A dispenser system for a liquid crystal display panel includes a table to overturn a substrate having at least one image display part on a first surface of the overturned substrate, and at least one syringe system to supply sealant onto a first surface of the overturned substrate to form a seal pattern along outer edges of the image display part on the first surface of the overturned substrate, wherein the at least one syringe system moves along horizontal directions.

1. Field of the Invention
The present invention relates to a dispensing system and a method using a dispensing system, and more particularly, to a dispenser system for a liquid crystal display panel and a method of using a dispensing system.
2. Discussion of the Related Art
In general, a liquid crystal display panel is used to display images according to data signals supplied to individual liquid crystal cells arranged in a matrix configuration, wherein light transmittance of the individual liquid crystal cells is controlled to display the image. Accordingly, liquid crystal display (LCD) devices include a liquid crystal display panel where a driver integrated circuit (IC) drives the individual liquid crystal cells.
The liquid crystal display panel includes a color filter substrate and a thin film transistor array substrate attached to each other, wherein a liquid crystal layer in disposed between the color filter substrate and the thin film transistor array substrate. In addition, the thin film transistor array substrate includes data lines and gate lines to intersect at right angles, thereby defining liquid crystal cells at every intersection of the data lines and gate lines. The data lines transmit data signals supplied from a data driver integrated circuit to the individual liquid crystal cells, and the gate lines transmit scan signals supplied from the gate driver integrated circuit to the individual liquid crystal cells. Data pads and gate pads are provided at distal end portions of each of the data and gate lines, respectively, to supply data signals and scan signals from the data driver integrated circuit and the gate driver integrated circuit to the data and gate lines, respectively. The gate driver integrated circuit sequentially supplies the scan signals to the gate lines so that the individual liquid crystal cells arranged in the matrix configuration can be sequentially selected on a line-by-line basis. Similarly, a data driver integrated circuit supplies the data signals to the data lines so that selected ones of the individual liquid crystal cells arranged in the matrix configuration can be provided with the data signals.
A common electrode and a pixel electrode are formed along inner surfaces of the color filter substrate and the thin film transistor array substrate, respectively, thereby supplying an electric field to the liquid crystal layer. The pixel electrode is formed at each of the individual liquid crystal cells on the thin film transistor array substrate, whereas the common electrode is integrally formed along an entire surface of the color filter substrate. Thus, by controlling voltages supplied to the pixel electrode and the common electrode, light transmittance of the individual liquid crystal cells can be individually controlled. In order to control the voltage supplied to the pixel electrode, a thin film transistor, which is commonly used as a switching device, is formed at each of the individual liquid crystal cells.
FIG. 1 is a plan view of a liquid crystal display panel according to the related art. In FIG. 1, a liquid crystal display panel 100 includes an image display part 113 where individual liquid crystal cells are arranged in a matrix configuration, a gate pad part 114 connected to gate lines of the image display part 113, and a data pad part 115 connected to data lines of the image display part 113. The gate pad part 114 and the data pad part 115 are formed along edge regions of a thin film transistor array substrate 101 that does not overlap with a color filter substrate 102. The gate pad part 114 supplies scan signals from a gate driver integrated circuit (not shown) to the gate lines of the image display part 113, and the data pad part 115 supplies image information from the data driver integrated circuit (not shown) to the data lines of the image display part 113.
The data lines and the gate lines are provided on the thin film transistor array substrate 101 to intersect each other, wherein a thin film transistor for switching the liquid crystal cells is provided at the intersection of the data lines and the gate lines. In addition, a pixel electrode for driving the individual liquid crystal cells is connected to the thin film transistor provided on the thin film transistor array substrate 101, and a passivation film for protecting the pixel electrode and the thin film transistor is formed along an entire surface of the thin film transistor array substrate 101.
Color filters are separately coated at cell regions defined by a black matrix formed on the color filter substrate 102. In addition, a common transparent electrode is provided on the color filter substrate 102.
A cell gap is formed by spacers disposed between the thin film transistor array substrate 101 and the color filter substrate 102, and the thin film transistor array substrate 101 and the color filter substrate 102 are attached together using a seal pattern 116 formed along an outer edge of the image display part 113, wherein a cell gap is formed by spacers disposed between the thin film transistor array substrate 101 and the color filter substrate 102.
During fabrication of the liquid crystal display panel, a process for simultaneous formation of a plurality of unit liquid crystal display panels on a single glass substrate is commonly used. Accordingly, the process requires dividing the plurality of unit liquid crystal display panels formed on the single glass substrate using a cutting process to produce a plurality of individual liquid crystal display panels. Next, liquid crystal material is injected through a liquid crystal injection opening of each of the individual liquid crystal display panels to form a liquid crystal layer within the cell-gap that separates the thin film transistor array substrate 101 and the color filter substrate 102. Then, the liquid crystal injection openings are sealed.
FIGS. 2A and 2B are schematic plan and cross sectional views of a process for formation of a seal pattern according to the related art. In FIGS. 2A and 2B, a screen printing method includes patterning a screen mask 206 so that a plurality of seal pattern forming regions are selectively exposed, and selectively supplying a sealant 203 to the substrate 200 through a screen mask 206 using a rubber squeegee 208 to simultaneously form a plurality of seal patterns 216A˜216F. The plurality of seal patterns 216A˜216F formed on the substrate 200 provide a gap into which a liquid crystal layer is formed, and prevent leakage of the liquid crystal material to an exterior of the plurality of seal patterns 216A˜216F. Accordingly, the plurality of seal patterns 216A˜216F are formed along outer edges of the image display parts 213A˜213F of the substrate 200, and a plurality of liquid crystal injection openings 204A˜204F are formed at each one side of the seal patterns 216A˜216F.
The screen printing method includes applying the sealant 203 on the screen mask 206 with the seal pattern forming regions patterned thereon, forming the plurality of seal patterns 216A˜216F on the substrate 200 through printing with the rubber squeegee 208, and evaporating a solvent contained in the seal patterns 216A˜216F and leveling them. The screen printing method is advantageous because of its convenience, but it is disadvantageous because of excessive consumption of the sealant 203 since the sealant 203 is applied along an entire surface of the screen mask 206 and printed using the rubber squeegee 208 to simultaneously form the plurality of seal patterns 216A˜216F. In addition, the screen printing method is problematic since a rubbing process of an orientation film (not shown) formed on the substrate 200 is altered as the screen mask 206 and the substrate 200 contact each other, thereby degrading image quality of the liquid crystal display device. Thus, a seal dispensing method has been proposed.
FIG. 3 is a schematic plan view of a seal pattern according to the related art. In FIG. 3, a seal dispensing method includes forming a plurality of seal patterns 316A˜316F along outer edges of a plurality of image display parts 313A˜313F formed on a substrate 300 by applying a certain pressure to syringes 301A˜301C filled with a sealant as a table 310 moves along forward/backward and left/right directions. Accordingly, the plurality of seal patterns 316A˜316F are sequentially formed as single lines around the image display parts 313A˜313F. During the seal dispensing method, since the sealant is selectively supplied to regions where the seal patterns 316A˜316F are to be formed, sealant consumption may be reduced. In addition, since the syringes 301A˜301C do not contact an orientation film (not shown) of the image display part 313 of the substrate 300, the alignment of the rubbed orientation film would not be damaged and image quality of the liquid crystal display device may be improved.
In order to form the seal patterns 316A˜316F, the table 210 may be fixed and the syringes 301A˜301C may be horizontally moved along the forward/backward and left/right directions around the image display parts 313A˜313F. Accordingly, a certain pressure is applied to the syringes 301A˜301C filled with the sealant to dispense the sealant onto the substrate 300, and the syringes 301A˜301C are moved along the forward/backward and left/right directions. However, foreign material generated from moving the syringes 301A˜301C may be deposited onto the image display parts 313A˜313C, thereby contaminating the liquid crystal display panel. Thus, in order to avoid contamination, the syringes 301A˜301C remain fixed and the table 310 is moved along the forward/backward and left/right directions.
However, keeping the syringes 301A˜301C fixed and moving the table 310 may be problematic. As an overall size of the liquid crystal display panel is enlarged, a corresponding area of the substrate 300 for fabricating the large-scale liquid crystal display panel increases. Thus, in order to form the seal patterns 316A˜316F on the substrate 300, a driving distance of the table 310 is doubled in accordance with a short side of the substrate 300. Accordingly, if a length of the short side of the substrate 300 is doubled, then the driving distance of the table 310 is increased by at least a factor of four. Therefore, if the area of the substrate 300 is increased, the dispenser occupies more space, thereby degrading clean room efficiency. In addition, since the table 310 is moved horizontally along forward/backward and left/right directions, a total time for forming the plurality of seal patterns 316A˜316F increases, thereby degrading productivity and efficiency.

Dispenser system for liquid crystal display panel and method of using the same


A controller, a memory device including a memory array, and a method for accessing the memory device. The method includes, during a first access, activating a first page of the memory array corresponding to a first row address and accessing data from the first page with a first column address. The method further includes, during a second access, activating a first sub-page of the memory array corresponding to a second row address and accessing data from the first sub-page with a second column address. The activated first sub-page of the memory array is smaller than the first page of the memory array. The method further includes activating a second sub-page without receiving a separate activate command.

Modern computer systems typically include a processor and a memory device which stores information accessed by the processor. During system operation, the processor may issue access commands to the memory device to access the stored information. The access commands issued by the processor may include read and write commands. For each received access command, the memory device may process the received access command and use the access command to access a memory array which contains the information stored by the memory device.
In many cases, there is a desire to reduce the amount of power consumed by the memory device. For example, the memory device may consume power while processing each access command. In order to reduce the total amount of power consumed by the memory device, there may be a desire to reduce the amount of power consumed by the memory device while processing each access command.

