Computed tomography (CT) imaging system has at least one processing unit configured to receive operator inputs that include a modified system feature and a clinical task having a task object and also receive operator inputs for determining a task-based image quality (IQ) metric. The task-based IQ metric represents a desired overall image quality of image data for performing the clinical task. The image data acquired using a reference system feature. The at least one processing unit is also configured to determine an exposure-control parameter based on the task object, the modified system feature, and the task-based IQ metric. The at least one processing unit is also configured to direct the x-ray source to generate the x-ray beam during the CT scan, wherein at least one of the tube current or the tube potential during the CT scan is a function of the exposure-control parameter.

Computed tomography (CT) imaging systems are typically controlled by trained operators that select a number of imaging and/or acquisition parameters that prescribe a CT scan. These parameters may be selected based on, among other things, the region-of-interest (ROI) and the clinical task. Clinical tasks may include, for example, detecting and characterizing nodules in the body, identifying an abnormal collection of fluid (gas or liquid), characterizing conditions of soft tissue, or identifying an abnormal congenital or developed anatomy of the person. Medical images with better image quality are generally easier to read for accomplishing the clinical task. But for certain medical imaging systems, such as CT imaging systems, acquiring medical images with better image quality may require exposing the person to a greater amount of radiation. Thus, one challenge for operators of CT imaging systems is to obtain medical images having a sufficient image quality without subjecting the person to unnecessary radiation.
Image quality, however, can be a function of several factors, including noise, contrast, spatial resolution, and/or noise texture. Each of these factors can be influenced by one or more adjustable parameters of the CT imaging system. To assist the operator in achieving sufficient image quality, manufacturers have developed several features, such as automated control systems that automatically adjust operation of the imaging system.
The adjustments made by the automated control system may be based on parameters entered by the operator. For example, automatic exposure control (AEC) engines in CT imaging systems may modulate a radiation dose based on an image quality (IQ) reference entered by the operator. To modulate the radiation dose, the AEC engine may modulate tube current and/or tube potential (or tube voltage). The IQ reference is indicative of an image quality desired by the operator. For example, the IQ reference may specify a minimum acceptable image quality for the resulting image data. The IQ reference may be, for example, a noise index that is directly proportional to image noise and represents an acceptable amount of noise that can be present in the medical images the operator would like to acquire. The AEC engine attempts to modulate the tube current to achieve constant image noise regardless of the attenuation level. Other IQ references entered by operators may be a reference mAs that is directly proportional to a tube current-time product, a reference image having an acceptable image quality, and a target image quality level based on a standard deviation of pixel values in an image.
Operators often desire to improve a protocol (e.g., by reducing dosage) without reducing image quality to which the operator is accustomed. While attempting to improve the protocol, the operator may enter the same IQ reference while changing one or more scan parameters or changing the reconstruction technique. In such instances, the AEC engines may not sufficiently account for how the modifications affect the overall image quality. For example, the known AEC engine that uses a noise index may be able to maintain equivalent noise between different protocols, but noise alone may not preserve the "look and feel" of an image. The overall image quality is based not only on noise but other factors, such as contrast, spatial resolution, and/or noise texture. Limitations to the known IQ references may be especially noticeable when changing the reconstruction kernel, changing a reconstructive technique, varying the level (or strength) of iterative reconstruction, or changing a tube potential (kV).
Accordingly, it can be difficult and time-consuming for an operator to develop a new protocol that achieves a desired image quality for a designated clinical task. Moreover, as discussed above, conventional IQ references may be insufficient when using a different reconstruction algorithm or when using a modified scan parameter in a scan prescription.

CT imaging system and method using a task-based image quality metric to achieve a desired image quality


A compliant contact system for making a temporary electrical connection with a semiconductor die for testing and a method for fabricating the compliant contact system are provided. The compliant contact system is adapted for use with a test apparatus for known good die. The compliant contact system includes an interconnect, and can include an alignment fixture for aligning the die with the interconnect. The interconnect includes a pattern of compliant contacts adapted to contact the bond pads on the die. The compliant contacts are formed as metal traces on a silicon substrate. The end portions of the metal traces are cantilevered over a pit etched into the substrate, and are adapted to flex to compensate for dimensional variations in the bond pads and to provide a bias force against the bond pads.

Microelectronics packages, called hybrids or multi chip modules, utilize unpackaged semiconductor dice. Because of an increased use of hybrids, semiconductor manufacturers are required to supply unpackaged dice that have been tested and certified as known good die (KGD). A known good die (KGD) is an unpackaged die having the same reliability as the equivalent packaged die.
The need for known good dice has led to the development of test apparatus suitable for testing unpackaged semiconductor dice. As an example, test apparatus for conducting burn-in tests for unpackaged dice are disclosed in U.S. Pat. Nos. 5,302,891; 5,408,190 and 5,483,174 to Wood et al., which are assigned to Micron Technology, Inc.
With this type of test apparatus, a non-permanent electrical connection must be made between contact locations on the die, such as bond pads, and external test circuitry. The bond pads provide a connection point for testing the integrated circuits formed on the die. The test apparatus typically includes some type of interconnect having a pattern of contact members for effecting the temporary electrical connection to the bond pads on the die.
In making this temporary electrical connection, it is desirable to form a connection that causes as little damage as possible to the bond pads on the die. If the contact members for the interconnect damage the bond pads, the entire die may be rendered as unusable. This is difficult to accomplish because the contact members must also produce a low resistance or ohmic contact with the bond pads. It is also desirable for the contact members to accommodate dimensional variations in the bond pads, particularly variations in a z-direction. For this reason contact members for interconnects are sometimes constructed as flexible or compliant members that can move up or down upon contact with the bond pads.
In view of the foregoing, it is an object of the present invention to provide an improved compliant contact system for making temporary electrical connections to unpackaged semiconductor dice and a method for fabricating the compliant contact system. It is yet another object of the present invention to provide an improved compliant contact system for testing unpackaged semiconductor dice that can be fabricated out of silicon using semiconductor circuit fabrication techniques. It is a further object of the present invention to provide an improved compliant contact system that includes an interconnect with raised contact members and an alignment fixture for mechanically aligning contact locations on the die with corresponding contact members on the interconnect. Other objects, advantages and capabilities of the present invention will become more apparent as the description proceeds.

Compliant contact system with alignment structure for testing unpackaged semiconductor device


The invention relates to a hook latch (73) configured so as to lock and unlock a mobile structure on a fixed structure of a vehicle, said latch having                an adapter (69) fitted with a hook (73) capable of fastening a keeper,        a handle comprising a trigger,        on the handle, a second pivot connection axis,        on the trigger, at least one hook capable of fastening at least one protrusion (125) of a bracket (121) connected to the adapter,        a third pivot connection axis, around which the handle and the adapter are guided in rotation in relation to each other, and        characterised in that it comprises an adjustment device for adjusting the flushness of the upper surface of the handle in relation to the aerodynamic surface, said device comprising        the bracket (121),        a screw (129) capable of being screwed and unscrewed within a first tapped recess of the adapter.

In the prior art, the technical teachings of documents U.S. Pat. Nos. 5,984,382A, 6,343,815B1, 6,382,690B1 and 7,131,672B2 are known to disclose hook latches.
Typically, such latches can either be connected to the fixed structure of the apparatus and capable of fastening and maintaining its mobile structure, or be connected to its mobile structure and capable of fastening its fixed structure to attach said structure.
FIG. 1 represents, in a schematic manner, a cross-section of a hook latch 11 according to one embodiment from the prior art in its environment and in a locked non-flush position. In this example, the latch 11 is assembled onto a mobile structure 13 of an aircraft so as to fasten a keeper 15 positioned on a fixed structure 17. For two distinct surfaces, a flush position implies a position in which the former two surfaces form a single surface.
The latch 11 comprises a handle 19 and a fastener known as an adapter 21, in which a hook 23 is assembled via a fitting part such as a nut 25. The nut 25 adjusts the sinking of the hook 23 within a recess 27 of the adapter 21. The handle 19 and the adapter 21 are assembled via a rivet 29 located at one end of the latch 11 opposite the hook 23. The rivet 29 extends along an axis 31 of rotation of the adapter 21 in relation to the handle 19. A locking element such as a trigger 33 secures the handle 19 in its closed position.
The mobile structure 13 has a second pivot connection axis 35 around which the latch 11 assembly is guided in rotation. In this example, the second pivot connection axis 35 is substantially parallel to the first axis 31 and is materialised by a rod 37 fixed in relation to the mobile structure 13 and passing through a strut 39 connected to the handle 19.
The hook 23 has a shape capable of fastening the keeper 15 extending along a third axis 41 parallel to the first two axes 31 and 35.
The adapter 21 has an overall cylindrical section 43 in which the recess 27 is fitted, which is partially tapped. A first pin 45 passes through the cylindrical section 43, thus fulfilling the function of locking the hook 23 in rotation in relation to the adapter 21. In this example, the pin 45 extends along an axis perpendicular to a rod 49 of the hook 23.
The hook 23 extends into the threaded rod 49, said rod being capable of being screwed, via this threading and the adjustment nut 25, within the recess 27 of the adapter 21. For this purpose, the nut 25 is threaded and tapped.
The handle 19 has an upper surface 51, in theory intended to be positioned flush with an aerodynamic surface 53 of the apparatus so as not to reduce the overall aerodynamics of the apparatus. However, due to the various manufacturing and assembly tolerances, it appears that the upper surface 51 of the latch 11 is often, as shown in this example, in a non-flush position, i.e. the ends of the handle 19 are not aligned with the aerodynamic surface 53 of the apparatus, which represents a considerable reduction in aerodynamics, an increase in aerodynamic drag and therefore a significant increase in the amount of fuel consumed by the apparatus.
For mobile structures with high aerodynamic stresses, for example aircraft radomes, i.e. the domes located at the front end of the aircraft generally protecting a radar antenna, the effect of the flushness of the latches with the upper surface is vital. This type of latch, although frequently used, therefore creates a major technical problem for one of ordinary skill in the art. In the prior art, in order to try to improve the positioning of the upper surface of hook latches, the only solution considered by one of ordinary skill in the art consists in adjusting, on the fixed structure of the apparatus and via a complex adjusting device, the fastening point for the hook. However, this solution requires the latch to be unlocked so as to separate the mobile elements from the structure and thus access the adjustment system for the fastening point. This leads to a non-negligible loss of time, and therefore a lengthy downtime for the apparatus. Moreover, this requires the implementation of human means and the use of specific tooling.

