An exhaust gas treatment apparatus for the removal of at least a sulfur dioxide gas and ammonia from an exhaust gas by bringing the exhaust gas into vapor-liquid contact with an absorbing liquid comprises an introduction-side tank to which the absorbing liquid is supplied, a parallel-flow type absorption tower positioned above the introduction-side tank; an ejection side tank positioned adjacent the introduction side tank; a counter-flow type absorbing tower positioned above the ejection side tank; a mist eliminator for removing splash mist from the exhaust gas; and a controller for controlling the pH of the absorbing liquid in one of the introduction-side absorption tower and the ejection-side absorption tower.

Field of the Invention and Related Art Statement
This invention relates to an exhaust gas treatment apparatus and method which can effectively remove sulfur and ammonia from an exhaust gas in a small-sized apparatus constitution, particularly to an apparatus and a method for exhaust gas treatment which can attain a high ammonia removal ratio.
As such a type of an exhaust gas treatment method, conventionally known is a method for removing sulfur oxides (mainly a sulfur dioxide gas) and the like from an exhaust gas by subjecting an absorbing liquid having an absorber such as limestone suspended therein and the exhaust gas to vapor-liquid contact by using a packed absorption tower (a vapor-liquid contact tower) or a spray type or liquid-column type absorption tower.
In general, the conventional packed-type exhaust gas treatment apparatus or spray type or liquid-column type exhaust gas treatment apparatus is essentially formed of one vapor-liquid contact tower per absorbing liquid tank. Such a constitution however has imposed a limitation to the size reduction, cost reduction and maintainability improvement as well as improvement in the performance of desulfurization.
Described specifically, in order to heighten the performance, an increase in the row number of spray nozzles to be installed in the case of the spray type, an increase in the height of the liquid column in the case of the liquid-column type and an increase in the height of the packed portion in the case of the packed type are required, which causes a marked increase in the whole size of the apparatus (particularly, the height of the absorption tower), the number of ducts or pipes connected with the apparatus or an installation height, resulting in the considerable increase in the capacity or power of a pump for pumping up the absorbing liquid.
The present inventor has therefore proposed in Japanese Patent Application No. HEI 5-118171 (Japanese Patent Application Laid-Open No. HEI 6-327927) an apparatus which exceeds the limitation of the conventional apparatus and has improved performance and reduced size.
The proposed apparatus is a so-called parallel counter flow type in which two liquid-column type absorption towers (parallel flow type and counter flow type) are aligned above a tank for storing an absorbing liquid and an exhaust gas is introduced into each absorption tower successively, where vapor-liquid contact of the exhaust gas with an absorbing liquid is effected in each tower. Such a constitution makes it possible to reduce the whole size (mainly a reduction in the height of the absorption tower) and to reduce the cost (reduction in both the equipment cost and operation cost) and moreover to improve the desulfurization and dedusting performance.
A description will next be made of one example of a conventional exhaust gas treatment method using such a parallel-counter flow type vapor-liquid contact apparatus, with reference to FIG. 3.
In this exhaust gas treatment method, employed is a vapor-liquid contact apparatus formed of a tank 1 to which an absorbing liquid (which will hereinafter be called "absorbent slurry") having an absorbent containing limestone suspended therein is fed; a liquid-column type introduction-side absorption tower 2 which extends upward from one side portion of the tank 1 and brings an untreated exhaust gas A into vapor-liquid contact with the absorbent slurry in the tank 1; and a liquid-column type ejection-side absorption tower 3 which extends upward from the other side portion of the tank 1 and brings the exhaust gas from the introduction-side absorption tower 2 into vapor-liquid contact with the absorbent slurry in the tank 1 again.
Here, the introduction-side absorption tower 2 is a so-called parallel flow type absorption tower in which an untreated exhaust gas A flows downward, introduced from the upper part. The ejection side absorption tower 3 is a so-called counter flow type absorption tower in which an exhaust gas ejection portion (not illustrated) for ejecting the treated exhaust gas B is formed at the upper part of the tower and the exhaust gas passing through the introduction-side absorption tower 2 and then the upper part of the tank 1 flows upward.
In the absorption towers 2,3, spray pipes 4,5, each in plural, are arranged in parallel, respectively. Each of these spray pipes 4,5 has plural nozzles (not illustrated) for injecting the absorbent slurry upward in the form of a liquid column.
Disposed outside the tank 1 are circulation pumps 6,7 for sucking the absorbent slurry from the tank 1. The absorbent slurry is fed into spray pipes 4,5 through circulation lines 8,9, respectively and then, injected upward from each nozzle.
The apparatus as shown in FIG. 3 is equipped with a so-called arm rotating type air sparger 10 for blowing oxidation air C in the form of fine air bubbles into the tank 1 while stirring the slurry in the tank 1, whereby the absorbent slurry which has absorbed a sulfur dioxide gas is efficiently brought into contact with air to cause complete oxidation, thereby affording gypsum.
According to this method, the absorbent slurry, which is brought into vapor-liquid contact with the exhaust gas after being injected from the header pipe 4 or 5 in the absorption tower 2 or 3 and flows downward while absorbing a sulfur dioxide gas and dust, is oxidized by being brought into contact with many air bubbles blown and stirred by the air sparger 10 in the tank 1, and then causes neutralization reaction, whereby a slurry containing gypsum at a high concentration is obtained. Incidentally, the main reactions occurring during the above treatment can be indicated by the following reaction formulas (1) to (3).
(Exhaust gas introduction portion of absorption tower) EQU SO.sub.2 +H.sub.2 O.fwdarw.H.sup.+ +HSO.sub.3.sup.- (1)
(tank) EQU H.sup.+ +HSO.sub.3.sup.- +1/2O.sub.2 .fwdarw.2H.sup.+ +SO.sub.4.sup.2-(2) EQU 2H.sup.+ +SO.sub.4.sup.2- +CaCO.sub.3 +H.sub.2 O.fwdarw.CaSO.sub.4 .multidot.2H.sub.2 O+CO.sub.2 (3)
In the tank 1, a large amount of gypsum, a small amount of limestone as an absorbent and a slight amount of powdery dust collected from the exhaust gas regularly exist in the form of a suspension or solution. This slurry in the tank 1 is fed to a solid-liquid separator 11 through a pipe line 9a branched from the circulation line 9 and is then collected by filtration as gypsum D having a small water content. The filtrate from the solid liquid separator 11, on the other hand, passes through a filtrate tank 12 and then pumped out by a pump 13. A portion of the filtrate is returned to the tank 1 as a water content to form an absorbent slurry, while another portion is discharged as a desulfurized waste water E in order to prevent the accumulation of impurities.
To the tank 1 under operation, limestone which is an adsorbent is supplied from a slurry preparation tank 15 as a slurry. The slurry preparation tank 15 has an agitator 16 and there, powdery limestone F charged from a silo (not illustrated) and water G supplied (industrial water or the like) are stirred and mixed, whereby an absorbent in the form of a slurry is prepared. The absorbent so prepared is then supplied by a slurry pump 17 to the tank 1 as needed.
In addition, make-up water (industrial water or the like) is supplied to the tank 1 to supplement the water content which shows a gradual decrease by the evaporation in the absorption towers 2,3.
During operation, the flow rate of the make-up water to the tank 1 or the flow rate of the slurry ejected from the pipe line 9a is controlled, whereby a slurry containing predetermined concentrations of gypsum and adsorbent is always stored in the tank 1 in an amount within a predetermined range.
During operation, a boiler load (flow rate of the exhaust gas A), a sulfur dioxide gas concentration in the untreated exhaust gas A, and pH and limestone concentration in the tank 1 are detected by sensors with a view to maintaining the desulfurization ratio and gypsum purity at a high level. Based on these detection results, a supply rate of the limestone to the tank 1 is adjusted by a controller (not illustrated) as needed. In general, the pH in the tank 1 is conventionally adjusted to 6.0 or so in order to promote the above-described oxidation reaction, while maintaining the high absorption performance of the sulfur dioxide gas, thereby preparing high-purity gypsum.
The exhaust gas treatment method using the above-described vapor-liquid contact apparatus of a parallel counter flow type which method has been proposed and industrialized by the applicant, however, is accompanied with the problem that when the untreated exhaust gas A contains ammonia, this ammonia is released as a gas in the counterflow type ejection-side absorption tower 3 and is then inevitably discharged while being contained in the treated exhaust gas B.
For example, an exhaust gas treatment equipment for an oil burning boiler of a thermal electric power plant, sulfur trioxide (SO.sub.3) contained in the exhaust gas is collected as ammonium sulfate ((NH.sub.4).sub.2 SO.sub.4) so that ammonia is generally poured into the exhaust gas at the flow prior to a desulfurizing apparatus, and an untreated exhaust gas A to be introduced to the desulfurizing absorption tower therefore contains about 100 ppm of ammonia at the maximum. In the conventional parallel counter flow type vapor-liquid contact apparatus as illustrated in FIG. 3, a large portion of the ammonia is dissolved and absorbed in the slurry in the parallel flow type introduction-side absorption tower 2 so that the ammonia concentration in the exhaust gas lowers to about 10 ppm at the maximum at the outlet portion of the introduction-side absorption tower 2. The slurry injected to the upper part of the ejection-side absorption tower 3 and brought into contact with the exhaust gas has pH as high as about 6, which increases the partial pressure of ammonia at the upper part of the absorption tower 3. Ammonia in the slurry is released again to the gas side, resulting in an increase in the ammonia concentration in the treated exhaust gas B to about 50 ppm at the maximum.
Incidentally, the exhaust gas control in Japan has not applied to ammonia yet, but it is desired to minimize the ammonia concentration in the treated exhaust gas B to be released into the air from the viewpoint of the air pollution prevention. There is accordingly a demand for the exhaust gas treatment method which can accomplish the size reduction of the apparatus and high desulfurization performance and at the same time reduce the amount of discharged ammonia.

