A deadbolt door lock assembly operates a deadbolt between an unlocked and locked position. It generally comprises an actuator, a ring, and a biasing member. The ring contacts the actuator and rotates it in either a clockwise or counter-clockwise direction to lock the deadbolt. Once the deadbolt is locked, the biasing member urges the ring out of contact with the actuator. In one aspect, the assembly is operable in either the clockwise or counter-clockwise direction without disconnecting the biasing member. In another aspect, the biasing member includes different portions to urge the ring out of contact with the actuator depending on whether ring operation is in a clockwise or counter-clockwise direction. The assembly may include a backstop to indicate rotational direction of the ring to lock the deadbolt. The assembly may also include a stabilizing bridge to inhibit transverse rotation of mounting screws that secure the assembly to a door.

This invention relates to deadbolt door lock assemblies, and in particular to such a door lock assembly in which the deadbolt is configured for keyless operation to lock the deadbolt.
Deadbolt door lock assemblies are commonly installed on entry doors of commercial and residential buildings to lock the doors closed and to provide increased security against unwanted entry. In such lock assemblies, a deadbolt is selectively positionable between an unlocked position and a locked position. In the unlocked position, the deadbolt is recessed into the door, allowing the door to open. In the locked position, the deadbolt extends out from the door for disposition within an opposing door frame jamb (when the door is closed), thereby locking the door closed.
Single cylinder and double cylinder deadbolt lock assemblies may be used. Both generally include an oscillating crank to actuate the deadbolt between the unlocked and locked positions. In the single cylinder assembly, a torque blade connects the crank to a thumbturn mounted on the inside facing surface of the door (e.g., accessible from within the building) and to a lock cylinder accessible from the outside surface of the door. The thumbturn can be manually turned or a key can be used to operate the lock cylinder to rotate the torque blade and actuate the deadbolt between its unlocked and locked positions. In the double cylinder assembly, the torque blade operatively connects the crank to two lock cylinders, one on each of the inside and outside surfaces of the door. Keys are used with both lock cylinders to operate the deadbolt.
While it is known that deadbolt door locks provide improved security, people often do not use them after closing the door from outside because it requires finding the correct key to operate the lock cylinder. To remedy this, some deadbolt lock assemblies allow keyless locking operation from outside the door to lock the deadbolt. Examples are disclosed in U.S. Pat. No. 3,593,548 (Kendrick), U.S. Pat. No. 5,010,749 (Lin), U.S. Pat. No. 5,150,592 (Lin), U.S. Pat. No. 5,186,030 (Lin), and U.S. Pat. No. 5,797,286 (Armstrong). These deadbolt door lock assemblies typically include a ring surrounding the lock cylinder in operative connection with the torque blade to actuate the deadbolt to its locked position without having to use a key.
One drawback of these prior deadbolt door lock assemblies is that they are susceptible to binding or jamming during subsequent unlocking of the deadbolt. In particular, the ring tends to interfere with the rotation of the torque blade back to a position corresponding to the unlocked position of the deadbolt. In addition, the force necessary to overcome binding of the lock accelerates wear of the internal mechanisms of the assembly. Another disadvantage of some prior keyless deadbolt lock devices is that projection of the deadbolt may be dependent on the rotational speed imparted by the user to the ring. In such a design, the deadbolt may not fully project to its locked position, leaving the lock easily retracted without a key.
To this end, co-assigned U.S. Pat. Nos. 5,813,261 and 6,601,420, the entire disclosures of which are incorporated by reference herein, disclose keyless deadbolt door lock assemblies that inhibit binding upon unlocking of the deadbolt. In particular, the keyless ring is used to actuate the torque blade to move the deadbolt to its locked position, and is then returned to its initial position by a biasing member so that the ring cannot interfere with subsequent movement of the torque blade (e.g., by using a key) back to the unlocked position of the deadbolt.
However, the lock assemblies disclosed in these references are generally useable on only a left hand door or a right hand door. Thus, two different models must be made available (one for use with a left hand door and one for use with a right hand door). Alternatively, the disclosed lock assembly may be disassembled, substantially reconfigured and reassembled to switch from use on a left hand door to use on a right hand door (or vice-versa).
There is a need, therefore, for a keyless deadbolt door lock assembly which is operable on either a left hand door or a right hand door with little or no reconfiguration, and is less susceptible to binding during unlocking of the deadbolt.


A communion cup filler apparatus that fills a full tray of serving cups simultaneously within several seconds. Each of a plurality of serving cups is positioned in an associated aperture in the tray. A distributor is attached above a base. The distributor includes a plurality of sloped polygon shapes, wherein each polygon shape includes an outlet hole; The tray is aligned between the base and distributor. A liquid is poured onto the distributor and is evenly divided among the serving cups.

Many churches serve communion on a weekly or monthly basis. Typically, these chuches utilize a communion tray that holds approximately forty individual communion cups. Each communion cup would hold approximately ⅓ fluid ounce of liquid. To manually fill each communion cup is a time consuming process.
An example device to fill an entire tray with one pour is disclosed in U.S. Pat. No. 3,196,909, entitled "Communion Glass Filler", issued Jul. 27, 1965. This device includes a substantially flat distributing pan with circular grooves that match the communion cup pattern. It also includes a plurality of radially extended grooves to interconnect the circular grooves. Formed in the trough of each of the concentric circular grooves are recesses which contain a hole to match the communion cup pattern.
Another example device to fill an entire tray with one pour is disclosed in U.S. Pat. No. 5,092,378, entitled "Communion Cup Filler", issued Mar. 3, 1992.
An example device to divide liquid equally among multiple containers is disclosed in U.S. Pat. No. 8,474,493, entitled "Liquid Apportionment Device", issue Jul. 2, 2013.
The disclosure of each of the above-cited U.S. patents is incorporated by reference herein.

Communion cup filler apparatus and method


An information processing apparatus, as a recording apparatus, formulates a Clip Information file of a still picture file (TS file), made up by plural still pictures, and a PlayList, composed of plural PlayItems, indicating the replay path of a slide show, and records the information on a DVD along with the TS file. The Clip Information file has an EP_map, as a table indicating the relationship of correspondence between the value of the presentation time stamp PTS of the transport stream TS and the source packet number SPN in the TS the PTS value indicates. The information processing apparatus, as a reproducing apparatus, reads out and reproduces the data address of the TS, represented by the replay start time IN_time and the replay end time OUT_time of the PlayItem.

