The LC combined transformer is a combination of capacitors, inductors and an electrically-isolated mutual inductor, i.e. conventional transformer; which in principle is a unity-coupled mutual capacitor or a cascade connection of an ideal transformer and unity-coupled mutual capacitor(s). To improve the imperfections of widely-used transformers, by employing the simplest passive-circuit design to attain a perfectly-functional match between mutual capacitors and the mutual inductor, this invention achieves optimal features of current or/and voltage transformation, and introduces a new function of waveform conversion from square to quasi-sine. The ideal current transformer herein is suitable for sinusoidal current measurements, the ideal voltage transformer herein suitable for sinusoidal voltage measurements, and they also could be upgraded to ideal transformers for both current and voltage transformations. This transformer can be designed as power transferable as well as waveform convertible, applicable in power systems or power electronics. Herein also states the design approach of integrated inductor and mutual inductor, and the use of push-pull inductor, materials being fully utilized and sizes decreased.

It is well known that, so far there has been only one species of ac electric transformer, i.e. the conventional voltage/current transformer, the prior art of this invention as well, being widely-used in electrical engineering. As a matter of fact, it is a mutual inductor, i.e. Tr in FIG. 1(a), with its coupling coefficient k less than but close to 1. In order to address this issue more clearly, for the time being, let's review its electric characteristic equations when neglecting power loss. If the port variables of a mutual inductor supposed as corresponding to those illustrated in FIG. 1(a), in electrical theory, its electrical characteristic equations in a sinusoidal steady-state circuit are presented as
                    {                                                                              V                  1                                =                                                      jω                                                                                L                      1                                                                                I                      1                                                        -                                      jω                                                                                M                                                                                I                      2                                                                                V                  2                                =                                                      jω                                                                                M                                                                                I                      1                                                        -                                      jω                                                                                L                      2                                                                                I                      2                                                                                (              1              )                                                                          (              2              )                                          where L1 and L2 respectively represent self-inductances of the primary winding and the secondary winding of the mutual inductor, M is the mutual inductance between them both; ω=2πf. And attention must be paid to its coupling coefficient k and turns ratio n, which are defined as
                    k        =                  M                                                    L                1                                                          L                2                                                                        (        3        )                                n        =                                            N              1                                      N              2                                =                                                    L                1                                            L                2                                                                        (        4        )            Obviously, the mutual inductor in FIG. 1(a) has an equivalent circuit schematically as in FIG. 1(b) [Note: FIG. 1(c) is also an equivalent circuit.], with its equations accordingly could be transformed as follows:
                    {                                                                                V                        a                                            =                                                                                V                            1                                                    -                                                                                jω                                                                                (                                                                  1                                  -                                  k                                                                )                                                                                L                              1                                                                                I                              1                                                                                =                                                                              jω                                                                                kL                              1                                                                                I                              1                                                                                -                                                                                jω                                                                                k                                                                                L                              1                                                                                L                              2                                                                                I                          2                                                                    =                                                                                L                            1                                                                                (                                                                                jω                                                                                k                                                                                L                                  1                                                                                I                                1                                                                                -                                                          jω                                                                                k                                                                                L                                  2                                                                                I                                2                                                                                )                                                                                V                    b                                    =                                                                                V                        2                                            +                                                                        jω                                                                                (                                                          1                              -                              k                                                        )                                                                                L                          2                                                                                I                          2                                                                                =                                                                  jω                                                                                k                                                                                L                              1                                                                                L                              2                                                                                I                          1                                                                    -                                                                                jω                                                                                kL                    2                                                                          I                    2                                                  =                                                                            L                      2                                                                                (                                                                  jω                                                                                k                                                                                L                            1                                                                                I                          1                                                                    -                                              jω                                                                                k                                                                                L                            2                                                                                I                          2                                                                                )                                                                                (              5              )                                                                                (                    6                    )                                                                                I          1                =                                                            V                a                                            jω                                                                                kL                  1                                                      +                                                                                L                    2                                                        L                    1                                                                                I                2                                              =                                                                      V                  a                                                  jω                                                                                kL                    1                                                              +                                                1                  n                                                                  I                  2                                                      =                                          I                0                            +                                                1                  n                                                                  I                  2                                                                                (        7        )            In FIG. 1(b), enclosed in the broken-line box is an ideal transformer that has the simplest voltage and current relationships between ports as Va/Vb=n, I1′/I2=N2/N1=1/n. Unfortunately for a practical transformer or mutual inductor, from FIG. 1(b) or equations above, it is easier understood that its voltage ratio is
                              V          1                          V          2                    ≠                        V          a                          V          b                      =                            N          1                          N          2                    =      n        ,and its current ratio is
            I      1        =                            I          0                +                              1            n                                          I            2                              ≠                        1          n                                  I          2                      ,            (                        I          0                ≠        0            )        .  This means that the conventional transformers, used either as a current transformer or as a voltage transformer or even as a power transformer, actually are all not precise in transformation of a current or of a voltage, as well as produce some inductive reactance capacity when transferring power since a conventional transformer or mutual inductor is both inductive and less-than-unity coupled, which is why errors exist in it inherently, due to the deficiency in its structure. Part of the errors originate from its leakage inductances (1−k)L1 and (1−k)L2 as well as magnetization inductance kL1, so as called reactance error, or more exactly inductive reactance error [Note: Reactive error not only worsens the transforming precision but also produces reactive current of the supply so as to cause more power loss and higher cost for transmission line materials]. In addition, there exist the power-dissipation error, or resistance error, from its copper loss and iron loss; as well as non-linearity error from its non-linear performance of cores. Therefore, to obtain its required precision, the conventional transformer had to resort to lots of methods for improvements while designed.
Furthermore, in a power system, due to the varieties and complexity of the network loads, there disperse great numbers of high-order harmonics in the supply network. The high-order harmonics not only contribute to energy wastes but also endanger the safety of facilities and loads, causing misoperations and mishaps, and seriously interfering with signal transmissions. The conventional transformer is powerless against those harmonics except for its insulations being threatened and cores overheated. It would have been a dream that, provided that only a few of passive components are added, it could come true that the conventional transformer will become one both transferring power from input to output and also functioning as harmonics isolation from in between, i.e. a function of waveform conversion from square-wave to quasi-sine being added. It was just a matter of regret, being long expected but not realized yet, in the past.

Methods and configurations of LC combined transformers and effective utilizations of cores therein


A building flooring system includes a plurality of polymer-based composite structural underlayment boards overlaying and secured to a building subfloor to form an underlayment layer over the building subfloor and a nonstructural finish-flooring layer overlaying and bonded to the underlayment layer. The polymer-based composite structural underlayment boards each have a polymer material core layer or a predominantly polymer material core layer that typically contains from 1% to 40% by weight filler(s) and a density between 1.6 lbs/ft3 and 25 lbs/ft3. At least the top or bottom major surface of each of the polymer-based composite structural underlayment boards is overlaid by a facer that reinforces and strengthens the polymer-based composite structural underlayment board and that is generally coextensive with and bonded to the overlaid major surface of the polymer-based composite structural underlayment board.

The subject invention relates to building flooring systems and in particular to a polymer-based composite structural underlayment board and an improved building flooring system that includes a plurality of the polymer-based composite structural underlayment boards overlaying and secured to a building subfloor to form an improved underlayment layer over the building subfloor and a nonstructural finish-flooring layer overlaying and bonded to the underlayment layer. As used in this specification and claims, a "nonstructural finish-flooring layer" is a flooring layer formed of: hard, rigid tiles (e.g. ceramic tiles); thin, flat or substantially flat manmade or natural hard rigid stone slabs (e.g. marble slabs and flagstones such as sandstone and shale slabs); linoleum; and resilient tiles (e.g. vinyl tiles).
In current building flooring systems, the nonstructural finish-flooring layers of the systems may be bonded directly to the upper surfaces of the building's subfloors, e.g. concrete subfloors. However, typically, current flooring systems include underlayment layers formed of plywood boards, hardboards, particleboards, gypsum boards, or fiber cement boards. The boards of these underlayment layers are secured to the upper surfaces of the building subfloors and the nonstructural finish-flooring layers are bonded directly to the upper surfaces of the underlayment layers. While these underlayment boards perform satisfactorily, the physical properties of these underlayment boards, such as but not limited to their weight, handleablity, cutablity, durability, flame spread rating, water absorption and/or fungus growth characteristics, etc. can present problems during the installation of the underlayment layer and over the anticipated service life of a flooring system. Accordingly, there has remained a need for an improved flooring system which utilizes an underlayment layer that is formed by underlayment boards that can be relatively light in weight, that are easy to handle, and that are easily cut at the job site to form the underlayment layer. There has also remained a need for an improved flooring system that includes an underlayment layer made of underlayment boards that are strong and durable, that absorb and retain very little moisture, that are fungus growth resistant, that are flame spread resistant, that have relatively good thermal and acoustical properties, and that have good bonding surfaces for bonding a nonstructural finish-flooring layer to an underlayment layer formed by the underlayment boards.

