent strength, are disadvantageous because of poor heat sealing property and difficulty in making a pouch.
High-density polyethylene is excellent in heat sealing property, heat sterilization characteristics and heat stability. Accordingly, it does not require the aid of antioxidants and is excellent also in extraction characteristics. However, there is a problem with respect to high-density polyethylene as follows. If high-density polyethylene is rapidly quenched by a chill roll and the like, it undergoes rapid volume shrink to cause wrinkles on the surface thereof. The wrinkles deteriorate the conformity with the chill roll, to thereby cause uneven quenching. As a result, transparency of the resulting high-density polyethylene film is deteriorated. Although a film having a smooth surface would be attained by higher chill roll temperature, this deteriorates the transparency. In view of the above, a sealant film which comprises a high-density polyethylene interlayer having low-density polyethylene layers laminated on both sides thereof has been proposed. However, this sealant film cannot endure a heat sterilization treatment at 121.degree. C. for 30 minutes.

Multi-layer transparent sealant film for laminating comprising high density polyethylene layer and packaging flim and pouch using the same


There is presented a system and method for updating digital media content. The system comprises a data structure residing on a media storage, the digital media content being stored in the data structure. The system further comprises a processor coupled to the media storage and configured to access the data structure, and receive an update to one or more modifiable elements of the data structure from an authoritative source external with respect to the data structure. The processor is further configured to modify the modifiable elements according to the update, and store the modified elements in the data structure. As a result, updates to the modifiable elements are persistently stored in the data structure.

1. Field of the Invention
The present invention relates generally to the management of media content. More particularly, the present invention relates to systems and methods for modifying and updating media content.
2. Background Art
A media file is a data structure containing media content, such as audio and/or video content, for example, that can be played back using a media player. The media file itself is an integral content unit recognized as such by the computer platform on which the media file resides or is used. Media files are commonly designed to store a single, identifiable item of core media content, encoded and arranged according to an established standard. Because the core content stored in a media file is often proprietary, it may be undesirable to permit a consumer or an entity other than the content owner to modify the core content after its encoding and arrangement within the media file. Consequently, although media files are created and may be edited or modified using software designed for that purpose, media files are typically not modifiable by the software resident on a media player.
Descriptive metadata associated with the core content stored in a media file can enhance the playback experience and add value to the core content. In this context, descriptive metadata refers to data that describes the core content. For example descriptive metadata may include the title of music or film content corresponding to the core content, the artist(s) or actor(s) performing the content, and the studio producing the content. Descriptive metadata may also include a description of the core content, information about the encoding of the core content, rights/licensing information, usage rules, watermarks or copyright ownership, and the like. The playback experience may be further enhanced by supplemental content associated with the core content. For example, in the case of core content corresponding to a cinematic film, supplemental content such as film reviews, promotional materials related to the film, movie trailers, and/or advertising related to the film, can add additional value to the core content. However, most media file formats presently in use do not store descriptive metadata and supplemental content within the media file structure.
One conventional solution for delivering the enhancements and advantages associated with descriptive metadata and supplemental content is to associate the media file with external metadata and supplemental content. In other words, the integral media file structure is associated with one or more data structures containing the descriptive metadata and supplemental content, which are themselves separate and distinct from the media file containing the core content. For example, external descriptive metadata may originate from a content storefront, such as Gracenotes accessed through the iTunes storefront, or from a website, such as imbd.com, or from some other remote database.
One advantage of using external descriptive metadata and supplemental content is that it allows information to be periodically updated. For example, film reviews, movie trailers, and promotional content associated with core content comprising a film can be kept current and fresh through this approach. There are, however, significant drawbacks associated with this conventional solution. One disadvantage is that this approach requires playback devices to warehouse descriptive metadata and supplemental content, and to maintain associations between that external content and the appropriate media file containing the core content. Another disadvantage is that, because the media file containing the core content is an integral file structure separate from the descriptive metadata and supplemental content, a copy operation performed on the media file transfers only the core content, not the descriptive metadata or the supplemental content stored separately.
Although presently in the minority, some media file formats do permit storage of descriptive metadata and supplemental content within the media file structure. While overcoming some of the problems associated with reliance on external storage of the descriptive metadata and supplemental content, this alternative approach, as conventionally practiced, introduces different problems of its own. For example, because the descriptive metadata and supplemental content are encoded and arranged in the media file prior to its distribution, that data becomes fixed and static upon delivery of the media file. Unfortunately for this approach, however, the lifetime of the core content may be much longer than that of the descriptive metadata and supplemental content accompanying it. For instance, core content comprising a feature film may retain its appeal to consumers for many years, but the trailers, advertising, and promotional content supplementing that core content may become outdated, irrelevant, and even inaccurate or misleading, far sooner.
Accordingly, there is a need to overcome the drawbacks and deficiencies in the art by providing a solution for managing media content that integrates storage of core digital media content, descriptive metadata, and supplemental content associated with the core content, and additionally enables updating of the modifiable content elements. It would be advantageous for the solution to further specify a time period or lifecycle for the core digital media content, during which period updating and/or other support functions are provided.