The DVD video format has realized continuous reproduction of still pictures (so-called slide show). The respective still picture signals are encoded to an intra-frame picture (I-picture) of the MPEG2 (Moving Picture Experts Group 2) video and multiplexed in a MPEG2 program. By multiplexing the I-pictures with audio data and sub-pictures into an MPEG2 program stream, the audio data and the sub-pictures may be synchronized and reproduced in the slide show. This slide show is reproduced at a preset timing based on the presentation time stamp.
The program stream for the DVD video has a structure with a VOBU (video object unit) as a unit. This conventional DVD data structure is described in, for example, the Japanese Laid-Open Patent Publication H10-271444. FIG. 1 hereof schematically shows the structure of a DVD video program stream of the conventional example 1. Referring to FIG. 1, the DVD video program stream is managed in terms of the VOBS (video object set) as a unit, which is used as a unit in, for example, a workpiece of a motion picture. This VOBS is composed of plural video objects (VOB), and is a unit of data recorded as a set or a group on a disc. The VOB is composed of plural cells, each being a unit for a scene or a cut in, for example, the motion picture. Each cell is composed of plural VOBUs (video object units). The VOBU has the duration of 0.4 to 1.2 second in terms of the moving picture. In this VOBU, there are contained one or more GOPs (groups of pictures) of the MPEG2 format.
The VOBU includes a Navigation pack (N-PCK), as a pack including the management information of VOBU. This Navigation pack is placed at the leading end of each VOBU. The Navigation pack includes VOBU_SRI (VOBU Search Information) and SP_SYNCA. The VOBU_SRI includes a leading address of VOBU reproduced in N seconds (N being an integer) before and after the replay time of VOBU containing the VOBU_SRI. The SP_SYNCA includes the address information of the sub-picture reproduced in synchronism with the video of the VOBU containing the SP_SYNCA. In reproducing e.g. a motion picture, this Navigation pack is first read in and replay is carried out based on the management information specified by the Navigation pack.
The VOBU includes, in addition to this NV_PCK, a video pack (V_PCK), as a pack having the main picture, an audio pack (A_PCK)A, as a pack including the speech data, and sub-picture pack (SP_PCK) S, as a pack including the sub-video data. The V_PCK, A_PCK and SP_PCK are compressed in a preset format, such as MPEG2, and recorded in this form on the recording medium. The VOBU may be exemplified by VOBU1 including a video pack shown for example in FIG. 1 (containing data of one I-picture and Sequence_end_code) and VOBU2 not containing the video pack.
The VOBU, used in the slide show, may not contain the video pack (Video pack containing the MPEG2 video). With the VOBU not containing the video pack, for example, VOBU2 in FIG. 1, the video still from the previous VOBU is continued. The time duration of the continuation of the still display of the I-picture may be controlled by the navigation command.
The program stream of the DVD audio basically has the same structure as the structure shown in FIG. 1. The DVD audio format implements the mode (Browsable slide show) in which the audio replay is asynchronous to the progress of the slide show. In the Browsable slide show, if the user commands the player to proceed to the display of the next still picture by e.g. a remote controller, such that the still display time of each still picture is varied, audio replay is not interrupted, such that audio data is reproduced continuously. Thus, in the DVD audio, there is such a mode in which video replay is not synchronized to the audio replay.
Meanwhile, data of the format different from that of FIG. 1 is stated in the Japanese Laid-Open Patent Publication 2002-158972, filed previously in the name of the present inventors. This Publication is referred to below as a prior-art example 2. The application format of data recorded in the information processing apparatus disclosed in this prior-art example 2 has two layers, namely the PlayList and Clip, for management of the AV stream. The PlayList in the PlayList layer is referenced solely by the user who may refer to the PlayList to reproduce and edit data, such as video data. On the other hand, the Clip layer is used when the player reproduces the AV stream specified by the PlayList. Here, an AV stream and the subsidiary information of the AV stream, paired together, is one object, which is managed in terms of a Clip as a unit. An AV stream file is termed a Clip AV stream file and its subsidiary information is termed the Clip Information file. The Clip AV stream file and the Clip Information file are discretely recorded on a recording medium. The data management is facilitated by discretely recording and supervising the stream data and its subsidiary information.
However, with the data form shown in FIG. 1, the address information is embedded in the MPEG program stream, so that readout becomes time-consuming. That is, in determining the readout address of the still picture, stream data is read out from the disc, the data is analyzed by a host CPU of the player, and the address of the access point of the still picture is subsequently determined, thus protracting the readout operation. If the slide show may be realized using the format similar to that of the audio video data as stated in the aforementioned prior-art example 2, data management may be facilitated, while a recording and/or reproducing apparatus of an analogous structure may conveniently be employed.

Information processing device, information processing method and program, and recording medium


A fracturing fluid mixture is used to hydraulically fracture underground formations in a reservoir, by mixing at least natural gas and a base fluid to form the fracturing fluid mixture, and injecting the fracturing fluid mixture into a well. Within the fracturing fluid mixture, the natural gas composition and content are selected such that a recovered gas component of a well stream is within the inlet specification of an existing gas processing facility, and the well stream has a wellhead flowing pressure that is sufficient to flow the well stream to surface, or have a flowing pressure that meets capture system inlet pressure requirements of the processing facility. The wellhead flowing pressure or the flowing pressure at the capture system inlet can be increased by adding natural gas to the fracturing fluid, which has the effect of reducing the bottom hole flowing pressure.

When employing hydraulic fracturing to fracture a hydrocarbon formation in an underground reservoir, large quantities of liquids and proppant materials are injected into the reservoir. At the end of the fracturing treatment, the fracture system and reservoir are completely saturated with the fracturing fluid. To be produced, oil and gas must either flow around or through the fracture fluid saturated rock and fracture system such that the fracture fluid must be sufficiently removed from the pathway in order to not impair flow. To remove the fracturing fluids from the reservoir and fractures, a pressure differential is induced within the wellbore to draw the fracturing fluids out of the reservoir and fractures. In this manner the fracturing fluids are removed, or flowed back until sustained, stable and sufficient oil and gas production is achieved.
Once the well is placed on production, the flow of native reservoir fluids is directed from the well to a processing facility where the produced fluids are processed to a suitable specification for sales or reuse in some manner. Processing at the processing facility for natural gas may include liquids separation, dehydration, natural gas liquids capture, compression, plus contaminates removal for components such as carbon dioxide, nitrogen, sulfur, hydrogen sulfide and oxygen. The processing facility can be located in the vicinity of the wellbore or a remote location and fluidly coupled to the wellbore by a pipeline. Further, the processing facility may be applied to process native reservoir fluids from a single well, or multiple wells.
The processing facility is typically configured with the capacity and capability to process a fluid composition of primarily native reservoir fluids and at a prescribed inlet pressure, but this configuration is typically not suitable for processing a composition that includes well effluent such as fracturing fluids or the inlet pressures available during fracture fluids recovery. Most commonly, due to capacity and capability limitations of processing facilities, recovery of the injected fracturing fluids is accomplished by simply opening the well to atmosphere. Common to post-fracturing recovery, the water and proppant components of the effluent are separated from the gas component by temporary fracturing flow back equipment primarily comprised of a choke to control pressure, phase separation for solids, liquids and gases, storage and or processing for the liquids and a vent or flare to atmosphere as an outlet for the gas stream. The flow back equipment is often comprised of an open-ended conduit directing flow to a pit where the liquids and solids are separated and captured within the pit while gases are vented or burned to atmosphere. This technique maximizes the pressure differential induced within the wellbore to draw the fracturing fluids out of the reservoir plus eliminates the complexities, costs, upsets and damage that may be encountered by attempting to direct the post-fracture well stream to the production facilities.
For example consider a well which produces at least natural gas and has had nitrogen energized water based fracturing treatment completed. The processing facility has been configured to process the native well stream, which generally contains at least natural gas with 25 lb/MMscf water, 7 vol % carbon dioxide, 1 vol % nitrogen, 0 vol % sulfur, hydrogen sulfide and oxygen and with a heating content of 1025 Btu/ft3, all of which is to enter the processing facility at a minimum pressure of 75 psig. The processing facility is then configured to process this native gas to a sales specification with a target composition and condition not exceeding 7 lb/MMscf for water, 2-3 vol % for carbon dioxide, 3 vol % for nitrogen, 50 mg/m3 of sulfur, 15 mg/m3 of hydrogen sulfide and 0.4 vol % of oxygen with a heating value in the range of 950 to 1150 Btu/ft3 at an outlet pressure of 600 psi. As such, the processing facility is configured with capacity to remove at least 20 lb/MMscf water, through a dehydration process, and 5 vol % carbon dioxide, through an amine carbon dioxide capture system, from the native natural gas, and then compress the natural gas to the required outlet pressure of 600 psig. The facility will not be configured to remove nitrogen, sulfur, sulfur dioxide, or oxygen from the native gas, or to modify the heating content; as these components of the native natural gas are within sales specification. Following the fracturing treatment and during the flow back stage, the well is flowed to remove the fracturing fluids from the reservoir. This is completed using temporary fracturing flow back equipment until such time as sufficient native reservoir fluids are included within the well stream such that the well stream is within the capability of the processing facility to process to the sales specification. This is commonly referred to as the well being 'cleaned-up' where sufficient fracturing load fluid has been recovered and the well is placed 'on production'. This post-fracture clean-up process or flow back stage may take two or more weeks to complete which is a relatively short time in the life of the well and does not warrant alteration of the processing facility to permit processing the post-fracture well stream. Initially during flow back of the fracturing fluids, the well stream will be comprised of virtually 100% injected fracturing materials, such as water, proppant and nitrogen gas. This gas component of this initial well stream ("gas stream"), containing nitrogen content in excess of the capability of the processing facility cannot be directed to the facility and is, by necessity vented or flared until the content is at or below 3%. As an alternative to venting or flaring the high nitrogen content gas stream, the recovered gas stream can be processed for nitrogen removal prior to entering the processing facility inlet by adding, for example, a temporary nitrogen capture membrane system. This membrane system may by necessity include dehydration to remove excess water vapor within the gas, compression to drive the gas across the membrane, venting of the separated nitrogen to atmosphere and finally additional compression of the separated natural gas to meet the minimum inlet pressure of the processing facility.
Due to the large amount of liquids typically found in a post-fracturing well stream, the pressure of the gas stream may be insufficient to meet the inlet pressure requirement of the processing facility even though the content of the gas stream may be within composition specification. The excessive liquids contained within the flow back well stream, while flowing up the wellbore from the reservoir and to surface, exhibits higher flowing pressure losses. This causes a reduction in the flowing pressure to surface, often to below the inlet pressure requirement of the processing facility. Again, this necessitates venting or flaring of the gas stream until the water content is reduced such that pressure of the stream from the well is sufficient to overcome the minimum inlet pressure of the processing facility. As an alternative, should the gas composition be within the processing facility inlet specification while the pressure is too low to meet the inlet pressure requirement, a temporary gas compressor can be applied to sufficiently increase the pressure to meet the inlet pressure requirement to avoid venting or flaring. At least dehydration for water vapor removal prior to compression is likely needed in order for the gas component of the well stream to meet the compressor's inlet requirements.
Further, should the flowing pressure losses be such that the fluids will not readily flow to surface unassisted, load fluid recovery techniques can be deployed to move fluids to surface during the flow back stage. Two examples of such techniques are swabbing and gas-lifting. Both techniques tend to be costly, complex and time consuming and are add-on processes to the flow back operation following the fracturing treatment. Swabbing involves moving mechanical devices up the wellbore to cause liquids in the wellbore to be lifted to surface. Gas-lifting involves inserting a tubing string or coiled tubing inside the well casing to a specified depth then injecting gas such as nitrogen or natural gas into the tubing or annular space between the tubing and wellbore to cause liquids to move to surface. Gas-lifting can involve extensive surface equipment such as compressors to pressurize the gas, and dehydration and cooling equipment to treat the gas prior to compression.
While there are known techniques available for processing a well stream at surface and to pressurize the well stream to a sufficient processing facility inlet pressure, these techniques can be environmentally harmful, and include techniques like venting or flaring gases to atmosphere, and depositing liquids into open pits. These temporary techniques also tend to require complicated and expensive surface equipment, which also can introduce significant pressure losses, thereby compromising the pressure differential induced within the wellbore to draw the fracturing fluids out of the reservoir. Significantly reducing or eliminating venting, flaring and the water applied during hydraulic fracture completion operations is generally difficult, expensive, complex and ineffective, yet important to the environment and ultimate sustainability of existing well completion techniques. The oil and gas industry would benefit from an effective, cost efficient, and reduced emissions method to induce flow back behaviors after hydraulic fracturing.