Exhaust gas treatment apparatus and method


A heat pipe heat exchanger and a method for fabricating the same are disclosed. A heat pipe heat exchanger 1 is provided with a heat pipe 2, and a heat block 3 having a heat pipe-holding hole 3A, and a fin 4 having a fin base portion 4A, to which the heat pipe 2 is joined by a heating tube expansion method. The heat pipe 2 is plastically deformable and in which a predetermined amount of hydraulic fluid 2a is sealed. The heat pipe 2 is composed of a pipe having a cross section except a perfect circle. The heat pipe-holding hole 3A and the fin base portion 4A are composed of holes each having a cross section except the perfect circle.

1. Field of the Invention
This invention relates to a heat pipe heat exchanger and a method for fabricating the same, in more particularly to a heat pipe heat exchanger in which a heat conductive member is disposed around a heat pipe and a method for fabricating the same.
2. Description of the Related Art
As an example of conventional heat pipe heat exchangers, a heat exchanger comprising a heat pipe composed of a tubular closed container having a perfect circle cross section and enclosing a hydraulic fluid, and a heat conductive member (e.g. fins and/or a heat block) attached to the heat pipe for facilitating heat exchange with the heat pipe has been known.
Such a heat pipe heat exchanger is broadly used in various fields as a thermal diffuser, since the heat pipe heat exchanger has advantages in that the heat pipe itself has a relatively simple structure and that a large heat transfer can be achieved in a small temperature difference.
Conventionally, in such a heat pipe heat exchanger, various methods such as press-fit method, mechanical tube expansion method, charging (filling) method, heating tube expansion method are adopted as a method for attaching the heat conductive member around the heat pipe. In particular, the heating tube expansion method is a method superior to the other methods, since a manufacturing workability can be improved and manufacturing facilities can be miniaturized. For example, the Japanese Patent No. 2541056 discloses a heat pipe heat exchanger using the heating tube expansion method.
Next, the heating tube expansion method is explained in more detail. According to the heating tube expansion method, a pipe-holding hole having a diameter slightly larger than that of the heat pipe is formed at a heat conductive member (e.g. a heat block and/or fins), then the heat pipe (closed container) is installed in the pipe-holding hole. Thereafter, by heating the heat pipe, the heat pipe is plastically deformed by a vapor pressure (internal pressure) of a hydraulic fluid enclosed in the container such that the heat pipe and the heat conductive member are contacted closely with each other and joined with each other. Through the description of the present invention, the "pipe-holding hole" means a hole (aperture) to make contact closely and adhere the heat pipe to the heat conductive member (such as the heat block or the fins).
When the heat pipe is installed in the heat conductive member by using the heating tube expansion method, smaller a gap (space) between an outer periphery surface of the heat pipe and an inner periphery surface of the pipe-holding hole is, smaller an amount of plastic deformation of the heat pipe required for the adhesion is, so that a heating temperature can be lowered. However, considering a required processing precision (processing tolerance) and a manufacturing (assembling) workability of an outer diameter of the heat pipe and an inner diameter of the pipe-holding hole, a tolerance in designed dimensions in a radial direction is generally set around 0.5 mm (a difference in diameters).
On the other hand, in the heating tube expansion method, the heating temperature of the heat pipe should be necessarily set at a temperature that does not go beyond a bursting temperature of the heat pipe.
For example, FIG. 1 is a graph showing a relationship between a heating temperature T and a pressure P as well as a relation between the heating temperature T and an increment ΔD of an outer diameter of the heat pipe, wherein a heat pipe made of copper having an outer diameter d of 9.52 mm, a wall thickness t of 0.34 mm, and an effective length of the heat pipe is 1000 mm and aqua is used as hydraulic fluid. As clearly understood from FIG. 1, a bursting temperature of the heat pipe corresponds to an intersection (about 304° C.) of a curve P1 indicating a saturation vapor pressure of the hydraulic fluid (aqua) in the heat pipe (copper tube) to the heating temperature T and a curve P2 indicating bursting pressure (destruct pressure) of the heat pipe to the heating temperature T.
From the above, when the gap between the outer periphery surface of the heat pipe and the inner periphery surface of the pipe-holding hole is set as 0.5 mm in the case as shown in FIG. 1, the heating temperature T of the heat pipe should be around 300° C. (T≈299° C.), which is slightly lower than a critical temperature (burst temperature), and it is necessary to keep this heating temperature T for a predetermined time. At this time, the internal pressure of the heat pipe becomes about 8.5 MPa (about 85 kgf/cm2).
Now, the heat pipe as described above is fabricated as follows. A pipe for forming a heat pipe is a tube having a perfect circle cross section, and previously provided with a groove (trench) or wick (capillary tube configuration which facilitates a flow back of the hydraulic fluid) at the inner periphery surface thereof. A work of reducing diameter of the tube, etc. is conducted for openings at both ends of the pipe. Thereafter, a reduced opening at one end of the pipe is closed by welding to provide a heat pipe container then a predetermined amount of hydraulic fluid is injected into the heat pipe container. Finally, this inlet (a reduced opening at another end of the pipe) is closed (sealed) by caulking or welding. In the heat pipe fabricated as described above, when the internal pressure is increased by heating, a straight part of the heat pipe having a perfect circle cross section has the highest mechanical strength as against the internal pressure. On the other hand, the both ends of the heat pipe have non-circular cross sections (non-spherical curved surface) since they are provided with the caulking or welding point, so that they have the lowest mechanical strength in the total configuration.
Further, in the heating tube expansion method, when heating the heat pipe installed in the pipe-holding hole of the heat conductive member, the plastic deformation occurs in the heat pipe due to the pipe internal pressure (the vapor pressure of the hydraulic fluid). At this time, the straight part of the heat pipe is protected by being adhered to the inner periphery surface of the pipe-holding hole, since the plastic deformation towards this direction does not progress due to the adhesion. On the other hand, since the ends of the heat pipe are exposed in the air and the mechanical strength thereof is low in the total configuration, there is an apprehension that the ends of the heat pipe may be broken (burst) due to the progress of the plastic deformation.
As described above, in the fabrication of the heat pipe heat exchanger by using the heating tube expansion method, the heat pipe is plastically deformed to be adhered to the heat conductive member around a theoretical destruct point. Therefore, it is very important to determine the gap between the outer periphery surface of the heat pipe and the inner periphery surface of the pipe-holding hole, and to set the heating temperature for the heat pipe. Further, considering a fluctuation in a real heating temperature, etc., the actual work required to be conducted under severe conditions (with small tolerance of margin).
Accordingly, a method for fabricating a heat pipe heat exchanger that can relax the working conditions has been desired.
As described above, according to the conventional method for fabricating a heat pipe heat exchanger, the heat pipe having the perfect circle cross section, which is disposed in the pipe-holding hole having the perfect circle shaped opening, is heated, so that the heat pipe is plastically deformed by the expansion force caused by the vapor pressure of hydraulic fluid in the container, so as to attach the heat conductive member to the heat pipe. Accordingly, it is necessary to heat the heat pipe by controlling the heating temperature to be lower than the critical temperature (bursting temperature) while keeping a plastic deformation amount of the heat pipe. Therefore, there is a disadvantage in that a burden for controlling the temperature on the manufacturer becomes heavy.
In addition, when the heat pipe is heated at a temperature around the critical temperature, a thermal load and a pressure load on the heat pipe are increased. As a result, there are disadvantages in that a rate of defective products becomes high and that productivity (yield) is deteriorated.

Heat pipe heat exchanger and method of fabricating the same


The invention concerns the use of duplex oligonucleotides about 25 to 30 base pairs to introduce site specific genetic alterations in plant cells. The oligonucleotides can be delivered by mechanical (biolistic) systems or by electrpoporation of plant protoplasts. Thereafter plants having the genetic alteration can be generated from the altered cells. In specific embodiments the invention concerns alteration in the gene that encode acid invertase, UDP-glucose pyrophosphorylase, polyphenol oxidase, O-methyl transferase, cinnamyl alcohol dehydrogenase, ACC synthase and ACC oxidase or etr-1 or a homolog of etr-1, and plants having isolated point mutations in such genes.