Method and apparatus for using a variable page length in a memory


An integrated electronic assembly including a first electronic component defining a receptacle and at least a second electronic component wherein at least a portion of the second electronic component is disposed in the receptacle of the first electronic component, and a method for conserving space in a circuit or on a printed circuit board by integrating a plurality of electronic components so that the plurality of electronic components collectively take up a smaller amount of space on a substrate than the plurality of electronic components would if the plurality of electronic components were not integrated.

The electronics industry is continually called upon to make products smaller and more powerful. Applications such as mobile phones, portable computers, computer accessories, hand-held electronics, etc., create a large demand for smaller electronic components. These applications further drive technology to research new areas and ideas with respect to miniaturizing electronics and often require "low profile" components due to constraints in height and width. Unfortunately, the technology is often limited due to the inability to make certain circuits and components smaller, faster, or more powerful. Nowhere can this be seen more than in the struggle to manufacture smaller electronic circuits and components which take up less space on a substrate, such as a printed circuit board ("PCB").
Originally, individual components had to be mounted on a PCB by inserting the leads of the component through holes in the PCB and soldering them to solder pads on the opposite side of the PCB, (called through-hole technology). This technique left half of the PCB unpopulated because one side had to be reserved for solder pads and solder and required enough space on the PCB to mount each individual component. Therefore, in order to fit more components in a particular circuit, the PCBs were made larger, or additional PCBs were required. Many times, however, these options were not available due to constraints in size for the PCBs.
A solution to this problem came in the form of Surface-Mount Devices ("SMD"), or Surface-Mount Technology. SMDs allow electronic devices or components to be mounted on one side of a substrate, (i.e., without having leads inserted through holes in the substrate). An SMD device has small metalized pads (solder pads, terminals or leads) connected to its body, which correspond to solder pads or lands placed on the surface of the substrate. Typically the substrate is run through a solder-paste machine, such as a screen printer, which puts a small amount of solder on the substrate lands. Then, the component is placed on the substrate, and the substrate and SMD device are sent through a re-flow oven to heat the solder paste and solder the component leads to the substrate lands ("reflow soldering"). The primary advantage to this technique is that both sides of the substrate can now be populated by electronic components. Meaning one substrate today can hold an amount of electronic components approximately equal to two substrates in the past.
Another solution to this problem was the development of the integrated circuit ("IC"), which allowed circuits made up of multiple electronic components to be combined into one packaged component. This allowed more components to be mounted on a substrate and reduced the amount of substrate space used (and therefore needed) by replacing multiple individual electronic components with one IC package. This also lowered manufacturing times for assembling electronics by reducing the number of components that had to be mounted to the substrate. Today, substrates continue to be populated with ICs and individual electronic components that have not been incorporated into an IC package ("discrete components").
As a result of these advances in technology, current electronic circuits are mainly limited by the size and number of components needed to be used on the PCB. Meaning, if the electronic components are made smaller or fewer components are needed for a particular circuit, the circuit can be made smaller as well. Unfortunately, there are some electronic components that a circuit cannot due without and that cannot be produced any smaller than they currently are without sacrificing something, (e.g., performance, structural integrity, etc.). Usually this is because the desired parameters for the component cannot be achieved when using smaller parts. Good examples of this are coil components, such as for example, inductors, antennas, transformers, chokes and the like. Certain parameters of these components are affected by the size of the parts used. For instance, in inductors, wire gauge determines both the DC resistance and the current carrying ability of the component. In other examples, the component may be capable of being made in a smaller size, but incapable of performing comparably to the original larger version of the component, (e.g., with comparable inductance, frequency range, Q-value, self-resonant frequency, or the like).
Accordingly, it has been determined that the need exists for an improved electronic component which overcomes the aforementioned limitations and which further provides capabilities, features and functions, not available in current devices and for a method of conserving space in a circuit.

Integrated electronic assembly for conserving space in a circuit


An electric coupling device includes a housing having a front socket opening and a rear chamber formed by two side wall. Two prongs are disposed in the socket opening of the housing and each has a free end extended out of the housing, and two conductor terminals are electrically coupled to the prongs, and a circuit breaker is coupled between one of the prongs and one of the conductor terminals and includes a conductor blade made of memorized material for selectively terminating or switching off the electric circuit between the conductor terminal and the prong when overheated or overloaded, and a reset knob may selectively and easily and readily switch on the electric circuit again.

1. Field of the Invention
The present invention relates to an electric coupling device, and more particularly to an electric coupling device including a circuit breaker having a memorized spring blade for switching off an electric circuit when overheated or when overloaded and having a reset member for resetting and for easily switching on the electric circuit.
2. Description of the Prior Art
Typical electric coupling devices, such as sockets, plugs, or the like are provided for coupling various electric facilities to electric power sources, and comprise one or more socket openings and one or more conductor terminals or prongs for electrically coupling to the electric facilities and the electric power sources.
For safety purposes, one or more fuses will be provided and coupled to or between the electric facilities and the electric power sources for automatically terminating or switching off the electric circuit when overheated or when overloaded.
For example, U.S. Pat. No. 5,772,473 to Cheng et al. discloses one of the fuse holders having a cartridge fuse for coupling between the electric facilities and the electric power sources and the cartridge fuse will be burned out when overheated or overloaded, for preventing the electric facilities from being damaged by such as overheating or overloading. However, once the cartridge fuse is burned out, another cartridge fuse is required to be provided and prepared and engaged into the fuse holder again, and it is time consuming and complicated to replace or to change the cartridge fuse.
U.S. Pat. No. 4,771,367 to Serr et al. discloses a typical electric plug having an integral circuit breaker or over0current protection means. The breaker is sold by Mechanical Products, Inc. of Jackson, Mich. As the 2000 series. However, the breaker is expensive.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages of the conventional electric coupling devices.

Circuit breaker for electric coupling device


A valve has a valve body, a valve member, a bonnet, an anti-loosening stem and multiple fillers. The valve member is mounted inside the valve body, and has a first mounting part and a groove that is defined annually in the first mounting part. The anti-loosening stem is mounted through the valve body, and has multiple embedding elements and a second mounting part that is mounted in the first mounting part. The embedding elements are mounted radially in the anti-loosening stem and abut the groove. Thus, the anti-loosening stem is mounted firmly in the valve member. The bonnet abuts the fillers and is mounted in the valve body. Therefore, the anti-loosening stem is prevented from detaching or jetting out of the valve member and damaging the user when removing the bonnet to replace the fillers.

1. Field of the Invention
The present invention relates to a valve, and more particularly to a valve with an anti-loosening stem that is mounted firmly in a valve member. The valve prevents the anti-loosening stem from being jetted out of the valve member which damages users who remove a bonnet to replace fillers.
2. Description of the Related Art
A ball valve has a valve body, a spherical member and a stem. The stem is mounted through the valve body and mounted in the spherical member that is mounted inside a valve body and has a through hole defined through the spherical member. A user manipulates the stem to rotate the spherical member, and the spherical member controls fluid inside a pipe system to circulate or to close.
With regard to a conventional ball valve, for example, as disclosed in utility model patent No. TW311669, a stem is mounted in a spherical member and has an extending part that is formed at one of two ends of the stem. The spherical member has a recess that receives the extending part of the stem and is defined in a top end of the spherical member. To control a pipe system, a user manipulates the stem to rotate the spherical member.
A filler is mounted between the stem and the valve body to prevent fluid leakage along the stem because of high fluid pressure in the pipe system when the fluid passes through the ball valve. Furthermore, a bonnet is mounted around the stem and the filler to stick the valve body.
When fatigue occurs to the filler because of long term usage, the sealing capacity of the filler is decreased. Then, the user removes the bonnet and the stem to replace the filler. However, the connection between the stem and the spherical member is not firm. When the user removes the bonnet from the valve body, the stem may be inadvertently loosened, detached and even ejected from the spherical member damaging the user due to high fluid pressure inside the valve body.


A new cultivar of Hosta named ‘Paradise Island’, a sport of Hosta ‘Fire Island’, that is characterized by its unique variegated foliage with bright yellow to yellow- centers and dark green margins, its red petioles and red markings extending into the leaf blade and its lavender flowers present in early to mid summer.

The present invention, Hosta 'Paradise Island', relates to a new and distinct cultivar of Hosta, botanically known as a Hosta hybrid, hereinafter referred to as 'Paradise Island'.
The Inventor discovered the new cultivar, 'Paradise Island', in a container in his nursery in August of 2003 in Ter Aar, The Netherlands. 'Paradise Island' originated as a naturally occurring chimeral mutation of Hosta 'Fire Island' (unpatented).
Asexual reproduction of the new cultivar was first accomplished under the direction of the Inventor utilizing in vitro propagation in Reeuwijk, The Netherlands in September of 2005. Asexual reproduction of the new cultivar by division and tissue culture has shown that the unique features of 'Paradise Island' are stable and reproduced true to type in successive generations.


A fractional-N frequency divider includes a half-integer frequency divider and a duty cycle adjustment circuit. The half-integer frequency divider includes a multi-modulus divider containing a cascaded chain of div2/3 cells, which is responsive to a multi-bit modulus control signal, and a phase control circuit configured support half-integer frequency division by the multi-modulus divider, by providing an input terminal of the multi-modulus divider with a periodically phase-flipped input signal having a first frequency. The duty-cycle adjustment circuit is configured to generate a divider output signal with a 50% duty cycle in response to a periodic signal generated by the half-integer frequency divider.

