The piezoelectric transducer saddle of the present invention is a thin, generally rectangular member that is designed to fit into the bridge slot of a musical instrument such as a guitar. The piezoelectric element is oriented vertically in the saddle and constitutes a structural member of the saddle. In a first embodiment of the saddle, a piezoelectric element forms the saddle itself. Electrical contacts are engaged to the sides of the piezoelectric element to produce electrical output. A preferred embodiment of the saddle is a laminated structure wherein the laminated layers are disposed vertically, and a vertical layer composed of a piezoelectric material is generally centrally disposed within the laminated structure. A metallic electrical contact is engaged on each side of the piezoelectric material to receive electrical signals generated by the piezoelectric material. In one embodiment, one of the electrical contacts is formed as a metallic layer which rises to the upper surface of the saddle to make contact with the strings of the musical instrument, in order to provide a ground for the metallic musical strings of the instrument. Further embodiments of the present invention utilize multiple piezoelectric elements and shaped piezoelectric elements to produce enhanced performance.

1. Field of the Invention
The present invention relates generally to electrical devices for generating musical tones in stringed instruments, and more particularly to saddles and bridges having piezoelectric transducers engaged therein or thereto.
2. Brief Description of the Prior Art
Stringed musical instrument saddles having piezoelectric transducers engaged thereto or disposed therewithin have been known for many years. Significant prior art includes the following patents.
U.S. Pat. No. 4,314,475 issued to L. R. Baggs, teaches a saddle having a piezoelectric transducer assembly disposed therewithin. The transducer assembly includes both horizontally disposed and vertically disposed piezoelectric elements, however the piezoelectric elements do not comprise a significant structural portion of the saddle, as is disclosed in the present invention.
U.S. Pat. No. 4,356,754 issued to L. R. Fishman, teaches a vibration transducer for a stringed instrument that has a piezoceramic wafer laminated to a brass plate (col. 4, 1. 43). U.S. Pat. No. 4,378,721 issued to K. Kaneko et al., teaches a pickup for a string instrument that has a transverse piezo element of ceramic powder mixed with a synthetic resin. U.S. Pat. No. 4,580,480 issued to W. H. Turner, teaches a simple piezo pickup for an acoustic guitar, comprising a piezo transducer 17 (col. 3, 1. 35) inserted beneath the saddle. U.S. Pat. No. 4,491,051 issued to L. M. Baucus, teaches four piezoelectric crystals, of alternating polarity that are enclosed in the lower part of a saddle structure between an upper ground conductor and a lower conductor which rests on an insulating sheet. An outer foil wrapping provides shielding (col. 14, 1. 48) and is insulated from the conductors by an insulator sheet (col. 14, 1. 39). U.S. Pat. No. 4,657,114 issued to T. P. Shaw, teaches a bridge pickup includes an array of piezo elements in a holder, encapsulated in a cast polymer member. U.S. Pat. No. 4,774,867 and U.S. Pat. No. 4,727,634 issued to L. R. Fishman, teaches small disk-shaped piezo crystals that are located between a resilient, conductive top layer and a ground plane. The top layer contacts the copper cladding of a circuit board. The assembly is inserted into a conventional saddle (col. 3, 1. 9). U.S. Pat. No. 4,030,396 issued to R. E. Mariner, teaches a piezo crystal that is embedded in resilient resin adjacent a mass (FIG. 4).

Piezoelectric transducer saddle for stringed musical instruments


A demodulator includes a wobble signal processor configured to convert a waveform of a wobble signal, and to generate a clock and a reference value based on a converted wobble signal. A sampling circuit is configured to sample the converted wobble signal by using the clock, and to generate a sampled signal. A viterbi decoder is configured to decode an auxiliary recording signal superposed on an optical disk by using the reference value and the sampled signal.

1. Field of the Invention
The present invention relates to an optical disk drive and, more particularly, to a demodulator for demodulating an auxiliary recording signal superposed on an optical disk and a semiconductor integrated circuit monolithically integrating the demodulator on a single semiconductor chip.
2. Description of the Related Art
A compact disk-recordable/rewritable (CD-R/RW) device is available as a recordable optical disk. A guiding groove is preformatted on the CD-R/RW device to guide a pickup. The guiding groove meanders slightly in a radial direction so as to detect a clock for rotation control. Such a track structure is referred to as a "wobbled land groove". Information superposed on a wobbled track of the CD-R/RW device is known as an absolute time in pregroove (ATIP). The absolute time on the CD-R/RW device can be obtained from the ATIP signal. A code sequence of an ATIP signal is converted into a digital frequency modulation signal, i.e., a biphase signal, and further subjected to frequency shift keying (FSK) modulation to be recorded as a wobble track.
A digital versatile disk+recordable/rewritable (DVD+RW) device is also available as a recordable optical disk. As in the case of the CD-R/RW device, a track structure of the DVD+RW device is the wobbled land groove. Information superposed on a wobbled track of the DVD+RW is known as an address in pregroove (ADIP). A code sequence of an ADIP signal is subjected to phase shift keying (PSK) modulation. A physical address on the DVD+RW device is obtained from the ADIP signal to be used for positioning of a recording area or verification of recording position during recording. The ATIP and ADIP signals are very important signals for detecting a state of the optical disk during reproducing and recording.
The ATIP signal is demodulated by an ATIP demodulator from a wobble signal detected from the optical disk by the pickup. Herein, the "wobble signal" is a signal obtained by the calculation of A−B, where A and B denote signals obtained from A and B sections of an optical detector in the pickup. The ATIP demodulator subjects the wobble signal to FSK demodulation, and generates a binarized wobble signal. The binarized wobble signal is latched in synchronization with a clock to demodulate the biphase signal. A biphase demodulator demodulates the ATIP signal from the biphase signal. The ADIP demodulator which demodulates the ADIP signal from the wobble signal first binarizes the wobble signal. The binarized wobble signal is subjected to EX-OR calculation together with a clock. A result of the EX-OR calculation is latched in synchronization with the clock to demodulate the ADIP signal.
During play-back of a recorded disk, since a recording signal is superposed on the wobble signal, a signal to noise (S/N) ratio of the wobble signal is relatively decreased. Furthermore, during recording on the optical disk, a recording light is reflected and superposed on the wobble signal to significantly decrease the S/N ratio of the wobble signal.
The ATIP demodulator cannot perform normal FSK demodulation of a signal portion containing a distorted waveform when the waveform of the wobble signal is distorted by decreasing the S/N ratio. Consequently, a demodulation error occurs in the demodulated ATIP signal. In the ADIP demodulator, when the wobble signal is distorted, a signal portion containing the distorted waveform cannot be subjected to normal binarization. Consequently, the demodulated ADIP signal has a demodulation error. As described above, when the S/N ratio of the wobble signal is significantly decreased, it is difficult for the ATIP demodulator and the ADIP demodulator to carry out accurate demodulation.

Demodulator, optical disk drive and semiconductor integrated circuit


A sealing mechanism for a gas chromatograph machine includes a weldment attachment mountable at the weldment assembly of the machine. The attachment has a passage therethrough for gas communicated to the weldment assembly. An actuator imparts a direct force on the weldment attachment to move it linearly towards an injection port of the machine and to sealingly clamp the weldment attachment onto the port. Torsional forces are not applied on the weldment attachment by the actuator.

Gas chromatography is a technique used for the separation of mixtures. In gas chromatography, the sample is often introduced as a liquid into the injection port whereafter it is volatilized. An inert gas is used as a carrier to propel the volatilized sample into the gas chromatographic column where the sample mixture is separated into its components. Each separated component is further propelled by the carrier gas through the exit of the gas chromatographic column into a detector. The detector then provides information regarding the amount and identity of each component of the sample mixture.
The injection port is the point at which the sample is introduced into the machine prior to separation of components. The injection port typically operates at elevated temperatures to ensure that the sample mixture is vaporized and transitions into the gas phase prior to separation entry to the chromatographic column. To assist this vaporization a disposable liner made of an inert material such as glass or quartz is placed within the injection port. A side effect of this process is that the liner also traps non-volatile components within the sample mixture. After repeated exposure to sample introductions, the injection port liner may loose its inert characteristics or become dirty and thus require replacement.
When using dirty sample matrices liner replacement is required frequently. This requires the uncoupling of two sealing surfaces to remove and replace the liner, followed by a recoupling of these sealing surfaces. This sealing is usually provided through the compression of an o-ring or ferrule around the outer diameter of the liner and positioned between the two sealing halves of the injection port body.
The normal way of forming this compression is through the use of a threaded weldment nut assembly onto an injection port body which contains a sealing bevel and metal tube to house the injection port liner. Such an arrangement is illustrated in FIG. 1. Components of the threaded nut assembly usually include gas introduction lines connected to a sealing septum to bring the carrier gas to the inlet. Once the weldment assembly is removed a liner and seal is placed into the injection port body. The threaded weldment nut is then turned onto matching threads on the injection port body producing a compression seal on an O-ring around the outer diameter of the injection port liner. This compression seal couples the liner and allows the flow of carrier gas supply through the liner into the gas chromatographic column.
The threaded weldment nut assembly often requires tools such as a wrench to rotate the nut onto the thread of the injection port body. The weldment nut is inductively heated when it is in contact with the injection port body, resulting in it often being too hot to handle (temperatures up to 350° C.). When removing the weldment nut from the injection port body it must be turned several times, often with a wrench, before it is released from the injection port body. After replacing the old liner, the threaded weldment nut is cool and thus exhibits difficulty in rethreading onto the thread of the hot injection port body. This can result in cross threading and seal leakage. Liner seals may also be damaged and leak due to torsional forces produced by rotating the weldment nut.
Additionally, this process of replacing the liner may be dangerous for operators if their hands contact the hot components of the injection port body which can easily occur when rotating the weldment nut assembly. The process of unthreading and rethreading may take several minutes to accomplish which can have deleterious effects on the system by exposing the gas chromatograph and column to air.
The present invention seeks to improve the ease and efficiency of removing and replacing the weldment assembly and on the whole making it safer for operators to use.

