A systematic method for single-rail domino logic circuits is provided, in which inverting and non-monotonic logic functions can be integrated into a pipelined system with almost zero overhead. This logic family, called Clock Logic (CL)-domino is functionally complete while tolerating skew and minimizing the number of clock phases that must be distributed. Simulation results for a CL-domino ALU at 1-GHz under high skew (1-FO4) conditions, shows a power reduction of 41% over the same ALU implemented in dual-rail skew-tolerant domino logic. This power reduction incurs no performance penalty over dual-rail techniques, although in some cases additional design effort is required.

During the past three decades, the power consumption of integrated circuits, including microprocessors, has been increasing at an exponential rate. This steady increase in power dissipation is the result of several factors. First, the number of transistors and the transistor density has doubled about every 24 months. However, the power efficiency of micro-architectures, measured by MIPS/Watt, degrades considerably as more superscalar features are built into a design. Second, the use of more complex circuit techniques has allowed clock frequencies to increase faster than pure process scaling would suggest; often at the expense of increased power. Third, aggressive transistor technologies with higher current carrying capabilities and lower threshold voltages have increased switching speeds at the expense of significant sub-threshold leakage current. Last, improvements in compilers and software applications have also increased the switching activity within a microprocessor.
If this trend continues, it is expected that the power consumption of typical microprocessors may be several thousand Watts by 2008. This presents an enormous challenge in the design of the power distribution networks needed to carry the large currents and also in the verification of digital noise immunity. Furthermore, these predicted power levels are prohibitively large from a reliability and system cost perspective. Also, from a system performance standpoint, high power dissipation limits the scalability in the number of processors that can be incorporated into a system and the number of cores on a single die. From this discussion, it becomes clear that total power consumption will eventually become a limiting factor to increased chip integration.
Despite the power dilemma, designers are still most concerned about speed performance because, in most cases, that is what determines whether a system is successful. For most microprocessors incorporating advanced superscalar micro-architectures, this has resulted in the use of dynamic domino logic.
Dynamic logic is a digital circuit design technique used in some high-performance integrated circuits. In contrast to the more popular logic family known as static CMOS, dynamic logic circuits are faster, because they present much lower input capacitance for the same output current and have a lower switching threshold. Unfortunately, dynamic circuits are more susceptible to noise than static CMOS. They also dissipate more power than their static counterparts because of their higher activity factors and significant clock loading. However, in many circumstances they have proven to be the only circuit family able to meet the demands of reduced cycle times.
Domino logic gates are a popular dynamic logic family, in which an inverting static gate is inserted between successive dynamic gates. Standard domino logic inserts an inverter between the dynamic gates while compound domino logic inserts multiple input complementary gates. The dynamic/static gate pair is known as a domino gate, although it is in fact constructed from two gates. A series of connected domino gates precharge simultaneously as if setting up a set of dominos. During evaluation, the first dynamic gate falls causing the static gate to rise which then causes the next dynamic gate to fall and its static gate to rise, much like a chain of toppling dominos. It is common practice in domino logic design to divide a pipeline 2 of series-connected domino gates 4 into "cells" 6 each of which is controlled by a respective clock phase Φ, as may be seen in FIG. 1. Each cell 6 may contain one or more dynamic logic gates 8. As may also be seen in FIG. 1, cells 6a controlled by clock phase Φ1 may be referred to as "phase 1 logic"; cells 6b controlled by clock phase Φ2 may be referred to as "phase 2 logic", and cells 6c controlled by clock phase Φ3 may be referred to as "phase 3 logic".
Domino logic circuits are often used in microprocessor critical paths because of their 1.5 to 2 times speed improvement over static CMOS gates. Despite their wide application to microprocessor design, conventional single-rail domino is not functionally complete because of its inability to perform inversions. There are many situations where inverting or non-monotonic logic needs to be used in conjunction with non-inverting/monotonic logic. These include multiplexers, parity circuits, and arithmetic units which depend heavily on XOR and XNOR functions. However, if inverting functions (some inputs to the first dynamic gate of a logic cell 6 are complemented) or non-monotonic functions are used inside a domino pipeline 2 with multi-phase clocks, the inverting or non-monotonic functions will be corrupted when the previous cell precharges. For example, in FIG. 1, the inverting gate 8 in the phase 2 logic 6b will be corrupted when the phase 1 logic 6a precharges; and likewise the inverting gate 8 in the phase 3 logic 6c will be corrupted when the phase 2 logic 6b precharges. This is because an inverting function of the previous logic cell 6 might, for example, cause a 0→1 transition on the input of the current cell in the middle of the evaluate cycle, where the input to the current cell 6 should have remained at 0 (as it was at the start of the evaluate cycle). This is illustrated in FIG. 2 for the case of two AND gates 10a, 10b in adjacent phase logic cells 6, where, one of the inputs to the second AND gate 10b is complemented. In the case of a non-monotonic function, the inputs to the dynamic gate 10b will change before the end of the current evaluate cycle and the output might no longer maintain the correct result. Such a logic function, where an inversion exists at the input of a dynamic gate or the gate implements non-monotonic logic, will hereafter be referred to as an input complemented or non-monotonic dynamic logic function.
Consequently, circuit designers must use slower logic circuits such as static CMOS or transmission gates to implement inverting and non-monotonic functions with the additional cost of increased overhead to interface from dynamic to static logic and back. Clock-blocking techniques that require the clock to be the last input signal to arrive at a dynamic gate after the data inputs, so that non-inverting and monotonic functions are possible, have also been used. As an example of such clock-blocking techniques is known as clock-delayed (CD)-domino. However, these clock-blocking techniques require precise matching of data and clock delays, which have to be accounted for under all possible process and environmental conditions. Furthermore, clock skew must be budgeted at each clock-blocking gate, making this logic family skew-intolerant. Last, scaling of such designs would normally require complete re-verification of the data and clock delay paths.
For designs where speed is the most critical design parameter, Domino Dynamic Cascade Voltage Switch Logic (DCVSL)/dual-rail domino circuits can be used to meet the requirements for inverting and non-monotonic functions. Such circuits require approximately double the number of transistors compared to single-rail domino logic, resulting in greatly increased routing complexity, circuit area and in many cases, decreased circuit speed due to longer differential routing lines.
Since domino circuits are synchronized by clocks, clock skew can have a significant impact on domino circuit performance. Skew tolerant domino circuits have been shown to alleviate the effects of skew on the performance of traditional domino circuits.
Skew-tolerant domino circuits remove the three sources of sequencing overhead found in traditional latch-based domino pipelines: clock skew, latch overhead and pipeline imbalances. This is accomplished by supplying overlapping clock phases to different stages of domino logic. The use of overlapping clock phases eliminates the need to budget clock skew in the cycle time, since data can now arrive and depart from different pipeline stages irrespective of modest variations in the arrival time of the clock signals. Furthermore, since the overlapping clock phases allow time for the first domino gate 4 of a logic cell 6 to evaluate before the last gate 4 of the previous cell 6 precharges, latches are eliminated from the pipeline 2 as domino gates 4 inherently function as latches. Finally, if the overlap between clock phases is larger than the worst-case clock skew, then domino gates can "time borrow" across stages. Gates 4 in two adjacent cells 6 can evaluate when their respective clocks are high and overlap, allowing gates that nominally evaluate during a first clock phase to run late into a second clock phase. Thus, removing all the sources of overhead allows the entire cycle time to be available for useful computation.
While many of the design difficulties concerning noise and delay performance of dynamic logic have been addressed in the prior art, practical power considerations have often been ignored. In practice, dynamic logic dissipates more power than static logic, mainly due to its increased switching activity resulting from periodic precharge and discharge operations. Additionally, the use of keeper devices to solve problems due to charge leakage, also tends to increase the transistor count and thus the switched capacitance, with an attendant increase in power consumption. Furthermore, dual-rail domino circuits dissipate more power (approximately double) than single-rail domino because of their increased routing capacitance and unity activity factor.
Accordingly, techniques for reducing the power consumption of domino logic circuits remain highly desirable.

Clock logic domino circuits for high-speed and energy efficient microprocessor pipelines


A dumping apparatus for a bag filled with molten substance wherein a tippler and a driving apparatus therefor are simplified and miniaturized in structure and a bag can be pulled out smoothly from within a carrying can with a minimized impact and without the possibility of break and can be transferred safely to a pallet. The tippler is mounted for pivotal motion around a stationary axis, and when it is pivoted from a first transfer position, fork prongs thereof are moved from between adjacent rollers of a roller conveyor to take up carrying cans from the roller conveyor. The carrying cans are thereafter held and moved by a side frame of the tippler, and when the tippler is pivoted to a second transfer position at which the side frame thereof is inclined downwardly, bags filled with molten substance slip somewhat from the carrying cans due to their own weight so that they are partially received on a pallet on a pallet conveyor. The pallet conveyor is then moved away from the tippler, whereupon the bags are fully pulled out from the carrying cans and transferred to the pallet.

