A planar light source device configured to illuminate a transmissive liquid crystal device having a display region configured of pixels arrayed in a two-dimensional matrix from the rear side, includes: planar light source units corresponding to hypothetical display region units into which the liquid crystal display device is divided; a light source provided to each planar light source unit has jC×jR (jC≦2, jR≦2) light-emitting device units which are classified into first and second light-emitting device units; each light-emitting device unit being configured of i (i≦1) red, 2i green, and i blue light-emitting devices. At each planar light source unit, the light-emitting devices of each color are classified into first and second luminance values. The classification categories differ between first and second light-emitting device units. The first light-emitting device unit and the second light-emitting device unit are placed in at least twofold rotational symmetry.

1. Field of the Invention
The present invention relates to a planar light source device and a liquid crystal display device assembly.
2. Description of the Related Art
With liquid crystal display devices, the liquid crystal material itself does not emit light. Accordingly, a planar light source device (backlight) is placed at the rear face of and immediately under a display region configured of multiple pixels, so as to illuminate the display region of the liquid crystal display device, for example. Note that with a color liquid crystal display device, one pixel is configured of the three sub-pixels of a red light-emitting sub-pixel, a green light-emitting sub-pixel, and a blue light-emitting sub-pixel, for example. An image is displayed by causing liquid crystal cells making up each sub-pixel to serve as a type of light shutter (light valve), i.e., by controlling the light transmissivity (aperture ratio) of each sub-pixel to control the light transmissivity of the illumination light (e.g., white light) emitted from the planar light source device.
With related art, a planar light source device in a liquid crystal display device assembly illuminates the entire display region with a uniform and constant brightness, but a configuration different from such a planar light source device, i.e., a planar light source device of a configuration which is configured of multiple light-emitting device units in which the illumination distribution of multiple display region units is changed (a partial driving type or a division-driving type planar light source device) is described in Japanese Unexamined Patent Application Publication No. 2005-258403. Such control of the planar light source device (also called partial driving or division driving of the planar light source device) is used to increase contrast ratio due to increase in the white level and reduction in the black level at the liquid crystal display device, whereby image display quality can be improved, and power consumption of the planar light source device can be reduced.
The light source making up each planar light source unit in the planar light source device is often configured of red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes, with white light being obtained by color mixing of the red light, green light, and blue light obtained by emitting light from these light-emitting diodes, and illuminating the display region of the liquid crystal display device with this white light.

Planar light source device and liquid crystal display device assembly


Utilizing line-of-sight volumes in a game environment comprises calculating a line-of-sight vector defined by the position of a game camera and the position of a character in the game environment, determining whether one of a set of predetermined game elements intersects the line-of-sight vector, and if the line-of-sight vector is intersected, replacing the game element with its corresponding line-of-sight volume. In one embodiment, a line-of-sight volume is a grid volume that has the same size and shape as it corresponding game element. The line-of-sight volume allows a user to substantially view the character in the game environment.

1. Field of the Invention
This invention relates generally to electronic entertainment systems and relates more particularly to a system and method for utilizing line-of-sight volumes in a game environment.
2. Description of the Background Art
Many video games have three-dimensional game environments and allow a character controlled by a user to freely roam within those environments. Game environments are often complex and include many game elements other than characters. Exemplary game elements are structures, walls, pillars, vehicles, rocks, trees, and hills. Characters may interact with some of these game elements, for example by driving a vehicle. Other game elements, for example trees, may only be part of the background and will not react to actions by the character.
Generally, a camera is an entity in game software that defines the area of the game environment that a system displays on a screen at any given time. What the camera "sees" is what is displayed on the screen. In some games, the camera follows the movements of a main character through the game environment, providing a third-person view of the game environment. In such a game, the main character may move into an area of the game environment that is hidden from the camera's view. For example, the main character may be behind a boulder or in a corner formed by walls.
In some games, the user has some control over the camera and can reposition it to bring the main character into view. However, in other games, the user has no or very limited control over the camera. In these games, the user must maneuver the main character to bring it into view. But since the main character is hidden, the user may not be sure exactly how to move the main character relative to the obscuring game element, and may need to randomly articulate the game controls to eventually maneuver the main character from its hidden position.
Dealing with a character hidden by other game elements can be very frustrating for a user, particularly a novice user who is unfamiliar with the niceties of game controls. Even experienced users may be irritated by such interruptions in game play, particularly in fighting games when an attacking opponent may also be hidden from the camera.
In some games, a camera automatically re-positions itself when a character is lost from view. In other games, the game software may switch to another camera when one camera loses sight of a character. Each of these approaches requires significant system processing resources to be accomplished.

Utilizing line-of-sight vectors in a game environment


By connecting a protection diode (71) wherein p-anode layers (21) and n-cathode layers (22) are alternately formed in a polysilicon layer, and p-n junctions (74) that are in a reverse blocking state when there is a forward bias are alternately short circuited with a metal film (53), to a power semiconductor element (IGBT (72)), it is possible to achieve a balance between a high breakdown capability and a smaller chip area, a rise of breakdown voltage is suppressed even when a clamping voltage is repeatedly applied, and furthermore, it is possible to prevent destruction caused by a negative surge voltage input into a gate terminal (G).

