An artificial image used for comparison with a medical image can be generated efficiently and accurately. A medical image including anatomically characteristic structures obtained by radiography of a predetermined part of a subject such as a human body is classified into segments having similar anatomic characteristics represented by the structures. The artificial image is generated for a specified one of the segments regarding the structures in normality.

1. Field of the Invention
The present invention relates to an image generation apparatus and an image generation method for aiding detection of an abnormality candidate by reading a medical image. The present invention also relates to a program that causes a computer to execute the image generation method.
2. Description of the Related Art
In the field of medicine, two or more medical images of the same patient radiographed at different times have been compared for detecting an abnormality based on a difference between the images and for discussing therapeutic measures by understanding the progression or remission of a disease, for example.
A small abnormal pattern such as that indicative of lung cancer at an early stage is especially easy to miss. Therefore, Japanese Unexamined Patent Publication No. 2002-158923, for example, describes a method for detecting a candidate of such an abnormality. In this method, subtraction processing or the like is carried out between corresponding pixels in two medical images radiographed at different times for finding a difference. In a temporal subtraction image representing the difference, an area having pixels of a predetermined value or larger, or an area having a characteristic shape such as a circular shape is detected as the candidate.
However, in two target images radiographed at different times, positions of the subject are different due to a change in posture of the patient at the time of radiography, for example. Therefore, in order to obtain a subtraction image, positional matching is generally carried out between the images to be processed. U.S. Pat. No. 5,359,513 and U.S. Patent Application Publication No. 20010048757 describe methods for such positional matching, for example. As one of such methods, at least one of two images of the same patient is subjected to global position matching (a linear transform such as an affine transform) including rotation, translation, and enlargement or reduction. Local position matching is also carried out according to non-linear transformation processing (warping processing such as a non-linear transform adopting curve fitting using a quadratic polynomial) based on a relationship between corresponding positions obtained by template matching on local areas. In addition, global position matching and local position matching may be carried out in combination. Furthermore, positional matching is further carried out in a local area having a large positional difference and the vicinity thereof.
These methods are used for positional matching between two-dimensionally projected images. Therefore, in the case where a large three-dimensional positional difference (leaning forward or backward or twisting sideways) is observed due to a posture change of the patient in images, positional matching is not carried out accurately. Therefore, an artifact is generated in a subtraction image, which leads to inaccurate detection of an abnormality. Furthermore, in the case where a patient does not have any image radiographed in the past, no image is used for comparison. Therefore, the methods using a subtraction image cannot be used, regardless of effectiveness of the methods for detecting an abnormal pattern such as that indicative of lung cancer, which tends to be missed.
For this reason, an apparatus for detecting a candidate of an abnormality area has been proposed in U.S. Patent Application Publication No. 20030210813, for example. As "teacher data" in this apparatus are used images in a database storing normal structure images of a subject and shapes of anatomic characteristics extracted from the images. Based on the teacher data, statistical models of normal structures of a subject (a shape change model, a texture change model, a correlation model between shape and texture) are generated, and a normal structure image corresponding to an input medical image is artificially generated based on the models. The candidate of an abnormality area is then detected based on the normal structure image and the input medical image.
The method of artificially generating the normal structure image is effective for detecting a small abnormality area that tends to be missed, even in the case where a large three-dimensional positional change is observed in images of a patient due to a posture change of the patient or in the case where no medical image radiographed in the past is available. However, in computer-aided diagnosis (CAD) regarding the chest, a detected candidate of lung cancer is generally divided into regions of interest, and each of the regions is subjected to lung cancer diagnosis. Therefore, generating an artificial image of the entire chest is not efficient.
Furthermore, characteristics appearing in images vary between the cases of presence and absence of structures such as ribs in the images. Therefore, in the case where an artificial image of the entire chest is generated, the image may have a characteristic that is partially different from that of an original image.
Consequently, accurate generation of an artificial image is desired regarding a region of interest where an abnormality has been detected, rather than generation of an artificial image regarding the entire chest.

Image generation apparatus and image generation method for detecting abnormalities


A method for predicting one or more events includes generating, for features of each of at least two feature types, an intermediate representation using a representation learning model for the at least two feature types. The intermediate representations of the at least two feature types are analyzed using a neural network and at least one neural network model so as to provide a joint representation for predicting certain events. One or more actions to be taken can be determined based on the one or more events predicted by the joint representation.

Communication networks and each of the network devices are nowadays under constant attack. The motivations for these attacks are numerous and range from hacking of personal banking information to the creation of botnets for orchestrated attacks on third-party computing infrastructures. In recent years, the ever growing number of small devices such as sensors, routers, cameras, etc. in the communication network has aggravated the risk of network and device intrusion. Despite this, only a minority of the largest worldwide companies have adequate technical safeguards against cyber risk. Consequently a growing market exists for vendors who can educate and help companies to implement cybersecurity defensive measures, such as setting up firewalls, intrusion prevention and management tools, user roles and policies, and communication and data encryption.
Most conventional intrusion detection and cybersecurity systems are rule-based and need a constant human supervision and constant addition of threat and cybersecurity knowledge leading to a reduced reliability due to the "human factor" with high costs.
Further conventional methods are e.g. disclosed in U.S. Pat. No. 7,574,740 B1 or EP 2 882 159 A1 and use a single source of data. Rules/Heuristic-based systems as e.g. disclosed in US 2014/0157405 require some prior knowledge and also constant human supervision. Further rules/heuristics have to be updated for each new configuration and/or threat detected in the network.

Method for predicting events using a joint representation of different feature types


An image processing system includes at least one processor having a plurality of PCI Express channels and at least two application specific integrated circuits. The application specific integrated circuits are communicatively coupled to the at least one processor by a first of the plurality of PCI Express channels and a second of the plurality of PCI Express channels. Multiple threads of execution are split between the at least two application specific integrated circuits.

Known image processing systems such as light production presses, digital copiers and other print devices produce printed images by retrieving raw source (image) data from a scanner, processing the data through a series of transformations (i.e., image data flow), and ultimately sending the transformed data to a print engine. These operations are generally implemented by a combination of firmware and imaging architecture that include a PC processor (e.g., Intel and AMD chipsets), a memory, a communications bus and a hardware assist application specific integrated circuit (ASIC). The ASIC communicates with the PC processor through a PCI Express channel (i.e., a serial physical-layer communications protocol) located on the PC processor.
In known imaging systems, the image data flow is linear in that a single ASIC is configured to perform all data flow operations including image compression functions, color space conversions (CSC), video, traptoning, and input/output functions. An exemplary data flow for a known image processing system generally includes: (1) retrieving image data from a scanner or input/output (I/O) device; (2) performing necessary CSC; (3) compressing the data; (4) decompressing the data upon demand from the print engine; and (5) sending the data to the print engine. Consequently, the performance (i.e., speed) of the image processing system is, in part, limited by the bandwidth capabilities of the single ASIC.
Known image processing systems are further limited by architectural constraints of the PC processor that limit the image data flows (i.e., transformations in the image data) that are necessary for high speed image processing. For example, PC processors do not allow for peer to peer communication from one PCI Express channel to another. As a result, there is no way to direct memory access (DMA) data to a print engine when the engine is on a separate PCI Express channel.
Accordingly, the embodiments described hereinafter were developed in light of these and other drawbacks associated with image processing systems that employs a PC processor in communication with a single ASIC.

System for high bandwidth imaging across PC chipsets and custom ASIC's

Hewlett-Packard Development Company, L.P.


The germicidal efficiency of an aqueous disinfectant cleaning composition is increased by incorporating an effective amount of a compound of the formula I EQU R--O(--G).sub.n I. wherein R is an alkyl group having from about 8 to about 22 carbon atoms, G is a saccharide residue having 5 or 6 carbon atoms; and n is a number from 1 to 10 into an aqueous composition which contains a compound of the formula II EQU R.sub.2 R.sub.3 R.sub.4 R.sub.5 NX. wherein R.sub.2 is a benzyl or C.sub.1-4 alkyl substituted benzyl group, and each of R.sub.3, R.sub.4, and R.sub.5 is independently an alkyl group having from about 8 to about 22 carbon atoms.

1. Field of the Invention
This invention relates to a method for increasing the efficiency of a germicidal cleaning composition.
2. Description of the Related Art
Investigations into the microbiological activities of alkyl glycosides have shown that they exhibit no significant antimicrobial activity even at concentrations as high as 10,000 ppm. Furthermore, combinations of alkyl glycosides with quaternary ammonium compounds are similarly undistinguished in their antimicrobial effect. While quaternary ammonium compounds exhibit bactericidal activity, their use with an alkyl glycoside surfactant, as described, for example, in U.S. Pat. No. 3,547,828, produces no increased or unexpected bactericidal effect. U.S. Pat. No. 4,748,158 teaches the use of alkyl glycosides as potentiating agents for increasing the microbicidal activity of bactericidally active biguanide compounds, especially microbicidal activity against gram-positive bacteria, in antiseptic preparations. U.S. Pat. No. 4,834,903 teaches composition in which the above-described oxyalkylated long chain glycoside composition is utilized in combination with one or more anionic, cationic or nonionic cosurfactant ingredients and/or with one or more detergent builder components.