Phase-locked loop (PLL) integrated circuits are frequently used to generate clock signals for synchronous integrated circuit systems. As will be understood by those skilled in the art, PLL integrated circuits may multiply a reference clock frequency by some number to thereby generate a relatively high frequency clock. This multiplying number can be a fractional number if fractional dividers are utilized in a feedback loop of the PLL. One typical technique to implement a fractional divider is to utilize a multi-modulus divider (MMD) with a delta-sigma modulator (DSM), which outputs a sequence of integer numbers having a fractional average value. The MMD uses these integer numbers as divisors. For example, these integer numbers can be any one of [N1, N2], where N1 and N2 are determined by the desired fractional number and the DSM order. To achieve proper operation, there should be no delays or intermediate divisors of the MMD. One example of fractional divider is disclosed in commonly assigned U.S. Pat. No. 8,559,587 entitled "Fractional-N Dividers Having Divider Modulation Circuits Therein with Segmented Accumulators," the disclosure of which is hereby incorporated herein by reference.
An example of a programmable MMD with extended range is disclosed in an article by Cicero S. Vaucher et al., entitled "A Family of Low-Power Truly Modular Programmable Dividers in Standard 0.35-urn CMOS Technology," IEEE JSSC, Vol. 35, No. 7, July 2000. A shown by FIGS. 1-2, a portion of this MMD 100 includes several stages of div2/3 cells 110 and logic circuits (e.g., OR gates, inverters). Each div2/3 cell includes four (4) level-sensitive D-type latches and three (3) AND gates, connected as illustrated. When signal MODin=1 and signal P=1, a divide-by-3 function is realized so that the states 201, 202 change as follows: (0,1)→(1,1)→(0,0)→(0,1). In addition, when signal MODin=0 and signal P=X (i.e., X=0 or 1), a divide-by-2 function is realized so that the states 201, 202 of corresponding D-type latches change as follows: (0,1)→(1,1)→(0,1). Thus, when node 201 is logic 1, MODout repeats the value of MODin and when node 201 is logic 0, MODout is logic 0, with the latch states changing at negative edges of signal Fin. As shown by FIG. 1, each stage of div2/3 cells samples its own MODin and generates its own MODout, with the rightmost input MODin being set high to a logic "1" value. Based on this configuration, each MODout signal is a positive pulse with the pulse width being one period of its own Fin. During this period, each stage has one chance to perform a "check", when its MODin is high, to determine whether it is supposed to function as a divide-by-3 cell or a divide-by-2 cell depending on its input P. The period of Fout (i.e., Tout) is related to the period of Fin (i.e., Tin) as follows:Tout=Tin(P<0>+P<1>21+ . . . +P<n−1>2n−1+P<n>2n),which means the divisor is equivalent to the binary number P<n:0>(2≦P<n:0>≦2n+1−1). Unfortunately, one problem with the MMD of FIGS. 1-2 is that when a new P<n:0> is loaded, the divisor does not directly change to the new divisor, but can get an uncertain intermediate value before becoming the new value. This property of the MMD of FIGS. 1-2 is not acceptable for fractional divider applications where any discrepancy will result in an error division ratio. U.S. Pat. No. 6,760,397 to Wu et al. and U.S. Pat. No. 6,501,816 to Kouznetsov et al. also disclose efforts to develop multi-modulus dividers for programmable frequency divider and fractional-N divider applications.
Still further conventional dividers may use cascaded chains of cells that divide by two or three as a function of a modulus control bit (MC) (e.g., ÷2 for MC=0, ÷3 for MC=1). Thus, a cascade of N cells can take any divide ratio from 2N to 2N+1−1 as a function of MC1 through MCN. Unfortunately, the duty cycle of the output divided frequency is typically less than 50%, which is a requirement for many frequency generating circuits for timing applications. A typical solution to achieve the 50% duty cycle requirement is to terminate the frequency divider chain by a divide-by-two flip-flop, which is triggered only by rising (or falling) edges at its input. As will be understood by those skilled in the art, the output of the flip-flop is high for one period of the incoming signal and low for the next period, such that the duty cycle is always 50%. But, with this solution, the output divide ratios can only take even values (e.g., 4, 6, 8, 10 . . . ). An attempt to correct this limitation by providing multi-modulus dividers that support 50% duty cycle output signals is disclosed in an article by Yu-Che Yang et al., entitled "A Dual-Mode Truly Modular Programmable Fractional Divider Based on a 1/1.5 Divider Cell," IEEE Microwave and Wireless Components Letters, Vol. 15, No. 11, pp. 754-756, November (2005).

Half-integer frequency dividers that support 50% duty cycle signal generation


This seat comprises a body (1) forming the actual seat (2) and the backrest (3) and being provided with safety straps (4) and (5) for the child, said straps being fitted to a crotch strip (7). This seat is characterized in that the straps (4) and (5) are fitted to a headrest (8) being fitted to the backrest (3) in a vertically shiftable arrangement and being integrally provided with a mechanism (9) from which a transmission element (10) extends which is linked to the lower end (7′) of the crotch strip (7), this latter being also fitted in a slidable arrangement, in such a way that the lifting and lowering motions of the headrest (8) bring about a joint increase or reduction of the space being afforded both by the straps (4) and (5) and the crotch strip (7). The headrest (8) comprises means (19) being provided for locking it in its different positions.

Several types of infant seats are already existing which in order to securely fasten the child to the seat comprise a strapping being formed by two adjustable straps being linked through a buckle to a crotch strip, said straps being joined to each other at the rear portion of the backrest and thereby forming a length passing through a tension device and extending beyond the front portion of the seat.
For the children's safety these seats are generally installed on the back seats of the motor vehicles.
Some of these infant seats comprise a backrest being provided with a headrest and are designed for rather small children of 1 to 5 years of age, for example.
In some of said seats the headrest forms a separate piece that is to be fitted to the backrest in an upwardly shiftable arrangement in order to be thus adapted to the child's height, the two straps of the strapping being fitted to the headrest.
In these seats there is the drawback that the straps will progressively adapt to the child's height as per the extent of the child's growth, but the same does not happen with the crotch strip, this latter being fixedly secured to the seat, in such a way that the more the child grows the greater its discomfort on the seat becomes because of the increasingly stronger pressing action being exerted on its crotch by the aforementioned strip.


A power block includes an insulative block which is mounted to a panel and a plurality of connection mounts which are coupled to the insulative block. The insulative block includes a plurality of molded dividers and the connection mounts are located therebetween. Each connection mount includes at least one stud extending upward from the block and a conductor having first and second portions. The first portion of each conductor is conductively coupled to the one or more studs and the second portion extends through the block in a direction opposite the one or more studs. The second portion includes a free end provided with a connector directly couplable to a destination point. A preferred aspect of the invention is that the conductor is a copper braid partially covered in a tin plated copper sleeve. According to a first embodiment, the connector at the free end of the conductor is a sleeve extending over the free end and having a hole for directly receiving a lead from a power filter. According to a second embodiment, the second portion of the conductor is formed of solid copper and the connector is a tapered free end of the second portion of the conductor which is "pluggable" into resilient clips. According to a third embodiment, the second portion of the conductors are substantially elongate and flexible, and the connector at the free end is a sleeve having a coupling slot or hole.

1. Field of the Invention
This invention relates broadly to electronic equipment. More particularly, this invention relates to electronic equipment terminal blocks which provide a conductive connection between external and internal destination points.
2. State of the Art
Electronic components and circuitry are often provided in large racks housing circuit boards and back planes. The components are powered by a DC power source; i.e., a battery. The DC power is filtered by power filters and then distributed to the components and circuitry.
A terminal block serves as the mounting point for conductively connecting the DC power source to the power filters, or for other connections, e.g., connections to bus bars and/or back planes. Terminal blocks must be able to handle high current situations while inducing minimal voltage drop. Typically, a terminal block is mounted on a panel on the equipment housing. The panel is provided with a plurality of holes for mounting other components and for extending wires therethrough.
Current off-the-shelf terminal blocks are generally of two types. The first type of terminal block includes an elongate insulative block having a first array of mechanical connection points on a first side of the block. A second side of the insulative block (orthogonal to the first side) is provided with a second array of mechanical or solder type connection points which are conductively coupled to the first side connection points. The terminal block is assembled between the power source and power filter by (1) panel mounting the terminal block; (2) attaching wires from the power source to the terminal block by a mechanical means; (3) cutting a series of intermediate wires to length and stripping the ends of wire; (4) attaching first ends of each of the wires to the second array of connection points; (5) feeding the second ends through holes in the panel; (6) securing power filters to the rear of the panel; and (7) wrapping the second ends of the second wires around leads on the power filters and securing by nuts. The resulting arrangement conductively couples the power source to the power filters.
A second type of terminal block includes threaded studs molded into the insulative block and extending outward from front and back sides, thereby forming front and back stud portions. The terminal block is connected to the DC power source and the power filter by: (1) passing the back studs through holes in a panel such that the back of the terminal block is flush with the panel; (2) using mounting hardware to mount the terminal block to the panel; (3) coupling the power filters to the rear of the panel; (4) coupling a first array of wires extending from the power source to the front stud portions and securing in place with nuts; (5) stripping first and second ends of an array of intermediate wires; (6) coupling the first ends of the wires to the back stud portions and securing in place with nuts; (7) coupling the second ends of the array of intermediate wires to the power filter with nuts.
In each prior art design, a series of intermediate wires are required to couple the terminal block to the power filters. This has several disadvantages. First, intermediate wires increase voltage drops. In addition, with increasing wire length of the intermediate wires, the power source to power filter connection will be subject to increased EMI. It is difficult to decrease the length of the intermediate wires, as the intermediate wires must be easily manipulable by an on-site technician and must be long enough to route between the power source and the power filter (typically at least four inches). Additional voltage drop is caused by the increased number of connections required when using intermediate wires. Furthermore, assembling the prior art designs requires a time consuming procedure necessitating a large number of manual connections.