In recent years, a large number of semiconductor devices are mounted in automobiles. A high breakdown capability (high surge capability) with respect to various kinds of surge voltage, such as ESD (electro-static discharge) is required of these semiconductor devices. Because of this, a surge protection diode (hereafter called a protection diode) is connected in order to protect a power semiconductor element configuring a semiconductor device from surge voltage.
When an external surge voltage or noise voltage, a surge voltage generated by an operation of the power semiconductor element itself, or the like, is applied to the power semiconductor element, a high breakdown capability of the semiconductor device is realized by clamping excessive voltage with the protection diode so that the excessive voltage is not applied to the power semiconductor element.
FIG. 18 is a sectional view showing main portions of a semiconductor device having a heretofore known protection diode. As shown in FIG. 18, in a heretofore known semiconductor device 800, an n-semiconductor layer (hereafter referred to as a high concentration n-semiconductor layer) 2, with an impurity concentration higher than that of a p-semiconductor substrate 1, is disposed on the p-semiconductor substrate 1. An n-semiconductor layer (hereafter referred to as a low concentration n-semiconductor layer) 3, with an impurity concentration lower than that of the high concentration n-semiconductor layer 2, is disposed on the high concentration n-semiconductor layer 2. A p-well layer 34 is disposed in a region (hereafter referred to as a control circuit region) in which is formed a control circuit 91 in a surface layer of the low concentration n-semiconductor layer 3, and a p-well layer 4 is disposed in a region (hereafter referred to as an IGBT region) in which is formed an IGBT 92.
The control circuit region is disposed in a central portion of the low concentration n-semiconductor layer 3. The plural p-well layer 34 are disposed distanced from each other. A MOSFET, diode, resistor Rg (not shown), or the like, configuring the control circuit 91 is disposed in a surface layer of each p-well layer 34. The MOSFET and diode shown in FIG. 18 are each disposed in a different p-well layer 34. Specifically, an n-source layer 35a and an n-drain layer 35b are provided as a MOSFET in the surface layer of one p-well layer 34, while an n-cathode layer 35c is provided as a diode in the surface layer of another p-well layer 34.
A gate electrode 38 is disposed across a gate insulating film 37 on the p-well layer 34 sandwiched by the n-source layer 35a and n-drain layer 35b. A source electrode 54 is in contact with the n-source layer 35a. A drain electrode 55 is in contact with the n-drain layer 35b. Although not shown in the drawing, a MOSFET body diode (parasitic diode) is formed, connected to the source electrode 54, in the p-well layer 34 in which the MOSFET is provided. A cathode electrode 56 is in contact with the n-cathode layer 35c. An anode electrode 57 is in contact with the p-well layer 34 in which the n-cathode layer 35c is provided.
The IGBT region neighbors the control circuit region (on the right side in the plane of FIG. 18). An n-emitter layer 5 of the IGBT 92, which is a power semiconductor element, is disposed in a surface layer of the p-well layer 4. A gate electrode 10 is disposed across a gate insulating film 7 on the p-well layer 4 sandwiched by the n-emitter layer 5 and low concentration n-semiconductor layer 3. An emitter electrode 12 is in contact with the n-emitter layer 5 and the p-well layer 4. Also, a collector electrode 11 configuring the IGBT 92 is disposed on the rear surface of the p-semiconductor substrate 1, which forms a p-collector layer.
Furthermore, a region in which a protection diode 81 (hereafter referred to as a protection diode region) is formed is provided in the low concentration n-semiconductor layer 3 in a region neighboring the control circuit region. The protection diode region neighbors the control circuit region on the side opposite to the IGBT region (on the left side in the plane of FIG. 18), thereby sandwiching the control circuit region. In the protection diode region, an insulating film (LOCOS oxide film) is provided on the low concentration n-semiconductor layer 3.
The protection diode 81 configured of three single unidirectional diodes 81a—a first diode, a second diode, and a third diode—formed of a p-anode layer 21 and an n-cathode layer 22 is disposed on the insulating film 60. For example, the first diode is disposed in the region the farthest from the control circuit region (on the left side in the plane of FIG. 18), while the third diode is disposed in the region nearest to the control circuit region (on the right side in the plane of FIG. 18).
The protection diode 81 is formed of a multi-crystal silicon layer (polysilicon layer). A cathode electrode 51 of the protection diode 81 is in contact with the n-cathode layer 22 of the first diode. The cathode electrode 51 is connected to a gate terminal G of the semiconductor 800. The cathode electrode 51 is connected via the control circuit 91 to the gate electrode 10 of the IGBT 92. An anode electrode 52 is in contact with the p-anode layer 21 of the third diode. The anode electrode 52 is connected to the emitter electrode 12 of the IGBT 92.
That is, the protection diode 81 is inserted between the gate terminal G and the emitter electrode 12 of the IGBT 92. This is equivalent to inserting the protection diode 81 between the gate electrode 10 and emitter electrode 12 of the IGBT 92. Also, as the control circuit 91 is also connected to the protection diode 81, the control circuit 91 is protected from surge.
FIG. 19 is a plan view showing main portions of the protection diode of FIG. 18. The n-cathode layer 22 of the first diode (on the left side in the plane of FIG. 19) is connected via the cathode electrode 51 and a pad electrode to the gate terminal G. The p-anode layer 21 of the first diode is connected to the n-cathode layer 22 of the second diode (in the center in the plane of FIG. 19). The p-anode layer 21 of the second diode is connected to the n-cathode layer 22 of the third diode (on the right side in the plane of FIG. 19). The p-anode layer 21 of the third diode is connected via the anode electrode 52 to the emitter electrode 12 of the IGBT 92. The emitter electrode 12 is connected via the pad electrode to an emitter terminal E.
FIG. 20 is an equivalent circuit showing the semiconductor device of FIG. 18. The three unidirectional diodes 81a configuring the protection diode 81 are connected in series. Of the three unidirectional diodes 81a, the cathode of an upper stage unidirectional diode 81a is connected to the gate terminal G connected to the control circuit 91, while the anode of a lower stage unidirectional diode 81a is connected to the emitter of the IGBT 92. That is, the upper stage unidirectional diode 81a is the first diode of the protection diode 81, while the lower stage unidirectional diode 81a is the third diode of the protection diode 81.
As shown in FIGS. 18 to 20, in the semiconductor device 800, the protection diode 81 formed of a polysilicon layer is formed across the insulating film 60 (LOCOS oxide film) on a surface of the semiconductor (low concentration n-semiconductor layer 3), and the n-cathode layer 22 of the protection diode 81 is connected via the control circuit 91 to the gate electrode 10 of the IGBT 92. Then, the p-anode 21 of the protection diode 81 is connected via the emitter electrode 12 of the IGBT 92 to the n-emitter layer 5. When a surge voltage is applied to the gate terminal G, the protection diode 81 breaks down, clamping the surge voltage, and no high voltage is applied to the gate electrode 10 of the IGBT 92. As a result of this, the IGBT 92 is protected from surge voltage.
Also, in the semiconductor device 800, a breakdown voltage necessary as the protection diode 81 is obtained by the three unidirectional diodes 81a being connected in series. For example, although a gate input voltage is 5V at a time of normal operation in a vehicle mounted application, it may happen that a 12V battery voltage is mistakenly applied to the gate terminal when handling. In order to protect the protection diode 81 itself from this kind of mistaken input, a breakdown voltage equal to or greater than the battery voltage is necessary. Additionally, in order to protect the gate of the IGBT 92, it is necessary that a voltage applied to the gate of the IGBT 92 is equal to or less than the gate breakdown voltage. It is possible to adjust the breakdown voltage of the protection diode 81 by changing the number of the unidirectional diodes 81a. However, when the number of the unidirectional diodes 81a increases, the area of the region (protection diode region) in which the protection diode 81 is formed increases. That is, the chip area of the semiconductor device 800 increases.
Therefore, a description will be given of a method of reducing the area of the protection diode 81. FIG. 21 is a plan view showing main portions of another example of a heretofore known protection diode. FIG. 21 shows a protection diode 82, which realizes a smaller area in comparison with FIGS. 18 and 19. The protection diode 82 is configured of multi-stage unidirectional diodes 81a formed of a polysilicon layer in which plural p-anode layers 21 and n-cathode layers 22 are alternately disposed. Neighboring unidirectional diodes 81a are connected. That is, the protection diode 82 configured of the multi-stage unidirectional diodes 81a is of a configuration wherein the p-anode layers 21 and n-cathode layers 22 of the unidirectional diodes 81a are alternately disposed, neighboring p-anode layers 21 and n-cathode layers 22 are connected, and plural bidirectional diodes having breakdown voltage in two directions are connected in series.
FIG. 22 is a wiring diagram showing a connection relationship between the heretofore known protection diode and a control circuit. The protection diode 82 is inserted between the gate terminal G and the emitter electrode 12 (emitter terminal E) of the IGBT 92, and no current arises until the bidirectional diodes break down in both the forward and reverse directions.
Next, a description will be given of an example wherein a protection diode 83 is inserted between the collector and gate of the IGBT, protecting the semiconductor device from surge voltage. FIG. 23 is an explanatory diagram showing main portions of another example of a semiconductor device having a heretofore known protection diode. FIG. 23 is an explanatory diagram showing a configuration of a semiconductor device in which is mounted the protection diode 83, which is formed of bidirectional diodes. FIG. 23(a) is a plan layout diagram of the whole of the semiconductor device shown in FIG. 23. FIG. 23(b) is a sectional view showing main portions of the semiconductor device shown in FIG. 23. FIG. 23(c) is a plan view showing main portions of the protection diode 83. FIG. 24 is an equivalent circuit diagram showing the semiconductor device of FIG. 23. As shown in FIG. 23, in a semiconductor device 900, the cathode electrode 51 of the protection diode 83 is connected to a collector terminal C via a stopper layer 85 of the IGBT 92, the p-semiconductor substrate 1 that forms a collector layer, and the collector electrode 11. The anode electrode 52 of the protection diode 83 is connected to the gate electrode 10 of the IGBT 92. The stopper layer 85 has the same potential as the collector layer.
As shown in FIG. 23(b), in the semiconductor device 900, for example, an IGBT region is provided between a control circuit region and a protection diode region. The configurations of the control circuit 91 and IGBT 92 are the same as in FIG. 18.
When a high voltage, such as an external surge voltage or a turn-off voltage when the IGBT 92 is switching, is applied to the collector terminal C, the protection diode 83 breaks down before the IGBT 92. Because of the breakdown, a current flows from the collector of the IGBT 92 via the protection diode 83 to the resistor Rg (refer to FIG. 22) in the control circuit 91, and a voltage is generated in the resistor Rg. The voltage is applied to the gate of the IGBT 92, the gate potential of the IGBT 92 rises, and when the gate potential rises to or above the gate threshold value, the IGBT 92 carries out a turning-on operation. As a result of the turning-on operation, no high voltage of a certain value or more is applied to the collector of the IGBT 92.
Also, the protection diode 83, in the same way as the protection diode 82 shown in FIG. 21, is configured of bidirectional diodes formed of a polysilicon layer formed on the insulating film 60. As the p-anode layers 21 and n-cathode layers 23 of the bidirectional diodes are all of a high impurity concentration, the bidirectional diodes are bidirectional Zener diodes. The protection diode 83 is formed by, for example, vapor phase diffusion.
Also, in, for example, Patent Document 1 below, there is proposed a semiconductor device wherein a protection diode is formed of bidirectional Zener diodes. In Patent Document 1 below, the bidirectional Zener diodes are configured of high impurity concentration p-anode layers and n-cathode layers with an impurity concentration lower than that of the p-anode layers.


An electric power transmission device as an aspect of the present invention includes a plurality of power transmitters configured to respectively generate magnetic fields. Phases of the respective magnetic fields are set such that the respective magnetic fields cancel out each other. The power transmitters sequentially shift frequencies of the respective magnetic fields to the same value at the same timing. A shift width of each of the frequencies for one-time shifting is limited by an upper limit value.

Contactless electric power transmission (contactless power supplying) from an electric power transmission device to an electric power reception device is becoming widespread. In the contactless power supplying, a power transmission circuit generates a radio frequency (high-frequency) current with a predetermined frequency. A power transmission coil is excited by the radio frequency current and power is transmitted through a magnetic field generated by the excitation. However, in the contactless power supplying, a magnetic field having leaked outside (leakage magnetic field) might interfere with broadcasting, wireless communication, and the like. Therefore, in the contactless power supplying, it is necessary to reduce a leakage magnetic field so as to satisfy a limit regarding an upper limit value of the leakage magnetic field, defined by the international standard, and the like.
Meanwhile, high-power supplying has been desired for charging a high-capacity battery of an electric vehicle (EV) and the like in a short period of time. When the contactless high-power supplying is performed, an amount of radio frequency current flowing through the coil increases, which inevitably causes the leakage magnetic field to increase. Thus, the development of a new technology for reducing the leakage magnetic field has been desired.

Electric power transmission device and electric power transmission system


The apparatus for removing particles in accordance with the present invention is for a processing device including a vacuum container unit having a plurality of chambers in which a predetermined process is performed on a wafer carried in by a conveyer unit in atmosphere. The apparatus comprises a charge neutralizing means for neutralizing charges generated on a surface of the wafer, the charge neutralizing means being mounted in a waiting-accommodation unit which constitutes a part of the conveyer unit, and a charging means for adsorbing particles in the vacuum container unit by electrostatic force, the charging means being mounted in the vacuum container unit.

