A method for automated re-layout of two-dimensional drawings from a solid model, wherein the solid model can be revised to incorporate design changes, for example. The re-layout process is invoked to automatically generate revised two-dimensional drawings which exactly duplicate an original set of two-dimensional drawings, except that geometry modified in the solid model will be automatically modified in the re-layout drawings. Dimensional data from the original set of drawings associated with unchanged geometry will be automatically associated with and added to the re-layout drawings. The invention permits the solid model to remain the master throughout the design process, while reliably carrying through design changes to the two-dimensional drawings. The user is not required to manually re-enter unchanged dimensional data from one drawing to the next revision.

The present invention is an improvement in the field of computer-aided design, and more particularly, an advancement in the solid modeling arts.
The use of a three-dimensional (3D) representation of an object (commonly referred to as a solid) can be an advantage to the part designer using a Computer Aided Design (CAD) system. Solid modeling is a computer representational method of describing objects in three-dimension (3D) space. There are various techniques known in the art in which this may be implemented. Solid models are commonly constructed either with primitive or boundary definition, which permit modeling the solid nature of the object, though the models often appear on the output device in a similar manner as wire frame representations. The modeler program has an understanding of what geometry coordinates would be formed "inside" and "outside" the modeled body. The solid model is manipulated by a solid model software package.
Two-dimensional (2D) representations of objects are projections of object features onto a viewing plane, typically embodied in 2D drawings. In addition to geometric elements, the 2D drawings may also contain text, dimensions and other supporting information, i.e., annotations. The two dimensional representation can typically be manipulated by a two dimensional software package.
Some CAD systems are designed such that the 2D portion is linked to the 3D portion, and changes in the solid (3D portion) cause appropriate changes in the 2D drawing. Such systems are described as associative. The particular feature of an associative system that pertains to this invention is the built-in ability to update the 2D drawing and dimensions when a change is made in the solid. This capability is due to the associativity between the dimensions, the solid, and the 2d representation. A limitation of prior associative system is the too-specific coupling to the solid, which prevents a more general usage, such as redimensioning between different solids or to the creation and dimensioning of multi-facetted cross sections. Associative systems usually rely on parametric methods to manage their many positive attributes. Parametric, in this case, refers to the fact that each feature of the body must be described in terms of some other feature or features at the time of its creation. For example, the location of a hole being placed in a block must be completely specified (perhaps by giving its distance from two edges). Though helpful in many ways, including updating the drawing to the model changes, parametric requirements can be a problem at times. It can be a disadvantage to be required to always enter the parameters for each feature as it is created since the relationships of the new feature to the existing ones may not yet be known. If it is necessary to change the reference items (e.g., pick two other edges as references), the user must usually create a new hole and then delete (or inactivate) the old hole. Thus, this can be a tiresome requirement.
There exist some solid modeling implementations which are strictly solid modelers. They provide no functionality in depicting dimensions, text, or other supporting annotation in conjunction with the solid model. With rare exception, this type of annotation is a necessary accompaniment with the geometry. One technique to remedy this problem is to provide an interface between the solid modeler and a 2D documentation package. The 2D documentation package typically contains a group of tools to both annotate a 2D drawing and to quantify different aspects of the planar projections used to depict an object that is, frequently, intended for manufacture. These tools could include a dimensioning package that allows the placement of dimensions, with various tolerance descriptions, on the drawing; a text generating package to allow the placement of Title, Drawing Identification Numbers, note or any other verbiage on the drawing; a symbol generating package to take care of the need of producing drawings using the industry standard symbols, for example, those used in Geometric Dimensioning; and a minimum set of geometry creation tools to allow the generation of whatever lines, arcs, arrows, etc. that would be needed to complete the documentation by adding partitioning, underlining, indicating sectioning planes or any of many needs, and the 2D drawing capabilities needed to produce the 2 D drawings being documented.
The interface between the solid modeler and the 2D documentation package generates the feature projections onto a plane. The planar features are passed to the 2D documentation package which supports dimensioning, text, and other annotation features. The process of passing the 3D model features into the 2D documentation package will be referred to herein as "laying out" the solid model or the "layout process." In other words, the layout process refers to the process of projecting the solid model onto a plane. The solid model may be oriented in different locations relative to the plane on which the projection is made. This creates different views of the solid model. Some common views are front, side, top, bottom, left, right, and isometric.
An implementation of a strict solid model, documentation package, and layout mechanism is Hewlett Packard's Mechanical Engineering Series 30 (hereinafter the "ME 30" or "HP ME 30"). The sequence of use is typically to create a solid model, generate a 2D representation using the layout mechanism, and add dimension, text, and other supporting annotation to the 2D representation. The 2D representation, which may include annotation, will hereinafter be called a "drawing."
The ME 30 system, through the layout mechanism, provides a one-way, one-time association from the solid model to the 2d documentation package. A solid model system is typically used to model objects prior to their construction. The solid model is frequently changed as the design evolves from initial conception to final form. Any change to the solid model will once again require the invocation of the layout process if the geometry in the 2D world is to be an accurate representation of the solid model. Each invocation of the layout process generates a new 2D representation of the solid model. A problem occurs because there is no method of transferring the annotations from the previous 2D drawing to the new 2D drawing. This means that the new layout must be dimensioned and annotated once again, which may be a very time consuming task.
For anything but extreme feature changes to the part, redimensioning is considered unacceptable in the typical design process. Therefore, in the typical conventional design process, the part is layed out once and then dimensioned. From this point on, the solid model and the 2D drawing become autonomous entities. Changes can be made to the model and these may (or may not be) manually depicted in the 2D drawing. This conventional process is generally depicted in the operational flow diagram of FIG. 1. Thus, the 3D model is initially created (step 1), and the first layout drawing is created (step 2) and the dimensions added (step 3). Now assume the design process involves some changes to the product under design. The 3D model is modified (step 4). Without re-invoking the layout process, the designer modifies the geometry and adds dimensions to the layout drawing (step 5). The modified 3D model and the layout drawing have now become autonomous entities. As this process is repeated (steps 6 and 7), the solid model and 2D drawing may diverge even further. Now there is no assurance that the modified 2D drawing correctly reflects the solid model.
The design process illustrated in FIG. 1 presents several problems. First, since there is no assurance that the modified drawing correctly represents the solid model, two definitions of the object geometry exists. There is a high probability that a Computer Aided Machine (CAM) using the solid model as the geometry definition will produce a different object from a CAM using the drawing as a geometry definition. Hence, there are two geometry definitions - the solid model and the drawing. Since different objects may result, considerable time and money may be wasted if objects are built to the wrong specification, caused by confusion as to what is the master geometric definition.
Second, often users will abandon the solid model after its initial creation. They will then only modify the drawing. The whole purpose of design is to implement functionality through the interacting forms of different objects. The solid modeling process enables the user to model the objects and their interaction with each other. To abandon this ability later in the design process defeats the purpose of this tool. Frequently a solid model, later in the design process, may be useful. However, if they have been abandoned, it may be too time consuming to bring the models up the current geometric definition.
Third, the user often does not model all of the geometric detail of the object because they know that they will abandon the solid shortly down the design process. Again this defeats the purpose of solid modeling which is to mimic the object for analysis with other objects before it is even built.
It is therefore an object of the invention to provide an interface between a solid model and a 2D documentation package which automates a re-layout process, whereby geometry changes in the solid model can be automatically incorporated into a revised set of layout drawings.
A further object of the invention is to provide such an interface which automatically transfers valid dimensional annotations from one layout drawing to the next version or re-layout of that drawing.

Automated re-layout with dimensional associativity


An image sensor includes a pixel array having a plurality of layers and a control unit. Each of the plurality of layers including pixels having a photoelectric conversion element and a transmission transistor therein. The photoelectric conversion element is configured to collect charges during an associated charge collection time period and the transmission transistor is configured to transmit the charges to a respective floating diffusion node at an end of the charge collection time period. The control unit configured to individually instruct the transmission transistors associated with different ones of the layers to transmit the charges to the respective floating diffusion nodes such that the charge collection time periods associated with the photoelectric conversion elements implemented in at least two of the layers differs in length.

Example embodiments relate to an image sensor, a method of operating the image sensor, and a system including the image sensor.
Image sensors convert an optical image into an electric signal. Recently, with developments in the computer industry and the communication industry, a demand for upgraded image sensors is increasing in various fields such as digital cameras, camcorders, personal communication systems (PCSs), game consoles, security cameras, medical micro-cameras, and robots. With the increase in the demand for such image sensors, a multi-layer image sensor including multiple layers is being developed as a next generation image sensor in order to obtain more pixel information, for example, more color information.

Image sensor, method of operating the same, and system including the image sensor


A method for explosive cutting using converging shockwaves, and an explosive cutting device are disclosed. The method includes providing a projectile with an explosive charge, positioning the projectile over the object so it extends along an intended line of cut, and detonating the explosive charge so that the projectile is accelerated toward the object, wherein the projectile either impacts on the object and the projectile includes a wave-shaping element which is shaped such that the impact generates converging shockwaves in the underlying object to be cut causing a crack to be propagated through the object along the intended line of cut; or impacts on a wave-shaping element in contact with the object, the wave-shaping element being shaped such that the impact generates converging shockwaves in the underlying object causing a crack to be propagated through the object along the intended line of cut.