Method for increasing the efficiency of a disinfectant cleaning composition using alkyl polyglycosides


A network system receives, from each of a plurality of client devices, a transmission of a scan of signals from signal broadcasting devices. A vector is created from each scan, whereby the vector comprises a received signal strength indicator (RSSI) to each unique signal broadcasting device. Based on the vector created from each scan, the network system determines a probability that the client devices are co-present. The probability is determined based on applying the vectors to a copresence estimation function that uses an angular similarity, a magnitude similarity, and a number of signal broadcasting devices. Based on the probability, the network system triggers a component to perform a corresponding operation.

Conventionally, locations of user devices are detected using GPS. However, GPS may not be specific or accurate enough in certain environments. This is especially true in urban areas or urban canyons where high buildings can interfere with satellites. Because GPS may not be accurate on mobile devices, it is not always reliable. Thus, it may be difficult to determine it two user devices are close together or co-located.

High dimension copresence estimation system


A stem extender for use with a faucet valve assembly which contains a valve body, a valving member including a valve stem rotatably disposed in the valve body, a stop member including a detent and a bore non-rotatably mounted on the valve body with the valve stem extending through the bore, and a handle for rotating the valve stem and the valving member. The stem extender includes a tubular member having a camming surface which cooperates with the detent of the stop member to ensure that the valving member is rotated to a sufficiently open position to prevent so-called "temperature kick" which occurs when the valving member is in the only slightly open position. The tubular member includes a slot opposite the camming surface adapted to receive a compression spring. The stem extender includes extension member containing a bottom section which is non-rotatably disposed in the slot of the tubular member and a top section which includes a stem which is operably connected to the handle whereby rotation of the handle causes rotation of the stem extender and valving member.

The preferred configuration of a two handle pressure balanced tub/shower valve would have one handle controlling the temperature while the other controls the on/off and volume. There are currently no two handle pressure balanced tub/shower valves available due in part to the phenomenon of "temperature kick". Temperature kick occurs when the volume handle is throttled down to a low flow condition, typically less than about 0.15 gallons per minute. When this occurs, the pressure in the valve from the shut off to the inlets is approximately the same. If there is a pressure imbalance between the hot and cold water, for instance if the hot water is 5 psi greater than the cold water, the pressure at the outlet would be higher than the cold water inlet pressure as the hot water pressure would dominate the cold water pressure. At this point, the flow exiting the valve would be full hot water. In a short period of time, about one minute, the body and shower riser would be filled with hot water. When the valve is turned back on, there is a blast of hot water coming out of the shower.
The same situation could occur if the pressures are equal, but one of the inlet openings is almost full open while the other is almost completely shut off. If it were desired to shower at a water temperature of 110.degree. F., when the cold water temperature is 50.degree. F. and the hot water temperature is 120.degree. F., the water opening would be almost totally biased to the hot water.
One way to prevent "temperature kick" is to ensure that the flow rate cannot be set at rates below about 0.15 gallons per minute. This is very difficult to achieve since most valves are infinitely adjustable across this range.
The present invention solves this problem by provision of a spring loaded stem extender which provides a "stop" and a ramped area which prevents extremely low flow rates.


An epoxy resin composition comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5-50 xcexcm is suited for semiconductor package encapsulation since it minimizes the warpage of packages and has satisfactory catalyst latency, storage stability and cure.

