An explosives detonator system includes a detonator housing within which is provided a detonation circuit that includes a conductive pathway having a fuse head integrated therewith such that the conductive pathway passes along both electrodes and a resistive bridge of the fuse head. An uncharged chargeable voltage source is also integrated with the detonation circuit and is electrically sensitive to a charging property which is included in a charging signal. Exposure to the charging property charges the voltage source, thereby rendering it capable of generating a potential difference between the electrodes at least to equal the breakdown voltage of the resistive bridge. The charging property is any one or more of a charging light pulse, a charging temperature, a charging pressure and a charging radio frequency.

Detonation of explosive charges is generally effected by means of detonators which are provided in a detonating relationship with the explosive charges. Such explosive charges usually comprise so-called "main" or "secondary" explosives.
In the mining industry, in particular, as well as in a number of other industries which rely on the use of explosives, e.g. the demolition industry, accurate control of explosives detonation is of great importance, for reasons including safety and accuracy of blasting operation.
Generally speaking, one can distinguish between two types of detonators namely electronic detonators and pyrotechnic detonators.
Electronic detonators, generally, effect detonation of an explosive with which they are in a detonating relationship by generating a voltage spark or plasma in proximity to the explosive. Such voltage spark or plasma is generated by the breakdown of a resistive element or bridge which is provided between two conducting electrodes. The resistive bridge and the electrodes are generally referred to collectively as a "fuse head" which is accommodated within a detonator housing. The plasma generates a shock wave which is transmitted to the proximate explosive and initiates the explosive.
Such electronic detonators generally provide accurate control over detonation, particularly as regards timing and delay properties thereof. However, electronic detonators are expensive to manufacture and difficult to use, requiring a separate or external power source and complex electronic transmission wire connections to allow transmission of electricity to the detonator and permit remote triggering thereof. In the applicant's experience, such connections are, in the Applicant's experience, prone to failure and may even result in, or allow for, premature initiation of the detonator and thus of the explosive, due to false stimuli, e.g. being provided by radio-frequency (rf) interference on the mining/demolition site.
In contrast to electronic detonators operating by means of an electronic delay system, pyrotechnic detonators employ a series of explosive charges that are located within a detonator housing to provide a desired detonating signal to the main explosive charge at a required timing and delay. The series of explosive charges generally includes (i) an initiating and sealing charge, also known as a priming charge, (ii) a timing charge, (iii) a primary charge and, optionally, (iv) a base charge. The initiating charge serves to initiate the explosive sequence in response to a shock signal transmitted thereto and also functions as a sealing charge which provides a seal to prevent blow-back inside the detonator housing. The initiating charge also initiates the timing charge which provides a desired burning delay for detonation. The timing charge, in turn, initiates the primary charge which either directly provides a detonation initiating signal to the main explosive charge, or initiates the base charge that, in turn, will provide the desired detonation initiating signal to the main explosive charge.
As alluded to above, initiation of the initiating charge of a pyrotechnic detonator is generally effected by imparting a shock signal to the detonator, typically being provided by one or more shock tubes which are located in an initiating relationship with the detonator. The initiating charge then typically comprises a sensitive explosive, initiation of which can be effected by a shock wave of sufficient magnitude. Shock tube is well known and widely used in the initiation of detonators; it comprises a hollow plastic tube lined with a layer of initiating or core explosive, typically comprising a mixture of HMX and aluminium metal powder. Upon ignition of the initiating (core) explosive, a small explosion propagates along the tube in the form of an advancing temperature/pressure wave front, typically at a rate of approximately 7000 ft/s (about 2000 m/s). Upon reaching the detonator, the pressure/temperature wave triggers or ignites the initiating/sealing charge in the detonator, which results in the sequence of ignitions mentioned above and thus eventually causing detonation of the main explosive charge. Although shock tube is economically attractive, safe and easy to use, not being readily susceptible to false stimuli, existing pyrotechnic-based detonator systems do not at all permit the same extent of control of detonation timing and delay which is achieved by using electronic detonators, as the timing and delay features are provided by the detonator explosive charge loading, instead of by electric components.
It will therefore be appreciated that each of electronic and pyrotechnic detonator systems has particular disadvantages associated therewith, which disadvantages impact negatively on the operational reliability, safety and ease of use of such systems. More particularly, whilst electronic detonator systems are attractive from the perspective of the accuracy of control which they offer, the complex voltage transmission wire arrangements and connections which are required present a concern. As regards pyrotechnic detonator systems, whilst they offer the ability to employ shock tube and avoid the use of complex transmission wire, they present difficulties in achieving detonation delay control and accuracy.
The present invention therefore seeks, broadly, to provide an approach to operating explosive detonators which addresses and at least partly alleviates the disadvantages associated with both pyrotechnic and electronic initiation of explosive detonators.
More specifically, the present invention seeks to address the difficulties of complex electrical signal transmission wire connections which are associated with the operation of electronic detonator systems and also the difficulties of inaccurate delay timing and control associated with pyrotechnic detonator systems.


In one aspect, a data item is input into a scoring classifier such that the scoring classifier indicates that the data item belongs to a first class. A determination is made as to the amount of retraining of the scoring classifier, based on the data item, that is required to cause the scoring classifier to indicate that the data item belongs to a second class. A reliability measure is determined based on the required amount of retraining and a class of the data item is determined based, at least in part, on the reliability measure.

Classifiers based on machine learning techniques may be used to classify data items of unknown classification. One area in which such classifiers may be used is in filtering mass, unsolicited, commercial e-mailings (colloquially known as e-mail spam or spam e-mail). Spam e-mail is akin to junk mail sent through the postal service. However, because spam e-mail requires neither paper nor postage, the costs incurred by the sender of spam e-mail are quite low when compared to the costs incurred by conventional junk mail senders. Consequently, e-mail users now receive a significant amount of spam e-mail on a daily basis.
Spam e-mail impacts both e-mail users and e-mail providers. For e-mail users, spam e-mail can be disruptive, annoying, and time consuming. For e-mail and network service providers, spam e-mail represents tangible costs in terms of storage and bandwidth usage, which costs are not negligible due to the large number of spam e-mails being sent.

This patent is subject to a terminal disclaimer.


A vacuum cleaner for helping maintain the cleanliness of the exposed surfaces of an ink jet droplet ejector. The vacuum cleaner is comprised of a top cover plate, having a plurality of air passages, that is located over a channel surface by spacers. A vacuum means draws the pressure in the defined volume between the top cover plate, the channel surface, and the spacers below the external pressure, whereby air is drawn into the defined volume through the air passages. The resulting air flow removes ink, dust, and debris from the vicinity of the exposed surfaces, thereby helping to maintain the cleanliness of the droplet ejector. The top cover plate and spacers are beneficially formed using silicon microstructure fabrication techniques.

Various ink jet printing technologies have been or are being developed. One such technology, referred to hereinafter as acoustic ink printing (AIP), uses acoustic energy to produce an image on a recording medium. While more detailed descriptions of the AIP process can be found in U.S. Pat. Nos. 4,308,547, 4,697,195, and 5,028,937, essentially, bursts of acoustic energy focused near the free surface of a liquid ink cause ink droplets to be ejected onto a recording medium.
Because the dimensions of the droplet ejectors used in acoustic ink printing are small, their cleanliness is extremely important. Not only can dirt particles and dust (particularly paper dust) clog the ejector ports, but ejected ink droplets which do not adhere to the recording medium can build up enough to disrupt the printing process.
While cleanliness may be a problem with the other types of ink jet printers, such printers usually use a small, moving print head that is readily wiped clean, such as before or after the printing of each print line. However, in AIP it is contemplated that a fixed print head that spans the print line and contains thousands of individual droplet ejectors will be used. To print an image with such a print head, the recoding medium passes by the print head as droplets are ejected onto the recording medium. As can be appreciated, it is difficult to clean such a large, fixed print head by wiping, particularly with a low cost, nondestructive system that does not disrupt the printing cycle.
Therefore, a non-wiping technique for improving the cleanliness of the exposed surfaces of the droplet ejectors of a fixed print head would be beneficial.

Vacuum cleaner for acoustic ink printing


A control system for an internal combustion engine having at least one fuel injection valve for injecting fuel into a combustion chamber of the engine and burning the injected fuel by compression ignition. A fuel injection control parameter for controlling at least one fuel injection valve is changed. A combustion state of the engine is then detected. A cetane number of the fuel is then estimated based on the changed fuel injection control parameter and the detected combustion state.

1. Field of the Invention
The present invention relates to a control system for an internal combustion engine, which ignites fuel in a combustion chamber by compressing an air-fuel mixture, and particularly relates to a control system which estimates a cetane number of the fuel used by the internal combustion engine.
2. Description of the Related Art
Japanese Patent Laid-open No. 2004-340026 (JP '026) discloses a method of estimating a cetane number of the fuel used in the internal combustion engine which burns the fuel by compression ignition using a relatively inexpensive sensor. Specifically, the following methods are disclosed in JP '026: 1) a method which uses an exciting force sensor for detecting an exciting force of the engine; 2) a method which uses a torque sensor for detecting an output torque of the engine; 3) a method which uses a CO sensor for detecting a concentration of CO (carbon monoxide) in exhaust gases; and 4) a method for determining the cetane number based on an angular accelerating speed calculated from a change in the engine rotational speed.
Among the above-described methods disclosed in JP '026, methods 1) to 3) require special sensors which are not normally used in engine control. While method 4) determines the cetane number based on an output of the engine rotational speed sensor, it must detect the rotational speed using a very short sampling period (i.e., a period corresponding to about 2 or 3 degrees of the crank angle).

