A transaction switch and integrated circuit incorporating said for switching data through a shared memory between a plurality of data interfaces that support different data protocols, namely packetized interfaces like InfiniBand and addressed data interfaces like PCI. The transaction switch also switches transactions commanding data transfers between the disparate protocol data interfaces and between those of the data interfaces having like protocols. For example, the transaction switch enables a hybrid InfiniBand channel adapter/switch to perform both InfiniBand packet to local bus protocol data transfers through the shared memory as well as InfiniBand packet switching between the multiple InfiniBand interfaces. The transactions are tailored for each interface type to include information needed by the particular interface type to perform a data transfer. The shared buffer memory, dynamically allocated by the transaction switch on a first-come-first serve basis, results in more efficient use of precious buffering resources than in a statically allocated scheme.

1. Field of the Invention
This invention relates in general to data buffering, switching and routing in computer networks, and in particular to buffering, switching and routing data between devices or interfaces having disparate data protocols and data formats.
2. Description of the Related Art
Computer networks consist of various elements that process data, store data, or transfer data between the elements. Typically, each of the network elements manages the data in disparate forms. For example, an operating system running on a processor element typically deals with data based upon the address of the data stored in a local memory. The data is transferred between the processor and memory on a processor or memory bus using one type of data transfer protocol. Similarly, data may be transferred between the processor or the memory and an I/O device in a system on an I/O bus, such as a PCI bus, using a different data protocol. Still further, data may be transferred in packets between two different computers on a network cable, such as an Ethernet cable, using a third protocol.
It is necessary for elements within a network desiring to transfer data between one another to convert or translate from one data protocol to another when moving the data between the elements. Consider, for example, a network interface card (NIC) that transfers data between an Ethernet cable and a PCI local I/O bus. The NIC includes an Ethernet interface, which is an example of a packetized data interface, for receiving a packet of data one bit at a time according to the Ethernet serial cable protocol. The NIC also includes a PCI interface, which is an example of an addressed data interface, for transferring the data packet to system memory according to the PCI bus protocol. Conversely, the NIC is capable of receiving a packet of data from system memory on the PCI bus and transmitting the data on the Ethernet cable.
For at least two reasons, the NIC may also be required to buffer the data in a memory on the NIC in between receiving the data from one interface and transmitting the data on the other interface. First, the PCI bus protocol and Ethernet protocol have different data transfer rates. In particular, the PCI bus is capable of transferring data at a much faster rate than the Ethernet protocol. Hence, if the NIC does not buffer the data from the PCI interface, some of the data may be lost before it can be transmitted on the Ethernet interface.
Second, the two protocols have different arbitration techniques. In the PCI protocol, a device desiring to transfer data must first arbitrate for and be granted ownership of the bus at which time it may transfer up to a maximum amount of data before relinquishing ownership of the bus. In contrast, Ethernet devices may transmit at will; however, they are subject to collision back off and retry algorithms. Hence, if the NIC does not buffer the data from the Ethernet interface, some of the data may be lost before the PCI interface can arbitrate for and be awarded ownership of the PCI bus, or vice versa if a collision occurs and the time to successfully retry is relatively lengthy.
Recently, a new packetized data transfer protocol, the InfiniBand™ Architecture (IBA), has been defined for performing data transfers between computers and their peripheral devices, such as storage devices and network interface devices, and between computers themselves. The IBA is a high speed, highly reliable, serial computer interconnect technology. The IBA specifies interconnection speeds of 2.5 Gbps (Gigabits per second) (1× mode), 10 Gbps (4× mode) and 30 Gbps (12× mode) between IB-capable computers and I/O units.
The IBA specifies InfiniBand (IB) channel adapters (CA) for adapting an InfiniBand packetized data link to another data transfer protocol, such as an addressed data bus like the PCI bus. Channel adapters enable a host computer or I/O device to connect to an IBA network by performing protocol translation between the IBA protocol and the local bus protocol, such as PCI. For example, in response to programming from a local processor, the CA may transfer a payload of data from a memory on the local bus, create an IB packet with the data, and transmit the packet to another IB node. Conversely, the CA may receive an IB packet, extract the payload of data from it, determine where in the memory the payload belongs, and transfer the payload data on the local bus to the memory. This is a protocol translation function, commonly referred to as a transport layer function, performed by the CA in addition to the protocol translation performed by the NIC described above, which simply transfers the entire packet from one interface to another, from the addressed data interface to the packetized interface and vice versa. In the case of the NIC, the local processor performs the transport layer function.
In addition to channel adapters, the IBA also specifies IB switches, for switching IBA packets within a local subnet of IBA channel adapters. IB switches include multiple IB ports for connecting to multiple IB channel adapters on IB links. Each channel adapter port has a unique local subnet identification number. The IB switches maintain switching tables that enable the switches to receive a packet in one port and switch the packet out another port that is connected to the destination channel adapter or to another switch from which the destination channel adapter is downstream.
It is desirable to include the functionality of an IB channel adapter and switch together in a single device, which may be referred to as a hybrid channel adapter/switch. A hybrid channel adapter/switch would be required to perform two functions. First, it would have to perform protocol translation between an IB link and a local bus, such as PCI. Second, it would have to perform IB packet switching between the various IB ports.
It is also highly desirable for the hybrid channel adapter/switch to perform a third function: addressed data switching or bridging. This function derives from the fact that it is desirable to have multiple addressed data local bus interfaces or ports, such as multiple PCI bus interfaces.
Multiple local bus ports are necessary to supply sufficient data throughput to match the IB port bandwidth, due to the enormous data throughput IB links are capable of sustaining. Furthermore, local bus loading specifications, such as PCI, limit the number of I/O controllers that may be attached to a local bus. Hence, it is also desirable to have multiple local bus ports on the hybrid channel adapter/switch to enable more I/O controllers to be connected than a single local bus can support. In such an arrangement, the I/O controllers on disparate local buses need to be able to transfer addressed data to one another. Additionally, an I/O controller will need to transfer data to or from a system or local memory that is connected to a memory controller on a different local bus than the I/O controller. Hence, the hybrid channel adapter/switch must be capable of switching or bridging addressed data between its multiple local bus interfaces.
For similar reasons described above with respect to the NIC, the hybrid channel adapter/switch would also need to perform data buffering, not only for the protocol translation function, but also for the packet switching and addressed data bridging functions. One obvious solution is to extend the architecture of the NIC described above. That is, the hybrid channel adapter/switch could provide a dedicated buffer memory for each possible data transfer path between each of the interfaces in the hybrid channel adapter/switch. A buffer between each of the combinations of paths between the IB interfaces would provide packet buffering for the packet switching function. Similarly, buffers between the PCI interfaces would provide addressed data buffering for the local bus bridging function. Buffers between the protocol translation device and the IB and PCI interfaces would provide buffering for the protocol translation function.
However, there are drawbacks to the solution just described. First, the solution makes inefficient use of the buffering memories. Due to the high transfer rates of the interfaces in question, the size of the buffers on many of the paths may have to be relatively large in order to achieve optimum transfer rates in the worst-case conditions. Hence, the solution may require more total buffer memory than is realistically manufacturable given contemporary semiconductor manufacturing capabilities. Consequently, a decision must be made a priori concerning how the limited buffer memory space will be statically divided among the data paths between the various interfaces.
This static allocation may at times result in inefficient use of the buffering resources. For example, the flow of data traffic through the hybrid channel adapter/switch may be such that for some periods some of the data paths are not used and others are saturated. In this situation, the buffers in the idle data paths are sitting empty. In contrast, because the heavily used paths do not have sufficient buffering resources, the overall data throughput rate through the hybrid channel adapter/switch may be reduced. A more efficient solution would enable the unused buffers to be used to facilitate the flow of data through the paths needing additional buffering resources.
A second drawback is that the solution requires double-buffering in the case of the transport layer protocol translation function. For example, a packet is received by an IB interface and stored in a buffer on the data path between the IB interface and the transport layer device. The transport layer device then reads the packet from the buffer, performs the necessary translation function, and writes the translated data to a buffer on the data path between the transport layer device and the destination local bus interface. The local bus interface then reads the translated data from the second buffer and transfers the data on the local bus. This double-buffering, i.e., buffering the data twice within the hybrid channel adapter/switch, works to reduce the overall bandwidth of data that may be transferred through the hybrid channel adapter/switch.
Therefore, what is needed is an apparatus in a network adapter having multiple disparate data protocol interfaces or devices to transfer data both between interfaces of the same type and between interfaces of a different type. The apparatus needs to perform the transfers without double-buffering the data and in such a manner that makes efficient use of valuable, limited buffer memory resources.

Transaction switch and network interface adapter incorporating same


A system and method for detecting at least one force, impact, shock, or vibration event on an imaging system. The system comprises a main assembly, a support assembly coupled to the main assembly, and at least one sensor coupled to the imaging system. The at least one sensor is configured to detect at least one force, impact, shock, or vibration event occurring on the imaging system. The method comprises detecting at least one force, impact, shock, or vibration event occurring on the imaging system and providing an indication to a user when a force, impact, shock, or vibration event occurs on the imaging system.

