A mirror assembly adaptable for use in conjunction with a microscope comprises a sapphire substrate having an outer surface for forming a damage-resistant first surface, and an inner surface with a layer of reflective material adhered to the inner surface of the sapphire substrate for providing a reflective second surface to produce a mirror optical image. The sapphire substrate provides support and protection for the reflective material layer and reflective second surface, whereby a bright, single, mirror optical image is provided for microscopic magnification.

The use of hand mirrors for examining inside the mouth during dental procedures is well known. Traditionally, most mirrors were utilized to examine the interior of the mouth and the exterior surfaces of the teeth. As such, they were large enough to provide the dentist or oral surgeon with an image which could be viewed with the naked eye. Endodontic procedures, however, involve work on the interior of a tooth within very small spaces and thus have produced the need for a substantially smaller mirror surface for providing an image of the interior dental tissue or root of the tooth.
During endodontic surgical procedures, such as retrofilling preparations on the inner end or tip of a tooth root, a small opening or aperture is formed, generally through the jaw bone and the tissue surrounding a tooth, to provide exposure of the dental root. To form the apertures for working on the tooth root, very small drills are utilized so that the required interior work space will be very small. The surgical work is performed using a surgical microscope to view the tooth root in the small work space that is created by drilling through the jaw proximate the tooth root. An endodontic mirror is used to provide a reflected optical image, and the microscope then magnifies the reflected optical image provided by the endodontic mirror for viewing by the surgeon. Because of the small work space, the endodontic mirror must be very small, but still must be capable of providing a bright, distortion-free optical image for magnification by the microscope.
Endodontic mirrors are available for such applications, as evidenced by U.S. Pat. No. 5,269,683, issued to Hickok et al. While the Hickok et al. mirror is suitable for providing a useful optical image, it has a variety of drawbacks which affect the quality of the optical image provided and thus affect the overall endodontic procedure. First, the mirror is a single surface mirror which has an exposed reflective surface of polished tungsten-carbide. The tungsten-carbide has been found to absorb a significant amount of visible light, thus reflecting an optical image of reduced brightness to the microscope. Endodontic surgical microscopes, however, require a large amount of light for work in the small, dark spaces of the interior of the jaw proximate a tooth root. Low light conditions and a darkened optical image during an endodontic microsurgical procedure are not only annoying to the surgeon, but also may affect the surgeon's ability to perform the procedure efficiently and properly.
An additional drawback to available endodontic mirrors is their susceptibility to damage by other endodontic instruments used during a microsurgical procedure inside the mouth. The mirrors are usually what are referred to as "first surface mirrors," and their reflective surface is exposed. Therefore, the reflective surface is easily scratched by irrigator tips and probes which are generally made out of stainless steel. Therefore, great care must be taken during the endodontic procedure to avoid contacting the exposed reflective surface with other, harder instruments. However, contact is often unavoidable and damage results. A damaged reflective mirror surface further degrades the optical image provided to the microscope.
One way to reduce such damage to the reflective surface is to provide a protective surface or layer on top of the reflective surface to thus create what is referred to as a "second surface" mirror. However, second surface mirrors have traditionally been subject to double imaging or "ghost" imaging. Light reflects from not only the second reflective surface, but also from the first protective surface, and thus provides second or ghost images of the area of interest. Ghost images are very undesirable in microscopic endodontic surgery wherein it is oftentimes difficult to obtain a suitable single optical image. The microscope magnifies these double images and makes detailed examination of the root end difficult.
Another drawback to existing endodontic mirrors is that they are susceptible to chemical and heat damage. Endodontic implements must be sterilized between uses. Usually a high temperature autoclave (.about.200.degree. C.) is used to heat the implements for sterilization. The reflective surface of first surface mirrors may be subject to warpage and other temperature-induced damage during autoclaving. Furthermore, aggressive chemicals utilized in chemical sterilization procedures degrade the optical surface. Still further, weak acids often present in the mouth can adversely affect an endodontic mirror's reflectivity.
Available endodontic mirrors have also been relatively expensive and generally are not made for use with universal dental handles. Each mirror is machined with its own dedicated handle which creates a substantial expense for the endodontic surgeon, who will generally require a number of endodontic mirrors having different sizes and shapes.
Accordingly, it is an object of the present invention to provide a highly reflective endodontic mirror which provides a bright optical image for microscopic surgical procedures.
It is another objective of the present invention to provide a mirror which is durable and damage resistant, and which may be manipulated with other surgical instruments in an endodontic procedure without degrading the reflective surface.
It is still another objective of the present invention to provide a clear, usable optical image without double imaging or ghost imaging.
It is another objective to provide an endodontic mirror which is relatively inexpensive and suitable for use with existing dental equipment such as universal dental handles.
It is still another objective of the present invention to provide an endodontic mirror which is highly resistant to repeated sterilization and exposure to chemical solutions which are encountered during endodontic procedures.

Mirror assembly for use in endodontic procedures


The present invention provides a method of making an imaged media and a method of displaying an image, comprising the steps of providing a color image, creating a modified image by transforming a first color portion of the color image into a gray-scale portion, wherein a second color portion of said color image remains in color in said modified image, and reproducing said modified image on a fully or partially light transmitting media which can be used to display the modified image in color.

With growth of the color changing illumination market, there has been a challenge in effectively demonstrating and/or representing the effects of color changing illumination on large areas or objects such as swimming pools, architecture etc.
This is presently attempted by expensive, yet relatively ineffective, video, or by still color photography. This still photography is sometimes shown as color photographs with white front lighting or as color transparency with white backlight.
There is also demand for eye-catching marketing displays, including Point-of-Purchase (PoP) displays that use color lighting or even color changing lighting for grabbing attention.
These PoPs typically use mechanical, moving, secondary objects or transparencies as part of the primary image or in front of or behind the primary image. They may use fiber-optics to create color-changing points of light. These solutions typically require labor intensive construction, including sign and letter masking, as well as fiber placement and complex color wheel design.
It would be desirable to solve these problems and shortcomings in a cost-effective and satisfactory manner. Point of purchase displays, night-display billboards, trade-show displays, portable salesman displays, home or office décor/novelty, training aid could all utilize an effective solution.


A lipstick case is composed of a tubular base, a tubular housing, a push rod, and a tubular cap. The tubular housing is fitted into the tubular base. The push rod is located at the bottom end thereof by a pillar at the bottom of the tubular base such that the push rod is received in the tubular housing. The push rod is provided at the top end thereof with a receptacle for holding the bottom end of a lipstick. As the tubular cap is lifted, the tubular housing is actuated to move up to shield the lipstick. The tubular housing can be turned back into the tubular housing to expose the tip of the lipstick.

The conventional lipstick case is defective in design in that a woman must use one hand to hold the tubular base of the lipstick case and another hand to turn the base to extract the lipstick to facilitate the application of the lipstick. In addition, the conventional lipstick case is provided with a tubular cap which can often cause a scratch on the lipstick at the time when the tubular cap is removed from the lipstick case.


A method and related computer program product for achieving high performance I/O write rates in a redundant array using a fully recoverable communication queue stored in NVRAM on a RAID controller comprising, receiving an I/O write request from an application, determining if the I/O request is an inline write command, writing inline write commands into a command queue stored in NVRAM, notifying the application generating the I/O request of command completion and requesting the operating system for further I/Os.

There are many applications, particularly in a business environment, where there are needs beyond what can be fulfilled by a single hard disk, regardless of its size, performance or quality level. Many businesses can't afford to have their systems go down for even an hour in the event of a disk failure. They need large storage subsystems with capacities in the terabytes. And they want to be able to insulate themselves from hardware failures to any extent possible. Some people working with multimedia files need fast data transfer exceeding what current drives can deliver, without spending a fortune on specialty drives. These situations require that the traditional "one hard disk per system"model be set aside and a new model be employed for storage. This technique is called Redundant Arrays of Inexpensive Disks or RAID. ("Inexpensive" is sometimes replaced with "Independent", but the former term is the one that was used when the term "RAID" was first coined by the researchers at the University of California at Berkeley, who first investigated the use of multiple-drive arrays in 1987. See D. Patterson, G. Gibson, and R. Katz. "A Case for Redundant Array of Inexpensive Disks (RAID)", Proceedings of ACM SIGMOD '88, pages 109-116, June 1988.
The fundamental structure of a RAID is the array. An array is a collection of drives that is configured, formatted and managed in a particular way. The number of drives in the array, and the way that data is split between them, is what determines the RAID level, the capacity of the array, and its overall performance and data protection characteristics.
A RAID appears to the operating system to be a single logical hard disk. RAID employs the technique of "striping", which involves partitioning each drive's storage space into units ranging from a sector (512 bytes) up to several megabytes. The stripes of all the disks are interleaved and addressed in order.
Most modern, mid-range to high-end disk storage systems are arranged as RAID configurations. A number of RAID levels are known. RAID-0 "stripes" data across the disks. RAID-1 includes sets of 1 data disk and 1 mirror disk for keeping a realtime copy of the data disks. RAID-3 includes sets of N data disks and one parity disk, and is accessed via specialized hardware which combines the data from the synchronized spindles. RAID-4 also includes sets of N+1 disks, however, data transfers are performed in multi-block operations. RAID-5 distributes parity data across all disks in each set of N+1 disks. RAID levels 10, 30, and 50 are hybrid levels that combine features of level 0, with features of levels 1, 3, and 5. One description of RAID types can be found at the Search Storage web page TechTarciet definition "RAID". May 2004.
Thus RAID or Redundant Array of Independent Disks is simply several disks that are grouped together in various organizations to improve the performance and/or the reliability of a computer's storage system. These disks are grouped and organized by a RAID controller.
All I/O to a redundant array is channeled through the RAID controller. The operating system sends an I/O request to the host driver. The host driver communicates the I/O request through an interconnect such as a PCI or ISA bus to the RAID controller. These I/O requests are then issued by the RAID controller to respective disks in the array.
Most RAID configurations have a parity block in each stripe that allows data recovery if a disk in the array fails or is corrupted. If a disk in the array is written to every time there is a write command then the parity block will have to be re-calculated each time there is a write. For example in a RAID 5 array, writing each block individually involves reading the old data block, reading the parity block, computing the new parity block, writing the new data block and writing the parity block. Thus each write command requires computation of the parity block and four accesses to the disk. This causes increased write latency and lower I/O throughput. If the writes to a stripe in the array are cached and written together, then this reduces the number of accesses to the disk and requires only one computation of the parity block, thereby reducing the write latency and increasing I/O throughput. This technique is commonly known as write back caching. Most RAID controllers today implement write back caching by storing successive writes in main memory or NVRAM (Non-Volatile Random Access Memory) and then performing multiple writes to the disk simultaneously, thereby avoiding the need to read multiple old data blocks and perform multiple re-calculations of the parity block for each write. This technique minimizes disk accesses and thereby minimizes disk head movement resulting in lower latency.
The rate at which I/Os can be received from the OS and issued to a disk in a redundant array is optimized by a RAID controller so as to minimize disk head movement. Conventional RAID controllers send an interrupt to the OS for further I/Os after previously received I/Os have been issued to the appropriate disks or the controller has saved the write data in memory (write back caching). This technique allows writes to take place from NVRAM while new I/O requests are being received from the OS. Data stored in NVRAM is recoverable during reboot in the event of system failure. However, this method involves the delay of first writing the command to the command queue and then backing up the data in NVRAM, followed by writing a response indicating command completion to the response queue before the RAID controller can send an interrupt to the OS and request new I/Os. The time interval between writing the command to the command queue, backing up the data in NVRAM, writing a response to the response queue and then sending an interrupt to the OS and receiving new I/Os results in significant latency and reduces I/O throughput.
DMA (Direct Memory Access) write requests have to be processed as they are received because the data is usually too large to be stored as part of a command. The user can only be notified of command completion when the DMA access has been completed (or the DMA has backed up the data in NVRAM) and a response has been written to the response queue. However, this is not the case for smaller sizes of write data.
"Inline data" refers to smaller write data sizes (typically 512 bytes to 1Kb). "Optimal inline maximum" refers to data sizes typically greater than 16Kb. Inline data can be included with the command as part of a command write packet. "Inline write commands" are commands that have inline data included with the command as part of a command write packet. These commands need not have the restrictions associated with DMA write requests as mentioned above.
What is needed is a method to reduce the latency involved with processing inline write commands.

