A semiconductor device (X1) including a semiconductor chip (3), a first lead (1) connected to an electrode of the semiconductor chip (3), a second lead (2) connected to another electrode of the semiconductor chip (3), and a resin package (4) sealing the semiconductor chip (3), an inner terminal (10) of the first lead (1), and an inner terminal (20) of the second lead (2). The resin package (4) includes a first to a fourth side surfaces (41-44), an upper surface (47) and a bottom surface (45). Each of the first and the second leads (1, 2) includes at least one outer terminal (11, 21) extending along the first side surface (41) and the bottom surface (45) of the resin package (4).

The present invention relates to a resin-packaged semiconductor device surface-mountable onto an object surface such as a circuit substrate, and more specifically, to a semiconductor device suitably used as a light emitter or a light receiver of an optical sensor.
Referring to the attached drawings, FIG. 29 and FIG. 30 show a typical conventional resin-packaged semiconductor device. This semiconductor device Y is a light emitting diode (LED) of a so-called frame type, made from a lead frame obtained by punching a metal plate for example.
Specifically, the light emitting diode Y comprises a pair of leads 1, 2 respectively including inner terminals 10, 20 and outer terminals 11, 21, a semiconductor chip (light emitting element) 3 mounted to the inner terminal 10 of the lead 1, a wire W for connecting an upper surface 30 of the light emitting element 3 to the inner terminal 20 of the other lead 20, and a resin package 4 for sealing the inner terminals 10, 20 of the leads 1, 2, the light emitting element 3 and the wire W. The resin package 4 is formed to have a convex lens 46 right above the light emitting element 3. Each of the outer terminals 11, 21 is bent like a crank so that the tip portion 11a, 21b is flush with a bottom surface 45 of the resin package 4.
With the above arrangement, the light emitting diode Y is surface-mounted on an object surface 5 such as a circuit substrate, and used as a light source for various purposes such as a light source of an optical sensor. When the light emitting diode Y is surface-mounted to the object surface 5, so called solder re-flow method is generally used. When the light emitting diode Y is mounted by means of the solder re-flow method, first, cream solder is applied to the tip portions 11a, 21a of the outer terminals 11, 21 for example. Then, the light emitting diode Y is lowered, with its tip portions 11a, 21a being aligned with their corresponding terminal pads 50 on the object surface 5, and then is placed in a re-flow furnace. In the re-flow furnace, the solder paste is re-melted under a temperature of about 200xc2x0 C. When the melted solder sets again, the light emitting diode Y is fixed on the object surface 5, completing the mounting process.
However, according to the light emitting diode Y, only the tip portions 11a, 21a of the outer terminals 11, 21 serve as the mounting portions to be fixed onto the object surface 5. This unitary determines the direction in which the light emitting diode Y can be faced. Specifically, if the upper surface 30 of the light emitting element 3 serves as the light emitting surface, the light emitting diode Y can only be mounted so as to emit light upward with respect to the object surface 5, or in other words, the light emitting diode Y cannot be mounted for emitting in parallel to the object surface 5. Therefore, in order to emit in parallel to the object surface 5, another light emitting diode must be prepared in which the emitting surface is vertical with respect to the bottom surface 45 (mounting surface) of the resin package 4. As exemplified as above, according to the conventional light emitting diode, there is an inconvenience in that different kinds of the light emitting diode must be prepared depending on the direction in which the light is to be emitted. The same inconvenience can also pose a problem in such semiconductor devices as a photodiode and a phototransistor in which a light receiving element is used as the semiconductor device chip 3.
It is therefore an object of the present invention to provide a semiconductor device capable of solving the above described problem.
According to a first aspect of the present invention, there is provided a semiconductor device comprising a semiconductor chip, a first lead connected to an electrode of the semiconductor chip, a second lead connected to another electrode of the semiconductor chip, and a resin package sealing the semiconductor chip, an inner terminal of the first lead, and an inner terminal of the second lead, wherein the resin package includes a first to a fourth side surfaces, an upper surface and a bottom surface, and each of the first and the second leads includes at least one outer terminal located near a corner portion of the resin package and extending along a same side surface of the first to the fourth side surfaces and the bottom surface of the resin package.
According to the above arrangement, an anode/cathode pair is formed at least in one of the side surfaces and in the bottom surface of the resin package. Therefore, when mounting the semiconductor device onto an object surface such as a circuit substrate, either of said one side surface and the bottom surface can be selected as a mounting surface.
According to an embodiment of the present invention, the outer terminal of the first lead includes a drop portion extending from the corresponding inner terminal along the first side surface of the resin package, a bottom portion extending from the drop portion along the bottom surface of the resin package, and a riser portion extending from the bottom portion along the third side surface of the resin package. The outer terminal of the second lead includes a drop portion extending from the corresponding inner terminal along the first side surface of the resin package, a bottom portion extending from the drop portion along the bottom surface of the resin package, and a riser portion extending from the bottom portion along the fourth side surface opposite to the third side surface of the resin package.
According to another embodiment of the present invention, the outer terminal of the first lead includes a drop portion extending from the corresponding inner terminal along the first side surface of the resin package, a bottom portion extending from the drop portion along the bottom surface of the resin package, and a riser portion extending from the bottom portion along the third side surface of the resin package, wherein the outer terminal of the second lead includes, a drop portion extending from the corresponding inner terminal along the second side surface opposite to the first side surface of the resin package, a bottom portion extending from the drop portion along the bottom surface of the resin package, and a riser portion extending from the bottom portion along the third side surface of the resin package.
According to still another embodiment of the resent invention, the outer terminal of the first lead includes a drop portion extending from the corresponding inner terminal along the third side surface of the resin package, a bottom portion extending from the drop portion along the bottom surface of the resin package, and a riser portion extending from the bottom portion along the third side surface of the resin package, wherein the outer terminal of the second lead includes a drop portion extending from the corresponding inner terminal along the third side surface of the resin package, a bottom portion extending from the drop portion along the bottom surface of the resin package, and a riser portion extending from the bottom portion along the second side surface opposite to the first side surface of the resin package.
According to still another embodiment of the present invention, the outer terminal of the first lead includes two branch portions, and one of the branch portions is bent to extend along the first side surface and the bottom surface of the resin package, whereas the outer terminal of the second lead includes two branch portions, and one of the branch portions is bent to extend along the first side surface and the bottom surface of the resin package. In this case, the other branch portion of the outer terminal of the first lead extends along the first side surface beyond the third side surface of the resin package whereas the other branch portion of the outer terminal of the second lead extends along the first side surface beyond the fourth side surface opposite to the third side surface of the resin package. Alternatively, the other branch portion of the outer terminal of the first lead is bent to extend along the first side surface and the third side surface of the resin package whereas the other branch portion of the outer terminal of the second lead is bent to extend along the first side surface and the fourth side surface opposite to the third side surface of the resin package.
According to still another embodiment of the present invention, the outer terminal of the first lead includes two branch portions, one of the branch portions is bent to extend along the first side surface and the bottom surface of the resin package, and the other branch portion is bent to extend along the first side surface and the third side surface of the resin package, whereas the outer terminal of the second lead includes two branch portions, one of the branch portions is bent to extend along the second side surface opposite to the first side surface and the bottom surface of the resin package, and the other branch portion is bent to extend along the second side surface and the third side surface of the resin package.
According to still another embodiment of the present invention, the outer terminal of the first lead includes two branch portions, one of the branch portions is bent to extend along the third side surface and the bottom surface of the resin package, whereas the outer terminal of the second lead includes two branch portions, and one of the branch portions is bent to extend along the third side surface and the bottom surface of the resin package. In this case, the other branch portion of the outer terminal of the first lead extends along the third side surface beyond the first side surface of the resin package, and the other branch portion of the outer terminal of the second lead extends along the third side surface beyond the second side surface opposite to the first side surface of the resin package. Alternatively, the other branch portion of the outer terminal of the first lead is bent to extend along the third side surface and the first side surface of the resin package, whereas the other branch portion of the outer terminal of the second lead is bent to extend along the third side surface and the second side surface opposite to the first side surface of the resin package.
Preferably, the semiconductor chip is mounted on the inner terminal of the first lead, and the inner terminal of the second lead is connected to the semiconductor chip via a wire. Further, it is especially advantageous if the connection between the inner terminal of the second lead and the wire is made generally at a longitudinal center of the resin package. Further, if the semiconductor chip is a light emitting element or a light receiving element, the upper surface of the resin package may be provided with a convex lens portion at a location corresponding to the semiconductor chip.
According to a second aspect of the present invention, there is provided a semiconductor device comprising a semiconductor chip a resin package sealing the semiconductor chip, four outer terminals outside of the resin package, electrically connected to the semiconductor chip, wherein the resin package includes four side surfaces, an upper surface and a bottom surface, the four outer terminals are disposed respectively at four corners on the bottom surface, and each of the outer terminals extends along a selected one of the side surfaces and the bottom surface of the resin package.
According to an embodiment of the second aspect of the present invention, each of the outer terminals includes a drop portion extending along the selected side surface of the resin package, a bottom portion extending from the drop portion along the bottom portion of the resin package, and a riser portion extending from the bottom portion along another side surface of the resin package adjacent to the selected side surface.
According to another embodiment of the second aspect of the present invention, each of the outer terminals includes two branch portions, one of the two being bent to extend along the selected side surface and the bottom surface of the resin package. In this case, the other branch portion of each outer terminal extends along the selected side surface beyond another of the side surfaces adjacent to the selected side surface of the resin package. Alternatively, the other branch portion of each outer terminal is bent to extend along the selected side surface and another of the side surfaces adjacent to the selected side surface of the resin package.
Preferably, two of the four outer terminals are connected together by a first inner terminal, the remaining two of the outer terminals are connected together by a second inner terminal, the semiconductor chip is mounted on the first inner terminal, and the second inner terminal is connected to the semiconductor chip via a wire. Further it is especially advantageous that the connection between the second inner terminal and the wire is made generally at a longitudinal center of the resin package. Still further, if the semiconductor chip is a light emitting element or a light receiving element, the upper surface of the resin package may be provided with a convex lens portion at a location corresponding to the semiconductor chip.
According to a third aspect of the present invention, there is provided a semiconductor device comprising a semiconductor chip, a first lead connected to an electrode of the semiconductor chip, a second lead connected to another electrode of the semiconductor chip, and a resin package sealing the semiconductor chip, an inner terminal of the first lead, and an inner terminal of the second lead, wherein the semiconductor chip is mounted on the inner terminal of the first lead, the inner terminal of the second lead is connected to the semiconductor chip via a wire, the wire extends in parallel to one side surface of the resin package, each of the first and the second leads having at least one outer terminal extending out of the resin package from corresponding inner terminal through the side surface, and the connection between the inner terminal of the second lead and the wire is made generally at a center, as seen in plan view, of the resin package.
According to a preferred embodiment of the third aspect of the present invention, the semiconductor chip is a light emitting element or a light receiving element, and the upper surface of the resin package is provided with a convex lens portion at a location corresponding to the semiconductor chip. Further, the inner terminal of the first lead is provided with a tongue extending toward the second lead for mounting the semiconductor chip, and the inner terminal of the second lead is provided with a tongue extending toward the first lead for connection to the wire.
Other objects, characteristics, and advantages of the present invention will become clearer from the following description of embodiments to be presented with reference to the accompanying drawings.