The present invention relates generally to imaging systems, and more particularly to a system and method for impact detection of an imaging system undergoing a force, impact, shock, or vibration event.
A typical imaging system comprises a source and a detector. An x-ray imaging system includes an x-ray source and an x-ray detector. Many x-ray detectors used in an x-ray imaging system comprise an image intensifier. However, many image intensifiers are being replaced by flat panel detectors on high-end imaging systems. A flat panel detector is more fragile and significantly more expensive than an image intensifier. It is known that mobile imaging systems can be subjected to random force, impact, shock and vibration during transport and/or positioning. Hence, the flat panel detector can create a reliability challenge for the imaging system that can be subjected to random force, impact, shock and vibration during transport and/or positioning.
The primary limitation of an imaging system having a flat panel detector is that there is not a reliable way to detect and document force, impact, shock, or vibration events that occur outside the warranty limits of the system. Unless a means exists to detect and document the force, impact, shock, or vibration events, the cost of replacing a damaged flat panel detector can result in a significant monetary burden for a manufacturer of the imaging system.
In addition to the source and detector, the typical imaging system comprises a main assembly and a support assembly. The main assembly may support the support assembly, and may include the source and/or the detector. The support assembly is typically coupled to the main assembly. The support assembly typically includes the source and/or the detector, and may also include an apparatus to support a subject undergoing imaging. For mobile imaging systems, the main assembly typically includes wheels for moving and/or positioning the imaging system. The support assembly can include roller bearings or wheels also. The main assembly and/or the support assembly typically performs functions that require more precise motion, position accuracy and repeatability, such as acquiring data for a three-dimensional scan. Force, impact, shock, or vibration damage to the main assembly and/or the support assembly associated with mechanical movement of the imaging system may reduce the position accuracy and repeatability. Periodic maintenance can be performed to test and recalibrate the main assembly and/or the support assembly. But the periodic maintenance can be performed less frequently if it is known that the main assembly and/or the support assembly is not been subject to high force, impact, shock, or vibration events during relocation or movement of the imaging system. Hence there exists a need for adapting an efficient mechanism to detect, document and indicate force, impact, shock, or vibration events occurring with an imaging system.

Method and system for impact detection of an imaging system


A plurality of scenes in a digital video are identified. The length of each scene is compared with a first threshold length and a second threshold length. When the scene is longer than the first threshold length and does not exceed the second threshold length, a first preview is generated for the scene. When the scene is longer than the first threshold length and longer than the second threshold length, a plurality of previews for the scene is generated.

Computing devices such as smart phones, cellular phones, laptop computers, desktop computers, netbooks, tablet computers, etc., are commonly used for a variety of different purposes. Users often use media viewers (e.g., an application that allows a user to consume a media item, such as a web browser, a standalone application, etc.) on computing devices to use, play, and/or consume digital media items (e.g., view digital images, watch digital video, and/or listen to digital music).
Users may often preview portions of media items when consuming the media items. For example, the user may move a pointer (e.g., a mouse pointer) over a portion of a playback bar to preview the frame and/or image that may be presented at a particular time. Numerous previews may be generated for each media item. For example, one preview may be generated for every second of a video. Users can also skip, jump, and/or seek to different portions of the media item. For example, a user may be allowed to jump to any point in time within a video.

Previewing and playing media items based on scenes


An organic light-emitting diode includes a first electrode and a second electrode facing the first electrode; an emission layer between the first electrode and the second electrode; a hole transport layer between the first electrode and the emission layer and includes a first hole transport layer, a second hole transport layer, and a buffer layer between the first hole transport layer and the second hole transport layer; and an electron transport layer between the emission layer and the second electrode, wherein the buffer layer and the electron transport layer each include a mixture of an electron-transporting organometallic compound and an electron-transporting organic compound.

1. Field
The present disclosure relates to an organic light-emitting diode.
2. Description of the Related Art
Organic light-emitting diodes (OLEDs) use light-emitting materials that emit light themselves when a voltage is applied thereto. OLEDs have advantages, such as high brightness, excellent contrast, wide viewing angles, quick responses, or low driving voltages, and may provide multi-color images.
A typical OLED has a structure including an organic emission layer (EML) that is interposed between an anode and a cathode. When a voltage is applied to the OLED, holes from the anode and electrons from the cathode are injected into the organic EML. The injected holes and electrons cause electron exchange among adjacent molecules within the organic EML, and then move to electrodes of opposite polarities. When the holes and electrons recombine in molecules, excitons having a high-energy excited state are generated. As the excitons return to a low-energy ground state, the materials emit lights. To improve brightness and efficiency, the OLED may further include an electron injection layer (EIL), an electron transport layer (ETL), a hole transport layer (HTL), a hole injection layer (HIL), and/or the like, in addition to an EML.
An OLED may have sub-pixels emitting different colors that are homogeneously arranged to represent a full (for example, white) color by using the microcavity effect. There have been efforts taken to reduce the differences in the lifetime and characteristics according to colors.


A skin weft with artificial hair attached thereto to provide various styling options or ample volumetric feeling. The skin weft comprises a stitched portion formed by stitching on a side edge of artificial hair composed of human hair or resin hair, a resin tape welded to a surface of the stitched portion, and a bonding component attached to a surface of the resin tape. The method for manufacturing the skin weft comprises the steps of forming a stitched portion by stitching one side edge of human hair or resin hair arranged and conveyed in the form of a sheet, and supplying a resin tape onto a surface of the stitched portion to form a bonding portion. Automatic mass production is achieved, thereby improving productivity and significantly reducing manufacturing costs. Additional means are unnecessary in the manufacturing process, thereby enabling an unskilled person to perform the task.

Field of the Invention
The present invention relates to a skin weft and a method for manufacturing the same, and more particularly, to a skin weft and a method for manufacturing the same that is capable of applying a human or artificial hair extension to a user's hair, thus making it easy to style his or her hair.
Background of the Related Art
If a portion of hair falls out due to hair loss or a quantity of hair is totally small, generally, an artificial or human hair extension is applied to the hair. At this time, if the hair extension made in the form of a small bundle is applied to a user's hair, it is knotted to the user's hair or fixed thereto by means of a separate ring.
However, such knotting needs an operator's skill and long time for the application of the hair extension, and further, if the hair extension is separated from the hair, the hair may be deformed. On the other hand, if the hair extension is fixed to the hair by means of the separate fixing ring, it may be easily separated therefrom due to unstable fixation, or it becomes in an unnatural fixed state.
So as to remove the above-mentioned problems, there has been proposed a skin weft made by attaching artificial hair to a band type bonding portion made of fiber materials having given width and length and applying a loop or adhesive to the bonding portion so as to attach the bonding portion to a user' hair. In case of the conventional skin weft, however, the artificial hair is attached to the bonding portion by means of an adhesive, which is manually manufactured, thus making it hard to achieve mass production. Furthermore, the adhesive should be applied even when the skin weft is applied to a user's hair, thus making it inconvenient to perform the application of the skin weft to the user's hair.

Skin weft and method for manufacturing the same


A method as well as new intermediates for preparing Ulipristal acetate (a compound I) and a method for preparing the new intermediates are provided. The intermediate in a constitutional formula IV is conductive to reacting with methyl lithium or methyl Grignard reagent, a protective group is easy to be removed after a reaction, side reactions are few, a mid-term treatment is simple, the reagents used are cheap, costs are low and a yield is high, if a compound in a constitutional formula V is obtained by the reaction of a compound in a constitutional formula III and the intermediate in the constitutional formula IV, the yield of a two-step reaction is 75%, a purity is above 98%.

1. Field of Invention
The present invention relates to a medicine, particularly to a method for preparing medicine, and more particularly to a method for preparing ulipristal acetate with an anti-progesterone and anti-glucocorticoid function and to a key intermediate and a preparing method therefor.
2. Description of Related Arts
Ulipristal acetate (a compound I; chemical name: 17α-acetoxyl-11β-(4-N,N-dimethylamino-phenyl)-19-norpregna-4,9-diene-3,20-dione) is a strong anti-progesterone and anti-glucocorticoid medicine. A constitutional formula of the Ulipristal acetate is as follows:

The Ulipristal acetate has been approved to be sold in Europe and America for being used within five days after unprotected sex and a known or suspected contraceptive failure, the Ulipristal acetate is an effective and safe emergency contraceptive.
Related reports of methods for preparing the Ulipristal acetate are as follows.
1. A method disclosed in the U.S. Pat. No. 4,954,490, (as illustrated in the equation I)
The method utilizes 3-methoxyl-19-norpregna-1,3,5(10),17(20)-tetraene as a starting material, and after an addition reaction, oxidation, reduction, hydrolysis and an addition-elimination action, 17α-hydroxyl-19-norpregna-4,9-diene-3,20-dione (a compound V2) is obtained by the oxidation, then the Ulipristal acetate (the compound I) is obtained by a total of ten reactions comprising ethylene glycol condensation, m-chloroperoxy benzoic acid epoxidation, Grignard addition, acid hydrolysis and acetylation, and a product with a melting point of 118˜121° C. is obtained by water/methanol recrystallization. The method is not adaptable to an industrialized production because the steps of the method are too many, the starting material is not easy to be obtained, reaction conditions are complex, intermediates need to be chromatography purified, a its total yield is only 0.62%, costs are very high and the product is not stable enough to be utilized in the medicine;
the equation I:

2. Another method disclosed in the U.S. Pat. No. 5,929,262 (as illustrated in the equation II)
the equation II:

the method utilizes 3,3-ethylendioxyl-17β-cyano-19-norpregna-5(10),9(11)-diene-17α-alcohol (a compound III) as the starting material, and 17α-hydroxy is protected by dimethyl chloromethyl silicane, the starting material is acid hydrolyzed after a reaction with a DBB/Li reagent at a low temperature of −70° C., then diketal is obtained by the ethylene glycol condensation reaction, a desired product is obtained by the epoxidation reaction, the Grignard reaction, the acid hydrolysis reaction and the acetylation reaction, and a yellow product with a melting point of 183˜185° C. is obtained by isopropanol, ethyl acetate and ethyl ether crystallization treatments. The method also does not adapt to the industrialized production because a cost of the starting material and DBB are very high, the reaction conditions are strict, an ultra low temperature and anhydrous anaerobic reaction are needed, the yield is low (wherein the total yield is only 14%) and the costs are also very high.
3. A third method was disclosed in the PCT application WO2004078709, (as illustrated in the equation III), a desired product is obtained by utilizing 17α-hydroxyl-19-norpregna-4,9(10)-diene-3,17-dione (a compound V2) with the acetylization, 3-carbonyl condensation, the epoxidation and the hydrolysis. A route of synthesis is simple, but the starting material is prepared from a compound VI by hydrolysis under an acidic condition, the total yield is only 11.8% (calculated from the compound VI), and in fact, the steps are much more, the yield is lower and the costs are higher, therefore, the method is not adaptable to the industrialized production;
the equation III:

4. A method was disclosed in the Chinese patent application CN200780021915.9 (as illustrated in the equation IV);
the equation IV:

the method utilizes 3,3-ethylendioxyl-19-norpregna-5 (10),9 (11)-diene-17-one (3-Ethylene Ketal for short, a compound II) as the starting material, the desired product is obtained by a total of nine reactions comprising the acetylene addition reaction, reaction with phenylsulfenyl chloride, the sodium methoxide hydrolysis, the acid hydrolysis, the ethylene glycol condensation, the epoxidation, the Grignard reaction, the acid hydrolysis and the acetylation reaction, solvate-free crystals are obtained after the isopropanol crystallization and being heated by ethanol and water for 14 h at 70° C. The method utilizes acetylene with great danger and the phenylsulfenyl chloride with a stink, wherein the phenylsulfenyl chloride is not stable and not easy to be stored, and impurities produced by decomposition involved in the reactions will lead to the low yield, additionally, the phenylsulfenyl chloride can deeply pollute environments, and new impurities is produced by being heated for a long time at the high temperature in the crystallization reaction, the total yield of the method is 13.8%˜15.8%, the costs are high, therefore, the method is not adaptable to the industrialized production.
In the conventional methods as above, the method 1, 2 and 4 are related to preparation of the compound VI, and the starting material of the method 3 is hydrolyzed from the compound VI.

Method for preparing ulipristal acetate and key intermediate thereof

Abstract: wherein R is defined in the specification.

Changzhou No. 4 Pharmaceutical Factory Co., Ltd


A combination linearly polarized antenna and quadrifilar helix antenna (40) includes a quadrifilar antenna (49) having a first coaxial cable (46) and an antenna with linear polarization (44) external to the quadrifilar antenna and having a second coaxial cable (42). A center conductor of the second coaxial cable is isolated from a center conductor of the first coaxial cable and the first coaxial cable runs substantially concentrically through the antenna with linear polarization.

(not applicable)
The invention relates generally to a combination satellite and terrestrial antenna, and more particularly to a combination linearly polarized and quadrifilar antenna able to provide excellent performance for both antennas.
Charles D. McCarrick describes a combination monopole/quadrifilar helix antenna for S-band/Satellite applications on page 330 of the May 2001 edition of the Microwave Journal. FIG. 1 illustrates the monopole/quadrifilar antenna 10 discussed in the McCarrick article. The antenna 10 includes a monopole 15 whose reflective element is a quarter-wave choke 14. Elements 14 and 15 form dipole antenna 13. The antenna 10 comprises a coaxial line 12 with a section of the outer conductor removed to expose the center conductor 15. The quarter-wave choke 14 is placed within a quadrifilar helix antenna shell 16 in an axially concentric fashion. The quadrifilar helix antenna is typically phased to produce circular polarization. Appropriate placement of the dipole antenna 14 within the quadrifilar antenna is critical for avoiding coupling between the two antennas and avoiding degradation of radiation patterns.
A combined antenna as described above has the disadvantages of having strict design requirements in terms of relative placement between antennas to avoid interference between the antennas and further requires a wider overall structure that may not necessarily be aesthetically pleasing. It is very difficult to optimize due to interactions between the dipole and quadrifilar helix. Furthermore, it is a mechanically-challenging structure and difficult to manufacture. The typical placement for such a combined antenna would be on the sloping back windshield of a vehicle. In this instance, for good satellite reception, care must be taken to ensure that most of the quadrifilar antenna xe2x80x9cclearsxe2x80x9d the line of sight with the transmitting satellite that may be blocked by the roof of the vehicle. Thus, a need exists for a combined dipole and quadrifilar antenna that will enable designers further freedom in the relative placement of the antennas while avoiding the detriments of coupling and interference between the antennas. Further, a need exists for a combined antenna that is esthetically pleasing that will further enable greater design choice in the placement of such combined antennas on windshields without being subject to blockage of signals by the form factor of the vehicle.
In a first aspect of the present invention, a combination linearly polarized antenna and quadrifilar helix antenna comprises a quadrifilar antenna having a first coaxial cable and an antenna with linear polarization external to the quadrifilar antenna and having a second coaxial cable. A center conductor of the second coaxial cable is isolated from a center conductor of the first coaxial cable and the first coaxial cable runs substantially concentrically through the antenna with linear polarization.
In a second aspect of the present invention, a combination dipole and quadrifilar helix antenna comprises a quadrifilar antenna having a first coaxial cable and a dipole antenna external to the quadrifilar antenna and having a second coaxial cable. A center conductor of the second coaxial cable is isolated from a center conductor of the first coaxial cable and the second coaxial cable runs substantially concentrically through the quadrifilar helix antenna.
In a third aspect of the present invention, a combination linearly polarized antenna and quadrifilar helix antenna comprises a quadrifilar antenna and a linearly polarized antenna vertically aligned and external to each other. The combination antenna further comprises a first coaxial cable running substantially concentric within at least a portion of the combination linearly polarized antenna and quadrifilar helix antenna serving as a coaxial feed to a quadrifilar feed network for the quadrifilar antenna and a second coaxial cable running substantially concentric within at least a portion of the combination linearly polarized antenna and quadrifilar helix antenna and serving as a quarter-wave extension for the linearly polarized antenna.
In a fourth aspect of the present invention, a tubular dipole antenna comprises a coaxial cable having and an inner conductor and an outer conductor both running vertically and substantially concentrically through a quarter-wave metal sleeve. The tubular dipole antenna further comprises a shorted end formed from the connection of the outer conductor of the coaxial cable to an end of the quarter-wave metal sleeve and a quarter-wave hollow metal tube connected to the inner conductor of the coaxial cable extending from the end of the quarter-wave metal sleeve.

Combination linearly polarized and quadrifilar antenna


Measuring device and method for determining the position of an electrically conductive test object (1) with a noncontacting sensor, in particular an eddy current sensor (2), wherein the test object (1) is adapted for linear reciprocal movement in a predetermined direction. The test object (1) includes a marking (6), and the sensor is arranged transversely to the direction of movement of the test object (1) and at a constant distance from the test object in the region of the marking (6), so that a movement of the test object causes the sensor to produce an at least largely linear signal change over a predetermined measuring range.

The present invention relates to a measuring device and a method for determining the position of an electrically conductive test object with a noncontacting sensor, in particular an eddy current sensor, wherein the test object is adapted for linear reciprocal movement in a predeterminable direction.
Measuring devices and methods of the type under discussion have been known from practical operation in a great variety of designs and configurations, for example, from DE 101 41 764 A1; U.S. Pat. No. 6,762,922; and U.S. Patent Publication No. 2003/0098686. Quite generally, such measuring devices and methods are used to define distances, displacements, or positions relative to any electrically conductive test objects. Typical applications of noncontacting displacement measuring sensors, in particular eddy current sensors, include, for example, the positioning of wafer slices in the semiconductor production, the detection of vibrations or bearing oscillations, or the monitoring of air gaps in magnetic bearings. A specific application of noncontacting displacement sensors, to which the invention relates in particular, is the determination of test objects that linearly reciprocate in one direction, for example, the measurement of immersion depths, or the monitoring of piston strokes or cylinder positions.
In the case of the measuring devices of the prior art, the sensor is generally arranged in the extension of the longitudinal axis of the component being detected, and is aligned parallel to same. Because of the linear reciprocal movement of the component, for example, a cylinder piston, the distance between the end face of the cylinder piston and the sensor increases or decreases in accordance with the actual position of the cylinder piston. When an eddy current sensor is used, differently strong eddy currents are induced in the piston as a function of the distance between the piston end face and the sensor, which results in a corresponding output signal on the eddy current sensor. The output signal varies linearly with the position of the piston. In the case of such arrangements, the relatively long structural forms are often problematic, which applies in particular when only a limited space is available for the measuring device.
Such a situation exists in particular in the case of fuel injectors, as are used, for example, in pump-nozzle injection systems or common-rail injection systems. To monitor and regulate the injection, it has been common practice to measure the movement of the injector needle as described above, toward the closing piston. Disadvantageous in this instance is, on the one hand, the long structural form of the fuel injector, which is not needed for the injection itself. This long structural form is mechanically extremely costly and with that cost intensive both in its manufacture and in its maintenance and care. Furthermore, it is disadvantageous that the position measuring of the injector needle is extremely subjected to tolerances, since the usable measuring point is very small, and since it is extremely difficult and possible only with great adjustment efforts to position the sensor in an exact manner.
It is therefore an object of the present invention to provide a measuring device and a method for determining the position of an electrically conductive test object of the initially described type, which make it possible to determine in a very precise manner the position of a test object with simple constructional means and in a compact structural form.