Method and computer program product to increase I/O write performance in a redundant array


Noise-making assemblies are presented including: a self-recovering stretchable element; and at least one noise-making element mechanically coupled with and along the self-recovering stretchable element at a number of attachment points, where the at least one noise-making element forms slack portions between the number of attachment points when the self-recovering stretchable element is in a relaxed position, where the slack portions are flattened when the self-recovering stretchable element is in an extended position, and where when the self-recovering stretchable element extends from the relaxed position to the extended position, the at least one noise-making elements emits a noise.

Many domestic dogs and cats enjoy interacting with their owners and with other dogs and cats by grasping a play object in their mouth or in one or more of their paws while the owner or other dog or cat grasps the same play object. As a result, a "tug of war" play session may ensue. In some examples, a cat may "bat" at an object hanging from a string or other tether-like structure and grasp the object with one or more claws and pull on it. One such play object is disclosed in U.S. Pat. No. 5,611,297. In addition to pet/owner play, a baby or toddler may grasp and pull on a noisemaking device affixed to a crib, gym structure, or other stable mount apparatus. For all of these examples, some commercially available dog, cat, and baby toys include noisemaking elements that activate when the object is grasped, squeezed, shaken and/or tugged in order to pique an animal's or a child's interest and to further excite them during play with the object. Such noisemaking elements typically include: rattlers, bells, pneumatically operated squeakers, electronically generated noisemaking units, and "crackling" elements.
Crackling elements provide a crackling, crinkling or rustling sound and a small vibration when deformed, such as when bent, straightened or compressed. Examples of objects and materials that are able to produce this effect include: plant-based paper, acetate paper, aluminum foil, polypropylene, MYLAR® (polyethylene terephthalate film) and various other polymers. Crackling elements have been used in pet toys for some time, including the above referenced U.S. Pat. No. 5,611,297 as well as U.S. Pat. No. 8,397,672. In the U.S. Pat. No. 8,397,672, crinkling elements are "sandwiched" in a plush fabric and serve to enhance a cat's sense of hunting as the cat attempts to walk on the fabric. In the U.S. Pat. No. 5,611,297, crinkle elements are attached on a surfaces contacted by the pet and are designed to emit noises when struck by a pet. However, none of these conventional solutions provide a manner in which active tugging play may be achieved that results in crackling. As such, noise-making assemblies are provided herein.


In an apparatus used to irradiate body tissue with high-intensity laser light, a probe with at least one waveguide is used which can be coupled with a laser light source and which at its light-exiting section, which can be inserted in the body tissue, is equipped with a diffuser element which consists of a base material that is highly transparent to the laser light and, dispersed therein, scattering particles that deflect the light rays, and with a first cover tube that surrounds the waveguide at a distance, that connects to a coolant source, that is open at its distal end and that, at least in the region of the diffuser element, is made of a transparent and good heat-conducting material, a device for modifying beam intensity is situated in the path of the laser beam before the input coupling point, with the waveguide in the region of the light-exiting section being surrounded by a reflector and/or absorber that has at least one light outlet in the region of the target radiation surface.

The laser has been used since 1983 for interstitial heating of biological tissue. In the meantime, various probes and applicators have been developed to irradiate laser light into human tissue. Corresponding devices are described in German patent applications open to public inspection 38 13 227, 41 37 983, 42 13 053 and 42 21 364.
The previously described systems are constructed according to one more or less similar principle. The laser light is launched into an optical element located in the tip of the waveguide through a waveguide. Here as a rule it is a question of mirrors or prisms as well as special diffusers which permit an even irradiation of the laser light in all directions of space. These systems are provided in part with a cooling circuit for an additional modification of the temperature area profile, as this is, for example, described in DE-A-42 21 364, from which the preamble of claim 1 proceeds. A main problem of all interstitial heating procedures is, however, the exact adaptation of the temperature area profiles to the given tissue lesion. This will be sketched briefly with reference to the example of prostatic hyperplasia.
The prostate is divided anatomically into a right and a left prostate lobe as well as a median lobe. The geometrical extension is indeed similar in a normal prostate, apart from differences in size. The intensities of pathological changes are, however, extraordinarily different from patient to patient. In addition to a general enlargement of the prostate, there are also found isolated changes in the right or left prostate lobes as well as in the median lobe. Moreover, of course, very different combinations of these pathological changes can occur in individual cases. In addition to this, it frequently results that the target tissue reacts differently to laser radiation although the irradiation profile was adapted to the lesion. The temperature distribution can thus assume undesirably excessively high or, however, even too low temperatures during the irradiation. A similar problem emerges in connection with irregularly formed tumors, whereby especially the histological composition within the tumor (living cells, necroses, hemorrhages, vessels) can supervene in an aggravating manner. A laser probe which solves this problem has not been described until now.

Apparatus for irradiating body tissue with laser light


A method is described of producing thin layers (below 10 μm in thickness) by directing droplets (preferably by inkjet printing techniques) onto precise locations on a substrate, the liquid of the droplets having a viscosity such that the droplets, on impact with the substrate, spread out to form relics on the substrate that are at least 1.4 times the diameter of the droplets in flight, adjacent droplets merging to form a continuous layer on the substrate. The droplets may have different compositions to form images within the layer. Successive layers may be added to built up a three dimensional structure whose properties can be tailored by the compositions used to build up a composite.

It is known from the prior art to apply thin layers and films to a substrate using many techniques, for example printing and screen-printing. Inkjet and laser printers will also produce thin films of ink.
It is known to use jet printing techniques to form three dimensional objects; for example in U.S. Pat. Nos. 5,059,226 and 5,140,937 there is disclosed the direct jetting of curable materials onto a substrate. In WO 97/48557 and WO 99/19900, there is described a method of forming three dimensional features on a surface using successive drops of inkjetted material to build up a deposit. The deposit is generally built up vertically to produce three dimensional objects, for example Braille characters and multi-layer optical and electrical devices.
Plastic layers and films capable of controlling electromagnetic radiation are important. U.S. Pat. No. 6,024,455 demonstrates the application of such plastic materials. The method described involves the melt co-extrusion of two (isotropic) polymers to produce a laminate film made up of hundreds of thin, alternating, layers of the two polymers. The layers are 0.1 μm thick or thinner.
To achieve controlled final optical properties, it is essential that the layers are dimensionally precise in the micro and macro dimensions, as well as optically clear.
Careful choice of the polymers gives control of light absorption, transmittance and reflection. High speed film web formation from the method described in U.S. Pat. No. 6,024,455 is clearly possible. However, it is difficult with this method to vary, readily the macro, micro and nano properties within each layer and between each layer.
The alignment of liquid crystal phases is usually brought about by a polyamide alignment layer that is in contact with the liquid crystals; U.S. Pat. No. 5,539,074. U.S. Pat. No. 5,567,349 and U.S. Pat. No. 5 593 617 disclose forming the alignment layer by polymerisation under polarised light of a layer that has been applied by spin coating. EP 1 227 347 discloses a process of jet printing an alignment layer followed by depositing a layer of cross-linkable liquid crystal in a volatile diluent.
U.S. Pat. No. 5,855,836 discloses a hot-melt system, in which a solid formulation is heated until it melts and is jet dispensed in a desired pattern on to a substrate. It then cools and solidifies, and the sequence is repeated to build a 3-dimensional object. The formulation includes a reactive component which is finally activated to cure the object. Since wax like materials are used, the formed layers are opaque and this method forms thick layers, e.g. 50 μm. Another disadvantage here is that the materials available are extremely limited. A related process is described in U.S. Pat. No. 5,059,266 and U.S. Pat. No. 5,140,937 involving direct jetting of curable materials. This is used for forming shaped 3 dimensional objects and not films.
It is also known to use red, green and blue filters in liquid crystal displays, which are deposited by jetting suitable pigments contained in suitable binders and solvents into a well.
One common feature with the prior art techniques is that the dispensed droplets of liquid are directed onto specific locations on a substrate so that the droplets adhere to the substrate in substantially the precise areas that the droplets land in order that the resulting deposit produces an image or print with as high (fine) a resolution as possible. This makes it hard to form a layer of substantially uniform thickness. In addition, when resins or curable resins are jet deposited they are generally supported in a volatile diluent.
There is an emerging need to produce on demand thin films made up of resins having active functionality for various purposes. For example: some polymeric resins have an active property, which may for example be physical, chemical, optical, electro-optical, magnetic or electrical (e.g. birefringence/wave guiding effects from liquid crystalline resins), or light emitting effects from organic/inorganic light emitting resins, electrical conducting effects from conducting resins. In particular, the capability to vary and integrate a variety of such active resins, in their active state (i.e. as tracks or patterns or circuits), within a layerwise plastic frame around the active resin is contemplated to be important in the future. In particular forming the active resin from suitable monomeric, oligomeric (pre-polymers) resin mixtures would allow greater flexibility in controlling the final active properties required.
In the field of security printing, the art is looking for new methods of creating authenticating materials that cannot be reproduced unlawfully and yet can readily be verified. Having these security features embedded within thin layers of polymeric material(s) would yield unusual effects in addition to the effects from the layering structure
U.S. Pat. No. 5,945,463 and U.S. Pat. No. 6,277,929 disclose a photocurable resin composition comprising a high molecular weight resin and a curable diluent that can be extruded to form a thick layer approx. 1 mm thick that is then photocured.