Panel feedthrough terminal block assembly


Provided are techniques for monitoring communication packets. A communication packet is received. A communication packet signature of the communication packet is determined. The communication packet signature is compared to one or more site-specific application signatures. In response to determining that the communication packet signature matches at least of the one or more site-specific application signatures, it is determined that the communication packet is to be trusted.

In a network of computing devices, Intrusion Detection System (IDS) sensors monitor network traffic (also referred to as "network packets") and are used to detect suspicious or malicious traffic (e.g., viruses). Conventional IDS sensors monitor network traffic based on known vulnerabilities and anomaly detection. Rules that specify the vulnerabilities and anomalies are typically stored in a database. The rules typically specify a pattern that the IDS sensors try to identify. When a network packet is received at an IDS sensor, the IDS sensor compares the network packet to the rules. For example, a virus has a certain signature. A signature may be described as providing a description of how the virus acts and which code the virus executes. Then, the rule for the virus may specify the signature, along with information, such as which port of a computing device the virus usually attacks.
Conventional IDS sensors may include a large number of rules. In some cases, the IDS sensors identify a network packet as suspicious or malicious, even though the network packet may be "trusted" (i.e., routing of the network packet on the network may continue as the network packet has been determined not to be suspicious or malicious). Thus, false-positive alerts are created and sometimes hard to distinguish. A false-positive alert is one that turns out to be "false" (i.e., a network packet is identified as suspicious or malicious even though the network packet may be "trusted").
Moreover, the IDS sensors may provide a large number of alerts that have to be sorted and manually inspected by highly trained security personnel. For example, IDS sensors may generate many (e.g., thousands of) alerts that need to be manually inspected before the alerts can be processed appropriately.
Thus, there is a need in the art for improved intrusion detection systems.

Use of application signature to identify trusted traffic


Total bilirubin or direct bilirubin is measured by allowing nitrous acid as an oxidizing agent to act on a sample of living body fluid, and measuring optical changes of the sample. For measuring the direct bilirubin, nitrous acid is allowed to act on the sample in the presence of thiourea as a reaction inhibitor for indirect bilirubin. For measuring the total bilirubin, nitrous acid is allowed to act on the sample in the presence of cetyltrimethylammonium bromide as a reaction accelerator. Or, direct bilirubin is measured by allowing an oxidizing agent to act on a sample of living body fluid in the presence of a specific non-ionic surfactant. These methods have a good correlation to the conventional enzymatic method and a good reagent stability and provide safe methods for measuring bilirubin with less danger to environmental pollution.

Bilirubin is a metabolic product of hemoglobin derived from aged erythrocyte and is the main component of bile pigment. Blood bilirubin includes direct bilirubin (conjugate form) and indirect bilirubin (free form). Direct bilirubin, whose propionic acid group on the side chain enzymatically forms an ester bond mainly with glucuronic acid in the liver, is highly water soluble, and reacts directly with a diazo reagent to form an azo coloring matter. Indirect bilirubin, whose propionic acid group is in a free state, is low in the water solubility and reacts with a diazo reagent only in the presence of a reaction accelerator such as alcohol, etc. to form an azo coloring matter.
Measurement values obtained by measuring bilirubin in blood includes a total bilirubin value and a direct bilirubin value. Total bilirubin value is a measurement value of conjugate form and free form in total, obtained by reaction with a diazo reagent in the presence of a reaction accelerator. Direct bilirubin value is a measurement value only of conjugate form, obtained by reaction with a diazo reagent in the absence of a reaction accelerator. Individual bilirubin concentrations of conjugate form and free form can be separately determined from these measurement values to make diagnosis of various liver diseases and diacrisis of jaundice. Thus, the measurement of bilirubin is an important phase of the clinical laboratory tests.
A diazo method for measuring color intensity of azobilirubin formed by the above-mentioned reaction of bilirubin with a diazo reagent is a conventional leading method for measuring bilirubin and has been widely used for diagnosis of various liver diseases.
Another method is to measure bilirubin on the basis of changes in absorbance of bilirubin by allowing an oxidizing agent to act on bilirubin in a sample of living body fluid to oxidize bilirubin. The method for measuring bilirubin, using such an oxidizing agent, includes, for example, a BOD method using bilirubin oxidaze (BOD) as an oxidizing agent, a chemical oxidation method using ferricyanide ions, copper ions, vanadate ions, etc. as an oxidizing agent in place of BOD, etc.
Other methods include, for example, a high performance liquid chromatographical method by high performance liquid chromatography, a film method using a mordant-coated film, etc.
Every one of these methods has both merits and demerits and has been not satisfactory yet.
That is, the diazo method has such problems that the reagent is unstable, that is, effective only about 5 days after the preparation and also ascorbic acid or hemoglobin present in a sample interferes with the measurement values. The BOD method has such problems that use of the enzyme inevitably increases measurement costs and the enzyme is effective only about 2 weeks after the preparation because the enzyme is difficult to be stabilized. The chemical oxidation method has such a disadvantage that use of highly toxic metal ions, etc. inevitably involves a waste water treatment problem and an environmental pollution problem. The high performance liquid chromatographic method or the film method needs a special measurement apparatus in spite of satisfactory measurement values, and has such a disadvantage as poor versatility in simultaneous multi-phasic measurement of a large number of samples like other phases of the clinical laboratory test chemistry.
In the current situation it is desirous to develop a method for measuring bilirubin, using a stable and safe reagent, which is applicable to versatile automatic analyzers and has a good correlation to the conventional method, particularly to the enzymatic method with distinguished characteristics.


A gas stream containing at least 50% by volume of ammonia but eventually no hydrogen sulphide is burned in a reaction region which is supplied with oxygen and oxygen-enriched air. Both combustion and thermal cracking of ammonia takes place in the reaction region. The rate of supplying oxygen moleculars to the reaction region is from 75 to 98% of the stoichiometric rate required for full combustion of all combustible fluids supplied to the reaction region. Under these conditions essentially no ammonia remains in the effluent gas but formation of oxides of nitrogen can be minimised.

This invention relates to a method of destroying a waste gas comprising ammonia.
Waste gas streams comprising ammonia are frequently encountered in refineries. Sometimes such waste gas streams also contain hydrogen sulphide in comparable proportions. These gas streams can be employed as a feed stream to the Claus process.
Other waste gas streams formed in refineries can contain little or no hydrogen sulphide but may contain ammonia, sometimes as essentially the only combustible component thereof. There is a need to destroy essentially all of the ammonia in such gas streams but without creating appreciable amounts of oxides of nitrogen in the effluent gas arising from the destruction process.
It is an aim of the present invention to provide a method of destroying a waste gas stream containing at least 50 per cent by volume of ammonia but essentially no hydrogen sulphide which makes it possible to solve the above problem.
We have surprisingly discovered that essentially pure ammonia streams can be successfully destroyed without creating appreciable quantities of oxides of nitrogen by employing oxygen-enriched air or its equivalent to support combustion of the ammonia, provided that sub-stoichiometric combustion conditions are maintained in the furnace in which the destruction is carried out.
According to the present invention there is provided a method of destroying a waste gas containing at least 50 per cent by volume of ammonia, comprising the steps of:
(a) supplying at least one stream of the waste gas to a reaction region;
(b) supplying molecules of oxygen to the reaction region either in at least one stream of oxygen-enriched air or in separate streams of (i) air unenriched in oxygen and (ii) pure oxygen or oxygen-enriched air;
(c) both burning and thermally cracking ammonia in the reaction region; and
(d) taking from the reaction region an effluent gas stream, comprising nitrogen, water vapour, argon, and hydrogen but being essentially free of nitric oxide, nitrogen dioxide, and dinitrogen tetroxide and essentially free of ammonia, wherein
(i) the mole ratio of oxygen molecules to all non-combustible gas molecules (including oxygen molecules) supplied to the reaction region is in the range of 28:100 to 70:100;
(ii) the rate of supplying oxygen molecules to the reaction region is from 75 to 98% of the stoichometric rate required for full combustion of all combustible fluids supplied to the reaction region;
(iii) and essentially no hydrogen sulphide is supplied to the reaction region.
By employing oxygen-enriched air, or equivalent separate supplies of oxygen and air, containing at least 28 mole per cent of oxygen, it becomes possible to create in the ammonia flame a sufficiently high temperature to cause some of the ammonia to crack thermally to form ammonia and hydrogen. This sub-stoichometric oxidation conditions can be maintained in the reaction region while obtaining essentially complete destruction of ammonia. A consequence of operation under sub-stoichometric oxidation conditions is that any oxides of nitrogen that are formed, i.e. nitric oxide, nitrogen dioxide or dinitrogen tetroxide, can be reduced to nitrogen by reductant(s) present in the reaction region.
Preferably, the rate of supplying oxygen molecules to the reaction region is from 80 to 90 per cent of the stoichometric rate required for full combustion of all combustible fluids supplied to the reaction region. At such a rate a favourable combination of destruction of ammonia by combustion and by thermal cracking can be achieved.
Preferably, the reaction region, or at least part of it is defined in a furnace. Preferably, the flow rate of at least one influent stream into the furnace is controlled so as to maintain the temperature of the effluent gas at the exit of the furnace in the range of 1300xc2x0 C. to 1700xc2x0 C. At temperatures above 1700xc2x0 C., damage tends to be done to the furnace, particularly any refractory lining thereof.
Preferably, the effluent gas contains more than 4 per cent by volume of hydrogen. More preferably, the effluent gas contains from 5 to 10 per cent by volume of hydrogen. Such effluent gas compositions are typically flammable and can therefore be burned to form a tail gas which may be discharged to the atmosphere, if necessary, after removal of any remaining traces of ammonia by dissolving such traces in water or other aqueous medium.
Selecting a mole ratio of oxygen molecules to all non-combustible gas molecules (including oxygen molecules) supplied to the reaction which is significantly above the minimum of 28:100, and a rate of supplying oxygen molecules to the reaction region of less than 90 per cent of the stoichometric rate required for full combustion of all combustible fluids both facilitate the production of an effluent gas stream which can readily be burned.
If, for example, the effluent gas stream is not flammable or is not able to sustain a stable flame, the concentration of hydrogen in it can be enhanced by any of the following measures if taken upstream of the combustion of the effluent gas stream:
(i) condensation or adsorption of at least part of its water vapour content;
(ii) separation by PSA or membranes to enhance its hydrogen content;
(iii) addition of a fuel gas thereto.
Measure (i) may be performed by cooling the effluent gas stream and contacting the cooled effluent gas stream with water or other aqueous medium.
Although it is generally performed to burn the effluent gas stream and discharge the resulting tail gas to the atmosphere, if desired, after treatment of the effluent gas stream to remove the last traces of ammonia therefrom, other methods of treating the effluent gas stream are possible. For example, the effluent gas stream may be subjected to separation so as to obtain a more concentrated fuel gas such as essentially pure hydrogen product. Another option, which is preferred if a small amount of hydrogen sulphide is supplied to the reaction region, is to supply the effluent gas stream to a unit for cleaning a tail gas from a Claus plant.
The expression xe2x80x9cessentially no hydrogen sulphide is supplied to the reaction regionxe2x80x9d should be understood to encompass the supply of hydrogen sulphide to the reaction region at a low rate, i.e. such that up to 5 mole per cent of the combustibles supplied to this region is formed of hydrogen sulphides with the effluent gas stream being suitable for treatment in a unit for cleaning a tail gas from a Claus plant.
The reaction region is readily operable so as to avoid the creation of an effluent gas stream that contains any of ammonia, nitric oxide, dinitrogen tetroxide, and nitrogen dioxide.
Preferably, all the waste gas is fed to a burner which fires into the reaction region. Alternatively, some of the waste gas may be introduced into the reaction region downstream of the flame created by operation of the burner. The ammonia introduced into the downstream region can then react with any nitric oxide, nitrogen dioxide or dinitrogen tetroxide in the combustion products produced by operation of the burner.
The effluent gas stream is preferably burned in a further furnace into which a further burner fires. The entire effluent gas stream is preferably supplied to the further burner. Combustion of the effluent gas stream may be supported by air or pure oxygen, or by oxygen-enriched air. The effluent gas stream is preferably cooled intermediate the furnaces.


