A superior graphic processing device is provided that performs parallel and fast edge function processing for coverage calculations during an anti-aliasing process. The edge function for each sub-pixel of a pixel can be described separately for the base edge function Bef concerning pixel coordinates, and the sub-edge function Sef concerning sub-pixel references, and when the sum of the values for the edge functions Bef and Sef is substituted as a variable for evaluation function LineIOcheck, whether a sub-pixel is located above, below, or on an edge line can be determined. xcex94x less than  less than x and xcex94y less than  less than y are established, the value of the sub-edge function Sef being considerably smaller than that of the base edge function Bef. When a plurality of relatively small Sef processing units are provided relative to one relatively large Bef processing unit, an LSI can be designed that integrates in a small area and that has the same coverage calculation capability. Further, the Bef calculation and a plurality of Sef calculations can be performed in parallel.

1. Field of the Invention
The present invention relates to a graphic processing device for generating a computer graphics (CG) screen on a display, such as a CRT (Cathode Ray Tube), and in particular to a graphic processing device which divides an object into multiple polygons and performs a geometric process on the polygons, and then for rasterizes pixels that constitute each polygon. More specifically, the present invention pertains to a graphic processing device for performing an anti-aliasing process to remove aliasing at the edges of polygons, and in particular to a graphic processing device for performing anti-aliasing in accordance with a percentage (i.e., a coverage) of sub-pixels, included in a pixel, that are covered by a polygon.
2. Related Art
In accordance with recent technical progression, application fields for computers have expanded. The preparation and processing of graphic forms and images using computers, i.e., computer graphics (CG), is one of examples. Recently, in accordance with improvements in the display capabilities of computers, and functional enhancements of graphic processes, xe2x80x9cthree-dimensional graphicsxe2x80x9d that generate two-dimensional images of three-dimensional objects and display them has been focused on. Three-dimensional graphics is a technique whereby an arithmetic model is employed to represent an optical phenomenon of a three-dimensional object when it is illuminated by a light source, and that performs shading of the surface of the object based on the arithmetic equation model, or that puts a pattern to a two-dimensional image to generate a graphic image that has a more realistic appearance and has three dimensions. The three-dimensional graphic techniques have become more popular for the CAD/CAM in science, engineering, manufacturing and other application fields, and in various software development fields.
The graphic processing system generally comprises a xe2x80x9cgeometry sub-systemxe2x80x9d that is regeared as a front end and a xe2x80x9craster sub-systemxe2x80x9d that is regarded as a back end.
The geometry sub-system is a system for performing a geometric process to determine the position of an object on a computer screen. In the geometry sub-system, generally, an object is treated as a set of multiple polygons (normally triangles), and processing is performed for each polygon. That is, geometric calculations, such as xe2x80x9ccoordinate transformation,xe2x80x9d xe2x80x9cclippingxe2x80x9d and xe2x80x9ccalculation relative to a light source,xe2x80x9d are performed for each vertex that defines a polygon. xe2x80x9cCoordinate transformationxe2x80x9d is a process for transforming the coordinates of each vertex of a provided polygon in accordance with the position of a viewpoint. xe2x80x9cClippingxe2x80x9d is a process for detecting and removing a portion of a polygon that is outside the boundaries of the edge of a computer screen. xe2x80x9cCalculation relative to a light sourcexe2x80x9d is a process for acquiring the luminance of each vertex based on the positional relationship with a light source.
The raster subsystem is a system for generating pixels that constitute an object. The rasterization process is generally performed by interpolating image parameters for all pixels in the polygon, with employing an image parameter that is obtained for each vertex of a polygon. The image parameters are color data represented by RGB and a Z value representing the depth. For the latest three-dimensional graphic process, an f (fog), to express a distance, and a t (texture), to express a material or a pattern on the surface of an object to provide reality, are included as image parameters. These image parameters are also calculated for each pixel.
Almost all data in the computer engineering field are represented as digital values. Therefore, so-called aliasing, which is an undesirable phenomenon, frequently appears during the conversion of an analog phenomenon in the natural world into discontinuous digital values. In computer graphic processing, aliasing is perceived as being the zig-zag edges of a polygon, or as a graphic form that has an inaccurate shape. This phenomenon is also caused because the pixels of a display are too large or the resolution is insufficiently high in comparison with the visual acuity of a person.
The process employed for removing the aliasing phenomenon is generally called anti-aliasing. The anti-aliasing process in the computer graphic field can be performed, for example, by dividing a pixel, which is the minimum unit for a drawing process, into multiple sub-pixels and by re-evaluating image data (color data, etc.) concerning the pixel obtained during the rasterization process. In other words, in the anti-aliasing process, a pixel that is cut across by the edges of polygons is divided into 4xc3x974, 8xc3x978 or 16xc3x9716 sub-pixels, and the value of the color data provided for a pixel is adjusted in accordance with the percentage of sub-pixels covered by a polygon (the sub-pixels to be painted), i.e., the coverage of the sub-pixels.
In the example shown in FIG. 5, a part of a pixel is covered with a polygon having a linear edge. When the pixel is divided into 4xc3x974 sub-pixels, the coverage is 14/16. In the example shown in FIG. 6, a part of a pixel is covered with a polygon having an arced edge. When the pixel is divided into 4xc3x974 sub-pixels, the coverage is 14/16. In these examples, instead of determining the color data for a pixel to be discontinuous values based on whether or not a pixel is covered by a polygon, the graduation should be adjusted in accordance with the extent of the coverage of the pixel. As a result, discontinuity at the edge will be reduced and the display quality will be enhanced. A graduation substantially similar to a natural phenomenon may be added to the edges of the polygon by performing anti-aliasing. For example, a three-dimensional wire frame model generated by CAD can be drawn as a continuous smooth line with no zig-zags. In addition, an image can be drawn for which there is less smearing of color at the edge of a polygon.
For the coverage calculations for acquiring the percentage of sub-pixels covered, whether the sub-pixels of a pixel are positioned inside a polygon, along an edge line, or outside the polygon must be determined. In other words, for the coverage calculation, a processing function (edge function) must be performed to determine the position of each sub-pixel, either above, below or on an edge line that defines the boundary of a polygon.
It would be easily understood by one having ordinary skill in the art that the edge function is represented by geometric calculation expressions that include several terms. Since the edge function processing is conventionally performed by software, fast calculation is difficult. It is preferable for fast anti-aliasing that a specific hardware circuit (e.g., an LSI) be used and that parallel processing be performed. However, the edge function processing involves multiple multiplications and divisions, and a relatively large gate size is required for implementing the hardware that performs such calculation (well known). Therefore, the size of the LSI chip would become larger and accordingly, the manufacturing costs would increase.
It is, therefore, one object of the present invention to provide a superior graphic processing device to perform an anti-aliasing process for removing aliasing that occurs at the edges of polygons.
It is another object of the present invention to provide a superior graphic processing device that performs anti-aliasing in accordance with a percentage (coverage) of the sub-pixels, included in a pixel, that are covered by a polygon.
It is an additional object of the present invention to provide a superior graphic processing device that performs parallel and rapid processing to acquire a coverage required for an anti-aliasing process.
It is a further object of the present invention to provide a superior graphic processing device on which an LSI having a relatively small gate size can be implemented to acquire the coverage required for anti-aliasing.
To achieve the above objects, according to a first aspect of the present invention, a graphic processing device that has a function for calculating a coverage that indicates the percentage of a pixel to be painted, includes: means for providing information relating to an edge line that defines the border between a portion to be painted and a portion not to be painted; a first processing unit for processing an edge function with regard to a pixel coordinate; more than one second processing unit for processing an edge function with regard to a sub-pixel reference for the respective sub-pixels within the pixel; evaluation means for determining, in accordance with output of the first and second processing units, whether the sub-pixel is located above, below, or on the edge line; and coverage calculating means for calculating a coverage for the pixel based on the resultant values of the evaluation means with regard to the respective sub-pixels.
According to a second aspect of the present invention, a graphic processing device that has a function for adjusting a pixel graduation according to a coverage that indicates the percentage of a pixel to be painted, includes: means for providing information relating to an edge line that defines a border between a portion to be painted and a portion not to be painted; means for determining image information for the portion to be painted; a first processing unit for processing an edge function with regard to a pixel coordinate; more than one second processing unit for processing an edge function with regard to a sub-pixel reference for the respective sub-pixels within the pixel; evaluation means for determining, in accordance with output of the first and second processing units, whether the sub-pixel is located above, below, or on the edge line; coverage calculating means for calculating a coverage for the pixel based on the resultant values of the evaluation means performed with regard to the respective sub-pixels; and means for adjusting image information of the pixel according to the obtained coverage.
The second processing unit can be mounted outside the first processing unit.
According to a third aspect of the present invention, a coverage calculating unit that calculates a coverage that indicates the percentage of a pixel within a predetermined area, includes: a first processing unit for receiving coordinate data that defines an edge line of the predetermined area and coordinate data of a pixel, for acquiring an edge function that defines the edge line and outputting a coefficient for the edge function, and for processing the edge function of the pixel and outputting the result; more than one second processing unit for receiving the coefficient of the edge function that defines the edge line, and a sub-pixel reference of the respective sub-pixels within the pixel, and for calculating an edge function of the corresponding sub-pixel and outputting the result; and a determination unit for, by employing a result of the edge function obtained through the first processing unit and the result of the edge function obtained through the respective second processing units, determining whether the sub-pixel is inside or outside the predetermined area.
