The need for a Time Domain Integration line scan camera to change a workpiece's height in z to relocate an ROF (Range Of Focus) of fixed excursions about a fixed POLB (Plane Of Least Blur) is removed by making the location of the POLB movable, thus making the location of the associated ROF variable, while leaving the actual z height of the workpiece unchanged. This can be accomplished by ensuring that, for a desired new location of the POLB, the rate at which the physical Δys transpire for the motion of the workpiece (which may be a PCA) matches the rate at which the optical Δys are clocked for the TDI image sensor. That may be achieved by varying the value for physical Δy as function of the POLB's location in z regardless of Vscan, but while also adjusting Vscan if that is necessary or desirable to keep such things as sensor cell exposure levels, and contrast from moving away from their optimum values.

The electronic assemblies of today, whether they be a large IC (Integrated Circuit) or a PCA (Printed Circuit Assembly) can posses an extraordinary degree of functionality. This has created issues related to initial testing and performance verification upon manufacture, as well as to periodic testing and performance verification during routine maintenance or trouble shooting and repair. In many cases, the old technique of having a test procedure followed by a trained technician that understands how the thing works is simply out of the question: the overwhelming complexity and issues of time and cost force us to seek other approaches.
In manufacturing large complex electronic assemblies the philosophy has tended toward one of ensuring that the design is sound, and then using good parts to correctly form the assembly. The expectation is that the completed assembly should work as desired. Associated with this is the notion that the sooner a defect can be discovered in the manufacturing process, the less it costs to discover and fix it. Some defects can only be discovered through performance testing, while others, especially those related to mechanical properties, can be discovered by inspection. Both performance testing and inspection can be automated to a significant degree. And since the effect on performance of a mechanical defect, such as a solder bridge between two traces on the PCA, or a break in a trace, might be pronounced ("It's dead and oozing stinky smoke . . . ") or subtle ("Every so often it does something goofy . . . "), and since finding a mechanically based electrical fault by analysis of electrical operation is like looking through the wrong end of a telescope, it is generally agreed that a through mechanical inspection should precede an attempt to operate the assembly.
Automated mechanical inspection of assembled PCAs turns out to be something that can be effectively accomplished. What one might call an "x-ray vision system" is proving to be an agreeable and cost effective way of reliably finding breaks in traces, bridges between traces, and voids in solder joints. Since x-rays are involved, these defects need not be upon an exposed surface to be discovered. The determination that a defect is present can be made by analysis of a suite of work images (say, for a solder joint) or by comparison of a work image with a stored exemplar (say, for trace integrity).
Such automated x-ray inspection systems have found acceptance in the marketplace, and new and refined techniques are appearing that both lower the cost and increase the capability of new automated inspection systems.
One of the ways to lower the cost of an x-ray imaging system is to reduce its mechanical complexity. One form for an early system used a circularly deflected x-ray beam and a rotating sensor. These items might be twelve to twenty inches away from each other, with the PCA disposed between them, but all must be in precision alignment if features (and defects) on the order of a few thousandths of an inch are to be resolved during testing. Such requirements add significantly to the mechanical complexity and cost of the imaging system.
An attractive alternative to such a design is one using a stationary TDI (Time Domain Integration) line scan camera (1), similar to the one described in the incorporated "PRECISE X-RAY INSPECTION SYSTEM . . . ", which we now summarize with the help of FIG. 1. As shown in FIG. 1, a plurality of multi-element imaging sensors (2) is disposed beneath a divergent x-ray 'point source' (3). Each image sensor is a TDI sensor that may be, for example, some number U, say U=18, of (closely spaced) pixels wide for each 'element,' while each image sensor has perhaps n=2048 of such U-many-pixel-wide elements closely and uniformly distributed along a length of say, six to eight and one half inches. Despite there being a total of (U·n)-many actual sensing devices within the entire TDI sensor, there are still just n-many outputs; one for each pixel position along the length. Each time the TDI sensor receives a clock pulse, a combined result influenced by the previous (in this case, twenty-four) clock cycles is presented as the output. We shall shortly have more to say about the TDI technique after a bit more of the line scan camera's architecture has been introduced, below.
Aside from their TDI properties, the image sensors may be similar to contact image sensors used in the low cost visual scanning of documents, save that they include a thin covering of material that fluoresces (or scintillates) with visible light when excited by x-rays. The long axes of the image sensors are all parallel to one another, and we shall call this direction the x axis. As might be expected, the direction in which the TDI image sensors have multiple pixels 'per element' is called the y axis. The arrangement in x and y of the individual TDI image sensors in their plurality is not a particular issue here, and we show them as spread out over an area, there better to mimic the spatial aspects of an 'area' image sensor. And while not essential, it is convenient if they cover a contiguous portion of the x axis with no embedded gaps corresponding to where one sensor stops and another starts.
Before proceeding we should address an issue relating to terminology and the use of the term 'camera' in this setting. We are aware that some practitioners use the term 'camera' to refer to an individual multi-element imaging sensor, whether it is but one pixel in width or is a TDI sensor, and that they would thus be inclined to refer to the overall line scan apparatus as the 'line scan system.' We find this somewhat cumbersome, as the term multi-element image sensor is perfectly descriptive, as is the notion of a camera whose output is an entire two or three dimensional image, and which happens to use a line scan technique upon multi-element TDI imaging sensors, and which we shall be content to call a 'line scan camera.'
To continue with FIG. 1, we shall arrange that the location from which the x-rays (4) emanate is above a central location within the arrangement of imaging sensors, and that the x-rays diverge uniformly in a generally conical manner toward the TDI imaging sensors. The imaging sensors are all mounted with uniform height at known locations within an x-y plane (5) that is perpendicular to the axis of the conical dispersion of the x-rays. We may assume, in the absence of any intervening material that absorbs or block x-rays, that each pixel location in the generally circular array of image sensors receives roughly the same level of x-ray illumination, and that each produces about the same level of electrical signal when clocked. (We also expect that any signal variations occurring under such 'neutral' conditions have been noted, and can if desired, be removed from measured data as effects of offsets and scaling, to leave in place indications related only to conditions within a PCA being tested.)
A PCA (6) to be tested is interposed between the x-ray source and the TDI imaging sensors, and is generally parallel to the x-y plane 5 of the imaging sensors. The size of the PCA may exceed that of the planar array of imaging sensors by many times over, and to accommodate that as well as allow each image sensor to 'see' every feature of interest on the PCA, the PCA is translated at a generally uniform velocity (Vscan) along a serpentine path 9 that is known in advance and under the control of a transport control mechanism (8), which may be a computer programmed and connected to operate in this manner. This is primarily smooth continuous motion back and forth along the y direction, with intervening discrete steps in the x direction at the extremes of y motion. During portions of the serpentine path when x-ray shadows of interest fall on the imaging sensors, the data signals from the TDI imaging sensors (denoted by the lower case Greek α) are read out at a regular clock rate and stored in a (rather large!) memory (7). Thus, at the end of a serpentine scan we have a whole big bundle of data that can be algorithmically manipulated (8) with software executed by a computer to produce (8) images of interest, and which may then be analyzed in isolation or compared to one or more exemplars, and in any case evaluated (10) using selected criteria. These techniques for analysis and comparison are conventional, and are not of further interest here.
Our interest lies more in an aspect of the manner in which an image is obtained in the first instance. To assist us in this, we may reduce the scope of the above described activity to obtaining a partial image along just one portion of one y-direction leg of the serpentine with data from just one imaging sensor. [This is done with the understanding, of course, that what we do for one imaging sensor we also do for the others, and that there are known ways for the processed data for the various sensors to be combined to produce a complete image of interest.]
To continue, we note that a notion of 'in focus' can be developed. Temporarily consider some pixel position along some imaging sensor that is not TDI, and is instead only one pixel wide. It basically represents all or a portion of an x-ray shadow of some target feature on the PCA that lies along the line (ray trace) from that pixel position to the origin of the x-rays (assumed to be a bright point-like spot). As the PCA moves, several values for our pixel location are clocked out and captured. These values are for different locations in y but at the same location (i) in x. Let's call such a thing a 'Y alpha sequence at (some) X,' or Yα@Xi. At the same time this is also happening for other pixel locations on the same imaging sensor (at another value of i for Xi), and at the corresponding pixel location (if there is one at that x) on all the other imaging sensors. Typically, a complete camera system will have many imaging sensors and their arrangement is such that at least one other imaging sensor will eventually produce a sequence of signals (various α values) for that same target feature. ('Eventually' might mean at a different location on the same leg of the serpentine, or on a different leg.)
Now, for all the other imaging sensors that produced a sequence of signals for the target feature (which might well be all of them, or just the one), place the elements of these various Yα@Xi into correspondence: this element of the sequence from this sensor corresponds to that element of the sequence from another sensor, and so on. We note that these elements (various α values) were probably not obtained at the same time, as the feature might have been imaged at a different place along the serpentine path. The important thing is to agree that such a correspondence between 'the same location in x' on different imaging sensors exists, and the effects of sensor separation can be represented as shifts or offsets of element positions between the sequences: a shift (or offset) of so many elements between a Yα@X1 and a Yα@X2, and of a different number of elements between Yα@X1 and a Yα@X3, and so on.
A similar correspondence can be formed with shifts between different pixel locations in x that 'have the same y,'whether they are on the same imaging sensor or on two that each lie on the other's axial extension (along the x axis or along a line parallel to it). That is, the data also contains various instances of an 'X alpha sequence at (some) Y,' or, Xα@Yj. (A note about notation is in order here. We will write Yα@Xi and Xα@Yj instead of Yα@Xi and Xα@Yi, lest it appear that when considering these two at the same time the subscript i is a common value for each. When we write Yα@Xi and Xα@Yj, each of i and j are allowed to range independently, and might be the same or might be different, as the case requires. What we mean is no more or no less than just 'some X' and 'some Y.')