Control system for internal combustion engine


A method for fabricating capacitor in a semiconductor device includes forming an sacrificial layer and over a substrate, forming a mask pattern over the sacrificial layer, etching the sacrificial layer in two steps with differentiated top and bottom power levels using the mask pattern as an etch mask to form an opening, and forming a bottom electrode over the opening.

The present invention relates to a method for fabricating a semiconductor device, and more particularly, to a method for fabricating a capacitor in semiconductor device.
The width (i.e., critical dimension (CD)) of a capacitor gets narrow due to the high integration of a semiconductor device. In other words, the size of an opening for a bottom electrode of a semiconductor device decreases.
FIGS. 1A and 1B are transmission electron microscopy (TEM) images showing a conventional capacitor in a semiconductor device. A sacrificial layer between the openings becomes thin because of a bowing profile in approximate mid regions of the openings. Referring FIG. 1B, a bottom critical dimension CD of the openings gets narrower compared to the width (i.e., CD) of each of the openings.
As the size of the openings decreases, the openings increasingly have a bowing profile due to the interference of a plasma for etching. As a result, capacitors, which are subsequently formed, are likely to be bridged together. Also, a lack of an etching margin causes the bottom CDs of the openings to decrease, and this decrease leads to the reduction in capacitor Cs of capacitors. However, in the case of etching a target layer/structure less to prevent the bowing profile formed by the interference of the plasma, the bottom CDs of the openings may increasingly decrease. On the other hand, in the case of etching the target layer/structure more to secure the bottom CDs of the openings, the bowing profile may become severe. Therefore, a method to overcome these two limitations needs to be developed.

Method for fabricating capacitor in semiconductor device


A transflective liquid crystal display having at least one reflective region 122 and at least one transmissive region 121. The display comprises a first polarizer 5, a second polarizer 100 opposing the first polarizer 5, two twisted nematic liquid crystal layers 30, 60 between said first and second polarizers 5, 100 and a reflector 110 for reflecting light passing though the reflective region 122 of the display. The twisted nematic liquid crystal layers 30, 60 have opposite twist directions to each other. The second twisted nematic liquid crystal layer 60 improves the contrast of the display. The display may have a double cell arrangement, in which case there may be a single cell gap or a double cell gap. Alternatively, the display may have a single cell arrangement in which case the second twisted nematic liquid crystal layer is a temperature dependent retardation film 65.

Liquid crystal display types are divided into three kinds: a transmissive LCD which uses a backlight to provide illumination, a reflective LCD which reflects ambient light, and a transflective LCD which uses both a backlight and ambient light. A transmissive LCD is an ineffective light converter and only transmits about 3% to 8% of light from its backlight. Therefore transmissive LCDs require a backlight device having high brightness, leading to high power consumption. Reflective LCDs use ambient light for imaging, thus saving power consumption. However, although reflective LCDs can be used during the daytime, or in environments where external light exists, they cannot be used at night or under poor ambient lighting conditions.
Furthermore, the market demand for outdoor LCD applications is expanding. LCDs are needed for mobile navigator/video systems, PDAs, personal organizers, Tablet PCs, notebook computers, and Kiosk displays etc. Regular transmissive LCDs are of limited use for these applications because they are very difficult to read under strong ambient light. Therefore high brightness LCDs are sometimes used for outdoor applications. However, due to the high power backlight, high brightness LCDs suffer from high power consumption, excessive heat generation, increased dimensions, electrical circuit alterations, and shortened LCD lifetime.
In order to overcome the above drawbacks of transmissive and reflective LCDs, transflective LCDs have been developed to allow good legibility under any ambient light environment. In most transflective LCD displays each pixel is divided into reflective and transmissive sub-pixels. The transmissive sub-pixel does not have a reflector so it allows light from the backlight to pass through it and operates in transmission mode. Meanwhile, the reflective sub-pixel has a reflector for reflecting ambient light so that it can operate in reflective mode. Transflective LCDs operate well under all light conditions.
U.S. Pat. No. 7,015,997 teaches a method of producing a transflective liquid crystal display with a single cell gap, by partial switching of the pixels of approximately 45 degrees in the reflective pixel region of the single cell gap. This is achieved by applying fringing fields, generated by a discontinuous electrode, to the molecules in the reflective pixel region of the cell gap.
U.S. Pat. No. 6,989,878 discloses a transflective twisted nematic liquid crystal display with cell gap spacing in the transmission portion of the transflective LCD being approximately triple the cell gap spacing in the reflection portion of the transflective LCD.
U.S. Pat. No. 6,801,281 discloses a single cell gap transflective liquid crystal display with a slant reflector built on the path of the backlight. Light from the backlight thus traverses the reflective pixel portion twice and thereby follows a path similar to that of the ambient light.
US Patent Application 20060098114 disclose an array substrate for a transflective liquid crystal display device with a discontinuous transmissive electrode having a plurality of transmissive electrode portions and a reflector comprising a plurality of discontinuous reflector portions, the transmissive electrode portions and reflector portions are alternately disposed in order to optimise the light efficiency in both reflection and transmission modes.
US Patent Application 20050248697 discloses an LCD assembly comprising a backlight an liquid crystal panel and an optical element. The liquid crystal panel comprises a liquid crystal layer between two polarizers. The optical element comprises a liquid crystal layer between two glass substrates, but no polarizers. The optical element may be switched between a reflective mode in which it reflects light and a transmissive mode in which it transmits light. In this way the assembly may be switched between reflective and transmissive modes, but the pixels are not split into reflective and transmissive sub-pixels. Rather in the reflective mode each pixel acts in an entirely reflective manner and in the transmissive mode each pixel acts in an entirely transmissive manner. In this way it is hoped to maximize the brightness of the display.
US Patent Application 20050151902 disclose a transflective liquid crystal display with a single LC cell gap. A liquid crystal cell wall structure between the upper and lower substrates creates a first channel at reflective region and a second channel at transmissive region. The first and second channels may be filled with different liquid crystal materials. The first an second channels do not overly each other, so in general light passing through the display either passes through the first liquid crystal material (in the reflective region) or the second liquid crystal material (in the transmissive region) but not both.

The Hong Kong University of Science and Technology


A battery replacement system for an industrial truck has an electrical propulsion drive and at least one battery compartment for holding a battery block. The battery block can be moved essentially in a horizontal direction into the battery compartment or out of the battery compartment. An external holding apparatus independent of the industrial truck is provided for the battery block. The industrial truck can be maneuvered over the holding apparatus such that the holding apparatus is positioned beneath the battery compartment. The battery block located within the battery compartment can be lifted slightly by the holding apparatus. The force required to lift the battery block can be produced by the electrical propulsion drive.

1. Field of the Invention
The invention relates to a battery replacement system for an industrial truck having the following general features:                the industrial truck has an electrical propulsion drive,        the industrial truck has at least one battery compartment for holding a battery block,        the battery block can be moved essentially in the horizontal direction into the battery compartment or out of the battery compartment, and        an external holding apparatus, which is independent of the industrial truck, is provided for the battery block.
2. Technical Considerations
Electrically powered industrial trucks are equipped with battery blocks which contain rechargeable batteries and can be charged either in the industrial truck or outside the industrial truck. If the charging process is carried out outside the industrial truck, the discharged battery block is removed from the industrial truck and can be replaced immediately by a freshly charged battery block. This allows the industrial truck to be used virtually around the clock. During the replacement process and during charging, the battery block is generally located on a holding apparatus which is matched to the battery block.
The battery block for an industrial truck can be replaced by means of a crane if the battery compartment is open at the top and the frame of the industrial truck and the fittings on it are designed appropriately. It is also known for the battery compartment to be provided with a side or front opening, through which the battery block can be pushed essentially in the horizontal direction out of the industrial truck. This horizontal removal of the battery block may, for example, be carried out by means of a lifting trolley equipped with an appropriate holding apparatus. It is also known for a roller path to be positioned alongside the opening in the battery compartment, onto which the battery block can then be pushed by hand or by means of an auxiliary apparatus.
Particularly in the case of relatively large industrial trucks having a correspondingly heavy battery block, manual movement of the battery block has been found to be difficult and dangerous. If auxiliary mechanical apparatuses are used to move the battery block, they must be able to apply a sufficiently high drive force and need to be designed in a correspondingly complex manner. This is true, in particular, when the battery block is anchored within the battery compartment such that the battery block must be lifted slightly in order to be able to subsequently move it horizontally.
The present invention is thus based on the object of providing a battery replacement system of the type mentioned initially but having a holding apparatus of simple design.

Battery replacement system for an industrial truck


A nozzle dam automatically latches on an annular ledge surrounding the nozzle opening. A pivotal latch arm on the dam, biased to the locked position is forced toward the unlocked position by a cam on the ledge as the nozzle is pressed on the ledge, and snaps into engagement with the ledge when the dam is fully seated over the opening. A bias arm may be operated by a wrench to pivot the latch arm toward the unlocked position until a detent locks the latch arm in the unlocked position.