Reduced emissions method for recovering product from a hydraulic fracturing operation


An apparatus for joint analog and digital interference cancellation includes a receiver configured to receive an analog reference interfering signal on a reference path, and a sum of an analog interference signal and an analog signal of interest on an antenna path. An analog interference canceller may be configured to produce an analog partially interference-cancelled signal using the analog reference interfering signal and the sum of the analog interference signal and the analog signal of interest. A first analog-to-digital converter may be configured to digitize the analog reference interfering signal to produce a digital reference interfering signal. A second analog-to-digital converter may be configured to digitize the analog partially interference-cancelled signal to produce a digital partially interference-cancelled signal. A digital interference canceller may be configured to produce an interference-cancelled signal using the digital reference interfering signal and the digital partially interference-cancelled signal.

As wireless communication systems often require the ability to communicate in the presence of strong interfering signals, they employ, for example, "full-duplex" operations in the commercial domain and interference excision in military applications. These techniques rely on a copy of the interfering signal being available in real-time, which enables the cancellation (or subtraction) of the interference, in contrast to classic, passive interference-nulling techniques that purport to reduce the level of unknown interference. The present invention is part of the class of active interference cancellation techniques, employing joint analog and digital interference cancellation to improve communication in the presence of interference.

Joint analog and digital interference cancellation in wireless systems


A coupler for coupling a linear fiber array to a spectrometer is provided, the coupler having a tube, a linear fiber bundle array inserted through the tube, an alignment mechanism for aligning the linear fiber bundle array with a slit on the spectrometer, and a locking mechanism for locking the linear fiber bundle array to the tube. Further, a method for coupling a linear fiber array to a spectrometer is provided, the method having the steps of inserting a linear fiber bundle array through a tube, aligning the linear fiber bundle array with a slit on the spectrometer, and locking the linear fiber bundle array to the tube once it is aligned with the slit on the spectrometer.

1. Field of the Invention
The present invention is related to a mount for coupling a linear fiber array to a spectrometer slit.
2. Prior Art
A spectrometer is an optical instrument used to measure properties of light over a specific portion of the electromagnetic spectrum. The variable measured is most often the light's intensity but could also, for instance, be the polarization state. The independent variable is usually the wavelength of the light, normally expressed as some fraction of a meter, but sometimes expressed as some unit directly proportional to the photon energy, such as wavenumber or electron volts, which has a reciprocal relationship to wavelength. A spectrometer is used in spectroscopy for producing spectral lines and measuring their wavelengths and intensities.
A typical spectrometer includes an entrance slit, a collimating mirror or lens, a wavelength dispersive element, such as grating or prism, a mirror or lens for focusing the dispersed light onto a single element detector such as photomultiplier (PMT) or avalanche photodiode. The entrance and exit slits are aligned in parallel to the grating grooves or perpendicular to the dispersion direction of the prism. When a multi-element detector such as diode array or charge coupled device (CCD) is used, the exit slit is removed and the width of the diode or CCD pixel is acting as the exit slit. The slits determine the spectrometer's resolution (subject to the overriding resolving power of the dispersion medium) and have a profound effect on the amount of light that is passed through the spectrometer.
For the remote sampling applications, the signal light from sample under investigation is transmitted through a fiber optic cable with either a single large core fiber or round-to-linear multiple fiber bundle which is butt-coupled onto the entrance slit. When a round-to-linear multiple fiber bundle is used, the linear end of the fiber bundle is aligned along the entrance slit, which is achieved by rotating the ferrule and fixed by a set screw conventionally. In order to achieve better light coupling efficiency, care must be taken to align the linear fiber array to the entrance slit. This manual alignment procedure is tedious and difficult and requires skilled personnel. In addition, the mounting mechanism is not stable at all with a single set screw. Thus it limits its field use. Particularly it requires tedious realignment after each movement.
With this conventional mounting mechanism, light loss occurs at the fiber optic array and entrance slit interface. To facilitate the alignment, the fiber core diameter is generally larger than the slit width. Thus a significant portion of the light from the fiber bundle is blocked by the slit. In some cases, light loss can be as much as 90%. This greatly reduces the system throughput, sensitivity and thus signal-to-noise ratio. This presents a problem for situations like weak signal to begin with. For example, Raman scattering is extremely weak, only very small fraction of the incident light inelastically scattered while almost all of the light is scattered elastically, so called Rayleigh scattering. Therefore in Raman spectroscopy it cannot afford losing any part of the signal.
U.S. Pat. No. 5,042,893 to Ong describes a direct mount coupler for use with a diode array spectrophotometer system. In this design, the entrance slit is replaced by a slit block containing a single waveguide (or plurality of fiber optic waveguides). The waveguide has a linear cross section adjacent the spectrometer and a round cross section at the connector, which secures the signal collection fiber. By removing the slit, the linear fiber array is acting as a slit so misalignment of the fiber slit interface is eliminated. Therefore light loss at the fiber bundle and slit interface is avoided and the system provides better sensitivity. However, it introduces an additional optic component (the single waveguide or plurality of fiber optic waveguides) and an interface at the connector between the round section of the coupler and a signal fiber waveguide. There exists light loss due to fiber-fiber coupling at the connector interface. In addition, a large core fiber has to be used for transferring the signal from a sample to match the diameter of the round section at the connector according to the patent's teaching. As the core diameter of the fiber is getting larger, the fiber is getting stiffer. Therefore the care must be taken to handle it which is inconvenient to the users for routine analysis.
Therefore, there is a need for linear fiber array mount for a spectrometer to provide an efficient coupling of the fiber slit to the entrance slit. Furthermore there is a need for a fiber slit mount for a slitless spectrometer to minimize light loss during the transfer between a sample and detector.

Linear fiber array mount to a spectrometer


X-ray detectors of an X-ray CT apparatus provides photographing image data to a medical image forming apparatus. When data for setting a region-of-interest ("ROI") image and CT values of bones are provided through an input data entry unit of the medical image forming apparatus, a system control unit controls a tomographic image reconstruction unit in such a way that the latter eliminates pixels with the CT values from the ROI image. The reconstruction unit provides the same to a monitor unit through a display control unit. The ROI tomographic image is converted into a blood-vessel emphasized tomographic image. A clear ROI image can be obtained for portions even complicatedly tangled with bones and vessels, such as a human head or the like.

