Each of first and second differential amplifiers has a function of increasing a bias current in response to the activation of a drivability control signal. A first driving circuit connects an output node to a high power supply line in response to the activation of an output signal of the first differential amplifier, and connects the output node to a low power supply line in response to the activation of an output signal of the second differential amplifier. Only during the activation period of the drivability control signal, a second driving circuit connects the output node to the high power supply line in response to the activation of the output signal of the first differential amplifier, and connects the output node to the low power supply line in response to the activation of the output signal of the second differential amplifier.

1. Field of the Invention
The present invention relates to a voltage supply circuit supplying a bit-line precharging voltage in a semiconductor memory, such as a DRAM (Dynamic Random Access Memory) or the like.
2. Description of the Related Art
In general, a semiconductor memory, such as the DRAM or the like, has an internal power supply circuit that uses an external power supply voltage supplied through an external terminal to generate a plurality of internal power supply voltages. For example, the internal power supply circuit includes a plurality of voltage supply circuits, which supply a bit-line precharging voltage, a memory-cell plate voltage, a word-line activating voltage, a bit-line restoring voltage, and the like, respectively.
Here, the operation of a semiconductor memory, such as the DRAM or the like, will be briefly described. When a semiconductor memory changes from a standby state to an active state, a precharging control signal to a precharging circuit (a circuit that connects pair of bit lines to a precharging voltage line) and an equalizing control signal to an equalizing circuit (a circuit that connects the pair of bit lines with each other) are inactivated, and then a word line is activated. Accordingly, a precharging operation and an equalizing operation for the pair of bit lines stop, and a potential difference occurs between the pair of bit lines due to an electric charge accumulated in a memory cell. By potential difference being amplified by a sense amplifier, the voltage of one of the pair of bit lines and the voltage of the other bit line are set to a restoring voltage and a ground voltage, respectively.
Subsequently, when the semiconductor memory changes from the active state to the standby state, the word line is inactivated, and then the precharging control signal and the equalizing control signal are activated. Accordingly, the precharging operation and the equalizing operation for the pair of bit lines restart. Since one of the pair of bit lines and the other bit line have substantially the same electric load capacitance, the voltage of one of the pair of bit lines and the voltage of the other bit line are set to approximately half of the restoring voltage by the equalizing operation.
When the precharging voltage is set to a half of the restoring voltage, in the precharging operation after the restoring operation as described above, a current which has to be supplied by a voltage supply circuit for a precharging voltage barely exists. Further, when the precharging voltage is set to a half of the restoring voltage, in the precharging operation after a read operating or a write operation, the current which has to be supplied by the voltage supply circuit for a precharging voltage barely exists. As such, when the current which has to be supplied by the voltage supply circuit for a precharging voltage is constantly small regardless of the operation state of the semiconductor memory, drivability (current supply capacity) of the voltage supply circuit for a precharging voltage could be small.
In general, a push-pull-type voltage supply circuit is used as the voltage supply circuit for a precharging voltage. In the push-pull-type voltage supply circuit the output voltage is set substantially constant by an output node being connected to a restoring voltage line or a ground line through output transistors when an output voltage is deviated from a predetermined voltage range (dead zone). In such a push-pull-type voltage supply circuit, the output voltage is not influenced by threshold voltages of the output transistors, like a source-follower-type voltage supply circuit (for example, see Japanese Unexamined Patent Application Publication No. 2001-325792). For this reason, the push-pull-type voltage supply circuit can set the output voltage with higher precision, as compared to the source-follower-type voltage supply circuit. Further, the change in an output current in a voltage region neighboring the dead zone is precipitous in the push-pull-type voltage supply circuit. For this reason, the change in the output voltage depending on the output current is smaller in the push-pull-type voltage supply circuit, as compared to the source-follower-type voltage supply circuit.
On the other hand, there is a case in which the precharging voltage VPR is set lower than a half of the restoring voltage VBLH in order to improve a margin for reading out data of the sense amplifier. In this kind of case, the current which has to be supplied by the voltage supply circuit for a precharging voltage temporarily increases in the precharging operation after the restoring operation. The current IVPR in this case is expressed using load capacitance of one of the pair of bit lines CBL, the number of sense amplifiers to be activated NSA, and the activation period of each of the sense amplifiers TCYC,as shown in the following equation (1).IVPR={(VBLH/2−VPR)·2·CBL·NSA}/TCYC  (1)
Further, when a voltage supply circuit for a restoring voltage is constituted using a source-follower circuit of nMOS transistors, the voltage of one of the pair of bit lines at the time of the end of the restoring operation increases as the restoring operation period extends. Even in this kind of case, the current which has to be supplied by the voltage supply circuit for a precharging voltage temporarily increases in the precharging operation after the restoring operation. The current IVPR in this case is expressed using the voltage of one of the pair of bit lines at the time of the end of the restoring operation VBLX, as shown in the following equation (2).IVPR={(VBLX/2−VPR)·2·CBL·NSA}/TCYC  (2)
As such, the voltage supply circuit for a precharging voltage is required to have large drivability when the current, which has to be supplied by the voltage supply circuit for a precharging voltage, temporarily increases according to the operation state of the semiconductor memory. In order to increase drivability of the push-pull-type voltage supply circuit, it is preferable to increase the channel widths of the output transistors. However, when the channel widths of the output transistors increase, the load capacitance of the output terminal of each of differential amplifiers, which outputs control signals to the output transistors, increases. For this reason, the response speed against the change of the output voltage is lowered.
Further, in the push-pull-type voltage supply circuit, a feedback loop is formed by a two-stage amplifying circuit. Accordingly, when the channel widths of the output transistors increase, the stability against oscillation lowers, and thus causes oscillation to easily occur. The lowering of the response speed against the change of the output voltage and the lowering of stability against oscillation can be avoided by increasing bias currents of the differential amplifiers. However, when the bias currents of the differential amplifiers are constantly increased regardless of the operation state that the semiconductor memory is in, power consumption in the standby state of the semiconductor memory increases.

Voltage supply circuit and semiconductor memory


A facility is provided for transitioning a database service from a failing, primary server to another server of a computing environment including a plurality of servers, at least some of which have a common database service capability, but not commonly replicated supporting databases. The facility includes, responsive to detection of failure at the primary server, selecting another server of the plurality of servers to function as database service backup for the primary server, updating at least one configuration file of the computing environment to indicate that the another server is to function as database service backup for the primary, failing server, and dynamically creating at least one database structure at the another server. The dynamically created at least one database structure supports the database service backup function at the another server and corresponds to a database structure of a database supporting the database service at the primary server.

A computing environment wherein multiple servers have the capability of sharing resources is referred to as a cluster. A cluster may include multiple operating system instances which share resources and collaborate with each other to process system tasks. Various cluster systems exist today, including, for example, the RS/6000 SP system offered by International Business Machines Corporation.
Within a typical cluster, redundant hardware and software are used to provide replicas on a backup server(s) of each database on an associated primary server, such that clustered servers are exact duplicates of another server. This clustered environment today forms the basis for high availability computing. In the event of a primary server failover, a user's data request is transparently routed to the clustered (i.e., backup) server, allowing the user to access the appropriate data without even realizing that the primary server has failed.
One problem with maintaining exact duplicates of servers and their databases within a computing environment is the obvious cost disadvantage of requiring currently maintained, redundant databases supporting one or more database services.
Thus, there is a need for techniques, responsive to failure at a primary database server, to dynamically transition database service responsibility from the failing server to another database server of a computing environment without pre-requiring maintenance of redundant databases at the primary and backup servers.

This patent is subject to a terminal disclaimer.

Transitioning of database service responsibility responsive to server failure in a partially clustered computing environment


A fluidized bed apparatus having a gas distribution plate containing a plurality of tuyeres, which tuyeres provide a uniform gas flow from the gas chamber of the apparatus to the reactor chamber of the apparatus and prevents particulate matter of the fluidized bed from backsifting from the fluid bed chamber through the gas distribution plate to the gas chamber. The tuyeres are secured in openings in the gas distribution plate and comprise a porous plate and preferably a perforated plate superposed within a flanged two-component structure which two components are screwed together or otherwise secured together to form the tuyere.