1. Field of the Invention
This invention pertains in general to a closure with inflatable seals for sealing a nozzle opening into a nuclear steam generating vessel, and more particularly, to a self latching nozzle dam which can be installed quickly without having to align screws or pins between the nozzle dam and nozzle wall or nozzle hold down ring.
2. Description of the Prior Art
Many nozzle dam designs are described in the prior art which have as their objective, quick installation features in order to minimize exposure time to nuclear radiation, which exists in the immediate work environment within the vessel.
For example, U.S. Pat. No. 4,667,701, patented by Evans et al. May 26, 1987, describes a nozzle dam sealing system having a permanent flange ring that is concentric with the circular opening of the nozzle, welded to the inside surface of the steam generator around the opening. Typical of installations presently in use, the ring has threaded holes for fastening a dam in place over the nozzle.
An insert, designed to receive a bayonet fastener, is screwed into each threaded hole.
A collapsible, adjustable, support frame similar to a pantograph, has bayonet pin means hingedly attached to one end of the frame, and bayonet pin means attached to the other end without hinges. The support frame is attached by the hinged bayonet pin means to the ring, and oriented vertically, normal to the nozzle ring.
The dam plate of the system, which retains the inflatable seal, is provided in three sections for assembly on the hingedly mounted support frame. The dam plate is in three sections because it must be passed into the vessel by way of a manway which is smaller than an assembled dam.
After assembly of the dam on the frame, the frame with dam is rotated down on the hinged bayonet means attachment until the pins at the other end of the pantograph frame can be installed in the inserts on the opposite side of the opening.
In order to avoid a source of delay during installation of the nozzle dam, assembly of the dam and frame must be accurate, so that the bayonet means align each with a respective insert when the dam is rotated down onto the ring to find the proper seating.
U.S. Pat. No. 5,007,460, patented Apr. 16, 1991 by Zezza et al., improves on U.S. Pat. No. 4,667,701. The nozzle dam is installed into the nozzle opening before the pantograph beams. This reduces the time required to install the nozzle dam system. Six bayonet pins attached to the ends of the beams provide the attachment to the inserts installed in the flange ring.
In order to be able to install the nozzle dam efficiently within the vessel, measurements of the nozzle must be applied to adjusting the pantograph and dam assembly in advance of the actual installation.
U.S. Pat. No. 4,826,036, patented May 2, 1989 by Lewis et al., describes a system which uses toggle type action clamps located at about six points about the circumference of the dam, each to drive a pin radially from the dam into a pocket in the nozzle to secure the nozzle dam in the nozzle. The movement of the pin towards the pocket is also used to generate hydraulic pressure for the expandable seal by way of a plunger that is press-fit on the pin. The plunger, carried by the advancing pin, presses against a bladder containing the hydraulic fluid.
Orientation of each pin with a corresponding pocket is necessary for successful closure.
U.S. Pat. No. 4,637,588, patented Jan. 20, 1987 by Wilhelm et al. describes a system which avoids need to align a screw or pin on the dam with corresponding receiving means in the nozzle.
This two-stage system has a foldable sealing nozzle dam plate with an anchor assembly below the plate attached to it by a vertical, threaded shaft assembly that passes up through the plate.
The anchor assembly includes a plurality of arms in a tripod arrangement which may be opened from a folded position, to extend radially from the vertical shaft into frictional engagement with the inner surface of the nozzle. The tripod arrangement is designed to increase radial pressure of the arms against the nozzle surface by movement of a linkage arm coupling of the tripod arrangement up the threaded shaft as the shaft is rotated.

Quick installation non-bolted nozzle dam system


The invention enables a gain adjustment in a receiver to improve signal quality by varying resistance of an input resistor array of a bandpass filter, the array having a plurality of resistors in series with switches that out of the path of the current when the resistors are in use.

1. Technical Field
This invention relates generally to wireless communication systems, and more particularly, but not exclusively, to a bandpass filter with integrated variable gain function.
2. Description of the Related Art
Communication systems are known to support wireless and wire lined communications between wireless and/or wire lined communication devices. Such communication systems range from national and/or international cellular telephone systems to the Internet to point-to-point in-home wireless networks. Each type of communication system is constructed, and hence operates, in accordance with one or more communication standards. For instance, wireless communication systems may operate in accordance with one or more standards including, but not limited to, IEEE 802.11, Bluetooth, advanced mobile phone services (AMPS), digital AMPS, global system for mobile communications (GSM), code division multiple access (CDMA), and/or variations thereof.
Depending on the type of wireless communication system, a wireless communication device, such as a cellular telephone, two-way radio, personal digital assistant (PDA), personal computer (PC), laptop computer, home entertainment equipment, et cetera communicates directly or indirectly with other wireless communication devices. For direct communications (also known as point-to-point communications), the participating wireless communication devices tune their receivers and transmitters to the same channel or channel pair (e.g., one of the plurality of radio frequency (RF) carriers of the wireless communication system) and communicate over that channel or channel pair. For indirect wireless communications, each wireless communication device communicates directly with an associated base station (e.g., for cellular services) and/or an associated access point (e.g., for an in-home or in-building wireless network) via an assigned channel. To complete a communication connection between the wireless communication devices, the associated base stations and/or associated access points communicate with each other directly, via a system controller, via the public switch telephone network, via the internet, and/or via some other wide area network.
For each wireless communication device to participate in wireless communications, it includes a built-in radio transceiver (i.e., receiver and transmitter) or is coupled to an associated radio transceiver (e.g., a station for in-home and/or in-building wireless communication networks, RF modem, etc.). As is known, the receiver receives RF signals, removes the RF carrier frequency from the RF signals directly or via one or more intermediate frequency stages, and demodulates the signals in accordance with a particular wireless communication standard to recapture the transmitted data. The transmitter converts data into RF signals by modulating the data to RF carrier in accordance with the particular wireless communication standard and directly or in one or more intermediate frequency stages to produce the RF signals.
Bandpass filters (BPFs) in receivers can incorporate gain setting functions. However, the conventional technique of gain settings may not be accurate due to resistance of switches in an input resistor array.
Accordingly, a new method of gain control is implemented such that the BPF can have gain that is less dependent on the switch on resistance.

Bandpass filter with integrated variable gain function using improved resistor array


A combustion burner including a fuel nozzle, a burner tube that surrounds the fuel nozzle to form an air passage between the burner tube and the fuel nozzle, swirler vanes that are arranged a circumferential direction on an external circumferential surface of the fuel nozzle, each of which extends along an axial direction of the fuel nozzle, and gradually curves from upstream to downstream so as to swirl air flowing in the air passage from the upstream to the downstream, a liquid fuel injecting hole that is formed on the fuel nozzle, and from which a liquid fuel is injected to a vane surface of each of the swirler vanes, and a cooling unit that cools a part of the vane surface on which the liquid fuel hits. The cooling unit includes a water cooling circuit formed inside the swirler vane.

A gas turbine, such as one used for generating power, includes, as its main components, a compressor, a combustor, and a turbine. Many gas turbines have a plurality of combustors, and the combustors included in the gas turbine are arranged in a circle in a combustor casing. Air compressed by the compressor is mixed with fuel supplied into the combustors, and is combusted. Such combustion takes place in each of the combustors to generate high temperature combustion gas. The combustion gas, produced by the combustion, is supplied to the turbine to drive the turbine in rotation.
FIG. 8 indicates an exemplary structure of a combustion burner included in a combustor of a conventional gas turbine. As shown in FIG. 8, this combustion burner 100A is arranged in plurality (in FIG. 8, only one is depicted), surrounding a pilot combustion burner 200. A pilot combustion nozzle, not shown, is installed in the pilot combustion burner 200. The combustion burner 100A and the pilot combustion burner 200 are arranged in a combustion liner of the gas turbine. The combustion burner 100A includes, as main component thereof, a fuel nozzle 110, a burner tube 120, and swirler vanes (swirler vane) 130 (Patent Documents 1 and 2).
The burner tube 120 is arranged along the same axis as the fuel nozzle 110, surrounding the fuel nozzle 110, to provide a ring-like air passage 111 between the external circumferential surface of the fuel nozzle 110 and the inner circumferential surface of the burner tube 120. Compressed air A flows through the air passage 111 from upstream (from the left-hand side in FIG. 8) to downstream of the air passage 111 (toward the right-hand side in FIG. 8). The swirler vanes 130 are arranged in a plurality of positions along the circumferential direction of the fuel nozzle 110, each extending in the axial direction of the fuel nozzle 110. A clearance (gap) 121 is kept between the tip (tip) of the external circumference of each of the swirler vanes 130 and the inner circumferential surface of the burner tube 120, generating a leaking air flow that flows around a vane pressure surface of each of the swirler vanes 130 to a vane suction surface thereof. This leaking flow interferes with the compressed air A to generate a vortical air flow. By way of such a vortical air flow, the compressed air A is effectively mixed with vaporized and atomized fuel F injected from a point near the tip of the fuel nozzle 110 to the vane surface. In this manner, even distribution of the fuel is promoted. The reference numeral 131 in FIG. 8 indicates a clearance setting rib.
The gas turbine uses not only a gas fuel but also a liquid fuel as a fuel. Conventionally, when a liquid fuel is used, the liquid fuel is injected through a liquid fuel injecting hole toward the flow of the compressed air. In this manner, the injected liquid fuel is sheared by the compressed air flow, and becomes atomized and mixed with air. The liquid fuel that is atomized and mixed with air is then combusted.
Examples of liquid fuels include, the bunker A, light oil, and dimethyl ether that are so-called oil fuel.
When a liquid fuel is used in the conventional combustion burner 100A, the liquid fuel is supplied from the point near the tip of the fuel nozzle 110, and each of the swirler vanes 130 gives a swirling force to the compressed air A that is flowing through the air passage 111 to obtain a swirling air flow a. The kinetic momentum of the swirler air is used to atomize the liquid fuel, and to reduce NOx and suppress soot.
However, the conventional combustion burner 100A, such as the one shown in FIG. 8, has been limited in its capability to atomize the liquid fuel. Furthermore, it has been extremely difficult to make the fuel density uniform in the fuel nozzle 110.
To prevent these problems, a combustion burner has been suggested to promote atomization and to make the fuel density uniform. FIG. 9 is a schematic of an exemplary structure of another conventional combustion burner. FIG. 10 is a perspective view of the fuel nozzle included in the conventional combustion burner. As shown in FIGS. 9 and 10, this conventional combustion burner 100B supplies a liquid fuel LF through liquid fuel injecting holes 133A arranged on the surface of the fuel nozzle 110. The liquid fuel LF, injected through the liquid fuel injecting holes 133A, is injected toward the vane pressure surface 132a of the swirler vane 130. On the vane pressure surface 132a, the liquid fuel LF spreads out into a thin film. The liquid fuel LF that is spread into a thin film is sheared by a high-speed air flow, to become atomized and vaporized. In this manner, atomization is promoted, and uniform fuel density is achieved (Patent Document 3).
[Patent Document 1] Japanese Patent Application Laid-open No. H11-14055
[Patent Document 2] Japanese Patent Application Laid-open No. 2004-12039
[Patent Document 3] Japanese Patent Application Laid-open No. 2006-336997

Cooling unit for cooling swirler vane of combustion burner


A method of fabricating electroplate solder on an organic circuit board for forming flip chip joints and board to board solder joints is disclosed. In the method, there is initially provided an organic circuit board including a surface bearing electrical circuitry that includes at least one contact pad. A solder mask layer that is placed on the board surface and patterned to expose the pad. Subsequently, a metal seed layer is deposited by physical vapor deposition, chemical vapor deposition, electroless plating with the use of catalytic copper, or electroplating with the use of catalytic copper, over the board surface. A resist layer with at least an opening located at the pad is formed over the metal seed layer. A solder material is then formed in the opening by eletroplating. Finally, the resist and the metal seed layer beneath the resist are removed.