2.1 MDON and their Use to Effect Specific Genetic Alterations
Mixed duplex oligonucleotides (MDON) and their use to effect genetic changes in eukaryotic cells are described in U.S. Pat. No. 5,565,350 to Kmiec (Kmiec I). Kmiec I discloses inter alia MDON having two strands, in which a first strand contains two segments of at least 8 RNA-like nucleotides that are separated by a third segment of from 4 to about 50 DNA-like nucleotides, termed an "interposed DNA segment." The nucleotides of the first strand are base paired to DNA-like nucleotides of a second strand. The first and second strands are additionally linked by a segment of single stranded nucleotides so that the first and second strands are parts of a single oligonucleotide chain. Kmiec I further teaches a method for introducing specific genetic alterations into a target gene. According to Kmiec I, the sequences of the RNA segments are selected to be homologous, i.e., identical, to the sequence of a first and a second fragment of the target gene. The sequence of the interposed DNA segment is homologous with the sequence of the target gene between the first and second fragment except for a region of difference, termed the "heterologous region." The heterologous region can effect an insertion or deletion, or can contain one or more bases that are mismatched with the sequence of target gene so as to effect a substitution. According to Kmiec I, the sequence of the target gene is altered as directed by the heterologous region, such that the target gene becomes homologous with the sequence of the MDON. Kmiec I specifically teaches that ribose and 2′-Omethylribose, i.e., 2′-methoxyribose, containing nucleotides can be used in MDON and that naturally-occurring deoxyribose-containing nucleotides can be used as DNA-like nucleotides.
U.S. patent application Ser. No. 08\664,487, filed Jun. 17, 1996, now U.S. Pat. No. 5,731,181 (Kmiec II) does specifically disclose the use of MDON to effect genetic changes in plant cells and discloses further examples of analogs and derivatives of RNA-like and DNA-like nucleotides that can be used to effect genetic changes in specific target genes.
Scientific publications disclosing uses of MDON having interposed DNA segments include Yoon, et al., 1996, Proc. Natl. Acad. Sci. 93:2071–2076 and Cole-Straus, A. et al., 1996, SCIENCE 273:1386–1389. The scientific publications disclose that rates of mutation as high as about one cell in ten can be obtained using liposomal mediated delivery. However, the scientific publications do not disclose that MDON can be used to make genetic changes in plant cells.
The present specification uses the term MDON, which should be understood to be synonymous with the terms "chimeric mutation vector," "chimeric repair vector" and "chimeraplast" which are used elsewhere.
2.2 Transgenic Plant Cells and the Generation of Plants from Transgenic Plant Cells
Of the techniques taught by Kmiec I and II for delivery of MDON into the target cell, the technique that is most applicable for use with plant cells is the electroporation of protoplasts. The regeneration of fertile plants from protoplast cultures has been reported for certain species of dicotyledonous plants, e.g., Nicotiana tobacum (tobacco), U.S. Pat. No. 5,231,019 and Fromm, M. E., et al., 1988, Nature 312, 791, and soybean variety Glycine max, WO 92/17598 to Widholm, J. M. However, despite the reports of isolated successes using non-transformed cells, Prioli, L. M., et al., Bio/technology 7, 589, Shillito, R. D., et al., 1989, Bio/Technology 7, 581, the regeneration of fertile monocotyledonous plants from transformed protoplast cultures is not regarded as obtainable with application of routine skill. Frequently, transformed protoplasts of monocotyledonous plants result in non-regenerable tissue or, if the tissue is regenerated the resultant plant is not fertile.
Other techniques to obtain transformed plant cells by introducing kilobase-sized plasmid DNA into plant cells having intact or partially intact cell walls have been developed. U.S. Pat. No. 4,945,050, U.S. Pat. No. 5,100,792 and U.S. Pat. No. 5,204,253 concern the delivery of plasmids into intact plant cells by adhering the plasmid to a microparticle that is ballistically propelled across the cell wall, hereafter "biolistically transformed" cell. For example U.S. Pat. No. 5,489,520 describes the regeneration of a fertile maize plant from a biolistically transformed cell. Other techniques for the introduction of plasmid DNA into suspensions of plant cells having intact cell walls include the use of silicon carbide fibers to pierce the cell wall, see U.S. Pat. No. 5,302,523 to Coffee R., and Dunwell, J. M.
A technique that allows for the electroporation of maize cells having a complex cell wall is reported in U.S. Pat. No. 5,384,253 to Krzyzek, Laursen and P. C. Anderson. The technique uses a combination of the enzymes endopectin lyase (E.C. 18.104.22.168) and endopolygalacturonase (E.C. 220.127.116.11) to generate transformation competent cells that can be more readily regenerated into fertile plants than true protoplasts. However, the technique is reported to be useful only for F1 cell lines from the cross of line A188×line B73.

Use of mixed duplex oligonucleotides to effect localized genetic changes in plants


A multi-track density direct access storage device is disclosed. In accordance with a preferred embodiment of the present invention, a direct access storage device for data storage within a data processing system comprises a housing, a rotatable spindle, at least one disk, and several heads. The disk is fixedly mounted to the rotatable spindle, and the rotatable spindle is rotated by a motor within the housing. A first disk surface of the disk has a first track density and a second disk surface of the disk has a second track density; wherein the second track density is preferably greater than the first track density. Each of the several heads contains a transducer to read and write information from and to the disk during the disk rotation. Under this configuration, the lower storage density first disk surface is utilized to store data that are frequently accessed while the higher storage density second disk surface is for storage capacity supplementation such that the total data storage capacity of the direct access storage device can be increased without degrading the data-accessing performance.

1. Technical Field
The present invention relates to an apparatus for data storage in general, and in particular, to an apparatus for storing data within a data processing system. Still more particularly, the present invention relates to a direct access storage device having multiple track density for storing data within a data processing system.
2. Description of the Prior Art
Direct access storage devices (DASDs) are generally utilized for long-term storage of data within a data processing system, and hard disk drives are one type of DASDs. A hard disk drive utilizes several rotatable disks for data storage. Data are represented on the disks as a series of magnetically polarized regions. These polarized regions are arrayed along the surface of a disk as either concentric data tracks or spiral data tracks. A read/write head is utilized to read data from or write data to different data tracks on the disk while the disk is rotating underneath the read/write head.
Increasing usage of high-volume file servers in local-area networks and wide-area networks has led to an increasing demand for higher capacity hard disk drives. Thus, dramatic improvements on the hard disk storage technology are required in order to keep pace with such demand. Generally, the storage capacity of a hard disk drive can be expanded by increasing both the track density and the linear data density of the hard disk drive. In conjunction, the track-seeking speed of the hard disk drive should also be increased accordingly.
In order to assure performance and reliability for a high track density design, the read/write head of the hard disk drive must be positioned extremely accurately over the data track center by a servo controller. At the same time, because high track-seeking speed tends to cause poor head settling and high track-misregistration (TMR) to the hard disk drive, the servo controller must also be optimized to provide a minimal Seek-Settling TMR after moving the head from one track to another and to maintain an adequate Tracking TMR during read and write operations.
Nevertheless, although a high bandwidth servo controller designed to have an aggressive seek profile can perform seeking with a very short seek-time, a fast seek-time often induces extra head vibrations and instability that lead to a high Seek-Settling TMR. For example, a typical fast-seek operation across one-third of a disk data surface for a 3.5-inch drive can complete in about 8 ms, but such high seek-time could also cause a Seek-Settling TMR as high as 10% of a full track width. Certainly, a low bandwidth servo controller having a less aggressive seek profile (e.g., seek time>13 ms) can reduce the Seek-Settling TMR significantly, if not eliminate the Seek-Settling TMR completely. Further, a low bandwidth servo controller can even substantially improve the Tracking TMR during the read and write operations because of the added attenuation on the dynamic noise, resonances, servo-track format errors, and position-sensing errors. However, the penalty is that all read and write operations will also be delayed by the low bandwidth servo controller due to the prolonged seeking operations.
This is the dilemma: it is possible to increase the storage capacity of a hard disk drive without increasing the TMR simply by utilizing a low bandwidth servo controller; however, the resulting degraded performance from the prolonged seeking operation is undesirable for any normal user applications. On the other hand, a higher TMR may be acceptable for a higher storage capacity design with an improved error correction coding (ECC) and processing. At least the addition of extra ECC in the data storage can improve the soft error rate (SER). For example, by doubling the ECC from 20 bytes to 40 bytes in a data block of 512 bytes, statistically, SER is improved from 10e.sup.-10 to 10e.sup.-20. Nonetheless, the additional ECC and processing also decrease the data access performance which again is undesirable for normal user applications.
Consequently, it would be desirable to provide an improved direct access storage device with a high data-storage capacity but without the degraded data-access performance.

Multi-track density direct access storage device

International Business Machines Corporation


An airbag apparatus includes an airbag, a retainer, a bag ring to sandwich a periphery of an opening of the airbag between the retainer and the bag ring, and a gas-generating device inserted into the airbag for discharging a gas for development of the airbag. The bag ring includes an airbag-holding portion to sandwich the periphery of the base end portion of the airbag, an engaging portion provided at an end portion of the airbag-holding portion adjacent to the stitching portion and engaging the stitching portion when the base cloth panel is displaced from the bag ring, and a gas flow-regulating portion provided on an inner side of the airbag-holding portion. The flow-regulating portion has an inclined portion relative to a gas blowing direction for protecting the stitching portion from the gas ejecting from the gas-generating device.

The present invention relates to an airbag apparatus mounted on a vehicle such as an automobile or the like, for restraining an occupant at a time of a collision, and more specifically, it relates to an airbag apparatus in which an airbag-fixing portion is protected from a high-temperature gas for developing the airbag (hereinafter the gas for developing the airbag is referred to as the gas for development) in the vicinity of the airbag-fixing portion on a vehicle body side, and in which a fixing strength for fixing the airbag is improved.
An airbag is provided with a blowing inlet through which a gas for development is blown into the airbag, and a peripheral edge portion of the blowing inlet is fixed to a member such as a retainer or the like provided on a vehicle body side.
Hitherto, in order to increase the fixing strength for fixing the airbag, it is well known that the airbag is sandwiched between a retainer where an inflator is inserted, and a pressing ring, and a chain-shaped seam is formed around a periphery of the blowing inlet, and the chain-shaped seam is engaged with a bore diameter surface of the retainer (for example, refer to Patent Document 1).
In the technology described in the Patent Document 1, an inner peripheral edge portion and an outer peripheral edge portion of a main part of the pressing ring having a flat plate shape, are risen in flange-shapes, respectively, so that a cross sectional surface shape thereof seen by cutting the pressing ring in a radial direction is formed to have an approximately C-shape.
Further, it is well known that a pressing member having a ring shape is formed with a spring steel so that the airbag is securely fixed with a simple structure, and the airbag is sandwiched between the pressing member and a base plate by utilizing the elasticity of the spring steel (for example, refer to Patent Document 2).
Furthermore, in the Patent Document 2, it is described that the gas for development, which is blown out from the inflator on an upper surface of a base plate portion, is introduced by means of bending an inner edge of the base plate portion of the pressing member downward, and the airbag is smoothly developed.
Patent Document 1: Japanese Unexamined Patent Application Publication No. 2-262446
Patent Document 2: Japanese Unexamined Patent Application Publication No. 7-291074
However, in the technology described in the aforementioned Patent Document 1, since a part of the gas for development, which is blown out from the inflator sometimes, flows into a space between the pressing ring and the airbag, a base cloth panel and the chain-shaped seam constituting the airbag are exposed to high-temperature gas for development after blown out from the inflator, so that a sufficient consideration is required for securing a heat tolerance.
On the other hand, in the technology described in the Patent Document 2, since a fixing operation for the airbag mainly depends on a sandwiching force generated by means of the elasticity of the pressing member between the pressing member and the base plate, the fixing strength for fixing the airbag becomes lower than that in the technology in the Patent Document 1, in which the chain-shaped seam is engaged with the member on the vehicle body side.
The present invention has been made in view of the above-described problems and it is an object of the present invention to provide an airbag apparatus, in which the airbag-fixing portion is protected from a gas for development, and in which a fixing strength for fixing the airbag is improved.
Further objects and advantages of the invention will be apparent from the following description of the invention.