Sealing mechanism for gas chromatograph machines


A method for displaying applications which includes: obtaining the applications installed in a master device and the applications installed in a slave device when the master device is connected with the slave device; if the master device and the slave device have a same application, using the same application as the application to be recommended; obtaining the usage information of the application to be recommended, and determining the priority of the application to be recommended according to the usage information; and displaying the application to be recommended on the master device or the slave device according to a level of the priority. The present disclosure further discloses a system for displaying applications.

With the development of science and technology, televisions are applied with more and more functions. Meanwhile, the number of applications installed in the television is increasing. Due to different user hobbies, the applications installed in the television by different users are various, and different applications would be used at different use frequencies, some are frequently used, and some are used less frequently. Currently, the applications which are frequently used by users cannot be recognized according to the user's preference to display on the television screen, that is, the applications that user frequently uses cannot be recommended to the user. The applications are displayed on the television in the manner of based in the order of the applications installation. When the applications installed in the television reaches a certain number, it is difficult for the user to find a required application quickly on the screen through the remote controller. For example, some one of the users buys a smart television, the smart television has a total of 200 applications installed, of which, an application, such as a video application IQIYI® is the 99th displayed in the list of the applications, so the user has to manipulate the remote control several times to find iQiyi each time. As a result, the user cannot quickly find the applications which are frequently used in numerous applications.

Method and system for displaying applications


Disclosed is a cleaning composition for use in cleaning the interior of a molding machine having residual molding resin retained therein, comprising (a) a specific graft polymer comprised of a main chain comprising an olefin polymer and having, grafted thereto, a side chain comprising a styrene polymer and (b) a thermoplastic styrene polymer, the graft polymer (a) and the thermoplastic styrene polymer (b) being present in a weight ratio of from 2/100 to 160/100. This cleaning composition exhibits an extremely excellent cleaning effect due to its high capability to scape off a residual resin on a metallic surface. By using this cleaning composition, the cleaning of the interior of a molding machine having a residual molding resin retained therein can be effectively and efficiently performed in a short period of time and at a low cost.

1. Field of the Invention
The present invention relates to a cleaning composition for a molding machine and a cleaning method. More particularly, the present invention is concerned with a cleaning composition for a molding machine which comprises a specific graft polymer and a thermoplastic styrene polymer, and a method for cleaning the interior of a molding machine having residual molding resin retained therein, in which the above-mentioned composition is utilized. The cleaning of the interior of the molding machine is required at the time of, for example, changing the type or color of a molding resin. Efficient, complete cleaning is attained by the present invention.
2. Discussion of Related Art
Generally, molding machines, such as an injection molding machine, an extrusion molding machine and a blow molding machine, are used to obtain a shaped article of a resin. When it is intended to change the type or color of a resin to be molded (hereinafter frequently referred to as "molding resin") in which various additives, such as a pigment and a dye, are often incorporated or when it is intended to shut down a molding operation, it is necessary to stop the molding machine. In the stopped molding machine, usually, a portion of the molding resin is retained. Therefore, if a molding resin of different type or color is processed by the molding machine without removing residual molding resin retained therein, a molded article is caused to have poor appearance and poor properties due to the mixing of the residual molding resin into the molded article. Further, even if the same molding resin is employed, when the molding is conducted without removing residual molding resin retained therein after the molding machine has been stopped for a certain period of time, a molded article has also poor appearance and poor properties due to the mixing of the residual molding resin, which has been decomposed or denaturized, into the molded article.
In the art, the residual molding resin retained in a molding machine has conventionally been removed by the following methods. One method is to disassemble the molding machine and manually clean the interior of the molding machine. Another method consists in charging a molding machine having residual molding resin retained in the interior thereof, with a resin to be used for a subsequent molding operation and operating the molding machine to pass the resin through the molding machine to thereby remove and withdraw the residual molding resin. A further method consists in charging a molding machine having residual molding resin retained in the interior thereof with a cleaning composition, operating the molding machine to pass the cleaning composition through the molding machine to thereby remove and withdraw the residual molding resin, while causing a part of the cleaning composition to be retained as a residual cleaning composition in the interior of the molding machine, charging the molding machine having the residual cleaning composition retained therein with a fresh molding resin, and operating the molding machine to replace the residual cleaning composition with the fresh molding resin.
The above-mentioned known cleaning compositions are (1) a composition (semi-melt type) comprising an acrylic resin having a superhigh molecular weight and, contained therein, a foaming agent, kaolin and calcium carbonate, (2) a composition (complete melt type) comprising a resin containing a surfactant, and (3) a composition (blend type) comprising a metallic soap containing a foaming agent, which is adapted to be blended with a resin before use in the cleaning of a molding machine.
However, all of the above conventional cleaning methods have inherent drawbacks. That is, the manual method in which the molding machine is disassembled, has drawbacks in that the workers' time is gravely wasted, thereby causing productivity to be low. Further, in this manual method, residual molding resin is likely to remain in some particular regions of the molding machine, for example, on the inner wall of a cylinder, where disassembly of parts is difficult for a structural reason.
In the method in which the removal of residual molding resin is performed by the use of a resin to be used for a subsequent molding operation, the cleaning effect of the resin is so low that a large amount of the resin is wasted, and that a long period of time is consumed for cleaning, because such a resin is generally suitable for molding but not for cleaning. Further, some types of residues retained in a molding machine, such as thermal decomposition products of rubbers, cannot be easily removed by this method.
In the method in which the removal of residual molding resin is performed by the use of a cleaning composition, all of the known cleaning compositions have serious drawbacks, which render it difficult to put the conventional cleaning compositions in practical use. That is, in the case of the semi-melt type cleaning composition (1), the composition itself is likely to remain as a residue in the interior of a molding machine, which residue is likely to get mixed into a fresh molding resin, thereby causing the final shaped article to have poor properties. In the case of the complete melt type cleaning composition (2), it has poor cleaning effect, and it is also likely to remain as a residue in the interior of a molding machine, causing the satisfactory removal of the residue to be troublesome and time-consuming. In the case of the blend type cleaning composition (3), it usually needs to be blended with a molding resin before use. This composition also has poor cleaning effect, and the prior blending with a molding resin is disadvantageous from the viewpoint of production efficiency. In the case of this blend type cleaning composition, best results are obtained when the type of a molding resin to be blended with the cleaning composition in the prior blending is the same as that of the residual molding resin to be removed. Accordingly, when a wide variety of molding resins are employed in a molding workshop, this disadvantageously makes it necessary to prepare a wide variety of cleaning compositions.
In the method in which the removal of residual molding resin is performed by the use of a cleaning composition, the residual cleaning composition remaining in the interior of a molding machine must be replaced with a fresh molding resin before molding the fresh molding resin, as mentioned above. Therefore, the cleaning composition must have not only high removing effect on a molding resin employed in the molding prior to the cleaning with the cleaning composition, but also high replaceability with a fresh molding resin to be employed in the molding subsequent to the cleaning with the cleaning composition. However, all of the conventional cleaning compositions are unsatisfactory not only in the cleaning effect but also in the replaceability with a fresh molding resin.
For example, when a molding machine having been used for molding a styrene resin is cleaned by the use of a blend type cleaning composition (which has been blended with a styrene resin) and used for molding an olefin resin, it is generally observed that replacing of the cleaning composition with the olefin molding resin is difficult, thereby causing a large amount of an olefin molding resin and a long period of time to be consumed for the replacing of the cleaning composition. The similar observation is made when a molding machine having been used for molding an olefin resin is cleaned by the use of a blend type cleaning composition (which has been blended with an olefin resin) and used for molding a styrene resin.
Styrene resins and olefin resins are plastics which are most frequently employed for molding, and hence it is frequently encountered that a molding machine having been used for molding an olefin resin must be cleaned for a subsequent molding of a styrene resin, and that a molding machine having been used for molding of a styrene resin must be cleaned for a subsequent molding of an olefin resin. Therefore, there has been a strong demand in the art for a cleaning composition capable of exhibiting not only excellent removing effect for residual molding resin retained in the interior of a molding machine but also excellent replaceability with a fresh molding resin to be used for subsequent molding operation.

Cleaning composition for a molding machine and a cleaning method


A multichannel system, including a multiplexer having inputs for a plurality of input channels, and a pre-charge buffer having a plurality of inputs coupled to an input of the multiplexer, and an output coupled to a multiplexer output. The multichannel system may stand alone, or may be coupled to a receiving circuit having an input coupled to an output of the multiplexer. In some instances, the receiving circuit is an analog to digital converter.