This patent is subject to a terminal disclaimer.

System and method for updating digital media content


A magnetic recording medium is disclosed, wherein a magnetic film comprising a partially oxidized cobalt with its in-plane coercive force not less than 500 Oe is provided on a substrate. Further disclosed are megnetic recording media, wherein there is further provided an underlayer comprising Cr, Fe or an Fe-Co alloy under said magnetic film, and wherein a perpendicular magnetic anisotropic film comprising a partially oxidized metal is further provided on said magnetic film. The magnetic recording media of the present invention are high in recording density and reproduction output, low in noise and high in S/N ratio.

1. Field of the Invention
The present invention relates to a magnetic recording medium capable of high-density recording and, more particularly, to a magnetic recording medium suitable for flexible discs, magnetic tapes or hard discs and a preparing method thereof.
2. Description of the Prior Art
Hitherto, a Co-Cr alloy film, a partially oxidized film of cobalt, a partially oxidized film of Fe-Co alloy or the like have been proposed as a perpendicular magnetic recording medium capable of high-density magnetic recording. Such partially oxidized films have a high perpendicular magnetic anisotropy, are capable of high-density recording and have a high resistance to sliding of the head. Such partially oxidized films are obtainable by vapor deposition in an oxygen atmosphere or by reactive sputtering, also in an oxygen atmosphere.
As a recording-reproducing head for the perpendicular magnetic recording medium, there have been proposed heads of main magnetic exciting type and of ring type. Unlike the former, the latter has an advantage in that a relatively high reproduction output is obtainable even if it is provided with only a perpendicularly magnetized film without any soft magnetic underlayer such as permalloy and is, therefore, highly effective.
There are, however, problems in that if recording is made on a single layer of perpendicularly magnetized film and reproduction of the recorded information is made, the waveform is bound to the double-humped, and therefore, the reproduced output in the low-density region is bound to be low. Another problem is that the perpendicular magnetic recording medium comprising a film of partially oxidized cobalt is low in reproduction output compared with the medium comprising a film of Co-Cr alloy.
Meanwhile, there is a problem that a system representing a combination of a perpendicular magnetic recording media comprising films of partially oxidized Fe-Co alloy and partially oxidized cobalt with a ring type head is lower in reproduction output than that comprising the Co-Cr alloy film. To be noted particularly is that if the perpendicular magnetic anisotropy is raised for an increased recording density, it is bound to result in a decrease of the reproduction output. That is, if recording is made on a single layer of Co-Cr medium and the recorded information is reproduced by an Mn-Zn ferrite head, a standardized output of approximately 100 .mu.Vo-p/mm/(m/sec)/turn is expected, that of the partially oxidized Fe-Co alloy medium is only 50 .mu.Vo-p/mm/(m/sec) turn or so.
In order to overcome these problems, a method for providing as an underlayer a film of Fe-Co alloy or the like having magnetic anisotropy oriented in an in-plane direction has been proposed. Such a method, though largely increasing the reproduction output and the recording density, is not yet sufficient in respect of S/N ratio, overwrite property and the like.

Magnetic recording medium having a Co-O magnetic layer, and specified in-plane properties

Lune-Toyonaka 121, 6-1, Kitajo-cho 4-chome


A semiconductor package structure having central leads according to the invention includes a substrate, a semiconductor device, a plurality of wires, and glue. A long slot penetrating through the substrate is formed in the substrate. A plurality of bonding pads formed on the semiconductor device are mounted on substrate. The plurality of bonding pads on the semiconductor device are exposed via the long slot of the substrate. The length of the semiconductor device is smaller than that of the long slot of the substrate so that a channel is formed at one side of the long slot when the semiconductor device is mounted on the substrate. The plurality of wires are arranged within the long slot of the substrate for electrically connecting the plurality of bonding pads on the semiconductor device to the plurality of signal output terminals on the substrate. The glue is provided for sealing the upper surface of the substrate to protect the semiconductor device. The glue is poured into the long slot of the substrate via the channel formed by the long slot of the substrate, for covering the plurality of wires.