1. Field of the Invention
This invention relates generally to a fluid bed apparatus and, in particular, to an improved gas distribution plate of the fluid bed apparatus which plate provides enhanced gas distribution flow to the reaction chamber of the apparatus and wherein the gas distribution plate prevents backsifting of bed particles from the fluid bed reaction chamber to the windbox chamber situated below the gas distribution plate.
2. Description of Related Art
Fluid bed apparatus are well known in the art and have been used for a number of industrial processes ranging from chemical reactions to the heating and/or cooling of materials. Basically, the fluid bed apparatus comprises a chamber through which a gas is passed upwardly and the gas fluidizes solid particles in the chamber and forms a fluid bed which is typically characterized as being similar to a boiling liquid.
A typical fluid bed apparatus comprises a vertical elongated chamber having a gas distribution plate near the bottom of the chamber. Air or other gaseous material (hereinafter referred to as gas for convenience) is introduced into a windbox or gas distribution chamber below the gas distribution plate and flows upward through openings in the plate and mixes with and fluidizes particulate solid material which is contained in the reaction chamber above the gas distribution plate. When the flowing gas and solid particles are mixed a fluid bed is generated which may be characterized as a very turbulent, random moving mixture. Depending on the operation performed in the fluid bed apparatus, the fluidizing gas, typically air or nitrogen, exits at the top of the fluid bed apparatus through a flue. The space in the chamber above the fluidized bed is typically called the freeboard section where larger solid particles entrained in the gas typically separate by gravity from the rising gas stream and fall back into the fluidized bed. The gas exiting the flue usually contains some fine solid particles. Where it is necessary to remove a product from the apparatus, outlets at various parts of the apparatus are provided to remove the particles which have either been reacted, dried, cooled or otherwise treated.
It is important that the gas fed into the fluid bed apparatus and which is mixed with the solid particulate matter in the reaction chamber be evenly distributed to provide a uniform and efficient fluidized bed mixture. Typically, such uniformity is attained by using a gas distribution plate having a number of evenly spaced vertical openings across the width of the plate through which the gas travels and mixes with the solid bed particles. As can be appreciated, one of the problems with a fluid bed apparatus is that the bed particles in the chamber, which are typically fine, may fall back (backsift) through the openings in the gas distribution plate into the windbox chamber. The backsifting may not only clog the holes inhibiting or preventing gas flow therethrough but also decreases the efficiency of the operation since the backsifted particles are not in the reaction chamber and will have to be removed from the gas windbox chamber and recycled back to the fluid bed in the reaction chamber. This problem is especially serious for fluid bed solid materials which are highly flowable, small in size and have a minimum or zero angle of repose.
To overcome the problem of backsifting of bed particles below the gas distribution plate, various designs for the gas distribution plate have been developed. One of the designs utilizes adjustable ports to restrict the backsifting and such a gas/diffusion plate for a fluidized bed apparatus is described in U.S. Pat. No. 4,068,389, which patent is hereby incorporated by reference. This patent shows the use of screw studs which are screwed into openings in the gas distribution plate and wherein the openings are tapped. The screw studs are designed to provide a tortuous path of small cross-sectional area between the side of the opening and the screw stud in which the gas travels from the windbox chamber to the fluid bed chamber of the apparatus. A modified embodiment of the screw stud is the use of a machine screw having a head wherein interposed between the bottom face of the head and the upper surface of the distribution plate is a standard form of internal lock washer through which the gas passes after exiting the screw thread opening. This embodiment is preferred over the screw stud since the lock washer is in a horizontal plane whereby agitated particles are precluded from entering due to gravity. It has also been proposed to use sintered metal plates as the gas distribution plate in a fluid bed apparatus but sintered plates are typically fragile and crack due to thermal expansion stresses. Size and temperature will be limited for this type of design.
Bearing in mind the problems and deficiencies of the prior art, it is therefore an object of the present invention to provide a highly effective and efficient gas distribution plate for use in a fluid bed apparatus which minimizes backsifting of solid bed particles below the plate into the gas chamber or windbox of the apparatus.
It is a further object of the present invention to provide a fluid bed apparatus having an improved gas distribution plate which plate minimizes backsifting of solid bed particles from the reaction chamber to the gas chamber or windbox of the apparatus while still providing highly effective and efficient gas distribution to the reaction chamber of the apparatus.
It is yet another object of the present invention to provide a method for operating a fluid bed apparatus wherein there is a minimum of backsifting of bed particles from the reaction chamber to the gas chamber or windbox of the apparatus.
Another object of the present invention is to provide a tuyere for use in the gas distribution plate of a fluid bed apparatus whereby gas flows upward through a plurality of the tuyeres and fluidizes solid particulate matter in the apparatus without any significant backsifting of solid particles through the tuyeres.
Still other objects and advantages of the invention will in part be obvious and will in part be apparent from the specification.

Kinetics Technology International Corporation


The present disclosure relates to fabricating substrates for use in microelectronic device packages. In at least one embodiment, two substrate cores may be attached together during build-up layer formation on each substrate core to increase substrate fabrication throughput. The embodiments of the present disclosure may allow the processing of relatively thin substrates.

In the production of microelectronic devices, microelectronic dice are generally mounted on substrates which provide electrical communication routes between the microelectronic dice and external components. The substrate may add considerably to the overall expense of a microelectronic package. Thus, in the pursuit of lower costs, advancements that reduce the cost of substrates are continually sought by the microelectronic device industry.

Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabrication


A device for grinding tablets includes a body, an electric motor housed within the body, a power source connected to the electric motor via a switch, a grinder driven to rotate by the electric motor, a tablet chute to the grinder, and a particle bin attached to or formed integrally with the body for receiving particles from the grinder.

The present invention relates to a device for grinding tablets/pills. More particularly, although not exclusively, the invention relates to a handheld device into which whole tablets can be inserted for grinding into particulate form.
Tablets come in different sizes depending upon the prescribed or desired dosage. Some tablets are provided with a score line to facilitate easy breakage into two parts. Where a dosage smaller than half a tablet is desired, further breakage becomes difficult—especially for elderly people or people with arthritic conditions for example. For this reason, it is often desired to grind tablets into powdered form for subsequent ease of portioning.
Some tablets are not rapidly absorbed into the body after being taken. Grinding of tablets into granular or powdered form increases the rate of absorption in the body.


The image forming apparatus comprises: a liquid ejection head which has a plurality of nozzles and a plurality of pressure generating elements corresponding to the nozzles, and applies a drive signal to the pressure generating elements so as to eject recording liquid from the nozzles; a plurality of drive waveform generating circuits which generate the drive signal having waveform for driving the pressure generating elements; a plurality of dummy capacitive loads which are connected to the drive waveform generating circuits; and a circuit selection device which selects at least one of the drive waveform generating circuits for applying the drive signal to at least one of the pressure generating elements and the dummy capacitive loads.