1. Field of Invention
This invention generally relates to the electronic packages, particularly to flip chip packages, more particularly to flip chip joints and board to board solder joints formed by electroplated solder on the organic circuit boards.
2. Description of the Related Art
Since the introduction of the flip chip technology by IBM in the early 1960s, the flip chip devices have been mounted on an expensive ceramic substrate where the thermal expansion mismatch between the silicon chip and the ceramic substrate is less critical. In comparison with wire bonding technology, the flip chip technology is better able to offer higher packaging density (lower device profile) and higher electrical performance (shorter possible leads and lower inductance). On this basis, the flip chip technology has been industrially practiced for the past 40 years using high-temperature solder (controlled-collapse chip connection, C4) on ceramic substrates. However, in recent years, driven by the demand of high-density, high-speed and low-cost semiconductor devices for the trend of miniaturization of modern electronic products, the flip chip devices mounted on a low-cost organic circuit board (e.g. printed circuit board or substrate) with an epoxy underfill to mitigate the thermal stress induced by the thermal expansion mismatch between the silicon chip and organic board structure have experienced an obviously explosive growth. This notable advent of low-temperature flip chip joints and organic-based circuit board has enabled the current industry to obtain inexpensive solutions for fabrication of flip chip devices.
In the current low-cost flip chip technology, the top surface of the semiconductor integrated circuit (IC) chip has an array of electrical contact pads. The organic circuit board has also a corresponding grid of contacts. The low-temperature solder bumps or other conductive adhesive material are placed and properly aligned in between the chip and circuit board. The chip is flipped upside down and mounted on the circuit board, in which the solder bumps or conductive adhesive material provide electrical input/output (I/O) and mechanical interconnects between the chip and circuit board. For solder bump joints, an organic underfill encapsulant may be further dispensed into the gap between the chip and circuit board to constrain the thermal mismatch and lower the stress on the solder joints.
In general, for achieving a flip chip assembly by solder joints, the metal bumps, such as solder bumps, gold bumps or copper bumps, are commonly pre-formed on the pad electrode surface of the chip, in which the bumps can be any shape, such as stud bumps, ball bumps, columnar bumps, or others. The corresponding solder bumps (or say presolder bumps), typically using a low-temperature solder, are also formed on the contact pads of the circuit board. At a reflow temperature, the chip is bonded to the circuit board by means of the solder joints. After dispensing of an underfill encapsulant, the flip chip device is thus constructed. The typical examples of the flip chip devices using solder joints are shown in FIGS. 1 and 2. FIG. 1 is an example of the typical flip chip devices with the use of metal bumps and presolder bumps. The metal bumps 101 are formed on the electrode pads 102 of the chip 103. The presolder bumps 104 made of low-temperature solder are formed on the contact pads 105 of the organic circuit board 106. The solder joints 107 are formed at a reflow temperature sufficient to melt and reflow the presolder bumps 104. After dispensing of an underfill encapsulant 107 into the gap between the chip 103 and circuit board 106, the flip chip device 100 is thus accomplished. FIG. 2 shows another example of the typical flip chip devices without using presolder bumps. The solder bumps 201 are formed on the electrode pads 202 of the chip 203. The chip 203 is bonded to the circuit board 204 at a reflow temperature, in which the solder joints 205 are formed at the contact pads 206. After dispensing of an underfill encapsulant 207 into the gap between the chip 203 and circuit board 204, the flip chip device 200 is thus accomplished.
Currently, the most common method for formation of presolder bumps on the circuit board is the stencil printing method. Some prior proposals in relation to the stencil printing method can be referred to U.S. Pat. No. 5,203,075 (C. G. Angulas et al.), U.S. Pat. No. 5,492,266 (K. G. Hoebener et al.) and U.S. Pat. No. 5,828,128 (Y. Higashiguchi et al.). Solder bumping technique for flip chip assemblies requires design considerations regarding both bump pitch and size miniaturization. According to practical experiences, the stencil printing will become infeasible once the bump pitch is decreased below ˜0.15 millimeter. In contrast, the solder bumps deposited by electroplating offers the ability to further reduce bump pitch down to below 0.15 millimeter. The prior proposals in relation to electroplate bumps on the circuit board for flip chip bonding can be found in U.S. Pat. No. 5,391,514 (T. P. Gall et al.) and U.S. Pat. No. 5,480,835 (K. G. Hoebener et al.). Although eletroplate solder bumping on the circuit board offers finer bump pitch over stencil printing, it presents several challenges for initial implementation. For example, the solder mask layer should not be damaged during the fabrication process of solder bumps. Also, the plating and bump height uniformity should also be established. These issues were not detailed in either U.S. Pat. Nos. 5,391,514 or 5,480,835.
Accordingly, it is desirable to provide an electroplating process for fabricating solder bumps on an organic circuit board, which does not damage solder mask layers and offers good plating and bump height uniformity.

Formation of electroplate solder on an organic circuit board for flip chip joints and board to board solder joints


An etching solution for a metal hard mask. The etching solution comprises a mixture of a dilute HF (hydrofluoric acid) and a silicon containing precursor. The etching solution also comprises a surfactant agent, a carboxylic acid, and a copper corrosion inhibitor. The etching solution is selectively toward etching the metal hard mask material (e.g., Titanium) while suppressing Tungsten, Copper, oxide dielectric material, and carbon doped oxide.

1. Field
Embodiments of the present invention relate to etching of an integrated circuit structure. More particularly, embodiments of the present invention pertain to selective etching a metal hard mask layer used in fabricating an integrated circuit.
2. State of the Art
The fabrication of microelectronic devices involves forming electronic components on microelectronic substrates, such as silicon wafers. These electronic components may include transistors, resistors, capacitors, and the like, with intermediate and overlying metallization patterns at varying levels, separated by dielectric materials, which interconnect the electrical components to form integrated circuits. The metallization patterns are generally referred to as "interconnects."
One process used to form interconnects is known as a "damascene process". In a typical damascene process, a photoresist material is patterned on a dielectric material and the dielectric material is etched through the photoresist material patterning to form a hole or a trench (hereinafter collectively referred to as "an opening" or "openings"). The photoresist material is then removed (typically by an oxygen plasma or selective wet etching) and the opening is then filled with a conductive material (e.g., such as a metal or metal alloys). The filling of the opening may be accomplished by either physical vapor deposition, chemical vapor deposition, or electroplating, as will be understood to those skilled in the art. When the opening is a hole, the resulting filled structure is referred to herein as a "via". When the opening is a trench, the resulting filled structure is referred to herein as a "trace". The term "interconnect" is defined herein to include all interconnection components including traces and vias.
As devices approach smaller dimensions, critical dimensions for vias and trenches become harder to achieve. Metals such as Tantalum (Ta) and Titanium (Ti) and metallic compounds such as Tantalum Nitride (TaN) and Titanium Nitride (TiN) have been used to help integrated circuit (IC) manufacturers achieve the critical dimensions for forming small vias and trenches. Metals and metallic compounds have also been used as antireflective coating and/or barrier layers in many processes to form the trenches and vias. Thus, as IC manufacturing technology enters into 0.10 um and beyond technology nodes, it is desired that metals and metallic compounds are being used as hard mark layer.
There are several known methods used to etch a metal hard mask. One method uses a high density plasma reactor in conjunction with a chlorine containing plasma. This method requires using two reactors for an IC structure having a metal hard mask layer and a dielectric layer. For the metal hard mask layer, a high density plasma reactor is used and for the dielectric layer, a medium density plasma reactor is used. The method is thus costly and complicated.
Currently, no efficient and safe composition is available for selective wet etching a metal hard mask layer. If a wet etching composition is used, it suspected to be carcinogenic, toxic, and hard to handle. More importantly, the current wet etching process typically takes a long time (e.g., about 70 minutes or more) to remove a metal hard mask layer and even so, it is not as selective to the metal as desired.
Therefore, it would be advantageous to develop a composition that can safely and efficiently etch a metal hard mask layer.

Composition for etching a metal hard mask material in semiconductor processing


A wound therapy method that results in improved wound healing for conditions including diabetic foot ulcers, pressure ulcers, and arterial and venous ulcers is described. The wound therapy method uses local anesthetic injections in an area surrounding the wound combined with electrical stimulation causing local and deep muscle contraction in the same area. The method leads to increased vasodilation, increased tissue oxygen levels at the target site, and increased blood flow to the target site. This causes local angiogenesis and tissue perfusion that increases wound healing rates and decreases future wound occurrences.