An aircraft comprises a plurality of spanner bars. Each spanner bar has a pattern of mounting holes separated by lands. A plurality of nut plates engage the spanner bars. Each nut plate includes a body having a mounting surface against one of the spanner bars; and first and second posts extending from the mounting surface and through respective holes in the corresponding spanner bar. Each post has an undercut portion that abuts against one of the lands. Each nut plate further includes a locking member occupying a space between one of the posts and the lands to prevent the nut plate from disengaging the corresponding spanner bar.

Spanner bars and other secondary support structures are commonly used in commercial aircraft for wire bundle management. The spanner bars may be secured to system support brackets, which are attached to primary aircraft structure. Wire support hardware such as p-clamps and ring posts are fastened to the spanner bars. Wire bundles are secured to the wire support hardware.
Wire support hardware may be attached to a spanner bar as follows. The wire support hardware is positioned on a front side of the spanner bar. The threaded portion of a fastener is aligned with a select open hole of the spanner bar and an open hole of the wire support hardware. The fastener is maneuvered through the holes until the threaded portion is exposed on a back side of the spanner bar. A loose washer and nut are placed over the threaded portion, and the nut is tightened with a hand tool until firmly clamped against the spanner bar. This process is repeated for each fastener.
Often, there is no visual sightline to the back side of the spanner bar. Therefore, the nut and washer are installed blindly. Some manual dexterity is needed to install the nut and washer blindly without dropping either part.
It would be desirable to reduce part count and installation time of attaching wire support hardware to a spanner bar. Even a seemingly trivial reduction for a single nut and washer can be significant due to the large number of fastening operations on secondary support structures in a commercial aircraft.

This patent is subject to a terminal disclaimer.


An ion drag vacuum pump is installed in a body, one side of which is connected to and in communication with a sealed chamber. An ion generating device and a positive ion dragging device for dragging positive ions generated by the ion generating device to exhaust gases located near the ions by speeding up the ions is disposed in the body. The positive ions are neutralized by a positive ion neutralizing device. The ion generating device includes a corona electrode as a corona discharger to which a positive voltage is applied, a metal plate as a DC glow discharger to which a positive DC voltage is applied, or a first RF electrode and a second RF electrode to which RF power is applied. The ion dragging device includes a target electrode or a first and a second grids to which a positive and a negative voltage are respectively applied. The ion neutralizing device includes a grounded baffle plate.

There have been developed a number of vacuum pumps which attain a vacuum state inside an enclosure by letting gas molecules collide with and get pumped out by fast moving solid, liquid or gas. One example of such pump is a turbomolecular pump. In order for these pumps to obtain an ultra-high vacuum state, however, these pumps must be provided with a mechanical vacuum pump, e.g., a rotary pump or a roots pump, as a back-up pump, making them structurally complicated.
Furthermore, there have been developed other pump using ion-transport effect, a sputter-ion pump and the like. In the sputter-ion pump, the molecules are ionized by electrons moving in helical path in high magnetic field.
The ions thus generated are accelerated to a cathode made of getter materials like Ti or Ta, and sputter the cathode, forming getter film on an anode. This sputtered getter film then removes gases from the enclosure by binding the gases to the surface. This pump, however, operates only in high vacuum, and needs a roughing pump to start with
Further, there is disclosed a vacuum pump in U.S. Pat. No. 4,641,060, entitled "METHOD AND APPARATUS USING ELECTRON CYCLOTRON HEATED PLASMA FOR VACUUM PUMPING", capable of producing a gas pumping plasma within an evacuated enclosure having a collimating system consisting of baffle plate structures and a magnetic field having a central uniform region connected to a source of neutral gas, a magnetic mirror intermediate region and a terminating divergent region. In this apparatus, a desired vacuum level is attained in an enclosure therein by: evacuating the enclosure to a selected pressure; feeding high frequency microwave energy of a selected power and frequency into the magnetic mirror intermediate region; and establishing the magnetic field at a strength such that an electron cyclotron frequency is made to equal to the frequency of the microwave energy within the intermediate region electrons within the magnetic mirror intermediate region, being heated by the microwave energy, the heated electrons ionizing the neutral gas in the intermediate and central regions for creating and maintaining a pumping plasma. Baffle plate structures are provided between the central and intermediate regions and between the intermediate and terminal regions for permitting unobstructed flow of plasma along the magnetic field lines to the terminal region while restricting inward flow of neutral gas resulting from recombination in the terminal region. The plasma is preferably composed of ionized neutral gas from the central and intermediate regions and an adequate neutral gas concentration is maintained in the intermediate region by controlled supply of make-up gas.
This pump, however, as in the case of turbomolecular pumps, must be equipped with a back-up pump. Further, since it utilizes microwave and a large number of magnets for controlling the plasma flow, it is structurally complicated and expensive to construct.

Korea Research Institute of Standards and Science


A vehicle folding rear view mirror support mechanism having first (15) and second (16) pivotally interconnected support arm means. A first end (15b1) of the first support arm means is pivoted on a mounting bracket (18) for attachment to the vehicle, a second end (15c1) of the first support arm means is pivotally connected with a first end (16b1) of the second support arm means, and a mirror mount (22) is pivotally connected to a second end (16c1) of the second support arm means. The first and second arm means (15, 16) are movable between a retracted reduced width position in which the two arm means are in a side by side substantially parallel relationship and an extended increased width position in which the two arm means are substantially end to end and the mirror mount (22) is supported at its maximum distance from the mounting bracket (18).

This invention relates to folding rear view mirrors for vehicles.
With vehicles such as agricultural or industrial tractors the variety of trailers, implements or attachments which may be drawn behind the tractor is very varied and this presents a problem in providing rear view mirrors which can be easily adjusted between the different width settings that are necessary to provide a clear rear view around the different trailers, implements or attachments which may be used.
One option is a telescoping arrangement as described, for example, in U.S. 2003/0117729, but such arrangements are not simple to adjust if not mechanised and may have penalties in terms of cost and component count. Simpler systems based on pivoting links, described in GB 1 339 123 and U.S. Pat. No. 3,031,929, allow a mirror mount to collapse inwards if an obstacle is encountered but do not support adjustment over a wide range of width settings whilst remaining visible to the user.


There is disclosed a system and method for dynamic stabilization which provides for distraction of the inter-vertebral space while still allowing a patient a substantial range of motion. In one embodiment, an inter-vertebral dynamic brace is used to maintain proper distraction. The dynamic brace is designed to allow the vertebrae to which it is attached to move through their natural arc, maintaining the correct instantaneous center of rotation. An adjustable tensioning device is used to maintain the proper distraction and compression forces to restore and maintain proper kinematics, while allowing the dynamic brace to move through an arc centered with respect to the center of rotation of the portion of the spine between the vertebrae. In one embodiment, a method is provided for adjusting the dynamic brace both with respect to the center of rotation of the vertebrae in both the flexion/extension axis and in the superior/inferior axis.