A sitting position of a vehicle occupant in the longitudinal direction of a vehicle is detected, an outlet close to the sitting position of the occupant from plural outlets and is selected based on the detected sitting position, and air is blown out from the selected outlet toward the occupant""s sitting position. Thus, since an outlet close to the occupant""s sitting position is selected, it becomes easier for air to reach the vehicle occupant to sufficiently cool or warm the occupant with a small amount of blown out air.

The present invention relates to an air conditioning system for a vehicle, and more particularly to an air conditioning system for a vehicle having at least three rows of seats in the longitudinal direction of the vehicle.
Heretofore there has been an RV (recreational vehicle) having three rows of seats (front, middle and rear seats) in the longitudinal direction of the vehicle in which a cooling outlet and a heating outlet are provided for each of the front, middle and rear seats to ensure satisfactory air conditioning for all of occupants on those seats.
In such an RV, however, seat slide ranges (position adjusting ranges) in the vehicular longitudinal direction of the middle and rear seats are wide, so for example when the middle seat is moved largely to the rear seat side, the distance between the air outlet for the middle seat and the sitting position of the middle seat occupant increases remarkably, so that it becomes difficult for the blown out air to reach the middle seat occupant.
In JP-A No. H10-86628 there is disclosed an air conditioning system wherein the position of a front seat in the longitudinal direction of a vehicle is detected and the volume of air blown out to the front seat occupant is adjusted in accordance with the distance between an outlet for the front seat and the front seat.
Where it is difficult for the blown out air to reach any of the three rows of seats in the foregoing vehicle, if the volume of air is adjusted and increased as in the aforesaid publication, it is possible to solve the described problem. However, the air which has been diffused to another occupant as a result of the increase in air volume creates a draft, thus making another occupant uncomfortable. If the air volume is increased merely to solve the deteriorated cooling or heating, an air conditioning having a large capacity is required, causing an increase in the load of a refrigerant compressor during cooling, with consequent increase in the driving force of the refrigerant compressor.
In an air conditioning system in which engine cooling water is used as a heat source for heating air with an increase in efficiency of a vehicle engine, the heat source during heating becomes insufficient as the volume of blown out air increases, thus giving rise to the problem that the temperature of blown out air drops.
The present invention has been accomplished in view of the above-mentioned drawbacks and it is therefore an object of the invention to provide an air conditioning system for a vehicle having at least three rows of seats in the longitudinal direction of the vehicle, which can ensure cooling and warming of vehicle occupants while suppressing an increase in air volume no matter in what vehicular longitudinal positions the occupants may sit.
For achieving the above-mentioned object, in a first aspect of the present invention there is provided a method for controlling an air conditioning system for a vehicle having three or more rows of seats in the longitudinal direction of the vehicle, the seats being adjustable in their vehicular longitudinal positions, the air conditioning system being mounted on the vehicle and having plural air blow out outlets in the vehicular longitudinal direction, which method comprises detecting a sitting position of a vehicular occupant in the vehicular longitudinal direction, selecting an outlet located near the occupant""s sitting position out of the plural outlets based on the detected sitting position, and blowing out air from the selected outlet toward the occupant""s sitting position.
Thus, since the outlet located near the occupant""s sitting position is selected and air is blown out from the selected outlet, it is easier for blown out air to reach the occupant. Specifically, with a small volume of blown out air, the occupant is sufficiently cooled or warmed. Also, since the volume of air blown out toward the occupant can be reduced, there is no fear of draft air flowing toward another occupant of the vehicle.
Moreover, since the blown out air volume for a vehicular occupant can be diminished, in an air conditioning system provided with a refrigerant compressor, it is possible to decrease the load on the refrigerant compressor during cooling, and thereby decreasing the driving force of the refrigerant compressor.
Further, since the blown out air volume for a vehicular occupant can be diminished, in an air conditioning system wherein engine cooling water is utilized as a heat source for heating blast air, it is possible to prevent a lowering in temperature of blown out air during heating and hence sufficiently warming the occupant.
In a second aspect of the present invention there is provided, in combination with the above first aspect, a vehicular air conditioning system controlling method wherein the temperature or volume of the air blown out from the outlets is controlled according to the sitting position of the vehicle occupant.
According to this method, for example during cooling, by reducing the temperature of blown out air with an increase in the distance between the vehicle occupant and the associated outlet, a sufficient cool feeling can be given to the occupant with a reduced volume of blown out air.
In a third aspect of the present invention there is provided, in combination with the above first or second aspect, a vehicular air conditioning system controlling method wherein whether an occupant is sitting on a seat is detected for each of the seats and air is blown out to only the seat on which the occupant sits. According to this method, it is possible to decrease the total volume of air blown out from the air conditioning system and thereby further diminish the load on the refrigerant compressor.
In a fourth aspect of the present invention there is provided an air conditioning system for a vehicle having three or more rows of seats in the longitudinal direction of the vehicle. The seats are adjustable in their vehicular longitudinal positions. The air conditioning system has a plurality of air outlets in the longitudinal direction of the vehicle and has a sitting position detecting means for detecting an occupant""s sitting position in the longitudinal direction of the vehicle. An outlet selecting means is provided for selecting, out of the plural outlets, an outlet located near the occupant""s sitting position based on the result of detection obtained by the sitting position detecting means, blow out direction calculating means which calculate a direction in which air is blown out from the outlet selected by the outlet selecting means. This is based on the detection obtained by the sitting position detecting means, and blow out direction adjusting means which are controlled based on the calculation obtained by the blow out direction calculating means and which adjust the blow out direction of air from the outlet selected by the outlet selecting means.
Further areas of applicability of the present invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are intended for purposes of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description. In the drawings:

Air conditioning system for vehicle and method for controlling same


The invention describes HIV-1 subtype isolate regulatory/accessory genes, and modifications and derivatives thereof. The genes which are described are the tat, nef and rev genes. Consensus amino acid sequences are also disclosed. The invention also relates to a vaccine including two or more of the nucleotide sequences, and nucleotide sequences from the pol and/or gag genes of HIV-1.