A computerized business process that captures component nonconformance data elements at an inspection process level is described. The nonconformance data is gathered via network-based data capture screens and image capture workstations. The data elements include information regarding the aircraft component nonconformance, component disposition, and if necessary, the repair or non-repairable status, type of repair to be conducted, primary non-repairable defect, and digital images of the nonconforming component feature. The information is uploaded to a database integrated with a nonconformance management system. The data is available for users, suppliers, and customers to view through a secure connection to a business entity's server system. The customer logs onto the system and accesses captured data elements and images.

This invention relates generally to supply chain services, and more specifically to methods and systems for managing turbine engine aircraft nonconforming components.
The manufacture of aircraft engine components, form, fit, and function of components are controlled by specifications included on component drawings. More specifically, engine components are manufactured in accordance with specified tolerances, and as such, engine component features may be inspected after manufacture is complete to determine compliance with the tolerances.
Because aircraft engine components may be manufactured with narrow tolerances, occasionally the nonconforming components must be dispositioned to determine compliance with the tolerances. More specifically, nonconforming components may be assessed to determine acceptance or rejection of the component, and if repairs would enable the components to satisfy the manufacturing tolerances. If repairs are warranted, a written report is generated to indicate corrective actions taken on the component. The written reports are maintained and may be entered into a monitoring system.
However, because multiple users manufacture and disposition nonconforming components, accessing nonconformance information about engine components may be a complex and time-consuming task. The problem is more complicated when parts are manufactured at one location, supplied at a different location, engineered at another location, and if necessary, repaired at a globally different location. Each location may utilize a different monitoring system that may not be compatible or accessible with systems used at other locations. Furthermore, each location may interpret inspection results differently, and may retain different nonconformance data. In addition, variations in the different facilities is a source of customer concern. As a result, analyzing historical nonconformance data for a component may be unreliable and time-consuming.

Methods and systems for aviation nonconformance component management


The present invention is directed to a contact resistance test structure and methods of using same. In one illustrative embodiment, the method includes forming a test structure comprised of two gate electrode structures, forming a plurality of conductive contacts to a doped region between the two gate electrode structures, forcing a current through the test structure and determining a resistance of at least one of the conductive contacts based upon, in part, the forced current.

1. Field of the Invention
The present invention is generally directed to the field of semiconductor devices, and, more particularly, to a contact resistance test structure and methods of using same.
2. Description of the Related Art
There is a constant drive within the semiconductor industry to increase the operating speed of integrated circuit devices, e.g., microprocessors, memory devices, and the like. This drive is fueled by consumer demands for computers and electronic devices that operate at increasingly greater speeds. This demand for increased speed has resulted in a continual reduction in the size of semiconductor devices, e.g., transistors. That is, many components of a typical field effect transistor (FET), e.g., channel length, junction depths, gate insulation thickness, and the like, are reduced. For example, all other things being equal, the smaller the channel length of the transistor, the faster the transistor will operate. Thus, there is a constant drive to reduce the size, or scale, of the components of a typical transistor to increase the overall speed of the transistor, as well as integrated circuit devices incorporating such tran-sistors.
FIG. 1A is a cross-sectional view of an illustrative transistor 10 formed above a semiconducting substrate 12. The transistor 10 is generally comprised of a gate electrode 14, a gate insulation layer 16, source/drain regions 20 and a sidewall spacer 22. An illustrative trench isolation structure 18 is formed in the substrate 12 to electrically isolate the transistor 10 from adjacent semiconductor devices, e.g., other transistors. Conductive contacts 26 are formed in a layer of insulating material 24. The contacts 26 are the means by which a conductive electrical path is established with the source/drain regions 20. The illustrative transistor 10 depicted in FIG. 1A may be formed in accordance with various techniques that are well known to those skilled in the art.
It should be understood that the transistor 10 in FIG. 1A is depicted in an ideal state that may or may not correspond to devices that have actually been manufactured using a variety of complex process flows. More specifically, in FIG. 1A, the entirety of the contact area 25 of the contact 26 engages the source/drain region 20. However, as device dimensions have continued to shrink, it is becoming increasingly difficult to insure that the entirety of the contact area 25 contacts the desired region, i.e., the source/drain region 20. Additionally, due to device size reductions and increased density, it is becoming more difficult to precisely align one structure, e.g., the contact 26, with the desired contact region, e.g., the source/drain region 20, without interfering with other structures.
For example, FIG. 1B depicts an illustrative example wherein the contacts 26 are at least partially formed on the sidewall spacer 22 of the transistor 10. In this illustrative situation, the contact area 25A is less than the idealized or theoretical contact area 25 shown in FIG. 1A. Accordingly, the contact resistance will increase in proportion to the size of the contact area 25 relative to the contact area 25A. FIG. 1C depicts another illustrative example in which a plurality of gate electrode structures share a common active region, e.g., a doped source/drain region 20. Similar to the situation depicted in FIG. 1B, the contact area 25A of the contacts 26 in FIG. 1C is less than the idealized or theoretical contact area 25 shown in FIG. 1A. In the particular example depicted in FIG. 1C, the close positioning of the gate electrode structures 14 and the size of the spacer 22 leave very little room, e.g., 10-100 nm, between the spacer 22 on adjacent devices. Such densely packed structures make it difficult to manufacture devices in which the entire area 25 fully engages the desired contact regions, i.e., a source/drain region. Such variations in contact resistance in actual devices as compared to contact resistance determined from an assumption that the contacts 26 fully contact the desired area (as shown in FIG. 1A) may lead to device performance that is less than anticipated or desired.
The present invention is directed to various methods and systems that may solve, or at least reduce, some or all of the aforementioned problems.

Contact resistance test structure and methods of using same


A hollow fiber membrane is formed by embedding a braid having a spiral open weave of monofilaments only, to avoid a “whiskering” problem common in prior art multifilament braid-supported tubular membranes. The open weave is characterized by contiguous, circumferential, rhomboid-shaped areas of polymer film separated by monofilaments. When the braid is supported on a plasticized PVA cable it can be infiltrated with membrane polymer which, when coagulated embeds the braid positioning it around the lumen. The spiral weave, free of any circumferentially constricting monofilament, when embedded in film, allows the membrane to be biaxially distensible. In other words, the membrane has “give” not only in the axial or longitudinal direction but also in the radial direction. “Give” in the radial direction permits soiled membranes to be backwashed under higher pressure than in a comparable braid which is not radially distensible.