This invention relates to a semiconductor encapsulating epoxy resin composition having satisfactory cure, catalyst latency, storage stability and adhesion and a semiconductor device encapsulated with the cured product thereof.
The semiconductor devices in use today are predominantly resin encapsulated diodes, transistors, integrated circuit (IC) chips, large scale integration (LSI) chips, and very large scale integration (VLSI) chips. Resin encapsulation is usually carried out with epoxy resin compositions because epoxy resins offer superior properties (e.g., moldability, adhesion, electrical characteristics, mechanical characteristics, and moisture resistance), compared with other thermosetting resins.
For cost reduction purposes, attempts to improve the package manufacturing cycle have been made in the semiconductor art. The epoxy resin compositions are required to be fast-curing. However, increasing the amount of catalyst to impart fast-curing tends to cause gold wire flow and short-filling during molding because of thickening and rapid curing. The increased amount of catalyst has another problem that the epoxy resin composition loses storage stability.
On the other hand, a variety of shapes have been developed for the semiconductor package. When packages of advanced design are encapsulated with conventional epoxy resin compositions, the packages warp so that they cannot be mounted on boards. This is a serious problem with thin packages such as thin small outline packages (TSOP) and single-side molded packages such as ball grid arrays (BGA).
For reducing the warpage of packages, it is commonly employed to increase the glass transition temperature (Tg) of resins above 190xc2x0 C. and to minimize the coefficient of linear expansion. The coefficient of linear expansion is reduced by increasing the amount of filler, which increases the viscosity of the composition, which in turn, hampers molding operation and causes bending of gold wires and deformation of die pads. The high glass transition temperature requires the use of resins having a high degree of polymerization, which also increases the viscosity of the composition, hampering molding operation.
An object of the invention is to provide a novel and improved semiconductor encapsulating epoxy resin composition which minimizes the warpage of packages and has satisfactory cure, catalyst latency, storage stability and adhesion, and a semiconductor device encapsulated with the cured product thereof.
The invention pertains to an epoxy resin composition comprising an epoxy resin, a phenolic resin, an inorganic filler, and a curing catalyst. We have found that by using a polyfunctional epoxy resin as the epoxy resin and microencapsulating the curing catalyst, there is obtained an epoxy resin composition which is suited for the encapsulation of packages, for example, thin packages such as TSOP and single-side molded packages such as BGA. Quite surprisingly, the warpage of the packages is minimized and the composition is endowed with fast-curing, catalyst latency, and storage stability and improved in cured strength and adhesion.
Accordingly, the invention provides an epoxy resin composition for semiconductor encapsulation comprising (A) a polyfunctional epoxy resin, (B) a phenolic resin, (C) an inorganic filler, and (D) curing catalyst-containing microcapsules having a mean particle size of 0.5 to 50 xcexcm. A semiconductor device encapsulated with the epoxy resin composition in the cured state is also contemplated herein.
In the epoxy resin composition of the invention, a polyfunctional epoxy resin is used as the epoxy resin (A). Preferably the polyfunctional epoxy resin is of the following structure.
In the formula, R is hydrogen or a monovalent hydrocarbon group of 1 to 6 carbon atoms, as typified by alkyl groups including methyl, ethyl, propyl, isopropyl, n-butyl, isobutyl, tert-butyl, pentyl and hexyl. Rxe2x80x2 is hydrogen, methyl or ethyl, and preferably hydrogen. The letter n is an integer of 0 to 6.
Of the polyfunctional epoxy resins, triphenolalkane type epoxy resins such as triphenolmethane type epoxy resins and triphenolpropane type epoxy resins are preferred.
In addition to the polyfunctional epoxy resin, another epoxy resin may be used herein. Illustrative examples of suitable other epoxy resins include novolac-type epoxy resins such as phenolic novolac epoxy resins and cresol novolac epoxy resins, aralkyl type epoxy resins, biphenyl skeleton-containing aralkyl type epoxy resins, biphenyl type epoxy resins, heterocyclic epoxy resins, naphthalene ring-containing epoxy resins, bisphenol type epoxy resins such as bisphenol A epoxy resins and bisphenol F epoxy resins, and stilbene type epoxy resins, alone or in admixture of two or more.
The polyfunctional epoxy resin should preferably account for 50 to 100% by weight, and more preferably 70 to 100% by weight of the entire epoxy resins.
The epoxy resins should preferably have a softening point of 50 to 120xc2x0 C. and an epoxy equivalent of 100 to 400. Epoxy resins with a softening point of lower than 50xc2x0 C. tend to form burrs and voids when molded and would result in cured products having a lower Tg whereas epoxy resins with a softening point of high than 120xc2x0 C. would be too viscous to mold.
When the epoxy resins are used for the encapsulation of semiconductor devices, it is preferred that the content of hydrolyzable chlorine be up to 1,000 ppm, more preferably up to 500 ppm, and the contents of sodium and potassium be each up to 10 ppm. If semiconductor devices are encapsulated with compositions containing an epoxy resin with more than 1,000 ppm of hydrolyzable chlorine or more than 10 ppm of sodium or potassium, the encapsulated devices would experience deterioration of moisture resistance during long-term storage under hot humid conditions.
The curing agent (B) for the epoxy resins is a phenolic resin having at least two phenolic hydroxyl groups per molecule. Exemplary curing agents include phenolic resins, for example, novolac-type phenolic resins such as phenolic novolac resins and cresol novolac resins; p-xylylene-modified novolac resins, m-xylylene-modified novolac resins, o-xylylene-modified novolac resins, bisphenol type resins such as bisphenol A type resins and bisphenol F type resins, biphenyl type phenolic resins, resole type phenolic resins, phenolaralkyl resins, and triphenolalkane resins and polymerized products thereof; and naphthalene ring-bearing phenolic resins and dicyclopentadiene-modified phenolic resins.
Of these phenolic resins, phenolic novolac resins and triphenolalkane resins such as triphenolmethane, triphenolethane and triphenolpropane resins and polymers thereof are preferable from the consideration of heat resistance, package warpage and moldability. These preferred phenolic resins may be combined with any of the above-described phenolic resins insofar as the desired effect is not impeded.
Amine curing agents and acid anhydride curing agents may also be used in combination with the phenolic resins.
The phenolic resin curing agents should preferably have a softening point of 60 to 150xc2x0 C., especially 70 to 130xc2x0 C. and a hydroxyl equivalent of 90 to 250. When the phenolic resins are used for the encapsulation of semiconductor devices, it is preferred that the contents of sodium and potassium be each up to 10 ppm. If semiconductor devices are encapsulated with compositions containing a phenolic resin with more than 10 ppm of sodium or potassium, the encapsulated devices would experience accelerated deterioration of moisture resistance during long-term storage under hot humid conditions.
The curing agent may be blended in any desired amount. Preferably the phenolic resin curing agent is blended in such amounts that the molar ratio of phenolic hydroxyl groups in the phenolic resin to epoxy groups in the epoxy resin may range from 0.5 to 1.5, especially from 0.8 to 1.2.
The inorganic filler (C) is selected from fillers commonly used in epoxy resin compositions. The inorganic filler is blended in order to reduce the coefficient of expansion of encapsulants for reducing the stress applied to semiconductor devices. Typical of the inorganic filler are fused silica in ground or spherical form and crystalline silica. Alumina, silicon nitride, aluminum nitride, and other fillers may also be used.
To achieve a good compromise between reduced expansion of cured products and moldability of compositions, it is recommended to use a blend of fillers in spherical and ground forms or only a filler in spherical form. The inorganic filler is preferably used after it is surface treated with silane coupling agents.
The inorganic filler preferably has a mean particle size of 1 to 40 xcexcm, more preferably 5 to 30 xcexcm. The mean particle size as used herein can be determined, for example, as the weight average (median diameter) in the particle size distribution as measured by the laser-light diffraction method.
The inorganic filler is blended in amounts of about 100 to 1,000 parts, preferably about 250 to 1,000 parts, and more preferably about 350 to 900 parts by weight per 100 parts by weight of the epoxy resin (A) and phenolic resin (B) combined. The preferred loading of inorganic filler is at least 70%, especially at least 75% by weight of the entire composition. Epoxy resin compositions loaded with less than 70% by weight of the inorganic filler may have a high coefficient of expansion, causing greater stresses to be applied to semiconductor devices and hence, deterioration of the device characteristics. The upper limit of filler loading is usually 92% by weight.
In the epoxy resin composition of the invention, curing catalyst-containing microcapsules (D) are blended. The curing catalyst in the microcapsules may be any of well-known curing catalysts for epoxy resins. Nitrogen-containing curing catalysts and organic phosphorus curing catalysts, especially imidazole compounds and organophosphine compounds are preferred as the catalyst to be contained in microcapsules.
Useful imidazole compounds are of the following general formula (1).
In the formula, R1 and R2 are independently hydrogen or substituted or unsubstituted monovalent hydrocarbon groups of 1 to 12 carbon atoms, preferably 1 to 6 carbon atoms, for example, alkyl, substituted alkyl and aryl groups, such as methyl, ethyl, hydroxymethyl and phenyl. R3 is a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms, preferably 1 to 6 carbon atoms, for example, alkyl, alkenyl and aryl groups, such as methyl, ethyl, phenyl and allyl. R4 is hydrogen or a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms, preferably 1 to 6 carbon atoms, for example, alkyl, substituted alkyl and aralkyl groups, such as methyl, ethyl, cyanoethyl and benzyl, or a group represented by the following formula (2). Exemplary substituted monovalent hydrocarbon groups are hydroxy and cyano-substituted ones.
Examples of the imidazole compounds include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-benzyl-2-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-allyl-4,5-diphenylimidazole, 2,4-diamino-6-[2xe2x80x2-methylimidazolyl-(1)xe2x80x2]-ethyl-S-triazine, 2,4-diamino-6-[2xe2x80x2-ethyl-4xe2x80x2-methylimidazolyl-(1)xe2x80x2]-ethyl-S-triazine, 2,4-diamino-6-[2xe2x80x2-methylimidazolyl-(1)xe2x80x2]-ethyl-S-triazine isocyanuric acid adduct, and 2-phenyl-4-methyl-5-hydroxymethylimidazole.
Examples of the organic phosphorus curing catalyst include organophosphines, typically triorganophosphines such as triphenylphosphine, tributylphosphine, tri(p-methylphenyl)phosphine, tri(nonylphenyl)phosphine, and diphenyltolylphosphine; a salt of a triorganophosphine with a triorganoboran such as triphenylphosphine-triphenylboran; and a salt of a tetraorganophosphonium with a tetraorganoborate such as tetraphenylphosphonium tetraphenylborate. Of these, phosphorus compounds of the following general formula (3) are preferred.
Herein, R5 is hydrogen, or an alkyl or alkoxy group of 1 to 4 carbon atoms. Exemplary alkyl groups are methyl, ethyl, propyl, isopropyl, butyl, isobutyl and tert-butyl. Exemplary alkoxy groups are methoxy and ethoxy. Preferably R5 is hydrogen or methyl.
Examples of the compound of formula (3) are given below.
The microcapsules are obtained by microencapsulating the curing catalyst with suitable polymers. Included are polymers of (meth)acrylic monomers, for example, alkyl esters of 1 to 8 carbon atoms and similar alkyl esters whose alkyl group has a substituent such as allyl, such as acrylates, itaconates, methacrylates, and crotonates; monofunctional olefinic (or vinyl) monomers such as styrene, xcex1-methylstyrene, acrylonitrile, methacrylonitrile, and vinyl acetate; and polyfunctional olefinic (or vinyl) monomers such as ethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, divinyl benzene, bisphenol A di(meth)acrylate, and methylene bis(meth)acrylamide. Of these, polymers of (meth)acrylate monomers are preferred.
Any desired method may be employed in preparing microcapsules containing the curing catalyst, typically imidazole compounds or organophosphine compounds as mentioned above. To manufacture microcapsules having a high roundness in high yields, any suitable one of well-known suspension polymerization or emulsion polymerization methods may be used.
To manufacture high concentration microcapsules from a commonly available catalyst, about 10 to 200 parts, desirably about 10 to 100 parts, and more desirably about 20 to 50 parts by weight of the monomer(s) may be used per 10 parts by weight of the curing catalyst. With less than 10 parts of the monomer, it may become difficult to impart latency. More than 200 parts of the monomer corresponds to a lower concentration of the catalyst, which may require to increase the amount of the catalyzed microcapsules for achieving satisfactory cure, leading to an economical disadvantage. In other words, the concentration of the curing catalyst in the microcapsules may be about 5 to 50% by weight, preferably about 9 to 50% by weight, more preferably 17 to 33% by weight.
In this way, microcapsules are formed to a mean particle size of 0.5 to 50 xcexcm, desirably 3 to 25 xcexcm. Microcapsules with a mean particle size of less than 0.5 xcexcm have the risk that a composition having a large amount of such microcapsules blended therein has an increased viscosity and the catalysis latency becomes insufficient. Microcapsules with a mean particle size of more than 50 xcexcm can cause gate clogging during molding.
Further desirably, the microcapsules have the following release action. In a leaching test, 1 g of the curing catalyst-containing microcapsules is mixed with 30 g of o-cresol, the mixture is held at 30xc2x0 C. for 15 minutes, and the quantity of the leached-out catalyst is determined by gas chromatography. The quantity of the leached-out catalyst is at least 70% by weight (i.e., 70 to 100% by weight) based on the entire quantity of the catalyst contained in the microcapsules. If the leach-out quantity is less than 70% in a 30xc2x0 C./15 min cresol leaching test, molding of the epoxy resin composition over semiconductor devices may require a molding time of more than one minute at 175xc2x0 C., leading to a low productivity. A leach-out quantity of at least 75% by weight (i.e., 75 to 100% by weight) is more desirable.
In the epoxy resin composition, the curing catalyst-containing microcapsules (D) are desirably blended in an amount of about 0.5 to 15 parts, more desirably about 1 to 10 parts by weight per 100 parts by weight of components (A) and (B) combined. Less than 0.5 part of the microcapsules may fail to provide satisfactory cure. More than 15 parts of the microcapsules ensure satisfactory cure, but increase the cost.
In the epoxy resin composition, the conventional curing catalyst (curing accelerator) which is not microcapsulated may be blended in combination with the curing catalyst-containing microcapsules. In this case, the weight ratio (B)/(A) of (B) the curing catalyst which is not microcapsulated and (A) the curing catalyst-containing microcapusules is preferably 0 to 0.5, preferably 0 to 0.2, more preferably 0 to 0.1.
For imparting flexibility or toughness or adhesiveness to the cured product of the epoxy resin composition, any of silicone-modified copolymers, various organic synthetic rubbers, thermoplastic resins such as styrene-butadiene-methyl methacrylate copolymers and styrene-ethylene-butene-styrene copolymers, silicone gel, and silicone rubber in powder form may be added to the inventive composition. The inorganic filler may be surface treated with two-part type silicone rubber or silicone gel. It is understood that the above-mentioned silicone-modified copolymers and styrene-butadiene-methyl methacrylate copolymers are effective for reducing stresses in the epoxy resin. The amount of such a silicone-modified copolymer and/or thermoplastic resin serving as the stress-reducing agent is preferably 0 to 10%, more preferably 0.2 to 5% by weight of the entire epoxy resin composition. More than 10% may detract from mechanical strength.
In the inventive composition, there may also be blended colorants (e.g., carbon black), flame retardants (e.g., brominated epoxy resins and antimony trioxide), parting agents, and coupling agents.
The epoxy resin composition of the invention is prepared as a molding material by blending the epoxy resin, curing agent, inorganic filer, curing catalyst-containing microcapsules, and other additives in a predetermined proportion, uniformly mixing them in a dry mixer or the like, melt kneading the mixture in a hot roll mill, kneader or extruder, followed by cooling for solidification and grinding to a suitable size.
The epoxy resin composition containing the catalyzed microcapsules is effectively utilized in encapsulating semiconductor devices, typically thin packages such as TSOP and single-side molded packages such as BGA. The most common encapsulation process is low pressure transfer molding. The molding temperature is usually about 160 to 190xc2x0 C.