Polymer-based composite structural underlayment board and flooring system


Apparatus and methods for manufacturing and repairing fibre-reinforced composite materials are disclosed. In various embodiments, the apparatus and methods disclosed herein use a resin retaining/releasing device comprising resin having a viscosity that is temperature dependent for infusion into a region of a part. The resin retaining/releasing device may include a first sheet and an opposite second sheet at least partially enclosing the quantity of resin. The first sheet and the second sheet may be gas-permeable. The second sheet may be substantially resin-impermeable when the viscosity of the resin is above a threshold viscosity and resin-permeable when the viscosity of the resin is below the threshold viscosity.

Resin infusion processes such as resin transfer infusion (RTI), resin transfer molding (RTM), vacuum-assisted resin transfer molding (VARTM), vacuum-assisted resin infusion (VARI) and Seemann composites resin infusion molding process (SCRIMP) are known processes used for manufacturing composite parts comprising fibre-reinforced structures. Occasionally and depending on factors associated with such infusion processes, there can be dry fabric patches at the surface of fibre-reinforced parts that were not completely impregnated with resin during the process. A conventional procedure for repairing such dry fabric patches is to apply a cosmetic resin wipe. However, this repair procedure is mainly cosmetic (i.e. non-structural) in nature and can result in the presence of structural defects such as porosity in the repaired region of the part due to air being trapped in the repaired region during the procedure.
Improvement is therefore desirable.


Method for making seals, in particular for garments, in which there are supplied in series at intervals on an unbroken string alternately bodies and graft elements in seats in said bodies to constitute with the string between them a connected plurality of seals separable by cutting the unbroken string.. Said method is used advantageously to realize a separable unbroken series of seals each of which comprises a body and at least one complementary graft element insertable in a seat in the body and connected by a section of string. To achieve this an unbroken string comprises alternately bodies and graft elements formed on itself at regular intervals.. A specific form of embodiment calls for the alternate formation of a body and two graft elements turned in opposite directions so that each separate seal has a body connected by the string to two graft elements therein.

Seals (i.e. fasteners) are known, in particular for fixing labels or other to garments, made up of a flexible piece, e.g. a small cord, with clips which can be coupled inseparably at both ends.
Ordinarily said seals are stocked in bunches or bulk and this results easily in tangling of the flexible sections or hooking of the projections of the clips thereto which make the seals difficult to use because the seals must often be untangled in the parts with considerable slowing of the operations of affixing the seals in position.

Method for making seals, in particular for garments, and seal in accordance with said method


Methods and apparatus are disclosed for designing a Web service that processes one or more composite messages. The same techniques may be applied to the design of clients of the Web service. The Web service is comprised of service logic and compositional logic. The service logic is comprised of a plurality of message handlers that process micro-messages of one or more composite messages. The compositional logic is comprised of a plurality of protocol demultiplexers that implement Web service functionality for demultiplexing, sequencing, and multiplexing one or more composite messages. The compositional logic is separated from the service logic, such that the service logic does not include operations for demultiplexing, sequencing, or multiplexing the composite messages.

Web services are distributed computing applications that can be invoked across the Internet. Web services are generally designed so that they can interact with one another. Thus, a Web service should be interoperable in order to exchange messages with other Web services and clients over a network. Web services standards based on the eXtensible Markup Language (XML), for example, such as the Simple Object Access Protocol (SOAP) and the Web Services Description Language (WSDL), provide a high level of interoperability across platforms, programming languages and applications.
A Web service defines a communication protocol between the service and its clients for the exchange of messages. Mechanisms for flexible composition of Web services greatly simplify development of new services with integrated and value added functionality. A number of techniques have been developed for composing Web services. The Business Process Execution Language for Web Services (BPEL), for example, is one proposed description language that supports the composition of Web services. See, T. Andrews et al., Business Process Execution Language for Web Services, Version 1.1, 2003. BPEL can describe behavior of a Web service that combines operations of existing Web services (specified in WSDL) into an integrated and value added service.
As Web service interfaces and their choreographies grow in complexity, rapid and reliable development of interoperable services and clients becomes more and more of a challenge. For a composite Web service, a composite protocol can be created, based on the protocols defined by its sub-services and value added functionality. The inherent structure of the protocol between sub-services, the composite Web service, and its clients is key for structuring the specification of the composite Web service and for structuring the internal design of the composite Web service and its clients. Specification structure and internal design structure determine most important quality attributes of a Web services solution such as interoperability, maintainability, testability, and changeability.
A need therefore exists for a flexible composition mechanism that allows structuring a Web service protocol into self-contained micro-protocols. A further need exists for mechanisms to impose the inherent structure of a Web service protocol onto the structure of a Web service specification and onto the internal design structure of a Web service and its clients.

Method and apparatus for designing web services using a sequence and multiplex architectural pattern


A punch apparatus for punching holes through a paper stack. The apparatus has a rotationally attached lever handle. The lever handle has a handle end, a contact end, and a rotation axis between the handle end and the contact end. When a downward force is applied to the handle end, the lever handle rotates about the rotation axis. The contact end of the lever handle then exerts a force on a lever arm which in turn rotates a main shaft and attached pressure plate. As a result, the pressure plate exerts a punching force down on punch pins causing them to punch down through the paper stack.

Prior art paper punches typically use a direct force approach to punch holes in a stack of paper sheets. In these prior punches, the user presses down on a pivoting cover flap which forces the punch pins down and into the paper stack. This direct force approach has very little mechanical advantage. The force required to punch through the holes increases with the thickness of the paper stack. For thicker paper stacks, the required force to punch through the stack may exceed what the user can easily provide.
To address this problem, several punch manufacturers have proposed using a lever mechanism to reduce the required force by increasing the mechanical advantage. For example, U.S. Pat. No. 5,778,750 proposes the use of an elongated lever handle where one end of the handle is pivotally fixed to the punch and the other end is pressed down by the user. In turn, an intermediate surface (between the ends of the handle) is forced down on the cover flap to exert the punching force. In U.S. Pat. No. 6,109,155, a lever handle is pivotally attached to a rod extending up from the based and through the cover flap. As in the '750 patent, when the handle is pressed down by the user, an intermediate surface on the lever presses down on the cover flap to exert the punching force. Both of these patents disclose the use of a lever handle to increase the force applied to the cover flap by mechanical advantage. This effectively reduces the maximum force the user needs to apply to punch the paper stack.
The present invention offers a novel lever-handled paper punch which increases the mechanical advantage in a different manner than other proposed lever punches. The present punch reduces the maximum punch force and improves upon the disadvantages of prior art punches.


The present invention relates to novel tocopheryl oligosaccharides, acylated tocopheryl oligosaccharides, sulfated tocopheryl oligosaccharides, and antiviral agents including the sulfated tocopheryl oligosaccharides as active ingredients. In the tocopheryl oligosaccharide, the hydrogen atom of the hydroxy group at the 1-position in the terminal sugar moiety of an oligosaccharide which consists of 3.about.20 of identical or different repeating monosaccharide units selected from the group consisting of glucose, galactose, mannose, talose, idose, altrose, allose, glucose, xylose, arabinose, rhamnose, fucose, and fructose, which are glycoside-linked, is substituted by a tocopherol group. In the acylated tocopheryl oligosaccharides, each of any hydroxy group of the sugar moiety, other than the hydroxy group at the 1-position in the terminal sugar moiety of the oligosaccharide described above, is protected by an acyl group. The antiviral agents including the sulfated tocopheryl oligosaccharides or the biologically acceptable salt of the same as active ingredients have low toxicities and exhibit improved antiviral action, especially against the Human Immunodeficiency Virus.