Braided hollow fiber membranes are commonly used in modules containing from several hundred to several thousand membranes. Damage to a single membrane in a module, which damage results in dirty water contaminating the permeate, is a serious problem which occurs more often than desired. Though the permeate is typically water, the permeate may be any filterable liquid to be separated from a suspension or dispersion of finely divided particles in the liquid.
To date, numerous braided membranes have been disclosed, each of which purports to provide desirable filtration efficiency but offer scant useful knowledge relating to avoiding the damage to a membrane or maximizing permeate efficiency. Emphasis on physical strength of the membrane is embodied in disclosures of U.S. Pat. Nos. 3,644,139; 4,061,821; 5,472,607; 5,914,039; 6,354,444; 7,165,682; 7,172,075; 7,306,105; 7,861,869; 7,909,172 and others. The requirement of strength decreed that these prior art braids be made by braiding multiple yarns, each comprising lengths of multiple monofilaments (or "filaments" for brevity). The drawbacks of using multifilament yarns were either overlooked or ignored.
Membranes such as are disclosed in U.S. Pat. No. 4,061,821 to Hyano et al, (hereafter '821) have braid embedded beneath a thick polymer film to provide a stabilizing effect during use of the membrane. The term "embedded" as used herein describes yarn or monofilament with at least 99% of its surface coated with polymer. Braid having an inner diameter in the range of 0.5-10 mm and unspecified "thin thickness" is made from filaments overlying and randomly overlapping one and another (see FIGS. 4, 5 & 6 in '821) in multiple layers but are preferably made from multifilament yarn. The stabilizing effect of the openings in the reinforcing material was lost (see sentence beginning at the bottom of col 4, and bridging cols 4 and 5) when the braid was coated with polymer, so that their reinforced membrane was not an effective membrane.
The problem of stability was addressed in U.S. Pat. No.5,472,607 to Mahendran et al, (hereafter '607) which teaches a film having a wall thickness in the range from 0.01 mm to 0.1 mm, supported on the outer circumferential surface of a preshrunk braid; a major portion of the area of the circular cross-section of the porous tubular support, viewed along the longitudinal central axis, is free from film and not embedded in film. Thus, it was not known how embedding the braid in the film affected the performance of the membrane; nor was it established whether failing to embed the braid in the film provided a significant advantage.
Membranes such as are disclosed in U.S. Pat. No. 6,354,444 to Mahendran et al, (hereafter '444) are produced by first weaving a tubular braid of multifilament yarn to have a cylindricity >0.8, preshrinking the braid, then coating the outer circumferential surface of the cylindrical braid with a dope of polymerizable membrane-forming polymer. The term "cylindricity" (sometimes referred to as "roundness") refers to how perfectly the circular cross-section of the tubular support matches the geometry of a true circle drawn to correspond to the mean diameter of the braid, a perfect match being 1.0. By "weaving" is meant that the filaments are interlaced without being knotted (as they would be if the braid was knit). "Dope" refers to fluid "membrane polymer", e.g. poly vinylidene fluoride ("PVDF") whether molten or in a solution. If in solution and coagulated, the dope forms a film having a wall thickness of >0.2 mm and with desired attributes for the filtration of fluid to be filtered, typically dirty water. The '444 braid is relatively dense, having an air permeability in the range of from 1 to 10 cc/sec/cm2 at 1.378 kPa so that the voids in the braid are small enough to provide substantial resistance to the passage of air, and thus inhibit substantial penetration of polymer. The braid is preshrunk to provide stability of the braid. Yarn lying in a generally longitudinal orientation (along the z-axis) provides extension at break of the uncoated braid of at least 10% which extensibility is referred to as "give".
The weave of the '444 braid is a circularly woven tubular braid. Such braids are tightly woven with at least one circumferential yarn lying in a generally x-y plane (z axis is longitudinally axial). This orientation necessarily constricts and prevents radial distension of the braid, but the preshrunk braid does have "give" in the longitudinal direction. However, when the braid is coated with a relatively elastic polymer to form the membrane, it is essentially longitudinally non-extensible (along the z-axis). In other words, the '444 membrane, whether pulled in the axial direction or pressured from within during backwashing, has essentially no "give". The importance of "give" relates particularly to effective backwashing. The higher the backwashing pressure the better, if it does not damage the membranes, because such pressure allows faster and more effective cleansing of contaminated membranes and therefore provides an economic advantage.
Because the '444 braid is deliberately not embedded in the polymer, yarn defining the lumen (bore) of the membrane is not coated with polymer. Other references disclose braids woven to minimize the problem of too-deep penetration of the polymer film. The non-embedded yarn, in all such instances, is prone to damage such as pin-holes. Such damage lessens the initial high bubble point of the freshly deployed membrane. The "bubble point" refers to the pressure under which a stream of air escapes through the largest pore in a wall of a wetted, defect-free membrane which has desirable flux. Further, the importance of stability of the structure of the braid during operation, particularly the effect of shrinkage, was not known.
Though U.S. Pat. No. 7,861,869 discloses a semipermeable capillary membrane reinforced by a braid of monofilament yarn, the yarn is made by bundling multiple monofilaments (36 in example 1). The braid is not made by braiding separate monofilaments. Penetration of the dope into the braid is controlled so that the inner channel (lumen) of the braid is not blocked. The process taught herein prepares an "outer skinned" version of the reinforced membrane, explicitly avoiding embedding the braid.
WO-A-0397221A1 describes a tubular fiber membrane which is longitudinally reinforced by unbraided yarns, not by a braid. The axial bore is formed by injecting an internal coagulation solution in the centre but the thickness of the annular film defining the lumen cannot be controlled.
US 2009/0206026 A1 to Yoon et al, titled "External pressure type hollow fiber membrane having reinforcing supporter with monofilament for gas separation and water treatment, and method and apparatus for preparing the same" states: "The hollow fiber membrane of the present invention has excellent pressure resistance and high tension force by using the rigid and tubular supporter, an improved softness by using the monofilaments, and an increased bonding force between the supporter and the coating layer by increasing the concave-convexo degree of the reinforcing supporter." (see '026 Abstract, lines 6-11). That the tubular supporter in the described hollow fiber membrane is rigid, is reiterated under "Industrial Capability" (see line 3 of paragraph
Such rigidity serves to distinguish the '026 membrane over the membrane of '607 to Mahendran et al, discussed in '026 as being the most relevant reference which teaches that "The support itself is so flexible (flaccid) that it does not have a circular cross-section and collapses with finger pressure." (see Abstract, lines 4-6) "By "flaccid" is meant that the denier of monofilaments used in the yarns or "ends" for carriers which are braided, and the number of picks/unit length of the braid, are such that a tubular braid has very little mechanical strength in a vertical plane normal to its longitudinal central axis, so that it is so flexible that it can be easily manually tied into a knot. A typical braid starts out as multiple filaments which make up a single "end" and two "ends" are plied together in 3.8 twists/25.4 mm to make up a yarn or "carrier". Multiple carriers, preferably 24, are used to braid a tubular braid." (see '607, col 3 lines 24-33). Clearly, the '026 statement relating to a rigid and tubular supporter are meant to distinguish over the '607 braid.
Note that though FIGS. 4 and 5 in '026 purport to be photomicrographs of the reinforcing supporter, both woven with monofilaments of 130 deniers and of 32 and 24 yarns respectively, other than stating that the diameter of the supporter can be controlled according to the number of cones (see [0042]), there is no indication in either photomicrograph as to the diameter of the woven braids shown. Neither is there any identification, anywhere, either of the weave, or of the machinery, used to make a braid having any specified diameter, much less a nominal inside diameter in the range from about 1.0 mm (to make a membrane having a nominal outer diameter of 1.5 mm, depending upon the denier of the monofilament to be used), to about 2.5 mm (to make a membrane having a nominal outer diameter of 3.0 mm, depending upon the denier of the monofilament to be used), as specified for the braid and membrane claimed herein. In particular, there is no mention of using a flexible cable, dissolvable in an aqueous solution (referred to as "aqueous-dissolvable") upon which to weave the braid. By "nominal" is meant "average".
Particularly noteworthy is that the '026 membrane is woven with both, monofilament and multifilament yarns; this provides convincing evidence that the inventors of the '026 braid failed to realize that "whiskering" and "fuzz" were the root causes of failure in membranes with multifilament braids.
In FIG. 6 of '026 there is illustrated an automatic device in which a perforated wire 2 extends along the central vertical axis of an injector for an internal coagulating solution 4. A high pressure injection nozzle 3 injects the internal coagulating solution onto the wire, and the solution is also squirted through the perforations while the reinforcing supporter passes over and is forwarded by the roller 5 in contact with the wire 2. (see [0045]).
Aside from the problem of perforating about a 2.0 mm diameter wire, doing which is beyond the skill of the inventors herein, it will be seen in the test presented in example 1 below, that an open weave tubular braid having the diameter claimed herein, made with woven monofilament in the size range claimed herein, cannot be forwarded (or "passed") over a wire as described in '026 because the friction is too great, and other reasons. Numerous attempts to forward a tubular braid of monofilaments only (see example 1 below) to make a membrane in the range of nominal outer diameters from 1.5-3.0 mm, fails to produce a usable, undistorted, uniform membrane. The '026 reference is therefore a non-enabling disclosure. Moreover, manually pulling the braid over the wire after the braid is coated with coagulant polymer, results in destruction of the membrane, again, because of the flaccid membrane and its excessive friction. To make and use the membrane claimed in '026 would require undue experimentation.
US 2004/0197557 to Eshraghi et al teaches (a) providing a molten removable substrate material in the form of an extrudate of a molten polymeric material (see [0011] to make a hollow fiber membrane having a dissolvable core, and the use of reinforcing fibers as follows: "Additionally, one or more reinforcing fibers can be incorporated into such polymeric membrane to form a fiber-reinforced tubular polymeric membrane structure. Preferably, such reinforcing fibers extend continuously along the longitudinal axis of the fibrous core or substrate and therefore provide axial reinforcement to the hollow fibrous membrane. Fiberglass having an average diameter of about 0.1-500 μm is particularly suitable for practice of the present invention, while other fibrous materials, including but not limited to carbon fibers, metal fibers, resin fibers, and composite fibers, can also be employed for reinforcing the hollow fibrous membrane. The reinforcing fiber can either be co-extruded with one of the polymeric membrane-forming layers, or be encapsulated between two polymeric membrane-forming layers, to form an integral part of the hollow fibrous membrane." (see [0085]) There is no suggestion, beyond the statement that "such reinforcing fibers extend . . . hollow fibrous membrane" how one or more reinforcing fibers are to be incorporated into the polymeric membrane.
The '557 publication states "the solid core fiber itself is formed of a solid-phase removable substrate material, and at least one layer of a polymeric membrane-forming material is coated directly onto such solid core fiber." (See [0023]). It thereafter states: "the molten removable substrate material is co-extruded with the membrane-forming polymer. (See [0041]-[0047]).
It is clear that Eshraghi et al did not extrude PVA because it degrades before it can be melt-extruded, irrespective of what grade of PVA is used. As evident in example 2 below, attempts were made to extrude each of three grades of PVA available from Kuraray, namely fully hydrolyzed (F-05 and F-17); intermediate hydrolyzed (M-17); and partially hydrolyzed (P-24, P-20, P-17 and P-05). The temperature at which each of the polymers degrades is lower than its softening temperature. Therefore each attempt resulted in severe degradation of each.
In the description of the process illustrated in FIG. 3A, the '557 publication states "a string or a tow of removable core fiber 122 from a spool 120 is passed through the extrusion die 124. A thin layer of the viscous polymeric solution 101 is therefore applied onto the removable core fiber 122, forming a coated fiber 132." ([See 0086]) The core fiber 122 could not have been flexible PVA as it necessarily would have to be plasticized with just sufficient plasticizer to provide a core fiber which was not degraded.
A core made from PVA in a solution of hot water has insufficient strength to maintain its cylindrical form—discovered to be a critical requirement for making the open weave braid of this invention. Not being able to make a PVA core negated the suggestion in '557 that PVA may be used for the core.
As for the reinforcing the '557 publication states "The reinforcing fiber can either be co-extruded with one of the polymeric membrane-forming layers, or be encapsulated between two polymeric membrane-forming layers, to form an integral part of the hollow fibrous membrane." There is no suggestion that the extrudate be covered with a braid before being coated with membrane polymer, and no way this could be accomplished using the teachings of their disclosure.
In a manner analogous to that stated above, commercially available ethyl vinyl alcohol (EVOH) from Kuraray; commercially available polylactic acid from Nature Works; commercially available nylons from Shakespeare; and no-longer commercially available copolyester from Eastman, failed to produce a usable core despite numerous trials in each of which the conditions of extrusion were changed.
Clearly the disclosure of the '557 publication is not an enabling disclosure.
With respect to the use of monofilaments, apart from a braid thereof, the '557 publication provides no indication that it recognized the ill effects of "whiskering" and "fuzz" in a braid made with at least some multifilament yarns.
Neither did the '557 publication recognize that only a tubular braid embedded near the inside diameter of the membrane so as to reinforce the lumen provided the highest peel strength, bubble point and permeate efficiency. There is no suggestion that a braid be woven using only monofilaments woven in a particular way, namely with an open weave so as to avoid having circumferentially restricting filaments which would not have "give" under abnormally high backwashing pressure.
Publication No. WO/2010/148517 to Cote et al (hereafter the "'517 publication") presents the concept of using a "dissolvable filament (solid or hollow) core" to make a hollow fiber membrane (see [0040]). It states that "the core can be a solid or capillary tube can be later dissolved in a solvent, preferably the solvent used to coagulate the membrane (typically water). Examples of water-soluble polymers include PVA, EVOH (made by Kuraray), as well as some forms of polyester (available from Eastman) and nylon (available from Shakespeare)." (see [0065]). Not mentioned is high amorphous vinyl alcohol (HAVOH) and more commonly available polylactic acid (PLA), cellulose acetate, hydroxyethyl cellulose, polyethylene oxide (PEO) and polyethylene glycol (PEG), all of which are water-soluble. If he had used PVA as a removable core, he would have realized that despite extended washing with water, more than 10% of the usable pores in the lumen of the membrane remain clogged, and the membrane requires a wash with an aqueous solvent in which the PVA is far more soluble than in water. They would not have disclosed such a complex cleaning requirement.
The Problem:
Currently used braided multifilament membranes are more readily susceptible to damage than they should be, resulting in leakage. The inventors herein discovered that such damage, resulting in leaks, typically occurs at vulnerable "thin spots" where yarns overlap near the surface of the braid; further, that such overlap of multifilament yarns or broken yarn is also conducive to formation of "whiskers" or "fuzz" which initiates pin-hole leaks, resulting in a low bubble point. Since in the '444 patent, thin film is deliberately restricted to the upper portion of the tubular braid, the uncoated lumen is formed and reinforced with unprotected, braided yarn, prone to whiskering. Such yarn tends to trap contaminant particles entering with the backwash and broken whiskers contaminate the permeate.
Still further, the relatively greater thickness of multifilament braid, relative to the thin film of polymer overlying the surface of the braid, results in a non-uniform thin polymer film having poor adhesion and a variable, low peel strength. In those instances where the lumen of the braid is deliberately coated with polymer film, the annular thickness of polymer film is uncontrollable (as evident in the '607, '869 and '075 patents inter alia). Though the '517 publication presented the concept of using a dissolvable polymer core such as PVA, what remained to be discovered was (i) how to overcome the degradation problem of PVA, yet make a reliably uniform core, (ii) how to make a flexible non-degraded PVA core which is strong enough to withstand the forces required to make an open weave braid snugly supported on the core, (iii) how to overcome the problem of dissolving the PVA core within a reasonably short time, and (iv) how to ensure that upon solving the prior two problems, the resulting membrane would have unclogged pores. Clogged pores would greatly diminish the permeate efficiency of the membrane. The goal was to obtain higher permeate efficiency than that obtained with multifilament reinforced membranes, and to remedy the aforementioned problems of braided membranes exemplified by the '517, and '444 membranes.

