A valve device for use in a feeding apparatus releases raw material into raw material processing machinery for the manufacture of high-voltage cable. The valve device includes a valve body including a first valve member having a conical shape and including at least one opening extending between a tip of the first valve member and a corresponding base portion of the first valve member, and a second valve member including at least one cover element. One of the valve members is rotatable with respect to the other valve member between a first operating position in which the at least one cover element uncovers the at least one opening, thereby allowing the raw material to flow through the valve device, and a second operating position in which the at least one cover element covers the at least one opening, thereby preventing raw material from flowing through the valve device.

1. Field of the Invention
The present invention generally relates to the field of high voltage cables manufacturing. More specifically, the present invention relates to a valve device particularly adapted to be used in feeding apparatuses for dispensing products, such as for example polymer compound granules, to an extruder machinery carrying out high voltage cables insulation.
2. Overview of the Related Art
Cable manufacturing, and in particular the manufacturing of high voltage cables—such as, for example, high voltage electric power distribution cables operating at voltages in the range from 20 up to 500 kV—typically requires that a central conductor of the cable is completely covered by a coating of homogenous insulating material, referred to as cable insulator in the following, able to electrically insulate the central conductor and prevent any possible dangerous electric discharge towards the surrounding environment.
As known in the art, during the manufacturing of a high voltage cable, the step of covering the central conductor with the cable insulator is achieved by an extrusion process of polymer compounds substantially including raw thermoplastic materials in the form of pellets (generally known as "granules"), which extrusion process allows creating a coating of a substantially constant and predetermined cross-sectional profile through a machinery called extruder. In particular, the granules of thermoplastic material, which are to be fed to the extruder, are loaded, stored and transported within a bin (generally an octabin,—i.e., a prism-shaped bin having an octagon base); in order to feed the extruder, the octabin is placed over an extruder load hopper, which connects the octabin and the extruder and through which the granules of thermoplastic material are caused to flow by gravity. When the granules enter the extruder and come into frictional contact with an extruder rotating screw (normally rotating at up to 120 rpm), the granules of thermoplastic material are heated up (for example at temperatures from 200° C. up to 275° C.) and melt, and the melted polymer is then pushed through an extruder die having a desired cross-section, and finally properly cooled.
As known to those skilled in the art, it is of the utmost importance that the cable insulator is, as far as possible, free from contaminants, so as to be able to ensure an effective insulation of the high voltage cable. In fact, the presence of contaminants in the cable insulator causes defects which may cause, in relative short periods of use, a drastic increase of local electrical fields acting thereon in response to applied high voltage gradients; such condition typically accelerates the ageing of the cable insulator and reduces an insulation breakdown strength of the same, thus making the high voltage cables unreliable. To this end, the raw material used to form the cable insulator, i.e. the granules of thermoplastic materials fed to the extruder, shall have a very high degree of "cleanliness". When the octabin is located above the extruder load hopper, the risk that contaminant particles or foreign bodies spuriously enter into the load hopper is relatively low, since the octabin substantially covers the extruder load hopper, whereas such risk becomes significant when the octabin is positioned away from the extruder load hopper and the latter is left uncovered; this actually happens relatively frequently, when, for example, the octabin has to be removed because for example empty, and replaced by a new octabin.
Therefore, although the above described method used for feeding or discharging the granules of thermoplastic material from the octabin to the extruder during cable insulator manufacturing is widely practiced thanks to the simplicity thereof, the fact that it is not possible to effectively prevent contaminating particles coming from the surrounding environment from entering the extruder when the octabin is not above the extruder load hopper makes the cable insulator (and hence the whole cable) very instable in terms of electrical and mechanical performance, thus resulting in a reduced reliability and lifetime of the cable.
Some manual expedients could in principle be adopted to prevent the input of contaminating particles into the extruder load hopper; for example, it could be possible to provide a cap for the extruder load hopper which is manually put thereon to close its entrance when the octabin is not in place, and manually removed after the octabin has been positioned so as to allow the granules of thermoplastic material to fall into the load hopper. However, such a solution is not very effective, since it involves a further manual operation to be performed by the personnel during the cable manufacturing process, thus being burdensome for an operator who has to be extremely careful during accomplishing the putting and the removing operations. Moreover, the manual cap placement and removal is an operation prone to errors, being inevitably subject to human mistakes that may impair the overall cable insulator manufacturing process, thereby causing time wastes and/or economic losses. Last but not least, the manual cap placement and removal may cause injuries to the operator.
For example, WO2009076375A1 discloses a dispensing system for granular materials, in particular agricultural products, capable of dispensing multiple products in different receptacles through a rotating structure. The rotating structure disclosed in such documents, although acting as a rotating valve for selectively distributing granular materials into corresponding receptacles, does not avoid possible feeding of undesired contaminating particles or materials in the receptacles. In particular, if undesired materials reach the dispenser, the latter keeps on supplying the contaminated granular materials without any supplying stop mechanism. Moreover, the dispenser configuration allows switching the material in different receptacles, but it does not allow discharging waste products outwards; in fact, since no discharge means are provided, which could throw away the contaminated granular material, such dispenser configuration is not adapted to be used for the purpose of the present invention, i.e., for feeding the extruder load hopper (and hence the extruder) during high voltage cable manufacturing.
US2003/159658 relates to a product discharge mechanism for a hopper having a gate or valve slideably positioned such that in one position it covers a fixed discharge opening of the hopper thereby obstructing product flow, and in one or more other positions it is at least partially opened with respect to the discharge opening so that said product may flow through the fixed opening and thereby be discharged from the hopper. In other words, with the mechanism disclosed in such document, no product can flow when the valve is in the closed position, but when the plate is away from the fixed openings, product can flow.
Therefore, the valve disclosed in such document, although regulating the product flow, is not able to prevent any product contamination by contaminating particles inevitably coming from the external environmental, i.e., the drawback of feeding waste materials into the hopper persists. Moreover, no lateral discharge passageways are provided for the product discharge mechanism so as to switch the undesired material to the external.

Valve device for high voltage cable insulator manufacturing


A high speed bipolar multiplexer circuit adds less than ten picoseconds delay to the data or test paths. The multiplexer circuit incorporates a low gain linear amplifier which is completely stable and compensates for any level losses through the input emitter followers. The minimal delay introduced in the system data paths and the good isolation between system data inputs and test data inputs matches the performance of the logic and memory circuits of the chips in which multiplexer circuits are incorporated.

1. Field of the Invention
The present invention generally relates to signal multiplexers and, more particularly, to a high speed multiplexer which minimizes signal delay and produces no loss of signal levels. The multiplexer according to the invention has particular application in high speed logic and memory circuits which incorporate scan test inputs requiring good isolation between system data and test data inputs.
2. Description of the Prior Art
A multiplexer is an electronic switch that connects one of two or more signal sources to a load. In one particular application, a multiplexer is used in a logic or memory chip that requires its receiving circuits to accept either system data inputs or test data inputs. Although the multiplexer function for this application can be easily performed using conventional logic circuits, the delay introduced into the system data paths would be intolerable for high performance logic and memory chips. What is needed for these high performance chips is a multiplexer circuit which, in the system mode, introduces a minimal delay in the system data paths and provides good isolation between system data inputs and test data inputs. The multiplexer circuit should be a high performance circuit, matching the performance of the logic and memory circuits of the chips in which they are incorporated, and preferably insure no signal loss between input and output terminals.

International Business Machines Corporation


A vehicle powertrain having multiple prime movers including a primary prime mover coupled inline to a transmission and a secondary prime mover selectively coupled to the transmission by a substantially concentric coupling. A method of powertrain control is also disclosed, wherein powertrain torque demand and torque available from the primary prime mover and the transmission within its present gear ratio are determined and compared. Output of the primary prime mover is increased if the powertrain torque demand does not exceed the torque available. Otherwise, the transmission is downshifted to a lower gear ratio. Torque demand is compared to torque available from the primary prime mover and the transmission within its now downshifted gear ratio. Output of the primary prime mover is increased if torque demand does not exceed torque available. Otherwise the secondary prime mover is started, its output increased, and the transmission is shifted to a higher gear ratio.