Packaged semiconductor device having bent leads


The systems and methods described herein optimize the retrieval of missed content by playing back cached content to enable tuners with limited capacity to retrieve the missed content. A content presentation system may receive, with a tuner, a transmission of content comprising media content and advertisements. The content presentation system may cache the advertisements. The content presentation system may determine whether an interruption during the transmission resulted in a missed portion of content and, in response, determine whether an advertisement upcoming at a time period in the transmission of content is cached. If the upcoming advertisement is cached, the content presentation system may play back the cached advertisement at the time period and release the tuner previously receiving the transmission of content to retrieve the missed portion of the content during the time period.

Viewers of broadcast content often experience interruptions in the content due to factors such as signal loss, rain fade, power outages, etc. These interruptions can cause gaps in the content. This problem only increases as content systems continually move to more mobile systems and users increasingly consume content on mobile devices.

This patent is subject to a terminal disclaimer.

Systems and methods for optimizing a set-top box to retrieve missed content


A compact serial communication device is disclosed that is formed from simplified circuits on a master side and a slave side and does not need a synchronous signal and a switching unit for switching transmission and reception operations, and is able to reduce load of the slave side. The master transmission/reception circuit outputs a serial data signal DATA to a transmission path with the serial data signal DATA being generated by superposing a low level superposition pulse on a clock signal, when the clock signal is at the high level, according to an output data signal to be output to the slave transmission/reception circuits; the slave transmission/reception circuits superposes a high level superposition pulse on the serial data signal DATA input from the transmission path according to an output data signal to be output to the master transmission/reception circuit when the clock signal is at the low level.

It is known that there are various methods of transmitting serial signals in serial communications. FIG. 17 through FIG. 20 illustrate typical ones of such methods.
FIG. 17 exemplifies a method of the related art for transmitting serial signals in serial communications.
In FIG. 17, a data signal SdA is a common data signal, in which data values are directly represented by signal levels, and data values are extracted from the data signal SdA by using a synchronization signal SaA, which delimits different data. In this method, two signals, such as the data signal SdA and the synchronization signal SaA are used.
FIG. 18 exemplifies another method of the related art for transmitting serial signals in serial communications.
In FIG. 18, a data signal SdB is a pulse width modulation signal, in which signal intervals are constant, and pulse widths differ between when the data value is "0" and when the data value is "1". With this method, although the code interval thereof is a problem, it is possible to perform asynchronous operations.
For this technique, for example, reference can be made to U.S. Pat. No. 698,066, U.S. Pat. No. 5,862,354, U.S. Pat. No. 5,978,927, U.S. Pat. No. 6,108,751, U.S. Pat. No. 6,239,732, U.S. Pat. No. 6,412,072, and U.S. Pat. No. 5,803,518.
FIG. 19 exemplifies another method of the related art for transmitting serial signals in serial communications.
In FIG. 19, a data signal SdC is a pulse position modulation signal in which pulse positions change along time, and data are sampled with a synchronization signal SaC serving as a time reference.
FIG. 20 exemplifies still another method of the related art for transmitting serial signals in serial communications.
In FIG. 20, a data signal SdD is a signal used in an infrared remote controller, and is obtained by combining the pulse width modulation and the pulse position modulation signal. However, because data intervals are not constant in the data signal SdD, the data signal SdD is an asynchronous signal, therefore, a synchronization signal is not needed.
FIG. 21 is a block diagram illustrating a serial communication device of the related art for performing half-duplex communications.
In FIG. 21, a serial communication device 200 includes a master transmission/reception circuit 201 and a slave transmission/reception circuit 205. The master transmission/reception circuit 201 includes a master transmission circuit 202, a master reception circuit 203, and a master switching section 204 for transmission authority control. Similarly, the slave transmission/reception circuit 205 includes a slave transmission circuit 206, a slave reception circuit 207, and a slave switching section 208 for transmission authority control. Basically, the master transmission circuit 202 is the same as the slave transmission circuit 206, and the master reception circuit 203 is the same as the slave reception circuit 207.
Here, when the transmission authority is on the master transmission/reception circuit 201, data are transmitted from the master transmission circuit 202 of the master transmission/reception circuit 201 to the slave reception circuit 207 of the slave transmission/reception circuit 205. Meanwhile, if the transmission authority is transferred to the slave transmission/reception circuit 205, data are transmitted from the slave transmission circuit 206 of the slave transmission/reception circuit 205 to the master reception circuit 203 of the master transmission/reception circuit 201.
However, as described above, in the related art, a synchronous signal is required. Even if the synchronous signal is not used, the circuits for generating data signals from data or extracting the data from the data signals are complicated. Further, in order to perform the half-duplex communication, the same circuit as that on the master side is required on the slave side, and switching units for switching between transmission operations and reception operations are needed. For this reason, the scale of the circuit is large, and space and cost of the circuit increase.

Serial communication device, method thereof and communication system using the same


A hard disk support for holding a hard disk drive can include a frame, a bracket, and a plurality of arched ribs. The bracket is located in the frame. The plurality of arched ribs extends from the frame toward to the bracket, and the arched ribs couple the bracket to the frame. When the hard disk support is shaken at a first orientation, the arched ribs are deformed to reduce the shock to the bracket to relieve the shock to the hard disk drive. As a result, the hard disk drive can be secured on the hard disk support without shock absorbers to absorb shock.

Hard disk drives are generally used to store data in a notebook or a computer. The notebook or the computer can include a hard disk support to secure the hard disk drive. The hard disk drive can receive shock when the hard disk support is moved, and the data in the hard disk drive can work abnormally and even be damaged under the shock. In general, the hard disk drive is fixed on the hard disk support by screws, and the hard disk support comprises a plurality of shock absorbers to absorb shock. However, the assembly of the shock absorbers with the hard disk support increases cost and labor.

Hard disk support and electronic device using the hard disk support

HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.


An apparatus (10) for molding a thin-wall plastic shell includes a powder box (12) and a mold box (14). The powder box (12) is positioned to an operative position wherein an opening (18) in the powder box (12) is brought in proximity to the mold surface (20) of the mold. A contoured selective charge application panel (36) has a gasket (30) about the end thereof and the selective charge application panel (36) is extended vertically from the opening (18) at variable heights to perfect a sealed surface at the opening (18) and the periphery (22) of the mold surface (20) to mask vertically extending waste surfaces (14a, 14b).