1. Field of the Invention
The present invention relates to an image forming apparatus, and more particularly, to an image forming apparatus which carries out printing by using a liquid ejection head having pressure generating elements corresponding to a plurality of ejection ports (nozzles), and to drive control technology for a liquid ejection head suitable for the image forming apparatus.
2. Description of the Related Art
In general, in an inkjet type recording apparatus (inkjet printer), ink droplets are ejected at prescribed timings from the nozzles of the recording head, on the basis of the dot pattern data (also called "dot data" or "print data") expanded from image data for printing which has been input from a host computer. Printing is carried out by means of these ink droplets landing on and adhering to a print recording medium, such as a piece of recording paper.
As a system of the recording head, for example, a system where ink droplets are ejected by causing change in the volume of pressure chambers (pressure generating chambers) connected to nozzle apertures, is known. In a recording head of this kind, a diaphragm which is elastically deformable in the outward direction is formed on a portion of the circumferential walls which demarcate the pressure chambers, and the volume of the pressure chambers is changed by causing this diaphragm to vibrate by means of pressure generating elements typified by piezoelectric elements.
Generally, a plurality of nozzle apertures are formed in the recording head, and a pressure chamber and a piezoelectric element are provided for each one of the plurality of nozzle apertures. All of the piezoelectric elements are electrically connected in parallel between a common power supply and ground wire, and a switching element is electrically connected in series with each of the piezoelectric elements. A signal (which is also referred to as "drive waveform" or "waveform") for driving the piezoelectric elements is generated by a drive waveform generating circuit, and it is selectively distributed and supplied to the piezoelectric elements via the power supply line and the switching elements.
More specifically, if a prescribed switching element, such as a switching array or analogue switch is selected and switched on according to the print data, for example, then a drive waveform is applied to a piezoelectric element via the power supply line, and an ink droplet is ejected from a prescribed nozzle aperture corresponding to the piezoelectric element to which the drive waveform has been applied.
In an inkjet recording apparatus which uses piezoelectric elements as described above, a common drive circuit system is generally adopted. In the common drive circuit system, one common drive waveform formed by combining a plurality of drive waveform elements for ejecting a plurality of types of ink droplets of different ink volumes (for example, a large dots, a medium dot, and a small dot) is used, and the required waveform portion is selectively applied to each of the piezoelectric elements by means of switches (see Japanese Patent Application Publication Nos. 2002-154207 and 2000-37867). In this system, there is no need to prepare drive waveform generating circuits individually for each of the piezoelectric elements because the common drive waveform is simultaneously applied to a plurality of piezoelectric elements. Therefore, this system has benefit in that the number of analogue circuits for high-voltage and high-precision, and the number of wires, can be reduced.
On the other hand, in view of the object of increasing printing speed and the like, in recent years, array type and line type printers have been proposed, in which a very large number of nozzles are prepared, ink being simultaneously ejected from the large number of nozzles in such a manner that printing is carried out quickly. In an array type or line type recording head having a large number of nozzles, if the common drive circuit system described above is used without modification, then a large number of piezoelectric elements are simultaneously driven according to drive waveforms output from a single drive circuit, the drive waveform is distorted by the load fluctuation, ejection errors may arise, and consequently non-uniformities in image quality may occur.
Various methods have been proposed in view of these. For example, a method where a dummy load element having an electrostatic capacitance (for example, several hundred nanofarads (nF) for approximately 1000 elements (nozzles)), which exceeds the electrostatic load capacitance of the piezoelectric elements ("several hundred picofarads (pF) per element" multiplied by "the number of elements") is provided (connected) either before or after the power supply line (signal wire), a method where various feed back controls based on a circuit (hardware) are applied to the drive circuit, a method where various feed back controls based on a software are applied to the drive circuit, and the like.
FIG. 24 shows the principal composition of the circuit required for head driving on the basis of the related art technology. As shown in FIG. 24, a ceramic capacitor 502 forming a dummy load element is provided before the flexible substrate 500 forming the power supply line, and a ceramic capacitor 504 forming a dummy load element is provided after the flexible substrate 500. At least one of the ceramic capacitors 502 and 504 should be connected to the flexible substrate 500.
Furthermore, as an example of providing to a signal line a dummy load element having a larger capacitance than the load capacitance of the piezoelectric element, there is a method in which each head is driven by selecting and adjusting the dummy load element for each head, in order to operate a plurality of heads having piezoelectric elements with different specifications in the same apparatus, as described in Japanese Patent Application Publication No. 2004-122120. The time constant τ which is a factor that flattens the drive signal, can be expressed as τ=C×R, on the basis of the electrostatic capacitance component C of the piezoelectric element, and the resistance component R, such as the wiring resistance, on resistance of analog switch. A method where the electrostatic capacitance component C and the resistance component R are adjusted in such a manner that this time constant τ is uniform, is known.
Furthermore, as an example of applying a circuit-based feedback to the drive circuit, there is a method where the feedback method is adjusted and a dummy load element is prepared in the piezoelectric element connection sections, in such a manner that variation in the on-resistance of the analog switches can also be adjusted, as described in Japanese Patent Application Publication No. 2002-59543. As an example of applying control-based feedback to the drive circuit, there is a method where the capacitance value of the required load is monitored, a dummy load element is selected on the basis of the monitoring results, and the capacitance of the dummy load element is determined in such a manner that the sum of the capacitance load and the dummy load is constant, as described in Japanese Patent Application Publication No. 11-320872.
However, in a print head having a plurality of nozzles exceeding 1000 nozzles, such as an array or line type of print head which ejects ink substantially simultaneously from the large number of nozzles in order to perform high-speed recording, a plurality of drive circuits constituted by common drive circuit systems need to be prepared. In this system, it is necessary to provide each of the drive circuits with a dummy load element, and hence the circuits may become large in size and the installation may become difficult. In addition to this, it is necessary to adjust the drive circuits in such a manner that the standards of the electrostatic capacitance value of the drive circuits are different from each other. For example, if a situation occurs where the electrostatic capacitance relating to ejection is low and the dummy load is high in a certain drive circuit and the electrostatic capacitance relating to ejection is high and the dummy load is low in another drive circuit, then some dummy loads are redundantly driven and there is an insufficiency in the electrostatic capacitance of the dummy loads used. As a result of that, power is wastefully consumed in the drive circuits (the power consumption in the drive circuits gets increase).
Specifically, if not only a large number of piezoelectric elements but also dummy load elements are simultaneously driven, then the drive circuit instantaneously consumes a large amount of power. Therefore, a voltage drop may occur in the power supply. In order to avoid the voltage drop of this kind in the power supply and to drive the piezoelectric elements reliably, it is necessary to provide a power supply apparatus having a large power supply capacity.
Furthermore, if a large amount of energy is consumed by the drive circuit and the drive energy is insufficient, then ink ejection may become unstable, and quality deterioration may arise in the recorded image.


Monoblock orthopedic and/or dental implants are disclosed. The monoblock implants include a ceramic articulating surface and an osseointegrative bone-contacting surface. Methods of making such implants also disclosed.

Orthopedic implants are commonly used to replace some or all of a patient's joint such as a hip, knee, shoulder or elbow where deterioration of or damage to the joint has occurred due to aging, illness, injury or trauma. Orthopedic implants are commonly made of metal, ceramic, polymeric materials, or some combination thereof. For example, orthopedic implants commonly include a metal or ceramic portion that articulates against a polymeric bearing surface, or a metal surface that articulates against a facing metal or ceramic surface. In a hip replacement, the orthopedic hip implant will typically include a femoral component having a metallic or ceramic head that articulates against a polymeric (or metal or ceramic) surface of an acetabular cup. The polymeric bearing surface of the acetabular cup is typically contained within a metal or metal-containing shell which has been treated, formed, or otherwise adapted to allow for and promote bone ingrowth. The metal or metal-containing shell may incorporate, at its outer or bone contacting surface, porous titanium, tantalum, or a tantalum foam, such as Trabecular Metal™, a material used in orthopedic implants made by Zimmer, Inc., of Warsaw, Ind., and discussed in greater detail below.
In general, implants are classified as either modular or monoblock (i.e., single piece). Modular orthopedic implants are those where the implant is composed of two or more assembled parts connected by a locking mechanism and allowing for some of the constituent parts to be replaceable. For example, in a modular acetabular cup, the polymeric portion (that includes the bearing surface) is attached by mechanical means to the inside of a metal shell. With this arrangement, surgeons can replace a defective polymeric insert with another polymeric, ceramic or metal insert without disrupting the fixation of the shell to the bone. In contrast, monoblock implants are considered "single-piece" implants where the constituent components are integral and not interchangeable.
With respect to the interaction between articulating surfaces, a common concern is the generation of debris resulting from the relative motion of such surfaces. For example, motion between a metal component and a polymeric material, or the motion between facing metal surfaces may result in the release of polymeric or metallic debris into the surrounding environment. Such debris can interfere with the proper function of the orthopedic implant as well as cause an undesirable autoimmune response in the patient. For these reasons, research and development of low friction orthopedic implants that minimize the generation of debris is ongoing.
In addition to minimizing the friction between articulating surfaces and thereby limiting the production of debris, secure affixation of the implant within the bone is an extremely important aspect of joint replacement. Long-term stabilization of the implant is often achieved by incorporation or integration of the implant into the surrounding natural bone of the patient. Over time, bone from the surrounding tissue will grow into and around the implant and secure the implant to the bone tissue. This phenomenon is often referred to as osseointegration. To promote osseointegration, orthopedic implants are commonly provided with a bone-contacting surface that allows and promotes bone ingrowth. For example, many implants are provided with a porous bone-contacting surface which allows bone tissue to extend and grow into the pores of such surface. Examples of such implants are those that include a porous metal surface, such as titanium or tantalum, and implants including the previously mentioned Trabecular Metal™.
As noted above, in addition to the metal and polymeric materials used in many of the currently available implants, other materials such as ceramics have likewise been used in orthopedic implants, particularly modular implants. Ceramic materials and implants including ceramic articulating surfaces are believed to reduce the amount of debris generated by the motion of the articulating surfaces. One example of a ceramic implant is disclosed in U.S. Pat. No. 7,695,521, the contents of which are incorporated herein by reference. Another example of a ceramic-based implant is disclosed in WO 2009/103775 A2, the contents of which are also incorporated herein by reference. Ceramic materials for use with orthopedic implants and/or dental implants are described in U.S. Pat. No. 6,534,197, the contents of which are likewise incorporated herein by reference. While the use of ceramic materials in a modular implant, where the ceramic portion that includes the bearing surface is mechanically attached to a component that includes metal is known, monoblock implants (wherein the ceramic component is bonded to or otherwise attached without mechanical locking mechanisms) with an integral bone in-growth surface have been more difficult to achieve.
Accordingly, it would be desirable to provide a ceramic monoblock implant wherein the bone-contacting surface allows for a reliable and secure affixation through osseointegration with natural bone.

Ceramic monoblock implants with osseointegration fixation surfaces


A continuous screw tightening machine including a driving machine (4) equipped with a grip handle (2); a tightening machine main body (3) with which a bit (7) for screw tightening is removably connected to the driving machine (4) through a reduction gear and a clutch; and a screw feed mechanism through which the bit (7) is rotatably inserted and which sequentially feeds a screw to the position where a tightening operation is to be carried out by the bit 7. The screw tightening machine also includes a screw feed mechanism main body (6) which is connected to the front of the tightening machine main body (3) so as to be slidable in the longitudinal direction, a screw supply mechanism (110) which continuously supplies a number of single-part screws in sequence to the screw feed mechanism under the force of gravity, and a tip block (12) which is connected to the screw feed mechanism main body, providing a surface to be contacted with an object.