Production of composites articles composed of thin layers

Huntsman Advanced Materials Americas Inc.


A capacitor (FIGS. 6-9) includes one or more extended surface lands (604, 704, 804, 904, FIGS. 6-9). In one embodiment, each extended surface land is a land on a top or bottom surface of the capacitor, having a land length that is equal to at least 30% of the width (614, FIG. 6) of the capacitor or 20% of the length (914, FIG. 9) of the capacitor. When embedded within an integrated circuit package (1102, FIG. 11), two or more vias (1112) can be electrically connected to the extended surface lands (1108).

The present invention relates generally to discrete capacitors, and more particularly, to surface lands on the surfaces of discrete capacitors, and methods of capacitor fabrication.
Electronic circuits, and particularly computer and instrumentation circuits, have in recent years become increasingly powerful and fast. As circuit frequencies continue to escalate, with their associated high frequency transients, noise in the power and ground lines increasingly becomes a problem. To reduce such noise, capacitors known as decoupling capacitors are often used to provide a stable signal or stable supply of power to the circuitry. Capacitors are farther utilized to dampen voltage overshoot when an electronic device (e.g., a processor) is powered down, and to dampen voltage droop when the device powers up.
Decoupling capacitors and capacitors for dampening voltage overshoot or droop are generally placed as close as practical to a die load in order to increase the capacitors"" effectiveness. Often, the capacitors are surface mounted to the die side or land side of the package upon which the die is mounted. FIG. 1 illustrates a cross-section of an integrated circuit package 102 having die side capacitors 106 and land side capacitors 108 in accordance with the prior art. Die side capacitors 106 are mounted on the same side of the package as the integrated circuit die 104. In contrast, land side capacitors 108 are mounted on the opposite side of the package 102 as the die 104.
FIG. 2 illustrates an electrical circuit that simulates the electrical characteristics of the capacitors illustrated in FIG. 1. The circuit shows a die load 202, which may require capacitance or noise dampening in order to function properly. Some of the capacitance can be supplied by capacitance, as modeled by capacitor 204, located on the die. Other capacitance, however, must be provided off chip, as indicated by off-chip capacitor 206. The off-chip capacitor 206 could be, for example, the die side capacitors 106 and/or land side capacitors 108 illustrated in FIG. 1.
Naturally, off-chip capacitor 206 would be located some distance, however small, from die load 202, due to manufacturing constraints. Accordingly, some inductance, as modeled by inductor 208, exists between the die load and the off-chip capacitor 206. The value of the inductor 208 is related to the xe2x80x9cloop area,xe2x80x9d which is the electrical distance from die load 202, through capacitor 206, and back to die load 202. Because inductor 208 tends to slow the response time of off-chip capacitor 206, it is desirable to minimize the loop area, thus reducing the value of inductor 208.
Referring back to FIG. 1, die side capacitors 106 are typically mounted around the perimeter of die 104, and provide capacitance to various points on the die through traces, vias, and planes (not shown) in the package 102. Because die side capacitors 106 are mounted around the perimeter, the path length between a die load and capacitor 106 may result in a relatively high inductance feature between the die load and capacitor 106.
In contrast, land side capacitors 108 can be mounted directly below die 104, and thus directly below some die loads. However, the package also includes land side connectors (not shown), such as pins or lands. In some cases, placement of capacitors 108 on the package""s land side would interfere with these connectors. Thus, the use of land side capacitors 108 is not always an acceptable solution to the inductance problem.
FIG. 3 illustrates a top view of an eight contact discrete capacitor 300, which can be used as a decoupling capacitor or to dampen voltage overshoot or droop, in accordance with the prior art. Contacts 302 provide electrical connections to electrodes of an internal capacitor structure within capacitor 300. Going clockwise from the upper left contact 302, the polarities of contacts 302 alternate between positive and negative. This results in opposing contacts (i.e., contacts directly opposite each other) having opposite polarities. Each contact 302 includes surface lands 304 on the top surface 308 and bottom surface of capacitor 300.
Referring also to FIG. 4, which illustrates a side view of a discrete capacitor in accordance with the prior art, each top and bottom land pair is electrically connected through a side termination 402 on the side surface 404 of the capacitor. Inner electrodes (not shown) electrically connect with the side terminations 402, and thus with the surface lands 304.
The length of lands 304 is indicated by dimension 312. Generally, the land length is designed to be a length that allows a reliable, surface mount solder attachment. A ratio of the length 312 of surface lands 304 to the width 310 of capacitor 300 is typically about the same for most devices. For example, a capacitor having a width 310 of 1.3 millimeters (mm) would typically have lands 304 with lengths 312 of about 0.3 mm, which is approximately 23% of the width 310 of capacitor 300.
Capacitors sometimes have more or fewer contacts, as well. For example, FIG. 5 illustrates a top view of a ten contact discrete capacitor 500 in accordance with the prior art. Eight of contacts 502 contact the sides of capacitor 500, and are referred to herein as xe2x80x9cside contacts.xe2x80x9d Two of contacts 504 contact the ends of capacitor 500, and are referred to herein as xe2x80x9cend contacts.xe2x80x9d Going clockwise from the upper left contact 502, the polarities of contacts 502, 504 alternate between positive and negative. Unlike the capacitor illustrated in FIG. 3, this results in opposing side contacts 502 having the same polarities, while end contacts 504 have opposite polarities.
The lengths of the side and end contact surface lands are represented by dimensions 512 and 514, respectively. As with the capacitor 300 illustrated in FIG. 3, the ratio of the length 512 of the side contact surface lands to the width 510 of capacitor 500 is typically about the same (e.g., about 23%) for most capacitors. In addition, the ratio of the length 514 of the end contact surface lands to the length 516 of capacitor 500 is also typically about the same. For example, a capacitor having a length 516 of 2.0 mm would typically have end contact lands with lengths 514 of about 0.3 mm, which is approximately 15% of the length 516 of capacitor 500.
As electronic devices continue to advance, an increasing need exists for higher capacitance with reduced inductance for decoupling, voltage dampening, and supplying charge. In addition, a need exists for capacitance solutions that do not interfere with package connectors, and which do not limit the industry to certain device sizes and packing densities. Accordingly, there is a need in the art for alternative capacitance solutions in the fabrication and operation of electronic devices and their packages.

Capacitor with extended surface lands and method of fabrication therefor


In a chemical reactor, a gas and a liquid which are in trace volumes are used to produce air bubbles and thus increase the interface area between the gas and liquid, substantially enhancing the efficiency of reaction between the gas and liquid. The chemical reactor comprises the following: a sheath flow forming block which forms a plurality of alternating sheath flows with two mutually unmixable fluids; a plurality of inlet ports through which said two fluids flow into the sheath flow forming block; a contraction zone which simultaneously contracts a plurality of sheath flows formed in the sheath flow forming block; and reaction flow channels each of which is connected with said contraction zone and is smaller in width than the sheath flow forming block.

A device which allows chemical reaction in a microreactor is disclosed by Japanese Patent Laid-Open No. 2000-298079. In this chemical reactor, one flow channel to induce reaction is provided for each liquid. In this method, however, it is difficult to increase the microreactor's throughput on a per-cubic-volume basis. In the reactor, there is only one pair of flow channels and it is easy to separate two liquids which are used for reaction.
Patent Document: Japanese Patent Laid-Open No. 2000-298079
When the sheath flow technique is used for chemical reaction between liquids, a smaller sheath flow width leads to a higher reaction speed. However, when the sheath flow width decreases, the throughput per unit time decreases. Therefore, it is desirable to form multiple sheath flows. After chemical reaction has been made using multiple sheath flows, the two liquids must be separated. However, since they have to be separated outside the microreactor, or in a macro structure, the overall chemical reaction speed will decline.


A method for evaluating a plane orientation dependence of a semiconductor substrate comprises: forming a hard mask on a semiconductor substrate having plane orientation (100); anisotropically etching the semiconductor substrate with use of the hard mask as a mask to obtain a surface oriented in a specific crystal orientation; and evaluating a plane orientation dependence of the semiconductor substrate by use of at least a portion of the surface oriented in a specific crystal orientation.