Various types of prime movers are used in current production automobiles. Prime movers are machines, such as motors and engines, in which work is accomplished by the conversion of various forms of energy into mechanical force and motion. For example, motors convert electric energy into mechanical energy, and engines transform chemical energy into mechanical energy. Such vehicle engines are sized to meet relatively high load requirements, such as hill climbing or rapid acceleration from standstill. But during normal city and highway vehicle operation at cruising speeds, a vehicle engine is often operated according to relatively low loads. Accordingly, vehicle engines usually operate at excess capacity, which can result in relatively low engine efficiency and high fuel consumption.
Several approaches have been proposed to modify a vehicle powertrain to yield higher engine efficiency and lower fuel consumption, including the use of multiple separate engines coupled to a conventional automatic transmission. When such a vehicle is operated at a relatively low torque demand from the operator, only one of the engines is employed to propel the vehicle. When torque demand exceeds the maximum torque output of the single engine, a second engine is activated in synchronism with the first engine and is engaged to the transmission to supplement the first engine torque output to the transmission.
But several drawbacks have been noted with this arrangement. For example, existing engine output couplings are typically not highly reliable, usually do not provide smooth operation transparent to the vehicle operator, and are often relatively expensive. Furthermore, existing coupling mechanisms do not always enable the engines to be coupled relatively quickly, and may involve substantial lag time between the vehicle operator's demand for additional torque and the delivery of additional torque via the second engine. Finally, in a powertrain with multiple engines, the initializing, activating, and/or synchronizing of additional engines is relatively fuel inefficient.

Control of a vehicle powertrain with multiple prime movers


An information processing apparatus that performs a startup control of redundantly configured modules includes a memory to retain abnormality information regarding an abnormality that occurs at time of startup control of the modules, and a startup controller section executing a startup process by sequentially executing the process, generating the abnormality information, determining whether a reduced operation is possible or not when the module in which an abnormality occurs at the time of startup control is detected, completing an execution of the process block in progress when it is determined that the reduced operation is possible, executing a restart process on a module selected from all the modules in which abnormalities occur at the time of startup control based on the abnormality information and completing an execution of the process block in progress after completing the restart process when determined that the reduced operation is not possible.

Some information processing apparatuses are designed in an attempt to provide highly reliable services by employing a redundant configuration for modules that perform parts of processes to provide the services. A startup control of such redundantly configured modules is carried out by an information processing apparatus that manages and controls the modules.
When an abnormality occurs in some of the modules, the information processing apparatus detaches the module in which the abnormality is detected or restarts the module in which the abnormality is detected in an attempt to carry out the startup control in a state where provision of services is secured.
Japanese Laid-open Patent Publication No. 2002-6996, Japanese Laid-open Patent Publication No. 5-166287, Japanese Laid-open Patent Publication No. 9-198325, and Japanese Laid-open Patent Publication No. 2007-293448 discuss technologies similar to the one described above.
However, when the information processing apparatus fails to startup in a state where provision of services is secured after detaching the module in which an abnormality is detected, a restart of the whole system becomes highly desirable. As a result, a startup time until the information processing apparatus is ready to provide services becomes longer.
Furthermore, the startup time until the information processing apparatus is ready to provide services may increase when a module is restarted every time an abnormality is detected.
In an information processing system where shut downs and start ups are repeated at regular intervals, such an increase of the startup time may lead to a delay of an operation following a certain time schedule.
According to one aspect, an object of the present disclosure is to provide an information processing apparatus, a startup program, and a startup method capable of controlling a delay time to startup one or more of redundantly configured modules when abnormalities are detected at the time of startup of the one or more of redundantly configured modules.

Apparatus and method for handling abnormalities occurring during startup


A process for storing data in a non-transient memory of a computer is proposed, whereby temporary memory cells are provided for the restoration of data lost due to switching off of the supply voltage. The temporary memory cells are sequentially loaded with the address, the data to be stored and various identification codes, so that the addressing and the data to be stored are safe guarded at all times. After switching off of the supply voltage an initialization routine is started, which tests the required memory cell content and, if necessary, loads them again.

The invention relates to a process for safeguarding the storage of data in a computer having a non-volatile memory.
When storing data in a memory cell of computerized controlling apparatuses with an attached memory, defective or incomplete data can he stored by switching off the supply voltage. Storing data in a memory cell of the memory can, for example, take 10 ms. If the voltage is switched off or impaired by interference during this time the memory cell can subsequently contain an undefined value. In other words, it is common that neither the new data is stored nor the old data is retained.
In order to safe guard the data to be stored multiple storage of these data is common practice and upon turning on the voltage again, the content of the memory cell is restored on the basis of conducting multiple decisions. For example, multiple storing can occur by means of three addresses, so that when voltage is turned on again, the content of the memory present in at least two of the memory cells is accepted. However, such multiple storage requires considerable expenditure of storage capacity and retention time.

Process for safeguarding transfer of data from a temporary part into a main part of a non-volatile memory


A photothermographic material, comprising at least a photosensitive silver halide, a non-photosensitive organic silver salt, a reducing agent and a binder, wherein a total silver iodide content of the photosensitive silver halide is 40% by mole or more and thermal development is started within 60 sec after exposure.

1. Field of the Invention
The present invention relates to photothermographic material and a method of forming an image using the photothermographic material.
2. Description of the Related Art
Recently, in the field of films for medical imaging, there is a strong demand for reducing the volume of waste processing liquid from the viewpoint of environmental preservation and economy of space. There have been demands for technologies relating to use of a photothermographic material as a film for medical imaging and a film for graphic arts. In particular, there is a demand for a photothermographic material that can be efficiently exposed by a laser image setter or a laser imager, and can provide black-toned images with high resolution and sharpness. Such a photothermographic material can provide users with a more simple and ecological thermal developing system without the use of liquid processing chemicals.
Although there are similar demands in the field of general image forming materials, high image quality (i.e., excellent sharpness and fine graininess) is particularly required for images used in medical imaging where high image quality of excellent sharpness and granularity are necessary. Further, images with blue-black tones are preferred from the perspective of facilitating diagnosis. Various types of hard copy systems using pigment or dye, such as an inkjet printer and an electrophotograph system, are commonly used as a general image forming system. However none of these is satisfactory as an output system for medical images.
In general, thermal image forming systems using organic silver salts are described in U.S. Pat. Nos. 3,152,904 and 3,457,075 and on pages 279 to 291, Chapter 9, "Thermally Processed Silver Systems," written by D. Klosterboer, in (Imaging Processes and Materials) Neblette, 8th edition, compiled by J. Sturge, V. Walworth and A. Shepp (1989), the disclosures of which is incorporated herein by reference.
A photothermographic material typically includes a photosensitive layer in which a photocatalyst (e.g., silver halide) of a catalytically active amount, a reducing agent, reducible silver salt (e.g., organic silver salt) and a toner for controlling the tone of a developed silver image as needed are dispersed in the matrix of a binder. After an image is exposed thereon, the photothermographic material is heated to a high temperature (e.g., 80° C. or above) to cause an oxidation-reduction reaction between a silver halide or a reducible silver salt (which acts as an oxidizing agent) and a reducing agent, thus providing a black silver image. The oxidation-reduction reaction is accelerated by the catalytic action of a latent image of the exposed silver halide. As a result the black silver image is formed in the exposed region (see U.S. Pat. No. 2,910,377 and Japanese Patent Application Publication (JP-B) No. 43-4924). Further, Fuji medical dry imager FM-DP L is an example of a practical medical image forming system using a photothermographic material that has been marketed.
In production of a thermographic system using an organic silver salt, two methods are available: in one method, a solvent coating is adopted and in the other method a coating liquid containing polymer fine particles as a main binder in an aqueous dispersion is applied and dried. In the latter method, since no necessity arises for a process of solvent recovery or the like, a production facility is simple and the method is advantageous for mass production.
Since such a thermographic system using an organic silver salt has no fixing step, there has been a considerable problem in image preservability after development, particularly with respect to degradation of a print-out when exposed to light. As means for improving the print-out, a method in which silver iodide formed through conversion of an organic silver salt is employed is disclosed in U.S. Pat. No. 6,143,488 and EP No. 0922995. In the method, such as described here, in which an organic silver salt is converted with iodine, however, a sufficient sensitivity cannot be obtained, which has led to difficulty in incorporation into an actual system.
As to other photosensitive materials using silver iodide, description thereof is given in WO (Laid-Open) Nos. 97-48014 and 97-48015; U.S. Pat. No. 6,165,705; Japanese Patent Application Laid-Open (JP-A) No. 8-297345; Japanese Patent No. 2785129 and others, in any of which neither a sufficient sensitivity nor a sufficient fog level is achieved, leading to a poor laser exposure photosensitive material which is not suitable for practical use. Development of a method has been awaited in which a silver halide rich in silver iodide content is effectively used to full performance.
JP-A No. 2000-305213 discloses an image forming method using a blue to ultraviolet laser beam and a photosensitive material therefor. However, no silver iodide is employed, resulting in insufficient sensitivity.
It has been understood from research conducted by the inventors of the invention that a photosensitive material of a high sensitivity and a high image quality is obtained by use of silver iodide in a system using a blue to ultraviolet laser beam.
Though a photosensitive material using silver halide with a high silver iodide content ensures practical sensitivity, the sensitivity thereof is still insufficient as compared with a level of expectation based on exposure being conducted at an absorption edge unique to silver iodide at which a high absorbance is realized.
That is, while it has been desired to achieve a full performance of a silver halide with a high silver iodide content since it is excellent in suppression of fogging and print-out, the current state of the art remains of insufficient sensitivity.