In processes for molding thin-walled plastic shells, a thermoplastic resin material is fed through an opening in a powder box to a mold surface of a mold box. Generally, the mold box and powder box are operatively connected such that the mold surface of the mold box is brought into close proximity of the opening in the powder box. The resin material is fed over the mold surface of the heated mold box and is melted into a molten resin film. The film is cooled to obtain the thin-walled plastic shell and is removed from the mold surface.
Currently, this molding process is accomplished with the powder box and mold box sealing where the two units meet; that is, at the top of the liner about the opening of the powder box and near the termination of the run off of the mold surface. This process allows the powder resin to contact the surface areas of the mold where such contact is not desired, causing waste and necessitating trimming of the finally formed part. Other methods known in the art of blocking this exposure, such as by using various insulating materials on the mold surface, still pose the problem of having to adopt special impacting and/or cooling, and/or brushing methods to keep them clean.
For example, the U.S. Pat. No. 4,790,510 to Takamtasu et al, issued Dec. 13, 1988, discloses a slush mold apparatus and method for molding film moldings such as surface coverings of interior parts of automotive vehicles. The powder box includes a skirt portion connected thereto having a lower edge which contacts the mold surface about its upper outer periphery. The skirt is a solid member which must be uniquely adapted to each unique mold surface configuration.
U.S. Pat. No. 4,773,844 discloses two mold boxes, each having a skin of thermoplastic material formed thereon. The mold boxes are then joined at margins under light pressure so as to separate salvage from the joined skins.
Presently there are two other methods being used to "control" thermoplastic resin powder flow (deposition on the shell mold surface) during the molding process. Only the second method selectively controls the powder placement.
One method grossly controls the flow of such powder, e.g., polyvinylchloride. The powder box is simply sealed to the shell mold on a perimeter flange. All mold surfaces interior to the powder box gasket are allowed to contact the powder thus forming (molding) a shell on the entire mold surface. The drawback to this method is that, on the average, 50% of the mold surface is not actual finished part surface (sometimes referred to as Class "A" surface). The shell molded on non-Class "A" areas is scrap material.
Another control method uses insulators mounted on non-Class "A" mold surfaces. The insulators and modulation of heat in these areas reduce the temperature of the exposed surface to the powder to a degree where the powder does not adhere, thus shell is not formed in the areas of the insulators. Such insulators are shown in U.S. Pat. Nos. 4,683,098 and 4,716,003 owned by the assignee of the present invention.
The present invention provides an apparatus and method for sealing the mold about its periphery along a variable height narrow width band to form a narrow flange on the thin-wall shell molded therein. Accordingly, the present apparatus and method generate little or no waste and trimming is reduced. Further, the present invention provides an apparatus and method for providing such a narrow width band portion seal between the opening of the powder box and the periphery of the mold surface at deep recesses within the mold. Such deep mold surfaces are formed in a mold box such that common mold box peripheries cannot extend into the mold surface to contact the periphery of the mold surface about the shell to be formed and further have surfaces thereon in which waste thermoplastic powder can build up when the mold is uniformly heated. The present invention provides an apparatus and method for perfecting such a seal in deep molds as well as in more shallow molds by use of a core device connected to the open edge of a powder box and having a variable height edge that conforms to either deep or shallow molds. Such a device can be adapted for both deep and shallow molds such that a single device is not limited to either deep or shallow mold use and the device is adapted to carry a gasket retainer and seal gasket with a perimeter shaped to form a variable height small width band seal to form a narrow flange at variable heights on the molded shell.

Apparatus and method for sealing a mold box


Certain exemplary embodiments comprise a mounting base adapted to be snapably coupled to a wiring lug. The wiring lug can comprise a prong, which can be adapted to electrically couple a circuit breaker to the wiring lug. The mounting base can define a chamber adapted to receive the wiring lug.

U.S. Patent Publication No. 20050057333 (Subramanian), which is incorporated by reference herein in its entirety, allegedly recites a "molded insulator cover for a circuit breaker molded case includes a terminal connector attachable to the strap terminal. The terminal connector projects outwardly from the circuit breaker molded case and an insulator discrete from the molded case is disposed around the terminal connector. The insulator is trapped into the circuit breaker molded case by attachment of the terminal connector to the strap terminal. The insulator is configured to be used with a plurality of different field installable terminal connectors." See Abstract.
U.S. Pat. No. 6,379,196 (Greenberg), which is incorporated by reference herein in its entirety, allegedly recites a "termination connector for a circuit breaker is disclosed. The termination connector preferably includes a plurality of single pole screw receiving members integrally attached by a molded housing for unitary attachment to a line or load end of a circuit breaker to assist in holding a nut or nut plate adjacent each screw hole in the circuit breaker's terminal straps. The molded housing preferably includes a line of perforations between each single pole screw receiving member so that the correct number of single pole screw receiving members can be retained and the others can be knocked off along the line of perforations. Provisions are disclosed for adaption of the connector to metric or English standard nut hardware. In addition, the termination connector and circuit breaker are provided with mating attachment devices for providing a simple yet secure connection." See Abstract.
U.S. Patent publication No. 5,434,376 (Hyatt), which is incorporated by reference herein in its entirety, allegedly recites the "present invention provides a terminal and base for connecting a circuit through a fusible switch. The base has a plurality of undercut prongs upstanding therefrom and an interlock snap resiliently attached thereto. The prongs are positioned on the base to prevent movement vertically and in at least one direction horizontally. The snap is positioned on the base to prevent movement in the remaining horizontal directions. The terminal includes a generally planar body made of conductive material. The body has a plurality of edges adapted to insert into the undercut prongs. The terminal positions an opposing edge on the body opposite the plurality of edges. The opposing edge is adapted to abut one end of the interlock snap. The terminal includes a first and second means for electrically and mechanically connecting the terminal to the circuit." See Abstract.

Devices, systems, and methods for mounting a circuit breaker


A recording apparatus to record a mark on a recording medium includes an aberration detecting part and an optical power controller. The aberration detecting part detects an aberration signal corresponding to the amount of an aberration contained in a light beam radiated onto a recording surface of the recording medium by using an optical pickup system which includes a light source and an objective lens. The light source emits a light beam having a power to record the mark on the recording medium. The objective lens condenses the light beam to focus the light beam as an optical spot on the recording surface of the recording medium. The optical power controller controls the power output from the light source according to the detected aberration signal, so as to have the light source output an optical power to record the mark, in which a deformation due to the aberration is compensated for, on the recording medium. Accordingly, even though the aberration occurs, a proper mark in which the deformation due to the aberration is compensated for can be recorded by increasing the recording power of the light source in proportion to the amount of the aberration to compensate for the aberration. As a result, the mark showing a good signal characteristic can be recorded on the recording medium without an additional aberration compensating device.

1. Field of the Invention
The present invention relates to an optical recording, and more particularly, to an apparatus and a method of preventing deformation of a recorded mark due to at least one of a spherical aberration due to a thickness deviation of a recording medium, and a coma aberration due to a relative radial tilting and tangential tilting between the recording medium and an objective lens, so that a proper mark can be recorded.
2. Description of the Related Art
Generally, an information recording and/or reproducing density increases as the size of an optical spot focused on a recording medium by an optical pickup decreases. As shown in the Equation 1 below, the size of the optical spot is reduced as the wavelength λ of a used light beam gets shorter and the numerical aperture NA of an objective lens gets larger.Spot Size αλ/NA   (1)
Therefore, to obtain a high recording density, a short wavelength light source, such as a blue semiconductor laser, and an objective lens having a large NA should be used in the optical pickup to reduce the size of the optical spot focused on the recording medium. In this technical field, a standardization of a high density recording medium, which uses a blue light source and an objective lens having an NA of about 0.85, increases a recording capacity to more than 20 GB, and whose thickness is reduced to about 0.1 mm, i.e., a next generation DVD, is proceeding.
However, a spherical aberration W40 is proportional to the 4th power of the NA of the objective lens and a thickness deviation of the recording medium. Thus, the recording medium has to have as uniform a thickness as possible to use an objective lens having an NA of about 0.85. But, it is very difficult to manufacture a recording medium having a uniform thickness of about 0.1 mm. Therefore, the spherical aberration proportional to the thickness deviation of the recording medium should be compensated for to properly record a mark on the recording medium. Here, the thickness of the recording medium refers to a distance between a surface upon which light is incident and a recording surface of the recording medium.
Additionally, a coma aberration is proportional to the cube of the NA of the objective lens and is caused by tilting of the recording medium (radial tilting and tangential tilting of the recording medium relative to the objective lens). Thus, if an objective lens having an NA of about 0.85 is used, the coma aberration should be compensated for to properly record a mark on the recording medium.


A vehicle air conditioning system uses a non-contact temperature sensor for feedback control of the temperature of the air blown out from a blowing opening. The degrees of opening of an air mix damper and a bypass open/close damper are controlled by actuators that respond in accordance with a temperature detected by the non-contact sensor so the blowing temperature will ultimately approach a target value. Air conditioning control is achieved as desired by this feedback control of the blowing temperature without providing wiring for a temperature sensor near the blowing opening.