Hook latch fitted with a positioning device and a method for assembling such a latch


An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.

1. Field of the Invention
The present invention relates to electronic devices and fabrication methods thereof, and more particularly, to an electronic device and a fabrication method thereof for facilitating reworking.
2. Description of Related Art
Generally, semiconductor packages, such as CPUs and memories, are disposed on printed circuit boards of electronic products (such as computers) and the printed circuit boards serve as communication interfaces for various kinds of electronic elements, such as I/O devices, multimedia and communication devices, thereby connecting the semiconductor packages to external devices so as to form a complete electronic system.
In the development of semiconductor technologies, various package types have been developed for semiconductor products. For example, BGA (ball grid array) semiconductor packages that have reduced IC areas, high density and multiple connections have become the mainstream in the market of semiconductor packages. Further, to obtain much lighter, thinner, shorter and smaller semiconductor packages, chip scale packages (CSP) are developed, which are characterized in that the package size is equal to or slightly larger than the size of a chip.
Conventionally, an underfilling process is performed to bond a BGA type chip scale package to a circuit board. However, voids, overflow or insufficient underfilling easily occurs during such an underfilling process. Further, since the underfilling material is made of a thermosetting polymer, when it is cured after being heated, it becomes difficult to rework. Therefore, if a defect occurs to the package or the underfilling material, the entire circuit board must be discarded.
To facilitate reworking, Taiwanese Patent No. I251,927 discloses a detachable base. A package can be disposed on the detachable base and then the detachable base with the package can be disposed on a circuit board. If a defect occurs to the package, the detachable base as well as the package can be detached and replaced with good ones, thereby eliminating the need to discard the entire circuit board.
However, the detachable base occupies spaces on the circuit board, incurring an increase of the area and height of the circuit board and hindering miniaturization of electronic products. Further, to facilitate detachment of the detachable base, the detachable base has a limited number of pins, thus limiting the increase of the number of connection pins between the circuit board and the package and making it difficult to meet the multi-function requirement of electronic products. In addition, the use of the detachable base incurs a high cost.
In view of the above-described drawbacks, FIG. 4A to FIG. 4C show a reworking method disclosed in US Patent Application Publication No. 20090184407. Through such a reworking method, a defective package or a defective underfilling material can be replaced without the need to discard the entire circuit board or the need of a detachable base.
Referring to FIG. 4A, a semiconductor package 11 is flip-chip disposed on a circuit board 10 through a plurality of first solder balls 12 and an underfilling material 13 is formed between the semiconductor package 11 and the circuit board 10 for encapsulating the solder balls 12. If a defect occurs to the semiconductor package 11, the semiconductor package 11 can be removed by grinding.
Referring to FIG. 4B, when the semiconductor package 11 is removed, upper portions of the underfilling material 13 and the first solder balls 12 are also removed (or the underfilling material 13 and the first solder balls 12 can be completely removed) and the remaining lower portions of the first solder balls 12 serve as electrical contacts 12′.
Referring to FIG. 4C, another semiconductor package 11′ is flip-chip disposed on the electrical contacts 12′ through a plurality of second solder balls 14 and an underfilling material 15 is formed to encapsulate the second solder balls 14.
In the above-described reworking method, a mechanical grinding process is performed to remove and replace the semiconductor package 11 so as to eliminate the need to discard the entire circuit board 10 and meet the miniaturization and multi-function requirements of electronic products.
However, the grinding process is quite complicated and therefore is costly and time-consuming. Further, the grinding depth is difficult to control, which easily leads to an uneven surface of the underfilling material 13′ and a poor coplanarity between the electrical contacts 12′, thus causing a tilted bonding of the semiconductor package 11′ to the circuit board 10 and even causing an offset of the joints between the semiconductor package 11′ and the circuit board 10.
Furthermore, an error due to the grinding accuracy may cause damage of circuits or copper pads on the circuit board 10.
Moreover, the grinding process produces a lot of particles that may pollute other elements (not shown) on the circuit board 10.
In addition, although an underfilling material having a low viscosity and a high CTE (coefficient of thermal expansion) facilitates removal of the semiconductor package, its low viscosity cannot meet the reliability requirement of the package assembly. Therefore, such an underfilling material cannot be used.
Therefore, there is a need to provide an electronic device and a fabrication method thereof so as to overcome the above-described drawbacks.

Electronic device and fabrication method thereof

National Taipei University of Technology


Improved collection optics for a lighting system comprised of a light source, reflector and light receptive component include a multi-portion reflector or a non-imaging optical collector having a positive curvature located at an input end to the light receptive component. The collection optics capture additional lumens for transmission through the light guide. The optical arrangement can also collect different colors of light from the source that would otherwise be omitted from transmission through the light receptive component.

This invention relates to collection optics for a high brightness discharge light source. More particularly, the invention relates to modification of known optical arrangements which use an elliptical or ellipsoidal reflector with a high brightness light source located at a first focal point of the reflector and an input end of a light receptive component such as a light guide or light conductor placed at a second focus of the reflector for transmitting light to a remote location. However, it will be understood that the invention has broader applications and may be advantageously employed in a number of other lighting environments and applications. Particular lighting systems require a high level of lumens for selected applications. For example, when using an optical fiber or light guide to carry the light to a remote location in the system, it is important to collect a maximum amount of the light emitted from the light source and input the light into the end of the light guide. The amount of light can be measured as number of lumens per unit area, i.e., lumen density, and the transmission optics plays an important role in maximizing the lumen density.
Typically, there is a tradeoff between lumen density and the cross-sectional dimension of the light guide. In general, the smaller the size of the light guide, the higher the lumen density. This higher density, however, comes at the expense of less collected lumens. Decreasing the size of the entrance aperture is also limited by the requirement that the transition optics must be sufficiently enlarged relative to the magnified image of the source in order to collect sufficient lumens. Therefore, it is generally preferred to maintain a slightly larger entrance aperture which, in turn, requires collection of a greater number of lumens from the light source to achieve the goal of increased lumen density.
An elliptical or truncated elliptical reflector is often used to direct light received from the discharge light source into the light guide. Unfortunately, any light emitted from the light source at a region adjacent to, but slightly spaced or offset from, the first focus is not directed into the light guide. Light from the offset region is imaged or focused at an area spaced from the input end of the light guide, and thus does not contribute to the light carried by the light guide. Lumen density in the light guide thus has no contribution from this additional light emitted from the light source.
By way of practical example, a core of an arc discharge light source is preferably located at the first focus of an ellipsoidal reflector, while a plume is also located inside the envelope but at a different region relative to the reflector. For example, the plume is located closer to the reflector if the arc is operated in a vertical direction and the open end of the ellipsoid is pointed downwardly. Sodium emission is primarily provided by the plume which is a region of slightly lower temperature than the arc core. In the core, the temperature is too high and completely ionizes the sodium. Thus, light emitted from the core does not result from sodium emission. Instead, convection currents within the envelope carry the sodium to regions of lower temperature and light is emitted in these lower temperature regions. Unfortunately, the regions of lower temperature are sufficiently spaced from the core, and thus spaced from the first focus of the reflector, so that this sodium light emission is not positioned at the second focus of the reflector. The sodium plume would, in fact, be focused well beyond the second focus of the reflector, missing entirely the entrance end of a small light guide. As a result of this arrangement, the light propagated through and emitted from the output end of the light guide is lacking in red color and has a green color since the wavelength spectrum of sodium emission is not transmitted through the light guide.
Moreover, different magnifications from different portions of the ellipse are obtained. This non-uniform magnification requires increasingly complex shapes and configurations to match the collector design and maximize the collection of light. Accordingly, there is a tradeoff between complexity and light collection that needs to be addressed.
A simple transition optical arrangement is desired between the light source and the input end of the light guide to maximize the lumen density, collect light from regions adjacent the first focus, and yet maintain simplicity and efficiency.