1. Field of the Invention
The present invention generally relates to an apparatus for removing particles, and more specifically, to an apparatus for removing particles for a processing device including a vacuum container unit in which a predetermined process is performed on a wafer carried in by a conveyer unit. As the processing device to which the present invention is applied, there is a sputtering apparatus for manufacturing electronic devices such as a semiconductor integrated circuit and a liquid crystal panel.
2. Description of the Prior Art
As electronic devices such as a semiconductor integrated circuit and a liquid crystal display panel become larger in size and the processing technique thereof becomes more microscopic, particles such as dust in atmosphere and fine grains in the liquid chemical during the manufacturing process influence the characteristics or yield of electronic devices significantly. Due to this, elimination of particles is a very important factor. For example, in the semiconductor integrated circuit, the distance between metal wires formed on the circuit requires design rule of about 0.2 μm to 0.1 μm and the processing technique to be more microscopic. In such a microscopic circuit, since the sizes of particles are as large as or larger than the distance between metal wires, yield (ratio of source material to product) is degraded when particles are adhered to the wafer causing short circuits.
For example, in a sputtering apparatus used in the manufacturing process of semiconductor integrated circuits, inert gas ions are generated in a vacuum container of high vacuum level and impacted on a target using electric field generated by applying voltage between the target and a wafer. Atoms broken out of the target material by the impacts are deposited on the wafer to form predetermined thin films. During the formation of the thin films, some of the atoms broken out of the target material by the impact are deposited not only on the wafer but also on a jig for fixing the wafer or around the jig. The target materials deposited on the portions other than the wafer are separated by the stress of the film as the deposition grows, to float in the vacuum container as particles. Moreover, abrasions of the conveyer unit for the wafer mounted in the vacuum container and other movable parts cause the generation of particles. Particles adhered on the wafer itself and carried into the vacuum container also exist.
As shown in FIG. 7, a film-forming device in which particles are removed using electrostatic force is disclosed in Japanese Patent Unexamined Publication JP-A 6-252066 (1994). The film-forming device includes a vacuum container 41, a plate support 42 mounted in the vacuum container, a particle-collecting plate 43, a charging means 44 for charging the particle-collecting plate 43, and a charging bar 45 which constitutes a portion of the charging means. The film-forming device also includes an exhaust port 46, a reaction gas introduction line 47, a cleaning gas introduction line 48, a valve 49 and others (not shown).
In accordance with the film-forming device, the particle-collecting plate 43 composed of electric conductor material is conveyed into the vacuum container 41 and disposed on a predetermined position of the plate support 42. The charging bar 45 which constitutes a part of the charging means 44 is then unfolded to contact and charge the particle-collecting plate 43. At the same time, gas is introduced into the vacuum container 41 through the cleaning gas introduction line 48 which joins the reaction gas introduction line 47, so that the particles blown off by the gas is adsorbed on the charged particle-collecting plate 43 by electrostatic force. The particle-collecting plate 43 to which particles had adsorbed is then conveyed out of the vacuum container 41. The particles in the device are eliminated in above-described manner. Wafers for forming devices are then conveyed into the vacuum container 41 to be subjected to film formation processes.
However, in the film-forming device disclosed in Japanese Patent Unexamined Publication JP-A 6-252066 (1994), gas is injected to blow off particles, which diffuses particles into the entire vacuum container. Since the area of the charged particle-collecting plate is smaller compared to that of inner wall of the vacuum container, the elimination of the entire diffused particles using only the particle-collecting plate is not enough. Moreover, since the charging electrode contacts the particle-collecting plate for charging, the surface of the particle-collecting plate may be damaged due to scratches, resulting in generation of additional particles.
In addition, since a mechanism for moving the charging bar is mounted through the wall of the vacuum container, the means for charging the particle-collecting plate is complex and large, and requires high installation costs. Moreover, the operating costs get higher since expensive gas for assisting combustion is used for dry cleaning.
In addition, since the film-forming process must be stopped for a long time while the particle-collecting plate adsorbs particles, the rate of operation is reduced.


A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.

1. Field of Invention
The invention relates to a circuit board and, more particularly, to a circuit hoard with a telecommunication network connection port.
2. Related Art
With the development of the science and technology, the electronic device is developed toward integration and minimization. The size of the circuit board of the electronic device is reduced, and many function modules such as a circuit board module having a function of modem card should be integrated.
As shown in FIG. 1, taking a conventional motherboard 1 as example, the motherboard 1 includes a telecommunication network connection port 11, a modem card processing module 12 and a signal connection wire 13. The telecommunication network connection port 11 and the modem card processing module 12 are disposed at the surface of a circuit board 10. A telecommunication network plug (not shown) connected to the telecommunication network voltage (TNV) circuit may be inserted into the telecommunication network connection port 11. The signal connection wire 13 is electrically connected to the telecommunication network connection port 11 and the modem card processing module 12, and therefore, the modem card processing module 12 may communicate with the TNV circuit.
The circuit board 10 includes a plurality of conductive layers, and a plurality of signal lines are laid out at each conductive layer, respectively. The external signal connection wire 13 is connected to the telecommunication network connection port 11. The modem card processing module 12 may be fixed on a circuit board. Since the quality of the early modem card processing module 12 is unstable, the modem card processing module 12 is usually fixed on the circuit board in a locking mode to be repaired and replaced conveniently.
In addition, the TNV of each country is different, and some TNV is hazardous voltage whose peak value exceeds forty-two volts called high voltage signal instead of safety extra-low voltage. Some signals transmitted by the telecommunication network connection port 11 are high voltage signals. As a result, to prevent the signal connection wire 13 transmitting the high voltage signals from interfering with the low voltage signal line laid out on the circuit board, the signal connection wire 13 is coated with insulating material, and an iron core 14 is jacketed on the signal connection wire 13. The problem that the lines have electromagnetic radiation interference (EMI) because of the wiring passing the high speed line signal area and the high frequency noise coupled to the connection wire is solved. However, the wire and insulated material of the signal connection wire 13 and the iron core 14 increase the manufacture cost of the circuit board 10. The modem card processing module 12 is fixed it the motherboard in a locking mode, which also costs the manufacture cost.


A front wheel suspension for motor vehicles is constructed such that an upper link is so connected at one single end thereof to a connecting member as to provide an arrangement wherein loading a wheel support member in the lateral direction with respect to the normal forward driving direction of the motor vehicle induces a reaction force along a link axis of the upper link without inducing any substantial amount of moment about a king pin axis.

The present invention relates to wheel suspensions for front wheels of motor vehicles.
A conventional front wheel suspension for motor vehicles is disclosed, for example, in JP-A 5-178041. This front wheel suspension comprises a support member rotatably supporting to a front wheel and having an upper portion and a lower portion, a lower link swingably supported by a vehicle body and pivotally supporting the support member at the lower portion thereof, a connecting member mounted to the upper portion of the support member for rotation about an axis thereof, a shock absorber operatively connected between the vehicle body and the connecting member, an upper link swingably supported by the vehicle body and connected to the connecting member, and a tie rod operatively connected to the support member to rotate the support member about a king pin axis aligned with the axis of rotation of the connecting member. The upper link has an end having two branches and pivotally mounted to the connecting member at two point thereof. Due to such construction, the front wheel suspension presents not only a merit of the strut type, but that of the double wishbone type.
As for the above conventional front wheel suspension, however, the upper link and the connecting member are connected to each other at two points to enable relative rotation about a connecting shaft extending in the longitudinal direction of the motor vehicle, so that, when mounting the upper link to the connecting member, two resilient bushes or joints which are rotatable only about their respective axes such as a ball joint are needed, resulting in a unsolved problem of increased weight and cost. Moreover, due to a need to dispose two joints in the longitudinal direction of the motor vehicle, or dispose to the shaft extending in the longitudinal direction of the motor vehicle a joint which is generally axially long, and rotatable only thereabout, the front wheel suspension has large longitudinal length, resulting in a unsolved problem of less degree of freedom of layout in view of interference with a tire/wheel upon turning thereof.
Such unsolved problems can be solved by connecting the upper link and the connecting member at one point. As for such simple one-point connection of the upper link and the connecting merrier, however, when the tire undergoes a lateral force upon turning of the motor vehicle, etc., the connecting member is rotated about the connecting shaft with a wheel support member, making very difficult a balance of the camber rigidity and the lateral rigidity, resulting in a possible occurrence of a mounting problem.
It is, therefore, an object of the present invention to provide wheel suspensions for front wheels of motor vehicles which ensure appropriate maintaining of a balance of the camber rigidity and the lateral rigidity.


A transmission apparatus includes an input shaft; an output shaft; a ring gear having internal ring gear teeth and having a ring gear central axis; a ring gear constraining structure constraining the ring gear to move translationally along a substantially circular path about the input shaft rotational axis without rotating about its own central axis relative to the apparatus; a mechanism for continuously changing the distance between the ring gear central axis and the input shaft rotational axis; a pinion gear having a diameter smaller than the inner diameter of the ring gear and retained with the ring gear so that its rotational axis is parallel with the ring gear central axis; and held in engagement with the ring gear teeth by a pinion gear constraining structure rotationally connected to an apparatus output shaft; where each time the input shaft rotates one revolution, the ring gear constraint structure moves the ring gear one revolution translationally along the circular path around the input shaft rotational axis, and the distance between the input shaft rotational axis and the ring gear central axis defines the diameter of the circular path over which the pinion gear travels during a single input shaft revolution, and thus defines the distance over which the pinion gear rolls for each revolution.