The skeletal system, particularly the human spine, is a complex structure designed to achieve a myriad of tasks, many of them of a complex kinematic nature. While performing its function, the spine must move into flexion (bending forward) and extension (bending backward). For example, the vertebrae that make up the lumbar region of the human spine move through roughly an arc of 15° relative to its neighbor vertebrae. Vertebrae of other regions of the human spine (e.g., the thoracic and cervical regions) have different ranges of movement. Thus, if one were to view the posterior edge of a healthy vertebrae one would observe that the edge moves through an arc of some degree (e.g., of about 15° if in the lumbar region) centered around an elliptical center of rotation. The inter-vertebral spacing in a healthy spine is maintained by a compressible disc which serves to allow the spine to move through this arc.
In situations (based upon injury or otherwise) where a disc is not functioning properly, the inter-vertebral disc tends to compress, and in doing so pressure is exerted on nerves extending from the spinal cord by this reduced inter-vertebral spacing. Various other types of nerve problems may be experienced in the spine, such as exiting nerve root compression in neural foramen, passing nerve root compression, and enervated annulus (where nerves grow into a cracked/compromised annulus, causing pain every time the disc/annulus is compressed), as examples. Many medical procedures have been devised to alleviate such nerve compression and the pain that results from nerve pressure. Many of these procedures revolve around attempts to prevent the vertebrae from moving too close to each other thereby maintaining space for the nerves to exit without being impinged upon by movements of the spine.
One such attempt is shown in U.S. Pat. No. 6,048,342 (hereinafter "the '342 patent") in which screws are embedded in adjacent vertebrae pedicles and rigid spacers are then sewed between the screws. In such a situation, the pedicle screws (which are in effect extensions of the vertebrae) then press against the rigid spacer which serves to distract the degenerated disc space so as to prevent the vertebrae from compressing the nerves. This works for preventing nerve pressure due to extension of the spine, however when the patient then tries to bend forward (putting the spine in flexion) the posterior portions of at least two vertebrae are effectively tied together and thus can not move through any arc, let alone through 15° of motion desired for some regions of the spine. This not only limits the patient's movements but also places additional stress on other portions of the spine (typically, the stress placed on adjacent vertebrae being the worse), often leading to further complications at a later date.
In some approaches, such as shown in European Patent Publication 01/45,576 A1, a "stop" is placed between spinous processes and the spinous processes are then banded together. This procedure has the same limitations and drawbacks as discussed above for the '342 patent.
In still another attempt to solve the compression problem, a lever arm approach has been attempted, as shown in U.S. Pat. No. 6,290,700, again resulting in the same problems, namely, an effective "welding" of two vertebrae together.
United States Patent Application Publication No. US/2004/002708A1 (hereafter "the '708 publication") with a Publication Date of Jan. 1, 2004 is entitled, "DYNAMIC FIXATION DEVICE AND METHOD OF USE" shows a dynamic fixation device that allows flexion. The device and method of the '708 publication uses a geometric shape to allow flexion but makes no provision for preventing or reducing disc compression during such flexion.

System and method for dynamic skeletal stabilization


A method and apparatus for load step, or instantaneous current spike, mitigation are provided. In the method and apparatus, load steps are mitigated if a computer system a whole is lightly load, which may be determined by the power consumption of the computer system. Further, load steps are mitigated if a number of processor cores capable of inducing a load step is higher than a threshold. The Advanced Configuration and Power Interface (ACPI) performance state of the cores is used to determine a core's potential for generating a load step. A processor core is instructed to mitigate load steps if conditions are met for the mitigation.

FIG. 1 shows a block diagram of an embodiment of a computer system 100. The computer system 100 includes two processors 110, 120. The processors 110, 120 may be any one of a variety of processors such as a central processing unit (CPU) or a graphics processing unit (GPU). For instance, they may be x86 microprocessors that implement x86 64-bit instruction set architecture and are used in desktops, laptops, servers, and superscalar computers, or they may be Advanced RISC (Reduced Instruction Set Computer) Machines (ARM) processors that are used in mobile phones or digital media players. Other embodiments of the processors are contemplated, such as Digital Signal Processors (DSP) that are particularly useful in the processing and implementation of algorithms related to digital signals, such as voice data and communication signals, and microcontrollers that are useful in consumer applications, such as printers and copy machines. Although the embodiment of FIG. 1 includes two processors for illustrative purposes, any other number of processors will be in-line with the described embodiment.
The processors 110, 120 of FIG. 1 may include one or more processor cores 115A-D, 125A-D that form the computational centers of the processors 110, 120 and are therefore responsible for performing a multitude of computational tasks that enable their respective processors 110, 120 to operate. The processor cores 115A-D, 125A-D may include execution units that perform additions, subtractions, and shifting and rotating of binary digits, among many other computations and may also include address generation and load and store units that perform address calculations for memory addresses and the loading and storing of data from memory. The collection of these operations performed by the processor cores 115A-D, 125A-D drives computer applications to run. In some embodiments, a core 115A may include two execution units and two address generation units. However, other embodiments are contemplated in which a core may only have one execution unit or one address generation unit.
As seen in FIG. 1, the processors 110, 120 are connected to a Northbridge 130 device through a processor bus 128. The Northbridge 130 device is part of the computer chipset, which may reside on a different socket than the processors 110, 120 along with a Southbridge device 150. The Northbridge 130 and the Southbridge 150 are connected via a peripheral bus 152 and are connected to system memory 140 via a memory bus 142. In some embodiments, the Northbridge 130 is referred to as a Memory Controller Hub (MCH) and the Southbridge 150 is referred to an Input/Output (I/O) Controller Hub (ICH). The Northbridge 130 and the Southbridge 150 contain logic that allows the processors 110, 120 to communicate with more hardware components. For instance the Northbridge 130 allows the processors 110, 120 to communicate with system memory 140, whereas the Southbridge allows the processors 110, 120 to communicate with peripherals through a Peripheral Component Interconnect (PCI) slot.
The processors 110, 120 of computer system 100 and their cores 115A-D, 125A-D consume electrical power during their operation. This is due to the fact that the transistors within the processors 110, 120 draw electrical current in their regular operation. Further, faster processors (with fast clock cycles) tend to consume more electrical energy in shorter periods of time than their slower counterparts because they require faster operation of electrical circuitry and therefore more consumption of electrical power. Due to their reliance on external power, processors 110, 120 and their processing cores 115A-D, 125A-D cannot operate under all conditions without performance failures. As an example, one type of Advanced Micro Devices (AMD) Phenom™ processor can operate at 2800 megahertz (MHz) and dissipate 140.8 watts of power, while requiring a voltage range of 1.225 to 1.425 volts and a maximum current draw of 102.5 amperes. Functional failures may occur when a processor operates at power, voltage, or current levels that are outside those for which it is designed. Further, power sources or supplies, such as batteries, are often slow to compensate and adjust their power supply to the needs of the processors.
One problem processor cores 115A-D, 125A-D may encounter in their operation is the di/dt problem. The di/dt problem refers to large changes in current draw or consumption by a processor core (e.g. 115A) over a short interval of time. The name di/dt is derived from the symbol for current, i, the symbol for time, t, and the derivative symbol, d, where di/dt represents the variation in current during an interval of time. These variations may cause oscillations in voltage supply and result in performance and functional failures, such as errors in running computer applications.
FIG. 2 shows an instance of a di/dt spike, or load step, as the problem will be referred to interchangeably herein, which occurs in a processor core (e.g. 115A) starting at the sixth clock cycle and lasting through the eighth clock cycle. The spike is due to a sudden need for current by the circuitry of the processor core. The need for current may be the result of abrupt computations that the core needs to perform, such as an application that suddenly requires a lot of computational effort to run, where the electrical circuitry, including transistors, requires much more current than before the application load. The supply voltage effect of the spike is seen in the corresponding voltage graph, where the current spike results in a voltage dip starting at cycle six. At the eighth cycle the voltage supply is below the operating voltage of the processor core. (Here, the operating voltage of the exemplary processor is 1.225 to 1.425 V). After the di/dt spike, the voltage is restored to a level within the operating voltage range.
In the embodiment of the computer system 100 of FIG. 1, the two processors 110, 120 may be connected in parallel to a voltage supply, where all the processor cores 115A-D, 125A-D share the same voltage supply. The processors 110, 120 may experience a voltage sag, or droop, as a result of a di/dt spike in any one of the processor cores 115A-D, 125A-D. The problem may be exacerbated when two or more processor cores 115A-D, 125A-D experience di/dt spikes at the same time. When di/dt spikes occur at the same time, or are in-phase, voltage droops are constructively compounded to result in a larger droop. However, when di/dt spikes occur in two or more processor cores at different times, or are out-of-phase, then voltage supply waves will propagate across the voltage supply grid. Power supplies are sometimes equipped with capacitance and inductance to limit the voltage fluctuations; however, the fluctuations often occur too fast for the voltage supply to adjust its supply.
Therefore, di/dt spikes by one or more processor cores may cause the power supply of a computer system 100 to become unstable. A computer's digital circuitry and logic may not operate properly under all conditions and computational failures will result in the event that operating conditions are violated. These computational failures will result in application and computer program errors that are experienced by a computer user. In extreme cases, terminal failures to the processor cores may occur that will damage the processors and cores.
Accordingly, it is desirable to have a method and apparatus to mitigate the di/dt problem. It is also desirable to have a method and apparatus to mitigate the di/dt problem while not having a significant impact on a computer system's performance.

Load step mitigation method and apparatus


An A/B RF automatic-set-up redundant sensing switch that monitors the relative differences in signal strength of the A and B paths and processes it according to a predetermined logic setting with no manual adjustment. When one of the paths is determined not to match the logic setting, it will switch to the other.