1. Field of the Invention
The present invention generally relates to a medical image forming apparatus for forming images in a region of interest from medical images of a computer tomography (CT) apparatus, a magnetic resonance imaging (MRI) apparatus, an X-ray photographing apparatus or the like. More particularly, the present invention relates to a medical image forming apparatus which is capable of forming definite images in a region of interest from ones tangled with bones and blood vessels in a human head or the like.
2. Discussion of the Background
In an X-ray CT apparatus which irradiates X-rays toward an examined body and photographs a tomographic image thereof, a preliminary scanning operation (called hereinafter "a pre-scan") may be carried out to judge whether or not a contrast medium reaches a photographing object portion (blood vessels, etc.). Such an X-ray apparatus is disclosed in U.S. Pat. Nos. 5,459,769 entitled "Procedure for Monitoring Contrast Agent Application in a CT Imaging System" issued to Barry D. Brown on Oct. 17, 1995 and U.S. Pat. No. 5,612,985 entitled "Computer Tomography Apparatus" issued to Yusuke Toki et al. on Mar. 11, 1997.
A series of operations is briefly shown in a flow chart: of FIG. 1. After a start operation 10 the X-ray CT apparatus executes a pre-scan preparation step 20. In this step, the apparatus is initialized and a predetermined level of X-ray exposure is set therein. Images to be scanned are photographer in response to the X-ray irradiation from the apparatus toward a subject body. The images are displayed on a monitor unit. An operator observes them carefully and determines an image at an appropriate place as a reference image Alternatively, if such images have been already stored in a recording unit through a previously diagnosed operation, the operator may select from them a CT image at a place suitable for a diagnostic purpose as the reference image. While observing the reference image, he or she manipulates a keyboard to set up a region-of-interest (called hereinafter "a ROI") in the reference image displayed on the monitor unit. This ROI is set to surround contrast medium observing regions with a circular frame, for instance. After determination of the reference image, a contrast medium is injected into a blood vessel of the subject body. The pre-scan 30 is then performed.
In this case, the operator checks the contrast medium by observing images in the ROI at a step 40 and instructs the X-ray CT apparatus at a start of an ordinary scan 50 to photograph CT images when he or she confirms that the medium has fully reached diagnostic portions. Thus, CT images useful for diagnosis are obtained because photographs thereof can be taken in such a preferable situation that the contrast medium has completely come to the diagnostic portions. The X-ray CT apparatus then ends its operations at a step 60.
Such confirmation of the contrast medium by means of the pre-scan is relatively easy in the case that a ROI is set up at rather larger blood vessels, e.g., abdominal aortas. However, confirmation is quite difficult for head portions, e.g., where bones and blood vessels are complicatedly located.
In the case of such head portions including complicated bones and blood vessel s, a CT value indicative of an X-ray absorption rate for each substance is almost the same and images set up in the ROI are gray in color as a whole. Fine blood vessels in the vicinity of bones, such as internal carotid arteries, are hardly displayed as images in the ROI. Thus, it is very difficult to check the contrast medium.


A flexible protective cover for preventing fluid from entering an open epidermal site on a user, comprising: a central portion having at least one rib, an edge connected to the central portion at an angle, a lip disposed around the edge, a sealing member disposed over the lip for providing a sealing engagement between the lip and the open epidermal site, and at least one adjustable strap removably connected to the central portion. Also disclosed is a flexible protective cover having a central portion, an edge connected to the central portion at an angle, an inflatable sealing member integral with the edge for providing the sealing engagement, and at least one adjustable strap removably connected to the central portion.

A need exists for a protective cover for an open epidermal site that can form a water-tight seal to effectively prevent fluid from entering the open epidermal site.
A further need exists for a protective cover that is flexible and able to form a seal on various parts of a human or animal body.
A need also exists for a protective cover having sufficient strength or reinforcement means for maintaining a seal and preventing contact with an open epidermal site when touched or impacted by light or moderate pressure.
A need exists for a protective cover having adjustable means for securing to various parts of a human or animal body and for securing to various types and sizes of humans and animals.
The present embodiments meet these needs.
The present embodiments are detailed below with reference to the listed figures.

Flexible protective cover for preventing fluid from entering an open epidermal site


A shaped lens for minimizing differences in time of arrival at the output surface of an explosive assembly. The lens is plano-convex with the convex shape oriented towards the explosive charge. The lens becomes monotonically thicker as the center of the lens is radially approached from the edge, according to a formula accounting for the detonation velocity of the explosive and velocity of the shockwave through the lens. The lens is preferably incorporated into a test fixture using a liquid explosive, such as nitromethane. The test fixture may be assembled on site, at the test location.

Performance testing of explosives has long been accomplished using a solid explosive charge for each test. Techniques to collect unreacted Hugoniot and Run-to-Detonation data include gun techniques and explosive wedge techniques. Gun based techniques are generally favored, but require specialized infrastructure that is not readily deployed. Separately, wedge experiments have been used to quantify the sustained pulse growth or Pop plot data for reactive materials and to also quantify unreacted Hugoniot for both inert and reactive materials.
But each of these experimental techniques requires using a solid charge comprising two explosives. Using a solid charge raises the concern that solid charges are dangerous to load. Furthermore, only very limited locations are authorized and capable of fabricating solid charges. Additionally solid charge explosive wedges are limited in diameter by the available compressive pressure. Gun based experiments are limited to a fixed diameter based upon the bore of the gun under consideration. Once the solid charge, explosive wedge, is fabricated, it must be transported from one of the authorized loading sites to the test site—encountering even more risk. Transport and storage of such explosive charges are time consuming and costly hazardous operations.
In contrast, loading of an explosive test charge with a liquid explosive charge provides the benefit that loading can be locally accomplished at the test site. Locally loading a liquid charges reduces preparation time, allows more flexibility in last minute adjustments and reduces risk. And locally loading a liquid charge reduces risks associated with storage and shipment.
Experimental testing using a liquid explosive may be accomplished using an inert lens. The inert lens under consideration has a convex surface facing towards the charge and an opposed planar output surface. A performance metric of such an explosive lens is the simultaneity of the time of arrival (ToA) across the output surface of the lens.
But none of these attempts have proven satisfactory in reducing ToA disparities to desired tolerances particularly as the perimeter of the lens is approached. The present invention seeks to overcome this disparity in ToA.

Lens for shaping an explosively generated shock

United States of America as represented by the Secretary of the Air Force


A manufacturing apparatus of a semiconductor device includes an introducing section, a process section, and a withdrawing section. The introducing section introduces a transfer box therein. The process section takes in the semiconductor substrate put in the introducing section and applies a prescribed processing to the semiconductor substrate. Further, the withdrawing section is arranged on a surface differing from the surface on which the introducing section is arranged and discharges the transfer box holding the semiconductor substrate withdrawn from the process section of the semiconductor substrate.