The present invention relates to fast channel switching systems, and more particularly, to an input current cancellation scheme in fast channel switching systems.
As electronic systems continue to grow in complexity, many devices, such as communication and medical equipment, simultaneously receive and process data signals originating from multiple data channels. For example, advanced communication protocols, such as Long Term Evolution (LTE), make use of multiple antennas to implement multiple input multiple output (MIMO) techniques on both mobile devices and base stations to achieve increased data rates. In such MIMO systems, multiple signals can be received and processed in parallel. In another example, medical devices, such as ultrasound, process data from multiple sensors to generate a single output, such as an image.
As can be expected, the analog to digital converter (ADC) a fundamental component of these electronic devices. Referring to the examples above, the ADC typically receives analog signals from a signal source (e.g., an antenna or a sensor), which are then converted by the ADC to a digital code representing the data. Accordingly, in multichannel receivers, each parallel analog signal is typically processed by one or more ADCs to produce an output digital signal. To convert multichannel analog signals to digital form, several circuit architectures have been developed.
In a related art approach, a separate ADC is included for each input channel. In addition to the high component cost associated with including an ADC on each channel, the power consumption of this arrangement is also significantly increased.
In another related art approach, a front-end multiplexer is employed such that each input channel is coupled to the front-end multiplexer, and the output of the multiplexer is relayed to the ADC and the rest of the circuitry in the chain. A drawback of this scheme is that it draws considerable input current from the input driver which becomes a concern as the speed of the switching increases. In addition, capacitance on the output of the multiplexer can cause input currents when switching channels.
To increase the switching speed of ADCs, input buffers can be used to charge an ADC input capacitor in order to reduce residual input current. Residual input current has undesirable effects including undesired gain, offset, and nonlinearity issues. The input buffer may have an offset that can be cancelled out by using a chopping mechanism. These techniques, however, reduce the accuracy of the ADC's output.
In yet another related art approach, the multiplexer output and the ADC input are decoupled and an external buffer is disposed at the front-end of the ADC. Here, the capacitance on the output side of the multiplexer can be particularly high (i.e., compared to internal loads) which results in high input currents at fast channel-switching rates.
As related art techniques either have high power consumption or low switching rates, the inventors perceive a need for a multichannel system that overcomes the above-identified drawbacks of existing systems.

Input current cancellation scheme for fast channel switching systems


A propulsion unit control system is provided for a boat having plural propulsion units provided side by side and electrically connected in association with two adjacent operation levers. The control system synchronizes engine speeds of the respective propulsion units with each other in light of inputs to the two operation levers. The control system computes a deviation between the averaged engine speed of a reference propulsion unit and the averaged engine speed of a propulsion unit to be synchronized, and corrects a throttle opening of the propulsion unit to be synchronized based on the computed deviation in order to synchronize the engine speeds of the respective propulsion units with each other.

1. Field of the Invention
The present invention relates to a control system for a boat having plural propulsion units provided side by side, and more particularly to a control system that selectively synchronizes engine speeds of the respective propulsion units with each other.
2. Description of the Related Art
One conventional boat has three propulsion units, such as outboard motors, stern drives or inboard-outdrive arrangements, provided side by side at its stern. In this type of boat, there typically are provided three shift/throttle lever pairs associated with corresponding ones of the individual propulsion units. Operating the six levers in addition to a steering wheel is cumbersome and can be troublesome to the operator.
To address this issue, one proposed control system connects operation control units for controlling operating conditions of outboard motors to each other via a communication line for sending and receiving information on operations of the respective outboard motors (See Japanese Publication No. JP-A-Hei 8-200110). In addition, another proposed control system uses two adjacent left and right operation levers to control shift and throttle operations of all of the plural propulsion units. With the operation levers tilted at equal angles, if the engines of the left and right propulsion units rotate at different speeds, a motor of a throttle actuating unit is actuated so as to equalize the engine speeds of the left and right propulsion units with respect to the engine speed of the right propulsion unit. As such, the engine speeds of the left and right propulsion units are synchronized with each other automatically (See Japanese Publication No. JP-A-2000-313398).
As described above, with the left and right operation levers tilted at equal angles, the control system synchronizes the engine speeds of the respective propulsion units with each other. However, variations in engine speed, variations in throttle opening or an engine load condition may exist because of, among other things, differences in the engines mounted to the respective propulsion units. These variable conditions occasionally impair the control system from immediately and smoothly synchronizing the engine speeds of the respective propulsion units with each other.


Embodiments related to network video messaging are disclosed. One disclosed embodiment provides a method that comprises receiving a video message from a client application of a source client; associating a navigation link with the video message; transmitting a notification message to the recipient client including the navigation link; receiving a retrieval request from the recipient client to access the video content via the navigation link; and transmitting the video content to the recipient client responsive to receiving the retrieval request by providing a persistent download of the video content from the storage server if the download condition indicates that a persistent download of the video content is permissible; and providing a transient download of the video content to the recipient client while prohibiting a persistent download of the video content if the download condition indicates that a persistent download of the video content is not permissible.

Messaging systems facilitate communication between two or more computing devices on a network. Electronic mail is one example of a messaging system that facilitates network communication. Some messaging systems enable a message, including media attachments such as pictures, video, or audio that has been transmitted to a given recipient to be forwarded to other recipients, thereby increasing dissemination of the message.


A reinforced hose including at least one of a pressure-resistant reinforcement, a tensile-strength reinforcement and/or an inner carcass. At least one of the pressure-resistant reinforcement, the tensile-strength reinforcement and the inner carcass have at least one elongated element formed as one of a profile, a cable, an interlockable wire, and a strip with the at least one elongated element being composed of an aluminum-based alloy.

For numerous applications of such hoses, it is often desirable and sometimes necessary to have light hoses available, particularly for deep-sea applications.
The hoses according to certain embodiments of the present invention may, in particular, be laid at sea at great depths.
One of the problems encountered when such hoses are laid at great water depths results from the weight of the suspended hose.
The strain on the hose resulting from its weight increases with increasing proximity to the surface of the water, starting from the bottom.
Thus, it is when the hose is held at the surface that the greatest strain is found in the hose.


A hopper coin feeder (1) comprises upper and lower hopper discs (18, 25). A flexible hopper wall (17) of diabolo shape cooperates with the upper disc (18) to control the feeding of coins by a coin pushing member (35) to the outer margin of the disc (18) where they are gripped between an annular band (33) and the disc (18) to be conveyed past a coin discriminator (61). Any coins or debris that drop from the edge of upper disc (18) are caught on the lower disc (25) and pass to a reject chute (132) and coin payout cup (12). An active coin delivery chute and diverter (80), FIG. 10, comprises a reciprocable plate (81) having a finger (82) which controls whether a coin fed from the upper disc (18) passes down the chute or is rejected onto the lower disc (25). Coins that pass down the chute enter a bowl (89) of a double-disc coin conveying assembly (5) that conveys a coin from the bowl (89) to a LIFO coin stacks (3) of a coin storage unit (1). Oversize coins that enter the chute can be directed through the bowl (89), and through aligned apertures (8) in the coin conveying discs, to pass into a coin outlet (10) also leading to the payout cup (12).

An example of a hopper coin feeder of the horizontal disc type is that described in Patent Specification WO 99/33030 of Scan Coin AB. The coin feeder is part of a coin sorter, the SC Active 2200, which is a relatively bulky high speed machine for handling large quantities of coins in banks or cash centres, for example. The present invention stems from work to produce relatively compact coin handling equipment that can be used, for example, in a retail outlet in association with a till. Such equipment may operate at slower speeds than that of the SC2200 and accordingly this can involve smaller angular velocities of coins in the hopper.
When coins are input to a hopper coin feeder in a batch ideally the coins must be separated into a single layer so that they can be fed one by one to a coin discriminator. It is desirable for coins to be presented individually to the discriminator to allow them to be correctly sorted and/or counted. If the coins are not separated in this way it is possible for 'piggyback' coins (that is, one coin with one or more other coins riding on top of it) to make discrimination and/or counting of coins inaccurate.
It is known from WO 99/33030 for example, to provide a hopper comprising a stationary rigid cylindrical (or part-cylindrical) wall, which defines the principal coin-holding zone of the hopper and which has a stepped lower edge to define with the upper face of the horizontal disc a coin outlet gap from said zone, the gap being substantially the same height as the thickness of the thickest coin to be handled. When in use, the coins are carried by the rotating disc they tend to move outwardly under the influence of centrifugal force to impact the wall, and the stepped lower edge acts to scrape off the top layer of coins, only allowing coins with a thickness less than the height of the outlet gap to pass beneath the wall. Coins which can be fed by such a hopper feeder are obviously limited to those having a thickness which is less than the height of the outlet gap.
This arrangement is not completely satisfactory when feeding a mixed batch of coins, as not all coins are the same thickness. In a case where the combined thickness of two thin coins is less than the thickness of the thickest coin which can be fed through the outlet gap, it is possible for two thin coins to pass under the wall on top of each other. In addition to this, it is possible for two such piggyback coins to become jammed within the gap. Such a jam may be acceptable in a bank or cash centre setting, where the machine operatives are relatively skilled and are capable of quickly clearing the jam. It is not satisfactory, however, in a retail setting. In this situation a coin feeder is desired to be easy to operate and relatively fault free, as well as being capable of presenting a single layer of coins to a coin discriminator in order to allow the coins to be accurately counted and/or sorted.


This invention provides a vector comprising an isolated nucleic acid which encodes a protein of interest linked to one or more nucleic acid segments encoding at least two Green Fluorescent Proteins. Provided is the method for detecting a protein of interest in a living cell which comprises: (a) transfecting the living cell with an isolated nucleic acid which encodes the protein of interest linked to at least two Green Fluorescent Proteins. Additional isolated nucleic acids different from the nucleic acid segment of interest may also be linked to at least two nucleic acid which encodes at least two molecules of Green Fluorescent Protein. (b) culturing the transfected cell in conditions permitting expression of Green Fluorescent Protein and the protein of interest; and (c) detecting the fluorescence of the Green Fluorescent Protein, thereby detecting a protein of interest in a cell.