1. Field of the Invention
The invention relates to a semiconductor package structure having central leads and a method for packaging the same, and in particular to a semiconductor device that is packaged by glue pouring so as to improve the package efficiency of the semiconductor.
2. Description of the Related Art
FIGS. 1A and 1B show a conventional semiconductor package structure having central leads in transverse and longitudinal section views, respectively. The semiconductor package structure includes a substrate 10, a semiconductor device 12, and glue 14 and 16. The substrate 10 is formed with a long slot 18. A plurality of bonding pads 20 formed on the semiconductor device 12 are located in the long slot 18 of the substrate. The bonding pads 20 are electrically connected to the substrate 10 by a plurality of wires 22. The glue 14 and 16 cover the semiconductor device 12 and the long slot 18 of the substrate 10, respectively, for protecting the semiconductor device 12 and the plurality of wires 22.
The method for gluing the glue 14 and 16 in the semiconductor package structure having central leads is performed by glue dispensing or screen printing in order to pour the glue 14 and 16 to cover the semiconductor device 12 and the long slot 18 of the substrate 10. Therefore, there should be two processes for completing the gluing. Thus, the processes for the semiconductor package having central leads are complicated and the cost of the package is relatively high.
In view of the above-mentioned problems, it is therefore an object of the present inventor to provide a semiconductor package structure having central leads and a method for packaging the same. In the structure and method of the invention, the glue is poured to cover the semiconductor device and the long slot of the substrate by only one process of glue pouring to complete the package of the semiconductor device. Thus, the manufacturing processes are simple and convenient.
It is therefore a primary object of the invention to provide a semiconductor package structure having central leads and a method for packaging the same. The structure and method are done by glue pouring so as to finish the package of the semiconductor device. Thus, the manufacturing processes are simple and convenient.
It is another object of the invention to provide a semiconductor package structure having central leads, in which a semiconductor device can be efficiently mounted on the substrate when the semiconductor device is packaged by glue pouring.
To achieve the above-mentioned objects, the invention is characterized in that the semiconductor package structure includes:
a substrate having an upper surface, a lower surface, and a long slot penetrating from the upper surface to the lower surface, the lower surface being formed with a plurality of signal output terminals;
a semiconductor device on which are formed with a plurality of bonding pads, the semiconductor device being mounted on the upper surface of the substrate, the plurality of bonding pads on the semiconductor device being exposed via the long slot of the substrate, and the length of the semiconductor device being smaller than that of the long slot of the substrate so that a channel is formed at one side of the long slot when the semiconductor device is mounted on the substrate;
a plurality of wires within the long slot of the substrate for electrically connecting the plurality of bonding pads on the semiconductor device to the plurality of signal output terminals on the substrate; and
glue for sealing the upper surface of the substrate to protect the semiconductor device, the glue being poured into the lower surface of the substrate via the channel formed by the long slot of the substrate, for covering the plurality of wires.
The invention is also characterized in that the method for packaging the semiconductor package structure includes:
providing a substrate, the substrate having an upper surface, a lower surface, and a long slot penetrating from the upper surface to the lower surface, the lower surface being formed with a plurality of signal output terminals;
providing a semiconductor device on which are formed with a plurality of bonding pads, the semiconductor device being mounted on the upper surface of the substrate, the plurality of bonding pads on the semiconductor device being exposed via the long slot of the substrate, and the length of the semiconductor device being smaller than that of the long slot of the substrate so that a channel is formed at one side of the long slot when the semiconductor device is mounted on the substrate;
providing a plurality of wires within the long slot of the substrate for electrically connecting the plurality of bonding pads on the semiconductor device to the plurality of signal output terminals on the substrate; and
providing glue for sealing the upper surface of the substrate to protect the semiconductor device, the glue being poured into the lower surface of the substrate via the channel formed by the long slot on the upper surface of the substrate, for covering the plurality of wires.
Thus, the package of the semiconductor device can be completed by only one process for pouring the glue, thereby facilitating the manufacturing process and lowering the manufacturing cost.

Semiconductor package structure having central leads and method for packaging the same


An improved system and method are disclosed for non-destructively determining the thickness and uniformity of an anti-tamper coating on a sensitive electronic part, such as, for example, an integrated circuit, multi-chip module, or other type of electronic device, component or equipment. The system includes an anti-tamper coating thickness measurement probe with a highly collimated beta radiation source and a Geiger-Muller tube sensitive to beta radiation arranged in close proximity to the beta radiation source. The probe is placed on or in close proximity to the anti-tamper coating on the part, so that the beta radiation electrons penetrate the coating material and are reflected back (back scattered) toward the beta radiation source and the Geiger-Muller tube. The Geiger-Muller tube collects the electrons from the back scattered radiation.