This application claims the benefit of U.S. Provisional Patent Application Ser. No. 61/754,226, entitled USE OF LOCAL ANESTHESIA AND ELECTRICAL STIMULATION IN PERIPHERAL WOUND TREATMENT, filed on Jan. 18, 2013, the entire content of which is hereby incorporated by reference.
The present disclosure pertains to methods for treating wounds, improving wound healing, treating peripheral neuropathic pain, and regeneration of sensation caused by peripheral nerve damage, by administering a combination of local and deep nerve analgesia and electrical stimulation.
Slow healing wounds and chronic foot ulcers are a common problem in the United States and can dramatically affect the quality of life of patients who present with this. Patients with Diabetes and peripheral arterial disease are at risk for developing serious health problems that affect the eyes, kidney, skin, feet and heart. Foot ulcerations are one of the most common complications in patients with these conditions. The development of foot ulcers typically develop from diabetic neuropathy and large vessel disease such as patients who suffer from peripheral arterial disease. Most commonly diabetic foot ulcers ("DFUs") are caused by peripheral neuropathy complicated by deformity, callus, and trauma. Vascular insufficiency, infection, and failure to implement effective treatment of DFUs are linked to secondary medical complications, such as osteomyelitis and amputation. Approximately 15% of DFUs result in lower-extremity amputation. More than 85% of lower-extremity amputations in patients with diabetes occur in people who have had an antecedent foot ulcer.
The 5-year mortality rate for patients with neuropathic and ischemic DFUs is 45% and 55%, respectively. General healing rates for neuropathic DFUs have been reported in the literature. The meta-analysis of 10 control groups from clinical trials, using good standard wound care (including debridement and off-loading, and either saline moistened gauze or placebo gel and gauze) demonstrated that the weighted mean rates of neuropathic ulcer healing were 24.2% (95% confidence interval [CI] 19.5-28.8%) over 12-weeks and 30.9% (95% CI 26.6-35.1%) over 20 weeks. These data provide clinicians with a realistic benchmark for the rate of healing of neuropathic ulcers over 20 weeks.

Use of local anesthesia and electrical stimulation in peripheral wound treatment


A dental flosser is moveable between a stored, non-use position where the flosser is substantially planar, and an engaged or in-use position where a portion of the flosser is angled relative to the handle to aid in reaching back teeth. The dental flosser preferably includes a holder (which may be a U-shaped holder) that is movable between the non-use and in-use position; a handle; a living hinge between the holder and the handle, and a locking arm designed to secure the holder in the in-use position.

Various dental flossers which hold dental floss are well known in the art. For example, Japanese Patent JP1227752 and World Patent WO 0232341 disclose two such dental floss holders. JP 1227752 discloses a holder including a U-shaped holder having a pair of arms that hold a strand of dental floss in tension there between. The holder further includes a handle, with its distal end extending from the bottom of the U-shaped holder. The handle and U-shaped holder are planar, i.e. flat, so the dental floss holder is portable and easy packed. However, because it is flat, this design can be difficult to use when flossing hard to reach areas, such as when cleaning the back teeth. World Patent WO 0232341 discloses a dental floss holder including a U-shaped holder that also holds a strand of dental floss in tension between the arms, and a planar handle. Disposed between the U-shaped holder and the planar handle is a bowed portion which provides a space for the corners of the user's mouth when the teeth at the back of the mouth are cleaned. Because the dental flosser includes a bow, it is not a planar holder, and its three dimensional design allows it to reach more easily between the back teeth than a flat holder. However, its three dimensional, non planar structure makes it more difficult to stack or display in the package during storage or transit. Other types of dental floss holders are also well known in the art.
There is therefore a continued need in the art for a disposable dental flosser which effectively flosses between teeth, including back teeth or other hard to reach areas in the mouth, and which is portable and can be readily stored, displayed and packed.


Provided is a mixed-math slot machine game having a reels-first base game and a mystery bonus feature with prize-first game logic. After any winning play of the base game, the reels have the possibility of re-spinning a number of times, with the preferred version varying the re-spins from one to four times, for example. If this happens, the game screen informs the player that he or she has been awarded the bonus. While this bonus is triggered by the first base game spin of the reels, the possible prizes it awards are statistically weighted based on the amount of the initial base game prize from the winning reel stop. Various ways of implementing the change of gaming logic are provided.

Various slot machine games since the 1970's have used simulated reels to conduct a slot machine game in which the reels are spun and stopped, and the results evaluated according to a paytable. Spinning mechanical reels being subject to error and non-random deviation, machines were developed in which each reel is controlled by a random number generator, the generator determining the stop position of the reel. A game controlled by random numbers in such a manner is called "reels-first" or "reels-first math," referring to the mathematics of executing the game rules being based on the reels. Another method developed years later is known as "prize-first." This method allows the use of lottery tickets, game outcome pools, central outcome servers, and other modern techniques to ensure that the payout of a game is randomly distributed and has the desired distribution of prizes. The term prize-first refers to the fact that the prize is known when the outcome is randomly generated or selected, and then the reels are controlled to spin and stop to provide a pattern that evaluates on the game's paytable to produce the desired prize. However, for various reasons, many gaming regulatory jurisdictions require the reels-first design to be used. Such a requirement complicates the use of bonus rounds and makes game design more difficult when complicated bonus features are desired.

Slot machine game with mystery bonus feature using mixed math


Turbine bucket nominal internal core profiles and core insert external profiles are provided. In one embodiment, a turbine bucket includes an airfoil, platform, shank and dovetail. The bucket has a nominal internal core profile substantially in accordance with Cartesian coordinate values of X, Y and Z set forth in Table 1 wherein the Z values are non-dimensional values from 0 to 1 convertible to Z distances in inches by multiplying the Z values by a height of the bucket in inches, and wherein X and Y are non-dimensional values which, when connected by smooth continuing arcs, define internal core profile sections at each distance Z along the bucket, the profile sections at the Z distances being joined smoothly with one another to form said bucket internal core profile.

Gas turbine systems are one example of turbomachines widely utilized in fields such as power generation. A conventional gas turbine system includes a compressor section, a combustor section, and a turbine section. During operation of the gas turbine system, various components in the system are subjected to high temperature flows, which can cause the components to fail. Since higher temperature flows generally result in increased performance, efficiency, and power output of the gas turbine system, the components that are subjected to high temperature flows should be cooled to allow the gas turbine system to operate at increased temperatures.
Many system requirements should be met for each stage of the turbine section, or hot gas path section, of a gas turbine system in order to meet design goals including overall improved efficiency and airfoil loading. Particularly, the buckets of the first stage of the turbine section should meet the operating requirements for that particular stage and also meet requirements for bucket cooling area and wall thickness. Internal cooling requirements should be optimized, necessitating a unique internal core profile to meet stage performance requirements enabling the turbine to operate in a safe, efficient and smooth manner.
Accordingly, improved buckets are desired in the art. In particular, improved internal core profiles for buckets would be advantageous.


A calibration method of an image scanning system is provided. Initially, differences between adjacent sensing values of a calibration plate are respectively determined and then stored in a memory. Alternately, a difference between a base value and each of the sensing values of the calibration plate is determined and then stored in the memory. When a normal scan action is executed, simultaneously reading each difference from the memory and adding to one corresponding sensing value of image information of an object obtained by the normal scan action. As a result, the memory volume for storing calibration data is reduced and the reading of calibration data is also facilitated.

1. Field of the Invention
The present invention relates to a calibration method of an image scanning system, and more particularly to a calibration method utilizing differences between calibration data.
2. Description of the Prior Art
An image system, like a scanner, typically possesses problems such as image defects or distortion of intensity owing to (a) the photo-response non-uniformity of the light source, the mirror, the lens and the charged-coupled device (CCD), (b) the aging of the system and, (c) the effects resulting from a dusty environment. Therefore, image information of an object captured by the image system is required to compensate or calibrate.
Referring to FIG. 1, which is a schematic cross-sectional view of a prior flat bed scanner 101. A white calibration plate 102 is provided outside a document sheet read area. A document sheet 104 is mounted on a document sheet table glass 103 and secured by a cover 112. The white calibration plate 102 is read prior to the reading of the document sheet 104 and the read signal is stored in a memory. When the document sheet 104 is scanned, a linear light source 105 illuminates on the document sheet 104. The reflected light from the document sheet 104 is directed to mirrors 106, 107 and 108 and directed to a charge-coupled device (CCD) 110 through a lens 109. An output of the CCD 110 as a document sheet read electrical signal is sent to an A/D converter (not shown) established within a signal processing unit (not shown) to convert the electrical signal into a digital signal. For a color image-scanning device, the charge-coupled device 110 includes three linear sensors, respectively R linear sensor, G linear sensor and B linear sensor. Each of the three linear sensors includes a plurality of photo-sensing elements, and each of the photo-sensing elements provides a sensing value for one pixel.
FIG. 2 is a flow chart of a general scanning process. Initially, at step 201, scanning a calibration plate to capture calibration data and the calibration data read from the calibration plate is stored in a calibration memory. Continuously, at step 202, a central processing unit (CPU) of a host computer reads the calibration data of each scan line of the calibration plate from the calibration memory, and proceeding computation to generate calibration data corresponding to each photo-sensing element of the linear sensor. At step 203, the calibration data are restored in the calibration memory. At step 204, a normal scan action is performed. A document sheet is scanned for capturing the image information thereof and simultaneously reading the calibration data corresponding to each photo-sensing element to calibrate the image information.
In the above calibration method, the calibration data read from the calibration plate is directly stored in the calibration memory. As an example, for a color image reading device including R, G, B three linear sensors, each of R, G, B linear sensors comprises 10000 photo-sensing elements, and the output of each photo-sensing element is converted to 8-bit digital signal and then stored in the calibration memory. In this case, a volume of the calibration memory for storing calibration data is 8*3*10000=240000 bits. This prior calibration method spends a lot of storage volume of the calibration memory and much time to read calibration data. Both of which adversely affect effectiveness of image capture and manufacturing cost for a high-speed scanning system and a high-pixel scanning device.
Accordingly, it is an intention to provide an improved calibration method to overcome the above drawbacks.