THIS invention relates to a process for the selection of HIV-1 subtype (clade) C isolate regulatory/accessory genes, selected HIV-1 subtype C isolate regulatory/accessory genes and modifications and derivatives thereof for use in prophylactic and therapeutic vaccines to produce proteins and polypeptides for the purpose of eliciting protection against HIV infection or disease.
The disease acquired immunodeficiency syndrome (AIDS) is caused by human immunodeficiency virus (HIV). Over 34 million people worldwide are thought to be living with HIV/AIDS, with over 95% of infected people living in developing countries (UNAIDS, 1999). It is estimated that 24.5 million infected people reside in sub-Saharan Africa and that South Africa currently has one of the world's fastest growing HIV-1 epidemics. At the end of 2000, over 24% of pregnant women attending government antenatal clinics in South Africa were HIV positive (Department of Health, 2001). A preventative vaccine is considered to be the only feasible way to control this epidemic in the long term.
HIV shows remarkable genetic diversity that has confounded the development of a vaccine. The molecular basis of variation resides in the viral enzyme reverse transcriptase which not only introduces an error every round of replication, but also promotes recombination between viral RNAs. Based on phylogenetic analysis of sequences, HIV has been classified into a number of groups: the M (major group) which comprises subtypes A to H and K, the O (outlier group) and the N (non-M, non-O group). Recently recombinant viruses have been more frequently identified and there are a number which have spread significantly and established epidemics (circulating recombinant forms or CRF) such as subtype A/G recombinant in West Africa, and CRF A/E recombinant in Thailand (Robertson et al., 2000).
Subtype C predominates in the Southern African region which includes Botswana, Zimbabwe, Zambia, Malawi, Mozambique and South Africa. In addition, increasing numbers of subtype C infections are being detected in the Southern region of Tanzania. This subtype also predominates in Ethiopia and India and is becoming more important in China.
A possible further obstacle to vaccine development is that the biological properties of HIV change as disease progresses. HIV requires two receptors to infect cells, the CD4 and co-receptors of which CCR5 and CXCR4 are the major co-receptors used by HIV-1 strains. The most commonly transmitted phenotype is non-syncytium inducing (NSI), macrophage-tropic viruses that utilise the CCR5 co-receptor for entry (R5 viruses). Langerhans cells in the mucosa are thought to selectively pick up R5 variants at the portal of entry and transport them to the lymph nodes where they undergo replication and expansion. As the infection progresses, viruses evolve that have increased replicative capacity and the ability to grow in T cell lines. These syncytium-inducing (SI) T-tropic viruses use CXCR4 in conjunction with or in preference to CCR5, and in some cases also use other minor co-receptors (Connor et al., 1997, Richman & Bozzette, 1994). However HIV-1 subtype C viruses appear to be unusual in that they do not readily undergo this phenotypic switch, as R5 viruses are also predominant in patients with advanced AIDS (Bjorndal et al., 1999, Peeters et al., 1999, Tscherning et al., 1998, Scarlatti et al., 1997).
An HIV vaccine aims to elicit both a CD8+ cytotoxic T lymphocyte (CTL) immune response as well as a neutralizing antibody response. Many current vaccine approaches have primarily focused on inducing a CTL response. It is thought that the CTL response may be more important as it is associated with the initial control of viral replication after infection, as well as control of replication during disease, and is inversely correlated with disease progression (Koup et al., 1994, Ogg et al., 1999 Schmitz et al., 1999). The importance of CTL in protecting individuals from infection is demonstrated by their presence in highly exposed seronegative individuals, for example certain sex-workers in Kenya (Rowland-Jones et al., 1998).
Knowledge of genetic diversity is highly relevant to the design of vaccines aiming at eliciting a cytotoxic T-lymphocyte (CTL) response. There are many CTL epitopes in common between viruses (HIV Molecular Immunology Database, 1998). In addition, several studies have now shown that there is a cross-reactive CTL response: individuals vaccinated with a subtype B-based vaccine could lyse autologous targets infected with a diverse group of isolates (Ferrari et al., 1997); and CTLs from non-B infected individuals could lyse subtype B-primed targets (Betts et al. 1997; Durali et al, 1998). A comparison of CTL epitopes in the HIV-1 sequence database indicated that there is a greater conservation of cytotoxic T epitopes within a subtype compared to between subtypes and that there will be a greater chance of a CTL response if the challenge virus is the same subtype as the vaccine strain.
It is thought that the regulatory genes of HIV are extremely important in eliciting an immune response. Tat, Rev and Nef are all expressed early in the infectious cycle and would thus provide targets for cytotoxic T lymphocytes (CTLs) early in infection, possibly allowing virus infected cells to be destroyed before the virus can spread (Klotman et. al., 1991; Addo et. al., 2001). In addition, there is promising data showing that the Tat protein elicits an effective immune response in HIV-infected, asymptomatic people (Calarota et. al., 1999; Calarota et. al., 2001). It has recently been reported that the Tat protein is one of the first to undergo escape from CTL in infected macaques (Allen et. al., 2000). This indicates that there is immune pressure on tat and that there is an early response to the Tat protein.
Viral strains used in the design of a vaccine need to be shown by genotypic analysis to be representative of the circulating strains and not an unusual or outlier strain. In addition, it is important that a vaccine strain also has the phenotype of a recently transmitted virus, which is NSI and uses the CCR5 co-receptor.

HIV-1 subtype isolate regulatory/accessory genes, and modification and derivatives thereof

The South African Medical Research Council


A method of fabricating a semiconductor device of the invention includes a plating process of filling a plurality of recesses provided to an insulating film formed on a substrate with an electro-conductive material, wherein the plating process includes a process step (S104) of performing the plating with a first current density which was obtained by correcting a predetermined first reference current density based on ratio of surface area Sr=S1/S2 of a first surface area S1 over the entire surface of the substrate which includes the area of side walls of the plurality of recesses over the entire surface of the semiconductor substrate, and a second surface area S2 over the entire surface of the substrate which does not include the area of side walls of the plurality of recesses, when fine recesses not larger than a predetermined width, out of all of the plurality of recesses, are filled with the electro-conductive material.

1. Technical Field
The present invention relates to a method of fabricating a semiconductor device, adopted to a process of forming by plating an electro-conductive film on an insulating film having a plurality of recesses formed therein, and a plating apparatus.
2. Related Art
In semiconductor devices using copper interconnect, there is an increasing demand on improved performance in filling of holes and trenches by copper plating, with progress of scaling of interconnect patterns as a result of shrinkage of design rule.
U.S. Pat. No. 6,319,831 and U.S. Pat. No. 6,140,241 describe procedures in which a first plating is carried out at a lower current density, and a second plating is then carried out at a higher current density.
Japanese Laid-Open Patent Publication No. 2001-123298 describes a technique of electrolytic plating. In this document, a mathematical relationship between current density and potential of electrode is determined by using an electrode composed of the same material with an object to be plated, and then the object to be plated is polarized in a plating bath at an arbitrary potential or current. A current value and potential value of the polarized object are measured, then an area of the object to be plated is calculated based on the mathematical relationship, the current value and potential value. Thus the calculated area of the object to be plated is used for electrolytic plating. More specifically, an interconnect pattern is formed on a substrate by a photolithographic technique using a photosensitive resist for plating, and the current value is then measured by allowing the substrate to polarize, in order to determine the exposed area of the electrode not covered by the photosensitive resist, that is, the area to be plated. The area of the substrate to be plated is then calculated based on the current value. Current value for the plating is then determined based on the calculated area.
Japanese Laid-Open Patent Publication No. 2005-264271 describes a method of fabricating a semiconductor device which includes a step of acquiring a ratio of fine recesses having width not larger than a first reference width in a layer having a plurality of recesses formed therein, a step of determining integrated current value necessary for filling up the recesses with an electro-conductive material based on the ratio, and a step of forming an electro-conductive layer by the electroplating process, based on thus-determined integrated current value. It is described that the method can successfully form an electroplated film with an appropriate thickness.
Japanese Laid-Open Patent Publication No. 2006-60011 describes a method of fabricating a semiconductor device which includes a first plating process allowing current having a first current density to flow using as an electrode a seed film formed on the surface of an insulating film and in openings, so as to deposit an electro-conductive material in the openings by the plating process, a second plating process following the first plating process, allowing current having a current density smaller than the first current density to flow so as to deposit the electro-conductive material on the surface of the insulating film by the plating process, and an annealing process following the second plating process, annealing the product.
Japanese Laid-Open Patent Publication No. 2005-39142 describes a method of fabricating a semiconductor device which includes a first step allowing electrolytic plating to proceed so as to fill at least either one of interconnect trenches and holes formed in an insulating film on a semiconductor substrate with an electro-conductive layer, under a condition such that an integrated current density, which is a product of current density (a current value per unit area of a cathode electrode, that is a wafer to be plated) and plating time, is kept at a predetermined value, and a second step allowing plating to proceed under a condition such that the current density is kept smaller than that in the first step. It is described that adoption of the electrolytic plating method in this patent publication can successfully improve filling performance of the electro-conductive layer formed in the interconnect trenches and holes, and can improve uniformity of bottom-up performance over the entire surface of wafer.
Japanese Laid-Open Patent Publication No. 2004-270028 describes a method of damascene copper plating, including a step of allowing current to flow, only in the direction opposite to the current direction corresponding to the growth of the plated film during plating. The method can prevent the plated film from piling up in the area where the interconnect is densely distributed, and can consequently avoid increase in the cost due to increase in the process time of CMP.
A plating apparatus generally has a preset recipe describing predetermined reference current density applied to the works to be plated and plating time. On the other hand, a substrate of a semiconductor device may have various interconnect patterns depending on design. A substrate having a lot of fine patterns need longer time for the plating, as compared with a substrate having only a less amount of fine patterns. For this reason, plating various substrates of semiconductor devices having different designs under the same current density and the same duration of time has a problem in that the semiconductor devices having a less amount of fine patterns causes excessive growth of the plated film, if the plating is allowed to proceed on the basis of the semiconductor devices having a lot of fine patterns. The excessive growth of the plated film is causative of unnecessary costs due to unnecessarily large consumption of plating material, takes a longer time for the succeeding CMP or other processing, and results in lowering in throughput. On the contrary, plating on the basis of the semiconductor devices having only a less amount of fine patterns raises a problem in that the semiconductor devices having a lot of fine patterns suffers from insufficient formation of the plated film. In particular, the fine recesses cannot thoroughly be plated, leaving voids or the like formed in the recesses. These problems have been remained unsolved.
After extensive investigations into the above-described phenomena, the present inventors found out that, when the recesses of the semiconductor devices are filled with an electro-conductive material by plating, the above-described problems are ascribable to large difference in effective surface area for the plating, as a result of large difference in the area of the side walls of the recesses depending on the density of interconnect pattern.
However, these problems have been left unsolved. For example, Japanese Laid-Open Patent Publication No. 2001-123298 determines a current value for plating based on the area of the electrode to be plated, but makes no consideration on characteristics of filling of the recesses with the electro-conductive material by plating. In other words, accurate correction cannot be given, because there is no consideration on the area of side walls of the recesses. Japanese Laid-Open Patent Publication No. 2005-264271 determines the integrated current value depending on ratio of the fine recesses to the layer, but makes no consideration on the effective surface area for plating, and therefore gives no accurate correction.