A tocopheryl glycoside as a water-soluble Vitamin E has been reported in U.S. Pat. No. 4,457,918, but which describes neither the concrete compounds including the oligosaccharides having three or more sugar residues, nor the antiviral actions thereof.
Japanese Patent Application First Publication Nos. 60-56994 and 61-30594 describe one- or two-sugar linked tocopheryl glycoside derivatives. However, in these documents, there is no description of the compounds including the oligosaccharides having three or more sugar residues and the tocopheryl glycosides in which lactoses are linked to galactoses, nor are the possibilities for using the same as starting materials of the compounds exhibiting the antiviral actions disclosed.
With regard to sugar sulfates, heretofore, monosaccharide sulfates and polysaccharide sulfates have been known and there are numerous reports related to the sulfates, e.g., Advances in Carbohydrate Chemistry, 20, 183, and Advances in Carbohydrate Chemistry, 25, 407.
Recently, a number of reports have been published wherein the polysaccharide sulfates are useful as the medical agents for Acquired Immune Deficiency Syndrome (AIDS). The reports include, for example, Japanese Patent Application First Publication No. 62-215529, Hideki Nakashima, et al., Jpn. J. Cancer Res. (Gann) 78, 1164 (1987); Osamu Yoshida, et al., Biochemical Pharmacology, 37, 2887.about.2891 (1988); Japanese Patent Application First Publication No. 1-103601; among others.
However, these polysaccharide sulfates have several disadvantages: they have antigenic properties and a strong tendency to act as anticoagulants, and are difficult to administer due to their poor absorption In vivo because of the molecular weights thereof being in excess of 10,000.
In addition, since 3'-azido-3'-deoxythymidine (AZT) (which is a nucleic acid derivative, and which has come to be broadly employed as an anti-AIDS agent) exhibits strong side effects, development of a novel chemical agent having low toxicity is desired.

Sulfated tocopheryl oligosaccharides and antiviral agents including the same as active ingredients


The present invention provides methods for treating a disorder, and methods for inhibiting a stress-activated protein kinase (SAPK) in a cell in an individual, the methods generally involving administering to an individual in need thereof an effective amount of pirfenidone or a pirfenidone analog; comparing a post-treatment SAPK activity level in a biological sample from the individual with a pre-treatment SAPK activity level; and adjusting the dose of the pirfenidone or pirfenidone analog based on the results of the comparison step. The present invention provides methods for treating a disorder, and methods for inhibiting a SAPK in a cell in an individual, the methods generally involving administering to an individual in need thereof an effective amount of pirfenidone or a pirfenidone analog; comparing a second post-treatment SAPK activity level in a biological sample from the individual with a first post-treatment SAPK activity level; and adjusting the dose of the pirfenidone or pirfenidone analog based on the results of the comparison step.

The signal transduction pathways that use mitogen-activated protein (MAP) kinases have an important role in a variety of cellular responses, including growth, stress-induced gene expression, and compensation for alterations in the environment. The Stress-Activated Protein Kinase or SAPK group of MAPKs includes the c-Jun N-terminal Kinase (JNK) and p38. SAPKs are activated strongly in response to environmental stresses such as heat and osmotic shock, UV-irradiation, exposure to genotoxic agents and pro-inflammatory cytokines. In mammalian cells, the JNK and p38 signalling pathways are involved in the response of cells to stresses such as those induced by ischaemia and reperfusion injury, they play a role in the immune response and also in the regulation of apoptosis. The p38 group of MAPK include at least four members, designated p38 or p38α, p38β, p38γ, and p38δ. Several downstream substrates of p38 have been identified, including transcription factors, protein kinases, and enzymes. Studies have indicated that activation of the p38 pathway is involved in many pathologic changes that occur during inflammatory, immunologic, and cardiovascular diseases.
There is a need in the art for improved treatment methods for various disorders such that dosage levels are adjusted based on a patient's response. The present invention addresses this need.
Literature
U.S. Pat. No. 6,579,856; U.S. Pat. No. 5,962,478; U.S. Pat. No. 6,300,349.

Use of pirfenidone in therapeutic regimens


A fault-current-limiting circuit for a poly-phase circuit of the type including a plurality of inductive windings each of which has a first terminal connected to a common point and at least one of the windings having a second terminal connected to an electrical load is disclosed. The fault-current-limiting circuit has a first electrical path between the common point and ground which includes a current-limiting device having a first state whereat current passes through the device and a second state whereat current through the device is limited and wherein the device switches from the first state to the second state when current through the device exceeds a predetermined maximum and a second electrical path between the common point and ground having an electrical resistance significantly greater than a resistance of the first path when a device is in its first state.

In modern electric power generation and distribution systems, polyphase alternating current is typically generated and distributed. A number of AC sources producing equal voltages at the same frequencies, at fixed but different phase angles provide the power. In an n-phase system, n voltage sources are connected together. Each voltage source produces a sinusoidally varying voltage of a fixed magnitude. The phase angle associated with each generated voltage varies from the phase angle associated with the voltage from another source by 2.pi./n radians. Current generated by each source may be provided to a single phase load, or to one phase of a polyphase load such as a polyphase motor or transformer.
Conveniently, the n voltage sources may be interconnected to each other at a common point. Modern power distribution systems are typically three phased. In a three-phase system, voltage sources and sinks connected at a common point are said to be connected in a "wye-configuration" or "star configuration". Alternatively, in a three-phased circuit, the voltage sources or sinks may be connected in "delta configuration".
While it is possible to interconnect multiple sources in a poly-phase system in a number of ways, the wye-configuration is generally desirable in three-phase systems. Specifically, for safety and other reasons, it is desirable to electrically connect the polyphase system to ground. Wye-connected source, provide a logical connection point for ground, namely the common (neutral) point of the n voltage sources.
Loads connected to an n-phase system may be chosen such that the net sum of the currents drawn from all sources or "phases" at any time, equals zero. For example, if currents drawn from each voltage source in an n-phase system are equal in magnitude, and displaced in phase by 2.pi./n radians, the phasor sum of the currents drawn from all sources is zero. In the above described wye-configuration, if the net sum of all currents drawn from the phases is zero, the polyphase circuit is said to be "balanced". Of course, if in an otherwise balanced system the current drawn from any of the sources varies, the system will no longer be balanced. Modern poly phase generation and distribution systems are designed and maintained in order to maintain a near balanced system.
In operation, however, a polyphase system is rarely perfectly balanced. While the loads may be chosen to balance the system, the demands on each phase often vary unpredictably with time. Each load may be subject to overvoltage, produced by surges impressed on the distribution system by way of lightning, switching, or the like. Similarly, a load may be prone to operate in resonance, thereby producing an overvoltage. Additionally, harmonics of the base operating frequency of the voltage sources may be present in the system. These harmonics may, for example, result from loads having non-linear voltage/current relationships, such as certain filters or rectifiers. Certain harmonics, such as the third harmonic of three voltage sources delivering current at a fixed (fundamental) frequency and displaced in phase by 2.pi./3 radians, are no longer out of phase. For, example in a three-phase system, generated currents are 2.pi./3 radians out of phase; third harmonics of these currents will have phase differences of 3*2.pi.=2.pi.=0 radians. These harmonics are consequently zero phase harmonics; 6th, 9th, 12th and 15th harmonics will similarly be zero phase harmonics in a three phased system. As currents attributable to their harmonics are in phase, their phasor sum will not equal zero.
The difficulties associated with the overvoltage of loads and zero phase harmonics may be limited by directly grounding the common point of the wye-connected three phase circuit. Thus, in balanced operation, no current will flow from this common point to ground, as this common point remains at or near zero potential in view of the balanced loads. In the event of an overvoltage, the potential difference between this grounded common point and an affected load will be limited to the overvoltage of that load. No other phase of the n-phased load or single phase load will be affected by overvoltage in one of the loads.
On the other hand, in a situation where one of the loads suffers a fault, caused by, for example, machine failure, an excess amount of current is drawn by a single phase of the circuit. This excess current drawn may impact on the current provided to loads by the remaining phases in the circuit. If the common point of the circuit is connected to ground, much of the fault current will flow from or to this ground connection. Similarly, currents attributable to zero phase harmonics will similarly flow from or to this ground connection. However, if the common point of the circuit is directly grounded, as described above, the amount of fault current flowing from ground through the common point to the load is not limited.
One suggested compromise to grounding the common point of the polyphase circuit has been to connect this common point to ground through an electrical impedance. Thus in the event of failure, the current drawn through the common point will be limited by the impedance. The impedance may take the form of an inductive, reactive or resistive load. The insertion of such an impedance may however create other problems, as for example described in U.S. Pat. No. 1,378,577. If the impedance is reactive it may interfere with the proper functioning of electrical equipment connected to the transformer. If the impedance is purely resistive, resistive losses will occur any time the polyphase circuit in not perfectly balanced. As balancing of a polyphase circuit is typically imperfect, the use of a resistive connection between the common point and ground may be the source of significant losses over time.
The present invention attempts to overcome some of the disadvantages of known circuits used to limit fault current in a polyphase circuit.


An illuminating toothbrush for illuminating the inside of a users mouth while the user brushes her teeth and/or gums. The illuminating toothbrush comprises a conventional toothbrush having elongated handle portion and bristle head portion modified with a lighting element connected to an internal battery compartment and a manually actuated momentary switch. The lighting element is positioned on the handle portion to enable it to direct light towards the bristle head, configuring it to illuminate the mouth of a user when the bristle head is in the user's mouth. In operation, when the manual switch is depressed through the application of manual pressure, the lighting element illuminates and when the manual pressure is removed, the lighting element ceases to illuminate.