Collection optics for high brightness discharge light source


A method and apparatus for converting electronic display aeronautical chart data to aeronautical chart data that is tailored for an avionics display is disclosed. The method and apparatus received by a data processing unit, electronic display aeronautical chart data. The color palette of the electronic display aeronautical chart data is then remapped to improve viewability on the avionics quality display. Finally, signals representative of the remapped colors are sent to the avionics quality display.

Conventional aeronautical chart files provided by such manufacturers as Jeppesen Sanderson, Inc. of Denver, Colo. are configured for charting on paper and possibly for displaying on conventional personal computers (PCs). Such conventional aeronautical chart file information is not tailored for avionics quality displays which may be used in a cockpit or other location inside an aircraft. Also, conventional aeronautical chart files are not tailored for displaying on most conventional electronic displays.
Aeronautical chart files are conventionally created using RGB colors, fonts, and graphics rendering techniques for personal computers, in order to achieve high quality paper charts. The result of displaying such conventional aeronautical chart files on an electronic display, such as, but not limited to, an avionics quality or commercial quality display, results in reduced readability, especially in cockpit ambient illumination conditions, and reduced color contrast compared to paper charts. In particular, for liquid crystal displays (LCDs), characteristics may also include color shifts over a range of viewing angles and poor font quality.
Accordingly, there is a need for a system and method to convert aeronautical chart files into files which are usable in an avionics quality display environment. There is also a need for a method of remapping conventional aeronautical chart colors to colors which will be more readily usable, readable, and provide better contrast and reduced luminance for an avionics quality display. Further, there is a need for a method and apparatus for remapping a white background color to a background color that does not conflict with other chart features and that provides color contrast for sunlight, diffused light, and night viewing conditions, as well as providing reduced luminance while maintaining good color contrast. Further still, there is a need for a system and method for using conventional aeronautical chart data and remapping conventional fonts and line widths to appropriate fonts and line widths for improved readability on an avionics quality display.
It would be desirable to provide a system and/or method that provides one or more of these or other advantageous features. Other features and advantages will be made apparent from the present specification. The teachings disclosed extend to those embodiments which fall within the scope of the appended claims, regardless of whether they accomplish one or more of the aforementioned needs.

Aeronautical chart display apparatus and method


An electrical connection between an electrically conductive probe on one device and a compliant pad on another device can be formed by piercing the compliant pad with the probe. The probe can contact multiple electrically conductive elements inside the pad and thereby electrically connect to the pad at multiple locations inside the pad.

A variety of techniques exist to connect electrically two or more electronic devices. One type of well known electrical connection technique is solder. Electrical connections consisting of solder between to electronic devices are generally reliable and have a relatively low electrical resistance. Also, once solder connections between electronic devices are made, the solder connections do not typically exert forces on either of the electronic devices. Solder connections, however, have some disadvantages. For example, solder connections between electronic devices cannot easily be undone and remade between one of the electronic devices and a different electronic device. As another example, solder connections typically do not allow appreciable relative movement between the electronic devices, and in fact, relative movement between the electronic devices (e.g., due to mismatched thermal expansion or contraction of the electronic devices) can break the solder connections.
Pressure based electrical connections in which an electrically conductive probe on one electronic device is pressed against a contact on another electronic device overcomes some of the disadvantages of solder connections. For example, such pressured based electrical connections are readily undone and reformed between one electronic device and a different electronic device. Also, the probe on one electronic device can typically slide with respect to the contact on the other electronic device in response to relative movement between the electronic devices. There are, however, disadvantages to pressure based electrical connections. For example, the electrical resistance of pressured based electrical connections is typically greater than that of solder connections. As another example, pressured based electrical connections, by definition, require a given amount of force between the probe on one electronic device and the contact on the other electronic device.
Other types of electrical connections also suffer from disadvantages. For example, mechanical force fitting electrical connections (e.g., zero insertion force connectors) often require secondary actuators and typically provide a relatively low density of individual connections. As another example, liquid metals can be difficult to contain and control and typically can be used only in relatively narrow temperature ranges.
Various embodiments of the present invention address one or more of the foregoing disadvantages in prior art electrical connection techniques.


The present invention relates to a mobile or stationary waste container cleaning system used for residential, commercial and industrial waste, garbage, trash, storage or operations containers or receptacles. Other applications include, but are not limited to cleaning of chemical drums, grease dumpsters (e.g. behind restaurants), rain barrels and non-uniform residential, commercial or industrial dumpsters or waste containers. The container cleaning system can alternatively be used for rural areas, farms or ranches.

1. Field of the Invention (Technical Field)
The present invention relates to a container cleaning system preferably used for residential and commercial waste, garbage, or trash containers or receptacles.
2. Description of Related Art
Residential and commercial waste containers can collect wastes and pests throughout the course of their use. Cleaning and maintenance of these waste containers can be time consuming and difficult, not to mention dangerous depending on the waste or residue. Often these containers are not cleaned regularly which can lead to worse health and environmental problems, especially in areas of dense populations.
The following is a discussion of the relevant prior and related art. Note that the following discussion refers to a number of publications by author(s) and year of publication, and that due to recent publication dates certain publications are not to be considered as prior art vis-à-vis the present invention. Discussion of such publications herein is given for more complete background and is not to be construed as an admission that such publications are prior art for patentability determination purposes.
U.S. Pat. No. 3,324,866 to Davis, entitled "Sanitation System", issued Jun. 13, 1967, discloses a truck for washing garbage "drums." The device includes a remotely controlled system with a forced fluid and disinfectant cleaning system, a fluid recirculation system and a separation system. This device does not have an arm modified to completely invert a waste container for cleaning.
U.S. Pat. No. 3,291,144 to Diamond, entitled "Trash Bin Washing Apparatus", issued Dec. 13, 1966, discloses a truck for cleaning commercial garbage dumpsters. It includes a fluid recirculation system and a separating system for solid waste removal. This device is a commercial garbage dumpster and does not have a modified arm able to completely invert a waste container, and does not contain a rotating head(s) or rotating nozzles.
U.S. Pat. No. 3,901,255 to Pettit, entitled "Drum Washer for Vehicles", issued Aug. 26, 1975, discloses a cleaning system located on a garbage truck and provides for heated washing of a garbage "drum". There is no mechanism for recirculation of liquid and no modified arm on this device.
Other methodologies have been used to try and solve the environmental, sanitary and health problems, but are time consuming or not cost efficient.
The present invention solves the problems that the prior or related art were unable to solve. The invention includes, but is not limited to: (1) a separate mobile unit (separate from the "garbage" truck) that provides more room for cleaning of the waste containers; (2) a wash fluid separation and recycling system, for better fluid use and efficiency; (3) a loading arm that bends and inverts waste containers up to 180 degrees; and (4) an effective use of time use for washing and convenience.

Waste container cleaning system with conveyor


The nail brace applicator serves for the application of a strip-shaped and leaf-spring-like nail brace onto a nail of a toe or finger. It comprises an elongated main body extending in a longitudinal direction, having a first end face extending approximately perpendicular to the longitudinal direction and having a first application zone with a first application surface formed by the first end face. Additionally, the nail brace applicator comprises a mounting element for releasably mounting the nail brace to be applied on the first application surface.

1. Field of the Invention
The invention relates to a nail brace applicator for applying a strip-shaped and leaf-spring-like nail brace onto a nail of a toe or finger.
2. Background Art
Such nail braces are known from EP 0 282 645 B1. This nail brace in the form of a leaf-spring-like strip is used to lift the sides of an overly curved nail. The nail brace is a strip made of a resilient plastic material. It is glued by means of a rapid cure adhesive along its entire brace length onto the nail that is to be corrected.
EP 0 282 645 B1 also describes a nail brace applicator that is used for the defined positioning and fixing of the nail brace. This special tool has approximately the shape of a pencil whose one pointed end is provided with an inwardly extending concave recess. This end is used to press the nail brace onto the nail that is to be corrected. The other end is designed as a spatula for applying the adhesive. This nail brace applicator has proven very effective in practice. Nonetheless, even with the use of this nail brace applicator, the application of the nail brace still requires a certain amount of dexterity and possibly the use of an additional tool, e.g. a pair of tweezers, in order not to come into contact with the rapid cure adhesive.


An optical pickup for reading information written on an optical disk is equipped with a vertical multi-mode converted laser diode which emits light, means for focusing the emitted light from the laser diode onto the optical disk, and means for receiving reflected light from the optical disk in order to read the information written on the optical disk, wherein the coherent distance of the emitted light from the laser diode is made shorter than the optical path length of the optical pickup.