1. Field of the Invention
The present invention relates to a continuous screw tightening machine which, in order to fix a plate material, such as a wooden plate, a metallic plate or a gypsum plate, on the floor or the like, continuously tightens screws without the need for using a conventional screw gang element containing a number of screws arranged at prescribed intervals in a row by means of a belt-like member.
2. Description of the Related Art
Conventionally, in order to screw-fix a plate material, such as a wooden plate, a metallic plate or a gypsum plate, on the floor or other object, a continuous screw tightening machine which can continuously tighten screws has been proposed.
This type of continuous screw tightening machine is exemplified by a continuous screw tightening machine with which a screw gang element containing a number of screws arranged at prescribed intervals in a row by means of a belt-like member is loaded in the screw tightening machine main body for tightening a screw while feeding another screw, but before the advent of the continuous screw tightening machine, the single-shot screw tightening machine with which a single-part screw is charged into the screw tightening machine main body one at a time and screwed-in into the object one by one had been used.
The patent document 1 discloses a continuous screw tightening machine with which the screw gang element is loaded in the screw tightening machine main body for tightening a screw while feeding another screw. With this machine, a driving machine is incorporated in the tightening machine main body on which a grip handle is formed; to the front of the tightening machine main body is mounted a screw feed mechanism main body through a pair of guide poles such that the screw feed mechanism main body is capable of being slid in the longitudinal direction; between the pair of guide poles is parallel disposed a bit for tightening the screw, and this bit is removably connected to a clutch such that it is rotation-driven through a rotating spindle, a reduction gear, and the clutch; and to the screw feed mechanism main body is mounted a magazine accommodating a screw gang element containing screws arranged in a row by means of a belt-like member and then rolled. Although the patent document discloses a continuous screw tightening machine with which a magazine accommodating said screw gang element is mounted, a continuous screw tightening machine with which the magazine is not used, but only said screw gang element is used is also available.
However, with the continuous screw tightening machine as disclosed in the patent document 1, the screw gang element is employed, and to use this continuous screw tightening machine, the screw gang element containing a number of screws arranged by means of a belt-like member must be previously formed; the formation of the screw gang element itself is complicated and thus the expense for it is high; and due to the amount of such expense, the operating cost of the continuous screw tightening machine has been high. The continuous screw tightening machine as disclosed in the patent document 1 is a machine of the type which must use the screw gang element, regardless of whether the magazine is used or not.
The patent document 2 discloses a portable fastening bit power driving tool which is of one-by-one tightening type. With this tool, one portion of a main body formed in the shape of a Y comprises an upper tube, a driving spindle, and a driving tool. The other portion comprises a supply tube which supplies a single-part screw. The upper tube and the supply tube are connected to the lower tube. Also, the upper tube and the driving spindle are configured such that they are capable of being reciprocated with respect to the lower tube. An escape apparatus, which is synchronized with the motion of the upper tube and the driving spindle, is provided, and by the motion of the upper tube, the escape apparatus is operated to supply a fastening bit to the lower tube during the return stroke of the driving tool.
However, the portable fastening bit power driving tool as disclosed in the patent document 2 is constructed such that the screw is charged one by one into the supply tube, thus it is, of course, impossible to carry out a continuous screw tightening operation. When a plurality of screws are accidentally charged into the supply tube, blocking is caused; and if a screw is charged in a reverse orientation, there will arise the need for taking it out. Other disadvantages are involved, and thus, every time one cycle of a tightening operation is completed, the subsequent screw must be confirmed for its orientation before being charged into the supply tube. Thus, an extremely time-consuming operation is required, and the operation efficiency is extremely low.
Patent Document 1
Patent Publication No. JP/P09-136269A/1997
Patent Document 2
Patent Publication No. JP/P52-1699A/1977


Compositions comprising Group 4 metal complexes in the +2 or +3 formal oxidation state and containing an anionic pentadienyl ligand or a substituted derivative thereof and activating cocatalysts are used as catalysts for polymerizing olefins, diolefins and/or acetylenically unsaturated monomers. Monovinylidene aromatic monomers in particular are polymerized to form highly syndiotactic polymers.

This invention relates to a process for preparing polymers of prochiral olefins, especially vinylaromatic monomers, having a high degree of syndiotacticity. More particularly, the invention relates to such a polymerization process using catalysts comprising certain Group 4 metal complexes in combination with one or more activating cocatalysts, characterized in that the complex comprises a cyclic or noncyclic, non-aromatic, anionic, dienyl ligand group forming a .pi.-bond to the metal. In the complexes, the metal is in the +2 or +3 formal oxidation state.
It is previously known in the art to prepare highly syndiotactic vinyl aromatic polymers and other prochiral olefins by the use of titanium complexes containing a single cyclopentadienyl or substituted cyclopentadienyl group and an activating cocatalyst including alkylalumoxanes, inert, noncoordinating ion forming compounds, Lewis acids and mixtures thereof. Disclosures of such prior art processes are found in U.S. Pat. Nos. 5,045,517, 5,066,741, 5,206,197 and U.S. Pat. No. 5,886,117.
Bis(cyclopentadienyl)titanium complexes in which the titanium is in the +4 formal oxidation state, and olefin polymerization catalysts formed from such by combination with an activating agent, e.g., alumoxane or ammonium borate, are well known in the art. Thus, U.S. Pat. No. 3,242,099 described the formation of olefin polymerization catalysts by the combination of bis(cyclopentadienyl)titanium dihalides with alumoxane. U.S. Pat. No. 5,198,401 disclosed tetravalent bis(cyclopentadienyl)titanium complexes, including at col. 9, lines 24-27, diene-containing complexes and olefin polymerization catalysts obtained by converting such complexes into cationic form. Particularly preferred catalysts are obtained by the combination of ammonium borate salts with the bis(cyclopentadienyl)titanium complexes. Generally, such bis(cyclopentadienyl) containing complexes are inferior for use in catalysts to prepare polymers having a high degree of syndiotacticity.
The preparation of certain Ti, Zr, and Hf monocyclopentadienyl diene complexes was also described in Yamamoto et al., Organometallics, 8, 105 (1989) (Yamamoto) and Blenkers, J, et al., Organometallics, 6, 459 (1987) (Blenkers). Titanium and zirconium complexes in which the titanium is in the +4 formal oxidation state, including monocyclopentadienyl complexes are also known in the art. Examples of the foregoing references include: U.S. Pat. Nos. 5,064,918, 4,774,301, and 4,808,680.
In copending application, Ser. No. 08/082,197 filed Jun. 24, 1993, now abandoned, there are disclosed monocyclopentadienyl complexes having a cyclic structure in which the titanium is in the +2 formal oxidation state. The application also teaches the formation of olefin polymerization catalysts from such complexes by the combination of the complex with activator compounds such as alumoxanes, borate salts and strong Lewis acids. The teachings of all of the foregoing patents, patent applications and publications are hereby incorporated by reference.

Syndiotactic prochiral olefin polymerization using non-aromatic, anionic, dienyl group containing complexes


The dynamic routing of a communication network should adapt to the traffic load existing in the network such that the network throughput is optimized. The inventive routing method solves this problem by a dynamic path fan, with alternate paths, upon whose only specifically selected alternate paths are incorporated.

1. Field of the Invention
The present invention is directed to a method for dynamic traffic routing in a communication network.
2. Description of the Prior Art
In a fully interworked, non-hierarchic network with n network nodes, n-2 alternate paths with only 2 path sections exist for every source-destination pair. Given a lopsided loaded network some of the total of the nxc3x97(nxe2x88x921)xc3x97(nxe2x88x922) alternate paths network-wide are under-loaded and other paths are overloaded.
Non-hierarchically organized, line-switching communication networks require dynamic routing that adapts to the traffic load present in the network such that the network throughput is optimized. In particular, lopsided load situations must thereby also be defused by the routing.
As in conventional routing in hierarchic networks, an initial attempt is also made in dynamic routing to set up connections via one or more scheduled paths that are usually direct paths. When this is not possible because, for example, all connecting line bundles of the direct path are completely occupied, the overflow traffic is assigned to alternate paths.
The principal difference between dynamic and conventional routing lies in the selection of the alternate paths. In conventional routing, administratively defined alternate paths are searched for an unoccupied line respective an unoccupied channel in a rigid sequence (xe2x80x9cfixed alternate routingxe2x80x9d). As a result thereof, the routing can only react very unsatisfactorily to unplanned, extraordinary load situations.
In dynamic routing, arising overload traffic is assigned to one or more active alternate paths. This active alternate path or, these active alternate paths are not fixed but are selected according to the respective method for dynamic routing or are even redefined at every call. The advantages of dynamic routing lie in its ruggedness and flexibility in response to lopsided load situations in the network that can arise, for example, due to temporally fluctuating loads (for example, spatially limited, strong traffic volume resulting from, for example, catastrophes) and network degradation (for example, outages of connecting line bundles and outages of switching units). Moreover, uncertainties in the network planning can be compensated better.
Central, status-controlled (dynamic) routing methods are supported on a network-central processor that receives information about the existing, local load situation from the network nodes. Beneficial, under-utilized paths can thus be centrally identified and the network nodes can be correspondingly informed. What is thereby disadvantageous, among other things, is the great outlay for network-central processors, data transmission and additionally required calculating capacity in the network nodes.
Decentralized, status-controlled (dynamic) routing methods are based on the answerback of load conditions of the trunk groups to the originating node of the non-hierarchic (sub-) network. These methods have the disadvantage that the non-standardized interface between the network nodes requires a uniform network (for example, network nodes of only one manufacturer), and also a requirement for high signaling outlay.
Decentralized, event-controlled (dynamic) routing methods can achieve a performance enhancement in that they learn the respective load situation by evaluating all trunks busy events (blocking events). However, a distinction is thereby not made between sporadic blockings (caused by statistical fluctuations of the offered traffic) and nearly complete blocking (caused by lopsided load or partial network overload).
European Application EP 0 696 147 A1 discloses a decentralized, event-controlled method for dynamic traffic routing in a communication network. Since the alternate paths are re-selected given a re-initialization and there is no status information in the selection, it is possible in this method that alternate paths that are blocked long-term can be re-activated. Given these re-activated alternate paths, it is therefore determined either already at the first call or at least after a few calls, given a renewed offering of calls, that the alternate path is no longer available and that it must therefore be removed again from the path fan.
An object of the present invention is to avoid the above-identified disadvantages in the prior art. Another object of the present invention is to provide a method of uniformly distributing overflow traffic onto optimally low-occupancy alternate routes better than hitherto.
This object is achieved in accordance with the invention in a method in which highly loaded alternate paths are not as quickly re-introduced into the path fans as less loaded alternate paths.