In order to follow the dynamics of single cellular micro-tubules in living cells using time-lapse imaging, expression at high levels of Green-Fluorescent Protein linked to the microtubule associated protein were required. Traditional Green Fluorescent Protein labeling methods induced artifacts such as micro-tubule bundling, mitotic abnormalities, photo bleaching (Heim, et al., 1996) (Cormack et al., 1996)and on/off blinking (Dickson et al, 1997). These labeling induced changes in cell morphology limits the usefulness of traditional Green Fluorescent Protein labeling in vivo.
This invention discloses a method for observing in vivo dynamics and function critical for many cellular processes in living cells using a Green Fluorescent Protein chimeric molecule (GFP-Ensconsin) to provide a non-perturbing label of cellular components.
This invention discloses that the Green Fluorescent Protein chimeric molecule produces a strong stable fluorescence signal useful in labeling individual protein components making them visible for quantitation by fluorescence speckle microscopy and time lapse imaging.

Protein conjugates containing multimers of green fluorescent protein

The Trustees of Columbia University in the City of New York


A method for processing a 3D audio effect and related products are provided. The method includes the following. In a VR scenario, eight first positions of eight monaural sound sources and eight pieces of monaural data corresponding to the eight monaural sound sources are obtained, where the eight monaural sound sources correspond to a target object, and each eight monaural sound source locates at a position with unique 3D coordinates. A second position of a target object in the VR scenario is obtained, where the second position has 3D coordinates, and the eight first positions and the second position are based on the same coordinate origin. A distance between each of the eight first positions and the second position is determined to obtain eight distances. The eight pieces of monaural data are adjusted according to the eight distances. The eight pieces of monaural data adjusted are synthesized to 7.1-channel data.

With popularity of electronic devices such as mobile phones, tablets, etc., the electronic devices can support an increasing number of applications and have powerful functions. The electronic devices are developing in a diversified and personalized way, becoming indispensable electronic products in daily life.
With technology development, VR is widely used in the electronic devices. However, for VR products, audio data received by existing headphones is usually two dimensions (2D) audio data. Accordingly, reality of sounds cannot be provided for users, thereby affecting user experience.

Method for processing 3D audio effect and related products

GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.


A flushable cover for a plunger with a layer of a flushable paper material and a layer of a film soluble in cold water. The cover is constructed to maintain integrity during use of the plunger, but at the same time being capable of being broken down in water.

A plunger is typically used to unclog toilets or other plumbing fixtures. During use, the plunger typically must be immersed in water. It, therefore, becomes saturated with water and exposed to contaminants, such as urine, fecal matter, used toilet paper, etc. After use, the plunger is removed from the fixture, which typically results in potentially contaminated water dripping outside the fixture. It must also be cleaned, which further results in potential human contact with the contaminants.


Provided is an airbrush in which a needle cap separated from a nozzle is not easily lost. The airbrush includes: an airbrush body; a nozzle that is provided at a tip of the airbrush body so as to spray paint and air; a needle cap that is separably attached to the nozzle; and a needle cap attachment portion that is provided at a rear end of the airbrush body so as to temporarily attach the needle cap separated from the nozzle thereto.

An airbrush is a tool that splashes paint in the form of mist by compressed air, and may simply perform an even painting operation which is not easily performed in a brush.
For example, as disclosed in Patent Document 1 , such an airbrush includes an airbrush body that is substantially formed in a pencil shape. The tip of the airbrush body is provided with a nozzle that sprays paint and air. A paint container is provided in the tipper portion of the airbrush body of the rear portion of the nozzle. Paint inside the paint container is led into the nozzle by the operation of an operation rod to be described later. The substantial center of the airbrush body is provided with an air supply hole that supplies compressed air and the operation rod that leads the compressed air supplied from the air supply hole to the outer periphery of the nozzle. A needle is provided inside an axial portion of the airbrush body so that the tip of the needle is biased so as to seal a paint spray hole of the nozzle. The sealing may be released when the needle retreats by the operation of the above-described operation rod.
In the airbrush with such a configuration, when the operation rod is pushed toward the airbrush body, the compressed air from the air supply hole is sprayed along the outer periphery of the nozzle. Further, when the operation rod moves backward, paint is sprayed through the paint spray hole of the nozzle of which the sealing by the needle is released.
Here, the sealing of the paint spray hole of the nozzle by the needle is performed by, for example, a valve structure in which the tip of the needle penetrates the paint spray hole of the nozzle so as to be freely extracted therefrom and inserted thereinto. When the tip of the nozzle through which the needle protrudes from the paint spray hole contacts a painting subject or the like, the needle is easily damaged, bent, or deformed, and hence a problem arises in the line thickness or the spraying direction of the paint. For this reason, the tip of the nozzle is provided with a needle cap that protects the needle.
[Patent Document 1] JP 2000-140719 A


An opening part cuts a periphery of a package which contains a bundle of PS (photosensitive) plates. Then, a lifter separates a top piece of the package from the bundle of the PS plates, and a cartridge body, which has been transferred by the lifter, is put on the bundle of the PS plates from which the top piece of the package has been separated. An inverter inverts the top and bottom faces of the bundle of the PS plates covered with the cartridge body, and then, the lifter separates the bottom piece of the package from the bundle of the PS plates. A cartridge lid, which is transferred by the lifter, is put on the bundle of the PS plates from which the bottom piece of the package has been separated.

1. Field of the Invention
The present invention relates generally to a method and apparatus for repacking a photosensitive tabular printing plate, and more particularly to a method and apparatus for repacking, in a darkroom, a photosensitive tabular printing plate from a package into a cartridge composed of a body and a lid.
2. Description of Related Art
A photosensitive tabular printing plate (PS plate: presensitized lithographic plate) in the market uses an aluminum plate as a support thereof, and it is widely used. A user of photoengraving machines performs printing by means of the PS plate which is manufactured by a manufacturer of printing materials. The PS plates supplied from the manufacturer are usually packed in a package so as not to expose themselves. The user usually repacks, in a darkroom, the packed PS plates from the package into a cartridge adopted to a supply part of a photoengraving machine to be used.
If, however, the user repacks the PS plates from the package into the cartridge whenever the user is supplied with the PS plates from the manufacturer, it is inconvenient and inefficient. Moreover, since the PS plates must be repacked in the darkroom, there is a problem concerning safety.
In order to eliminate the above-stated disadvantages, there is a method in that the manufacturer packs the PS plates in a special cartridge adopted to the photoengraving machine which is to be used by the user, and then the PS plates are supplied to the user. In this case, the special cartridge is expensive and it is difficult to recycle the cartridge, and because of this there is increased cost.

Method and apparatus for repacking a photosensitive tabular printing plate


A cushioning member for use in a circuit board includes an elastic main body and a fixing element. The fixing element is coupled with the elastic main body and aligned with a perforation of the circuit board. The fixing element includes an extension part and a fastening part. The extension part is arranged between the elastic main body and the fastening part. The fastening part is arranged on an end of the fixing element. The fastening part is sustained against a first surface of the circuit board and the extension part is received in the perforation after the fixing element is penetrated through the perforation, so that the cushioning member is combined with the circuit board and the elastic main body is attached on a second surface of the circuit board, wherein a cushioning efficacy is provided when the electronic device is suffered from an external force.

Recently, the general trends in designing portable electronic devices are toward small size, light weightiness and easy portability. The portable electronic devices such as mobile phones, personal digital assistants (PDAs), digital still cameras, digital video cameras, notebook computers and the like have built-in batteries. If no external power supply apparatus is provided to power the portable electronic device, the built-in battery is usually used as the main power source. If the power supplied from the battery is insufficient, the user may simply plug a power supply apparatus (e.g. a power adapter or a charger) into an AC wall outlet commonly found in most homes or offices so as to receive an AC voltage. The AC voltage is then converted into a DC power to be used for the portable electronic device and/or charge the built-in battery.
Referring to FIG. 1A, a schematic exploded view of a conventional power adapter is illustrated. The power adapter 1 principally comprises a casing member 11, a metallic shielding member 12, an insulating member 13 and a circuit board 14. The casing member 11 includes an upper casing part 111 and a lower casing part 112. The metallic shielding member 12 is used for minimizing the influence of electro-magnetic interference (EMI) and includes an upper shielding part 121 and a lower shielding part 122. For safety, the insulating member 13 is arranged between the circuit board 14 and the metallic shielding member 12 for isolating the circuit board 14 from the metallic shielding member 12. The insulating member 13 is substantially a thin film layer such as an insulating tape. The insulating member 13 is attached onto the inner surfaces of the upper shielding part 121 and the lower shielding part 122 so as to define a receptacle 131 for accommodating the circuit board 14 therein. Some electronic components 141 are mounted on the circuit board 14 for providing power conversion.
FIG. 1B is a schematic cross-sectional view of the circuit board shown in FIG. 1A. Some of the electronic components 141 have respective pins 142 inserting into holes (not shown) of the circuit board 14 from a first surface 143 to a second surface 144. The pins 142 are fixed on the second surface 144 of the circuit board 14 via solder paste 145 such that the electronic components 141 are mounted on the first surface 143 of the circuit board 14. Generally, after the pins 142 penetrates through the holes, the tips of the pins 142 are protruded from the second surface 144 of the circuit board 14 by a specified length.
During the power adapter 1 is subject to a shock test, the circuit board 14 is suffered from vibration in the vertical direction. If the vibration is too strong, the pins 142 protruded from the second surface 144 of the circuit board 14 may pierce though the insulating member 13 and thus the electronic components 141 on the circuit board 14 will be in direct contact with the metallic shielding member 12. Under this circumstance, the power adapter 1 has a malfunction and the product yield is reduced.
Similarly, if the power adapter 1 is suffered from a drop or a strong impact, the pins 142 protruded from the second surface 144 of the circuit board 14 may pierce though the insulating member 13 and thus the electronic components 141 on the circuit board 14 will be in direct contact with the metallic shielding member 12. Under this circumstance, the power adapter 1 has a breakdown and the reliability of the power adapter 1 is reduced.
Therefore, there is a need of providing a cushioning member for use in a circuit board of an electronic device so as to obviate the drawbacks encountered from the prior art.