1. Field of the Invention
This invention relates generally to an oral hygiene apparatus and, more particularly, to a toothbrush having an integrated flashlight for illuminating inside the mouth.
2. Description of the Prior Art
The use of elongated oral hygiene apparatus, such as a toothbrush, to clean the teeth of gums of an individual is well known. A conventional toothbrush commonly consists of an elongated handle having a head portion defined by a plurality of tightly clustered bristles which are used to brush against ones teeth and gums. A problem which still exists, however, is that when using a conventional toothbrush to brush teeth, a lack of illumination inside the mouth often makes it difficult for the user to see inside their mouth while brushing. Thus, there remains a need for a toothbrush having an integrated lighting element that would enable a user to illuminate inside their mouth while brushing. It would be helpful if such an illuminating toothbrush included an onboard power source to provide electrical power the lighting element. It would be additionally desirable for such an illuminating toothbrush included a momentary actuating switch mounted thereon that enabled a user to selectively activate the lighting element while holding the toothbrush in a conventional manner with either hand.
The Applicant's invention described herein provides for an illuminating toothbrush adapted to allow a user to activate an integrated lighting element that improves visibility in their mouth. The primary components in Applicant's illuminating toothbrush are a toothbrush, a lighting element, an actuating switch, and a power source. When in operation, the illuminating toothbrush enables more effective and efficient cleaning of a teeth and gums by providing illumination in the mouth. As a result, many of the limitations imposed by prior art structures are removed.


In a laser printer using a plurality of laser scan units, a laser scan unit is capable of manually adjusting a plurality of laser beams to be parallel. The laser scan unit assembly includes a laser scan unit having a window on a front surface through which a laser beam is emitted, a hinge portion provided at one side of the laser scan unit to pivotably dispose the laser scan unit on the body, and an adjusting portion provided on the side of the laser scan unit opposite from the hinge portion, to adjust an amount the laser scan unit pivots. The body has a hinge supporting portion provided thereon to support rotation of the hinge portion. The hinge portion is formed as a hinge shaft and the hinge supporting portion is formed as a groove to support the hinge shaft. The adjusting portion includes a first adjusting unit which is an inclined surface, and a second adjusting unit which is a screw and is provided on the body.

1. Field of the Invention
The present invention relates to a laser printer forming an image by scanning a plurality of laser beams, and more particularly, to a laser scan unit assembly capable of adjusting the plurality of laser beams from a plurality of laser scan units to be parallel with each other when scanned onto a photosensitive body, and a laser printer having the same.
2. Description of the Related Art
Generally, a laser printer prints a predetermined image by forming the image on a photosensitive body using laser beams emitted from a laser scan unit, and then transferring the image onto paper. A particular type laser printer such as a color laser printer forms an electrostatic latent image on the photosensitive body by emitting a plurality of laser beams from a plurality of laser scan units. Since the plurality of laser scan units are disposed at predetermined intervals to be parallel with each other, the laser beams emitted from the laser scan units are formed on the photosensitive body at predetermined intervals in parallel and create an electrostatic latent image. The laser printer then develops the electrostatic latent image created on the photosensitive body with a developing agent and transfers the developed image onto paper.
In such a laser printer, laser beams emitted from the laser scan units may not be parallel to each other due to manufacturing tolerances of the parts or assembling error. If the plurality of laser beams are not parallel, each color may be mis-positioned, thereby impairing print quality.
In order to solve such a problem, conventionally, a laser scan unit assembly adjusts the plurality of laser beams by adjusting angles of the mirrors reflecting the laser beams. Since a mirror unit has a laser scan unit inside, a motor is provided to adjust the angle of the mirror. The laser beams are formed on the photosensitive body in parallel with each other by adjusting the angle of the mirrors with a control unit controlling the motor.
However, problems occur when adjusting mirrors using a motor. First, the interior temperature of the laser scan unit increases as the temperature of the motor increases when used for a long time, and therefore the life span of the laser scan unit is reduced. Second, manufacturing costs are increased because the motors and the motor control units are required. Finally, space to dispose the additional motor is required, thereby enlarging the size of the laser printer. Therefore, there has been a need for a laser scan unit assembly capable of adjusting a plurality of laser beams on a photosensitive body without having to use a motor.

Laser scanning unit assembly and laser printer having the same


The invention relates to a method for activating an automation station in the automation apparatus of an industrial application. The invention provides a method for activating an automation station in the automation apparatus of an industrial application, in which the automation station comprises a plurality of Profinet-compatible devices to which an unambiguous symbolic name is provided for identification, and wherein an identification of the automation station connected to the automation apparatus for operation is performed based on the symbolic names of the Profinet-compatible devices, and the Profinet-compatible devices are driven by the automation apparatus after connection of the automation station in functional dependence on the identified automation station.

In modern industrial applications such as automobile manufacturing or mechanical engineering, it is frequently necessary to be able to operate different tools on an apparatus in the plant, with field devices such as sensors or actuators that are necessary for tool functionality.
Profinet, which is well known to be the open Ethernet-based automation standard of the Profibus User Organization (PNO) and follows the Ethernet standard (according to the Institute of Electrical and Electronics Engineers (IEEE) 802.3) essentially 100%, is currently used generally for linking or integrating field devices in automation systems of industrial applications. Process and production data are available not only here on the field level, they can also be seamlessly integrated into multi-division data acquisition systems, thus enabling integration of the decentralized periphery in the vertical direction as well.
An essential difference between Profibus and Profinet lies in the different addressing of devices of the field devices connected in or to be connected into the respective network.
In contrast to the Profibus, the respective connected field devices inside a Profinet network are addressed by means of the specific and unambiguous Media Access control (MAC) address for each device, as well as the Internet Protocol (IP) address unambiguously assigned to this physical address.
Before the assignment of the physical and logical network addresses, however, each Profinet network component must be granted a symbolic name or Profinet device name for identification within the network for subsequent unambiguous addressing. The symbolic name or Profinet device name is set for the field device before the latter can be operated in a Profinet system. This granting is frequently referred to as "baptism."
In addition, these device names are made known in advance to a configuration unit that can be associated with the apparatus to which the field devices will be connected, and they are assigned a target configuration. This information from the configuration unit is subsequently transferred to a controller assigned to the apparatus for granting the IP addresses, as well as for parameterization and configuration of connected, identified field devices. If a field device is changed out, the "new" field device replacing the changed-out field device must be set up with the original Profinet name, i.e., the same name as that for the "old" field device being replaced.
Based on the Profinet standards, different automation stations for modern industrial applications, such as tools, together with integrated field devices necessary for the implementation of automation functionalities on an automation apparatus, such as a robot or a production machine, are activated according to prior art, essentially as described below with reference to FIG. 2, a highly simplified schematic sketch of automation stations according to prior art to be operated at an automation apparatus.
FIG. 2 shows an exemplary automation apparatus 100 operating according to the Profinet standard to which a configuration unit 600 is assigned. Three tools 200, 300 and 400 are to be connected to the automation apparatus 100 as automation stations in the operation.
First, the tools 200, 300 and 400 are coupled to the apparatus 100 in the operation. In the coupling process of tools 200, 300 and 400, they are supplied with power 1 in a first step via the supply units 107 arranged at the automation apparatus 100 and via the supply units 217, 317 and 417 arranged at the tools. Then a controller 101 recognizes the connected tool by way of special input information that has a special coding depending on the tool. The connected tool can be recognized via plug connectors, but also in a non-contact manner, e.g., via Radio Frequency Identification (RFID) techniques. In each case it is necessary to provide a special coding unit, labeled 218, 318 and 418 in FIG. 2, on the tool side and, on the automation apparatus 100 side, an interface unit 108, to which the coding information is transferred in a subsequent step 2. The automation apparatus 100 further comprises a field device 102 that is connected to the controller 101 and reads out the transferred coding information 3 and transfers it to the controller.
In addition, a number of Profinet-compatible field devices 501 and 502, 503 or 504-507 are installed on the tools 200, 300 and 400, wherein different numbers and types are possible and are generally required depending on the tool. The field devices 501 and 502, 503 and 504-507 are also supplied with power via the supply voltage of tools 200, 300 and 400, which is not shown in detail in FIG. 2 for the sake of comprehensibility. Then a connection 4 to these field devices is produced via a communications terminal 109 arranged on the automation apparatus 100 and via communications terminals 219, 319 and 419 arranged on the tools 200, 300 and 400, respectively. Each device is labeled unambiguously by its device name, as described above. The field devices 501-507 of all tools must thus have an unambiguous device name, referred to in the present example as "A," "B," "C," "D," "E," "F" and "G," which is permanently stored on the devices.
These device names "A," "B," "C," "D," "E," "F" and "G" are also planned and stored in advance in the configuration unit 600, and are made known to the controller 101 by configuration unit 600 for activation.
The controller 101 identifies the individual field devices 501-507, and then carries out the automation tasks necessary for activation, depending on the respective connected tool. For this purpose, it uses the information on the connected tool and on the field devices installed on the tools.
Essential disadvantages of the above-described prior art are based on the necessary tool coding.
The coding of tools for identification or recognition typically entails high cost, first because special interfaces 108 are necessary on the side of the automation apparatus 100 and an additional field device 102 is necessary for evaluating the coding. Moreover, the respective coding units can become contaminated or be destroyed in continuous operation, which may cause downtime.