The need to protect sensitive electronic circuits, components or equipment against unauthorized access is well known. For example, electronic circuits, components and systems used in military weapons or other fielded military equipment can contain classified structures or data that needs to be protected against unauthorized access. Notably, the strategic, tactical or operational value of the classified structures or data that may be compromised by such unauthorized access is unquantifiable. Also, the ability to protect such sensitive electronic circuits, component or systems against unauthorized access is weakened if the sensitive electronic circuits, components or systems are not under domestic control (e.g., foreign military sales of classified weapon systems).
Similarly, electronic circuits, components or systems used for civilian applications can contain sensitive, proprietary information that needs to be protected against unauthorized access. For example, financial institutions and corporations use computerized systems to protect sensitive information (e.g., personal data, customer data, financial data, financial transaction authorization codes, authentication procedures, security passwords, etc.). Such sensitive information may be stored in alterable semiconductor memory devices (e.g., flash memory device, EPROM, EEPROM, PROM, RAM, DRAM, etc.) or memory components of integrated circuits. Any compromise in the security of the sensitive data contained in such memory devices or integrated circuits can result in significant tangible and intangible losses to the financial institutions and corporations involved, such as, for example, financial losses, losses due to fraudulent transactions, business losses, losses due to compromised customer lists and financial data, losses of institutional or corporate integrity, losses of commercial confidence, and losses due to adverse publicity. Thus, electronic circuits, components or systems containing sensitive information used for civilian applications also need to be protected against unauthorized access.
One technique for protecting sensitive hardware and software devices is discussed in commonly-assigned U.S. Pat. No. 5,877,093 to Heffner et al., entitled "Process For Coating An Integrated Circuit Device With A Molten Spray." Heffner et al. disclose forming a primer coating and an opaque coating on an integrated circuit or multi-chip module. A primer coating composition is applied to a surface of the integrated circuit device or multi-chip module. An opaque coating composition is then applied over the primer coating to form an opaque coating that overlies the active circuitry on the surface, in order to prevent optical- and radiation-based inspection and reverse engineering of the active circuitry. Other related coating techniques for protecting sensitive hardware and software devices are discussed in commonly-assigned U.S. Pat. No. 6,287,985 to Heffner et al., entitled "Process For Applying A Molten Droplet Coating For Integrated Circuits," and commonly-assigned U.S. Pat. No. 6,319,740 to Heffner et al., entitled "Multilayer Protective Coating For Integrated Circuits And Multi-chip Modules And Method Of Applying Same." Notably, such protective coatings for sensitive hardware and software devices are referred to as anti-tamper coatings.
A significant problem with existing anti-tamper coating techniques is that the coatings are highly complicated structures, which are designed to thwart an intruder's physical or electronic attempts to access the active circuitry underneath (e.g., by drilling through or removing the coating, and/or optically or electronically detecting the structure of the active circuitry underneath). Consequently, it is a very complicated, time consuming, and expensive process to evaluate the quality of an anti-tamper coating on a part, or test and evaluate the performance of such an anti-tamper coated part. For example, if a number of anti-tamper coated parts are produced for a classified, government application, then these parts can be shipped to an authorized government facility for specialized evaluation and testing. However, the specialized testing and shipping of these parts are very time consuming and expensive processes, and the tested parts are typically destroyed or made useless as a result. As another example, each anti-tamper coated part can be tested individually to determine if the coating has damaged that part. Again, these tests are very time consuming and performed with expensive, specialized equipment, and the tested parts are typically destroyed or made useless as a result. Therefore, it would be advantageous to provide an improved system and method for non-destructively testing and evaluating anti-tamper coatings on sensitive electronic parts, which use inexpensive processes that take relatively little time to perform. As such, one non-destructive technique that can be used to determine the performance of the constituent elements in an anti-tamper coating material and thus the performance of the anti-tamper coating itself, is to measure the thickness and uniformity of the anti-tamper coating on the part. As described in detail below, the present invention provides such an improved system and method, which can be used to non-destructively determine the thickness and/or uniformity of an anti-tamper coating material on a sensitive electronic part.

System and method for non-destructively determining thickness and uniformity of anti-tamper coatings


Electronic circuit node structures which minimize parasitic capacitance in linear path and angular circuit topographies for high frequency circuits are described. The electronic circuit comprises at least two signal conductor elements and an active or passive circuit element on a substrate. The conductor elements are arranged to define a gap between their ends. The circuit element bridges the gap. In one embodiment, the longitudinal axes of the conductor elements are laterally offset and generally parallel. The conductors are arranged to form the gap between adjacent edges on the ends of the conductors. The circuit element is arranged to bridge the gap. The other conductor edges near the gap are arranged at angles which increase the distance between them. In another embodiment, the conductor elements form an angle with the gap at the apex. The circuit element bridges the gap between the conductor edges nearest the apex. Other conductor edges are arranged to form a line parallel to the axis of the circuit element. The angle defined by the intersection of the conductor elements may be between 90 and 150 degrees. In all embodiments, the circuit element and/or the conductor elements may be thin-film superconductors. In all embodiments, the circuit element may be placed on the same side of the substrate as the conductor elements, or it may be on the opposite side of the substrate, overlapping the conductor edges forming the gap.