1. Field of the Invention
This invention relates to a dumping apparatus for a bag filled with molten substance which pulls out, from within a carrying can which has been transported to the dumping apparatus together with a bag accommodated therein and filled with molten substance, the bag and transfers it to a pallet.
2. Description of the Prior Art
A dumping apparatus is already known and disclosed, for example, in U.S. Pat. No. 4,724,656 wherein a tippler to which a paper bag filled with asphalt latex or asphalt in a molten condition (such paper bag will be hereinafter referred to as bag filled with asphalt latex) is transported by means of a roller conveyor while accommodated in a carrying can is moved to take up the carrying can from the roller conveyor and then incline the carrying can downwardly while held thereon so that the bag filled with asphalt latex is pulled out from within the carrying can and transferred to a pallet.
The tippler of the dumping apparatus includes a pair of disks each having a window hole formed therein through which a carrying can pass and a plurality of rods which can hold a carrying can thereon. Each of the disks has serrations or teeth formed on an outer periphery thereof. The tippler is mounted for rotation on a travelling frame, which is moved horizontally together with the tippler. The serrations of the disks are held in direct engagement with a pair of racks, and the travelling frame is connected to a motor by way of a chain so that it may be moved back and forth by the motor. Or else, small gears are provided between the serrations of the disks and the racks such that they mesh with both of the latter. The racks are connected to piston rods of a pair of cylinders so that the travelling frame may be moved back and forth by contracting and expanding movements of the piston rods. When the travelling frame is moved back and forth, the tippler is moved back and forth away from and toward a pallet together with the travelling frame.
Meanwhile, a pallet conveyor for transporting a pallet from a transfer position of a bag filled with asphalt latex is mounted on a conveyor frame which is supported on a conveyor truck for upward and downward tilting motion around an end portion thereof remote from the tippler. The conveyor frame is pivoted from a normal horizontal position to an upwardly inclined position and then pivoted back to the normal horizontal position when a piston rod of a cylinder which is provided between the conveyor frame and the conveyor truck is expanded and then contracted. Further, the conveyor truck is separably connected to a slide rod to which rotation of a motor is transmitted after it is converted into linear motion so that the conveyor truck may be moved toward and away from the tippler by rotation of the motor.
With the conventional dumping apparatus, a carrying can held on the tippler is inclined downwardly while being moved horizontally toward a pallet by the tippler, and simultaneously the pallet is moved toward the tippler while it is being inclined such that an end portion thereof adjacent the tippler may be raised. Consequently, a bag filled with asphalt latex is discharged from the carrying can, whereupon an end portion thereof is received on the pallet which is inclined in the same direction as the bag filled with asphalt latex. After then, the carrying can is returned to its upwardly directed position while it is being retracted away from the pallet, and simultaneously the pallet is returned to its horizontal position. As a result of such returning movement, the bag filled with asphalt latex in the carrying can is let off from the carrying can and thus transferred to the pallet.
The dumping apparatus, however, has such problems as described below.
In particular, first, since the tippler is bodily moved forwardly or backwardly while being rotated, the driving mechanism therefor is complicated in structure and consequently is expensive, and besides since a large number of driving parts are involved, a high power is required.
Further, since the tippler is moved back and forth together with the travelling frame, the dumping apparatus is large in overall size.
Besides, since the tippler is moved horizontally toward a pallet while it is being rotated, a carrying can is tilted down while being advanced drawing an elliptic locus and the bag filled with asphalt latex in the carrying can is almost thrown to the pallet. Accordingly, the impact when an end portion of the bag filled with asphalt latex drops on the pallet is high.
In addition, since the carrying can rises, upon returning movement of the tippler, while being retracted drawing an elliptic locus, it will raise a portion of the bag filled with asphalt latex which has not been drawn out fully from and still remains in the carrying can. In this instance, since the asphalt in the paper bag still remains in a molten condition of a high temperature (for example, 200.degree. C. or so), the bag filled with asphalt latex is flexible with a high weight. Therefore, when the portion of the bag filled with asphalt latex which remains in the carrying can is lifted by the rising carrying can, an edge of the mouth of the carrying can acts as if it bites into the bag filled with asphalt latex. Then, in this condition, the bag filled with asphalt latex is lifted while the mouth edge of the carrying can rubs the paper bag which is now in a weakened condition due to heat of the asphalt latex, and on the other hand, the bag filled with asphalt latex is drawn out fully from the carrying can while being lifted in this manner and then drops onto the pallet. Therefore, the probability that the paper bag may be broken is high. If the paper bag is broken, then the asphalt latex in a molten condition of a high temperature will leak from the paper bag and may soil not only the pallet but also the pallet conveyor, the conveyor frame, the conveyor truck and the driving apparatus for them, and much time and labor will be required for cleaning of them.

Dumping apparatus for bag filled with molten substance


A solar powered ground lights is typically mounted in a walkway, pathway, pool deck, roadway, park pathway, either in cement, wood, synthetic materials, or otherwise, and are ideally suited for use in walls, ceilings, and pool or dock areas because they are readily mounted from the top, requiring only a cylindrical depression and possibly three screws for mounting and require no external wiring. The solar powered ground lights are also low voltage and safe. Illumination of the Solar powered ground lights is provided by a Solar Powered system utilizing Light Emitting Diodes (LEDs), or an electro-illuminescent Lighting system backed up with a solar powered circuit for the rechargeable battery. This provides for an illumination system capable if providing ease if view for pedestrians as well as illuminating roadways. The system may be fully IP68 waterproof rated.

In-ground or in-deck support is not utilized enough to provide passive lighting. Some types of ground lighting are known for gardens and which is supported on short pikes to give a high lighting effect with lateral light directed upon plants and garden areas. These types of lighting are inappropriate for high traffic areas where the object of providing lighting and being not significantly obstructive to walking is desired.
Conversely, walkways, parkways, roads, and the like are typically conventionally illuminated utilizing lighting systems that require wiring from one illuminated source to the next, such as overhead wiring or poles. Some illumination systems are solar powered and temporary with housing that are thrust into the ground with a steak and are not capable of being mounted into a surface or mounted to as to permit and illuminate pedestrian traffic. Another issue for pedestrian traffic is wear. Many custom wired in-sidewalk systems have painted plates which scuff and undergo the negative effects of sunlight destruction (fading) as well as heating and cooling.
Many potentially dangerous places to walk are not lighted because the expense of wiring and providing lighting in places not heavily frequented by pedestrians is not believed to be justified. Docks and areas surrounding docking areas may go days and weeks without foot traffic in the area. However, in a harbor environment lighting is critical because visibility, especially when it is needed, is frequently impaired by weather conditions and stored obstacles, such as carts, rope, floats paddles and small canoes on a dock.
A requirement of high maintenance is a cost issue which adds to the installation cost issue for all ground lighting, but especially lighting units mounted in the marine environment. The electrical distribution system has to be sufficiently upgraded over a system that would exist outside the marine environment and at increased cost. Failure of any distribution system in a marine environment occurs more frequently and at a higher cost of replacement. Maintenance of wired units requires much onsite time to dis-assemble, replace faulty components and then re-assemble on site.
What is needed is a low maintenance lighting system, utilizable in a relatively low pedestrian traffic environment, that is inexpensive to install, inexpensive to replace (and/or repair), and which has wear characteristics that will not exhibit significantly noticeable wear if trod upon. The needed system should be available at a range of costs and capabilities to encourage the installation of a low-tech version of the system in facilities which demand the lowest cost system, and to encourage the installation of a high-tech version of the system in facilities which demand a higher level of service & control.


An improved tambourine has a rigid, enclosed, jingle-supporting frame that defines a center of gravity and a number of pairs of percussion jingles connected to the frame at determined locations around one of the frame's segments. A handle for manually grasping the frame is connected to a second segment of the frame. The second segment is closer to the center of gravity of the tambourine than is the first segment, which is arcuate in shape. The second segment includes radial, inwardly turned portions and a handle-bearing portion that is substantially parallel to a chord formed between the ends of the arcuate first segment and spaced a determined distance from the geometric center of the handle.

1. Field of the Invention
The invention relates to musical percussion instruments and, more specifically, to an improved tambourine.
2. Description of the Prior Art
This invention generally relates to a "headless" tambourine, which is a percussion musical instrument used in contemporary rock music. Conventional tambourines are circular in shape and include sounding elements that essentially jingle mounted in slots circumferentially spaced around the circular frame.
One drawback of conventional tambourines is that the hand and arm can become tired because the instrument is typically grasped at one edge of the circular frame. Thus, a large moment of force is created by holding the frame on an edge, which causes discomfort to the user. Grasping of the instrument can also be awkward because of the shape of the frame in relation to the position of the grasping hand.
In U.S. Pat. No. 4,230,015, issued to the inventor of the subject application, a tambourine is disclosed that includes a frame having a grasping portion disposed at or near the center of gravity of the rim such that the tambourine may be comfortably held for long periods of time. The handle can be disposed near the geometrical center of the rim. However, the teaching that the handle be disposed at or near the center of gravity of the rim can present a disadvantage. By totally or substantially eliminating the distance between the geometrical center of the handle and the center of gravity, the user may have the perception is that there is virtually no moment because the virtual pivot point may coincide with the geometrical center of the handle. Without the feel of a moment force, there can be some loss of the "feel" of a tambourine and a loss of control, as a user may anticipate, that such moment force does or will exist during use.


The disclosure provides methods of identifying a human subject as a candidate for treating or inhibiting a liver disease by inhibiting HSD17B13. The disclosure also provides methods of treating a subject who is PNPLA3 Ile148Met+ by administering an inhibitor of HSD17B13. The disclosure also provides method of detecting a PNPLA3 Ile148Met variant and functional HSD17B13 in a subject. The disclosure also provides method of identifying a subject having a protective effect against liver disease. The disclosure also provides inhibitors of HSD17B13 for use in the treatment of a liver disease.