1. Field of the Invention
The present invention relates to a vehicle air conditioning system that achieves control of the blowing air temperature using a non-contact temperature sensor.
2. Description of the Related Art
A known vehicle air conditioning system includes an air conditioning (A/C) unit for supplying conditioned air, a duct system for guiding the air from the A/C unit to a blowing opening, and a contact temperature sensor for detecting the temperature of the conditioned air inside the duct. The contact temperature sensor detects the temperature of an object (blown air) with which it has physical contact. The sensor is typically a thermistor.
The air conditioner also includes an A/C computer for feedback control of the A/C unit based on the temperature detected by the sensor to cause the temperature of air blown from a blowing opening to approach its target value (see, for example, Japanese Patent Laid-Open Publication No. Hei. 6-262933).
In order to precisely achieve the target temperature, the contact temperature sensor needs to be located in the duct system as near as possible to the blowing opening, allowing for the heat loss of the air inside the duct system. Thus, for a long duct system, long electric cables are required for the connection of the contact temperature sensor near the blowing opening with the A/C computer. This leads to a high cost because of the material cost of the electric cables, and lowers assembling operation efficiency.

Vehicle air conditioning system with air temperature sensor


A digital signal processor (DSP) computes logarithmic values for data values of the input signal by using an approximation formula expanded into power series. To reduce the number of computing steps, the processor includes a shift circuit for shifting an input data value into a predetermined range of numeric values, a high-order coefficient memory for storing coefficient values of high order coefficients other than a zero-order coefficient of the approximation formula for data values within the predetermined range of numeric values, a zero-order coefficient memory for storing a coefficient value of the zero-order coefficient shifted according to the number of digits shifted by the shift circuit, and an address specifying circuit for specifying a reading address of the zero-order memory corresponding to the number of digit shifted by the shifted circuit. Also, a DSP computes an inverse logarithmic value of a data value of the input signal by using an approximation formula expanded into power series. The processor includes a summing circuit for summing a specific value to an input data value so that a summed value falls within a predetermined range of numeric values, a coefficient memory for storing coefficient values of the approximation formula for data values within the predetermined range of numeric values, and a shift circuit for shifting a result of computation performed by using the approximation formula by a number of digits corresponding to the specific value summed by the summing circuit.

1. Field of the Invention
The present invention relates to a digital signal processor (hereinafter referred to as "DSP") that computes logarithmic values or inverse logarithmic values for data values of an input signal.
2. Description of Background Information
In recent years, processing of analog signals has become an important task of signal processors, wherein a digital signal obtained by analog-to-digital conversion of an input analog signal is treated by a processor, constituting a circuit such as a wave filter, or a modulator circuit, and so forth. To realize the function of such a circuit by using a DSP, it is necessary to repeat a number of multiplication operations, so it is quite effective to substitute such multiplication operations with summing operations, for facilitating the computing operations. To permit the substitution of arithmetic operations, conversion of input values to logarithmic values, or subsequent inverse conversion of the logarithmic values, are often implemented.
When a logarithmic value Log (x) of an input value x is expanded into power series by the expansion according to the Taylor' theorem, the resultant power series can be expressed by the following equation (1). EQU Log (x)=c.sub.0 +c.sub.1 x+c.sub.2 x.sup.2 +c.sub.3 x.sup.3 +. . . (1)
Therefore, if the coefficients c.sub.0, c.sub.1, c.sub.2 . . . in the equation (1) are prepared, a logarithmic value can be obtained by sequentially performing operations of: computing the square (second power), the third power, . . . of the input signal x; multiplying a corresponding coefficient to the result of computation; and obtaining a sum total of the products.
Since various values ranging from a small value to a large value can be inputted as the value x to be substituted into the equation (1), the number n of coefficients c.sub.n to be prepared should be large enough to reduce the magnitude of errors below-a tolerance level for the whole range of the input signal.
Consequently, with conventional processors used for the logarithmic conversion, the coefficients c.sub.n are prepared up to a number which allows the error of the logarithmic value obtained by the conversion to be maintained below the tolerance level for a certain range of input value x, e.g., 0.999 through 0.1 of input value x. When the input value x is outside this range, the input value is shifted to a value within the range so that the computation is performed by using the shifted value, then a correction by a value corresponding to the shift amount is effected to the computed value.
Specifically, when the input value is 0.005, the input value desirably is shifted by two digits, i.e., multiplied by 10.sup.2, in order that the shifted value falls within the above-mentioned range of 0.999 through 0.1. After the multiplication of 0.005 by 10.sup.2, the input value has a value 0.5, and the logarithmic conversion is effected to this shifted value 0.5, to yield an output value -0.30103. The thus produced converted value is then processed by a shift correction operation.
The correction operation against the shift is performed by adding a logarithmic value of 10.sup.-2, that is, a value -2.00 in this case, to the computed result since the input value has been shifted upward by two digits (10.sup.2). Thus, the summed value -2.30103 is issued as the logarithmic conversion value of the input value x when x=0.005.
When an inverse logarithmic value 10.sup.x of an input value x is expanded into power series by the expansion according to the Taylor' theorem, the resultant power series can be expressed by the following equation (2). EQU 10.sup.x =r.sub.0 +r.sub.1 x+r.sub.2 x.sup.2 +r.sub.3 x.sup.3 +. . . (2)
Therefore, if the coefficients r.sub.0, r.sub.1, r.sub.2 . . . in the equation (2) are prepared, an inverse logarithmic value can be obtained by sequentially performing operations of: computing the square (second power), the third power, . . . of the input signal x; multiplying a corresponding coefficient to the result of computation; and obtaining a sum total of the products.
Since various values ranging from a small value to a large value can be inputted as the value x to be substituted into the equation (2), the number n of coefficients r.sub.n to be prepared should be large enough to reduce the magnitude of errors below a tolerance level for the whole range of the input signal.
Consequently, with processors used for the inverse logarithmic conversion, the coefficients r.sub.n are prepared up to a number which allows the error of the inverse logarithmic value obtained by the conversion to be maintained below the tolerance level for a certain range of input value x, e.g., 0.999 through 0.1 of input value x. When the input value x is outside the predetermined range, a certain number is added to the input value to produce a value within the predetermined range so that the computation is performed by using the summed value, then a correction is effected by dividing the computed value by a value corresponding to the number added to the input value.
Specifically, when the input value is 2.30103, a certain value -2 is suitably added to the input value, in order that the summed value falls within the above-mentioned range of 0.999 through 0.1. After the addition of the value -2, the summed value is equal to 0.30103, and the inverse logarithmic conversion is effected to the value 0.30103, to yield an output value 2.000. The thus produced converted value is then processed by a correction operation.
The correction operation in this case is performed by dividing the computed value by an inverse logarithmic value of 10.sup.-2, i.e., 0.01, or to multiply 10.sup.2 to the computed result since the value added to the input signal is -2. Thus, the resultant multiplied value 200.000 is issued as the inverse logarithmic conversion value of the input value x when x=2.30103.
As described previously, with the conventional DSP used to calculate the logarithmic value log x of the input value x, the input value is shifted so that it falls in a predetermined range, the computation operation for producing the logarithmic value is effected to the shifted input value, and a correction value corresponding to the amount shift is added to the result of computation. Consequently, there has been a drawback that a large number of processing steps are required, so that the a longer processing time is needed.
Furthermore, with the conventional DSP used to calculate the inverse logarithmic value 10.sup.x of the input value x, a certain number is added to the input value so that the summed value falls in a predetermined range, the computation operation for producing the inverse logarithmic value is effected to the summed value produced from the input value, and a correction value corresponding to the certain value added to the input value is multiplied to the result of computation. Consequently, there has been a drawback that a large number of processing steps are required, so that a longer processing time is needed.

Digital signal processor using a coefficient value corrected according to the shift of input data


An exposure apparatus includes a projection optical system configured to project light from an original, wherein the apparatus exposes a substrate to light through liquid filled in a gap between the last surface of the projection optical system and the substrate; and a detecting device configured to detect a droplet adhering to the exposed substrate. The detecting device includes a storage unit configured to prestore first image data corresponding to a surface of the substrate without the liquid and an image-capturing unit configured to capture an image of a surface of the exposed substrate. The detecting device detects the droplet based on a comparison between the first image data and second image data obtained by the image-capturing unit.