Semiconductor encapsulating epoxy resin composition and semiconductor device


Disclosed are methods for performing capillary electrophoresis on two or more nucleic acid samples. The methods employ a forward voltage to move a first sample forward from an inlet to an interrogation region in the capillary, then a backward voltage to move the first sample backward, and then a forward voltage again to move the first sample and a second sample forward. Systems and apparatuses for performing capillary electrophoresis are also provided.

Capillary electrophoresis systems are used for separation of, e.g., PCR amplicons. In a typical workflow a sample is brought to the one end of the capillary where a small portion of the sample is injected as a plug. Typically, high voltage is applied and the charged species in the sample starts migrating inside the capillary where gel discriminates between species based on speed; the species migrate such that species with different properties become separated. The polarity of the high voltage is chosen so that species of interest are driven to migrate towards the other end of the capillary where, at some distance before the end, they are detected. The first species arrives at the location of detection at a particular time, and then the species of interest arrive later, according to their respective properties. The output from the detector reveals the time of arrival of any of the species in the population, from which information about said species, such as its size, can be discerned.
In increasing throughput of electrophoresis systems would provide many scientific and investigative benefits.


A method of repairing a vehicle bed-liner includes depositing a two-component patching material into the defect and placing a template having a design surface over the defect in the bed-liner, with the design surface facing the defect. A rigid backing plate can be placed over the template. The template is biased toward the patching material to form a patch in the bed-liner.

1. Field of the Invention
This invention relates generally to the repair of protective coatings and, in one particular embodiment, to the repair of vehicle bed-liner coatings.
2. Technical Considerations
Protective coatings are known for protecting various substrates, such as metal or plastic pipelines, large gravel haulers, vehicle components, railroad cars, metal valves, plastic parts, etc., from mechanical and/or environmental damage. One particular use for such protective coatings is in so called vehicle "bed-liners". Bed-liners are provided in the cargo bed areas of trucks or other commercial vehicles to protect the underlying metal bed from scratches, dents, chips, corrosion, and other damage. Additionally, the bed-liner provides the vehicle with a desirable aesthetic appearance, especially when the bed-liner is new. Conventional bed-liners can be formed by attaching prefabricated rubber or plastic pieces onto the vehicle bed. Alternatively, the bed-liner can be formed in situ by the spray application of a liquid coating composition onto the vehicle bed, which coating composition then cures to form the protective bed-liner.
While generally acceptable for their intended purpose, problems can develop with the use of such conventional bed-liners. For example, when new, the bed-liner initially protects the underlying metal surface from mechanical damage caused by hauling or throwing objects into the vehicle bed and/or environmental damage, such as corrosion, that can be caused by moisture. However, with continued use, the bed-liner can become scratched, gouged, or otherwise damaged. This can lead to a decrease in the aesthetic appearance of the bed-liner or, more importantly, can expose portions of the underlying metal vehicle surface, which can promote scratching of the metal surface or corrosion. Once rust or other corrosion gains a foothold, degradation of the entire metal bed can follow. Additionally, for spray-applied bed-liners, bubbles or voids or other application defects can exist in the bed-liner coating.
Once a vehicle bed-liner has become damaged or application defects are detected, the entire bed-liner may have to be removed and an entirely new bed-liner applied to the vehicle bed to prevent continued corrosion of the underlying metal surface. This can be a time-consuming and expensive venture. Alternatively, a vehicle owner may try to patch the damaged area using duct tape or other conventional patching compositions. However, a drawback of this procedure is that the patched area may not match the original bed-liner appearance, e.g., color, texture, and/or design, which can lead to a "patchwork quilt" appearance of the overall bed-liner. This is aesthetically undesirable. Moreover, the patching material can have a different mechanical and/or chemical durability than the original bed-liner, which can result in the need to continually re-patch the area as the patching material wears away.
Therefore, it would be desirable to provide a method and/or apparatus for repairing a damaged bed-liner that eliminates or reduces at least some of the problems described above.

Method and apparatus for repairing bed-liner coatings


This invention relates to apparatus for setting a plug in, or retrieving a plug from, a horizontal xmas tree. The apparatus comprises a housing with a throughbore adapted to be releasably connected at a first end to a horizontal xmas tree, the housing including an at least one axially moveable member which also includes an at least one radially moveable element and a tool deployable within the housing throughbore by an elongate support and adapted to be releasably connected to the plug. The tool has an outer surface portion profiled to releasably engage with an engagement surface the at least one radially moveable element whereby, in operation, engagement of the at least one radially moveable element with the tool outer surface portion permits the plug, connected to the tool, to be set in the horizontal xmas tree or retrieved from the horizontal xmas tree by axial movement of the at least one axially moveable member.

Subsea oil and gas production wells are sealed off from the environment using apparatus known as a production xmas trees. Two types are commonly used; firstly the vertical xmas tree, which has gate valves in the production bore allowing isolation of the well through the remote operation of these valves, and secondly, the horizontal or "spool" xmas tree in which the production bore is sealed off using plugs run into a tubing hanger installed inside the tree.
Increasingly, horizontal type xmas trees are being used with subsea wells for reasons of cost and convenience. Horizontal xmas trees allow wells to be brought into production in less time and at a lower cost than vertical xmas trees. Furthermore, horizontal xmas trees allow for more modern and larger bore completion systems to be used in the well.
However, significant problems have been encountered when trying to correctly set plugs in the tree, or when trying to recover plugs from the tree. For example, the plug can be set in similar, but incorrect profiles within the tree resulting in low integrity sealing of the well. Secondly large forces are required to set or retrieve the plug from the tree, and thirdly there is no positive indication of the plug being correctly set.
Since the plugs are primary barriers in isolating the high pressure hydrocarbon well fluids from the environment, it is critical they are correctly placed and fitted within the xmas tree system.


This mobile unit suppresses lateral vibration produced when the mobile unit passes over a step. A stabilizer according to the present invention predicts contact timing at which the mobile unit makes contact with a step, which may be a bump or pit, using sensor information or map information, shifts the center of gravity of the mobile unit laterally by controlling actuators, and shifts the center of gravity laterally for the next step after detecting that the mobile unit has passed over the previous step.

(1) Field of the Invention
The present invention relates to a mobile robot with a stabilizer for preventing lateral vibration produced when the mobile robot passes over steps and a travelling method for stabilizing the mobile robot.
(2) Description of the Related Art
Conventionally, mobile robots that travel over steps on a road surface in various travel manners have been proposed (e.g., JP-A No. 2009-55682 and JP-A No. 2007-168602).
When there is a bump on a floor surface, an inverted mobile unit disclosed in JP-A No. 2009-55682 inclines itself forward while maintaining contact between its rotary unit and the bump to acquire the torque required to pass over the step through inversion control.
JP-A No. 2007-168602 discloses a two-wheel travelling carriage that detects steps. The carriage is configured not to change the travel direction when the detected step has a height equal to or less than 10% of the radius of the wheels of the carriage, but to travel over the step with both wheels making contact with the step when the detected step has a height from 10% to 40% of the radius of the wheels.

Mobile robot and travelling method for the same


A combination shipping and dispensing carton for carrying pouches which can be converted into side-by-side dispensers for dispensing pouches in their upright position on the shelves of stores. The carton has a bottom panel, top panel and adjoining side panels and flaps for closing the ends of the carton. The carton has a pair of tear lines extending through one side panel and a fold line extending in the other side panel which are interconnected so that when the tear lines are torn the carton can be formed into side-by-side dispensers by folding the fold line. This shipping carton carries the pouches in two rows with the tops of the pouches in each row meeting near the center of the carton and overlapping so that the length of the carton is less than two times the length of a pouch.

1. Field of the Invention
The present invention relates generally to a combination shipping carton for shipping pouches which can be easily converted into twin boxes for dispensing and displaying the pouches to the consumer. This invention has a unique feature in a combination of a fold line in one side panel and of tear lines in the carton for converting the shipping carton into twin boxes for dispensing and displaying the pouches.
2. Background
Many food products, such as drinks, small pieces of candy, snack mixes of small pieces of food (e.g. trail mix), and the like are packaged and sold to the consumer in pouches made of a composite material. These pouches tend to be small in size (e.g. 200 milliliters or 100 grams). These pouches are presently shipped to the store in a shipping container and these are removed and placed on the shelf individually in groups or displayed in the shipping container.
Neither of these options for displaying and dispensing these pouches to the consumer is very satisfactory.

Combination shipping carton and twin dispenser boxes

Abstract: The length of the carton can be from approximately the length of a pouch to one and half times the length of a pouch, depending upon the configuration of the pouches and how full they are filled.