Various references, including patents, patent applications, accession numbers, technical articles, and scholarly articles are cited throughout the specification. Each reference is incorporated by reference herein, in its entirety and for all purposes.
Chronic liver disease and cirrhosis are leading causes of morbidity and mortality in the United States, accounting for 38,170 deaths (1.5% of total deaths) in 2014 (Kochanek et al., Nat'l. Vital Stat. Rep., 2016, 65, 1-122). The most common etiologies of cirrhosis in the U.S. are alcoholic liver disease, chronic hepatitis C, and nonalcoholic fatty liver disease (NAFLD), together accounting for about 80% of patients awaiting liver transplant between 2004 and 2013 (Wong et al., Gastroenterology, 2015, 148, 547-555). The estimated prevalence of NAFLD in the U.S. is between 19 and 46 percent (Browning et al., Hepatology, 2004, 40, 1387-1395; Lazo et al., Am. J. Epidemiol., 2013, 178, 38-45; and Williams et al., Gastroenterology, 2011, 140, 124-131) and is rising over time (Younossi et al., Clin. Gastroenterol. Hepatol., 2011, 9, 524-530), likely in conjunction with increased rates of obesity, its primary risk factor (Cohen et al., Science, 2011, 332, 1519-1523). While significant advances have been made in the treatment of hepatitis C, there are currently no evidence-based treatments for alcoholic or nonalcoholic liver disease and cirrhosis.
Previous genome wide association studies (GWAS) have identified sequence variations associated with increased risk of chronic liver disease. The most robustly validated association is with a common missense variant in patatin-like phospholipase domain-containing 3, encoded by the gene PNPLA3. This variant (rs738409, p.Ile148Met) was initially found to be associated with an increase in hepatic triglyceride levels (Romeo et al., Nat. Genet., 2008, 40, 1461-5), and subsequently associated with nonalcoholic steatohepatitis (NASH) (Batman et al., Hepatology, 2010, 52, 894-903; Sookoian et al., J. Lipid Res., 2009, 50, 2111-2116) and cirrhosis (Shen et al., J. Lipid Res., 2015, 56, 167-175). A missense variant in TM6SF2, encoding transmembrane 6 superfamily member 2, also confers increased risk of nonalcoholic fatty liver disease (NAFLD)(Kozlitina et al., Nat. Genet., 2014, 46, 352-6; Liu et al., Nat. Commun., 2014, 5, 4309; and Sookoian et al., Hepatology, 2015, 61, 515-25). Exactly how the variants in PNPLA3 and TM6SF2 contribute to liver disease has yet to be fully elucidated (Smagris et al., J. Biol. Chem., 2016, 291, 10659-76; Mahdessian et al., Proc. Natl. Acad. Sci. USA, 2014, 111, 8913-8; Huang et al., J. Biol. Chem., 2011, 286, 37085-93; and Pirazzi et al., J. Hepatol., 2012, 57, 1276-82). To date, no genetic variants that protect from chronic liver disease have been identified.

Inhibition of HSD17B13 in the treatment of liver disease in patients expressing the PNPLA3 I148M variation


A sintered body of titanium based carbonitride alloy containing hard constituents based on, in addition to titanium, one or more of the metals Zr, Hf, V, Nb, Ta, Cr, No or W in 5-30% binder phase based on Co and/or Ni is disclosed. The body has a binder phase enriched surface zone with a higher binder phase content than in the inner portion of the body in combination with an enrichment of simple hard constituents, i.e., the share of grains with core-rim structure is lower in the surface zone than in the inner of the body.

The present invention relates to a sintered body of a carbonitride alloy with titanium as main component which has improved properties particularly when used as cutting tool inserts in intermittent metal cutting operations under particularly toughness demanding conditions. This has been done by a different distribution of hard constituents and binder phase between the surface layer and inner (bulk) zone and a different form of the hard constituents in the surface zone and bulk zone in regard to simple and complex structures, particularly different core-rim-situations.
Titanium based carbonitrides (so-called cerments) are today well established in the metal cutting industry and are primarily used as tools for finishing. They consist of hard constituents of titanium-based carbonitride embedded in a binder phase of cobalt and/or nickel. The hard constituents generally have a complex structure with a core surrounded by a rim of a different composition.
For tungsten carbide-cobalt-based hard metals, the so-called gradient sintered grades, particularly when coated with one or more CVD layers, have now gained strong foothold in metal-cutting inserts. Gradient sintering means that the sintering is performed in such a way that an about 10 .mu.m wide surface zone of the material gets another composition that its inner part, particularly with a higher binder phase content in the surface zone. Examples of patents within this area are U.S. Pat. Nos. 4,277,283, 4,610,931, 4,497,874, 4,649,048, 4,548,786 and 4,830,930. U.S. Pat. No. 4,911,989 describes a coated hard metal where the hardness increases monotonously in a 50-100 .mu.m wide surface zone.
Different forms of gradient sintering for titanium-based carbonitride alloy have existed for a number of years. For example, grades exist with a few .mu.m thick coating with strong binder phase enrichment and below that a binder phase depletion which extends 200-400 .mu.m into the material with a gradual increase up the bulk level. This gradient type gives increased wear resistance which takes place with a certain loss of the toughness behavior. As expected, a hardness maximum is obtained just below the binder phase enriched zone where the enrichment of hard constituents is the greatest.
One way of improving the toughness behavior is through a relatively moderate binder phase enrichment to a depth of about 20-50 .mu.m from the surface followed by an enrichment of hard constituents which then gives a hardness maximum. The binder phase enrichment gives a better toughness behavior but increases at the same time the risk for plastic deformation. The hard constituent enrichment increases the wear resistance (when the wear has reached this area) but increases the risk of crack propagation, i.e., deteriorates the toughness behavior at the same time as the resistance to plastic deformation increases.
An example of a variant of the above is U.S. Pat. No. 5,059,491, which discloses a hard surface layer with a hardness maximum situated between 5 and 50 .mu.m from the surface and an outer surface zone with a hardness of between 20 and 90% of the maximum hardness. This is accomplished by starting the sintering process in an non-oxidizing atmosphere up to 1100.degree. C. followed by a nitriding atmosphere which is finished by a denitriding atmosphere. The denitriding period comprises at least the cooling but can also comprise the whole or part of the sintering holding time.
Thus, normal gradient sintered hard alloys get a depletion of binder phase, i.e., an enrichment of hard constituents, just below the binder phase enrichment. This leads to increased wear resistance in this area with increased resistance to plastic deformation, but unfortunately also leads to a worsened toughness behavior.

Titanium based carbonitride alloy with binder phase enrichment


An apparatus for manufacturing a tube-like preform having a longitudinal wall with a variable cross-section for blow molding of a hollow body from a thermoplastic material, includes a tubular die having a variable exit opening, and a collar die having a recess and movable into engagement with and away from the tubular die, the preform being produced by ejecting of the thermoplastic material from the exit opening of the tubular die into the recess of the collar die while moving tubular die, with controlling a speed of movement of the collar die and a cross-section of the exit opening of the tubular die in such a manner that larger and smaller cross-section of the exit opening correspond to speed rate of the collar die, so that a thickness of the wall of the producible preform changes from peaks to valleys in a wave-like manner to form the variable cross-section of the wall.

The invention relates to an apparatus for manufacturing tube--like preforms having a variable cross-section along their length for blow--molding hollow bodies from a thermoplastic material, which apparatus comprises a tubular die and a collar die (injection molding die) having a recess into which plastic material is injected when the collar die sits on the tubular die, the preform being produced upon lifting of the collar die of the tubular die and moving collar die to its predetermined position above the tubular die. The apparatus further comprises a control device for a drive displacing the collar die toward and away from the tubular die, and a control device for a drive responsible for changing the size of the exit opening of the tubular die during movement of the collar die away from the tubular die. The speed of the collar die increases from zero up during away movement of the collar die. The control devices are actuated upon start of lifting of the collar die and effect a displacement dependent control.
An apparatus of this type is disclosed in German patent 2,426,730. This apparatus functions according to a PRESSBLOWER process. The control devices of this apparatus are provided with switches which are actuated by the liftable collar die. The preform produced in this apparatus has a wall with a stepwise cross-section. The wall thickness of the preforms in different regions has a different configuration, and the change in cross-section of the preform is produced in relatively little time. This known apparatus is poorly adapted for producing preform for bellows. This apparatus is not suited for producing preforms for bellows that should have a substantially constant wall thickness despite having numerous large pleats. This requires practically not attainable large number of switches. It is also known, from German patent 2,426,736, to control switches of the control device of such an apparatus, which switches are arranged along the displacement path of the collar die, by an electronic prearranged program, If such a program is made time-dependent, then frequent changes in wall thickness, necessary for producing a preform for a bellows, cannot be effected with a necessary precision, because conformity between respective positions of the collar die cannot be achieved with sufficient precision.
Accordingly, the main object of the invention is an improved apparatus of the above-mentioned type which would make it possible to produce preforms for bellow, that is performs having a relatively high number of enlarged wall thickness changes per unit of length, with an increased precision.

Apparatus for and method of manufacturing of preforms having a longitudinal wall with a variable cross section


A device for encasing a system for dispensing a liquid product, provided mainly with an evacuation conduit, the downstream end of which opens to the outside, characterized in that it includes, on the one hand, a compartment respectively delimited by a back wall and a front wall with an outlet orifice in it and, on the other hand, at least one elastic return element supported by the said system on the side opposite the downstream end that can retract such as to allow the said system to be inserted in the said compartment and can then rest against the back wall to as to insert and maintain the end of the said conduit in the outlet orifice.