Method and system of dynamic traffic control in a communication network


A computer sets a first timing condition for plural registers included in first design information of a semiconductor integrated circuit, and executes first logic synthesis to generate second design information. The computer sets, for the registers, a second timing condition having a smaller timing margin than the first timing condition, and executes second logic synthesis to generate third design information. The computer calculates an area change rate caused by a difference between the timing conditions, on the basis of the second and third design information with respect to each logic cone including a register at its end point, and categorizes the registers into a first group and a second group having smaller change rates than the first group, according to the change rate. The computer executes third logic synthesis with the second timing condition set for the first group and the first timing condition set for the second group.

Designing of semiconductor integrated circuits involves logic synthesis to convert design information from register transfer level (RTL) to gate level (netlist). In the logic synthesis process, RTL design information, timing conditions, design rule check (DRC), etc. are used to decide which circuit to implement functions.
A timing condition that is given at the time of the logic synthesis indicates a design margin relevant to timing (hereinafter, referred to as timing margin). Variations in delay time of clock signals, due to clock skew, clock on chip variation (OCV), crosstalk delay, a gap between wiring delay estimate and real wiring delay, phase locked loop (PLL) jitter, and other reasons may not be considered at the time of logic synthesis. Hence, at the time of logic synthesis, a timing margin is set in the timing condition on the basis of the sum of the worst-case values of delay time variations generated in the above respective delay variation elements, such as clock skew.
See, for example, Japanese Laid-open Patent Publication Nos. 2003-76729, 11-145297, and 6-19999.
In the meantime, when a timing margin is set as described above, a timing constraint to be satisfied becomes severe, and a logic synthesis tool generates a netlist by selecting comparatively high-speed circuits, so as to satisfy the constraint. Such a circuit tends to have a large circuit area. Hence, a problem is to reduce a circuit area of a semiconductor integrated circuit.


A network based system for distributing audio recordings of discrete transmissions from land mobile radio systems received by plural radio terminals having scanning receivers to plural client terminals, including methods of selecting the best available recordings and selectively storing content both locally in the radio terminals and at network based storage locations.