Polyurethaneurea resins containing at least one group of the formula (I)—NH(CO)XOR1O(CO)CHR2CH2N[CnH2nSi(OR3)3](CO)NH—  (I)and/or at least one group of the formula (II){—NH(CO)XO}a{CH2═CR2(CO)O}bR4{O(CO)CHR2CH2N[CnH2nSi(OR3)3](CO)NH—}c  (II)wherein    X=[O(CH2)4]q(OC2H4)x(OC3H6)y[(CH2)5(CO)]z;    q=0 to 10;    x=0 to 20;    y=0 to 20;    z=0 to 10;    n=2 or 3;    a=1 or 2;    b=0 to 4;    c=1 to 5;    R1=—C2H4—, —C3H6—, —C4H8—, —CH(CH2O(CO)R5)CH2— or —CH2CH(O(CO)R5)CH2—;    R2=H or CH3;    R3=C1 to C4 alkyl;    R4=a+b+c-valent, saturated hydrocarbon residue of a (cyclo)alkane polyol with a+b+c hydroxyl groups;    R5=an acid residue of a monocarboxylic acid,    with the proviso that a+b+c=3 to 6 and wherein the sequence of the subformulae indicated q, x, y and z may be varied at will and q, x, y and z in each case merely state the number of instances of the particular subformulae contained in the formulae (I) and (II).

Polyurethaneurea resins with trialkoxysilane groups and methods for the production thereof are known per se.
For example, isocyanate-functional polyurethane prepolymers and/or isocyanate-functional polyurethaneurea prepolymers may be reacted with trialkoxysilanes carrying primary or secondary amino groups to yield polyurethaneurea resins with terminal trialkoxysilane groups. Such polyurethaneurea resins with trialkoxysilane groups are described, for example, in U.S. Pat. No. 5,760,123 as starting products for the production of aqueous dispersions of polyurethaneurea resins with siloxane bridges.
Alternatively, functionalized polyurethaneurea resins may be reacted in a polymer-analogous reaction with suitably functionalized trialkoxysilanes, i.e., trialkoxysilanes which comprise groups which are complementarily reactive towards the functional groups of the polyurethaneurea resins, to yield polyurethaneurea resins with trialkoxysilane groups.

Polyurethaneurea resins with trialkoxysilane groups and processes for the production thereof


The misapplication or misplacement of solder bumps on chips and/or circuit boards presents financially significant waste and cost efficiency problems in the manufacture of electronic components. The present invention describes an article and a process for using the article to more quickly remove such spurious solder during manufacture of components. The present invention may comprise an article for assisting in the removal of solder from a surface comprising: a) a surface layer of textured material which can be wet by molten solder, b) a first thermally conductive layer having a surface which is in thermal contact with said surface layer, and c) preferably a flux which is present on at least one of said surface layer and said thermally conductive layer having a surface in thermal contact with said surface layer. The article may be preferably provided where the first thermally conductive layer comprises a sheet of flexible, thermally conductive metal, especially aluminum. The performance of the article may be generally enhanced by providing the thermally conductive layer as a metallic layer with its surface having a layer of material which can be wet by molten solder.

1. Field of the Invention
The present invention relates to the manufacture of articles using solder, particularly the manufacture of articles having electrical connections which use solder to provide areas where electrical contacts are attached or electrical connections made, and most particularly to the manufacture of circuit boards where solder is used to provide electrical contact points or points of adhesion for electrical connections, and to the removal of excess solder in such manufacturing processes.
2. Background of the Art
Solder has been used for literally centuries in the adherence of metal components together. Solder is a relatively low melting metal or alloy (usually lead and tin, with other optional ingredients therein) which is melted between two components which are intended to be adhered. Because the solder usually melts at a temperature below the melting point of the metals which are to be adhered together, the solder will bond the two surfaces (the primary materials) to be adhered without the need of using temperatures which could melt or damage the primary materials, as would be the case in welding. Soldering is generally performed by cleaning two primary surfaces, applying a flux (which may further clean or maintain the cleanliness of the surface) which enables or enhances the surface to be wetted by the solder. After the surfaces have been cleaned and a flux applied, the solder is heated, allowed to flow between the two surfaces, and then cooled. The cooled solder forms a solid bond between the two primary surfaces.
One of the desirable aspects of soldering in the electrical and electronic arts is the fact that the bond between the two primary surfaces is conductive. This allows the use of the soldering technique between electrically transmissive elements, and in fact enables electrical connections to be readily effected between electrical elements. Solder deposits are often used in the electrical/electronic (the terms may be used alternatively or collectively for the description of the present invention) industry to provide connection points in premade circuit boards. The board or circuit is constructed with the electrical/electronic configuration built into the board, and the specific points where other electrical connections are to be made to the board are provided with solder points so that a connecting component may be aligned with the circuit board, and the connecting component may be heated in aligned contact (the electrical connectors aligned with the solder points where they are to be bonded) with the circuit board and the components and circuit heated to bond the components to the circuit board through the solder points.
In the manufacture of circuit boards having large numbers of point-to-point contacts needed between components, the detail in the electronic/electrical configurations and the solder points can be very complex and require great precision in the location and volumes of solder on the circuit board. These complex arrangements of electrical/electronic connections can be prepared by a number of different methods. The individual contact points may be manually applied or the entire distribution of solder points may be applied by printing type process (screen application, gravure coating, etc.). In either case, mistakes in the positioning or quantity of solder applied may occur. These mistakes, usually in the form of excess or misaligned solder deposits, can adversely affect the performance of the circuit board by preventing proper alignment of the board or a chip on the board (because of a physical anomaly in the presence of a bump or mis-positioning of solder), or the absence of solder preventing a proper electrical connection to be accomplished. Because of the desire to reduce manufacturing waste, both because of environmental concerns and the expense involved in waste, it is desirable to recover and salvage any mistakenly configured circuitry so that the circuit board may be reused. Many different types of efforts have been attempted to provide materials and processes for recovering misconfigured circuit boards.
There are basically three types of processes which are used to control or remove solder from circuit board applications. One type of process levels solder which remains on a circuit board. This leveling may be accomplished with any one of or combination of liquid (solvent) application, thermal softening, and air knifes. Such processes are exemplified as system patents by U.S. Pat. Nos. 5,593,499; 4,614,858; 4,412,641; and U.S. Pat. No. 4,285,091. Another process involves solvent or carrier material to the surface. This is shown in some of the system patents described above and are shown with fluidized beds and/or solvents in U.S. Pat. Nos. 4,769,083; 3,924,794; and 3,865,298. Wicking materials, usually applied only to the specific solder joints or collection of solder connections for an individual component are shown, for example, in U.S. Pat. Nos. 4,323,631; 4,923,521; 5,065,931; 3,715,797; 4,416,408; 4,934,582; and RE 32,806.
U.S. Pat. No. 4,934,582 describes a method and apparatus for the removal of solder mounted surface mount electronic components which includes the removal of old solder, broken leads, and the electronic component without damaging other devices on the substrate. A desoldering braid is shaped to cover each of the electronic component's outer lead bonds without contacting the component's base. The desoldering braid is heated and brought in contact with the bonds until the solder flows into the desoldering braid and any broken outer leads attach to the desoldering braid. Upon removal of the desoldering braid the electronic component can be lifted off the surface. The desoldered solder joints will contain a thin uniform coating of solder less than approximately 50 micro inches thick. This allows for removal and replacement of solder mounted electronic components with leads on center lines spaced less than 0.020 inches.
U.S. Pat. No. 4,905,371 describes an apparatus and method for a cleaning process control. The apparatus includes a printed wire circuit board that is made on a Pyrex glass or other transparent substrate. Components are attached to the printed wire circuit board and then the circuit card assembly which is formed is cleaned using a selected cleaning process. The circuit card assembly can then be inspected to determine the effectiveness of a particular cleaning process by flipping over the transparent circuit card, peering through the substrate to inspect for corrosion and solder balls. The circuit card assembly can then be cleaned more extensively and used again to check a different cleaning process.
U.S. Pat. No. 4,416,408 describes a solder removing device for absorbing solder which has been rendered molten by the application of heat, including an open-mesh structure comprising a strand and formed by knitting, as a primary example, at least the surface of the strand being metallic and receptive to solder flux (and indeed being coated with solder flux rendering it more capable of wetting with molten solder). The open-mesh structure enables the device to absorb solder more freely and in greater quantities than can prior braided devices in which the multiple strands are contiguous.
U.S. Pat. No. 3,724,418 describes the application of a thin uniform coat of hot tin lead solder to the exposed copper circuitry of electrical circuit boards utilizing a fluxing station, a standing wave soldering station, a hot liquid spray leveling station, a hot water spray cleaning station, a high volume air spray drying station and a conveyor for transporting the electrical circuit boards past the aforementioned stations. The apparatus contains those pumps, motors, tanks, and electrical and hydraulic systems necessary to support the aforementioned stations.
U.S. Pat. No. 3,715,797 describes a rope-like member of braided heat conducting metallic wires coated with a second metal and a flux is applied to a solid solder joint. Heat applied to the rope-like member liquefies the solder which in turn is absorbed into the member thereby removing solder from the joint.
U.S. Pat. No. 5,593,499 describes a dual air knife assembly for removing excess solder and leveling any remaining solder on a passing circuit board with a gas from a gas source includes a first and second air knife. The first air knife has a first passage with a first inlet adapted to connect to the gas source and a first outlet adapted to be positioned adjacent the passing circuit board. The second air knife has a second passage with a second inlet connected to the gas source and a second outlet adapted to be positioned adjacent the passing circuit board. The first air knife is adapted to be positioned substantially perpendicular to the circuit board and the second air knife is adapted to be positioned at an angle less than 90 degrees and preferably between 20 and 60 degrees to the circuit board. The dual air knife assembly may include a spacer which separates the a first and second air knife and is recessed from the outlets of the a first and second air knife to create an expansion chamber. The distance the first and second outlets are from the passing circuit board and the temperature and pressure of the gas exiting from the a first and second air knife should all be substantially the same. Typically, the dual air knife assembly is used in a soldering system which includes a conveyor, a flux station, and a solder station. The dual air knife assembly is used in a process referred to as "hot air solder leveling" to remove excess solder and more evenly distribute any remaining solder. A pair of dual air knife assemblies may be used in another soldering system where excess solder is removed and any remaining solder is leveled on both sides of a circuit board.
U.S. Pat. No. 5,065,931 U.S. patent No. describes a process for repairing electronic device packages, the problem of removing solder remnants on substrate bonding pads is solved by, first etching a pattern in silicon and metallizing the pattern to make a silicon wick. The solder remnants on the bonding pads are melted, and the etched pattern of the silicon wick is brought into contact with the remnants to remove them by capillary action. It is often convenient to heat the silicon wick so that solder remnants melt when the wick is brought into contact with them.
U.S. Pat. No. 5,007,574 describes a desoldering tool which has a removable cartridge and a base unit having an assembly interior including a solder collection chamber and a removable vacuum source for developing a vacuum in the bottom of the chamber under a removable porous solder retention pad, the cartridge having a temperature self-regulating heater therein and a tail pipe extending from a tip of the cartridge to a position above the solder collection chamber, and a vacuum seal between the cartridge and the base unit to maintain the vacuum and reduce transfer of heat from the tip.
U.S. Pat. No. 4,923,521 describes a process for repairing electronic device packages. The problem of removing solder remnants on substrate bonding pads is solved by, first, etching a pattern in silicon and metallizing the pattern to make a silicon wick. The solder remnants on the bonding pads are melted, and the etched pattern of the silicon wick is brought into contact with the remnants to remove them by capillary action. It is often convenient to heat the silicon wick so that solder remnants melt when the wick is brought into contact with them.
U.S. Pat. No. 4,614,858 describes a desoldering tool for removing soldered electronic components from printed circuit boards which includes a plurality of electric heater bars disposed in spaced apart, opposed relationship so as to grasp the component to be removed. The heater bars are shaped to contact the solder terminations to be desoldered and are composed of an alloy of high electrical resistivity, such as Nichrome. The heater bars are each removably attached to a pair of cantilever spring plates carried by the enlarged end of the handle of the desoldering tool by a different pair of bus bars enclosed in a molded plastic housing providing support and electrical insulation. One bus bar of each pair is rigidly attached to one spring plate while the other bus bar is attached to the other spring plate so that the cantilever spring plates urge the heater bars against the solder terminations and retain the component for physical removal. The leads of a power cord extending through the handle are electrically connected to the spring plates for supplying heating current to the heater bars through the bus bars.
U.S. Pat. No. 4,412,641 describes a device for desoldering electronic components from circuit boards which has a soldering nozzle which produces a solder wave that is directed from below the circuit board against the component to be desoldered; thereby dissolving previous solder bonds. The component can then be lifted out from above and suction is applied from below to the now-opened bores of the circuit board, to remove residual solder from them. A new component can then be installed, using the same equipment.
U.S. Pat. No. 4,323,631 describes a solder removing device is disclosed including fibers of temperature-resistant non-metallic material, such as a synthetic polymeric material, for example FEP or PTFE, which are coated with a metal rendering them more receptive to solder flux. The metallized fibers are coated with solder flux rendering them more capable of wetting with molten solder, interstices between the fibers serving to absorb molten solder by capillary attraction.
U.S. Pat. No. 4,285,091 and U.S. Pat. No. 4,187,973 describe a desoldering system which operates in conjunction with a soldering instrument which may be of the temperature controlled type disclosed and specifically designed for simultaneously desoldering dual-in-line integrated circuit packages, having for example 14 or 16 pins, multiple pins for transistors, 8 or 10 pin round integrated circuit packages and the like. Due to the large throughput of air required to the vacuum system the desoldering attachment features large inlet pipes. The desoldering tip is directly screwed onto the heating element of a soldering instrument surrounded by an air tight sleeve which includes a filter or trap for the solder. The sleeve of the desoldering instrument in turn is connected to another barrel which may include an additional filter and is provided with a three-way trigger valve. The valve selectively connects the desoldering attachment to a vacuum line to pull in the solder, it closes the vacuum line when not depressed, and provides access to the outside air for removing the solder collected in the desoldering attachment. A solder extractor is provided for this purpose. It is connected to a vacuum line and features a snap action to uncover a vacuum connection whereby the desoldering tip and its sleeve may be cleaned by sucking out the solder.