Dispensing systems are generally small, complex technical assemblies that can be mounted on several types of packaging. These include, for example, spray nozzles, aerosol valves, drop dispensers, etc.
It is often necessary, for technical and/or aesthetical reasons, to conceal these systems or to integrate them in a packaging without affecting their main product-dispensing function.
When the packaging uses an operating device such as a tappet-button, the encasing and assembly of the dispensing system with the button is a delicate operation that must, however, be carried out easily and quickly in order for it to be automated.
Furthermore, if the tappet-button has elements that are intended to cooperate functionally with the dispensing system and, mainly, with the downstream end of the evacuation conduit, their relative positioning must be carried out in a precise and stable manner.
The aim of the present invention is to solve these technical problems in a satisfying manner.

Covering device for a liquid product dispensing member


A method for depositing a silicon oxynitride layer that has a higher etch-removal rate. The deposition starts by first passing gas from a pipeline A into the deposition chamber before switching the RF power source on. The further is the delay in switching the RF power source on, the higher will be the etch-removal rate of the silicon oxynitride layer formed by the deposition. Furthermore, the RF power source will remain on for a short period after the pump starts pumping gas away from the deposition chamber through pipeline A at the end of the deposition. The sooner is the switching off of the RB power source after the pump start to operate, the higher will be the etch-removal rate of the silicon oxynitride layer that result from the deposition.

1. Field of Invention
The present invention relates to a method for forming a silicon oxynitride layer. More particularly, the present invention relates to a method for forming a silicon oxynitride layer that has a higher etch-removal rate in subsequent etching process. This is accomplished through changing some parameters during the deposition of silicon nitride.
2. Description of Related Art
Silicon oxynitride (SiO.sub.x N.sub.y) is a dielectric material that has properties ranging between silicon dioxide (SiO.sub.2) and silicon nitride (Si.sub.3 N.sub.4). The internal stress of a silicon oxynitride layer is smaller in magnitude than a silicon nitride layer, while its resistance against moisture and impurities is better than a silicon dioxide layer. Therefore, a silicon oxynitride layer is commonly employed as a protective material. To avoid any serious damages to the metallic layer above the devices due to a high processing temperature during silicon oxynitride deposition, a processing temperature lower than 450.degree. C. is preferred. Hence, the silicon oxynitride layer is usually deposited using a plasma-enhanced chemical vapor deposition (PECVD) method with silane (SiH.sub.4), nitrous oxide (N.sub.2 O), and nitrogen (N.sub.2) as the reactive gases. The refractive index of silicon oxynitride is about 1.75, which is intermediate between silicon dioxide and silicon nitride. The refractive index is actually dependent upon the amount of oxygen and nitrogen inside the silicon oxynitride.
In photolithographic processing that uses deep ultra-violet (DUV) light source, depositing a thin layer of silicon oxynitride is a simple and economical way to form an anti-reflection layer (ARL). In general, the silicon oxynitride layer does not need to be removed. However, in performing a self-aligned silicide (Salicide) process, any coated silicon oxynitride layer must be completely removed.
Silicon oxynitride layer can be removed using hot phosphoric acid solution. However, prolonged exposure to phosphoric acid can damage the device's polysilicon layer and the substrate. Therefore, a faster etch-removal rate for the silicon oxynitride layer is very much preferred. The silicon oxynitride layer deposited using a conventional deposition method has a rather low etch-removal rate. Because of the slow etching rate, a few minutes of etching time is usually required to etch clean of any silicon oxynitride material. By the time the etching is finished, severe damages to the devices may result leading to a low product yield. On the other hand, if the etching time is shortened, residual silicon oxynitride will remain. This will adversely affect subsequent self-aligned silicide processing operation, which is equally detrimental to the device's reliability.
In light of the foregoing, there is a need in the art to improve the method of depositing silicon oxynitride to form silicon oxynitride layer.

Method for increasing etch removal rate of silicon oxynitride


An apparatus for providing delay signals to perform print scan line synchronizations within a laser printer is disclosed. The apparatus includes a voltage-control oscillator, a frequency divider and multiple output control modules. The voltage-control oscillator converts a clock signal to a higher frequency signal. The frequency divider then reduces the frequency of the higher frequency signal. Then, each of the output control modules generates a delay signal, and each of the delay signals is delayed by no more than one tenth of a clock cycle from an adjacent one of the delay signals.

1. Technical Field
The present invention relates to electrophotographic printers in general, and, in particular, to an apparatus for improving image fidelity on electrophotographic printers. Still more particularly, the present invention relates to an apparatus for providing delay signals to perform print scan line synchronization within a laser printer.
2. Description of Related Art
Laser printers are designed to produce an image on paper or other print material at virtual positions defined by a digital raster. These virtual positions in the raster are known as "pixels." In laser printers, the image is typically first produced on a charged photoconductive material by scanning the photoconductor with a laser beam in a sequence of scan lines. A laser printer may scan the surface of the photoconductive material with a laser in the sequence of scan lines using a rotating polygonal mirror. As a line is being scanned, or written, the laser beam is energized during the extent of each pixel. When the laser beam is energized, the portion of the photoconductor upon which the laser energy impinges is discharged, thereby producing a charge-pattern copy of the desired image on the photoconductor. The printed output is obtained by attracting toner to the charge-pattern and by transferring the developed image to paper or other types of print material.
If the laser beam is modulated, then variations in charge are translated to proportionate amounts of toner deposited on a sheet of paper in the printer. The laser scans the photoreceptor surface to generate a signal at the beginning of each scan line that is used to initiate modulation of the laser beam for that scan line. Such signal is called a beam detect signal, and is asynchronous to the input clock reference oscillator. The clock reference oscillator determines the width of each printed pixel.
The present disclosure provides an apparatus for providing delay signals to perform print scan line synchronization within a laser printer.

Apparatus for providing delay signals to perform print scan line synchronization within a laser printer


A system, method, and apparatus to automatically detect clocks within a given space and synchronize each clock within the given space to display the correct time is provided. The system includes a time component adjusting device including a communication module configured to detect and connect to clocks within the vicinity of the time component adjusting device, generate a clock tracking profile for each of the clocks, and ensure that each of the clocks depict the accurate time. The time component adjusting device also seeks to prevent desynchronization of clocks upon occurrence of events such as daylight savings and leap seconds.

For centuries, clocks have served as mechanisms for indicating the current time at a given location. However, a previous issue was that a significant amount of clocks did not include a processor or applicable module configured to access a wireless network; therefore they lacked the ability to display the correct time in an automated manner. In other words, because the clocks were only configured to be adjusted manually, the clocks inevitably depicted an incorrect time due to anticipated events, such as daylight savings time.
Solutions to this issue have been provided, but integrating this functionality into certain categories of clocks is impractical. Furthermore, the number of devices that digitally indicate the current time is larger than ever, resulting in a greater number of devices such as, but not limited to, appliances, vehicles, and other frequently interacted with devices depicting the incorrect time at least once a year. A common approach is for an individual to manually adjust each individual clock whenever necessary; however, this is an arduous task in environments that either have multiple clocks and/or have clocks positioned in areas that are difficult to reach. For example, wall clocks positioned in rooms with high ceilings require a ladder in order to reach the clock and manually set it to the correct time. Also, depending on the habitat, an environment such as a kitchen may include a wall clock, a microwave clock, an oven clock, a coffee maker clock, and a plurality of other applicable clocks that all require adjustment; thus, the individual is tasked with manually adjusting multiple clocks within a single room. Thus, the desire for all clocks to be synchronized within a given space proves to be a difficult task due to the fact that, if a respective clock does not include the ability to self-adapt, then an individual is manually required to adjust the clock regardless of location and/or configuration.
Therefore, a need exists to overcome the problems with the prior art as discussed above. In particular, what is needed is a system, device, and method to automatically detect clocks within a given space and synchronize each clock within the given space to display the correct time.


A two-sided-access (TSA) eWLB is provided that makes it possible to easily access electrical contact pads disposed on both the front and rear faces of the die(s) of the eWLB package. When fabricating the IC die wafer, metal stamps are formed in the IC die wafer in contact with the rear faces of the IC dies. When the IC dies are subsequently reconstituted in an artificial wafer, portions of the metal stamps are exposed through the mold of the artificial wafer. When the artificial wafer is sawed to singulate the TSA eWLB packages and the packages are mounted on PCBs, any electrical contact pad that is disposed on the rear face of the IC die can be accessed via the respective metal stamp of the IC die.