Now, if we pick from some Yα@Xi and Xα@Yj that contain a common element that belongs to (is contained in) the target feature, and with knowledge of sensor separation and a desired height in z, we 'properly' shift their respective other Yα@Xi and Xα@Yj into correspondence with them and then combine (say, by averaging) all instances of that element (for the target feature) for all the sequences, we can favor the desired location along the z axis in that: For all the ray traces passing through the target feature at that z and reaching an image sensor, each has a signal value α related to the target feature, and we may take their average as representative thereof, while for other rays that might reach a sensor after passing through a different z location the associated signal values tend to cancel each other (average out). Note that: which pixel position along the length of a sensor has determined an x coordinate (as further understood by which leg in the serpentine the PCA was happening when that pixel value was taken); the location within the sequence of clocked out sensor values (which αj) within a leg determines the y coordinate; and, the desired z coordinate further affects the pattern of shifts or offsets between the Yα@Xi and Xα@Yj from for the imaging sensors. The averaged value obtained here is the value of the pixel at (x, y, z), i.e., its intensity, which we might call A (the Greek upper case alpha).
It will be appreciated that as the divergent x-rays spread out on their journey from the x-ray spot on the source, a given sized target object in the PCA will create a larger shadow (in spatial terms measured in pixel-to-pixel spacings at the imaging sensor) if the target object is closer to the x-ray spot on the source, than it does when further away. The ratio between the actual size of the target object and its apparent size according to the corresponding shadow on the sensor (and, of course, taking the spacing of the sensor elements into account) is called the magnification, or M. The value of M figures in how much to shift the sequence of measurable a values from each sensor to correspond to those of another sensor, or to shift a sequence of a values from a given sensor element for combination with the un-shifted sequence for the same sensor element, and thus 'focus' at a desired value of z.
Now, when we shift one collection of α values to combine it with another, one collection moves relative to the other: it won't do if they both move the same amount, as the net effect would be no shift at all. So, if there are several collections to be shifted by different amounts and then combined, we can appreciate that all of these can be thought of as being shifted by the requisite amounts relative to something that does not shift. That 'something' is the image, or slice, (which is some collections of α values) at some z height of convenience, say, zk. We shall refer to this height zk in z as the reference plane. When considering what magnification M is afoot for the focusing of images, the necessary shifting will be performed relative to zk, and the value of M that exists for using that particular value of z will be called Mref.
We have just found (x, y, z, A), or a pixel description for a location in space, which might belong to a solder ball affixing a huge IC to a ball grid array. We do this for not just one pixel location, but for all pixel locations that may be of interest (there might be parts of a PCA that we do not bother to inspect). That is, we can pick an (x, y) location and then shift in x as y remains fixed, and then shift in y as x remains fixed. Then we pick another (x, y) location, and so on. What emerges is an (x, y) image in A at some height in z. We probably want the same (x, y) regions at other values for z, as well, and it will be appreciated that in this general manner a desired complete two or three dimensional image can be formed. The serpentine path serves to cover the entire PCA, while an increased plurality of imaging sensors provides improved cancellation of the 'out of focus' planes in z.
Now let's consider what happens if we use a TDI imaging sensor, instead of one just a single pixel in width. As before, each clock cycle produces Yα@Xi and Xα@Yj for our use. Unfortunately, the situation for the TDI Yα@Xi is more complicated than it was before, and than for the Xα@Yj. The Yα@Xi are aligned with the direction of mechanical motion of the PCA along a leg of the serpentine. A phenomenon known as "TDI blur" acts as a fly in the ointment of both 2D and 3D imaging, and restricts the range of z values for which a given scan taken at, say, z1, can be focused for slices above and below z1 based on just that one scan at z1. The resulting acceptable ROF (Range Of Focus) might be, say, z1+pΔz to z1−qΔz, or perhaps just ±200 mils. An ROF many times that amount is customarily possible with non-TDI imaging sensors that are just one pixel wide. Despite this, TDI is valued for the superior images that it does produce within its ROF, and the usual cure when the PCA to be inspected is thicker than the camera's ROF is to equip a TDI line scan camera system with a transport mechanism that can change the height of the PCA below the x-ray source and above the imaging plane. Such a change in z height repositions the PCA so that the portion of interest will then fall within the ROF. It is not that this does not work, but z axis motion is an expensive mechanical capability to provide, and it can be a fussy thing to keep well maintained.
To conclude this somewhat simplified description of how a TDI line scan camera operates, we should dwell a bit more on this notion of TDI blur. Perhaps if we do, we can find a way to save the TDI ointment from the fixed-location-ROF fly, and do so without resorting to an expensive variable z height PCA transport mechanism.
Refer now to FIG. 2, which is a simplified mechanical schematic diagram 10 of a portion of the system of FIG. 1. FIG. 2 illustrates the cause of TDI blur in the y direction and the observation that there is a plane of least blur for some height z1 in the z direction. The TDI image sensor 2 is n-many pixels in width along a direction that is parallel to the direction of PCA motion, which is in the y direction. We denote these n-many y positions as yj−n to yj−1. There is a 'position' yj that is not in the sensor 2 any more, and that is actually in memory (7) as the a value clocked out for the most recent cycle of the clock signal (that clock signal is not shown). In the x direction are some large number of pixel positions: xi, xi+1, xi+2, . . . .
Thus, for each clock cycle the TDI sensor 2 produces an entire (new) XαYj and the next installment in (component of) that contributes to each of YαXi, YαNi+1, YαXi+2, . . . . The individual α output values that make up these sequences are the actual outputs from the TDI sensor 2, and are represented by the arrows 13. These individual α output values are stored in a suitable data structure located in memory 7 and can be accessed to assemble the various sequences of interest for algorithmic purposes having to do with image formation and so forth.
The next step is to appreciate how the optical width (n-many pixels across) of the TDI sensor contributes to what is clocked out as the various xi, xi+1, xi+2, . . . at yj. Each time the TDI imaging sensor 2 receives a cycle of the clock signal an amount of charge in an optical sensing cell 20 (say the one at (xi, yj−n) in the figure) corresponding to the accumulated (integrated) amount of radiation incident thereon since the last clock cycle, is transferred (via an arrow 12) to the adjacent cell at the same x position but at the next y position [which in this example would be to the cell 21 at (xi, yj−(n−1))]. The idea is that the recipient cell gets a head start on forming a signal (more charging, or not) that corresponds to the thing being imaged, and noise gets averaged out. In order for this to work, we assume that the shadow of the thing being imaged also moves over by an amount 'physical Δy' that matches the 'optical Δy' (i.e., the pixel-to-pixel spacing within the sensor 2 along the y direction) so that continued charge accumulation (or not) will proceed as if for a long exposure with a non TDI line scan camera. So, the 'long exposure' is n-many pixels in duration, which in terms of time is however long it takes to move n-many physical Δys. The nth clock cycle will output from cell 22 to memory (7) the accumulated charge for the previous n-many exposures across the width of the TDI sensor, and do so for each of the various xi locations.
This manner of operation may be appreciated by considering the solid square ▪ representing some feature's image (or a portion thereof) on a PCA 14. Solid square 17a lies along a BEFORE ray 18 of actinic radiation and its shadow 28 determines (at some time t0) the charge on the cell 20. As the PCA moves by each Δy the shadow of 17a falls upon the next cell along the y axis, until after (n−1)-many shifts (at t(n−1) and after (n−1)-many Δys) the shadow 31 of 17b (PCA 14 having been shifted to the right in the figure, and now lying along the AFTER ray 19) falls on cell 22. At tn (n-many Δys) that last accumulated amount of signal (which is very different from just what shadow 31 by itself would produce on cell 22) will be output as the a value for Yj@Xi. It will be appreciated that for each of the intervening shifts the shadow of the solid square fell upon the corresponding intervening cell, and that charge accumulation (or not) proceeded as if for a stationary 'long' exposure upon a single cell.
This happy circumstance (the α value for Yj@Xi is a very good signal!) does have one special requirement, however. What has been described in the two preceding paragraphs will occur only if, given a particular velocity Vscan and optical Δy, the PCA has a particular height z1 in the z direction that we shall call the POLB (Plane Of Least Blur). An appreciation of this allows us to answer the question: "Why is there such a thing as TDI blur, anyway?"
To see the answer to that question, it is only necessary to consider what happens when (for the same Vscan, physical Δy and optical Δy) the PCA is at a different height, say, the situation at 15 for a lesser height of z=z1−qΔz. From an inspection of the figure it can be appreciated that for (the same) PCA 15 at that lesser height the solid triangle ▴ 23a will for some clock cycle produce a shadow 27 along ray 18 on cell 20, which is fine as far it goes. However, after (n−1)-many shifts solid triangle 23b (now shifted to the right) projects along ray 24 to produce a shadow 32 that is not even upon the sensor 2. Oops! From further inspection of the figure it will also be appreciated for (the same PCA) at situation 16 with a greater height (z=z1+pΔz) the solid splat  25a will for some clock cycle produce a shadow 29 along ray 18 on cell 20, which is well and good. However, after (n−1)-many shifts solid splat 25b (now shifted to the right) projects along ray 26 to produce a shadow 30 that is not upon cell 22 of the sensor 2, but upon cell 33 instead. Double Oops! The shadows projected along rays 24 and 26 do not fall on cell 22, and are instances of TDI blur, the degree of which is clearly a function of height in z.
Now, in all candor a little TDI blur is not fatal. We can express a tolerance for TDI blur as an allowable number of pixel positions for mis-registration of the sort produced by rays 24 and 26. In a TDI sensor that is twenty-four pixels wide a mis-registration of ±4 pixel positions (±4 optical Δys) is perhaps a reasonable limit. For focusing or imaging operations that exceed that limit we might be justified in declaring that the various YαXi, YαXi+1, YαXi+2, . . . are corrupted beyond redemption, and cannot be used. (As an aside, one might expect that the XαYj are not afflicted with or defiled by TDI blur. In terms of the explanation given for FIG. 2, at pixel 20 the contribution of shadows 27 and 29 to that of 28 cannot be separated from that for 28, and so on with irregular effect for pixels position further along y. What we can say is that the shadow 28 is reinforced, while the others are not . . . . ) To prevent exceeding the ±4 pixel positions we are compelled to impose a corresponding limit on how far away a desired z value can be from the actual value of z1 that was in use during the scan that acquired the data. The lower limit of z=z1−qΔz and the upper limit of z=z1+pΔz are illustrative of establishing an ROF (although we confess that the particular z1−qΔz and z1+pΔz of this particular figure do not illustrate an ROF corresponding to ±4 pixel positions).
The situation then, is this. By accepting the notion of ROF we agree to tolerate a bit of degradation in images that are scanned at z=z1 (that is, at the POLB) but eventually used to focus at a plane above or below that, but still within the ROF (z1−qΔz to z1+pΔz) set by tolerating some TDI blur. In general, p won't equal q, and the ROF might be in the range of about ±200 mils. There are occasionally times when a PCA to be inspected will be thicker than that. The cure of providing a movable z axis to relocate the PCA relative to z1 is pretty expensive if the need is only occasional. We need a genuine cure that doesn't make us regret having to provide it. Ah, but how to do it?

