A system for facilitating secure remote access to sensitive data is provided. The system includes a plurality of electronic devices. These electronic devices are under the control of an organization. The system also includes a data router. When the data router obtains sensitive data that is to be made available to remote clients, the data router secures the sensitive data and transmits the secured sensitive data over a first communication channel to an organization-controlled server. When the data router obtains other data that is to be made available to remote clients, the data router transmits the other data over the second communication channel to a third-party server.

Computer and communication technologies continue to advance at a rapid pace. Indeed, computer and communication technologies are involved in many aspects of a person's day. For example, many devices being used today by consumers have a small computer incorporated within the device. These small computers come in varying sizes and degrees of sophistication. These small computers may vary in sophistication from one microcontroller to a fully-functional complete computer system. For example, small computers may be a one-chip computer, such as a microcontroller, a one-board type of computer, such as a controller, a typical desktop computer, such as an IBM-PC compatible, etc.
Computers typically have one or more processors. The processor(s) usually are interconnected to different external inputs and outputs and function to manage the particular computer or device. For example, a processor in a thermostat may be connected to buttons used to select the temperature setting, to the furnace or air conditioner to change the temperature, and to temperature sensors to read and display the current temperature on a display.
Many electronic devices include one or more small computers. For example, thermostats, furnaces, air conditioning systems, refrigerators, telephones, typewriters, automobiles, vending machines, and many different types of industrial equipment now typically have small computers, or processors, inside of them. Computer software runs the processors of these computers and tells the processors what to do to carry out certain tasks. For example, the computer software running on a thermostat may cause an air conditioner to stop running when a particular temperature is reached or may cause a heater to turn on when needed.
Sometimes, an organization wants to make data about its electronic devices available to certain remote clients, i.e., clients who are not in the same physical location as the electronic devices. This data may relate to the operation of the electronic devices themselves. For example, the data may indicate whether an electronic device is turned on, whether it is calibrated correctly, whether a cycle of operation has completed correctly, and so forth. Alternatively, or in addition, this data may relate to something other than the operation of the electronic devices. For example, the data may include a user identifier that corresponds to a user of an electronic device, a measurement taken by an electronic device, an alert generated by an electronic device, and so forth.
An organization typically uses a third-party service to make data available to remote clients. The third-party service is under the control of a third party, i.e., an entity other than the organization. The third-party service fulfills requests for data from authorized remote clients. Some of the data that an organization wants to make available to remote clients may be sensitive, i.e., not intended for public disclosure. Often, the organization may not trust the third party with sensitive data. Thus, benefits may be realized if means were provided to enable an organization to make sensitive data available to remote clients without disclosing the sensitive data to third parties.

Systems and methods for facilitating secure remote access to sensitive data from an embedded device


An injection molding machine is provided with a linear guide block configured to be guided on a linear guide rail and a guide mounting block which is secured to the linear guide block and supports the movable platen. Two mounting bolts and two adjust bolts are disposed individually at two positions, spanning between the movable platen and the guide mounting block. The size of a gap between the movable platen and the guide mounting block is adjusted by independently tightening the adjust bolts, whereby the horizontal tilt of the movable platen is adjusted.

1. Field of the Invention
The present invention relates to a movable platen support mechanism used in an injection molding machine provided with a movable platen, stationary platen, rear platen, die clamping mechanism, and linear guide unit for axially guiding the movable platen.
2. Description of the Related Art
As shown in FIG. 11, an injection molding machine usually comprises a die clamping unit 100 and an injection unit 200, which are located on a base frame 300. The die clamping unit 100 includes a movable platen 1, stationary platen 9, rear platen 12, and toggle mechanism 13. A plurality of tie-bars 14 are mounted between the stationary platen 9 and the rear platen 12 so as to penetrate the movable platen 1. The tie-bars 14 are slidable relative to the movable platen 1. The stationary platen 9 is fitted with a stationary die (not shown), and the movable platen 1 with a movable die (not shown).
A pair of linear guide rails 11 are mounted on the base frame 300, and linear guide blocks 5 to which the guide mounting block 2 is secured are placed on the guide rails 11. The linear guide blocks 5 are movable longitudinally relative to the guide rails 11. The movable platen 1 is secured to the linear guide blocks 5 by bolts (not shown) or the like with the aid of the guide mounting block 2. The toggle mechanism 13 is powered by a movable platen driving servomotor (not shown). As the toggle mechanism 13 is driven, the movable platen 1 approaches or withdraws from the stationary platen 9. As the movable platen 1 moves in this manner, the linear guide blocks 5 move on the guide rails 11 longitudinally relative thereto. For example, Japanese Patent Application Laid-Open No. 9-262884 discloses a technique in which a linear guide is used to guide a movable platen in a die clamping mechanism of an injection molding machine, in order to improve the die opening/closing accuracy.
If the linear guide is used to guide the movable platen, as described above, a load produced by the deformation of the movable platen acts on the linear guide, thereby greatly affecting the life performance of the guide. Some of measures to counter this phenomenon are proposed in the following Japanese patent publications.
Japanese Patent Application Laid-Open No. 8-258103 discloses a platen structure that can suppress deflection.
Japanese Patent Application Laid-Open No. 2006-272558 discloses a technique in which an expensive material with a low linear expansion coefficient is used for a platen and a platen support member.
Japanese Patent Application Laid-Open No. 2003-71894 discloses a mechanism in which spring elements are vertically attached to the lower end portion of a movable platen, as a mechanism that can absorb deformation of the movable platen.
Japanese Patent Application Laid-Open No. 2004-330449 discloses a mechanism in which buffer members (spring elements or fluid-pressure cylinders) are arranged vertically and horizontally between a movable platen and a linear guide unit, as a mechanism that can absorb vertical and horizontal deformations of a movable platen.
If the linear guide is used to guide the movable platen, as mentioned before, a load produced by the deformation of the movable platen acts on the linear guide, so that the life performance of the guide is greatly affected. The deformation of the movable platen is attributable to deflection by a die clamping force and thermal expansion caused by die temperature control.
The deflection by the die clamping force can be reduced by the technique disclosed in Japanese Patent Application Laid-Open No. 8-258103.
Further, the thermal expansion due to die temperature control can be reduced by the technique disclosed in Japanese Patent Application Laid-Open No. 2006-272558. In this case, however, an expensive material with a low linear expansion coefficient needs to be used for a platen, such as a movable platen, and a platen support member, thus entailing an increase in the manufacturing cost of an injection molding machine.
According to the technique disclosed in Japanese Patent Application Laid-Open No. 2003-71894, the spring elements are mounted vertically, so that they cannot absorb horizontal deformation of the movable platen. Further, the spring elements are located between a guide mounting block and mounting bolts, so that the posture of the platen does not change if shims are fitted to bolt seating surfaces. Thus, this technique is not applicable to parallelism adjustment.
According to the technique disclosed in Japanese Patent Application Laid-Open No. 2004-330449, the buffer members are mounted vertically and horizontally, so that the posture of the movable platen is unstable and requires support by tie-bars. Thus, the effect of the linear guide unit to improve the die opening/closing accuracy is small. Since the adjustment of the parallelism of the platen is not taken into consideration, moreover, this technique is not applicable to the parallelism adjustment.


A non-contact voltage detecting method and device are provided. The non-contact voltage detecting device includes a discharge lamp having an excitation voltage and a lighting voltage applied thereon, a boost circuit coupled to the discharge lamp for providing an operation voltage to the discharge lamp and a switch circuit coupled to the boost circuit for providing a periodical high-low signal level to control the boost circuit wherein the discharge lamp flickers if there is a relatively high voltage power nearby, while the discharge lamp is extinguished without the relatively high voltage power nearby. In addition, the device is capable of being an illumination source by increasing an input voltage of the boost circuit when it is not used for detecting the high voltage power.

The high voltage power is a kind of invisible energy. It is popularized and useful in various applications, such as physics, chemistry, biochemistry, material science and Micro-Electro Mechanical System (MEMS). However, it would be harmful and dangerous if the high voltage power is not properly applied. It is necessary to develop a device for detecting the high voltage power.
A conventional method for detecting the high voltage power relates to utilizing a high impedance resistor connected to an electrode of the high voltage power for detecting a lower voltage power relative thereto. Such a low voltage is resulted from the decline of the original high voltage. By reading out the low voltage through a general detecting instrument, one can judge weather the high voltage power exists or not.
However, if the high impedance resistor is failed or the insulation property of the detecting instrument is bad, the high voltage power may damage the detecting instrument and hurt the person who operates it. Therefore, in order to overcome the disadvantages of the conventional method, the present invention provides a novel detecting method and device for safely detecting the high voltage power.

Device and method for detecting high voltage


A process for converting polyalkylaromatics to monoalkylaromatics, particularly cumene, in the presence of a modified LZ-210 zeolite catalyst is disclosed. The process attains greater selectivity, reduced formation of undesired byproducts, and increased activity.