1. Field of the Invention
The present invention relates to a manufacturing apparatus of a semiconductor device having an introducing section and withdrawing section, particularly relates to a layout of manufacturing apparatuses of a semiconductor device, which permits improving the transfer efficiency of a semiconductor article within a clean room.
2. Description of the Related Art
In the manufacturing process of a semiconductor device, semiconductor substrates are handled in general in a supervising unit called a lot consisting of 13 semiconductor substrates or 24 or 25 semiconductor substrates. Also, the semiconductor substrates handled in a unit of a lot are housed in a semiconductor substrate housing container called a carrier. In a clean room in which the semiconductor device is actually manufactured, the semiconductor substrates, which are set in a cassette or a carrier, are housed in a semiconductor substrate transfer box so as to be transferred and stored.
There are several methods of introducing the semiconductor substrates, which are supervised as described above, into a manufacturing apparatus of a semiconductor device, hereinafter referred to simply as "a manufacturing apparatus", arranged within the clean room, as summarized below:
(1) A cassette housing the semiconductor substrates is taken out of the transfer box so as to be set in the manufacturing apparatus.
(2) The transfer box housing the semiconductor substrates are set in the manufacturing apparatus, with the lid of the transfer box left open.
(3) The transfer box housing the semiconductor substrates are set in the manufacturing apparatus, with the lid of the transfer box kept closed.
In methods (1) and (2) given above, required is a manual operation performed by the operator in taking out the cassette from the transfer box and in opening the lid of the transfer box. The particular cassette is called an open cassette.
On the other hand, method (3) given above does not require a manual operation, and the semiconductor substrate is automatically taken in by the manufacturing apparatus. For example, the manufacturing apparatus automatically opens the lid of the transfer box so as to take in the semiconductor substrate. Alternatively, if the transfer box is set in the manufacturing apparatus, the manufacturing apparatus takes in the transfer box itself and opens the lid of the transfer box inside the manufacturing apparatus so as to take out the semiconductor substrate from the cassette.
The layout of the particular manufacturing apparatuses within a clean room will now be described with reference to FIG. 1 showing a partial region of the clean room.
As shown in the drawing, a clean room 100 includes a utility area 120 and a working area 130. The utility area 120 is partitioned from the working area 130 by a wall, and various manufacturing apparatuses 110-1 to 110-14 are arranged within the utility area 120. The working area 130, which is the region other than the utility area 120, has a cleanliness higher than that of the utility area 120. A semiconductor substrate introducing section (loader section) 111 and a semiconductor substrate withdrawing section (unloader section) 112 are included in each of the manufacturing apparatuses 110-1 to 110-14. The semiconductor substrate is introduced into the manufacturing apparatus through the semiconductor substrate introducing section 111, and is withdrawn from the manufacturing apparatus through the semiconductor substrate withdrawing section 112. Only these introducing section 111 and withdrawing section 112 extend from the utility area 120 so as to be exposed to the working area 130. The transfer of each semiconductor substrate and, in some cases, various manual operations are carried out within the working area 130.
As described above, the clean room is partitioned in general into a region requiring a high cleanliness (working area) and another region that does not require a high cleanliness (utility area).
If manufacturing apparatuses are to be efficiently installed within a clean room which is partitioned into a plurality of regions based on the required cleanliness, the manufacturing apparatuses 110-1 to 110-14 are to be arranged side by side as shown in FIG. 1. In this case, the working area 130 is in the form of a passageway.
There are two methods of handling the semiconductor substrates before and after the processing, as summarized below:
(1) The semiconductor substrates, which are housed in a certain cassette before the processing, are housed in another cassette after the processing.
(2) The semiconductor substrates after the processing are housed in the cassette previously used for housing the semiconductor substrates before the processing.
Which of the methods (1) and (2) given above to employ is determined by the specification of the manufacturing apparatus and by the layout of the clean room in which the manufacturing apparatuses are installed and the operating policy of the clean room.
Where the semiconductor substrates after the processing are not brought back to the cassette housing the semiconductor substrates before the processing as in method (1) given above, the semiconductor substrate introducing section and the semiconductor substrate withdrawing section are arranged to form a pair on the front surface of the manufacturing apparatus, as shown in FIG. 1.
Where the semiconductor substrates after the processing are housed in the cassette housing the semiconductor substrates before the processing as in method (2) given above, it is possible for a single section to act both as a semiconductor substrate introducing section and as a semiconductor substrate withdrawing section. The cassette in which the same semiconductor substrates are set both before and after the processing is generally called a uni-cassette. To be more specific, at least one section acting both as a semiconductor substrate introducing section and as a semiconductor substrate withdrawing section is formed in the front surface of the manufacturing apparatus that is operated by using a uni-cassette. Incidentally, in the case of using a uni-cassette, the same transfer box housing the cassette is used in general both before and after the processing of the semiconductor substrate.
However, above-noted methods (1) and (2) for handling the semiconductor substrate both before and after the processing of the semiconductor substrate are advantageous in some respects and disadvantageous in other respects, making it difficult to determine which method is the best method.
First of all, method (1), in which the semiconductor substrates after the processing are not brought back to the cassette previously housing the semiconductor substrates before the processing, will now be described with reference to FIG. 1. The arrows of the solid lines shown in FIG. 1 denote the flow of the transfer box housing the semiconductor substrates, and the arrows of the broken lines denote the flow of the vacant transfer box. Suppose, for example, that the semiconductor substrate is processed in the manufacturing apparatuses 110-12, 110-3 and 110-4 in the order mentioned.
In the first step, the transfer box housing the semiconductor substrate processed in the manufacturing apparatus 110-12 is set in the semiconductor substrate introducing section 111 of the manufacturing apparatus 110-3. Also, a vacant transfer box is set in the semiconductor substrate withdrawing section 112 of the manufacturing apparatus 110-3. In the manufacturing apparatus 110-3, a prescribed processing is applied to the semiconductor substrate housed in the transfer box set in the semiconductor substrate introducing section 111. After completion of the processing, the processed semiconductor substrate is housed in the vacant transfer box set in the semiconductor substrate withdrawing section 112. The transfer box housing the processed semiconductor substrate is set in the semiconductor substrate introducing section 111 of the next manufacturing apparatus 110-4.
On the other hand, the transfer box set in the semiconductor substrate introducing section 111 of the manufacturing apparatus 110-3 becomes vacant. The vacant transfer box is set again in the semiconductor substrate withdrawing section 112 of, for example, the manufacturing apparatus 110-12 used for applying the previous processing to the semiconductor substrate. In this case, the transfer box reciprocating between the manufacturing apparatus 110-12 and the manufacturing apparatus 110-3 is allowed to maintain the same cleanliness. Also, the transfer box that has been become vacant provides a transfer box for receiving the next semiconductor substrate and, thus, is transferred to another process step. Alternatively, it is possible for the vacant transfer box to be washed and, then, transferred for receiving the next semiconductor substrate. In this case, the semiconductor substrate after the processing is housed in a new transfer box. It follows that the semiconductor substrate is not contaminated within the transfer box. Naturally, the cleanliness of the semiconductor substrate is not impaired.
However, in the handling method of the semiconductor substrate described above, problems are generated that the efficiency of the cleanliness supervision of the entire clean room becomes poor, and that the operation and supervision of the transfer box become troublesome. To be more specific, the cleanliness required for the transfer box differs depending on the process steps. For example, the semiconductor substrate in the process step falling within a range of between the etching step and the resist removing step is coated with a resist film. Therefore, it suffices for the cleanliness of the transfer box for transferring the semiconductor substrate between the process steps falling within the range noted above to be relatively low. On the other hand, the transfer box used in the steps falling within a range of between the cleaning step and the film-deposition step requires a very high cleanliness.
In the case of the layout of the manufacturing apparatuses as shown in FIG. 1, moved within the working area 130 are the semiconductor substrate which is to be maintained at a high cleanliness, the semiconductor substrate to which are attached a resist material and a reactive gas, the transfer box storing the semiconductor substrate, the cassette, and the vacant transfer box. Since the transfer boxes differing from each other in the cleanliness are moved within the same site, it is difficult to supervise efficiently the cleanliness of the clean room. Further, since the transfer boxes having various degrees of cleanliness are present within the working area 130, the operation and supervision of the working area 130 become troublesome and complex.
It should also be noted that it is necessary to put in the transfer box a supervising tag indicating the information on the semiconductor substrate housed in the transfer box and the information on the present process stage of the semiconductor substrate. In the case of method (1), the transfer box is replaced every time the processing performed in the manufacturing apparatus. Therefore, it is necessary to transfer the supervising tag put in the semiconductor substrate introducing section into the transfer box positioned in the semiconductor substrate withdrawing section. It follows that the supervision of the transfer box become troublesome in this respect, too.
On the other hand, in the case of method (2) using a uni-cassette, the semiconductor substrate processed in the manufacturing apparatus is brought back into the transfer box previously housing the semiconductor substrate before the processing. It follows that the transfer box does not become vacant, with the result that the supervision of the transfer box can be simplified and, at the same time, the problem relating to the supervising tag can be solved.
However, in the case of using a uni-cassette, a new problem is generated that it is difficult to maintain the cleanliness within the transfer box. For example, the semiconductor substrate after the lithography process is coated with a resist film, with the result that it is possible for the resist to be attached to the cassette. Further, suppose that an etching treatment is performed in, for example, a dry etching apparatus in the next step. In this case, the cassette adsorbs the reactive gas attached to the semiconductor substrate and released from the semiconductor substrate in the dry etching step. It follows that, if various processes are performed successively, the chemical solution, the gas, etc., used in the processing are attached to the transfer box every time the processing is performed.
The contamination of the transfer box noted above is a serious problem. Even if the semiconductor substrate is cleansed by removing the resist from the semiconductor substrate and by washing the semiconductor substrate, the cleanliness of the semiconductor substrate becomes poor because the inner region of the transfer box is contaminated with the resist or the reactive gas. In this fashion, the use of a uni-cassette gives rise to the problem that the transfer box and the cassette are contaminated with progress of the processing, and the semiconductor substrate is also contaminated in accordance with contamination of the transfer box and the cassette.
The conventional layout of another manufacturing apparatuses in a clean room will now be described with reference to FIG. 2.
As shown in the drawing, the working area within the clean room 100 is divided into three working areas 130-1, 130-2 and 1303 depending on the cleanliness required for the transfer box. Also, the kinds of the manufacturing apparatuses that are to be installed in the utility areas 120-1 to 120-4 are determined in accordance with the cleanliness of the working area. Further, the transfer boxes are classified depending on the cleanliness thereof into a transfer box to which resist is attached, a transfer box of a low cleanliness to which is attached a gas in, for example, the etching process, and a transfer box of a high cleanliness used in the film-deposition processing and requiring a very high cleanliness. It should be noted that the working areas 130-1 to 130-3 provide a zone in which are moved the transfer boxes having various degrees of the cleanliness noted above.
In the case of the clean room of the construction described above, only the transfer boxes having substantially the same cleanliness are moved within each working area so as to facilitate the supervision of the cleanliness within the clean room and the operation and supervision of the transfer box. On the other hand, where the transfer box is transferred between the working areas differing from each other in the level of the cleanliness, the transfer distance becomes long. At the same time, the transfer of the transfer box becomes highly complex, with the result that it is difficult to supervise the transfer box.
In the method using a uni-cassette, the problem referred to above remains unsolved even if the layout of the clean room is changed.
In conclusion, it is very difficult to maintain the required cleanliness of the semiconductor substrate by the apparatus construction of the uni-cassette alone. Under the circumstances, it is necessary to use an exclusive apparatus equipped with a replacing mechanism for replacing the transfer box and the cassette for maintaining the required cleanliness or a manufacturing apparatus equipped with a mechanism including a semiconductor substrate introducing-withdrawing section and replacing the transfer box before and after the processing. However, if the transfer box is transferred by introducing these apparatuses, the transfer of the transfer box housing the semiconductor substrate and the vacant transfer box becomes highly complex.
As described above, if the semiconductor substrate is transferred by using a uni-cassette in the conventional manufacturing apparatus and the manufacturing system of the semiconductor device, it is possible to obtain the merit that the transferring supervision of the transfer box is facilitated and the supervising tag need not be moved. However, the conventional technology gives rise to the problem that it is difficult to maintain the required cleanliness of the semiconductor substrate because the inner region of the transfer box is contaminated every time the processing is performed.
Also, in the system in which the semiconductor substrate after the processing is housed in a transfer box differing from the transfer box housing previously the semiconductor substrate before the processing, the required cleanliness within the transfer box can be maintained easily. In this case, however, it is necessary to move the supervising tag every time the processing is performed within the manufacturing apparatus. Also, the transferring route of the transfer box becomes complex. As a result, a problem is generated that the supervision in the cleanliness of the clean room and the transferring supervision of the transfer box become complex and difficult.