According to a fourth aspect of the present invention, a coverage calculating unit that calculates a coverage that indicates the percentage of a pixel within a predetermined area, comprises: a first processing unit for receiving coordinate data that defines an edge line of the predetermined area and coordinate data of a pixel, for acquiring an edge function that defines the edge line and outputting a coefficient for the edge function, and for processing the edge function of the pixel and outputting the result; more than one second processing unit for receiving the coefficient of the edge function that defines the edge line, and a sub-pixel reference of the respective sub-pixels within the pixel, and for calculating an edge function of the corresponding sub-pixel and outputting the result; a determination unit for, by employing a result for the edge function obtained through the first processing unit and a result for the edge function obtained through the second processing unit, determining whether the sub-pixel is inside or outside the predetermined area; and a coverage calculating unit for collecting results for all sub-pixels within the pixel and calculating a coverage of the pixel.
The second processing unit can be mounted outside the first processing unit.
The basic principle of the present invention will now be explained in detail.
An equation (i.e., edge function: ef) for a line (edge) that connects two vertexes, V0 (x0, y0) and V1 (x1, y1), of a polygon is expressed as equation (1) below. In equation (1), dx=x1xe2x88x92x0 and dy=y1xe2x88x92y0.
ef=(yxe2x88x92y0)dxxe2x88x92(xxe2x88x92x0)dyxe2x80x83xe2x80x83[Equation 1]
Assume that a point slightly apart from an arbitrary point (x, y) on the line (edge) is (x+xcex94x, y+xcex94y). When the coordinates at this point are substituted into equation (1), the edge function is represented as equation (2).
ef=(yxe2x88x92y0)dxxe2x88x92(xxe2x88x92x0)dx+xcex94ydxxe2x88x92xcex94xdyxe2x80x83xe2x80x83[Equation 2]
Assuming that point (x, y) is pixel coordinates, (x+xcex94x, y+xcex94y) can be sub-pixel coordinates and (xcex94x, xcex94y) can be a sub-pixel reference values. In many cases, each sub-pixel reference is integer times a constant value.
When the edge function for sub-pixel coordinates (x+xcex94x, y+xcex94y), expressed by equation (2), is divided into the base edge function Bef, concerning pixel coordinates (x, y), and the sub-edge function Sef, concerning sub-pixel reference (xcex94x, xcex94y), they are described as equations (3) and (4) below.
Bef=(yxe2x88x92y0)dx+(x0xe2x88x92x)dyxe2x80x83xe2x80x83[Equation 3]
Sefxe2x88x92xcex94ydxxe2x88x92xcex94xdyxe2x80x83xe2x80x83[Equation 4]
When the sum of the values of the edge functions Bef and Sef is substituted into the above equations as a variable of evaluation function LineIOcheck, a lineIO information for a sub-pixel (whether a sub-pixel is located above, below, or on an edge) can be determined (see equation (5)).
IO=LineIOcheck(Bef+Sef)xe2x80x83xe2x80x83[Equation 5]
Generally, sub-pixel references xcex94x and xcex94y are considerably smaller than pixel coordinates x and y, and xcex94x less than  less than x and xcex94y less than  less than y are established. Accordingly, the sub-edge function Sef is considerably smaller than the base edge function Bef.
In the computer engineering field, a small data value can be represented by a narrow bit width, so that the gate size of an LSI which implements the process for a small data value is small. A Bef processing unit that must process a relatively large coordinate value must also be relatively large. For example, a graphics workstation display has a resolution of about 4096=213)xc3x974096 (=213), and x and y coordinates for addressing a pixel require an 18-bit width, 13 bits for an integer portion and 5 bits for a decimal fraction portion. Since the Bef processing unit receives and processes the x and y coordinates that each have an 18-bit width, a large processing unit is required. On the other hand, sub-pixel references xcex94x and xcex94y correspond only to the decimal fraction portion of the pixel coordinates for x and y, so that only a three-bit width is sufficient for 8xc3x978 sub-pixels. That is, since the Sef processing unit processes only three-bit sub-pixel references xcex94x and xcex94y, only a small processing unit is required.
While the Bef processing is performed once for one pixel, the Sef processing must be performed for each of the sub-pixels within a pixel. In addition, taking the sizes of the processing units into consideration, it is very probable according to an packaging technique that a single Bef processing unit and a plurality of Sef processing units can be provided on a single LSI chip.
As previously described, in the coverage calculation, the processing (Bef processing) for the coordinates of one pixel is accompanied by the processing (Sef processing) for 4xc3x974, 8xc3x978 or 16xc3x9716 sub-pixel references. When the edge function is divided into the base edge function portion Bef, concerning the pixel coordinates, and the sub-edge function portion Sef, concerning the sub-pixel reference, and when a plurality of Sef processing units are provided for one Bef processing unit, a high efficiency for the mounting of a single LSI chip can be performed and the implementation of the equivalent coverage calculation capability requires only a small area, so that manufacturing costs can be reduced. Further, since the Bef calculation for a pixel and a plurality of Sef calculations for sub-pixels, which accompanies the Bef calculation, are performed in parallel, the processing speed can be increased.
While in the above description it has been assumed that the edge function was for a linear edge of a polygon, the edge function for an arced edge will be described.
Assume that the edge of a polygon is composed of an arc with a center Vc (xc, yc) and a diameter d. The equation (edge function: cef) for the arc is thus represented as equation (6).                     Cef        =                                            (                              d                2                            )                        2                    -                      {                                                            (                                      x                    -                                          x                      c                                                        )                                2                            +                                                (                                      y                    -                                          y                      c                                                        )                                2                                      }                                              [                  Equation                                xe2x80x83                              6                ]
Assume that a point slightly apart from an arbitrary point (x, y) on the arc (edge) is (x+xcex94x, y+xcex94y). When the coordinates at this point are substituted into equation (6), the edge function is represented as equation (7). It should be noted that xxe2x88x92Xc=dx and yxe2x88x92yc=dy.                     Cef        =                                            (                              d                2                            )                        2                    -                      (                                          ⅆ                                  x                  2                                            +                              ⅆ                                  y                  2                                                      )                    -                      {                                          2                                                  (                                                                                ⅆ                        x                                                                                xe2x80x83                                                                  Δ                                                                    xe2x80x83                                                                  x                                        +                                                                  ⅆ                        y                                                                                xe2x80x83                                                                  Δ                                                                    xe2x80x83                                                                  y                                                        )                                            +                              Δ                                                  xe2x80x83                                                                  x                  2                                            +                              Δ                                                  xe2x80x83                                                                  y                  2                                                      }                                              [                  Equation                                xe2x80x83                              7                ]
Assuming that point (x, y) is pixel coordinates, (x+xcex94x, y+xcex94y) can be sub-pixel coordinates and (xcex94x, xcex94y) can be a sub-pixel reference values, as previously described. In many cases, each sub-pixel reference is integer times a constant value.
When the edge function for sub-pixel coordinates expressed by equation (7) is divided into the base edge function Bef, concerning pixel coordinates (x, y), and the sub-edge function Sef, concerning sub-pixel reference (xcex94x, xcex94y), they are described as equations (8) and (9) below.                     Bef        =                                            (                              d                2                            )                        2                    -                      (                                          ⅆ                                  x                  2                                            +                              ⅆ                                  y                  2                                                      )                                              [                  Equation                                xe2x80x83                              8                ]            xe2x80x83Sef=xe2x88x92{2(dxxcex94x+dyxcex94y)+xcex94x2+xcex94y2}xe2x80x83xe2x80x83[Equation 9]
When the sum of the values of the edge functions Bef and Sef is substituted as a variable of evaluation function CircleIOcheck into the above equations, a circleIO information for a sub-pixel (whether a sub-pixel is located above, below, or on an edge) can be determined (see equation (10)).
IO=CircleIOcheck(Bef+Sef)xe2x80x83xe2x80x83[Equation 10]
Generally, sub-pixel references xcex94x and xcex94y are considerably smaller than pixel coordinates x and y, and xcex94x less than  less than x and xcex94y less than  less than y are established. Accordingly, the sub-edge function Sef is considerably smaller than the base edge function Bef (described above).
In the computer engineering field, a small data value can be represented using a narrow bit width, so that the gate size of an LSI to be implemented for processing a small data value is small. A Bef processing unit that processes a relatively large coordinate value must be relatively large. On the other hand, as the required Sef processing unit is small, a plurality of Sef processing units can be provided for one Bef processing unit (as described above).
As previously described, in the coverage calculation, the processing (Bef processing) for the coordinates for one pixel is accompanied by the processing (Sef processing) of 4xc3x974, 8xc3x978 or 16xc3x9716 sub-pixel references. When the edge function is divided into the base edge function portion Bef, concerning the pixel coordinates, and the sub-edge function portion Sef, concerning the sub-pixel reference, and when a plurality of Sef processing units are provided for one Bef processing unit, an LSI chip having a small area can be designed that has the same coverage calculation capability and a high mounting efficiency, resulting in the reduction of manufacturing costs. Further, since the Bef calculation for a pixel and the Sef calculations for a plurality of sub-pixels, which accompany the Bef calculation, are performed in parallel, the processing speed can be increased.
For the LSI design, it is well known that a small gate size for a computer, i.e., a small mounting area, directly affects the reduction of manufacturing costs. According to the present invention, since a unit for coverage calculation during graphic processing (particularly during a rasterization process) occupies only a small mounting area, the manufacturing costs can be greatly reduced.
In short, according to the present invention, provided is a superior graphic processing device that performs parallel, rapid edge function processing for coverage calculation during an anti-aliasing process.
In addition, according to the present invention, provided is a superior graphic processing device on which can be mounted an LSI having a relatively small gate size that performs coverage calculation for anti-aliasing.