1. Field of the Invention
The present invention relates generally to the field of mechanisms for transmitting rotational energy and torque from one mechanical element to another. More specifically the present invention relates to a transmission apparatus for transmitting rotational energy from an input shaft to an output shaft at gear ratios, or in more general terms at rotational ratios, which are variable between a maximum forward ratio and a maximum rearward ratio continuously at any of an infinite number of intermediate ratios.
The apparatus includes a ring gear having internal ring gear teeth and having a central axis. The ring gear is constrained with ring gear constraining means to move translationally along a lateral circular path about an input shaft rotational axis, without rotating about its own central axis relative to the apparatus; means for continuously changing the distance between the ring gear central axis and the input shaft rotational axis; a pinion gear having a diameter smaller than the inner diameter of the ring gear and retained with the ring gear such that its rotational axis is parallel with the ring gear central axis and held in engagement with the ring gear teeth by pinion gear constraining means connected to an apparatus output shaft by gear train means to transmit torque and rotational movement to the output shaft.
2. Description of the Prior Art
There have long been transmissions for transmitting torque from an input shaft to an output shaft and for altering the number of revolutions made by the output shaft for every revolution of the input shaft. Examples of these prior transmissions are found in automobiles and plant machinery. A problem with them is that most alter the rotational ratios incrementally, by disengaging the input shaft momentarily to permit shifting a new gear into the chain. This shifting causes discontinuous acceleration and requires either complex and expensive automatic shifting mechanisms or human monitoring and control. Furthermore, the clutches wear out much faster than the transmission as a whole, making frequent shut-downs and servicing necessary.
Continuously variable transmissions have been constructed, but with decided disadvantages. An example is a rotating disk having a radially mounted engaging wheel which slides along the disk to varying radial points for different disk/wheel rotational ratios. This transmission is used in some lawn mowers, and has proven inefficient and subject to frequent failure. Others have involved complicated fluid pump braking systems, and can be heavier, bulkier and more expensive to manufacture than conventional, shifting transmissions.
Prior art references for transmissions generally which are known to the applicant include: German U.S. Pat. No. 3,532,736, having an output on sliding blocks; Irvin, U.S. Pat. No. 5,099,706, having a rack and pinion drive transmission; France U.S. Pat. No. 1,251,574, having an eccentric planetary drive; Koser U.S. Pat. No. 4,497,221, varying the radius of the chain ring so as to vary the ratio; Pires U.S. Pat. No. 5,108,352, having an eccentric planetary transmission with a counterbalance means and sliding blocks; and Rhodes U.S. Pat. No. 1,701,823, having a CVT using centrifugal force to change ratio, and having a rotating ring gear.
It is thus an object of the present invention to provide a transmission which provides clutch-free, continuously variable transmission of torque.
It is another object of the present invention to provide such a transmission which is simple in design, having only a few operating parts, and is reliable and inexpensive to build.
It is still another object of the present invention to provide such a transmission which can be serviced easily and by minimally skilled personnel.
It is finally an object of the present invention to provide such a transmission which occupies less space than most automatic transmissions in use today.

Continuously variable gearing transmission


A delay compensation circuit responds to a sensed change in operating temperature of a CMOS integrated circuit (IC) by appropriately adjusting the IC's power supply voltage so as to prevent the temperature change from affecting IC signal path delays. The delay compensation circuit senses the temperature change by monitoring a temperature sensitive voltage across a diode included in the IC and generates the power supply voltage as an appropriately adjusted linear function of the diode voltage.

1. Field of the Invention
The present invention relates in general to integrated circuits and particular to a system for compensating for temperature induced delay variation in an integrated circuit.
2. Description of Related Art
A typical integrated circuit (IC) tester includes a set of pin electronics circuits, one for carrying out test activities at each terminal of a device under test (DUT). The test activities include sending test signals to the terminals and sampling DUT output signals produced at the terminals. Each pin electronics circuit carries out its test activities in response to timing signals produced by a timing signal generator. Each timing signal controls a separate test action, the pin electronics circuit carrying out the action in response to the timing signal's edges. An IC test is organized into a succession of test cycles during which test activities are carried out at the DUT terminals. The timing signal generator produces each timing signal edge in response to a pulse of a reference clock signal with a programmable delay indicated by an input pattern vector (data value) produced by a pattern generator at the start of each test cycle.
For example, in order for the tester to send a test signal edge to the DUT terminal 1 nanosecond after some particular reference clock signal pulse, the pattern vector must indicate the correct clock signal pulse and must indicate the desired 1 nanosecond delay. However the timing circuit does not wait the entire 1 nanosecond to initiate the timing signal pulse. Since transistor drivers in the signal path of the timing circuit between its clock signal input and its timing signal output must switch on or off when responding to the clock signal, the timing circuit has a fixed inherent signal path delay in addition to its programmable delay. Also transistor logic stages in the signal path of the pin electronics circuit between its input timing signal and its output test signal also have an inherent switching delay. Thus in order for the test signal edge to occur five nanoseconds after the selected reference clock signal edge, the programmable delay of the timing signal generator must calibrated to a value that is slightly less than five nanoseconds to account for the inherent delay of the timing generator as well as the inherent delay of the pin electronics circuit.
Once the timing signal generator is properly calibrated, the inherent signal path delays of timing signal generator and the pin electronics circuit should remain constant during the test. However these inherent signal path delays can change substantially with the temperature of the integrated circuits implementing the timing signal generator and the pin electronics circuit, particularly when they are CMOS integrated circuits.
Some prior art systems avoid temperature induced delay variations in an IC by using feedback control to keep the IC at a constant temperature. In such systems, a controller senses the temperature of an IC and supplies power to a heater which may be attached to the IC or formed by transistors within the IC itself. When the sensed temperature increases above a desired set point, the controller reduces or turns off the heater power. When the sensed temperature decreases below the set point, the controller increases or turns on the heater power. Some of these systems sense IC temperature by sensing the voltage across a temperature sensitive resistor formed on the IC. Other systems sense temperature by sensing the temperature dependent frequency of oscillation of a ring oscillator formed on the IC or by sensing the temperature dependent signal transit time of a signal traveling through a reference delay circuit formed on the IC. These temperature controlling systems are expensive because IC heaters are expensive. Also, since they cause an IC to operate at a relatively high constant temperature, they can reduce the operating life of the IC.
Other feedback control systems do not try to directly control IC temperature but instead monitor switching speed of the transistors forming the signal path within the IC and control that switching speed by controlling the power supply to those transistors. A transistor's switching speed varies with its power supply voltage. For example, some of these systems sense the frequency of a ring oscillator formed on the IC and adjust the IC power supply to maintain the ring oscillator frequency at a desired level. If the transistors forming the ring oscillator are similar to the transistors forming the signal path and share the same power supply, then by holding the ring oscillator frequency constant despite changes in IC temperature, the signal path delay is also held constant. While such systems do not require that the IC operate at high temperatures, they employ relatively complicated ring oscillators and/or reference delay circuits on the IC which increase the cost and difficulty of IC design and fabrication. Such systems also require the use of relatively complicated phase lock loop controllers which further add to system cost.
Thus although the prior art delay compensation systems work reasonably well, they are expensive to implement. What is needed is an inexpensive and easy to implement system for compensating for temperature induced delay variation in an IC.

System for compensating for temperature induced delay variation in an integrated circuit


A ripper tooth for use mounted on an excavation tool having a tool body mounted for rotation on an excavation machine arm, the ripper tooth being mounted to the tool body for ripping engagement with a substrate. The ripper tooth has first and at least second portions, each with a tip disposed for ripping engagement with the substrate. The first and second portions are laterally spaced apart generally along the axis of rotation of the tool relative to the arm, and the first and second portions are angularly spaced apart generally in a direction of substrate ripping motion. The first portion is disposed on a first axis and the second portion is disposed on a second axis, the first and second axes being different. Ripper excavation tools with one or more ripper teeth of the disclosure mounted to the tool body are also described.

Excavation tools of the types described herein are typically mounted to conventional excavators of the type having a backhoe. The backhoe includes a dipper stick, and the tool is mounted on the outboard end of the dipper stick. The tools are employed for excavation of difficult-to-excavate intermediate substrate, e.g. substrate between the category of loose soil or loose gravel and the category of solid rock. Intermediate substrate requires special tools to be excavated efficiently. Loose soil or gravel can be excavated with a conventional bucket, but a conventional bucket is generally not effective in intermediate substrate. Solid rock excavation generally requires a hydraulic hammer, a rock trencher or blasting, but these methods are not efficient for excavating intermediate substrate. Attempts have been made to develop tools that are effective and efficient in excavating intermediate substrate. Simply stated, there have been several general approaches, e.g., the single tooth approach; the added articulated tooth approach, in which a tooth is positioned behind the bucket; and the multi-tooth bucket approach, where several teeth are mounted on the back side of the bucket, e.g. as described in Arnold U.S. Pat. No. 4,279,085 and Arnold U.S. Pat. No. 4,457,085, or with several teeth mounted along the leading edge of a bucket, the tooth tips in straight line, e.g. as described in Hemphill U.S. Pat. No. 4,037,337, the complete disclosures of all of which are incorporated herein by reference. Each of these approaches has been found to have drawbacks, and none is particularly efficient or effective for excavation of intermediate substrate. In particular, a single tiger or single spike tooth is considered effective for ripping rock because it focuses the force on one concentrated point, thus creating a high pressure to break rock easily. However, the single tiger tooth wears very quickly and must be replaced after a relatively short period of time. The single tiger tooth is also ineffective for ripping the sides of a trench because of the location of the tip. The conventional twin tiger tooth is not as effective for ripping because it tends to share the load over two points; however, it appears to last relatively longer due to the sharing of the pressure between both tips. Also, when the twin tiger tooth is used on the outside corners or edges of a bucket, they allow easier ripping of the trench side wall because on the right side of the bucket, the right tip rips the right side wall, and on the left side of the bucket, the left tip rips the left side wall. In contrast, with a single tiger tooth used on the outside corner of a bucket, the side of the tooth rubs on the side wall and the ripping effect is lessened.