Method of fabricating semiconductor device, and plating apparatus


A metallic thin plate is etched to form a plurality of keypads having hollowed portions and cut to form a metallic keypad panel having a predetermined shape. Then, an electroplated layer is coated on the surface of the metallic keypad panel. A layer of protective film is adhered on the non-electroplated surface of the metallic keypad panel, which is disposed in a mold. A plastic material is then injected into the mold, so that the plastic material is formed into a pattern layer. In addition, a plastic thin plate is prepared with one side surface printed with a displaying layer, is adhered on elastic bodies having a plurality of protrusions and is cut to form an elastic layer. Finally, after the protective film is peeled off, an adhesive layer is applied thereon. The elastic layer is adhered on the surface of the adhesive layer.

1. Field of the Invention
The present invention relates to a keypad panel, and in particular to a method for manufacturing a metallic keypad panel.
2. Description of Prior Art
Keypad panel has become a necessary hardware for a portable electronic device. The surface of the keypad on the keypad panel is provided with numerals, characters, phonetic symbols, roots for an input method and various functional icons, so that a user can input data according to the icon displayed on the surface of the keypad or perform various functions of the portable electronic device. Therefore, for a portable electronic device, the keypad panel is a very important input means.
For example, a conventional metallic keypad panel on a portable electronic device is shown in FIGS. 1(a) and 1(b) (Japanese Laid-Open Patent Publication No. 2007-115633). In manufacturing the metallic keypad panel 10a disclosed in FIG. 1, a metallic plate 1a is prepared first. Then, a first etching process is applied to the metallic plate 1a, thereby forming hollowed portions 2a having characters, numerals and marks. After etching the hollowed portions 2a, a second etching process is applied to one side surface of the metallic plate 1a. After the second etching process, one side surface of the metallic plate 1a is formed thereon with a cross-like recessed portion 2b. Then, the metallic plate 1a is disposed in a mold. A resin is injected into the mold, so that the resin can fill the hollowed portions 2a and the cross-like recessed portion 2b. The cross-like recessed portion 2b allows the resin to be combined on the metallic plate 1a firmly, thereby forming a resin layer 3a. After the metallic plate 1a is combined with the resin layer 3a, the metallic plate 1a is cut to form keypad caps 11a. Then, one side surface of the resin layer 3a is printed with a printing layer 4a. An adhesive layer 5a is applied on the printing layer 4a. The resin layer 3a is adhered on elastic bodies 7a of a base 6a, so that a protrusion 71a of the elastic body 7a can press against a metal dome 8.
In manufacturing the above-mentioned metallic keypad panel 10a, since two or more etching processes should be applied to the metallic plate 1a, more work hours and a large number of processes are necessary. Further, a gap is formed between each keypad cap 11a, and the gap may be filled with dusts or penetrated by liquid easily. As a result, the metallic keypad caps 11a cannot be pressed smoothly or an internal short circuit may occur. Further, one side surface of the metallic plate 1a does not provide any reflective effect of a particular luster. Therefore, the external appearance and the overall visual effect of the metallic keypad panel 10a are dull.

Method for manufacturing metallic keypad panel having ripple luster


The present invention relates to a method of stimulating the motility of the gastrointestinal system in a subject in need thereof, wherein the subject suffers from maladies (i.e., disorders or diseases) of the gastrointestinal system. The method comprises administering to a subject in need thereof a therapeutically effective amount of a growth hormone secretagogue compound or a pharmaceutically acceptable salt, hydrate or solvate thereof. The growth hormone secretagogue can be co-administered with a laxative, a H2 receptor antagonist, a serotonin 5-HT4 agonist, an antacid, an opioid antagonist, a proton pump inhibitor, a motilin receptor agonist, dopamine antagonist, a cholinergic agonist, a cholinesterase inhibitor, somatostatin, octreotide, or any combination thereof.

Gastrointestinal (GI) motility is a coordinated neuromuscular process that transports nutrients through the digestive system. C. Scarpignato, "Pharmacological Stimulation of Gastrointestinal Motility: Where We Are And Where Are We Going?" Dig. Dis., 15: 112 (1997). Impaired (i.e., slowed) motility of the gastrointestinal system, which can be involved in gastroesophageal reflux disease, gastroparesis (e.g., diabetic and postsurgical), irritable bowel syndrome and constipation, is one of the largest health care burdens of industrialized nations. S. D. Feighner et al., "Receptor for Motilin Identified in the Human Gastrointestinal System," Science, 284: 2184-2188 (Jun. 25, 1999).
In view of the above, an effective, physiological way to stimulate motility of the gastrointestinal system is highly desirable.

Method of stimulating the motility of the gastrointestinal system using growth hormone secretagogues


The invention relates to an integrated memory module having a memory unit and a self-test circuit, the self-test circuit being embodied in such a way as to make available test data and test addresses for testing memory areas in the memory unit and to generate defect data depending on the detection of a defect, a test circuit being provided in order to receive defect data from one or a plurality of connectable memory modules to be detected, the test circuit being configured in such a way as to store the received defect data depending on addresses assigned thereto in the memory unit.

1. Field of the Invention
The invention relates to an integrated memory module having a self-test circuit, to a test system and also to a method for testing integrated memory modules.
2. Description of the Related Art
In order to check integrated memory modules with regard to their functionality after the production process, they are tested. For this purpose, the integrated memory modules are connected to a tester device and a test operation is started, during which each of the memory cells of the integrated memory module is checked with regard to predetermined specifications.
The memory module is tested by data being written in and subsequently read out again, defect data being generated from a comparison between data written in and data stored in the relevant memory cell, which defect data specify whether the memory cell is defective or functions correctly. The generation of the data for testing the memory module can be effected by a self-test circuit which also determines the defect data.
Said defect data have to be transferred from each of the memory modules to be tested to the testing test device. This is time-consuming and considerably restricts the throughput of integrated memory modules.
The defect data determined serve to determine a repair solution which makes it possible to replace defective memory areas in the integrated memory module by redundantly provided memory areas which are likewise present in the integrated memory module. However, since a defective memory cell is not replaced by a redundant memory cell, but rather by a redundant memory area, it suffices, for the determination of the repair solution, to obtain only a defect address of the memory area in which one or a plurality of defective memory cells are situated. This may be done for example as early as in the self-test circuit provided in the integrated memory module, so that the defect data to be transferred to the tester device are already compressed. Since no information required for determining the repair solution is lost as a result, the term redundancy-conforming compression is used.
Despite compression, the time taken to transfer the defect data is considerable and the throughput when testing integrated memory modules on a tester device is thus restricted.

Memory module, test system and method for testing one or a plurality of memory modules


An optical modulator using a thin plate including a portion having 20 μm or less thickness, capable of selecting a specific polarized wave from a light wave which propagates in an optical waveguide in the modulator without reduced productivity. The modulator includes an X-cut or Y-cut thin plate of a material having an electrooptic effect; an optical waveguide formed in a top or bottom surface of the plate; and a control electrode on the top surface of the plate to modulate light which propagates in the waveguide. An attenuating means which absorbs light having a specific polarization plane of a light wave which propagates in the waveguide is disposed in the vicinity of the waveguide. The attenuating means includes light absorbing members disposed at a gap L which is 0.5 to 2 times the mode-field diameter of the light wave which propagates in the waveguide with the waveguide interposed therebetween.