Unwanted capacitance at the connection between signal conductors and circuit elements has long been a phenomenon with which circuit designers have had to contend. Generally termed "parasitic" capacitance, it is commonly manifested as a capacitive effect between signal leads and the metal package of a circuit element, and as a capacitive effect across a circuit node caused by the disposition of two conductors in close proximity. Because capacitors can pass alternating current (AC) signals, parasitic capacitance of sufficient magnitude can both weaken signals and couple them into circuits where they are unwanted. The effects of parasitic capacitance cause signal degradation and limit the upper frequency at which a circuit can be operated.
Thin film device technology has reduced the phenomenon with respect to the capacitance which existed between input and output leads and element packages in a circuit node. But a residual parasitic effect remains in nodes where a thin film circuit element is connected between two microstrip conductors. The edges of the microstrip conductors nearest to the thin-film circuit element act as capacitive plates because the microstrip conductors are metal bodies of finite surface area separated by a small increment of distance across dielectric substances, i.e., air and the substrate upon which the conductors and the circuit element are deposited. The result is parasitic capacitance between the microstrip conductors and in parallel with the thin-film circuit element in the node.
In circuits where the thin-film circuit element and/or the conductor elements in the circuit node are superconductors, the combined effects of high signal frequencies and physically small circuit elements magnify the problem. Superconducting thin-film circuit elements are often non-linear devices whose resistive characteristics are controlled by varying bias currents passing through them. Parasitic capacitance is of little consequence when the superconducting circuit element is in its lowest resistance (i.e., superconducting) state, but becomes more significant and harmful to performance as the circuit element presents higher resistance to signals. In microwave and millimeter wave circuit nodes, parasitic capacitance is increasingly critical because of the inverse relation of impedance and frequency for capacitive circuits. Undesirable signal coupling across the circuit element connection is more pronounced and damaging at progressively higher frequencies.
The negative effects of parasitic capacitance are particularly significant in high frequency superconducting circuits. Because the input and output conductor segments are often superconductors, which by definition exhibit extremely low resistance, any capacitive coupling across an interface between conductor lines and a superconducting circuit element can cause serious signal degradation of leakage, depending on the application. Additionally, the physical length of superconducting circuit elements at millimeter wave frequencies can be on the order of 5 millimeters and less, making for very small dielectric gaps between the ends of the conductor elements between which the superconducting circuit element is connected. Thus, it is desirable to take measures to minimize the capacitance caused by the physical proximity of the input and output superconductors in a superconducting circuit node.

Low parasitic capacitance superconductor circuit node


A thin-film structure includes plate-shaped metals or plate-shaped structures in which a plate-shaped metal and a plate-shaped dielectric are in contact. The plate-shaped metal or structures are formed on a transparent base having a surface with line-shaped corrugated structures. The plate-shaped metals or structures are perpendicular to or oblique to the surface of the base. The thin-film structure has characteristics suitable for polarizers used in liquid crystal projectors and the like.

The present invention relates to a polarizer used in liquid crystal display devices, optical recording devices, optical sensors, and the like. More specifically, the present invention relates to a thin-film structure having polarization characteristics needed for polarizers and a method for making the same.
A polarizer is an optical element that extracts polarized light having a specific orientation from light containing multiple polarizations. Various types of polarizers have been proposed and implemented in practice. Examples include: polarized glass, in which column-shaped silver particles having high aspect ratios is dispersed in glass; polarizers in which island-shaped metal layers are alternated with dielectric layers and then drawn; polarized film, in which polymer is drawn and aligned; and stacked polarizers, in which dielectric films and metal films are stacked in an alternating manner and light is entered from the cross-section direction of the film.
In the field of liquid crystal technology, technical advances are being made in making optical systems more compact, light-weight, high-luminance, and the like. The popularity of liquid crystal display devices in applications such as business data display, home-theater video display and the like has been increasing rapidly. In particular, there have been significant advances in the increasing of luminance through the increasing of lamp luminance, the improving of light usage efficiency through polarization conversion and the like.
However, this has led to the problem of higher temperatures in the optical system resulting from greater compactness, higher luminance, and the like. As a result, there is a growing demand for heat-resistant properties in the optical components.
Liquid crystal display devices generally use a polarizing plate formed from an organic film with dye, as in Japanese laid-open patent publication number 2002-296417. However, with these polarizing plates with organic film, the heat resistant properties are low because of the use of organic material. Also, there are polarizing films that are dye-based and that have high heat resistance properties. However, these polarizing films have narrow working wavelength bands, thus imposing restrictions on use.
In order to overcome these problems, the use of wire-grid type polarizers has been proposed. In wire-grid type polarizers, the wire is metal and the substrate is glass so that only non-organic material is used. Thus, unlike organic materials such as the dye-based polarizers, high heat resistance properties can be provided. The wire-grid polarizers with the structures shown in U.S. Pat. No. 6,108,131 and U.S. Pat. No. 6,122,103 achieve these objects.
However, production of wire-grid polarizers requires high-precision control of wire thickness, distances between wires, and the like. In particular, production of a visible-light wire-grid polarizers require ultrafine structures where the width of a wire and a gap must be 160 nm or less. As a result, manufacturing technologies such as dry etching, photolithography, and the like must be used. The equipment needed for these technologies is costly and a large number of steps is needed, thus increasing production costs.
While the production of the polarizers described above all require complex steps, there have been attempts at forming a film having polarization splitting properties on a base using just a deposition process. In Japanese laid-open patent number Hei 4-218662, a metal (Al) and a transparent dielectric (SiO2) are vaporized simultaneously on a flat substrate from facing diagonal directions to form a structure in which plate-shaped Al and SiO2 are adhesed together and projected from the substrate. The adhesed plates have an average thickness of approximately 5 nm, a width of approximately 30 nm, and a height of approximately 1500 nm. This plate-shaped body is oriented roughly perpendicular to the direction from which vaporized particles come flying so that superior polarization characteristics are provided for visible light.
However, the results of follow-up tests conducted by the inventors showed that the structure of the plate-shaped body was near the surface of the substrate was completely different from that of the area around the upper end. Near the substrate, the metal formed fine particles and no plate-shaped structure is formed near the substrate. Furthermore, while plate-shaped structures are formed from approximately 50 nm away from the substrate surface, the cross-section shape of the plate-shaped metal changes as the distance from the substrate increases, and a widening along the thickness axis was observed. More specifically, it was not possible to obtain the film structure that was disclosed. Also, the extinction ratio of the polarizing film is approximately 5 db. This provides inadequate performance for a polarizer and prevents the technology from being used for optical communications, liquid crystal projectors, and the like.