Method for relocating the range of focus in a line scan camera having time domain integration image sensors


A knife sharpener comprising a sharpening device preferably of the type involving upwardly extending pairs of overlapping, resiliently flexible fingers or strips forming opposed abrasive sharpening faces, provided with a pair of shields respectively operative between closed positions in which they cover and protecting the sharpening device and open positions in which they respectively provide a handhold for the device and protect the hand of the user when it is on the handhold, and preferably provided with locking means moveable between a first position engaging said shields and retaining them in said closed position and a second position releasing said shields from their closed positions and extending out from said assembly to provide protection for the hand of the user.

Many devices have been proposed for sharpening knives. One type of such device, suitable for both professional and home use, includes a structure through and across which a knife may be drawn, the device then acting on the cutting edge of the device to enhance the sharpness of that edge. Such sharpeners, when not secured to some external support, must be held in place on a horizontal support such as a table by one hand of the user, the other hand of the user manipulating the knife. The proximity of the knife, as it is drawn through the sharpening device, to the user's hand engaged in holding the device stationary on a support surface presents significant danger of injury to that hand if the knife is not manipulated in an entirely correct fashion, and hence it is highly desirable to provide the device with some means for protecting the user's holding hand.
One particularly effective sharpening device is that shown in the inventor's prior U.S. Pat. No. 6,769,327 of Aug. 3, 2004 entitled "Knife and Blade Sharpener". The knife sharpener there disclosed has sets of overlapping resiliently flexible fingers or strips which form opposed abrasive sharpening faces operable to engage the cutting edge of the knife blade. Sharpeners of that type have proved to be exceptionally effective, but those resiliently flexible fingers, if exposed to the vicissitudes of handling and storage, are susceptible to physical damage or distortion. In addition, the marketplace places a high value on compactness for easy handling and storage. Also, since the fingers are abrasive the environment should be shielded from possible damage from the fingers themselves. Moreover, it has been found that the conventional hand-guard, usually only co-extensive with the abrasive finger assembly, does not provide adequate protection to the user's hand, particularly the thumb-portion of that hand.


An optical disk drive that can automatically adjust an erase power to an appropriate level to keep the error rate low and not to shorten the life of an erasable optical disk. The optical disk drive obtains a reference erasing modulation factor using a test area of the erasable optical disk when the disk is set. While overwriting data in the erasable optical disk, the optical disk drive obtains an erasing modulation factor based on the read signal detected in an erased region from time to time to adjust the erase power so that the erase power continually adjusted to the appropriate level.

1. Field of the Invention
The present invention relates to an optical disk drive, and more particularly, to an optical disk drive that writes data in an erasable optical disk.
2. Description of the Related Art
As a recordable optical disk, write once types such as CD-R and erasable types such as CD-RW are available. In order to overwrite data in an erasable type optical disk, a laser beam of which laser power changes in two steps, a write power Pw and an erase power Pe, is used. In this case, the recording layer of the optical disk is turned from a crystal state to an amorphous state by the laser beam of the write power Pw to form a recording mark, and the recording layer of the optical disk is turned from an amorphous state to a crystal state by the laser beam of the erase power Pe to erase the recording mark.
In the case of writing in an optical disk, the optimum write power Pwo and the optimum erase power Peo of the laser beam depend on the kind of the optical disk, the optical disk drive, and the recording speed. Accordingly, in order to set the optimum write power Pwo and the optimum erase power Peo that suit the combination of the kind of the optical disk, the optical disk drive, and the recording speed, a write power calibration operation called Optimum Power Control (OPC) is performed before the writing of data.
The conventional OPC operation of an erasable optical disk drive will be described below. On a recording face of the optical disk, as shown in FIG. 6, a data area to store various data therein and a power calibration area (PCA) that is a test writing region to set the optimum write power of the laser beam are provided. The PCA is provided at the most inner radius of the disk. The PCA consists of a test area and a count area. The test area is divided into 100 partitions, each partition consisting of 15 frames. One OPC operation is performed using one of the 100 partitions. A test signal of which laser power changes in 15 steps is recorded in 15 frames in a partition, each frame being recorded using one step of laser power. This test signal is an EFM modulated signal of a series of pulses having a time width of 3-11 times of a reference time width T (T=230 nsec, a cycle frequency of 4.32 MHz at a standard speed (single speed)). Recording marks having varying lengths of 9 kinds are written in the frame.
The test signal is reproduced by detecting the reflected light of a laser beam applied to these frames. A modulation factor m as an index of the amplitude of the reproduced signal is also measured.m=I11/Itop
As showed in FIG. 7, I11 is the amplitude of a detected signal generated by an 11T recording mark and a land (the portion between recording marks), and I3 is the amplitude of a detected signal generated by a 3T recording mark and the land. Itop is a reflectivity of the land portion. The modulation factor m depends on the write power Pw.
When the write power is low, the modulation factor m is small because the amplitude of the reproduced signal is small. The greater the write power Pw becomes, the greater the amplitude of the reproduced signal becomes, and consequently, the greater the modulation factor m becomes. When the write power becomes greater to a sufficient extent, the modulation factor m saturates. If an optical disk is recorded at the write power Pw around which the modulation factor m begins saturating, the reproduced signal contains the least jitter and/or error. This write power is determined to be the optimum write power Pwo.
This optimum write power Pwo is used as the write power for the writing of signals. The optimum erase power Peo is determined based on the optimum write power Pwo by multiplying a coefficient εo (erase power/write power ratio) recorded in the optical disk as ATIP information.Peo=εo×Pwo
There are two methods of overwriting: a method in which a written signal is erased and then, a signal is written and a method in which a signal is directly overwritten (direct overwrite). Most optical disk drives available in the market utilize the direct overwrite method and few optical disk drives utilize the erase and write method. The direct overwrite method inherits the following problems.
Ordinarily, the write power that best fits the optical disk drive and the optical disk (medium) is determined by the OPC. If an appropriate signal amplitude (modulation factor), an overwrite property, and an appropriate erasing durability are taken into account when the optimum write power is determined, no problem would occur as long as the optical disk is written and read by the same optical disk drive.
However, the erasable optical disk such as a CD-RW disk is a compatible medium. The optical disk that is recorded by an optical disk drive manufactured by a manufacturer may be overwritten by an optical disk drive manufactured by another manufacturer. In this case, if the write power by which the signal is written in the optical disk is too high (the modulation factor is rather too high), the signal will remain un-erased depending on the erase power to be used during the overwriting.
That is, on the overwriting, laser power of two kinds, the write power to write a recording mark and the erase power to form a portion (space) where no recording mark exists, is applied to an existing recording region to perform the overwriting. In the case that the existing signal written on a track is too great, the existing signal is not erased and remains in the erased region (space region). It may cause a too low C/N ratio of the reproduced signal after the overwriting and a too high error rate.
If the write power and the erase power are equally increased to avoid this problem, the erasing durability of the optical disk is lowered and the life of the optical disk is shortened. Additionally, since the overwrite properties becomes worse if an optical disk recorded by an optical disk drive is further overwritten by another optical disk drive, the error rate of the reading of a signal becomes worse.