Extended, or embedded, wafer-level ball grid array (eWLB) packages are used to extend the size of a WLB package beyond the area of the integrated circuit (IC) die in order to provide it with a higher ball count and greater fan out for making electrical interconnections between the pads of the IC die and external electrical circuitry. After the IC dies have been fabricated on a semiconductor wafer, they are singulated into individual dies. The individual dies are then reconstituted on an artificial wafer, which typically comprises a piece of tape on which the dies are positioned front face down and a polymer molding material that encapsulates the dies. It should be noted that the dies that are reconstituted on the artificial wafer may be the same types of dies that were singulated from the same wafer or they may be different types of dies that were singulated from different types of wafers.
After the polymer molding material has been cured to form a mold about the dies, the tape is removed to expose the front side of the wafer, which is the side of the artificial wafer that is co-planar with the front faces of the dies. Wafer-level processes are then used to deposit and pattern layers of dielectric material and metal on the front side of the artificial wafer to form conductive traces. First ends of the conductive traces are in contact with the pads of the dies. Second ends of the conductive traces fan out away from the respective dies. Solder balls are then deposited at particular locations on the front side of the artificial wafer in contact with the second ends of the conductive traces, thereby establishing electrical interconnections between the solder balls and the pads of the respective dies. The artificial wafer is then sawed to singulate the individual eWLB packages from one another. Each singulated eWLB package contains at least one die, but may contain more than one die. In cases where the eWLB package contains more than one die, the dies may of the same type or different types.
After the eWLB packages have been singulated, an eWLB package is typically mounted on a printed circuit board (PCBs) on which other IC packages and/or other electrical components are also mounted. The eWLB package is placed on the PCB such that the solder balls of the eWLB package are in contact with electrical contacts of the PCB. The side of the eWLB package on which the solder balls are disposed is typically referred to as the front side of the package, whereas the opposite side of the eWLB package is typically referred to as the rear side of the package. A solder reflow process is then performed to permanently bond the solder balls of the eWLB package to the respective electrical contacts of the PCB. In this way, the pads of the die(s) of the eWLB package are electrically interconnected with the electrical contacts of the PCB.
In eWLB packages, any electrical wiring that needs to be made inside of the mold is made from the front side of the eWLB package. In some cases, however, electrical contact pads of the die are located on the rear face of the die, or on both the front and rear faces of the die. For example, most optoelectronic dies such as light emitting diode (LED) dies, photodiode dies and vertical cavity surface emitting laser diode (VCSEL) dies have electrical contact pads on their front and rear faces. Forming the electrical wiring that is needed to make the electrical interconnections between the solder balls of the eWLB package and electrical contact pads located inside of the mold on the rear faces of the dies can be difficult due to the fact that these contact pads are inside of the mold.
A variety of solutions to this problem have been proposed, some of which are disclosed in U.S. Pat. No. 7,048,450, which is assigned to the assignee of the present application and which is incorporated herein by reference. Such solutions typically involve creating a thru-mold via (TMV) that extends from the front side of the eWLB package to the rear side of the package and then connecting the TMV to the contact pad(s) disposed on the rear face of the die with a bond wire or a metal bridge. While such solutions work satisfactorily, they are relatively difficult to implement. Also, the use of bond wires and the like is inconsistent with one of the benefits of eWLB technology, which is that it avoids the use of bond wires and uses wafer-level processes to form the interconnections between the solder balls and the contact pads of the die.
A need exists for an eWLB package and method that allow electrical connections to be more easily made to the rear faces of the dies.

Two-sided-access extended wafer-level ball grid array (eWLB) package, assembly and method

Avago Technologies General IP (Singapore) Pte. Ltd.


An image data area extracting system includes: a threshold value setting unit configured to set a threshold value for three dimensional image data of an object; an area managing unit configured to extract a threshold value area from the three dimensional image data based at least in part on the threshold value; a three dimensional projection image display unit configured to display an image, the image being constructed from the three dimensional image data; a starting point designating unit configured to designate a starting point for a connected area to be deleted from the image; and an extract connected area deleting unit configured to remove the connected area from the image.

1. Field of the Invention
The present invention relates to an image data area extracting system and an image data area extracting method applicable to image diagnosis devices. Particularly, the present invention is directed to an image data area extracting system and an image data area extracting method for removing areas that are unnecessary for diagnosis in a medical image.
2. Discussion of the Background
Generally, an image diagnosis apparatus, such as an X-ray computed tomography (CT) device, is used to acquire and reconstruct X-ray CT image data by detecting X-rays penetrated through an object. In particular, to observe blood vessels, imaging is performed by injecting a contrast medium into an object and X-ray CT image data of the contrasted blood vessels is then reconstructed. Namely, three-dimensional (3D) projection image data is constructed using the reconstructed X-ray CT image data.
Usually, a Maximum Intensity Projection (MIP) method, a minimum intensity projection method (MinIP), or an X-ray projection method is used for reconstructing the 3D projection image data. To observe the contrasted blood vessels, 3D projection images are generally constructed using the MIP method. The resultant image is known as an MIP image.
While an MIP image is useful to observe blood vessels, it has several limitations. More particularly, images of other physical structures, such as bones, are reconstructed with the blood vessel data because a CT value for a contrasted blood vessel and a CT value for a bone are close. As a result of the presence of the bone tissue images in the MIP images, accurate diagnosis of blood vessels is inhibited.
To resolve this difficulty, another method has been proposed, for example, as described in Japanese Patent Application Publication No. 9-73557. According to this method, 3D images of surface rendering (SR) images using voxel or volume rendering (VR) images are reconstructed. Additionally, data related to unnecessary bone areas is deleted through the SR images or the VR images prior to observation of the contrasted blood vessels.
FIGS. 1(a)-1(c) illustrate the method for deleting unnecessary bone area prior to observation of the contrasted blood vessels. FIG. 1(a) illustrates a shaded volume rendering (SVR) image produced using the MIP method. Because the CT value of bone is generally equal to the CT value of a blood vessel in the conventional method, both blood vessels and bones appear in the SVR image as shown in FIG. 1(a).
To discriminate between bone and blood vessels in an SVR image, a threshold value using CT value and opacity for a CT value are set. The image is displayed by discriminating between bone and contrasted blood vessels using the threshold and opacity. It is also possible to delete bone area image data selectively by dividing or by extracting SVR image data of bone area using a connected area extracting method.
FIG. 1(b) shows an SVR image of a contrasted blood vessel from which bone area image data has been deleted. The MIP image is produced from X-ray CT image data included in the blood vessel area of the SVR image.
However, these observations of contrasted blood vessels using an X-ray CT apparatus cannot efficiently perform the deletion of bone area image data because many soft tissues present in the same area have CT values substantially equal to CT values for bones. For example, other tissues (e.g., cartilage or other organs) may interfere with the removal of bone area image data.
Because the CT value of bone ranges to a certain extent, if a threshold value and opacity are set at a low CT value at the start of bone area image data deletion operation, organs (which are a type of soft tissue) are also displayed with bones. Since soft tissues (e.g., internal organs) include large contact areas with the contrasted blood vessels, it is difficult to extract the bone area image data. Thus, if CT values of the threshold value and the opacity are set low, it is difficult to efficiently delete the bone area image data.
An alternative approach is to set the CT value of the threshold and opacity high. While the bone area image data is deleted by setting the threshold value at high CT to construct the MIP images from the X-ray CT image data, as depicted in the circled ranges of 1(c), soft tissue (e.g., cartilage) remains in the images, since the CT value of cartilage is substantially similar to the CT value of bones.
It is possible construct an MIP image by selectively deleting cartilage based on setting a new threshold value with the connected area extracting method. By doing this, it is possible to delete the bone area image data that remains in the MIP image in FIG. 1(c). However, even in this reconstructed MIP image, cartilage having lower CT values remains. Consequently, to obtain an MIP image effective for diagnosis, it is necessary to repeat complex processes to delete the bone area image data using the 3D image, a confirmation of the MIP images, and successive setting of threshold values for deletion.
While the above examples have illustrated the difficulties for diagnosing blood vessels, the same difficulties also apply to observation of other organs. Additionally, the data used for processing in the above-identified application may be obtained from a local memory, a remote memory, or a storage device via a communication network, such as in a PACS system.

Image data area extracting system and image data area extracting method


The invention relates to antibodies or fragments thereof specific for insulin-like growth factor binding protein-7 (IGFBP7). A method of raising anti-IGFBP7 single domain antibodies is also disclosed and specific antibody clones are described, along with their binding characteristics. The anti-IGFBP7 antibodies may be useful as diagnostic tools for detecting neoplastic diseases involving tumor angiogenesis, and a variety of other angiogenesis associated diseases.

Malignant brain tumors, glioblastoma multiforme (GBM), are a fatal form of cancer. Despite advances in neurosurgical techniques, chemotherapeutic regimens, and radiotherapy protocols, the median survival following surgical resection and adjuvant therapy is less than 12 months. Glioblastomas have one of the highest rates of angiogenesis among all malignant tumors. The level of angiogenesis in glioblastomas is a direct predictor of patient survival.
However, non-invasive diagnostic/prognostic assessment of the angiogenesis in glioblastomas by imaging techniques is lacking. Similarly, there are no effective anti-angiogenic therapies for glioblastomas. Developing imaging, diagnostic and therapeutic approaches to assess and inhibit angiogenesis in glioblastomas, respectively, depends on the characterization of specific markers of brain tumor angiogenesis that could serve as targets.
Typically, GBM is diagnosed as an area of contrast enhancement on MRI—this technique does not provide useful information on the molecular characteristics of GBM nor about the rate of angiogenesis.
GBM therapy currently includes neurosurgical tumor removal followed by highly toxic radio- and chemo-therapeutic regimens (and several experimental treatments). However the success rate remains low.
The key reason for failure of neurosurgical intervention in curing GBM is cancer recurrence. Recurrence occurs because of the locally invasive nature of the tumor—microscopic regional metastases are not removed during surgery and cause tumor recidive. Failure of chemotherapeutic treatments is due to poor penetration of drugs across the blood-tumor barrier.
Accordingly, it is desirable to develop diagnostic and/or therapeutic formulations that specifically recognize abnormal blood vessels in brain tumors. These formulations could be adapted for use in molecular imaging (optical, MRI, PET) in vivo to diagnose brain tumor and evaluate the extent of angiogenesis and invasion, to prevent growth of abnormal tumor vessels, and/or to target/deliver other therapeutics to tumor vessels to destroy tumor vessels.