1. Field of the Invention
The present invention relates to land mobile radio scanners and network delivery of audio received thereby. More particularly, the present invention is directed radio scanners operating as radio terminals that are interconnected by the Internet, and which announce availability of captured audio so that client terminals may request audio content through the Internet.
2. Description of the Related Art
Scanning radio receivers, commonly known as "police scanners" or simply "scanners", allow users to listen to police, fire, aircraft, marine, business and other manner of one-way and two-way radio communications across a broad spectrum of frequencies, typically from 25 MHz to 1300 MHz, and including higher frequencies as well. These spectrum, broadcasting, and receiving systems, are generally referred to as Land Mobile Radio (LMR). Land mobile radio systems, also called public land mobile radio or private land mobile radio, is a term that denotes a wireless communications system intended for use by terrestrial users in vehicles (mobiles) or on foot (portables). Such systems are used by emergency first responder organizations, public works organizations, or companies with large vehicle fleets or numerous field staff. Scanners typically have a channel memory that is used to store one or more receiver frequencies, or indicia of frequency, which can be recalled by referencing a channel number, thereby simplifying the entry and selection of desired reception frequencies and reception channels. Various types of scanners are known, some operating in a few bands of frequencies with limited channel memory capacity, others being full-featured models that cover all the pertinent bands and including generous channel memory capacity. Scanners are enabled to sequentially change reception frequencies, thereby scanning through a list of frequencies, searching for broadcasts that may or may not be of interest to a user. In modern scanners the selection of a radio frequency generally includes specifying the radio frequency band and the receiver phase-locked loop (PLL) divisor that is requires to tune the receiver to discriminate the precise frequency of interest. Thus, the specification of the RF-band and PLL divisor with a digital selection means enables a precise reception frequency in most scanners.
Modern radio broadcast systems employ digital processors to control the allocation of frequencies for radio communications. This typically also includes spectrum utilization efficiency improving techniques that enable systems to offer a greater number of communications "channels" than the number of actual radio frequencies that may exist in a system. Thus, a single frequency may be utilized for a large number of channels, which are managed by a system protocol. The system protocols use various techniques for defining and allocating channels, and modern scanners have corresponding decoding systems or distinguishing channels from one another, as is appreciated by those skilled in the art.
Scanner radio receivers typically employ some form of squelch control so that noise and undesirable communications are not routed to a loudspeaker or other audio circuit. Carrier squelch can be used, which gates received audio to a loudspeaker based on the signal-to-noise ratio or carrier-to-noise ratio of the receiver demodulator output. Other systems employ out of band tones that are detected to control squelch. This is an example of a technique to provide more than one channel of communications on a single frequency. Certain receivers are sensitive to certain tones, and therefore receive and transmit communications only on channels where the tones match. One such system employs plural sub-audible tones, and is referred to as a continuously tone coded squelch system ("CTCSS"), as is well known in the art. The receiver checks for a particular one of the plural tones based on the channel programming, and detection of a matching tone enables the squelch gate of the receiver. Another system employs digital data fields that are broadcast along with the primary communication signals, and the receiver looks for a matching digital code. Such systems are referred to as digitally coded squelch systems ("DCS"). Other squelch control systems are known as well.
Early two-way radio systems employed a single radio frequency or a duplex pair of radio frequencies for two-way communications. Such systems lent themselves well to scanning receiver monitoring because a given two-way radio fleet of users, such as the local police department, could be readily monitored by receiving a single, predetermined, radio frequency. However, heavy radio use demand and congested airways caused manufacturers to develop more spectrally efficient radio systems. One solution was the trunked radio system where a group of two to twenty-eight duplex pairs of radio frequencies are allocated together for shared use by plural fleets of users. In a trunked system, talk group identities are assigned to the fleets, which are used to provide receiver squelch gate control for the plural members of any given fleet of users. The difference in a trunked radio system vis-à-vis a conventional system is that the radio frequencies are dynamically allocated during use. For each push-to-talk of a transmitter, the system dynamically allocates a radio frequency for the transmitter to use. As such, a conversation between a dispatcher and a fleet of patrol cars, for example, can change from frequency to frequency within the trunked group of frequencies during the course of a conversation. Thus, the conversation is carried out over an intermittent sequence of discrete radio transmission of audio content. Suppliers of scanning receivers addressed this difference in functionality by developing radios that could track the talk group identities ("talk group ID's") and dynamically hop from frequency to frequency as the conversation progressed. The key to radio scanner operation in a trunking environment is to have all of the trunking frequencies for each trunk group stored in the scanner channel memory, typically associated with a system identity ("System ID"), and then track the talk group ID code of the desired fleet, along with the dynamic allocation of the trunking frequencies. In this way, the trunked scanner functions like a conventional scanner from the user's perspective, with the "channel" actually associated with both a trunking system ID and a talk group ID instead of the conventional radio system frequency-to-channel, plus squelch code, correlation. Certain trunking systems dedicate one of their allocated frequencies as a control channel carrying relatively high speed data signals, which are monitored by receivers looking for assignment to a talk channel from time to time.
Two-way mobile radio communications systems are widely used for a variety of applications including public safety, commercial, and personal communications. Radios with transmitter and receiver elements, commonly known as transceivers, participate in these communications. In addition, other radio receivers, such as scanners, monitor communications without participating through transmissions.
Most two-way radio communications operate according to a transmission trunked control system. This is different from the conversation trunked system. For example, a PSTN telephone call is conversation trunked in that the communications resource is set-up and maintained for the entire duration of a conversation, even during periods of quiet between the parties to the conversation. In a transmission trunked environment, the system operates in a push-to-talk mode. In this situation, each verbal statement from each user is individually transmitted. Each statement by a party to a conversation is transmitted on a radio frequency, and a conversation usually comprises a series of separate discrete transmissions with periods of quiet in which no radio signals occur between individual transmission signal elements. In some instances, if the gap between remarks is short, a transmitter may remain active with no gap in the carrier signal of the radio transmission between remarks. When used for conversation, the result is a radio channel with a series of separate discrete transmissions, each with a relatively short duration, typically in the range of two to sixty seconds. Depending on the level of activity on a channel, this may generate a regular patter of activity, or there may be inactive gaps extending to hours between conversations.
For the sake a clarity, the terms 'channel', 'frequency', 'signal' and 'squelch' are used as follows. The term 'channel' refers to a discrete communications path for the transmission of certain classes of related content that may be independently identified at a radio receiver, regardless of whether this path is currently active with the presence of a radio signal or inactive without the presence of a radio signal, such as a radio broadcast frequency, a coded squelch broadcast signal, or trunked radio system talk group ID. The term 'frequency' refers to an actual radio broadcast frequency on which a communications signal is modulated or may be modulated, such as a conventional frequency or a trunked system working channel. The term 'signal' refers to a discrete period of activity on a channel, such as a single radio transmission, or a series of closely spaced but discrete transmissions. In some cases, evident by context, 'signal' may refer to the content currently present on a broadcast frequency. The term 'squelch' refers to a test determining whether a signal is present on a particular frequency; squelch is true when there is no signal, and unsquelch is true when there is signal.
In common speech there may be confusion between these terms. For instance, in conventional radio systems, there is typically a one-to-one regional correspondence between channels and locally active broadcast frequencies. This encourages a perceived equivalence between the terms, or blurring of meanings. However, the terms have different technical meanings herein.
Frequency agile receivers, commonly known as "scanners", are designed to receive signals on multiple communications channels by sequentially sampling ("scanning") predetermined channels until an active signal is detected, and holding on that channel to receive audio until the transmission or series of transmissions is complete. The scanner then resumes the scanning process to detect the next new signal. Typical scanners can scan hundreds of channels. Since any individual channel will typically have long periods of inactivity, this technology is a practical way to monitor communications on multiple channels with a single receiver, although it is typically not plausible to receive simultaneous communications on different channels with a single receiver.
When a single receiver is receiving a transmission on one channel, it is typically insensitive to any radio communications on other channels. As a limited exception to that principle, some scanners have a 'priority' feature wherein the scanner periodically retunes to a designated "priority" frequency to test for signal, at the cost of brief gaps in the reception of the present non-priority signal. This tradeoff provides for greater reliability in coverage of signals on the designated priority frequency, at the direct cost of performance in the reception completeness of all non-priority signals.
With respect to prior teachings of record by the inventor of the present disclosure, a first co-pending U.S. patent application Ser. No. 11/600,476 to Sullivan et al. filed on Nov. 16, 2006, (hereinafter "Sullivan-1") for a Network Audio Directory Server and Method, the contents of which are hereby incorporated by reference, was submitted by the inventors hereof. Sullivan-1 discloses a system and method of communicating audio through a network. Sullivan-1 addresses certain structure and techniques employed in the network environment. The method includes detecting audio content from an audio source by a first network terminal, sending a directory packet including a network address of the detected audio content to a second network terminal, and requesting the audio content through the network by the second audio terminal. The further step of storing the detected audio content in a buffer for audio packets identified by packet identities is added in some embodiments. The sending of a directory packet step may include sending a packet identity, and the requesting step may include specifying an audio packet according to the packet identity. A further step of sending a source packet including the network address of the detected audio content to a network directory server by the first network terminal may be added. Thusly, the directory server manages the requests and communication of audio content between feed source terminals and receiver terminals.
A first issued U.S. Pat. No. 8,125,988 issued on Feb. 28, 2012, Ser. No. 11/809,964, to Sullivan et al. filed on Jun. 4, 2007 (hereinafter "Sullivan-2") for a Network Audio Terminal and Method, the contents of which are hereby incorporated by reference, was submitted by the inventors hereof. Sullivan-2 discloses network audio feed source terminals, receive terminals and methods. Sullivan-2 teaches a receive terminal that includes a network interface that receives network packets and a network packet scanner coupled to the network interface that sequentially scans received network packets in accordance with scan criteria. A content selector is coupled to the network packet scanner, and selects network packets containing units of audio content from the scanned network packets based on selection criteria. An audio content processor is coupled to the content selector, and processes the audio content in the selected network packets. The network packets may include directory packets containing audio content addresses, in which case, the content selector further selects directory packets based on selection criteria. An audio packet requestor is coupled to the content selector and the network interface, and operates to request audio packets through the network identified by the audio content addresses that correspond to the selected directory packets. Sullivan-2 also teaches a network audio feed source terminal, which is used for coupling units of audio content from an audio source to a network. The feed terminal includes a source interface that receives audio content from the audio source and a content monitor that identifies audio content in accordance with monitoring criteria. The feed terminal also includes a means for capturing a selected portion of the identified audio content as units of audio content in accordance with capture criteria, and, a network interface that couples the units of audio content into the network.
A second issued U.S. Pat. No. 8,429,287 issued on Apr. 23, 2013, Ser. No. 12/432,009, to Sullivan et al. was filed on Apr. 29, 2009 (hereinafter "Sullivan-3") for a Network Audio Distribution System and Method, the contents of which are hereby incorporated by reference, was submitted by the inventors hereof. Sullivan-3 discloses audio content distribution from audio sources to client terminals through a network. An audio source interface receives raw audio from an audio source, and converts it into a digital audio clip in a digital audio packet, containing a timestamp and a channel identity corresponding to the audio source. A network audio server formats the digital audio packet into a network compliant digital audio file, which is stored at a network address. The network audio server generates a directory packet including the address of the digital audio file, the channel identity, and the timestamp, and, couples the directory packet to a directory server located on the network. The directory server outputs a directory stream to a client terminal on the network, which selects a directory packet and sends an audio file request through the network for the digital audio file. The audio file is then sent to the client terminal.
A second co-pending U.S. patent application Ser. No. 13/474,191 to Sullivan et al. filed on May 17, 2012 (hereinafter "Sullivan-4") for Channel Monitoring with Plural Frequency Agile Receivers, the contents of which are hereby incorporated by reference, was submitted by the inventors hereof. Sullivan-4 discloses a system and method to efficiently use a plurality of 'receivers' to monitor a larger plurality of 'sources' for audio content. Upon identifying that a source is active, one of the plural receivers is assigned to convey the content to a destination. All other receivers are prevented from monitoring that specific source for the duration of its activity, but continue to monitor the remaining sources. 'Source' includes any source of information containing audio content. 'Receiver' includes any device capable of selectively conveying such content, including physical switches, hardware or software multiplexers, microphones, radio receivers, or any other means of obtaining such content.
The teachings of Sullivan-1, Sullivan-2, Sullivan-3, and Sullivan-4 encompass certain illustrative embodiments useful in a range of systems and methods for network audio content acquisition, delivery and reproduction. Generally, these teachings amount to building blocks that can be arranged to yield a wide variety of network audio delivery systems. However, the implementation of a network wide system for audio content distribution to a wide variety of end users presents numerous architectural and protocol challenges, particularly with respect to system access security, reliability and integrity, system growth, and traffic management. Thus, it can be appreciated that there is a need in the art for a system and method for implementing and managing a system of plural network coupled radio terminal sources for audio content and plural end user client terminals seeking access to such audio content.

Land mobile radio scanning with network served audio


According to an example, an original image is divided into image blocks according to a preset size, at least one pixel is overlapped between adjacent image blocks, a target image block is obtained after performing reduction processing for each of the image blocks according to a reduction factor, coordinates of the target image block are obtained according to the reduction factor and coordinates of the image block; and the target image blocks are combined according to the coordinates of the target image blocks.

With the development of computer technologies, real-time interactive games are increasingly popular. In the real-time interactive game, scene pictures vary with movements of characters, at the same time, the scene pictures may be scaled according to operations of users. The visual range of the scene pictures displaying to the user also will be consequently expanded or reduced.
Generally, in conventional processing for the pictures in real-time interactive scenes, a picture is divided into image blocks in accordance with a certain size, and then the image blocks are processed respectively. For example, the image blocks may be loaded, reduced or magnified. By processing the image blocks, processing speed is improved, and storage space required in the processing procedure is reduced. However, when performing reduction processing for the picture, since the size of the picture is in units of pixels, the size of the image block after the reduction is an integer, rather than a floating point number which is obtained according to a reduction factor, white "cracks" between two adjacent image blocks will occur after the reduction processing, which will affect the smoothness and aesthetic of the picture.

TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED


A Method for self controlled early detection and prediction of a performance shortage of an application is described comprises the steps of monitoring at least one performance parameter of the application, storing performance data including a time dependency of said performance parameter, using said performance data to compute a mathematic function describing a time dependent development of said performance parameter, using said mathematical function to compute a point in time when the performance parameter exceeds a certain threshold, and generating and outputting a prediction comprising information that a performance shortage of the application is expected at said computed point in time, if said point in time lies within a settable timeframe.