Manufacturing apparatus of semiconductor device having introducing section and withdrawing section


A switchgear cabinet including covering parts and at least one cabinet door mounted on a cabinet carcass by hinges and having a door frame including two vertical profiled elements and two horizontal profiled elements as well as corner pieces joining the profiled elements. In order to simplify the structure and assembly of the switchgear cabinet, hinge receptacles on which the hinges are mounted are supplied on or in the corner pieces of the same side of the door frame.

1. Field of the Invention
This invention relates to a switchgear cabinet with covering elements and at least one cabinet door attached to the body of the cabinet by hinges, which door has a door frame made of two vertical profiled elements and two horizontal profiled elements and corner pieces connecting them.
2. Discussion of Related Art
A switchgear cabinet is taught by German Patent Reference DE 28 47 994 C2. There, a door of the switchgear cabinet has a door frame with an inserted door leaf. The door of the switchgear cabinet is hingedly attached to the frame of the switchgear cabinet by hinges, wherein the hinges are received in a frame by a hinge part. For this purpose, the portion of the frame receiving the hinge parts is adapted in a particular way to a section of the hinge parts, which involves a corresponding cost outlay. The profiled elements forming the door frame are beveled in the corner areas and put together by corner connectors in order to clamp the profiled frame sections with respect to each other. No specific information is provided in regard to the corner connectors.
A switchgear cabinet disclosed by German Patent Reference DE 29723 273 U1, has a door frame made of hollow profiled sections, which are connected with each other at right angles by corner pieces, and is attached to the back of the door facing the switchgear cabinet interior, but no detailed information regarding the embodiment of the corner pieces is provided. Hinge elements are attached to the back of the door leaf outside of a circumferential seal, while further hinge elements, which are hingedly connected therewith are fixed in place on an adjoining vertical frame leg of the switchgear cabinet.


A storage system (1) has a chamber (3). In the chamber (3), multiple storage tanks (5) are arranged, and a picking and placing device (8) is arranged above these tanks. Carrousels (8) are arranged in the storage tanks. These carrousels are suspended from a top pivot bearing (35) and laterally guided by a bottom pivot bearing (44). The top pivot bearing (35) is located outside the insulation (12) of the storage tanks and is thus protected from extreme temperatures. In the carrousel (18), storage cassettes (20) are arranged which are laterally held by guide elements (31).

The storage of laboratory objects at very low temperatures, for example at temperatures below −160° C., typically at −196° C., is very costly and not very accessible to an automation. A storage system for low temperatures is known from EP 1 972 874, but this system is only partly suitable for truly low temperatures.
U.S. 2010/0275636 describes a vacuum-insulated storage tank for laboratory objects with which cryogenic temperatures can be achieved.
U.S. Pat. No. 5,233,844 describes a storage system for cryogenic temperatures in which laboratory objects can be stored in a carrousel inside a thermally insulated storage tank.


An M-ary-modulation-capable equalizing processing apparatus, received signal processing system, receiver and M-ary-modulation-capable equalizing processing method enabling reduction in processing amount of the equalizing processing while improving bit error rate characteristics. M-ary-modulation-capable equalizing processing apparatus 6 has phase rotation sections 601 to 604, equalizing processing sections 611 to 614 and soft-decision value determining section 620. Phase rotation sections 601 to 604 rotate phases of signal Sr1 to Sr4. The signals Sr1 to Sr4 are obtained from a received signal Sr that is converted into a digital baseband signal and that has information amounts “3” per symbol, and have an information amount of 1 bit per symbol. Equalizing processing sections 611 to 614 perform equalizing the processing on the signals Sr1 to Sr4 to output soft decision value Spd1 to Spd4. Based on the soft decision value Spd1 to Spd4, soft-decision value determining section 620 determines a soft decision value Ssd.

1. Field of the Invention
The present invention relates to an M-ary-modulation-capable equalizing processing apparatus, received signal processing system, receiver and M-ary-modulation-capable equalizing processing method, and more particularly, to an M-ary-modulation-capable equalizing processing apparatus for use in digital radio communication techniques to support fading, received signal processing system including the M-ary-modulation-capable equalizing processing apparatus, receiver including the received signal processing system, and M-ary-modulation-capable equalizing processing method to achieve aforementioned apparatuses and system.
2. Description of Related Art
Generally, on radio channels a receiver receives at the same time radio signals propagated through a plurality of paths with different propagation time due to effects of multipath fading. Therefore, on the receiver, delay distortion occurs and bit error rate characteristic deteriorate.
As the symbol rate is increased, the delay distortion becomes larger. Accordingly, in future high-rate digital mobile communication apparatuses, effects of delay distortion are not ignored, and it is dispensable removing the delay distortion.
An equalizer is representative means for correcting the delay distortion. In the radio communication field, an equalizer is mounted on a receiver that performs high-rate transmission. Further, there is a growing trend to mount an equalizer on mobile phones and the like that adopt GSM (Global System for Mobile communication) that is one of European digital mobile telephone standards.
A representative algorithm as an equalizer is a Viterbi equalizing algorithm. The Viterbi equalizing algorithm is one for generating a received signal replica from combinations of all expected received signals using detection results of delay distortion of multipath fading, and estimating a most likely transmitted signal from the Euclidean distance between the replica and received signal.
A processing amount of the Viterbi equalizing algorithm is affected by "2at" when assumed that allowed delay time on multipath fading is t[s] (t=k×T, where T is a symbol duration, and k is the number of allowable delay taps) and an information amount per symbol is a bits. This is because of increases in the number of states in trellis state transition and the number of possible transitions from state "1" used in the Viterbi equalizing algorithm, and the processing amount exponentially increases with increases in information amount a per symbol.
For example, in EDGE (Enhanced Data GSM Environment) that is the GSM next-generation communication standard, the information amount per symbol is "3" (the information amount a is "1" in GSM), and when the number of allowable delay taps (k) is "5", required are the number of states of "4096" and the number of possible transitions of "8". The number of states in EDGE is 256 times that in GSM, and the number of possible transitions in EDGE is 3 times that in GSM.
Document 1 (Japanese Laid-Open Patent Publication H05-335893) discloses an equalizing method and apparatus which define a plurality of states as one state set in the Viterbi equalizing algorithm, applying the Viterbi equalizing algorithm to such a limited state of the state set, and thereby suppressing the processing amount of the Viterbi equalizing amount.
However, in the equalizing method and apparatus as disclosed in Patent Document 1, considered are transitions for each state set and transitions between limited states in the Viterbi equalizing algorithm, and consideration is not given to deterioration of bit error rate characteristics.

Matsushita Electric Industrial Co., Ltd.