Optical disk drive that can adjust erase power during writing operation


A multi-layered electrophotographic element providing significantly improved properties, especially for use in photocopying and printing, which comprises a conductive support carrying a photoconductive layer comprising a photoconductive charge generating layer and a charge transporting layer on the charge generating layer. The charge generating photoconductive layer comprises a mixture of charge generating perylene pigments of the following structures ##STR1## wherein the mixture of perylene pigments is selected from pigment mixtures of a perylene of structure 1 with a perylene of structure 2, pigment mixtures of perylenes of structure 1 and pigment mixtures of perylenes of structure 2.

1. Field of the Invention
The present invention relates to electrophotography and, more specifically, to a multi-layered electrophotographic element.
2. Description of Related Art
In electrophotography, an image is formed on an electrophotographic element generally comprising a photoconductive layer on a substrate by first providing the surface of that layer with a uniform electrostatic charge and then exposing it imagewise to light. The imagewise exposure causes the areas struck by light to become conductive and the charge in this area is discharged, while the charge in the non-exposed areas remains, forming an electrostatic latent image. This latent image is rendered visible, for example, by depositing finely divided electroscopic toner particles onto the imaged layer surface, the toner particles being attracted by the remaining charge. In direct electrophotography, the image thus rendered visible is fixed locally onto the electrophotographic element, e.g. by heat and/or pressure. In indirect electrophotography, the image formed on the photoconductive element is first transferred to and then fixed onto a support, usually of plain paper. Thereafter, any toner particles remaining on the photoconductive layer surface are cleaned therefrom to make the element suitable for a subsequent copying cycle.
The electrophotographic element in practice may comprise a radiation-sensitive charge generating layer applied to a conductive support. Alternatively, it may comprise a plurality of layers including a radiation-sensitive charge generating layer and a charge transporting layer applied thereto. Such multi-layered electrophotographic elements are described, for example, in U.S. Pat. Nos. 3 713 820, 3 725 058, 3 824 099, 3 837 851, 3 839 034 and 3 898 084.The radiation-sensitive compound or compounds in such a charge generating layer may be of an inorganic or organic nature. When inorganic material is used, it generally is present either in the form of particles dispersed in a binder or in the form of a homogeneous film obtained, for example, by vapor deposition. Selenium is the inorganic material most commonly used. When organic material is used, it may, for example, be present in the form of a film-forming organic polymer, such as, for example, a polyvinyl carbazole or polyvinyl pyrene, or in the form of finely divided pigment particles, such as, for example, bisazo pigments, of which Phenelac Blue and its derivatives are among the best known, which are dispersed in an organic binder.
Such pigment-binder layers, however, have exhibited a number of disadvantages. Hence, processes have been proposed for preparing charge generating layers in which the radiation-sensitive compound is present in a molecularly divided form instead of in the form of pigment particles. The advantage of the former is that the layers can be made much thinner and smoother than pigment-binder layers and are also better in respect of their charge transport and resolving powers. Furthermore, the grinding operations required for the preparation of pigment-binder layer compositions can be dispensed with.
Charge generating layers containing radiation-sensitive compounds in molecularly divided form are described, for example, in U.S. Pat. Nos. 4 123 270 and 4 286 040 and in U.K. patent No. 1 172 355. Recently organic photo generating pigments such as perylene pigments, bisazo pigments, quinone pigments, and phtalocyanine pigments have been used. Such pigments can be evaporated fairly easily in a vacuum and subsequently can be deposited on a suitable substrate to obtain thin extremely homogeneous layers.
When, because of their associated advantages, it is desired to use such layers in the thinnest possible form, e.g. at a thickness of not more than 1 to 2 .mu.m, they must be provided with a top layer because of the vulnerability of the extremely thin layers to abrasion, and in order to be able to bring them to the required charge level during uniform charging. The top layer to be used must also permit the transport of charge carriers, usually holes, which are formed in the charge generating layer during the imagewise exposure.
Perylene pigments are widely used in charge generating layers in photoconductive elements for electrophotography. The currently used perylenes have properties which make them suitable for a wide variety of photoconductors. However, there remains a need for improved photoconductive elements in, for example, electronic printers, such as laser printers, where sensitivity in the near infrared is often required. Also, there remains a need for photoconductors with an improved photosensitivity, low residual charge after illumination, a rapid discharge rate and low dark decay.

Multi-layered electrophotographic element having a mixture of perylene pigments


Methods, systems, and devices for particulate filter soot management for internal combustion engines are described herein. A method for particulate filter soot management for internal combustion engines includes determining a quantity of soot on a particulate filter and adjusting a skip fire firing sequence based at least in part on maintaining the quantity of soot on the particulate filter within a desired soot quantity range.

Spark ignition and compression ignition engines require an exhaust system including one or more aftertreatment elements to limit emission of undesirable pollutants that are combustion byproducts. Catalytic converters and particulate filters are two common aftertreatment elements.
Spark ignition engines generally use a 3-way catalyst that both oxidizes unburned hydrocarbons and carbon monoxide and reduces nitrous oxides (NOx). These catalysts require that, on average, the engine combustions be at or near a stoichiometric air/fuel ratio, so that both oxidation and reduction reactions can occur in the catalytic converter.
Since compression ignition engines generally run lean, they cannot rely solely on a conventional 3-way catalyst to meet emissions regulations. Instead they use another type of aftertreatment device to reduce NOx emissions. These aftertreatment devices may use catalysts, lean NOx traps, and selective catalyst reduction (SCR) to reduce nitrous oxides to molecular nitrogen. The most common SCR system adds a urea/water mixture to the engine exhaust prior to the engine exhaust flowing through a SCR based catalytic converter. In the SCR element the urea breaks down into ammonia, which reacts with nitrous oxides in the SCR to form molecular nitrogen (N2) and water (H2O).
Soot and ash are other byproducts that exit an internal combustion engine (both spark ignition and compression ignition), they are generally viewed as non-beneficial and harmful to the environment. All internal combustion engines produce an amount of soot and ash as byproducts of the combustion process.
Soot is made up of mostly combustible material that can be oxidized to make its particles smaller and less impactful. Ash is made up of non-combustible materials and, so for treatment of ash, exhaust systems may be utilized to attempt to capture ash within the system.
One mechanism used in the ash and soot removal/conversion process is a particulate filter. The filter exhaust gas to pass through a porous filter material and, in doing so, larger particulate, such as larger soot and ash particles, cannot pass through the pores and are captured by the filter material. As more, larger particles are caught in and on the filter material, they begin to further restrict the pore size and, thereby, smaller and smaller sized soot particles are captured by the filter material.
This can be beneficial to the filtering process, to a point. Over time, the particles will continue to collect in and on the filter material until the pores are nearly or completely blocked, allowing very few or no particles through. Accordingly, with many of the pores blocked, the gas flow through the filter material decreases. This restriction reduces the performance and fuel economy of the engine, among other issues.

Particulate filter soot management for internal combustion engines


An electronic device includes electronic components, including: a power switching unit to output a power switching signal; a first power input unit to receive first power from one of a plurality of external power devices; a second power input unit to receive second power from one of the external power devices; a power converting unit to convert the first power received through the first power input unit into driving power having a voltage level to drive each electronic component, and to supply the driving power to each electronic component; and a power management unit to control the power converting unit to be enabled when the second power is input through the second power input unit, and control whether the power converting unit is enabled corresponding to the power switching signal from the power switching unit, when the second power is not input through the second power input unit.

1. Field of the Invention
Aspects of the invention relate to an electronic device and an electronic device system, and more particularly, to an electronic device and an electronic device system, which receives power from a first device and is capable of controlling the power of the first device and for itself.
2. Description of the Related Art
Recently, many independent electronic devices, such as a computer system or an audio/video (AV) system, have been used being connected to each other. For example, in the computer system, a computer and a monitor are connected to each other. In the AV system, a digital versatile disc (DVD) player, a television and an amplifier are connected to one another. Also, the computer system has been recently connected to the devices of the AV system, thereby forming a multimedia system.
However, such a conventional electronic device system should individually supply power to the respective electronic devices such as the computer, the monitor, the DVD player, the television and the amplifier. Further, power buttons are individually provided in the respective electronic devices, so that it can be inconvenient for a user to manipulate the respective power buttons of the electronic devices one by one when the user wants to turn on/off the electronic devices.
Accordingly, when one electronic device (hereinafter, referred to as a "second electronic device") of the electronic device system receives the power needed for its operation from another electronic device (hereinafter, referred to as a "first electronic device"), the power management of the second electronic device can be conveniently implemented by controlling the power supplied from the first electronic device to the second electronic device.
Further, turning on/off the first electronic device as well as the second electronic device through either of the first or second electronic device, e.g., the second electronic device, would be convenient.
Also, when the second electronic device, of which the power management is implemented by the power supplied from the first electronic device, receives the power, not from the first electronic device, but another power source, various power sources can be selectively used in supplying the power to the second electronic device, thereby enhancing the convenience to the user. Thus, it is can be advantageous when the power of the second electronic device is controlled independently of the first electronic device.

Electronic device and electronic device system


Disclosed herein is a chimeric protein comprising a pre-activated transcription factor and a strong transcription activation domain for regulating fungal gene expression, and reagents and methods for constructing and using said protein.