Formulations targeting IGFBP7 for diagnosis and therapy of cancer


Systems and methods for reduction of pollutants in combustion processes using combined rotating opposed fired air (ROFA) and fuel injection sorbents (FSI) for increased chemical reactivity.

1. Field of the Invention
The present invention relates generally to a method for reducing byproducts emissions from combustion reactions, and, more particularly, to a method for regulating flue gas pollutants in reactors and combustion furnaces.
2. Description of the Prior Art
The combustion of sulfur-containing carbonaceous compounds, especially coal, results in a combustion product gas containing unacceptably high levels of sulfur dioxide.
SO2 Reduction Methods
The reduction of sulfur dioxide (SO2) is of primary concern to the power and industrial boiler industries since acid rain is a product of gaseous SO2 release into the environment. To combat acid rain, federal regulations are increasingly more stringent and companies are increasingly more exposed to federal penalties for over emitting SO2.
Sulfur dioxide is a colorless gas that is moderately soluble in water and aqueous liquids. It is formed primarily during the combustion of sulfur-containing fuel or waste. Once released to the atmosphere, sulfur dioxide reacts slowly to form sulfuric acid (H2SO4), inorganic sulfate compounds, and organic sulfate compounds.
Air pollution control systems for sulfur dioxide removal are large and sophisticated, and rely on two main techniques for sulfur dioxide removal: absorption and adsorption. Both methods rely on neutralization of the absorbed sulfur dioxide to an inorganic salt by alkali to prevent the sulfur from being emitted into the environment. The alkali for the reaction most frequently used include: limestone—either calcitic or dolomitic; quick and hydrated lime—slurry or dry; and magnesium hydroxide—commercial and byproduct from Thiosorbic lime; and trona.
Absorption—Absorption processes use the solubility of sulfur dioxide in aqueous solutions to remove it from the gas stream. Once sulfur dioxide has dissolved in solution to form sulfurous acid (H2SO3), it reacts with oxidizers to form inorganic sulfites (SO3−) and sulfates (SO4−). This process prevents the dissolved sulfur dioxide from diffusing out of solution and being re-emitted. The solution is then processed to remove the sulfur
Limestone is the alkali most often used to react with the dissolved sulfur dioxide. Limestone slurry is sprayed into the sulfur dioxide-containing gas stream. The chemical reactions in the recirculating limestone slurry and reaction products must be carefully controlled in order to maintain the desired sulfur dioxide removal efficiency and to prevent operating problems. Wet scrubbers used for sulfur dioxide control usually operate at liquid pH levels between 5 to 9 to maintain high efficiency removal. Typical removal efficiencies of sulfur dioxide in wet scrubbers range from 80 to 95%.
Another type of absorption system is called a spray atomizer dry scrubber, which belongs to a group of scrubbers called spray-dryer-type dry scrubbers. In this case, an alkaline slurry is sprayed into the hot gas stream at a point upstream from the particulate control device. As the slurry droplets are evaporating, sulfur dioxide absorbs into the droplet and reacts with the dissolved and suspended alkaline material.
Large spray dryer chambers are used to ensure that all of the slurry droplets evaporate to dryness prior to going to a high efficiency particulate control system. The term "dry scrubber" refers to the condition of the dried particles approaching the particulate control system. Fabric filters or electrostatic precipitators are often used for high efficiency particulate control.
Spray-dryer-type absorption systems have efficiencies that are similar to those for wet-scrubber-type absorption systems. These generate a waste stream that is dry and, therefore, easier to handle than the sludge generated in a wet scrubber. However, the equipment used to atomize the alkaline slurry is complicated and can require considerably more maintenance than the wet scrubber systems. Spray-dryer-type absorption systems operate at higher gas temperatures than wet scrubbers do and are less effective for the removal of other pollutants in the gas stream such as condensable particulate matter.
The choice between a wet-scrubber absorption system and a spray-dryer absorption system depends primarily on site-specific costs. The options available for environmentally sound disposal of the waste products are also an important consideration in selecting the type of system for a specific application. Both types of systems are capable of providing high efficiency sulfur dioxide removal. Both types of systems are also very expensive to install, operate, and maintain.
Adsorption—Sulfur dioxide can also be collected by adsorption systems. In this type of control system, a dry alkaline powder is injected into the gas stream. Sulfur dioxide adsorbs to the surface of the alkaline particles and reacts to form compounds that can be precipitated out of the gas stream. Hydrated lime (calcium hydroxide) is the most commonly used alkali; however, a variety of alkalis can be used effectively. A dry-injection-type dry scrubber can be used on smaller systems as opposed to using the larger, more complicated spray-dryer-type dry scrubber. However, the dry injection system is slightly less efficient, and requires more alkali per unit of sulfur dioxide (or other acid gas) collected. Accordingly, the waste disposal requirements and costs are higher for adsorption systems than absorption systems.
In general, the prior art adsorption methods are more expensive because they require expensive equipment, including a bag house and electrostatic precipitator, are inefficient in the utilization of alkali and reduction of sulfur, and require extra maintenance because the injectors are prone to plugging.
Thus, prior art SO2 absorption and adsorption systems and methods have drawbacks that make them expensive and/or inefficient. A need exists, therefore, for a SO2-removal system and method that produces an easily-handled by-product, achieves greater than 70% sulfur removal from the flue gas with high sorbent utilization, and reduces the equipment requirements (and costs).
Furnace Sorbent Injection (FSI) to Reduce SOx
Other pollutants, such as SO3, Hg, HCl, NOx, and PM have also been removed from combustion effluent by furnace sorbent injection (FSI). However, the prior art methods for the removal of these pollutants are also relatively inefficient and expensive to perform.
ROFA
Rotating opposed-fired air (ROFA) utilizes the co-ordinated, reinforcing, tangential injection of high-velocity secondary air to produce turbulent mixing, resulting in a greater combustion efficiency for greater NOx reduction, such as taught in U.S. Pat. No. 5,809,910 issued Sep. 22, 1998 to Svendssen, which describes a ROFA system that provides for the asymmetrical injection of overfired air (OFA) in order to create a rotation and high turbulence in the furnace, thus more thoroughly mixing the secondary air and the combustion gases. ROFA has been applied to combustion furnaces solely for the reduction of NOx and SO3 in the prior art.
Overall, while the use of boosted over fire air is known in the art, its use in combination with fuel sorbent injection for efficient, cost-effective, and highly effective reduction of pollutants has not been taught or disclosed in the prior art. Thus, a need exists for systems and methods providing for the reduction of pollutants in flue gas concentration in a combustion process burning sulfurous fossil fuel and utilizing a high-turbulence over fired air system.

Method for flue-gas reduction of pollutants in combustion processes


A card organizer device (10) supported in a cabinet (12) for depositing cards (14) moved into the card organizer device into the cabinet, is described. The card organizer device is comprised of a plurality of elongate, side-by-side holders (40, 42, 44, 46) each having a plurality of compartments (94, 98, 102, 106) for receiving cards that have been first sorted and then moved through the open top of the holders and into the compartments. The holders are also provided with open bottoms. This provides for depositing the cards into boxes (32, 34, 36 and 38) formed in the cabinet when the card organizer device is removed from the cabinet. That way, the cards lay in the boxes of the cabinet in a fanned and sorted order. The sorted cards can then be removed from the cabinet and placed back into a conventional set box container. The sorted cards can then be held in the set box container for appreciation or resale. A cover (114) is also provided that mounts over the cards and the card organizer device mounted in the cabinet to protect the sorted cards.