1. Field of the Invention
The present invention is related to an optical pickup which reads information written on an optical disk using a laser diode, a manufacturing method thereof, and an optical disk system equipped with such optical pickup.
2. Description of the Related Art
In a DVD, MO, CD-R/RW, or DVD-R/RW/RAM system or the like which reads information written on an optical disk, a laser diode is used as the light source of an optical pickup. FIG. 9 shows the rough structure of an optical pickup 31 for reading information recorded on an optical disk 36. The optical pickup 31 is equipped with a laser diode 32, a half mirror 33, a collimator lens 34, an objective lens 35 and a light detector 37. The emitted light from the laser diode 32 is reflected by the half mirror 33 and formed into a parallel beam of light by the collimating lens 34. The parallel beam of light is focused on the optical disk 36 by the objective lens 35. The reflected light from the optical disk 36 passes through the objective lens 35 and the collimating lens 34, and is detected by the light detector 37 after being transmitted through the half mirror 33. The half mirror 33 transmits about 50% of the incident light, and reflects about 50% of the incident light. For this reason, one portion of the reflected light from the optical disk returns to the laser diode without being directed to the primary light detector 37. This is called feed-back. The feed-back to the laser diode 32 from the optical disk interferes with the light emission of the laser diode 32, and this generates feed-back noise in the emitted light of the laser diode 32.
A measurement system for measuring feed-back noise is shown in FIG. 1. In FIG. 1, the measurement system includes a laser diode 11, a collimator lens 12, a half mirror 13, an attenuator 14, a total reflection mirror 15, an objective lens 16, a light detector 17 and a noise measuring device 18. The emitted light from the laser diode 11 is formed into a parallel beam of light by the collimator lens 12, and then separated into two parallel beams of light by the half mirror 13. One separated parallel beam of light receives a required attenuation by the attenuator 14, and returns to the laser diode 11 after being reflected by the total reflection mirror 15. The other separated parallel beam of light is focused by the objective lens 16 and received by the light detector 17. The amount of noise in the received emitted light from the laser diode 11 is measured by the noise measuring device 18. In this measuring system, it is possible to measure the effect of the amount of feed-back with respect to the feed-back noise by adjusting the amount of attenuation of the attenuator 14.
In order to prevent feed-back noise, a method of superimposing a high-frequency electric current on the direct electric current driving the laser diode has been proposed (Electronics Letters, vol. 20, No. 20, pp. 821-822). FIG. 2 shows the emitted light at the time a high-frequency electric current is superimposed on the direct electric current when the laser diode is driven. In FIG. 2, when a sinusoidal high-frequency electric current is superimposed on the direct electric current serving as a driving current, the emitted light forms pulses. This proposal uses the phenomenon of multi-mode light emission carried out at the times when the emission of light is begun again after a high-frequency electric current momentarily forces the direct electric current below the threshold value of the laser diode when the high-frequency electric current is superimposed on the direct electric current when the laser diode is driven.
In this proposal, the distance from the laser diode to a reflector is 100 mm, and a 1 GHz high-frequency electric current is superimposed. In this case, the laser diode repeatedly carries out a pulse light emission operation in which light is emitted for a period of 500 psec, and then the emission of light is turned off for a period of 500 psec. Because light will travel approximately 150 mm in 500 psec, in a measurement system having a round trip distance of 200 mm from the laser diode to the reflector, during the state where the emission of light from the laser diode is turned off, the emitted light from the previous light emitting state is reflected by the reflector and forms feed-back (feed-back A in FIG. 2). This feed-back returns during the time from the light emission turning off state to the next light emitting state. When the laser diode repeatedly carries out a pulse light emission operation by alternating between a light emitting state and a light emission turning off state, there is no coherence correlation between the emitted light from the laser diode at the time of the previous light emitting state and the emitted light from the laser diode at the time of the next light emitting state. As a result, because there is no coherent interaction between the feed-back and the emitted light of the next light emitting state, the feed-back noise can be suppressed to a relatively low level.
In accordance with the miniaturization of the latest optical pickups, the distance between the end surface of the laser diode of the optical pickup and the optical disk has been shortened to about 30 mm. Further, the frequency of the superimposing high-frequency electric current has been kept at 300˜500 MHz in order to prevent unwanted radiation. For this reason, because the emitted light from the laser diode during the period of the light emitting state is reflected by the optical disk and forms feed-back (feed-back B in FIG. 2), such feed-back interferes with the light emission from the laser diode, and this generates a large amount of feed-back noise.
Further, a self-pulsation laser diode has also been developed in order to reduce the feed-back noise. This laser diode carries out a pulse light emission operation in which when the laser diode begins emitting light, the absorption coefficient and the like at the emission light wavelength are changed, and the emission of light is turned off, and when the emission of light is turned off, the absorption coefficient and the like return, and the laser diode begins emitting light again. From the fact that the self-pulsation laser diode also carries out multi-mode oscillation when the emission of light is begun, it is difficult for feed-back noise to be generated. However, because even the self-pulsation laser diode has a limited pulsation frequency, when the emitted light from the laser diode during the period of the light emitting state is reflected and forms feed-back in the miniaturized optical pickup, such feed-back interferes with the light emission from the laser diode, and there is still the problem of a large amount of feed-back noise being generated in the emitted light of the laser diode.
In the structures of older related art optical pickups, there is a little influence against feed-back in the multi-mode oscillation laser diode, and in the miniaturized optical pickup described above, because the laser diode receives an effect from the feed-back, there has been a need to evaluate the feed-back noise. The effect of superimposing a high-frequency electric current and the effect of self-pulsation can ultimately be evaluated by the noise in the emitted light of the laser diode, but the measurement of noise is extremely complicated, and it is difficult to evaluate the relationship between the amplitude of the superimposed high-frequency electric current and the feed-back noise in a measurement system for evaluating noise due to feedback.
On the other hand, many methods of evaluating the coherence of the emitted light from the laser diode with a Michelson interferometer have been reported. FIG. 3 shows a structure according to the principle of a Michelson interferometer. In FIG. 3, there is a movable mirror 19 and a fixed mirror 20. The emitted light from the laser diode 11 is formed into a parallel beam of light by the collimator lens 12, and then separated into two parallel beams of light by the half mirror 13. One separated parallel beam of light is reflected by the fixed mirror 20, passes through the half mirror 13, and is detected by the light detector 17 via the objective lens 16. The other separated parallel beam of light is reflected by the moving mirror 19, reflected by the half mirror 13, and then detected by the light detector 17 via the objective lens 16. By moving the movable mirror 19, it is possible to change the difference in the distances of the two separated parallel beams of light to the light detector 17. The coherence of the emitted light from the laser diode 11 is measured from the created difference in distance of the movable mirror 19 and the light electric power detected by the light detector 17.
In current Michelson interferometers, measurements can be carried out easily within the range of relatively small differences in distance, but when a considerable difference in distance is formed in the distance from the front facet of the laser diode of the optical pickup to the optical disk, the range in which measurements can be carried out easily is exceeded.

Optical pickup, manufacturing method thereof, and optical disk system


A system capable of inspecting an article for defects, the system including: a patch comparator, configured to determine with respect to each of a plurality of reference patches in a reference image a similarity level, based on a predefined patch-similarity criterion and on a source patch defined in the reference image; an evaluation module, configured to rate each inspected pixel out of multiple inspected pixels of the inspection image with a representative score which is based on the similarity level of a reference patch associated with a reference pixel corresponding to the inspected pixel; a selection module, configured to select multiple selected inspected pixels based on the representative scores of the multiple inspected pixels; and a defect detection module, configured to determine a presence of a defect in the candidate pixel based on an inspected value of the candidate pixel and inspected values of the selected inspected pixels.