1. Field of the Invention
The present invention relates to an optical modulator, and more particularly, to an optical modulator which includes a thin plate made of a material having an electrooptic effect and including a portion having a thickness of 20 μm or less, and a reinforcement plate attached to a bottom surface of the thin plate and having a thickness greater than that of the thin plate.
2. Related Art Statement
Conventionally, in an optical communication field or an optical measurement field, a waveguide type optical modulator in which an optical waveguide or a modulation electrode is formed on a substrate having an electrooptic effect is much used.
Particularly, as multimedia has been developed, the amount of communication tends to increase and thus wider bandwidth of an optical modulation frequency needs to be realized. As a realizing means thereof, an external modulation method using a LiNbO3 (hereinafter, referred to as LN) modulator or the like has been diversified. However, in order to realize the wider bandwidth of the LN modulator, velocity matching between a light wave and a microwave which is a modulation signal and reduction of a driving voltage need to be realized.
As a means for solving the above-described problems, conventionally, the velocity matching has been realized by forming a buffer layer on a waveguide. However, recently, as a substrate processing technology is improved, the thickness of the substrate tries to decrease such that the velocity matching condition between the microwave and the light wave is satisfied and at the same time the driving voltage is reduced.
In Patent Documents 1 to 3, an optical waveguide and a modulation electrode are mounted on a thin substrate (hereinafter, referred to as "first substrate") having a thickness of 30 μm or less and another substrate (hereinafter, referred to as "second substrate") having dielectric constant lower than that of the first substrate is bonded to the first substrate, such that an effective refractive index of the microwave is lowered, the velocity matching between the microwave and the light wave is realized and mechanical strength of the substrate is maintained.
[Patent Document 1] Japanese Unexamined Patent Application Publication No. S64-18121
[Patent Document 2] Japanese Unexamined Patent Application Publication No. 2003-215519
[Patent Document 3] Japanese Unexamined Patent Application Publication No. H10-133159
Meanwhile, as the waveguide type optical modulator, an optical intensity modulator, an optical switch, a variable optical attenuator (VOA) or a phase modulator is developed and put into practical use. For example, in the VOA, the refractive index of the waveguide is changed by an electrooptic effect or a thermo-optic effect to adjust output light intensity, in a branch waveguide of one arm for configuring a Mach-Zehnder interferometer.
However, in a case of using a substrate having optical anisotropy, an applied voltage or the amount of heating varies depending on a polarized wave of incident light. Accordingly, only a specific polarized wave must propagate.
As a method of selecting a specific polarized wave, as shown in FIG. 1A, there is provided a method of attaching a polarizer 2 on the end surface of an entrance of a substrate 1 of an optical modulator. In a case of using an LN substrate, there is provided a method of attaching a metal film 4 on an optical waveguide 3 in an X-cut plate (see FIG. 1B) or a method of providing a slab to a side surface of an optical waveguide in a Z-cut plate.
However, when a thin plate having a thickness of 20 μm or less is used, it is difficult to attach the polarizer to the end surface of the substrate with high precision as shown in FIG. 1A. In addition, when the metal film 4 is attached to the top surface of the thin plate as shown in FIG. 1B, the substrate is at increased risk of being damaged by a difference in coefficient of thermal expansion between the substrate and metal film, and, when the metal film is formed on the optical waveguide 3, the specific polarized wave is absorbed and a light wave having a different polarization plane is also attenuated.
Since the above-described methods of selecting the specific polarized wave require a separate process in addition to a process of manufacturing the optical modulator, a manufacturing process becomes complicated and thus the manufacturing cost increases.


A modified test tube is provided which can sit on any flat surface unaided by a test tube rack. The modified test tube includes a tubular containment portion and tubular neck portion. The containment portion has a bottom surface preferably provided with a plurality of legs and a closed end. The neck portion is angled approximately 45.degree. relative to the flattened surface and has a mouth which opens parallel to the flattened bottom surface. The legs enable the test tube to sit prone on any flat surface by itself, unaided by a rack, and the bent neck portion prevents the contents from spilling from the test tube. This design enables the contents within the test tube to be easily monitored without moving the test tube. A test tube rack is further provided for storing the test tubes. The test tube rack is generally a rectangular member having a plurality of cavities, spaced such that each does not intersect another. The cavities are preferably provided with openings alternately provided in opposite sides of the rack.

1. Field of the Invention
This invention relates broadly to laboratory equipment. More particularly, this invention relates to test tubes and test tube racks.
2. State of the Art
Standard test tubes are tubular in shape and have a rounded sealed bottom end and an open top end. The standard test tube design possesses a high degree of utility in laboratory experimentation and research. In fact, it is anticipated that the standard shape test tube will continue to dominate the test tube market due to its simplicity and design familiarity. Yet, this dominance is in spite of drawbacks associated with the standard design.
Standard test tubes require the use of a rack for support, as the test tubes cannot stand on their own. Unless the open end of a standard test tube is closed with a stopper, when the test tube is placed on a flat surface without the use of a rack, the contents of the test tube will spill out. Therefore, standard test tubes, regardless of size, generally require the use of a test tube rack to hold the test tubes while the test tubes are being utilized. As a result, when placing a standard test tube into a heated water bath, the test tube must first be placed into a test tube rack and then the entire rack must be inserted into the water, such that the test tubes are substantially submerged. This results in more time and energy needed to bring the contents of the standard test tubes to the desired temperature. Furthermore, as a substantial portion of the standard test tube is submerged in the water bath, it is difficult to monitor reactions occurring within the test tube. Moreover, when applying heat to a standard test tube, it is common to place the test tube in a clamp and to apply a flame under the test tube. This often provides uneven heating of the contents, as heat is applied primarily only under the bottom of the test tube and may cause the contents at the bottom of the tube to scorch. In addition, standard test tubes cool slowly as cool air will only come into contact with a small surface area of the contents of the tube. Another disadvantage is that when adding or heating reagents in a standard test tube there is a strong potential for harmful spatter from "bumping" (the rapid evolution of gas bubbles) to occur which can result in sample loss. Furthermore, when adding a substance to a test tube in situations where the substance weight is critical, the substance must first be weighed on weighing paper and then transferred into the test tube. As some of the substance will remain on the weighing paper after the bulk of the substance has been transferred to a test tube, experimental error is introduced into the system.
As discussed above, standard test tubes require a test tube rack. Standard test tube racks usually have upper and lower horizontal holding members and vertical supports. The upper holding member has a plurality of holes arranged in a two dimensional array, each of the holes being slightly larger than the diameter of the standard test tubes which the rack is designed to hold. The lower holding member has a plurality of depressions aligned below the holes of the upper holding member. A standard test tube extends through one of the holes in the upper holding member and seats in the depression aligned beneath the hole through which the test tube extends.
Standard test tube racks, like standard test tubes, also carry substantial disadvantages. First, it is difficult to monitor and observe reactions occurring in a test tube held in a standard rack if the test tube is not located along the edge of the two-dimensional array. This problem is compounded when a large number of tubes fill the rack, making observation of the contents below the mouths of the tubes even more difficult. Second, standard racks require a substantial amount of space, as their design is not generally conducive to stacking. In those racks which are stackable, once the racks are stacked, observation of a test tube within a lower rack is not possible and removal of a test tube from a lower rack requires removing the racks stacked above the lower rack.

Modified test tube and test tube rack therefor


A bass compensation circuit for use in a sound reproduction device is provided with a second-order positive feedback type high-pass filter. The filter has an operational amplifier and a first positive feedback resistor, a first variable resistor connected to an input terminal for receiving an input signal, coupled with a second variable resistor for volume control, and a second resistor for determining a Q-value and a cut-off frequency of a second-order positive feedback type high-pass filter. The first variable resistor and the second resistor are inserted in series between the first resistor and the ground. Thus, the bass compensation circuit can amplify only low frequency signals which do not serve as a masking sound used in masking middle and high frequency signals and has a low level when the sound volume is low. Moreover, the Q-value and the cut-off frequency of the second-order positive feedback type high-pass filter can continuously be changed by using the second variable resistor. Consequently, the Q-value and the cut-off frequency of the second-order positive feedback type high-pass filter can change in a natural manner against a change in sound volume.

1. Field of the Invention
This invention relates to a bass compensation circuit for use in a sound reproduction device.
2. Description of the Related Art
First, a conventional sound reproduction device provided with a range correction circuit (namely, a tone control circuit or an equalizer) will be described hereinbelow by referring to the accompanying drawings. FIG. 3 is a circuit diagram for illustrating the configuration of the range correction circuit provided in the conventional sound reproduction device and adapted to change relative levels of amplitude (hereunder sometimes referred to simply as levels) at frequencies of middle and high frequency ranges and of a low frequency range correspondingly to change in sound volume. As shown in this figure, a variable resistance with a center tap is employed as a variable resistor 13 for volume control. Further, a time constant circuit comprised of resistances 16 and 17 and capacitors 14 and 15 is connected to the variable resistor 13. Circuit constants of this time constant circuit are determined in such a manner that the reactance of the capacitor 14 is sufficiently high but that of the capacitor 15 is low correspondingly to frequencies of a middle frequency range. Further, levels at frequencies of the middle frequency range can be changed only by regulating the variable resistor 13. Moreover, levels at frequencies of a high frequency range rise due to reduction in reactance of the capacitor 14. Furthermore, levels at frequencies of a low frequency range rise owing to increase in reactance of the capacitor 15. Additionally, the conventional sound reproduction device provided with this circuit employing a frequency response (namely, frequency characteristics), the graph of which is as illustrated in FIG. 4, in order to realize a well-known loudness contour.
As is seen from FIG. 4, the frequency response of the conventional sound reproduction device provided with the range correction circuit gently changes in a frequency range, the center frequency of which is 1 kilohertz (kHz). As the result, in case where sound volume is small, a listener has a feeling of indistinctness toward sounds of frequencies of middle and low frequency ranges. Especially, a listener feels as if a vocal part were turned down. Even if such a frequency response is improved and a rolloff frequency is regulated in such a manner to increase levels at frequencies of low and high frequency ranges, it is difficult to increase only levels at necessary frequencies, because of the fact that basically, the circuit has a first-order filter arrangement. The present invention is created to resolve such a problem of the conventional circuit.
It is, therefore, an object of the present invention to provide a bass compensation circuit for use in a sound reproduction device, which can compensate a frequency response at desired frequencies of a low frequency range, which are necessary for music reproduction in such a way that the compensated frequency response can change against change in sound volume in a natural manner.

Bass compensation circuit for use in sound reproduction device

Matsushita Electric Industrial Co., Ltd.