The following description will make specific reference to the use of the catalyst disclosed herein in the transalkylation of PIPBs with benzene to afford cumene, but it is to be recognized that this is done solely for the purpose of clarity and simplicity of exposition. Frequent reference will be made herein to the broader scope of this application for emphasis.
Cumene is a major article of commerce, with one of its principal uses being a source of phenol and acetone via its air oxidation and a subsequent acid-catalyzed decomposition of the intermediate hydroperoxide.
Because of the importance of both phenol and acetone as commodity chemicals, there has been much emphasis on the preparation of cumene and the literature is replete with processes for its manufacture. The most common and perhaps the most direct method of preparing cumene is the alkylation of benzene with propylene, especially using an acid catalyst.
Another common method of preparing cumene is the transalkylation of benzene with PIPB, particularly di-isopropylbenzene (DIPB) and tri-isopropylbenzene (TIPB), especially using an acid catalyst. Any commercially feasible transalkylation process must satisfy the requirements of a high conversion of polyalkylated aromatics and a high selectivity to monoalkylated products.
The predominant orientation of the reaction of benzene with PIPB resulting in cumene corresponds to Markownikoff addition of the propyl group. However, a small but very significant amount of the reaction occurs via anti-Markownikoff addition to afford n-propylbenzene (NPB). The significance of NPB formation is that it interferes with the oxidation of cumene to phenol and acetone, and consequently cumene used for oxidation must be quite pure with respect to NPB content.
Because cumene and NPB are difficult to separate by conventional means (e.g. distillation), the production of cumene via the transalkylation of benzene with PIPB must be carried out with a minimal amount of NPB production. One important factor to take into consideration is that the use of an acid catalyst for the transalkylation results in increased NPB formation with increasing temperature. Thus, to minimize NPB formation, the transalkylation should be carried out at as low a temperature as possible.
Since DIPB and TIPB are not only the common feeds for the transalkylation of benzene with PIPBs but also the common byproducts of the alkylation of benzene with propylene when forming cumene, transalkylation is commonly practiced in combination with alkylation to minimize the production of less valuable byproducts and to produce additional cumene. In such a combination process, the cumene produced by both alkylation and transalkylation is typically recovered in a single product stream. Since NPB is also formed in alkylation and the amount of NPB formation in alkylation increases with increasing temperature, the NPB production in both alkylation and transalkylation must be managed relative to one another so that the cumene product stream is relatively free of NPB.
What is needed is an optimum transalkylation catalyst for, e.g., cumene production, with sufficient activity to effect transalkylation at acceptable reaction rates at temperatures sufficiently low to avoid unacceptable NPB formation. Because Y zeolites show substantially greater activity than many other zeolites, they have received close scrutiny as a catalyst in as a catalyst in aromatic transalkylation. However, a problem exists in that Y zeolites effect transalkylation at unacceptably low rates at the low temperatures desired to minimize NPB formation.
Therefore, in order for a commercial process based on Y zeolites to become a reality, it is necessary to increase catalyst activity—i.e., increase the rate of cumene production at a given, lower temperature.

This patent is subject to a terminal disclaimer.

Aromatic transalkylation using a modified LZ-210 zeolite


An antenna circuit tunable to a determined resonance frequency, includes an antenna coil and adjustable components. The antenna circuit includes a filter having at least one point to tap an electric voltage the amplitude of which forms a pertinent indication for the tuning of the antenna circuit. To tune the antenna circuit, the adjustable components of the antenna circuit are adjusted so that the electric voltage has a determined amplitude.

The present invention relates to inductive antenna circuits, particularly for contactless integrated circuit readers, and more particularly, to an antenna circuit tunable to a determined resonance frequency, comprising an antenna coil and adjustable components. The present invention further relates to a method for tuning such an antenna circuit.
FIG. 1 schematically represents a contactless integrated circuit reader RD equipped with an antenna circuit 10 of the aforementioned type. The antenna circuit 10 comprises a coil L and adjustable components, such as two adjustable capacitors C1, C2. The antenna circuit receives an alternating current (AC) excitation signal Se of frequency F0 supplied by the reader RD, and sends an AC magnetic field FLD. This magnetic field enables the reader RD to communicate by inductive coupling with contactless integrated circuits CIC1, CIC2 . . . CICn which are each equipped with a respective antenna coil L1, L2 , . . . Ln. The integrated circuits CIC1–CICn are, for example, contactless smart card integrated circuits, contactless electronic tag integrated circuits, contactless badge integrated circuits, and the like.
The adjustable capacitors C1, C2 enable the resonance frequency of the antenna circuit to be tuned to the frequency F0 of the excitation signal, which is for example 13.56 Mega Hertz (MHz) according to the International Standards Organization (ISO) standards ISO 15693 and ISO 14443. The tuning of the antenna circuit to the frequency F0 enables an optimal communication distance to be obtained between the reader and the contactless integrated circuits.
Although this tuning is generally performed at the time of commissioning the antenna circuit, the latter is then subjected to variations in humidity and temperature that can substantially affect its resonance frequency. The presence of metal objects in the proximity of the antenna circuit further influences the resonance frequency. The antenna circuit must therefore be tuned again on site to take its conditions of use into account. It must then be tuned at regular intervals if the reader RD is to have an optimal communication distance.
The tuning of the antenna circuit can be performed manually but this solution requires the intervention of qualified staff. Furthermore, a manual tuning can prove difficult in certain conditions of use. As an example, a contactless badge reader dedicated to controlling access in high altitude transport facilities (e.g., chair lifts, cable cars, etc.) will be considered. Due to the poor weather conditions and the very low temperatures, it is difficult to adjust the components of the antenna circuit bare-handed, using a screwdriver.
In this case, an electrically tunable antenna circuit is provided comprising embedded equipment that automatically tunes the antenna circuit ("autotuning"), once a day for example.
FIG. 2 represents an electrically tunable antenna circuit 20, comprising electrically adjustable capacitors C1, C2 for that purpose. The capacitor C1 comprises a capacitor C10 in parallel with a plurality of switchable capacitors C1i. The capacitor C2 comprises a capacitor C20 in parallel with a plurality of switchable capacitors C2j. Each capacitor C1i, C2j, respectively, is switchable by an electric relay RLi, RLj, respectively, arranged in series with the capacitor. The relays RLi are driven by signals Si and the relays RLj are driven by signals Sj. Thus, the combination of signals Si determines the value of the capacitor C1 and the combination of signals Sj determines the value of the capacitor C2.
FIG. 3 represents curves of phase φ and of impedance Z of the antenna circuit 20 when it receives an excitation signal Se oscillating at the frequency F0, such as 13.56 MHz for example.
The tuning of the antenna circuit 20 to the frequency F0 theoretically involves finding a pair of determined values of the impedance Z and of the phase φ, generally Z=50Ω and φ=0°.
However, a piece of equipment for measuring the phase Φ and the impedance Z is generally too costly and cumbersome to form an embedded piece of equipment.
Thus, as shown in FIG. 4, the embedded equipment performing the automatic tuning of the antenna circuit generally includes a simple voltage standing wave ratio (VSWR) meter TMR arranged between the antenna circuit 20 and the reader RD, and a tuning device TC1 supplying the signals Si, Sj for controlling the relays of the antenna circuit. The VSWR meter TMR measures the voltage standing wave ratio and the device TC1 tunes the antenna circuit so that the voltage standing wave ratio is minimal at the frequency F0.
This tuning method is simple and inexpensive, but the precision of it is mediocre. Indeed, the voltage standing wave ratio provides an indication which, although it is pertinent, can be considered in the light of experience acquired, to be insufficient in itself to achieve reliable and precise tuning. Furthermore, an adjustment of the antenna circuit based on the voltage standing wave ratio is long and difficult to find. Many combinations of the signals Si, Sj must be tested before finding the combination taken to be optimal.
Thus, it is desirable to provide a method for tuning an antenna circuit that is more precise than the classical method described above. It is also desirable to provide a tuning method that is precise and that can be implemented by embedded equipment that is simple and affordable to produce. It is also desirable to provide an antenna circuit that is simple to tune.

Tunable antenna circuit, particularly for contactless integrated circuit reader


The invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same and provides an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same. A common mode choke coil as the electronic component has an overall shape in the form of rectangular parallelepiped that is provided by forming an insulation layer, a coil layer (not shown) formed with a coil conductor, and external electrodes electrically connected to the coil conductor in the order listed on a silicon substrate using thin film forming techniques. The external electrodes are formed to spread on a top surface (mounting surface) of the insulation layer.