A novel heat exchange device to provide sufficient amounts of heat within a manifold including a working fluid within heating coils to generate electricity through an external combustion steam engine and electrical generator is provided. Such a novel heat exchanger includes coils that surround a central heating compartment thereby exposing such coils to gradually increasing temperatures such that the working fluid is first vaporized and then is ultimately superheated to a “dry” steam upon the point of egress of the heat exchanger leading to the engine portion. In this manner, greater efficiency in heating of the working fluid is accomplished with all of the fluid converted to a gas under pressure to effectuate the necessary engine, etc., movement for energy production.

There are many different electrical generators that have been developed through many years. Many rely upon the burning of fossil fuels (gasoline and diesel, in particular) to create heat that eventually transfers into mechanical energy (through various engine types, such as internal combustion and Stirling engines). Such fossil fuel combustion electrical generators (as well as waste oil burning types), however, create problems with nitrogen oxide (NOx) and sulfur dioxide (SO2) emissions and thus require caution and possible extra filter technologies to protect the user and the environment from such toxic releases (particularly due to the high temperatures required to incinerate liquid fuels that, in the presence of air, create such undesirable byproducts). As well, the specific types of fuel needed for such a device to function are usually limited and expensive due to necessary fuel refinements for such a purpose. Although the resultant kilowatt generation from such a device may be acceptable for short term purposes (power outages, for instance), such a device is highly undesirable in terms of providing electricity to a grid or for sustained periods of time, unfortunately.
Likewise, other past generators have relied upon internal combustion engines that exhibit bulky and/or extremely heavy configurations and require usage in a specific location. Though effective in such configurations, these engines are actually rather elaborate and/or highly inefficient for such a purpose and must use highly refined and expensive fuels to operate. Unfortunately, to operate these engines in the production of electricity has created myriad problems in such that the fuel needed has been ignited in an explosion within the piston cylinder that instantaneously combusts the subject fuel to the point of generating a high temperature but too quickly to properly and completely incinerate the fuel themselves, thus leading to the unwanted creation of NOx and SO2 emissions. In other words, the prior designs for such electrical generating devices at this size and output have been limited in their fuel types (not to mention the proper balance of combustion and exhaust collection) to make it worthwhile for the user to provide a cost-effective electrical generator. As well, as alluded to above, the continued safety issues with fuel combustion exhaust issues renders such prior devices highly questionable in terms of availability at any desired location for actual long term use, particularly without the added expense of emission control components.
In a separate consideration, there exist particularly effective heat regenerative steam engines in U.S. Pat. Nos. 7,080,512, 7,856,822, and 7,992,386 (as examples), all to Schoell, that are configured specifically to be incorporated and introduced within a system wherein the source of water vaporization is waste heat from a manufacturing process. Such systems thus capture heat that typically is unusable and couples such a source with a working fluid that becomes steam (or a like vapor) in order to generate electricity through a modified multi-piston engine. No discussion is made of the potential for incorporating such a specific, effective steam engine with any other type of heat source, and no provision is made for the necessary components required to possibly utilize such a device with any type of heat source other than those specified as exhaust types from large-scale reactors. As such, although such a specific heat regenerative engine is effective in conjunction with certain waste heat sources, the investigation into any viability with any other types of sources, let alone separate engines incorporated directly into such a heat regenerative type apparatus, has not been explored, particularly in terms of a small-scale device, regardless of overall end result in terms of kilowatt generation.
There thus exists a definite need to provide a cost-efficient, effective, environmentally friendly, electrical generator utilizing low square footage genset technology. To date, unfortunately, the shortcomings of the prior devices delineated above leave a gaping omission in the types of generators available to such a degree within the electrical generator industry. This invention overcomes and provides, in a narrow scope, a device that meets all of those goals and with a capability to generate a high amount of kilowatts for introduction within an electrical grid and/or to power lights, equipment, and the like, directly.
Additionally, there has been a noticeable lack of improvements in the heat exchanger industry for implementation with a steam or combustion engine. Past developments have included standard coiled structures that are subjected to heat sources in order to convert, for steam engines, at least, working fluids to vapor and thus transfer of the same to an engine for mechanical motion purposes. The concentration on engine improvements has not yielded any significant modifications for typical heat exchangers of the past, unfortunately. Although most devices of this type are enclosed systems (to reduce loss of heat, at least), the typical configurations employed for such processes allow for direct heat exposure to the target coils without any noticeable variations in temperature. A system that compensates not only for problems that may exist with coil devices that permit instant heating, rather than gradual, and/or further takes into account the potential for coil insulation due to ash and other carbon byproducts from fuel and gas combustion therein, would be quite attractive to the combustion engine, industry, at least. To date, however, and as noted above, such improvements have not been provided.