This invention provides a data transmission method and a data receiving method which enable audio data to be multiplexed into video data and be transmitted using a DVI standard cable or the like satisfactorily with a simple configuration.

In recent years, a standard referred to as DVI standard has been established for transmitting video data to a video display device in a format of digital data when a video signal source such as a television tuner, a video player or a personal computer device body, and a video display device such as a monitor receiver are connected.
Details of the DVI standard will be given in following descriptions of embodiments while, to be brief, the DVI standard allows video data to be transmitted to the display device by digitizing primary color signals R, G and B in pixel units, respectively, thereby transmitting and displaying high-definition images. In addition, as the video data in pixel units are transmitted, a display driver can be directly driven by the received video data on the display device side, thereby realizing display or the like with a relatively simple processing configuration.
Data transmitted through a cable that is defined by the DVI standard are fundamentally only video data, and thus when considering that audio data are transmitted at the same time, the display device and an audio output device such as a tuner must be connected through an audio cable, which is different from the cable defined by the DVI standard.
However, when the display device and the signal sources are connected through plural cables, the connection configuration is adversely complicated.
More specifically, when considering a configuration of the system that transmits only video data, for example a video signal source 701 and a display device 703 are connected through a DVI standard cable 702 as shown in FIG. 7, and video data which are coded according to the DVI standard are transmitted through the cable 702, whereby the video data can be transmitted from the video signal source 701 to the display device 703. On the other hand, when video data and audio data are transmitted from a video/audio signal source 801 to a display device with speaker 804 as shown in FIG. 8, the signal source and the speaker display must be connected so that the video data are transmitted by a DVI standard cable 802 and the audio data are transmitted by an audio signal cable 803 that is different from the cable 802. When the video/audio signal source 801 and the display device 804 are connected as shown in FIG. 8, video that is outputted from the signal source 801 can be displayed on the display device 804, and sounds can be outputted from speakers 805L and 805R which are mounted on the display device 804.
However, when video data and audio data are transmitted using different cables as shown in FIG. 8, the connection configuration is complicated correspondingly. It is preferable that the devices are connected through as few cables as possible.
The technology for multiplexing video and audio data, and transmitting multiplexed data through one cable can be realized by adopting a data transmission technique that employs for example a bus line which is standardized as IEEE (The Institute of Electrical and Electronics Engineers) 1394 system. However, quite complicated data processing is required to transmit data through the bus line according to this IEEE 1394 system, and accordingly a quite large circuit construction is needed as a configuration for an encoding process to transmit data on the transmitting end, or a configuration for decoding data that are received through the bus line on a receiving end, resulting in a high cost. Further, in the IEEE 1394 system, the video data and audio data are compressively coded and multiplexed in view of a transmission rate and the like, and thus the image quality is inferior to that in the case where video data digitized in pixel units are transmitted according to the above-mentioned DVI standard.
In addition, when the digitized audio data are to be transmitted together, a video clock and an audio clock must be transmitted simultaneously, so that signal lines for the transmission are needed, and jitter is unfavorably increased because the high-speed signals are transmitted.
The present invention is made to solve the above-mentioned problems, and this invention has for its object to provide a data transmission method and a data receiving method by which audio data can be transmitted easily and satisfactorily using an existing interface through which video data are transmitted.

Data transmitting method, data receiving method, data transmitting device, and data receiving device

Abstract: From a data transmitting end, a superimposed video/audio data signal in which audio data are superimposed over a video blanking interval of video data in superimposition timing that is generated using a video blank sync signal and a pixel clock, are transmitted to a data receiving end through the DVI cable, together with the video blank sync signal and the pixel clock. On the data receiving end, a timing signal for extracting the audio data from the superimposed video/audio data signal is generated using the transmitted video blank sync signal and pixel clock, and the superimposed video/audio data signal is separated into video data and audio data using the generated timing signal, as well as the digital audio data are converted into an analog audio signal using an audio clock that is generated by dividing the frequency of the pixel clock.

Matsushita Electric Industrial Co., Ltd.


Disclosed are matrices, devices and methods for the manufacture of live autogenous skeletal replacement parts comprising plural different tissues.

This invention relates to a method of in situ manufacture of live autogenous replacement body parts such as skeletal parts, e.g. joints. More particularly, the invention is concerned with matrix materials and methods for the manufacture of live autogenous replacement parts comprising plural different tissues.
Bony defects, whether from degenerative, traumatic or cancerous etiologies, pose a formidable challenge to the reconstructive surgeon Although many types of bone grafts and numerous biocompatible materials have been used clinically they all suffer from shortcomings or potential long term complications See, for example, Urist, "Bone Transplants and Implants" in Fundamental and Clinical Bone Physiology, Chapter 11, Lippincott, Philadelphia, Pa., 1980 pp. 331-368; Habal and Reddi, "An Update on Bone Grafting and Bone Substitutes in Reconstructive Surgery" in Advances in Plastic and Reconstructive Surgery, Year Book Medical Publishers, Chicago, Ill., 1987, pp. 147-209.
More difficult still is the reconstruction or repair of skeletal parts comprising multiple different structural tissues. For example, joint reconstruction requires repair of both the bony defect and the articular cartilage. To date there are no satisfactory clinical means for readily repairing both cartilage and bony defects within a joint, and which result in viable, fully functional joints. Replacement with prosthetic joints is currently the only option for serious degeneration of joint function. It is anticipated that a means for functional reconstruction of joint complexes will have a profound effect on the management of degenerative joint disease and alloplastic joint replacement surgery.
True osteogenic factors capable of inducing the cascade of events that result in endochondral bone formation now have been identified, isolated and cloned. These proteins, when implanted in a mammal, typically in association with a matrix that allows the attachment, proliferation and differentiation of migratory progenitor cells, are capable of inducing recruitment of progenitor cells, stimulating their proliferation and inducing differentiation into chondrocytes and osteoblasts, and inducing differentiation of cartilage, vascular invasion, bone formation, remodeling, and finally marrow differention. More recently, these factors have been shown capable of generation of tissue of mesenchynal origin more generally, including liver and nerve tissue.
A particularly useful osteogenic protein is human OP1 (Osteogenic Protein-1), described in U.S. Pat. No. 5,011,691, U.S. Pat. No. 5,266,683 the disclosures of which are incorporated by reference and Ozkaynak et al. (1990) EMBO J. 9: 2085-2093. Species homologs identified to date include mouse OP-1 (see U.S. Pat. No. 5,266,683) and the Xenopus homolog 60A, described in Wharton et al. (1991) PNAS 88:9214-9218). Other closely related proteins include OP2 (Ozkaynak (1992) J. Biol. Chem. 267:25220-25227 and U.S. Pat. No. 5,266,683), BMP5, and 6 (Celeste et al. (1991) PNAS 87:9843-9847) and Vgr-1 (Lyons et al. (1989). These disclosures disclose the sequences and chemical and physical characteristics of these proteins. U.S. Pat. Nos. 5,011,691 and 5,266,683 also provide detailed descriptions for formulating and assaying osteoinductive devices useful for inducing bone formation in mammals. Other related osteoinductive proteins include BMP 2, 3, 4 (Wozney et al. (1988) Science 242:1528-1534); BMP 9 (WO93/00432, published Jan. 7, 1993); DPP (Padgett et al. (1987) Nature 325:81-84, and Vg-1 (Weeks (1987, Cell 51:861-867).
It is an object of the instant invention to provide a matrix suitable for regenerating body parts comprising two or more functionally and structurally associated different replacement tissues in an animal. It is another object to provide devices and methods for the reconstruction of viable, functional body parts comprising plural tissues, e.g., organs such as liver or joints comprising new bone and articular/cartilage.

Matrix for the manufacture of autogenous replacement body parts


A carton includes a pivoting recloseable lid that is easy to open and recluse. The recloseable lid includes a breachable closure aperture section that can be adapted to receive a portion of a bag or other flexible container accommodated within the carton. When the lid is opened, the contents of the flexible container can be dispensed.

Conventional dispensing cartons are known. Such cartons often include a bag or other flexible container accommodated within the interior of the carton. The bag may be used to store foodstuffs or other dispensable products. Conventional cartons, however, may be difficult to open, may not close reliably, and may not adequately seal a bag or other flexible container contained within the carton.


The invention relates to a method of manufacturing a rotor for an electric machine, wherein the rotor is composed of at least one electric sheet wherein at least one electric sheet is thermally treated regionally to directly modify its magnetic permeability in the treated region.