The present invention provides an optical coupling member and an optical connector using the optical coupling member, capable of improving the efficiency of an assembly work of the optical connector and positioning optical fibers in the optical connector with high accuracy. The optical coupling member (10) has: holding members (11) for being able to hold optical fibers (21) that are inserted from insertion holes (11a) formed at end parts; lenses housed in housing parts formed at opposite end parts of the holding members (11); and a joining member (13) for connecting the holding members (11) as aligned in parallel to each other, the joining member being formed of an elastic material.

In an optical fiber communication system, an optical connector with a plurality of optical fibers aligned at predetermined intervals is used to connect to another optical device or optical connector. Alignment of the optical fibers is generally performed by shaft alignment using positioning grooves such as V-shaped grooves provided at predetermined intervals.

This patent is subject to a terminal disclaimer.

Optical coupling member and optical connector using the same


The present invention provides a method and apparatus for adaptively controlling a closed throttle downshift in an automatic transmission wherein a transmission aberration during a shift is diagnosed and corrected during subsequent closed throttle downshifts. The invention is carried out by monitoring transmission characteristics including input speed, output speed and shift duration during a closed throttle downshift, and identifying departures from acceptable patterns. Each type of departure calls for a particular remedy, and a suitable adjustment is calculated based on the times and/or the commanded pressures at certain times, the adjustment being implemented by changing one or more initial conditions for the next shift of the same type. The adjustments may have to be large to make a full or significant partial correction at the next shift. Conversely small increments may be necessary to avoid over-correction.

Generally, a motor vehicle automatic transmission includes a number of gear elements coupling its input and output shafts, and a related number of torque establishing devices such as clutches and brakes that are selectively engageable to activate certain gear elements for establishing a desired speed ratio between the input and output shafts. As used herein, the terms "clutches" and "torque transmitting devices" will be used to refer to brakes as well as clutches.
The input shaft is connected to the vehicle engine through a fluid coupling such as a torque converter, and the output shaft is connected directly to the vehicle wheels. Shifting from one forward speed ratio to another is performed in response to engine throttle and vehicle speed, and generally involves releasing or disengaging the clutch (off-going) associated with the current speed ratio and applying or engaging the clutch (on-coming) associated with the desired speed ratio.
The speed ratio is defined as the transmission input speed or turbine speed divided by the output speed. Thus, a low gear range has a high speed ratio and a higher gear range has a lower speed ratio. To perform a downshift, a shift is made from a low speed ratio to a high speed ratio. In the type of transmission involved in this invention, the downshift is accomplished by disengaging a clutch associated with the lower speed ratio and engaging a clutch associated with the higher speed ratio, to thereby reconfigure the gear set to operate at the higher speed ratio. Shifts performed in the above manner are termed clutch-to-clutch shifts and require precise timing in order to achieve high quality shifting.
The quality of shift depends on the cooperative operation of several functions, such as pressure changes within on-coming and off-going clutch apply chambers and the timing of control events. Moreover, manufacturing tolerances in each transmission, changes due to wear, variations in oil quality and temperature, etc., lead to shift quality degradation.

Method and apparatus for adaptive control of closed throttle downshifts in an automatic transmission


The provision of premixed aqueous compositions are used to provide a paint composition of varying finish characteristics at the point of sale. Paint components are combined in differing amounts to produce paint compositions being suitable for either interior or exterior use and having differing sheens, quality levels, and color bases. A user interface to input a desired amount of paint composition and controller is provided. The controller tracks the available amount of the components by subtracting the amounts in the supply reservoirs as they are supplied to the receiving reservoir. The controller determines whether availability components in the supply reservoirs is sufficient for the amount of the desired aqueous paint composition by subtracting the amount components for the desired aqueous paint composition to be produced from the amount in the plurality of supply reservoirs. If the amount is less than zero after the subtraction, then the availability is insufficient and the controller provides a signal to the plurality of supply reservoirs not to supply the plurality of paint components.

1. Technical Field
This invention relates to the production of an aqueous paint from a plurality of premixed compositions.
2. Background Art
The traditional manufacture of paint has utilized processes which continuously fill containers with a neutral or base color at the central facility. The containers are transported to the point of sale and stored until resale. The transport and storage in the individual containers adds significantly to the cost of the sold product for it is necessary to inventory a wide variety of paints having different finish characteristics to satisfy consumer demand. For example, the finishes offered for sale range from the traditional flat paint through varying resin compositions up to a high gloss finish. Inventory is maintained for all the different finishes at the point of sale by the merchant.
The manufacture of paint at the central facility can be either a batch process or an extended continuous mixing process. The process typically calls for mixing a pigment containing ground titanium dioxide along with a thickener, a viscosity controlling agent and resin added to the water base. The pigment is a composition with a high percentage solids suspended in water. Storage for any significant period of time of a premixed pigment composition typically results in settling and a non-uniform distribution of constituents throughout the premix. Consequently, manufacturing processes are designed to limit the residence time in premixing containers in order to promote the manufacture of more uniform products.

Method and apparatus for producing an aqueous paint composition from a plurality of premixed compositions


The invention provides a filter element which has a reduced initial pressure loss, can reduce an energy cost and can secure a high air flow rate, a filter element which has an elongated gas removing service life and filtering service life while keeping a high gas removing performance and a high dust removing efficiency, a manufacturing method and a method of use of the same. In a filter element (10) in which a pleated composite substrate (11) obtained by lapping or laminating an nonwoven fabric sheet including a fiber constituted by a thermoplastic resin and a gas removal sheet is pleated, and a pleated shape of the pleated composite substrate (11) is held by a shape retaining member (12a), a thickness of the nonwoven fabric sheet is increased at least 5% when heated to 60 degree C.

There has been conventionally used an air cleaner filter which is set in a house and a cabin filter which is installed in an inner portion of an air conditioner within a passenger room of a motor vehicle and an air cleaner installed in a ceiling within the passenger cabin or on a panel at the back of a rear seat so as to clean the indoor air, and which clean outdoor and indoor air. And in this cabin filter or air cleaner, a filter element is used in accordance with an aspect that an air filter base material including a gas decomposing particle or a gas adsorbing particle serving as a gas removing particle is pleated.
In the case of the filter element mentioned above, if the gas removing particle is covered with dust or the like, there is a problem that the gas removing performance is lowered, and the gas removing service life becomes shorter. Accordingly, there is devised such as to efficiently operate functions for deodorizing and removing harmful gas by the gas removing particles after previously removing the dust by a filter element for removing the coarse dust, by laminating or integrating the filter media for removing the coarse dust and a base material including the gas removing particle. As the filter element mentioned above, for example, there has been known a deodorant filter material unit in patent document 1.
However, if the filter media for removing the coarse dust is laminated on the base material including the gas removing particles, a pressure loss of the filter element becomes too large, so that there is generated a problem that an energy cost of the air cleaner or the like becomes high or the gas removing function can not be sufficiently achieved. Accordingly, the filter media for removing the coarse dust is required to have a dust removing efficiency as high as possible and to have a filtering service life as long as possible, in addition to making a pressure loss as small as possible so as to secure a high air flow rate.
If a filter material for removing a coarse dust having a small thickness is used for the requirement, there is obtained an advantage that the pressure loss of the filter element is reduced, and the high gas quantity can be secured. However, there is a problem that a space holding the dust is reduced and the filtering service life of the filter element is shortened.
Further, in the case that the filter material for removing the coarse dust having a large thickness is conversely used, there is obtained an advantage that the space holding the dust is increased and the filtering service life is elongated. However, on the contrary, there is a problem that the pressure loss of the filter element becomes high, the energy cost is increased and the high air flow rate can not be secured.
Patent Document 1    Japanese Unexamined Patent Publication No. 11-254958

Filter element, method of manufacture and use


Apparatus and methods are used for controlling electromagnetic radiation pulse duration in a lithographic apparatus. A dividing element is arranged to divide an electromagnetic radiation pulse into a first portion and a second portion. A prism receives, refracts, and subsequently emits the first portion of the electromagnetic radiation pulse. A directing element is arranged to direct the first and second portions of the electromagnetic radiation pulse parallel to a common optical axis. The first portion combines with the second portion to form a combined radiation beam pulse. The combined radiation beam pulse has a longer pulse duration than the divided electromagnetic pulse and experiences no corresponding loss in intensity.