Explosives are convenient sources of energy which can be suddenly released in order to perform work on various targets. Accordingly explosives have been applied for the breaking or cutting of solid materials, such as metal. This may serve purposes of demolition, separation of components of an integral structure or destruction of or damage to a target. In particular at sites which are difficult to access, or which are considered dangerous, the application of explosives may provide an outcome. Several methods of explosive cutting are known in the art.
A known method of explosive cutting is by means of shaped charges such as linear cutting charges. A linear cutting charge generally comprises a length of metal which is, e.g. substantially semi-circular of V-shaped in cross-section and an explosive which extends the length of the metal and which must be capable of sustaining detonation with a high velocity of propagation. The length of metal is arranged with its hollow side directed towards and spaced from the target metal to be cut, whilst the explosive extends centrally of and in contact with the opposite side of the length of metal. With a semicircular section length of metal the explosive, when detonated, acts on the length of metal to evert the length of metal and project a part of it as a high velocity metal jet at the target, the target thus being severed if the charge is sufficiently powerful. In the case of a V-section length of metal, the pressure exerted by the explosive, when detonated, serves to drive the two limbs of the V-section length of metal towards one another at high velocity so that they collide. As a result of the collision of the said two limbs a small part of each of the limbs is stripped off and is projected at the target as an extremely fast-moving blade-like jet which is capable of producing a very deep and narrow cut in a metal target for a given amount of explosive. Explosive cutting using shaped charges has disadvantages in that the application of a metal jet has low energy efficiency (a relatively high amount of explosive is required per cutting length), and that the jet may cause side damages if the jet shoots through the object to be cut after penetration.
A further known method of explosive cutting applies a shockwave refraction tape (SRT) in contact with the material to be cut [WO-A-86/07000]. The SRT consists of a wave-shaping element covered by a layer of explosive. The wave-shaping element generally looks like an isosceles triangle with a large base containing a nick. When the explosive is detonated, a pair of converging shockwaves at an angle to each other set off into the target object to be cut. The converging shockwaves collide in the material to be cut, which creates an enormous pressure. This pressure wave in the target is followed by a huge tensile stress wave when the two release waves (that follow the shock waves) interact. This creates a fracture in the material plane in which the shock and release waves interact [New Scientist 1986, 110(1504), 28]. In order to generate sufficiently powerful shockwaves, this method requires the use of so-called high explosives that have a detonation velocity of above 7 km/s. Transportation and storage of such high explosives is, however, bounded to severe safety rules and therefore impractical and very costly. In addition, the use of highly explosive materials is normally accompanied with the application of government permits.
It would be desirable to provide an alternative method of explosive cutting which allows at least partly overcoming drawbacks faced in the prior art.

NEDERLANDSE ORGANISATIE VOOR TOEGEPAST-NATUURWETENSCHAPPELUK ONDERZOEK TNO


A polymeric coating can be applied to an overhead conductor. The overhead conductor includes one or more conductive wires, and the polymeric coating layer surrounds the one or more conductive wires. The overhead conductor can operate at a lower temperature than a bare overhead conductor with no polymeric coating layer when tested in accordance with ANSI C119.4 method. Methods of applying a polymeric coating layer to an overhead conductor are also described herein.

As the demand for electricity grows, there is an increased need for higher capacity electricity transmission and distribution lines. The amount of power a transmission line can deliver is dependent on the current-carrying capacity (ampacity) of the line. Such ampacity is limited, however, by the maximum safe operating temperature of the bare conductor that carries the current. Exceeding this temperature can result in damage to the conductor or other components of the transmission line. However, the electrical resistance of the conductor increases as the conductor rises in temperature or power load. A transmission line with a coating that reduces the operating temperature of a conductor would allow for a transmission line with lowered electrical resistance, increased ampacity, and the capacity to deliver larger quantities of power to consumers. Therefore, there is a need for a polymeric coating layer that has a low absorptivity in order to limit the amount of heat absorbed from solar radiation, a high thermal conductivity and emissivity in order to increase the amount of heat emitted away from the conductor, a high thermal resistance and heat aging resistance to boost life span and survival at high conductor temperatures, and which can be produced in a continuous and solvent-free process.


A method for managing the security of a client device in a mobile device management system (MDMS) comprises receiving a security policy at a client device, applying the security policy on the client device, determining an occurrence of a security policy event, determining a violation based on the occurrence of the security policy event and applying different security controls based on predefined elapsed times on the client device.

1. Technical Field
The present invention relates generally to security management of a mobile device and, more particularly, to an enterprise-wide, time-dependent security management system for mobile devices based on security policies.
2. Related Art
When it comes to using mobile devices (e.g., smart phones, cell phones, laptop computers, notebook computers, Tablet PCs, Personal Digital Assistants (PDAs), and the like) as repositories and/or stewards of sensitive personal information (e.g., bank account details, Social Security numbers, credit card numbers, debit card numbers, etc.) and business information (e.g., access to business e-mail messages, confidential enterprise data, etc.), the number one concern for most users is theft or loss of the mobile device. For example, because cell phones are utilized much more often than one's wallet, one's cell phone is typically easier to lose than one's wallet.
A drawback of existing protection schemes is the requirement that a security application is used only when the event (i.e., theft, loss, etc.) occurs which limits the convenience of the mobile device. For example, when a mobile device is lost, the user may need to change information related to the mobile device (e.g., by entering a valid password) immediately or a security breach may occur. Enterprises/companies may be greatly affected with the loss of a mobile device. A new approach to an enterprise-level mobile device security management system is needed. Heretofore, several unsuccessful attempts have been made to address these shortcomings.
United States Patent Application US20060199598 describes a method that includes wirelessly receiving a text string at a mobile phone and parsing the text string to obtain security configuration data of the mobile phone and determining whether a code in the security configuration data matches a corresponding code in the mobile phone.
United States Patent Application US20070143824 describes a system and method for enforcing security parameters that collects information from a source relating to a mobile device and, based on the collected information, an identity status for the mobile device is determined that uniquely identifies the mobile device and distinguishes it from other mobile devices.
United States Patent Application US20070232265 describes a system and a method of security management of a wireless mobile device capable of reducing damage caused by a security attack and a malicious code in the wireless mobile device by appropriately interoperating with a network switching center (NSC).
U.S. Pat. No. 7,665,125 describes a wireless security system that includes a client module deployed on a wireless device, a network module, and a server module in which the client module is adapted to authenticate authorized wireless devices independent of the network module and the server module.
Therefore, what is needed is a solution that addresses at least one of the deficiencies of the current art.

Mobile device security management system


A method of killing yeast or fungi which comprises treating the yeast or fungi with a toxic amount of dihydrocarvone.