The rotor of an electric machine is produced from magnetically conductive sheet metal, also called electric sheet, in a conventional machine design. The magnetic permeability of the sheet metal is considered as homogeneous with the exception of stamping effects and laser cuts at edges of the laminations. However, stray fluxes, i.e. unwanted flux components during the operation of the machine, cannot always be avoided since the metal sheets also have to satisfy mechanical demands. The occurrence of these stray fluxes is unwanted independently of the actual machine type, i.e. independently of whether the rotor is intended for a synchronous machine, reluctance synchronous machines or an asynchronous machine.
Reluctance synchronous machines are used due to their high robustness and due to the high efficiency in particular at high speeds. Since webs for the mechanical stabilization of the rotor are taken into account in reluctance synchronous machines, substantial magnetic stray fluxes arise here. The magnetic conductivity of the rotor is maximized to maximize the magnetic exploitation of the iron material and to minimize the power excitation. This has the result that the webs equally represent good magnetic conductors. The webs are typically minimized down to the mechanical load limit to reduce this magnetically unwanted effect. Further improvements are currently not possible.
First approaches in research projects pursue explicit damage to the material by laser cutting, which is in particular expensive in mass production and which signifies a high time effort. It is therefore desirable to identify alternative methods of rotor production that do not require a laser cutting.
In a similar manner to the reluctance machine, subharmonic field components also arise in synchronous machines having concentrated windings such a with a 12 slot/10 pole machine due to the magnetomotive force (MMF) distribution. Said subharmonic field components generate high losses in the rotor due to the high penetration depth in the material at a low frequency. The magnetic losses are specifically decisively determined hereby. To avoid losses, flux barriers can be worked into the rotor that substantially reduce the subharmonic field components. A method of segmenting and reducing subharmonic field components is already known from DE 10 2008 054 284 A1.
Unwanted stray fluxes can likewise occur with specific rotor geometries for asynchronous machines, in particular with designs in which the required conductors are received by rotor slots. With machines of smaller power classes, the introduction of the conductors frequently takes place using injection molding processes with aluminum or copper, with closed rotor slots being preferred for this purpose to simplify the injection molding process. In addition, a closed rotor slot increases the mechanical strength that is in particular required for machines of high speeds such as spindle drives or cutters. A closed rotor slot, however, also disadvantageously increases the stray flux of the field in an electromechanical manner in comparison with open rotor slots, in particular by the resulting web that the closed slot forms. The breakdown torque of the asynchronous machine is disadvantageously reduced by the stray flux. If a closed rotor slot is necessary due to the mechanical or technical production demands, the stray flux path can initially not be influenced by design interventions.
A method of thermally treating a permanent magnet rotor is known from U.S. Pat. No. 5,684,352. In this respect, regions around the rotor shaft should be directly demagnetized to optimize the torque behavior of the machine. After the thermal heating, the total lamination is cooled in water so that an austenite lattice is formed.
A similar method is known from WO 2008/006719 A1 that thermally treats regions of the laminations around the rotor shaft specifically. The aim of this method is the use of magnetically conductive rotor shafts.
A further method is known from WO 2014/125104 that likewise proposes a thermal treatment of a rotor laminated stack.
The underlying object of the invention comprises identifying a suitable manufacturing method that is suitable to reduce the disadvantageous stray flux effects during the machine operation.
This object is achieved by a method of manufacturing a rotor for an electric machine, wherein the rotor is composed of at least one electric sheet and at least one electric sheet is thermally treated regionally to directly modify its magnetic permeability in the treated region, and wherein rotor sections adjacent to the treated region are cooled during the thermal treatment. The method in accordance with the invention now provides that a rotor produced from at least one electric sheet is thermally treated in regions to directly modify the magnetic permeability of the electric sheet in the treated region. The saturation field strength for this region is in particular also thereby considerably reduced.
The unwanted occurrence of stray fluxes in these regions can be reduced or even prevented by the direct modification of the magnetic conductivity of the electric sheet at the relevant points of the metal sheet. The machine operation can thereby be optimized overall, which is shown, for example, by an increase in the efficiency of the machine, i.e. by an increase in the resulting torque with a constant power consumption or a reduction in the current with a constant torque.
The rotor is typically stamped from an electric sheet, with individual laminations subsequently preferably being stacked in the axial direction.
Depending on the rotor type, the desired rotor geometry is prepared by the production of cut-outs, for example in the form of flux barriers or slots, in particular by stamping. In the resulting rotor geometry, webs or slots are created in the region of the flux barriers that result in unwanted stray paths due to the magnetic conductivity of the electric sheet. The direct thermal treatment of these formed webs can decisively disturb the arising stray effects.
The torque development of a machine decisively depends, for example, on the machine flux and the stray fluxes within the machine. In reluctance synchronous machines, a stray flux path arises due to the rotor configuration over webs in the flux barrier region that are, however, required for the mechanical stabilization of the rotor. Since these webs likewise comprise the soft magnetic material due to the stamping procedure, they are characterized by good magnetic conductivity so that the disadvantageous stray flux paths extend over the webs. These scatter paths are effectively disturbed by the reduction of the magnetic permeability in the web region. The required magnetic permeability can be efficiently achieved by a punctiform or regional thermal treatment of the webs.
The same applies with a rotor geometry for asynchronous machines in which closed slots are used for the reception of the conductor bars. The closed slots of the rotor geometry likewise form corresponding webs of the soft magnetic material at the rotor periphery that previously led to the unwanted stray flux paths. The effect of the stray fluxes can be reduced by a direct treatment of these formed webs at the rotor periphery so that the motor operation can be optimized in total.
Subharmonic field components that effect high losses in the rotor due to the high penetration depth in the material at a low frequency also arise in synchronous machines due to the magnetomotive force distribution. These effects can also be effectively combated and minimized by a direct thermal treatment of the used electric sheet at predefined points.
The modification of the magnetic permeability is achieved by a thermally induced change of the crystal structure of the electric sheet used. A transition from a crystal structure having higher magnetic conductivity into a crystal structure having smaller conductivity is preferably enforced by a controlled heat effect on the region to be treated. The structure is transitioned into a modified crystal lattice in accordance with the iron-carbon diagram by a subsequent cooling, in particular by running through a thermal process, of the treated lamination. The region to be treated is preferably greatly heated over a predefined period to time and is subsequently quenched, in particular while observing the critical cooling rate.
Water, to which corresponding additives may optionally be admixed that change the surface tension of the water, inter alia serves the cooling or passing through of the thermal profile. Oil, a salt bath, aqueous polymer solutions (e.g. polyvinylpyrrolidone), air or gases, e.g. nitrogen or argon, are conceivable as further quenching media.
The desired magnetic properties are preferably achieved when the rotor region to be treated is heated to at least 900°, preferably at least 1000°, ideally to a temperature range between 900° and 1100°, to convert the crystalline structure of the electric sheet into an austenite lattice. The temperature range is dependent on the alloy used for the electric sheet. The temperature range given is optimized for Si steel (i.e., silicon steel).
To avoid damage to the remaining rotor structure, adjacent rotor sections whose permeability should not be modified are cooled during the thermal treatment in accordance with the invention.
The invention furthermore relates to a rotor for an electric machine, in particular to a synchronous machine, a synchronous reluctance machine or an asynchronous machine, wherein the rotor consists of at least one electric sheet that is characterized by a different magnetic permeability in specific regions; webs of the rotor geometry that are formed are in particular characterized by a differing permeability, in particular a smaller permeability. The rotor in accordance with the invention is ideally manufactured in accordance with the method in accordance with the invention or in accordance with an advantageous embodiment of the method such that the same advantages and properties result for the rotor as for the method in accordance with the invention.
In addition to the rotor, the present invention additionally relates to an electric machine, in particular to a synchronous machine, a synchronous reluctance machine or an asynchronous machine having a rotor in accordance with the present invention. Due to the dependency on the rotor in accordance with the invention, it is obvious that the above-discussed advantages and properties of the rotor or of the method apply without restriction to the behavior of the electric machine so that a description is omitted to avoid repetition. By a differing, in particular smaller permeability. The rotor in accordance with the invention is ideally manufactured in accordance with the method in accordance with the invention or in accordance with an advantageous embodiment of the method such that the same advantages and properties result for the rotor as for the method in accordance with the invention.
In addition to the rotor, the present invention additionally relates to an electric machine, in particular to a synchronous machine, a synchronous reluctance machine or an asynchronous machine having a rotor in accordance with the present invention. Due to the dependency on the rotor in accordance with the invention, it is obvious that the above-discussed advantages and properties of the rotor or of the method apply without restriction to the behavior of the electric machine so that a description is omitted to avoid repetition.
Further advantages and properties of the invention will be described in more detail in the following with reference to a plurality of drawings.

Method of manufacturing a rotor and electric machine

RHEINISCH-WESTFÄLISCHE TECHNISCHE HOCHSCHULE (RWTH) AACHEN


Novel polyester compositions, particularly suitable for the insulation of wires, contain an aromatic polyester, especially polybutylene terephthalate. The presence of certain tin (II) compounds, for example tin (II) oxide, oxalate, phthalate, pyromellitate, or phosphite, reduces the flammability and smoke generation of such compositions. The presence of an aliphatic polyester, and optionally a thermoplastic elastomer, can also improve the properties of such compositions.