International Business Machines Corporation


According to one embodiment, a display device includes a first transparent substrate including a first end portion, a second transparent substrate including a second end portion and opposing the first transparent substrate and a plurality of light-emitting devices provided along the second end portion, and the first transparent substrate includes a first driver provided in a first region located between the first end portion and the second end portion and located without overlapping the second transparent substrate in planar view, the second end portion includes a concavity, and at least one first light-emitting device of the light emitting devices, provided along the concavity, oppose the first driver with a predetermined interval therebetween.

Recently, a display device comprising a light source, a pair of substrates including a pixel electrode and a common electrode and a polymer dispersed liquid crystal layer disposed between the substrates (which will be referred to as a transparent display, hereinafter) is known. In such a transparent display, the light source is provided on a side portion of the liquid crystal layer, and as a result, the interval between the light source and various drivers tends to be short. With this structure, the heat generated when the light source is on, and the heat generate by various drivers when they are driven may not be radiated sufficiently. When the heat is sufficiently radiated, for example, the temperatures of the various drivers may exceed the heatproof temperature, which may cause troubles in these drivers.


Disclosed are an apparatus for harvesting/storing piezoelectric energy, including: a substrate having a groove at a side thereon; a piezoelectric MEMS cantilever having an end fixed to the substrate and the other end floating above the groove, and configured to convert and store an external vibration into electric energy; and a mass formed at one end of the piezoelectric MEMS cantilever and configured to apply a vibration, and a manufacturing method thereof.

A piezoelectric energy harvesting device (hereafter, referred to as a 'PEH' device) generates the largest electric energy at the resonance frequency due to amplification of displacement occurring when the resonance frequency of the PEH device and the frequency of ambient vibrations meet each other.
The voltage generated from the PEH device is outputted in an AC (Alternating Current) type. A rectifier is used to convert the AC voltage into DC voltage. The rectifier is composed of four or two diodes, in a full-bridge type or a half-bridge type. A filtering capacitor reducing ripple of the DC voltage is connected to the rear end of the rectifier.
The output DC voltage of the filtering capacitor is used to drive an IC such as a memory, and MCU and RF transmitting/receiving devices. However, the electric energy obtained from small vibrations in an ambient environment is very small in magnitude, so the electric energy is not enough to drive an IC. Accordingly, methods of using stored power, if needed, by charging a storage device, such as a super capacitor, a secondary battery and a thin film battery, have been studied.
The electronic devices used at present in wireless sensor nodes more automatically operate by actively performing the functions or passively sensing or collecting information. For this configuration, a micro-energy supply device that can continuously supply power is required. Although batteries can perform this function, the amount of available energy decreases as time passes due to a limit in the storage capacity, and consequently, it becomes impossible to supply power to a wireless sensor node.

Apparatus for harvesting and storing piezoelectric energy and manufacturing method thereof

ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE


OCV coefficients in a path being an analysis target according to the number of gate stages are calculated in a coefficient arithmetically operating unit by canceling off a variation in delay in each gate in accordance with the number of gate stages in the target path, and timing analysis of the target path is performed in a timing analysis unit by using the OCV coefficient with the number of gate stages being considered, whereby a variation degree in the entire path is reduced in accordance with the number of gate stages in the target path, thus making it possible to carry out accurate timing analysis in consideration of the variation in a chip of a semiconductor integrated circuit.

1. Field of the Invention
The present invention relates to a timing analysis apparatus, a timing analysis method and a program product for a semiconductor integrated circuit, which is particularly preferable for use in static timing analysis in a semiconductor integrated circuit.
2. Description of the Related Art
As a method of conducting timing verification of a semiconductor integrated circuit such as an LSI, especially a digital circuit, static timing analysis (STA) is conventionally used. In the static timing analysis, timing verification of a circuit is conducted based on delays assigned respectively to elements and the like in the circuit, unlike circuit simulation and logical simulation which are conducted to correspond to an actual operation logically.
Namely, in the static timing analysis, creation of a test pattern or the like is not needed, and timing verification is conducted by accumulating a delay of each element and the like in a path (signal flow path). The static timing analysis requires short time for verification, and is capable of comprehensively analyzing an entire chip at one time, and therefore static timing analysis apparatuses are used as one of the verification apparatuses for designs of most of the semiconductor integrated circuits recently.
Here, there are normally variations in the characteristics of the elements in the semiconductor integrated circuit, and it is necessary to carry out static timing analysis in consideration of the variations. At present, static timing analysis is generally carried out by expressing the variation of each element by multiplying the delay of each element by an equal coefficient (for example, refer to Patent document 1 (Japanese Patent Laid-open No. 63-98042), and Patent document 2 (Japanese Patent Laid-open No. 2002-222232). The variation in the delay of each element is expressed in this manner, and it is verified whether the semiconductor integrated circuit is normally operable or not when the variation in the chip occurs.
For example, in the conventional static timing analysis, timing verification of a semiconductor integrated circuit under the worst condition is conducted by verifying whether the conditions expressed by the following expressions (19) and (20) are satisfied or not. Here, the worst condition is the condition under which the circuit operates at a low speed, and corresponds to the case in which process (P) is at a low speed, temperature (T) is high, and voltage (V) is low.Cycle_Time+Clock_path_time×ocv_worst−Data_time−Setup_time>0  (19)Data_path_time×ocv_worst−Clock_path_time−Hold_time>0  (20)
Similarly, timing verification of a semiconductor integrated circuit under the best condition is conducted by verifying whether the conditions shown by the following expressions (21) and (22) are satisfied, or not. The best condition is the condition under which the circuit operates at a high speed, and corresponds to the case in which process (P) is at a high speed, temperature (T) is low, and voltage (V) is high.Cycle_Time+Clock_path_time−Data_path_time×ocv_best−Setup_time>0  (21)Data_path_time−Clock_path_time×ocv_best−Hold_time>0  (22)
The above-described expressions (19) and (21) are conditional expressions for verifying setup time, and the above-described expressions (20) and (22) are conditional expressions for verifying hold time.
In the above-described expressions (19) to (22), Cycle_Time is a cycle of a clock signal, Clock_path_time is a clock path delay, Data_path_time is a data path delay, Setup_time is a value of standard of setup time, Hold_time is a value of standard of hold time, ocv_worst is a variation coefficient under the worst condition, and ocv_best is a variation coefficient under the best condition. The coefficients ocv_worst and ocv_best are constant values which are previously specified to express variations in delay.

Semiconductor integrated circuit timing analysis apparatus timing analysis method and timing analysis program


A geographic information system allows users to access a map database and to contribute map data to the database. Proposed edits to the map are queued for review by a reviewer users. Reviewing users can subscribe to review edits in regions and/or to types of map features. Reviewers can share their subscriptions with other reviewers. In the moderation queue, the proposed edits are ranked and those edits proposed by users who also review are optionally ranked higher and thus reviewed sooner than edits proposed by users who do not review or review less. The history of reviewers is analyzed to identify those with expertise in a particular region and/or type of map feature. One embodiment of the system includes a database containing geographic data, an inference module, a spam prevention module, a reviewing module and a publishing module.

1. Field of the Invention
The present invention is related to on-line map databases and, more particularly to managing user-contributed edits to map information.
2. Description of the Background Art
Conventionally, acquiring the data necessary to create a map requires vast amounts of time and resources. The data required to create a map ("map data") includes geographic data, such as latitude, longitude, elevation, location of geographic features of interest (e.g., bodies of water, mountains, forests); political data, such as country, state, and city boundaries, locations of streets and roadways, points of interest (e.g., government buildings, universities, stadiums), address numbering on a street; and attributes of features, such as whether or not an area is public and the nature of the surface of a street. Acquiring this data traditionally requires sending expert observers to the location to be mapped. Since experts are used to acquire the map data, it is generally deemed reliable and of sufficient quality for the map maker's usage. Because of the expense of acquiring map data, the map and the data necessary to create it are frequently proprietary. This adds to the cost of providing maps to users whether it is in hard copy form or on through online media, such as the World Wide Web.
Additionally, because of the expense involved, map data is not verified frequently. Therefore, if there is an error in or a change to the existing map data, it can take a long time for a map to be corrected or to be changed to reflect an addition. Even maps available in map websites on the World Wide Web can take a year or more to reflect a correction or addition. This can lead to very frustrating experiences for users of these maps. A user may obtain driving directions from a map website, but get lost while following such directions because there was an error in the map data, such as a closed street, or a change in street name or the like.