1. Field of the Invention
The present invention relates to liquid immersion exposure technology used in a process of manufacturing a device, such as a semiconductor device.
2. Description of the Related Art
A reduction projection exposure apparatus is used in manufacturing a semiconductor device (e.g., a large-scale integrated (LSI) circuit or very-large-scale integrated (VLSI) circuit) having an ultra-fine pattern. The reduction projection exposure apparatus projects, in a reduced size, a pattern formed on a mask onto a substrate coated with a photosensitive agent and transfers the pattern to the substrate. As the degree of integration in semiconductor devices increases, it becomes necessary to produce finer circuit patterns. With the development of resist processes, efforts have been made to develop exposure apparatuses that can achieve finer patterning.
A typical method for increasing the resolution of an exposure apparatus is to shorten the exposure wavelength or to increase the numerical aperture (NA) of a projection optical system. As for the exposure wavelength, there is an ongoing shift from the use of a 365-nm i-line to the use of light emitted from a KrF excimer laser having an oscillation wavelength of about 248 nm. Additionally, an ArF excimer laser having an oscillation wavelength of about 193 nm is under development. A fluorine (F2) excimer laser having an oscillation wavelength of about 157 nm is also under development.
At the same time, a projection exposure method using a liquid immersion method is now gaining attention. The liquid immersion method is also a technique for increasing resolution, but is completely different from the other methods described above. In conventional methods, a space between the last surface of a projection optical system and a substrate surface (e.g., wafer surface) to be exposed is filled with a gas. However, in the liquid immersion method, projection exposure is performed while this space is filled with a liquid. An advantage of the liquid immersion method is that if the refractive index of a liquid filling the space between a projection optical system and a wafer is "n", it is possible to achieve a resolution that is "n" times higher than that achievable by conventional methods which uses light sources having the same wavelength as that of a light source used in the liquid immersion method. When, for example, the space between the projection optical system and the wafer is filled with pure water (having a refractive index of 1.33), if the maximum angle of incidence of a light beam forming an image on the wafer in the liquid immersion method is the same as that in the conventional methods, a resolution achieved by the liquid immersion method is 1.33 times higher than that achieved by the conventional methods even if the wavelength of the light source used in the liquid immersion method is the same as that of the light sources used in the conventional methods. This is equivalent to increasing the NA of the projection optical system in the conventional methods to 1.33 times. The liquid immersion method can achieve a resolution corresponding to an NA of 1 or more, which is not achievable by the conventional methods.
Examples of conventional exposure apparatuses to which the liquid immersion method is applied include an exposure apparatus disclosed in Japanese Patent Laid-Open No. 6-124873. FIG. 9A and FIG. 9B illustrate a structure of this exposure apparatus. In the exposure apparatus of FIG. 9A, filling a liquid tank (chamber) 109 with a liquid 130 allows the space between the last surface (optical element 107) of a projection optical system 104 and a wafer 102 to be filled with the liquid 130. In the liquid tank 109, there are disposed all or part of coarse positioning units 111-1 to 111-4 as well as a wafer conveying unit for conveying the wafer 102 from a wafer cassette 110 and placing the wafer 102 on a wafer chuck 112. The wafer chuck 112, an XY stage 113, and a fine-motion stage 114 are also disposed in the liquid tank 109. In FIG. 9A, a reference mirror 116 is attached in the X and Y directions (Y direction is not shown) to the fine-motion stage 114 and reflects light from a laser interferometer 115 to measure the position of the fine moving stage 114. The liquid tank 109 has a window 117 which allows light from the laser interferometer 115 to pass therethrough. A heat insulator 118 outside the liquid tank 109 thermally insulates the liquid tank 109 from outside.
Upon completion of exposure of the entire surface of the wafer 102 to light in the exposure apparatus of FIG. 9A, a conveying pump 122 is activated again and starts discharging the liquid 130 from the liquid tank 109. A liquid level gauge 119, which constantly monitors the level of the liquid 130, causes the conveying pump 122 to stop when the level of the liquid 130 becomes slightly lower than that of the surface of the wafer chuck 112. Therefore, the amount of the liquid 130 discharged from the liquid tank 109 is small. After that, a vacuum of the wafer chuck 112 is turned off. Then, the wafer 102 on the wafer chuck 112 is moved with a conveying hand 111-4 and stored in the wafer cassette 110. At a point immediately before the storage of the wafer 102 in the wafer cassette 110, the liquid 130 may be removed from the wafer 102 by blowing clean air onto both surfaces of the wafer 102.
As illustrated in FIG. 9B, Japanese Patent Laid-Open No. 6-124873 also discloses a structure in which only part including the wafer chuck 112 is disposed in the liquid tank 109. A structure in which the wafer chuck 112 is directly disposed on the bottom surface of the liquid tank 109, which is disposed on the fine-motion stage 114, is also disclosed. That is, Japanese Patent Laid-Open No. 6-124873 disposes the exposure apparatus in which the last surface of the projection optical system 104 and the entire wafer 102 are disposed in the liquid tank 109.
International Patent Publication No. WO99/049504 describes another example in which the liquid immersion method is applied to an exposure apparatus. International Patent Publication WO99/049504 discloses an exposure apparatus in which a liquid is supplied exclusively to the space between a projection optical system and a wafer surface such that the space is filled with the liquid.
FIG. 10 illustrates an inline connection between an exposure apparatus 153 and a coating/developing device 152 disclosed in Japanese Patent Laid-Open No. 2002-057100. Upon receipt of a wafer from the coating/developing device 152, a wafer conveying robot of the exposure apparatus 153 conveys the wafer to a wafer stage (exposure stage) 155. The same wafer conveying robot also conveys the exposed wafer to the coating/developing device 152. In the coating/developing device 152, a robot which conveys a wafer coated with a resist to an interface 154 adjacent to the exposure apparatus 153 conveys the exposed wafer to a heating unit.
In the conventional exposure apparatuses described above, even if a liquid between the projection optical system and the wafer surface is discharged to the outside after exposure, some liquid may remain on the last surface of a projection lens. This means that the liquid adhering to the last surface of the projection lens may be dropped onto the wafer during handling of the wafer. Moreover, the liquid on the wafer may further be dropped onto the wafer chuck during conveyance of the wafer, cause local defocusing, and lead to lower yields. Additionally, this requires replacement of the wafer chuck, involves a considerable amount of apparatus downtime associated with the replacement, and thus significantly affects the device productivity. Moreover, if the liquid adheres to the conveying hand during conveyance of an exposed and wet wafer, the liquid further adheres to an unexposed wafer to be subsequently conveyed. In other words, cross-contamination occurs. This causes local defocusing and leads to lower yields.
Furthermore, if a wafer to which a liquid adheres is conveyed to the coating/developing device and subjected to heat treatment, heat of evaporation of the liquid causes temperature non-uniformity and degradation in critical dimension (CD) uniformity. If high-speed spin drying or the like is performed under assumption that all exposed wafers are wet, the structure of the exposure apparatus is made complex. This causes an increase in cost and a reduction in throughput.

Exposure apparatus and device manufacturing method


A "baseball hitting exerciser" serving as both a hitting exerciser and a home base plate, including a flexible post, a connecting tube, a fixing tube, an anti-dust cover and a bottom cover. On the bottom end of the fixing tube is a neck connected to a push block; the push block serves to push the anti-dust plate that is compressed by the springs inside the fixing hole, so the push block may be turned and accommodated inside the wing plate troughs in the fixing hole; then, the fixing tube is fixed inside the fixing hole. If the connecting tube is turned again, the bias force of the springs pushing on the anti-dust cover will push the push block away from the fixing hole; so the base plate is restored to the shape of a normal base plate; so the base runner can safely use the base.

The subject invention relates to a type of "baseball hitting exerciser" that may be used for practicing hitting exercises as well as a base plate.
Baseball has been a very popular sport in Taiwan. Ever since the Hong-Yeh Junior Baseball Team to the present two major baseball leagues, baseball has been widely welcomed by the public; therefore, many baseball superstars have later become international stars; but in routine practice, it is considered uneconomical for a pitcher to pitch each and every ball to the hitter; therefore, the baseball hitting exerciser has come into being.
Conventional baseball hitting exercisers come in all shapes with the employment of different principles, but no such exerciser can be used simultaneously as a running base. In normal practicing routine, after the ball is hit, the hitter has to run the base, and sometimes he has to race with the ball and try to reach the base by sliding; in this case, a normal baseball hitting exerciser becomes a major killer to the safety of the base runner; therefore, the conventional baseball hitting exercisers need to be improved.


Method and apparatus for detecting the presence of a color dye in a water sample are described. Light is generated and passed through a water sample. A color sensor is utilized to measure the light that passes through the water sample. Based on the measured light, it is determined whether a dye color is present in the water sample.