Method, apparatus, and computer program product example embodiments provide wireless position determination. According to an example embodiment, a method comprises generating in a mobile wireless device, grid nodes representing one or more floor areas in an enclosed space, based on a map of the enclosed space; estimating locations along a path of motion of a user of the mobile wireless device traversing the one or more floor areas, based on motion observations made by a motion sensor in the mobile wireless device and map information; generating a radiomap of the one or more floor areas by making radio measurements with the mobile wireless device, at the estimated locations along the path of motion, mapping the measurements to the generated grid nodes that are closest to the estimated locations; and compiling a fingerprint data structure of the radiomap, including observation elements representing the radio measurements at the mapped grid nodes.

Modern society has adopted, and is becoming reliant upon, wireless communication devices for various purposes, such as connecting users of the wireless communication devices with other users. Wireless communication devices can vary from battery powered handheld devices to stationary household and/or commercial devices utilizing an electrical network as a power source. Due to rapid development of the wireless communication devices, a number of areas capable of enabling entirely new types of communication applications have emerged.
Cellular networks facilitate communication over large geographic areas. These network technologies have commonly been divided by generations, starting in the late 1970s to early 1980s with first generation (1G) analog cellular telephones that provided baseline voice communications, to modern digital cellular telephones. GSM is an example of a widely employed 2G digital cellular network communicating in the 900 MHZ/1.8 GHZ bands in Europe and at 850 MHz and 1.9 GHZ in the United States. While long-range communication networks, like GSM, are a well-accepted means for transmitting and receiving data, due to cost, traffic and legislative concerns, these networks may not be appropriate for all data applications.
Short-range communication technologies provide communication solutions that avoid some of the problems seen in large cellular networks. Bluetooth™ is an example of a short-range wireless technology quickly gaining acceptance in the marketplace. In addition to Bluetooth™ other popular short-range communication technologies include Bluetooth™ Low Energy, IEEE 802.11 wireless local area network (WLAN), Wireless USB (WUSB), Ultra Wide-band (UWB), ZigBee (IEEE 802.15.4, IEEE 802.15.4a), and ultra-high frequency radio frequency identification (UHF RFID) technologies. All of these wireless communication technologies have features and advantages that make them appropriate for various applications.
At least one communication-related application currently being offered in various forms is electronic positioning. Basic electronic positioning may provide the current location of a device in terms of coordinates, in relation to a visual map. However, the means by which the raw positioning information is obtained may vary. Offerings may include the incorporation of Global Positioning System (GPS) receivers in a device for obtaining the electronic positioning information from satellites. Further, long range wireless communication systems, such as cellular telephony, may also provide electronic positioning information through methods such as cell-based triangulation. Short-range wireless systems may be able to provide similar information through a determination of proximity of a device to a particular wireless access point.

Method, apparatus, and computer program product for distributed indoor three-dimensional radiomap


The present invention provides a hand-held massage assembly that is modular and allows a user the option of using a roller mechanized massager with or without a handle. In accordance with an embodiment of the present invention, the hand-held massage assembly includes a roller mechanized massager having an electro-mechanical connection. A handle is connectable to the electro-mechanical connection on the roller mechanized massager by a first electro-mechanical connection at one end thereof. The handle also has a second electro-mechanical connection at an opposite end. The first electro-mechanical connection and second electro-mechanical connection of the handle are electrically coupled to each other. A power cord having an electro-mechanical connection is coupled to the second electro-mechanical connection on the handle. All of the electro-mechanical connections are designed such that the handle may be removed from the assembly and the electro-mechanical connection of the power cord may be coupled directed to the electro-mechanical connection of the roller mechanized massager.

The present invention generally relates to a massage device. More particularly, the present invention relates to a hand-held massage device with a removable handle.
Massaging devices for stimulating the skin, muscles and blood circulation are well known. In general, hand-held massage devices are difficult to use on oneself and require the use of a second party in order for a user to avoid having to twist and contort their body in order to reach relatively inaccessible portions of a user's back. Handles on conventional devices have been used to reduce the amount of twisting and contortion necessary for a user to reach those hard-to-get spots, but the handle of the massage device can be obtrusive and make it difficult for a user to manipulate the massage device when the user desires to reach a relatively easy-to-reach spot, such as the user's shoulders or to use conveniently with the hand hold without the requirement of the handle as an obstruction to the therapy. Therefore existing hand-held massagers can be much less effective if they require the presence of a second party to reach the hard-to-get spots on the user's back and if the handle of the device makes it difficult for the user, on their own, to manipulate the device so the user can massage a portion of their body such as their shoulders.
A number of devices have been created for the purpose of providing a massage. For example, U.S. Pat. No. 4,757,806, discloses a portable massage unit. However, the massage unit is bulky and its reach limited as the massage applicator is connected to a relatively large power unit by a relatively short cord. In another example, U.S. Pat. No. 4,846,158, discloses a hand-held massage device having a vibrating head spring mounted on a handle. However, the hand-held device requires the use of a fixed handle and a power cord both of which are permanently attached to the massage device. U.S. Pat. No. 4,149,530, discloses a hand held electric massager that includes a spherical vibrating portion and a handle portion permanently attached thereto. The handle portion contains a rechargeable battery connectable to a recharging unit. As with the other devices, the handle is permanently attached to the spherical vibrating portion of this invention.
Accordingly, there is a need for a hand-held massage device that is modular. There is also a need for a hand-held massage device that allows a user the ability to reach hard-to-get spots while allowing the user to also more easily manipulate the device when massaging their shoulders or arms. There is a further need for a hand-held massage device which allows a user the option of using the device with or without a handle. The present invention satisfies these needs and provides other related advantages.

Hand held massage device with removable handle


A superconductive composite member, which has a core composed of an oxide ceramic material which is surrounded by an envelope, has an increased core density in order to achieve a higher critical current density. The increased core density is obtained during a hot-shaping step of the core material in the envelope, wherein the composite is heated to a temperature wherein the superconductor material is present in either a molten or a partially molten state.

The present invention is directed to a method for manufacturing a superconductive composite member by introducing an oxide ceramic superconductive material into an envelope to form an initial composite member, shaping the initial composite member by reducing its cross section to the shape of the final composite member with thermal treatment for recovery and for setting the oxygen concentration. The invention is also directed to a corresponding superconductive composite member.
Superconductive composite members wherein an oxide ceramic superconductive powder is surrounded by an envelope material are known. Examples are disclosed in an article by H. Krauth and A. Szulczyk in METALL, Vol. 43, 1989, pages 418ff. The composite members, such as wires or bands that are also superconductive above the temperature of liquid nitrogen, are manufactured by employing oxide ceramic high-temperature superconductors (HTSC). The materials suitable for this purpose are known per se. Included among them, for example, are phases in the systems of YBaCuO, BiSrCaCuO and TlBaCaCuO.
For manufacturing technical conductors, oxide ceramic powder is filled, for example, into a metal tube and a wire or band is then manufactured by shaping to reduce the cross section of the metal tube or envelope to the desire shape. Subsequently, a thermal treatment is implemented that serves the purpose of producing the continuous, superconductive connection through the HTSC material and the purpose of optimizing the critical current density.
The envelope is usually composed of silver or of silver alloys, because these materials will guarantee the oxygen permeation through the envelope material during the final thermal treatment for setting the optimum oxygen content.
In order to achieve a higher filling density in the manufacture of the composite members, the powder may be pressed into rods or pellets and then filled into the tube or a melt can be filled into the envelope tube. With reference to the theoretical density for the HTSC material, a filling density of approximately 55% is achieved by utilizing powders. Filling densities of approximately 70% are achieved by employing the powder pressed into rods or pellets and a filling density of up to 100% is obtained by filling with a melt. After the shaping of the filled tubes to form the finished composite wire by a drawing or a combination of drawing and rolling steps, the core density of the oxide ceramic superconductive material typically amounts to 65% through 75% of the theoretical density. In the final annealing for setting the superconductive properties, large pores in the core of the HTSC material will occur and will result in a greatly reduced critical current density form, due to the partial melting of the core connected therewith. These pores are, thus, undesirable and should be largely avoided.