An improved coupling assembly is provided for transmitting rotary power from the working end of an internal combustion engine to a driven shaft. The crankshaft also has a free end connected to an accessory drive train. The coupling assembly comprises a low inertia flywheel having a mass so selected as to cause the node of the first crankshaft mode of torsional vibration to be located in the vicinity of the middle of the crankshaft, and a flexible coupling which interconnects the working end of the crankshaft with the driven shaft. The low inertia flywheel not only reduces the amplitude of the torsional deflection at the free end of the crankshaft, but further raises the primary torsional vibration orders of the engine which excite the coupling assembly by at least one half of an order such that the peak stresses applied to the teeth of the first gear wheel of the accessory drive train are at least halved and are further applied to at least twice as many gear teeth, thereby greatly prolonging the life of the gear wheel. Moreover, the low inertia flywheel further increases the lifetime of the flexible coupling by raising its natural frequency to a level which is substantially higher than the 0.5 engine order of torsional vibration associated with engine malfunction and governor interaction.

This invention generally relates to engine couplings, and is specifically concerned with an improved, low-inertia coupling assembly for reducing stress in the interface between the ends of a crankshaft and a drive train.
Coupling assemblies for transmitting rotary power from the working end of a crankshaft of an internal combustion engine to a driven shaft are well known in the prior art. Such coupling assemblies generally comprise a high inertia flywheel in combination with a flexible coupling which interconnects the working end of the crankshaft with the driven shaft. The flexible coupling may include a resilient member formed from an elastomeric material. Such couplings are most typically used in diesel engines, and the primary purpose of the high-inertia flywheel is to smooth out the amplitude of the torque generated by the working end of the crankshaft. A secondary purpose of the flywheel is to provide a mount for the ring gear which engages the output gear of the starter motor of the engine. The flexible coupling utilized in such prior art assemblies not only serves the function of mechanically interconnecting the working end of the crankshaft with a driven shaft; the flexibility provided by the elastomeric material in the coupling advantageously dampens impulse torques which might otherwise be generated between the crankshaft and the driven shaft. Such unwanted impulse torques may occur, for example when the driven shaft is a cardan-type shaft, and the elastomeric material provided in such a flexible coupling allows the coupling to drive such a shaft for a maximum amount of time without failure.
While such prior art coupling assemblies have performed satisfactorily in the past, the applicant has observed a number of shortcomings in the performance of such couplings as the power of diesel engines has increased over the years. For example, the applicant has noted that the relatively large inertias associated with the flywheels of prior art couplings (typically between 150 and 400 lbs*ft.sup.2 in diesel engines of between about 500 and 2000 horsepower) tend to cause the node of the first mode of crankshaft torsional vibration to be located in the vicinity of the flywheel itself. Such a location has the effect of maximizing the amplitude of the torsional vibration experienced by the free end of the crankshaft. Since the free end of the crankshaft of such diesel engines is typically connected to an accessory drive train such as the timing gear train and vehicle accessory drives, the relatively large amplitude of torsional movement of the free end of the crankshaft creates undesirable stress in this gear train which is particularly intense with respect to the teeth of a crank nose pinion of the gear train.
The applicant has also observed three other major problems that come about as a result of the relatively large mass of the flywheels used in such prior art couplings. The first and most important of these problems is concentration of intense stress on only a few of the gear teeth of the gear train driven by the free end of the crankshaft. The inherent natural frequency of the crankshaft mode (or second system mode) of torsional vibration causes the crankshaft to be excited by relatively low engine orders (such as the second, third or fourth orders in a four, six or eight throw diesel crank respectively). Hence, in the case of an eight throw crank, the excitation of the crankshaft mode of torsional vibration in the engine of a prior art flywheel assembly by the fourth engine order results in the same four teeth (located 90.degree. apart) being subjected to very high torsional vibrational stresses with each revolution of the gear wheel. After a period of time, these stresses cause these four gear teeth to fail, thereby necessitating an expensive and time-consuming replacement of the gear wheel. A second problem associated with the use of a high inertia flywheel in such prior art couplings is the relatively low frequency it confers on the coupling mode (first system mode); i.e. frequencies in the range of 15 to 20 hertz. While these frequencies avoid major exciting orders in the engine operating speed range, the engine has to run through the coupling resonance speed during start-up, and can damage the coupling by excessive deflections at such low frequencies.
A third problem occurs if this low coupling mode frequency brings the half-order resonance speed within the upper speed range of the engine. Either a misfiring cylinder, or vigorous governor action will cause a high level of half-order excitation which can damage or break the coupling under these conditions.
Other shortcomings associated with the use of such a high-inertia flywheel include the out-of-balance and bending moment forces that such a flywheel applies to the crankshaft which supports it, as well as the expense necessitated by the precision manufacture and installation of such heavy components in an engine.
Clearly, there is a need for an improved coupling assembly which overcomes the shortcomings and problems associated with the use of high-inertia flywheels in such assemblies.

Torsional tunable coupling for a diesel engine drive shaft


An audio playback system includes a handheld device and a digital stereo set. By the handheld device, a control message is converted into a pulse signal. Moreover, the on/off states of a visible light emitting element are controlled according to first pulse signal, so that a visible light signal is generated. After the visible light signal is received by an optical sensor of the digital stereo set, the visible light signal is restored to the control message. After the control message is received by the digital stereo set, the digital stereo set performs a corresponding control action.

Conventionally, a digital stereo set is controlled by using a control panel or a remote controller. As known, since the control panel or the remote controller can only provide basic control items, the control panel or the remote controller is not personalized. With increasing development of science and technology, the functions of the current handheld devices such as smart phones or tablet personal computers are very complete. Moreover, the current handheld devices have diversified controllable items and can perform personalized control actions. Consequently, it is an important issue to research how to use the handheld device to control the digital stereo set.
Nowadays, the handheld device may be in communication with the digital stereo set by a wireless communication technology in order to control the digital stereo set. The wireless communication technology widely used in the handheld device is for example a Wi-Fi communication technology, a Bluetooth communication technology or a near field communication technology. Regardless of which wireless communication technology is adopted, both of the handheld device and the digital stereo set should be additionally equipped with corresponding chips. In other words, the use of the wireless communication technology is neither cost-effective nor user-friendly. For example, during a Bluetooth pairing process, it is necessary to input the same password into the two devices. Moreover, since the above-mentioned wireless communication technologies belong to radio frequency communication technologies, the generated electromagnetic radiation is detrimental to the human bodies, and a problem of electromagnetic radiation channel occupancy occurs.
Therefore, there is a need of providing an improved communication and control method for a handheld device and a digital stereo set in order to eliminate the above drawbacks of the wireless communication and provide abundant personalized control actions.


A soldering quality detection platform comprises a 2D image acquisition device adapted to acquire a 2D image of a soldered region of a soldered product, a 3D image acquisition device adapted to acquire a 3D image of the soldered region of the soldered product, and a judgment device. The judgment device is adapted to determine whether a soldering quality is qualified based on the 2D image and the 3D image of the soldered region of the soldered product.

A soldering quality of a soldered product is generally determined by human visual inspection. Such a manual judgment is subject to a high error rate and low efficiency. Therefore, in recent years, machine vision has been proposed to determine the soldering quality of the soldered product. A two-dimensional (2D) image of a soldered region, such as a soldered joint, of a soldered product is captured by a 2D camera, and a computer then determines whether the soldering quality is qualified based on the captured 2D image information.
The 2D image information of the soldered region, however, can only reflect information such as a shape and size of a 2D projection profile thereof, and cannot reflect a three-dimensional shape and size thereof. Determining whether the soldering quality is qualified only based on the 2D image information is still prone to erroneous judgment and reduced accuracy.


A microwave heating package includes a dimensionally stable first component for supporting a food item and a flexible second component dimensioned to receive the dimensionally stable first component. Each of the first component and the second component may include a microwave energy interactive element for altering the effect of microwave energy on a food item within the package.

Microwave ovens have become a principle form of heating food in a rapid and effective manner. Various attempts have been made to provide microwave food packages that produce effects associated with foods cooked in a conventional oven. Such packages must be capable of controlling the distribution of energy around the food item, utilizing the energy in the most efficient manner, and ensuring that the food item and the container provide a pleasant and acceptable finished food item. While some microwave interactive packages are available commercially, there remains a need for improved materials and constructs that provide the desired level of heating, browning, and/or crisping of a food item in a microwave oven.

Microwave energy interactive food package


A sheathing layer spans a supporting surface from which moisture is to be removed. In one exemplary system, ventilation channels extend between opposed ends of the substrate layer, communicating with an outlet opening at one end and with a duct at the opposing end which in turn communicates with an inlet opening at the same end of the substrate layer as the outlet opening. A fan is arranged to circulate air through channels from the inlet opening to the outlet opening to replace humid air in the channels with drier replacement air. In another example, a substrate layer includes ventilation channels communicating only between the supporting surface and an outlet opening. The outlet opening connects to a fan which maintains the channels at a vacuum pressure to withdraw moisture therefrom.