Cushioning member and electronic device with such cushioning member


The present invention is achieved with the object of providing an illumination system formed of an LED light emitting body and a socket which can appropriately release heat from LED chips. This object is achieved in the following manner. A heat conducting layer 12 made of diamond is provided on a substrate 11, and on top of this, a conductive layer 13 having a predetermined pattern is formed. LED chips 16 are mounted in predetermined positions on the conductive layer 13. Terminals of the conductive layer 13 and electrodes of the LED chips 16 are connected to each other. A connector part 14 for the connection to a socket is provided in an end portion of the substrate 11. The heat conducting layer 12 on the connector part 14 makes thermal contact with the heat conducting layer provided on the inner surface of the opening of the socket. A current is supplied to respective LED chips 16 through the conductive layer 13 from the socket, and respective LED chips 16 emit light. Heat that is generated in the LED chips 16 is released to the outside of the illumination system from the socket through the conductive layer 13, the heat conducting layer 12 and the connector part 14. As a result of this, an increase in the temperature of the LED chips 16 can be prevented, and an LED illumination system that emits a large amount of light can be formed.

As a result of the development of gallium nitride based LEDs (GaN-LEDs) that emit blue light, utilization of LEDs as illumination devices have recently been the focus of attention. When used as an illumination device, gallium nitride based LEDs have a variety of properties, such as (a) the life of elements is long, almost infinite for practical use, (b) energy efficiency is high, and little heat is released, (c) luminosity is high, (d) light controlling properties are excellent (a desired tone of color can be generated), and (e) the size of a single element is very small, making it possible to mount elements in a desired form, as compared to conventional illumination devices, such as incandescent light bulbs and fluorescent lamps.
It is desirable for white light to be gained in order to use LEDs as light sources. In recent years, a white light source (white LEDs) has been implemented by covering a GaN-LED with an yttrium aluminum garnet fluorescent thin film, and therefore, it can be expected that LED illumination devices will be more widely used in the future.
It is necessary to make LED illumination devices easy to handle in the same manner as conventional electric lamps and fluorescent lamps, in order for LED illumination devices to gain widespread in household use. For example, though LEDs have a life that is longer than that of conventional light bulbs and fluorescent tubes, still, in some cases, it becomes necessary to change them in general homes. Therefore, it is desirable for the attachment and removal of LED light sources (which corresponds to light bulbs and fluorescent tubes) to and from illumination devices to be able to be carried out in the same manner as or more easily than conventional electric lamps and the like.
However, such LED illumination devices where attachment and removal of an LED light source can be easily carried out have not been researched.
In addition, it is necessary to solve the problem where the temperature of LED chips increases when supplied with a large amount of power, as described below, when LEDs are used for an illumination device.
At present, the intensity of light flux that is gained from a white LED, as described above, is several lm (lumen) when the LED is in bullet form (having a diameter of 3 mm), and is several tens of lm when the LED is of a large area type with high brightness. However, it is necessary to gain light flux of 1000 to several thousands of lm from such a white LED, in order for the white LED to be used as a light source for a liquid crystal projector or a light source for the headlights of an automobile. In order to achieve this, it is necessary to supply power of 20 W to 100 W or greater to the white LED, because the light emitting efficiency of white LEDs at present is approximately 25 (lm/W) at the maximum when the white LED is of a type that is currently in use, and approximately 50 (lm/W) at the maximum when the white LED is of a type that is prepared in a laboratory.
In the case where such a large amount of power is supplied to a presumably small mounting region for a light source as that described above, there is a risk that the LED chip may store heat and the temperature may increase. In addition, even in the case where this heat is conveyed to the substrate on which the LED chip is mounted, this substrate stores heat, which increases the temperature, and thereby, there is a risk that the temperature of the LED chip may also increase. LEDs are semiconductor devices, and therefore, the higher the temperature becomes, the higher the probability of occurrence of non-radiative recombination becomes, reducing the light emitting efficiency. Accordingly, it is necessary to appropriately release heat generated in an LED chip to the outside so as to prevent the temperature of the LED chip from excessively increasing, in order to make an LED illumination device emit a large amount of light efficiently.
Japanese Unexamined Patent Publication No. 2002-232009 describes the release of heat from the surface of a conductive pattern for supplying power to LEDs which are provided on a flexible substrate (see [0050] and FIG. 4), and the release of heat from a fin for heat release made of a silicone resin which is provided on the rear surface of a flexible substrate (see [0046] and FIG. 8). Here, concerning the material of the flexible substrate, there is a description "flexible resin member" in [0032]. Therefore, the function of a substrate in the release of heat has not yet been sufficiently looked into.
Meanwhile, the present inventors have proposed that an LED chip be mounted on a diamond substrate (or a substrate of which the surface is covered with diamond or diamond carbon) in order to convey to the outside heat that has been generated in the LED chip, in Japanese Unexamined Patent Publication No. 2002-329896 (see [0020] and FIG. 3). The thermal conductivity of diamond at room temperature is approximately 20 W/cmK, which is higher than that of a substrate that is conventionally used to mount an LED chip (sapphire, quartz, SiC, GaN, AlN or the like) by one digit to two digits. Therefore, the heat that is generated in an LED chip is absorbed by the diamond substrate so that an increase in the temperature of the LED chip can be restricted.
The substrate for mounting an LED chip is as thin as several mm, so that the space for installment can be made small. Therefore, heat from the LED chip tends to be stored in the substrate. In Japanese Unexamined Patent Publication No. 2002-329896, the heat that is absorbed by the diamond substrate is "released to the outside from the bottom and the sides" of the substrate ([0020]). However, in the case where the density of installment of LEDs is further increased, release of heat from the substrate to the surrounding air becomes insufficient, making the temperature of the substrate increase. Therefore, there is a risk that the heat generated in an LED chip may not be appropriately released.
The present invention is provided in order to solve such problems, and an object thereof is to provide an LED illumination system where an LED light source can be easily attached and removed. Another purpose of the present invention is to allow such an LED illumination system to appropriately release the heat that is generated in LEDs to the outside of the system.


An image detector (1) has a first substrate (10) carrying an electromagnetic radiation conversion layer (11) for converting incoming electromagnetic radiation (A) with a first range of wavelengths into outgoing electromagnetic radiation (B) with a second different range of wavelengths and a photodetector array (21) is carried by a second substrate (20) and responsive to the second range of wavelengths for detecting outgoing electromagnetic radiation (B) emitted by the layer (11). The second substrate (20) is mounted to the first substrate (10) by a mounting arrangement (40) defining an insulative space (50) which provides good electrical isolation between the photodetector array (21) and the electromagnetic radiation conversion layer (11). The use of separate substrates (10 and 20) enables the photodetector array (21) and electromagnetic radiation conversion layer (11) to be manufactured independently of one another using optimum processes for producing the desired properties for the photodetector array (21) and electromagnetic radiation conversion layer (11), respectively.

European Patent Application No. EP-A-0125691 describes such an image detector in which the photodetector array is provided as a matrix of photosensitive diodes or photodiodes and associated thin-film circuitry on one major surface of an insulative substrate and the electromagnetic radiation conversion layer is provided as a layer of phosphor material dispersed in a binder on the other surface of the insulative substrate. Such an arrangement requires that the insulative substrate be transparent to the outgoing radiation emitted by the electromagnetic radiation conversion layer. Moreover, it requires that the processing technology used to provide the phosphor layer be compatible with that used to form the photodetector array and, for example, the processing temperatures which can be withstood by amorphous silicon thin film circuits lie at the lowermost end of the deposition temperature range for phosphors such as caesium iodide.


An entrapment tunnel watercraft vessel having three hulls consists of a main hull and two amas arranged outboard of the main hull with the keels of the three hulls being parallel. The main hull is a narrow, vee hull with variable, rearwardly decreasing deadrise. The amas have very fine bows and narrow, asymmetric deep-V hulls, with nearly vertical slab outboard sides above their keels and variable reverse deadrise on their inboard sides with the reverse deadrise angles decreasing from bow to stem. The tunnels on each side of the main hull are formed by three distinct surfaces, the sides of the main hull above its chine, the reverse deadrise inboard sides of each ama upward from their keels and a ceiling surface transversely spanning the aforementioned sides and having rearwardly increasing deadrise and rearwardly decreasing width. The tunnel ceilings slopes down from the bow to a section aft of midship where the ceiling height above the keel remains essentially constant. At speed the craft generates substantial amounts of lift and positive trim, thereby reducing the forward wetted length of the immersed tunnel ceiling and the apex of the ceiling is approximately at the craft dynamic waterline. As a result the watercraft vessel has improved seakeeping, stability and weight carrying ability.