This patent is subject to a terminal disclaimer.

Photothermographic material and image forming method for the photothermographic material


An apparatus is provided for use in monitoring the level and temperature of a refrigerant, wherein the temperature of the liquid phase of the refrigerant is to be maintained below an established acceptable value. The apparatus includes a chamber interposed in a liquid line of a cooling system, wherein the chamber has a transverse cross-sectional area greater than the area of the liquid line, and is disposed at least partially above the line. A temperature sensor and a heater are provided within the chamber above the height of the liquid line and the sensor is connected to an alarm through a control which measures the temperature of the sensor and activates the alarm when the sensor temperature exceeds a predetermined value above the established acceptable value of the refrigerant liquid. The heater is of a temperature greater than the predetermined value so that when the liquid within the chamber falls below the temperature sensor and heater, heat is transferred to the sensor and raises the temperature of the sensor, and when the liquid level within the chamber reaches the sensor and heater, heat is transferred to the liquid and the temperature of the sensor is maintained at about the same value as the liquid.

1. Field of the Invention
The present invention relates generally to devices for monitoring the level and temperature of a liquid flowing through a fluid handling system and, more particularly, to a monitoring apparatus for providing an alarm when the flow or temperature of a liquid within a refrigeration system falls outside an established acceptable range of values.
2. Discussion of the Prior Art
Refrigeration-cycle systems are used to provide cooling in everything from residential air conditioners to commercial freezers such as those employed to cool refrigerated or frozen food counters in grocery stores.
A conventional commercial refrigerator or freezer includes a condenser, an evaporator, liquid and suction lines connected between the condenser and the evaporator to form a closed coolant system, a compressor, and a thermostatic expansion valve in the liquid line adjacent the evaporator. A liquid control valve is typically provided in the liquid line and is movable between a closed, defrost-cycle position restricting the flow of liquid through the liquid line, and an open, refrigeration-cycle position.
It is a known practice to defrost a commercial refrigeration system daily, and frequently twice daily, in order to maintain the efficiency of the system and prevent the formation of ice within the counter. An electrical circuit is provided in conventional systems for controlling the defrost cycle, and includes a switch for permitting operation of the liquid control valve to switch the system between the defrost cycle and the refrigeration cycle.
In order to permit maintenance personnel to monitor the level of refrigerant in the system, it is known to provide a sight glass within the liquid line which enables the personnel to view the flow of liquid through the line. When bubbles are visible in the line, low levels of coolant are present, providing an indication that replenishment is required. However, a certain amount of coolant is typically lost from the system before bubbles ever begin to appear in the sight glass, rendering early detection of coolant lose impossible.
This shortcoming in conventional systems has become significant in recent years with the concern for protecting the ozone from depletion due to the release of freon and other coolants to the atmosphere. Within the last four years, largely due to government imposed taxes, the price of freon has increased by a factor of five, bringing to the forefront a need to conserve freon in refrigeration systems whenever possible, and to stop leaks at an early stage.
New refrigeration systems are being marketed which include complicated monitoring systems for monitoring the level of liquid refrigerant in a receiver tank of the system, and which are capable of detecting certain types of leaks in the system. However, these systems are very expensive, and do not address the need of providing a reliable monitoring apparatus capable of use in existing, older units.

Liquid level and temperature monitoring apparatus


A cassette is provided having a base and a cover which is hinged to the base for closing the same and providing a light-tight space therebetween. A latching assembly is provided for latching and unlatching of the top of the base. A cushion member is secured in to the inside surface of the cover and an intensifying screen is secured to the outer surface of the cushion member. The cushion member comprises a first layer which is secured to the inner surface of the top cover an a second outer layer. The first layer is provided with a a cut-out portion for receiving the latch assembly. The second layer is superimposed on the first layer and covers the cut-out portion which receives said latch assembly. The first layer is made of a material having a first density and the second layer is made of a material having a second density greater than the first density such that a substantially uniform pressure is applied against the film placed in the space between top cover and base.

Typical prior art film cassettes comprise a cover which is hingedly mounted to a base such that when the cover is closed on the base, there is provided a light-tight space therebetween for receiving photosensitive x-ray film. Secured to the inside surface of the cover is a foam pad having an intensifying screen secured to its outer surface. When the cover is in the closed position, the foam pad and intensifying screen pushes the x-ray film firmly against the base of the cassette. Appropriate latching means are provided for latching and unlatching the cover with respect to the base. With cassettes that are designed for use in mammography it is important that the film be placed closely adjacent the edge of the cassette that is placed against the patient and that the best possible image be obtained along the edge as well as in the central area of the film.
A problem experienced with prior art cassettes is that there is a lack of good film contact between the intensifying screen and the adjacent a-ray film, especially along the edges of the film. Foam pads used in prior art cassettes typically comprise a single layer of a resilient material. The foam pad generally provides relatively little force at the edge areas of the film as opposed to the areas distal from the edges. Additionally, the latching mechanism is often provided adjacent the edge of the cassette to be placed against the patient. The foam pad and attached intensifying screen is simply placed directly over the latching mechanism which further contributes to inconsistent uniform contact between the intensifying screen and film in this area.
Applicant has invented an improved cassette which minimizes or eliminates many of the problems of the prior art and also provides a cassette that is easy and economical to manufacture.


A method of fabricating a color filter array including providing substrate, forming a multilevel structure that is attached to the substrate, etching the multilevel structure to expose first wells in the multilevel structure, filling at least the first wells in the multilevel structure with the first color component, curing the first color component, etching the multilevel structure to expose second wells in the multilevel structure, filling at least the second wells in the multilevel structure with a second color component, and curing the second color component.

Color filter arrays are used in a variety of electronic devices, including portable devices, such as laptop computers, and non-portable devices, such as flat screen televisions. Color filter arrays can be used to filter light that is later captured by a sensing element, such as in a digital camera, or to provide color in a flat panel display. Color filter arrays are used in display technologies, such as liquid crystal display (LCD) and organic light emitting diode (OLED) display technologies.
Typically, a color filter array includes many pixels and each pixel includes a number of colored sub-pixels that are separated from one another by a narrow black matrix. Each sub-pixel is a single color, such as red, green, blue, white, cyan, yellow, magenta, or another suitable color. Light is passed through a sub-pixel to display the sub-pixel's color. A different amount of light is passed through different sub-pixels to provide a large number of colors.
Often, color filter arrays are manufactured using photolithography on glass. Photosensitive colored dyes are applied to a sheet of glass and selectively exposed or cured and washed off to create the narrow black matrix and the sub-pixels. However, this requires a large number of steps and is cost prohibitive.

Method of fabricating a color filter array using a multilevel structure


A lens-fitted photo film unit is pre-loaded with a photo film of a predetermined length. The photo film is retained on a spool. A winder wheel is connected to the spool. After each frame is exposed on the photo film, the winder wheel is manually rotated to wind the photo film into a cassette shell about the spool. In the lens-fitted photo film unit, a combination of a detector cutout and a protruded portion detects that the winder wheel has made a predetermined number of rotations, which depends upon the predetermined length of the photo film. A combination of a recess and a protruded portion locks rotation of the winder wheel in response to rotation of the winder wheel to a predetermined rotational position after the predetermined number of the rotations of the winder wheel. The winder wheel is inhibited from being rotated after the photo film is entirely wound into the cassette shell.