Current demands for high density and performance associated with ultra large scale integration require submicron features, increased transistor and circuit speeds and improved reliability. Such demands require formation of device features with high precision and uniformity, which in turn necessitates careful process monitoring, including frequent and detailed inspections of the devices while they are still in the form of semiconductor wafers.
A conventional in-process monitoring technique employs a two phase "inspection and review" procedure. During the first phase the surface of the wafer is inspected at high-speed and relatively low-resolution. The purpose of the first phase is to produce a defect map showing suspected locations on the wafer having a high probability of a defect. During the second phase the suspected locations are more thoroughly analyzed. Both phases may be implemented by the same device, but this is not necessary.
The two phase inspection tool may have a single detector or multiple detectors. Multiple detector two phase inspection devices are described, by way of example, in U.S. Pat. Nos. 5,699,447, 5,982,921, and 6,178,257.
U.S. patent application Ser. No. 13/495,824 entitled "Apparatus and Method for Defect Detection Including Patch to Patch Comparison" discloses apparatus and method for defect detection including patch to patch comparison.
Defect detection systems for detecting defects in patterned microscopic objects, include for example the following:
United States Patent Application No. USSN 20080106740, entitled "Dual stage defect region identification and defect detection method and apparatus";
United States Patent Application No. USSN 20090148033, "Optical Inspection Apparatus For Substrate Defect Detection";
U.S. Pat. No. 6,064,484, entitled "Pattern inspection method and system";
U.S. Pat. No. 6,829,047, entitled "Defect detection system"; U.S. Pat. No. 7,630,535 entitled "Die-to-die photomask defect detection using region data to modify inspection thresholds";
U.S. Pat. No. 7,801,353, entitled "Method for defect detection using computer aided design data".
State of the art Applied Materials inspection systems are described and claimed in U.S. Pat. Nos. 5,982,921; 6,178,257; 6,952,491; 7,796,807; 7,499,583; 5,699,447; 6,829,381; 7,379,580; 7,410,737; 7,054,480; 6,862,491.
FIG. 1 is an illustration of a wafer 10 such as ones which may be used in the fabrication of integrated circuits and other microdevices. While the term wafer may be used to refer only to the substrate material on which the integrated circuit is fabricated (e.g. a thin slice of semiconductor material, such as a silicon crystal), this term may also be used to refer to the entire construction, including the electronic circuit fabricated on the wafer.
The wafer 10 is divided into multiple dies 11 which are illustrated in a widely implemented rectangular form. Like the term 'wafer', the term 'die' may also be used either for small blocks of semiconducting material, on which a given functional circuit is fabricated, or for such a block including the fabricated electric circuit. Usually, wafer 10 may be cut ("diced") into its multiple dies 11, wherein all of the dies of the wafer contain a copy of the same electronic circuit. While not necessarily so, each of the dies 11 is independently functional.
A single die may include a large amount of patterns that well exceed millions of patterns per die. A semiconductor die usually includes a plurality of layers. A pattern, such as local pattern 24 may be a part of a metal interconnection line, a trench, a via, a conductive gate, etc. Different areas on each die may be put to different uses; such areas may be for example background areas (that are ideally very smooth), memory areas (that include a large number of repetitive patterns) and logic areas (that usually do not include large quantities of adjacent repetitive patterns).
There exists a need for improved and more robust techniques for detecting defects in a substrate, and especially semiconductor substrate defects.

System, a method and a computer program product for patch-based defect detection


An SRAM device includes a substrate having at least one cell active region in a cell array region and a plurality of peripheral active regions in a peripheral circuit region, a plurality of stacked cell gate patterns in the cell array region, and a plurality of peripheral gate patterns disposed on the peripheral active regions in the peripheral circuit region. Metal silicide layers are disposed on at least one portion of the peripheral gate patterns and on the semiconductor substrate near the peripheral gate patterns, and buried layer patterns are disposed on the peripheral gate patterns and on at least a portion of the metal silicide layers and the portions of the semiconductor substrate near the peripheral gate patterns. An etch stop layer and a protective interlayer-insulating layer are disposed around the peripheral gate patterns and on the cell array region. Methods of forming an SRAM device are also disclosed.

In recent years, static random access memory (SRAM) devices have been fabricated having cell gate patterns sequentially stacked on an active region of a semiconductor substrate. Current in the device may be increased when the cell gate patterns are arranged in a three-dimensional manner on the semiconductor substrate, compared with a two-dimensional arrangement. In addition, sequentially stacking the cell gate patterns may provide increased device density for a given set of design rules.
However, there may be a structural limit in applying a silicide process to a peripheral circuit region of an SRAM device. This is because the cell gate patterns of an SRAM device may be disposed vertically in the cell array region, while peripheral gate patterns are disposed laterally in the peripheral circuit region. Thus, when a silicide process is performed on the peripheral gate patterns and the semiconductor substrate near the peripheral gate patterns, the silicide process may cause metal contamination in the cell gate patterns, which may degrade the electrical characteristics of the SRAM device.
U.S. Pat. No. 6,287,913 to Paul D. Agnello et al. (the '913 patent) discloses a double polysilicon process for providing both logic and memory circuits/devices in a single chip.
According to the '913 patent, a double polysilicon process includes forming a memory gate stack on a memory region. After the gate stack is formed, a logic gate stack is formed on a logic region. A silicide process is then performed on the logic region to form cobalt (Co) or titanium (Ti) silicides on a top surface of the logic gate stack and the semiconductor substrate near the logic gate stack.
However, in the polysilicon process, the memory stack and the logic gate stack are not formed at the same time. Accordingly, use of a double polysilicon process may require a lengthy fabrication process and/or may increase the cost of fabricating a semiconductor chip.

This patent is subject to a terminal disclaimer.

Methods of forming SRAM devices having buried layer patterns


Some embodiments include integrated memory having an array of repeating plates across a plurality of nodes. The array includes rows and columns. The plates along individual columns and individual rows alternate between two orientations which are substantially orthogonal to one another. Some embodiments include methods of forming repeating structures. A pattern is formed which includes a lattice of intersecting wavy lines and a box surrounding the lattice. The pattern has a plurality of openings extending therethrough. A liner material is along sidewalls of the openings. The liner material and the pattern are sliced along a row direction and a column direction substantially orthogonal to the row direction. Such slicing subdivides the liner material into a plurality of plates. The plates are within an array comprising columns and rows. The plates along individual columns and individual rows alternate between two orientations which are substantially orthogonal to one another.

Memory is one type of integrated circuitry and may be used in electronic systems for storing data. Integrated memory is usually fabricated in one or more arrays of individual memory cells.
The memory cells are configured to retain or store memory in at least two different selectable states. In a binary system, the states are considered as either a "0" or a "1". In other systems, at least some individual memory cells may be configured to store more than two levels or states of information.
One type of memory cell is phase change memory (PCM). Such memory utilizes phase change material as a programmable material. Example phase change materials that may be utilized in PCM are chalcogenide materials.
The phase change material reversibly transforms from one phase to another through application of appropriate stimulus. Each phase may be utilized as a memory state, and thus an individual PCM cell may have two selectable memory states that correspond to two inducible phases of the phase change material.
FIGS. 1 and 2 diagrammatically illustrate a couple of prior art memory structures. Specifically, FIGS. 1A and 1B illustrate a memory structure 2 utilizing a heater, and FIGS. 2A and 2B illustrate a memory structure 2a in a heaterless configuration.
The memory structure 2 of FIG. 1 is shown to comprise a heater plate 3 which is beneath and directly against a storage element 4 of phase change material (the phase change material may comprise, for example, chalcogenide material). The heater plate and the storage element are together comprised by a phase change memory cell 9, with the heater being utilized to induce a change in phase within the storage element (for instance, within chalcogenide) during programming of such memory cell.
The heater plate is over and directly against electrically conductive material 5 (which may be, for example, silicide), and the electrically conductive material 5 is over other materials 6 within a pedestal. The pedestal may include a select device (for instance, a bipolar transistor) which is coupled to the adjacent memory cell 9 to alleviate potential leakage problems.
A wordline 7 is beneath the memory cell, and a bitline 8 is above the memory cell. In operation, voltage differentials between the wordline and bitline are utilized for writing to, and reading from, the memory cell.
The heaterless memory structure 2a of FIG. 2 differs from the memory structure shown in FIG. 1 in that the cell 9 of FIG. 2 comprises the storage element 4 (for instance, chalcogenide) configured as a plate, and lacks the heater plate (i.e., the plate 3 of FIG. 1).
The memory cells 9 of FIGS. 1 and 2 may be incorporated into memory arrays. FIG. 3 shows a top view of an example prior art memory array 12. Wordlines 7a-d extend along the row directions of the array, and bitlines 8a-d extend along column directions of the array. Plates 10 (which may be either the heater plates of the FIG. 1 cell or chalcogenide plates of the FIG. 2 cell) are diagrammatically illustrated to be present at cross-points where wordlines and bitlines overlap. The plates would actually be over the wordlines and under the bitlines (as shown in the side views of FIGS. 1 and 2), and accordingly would not be visible in the top view of FIG. 3. However, the locations of the plates are shown in FIG. 3 in order to assist the reader in understanding the prior art pattern.
A difficulty that may be encountered during utilization of PCM is thermal cross-talk between adjacent memory cells. Specifically, the induction of a phase change within one memory cell may inadvertently trigger a change in a neighboring memory cell. The thermal crosstalk may cause a so-called "program-disturb" phenomena in which data is lost from a memory cell during programming of a neighboring memory cell, and may cause other problems, such as, for example, reducing the useful lifetime of memory cells within an array.
It would be desirable to alleviate or prevent thermal crosstalk between neighboring memory cells of PCM arrays.

Integrated memory and methods of forming repeating structures


In one embodiment, a first node among a number of distributed nodes capable of forming or reforming a communication network between the nodes, each of the nodes including functionally similar components for forming or reforming such a network, includes a memory for storing values for variables for the node. The first node also includes one or more components collectively operable to: (1) spontaneously and independent of a centralized controller associated with the network, transmit a probe message to one or more of the other nodes for purposes of forming or reforming a network; (2) receive a probe message from a second node, the probe message including values for the variables for the second node; (3) compare the values for the variables for the first node to the values for the variables for the second node within the probe message to determine, independent of a centralized controller associated with the network, whether the first node should set itself to a new channel; and (4) if so, set the first node to the new channel.