1. Field of the Invention
The present invention relates to a surface mount type electronic component mounted on a printed circuit board or hybrid IC (HIC) and a method of manufacturing the same.
2. Description of the Related Art
Known coil components mounded on circuits in electronic apparatus such as personal computers and portable telephones include wire-wound types provided by wounding a copper wire around a ferrite core, stacked types provided by stacking magnetic sheets made of ferrite having a coil conductor pattern formed thereon one over another, and thin film types provided by alternately forming insulation films and coil conductors constituted by metal thin films using thin film forming techniques. The rapid advance toward electronic components having smaller sizes and higher performance in recent years is accompanied by strong demand for coil components having smaller sizes and higher performance. In the case of thin film type coil components, chip size coil components of 1 mm or less are supplied to the market by reducing the thickness of coil conductors.
Patent Document 1 discloses a common mode choke coil as a thin film type coil component. FIG. 4 is an external perspective view of a common mode choke coil 51 according to the related art disclosed in Patent Document 1. In FIG. 4, for easier understanding, visible regions of outer external electrodes 61, 63, 65, and 67 are indicated by hatching, and internal electrode terminals 71 and 73 and features in the neighborhood of the same, which are covered by the external electrodes 61 an 63 and are not visible in practice, are shown in perspective representation. Hidden lines are represented by broken lines.
As shown in FIG. 4, the common mode choke coil 51 has an overall shape in the form of a rectangular parallelepiped that is provided by forming an insulation layer 57 and a coil layer (not shown) formed with a coil conductor in the order listed on a magnetic substrate 53 using thin film forming techniques and combining the resultant stack with another magnetic substrate 55 with a bonding layer 59 interposed between them. The internal electrode terminals 71, 73, 75, and 77 exposed at side portions of the insulation layer 57 are electrically connected to the external electrodes 61, 63, 65, and 67, respectively. The external electrodes 61, 63, 65, and 67 are formed at the respective side portions where the internal electrode terminals 71, 73, 75 and 77 are exposed such that they extend also on the top and bottom of the magnetic substrates 53 and 55 which are substantially perpendicular to the side portions and substantially parallel to the surface where the insulation layer 57 is formed.
Patent Document 1: JP-A-8-203737
The common mode choke coil 51 is completed through a thin film formation step at which the insulation layer 57 and the coil layer are formed on the magnetic substrate 53 in the form of a wafer using thin film forming techniques such as a photo-process, a substrate bonding step at which the magnetic substrate 55 is bonded using the bonding layer 59 formed on the insulation layer 57, a cutting step at which the wafer is cut and separated into chips, and an external electrode forming step at which the external electrodes 61, 63, 65, and 67 are formed. Since a plurality of manufacturing steps are required to manufacture the common mode choke coil 51 as thus described, a problem arises in that the common mode choke coil 51 becomes expensive because of high manufacturing costs. The external electrodes 61, 63, 65, and 67 are formed using, for example, a masked sputtering process. However, it is difficult to form external electrodes 61, 63, 65, and 67 having the shape shown in FIG. 4 on a common mode choke coil 51 smaller than a 1005 type component (the length of which is 1.0 mm along longer sides thereof and 0.5 mm along shorter sides thereof) because of limitations on mask registration accuracy and etc.
It is an object of the invention to provide an electronic component which can be formed with a small size and a low height at a low cost and a method of manufacturing the same.

Electronic component and method of manufacturing the same


Provided herein is a method for electroheating liquid egg. Also provided herein is an apparatus specifically designed for heating and cooling materials and preferably liquid egg and apparatus for pasteurizing liquid egg by electroheating.

There are a number of techniques which are known for pasteurizing and processing liquid egg. The more popular approaches involve the use of conventional plate heat exchangers, steam infusion systems, or combinations of both. However, these techniques have limitations because of the physical nature of liquid egg. Plate heat exchangers are very popular in that they are very efficient and relatively simple to use. However, plate heat exchangers are limited in the amount of heat that they can convey to liquid eggs without causing irreparable harm such as undue coagulation, scorching, caking on the plate, and the like. Furthermore, the highest effective temperature range over which heating can be accomplished by plate heat exchangers is limited to between about 150.degree. F. to about 155.degree. F., particularly for long term, continuous processing techniques. As a matter of practical reality, plate heat exchangers can only be used to heat liquid whole egg to pasteurization temperatures of between about 140.degree. F. and about 155.degree. F. for an extended period of time.
Steam infusion systems can be used to obtain much higher temperatures such as, for example, 165.degree. F. However, it is necessary to separate the condensed steam and residual water from the liquid egg during processing. The equipment used for steam pasteurizing liquid eggs is also quite expensive and elaborate.
It is of course possible to pasteurize at lower temperatures without the attendant shortcomings of high temperature methodologies. However, in so doing, sacrifices are made in terms of the degree of microbial kill and extent of the storage stability of the resulting liquid egg product
Electroheating has been used successfully for the heat treatment, and principally the cooking, of food stuffs. A particularly important technique for electroheating is described by Mr. David Reznik, (a co-inventor hereof) in U.S. Pat. No. 4,739,140, the entirety of which is hereby incorporated by reference. Mr. Reznik found that when an AC electric current at a frequency exceeding mains frequency is passed through food, heating of the food can be accomplished without substantial electrolysis or reaction between the food product and the electrodes.
Mr. Reznik's '140 patent does not describe, however, pasteurizing egg. Furthermore, this important work does not discuss any of the unique qualities or unique problems associated with the continuous pasteurization of liquid egg. Liquid egg is unique and when considering its preparation, processing and/or storage a number of often competing criteria must be taken into account, including, without limitation: storage stability, content of potentially pathogenic bacteria, foaming ability, emulsion properties, viscosity, detrimental coagulation, and pourability. Largely because of this complexity and because of practical commercial considerations, the application of Mr. Reznik's original discovery to continuous liquid egg pasteurization was not without difficulty. Originally, such problems as caking on one or the other electrode (particularly at low frequency), detrimental coagulation, odor, and arcing, were observed. The reasons for these problems are not yet completely understood. However, the interplay of the demands of regulatory oversight, commercial desirability, the qualities and properties of liquid egg, and the physical constraints of the original electroheating apparatus design are most likely responsible.
U.S. Pat. No. 4,695,472, (the "'472 patent") discusses methods and apparatus for extending the shelf life of fluid food products including eggs. The methods and apparatus described involve the repeated application of high voltage, high current density, discrete electric pulses to fluid food products. Field strengths used are, at a minimum, 5,000 volts/cm, voltages as high as, for example, 37,128 volts are disclosed. Current densities of at least about 12 amps/cm.sup.2 are also disclosed as are pulse frequencies of between 0.1 and 100 Hz. Preferably, the treatment methods according to the '472 patent involves the application of at least 2 and more preferably at least about 5 high energy pulses to the material being treated. The principal embodiments disclosed in the '472 patent involve the use of direct current. The techniques described in the '472 patent have several disadvantages. Most notably, electrolysis is caused with resultant electrode loss, contamination, and, at least in the case of eggs, detrimental coagulation. To mitigate this problem, the '472 patent requires the use of membranes interposed between the electrodes and the food product being treated. The '472 patent also fails to appreciate that highly functional egg having outstanding storage stability can be obtained without the need for the complicated pulsed electrical treatment disclosed therein.
Most importantly, the '472 reference does not appreciate the difficulties attendant the continuous pasteurization of liquid egg. Specifically, nothing in the '472 patent discusses the problems attendant ensuring the absence of detrimental coagulation. Most notably, even though the '472 patent does describe arcing as a potential problem, the only effect attributed to such arcing is damage to the electrodes. Furthermore, all of the tests conducted in accordance with the '472 patent of liquid egg involve the use of static, bench testing devices at peak voltages of 34,000 volts or higher and currents ranging from between 7,200 and 14,200 amps. No continuous egg processing was undertaken. As will be described further herein, when similar static testing was undertaken by the present inventors using the technology described herein, totally coagulated egg resulted.
To date, the '472 patent has, apparently, not been the subject of commercial use nor are the present inventor(s) aware of any egg product being produced in accordance with its teaching. Thus, whether or not a sufficiently functional egg product can be produced with such methodologies and apparatus is unknown.

Method of electroheating liquid egg and product thereof


A haptic device operated alone or interacts with other physical or virtual devices of similar design that enable users to remotely image, analyze, or manipulate objects, either manually and or with the assistance of computer programs. The device extends and retracts “pins” in reaction to messages from a processor, and to external pressure applied to the pins' topical surface. A support structure provides a constant geometric plane. An operating system is provided that is capable of interaction for any one of a collection of devices of varying size and function. Multiple devices that are paired or otherwise positioned relative to one another, or scaled in size relative to one another, can be controlled to operate in cooperation with one another.

This invention is in the field of haptic devices. Embodiments of the invention are more specifically directed to remote force management by operation of one or more haptic devices.
Conventional computer systems typically interface with their users, and with the "outside world" in general, by way of graphics and text. Even pointing devices (e.g., mouse, trackball, trackpad) operate in a graphical sense, by navigating a cursor among graphical elements. In the industrial context, additional interface approaches include the receiving of inputs from sensors and transducers, and the outputting of motor control signals in either of the digital and analog domains.
Haptic devices refer to those interface devices by way of which computers and computer systems mechanically interface with users or objects, by applying forces, vibrations, or motions from the device to the user or object. Examples of conventional haptic devices include robotic devices for handling or moving an object, for example as controlled by a haptic input device receiving motion inputs from a human user, vibrators in game controllers and other devices for issuing a sensation to the user at the appropriate times in a game or simulator, virtual reality systems by way of which user motion is directly interpreted as inputs, and by way of which the haptic device can receive physical feedback, and the like.
Conventional haptic devices operate according to a variety of mechanisms. A common type of haptic device includes actuators that cause mechanical motion in response to a signal stimulus. Conventional haptic input mechanisms include electroactive polymers for sensing the touch of a user, and actuators including piezeoelectric, electrostatic, and subsonic audio wave elements for transducing touch or pressure to an electrical signal.
It is contemplated that multiple conventional haptic devices may operate in conjunction with one another by way of a shared motor mechanism, such as a lever. However, this shared motor mechanism necessarily enforces a practical limit as to how remote the devices can be from one another, and as to the response of the devices to one another.

Haptic device capable of managing distributed force


A vending machine and a hose controller system for vending machines wherein the dispenser hose is axially and torsionally controlled to facilitate slight twisting, thereby minimizing applicator tool resistance, and making it easier for users to operate the remote vending tool on the hose distal end. The elongated reinforced applicator hose terminates at the controller, which bridges the hose between the outdoors and the cabinet interior. The controller has an angulated bracket mounted within the vending machine cabinet. A collar assembly secured on the bracket top above a hose feed-through orifice has a terminator, a bushing, and a cooperating yoke that are coaxially secured. The terminator anchors the hose end and is seated within the yoke. A rigid lug projects radially from the yoke. A rigid restrictor surmounts the collar assembly and limits rotation by contact with the lug.