1. Field of the Invention
The present invention relates to the detection and prediction of software performance shortages by monitoring performance parameters such as memory and storage usage, available CPU capacity, and the frequency of application processes.
2. Description of Prior Art
It is very important to provide professional software applications or computing systems, such as databases, with minimal maintenance requirements. Such maintenance often involves ensuring that the software is operating at acceptable levels of performance and efficiency, which requires monitoring the resources used by the software and supporting the software with at least a minimal amount of resources. If a resource becomes unavailable or depleted, such as where the resource is used by the software or is damaged, the corrective measures must be implemented by, for example, dynamically extending full storage devices. It is thus important to know when to implement such corrective measures.
Prior art methods of implementing such corrective measures include defining thresholds for certain performance parameters, where such thresholds may correspond to a performance parameter of an application or to the availability of one or more resources. For example, the performance parameters may correspond to a frequency of processes carried out by an application, a table space fill grade, available memory or storage, and CPU usage.
If a performance parameter exceeds its threshold an exception occurs and an administrator, such as a database administrator (DBA), is informed. Exemplary performance thresholds include 90% table space fill grade, 80% disc storage used, and the like. The upper thresholds are preferably defined such that the application provides full performance until one ore more performance parameters reach their thresholds. Within periodic time intervals, measurements are carried out to determine whether each of the performance parameters has exceeded its respective threshold.
Unfortunately, the prior art suffers from various problems and limitations. For example, by the time the system alerts the administrator to the need for corrective measures, a performance threshold has already been exceeded and it is likely that the system or application will operate at less than optimal levels between the time the administrator is notified and the time the administrator implements the corrective measures. Furthermore, preventing one or more of the performance parameters from reaching the thresholds requires the administrator to spend time monitoring the parameters.
Accordingly, there is a need for an improved method of ensuring optimal performance of a computer system that does not suffer from the problems and limitations of the prior art.

Method to automatically detect and predict performance shortages of databases


A static random access memory (30), resistant to soft error from alpha particle emissions has a high density array of memory cells (44) coupled to word lines (73 and 74) and bit line pairs (68), and operates at low power supply voltages (for example, 3.3 volts). A charging circuit (55) boosts a supply voltage to the memory array above the power supply voltage. The charging circuit (55) includes an oscillator (57), a charge pump (56), and a voltage regulator (58). The boosted supply voltage reduces the effect of an alpha particle hitting the memory array (44) at low power supply voltages. Providing a boosted supply voltage to the memory array (44) improves soft error resistance without adding capacitance to each memory cell (52 and 54).

FIG. 1 illustrates in schematic diagram form six-transistor memory cell 10 according to the prior art. Memory cell 10 includes N-channel transistors 11 and 12, P-channel transistors 13 and 14, and N-channel pass transistors 15 and 16. The gates of N-channel transistor 11 and P-channel transistor 13 are connected to node 102. The gates of N-channel transistor 12 and P-channel transistor 14 are connected to node 101. N-channel pass transistor 15 has a first current electrode connected to node 101 and a second current electrode connected to bit line 17 labeled "BL". N-channel pass transistor 16 has a first current electrode connected to node 102 and a second current electrode connected to bit line 18 labeled "BL*". (Note that an asterisk "*" after a signal or line name indicates that the signal or line is a logical complement of a signal or line having the same name but lacking the asterisk "*".) The gates of N-channel pass transistors 15 and 16 are connected to word line 19 labeled "WL". N-channel pass transistors 15 and 16 couple nodes 101 and 102, respectively, to bit lines 17 and 18 when word line 19 is enabled as a logic high. The sources of P-channel transistors 13 and 14 are connected to a positive power supply voltage terminal labeled "V.sub.DD ". The source of each of N-channel transistors 11 and 12 is connected to a negative power supply voltage terminal labeled "V.sub.SS ". V.sub.SS is normally at ground potential and V.sub.DD receives a power supply voltage of about 3.3 volts. A power supply voltage of about 3.3 volts may range between about 3.0 volts and about 3.6 volts.
N-channel transistors 11 and 12 and P-channel transistors 13 and 14 form a cross-coupled latch. Memory cell 10 stores a data bit based on the voltages at nodes 101 and 102. Reading and writing to memory cell 10 is accomplished through bit lines 17 and 18. To write data into memory cell 10, word line 19 is enabled as a logic high and complementary data signals are applied to bit lines 17 and 18 at a potential high enough to overwrite the contents of the memory cell. The voltage on bit lines 17 and 18 is approximately at the potential of V.sub.DD for a logic high and near V.sub.SS for a logic low. Memory cell 10 will latch in either a logic high or a logic low state depending on the logic states of bit lines 17 and 18.
Assuming bit line 17 is a logic high and bit line 18 is a logic low when word line 19 is enabled, N-channel pass transistors 15 and 16 are both conductive. The logic states of bit lines 17 and 18 are provided to nodes 101 and 102. Node 101 becomes a logic high, causing P-channel transistor 14 to become substantially non-conductive and N-channel transistor 12 to become conductive. Node 102 is reduced to a logic low voltage equal to approximately the negative power supply voltage. P-channel transistor 13 is conductive, and N-channel transistor 11 is non-conductive. Initially, a logic high voltage at node 101 is approximately equal to the positive power supply voltage minus a threshold voltage drop (V.sub.T) across P-channel transistor 13. The voltage at node 101 will eventually rise to approximately the potential of V.sub.DD. The V.sub.T across P-channel transistor 13 is equal to approximately 0.8 volts with a power supply voltage of 3.3 volts.
During a read cycle of memory 30, word line 19 is enabled, causing N-channel pass transistors to be conductive. Column logic/decoders select bit lines 17 and 18 to read the data bit stored in memory cell 10. The latched logic states stored on nodes 101 and 102 are provided to bit lines 17 and 18 as a relatively low differential voltage, (approximately 50-100 millivolts). During a read cycle, the logic states of nodes 101 and 102 remain unchanged.
Memory cell 10 maintains the current logic state for as long as a power supply voltage is provided. However, memory cell 10 may inadvertently change logic states due to charged particle emissions. These charged particles include alpha particles, x-rays, or other sources of ionizing radiation. Alpha particles are emitted as a result of the natural radioactive decay of radioactive elements such as uranium, americium, and thorium. Uranium and thorium are sometimes present in semiconductor packaging material in small amounts. Radioactive elements may also be present in the aluminum layers of the integrated circuit. The alpha particles are emitted from the radioactive elements and penetrate the memory array region of the SRAM cell. An alpha particle striking in the vicinity of memory cell 10 may change the logic state of the cell. When an alpha particle strikes the integrated circuit, electrons migrate toward the most positive sources. The charge from the alpha particle strike may be large enough to cause memory cell 10 to change logic states. This is called a soft error. A soft error is difficult to detect because the memory cell changes logic states without suffering any physical damage.
The critical charge (Q.sub.CRIT) required to cause memory cell 10 to change logic states is equal to the product of the change in voltage as a result of the alpha particle hit (.DELTA.V.sub..alpha.), and the cell capacitance (C.sub.CELL), or EQU Q.sub.CRIT =.DELTA.V.sub..alpha. C.sub.CELL ( 1)
Various techniques have been found to reduce soft error in memory cell 10. For instance, soft error is sometimes reduced by increasing cell capacitance C.sub.CELL. Cell capacitance C.sub.CELL is increased by adding capacitance to N-channel transistors 11 and 12 of memory cell 10, or by coupling capacitors between each of nodes 101 and 102 and V.sub.SS. Q.sub.CRIT should be made large enough to withstand the charge leakage caused by an alpha particle hit. However, write speed may be sacrificed if cell capacitance C.sub.CELL is too large. Increasing Q.sub.CRIT by adding capacitance increases the voltage change .DELTA.V.sub..alpha. required to cause memory cell 10 to change logic states. But, adding capacitance to memory cell 10 increases process constraints and may increase the surface area required for each SRAM cell.
As the density and size of SRAMs are increased, memory cell sizes reduced, and power supply voltage decreased, memory cell 10 becomes even more vulnerable to soft error. Also, P-channel transistors 64 and 65 may be thin film transistor (TFT) loads. TFT transistors provide the advantages of low standby current and good cell stability without increasing cell size. However, the small size of a TFT transistor results in decreased cell capacitance, which also may cause increased soft error. Thus, in a very high density SRAM, as memory cell size is reduced, it becomes harder to increase cell capacitance C.sub.CELL without negating, at least in part, the reduction in size.

Static random access memory resistant to soft error


An antenna includes a substrate including a ground plane and a dielectric layer adjacent thereto and at least one antenna unit carried by the substrate. The at least one antenna unit may include a plurality of adjacent antenna elements arranged in spaced apart relation from one another about a central feed position on the dielectric layer opposite the ground plane. The at least one antenna unit may also include an antenna feed structure including a respective coaxial feed line for each antenna element and a feed line organizer body having passageways therein for receiving respective coaxial feed lines.