1. Field of the Invention
The present invention relates to an organizer device for cards. In particular, the present invention relates to a device for organizing cards, particularly collectible cards, into a container for temporarily holding the cards until they are organized in numerical order. The organized cards are then deposited from the organizer device into the container where they are picked up and placed in a set box container for the cards. A set box container is a package constructed to hold a numbered set of the collectible cards.
The card organizer device is preferably comprised of a plurality of elongate, rectangular shaped holder units, each having an open top and an open bottom. The holder units are connected side-by-side by rims that extend between adjacent holder units. Preferably the width of each holder unit is only slightly wider than the width of the cards to be moved into the organizer device. A plurality of partitions extend between the spaced apart sidewalls of the holder units to provide a plurality of compartments for receiving sorted cards along the length of the holder units. The rims between the adjacent holder units are preferably provided with indicia for labeling the compartments. In use, the card organizer device is first mounted in a container or cabinet. The cards are usually sold in a random order. The cards are then sorted and placed in compartments in a holder unit of the organizer device according to alphabetic, numerical or some other pertinent order. The organizer device can then be removed from the container by grasping finger tabs provided at each end of the organizer device and lifting the organizer device out of the container, leaving the sorted cards in the container. The organized cards deposited in the container are then picked up, in order, and placed back into the set box container for the cards. A removeable cover mounts over the card organizer device mounted in the cabinet to protect the sorted cards while they are held in the organizer device mounted in the container. Also, the card organizer device enables the collectible cards to be sorted and ordered without damaging the cards by scratching their faces or wearing or rounding the card edges. This helps to retain the intrinsic value of the collectible cards.
2. Prior Art
The prior art has described various types of devices for sorting and filing cards, check vouchers, important papers and the like. Some of these devices are provided with moveable partitions for varying the space between adjacent partitions. This enables a user of the device to adjust the size of the compartment formed between adjacent partitions depending on the amount of papers and the like that are filed in a particular compartment. Illustrative of these prior art devices are U.S. Pat. No. 254,836 to Nauerth; U.S. Pat. No. 386,673 to Wells; U.S. Pat. No. 386,675 to Wells; U.S. Pat. No. 590,666 to Macrae; U.S. Pat. No. 660,541 to Field; U.S. Pat. No. 867,599 to Rand; U.S. Pat. No. 877,600 to Sawyer; U.S. Pat. No. 970,103 to Parrott; U.S. Pat. No. 1,030,317 to Middauoh; U.S. Pat. No. 1,603,776 to Joly and U.S. Pat. No. 1,613,570 to Shotwell.
Nauerth describes a file for postal and other cards. The file is comprised of a case having an open side. Partitions are adjustably mounted on rods provided adjacent to an upper wall of the case while recesses are provided on an opposite lower wall. The recesses mate with pins depending from the partitions to limit the lateral movement of the partitions to vary the size of the included compartment.
Wells describes two types of paper or bill files. U.S. Pat. No. 386,673 describes a bill file comprised of a base having a pair of grooves extending lengthwise along opposed side portions of the base. A plurality of partitions are mounted on the base. The partitions have opposed inwardly bent rims at a lower end of the partition that mate with the grooves to provide for adjusting the partitions along the base. U.S. Pat. No. 386,675 describes a bill file comprised of a base having a pair of slide rods mounted lengthwise along opposed side portions of the base. A plurality of partitions are provided with legs having openings that provide for the partitions to slide along the rods for adjusting the partitions. These bill files do not provide for depositing the bills in a container after the bills have been sorted.
Macrae describes a check sorter or separator comprised of an open box-like case having a pair of guide rods extending longitudinally along the inside sidewalls of the case and adjacent to the open top of the case. A plurality of partitions are slideably mounted on the guide rods to form compartments for the checks. A plunger or follower is mounted on the rods at one end of the plurality of partitions. The plunger serves to hold the partitions and sorted checks together in a compressed relationship.
Field describes a portable and collapsible case having a plurality of partitions connected together in the shape of pleated bellows. The partitions have tapered corners for seeing the card held by the partition. When the case is collapsed, a strap can be drawn around the case to hold it in the collapsed position.
Rand describes a sorting device having a base provided with a central groove that extends the majority of the length of the base. A slide rod is mounted along the length of the groove. The slide rod provides for slideably supporting partitions mounted on slide blocks to adjust the distance between the partitions.
Sawyer describes a file case having a false bottom mounted on a base wall of the file case. The false bottom provides for mounting a slide rod. A follower plate is slideably mounted on the slide rod for compressing partitions and cards sorted between the partitions together in the file case. A tip lid is hinged to one of the sidewalls and the opposite sidewall is hinged to the base for opening the case.
Parrott describes a card holder rack that is provided with month and day indicia for filing cards of scheduled events. The partitions in the holder are provided with a cut out portion that permits convenient access to the filed cards. There is no means of removing the filed cards from the back of the holder.
Middaugh describes a file holder having an open front and top sides. A guide rod is mounted between the end walls and adjacent to the bottom. Partitions are slideably mounted on the guide rods to adjust the distance between the partitions for filing papers in the holder. The back of the holder can be opened for removing papers from the holder; however, the file holder is not adapted for sorting cards into a container for the cards.
Shotwell describes an index file having an open top and with a guide rod extending the length of the file, adjacent to the bottom wall. Individual folder units are slideably mounted on the guide rod. The folders have a pocket that provides for mounting papers and the like. An outer flap portion of each folder provides for identifying the contents of the folder.
Joly describes a card sorting device and system for filing. The sorting device is divided into several series of compartments separated by partitions. The series of compartments are useful for successive sorting of cards according to alphabetic order, numerical sequence or some other established criteria. This device does not provide for depositing the sorted cards in a separate container for the cards.
Other patents more remotely related to the present invention include U.S. Pat. No. 1,113,182 to Avery and U.S. Pat. No. 1,467,357 to Davies.
What is not shown by the prior art and what is needed is an organizer device that is mountable in a container, which serves as both a support for the organizer device and as a container for the sorted cards. To serve that purpose, the organizer device needs to have an open top and an open bottom with a plurality of partitions mounted on longitudinal support walls between the open top and bottom. The sorted cards are received in compartments formed by the partitions. After the cards have been sorted, the organizer device can be removed from the container, thus depositing the sorted cards in the container.


An apparatus for controlling an engine to switch combustion modes in accordance with the load applied to the engine. An injector injects fuel into a combustion chamber to perform a plurality of combustion modes. A valve, such as a swirl control valve, is arranged in an intake passageway to adjust the intensity of the swirling motion produced in the combustion chamber. An ECU determines the combustion mode that is to be performed in accordance with the load applied to the engine. The ECU controls the valve to optimize the intensity of the swirling motion in accordance with the determined combustion mode. The ECU also controls the injector to perform the determined combustion mode. When the combustion mode that is to be performed switches between stratified charge or semi-stratified charge and homogeneous charge, the ECU controls the injector to perform semi-stratified charge combustion for a certain time period before performing a newly determined combustion mode. The ECU varies the time period in accordance with the difference between the actual position and a target position of the valve. This stabilizes combustion when switching combustion modes and produces a smooth transition between combustion modes.

The present invention relates to apparatuses and methods for controlling engines that inject fuel directly into their cylinders. More particularly, the present invention relates to apparatuses and methods for changing combustion modes in engines in accordance with the load applied to the engine.
In a typical engine, fuel is injected into an intake passage from a fuel injector. The fuel is then homogeneously mixed with air passing through the intake passage and sent into a combustion chamber. In the combustion chamber, the homogeneous air-fuel mixture is ignited by a spark plug and burned to generate engine power.
The burning of air-fuel mixture, which is distributed homogeneously in the combustion chamber, is generally referred to as homogeneous charge combustion. An engine performing homogeneous charge combustion has a throttle valve arranged in its intake manifold. The size of the throttle valve opening is adjusted to vary the amount of air supplied to the combustion chamber and thereby control engine power.
However, homogeneous charge combustion produces strong vacuum pressure in the intake manifold when the throttle valve throttles the intake manifold. The vacuum pressure increases pumping loss, which occurs when the air-fuel mixture is drawn into the combustion chamber from the intake manifold. This decreases the efficiency of the engine.
To solve this problem, an engine capable of performing stratified charge combustion has been proposed. Stratified charge combustion is performed by injecting fuel directly into the combustion chamber such that the fuel is concentrated about the spark plug. Ignition by the spark plug burns the stratum of rich air-fuel mixture surrounding the spark plug. This, in turn, burns the stratum of lean air-fuel mixture surrounding the rich mixture. The power of a stratified charge combustion engine is basically controlled by adjusting the amount of fuel injected toward the vicinity of the spark plug. Accordingly, pumping loss is decreased since the throttle valve need not throttle the intake manifold. This improves the efficiency of the engine. Furthermore, stratified charge combustion improves fuel efficiency since the engine can be driven with an air-fuel mixture having a lean air-fuel ratio.
Japanese Unexamined Patent Publication No. 5-52145 describes an engine that switches combustion modes between stratified charge combustion, homogeneous charge combustion, and semi-stratified charge combustion depending on the load applied to the engine. When the engine load is relatively low, stratified charge combustion is performed by injecting fuel into the combustion chamber during the compression stroke. When the engine load is relatively high, homogeneous charge combustion is performed by injecting fuel into the combustion chamber during the intake stroke. When the engine load shifts from low to high or from high to low, semi-stratified charge combustion is performed before proceeding to homogeneous charge combustion or stratified charge combustion. Fuel is injected twice, once during the intake stroke and once during the compression stroke, to perform semi-stratified charge combustion. Accordingly, semi-stratified charge combustion is an intermediate combustion mode performed between stratified charge and homogeneous charge.
In addition to a throttle valve, which adjusts the amount of intake air, the engine includes a swirl control valve, which adjusts the intensity of the swirling motion of air in the combustion chamber. When the combustion mode is shifted between stratified charge combustion and homogeneous charge combustion in accordance with changes in the engine load, the positions of these valves are varied to adjust the state of the intake air (flow rate and amount) in the combustion chamber. However, when varying the positions of the valves, a certain length of time is required for the valves to reach their target position. In other words, the valves have a response delay. This further delays the adjustment of the intake air conditions (amount and swirl). During such delays, the conditions of the intake air in the combustion chamber remain inappropriate for the combustion mode that is to be performed. This may cause unstable combustion of the air-fuel mixture.
Accordingly, the engine described in Japanese Patent Publication No. 5-52145 performs semi-stratified charge combustion for a certain length of time before switching between stratified charge combustion and homogeneous charge combustion. In other words, semi-stratified charge combustion is performed for a predetermined time period when switching combustion modes between stratified charge combustion and homogeneous charge combustion to achieve an intake air state that is optimal for the combustion mode that is to be performed. Thus, semi-stratified charge combustion stabilizes combustion and allows smooth switching of combustion modes.
However, the time required for semi-stratified charge combustion is not necessarily constant. For example, if the difference between the actual position of the valves and the target position is large or if the state of the intake air is changing dramatically, the duration of semi-stratified charge combustion may be insufficient. On the other hand, if the difference is small, the duration of semi-stratified charge combustion may be too long.
If the semi-stratified charge combustion time period is too short, the combustion mode is switched before the intake air conditions are appropriate for the new combustion mode. This may lead to power fluctuation and misfires. If the semi-stratified charge combustion time is too long, fuel efficiency will deteriorate. Accordingly, if the time for semi-stratified charge combustion is constant, unstable combustion may occur when switching combustion modes between stratified charge and homogeneous charge and there will be a loss in fuel efficiency.