Managing moderation of user-contributed edits


A method for detecting vibrations of a shaft of an electrical machine includes measuring at least one of a shaft voltage and a shaft current and analyzing the measured at least one of the shaft voltage and the shaft current so as to determine the vibrations. In addition, an apparatus for detecting vibrations of a shaft of an electrical machine includes a first grounding device disposed at a first point on the shaft on a first side of the electrical machine and a second grounding device disposed at a second point of the shaft on a second side of the electrical machine. The second grounding device is configured to measure at least one of a shaft voltage and a shaft current.

Vibrations of the shaft assembly of a machine, in particular of a turbo generator assembly, may be of a variety of types. They may be bending vibrations or transverse vibrations which occur in the direction perpendicular to the shaft. Furthermore, so-called oscillations may occur, i.e. generally changes in the rotational frequency of the shaft, which are damped quasi-periodically, about the system frequency of generally 50 Hz (or 60 Hz), which are generated by, for example, sudden disruptions to the system. A third type of vibrations of the shaft is the actual torsional vibrations which may be generated, for example, by sudden increases in the load on the system. Torsional vibrations are in this case vibrations which are manifested in a non-uniform rotational frequency along the shaft (phase shifts or frequency shifts), i.e. bring about torsion in the shaft.
Torsional vibrations are very small vibrations, generally in the region of 0.01 degrees phase amplitude, which can, however, lead to a very high load on the shaft, and, in particular, breakdown of the natural frequency of such a torsional vibration with the stimulus exciting this torsional vibration may lead to a hazardous escalation of such torsional vibrations, which may even result in breakage of the shaft. In this case, torsional vibrations may have frequencies of a few Hz to 200 Hz, the frequency naturally depending on the material composition and thickness of the shaft, the masses associated with the shaft, and the size of the system. In particular in the case of large systems having long shafts, these torsional vibrations may be extremely critical.
In accordance with the importance of this problem, a large number of patent specifications have already dealt with this topic. For example, U.S. Pat. No. 3,934,459 describes a measuring device and a method for measuring the torsional vibrations of the entire shaft assembly of a turbine generator system. For this purpose, the torsional vibrations are sensed at one or more points on the shaft by means of one or more sensors which are not specified in any more detail. The further-processing of the torsion signals is the main topic of this specification. The further-processing takes place by filtering using bandpass filters and multipliers in order to determine, in the end, the maximum torques.
In addition, mention will be made of U.S. Pat. Nos. 3,885,420, 4,148,222, 4,137,780 and 4,317,371, which all describe measuring devices or methods for measuring torsional vibrations of such electrical systems. For the purpose of detecting the torsional vibrations, toothed wheels connected to the shaft are used as the signal transmitters which produce electrical signals via sensors. The signals are further-processed by means of bandpass filters and multipliers etc. U.S. Pat. No. 4,317,371 describes a special demodulation method for measuring phase shifts. The method comprises the production of lower intermediate frequencies and the subsequent frequency demodulation, as is known per se from radio technology. Another method (U.S. Pat. No. 3,885,420) uses a phase-locked loop (PLL) for demodulation. In addition, reference is made to U.S. Pat. No. 4,444,064, which describes a method in which initially a magnetic pattern is impressed in the shaft, and is subsequently used as the pulse generator. Another concept for measuring torsional vibrations is based on the fact that the voltage at the phase winding clamps of the permanent magnet generator, which is coupled to the shaft, is used for the purpose of determining such vibrations. Evaluation of the generated voltages will give an indication of the torsional vibrations. The evaluation takes place, in turn, by means of frequency demodulation (PLL technique). One advantage of this arrangement is the lower costs in comparison to the toothed wheel solution.

Apparatus and method for detecting vibrations of the shaft assembly in an electrical machine


The present invention relates to new adjuvants and the uses in pharmaceutical compositions, like in vaccines. In particular, the present invention provides new compounds useful as adjuvants for prophylactic and/or therapeutic vaccination in the treatment of infectious diseases, inflammatory diseases, autoimmune diseases, tumours, allergies as well as for the control of fertility in human or animal populations. The compounds are particularly useful not only as systemic, but preferably as mucosal adjuvants. In addition, the invention relates to its uses as active ingredients in pharmaceutical compositions.