Heat exchanger for combustion engines including a housing containing a refractory tube within a dividing tube encircled by at least one coiled tube


In an actuating structure for a valve, in particular for a waste gate of an exhaust gas turbocharger, comprising a lever element and a valve closure element which is movably supported by the lever element and has a sealing surface for sealing a valve opening wherein the lever element and the valve element cooperate via respective contact areas, which are curved at least with respect to a plane perpendicular to the axial direction of the valve, the curved contact areas are arranged concentrically with each other and have a common center of curvature which is arranged at least essentially at the level of the sealing surface of the valve closure element.

The invention relates to an actuating means for a valve, in particular, a closure member for a waste gate of an exhaust gas turbocharger including a valve closure element with a sealing surface and a curved contact section via which the valve closure element is joined to a lever element.
DE 10 2006 022 482 A1 discloses an exhaust gas control valve for an exhaust gas turbocharger of an internal combustion engine, wherein the exhaust gas valve closure flap comprises a swivel arm and a valve closure head, which is pivotally arranged thereon and which may be brought into abutment against a bypass opening in a turbine housing of the exhaust gas turbocharger for closing the bypass opening, and may be lifted off therefrom for opening the bypass opening. The exhaust gas valve closure head may be swiveled by means of an actuating means, with the arrangement of the valve head at the swivel arm being such that the angle of the valve closure head relative to the bypass opening is adjustable. The contact area between the swivel arm and the valve head is formed by an outer surface and an inner surface of a spherical cap structure.
The known exhaust gas control valve suffers from high wear which increases the risk of failure of the exhaust gas control flap valve.
It is therefore the object of the present invention to provide an actuating means for a valve, that is specifically a valve closure head, in particular for a waste gate of an exhaust gas turbocharger, which has a high functional reliability.

Actuating means for a valve, in particular a wastegate, of an exhaust gas turbocharger


A polarizing beam splitter apparatus of a light valve image projection system includes a polarizing beam splitter commonly usable as a polarizer and an analyzer, and a quarter wave plate in combination. In the polarizing beam splitter apparatus, a quarter wave plate is arranged in a light path along which a light passes out from and passes back again to the polarizing beam splitter in such a manner that either a fast axis or a slow axis of the quarter wave plate is perpendicular to a plane containing both a first optical axis and a second optical axis of the polarizing beam splitter, so that the angular range of a light to be used can be increased. In the light valve image projection system, a light outputted from a light source is incident through a polarizing beam splitter apparatus to a light valve, and an effective component of the light reflected from the light valve is projected through the polarizing beam splitter apparatus and a projection lens on a projection screen. The polarizing beam splitter apparatus is high in polarization efficiency even if the range of incident angle of a light to be used is large, so that a projected image highly improved in contrast and brightness can be obtained.

1. Field of the Invention
This invention relates to a polarizing beam splitter apparatus commonly usable as a polarizer and an analyzer and a light valve image projection system using the same in which an optical image formed on a reflection light valve is irradiated by an illuminating light to be projected on a projection screen through a projection lens.
2. Description of the Prior Art
As a method to obtain a large projection screen image, projection display system using a liquid crystal panel as the light valve is well-known conventionally. In this system, an optical image corresponding to an image signal is formed on a liquid crystal panel and the optical image thus formed thereon is irradiated by an illuminating light and enlarged and projected on a projection screen by a projection lens. A projection display system in which a reflection liquid crystal panel is used for the light valve is disclosed in, for example, Japanese Pat. Appln. of Laid-Open No. 61-13885 and U.S. Pat. No. 4,464,018. The optical system of this projection display system consists of a light source for irradiating an approximately parallel light, a polarizing beam splitter to be commonly used as a polarizer and an analyzer, a reflection liquid crystal panel and a projection lens. A light outputted from the light source is separated by the polarizing beam splitter into an S polarized component to be reflected and a P polarized component to be passed straight. The S polarized light component thus obtained is incident to the liquid crystal panel and the reflection light therefrom is sent to the polarizing beam splitter again. The P polarized component contained in the reflection light passes straight through the polarizing beam splitter to enter into the projection lens. The reflection liquid crystal panel uses the birefringence of a liquid crystal and has a reflection electrode for reflecting light. The reflection liquid crystal panel is not substantially birefringent when a voltage is not applied to the liquid crystal layer, but when a voltage is applied thereto, birefringent characteristics are realized. If a linearly polarized light having a pre-determined polarization direction is directed into the liquid crystal panel, the polarization state of light reflected therefrom can be controlled by the voltage that is applied thereto. As such an optical image can be formed on the liquid crystal panel as the result of the change in birefringence and the optical image thus formed can be enlarged and projected on a projection screen by the projection lens.
In the reflection liquid crystal panel, a switching element can be arranged under the pixel electrode, so that a high density arrangement is made possible by reducing the pixel pitch without the need to make the switching element small, thus being advantageously capable of obtaining a projected image of a higher resolution on a projection screen than in the case of using a transmission liquid crystal panel.
With the light valve image projection system as such, however, if the angle between the light incident to the polarizing beam splitter and the incident optical axis is increased, a problem may arise in that the contrast of a projected image is reduced. Therefore, a xenon lamp, which has a small light radiator and is high in luminance, has been used in many cases. In this case, however, it has been pointed out that the xenon lamp is low in efficiency and short in service life. From the viewpoint of the efficiency and service life of a lamp to be used, the use of a metal halide lamp can be considered, but such is a larger light radiator as compared with the xenon lamp, so that the angle between the incident light to the polarizing beam splitter and the incident optical axis is increased, the result being that the brightness and the contrast of a projected image are difficult to coexist.

Polarizing beam splitter apparatus and light valve image projection system

Matsushita Electric Industrial Co., Ltd.


An imaging device is provided which may include a plurality of imaging lenses. Each imaging lens may be placed adjacent to a dispersive element. The imaging lenses and dispersive element(s) may be placed adjacent to a focal plane array to allow light from a light emitting event traveling through the imaging lenses to be simultaneously received by the focal plane array. One of the optical channels provides continuous broadband imagery without interfering with the operation of the dispersive optical channels. No moving parts are required in this small compact system, and no reconfiguration during operation is necessary to enable any of the functions, they are all simultaneous. Information related to the light received by the focal plane array may be transmitted to a processor for processing to determine whether the light emitting event is of interest and to determine an event type. Broadband imagery provided may be used for situational awareness, targeting, and surveillance.

The present invention relates generally to imaging devices, and more particularly to devices for detecting and identifying light emitting events.
Prior art imaging devices may comprise a rotating spectral separation element or subassembly installed in the collimated space of an imaging lens that is focused on a focal plane array and then may use spectro-tomographic image processing techniques to extract hyperspectral image data. Prior art imaging devices also may comprise a spectral separation element or subassembly placed in front of the imaging lens of a single channel imaging system comprised of an imaging lens focused on a focal plane array. The prior art imaging devices may receive light from a light-emitting event occurring within a scene. The emitted light travels through the spectral separation element or subassembly while the spectral separation element or subassembly is either in a fixed position or is rotating and is then received by the focal plane array. The focal plane array transmits information related to the received light to a processor. Thereafter, if the spectral separation element or subassembly is rotated to a second angular position, and the emitted light travels through the spectral separation element or subassembly and is received by the focal plane array, the focal plane array then transmits this information related to the received light to the processor and spectro-tomographic image proceesing is used to extract spatially organized spectral information. This process of spectral separation, reception and transmission is continued until the light-emitting event may be identified by the processor based on the transmitted information.
There are several shortcomings to the prior art. While the systems described are collecting this spectral information, they cannot collect broadband image information. Another problem is that in order to locate the source of a light-emitting event within the sensors' field of view in the case where the spectral separation element or subassembly rotates, the spectral separation element or subassembly must rotate enough to generate an arc in the light spectrum received by the focal plane array that is collected over several frames of the focal plane array in order to locate the position of the light-emitting event. This process takes-time-and requires that several frames of focal plane array imagery be processed. In order to perform this location function on short time events, the spectral separation element or subassembly must rotate at high rates, the focal plane array must operate at high frame rates that is transmitted to the processor at high rates that drives the required capability of the processor to a higher level. Another problem associated with the prior art imaging devices is that the prior art imaging devices must be stable for proper operation.
Accordingly, there is a need in the art for an improved imaging device.

Image detection and identification device


In a distributed computing environment utilizing Common Object Request Broker Architecture (CORBA), a software status display tool that provides a graphical representation of the current operational status of all of the data sources in a computer network. The display tool accesses the CORBA Name Server and obtains all available references for object implementations and their CORBA Interface Definition Language (IDL) interface. The references and interfaces map directly to all of the data suppliers and servers and their respective interfaces. The display tool then interfaces with each and every supplier and server as if it were a corresponding client or consumer and based upon the data it is able to obtain it makes a determination of the state of that particular supplier or server. The display tool then logs the results of its determinations and presents a fundamental color-coded system-wide display of its determinations on a video device.