1. Field of the Invention
The present invention relates generally to vending machines that operate through external product applicator hoses. More particularly, the present invention relates to so-called coin-operated vending machines of the type commonly employed at self-service car washes that vend selected products to customer vehicles through elongated hoses.
2. Description of the Related Art
Self service, coin-operated car washes customarily include numerous service bays that customers enter to spray-wash their vehicles. Elongated hoses or "wands" terminating in various applicator heads or spray nozzles typically direct a power stream of fluid towards the vehicle being serviced. (The term "coin-operated" refers to self service vending machines that accept coins, credit cards, currency, tokens, or combinations thereof.) As the self-service car wash industry has evolved, products or services other than washing or waxing have become available, and consumer-demand for ancillary car-wash products continues to grow. Thus, modern car washes offer numerous options for detailing cars. As part of a thorough cleaning, the vehicle carpet should be vacuumed. Some vacuum cleaning systems include optional carpet cleaners or spot removers that are applied prior to vacuuming to dislodge stubborn stains. Shampoo applicators are quite common. Spray-applied fragrances are also popular, and various coin-operated, fragrance dispensing machines exist for treating vehicle interiors. Thus most modern car wash installations include one or more coin-operated vacuuming machines, carpet cleaning machines, fragrance applicators and the like. While typical spray-wash and spray-wax services are offered within one of numerous service bays provided by the installation, vending machines for ancillary car wash products are usually mounted outdoors on a special, illuminated service island, proximate a convenient parking space for the customer.
Elongated, reinforced applicator hoses are common in the car wash industry. As mentioned, hand-held spray wands or gun-applicators are typically used in the washing bays. Elongated applicator hoses leading to suitable hand-held suction heads are used by vacuuming machines. Fragrance dispensers typically employ elongated tubular applicator hoses as well. Because vending machines are often subject to theft and vandalism, applicator hoses must be rugged and durable. Typical reinforced hoses include a rugged, metallic tubular core surrounded by an outer, impact resistant plastic cover. Washing hoses are designed for high pressure, high volume use. With vacuuming machines, internal conduits running through the applicator hose interconnect the suction head with the power vacuum motors disposed within the machine cabinet. Spot remover pumps route fluid through separate conduits protected within the applicator hose. Fragrance machines may route one or more low-diameter fragrance lines interiorly through the reinforced applicator hose along with separate electrical control lines running to applicator control switches.
For example, my prior U.S. Pat. No. 4,527,713 issued Jul. 9, 1985 discloses a coin-operated, cabinet-mounted fragrance dispenser for spraying desired fragrances interiorly of vehicles proximate a car wash. An elongated, reinforced applicator hose houses other smaller diameter conduits that route fragrance solutions.
My prior U.S. Pat. No. 5,074,438 entitled "Full Service Car Wash Fragrance Dispensing Machine" discloses a vending machine using a hand-operated applicator gun interconnected with an elongated applicator hose. The machine outputs a dose of fragrance mist during each application. The elongated hose interconnecting the applicator gun and the vending machine coaxially surrounds separate conductive tubes that individually transmit air and fragrance concentrates to an atomizer manifold disposed within the applicator gun.
My prior U.S. Pat. No. 4,968,166 entitled "Carpet Cleaning Machine With Foaming Control Block With Heater And Brush" discloses a coin operated carpet and upholstery vending machine that vigorously cleans automotive interiors. An elongated hose extending from the unit enclosure terminates in hand-held brush which outputs foam. In use the hand-held is forcibly rubbed against the carpet during cleaning.
Finally, my prior design patent, U.S. Pat. No. 381,477, discloses a vacuum cleaner that offers both fragrances and shampoo. Again, an elongated applicator hose is included
In almost all cases the "business end" of the applicator hose includes a suitable, hand-held tool. With sprayers, this may be an ergonomically designed gun that is easy to hold and manipulate. With simpler spray designs, a mere wand is employed. With the carpet cleaning machine mentioned above, a manually operated, foaming carpet brush is employed. In any case, as the user of the applicator tool moves it about during normal use, the applicator hose will inevitably be twisted a predetermined amount. In other words, user wrist and arm movements will tend to twist the applicator tool, and such twisting movements are mechanically transmitted directly to the applicator hose. Since modern vandal-resistant, applicator hoses are extremely rugged and durable, the twisting moments applied at their terminal end will be transmitted to the opposite end that is routed into the vending machine. It is imperative that the vending machine connection be secure; the connection must resist axial and torsional forces. Since numerous wires and conduits or smaller hoses may be routed through the applicator hose, and since they are interconnected interiorly of the vending machine to critical parts, they must not be rotated too much.
Thus, the hose connection point must limit axial and torsional stress. However, if torsional deflections are prevented completely by an overly rigid connection, movements of the applicator tool at the opposite hose end will be resisted. Where hose rotation is not allowed, the remote applicator tools will be difficult to maneuver. Resistive forces from the cabinet-hose junction that are transmitted back to the hand tool will interfere with customer freedom of movement.


The present invention is directed to a method for the production of D,L-aspartic acid. The method comprises reacting an unsaturated dicarboxylic acid or anhydride, such as, maleic acid, fumaric acid, maleic anhydride, or mixtures thereof, with excess aqueous ammonia at an elevated temperature and pressure for a time sufficient to produce diammonium D,L-aspartate. The produced diammonium D,L-aspartate is then neutralized to D,L-aspartic acid. Excess unreacted ammonia and various by-products may be recycled and re-used in the method, thereby minimizing waste and reducing cost. The produced D,L-aspartic acid may be subsequently used to make polyaspartic acid.

D,L-aspartic acid is useful for the production of polysuccinimide and polyaspartic acid. Poly-alpha,beta-D,L-aspartic acid, copolymers of poly-alpha,beta-D,L-aspartic acid, and their salts are generally water soluble, biodegradable polymers useful in a variety of applications. Such applications include detergent formulations, water treatment, oral hygiene products, pharmaceuticals, agricultural applications, oil production, cosmetics, and personal care products, such as hair and skin care products.
Polyaspartates can be manufactured by polymerization of D,L-aspartic acid and L-aspartic acid, or by polymerization of maleic acid in the presence of ammonia. The polyaspartates derived from D,L-aspartic acid and L-aspartic acid are generally useful in a wide variety of applications. Such applications include uses as mineral scale inhibitors in water treatment; scale and corrosion inhibitors in oil production; humectants in personal care products; and, nutrient absorption enhancers in agriculture. However, the polyaspartates derived from maleic acid and ammonia are not suitable for use in many applications due to limitations on molecular weight or color.
L-aspartic acid is the only form of aspartic acid which is currently available on a large commercial scale. L-aspartic acid is used in the manufacture of the artificial sweetener, aspartame. The manufacture of L-aspartic acid involves the use of fermentation or other biotechnology processes and can be expensive.
The production of D,L-aspartic acid by various methods is known in the art. Polish Pat. No. 133691 and Polish Pat. No. 143183 disclose the production of D,L-aspartic acid by reacting maleic acid and ammonia in the presence of a large amount of ammonium chloride at an elevated temperature and pressure. The resulting diammonium salt of aspartic acid is acidified with hydrochloric acid to afford a 60% yield of D,L-aspartic acid. However, for every mole of aspartic acid produced by the disclosed process, four moles of ammonium chloride are produced as waste. Inclusion of a large amount of ammonium chloride and the acidification with hydrochloric acid are undesirable process expedients because of the added waste produced, and because of the corrosive nature of such additives which requires special process equipment.
East German Pat. No. DD126075 discloses a method for the manufacture of D,L-aspartic acid in which maleic anhydride is neutralized with aqueous ammonia at a normal pressure and an elevated temperature. An additional solvent, N-formylacetamide, is added and the solution is heated at 120-130 degrees C. Hydrochloric acid is then added to the reaction mixture to yield D,L-aspartic acid. However, the N-formylacetamide is destroyed in this process, creating undue waste and added expense. Inclusion of an additional solvent, such as N-formylacetamide, in the method of the present invention would have a deleterious effect because of the added waste and expense. In addition, carrying out the method of the present invention at a normal, rather than an elevated pressure, would have an adverse effect on the formation of the reaction product.
U.S. Pat. No. 4,839,461 to Boehmke teaches the production of polyaspartic acid by reacting maleic acid and ammonia. The products can be converted into D,L-aspartic acid by treatment with hydrochloric acid. The process of Boehmke teaches the addition of a metal hydroxide or ammonium hydroxide, the reaction of maleic acid and ammonia in a molar ratio of 1:1-1.5, and the production of monoammonium salt.
In addition, methods of manufacturing polymers of aspartic acid are known. U.S. Pat. No. 5,219,952 to Koskan et al. teaches the production of high molecular weight polysuccinimide and high molecular weight polyaspartic acid from maleic anhydride and ammonia. U.S. Pat. No. 5,292,858 to Wood teaches the production of copolymers of polyamino acids. U.S. Pat. No. 5,373,088 to Koskan et al. teaches the production of polyaspartic acid from maleic acid and ammonia. U.S. Pat. No. 5,491,213 to Batzel teaches the production of polysuccinimide by reacting an unsaturated dicarboxylic acid or anhydride with a particulate ammonium salt.
The known methods for producing D,L-aspartic acid have several disadvantages. They are more costly because additional reactants and more expensive plant equipment must be used, thus increasing the cost. They are more wasteful because various end products and by-products are discarded rather than recycled back into the process.
Therefore a need exists for a more efficient and low-cost method of producing D,L-aspartic acid that simultaneously yields a high amount of product. The method of the present invention overcomes the problems associated with the known methods of making D,L-aspartic acid by recovering and recycling excess ammonia used in the method, as well as recovering and recycling various additional by-products for re-use in the method. Such recycling of products reduces waste and provides for a more efficient method of production. Thus, the present invention provides an efficient, cost-effective method for the manufacture of D,L-aspartic acid.