Thin-film structure and method for producing the same


A flow control manifold includes a valve housing having first and second inlets and an outlet. The valve housing defines a cavity sized to slideably engage a valve having a first position and a second position. The flow control manifold may further include a first flow path defined within the valve and a second flow path defined within the valve such that the first flow path fluidly couples the first and second inlets to the outlet along the second flow path when the valve is in the first position.

Many medical solutions must be separated into their constituent components for storage in order to maintain stability, viability or to satisfy other medical concerns. These solutions may be stored in separate containers, but are often stored in separate chambers of a single container. The chambers of the container and the constituent components of the solution are often separated by a frangible heat seal. One example of such a double or dual chambered container is disclosed in U.S. Pat. No. 5,209,347 which is incorporated herein by reference for all purposes, and which is assigned to the Baxter International Inc., the assignee of the present application. This container includes a frangible seal that permits the mixing and combination of the constituent components of the solution when the seal is broken by hand and fluid pressure against the sides of the bag. Peelable seals are one type of frangible seal commonly utilized to permit the mixing and combination of constituent fluids stored in separate compartments of a dual chambered container via a pulling and/or twisting applied to the opposing sides of the container.
FIG. 1 illustrates one example of a known multiple chamber container 10 having a first and second chambers 12, 14 separated by a peelable seal 16. The container 10 is formed from first and second sheets 18, 20 of polymeric film aligned and registered relative to each other. The first and second sheets 18, 20 are joined or secured along a perimeter bond 22. The peelable seal 16 divides the interior formed by the cooperation of the bonded first and second sheets 18, 20 into the first and second chambers 12, 14.
The peelable seal 16 further divides the container 10 into third chamber 24 sized to support and isolate an access port 26. In particular, the peelable seal 16 includes sub-seal portions 16a, 16b arranged to define the substantially wedge or pie-shaped third chamber 24. The access port 26 is arranged with a first end 26a arranged and isolated within the third chamber 24. The access port 26 body extends through the perimeter bond 22 such that a second end 26b is exposed and accessible external to the container 10. In operation the peelable seal 16 and sub-seal portions 16a, 16b separate the first and second chambers 12, 14 and isolate the access port 26 prior to the combining the constituent components of the solution.
The constituent components of the solution can be combined and dispensed by applying pressure to one or both of the chambers 12, 14 to force the fluid against the peelable seal 16. The fluid force against the peelable seal 16 causes the first and second sheets 18, 20 to separate or peel apart thereby allowing the fluid to mix into solution. Similarly, the fluid force against the sub-seal portions 16a, 16b causes a separation that allows the solution to access the first end 26 a of the access port 26.
It is known that these, and other similar, peelable container systems require a great deal of fluid force to separate the peelable seal 16. The large force requirement can be difficult for individuals having limited upper body strength such as infirmed or elderly patients. Moreover, these container systems provide no system or method for resealing or interrupting fluid flow once the peelable seal 16 has been separated.
While the above description discloses a known system for storing and controlling the constituent components of a solution, a need exists for a simpler, more efficient and/or more flexible system of storing and controlling the constituent components of a solution.

Fail safe dual chamber peritoneal dialysis/infusion system


An image processing method in which a RIP process is performed on original image data to obtain raster data with a first resolution, and a smoothing process is performed through oversampling the obtained raster data to generate output image data with a second resolution which is smaller than the first resolution. The method is performed for recording an image on a recording medium by an inkjet recording device that performs the recording by discharging an ink drop on the recording medium from an inkjet head based on the output image data. Here, the first resolution in the RIP process for performing the smoothing process on the raster data is determined according to information that indicates the number of gradations corresponding to the number of ink drops selected in advance and the second resolution.