Responding to consumer demand, modern washing machines offer users a host of different of options. This array of choices typically includes a first control for setting the temperature of the water (e.g., hot, warm or cold). For example, the temperature of both the wash cycle and the rinse cycle can be programmed. There is also a second control to set the length of wash and another control to select the type of wash cycle (e.g., light, heavy, or normal wash). Other washers allow a user to select a particular type of wash (e.g., a regular wash, a permanent press wash, and a delicates/hand washable wash) based on that type of clothes in the washer. With these increased options and settings, the possibility for user error (e.g., using an inappropriate water temperature or wash cycle for particular clothing) also increases.
There are also many cleaning products available in the marketplace. These cleaning products include detergents (e.g., detergents designed for color clothes, detergents designed to fight stains, detergents with bleach, etc.), bleach products, and fabric softeners. Furthermore, numerous spot removal products that are designed to pre-treat stains or other marks on clothing are also available. This array of products, while offering greater options, also increases the likelihood that a user may inappropriately mix, combine, or incorrectly apply these products due to a failure to follow directions, lack of expertise, carelessness, user mistake, or user error.
Concurrent with these trends in washing machine technology and cleaning product availability is the trend in the fashion industry to offer clothing with bright and vibrant colors. To meet consumer demand for bright, vibrant, and rich colors in clothing, clothing designers utilize different color dyes to achieve these color effects. These colors are often achieved by mixing several different colors and by including dark and rich dyes.
Since consumers are price conscious, another trend in the industry is for manufacturers to identify ways to reduce their costs. One way to reduce costs is to utilize less expensive dyes on the clothing. Unfortunately, fabrics with less expensive dyes may be more sensitive to the temperature of the wash and the type of wash cycle and not as color fast as a more expensive dye. For example, minor deviations from the ideal washing situation may cause the dye to run in the wash. Another way to reduce costs is for the manufacturer to skip the process of pre-washing the clothing that serves to wash out residual dyes or to pre-shrink the clothing. Unfortunately, an un-suspecting user washing an article of clothing for the first time may be disappointed to learn that 1) the clothing has shrunk and 2) the color dye in the article has run in the wash, possibly ruining other pieces of clothing in the wash.
The above factors and trends increase the likelihood of color dye run-off in the wash. The dye run off can stain white clothing or other lighter color clothing, thereby causing damage to many items of clothing if not all of the clothing in the wash. Based on the foregoing, there remains a need for a method and apparatus that can detect dye run-off in the wash before damage to the clothes occurs.

Avago Technologies ECBU IP (Singapore) Pte. Ltd.


An array substrate of a liquid crystal display device includes a substrate, a gate line and a data line on the substrate, the gate line and the data line crossing each other to define a pixel area, a common line parallel to the gate line, a common electrode extending from the common line and including a plurality of vertical portions, a thin film transistor electrically connected to the gate line and the data line, the thin film transistor including a gate electrode connected to the gate line, a semiconductor layer over the gate electrode, a source electrode over the semiconductor layer and connected to the data line, and a drain electrode over the semiconductor layer and spaced apart from the source electrode, wherein a portion of the semiconductor layer partly covers a side of the gate electrode disposed between the data line and the drain electrode, and a pixel electrode in the pixel area, the pixel electrode connected to the drain electrode, and includes a plurality of vertical parts alternating with the plurality of vertical portions of the common electrode.

1. Field of the Invention
The present invention relates to a liquid crystal display (LCD) device and method of fabricating a liquid crystal display device, and more particularly, to an array substrate of a liquid crystal display device and a method of fabricating an array substrate of a liquid crystal display device.
2. Discussion of the Related Art
In general, liquid crystal display (LCD) devices are driven by making use of optical anisotropy and polarization characteristics of a liquid crystal material. The LCD devices commonly include two substrates that are spaced apart and face each other, and a liquid crystal material layer interposed between the two substrates. Each of the substrates includes electrodes that face each other, wherein a voltage supplied to each electrode induces an electric field perpendicular to the substrates between the electrodes. An alignment of liquid crystal molecules of the liquid crystal material layer is changed by varying an intensity or direction of the applied electric field. Accordingly, the LCD device displays an image by varying light transmittance through the liquid crystal material layer in accordance with the arrangement of the liquid crystal molecules. Thus, the LCD device has superior light transmittance and aperture ratio.
LCD devices that include thin film transistors and matrix configuration of pixel electrodes, which are referred to as an active matrix LCD device, are commonly used because of their high resolution and ability to quickly display moving images. However, the LCD devices are disadvantageous due to their narrow viewing angle. To overcome the narrow viewing angle, an in-plane switching (IPS) LCD device has been developed that implements an electric field that is parallel to surfaces of the substrates.
FIG. 1 is a plan view of an array substrate for an in-plane switching (IPS) liquid crystal display (LCD) device according to the related art. In FIG. 1, a gate line 12 is formed along a first direction on a substrate 10, and a common line 16 is formed along the first direction parallel to the gate line 12. In addition, a data line 24 is formed along a second direction perpendicular to the first direction to cross the gate line 12 and the common line 16. Accordingly, the data line 24 and the gate line 12 define a pixel area P.
A thin film transistor T is formed at the crossing of the gate line 12 and the data line 24 to function as a switching element. The thin film transistor T is composed of a gate electrode 14 that is connected to the gate line 12, a source electrode 26 that is connected to the data line 24, a drain electrode 28 that is spaced apart from the source electrode 26, and a semiconductor layer 20 that is disposed between the gate electrode 12 and the source and drain electrodes 22 and 24. The source electrode 26 may have a U-shape, and may surround a part of the drain electrode 28, which may have a rod shape.
In the pixel area P, a pixel electrode 30 and a common electrode 17 are formed, wherein the pixel electrode 30 is connected to the drain electrode 24 and the common electrode 17 is connected to the common line 16. The pixel electrode 30 is composed of an extension part 30a, a plurality of vertical parts 30b, and a horizontal part 30c. The extension part 30a is connected to the drain electrode 28, and the plurality of vertical parts 30b, which are spaced apart from each other, vertically extend from the extension part 30a. The horizontal part 30c overlaps the common line 16 and is connected to the plurality of vertical parts 30b.
The common electrode 17 includes a horizontal portion 17a and a plurality of vertical portions 17b, wherein the horizontal portion 17a overlaps the extension part 30a of the pixel electrode 30. The plurality of vertical portions 17b vertically extend from the common line 16 and are alternately arranged with the plurality of vertical parts 30b of the pixel electrode 30. The plurality of vertical portions 17b are connected to the horizontal portion 17a of the common electrode 17.
The common line 16 and the horizontal part 30c of the pixel electrode 30 form a storage capacitor C that is parallel to a liquid crystal capacitor. Accordingly, the common line 16 functions as a first storage electrode and the horizontal part 30c functions as a second storage electrode. However, as shown in FIG. 1, the data line 24 and the drain electrode 28 may become electrically shorted together.
FIG. 2 is an enlarged plan view of region "A" of FIG. 1 according to the related art. In FIG. 2, the source electrode 26 extends from the data line 24 and is disposed over and along a first side of the gate electrode 14. Similarly, the drain electrode 28 is disposed over the gate electrode 14 along a second side of the gate electrode 14. Accordingly, the source electrode 26 has a U-shape, and the drain electrode 28 that extends over the gate electrode 14 has a rod shape that is surrounded by the source electrode 26.
During a patterning process of the data line 24, the source electrode 26, and the drain electrode 28, a residuary layer 50 may remain along a stepped portion of the gate electrode 14 located between the data line 24 and the drain electrode 28. Accordingly, the data line 24 and the drain electrode 28 may become electrically shorted together when a voltage is supplied to the LCD device. Thus, driving the LCD device may be problematic due to the electrical short circuit of the data line 24 and the drain electrode 28.
To solve these problems, the semiconductor layer 20 has been formed to have an enlarged area formed over the gate electrode 14 in an area where the data line 24 and the drain electrode 28 may electrically short circuit. However, a position of the semiconductor layer 20 may be shifted during formation processes of the semiconductor layer 20 such that the data line 24 and the drain electrode 28 may still become electrically short circuited.

Array substrate of liquid crystal display device and method of fabricating the same


A siderail and support mechanism for a bed includes a siderail having a head edge and a foot edge. First and second support arms having upper and lower pivot shafts are configured to pivotally attach the siderail to a bed. At least one of the first support arm and the second support arm includes an edge configured to form a continuous face with one of the head edge and the foot edge of the siderail. In a further embodiment, a bed siderail and support mechanism includes a siderail for a bed including a central portion and at least one end portion. The end portion is configured to extend lower than the central portion to closely cooperate with a bed structure for preventing a patient from being trapped between the siderail and the bed. The siderails are configured to minimize potential trapping hazards.

Hospital beds are provided with safety siderails. The express purpose of the siderail is to prevent a patient from inadvertently rolling out of the bed. The siderail must be movable, however, in order to permit the patient to exit the bed, or to permit medical attendants to minister to the patient. It is common to provide a four bar link mechanism to the siderail, configured to lower the siderail to a mid-position and to a storage position when not in use.
There is some concern that a patient might trap some portion of their body between the siderail and the bed. There is further concern with trapping some portion of the patient between the siderail and the bed as the siderail is lowered.
It would be advantageous to provide a bed siderail that minimizes the opportunity for part of a patient's body to be wedged between the bed and the siderail. It would further be advantageous to provide a siderail configured to minimize the opportunity for part of a patient's body to be trapped during a lowering operation of the bed siderail.


There are provided a character printing method and device. There are defined print size alternatives to be selectively set to a print size of a printing area of a printing object on which is to be printed part or all of a character group including at least one character. One of the print size alternatives is set to the print size. Print image data is formed by extracting part or all of the character group such that the part or all of the character group is adapted to the print size. A print image is printed on the printing object based on the print image data.