A method of controlling the charge current during charging of a lithium-ion battery. A battery charging controller is based on a Kalman filter, which uses estimated battery states to generate a feedback metric to continually adjust a battery cell model. The battery cell model then delivers data to an optimization process that generates the charge current.

A lithium-ion battery is a type of rechargeable battery. Lithium-ion batteries are used for diverse applications such as portable electronics and electric vehicles and are growing in popularity for many additional applications.
In these batteries, lithium ions move from a negative electrode through an electrolyte to a positive electrode during discharge, and back when charging. Lithium-ion batteries use an intercalated lithium compound as the material at the positive electrode and typically graphite at the negative electrode.
Research is ongoing for lithium-ion batteries in areas such as battery life extension, energy density, safety, cost reduction, and charging speed. One field of research is investigation of "lithium plating", which occurs during certain charging conditions and can be detrimental to battery life and safety. The phenomena of lithium plating has been difficult to analyze and prevent.

Control of lithium plating of lithium-ion battery during charging


An interposer assembly includes an insulating plate with passages extending through the thickness of the plate and metal contacts in the passages. The contacts have resilient upper and lower contact arms that deflect into upper and lower recesses of the plate when sandwiched between contact pads of overlying and underlying circuit members. The recesses are sized to accommodate solder connections between contact arms and contact pads.

The invention relates to interposer assemblies used for forming electrical connections between spaced contact pads on circuit members.
Interposer assemblies are used for forming electrical connections between densely spaced contact pads on adjacent parallel circuit members. Commonly, the circuit members are a circuit board and a ceramic plate carrying integrated circuits. The pads on the members are arranged in identical patterns.
The interposer assembly includes an insulating plate and a plurality of through-contacts carried in the plate and arranged in the same pattern as the pads on the circuit members. The assembly is sandwiched between upper and lower circuit members to form electrical connections between opposed pairs of contact pads.
In one type of interposer assembly, the lower circuit member is permanently held against the bottom side of the plate before the upper circuit member is pressed against the plate. The contact pads on the lower circuit member are soldered to the contacts. This enables the interposer assembly and lower circuit member to form a subassembly that is assembled later with the upper circuit member to interconnect the circuit members.
The contact pads on the lower circuit member each include a solder layer to form the soldered connections. The lower circuit member is pressed against the bottom side of the plate with the solder layer on the pads engaging the contacts. The lower circuit member and interposer plate are placed in a reflow oven to melt the solder layer and solder the contacts and contact pads together. The solder connections form reliable mechanical and electrical connections between the contacts and contact pads and hold the lower circuit member firmly against the plate.
The contacts project above the top surface of the plate of the soldered subassembly. The upper circuit member is pressed against the upper side of the plate with the contact pads on the upper member engaging the contacts. The upper circuit member is held against the plate with the contacts forming electric connections between aligned pairs of pads.
Interposer assemblies form electrical connections between contact pads arranged in very close proximity to each other. The pads may be arranged on a one millimeter center-to-center grid. A number of interposer assemblies may be mounted on a single frame, with thousands of contacts in the frame. In addition to requiring closely spaced contacts, the contacts must make reliable electrical connections with the pads when the assemblies are sandwiched between the circuit members. Failure of a single contact to make a reliable connection renders the entire frame useless.
A low mechanical closure force is required in order to prevent undue stress on a ceramic circuit member. A high closure force could distort or possibly break the ceramic member. Further, interposer assemblies must occupy a minimum width between the circuit members. The contacts must compress and enable the circuit members to be flush against the plate. The contacts must be compliant or resilient enough to deform with a lower closing force and yet must be sufficiently stiff to establish reliable electrical connections between pairs of contact pads.
Conventional interposer assemblies in which one circuit member is soldered to contact pads have contacts that are relatively rigid after being soldered to the contact pads. A high closing force is required to press the other circuit member flush against the interposer plate.
On occasion it may be necessary to replace a circuit member with a substitute circuit member if a defect were found after pressing the circuit member against the interposer plate. The is compressed contacts do not have sufficient resiliency to return to their original projections above the plate after removal of the circuit member. Reengagement of the contacts with the contact pads of the substitute circuit member often results in failure of one or more contacts to form electrical connections.
The invention is an improved interposer assembly including metal through contacts confined in closely spaced passages extending through an insulating plate. The contacts have resilient upper and lower contact arms that space contact surfaces away from opposite sides of the plate. The contact arms can be compressed against contact pads of circuit members with a low closing force. However, the contact arms are sufficiently resilient to return the contact surfaces away from the plate for reengagement with contact pads if necessary to permit adjustment or replacement of the circuit member.
The upper and lower contact arms of each contact are compressed by the contact pads independently of one another. This permits the contact pads of one circuit member to be soldered to the contact arms on one side of the plate prior to assembly of the interposer assembly with the other circuit member. The compression of the contact arms by the one circuit member does not affect the resiliency and shape of the contact arms on the other side of the plate. The contact arms on the opposite side of the plate remain in position to form reliable pressure connections or solder connections with the contact pads of the other circuit member.
An interposer assembly having features of the present invention includes an insulated plate and a number of metal contacts carried in the plate. The plate is formed from a single piece of insulating material. A number of single contact passages are in the plate, each contact passage including a slot extending through the thickness of the plate, an upper recess extending away from the slot and open to the top surface of the plate, and a lower recess extending away from the slot and open to the bottom surface of the plate. The slot includes a nominal width portion extending from the top surface of the plate and a reduced width portion extending from the bottom surface of the plate. A transverse wall joins the slot portions.
Each contact includes a body portion in a passage slot, with upper and lower contact arms extending from the body portion. A contact surface is on each contact arm, the distance between the contact surfaces greater than the thickness of the plate when the contact arms are unstressed. The contact body portion has a nominal width portion in the nominal width portion of the slot and a reduced width portion in the reduced width portion of the slot and includes an abutment surface abutting the transverse wall of the slot to locate the contact in the contact passage. The upper contact arm extends into the upper recess and overlies a recessed floor of the upper recess and the lower contact arm extends into the lower recess and overlies the floor of the lower recess of the passage.
When a circuit member is pressed against the lower contact arms, each contact arm engages the floor of the lower recess to maintain the position of the contact in the passage slot. This enables the sets of upper and lower contact arms to be deflected essentially independently of one another.
The compressed contact arms move entirely within the upper and lower recesses when the plate is compressed between circuit members. The lower set of recesses is sized to accommodate solder connections in the recesses to enable soldering of the lower contact arms to contact pads. Preferably the upper recesses are also sized to accommodate solder connections in the recesses. This permits identical plates to be used having contacts with upper contact arms configured to form pressure connections or upper contact arms configured to form solder connections to electrically connect with contact pads.

Interposer assembly for soldered electrical connections


A set of at least two masks, coordinated with one another, for the projection of structure patterns, into the same photosensitive layer arranged on a semiconductor wafer. The first mask includes a semitransparent or nontransparent first layer, which is arranged on a first substrate and in which at least one first opening is formed at a first position, the first opening having a first lateral dimension, which is greater than the resolution limit of a projection system for the projection of the structure patterns. The second mask includes a semitransparent or nontransparent second layer, which is arranged on a second substrate and in which at least one dummy structure assigned to the first opening is formed at a second position, the dummy structure having a second lateral dimension, which is smaller than the resolution limit of the projection system wherein the first position on the first mask corresponds to the second position on the second mask.