1. Field of the Invention
The present invention relates to a method for evaluating a dependence of properties of a semiconductor substrate on a plane orientation (referred to as plane orientation dependence) and a semiconductor device manufactured using the method.
2. Description of the Prior Arts
The plane orientation is an important factor in physical properties of a crystalline semiconductor (e.g., silicon, etc.,) substrate including a rate of thermal oxidation, a rate of etching, electron mobility and the like. In particular, the plane orientation gives a great influence to the rate of thermal oxidation, i.e., a growth rate for a thermal oxidation film formed on a surface of a silicon substrate. The rate of thermal oxidation is the slowest on a surface of the silicon substrate having plane orientation (100), faster on a surface thereof having plane orientation (111) and still faster on a surface thereof having plane orientation (110). Therefore, the thickness of thermal oxide films is uneven unless they are formed on surfaces having the same plane orientations.
There is no problem in the case where a gate oxide film is formed only on a surface of a silicon wafer such as known MOSFET. However, it is important to obtain a gate oxide film of a uniform thickness in a device wherein the gate oxide film is three-dimensionally arranged, for example, in a trench-type vertical power MOSFET shown in FIG. 16. Therefore, in order to avoid an area where dielectric voltage is reduced, attempts have been made for matching all plane orientations of areas having formed thereon the gate oxide films by putting some thought into the arrangement of elements (chips) on the substrate (see Japanese Unexamined Patent Application No. HEI10-154810).
As understood from the above, it is important to determine the plane orientation of the substrate itself and evaluate the plane orientation dependence before manufacturing a device.
One of the conventional popular methods for evaluating the plane orientation dependence of a substrate is as follows. Wafers having different plane orientations are prepared by cutting out from silicon ingots having various plane orientations. These wafers are thermally oxidized actually and respectively, and the plane orientation dependence is evaluated by the rate of thermal oxidation.
However, this method entails a problem that the impurity concentration or the like is within specs but may be different in lots of ingots. This causes different rates of thermal oxidation, and therefore, the method is poor in precision for evaluating the plane orientation dependence.
Another conventional popular method for determining the plane orientation of a substrate is as follows. In manufacturing a semiconductor device, a reference pattern for mask alignment is formed in advance, and then, a mark pattern for a photomask alignment is matched to the reference pattern. The reference pattern is formed on a basis of an orientation flat or a notch (a V-shaped cut-out formed in an outer peripheral section of the silicon wafer) of the wafer. The orientation flat or notch is formed to provide a nominal reference plane by cutting a portion of the outer peripheral section of the wafer along a crystal orientation upon manufacturing the wafer.
The orientation flat formed on the silicon wafer having plane (100) provides a nominal plane (110). The edge, e.g., the corner, between plane (100) and orientation flat (110) of the silicon wafer has orientation <110>. The orientations generally exhibit precision with a margin of approximately plus or minus 2 degrees with respect to the true crystal orientation.
In other words, even if the orientation flat are accurately aligned in position with the mark pattern of the photomask, a deviation of 2° at the maximum may actually occur between the mark pattern for the photomask alignment and the true crystal orientation. Therefore, the plane orientation of the substrate cannot be determined accurately because the amount of deviation varies in every silicon wafer.
In order to eliminate such a positional deviation, Japanese Unexamined Patent Publication No. HEI 7(1995)-283117 discloses a photomask alignment method for determining a crystallographic reference orientation of a silicon wafer with high precision. This method does not use a cut line of the orientation flat as a reference for alignment of crystal orientation, but uses another means. The method will be explained with reference to FIG. 17.
Firstly, a silicon oxide film 72 is formed as an etching mask layer on a silicon wafer having plane (100). Then, two circular openings 70 and 71 are formed on the silicon oxide film 72 at the positions spaced from each other. The circular openings 70 and 71 are formed such that a straight line connecting the centers of the openings 70 and 71 is approximately parallel to the orientation flat showing nominal orientation <110> of the silicon wafer.
Thereafter, the resulting silicon wafer is isotropically etched with an alkali solution such as potassium hydroxide (KOH) solution. Thereby, the silicon wafer is etched from the circular openings 70 and 71 on the silicon oxide film 72, so that etch pits 74 and 75 each having a square pyramid shape with the circular opening 70 or 71 as the center are formed on the surface of the silicon wafer (FIG. 17(a)). These etch pits 74 and 75 are squares having four sides of orientation <110> on the surface of the silicon wafer.
Subsequently, a photomask 78 is prepared for obtaining a true orientation <110> of the silicon wafer. This photomask 78 is provided, as shown in FIG. 17(b), with a square window 76 and a rectangular window 77 arranged as follows to provide a mark line for mask alignment: The windows 76 and 77 are spaced from each other like the openings 70 and 71 and disposed in a parallel relation. The shorter sides of the windows 76 and 77 are smaller than the sides of the etch pits 74 and 75.
The photomask 78 is arranged and aligned on the silicon wafer having the etch pits 74 and 75 thereon. As shown in FIG. 17(c), the alignment is performed so that the sides of the etch pits 74 and 75 are parallel to the sides of the windows 76 and 77. This brings the mark line for the mask alignment directing the true orientation <110> of the silicon wafer indicated by reference numeral 80.
In this method, even if surfaces oriented in the orientation <110> are produced with respect to the circular openings 70 and 71 on the silicon oxide film 72 by isotropic etching using the alkali solution and thereby the photomask is aligned in the right position, this alignment is obtained only with respect to a positional alignment pattern, i.e., the circular openings 70 and 71. Such alignment is not always accurate with respect to a pattern for evaluating the plane orientation dependence or a pattern for an actual device in which plane orientations are required to be matched in consideration of potential deformation or warpage of silicon wafers which may vary every shot (depending upon silicon ingots). In other words, the photomask is aligned only in an indirect manner by this method.
The wafer obtained by the above-described process cannot be applied to a plane orientation evaluation pattern or an actual device. For, when a silicon wafer having plane (100) is etched in potassium hydroxide (KOH) solution, a surface thereof having plane (111) remains because dissolution rate is extremely slow in plane (111). Therefore, the etch pits formed on the silicon wafer have a V-shaped trench with an angle of about 55°. The etch pits cannot be applied to a trench-formation process in manufacture of the above-mentioned trench-type vertical power MOSFET, particularly.
In order to form on a silicon wafer a trench-shaped etch pit having vertical sidewalls, a special silicon wafer having a surface of orientation (110) is required to be used. It is difficult to apply such a special silicon wafer to a process flow established for a mainstream silicon wafer having plane (100).
Under such circumstances, there has been the demand for a technique for accurately and easily determining one or more plane orientations of a substrate and evaluating the dependence of arious properties of the substrate on the plane orientations by a single process.

Method for evaluating dependence of properties of semiconductor substrate on plane orientation and semiconductor device using the same


A toy gun with an integrated target generator is disclosed. A water container is provided to store water and to provide pressurized water as ammunition for the water gun. A bubble generator assembly is provided to generate bubbles that can be used as targets for the water gun. A pump handle is provided to pump air into the water container and to simultaneously actuate the bubble generator assembly. A trigger assembly is provided to allow a user to selectively fire water out of the water gun.

1. Field of the Invention
The present invention relates to toy guns, and in particular, to a toy gun with an integrated target generator. In the present invention, the target generator is provided in the form of a bubble generator that generates bubbles, and the toy gun ejects water that can be directed at the generated bubbles.
2. Description of the Prior Art
Toy guns are very popular among children. Presently-available toy guns can be adapted to fire a wide variety of soft or non-harmful ammunitions ranging from water to foam darts. For example, toy water guns have been provided for the entertainment of children for a long time. Many conventional water guns include (1) a trigger that can be actuated to fire water from the water gun, (2) a water container for holding the water, and (3) a pump mechanism used to pressurize the water in the water container. To use the water gun, a user fills the water container with water. The user then pumps the pump mechanism to pressurize the water in the water container. Next, the user aims the water gun at a target and actuates the trigger that effects the release of pressurized water out of the water gun.
Unfortunately, these conventional toy guns are not provided with any targets. Consequently, the ammunitions (foam darts, water) in these toy guns are often fired at certain undesirable targets, such as furniture, windows, walls, animals or other people. This lack of targets is undesirable for several reasons. First, even though the ammunitions (water, foam darts, etc.) are chosen to be relatively harmless, they can deface walls and furnitures, damage paintings or other precious art objects, create a mess around the house, and possibly damage windows. Second, these ammunitions can be dangerous. For example, the water fired from a toy water gun is pressurized, and the pressurized water or foam darts could hit a person in the eyes or in the ears. This risk of injury cannot be discounted since these toy guns are usually operated by children of all ages, including younger children who may not always carefully evaluate the consequences of their actions before acting. Moreover, as the distance to the target decreases, the risk of injury to the person increases.
In addition, children demand variety in their play things, and many children have grown tired of shooting at stationary objects. Many children are now demanding toys, and in particular, toy guns, that are different and which offer more excitement, greater sophistication of play, and more options.
In addition, to meet the demand for more exciting and sophisticated toys, the construction of many toys have unfortunately become more complex and therefore more expensive.
Accordingly, there remains a need for an improved toy gun that address the disadvantages set forth previously and that is cost-effective to manufacture.

Toy gun with an integrated target generator


Open top liquid/gas cyclone separator tube with a dual purpose single separator tube with both liquid and gas separation zones, an open top discharge vent to provide a for humid air to be discharged into the atmosphere, a means to prevent splashing out the open top of the separator tube, a means of the separation section to prevent turbulence while allowing the accumulation of used water in the bottom of the tube, a to provide gravity feeding of the water back to the scrubbing mechanism to be recycled for water preservation, a means of regulating the rate of water feed to the scrubbing mechanism, an open port means of the scrubbing mechanism to be used to add chemicals, gases or other elements to the gas stream that is discharged to the environment, and a for vertical discharge on the scrubbing mechanism to enhance entrainment of water droplets containing particles, bacteria and mold spores.