Method of manufacturing an oxide ceramic superconductor having a high core density


An optical element is formed from a molded body which is formed using an impact consolidation phenomenon in which mechanical impact is applied to ultra fine fragile particles which are supplied onto a substrate so that the ultra fine fragile particles are pulverized and bonded to each other. In the optical element, d6/λ4<4×10−5 nm2 holds, in which d (nm) represents the average radius of a part of the molded body, such as a pore (void) or a different phase, having a refractive index different from that of a primary component of the molded body, and in which λ (nm) represents the wavelength of light transmitting through the molded body.

1. Field of the Invention
The present invention relates to optical elements used for optical communication, optical wiring, or optical storage, optical integrated devices each formed by integrating the optical elements, optical information transmission systems, and manufacturing methods thereof.
2. Description of the Related Art
Optical communication and optical storage devices have been widely used in recent years. Therefore optical elements have been increasingly in demand. In particular, following the practical use of wavelength multiplexing of optical communication, the use of optical elements for metro and access networks have been increased instead of so-called backbone network systems which are primarily formed using optical fibers. Therefore, as optical elements used in add-drop multiplexers for optical signals, instead of elements formed in combination of bulk materials, use has been increasingly made of planar waveguides which are reduced in size and made of thin optical material films and can be easily integrated with various elements.
The planar waveguide is generally formed of a quartz or silicon substrate and an amorphous material such as silicon oxide provided thereon. As a method for forming a thin film, for example, use is made of a flame deposition method in which a thin film is formed by depositing a material using flame treatment or a vapor-phase growth method such as CVD. The thin film obtained is formed into a predetermined shape by a reactive ion etching method or the like, so that an optical element is obtained.
In order to effectively control light including modulation and switching of optical signal, it is necessary to use a physical effect which is obtained through the interaction between an exterior input signal such as electricity or heat and a material forming an optical element. As a silicon-based planar waveguide, for example, an optical switch using a thermooptic effect and comprising a directional coupler provided with a heater, and a switch formed in combination with MEMS have been known. Unfortunately, both types of switches have slow response, in the microsecond range. An optical switch using a thermooptic effect consumes a large amount of electric power, and an MEMS type switch has a complicated structure and is expensive.
Because of its high speed of response, low power consumption due to voltage drive system, and a simple structure, an electrooptic effect in which the refractive index is changed by the interaction between an electric field and a material has been used for an optical modulator. In order to form an optical modulator using LiNbO3, a Mach-Zehnder waveguide is formed on a single crystal LiNbO3 substrate by the use of a Ti diffusion method and is combined with electrodes. When a voltage is applied to the electrodes, the refractive index of the waveguide can be changed, and as a result, ON/OFF operation of an optical signal can be performed. However, since it is required to use a single crystal substrate, the modulator described above is expensive. Further, since the length of the waveguide must be increased due to a small electrooptic effect of LiNbO3, the size of the element is extremely and problematically increased to several centimeters.
Pb1−xLax(ZryTil-y)1−x/4O3 (PLZT) as a transparent ceramic has a larger electrooptic coefficient by approximately two orders of magnitude than that of a LiNbO3 single crystal and has recently been used to form an optical modulator. Therefore, the size of an optical element may be decreased, and consequently, reduction in cost, lower power consumption, and higher speed of response can be expected. Accordingly, investigation of sol-gel processes for forming thinner films of PLZT have been carried out (see K. D. Preston and G. H. Haertling, Appl. Phys. Lett. 60 (1992), p. 2831, and K. Nashimoto, K. Haga, M. Watanabe, S. Nakamura and E. Osakabe, Appl. Phys. Left. 75 (1999), p. 1054).
However, in order to form a thin film having a high transmittance and a high electrooptic effect, epitaxial growth must be performed, and a single crystal substrate must also be used as an underlying material. Accordingly, waveguides other than silicon-based waveguides are not easily formed on a substrate. In addition, a film-forming process in accordance with a sol-gel method must be performed for a long time in order to obtain a film having the thickness required for an optical element. Therefore, the cost is disadvantageously increased.
Electrooptic materials such as LiNbO3 and PLZT are ferroelectric materials. This property appears when the particular crystal structures of the individual materials are formed. Therefore, when an electrooptic material is used for an optical element, it has been believed that a single crystal substrate thereof must be used or that an electrooptic material must be epitaxially grown on a single crystal substrate.
Hereinafter, the formation of nanophotonic devices which can realize the integration between light and electronics on one chip will be further desired as a significant innovative technique. In order to realize the devices described above, a technique in which an LSI such as a central processing unit (CPU) or a memory and an active optical element such as an optical switch are formed on the same chip must be developed. In addition, a technique in which an electrooptic material such as PLZT is deposited with high crystallinity on a silicon or a quartz substrate must also be developed.
On the other hand, as a novel ceramic film-forming method an aerosol deposition (AD method) has been developed. The AD method is a film-forming method based on an impact consolidation phenomenon and utilizes the phenomenon of collision and coalescence of ultra fine particles. Compared to a related thin film-forming method, the AD method is expected to realize higher film-forming rates and low process temperatures (see Jun Akedo and Maxim Lebedev, "MATERIA"41, (2002), P. 459 and Jun Akedo and Maxim Lebedev, Jpn. J. Appl. Phys. 38, (1999), P. 5397). Moreover, in the AD method, the properties of a film are independent of any underlayer, and therefore, a material for the substrate can be optionally selected.
A technique disclosed in Japanese Unexamined Patent Application Publication No. 2001-3180 is a film-forming technique in accordance with the AD method and is characterized in that ultra fine fragile particles provided on a substrate are pulverized by applying mechanical impact so that the ultra fine fragile particles are bonded to each other or that the ultra fine fragile particles are bonded to each other and are bonded to the substrate. As a result, the bonding between the ultra fine particles is realized, and without applying heat, a film having a high density and a high strength can be formed.
A technique disclosed in Japanese Unexamined Patent Application Publication No. 2002-235181 relates to the structure formed in accordance with the AD method and is characterized in that the structure is a polycrystal material in which no crystal orientations exist and in which grain boundaries made of glass layers are not substantially present. In addition, this structure is characterized in that the average crystal particle diameter is 50 nm or less and in that the compactness is 99% or more. The average crystal particle diameter disclosed in Japanese Unexamined Patent Application Publication No. 2002-235181 is the size of the crystal particle calculated in accordance with the Scherrer method of X-ray diffraction analysis.
A technique disclosed in Japanese Unexamined Patent Application Publication No. 2002-20878 is a film-forming technique in accordance with the AD method in which ultra fine particles are sprayed onto a substrate surface and is characterized in that at least part of this spray flow is obliquely incident on the substrate surface. As a consequence, a film can be formed in which the ultra fine particles therein are sufficiently bonded to each other, the texture is dense, the surface is smooth, and the density is uniform.
A technique disclosed in Japanese Unexamined Patent Application Publication No. 2001-38274 is a technique for forming a planarized film composed of ultra fine particles in accordance with the AD method and is characterized in that the film formation is carried out by performing at least one planarizing step for planarizing the surface of a film formed by deposition.
As described above, the development of techniques for piezoelectric materials and the like in accordance with the AD method has significantly advanced. However, the application of the AD method to optical elements has not been studied and, with respect to PZT and PLZT thin films, the transparency thereof have only been reported as of today. The transparency of the film obtained by the AD method is 30 dB/mm or more in terms of the transmission loss, and therefore, it is impossible to apply this film for optical elements.

Optical element, optical integrated device, optical information transmission system, and manufacturing methods thereof

National Institute of Advanced Industrial Science and Technology


A wireless quality collecting device receives quality information on a wireless area from a terminal device that is located in the wireless area. For each region belonging to a predetermined range, the wireless quality collecting device counts the number of pieces of the received quality information. For a region in which the total number of pieces of the counted quality information is equal to or greater than a predetermined number, from among pieces of the quality information belonging to the region, the wireless quality collecting device selects the predetermined number of pieces of the quality information and stores the selected quality information in a storing unit.