1. Field of the Invention
This invention relates to polyester compositions.
2. Introduction to the Invention
Many polyester compositions are known, including compositions which can be melt-shaped, e.g. melt-extruded around a conductor to provide an insulating coating. The physical and electrical properties of such polyester compositions are of course very important, and, for many uses, include flammability and smoke generation when burned. A great variety of polyester compositions have, therefore, been used or proposed for use, particularly as insulating coatings on wires. Reference may be made for example to U.S. Pat. Nos. 2,167,278, 3,671,487, 3,835,089, 4,048,128, and 4,332,855 and the United States Patents cited as references on page 1 thereof; copending, commonly assigned U.S. patent application Ser. No. 07/537,558, filed Jun. 13, 1990 (MP1360); European Patent Publication No. 0057415; and Japanese Patent Document Nos. 099256 (December/1971), 7199256 (February/1985), 7199257 (February/1985) and 210446 (May/1986). The entire disclosure of each of said patents, application and patent documents is incorporated by reference herein for all purposes.


An image capturing apparatus for capturing an image of a subject; has: an image pick-up unit for acquiring the image; and a noise reduction unit which removes a frequency component of a color difference signal of the image corresponding to a frequency component of a luminance signal based on the frequency component of the luminance signal of the image.

1. Field of the Invention
The present invention relates to an image capturing apparatus. More particularly, the present invention relates to an image capturing apparatus for processing a captured image.
2. Description of the Related Art
An image capturing apparatus that performs image processing for reducing the noise of a captured image. As an example of an image capturing apparatus, there is a digital electronic still camera disclosed in Japanese Patent Application laid-open No. 6-6748. The digital electronic still camera applies discrete-cosine-transformation (DCT) to a luminance signal of an image signal Y and color difference signals Cr and Cb, and divides the components, to which the DCT is applied, by the value of a quantization table. The digital electronic still camera then compresses the data of the obtained quotient by encoding the obtained quotient and stores the compressed data to a recording medium. This digital electronic still camera usually uses one of the quantization table for normal use and the table for adjusting visibility, which is used for the frequency bands in which there are many noises, according to the necessity.
However, it was difficult for the conventional image capturing apparatus to perform image processing by distinguishing the edge of an image and the noise of an image. For example, the edge of an image may be reduced when the noise of an image is reduced.

Noise reduction in image capturing apparatus


A driving circuit is provided to reduce threshold voltage shifting of a driving switch thereof, and includes a capacitor, a pre-charging switch, a scanning switch, a driving switch, three stabilizing switches, and a light emitting device. A gate electrode of the pre-charging switch receives a first control signal, a drain electrode thereof receives a second control signal, and a source electrode thereof is connected to the capacitor, so as to pre-charge the capacitor to switch on the driving switch. The capacitor then discharges through the driving switch. When the driving circuit reaches a stable state, the driving switch drives the light emitting device to emit light.

Field of the Invention
The present invention relates to the field of display technology, and more particularly to a driving circuit for a display panel and a liquid crystal display device using the same.
Description of the Related Art
As a new generation display technology, Active Matrix Organic Light Emitting Diode (AMOLED) display panels have the advantages of low power consumption, a wide color gamut, high brightness, high resolution, etc., thereby being favored by the market. However, since the emission of AMOLED is driven with an electric current flowing from a transistor operated in saturation, the use of AMOLED has faced many problems including:
Organic light emitting diodes (OLED) have an aging problem. Since most of the conventional technologies use DC driving, holes and electrons are fixed in moving directions, they are respectively injected into an emission layer from an anode and cathode to form excitons through recombination, and eventually resulting in light emission. Redundant holes (or electrons) that were not involved in the recombination process may accumulate at a junction between a hole transport layer and the emission layer (or between the emission layer and an electron transport layer), or may pass through a potential energy barrier and then enter the electrodes. As the work time of the OLEDs extends, those un-recombined charge carriers which have accumulated at the junction will form a built-in electric field inside the OLEDs, and thereby result in a continuous increase in threshold voltage of each one of those light emitting diodes, thereby lowering their brightness, and also gradually reducing the energy utilization efficiency.
In a low-temperature poly-silicon (LTPS) technology, known as the mainstream manufacturing technology for OLEDs, there is a lack of uniformity in the threshold voltage of the transistors manufactured by the LTPS technology. Therefore, when the same gray-scale voltages are inputted to the transistors, different threshold voltages will generate different driving currents, and lead to inconsistency of electric current.
For example, with reference to FIG. 1, FIG. 1 shows a conventional 2T1C (two transistor, one capacitor) AMOLED driving circuit design, wherein member 11 is a thin-film transistor which is a scanning switch for controlling a capacitor 10; member 12 is an OLED driving transistor that is used to drive an OLED; the capacitor 10 is used to store the gray-scale voltage of a data signal, so as to control the driving current of transistor 12 to the OLED. In the circuit diagram, "Gate n" means the scanning signal from the n-th scanning line, "Data n" means the data signal from the n-th data line, and "Vdd" means the driving signal of the OLED. Due to the aforementioned aging problem of OLEDs and uniformity problems which occur in the LTPS manufacturing process, the threshold voltage Vth of the transistor in this conventional 2T1C driving circuit is shifted, thereby causing unstable gray-scale performance of the OLED and worse uniformity of the driven images.

Driving circuit for a display panel and liquid crystal display device using the same

Shenzhen Chine Star Optoelectronics Technology Co., Ltd.


An adapter device for mounting a pivoting label holder on a merchandise display hook originally designed for fixed label holders and having a label support arm formed with a laterally extending label support portion at the outer end thereof. The adapter device includes a plastic body for mounting on the shaft of the merchandise display hook and has a cross bar aligned perpendicular to the label support arm, for the support of a pivoting label holder. The cross bar can comprise a cross bar portion extending laterally from the adapter body in a direction opposite to and coaxial with the laterally extending label support portion of the label support arm, thereby forming a combined support for the pivoting label holder. A forwardly-open stabilizing element engages the label support portion to prevent the adapter from pivoting about the shaft. Alternatively, the adapter device can include an integral full-width cross bar for mounting the pivoting label holder, with elements for stabilizing and positively locating the adapter.

Merchandise display hooks typically have a merchandise support arm and often have a label support arm extending forwardly above the merchandise support arm for supporting price and item information, and the like. The information can be displayed on a label holder which is fixed to the outer end of the label support arm, or the label holder can be pivotally attached to the end of the label holder support arm. For pivotal mounting of the label holder the support can be provided with a cross bar which extends laterally on either side of the shaft of the label support arm and provides the desired pivotal support.
Pivoting label holders typically include one or more rearwardly-extending retaining clip portions, which can be cylindrical in shape, and which are configured to be loosely pivotally mounted on the cross bar. The pivoting label holders are typically formed by extrusion of suitable plastic material and include a notch in the retaining clip portion to accommodate the shaft of the label support arm. Thus, the retaining clip portion attaches to the cross bar on either side of the shaft of the label support arm, and the opening or gap between the retaining clip portions allows the pivoting label holder to pivot upward during stocking and removal of product from the merchandise support arm located below the label support arm.
The above described merchandise display hooks, with pivoting label holders, are becoming more widely used and are increasingly desired by mass merchandisers. However, there are many millions of display hooks of various types currently in use which are not designed for attachment of a pivoting label holder. An objective of this invention is to provide a cost-effective means to adapt one of the existing styles of merchandise display hooks, originally designed for mounting of fixed label holders, for use with pivoting label holders. Store owners are thus able to install pivoting label holders by conversion of existing, installed devices, without requiring the expense of complete replacement.
The present invention more particularly comprises an adaptor device designed to be attached to the outer end of the label support arm of a merchandise display hook originally designed for fixed label holders, modifying the device for mounting of a pivoting label holder. The adaptor device of the invention is designed for mounting on a label support arm which is substantially L-shaped, having a generally straight, outwardly extending shaft and a laterally extending label support portion aligned substantially perpendicular to the shaft. The adaptor device mounts on the outer end of the label support arm and includes means to form at least a portion of a cross bar extending laterally, perpendicular to the label support arm for mounting a standard pivoting label holder.
In one form of the invention, the cross bar-forming means of the adaptor device comprises a cross bar portion extending laterally from the adaptor body in a direction generally opposite to the laterally extending label support portion of the label support arm. The cross bar portion is aligned to be substantially coaxial with the label support portion to form a combined support for the pivoting label holder on both sides of the shaft of the label support arm. The pivoting label holder thus rotatably attaches to both the cross bar portion of the adaptor device and to the label support portion of the label support arm. The adaptor device also includes means to engage the label support portion to lock the adaptor device in fixed position with respect to the label support arm.
In another embodiment of the invention, the adaptor includes a full-width cross bar element which extends on both sides of the label support arm. The pivoting label holder is thus pivotally mounted exclusively by the cross bar of the adapter device.
In a third embodiment of the invention, the adapter includes a stabilizing clip portion configured to engage the laterally extending label support portion when the adapter is mounted to the shaft such that the adapter is prevented from rotating with respect to the shaft, thus mounting the attached cross bar in a fixed horizontal orientation.