This invention relates generally to the field of room environment control and more specifically to open top liquid/gas cyclone separator tube and process for same. It has been known for centuries that food products deteriorate in quality on the shelf or in storage over time. The length of time it takes for the deterioration process is affected by the rate of food destroying pathogen population and regeneration. The length of time for preservation of food products in storage can be increased by the application of thermodynamic factors such as temperature, pressure and humidity. Refrigeration was discovered to increase the time for preservation of food products before its affect on microscopic pathogens was well understood. It has since been determined that (FILL IN WITH THERMODYNAMIC INFORMATION)
The most popular and effective preservation method for food products has been refrigeration. Keeping raw food products at low temperatures exponentially decreases the growth rate of product destroying pathogens and the products have been preserved for longer periods. Fresh food products must be kept at a delicate temperature range that is constantly above freezing and below a temperature that contributes to the rapid growth of pathogens. Since the production of food products has evolved into fewer and larger farms and storage facilities, the lack of thermodynamic knowledge of growers and the exuberant promotion by suppliers has moved preservation methods into larger and more powerful air handling facilities and mechanisms. Storage facilities for raw food products have been increased in size and capacity, costing upwards of $1 million per facility. These large facilities have been scaled both in size of storage area and also the size and capacity of air handling plenums used for air circulation.
Raw food product storage environment and product preservation has been addressed by opportunists more than by sound engineering. The industry has been addressing product volume that does not affect the environment instead of air volume that does. In potato storage units, fans have been increased in capacity of movement to as much as 2,200 cubic feet of air per minute per ton of potatoes. This translates to 165,000 cubic feet of air per minute in a 75 ton capacity storage unit. Assuming that there is 25% of the total air capacity of the unit left after it is full of product, the turnover rate would be approximately 3 times per minute, a substantial overkill that can be effective only for cooling purposes and not for environmental control. The running of these high capacity fans dries out the product and also moves pathogens from diseased products to healthy ones throughout the storage facility, thereby spreading and increasing the probability of product destroying diseases into every location of the facility. In an attempt to hold the humidity up in the storage while blowing high volumes of air through the product, the industry has provide atomizing impellers that atomize as much as 30 gallons of water per minute per unit. The smallest of droplets that can be produced by an efficient atomizer is approximately ten microns in diameter. Larger droplets are readily affected by gravity, pulling them to the floor of the facility and the ventilation tubes. The excess water provides a welcome environment for pathogens to reproduce and increase in population. Such a high volume of water only serves to wet the floors and walls of the plenums since the air will only contain a small amount of water, the capacity depending on the temperature in the facility. The only factor applicable to the humidity of the air in the facility with this method is evaporation. The evaporation rate decreases in the facility as temperature decreases because cold air holds much less water that warm air. Hence there has been a major overkill in an attempt to preserve potato and vegetable products in storage and a great deal of water is wasted in these processes.
In 2005, Isaacs patented a device, U.S. Pat. No. 6,905,537, to be used in the emissions control industries that effected the collection of vapors, dust, heavy metals and other particles from industrial emissions and room environments. The use of this device for the control of pathogens in a food storage facility was not effectively applicable before the present invention was created to preserve the humidity in a storage room, for the recycling of the air and the controlled application of additives to the environment.

Open top liquid/gas cyclone separator tube and process for same


An anchor bolt for anchoring in a hole of an arbitrary component includes a tension bolt having a threaded portion and an adjoining frustoconical head portion. An expanding sleeve has a polygonal cross section, a female-threaded portion and an adjoining anchoring portion to be expanded in sectors by the frustoconical head portion of the tension bolt when the tension bolt is screwed into the female-threaded portion of the expanding sleeve. The polygonal cross section of the expanding sleeve has sides with middle regions and axially parallel predetermined breaking lines each being formed in the middle region of a respective one of the sides for dividing the sides into partial lateral surfaces. Each two of the partial lateral surfaces extend outwardly from a respective one of the predetermined breaking lines and rise toward one another at an obtuse angle.

1. Field of the Invention
The invention relates to an anchor bolt for anchoring in a hole of an arbitrary component, including a tension bolt having a threaded portion and an adjoining frustoconical head portion, and an expanding sleeve having a polygonal cross section, a female-threaded portion and an adjoining anchoring portion to be expanded in sectors by the frustoconical head portion of the tension bolt when the tension bolt is screwed into the female-threaded portion of the expanding sleeve, and an axially parallel predetermined breaking line disposed in a middle region of each side of the polygon.
2. Description of the Related Art
An anchor bolt of the generic described is known from European Patent No. 0 008 085, corresponding to U.S. Pat. No. 4,408,937. The polygonal cross section of the expanding sleeve in that device prevents the expanding sleeve from being made to rotate in the hole as the tension bolt is being tightened. Existing sharp edges of the expanding sleeve facilitate penetration into the material of the wall around the hole and thus the anchoring of the expanding sleeve in the hole.
It is accordingly an object of the invention to provide an anchor bolt, which overcomes the hereinafore-mentioned disadvantages of the heretofore-known devices of this general type and which improves the anchoring of the expanding sleeve in the hole, so that greater forces can be withstood even when used for thin components.


An electromagnetic shielding system for a printed circuit board includes a shielding enclosure having a plurality of side walls and an integral top surface, the top surface including a scored line for allowing removal of an interior portion of the top surface to thereby define a remaining perimeter rim, and a replacement cover for attachment to the remaining cover rim. The replacement cover includes a metal foil having an adhesive surface or a sheet metal material.

1. Field of the Invention
The present invention relates generally to a shielding system for a printed circuit board, and in particular, to a shielding system having an integral shielding enclosure with a fixed cover that may be permanently removed, and a replacement cover for attaching thereto.
2. Description of the Related Art
As is well known in the prior art, selected electric or electronic parts on a printed circuit board radiate electromagnetic waves which thereby cause noise or unwanted signals to appear in adjacent components on the printed circuit board or electric or electronic parts and devices existing in the vicinity of the printed circuit board. Accordingly, it is highly desirable to provide shielding for electronic components of printed circuit boards such as those found in radio transmitters, radio receivers, computers and other electronic devices that use circuitry that emits or is susceptible to electromagnetic radiation. It is known that these components can be shielded to reduce undesirable electromagnetic interference and/or susceptibility effects with the use of a conductive shield that reflects or dissipates the electromagnetic charges and fields. Such shielding may be grounded to allow the offending electrical charges and fields to be dissipated without disrupting the operation of the electronic components enclosed within the shield.
A variety of devices have been utilized for shielding electronic components, but these prior art devices have not been entirely satisfactory since they do not allow for easy access to the underlying electronic component after the installation of the shield.
For example, a conventional metal shield cover, or can, is mounted to a printed circuit board by using fasteners appropriate for the purpose. Thereafter, the metal shield is soldered or welded to selected grounding strips on the printed circuit board at selected locations of its side walls. Using solder or welding to mechanically hold and electrically connect the metal shield to the printed circuit board permanently affixes the metal shield over the selected electronic component(s).
After assembling the completed printed circuit board, including the required metal shields, the printed circuit board will generally be subjected to a xe2x80x9cburn-inxe2x80x9d stage during which it is subjected to elevated temperature tests. If one of the electronic components should fail during the burn-in, however, that component must be replaced. Thus, it becomes necessary to desolder or unweld the metal shield from the printed circuit board in order to obtain access to the failed component and replace the same. This is very difficult to successfully accomplish and, more than likely, the entire printed circuit board will be destroyed.
In order to overcome this problem, shielding devices, such as that disclosed in U.S. Pat. No. 4,754,101 of the present assignee, the entire contents of which are hereby incorporated by reference, have included a separate wall enclosure and a removable cover. The cover is resiliently held in place by deflectable engagement prongs extending from an upper edge of the wall enclosure. The presence of the resiliently held cover allows access to the underlying electronic component, should the same be required, however, the manufacturing costs associated with the formation of the engagement prongs are also increased.
Accordingly, there exists a need for a shielding cover which can be soldered to the printer circuit board, but which still allows access to the underlying electronic component should it be necessary to replace, repair or otherwise adjust the same, and which can be inexpensively manufactured.
The present invention overcomes these disadvantages by providing an electromagnetic shielding system including a shielding enclosure having a plurality of side walls and an integral top surface. The top surface includes a scored line for allowing removal of an interior portion of the top surface to thereby define a remaining perimeter rim. A replacement cover is also included for attachment to the remaining cover rim after the interior portion is removed. The replacement cover may include a metal foil having an adhesive surface or a metal sheet material.
The present invention further provides a method for shielding and obtaining access to a component on a printed circuit board. The method includes providing a printed circuit board having a component encompassed by a shielding enclosure. The shielding enclosure includes a plurality of side walls and an integral top surface having a scored line which defines an interior portion. The scored line on the top surface of the shielding enclosure is severed and the interior portion of the top surface defined by the scored line is removed to thereby leave a remaining perimeter rim on the printed circuit board and allow access to the component within the rim. The scored line may be severed by grasping a hole in the top surface of the shielding enclosure and applying force. A replacement cover is also provided for the top surface of the shielding enclosure. The replacement cover is attached to the shielding enclosure to thereby encompass and shield the component.

Electromagnetic shielding system for printed circuit board


An information recording apparatus (300) is for recording record information onto an information recording medium (100) comprising a first recording layer (L0 layer) and a second recording layer (L1 layer) to record therein the record information by irradiating laser light. The information recording apparatus is provided with: a recording device (352) for recording the record information into at least one of the first recording layer and the second recording layer by irradiating the laser light; and a controlling device (354) for controlling the recording device to record the record information into a target area (115a), which is a recording area of the second recording layer corresponding to a recording area (105a) of the first recording layer in which the record information is recorded, if the record information is recorded into the second recording layer.