Monofilament-reinforced hollow fiber membrane


In accordance with the present invention, there is provided an ear plug for preventing water and wind from entering the ear canal while allowing audible tones to pass therethrough. The ear plug is provided with an ear plug housing which is provided with an outer member and an inner portion. The outer member is adapted to reside in the outer ear of the user and an elongate tubular member having an exterior portion adapted to extend downwardly within the ear canal of the user. The ear plug is further provided with an ear plug insert. The ear plug insert is provided with a retaining member which is generally annular, a membrane which is made of a water impervious material and is adapted to allow audible tones to pass therethrough, and an insert housing which is generally annular. The insert housing is provided with a first end which is axially disposable in the interior portion of the elongate tubular member which is adapted to receive the first end of the insert housing. The insert housing is further provided with a second end which is adapted to circumferentially receive the retaining member with the membrane securely disposed between thereto, so as to axially enclose the second end of the insert housing thereby preventing water and wind from entering the ear canal while allowing audible tones to pass therethrough.

Surfers, swimmers, water skiers, and others who are in substantial contact with water often encounter problems with water entering the ear canal. This is particularly troublesome when the water entering the ear canal is relatively cold or becomes cold as a result of wind. A person subject to repeated conditions of this nature may develop a condition commonly referred to as surfer's ear (the development of bony stenosis of the external auditory canal due to diffuse exostoses).
The present invention relates to an improved ear plug. While simply plugging the ear canal may serve to prevent water and wind from entering the ear canal, the ability to hear audible tones may be substantially impaired. Previous efforts to keep water out without impairing the user's ability to hear have employed ear plugs with small openings to the ear canal. While such openings may impair the passage of water and wind, such a configuration, nonetheless, allows for the passage of undesired water and wind. Accordingly, there is a need in the art for a device which prevents water and wind from entering the ear canal while allowing audible tones to pass.


Methods of fabricating three-dimensional structures comprise: contacting a printing plate face with a suspension comprising particles to arrange the particles at predefined positions on the printing plate face, the predefined positions comprising a first position laterally adjacent to a second position; positioning the printing plate with the printing plate face turned toward a substrate and the first position aligned to a protrusion on the substrate; contacting the protrusion with a first layer of particles disposed at the first position of the printing plate to transfer the first layer of particles to a protrusion surface; moving the printing plate laterally to align the second position to the protrusion; and contacting the first layer of particles disposed on the protrusion surface with a second layer of particles disposed at the second position of the printing plate to transfer the second layer of particles to on top of the first layer of particles.

1. Field of the Invention
This invention relates to semiconductor device fabrication, and particularly to three-dimensional structures such as nanostructures and methods of fabricating the same using a printing plate.
2. Description of Background
Substantial attention has been directed to the design, implementation, and use of three-dimensional structures having well-controlled geometries and interesting optical, electrical, and/or mechanical properties. For example, three-dimensional nanostructures can comprise chemical compositions that allow them to exhibit photovoltaic, thermoelectric, diffractive, and other properties that are superior to those of other materials. Unfortunately, current methods for fabricating such three-dimensional nanostructures utilize lithography and etch processing techniques that are very complex and expensive to perform. Further, such methods are further limited by the availability of materials that can be patterned using lithography and etch techniques.
One particular type of three-dimensional structure that has received much attention is the electronic biosensor, which monitors the progress of certain biological systems. Biosensors have been described that include an array of electrode test sites in electrical connection with a plurality of conductive leads. The electrode test sites can be formed in a semiconductor wafer using photolithography and etch processing techniques. Further, the test sites can be coupled to associated detection circuitry via transistor switches using row and column addressing techniques employed, for example, in addressing dynamic random access memory (DRAM) or active matrix liquid crystal display (AMLCD) devices.
Other types of three-dimensional structures that have received much attention are photonic crystals and photonic bandgap structures. Such structures are often fabricated as two-dimensional structures because there is no economic way to fabricate them as three-dimensional structures. However, three-dimensional photonic structures are known to be much more effective. Additional types of three-dimensional nanostructures that have received increasing attention are metamaterials and thermoelectric materials. Metamaterials include a combination of different materials arranged in a defined three-dimensional geometry that causes them to exhibit extraordinary optical properties, e.g. a negative index of refraction. For visible light applications, metamaterials can require nanoscale building blocks.
There are ongoing efforts to increase the density of electrode arrays by reducing electrode and overlying lead or contact sizes to nanometer-or micrometer-scale dimensions, thereby producing "microelectrode arrays" (MEAs). However, it has been difficult to produce MEAs with very small dimensions using current top-down semiconductor fabrication methods. For example, current photolithography and etch techniques can be employed to pattern openings or vias in an insulation layer formed above the electrodes before filling those vias with a conductive material to form contacts to the electrodes. However, the ability of the photolithography and etch techniques to pattern small features is restricted by factors such as the resolution limits of the optical lithography system.
It is therefore desirable to develop a less demanding, inexpensive method for producing a large number of three-dimensional structures, particularly structures of small dimensions such as photonic crystals, nanostructures, metamaterials, microelectrode arrays, etc. It is further desirable to increase the number of materials available for forming such three-dimensional structures.

Three-dimensional structures and methods of fabricating the same using a printing plate

International Business Machines Corporation


A protection system implemented on one die of a multi-die package provides a discharge path for excess voltages incurred on one or more other die of the package. Ground paths are provided for certain circuitry in the package that have high noise-sensitivity, and ground paths are provided for certain circuitry in the package that have low noise-sensitivity relative to the high noise-sensitivity circuitry. The grounds of high noise-sensitivity circuitry of multiple die are shorted together, resulting in a common high noise-sensitivity ground. The grounds of low noise-sensitivity circuitry of multiple die are shorted together, resulting in a common low noise-sensitivity ground. A pre-designated removable path is included on the package external to the die, which shorts the common high noise-sensitivity ground and the common low noise-sensitivity ground. The removable path may be removed during manufacturing, if noise present on the shorted grounds results in unacceptable performance degradation.