Multiple companies construct mobile phone systems and provide various services. The state of wireless areas formed by both wireless base stations and terminal devices vary due to the time or locations. Consequently, the communication state in the wireless areas are improved by measuring the wireless quality in each of the wireless areas.
In general, a high-cost drive test is used for this measurement. In recent years, the Minimization of Drive Test (MDT) technology is used as a method of reducing the cost. The MDT technology measures the wireless quality in a wireless area by using a terminal device owned by a user in this area and automatically reports the measurement result to an operator. The pieces of quality information collected from terminal devices in this way are registered in databases in the companies that provide the mobile phone systems and are used to develop the quality.
Furthermore, there is a known technology, as a technology for changing the collecting period of the wireless quality, that changes a collecting period depending on the accuracy of location information on a terminal device that corrects the quality information. Furthermore, there is a known technology that changes a collecting period in accordance with the time intervals for which a terminal device collects information or in accordance with the state of a battery in the terminal device.
Patent Document 1: Japanese Laid-open Patent Publication No. 2012-029053
Patent Document 2: Japanese Laid-open Patent Publication No. 2012-085235
Patent Document 3: Japanese Laid-open Patent Publication No. 2011-223118
However, with the technologies described above, if, for example, a wireless area collected by a person has occurred, quality information is excessively collected and thus the size of a storage device that stores therein the quality information collected from the terminal device becomes enlarged. Consequently, there is a problem in that the capital investment in improving the wireless quality is excessively increased.

Wireless quality collecting device, wireless quality collecting method, and computer-readable recording medium


Systems and methods of integration of resistive memory elements with logic elements in advanced nodes with improved mechanical stability and reduced parasitic capacitance include a resistive memory element and a logic element formed in a common integration layer extending between a bottom cap layer and a top cap layer. At least a first intermetal dielectric (IMD) layer of high-K value is formed in the common integration layer and surrounding at least the resistive memory element, to provide high rigidity and mechanical stability. A second IMD layer of low-K value to reduce parasitic capacitance of the logic element is formed in either the common integration layer, a top layer above the top cap layer or an intermediate layer in between the top and bottom cap layers. Air gaps may be formed in one or more IMD layers to further reduce capacitance.

Magnetoresistive random access memory (MRAM) is a non-volatile memory technology that uses magnetic elements. MRAM is gaining popularity as the next-generation memory technology for numerous semiconductor device applications which require low cost and high speed. Several types of MRAM are well known in the art, and MRAM operation can be briefly explained using the example of a commonly used variety of MRAM, a Spin Transfer Torque MRAM (STT-MRAM). A STT-MRAM uses electrons that become spin-polarized as the electrons pass through a thin film (spin filter).
FIG. 1 illustrates a conventional STT-MRAM bit cell 100. The STT-MRAM bit cell 100 includes magnetic tunnel junction (MTJ) storage element 105 (also referred to as "MTJ stack" or simply, "MTJ"), transistor 101, bit line 102 and word line 103. MTJ 105 is formed, for example, from pinned layer 124 and free layer 120, each of which can hold a magnetic moment or polarization, separated by insulating tunneling barrier layer 122. There may be an anti-ferromagnetic (AFM) layer and a cap layer (not shown) in MTJ 105. The AFM layer is used to pin the magnetic moment of the pinned layer. The cap layer is used as a buffer layer between the MTJ and metal interconnects. The polarization of the free layer can be reversed by applying current in a specific direction such that the polarity of the pinned layer and the free layer are either substantially aligned or opposite. The resistance of the electrical path through the MTJ varies depending on the alignment of the polarizations of the pinned and free layers. This variation in resistance can be used to program and read STT-MRAM bit cell 100, as is known. STT-MRAM bit cell 100 also includes circuit elements, source line 104, sense amplifier 108, read/write circuitry 106 and bit line reference 107. Those skilled in the art will appreciate the operation and construction of STT-MRAM bit cell 100 as known in the art.
As seen from the above example, the fabrication of a conventional STT-MRAM bit cell involves integration of the various above-described components on a circuit board or semiconductor package. More specifically, memory or storage elements (e.g., MTJ 105) may be integrated with various other circuit elements (generally referred to herein, as, "logic elements") such as, passive components, metal wires, vias, transistors, logic gates, etc. In general, such integration requires process compatibility between the memory elements and the logic elements. Several challenges arise in this area, particularly as device technology continues to advance towards smaller and smaller device sizes.
For example, during the fabrication of MRAM devices such as STT-MRAM bit cell 100, it is important to ensure that capacitance (C) of various components and resistance (R) of various components and connections are maintained at low values. This is important for reducing cross coupling and RC delay values.
However, dielectric material, conventionally referred to as interlayer dielectric (ILD) material or inter-metal dielectric (IMD) material, used for integrating dense metal levels or metal layers required at advanced device nodes, may require using low-K or extreme low-K (ELK) dielectric materials with a view to lowering parasitic capacitance. Lowering the dielectric constant is conventionally accomplished by inserting light weight elements to reduce the silicon-oxide bond density, which is in turn conventionally associated with degraded mechanical stability.
Several additional Chemical mechanical polishing (CMP) process steps are used in conventional manufacture of MRAM devices. These additional CMP steps before the fabrication of Cu interconnect structures require a high level of mechanical stability, which may not be compatible with the use of low-K or ELK dielectric materials. The conventional approaches do not effectively balance the conflicting effects of the K-value of dielectric materials on parasitic capacitance and mechanical stability. Further, such low-K dielectric materials may require high-temperatures (e.g., 400 C.) for ultraviolet (UV) curing, which may cause degradation of the MRAM devices such as MTJ 100.
Moreover, integrating MRAM devices in advanced logic nodes (e.g., 28 nm and below) with logic processes such as complementary metal oxide semiconductor (CMOS) back end of line (BEOL) processes, introduces additional challenges. Vias are conventionally used for connecting elements between different layers of interconnections. The separation between adjacent layers, which relates to a vertical height of the vias may be different from that of the MRAM elements such as MTJ 100. The maximum via height may be limited by aspect ratio specifications whereas the minimum MTJ height may be limited by CMP tolerances. Thus, there may be mismatches between the via heights and MTJ heights which may frustrate integration of these elements on a common device.
Accordingly, there is a need in the art for avoiding the aforementioned conventional approaches for integration of MRAM devices.

MRAM integration with low-K inter-metal dielectric for reduced parasitic capacitance


An electrical circuit including components which cooperate with each other, in which a component of the electrical circuit which is waiting for an action to be carried out by another component, is notified by an acknowledgement signal shortly before the implementation of the action that implementation of the action is imminent. The electrical circuit optionally includes a clock generator containing a master clock generator, a clock control unit and several clock signal producing units. The master clock generator produces a master clock signal which is supplied to all of the clock signal producing units. The clock control unit produces several release signals that are respectively supplied to each clock signal producing unit. Each clock signal producing unit passes part of the master clock signal in response to the received release signal, and transfers the passed signal as a clock signal to at least one component of the electrical circuit.

In electrical circuits such as these, the components which cooperate with one another frequently do not have the same performance, and in particular they do not operate at the same speed.
One electrical circuit in which this is frequently the case is, by way of example but as is known by no means exclusively, a programmable unit such as a microcontroller.
FIG. 1 shows the fundamental design of a microcontroller. The illustrated microcontroller contains a core C, memory devices S1 to Sn which are connected to the core C via a first bus BUS1, and periphery units P1 to Pn which are connected to the core C via a second bus BUS2.
The memory devices S1 to Sn are, for example, a RAM, a ROM, a flash memory, etc.
The periphery units are, for example, an A/D converter a DMA controller, a coding device, a CAN controller, etc.
The core C    reads commands and operands which are stored in the memory devices S1 to Sn or in an external memory device which is provided outside the microcontroller, and carries out these commands and operands,    and in the process cooperates in a predetermined manner with the memory devices S1 to Sn and with the periphery units P1 to Pn.
Microcontrollers are clock-controlled devices, with the speed at which the microcontroller operates (for example how quickly it carries out the program to be carried out by it) depending inter alia on the frequency of the clock signal that is used.
The higher the clock signal frequency, the faster the microcontroller operates.
On the other hand, however, high clock signal frequencies lead to a high power consumption and to the disadvantages associated with this such as severe heating, as well as the production of electromagnetic radiation, etc.
In order to keep these disadvantages within bounds, efforts are being made to ensure that the various components of the microcontroller each run only as fast as is necessary for correct operation of the microcontroller. This is generally achieved by producing a number of clock signals at different frequencies in the microcontroller, and by supplying these different clock signals to the various components. This makes it possible, for example, to supply the core C with a very high-frequency clock signal, and to supply specific periphery units, such as a D/A converter, with a clock signal at a lower clock frequency, for example with a clock signal at half the clock frequency.
However, the fact that certain components of the microcontroller are supplied with a clock signal at a lower frequency influences not only the relevant components themselves but can also influence components which are supplied with a clock signal at a high frequency. This is the case, for example, when a component which operates at a high clock frequency, that is to say by way of example the core C, wishes to transmit data to a component which is operating at a lower clock frequency, for example to the D/A converter. In this case, the core C must produce the data to be transmitted for a longer time at its outputs than would be the case if the receiver of the data were a component which was operating at the same clock frequency as the core C. This is due to the fact that the clock edges by means of which the D/A converter can accept data occur at comparatively long time intervals, and because the core C must furthermore continue to provide the data to be transferred until the D/A converter has acknowledged correct reception of the data, in which case the acknowledgement process also takes a certain amount of time owing to the necessity to synchronize the core and the D/A converter by means of flipflops or the like which are arranged between them. The core C can thus be blocked for a greater or lesser time as a result of which, overall, it operates more slowly than would be possible on the basis of its clock frequency.
At least some of the problems which have been mentioned can be overcome by operating the components alternately using clock signals at different frequencies. However, the production of clock signals at different frequencies and passing these clock signals to the components that use them are associated with a high degree of complexity, and are likewise also associated with considerable disadvantages.