1. Field of the Invention
The present invention relates to a lens-fitted photo film unit. More particularly, the present invention relates to a lens-fitted photo film unit pre-loaded with a photo film cassette, and of which the photo film cassette being removed after exposures can be safely handled.
2. Description Related to the Prior Art
There is a lens-fitted photo film unit pre-loaded with a photo film, and provided with a simple construction for taking exposures. The photo film is contained in the lens-fitted photo film unit in a state where a trailing end of the photo film is secured to a spool. The spool is contained in a cassette in a rotatable manner. A winder wheel is connected to the spool, and after each exposure, is rotated to wind an exposed portion of the photo film into the cassette. The cassette can be unloaded from the lens-fitted photo film unit in an illuminated room, not in a dark room. There is a type of the lens-fitted photo film unit in which a cassette shell is formed from resin, contains the photo film, and in which an operation of inserting the photo film into the lens-fitted photo film unit is facilitated.
There is a photo film passageway or mouth, defined along a line between the shell halves, for passage of the photo film between the inside and the outside of the cassette shell. A cassette shutter is contained in an inner position of the passageway, and rotates to open/close the passageway. There are indicator openings formed in one of end faces of the cassette shell where an indicator plate is disposed. The indicator openings are different in the shape, and associated with respective meanings of "Unexposed", "Partially exposed", "Exposed" and "Developed" statuses of the photo film. The indicator plate with the spool rotates in its position behind the indicator openings inside the cassette shell, and is stopped in any one of the indicator openings. One meaning associated with one of the indicator openings through the indicator plate is visible implies the status that the photo film has in the cassette shell.
After taking exposures in all of the available frames, a user forwards the lens-fitted photo film unit to a photo laboratory and requests photo finishing of the photo film. A photofinishing operator of the photo laboratory removes the cassette from the lens-fitted photo film unit. Before the cassette is removed from the lens-fitted photo film unit, the winder wheel is checked by applying rotary force to it by the operator. This is because it should be confirmed that the entirety of the photo film has been wound into the cassette shell. Since this cannot be confirmed by observing the appearance of the lens-fitted photo film unit, rotary force is manually applied to the winder wheel for the confirmation. There is, however, a problem in that such a manual operation is very slow and inconsistent with high efficiency in the photofinishing operation.
In a camera for use with the cassette, there is a photo sensor for detecting a rotational position of the spool. To remove the cassette from the camera, the indicator plate is controlled to stop behind the indicator opening indicating the "Exposed" status. This is for the purpose of avoiding erroneously reloading a camera with the cassette being used. However the lens-fitted photo film unit does not have such a construction for reasons of cost, a space for incorporation and the like. The indicator plate of the cassette removed from the lens-fitted photo film unit is not in a predetermined position. If a user unloads the cassette being used from the lens-fitted photo film unit, the indicator plate is likely to stop behind the indicator opening indicating the "Unexposed" status. The user is likely to incorrectly load a camera with the cassette being used.


Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are formed and a second semiconductor chip section in which a logic circuit and a multilayer wiring layer are formed to each other in such a manner that the multilayer wiring layers are opposed to each other and are electrically connected to each other; and a light blocking layer configured to be formed by an electrically-conductive film of the same layer as a layer of a connected interconnect of one or both of the first and second semiconductor chip sections near bonding between the first and second semiconductor chip sections. The solid-state imaging device is a back-illuminated solid-state imaging device.

The present disclosure relates to a solid-state imaging device, a manufacturing method thereof, and an electronic apparatus including a solid-state imaging device, such as a camera.
The CMOS (Complementary Metal Oxide Semiconductor) solid-state imaging device is known as a solid-state imaging device and this CMOS solid-state imaging device is widely used in digital still cameras, digital video camcorders, etc. In recent years, as the solid-state imaging device mounted in a mobile apparatus such as a cellular phone equipped with a camera and a personal digital assistant (PDA), the CMOS solid-state imaging device, whose supply voltage is low, is frequently used in view of the power consumption and so forth.
In the CMOS solid-state imaging device, the unit pixel is formed with a photodiode serving as a photoelectric converter and plural pixel transistors. The CMOS solid-state imaging device has a pixel array (pixel area) in which the plural unit pixels are arranged in a two-dimensional array manner and a peripheral circuit area. The plural pixel transistors are formed of MOS transistors and are composed of three transistors, i.e. a transfer transistor, a reset transistor, and an amplification transistor, or four transistors further including a selection transistor in addition to these three transistors.
As such a CMOS solid-state imaging device, there have been proposed various related-art solid-state imaging devices configured as one device by electrically connecting a semiconductor chip in which the pixel array obtained by arranging plural pixels is formed to a semiconductor chip in which a logic circuit to execute signal processing is formed. For example, Japanese Patent Laid-open No. 2006-49361 discloses a semiconductor module obtained by connecting a back-illuminated image sensor chip having a micro-pad for each pixel cell to a signal processing chip having a signal processing circuit and a micro-pad by a micro-bump.
WO2006/129762 discloses a semiconductor image sensor module obtained by stacking a first semiconductor chip including an image sensor, a second semiconductor chip including an analog/digital converter array, and a third semiconductor chip including a memory element array. The first semiconductor chip is connected to the second semiconductor chip via a bump as an electrically-conductive connecting conductor. The second semiconductor chip is connected to the third semiconductor chip by a penetrating contact that penetrates the second semiconductor chip.

Solid-state imaging device, manufacturing method thereof, and electronic apparatus


A method and device for searching a recording medium are provided. The recording medium has a management information area of which location information is overlapped with that of a program area. The method for determining an area on a recording medium having an overlapped time range between two areas reads a time address from a current position on the recording medium, obtains additional information from the recording medium or from a recording medium driving unit, if the read time address belongs to the overlapped range, and determines, based on the obtained additional information, to which one the areas the current position belongs. Therefore, it prevents wrong track jumps that are caused from time-overlapped areas on a capacity-expanded recording medium.

1. Field of the Invention
The present invention relates to a method and device for searching a recording medium having a management information area whose location information is overlapped with the location information of a program area of the recording medium.
2. Description of the Related Art
In general, a disk-type recording medium such as, e.g., a CD-RW, has wobble recording tracks on which ATIP (Absolute Time in Pregroove)-framed data are stored during its manufacturing stage or prior to any data is recorded thereon by a user. As known, the ATIP-framed data are pre-encoded on the recording medium in a wobble shape by frequency modulation.
FIG. 1 shows an example of a general ATIP frame. Each ATIP frame carries certain bits of information. As shown in FIG. 1, if the first bits (M1, S1, and F1) of the 'minutes', 'seconds' and 'frames' fields of the ATIP frame is '000', then these fields are considered to contain an ATIP time code. An ATIP time code is location information for the recording medium and is used to indicate a particular location on the recording medium at which data/information is stored.
FIG. 2 is a graph of an ATIP time code for a general writable disk. As shown in FIG. 2, an ATIP time code TC1 corresponding to a program area (data area) of the disk increases linearly from 0 (zero) to a maximum value of 79:59:74 in the outwardly direction of the disk. An ATIP time code TC2 corresponding to a lead-in area (management information area) of the disk decreases linearly from 99:59:74 to some value in the inwardly direction of the disk towards the disk center.
Generally, the management information area (MIA) including the lead-in area of the disk is about 4˜5 minutes in time code size where its time code ranges from about 95 to 99 minutes. On the other hand, the program area of the disk ranges from 0 to about 80 minutes in time code size because its recording capacity is about 80 minutes. Due to the gap between 80 minutes and 95 minutes in time code, the ATIP time code of the management information area of a general disk-type recording medium does not overlap with the ATIP time code of the program area (PA) of the recording medium. As a result, time codes have been used to distinguish between the management information area and the program area of the recording medium during data recording operations.
However, the storage capacity of a conventional disk-type recording medium is being expanded in these days due to the advancement of technology. Due to this effort, a recording medium having a recording capacity (program area) of 99 minutes has been introduced. But, such expansion of recording capacity introduces another problem to the recording medium. Due to the expanded capacity of the recording medium, the recording medium now has an overlapping time code range.
FIG. 3 shows a graph of ATIP time codes of a conventional, capacity-expanded writable disk, illustrating an overlapping range of the time codes between the program area and the management information area of the disk.
As shown in FIG. 3, there are an expanded ATIP time code TC1′ for the program area, and an ATIP time code TC2 for the management information area of the disk. The end part of the ATIP time code TC1′ of the program area of the disk is overlapped with the ATIP time code TC2 of the management information area of the disk, because the recording capacity of the disk has been expanded to 99:59:74 in time code.
The overlapped ATIP time codes cause certain serious problems. For instance, if an ATIP time code falls within the overlapped ATIP time code range, it often becomes difficult and impossible to know whether a current recording position of the disk is in the management information area or in the program area since the time code would equally apply to both the management information area and the program area. As a result, data can be written in the wrong area of the disk.
As an example of this problem, assume that a particular time address among 95˜99 minutes in ATIP time code is requested to a disk device to record information in the lead-in area of the disk at the requested time address. But, if an optical pickup slides erroneously to an outer program area having the time code of 95˜99 minutes during a track jump, then the information to be written in the lead-in area (management information area) would instead be recorded in the outer program area, which is completely undesired. Further, even if control signals have been applied to the optical pickup to move the pickup to the desired location in the lead-in area of the disk, if a servo fails then the pickup can be erroneously moved to the program area of the disk, which will result in the recording of the information in the wrong area because the requested time code has applicability both in the program area and the management information area of the disk.
In addition to the use of the ATIP time code as location information of the disk, another way to identify a particular location on the disk is to use an absolute time (MM:SS:FF). As known, when data are recorded on a recording medium such as a CD-Rom, an absolute time (MM:SS:FF) is written in a sub-Q channel of every data block. The absolute time is location information used to indicate locations on the recording medium. A distraction between the ATIP time code and the absolute time is that the ATIP time codes are carried inherently on the disk by the wobbling of the physical tracks on the disk, whereas the absolute times are recorded values made during a recording operation.
If a recording medium has an expanded 99-minute data recording capacity such that the absolute time in the program area of the recording medium has been extended up to (99:59:74) in absolute time, then the absolute time of the management information area of the recording medium will overlap with the absolute time of the program area of the recording medium, similar to what is shown in FIG. 3.
Generally, a disk device such as a recording/reproducing device cannot monitor the time codes of ATIP frames during a data reading (reproducing) because of the hardware structural limitations. Instead, the disk device is configured to monitor the absolute time written in the sub-Q channel of reproduced data. As a result, since the absolute times of the program area and the management information area of the disk overlap with each other as discussed above, then the problem of reading data to a wrong location on the disk can occur even if the correct absolute time has been identified.
For example, assuming that a host sent to a disk device a command to read data from an arbitrary position in the management information area of the disk. But, at this time, if an optical pickup slides erroneously to an outer program area (having the absolute time of 95˜99 minutes) during a track jump, then the disk device would read data from the undesired program area, instead of the desired management information area, whereby wrong information/data would be read and provided to the host.