In the field of semiconductor technology, integrated circuits are usually produced by progressive projection of structure patterns, formed on masks, onto a semiconductor wafer coated with a photosensitive resist and a subsequent transferring of the structure pattern into layers respectively arranged underneath the resist. In order to further advance the miniaturization of structure sizes within the structure patterns in semiconductor technology, so-called resolution enhancement techniques (RET) are increasingly being resorted to for the projection. These involve, in addition to illumination methods such as off-axis illumination or structure-specific methods such as optical proximity correction (OPC), primarily innovative mask techniques such as phase masks, for example.
With regard to the resolution that can be achieved on a semiconductor wafer by an exposure device in a projection, the best results are obtained specifically by the type of alternating or chromeless phase masks. Alternating phase masks are particularly suitable for the projection of a dense line-gap pattern formed on such a mask type and having a width ratio of lines to gaps of about 1:1.
However, phase conflicts may occur in the case of the aforementioned types of phase masks. In the case of an exposure, the phase conflicts lead to undesirable, still unexposed resist structures in a photosensitive layer arranged on the semiconductor wafer. With the aid of a second or trimming exposure, the resist structures may subsequently be exposed and removed in a downstream development process.
Trimming masks are known which have light-transmissive openings within a nontransparent chrome layer on a substrate, which openings can be projected onto the resist structures of an alternating or chromeless phase mask which have already been produced by phase conflicts. With the aid of further openings in the chrome layer, it is possible, moreover, to expose further structure elements of a structure pattern having dimensions that are not so small and are thus not critical in the photosensitive layer. In this way, with the aid of a set of two masks with structure patterns coordinated with one another, it is possible to image extremely small dimension-critical structure elements besides larger and therefore less critical structure elements.
Trimming masks are typically formed as dark field masks, i.e., the structure elements to be formed on a wafer are formed as openings in a nontransparent or at least semitransparent layer on the substrate of the mask. The trimming masks are also referred to as secondary masks. Alternating phase masks are generally likewise present as dark field masks.
With the use of the phase masks of the alternating or chromeless type, a comparatively large lithographic process window can be obtained for many structure geometries, for example, of line-gap patterns. A lithographic process window represents the ranges of values of exposure dose and focus which are necessary in the event of a projection onto a wafer for not exceeding a specific structure width tolerance.
However, there are specific structure geometries for this mask type, in particular, line-gap patterns having a very special line-to-width ratio that differs from 1:1, for which, in particular, only a small process window can be obtained even using alternating or chromeless phase masks. In particular, a depth of focus that is too small for application in circuit fabrication is achieved in this case. It is usually the case that such structure patterns cannot be imaged with sufficient quality even by a second exposure with the aid of a trimming mask.
One albeit inadequate solution to the existing problem consists in excluding, as early as during the preparation for the purpose of forming the structure pattern on the mask, those widths of individual structure elements or periods of regular patterns for which only a very small process window may be expected for the structure element, for example, on account of experimental or simulator-based investigations. In order nevertheless to be able to realize the desired structure patterns with their functionality in the later completed integrated circuit, it is thus necessary to create designs which satisfy the exclusion criteria mentioned.
This leads to an increased complexity at least in the design of the component. There may also be limitations in the functionality made possible by the layout. This often also results in an enlargement of the circuit area, which may also result in higher costs for fabrication due to the smaller number of circuits per wafer.

Set of at least two masks for the projection of structure patterns


A semiconductor memory chip has fuses and a redundancy memory cell which can replace a normal memory cell that is found defective by cutting off the fuses. If the normal memory cell is defective, the fuses are cut off thereby to connect the redundancy memory cell instead of the normal memory cell which is defective. The entire surface of the semiconductor memory chip is coated with a resist layer. The coated the resist layer is exposed at regions of the fuses to an energy beam, and then developed form a resist pattern. The semiconductor memory chip is etched at the regions using the resist pattern as a mask for thereby cutting off the fuses. The fuses may be spaced at intervals of 2 .mu.m or smaller, and can be cut off without causing damage to a layer beneath the fuses.

1. Field of the Invention
The present invention relates to a method of repairing a semiconductor memory by disconnecting a defective memory cell and connecting instead a redundancy memory cell in the semiconductor memory chip. The present invention is also concerned with an electron-beam memory repair apparatus and a redundancy memory circuit to which the method of repairing a semiconductor memory is applicable.
2. Description of the Prior Art
FIG. 1 of the accompanying drawings shows a semiconductor memory in a semiconductor memory chip on a semiconductor wafer, which includes a redundancy memory circuit comprising a redundancy cell. The semiconductor memory also includes normal memory cells 100 having 512 normal data lines with addresses 0.about.511, for example, and an address decoder 101 comprising logic gates 101a having respective output lines that are connected respectively to the 512 normal data lines through fuses 104a. Output addresses are selected by address lines A.sub.0 , A.sub.0, A.sub.1 , A.sub.1, . . . . The address line A.sub.0 represents an inversion of the address line A.sub.0.
The redundancy memory circuit includes a decoder 103 whose output is connected to a redundancy memory cell 102 through a redundancy data line. The address lines A.sub.0 , A.sub.0, A.sub.1 , A.sub.1, . . . are connected through respective fuses 104b to the inputs of the decoder 103. The redundancy memory circuit, which is made up of the redundancy memory cell 102, the redundancy data line, the decoder 103, and the fuses 104b, is normally in a disabled state. When an enable signal is applied, the disabled state of the redundancy memory circuit is canceled, and the output thereof is made effective.
The redundancy data line of the redundancy memory cell 102 in the redundancy memory circuit corresponds to the normal data lines of the normal memory cells 100. If the normal memory cell connected to the normal data line connected to the uppermost logic gate 101a, for example, is defective, then the fuse 104a connected to the output of the logic gate 101a is cut off, and fuses 104b connected to the input of the decoder 103 are cut off to use the redundancy data line connected to the redundancy memory cell 102 instead of the normal data line connected to the defective memory cell. In this manner, the normal data line connected to the defective memory cell is rendered ineffective, and the disabled state of the redundancy memory circuit is canceled by an enable signal, making effective the output of the redundancy memory cell 102 which is connected to the redundancy data line.
The fuses 104a, 104b are generally cut off by a laser-beam fuse cutting process. The principles of the laser-beam fuse cutting process will be described below with reference to FIGS. 2(a) through 2(d) of the accompanying drawings.
As shown in FIGS. 2(a) through 2(d), a semiconductor memory fuse region comprises an Si substrate 200, an insulating film 201 of SiO.sub.2 disposed on the Si substrate 200, a fuse layer 202 disposed on the insulating film 201 as an interconnection layer of aluminum, polysilicon, or the like, and an insulating film 204 of SiO.sub.2 disposed on the fuse layer. When a laser pulse shown in upper areas of FIGS. 2(a) through 2(d) is applied to the semiconductor memory fuse region, the energy of the applied laser pulse is absorbed by the fuse layer 202, whose temperature increases, as shown in FIG. 2(a). When the temperature of the fuse layer 202 rises, the energy absorption rate of the fuse layer 202 increases, resulting in an intensive pressure buildup in the fuse layer 202. The intensive pressure buildup in the fuse layer 202 causes the upper insulating film 201 of SiO.sub.2 to explode, allowing the fuse layer 202 to be vaporized, as shown in FIG. 2(b). When any remaining fuse layer is vaporized by the energy of a final portion of the laser pulse, the laser pulse reaches the lower insulating film of SiO.sub.2 (see FIG. 2(c)), which is slightly vaporized (see FIG. 2(d)). The fuse is cut off in the manner described above.
The laser-beam fuse cutting process is usually carried out by a mechanism which positions a laser beam quickly and highly accurately to a given fuse position in a semiconductor memory chip and applies the laser beam to cut off the fuse in the fuse position. The mechanism cuts off the fuse based on repairable wafer chip information and defective data line address information which have been obtained from a preliminary test conducted prior to the repairing process.
Recent highly integrated semiconductor memory chips are reduced in size by positioning fuses according to design rules which are employed so as to minimize the area which is occupied in the memory chip area by the fuses. There are strong demands for lowering the cost of the semiconductor memory chips. However, the conventional laser-beam fuse cutting process suffers the following shortcomings:
(1) The laser-beam fuse cutting process is required to selectively blow off only desired fuses in a manner to minimize damage to surrounding and lower silicon substrate regions. To meet such a requirement, it is necessary to use a laser beam having a wavelength which is equal to or longer than the infrared wavelength range. Because of the wavelength limitation, the laser beam spot diameter cannot be smaller than about 2.5 .mu.m. PA1 (2) The positioning error of the mechanism for positioning a laser beam quickly and highly accurately to a given fuse position in a semiconductor memory chip is determined by the mechanical accuracy of the mechanism, and has a practical limit of about 0.3 .mu.m.
In view of the above two drawbacks of the conventional laser-beam fuse cutting process, it has been technically difficult to reduce the interval between fuses in a semiconductor memory chip to a distance of 2 (m or smaller. Therefore, efforts to minimize the area occupied by fuses in semiconductor memory chips have been subject to limitations.
In recent semiconductor memories, fuses are formed in the same layer as metal interconnections such as of aluminum or the like for the following reasons:
Semiconductor memories have a plurality of interconnection layers with metal interconnections in the uppermost layer and polysilicon interconnections in the lowermost layer. If the lowermost interconnection layer is used as a fuse layer, then it is necessary to etch back insulating and interconnection layers above the fuse layer in the vicinity of fuse regions. Due to variations in the thicknesses of the insulating and interconnection layers and also variations in the etchback process, it has been difficult to leave an insulating layer of stable thickness on the fuse layer in the environment of multiple interconnection layers. Consequently, fuses are generally formed in the uppermost layer.
The metal of the uppermost layer has a very high reflectance with respect to an infrared laser beam. Light that has entered the uppermost layer is absorbed by the surface thereof owing to the skin effect, and cannot reach a lower portion of the uppermost layer. For this reason, the power of the laser beam needs to be increased in order to cut off fuses in the uppermost layer. With the increased laser beam power, the layer underneath the uppermost layer tends to be damaged when fuses are cut off. It has thus been highly difficult to cut off minute fuses stably with a laser beam.

Method of repairing semiconductor memory, electron-beam memory repairing apparatus and redundancy memory circuit to which the method of repairing semiconductor memory is applicable


The present invention is a dye-sensitized solar cell module provided with a pair of mutually opposed electrodes, partitions that connect the pair of electrodes and form a plurality of cell spaces together with the pair of electrodes, and an electrolyte filled into the cell spaces, wherein one electrode of the pair of electrodes has oxide semiconductor portions that face each of the plurality of cell spaces and are loaded with a photosensitizing dye, at least one electrode of the pair of electrodes is composed of at least two layers, the thickest layer is a metal substrate having a thickness of 100 μm or less or a resin film having a thickness of 500 μm or less, and the electrode containing the metal substrate or the resin film has a bending portion that bends so as to protrude towards the opposing electrode.