Electrical circuit having cooperating components


In an image forming apparatus that transfers images formed on plural photosensitive drums onto a belt in a superimposing manner to produce a multi-color image, a positional deviation in a main scanning direction, which is generated while transferring the images formed, is detected. An eccentricity phase of each of the photosensitive drums is calculated based on the positional deviation detected, and a rotational phase of the photosensitive drums is controlled based on the eccentricity phase calculated.

1) Field of the Invention
The present invention relates to compensating for a color shift that occurs at a time of image transfer, in an image forming apparatus, such as a plain paper reproducing machine, a plain paper facsimile machine, a page printer, and the like, that produces multi-color images.
2) Description of the Related Art
In an image forming apparatus of a so-called tandem type, a multi-color image is produced by transferring images formed on a plurality of photosensitive drums in a superimposing manner. In such image forming apparatus, dynamic transfer color shift is caused due to factors such as angular speed fluctuation of a photosensitive drum occurring at a gear or a joint, speed fluctuation of a transfer belt, eccentricity of the photosensitive drum, and speed unevenness between belt positions occurring due to stretching of the transfer belt, which cause positional deviations among transfer patterns corresponding to the respective photosensitive drums, and these positional deviations finally appear as a color shift.
Of the above causes, the eccentricity of the photosensitive drum generates a positional deviation corresponding to one rotation of the drum. However, Japanese Patent Application Laid-Open No. H9-146329 discloses a countermeasure where phases of eccentricities of a plurality of photosensitive drums are properly adjusted so that, even if positional deviation occurs in respective photosensitive drums, color shift among the photosensitive drums is prevented from occurring.
As a method for detecting eccentricity of a photosensitive drum, Japanese Patent Application Laid-Open No. 2001-339972 discloses a technology that uses a displacement gauge of a contact type and one of a non-contact type. However, the gauge of the contact type is not reliable, and the gauge of the non-contact type (an optical system) has a complicated configuration.
Japanese Patent Application Laid-Open No. H9-146329 discloses that when eccentricities of respective photosensitive drums are adjusted, a method of detecting the eccentricities is important. Patterns for detecting positional deviation, each being constituted of a toner image, that are formed on a transfer belt (an endless belt), are sequentially sampled by optical sensors, to detect positional deviation data in a sub-scanning direction, and information about the eccentricities.
However, since the positional deviation data in the sub-scanning direction obtained by sampling basically includes a plurality of positional deviations caused by the transfer color shifts, it contains rather complicated waveforms. Therefore, it is very difficult to separate or extract information about a cyclic positional deviation corresponding to one rotation of the photosensitive drum from the positional deviation information, and the separated information is not very accurate.
The positional deviation corresponding to a cycle of one rotation of the photosensitive drum appears as synthesis of a positional deviation due to eccentricity of the photosensitive drum itself, and a positional deviation due to an angular speed fluctuation of a shaft of the photosensitive drum. Moreover, a phase thereof is different from a phase due to the eccentricity of the photosensitive drum itself. Therefore, even if the phase of the cyclic positional deviation corresponding to one rotation of the drum is detected, the phase of the drum eccentricity cannot be obtained.
The eccentricity of the photosensitive drum causes a positional deviation in a sub-scanning direction and a positional deviation in a main scanning direction, and it is preferable to reduce both the deviations. The details of a generating mechanism of the deviations is explained later, but the deviations occur due to fluctuation of the writing position due to the eccentricity of the photosensitive drum, because a writing beam is obliquely incident on a surface of the photoconductor.
Even if the phase of the positional deviation in the sub-scanning direction is not grasped, it is possible to correct the positional deviation in the sub-scanning direction by synthesizing the deviation with the positional deviation due to the angular speed fluctuation in the same cycle. However, the positional deviation in the main scanning direction cannot be corrected unless a phase thereof is grasped.
The main scanning direction herein is the same direction as image writing direction of writing an image to the photosensitive drum, and is parallel to a direction in which a rotational shaft of the photosensitive drum extends. The sub-scanning direction is perpendicular to the main scanning direction on an image plane, and corresponds to a conveying direction of a transfer belt. These definitions are applied in the following explanation.

Image forming apparatus and image forming method with detecting a positional deviation in a main scanning direction


A rotor assembly for a permanent magnet motor includes a rotor stack of laminated ferromagnetic layers and partial end plates at opposite axial ends of the rotor stack wherein each axial end of the rotor bears two partial end plates, each of which covers a partial circle and does not axially overlap with the other one of the partial end plates at the same axial end. The two partial end plates of each axial end are formed by a first axial end plate shaped as a first partial ring disc and a second partial end plate shaped as a second partial ring disc that are made of stamped metal and that are of different mass.

The rotors of compressors with rigid rotors, i.e. rotors operated at a rotational speed well below their specific natural frequency, are generally provided counterweights for balancing the moving parts of a compressor mechanism. This is a measure to reduce vibrations and stress caused by unbalance. The counterweights may be attached to the rotor itself or to the shaft driven by the rotor. One example for the use of a brushless permanent magnet motor with a rotor balanced with counterweights is a scroll compressor in an HVAC system of an electric or hybrid vehicle.
The rotor of a brushless motor may be composed of a stack of ferromagnetic sheets alternating with insulating layers. Permanent magnets may be inserted in slots formed in the stack. Typically, the stack is held together by non-ferrous end plates secured by fastening pins that extend through the end plates and the stack from end to end in an axial direction. The unbalance of a compressor mechanism depends on the overall geometry of the rotor assembly including all parts rotating with the shaft, for example, an orbiting scroll.
While counterweights are thus necessary for balancing the moving parts of a compressor mechanism, they also occupy valuable packaging space, especially in automotive vehicles where packaging space is very limited.


A side-view type light emitting device includes a package body, first and second lead frames, a light emitting diode chip, a resin covering portion, and at least one spacer portion. The package body has a first surface provided as a mounting surface, a second surface located opposite to the first surface, side surfaces located between the first surface and the second surface, and a concave portion formed at one of the side surfaces corresponding to the light emitting surface.

1. Field of the Invention
The present invention relates to a side-view type light emitting device, and more particularly, to a side-view type light emitting device having a structure capable of providing uniform light irradiation on a test target such as a light guide panel (LGP) and an optical device including the side-view type light emitting device.
2. Description of the Related Art
In general, a light emitting diode (LED) is provided as a light emitting device that has a package body with a lead frame connected to an electrode. The light emitting diode is widely used in various application fields, in combination with a variety of light receiving devices such as a backlight unit of a liquid crystal display, a light guide panel of a surface emitting display, and an optical sensor.
Specifically, a side-view type light emitting device (a kind of light emitting device) is widely used as a light source for a backlight unit of a liquid crystal display.
The backlight unit must maintain the light uniformity throughout the entire panel in spite of the trend toward the wide area thereof. However, because an LED light source used as a light source for the backlight unit is a point light source, it has a limitation in the light uniformity in comparison with a conventional CCFL that is a line light source. Also, because the number of LEDs mounted on a circuit board increases with an increase in the BLU area, the positional accuracy of the mounted LEDs must also be secured. However, the tolerance of a reflow soldering process, which is generally used as a mounting process, causes a variation in the position of the LED on an FPCB. Also, a distance change of the light guide panel and the backlight unit and the LED may occur in alignment with the backlight unit.
A method of mounting a light emitting device closely on a light input surface of a light guide panel is used to prevent the above problems. However, when the light guide panel is expanded by the heat generated during the operation of an LED, the distance between the LED and the light guide panel changes or they are closely adhered to each other, thus making it difficult to provide uniform light irradiation.

Side-view type light emitting device and optical device including the same