It is known to be desirable to remove excess moisture in buildings to prevent the accumulation of mold and for the comfort of occupants of the building. Moisture is particularly a problem in foundation areas of concrete structures in which the moisture can penetrate through concrete walls and floors into occupied spaces of the building.
The following US patents disclose several examples of systems related to moisture removal in a building: U.S. Pat. No. 5,893,216 belonging to Smith et al.; U.S. Pat. No. 5,555,643 belonging to Guasch; U.S. Pat. No. 5,408,759 belonging to Bass; U.S. Pat. No. 5,155,924 belonging to Smith; U.S. Pat. No. 5,092,520 belonging to Lestage; U.S. Pat. No. 4,843,786 belonging to Walkinshaw et al.; U.S. Pat. No. 4,114,334 belonging to Thoren; and U.S. Pat. No. 3,318,056 belonging to Thompson.
In each instance in the prior art, the systems are not well suited for installation as a substrate ready to accept finishing materials thereon and in a manner in which airflow for collecting moisture is optimized through a substrate area. In other instances the systems disclosed in the prior art are complex to install and/or costly.
U.S. Pat. No. 6,691,427 belonging to Fernandes et al. discloses a concrete wall heating and drying system in which panels of insulating material direct airflow across the surfaces of a concrete wall to be dried. The system works well, however in some instances the airflow pattern may be limited to particular wall configurations and the many redirections of air through manifold or plenum sections of the system do not always ensure even pressure and flow distribution for optimum moisture collection.


A process for etching with a scanning tunneling microscope on both a single crystal and a thin film of high temperature superconductor is disclosed.

The scanning tunneling microscope, hereinafter STM, is an instrument capable of resolving surface detail down to the atomic level. The microscope's conductive tip, ideally terminating in a single atom, traces the contours of a surface with atomic resolution. The tip is maneuvered to within a nanometer or so of the surface of a conducting substrate so that the electron clouds of the atom at the probe tip overlap that of the nearest atom of the sample. When a small voltage is applied, electrons tunnel across the gap between the microscope tip and the substrate, generating a tunneling current the magnitude of which is sensitive to the size of the gap. Typically the tunneling current decreases by a factor of 10 each time the gap is widened by 0.1 nanometer.
Movement of the microscope tip is controlled by piezoelectric controls. In one mode of operation, the tip or probe is held at a constant height as it is moved horizontally back and forth across the sample surface in a raster pattern, its parallel tracks separated by a fraction of a nanometer. This causes the tunneling current to fluctuate and the current variation is measured and translated into an image of the surface. The current increases when the tip is closer to the surface, as when passing over bumps such as a surface atom, and decreases when the tip is farther from the surface, as when passing over gaps between atoms. In an alternative mode of operation, the probe or tip moves up and down in concert with the surface topography as it is moved across the surface in a raster pattern. Its height is controlled to maintain a constant tunneling current between the tip and the surface. The variations in voltage required to maintain this constant gap are electronically translated into an image of surface relief.
The image obtained by either mode of operation is not a topographical map of the surface, but a surface of constant tunneling probability affected by the variations in the occurrence and energy levels of the electrons present in the surface atoms. If the surface is composed of a single type of atom, the image may closely resemble topography, but when various atoms are present pits or bumps will appear in the image depending upon their electronic structures.
Further detail on the structure and operation of the STM is disclosed in U.S. Pat. No. 4,343,993 of Binnig et al issued Aug. 10, 1982; Wickramasinghe, H. K., Scientific American, October (1989) pp. 98-105; Rabe, J. P., Angew. Chem. Int. Ed. Engl. 28 (1989) No. 1, pp. 117-122; and Hansma et al., Science, 242, Oct. 14, 1988, pp. 209-216.
The STM is useful not only for the imaging or characterization of surfaces, but also for manipulating surfaces on a scale as small as subnanometers. STM is limited to imaging or manipulating surfaces which conduct electrons. Therefore, thin conductive coatings or replicas have been used on substrate surfaces which are nonconducting. See McCord et al., J. Vac. Sci. Technol. B 4 (1), 86-88 (1986); McCord et al., J. Vac. Sci. Technol. B 6(1), 293-296 (1988); Research Disclosure 28130, September 1987; Schneir et al., J. Appl. Phys., 63, 717-721 (1988); and Schneir et al., Langmuir, 3, 1025-1027 (1987).
Metal deposition onto a substrate surface from a gas is another method which has been used to pattern lines using the STM. See McCord et al., J. Vac. Sci. Technol. B 6, 1877-1880 (1988); Japan Patent Application 63-271,743 published Nov. 9, 1988; and U.S. Pat. No. 4,550,257 of Binnig et al., issued Oct. 29, 1985. Metal deposition onto gold is taught by Emch et al., J. Appl. Phys., 65, 79-84 (1989). Deposition of particles onto the surface from a carrier is disclosed in U.S. Pat. No. 4,829,507 of Kazan et al. issued May 9, 1989.
The formation of protrusions or raised surface areas on metallic glasses by local heating using the STM has also been reported as a means of nanometer lithography by Staufer et al., J. Vac. Sci. Technol., A 6, 537-539 (1988) and Ringger et al., Appl. Phys. Lett. 46, 832-834 (1985).
Writing using the STM wherein the microscope tip physically touches, scratches, indents, or creates holes in the substrate surface has been taught by Van Loenen et al., Appl. Phys. Lett., 55, (13), 1312-1413, Sep. 25, 1989; Jaklevic et al., Physical Review Letters, 60, 120-123 (1988); and Garfunkel et al., Science, 246, 99-100, Oct. 6, 1989.
Another approach to writing with the STM has been to use the tunneling current for surface rearrangement of the atoms already present. Such lithography has not been reliably reproducible. See Becker et al., Nature, 325, 419-421 (1987), and Japan Patent Application 63-60,196 published Mar. 16, 1988.
The ability to manipulate single atoms or molecules with the STM provides unique potential applications in microelectronics. Much of the current interest in high temperature superconductors is related to their use in electronic applications. One important criterion in this area is the ability to make extremely fine structures such as junction devices. Also of great importance is the surface chemistry and surface morphology of these materials.
R. Laiho et al., Journal of Microscopy, Vol. 152, Part 2, pp. 407-413, November (1988) disclose investigation of the surface structures of the high temperature superconductors YBa.sub.2 Cu.sub.3 O.sub.7-x, Bi-Ca.sub.1.7 Sr.sub.0.7 Cu.sub.2 O.sub.x and TlCaBaCuO.sub.4.5.+-.x using STM. H. Heinzelmann et al., Journal of Microscopy, Vol. 152, Part 2, pp. 399-405, November (1988) discuss use of STM and of AFM (atomic force microscopy) at room temperature and pressure to investigate the surface of single crystal YBa.sub.2 Cu.sub.3 O.sub.7-x high temperature superconductors. Both of these references teach imaging or characterization of surfaces but no means of etching or lithography on these superconducting substrates.
H. Heinzelmann et al., App. Phys. Lett., Vol. 53, No. 24, p. 2447 (1988) disclose investigation of the topography of the surface of the high temperature superconductor HoBa.sub.2 Cu.sub.3 O.sub.7-x single crystal using STM. Surface features have been modified on this material using STM at a high threshold voltage (.gtoreq.2.0 V). This work was done only on single crystals. Etching by multiples of layers (a few angstroms) was not demonstrated and the resulting etch pattern was irregularly shaped indicating an uncontrolled process. Thin films may be of more practical use for devices.
It is therefore an object of the present invention to provide a process for etching of nanoscale structures using STM on a high temperature single crystal or thin film superconductor.
It is a further object of the present invention to provide a lithography process using a STM on a single crystal or thin film superconductor which requires no post writing treatment to stabilize the image.
It is a further object of the present invention to provide a lithography process using a STM on a single crystal or thin film superconductor which can controllably remove one or more layers in the a-b plane and which does not destructively deform the superconductor.

Etching of nanoscale structures on high temperature superconductors


The present invention relates to a temperature monitoring for switching elements, in particular for a module having bipolar transistors with an insulated gate. For this purpose, the current operating parameters of the IGBT module are detected and, on the basis of said operating parameters, an expected temperature of the switching element is determined at a predetermined position. Said expected temperature is compared with a temperature detected at this position. If the actual temperature exceeds the expected temperature, then this is an indication of a malfunction.

The present invention relates to a switching element having temperature monitoring, a drive system having such a switching element, and a method for temperature monitoring. In particular, the present invention relates to temperature monitoring in a switching element having an IGBT module.
The publication EP 1 724 561 A2 discloses a temperature sensor for an IGBT module. Here, the IGBT module has a hole which is provided for attaching the IGBT module to a heat sink. A sensor element for temperature measurement is accommodated on a carrier element, and the carrier element has a shape for affixing the carrier element flush against the IGBT module.
For an electric drive, in particular in an electric or hybrid vehicle, three-phase machines are supplied with electric power via an inverter. In particular modules having semiconductor switching elements, for example, bipolar transistors having an insulated gate terminal (IGBT), are used in the inverter. Since the current-carrying capacity of a single transistor in such a module is limited, multiple transistors may be connected in parallel in an IGBT module in order to increase the current-carrying capacity.
Furthermore, in electric drive systems, a switching state is generally provided, in which the system may be switched to a safe operating state. Such a safe switching state is, for example, an active short circuit, in which all phase terminals of a connected electric machine, for example, can be electrically connected, i.e., short-circuited, via the switching elements of the inverter. In the case of such an active short circuit, a relatively high current may possibly occur. The temperature of the IGBT module may be monitored by means of a temperature sensor.