For example, with regard to an information recording medium, such as an optical disc, like a CD-ROM (Compact Disc-Read Only Memory), a CD-R (Compact Disc-Recordable), and a DVD (Digital Versatile Disk)-ROM, there has been also developed an optical disc of a multilayer type or double layer type or multiple layer type in which a plurality of recording layers are laminated on the same substrate. More specifically, a dual-layer type optical disc, i.e. a two-layer type optical disc, has a first recording layer which is on the nearest side viewed from the irradiation side of laser light in recording by using an information recording apparatus (i.e. on the closest side to an optical pickup), as a first layer (wherein the first recording layer is referred to as a "L0 layer", as occasion demands, in this application). Moreover, it has a semi-transparent reflective film located on the rear side of the first recording layer (i.e. on the farther side viewed from the irradiation side of the laser light). The dual-layer type optical disc has a second recording layer which is located on the rear side of the semi-transparent reflective film via a middle layer, such as an adhesion layer, as a second layer (wherein the second recording layer is referred to as a "L1 layer", as occasion demands, in this application). Moreover, it has a reflective film located on the rear side of the second recording layer. Then, in preparing such a multilayer type information recording medium, the L0 layer and the L1 layer may be separately formed, and they are bonded together in the end, to thereby produce the dual-layer type optical disc at low cost.
In the information recording apparatus, such as a CD recorder, for recording information onto such a dual-layer type optical disc, the information is recorded into the L0 layer in a rewritable method or irreversible change recording method such as irreversible change recording heat by using heat or the like, by focusing the laser light for recording onto the L0 layer, and the information is recorded into the L1 layer in a rewritable method or irreversible change recording method by heat or the like, by focusing the laser light onto the L1 layer.
Patent document 1: Japanese Patent Application Laying Open NO. 2000-311346

Information recording medium, information recording device and method, and computer program


In a phase shift circuit apparatus, first and second currents, produced by dividing signal current at a predetermined ratio by a variable bias voltage, are respectively supplied to fifth and eighth transistors which constitute the second differential amplification means, and the first and the second currents are respectively divided at predetermined ratios to supply currents, including square components; third, fourth, fifth and sixth currents which are caused to flow through fifth and sixth transistors of the third differential amplification means and seventh and eighth transistors of the fourth differential amplification means, respectively. Seventh and eighth currents which, produced by dividing signal current at predetermined ratios, are supplied to the ninth and the tenth transistors or the eleventh and the twelfth transistors from the first and the second connection nodes, respectively. In this event, currents which are first and second divided sum currents including square components at predetermined ratio are provided to the first and the second load resistances, and at the fourth connection node there is developed an output voltage by composing the first connection node voltage, which leads the input signal by a phase angle of 45.degree., with the second connection node voltage which lags the input signal by a phase angle of 45.degree., and the gain of the output is substantially constant within a variable range of phase.

1. Field of the Invention
The present invention relates to a phase shift circuit, and may be suitably applied to an automatic phase control circuit, which is used in a television receiver, video tape recorder, and camera, for example.
2. Description of the Prior Art
FIG. 1 illustrates a conventional automatic phase control circuit 1 which automatically phase controls chrominance signals of video signals transmitted according to NTSC (National Television System Committee) or
(Phase Alternation by Line). In the automatic phase control circuit 1, a phase shift circuit 2 outputs continuous wave signals (hereinafter referred to as CW signals), which are inputted to a multiplier circuit 3, where CW signals and burst signals S1 are multiplied and then outputted to a voltage controlled oscillator 5 through a lag-lead filter circuit 4.
In the voltage controlled oscillator 5, a quartz oscillator output S2 is shifted in phase by an output voltage .DELTA.V which has been inputted from the lag-lead filter circuit 4, so that the oscillation frequency of the quartz oscillator may be modified.
In the automatic phase control circuit 1, the output CW signals S3 having the modified oscillation frequency are fed back from the voltage controlled oscillator 5 to the phase shift circuit 2 through a low pass filter 6, so that the oscillation frequency of the quartz oscillator is made equal to the frequency of the burst signals.
In the automatic phase control circuit 1, output signals S3 are shifted 90.degree. in phase through a 90.degree. shift circuit 7, and CW signals which are 180 degrees out of phase with burst signals S1 are outputted as carrier signals of the B-Y axis through a buffer 8. Furthermore, output CW signals S3 which are in phase with the output of the low pass filter 6 are outputted as carrier signals of R-Y axis through a buffer 9.
The phase shift circuit 2 and an equivalent circuit thereof are shown in FIGS. 2 and 3, respectively. As shown in FIG. 2, a bias voltage .DELTA.V of one of the transistor pair which constitutes a differential amplification circuit is variable, and therefore the ratio between currents I1 and I2 which flow through transistors Q1 and Q2, respectively, are controlled (0<k<1) so that the phase of the CW signals outputted from the output terminal P0 may be shifted within a range of .+-.45.degree. with the input signals.
The collectors of the transistors Q1 and Q2 are supplied with source voltage Vcc through load resistances R1 and R2, respectively. A buffer transistor Q3 is connected to a connection node P1 between the transistor Q1 and the load resistance R1. The buffer transistor Q3 is connected at the emitter to a current source 10, and a capacitor C1 is connected between the output terminal P0 and a connection node P2 of the emitter and the current source 10.
As the phase is shifted in such a fashion, the output gain of CW signals outputted from the output terminal P0 linearly varies (FIG. 4).
When the output gain is to be 0 [dB] at a current ratio k of 1/2 as shown by broken line in FIG. 4, the output gain becomes larger as current ratio k reaches to 0 or 1, and the maximum 3 [dB] gain largely varies. When the output gain largely changes, the multiplication output from the multiplier circuit 3 however increases in distortion factor, with the result that the demodulation axis is deviated from the ideal demodulation axis.
More specifically, as illustrated in FIG. 5 the multiplier circuit 3 includes differential amplification circuits 10 and 11, which are constituted by a pair of transistors Q5 and Q6, and Q7 and Q8, respectively. Transistors Q9 and Q10 are connected to and input burst signals S1 to common emitters of transistors Q5 and Q6, and Q7 and Q8, respectively. The common emitters of the transistors Q9 and Q10 are connected to a current source 13 through a switching circuit 12 which makes switching operation by a burst gate pulse BG. To cause the differential amplification circuits 10 and 11 of the multiplier circuit 3 to perform switching operation, a voltage of 5 V.sub.T (=130 [mV]) is necessary as the input amplitude of the transistors Q5 to Q8. In the case where CW signals outputted from the phase shift circuit 2 are rather small in amplitude, the differential amplification circuits 10 and 11 are, therefore, not correctly operated, and there is thus a problem such that it is not possible to produce CW signals having .+-.90.degree. shift with burst signals at a good accuracy.
Also when CW signals are excessively large in amplitude, the distortion factor of the output gain increases in phase shifting. Furthermore, in this case the influences of base-collector capacitance C.sub.BC of the transistors Q5 to Q8 becomes excessively large, and this generates distortion in the waveform of the multiplication output, so that demodulation axes are deviated .theta. from ideal B-Y and R-Y axes (FIG. 6). When in FIG. 6 the deviation angle .theta. of the B-Y axis is corrected, the variable range of the hue by the phase shift circuit 2 becomes 45.degree.-.theta., and is therefore narrowed by the deviation .theta..
To avoid this disadvantage, a phase shift circuit 14 as shown in FIG. 7 has been proposed. In this phase shift circuit 14, a differential amplification circuit 15 which is constituted by a pair of pnp transistors is respectively connected to a connection node between load resistance R11 and the transistor Q11, and another connection node between resistance R12 and the transistor Q12 to produce negative signal voltage, and thereby the variable range of the phase to input signals is enlarged outside .+-.45.degree.. In this case, there is however a disadvantage in that the output gain due to the phase shifting becomes larger by 10 [dB] at maximum than the gain at k=1/2 as shown in FIG. 8.


A peak detector provides repeatable and accurate measurements of the signal amplitude for variable frequencies of input signals. The peak detector includes a pulse edge generator circuit that generates a pulse edge signal in response to the signal peaks of an input signal and a sampler circuit that is triggered to sample the input signal by the pulse edge signal. The pulse edge generator circuit compares the input signal with a delayed version of the input signal to produce a differential signal and generates the pulse edge signal using the differential signal. An analog or digital sampler is triggered by the pulsed edge signal to measure the information, e.g., peak value, of the input signal. One or more delay circuits may be used to align the edges of the pulsed edge signal with the peaks of the input signal.

Peak detectors are used to detect the peak amplitude of a signal, such as an analog electronic signal. Examples of peak detector units are described in U.S. Pat. No. 6,188,250; U.S. Pat. No. 6,191,621; and U.S. Pat. No. 5,594,384, which are incorporated herein by reference. The main shortcomings of known peak detectors are caused by factors such as capacitor leakage, voltage drop in rectifying diodes, and slow amplifier feedback. An improved peak detector is desirable.


An injection which contains as the active ingredient a pyrazolone derivative which typically is Edaravone, a physiologically acceptable salt thereof, or a hydrate or solvate of either in an amount of 3 to 60 mg/mL. It is excellent in long-term stability, product storage, and suitability for use.