Prior art air entrapment tunnel boats including catamarans, air entrapment tunnel monohulls, etc. are designed for the tunnel ceilings to become totally ventilated at design speeds and thereby reduce wetted surface drag while achieving some aerodynamic lift.
Other prior art watercraft, as for example, the Hickman Sea Sled, Boston Whalers, Tri-hulls and cathedral hulls are designed to keep aft portions of their entrapment tunnels at least partially immersed. The majority of these tunnels are rearwardly sloping and in cross section, typically arcuate. Tunnels that were angular were formed by the convergence of the main hull bottom deadrise and ama inboard side deadrise or main hull side deadrise above the chine and ama inboard side. Some tunnels had a distinct third ceiling surface that was usually of constant width in the aft section and were either flat horizontally or had very little deadrise.
Either submerged propellers or waterjets lose efficiency and effectiveness when ventilated and this has been a serious problem with prior art craft of the type described above. Since the tunnels of the craft constructed in accordance with the present invention are not formed by the convergence of the ama and main hull sides or bottom, the tunnel and main hull are treated as separate running bottoms designed to compliment each other to optimize total performance.

Entrapment tunnel monohull optimized waterjet and high payload


A photovoltaic cell can include a dopant in contact with a semiconductor layer. The photovoltaic cell can include a transparent conductive layer and a first semiconductor layer in contact with the transparent conductive layer, the first semiconductor layer including magnesium. In certain circumstances, a substrate can be a glass substrate. In other circumstances, a substrate can be a metal layer. The first semiconductor layer can include CdS. The first semiconductor layer can have a thickness of between about 200 or 3000 Angstroms. The first semiconductor layer can include 1-20% magnesium. A method of manufacturing a photovoltaic cell can include providing a transparent conductive layer and depositing a first semiconductor layer in contact with the transparent conductive layer, the first semiconductor layer treated with magnesium.

During the fabrication of photovoltaic devices, layers of semiconductor material can be applied to a substrate with one layer serving as a window layer and a second layer serving as the absorber layer. The window layer can allow the penetration of solar energy to the absorber layer, where the optical energy is converted into electrical energy. Some photovoltaic devices can use transparent thin films that are also conductors of electrical charge. The conductive thin films can be a transparent conductive oxide (TCO), such as fluorine-doped tin oxide, aluminum-doped zinc oxide, or indium tin oxide. The TCO can allow light to pass through a substrate window to the active light absorbing material and also serves as an ohmic contact to transport photogenerated charge carriers away from the light absorbing material. A back electrode can be formed on the back surface of a semiconductor layer. The back electrode can include electrically conductive material, such as metallic silver, nickel, copper, aluminum, titanium, palladium, or any practical combination thereof, to provide electrical connection to the semiconductor layer. The back electrode can be a semiconductor material. Doping the semiconductor layer can improve the efficiency of a photovoltaic device.

Photovoltaic devices including MG-doped semiconductor films


An egg is accelerated such that the inner and outer shell membranes separate and allow the air cell to move within the egg when the egg is repositioned. By separating the outer and inner shell membranes of an egg, the air cell will reposition itself at the upper portion of the egg shell. An egg may be accelerated in various ways according to embodiments of the present invention including, but not limited to, agitation, “flicking” by hand, spinning, rotating, centrifuging, etc.

In poultry hatcheries and other egg processing facilities, eggs are handled and processed in large numbers. The term "processing" includes treating live eggs with medications, nutrients, hormones and/or other beneficial substances while the embryos are still in the egg (i.e., in ovo). In ovo injections of various substances into avian eggs have been employed to decrease post-hatch morbidity and mortality rates, increase the potential growth rates or eventual size of the resulting bird, and even to influence the gender determination of the embryo. Injection of vaccines into live eggs have been effectively employed to immunize birds in ovo.
There are a number of applications for which it is desirable to inject eggs containing early avian embryos. For example, it may be desirable to deliver a substance to an early embryo, such as a blastoderm. To illustrate, it may be desirable in the poultry industry to manipulate an early embryo in ovo to introduce a foreign nucleic acid molecule (i.e., to create a transgenic bird) or to introduce a foreign cell(s) (i.e., to create a chimeric bird) into the developing embryo. Unfortunately, blastoderm visibility is very poor in the presence of the inner shell membrane of an avian egg. Moreover, blastoderm position may not be in the most favorable location for receiving a substance.
In addition, there a number of applications for which it is desirable to remove samples from eggs, including from early avian embryos. Further, there are a number of applications for which it is desirable to insert a sensing device inside an egg containing an embryo to collect information therefrom.
Current methods of inserting devices into avian eggs containing early embryos may be undesirable because they may result in unacceptably low hatch rates, and may cause other problems, such as the introduction of air bubbles into an egg, damage to extra-embryonic membranes or to the embryo itself, or a combination of these factors. Accordingly, there is a need in the art for improved methods of inserting devices into avian eggs.

Methods for manipulating air cells within avian eggs


A gas sensor is for determining at least one physical quantity of a gas, e.g., an exhaust gas of an internal combustion engine, the gas sensor having a sensor element that is fixed in a housing of the gas sensor by a seal assembly. The seal assembly includes a sealing element, which has a ceramic and/or a metallic material. After the heat treatment, the sealing element has a maximum decrease in volume of 5 percent, or an increase in volume, based on the volume of the sealing element prior to the heat treatment.

A gas sensor is described in German Published Patent Application No. 41 26 378. The gas sensor contains an oblong, planar sensor element, which makes contact with the gas to be analyzed, using a section on the side of the gas to be analyzed. Contact surfaces for contacting the sensor element to evaluation electronics arranged outside of the gas sensor are provided on a terminal-side section of the sensor element facing away from the section on the side of the gas to be analyzed. The measuring-gas-side and terminal-side sections of the sensor element are separated by a seal arrangement. The seal assembly is arranged between a molded ceramic part on the side of the measuring gas and a molded ceramic part on the side of the terminal. The molded ceramic parts and the seal assembly contain openings for accommodating the sensor element. To produce the seal, a premolded sealing ring is initially pressed between the two molded ceramic parts. While the sealing ring is pressed, it is converted to steatite powder, which then rests radially against the sensor element and the housing and thereby seals the sensor element in the housing. A seal assembly is also described in German Published Patent Application No. 195 32 090, where a further boron-nitride sealing element is pressed between two steatite sealing elements. As in German Published Patent Application No. 41 26 378, the sealing action may be attained in that a force is exerted by the molded ceramic parts on the sealing material in such a manner, that the sealing material is markedly compressed and presses against the sensor element and the housing due to deformation.
In the case of the described seal assemblies, it may be undesired that the sealing material is required to be under constant high pressure to achieve the required sealing effect. Therefore, such seal assemblies may be expensive and difficult to produce. In addition, the sensor element may be damaged by the forces occurring while the seal assembly is being pressed.
European Published Patent Application No. 0 706 046 describes a seal assembly, in which the sensor element is fixed in position in a ceramic retaining body by a glass seal. In addition, German Published Patent Application No. 198 52 674 and German Published Patent Application No. 101 23 168 describe a seal assembly having a sealing element, which contains a mixture of a ceramic powder, e.g. steatite, and a glass powder. The sealing element is heated to a maximum temperature of 1000 degrees Celsius. Due to this heat treatment, the glass powder is melted in the steatite matrix and thus diffuses into the pores of the steatite matrix. The ceramic portion is not sintered by the heat treatment.
In the case of seal assemblies that contain a glass fraction, it may be undesired that states of stress, which may lead to tears in the glass-containing seal, may occur during operational heating or cooling of the seal assembly, or under stress due to thermal shock. In addition, the electrical resistance of a glass-containing seal decreases considerably in response to higher temperatures occurring during the operation of the gas sensor so that unwanted currents may occur between the sensor element and the housing.


A lead adapted to be located within the cardiac vasculature is disclosed. The lead may be readily steered to a desired location within the cardiac vasculature to thereafter be securely located at a desired pacing site. The lead is provided with an improved electrode assembly located at its distal tip. The electrode assembly includes a fixation helix and a guidewire-like projection, both extending from the distal end of the lead body. The fixation helix, which may serve as all or part of the active electrode surrounds a structure corresponding to the distal end of a conventional guidewire. The fixation helix is mounted around the guidewire tip so that the sharpened tip of the helix lies closely adjacent to the guidewire tip, in a region of the guidewire tip which is sufficiently flexible to allow it to be moved away from the sharpened tip of the helix. The guidewire tip, which may be provided with a preformed curve at its distal end, is employed to navigate the lead through the cardiac vasculature in a fashion similar to the navigation of a catheter and guidewire in combination or a guidewire alone. Upon reaching the desired location within the cardiac vasculature, the lead may be rotated to screw one or more turns of the fixation helix into heart tissue, the flexibility of the guidewire tip allowing it to move away from the sharpened tip of the helix during the process of affixing the lead to the tissue.