Modern integrated circuits (ICs) are easily damaged by excess voltages. Common sources of these potentially damaging voltages include electrical overstress (EOS) and electrostatic discharge (ESD). ESD, a serious issue in solid state electronics, is a transfer of electrostatic charge between bodies or surfaces at different electrostatic potentials either through direct contact or through an induced electrical field. ICs which are built using semiconductors, such as silicon, and insulating materials, such as silicon dioxide, can be permanently damaged when subjected to higher voltages that may be produced by ESD events.
Traditionally, on-chip circuits are employed to protect the IC during an ESD event. In conventional IC ESD protection schemes, special clamp circuits are often used to shunt ESD current between the IC power supply rails and thereby protect sensitive internal elements of the IC from damage. Such clamping circuits typically have a timer circuit (e.g., a resistor-capacitor (RC) timer, which may be referred to as a "transient detector") and a large n-channel MOSFET device for discharging the high ESD current. Thus, a power rail clamp circuit is often employed within an IC so that if an ESD event is encountered on the IC's power rail, the clamp will turn on and reduce the voltage so that the IC's main devices (circuitry elements) will not get damaged. Implementations and use of such RC clamps are well-known in the art.
Exemplary ESD protection circuits include those described in U.S. Pat. No. 5,946,177 titled "Circuit for Electrostatic Discharge Protection", U.S. Pat. No. 6,327,126 titled "Electrostatic Discharge Circuit", U.S. Pat. No. 7,196,890 titled "Electrostatic Discharge Protection Power Rail Clamp with Feedback-Enhanced Triggering and Conditioning Circuitry", U.S. Pat. No. 5,654,862 titled "Method and Apparatus for Coupling Multiple Independent On-Chip VDD Busses to ESD Core Clamp", and Published U.S. Patent Application No. 2006/0250732 titled "Transient Pulse, Substrate-Triggered BICMOS Rail Clamp For ESD Abatement."
A given integrated circuit (IC) package may have multiple die implemented therein. Traditionally, there are on-chip ESD protection circuits which are integrated into the input/output (I/O) circuits to protect a given die during an ESD discharge event. These circuits provide the required protection for that particular die. Thus, in traditional ESD protection schemes for IC packages including multiple die, an ESD protection circuit may be implemented within each die for protecting its particular die against excess voltage events (e.g., ESD events) that arise within the particular die. As an example, an ESD protection circuit may have a pair of back-to-back diodes that are arranged within a given die for providing a discharge path for excess voltage events that arise within the given die. Similarly, another pair of back-to-back diodes may be arranged within another die for providing a discharge path for excess voltage events that arise within such other die. Such utilization of back-to-back diodes for providing an excess voltage discharge path is well-known in the art. In general, such diodes are usually reverse-biased (non-conducting) under normal operating conditions, but upon an excess voltage event (e.g., ESD) occurring which causes an excess charge on one side of the diode pair exceeding some threshold amount, a diode in the pair becomes forward-biased (conducting) so as to provide a discharge path for the excess voltage.
In a package that has multiple die, the I/O signals of one die may communicate with I/O signals of one or more other die in the same package. Different die in the package may have different levels of sensitivity to noise. For instance, these die in a given package may contain completely digital circuits or RF/analog circuits, which are highly sensitive to substrate noise and cross talk. Typically, if a die contains circuitry that is highly sensitive to noise (e.g., sensitive RF/analog circuits), it requires proper isolation from the substrate noise which may be introduced by another die, such as by a digital die in the package.
ESD protection for an overall package containing multiple die becomes more challenging due to such problems as noise isolation, cross talk, etc. Moreover, the communication between multiple die and the signals which interface between different power domains adds to the ESD vulnerability of the package.

System and method for excess voltage protection in a multi-die package


According to one embodiment, a pattern forming method is disclosed. The method includes forming a guide pattern, forming a block copolymer film that covers the guide pattern and includes first and second polymers, and forming a microphase-separation pattern including first portions of the first polymer and second portions of the second polymer which are alternately arranged by subjecting the block copolymer film to microphase separation. The method further includes measuring a position of the guide pattern, the first portions or the second portions by using a scanning probe microscope, determining whether a misalignment amount of the first portions with respect to the guide pattern is within a first range, based on the measured position of the first and the guide pattern, and removing the first portions, when the misalignment amount is within the first range.

Pattern forming methods in which directed self-assembly (DSA) techniques are used have been known. The pattern forming methods include, for example, a step of forming a guide pattern on an underlying film, a step of forming a block copolymer film covering the guide pattern and including first and second polymers on the underlying film, a step of subjecting the block copolymer film to microphase separation (heating process) and forming a microphase-separation pattern including first and second portions made of the first and second polymers, and a step of selectively removing part of the microphase-separation pattern.


An anti-CTLA4 (cytotoxic T lymphocyte associated antigen 4) and anti-PD-1 (programmed cell death 1) bifunctional antibody. a pharmaceutical composition thereof and use thereof. Particularly, the anti-CLTA4 and anti-PD-1 bifunctional antibody comprises a first protein functional domain that targets PD-1 and a second protein functional domain that targets CTLA-4. The bifunctional antibody can bind to CTLA-4 and PD-1 specifically, relieve immunosuppression of CTLA4 and PD-1 on an organism specifically, activate T lymphocytes, and thus has good application prospects.

Cytotoxic T lymphocyte associated antigen 4 (CTLA4) closely relates to CD28 in gene structure, chromosomal localization, homology of sequences and gene expression, and both of them are receptors of costimulatory molecule B7, and mainly expresses on the cell surface of activated T cells. Interaction of CTLA4 and B7 inhibits the activation of T cells in mice and human, and negatively regulates the activation of T cells.
Anti-CTLA4 antibody or CTLA4 ligand can prevent CTLA4 from binding to its natural ligand, thereby block the negative signal transduction in T cells induced by CTLA4, and enhance the response of T cells to various antigens, which has been confirmed by both in vivo and in vitro studies. Currently, clinical trials of anti-CTLA4 antibodies treating prostate cancer, bladder cancer, colorectal cancer, gastrointestinal cancer, liver cancer, and malignant melanoma, etc. are ongoing (Grosso J F., Jure-Kunkel M N., CTLA-4 blockade in tumor models: an overview of preclinical and translational research. Cancer Immun. 2013; 13:5. Epub 2013 Jan. 22).
Interleukin 2 (IL-2) produced by T cells is a cytokine regulating proliferation of certain subgroups of T cells, and a crucial factor regulating immune responses, promoting the proliferation of activated B cells and participating in antibody responses, hematopoiesis and tumor surveillance. Recombinant human IL-2 has been approved by the U. S. FDA for the treatment of malignant tumors (including melanoma, renal tumors, etc.) while undergoing clinical studies to treat chronic viral infections (Chavez, A. R., et al., Pharmacologic administration of interleukin-2. Ann N Y Acad Sci, 2009. 1182: p. 14-27). In in vitro experiments, anti-CTLA4 antibodies can specifically remove the immunosuppression of CTLA4, activate T cells, and induce the generation of IL-2, displaying promising prospects in therapies for neoplastic and parasitic diseases.
As crucial factors on T cell functions, CTLA4 and anti-CTLA4 antibodies have particular therapeutic effects via intervening immune microenvironment, displaying high efficacy and supplementing traditional medicine, thereby crafting new opportunities in therapies. The therapeutic effects of CTLA4 and anti-CTLA4 antibodies are investigated in various pre-clinical and clinical studies, such as inhibition of airway hyper-responsiveness in asthma animal models, prevention of the development of rheumatic diseases, and induction of immune tolerance in allogeneic transplantation, etc. Meanwhile, although no adverse effects have been found in short-term clinical trials, we should note the potential impacts of long-term usage of drugs targeting CTLA4, such as anti-CTLA4 antibody, might provoke autoimmune diseases due to over-blockage on CTLA4-B7 signal pathway. Since antibodies can bind specifically to its antigen and induce target cell lysis or block pathological progress, drug development of antibodies especially humanized antibodies is very important in treating malignant tumors or auto-immune diseases.
The transmembrane receptor PD-1 (programmed cell death 1, also known as PD-1) is a member of the CD28 gene family, expresses in activated T cells, B cells and myeloid cells. Receptors of PD-1, PDL1 and PDL2, belong to the B7 superfamily; wherein PDL1 is broadly expressed in a variety of cells including T cells, B cells, endothelial cells and epithelial cells, while PDL2 is only expressed in antigen presenting cells such as dendritic cells and macrophages.
T cells play an important role in clearing viral infections, but T cell antivirus responses are often associated with immunopathogenesis. Although negative regulation of T cell activation mediated by PD-1 is critical in reducing tissue damage caused by infection, blocking or inhibiting the PD-1 pathway might lead to autoimmune diseases, for example, PD-1 gene knockout mice showed more effective clearance of pancreatic virus infection, but led to more severe liver damage (Iasi et al., 2003, j. Exp. J Med, 198, 39-50). In addition, tumors with high PD-1 expression often develop into cancers that are difficult to detect (Hamanishi et al., 2007, Proc. Natl. Acad. Sci. USA 104:3360-5). An established method to regulate PD-1 expression is through injection of antibodies in vivo.
Due to the broad antitumor prospects and astounding efficacy of PD-1 antibodies, it is generally believed that antibodies against PD-1 pathways will lead to breakthroughs in the treatment of a variety of tumors: non-small cell lung cancer, renal cell carcinoma, ovarian cancer, melanoma (Homet M. B., Parisi G., et al., Anti-PD-1 Therapy in Melanoma. Semin Oncol. 2015 June; 42(3):466-473), leukemia and anemia (Held S A, Heine A, et al., Advances in immunotherapy of chronic myeloid leukemia CML. Curr Cancer Drug Targets. 2013 September; 13(7):768-74). Ever since the revelation of the unprecedented clinical efficacy data at the annual meetings of American Association for Cancer Research (AACR) and American Society of Clinical Oncology (ASCO) in 2012 and 2013, PD-1 antibodies have become the hottest new drugs in R&D in the global pharmaceutical industry.
Interferon gamma (IFN-γ) is produced naturally mainly by natural killer (NK) cells, natural killer T (NKT) cells, or by effector T cells consisting of CD4+ Th1 cells and CD8+ cytotoxic T lymphocytes (CTL) after being stimulated by specific antigens. As an important innate immune and acquired immune cytokine, IFN-γ plays an import role in antagonizing or inhibiting viral, some bacterial and protozoon infections. In the meantime, IFN-γ can activate macrophages and induce the expression of type 2 major histocompatibility complex (MHC) to activate immune responses to control the progression of tumors (Schoenborn J R, Wilson C B. Regulation of Interferon-gamma Durin g Innate and Adaptive Immune Responses. Advances in Immunology 2007; 96: 41-101).
Monoclonal antibodies (mAbs) targeting a single antigen have been used to treat cancers, inflammation, infectious diseases, etc. However, the cause and in vivo factors of many diseases are complicated, including up- or down-regulations of different proteins, cytokines or receptors in different signaling pathways, either inhibiting or promoting biological functions. Therefore, simultaneously blocking different targets can improve treatment efficacy, which can be achieved by combinations of drugs with different targets or by one drug with multiple targets, such as multispecific antibodies.
Bispecific antibody, also called bi-functional antibody targeting two different antigens at the same time, can be produced by immune sorting purification, as well as advantageous recombinant technologies with flexibilities in binding site optimization, format of synthesis, and production output. At present, there have been more than 45 forms of bispecific antibodies (Müller D, Kontermann R E. Bispecific antibodies for cancer immunotherapy: Current perspectives. BioDrugs 2010; 24:89-98). The IgG-scFv structure, named after Morrison, has been used in many bispecific antibodies, (1997 Coloma M J, Morrison S L. The Design and production of will be tetravalent bispecific antibodies. Nat Biotechnol. Nature Biotechnology, 1997; 15, 15, 9-163). Bispecific antibody with IgG-scFv structure has been proven as an ideal form of bispecific antibody with advantages in antibody engineering, expression and purification due to its similarity to the natural IgG format (Miller B R, Demarest S J, et al., Stability engineering of scFvs for the development of bispecific and multivalent antibodies. Protein Eng Des Sel 2010; 23:549-57; Fitzgerald J, Lugovskoy A. Rational engineering of antibody therapeutics targeting multiple oncogene pathways. MAbs 2011; 3:299-309).
However, bispecific antibodies have been developed mostly against antigens on the surface of two different cells, not against two different antigens on the same cell. Thus, a bispecific antibody drug against both PD-1 and CTLA4 needs to be developed.