Searching method and device for a recording medium having overlapped time address


Techniques for supporting MIMO transmission are described. Users are classified into a first group of users to be scheduled individually for MIMO transmission and a second group of users that can be scheduled together for MIMO transmission. Transmission resources are allocated to the first and second groups, e.g., based upon various criteria such as the number of users in each group, data requirements of the users, total loading for each group, etc. The transmission resources may be hybrid automatic retransmission (HARQ) interlaces, frequency channels, time frequency resources, etc. The resource allocation may be semi-static. The transmission resources allocated to each group are used for data transmission on the downlink and/or uplink for the users in the group. HARQ with blanking may be used for data transmission for the users in the first group. HARQ without blanking may be used for data transmission for the users in the second group.

I. Field
The present disclosure relates generally to communication, and more specifically to techniques for transmitting data in a wireless communication system.
II. Background
Wireless communication systems are widely deployed to provide various communication services such as voice, packet data, broadcast, messaging, etc. These systems may be multiple-access systems capable of supporting communication for multiple users by sharing the available system resources, e.g., bandwidth and transmit power. Examples of such multiple-access systems include Code Division Multiple Access (CDMA) systems, Time Division Multiple Access (TDMA) systems, Frequency Division Multiple Access (FDMA) systems, and Orthogonal FDMA (OFDMA) systems.
A wireless multiple-access system includes Node Bs (or base stations) that can communicate with user equipments (UEs). Each UE may communicate with one or more Node Bs via transmissions on the downlink and uplink. The downlink (or forward link) refers to the communication link from the Node Bs to the UEs, and the uplink (or reverse link) refers to the communication link from the UEs to the Node Bs.
A wireless multiple-access system may support multiple-input multiple-output (MIMO) transmission on the downlink and/or uplink. On the downlink, a Node B may send a MIMO transmission from multiple (T) transmit antennas at the Node B to multiple (R) receive antennas at one or more UEs. A MIMO channel formed by the T transmit and R receive antennas may be decomposed into C spatial channels, where C≦min {R, R}. Each of the C spatial channels corresponds to a dimension. Improved performance (e.g., higher throughput and/or greater reliability) may be achieved by exploiting the additional dimensionalities created by the multiple transmit and receive antennas.
There is therefore a need in the art for techniques to efficiently support MIMO transmission in a wireless multiple-access system.

Resource allocation to support single-user and multi-user MIMO transmission


The present disclosure relates to a module structure of a liquid crystal display, the module structure includes a panel glass assembly, a backlight assembly and a display housing retaining wall; an accommodating space formed by the display housing retaining wall accommodates the panel glass assembly and the backlight assembly; the panel glass assembly includes a front glass sheet, a rear glass sheet and a sealant for sealing a liquid crystal accommodating space between the front glass sheet and the rear glass sheet. The module structure is characterized in that, a filling gap is provided between outer peripheral surfaces of the front glass sheet and the rear glass sheet of the panel glass assembly and an inner peripheral surface of the display housing retaining wall facing the outer peripheral surfaces; and a panel edge protective adhesive is filled in the filling gap. The present disclosure also relates to a manufacturing process of the module structure.

Liquid crystal displays (LCDs) have been widely used in industrial control man-machine interface products. Due to the harsh usage environment of industrial control products, the service life for continuous operation of an equipment and the quality assurance for high-reliability operation of the equipment, users' requirements of reliability on industrial displays have been considerably increased as compared to consumer products. Especially, for power distribution products, they are usually installed in natural environments with high temperature and humidity as well as wide temperature range, and people have extremely high requirements on the continuity of power supply. Therefore, stricter requirements are raised from users on the reliability of displays used in power distribution products. In order to meet the high reliability requirements on the displays of products for special industrial application, it is necessary to propose a designing method and a manufacturing process of LCD modules with high reliability requirements.
Common failure modes of a LCD include disconnection, black spot, no display and the like. The failure mechanism of disconnection and no display is that, a wiring on a LCD panel is broken due to electrochemical corrosion, while the failure mechanism of black spot is that, a sealing performance of a sealant around the LCD panel is invalid, which results in a leakage of liquid crystal inside the display panel or causes ambient water vapor to penetrate into the display panel. In order to avoid an occurrence of these failure mechanisms, the existing technical solution usually is to coat a terminal part protective adhesive on a lead terminal of the LCD, and at the same time, a module housing (or backlight) retaining wall is designed around the display panel to avoid a contact with a human hand or prevent foreign matters from entering a gap between an upper glass sheet and a lower glass sheet of the panel. Moreover, in the design of the display panel, a high-reliability panel sealant and measures for increasing a width of the panel sealant can be adopted depending on the customer's reliability requirements. FIG. 1 is a structural diagram of an existing module structure of LCD, which is characterized in that a terminal part attached to a LCD controller is coated with a terminal part protective adhesive. At the same time, a module housing retaining wall is provided around the LCD panel, and the LCD panel is closely attached onto the module housing retaining wall to prevent foreign matters from entering the a gap of the panel.
However, these solutions can only meet the reliability requirements of general industrial displays. When designing display panels, the selection of panel sealant is determined according to the preset reliability requirements. Once the design is finalized, users can no longer request panel manufacturers to change the design. Therefore, if it attempts to further improve the reliability of the display and meet the requirements of high reliability and long-term operation in harsh industrial environments, improved protective measures have to be adopted in module design.

Module structure of liquid crystal display and manufacturing process of module structure


A mobile object control system has an SfM unit detecting distance to an object imaged by a monocular camera by using the SfM algorithm, a first-stop-position output unit outputting a first stop position, a second-stop-position calculating unit calculating a second stop position closer than the first stop position, and a control unit controlling travel of a mobile object. The control unit controls the mobile object so as to stop at the second stop position. When a predetermined starting condition is satisfied, the control unit controls the mobile object so as to start. The SfM unit detects the distance to an object by using an image captured by the monocular camera after the mobile object starts. When a result of detection of the distance of the object by the SfM unit is obtained, the control unit uses the detection result for control of the travel.

The present invention relates to a mobile object control system, a mobile object control method, and a program and, for example, relates to a mobile object control system, a mobile object control method, and a program accompanying distance detection using an SfM algorithm.
In recent years, attention is being paid to a technique of detecting distance to an object by using a camera. In a technique using a stereo camera, distance can be measured by using the parallax of two cameras facing in the same direction. Since a stereo camera has two cameras, the cost is high. Consequently, various methods of measuring distance without using a stereo camera have been proposed.
As one of them, SfM (Structure from Motion) as an algorithm capable of measuring distance to an object by using a monocular camera is known. The SfM is an image processing algorithm of estimating the position of a monocular camera by performing detection of distance to an object and object's motion detection on the basis of an image obtained by the monocular camera.
Regarding this, for example, Patent Literature 1 (Japanese Unexamined Patent Application Publication No. 2015-219745) discloses a technique of calculating a camera position by using the SfM and generating a three-dimensional map. Patent Literature 2 (Japanese Unexamined Patent Application Publication No. 2012-123296) discloses a technique of detecting a photographic-subject distance by using both distance detection by a stereo camera and distance detection using the SfM.
In the case of providing an in-vehicle device with the image processing technique using the SfM, detection of the motion of an object other than one's vehicle, detection of the distance between the object other than the one's vehicle and the vehicle, and estimation of the position of the vehicle can be performed. Objects other than one's vehicle include stationary objects and mobile objects such as other vehicles and humans. Until now, it is regarded that the precision of the distance detection using the SfM is insufficient. However, the sufficiency of precision is being improved by increase in the number of pixels which are input and device of processes. Consequently, an application technique of the distance detection using the SfM is being expected.