(1) Field of the Invention
The present invention relates in general to computer networks, and more specifically to a method and apparatus that provides a display of the current operational status of all the data sources connected to a computer network.
(2) Description of the Prior Art
A common data processing system design utilizes a distributed computing environment where data is managed and disseminated over two or more interconnected computers. Such an interconnection of computers with the ability to communicate information between the computers is known as a computer network, or simply a network. Such networks may include a large number of components, including various types of computers and peripheral devices, which may be configured in a variety of ways and may be characterized as "Local Area Networks" (LANs) or "Wide Area Networks" (WANs) by the geographic area over which the components are distributed. LANs and WANs often employ several common configurations or architectures. For example, in a generic client/server configuration a certain number of the interconnected computers may function as clients while others may function as servers that provide services to the clients. Such a client/server configuration is a common example of the several available configurations of distributed computing environments (LANs and WANs) and is well known by those skilled in the art.
One manner of implementing software applications to run on a LAN or WAN is to use a vendor-independent network software architecture and infrastructure that various heterogeneous software applications can use to work together over the network. Such an implementation can be achieved using the "Common Object Request Broker Architecture" (CORBA) Specification. CORBA is a vendor independent specification for an architecture and infrastructure that promotes interoperability. It integrates computers from different vendors ranging in size from mainframes to desktops. CORBA provides a software bus that enables system applications to exchange and communicate information where such applications typically are distributed across a LAN or WAN. A CORBA based system relies on data abstraction to permit software applications running on the system to function unconstrained by the underlying network details, such as the types of workstations, the types of operating systems, and/or the programming languages of other application implementations. One of CORBA's most important, as well as most frequent uses is in network server applications that must handle a large number of clients, at high hit rates with high reliability. Applications utilizing CORBA are typically implemented and configured as either providers of data (servers and suppliers) or users of data (clients and consumers).
A large-scale distributed software system utilizing CORBA based architecture could have hundreds of servers/suppliers. In a large-scale system it may not be immediately obvious to a system manager whether all of the servers/suppliers are functioning properly or if a single server/supplier out of hundreds has failed. A number of software tools presently exist for gathering a variety of data from servers and/or clients in a distributed software system.
For example, U.S. Pat. No. 5,226,120 to Brown et al. for "Apparatus and Method of Monitoring the Status of a Local Area Network" (issued Jul. 6, 1993) teaches a monitoring and status displaying apparatus which determines the topology of a LAN by identifying and isolating each hub in the LAN and identifying the types of modules and the physical locations of the modules in the hub so that an image of the actual hub can be displayed on the video screen of the control console. The actual hub image shows the location and types of modules installed in the hub. However, this apparatus is oriented towards the managing and ascertaining of the specific physical layout of the hardware that composes the LAN. It does not monitor the processes running on the separate data terminal devices to determine if they are providing data appropriately nor does it display this information as status.
U.S. Pat. No. 5,675,798 to Chang for "System and Method for Selectively and Contemporaneously Monitoring Processes in a Multiprocessing Server" (issued Oct. 7, 1997) teaches a system for displaying the status of specific client applications running on a single multiprocessing server. The invention, by isolating and focusing on a specific client process, provides information of a granularity to identify processes which are hung up on semaphores, messages, queues or the like. The system employs a monitoring computer program running on the multiprocessing server which links control blocks to every process and displays information regarding the processes on a video display. Although this invention can provide a display of the status of a particular client process running on the server, it does not provide a system wide display of all servers and suppliers at once. There is no opportunity to obtain a complete system wide picture of which servers are operating and which are not. Also, this invention does not employ existing CORBA resources to achieve its results, but rather needs to employ additional performance monitoring code.
U.S. Pat. No. 5,939,999 to Ohgaki for "Polling Method and Apparatus for a Digital Processing System" (issued Aug. 17, 1999) teaches a digital processing system, such as transmission apparatus used in a digital communication system which employs a supervisory control unit and a plurality of controlled units each performing various processes. The supervisory control unit must perform a polling operation to each controlled unit to collect status information and determine whether any one of the controlled units is not mounted or has failed. Although the Ohgaki apparatus permits a considerable reduction of polling time over the prior art between the supervisory control unit and the plurality of controlled units, there is no display of such information to any type of graphical user interface.
U.S. Pat. No. 6,070,190 to Reps et al. for "Client-Based Application Availability and Response Monitoring and Reporting for Distributed Computing Environments" (issued May 30, 2000) teaches a method, system and program product for monitoring, from a client computer system, the performance of an application program residing on a server computer system connected to a LAN or WAN. A probe program residing at the client computer generates requests for the services of the application program and records transaction records based upon service responses from the server. The transaction records contain information such as whether a service response was made, the length of time to receive a response and other desired performance metrics. This information is stored in a database for statistical analysis and is also displayed on a graphical user interface. The goal is to monitor desired performance metrics of software applications running on servers from an end-user's vantage point. Although this invention can provide a display of the status of a particular process running on a server, it does not provide a system wide look at the status of all servers. Furthermore, it employs additional performance monitoring code in the form of a probe program incorporated into each client computer.
The above-described patents, while offering valuable information, do not by themselves provide the system manager of a large-scale distributed software system with a method and apparatus for easily and continuously ascertaining the system wide state of all of the servers/suppliers in real time. With such a method and apparatus, a system user might avoid a situation where he/she is unaware that a server or supplier is experiencing a loss of functionality until an undesired event occurs. System testers and maintenance personnel would also benefit from such a method and apparatus by quickly ascertaining the baseline status of the system and then quickly detecting and localizing a system problem to a particular server/supplier. In addition, it would be advantageous to provide such a method and apparatus without requiring additional performance monitoring code to be incorporated into each server/supplier application and without requiring a Simple Network Management Protocol (SNMP) agent to be running on all applicable hosts and an available system manager to oversee the system wide monitoring.
There is currently no method and apparatus which can provide a "quick look" status of all of the data sources of a data processing system utilizing CORBA architecture on a LAN which avoids incorporating performance monitoring code into each server/supplier application, avoids having an SNMP agent running on every host, enables a system operator or manager to determine the availability of system data, allows testers to determine the configuration of the system for a particular test and provides maintenance personnel a debugging capability to assist in troubleshooting of problems. What is needed is a status display tool for a multi-unit computer based network hosting a large-scale distributed software system.

The United States of America as represented by the Secretary of the Navy


A vacuum insulation material includes a pair of gas barrier exterior materials, a core material including a cellulose structure having porosity of greater than or equal to about 80% under reduced pressure of about 1 Pa, where the cellulose structure has a unit length of greater than or equal to about 1 μm and less than or equal to about 5 mm in the heat-insulation direction, and the method of manufacturing the same, and a gas adsorption agent, where the core material and the gas adsorption agent are interposed between the pair of gas barrier exterior materials and sealed inside of the pair of gas barrier exterior materials under reduced pressure.

1. Field
Exemplary embodiments of the invention relate to a vacuum insulation material. Particularly, exemplary embodiments relate to a vacuum insulation material having low thermal conductivity and in which a reduction of thermal conduction in an unfavorable direction effectively occurs during heat insulation thereof by pores in the heat-insulation direction.
2. Description of the Related Art
A vacuum insulation material is typically obtained by vacuum-packaging a core material or a gas adsorption agent in a gas barrier exterior material and suppresses thermal conduction by maintaining the inside thereof under vacuum. The vacuum insulation material has been used in an electrical product such as a freezer, a refrigerator, a warmer cabinet, a vending machine, a house wall material, or the like due to the low thermal conductivity thereof.
A glass fiber has been generally used as a core material in the conventional vacuum insulation material. The glass fiber may be scattered during the manufacture thereof or during manufacturing or dissembling of a vacuum insulation material including the glass fiber, and may adversely influence a human body, for example, through a worker's inhalation, skin irritation, or the like.
Accordingly, techniques using a thin plate-shaped cellulose structure as a core material of a vacuum insulation material have been developed in recent.


Implementations of the present disclosure involve a system and/or method for handling errors in a multi-node commercial computing system running a number of guest applications simultaneously. In particular, the system and/or method provides the ability to program on a per-error basis the destination within the system for an interrupt based on an I/O error, the ability to provision for multiple/redundant error reporting paths for a class of more severe errors and/or distributed set of error status and log registers to aid software in narrowing down the source of an error that triggered the interrupt. In addition, the system provides for dynamically altering the destination of the error handling in response to one or more operating conditions of the system. Such flexibility in the system provides for a more robust error handling without impacting the performance of the multi-node computing system.

Computers or other executing devices are ubiquitous in today's society. They come in all different varieties and can be found in places such as automobiles, laptops or home personal computers, banks, personal digital assistants, cell phones, as well as many businesses. One particular example of such an executing device is a multi-node, high-performance server used in a business for enterprise computing. Such servers allow for multiple Guest Operating Systems (GOSs) to share the hardware and processing power of the server to minimize the cost of executing multiple software applications such as online transaction processing, database operations, analytics and web hosting. However, because many GOSs may be operating simultaneously, errors occurring the system are typically plentiful and require quick and careful handling so that such errors do not impact the operation of all of the GOSs of the system.
In handling errors in the system, the server attempts to minimize any downtime and contain any bad data from infecting other components of the system, providing enough information such that the error can be diagnosed and isolated and limiting the effects of an error to a single GOS on other components of the system and/or other GOSs operating on the system. One approach to error handling within the server system is to dedicate a separate Service Processor for housekeeping, system initialization, environmental monitoring and error handling. The Service Processor is typically operates out-of-band communicating with the server over a low-speed path. Thus, in systems with many errors, the Service Processor may act as a bottleneck to the system as the lower-speed processor attempts to handle the errors and related interrupt sequence to address the errors. Similar bottlenecks can occur if the interrupts are handled by a specific dedicated node/core/thread.
It is with these and other issues in mind that various aspects of the present disclosure were developed.

Selecting I/O interrupt target for multi-core server systems