(1) Field of the Invention
During the study of limonene as a hand cleaner, the applicants found that fully oxygenated limonene is a fungicide. A reveiw of the literature revealed that oxygenated limonene contains several oxidation products including: limonene-1,2-oxide, limonene-8,9-oxide, 1-menthene-9-al, .alpha.-2,8-p-menthadiene-1-ol, .beta.-2,8p-menthadiene-1-ol, dihydrocarvone, .beta.-cymenol, carvone, cis-carveol, and trans-carveol, as :;as outlined by Bain in U.S. Pat. Nos 2,863,882 and 3,014,047. Blumann listed the compounds formed by the auto-oxidation of limonene in Chemical Abstracts, Volume 63, 1965, on page 1819, which included cis-carveol, trans-carveol, trans-p-menth-8-ene-1,2-diol, limonene 1,2-epoxide, limonene 8,9-epoxide, cis and trans-p-mentha-2,8-dien-1-01, and perillyl alcohol. Even though it was unexpected, the applicants found that effecitve concentrations of dihydrocarvone kills yeast and fungicidal concentrations of dihydrocarvone kills fungi.
Dihydrocarvone is a monocyclic monoterpene with the following chemical formula: ##STR1##
Dihydrocarvone is an oil with a terpenic aroma. It is insoluble in water and glycerine. Dihydrocarvone is soluble in alcohol and is miscible in corn oil, olive oil, and soybean oil, etc. Dihydrocarvone has been used as a bactericide, but heretofore, it has never been demonstrated to kill yeast or fungi.
Bain in U.S. Pat. No. 2,803,647 showed his method of producing carveol and dihydrocarvone and their esters.
(2) Description of the Prior Art
Zukerman studied the effect of auto-oxidized limonene on bacteria. He found it was weakly bacteriostatic, was unstable, and that it lost its bacteriostatic effect on keeping as was discussed in Nature 168: 517 (1951). He never studied oxidized limonene nor dihydrocarvone for fungicidal activity. Kurita investigated the fungicidal activity of several components of essential oils in Biol. Chem., 45(4), 945-952, 1981, and noted that cineole, anethole, safrole, d-limonene, .alpha.-pinene, .beta.-pinene, camphene, .beta.-myrcene, caryophyllene, .beta.-cymene, d-camphor, benzaldehyde, vanillin, and furfural are not fungicidal while cinnamaldehyde, phenol, perillyl aldehyde, citral, perillyl alcohol, geraniol, citronellol, 1-nonanol, 1-decanol 1-menthol and borneol have minimal to good fungicidal activity. He never studied the anti-yeast or anti-fungal activity of dihydrocarvone. Peter Tetenyi et al studied essential oils obtained from twelve different specimens of Tanacetum vulgare L. and found eight of the twelve specimens to be bactericidal in a concentration of 100 ug/ml against 85-90% of nineteen different bacteria and 100% fungicidal against sixteen species of fungi in a concentration of 50 ug/ml. He delineated numerous chemical components in the oils but he never studied dihydrocarvone or any of the individual components in the oils for anti-bacterial, anti-yeast and/or anti-fungal activity as was outlined in Herba Hungarica, 1981, Tom 20, No. 1-2, pages 57-74. In Botanical Gazette 122, 194-8 (1961), R. C. French showed that carveol and dihydrocarveol stimulate the germination of wheat stem rust uredospores suggesting that carveol and dihydrocarveol promote the growth of fungi. J. C. Maruzzella and L. Liguori reported the in vitro anti-fungal activity of essential oils in the Journal of the American Pharmaceutical Association, Vol. XLVII, No. 4, April 1958, pages 250-4, but they did not study the fungicidal activity of dihydrocarvone. J. C. Maruzzella and Jerry Balter showed the action of essential oils on phytopathogenic fungi in the Plant Disease Reporter Vol. 43, No. 11, Nov. 1959, pages 1143-1147, but they did not study the anti-yeast or the anti-fungal activity of dihydrocarvone. Gauvreau showed a means of producing disinfecting compositions in U.S. Pat. No. 3,595,975 by combining cetyl pyridinium with terpenes to form antiseptics. Gauvreau never studied the use of dihydrocarvone alone nor in combination with cetyl pyridinium. Chastain and Sanders discovered a method of making limonene bactericidal and fungicidal as described in U.S. Pat. No. 5,153,229, but they never studied dihydrocarvone for
bactericidal nor fungicidal activity. A. Morel revealed the sterilizing action of carveol, dihydrocarveol, and their ozonization products in Comp. Rend. Soc. Biol. Volume 115, pages 536-8 (1934). He demonstrated the bactericidal activity of carveol and dihydrocarveol but he never studied their anti-yeast or anti-fungal activity. D. D. Whitehead in U.S. Pat. No. 3,743,747 showed the fungicidal activity of several oxo-derivatives of limonene and dipentene, but he never studied the anti-yeast or anti-fungal activity of dihydrocarvone. J. C. Maruzzella et al reported the action of odoriferous organic chemicals and essential oils on wood-destroying fungi in the Plant Disease Reporter Vol 44, No. 10 (1960); dihydrocarvone was never studied. Murdock and Allen showed the germicidal effect of sodium benzoate against yeast is enhanced by orange peel oil and d-limonene (stripper oil), as was reported in Food Technology, Vol 14, No. 9, 1960, pages 441-5. They never studied the action of dihydrocarvone against yeast or fungi. Kellner et al studied ethereal oils for antimicrobial activity, but they never studied the oils nor any of their chemical constituents for anti-yeast or anti-fungal activity as was outlined in Arzneimittel-Forschung 5 224-9 (1955).
It should be pointed out that the drugs which are bactericidal are usually not fungicidal, and drugs which are fungicidal are usually not bactericidal. In humans, the use of bactericidal antibiotics frequently promotes the growth of yeast. Table A, which follows, exemplifies the anti-bacterial, anti-yeast and anti-fungal activity of several commonly used anti-bacterial, anti-yeast, and anti-fungal antibiotics.
TABLE A __________________________________________________________________________ ANTIBIOTIC ACTIVITY AGAINST ANTIBIOTICS Gm + Bact Gm - Bact A F Bact Yeast Fungi __________________________________________________________________________ A. ANTIBACTERIAL 1. Ampicillin YES YES NO NO NO 2. Cephalothin YES YES NO NO NO 3. Chloramphenicol YES YES NO NO NO 4. Erythromycin YES NO NO NO NO 5. Ethambutol NO NO YES NO NO 6. Gentamicin YES YES NO NO NO 7. Isoniazid NO NO YES NO NO 8. Nitrofurantoin NO YES NO NO NO 9. Penicillin YES NO NO NO NO 10. Rifampin YES NO YES NO NO 11. Streptomycin YES YES YES NO NO 12. Sulfonamides NO YES NO NO NO 13. Tetracycline YES YES NO NO NO 14. Vancomycin YES YES NO NO NO B. ANTIYEAST 1. Nystatin NO NO NO YES NO 2. Gentian Violet NO NO NO YES NO C. ANTIFUNGAL 1. Chlotrimazole NO NO NO YES YES 2. Griseofulvin NO NO NO NO YES __________________________________________________________________________ Gm + Bact = Gram Positive Bacteria, Gm - Bact = Gram Negative Bacteria, A F Bact = Acid Fast Bacteria, YES = Kills Organism, NO = No Activity Against Organism
It should be noted in the table above that none of the anti-bacterial antibiotics kill yeast nor fungi, and none of the anti-yeast nor anti-fungal antibiotics kill bacteria. Thus an anti-fungal or anti-yeast antibiotic is not expected to kill bacteria, and an anti-bacterial antibiotic is not expected to kill yeast or fungi. Anti-fungal antibiotics do not necessarily kill yeast, and anti-yeast antibiotics do not necessarily kill fungi.
Several differences between yeast and fungi are known and are listed. For instance: (1) yeast can be grown in a culture in 24-48 hours while a fungus requires 7-14 days to grow in a culture. (2) Yeast grow on blood agar while fungi grow on sabouraud dextrose agar. (3) The use of anti-bacterial antibiotics in humans promotes the grow of yeast but the use of anti-bacterial antibiotics in humans does not promote the growth of fungi. (4) Several anti-yeast antibiotics do not kill fungi and several anti-fungal antibiotics do not kill yeast.

Method of killing yeast or fungi with dihydrocarvone


In one embodiment, a method for reducing information leakage in order to counter side channel attacks against a secure execution environment is described, the method including receiving at the secure execution environment a first input comprising a key comprising a sequence of k input elements in a commutative ring, CR, receiving at the secure execution environment a second input comprising a text comprising a sequence of p input elements in the commutative ring, CR, defining an input INP comprising a sequence of j input elements, wherein INP comprises either one or both of the first input or the second input, performing one of a matrix randomization operation or a polynomial randomization operation on the inputs, and producing a randomized output.

Can Homomorphic Encryption be Practical, by Kristin Lauter, Michael Naehrig, Vinod Vaikuntanathan, July 2011 describes that the prospect of outsourcing an increasing amount of data storage and management to cloud services raises many new privacy concerns for individuals and businesses alike. The privacy concerns can be satisfactorily addressed if users encrypt the data they send to the cloud. If the encryption scheme is homomorphic, the cloud can still perform meaningful computations on the data, even though it is encrypted.
The promise of practical homomorphic encryption is sought by government, industry, and society. IBM and Microsoft have been vigorously pursuing research towards its potential promise as it, for example, enables 'secure encrypted search' (or 'privacy-preserving information transfer') by a public (open) cloud server; the server, for example, searches in an encrypted medical database (without knowing the query or the result), and delivering the encrypted result for decryption by the secure client. Yet another application of 'secure function evaluation' is where the open untrusted server executes a secret algorithm for an input without knowing the nature of the algorithm or the result. Thus a hacker who is presumed to have gained an open access to the public cloud server (even a malicious cloud service employee) presents no threat of compromise of the information or transaction. The applications of this homomorphic encryption are many and will enable wide-spread use of cloud computing allowing, for example, security conscious government and financial industry to move their services to the public cloud by encrypting their data bases and make them available for cloud computing without ever worrying about a security violation by the cloud service or outside hackers. Further, this privacy-preserving technology helps society cope with ever increasing attacks on confidential data not to mention private clouds. Note that the security of the above is not a result of a moving-target paradigm (e.g., software that is rapidly updated to thwart hackers' analysis) or clear software obfuscation but inherent in the mathematical nature of the homomorphic cryptosystem.
To date, homomorphic systems have been found to be impractical; only restricted special-case constrained uses have been shown to be of some potential for practical use.
Gentry et al. in STOC '09, Proceedings of the 41st Annual ACM Symposium on Theory of Computing, pgs. 169-178, proposes a fully homomorphic encryption scheme—i.e., a scheme that allows one to evaluate circuits over encrypted data without being able to decrypt.
Xiao et al, in a paper entitled, An Efficient Homomorphic Encryption Protocol for Multi-User Systems, available at www.utdallas.edu/˜ilyen/techrep/HPbound.pdf propose a solution for the homomorphic encryption problem.
The following patent references are also believed to reflect the state of the art:
U.S. Pat. No. 7,254,586 to Chen et al;
WO/2010/100015 of INTRINSIC ID B.V.;
US 20100329454 of Takashima;
U.S. Pat. No. 7,472,093 to Juels; and
US 20110110525 of Gentry.

This patent is subject to a terminal disclaimer.

Method and system for homomorphicly randomizing an input


Evaluation indication systems, methods, and programs display a current position of a vehicle and a map around the current position on a display unit, acquire current evaluations that indicate evaluations of fuel consumption in current travel of the vehicle by unit sections, and acquire previous evaluations that indicate evaluations of fuel consumption of the vehicle in a past prior to the current travel by unit sections. The systems, methods, and programs indicate the current evaluations and the previous evaluations together by unit sections on the map.