1. Field of the Invention
This invention relates to a character printing method and device for reading a character group from a disc which can be played back and stores data of the character group, and printing the character group.
2. Prior Art
Recently, disc systems have become commercially available one after another which store and reproduce main information and attribute information concerning the main information (which is formed of text data, and includes management information corresponding to the main information, a disc title entered by the user, and main information titles corresponding to the main information) by using a recordable/reproducible disc.
The disc system of this kind includes a magneto-optical (MO) disc system for mainly storing and reproducing music/voice signals as the main information, a rewritable CD (CD-R, etc.) system, and a DVD system for mainly recording and reproducing movie data as the main information. A mini disc (minidisc) (hereinafter referred to as an xe2x80x9cMDxe2x80x9d) system available from Sony Corporation as an applied system of the MO disc system is also a commercial product of the disc system of the same kind drawing attention of users.
In the case of the MD system, for instance, the MD records not only music pieces (music information) as the main information but also characters representative of a disc title, music numbers, music titles, playing (playback) times, recording dates, etc., as the attribute information. When the MD is played by an MD player, these characters (attribute information) are displayed on a display block of the MD player, to present information from which the user can know a title of the disc, a title of the music piece being played, etc., and further write down on various kinds of labels to be affixed to predetermined areas of an MD cartridge and an MD case, which are supplied as accessories of the MD.
However, it is a troublesome and time-consuming operation to extract data (take notes) from the information displayed on the MD player being played. Further, even if the MD player is provided with means for reading all the attribute information from the MD and printing the information on a predetermined printing object, it is still required to extract therefrom a portion suitable for a selected one of various sizes (e.g. of various kinds of labels). Still further, even if the extraction can be properly carried out, it is difficult to manually write lots of letters within a small-sized label such that the written characters have an attractive appearance, and what is more, when there are lots of labels to be prepared (i.e. when several types of labels are manually written), the operation demands much patience.
It is an object of the invention to provide a character printing method and device which is capable of reading a character group from a recordable/reproducible disc on which is recorded the character group, and printing a portion extracted from the character group such that the portion is adapted to a selected one of various print sizes.
To attain the object, according to a first aspect of the invention, there is provided a method of printing characters, comprising the steps of:
defining print size alternatives to be selectively set to a print size of a printing area of a printing object on which is to be printed part or all of a character group including at least one character;
reading the character group from a disc storing the character group;
setting one of the print size alternatives to the print size;
forming print image data by extracting part or all of the character group such that the part or all of the character group is adapted to the set print size; and
printing a print image on the printing object based on the print image data.
To attain the object, according to a second aspect of the invention, there is provided a character printing device comprising:
print size storage means for storing print size alternatives to be selectively set to a print size of a printing area of a printing object on which is to be printed part or all of a character group including at least one character;
reading means for reading the character group from a disc storing the character group;
print size-setting means for setting one of the print size alternatives to the print size;
image data-forming means for forming print image data by extracting part or all of the character group such that the part or all of the character group is adapted to the set print size; and
printing means for printing a print image on the printing object based on the print image data.
According to the character printing method and device, by reading out a character group recorded on a disc, and at the same time, setting one of print size alternatives to the print size, a predetermined part or all of the character group is extracted such that the predetermined part or all of the character group is adapted to the set print size to form print image data, and a print image is printed based on the print image data. In short, by selecting one of various print size alternatives and setting the selected one to the print size, it is possible to extract part or all of the character group such that the part or all of the character group is adapted to the set print size and print the same.
Preferably, the method includes the step of removably mounting one of a plurality of kinds of printing objects in a printing device, as the printing object.
Preferably, the character printing device includes mounting means for removably mounting one of a plurality of kinds of printing objects in a printing device, as the printing object.
According to these preferred embodiments, it is possible to mount one (any) of the plurality of kinds of printing objects in the printing device, and print on the mounted printing object.
More preferably, the step of setting one of the print size alternatives to the print size includes selecting, from the print size alternatives, one corresponding to the mounted one of the plurality of kinds of printing objects, when the print size varies with a kind of the printing object which is mounted in the printing device.
More preferably, the print size-setting means selects, from the print size alternatives, one corresponding to the mounted one of the plurality of kinds of printing objects, when the print size varies with a kind of the printing object which is mounted in the printing device.
According to these preferred embodiments, it is possible to select a print size suitable for a kind of the printing object. More specifically, this embodiment is applied to cases where the print size varies with the kind of printing object, and in this case, the selection of the printing object means the selection of the print size.
Further preferably, the method further includes the step of detecting the kind of the printing object mounted in the printing device, and the step of setting one of the print size alternatives to the print size includes selecting, from the print size alternatives, one corresponding to the detected kind of the printing object.
Further preferably, the character printing device further includes detection means for detecting the kind of the printing object mounted in the printing device, and the print size-setting means selects, from the print size alternatives, one corresponding to the detected kind of the printing object.
According to these preferred embodiments, the kind of a printing object mounted is detected, and the print size is selected according to the kind of the printing object, it is possible to select the print size adapted to the kind of printing object mounted.
Preferably, the step of setting one of the print size alternatives to the print size includes selection of one of the print size alternatives by the user.
Preferably, the print size-setting means selects the one of the print size alternatives in response to an operation carried out by the user.
According to these preferred embodiments, since the print size is selected in response to the selection by the user, and hence it is possible to select the print size complying with the user""s intention.
Preferably, the print size alternatives include sizes of a plurality of kinds of labels.
According to this preferred embodiment of each of the first and second aspects of the invention, since the print size alternatives to be selected for the print size include sizes of a plurality of kinds of labels, and hence by selecting any of them as the print size, it is possible to extract a character group adapted to any of sizes of labels.
More preferably, the plurality of kinds of labels include a disc label to be attached to a front surface of a disc cartridge, a case label to be attached to a front surface of a case of the disc cartridge, and a side label to be attached to a side surface of the disc cartridge or the case.
According to this preferred embodiment of each of the first and second aspects of the invention, it is possible to extract and print a character group adapted to any of sizes of various kinds of labels including a disc label, a case label, and a side label.
More preferably, the step of setting one of the print size alternatives to the print size includes selecting, from the print size alternatives, one corresponding to a size of a half-die-cut label, when the printing object is formed with the half-die-cut label.
More preferably, the print size-setting means selects, from the print size alternatives, one corresponding to a size of a half-die-cut label, when the printing object is formed with the half-die-cut label.
According to these preferred embodiments, when a half-die-cut label is formed in a printing object, by selecting a print size adapted to the size of the half-die-cut label, it is possible to extract and print a character group adapted to the label size of the half-die-cut label.
Preferably, the printing object is a tape.
According to this preferred embodiment of each of the first and second aspects of the invention, since the printing object is a tape, it is possible to apply the method and device to a tape printing apparatus.
Preferably, the disc is a mini disc.
According to this preferred embodiment of each of the first and second aspects of the invention, it is possible to print a character group read from the mini disc.
Preferably, the reading means includes disc playback means for reading the data of the character group from the disc.
According to this preferred embodiment, the character printing device has disc playback means for reading the character group from the disc. That is, the device is provided with the disc playback means which is not only capable of playing back (reading) main information of music, voices, movies, etc., but also capable of reading a character group, such as information of attributes. This makes it possible to easily read out character groups stored in the disc as well as divert the construction of a disc playback device of a general type to the reading of the character group.
More preferably, the disc playback means is constructed such that the disc playback means receives a request signal generated in response to a key operation of a remote controller from the remote controller, and transmits a portion of a character group to be displayed on a display of the remote controller to the remote controller, the portion corresponding to the request signal, and the reading means further includes remote-controlled communication means for sending the request signal and receiving the portion of the character group in place of the remote controller.
The aforementioned disc playback device of the general type is constructed such that it receives a request signal generated by a key operation from the remote controller, and transmits a character group in response to the request signal. Therefore, by generating the same request signal as generated by the remote controller for the same processing, the character printing device can also obtain the same character group as obtained by the remote controller. That is, in this character printing device, the reading means has the disc playback means and the remote-controlled communication means for transmitting the same request signal as generated by the remote controller and receives the character group, which makes it possible to obtain the character group stored in the disc. It should be noted that by configuring the remote-controlled communication means such that it causes the remote controller to generate a plurality of request signals by a single operation and transmit a combination of a plurality of successive request signals to the disc playback device, it is possible to obtain a plurality of character groups corresponding to the respective request signals by a single operation.
The above and other objects, features, and advantages of the invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.


A method for making microlens molds and microlens array molds is described which utilizes a spinning half radius diamond cutting member operated in a plunge cut in a technique similar to milling to cut the optical surface into a diamond turnable material. The method can be used to make high sag lens molds with high accuracy. Microlens array molds can be made with a high degree of uniformity and a nearly 100% fill factor.