1. Field of the Invention
The present invention relates to an image processing method and apparatus in which a RIP process is performed on original image data to obtain raster data, and a smoothing process is performed through oversampling the obtained raster data to generate output image data.
2. Description of the Related Art
Image forming methods for forming a color image using an inkjet recording device are proposed. In the method, a color image is formed through the steps of: creating original image data including graphics, such as characters, illustrations, and the like, using a computer; outputting the original image data in PDL format (page description language) from the computer; performing a RIP process on the original image data in PDL format to create raster data of C (cyan), M (magenta), Y (yellow), and K (black) components; and forming the color image using an inkjet recording device based on the obtained raster data.
Here, when forming a character "A" based on the raster data created in the manner as described above, the edge portion of the character becomes irregular depending on the size of the dots (resolution) as shown in FIG. 8A.
Consequently, for inkjet recording devices having capabilities of multi-gradation representation, methods for obscuring the aforementioned irregularity are proposed as described for example, in Japanese Unexamined Patent Publication Nos. 11 (1999)-69163, 10 (1998)-336454, 5 (1993)-233792, 9 (1997)-149242, and 2001-105663. In such methods, for example, a smoothing process is performed, using an oversampling method or the like, on the raster data to generate intermediate density data, thereby obscuring the irregularity. The referent of "oversampling method" as used herein means a method in which high resolution raster data are divided into pixel groups, each pixel group including n×n pixels, and output image data are generated with the average density of each pixel group as the density of each pixel in output image.
More specifically, for example, in an inkjet recording device having capabilities of eight-gradation (8 level) representation per pixel by varying the number of ink drops to be discharged for each pixel in the range from 0 to 7, the irregularity on the edge portion of a character may be obscured in the following manner. That is, calculating the density levels using the oversampling method described above, and generating pixel values of eight gradations based on the density levels, and forming dots by varying the number of ink drops in eight steps based on the pixel values of eight gradations, and thereby arranging intermediate density dots on the edge portion of the character (FIG. 8B).
Here, for example, when generating output image data to be inputted to an inkjet recording device with an output resolution of 300×300 dpi and an output gradation value of eight by performing the oversampling described above, it has been customary to perform a RIP process on the original image data to obtain raster data with a resolution of, for example, 900×900 dpi, and to perform oversampling by dividing the raster data with the resolution of 900×900 dpi into pixel groups of 3×3 pixels to generate output image data. Here each pixel group corresponds to each pixel in output image.
Even if the number of ink drops is varied in eight steps, however, there may be a case, depending on the type of printing paper, in which the density of the dots is not represented in eight steps due to ink sheering, ink holding capacity, or ink bleeding of the printing paper. Thus, for example, generation of raster data that enable the density representation of dots in eight steps for printing paper that support the density representation of dots only in five steps (including white dots) results in that some of the data are wasted.
More specifically, in a case where the printing paper may support the density representation of dots only in five steps (including white dots), and output image data with a resolution of 300×300 dpi are to be obtained, the amount of data required is 300×300×4 (number of drops)=360000, and not more. The referent of "amount of data" as used herein means the number of gradations per unit area. Here, the amount of data is expressed in the number of gradations per square inch as an example.
That is, the RIP process needs to be performed only to obtain the raster data of two gradations with a resolution of 600×600 dpi. Thus, performance of the RIP process to obtain the raster data with a resolution of 900×900 dpi as in the conventional manner causes the RIP process time unnecessarily long. Further, the data to be processed becomes voluminous, and subsequent data processing for the raster data is also caused unnecessarily long.

Image processing method and apparatus comprising an image processing in which a RIP process is performed on original image data


A fan-motor-incorporated heat sink effectively supplies cooling air flow in a thin electronic device having limited space above the heat sink. The heat sink enables air intake above the heat sink by positioning a fan, the fins of a heat sink substrate and the side wall of the substrate lower than the fan driving unit. The heat sink substrate and the fins are formed such that air is exhausted only in one direction. A cover is provided on the side of the heat sink substrate on which the fan driving unit is mounted and to which air is taken in to prevent exhausted air from being taken in. The structure of the electronic device is positioned close to the upper surface of the fan driving unit on the heat sink. Thus, the heat sink can be installed on a thin electronic device while improving the cooling of a heat emitting element.