3-Methyl-l-phenyl-2-pyrazolin-5-one (non-proprietary name: "Edaravone", trade name: "Radicut"; manufactured and sold by Mitsubishi Pharma Corporation. hereinafter referred to as Edaravone) which is one of the pyrazolone derivatives as mentioned above is also called 3-methyl-1-phenyl-5-pyrazolone. It is a compound recognized to have potent effectiveness in the various experiments using animal models of cerebrovascular disorders and its clinical application is extremely expected as a drug for the treatment of cerebrovascular disorders such as cerebral stroke, brain tumor, cerebral ischemia observed in the acute stage of head trauma, cerebral edema and the like for which no effective drug is available {brain function normalizing effect (Japanese patent publication (Kokoku) No. Hei 5-31523), lipid peroxidation inhibiting effect (Japanese patent publication (Kokoku) No. Hei 5-35128). An injection containing Edaravone as an active ingredient has been developed. One example is an injection which is an aqueous solution of Edaravone containing at least one compound selected from sulfites, hydrogensulfites and pyrosulfites, and a cysteine and has a pH in the range of 2.5 to 6.0 (Japanese patent publication (Kokoku) No. Hei 7-121861).
Now, Edaravone is clinically used as a brain protector (infusion) and two ampoules are needed daily. If Edaravone is prescribed for the other diseases in future, there are possibilities of using more ampoules. Anyway, in the present prescription, it is necessary to prepare at least two ampoules or vials a day. However, in the medical treatment site where any medical accidents must be avoided, the number of steps required for the preparation of medicines should be reduced as much as possible and the availability of the medicines should be increased. Further, medicines each composed of plural ampoules or vials need a wider space to store them in. Such a situation is not preferable for both a medicine maker and one engaged in the medical treatment.
There is accordingly a demand for the development of a medicine containing high-concentration of Edaravone but low in volume, namely, a high concentration low volume injection. However, Edaravone is sparingly soluble in water (2 mg/mL at 25° C.), has less chemical stability with an increase in its concentration in the aqueous solution, and is apt to be decomposed by oxidation in the aqueous solution compared to Edaravone in the powder form. In consideration of such properties, it is difficult to stabilize Edaravone as a pharmaceutical for a long period time and prepare an injection containing it in an amount exceeding a saturated solubility in water. Actually, such a formulation is not realized until now.

Stable high-concentration injection containing pyrazolone derivative


A ZnO layer is provided which can obtain emission at a wavelength longer than blue (e.g., 420 nm) and has a novel structure. A transition energy narrower by 0.6 eV or larger than a band gap of ZnO can be obtained by doping S into a ZnO layer.

A) Field of the Invention
The present invention relates to a ZnO layer and a semiconductor light emitting device, and more particularly to a ZnO layer suitable for particularly green light emission and a semiconductor light emitting device.
B) Description of the Related Art
Main trends of green light emitting diodes (LED) presently in practical use are InxGa1-xN-containing LED and GaP-containing LED.
An InxGa1-xN-containing LED is formed, for example, on a sapphire substrate. For example, sequentially formed on a (0001) polar plane of a sapphire substrate are a buffer layer, an n-type GaN contact layer, an InGaN emission layer, a p-type GaN clad layer and a p-type GaN contact layer. Green emission can be obtained by changing an In composition of an InxGa1-xN in the InGaN emission layer.
For a GaP-containing LED, green emission (Eg: 2.25 eV to 2.45 eV) can be obtained by using Ga1-xAlxP semiconductor material. However, this LED is not practical because emission is indirect transition and an emission intensity is weak. An emission efficiency can be increased by doping luminescent centers substituting group V and called isoelectronic traps, into GaP. If N is selected as isoelectronic traps, yellow-green emission occurs at a wavelength of 565 nm.
A high emission efficiency at an external quantum efficiency of about 50% can be obtained for a blue InxGa1-xN LED. However, such a high quantum efficiency can only be obtained in a range from ultraviolet in a 360 nm range to blue in a 460 nm range, and in the longer wavelength range, an efficiency is lowered considerably. For example, green in a 530 nm range has an efficiency about a half that of blue. Improving an efficiency of a green LED is important when considering applications to a liquid crystal display using as backlight, LED's of three primary colors: blue of InGaN-containing LED, green of InGaN-containing LED, and red of AlGaInP-containing LED.
An efficiency of a green LED is lowered by a phenomenon which occurs when a mixed crystal In component of InxGa1-xN to be used as the material of the emission layer is increased. By using InxGa1-xN mixed crystal as the material of the emission layer, blue emission at a wavelength of about 470 nm is obtained at an In composition of about 20%, and green emission at a wavelength of about 520 nm is obtained at an In composition of about 35%. However, at an In composition of 20% or higher, phase separation occurs. Green emission characteristics are degraded by phase separation.
In the LED structure described above, since the InxGa1-xN emission layer is thin, this layer grows lattice matching the relatively thick n-type GaN contact layer The InxGa1-xN layer is therefore formed containing strain in crystal. InxGa1-xN having a high mixed crystal In composition has a much larger lattice constant than that of GaN. Therefore, compression strain is contained in crystal of the InxGa1-xN emission layer lattice matching the GaN contact layer. Because of compression strain, a piezo electric field is generated in the InxGa1-xN layer so that carriers (electrons and holes) in crystal are spatially separated and a recombination probability lowers. This results in a lowered internal quantum efficiency of LED. Furthermore, as a device generating a piezo electric field is driven, a drive current increases and emission color shifts to the shorter wavelength side.
FIG. 8 illustrates a band diagram of a double hetero structure of GaAlP/Gap/GaAlP of a GaP-containing LED. Heterojunction of GaP/Ga1-xAlxP has a type II structure. Therefore, a GaP-containing LED having a double hetero structure or a quantum well structure cannot confine carriers in an emission layer. It is therefore difficult to improve the emission characteristics. A conventional light emitting diode has therefore homojunction and its emission efficiency is low. An LED having N isoelectronic traps in GaP has homojunction and an emission efficiency of several %, and renders yellow-green emission at a wavelength of 565 nm to 570 nm.
JP-A-2004-296459 discloses a light emitting device using ZnO doped with Se or S as the material of an emission layer. It describes that this light emitting device renders blue emission at 420 nm (e.g., refer to paragraph [0090]). It also describes that the light emitting device has an emission wavelength of 370 nm to 440 nm depending upon a concentration of Se or S (e.g., refer to paragraphs [0077] and [0091]).

ZnO layer and semiconductor light emitting device


A motor drive includes a dynamic braking circuit for producing a deceleration torque utilizing a braking force caused by a synchronous motor acting as a generator when the synchronous motor is deenergized. The motor drive apparatus is equipped with a dynamic braking circuit fault detection capability, a DC power supply which is obtained by rectifying input AC power, voltage application function for applying a voltage to the windings of the synchronous motor and to the dynamic braking circuit for a predetermined length of time by switching power transistors connected to the DC power supply, current detection unit for detecting the value of a current flowing from the power transistors, and fault checking unit for checking the dynamic braking circuit for the presence or absence of a fault, based on the current value detected by the current detection unit and on a predefined threshold value.

1. Field of the Invention
The present invention relates to a motor drive apparatus equipped with a dynamic braking circuit fault detection capability, and more particularly to a motor drive apparatus having a capability to detect faults in a dynamic braking circuit (such as a contact welding defect or an electrically inoperable contact, breakage of a resistor, disconnection of a connecting cable, etc.).
2. Description of the Related Art
FIG. 7 is a block diagram showing the configuration of a motor drive apparatus according to the prior art.
In the motor drive apparatus 101 shown in FIG. 7, a DC power supply 102 converts AC power, supplied from an AC power supply not shown, into DC power. The DC power from the DC power supply 102 is supplied to a synchronous motor 104 (hereinafter referred to as the motor) via a power transistor unit 103 comprising power transistors A to F. When the power to the motor 104 is cut off while the motor 104 is running, a dynamic braking circuit 105 actuates switches S1 and S2, i.e., relay contacts, so that the power is dissipated through resistors Ru, Rv, and Rw in the dynamic braking circuit 105.
A motor drive control circuit 110 outputs a dynamic braking circuit control signal SIG1, in response to which a fault detection circuit 111 generates a power transistor control signal SIG2 for controlling the driving/stopping of the motor 104, i.e., a power transistor ON/OFF signal, and supplies it to the power transistors A to F in the power transistor unit 103. A current detector 106 detects current flowing from the power transistor unit 103 to the motor 104.
The fault detection circuit 111 receives the dynamic braking circuit control signal SIG1 from the motor drive control circuit 110 and a contact state signal SIG70 from the dynamic braking circuit 105, i.e., an ON/OFF signal indicating the operation ON/OFF state of the motor 104 in accordance with the ON/OFF state of the switches S1 and S2, and detects from these signals a fault occurring in the dynamic braking circuit 105 (such as a contact welding defect or an electrically inoperable contact, breakage of a resistor, or disconnection of a connecting cable). To check the operation of the dynamic braking circuit 105 at the time of control of the motor 104, it is common to use the contact state signal SIG70 that indicates the contact state of the switches S1 and S2 as hardware provided in the dynamic braking circuit 105.
Methods that do not use such a contact state signal are also known; as one such method, there is disclosed, for example, in Patent Publication No. 1, a method that checks the operation/non-operation of the dynamic braking circuit by lowering the DC voltage when starting the motor operation.
[Patent Publication No. 1] Japanese Patent No. 3383965 (refer to [CLAIM 1] in Patent Claims, paragraphs [0003] to [0006] in Patent Specification, and FIGS. 1 and 2)
The method that requires the addition of a hardware contact signal involves the problem that the apparatus cost increases. On the other hand, the method of Patent Publication No. 1 that does not use such a contact signal requires the addition of a control circuit in order to perform control to obtain a low supply voltage necessary for fault detection, and this also involves the problem that the apparatus cost increases.

Motor drive apparatus equipped with dynamic braking circuit fault detection capability


An enzyme preparation composition comprising a mixture of enzymes comprising an enzyme with homogalacturonan activity, more specifically pectin lyase, and an enzyme with endoglucanase activity, wherein the enzymes are in relative proportions to produce cloud volume from fruit or vegetable material. The preparation is such that enzymes which reduce the cloud volume by more than 5% are excluded, and wherein the endoglucanase has both CMCase activity and xyloglucanase activity in a ratio of at least 0.7.