Dye-sensitized solar cell modules are attracting attention for use as photoelectric conversion elements since they allow the obtaining of high photoelectric conversion efficiency at low cost, and various studies have been conducted on the development of these dye-sensitized solar cell modules.
Dye-sensitized solar cell modules typically are provided with a working electrode, counter electrode, photosensitizing dye loaded on the working electrode, partitions that divide the space between the working electrode and counter electrode into a plurality of cell spaces, and an electrolyte arranged in each of the cell spaces.
As such a dye-sensitized solar cell module, a dye-sensitized solar cell module obtained by, for example, superimposing a working electrode and counter electrode with encapsulating materials serving as partitions and an electrolyte interposed between the working electrode and the counter electrode at atmospheric pressure or lower and at a pressure equal to or lower than the vapor pressure of the electrolyte and then adhering with the encapsulating materials is known (Patent Document 1).

Dye-sensitized solar cell module and manufacturing method for same


To prevent increase in stress on a soldered join between a terminal pin and a circuit board in the event of thermal expansion, a support (22) with a larger diameter and a recess (21) with a smaller diameter are formed on a terminal pin (20). An alignment plate (30) is arranged to be movable with respect to a connector housing (11) between a support position in which the support member (22) is a close fit in a position fixing hole (31), and a release position in which the recess (21) is a loose fit. This eliminates the increase in stress on the soldered portion (M) due to differing rates of thermal expansion and contraction of the circuit board (P) and alignment plate (30).

As shown in FIG. 17 of this specification, a base plate connector has a plurality of long and thin terminal pins 3 which protrude from the rear face of a connector housing 2 and bend downwards. The anterior ends of the terminal pins 3 are aligned so as to fit with connecting holes H formed in a circuit base plate P. It is arranged so that, when attachment is carried out, the connector housing 2 is fixed at a specified position on the circuit base plate P, the anterior end of the terminal pins 3 being inserted 15 into the connecting holes H and being fixed by means of soldering M. The terminal pins are easily bent out of position, and so the connector housing 2 has an alignment plate 4 fixed thereon, this alignment plate 4 serving as a means for carrying out with certainty the insertion operation of the terminal pins 3 into the connecting holes H. The alignment plate 4 has position fixing holes 5 that correspond to the connecting holes H of the circuit base plate P. The anterior ends of the terminal pins 3 pass through the position fixing holes 5 and as a consequence the mutual positioning among the terminal pins 3 comes to correspond to the alignment of the connecting holes H.
In the state where the base plate connector 1 is attached to the circuit base plate P, if the connector housing 2, the alignment plate 4, and the circuit base plate P are subjected to a temperature change, due to the differing rates of thermal expansion of the different materials used, there is a possibility of a force applying so as to cause a relative shift in position between the position fixing holes 5 and the connecting holes H along a direction that is transverse to the terminal pins 3. However, in the case of the conventional alignment plate 4, since it is necessary to fix the position of the terminal pins 3 with a high degree of accuracy, the position fixing holes 5 are arranged to be of the minimum necessary size in order to prevent sideways movement of the terminal pins 3, as shown in FIG. 18. For this reason, if a transverse force applies so that the position fixing holes 5 shift in position with respect to the connecting holes H, this force is transmitted to the soldered portions M via the terminal pins 3, and stress on the soldered portions M increases. This may weaken or break the electrical connection.
The present invention has been developed after taking the above problem into account, and aims to prevent an increase in stress on the soldered portions joining the terminal pins to the circuit base plate as the ambient temperature changes.
According to the invention, there is provided a connector for attachment to a printed circuit board which comprises a connector housing having a plurality of elongate electrical terminals projecting therefrom in a first direction and an alignment member attached to said housing. The housing is adapted to retain the free ends of said terminals in a substantially fixed orientation with respect to the housing. The alignment member is movable with respect to the housing in the first direction from a temporary position to a final position. The terminals are tightly retained by said alignment member in the temporary position and loosely retained by said alignment member in the final position.
Such an alignment member has the advantage that the terminals are tightly retained for positioning with respect to the circuit board or other electrical component, yet are free to move relative to the alignment member once in the final position.
Preferably the alignment member is substantially planar and has a plurality of apertures to receive the tips of the terminals in sliding relationship. The apertures are preferably enlarged on the side of the circuit board or component to accommodate solder; this ensures that the eventual soldered connection of the terminals is strong and electrically sound.
In a preferred embodiment the terminals are waisted immediately behind the tip so as to be a loose fit in the alignment member when it has been moved to the final position. Alternatively, the terminal can be flanged outwardly behind the tip, and the flanged portion arranged to be a tight sliding fit in a respective aperture. In the final position the flange is moved out of the aperture to leave the terminal in said aperture with clearance.
The alignment member is preferably retained on the housing by detent means whereby it can be snapped from the temporary to the final positions. In the case where the components are of plastic or resin material the alignment member may have opposite projections for engagement in opposite parallel recesses of the housing. These recesses may comprise opposite parallel grooves to retain opposite edges of the alignment member, two grooves being provided on each side to define the temporary and final positions.
Preferably the alignment member is arranged between the housing and the circuit board or other electrical component. This arrangement ensures that simple pressure on the housing can automatically snap the alignment member to the final position where it remains sandwiched in place. This has the further advantage that the alignment member cannot move relative to the housing and thus place stress on the soldered connection of the terminals.


A new fire suppression device for suppressing a fire within a predetermined radius of the fire suppression device. The inventive device includes a housing having upper and lower housing portions. The housing portions are positionable between an opened position and a closed position. A tank that is disposed between the housing portions holds a flame retardant substance such as halon or a dry chemical. The outer perimeter of the tank is substantially exposed to the area outside the housing when the housing portions are in the opened position. A plurality of tubes outwardly extend from the outer perimeter of the tank. The flame retardant substance passes from the interior of the tank through the tubes when the housing portions are in the opened position.

1. Field of the Invention
The present invention relates to fire extinguishing devices and more particularly pertains to a new fire suppression device for suppressing a fire within a predetermined radius of the fire suppression device.
2. Description of the Prior Art
The use of fire extinguishing devices is known in the prior art. More specifically, fire extinguishing devices heretofore devised and utilized are known to consist basically of familiar, expected and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which have been developed for the fulfillment of countless objectives and requirements.
Known prior art fire extinguishing devices include U.S. Pat. No. 4,643,260; U.S. Pat. No. 3,993,138; U.S. Pat. No. 3,865,192; U.S. Pat. No. 5,018,586; U.S. Pat. No. 4,214,631; and U.S. Pat. No. Des. 355,862.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not disclose a new fire suppression device. The inventive device includes a housing having upper and lower housing portions. The housing portions are positionable between an opened position and a closed position. A tank that is disposed between the housing portions holds a flame retardant substance such as halon or a dry chemical. The outer perimeter of the tank is substantially exposed to the area outside the housing when the housing portions are in the opened position. A plurality of tubes outwardly extend from the outer perimeter of the tank. The flame retardant substance passes from the interior of the tank through the tubes when the housing portions are in the opened position.
In these respects, the fire suppression device according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of suppressing a fire within a predetermined radius of the fire suppression device.


An automatic dishwashing appliance comprising an unattached electrolytic device which comprises an unattached electrochemical cell capable of generating electrolyzed water in the wash and/or rinse cycle, and more particularly to the unattached electrolytic device itself, methods of use, and articles of manufacture.