1. Field of the Invention
The invention relates to an evaluation indication system, evaluation indication method and computer-readable storage medium that indicate an evaluation of fuel consumption of a vehicle.
2. Description of the Related Art
In related arts, various techniques for indication for improving the fuel consumption of a vehicle have been developed. For example, Japanese Patent Application Publication No. 2011-33447 (JP 2011-33447 A) describes a technique for indicating that the energy consumption of a host vehicle exceeds a reference value in association with locations in a current travel route. In addition, Japanese Patent Application Publication No. 2004-251786 (JP 2004-251786 A) describes a technique for indicating information that allows comparison in each section between a current fuel consumption and a historical average fuel consumption. Furthermore, Japanese Patent Application Publication No. 2002-350152 (JP 2002-350152 A) describes a technique for indicating an evaluation (good, intermediate, bad, or the like) of fuel consumption in previous travel on a map for each location or each route together with an evaluation of current fuel consumption at a current position of the vehicle.

Evaluation indication system, evaluation indication method and computer-readable storage medium


A socket having a housing, a plurality of contacts, a plurality of insulating members and a plurality of conductive resin members is described. The housing is in a box shape with an opening and is provided with a matrix of penetration holes at a bottom portion. The plurality of contacts include contacts for ground and respective pairs of contacts for high-speed differential transmission. The plurality of insulating members support the plurality of contacts and are pressed into the housing so that the contacts are exposed on an opposite side of the opening from the penetration holes of the housing. The plurality of conductive resin members are fitted at positions of the plurality of insulating members in contact with the contacts for ground.

Some LGA (Land grid array) packages are mounted on circuit boards via specialized sockets rather than directly mounted on the circuit boards. As an example of documents disclosing a technique related to this type of socket of LGA package, Japanese Patent Application Publication No. 2012-174616 (hereinafter, referred to as "Patent Document 1). In the socket for electronic component disclosed in Patent Document 1, a metal board with a plurality of penetration holes is used as the bottom of the housing, contacts for signal and contacts for ground arranged in a lattice shape are inserted into the penetration holes of the metal board, and the contacts are fixed to the housing. In this socket for electronic component, a first protruding piece protrudes inward from the inner wall of the penetration hole of the metal board, and the tip of the first protruding piece is in contact with and conducted to the contact for ground. Therefore, the metal board serves as the ground, the electrical reflection noise and congestion noise are shielded by the contact for ground and the metal board, and the shielding performance for the contact for signal is improved.
By the way, some LGA packages perform differential transmission at such a high speed that the transmission rate reaches 112 Gbps. The technology of patent document 1 could not adequately prevent the occurrence of crosstalk in such high speed differential transmission.
The present disclosure has been made in view of such a problem, and one of the objects is to provide a connector which can prevent the occurrence of crosstalk in high-speed differential transmission.


A high velocity air filter includes a hollow, generally cylindrical filter element comprised of a filtering material folded to extend back and forth between inner and outer peripheral surfaces to define a series of pleats extending longitudinally of the filter element. The inner edge of a plurality of the pleats is a lesser distance from the longitudinal axis of the filter element than the inner edge of the other pleats, thereby forming a plurality of short pleats and a plurality of long pleats. The inner diameter of the filter element is less crowded than in conventional high velocity air filters. The restriction to airflow is thus lowered without increasing the surface area of the filter media or sacrificing the capacity of the filter element.

1. Field of the Invention
The invention relates to air filters and, more particularly, to an improved pleated filter media for high velocity air filters.
2. Summary of Related Art
Air filters are well known devices wherein air is drawn or forced into a housing and caused to pass through a filter unit having a full flow, pleated filter media to remove the dirt, dust particles and other contaminants carried in the air. Substantially clean air is thereby passed to the point of usage, such as an internal combustion engine.
Such air filters generally comprise a filter housing provided with an air inlet and an air outlet. A filter element is mounted within the housing and is interposed between the inlet and outlet of the housing. A seal is positioned to seal the inlet from the outlet so that no air can pass out of the outlet without having first passed through the filter element. The filter element is conventionally constructed of a pleated paper type filtering material folded in a manner to define a series of circumferentially arranged and axially extending pleats. The filter element is generally cylindrically-shaped, and may be frustoconically-shaped.
High velocity air filters have heretofore included pleated paper filter elements in which the length of all of the pleats is the same; that is, the distance from the radially outer edge of a pleat to the radially inner edge of a pleat is substantially the same for all of the pleats. However, in applications requiring relatively compact air filters, the inner diameter of the filter element is reduced to the point that the inner, or downstream, edges of the pleats tend to become unduly crowded. This causes increased restriction of air flow through the filter element, resulting in a loss of engine power.
Filter elements for relatively low velocity oil filters have been provided with long pleats alternating with much shorter pleats, often referred to as a "W" or "M" pleat configuration, for many years. The purpose of the "W" or "M" pleat configuration in oil filters is to increase the total surface area of the filter media employed in the oil filter element. A staggered short pleat configuration has heretofore never been utilized in a filter element for a high velocity air filter application, nor would the "W" or "M" pleat configuration as used in oil filters be suitable in a high velocity air filter. In addition, with the "W" or "M" pleat configuration as used in oil filters, independent spacer formations are generally required to evenly space each pleat from the adjacent pleats.


To improve luminance uniformity in a panel plane, for example, there is set an amplitude of a pixel driving voltage which is an anode current in the neighborhood of a threshold value of electron emission of one pixel and the amplitude is kept as a threshold value correction value for each pixel, and to correct the luminance variation in the high-luminance emission between the pixels, there is set an amplitude of a pixel driving voltage which is an anode current in the neighborhood of a maximum value of electron emission of one pixel and the amplitude is kept as a gain correction value for each pixel. In the configuration, when a video image is displayed, the input video signal is corrected using the threshold correction value and the gain correction value for each pixel.

The present invention relates to a luminance correction technique in a display device using, for example, a field emission display (FED).
JP-A-7-181911 describes a method of luminance correction between pixels constituting a field emission display (reference is to be made to, for example, page 15 and FIG. 1). The display is driven, for example, in a pixel-by-pixel way to detect as an anode current a quantity of electrons emitted from each pixel, an amplitude or a pulse width of a driving voltage applied to each pixel is controlled to obtain an appropriate electron emission quantity, and the value is kept and outputted as a correction value of each pixel. JP-A-2001-350442 describes a technique in which an anode current is similarly measured to create a luminance correction memory (reference is to be made to, for example, pages 8 and 9 and FIG. 1).
JP-A-2002-313262 describes a method in which since the display elements are configured in a form of a matrix, to avoid increase in a period of time to measure the correction quantity for the luminance correction values, a panel including subdivided anode electrodes is used to simultaneously obtain luminance correction values of a plurality of pixels to thereby reduce the measuring period of time (reference is to be made to, for example, page 5 and FIG. 1).

Display device having luminance correcting function


A computer-implemented system and method for examining the integrity of a structure having a visually repetitive pattern such as a fence, includes an imaging system having a light source and an optical element to produce a narrow substantially vertical light beam, and a photodetector to receive reflected light. The light beam is directed at the structure while moving laterally, producing a planar image of the structure which is continually refreshed. The system processes the images and identifies an anomalous feature from an anomaly in the repetitive pattern.

Finding anomalies in the structures that have repetitive pattern, and are to some extent semitransparent, is a difficult task that no easy solution is found so far. Verifying the integrity of a fence requires manual visual inspection along the entire fence, which can be a tedious and lengthy process. The task becomes more challenging when the lighting conditions changes (day to night), and/or the pattern of the object is relatively small.
There is a need in the art for automated systems or methods for verifying the structural integrity of structures, in particular those structures with visually repetitive patterns, such as fences.

Automated system to verify structural integrity of a structure

Alberta Centre for Advanced MNT Products


A semiconductor device package is presented having signal traces interposed between power and ground conductors in order to form stripline transmission lines. The semiconductor device package includes a substrate having a die area defined upon an upper surface. The die area is dimensioned to receive the integrated circuit. A first planar conductive layer formed upon the upper surface includes a first set of bonding pads and a set of conductive traces. Members of the first set of bonding pads are arranged upon the upper surface proximate the die area, and are used to make electrical connections to the integrated circuit. Members of the set of conductive traces are connected between one of two polarities of a power supply and corresponding members of the first set of bonding pads, and function as reference planes for underlying signal traces. A second planar conductive layer is positioned between the first planar conductive layer and an underside surface of the substrate. The second conductive layer is connected to the other of the two polarities of the power supply, and also functions as a reference plane for signal traces within the substrate. A planar conductive signal layer is interposed between the first and second conductive layers and patterned to form a set of signal traces. The signal traces form stripline transmission lines which are highly desirable in high frequency applications as their impedances are highly predictable and controllable.