1. Technical Field
The present invention relates to redundant sensing switches. In particular, it relates to an improved RF redundant sensing switch which dynamically switches signal sources based on relative differences between those two sources.
2. Background
RF redundant sensing switches are used in a variety of applications to offer back up redundancy of the same signal in the event of a failure of the primary signal, therefore increasing the reliability of the system. To illustrate how RF redundant sensing switches are used, an example will be discussed which illustrates how these switches are used by cable television systems.
In cable television systems, RF redundant sensing switches are often used in the headends and hubs of cable systems. The RF redundant sensing switches offer redundant paths which can be switched based on signal quality. They can be used in conjunction with any active RF device and/or RF path, such as a redundant optical and/or RF ring architecture by switching between the primary and secondary signal sources on the A/B signal paths.
Conventional systems monitor the level of primary signal source. If an error is detected, the RF redundant sensing switch will switch from the primary signal source to the secondary signal source. Typically, an error is detected when the primary signal disappears completely or drops below a predetermined threshold level.
Alternatively, other conventional systems monitor the secondary signal in addition to the primary and switch from the primary to the secondary signal path only when the secondary signal is above a predetermined threshold level. The threshold levels in the prior art systems do not necessarily have to be the same.

Apparatus and method for an A/B RF redundant sensing switch


An improved interconnect and cross-connect equipment panel for telecommunications apparatus holds jack panel modules (20) with connections to their rear and connector modules (20) with interconnected front and rear connectors. Patch cords (52) are utilized at the rear of the panel to interconnect a jack panel module with a connector module so that telecommunications apparatus connected to the rear of a jack panel module is accessible from the front of a connector module.

This invention relates to a panel for holding interconnect and cross-connect equipment for telecommunications apparatus and, more particularly, to an improved panel of that type wherein connections are accessible at the front of the panel.
U.S. Pat. No. 5,552,962 discloses a jack panel module for the interconnection and cross-connection of telecommunications apparatus. The module has two pairs of connector sets on its rear adapted for electrically coupling the module to first and second telecommunications apparatus. On the front of the module are jacks adapted for electrically connecting, through patch cords, one of the telecommunications apparatus to a third telecommunications apparatus coupled to another module of the same type. In the past, these modules have been installed in brackets attached to frames wherein each bracket can accommodate twenty-four modules arrayed side-by-side. These modules require electrical power and therefore a power panel is also mounted to the frame. The power panel is capable of providing power for several groups of twenty-four modules.
The aforedescribed modules have been used in telephone central offices having aisles at the front and rear of the frames holding the modules, enabling access to cabling or patching on both sides of the modules. However, it is now proposed to utilize these modules in cabinets wherein there is access, after installation, only to the front of the modules. In addition, each of these cabinets can accommodate a maximum of twelve modules. It would therefore be desirable to provide a panel incorporating modules of the type described wherein there is cabling access at the front of the panel.
Since the new panel will only hold twelve modules, the prior art power panel would not be used to its full capacity. It would therefore be desirable to provide a lower capacity power module for a cabinet-mounted panel.

Interconnect and cross-connect equipment panel for telecommunications apparatus


A filtering apparatus fits adjacent to the nostrils and nose of the user and includes a rigid base for retaining a filtering material thereon through which the user may breathe. The filter material takes the form of an open-cell foam, in the form of a pad, which is removably held between retainer members carried on the rigid base. The foam pad includes a peripheral sidewall and defines an open cavity in the thickness thereof. A clamping device included in the base has an upper and lower plate that are joined together by fasteners. A supporting arrangement for facial wearing comprises a pair of elongated ear support members arranged in spaced-apart relationship and joined together to define a pivot or hinge mechanism that is captured beneath the opposing surfaces of the base plates.

1. Field of the Invention
The present invention relates to the field of ambient air filtering, and more particularly to a novel nose filter having a base on which a removable foam pad is retained and which includes a pair of pivotal elongated members adapted to be supported on the ears of a wearer so that the foam pad resides immediately adjacent the nostrils of the nose and wherein the foam is of an open-cell construction permitting the user to breathe while filtering micro-particles of contamination or foreign matter.
2. Brief Description of the Prior Art
In the past, it has been the conventional practice to use facial filters, which generally include a facial mask which is retained on the head of the user by means of tieable strings, elastic bands or a system of straps and buckles. Such a facial mask may cover only the nose or both the nose and mouth, depending on the need of the user. Such a mask is conventionally constructed from an apertured diaphragm, micro-mesh paper construction, a micro-mesh screen or the like. Such filters are not supported except by the attachment means used to hold the filter onto the head of the user.
Problems and difficulties have been encountered with such facial filters, which stem largely from the fact that there is no support for the filter material other than the straps, bands, or elastic which holds the filter material onto the facial area of the user. Such a facial filter cannot readily be removed from the facial area since the filter material has a tenancy to flex and collapse. The facial diaphragm or filter material is not readily supported so that dislodgement or voids between the soft filter material and the skin of the user are experienced permitting contaminated air to creep beneath the filter material into the breathing system of the user.
Therefore, there has been a long-standing need to provide a facial filter, particularly for the nose, which will reside immediately adjacent the nostrils of the user and which mounts the filtering material onto a rigid, non-bendable support that permits ready removal and replacement of the filter material. Means should be provided for mounting the base and the filter material on the facial area of the user employing the user's ears to support spaced-apart, elongated pivotal members, similar to those used on spectacles.


A vehicular burglar-proof system includes (i) a plurality of alarm unit, (ii) a detection unit for detecting movement, opening, and closing of a movable body, and (iii) a control unit connected to the plurality of alarm unit and the detection unit. A predetermined operation of the movable body allows the control unit to turn off the plurality of alarm unit or change the alarm unit into a predetermined alarming state. This structure can provide a user-friendly vehicular burglar-proof system in which an alarming state can easily be selected according to the use.

1. Field of the Invention
The present invention relates to a burglar-proof system for a vehicle used to prevent theft mainly in an automobile.
2. Background Art
Recent years, there has been an increasing number of vehicles each incorporating a vehicular burglar-proof system for preventing theft of articles inside of the body or cabin of a parked vehicle by flashing the headlights or blowing the horn when a door of the vehicle is unlocked or opened/closed by a forged key or tools.
A conventional vehicular burglar-proof system is described with reference to FIG. 5.
FIG. 5 is a block diagram of a conventional vehicular burglar-proof system. In the drawing, lamps (headlights) 1A for radiation of light in the front direction of a vehicle, buzzer 1B installed in the cabin of a vehicle, and alarming horn 1C form alarm unit 1.
Further, the system includes door knob 2A for opening/closing a door, locking knob 2B for locking/unlocking the door, key cylinder 2C for receiving a key when the engine is started. Each of these components has a switch for detecting the movement or opening/closing of the component and form detection unit 3.
Then, these alarm unit 1 and detection unit 3 are electrically connected to control unit 4 of the vehicle formed of electronic components, such as microcomputers, to form a vehicular burglar-proof system.
Cntrol unit 4 has changeover switches each for selecting one from a plurality of alarm unit 1. In FIG. 5, three changeover switches are provided. Changeover switch 41 is a switch for determining whether or not to select lamps 1A as an alarm unit. Changeover switch 42 is a switch for determining whether or not to select buzzer 1B as an alarm unit. Changeover switch 43 is a switch for determining whether or not to select horn 1C as an alarm unit. When a changeover switch is turned on (energized), a predetermined alarm unit is selected. When a changeover switch is turned off (not energized), a predetermined alarm unit is not selected. In FIG. 5, only horn 1C is selected by changeover switch 43 as an alarm unit.
In a vehicle incorporating a so-called keyless entry system in which a driver holds a card or a portable unit including a key (not shown) and locks/unlocks doors by communication between the card or the portable unit and a vehicle, a communication unit (not shown) for communicating with the portable unit held by the driver is provided in the vehicle. The communication unit is connected to a drive unit (not shown) for operating locking knob 2B, such as a motor, and to control unit 4.
To prevent theft, predetermined alarming states, such as flashing lamps 1A, sounding buzzer 1B, and blowing horn 1C, are set in control unit 4.
In the above structure, when a driver operates the portable unit, or goes at a predetermined distance away from the vehicle after getting off the vehicle and closed the door, an inherent code is transmitted, as a radio signal, from the portable unit to the vehicle. Then, the communication unit in the vehicle receives the code and determines if it is a correct code inherent to the vehicle or not. When the code is correct, the drive unit, such as a motor, operates locking knob 2B and locks the doors.
When a driver comes near to the vehicle and operates the portable unit, or enters within a predetermined range of distance from the vehicle, the portable unit transmits a radio signal similarly. Then, the communication unit receives the signal, and the doors are unlocked.
Further, when a driver leaves a parked vehicle with its doors locked, and a person other than the driver opens/closes or unlocks one of the doors using a forged key or tools, detection unit 3 detects that the door is opened/closed, door knob 2A is operated, or locking knob 2B is unlocked even though communication is not made between the communication unit and the portable unit. Control unit 4 detects this detection.
Then, control unit 4 operates to provide a predetermined alarming state, such as blowing horn 1C. This draws attention of surroundings and prevents theft in a parked vehicle.
Known as one of prior art references of this application is Japanese Patent Unexamined Publication No. H07-47928.
However, in the conventional vehicular burglar-proof system, the alarming state is predetermined, such as blowing horn 1C only. For this reason, to select individual alarming states according to the use of the driver of a vehicle, the changeover switches of alarm unit, i.e. lamps 1A, buzzer 1B, and horn 1C, are required. This increases the number of constituent components of the burglar-proof system. Further, because changeover switches are generally provided in obscure and user-unfriendly positions, changeover requires a large labor.