The present invention relates to implantable electrode leads generally, and more particularly to leads adapted for use in the coronary sinus.
Recently, an increased interest in pacing the left atrium and ventricle of the heart has led to a resurgence of interest in location of cardiac pacing leads in the coronary sinus, great vein, or other cardiac vein. To this end, the use of guidewire placed leads, as disclosed in U.S. Pat. No. 3,769,984 issued to Muench, has resurfaced, leading to the development of a number of coronary sinus pacing leads intended to be advanced into a desired location within the cardiac vasculature over a guidewire. Some examples of such leads are disclosed in U.S. Pat. No. 6,033,414 issued to Tockman et al., U.S. Pat. No. 5,935,160 issued to Auricchio et al., and U.S. Pat. No. 5,304,218 issued to Alferness. As an alternative to advancing a lead to a desired position by means of a guidewire, it has also been proposed to fashion the tip of a lead with a preformed curve, so that the tip of the lead itself may be used to steer the lead through the cardiac vasculature. Such a lead is disclosed in U.S. Pat. No. 6,006,122 issued to Smits. In addition to renewed interest in locating leads within the cardiac veins, there has been significant developmental effort expended on solving the problem of maintaining a lead in a desired location in the cardiac veins. One group of solutions to this problem has been to provide the lead with a preformed set of bends or curves in the lead body, temporarily straightened by stylet, which upon removal of the stylet expand to wedge the lead within the cardiac veins. Examples of leads of this type are disclosed in U.S. Pat. No. 4,488,561 issued to Doring, U.S. Pat. No. 4,454,888 issued to Gold and U.S. Pat. No. 4,057,067 issued to Lajos, An alternative set of mechanisms for location of leads has been to provide an electrode, which is either configured to be wedged in the cardiac veins, or which is adapted to be expanded into contact with the wall of the cardiac veins. Such electrodes are disclosed in U.S. Pat. No. 6,006,122 issued to Smits, U.S. Pat. No. 5,224,491 issued to Mehra, and U.S. Pat. No. 5,991,668 issued to Leinders.
The present invention is directed toward a lead adapted to be located within the cardiac vasculature, which may be readily steered to a desired location within the cardiac vasculature and thereafter securely located at a desired pacing site. The present invention accomplishes these desired results by means of a lead provided with an improved electrode assembly located at its distal tip. The electrode assembly includes a fixation helix and a guidewire-like projection, both extending from the distal end of the lead body. The fixation helix, which may serve as all or part of the active electrode surrounds a structure corresponding to the distal end of a conventional guidewire (hereafter referred to as the xe2x80x9cguidewire tipxe2x80x9d). The fixation helix is mounted around the guidewire tip in such a fashion that the sharpened tip of the helix lies closely adjacent to the guidewire tip, in a region of the guidewire tip which is sufficiently flexible to allow it to be moved away from the sharpened tip of the helix. The guidewire tip, which may be provided with a preformed curve at its distal end, is employed to navigate the lead through the cardiac vasculature in a fashion similar to the navigation of a catheter and guidewire in combination or a guidewire alone. Upon reaching the desired location within the cardiac vasculature, the lead may be rotated to screw one or more turns of the fixation helix into heart or blood vessel tissue, the flexibility of the guidewire tip allowing it to move away from the sharpened tip of the helix during the process of affixing the lead to the tissue.

Implantable active fixation lead with guidewire tip


In one embodiment, a method for analyzing substrate noise includes applying a static timing analysis (STA) algorithm to a description of a digital circuit. Application of the STA algorithm generates timing information on one or more gates in the digital circuit. The method also includes applying a current waveform generation (CWG) algorithm to the description of the digital circuit, the timing information on one or more gates in the digital circuit, and a description of switching activity in the digital circuit. Application of the CWG algorithm generates a current waveform. The method also includes generating a reduced model (RM) of the digital circuit for simulation according to the description of the digital circuit, the current waveform, and a model of a package associated with the digital circuit. Simulation of the RM of the digital circuit generates an indication of noise in a substrate associated with the digital circuit.

Mixed-signal designs have become ubiquitous with the proliferation of deep submicron (DSM) system-on-chip (SoC) design methodologies. In such designs, maintaining signal integrity and reducing noise have become vexing issues. Switching noise due to large signal swings in the digital part can propagate through the common substrate and corrupt sensitive analog components. In designs that have low resistivity substrates, noise generated in one region of the die may cause the rest of the chip to malfunction. Decreasing feature size lets more devices to be packed on a chip, generating higher overall noise. Smaller devices are also more sensitive to noise because of reduced noise margins. The increasing switching rates and decreasing transition times are also responsible for more transients. Due to these DSM effects, SN analysis (SNA) has become a critical problem in most mixed-signal designs.
Traditionally, SPICE has been the primary tool used by designers for noise analysis. However, it is not feasible to use SPICE on a block having even 100,000 gates. Research work has been done on modeling SN during design phases. Much of this research derives a passive network model that can be simulated with SPICE to yield substrate noise patterns for the entire design for the set of input vectors from a testbench. Each cell in the library is simulated with SPICE for all possible inputs and power supply current and substrate injection currents are extracted. This knowledge is used to do a full-chip analysis. One problem with at least some previous approaches is that they do not consider package inductance and the associated power supply noise, and hence are not very practical. Some previous approaches do not consider the dependency of noise on the load at each gate. In at least one previous approach, a time-series divided parasitic capacitance model is use for time-domain power supply current estimation. Previous approaches are typically input-pattern dependent, i.e., a separate model must be derived for each input pattern. Even for a moderately sized design, the number of models can become very large. This leads to exorbitant run times, making these approaches impractical for a full-chip analysis. Also, there is no guarantee that the maximum noise will be reported, since the worst-case input pattern may not be present in the testbench.


Improved techniques are provided for parallel writing of data to a shared object in a parallel computing system. A method is provided for storing data generated by a plurality of parallel processes to a shared object in a parallel computing system. The method is performed by at least one of the processes and comprises: dynamically determining a block size for storing the data; exchanging a determined amount of the data with at least one additional process to achieve a block of the data having the dynamically determined block size; and writing the block of the data having the dynamically determined block size to a file system. The determined block size comprises, e.g., a total amount of the data to be stored divided by the number of parallel processes. The file system comprises, for example, a log structured virtual parallel file system, such as a Parallel Log-Structured File System (PLFS).

Parallel storage systems are widely used in many computing environments. Parallel storage systems provide high degrees of concurrency in which many distributed processes within a parallel application simultaneously access a shared file namespace.
Parallel computing techniques are used in many industries and applications for implementing computationally intensive models or simulations. For example, the Department of Energy uses a large number of distributed compute nodes tightly coupled into a supercomputer to model physics experiments. In the oil and gas industry, parallel computing techniques are often used for computing geological models that help predict the location of natural resources.
When a number of parallel processes write data to a shared object, block boundaries, data integrity concerns and serialization of shared resources have prevented fast shared writing. Recent efforts to address this problem have employed log structured virtual parallel file systems, such as a Parallel Log-Structured File System (PLFS). See, e.g., U.S. patent application Ser. No. 13/536,331, filed Jun. 28, 2012, entitled "Storing Files in a Parallel Computing System Using List-Based Index to Identify Replica Files," incorporated by reference herein. While such techniques have improved the speed of shared writing, they create a secondary challenge to maintain the necessary amount of metadata without creating unnecessary overhead since log structured file systems are known to create more metadata than traditional flat file filesystems.
A need therefore exists for improved techniques for parallel writing of data to a shared object, in order to reduce file system metadata.

Cooperative storage of shared files in a parallel computing system with dynamic block size


A method for manufacturing a semiconductor nano layer structure includes: two substrates are provided; a plurality of semiconductor nanowires are formed on one of the substrates; an absorption surface is formed on the other substrate; one of the substrates is fixed on a cylindrical roller, the cylindrical roller is brought into contact with a surface of the substrate which is stationary and is not fixed on the cylindrical roller, and rolled with a constant velocity and pressure so that the semiconductor nanowires are break, detached, transferred and absorbed, and a semiconductor nano layer structure is formed on the stationary substrate; a de-laminating process is performed to separate the semiconductor nano layer structure from the second substrate; an electric Joule heat welding process is locally performed to bond each of the semiconductor nanowires of the semiconductor nano layer structure or each semiconductor nano layer structure.

1. Technical Field
The present disclosure relates to a . nano layer structure and manufacturing method thereof, and especially relates to a semiconductor nano layer structure and manufacturing method thereof.
2. Description of Related Art
There exist urgent needs in the applications of high efficiency, low cost, large area and flexible displays or optoelectronic devices to the field of energy and mobile communication industry. In this regard, it is a must to make a breakthrough in conventional high efficiency and high cost manufacturing methods for ICs and low efficiency, low cost manufacturing methods for displays with glass substrate or thin-film solar cells, so as to meet the future requirements of the energy and mobile communication industry.
Recently, one-dimensional semiconductor nanostructure has become an essential component for the next generation electronic devices; optoelectronic devices, sensors or energy transforming devices owing to its unique features on mechanics, electrical conductions, optics, thermodynamics and chemistry. Nowadays, various semiconductor nanostructures have been developed. Many research teams utilize these semiconductor nanostructures to manufacture devices with various functionalities. However, it is a big challenge on how to transfer assembly, process and integrate the one dimensional semiconductor nanostructures to form nano electronic devices in a large scale and large area, and the aforementioned processes should be controllable, uniform and repeatable.
The main issue is that it is difficult to control the alignment and stacking direction during arranging, of the semiconductor nanowires in order to form a large area layer structure. Furthermore, for forming a semiconductor nano layer structure, conventionally it requires to disperse the nanowires on a substrate, this will lead to constrain on the followed manufacturing process. Therefore, to method that can form a large area and free-standing semiconductor nano layer structure composed of the semiconductor nanowires is very important.

Semiconductor nano layer structure and manufacturing method thereof


Automatic titration method and apparatus provides for adjustment of the electric potential of a solution. A programmed computer responsive to iterative measurements of the potential regulates a two-phase adjustment process which approaches the desired electric potential (overall aim) using sub-aims thereby preventing overshoot of the overall aim.