1. Field of the Invention
The present invention relates to a heat sink for cooling a semiconductor element which emits much heat such as a micro processing unit (referred to as an MPU hereinafter).
2. Description of the Prior Art
Heat sinks have been used for cooling semiconductors and the like which emit much heat. Recently, in particular, a fan-motor-integrated heat sink incorporated with a small fan is used for coping with the high heat emission of the MPU etc.
Conventional heat sinks will be described hereinafter. FIG. 8 is a perspective view of a conventional heat sink and FIG. 9 is a cross sectional view of the conventional heat sink.
In FIGS. 8 and 9, reference numeral 81 denotes an MPU that is a high-exothermic semiconductor element, 82 a heat sink substrate which is mounted on the MPU 81, 83 radiator fins, 84 driving means such as a motor or the like, 85 a fan and 86 a structure such as the casing of a notebook-type personal computer etc. for defining a space above the heat sink.
The operation of a conventional fan-motor-integrated heat sink having the aforementioned structure will be described hereinafter. Heat emitted from the MPU 81 is transmitted to the heat sink substrate 82 and the radiator fins 83. Air flow generated by the fan 85 rotated by the driving means 84 is taken in between the structure and the upper surface of the heat sink as shown by an arrow A and passes among the radiator fins 83 while carrying off heat therefrom to be vented from the side surface thereof as shown by an arrow B.
The aforementioned conventional structure had a problem that it was impossible for thin devices such as the notebook-type personal computer limited in thickness to secure a sufficient space for taking in air from above the heat sink and consequently to secure a sufficient cooling performance. Although the entire heat sink may be made thin for securing sufficient space, a motor capable of rotating the fan to generate a sufficient amount of air flow for cooling the device required a certain degree of thickness because of the structure of its bearing and coil, so that the motor was structurally limited in being made thin.

Heat sink and electronic device employing the same

Matsushita Electric Industrial Co., Ltd.


This invention relates to a process for safely decontaminating the chill water used in meat processing. The decontaminant used in the process is chlorine dioxide.

1. Field of the Invention
This invention relates to a process for safely decontaminating the chill water used in meat processing. The decontaminant used in the process is chlorine dioxide.
2. Description of the Prior Art
Freshly slaughtered poultry or other meat products are contaminated with pathogenic microorganisms. These microorganisms are present both on the surfaces of the animals, as well as in the intestinal tracts immediately after slaughter or evisceration. To insure product safety, recent federal regulations require microbiological testing rather than visual inspection. These regulations require that carcasses be tested for Salmonella.
A number of processes, which employ biocides for the pathogen control, have been proposed to decontaminate the chill water used to process poultry and other meat products. These processes include the use of chlorine-based sanitizers, chlorine dioxide, acidified sodium chlorite solutions, ozone and peracetic acid, but there are problems associated with using these chemicals. Ozone has poor persistence, while peracetic acid is only effective in high doses. Chlorine based sanitizers are inexpensive, but are less effective particularly at higher chill water pH. Chlorine dioxide is more effective, but can create health problems for workers exposed to it.
U.S. Pat. No. 5,389,390 suggests a process for removing bacteria from poultry, which involves using aqueous solution containing about 0.001% to about 0.2% by weight of a metal chlorite, such that the chlorite ion is in the form of chlorous acid. While this process is capable of controlling some of the microorganisms in the chill water, it does not provide flexibility with respect to adjusting the feed rate of metal chlorite to the process water being treated as the demand of the treated water increases. In addition, chlorous acid is not as effective in reducing pathogenic organisms such as salmonella and E. coli.
U.S. Pat. No. 5,227,306 suggests a process and apparatus that provide flexibility for adjusting the feed and feed rate of chlorine dioxide to an aqueous system. The chlorine dioxide is generated on-site by an external generator, and the feed and feed rate are automatically controlled by means of a multiple feedback loop system. This process provides adequate oxidative treatment while avoiding overfeed or underfeed conditions. However, the applications described in the patent do not relate to systems where food and people are exposed to the chlorine dioxide, and does disclose the use of an air monitoring system, which would shut down the unit should vapor levels exceed defined limits.
U.S. Pat. No. 5,635,231 suggests a process for treating poultry and red meat that removes, retards, or reduces bacterial growth. The processes involve spraying the meat, either prior to or after introducing the meat into the chiller, with a solution of trialkali metal phosphate to decontaminate the meat. One of the problems with this process is that high amounts of the phosphate are used, which are discharged into the environment. U.S. Pat. No. 5,700,507 teaches that the discharge can be minimized if the trialkali metal phosphate is used in conjunction with a steam treatment.
U.S. Pat. No. 5,683,724 describes an automated process for inhibiting microbial growth in aqueous food transport or process streams. In this process, a percarboxylated acid, such as peracetic acid, is used as the microbiological control agent. The amount of percarboxylated acid fed is controlled by maintaining an ORP between 280 and 460 mV. The patent notes that the use of chlorine dioxide is undesirable, because it is a toxic gas and has an acceptable air concentration limit of 0.1 ppm. Exposure to levels above this amount may cause headaches, nausea, and respiratory problems. The patent goes on to note that expensive and intricate safety devices and/or equipment are needed when using chlorine dioxide as a decontaminant, in order to monitor the level of chlorine dioxide and maintain concentrations below 0.1 ppm. The art described in the invention addresses these concerns and provides a solution in a safe manner.
Clearly, there is a need in the meat processing industry for a process that effectively decontaminates the meat as well as the process water, which does not damage the meat being treated, and also insures the safety of workers connected with the treatment process.
All citations referred to under this description of the "Related Art" and in the "Detailed Description of the Invention" are expressly incorporated by reference.

Process for safely decontaminating the chill water used in meat processing

Ashland Licensing and Intellectual Property LLC