Mobile object control system, mobile object control method, and program


A fired heater has two cells segregated by an insulative wall. A first plurality of burners are located in the first cell and a second plurality of burners are located in the second cell. A radiant tube extends from the first cell to the second cell for carrying a fluid material through the heater to heat the fluid material. The flow of fuel to the burners in either the first cell or the second cell can be terminated to accommodate lower heater duty when demand is lower.

Fired heaters burn hydrocarbon fuels to indirectly exchange heat with a process fluid in route to a process unit. In hydrocarbon processing technologies, operators would like to turn down heater duty to meet the process unit demand. Turn down for various operating cases can be as low as 25% of the heater design duty.
Due to environmental regulations that tend to reduce the allowable emissions to the environment, there is an increasing demand that fired heaters be equipped with low NOx burners. For low NOx burners to have stable operation, ensure flame stability and minimize CO emissions, there is need to maintain a minimum bridge wall temperature (BWT) which is the temperature of the flue gas when it exits the radiant section of the heater and transitions to the convection section of the heater. Furthermore, operation with excess air may also be required at high turndown conditions to maintain stable burner operation which negatively affects fuel efficiency of the heater. BWT decreases as the heater turndown increases. Consequently, turndown duty that a fired heater can achieve is limited and often a compromise heat integration scheme must be developed to utilize the excess heater duty generated.
A fired heater that can be turned down to a greater degree and meet these other considerations would be greatly desired.


A wall panel system for constructing clean rooms includes wall panels, wall studs and a "z" bracket assembly device for mounting the wall panels to the wall studs. The wall panels are covered with a protective covering of a hard core plastic laminate or a shatter-proof polyvinyl chloride (PVC) which provides a sanitizing surface. Also, the system includes wall panel seam filling, internal corner covering and external corner covering to preserve the integrity of the clean room. At least one door is provided for access to the clean room and one window may be provided for viewing access to the room. The room is constructed to provide a particulate-free environment.

1. Field of the Invention
The present invention concerns building wall panel systems. More particularly, the present invention concerns mounting assemblies for building wall panel systems. Even more particularly, the present invention concerns mounting assemblies for building wall panel systems and clean rooms constructed therewith.
2. Description of the Prior Art
"Clean rooms" are substantially particulate free structures which are used in the pharmaceutical industry and in other environments where it is a prerequisite that conditions be maintained which do not attract or generate particulates.
In constructing such rooms, it is essential that the interior of the room be capable of being maintained particulate free under all conditions. Thus, it is necessary that the number of exposed joints, seams, crevices and the like be minimized.
Traditionally, clean rooms or non-clean room wall assembly systems use some version of a batten strip or the like, such as a joining strip to unite together wall panels and to cover the gap at the wall panel intersections or joints.
For example, U.S. Pat. No. 4,028,856 discloses a panel retainer which is placed over the intersection of each adjoining panel and then screwed to a stud. The disadvantages of this type of panel retainer in a clean room environment become apparent. The number of particulate collecting areas are compounded because the retainer now provides two edges at each wall joint for particulate collection.
To eliminate the batten and to provide ease of assembly, magnetic stripping has been proposed. For example, U.S. Pat. No. 4,835,923 shows a prefabricated wall assembly system using magnets. However, the magnets act as collectors of metallic dust which will then act as a collector of other contaminants; and the magnets seriously affect the operation of electronic instruments in the clean room.
In U.S. Pat. No. 4,897,976, there is disclosed a system for assembling a total building using prefabricated wall panels and assembly fixtures. This method of assembly uses a spline and a vertical bracket to hold the panels in place. This provides a wall that is long-standing and withstands severe wind conditions. However, the system is difficult to assemble and disassemble. It is durable, but not portable. Also, there is no provision in this structure to provide for maintaining clean room integrity. The intersecting joints are all exposed and act as collection points for particulates and contaminating dust.
Thus, it would be desirable to have a wall panel assembly system which facilitates assembly and eliminates particulate and contamination collection areas. The present invention addresses these matters.

Panel system and clean rooms constructed therefrom


A sprue and valve assembly (22) delivers a curable liquid material to a mold cavity (26) and thereafter is easily cleaned of the cured residual core (52) remaining from the liquid material. A sprue (34) having a flow passage (36) extends between the exterior surface of a mold (24) and a runner (30) in the mold (24). A valve body (54) is connected to the exterior face of the sprue (34). A coin slide type closure element (56) within the valve body (54) is controlled by a lever mechanism to selectively open or close the flow passage (36) to the curable liquid material flow. The flow passage (36) is tapered to permit easy removal of the cured residual core (52). PTFE seals (74) are disposed on opposite sides of the closure element (56). A bayonet fitting permits quick connection and disconnection of a supply line (18) to the valve body (54). An ejector assembly (80) connects to the bayonet fitting and includes an ejector shaft (84) which is manually struck to eject the cured residual core (52) held fast within the flow passage (36).

Resin transfer molding (RTM) is a well known method of producing large composite structures, such as vehicular bumpers and the like. According to present RTM technology, two liquid components, a resin and a hardener, are mixed together and immediately transfer through a supply line to a shut off valve located immediately upstream of a sprue leading into the mold and ultimately to a mold cavity. Once the mold cavity has been filled, the valve is closed and the supply line detached from the valve. The entire mold, sprue and valve assembly is then heated to a curing temperature so that the mixed resin solidifies around the reinforcing matrix to form a rigid and durable product. The mold is then opened and the product removed from the mold cavity. However, before the mold can be cycled again, the cured resin must be removed from the sprue and valve assembly.
Because the resin material, once cured, is extremely hard and adheres steadfastly to all contacting surfaces, the sprue and valve assembly frequently becomes clogged with a cured residual core of resin. Because the prior art has not found a more efficient method of removing the cured residual core from the flow passage in the sprue and valve assembly, the prevalent technique for cleaning the sprue and valve assembly is to drill out the cured residual core. Thus, according to the most advanced prior art techniques, the sprue and valve assembly must be cleaned of the cured residual core between each cycle of the mold by drilling out the cured residual core.

Sprue and valve assembly for delivering a curable liquid material to a mold cavity


A plasma reaction apparatus has main and auxiliary magnetic field generating coils for generating a magnetic field which has a gradient of no more than 50 gauss/cm in the axial direction and a difference between the axial magnetic field gradient and the magnetic field gradient ten centimeters from the axis of no more than 10 gauss/cm for processing a semiconductor substrate. The plasma reaction apparatus is able to generate a high density, uniform plasma so that the semiconductor substrate is uniformly processed at high speed.