The invention relates generally to the field of improved microlens molds and microlens. More particularly, the invention concerns a method of making a precision mold suitable for forming high quality, micro-sized optical articles, such as a microlens or microlens array.
Rotationally symmetric optical surfaces in molds for injection molding or compression molding are typically made either by grinding or diamond turning. While these techniques work well for larger surfaces, they are not suited for making high quality optical surfaces in small sizes or arrays. Other techniques are available for making small scale single lenses and arrays but they are limited as to fill factor, optical accuracy and/or the height or sag of the lens geometry that can be made.
Grinding relies on an orbital motion of the grinding surfaces to make a precision optical surface without scratches. However, the orbital motion and the grinding surfaces become impractical when making optical surfaces below a few millimeters in size. Grinding multiple surfaces for an array can only be done one surface at a time with multiple pieces that are then fit together.
Diamond turning can be used to make optical surfaces down to 2 millimeters in size but the setup is difficult. Precise location of multiple optical surfaces is not possible due to multiple setups. The need for multiple setups also increases the machining time for an array so that diamond turning becomes cost prohibitive.
Another technique that is suitable for making microlenses under 2 millimeters is polymer reflow. Polymer reflow is done by depositing drops of polymer onto a surface and then heating the polymer to allow it to melt and reflow into a spherical shape under the influence of surface tension effects. In order to obtain a truly spherical optical surface, reflow lenses must be separated from one another so that they contact the underlying surface in a round pattern. To maintain round pattern of each lens at the surface, the lenses must be separated from one another which substantially limits the fill factor in an array. U.S. Pat. No. 5,536,455, titled, xe2x80x9cMethod Of Manufacturing Lens Array,xe2x80x9d by Aoyama, et al., Jul. 16, 1996, describes a two step approach for making reflow lens array with a high fill factor. Using this technique, a second series of lenses is deposited in the gaps between the first set of lenses. While this technique can provide a near 100% fill factor, the second set of lenses does not have round contact with the underlying surface so that the optical surface formed is not truly spherical. Also, reflow techniques in general are limited to less than 100 microns sag due to gravity effects. Aspheric surfaces cannot be produced using polymer reflow.
Grayscale lithography is also useable for making microlenses under 2 millimeters. Grayscale lithography can be used to make nearly any shape and high fill factors can be produced in lens arrays. However, reactive ion beam etching and other etching techniques that are used in gray scale lithography are limited as to the depth that can be accurately produced with an optical surface, typically the sag is limited to under 30 micron.
High sag lenses are typically associated with high magnification or high power refractive lenses that are used for imaging. High power refractive lenses have tight curvature and steep sides to maximize the included angle and associated light gathering or light spreading which implies a high sag. In the case of image forming, refractive lenses are preferred to preserve the wave front of the image. In other cases such as illumination where the wave front does not have to be preserved, Fresnel or diffractive lenses where the optical curve is cut into segmented rings, can be used to reduce the overall sag of the lens. In the case of microlenses, high power diffractive lenses are not feasible due to the steepness and narrow spacing of the ring segments at the edge that would be required to make a low sag, high power microlens.
U.S. Pat. Nos. 5,519,539, titled, xe2x80x9cMicrolens Array With Microlenses Having Modified Polygon Perimeters,xe2x80x9d by Hoopman et al., May 21, 1996 and 5,300,263, titled, xe2x80x9cMethod Of Making A Microlens Array And Mold,xe2x80x9d by Hoopman et al., Apr. 5, 1994, describe a method for making lens arrays that involves casting a polymer into a series of small receptacles so that surface tension forms the polymer surfaces into nearly spherical shapes. A correction is done on the shape of the receptacles to make the surfaces more closely spherical but this results in football-shaped intersections so that optical quality and the effective fill factor are limited.
Therefore, a need persists in the art for a method of making a precision microlens mold suitable for forming high quality, micro-sized optical articles, such as a microlens or a microlens array.
It is, therefore, an object of the invention to provide a method of making a precision mold for microsized optical articles.
Another object of the invention is to provide a method of making a precision mold that does not damage the mold surface.
Yet another object of the invention is to provide a method of making a mold that utilizes a cutting member that is not limited to depth of penetration.
Still another object of the invention is to provide a method of making a precision mold that is useable for forming an array of micro-sized optical articles.
It is a feature of the invention that a forming element having a high speed, rotatable half-radius diamond cutting member rotatably engages a substrate in a predetermined cutting pattern to form a precision mold surface in the substrate.
According to one aspect of the present invention, a method of making a precision mold for a micro-sized optical article, comprises the steps of:
(a) providing a substrate;
(b) providing a forming element having a rotatable hardened cutting member, said hardened cutting member having a predetermined shape for forming a micro-sized mold cavity in said substrate;
(c) positioning said rotatable hardened cutting member into a milling relationship with said substrate; and,
(d) milling said substrate with said rotatable hardened cutting member to form said predetermined shaped micro-sized mold cavity for molding a micro-sized optical article.
In another aspect of the invention, a microlens and a microlens array made by the method of the invention has a spherical shaped surface, an aspheric shaped surface or an anamorphic shaped surface.
The present invention has the following advantages: the precision microlens mold can be used to mold high quality, micro-sized optical articles, such as microlenses, that have symmetric surfaces with steep sides and high sags; and, the forming element is contoured to produce very accurate optical surfaces in single microlenses or arrays. In the case of arrays, near 100% fill factor can be achieved in the molded article.

Method of making a precision microlens mold and a microlens mold


The present invention discloses a large-field unit-magnification projection optical system. The optical system includes an optical axis, a spherical concave reflection mirror; a lens group with positive refracting power arranged adjacent the mirror with an air space therebetween. The lens group includes a first plano-convex lens, a negative meniscus lens adjacent the plano-convex lens, a positive lens adjacent the negative meniscus lens, a negative double-convex lens spaced apart far from the positive lens, and a second plano-convex lens. The optical system further includes a pair of prisms each having respective first and second surface. The second surfaces are arranged adjacent the flat surface of the plano-convex lens element on opposite sides of the optical axis and the first surfaces are arranged adjacent object planes and image planes, respectively. Each lens in the lens group and the pair of prisms provide chromatic aberration correction in a spectral region that contains at least g, h and i-line wavelengths. In this projection optical system, the object plane is parallel to the image plane.

At present, photolithography is widely employed in sub-micron resolution integrated circuit (IC) manufacturing. With an increasing degree in gold-bumping and other wafer-level IC packaging technologies, there has been an increasing demand for the projection optical system having a large depth of focus, a high throughput, and a relatively low (i.e., a few microns) resolution. Projection photolithography has been developed and applied gradually.
The present invention described below is related to the optical system described in U.S. Pat. No. 6,879,383 (hereinafter, "the '383 patent") issued on Apr. 12, 2005 to Mercado and assigned to Ultratech, Inc.
FIG. 1 is a cross-sectional diagram of an example optical system 100 according to the '383 patent.
The invention described in the '383 patent is a large field, broad spectral band, color-corrected, anastigmatic projection optical system that projects an image of a pattern formed on a reticle onto a substrate.
The term "large field" means a field having a rectangular dimension of about 50 mm×100 mm or greater. Also, the term "broad spectral band" refers a spectral band that includes the g, h, i, spectral lines of mercury (i.e., 436 nm, 405 nm, 365 nm).
Optical system 100 includes, along an axis A1, a concave spherical mirror M with an associated aperture stop AS2. The mirror M includes an aperture AP on the optical axis. The aperture AP may be used, for example, to introduce light into the optical system for aligning of an object (e.g., a mask) with its image or inspecting the object. The optical system 100 is essentially symmetrical relative to an aperture stop AS2 so that the system 100 is initially corrected for coma, distortion, and lateral chromatic aberration. All of the spherical surfaces in optical system 100 are nearly concentric.
Optical system 100 further includes a field corrector lens group G with positive refractive power arranged along axis A1 adjacent to and spaced apart from mirror M. The lens group G includes a positive lens element L1 with surfaces S3 and S4. The positive lens L1 is plano-convex with surface S4 being convex and surface S3 being flat. The lens group G further includes adjacent lens element L1 and towards mirror M at least two negative lens L2 and L3. Lens L2 has surfaces S5 and S6 and Lens L3 has surfaces S7 and S8. Negative lenses L2 and L3 are meniscus type, with S6 and S8 being convex.
Adjacent lens group G is a first prism PA with surfaces S1A and S2A, and a second prism PB with surfaces S1B and S2B. The surface S1A faces an object plane OP2 and the surface SIB faces an image plane IP2. The object plane OP2 and the image plane IP2 are spaced apart from respective flat surfaces S1A and S1B by respective gaps WDA and WDB representing working distances. There is complete symmetry with respect to the aperture stop AS2, WDA=WDB. Although prisms PA and PB are not included in field corrector lens group G, these prisms play a role in the aberration correction, including chromatic aberration correction.
However, there is a certain angle between the object plane and the image plane. Because the object plane is not parallel to the image plane, there are some difficulties in photolithography machine design.

Large-field unit-magnification projection optical system

Shanghai Micro Electronics Equipment Co., Ltd.