The invention was supported, in whole or in part, by funding from the Government. The Government has certain rights in the invention.
Fungal species are the commercial source of many medicinally useful products, such as antibiotics (e.g., beta-lactam antibiotics such as penicillin, cephalosporin, and their derivatives), anti-hypercholesterolemic agents (e.g., lovastatin and compactin), immunosuppressives (e.g., cyclosporin), and antifungal drugs (e.g., pneumocandin and echinocandin). All of these drugs are fungal secondary metabolites, small secreted molecules that fungi utilize against competitors in their microbial environment. Fungi also produce commercially important enzymes (e.g., cellulases, proteases, and lipases) and other products (e.g., citric acid, gibberellic acid, natural pigments, and flavorings).
The production of secondary metabolites, enzymes, and other products is regulated by coordinated gene expression. For example, the production of penicillin is limited by the activity of two enzymes, encoded by the ipnA and acvA genes. PacC, a zinc-finger transcription factor, binds to sequences upstream of these two genes. Moreover, increased activity of PacC leads to both increased enzyme activity and penicillin production.
Our understanding of transcriptional regulation of secondary metabolite production, as exemplified above, has increased greatly over the past decade. To date, however, the use of genetically-engineered transcription factors has not been applied to increase production of commercially-important fungal products. In contrast, methods to increase production of penicillin currently rely upon mutagenesis and selection for mutants which display increased secondary metabolite production.
The invention provides a means to increase the production of secondary metabolites in fungi by genetic manipulation of the fungal organism itself. The ability to increase fungal secondary metabolite production has at least two important applications. First, it will allow increased production of existing secondary metabolites which are useful in clinical and experimental settings. Second, increasing production of secondary metabolites will facilitate identification of new compounds in fungi that otherwise make undetectable levels of these compounds in the laboratory.
Accordingly, in one aspect, the invention features a two-part chimeric transcription factor including (i) a pre-activated transcription factor functional in a fungal strain, and (ii) a transcription activation domain that is different from the transcription activation domain naturally associated with the transcription factor. In a preferred embodiment, the transcriptional activity of the chimeric transcription factor is greater than the transcriptional activity naturally associated with the pre-activated transcription factor. In another preferred embodiment, the pre-activated transcription factor is pre-activated by truncation. In a related preferred embodiment, the pre-activated transcription factor includes a substitution of a serine or threonine residue with an alanine, aspartic acid, or glutamic acid residue, wherein the substitution pre-activates the transcription factor (e.g., by mimicking or otherwise altering phosphorylation). In another preferred embodiment, the transcription factor is a member of the PacC family (defined below) and can be pre-activated. In a related preferred embodiment, the pre-activated transcription factor contains portions of the amino acid sequence shown in FIG. 1 (SEQ ID NOs: 1-6).
In another aspect, the invention features a vector including DNA encoding a chimeric transcription factor including (i) a pre-activated transcription factor functional in a fungal strain, and (ii) a transcription activation domain that is different from the transcription activation domain naturally associated with the transcription factor. The DNA is operably linked to a promoter capable of directing and regulating expression of the chimeric transcription factor in a fungal strain.
The transcription factor encoded within the vector described above is expressed in a fungal cell, such as a filamentous fungal cell, which produces the secondary metabolite of interest and in which expression of the transcription factor increases the production of the secondary metabolite by the cell. The secondary metabolite can be non-proteinaceous or it can be a protein or peptide.
In another aspect, the invention features a method of producing a secondary metabolite of interest, including the steps of (i) introducing into a fungal cell, such as a filamentous fungal cell, a vector including a promoter capable of controlling gene expression in the fungal cell, and a nucleic acid encoding a two-part transcription factor including a DNA-binding domain and a transcription activation domain; and (ii) culturing the fungal cell under secondary metabolite-producing conditions. In a preferred embodiment, the transcription activation domain is different from the transcription activation domain naturally associated with the DNA-binding domain. In other preferred embodiments, the transcription factor is a pre-activated transcription factor (pre-activated by substitution of a serine or threonine residue with an alanine, aspartic acid, or glutamic acid residue, or pre-activated by truncation). In other preferred embodiments, the DNA binding domain of the transcription factor is from a fungal transcriptional activator or from a fungal transcriptional repressor.
By xe2x80x9cpre-activated transcription factorxe2x80x9d is meant a transcription factor or fragment thereof that, compared to the precursor molecule, is capable of 1) increased binding, either direct or indirect, to a specific DNA sequence located in a gene regulatory region (e.g., a promoter), or 2) increased transcription activating properties. Pre-activated transcription factors may be able to activate transcription from promoters, but this is not necessarily the case. For example, a transcription factor DNA-binding domain with binding properties but no transactivation activity is considered to be a pre-activated transcription factor. xe2x80x9cPre-activation by truncationxe2x80x9d or xe2x80x9cpre-activated by truncationxe2x80x9d means that removal of a portion of the protein leads to pre-activation. This occurs in vivo through proteolytic cleavage. In the invention, pre-activation by truncation is achieved with the use of DNA that encodes a pre-activated form of the protein, excluding portions of the protein that would be proteolytically cleaved in vivo.
By xe2x80x9csubstantially identicalxe2x80x9d is meant a polypeptide or nucleic acid exhibiting at least 50%, preferably 85%, more preferably 90%, and most preferably 95% identity to a reference amino acid or nucleic acid sequence. For polypeptides, the length of comparison sequences will generally be at least 16 amino acids, preferably at least 20 amino acids, more preferably at least 25 amino acids, and most preferably 35 amino acids. For nucleic acids, the length of comparison sequences will generally be at least 50 nucleotides, preferably at least 60 nucleotides, more preferably at least 75 nucleotides, and most preferably 110 nucleotides.
By xe2x80x9cpromoterxe2x80x9d is meant a sequence sufficient to direct and/or regulate transcription. Also included in the invention are those elements which are sufficient to render promoter-dependent gene expression controllable for cell type-specific, tissue-specific, temporal-specific, or inducible by external signals or agents; such elements may be located in the 5xe2x80x2 or 3xe2x80x2 or intron sequence regions of the native gene.
By xe2x80x9coperably linkedxe2x80x9d is meant that a gene and one or more regulatory sequences are connected in such a way as to permit gene expression when the appropriate molecules (e.g., transcriptional activator proteins) are bound to the regulatory sequences.
Other features and advantages of the invention will be apparent from the following description of the preferred embodiments thereof, and from the claims.

Chimeric pre-activated transcription factors

Whitehead Institute for Biomedical Research


The present invention provides a method for producing 3,5-di-tert-butyl-4-hydroxybenzoic acid comprising:    (1) providing 2,6-di-tert-butylphenol which may contain up to 0.5% by weight of 3,3′,5,5′-tetra-tert-butyl-4,4′-dihydroxybiphenyl;    (2) reacting a basic alkali metal compound with an excess amount of the 2,6-di-tert-butylphenol, which is in excess of the basic alkali metal compound, to give the alkali metal 2,6-di-tert-butylphenolate; and    (3) reacting the alkali metal 2,6-di-tert-butylphenolate obtained in step (2) with carbon dioxide to give 3,5-di-tert-butyl-4-hydroxybenzoic acid. According to the method of the present invention, 3,5-di-tert-butyl-4-hydroxybenzoic acid can be obtained with high and stable yield.

3,5-Di-tert-butyl-4-hydroxybenzoic acid (hereinafter, called as "DBPOB") is used for synthesizing a wide variety of materials, for example ultraviolet absorber and antioxidant contained in polymer materials such as polypropylene, developer for pressure-sensitive recording paper as well as medical and agricultural chemicals.
WO 2004/031113 (which is incorporated herein by reference) discloses a method for producing DBPOB, which comprises reacting a basic alkali metal compound such as sodium hydroxide with an excess amount of 2,6-di-tert-butylphenol (hereinafter, called as "DTBP") at a temperature of no lower than 160° C. to give the alkali metal 2,6-di-tert-butylphenolate and reacting said alkali metal 2,6-di-tert-butylphenolate with carbon dioxide to give DBPOB.
This method is advantageous because of the high reaction yield. In addition, the excess DTBP can easily be recovered from the product and reused for synthesizing DBPOB as starting material.
However, the present inventors have found that when the method was conducted with DTBP which was stored for a long time, the expected high yield could not be achieved though the stored DTBP kept the high purity. Moreover, when the method is conducted repeatedly using the excess DTBP separated at the last step as starting material for the next cycle, the yield of DBPOB decreases after 4 th or 5 th cycles. In this case, though there is no problem concerning the purity of the DTBP separated in the last step of each cycle, the yield of DBPOB decreased dependent on the number of the cycles.
Accordingly, there is a need for a method of producing DBPOB with high and stable yield even if DTBP used for the reaction is the one that has been stored for a long time or excess DTBP is recycled more than 4 or 5 times.

Method for producing 3,5-di-tert-butyl-4-hydroxybenzoic acid

Kabushiki Kaisha Ueno Seiyaku Oyo Kenkyujo


A liquid crystal display includes a backlight, a polarization plate, at least two substrates, a liquid crystal layer placed between the substrates, and a color filter layer formed on at least a part of the substrates, wherein the color filter layer has green pixels that satisfy the relations 0.25<x<0.32 and y>0.58, wherein x and y each represent a chromaticity value in an xy color system using illuminant C, the color filter layer has a contrast of 1000 or more with respect to each of X, Y and Z values, and the backlight uses a light-emitting device having a peak wavelength in the range of from 520 to 540 nm as a light source.