Dynamic channel selection (DCS) generally allows nodes within a node group to automatically, without pre-existing knowledge of the channel initially occupied by each node in the node group, select a channel on which to initially form a network or select a new channel on which to reform the network when desirable (e.g., when the current channel becomes unusable). Certain implementations of DCS include a central controller within a DCS network that decides the channels on which nodes within a node group should initially form a network. Additionally, the central controller may decide when the network should transition to a new channel and then manage the channel transitions of other nodes. For example, the IEEE 802.11h working group is producing a specification that adds DCS capabilities to the IEEE 802.11a specification. As another example, the ETSI Broadband Radio Access Networks (BRAN) HIPERLAN/2 specification also includes DCS capabilities. Both of these approaches utilize a node within the network that is given special authority for deciding when the network should select a new channel based on the operating conditions on the current channel.

Distributed dynamic channel selection in a communication network


Modafinil polymorphic forms of modafinil racemate, methods of preparation thereof, pharmaceutical compositions and methods of therapeutic treatment involving modafinil polymorphic forms.

Modafinil (C15H15NO2S) of formula I, 2-(benzhydrylsulfinyl) acetamide, or 2-[(diphenylmethyl)sulfinyl]acetamide, is a synthetic acetamide derivative with wake-promoting activity, the structure of which has been described in U.S. Pat. No. 4,177,290 ("the '290 patent"), and whose racemate has been approved by the United States Food and Drug Administration for use in the treatment of narcolepsy.

A method of preparation of a racemic mixture is described in the '290 patent. A method of preparation of a levorotary isomer is further described in the U.S. Pat. No. 4,927,855 (both incorporated herein by reference).
Modafinil has been described as a compound having an interesting neuropsychopharmacological potential in mouse (U.S. Pat. No. 4,177,290). Modafinil also induces an important increase in night activity of monkey (Y. Duteil et al., Eur. J. Pharmacol., 1990; 180:49). Modafinil has been successfully tested in humans for treatment of idiopathic hypersomnia and narcolepsy (Bastuji et al., Prog. Neuropsych. Biol. Psych., 1988; 12:695).
Modafinil has also been described as an agent with activity on the central nervous system, and as a useful agent in the treatment of Parkinson's disease (U.S. Pat. No. 5,180,745), in the protection of cerebral tissue from ischemia (U.S. Pat. No. 5,391,576), in the treatment of urinary and fecal incontinence (U.S. Pat. No. 5,401,776), and in the treatment of sleep apneas and disorders of central origin (U.S. Pat. No. 5,612,379).
U.S. Pat. No. Re. 37,516 describes modafinil preparations of a defined particle size of less than about 200 microns that are more effective and safer than preparations containing a substantial proportion of larger particles.
Beside, these patents that relate to modafinil as racemate, U.S. Pat. No. 4,927,855 discloses the use of the levorotary isomer to treat depression, and disorders present in patients suffering from Alzheimer's disease.
Other therapeutic indications that relate to modafinil racemate are disclosed in more recent patent applications. For instance, international patent application. WO 00/54648 relates to the treatment of vigilance disorders of Steinert's disease, and international patent application WO 99/25329 relates to the treatment of hypersomnia in cancer patients that are administered with morphinic antalgics. Other known therapeutic indications include the treatment of attention deficit hyperactivity disorders (ADHD) linked to hyperactivity and treatment of tiredness and/or fatigue, particularly tiredness and/or fatigue associated to multiple sclerosis (international patent application WO 01/12170), as well as treatment of food behaviour disorders, wherein modafinil is active as an appetite stimulant (international patent application WO 01/13906). International patent application WO 01/13906 also suggests using low doses of modafinil (1 to 75 mg/day) to stimulate cognitive functions, without observing any improvement at higher doses.
The international patent application WO 02/10125 discloses polymorphs of modafinil and processes for preparing them.


In a shaving implement a handle is provided that includes a body section and an end portion projecting outwardly therefrom. An axle member is rotatably coupled to the end portion for selective angular movement relative thereto. A razor cartridge is coupled to the axle member and includes at least one razor blade that defines an at least partially exposed cutting edge. The razor cartridge is rotatably moveable with the axle member and the detent is provided for releasably retaining the axle member and thereby the razor cartridge in the user selected angular position relative to the handle.

Modern wet shave razors typically employ a blade carrying razor cartridge that pivots or rotates about an axis that is positioned approximately perpendicular to a handle forming part of the razor. While a wet shave razor configured in this manner can follow the contours of a user's skin better than a razor employing a fixed cartridge, the razor can be difficult to properly position when shaving areas such as an armpit. To achieve a close shave in such an area, one must orient one's hand in uncomfortable positions so that the razor cartridge, and thereby the exposed razor blades carried therein, can be drawn over all of the skin to be shaved. Accordingly, there is a need for a wet shave razor that allows a user to appropriately orient the razor cartridge relative to the area being shaved without having to uncomfortably contort one's arm or hand.
Another difficulty associated with the above-described wet shave razors is that the razor cartridge is only able to cut hair when stroked in one particular direction. This results in a user having to reposition the razor between successive strokes. This adds to the amount of time one spends shaving as well as increases the potential for shaving discomfort.
Based on the foregoing, it is the general object of the present invention to provide a shaving implement that improves upon or overcomes the problems and drawbacks associated with prior art wet shave razors.

Razor having a multi-position shaving head


A dynamically matched set of golf clubs having a variable optimum moment of inertia for each club in the set wherein each club has a moment of inertia proportional to the lie angle of the club and the optimum value of the moment of inertia is determined using precise mathematical formulas and calculations.

The present invention relates to a set of golf clubs, and in particular, to a set of golf clubs having a maximum effective moment of inertia.
The playing of the game of golf and the equipment used therewith are controlled by the United States Golf Association rules of golf, which are designed to preserve the essence of the game by not allowing equipment producing improvements outside the skill level of the player. For this reason, and given the fact that the equipment works well, golf equipment has stayed generally constant over time, the exception being the progression from wooden golf clubs to more technically advanced metals, graphites, and other plastics, which are currently in use today.
Golf is played with a set of golf clubs, each individual club being designed to hit certain types of golf shots and/or to hit the golf ball certain distances depending upon the player's position and distance from the target, the hole. Within these parameters, there are a wide variety of numbers and types of golf clubs which comprise a set. Normally, a set of clubs totals fourteen, the maximum number allowed when playing a game in accordance with United States Golf Association rules. Such a set includes three to five woods, a putter and the remainder being irons. Individual golfers often vary the makeup of each set of golf clubs. For example, a set can be made of only one or two wood type clubs, the rest of the set being distributed among irons and a putter. The distribution of the various clubs generally provide a golfer with a series of different lengths, weights and lofts of club heads, which enable the golfer to hit shots of varying distance and trajectory, depending upon the particular golf shot required when playing a game of golf on a golf course. Traditionally, wooden type golf clubs are used to hit the ball greater distances, whereas the iron type golf clubs hit shorter and more controlled golf shots. Most golf clubs used today are matched in accordance with swing weight, and in an optimum set, shaft frequency. Swing weight process is a system of static measurements based on a linear function of the shaft, grip and head in relationship to each other, using a swinging weight matching scale as described in the U.S. Pat. No. to Adams (1,953,916). The clubs of such a conventional matched set balance at the same setting on the scale. The scale reading is then used to designate the swing weight characteristics of the set to provide a statically balanced golf club. This process of swing weight measurement gained wide acceptance because most of the shafts used were relatively of the same dead weight. However, with modern technology. There are great weight differences in shafts due to new materials available, and the idea of swing weight is less applicable because this traditional way of matching golf clubs creates a set which does not swing the same. Conventional golf clubs are statically matched rather than being dynamically matched, so that the clubs within the set are not matched when they are swung to hit a golf ball.
The concept of dynamically matching a set of golf clubs in accordance with the moment of inertia has been addressed in the prior art. For example, the U.S. Pat. No. to Marciniak (3,473,370) discloses a method of producing a dynamically matched set of golf clubs having the same moment of inertia by selecting a club of a desired swinging and playing action and determining its moment of inertia. This is accomplished using a torsional pendulum and measuring the moment of inertia with respect to the center of gravity. A set is made by selecting other clubs and applying heads of different weights until measurement with the torsional pendulum indicates that the same moment of inertia has been obtained. The data is plotted on a graph, which then can be read for the required head weights for the complete set.
The U.S. Pat. No. to Everett, III (3,698,239) relates to a dynamically matched set of golf clubs also having identical moments of inertia with respect to a common swinging axis. Using a selected club, the moment of inertia is determined by calculation from length and weight parameters. The head weights required for dynamically matching other sets in the club are matched to the favorite club.
The U.S. Pat. No. to Osborne et al. (3,703,824) relates to an apparatus for comparing moments of inertia of golf clubs about a given axis using a balance beam on a fulcrum, a means for supporting a club and a weight adapted to slide along the balance beam for counterbalancing the shaft and head, and a second weight on the beam between the fulcrum and the head whereby the two counterweights move over separate scales. The first scale is positioned on part of the beam and calibrated in units of moment of inertia, and the second scale positioned on another part of the beam, calibrated in length of the golf club. To make a set of clubs, each club is chosen such that its moment of inertia about a specific axis does not vary by more than a preset amount.
The U.S. Pat. No. to Suganuma (4,900,025) relates to a dynamically matched set of golf clubs using a uniform grip weight, shafts having different lengths and different shaft deflection characteristics. When a given torque is applied to each club about the same reference point, moments of force at the head and sides of the club are standardized with reference to a central portion between the hands of the player who holds a club during a swing about a rotating axis. When natural frequencies of the club head end are set and measured with reference to the central portion as a support end, the natural frequency of arbitrary clubs are fixed in accordance with a predetermined formula.
The U.S. Pat. No. to Turley (4,212,193) is directed to an apparatus and method for determining the moment of inertia of golf clubs using a low-cost electronic means to measure periods of oscillation and to compute and display the moment of inertia thereby. The patent teaches that clubs are matched by adding weight or adjusting length in order that the moment of inertia of each golf club be matched.