Apparatus and method for controlling direct injection engines


In a color-center light source, a color center is formed artificially. A predetermined single atom is removed from the surface of a defect-free ionic crystal so as to form a lattice defect. Optical transition of the defect is utilized so that it functions as a light source.

1. Field of the Invention
The present invention relates to a new light source having an artificially formed color center (hereinafter referred to as an "artificial color-center light source") in which an atom is removed from the surface of an ionic crystal so as to form a defect artificially and to use the same as a color center.
2. Description of the Related Art
A color center laser is a known light source that operates on the basis of random defects formed in an ionic crystal.
A structure in which a single atom is trapped in an optical resonator to provide a light source is disclosed in a paper entitled "Microlaser: A laser with one atom in an optical resonator" reported in a recent Physical Review Letter.
In the light source, a barium atom beam is passed through the resonator and is optically excited so as to function as a gain medium. Statically, a single barium atom is present in the resonator. Therefore, the author of the paper named the apparatus "single atom optical resonator."
Microlight sources developed thus far are of a type that utilizes transition between energy bands of a semiconductor material and/or structure. Especially, semiconductor quantum-well devices utilizing quantum confined structures and like devices have been used.
However, this invention, in which a single lattice defect is formed in a resonator with atomic level accuracy, enables generation of light having a constant wavelength in a more stable manner as compared with conventional light sources. Moreover, the characteristics of the light source are determined by well defined energy levels of the single defect and an interaction between a field of photons and a coupled vacuum state with the resonator. Therefore, this structure facilitates handling of a light source in quantum optics. It is also important that the basic structure of the light source can be constructed through use of a homogeneous material of a single kind.
Of course, since the size of the structure is at the atomic level, in the future, the light source will be usable as a microlight source in optical communication as well as in information transmission of an optical computer. In contrast to conventional light sources which mainly utilize transition between energy bands of a semiconductor material/structure, the present invention utilizes energy transition between levels that are determined by the characteristics of an atom itself, which is a more basic element. And, in the present invention, due to electrical confinement, the transition probability becomes higher than that in a bulk material.
With recent progress in developing a technique of manipulating a single atom through use of a scanning tunnel microscope (STM), it has become possible to manipulate the spatial position of each individual atom. A paper entitled "Scanning Tunneling Microscope Fabrication of Atomic Scale Memory on a Silicon Surface" (Dehuan Huang, et al., J. J. A. P. 33, 190 (1994)) discloses a technique of arbitrarily removing and inserting silicon atoms that form a crystal structure on a silicon substrate through use of an ultra-high vacuum STM. Through use of this technique, an attempt has been made to reproduce a defect at the atomic level and to provide an atomic-level memory utilizing the presence/absence of an atom.
FIGS. 1(a) and 1(b) show artificial lattice defects that were formed through use of the conventional STM. In FIGS. 1(a) and 1(b), the images of silicon atoms are shown as white patterns, while the sites from which silicon atoms were removed are depicted by black patterns. FIG. 1(a) shows an image of an atomic plane before removal of atoms, while FIG. 1(b) shows an image of an atomic plane after atoms at locations indicated by black "+" marks in FIG. 1(a) were removed by the STM. These images clearly show that it is possible to remove an atom from any position on a silicon atom plane.
A lattice defect in an ionic crystal (e.g., LiF, NaCl, NaF, KI) is known to exhibit an optical transition property (usually called a "color center") which is represented by a quantum effect in a quantum box. This characteristic has been used in, for example, a color center laser. Application to a color center laser is disclosed in, for example, "Laser Handbook" (Ohm Corporation). Quantum effect of a color center is disclosed in, for example, "Defects in Crystalline Solids" (written by B. Henderson).
A site from which an atom has been removed (i.e., a defect) serves as an energy well formed in the potential of surrounding atoms. Since the size of the well is smaller than the wavelength of an electron, a quantum confinement effect takes place and quantizes energy levels to discrete values; i.e., quantization levels. Especially, when a negative ion is removed from an ionic crystal so that a defect is formed therein, electrons are attracted by a positive charge generated at the defect and are trapped in the vicinity of the defect. When a trapped electron falls to a lower energy level created by the well, the balance energy is radiated in the form of an electromagnetic wave, which is the light emission process of a color center.
As described above, when only negative ions are removed with atomic-level accuracy, quantized energy levels at which electrons are restrained are established, so that stable light having a narrow spectral width can be generated while avoiding the conventional drawback in which a light source has a broad emission spectra due to inhomogeneity of the randomly created defects.

Japan Science and Technology Corporation

Room 24, Mezon Koizumi, 6-33, Midori-cho 1-chome


A method and apparatus for forming a thin solar cell having a substantially planar body comprising a first layer which includes at least one photoactive semiconductor layer. This first layer has a frontal light entrance face, a rear face, and side edge face. A second layer comprising an electrically conductive grid-shaped front contact and an anti-reflection layer is located on the frontal light entrance face. A third layer comprising a front cover glass is fastened substantially adjacent the anti-reflection layer and the front grid-shaped contact. A fourth layer, comprising an electrically conductive rear conductive contact, is located on the rear face of the first layer. Spaced apart from the first layer are two electrically interconnection pads. Each pad has a face suitable for an electrical interconnection. A first connection for electrically connecting one pad to the front grid shaped contact and a second connection for electrically connecting the other pad to the rear conductive contact are disposed on one side of the solar cell.

1. Field of the Invention
The present invention relates to a thin solar cell and to a method for producing the same and, more particularly, to a thin solar cell of the type having a body composed essentially of one or more photoactive semiconductor layers, such as gallium arsenide, with the semiconductor body having on its frontal light entrance face a grid-shaped contact, an anti-reflection layer and a cover glass, and on its rear face a rear contact.
2. Description of the Related Art
High efficiency thin solar cells are presently a target of development all over the world since the ratio of performance to weight is important for use in satellites. Some solar cells are composed of a direct bandgap semiconductor material, such as gallium arsenide, which responds to the absorption of light within a depth of a few .mu.m. Direct bandgap semiconductors of a few .mu.m in thickness are thus able to electrically provide the full function of a solar cell. Other solar cells are composed of an indirect bandgap semiconductor material, such as silicon, which requires a layer of about 70 .mu.m for complete absorption of light. Solar cells made of GaAs exhibit greater efficiencies and better radiation resistance. The use of GaAs solar cells is therefore more advantageous for use with low-orbit satellites. One drawback, however, in using GaAs over Si in solar cells is that for the same thickness of the solar cell, the GaAs cell has a substantially greater weight than the Si cell.
In a GaAs solar cell and in solar cells composed of semiconductors of the III-V or II-VI groups of the Periodic Table of Elements, all of the photoelectrically sensitive layers are produced in an epitaxy process (growing of several differently doped and composed crystalline layers on a carrier substrate). The substrate on which the photoactive layers are produced, inter alia, has no photoelectric function and usually serves only for the production of these layers and to impart stability to the semiconductor body. It is possible to remove layers, that usually are unnecessary for the photoelectric function and undesirable because of their added weight (particularly if used in satellites), partially or in their entirety before the solar cells are put into operation. In this connection, GaAs and other compound semiconductors in which the photoelectric layers are produced in an epitaxial process, offer particular possibilities for separating the substrate layer from the epitaxy in order to produce thin semiconductor layers. A few of the separation methods include:
(1) the CLEFT process for epitaxial layers; the CLEFT process is described in Appl. Phys. Lett. 37(6), Sep. 15, 1980, pages 560-562;
(2) the lift-off technique by use of a chemically selectively-etchable epitaxially grown intermediate layer;
(3) an etching technique in which the substrate is etched away down to an epitaxially grown stop layer;
(4) polishing and/or lapping and/or chemically etching away the substrate down to the photoactive semiconductor layers can also be effected for layers that were not produced by epitaxial processes.
However, the complete or partial removal of the substrate is not a required part of the present invention. A thin solar cell can also be a cell in which the semiconductor body, comprising one or more photoactive semi-conductor layers, due to its low thickness and its concomitant fragility, can no longer be sufficiently manipulated without the presence of a stabilizing carrier. In existing solar cell devices, the attachment of connectors to interconnection pads on the thin semiconductor body by bonding, soldering, or other thermally or mechanically stressful processes in order to interconnect adjoining solar cells is very difficult because of the real danger of breakage involved.
The P/N junctions of most semiconductors and, for direct bandgap semiconductors, usually also the so-called window layer (e.g. AlGaAs for GaAs solar cells) required to reduce the high surface recombination are sensitive to environmental influences. The edges of GaAs solar cells and most other solar cells made of a direct bandgap semiconductor material must therefore be specially protected (passivated), at least as long as they are subjected to these influences. For GaAs solar cells, for example, this is usually done by etching a "mesa" trough around the active surface from the front through the photoactive layer with subsequent passivation by means of a dielectric medium (e.g. an anti-reflection layer) and sawing off the edge. This step includes a solar cell active area definition where the size of the photoelectrically active surface of the solar cell is determined.