1. Field of Invention
This invention relates to semiconductor device packages and more particularly to device packages having signal traces connecting input/output (I/O) pads of an integrated circuit to device package terminals.
2. Description of Related Art
During manufacture of an integrated circuit (e.g., a microprocessor), signal lines formed upon the silicon substrate which are to be connected to external devices are terminated at flat metal contact regions called input/output (I/O) pads. Following manufacture, the integrated circuit (i.e., "chip") is typically secured within a protective semiconductor device package. Each I/O pad of the chip is then connected to one or more terminals of the device package. The terminals of a device packages are typically arranged about the periphery of the package. The I/O pads of the chip are electrically connected to the terminals of the device package. Some types of device packages have terminals called "pins" for insertion into holes in a printed circuit board (PCB). Other types of device packages have terminals called "leads" for attachment to flat metal contact regions on an exposed surface of a PCB.
As integrated circuit fabrication technology improves, manufacturers are able to integrate more and more functions onto single silicon substrates. As the number of functions on a single chip increases, however, the number of signal lines which need to be connected to external devices also increases. The corresponding numbers of required I/O pads and device package terminals increase as well, as do the complexities and costs of the device packages. Constraints of high-volume PCB assembly operations place lower limits on the physical dimensions of and distances between device package terminals. As a result, the areas of peripheral-terminal device packages having hundreds of terminals are largely proportional to the number of terminals. These larger packages with fine-pitch leads are subject to mechanical damage during handling or testing. Mishandling can result in a loss of lead coplanarity, adversely affecting PCB assembly yields. In addition, the lengths of signal lines from chip I/O pads to device package terminals increase with the number of terminals, and the high-frequency electrical performance of larger peripheral-terminal device packages suffer as a result.
Grid array semiconductor device packages have terminals arranged in a two-dimensional array across an underside surface of the device package. As a result, the physical dimensions of grid array device packages having hundreds of terminals are much smaller than their peripheral-terminal counterparts. Such smaller packages are highly desirable in portable device applications such as laptop and palmtop computers and handheld communications devices such as cellular telephones. In addition, the lengths of signal lines from chip I/O pads to device package terminals are shorter, thus the high-frequency electrical performances of grid array device packages are typically better than those of corresponding peripheral-terminal device packages. Grid array device packages also allow the continued use of existing PCB assembly equipment developed for peripheral-terminal devices.
An increasingly popular type of grid array device package is the ball grid array ("BGA") device package. A BGA device includes a chip mounted upon a larger substrate made of, for example, fiberglass-epoxy printed circuit board material or a ceramic material (e.g., aluminum oxide, alumina, Al.sub.2 O.sub.3, or aluminum nitride, AlN). The substrate includes two sets of bonding pads: a first set adjacent to the chip and a second set arranged in a two-dimensional array across the underside surface of the device package. Members of the second set of bonding pads function as device package terminals, and are coated with solder. The resulting solder balls on the underside of the BGA device package allow the device to be surface mounted to an ordinary PCB. The I/O pads of the chip are typically connected to corresponding members of the first set of bonding pads. Many BGA device packages have die areas dimensioned to receive integrated circuit chips and use established wire bonding techniques to electrically connect the I/O pads of the chips to corresponding flat metal "bonding fingers" adjacent to the die areas. During wire bonding, the I/O pads of the chip are electrically connected to corresponding bonding fingers by fine metal bonding wires. The substrate includes one or more layers of signal lines (i.e., signal traces or interconnects) which connect bonding fingers to corresponding members of the second set of bonding pads. During PCB assembly, the solder balls are placed in physical contact with corresponding bonding pads of the PCB. The solder balls are then heated long enough for the solder to flow. When the solder cools, the bonding pads on the underside of the chip are electrically and mechanically coupled to the bonding pads of the PCB.
The controlled collapse chip connection ("C4") is a well known alternate method of attaching an integrated circuit chip directly to a device package substrate, and is commonly referred to as the "flip chip" method. In preparation for C4 attachment, the I/O pads of the chip are arranged in a two-dimensional array upon an underside of the chip, and a corresponding set of bonding pads are formed upon an upper surface of the device package substrate. A solder bump is formed upon each of the I/O pads of the chip. During C4 attachment of the chip to the device package substrate, the solder bumps are placed in physical contact with the bonding pads of the device package substrate. The solder bumps are then heated long enough for the solder to flow. When the solder cools, the I/O pads of the chip are electrically and mechanically coupled to the bonding pads of the device package substrate. After the chip is attached to the device package substrate, the region between the chip and the device package substrate is filled with an "underfill" material which encapsulates the C4 connections and provides other mechanical advantages.
When the propagation delays of signals along the lengths of semiconductor device package signal traces exceed about one-quarter of the signal rise times, the signal traces begin to behave like transmission lines. The distances between conductors and the electrical properties of the dielectric material providing isolation become major factors in determining the impedances of the signal paths. Impedance changes along the lengths of the signal paths cause signal reflections at high frequencies which may in turn cause data transmission errors. Reliable operation of packaged semiconductor devices at high frequencies (i.e., at signal frequencies where propagation delays of signals along the lengths of the signal traces are greater than about one-quarter of the signal rise times) thus requires signal traces having uniform impedances.
It would be beneficial to have a semiconductor device package having signal traces which present uniform impedances along their entire lengths. Such a semiconductor device package would substantially reduce signal reflections at high frequencies along with resultant data transmission errors, thereby improving the high frequency performance of the semiconductor device package.

Integrated circuit package having signal traces interposed between power and ground conductors in order to form stripline transmission lines


Shoe organization and selection system whereby a person can easily and conveniently find a pair of shoes desired from their closet by selecting the shoe from a computer screen that contains pictures of all of the shoes in the shoe organizer (FIG. 1A), and then the computer will open the appropriate shoe drawer (18) so that the desired shoe can be extracted. The system comprises of a modular shoe organizer rack (FIG. 1A) which will contain the actual shoes, a motorized shoe drawer (18), and a shoe selection console (40), thereby named SSC for short, that will be directly connected to each shoe compartment either wired or wirelessly. The shoe selection console (40) will contain a picture of each shoe (42) contained in the shoe organizer. The pictures will either be a hard copy picture of the shoe which can be slid into the each individual SSC cell (42) (in the case of a push button type console) or it will be an appropriate computer generated picture stored in each cell that will be shown graphically on the SSC. The device is operated as follows. A person wants to grab a pair of red pumps from her closet as quickly as possible. She goes to the SSC and finds the cell containing the picture of the shoe desired. She then selects that shoe by pressing or touching the corresponding cell on the screen. The SSC will then send a signal to the shoe organizer unit (FIG. 1A) to the appropriate shoe compartment (18) programmed for that shoe. It will then activate the motor (50) that will open the shoe compartment (18) and slide the shoe drawer out. The person can now extract the shoes from the compartment. After she extracts the shoes, she taps the extended drawer (18) by pushing it in a little and the reversible motor (50) will automatically slide the drawer back into the shoe organizer.

1. Field of Invention
This invention relates generally to an electro-mechanical device controlled electronically by means of a computer or push button console that is used for accessing shoes stored in a shoe organizer.
2. Background of the Invention
In today's fast moving environment where fast food restaurants are the way of life, people would like to be able to accomplish things in as fast and as efficient as possible to get where they have to go. One of the things people have to do on an everyday basis is to put their clothes on after getting up from bed. As a part of that routine, finding the right shoe for the right outfit to wear for that day or to wear for a special event, or a dinner engagement could be a rather trying experience when you're running late and need to get ready quickly. A typical problem is that you have quite a few shoes that may or may not be well organized into shoe racks in your closet. Even if they are organized in shoe racks, it often takes some time for you to bend down and look through all of the array of shoes you have to find just that right pair to match your outfit for that day or event you are about to be late attending. Some other problems that exists today even with the current shoe organizers that are in the market is that you have to take the time to either pull the shoe out of a shoe compartment so that you can see the shoe itself or for those types of racks that you lay the shoe on top of, you have to pick up the shoe from the rack. An additional disadvantage is that when someone is in a hurry and you have a choice of several similar shoes for a particular outfit, it would take you longer to look for the right shoes since you would have to manually search all of your shoes to pull out the similar shoes.

System for selecting and retrieving shoes from an automated shoe rack


A method for crystallization of a weakly acidic and/or weakly basic compound having an uncharged form and at least one charged form comprises the steps of:                a) providing a solution of said compound in a solvent having an initial pH-value and an initial total concentration of said compound, said initial pH-value being chosen such that the compound is present in said solution predominantly in said charged form, said initial total concentration being chosen larger than the intrinsic solubility of said uncharged form;        b) gradually changing the pH-value of said solution in a direction that leads to a decrease of said compound's solubility until reaching a predetermined target pH-value at which said solution is in a substantially saturated state and the concentration of said uncharged form is substantially equal to said intrinsic solubility thereof; and        c) maintaining said solution in a substantially saturated state while allowing formation of crystals of said compound.

Crystallization is an important purification and separation technique in a variety of commercial processes, as for example biotechnology, mineral processing, waste treatment, energy storage, new materials and electronic chemicals. Crystallization can occur in solution, from vapor or from melt. Most processes in the chemical industries use crystallization from solution, and the starting point for it is the creation of a saturated solution. However, with the currently known methods the formation of a saturated solution is often a time-consuming process. Usually, it takes days until the equilibrium between the compound's soluble and insoluble forms has been reached. Hence, instead of a saturated solution, a supersaturated solution is used in most instances as the starting point for the crystallization. However, in such cases it is important to know the level of supersaturation, since the supersaturation appropriate for crystallization varies from compound to compound and depends on the compound's ability for crystallization. In general, with decreasing level of supersaturation the crystal growth becomes slower and the crystal quality improves.
Wang has tried to obtain a very high supersaturation of nicotinic acid by adding hydrochloric acid to a sodium nicotinate aqueous solution (Wang, F and Berglund, K A. Monitoring pH swing crystallization of nicotinic acid by the use of attenuated total reflection Fourier transform infrared spectrometry. Industrial & Engineering Chemistry Research 39(6), 2000, 2101-2104). The point of highest supersaturation was then used as the starting point for the nicotinic acid crystallization.
Another example is controlled batch crystallization by pH variation, developed by Zhu (Zhu, J and Garside, J. Controlled batch crystallization by pH variation. Jubilee Research Event, a Two-Day Symposium, Nottingham, UK, Apr. 8-9, 1997, 1, 449-452). According to Zhu, a short pulse of supersaturation initialized crystallization, and during the whole crystallization process, pH change was used in order to maintain a constant level of supersaturation. Furthermore, Zhu tried to raise the level of supersaturation as high as possible in order to shorten operation time.
However, supersaturation is considered to be a risk for the formation of amorphous material and for crystal defect occurrence. Therefore, with the presently known methods for crystallization relying on supersaturated solutions, one has to establish an appropriate level of supersaturation in each case, trying to find a compromise between the rate of crystallization and the quality of crystals formed.