Liquid crystal displays, which were first introduced into small-sized apparatuses such as pocket calculators or the like, have found widespread applications such as mobile apparatuses, personal computers, monitors, and television sets. With the widespread use, full-color liquid crystal displays have been produced, and bright display color have been demanded.
Thus, color reproduction range has been extended by increasing the content of pigments or the like in color filters, and the associated reduction in vividness has been compensated by improving backlights and optical components.
In addition, techniques for optimizing the wavelengths of backlights have been employed. Japanese Patent Application Laid-Open (JP-A) No. 2004-78102 discloses an example of such techniques in which an LED is used as a light source to extend color reproduction range (by shifting the wavelength of a green emission peak to a shorter wavelength).
As mentioned above, improvements in vividness have been investigated based on the extension of the color reproduction range of color filters and the optimization of the wavelengths of backlights.
In recent years, however, as display screens are upsized, higher display quality has been required. In particular, the vividness of display colors is a factor that significantly affects the quality of displayed images and thus should be improved.


A container manufacturing device for performing manufacture of a pre-form and a container in a single station via one stop is provided. The container manufacturing device includes a pre-form molding module configured to form a shape of a pre-form of a container using a resin material, an injection module connected to the pre-form molding module and configured to supply the resin material to the pre-form molding module, a container molding module configured to inject air to the pre-form to expand the pre-form and to form the shape of the container and including a container mold, and a rotary table with a rib plate suspended thereon while rotating between the pre-form molding module and the container molding module, the pre-form or the container being mounted on the rib plate.

Many devices for attaching a label with an embellishment, trade name, explanation, etc. printed thereon have been widely used to indicate an embellishment, a trade name, or an explanation on a surface of a blow molding container formed of a synthetic resin.
One of methods of attaching a label is an in-mold molding method of pre-putting an in-mold molding label (hereinafter, referred to as a label) on a mold and simultaneously attaching the label to a surface of a surrounding wall of a main body of a container while molding the main body of the container.
In the in-mold molding method, a label is simultaneously attached while a main body of a container is molded, an attachment procedure using another dedicated process is not required, an outer appearance or tactile sensation is not likely to be degraded because a step difference is not generated between a surface of the main body of the container and the label, and the label is strongly and safely attached to the main body of the container irrespective of thickness reduction in a blow molding container.
For example, Japanese Patent Laid-open publication No. 2004-136486 discloses a label, a label-attached blow molded product, and a method of manufacturing the same.
However, when in-mold molding according to the prior art is used, since an inject material (hereinafter, referred to as a pre-form) prior to having a shape of a container needs to be molded and container molding and labeling via pre-form heating and pre-form expansion, and container ejection are required, an area occupied by a layout of devices for respective operation stages is very wide and operating speed is very low and, thus, there is a problem in that the in-mold molding is ineffective.
An in-mold molding device according to the prior art is designed as a hydraulic type device and, thus, there is a problem in that a workplace is contaminated due to oil leak, etc. and a container is also contaminated during a manufacture procedure.


Embodiments of the invention provide an electro-absorption modulator including an optical waveguide and a microwave waveguide. The microwave waveguide is electromagnetically coupled to the optical waveguide. The optical waveguide includes a quantum well region and a substantially sinusoidal structure. The waveguide mode of the optical waveguide is responsive to the substantially sinusoidal structure.

Modulation of optical signals is commonly utilized to transfer information in modern communication systems. One method of modulation utilizes an electro-absorption modulator. One type of electro-absorption modulator includes a microwave waveguide electromagnetically coupled to an optical waveguide.
One type of optical waveguide includes a multiple-quantum well region formed of III-V compound semiconductors. The multiple quantum well region is produced by one or more quantum well layers of a low bandgap material interleaved between a corresponding number of barrier layers of a higher bandgap material. The bandgap energy of the quantum well layers is less than the bandgap energy of the barrier layers. Thus, a multiple quantum well structure composed of N quantum well layers has N+1 barrier layers.
Electrons and holes are confined in the same physical quantum well. As a result, the electrons and holes are in close proximity to each other and interact strongly to form exciton pairs. The exciton has a strong absorption similar to an atomic absorption. The electro-absorption modulator utilizes a microwave signal to change the excitonic absorption properties of the quantum well layers of the optical waveguide. The microwave signal is utilized to vary the electrical bias across the multiple quantum well layers. When biased at a first state, the external electric field across each quantum well layer results in a sharp optical absorption. When biased at a second state, the external electric field across each quantum well layer results in a lower optical absorption. Hence, the resulting modulated optical signal provided at an output of the electro-absorption modulator has an on-state and an off-state.
For optimal coupling between the microwave signal and the optical signal propagating in the electro-absorption modulator, the microwave signal should propagate along the device at the same velocity as the optical signal. However, the prior art devices are problematic in that the microwave and optical signals travel with different group velocities. Accordingly, the device efficiency and operating bandwidth is deleteriously reduced.

Avago Technologies Fiber IP (Singapore) Ltd. Pte.


A semiconductor storage device includes: a voltage generation circuit configured to generate a read voltage to be supplied to a selected word line to which a read-target memory cell transistor is connected and a read-pass voltage to be supplied to an adjacent word line; a word line driver configured to, when the read voltage transitions, apply the read voltage to the selected word line with a first kick voltage amount and apply the read-pass voltage to the adjacent word line with a second kick voltage amount; and a control circuit configured to set each of the first kick voltage amount and the second kick voltage amount to a voltage corresponding to an amount of the transition.

Recently, in a semiconductor storage device such as a NAND-type flash memory, a three-dimensional structure has been adopted for refinement and capacity enlargement. As for the NAND-type flash memory, there is not only a case where a memory cell transistor is configured as an SLC (single-level cell) capable of holding 1-bit (binary) data but also a case where the memory cell transistor is configured as an MLC (multi-level cell) capable of holding 2-bit (four-valued) data, a TLC (triple-level cell) capable of holding 3-bit (8-valued) data or a QLC (quad-level cell) capable of holding 4-bit (16-valued) data.
When a memory cell transistor is multi-valued as described above, it is necessary to change a read voltage according to data stored in the memory cell transistor at the time of reading data, and there is a demand for speeding up transition to each read voltage.


Aspects of the present disclosure include a titration probe that mitigate the occurrences of titration probe clots. A bar such as segment of music wire, is extended across the tip of a titration probe and attached at both ends to the titration probe. The bar is configured to catch clots and prevent the clots from being collected along with a blood sample to be analyzed. The bar effectively reduces the cross sectional area of the titration probe tip.

Previously existing titration probes for acquiring whole blood samples have been susceptible to blockage by clots, particularly at the probe distal end. Blood clots and other accumulations of materials that collect around a blockage can become free and contaminate a collected sample. This can interfere with testing of the collected sample and may result in inaccurate test results.

This patent is subject to a terminal disclaimer.

Clot mitigating probe for blood analyzing instrument


Rectangular baler comprising a bale chamber adapted to contain one or more bales; a compacting plunger for advancing crop material in a discharge direction towards a discharge opening of the bale chamber; wherein at least one friction block is fixed on an inner side of a wall of the bale chamber; the or each friction block comprising a wedge shaped part having an inclined surface extending from the inner side of the wall in the discharge direction.

In rectangular balers bales are formed by compressing crop material in a bale chamber by a plunger that reciprocates in the bale chamber.
An example of a bale chamber of the prior art is shown in FIG. 1. The bale chamber 1 comprises a top wall 2, a bottom wall 5, and two side walls 6. At one end of the bale chamber there is provided a plunger 3. The top wall 2 and/or the bottom wall 5 and/or the side walls 6 may be provided with a series of hay dogs 4. When the plunger moves in a discharge direction F to add a flake of crop to the bale, the hay dogs 4 hold the flake in shape. The top wall 2 and the side walls 6 are typically hinged at the end near the plunger 3, see hinge axis's 12, 16, allowing to adjust the position of those walls, wherein, in use, a compacting pressure is exerted on the top wall and the side walls. In that way the density of the bales may be regulated.
The problem with the balers of the prior art is that in certain circumstances it is not possible to produce bales with an acceptable density, even when using the maximum pressure on the walls of the bale chamber.


A vertical bolt mechanism and installation configuration that avoids damage to a door corner comprises a vertical bolt case of tubular shape and a horizontal tubular transfer case. The mechanism is substantially contained within the bolt case and transfer case. In the installation in a door, the bolt case and the transfer case require only two major holes in the door top and edge, each hole being well spaced from the door corner and the axis of each hold being directed perpendicular to the other. Installation requires insertion of the bolt case through the hole in the top of the door and the transfer case through the hole in the edge of the door. The two cases come together to form an L-shape within the door with the internal mechanism of each case joined in engagement. Routing or cutting out of the door at the corner is thus avoided.

The field of the invention pertains to double doors that close together without a door frame in between. Normally the active door includes handles and a latch to provide for opening and closing the active door. Thus, at the intermediated handle elevation the passive door includes a strike plate and recess for the latch. The passive door may also include a separate strike plate and recess for a dead bolt at the intermediate level.
At the top corner of the passive door directly above the intermediate elevation strike plate is a vertically movable bolt engageable with a strike plate and recess in the door frame. Extended, the vertically movable bolt prevents opening of the passive door unless the active door is first opened releasing the cam actuator for the vertically movable bolt. In certain applications such as fire doors a bimetallic link will be included in the vertical bolt mechanism to prevent opening of the passive door in the event of high temperatures beyond the door.
Whether a steel door or a wooden door a considerable amount of door structure must be removed at the top corner to accommodate the vertical bolt mechanism. As a result this corner may be significantly weakened in routing out or cutting the door structure without damaging the door surfaces.
With a view toward avoiding significant damage to the passive door structure and simplifying installation of the vertical bolt mechanism the following mechanism configuration has been developed.