Titration is generally known as a method of determining volumetrically the concentration of a substance in a subject material by adding a standard solution of known volume and strength (this standard solution is known as the "titrant") to the subject material until a given reaction is completed.
Typically, titration is carried out to the "endpoint", i.e. the point at which the given reaction is complete, to determine the concentration of a given substance in the material. Various potentiometric, colorimetric, and coulometric titration processes are known in the art. Potentiometric determination methods are generally based on the determination of pH, ion activity, redox and other chemical potentials. Uses of titration techniques include determination of the contents of a chemical solution (See, U.S. Pat. No. 4,859,608 to Frueh) or to determine the concentration of certain functional chemical groups in a solution (See, U.S. Pat. No. 3,730,685 to Prohaska).
Titration processes require a high degree of precision, extensive operator interaction and are generally very time corisuining. Further, because the amount of titrant added to a solution to yield a given change will vary dramatically as the electric potential changes, overshooting the endpoint of a titration often occurs. Overshooting the endpoint of a titration results in inaccurate and often useless data or results.
In an effort to increase the accuracy and efficiency of titration processes, automatic titration systems have been developed. Most often these systems take the form of titration-to-endpoint methods mentioned above. In a typical endpoint system, the automatic titrator will produce a recording of the entire titration curve from which the endpoint may be determined.
In the curve-recording type of automatic system, titrant is delivered by means of a motor-driven syringe, or burette, through a capillary whose tip is immersed in a rapidly stirred solution. The motor drive is coupled to the drive mechanism of a recording potentiometer, with the recording chart divisions being directly related to the titrant delivered. The measured potential variations are automatically plotted on the chart, and by inspection of the plotted curve, the entrance and exit of the steep portion of the curve in which an inflection occurs can be located. By taking half the distance between these points, a close estimate of the endpoint is obtained.
One of the key advantages of an automatic titrator is that a large number of similar titrations can be performed in a short period of time, but the requirement for manual determination of the endpoint in each case obviates this advantage. In addition, poor results can occur if there is a slow attainment of equilibrium in the solution during the titration, or if the mixing rate is inadequate. This problem can be overcome to some extent by the use of an "anticipation" technique wherein the rate of titrant addition is automatically slowed as the end point is approached. However, anticipation does not entirely eliminate the problem, for the slower rate itself introduces errors and also reduces the advantage of the automatic system. It should also be noted that in many titrations, the points of inflection (areas of rapid change in electric potential that are indicative of the endpoint) on the plotted curve are very difficult to locate with any accuracy, and this introduces further error in the measurements.
There are many examples of automated titration-to-endpoint processes. U.S. Pat. No. 3,730,685 to Prohaska discloses a computer-controlled process whereby a program is used to analyze the progress of the titration curve by determining the slope of the curve after each incremental addition of titrant. The maximum slope of the curve is calculated to determine the endpoint of the titration.
U.S. Pat. No. 3,769,178 to Rethermal, Jr., discloses an automatic titration process that plots the first derivative of the titration curve in an attempt to more accurately determine the endpoint of the titration.
Other methods of automatic titration to determine the end point of the titration are disclosed in U.S. Pat. No. 4,266,942 to Vandenbossche et al., U.S. Pat. No. 4,302,299 to Ishikawa, and U.S. Pat. No. 4,859,608 to Frueh.
Titration processes may also be used to adjust the electric potential of a subject material. The adjustment may take the form of, for example, pH modification or the modification of the ion concentration in a material. U.S. Pat. No. 4,940,551 to Riggs et al. discloses a process where predetermined dispenses are injected into a fluid stream to create an in-situ titration curve to calculate one total dispense to obtain a desired pH. However, this system is slowed by the fact that the titration curve must be created before adjustment may commence.
The known processes utilizing automatic titration have been unable to completely solve such problems as excessive overshooting of the aim or endpoint, slow titration times or the requirement of operator interaction. Further, the known processes utilizing automatic titration are often restricted to pH applications or are designed for application only in titration-to-endpoint systems.

Adjustment of electric potential by automatic titration


Systems, methods, and computer storage media having computer-executable instructions embodied thereon that provide contextual services are provided. Embodiments of the present invention allow an input mechanism to provide contextual services. Exemplary input mechanisms include a keyboard, a gesture interface, and a speech interface. These inputs may be used to provide user input into one or more applications running on a computer. The contextual services provided include composition assistance, grammatical assistance, communication-context assistance, and research assistance. In one embodiment, an input mechanism (“IME”) program provides the contextual service. The IME program may work with a remote contextual-service provider. The IME program communicates user input and contextual information to the contextual-service provider. The contextual-service provider analyzes the input and contextual information to determine whether one or more contextual services should be provided.

Many computing device users are habitual, or at least engage in some reasonably predictable behaviors on a routine basis. For instance, a particular user may routinely conduct a search for "world news" first thing in the morning to view headlines from prominent overnight news stories. Or, a user may have been engaged in an email conversation with a friend early in the day and, a few hours later, conduct a search for information about a book the friend recommended during the conversation. While each of these scenarios is somewhat predictable, at least with a degree of confidence greater than that of purely random search behavior, they still require that the user access an online search application and type one or more search query terms to access the information (and/or links to the information) she desires to access.


A refrigeration cycle device has a compressor, a radiator, a decompressor, an evaporator, a heat medium cooling evaporator, a cooling target device, a detector, and a controller. The heat medium cooling evaporator cools a cooling heat medium by performing a heat exchange between the refrigerant decompressed in the decompressor and the cooling heat medium. The cooling heat medium cools the cooling target device. The detector detects a subcooling state of the cooling target device having a temperature lower than or equal to a reference temperature. Upon the detection of the subcooling state in the cooling target device by the detector, the controller increases the degree of superheat of the refrigerant flowing out of the heat medium cooling heat exchanger as compared to the degree of superheat of the refrigerant flowing out of the heat medium cooling heat exchanger when the detector does not detect the subcooling state.

Refrigeration cycle devices may include a compressor, a condenser, a decompressor, and an evaporator, and is included in an air conditioner for a vehicle.
As an example, a refrigeration cycle device may be configured to set various refrigerant circuits so that the refrigeration cycle device is operated in various modes such as a cooling mode, a heating mode, and a dehumidifying and heating mode.


It is an object of the present invention to provide a water-evaporation type cooling apparatus which uses a solid-state electrolytic element, is free from an environmental protection problem, is soundless, and has a small size. An solid-state electrolytic element 50 is arranged to partition an airtight can 51 into spaces 51a, 51b, water 53 is reserved in the space 51a, and a condenser 55 is arranged to communicate with the space 51b. A water-reservation portion of the space 51a communicates with a water-reservation portion of the condenser 55 through a water path 57, and gas-phase portions of the spaces 51a, 51b communicate with each other through a ventilation path 58. A power is supplied from a DC power supply 52 to the solid-state electrolytic element 50 to make water decomposition reaction on an anode side and water generation reaction on a cathode side. A thermal connection surface 59 of a bottom portion of the space 51a is shaped into an outer surface shape along the outer surface shape of a target object 54.

As a conventional method of cooling an electronic part represented by a LSI packaged on electronic equipment or power equipment, as described in, e.g., Japanese Unexamined Patent Publication No. 6-21279, there has been known a method of radiating heat generated from a heat-generation member such as the LSI by combining a refrigerant bag and a heat pipe to each other.
Prior Art FIG. 19 is a view of the arrangement of a conventional heat-transfer apparatus described in Japanese Unexamined Patent Publication No. 6-21279.
Referring to FIG. 19, a protection metal vessel 1 has a hole portion 2 formed in a bottom portion thereof. A refrigerant bag 3 is stored in the lower portion of the protection metal vessel 1. The refrigerant bag 3 has an arrangement in which both the ends of a cylindrical member consisting of a soft plastic material such as polyethylene are sealed by means of heat fusing or the like, has an operation liquid 4 filled therein, and has a gas filled in the upper space thereof. When the refrigerant bag 3 is stored in the protection metal vessel 1, the refrigerant bag 3 partially projects from the hole portion 2 to form a contact portion 5 which is brought into contact with a target object 8 such as a LSI.
A heat-transfer pipe 6 is stored to be wrapped with the refrigerant bag 3, and a heat-radiation fin 7 is attached to one end of the heat-transfer pipe 6 which projects outside the protection metal vessel 1.
A halogen-based refrigerant such as flon or p-fluorocarbon (C.sub.6 F.sub.14) is used as the operation liquid 4.
An operation of the conventional heat-transfer apparatus will be described below.
The heat-transfer apparatus is installed such that the contact portion 5 is brought into contact with the target object 8 such as the LSI. Heat generated by the target object 8 is transferred from the contact portion 5 to the operation liquid 4. The operation liquid 4 is evaporated by the heat transferred from the contact portion 5, and the vapor condensed at the portion where the vapor is in contact with the heat-transfer pipe 6 in the refrigerant bag 3 to be liquified and dropped. With this exchange of latent heat, the heat is absorbed by the heat-transfer pipe 6. Thereafter, the heat is radiated from the heat-radiation fin 7 attached at one end of the heat-transfer pipe 6. When such heat exchange is repeated, the target object 8 is cooled.
Since the conventional heat-transfer apparatus is arranged as described above, the target object cannot be cooled to a temperature which is equal to or lower than the outer temperature of the heat-radiation portion. The use environment of the heat-transfer apparatus is disadvantageously limited.
Since a halogen-based refrigerant such as flon or p-fluorocarbon is used as the operation liquid 4, when the apparatus is scrapped, the refrigerant must be retrieved form the apparatus for environmental protection. However, in general, many electronic equipments frequently have an unspecified number of markets as targets. Therefore, a problem caused by the retrieving method must be solved.
General electronic equipment is necessarily decreased in size, the structure of the above heat-transfer apparatus cannot be decreased in size. Therefore, a sufficient means for the decrease in size cannot be made.

Water evaporation type cooling apparatus by means of electrolytic reaction