Method for crystallization of a weakly acidic and/or weakly basic compound


A method of forming a semiconductor structure comprises providing a semiconductor substrate. A feature is formed over the substrate. The feature is substantially homogeneous in a lateral direction. A first ion implantation process adapted to introduce first dopant ions into at least one portion of the substrate adjacent the feature is performed. The length of the feature in the lateral direction is reduced. After the reduction of the length of the feature, a second ion implantation process adapted to introduce second dopant ions into at least one portion of the substrate adjacent the feature is performed. The feature may be a gate electrode of a field effect transistor to be formed over the semiconductor substrate.

1. Field of the Invention
The subject matter disclosed herein generally relates to the manufacturing of integrated circuits, and, more particularly, to methods of forming a semiconductor structure wherein dopant profiles are created adjacent a feature formed on a substrate.
2. Description of the Related Art
Integrated circuits comprise a large number of individual circuit elements, such as transistors, capacitors and resistors. These elements are connected internally to form complex circuits, such as memory devices, logic devices and microprocessors. An improvement in the performance of integrated circuits requires a reduction of feature sizes. In addition to an increase in the speed of operation due to reduced signal propagation delays, reduced feature sizes allow increasing the number of functional elements in the circuit in order to extend its functionality.
FIG. 1b shows a schematic cross-sectional view of a field effect transistor 100 according to the state of the art. A substrate 101 comprises an active region 102. Shallow trench isolations 103, 104 isolate the active region 102 from neighboring circuit elements. A gate electrode 106 is formed over the substrate 101 and isolated from the substrate 101 by a gate insulation layer 105. The gate electrode 106 is flanked by sidewall spacers 117, 118.
Additionally, the field effect transistor 100 comprises an extended source region 109, an extended drain region 110, a source region 112 and a drain region 113. A portion of the extended source region 109, which is denoted as "source extension," and a portion of the extended drain region 110, denoted as "drain extension," extend below the sidewall spacers 117, 118 and are adjacent the gate electrode 106.
A method of forming the field effect transistor 100 is described with reference to FIGS. 1a and 1b. FIG. 1a shows a schematic cross-sectional view of the field effect transistor 100 in a first stage of the manufacturing process. First, the trench isolations 103, 104 and the active region 102 may be formed in the substrate 101. Then, the gate insulation layer 105 and the gate electrode 116 may be formed over the substrate 102. These structures may be formed using advanced techniques of ion implantation, deposition, oxidation and photolithography. In particular, the gate electrode 106 may be formed by photolithographically patterning a layer of material deposited over the substrate 101 and the gate insulation layer 105. Photolithography, which is well known to persons skilled in the art, comprises depositing a photoresist layer over the substrate 101 and exposing the photoresist layer.
After the formation of the gate electrode 106, the extended source region 109 and the extended drain region 110 may be formed by implanting ions of a dopant material into the substrate 101 adjacent the gate electrode 106. Parts of the substrate 101 outside the field effect transistor 100 which are not to be doped are covered by a layer of photoresist (not shown) which is configured to absorb ions.
After the formation of the extended source region 109 and the extended drain region 110, the sidewall spacers 117, 118 may be formed. To this end, a layer 111 of a spacer material may be conformally deposited over the substrate 101, e.g., by means of chemical vapor deposition (CVD). The spacer material may comprise silicon dioxide and/or silicon nitride. In conformal deposition, a local thickness of the deposited layer is substantially independent of a local slope of the surface on which it is deposited. In particular, the layer 111 has a substantially equal thickness on horizontal surfaces, such as the surface of the substrate 101 and the top surface of the gate electrode 106, and on vertical surfaces, such as the side surfaces of the gate electrode 106.
FIG. 1b shows a schematic cross-sectional view of the field effect transistor 100 in a later stage of the manufacturing process. The layer of spacer material 111 is etched anisotropically. In anisotropic etching, an etch rate in a vertical direction is greater than an etch rate in a horizontal direction. Therefore, portions of the layer of spacer material 111 whose surface is substantially horizontal, such as portions of the layer 111 on the top surface of the gate electrode 106 or on the surface of the substrate 101, are removed more quickly than inclined portions of the layer 111. In particular, portions of the layer 111 whose surface is substantially horizontal are removed more quickly than portions of the layer 111 whose surface is substantially vertical, such as portions of the layer 111 on the side surfaces of the gate electrode 106.
The etching of the layer 111 of the spacer material is stopped upon removal of the portions of the layer 111 having a horizontal surface. Due to the slower removal of portions of the layer 111 having a vertical surface, residues of these portions remain on the substrate and form the sidewall spacers 117, 118 adjacent the gate electrode 106. In some examples of methods of forming a field effect transistor according to the state of the art, the sidewall spacers 117, 118 may be part of one contiguous sidewall spacer structure running around the gate electrode 106.
Following the formation of the sidewall spacers 117, 118, the source region 112 and the drain region 113 may be formed by implantation of ions of a dopant material. The sidewall spacers 117, 118 absorb ions impinging on the sidewall spacers 117, 118. Therefore, the source region 112 and the drain region 113 may be provided at a greater distance to the gate electrode 106 than the extended source region 109 and the extended drain region 110. This allows the formation of a graded dopant profile, wherein the dopant profile below the sidewall spacers 117, 118 in the vicinity of the gate electrode 106 is relatively shallow and becomes deeper in the source region 112 and the drain region 113 which are provided at a greater distance to the gate electrode. As persons skilled in the art know, this may help to reduce short channel effects and, hence, may help to improve the performance of the field effect transistor 100 compared to a transistor wherein the source region 112 and the drain region 113 extend to the gate electrode 106.
In other examples of methods of manufacturing a field effect transistor according to the state of the art, further sidewall spacers may be formed adjacent the sidewall spacers 117, 118, and further implantations of dopant ions may be performed to create more sophisticated dopant profiles.
Finally, an annealing may be performed to activate dopants in the active region 102, the extended source region 109, the extended drain region 110, the source region 112 and the drain region 113.
A problem of the prior art method of forming a field effect transistor is that, in each of the processes employed in the formation of the sidewall spacers 117, 118, inhomogeneities may occur across the surface of the substrate 101, as well as between the processing of different substrates. Therefore, there may be a variation between dopant profiles in field effect transistors formed in different portions of the substrate 101, and between dopant profiles of field effect transistors formed on different substrates. Different dopant profiles, however, may entail different properties of the individual field effect transistors. This, in turn, may adversely affect the reproducibility of the method of manufacturing a field effect transistor according to the state of the art.
A further problem of the prior art method of forming a field effect transistor is that a loss of silicon in the substrate 101, as well as a loss of material of the shallow trench isolations 103, 104, may occur during the removal of the sidewall spacers 117, 118. This may also lead to a loss of dopants in regions in the vicinity of the gate electrode 106.
Yet another problem of the method of forming a field effect transistor according to the state of the art is that the sidewall spacers 117, 118 occupy an amount of space in the vicinity of the gate electrode 106. As the size of the field effect transistor 100 is reduced, it may be desirable to use this amount of space for different purposes, for example for forming electrical connections to the field effect transistor 100, or it may be desirable to provide a stress-creating layer in the vicinity of the gate electrode 106. As persons skilled in the art know, stress-creating layers may be employed to provide a compressive or tensile stress in a channel region of the field effect transistor 100 below the gate electrode 106, which may improve the mobility of electrodes and/or holes in the channel regions.
Therefore, it has been proposed to remove the sidewall spacers 117, 118 after the formation of the source region 112 and the drain region 113. This may be done by means of an etching process adapted to selectively remove the spacer material. The removal of the sidewall spacers 117, 118, however, may require further processing steps, which may increase the complexity of the formation of the field effect transistor 100. Moreover, the field effect transistor 100 may be damaged during the etching process.
The present disclosure is directed to various methods that may avoid, or at least reduce, the effects of one or more of the problems identified above.

Method of forming a semiconductor structure


An active implantable medical device, especially of a cardiac pacemaker, defibrillator and/or cardiovertor type, having a dual chamber stimulation function and protection against cross-sensing atrio-ventricular phenomena. Cardiac events, spontaneous or stimulated, are detected in a first cavity, preferably the atrium, and a second cavity is stimulated, preferably the ventricle, The detection and confirmation of cross-sensing is performed by detecting in the atrium a signal coming from a depolarization consecutive to a preceding stimulation of the ventricle, and distinguishing such a signal from a signal resulting from spontaneous activity of the atrium. According to an embodiment, the detection of cross-sensing preferably includes the detection of an activity of the atrial extra-systole type occurring between a ventricular stimulation and a consecutive atrial event, stimulated or spontaneous, in order to determine that the interval of time between the stimulation of the second cavity and the atrial extra-systole type is less than a predetermined duration, and to detect the stability of this interval, preferably by modulating the atrio-ventricular delay (AVD) and to detect the absence of significant modification, with regard to these variations, in a particular time interval in question.