Infectious diseases are the major cause of morbidity and mortality, accounting for a third of the deaths which occur in the world each year. In addition, infectious agents are directly responsible for at least 15% of new cancers, and they also seem to be involved in the pathophysiology of several chronic diseases (e.g. inflammatory, vascular and degenerative diseases). Traditional infectious diseases are also highly expensive in terms of health-associated costs of infected patients and loss in productivity at work.
The main strategies used to prevent infectious diseases are therapy and prophylaxis. Vaccination has become the most cost-effective measure to prevent infections. However, there are still many diseases for which vaccines are not yet available or the available vaccines are not completely satisfactory due to low efficacy, high reactogenicity, poor stability and/or high costs. Thus, there is still an urgent need for both new and improved vaccines.
Despite the fact that vaccines have traditionally been used for the prophylaxis of infectious diseases, recent findings suggest that they are also a powerful tool for the immunotherapy of transmissible diseases (e.g. viral hepatitis, Helicobacter pylori infections, herpes virus infections, etc.). In addition, vaccines can be used for the immune-therapy or immune-prophylaxis of autoimmune diseases, inflammatory diseases, tumours, allergies and for the control of fertility in human and/or animal populations. In particular, the last application seems to require the elicitation of efficient mucosal responses at the level of the reproductive tract.
Most infectious diseases are either restricted to the mucosal membranes or the etiologic agents need to transit the mucosa during the early steps of the infection. Therefore, it is desirable to obtain not only a systemic, but also a local mucosal immune response as a result of vaccination, thereby blocking both infection (i.e. colonization) and disease development. This may result in a more efficient protection against infection, facilitating also the eradication of diseases for which humans are the only reservoirs (i.e. blocking transmission to susceptible hosts). Parenterally-administered vaccines mainly stimulate systemic responses, whereas vaccines administered by a mucosal route mimic the immune response elicited by natural infections and can lead to efficient mucosal and systemic responses. Due to the apparent compartimentalization of the systemic and mucosal immune system, parenterally administered vaccines are less effective in protecting against mucosal pathogens (McGhee, J. R., Mestecky, J., Dertzbaugh, M. T., Eldridge, J. H., Hirasawa, M. and Kiyono, H. (1992) The mucosal immune system: from fundamental concepts to vaccine development. Vaccine 10, 75-88). Thus, administration of immunogens through the mucosal route is required to achieve full protection. However, most of the available vaccines are administered through the parenteral route, thereby, eliciting a systemic immunity in the individual.
The administration of vaccines via the mucosal route offers several advantages over parenteral vaccination. These advantages include an ease of administration, the possibility of self-administration (e.g. by intranasal, rectal or oral application), the elimination of the chance of unwanted cross-infection due to the use of infected needles or non-sterile working, lower rates of side effects, higher acceptance by the public, better compliance of vaccination protocols (i.e. increment in the overall efficacy), simpler administration logistics and lower delivery costs, being particularly suitable for mass immunization programmes. However, the compartmentalisation at the level of the mucosal immune system has to be taken into consideration. In fact, immune responses which can be observed following intra-nasal vaccination may not necessarily occur after oral or intra-rectal immunisation. For example, oral vaccination may not stimulate efficient responses in the genitourinary and/or respiratory tracts.
Unfortunately, the delivery of antigens by the mucosal route is associated with a major problem, namely that antigens delivered by this route are generally poorly immunogenic. This is the result of different mechanisms, such as (i) accelerated antigen elimination by the non specific host clearance mechanisms (e.g. ciliar activity, peristaltism), (ii) antigen degradation by local enzymes, (iii) antigen alteration and/or structural modification as a result of extreme pH (e.g. acidic in the stomach, alkaline in the intestine), (iv) poor antigen penetration through the mucosa, (v) limited access of vaccine antigens to antigen presenting cells, and (vi) local peripheral tolerance.
To overcome these problems, different strategies have been used, such as antigen entrapment or association with physical or biological particles (e.g. microparticles, nanoparticles, bacterial ghosts), the use of virosomes or viral-like-particles, the use of liposomes or ISCOMS, the use of transgenic plants, antigen production by attenuated viral or bacterial carriers acting either as conventional vectors or as carriers for nucleic acid vaccines and/or their administration with mucosal adjuvants. However, despite the heavy body of experimental evidence generated in pre-clinical studies during the last years, almost no candidates have been transferred to the vaccine development pipeline.
The use of optimal adjuvants plays a crucial role in vaccination. Antigens administered without adjuvant only rarely mediate an adequate immune response. In addition, not only the strength but also the quality of the elicited immune response matters. Stimulation of an incorrect immunization pattern may lead to immunopathological reactions and exacerbation of the symptoms of infection. In this context, the adjuvant can help to assist the desired immune response. In other words, an adjuvant can modulate the immune response or redirect the immune response to balance the immune response in the desired direction.
Substances referred to as "adjuvants" are those which are added and/or co-formulated in an immunization to the actual antigen (i.e. the substance which provokes the desired immune response) in order to enhance the humoral and/or cell-mediated immune response ("Lexikon der Biochemie und Molekularbiologie", 1. Band, Spektrum, Akademischer Verlag 1995). That is, adjuvants are compounds having immunopotentiating properties, in particular, when co-administered with antigens. The use of many adjuvants is based solely on experience, and the effect can neither be accurately explained nor predicted. The following groups of adjuvants are traditionally used in particular: aluminum hydroxide, emulsions of mineral oils, saponins, detergents, silicon compounds, thiourea, endotoxins of gram-negative bacteria, exotoxins of gram-positive bacteria, killed or attenuated living bacteria or parts thereof.
An overview over the presently known mucosal adjuvants and delivery systems, e.g. the above mentioned particles, ICOMS, liposomes and viral-like particles, for protein, DNA- and RNA-based vaccines is given in Vajdy et al., Immunol. Cell Biol., 2004, 82, 617-627. Therein the currently available approaches in immunopentiation of mucosal vaccines are discussed.
That is, various mucosal adjuvants have been described which should serve as an alternative for the adjuvants useful for systemic administration, e.g. see Vajdy et al., supra. These mucosal adjuvants include heat labile enterotoxin and detoxified mutants thereof. In particular, genetically detoxified mutants of heat labile enterotoxin of E. coli have been developed as useful mucosal adjuvants. Moreover, cholera toxin of vibrio cholera is known as an adjuvant useful for mucosal vaccination. Further, the application of unmethylated CpG dinucleotides has been described. It was shown that CpG can bias the immune response towards a Th1 response and can modulate pre-existing immune responses. Saponins are also described as immunomodulatory substances, predominantly via the induction of specific cytokines which then modulate and/or activate the immune response.
In addition, as adjuvants which may be useful in mucosal vaccination the following have been described:
The MALP-2 molecule and Bisaxcyloxypropylcysteine-conjugates thereof, e.g. a Bispalmitoyloxypropylcysteine-PEG molecule is known to represent potent stimulants for macrophages. The usefulness of MALP-2 as an adjuvant was shown previously, see e.g. WO2004/009125 and WO2003/084568. In particular, it was demonstrated that MALP-2 can act as an effective mucosal adjuvant enhancing the mucosal immune response, e.g. fostering an enhanced expression of antigen-specific IgA antibodies.
Furthermore, it was shown that MALP-2 can activate dendritic cells and B-cells, both play an important rule in the induction of a specific humoral immune response. In addition preliminary studies demonstrate that a combination for biologically active HIV-1 tat protein and synthetic MALP-2 may be a promising vaccine with the MALP-2 component as an effective mucosal adjuvant.
Unfortunately, most of the compounds described above being useful as mucosal adjuvants are not utilisable due to their intrinsic toxicity, e.g. retrograde homing to neuronal tissues of bacterial toxoids and/or toxins at/in the derivatives after nasal vaccination.
Thus, none of these previously described mucosal adjuvants have been approved yet, but, today, only two systemic adjuvants received approval to be administered to humans and, hence, are used for the preparation of human vaccines. These adjuvants are Alum and MF59. However, both are not effective as mucosal adjuvants.
There has been an intensive search in recent years for novel adjuvants, including those for the mucosal administration route. Only a few substances have been found to be able to enhance mucosal responses. Among these, some act as carriers to which the antigens must be bound or fused thereto. Far fewer universally employable "true" adjuvants which are admixed to the antigens have been found, as outlined above.
Typically cell membranes are inter alia composed of lipids, like phospholipids. Roughly, phospholipids can be divided in phosphoglycerides and sphingolipids. The backbone of a sphingolipid is sphingosine. In all sphingolipids, the amino group of sphingosine is acylated to form a ceramide (N-acylsphingosine). The terminal hydroxyl group is also substituted. Thus, depending on the substituent a sphingomyelin, a cerebroside or a ganglioside is formed. In cerebrosides a glucose or galactose is linked to the terminal hydroxyl group of ceramide while in gangliosides an oligosaccharide is linked to the ceramide by a glucose residue.
Alpha-galactosylceramide (alpha-GalCer) as an example of alpha-hexosylceramide (alpha-HexCer) was originally isolated form the marine sponge Agelas mauritianus (Morita M., et al, J. Med. Chem., 1995, 38(12), 2176-2187). In particular, the compound Agelasphin-9b, (2S,3S,4R)-1-O-(alpha-D-galactopyranosyl)-16-methyl-2-[N—((R)-2-hydroxytetracosanoyl)-amino]-1,3,4-heptadecanetriol, is described as a potent antitumor agent. It is known that alpha-GalCer can enhance the protective immunity and displays immunomodulatory functions. Furthermore, it is described in the art that in vivo administration of alpha-GalCer leads to a potent activation of NKT-cells in mice, thus, initiating cytokine secretion, up-regulation of surface receptors and further activation of various cells of the innate and adaptive immune response. Additionally, it is speculated that alpha-GalCer has a therapeutic activity against tumors, infections and autoimmune diseases.
Alpha-galactosylceramide is able to bind to the CD1d molecule present in a subset of lymphocytes. Upon binding to CD1d, alpha-GalCer was demonstrated to activate murine and human NKT cells by recognition via antigen receptors expressed on said cells. Furthermore, it was demonstrated that nearly complete truncation of the alpha-GalCer acyl chain from 24 to 2 carbons does not significantly affect the mouse NKT cell response. Thus, the glycosyl moiety seems to be important for CD1d/GalCer and antigen receptor recognition and modification of said moiety is likely to influence binding and activation activity of alpha-GalCer.
Recently it has been described that glycosylceramides are useful as adjuvants for vaccines against infections and cancer, WO03/009812. In this document subcutaneous administration of alpha-galactosylceramides has been used to show enhancement and prolongation of malaria-specific T cell responses. Further, in WO2004/028475 the use of glycosylceramide analogues is shown. It is described that these analogues are able to immunomodulate the immune response, i.e. may activate or stimulate the immune response or, on the other hand, can have immunoinhibitory activity.
However, the use of alpha-GalCer or other glycosylceramides is limited in view of its stability and its tolerance towards the individual. Furthermore, the solubility of alpha-GalCer in aqueous solvents is poor and degradation due to enzymatic cleavage rapidly occurs. In addition, excretion of these compounds is rapid and, thus, higher dosage of said compounds is necessary.
PEGylation (i.e. the attachment of polyethylene glycol to proteins and drugs) is an upcoming methodology for drug development and it has the potential to revolutionise medicine by drastically improving the pharmacokinetic and pharmacodynamic properties of the administered drug [Parveen S, Sahoo S K. Clin Pharmacokinet 2006; 45(10):965-88.]. Since several years polyethylenglycole [is already used as a non-absorbable marker [Isenberg J I, Hogan D L, Koss M A, Selling J A. H, Gastroenterology 1986; 91(2):370-8], for the control of passive mucosal permeability (evaluated with a low-molecular-weight substance PEG 200) [Ventura U, Ceriani T, Moggio R., Scand J Gastroenterol Suppl 1984; 92:55-8] or as molecular weight marker (i.e., PEG 4000, FITC-dextran 10.000). It was demostrated, that PEG showed only low intranasal irritation in humans [EP 0532546] and also low toxicity was found in rabbits or in sheeps after 1 repeated nasal application (three times a day) of pure PEG. The usage of pegylated immuno-nanoparticles synthesized with bifunctional PEG derivatives showed that these component can link the nanoparticle with the targeting MAb [Olivier J C, Huertas R, Lee H J, Calon F, Pardridge W M., Pharm Res 2002; 19(8):1137-43].
However, the use of pegylated compounds, such as the current standard therapy for HCV, pegylated interferon alpha in combination with ribavirin, has its limitations. Limited efficacy in patients with hepatitis C virus genotype 1 and the side effect profile will necessitate the development of new therapeutic approaches [Manns M P, Wedemeyer H, Cornberg M, Gut, 2006; 55(9), 1350-9]. Furthermore, the conjugation of an immunomodulator with PEG does not matter, that the pegylated compound still is able to act as an adjuvant. Studies with pegylated Malp-2 derivatives showed a decrease in cellular proliferation and also in the secretion of antigen-specific IgG titer in comparison to Malp-2. Until now, it has not been demonstrated, that a pegylated derivative of a chemical active compound was able to stimulate and activate an antigen-specific immune response via intranasal administration route. The usage of the conjugates according to the present invention, e.g. the new αGalCerMPEG compound as systemic, but also as mucosal adjuvant showed that said conjugates are able to enhance antigen specific immune responses without adverse side effects.
Hence, there is still a need in the prior art to provide new compounds useful as adjuvants, particularly as mucosal adjuvants and/or as vaccines overcoming the drawbacks mentioned above, in particular, having good stability and tolerance in the individual while being soluble in aqueous solvents, being protected against degradation in the individual and with good shelf life. In particular, there is a need for mucosal adjuvants which can elicit a strong immune response which represent a balanced or adjusted immune response involving both humoral and cellular components, thus, allowing effective prophylaxis or treatment of various diseases and conditions, specifically of infectious diseases or cancer.
Thus, the object of the present invention is the provision of mucosal adjuvants which can elicit and/or enhance and/or modulate (pre-existing) immune response in an individual or subject. In particular, the invention was based on the object of developing a range of novel, highly active adjuvants, particularly mucosal adjuvants which are non-toxic for humans and which can be employed with a wide variety of active ingredients to be assisted in conventional or novel vaccines such as, in particular, prophylactic or therapeutic vaccines, including cancer and DNA vaccines.