A method and device for using a portable dataport for electronic document retrieving, annotating, inter-relating, and managing, comprising a view manager having an at least one-dimensional grid. The view manager and grid provide document inter-relation and management in a user friendly fashion. The view manager is electronically linked to an electronic document storage device to retrieve, inter-relate, annotate and manage the documents.

There exists a need for a portable dataport and methodology for retrieving, inter-relating, annotating and managing documents at a point of need. This need has particular application in the construction industry, but also exists in the medical, information science, real estate management, design and engineering, transportation industry, plan and building operations, building management, emergency services, operations management and many other industries and/or fields where electronic documents must be retrieved, inter-related, managed, annotated and/or edited at a point of need.
In the context of the construction industry, as an example and not by limitation, the present invention addresses economic needs that arise from an extremely competitive industry that has low profit margins. The largest cost other than subcontracts, direct work material, and direct work labor is staff to manage the project and direct the field activities. This can be as much as three and a half percent of the construction costs, which includes the cost of the staff and the taxes, insurance and benefits required. Any reduction of field staff time or reduction of field staff numbers on projects, contributes directly to the bottom line profitability of the construction company. The present invention provides more efficient operations for field staff in order to solve the above-listed deficiencies in the construction field. The same efficiencies also have benefits in other industries and fields.
Information management in the construction industry, for the most part, is still in the paper, pencil and fax era. Most field superintendents currently use cumbersome documents and volumes of printed specifications to investigate conflicts, between contractors and/or subcontractors, building designs and/or engineering, and request the necessary information, in person, from team members. This non-automated process can be very costly and burdensome to a construction company.
The single largest cost to construction companies is their labor cost, whether for management personnel or field labor personnel. The largest variable in cost of an installation is the availability of information at the point of need. The present invention derives from these cost factors and needs and the associated benefits of faster response and turn-around times and reduced cost of labor on a project.
Another large cost of a construction project is the relocation of personnel from one work area to another due to the lack of necessary information being available for them. Reducing or eliminating these relocations by making the necessary information available to the user at the point of need, saves the construction company money and contributes to the company's profitability.
Likewise, cost issues in the construction industry arise from post-installation repairs that arise from the lack of time to effectively handle and coordinate all issues during the construction period, including punch list or action item list concerns. The present invention is designed to help track and coordinate these issues during installation and handle them immediately by electronically notifying the proper personnel of the deficiency in a timely, user friendly manner, during construction, not after.
A research study, conducted at Carnegie Mellon University, in 2003 indicated that the most ignored persons in the construction industry are the field staff when it comes to technological improvements to efficiency and information being made available at the point of need. Further discussions with construction industry leaders indicated that many of the mistakes that were discovered in the field installation were never corrected due to the inability to identify the issue, record it and quickly send it to the personnel that could correct it. If the issue identification, recordation and notification all were accomplished on a regular basis at a point of need, one large construction company suggested that it would save approximately $20 Million per year on return work.
During this same study, students involved in the study, interviewed several superintendents and project managers to determine the most desired software within the construction industry. The students and the present inventors concluded that the need for an invention to accomplish identification, recordation and notification at a point of need on the job site was missing from development in the information technology industry.
Currently, field issues are solved through a series of field and field office interactions (personal contact) that consume a lot of time for the field superintendents. Most contractors require their field superintendents to make two rounds through the construction site each work day. Anything that prevents this two round day from occurring, keeps the field superintendents adequately and satisfactorily performing their other assignments.
The present invention provides the field superintendent the freedom to stay in the field while still having adequate access to project documents. It allows the field superintendent to spend more time solving problems and communicating with the people that can provide solutions.
Other related systems have tried to solve some of the above-listed problems, yet they do not disclose, teach or suggest the solution provided by the present invention. For example, a system called, Autodesk Constructware, discloses generally a database management system for the construction industry which uploads, organizes and makes available to a user, various project documents, but only in an office environment through a hardwired, non-portable desktop requiring knowledge of computer file system management. This reference reduces the confusion sometimes caused by communication between the job site and the office. Further, the Autodesk Constructware system provides a web-based viewer for document sharing and viewing. Similar to Autodesk Constructware, Skematek also provides a construction document management service. The Skematek system requires users to have an in-depth knowledge of file system management. Skematek's service eliminates the need for a user to compile, copy and distribute copies of construction documents and further electronically archives the documents in a logical fashion. This system also discloses the ability to link documents, such as owner's manuals and warranty documentation, with construction drawings. However, neither of these two systems provide the benefits and/or advantages disclosed within the present invention, including, in particular, the View Manager's capabilities, user-friendliness, quick navigation between project documents and portability.
Another related reference, U.S. Publication No. 2005/0198354 A1, to Holloway, Jr., teaches a job site communication system and computer program used for remotely communicating documents between a job site and a remote server or to persons outside of the job site. This system comprises a hand held computer device, which allows the user to view and, to some extent, make very limited annotations on the documents and CAD drawings, which the user can then transmit off-site. The transmission process in this Patent Publication requires almost expert knowledge of computers, including electronic transmission, emailing and attachments, whereas the present invention's View Manager and field communication tool is very user friendly and requires only novice computer knowledge. The system disclosed in this Patent Publication also provides the user with the ability to communicate with off-site personnel, as needed. However, this system does not disclose a View Manager and other related features of the present invention, which allow a user to easily navigate between inter-related documents and/or layers on a particular document.
Further, Patent Publication, US 2004/0201622 A1, to Rhodes et al., teaches a document distribution system which provides free form routing of documents through a system. The flexibility of this routing is provided by facilities which allow recipients, as well as the originating user, to modify the document routing through the system. Recipients also have some limited ability to annotate the documents. Again, in this reference, the user friendly View Manager, communication tools and related features of the present invention are not disclosed, taught or suggested.

Portable dataport device and method for retrieving, inter-relating, annotating and managing electronic documents at a point of need


The system includes a 3D feature detection module and 3D recognition module 202. The 3D feature detection module processes 3D surface map of a biometric object, wherein the 3D surface map includes a plurality of 3D coordinates. The 3D feature detection module determines whether one or more types of 3D features are present in the 3D surface map and generates 3D feature data including 3D coordinates and feature type for the detected features. The 3D recognition module compares the 3D feature data with biometric data sets for identified persons. The 3D recognition module determines a match between the 3D feature data and one of the biometric data sets when a confidence value exceeds a threshold.

1. Technical Field of the Invention
This invention relates to three-dimensional (3D) biometric data processing and in particular to systems and methods for processing 3D biometric data for feature detection, classification and recognition.
2. Description of Related Art
Biometrics is the science of measuring and analyzing biological data. In law enforcement and security fields, biometrics is used to measure and analyze human features, such as fingerprints, facial patterns, palm prints, retinas, etc. Currently, binary or two-dimensional fingerprint images are the most relied upon biometric measurement for verifying a person's identity and for linking persons to a criminal history and for background checks. Criminal justice agencies rely on binary fingerprint images for positive identification to latent prints collected as evidence at crime scenes and in processing persons through the criminal justice system.
The National Institute of Science and Technology (NIST) and the American National Standards Institute (ANSI) supports the ANSI/NIST-ITL 1-2000 Data Format for the Interchange of Fingerprint, Facial, & Scar Mark & Tattoo (SMT) Information. This standard defines the content, format, and units of measurement for the exchange of biometric image information, such as fingerprint, palm print, facial/mug shot, and scar, mark, & tattoo (SMT) image information that may be used in the identification process of a subject. The information consists of a variety of mandatory and optional items, including scanning parameters, related descriptive and record data, digitized fingerprint information, and compressed or uncompressed images. This information is intended for interchange among criminal justice administrations or organizations that rely on automated fingerprint and palm print identification systems or use facial/mug shot or SMT data for identification purposes. Other organizations have different standards as well for the content, format or units of measurement for biometric information. The fingerprint and palm-print images meeting specified NIST and ANSI standards allow for matching of print images in large databases of existing fingerprint and palm-print based records. For example, the FBI maintains an Interstate Identification Index System for fingerprints and palm prints. Currently, the biometric image information required by NIST and ANSI standards for fingerprints and palm prints includes only binary biometric images or two-dimensional coordinates of fingerprint features.
In addition, the most common methods of finger print and palm print acquisition collect two-dimensional biometric images. One method is a rolled ink print technique wherein a trained technician manipulates a person's finger or hand on paper to capture an ink print that meets industry standards. Another method is electronic scanning of a finger or palm as it contacts a surface to generate a two-dimensional (2D) binary image.
Systems are currently being developed for non-contact means of acquiring fingerprints using 3D imaging techniques. Recent advancements in the fields of computing hardware and software have made capturing 3D biometric data a more practical solution. For example, one method of capturing 3D biometric image data is described in PCT Application No. WO2007/050776, entitled System and Method for 3D Imaging using Structured Light Illumination, which is incorporated by reference herein.
For backward compatibility with the existing fingerprint databases, acquired 3D biometric image data is converted into a gray scale 2D image. In addition, the 2D gray scale image may be further converted into a 2D binary image. For example, an I(x,y) value is generated to represent the gray-level of a point of the fingerprint in two dimensions. A binarization of the gray scale image is then performed by assigning gray levels close to 0 to surface valleys and dark pixels with high values of gray to ridges. The ridges and valleys of the 2D binary image are then processed to detect features of the fingerprint. The detected features of the fingerprint are described with a location having two-dimensional coordinates. The detected features then are used to perform validation, classification and recognition tasks.