Active implantable medical devices that collect (sense) and deliver (stimulate) signals in the atrium as well as the ventricle are subject to a disadvantage known as a "cross-talk" or "cross-sensing" phenomenon. This phenomenon occurs when, in the atrial cavity, the pacemaker detects a signal coming from a depolarization following a preceding ventricular stimulation (this cross-sensing phenomenon will be designated in the following as "CTVA" ("Cross-Talk Ventriculo-Atrial")). The device can wrongly interpret this signal as resulting from a spontaneous depolarization of the atrium, with the result that this detected phenomenon is prejudicial to the expected functioning of the device.
In current devices, this CTVA phenomenon is all the more emphasized because of the relatively greater the sensitivity of input amplifiers of the atrial stage; this high sensitivity is used to be able to sense and interpret signals of low amplitude in the atrium, in case of TdRA (Troubles of the Atrial Rhythm), a generic term that covers various atrial arrhythmia such as tachycardia, fibrillation, flutter, etc., which troubles are all characterized by a rapid, abnormal atrial rhythm at the detection.
To improve both the sensitivity and the selectivity of the atrial sensing and detection, it is therefore necessary to remedy the consequences of this cross-sensing.
A first solution concerns creating a time interval called "blanking", during which the atrial amplifier is completely disconnected from the sensing circuit during a ventricular stimulation (as described, for example, in U.S. Pat. No. 4,825,870 for an amplifier of signals detected in the ventricular cavity). But this blanking period is released (triggered) only during stimulation and has only a short duration; the former does not therefore, protect, against the delayed detection of the signal of depolarization.
EP-A-0 594 957 describes another manner to process the problem of the CTVA. It proposes to analyze collected signals and, when a signal in the atrium is detected at the same time that a signal is present on the ventricular stage, the device deduces from this concomitance that the detected atrial signal has its origin in the ventricle. Proceeding in this manner, however, suffers the disadvantage that one cannot detect spontaneous signals emitted by two cardiac cavities that are totally desynchronized. Further, such a processing of signals considers only the spontaneous events, and not the stimulated events.
Another solution would be to increase the atrial refractory period. This solution, although easy to implement in current pacemakers, would have the disadvantage to decrease the atrial sensing window. The rapid atrial arrythmias could then be partially detected, limiting the efficiency of the diagnosis algorithms.
Further, EP-A-0 705 620 describes a dynamic window technique so as to better recognize signals coming from a tachycardia, and to distinguish them from signals coming from a CTVA.

Detection and confirmation of cross-sensing phenomenon in active implantable medical devices


A content managing method of a mobile device, a server, and a system is provided. According to the content managing method, when the mobile device enters into a specific region, the mobile device transmits location information of the location of the mobile device and device information of the mobile device to the server, and the server searches for and transmits content information corresponding to the location information to the mobile device. Accordingly, a user can receive the content information simply by entering into a specific location with the mobile device.

1. Field of the Invention
The present invention relates to a method for managing contents of a mobile device, a server, and a system. More particularly, the present invention relates to a method for managing content of a mobile device, a server, and a system so that the server provides adequate content to the mobile device connected over a communication network such as Internet.
2. Description of the Related Art
Thanks to recent advances of communication technologies, a user can download various content using a mobile device. For example, the user can download content such as music or game by use of a mobile phone. Using the mobile device, the user may download necessary data by accessing a server.
As such, the user can download various content using the mobile device, whereas it is quite complicated to download the intended content according to a user's location. Since the mobile device is small in size, content represented on its screen are small. Accordingly, the user can access the server, search for the intended content, and then download the content through a number of steps using the mobile device.
The user wants to download the content in a simple manner. Accordingly, what is needed is a method for easily downloading the content according to the situation using the mobile device.

Mobile device, server, and content management method for a system comprising same


The present invention is a method of manufacturing a quantum dot array having a plurality of columnar parts including a quantum dot on a substrate, the method comprising the steps of obliquely vapor-depositing a material constituting a first barrier layer to become an energy barrier against the quantum dot onto a surface of the substrate, so as to form a plurality of first barrier layers; obliquely vapor-depositing a material constituting the quantum dot with respect to the surface of the substrate, so as to form the quantum dots on the first barrier layers; and obliquely vapor-depositing a material constituting a second barrier layer to become an energy barrier against the quantum dot with respect to the surface of the substrate, so as to form the second barrier layers on the quantum dots.

In general, a quantum dot is a minute mass on the order of several to several tens of nanometers made of a semiconductor, metal, or the like, and can three-dimensionally confine electrons and holes therein. Such a confining effect quantizes the movement of electrons and holes in the quantum dot, thereby forming discrete energy levels. When a plurality of such quantum dots are arranged into an array, so as to form a quantum dot array, a quantum dot laser excellent in energy efficiency and temperature stability and the like can be realized.
As a method of manufacturing such a quantum dot array, one manufacturing a quantum dot array by patterning which employs photolithography and one manufacturing a quantum dot array by self-organization utilizing the SK (Stranski-Krasnotav) growth mode in thin-film growth have also been known.
However, the manufacturing method utilizing photolithography complicates the process and lowers the production efficiency, thereby raising the cost of devices using the quantum dot array. When cost-cutting is intended, on the other hand, the area is hard to increase.
The manufacturing method utilizing the SK growth mode utilizes the lattice constant difference between a material constituting the quantum dot and a material constituting a barrier layer, thereby limiting combinations of the materials constituting the quantum dot and barrier layer. Also, this method is hard to regulate the number density of quantum dots on a substrate. When quantum dots and barrier layers are to be laminated alternately in the film thickness direction, the barrier layers must increase their thickness in order to alleviate their lattice strain.
Therefore, a method of forming a plurality of columnar quantum dots on a substrate by obliquely vapor-depositing a material constituting the quantum dots onto the substrate has been proposed (see Suzuki and two others, "Morphological Stability of TiO2 Thin Films with Isolated Columns", Japanese Journal of Applied Physics Part 2, Vol. 40, p. L398-L400, 2001).

Quantum dot array and production method therefor, and dot array element and production method therefor


A method and computer program product for determining whether an object of interest can have its temperature measurement calculated by a thermal imaging camera. To do this, the measurement IFOV is converted into linear units. The measurement IFOV may be displayed on the display of the camera as a graphical indicator (100, 100′, 100″, 100′″) or a value. An object of interest can be registered with the graphical indicator (100, 100′, 100″, 100′″) or its dimension compared with the measurement IFOV and then it is determined whether the temperature measurement of the object can be acceptably calculated. Alternately, data obtained by a matrix of pixel elements may be analyzed to determine whether an accurate temperature can be calculated.

Handheld thermal imaging cameras, for example, including microbolometer detectors to generate infrared images, are used in a variety of applications, which include the inspection of buildings and industrial equipment. Many state-of-the-art thermal imaging cameras have a relatively large amount of built-in functionality allowing a user to select a display from among a host of display options, so that the user may maximize his 'real time', or on site, comprehension of the thermal information collected by the camera.
As is known, infrared cameras generally employ a lens assembly working with a corresponding infrared focal plane array (FPA) to provide an infrared or thermal image of a view in a particular axis. The operation of such cameras is generally as follows. Infrared energy is accepted via infrared optics, including the lens assembly, and directed onto the FPA of microbolometer infrared detector elements or pixels. Each pixel responds to the heat energy received by changing its resistance value. An infrared (or thermal) image can be formed by measuring the pixels' resistances—via applying a voltage to the pixels and measuring the resulting currents or applying current to the pixels and measuring the resulting voltages. A frame of image data may, for example, be generated by scanning all the rows and columns of the FPA. A dynamic thermal image (i.e., a video representation) can be generated by repeatedly scanning the FPA to form successive frames of data. Successive frames of thermal image data are generated by repeatedly scanning the rows of the FPA; such frames are produced at a rate sufficient to generate a video representation of the thermal image data.
Often, the user of the camera needs to know his distance from an object of interest. This is sometimes necessitated by safety concerns when a user is inspecting, for example, electrical or other potentially hazardous equipment and the user is required to be a certain distance from the equipment. Likewise, sometimes the distance from an object of interest to the user also can affect performance accuracy capabilities of a thermal imager being used for inspection work.

Thermal imager that analyzes temperature measurement calculation accuracy


A kick boat employing a hinged frame design provides an infinitely adjustable foot rest and leg support, and infinitely adjustable mainframe positioning. No tools are required to assemble and disassemble the boat. The hinged frame is structured and arranged to collapse and partially rotate to form a back pack frame. Alternatively, the hinged frame may be fully rotated to a fully collapsed space minimizing storage position. A cargo bay restraining system is also provided.