The instant invention relates to cloudy juices and methods for making same. The invention is particularly concerned with cloudy juices from pomaceous fruit. The invention is further concerned with cell wallxe2x80x94cloudxe2x80x94material obtainable by a method according to the invention and uses thereof. The invention also concerns enzyme preparations which can suitably be used for the preparation of cloud material and/or juice containing said cloud material.
Liquefaction is a process which is frequently used for the manufacturing of clear apple juice. The process aims at a complete degradation of cell walls using cell wall degrading enzymes. This process can be realized by treating apples with an appropriate pectolytic enzyme, for instance pectin lyase (PL), in combination with a crude cellulase preparation, containing several endoglucanases, cellobiohydrolase (CBH) and several other activities.
A process for making a cloudy apple juice has been described in Vincken et al. (1996, PhD Thesis, Enzymic Modification of Cellulase-Xyloglucan Networks, Wageningen Agricultural University, The Netherlands, Chapter 9) by partial degradation of apple cell walls. This yields a suspension of eroded apple cells which is mainly composed of cellulose and xyloglucan. It is unknown why these cellulose-xyloglucan complexes do not precipitate like cellulose particles do. It is thought that the xyloglucan molecules play a role in stabilization.
By this process Vincken et al. have been able to produce a cloudy apple juice on a small scale, using pectin lyase and small amounts of a crude cellulase preparation and ripe apples. The use of ripe apples is thought to be important in this process, because these contain large amounts of xyloglucan endotransglycosylase (XET) . It is thought that a small amount of xyloglucanase is required to trigger the depolymerizing action of XET. The XET then weakens the apple cell wall, facilitating juice release but leaving the major part of the cellulose-xyloglucan network intact. A too large dose of cellulase destroys the cloud.
From an industrial point of view, the process above has two important drawbacks. Firstly, the enzyme formulation used in this process apparently contains components that are detrimental for cloud stability. Secondly, the balance between fungal glucarases and endogenous XET, is very important in order to obtain a cloudy juice. However, this balance is difficult to manage in practice as it requires knowledge of the endogenous XET-levels. No methods are known to determine such levels in an industrial context and the method is difficult to reproduce, even on a small scale. A further disadvantage, associated with the use of ripe apples, resides in their susceptibility to fungal attack. Fungi, such as Penicillium produce mycotoxins, which end up in the juice.
Another method for making a cloudy apple juice is disclosed in WO 95/34223. The method herein disclosed involves the use of enzymes that attack the hairy regions of the pectin backbone, such as rhamnogalacturonase (RGase), rhamnogalacturonan acerylescerase (RGAE), galactanase, and combinations thereof. A strong warning is expressed against the use of homogalacturonan degrading enzymes as they would destroy cloud stability (vide page 10, Experiment 4, page 6, 11, 13 to 16).
It is an object of the invention to provide a reproducible method for making cloudy apple juice which can be practiced on an industrial scale.
It was surprisingly found that a cloudy apple juice is obtained when a method is used comprising the step of treating apple material with a mixture of enzymes comprising a homogalacturonan depolymerizing activity, such as pectin lyase (EC 184.108.40.206), and an enzyme with endoglucanase activity (EC 3.-2.1.4), in the absence of enzymes which reduce the cloud volume by more than 25%, as determined by a method which comprises:
(a) suspending 5 mg of a cloud material
obtainable by homogenizing 1 g of apple pieces of Malus malus L. cv. Jonagold, after removal of the peel and core, using a Braun Kitchen machine (MX32, Frankfurt, Germany; 5 mm blade), incubating at 40xc2x0 C. under continuous head-over-tail mixing at 150 rpm in 3 mL of a 200 mM NaOAc buffer (pH 4) containing 0.01% (w/v) NaN3, 1% ascorbic acid, 50 mU pectin lyase and an amount of endoglucanase with an equivalent of 25 mU of xyloglucanase activity,
xe2x80x83in 3 ml of a 25 mM NaOAc buffer (pH 5), containing about 0.01% (w/v) NaN3,
(b) Incubating the cloud suspension so obtained for 1 h at about 40xc2x0 C., in the presence of the said enzyme, during which the cloud suspension and enzyme is mixed head-over-tail,
(c) allowing the cloud to settle at about 40xc2x0 C. for 24 hours, and
(d) determining the effect of the enzyme on cloud stability by calculating the difference between the cloud volume or the cloud suspension obtained by following the above steps in the absence of the said enzyme and subtracting the volume obtained of the cloud suspension obtained by following the above steps in the presence of the enzyme.
By the use of this test, enzyme cocktails in which undesirable enzymes are absent have been developed. The enzyme preparations are characterised by the presence of an endoglucanase having CMCase activity, preferably a CMCase activity to xyloglucanase activity ratio of at least 0.7, and an enzyme having homogalacturonan depolymerizing activity such as a combination of pectin esterase and polygalacturonase, preferably pectin lyase.
In principle, there is no upper limit to the ratio (endoI in Table 1 has a CMCase/XGase ratio of about 114 and performs very well in a process for making a cloudy juice according to the invention; the CMCase activity is by far the most important in the partial apple liquefaction of apple material, but it cannot be concluded that XGase activity is absolutely redundant).
By using a method according to the invention, enzymes of the crude cellulase preparation which destroy cloud stability can be identified. Accordingly, a preferred embodiment of the invention is a process which is essentially free from cellobiohydrolase activity (EC 220.127.116.11).

Cloudy fruit juices and methods for making same


The invention involves dimeric forms of the protein known as fibroblast activation protein alpha, or "FAP.alpha." and its uses.

The invasive growth of epithelial cancers is associated with characteristic cellular and molecular changes in the supporting stroma. For example, epithelial cancers induce the formation of tumor blood vessels, the recruitment of reactive tumor stromal fibroblasts, lymphoid and phagocytic infiltrates, the release of peptide mediators and proteolytic enzymes, and the production of an altered extracellular matrix (ECM). See, e.g., Folkman, Adv. Cancer Res. 43: 175-203 (1985); Basset et al., Nature 348: 699-704 (1990); Denekamp et al., Cancer Metastasis Rev. 9: 267-282 (1990) Cullen et al., Cancer Res. 51: 4978-4985 (1991); Dvorak et al., Cancer Cells 3: 77-85 (1991); Liotta et al., Cancer Res. 51: 5054s-5059s (1991); Garin-Chesa et al., J. Histochem. Cytochem. 37: 1767-1776 (1989). A highly consistent molecular trait of the stroma in several common histologic types of epithelial cancers is induction of the fibroblast activation protein (FAP.alpha.), a cell surface glycoprotein with an observed M.sub.r of 95,000 originally discovered with a monoclonal antibody, mAb F19, raised against proliferating cultured fibroblasts. See Rettig et al., Cancer Res. 46: 6406-6412 (1986); Rettig et al., Proc. Natl. Acad. Sci. USA 85: 3110-3114 (1988); Garin-Chesa et al., Proc. Natl. Acad. USA 87: 7235-7239 (1990); Rettig et al., Cancer Res. 53: 3327-3335 (1993). Each of these four papers is incorporated by reference in its entirety.
Immunohistochemical studies such as those cited supra have shown that FAP.alpha. is transiently expressed in certain normal fetal mesenchymal tissues but that normal adult tissues are generally FAP.alpha..sup.-. Similarly, malignant epithelial, neural and hematopoietic cells are generally FAP.alpha..sup.-. However, most of the common types of epithelial cancers, including >90% of breast, lung, skin, pancreas, and colorectal carcinomas, contain abundant FAP.alpha..sup.+ reactive stromal fibroblasts. Garin-Chesa et al., Proc. Natl. Acad. Sci. USA 87: 7235-7239 (1990). The FAP.alpha..sup.+ tumor stromal fibroblasts almost invariably accompany tumor blood vessels, forming a distinct cellular compartment interposed between the tumor capillary endothelium and the basal aspect of malignant epithelial cell clusters. While FAP.alpha..sup.+ stromal fibroblasts are found in both primary and metastatic carcinomas, benign and premalignant epithelial lesions, such as fibroadenomas of the breast and colorectal adenomas only rarely contain FAP.alpha..sup.+ stromal cells. In contrast to the stroma-specific localization of FAP.alpha. in epithelial neoplasms, FAP.alpha. is expressed in the malignant cells of a large proportion of bone and soft tissue sarcomas. (Rettig et al., Proc. Natl. Acad. Sci. USA 85: 3110-3114 (1988)). Finally, FAP.alpha..sup.+ fibroblasts have been detected in the granulation tissue of healing wounds (Garin-Chesa et al., supra) . Based on the restricted distribution pattern of FAP.alpha. in normal tissues and its uniform expression in the supporting stroma of many epithelial cancers, clinical trials with .sup.131 I-labeled mAb F19 have been initiated in patients with metastatic colon cancer (Welt et al., Proc. Am. Assoc. Cancer Res. 33: 319 (1992); Welt et al. J. Clin. Oncol. 12: 1561-1571 (1994)) to explore the concept of "tumor stromal targeting" for immunodetection and immunotherapy of epithelial cancers.
Rettig et al., Int. J. Cancer 58: 385-392 (1994), incorporated by reference, discusses the FAP.alpha. molecule and its features. Rettig et al postulate that FAP.alpha. is found in high molecular weight complexes in excess of 400 kilodaltons, but do not discuss the possibility of dimeric molecules, nor does the paper elaborate on the specific enzymatic properties of the molecule.
The induction of FAP.alpha..sup.+ fibroblasts at times and sites of tissue remodeling during fetal development, tissue repair, and carcinogenesis is consistent with a fundamental role for this molecule in normal fibroblast physiology. Thus, it is of interest and value to isolate and to clone nucleic acid molecules which code for this molecule. This is one aspect of the invention, which is described in detail together with other features of the invention, in the disclosure which follows. Further aspects of the invention include the dimeric FAP.alpha. molecules, and the exploitation of the properties of these molecules. These features are also elaborated upon hereafter.

Isolated dimeric fibroblast activation protein .alpha., and uses thereof