Anti-CTLA4 and anti-PD-1 bifunctional antibody, pharmaceutical composition thereof and use thereof


A connecting position of a braid portion relative to a shield pipe is stabilized. A shield pipe in which a conductive wire constituting a wire harness is inserted, a braid portion that is connected to an end portion of the shield pipe and in which the conductive wire that is extended out of the shield pipe is inserted, an end member that is formed of a conductive material and that is mounted to an outer circumferential surface of the shield pipe while covering an end surface of the shield pipe, the braid portion being connected to an outer circumferential surface of the end member, and a crimp ring that crimps the braid portion onto the end member are provided. A positioning groove for positioning the crimp ring in an axial direction is formed on the outer circumferential surface of the end member.

Conventionally, in hybrid vehicles or electric automobiles, there are cases where a wire harness constituted by a plurality of wires is routed between a battery and an inverter in a state in which the wire harness is inserted in a metal shield pipe. An example of such a wire harness is disclosed in JP 2007-287335A.
The aforementioned wire harness is inserted in a shield pipe that is routed along an under-floor area of a vehicle. On the other hand, in a portion of the wires that is led out of the shield pipe, that is, in a region where the wires are routed toward the battery or the inverter, the wires are inserted in a metal braid portion, which serves as a flexible shielding member, so that the routing direction can be adjusted freely.
JP 2007-287335A is an example of related art.
In the above-described structure, the metal braid portion is connected to the shield pipe by placing the metal braid portion so as to cover an end portion of the shield pipe and, in this state, tightening a ring-shaped crimp member.
However, in the above-described structure, no measure for defining the tightening position (crimping position) of a crimping tool relative to the shield pipe is taken. Therefore, conventionally, the tightening position of the crimping tool is determined after manually measuring the distance from an end edge of the shield pipe, and thus it is not possible to perform the operation efficiently.


In one aspect, the present subject matter is directed to a sensor. The sensor includes an encapsulated fiber optic sensor and a ring shaped structure. The encapsulated fiber optic sensor passes through the ring shaped structure. The ring shaped structure is configured to resonate at a predetermined frequency.

Several major natural disasters, such as earthquakes, hurricanes or tsunami, have occurred in the last decades causing a large number of victims and a considerable monetary loss through the collapse of bridges, buildings, energy infrastructures, or transportation systems. Therefore, the needs to identify structural damage and to monitor its evolution impose the development of structural health monitoring (SHM) detection techniques. The main objective of the SHM research is to develop methods for observing in-situ structural behavior under different loading conditions during predetermined time periods or over the structure lifetime and to detect the deterioration of structural or material properties.
A wide range of sensors have been developed particularly for generating and receiving acousto-ultrasonic waves, exemplified by piezoelectric wafer active sensors (PWAS) and fiber Bragg grating (FBG) sensors. Both are effectively used in acousto-ultrasonic based damage identification because a single technology is not suited for the entire range of applications. FIG. 1 illustrates the set-up of the hybrid acousto-ultrasonic concept. Surface bonding or embedding are two ways of integrating the PWAS or FBG into a host structure. In the case of embedded, the mechanical behavior of the composite laminate are not degraded by the presence of the FBG or PWAS inclusion.
As such, it would be desirable to provide integrated miniaturize transducers that can be permanently bonded to the structure and left in place to be activated on demand and demonstrate that they can be used to monitor structural integrity in service conditions with high reliability & durability. It would also be desirable to develop a combined piezo-optical sensing system and to prove high reliability over the structure lifetime, since unjustified maintenance actions are quite costly to the operator.


Automatic optical inspection (AOI) systems are described comprising optical modules that include an illumination component and a lens array configured to direct illumination of the illumination component at a portion of a substrate. The lens array includes a Fresnel lens. The optical module includes a camera that receives reflected light resulting from an interaction of the illumination and the substrate. The camera includes a time delay integration (TDI) sensor. A telecentric imaging lens directs reflected light from the substrate to the camera. The illumination component comprises a controller coupled to multiple LED light sources, each emitting light at a different wavelength. The controller independently controls each LED light source. The illumination component includes a bright field and/or a dark field light source. The illumination component can include a front side and/or a back side light source. An optical fiber is coupled to the camera and an image processor.

Defect monitoring and control are critically important in the manufacturing and production of large substrates like for example the substrates used in flat panel displays (FPDs). The FPDs are flat panel display screens used for portable personal computers (PCs), flat desktop monitors, mobile phones and digital devices, car navigation systems, video cameras, projection and the recently introduced flat and thin LCD televisions, and many other large and small display screens on various devices and appliances. The FPDs include, for example, Thin Film Transistor-Liquid Crystal Display (TFT-LCD) substrates. A typical LCD consists of two transparent substrates (typically glass) with control circuitry (TFT) and optical filters printed on their surfaces and filled with liquid crystal material between the two substrates. The FPD manufacturing process is complex and carried out in a highly sterile environment. Production of FPDs is susceptible to various defects introduced during the fabrication process, which may force the manufacturer to discard or repair panels. Hence the production yield suffers and product cost increases. Therefore, detection of defects in the substrates is critical to the manufacturer's success.
There are many types of defects in the TFT manufacturing process, including, but not limited to, fall-ons (particles of foreign material that fell on the glass during manufacturing), opens and shorts (a trace that became open and separate traces that became connected, respectively), chemical residues (puddles of chemicals left on the surface), and pinholes (through holes that create shorts between layers). These defects can result in deficiencies from dead pixels to malfunctioning panels.
Substrate inspection during steps of the manufacturing process facilitates quality control and process control, and helps minimize material loss resulting from those manufacturing defects. The inspection of FPDs presents special technological challenges because of the transparent materials used, multi-layer structure, high-density features, fine nature of potential defects (measured in single microns), large substrate area, and tact time (i.e., throughput) requirements. Automatic optical inspection (AOI) is used in the manufacturing processes of TFT-LCDs and semiconductor integrated circuit (IC) chips to diagnose the quality of manufactured components and improve the yield of the production, thus reducing manufacturing costs.
Conventional AOI systems use a camera to generate an image of the substrate. The resulting image is analyzed in an attempt to detect defects in the substrate. Analysis of the image provides information of defects, where the defect information includes one or more of location (e.g., x-coordinate position, y-coordinate position, data, gate, zone, etc.), size, and type of the defect. Additionally, the analysis provides information of trends in the number of defects as well as the defect type and location. The information of the analysis helps manufacturers optimize their yield management.
The fundamental performance of AOI is measured predominantly using the key specifications of speed and sensitivity of inspection. The advances in manufacturing technology have lead to higher speeds of fabrication, substrates having increasingly larger sizes, and printed patterns (on substrates) having ever smaller dimensions, all of which result in a more demanding need for AOI with higher speed and better sensitivity. Consequently, there is a need for AOI systems and methods that provide relatively high-speed analysis of large panel substrates (e.g., LCD glass substrates, semiconductor wafers, etc.) while delivering high resolution images and providing higher levels of sensitivity in defect detection.

Automatic inspection system for flat panel substrate


In one embodiment, a method includes, by one or more computing systems: receiving one or more non-video inputs, where the one or more non-video inputs include at least one of a text input, an audio input, or an expression input, accessing a K-NN graph including several sets of nodes, where each set of nodes corresponds to a particular semantic context out of several semantic contexts, determining one or more actions to be performed by a digital avatar based on the one or more identified semantic contexts, generating, in real-time in response to receiving the one or more non-video inputs and based on the determined one or more actions, a video output of the digital avatar including one or more human characteristics corresponding to the one or more identified semantic contexts, and sending, to a client device, instructions to present the video output of the digital avatar.

In computing, an avatar is a graphical representation of a user or entity. It may take either a two-dimensional form as an icon or a three-dimensional form, as in games or virtual worlds. Avatars can be used as virtual embodiments of embodied agents, which are driven more or less by artificial intelligence rather than real people. Automated online assistants are examples of avatars used in this way.