1. Field of the Invention
The present invention relates to an apparatus and a method for controlling electromagnetic radiation pulse duration.
2. Related Art
A lithographic apparatus is a machine that applies a desired pattern onto a substrate or part of a substrate. A lithographic apparatus can be used, for example, in the manufacture of flat panel displays, integrated circuits (ICs) and other devices involving fine structures. In a conventional apparatus, a patterning device, which can be referred to as a mask or a reticle, can be used to generate a circuit pattern corresponding to an individual layer of a flat panel display (or other device) or an IC. This pattern can be imaged onto a target portion (e.g., comprising part of one or several dies) on a substrate (e.g., a silicon wafer) that has a layer of radiation-sensitive material (e.g., resist) using a beam of radiation. In general, a single substrate will contain a network of adjacent target portions that are successively exposed. Conventional lithographic apparatus include so-called steppers, in which each target portion is irradiated by exposing an entire pattern onto the target portion, and so-called scanners, in which each target portion is irradiated by scanning the pattern through the beam in a given direction (the "scanning"-direction) while synchronously scanning the substrate parallel or anti parallel to this direction.
Instead of a circuit pattern, the patterning device can be used to generate other patterns, for example a color filter pattern or a matrix of dots. Instead of a mask, the patterning device can be a patterning array that comprises an array of individually controllable elements. The pattern can be changed more quickly and for less cost in such a system compared to a mask-based system.
A flat panel display substrate is typically rectangular in shape. Lithographic apparatus designed to expose a substrate of this type can provide an exposure region that covers a full width of the rectangular substrate, or covers a portion of the width (for example half of the width). The substrate can be scanned underneath the exposure region, while the mask or reticle is synchronously scanned through a beam. In this way, the pattern is transferred to the substrate. If the exposure region covers the full width of the substrate then exposure can be completed with a single scan. If the exposure region covers, for example, half of the width of the substrate, then the substrate can be moved transversely after the first scan, and a further scan is typically performed to expose the remainder of the substrate.
In conventional lithographic apparatus, the beam of radiation may be provided by a radiation source (e.g., a laser or an arc lamp), and the radiation beam may be formed by or comprised of a plurality of radiation beam pulses. The radiation beam pulses may be generated by pulsing the radiation source or by selectively allowing or preventing the passage of a continuous beam of radiation. A certain exposure energy is associated with each of the radiation beam pulses, and the energy of a respective pulse may be calculated as the intensity of the radiation beam pulse integrated over the duration of the pulse. Thus, the energy of the radiation beam pulse may be increased by increasing the pulse duration and/or by increasing the intensity. Alternatively, the energy of the radiation beam pulse may be kept constant by varying the intensity by a certain amount and by varying the pulse duration by corresponding amount.
The beam of radiation may pass through lenses, gratings, masks, etc., or be reflected from mirrors or other reflective surfaces. The intensity of radiation beam pulses forming the radiation beam may be high enough to temporarily or permanently damage those surfaces that contact the radiation beam. The intensity of a given pulse may be sufficient to instantly damage the surfaces, or the cumulative effects of a plurality (e.g., millions or billions) of pulses may be sufficient to cause such damage. In some circumstances, such damage may be tolerable. However, in general, it is desirable to avoid damage to optical elements through which the radiation beam passes through or off which the radiation beam reflects.
Reduction or elimination of such damage increases the lifetime of the elements and also ensures that the performance of the elements does not degrade rapidly. One approach to reducing such damage is to reduce the intensity of the radiation beam pulses that form the radiation beam. However, if the intensity of the radiation beam pulses is decreased without a corresponding change in pulse duration, the total energy of a given radiation beam pulse will decrease. The decrease in total energy may not be desirable, as a radiation beam pulse may require a certain threshold energy in order to perform a certain function, such as applying a pattern to a photosensitive material. Therefore, in addition to reducing the intensity of the radiation beam pulses to reduce or eliminate damage to surfaces through which the radiation beam passes or off which the radiation beam reflects, it is also desirable to increase the duration (i.e., the length) of the radiation beam pulse to ensure that the total energy of the pulse remains unchanged and at or above the threshold value.
Conventional apparatus increase the duration of a radiation beam pulse by reflecting a portion of the radiation beam around a reflective optical circuit provided by mirrors. The reflected portion is then directed in the direction of travel of the non-reflected portion of the radiation beam. By carefully controlling parameters associated with the reflection of the portion of the radiation beam pulse, the reflected radiation beam pulse can be made to slightly lag and/or overlap with the non-reflected portion of the radiation beam pulse. The lag and/or overlap in the radiation beam pulses is such that the two radiation beam pulses, in combination, effectively serve as a single radiation beam pulse having an increased length (e.g., an increased duration).
These conventional apparatus succeed in reducing the intensity of a radiation beam pulse, while effectively increasing the length of the pulse. However, these conventional apparatus have at least one disadvantage. By reflecting the portion of a radiation beam pulse around an optical circuit using mirrors, losses associated with each respective reflection decrease the intensity of the reflected portion. As losses in intensity increase, it becomes more difficult to ensure that a radiation beam pulse with sufficient intensity is incident upon a target portion of the resist coated substrate at a later stage in the lithographic apparatus.
Therefore, what is needed is an apparatus and method that allows the pulse duration of a radiation beam to be extended without a corresponding loss in intensity.

Electromagnetic radiation pulse duration control apparatus and method


An optical fiber processing apparatus comprises reactors (3, 3a, 3b and 3c) that accommodate optical fiber, a single suction pump (7) having an intake port (19) and an outlet port (21), a storage chamber (5) into which deuterium containing gas is delivered, and a circuit portion (9, 59) including a plurality of valves disposed on a plurality of passages connecting the reactors, the suction pump and the storage chamber. The circuit portion includes a first channel for returning deuterium containing gas inside a reactor chamber to the storage chamber, a second channel for delivering air to the reactor chamber thereby rendering the pressure inside the reactor chamber atmospheric pressure, a third channel for decompression of the reactor chamber and a fourth channel for supplying deuterium containing gas in the storage chamber into the reactor chamber.

1. Field of the Invention
The present invention is related to an optical fiber processing apparatus for controlling transmission loss.
2. Description of Related Art
Generally, optical fiber is produced by stretching quartz glass based material when the material is in a melted state heated to a high-temperature of approximately 2000° C. After the stretched fiber core is rapidly cooled inside a cooling device such as a cooling cylinder or the like, the fiber core is coated, wrapped with a coating resin. It is known that during this series of steps, NBOHC (Non-Bridging Oxygen Hole Center Si—O) arises when the melted fiber core is rapidly cooled.
The NBOHC remaining in the optical fiber combines with hydrogen remaining in the optical fiber during the production process or hydrogen arising from the resinous coating the optical fiber, becoming Si—OH. If the hydroxyl (—OH) arises, optical loss in the 1.38 micrometer optical communication wavelength increases due to absorption loss from the hydroxyl, resulting in a deterioration in the transmission characteristics of the optical fiber.
The method of exposing the optical fiber to gas containing deuterium is known for use to improve the problem of deteriorating transmission characteristics. This well-known method involves reacting the NBOHC inside the quartz glass with deuterium (D2) and generating deuteroxyl (—OD) instead of hydroxyl (—OH). Because the optical absorption band of deuteroxy is 1.87 micrometers, wavelength region where absorption loss is substantial is shifted beyond the optical communication wavelength region of the 1.3 micrometer, thereby reducing transmission loss of the optical communication wavelength region. However, a problem affecting this well-known method is that the duration of exposure to the deuterium containing gas must continue for a day or a week, this substantial time requirement rendering the method inefficient.
Accordingly, a method in which a reactor chamber filled with gas containing deuterium is used as a decompression chamber in order to reduce time of exposure to the deuterium containing gas, while using a storage chamber that enables the valuable deuterium to be reused instead of being discarded has been proposed in Japanese Patent Application No. 2003-424632.
However, the above method which employs a decompression reactor and a storage chamber requires a plurality of pumps such as a pump in order to facilitate decompression in the reactor, a pump in order to supply the deuterium containing gas inside the storage chamber to the reactor after decompression is complete and a pump to return the deuterium containing gas to the storage chamber after that operation. Accordingly, the problem arises of considerable expense required for equipment costs.
Further, the storage chamber is a supply container for supplying the deuterium containing gas to the inside of the reactor and therefore there must be a one-to-one pairing relationship between the reactor and the storage chamber. This means that in order to process a plurality of optical fibers simultaneously, a plurality of reactors are required for setting the optical fiber which then requires the same number of storage chambers to be provided as the number of reactors. This requires usage of substantial space to install the equipment and engenders considerable expense for equipment costs.
Here, a method in which a single large storage chamber or a highly pressurized storage chamber is employed to correspond to a plurality of reactors is conceivable. However, increasing the size of the storage chamber raises costs, while in providing a high-pressure container, substantial back pressure arises from the vacuum pump and it is not possible to create a sufficient vacuum condition in the reactor.