Hexosylceramides as adjuvants and their uses in pharmaceutical compositions

Helmholtz-Zentrum fuer Infektionsforschung GmbH


A continuous conveyor belt for transporting a stream of objects to an inspection station includes a plurality of links matingly joined together to form a surface for supporting the objects for movement along a given path of travel to the inspection station, and wherein the continuous conveyor belt is entrained between a drive roller and a nose bar which has a given diametral dimension, and wherein the continuous conveyor belt propels the objects into free flight and in a given pattern through a sorting station which is disposed downstream of, and in spaced relation relative to the nose bar, and wherein the individual links when passing about the nose bar effectively minimizes the size of the object pattern passing through the sorting station, while simultaneously maintaining product separation which permits imaging of substantially the entire surface area of each product.

The prior art is replete with numerous examples of continuous conveyor belts utilized in combination with assorted other manufacturing devices to achieve various objectives.
For example, the prior art includes conveyor assemblies which are utilized in combination with imaging and air ejector mechanisms to effectively remove defective products and other undesirable debris from a stream of bulk products which have been propelled into free flight by the conveyor assembly and through an adjoining inspection station. An example of a prior art assembly having these characteristics is manufactured by Key Technology, Inc., of Walla Walla, Washington, under the trademark "Tegra". This device includes imaging devices which have implementing hardware and software which not only recognizes color and size, but also the shape of the products being carried by the associated conveyor assembly. The software and related hardware allows the imaging devices to detect color subtleties beyond human vision. Further, the imaging devices used in this same assembly facilitates spacial resolution by means of square pixels which provides enhanced visual acuity with respect to the color and shape of the products as they are propelled by the associated conveyor into free flight. In this same sorting device, defective products are removed from the air-borne product stream by an air ejector mechanism which directs accurately timed air pulses at the centroid of the individual products. These timed pulses of air effectively removes the defective products from the product stream as they pass through a sorting station. Still further, this present device employs a catenary belt profile which utilizes centrifugal stabilization to provide a stable product feed stream through the inspection station and improved trajectory following propulsion from the end of the conveyor assembly. In addition, the imaging assembly, and air ejector mechanism can also be employed with a substantially planer or flat belt instead of the catenary belt profile disclosed above. This assembly including the implementing hardware and software is disclosed in detail in application Ser. No. PCT/US96/12814, the teachings of which are incorporated by reference herein.
While the prior art devices have operated with varying degrees of success, there have been shortcomings which have detracted from their usefulness. For example, there is a tendency for bulk product delivered to such conveyor assemblies (both planar and catenary profiles) to roll or otherwise move laterally relative to the direction of movement of the conveyor belt as it is being carried in the direction of the inspection station. This lateral movement of the bulk product on the conveyor assembly is not desirable inasmuch as the given trajectory of the bulk products, once launched into free flight by the conveyor assembly, tends to be less than predictable. Consequently, ejector mechanisms, as described above, must be positioned at some distance from the product stream or pattern. In view of this spacial relationship, the action of the air ejectors may not be optimal in removing undesirable products from the overall product stream.
Still further, another shortcoming which has detracted from the performance of the prior art devices has been the propensity for the bulk products moving through the sorting station to be oriented in such a position that the imaging devices employed with same cannot see the entire surface area of the individual products passing through the sorting station. When this event occurs, some products may pass through the inspection station with undetected anomalies which would normally have rendered them undesirable from an end user standpoint.
An improved modular, continuous conveyor belt for transporting a stream of objects to an inspection station is the subject matter of the present application.


A functional circuit group consisting of a plurality of functional circuits is formed at a surface of a substrate and a resistance element group consisting of a plurality of resistance elements connected to the functional circuits is arranged outside the functional circuit group on the substrate. The resistance element group is arranged in a region extending from an inner line, which is distant by one-third of a distance between the outer edge of the substrate and the center thereof from the same outer edge, up to the same outer edge. The resistance element group is a group in which a plurality of resistance elements, each having the same shape and size, are arranged at a constant distance between two of any adjacent pair.

1. Field of the Invention
The present invention relates to a semiconductor integrate circuit device having a resistance element capable of reducing a dispersion of resistance values among resistance elements.
2. Description of the Related Art
Conventionally, a general semiconductor integrated circuit device of a packaging structure has a silicon chip mounted on a lead frame and molded by a resin. In the semiconductor integrated circuit device, since a silicon chip, lead frame, mount material and molding resin have mutually different thermal expansion coefficients, the silicon chip receives a stress from the lead frame, mount material and molding resin and so forth. Especially after the silicon chip is molded by the resin, the resin contracts in the course of cooling, and thus there arises a compressive stress working from the exterior to the interior of the chip which is as large as in the range of tens to hundreds of MPa.
FIG. 1 is a graph showing a relation of the stress imposed on a chip with the distance from the center of the chip, wherein the stress is represented by a ordinate and the distance is represented by an abscissa. In FIG. 1, a solid line shows a compressive stress and a broken line shows a shearing stress. As shown in FIG. 1, the compressive stress occupies a greater part of the total stress imposed on the chip and has the maximum in the central portion, whereas it is decreased as a measuring point is closer to the periphery of the chip. A changing rate of the compressive stress on the distance is smaller in the central portion but it is drastically enlarged as a measuring point is closer to the periphery of the chip.
On the other hand, as shown by a broken line in the figure, the shearing stress imposed on the chip grows larger as a measuring point is closer to the periphery of the chip. An increment of the shearing stress in the peripheral region offsets the decrease in compressive stress there. As a result, a changing rate of the total stress imposed on the chip on the distance is the smallest in a central region from a line locating at a distance of about one-third of a distance from the center of the chip to the edge thereof. The second smallest of the changing rate is in a peripheral region of the chip with its innermost boundary extending from the same outer edge of the chip to about one-third of a distance from the center of the chip to the outer edge thereof. In the residual region, the changing rate is the maximum.
The stress generating in the interior of the chip is greatly different in magnitude according to a size thereof, a material of a lead frame, an area of an island and a thickness and area of a molding resin.
It is well known that when a stress is externally imposed on a silicon substrate, a change in an average bond distance between silicon atoms affects an energy band structure of silicon, so that an electric conductivity is increased. A resistance value of a diffused resistor formed in a silicon substrate by introducing an impurity therein is changed by a stress generated by an external cause (in general, the resistance value is decreased). This phenomenon is called Piezoresistance Effect.
FIG. 2 is a plan view showing a chip of a conventional semiconductor integrated circuit device. This is hereinafter referred to as the first prior art. As shown in FIG. 2, an array 12 of two resistors each having a rectangular shape parallel to a pair of opposed sides of a chip are arranged in the peripheral region of a substrate 11. An array 13 of two resistors parallel to the array 12 of two resistors is located in a central region with each having a position closer to the center than each of the array 12 of resistors. Functional circuits (not shown) which are connected to the arrays of resistors 12, 13, are formed at the surface of the substrate 11 and thus the chip 14 is constituted.
In the first prior art with such a constitution, the array 13 of resistors has an imposed stress higher on the average than that of the array 12 of resistors and the resistance value is drastically decreased after assembling. Even in the array 13 of resistors, a central portion of the chip 14 is different in decrease of a resistance value from a peripheral portion thereof.
In such a manner, when a resin mold type package is formed, resistance value of a resistance array is different between before and after the package assembling. In a definite manner, a resistance value after the assembling is decreased by about 0 to 10%, compared with a resistance value before the assembling and especially in a portion where the strongest stress is imposed, a resistance value is conspicuously changed.
In order to reduce a influence of Piezo Effect, there have been proposed a various integrated circuit device (see publications of Unexamined Japanese Patent Application No. Sho 57-31167 and Unexamined Japanese Patent Application No. Sho 63-67765). These techniques disclosed in the publications are hereinafter referred to as the second and third prior arts.
FIGS. 3A and 3B are plan views respectively showing configuration of resistance elements according to the second and third prior arts, wherein FIG. 3A shows resistance elements arranged in a peripheral region of a substrate and FIG. 3B shows resistance elements arranged in the vicinity of a corner region of the substrate. As shown in FIGS. 3A and 3B, resistance elements 22, 23, 24 and 25 each extending in a rectangular shape are arranged in regions of a substrate 21. For example, the resistance elements 22, 23, which are required so that a ratio of resistances is always constant, are arranged in parallel to each other. Moreover, in this example, lines which respectively bisect the resistance elements 22, 23 lengthwise both coincide with an arbitrary line Xc perpendicular to an x direction shown in FIG. 3A.
Besides, as shown in FIG. 3B, the resistance elements 24, 25 arranged around the corner of the substrate 21 are also arranged in parallel to each other. Lines bisecting the resistance elements 24, 25 lengthwise both coincide with a diagonal 26 of the substrate 21.
In the chip 27 in which resistance elements are arranged in such a way, since a rate of change in resistance for each resistance element of a pair is equal to the other, resistance ratios between before and after adhering of the chip 27 to a package are equal.
However, since there is a need that lines bisecting two in-parallel arranged resistance elements are coincide with each other in the second prior art, positioning of resistance elements on the substrate 21 is difficult. Especially when each of the pairs of resistance elements 22, 23, 25, 26 are constituted with a plurality more than two of resistance elements, it is difficult to connect between resistance elements respectively belonging to any arbitrary pair, so that a problem arises that a design of elements is complicated.
In the third prior art, resistance elements are arranged in a central region of a chip. In an integrated circuit device constituted in such a way, since resistance elements are arranged in the central region of the chip where a rate of change in stress with a change in distance from the center of the chip is smaller, a dispersion of resistance values in one chip can be resulted in reduction thereof. However, a resistance value itself of a resistance element is subjected to a large change after a chip is adhered to a package, compared with that of the resistance element before the adhesion of the chip.
A resistance element incorporated in, for example, a comparator or the like among those formed in an analogue type IC and the like has a requirement especially for a control of a resistance value with high accuracy. However, if a resistance value after assembling of a package is desired to be controlled with high accuracy, a design for resistance elements has to be made in consideration of a resistance dispersion in a fabrication and such a design is extremely difficult in execution and at the same time increases the number of process steps in the fabrication.
There is available a thin-film resistor as a resistance element with high accuracy in resistance value. However, since the thin-film resistor requires an apparatus and process steps, both special, for formation thereof, it has not widely been popular.
On the other hand, a method wherein a diffused resistor is formed by introducing an impurity in a surface region of a semiconductor substrate is widely used due to simplicity of fabrication thereof and a resistance layer having high accuracy is formed by adopting this diffused resistor. However, there is a limit of .+-.5% for reduction of a dispersion of resistance values of resistors each after the completion of diffusion process when resistance layers are formed with a diffusion resistor. Therefore, in order to control a dispersion of resistance values after the completion of diffusion process steps within a tolerance .+-.5%, there is a need for an assembly process to be carried out in such a manner that a dispersion of resistance values in the assembly process of a package is reduced to be as small as possible.
Since a magnitude of change between before and after the assembly process is different by a different kind of package, it is extremely difficult to estimate a correct magnitude of change in a designing stage. Since an IC such as a gate array generally has a configuration of a plurality of chips of different sizes on an IC substrate, differences in change of resistance value caused by differences in ship size cannot either be neglected. Therefore, to minimize a difference between before and after the assembly process is more required than to reduce dispersion between resistance elements in one chip.