Matsushita Electric Industrial Co., Ltd.


An electrical connector (100) for accommodating an electrical device, and includes a shielding member (3), a terminal block positioned adjacent to the bottom of the shielding member (3), a number of terminals (2) received in the terminal block (1). The shielding member (3) includes a first wall (31), a second wall (32), a third wall (33) and a fourth wall (34) connecting with one another in turn, the terminal block (1) mainly extends along a first direction and is positioned adjacent to the bottom of the shielding member (3), the terminals (2) are assembled to the terminal block (1) and extends to a second direction perpendicular to the first direction. The terminal block (1) extends between the fist wall (31) and the third wall (33) of the shielding member (3) and engages with the first wall (31) and the third wall (33) of the shielding member (3) along the first direction without contact with the second wall (32) and fourth wall (34), the terminal block (1) comprises latch means (14), and the first wall (31) and third wall (33) respectively provide an engaging portion (312) corresponding to the latch means (14).

1. Field of the Invention
The present invention relates to an electrical connector, and particularly to an electrical connector used for a mobile phone or other electrical devices having different designs and configurations.
2. Description of the Prior Art
With the rapid development of the technology of wireless communication and advanced technology of electrics, electronic consuming products such as mobile phone, Personal Digital Assistant (PDA) etc., are designed to comply with miniaturization trend and multiple functions, such as mounting a camera thereon, to meet with requirements of human. As a result, socket connectors for accommodating the cameras therein are correspondingly demanded.
Usually, these electrical connectors used for accommodating and electrically connecting the cameras with the consuming products each provides an insulatvie housing, a shielding member assembled to the insulative housing, and a plurality of terminals engaged with the insulative housing. Please refer to FIG. 1, a conventional electrical connector 1′ shown therein comprises a rectangular shielding member 30′ defining a receiving space, an insulative housing 10′ positioned on the bottom of the shielding member 30′, and a plurality of terminals 20′ assembled to receiving passageways 11′ of an insulative housing 10′ which is received in the bottom portion of the receiving space. Each wall of the shielding member 30′ respectively defines a pair of locking barb 301′ at two sides thereof, and the insulative housing 10′ defines a plurality of locking slots 101′ corresponding to the locking barbs 301′. In process of assembling the insulative housing 10′ and the shielding member 30′, the locking barbs 301′ are insert into the locking slots 101′, and then the tapered protrusions of the locking barbs 301′ lock with the locking slots 101′. However, it requires the insulative housing have enough thickness to ensure the reliability of engagement with the shielding member 30′ in this way. The insulative housing results in high profile of the connector along the mating direction, and thus increases the thickness of the consuming products. The insulative housing 10′ even may disengage from the shielding member 30′ when large force is exerted thereto and thus, damage the electrical connection. Furthermore, the large profile housing goes against the trend of cost down.
Hence, an improved electrical connector is desired to overcome the disadvantages of the prior art.


An automated speech recognition filter is disclosed. The automated speech recognition filter device provides a speech signal to an automated speech platform that approximates an original speech signal as spoken into a transceiver by a user. In providing the speech signal, the automated speech recognition filter determines various models representative of a cumulative signal degradation of the original speech signal from various devices along a transmission signal path and a reception signal path between the transceiver and a device housing the filter. The automated speech platform can thereby provide an audio signal corresponding to a context of the original speech signal.

1. Field of the Invention
The present invention generally relates to automated speech recognition ("ASR") methods and systems. The present invention particularly relates to ASR methods and devices for providing an input speech signal to an ASR platform that approximates an original speech signal.
2. Description of the Related Art
An ASR platform as known in the art is designed to respond to a reception of a transmitted speech signal (e.g., voice commands) from a transceiver (e.g., mobile phones, embedded car phones, and phone enabled personal data assistants) with an audio signal that corresponds to the context of the transmitted speech signal. However, the performance of prior art ASR platform is adversely affected by any signal degradation of the transmitted speech signal (e.g., acoustical coupling and signal distortion) along a transmission signal path from a user of the transceiver to the ASR platform. Prior art attempts to minimize, if not eliminate, any signal degradation of the transmitted speech signal have generally proven to be unacceptable. The present invention addresses this problem.


A purification process of crude methacrylamide by recrystallization from an aqueous methacrylamide solution, comprising the steps of conducting crystallization by adjusting the hydrogen ion concentration of the aqueous methacrylamide solution to pH 8 or more, separating a methacrylamide crystal, adjusting 5% by weight or more of resulting mother liquor to pH 5 or less, separating precipitated insoluble matter, and reusing thus-treated mother liquor, is provided.. The high quality methacrylamide crystal thus obtained is excellent in Hazen number, purity and transparency of a methanol solution and suitable for uses such as windshield glasses.

a) Field of the Invention
The present invention relates to a process for preparing high purity methacrylamide suitable for use in modifiers in the field of windshield glasses, photographic films and coagulating agents by purification of an aqueous crude methacrylamide solution.
b) Description of the Prior Art
Many processes have been known for the preparation of methacrylamide.
These processes are, for example, a process for reacting acetone cyanhydrin (hereinafter referred to as ACH) with sulfuric acid and neutralizing the resulting methacrylamide sulfate to obtain methacrylamide; and a process for hydrating methacrylonitrile to obtain methacrylamide.
The methacrylamide prepared by the above processes are satisfactory for use in the field of fiber modifiers and the raw material for preparing emulsion of coating and adhesive.
The above methacrylamide, however, cannot be used in view of quality for windshield glasses and other applications. High degree of transparency is required for many resin products used for these applications, and hence contamination of a trace amount of impurity such as polymer leads to serious deterioration of quality in these products.
Purification steps are required for preparing the high purity methacrylamide and recrystallization is the most practical process of purification. As a recrystallization process, for example, Japanese Patent 50666 (1984) (U.S. Pat. No. 4,465,856) discloses crystallization under alkaline conditions.
However, in the purification of methacrylamide by recrystallization, the mother liquor obtained by separating the crystal is preferably recycled as a raw material to the next crystallization step. Repeated recycling leads to a problem of rapid deterioration in the quality of methacrylamide.
In order to inhibit deterioration of quality, the mother liquor is often treated with activated carbon. The treatment, however, cannot maintain satisfactory quality of methacrylamide and a portion of the mother liquor must be discharged out of the system.


An aggregation of crystals extending long in the scanning direction (a long crystal grain region) is formed when a continuous wave laser oscillator (a CW laser oscillator) is employed for annealing the semiconductor film in the manufacturing process of a semiconductor device. The long crystal grain region has a characteristic similar to that of single crystal in the scanning direction, but there is restriction for high integration because of the small output of the CW laser oscillator. pa In order to solve the problem, a pulsed laser beam 1 having a wavelength absorbed sufficiently in the semiconductor film is used in combination with a laser beam 2 having a high output and having a wavelength absorbed sufficiently in the melted semiconductor film. After irradiating the laser beam 1 to melt the semiconductor widely, the laser beam 2 is irradiated to the melted region. And then the laser beam 2 and the semiconductor film are moved relatively while keeping the melting state so as to form the long crystal grain region. The laser beam 2 keeps to be irradiated to the semiconductor film until the laser beam 1 is irradiated, and the output of the laser beam 2 is attenuated when the laser beam 1 is irradiated so as not to give the energy more than is needed so that the very uniform laser annealing becomes possible. Thus the long crystal grain region having a width 10 times as broad as the conventional one can be formed.