1. Field of the Invention
The present invention relates to a plasma reaction apparatus, and, more particularly, to a plasma reaction apparatus for etching the surface of a semiconductor substrate with a gas discharge.
2. Description of the Related Art
When a semiconductor device is manufactured, the semiconductor substrate is subjected to processes such as a thin film forming process and an etching process. A semiconductor substrate processing apparatus, may generate a plasma in a gas discharge.
FIG. 5 is a schematic cross sectional view which illustrates an ordinary conventional plasma reaction apparatus 100 in which a plasma is generated by ECR (Electron Cyclotron Resource) discharge.
Referring to FIG. 5, the plasma reaction apparatus 100 comprises a reaction chamber 1, and a waveguide tube 6 for introducing microwaves into the reaction chamber 1, a quartz plate 7 serving as an introduction port through which the microwaves are introduced. A single solenoid coil 4 serving as a magnetic field generating means and a mirror coil 5 are disposed outside the reaction chamber 1, the single solenoid coil 4 surrounding the reaction chamber 1. A gas introduction port 8 is formed in the upper portion of the reaction chamber 1 and an exhaust port 13 is formed in the bottom portion of the reaction chamber 1. Furthermore, the reaction chamber 1 includes a supporting frame 3 on which a semiconductor substrate 2 is placed.
The thus structured apparatus is operated as follows. The inside portion of the reaction chamber 1 is exhausted by means of a vacuum pump (omitted from illustration) through the exhaust port 13. Then, a reactive gas is introduced into the reaction chamber 1 through the gas introduction port 8, and a portion of the reactive gas is exhausted through the exhaust port 13 while continuing the gas introduction into the reaction chamber 1 so as to make the gas pressure constant. Furthermore, microwaves having a frequency of 2.45 GHz and generated by a microwave power source (omitted from illustration) are introduced into the reaction chamber 1 via the waveguide tube 6 and the quarts plate 7. On the other hand, electricity is supplied to the single solenoid coil 4 disposed around the reaction chamber 1 so as to cause the solenoid coil 4 to generate a magnetic field for exciting ECR, that is a magnetic field having a magnetic flux density of 875 gauss in the reaction chamber 1. Also the mirror coil 5 is supplied with electricity so that it generates a magnetic field in the same direction as that generated by the solenoid coil 4. As a result, a weak mirror magnetic field is created between the solenoid coil 4 and the mirror coil 5 so that magnetic lines of force are perpendicular to the surface of the semiconductor substrate 2.
As a result of the above-mentioned operation, reactive gas molecules in the reaction chamber 1 are formed into a plasma due to collisions with electrons accelerated by the ECR. The reactive gas plasma thus generated is dispersed along the magnetic lines of force so that the dispersed reactive gas plasma is perpendicularly incident on the surface of the semiconductor substrate 2 on the supporting frame 3. At this time, the surface of the semiconductor substrate 2 is etched in a desired direction. The type and the pressure of the gas, and the microwave power and the like are determined according to the process to which the semiconductor substrate 2 to be processed is subjected.
In the plasma reaction apparatus 100 utilizing the ECR discharge, the resonance region is not widely and uniformly formed because the magnetic field required for the electron cyclotron resonance is generated by the single solenoid coil 4. That is, it has been difficult to obtain an etching apparatus revealing a high etching rate and satisfactory uniformity. The reason for this will now be described with reference to FIG. 6 which is a graph showing the relationship between solenoid electric current values and etch rates while also referring to uniformity data.
When the electric current supplied to the solenoid coil 4 is small, that is, about 160A as shown in FIG. 7, the gradient of the magnetic field is small in the ECR region in the vicinity of the center of the reaction chamber 1 and the gradient of the magnetic field increases in proportion to the distance from the center. Therefore, a non-uniform resonance region distribution is (as will be described later with reference to FIG. 7) displayed as follows: the resonance region is distributed widely in the center portion of the reaction chamber 1 and narrowed in inverse proportion to the distance from the center as shown by the diagionally-lined area 11 in FIG. 5. On the other hand, in a case where the value of the electric current supplied to the solenoid coil 4 is large, that is, about 190A,. a uniform ECR region is formed as shown by the diagonally-lined area 12 in FIG. 5 because the gradient of the magnetic field in the ECR region is great (as will be described later with reference to FIG. 7). However, the uniform magnetic field has been too narrow and therefore only a narrow resonant region has been formed.
Results of experiments carried out by using the conventional plasma reaction apparatus will now be described with reference to FIGS. 6 and 7.
The specifications of the coil used in the experiment are as follows: the inner diameter was 27 cm, the outer diameter was 39 cm, the axial directional length was 14 cm and the number of turns was 160. An Si-substrate having a diameter of 6 inches was etched by a plasma generated under conditions that the flow rate of chlorine gas was 10 cc/minute, the pressure was 0.5 mTorr and the microwave power was 600 W.
According to the magnetic field characteristics shown in FIG. 7, the gradient of the magnetic field parallel to the axis of the magnetic field is small when an electric current having a small value is supplied to the coil. The value of the axial gradient along the central axis (R=0 cm) and at a point (R=10 cm) 10 cm distant from the central axis are considerably different from each other.
Since the magnetic field gradient and the area of the ECR region are in inverse proportional relationship, a wide ECR region is formed when the magnetic field gradient is small. As a result, the density of the generated plasma is increased. Therefore, the etch rate is raised in a case where the value of the electric current supplied to the coil is small as shown in FIG. 6.
Although it is preferable that the practical etch rate be 1000.ANG./min or higher, the uniformity of the magnetic field becomes worse, excessively so, to 20% or more, and the ECR region is distributed as shown by the diagonally-lined area 11 in FIG. 5 when the etch rate is increased. As a result, desired uniformity of etching on the semiconductor substrate 2 cannot be obtained.
On the other hand, if a uniform ECR region (represented by reference numeral 12 shown in FIG. 5) is desired (adjacent to the coil electric current of 190A shown in FIG. 6), the ECR region is narrowed and a practical etch rate of 1000.ANG./min cannot be obtained.
As described above, the conventional plasma reaction apparatus using ECR therefore encounters a problem that an increase in the etching speed and an improvement of the uniformity of the magnetic field cannot be realized simultaneously.
That is, as can be understood from the above description, the axial gradient of the magnetic field and the etch rate have a close relationship. Furthermore, the uniformity of the gradient of the magnetic field must be improved in order to improve the uniformity of the etch rate. The radial directional uniformity of the gradient of the magnetic field shown in FIG. 7 is calculated by the following equation 1 from the larger and the smaller of the gradients of the magnetic field in a region at a central axis (R=0) to the point of 10 cm distant from the central axis (R=10 cm): ##EQU1##
As can be seen from a dashed curve shown in FIG. 7, increasing the electric current supplied to the coil improves the uniformity of the gradient of the magnetic field and coincides with an increase in the uniformity of the etch rate as shown in FIG. 6.
However, there arises a problem in that, if an enlarged electric current is supplied to the coil in order to improve the uniformity of the gradient of the axial magnetic field, the value of the gradient of the magnetic field is undesirably increased and therefore the etch rate deteriorates.

ECR plasma reaction apparatus having uniform magnetic field gradient


A separable pliers having a pair of arms separably hinged together. They may be separated only when the handles are far enough apart. A lip on one handle, and a hook on a bias spring integral with the other handle engage one another to restrain the handles from opening that far unless and until the spring is bent to release the hook from the lip, after which the arms can be separated.

Orthodontic pliers which include two separable parts are well known. Each one of two parts has a handle and some type of jaw device. The parts are joined by a hinge which must be disassembled to separate the parts. The ultimate objective is to provide a strong and reliable pliers construction which wears well, and whose parts are amenable to simple cleaning and sterilization procedures. Uncomplicated procedures and physical arrangements for hinge separation are much to be preferred.
Examples of known separable pliers are Fowler III U.S. Pat. No. 5,197,879 and Ingels U.S. Pat. No. 5,232,360. The Fowler pliers illustrate the problems when a pinless hinge is used. It relies on a dovetail arrangement that holds the parts together throughout a pre-established amount of opening of the handles and jaws. Beyond that limit, the parts fall apart from one another. Either some releasable means must be provided to limit this movement, or care must be taken by the user to prevent movement beyond the limit. The relatively short dovetail surfaces take the wear caused by squeezing of the handles together. Ultimately this wear will cause undesirable sloppiness of action, or some adjustment means must be provided.
The Ingels patent provides a hinge that has a pin and a recess which both center the parts and take the wear over a substantial area. The parts are prevented from separating by overhanging shoulders of limited extent, and readily separate when their handles are separated beyond this extent, but are held by an extra spring.
It is an object of this invention to provide a separable pliers in which the separation of the handles is limited by the same spring which biases the handle apart. This provides a pliers which is reliably held together and which can readily be disassembled by the simple deflection of the spring.


The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.