Semiconductor integrated circuit device having resistance element


An ink jet printer includes a capping device. The device includes a cap having a brim for covering the ink jet surface of an ink jet head. The device also includes a holder for holding the cap. When held by the holder, the cap deforms elastically in such a manner that a protrusion protrudes the middle of the cap brim toward the jet surface. The cap has a cavity formed in it. When the brim of the cap held by the holder is pressed against the jet surface, the cap deforms elastically in such a manner that the brim covers the surface completely. The elastic deformation collapses the cavity, thereby reducing the force for pressing the cap against the head.

1. Field of the Invention
The present invention relates to a capping device for an ink jet head recovery apparatus and an ink jet recorder including such an apparatus.
2. Description of the Related Art
FIG. 7 of the accompanying drawings shows the capping device of a conventional recovery apparatus for an ink jet head. The capping device can prevent the jet nozzle of the head 30 from drying and/or foreign matter from entering the nozzle. The device includes a cap 32 having a brim 33 for close contact with the vertical front surface 31 of the head 30. The cap brim 33 is rectangular, and has longer, substantially vertical sides and shorter horizontal sides. The longer sides of the brim 33 are narrow so as to be deformed easily when the cap 32 is pressed against the head surface 31. In order that the brim 33 may contact more closely with the head surface 31, the height H of the cap 32 at the middle of the longer sides of the brim is higher than its height h at their both ends. Such a cap is disclosed in Japanese Patent Laid-Open No. 6-155753.
The cap 32 can also operate for the recovery apparatus for cleaning the head 30 so as to prevent it from being clogged with ink or to remove clogging ink, or for pumping ink into the head 30 when the ink cartridge is replaced. The middle of the cap 32 is higher not only to improve the closeness of contact of the cap with the head surface 31, but also to reduce the amount of air entrained when the cap is separated from the head 30.
In order to bring the cap 32 into close contact with the head surface 31, as shown by two-dot chain lines in FIG. 7, there is a need of great compressive force for pressing the cap until the cap brim 33 becomes flat. If the close contact with great compressive force is done frequently, the cap 32 may be deformed, so that its accuracy of close contact may become low.

Ink jet head capping device and ink jet recorder including same


A sieving screen or filtration screen, and processes for producing the same, featuring the use of a flexible, chemical resistant, intermittent, polymeric coating as an edging material and/or for providing indicia for identification purposes to show, for example, the source of the product, producer's or customer's logos, trade names, part numbers, indications and precautions for use, and any other forms of instruction and/or information, as well as providing an intermittent or discontinuous coating to allow for electrical grounding with a conventional filter clamp or the like. Screen printing is one preferred method for applying the polymeric matter to the sieve or filter screen.

Screens which may be used as a sieve screen and/or a filter screen are generally comprised of a plurality of openings or open spaces which may be produced in a variety of known ways such as being in the form of fabric comprised of woven, interlaced or intertwined thread, cord or wire, or may be molded, stamped, needled, etched and the like, for forming a gauze or mesh material which can be used for separating coarse and fine particles from each other, or for removing particulate or viscous matter from fluids, including liquids and/or gases. The current state of the art for such screens usually involves the use of a cloth, or felt, or other form of edging which is typically attached by sewing or stitching such edging to the perimeter of the perforated or mesh portion for providing a friction surface to preclude the screen from slipping out from under a clamping ring or other type of holding attachment. Also, such edging typically provides some degree of finished appearance to the screen and additionally may have a gasketing function. Such a prior art screen is shown in FIGS. 1 and 2 and will hereinafter be further described.
There are a considerable number of problems which are typical of such prior art screens:
(a) Current cloth or felt edging materials absorb liquids. Washing and drying of conventional screens is made difficult because of this tendency for present edgings to absorb liquids. PA1 (b) Conventional sewn-on edgings have gaps or crevices which can trap either particles or liquids, or both. Cleaning of such screens for reuse is difficult and cross-contamination between process batches is a distinct possibility. PA1 (c) Conventional sewn-on edgings can be, and usually are, costly because of waste of the edging material. The "donut" of cloth used for the typical circular, oval or rectangular edging is often die cut out of a roll of fabric. The unused center portion is usually discarded, thus resulting in a waste factor as high as 60 percent. PA1 (d) Conventional sewn-on edgings require the use of ink markings for identification, such as for specifying indicated uses, precautions, sizes, models, and other forms of information. The ink used for marking may be a source of contamination in certain process applications.
United Kingdom Patent 482,622 discloses a filtration device comprised of a wire gauze or mesh having a pair of peripheral gasket members of india rubber disposed on opposite marginal edges thereof and then vulcanized to form a continuous coating intimately bonded to the wire gauze. There is no teaching of patterned or intermittent indicia nor discontinuous portions for allowing electrical contact for grounding of the screen, nor teaching of providing informative data and the like to the screen area or marginal portions thereof.
U.S. Pat. No. 3,382,985 discloses a filter element in the form of a woven cloth of polypropylene, nylon, Acrilon or polyurethane fiber, fiber glass or cotton with an integral gasket which eliminates gasket grooves. The gasket material may also consist of woven polymeric fibers using a resilient or spongy, e.g., waffle, trilock or honeycomb bonded with an adhesive, e.g., epoxy adhesive, liquid neoprene or latex. The gasket may also be sewn to the filter element with polymeric thread. The gasket material is continuous throughout and the patent does not teach or suggest a discontinuous coated edge portion nor indicia of any kind..
U.S. Pat. No. 3,332,557 discloses a filter element comprising a wire mesh screen and a peripheral or marginal anchoring strip of greater thickness than the wire mesh. The gasket portion is disclosed as being in the form of a molded ring, which may be rubber or the like. As in the above mentioned prior art, there is no teaching or suggestion of a discontinuous polymeric coated edge which would allow for electrical grounding nor for the provision of indicia of any kind.


A wear assembly includes an adapter with a nose, a wear member with a socket to receive the nose, and a lock to secure the wear member to the adapter.