Adapter with cross bar for mounting pivoting label holders


The invention provides an image processing apparatus and method wherein image signals can be arithmetically processed on the real-time basis. Infrared rays introduced into a light reception section are photoelectrically converted in synchronism with a reset pulse signal supplied from a timing generator and are outputted to an amplification section in synchronism with a light reception section transfer pulse signal supplied from the timing generator. The signal inputted to the amplification section is amplified to a level necessary for processing in an apparatus in the following stage in synchronism with an amplification section drive pulse signal supplied thereto from the timing generator, and outputted to an arithmetic operation section. The signal inputted to the arithmetic operation section is temporarily stored into a storage section, and a predetermined arithmetic operation designated by an arithmetic operation selection signal from an arithmetic operation control section is performed for the signal by a comparison section to produce a binary digitized signal. The binary digitized signal is outputted to an outputting section. The signal inputted to the outputting section is outputted as a pixel signal over a common signal line in synchronism with a selection signal from a horizontal scanning circuit.

This invention relates to an image processing apparatus and method.
A technique of arithmetically operating an image signal is being spread widely. This technique is utilized, for example, to determine a three-dimensional image of an imaging object by arithmetically operating an image signal.
In order to obtain a plurality of signals necessary for arithmetic operation, where such an image pickup device as a CCD (Charge Coupled Device) is used, an image of an imaging object is picked up repetitively. Image signals obtained by the repetitive image picking up operations are stored into a memory device such as a frame memory. Then, the thus stored signals are read out from the storage device and used for such arithmetic operation as described above.
Also such a non-scanning type image pickup device as disclosed in Japanese Patent Publication No. hei 6-25653 has been proposed as a method and an apparatus for realizing real-time geometric measurement.
However, where an image of an imaging object is picked up repetitively, since the time of, for example, 33.3 msec or 16.6 msec is required for a single image picking up operation, there is a subject to be solved that this time required for the image pickup makes an upper limit and a result of arithmetic operation of image information cannot be obtained at a higher rate.
Also it is a subject to be solved that, since a result of arithmetic operation of an image signal cannot be obtained unless an image picking up operation is performed repetitively, a result of arithmetic operation cannot be obtained on the real-time basis.
In the non-scanning type image pickup device disclosed in Japanese Patent Publication No. hei 6-25653, since outputs of individual pixels arrayed on the image pickup device are handled independently of one another, output signal lines of the pixels cannot be formed as a common output signal line or lines. Further, since the non-scanning type image pickup device does not include storage means for the pixels, it has a subject to be solved that it loses such a characteristic of the "non-scanning type" that individual pixels operate independently of one another and consequently cannot perform real-time processing.

This patent is subject to a terminal disclaimer.


A printing device (10) such as a laser printer includes a radio frequency controller (38) which permits the detection and redirection of media having one or more defective radio frequency device tags, such as an RFID tag, to a specific one of two or more output options (50, 52). The radio frequency controller (38) may include radio frequency control logic (500) that communicates with the base printer (10) and the output options (50, 52) over a down port (506) and up port (508) to intercept commands from the printer (10) to the options (50, 52) and to also respond to such commands. A defective tag can be detected by attempting to program a tag using an RF reader/programmer (504).

Inkjet and laser printers have become commonplace equipment in most workplace and home computing environments. Today, many printers are multi-functional assemblies capable of printing on a large array of print media including letterhead, paper envelopes and labels. A recent innovation in the printing industry involves the manufacturing of print media with embedded radio frequency signatures in the form of Radio Frequency Identification (RFID) transponders or tags. These tags, sometimes called "Smart Labels", may be used with a variety of existing printing methods.
Embedded print media generally comprises a backing material (sometimes referred to as the "web") upon which a label is applied, with a RFID tag sandwiched in between the label and the backing material. There may be one or more labels on the web and the sheet, as presented, may be part label and part plain paper. In some cases, there may be more than one tag arrayed across the width and down the length of the media such that multiple columns and/or rows of tags are contained on the print media.
Another similar type of embedded print media is known as "Smart Paper" in which RFID tags are embedded into the media without labels. One application for Smart Paper is in the area of secure document storage where access to information printed on a document is controlled by use of data control mechanisms such as Access Control List ("ACL") embedded in a tag on the media. To control access, a radio frequency reader/programmer situated near a control point, such as an access control cabinet, can check the ID of a user wanting to access the cabinet against the ACL on the tag on the media. If the ID of the user and the ACL do not match, an alarm can be invoked to notify of an attempted breach in security. In addition, the information on the ACL can be spread among a plurality of tags on a single sheet of print media to accommodate multiple accesses by multiple users and to save costs in the printed media.
One of the benefits of printing labels on a cut-sheet printer such as a laser or inkjet printer is that the relatively wide format allows for multiple columns of labels to be used. The use of multiple columns improves the overall rate at which the labels can be printed. At the same time, because the customer can print more than one label for each sheet printed, the relative cost of each label is greatly reduced.
Accordingly, printing on media with embedded RFID tags is rapidly becoming a growing area of label printing. Each tag on a sheet can be printed with certain data, and the RFID tag embedded within that media can be used to allow individualized processing of user associated data. For example, a shipping label might have the delivery address and a package tracking ID printed on it, while the corresponding tag would be programmed with the same information. The delivery information can then be read from the tag, whether or not the package is positioned so that the tag is visible.
In modern laser printing systems it is common to offer a variety of paper handling options at the output of the printer. Notably, the ability to direct each printed sheet uniquely to one of a selection of output bins is a commonly desired feature. To enable output bin selection, output bins may be added to the output section of the printer in a stackable, modular fashion.
In addition, each option device may have the ability to communicate with the printer's core engine processor via a communications interface commonly referred to as the "Paper Port". With some printing systems a variety of output options may be employed including a single output bin, a 5-bin multi-bin stacker, and a single-bin stapler "finishing option". When connected to the base printer, these options may be integrated into a complete printing system.
Printing label media with embedded RFID tags presents the additional problem of how to manage media with tags that have been damaged or are otherwise inoperable. While it is relatively straightforward to visually examine a printed page and detect gross defects with the printed output, a "bad" tag is difficult or impossible to distinguish from a "good" tag without attempting to electronically read and verify the tag's operation and content.
Laser printers have a key inherent characteristic that makes the detection and separation of media having defective tags a unique problem from existing thermal printer systems. With laser printers the page cannot be stopped or reversed during the printing operation without jeopardizing the quality of the printed image on the page. Therefore, it is desirable to find a method of distinguishing bad tags from good ones that does not require stopping the printing process. At the same time, it is also desirable that minimal modifications in either hardware or software be required of the base printer or existing options. Therefore, changing the existing communications protocol between engine and software, or providing additional signals to the options are not attractive options.
Therefore it is desirable for the RFID-capable printer to take some action when a bad or defective tag has been detected to make such pages easily distinguishable from other pages in the print stream that have good tags. A solution that can be offered as an after-market installable option to detect and separate media having defective RFID tags from good ones would provide numerous advantages.

Systems and methods for handling defective RFID media according to available printer output options


An image forming apparatus is provided with a main body, an image forming assembly accommodated in the main body, a withdrawable unit accommodated in the main body in such a manner as to be withdrawable to the outside, a fixing unit for fixing a toner image to a recording sheet with heat from the heating member by conveying the recording sheet having the toner image transferred thereto while nipping it between a heating member and the pressure member, and a temperature raising device for raising the temperature of the heating member. The fixing unit is detachably mounted on the withdrawable unit. On the other hand, the temperature raising device includes a mounting portion different from that of the heating member, and is fixedly attached to the withdrawable unit and is kept attached to the withdrawable unit even if the fixing unit is separated from the withdrawable unit.

1. Field of the Invention
The present invention relates to an image forming apparatus such as a printer, a copier, a facsimile machine or a complex machine, and particularly to a construction of a fixing unit for fixing a toner image, which has been transferred to a sheet, to the sheet.
2. Description of the Related Art
A fixing unit of an image forming apparatus is adapted for fixing a toner image to a sheet by conveying the sheet having an unfixed toner image transferred thereto through a nip between a heating roller and a pressure roller while heating the unfixed toner image by means of the heating roller. In order to increase the temperature of the outer surface of the heating roller, an induction heating method for causing the heating roller to generate heat itself is adopted in addition to a radiant heating method according to which a heat source such a halogen lamp is installed in the heating roller. By this induction heating method, the temperature of the heating roller can be quickly increased by an eddy current resulting from electromagnetic induction.
As a prior art relating to a fixing unit adopting the induction heating method, a construction is known in which a bobbin having an induction heating function is installed in a cylindrical heating roller (see, for example, Japanese Unexamined Patent Publication No. 2002-311729). The bobbin also has a cylindrical shape and an induction coil, a ferrite core and the like are arranged therein. Since the heating roller and the bobbin are separate parts and wiring with the induction coil is arranged in the bobbin, the heating roller can freely rotate. Particularly in this prior art, one end of the bobbin is connected with one side wall plate of a main body of an image forming apparatus. Thus, upon detaching the fixing unit, the bobbin remains in the main body of the image forming apparatus. Therefore, the fixing unit is thought to be able to be easily disassembled and reassembled at the time of replacing the heating roller.
However, in the prior art construction in which the bobbin remains in the main body of the image forming apparatus, a circuit board and the like for supplying a current to the coil also remains in the main body together with the bobbin. Thus, for the maintenance, inspection and the like of the circuit board, an operator has to detach, replace and/or attach the circuit board while stretching his arms to the back of the main body of the image forming apparatus after the fixing unit is detached. Such an operation is particularly difficult if a space after the detachment of the fixing unit is small.