1. Field of the Invention
The present invention relates to a laser irradiation method and a laser irradiation apparatus to perform the laser irradiation (the laser irradiation apparatus includes a laser oscillator and an optical system to guide a laser beam emitted from the laser oscillator to an object to be irradiated.). In addition, the present invention relates to a method for manufacturing a semiconductor device using the laser irradiation method and the laser irradiation apparatus to perform the laser irradiation. It is noted that the semiconductor device described in this specification includes a general device that can be operated by utilizing the semiconductor characteristic. And thereby a computer, an electro-optical device and the like having the semiconductor device as its component are also included in the semiconductor device.
2. Description of the Related Art
In recent years, research has been extensively conducted on the technology to crystallize an amorphous semiconductor film formed over an insulating substrate such as a glass substrate and to form a semiconductor film having a crystal structure (hereinafter referred to as a crystalline semiconductor film). As the crystallizing method, a thermal annealing method using an annealing furnace, a rapid thermal annealing method (RTA method), a laser annealing method and the like have been examined. It is possible to employ one of these methods or a combination of these methods in crystallization.
The crystalline semiconductor film has a much higher mobility than the amorphous semiconductor film. Therefore, the crystalline semiconductor film is utilized for forming a thin film transistor (TFT), and is further utilized for an active matrix liquid crystal display device and the like with TFT for a pixel portion or both TFT for the pixel portion and TFT for a driver circuit formed over one glass substrate.
Usually, in order to crystallize the amorphous semiconductor film in the annealing furnace, the heating process needs to be performed at a temperature of not less than 600° C. for 10 hours or more. It is quartz that is suitable for a material of a substrate applicable for this crystallization, but a quartz substrate is expensive and is very difficult to be processed into a large substrate. Enlarging the size of the substrate is considered to be one of the means to increase production efficiency, and that is why the research has been done to form a semiconductor over a glass substrate which is inexpensive and which can be easily processed into a large substrate. Recently, it has been examined to use the glass substrate with a side of 1 m or more.
As an example of the research, the thermal crystallization method with metal element disclosed in the published unexamined patent application no. H7-183540 makes it possible to lower the temperature of crystallization that has been regarded as a problem in the conventional method. According to the thermal crystallization method with metal element, the crystalline semiconductor film can be formed by adding a minute amount of nickel, palladium, lead or the like to the amorphous semiconductor film and then heating it at a temperature of 550° C. for four hours. The temperature of 550° C. is lower than the distortion temperature of the glass substrate, and thereby it is not necessary to worry about its deformation and the like.
On the other hand, the laser annealing method makes it possible to give high energy only to the semiconductor film without increasing the temperature of the substrate. Therefore, the laser annealing method is attracting attention because this method can be employed not only to the glass substrate whose distortion temperature is low, but also a plastic substrate and the like.
An example of the laser annealing method is explained as follows. A pulsed laser beam generated from a pulsed laser oscillator, typically an excimer laser, is shaped into square with several centimeters on a side or linear having a length of 100 mm or more on a surface to be irradiated and the laser beam is moved relatively to the object to be irradiated to perform annealing. It is noted that "linear" here does not mean a line strictly but means a rectangle (or an oblong) with a large aspect ratio. For example, linear indicates a rectangle with an aspect ratio of two or more (preferably from 10 to 10000), which is included in a laser beam that is rectangular in shape at the surface to be irradiated (rectangular beam). The laser beam is shaped into linear in order to secure energy density for sufficient annealing to the object to be irradiated though the laser beam may have the rectangular shape or a planar shape when sufficient annealing can be performed to the object to be irradiated.
The crystalline semiconductor film thus manufactured has a plurality of crystal grains assembled and a position and a size of each crystal grain are random. TFT formed over the glass substrate is formed by patterning the crystalline semiconductor film into island shape in order for isolation. In such a case, it was not possible to form the crystal grains as specifying their positions and sizes. Compared to the inside of the crystal grain, the boundary between the crystal grains (crystal grain boundary) has an amorphous structure and an infinite number of recombination centers and trapping centers existing due to crystal defects. It is known that when a carrier is trapped in the trapping center, potential of the crystal grain boundary increases to become a barrier against the carrier, and therefore a current transporting characteristic of the carrier is lowered. Although the crystallinity of the semiconductor film in a channel forming region has a serious influence on characteristics of the TFT, it was almost impossible to form the channel forming region with a single-crystal semiconductor film by eliminating such an influence of the crystal grain boundary.
Recently, attention has been paid to the technique of irradiating continuous wave (CW) laser beam to a semiconductor film while scanning the CW laser beam in one direction to form a single-crystal grain extending long in the scanning direction. A region in which such single-crystal grains are assembled is referred to as a long crystal grain region in this specification. It is considered that it is possible, with this technique, to form a TFT that has almost no crystal grain boundary at least in the channel direction thereof. (for example, US published patent application 2002/0031876 A1).
However, in the crystallizing method using the CW laser oscillator, when a CW YAG laser is used for example, since the CW laser beam having wavelengths absorbed sufficiently in the semiconductor film is utilized, the CW laser beam had to be converted into a harmonic. Therefore, only the laser oscillator that outputs as low as 10 W is utilized, and it is inferior to the excimer laser in terms of productivity. When the CW laser oscillator having a wavelength of 532 nm with an output of 10 W is used to crystallize the semiconductor film having a thickness of about 50 nm, a size of the beam spot has to be made as small as 10−3 mm2 approximately, for example. Here, the output means a power of the laser beam, which is energy per unit time. On the other hand, when an excimer laser is employed, the beam spot can be made as large as 1 cm2. It is noted that the CW laser oscillator with high output, having a wavelength not longer than that of visible light and having a considerably high stability is appropriate in this method. For example, a second harmonic of a YVO4 laser, a second harmonic of a YAG laser, a second harmonic of a YLF laser, a second harmonic of a YAlO3 laser, an Ar laser and the like are applicable. Although the other higher harmonics are applicable for the annealing, they have a disadvantage of small output. It is the object of the present invention to decrease the disadvantage in productivity to a large degree as keeping the advantage of the crystallizing technique using the CW laser oscillator.

Laser irradiation apparatus, laser irradiation method, and method for manufacturing semiconductor device

Semiconductor Energy Laboratory Co., Ltd.


Some embodiments provide a method for associating data message flows from applications executing on a host computer with network interfaces of the computer. The method of some embodiments identifies a set of applications operating on a machine executing on the host computer, identifies candidate teaming policies for associating each identified application with a subset of one or more interfaces, and generates a report to display the identified candidate teaming policies per application to a user. In response to user input selecting a first teaming policy for a first application, the method generates a rule, and distributes the rule, to the host computer to associate the first application with a first subset of the network interfaces specified by the first teaming policy. Similarly, in response to user input selecting a second teaming policy for a second application executing on the machine, the method generates a second rule, and distributes the second rule, to the host computer to associate the second application with a second subset of the network interfaces specified by the second teaming policy.

Port uplink profiles allow users to consistently configure identical capabilities for network adapters across multiple hosts. Today, all the application running on a single virtual machine share common teaming policy irrespective of whether the applications include a mix of high and low priority applications. For high priority traffic, users would often like load-balancing teaming policy, while for other applications, they may prefer other teaming policies, such as failover policies. But this kind of flexibility does not exist today, when high and low priority applications execute on one machine as the teaming policies are defined at a machine level, and not an application level.
Also, datacenter tools today provide a de-centralized way of managing teaming policies. At the present, an administrator can configure and apply a teaming policy at a host level, or a logical switch level, with the logical switch being implemented by multiple software switches executing on multiple host computers. Under this approach, when a customer wants to modify the teaming policy, then he has to identify or keep track of the teaming policies for each logical switch level on each host computer, and then apply this change. In high volume datacenters this is inefficient and not a scalable approach.

Teaming applications executing on machines operating on a computer with different interfaces of the computer


The present invention provides an array substrate, its manufacturing method, and a display device. The array substrate comprises a gate metal layer, a gate insulating layer, a source/drain metal layer, first common electrode lines arranged on an identical layer to the gate metal layer, a first via hole arranged in the gate insulating layer and corresponding to the first common electrode line, a source/drain metal filling part arranged within the first via hole, a second via hole in communication with the first via hole, and a transparent connection part. The first common electrode lines are, by means of the transparent connection part and the source/drain metal filling part, in electrical connection with each other through the second via hole. According to the present invention, it is able to reduce the depth of the via holes in the array substrate, and improve the uneven diffusion of an alignment layer.

Referring to FIG. 1, which is a schematic view showing a thin film transistor array substrate in the prior art, the thin film transistor array substrate comprises common electrodes 102, gate lines 103, common electrode lines 104, and data lines 105. The common electrode lines 104 are connected to the common electrodes 102, so as to reduce the resistance of the common electrodes 102.
A method for manufacturing the thin film transistor array substrate with the above-mentioned structure comprises the following steps:
S11: forming the common electrodes on a substrate;
S12: forming a gate metal layer and the common electrode lines on the substrate with the common electrodes by a one-time patterning process, the gate metal layer including gate electrodes and gate lines;
S13: forming a gate insulating layer on the substrate with the gate metal layer and the common electrode lines;
S14: forming an active layer on the substrate with the gate insulating layer;
S15: forming a source/drain metal layer on the substrate with the active layer, the source/drain metal layer including source/drain electrodes and data lines;
S16: forming a passivation layer (PVX) on the substrate with the source/drain metal layer, and a via hole penetrating through the passivation layer and the gate insulating layer; and
S17: forming, on the substrate with the passivation layer, a pixel electrode layer, a first connection part for connecting pixel electrodes to the drain electrodes and a second connection part for connecting the adjacent common electrode lines on the gate metal layer.
Referring to FIG. 2, which is a schematic view showing a connection mode of the common electrode lines on the gate metal layer in the prior art. FIG. 2 includes: the substrate 101, the common electrode lines 104 arranged on an identical layer to the gate metal layer, the gate insulating layer 106, the passivation layer 107, the via holes 108 in the passivation layer, and the second connection part 109 arranged on an identical layer to the pixel electrode layer.
As shown in FIG. 2, the via hole 108 formed in the passivation layer 107 is relatively deep, so a rough surface will occur at the via hole 108, and an alignment layer (PI) will diffuse unevenly, thereby the image quality of a display panel will be affected seriously. For example, such undesirable phenomena as black Mura of the alignment layer at the periphery of the display panel, and M24 defects (with a plurality of vertical, linear Mura, blackening in the middle and whitening at both sides) and white spots (with discontinuous, dot-like black points) within a pixel region, will occur.
Hence, such problems as how to reduce the depth of the via holes in the array substrate and improve the uneven diffusion of the alignment layer urgently need to be addressed.

Array substrate, its manufacturing method, and display device

BEIJING BOE DISPLAY TECHNOLOGY CO., LTD.