1. Field of the Invention
The present invention relates to an improved memory system mounted directly on a motherboard and an associated method.
2. Description of the Related Art
Most computer systems allow for memory expansion using memory modules. Memory modules—for example, single inline memory modules (SIMMs) and/or dual inline memory modules (DIMMs)—are small, compact circuit boards that are designed to connect easily into an expansion socket mounted on a main circuit or motherboard.
FIGS. 1 and 2 are diagrams of computer system 100's memory architecture. Referring to FIGS. 1 and 2, a system 100 includes a plurality of memory modules 106 controlled by a memory controller 104. The memory controller 104 controls read and write operations relating to the memory modules 106. The memory controller 104 is mounted on the main or motherboard 102. The operation of the memory controller 104 is well known to a person of reasonable skill in the art and will not be discussed any further.
The memory modules 106 oftentimes include edge connectors 114 comprising a plurality of contact pads 116. The contact pads 116 are typically present at both sides of the modules 106. A plurality of receptacles, e.g., sockets 112, is mounted on the motherboard 102. The sockets 112 receive the edge connectors 114 to thereby electrically couple the motherboard 102 to the memory modules 106. More particularly, the sockets 112 electrically couple traces routed on the motherboard 102 to traces routed on the memory modules 106.
The memory modules 106 include a plurality of memory devices 108. These memory devices 108 are, for example, dynamic random access memory (DRAM) or synchronous dynamic random access memory (SDRAM). A buffer 110 controls and buffers commands and addresses (C/A) it receives from the memory controller 104. The plurality of memory devices 108 and the C/A buffer 110 are mounted on the memory module 106.
Signal traces are routed on both the motherboard 102 and the modules 106. These signal traces might include a data bus DQ, system clock signal CLK, and C/A bus. The memory devices 108 and the buffer 110 receive signals from a controller 104 through the corresponding socket 112 mounted on the motherboard 102.
In any memory architecture, it is important to maintain the signal integrity of the address, control and clock signals. Maintaining signal integrity becomes more difficult as the operating frequency increases because of transmission line effects, including signal reflection.
In transmission line theory, the connection between the motherboard 102 and the module 106 through the socket 112 is termed a stub load. Stub loads present a transmission discontinuity that results in signal reflection and ultimately, adversely affects signal integrity.
Referring to FIGS. 1–3, a signal trace 302, e.g., the data bus DQ, is routed on the motherboard 102. The signal trace 302 is electrically coupled to a signal trace 304 routed on the module 106 through the socket 312. But the socket 312 presents a discontinuity 306 between the signal trace 302 and the signal trace 304. The discontinuity 306 causes a portion of the signal to reflect back injecting noise, as well as, decreasing timing margins and voltage windows.
Referring to FIG. 4, stub resistors 416 in the memory modules 406 reduces signal reflection. But these stub resistors 416 improve memory read and write operations. As the value of the stub resistors 416 increases to decrease reflection, the voltage drop across it increases attenuating the signal voltage. Attenuating signal voltages decrease the voltage window. And the stub resistors 416 might cause RC parasitic loads that delay the signal.
Accordingly, a need remains for a memory system capable of addressing disadvantages associated with existing memory systems.

Memory system mounted directly on board and associated method


The accuracy of electrochemical profiling measurements that provide depth dependent characteristics for a semiconductor is enhanced by stabilizing the semiconductor's effective dissolution valence. According to the present invention, the semiconductor dissolution valence is stabilized by anodically dissolving the semiconductor surface using a potential associated with the electropolishing region of the semiconductor. This potential, typically 1V to 5V relative to the profiler saturated calomel reference electrode, favors quadrivalent dissolution over divalent dissolution. Dissolution valence is further stabilized by using an electrolyte having a relatively low fluoride content, a characteristic associated with a low dissolution rate (relative to a rate of electrochemical oxidation) of the oxide at the semiconductor surface. Preferably the electrolyte has a fluoride content in the approximate range 0.01 mol-dm.sup.-3 to about 1.0 mol-dm.sup.-3, and is buffered with a pH ranging from about 3 to 5. According to the present invention, the effective dissolution valence of silicon is stabilized to about 3.70, and craters etched in a silicon specimen will have a deviation from a mean profile depth within about .+-.1%.

Semiconductor materials contain majority and minority carriers that govern the performance of transistors and other semiconductor devices fabricated from such materials. In the design and fabrication of such devices, it is important to know the concentration of these carriers at various depths within the semiconductor material.
It is known in the art to measure carrier concentration in semiconductor materials using electrochemical profiling techniques, also known as anodic dissolution techniques. According to these techniques, concentration measurements are made at various levels in a semiconductor material as the semiconductor material is controllably dissolved, layer-by-layer.
For example, U.S. Pat. No. 4,028,207 issued in 1977 to M. M. Faktor, et al. discloses a measuring apparatus wherein an electrolyte forms a Schottky barrier with the semiconductor surface while controllably dissolving the semiconductor surface to expose new regions. When high anodic potential is applied, the electrolyte etches more deeply into the semiconductor, and data relating carrier concentration to the new depth may be obtained. The Semilab MCS-90, manufactured by Semiconductor Physics Laboratory RT of Budapest, Hungary, is an example of a modern electrochemical profiler.
FIG. 1 depicts a typical apparatus 2 for making electrochemical profile measurements according to the prior art, an apparatus with which the present method may be practiced to provide improved measurement data. The semiconductor specimen 4 is supported on an electrolytic cell 6 that typically includes a saturated calomel reference electrode ("SCE" ) 8, a graphite cathode auxiliary electrode 10, and a light source 12 (used to create holes when specimen 4 is n-type material).
A suitable mechanism 14 exerts force against specimen 4 to maintain intimate contact between the specimen surface 16 that is to be etched, and an area (A) of electrolyte 18. The interface at surface 16 between the specimen 4 and the electrolyte 18 forms a rectifying or so-called Schottky barrier. Collectively, the semiconductor-electrolyte system including interface surface 16 forms what is commonly referred to as the semiconductor working electrode. Preferably a gold electrode 20 contacts surface 16, while contact mechanism 40 urges ohmic contact between platinum pins 22 and 24 and the non-etched side 26 of the specimen 4. A pump 28 is optionally used in the prior art, generally to circulate the electrolyte 18.
A bias voltage source 30 provides a swept anodic potential V.sub.a (t) that is coupled to the first input of a potentiostat 32, whose second input is coupled to the SCE electrode 8. Potentiostat 32 provides an anodic output etching current i(t) that is coupled to the graphite electrode 10. Potentiostat 32 essentially imposes the reference, or anodic, potential V.sub.a (t) upon the SCE electrode 8. As used herein, the anodic potential V.sub.a (t) is understood to be referenced to the SCE electrode 8.
The platinum pins 22, 24 couple a signal generator 34 to specimen 4 to facilitate data measurements using the gold electrode 20 and alternating current ("AC") circuitry 38. As the anodic voltage from source 30 is swept (e.g., varied), the semiconductor depletion region at the semiconductor interface 16 changes, thus varying the interface admittance. The admittance at the specimen-electrolyte interface 16 has real and imaginary components, whose respective magnitudes may be determined by AC circuitry 38.
AC circuitry 38 typically includes phase-sensitive components that permit characterization of specimen 4 at various depths, using, for example, the real and imaginary interface admittance components to determine the interface capacitance C.sub.Si-E. Direct current ("DC") circuitry 36 typically includes components for integrating the anodic current i(t) to enable a determination of the semiconductor etch depth W.sub.R. Circuitry 36 and 38 can provide output data that may, for example, be used to represent semiconductor parameters as a function of etch depth, in an X-Y plot, for example.
In practice, for an n-type semiconductor specimen, anodic dissolution of surface 16 typically occurs at a fixed anodic potential V.sub.a that is maintained by the potentiostat 32, at a rate determined by the number of minority carriers (holes) produced by photons from light source 12. For p-type material, sufficient anodic current i(t) exists without illumination from light source 12, due to the relatively large number of available minority carriers (electrons).
As understood by those skilled in the relevant art, data representing semiconductor depth (W.sub.R) are provided by taking the integral of the dissolution current i(t), ##EQU1## where M is the semiconductor's molecular weight, N is the effective dissolution valence of the semiconductor specimen, F is the Faraday constant, D is the semiconductor density, and A is the dissolution area.
To produce a carrier concentration profile, W.sub.R must be added to the depletion width W.sub.D, ##EQU2## where, as noted, A is the dissolution or etch area, and C.sub.Si-E is the overall interface capacitance.
From the foregoing, it will be appreciated that if the effective dissolution valence N cannot be reliably and consistently maintained and determined, meaningful measurements of W.sub.R cannot be attained. Similarly, one cannot obtain accurate and reliable measurements of other semiconductor parameters that depend upon N or W.sub.R.
While electrochemical profile measurements as described above have been used for many years, in practice the data obtained can be inconsistent and vary widely. In addition to the measurements being dependent upon the electrolyte selected and the electrolyte pH, the depth calculations are very sensitive to the effective dissolution valence of the semiconductor (the number of electronic charges transferred per atom of semiconductor dissolved). In fact, the inability to reliably maintain a consistent effective dissolution valence has caused electrochemical depth profiling to fall out of favor for silicon specimens, especially for multilayer silicon specimens.
What is needed in electrochemical depth profiling is a method for reliably maintaining a consistent effective dissolution valence for a semiconductor specimen, thereby promoting more accurate depth measurement data. The present invention provides such a method.

Method for stabilizing the effective dissolution valence of silicon during electrochemical depth profiling