Electrochemical cells for use in automatic dishwashing appliances are designed to operate by making use of the water electrolysis process wherein, at the anode-water interface, OH− being present in water due to electrolytic dissociation of water molecules donates an electron to the anode and can be thereby oxidized to oxygen gas which can be removed from the system. As a result, the H+ concentration can be enhanced at the anode-water interface so that H+ enriched acidic water can be produced. In a similar manner, at the cathode-water interface, H+ accepts an electron from the cathode and can be reduced to hydrogen to form hydrogen gas which can be similarly eliminated from the system so that the OH− concentration can be increased at the cathode-water interface whereby OH− enriched alkaline water can be generated. Further, when halogen ion containing water (such as, natural water containing sodium chloride or an aqueous solution of sodium chloride) is subjected to electrolysis, halogenated mixed oxidants are generated in the electrolyzed water.
The following references disclose use of electrochemical cells: U.S. Pat. Nos. 5,932,171; 4,481,086; 4,434,629; 4,493,760; 4,402,197; 5,250,160; 5,534,120; 5,865,966; 5,947,135; JP Application No. 10057297A; JP Application No. 10179489A; JP Application No. 10033448A; JP Patent No. 09122060; JP Patent No. 2000116587; JP Patent No. 10178491; and EP Application No. 0983806A1.
The following references are also related to electrolyzed water: U.S. Pat. Nos. 3,616,355; 4,048,047; 4,062,754; 4,100,052; 4,328,084; 4,761,208; 5,314,589; 5,395,492; 5,439,576; 5,954,939 (equiv. EP 711,730); and WO 00/34184.
U.S. Pat. No. 4,402,197 encompasses in-line generation of hypochlorite from saline using an attached, non-partitioned electrochemical cell. U.S. Pat. No. 5,534,120 describes an attached, non-partitioned electrochemical cell, which can optionally separate the acidic/alkaline ionized water streams separately in the treatment of dishware. U.S. Pat. No. 5,947,135 describes the use of an attached, partitioned electrochemical cell that produces separate anolyte/catholyte streams for cleaning and disinfection of tableware. JP Application No. 10033448A discloses the use of an attached electrochemical cell in conjunction with an alkaline cleaning agent containing enzymes to clean tableware.
A problem with using attached electrochemical cells in automatic dishwashers can be that the electrochemical cells eventually become fouled from scaling and no longer function efficiently which can be difficult to remedy. Several remedies have been proposed. For example, JP Application No. 10057297A and U.S. Pat. No. 5,954,939 reduce scale formation in the electrochemical cell by electrode polarity reversal. WO Patent Number 00/64325 and U.S. Pat. No. 4,434,629 incorporate the electrochemical cell as part of a water softening system to reduce scaling. U.S. Pat. No. 5,932,171 provides an electrode cleaning composition, such as a source of acid or other descaler, to purge the electrochemical cell. Such remedies to descaling of attached electrochemical cells in automatic dishwashing appliances in the above references can increase the manufacturing cost of the appliance (e.g. polarity reversal, water softeners) or are inconvenient, temporary fixes (e.g. cleaning solutions) that require regular consumer attention.
Another problem of attached electrochemical cells can be that consumers should buy brand new, often expensive, automatic dishwashing appliances to experience the benefits of using electrolyzed water. It has now surprisingly been found that the use of an unattached electrolytic device, comprising an electrochemical cell, offers an efficient and convenient alternative to the abovementioned problem. In this case, either the unattached electrolytic device itself or its replaceable components can be exchanged for new. For instance, a consumer can decide to replace the disposable electrochemical cell in the unattached electrolytic device. If the consumer later desires to replace the unattached electrolytic device itself, this can also be done. This can be especially advantageous in automatic dishwashing appliances where consumer convenience can be desired.
Furthermore, the unattached devices of the present invention can be used with existing residential and commercial automatic dishwashing appliances, allowing consumers to experience the benefits of electrolyzed water in their current appliance without having to upgrade.

Self-contained, self-powered electrolytic devices for improved performance in automatic dishwashing


Systems and methods for steering an optical path to gain access to data locations in a holographic memory cell (HMC). One of the systems includes: (1) first and second reflective elements locatable to receive and reflect a complex, spatially-modulated incident beam of light, (2) a reflective element steering mechanism, coupled to the first and second reflective elements, that moves the first and second reflective elements to steer the incident beam in a desired direction and (3) an HMC rotating mechanism, couplable to the HMC, that rotates the HMC about an axis thereof, the reflective element steering mechanism and the HMC rotating mechanism cooperating to cause the incident beam to illuminate a location on a plane of the HMC that is a function of a movement of the first and second reflective elements and a rotational position of the HMC.

Most modern processing systems, including personal computers (PCs), rely on one form or another of optical data storage. For example, CD-ROM drives are now standard equipment on nearly all new PCs. Nearly all multimedia software, including video games, maps, encyclopedias, and the like, are sold on CD-ROM. Also, compact discs are the most prevalent storage medium for musical recording. More recently, digital video disc (DVD) technology has been introduced that will expand the storage capacity of standard CD technology from about one-half gigabyte to about five gigabytes.
The large storage capacities and relatively low costs of CD-ROMs and DVDs have created an even greater demand for still larger and cheaper optical storage media. Many large businesses rely on jukebox-style CD changers in order to access a particular one of potentially hundreds of discs. Motion pictures released in optical storage format still require multiple CDS or oversized laser discs. However, it appears that the limits of CD-ROM and DVD technology are being reached. In order to continue to improve the capacity and speed of optical storage systems, research increasingly focuses on holographic storage devices capable of storing hundreds of gigabytes in a CD-sized storage medium.
A number of holographic data storage systems have been developed that are capable of storing and retrieving an entire page of data at a time. In these systems, data to be stored is first encoded in a two dimensional (2D) optical array, for example on a liquid crystal display (LCD) screen, which is one type of spatial light modulator (SLM). Another type of SLM is Texas Instruments' Digital Mirror Device, which is a reflective device that allows the reflectivity of each pixel to be changed. The term "SLM" also includes fixed masks of varying optical density, phase, or reflectivity.
A first laser beam, called an object beam, is transmitted through the SLM and picks up an intensity pattern from the data squares and rectangles (pixels) in the 2D array. The data-encoded object beam is ultimately projected onto and into a light-sensitive material, called a holographic memory cell (HMC). A second laser beam, called a reference beam, is also projected onto and into the holographic memory cell. The object beam and the reference beam then cross to produce an interference pattern throughout a volume element of the HMC. This unique interference pattern induces material alterations in the HMC that generate a hologram.
The formation of the hologram in the holographic memory cell is a function of the relative amplitudes of, and the phase differences between, the object beam and the reference beam. It is also highly dependent on the incident angles at which the object beam and the reference beam were projected onto the holographic memory cell. After hologram storage, the data beam may be reconstructed by projecting into the HMC a reference beam that is the same as the reference beam that produced the hologram. The hologram and the reference beam then interact to reproduce the data-encoded object beam, which may then be projected onto a two-dimensional array of light sensitive detectors which read back the data by sensing the pattern of light and dark pixels.
The object beam produced by the spatial light modulator has a high space-bandwidth product (SBP). The SBP of a beam is equal to the number of pixels the beam contains. For example, the 800.times.600 pixel image produced by a SVGA computer monitor has a SBP of 480,000. When high SBP beams are projected into a holographic memory cell, it is important to keep the optical path lengths traversed by the beams constant. Otherwise, the high SBP image will go out of focus and the data will be lost.
Maintaining a constant optical path length in order to keep the high SBP image of the object beam in focus necessarily makes it difficult to steer the object beam to different areas on the surface of the holographic memory cell, because such steering frequently causes the optical path length to change. For this reason, many holographic data storage systems project a reference beam through an acousto-optic cell, which diffracts the reference beam through an optical system, such as a 4-f imaging system, that has a fixed optical path length. Altering the frequency of the acoustic wave changes the angle at which the reference beam is diffracted and therefore incident to the surface of the holographic memory cell. Systems using such angle-tuned reference beam steering are known as "angle multiplexing" systems and are distinguished by their capability to project different pages of data into the same location on the surface of the holographic memory cell, but at different angles of reference-beam incidence. The data is then retrieved by steering the interrogating reference beam at different angles of incidence. However, these prior art systems are inadequate to steer a high SBP object beam to different areas of the holographic memory cell because of their inherent limitations with respect to space-bandwidth product throughput.
Accordingly, there is a need in the art for improved optical systems that are capable of steering high space-bandwidth product images to different regions on the surface of a holographic memory cell without causing the image to lose focus. There is a further need in the art for improved optical systems capable of steering high space-bandwidth product images in more than one dimension in a coordinate system. There is a still further need in the art for improved optical systems capable of steering complex reference beams in more than one dimension in a coordinate system.

System and method for steering Fresnel region data using cylindrical coordinates to access data locations in a holographic memory


A biological system for removing selenium from waste water comprises a first immobilized cell bioreactor (ICB) and a selenide removal module. The first ICB comprises a chamber having a substrate housed therein and situated to contact the waste water flowing therethrough during use. Anaerobic microorganisms are supported on the substrate, and comprise selenium respiring bacteria capable of reducing selenates and selenites to insoluble elemental selenium and/or sulfate reducing bacteria capable of reducing selenates and selenites to insoluble elemental selenium or to soluble selenides. The selenide removal module includes metallic or oxidized iron compounds capable of chemically reacting with selenide or sulfide compounds in the waste water to form iron selenide or iron sulfide precipitates.

Environment-conscious industries are continuously laboring toward the goal of removing pollutants from contaminated water to make the water safe at both the ground level and the consumer level. Government-regulated agencies establish limits for many common industrial pollutants. These limits tend to become stricter as pollution reduction and removal technology proves effective at accomplishing previously-established requirements. Consequently, both ground and consumer level water continue to improve in terms of both purity and safety.
Among the methods employed to reduce or remove pollutants, bioremediation constitutes an effective and desirable technology. In a broad sense, bioremediation includes the use of microorganisms that digest pollutants as a source of food, including nitrogen and carbon compounds. Bacterial metabolism converts the pollutants to metabolites having a simple chemical structure, sometimes degrading the pollutants completely to carbon dioxide and water in an aerobic process, or to methane in an anaerobic process. In any respect, the metabolites produced by the bacteria typically have no adverse environmental effects.
Selenium is sometimes a major contaminant in waste water, including mine drainage and agricultural irrigation water. The present selenium maximum level for drinking water mandated by the Environmental Protection Agency is 0.05 parts per million (ppm). Several chemical processes have been developed for selenium removal from waste water, but they tend to be relatively expensive and require an undesirably large amount of time and machinery. Mining companies and government agencies such as the Bureau of Reclamation are incurring large costs to remediate selenium from mine drainage and irrigation water.
Accordingly, it is desirable to provide a method and system for removing selenium from waste water in a cost and time efficient manner. It is also desirable to provide such methods and systems that can replace some conventional chemical processes for selenium removal with biological processes and thereby reduce the requisite time, machinery, and operational costs for performing the processes. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description of the invention and the appended claims, taken in conjunction with the accompanying drawings and this background of the invention.

System and methods for biological selenium removal from water