The present invention relates to the field of communications, and more particularly, to phased array antennas.
Existing microwave antennas include a wide variety of configurations for various applications, such as satellite reception, remote broadcasting, or military communication. The desirable characteristics of low cost, light-weight, low profile and mass producibility are provided in general by printed circuit antennas wherein flat conductive elements are spaced from a single essentially continuous ground element by a dielectric sheet of uniform thickness. The antennas are designed in an array and may be used for communication systems such as identification of friend/foe (IFF) systems, personal communication service (PCS) systems, satellite communication systems, and aerospace systems, which require such characteristics as low cost, light weight, low profile, and a low sidelobe.
The bandwidth and directivity capabilities of such antennas, however, can be limiting for certain applications such as space applications. Furthermore, while a microstrip patch antenna is advantageous in applications requiring a conformal configuration, e.g. in aerospace systems, mounting the antenna presents challenges with respect to the manner in which it is fed such that conformality and satisfactory radiation coverage and directivity are maintained and losses to surrounding surfaces are reduced.
More specifically, increasing the bandwith of a phased array antenna with a wide scan angle is conventionally achieved by dividing the frequency range into multiple bands. This approach results in a considerable increase in the size and weight of the antenna while creating a Radio Frequency (RF) interface problem. Also, gimbals have been used to mechanically obtain the required scan angle. Again, this approach increases the size and weight of the antenna, and results in a slower response time.
Additionally, prior art phased array antennas often have an antenna feed structure including coaxial feed lines to be connected to the various antenna elements. These coaxial feed lines are typically parallel to a common axis and soldered together to form the antenna feed structure. The feed structure is inserted through the antenna""s substrate for connection with the antenna elements. Yet, it may be difficult to properly ground such antenna feed structures while connecting them to the antenna elements, which may result in undesirable common mode currents, for example.
Thus, there is a need for a lightweight patch dipole phased array antenna with a wide frequency bandwith and a wide scan angle, and that can be conformally mountable to a surface.
In view of the foregoing background, it is therefore an object of the invention to provide a lightweight patch dipole phased array antenna with a wide frequency bandwith and a wide scan angle, and that can be conformally mountable to a surface.
This and other objects, features and advantages in accordance with the present invention are provided by an antenna including a substrate including a ground plane and a dielectric layer adjacent thereto and at least one antenna unit carried by the substrate. The at least one antenna unit may include a plurality of adjacent antenna elements arranged in spaced apart relation from one another about a central feed position on the dielectric layer opposite the ground plane. The at least one antenna unit may also include an antenna feed structure including a respective coaxial feed line for each antenna element and a feed line organizer body having passageways therein for receiving respective coaxial feed lines.
More specifically, the feed line organizer body may include a base connected to the ground plane and a guide portion carried by the base. The base and the guide portion may be integrally formed as a monolithic unit, for example. Moreover, the guide portion may include a bottom enclosed guide portion carried by the base, a top enclosed guide portion adjacent the antenna elements, and an intermediate open guide portion extending between the bottom enclosed guide portion and the top enclosed guide portion adjacent the antenna elements. Each coaxial feed line may be soldered to the feed line organizer body at the intermediate open guide portion. Furthermore, the antenna feed structure may include a tuning plate carried by the guide portion. Additionally, the passageways may each be parallel to a common axis, and the feed line organizer may include at least one conductive material, such as brass, for example.
The ground plane may extend laterally outwardly beyond a periphery of the at least one antenna unit. Also, the antenna may further include at least one hybrid circuit carried by the substrate and connected to the antenna feed structure. Each antenna element may have a generally rectangular shape, and the at least one antenna unit may include a plurality of antenna units arranged in an array. Furthermore, the dielectric layer may have a thickness in a range of about xc2xd an operating wavelength of the at least one antenna unit. Additionally, there may be at least one impedance matching dielectric layer on the at least one antenna unit.
A method aspect of the invention is for making an antenna and includes providing at least one antenna unit on a substrate comprising a ground plane and a dielectric layer adjacent thereto. The at least one antenna unit may include a plurality of adjacent antenna elements arranged in spaced apart relation from one another about a central feed position on the dielectric layer opposite the ground plane. Additionally, the substrate may have an opening therein exposing portions of the plurality of adjacent antenna elements. The method may further include forming an antenna feed structure by positioning respective coaxial feed lines within passageways of a feed line organizer body. Further, the antenna feed structure is inserted into the opening, and each of the coaxial feed lines is connected to a respective antenna element.

Patch dipole array antenna including a feed line organizer body and related methods


A semiconductor device sealed with mold resin is disclosed. The device includes a semiconductor substrate having a main surface and an element formed on the main surface of the semiconductor substrate. A stress buffering film for protecting at least the element from stress of the mold resin is provided on the semiconductor substrate so as to cover at least the element. The entire semiconductor device is covered and sealed with mold resin. The stress buffering film is formed of organo-silicone ladder polymer having a hydroxyl group at its end. In the semiconductor device, water does not get into an interface of the stress buffering film and the underlying substrate, resulting in an enhancement of the moisture resistance of the semiconductor device.

1. Field of the Invention
The present invention generally relates to mold resin sealed semiconductor devices, and particularly to a semiconductor device sealed with mold resin which is improved not to cause volatility defective or malfunctions of elements.
2. Description of the Background Art
In a conventional resin sealed semiconductor device, with miniaturization of semiconductor elements, there has been a problem that volatility defective or malfunctions of elements are caused due to stresses by the sealing resin. In order to solve the problem, the art is proposed wherein a stress buffering film formed of a resin layer is formed covering surfaces of elements.
FIG. 3A is a plan view of a semiconductor device disclosed in Japanese Patent Laying-Open No. 55-111148 which is the first conventional art and FIG. 3B is a cross-sectional view along the IIIB line in FIG. 3A. Referring to the figures, a silicon dioxide film 3 is formed on a surface of a semiconductor substrate 1. Openings are provided for formation of a base electrode 16 and an emitter electrode 4 in the silicon dioxide film 3. Base electrode 16 and emitter electrode 4 are provided filling the openings. A metal film body 12 is formed surrounding base electrode 16. A bonding wire 8 is connected to emitter electrode 4. Covering emitter electrode 4, base electrode 16 and metal film body 12, a phenylsilicone ladder polymer film 56 which is an undercoat resin layer is provided on semiconductor substrate 1. The phenylsilicone ladder polymer film 56 is formed by applying an anisole solution of phenylsilicone ladder polymer on semiconductor substrate 1. The backside of semiconductor substrate 1 is affixed on a lead frame 11 for external electrode picking-up. The entirety of the semiconductor device is buried in a mold resin 9.
In the above-described conventional device, metal film body 12 is formed for the purpose of preventing that water permeating mold resin 9 degrades the adhesive property between phenylsilicone ladder polymer film 56 and silicon dioxide film 3. With no metal film body 12, since the adhesive property is weak between phenylsilicone ladder polymer film 56 and silicon dioxide film 3, water gets into the interface of these films, which further reaches base electrode 16. As a result, inverse breakdown voltage is produced between base-collector, so that the device cannot effect the function as a semiconductor circuit. Accordingly, formation of metal film body 12 is essential. On the other hand, however, there have been problems that it makes the structure complex and manufacturing process complicated.
Also, the semiconductor device has a problem that its reliability is decreased because, since silicone ladder polymer film 56 is formed on the surface of the semiconductor substrate after connecting bonding wire 8 to emitter electrode 4, there is no stress buffering film on the surface of semiconductor substrate 1 in the processes until that time.
FIGS. 4A-4F illustrate in cross-sectional views steps of manufacturing a semiconductor device provided with ladder type organo-silicone polymer disclosed in Japanese Patent Laying-Open No. 55-50645 which is the second conventional art.
Referring to FIG. 4A, a base region 13 and an emitter region 14 are formed in a surface of a semiconductor substrate 1 (silicon substrate).
Referring to FIG. 4B, a cyclohexanone solution of ladder type organo-silicone polymer (a polymer obtained by heating a mixture of phenyltriethoxysilane and .gamma.-phenylaminopropyltriethoxysilane) is applied with a spinner on the surface of semiconductor substrate 1, which is dried to form an organo-silicone polymer film 106.
Referring to FIG. 4C, a photoresist 7 having openings at portions located above electrode picking-up holes of a collector region 1a, base region 13 and emitter region 14 is formed on organo-silicone polymer film 106.
Referring to FIGS. 4C and 4D, using the photoresist 7 as a mask, organo-silicone polymer film 106 is etched using 1, 1, 1-trichloroethane. Next, removing photoresist 7, a thermal treatment is applied at 350.degree. C. for one hour to make a cross linked ladder type organo-silicone polymer film 106.
Referring to FIG. 4E, an aluminum evaporating film 15 is formed on semiconductor substrate 1 so as to fill openings of organo-silicone polymer film 106, and a photoresist 7 having predetermined shape is formed on aluminum evaporating film 15.
Referring to FIGS. 4E and 4F, using photoresist 7 as a mask, aluminum evaporating film 15 is etched, and removing photoresist 7 subsequently, an aluminum electrode 4 is formed.
According to the above-described second conventional art, since organo-silicone polymer film 106 which is a stress buffering film is formed on the surface of semiconductor substrate 1, the elements are protected in the process. However, in the second conventional art, there have been problems described below.
That is, referring to FIGS. 4C and 4D, 1, 1, 1-trichloroethane is employed for etching organo-silicone polymer film 106. 1, 1, 1-trichloroethane produces hydrogen chloride which is corrosive in a reaction with water, and is easily decomposed with fire to produce gas such as hydrogen chloride. Since 1, 1, 1-trichloroethane has such properties, there have been problems such that it must be handled with great care and selection of materials of an etching device and an etching container is limited. Furthermore, in the second conventional art, although it is made clear that the leak current between source/drain is stable even after leaving the device under circumstances of high temperature, it is not clear if the elements are protected from stresses of mold resin.

Semiconductor device sealed with mold resin