In mining and construction, wear members are typically provided along the digging edge of the equipment to protect the bucket or the like and/or to engage and break up the ground to be gathered. Accordingly, the wear parts are subjected to highly abrasive conditions and experience considerable wearing. The wear parts must then be replaced on a periodic basis.
In order to minimize the loss of material due to replacement of worn parts, the wear assemblies are typically manufactured as two or more separable components including an adapter and a wear member. The adapter is attached to the digging edge by welding, mechanical attachment, or being cast along an edge of the excavating device so as to present a forwardly projecting nose for supporting the wear member. The wear member has a socket that is received over the nose, and a forward working end. In a point, the working end is typically a narrowed digging edge. The wear member substantially envelops the adapter nose and thereby tends to protect the nose from wear. For example, depending on a variety of factors, generally five to twenty points can be successively mounted on a single adapter before the adapter becomes worn and in need of replacement. To accommodate replacement of the wear member in the field, the wear member is usually secured to the adapter nose by a removable lock (e.g., a lock pin).
Wear assemblies used in mining, excavation and construction, and particularly excavating tooth systems, are subjected to large and varied forces applied in all directions. As a result, points and other wear members must be firmly secured to the adapter to withstand the axial, vertical, reverse and lateral loads as well as impacts, vibrations and other kinds of forces. Vertical loads have been particularly troublesome in that large moment forces are generated that tend to "rotate" the wear members forward on the adapter and at times result in the ejection of the member. While the walls of the adapter nose provide support for the wear member, the lock in most cases also plays a large role in retaining the point and resisting loads, particularly moment and reverse forces.
In a conventional tooth system 1 (FIG. 22), the adapter nose 2 and complementary socket 3 in the point 4 are wedge-shaped and include converging top and bottom surfaces 2a, 2b, 3a, 3b. A central downward load P applied at the free end 4a of the point 4 will apply a moment force that tends to rotate the point 4 on the nose 2. The load P is generally transmitted to and resisted by the upper side of the nose tip 2c contacting the front end 3c of the socket 3 (reaction force A) and by the lower side of a base portion 2d of the nose contacting the base or rear end 4d of the point 4 (reaction force B). These reaction forces form a counteractive moment to resist the moment formed by force P. As can be appreciated, large vertical forces can create substantial ejection forces. Moreover, the impacts, vibration, wear, and presence of fines, etc. exacerbate the difficulty of resisting high ejection forces.
In the present example of a central downward load P, the vertical component of reaction force A, in general, equals the downward load P plus the vertical component of reaction force B. However, because of the converging walls of the nose, the horizontal component of each of the reaction forces A and B is in a forward direction that tends to urge the point off the nose. To the extent these forces are not resisted directly by the geometry and friction of the nose and socket, they are resisted as shear loads by the lock pin. The repeated application of high shear loads can place unacceptably high stresses on the lock pin and result in its breakage.
Further, in such conventional teeth, the lock pin is typically hammered into place and tightly held by frictional forces applied primarily by the placement of the holes in the point relative to the hole in the adapter nose. However, wearing of the point and adapter will tend to loosen the connection and increase the risk of losing the lock pin. Accordingly, the lock pin is often initially set very tightly in the defined opening so as to put off the time when excessive looseness develops. The lock pin must then be driven into and out of the opening by repeated blows of a large hammer. This can be a troublesome and time-consuming task, especially in the larger sized teeth.
A take-up elastomer has often been placed in front of the lock pin in an effort to maintain a tight fit between the point and adapter when wearing begins to develop. While the elastomer functions to pull the point onto the adapter, it also reduces the lock's ability to resist the applied moment and reverse forces. These loads tend to place more stress on the elastomer than it can withstand. As a result, during use, overworking of the elastomer can result in its premature failure and loss of the lock pin, which then results in loss of the point.
The loss of a point due to pin failure, looseness or elastomer problems not only results in premature loss of the point and wearing of the adapter nose, but also in possible damage to machinery that may be processing the excavated material, particularly in a mining operation. Moreover, since the adapter is often welded in place, replacement of an adapter usually results in significant down time for the digging equipment.
A variety of different point and nose designs have been developed to increase the stability of the point-adapter coupling, reduce the forces tending to eject the point, and lessen loading on the lock.
In one tooth design 1′ (FIG. 23) the front end of the nose 2′ and socket 3′ are each provided with a squared configuration having upper and lower stabilizing flats 5′, 6′. On account of the stabilizing flat 5′, a central downward load P′ on the free end 4c′ of the point 4′ will be transmitted to the nose tip 2a′ so as to generate a vertical reaction force A′ which generally has no substantial horizontal component tending to eject the point from the nose. Nevertheless, the reaction force B′ will still generate a substantial forward horizontal component at the rear of the point that tends to push the point from the nose. While this design improves the stability of the point over the conventional tooth system, it still applies a substantial ejection force and can place high shear forces on the lock.
In another design, such as disclosed in U.S. Pat. No. 5,709,043 to Jones et al., the nose and socket are each provided with a front squared section and rear bearing surfaces that are substantially parallel to the longitudinal axis of the tooth. In this construction, the combined effect of the front stabilizing flats and parallel bearing surfaces create reaction forces at the tip and base of the nose that are generally only vertical. Such vertical reaction forces will in general not generate substantial horizontal components. Accordingly, this construction greatly reduces the forces tending to push the point off of the adapter. Such stabilizing of the point also reduces shifting and movement of the point on the adapter nose for reduced wearing. Nevertheless, multiple other factors (such as impacts, etc.) as well as reverse forces can still apply high shear forces to the lock.
In one other design, such as disclosed in U.S. Pat. No. 4,353,532 to Hahn, the point and adapter are each provided with a helical turn or thread so that the point is rotated about its longitudinal axis when mounted on the adapter nose. On account of the threads, the point rotates about the longitudinal axis of the tooth and generally presses the lock against the adapter nose when ejection forces are applied. The lock is much less likely to fail when under these kinds of compression forces as opposed to the high shear forces applied in conventional teeth. While this construction provides great strength and retention benefits, the nose and socket are complex and more expensive to manufacture.

Abstract: The nose and socket include complementary rails and grooves that vertically diverge as they extend from the front of the nose. The lock can have a tapered construction.


A flow control assembly for use in preparation of samples for analysis by solid phase extraction includes a housing assembly having a first passage communicating with a needle bore and locating a solid phase sorbent, a second fluid port, and a valve for selective aspiration or delivery of fluid across a solid phase sorbent, or bypassing the solid phase sorbent. Independent flow paths are provided for a sample via the needle, and of the elution solvent via a separate port. The valve includes relatively slideable first and second members, the second member including an elongate shank that is relatively reciprocably slideable for effecting selective aspiration or delivery of fluid between first and second relative positions. A third fluid port may be provided communicating with the elongate second passage for selective fluid communication with a port in a shank when the shank is at the second relative position.

This invention relates generally to the preparation of samples for analysis and is concerned more particularly with the sample preparation technique known as solid phase extraction (SPE). The invention provides apparatus and techniques for improved sample preparation by solid phase extraction and is especially applicable where very small samples are desired.
Solid phase extraction (SPE) is a sample preparation technique where an analyte of interest is concentrated from a dilute matrix as well as being exchanged into a preferred matrix that is compatible with the analysis process. Typically the analyte is bound to a solid phase support or sorbent, washed and then eluted in a small concentrated volume. Micro Extraction by Packed Sorbent (MEPS™) is a form of micro SPE where the chromatography solid phase (2-3 mg of silica or polymer) is packed into a modified needle of an analytical syringe. In this case, the sample is aspirated onto the solid phase sorbent, commonly called the bed, using the aspirating stroke of the syringe. The solid volume is washed and then the analyte of interest is eluted using a suitable small volume of elution solvent. MEPS is fast, efficient and cost-effective when compared to traditional cartridge-based solid phase extraction. In effect, MEPS integrates the sample preparation and injection into a single device, streamlining workflows as extracts can be introduced directly into the analytical instrumentation.
It is an object of the invention to provide for further improvements in the functionality of MEPS as an advantageous method of solid phase extraction for microsamples.

Sample preparation by solid phase extraction


A dual locking device is provided for securing a plugging member of a case, such as a luggage case or suitcase or the like, and comprises a housing, a switching mechanism, a restriction member and two locking devices. The switching mechanism includes a push-button and a securing member movable relative to the housing between a locked position and an unlocked position. Additionally, the restriction member is controlled by the locking devices respectively for retaining the switching mechanism, and is movable either through a first route between a retaining position and a first releasing position or through a second route between the retaining position and a second releasing position.

Various mechanical structures are employed to fabricate a lock device, especially in the design of a complicated dual locking device for security to against terrorists. One conventional technique, relative to the dual locking device, is disclosed in U.S. Pat. No. 6,843,080. The dual locking device of U.S. Pat. No. 6,843,080 has a shifting member controlled by a combination lock to block or open a bendable shackle element from a corresponding locking hole. Under the control of the combination lock, the shifting member itself is both linear displaceable and deflectedable about a horizontal shaft. When a correct code of the combination lock is set, a stopper of the shackle element can be brought to push the shifting member so that the shifting member is forced to deflect and displace to come off the corresponding locking hole so as to release the shackle element from the locking hole.
One limitation of U.S. Pat. No. 6,843,080 for the dual locking device is the difficulty or impossibility of applying the shifting member with two motions on a zipper lock for securing a latch hole of a zipper.
Another conventional lock is disclosed in U.S. Pat. No. 6,912,880 and is also relative to the dual locking device, which has a stopping member to block or open a way of a push-button to constrain or release a lock tongue of the dual locking device. More specifically, the stopping member is pivotally mounted in a lock body under controls of a key lock and a combination lock. Moreover, the key lock is far from the stopping member and is linked via a linking member. Upon this complicated design, the conventional lock of the U.S. Pat. No. 6,912,880 is big in size for its complicated structure with extra elements, such as the linking member and two push-buttons.
For microminiaturization of the lock, it would be advantage to provide a dual locking device, which is capable of meeting the increasingly insistent requests for reduction in cost, weight, section, and dimensions with the same reliability and usability.
From the foregoing descriptions, it will be seen that room exists for improvements in the base.