Matched sets for golf clubs having maximum effective moment of inertia


Methods, systems, and computer program products for performing range-based directory number (DN) screening are disclosed. According to one aspect, the subject matter described herein includes a method for determining that a telecommunications device DN is within an allowed set of numerical ranges. The method includes creating a range tree for representing an allowed set of numerical DN ranges, wherein each range is defined by a numerical upper and lower bound, and storing the range tree in a memory device; receiving a telecommunications device DN to be analyzed; traversing the range tree from a root node of the tree, based on analyzing each digit of the DN, until a leaf node is reached; and determining, based on an attribute associated with the leaf node reached, whether the DN is within the allowed set of ranges.

Directory number (DN) analysis and screening is a mandatory step in routing a call through a digital switch, such as a soft switch. DN screening determines whether a received DN belongs to the domain of a digital switch and thus determines how the switch will process the DN.
DN analysis typically includes the following steps: DN screening, which determines whether the directory number belongs to the domain serviced by the switch; digit analysis, which analyzes the received digits and processes the call based on the results of the analysis; and routing analysis, which determines the route to be taken by the call based on the results of the digit analysis. The DN screening step traditionally involves performing either a database query or a prefix pattern match.
The database approach typically involves storing in a database each number in the domain of the switch. During operation, a database access is made for each DN that is screened. Although this is an easy method to implement, the database access may incur significant processing overhead at every switch, due to the fact that a database access or query is performed for every DN; this additional overhead may degrade overall performance of the switch and may thus cause an unacceptable loss of capacity during peak traffic. The screening of a large number of DNs may become a significant bottleneck of a digital switch; in extreme cases, calls may be dropped or routed to other switches if a switch has exhausted its resources during the DN screening phase.
The prefix pattern match approach typically involves creating a table that stores a list of every prefix within the domain. For 10-digit numbering plans the prefix may be the most significant 7 digits of the DN, reflecting the fact that telephone numbers may be assigned to operators in blocks of 1,000 numbers. If operator A has been assigned a single block of 1,000 DNs, from 919.493.8000 through 919.493.8999, for example, a switch owned by operator A need only check only a single prefix (i.e., "9194938") to determine if the number is within the assigned block. In this example, the table of prefixes contained within the domain would include just one entry: [9194938]. A prefix pattern match could be achieved with a single comparison. However, the prefix table for a switch with a domain containing telephone numbers 214.222.2000 through 310.999.9000 would contain 967,778 prefixes: [2142222, 2142223, 2142224 . . . , 3109997, 3109998, 3109999], where each prefix represents a block of 1,000 DNs. The prefix pattern match method also has some distinct disadvantages. First, this approach is not scalable to handle blocks of numbers with the same property that do not share a prefix. Although there are mathematic and other techniques, such as the use of parse trees, that avoid the necessity of performing the above-described prefix comparisons to perform a prefix pattern match, one problem is that for optimum speed, the entire table or tree should be in memory. Due to the size of the table and limitations on memory resources, however, it may be impossible or prohibitively costly to keep the entire table or tree in memory. Second, if a database is used to store prefixes rather than storing the full DN, although the prefix pattern match approach may reduce by a factor of 1000 the number of entries that must be stored and compared, that number may still be large enough to cause performance of the switch to suffer due to the overhead incurred by database access and processing. Third, if a parse tree is used to store prefixes, although the use of such a tree has the benefit of fast number lookup (at the expense of potentially enormous memory requirements, as mentioned above), the maintenance of parse trees—adding and deleting blocks of numbers—may be very resource intensive and thus costly, and may require multiple traversals of the entire tree. In situations where the numbers associated with the domain of a particular switch change relatively often, the additional overhead incurred to continuously maintain the tree may cause performance of the switch to suffer unacceptably.
Accordingly, in light of these disadvantages associated with database lookup and prefix pattern-matching methods of DN screening, there exists a need for a way to perform DN screening that is fast, uses minimal processing and memory resources, and is easily and quickly maintained.


A method for decoding high efficiency video coding, comprising determining whether a coding unit is within an intra slice or an inter slice, determining whether intra block copy has been enabled, reviewing syntax for said coding unit for an intra block copy flag when the coding unit is within an intra slice and intra block copy has been enabled, and omitting reviewing the syntax for the intra block copy flag when the coding unit is within an inter slice.

High Efficiency Video Coding (HEVC) is a video coding standard being developed to provide improved video compression when compared to previous standards such as H.264/MPEG-4 Advanced Video Coding (AVC), in order to better handle the large amounts of data present in high resolution video files. HEVC is a block-based hybrid spatial and temporal predictive coding scheme in which an input image, such as a video frame, is divided into square blocks called coding tree units (CTUs). Unlike many other video coding schemes that break input images into macroblocks of 16×16 pixels, each CTU in HEVC can be as large as 64×64 pixels. Each CTU can then be recursively divided into one or more levels of smaller square blocks called Coding Units (CUs) that are coded.
In HEVC, prediction units (PUs) within each individual CU can be coded with intra prediction or inter prediction. Coding a PU with intra prediction uses spatial prediction, in which a predicted PU is predicted from a spatial prediction direction based on neighboring pixels around the PU being coded, and the spatial prediction direction is coded in syntax. Coding with inter prediction uses temporal prediction, in which predicted PU motion compensation blocks that are similar to the PU being coded are found in other image slices within the same or different input images. Motion vectors are coded in syntax that point to predicted PU motion compensation blocks in other image slices, along with an index identifying reference pictures in which the other image slices appear.
In some embodiments or extensions of HEVC algorithms, a technique called intra block copy (IBC) can be alternately used when coding an input image. Coding a CU using intra block copy can be done by finding an intra block copy compensation block that is similar to the CU being coded within the same image slice as the CU being coded. A intra block copy vector can be coded in syntax that points to the intra block copy compensation block. As such, intra block copy vectors and intra block copy compensation blocks for a CU can be similar to the motion vectors that point to motion compensation blocks used when coding PUs with inter prediction, expect that the intra block copy compensation blocks are within the same slice as the CU being coded.
Intra block copy offer improved compression in many situations when compared to only using intra prediction and inter prediction. For example, because an individual slice often contains repeated patterns, an intra block compensation block found at another position in the same slice can often be more similar to the CU being coded than predicted PUs generated through spatial prediction.
However, an even closer match for a CU than the one found through intra block copy can often be found in another slice using the temporal prediction of inter prediction. For example, when coding a video sequence showing a ball moving from the top left corner of the screen to the lower right corner of the screen, coding the CU showing a portion of the ball can be more efficiently coded by referring to areas of previous or subsequent images that show the same portion of the ball rather than coding another portion of the same slice that may not show the ball. As such, intra block copy is often irrelevant when coding CUs within inter slices.
Most existing HEVC coding systems add an intra block copy flag to each and every CU when coding with intra block copy. This intra block copy flag indicates whether or not intra block copy was used when coding the CU. However, because intra block copy is often irrelevant when coding CUs within inter slices, having an encoder add an intra block copy flag to every CU, even ones for which the intra block copy information is generally irrelevant, the addition of the intra block copy flag adds an unnecessary bit to the bitstream, and also wastes time and processor cycles. It also wastes time and processor cycles for a decoding system, because the decoding system checks each CU for the value of its intra block copy flag, even when the information provided by the intra block copy flag is likely not relevant for CUs in inter slices.

Intra block copy for intra slices in high efficiency video coding (HEVC)


Embodiments of the present invention provide an approach for migrating virtual machines across network (e.g., WAN) separated data centers (e.g., storage clouds). Specifically, under embodiments of the present invention, a first storage system associated with a first data center is synchronized with a second storage system associated with a second data center via a storage system link. Then, a minimal state of a virtual machine is migrated from a first computer in the first data center to a second computer in the second data center via a WAN link. Using the minimal state, the virtual machine is stored in the second computer. Thereafter, the storage system link is terminated. In addition, as updated pages are received in memory of the first computer, they are migrated to the second computer via the WAN link. Once this migration is complete, the WAN link can be terminated. Therefore, embodiments of the present invention provide at least two forms of synchronization: computational synchronization and storage synchronization.