Switching element having temperature monitoring and method for temperature monitoring


A rack-mount structure has a roof mount fitted to the roof, the roof mount includes a slot therein, a suspending frame pivotally connected to one side of the slot, and a latching mechanism for releasably securing the flat panel display to the suspending frame. The suspending frame has a receiving space for receiving a flat panel display therein. A pair of latching members is formed on the roof mount and the suspending frame to lock the suspending frame within the slot. A release button controlling the engagement between the latching members can also be formed on the roof mount or the suspending frame. One side of the receiving space of the suspending frame is covered with a mirror plate or a glass plate.

The present invention relates in general to a rack mount device, and more particularly, to a rack mount device installed on a top of a vehicle or a location for mounting a liquid crystal display operative to provide both audio and video display functions.
Vehicles have become the major transportation tool for modern society. For the large size bus, televisions are often mounted to the top of the bus for entertaining the passengers. However, the conventional rack for mounting or installing the televisions is typically very large and heavy. Thus, it very easily blocks the view of both the passengers and the driver. It is also very dangerous for tall people. Such type of rack is not suitable for use in a small size family car. In the small size car, the television is typically in the form of a liquid crystal display embedded in the middle of the dashboard. Therefore, it is not convenient for the passengers in the back seats to watch. Further, for entertaining purposes, video devices such as VCD or DVD are also installed in the vehicle to provide programming for the display. This is therefore very costly. When the driver or owner is away from the car, the car is often stolen or damaged because of the high-value video system installed therein.

Rack-mount structure for mounting LCD display


A sheet discharge tray that can improve width direction alignment of discharged sheets of various sizes with a simple structure. Ribs are disposed on a sheet discharge tray. And a space between at least a pair of adjacent ribs among the ribs at a discharging direction upstream end portion is narrower than a space between the at least two adjacent ribs at a discharging direction downstream end portion.

1. Field of the Invention
The present invention relates to a sheet discharge tray, and more particularly to a sheet discharge tray that stacks sheets such as originals, printing paper, or plastic sheets discharged from a sheet conveying apparatus that conveys sheets and is provided in an image forming apparatus, such as a copying machine or a printer, an image reading apparatus, such as a sheet feed scanner, etc., as well as a sheet conveying apparatus, a image forming apparatus, and an image reading apparatus having the sheet discharge tray.
2. Description of the Related Art
A sheet conveying apparatus that conveys sheets is provided in an image forming apparatus, such as a copying machine or a printer, and an image reading apparatus, such as a sheet feed scanner. This kind of sheet conveying apparatus discharges conveyed sheets onto the stacking surface of a sheet discharge tray provided in the image forming apparatus or the image reading apparatus. Some sheet discharge trays are provided with an extension tray, described later using FIG. 9, in order to stack large size sheets that are discharged from the sheet conveying apparatus (for example, see Japanese Laid-Open Patent Publication (Kokai) No. 2004-010220 (FIG. 2)).
FIG. 9 is a side view showing schematic configuration of a conventional sheet discharge tray.
In FIG. 9, a sheet discharge tray 10 comprises a plate-shaped member 11 on which a stacking surface 11a is formed for stacking sheets discharged from sheet discharge section 20 of a sheet conveying apparatus, an extension tray 12 comprising a plate-shaped member, on which an extension stacking surface 12a is formed, that is capable of face-to-face superposition with the stacking surface 11a, and a pivot 13 that is provided between the plate-shaped member 11 and the extension tray 12. The pivot 13 is provided in proximity to the end of the stacking surface 11a in the discharging direction. The plate-shaped member 11 rotatably supports the extension tray 12 via the pivot 13.
The extension tray 12 arrives at a housing position (not shown) by being rotated in the direction of an arrow D shown in FIG. 9. At the housing position, the extension stacking surface 12a of the extension tray 12 is opposite to the stacking surface 11a of the plate-shaped member 11. When the extension tray 12 is in the housing position, a sheet of a size that is smaller than the length in the discharging direction of the stacking surface 11a, such as a business card or a postcard, can be stacked on the surface opposite to the extension stacking surface 12a of the extension tray 12, i.e. the rear surface. In contrast, when stacking sheets that are longer than the length in the discharging direction of the stacking surface 11a, the extension tray 12 is rotated in the opposite direction to the arrow D to reach the extension position shown in FIG. 9.
According to the sheet discharge tray 10 shown in FIG. 9, the length of the stacking surface of the sheet discharge tray 10 can be changed depending on the size of the sheets to be discharged from the sheet discharge section 20 of the sheet conveying apparatus.
As described later using FIG. 10, a sheet discharge tray that stacks sheets discharged from a sheet conveying apparatus while aligning the sheets has also been proposed (for example, see Japanese Laid-Open Patent Publication (Kokai) No. 10-109807 (FIG. 1)).
FIG. 10 is a side view showing schematic configuration of another conventional sheet conveying apparatus in which a sheet discharge section is provided.
A sheet discharge tray 30 that is connected to a sheet conveying apparatus 300 as shown in FIG. 10 comprises a base 31 on which are formed a sloping surface 31a and a horizontal surface 31b for stacking sheets discharged from sheet discharge section 320 of the sheet conveying apparatus 300, a first end fence 32 provided at the end in the discharging direction of the base 31, two ribs 35 that are vertically arranged in parallel in the discharging direction on the upper surface of the base 31, and a second end fence 33 as a abutment plate that is provided between the two ribs 35. The second end fence 33 may also be configured to be movable in the discharging direction.
According to the sheet discharge tray 30 shown in FIG. 10, since the sloping surface 31a is formed to become lower as it proceeds towards the end side in the discharging direction, through the force of gravity, the sheets can be stacked so as to collide against either the end fence 32 or the end fence 33 depending on the sheet size. It is therefore possible to reduce misalignment among the discharged sheets in the discharging direction.
Further, in a case where the size of the discharged sheets is small, since the inside faces of the ribs 35 contact the sheets before the sheets collide against the end fence 33, the ribs 35 can function as widthwise regulating plates that reduce misalignment among sheets with regard to the width direction that is orthogonal to the discharging direction.
According to the sheet discharge tray 10 shown in FIG. 9, an improvement in the discharging direction alignment of sheets can be expected by forming a sloping surface in which the stacking surface 11a and the extension stacking surface 12a become lower as they approach the sheet discharge section 20. However, an improvement in the alignment of sheets in the width direction that is orthogonal to the discharging direction can not be expected. It is thus necessary for the user to remove a bundle of sheets that is stacked on the sheet discharge tray 10 and correct the misalignment in the width direction.
Further, according to the sheet discharge tray 30 shown in FIG. 10, an improvement in the discharging direction alignment of discharged sheets can be expected when the user adjust the position in the discharging direction of the second end fence 33 to match the size of discharged sheets. However it is necessary for the user to consume time to adjust the position of the second end fence 33. Furthermore, according to the sheet discharge tray 30 shown in FIG. 10, since a sheet whose width exceeds the space between the two ribs 35 is stacked on the upper surface of the ribs 35, an improvement in the width direction alignment of such sheets can not be expected. Therefore, when large size sheets are discharged, the user must perform the time consuming work of removing a bundle of sheets that are stacked in a disorderly manner on the sheet discharge tray 30 and then aligning the bundle of sheets.

Sheet discharge tray, as well as sheet conveying apparatus, image forming apparatus, and image reading apparatus having the sheet discharge tray


Aspects involve estimating transitions in properties of a concrete mixture prior to batching and during transport of the mixture from a first location, such as a concrete batch plant, to a second location, such as a job site and controlling a mixture of ingredients for concrete in response. A tool may execute a method for estimating an initial temperature at batching and a change in temperature of the concrete mixture during transport due to the exothermic reaction of the mixture, percentages and types of ingredients of the mixture, and/or environmental factors along a transit route. A control system at the concrete batching plant may control one or more components of the concrete batch plant in response to the estimated temperature change, such as a dispenser of an ingredient of the mixture and/or a heating or cooling mechanism to adjust the temperature of an ingredient of the concrete mixture.

Concrete is made from mixing aggregate, typically sand and gravel or rock, with cement and water, along with property-enhancing chemical admixtures. Mixing cement and water produces heat—it is an exothermic reaction. Proper curing of the concrete can be negatively affected when the temperature of concrete exceeds various thresholds while the concrete is hardening and curing, such as an upper temperature threshold or a lower temperature threshold. These issues may be exacerbated by the exothermic reaction occurring within the concrete mixture. Thus, techniques have been developed to cool the concrete, or some component of the concrete, so that the concrete is and remains cool enough to cure properly. However, concrete is typically mixed at a concrete plant and transported, often in cement mixing trucks, to the job site (or location in which the concrete is to be poured into a mold for curing). During transit, the exothermic reaction within the concrete mixture, along with radiant, convective, and conductive heat transfer, may affect the temperature of the mixture such that the mixture may be within an acceptable temperature range at the concrete plant, but exceed a threshold value upon delivery at the job site and may be rejected for pouring. Furthermore, because the concrete is comprised of various materials, changes in the material temperature can result in a measurable difference in the batched concrete's temperature. For example, aggregate used in a concrete mixture from a stockpile that is located in the sun vs. a stockpile that is located in the shade can affect the temperature of a concrete mixture from batch to batch. In another example, fresh deliveries of cement can exceed temperatures of 180 degrees Fahrenheit such that the age of the cement in a storage bin can affect the concrete temperature during pouring. As deliveries of cement are received throughout the day, fluctuation in concrete temperature is generally expected, but difficult to control. As a concrete plant may provide concrete to several different job sites at different locations over the course of a day (at different distances from the concrete plant) and with numerous variations in the mixture recipe, the amount of pre-cooling of the ingredients of the concrete mixture needed to avoid rejection of the concrete batch at the job site may vary from truckload to truckload, often requiring significant oversight by a concrete plant operator.
It is with these observations in mind, among others, that aspects of the present disclosure were conceived.

System and method for controlling a concrete mixture based on estimated concrete properties