1. Field
This invention relates to single user water craft. More specifically, the invention is directed to kick boats, and provides several enhancements for such boats.
2. State of the Art
Typically, kick boats are single person vessels which are powered by the action of swim fins on the user's feet or of oars supported on the framework of the vessel. Small motors may also be used on these boats. Kick boats are popularly used as fishing platforms, but they are also used more generally for water transport, such as in connection with hunting, touring or white water rafting.
These boats generally comprise two inflatable cylindrical pontoons harnessed together by means of a rigid mainframe. The mainframe functions as the support for seating or decking, and also serves as the attachment point for any optional equipment; such as foot rests, frame extensions, motors, oars, rod holders, beverage holders, fish finders, stripping aprons, cargo containers, anchors, etc.
Mainframes have typically been constructed of aluminum. In general practice, assembly of the mainframe to the pontoons requires that the mainframe rest directly on the pontoon surfaces. Significant problems have been associated with such direct contact between the mainframe and pontoons. Friction between the surfaces of a pontoon and a frame during use of the boat causes black oxide to rub off of the mainframe and stain the pontoons and anything else coming in contact with the oxide. Aluminum mainframes also are easily scratched and dented during use, transportation and storage. Pontoon surfaces are subject to puncture and abrasion, because of the conventional materials of construction of the pontoons, typically PVC, rubber, rubberized fabric or similar polymeric materials. Raised or rough areas on the mainframe cause cuts and abraded areas in the pontoon surfaces. To avoid staining, puncture and abrasion problems, boat owners must invest considerable time in maintaining the boat. The aluminum frame must be kept painted to avoid any direct surface contact between the mainframe and the pontoons; and any dents or nicks must be smoothed out before the mainframe can be attached to the pontoons.
Historically, kick boats have been designed with wrap around mainframes supported on a pair of inflatable pontoons. The mainframe harnesses the pontoons in spaced tandem arrangement. The major portion of the frame is thus suspended between the pontoons as a support structure having side members, front and rear cross members and a central platform. Any additional boat components and accessories are attached to this support structure.
The bending moments generated in conventional mainframes have been observed to have a negative impact on the durability of the frame. The largest bending moments generated in the mainframe occur where the side members are joined to the central platform. Breakage often occurs in this area, especially under conditions causing the pontoons to bounce or the load to fluctuate (in rough water, for example). Overstress failures have also been observed to occur in the regions where foot rest and cargo bay accessories are attached to a frame.
Conventional mainframes are tubular in construction to reduce weight. Cargo platforms are generally attached to a mainframe by sliding reduced cross section segments carried at the ends of a tubular cargo frame into tubular mainframe members. Cargo frames have historically been constructed of tube material having the same inner and outer diameters as the associated mainframes. A reduced cross section segment at the end of the cargo frame therefore act as a stress riser which weakens the cargo frame. Failure of the cargo frame due to this stress riser has been observed.
Cargo platforms comprising soft floors, such as those constructed from textile mesh or canvas, for example, stretched across a rigid frame are typically attached to the back end of the mainframe to carry any gear a boater may need to transport. Such soft floors have been favored because they offer considerable weight savings over the use of a solid platform. Unfortunately, the textile materials of construction tend to sag when loaded, so that gear is immersed in the water to some degree while the boat is in use.
Accessories are typically attached to side members of a mainframe, to be convenient to a boater's hand during boating. Unfortunately, any strap used to attach an accessory to a side member of the mainframe is inherently pushed into the pontoon surfaces when a mainframe is mounted on the pontoons. Other fastener systems and accessory surfaces moving against the pontoons also cause problems associated with wear. Vibration due to wind or rough water, or the transport of an assembled boat, causes abrasion of the pontoon surfaces under these pressure points.
Another commonly used method used to attach accessories to the mainframe side members is to fasten or integrally form a clevis at one end of the accessory. The clevis slips over a side member and is fixed in place. Oar locks, fishing rod holders, and beverage holders are examples of accessories that may be attached to a mainframe in this manner. Conventionally, clevis and side members have been made of aluminum. Galling between the clevis and side member surfaces has been found to present a significant problem after short usage times.
Wrap around mainframes provide stability along the full length of each pontoon and maintain the pontoon pair in parallel position even in relatively rough water conditions. Unfortunately, the front cross member of a conventional wrap around design obstructs a user's entry and exit from the vessel. This problem increases with increasing water depth. Historically, the front cross member of a mainframe has acted as a footrest. A footrest provides many practical advantages; for example, for generally relaxing, for resting and stretching finning muscles, or for supporting a user's feet in an elevated position to clear bottom hazards. It also may serve as a foot brace for more efficient rowing action.
A framing system which eliminates front cross members offers convenient walk-in access to the vessel's seating area, but with the accompanying loss of the footrest. "L"-shaped foot rest extensions have thus been attached to the side members of certain mainframes lacking a front cross member. Neither the conventional front cross member nor the newer foot rest extension is continuously adjustable to comfortably accommodate various leg lengths.
It is recognized that it would be beneficial to provide adequate leg support above the surface of a kick boat's foot rest. Such leg support would be expected to alleviate leg strain when the feet are elevated. Hypothetically, a cross member could provide additional leg support with the use of a foot rest attachment suspended from and located forward of the member, but only if the user's legs, through serendipity, happened to be of the correct length to take advantage of such a feature.
The front cross member has also historically acted as a tether. It is often advantageous (when fishing in rivers, streams and lake shallows for example) to stand up intermittently during the use of a kick boat. When a boater stands, the boat continues to be acted upon by any wind or current present. Removal of the front cross member of wrap around mainframes leaves a gap in the structure surrounding a user, thereby allowing the boat to drift free under these circumstances.
Stripping aprons are commonly used in conjunction with kick boats to catch and contain fly fishing line as it is stripped back after casting. The apron may also be used as a work surface for other applications. Conventional aprons represent a safety hazard as they present a physical barrier to egress from the craft, should the craft over balance.
Conventional aprons are also fixed in place and are not adjustable to accommodate boaters of various sizes. Any gap between the apron and a boater will allow stripped line to fall out of the boat. Wet line sinks in the water, so any line falling into the water in front of a boater becomes entangled around the boater's legs and swim fins or around rocks and weeds. Under sized aprons present the same problem. A full sized apron that could be adjustably positioned along the longitudinal axis of the boat would constitute a significant improvement.
When deployed, conventional stripping aprons interfere with easy access to the seating area of a boat, just as the front cross members of wrap around mainframes do. A user typically must choose between attaching a stripping apron to a boat, thereby restricting access to the seating area, or stowing it away in a cargo container. It would be more convenient to be able to easily access the seating area without disassembling the apron. A storage system that keeps the apron handy and easily deployed, but out of the way when not in use, would be an additional enhancement.
Many kick boat accessories are available to enhance user comfort and convenience. Historically, it has been difficult to attach accessories to the mainframe in a manner avoiding entanglement of the boater or abrasion of the pontoons, and to avoid clutter, while allowing the accessory to be easily accessed when wanted. Historically, accessories are provided to serve a single function. It would be of benefit to provide adaptable accessories that can meet a variety of needs, to eliminate clutter.
Conventional boat models are provided with the aim of meeting the needs of boaters primarily interested in one particular type of application. Boats configured for lake fishing are not necessarily convenient for river fishing or river running for example. A versatile boat that can be configured to meet a variety of needs would be highly advantageous.
Storage of kick boats has been inconvenient for those, such as apartment dwellers, having limited storage space. Kick boats have generally been bulky, even when disassembled for storage or transport. Duffle bags and bags with attached back pack straps have been used to increase kick boat portability. The bag size (approximately 4 feet long) required to contain a basic kick boat is awkward to carry when hiking to water.
Conventional kick boat designs utilize metal-to-metal (usually aluminum-to-aluminum) joints. Tools are required to assemble and disassemble these conventional kick boat joints. Screw drivers and socket and crescent wrenches are examples of the tools commonly required. Most conventional joint assembly methods for kick boats require nuts, bolts and washers. Some joints (such as for the attachment of oar locks or cargo frames) also require the use of a mallet to assist in their assembly. Mallets are required as the metal becomes substantially galled due to the rocking motion of the vessel on water. Such tools add to the weight that must be transported with the vessel. When boating, there is always the danger of loosing tools and fasteners in the water.
The cylindrical pontoons of kick boats have conventionally presented substantial flat water line interfaces. Flat interfaces on the pontoons provide enhanced tracking but decreased maneuverability of the vessel. A flat interface also provides a large frictional resistance surface in contact with the water when water flows perpendicular to the flat interface.
Newly developed swept pontoons are being offered to replace the previously favored cylindrical pontoons in some applications. When viewed in a longitudinal cross section, cylindrical pontoons have parallel walls over the water contact area, that rest flat on the water. Swept pontoons may include a cylindrical midsection, but are otherwise characterized by converging walls that curve up away from the plane of the water surface. Fully swept pontoons have no cylindrical sections and are offered with varying radii of curvature.
Swept pontoons greatly decrease the water resistance of the boats and allow for greater maneuverability and easy propulsion action. However, boats utilizing swept pontoons are less stable in the water and so are less forgiving of longitudinal load imbalances. Therefore, there is an increased need for adjustability in situating the mainframe longitudinally along the pontoons, to balance the load carried by the pontoons.
There remains a need for a versatile kick boat with adjustable and secure foot, leg and seat support structures, improved cargo storage, and reduced maintenance requirements. There further remains a need for a kick boat assembly capable of more efficient storage and transport, and for a safe, durable, and collapsible design that provides rigid stability when reassembled. There is also a need for improved load balancing capabilities for swept pontoon kick boats. Elimination of the need for tools and loose hardware for assembly and disassembly would eliminate a major source of inconvenience, and would help reduce weight, thereby enhancing portability. Improved accessory storage and an adjustable and safe stripping apron are also needed.