The cloud computing environment is an enhancement to the predecessor grid environment, whereby multiple grids and other computation resources may be further abstracted by a cloud layer, thus making disparate devices appear to an end-user as a single pool of seamless resources. These resources may include such things as physical or logical compute engines, servers and devices, device memory, and storage devices.
With multiple clouds operating in different geographical regions, the ability to move workloads running inside of virtual machines from one location to another is a growing desire. Among other things, previous solutions do not address the following: (1) the cost of accessing storage over a WAN once the virtual machine has moved; and (2) the cost of moving large amounts of virtual machine state information over the WAN.

Migrating virtual machines across network separated data centers

International Business Machines Corporation


Water having alkalies selected from sodium, potassium and mixtures thereof dissolved therein is treated with a composition to reduce the concentration of the alkalies whereby the water is rendered usable according to ASTM standards to render the water usable as concrete mix water. The composition and the method of its use is disclosed herein, wherein the composition is selected from compounds in the group consisting of lithium carbonate, acid zirconium phosphate, carbon dioxide and mixtures thereof.

1. Technical Field of the Invention
This invention broadly relates to water used to prepare fluid concrete, which is referred to in the concrete construction art as plastic concrete. The invention further relates to the physical separation of the liquid and solid components of plastic concrete, and, subsequent to the said physical separation, the invention still further relates to the chemical treatment of the liquid component of the plastic concrete to render the liquid component useful as mix water to make new plastic concrete.
2. Description of the Prior Art and Problems Solved
It is well known that concrete is useful as a basic and highly versatile material of construction. The versatility of concrete stems, at least in part, from the fact that concrete initially occurs in a fluid condition, which, after a period of time, converts to a monolithic solid condition. In the fluid condition, concrete, being comprised of discrete solids dispersed in water, has little or no compressive strength; it can be pumped; and it will flow into and assume the shape of a container, referred to in the art as a form. After a period of time, fluid concrete converts to the dense, rigid, monolithic solid condition having the shape of the form and exhibiting substantial compressive strength. For purposes of this disclosure, the fluid condition of concrete, is referred to herein as plastic concrete, and the monolithic solid condition of concrete is referred to herein as set concrete.
The solids dispersed in concrete are comprised of hydraulic cement and aggregate wherein the aggregate ordinarily, but not always, consists of graded coarse aggregate, i.e. rock, mixed with graded fine aggregate, i.e. sand.
It is known that plastic concrete can be prepared in one location, which can be remote from the place of its intended use, and then conveniently transported by known means, such as in a truck, to the place of its intended use. It is also known that plastic concrete can be prepared while being transported to the intended place of use. A truck ordinarily employed to transport plastic concrete is referred to in the art as a ready mix truck.
After plastic concrete has been delivered to the intended location of use in a ready mix truck and caused to flow therefrom into a form, it is known that some plastic concrete may be left in the truck or, at least, that the walls of the truck will be covered with a wet hydraulic cement residue. It is known that any plastic concrete or wet hydraulic cement residue remaining in the truck will conform to the shape of the truck as if it were a form, and, if permitted to remain undisturbed therein for a sufficient period of time, that the cementitious material will hydrate to thereby produce set concrete.
Operators of ready mix trucks do not desire plastic concrete or wet cement residue to set in their trucks. Accordingly, it is well known in the art that operators attempt to remove unused plastic concrete and/or wet hydraulic cement residue, both of which, separately and collectively, are, for convenience, referred to herein as "unset cement", from a ready mix truck by vigorously contacting the unset cement with water to dilute the unset cement whereby it is flushed from the truck. It is apparent that this water flush technique creates a disposal problem. At one time the disposal problem was not addressed, because the wash effluent, consisting of plastic concrete and a highly diluted mixture of aggregate and hydraulic cement, was merely dumped on the ground. This, method can be an environmental problem, and, furthermore, constitutes a waste of water, aggregate and hydraulic cement. The handling and treatment of wash effluent and a solution to the disposal problem is the subject of this disclosure.
The prior art has attempted to harmonize the need to thoroughly wash unset cement from trucks while avoiding the practice of dumping the wash effluent on the ground. In this regard, the art has developed a method for physically separating the component parts of unset cement comprised of the steps of flushing unset cement from a container, such as a ready mix truck, by diluting the unset cement in the ready mix truck with a sufficient quantity of water to produce a wash effluent, comprised of aggregate, hydraulic cement and water, which will flow from the truck; placing the wash effluent in a storage/holding tank; and then performing a further series of steps, referred to in the art as concrete reclaiming, to separate the aggregate from the other named components of the wash effluent.
Concrete reclaiming is known in the art and is broadly comprised of the steps of contacting the mentioned wash effluent with a quantity of water sufficient to physically separate the hydraulic cement component from the aggregate component to form a solid phase which is distinctly separate from the liquid phase; separating the solid (aggregate) phase from the liquid phase in a clarification step or a sieve and size separation step to thereby produce one or more solid phase streams and a liquid stream; and, thereafter, storing the aggregate or aggregates for future use in new plastic concrete and storing the liquid stream, referred to in the art and herein as "gray water," in a holding pond or storage tank.
Gray water is not a true solution. It is comprised of finely divided solids which are dispersed in an aqueous liquid phase as well as solids which are dissolved in the aqueous liquid phase. In the prior art method described above, gray water is placed in a holding pond and is permitted to remain undisturbed therein for a time sufficient for the solid components thereof to settle and for the liquid component thereof to evaporate or to separate whereby the liquid can be removed by pumping. The solids are then excavated from the pond and disposed of in a landfill. A disposal problem, accordingly, still exists and water is still wasted.
The ability to use gray water to make new plastic concrete is a desirable object. If this use of gray water could be realized, then there would be no disposal problem and there would be no waste problem because the aggregate reclaimed could be recycled, as it now is, to make new plastic concrete. and the gray water, which, as defined, includes the liquid component of the reclaimed plastic concrete and wash water, could also be recycled to make new plastic concrete. The prior art, however, as discussed below, has not solved the problem of treating gray water to render it completely useful as mix water to make plastic concrete.
It has been observed that set concrete made with mix water having an unacceptably high concentration of dissolved alkali metal exhibits low durability and tends to crumble. The prior art has not solved this problem in that it has failed to provide a method of treating potential mix water, for example gray water, to convert alkalies dissolved in such water to a form which will not cause the production of set concrete which can be weak and/or unstable. In the context of this invention, the phrase "dissolved alkali metal" and the word "alkalies" refer to sodium, potassium and mixtures thereof which is/are dissolved in the mix water. The sum of the concentrations of dissolved sodium and dissolved potassium is expressed as sodium oxide equivalents, Na.sub.2 O!eq, in parts per million parts (ppm). To this end, the AMERICAN SOCIETY OF TESTING MATERIALS (ASTM) has published a Standard Specification For Ready-Mixed Concrete, ASTM C 94-89b, which establishes set time and performance criteria for plastic concrete which is made with water having questionable or otherwise unknown chemical content, and specifies the concentration limits of certain chemicals present in such water. Tables 1 and 2, below, contain the set time, performance and concentration limits referred to above.
TABLE 1 ______________________________________ ACCEPTANCE CRITERIA FOR QUESTIONABLE WATER SUPPLIES TEST PROPERTY LIMIT METHOD ______________________________________ Minimum Compressive Strength, @ 7 days 90% ASTM C 109 as a percent of control Set Time, deviation from control, Hrs:Mins ASTM C 191 minimum earlier set 1:00 maximum later set 1:30 ______________________________________
TABLE 2 ______________________________________ CHEMICAL LIMITATIONS FOR MIX WASH WATER DISSOLVED CHEMICAL LIMIT maximum concentration in mix water ppm TEST METHOD ______________________________________ Chloride, expressed as C1 ASTM D 512 prestressed concrete 500 concrete in bridge deck 500 concrete in moist environments 1000 concrete containing aluminum 1000 concrete containing dissimilar metals 1000 concrete contacting galvanized metal 1000 SULFATE, expressed as SO.sub.4 3000 ASTM D 516 ALKALIES, expressed as Na.sub.2 O! + 600 0.658K.sub.2 O! TOTAL SOLIDS 50,000 AASHTO T26 ______________________________________
With regard to the data in Table 2, notice that water having an ALKALIES concentration greater than 600 ppm cannot be employed as mix water to make plastic concrete which complies with ASTM specifications. It has been observed that gray water can, and often does, contain "dissolved alkali metal" in excess of 600 ppm and is, thus, not useable as mix water to make plastic concrete meeting ASTM specifications. However, such water, as demonstrated in Example 3, below, can be employed to make concrete, but the water does not comply with ASTM specifications.
This invention, accordingly, provides a method of treating water, for example gray water, containing alkali metal dissolved therein to convert the dissolved alkali metal content thereof to a nonreactive form or forms. The method thus operates to reduce the concentration of alkalies dissolved in the water whereby, for example, the water is rendered useable as mix water which meets ASTM specifications for making plastic concrete. The treated water is usable as mixing water without performing further steps to physically remove the alkali metals therefrom. Thus, in one preferred aspect of this invention, there is provided a method of using all components, solid and liquid, of old plastic concrete, and wash water to make new plastic concrete. This invention, accordingly, avoids the waste disposal and environmental problems associated with methods currently employed.