System and method for three-dimensional biometric data feature detection and recognition


Provided are asymmetrical, ultraviolet stabilizers which are hydroxyphenyl benzotriazolylphenol compounds of the formula: ##STR1## wherein: R.sub.1 is C.sub.1 to C.sub.18 alkyl, C.sub.6 to C.sub.10 aryl, C.sub.7 to C.sub.16 arylalkyl, C.sub.1 to C.sub.12 alkoxy, C.sub.6 to C.sub.10 aryloxy, C.sub.7 to C.sub.16 arylalkoxy, cyclopentyl, cyclohexyl or cumyl;. R.sub.2 is C.sub.1 to C.sub.18 alkyl, C.sub.6 to C.sub.10 aryl, C.sub.7 to C.sub.16 arylalkyl, C.sub.1 to C.sub.12 alkoxy, C.sub.6 to C.sub.10 aryloxy, C.sub.7 to C.sub.16 arylalkoxy, cyclopentyl, cyclohexyl or cumyl; PA1 R.sub.1 is different from R.sub.2 ; and PA1 X is selected from the group consisting of hydrogen, halogen, C.sub.1 to C.sub.12 alkyl, and C.sub.1 to C.sub.12 alkoxy. The invention also pertains to a process for their preparation and stabilized polymer blends containing the stabilizers.

The present invention pertains to ultraviolet light stabilizers for plastics and coating compositions, or more particularly, to novel types of compounds which are asymmetrical benzotriazolylphenols.
It is well known in the art that plastics are unstable over time upon exposure to ultraviolet light. Such plastics undergo a decrease in mechanical strength and an increase in unwanted color when exposed to uv radiation. It is also known to improve the resistance of plastics and coating compositions to deterioration by the addition of a uv light absorber. Such commonly used stabilizers include compounds of the hydroxyphenyl benzotriazole family, including hydroxyphenyl benzotriazole monomers and dimers. Hydroxyphenyl benzotriazole monomers are well known in the art and are disclosed in earlier U.S. Pat. Nos. 3,204,896; 3,189,6515; 5,097,041; 4,943,637 and 5,104,992. Hydroxyphenyl benzotriazole dimers are also known.
The benzotriazole dimers have an advantage over the monomeric benzotriazole u.v. absorbers. The dimers have higher molecular weight which makes them much less volatile. This is very important considering the high temperatures required for the processing of engineering plastics. In addition, these dimers possess high thermal stability so they are not decomposed when exposed to elevated temperatures for prolonged periods of time.
Benzotriazole type u.v. absorbers, including dimers, function through a mechanism involving the phenolic hydrogen and the nitrogens of the triazole ring. In attempts to reduce the volatility of benzotriazole monomers, various organic groups were added to the phenolic ring and/or halogens to the benzene ring of the benzotriazole. Volatility was usually reduced by substitution of one or two organic groups on the phenolic ring. While these measures did improve the volatility problem, it also reduced the total u.v. absorption capability of the benzotriazole monomers. Most commercial benzotriazoles which are available today are disubstituted.
U.S. Pat. Nos. 4,684,679, and 4,812,498 disclose the symmetrical dimers 2,2'-methylene-bis-(4-hydrocarbyl-6 benzotriazolylphenols). U.S. Pat. Nos. 4,684,679 and 4,937,348 disclose a process for preparing the symmetrical dimers 2,2'- methylene-bis-(4-hydrocarbyl-6-benzotriazolylphenols) by first forming the Mannich base of a described benzotriazole monomer and then reacting the Mannich base with the same benzotriazole monomer or the same Mannich base. All of the above patents are incorporated herein by reference. Indeed, a common feature of all known benzotriazole dimers is that they are symmetrical, that is, all units of the dimer or polymer contain the same single hydroxyphenyl benzotriazole monomer unit. For example, U.S. Pat. No. 4,937,348 shows a hydroxyphenyl benzotriazole dimer having the formula: ##STR2## These compounds are symmetrical because each R.sub.2, which is an alkyl group having 1-18 carbon atoms at the 4 position of each of the phenolics, is identical. To synthesize benzotriazole dimers, one is limited to benzotriazole compounds where there is but a single substitution on the phenolic ring. Disubstitution on the phenolic ring prevents the formation of a dimer through a Mannich base or by any known reaction. This fact limits the number of benzotriazole dimers to the few monosubstituted benzotriazoles commercially available.
This is disadvantageous because the physical properties of symmetrical dimers of hydroxyphenyl benzotriazoles have limited properties with regard to melting point, molecular weight, uv absorption distribution, particle migration, and polymer compatibility. Since there are so few compounds in this dimer group, it is often impossible to select a symmetrical hydroxyphenyl benzotriazole having the best combination of properties. For example, while it may be desired for a benzotriazole to have a certain uv absorption characteristic or melting point, it may not be compatible with the plastic of choice. It has now been unexpectedly found, that by independently varying the alkyl (hydrocarbyl) group at the 4-position of the phenolic ring so that each half of the dimer has a different substitution, numerous dimers can now be synthesized. The melting point, molecular weight, and uv absorption distribution properties can be tailored to the requirements for the polymer of choice. It has been found that each dimer half contributes its beneficial characteristics. Also unexpectedly, the melting points of the asymmetrical dimers are lower than one would normally expect. This allows the asymmetrical dimers to be used with polymers which are processed at lower temperatures and the lower melting point allows easier dispersion in polymers.
It has also been unexpectedly found that in general, asymmetrical dimers display higher solubility in organic non-polar solvents than symmetrical dimers made from the same monomers, as shown in Table 1 below. The symmetrical dimers usually have limited solubility in polar and non-polar solvents and have higher melting points. With better solubility and lower melting point, asymmetrical benzotriazoles are more easily and more uniformly blended in the plastic to be stabilized. The asymmetrical benzotriazoles make it possible to synthesize many different combinations of monomers to form dimers with tailor made characteristics.


An adsorbent, supple, filter fabric composed of an air-permeable, supple, textile, carrier material having adsorbent particles fixed on it by means of a thermoplastic binding agent. The adsorbent particles are coated on their surface with binding-agent particles which are set apart from each other. The average diameter of the binding-agent particles is smaller than that of the adsorbent particles. The adsorbent particles are also bonded to each other by binding-agent particles. The coating of the carrier material with adsorbent material is over 200 g/m.sup.2. The fabric has a total thickness of 0.5 to 5 mm, and its suppleness permits a bending radius of not more than 5 mm able to be carried out free of destruction. The filter fabric is manufactured by first mixing absorbent and binding-agent particles while adding water. The mixing is followed by carrying out the following steps in continuous sequence: sprinkling of the mixture on the textile carrier material, heating above the start of melting of the binding agent, and cooling off and rolling up of the resultant supple filter fabric. The product can be used in air purification systems as well as for protective clothing.

1. Field of the Invention
The invention relates to an adsorbent, supple, filter fabric as well as a method for its manufacture. More particularly, the invention relates to such filter fabrics which can be used as filtering components of ventilating systems and air conditioning equipment as well as, because of their flexibility, in clothing which is protective against dusty and gaseous hazardous materials.
2. Description of Related Art
German patent DE 33 04 349 C2 discloses a membrane filter, having an adhesive agent imprinted on the textile carrier material in uniform, punctiform distribution by means of a stencil as a pattern of little adhesive piles in the shape of a hemisphere or a cone. Adsorbent particles having a diameter of 0.1 to 1 mm are fixed on it, likewise in uniform, punctiform distribution. The punctiform pattern covers 30 to 70% of the carrier-material surface. The adhesive agent is a solvent-free polyurethane. The quantity of the adsorbent applied is stated with 10 to 200 g/m.sup.2.
To produce it, 30 to 70% of the surface of the carrier material is covered by means of a stencil with a punctiform pattern of little adhesive piles in the shape of a hemisphere or a cone. The adhesive is a mixture of a prepolymerized, masked isocyanate and a cross-linking agent. The imprinted surface is sprinkled with adsorbent particles and the adhesive agent is cross-linked.
A disadvantage of this filter fabric is that, in order to obtain sufficient permeability to air, the adsorbent particles are fixed only on the surfaces of the little adhesive piles. This limitation precludes an adsorbent coating above 200 g/m.sup.2. In particular, it is not possible to provide for further adsorbent layers. Consequently the quantity of pollutants able to be adsorbed spontaneously is also limited.
The fact that the adsorbent particles cannot mutually bond adhesively, but rather only directly to the little adhesive piles, also rules out the possibility of taking advantage of the higher permeability to air of adsorbent particles up to 5,000 .mu.m large and at the same time offering a large, spontaneously effective adsorbent surface. Given the suggested dimensions of the little adhesive piles having a height of 0.05 to 0.5 mm and a diameter of 0.2 to 1 mm, not enough binding agent is available for larger quantities of adsorbent particles.

Adsorbent, supple, filter fabric and method for its manufacture